Lead-Free, RoHS, and WEEE Information Wanted

John R. Barnes KS4GL, PE, NCE, NCT, ESDC Eng, ESDC Tech, PSE, SM IEEE
August 11, 2021
jrbarnes@iglou.com

Since December 2004 I have been searching the engineering and scientific literature for information on how to design and build electronics to be lead-free, RoHS-compliant, and WEEE-compliant-- and hopefully still have good quality, work reliably, and last a long time (lotsa luck). My plan was to boil this information down for dBi's clients to use, with it eventually becoming a "Chapter 20.5" for a second edition of my books, Robust Electronic Design Reference Book, Volumes 1 and 2. But at this point it looks this study may become Volume 3, a separate book, or a massive collection of web pages instead. To date I have found 287 books, 435 Ph. D. and Masters theses, and 25,925+ papers/ magazine articles/ reports on these subjects. I've also looked at many thousands of webpages, and printed out a few hundred of them. My bibliography at http://www.dbicorporation.com/rohsbib.htm has references to everything that I have acquired to date, with links to 6,810+ documents that may be downloaded for free from the Internet. But in my searches I've found references to numerous other pertinent documents that I have not yet been able to locate. Many of these were published by: whose journals and proceedings are so specialized that they can rarely be found in libraries open to the general public.

If you come across free or reasonably-priced sources for any of the following documents, please E-mail me the information at jrbarnes@iglou.com. I will acknowledge your contribution to this research in my web pages, and in any magazine articles, papers, or books that may come out of it.

When I run across a database that looks promising, I search for:

I'm also finding additional sources to mine, by searching Dogpile and Google for everything written by certain authors:

Thanks!

John R. Barnes

So far I have checked libraries at the following institutions for information on lead-free electronics, the RoHS Directive, the WEEE Directive, and their ilk:
AU = Auburn University (Auburn, AL, rbd library) checked card catalog 10/9/2010, last visited 3/3/2007
BoU = Boston University (Boston, MA, science & engineering library) checked card catalog 10/14/2010, last visited 10/17/2010
BSU = Boise State University (Boise, ID, albertsons library)
BU = Bradley University (Peoria, IL, cullom-davis library)
BYU = Brigham Young University (Salt Lake City, UT, lee library) checked card catalog 10/9/2010
CBU = Christian Brothers University (Memphis, TN, plough library) checked card catalog 10/9/2010
CMU = Carnegie Mellon University (Pittsburg, PA, sorrells library, hunt library) checked card catalog 8/5/2012, last visited 8/8/2012
CPL = Chicago Public Library (Chicago, IL) last visited 8/2005
CSM = Colorado School of Mines (Golden, CO, lakes library) last visited 8/10/2006
CSU = Cleveland State University (Cleveland, OH)
CSULA = California State University - Los Angeles (5151 State University Dr, Los Angeles, CA, north library) checked card catalog 8/11/2011, last visited 8/18/2011
CSULB = California State University - Long Beach (1250 Bellflower Boulevard, Long Beach, CA, library) checked card catalog 8/11/2011, last visited 8/17/2011
CWRU = Case Western Reserve University (Cleveland, OH)
EBSCOA = EBSCOhost Academic Search Complete checked card catalog 7/7/2014, last visited 8/6/2021
EBSCOB = EBSCOhost Business Source Premier checked card catalog 7/7/2014, last visited 8/6/2021
FAU = Florida Atlantic University (Boca Raton, FL, wimberly library) checked card catalog 10/9/2010, last visited 7/29/2010
FIT = Florida Institute of Technology (Melbourne, FL, evans library) checked card catalog 10/9/2010
FIU = Florida International University (Miami, FL, green library) checked card catalog 10/9/2010, last visited 7/25/2010
FSU = Florida State University (Tallahassee, FL, strozier library) checked card catalog 10/9/2010, last visited 3/2/2007
GIT = Georgia Institute of Technology (Atlanta, GA, main library) checked card catalog 10/9/2012, last visited 10/11/2012
IEEE XPLORE = IEEE XPLORE checked card catalog 2/10/2014, last visited 8/4/2021
ISU = Iowa State University (Ames, IA, parks library) last visited 8/26/2006
IU = Indiana University (Bloomington, IN, bloomington chem library) checked card catalog 10/9/2010
KSU = Kansas State University (Manhattan, KS, hale library) last visited 8/8/2006
KU = Kansas University (Lawrence, KS, anschulz library) last visited 8/8/2006
KYVL = Kentucky Virtual Library
Lexmark = Lexmark Library (Lexington, KY, lexmark library) checked card catalog 10/9/2010, last visited 10/1/2010
LH = Linda Hall Library of Science, Engineering & Technology (Kansas City, MO, linda hall library) checked card catalog 10/9/2010, last visited 10/26/2007
LU = lamar university (Beaumont, TX, gray library) checked card catalog 10/9/2010, last visited 10/23/2008
McMU = McMaster University (Hamilton, Ontario)
MIT = Massachusetts Institute of Technology (Cambridge, MA, barker library) checked card catalog 10/14/2010, last visited 10/16/2010
MoSU = Montana State University (Bozeman, MT) checked card catalog 10/9/2010
MST = Missouri University of Science and Technology (Rolla, MO. wilson library) checked card catalog 10/9/2010, last visited 8/14/2009
MSU = Michigan State University (East Lansing, MI, engineering library) last visited 7/9/2006
MTUM = Montana Tech of the University of Montana (Butte, MT) last visited 8/23/2006
MU = Mercer University (Atlanta, GA) checked card catalog 10/20/2010
NEU = Northeastern University (Boston, MA, snell library) checked card catalog 10/17/2010, last visited 10/17/2010
NWU = Northwestern University (Chicago, IL, science library) checked card catalog 10/9/2010, last visited 9/25/2006
OCU = Oklahoma Christian University (Oklahoma City, OK, beam library) checked card catalog 10/9/2010
OGI = Oregon Graduate Institute (Beaverton, OR, science library) checked card catalog 10/9/2010
OkSU = Oklahoma State University (Stillwater, OK, north boomer library) checked card catalog 10/9/2010
OrSU = Oregon State University (Corvallis, OR, valley library) checked card catalog 10/9/2010
OSU = Ohio State University (Columbus, OH, sel library) checked card catalog 8/1/2012, last visited 8/3/2012
PQ = ProQuest Dissertations & Theses Database, checked 8/4/2011
PSU = Portland State University (Portland, OR, millar library) last visited 8/15/2006
PU = Purdue University (West Lafayette, IN, engineering library) checked card catalog 10/9/2010, last visited 9/29/2006
RIT = Rochester Institute of Technology (Rochester, NY)
RU = Rice University (Houston, TX, fondren library) checked card catalog 10/9/2010, last visited 10/22/2008
RyU = Ryerson University (Toronto, Ontario, library) checked card catalog 10/9/2010, last visited 10/25/2009
SDSU = San Diego State University (San Diego, CA, library) checked card catalog 10/9/2010, last visited 10/5/2009
SIUC = Southern Illinois University Carbondale (Carbondale, IL, morris library) checked card catalog 10/9,2010, last visited 8/13/2009
SIUE = Southern Illinois University Edwardsville (Edwardsville, IL, lovejoy library) checked card catalog 10/9/2010, last visited 8/25/2009
SLU = Saint Louis University (St. Louis, MO)
SMU = Southern Methodist University (Dallas, TX, fondren & science libraries) checked card catalog 10/11/2011, last visited 10/21/2011
SPU = Seattle Pacific University (Seattle, WA) checked card catalog 10/9/2010
SU = Seattle University (Seattle, WA, lemieux library) checked card catalog 10/9/2010
SUNB = State University of New York - Buffalo
TTU = Tennessee Technological University (Cookeville, TN, volpe library) checked card catalog 10/9/2010
TU = Tufts University (Medford, MA, tisch library) checked card catalog 10/14/2010, last visited 10/16/2010
UA = University of Alabama (Tuscaloosa, AL, sterne library)
UAB = University of Alabama at Birmingham (Birmingham, AL, sterne library) checked card catalog 10/9/2010
UAH = University of Alabama in Huntsville (Huntville, AL, salmon library) checked card catalog 10/9/2010
UAk = University of Akron (Akron, OH)
UAr = University of Arkansas (Fayetteville, AR, main library) checked card catalog 10/9/2010, last visited 8/24/2009
UC = University of Cincinnati (Cincinnati, OH, engineering library) checked card catalog 11/8/2020, last visited 4/27/2011
UCB = University of Colorado at Boulder (Boulder, CO, engineering library) last visited 8/4/2013
UCF = University of Central Florida (Orlando, FL, main library) checked card catalog 10/9/2012, last visited 10/18/2012
UCI = University of California at Irvine (Irvine, CA, science library) checked card catalog 10/9/2010, last visited 10/24/2006
UCSD = University of California - San Diego (San Diego, CA, science & engineering library) checked card catalog 10/10/2010, last visited 10/4/2009
UD = University of Dayton (Dayton, OH, roesch library) checked card catalog 11/8/2020, last visited 5/17/2018
UDe = University of Denver (Denver, CO, penrose library) checked card catalog 10/10/2010, last visited 8/7/2013
UE = University of Evansville (Evansville, IN, library) checked card catalog 10/10/2010, last visited 8/12/2009
UF = University of Florida (Gainesville, FL, science library) checked card catalog 10/9/2012, last visited 10/13/2012
UH = University of Hawaii at Manoa (Honolulu, HI) last visited 7/12/2007
UI = University of Iowa (Iowa City, IA, engineering library) last visited 8/27/2006
UIC = University of Illinois at Chicago (Chicago, IL, science library) checked card catalog 10/10/2010
UIUC = University of Illinois - Urbana-Champaign (Urbana-Champaign, IL, engineering library) checked card catalog 10/10/2010
UK = University of Kentucky (Lexington, KY, engineering library) checked card catalog 12/17/2020, last visited 2/16/2021
UL = University of Louisville (Louisville, KY, engineering library) checked card catalog 4/17/2011, last visited 4/21/2010
UM = University of Michigan (Ann Arbor, MI, art, architecture & engineering library) checked card catalog 11/7/2020, last visited 8/3/2018
UMC = University of Missouri - Columbia (Columbia, MO) checked card catalog 10/12/2010
UMe = University of Memphis (Memphis, TN, mcwherter library) checked card catalog 10/12/2010
UMi = University of Miami (Coral Gables, FL, richter library) checked card catalog 10/12/2010, last visited 7/25/2010
UNCC = University of North Carolina at Charlotte (Charlotte, NC, atkins library) checked card catalog 10/12/2010, last visited 3/19/2010
UNF = University of North Florida (Jacksonville, FL, carpenter library) checked card catalog 10/12/2010
UNL = University of Nebraska - Lincoln (Lincoln, NE, engineering library) last visited 8/25/2006
UOk = University of Oklahoma (Norman, OK, engineering library) checked card catalog 10/12/2010, last visited 8/23/2009
UPi = University of Pittsburgh (Pittsburgh, PA, bevier engineering library, hillman library) checked card catalog 8/5/2012, last visited 8/5/2012
UR = University of Rochester (Rochester, NY)
USA = University of South Alabama (Mobile, AL)
USC = University of Southern California (910 Bloom Walk, Los Angeles, CA, sel library) checked card catalog 8/11/2011, last visited 8/18/2011
USD = University of San Diego (San Diego, CA, copley library) checked card catalog 10/12/2010, last visited 10/6/2009
USF = University of South Florida (Tampa, FL, center library) checked card catalog 10/12/2010
USU = Utah State University (Logan, UT, lee library) checked card catalog 10/12/2010
UT = University of Tennessee (Knoxville, TN, hodges library) checked card catalog 1/11/2014, last visited 10/21/2012
UTA = University of Texas at Austin (Austin, TX, engineering library) checked card catalog 10/12/2010, last visited 8/18/2009
UTAr = University of Texas Arlington (Arlington, TX, ??? library) checked card catalog 10/11/2011
UTD = University of Texas at Dallas (Richardson, TX, mcdermott library) checked card catalog 10/11/2011, last visited 10/21/2011
UTo = University of Toledo (Toledo, OH, carlson library) checked card catalog 10/12/2010, last visited 3/20/2009
UTor = University of Toronto (Toronto, Ontario, engineering library) checked card catalog 10/12/2010, last visited 10/25/2009
UU = University of Utah (Salt Lake City, UT, marriott library) last visited 8/11/2006
UW = University of Washington (Seattle, WA, suzallo library) last visited 8/21/2006
UWa = University of Waterloo (Waterloo, Ontario, davis library) checked card catalog 10/12/2010, last visited 10/23/2009
UWF = University of West Florida (Pensacola, FL)
UWi = University of Windsor (Windsor, Ontario)
UWO = University of Western Ontario (London, Ontario)
UWy = University of Wyoming (Laramie, WY)
VU = Vanderbilt University (Nashville, TN, science library) checked card catalog 4/17/2011, last visited 3/18/2011
WrSU = Wright State University (Dayton, OH, dunbar library) checked card catalog 10/12/2010
WSU = Wayne State University (Detroit, MI, science library) last visited 8/17/2008
WUSL = Washington University in St. Louis (St. Louis, MO, west campus library) last visited 8/7/2006

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/' [execute] [center line] def f10 = [cursor command] [begin line] [erase end line] 'l /sciencedirect/' [execute] [center line] def f10 = [cursor command] [begin line] [erase end line] 'l /.scientific./' [execute] [center line] def f10 = [cursor command] [begin line] [erase end line] 'l /smta.org/' [execute] [center line] def f10 = [cursor command] [begin line] [erase end line] 'l / source /' [execute] [center line] def f10 = [cursor command] [begin line] [erase end line] 'l /.springer./' [execute] [center line] def f10 = [cursor command] [begin line] [erase end line] 'l /.tandfonline./' [execute] [center line] def f10 = [cursor command] [begin line] [erase end line] 'l /UK online/' [execute] [center line] def f10 = [cursor command] [begin line] [erase end line] 'l /.wiley./' [execute] [center line] def f10 = [cursor command] [begin line] [erase end line] 'l /XPLORE/' [execute] [center line] def f10 = [next window] [mark line] [execute] [down] [mark line] [begin mark] [next window] s margins 1 80 --------------------------------------------------------
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"The Allotropic Transformation White Tin - Grey Tin", London: International Tin Research and Development Council, 1938.

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C. J. Smithells, Chapman-Hall's Centenary Year (1930), p. 178.

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E. Ignatowitz, Chemie fu"r Schule und Beruf (Chemistry for School and Profession), Europa Lehrmittel Verlag, Haan-Gruiten, 1999, p. 180.

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Silman, Harold, chromium plating - past, present and future. Publication date: 1984, p 140-146

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Todor Stambolov, (book) The Corrosion and Conservation of Metallic Antiquities and Works of Art, Central research Laboratory for Objects of Art and Science, Amsterdam, pp 175-177, 1985.
{ IU bloomington fine CC137.M5S78, }

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Electrically Conductive and Insulative Adhesives (book)

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Harris, P., "The Growth of Tin Whiskers", International Tin Research Institute, 734, pp. 1-19, 1994.

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Hexavalent chromium Technical Report - University of Texas at Austin, Center for Research in Water Resources no. 240, July 1993, pp. 61, 65

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Walker, R. "Internal Stress in Electrodeposited Metallic Coatings," Metal Finishing Monograph, p. 32, 1968.

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F. J. Dunkerly and Wilbur Lewis Mudge, "Kinetics of the Alpha Beta Transformation of Pure Tin," Technical Report L5, University of Pennsylvania, Contract NObs-2477. Navy Department Bureau of Ships (Jan. 1950).

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Lead and the Electronics Industry: A Proactive Approach Performer: National Center for Manufacturing Sciences, 3025 Boardwalk, Ann Arbor, MI 48108. May 1995. 50p. Report: NCMS-0177BK95

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To"pfer, J. G., Lehrbuch der Orgelbaukunst (Textbook on Organbuilding), Ill. 571a, Vol. 4, 4th & 5th editions by Paul Smets, Rheingold-Verlag Mainz, 1960.
{ CSULA ML556.T63, SMU harmon ML556.T642, }

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R. R. Rogers and W. R. G. Stewart, Report on Investigation MD2609, Mineral Dressing and Metallurgical Labs Bureau of Mines, Ottawa, Canada, Nov. 23, 1949.

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(new source 7/7/2020)
T. I. Prokopowicz and A. R. Vaskas, Research and Development, Intrinsic Reliability, Subminiature Ceramic Capacitors, Final Report, ECOM-90705-F, 1969 NTIS AD-864068, 175 pp. --------------------------------------------------------
(new source 2/8/2011)
Research Report No. 425, Applied Electronic Material Property Subcommittee, Sep. 16, 1988, The Japan Society of Applied Physics, pp. 11-16.

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Busch, Lieland? Wieland?, and Zoller, Semiconducting Materials, London: Butterworths Scientific Publications, 1951, pp. 188.
{ FSU dirac 621.319C748s, }

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(new source 7/4/2011)
G.T. Galyon, "Sn-Cu Whisker Nodule," iNEMI Whisker Fundamentals, 2004.

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Bornemann, A., and Gela, T., "Studies in the Behavior of Certain Non-Ferrous Metals at Low Temperatures," Vol. II Final Report, Contract No. DA-36-939-SC-15393? DA-36-039-SC-15393? Dec. 1953, Signal Corps Project 2005 - MO8 - Metals, U. S. Army.

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M. Margolis and A. Bornemann, "A Study in Ferrous and Non-Ferrous Alloys at Low Temperature," Final Report Contract No. W-36-039-SC-38135, Nov. 1950.

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Third semi-annual lead-free solder implementation summit. British Library

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Peter W. Stephens, Use of Synchrotron Radiation to Determine the State of Strain in Tin Coatings on Integrated Circuit Packages Herndon, VA: NEMI, Tin Whisker Modeling Project Rep., May 2002, Available upon request from NEMI.

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Coleman, R. V. "Whiskers," Work Function, pp. 1112.

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0000--------------------------------------------------------
(new source 1/30/2011)
5DX User Group Meeting
{ }
1 item found as of 1/30/2011

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2004 Academic Student Compendium Proceedings
( http://www.smta.org/knowledge/proceedings.cfm }
item found as of 11/26/2020
03-04 checked 11/26/2020

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2013 ACM/IEEE International Workshop on System Level Interconnect Prediction
2011 13th International Workshop on System Level Interconnect Prediction
SLIP
{ IEEE XPLORE (11,13-), (many other universities also subscribe to IEEE XPLORE), }
3 items found as of 8/3/2021
11,13-20 checked 8/3/2021

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Acta Crystallographica
{ https://onlinelibrary.wiley.com/loi/S01087673 CSULA north QD901.I523, CSULB orca QD901I523, MST wilson QD901.I523, NWU online & sci 548.05A188, OkSU online, OSU sel QD901A2, PU phys 548Ac8, SDSU online, SIUC storage 50865-5481, SIUE storage, UAr online, UC chem QD901.A2 & sw depos QD901.A2, UCSD s&e QD1.A190, UD roesch, UIC sci, UK online & chem/phys QD901.I523, UL kersey QD901.I523, UM online & buhr QD901.A18, UOk online, USC grand, UT hodges QD901.A3, }
4 items found as of 1/20/2021
searched for tin whisker(s) & Sn whisker(s) on 7/16/2020
searched for zinc whisker(s) & Zn whisker(s) on 9/1/2020
searched for indium whisker(s) on 9/1/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/1/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/1/2020

Tiedema, May and Burgers, Acta. Cryst., 1949, 2, 151. *** not applicable ***

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Acta Electronica Sinica
Tien Tzu Hsueh Pao
{ http://www.oriprobe.com/journals/dianzixb.html MIT storage TK7800.T54, OSU depos TK7803.E4, }
item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Liu, Fang, Meng, Guang, Zhao, Mei, and Zhao, Jun-feng, .Researches of lead-free solder joint reliability under board-level drop impact Tien Tzu Hsueh Pao/Acta Electronica Sinica, v 35, n 11, November, 2007, p 2083-2086 Language: Chinese

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Acta Materialia
{ https://www.sciencedirect.com/journal/acta-materialia/issues MST wilson TS200.A3, OkSU online, OSU online & TN1A23, SDSU online, SIUC morris 50872-6693, UAr online, UC online & depos TN1.A2, UCSD online, UK online sd & eng TS200.A3, UL kersey TS200.A3, UM online, UOk bizzell TN1.A3, USC grand, UT online & hodges TN1.A3, }
>=20 items found as of 8/8/2021
v44#1-v214(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 7/16/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/31/2020
searched for indium whisker(s) on 8/31/2020 searched for cadmium whisker(s) and Cd whisker(s) on 8/31/2020 searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 8/31/2020 searched for PDN, power distribution, and capacitor(s) on 8/31/2020 searched for ESD, and electrostatic discharge on 8/31/2020 (new reference 6/22/2020)
J. R. Michael, D. F. Susan, and B. B. McKenzie, "The Crystallography of Sn Whiskers", to be submitted Acta Materialia. (not found on osti.gov or at UK) --------------------------------------------------------
(new source 10/15/2020)
Acta Mechanica
{ https://link.springer.com/journal/707/volumes-and-issues UK online, }
1 item found as of 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

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Acta Metallurgica
{ https://www.sciencedirect.com/journal/acta-metallurgica/issues MST wilson TS200.A3, NWU online & sci L669.05A188, OkSU online, OSU sel TN1A2, PU phys 669.05Ac8, SDSU main TN1.A2, SIUC morris 50872-6691, UAr main TS200.A3, UC online & eng TN1.A2, UCSD s&e TN1.A191, UD roesch, UE, UIC daley TS200.A3, UK online & eng TS200.A3, UL kersey TN1.S36 & TS200.A3, UM online sd, UOk online, USC grand, UT hodges TN1.A3, }
>=20 items found as of 8/2/2021
v1#1-v37#12(ended publication) all issues checked 8/2/2021
searched for tin whisker(s) and Sn whisker(s) on 7/17/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/6/2020
searched for indium whisker(s) on 8/6/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/6/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight on 8/6/2020
searched for gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/1/2020 --------------------------------------------------------
Acta Metallurgica et Materialia
{ https://www.sciencedirect.com/journal/acta-metallurgica-et-materialia/issues UK online, }
1 item found as of 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 7/17/2020
searched for zinc whisker(s) and Zn whisker(s) on 9/18/2020
searched for indium whisker(s) on 9/18/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/18/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/18/2020 --------------------------------------------------------
Acta Metallurgica Sinica (China)
Jin shu xue bao
Jinshu Xuebao
{ https://link.springer.com/journal/40195/volumes-and-issues FIT online, LH closed, OkSU online, OSU online, RyU online, TU online, UCSD s&e TN1.C55, UM online & hatcher microforms AO72:1, UPi hillman journals, UTor online, VU online (not fulltext), }
12 items found as of 8/9/2021 catalog
v1#1-v3#6,v4#3-v4#6,v19#1-v22#6,v26#1-v34#9(21) checked 8/9/2021
searched for tin whisker(s) and Sn whisker(s) on 11/27/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/27/2020
searched for indium whisker(s) on 11/27/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/27/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/27/2020

(new reference 12/17/2020)
Shuang Li, Xiao-Wu Hu, Xiong-Xin Jiang Comparative Study on Solid-State and Metastable Liquid-State Aging for SAC305/Cu Joints ," Acta Metallurgica Sinica (China), vol. 32 no. 5, pp. 629-637, May 2019. https://doi.org/10.1007/s40195-018-0789-2

Zhi-Wei Lai, Zhe-Yuan Huang, Gui-Sheng Zou Rapid Ultrasonic-Assisted Soldering of AZ31B Mg Alloy/6061 Al Alloy with Low-Melting-Point Sn–xZn Solders Without Flux in Air ," Acta Metallurgica Sinica (China), vol. 32 no. 3, pp. 332-342, Mar. 2019. https://doi.org/10.1007/s40195-018-0749-x

Noritake Hiyoshi Crack Initiation and Propagation Evaluation for Sn–5Sb Solder Under Low-Cycle Fatigue ," Acta Metallurgica Sinica (China), vol. 30 no. 9, pp. 851-856, Sept. 2017. https://doi.org/10.1007/s40195-017-0605-4

Bismarck Luiz Silva, Rodrigo Valenzuela Reyes, Amauri Garcia, and José Eduardo Spinelli, x Dendritic Growth, Eutectic Features and Their Effects on Hardness of a Ternary Sn–Zn–Cu Solder Alloy ," Acta Metallurgica Sinica (China), vol. 30 no. 6, pp. 528-540, June 2017. https://doi.org/10.1007/s40195-017-0572-9

--------------------------------------------------------
Acta Organologica
{ BYU music ML5.A253, CSULA north ML594.A1A2, FSU music ML5.A253, IU bmusic ML552.A188, OSU music ML550.A1A, SIUC mclafferty 786.608 A188, UC ccm ML550.A25, UF music ML5.A253, UK finearts ML5.A253, UM music ML5.A19 & buhr ML5.A19, UMc music ML5.A253, UOk finearts ML5.A253, USC online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Active & Passive Electronic Components
{ https://www.hindawi.com/journals/apec/contents/year/2020/ EBSCOA, UK online, UT online, }
13 items found as of 8/6/2021
v25#1-4/22/2021(21) checked 8/6/2021

--------------------------------------------------------
Additives for Polymers
{ https://www.sciencedirect.com/journal/additives-for-polymers/issues CSULB online, OkSU online, OSU online, SDSU online, UC online, UCSD online, UK online, UM online, UOk online, USC TP1142.A33, UT online, }
1 item found as of 1/20/2021

--------------------------------------------------------
Adhesives & Sealants Industry
{ http://www.adhesivesmag.com/ EBSCOB, CSULA online, CSULB online, IU online, NWU online, OkSU online, OSU online, SDSU online, SIUC online, UAr online, UCSD online, UIC online, UK online, UM online sd, UOk online, USD TP967.A485 668/.3, UT online, }
18 items found as of 8/6/2021
v3#5-v28#2(21) checked 8/6/2021

--------------------------------------------------------
Adhesives in Electronics "94"
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Advanced Electronic Packaging (Materials Research Society Symposium Proceedings
{ CMU eng TK7870.15.A35, GIT online, LB, OSU sel TK7874.A332, SMU online, UC online, UM online, USC grand TK7870.A315, UTAr sel TK7874.A332 & sel TK7870.A35, UTD main TK7874.A332, }
11 items found as of 6/29/2017 catalog
89,06 checked 6/29/2017

--------------------------------------------------------
Advanced Engineering Materials
{ https://onlinelibrary.wiley.com/loi/15272648 AU online, GIT online, IU online, LH closed, NWU online, OkSU online, OSU online & sel TA401.A15, RyU online, SDSU online, SIUC online, SMU online, UAB online, UAr online, UC online, UCB online, UCF online & main TA401.A15, UCSD online, UD online, UIC online, UK online, UM online, UOk online, USC TA401.A15, UT online, UTD online, UTor online, UWa online, VU online, }
>=20 items found as of 8/11/2021
v1#1-v23#7(21) all issues checked 8/11/2021
(new reference 1/20/2021)
," Advanced Engineering Materials, vol. 22 no. 12, pp. , Dec. 2020.

Kwang-Ho Jung Kyung Deuk Min Choong-Jae Lee Haksan Jeong Jae-Ha Kim Seung-Boo Jung Ultrafast Photonic Soldering with Sn–58Bi Using Intense Pulsed Light Energy ," Advanced Engineering Materials, vol. 22 no. 12, pp. 2000179-1-2000179-, Dec. 2020. https://doi-org.ezproxy.uky.edu/10.1002/adem.202000179

(not at UK) searched for tin whisker(s) and Sn whisker(s) on 7/17/2020
searched for zinc whisker(s) and Zn whisker(s) on 9/18/2020
searched for indium whisker(s) on 9/18/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/18/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/18/2020

--------------------------------------------------------
Advanced Manufacturing Technology (AMT)
{ CSULB online, FIT online, Lexmark, LH closed, MSU online, NWU online, OkSU online, OSU online, PU online & eng 670.4205In8, SMU online, UCB online, UIC online, UK eng T59.4.I5410, UM online, UOk online, UPi online, USC T59.4.I541x670, USD online, UT online, UTAr online, UTD online, UTor online, VU online, }
6 items found as of 5/31/2020 catalog
v8#1-v13#1,v16#6,v21#12-v32#1,v32#3-v33#5,v33#7-v34#5,v34#9-v34#12 checked 5/31/2020

--------------------------------------------------------
Advanced Materials
{ https://onlinelibrary.wiley.com/loi/15214095 CSULA north QD1.A67, CSULB online & orca TA401.A38, FAU online, FIU online, MST wilson TA401.A29, OkSU online, OSU online & TA401.A24, RyU online, SDSU online, SIUC online, SMU online, TTU, UAr online, UC online & TA401.A16, UCSD s&e TA1.A243, UH online, UK online, UM online & shapiro TA401.A291, UNCC online, UOk online, USC TA401.A29620, USD online, UT online & hodges TA401.A29, UTAr online, UTD online, UTor online, VU online, }
>=20 items found as of 8/11/2021
v1#1-v33#31(21) all issues checked 8/11/2021
searched for tin whisker(s) and Sn whisker(s) on 8/7/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/7/2020
searched for indium whisker(s) on 8/7/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/7/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/11/2020 (new reference 2/28/2021)
," Advanced Materials, vol. 33 no. 16, pp. , 2021.

Na Han, Mingzi Sun, Yuan Zhou, Jie Xu, Chen Cheng, Rui Zhou, Liang Zhang, Jun Luo, Bolong Huang, Yanguang Li, Alloyed Palladium–Silver Nanowires Enabling Ultrastable Carbon Dioxide Reduction to Formate ," Advanced Materials, vol. 33 no. 4, pp. 2005821-1-2005821-, Jan. 27, 2021. https://doi.org/10.1002/adma.202005821

--------------------------------------------------------
Advanced Materials & Processes
{ AU rbd TA401.3.I5855, CSULA online, CSULB online, FIT online, LH closed, MST wilson TS200.M36, OkSU online, OSU online & sel TS200A762, SDSU online, SIUC online, UAB sterne TA401.A42, UAr online, UC eng TA418.9.C6A28, UCB online, UCI online & sci TS200.M361, UCSD s&e TS1.M587, UE, UK eng TS200.M380, UL kersey TS200.M36, UM online, TS200.M5891, UOk online, USC TA401.A296620, USD online, UT online & hodges TS200.M36, VU online & sel TS200.M36, }
18 items found as of 1/26/2016
v157#1(2000)-v174#1 checked 1/26/2016

--------------------------------------------------------
Advanced Materials Research
{ https://www.scientific.net/AMR NWU online, UAH sci TN688.3.B33I58, UAr online, UC online, UCSD online, UD roesch TA660.S63F54, UK online, UMC online, }
>=20 items found as of 1/21/2021
v22-v138 checked 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 10/11/2020
searched for zinc whisker(s) and Zn whisker(s) on 10/11/2020
searched for indium whisker(s) on 10/11/2020
searched for cadmium whisker(s) and Cd whisker(s) on 10/11/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 10/11/2020
searched for nanowire(s), mesowire(s), microwire(s) on 10/11/2020

Example: 10.4028/www.scientific.net/amr.1043.109 --------------------------------------------------------
Advanced Metallization Conference 2007
{ CMU eng TK7871.85.A228, LH TK7871.85.A228, MST wilson TK7871.85.A228, OSU sel TK7871.85.A3482, PU eng 621.38152Ad9451p, SMU sci TK7871.85.A3482, UC eng K7871.85.A3482, UCB TK7871.85.A3482, UM offsite TK7871.75.A23, UOk eng TK 7871.85.A3482, UPi online, USC sel TK7871.85.A3482, }
4 items found as of 6/11/2015 catalog
94,98-08 checked 6/11/2015

--------------------------------------------------------
Advanced Packaging
Advanced Packaging online Article
(merged with Solid State Technology)
{ http://ap.pennnet.com/home.cfm, EBSCOA, EBSCOB, CSULA online, CSULB online, LH closed, OkSU online, OSU online, SDSU online, SIUC online, SMU online, UAr online, UCSD online, UK online, UOk online, USC TK7874.A334, USD online, UT online, UTAr online, UTD online, }
>=20 items found as of 8/6/2021
v7#6,v9#1-v62#1(19) checked 8/6/2021
searched for tin whisker(s) and Sn whisker(s) on 7/17/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/7/2020
searched for indium whisker(s) on 8/7/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/7/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/1/2020 --------------------------------------------------------
Advanced Packaging Materials Conference
item found as of 1/30/2011 catalog

(new reference 6/8/2009)
P. Markondeya Raj, Isaac Robin Abothu, Reza Abdolvand, Farrokh Ayazi and Rao Tummala, "Solution-Derived 3D /Vertical Piezoelectric and High Capacitance Density Structures for MEMS and Biomedical Applications", Advanced Packaging Materials Conference, March 15-17, 2006, p. 122, Atlanta.

--------------------------------------------------------
2001 Advanced Packaging Technology Conference
{ http://www.smta.org/knowledge/proceedings.cfm, }
14 items found as of 11/26/2020
01 checked 11/26/2020

-------------------------------------------------------
Advanced Printing Technology Conference
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Advanced Semiconductor Engineering Technical Conference
item found as of 1/30/2011 catalog

(new reference 1/20/2011)
Lee, Jeffrey, Whisker Formation Study of Lead-Free Plated Packages, Advanced Semiconductor Engineering Technical Conference Taipei, Taiwan Dec. 2002 pag 103.

--------------------------------------------------------
2002 Advanced Technology Symposium Conference Proceedings
{ http://www.smta.org/knowledge/proceedings.cfm }
8 items found as of 11/26/2020
02 checked 11/26/2020

--------------------------------------------------------
Advances in Chemistry Series
{ CSULA north QD1.A355, CSULB QD1.A355, MST wilson various, OSU sel QD1.A26NO218, SDSU QD1.A355, SIUC mclafferty 540.8A244, SIUE lovejoy QD1.A355, UAr main QD1.A355, UC chem QD1.A36, UCSD s&e QD1.A24453, UD roesch various, UM shapiro TK7871.15.P6E385, UOk bizzell QD1.A355 & chem-math QD1.A355, USC QD1.A355540.82, USD cl QD1.A355, }
item found as of 1/30/2011

--------------------------------------------------------
Advances in Coatings Technologies for Corrosion and Wear Resistant Coatings
{ FIU green TA418.76.A38, NWU TA418.76.A38 620.11223A244, }
1 item found as of 1/30/2011
95

--------------------------------------------------------
Advances in Coatings Technologies for Surface Engineering (see TMS Annual Meeting)
{ MST wilson TA418.76.A38, NWU sci 667.6 A244, PU eng 667.9 Ad945 1997, UF sci A418.76.A391, UT hodges TA418.76.A383, }
item found as of 1/30/2011

--------------------------------------------------------
Advances in Electronic Packaging 2003
American Society of Mechanical Engineers, EEP
Applications of Experimental Mechanics to Electronic Packaging, Proceedings of the 1997 ASME International Mechanical Engineering Congress and Exposition, EEP
Manufacturing Aspects in Electronic Packaging 1993
Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Proceedings of InterPack
Proceedings of the ASME 2009 InterPack Conference
Proceedings of the ASME InterPack Conference
Proceedings of the ASME Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS
{ LH TK7870.15.A83, MIT barker TK7870.15.J65, MST wilson TK7870.15.A83, MSU eng TK7870.15.A88, NEU snell TK7870.15J65, PU eng 621.381046J668p, SIUE lovejoy TK7870.15.A85, UC sw TK7801.H544, UCB TK7870.15.J65, UM online, UTAr sel TK7870.15.A83, }
>=20 items found as of 10/1/2020 catalog
92-93,95,97,99,01,03,05,07,09,11,13 checked 10/1/2020

McCluskey, F. P., Govind, A., and Beaudet, D., "Reliability assessment of BGA interconnects with CADMP-II," American Society of Mechanical Engineers, EEP, vol. 17, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 1996, pp. 93-100

Evaluation of a conductive adhesive based approach to lead free flip chip assembly Venkateswaran, Muthiah; Borgesen, Peter; Srihari, K. American Society of Mechanical Engineers, EEP, vol. 2, 2002, pp. 111-115

The lead-free interconnection movement: A pro-active approach to understand the effects on cots, USAge in the aerospace and defense industries Rafanelli, Anthony J. American Society of Mechanical Engineers, EEP, vol. 2, 2002, pp. 203-213

Akiguchi, Takashi, Koguchi, Hideo, Yamaguchi, M, Takayasu, A, "Deformation of conductive particles and reliability of electronic devices using COG," American Society of Mechanical Engineers, EEP, vol. 2, pp. 425-430, 2002.

--------------------------------------------------------
Advances in Science and Technology
{ https://www.scientific.net/AST OSU geo QE501.4.T581, UK online, UM online, }
item found as of 1/20/2021 catalog

--------------------------------------------------------
Advancing Microelectronics
{ https://meridian.allenpress.com/imaps-am/issue/browse-by-year UAr main TK7874.A38, UCI online & sci TK7874.A382, }
>=20 items found as of 3/14/2021
v28#1-v29#5,v30#2-v45#6(18) checked 3/14/2021

--------------------------------------------------------
AEI
AEI Engineering Review?
{ UC sw depos TK1.A22, }
3 items found as of 1/30/2011 catalog

--------------------------------------------------------
Aerospace/Airlines Plating Forum
{ }
2001 Aerospace/Airline Plating & Metal Finishing Forum
31st Aerospace/Airline Plating & Metal Finishing Forum
17 items found as of 1/30/2011 catalog
94-95,99,01 checked 11/20/2010

," 24th Annual Aerospace/Airline Plating & Metal Finishing Forum , 1988, pp. xx-xx.

1989

1990

1991

James A. Bates The Replacement of Cadmium Plating, Acid or Alkaline Zinc-Nickel, 1992,

," 28th Annual Aerospace/Airline Plating & Metal Finishing Forum , Apr. 20-23, 1992, pp. xx-xx.

1993

James A. Bates Comparison of Alkaline Zinc Nickel and Acid Zinc Nickel as Replacement Coatings for Cadmium, 1994,

," 30th Aerospace/Airline Plating & Metal Finishing Forum, 1994, pp. xx-xx.

," 31st Aerospace/Airline Plating & Metal Finishing Forum, 1995, pp. xx-xx.

N. Yanaki, X-Ray Fluorescence: The New Key to Highly Accurate, Non-destructive Coating Thickness Measurements for Industry, 1996,

J. Quets & J.R. Alford Thermal Spray for Chromium Plating Replacement, 1996,

," 32nd Aerospace/Airline Plating & Metal Finishing Forum, Apr. 30-May 2, 1996, pp. xx-xx.

," 33rd Annual Aerospace/Airline Plating & Metal Finishing Forum, San Francisco, CA, Mar. 25-26, 1997, pp. xx-xx.

," 1998 Aerospace/Airline Plating & Metal Finishing Forum, San Antonio, TX, Mar. 1998, pp. xx-xx.

Bryan Fuhr A New Aluminum Replacement for Cadmium, 1999,

Bruce D. Sartwell Qualification of HVOF Thermal Spray Coatings as Replacement for Hard Chrome Plating on Aircraft Landing Gear, 1999,

," 1999 Aerospace/Airline Plating & Metal Finishing Forum, Jacksonville, FL, Apr. 20-22, 1999, pp. xx-xx.

," 2000 Aerospace/Airline Plating & Metal Finishing Forum, Cincinnati, OH, Mar. 27-29, 2000, pp. xx-xx.

T.Naguy, M.Klingenberg, M.Neidbalson, M.Pavlik & D.Schario Status Report on Non-line-of-sight (NLOS) Hard Chromium Alternatives, 2001,

Bruce D.Sartwell Status of DoD Program on Replacement of Hard Chrome Plating With Thermal Spray Coatings on Aircraft Components, 2001,

," 2001 Aerospace/Airline Plating & Metal Finishing Forum, Portland, OR, Mar. 27-29, 2001, pp. xx-xx.

," 2002 Aerospace/Airline Plating & Metal Finishing Forum, Orlando, FL, Aug. 27-29, 2002, pp. xx-xx.

," 2004 Aerospace/Airline Plating & Metal Finishing Forum, Tulsa, OK, Mar. 29-Apr. 1, 2004, pp. xx-xx.

--------------------------------------------------------
Aerospace Applications Conference
1996 IEEE Aerospace Applications Conference. Proceedings
{ IEEE XPLORE (88-96), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
88-96 checked 8/3/2021

--------------------------------------------------------
Aerospace Industries Association Lead(Pb)-Free Electronics Risk Management (AIA-PERM) Consortium Meeting
{ }
item found as of 7/25/2012 catalog

(new reference 7/25/2012)
Meschter and Snugovsky, "Tin-Whisker Testing and Modeling (SERDP WP-1753) Overview," Aerospace Industries Association Lead(Pb)-Free Electronics Risk Management (AIA-PERM) Consortium Meeting Number 7, Coral Gables, FL, January 11-13, 2010.

Meschter and Snugovsky, "Influence of Board and Component Cleanliness on Whisker Formation" Aerospace Industries Association Lead(Pb)-Free Electronics Risk Management (AIA-PERM) Consortium Meeting Number 7, Coral Gables, FL, January 11-13, 2010.

Meschter and Snugovsky, "Whisker growth from solder joints," Aerospace Industries Association Lead(Pb)-Free Electronics Risk Management (AIA-PERM) Consortium Meeting Number 7, Coral Gables, FL, January 11-13, 2010.

--------------------------------------------------------
Aerospace Sciences Meeting
{ https://arc.aiaa.org/action/showPublications?pubType=meetingProc&seriesKey=6.asm }
1 item found as of 10/18/2020

--------------------------------------------------------
AESF Chromium Colloquium
{ }
1 item found as of 1/30/2011 catalog
checked 11/20/2010

," AESF Chromium Colloquium, Cleveland, OH, May 30-31, 1996, pp. xx-xx.

--------------------------------------------------------
AESF SUR/FIN 2004
AESF Annual Technical Conference
Nth AES Annual Technical Conference Proceedings
72nd AES Annual Technical Conference Proceedings
AESF SUR/FIN Proceedings
American Electroplaters' Society 66th Annual Technical Conference
American Electroplaters' Society SUR/FIN '82 69th Annual Technical Conference
Proceedings AESF SUR/FIN '96
Proceedings of AESF SUR/FIN
Proceedings of AESF SUR/FIN 2002
Proceedings of the AESF 74th Annual Technical Conference
Proceedings of the 71st American Electroplaters Society SUR/FIN '84
Proceedings of the Annual Convention of the American Electroplaters Society
Proceedings of the 43rd Annual Convention of the American Electroplaters Society
Proceedings of the International Technical Conference of AESF SUR/FIN
Proceedings of The International Technical Conference of SUR/FIN
SUR/FIN '94 Technical Conference Proceedings
Technical Conference Proceedings AESF SUR/FIN
{ GIT main-6e TS670.A332X, LH closed, UCB pascal TS670.A332, UTor eng TS670.A642, WSU sci TS670.A332, }
>=20 items found as of 8/4/2013 catalog
55,79-88,93-00,02-04 checked 8/4/2013

ZAKRAYSEK, L., TIN WHISKER GROWTH FROM A BRIGHT ACID TIN ELECTROPLATED FINISH, 1976, 3033. SUR/FIN 76, SESSION D.

Kaja, S, Pickering, H. W, Bitler, William R. INTERDIFFUSION OF ELECTRODEPOSITS WITH COPPER SUBSTRATES. Annual Technical Conference - American Electroplaters' Society, vol. 1, 1982, C-4, 2p

," Proceedings of the 79th AESF Annual Technical Conference SUR/FIN '92, Atlanta, GA, June 22-25, 1992, pp. xx-xx.

Jeannier, Eliane, Zinc plating and corrosion protection top coat Proceedings of the AESF Annual Technical Conference, 1993, pp. 297-308

," Proceedings of The International Technical Conference of AESF SUR/FIN, Anaheim, CA, June 21-24, 1993, pp. xx-xx.

," SUR/FIN '94 Technical Conference Proceedings, Indianapolis, IN, June 20-23, 1994, pp. xx-xx.

," Proceedings of The International Technical Conference of SUR/FIN, Baltimore, MD, June 26-29, 1995, pp. xx-xx.

Szotek, Jeff M, Alloy alternatives to hexavalent chromium Proceedings of the AESF Annual Technical Conference, 1996, pp. 935-943

," Proceedings AESF SUR/FIN '96, Cleveland, OH, June 10-13, 1996, pp. xx-xx.

," Technical Conference Proceedings AESF SUR/FIN, Detroit, MI, June 23-26, 1997, pp. xx-xx.

," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. xx-xx.

," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. xx-xx.

Fan, Chonglun; Blair, A.; Mayer, L.; Abys, J.A. Electric gadgets "must get greener" New Technical and Economical Developments in Nickel/Palladium Leadframe Surface Finishing AESF SUR/FIN, 2000, pp. 187-193

Nickel/Palladium Leadframe Surface Finishing New Technical and Economical Developments in, 2000, Jun, C. Fan, A. Blair, L. Mayer and J. A. Abys

Brenda Fernandes & Dr. Kazimierz Wikiel, Technic, Inc., R&D, Cranston, RI; SUR/FIN 2000 High-speed Electroplating of Lead-free Solder, SUR/FIN 2000

Yun Zhang, Chen Xu, Chonglun Fan & J.A. Abys, Properties of Electroplated Tin & Tin Alloy Coatings, SUR/FIN 2000

Richard M. Edgar, Florida Cir Tech Inc., Greeley, CO, SUR/FIN 2000 An Analysis of Lead-free Final Finishes: The First Step in Producing a Lead-free Printed Wiring Board, 2000, Jun,

T. Naguy, M. Klingenberg, M. Pavlik & D. Schario Non-line-of-sight Hard Chromium Alternatives Update SUR/FIN 2000

C. Fan, B. Stacy, C. Xu and J. A. Abys Solderability and Wirebonding Performance of Palladium-Cobalt Finish SUR/FIN 2000

," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

," AESF SUR/FIN, Nashville, TN, June 25-28, 2001, pp. xx-xx.

Lal, S, "An Evaluative Study of Lead-Free Deposits in High Speed Applications, AESF SUR/FIN Conference 2001

Lal, S., "An Evaluative Study of Lead-Free Deposits in High Speed Applications, AESF SUR/FIN Conference 2001

R. Schetty, N. Brown, A. Egli, J. Heber, and A. Vinckler, "Lead-free finishes-whisker studies and practical methods for minimizing the risk of whisker growth," in Proc. AESF SUR/FIN Conf., Jun. 2001, pp. 1-5.

[jagtap4 9] R. Schetty, N. Brown, A. Egli, J. Heber, and A. Vinckler, in Proc. AESF SuR/FIN Conf., (2001) 1. C. Xu, C. Fan, A. Vysotskoya, J. Abys, Y. Zhang, L. Hopkins, and F. Stevie, "Understanding whisker phenomenon\\\_Part II, competitive mechanisms," in Proc. AESF SUR/FIN Conf., Jun. 2001.

Oberle, R., "Metallurgical Aspects of Tin Whisker Growth", Proceedings of the American Electroplaters and Surface Finishers (AESF) SUR/FIN Conference, June 24-28, 2002, pp. N/A

Oberle, R., "Metallurgical Aspects of Tin Whisker Growth", Proceedings of the American Electroplaters and Surface Finishers (AESF) SUR/FIN Conference, June 24-28, 2002, pp. N/A

Boguslavsky, I., N. Brown and H. Gray, "The Effect of Operating Parameters and Test Conditions On the Whisker Performance of Pure Tin as a Lead-Free Solderable Finish", Proceedings of the American Electroplaters and Surface Finishers (AESF) SUR/FI Conf June 24-28, 2002

Boguslavsky, I., N. Brown and H. Gray, "The Effect of Operating Parameters and Test Conditions On the Whisker Performance of Pure Tin as a Lead-Free Solderable Finish", Proceedings of the (AESF) SUR/FIN Conference, June 24-28, 2002, pp. N/A

," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. xx-xx.

Lal, S., "Tin Whiskers and Minimization in Electrical Connectors", AESF-SUR/FIN Conference, Milwaukee, WI: June 2003

," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. xx-xx.

," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. xx-xx.

," AESF SUR/FIN 2005, St. Louis, Missouri, June 13-16, 2005, pp. xx-xx.

SUR/FIN 2007 Jurgen Barthelmes, Peter Kuhlkamp, and Din-Ghee Neoh, J. Barthemes et al., "Quantification Of The Influence Of All Important Physical And Chemical Tin Plating Bath Parameters On The Propensity For Whisker Formation,"

--------------------------------------------------------
Agilent Technologies Lead-free Seminar
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
2010 AIMS/Harsh Environments Symposium
2009 AIMS Harsh Environments Electronics Symposium
8 items found as of 1/30/2011 catalog
09-10 checked 10/26/2010

--------------------------------------------------------
AIP Advances
{ https://aip.scitation.org/toc/adv/current UK online, }
18 items found as of 8/8/2021
v1#1-v11#7(21) all issues checked 8/8/2021

searched for tin whisker(s) and Sn whisker(s) on 11/28/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/28/2020
searched for indium whisker(s) on 11/28/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/28/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/28/2020

--------------------------------------------------------
(new source 12/6/2015)
AIP Conference Proceedings
{ https://aip.scitation.org/toc/apc/current UK online, }
>=20 items found as of 1/20/2021
263,305,373,418,491,612,741,817,908,945,1143,1270,1300,1601 checked 1/20/2021

searched for tin whisker(s) and Sn whisker(s) on 11/28/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/28/2020
searched for indium whisker(s) on 11/28/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/28/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/28/2020

--------------------------------------------------------
Air Force Research Laboratory Technology Horizons
3 items found as of 12/5/2014
Mar00-Aug10 checked 12/5/2014

--------------------------------------------------------
Air Safety Week
{ CSULB online, OSU online, UM online, UCSC KF2406.A15A38, VU online, }
3 items found as of 2/21/2011

--------------------------------------------------------
Air & Space Power Chronicles
1 item found as of 1/30/2011

--------------------------------------------------------
Air Traffic Technology International '99
{ https://www.airtraffictechnologyinternational.com/magazine }
(new reference 12/23/2013)
Smith 1999 "Electrostatic Discharges Internal to Chairs,..."

--------------------------------------------------------
Air and Waste Management Association - Nth Annual International Conference on Thermal Treatment Technologies
item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Kubik, Katarzyna, Donaj, Pawel, Swiderski, Artur, Yang, Weihong, Blasiak, Wlodzimierz, Christer, Forsgren .Assessment of ASR treatment using pyrolysis and reforming of its residences for small scale electricity generation systems Air and Waste Management Association - 27th Annual International Conference on Thermal Treatment Technologies 2008, v 2, Air and Waste Management Association - 27th Annual International Conference on Thermal Treatment Technologies 2008, 2008, p 717-726

--------------------------------------------------------
Aircraft Engineering
Aircraft Engineering and Aerospace Technology
{ https://www.emerald.com/insight/publication/issn/0002-2667 CSULB orca TL501.A5615, OkSU stillwater 629.1305A2985, OSU online & sel TL501A285, SDSU TL501.A5615, UC eng TL501.A555, UK online & eng TL501.A5615, UL online & kersey TL501.A5615, UM TL501.A296, UOk bizzell TL501.A5615, UT online & hodges TL501.A5615, }
3 items found as of 1/20/2021
v76#5

--------------------------------------------------------
AIST Steel Properties and Applications Conference Proceedings
item found as of 1/30/2011 catalog

(new reference 12/31/2008)
Fess, S., .XRF as a method for measuring coat weight thickness of various conversion coatings on steel or aluminum AIST Steel Properties and Applications Conference Proceedings, Combined with Ms and T'07, Materials Science and Technology 2007, AIST Steel Properties and Applications Conference Proceedings, Combined with Ms and T'07, Materials Science and Technology 2007, 2007, p 347-360

--------------------------------------------------------
Aluminium International Today
{ http://www.aluminiumtoday.com/ CSULB orca HD9539.A6 A48, UCF main TS554.A453, UK eng TS554.A453, UM online, USC TS554.A453, UT online, UTAr online, UTD online, VU online, }
2 items found as of 1/20/2021 catalog
v22#1-v31#5 checked 1/20/2021

--------------------------------------------------------
American Ceramic Society Bulletin
{ EBSCOA, CMU eng, CSULA online, CSULB online, GIT online, OSU online, SMU online, UC ceas TP785.A63, UCF online, UF online, UK online & remote TP785.A63, UL TP785.A63, UM online & TP785.A5b, UNC TP785.A63, UPi online, USC grand, UT online, UTAr online, UTD online, VU online, }
8 items found as of 8/6/2021 catalog
v80#10-v100#6(21) checked 8/6/2021

--------------------------------------------------------
American Industrial Hygiene Association Journal
AIHA Journal
{ https://www.tandfonline.com/loi/uaih20 CSULA north RC963 .A135, CSULB online, UC online & ceas RC963.A135, UD roesch, UK online & med W1AM4365, UL health, UM online, USC online, UT hodges RC963.A135, VU online, }
1 item found as of 1/20/2021
searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

--------------------------------------------------------
American Institute of Mining & Metallurgy
{ UK eng TN1.A5, }
item found as of 1/30/2011

--------------------------------------------------------
American Journal of Industrial Medicine
{ https://onlinelibrary.wiley.com/loi/10970274 GIT online, OSU online, UC online, UCF online, UD online, UF online, UK online & med W1AM468H, UL health, UM online, USC RC963.A1A7, UT online, VU online, }
1 item found as of 8/11/2021
v51#1-v64#9(21) checked 8/11/2021

--------------------------------------------------------
American Laboratory
{ https://www.americanlaboratory.com/1413-Issues/ AU rbd Q184.A54, GIT main-3e Q184.A54, LH closed, MST Q184.A54, NEU snell Q1.A4320, OrSU online, OSU health Q184.A54, PU chem 502.8Am35 & hicks 502.8Am35, RyU QD53.L322, SIUC morris 51089-5071, SMU storage, TTU, TU tisch Q184.A54, UAB sterne Q184.A54, UCI sci drum Q184.A54, UF ifas centers, UIUC chem 600.7805AM, UK sci Q184.A54, UM taubman Q184.A52 & buhr Q184.A52, UOk bizzell Q184.A54, USC grand, UTA geol Q184A54, UTD Q184.A54, UTor Q184.A54, UWa davis Q184.A54, }
item found as of 10/13/2012 catalog

(new reference 10/13/12)
Sieber, John R., . Certified reference materials for testing of declarable substances American Laboratory, v 39, n 9, April, 2007, p 20-22

--------------------------------------------------------
American Society of Mechanical Engineers, Design Engineering Division (Publication) DE
item found as of 1/30/2011 catalog

(new reference 1/30/2011)
Gomatam, Rajesh R, and Sancaktar, Erol, "A study of fatigue and failure behavior of conductive adhesive joints subjected to elevated temperature and humidity," American Society of Mechanical Engineers, Design Engineering Division (Publication) DE, vol. 117, Proceedings of the ASME Design Engineering

--------------------------------------------------------
American Society of Mechanical Engineers, Production Engineering Division
PED
{ UM online, }
item found as of 6/11/2015 catalog
92-93 checked 6/11/2015

--------------------------------------------------------
AMMTIAC Quarterly
{ CSULA online, CSULB online, UC online, UK online, UM online, USC TA404.2A462, VU online, }
1 item found as of 1/20/2021

--------------------------------------------------------
AMP Journal of Technology
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Analog Applications Journal
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Analog Dialog
{ OSU online, }
2 item found as of 3/4/2014 catalog

--------------------------------------------------------
Analytical and Bioanalytical Chemistry
{ https://link.springer.com/journal/216/volumes-and-issues CSULA online, CSULB online, OSU online, UC online, UD online, UK online & sci QD71.Z3, UL online, UM online, USC QD71.A5, UT online, VU online, }
1 item found as of 1/20/2021

searched for tin whisker(s) and Sn whisker(s) on 11/27/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/27/2020
searched for indium whisker(s) on 11/27/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/27/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/27/2020

--------------------------------------------------------
Analytical Chemistry
{ https://pubs.acs.org/loi/ancham CSULB online, Lexmark, MST depos 660.5In21am & wilson TP1.I615, NWU online & sci L543.05I42, OkSU main 660.5A532, OSU ONL NE & sel TP1J861, PU chem 660.5In2a, SDSU online, SIUE online, UAr online, UC chem TP1.I62, UCSD s&e QD450.2.P58, UD online & roesch, UIC online, UK online & chem/phys TP1.I615, UL online & kersey TP1.I615, UM online & buhr TP1.I62 & shapiro TP1.I62, UOk chem-math TP1.I615, USC grand, USD online, UT online & hodges TP1.I615, }
item found as of 1/20/2021

--------------------------------------------------------
Ann. Institute of Physical Chemistry (Leningrad)
item found as of 1/30/2011 catalog

(new reference 1/30/2011)
Stepanoff, Ann. Inst. Phys. Chem. (Leningrad), 2, 500 (1924).

--------------------------------------------------------
Annalen der Physik
Drude's Annalen
{ https://onlinelibrary.wiley.com/loi/15213889 IU online, MST depos 530.5An7a & wilson QC1.A6, NWU online & sci 530.5 A61, OkSU main 530.5A6127, OSU online & sel QC1A61, PU online & phys 530.5An7, SDSU online, SIUC online, SIUE lovejoy, UAr online, UC online & phys QC1.A6, UCSD s&e QC1.A6134, UIC sci QC1.A6, UK online & chem/phys QC1.A6 & king QC1.A6, UL online & kersey QC1.A6 & ekstrom QC1.A6, UM online & shapiro QC1.A6 & buhr QC1.A613, UOk bizzell QC1.A6, USD online, UT online, }
2 items found as of 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 12/19/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/19/2020
searched for indium whisker(s) on 12/19/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/19/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/19/2020

--------------------------------------------------------
10th Annual Automotive Electronics Reliability Workshop
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Fifteenth Annual Connectors and Interconnection Technology Symposium Proceedings
{ CSULA palmer TK7870 .C75, UC depos TK7870.C6, UL robotics TK2821.C6, }
1 item found as of 1/30/2011

--------------------------------------------------------
Annual Electronic Packaging Conference {UM TK5.I52 & TK7870.E4215 (Buhr), UT TK7870.E542, }
--------------------------------------------------------
2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Nth Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Proceedings of xxxx IEEE/CPMT Nth Semiconductor Thermal Measurement and Management Symposium
SEMI-THERM
{ IEEE XPLORE (88-), GIT online & main TK7871.85.I27, UK online & QA76.I65, UM online & TK5.I12, (many other universities also subscribe to IEEE XPLORE), }
3 items found as of 8/3/2021
88-21 checked 8/3/2021

(new reference 12/23/2013)
Connet June 1972 p 94-99

-------------------------------------------------------
2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society
{ IEEE XPLORE (88-), }
1 item found as of 8/3/2021
14-20 checked 8/3/2021

zabaleta, haritz, valencia, david, perry, joel, veneman, jan, and keller, thierry,
"absolute position calculation for a desktop mobile rehabilitation robot based on three optical mouse sensors," 2011 annual international conference of the ieee engineering in medicine and biology society, boston, ma, aug. 30-sept. 3, 2011, pp. 2069-2072.

2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) 3-7 July 2013 *** here for IEEE XPLORE 8/3/2021 *** -------------------------------------------------------
Fifteenth Annual International Symposium on Fault-Tolerant Computing
20th International Symposium on Fault-Tolerant Computing
{ IEEE XPLORE (88-99), UK eng QA76.7F38I58, (many other universities also subscribe to IEEE XPLORE), }
9 items found as of 8/3/2021
88-99 checked 8/3/2021

--------------------------------------------------------
1997 1st Annual International Systems Packaging Symposium
item found as of 1/30/2011 catalog

(new reference 1/30/2011)
Hong, Bor Zen, Viscoplastic deformation and thermal fatigue behavior of lead-free solder joints in a surface mount package The 1997 1st Annual International Systems Packaging Symposium, San Diego, CA, USA, 02-05 Dec. 1997. pp. 197-200. 1997

--------------------------------------------------------
106th Annual Meeting and Exposition of The American Ceramic Society
{ UCF main TP807.I65, UF sci TA418.9.C6C412, }
item found as of 1/30/2011 catalog

(new reference 6/8/2009)
Devarajan Balaraman, P. Markondeya Raj, Sid Dalmia, Isaac Robin Abothu, Swapan Bhattacharya, Lixi Wan, Michael. D. Sacks, Madhavan Swaminathan and Rao R. Tummala, "Integration of Hydrothermal and Sol-Gel Derived Ceramic Film Capacitors for Next-Generation Convergent Microsystems", Presented at 106th Annual Meeting and Exposition of The American Ceramic Society held during April 18-21, 2004.

--------------------------------------------------------
Annual National Relay Conference
{ UK eng TK2851.N27, }
item found as of 1/30/2011

--------------------------------------------------------
Annual Review of Materials Research 2004
Annual Review of Materials Research
{ https://www.annualreviews.org/loi/matsci EBSCOA, EBSCOB, AU online, BYU online, FAU TA401.A7, FIT online, FIU online, FSU online, IU online, LH online, LU gray TA401.A7, MST online, NWU online, OGI online. OkSU online, OrSU online, OSU online, PU online, RyU online, SDSU online, SIUC online, SU online, TTU online, UAB online, UAH online, UAr online, UC online, UCF online, UCI pnline, UCSD online, UDe online, UF online, UIC online, UIUC online, UK online, UL robotic TA401.A7, UM online, UMC online, UMe mcwherter TA401.A7, UMi online, UNCC online, UNF online, UOk online, USD online, USF online, USU online, UT online, UTA online, UTo online, UTor online, UWa online, WrSU online, }
3 items found as of 8/6/2021
v1-v51(21) all issues checked 8/6/2021

--------------------------------------------------------
22nd Annual Review of Progress in Applied Computational Electromagnetics
2016 IEEE/ACES International Conference on Wireless Information Technology and Systems (ICWITS) and Applied Computational Electromagnetics
2018 International Applied Computational Electromagnetics Society Symposium
2017 International Applied Computational Electromagnetics Society Symposium - Italy
2015 31st International Review of Progress in Applied Computational Electromagnetics
{ IEEE XPLORE (15-), UK online, }
1 item found as of 8/3/2021
15-20 checked 8/3/2021

--------------------------------------------------------
(new source 6/22/2020)
5th Annual Sn Whisker Symposium
{ }
1 item found as of 6/22/2020

(new reference 6/22/2020)
10. D.F. Susan, J.R. Michael, Edmund Webb III, R.P. Grant, B.B. McKenzie, and W.G. Yelton, "SEM Observation and EBSD Analysis of Straight and Kinked Sn Whiskers", presented at 4th Annual Sn Whisker Symposium, Univ. of Maryland, College Park, MD, June 23-24, 2010. SAND2010-3943C 2010-06-01 (not found on osti.gov) 11. P.T. Vianco and J.A. Rejent, "Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development: Model and Experiments", presented at 4th Annual Sn Whisker Symposium, Univ. of Maryland, College Park, MD, June 2010. (not found on osti.gov) --------------------------------------------------------
Annual Technical Conference - ANTEC
ANTEC 94
Conference Proceedings at ANTEC '98
Conference Proceedings for the Society of Plastics Engineers, Inc. 43rd Annual Technical Conference
Society of Plastics Engineers Annual Technical Conference
Society of Plastics Engineers Annual Technical Conference 2006
{ LH TA455.P5S635, MST wilson TP1105.S55, OkSU main 668.408S678t, OSU sel TP1105.S62, SDSU TP986.A1.S5725, UC eng TP1105.S63, UCB eng TP986.A1S5725, UL kersey TP1105.S62, UM online, UOk online, }
4 items found as of 1/30/2011
94

--------------------------------------------------------
(new source 6/22/2020)
5th Annual Tin Whisker Conference
{ }
1 item found as of 6/22/2020

--------------------------------------------------------
Anoplate News
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Anti-Corrosion Methods and Materials
{ https://www.emerald.com/insight/publication/issn/0003-5599?_ga=2.88503451.1896950517.1604010988-1945093323.1603753182 MST wilson TA462.A57, OkSU online, OSU online & sel TA462A1A56, SDSU online, SIUC morris 51391-6202, UAr online, UC online, UH online, UK online & eng TA462.A67, UL online, UM online & buhr TA462.A1A628, UOk online, UPi online, UT online, UTo online, }
11 items found as of 8/8/2021 catalog
v39#1-v68#3(21) checked 8/8/2021

--------------------------------------------------------
Appliance
{ OSU online, PU eng 671M562, SDSU online, UM online, UT online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Appliance Design
{ http://www.appliancedesign.com/ EBSCOB, IU online, NWU online, OSU online, PU hicks 338.47643605Ap58, SDSU online, SIUC online, UAr online, UCSD online, UIC online, UK online, UOk online, USD online, UT online, }
>=20 items found as of 8/6/2021
v48#1(Jan00)-v67#4(19) checked 8/6/2021

--------------------------------------------------------
Application Reference Materials
1 item found as of 12/5/2014
checked 12/5/2014

--------------------------------------------------------
Applications of Surface Science
{ https://www.sciencedirect.com/journal/applications-of-surface-science/issues MST wilson TA418.7.A66, NWU sci 660.29453A6524, OkSU online, PU hicks 660.29453Ap58, SIUC morris 57118-6611, UAr chem TA418.7.A66, UC geo TA418.7.A66, UCSD online, UK online, UM online sd & shapiro QC1.A652, UPi online, UT online, }
1 item found as of 1/20/2021 catalog
searched for tin whisker(s) and Sn whisker(s) on 12/3/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/3/2020
searched for indium whisker(s) on 12/3/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/3/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/3/2020

--------------------------------------------------------
Applied Mechanics and Materials
{ https://www.scientific.net/AMM OSU online, UC online, UK online (pay), UM online, }
>=20 items found as of 1/20/2021
v1-v65(Jun11) checked 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 10/11/2020
searched for zinc whisker(s) and Zn whisker(s) on 10/11/2020
searched for indium whisker(s) on 10/11/2020
searched for cadmium whisker(s) and Cd whisker(s) on 10/11/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 10/11/2020 searched for nanowire(s), mesowire(s), microwire(s) on 10/11/2020

--------------------------------------------------------
Applied Physics
{ https://link.springer.com/journal/339/volumes-and-issues USC QC1.A73, }
3 items found as of 11/27/2020 catalog
searched for tin whisker(s) and Sn whisker(s) on 11/27/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/27/2020
searched for indium whisker(s) on 11/27/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/27/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/27/2020

--------------------------------------------------------
Applied Physics A
Applied Physics A: Materials Science and Processing
{ https://link.springer.com/journal/339/volumes-and-issues MST online, OCU online, OkSU online, OSU online & QC1A6232, PU online & phys 530.05Ap51a, SDSU online, SIUC online, UAr online, UC online & phys QC1.A662, UCSD online, UK online, UM online & shapiro QC1.A65742, USD online, UT online & hodges QC1.A73, }
4 items found as of 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 11/27/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/27/2020
searched for indium whisker(s) on 11/27/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/27/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/27/2020

--------------------------------------------------------
Applied Physics Letters
{ https://aip.scitation.org/toc/apl/current FSU online, GIT online, MST online, OkSU online, OSU online & sel QC1A626, SDSU online, SIUC online, SIUE online, UAr online, UC online & phys QC1.A67, UCF online, UCSD online, UE, UK online, UM online & shapiro QC1.A658, UOk online, USD online, UT online, }
>=20 items found as of 1/20/2021
v90#11,v92#9,v92#21,v93#1,v93#4,v93#12,v94#1,v94#9 checked 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 7/17/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/6/2020
searched for indium whisker(s) on 8/6/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/6/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight on 8/6/2020
searched for gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 10/9/2020

--------------------------------------------------------
Applied Physics Reviews
{ https://aip.scitation.org/toc/are/current CSULB online, UK online, UT online, }
4 items found as of 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 11/28/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/28/2020
searched for indium whisker(s) on 11/28/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/28/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/28/2020

--------------------------------------------------------
Applied Surface Science
{ https://www.sciencedirect.com/journal/applied-surface-science/issues CMU online, MST wilson TA418.7.A66, OkSU online, OSU online, SDSU online, SIUC online, UAr chem TA418.7.A66, UC online & TA418.7.A66, UCSD s&e, UK online sd, UL online & kersey TA418.7.A66, UM online & shapiro QC1.A652, UOk online, UT online, UTo online & carlson, WSU online & carlson, }
10 items found as of 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 7/17/2020

searched for zinc whisker(s) and Zn whisker(s) on 9/12/2020
searched for indium whisker(s) on 9/12/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/12/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/12/2020 --------------------------------------------------------
Archaeologia: Or Miscellaneous Tracts Relating to Antiquity
{ MSU main DA20.A64, NWU main film 16500, OSU depos DA20A66, PU human microform 072 Ea76 Reel 1258-1261, SIUC morris 32675-9131, UC class DA20.A66, microforms, UM hatcher film X1287 reel 1258-1261, UT hodges DA20.A64, WSU purdy-kresge, }
1 item found as of 1/30/2011

--------------------------------------------------------
Archives of Environmental Contamination and Toxicology
{ https://link.springer.com/journal/244/volumes-and-issues AU online, BYU online, FAU online, FIT online, FIU online, FSU online, IU online, LH closed, MST online, NWU online, OGI online, OkSU online, OrSU online, OSU online, PU online, RyU online, SDSU online, SIUC online, SU online, UAr online, UC online, UCF online, UCI online, UCSD online, UD online, UDe online, UF online, UIC online, UIUC online, UK online, UL online, UM online, UMC online, UMe mcwherter, UMi online, UNCC online, UNF online, USD online, USF online, USU online, UT online, UTA online, UTo online, UTor online, UWa online, }
2 items found as of 1/20/2021
v53#2 checked 1/20/2021

--------------------------------------------------------
Archives of Environmental Health
{ https://www.tandfonline.com/loi/vaeh20 OSU online, UC sw depos, UD online, UK online & med W1AR455 & remote W1AR455, UL health, UM online, UT online, VU online, }
1 item found as of 1/20/2021
searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

--------------------------------------------------------
Archives of Metallurgy and Materials
{ LH closed, }
1 item found as of 1/30/2011

--------------------------------------------------------
Arrow Asian Times
Arrow Asia Times
8 items found as of 1/30/2011

--------------------------------------------------------
Ars Organi
{ FSU music MT182.P4, IU music, NWU music MT182.P4, OSU depos MT182.P4A7, RU fondren ML5.A68, SMU hamon, UC ccm MT182.P4, UK finearts MT182.P4, UM music ML5.A78, UMc music MT182.P43A7, UTor music ML5.A647, }
item found as of 1/30/2011 catalog

(new reference 2/11/2009)
[7] K. Bormann, Ars Organi 1969, 35, 1326.

(not at UK) --------------------------------------------------------
ASHRAE Journal
{ https://www.thefreelibrary.com/ASHRAE+Journal-p24835 AU online, CBU, FIT online, FSU online, GIT online, IU online, LH closed, LU gray TH7201.A22, MoSU TH7005.A87, MST wilson TH7201.A512, NWU online, OCU microform, OGI online, OkSU online, OrSU valley TH7201.A53, OSU online, PU online, RU fondren, SDSU online, SIUC online, SIUE lovejoy microfiche, SU online, TTU, UAB sterne TH7201.A22, UAH online, UAr online, UC online, UCF online, UCI online, UCSD online, UDe online, UE, UF online, UIC online, UIUC online, UK eng TH7005.A74, UM online & buhr TH7201.A516, UMC online, UMe mcwherter, UNF online, UOk online, USD online, USF online, USU online, UT online, UTA online, UTo online, WrSU online, }
1 item found as of 1/30/2011

--------------------------------------------------------
(new source 6/22/2020)
10th Asia-Pacific Microscopy Conference
APMC
{ }
(new reference 6/22/2020)
4. J.R. Michael, D.F. Susan, and B.B. McKenzie, "2D and 3D EBSD Characterization of Tin Whiskers", 10th Asia-Pacific Microscopy Conference (APMC), Perth, Australia, Feb. 2012. (not found on osti.gov) --------------------------------------------------------
2010 15th Asia and South Pacific Design Automation Conference
Asia and South Pacific Conference on Design Automation
Conference and 15th International Conference on VLSI Design
Proceedings of ASP-DAC/VLSI Design 2002. 7th Asia and South Pacific Design Automation Conference and 15th International Conference on VLSI Design
ASP-DAC
{ IEEE XPLORE (95,97-18,20-), (many other universities also subscribe to IEEE XPLORE), }
4 items found as of 8/3/2021
95,97-18,20-21 checked 8/3/2021

--------------------------------------------------------
Asia Electronics Forum
1 item found as of 1/30/2011

--------------------------------------------------------
Asia-Pacific Conference on Environmental Electromagnetics
CEEM
{ IEEE XPLORE (00,03,06,09,12,15), }
>=20 items found as of 8/3/2021
00,03,06,09,12,15 checked 8/3/2021

--------------------------------------------------------
Asia-Pacific Microwave Conference
Proceedings of Asia-Pacific Microwave Conference 2007
APMC
{ IEEE XPLORE (92-93,97,99-01,05-), (many other universities also subscribe to IEEE XPLORE), }
3 item found as of 8/3/2021
92-93,97,99-01,05-20 checked 8/3/2021

--------------------------------------------------------
xxxx Asia-Pacific Symposium on Electromagnetic Compatibility
Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility
APEMC
{ IEEE XPLORE (08,10,12-13,15-), UM online? (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
08,10,12-13,15-17 checked 8/3/2021

-------------------------------------------------------
2013 5th Asia Symposium on Quality Electronic Design
1st Asia Symposium on Quality Electronic Design
ASQED
{ IEEE XPLORE (09-), (many other universities also subscribe to IEEE XPLORE), }
10 items found as of 8/3/2021
09-15 checked 8/3/2021

-------------------------------------------------------
Third Asian-Pacific Congress on Computational Mechanics and Eleventh International Conference on the Enhancement and Promotion of Computational Methods in Engineering and Science
{ GIT main-4e QA801.A75, OSU sel QA801.A75, UIUC eng 531As42c, UOk chem-math QA801.A75, }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
ASM International Electronic Materials and Processes Conference
{ UTAr storage TK7874.A77, }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
ASM International Practical Failure Analysis
{ }
1 item found as of 12/10/2013
checked 12/10/2013

--------------------------------------------------------
2008 ASME International Mechanical Engineering Congress and Exposition
Proceedings of the ASME International Mechanical Engineering Congress & Exposition
ASME International Mechanical Engineers Conference
IMECE
{ BYU TJ5.I58, CMU eng TJ5.I53, GIT main-5e TA349.A86 & main-5e TJ5.I58x, LH TA349.R41, MIT barker TJ5.I58, MST wilson TA190.E66, NEU snell R856.A245 & snell TJ5.I58 & snell TJ212.P76, OrSU valley TJ212.2.I56, OSU sel TA349.P763, PU eng 620.0068En335, RU fondren TJ260.I564 & TJ212.2.P76, RyU TJ5.M36, UC eng TA164.A85 & eng TJ212.2.P76 & eng TJ260.A75, UTA eng TJ260I5755, }
>=20 items found as of 8/6/2012 catalog
97-98,07-09 checked 8/6/2012

(new reference 6/8/2009)
S. Bhattacharya and R. Tummala, "Epoxy nanocomposite capacitors for integral passives technology, " ASME International Mechanical Engineers Conference, Technical Paper 99-IMECE/EEP-25, pp. 1-8, Nashville, Tennessee, November 1999

--------------------------------------------------------
Assembly
Assembly Magazine
{ http://www.assemblymag.com/ MST online, MTUM online, OkSU online, OSU online, SDSU online, UAr main TS178.4.A75, UC online & eng TJ1320.A75, UCSD ssh PR3291.A1A77, UOk online, UT online, VU online, WSU online, }
>=20 items found as of 12/21/2020 catalog
v44#1(Jan01)-feb15 checked 12/21/2020

--------------------------------------------------------
Assembly Automation
{ https://www.emerald.com/insight/publication/issn/0144-5154 FAU online, FIT online, MST online, OkSU online, OSU online, SDSU online, UAr online, UC online & eng TS178.4.A84, UCSD online, UH online, UK online, UMi online, UOk online, UT online, UTo online, WSU online & sci, }
5 items found as of 8/8/2021 catalog
v1#1-v41#1(21) all issues checked 8/8/2021

--------------------------------------------------------
Assembly Engineering
{ http://www.assemblymag.com/Links/DigitalEditionArchive, UC ceas TJ1320.A75, UM online, UT hodges TJ1320.A75, VU online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Assembly Technology Expo
{ VU online, }
1 item found as of 1/30/2011

--------------------------------------------------------
ASTM special technical publication
Symposium on Solder (ASTM Special Technical Publication No. 189)
{ MST wilson various, NWU sci 620.6A5127s, OkSU main 620.112A512s, OSU misc, PU eng misc, Lexmark various, SDSU TA401.A69, SIUC mclafferty 620.112A512s, SIUE lovejoy various, UAr various, UC various, UCSD s&e various, UD roesch various, UIC verious, UK eng TA410.A43 & QD133.A63, UL kersey TA418.9.C6T43, UM misc, USD various, UT hodges TA401.A69, }

4 items found as of 1/30/2011

--------------------------------------------------------
AT&T Technical Journal
Bell Labs technical journal (new name)
{ https://onlinelibrary.wiley.com/loi/15387305 CMU eng, CSULA north TK1.B425. OSU sel TK1.B423, SMU storage, UC online & math TK1.B4, UCF main TK1.B43, UD online, UF sci TK1.B425, UK online & remote TK1.B425, UL robotic TK1.B425, UM online, UPi eng, USC grand, UT online & hodges TK1.B425, UTAr depos TK1.B425, UTD TK1.B425, VU online, }
1 item found as of 8/2/2021
v64#1(start)-v75#2(96,ended publication) checked 8/2/2021

--------------------------------------------------------
Australian
{ OSU online, UD online, UK online, }
1 item found as of 1/20/2021

--------------------------------------------------------
Australian Journal of Scientific Research
{ IU bloomington alf QC1.A93, MST depos 505Au78, NWU sci 530.5A938, OkSU online, OSU sel QC1A93, PU chem 540.5Au73, SDSU Q1.A773, SIUC storage 51368-5301 & storage 51010-5741, UC phys Q1.A7 & sw depos Q1.A7, UCSD s&e Q1.A938, UIC sci various, UK chem/phys Q1.A773, UL ekstrom QH1.A983, UM online & shapiro QD1.A93, UOk bizzell Q1.A773 & bizzell QH1.A983, UT hodges closed Q1.A8, }
item found as of 1/30/2011

--------------------------------------------------------
Australian Printer Magazine
{ GIT main-6e Z119.A895, }
item found as of 1/30/2011 catalog

Tribute, Andrew "Living with the environment," AP Australian Printer Magazine, n FEB., Feb. 2006, p 29

--------------------------------------------------------
Automation World
{ http://www.automationworld.com/digitaledition, UK online, }
1 item found as of 1/20/2021

--------------------------------------------------------
Automotive Engineer
Automotive Engineer (London)
{ OkSU online, OSU online & sel TL1J192, SDSU online, SIUC online, SIUE lovejoy microfiche, UAr online, UC eng TL1.A88, UCSD online, UK online & eng TL1.S5, UL online & kersey TL1.A596 & kersey TL1.S5, UOk online, USD online, UT hodges TL1.A596, }
3 items found as of 1/20/2021
v28#5

--------------------------------------------------------
Automotive Finishing
{ SDSU online, UOk online, }
2 items found as of 1/30/2011

--------------------------------------------------------
Aviation Today
{ UM online, }
3 items found as of 1/30/2011

--------------------------------------------------------
Aviation Week & Space Technology
{ https://archive.aviationweek.com/ https://archive.org/details/aviationweek?sort=date MST wilson TL501.A8, MSU online, OCU beam, OkSU stillwater 629.1305A9588, OSU online & sel TL501A95, SDSU online, SIUC online, SIUC lovejoy, UAr online, UC eng TL501.A7, UCSD online, UE, UK online & eng TL501.A8, UL kersey TL501.A8, UOk online, USD online, UT online, UTo online & carlson, WSU online & sci, }
4 items found as of 1/20/2021
v124#6-v158#22(2003)

--------------------------------------------------------
Avnet Advantage
>=20 items found as of 12/5/2014
Apr04-Jun06,Mar07 checked 12/5/2014

BBBB--------------------------------------------------------
Benchmarking: An International Journal
{ https://www.emerald.com/insight/publication/issn/1463-5771 GIT online, UC online, UCF online, UF online, UK online, UM online, UPi online, VU online, }
1 item found as of 8/8/2021 catalog
v6#1(99)-v28#7(21) checked 8/8/2021

--------------------------------------------------------
Berichte der Deutschen Chemischen Gesellschaft
{ https://chemistry-europe.onlinelibrary.wiley.com/loi/10990682b/year/1918 IU bloomington alf QD1.D4, MST depos 540.6D48, NWU sci 540.6D48, OkSU stillwater 540.5C5168, OSU sel compact QD1.D48, PU chem 540.5D48 & hicks 540.5D48, SDSU online, SIUC morris 51816-5401, SIUE storage, UAr online, UC chem (Oesper Rm) QD1.D4, UCSD online, UD roesch rare QD1.D4, UE, UIC sci, UK chem/phys QD1.D4, UL kersey QD1.D4, UM online & shapiro QD1.D486b & hatcher QD1.D486b & buhr QD1.D486b, UOk online, UT hodges closed QD1.D4, }
2 items found as of 1/30/2011

--------------------------------------------------------
Board Authority
{ UM online, }
3 items found as of 1/30/2011

--------------------------------------------------------
Boeing Environmental Technotes
2 items found as of 1/30/2011 catalog

--------------------------------------------------------
Boltzmann-Festschrift
item found as of 1/30/2011 catalog

J. H. van't Hoff, Boltzmann-Festschrift 1904, S. 233.

--------------------------------------------------------
Bosch Telecom

item found as of 1/30/2011 catalog

"CECC-parts with Pure Sn for Pretinning for VJ-capacitors," Sept. 1996.

--------------------------------------------------------
Brass World
Brass world and Platers Guide
{ OSU depos TS200B82, UAr storage ML1.B72, UM buhr TS200.P72, WSU storage, }
1 item found as of 1/30/2011

--------------------------------------------------------
British Chemical Abstracts B
{ OSU depos QD1C52, PU hicks 540.5B77, SIUC storage 51903-5401, UC biol QP1.P4, UK chem/phys QD1.B8, UL ekstrom QD1.B68, UM shapiro QD1.B8621, UOk bizzell 660.5B899b, UT hodges QD1.B68, }
1 item found as of 1/30/2011

--------------------------------------------------------
British Corrosion Journal
{ OSU sel TA462A1B7, SIUC storage 51630-6201, UC eng TA462.B73, UCSD s&e QD1.B864, UK eng TA462.B73, UOk bizzell TA462.B73, UT hodges TA462.B73, }
1 item found as of 1/30/2011

--------------------------------------------------------
British Journal of Applied Physics
{ https://iopscience.iop.org/journal/0508-3443 OSU online, UC online, UK storage QC1.I548, UM online, UT online, VU online, }
7 items found as of 5/20/2021
searched for tin whisker(s) and Sn whisker(s) on 12/21/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/21/2020
searched for indium whisker(s) on 12/21/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/21/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/21/2020

--------------------------------------------------------
British Plastics & Rubber
{ https://www.thefreelibrary.com/British+Plastics+%26+Rubber-p22819 AU online, BYU hbll TP1101.B75x, FIT online, FSU online, GIT main-4w HD9661.G7B73, LH, NWU sci L678.05B849, PU eng 678.05P695 & hicks 678.05P695, SIUC storage 51156-6732, UDe online, UF online, UIUC eng 668.405BR, UM online, UNF online, USF online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Bulletin of the American Physical Society
{ https://www.aps.org/meetings/baps/index.cfm IU bloomington swain QC1.A512 & alf QC1.A512, MST depos 530.5Am35b, NWU online & sci L530.6A512b, OkSU online, OSU sel QC1A56, PU chem 530.5P56b & phys 530.5P56b, SDSU online, SIUC morris 51134-5301, UAr online, UC phys QC1.A55, UCSD online, UIC sci QC1.A56, UK chem/phys QC1.A56, UL kersey QC1.A56, UM hatcher QC1.A524, UOk bizzell QC1.A473, UT hodges closed QC1.A58, }
3 items found as of 1/30/2011

--------------------------------------------------------
Bulletin SEV/AES
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Business Line
{ OSU online, UD online, UM online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Business Wire
{ OSU online, UK online, UM online, VU online, }
2 items found as of 1/20/2021

--------------------------------------------------------
BusinessWeek
{ OSU online, UC online, USD online, UK online & young HF5001.B89 & storage HF5001.B89, UL online, UM online, UT online, VU online, }
1 item found as of 1/20/2021

CCCC--------------------------------------------------------
Cadalyst
{ http://www.cadalyst.com/cadalyst/ IU online, NWU online, OkSU stillwater 620.5C1221, OSU online, PU eng 006.605C113, SDSU online, UC CAS T385.C338, UCSD online, UK online, UM online, UOk online, UT online, }
1 item found as of 6/20/2021
v15#2(98)-v32#1(15) checked 6/20/2021

--------------------------------------------------------
CALCE International Symposium on Tin Whiskers
item found as of 2/8/2011 catalog

(new reference 2/16/2011)
Aragon, J., "Tin Whisker Mitigation Methods", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

Boettinger, W., "NIST Tin Whisker Research", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

Chason, E., "Stress Generation, Relaxation and Whisker Formation in Tin Coatings on Copper", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

Doornink, J., "Effectiveness of EPM Coatings as a Mitigation Against Tin Whiskers", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

Dunlevey, F., "Evaluation of the Influence of Substrate Material on Tin Whisker Growth", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

Galyon, G., "Tin Whisker: Stress Measurement and Analysis", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

Handwerker, C., "Stress Relaxation in Sn, Sn-Cu, and Sn-Pb Films", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

Mathew, S., "Tin Whisker Risk and Growth Assessment", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

Michelet, J., "Tin Whiskers: How to Mitigate their Growth by an Accurate Choice of the Finish, the Under-Layer and/or by Conformal Coating?", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

Nocke, K., "Tin Whisker Growth Investigations Component and Module Level", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

Oberndorf, P., "Matte Tin Plating as an Alternative to Tin-Lead as Semiconductor Surface Finish", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

Pinsky, D., "The Effect of Grain Boundary Impurities on the Whiskering Propensity of Tin", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

Reinbold, L., "Intermetallic Growth Kinetics in Copper-Tin Bi-Layer Thin Films", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

Shibutani, T., "Evaluation of Resistance to Tin Whisker Formation Induced by Contact Force", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

Suganuma, K., "Tin Whisker Formation on Fine Pitch Connectors and Its Mitigation", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

Thompson, R., "POSS-thiol Based Mitigation of Tin Whiskers", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

Touw, A., "Tin Whisker Interactions: A Monte Carlo Analysis", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

Wilcox, G., "Tin Whisker Growth from Electrodeposited Tin-Manganese Alloys", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

Mizuguchi et.al. "Whisker and Nodule Formation on Lead-Free Tin Plating by External Stress" 2nd CALCE International Tin Whisker Symposium 2008

--------------------------------------------------------
Calphad: Computer Coupling of Phase Diagrams and Thermochemistry
{ https://www.sciencedirect.com/journal/calphad/issues AU online, BYU online, CMU eng, CSULB online, FSU online, GIT online, LH closed, MoSU QD510.C17, MST wilson QD503.C2, NWU sci microfiche S13, OkSU online, OSU online, PU online, SDSU online, UC online, UCI online, UCSD online, UDe online, UF online, UIC online, UIUC online, UK online (pay), UM online sd, UMC online, UNF online, UPi online, USD online, USU online, UT online, UTA online, UTo online, WrSU online, }
>=20 items found as of 8/8/2021 catalog
v1#1-v73(21) all issues checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 12/4/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/4/2020
searched for indium whisker(s) on 12/4/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/4/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/4/2020

(new reference 12/4/2020)
Berche, A., J. C. TédenacP. Jund Calphad assessment of the Ni–Sn–Ti system Calphad Volume 54, September 2016, Pages 67-75 https://doi.org/10.1016/j.calphad.2016.06.002

Berche, Alexandre, Pierre BenigniMarie-Christine Record Thermodynamic assessment of the La–Zn system Calphad Volume 36, March 2012, Pages 65-70 https://doi.org/10.1016/j.calphad.2011.11.004

Braga, M. H., J. VizdalL. F. Malheiros The experimental study of the Bi–Sn, Bi–Zn and Bi–Sn–Zn systems Calphad Volume 31, Issue 4, December 2007, Pages 468-478 https://doi.org/10.1016/j.calphad.2007.04.004

Cacciamani, G., G. BorzoneA. Watson Thermodynamic modelling and assessment of the Au–In–Sn system Calphad Volume 33, Issue 1, March 2009, Pages 100-108 https://doi.org/10.1016/j.calphad.2008.09.018

Colinet, Catherine, Jean-Claude TedenacSuzana G. Fries Structural stability of intermetallic phases in the Sn–Ti system Calphad Volume 33, Issue 1, March 2009, Pages 250-259 https://doi.org/10.1016/j.calphad.2008.08.001

Idbenali, M., C. ServantL. Bouirden A thermodynamic reassessment of the La–Sn system Calphad Volume 33, Issue 2, June 2009, Pages 398-404 https://doi.org/10.1016/j.calphad.2008.12.003

Iddaoudi, A., N. SelhaouiL. Bouirden Thermodynamic assessment of the Sc–Sn system Calphad Volume 41, June 2013, Pages 71-75 https://doi.org/10.1016/j.calphad.2013.01.006

Jiang, M., J. SatoK. Ishida A thermodynamic assessment of the Co–Sn system Calphad Volume 28, Issue 2, June 2004, Pages 213-220 https://doi.org/10.1016/j.calphad.2004.08.001

Khvan, A. V., T. BabkinaI. A. Abrikosov Thermodynamic properties of tin: Part I Experimental investigation, ab-initio modelling of a-, ß-phase and a thermodynamic description for pure metal in solid and liquid state from 0?K Calphad Volume 65, June 2019, Pages 50-72 https://doi.org/10.1016/j.calphad.2019.02.003

Kroupa, A., V. VykoukalM. Šob The theoretical and experimental study of the Sb-Sn nano-alloys Calphad Volume 64, March 2019, Pages 90-96 https://doi.org/10.1016/j.calphad.2018.11.004

Kroupa, Ales, Ratikanta MishraHerbert Ipser Phase equilibria in the ternary Ni–Sb–Sn system: Experiments and calculations Calphad Volume 45, June 2014, Pages 151-166 https://doi.org/10.1016/j.calphad.2013.11.007

Lafaye, Paul, Caroline Toffolon-MascletJean-Marc Joubert Thermodynamic modelling of the Cr-Nb-Sn system Calphad Volume 57, June 2017, Pages 37-45 https://doi.org/10.1016/j.calphad.2017.02.003

Tang, Cai, Biao HuJiong Wang Thermodynamic modeling of the Hf–Sn and Sn–Y systems Calphad Volume 39, December 2012, Pages 91-96 https://doi.org/10.1016/j.calphad.2012.09.003

Wang, S. L., X. H. SuX. J. Liu Thermodynamic optimizations of the Nd-Sn and Sn-Tb systems Calphad Volume 60, March 2018, Pages 214-221 https://doi.org/10.1016/j.calphad.2017.12.009

Yin, Fucheng, Jean-Claude TedenacFranck Gascoin Thermodynamic modelling of the Ti–Sn system and calculation of the Co–Ti–Sn system Calphad Volume 31, Issue 3, September 2007, Pages 370-379 https://doi.org/10.1016/j.calphad.2007.01.003

Zhou, Bi-Cheng, Shun-Li ShangZi-Kui Liu First-principles calculations and thermodynamic modeling of the Sn-Sr and Mg-Sn-Sr systems Calphad Volume 46, September 2014, Pages 237-248 https://doi.org/10.1016/j.calphad.2014.04.003

--------------------------------------------------------
Canadian Aeronautics and Space Journal
{ MST wilson TL501.C2713, OkSU stillwater north_boomer 629.1305C212, OSU sel TL501C3, SIUC storage 51729-6291, UCSD s&e TL1.C212, UM buhr TL501.C23, UOk online, UT hodges TL501.C2713, }
1 item found as of 1/30/2011

--------------------------------------------------------
Canadian Journal of Physics
{ https://cdnsciencepub.com/loi/cjp IU blomington swain QC1.C21 & alf QC1.C21, MST wilson QC1.C3, NWU online & sci 530.5C212, OkSU online, OSU online & sel QC1C16, PU phys 506N213j & hicks 506N213j, SDSU online, SIUC online, SIUE storage, UAr online, UC phys QC1.C3, UCSD online, UIC sci QC1.N3323, UK online & chem/phys QC1.C360, UL kersey QC1.N332, UM online & shapiro QC1.C21, UOk online USC online, UT hodges QC1.C36, }
2 items found as of 1/20/2021
searched for tin whisker(s) & Sn whisker(s) on 9/1/2020
searched for zinc whisker(s) & Zn whisker(s) on 9/1/2020
searched for indium whisker(s) on 9/1/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/1/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/1/2020

--------------------------------------------------------
Capacitor and Resistor Technology Symposium 2004
CARTS
19th Annual Capacitor and Resistor Technology Symposium
24th Annual Capacitor and Resistor Technology Symposium
1996 CARTS Conference
2006 CARTS Conference Proceedings
CARTS 2001 Proceedings
CARTS 2002 Proceedings
CARTS 2007 Symposium Proceedings
1996 Proceedings 16th Capacitor and Resistor Technology Symposium
Proceedings Capacitor and Resistor Technology Symposium
Proceedings of the 15th Capacitor and Resistor Technical Symposium
Proceedings of the Capacitor and Resistor Technical Symposium
{ LH open TK7872.C65C36 & TK7872.C65C37 & TK7872.C85 & 628.1X29, }
>=20 items found as of 11/14/2014 catalog
04,06-07 checked 11/14/2014

Eighth Capacitor and Resistor Technology Symposium, San Diego, CA, Mar. 1988, pp. .

10th Capacitor and Resistor Technology Symposium, San Francisco, Ca, Mar. 28-29, 1990, pp. .

11th Capacitor and Resistor Technology Symposium, Las Vegas, NV, Mar. 4-7, 1991, pp. .

1992 Proceedings 12th Capacitor and Resistor Technology Symposium, Tucson, AZ, Mar. 16-19, 1992, pp. .

Proceedings of the 15th Capacitor and Resistor Technical Symposium, San Diego, CA, Mar. 13-16, 1995, pp. .

1996 Proceedings 16th Capacitor and Resistor Technology Symposium, New Orleans, LA, Mar. 11-15, 1996, pp. .

17th Annual Capacitor and Resistor Technology Symposium, Jupiter, FL, Mar. 24-27, 1997, pp. .

18th Annual Capacitor and Resistor Technology Symposium, Huntington Beach, CA, Mar. 9-13, 1998, pp. .

19th Annual Capacitor and Resistor Technology Symposium, New Orleans, LA, Mar. 1999, pp. .

CARTS, USA 2000 Proceedings, Huntington Beach, CA, Mar. 6-10, 2000, pp. .

CARTS 2001 Proceedings, St. Petersburg, FL, Mar. 26-30, 2001, pp. .

CARTS 2002 Proceedings, New Orleans, LA, Mar. 25-29, 2002, pp. .

23rd Capacitor and Resistor Technology Symposium, Scottsdale, AZ, Mar. 31-Apr. 3, 2003, pp. .

Capacitor and Resistor Technology Symposium 2004, San Antonio, TX, Mar. 29-Apr. 1, 2004, pp. .

2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. .

CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29, 2007, pp. .

Capacitors and Resistors Technology Symposium, Jacksonville, FL, Mar. 28-31, 2011, pp. .

Capacitors and Resistors Technology Symposium 2014, Santa Clara, CA, Apr. 1-3, 2014, pp. .

--------------------------------------------------------
CARE Innovation 2010
1 item found as of 10/22/2015

--------------------------------------------------------
CARTS Asia
CARTS Asia 2006
CARTS Asia 2007
Proceedings CARTS Asia
Proceedings CARTS Asia 2005
>=20 items found as of 11/14/2014 catalog
05-07 checked 11/14/2014

Proceedings CARTS Asia 2005, Taipei, Taiwan, Oct. 11-15, 2005, pp. .

CARTS Asia 2006, Taipei, Taiwan, Oct. 9-11, 2006, pp. .

CARTS Asia 2007 Proceedings, Taipei, Taiwan, Oct. 9-13, 2007, pp. .

--------------------------------------------------------
Capacitor and Resistor Technology Symposium (CARTS) Europe
CARTS Europe 2011
CARTS Europe
CARTS-Europe '99
CARTS-Europe '97 Symposium
CARTS-Europe 2004
Proceedings of CARTS-Europe 2005
CARTS-Europe 2006 Proceedings
CARTS Europe 2007
CARTS Europe 2008
CARTS Europe 2010
Proceedings Carts-Europe xxxx
{ UWa davis TK7872.C85E85x, }
>=20 items found as of 11/14/2014 catalog
04-08,10-11 checked 11/14/2014

CARTS Europe '93, Geneva, Switzerland, Oct. 4-7, 1993, pp. .

Proceedings Nth European Passive Components Symposium, Crowborough, UK, Oct. 17-20, 1994, pp. .

CARTS Europe '95, Amsterdam, Netherlands, 1995, pp. .

CARTS Europe 96, Nice, France, 1996, pp. .

Proceedings of 9th European Passive Components Symposium, Prague, Czech Republic, 1997, pp. .

Proceedings CARTS-Europe '98, Nice, France, Oct. 13-16, 1998, pp. .

CARTS-Europe '99, Lisbon, Portugal, Oct. 18-22, 1999, pp. .

CARTS Europe 2000, Brussels, Belgium, Oct. 16-20, 2000, pp. .

CARTS Europe 2001, Copenhagen, Denmark, Oct. 15-19, 2001, pp. .

Proceedings of the 15th Annual European Passive Components Conference , Oct. 15-19, 2001, pp. .

CARTS Europe 2002, Nice, France, Oct. 15-17, 2002, pp. .

Blum, W., R. kullman, et al "On the Scope of Whisker Risk of Pure Tin Terminated SMD-Resistors", Capacitor and Resistor Technology Symposium (CARTS) Europe, Oct. 15-17, 2002, pp. 234-238.

Blum, W., R. Kullman, et al "On the Scope of Whisker Risk of Pure Tin Terminated SMD-Resistors", Capacitor and Resistor Technology Symposium (CARTS) Europe, October 15-17, 2002, pp. 234-238.

CARTS Europe 2003, Stuttgart, Germany, Oct. 26-29, 2003, pp. .

CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. .

Proceedings of CARTS-Europe 2005, Prague, Czech Republic, Oct. 17-20, 2005, pp. .

CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept. 25-28, 2006, pp. .

CARTS Europe 2007, Barcelona, Spain, Oct. 29-Nov. 1, 2007, pp. .

CARTS Europe 2008 Proceedings, Helsinki, Finland, Oct. 20-23, 2008, pp. .

CARTS Europe 2009, England, Sept. 2009, pp. .

CARTS-Europe 2009 Virtual Conference, Oct. 20-23, 2009, pp. .

CARTS Europe 2010, Munich, Germany, Nov. 10-11, 2010, pp. .

CARTS Europe 2011, Nice, France, Oct. 10-12, 2011, pp. .

--------------------------------------------------------
(new source 11/30/2013)
CARTS International 2013
{ }
>=20 items found as of 11/14/2014 catalog
12-13 checked 11/14/2014

CARTS International 2012, Las Vegas, NV, Mar. 26-27, 2012, pp. .

CARTS International 2013, Houston, TX, Mar. 25-29, 2013, pp. .

CARTS International 2014, Santa Clara, CA, Mar. 31-Apr. 3, 2014, pp. .

--------------------------------------------------------
(new source 12/5/2013)
CARTS USA 2011 Proceedings
CARTS USA 2000 Proceedings
CARTS USA 2003 Proceedings
CARTS USA 2005
CARTS USA 2008 Proceedings
CARTS USA 2009 Proceedings
CARTS USA 2010 Proceedings
{ }
>=20 items found as of 11/14/2014 catalog
05,08-11 checked 11/14/2014

CARTS USA 2000 Proceedings, Huntington Beach, CA, Mar. 6-10, 2000, pp. .

CARTS USA 2003 Proceedings, Scottsdale, AZ, Mar. 31-Apr. 3, 2003, pp. .

CARTS USA 2008 Proceedings, Newport Beach, CA, Mar. 17-20, 2008, pp. .

CARTS USA 2009 Proceedings, Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp. .

CARTS USA 2010 Proceedings, New Orleans, LA, Mar. 15-18, 2010. pp. .

CARTS USA 2011 Proceedings, Jacksonville, FL, Mar. 28-31, 2011, pp. .

--------------------------------------------------------
CENS.com
{ http://cens.com/cens/html/en/index.html }
18 items found as of 1/30/2011
checked 11/20/2010

--------------------------------------------------------
(new source 7/7/2020)
Ceramics International
{ https://www.sciencedirect.com/journal/ceramics-international/issues UK online, }
1 item found as of 1/20/2021
--------------------------------------------------------
Chemical & Engineering News
Chemical and Engineering News
{ https://cen.acs.org/magazine/all-issue.html MST wilson TP1.C35, OkSU stillwater 660.5C5172, OSU sel TP1J862, SDSU online, SIUC online, SIUE online, UAr online, UC online & chem TP1.I63, UCSD s&e QD1.C517, UE, UK online & chem/phys TP1.C35, UL online & kersey TP1.C35, UOk online, USD online, }
3 items found as of 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 12/18/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/18/2020
searched for indium whisker(s) on 12/18/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/18/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/18/2020

(new reference 12/18/2020)
New Mechanism Used to Grow Crystals ," Chemical & Engineering News, vol. 42 no. 11, pp. 48-49, Mar. 16, 1964. DOI: 10.1021/cen-v042n011.p048

Metal Wishers ," Chemical & Engineering News, vol. 33 no. 47, pp. 5026-5027, Nov. 21, 1955. DOI: 10.1021/cen-v033n047.p5026a

Testing Iron Whiskers ," Chemical & Engineering News, vol. 35 no. 2, pp. 22-24, Jan. 14, 1957. DOI: 10.1021/cen-v035n002.p022a

Whiskers on a Large Scale ," Chemical & Engineering News, vol. 33 no. 25, pp. 2610, June 20, 1955. DOI: 10.1021/cen-v033n025.p2610

STOPPING THE TIN WHISKER STALKERS ," Chemical & Engineering News, vol. 85 no. 29, pp. 30-33, July 16, 2007. DOI: 10.1021/cen-v085n029.p030

"Metals Grow Whiskers," Chemical & Engineering News, vol. 33 no. 9, pp. 857, Feb. 28, 1955. https://doi-org.ezproxy.uky.edu/10.1021/cen-v033n009.p857

--------------------------------------------------------
Chemical Engineer
Chemical Engineer (London)
{ MST online, OCU beam, OkSU stillwater 660.5C51728, OSU sel & compact TP1I592, PU hicks 540.5C383, SDSU online, SIUC morris 51393-6611, UAr online, UC eng TP1.I7, UCSD online, UK eng TP1.C445, UL kersey TP1.C524, UOk eng TP1.C322, USD online, UT online & hodges TP1.C356, }
1 item found as of 1/30/2011

--------------------------------------------------------
Chemical Market Reporter
{ MST online, OkSU stillwater 660.5O391, OSU online & sel HD9650.1C486, SDSU online, SIUC online, SIUE microfiche, UAr online, UC eng TP1.O4, UCSD online, UK online, UL kersey TP1.O4, UOk online, USD online, UT online & hodges TP1.O4, }
3 items found as of 1/20/2021

--------------------------------------------------------
(new source 10/15/2020)
Chemical Physics Letters
{ https://www.sciencedirect.com/journal/chemical-physics-letters/issues UK online, }
1 item found as of 1/20/2021

--------------------------------------------------------
Chemical Processing
{ http://www.chemicalprocessing.com/ AU online, FSU online, LH closed, NWU sci L660.5C5178, OkSU online, OrSU valley TD1.C5006, OSU sel TP1.C48 & compact TP1.P739, PU eng 660.5C4193 & hicks 660.5C4193, SDSU online, SIUC online, SU online, UC sw depos TP1.C35, UCF main TP1.B693, UCSD s&e QD1.C5248, UDe online, UF sci TP1.P684, UMC online, USF online, UTA chem TP1C367, UTo online, }
10 items found as of 1/30/2011
May02-Nov10 checked 11/20/2010

--------------------------------------------------------
Chemisch Weekblad
{ NWU sci L540.5C5175, OSU depos QD1C6, PU hicks 540.5C42, UC sw depos QD1.C68, UIC warehouse QD1.C6885, UK King QD1.C6885, UM buhr QD1.M188, UOk hist_of_sci, }
6 items found as of 1/30/2011

--------------------------------------------------------
Chemistry of Materials
{ https://pubs.acs.org/loi/cmatex AU online, CSULB online, FSU online, GIT online, LH closed, NWU sci L660.205C5172, OGI sci, OkSU online, OrSU valley QD1.C73931, OSU online, PU online, RU online, SDSU online, SPU online, SU online, TTU online, UAB online, UAr online, UC online, UCF online, UCI online, UCSD online, UD online, UDe online, UF online, UIC online, UIUC online, UK online & chem/phys QD1.C7448, UL robotic, UM online, UMC online, USC grand, USD online, USF online, USU online, UTA online, UTo online, WrSU online, }
>=20 items found as of 8/8/2021
v7#5,v12#1-v33#14(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 7/17/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/7/2020
searched for indium whisker(s) on 8/7/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/7/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight on 8/7/2020

searched for gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 10/9/2020

-------------------------------------------------------
Chemosphere
{ https://www.sciencedirect.com/journal/chemosphere/issues AU online, BYU hbll QH540.C48, FSU online, GIT online, IU online, LH closed, MST wilson QH540.C48, NWU online, OGI online, OkSU stillwater 628.505C5175, OrSU valley QH540.C48, OSU online, PU online, RU online, SDSU online, SIUC online, UAB sterne QH540.C48, UAr online, UC online, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UIUC online, UK online, UM online sd & shapiro QH540.C51, UMC online, UNF online, UOk online, USD online, USF online, USU online, UT online, UTA online, UTo online, WrSU online, }
1 item found as of 1/20/2021

--------------------------------------------------------
China International Conference on Electricity Distribution
CICED
{ IEEE XPLORE (08,10,12,14,16,18), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
08,10,12,14,16,18 checked 8/3/2021

--------------------------------------------------------
2011 China-Japan Joint Microwave Conference Proceedings
{ IEEE XPLORE (08,11), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
08,11 checked 8/3/2021

--------------------------------------------------------
China Welding (English Edition)
{ http://www.chinaweldingjournal.com/AllIssueEn.htm LH closed, UTo online, }
1 item found as of 3/14/2021 catalog
v26#4-v29#3(20) checked 3/14/2021
(new reference 12/30/2008)
Zhang, Liang, Xue, Songbai, Lu, Fangyan, Han, Zongjie, Wang, Jianxin .Numerical simulation of soldered joints and reliability analysis of PLCC components with J-shape leads China Welding (English Edition), v 17, n 2, June, 2008, p 37-41

-------------------------------------------------------
Chinese Journal of Materials Research
Cailiao Yanjiu Xuebao
{ https://www.cjmr.org/EN/article/showOldVolumnList.do LH closed, UTo online, }
item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Zhang, Xinping, Yin, Limeng, Yu, Chuanbao .Advances in research and application of lead-free solders for electronic and photonic packaging Cailiao Yanjiu Xuebao/Chinese Journal of Materials Research, v 22, n 1, February, 2008, p 1-9 Language: Chinese

-------------------------------------------------------
Chinese Journal of Nonferrous Metals
Zhongguo Youse Jinshu Xuebao
{ http://cjonm.csu.edu.cn/openAccess.aspx LH closed, }
13 items found as of 11/5/2020 catalog

--------------------------------------------------------
Chinese Journal of Semiconductors
Ban dao ti xue bao
Pan Tao Ti Hsueh Pao
{ https://caod.oriprobe.com/journals/bdtxb/Chinese_Journal_of_Semiconductors.htm LH closed, UTD online, }
2 items found as of 1/30/2011

--------------------------------------------------------
Chinese Physics Letters
Zhongguo wu li kuai bao
{ https://iopscience.iop.org/journal/0256-307X CSULB online, OSU online, UC online, UD online, UK online & remote QC1.C5235, UL online, UM online, USC grand, VU online, }
3 items found as of 1/20/2021
v2#7 checked 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 12/18/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/18/2020
searched for indium whisker(s) on 12/18/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/18/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/18/2020

--------------------------------------------------------
Chinese University of Hong Kong Technical Conference

items found as of 1/30/2011 catalog

Shih, Richard L. H., Metallurgy and stability of the pure Sn/Ni and Sn/Cu interface for lead-free flip chip application, The Chinese University of Hong Kong Technical Conference Taipei, Taiwan Dec. 2002 pag 77

--------------------------------------------------------
1998 Chip Scale Packaging Proceedings
{ http://www.smta.org/knowledge/proceedings.cfm, }
items found as of 11/26/2020 catalog
98 checked 11/26/2020

--------------------------------------------------------
Chip Scale Review
{ http://www.chipscalereview.com/ MST online, }
>=20 items found as of 8/11/2021
mar98-sep07,apr08-may08,jul08-(v13#3)may09,aug09-nov09,jan10-aug21 checked 8/11/2021

--------------------------------------------------------
CIGRE Symposium Power System Electromagnetic Compatibility

{ }
(new reference 12/23/2013)
Pommerenke 1993

--------------------------------------------------------
Circuit Cellar
{ http://www.circuitcellar.com/ MST wilson QA76.76.A65C55, }
1 item found as of 4/7/2014
#174-#242,245-278 checked 4/7/2014

--------------------------------------------------------
Circuit World
{ https://www.emerald.com/insight/publication/issn/0305-6120 CSULB online, ISU parks TK7867.A8, LH closed, MST online, MSU online, NWU online, OkSU online, OSU online, SDSU online, UAr online, UC online, UCB online, UCI online & sci TK7867C573, UH online, UK online, UL online, UM online, UOk online, USC TK7800C57, USD online, UT online, UTo online, WSU online, }
>=20 items found as of 8/8/2021
v1#1-v47#2(21) all issues checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 7/17/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/7/2020
searched for indium whisker(s) on 8/7/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/7/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/2/2020

," Circuit World, vol. no. , pp. , .

--------------------------------------------------------
Circuitnet
{ http://www.circuitnet.com/cgi-bin/news/search.cgi?action=search&page=1&perpage=15&template=articleLists/index_newsletter_archive_cn.html&categoryNums=180&includeSubcats=0 }
>=20 items found as of 1/30/2011
checked 4/6/2009

--------------------------------------------------------
Circuitree
Circuitree Magazine
{ AU online, CSULB online, GIT online, KSU online, KU online, LH closed, MIT online, MST online, MSU online, NEU online, SDSU online, SMU online, UCB online, UCF online, UF online, UNF online, UOk online, UPi online, USC, UT online, UTAr online, UTD online, UTor online, WSU online, }
>=20 items found as of 8/2/2021 catalog
v13#3-v24#3(ended publication) checked 8/2/2021

Handwerker, C. A. (METALLURGY DIVISION - 855) Lead-Free Solders: A Change in the Electronics Infrastructure Circuitree - Sept. 1, 1999

Zhang, Y., Circuitree, vol. 12, no. 11, pp. 10-22, Nov. 1999.

Zhang, Y., "Can Electroplated Pure Tin Be Utilized as a Final Surface Finish for PWBs?", Circuitree, vol. 12, no. 11, pp. 10-22, November 1999.

--------------------------------------------------------
Circuits Assembly
{ http://circuitsassembly.com/ CSULA online, CSULB online, FIT online, Lexmark, OkSU online, OSU online, SDSU online, SIUC online, SMU online, UAr online, UCI online, UCSD online, UK online, UMi online, UOk online, USC TK7868.P7C543, USD online, UT online, UTAr online, UTD online, UTo online, WSU online, }
>=20 items found as of 8/2/2021
v1#1-v3#7,v3#9,v3#12-v5#2,v9#1-v20#11(ended publication) checked 8/2/2021
searched for tin whisker(s) and Sn whisker(s) on 1/23/2021
searched for zinc whisker(s) & Zn whisker(s) on 1/23/2021
searched for indium whisker(s) on 1/23/2021
searched for cadmium whisker(s) & Cd whisker(s) on 1/23/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 1/23/2021

(new reference 2/16/2021)
Richard Stadem in Feb. 2010

--------------------------------------------------------
Circuits Manufacturing
{ AU rbd TK7868.P7C543, ISU parks TK7869.C57x, Lexmark, LH closed, NEU snell T1.C4210, PU hicks 621.381505C496, }
1 item found as of 1/30/2011

--------------------------------------------------------
Citizen Scientist News
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Clean Technologies and Environmental Policy
Clean Products and Processes
{ https://link.springer.com/journal/10098/volumes-and-issues AU online, GIT online, MST online, NWU online, OGI online, OrSU online, OSU online, PU online, SDSU online, SIUC online, SU online, UAr online, UC online, UCI online, UCSD online, UDe online, UF online, UK online, UMC online, UNF online, USD online, USF online, UOk online, UT online, UTA online, UTo online, WrSU online, }
7 items found as of 8/9/2021
v1#2-v23#6(21) checked 8/9/2021

-----------------------------------------------------
Collection of Technical Papers - Nth AIAA Aerospace Sciences Meeting
{ UTA online, UTor aero TA630.S76, UWa davis TL671.2.A369, }
item found as of 1/30/2011 catalog

Corbitt, N., Ngo, C. C., and Lai, F. C., "Effects of thermal and vibrational cycles on stresses in lead-free solder joints," Collection of Technical Papers - 45th AIAA Aerospace Sciences Meeting, vol. 11, pp. 7526-7533, 2007.

--------------------------------------------------------
Collection of Technical Papers - AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference
{ AU rbd TA645.A3, FAU wimberly TA645.A25, GIT main-5e TA645.A3 &main-6e TL875.A111, LH open, MoSU documents, MST various, OSU sel TA645.A19, PU eng 620.106St89, SIUC morris 629.1A288c, SMU sci TA645.A3, UAr online, UC eng TA645.A2, UF sci TL671.2.A369, UIUC eng 629.1Ai12c, UM online, UOk eng TA645.A512, UTAr sel TA401.A52, }
item found as of 6/11/2015 catalog
74,77,85 checked 6/11/2015

(new reference 12/30/2008)
Qian, H., Sun, C.T. .Effect of bondline thickness on mode I fracture in adhesive joints Collection of Technical Papers - AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, 49th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference, 2008, p 2008-1845

--------------------------------------------------------
Commercial Wireless Systems
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Communication Systems Design
{ OSU online, UD online, UK online, UM online, VU online, }
2 items found as of 1/20/2021

--------------------------------------------------------
(new source 6/22/2020)
28th Compatibility, Aging & Stockpile Stewardship Conference
{ }
1 item found as of 6/22/2020

--------------------------------------------------------
Compliance Engineering
Compliance Engineering 2000 Annual Reference Guide
{ http://www.ce-mag.com/ Lexmark TH7800.C65, OkSU online, PU eng 343.7309945C738, SDSU online, }
>=20 items found as of 1/30/2011

--------------------------------------------------------
Components in Electronics
>=20 items found as of 12/5/2014
May04-Apr09,Dec11-Feb12,Feb14 checked 12/5/2014

--------------------------------------------------------
Components, Packaging, and Manufacturing Technology Society Newsletter
{ }
2 items found as of 1/3/2013
v34#1,v35#1-v35#2 checked 1/3/2013

--------------------------------------------------------
Composites Part A: Applied Science and Manufacturing
{ https://www.sciencedirect.com/journal/composites-part-a-applied-science-and-manufacturing/issues MST online, NWU online & sci L620.11805C737a, OSU online & sel TA418.9C6C628, PU online & eng 620.1105C738, SDSU online, SIUC online, UAr mullins per-microfiche, UC online & eng TA418.9.C6C62, UCSD online, UIC online & daley TA418.9.C6C63, UM online sd, UOk online, UT online & hodges TA418.9.C6C65, }
1 item found as of 1/30/2011

--------------------------------------------------------
Comptes Rendus Hebdomadaires des S‚ances de l'Acad‚mie des Sciences
{ AU rbd closed Q46.A14, GIT storage Q46.A14, MST depos 505C73, NWU sci 506P23, OkSU stillwater 506A167c, OSU depos Q46P23, PU math 506Ac1ab & hicks 506Ac1ab, SDSU online, SIUC online, SIUE storage, UAr storage Q2.A24, UC chem (Oesper Rm) Q46.A143, UCI sci microform S-000210, UCSD s&e Q1.A1683, UIC various, UK chem/phys Q46.A14 & king Q2.A25, UL kersey Q46.A142 & Q46.A14, UM hatcher Q46.A14C7 & buhr Q46.A14C7, UOk bizell Q2.A26, UT hodges Q46.A14Ser.2, WSU storage & sci, }
item found as of 1/30/2011

Compt. rend. 47, 106, Nov. 1868. *** not applicable ***

--------------------------------------------------------
Computational Materials Science
{ https://www.sciencedirect.com/journal/computational-materials-science/issues AU online, CSULB online, FAU online, FIT online, FSU online, GIT online, LH closed, MST online, NWU online, OkSU online, OrSU valley TA403.6.C67, OSU online, PU online, RU online, SDSU online, SMU online, UAB sterne TA401.C656, UAr online, UC online, UCSD s&e TA1.C64245, UK online (pay), UM online, UMC online, UMi online, UNCC online, UNF online, UOk online, UPi online, USC TA401.C656, USF online, USU online, UT online, UTA online, UTAr online, UTD online, UTo online, UTor online, UWa online, WrSU online, }
>=20 items found as of 8/8/2021 catalog
v17#1(00)-v197(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 12/3/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/3/2020
searched for indium whisker(s) on 12/3/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/3/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/3/2020

(new reference 12/3/2020)
Béjaud, R., J. DurinckS. Brochard The effect of surface step and twin boundary on deformation twinning in nanoscale metallic systems Computational Materials Science Volume 145, 1 April 2018, Pages 116-12 https://doi.org/10.1016/j.commatsci.2017.12.035

Bolshakova, I., T. MoskovetsA. Klimenko Modeling of InSb and InAs whiskers growth Computational Materials Science Volume 10, Issues 1–4, February 1998, Pages 38-41 https://doi.org/10.1016/S0927-0256(97)00184-5

Cern, Miroslav, ýPetr ŠestákJaroslav Pokluda Influence of superimposed normal stress on shear strength of perfect bcc crystals Computational Materials Science Volume 47, Issue 4, February 2010, Pages 907-910 https://doi.org/10.1016/j.commatsci.2009.11.022

Cern, Miroslav, ýPetr ŠestákJaroslav Pokluda Strength of bcc crystals under combined shear and axial loading from first principles Computational Materials Science Volume 55, April 2012, Pages 337-343 https://doi.org/10.1016/j.commatsci.2011.11.009

chibisovaa, m. a., n. chibisovn. f. karpovich effect of bond population on the elasticity of tungsten nanowires: ab initio calculation computational materials science volume 114, march 2016, pages 99-101 https://doi.org/10.1016/j.commatsci.2015.12.013

Lu, Feng, Liangying WenShengfu Zhang Numerical simulation of iron whisker growth with changing oxygen content in iron oxide using phase-field method Computational Materials Science Volume 125, December 2016, Pages 263-270 https://doi.org/10.1016/j.commatsci.2016.09.003
Nath, S. K. Deb, x Elastic, elastic–plastic properties of Ag, Cu and Ni nanowires by the bending test using molecular dynamics simulations Computational Materials Science Volume 87, May 2014, Pages 138-144 https://doi.org/10.1016/j.commatsci.2014.02.013

Yang, Yang, Suzhi LiJun Sun Pseudoelasticity in twinned a-Fe nanowires under bending Computational Materials ScienceAvailable online 16 November 2020... https://doi.org/10.1016/j.commatsci.2020.110128

Zhang, Jian-Min, Yan YangVincent Ji Theoretical strength and structural response of Cu crystal Computational Materials Science Volume 43, Issue 4, October 2008, Pages 917-923 https://doi.org/10.1016/j.commatsci.2008.02.004

--------------------------------------------------------
Computational Mechanics
{ https://link.springer.com/journal/466/volumes-and-issues UK online, }
1 item found as of 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

--------------------------------------------------------
Computer
{ IEEE XPLORE (v3#5-), UK online & eng TK7885.A1I5, (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/4/2021
v3#5-v54#8(21) checked 8/4/2021

--------------------------------------------------------
Computer Design
{ OSU sel TK7888.3.A1C6, UC langsam microfilm 5592, UD roesch, UM online, UT hodges TK7888.3.C65, VU online, }
4 items found as of 1/30/2011

--------------------------------------------------------
Computer/Electronic Service News
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Computer Journal
{ http://comjnl.oxfordjournals.org/content/by/year, OSU online, UC online, UK online & eng QA76.C57, UL online, UM online, UT online, VU online, }
1 item found as of 1/20/2021

--------------------------------------------------------
Computer Law & Security Review
Computer Law and Security Report
Computer Law & Security Report
{ https://www.sciencedirect.com/journal/computer-law-and-security-review/issues FAU online, FIU online, NWU online, OkSU online, OSU online, SDSU online, SMU online, UC online, UCSD online, UIC online, UK online, UM online, UMi online, UOk online, UT online, UTAr online, UTD online, UTo online, WSU online, }
2 items found as of 1/20/2021 catalog
--------------------------------------------------------
Computerworld
{ UC cler periodicals & langsam microforms, UD online & roesch, UK online & young oversize QA76.C5816, UL online, UM online, UT online, VU online, }
12 items found as of 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 8/8/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/8/2020
searched for indium whisker(s) on 8/8/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/8/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight on 8/8/2020
searched for gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 10/10/2020

--------------------------------------------------------
Computers, Materials and Continua
{ UCI online, }
1 item found as of 1/30/2011 catalog
v1#1-v4#1 all issues checked 1/31/2011

--------------------------------------------------------
(new source 7/15/2020)
2015 Components for Military and Space Electronics Conference and Exhibition
{ }
1 item found as of 7/15/2020

-------------------------------------------------------
Conference Proceedings 34th European Microwave Conference
2005 European Microwave Conference
Proceedings of the Nth European Microwave Conference
EuMC
{ IEEE XPLORE (69-), GIT main TK7876.E87, UCF main TK7876.E87, UCI sci TK7876.E87, UK online, UM online, UT hodges TK7876.E87, UTo depos TK7876.E87 (many other universities also subscribe to IEEE XPLORE), }
3 items found as of 8/3/2021
69-20 all issues checked 8/3/2021

--------------------------------------------------------
Conference Record - IEEE Instrumentation and Measurement Technology Conference
2010 IEEE Instrumentation and Measurement Technology Conference
2010 IEEE Instrumentation & Measurement Technology Conference Proceedings
IEEE Instrumentation and Measurement Technology Conference
Instrumentation and Measurement Technology Conference Proceedings
Proceedings of the 18th IEEE Instrumentation and Measurement Technology Conference
Proceedings of the IEEE Instrumentation and Measurement Technology Conference I2MTC
IMTC

{ IEEE XPLORE (88-), UK online, UM online? (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
88-21 checked 8/3/2021

--------------------------------------------------------
Conference Record of the Thirty-first IEEE Photovoltaic Specialists Conference
IEEE Conference Record of the Twenty-Ninth Photovoltaic Specialists Conference
PVSC
{ IEEE XPLORE (88,90-91,93,96-97,00,02,05,08-), (many other universities also subscribe to IEEE XPLORE), }
18 items found as of 8/3/2021
88,90-91,93,96-97,00,02,05,08-20 checked 8/3/2021

--------------------------------------------------------
Conference Record of the 2006 IEEE 4th World Conference on Photovoltaic Energy Conversion
{ IEEE XPLORE (94,03,06), UK online, UM online? (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
94,03,06 checked 8/3/2021

--------------------------------------------------------
Conference Record of the 1991 International Display Research Conference
{ IEEE XPLORE (82,85,88,91), NWU online, PU hicks 621.38In7, UC eng microfiche 6491CM3071-8, UH TK7882.I6I168 & TK5103.5D5, UK online, UM online, (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
82,85,88,91 checked 8/3/2021

--------------------------------------------------------
2001 Conference Record of Pulp and Paper Industry Technical Conference
Conference Record of 1990 Annual Pulp and Paper Industry Technical Conference
{ IEEE XPLORE (88-), (many other universities also subscribe to IEEE XPLORE), }
4 items found as of 8/3/2021
88-19 checked 8/3/2021

--------------------------------------------------------
Conformity 2002
Conformity
>=20 items found as of 8/2/2021
v10#1-v13#4,v13#6-v14#2,v14#4(ended publication) checked 8/2/2021

--------------------------------------------------------
Connect
{ NWU online, SDSU online, SIUC online, UIC online, UT online, }
12 items found as of 11/14/2014
Mar98-#168(Oct10) checked 11/14/2014

--------------------------------------------------------
Connector Specifier
{ https://www.connectorsupplier.com/archive-connector-specifier/ EBSCOB, NWU online, OkSU online, OSU online, SDSU online, SIUC online, UAr online, UCSD online, UK online, USD online, UT online, }
>=20 items found as of 8/6/2021
v16#1-v25#5(09) checked 8/6/2021
searched for tin whisker(s) and Sn whisker(s) on 7/19/2020

searched for zinc whisker(s) and Zn whisker(s) on 9/12/2020
searched for indium whisker(s) on 9/12/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/12/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/12/2020 --------------------------------------------------------
Control
{ http://www.controlglobal.com/issues/index.html, AU rbd TJ212.C59, LH closed, NWU sci L629.8305C764, OkSU stillwater 670.4205C764, OrSU valley TK7880.C6, OSU depos TJ212.C595, PU hicks 629.805C768, RU fondren TK7882.C6C65, SIUC online, UIC warehouse TJ212.C59, UIUC eng 629.805CO, UM online & buhr TJ212.C76, USF online, WrSU swdepos TJ212.C59, }
1 item found as of 6/17/2020
Jan07-feb16 checked 6/17/2020

--------------------------------------------------------
Control Engineering
{ http://www.controleng.com/ AU online, CBU, FSU online, GIT online, LH closed, MST wilson TJ212.C6, NWU sci L629.8905C764, OGI online, OkSU stillwater 621.805C764, OrSU valley TJ212.C6, OSU online, PU eng 621.805C76 & hicks 621.805C76, RU fondren TJ212.C6, SDSU online, SIUC online, SU online, TTU TJ212.C6, UAB sterne TJ212.C6, UAr online, UC online, UCF online, UCI sci drum TJ212.C6, UCSD online, UD online, UDE online, UF online, UIC online, UIUC online, UK online & eng TJ212.C6, UM online, UNF online, USD online, USF online, USU online, UTA online, UTo online, WrSU online, }
4 items found as of 1/20/2021

--------------------------------------------------------
Corporate Environmental Strategy
{ CSULB online, OSU online & faes HD30.255.C67, SDSU online, TU online, UC online, UCB online, UCSD online, UF online, USF online, UT online & hodges HD30.255.E67, UTA online, UTAr online, UTD online, UTo online, WSU online, }
item found as of 8/4/2013 catalog
v5#1-v9#4 checked 8/4/2013

Veleva, Vesela, and Sethi, Suresh, "The Electronics Industry in a New Regulatory Climate: Protecting the Environment and Shareholder Value," Corporate Environmental Strategy , vol. 11 no. 9, pp. 2-207-2-224, Oct. 2004.

--------------------------------------------------------
Corrosion
{ https://corrosionjournal.org/loi/corr FAU online, MST online, OSU TA462C75, SIUC online, UC eng TA462.C65, UCSD online, UK online & eng TA462.C65, UL kersey TA462.C65, UT online, }
1 item found as of 1/20/2021
v7#10
searched for tin whisker(s) and Sn whisker(s) on 7/18/2020

searched for zinc whisker(s) and Zn whisker(s) on 9/12/2020
searched for indium whisker(s) on 9/12/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/12/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/12/2020 --------------------------------------------------------
Corrosion Reviews
Reviews of Coatings & Corrosion
{ https://www.degruyter.com/view/journals/corrrev/corrrev-overview.xml?language=en&tab_body=toc-78025 GIT main-5e TA418.76.R48, LH closed, MST wilson TA418.76.R48, TTU, UIUC eng 620.112205RE1, USF tampa TA418.76.R48, UT hodges TA418.76.R48, }
4 items found as of 1/30/2011
v3#1-v26#6 checked 8/14/2009

--------------------------------------------------------
Corrosion Science
{ https://www.sciencedirect.com/journal/corrosion-science/issues MST wilson TA462.C67, OkSU online, OSU online & sel TA462C83, SDSU online, SIUC online, UAr mullins TA462.C659, UC online & eng TA462.C678, UCSD online, UD online, UK online sd (pay) & eng TA462.C659, UL online & kersey TA462.C659, UM online sd, UT online, UTo online & carlson, WSU online, }
>=20 items found as of 8/8/2021
v42#1(2000)-v189(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 12/3/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/3/2020
searched for indium whisker(s) on 12/3/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/3/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/3/2020

(new reference 2/20/2021)
Study on corrosion behavior of ß-Sn and intermetallic compounds phases in SAC305 alloy by in-situ EC-AFM and first-principles calculation Pan Yi, Chaofang Dong, Kui Xiao, Xiaogang Li Article 109244 corrosion science vol. 181 Apr. 1, 2021 https://doi.org/10.1016/j.corsci.2021.109244

illés, balázs, tamás hurtonybálint medgyes effect of current load on corrosion induced tin whisker growth from snagcu solder alloys corrosion science volume 99, october 2015, pages 313-319 https://doi.org/10.1016/j.corsci.2015.07.026

kim, sang hoon, kwun nam huisangsun yang oxidation resistant effects of ag2s in sn–ag–al solder: a mechanism for higher electrical conductivity and less whisker growth corrosion science volume 105, april 2016, pages 25-35 https://doi.org/10.1016/j.corsci.2015.12.021

Cheng, Cong Qian, Fen YangXiao Gang Li Leaching of heavy metal elements in solder alloys Corrosion Science Volume 53, Issue 5, May 2011, Pages 1738-1747 https://doi.org/10.1016/j.corsci.2011.01.049

--------------------------------------------------------
COTS Journal
{ https://issuu.com/rtcgroup/stacks/d3742839e19a4010b6937a9b51b8ef2d http://www.cotsjournalonline.com/index.php/issues/ http://news.rtc-media.com/display.php?M=1675934&C=3d36ce40a59d8ae0f56b867e08af5bfd&S=374&L=186&N=344 CSULB online, GIT online, UD online, UF online, UPi online, USC HD9744.E43C687, }
7 items found as of 5/14/2015 catalog
Oct03-Apr15 checked 5/14/2015

--------------------------------------------------------
CPMT Society Outlook
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Critical Reviews in Solid State Sciences
C R C Critical Reviews in Solid State Sciences
{ https://www.tandfonline.com/loi/bsms19 OSU sel QC176.A1C4V6, UC phys QC176.A1C453, UK sci QC176.A1C453, UL robotics QC176.A1C453, UM online, VU sci QC176.A1C453, }
1 item found as of 11/29/2020
searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

--------------------------------------------------------
(new source 9/2/2020)
Crystal Growth & Design
{ https://pubs.acs.org/loi/cgdefu UK online, }
1 item found as of 1/20/2021
searched for tin whisker(s) & Sn whisker(s) on 10/10/2020
searched for zinc whisker(s) & Zn whisker(s) on 10/10/2020
searched for indium whisker(s) on 10/10/2020
searched for cadmium whisker(s) & Cd whisker(s) on 10/10/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/2/2020

--------------------------------------------------------
Crystal Research and Technology
Kristall und Technik
{ https://onlinelibrary.wiley.com/loi/15214079 OSU online, UC online, UD online, UK online, UM online, UT online, VU online, }
7 items found as of 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 12/18/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/18/2020
searched for indium whisker(s) on 12/18/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/18/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/18/2020

--------------------------------------------------------
Crystallography Reports
Kristallografiia
{ https://link.springer.com/journal/11445/volumes-and-issues CSULA online, CSULB online, OSU geo QD901.K719, UC online, UD online, UK online & storage QD901.K7135, UL online, UM online, USC grand, UT online, VU sci QD901.K7135, }
1 item found as of 1/20/2021

searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

(new reference 6/22/2020)
V. K. Galuzunova. A study of the influence of certain factors on the growth of filamentary tin crystals. Kristallografiya, 7:761-768, 1954.

(not at UK) --------------------------------------------------------
CTMA Symposium: Lead-Free Solder
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Current Opinion in Solid State and Materials Science
{ https://www.sciencedirect.com/journal/current-opinion-in-solid-state-and-materials-science/issues OSU online, UK online, UM online, }
2 items found as of 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 12/3/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/3/2020
searched for indium whisker(s) on 12/3/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/3/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/3/2020

(new reference 12/3/2020)
Wright, Jonathan, Carlotta GiacobbeMarta Majkut New opportunities at the Materials Science Beamline at ESRF to exploit high energy nano-focus X-ray beams ," Current Opinion in Solid State and Materials Science, vol. Volume 24, Issue 2, April 2020, 100818 https://doi.org/10.1016/j.cossms.2020.100818

(not at UK) --------------------------------------------------------
Czechoslovak Journal of Physics
{ https://link.springer.com/journal/10582/volumes-and-issues OSU online, UC online, UD online, UK online, UM online, VU online, }
2 items found as of 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

DDDD--------------------------------------------------------
Data Center Journal
{http://www.datacenterjournal.com/, }
item found as of 1/20/2016
dec15 checked 1/20/2016

--------------------------------------------------------
DATA Storage
{ UM online, VU online, }
2 items found as of 1/30/2011

--------------------------------------------------------
Dataweek
{ http://dataweek.co.za/archives.aspx, }
>=20 items found as of 7/3/2020 catalog
Jul4,01-Jun30,2020 checked 7/3/2020

--------------------------------------------------------
Dayton Daily News
{ http://www.daytondailynews.com/c/content/oh/index/services/archives/faq_content.html, OSU online, UD online, UK online, UM online, VU online, }
1 item found as of 1/20/2021

--------------------------------------------------------
De Ingenieur
{ IS parks TA4.In4, UT hodges closed TA4.I4, }
1 item found as of 1/30/2011

--------------------------------------------------------
Defect and Diffusion Forum
{ https://www.scientific.net/DDF OSU sel QD543.A1D523, UC online, UM online, UT hodges QD543.D49, VU annex QD543.D49, }
17 items found as of 1/20/2021
v83,v216-v217 checked 1/20/2021

searched for tin whisker(s) and Sn whisker(s) on 10/12/2020

searched for zinc whisker(s) and Zn whisker(s) on 10/12/2020
searched for indium whisker(s) on 10/12/2020
searched for cadmium whisker(s) and Cd whisker(s) on 10/12/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 10/12/2020 searched for nanowire(s), mesowire(s), microwire(s) on 10/12/2020 --------------------------------------------------------
Defense Electronics
{ http://rfdesign.com/, UOk online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Defense Manufacturers Conference
{ }
item found as of 11/12/2014

(new reference 11/12/2014)
S. Meschter, P. Snugovsky, J. Kennedy, Z. Bagheri, S. Kosiba SERDP Tin Whisker Testing and Modeling: High Temperature/High Humidity (HTHH) Conditions, Defense Manufacturers Conference (DMC) December 2-5, 2013 Orlando, Florida

--------------------------------------------------------
(new source 6/22/2020)
Defense Manufacturing Conference
{ }
1 item found as of 6/22/2020

--------------------------------------------------------
(new source 6/22/2020)
Defense Semiconductor Association Meeting
{ }
1 item found as of 6/22/2020

--------------------------------------------------------
Defense Tech Briefs
2 items found as of 12/5/2014
v2#3-v2#6,v4#2-v7#1 checked 12/5/2014

--------------------------------------------------------
(new source 10/15/2020)
Desalination
{ https://www.sciencedirect.com/journal/desalination/issues UK online, }
1 item found as of 1/20/2021

--------------------------------------------------------
Design & Reliability of Solders and Solder Interconnections
{ CMU eng TK7870.15.D37, USC TS610.D47, }
11 items found as of 8/6/2012 catalog

--------------------------------------------------------
Design Automation Conference
2010 47th ACM/IEEE Design Automation Conference
44th ACM/IEEE Design Automation Conference
39th Design Automation Conference
Proceedings 2000 37th Design Automation Conference
Proceedings 1998 Design Automation Conference
Proceedings of the Nth Design Automation Conference
DAC
{ IEEE XPLORE (78-), (many other universities also subscribe to IEEE XPLORE), }
7 items found as of 8/3/2021
78-20 checked 8/3/2021

----------------------------------------------------
Design For Reliability Seminar/Exhibition
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Design News
{ CMU eng, OkSU stillwater 620.004205D457, SDSU online, SIUC morris 52092-6201, UAr online, UCSD online, UOk online, UPi online, USD online, }
>=20 items found as of 4/8/2014 catalog
v60#1-v67#3,v67#5-v67#12,v68#2-v68#10,v68#12 checked 4/8/2014

--------------------------------------------------------
Design World
{ AU ladc NK1490.D47, FSU strozier 740.5D4577, OkSU main 745.405D457, UM aael NK1490.D46, }
4 items found as of 4/6/2014 catalog
v3#7-v3#12,v4#4-v5#7,v5#9-v6#7,v6#9-v9#3 checked 4/6/2014

--------------------------------------------------------
DesignCon 2009
DesignCon East 2005
DesignCon99
>=20 items found as of 1/30/2011 catalog
99-00 checked 3/19/2008

"," Designcon 1997 "," DesignCon 1998 "," DesignCon 2001, Santa Clara, CA, Jan. 29-Feb. 1, 2001, pp. .

"," DesignCon 2002, Santa Clara, CA, Jan. 28-31, 2002, pp. .

"," DesignCon 2003, Santa Clara, CA, Jan. 27-30, 2003, pp. .

"," DesignCon East 2003, Boston, MA, June 23, 2003, pp. .

"," DesignCon 2004, Santa Clara, CA, Feb. 2-5, 2004, pp. .

"," DesignCon East 2004, Boxborough, MA, Apr. 5-7, 2004, pp. .

"," Euro DesignCon 2004, Munich, Germany, Oct. 11-14, 2004, pp. .

"," DesignCon 2005, Santa Clara, CA, Jan. 31-Feb. 3, 2005, pp. .

"," DesignCon East 2005, Worcester, MA, Sept. 19-21, 2005, pp. .

"," Euro DesignCon 2005, Munich, Germany, Oct. 24-27, 2005, pp. .

"," DesignCon 2006, Santa Clara, CA, Feb. 6-9, 2006, pp. .

"," DesignCon 2007, Santa Clara, CA, Jan. 29-Feb. 1, 2007, pp. .

"," DesignCon 2008, Santa Clara, CA, Feb. 4-7, 2008, pp. .

"," DesignCon 2010, Santa Clara, CA, Feb. 1-4, 2010, pp. .

"," DesignCon 2011, Santa Clara, CA, Jan. 31-Feb. 3, 2011, pp. .

"," DesignCon East 2011, Boston, MA, Sept. 27, 2011, pp. .

"," DesignCon 2013, Santa Clara, CA, Jan. 28-31, 2013, pp. .

--------------------------------------------------------
DesignFax
{ http://www.manufacturingcenter.com/dfx/archives/printarchives.asp https://www.thefreelibrary.com/Designfax-p2737 UM online, VU online, }
2 items found as of 1/30/2011

--------------------------------------------------------
designindustry
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Desktop Engineering
3 items found as of 1/30/2011
v15#5,v15#7-v15#10,v16#1-v16#2,v16#4-v16#5 checked 1/25/2011

--------------------------------------------------------
Diffusion and Defect Data. Pt A Defect and Diffusion Forum
{ AU online, BYU hbll QD543.D49pt.A, FIU green QD543.D5, FSU remote 530.5D569, GIT main-4e QD543.D52X, IU online, LH closed, MST depos QD543.D492, NWU online, OkSU main 541.341D56851, OrSU valley QC185.D51, OSU online, RU fondren QC176.8.D5D53, SU online, UC chem TP810.D44, UCI sci drum TP810.D44, UCSD s&e QD1.D569, UF sci QD543.D49, UK sci QC611.6.D4D43, UM online, UMi richter QC175.16.P5P465 & QC176.8.D5D57 & TA418.52.S46, USU auto QD543.D49pt.A, UTA eng TP156D47D4777, UTor online, }
4 items found as of 1/30/2011
v169-v170,v177-v178,v186-v187,v263-v264 checked 10/25/2009

--------------------------------------------------------
Diffusion and Defect Data Pt.B: Solid State Phenomena
{ GIT main QD543.D53X, MST wilson various, OkSU stillwater 541.341 D56853, OSU sel QC611.8.P64P67, UC eng various, UCF main QD543.D55, UCSD s&e QD1.S685, UK chem/phys QD543.D573, UMi richter various, }
1 item found as of 1/30/2011
v105

--------------------------------------------------------
Digest of Technical Papers - SID International Symposium
2008 SID International Symposium Digest of Technical Papers
SID International Symposium Digest of Technical Papers
{ CSULB online, FAU wimberly TK7882.I6S53, FIU green TK7882.I6S18, GIT main-6e TK7882.I6S18A, Lexmark TK7882.I6S18 & TK7882.I6I57, LH closed, }
3 items found as of 1/30/2011 catalog
05,07-08 checked 3/8/2009

--------------------------------------------------------
1997 Digital Communications Design Conference
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
1999 Digital Communications System Design Conference
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
2006 Diminishing Sources and Material Shortages (DMSMS) Conference
DoD Diminishing Manufacturing Sources and Material Shortages Conference
DOD DMSMS Conference
{ http://www.dtic.mil/ndia/, http://www.dmsms.org/, }
7 items found as of 7/3/2020 catalog
05-06 checked 7/3/2020

--------------------------------------------------------
Disaster-Resource.com
{ http://www.disaster-resource.com/, }
1 item found as of 1/30/2011

--------------------------------------------------------
Discussions of the Faraday Society
{ https://pubs.rsc.org/en/Journals/JournalIssues/DF#!issueid=df1971_52_0&type=archive&issnprint=0366-9033 MST wilson QD1.F32, NWU sci 541.3706F219d & geo 541.372F219i, OkSU stillwater 541.06F219d, OSU sel QD1F23, PU chem 541.3F22 & hicks 541.3F22, SDSU QD1.F32, SIUC online, SIUE, UAr online, UC chem (Oesper Rm) TK1.F24, UCSD online, UIC sci, UK online & chem/phys QD1.F32, UL kersey QD1.F32, UM online & shapiro QD1.F22d & buhr TK1.F221D6, UT hodges closed TK1.F23, }
2 items found as of 1/20/2021
searched for tin whisker(s) & Sn whisker(s) on 9/2/2020
searched for zinc whisker(s) & Zn whisker(s) on 9/2/2020
searched for indium whisker(s) on 9/2/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/2/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/2/2020

-------------------------------------------------------
Dislocations and Mechanical Properties of Crystals
{ CSULA north QD901.U5, OSU depos QD901.U5, SMU sci QD901.U5, UC phys QD901.U5 & sw depos QD901.U5, UD roesch QD901.U5, UK sci QD901.U5, USC QD901.U5, UT hodges QD901.U5, VU annex QD901.U5, }
1 item found as of 1/30/2011

--------------------------------------------------------
Display Manufacturing Technology Conference, Digest of Technical Papers
item found as of 1/30/2011 catalog

Nis, John R, "TAB driver interconnection process for automated assembly Display Manufacturing Technology Conference, Digest of Technical Papers, 1997, pp. 57-58

--------------------------------------------------------
DOE Pollution Prevention Conference
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Doktorsavhandlingar vid Chalmers Tekniska Hogskola
{ AU rbd T7.G68, GIT main T7.G64X, OSU depos T4G65, UK king T7.D650, UM hatcher T4.G675, }
item found as of 1/30/2011 catalog

An electron microscopy study on materials in electronic packaging Ye, Li-Lei Doktorsavhandlingar vid Chalmers Tekniska Hogskola no. 1875, 2002, p 1-53

--------------------------------------------------------
Douglas Service

{ }
(new reference 12/23/2013)
Frank, D. E., "Electrostatic Discharge... Nemesis of Electronic Systems," July/Aug. 1980

--------------------------------------------------------
DMSMS COE Newsletter
{ }
1 item found as of 1/30/2011 catalog

EEEE--------------------------------------------------------
e-inSITE
{ http://www.e-insite.net/ VU online, }
2 items found as of 1/30/2011

--------------------------------------------------------
ECN
ECN Electronic Component News
{ https://www.thefreelibrary.com/ECN-Electronic+Component+News-p25680 EBSCOB, IU online, NWU online, OkSU online, OSU online, SDSU online, SIUC online, UAr online, UCSD online, UK online, UOk online, USD online, UT online, }
>=20 items found as of 8/6/2021
(Feb04)-v63#5(Jun19) checked 8/6/2021

--------------------------------------------------------
(new source 6/22/2020)
217th ECS Meeting
{ }
1 item found as of 6/22/2020

--------------------------------------------------------
ECS Transactions (Electrochemical Society)
{ https://iopscience.iop.org/journal/1938-5862 MST online, UC chem TP156.C46C48, UCI online, UCSD online, UMC online, UMI online, USC 620, UTA online, UTo online, UTor online, UWa online, }
6 items found as of 11/7/2020 catalog
v3#10,v3#31,v3#43,v6#8-v6#9,v18#1 checked 8/19/2009
searched for tin whisker(s) and Sn whisker(s) on 1/24/2021
searched for zinc whisker(s) & Zn whisker(s) on 1/24/2021
searched for indium whisker(s) on 1/24/2021
searched for cadmium whisker(s) & Cd whisker(s) on 1/24/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 1/24/2021

*** here for UK 1/24/2021 *** Liang Wu, Mark A Ashworth, and Geoffrey D Wilcox, x "The Role of Nodules in the Growth of Zn Whiskers from Alkaline Cyanide-Free Zn Electrodeposits," ECS Transactions, vol. 66 no. 21, pp. 1-, 2015. https://doi.org/10.1149/06621.0001ecst

--------------------------------------------------------
ED Online
{ http://electronicdesign.com/ }
2 items found as of 1/30/2011

--------------------------------------------------------
EDA Tech Forum
3 items found as of 1/30/2011 catalog
v2#2(Jun05),v2#4(Dec05)-v7#5(Sep10) checked 11/20/2010

--------------------------------------------------------
EDN
EDN Europe
{ http://www.edn.com/archive/ IU online, KYVL, NWU online, OCU beam, OkSU stillwater 621.3805 E105, OSU online, PU eng 621.305EL223, SDSU online, SIUC online, UAr online, UC eng TK1.E323, UCSD online, UD online & roesch, UIC online & daley TK1.E267, UK online, UL kersey TK1.E266, UM offsite TK1.E117, USD online, UT online & hodges TK7870.E515, }
>=20 items found as of 8/2/2021
v50#1-v58#6(ended publication May13) checked 8/2/2021

------------------------------------------------------
EE Times
Electronic Engineering Times
{ https://www.eetimes.com/ FIU online, IU online, OkSU online, OSU online, PU eng 621.38105EL245, SDSU online, SIUC online, UC eng TK7815.E43 & cas TK7815.E43, UCSD online, UK online, UM online, UMi online, UOk online, USD online, UT online, UTo online, }
>=20 items found as of 8/2/2021 catalog
#1536-#1631(ended publication) checked 8/2/2021

--------------------------------------------------------
EE Times - Asia
{ http://www.eetasia.com/ }
>=20 items found as of 1/30/2011 catalog
4/15/01-10/8/10 checked 11/20/2010

-------------------------------------------------------
EE Times Europe
EEtimes Europe
{ http://www.eetimes.eu/uk/ USD online, }
>=20 items found as of 1/30/2011 catalog
Dec07-Oct10 checked 10/5/2010

--------------------------------------------------------
EEE Links
{ }
3 items found as of 1/30/2011 catalog

--------------------------------------------------------
(new source 7/7/2020)
EEE Parts Bulletin
{ }
1 item found as of 7/7/2020

--------------------------------------------------------
eeProductCenter
6 items found as of 1/30/2011

--------------------------------------------------------
EExpress
{ http://eetimes.eu/, }
1 item found as of 1/30/2011

--------------------------------------------------------
EFIP 03
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
EIPC Winter Conference
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Electrical Design of Advanced Packaging and Systems Symposium
IEEE Electrical Design of Advanced Packaging & Systems Symposium
2002 International Conference on Advanced Packaging and Systems
Proceedings 2002 International Conference on Advanced Packaging and Systems
EDAPS
{ IEEE XPLORE (08-), UM online? (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
08-20 checked 8/3/2021

--------------------------------------------------------
Electrical Manufacturing
{ AU rbd TK1.E362, FSU strozier HD9695.U52N3, LH closed, LU gray TK1.E362, NWU sci L621.3E39d, OkSU stillwater north boomer 621.305E38, SDSU compact TK1.A3E5, SIUC microfilm 55332-6211, TTU microfilm, UAB sterne TK1.E362, UF sci TK1.E362 & sci TK7869.E37, UIC warehouse TK7800.E44, UK end film S-34 & storage microfilm S-34, UTA storage 621.305EL251, UTo online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Electrical Overstress/Electrostatic Discharge Symposium Proceedings
EOS/ESD
{ IEEE XPLORE (95-), (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021

79-20 checked 8/3/2021

--------------------------------------------------------
Electrical World
{ EBSCOA, EBSCOB, AU online, FIT online, FSU online, GIT online, UL closed, LU online, NWU online, OGI online, OkSU stillwater 621.305E3838, OrSU storage TK1.E56, OSU online, PU online, RU fondren TK1.E46, SDSU online, SIUC online, SIUE online, SU online, TTU, UAH online, UAr online, UC eng TK1.E5 & swdepos microfilm, UCF online, UCI online, UCSD online, UDe penrose microform, UE microform, UF online, UIC warehouse TK1.E6, UIUC online, UK storage TK1.E5, UM online, UMc online, UMe mcwherter, UNF online, UOk online, USD online, USF online, USU online, UT hodges TK1.E5, UTA eng 621.305EL25, UTo online, WrSU online, }
1 item found as of 10/19/2015
v121#26 checked 10/19/2015

*** search for whiskers and tin pest *** --------------------------------------------------------
Electro International 1994
ELECTRO 'xx
Electro/xx International
Proceedings of the Electro/xx Technical program
{ IEEE XPLORE (91,94-96,98-99), SDSU online, USD online (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
91,94-96,98-99 checked 8/3/2021

--------------------------------------------------------
Electrochemical and Solid-State Letters
{ https://iopscience.iop.org/journal/1944-8775 IU bloomington chem QD551.E48, MST ONLINE, NWU online & sci L541.3705E385, OkSU stillwater 621.38105E38, OSU sel TK7871E38, PU online & chem 541.3705EL255, SDSU TK7871.E38, SIUC online, UAr online, UC eng TK7871.E38 & chem TK7871.E38, UCSD online, UD online, UIC daley TK7871.E38, UK online & eng TK7871.E38, UL kersey TK7869.E35, UM online sd, UOk online, UT online & hodges TK7871.E38, }
2 items found as of 1/20/2021

--------------------------------------------------------
Electrochemical Society Interface
{ http://www.electrochem.org/dl/interface/ AU online, BYU online, FIT online, FIU online, FSU online, GIT online, IU online, LH closed, MST online, NWU online, OGI online, OkSU online, OrSU online, OSU online, PU online, RU online, SDSU online, SIUC online, SU online, TTU, UAH N-1, UAr online, UC online, UCI online, UCSD online, UD roesch, UDe online, UIC online, UIUC online, UK online & sci TP250.E595, UM online, UMc online, UMe chem, UMi online, UOk online, USU storage, UT online, UTA chem TP250E543, UTO online, WrSU dunbar TP250.E595, }
11 items found as of 6/20/2021
v1#1-v30#1(21) all issues checked 6/20/2021
searched for tin whisker(s) and Sn whisker(s) on 7/18/2020

searched for zinc whisker(s) and Zn whisker(s) on 9/12/2020
searched for indium whisker(s) on 9/12/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/12/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/12/2020 --------------------------------------------------------
Electrochemical Society Proceedings
Proceedings (Electrochemical Society)
{ MST online, NEU snell various, OSU sel various, UC eng TS645.I57, UCSD s&e various, UMi online, UTA online & chem TP256.S95, }
item found as of 1/30/2011 catalog

Zhang, Y, and J. A. Abys, "A Unique Electrodeposition Process of a Lead-Free Solder - Pure Tin", Electrochemical Society Proceedings 96-21, pp. 159-176, 1997. Proceedings of the Symposium on Environmental Aspects of Electrochemical Technology : Applications in Electronics

Zhang Y., and J. A. Abys, "A Unique Electrodeposition Process of a Lead-Free Solder - Pure Tin", Electrochemical Society Proceedings 96-21, pp. 159-176, 1997.

--------------------------------------------------------
Electrochimica Acta
{ https://www.sciencedirect.com/journal/electrochimica-acta/issues CSULB online, IU online, MST wilson TP250.E63, OkSU stillwater 541.3705E38, OSU online & sel TP1.E4, PU chem 541.37EL25, SDSU online, SIUC online, UAr mullins chem per QD551.E55, UC online & eng TP1.E5, UCSD online, UK online sd & chem/phys QD1.E376, UL online & kersey QD551.E43, UM online & shapiro QD1.E42, UOk online, USC online, UT online & hodges TP250.E64, }
>=20 items found as of 8/8/2021
v37#1-v390(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 12/3/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/3/2020
searched for indium whisker(s) on 12/3/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/3/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/3/2020

(new reference 3/11/2021)
Frederick C. Krause, John-Paul Jones, Marshall C. Smart, Keith B. Chin, Erik J. Brandon Screening electrolytes designed for high voltage electrochemical capacitors ," Electrochimica Acta, vol. 374, pp. 137898-1-137898-, Apr. 1, 2021. https://doi.org/10.1016/j.electacta.2021.137898

--------------------------------------------------------
Electromagnetic Compatibility
{ CSULB online, }
>=20 items found as of 1/30/2011 catalog

--------------------------------------------------------
Electromagnetic News Report
{ CSULB online, UK online, UM online, USC online, VU online, }
>=20 items found as of 1/20/2021
v39#4,v40#4 checked 1/20/2021

--------------------------------------------------------
Electronic Business
{ http://www.edn.com/, IU online, KYVL, Lexmark, MST online, NWU online & main L338.4621E37, OkSU online, OSU online & bus HD9696A3U5E55, PU manage 338.4762130973EL24, SDSU online, SIUC online, SIUE online, UAr online, UC langsam HD9696.A3U5376, UCSD online, UD roesch, UIC warehouse HD9696.A3U5376, UK online, UM online, USD online, UT online, }
>=20 items found as of 1/20/2021
checked 1/20/2021

"japanese oems' lead-free initiative," electronic business, feb. 1, 2000.

fraone, gina, "north america won't lead on lead-free," electronic business, feb. 1, 2000.

jorgensen, barbara, "getting the lead out," electronic business, nov. 1, 2000.

doler, kathleen, "be lean, mean...and green," electronic business, sept. 1, 2000

zizzo, thomas, "europe gives mother nature a break," electronic business, feb. 1, 2001.

arensman, russ, "the greening of technology," electronic business, may 1, 2001.

miller, harvey, "lead-free electronic solders: are they really better?," electronic business, sept. 1, 2002.

zizzo, thomas, "new environmental laws in europe target electronics waste," electronic business, vol. june 1, 2003.

mahoney, jerry, "getting the lead out," electronic business, june 15, 2003.

jorgensen, barbara, "lead-free logistics," electronic business, nov. 1, 2003.

jorgensen, barbara, "terms for lead-free id," electronic business, july 1, 2004.

kirschner, michael, "materially deficient," electronic business, aug. 1, 2004.

king, rachael, "shooting at a moving target," electronic business online, dec. 1, 2004.

jorgensen, barbara, "hazardous-waste edict may accelerate component obsolescence," electronic business online, feb. 1, 2005.

jorgensen, barbara, "the end is near," electronic business, vol. 31 no. 2, pp. 33-34, feb. 1, 2005.

friend, gil, "getting ahead of green goals," electronic business online, mar. 1, 2005.

james, geoffrey, "how green is the valley?," electronic business, june 1, 2005.

jorgensen, barbara, "the "greening" of the supply chain," electronic business, june 2005.

gordon, pamela, "environmental differentiation," electronic business, june 1, 2005.

mello, adrian, "a challenging environment," electronic business, june 1, 2005.

jorgensen, barbara, "global sourcing: getting there from here," electronic business , oct. 1, 2005.

marlow, stephen, "commentary: are you ready for rohs?," electronic business, jan. 27, 2006.

jorgensen, barbara, "celestica ceo delaney: nothing in the supply chain untouched by rohs," electronic business, feb. 10, 2006.

cimalore, chuck, "commentary: confine the rohs compliance chaos," electronic business , feb. 28, 2006.

jorgensen, barbara, "it's tough to be green," electronic business, mar. 1, 2006.

wilson, drew, "europe at a crossroads," electronic business, mar. 1, 2006.

harbert, tam, "unwanted electronics," electronic business, apr. 1, 2006.

jorgensen, barbara, "peer into technology's future," electronic business, apr. 1, 2006.

bulkeley, debra, "software to the rescue," electronic business, apr. 1, 2006.

wilson, drew, "one-stop weee shop aims to spark compliance competition," electronic business, may 16, 2006.

johnson, sally cole, "rohs and non-compliance: expect to see penalties," electronic business, june 13, 2006.

johnson, sally cole, "technology transforms non-compliant rohs parts into compliant ones," electronic business, june 13, 2006.

bradley, tony, "compliance: beyond rohs," electronic business, june 20, 2006.

tallentire, paul, "commentary: why we need federal rohs and weee laws," electronic business, june 20, 2006.

jorgensen, barbara, "rohs, the coherent way," electronic business, june 27, 2006.

fjelstad, joseph, "commentary: note to european union-repeal rohs!," electronic business, july 25, 2006.

jorgensen, barbara, "there oughta be a (single) law," electronic business, july 1, 2006.

"executive guide: rohs and compliance," electronic business, july 11, 2006.

benson, duane, "commentary: comply with rohs in four easy steps," electronic business, july 11, 2006.

wilson, drew, "eu's environmental authority speaks out on rohs, other directives," electronic business, july 11, 2006.

jorgensen, barbara, "wall street mixed on rohs risks, rewards," electronic business , aug. 1, 2006.

bulkeley, debra, "companies still ill-prepared for compliance, especially with rohs," electronic business, aug. 8, 2006.

harbert, tam, "china flexes environmental muscles," electronic business, sept. 1, 2006.

mason, john m., "rohs is here- with 29 exemptions, and counting," electronic business, sept. 12, 2006.

james, geoffrey, "plm: the missing link?," electronic business, oct. 1, 2006.

jorgensen, barbara, "the electronics industry's compliance blues," electronic business , apr. 17, 2007.

jorgensen, barbara, "ring in the new rules," electronic business, jan. 1, 2008.

abrams, fern "dealing with the devil: could reach be better than rohs?," electronic business, feb. 5, 2008.

nevison, gary, "rohs ? more harm than good?," electronic business, mar. 31, 2008.

nevison, gary, "rohs enforcement getting more forceful," electronic business , aug. 12, 2008.

nevison, gary, "rohs 2: changes ahead," electronic business, dec. 22, 2008.

spiegel, rob, "leaded parts still in high demand," electronic business, jan. 20, 2009.

nevison, gary, "reach and rohs restrictions merging?," electronic business, jan. 21, 2009.

harbert, tam, "obama and the environment: new policies could produce more electronics regulation, opportunity," electronic business, jan. 26, 2009.

nevison, gary, "impact of rohs, reach, eup on electronics industry in 2009," electronic business, feb. 18, 2009.

nevison, gary, "what reach expects from a us company," electronic business, mar. 2, 2009.

spiegel, rob, "counterfeit components remains a huge electronics supply chain problem," electronic business, mar. 3, 2009.

nevison, gary, "rohs exemptions announced by ec--what goes, what stays, what's new," electronic business, mar. 25, 2009.

--------------------------------------------------------
Electronic Components & Materials
Proceedings of International Conference on Electronic Components & Materials
{ CSULB TK7869.I57, FIU green TK7869.I57, LH TK7869.I57, }
item found as of 8/15/2011 catalog
89

Yong, Yan (Sichuan Res. Inst. of Nonferrious, Chengdu, China); Jiang Xiao-hu; Zhang Ji-zhong; Xu Jian-yang High performances Sn-Cu electronic lead-free solder Electronic Components & Materials, v 24, n 4, Apr. 2005, p 54-6

Fu-ping, Liao (Sch. of Mater. Sci. & Eng., Nanchang Univ., China); Zhou Lang; Huang Hui-zhen Creep behavior of lead-free electronic solder alloys Electronic Components & Materials, v 24, n 4, Apr. 2005, p 65-7

--------------------------------------------------------
Electronic Design
{ http://electronicdesign.com/ EBSCOA, EBSCOB, IU online, Lexmark, MST wilson TK7800.E437, NWU online, OkSU online, OSU sel TK7800E37, PU eng 621.305EL248, SDSU online, SIUC online, UAr online, UC eng TK7800.E37, UCSD online, UE online, UIC online, UK online & eng TK7800.E437, UL kersey TK7800.E37, UM offsite TK7869.E38, UOk online, USD online, UT online & hodges TK7800.E4, }
>=20 items found as of 8/6/2021
v53#1-v68#5(20) checked 8/6/2021
searched for tin whisker(s) and Sn whisker(s) on 8/8/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/8/2020
searched for indium whisker(s) on 8/8/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/8/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight on 8/8/2020

searched for gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 10/10/2020 --------------------------------------------------------
Electronic Device Failure Analysis
{ https://www.asminternational.org/news/magazines/edfa EBSCOA, CSULB online, FIU online, LH closed, RyU online, SMU online, UK online, UMi online, UOk online, UPi online, USC TK7870.E157, UTAr online, UTD online, }
10 items found as of 8/6/2021 catalog
v10#1-v23#2(21) checked 8/6/2021

searched for tin whisker(s) and Sn whisker(s) on 1/23/2021
searched for zinc whisker(s) & Zn whisker(s) on 1/23/2021
searched for indium whisker(s) on 1/23/2021
searched for cadmium whisker(s) & Cd whisker(s) on 1/23/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 1/23/2021

-------------------------------------------------------
Electronic Education Report
{ OSU online, UM online, UT online, VU online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Electronic Engineering (London)
{ OSU sel TK6630.A1E3, UC langsam microfilm 504 & sw depos TK6630.A1T45, UD online, UM online, UT online, VU online, }
4 items found as of 1/30/2011

--------------------------------------------------------
Electronic Equipment News

{ }
(new reference 12/23/2013)
Holland March 1976 pp. 20-21

--------------------------------------------------------
1997 Electronic Interconnect Conference
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Electronic Manufacturing
{ Lexmark, UT hodges TK1.A3I46, }
2 items found as of 1/30/2011

--------------------------------------------------------
3rd Electronic Materials and Assembly Processes for Space (EMPS) Workshop
{ http://emps.port.ac.uk/documents.html, }
>=20 items found as of 6/18/2020
10-19 all issues checked 6/18/2020

," 11th Electronic Materials and Assembly Processes for Space EMPS) Workshop, Noordwijk, the Netherlands, June 1-3, 2021, pp. xx-xx.

--------------------------------------------------------
Electronic Media
{ UC langsam oversize PN1990.E44, UD online, UK online, UM online, UT online, VU online, }
1 item found as of 1/20/2021

--------------------------------------------------------
Electronic News
{ http://enx.sagepub.com/content/by/year http://www.edn.com/ EBSCOA, EBSCOB, IU online, Lexmark, NWU online, OkSU online, OSU online & bus HD9696U5E4, PU eng 621.305EL2832, SDSU online, SIUC online, SIUE microfilm, UAr online, UC eng microfilm 49, UCSD online, UD roesch, UIC online, UK online, UM online, USD online, UT online & hodges closed microfilm HD9696.U5E4, }
>=20 items found as of 1/20/2021
checked 1/20/2021

Chappell, Jeff, Davis, Jessica, Deffree, Suzanne, Levine, Bernard, Mason, John F. Mutschler, Ann Steffora, Sperling, Ed, Spiegel, Rob Taylor, Colleen, Wilson, Richard, --------------------------------------------------------
Electronic Packaging and Production
{ CSULA online, FIU online, Lexmark, OkSU online, OSU online, SDSU online, SIUC online, SMU online, UAr online, UCSD online, UM online, UOk online, USC grand, USD online, UT online, UTAr online, UTD online, }
15 items found as of 1/30/2011
v35#6, v40#5

--------------------------------------------------------
Electronic Parts Engineering
{ }
3 items found as of 1/30/2011 catalog

--------------------------------------------------------
Electronic Product Design
{ http://www.epdonthenet.net/ LH closed, }
11 items found as of 1/30/2011 catalog
11/02-3/18/08 checked 4/5/2009

(new reference 12/30/2008)
Take legal action Electronic Product Design, vol. 25 no. 2, Feb. 2004, pp. 35-36

Preparation is the key to RoHS and WEEE Electronic Product Design, vol. 25 no. 4, Apr. 2004, pp. 12

Clements, Vic Impacts and issues for WEEE Electronic Product Design, vol. 25 no. 4, Apr. 2004, pp. 48

Thomas, Suzanne How trouble-free is lead-free? Electronic Product Design, vol. 25 no. 11, Nov. 2004, pp. 28-30

Anon .Envirowise issues a call to compliance Electronic Product Design, v 26, n 8, August, 2005, p 4

--------------------------------------------------------
Electronic Production
{ LH closed, }
4 items found as of 1/30/2011 catalog

Putting lead-free into practice EP Electronic Production (London), vol. 29 no. 8, Sep, 2000, pp. 23

--------------------------------------------------------
Electronic Products
{ http://www2.electronicproducts.com/BackIssues.aspx FAU wimberly TK7870.E543, FIU online, MST online, OkSU online, OSU online, PU eng 621.38105EL26, SDSU online, UC eng TK7870.E543, UCSD online, UTor online, }
>=20 items found as of 7/15/2020 catalog
v46#8(Jan04)-Oct13 checked 7/15/2020

--------------------------------------------------------
Electronics
{ FAU wimberly TK7800.E4384, FIU green TK7800.E4384, Lexmark, MST wilson TK7800.E45, OkSU online, OSU QC1E38, SDSU TK7800.E439, SIUC morris 52217-6213, SIUE microfiche, UAr mullins TK7800.E4384, UC eng QC544.V3A3, UCSD s&e TK1.E384, UE microform, UK off-campus QC544.V3A3, UL kersey TK7800.E4384, UMi richter TK7800.E4384, USD online, UT online, }
4 items found as of 1/30/2011

--------------------------------------------------------
Electronics Cooling
{ http://www.electronics-cooling.com/ FIU online, SIUC online, }
4 items found as of 7/22/2021 catalog
v11#1-spring18,fall18-fall20,sum21 checked 7/22/2021

--------------------------------------------------------
Electronics Engineer
{ UF sci microfilm TK7800.E438, }
1 item found as of 1/30/2011

--------------------------------------------------------
Electronics Goes Green
Proceedings of the Electronics Goes Green Conference
EGG
{ IEEE XPLORE (12,16), (many other universities also subscribe to IEEE XPLORE), }
12 items found as of 8/3/2021 catalog
12,16 checked 8/3/2021

(new reference 12/30/2013)
Turbini, L., G. Munie, D. Bernier, J. Gamalski, D. Bergman. "Assessing the Environmental Implications of Lead-Free Soldering,", Proceedings of the Electronics Goes Green Conference, Berlin, Sept. 2000, 37-42.

--------------------------------------------------------
Electronics Letters
IET Electronics Letters
{ IEEE XPLORE (v1#1-), UK online & eng TK7800.E4395, (many other universities also subscribe to IEEE XPLORE), }
12 items found as of 8/4/2021
v1#1-v3#12(67), v44#1(08)-v56#24 checked 8/4/2021

searched for tin whisker(s) and Sn whisker(s) on 1/24/2021
searched for zinc whisker(s) & Zn whisker(s) on 1/24/2021
searched for indium whisker(s) on 1/24/2021
searched for cadmium whisker(s) & Cd whisker(s) on 1/24/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 1/24/2021

*** here for IEEE XPLORE 8/4/2021 *** about 0.75 per year ," Electronics Letters, vol. 56 no. 17, pp. , 2020.

--------------------------------------------------------
Electronics Manufacture and Test
>=20 items found as of 2/9/2011 catalog
June98-Sept04,Jan05-May05,Jan06-July06,Apr07-Oct10 checked 10/12/2010

--------------------------------------------------------
Electronics Manufacturing China
item found as of 1/30/2011 catalog

Shangguan, D., Understanding Compatibility and Clarifying Issues in Lead-Free Transition. Electronics Manufacturing China, Apr. 2004, pp. 20-24.

--------------------------------------------------------
Electronics Production World
{ http://www.electronicsproductionworld.com/articleList~idcategory~10.html, }
1 item found as of 1/30/2011

--------------------------------------------------------
Electronics Protection
{ http://www.electronicsprotectionmagazine.com/ }
2 items found as of 4/21/2015
v9#2-v9#3,v13#1 checked 4/21/2015

--------------------------------------------------------
Electronics Supply & Manufacturing
{ CSULB online, FIU online, OkSU online, UOk online, USC HD9696.A1E55, USD online, UTD online, }
>=20 items found as of 10/21/2011 catalog
Apr04-Jun07(finished) checked 10/21/2011

--------------------------------------------------------
2010 3rd Electronic System-Integration Technology Conference
2nd Electronics Systemintegration Technology Conference
ESTC
{ IEEE XPLORE (06,08,10,12,14,16,18,20), UF online, UM online (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
06,08,10,12,14,16,18,20 checked 8/3/2021

--------------------------------------------------------
Electronics Test
{ UM online, }
2 items found as of 1/30/2011 catalog

--------------------------------------------------------
Electronics Weekly
{ http://www.electronicsweekly.com/Sitemap/Default.aspx?SlotPageID=3 http://www.edn.com/, CMU eng, CSULA online, CSULB online, OkSU online, SDSU online, SIUC online, SMU online, UAr online, UCSD online, UK online, UOk online, UPi online, USC TK7800 621, USD online, UT online, UTAr online, UTD online, }
>=20 items found as of 1/20/2021 catalog
98-1/29/2014 checked 1/20/2021
Electronics Weekly, 1997/03/19 have Electronics Weekly, 1998/03/18 have searched for tin whisker(s) and Sn whisker(s) on 10/10/2020
searched for zinc whisker(s) and Zn whisker(s) on 10/10/2020
searched for indium whisker(s) on 10/10/2020
searched for cadmium whisker(s) and Cd whisker(s) on 10/10/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/2/2020

--------------------------------------------------------
Electronics World
Electronics World + Wireless World
{ AU rbd TK6540.R668, FSU dirac 620.5W798, GIT main-6e TK5700.W55, LU gray TK5700.W55, MST microfilm 621.38405 R118n, OkSU stillwater 621.38405W798111, OSU sel TK6540.R118, RU fondren TK5700.W55, SDSU TK7800.E5, SIUC morris 54335-6214, UA sterne microfilm TK7800.R668, UAr mullins TK5700.W55, UC swdepos TK6540.R34, UCB eng TK5700.W55, UCF main TK7800.R668, UCSD s&e TK1.E3865, UF sci TK5700.W55, UH TK7800.R668, UK eng TK5700.W55, UL kersey TK7800.R668, UOk bizzell TK7800.R668, UPi hillman, USF TK5700.W55, UTo carlson, WSU sci, UTor eng TK5700.W5522, UWa davis TK5700.W55, }
>=20 items found as of 10/13/2012 catalog
v96#xxxx-v118#1917 checked 10/13/2012

--------------------------------------------------------
Electronicstalk
{ http://www.electronicstalk.com/ }
2 items found as of 1/30/2011

--------------------------------------------------------
Electroplating & Finishing
{ http://www.plating.org/english/Search.asp?action=search, }
item found as of 1/30/2011 catalog
3/18/03-11/21/10 checked 11/21/10

Fang, J-L Lecture series on final surface finishing process for PCB - II Process of replacement Sn plating for super thin flexible PCB with super density. Electroplating & Finishing. Vol. 23, no. 1, pp. 36-39. Feb. 2004

Li, Ming Applications of electroplating technology in electronic packaging Electroplating & Finishing. Vol. 24, no. 1, pp. 44-49. 2005

--------------------------------------------------------
Electroplating and Metal Finishing
{ MST depos 671.705El25m, OSU sel TS670A1E4, SIUC morris 52174-6711, SMU storage, UM buhr TS670.A1E38, WSU storage, }
1 item found as of 1/30/2011 catalog
v28#5

--------------------------------------------------------
Electrospec
{ http://www.electrospec.com/, }
1 item found as of 1/30/2011

--------------------------------------------------------
Electrostatic Damage to Electronics Conference Proc
{ }

(new reference 12/23/2013)
Jones Apr 1990

--------------------------------------------------------
Electrostatic Products
{ }

(new reference 12/23/2013)
Bogar, J. and Sterling, D., "Minimize EMI in Your Computer Design," Electrostatic Products pp. 105-111, Jan. 1984.

--------------------------------------------------------
Elektron
{ }
6 items found as of 1/30/2011 catalog

--------------------------------------------------------
Elektronik
{ CSULB online, FIU online, GIT main TK7800.E443, LH closed, OkSU online, SDSU online, SIUC online, SMU online, UAr online, UMi online, UOk online, USC TK7800.E443, USD online, UT hodges TK7800.E443, UTAr online, UTD online, }
2 items found as of 1/30/2011 catalog

x --------------------------------------------------------
Elektronik Industrie
1 item found as of 1/30/2011 catalog
Jan06-Dec06 checked 1/27/2009

--------------------------------------------------------
Elektronik Praxis
{ http://www.elektronikpraxis.de/, CSULB online, FIU online, LH closed, MST online, MSU online NWU online, OkSU online, SDSU online, SMU online, UAr online, UCB online, UMi online, UOk online USD online, VU online, WUSL online, }
item found as of 8/4/2013 catalog

Cost of electrical component production in Germany Elektronik Praxis, n 3, 16 Feb. 2005, p 98-102 Language: German

--------------------------------------------------------
EMasia
{ http://www.emasiamag.com/ }
>=20 items found as of 1/30/2011 catalog
Jul04-Sep10 checked 11/21/2010

--------------------------------------------------------
Embedded Systems Design (ESD)
{ http://www.embedded.com/magazines https://www.embedded.com/embedded-systems-design-magazine-archive-2/ UM online, }
5 items found as of 3/14/2021
v11#1-v14#13(01),v23#1-v25#4(12) checked 3/14/2021

--------------------------------------------------------
Embedded Systems Programming
{ http://vault.embedded.com/;jsessionid=3ID1MR24IWEFXQE1GHPSKHWATMY32JVN OSU online, UK online, UM online, USC QA76.6.E484, UT online, VU online, }
1 item found as of 1/20/2021

--------------------------------------------------------
Embedded Technology
{ FIT online, }
1 item found as of 1/30/2011
Jul10-Nov10 checked 11/21/2010

--------------------------------------------------------
EMC
11 items found as of 1/5/2014 catalog
#186-#229,#231 checked 1/5/2014

--------------------------------------------------------
EMC Design & Test
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
EMC EXPO 88 Symposium Record
EMC EXPO87
{ }
19 items found as of 1/30/2011 catalog

(new reference 12/23/2013)
Boxleitner, 1989, "Designing and Testing for ESD Immunity Based on Actual Equipment Use Criteria," -1EMC EXPO Symposium Record-0, Washington, D.C., Aug. 1-3, 1989, pp. B3.15-B3.22 Keytek AN 175

Boxleitner, 1989, "Frequency of Occurance of ESD to Information Processing Equipment," -1EMC EXPO Symposium Record-0, Washington, D.C., Aug. 1-3, 1989, pp. C1.26-C1.30 Keytek AN 176

Duff, 1989, "Grounding for the Control of EMI," p. A6.1-A6.15

Greason, 1989, "Theoretical Principles of Electrostatic Discharge" p B3.1-B3.8

Hutchins 1989 "ESD Protection Using Discrete Semiconductor Products," p B3.23-B3.29

Mardiguian 1989 p A2.1-A2.16 "An Introduction to ESD"

Moehr 1989 p B3.9-B3.14 "How to Compare the Old and New ESD Test Method"

Violette 1989 p A3.1-A3.23 "An Introduction to the Design of Printed Circuit Boards (PCB's) With High Speed Digital and High Frequency System Performance Considerations"

--------------------------------------------------------
emc journal
UK EMC Journal
{ http://www.compliance-club.com/ }
4 items found as of 1/30/2011 catalog

--------------------------------------------------------
EMC Technology
{ }
>=20 items found as of 1/30/2011 catalog

--------------------------------------------------------
EMC Technology and Interference Control News
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
EMC Test and Design
{ }
3 items found as of 1/30/2011 catalog

(new reference 12/23/2013)
Pepe Jan/Feb 1991 p 35-31

Cronin Jan 1993

--------------------------------------------------------
EMC Zurich in Singapore 2006
{ IEEE XPLORE (06), (many other universities also subscribe to IEEE XPLORE), }
4 items found as of 8/3/2021
06 checked 8/3/2021

--------------------------------------------------------
emcnow
{ http://www.emc.com/about/news/emc-publications/index.htm, }
1 item found as of 1/30/2011

--------------------------------------------------------
2000 Emerging Technologies Conference Proceedings
{ http://www.smta.org/knowledge/proceedings.cfm, OkSU online, }
2 items found as of 11/26/2020
97-98,00 checked 11/26/2020

--------------------------------------------------------
empfasis
{ https://store.aciusa.org/Empfasis-Vol-7-No-4-P278.aspx https://store.aciusa.org/EMPFasis-Newsletter-C30.aspx }
>=20 items found as of 10/26/2013 catalog
Jan01-Mar11 checked 10/26/2013

--------------------------------------------------------
emsnow
{ http://www.emsnow.com/ }
>=20 items found as of 1/30/2011
11/24/04-11/21/10 checked 11/21/2010

--------------------------------------------------------
Energy & Fuels
{ https://pubs.acs.org/loi/enfuem AU online, FSU online, GIT online, LH closed, MST online, NWU online, OCU online, OGI online, OkSU online, OrSU valley TP315.E518, OSU online, PU online, RU online, SDSU online, SIUC online, SPU online, SU online, TTU online & TP315.E518, UAB online, UAr online, UC online, UCF online, UCI online, UCSD online, UD online, UDe online, UE online, UF online, UIC online, UIUC online, UK online, UM online, UMC online, USD online, USF online, UTA online, UTo online, WrSU online, }
17 items found as of 8/8/2021
v22#1-v35#15(21) checked 8/8/2021

--------------------------------------------------------
Energy Conversion and Resources - 2005
{ GIT main-5e TJ163.2.E466x, LH open, MST wilson TJ163.2.E466, OrSU valley TJ163.2.E466, OSU sel TJ163.7.E53, PU eng 621.042En262, RU fondren TJ163.7.E53, UC eng TJ163.7.E54623, UIUC eng 621.31E5673, UM offsite TJ163.2.I68, UTA eng TJ163.7E54634, }
1 item found as of 6/11/2015
03-06 checked 6/11/2015

--------------------------------------------------------
Energy Policy
{ https://www.sciencedirect.com/journal/energy-policy/issues AU online, FSU strozier 330.5E56, GIT online & main-4w HD9502.A1E54, LH closed, MST wilson HD9502.A1E54, NWU online, OGI online, OkSU stillwater 621.05E56, OSU depos HD9502.A1E54, PU eng 333.8205En27 & hicks 333.8205En27, RU online, SDSU online, SIUC online, UAr mullins HD9502.A1E54, UC online, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UIUC online, UM online, UMC eng HD9502.A1E54, UNF online ESD online, USF online, UTA online, UTo online, WrSU online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Engineer
{ MST depos 620.5En2, NWU sci 620.69E57, OkSU stillwater 620.5E56, SIUC morris 52212-6201, SIUE online, UAr online, UCSD online, UK online, USD online, UT online, }
2 items found as of 1/20/2021
v293#7716 checked 1/20/2021

-------------------------------------------------------
Engineering (London)
{ MST depos 620.5En3, NWU sci L620.5E57, OSU depos TA1.E54, PU eng 620.5En32, SDSU TA1.E55, SIUC morris 52316-6201, UAr morris per microfiche TA1.E55, UC eng TA1.E55, UCSD online, UE, UK eng TA1.E55, UL kersey TA1.E55, UT hodges TA1.E35, WSU online & storage, }
2 items found as of 1/30/2011
v247#8 checked 3/9/2009

--------------------------------------------------------
Engineering and Technology
IET Engineering and Technology
{ IEEE XPLORE (V1#1-), OSU sel TK1E65, PU eng 621.305En33, SDSU TK1.I412, SIUC online, UCSD online, UD roesch, UF online & sci TK1.I4125, VU online (many other universities also subscribe to IEEE XPLORE), }
5 items found as of 8/4/2021
v1#1-v16#3(21) all issues checked 8/4/2021

--------------------------------------------------------
Engineering Fracture Mechanics
{ https://www.sciencedirect.com/journal/engineering-fracture-mechanics/issues IU, MST wilson TA409.E5, NWU online, OkSU online, OSU online & sel TA409A1E5, PU online & eng 620.1126En34, SDSU online, UAr mullins per microfiche TA401.E53, UC online & eng TA409.E5, UCSD online, UIC online & daley TA409.E5, UK online & eng TA401.E576, UL online & kersey TA409.E5, UM online, UT online & hodges TA401.E63, }
1 item found as of 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 12/3/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/3/2020
searched for indium whisker(s) on 12/3/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/3/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/3/2020

--------------------------------------------------------
Engineering Management
{ https://www.tandfonline.com/loi/uemj20 NWU online, SDSU HD31.R57, UAr online, UCSD online, UK online, UT online, }
2 items found as of 1/20/2021
searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

--------------------------------------------------------
Engineering Science and Education Journal
{ IEEE XPLORE (v1#1-v11#6), UK online, (many other universities also subscribe to IEEE XPLORE), }
7 items found as of 8/2/2021
v1#1-v11#6(02,ended publication) all issues checked 8/2/2021

--------------------------------------------------------
(new source 7/7/2020)
Engineering Science and Technology, an International Journal
{ UK online, }
1 item found as of 1/20/2021
--------------------------------------------------------
Engineering Technology
{ LH closed, MIT online, UC cas TA1.J64, }
5 items found as of 1/30/2011 catalog

(new reference 12/30/2008)
Langfield-Holland, Mark, .WEEE and RoHS: Just what are my responsibilities? Engineering Technology, v 8, n 10, December 2005/January 2006, 2005-2006, p 41-43

--------------------------------------------------------
EngineerIT
Elektron
{ https://www.engineerit.co.za/magazine/ FIU online, GIT main-6e TK1.E88X, LH closed, UI eng, }
9 items found as of 12/22/2020 catalog
jan05-oct13,jan19-feb19 checked 12/22/2020

--------------------------------------------------------
Environmental Engineering
{ https://www.thefreelibrary.com/Environmental+Engineering-p24897 UK online, UM online, UT online, VU annex over TD1.S58, }
1 item found as of 1/20/2021

--------------------------------------------------------
Environmental Health Perspectives
{ https://ehp.niehs.nih.gov/loi/ehp MST online, OkSU online, SDSU online, SIUC online, SIUE online, UAr online, UCSD online, UE online, UK online, USD online, UT online, }
3 items found as of 1/20/2021

--------------------------------------------------------
Environmental Impact Assessment Review
{ https://www.sciencedirect.com/journal/environmental-impact-assessment-review/issues NWU online & main 333.71E61, OkSU online, OSU online, PU hum 333.710973En89, SDSU online, SIUC online, UC online & eng TD194.6.E593, UCSD online, UD online, UIC online, UK online sd & young TD194.6.E593 (to 1982), UL ekstrom TD194.6.E593, UM online, UT online, }
4 items found as of 1/20/2021

--------------------------------------------------------
Environmental Science
Huanjing Kexue
{ CSULB online, LH closed, MU online, UPi online, }
item found as of 1/30/2011 catalog

(new reference 12/29/2008)
Zhao, Jie, Meng, Xian-Ming, Chen, Chen, Zang, Hua-Xun, Ma, Hai-Tao .Leaching behavior of heavy metal elements in lead-free solders Huanjing Kexue/Environmental Science, v 29, n 8, August, 2008, p 2341-2344 Language: Chinese

--------------------------------------------------------
Environmental Science & Technology
{ https://pubs.acs.org/loi/esthag AU online, FSU online, GIT online, LH closed, MST online, NWU online, OGI online, OkSU online, OrSU valley TD180.E5, OSU online, PU online, RU online, SIUC online, SIUE online, SPU online, SU online, UAB online, UAr online, UC online, UCI online, UCSD online, UD online, UDe online, UE online, UF online, UIC online, UIUC online, UK online, UM online, UMC online, UNF TD180.E5, UPi online, USD online, USF online, UTA online, }
>=20 items found as of 8/8/2021 catalog
v34#20,v37#20,v40#8,v42#18,v43#21-v55#15(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 12/21/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/21/2020
searched for indium whisker(s) on 12/21/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/21/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/21/2020

*** here for online 8/8/2021 *** --------------------------------------------------------
EOS/ESD Technology
{ }
2 items found as of 11/24/2011 catalog
87 checked 11/24/2011

(new reference 12/23/2013)
Pierce Feb/Mar 1988

--------------------------------------------------------
EPN Online
{ http://www.epn-online.com/subscription/index/abo/true, }
1 item found as of 1/30/2011

--------------------------------------------------------
EPP Europe
{ http://www.epp-online.de/news, }
1 item found as of 1/30/2011

--------------------------------------------------------
Ericsson Review
{ http://www.ericsson.com/ericsson/corpinfo/publications/review/ CSULB online, GIT online, UF online, UK eng TK1.E68, UPi eng, USC TK1.E68, UTD online, VU online, }
3 items found as of 10/26/2013 catalog
v56#1(1979)-2010#2 checked 10/26/2013

--------------------------------------------------------
ESA Journal
European Space Agency (ESA) Journal
{ CMU eng, }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
ESA Scientific and Technical Review
{ CMU eng, }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
ESConnectivity
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
ESD Forum
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
ESD Journal
{ http://www.esdjournal.com/archive_page.htm }
2 items found as of 1/30/2011 catalog

--------------------------------------------------------
ESPEC Technology Report
Espec Technology Report
{ http://www.espec.co.jp/english/tech-info/tech_info/ }
13 items found as of 10/26/2013 catalog
#1-#27 all issues checked 10/26/2013

--------------------------------------------------------
ESTEC - NOORDWIJK
{ UC ceas TA1.I62 & CDROM TA1.I62, }
1 item found as of 1/30/2011

--------------------------------------------------------
Eureka
{ LH closed, MST depos 620.11Eu72, MSU online, NWU sci L620.105E89, SIUC storage 58708-6201, UCB eng TA401.E9, UD roesch remote, UM online, USD online, }
item found as of 1/30/2011

--------------------------------------------------------
EuroAsia Semiconductor
European Semiconductor
{ http://www.euroasiasemiconductor.com/ GIT main-6e TK7871.85.E878, }
12 items found as of 1/30/2011 catalog
Dec03-Aug10 checked 11/21/2009

--------------------------------------------------------
Eurocomp
{ http://www.esa.int/esaMI/ESA_Publications/SEM4PNZ990E_0.html }
1 item found as of 1/30/2011

--------------------------------------------------------
EUROCORR 2004: Long Term Prediction & Modelling of Corrosion
{ LH CDRM 1294, UM offsite TA418.76.E976, UOk online, USC online, }
item found as of 9/24/2014 catalog

Hansal, S, Pavetits, H, Hansal, W E G, Besenhard, J, Kronberger, H, Nauer, G E Corrosion behaviour of pulse plated tin-silver alloys EUROCORR 2004: Long Term Prediction & Modelling of Corrosion, Nice, France, 12-16 Sept. 2004. 2004

--------------------------------------------------------
European Conference on Optical Communications Proceedings
39th European Conference and Exhibition on Optical Communication
ECOC
{ IEEE XPLORE (96,98,01-02,06-), (many other universities also subscribe to IEEE XPLORE), }
items found as of 8/3/2021
96,98,01-02,06-20 checked 8/3/2021

(new reference 12/23/2013)
Kakimoto 1982 p 124-128

--------------------------------------------------------
13th European Conference on Power Electronics and Applications
2007 European Conference on Power Electronics and Applications
EPE
{ IEEE XPLORE (93,05,07,09,11-), (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
93,05,07,09,11-20 checked 8/3/2021

--------------------------------------------------------
European Electronics Engineer
{ http://www.engineerlive.com/european-electronics-engineer/ }
5 items found as of 1/30/2011 catalog
checked 4/4/2009

--------------------------------------------------------
European ESD Symposium Proc
{ }

(new reference 12/23/2013)
Honda v 2 p 1-10 Feb 1993

--------------------------------------------------------
14th European FIB Users Group Meeting
European Focused Ion Beam Users Group Meeting
EFUG
{ http://www.imec.be/efug/EFUG20.html, }
1 item found as of 10/26/2013 catalog
98-12 checked 10/26/2013

--------------------------------------------------------
European Journal of Operational Research
{ https://www.sciencedirect.com/journal/european-journal-of-operational-research/issues IU bloomington alf T57.6.E92, Lexmark, NWU online & sci 001.424E895, OkSU online, OSU online & bus T57.6E96, PU online & eng 658.4034Eu74, SDSU online, SIUC morris 52320-5181, UAr online, UC online & langsam T57.6.E92, UCSD online, UIC online & daley T57.6.E92, UK online sd, UL online & kersey T57.6.E92, UM online, UOk online, USD online, UT online & hodges T57.6.A1E8, }
3 items found as of 8/8/2021
v183#2,V191#3,v206#1-v295#2(21) checked 8/8/2021

--------------------------------------------------------
European Medical Device Manufacturer
{ http://www.devicelink.com/emdm/, }
1 item found as of 1/30/2011 catalog
Jan97-Nov10 checked 11/21/2010

--------------------------------------------------------
European Microelectronics and Packaging Conference
European Microelectronics and Packaging Symposium
EMPC
{ IEEE XPLORE (09,11,13,15,17,19), CSULB online, UOk eng TK7874.E978 (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021 catalog
09,11,13,15,17,19 checked 8/3/2021

(new reference 4/13/2011)
Ishii, Masahito, Tatsuo Kataoka, Hiroaki, Kurihara, "Whisker Problem in the Ultra-fine Pitch Circuits," l2th European Microelectronics & Packaging Conference, June 7-9, 1999. pp. 379-385.

--------------------------------------------------------
Nth European Passive Components Conference
Proceedings Nth European Passive Components Symposium
{ http://ecadigitallibrary.com/, }
items found as of 11/30/2013 catalog
checked 11/30/2013

--------------------------------------------------------
European Polymer Journal
{ https://www.sciencedirect.com/journal/european-polymer-journal/issues AU online, CMU online, FAU wimberly QD281.P6E8, FIT online, FSU online, GIT online, LH closed, LU gray, MST wilson microfilm 547.84Eu74, NWU online, OkSU online, OSU online, PU online, RU online, SDSU online, SIUC storage 55374-5471, TTU, UC online, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UIUC online, UK online (pay), UM online, UMC online, UMi online, UNF online, UOk online, USF online, USU online, UT online, UTA online, UTo online, WrSU online, }
4 items found as of 8/8/2021 catalog
v45#1-v156(21) checked 8/8/2021

--------------------------------------------------------
(new source 10/31/2020)
European Semiconductor

--------------------------------------------------------
European Semiconductor Design Production Assembly
item found as of 1/30/2011 catalog

"Gold bumps off the danger list Jasper, Jorg, Shiels, Dave European Semiconductor Design Production Assembly, vol. 22 no. 7, Jul, 2000, pp. S-86-S-88.

"The vision thing Anon European Semiconductor Design Production Assembly, vol. 23 no. 4, Mar. 2001, pp. 81+83.

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1st European Union/United States Lead-free Solder Interface Meeting
{ }
1 item found as of 1/30/2011 catalog

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1999 Third European Workshop on Advanced Mobile Robots
Second EUROMICRO workshop on Advanced Mobile Robots
Proceedings of the First Euromicro Workshop on Advanced Mobile Robot
{ IEEE XPLORE (96-97,99), }
3 items found as of 8/3/2021
96-97,99 checked 8/3/2021

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Evaluation Engineering
{ http://www.evaluationengineering.com/ FIU online, IU bloomington alf TK7869.E3, NWU online, OkSU online, OSU online, PU eng 621.38105Ev13 & hicks 621.38105Ev13, SIUC online, UCSD online, UK online, UM online & buhr TA168.A1E92, UMionline, UPi online, USD online, UT hodges K7870.E87, }
3 items found as of 6/20/2021 catalog
v44#1-v60#3(21) checked 6/20/2021

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evertiq
{ http://www.evertiq.com/ https://evertiq.com/news/42533 }
>=20 items found as of 1/30/2011 catalog
June14,04-Oct3,10 checked 10/3/2010

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eWEEK
{ http://www.webbuyersguide.com/resource/resourceLibrary.aspx?&sitename=webbuyersguide, OSU online, UD online, UK online, UM online, UT online, }
1 item found as of 1/20/2021

FFFF--------------------------------------------------------
Fabless Forum
1 item found as of 1/30/2011 catalog

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1969 Fall Joint Computer Conference
{ CSULB online, UC langsam microfilm 5049 & sw depos TK7885.A1J6, UM online, VU stacks TK7885.A1J6 & annex TK7885.A1J6, }
1 item found as of 1/30/2011

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Fastener World
1 item found as of 1/30/2011

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Fatigue and Fracture of Engineering Materials and Structures
{ https://onlinelibrary.wiley.com/loi/14602695 EBSCOA, IU online, MST wilson TA418.38.F37, NWU online & sci microfiche S15, OkSU online, OSU online & sel TA418.38F382, PU online & eng 620.1123F269 & hicks 620.1123F269, SDSU online, SIUC online, UAr mullins TA418.38.F374, UC online & eng TA630.F3, UCSD online, UD online, UIC online, UK online & eng TA418.38.F374, UL kersey TA418.38.F374, UM online, UOk online, UPi online, USD online, UT online & hodges TA418.38.F374, }
11 items found as of 8/6/2021 catalog
v19#1-v44#8(21) checked 8/6/2021

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Federal Aviation Administration-Florida Institute of Technology Workshop on Grounding and Lightning Technology
{ SMU fondren microform TD4.509:79-6, UC langsam micro gov TD4.509:79-6, UK storage microfiche TD 4.509:79-6, UL robotic TD4.509:77-84, UM offsite TL521.A57094 no.77-84, UT storage TD4.509:77-84, }
1 item found as of 1/30/2011 catalog

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Feinwerktechnik, Mikrotechnik, Messtechnik
{ LH closed, OSU sel Q184.Z48, UK king Q184.F18, UL ekstrom Q184.Z42, }
1 item found as of 1/30/2011 catalog

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ferret.com.au
{ http://www.ferret.com.au/ }
3 items found as of 1/30/2011

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Eighth Field Emission Symposium
{ UM online, UT hodges QC1.J81, }
1 item found as of 1/30/2011 catalog

(new reference 1/26/2011)
R. L. Parker Eighth Field Emission Symposium Aug 1961

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Financial Times Information
{ }
1 item found as of 1/30/2011

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Finishing
Finishing Industries
{ https://www.thefreelibrary.com/Finishing-p25049 CSULB online, FIU online, GIT online & main TT300.F53X, LH closed, LU gray TT300.F5, MST online, MSU online, OkSU online, OSU sel TS670A1E422, PU eng 667.905F495, SDSU online, SIUC online, SMU online, UCB online, UMi online, UOk online, UPi online, USC grand, USD online, UT online, UTAr online, UTD online, VU online, WSU online, }
>=20 items found as of 8/4/2013 catalog
v1#1-v5#11,v6#1-v6#2,v6#4-v6#11,v7#1-v33#6,v34#1,v34#3-v34#5,v35#1-v37#3 checked 8/4/2013

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finishing.com
{ http://www.finishing.com/ }
12 items found as of 1/30/2011

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Finishing Today
Industrial Paint and Powder
{ http://www.ippmagazine.com/ http://www.finishingtodaymag.com/ EBSCOB, FAU wimberly HD9999.C646I63, FIU online, IU online, NWU online, OkSU stillwater 698.305I421, OSU online, PU eng 667.605In2, SDSU online, SIUC online, UAr online, UK online, UCSD online, UM online, UMi online, UNCC online, UOk online, USD online, UT online, UTo online, WSU online, }
8 items found as of 8/2/2021
v77#1-v84#7(ended publication) checked 8/2/2021

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(new source 10/1/2020)
Finishing World
{ }
1 item found as of 10/1/2020

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Flame Retardants and Fire Safety
{ }
1 item found as of 1/30/2011 catalog

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Flexo
{ GIT main-6e Z252.5.F6F638x, }
item found as of 1/30/2011 catalog

Caudill, Cheryl Are you keeping up? Flexo, v 31, n 8, Aug. 2006, p 36-37

-------------------------------------------------------
flipchips.com
>=20 items found as of 7/4/2020
tutorial1-tutorial125 checked 7/4/2020

-------------------------------------------------------
Florida Today
{ UK online, UM online, }
1 item found as of 1/20/2021

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Focus on Tin
item found as of 1/30/2011 catalog

"Tin 'whiskers' and how to avoid them," Focus on Tin, no. 3, pp. 3, Summer 1994.

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Forbes
{ http://www.forbes.com/ MST wilson HF5001.F6, OkSU online, SDSU online, SIUE lovejoy, UAr online, UCSD online, UE, UK online, USD online, }
3 items found as of 1/20/2021

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Fortune
{ http://money.cnn.com/magazines/fortune/fortune_archive/ UC langsam stacks HF5001.F7, UK online & young HF5001.F7 & storage HF5001.F7, UM online, UT online, VU online, }
1 item found as of 1/20/2021

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FPGA and Structured ASIC Journal
{ }
1 item found as of 1/30/2011

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Freescale Technology Forum
{ http://www.freescale.com/webapp/sps/site/homepage.jsp?code=FTF_HOME_CATEGORY, }
1 item found as of 1/30/2011 catalog

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Frontline Solutions
{ CSULB online, OSU online, SMU online, UD online, UK online, UM online, UT online, UTAr online, UTD online, }
1 item found as of 1/20/2021 catalog

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Fujikura Technical Review
{ https://www.fujikura.co.jp/eng/rd/gihou/index.html }
9 items found as of 7/4/2020 catalog
29(Jan00)-49(dec19) checked 7/4/2020

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Fujitsu Scientific and Technical Journal
{ http://www.fujitsu.com/global/news/publications/periodicals/fstj/ CSULB online, FIU online, OkSU online, OSU sel TK7800F9, SDSU online, SIUC online, UAr storage TK1.F85, UCSD online, UPi online, USC TK1.F9, UTD online, UTor online, VU online, }
11 items found as of 8/2/2021 catalog
v26#1-v56#1(20, ended publications) checked 8/2/2021

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Fujitsu Ten Technical Journal
{ https://www.denso-ten.com/business/technicaljournal/10_19.html }
2 items found as of 7/4/2020 catalog
1-42(mar17) checked 7/4/2020

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Furukawa Review
{ https://www.furukawa.co.jp/review/ FIU online, OkSU online, SDSU online, UK online, UMi online, UTor online, }
5 items found as of 6/20/2021 catalog
#18(May99)-#47(16) checked 6/20/2021

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Future Circuits International
{ }
2 items found as of 1/30/2011 catalog

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Future Fab International
5 items found as of 1/30/2011 catalog

GGGG--------------------------------------------------------
Gallon Environment Letter
{ }
1 item found as of 1/30/2011

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Galvano
{ }
1 item found as of 1/30/2011

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Galvanotechnik
{ LH closed, OkSU main 671.732P523g, WSU storage, }
>=20 items found as of 1/30/2011 catalog
-Mar09 checked 4/3/2009

(new reference 12/30/2008)
Jostan, J.L. "Whisker Formation in Tin, Tin-Lead Alloys, Silver, and Gold," Galvanotechnik, vol. 71, no. 9, pp. 946-955, Sept. 1980 (Language in German).

Strube, G, DAS ELEKTROLYTISCHE ABSCHEIDEN VON ZINN UND BLEI-ZINN-UEBERZUEGEN. (Electrolytic Deposition of Tin and Tin-Lead Coatings.) Galvanotechnik, vol. 73 no. 12, Dec. 1982, p 1330-1337

v. Leersum, I. Chromfreie Vorbehandlung - Statusbericht (Chromium-free pretreatment - a status report) Galvanotechnik, vol. 89 no. 5, May 1998, p 1590-1594 Language: German

Koebbert, H.-O. Elektrotauchlackierung von Aluminium (Electrocoat painting of aluminum) Galvanotechnik, vol. 90 no. 1, Jan. 1999, pp. 158-167 Language: German

Thiery, L. Chrom(VI)-freie Oberflaechenbehandlung von Zink (Hexavalent chromium-free surface treatment of zinc) Galvanotechnik, vol. 91 no. 12, Dec. 2000, pp. 3373-3377 Language: German

Jordan, M. L”tbare bleifreie Schichten Solderable leadfree coatings, Galvanotechnik, vol. 92 no. 5, May 2001, pp. 1225-1236

Preikschat, P. Chrom(VI)ersatz fur Zink und Zinklegierungen - Dickschichtpassivierung im kreuzverhor (An alternative to hexavalent chromium for zinc and alloy coatings - Thick film passivation under scrutiny) Galvanotechnik, vol. 92 no. 9, Sept. 2001, p 2373-2377+V Language: German

Reinhold, B.; Brettmann, M. Behandlung von aluminiumbauteilen und konstruktionen in mischbauweise (Treatment of aluminium components and assemblies in multi-metal constructions) Galvanotechnik, vol. 92 no. 10, Oct. 2001, pp. 2655-2663+IV Language: German

Jansen, R.; Preikschat, P. Chrom(VI)ersatz auf zink - Nachbehandlungsverfahren in der praxis (Hexavalent chromium replacement for zinc passivation - Post treatment processes in practice) Galvanotechnik, vol. 92 no. 12, Dec. 2001, pp. 3231-3238+V Language: German

Nowak, A.; Seidel, R. Verbesserung der Lackhaftung und des Korrosionsschutzes von Magnesium durch moderne Konversionsverfahren (Improved paint adhesion and corrosion protection of magnesium using modern conversion coatings) Galvanotechnik, vol. 95 no. 7, July 2004, p 1724-1730+vi Language: German

Rauscher, Gerhard Neuartige chromfreie Vorbehandlungsverfahren fur die Aluminium-Lackbeschichtung (A novel chromium-free pretreatment process for painting of aluminium) Galvanotechnik, vol. 95 no. 11, Nov. 2004, p 2744-2751+vi Language: German

Crosby, Jeff, Lau, Danny Glanzendes Zinn mit niederem Kohlenstoffgehalt fur Steckverbinder (Bright tin with low carbon content for plug connectors) Galvanotechnik, v 96, n 2, Feb. 2005, p 311-322+v Language: German, English

Klobes, Karl-Hermann Zink- und Zinklegierungen - Massengalvanisierung im automobilbau (Zinc and zinc alloys - Mass plating in automotive construction) Galvanotechnik, v 96, n 7, July 2005, p 1562-1568+iv Language: German

Unruh, J.N. Chromabscheidung aus wassrigen Losungen - Teil 1: Chromsaurelosungen (Chromium electrodeposition from aqueous solution - Part 1: Chromic acid solutions) Galvanotechnik, v 96, n 9, Sept. 2005, p 2063-2071+v Language: German

Unruh, J.N.M. Chromabscheidung aus wassrigen elektrolyten teil 6: Die entwicklung der theorien (Electrodeposition of chromium from aqueous media - Part 6: Development of theories) Galvanotechnik, v 97, n 3, Mar. 2006, p 585-597 Language: German

Snyder, Donald L., Hill, Rock, Paulig, Franziska Dreiwertige und sechswertige dekorative chromverfahren im vergleich (Trivalent and hexavalent decorative chromium plating processes compared) Galvanotechnik, v 97, n 5, May 2006, p 1117-1121+vi Language: German

Volk, P. Chrom(III)haltige passivierung fur aluminium (Trivalent chromium passivates for aluminium) Galvanotechnik, v 97, n 5, May 2006, p 1122-1129+vi Language: German

Nagao, Toshimitsu, Sato, Kazuya, Otsuka, Kuniak, Nakagishi, Yutaka Herausforderung der chromfreien kunststoffbeschichtung (Challenge to chromium-free plastic plating method) Galvanotechnik, v 97, n 9, Sept. 2006, p 2124-2130+v Language: German, English

Dyllus, Thomas Glanzchromelektrolyt auf chrom(III)basis chrom(VI)gleichwertig in optik und bestandigkeit (Bright chromium deposits from a trivalent bath - Aesthetically and in performance, a match for hexavalent chromium plate) Galvanotechnik, v 97, n 9, Sept. 2006, p 2141-2147+vi Language: German

Unruh, Jurgen .Chromabscheidung aus wassrigen Elektrolyten Teil 14: Chrom(III) im Chromelektrolyten (Electrodeposition of chromium from aqueous electrolytes - Part 14: Trivalent chromium in hexavalent chromium electrolytes) Galvanotechnik, v 98, n 3, March, 2007, p 591-602+v Language: German

Thiery, Lionel, Raulin, Frederic .Fortschritte beim chrom(III)basierten passivieren (Advances in trivalent passivates on zinc and zinc alloys) Galvanotechnik, v 98, n 4, April, 2007, p 862-869+IV Language: German, English

Zhang, Wan, Schwager, Felix .Funktion von Blei bei der Verhinderung der Whiskerbildung in Zinnschichten (The role of lead in repressing whisker formation in tin deposits) Galvanotechnik, v 98, n 5, May, 2007, p 1121-1130+V Language: German

Wegricht, Jens, Spinaler, Jurgen, Mittweida, Fels, Carl Christian .Untersuchungen zur Chrom(VI)freien Vorbehandlung fur die Kunststoffgalvanisierung (Studies of chromium(VI)-free pretreatment for metallising of plastics) Galvanotechnik, v 98, n 6, June, 2007, p 1371-1379+vi Language: German

Van Der Pas, Frando, Zacearia, Bruno, Pinamonti, Marco .Eltos Bevorzugt Enthones AlphaSTAR [registered trademark] (Eltos Votes for Enthone's AlphaSTAR [registered trademark]) Galvanotechnik, v 98, n 7, July, 2007, p 1648-1652+vii Language: German

Kassing, Bernd, Schreiner, Harald .Sechs Jahre Praxiserfahrung mit Chromfreier Vorbehandlung von Aluminium (Six years practical experience with chromate-free pre-treatment of aluminium) Galvanotechnik, v 98, n 9, September, 2007, p 2248-2250+VI Language: German

Romankiewicz, K., Bohnet, J., Metzner, M., Kaszmann, H. .Chromdispersionsabscheidung - Veranderung der Schichteigenschaften durch Nanoskalige Feststoffe (Chromium matrix composite electrodeposits - Enhancement of deposit properties by use of nanoparticles) Galvanotechnik, v 98, n 12, December, 2007, p 2906-2919+IV Language: German

Kurtz, Olaf, Kuhlkamp, Peter, Barthelmes, Jurgen Ruther, Robert .Antikorrosionslosung zur Reduktion und Vermeidung von Korrosionswhiskern (A new corrosion inhibitor for minimising or avoiding tin whisker formation) Galvanotechnik, v 99, n 6, June, 2008, p 1349-1357+IV Language: German

Funk, St. .Praxistauglichkeit von chrom (VI) freien alternativschichten fur aluminium in der architektur (Serviceability of hexavalent chromium-free conversion coating for architectural aluminium applications) Galvanotechnik, v 99, n 8, August, 2008, p 2006-2007+vi Language: German

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Gate to Environmental and Health Sciences (Internet-Journal Gate to EHS)
1 item found as of 1/30/2011

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G. E. Report
{ }
item found as of 1/30/2011 catalog

(new reference 1/26/2011)
C. R. Morelock G. E. Report no. 61-RL-(2756M)

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GEC Journal of Research
GEC Journal of Technology
General Electric Company?
{ CMU eng, CSULB orca TK1.G257, UPi eng & storage, }
2 items found as of 1/30/2011 catalog

--------------------------------------------------------
GIDEP Alert
item found as of 1/30/2011 catalog

"Relay, Electromagnetic," Alert Number C6-A-91-03-V, Apr. 1, 1991.

Heutel, K. J., "Problem Notification - Tin Whisker Growth in Electronic Assemblies," GIDEP Alert F3-A-87-04A, Feb. 19, 1988.

"Relay, Electromagnetic," GIDEP Alert Number F3-P-97-01-V, Dec. 2, 1996.

J. Khuri, "Agency action notice," Government-Industry Data Exchange Program (GIDEP), Doc. no. AAN-U-02-104, Jul. 2002.

--------------------------------------------------------
Global Plastics Environmental Conference
Society of Plastics Engineers - Global Plastics Environmental Conference
{ }
items found as of 1/30/2011 catalog

(new reference 12/30/2008)
Dawson, Raymond B.; Landry, Susan D.; Ranken, Paul Updates on end-of-life, safety, and regulatory aspects for flame retarded plastics used in electrical and electronic equipment Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, 2004, pp. 63-74

Bachman, Bonnie J.; Desai, Nitin B.; Kierl, William G.; Olson, William L.; Zollo, James A. Design for reuse: Where environmental regulations and business strategies meet Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, 2004, pp. 239-250

Arnold, Rocky R., .Innovative "Green" EMI shielding based on polymer film material Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, 2004, p 35-43

Schnecke, Doreen, Gunther, Jorg .Study on recyclibility of in-mold decorated plastics parts Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, 2004, p 55-61

Bachman, Bonnie J., Desai, Nitin B., Kierl, William G., Olson, William L., Zollo, James A. .Design for reuse: Where environmental regulations and business strategies meet Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, 2004, p 239-250

Russell, Kimberley A., Sackett, Donald .Meeting the plastics challenges for toxic materials Global Plastics Environmental Conference 2005: GPEC 2005 - Creating Sustainability for the Environment, Global Plastics Environmental Conference 2005: GPEC 2005 - Creating Sustainability for the Environment, 2005, p 665-670

Thomas, Gabi, Bernd, Heinz .Celstran [registered trademark] recycling concept - Incorporation of LFT production scrap into Celstran [registered trademark] pultrudate Society of Plastics Engineers - Global Plastics Environmental Conference, GPEC 2007 - Environmental Innovation: Plastics Recycling and Sustainability, v 2, Society of Plastics Engineers - Global Plastics Environmental Conference, GPEC 2007 - Environmental Innovation: Plastics Recycling and Sustainability, 2007, p 878-892

Miller, Gordon C., .Alternatives to chrome plating and related chemical use in creating automobile, light truck, and heavy truck decorative components Society of Plastics Engineers - Global Plastics Environmental Conference, GPEC 2007 - Environmental Innovation: Plastics Recycling and Sustainability, v 2, Society of Plastics Engineers - Global Plastics Environmental Conference, GPEC 2007 - Environmental Innovation: Plastics Recycling and Sustainability, 2007, p 962-994

Linehan, Thomas, .RoHS and WEEE and how it has affected our designs for process controls for the plastics industry Society of Plastics Engineers - Global Plastics Environmental Conference, GPEC 2007 - Environmental Innovation: Plastics Recycling and Sustainability, v 3, Society of Plastics Engineers - Global Plastics Environmental Conference, GPEC 2007 - Environmental Innovation: Plastics Recycling and Sustainability, 2007, p 1309-1314

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Global SMT and Packaging
{ https://smt-pcb-electronics-manufacturing-news.globalsmt.net/bookcase/svjp http://www.globalsmt.net/ FIU online, MST online, OkSU online, SDSU online, }
>=20 items found as of 11/10/2020 catalog
v4#4,v5#1-v15#5,v15#8-v15#9,v15#11,v16#1-v16#5,v16#7,v16#9,v16#12-v17#1,v18#1, v19#4,v20#2-v20#5,v20#10 checked 11/10/2020

(new reference 12/31/2008)
Goodman, Paul The impact of the WEEE and RoHS directives on electrical equipment manufacturers Global SMT and Packaging, vol. 3 no. 4, May 2003, pp. 12-14

Lasky, Ronald; Jensen, Timothy Best practices in implementing Pb-free assembly Global SMT and Packaging, vol. 3 no. 8, Nov. 2003, pp. 10-15

Willis, Bob Secondary reflow failure - Another lead contamination defect Global SMT and Packaging, vol. 4 no. 1, Dec. 2003/Jan. 2004, 2003-2004, pp. 4-5

Ashmore, Clive, .Mass imaging process performance with Pb-free solder pastes Global SMT and Packaging, v 4, n 2, February, 2004, p 26-28

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Global Sources
{ http://www.globalsources.com/ }
10 items found as of 1/30/2011
checked 4/4/2009

--------------------------------------------------------
Global Symposium on Recycling, Waste Treatment and Clean Technology
{ LH open, MST TD794.5.G55, UF, UM offsite TD794.5.G46, UOk eng TD896.G56, USC grand, UTAr sel TD794.5.G56, UTor eng TD794.5.G56, }
2 items found as of 9/24/2014 catalog
99,04 checked 9/24/2014

-------------------------------------------------------
Gold Bulletin
{ http://www.goldbulletin.org/ OSU online, UC sw depos chem TN760.G65, UK online, UM online, VU online, }
2 items found as of 1/20/2021

searched for tin whisker(s) and Sn whisker(s) on 1/23/2021
searched for zinc whisker(s) & Zn whisker(s) on 1/23/2021
searched for indium whisker(s) on 1/23/2021
searched for cadmium whisker(s) & Cd whisker(s) on 1/23/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 1/23/2021

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Government Computer News
{ http://www.gcn.com/archives/ FIU online, MST depos QA75.5.G68, OkSU stillwater 004.05G721, SDSU online, SIUC online, UAr online, UCSD online, UK online, UMi online, UOk online, USD online, }
2 items found as of 1/20/2021
May28,07-Mar23,09 checked 1/20/2021

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1992 Government Microcircuit Applications Conference
{ UK eng TK7874.G580, }
item found as of 1/30/2011 catalog

Richardson, J. H., and B.R. Lasley, "Tin Whisker Initiated Vacuum Metal Arcing in Spacecraft Electronics," 1992 Government Microcircuit Applications Conference, Vol. XVIII, pp. 119-122, Nov. 10-12, 1992.

Richardson, J.H., and B.R. Lasley, "Tin Whisker Initiated Vacuum Metal Arcing in Spacecraft Electronics," 1992 Government Microcircuit Applications Conference, Vol. XVIII, pp. 119-122, November 10-12, 1992.

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Green Chemistry
{ https://pubs.rsc.org/en/journals/journalissues/gc#pnlissues OSU online, UC online, UK online, UM online, UT online, VU online, }
1 item found as of 1/20/2021

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Green SupplyLine
{ http://www.greensupplyline.com/ http://www.eetimes.eu/
http://www.electronicsweekly.com/
http://www.industrialcontroldesignline.com/ }
>=20 items found as of 1/30/2011
checked 4/4/2009

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Greener Management International
{ OSU online, UK online, UM online, UT online, VU online, }
1 item found as of 1/20/2021

--------------------------------------------------------
grist
{ http://www.grist.org/ UL robotic SB482.A4 G74, UM online, }
1 item found as of 1/30/2011

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Ground Water
{ MST wilson GB1001.G7, OkSU stillwater 551.4905G882, SDSU online, UAr online, UCSD online, UK geol GB1001.G75, USD online, UT online, }
1 item found as of 1/30/2011

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GSFC Systems Engineering Seminar
{ }
1 item found as of 1/30/2011 catalog

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Guardian
{ UK online, UM online, }
1 item found as of 1/20/2021

HHHH--------------------------------------------------------
Hardware Secrets
{ http://www.hardwaresecrets.com/, }
item found as of 1/30/2011
checked 4/4/2009

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Harsh Environments Workshop
item found as of 1/30/2011 catalog

Hundt, Michael, "QFN 9X9 Solder Joint Reliability" (Harsh Environments Workshop, Indianapolis, IN, July 19-20, 2006)

--------------------------------------------------------
HDPUG { http://www.hdpug.org/ }
4 items found as of 11/6/2015

15 checked 11/5/2015

--------------------------------------------------------
Heat Treatment of Metals
Jinshu Rechuli
{ https://caod.oriprobe.com/journals/jsrcl/Heat_Treatment_of_Metals.htm LH closed, PU eng 671.3605H353 & hicks 671.3605H353, }
item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Xiao, Dai-Hong, Song, Min, Chen, Kang-Hua .Effect of heat treatment on the formation and growth of tin whisker Jinshu Rechuli/Heat Treatment of Metals, v 32, n 11, November, 2007, p 88-90 Language: Chinese

--------------------------------------------------------
Helvetica Physica Acta
{ IU bloomington alf QC1.H4, MST depos 530.5H369, MSU remote QC1.H4, NWU sci 530.5H485, OkSU stillwater north_boomer 530.5H485, OSU sel QC1H48, PU online & phys 530.5An725 & 530.5H36 & 530.5 H36a & 530.6P21aa, SDSU QC1.H4, SIUC morris 52643-5301, SIUE storage, UAr storage QC1.H4, UC phys QC1.H4, UCSD s&e QC1.H485, UIC sci QC1.H4, UK king QC1.H4, UL kersey QC1.H4, UM shapiro QC1.H4 & buhr QC1.H4, UOk bizzell QC1.H4, USD online, UT hodges & closed QC1.H4, UTo carlson & depos, WSU sci, }
4 items found as of 1/30/2011

--------------------------------------------------------
Hewlett-Packard Journal
{ http://www.hpl.hp.com/hpjournal/pdfs/IssuePDFs/hpjindex.html EBSCOA, EBSCOB, CME eng, CSULA north QA76.8.H16H48, CSULB online, GIT online, OSU depos TK7870.A1H45, SMU online, UCF main TK1.H3, UF online, UK online, UM online, UPi online, USC QA76.8.H16H48, UT online, UTAr online, UTD online, VU online, }
5 items found as of 8/2/2021
v1#1-v50#1(ended publication) all issues checked 8/2/2021

--------------------------------------------------------
high-density interconnect
ATOTECH high-density interconnect HDI
{ UCF main TK7870.15.I573, WSU sci TS510.P76, }
item found as of 1/30/2011 catalog

Winkler, Sandra, and Horn, Bance, A Look at the Past Reveals a Lead-free Drop-In Replacement ATOTECH high-density interconnect Mar? Apr? 2001

Winkler S., and B. Hom, "A Look at the Past Reveals a Leadfree Drop-In Replacement", High Density Interconnect (HDI) on-line (http://www.hdi-online.com), March 2001.

--------------------------------------------------------
High Frequency Electronics
( http://highfrequencyelectronics.com/ )
1 item found as of 5/20/2020
v15#2-v16#2,v16#5-v17#4,v17#6-v19#2,v19#4 checked 5/20/2020

--------------------------------------------------------
High Performance Cleaning and Coating Conference
{ }
1 item found as of 3/23/2011 catalog

--------------------------------------------------------
1999 High-Performance System Design Conference
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
High-Purity Substances
Vysokochistye Veshchestva
{ ISU parks TP156.P83H54x, }
3 items found as of 1/30/2011

--------------------------------------------------------
High-Speed Communications Alliance
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
High-Speed Digital Design
{ http://www.sigcon.com/ }
>=20 items found as of 1/30/2011
v10#1 checked 4/9/2009

--------------------------------------------------------
Hitachi Review
Hitachi Seisakujo
{ http://www.hitachi.com/rev/index.html, CSULB online, GIT online, OSU sel T1.H55, UF online & sci T1.H55, UK storage TK1.H67, UM online & buhr TK4.H67, UPi online, USC T1.H55, UTD online, VU annex-over T1.H55, }
1 item found as of 7/4/2020 catalog
v49#1-v69#3(mar20) checked 7/4/2020

--------------------------------------------------------
HKPCA Journal
{ }
6 items found as of 1/30/2011 catalog

--------------------------------------------------------
Human Systems Management
{ MST online, MSU online, NWU online, OkSU online, OSU online, SDSU online, SIUC online, UAr mullins HD28.H85, UC sw depos HD28.H8, UCSD online, UIC online, UL ekstrom HD28.H85, UM online & hatcher HD28.H92 & buhr HD28.H92, USD online, UT online & hodges HD28.H85, UTo online, WSU online, }
1 item found as of 1/30/2011

IIII--------------------------------------------------------
IAS-ARS Space Exploration Meeting
{ }
1 item found as of 2/12/2011 catalog

--------------------------------------------------------
IBM Journal of Research and Development
{ IEEE XPLORE (v1#1-), CSULA north TK7800 .I14, CSULB online, FAU online, FIU online, KYVL, Lexmark, MST online, SDSU online, SIUC online, SIUE lovejoy, SMU online, UAr online, UC online & phys TK7800.I2, UCSD online, UE microform, UK eng Q180.A1I12 & storage microfilm S-37, UL online & robotic TK7800.I14, UM online, UMi online, UOk online, USC grand, USD online, UT online & hodges Q1.I2 & storage Q1.I2, UTAr storage TK7800.I14, UTD online, VU online, (many other universities also subscribe to IEEE XPLORE), }
12 items found as of 8/4/2021
v1#1-v64#6(20) all issues checked 8/4/2021

searched for tin whisker(s) and Sn whisker(s) on 1/23/2021
searched for zinc whisker(s) & Zn whisker(s) on 1/23/2021
searched for indium whisker(s) on 1/23/2021
searched for cadmium whisker(s) & Cd whisker(s) on 1/23/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 1/23/2021

--------------------------------------------------------
(new source 2/13/2021)
IConnect007
{ http://www.iconnect007mail.com/ }

--------------------------------------------------------
IBM Technical Disclosure Bulletin
{ OSU depos TK7800.I16, SMU sci, UK storage QA76.5.I150, UL robotic QA76.8.I101I48, UM offsite TK7800.I15, }
2 items found as of 1/30/2011

--------------------------------------------------------
IDEMA ESD Symposium Proceedings
{ }

(new reference 12/23/2013)
A. Wallash and Y.K. Kim, "Standard ESD Testing of AMR and GMR Recording Heads, IDEMA ESD Symp. Proc., May 22, 1997.

Chung Lam, "Magnetic Characterization of ESD Damage to MR Heads", Proc. IDEMA ESD Symp., May 22, 1997.

A. Wallash, "101 Ways to ZAP MR and GMR Heads", in Understanding ESD and EMI Issues in Magnetic Recording (IDEMA, Sunnyvale, CA, May 22, 1997,

Honda May 22, 1997, "Impulsive Electromagnetic Fields due to Metal-Metal..."

T. Cheung, "CDM Testing of MR Heads", in Understanding ESD and EMI ssues in Magnetic Recording (IDEMA, Sunnyvale, CA, May 22, 1997

G. Kimball, "Safe MR resistance measurements", in Understanding ESD and EMI Issues in Magnetic Recording, IDEMA, Sunnyvale, CA, May 22, 1997, pp. 89-100.

--------------------------------------------------------
IEE Colloquium on Assembly and Connections in Microsystems
{ IEEE XPLORE (97), UK online, UM online (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
97 checked 8/3/2021

--------------------------------------------------------
IEE Colloquium on "Electromagnetic Hazards to Active Electronic Components"
{ IEEE XPLORE (94), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
94 checked 8/3/2021

--------------------------------------------------------
IEE Colloquium on ESD (Electrostatic Discharge) and ESD Counter Measures
{ IEEE XPLORE (95), (many other universities also subscribe to IEEE XPLORE), }
4 items found as of 8/3/2021
95 checked 8/3/2021

--------------------------------------------------------
IEE Colloquium on Surges, Transients and EMC (ref no 1998/184, }
{ IEEE XPLORE (98), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
98 checked 8/3/2021

--------------------------------------------------------
IEE Seventh International Conference of Electromagnetic Compatibility IEE International Conference of Electromagnetic Compatibility
{ IEEE XPLORE (90,92,94,97,99,17,19), UK online, (many other universities also subscribe to IEEE XPLORE), }
3 items found as of 8/3/2021
90,92,94,97,99,17,19 checked 8/3/2021

--------------------------------------------------------
IEE Proceedings
Proceedings of the Institution of Electrical Engineers
{ IEEE XPLORE (v110#1-v126#12), UK online, (many other universities also subscribe to IEEE XPLORE), }
3 items found as of 8/4/2021

*** here for IEEE XPLORE 8/4/2021 *** --------------------------------------------------------
IEE Review
{ IEEE XPLORE (v34#1-v52#3), UK online & remote TK1.I35, (many other universities also subscribe to IEEE XPLORE), }
10 items found as of 8/2/2021
v34#1(88)-v52#3(ended publication) checked 8/2/2021

--------------------------------------------------------
The IEE Seminar and Exhibition on MEMS Sensor Technologies 2005
{ IEEE XPLORE (05), }
item found as of 8/3/2021
05 checked 8/3/2021

--------------------------------------------------------
IEE Seminar on Beyond WEEE. Unsustainable Product Design and How to Avoid It
{ IEEE XPLORE (05), UM online? (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/3/2021
05 checked 8/3/2021

--------------------------------------------------------
IEE Seminar on the 'Hows' and 'Whys' of EMC Design
{ IEEE XPLORE (99), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
99 checked 8/3/2021

--------------------------------------------------------
2006 IEEE Aerospace Conference
2008 IEEE Aerospace Conference Proceedings
{ IEEE XPLORE (97-), UK online, UM online & TK5.I12, UTo carlson TL3000.A1I18a, WSU online (many other universities also subscribe to IEEE XPLORE), }
3 items found as of 8/3/2021
97-21 checked 8/3/2021

--------------------------------------------------------
2011 IEEE 35th Annual Computer Software and Applications Conference
COMPSAC
{ IEEE XPLORE (78-79,88-), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
78-79,88-20 checked 8/3/2021

--------------------------------------------------------
IEEE Antennas and Propagation Society International Symposium 2006
{ IEEE XPLORE (63-), UK eng TK7871.6I44, (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021

*** here for IEEE XPLORE 8/3/2021 *** --------------------------------------------------------
IEEE Boston Reliability Chapter 38th Annual Spring Reliability Symposium
{ IEEE XPLORE (96), UK online, (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021 catalog
96 checked 8/3/2021

--------------------------------------------------------
2010 the 5th IEEE Conference on Industrial Electronics and Applications
ICIEA
{ IEEE XPLORE (06-), }
15 items found as of 8/3/2021
06-20 checked 8/3/2021

--------------------------------------------------------
2008 IEEE Conference on Robotics, Automation and Mechatronics
{ IEEE XPLORE (04,06,08,10-11,13,15,17), }
5 item found as of 8/3/2021
04,06,08,10-11,13,15,17 checked 8/3/2021

--------------------------------------------------------
IEEE Conference Record of 1970 Fifth Annual Meeting of the IEEE Industry and General Applications Group
{ }
3 items found as of 1/30/2011

--------------------------------------------------------
IEEE CPMT Symposium Japan
IEEE 9th VLSI Packaging Workshop of Japan
ICSJ
{ IEEE XPLORE (08,10,12-), (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
08,10,12-19 checked 8/3/2021

--------------------------------------------------------
IEEE Electromagnetic Compatibility Magazine
{ IEEE XPLORE (v1#1-) (many other universities also subscribe to IEEE XPLORE), }
13 items found as of 8/4/2021
v1#1-v10#2(21) all issues checked 8/4/2021

--------------------------------------------------------
IEEE Energy Conversion Congress and Exposition
ECCE
{ IEEE XPLORE (09-) (many other universities also subscribe to IEEE XPLORE), }
10 items found as of 8/3/2021
09-20 checked 8/3/2021

--------------------------------------------------------
IEEE Engineering Management Review
{ IEEE XPLORE (v1#1-v15#4,v30#1-), UK remote TA190.I530, (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/4/2021
v1#1-v15#4,v30#1(02)-v49#2(21) checked 8/4/2021

--------------------------------------------------------
2013 IEEE Grenoble PowerTech
2011 IEEE Trondheim PowerTech
2009 IEEE Bucharest PowerTech
2007 IEEE Lausanne Power Tech
2005 IEEE Russia Power Tech
2003 IEEE Bologna Power Tech Conference Proceedings
2001 IEEE Porto Power Tech Proceedings
POWERTECH
{ IEEE XPLORE (01,03,05,07,09,11,13,15,17,19,21), UK online, (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021

01,03,05,07,09,11,13,15,17,19,21 checked 8/3/2021

--------------------------------------------------------
IEEE Industry Applications Magazine
{ IEEE XPLORE (v1#1-), UK online, (many other universities also subscribe to IEEE XPLORE), }
3 items found as of 8/4/2021
v1#1-v27#4(21) all issues checked 8/4/2021

--------------------------------------------------------
2010 IEEE Industry Applications Society Annual Meeting
Conference Record IAS Annual Meeting 1980
Conference Record of the 2000 IEEE Industry Applications Conference
Conference Record of the IEEE Industry Applications Society Annual Meeting
Conference Record Industry Applications Society IEEE-IAS-1985 Annual Meeting
IEEE Industry Applications Society 48th Annual Petroleum and Chemical Industry Conference
{ IEEE XPLORE (88-), (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
88-20 checked 8/3/2021

--------------------------------------------------------
2007 IEEE Intelligent Vehicles Symposium
{ IEEE XPLORE (92-96,00,02-), }
8 items found as of 8/3/2021
92-96,00,02-20 checked 8/3/2021

--------------------------------------------------------
IEEE International Conference on 3D System Integration
3DIC
{ IEEE XPLORE (09-16,19), (many other universities also subscribe to IEEE XPLORE), }
6 items found as of 8/3/2021
09-16,19 checked 8/3/2021

--------------------------------------------------------
IEEE International Conference on Automation Science and Engineering
{ IEEE XPLORE (05-), }
11 items found as of 8/3/2021
05-20 checked 8/3/2021

--------------------------------------------------------
(new source 5/15/2021)
2020 IEEE International Conference on Autonomous Robot Systems and Competitions
ICARSC
{ IEEE XPLORE (14-), }
item found as of 8/3/2021
14-21 checked 8/3/2021

--------------------------------------------------------
IEEE 1993 International Conference on Consumer Electronics
2010 Digest of Technical Papers International Conference on Consumer Electronics
ICCE
{ IEEE XPLORE (88-03,05-), (many other universities also subscribe to IEEE XPLORE), }
7 items found as of 8/3/2021
88-03,05-21 checked 8/3/2021

--------------------------------------------------------
2013 10th IEEE International Conference on Control and Automation
{ IEEE XPLORE (02-03,05,07,09-), UK online, (many other universities also subscribe to IEEE XPLORE), }
8 items found as of 8/3/2021
02-03,05,07,09-20 checked 8/3/2021

--------------------------------------------------------
IEEE International Conference on Industrial Technology
ICIT
{ IEEE XPLORE (94,96,00,02-06,08-), (many other universities also subscribe to IEEE XPLORE), }
8 items found as of 8/3/2021
94,96,00,02-06,08-21 checked 8/3/2021

-------------------------------------------------------
xxxx IEEE International Conference on Mechatronics and Automation
xxxx IEEE/ASME Advanced Intelligent Mechatronics
xxxx IEEE/ASME International Conference on Advanced Intelligent Mechatronics
International Conference on Mechatronics and Automation
Proceedings of the xxxx IEEE International Conference on Mechatronics and Automation
ICMA
{ IEEE XPLORE (97,99,01-), UM online? (many other universities also subscribe to IEEE XPLORE), }
17 items found as of 8/3/2021
97,99,01-20 checked 8/3/2021

--------------------------------------------------------
17th IEEE International Conference on Micro Electro Mechanical Systems
{ IEEE XPLORE (89-), }
11 items found as of 8/3/2021
89-21 all checked 8/3/2021

--------------------------------------------------------
2013 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems
{ IEEE XPLORE (06-), (many other universities also subscribe to IEEE XPLORE), }
19 items found as of 8/3/2021
06-21 checked 8/3/2021

--------------------------------------------------------
2010 IEEE International Conference on Power and Energy
PECON
{ IEEE XPLORE (03-04,06,08,10,12,14,16,18,20), UK online, (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
03-04,06,08,10,12,14,16,18,20 checked 8/3/2021

----------------------------------------------------
2011 IEEE International Conference on Robotics and Automation
{ IEEE XPLORE (84-), UK online, (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
84-20 checked 8/3/2021

----------------------------------------------------
2005 IEEE International Conference on Robotics and Biomimetics
ROBIO
{ IEEE XPLORE (04-), }
>=20 items found as of 8/3/2021
04-19 checked 8/3/2021

----------------------------------------------------
IEEE International Conference on Semiconductor Electronics
{ IEEE XPLORE (96,98,00,02,04,06,08,10,12,14,16,18,20), UK online, UM online, (many other universities also subscribe to IEEE XPLORE), }
8 items found as of 8/3/2021
96,98,00,02,04,06,08,10,12,14,16,18,20 checked 8/3/2021

----------------------------------------------------
IEEE International Convention Digest
{ UK remote TK1.I377, }
1 item found as of 1/30/2011

--------------------------------------------------------
2004 IEEE International Engineering Management Conference
2008 IEEE International Engineering Management Conference
International Conference on Engineering and Technology Management
{ IEEE XPLORE (88,90,92-96,98,01-), UK online, UM online? (many other universities also subscribe to IEEE XPLORE), }
4 items found as of 8/3/2021
88,90,92-96,98,01-08 checked 8/3/2021

--------------------------------------------------------
2013 IEEE 56th International Midwest Symposium on Circuits and Systems
48th Midwest Symposium on Circuits and Systems
MWSCAS
{ IEEE XPLORE (89-), (many other universities also subscribe to IEEE XPLORE), }
4 items found as of 8/3/2021
89-20 checked 8/3/2021

--------------------------------------------------------
2010 IEEE 3rd International Nanoelectronics Conference
2006 IEEE Conference on Emerging Technologies - Nanoelectronics
2nd IEEE International Nanoelectronics Conference
INEC
{ IEEE XPLORE (06,08,10-16,18-19), (many other universities also subscribe to IEEE XPLORE), }
11 items found as of 8/3/2021
06,08,10-16,18-19 all issues checked 8/3/2021

-----------------------------------------------------
2010 IEEE International Reliability Physics Symposium
27th Annual Proceedings International Reliability Physics Symposium
23rd Annual Proceedings Reliability Physics
26th Annual Proceedings Reliability Physics 1988 Sixth Annual Reliability Physics Symposium
46th Annual IEEE International Reliability Physics Symposium Proceedings
IEEE International 44th Annual Reliability Physics Symposium Proceedings
Proceedings 45th Annual IEEE International Reliability Physics Symposium
Proceedings of the International Reliability Physics Symposium
IRPS
{ IEEE XPLORE (67,70-), UK online & eng TK 7870.S98, UM online (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
67,70-21 checked 8/3/2021

--------------------------------------------------------
1999 IEEE International Solid-State Circuits Conference
ISSCC
{ IEEE XPLORE (55-), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
55-21 checked 8/3/2021

--------------------------------------------------------
IEEE 7th International Symposium on Applications of Ferroelectrics
Sixteenth IEEE International Symposium on Applications of Ferroelectrics
Proceedings of the Tenth IEEE International Symposium on Applications of Ferroelectrics
Proceedings of the 2000 12th IEEE International Symposium on Applications of Ferroelectrics
ISAF
{ IEEE XPLORE (86,90,92,94,96,98,00,02,04,06-), (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
86,90,92,94,96,98,00,02,04,06-21 checked 8/3/2021

--------------------------------------------------------
2014 IEEE 12th International Symposium on Applied Machine Intelligence and Informatics
2021 IEEE 19th World Symposium on Applied Machine Intelligence and Informatics
SAMI
{ IEEE XPLORE (08-), }
2 items found as of 8/3/2021
08-21 checked 8/3/2021

--------------------------------------------------------
2001 IEEE International Symposium on Circuits and Systems
IEEE International Symposium on Circuits and Systems
Proceedings of the 2004 International Symposium on Circuits and Systems
ISCAS
{ IEEE XPLORE (88-), (many other universities also subscribe to IEEE XPLORE), }
7 items found as of 8/3/2021
88-21 checked 8/3/2021

--------------------------------------------------------
2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging
2009 15th International Symposium for Design and Technology of Electronics Packages
SIITME
{ IEEE XPLORE (09-), (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
09-20 checked 8/3/2021

--------------------------------------------------------
2011 IEEE 13th International Symposium on High-Assurance Systems Engineering
HASE
{ IEEE XPLORE (98-17,19), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
98-17,19 checked 8/3/2021

--------------------------------------------------------
2004 IEEE International Symposium on Industrial Electronics
ISIE
{ IEEE XPLORE (92-), UK online, (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
92-20 checked 8/3/2021

--------------------------------------------------------
2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
Nth International Symposium on the Physical and Failure Analysis of Integrated Circuits
16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA
{ IEEE XPLORE (95-), UM online (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
95-20 checked 8/3/2021

--------------------------------------------------------
First IEEE International Symposium on Polymeric Electronics Packaging
{ IEEE XPLORE (97), UK online, UM online, (many other universities also subscribe to IEEE XPLORE), }
13 items found as of 8/3/2021
97 checked 8/3/2021

-------------------------------------------------------
2010 IEEE International Symposium on Sustainable Systems and Technology
2008 IEEE International Symposium on Electronics and the Environment
IEEE International Symposium on Electronics and the Environment
IEEE International Symposium on Sustainable Systems and Technology
Proceedings of 2004 IEEE International Symposium on Electronics and the Environment
Proceedings of the 2007 IEEE International Symposium on Electronics & the Environment
ISSST
ISEE
{ IEEE XPLORE (93-), OSU sel TK7835.I34, UK online & eng TK7835.I340, UM online, UT hodges TK7835.I34, WSU sci TK7835.I33 (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
93-12 checked 8/3/2021

--------------------------------------------------------
2010 IEEE International Workshop on Medical Measurements and Applications Proceedings
IEEE International Workshop on Medical Measurements and Applications
MeMeA
{ IEEE XPLORE (06-), (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/3/2021
06-21 checked 8/3/2021

--------------------------------------------------------
IEEE Journal of Photovoltaics
{ IEEE XPLORE (v1#1-), (many other universities also subscribe to IEEE XPLORE), }
3 items found as of 8/4/2021
v1#1-v11#4(21) all issues checked 8/4/2021

--------------------------------------------------------
IEEE Journal of Quantum Electronics
{ IEEE XPLORE (v1#1-), UK online & eng TK7800.I53, (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/4/2021
v1#1-v2#12(66), v36#1-v41#12(05), v46#1(10)-v57#5(21) checked 8/4/2021

," IEEE Journal of Quantum Electronics, vol. 41 no. 12, pp. , 2005.

*** here for IEEE XPLORE 4/7/2021 *** about 0.1 per year --------------------------------------------------------
2004 IEEE Microelectronics Reliability and Qualification Workshop
Microelectronics Reliability and Qualification Workshop
8 items found as of 1/30/2011 catalog

--------------------------------------------------------
IEEE Microwave and Wireless Components Letters
{ IEEE XPLORE (v11#1-), NWU online & sci L621.3813I222, OSU online & sel TK7876I46, PU online & eng 621.381305In7, UC online, UD online, UIC online & daley TK7800.I19, UK online & eng TK7876.I480, UL online, UM online, UT online & hodges QC685.I44 (many other universities also subscribe to IEEE XPLORE), }
6 items found as of 8/4/2021
v11#1(01)-v31#7(21) checked 8/4/2021

--------------------------------------------------------
IEEE Microwave Magazine
{ IEEE XPLORE (v1#1-), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/4/2021
v1#1-v22#9(21) all issues checked 8/4/2021

--------------------------------------------------------
2008 IEEE MTT-S International Microwave Symposium Digest
1967 G-MTT International Microwave Symposium Digest
1971 IEEE GMTT International Microwave Symposium Digest
MTT-S
{ IEEE XPLORE (67-), IU indianapolis TK7876.I18, OSU online & sel TK7876.I463, PU hicks 621.3813In75, UC online, UK online & eng TK7876.I18a, UL kersey TK7876.I18a, UM online, UT hodges TK7876.I18 (many other universities also subscribe to IEEE XPLORE), }
4 items found as of 8/3/2021
67-20 checked 8/3/2021

--------------------------------------------------------
IEEE Nanotechnology Express
{ IEEE XPLORE (v1), }
1 item found as of 8/4/2021
v1(15) checked 8/4/2021

--------------------------------------------------------
IEEE Nanotechnology Magazine
{ IEEE XPLORE (v1#1-), (many other universities also subscribe to IEEE XPLORE), }
4 items found as of 8/4/2021
v1#1-v15#4(21) all issues checked 8/4/2021

--------------------------------------------------------
2013 IEEE Nuclear Science Symposium and Medical Imaging Conference
2003 IEEE Nuclear Science Symposium Conference Record
IEEE Nuclear Science Symposium Conference Record
{ IEEE XPLORE (90-), UK online, UM online, (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/3/2021
03-19 checked 8/3/2021 (about 1200 papers each time)

*** here for IEEE XPLORE 8/3/2021 *** about 0.1 per year --------------------------------------------------------
IEEE Potentials
{ IEEE XPLORE (v7#1-), UK online, UM online (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/4/2021
v7#1-v40#4(21) checked 8/4/2021

--------------------------------------------------------
IEEE Power Engineering Society

{ OSU TK5I351 & TK5I2, UK TK5.I25 & TK5.I252 & TK5.I34, UL TK1001.I235, UM TK5.I12, }
(new reference 12/23/2013)
Dang 1985 paper 362-9

Martzloff Summer 1985

Mukae 1987 paper 219-9

Feser paper 88 1988 Winter

--------------------------------------------------------
2010 IEEE Radio and Wireless Symposium
1998 IEEE Radio and Wireless Conference Proceedings of Radio and Wireless Conference
RWS
RAWCON
{ IEEE XPLORE (98-04,06-), other universities also subscribe to IEEE XPLORE), }
3 items found as of 8/3/2021
98-04,06-21 checked 8/3/2021

--------------------------------------------------------
2000 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, Digest of Papers
RFIC
{ IEEE XPLORE (97-), UK online, UM online, (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
97-21 all issues checked 8/3/2021

--------------------------------------------------------
2007 IEEE Region 10 Conference
2005 IEEE Region 10
IEEE Region 10 Annual International Conference, Proceedings
IEEE Region 10 Conference on Convergent Technologies for the Asia-Pacific
TENCON
{ IEEE XPLORE (89-), UK online & eng TK7801.T74 & TK7885.T15, UM online (many other universities also subscribe to IEEE XPLORE), }
6 items found as of 8/3/2021
89-20 checked 8/3/2021

--------------------------------------------------------
IEEE Robotics and Automation Letters
{ IEEE XPLORE (V1#1-), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/4/2021

v1#1-v6#4(21) all issues checked 8/4/2021

--------------------------------------------------------
IEEE Robotics & Automation Magazine
{ IEEE XPLORE (v1#1-), (many other universities also subscribe to IEEE XPLORE), }
15 items found as of 8/4/2021
v1#1-v28#2(21) all issues checked 8/4/2021

--------------------------------------------------------
IEEE Sensors Journal
{ IEEE XPLORE (v1#1-), }
3 items found as of 8/4/2021
v1#1-v21#15(21) all issues checked 8/4/2021

--------------------------------------------------------
IEEE SoutheastCon 2010
IEEE Southeastcon '83
{ IEEE XPLORE (81,88-), (many other universities also subscribe to IEEE XPLORE), }
5 items found as of 8/3/2021
81,88-21 checked 8/3/2021

(new reference 12/23/2013)
Watson 1983 pp. 27-30

--------------------------------------------------------
IEEE Spectrum
{ IEEE XPLORE (v1#1-), (many other universities also subscribe to IEEE XPLORE), }
14 items found as of 8/4/2021
v1#1-v58#8(21) all issues checked 8/4/2021

--------------------------------------------------------
2010 IEEE Symposium on Product Compliance Engineering
IEEE Symposium on Product Compliance Engineering
2009 IEEE Symposium on Product Compliance Engineering Proceedings
2006 IEEE Symposium on Product Safety & Compliance Engineering
PSES { IEEE XPLORE (05-), UM online? (many other universities also subscribe to IEEE XPLORE), }
19 items found as of 8/3/2021
04-19 all issues checked 8/3/2021

--------------------------------------------------------
IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging
2007 IEEE Electrical Performance of Electronic Packaging
Digest of 11th IEEE Topical Meeting on Electrical Performance of Electronic Packaging
IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems
Proceedings IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging
Proceedings of the IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging
Proceedings of the 12th Topical Meeting on Electrical Performance of Electronic Packaging
4th Topical Meeting on Electrical Performance of Electronic Packaging Proceedings
EPEP
{ IEEE XPLORE (92-), OSU online, UC depos TK7800.I26, UK online, UM online, (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
92-20 all issues checked 8/3/2021

--------------------------------------------------------
IEEE Transactions on Advanced Packaging
{ IEEE XPLORE (v22#1-v33#4), Lexmark, OSU online & TK7870A1I2723, UC online & eng TK7869.I184, UD online & roesch 2nd, UK online & eng TK1.I5340, UL online & kersey TK7869.I182, UM online, UT online & hodges TK7800.I543 (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/2/2021
v22#1-v33#4(10, ended publication) all issues checked 8/2/2021

--------------------------------------------------------
IEEE Transactions on Antennas and Propagation
{ IEEE XPLORE (v11#1-), UK online & eng TK7800.I2, (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/4/2021
v11#1-v13#6(65), v59#1(11)-v69#8(21) checked 8/4/2021

," IEEE Transactions on Antennas and Propagation, vol. 13 no. 6, pp. , 1965.

*** here for IEEE XPLORE 8/4/2021 *** about 0.1 per year --------------------------------------------------------
IEEE Transactions on Automation Science and Engineering
{ IEEE XPLORE (v1#1-), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/4/2021
v1#1-v18#3(21) all issues checked 8/4/2021

--------------------------------------------------------
IEEE Transactions on Component Parts
{ IEEE XPLORE (v10#1-v12#1), (many other universities also subscribe to IEEE XPLORE), }
13 items found as of 8/2/2021
v10#1-v12#1(65, ended publication) all issues checked 8/2/2021

--------------------------------------------------------
IEEE Transactions on Components and Packaging Technologies
{ IEEE XPLORE (v22#1-V33#4), OSU online & sel TK7870.A1I27225, UC online & eng TK7869.I1825, UD online & roesch 2nd, UK online & eng TK7869.I183, UL online & kersey TK7869.I18, UM online, UT hodges online & TK7800.I54, UTo carlson, WSU online & sci (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/2/2021
v22#1-v33#4(10, ended publication) all issues checked 8/2/2021

--------------------------------------------------------
IEEE Transactions on Components, Hybrids, and Manufacturing Technology
{ IEEE XPLORE (v1#1-v16#8), Lexmark, OSU online & sel TK7870.A1I2722, UC online & eng TK7869.I18, UD online & roesch, UK online & eng TK1.I530, UL online & kersey TK7869.I18, UM online, UT hodges TK7800.I54 92-93 (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/2/2021
v1#1-v16#8(93, ended publication) all issues checked 8/2/2021

--------------------------------------------------------
IEEE Transactions on Components, Packaging, and Manufacturing Technology
{ IEEE XPLORE (v17#1-v21#4,v1#1-), Lexmark, OSU online & sel TK7870.A1I2723, UC online & TK7869.I18, UD online & roesch 2nd, UK online & eng TK7869.I183, UL TK7800.I543 Part A 94-98 Part B 94-98 Part C 96-98 (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/4/2021
v17#1-v21#4,v1#1-v11#7(21) all issues checked 8/4/2021

," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 11 no. 7, pp. , July 2021.

--------------------------------------------------------
IEEE Transactions on Computers
{ IEEE XPLORE (v17#1-), UK online & eng TK7885.A1I2, (many other universities also subscribe to IEEE XPLORE), }
3 items found as of 8/4/2021
v17#1-v20#12(71), v59#1(10)-v70#8(21) checked 8/4/2021

," IEEE Transactions on Computers, vol. C-20 no. 12, pp. , 1971.

*** here for IEEE XPLORE 5/25/2021 *** about 0.2 per year --------------------------------------------------------
IEEE Transactions on Device and Materials Reliability
{ IEEE XPLORE (v1#1-), NWU online & sci 621.38105I225, OSU online & sel TK7800I214, PU online & eng 621.38105Ie2, UC online, UD online, UIC online & daley TK7870.23.I34, UK online & eng TK7870.23.I34, UL online & kersey TK7870.23.I34, UM online, UT online & hodges TK7870.23.I34 (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/4/2021
v1#1-v21#2(21) all issues checked 8/4/2021

--------------------------------------------------------
IEEE Transactions on Dielectrics and Electrical Insulation
IEEE Transactions on Electrical Insulation
{ IEEE XPLORE (v1#1-), UD online & roesch, UM online (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/4/2021
v1#1-v28#3(21) all issues checked 8/4/2021

," IEEE Transactions on Dielectrics and Electrical Insulation, vol. 28 no. 2, pp. , Apr. 2021.

--------------------------------------------------------
IEEE Transactions on Electromagnetic Compatibility
{ IEEE XPLORE (v6#1-), TTU online, UK online, UM online? (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/4/2021
v6#1-v63#3(21) checked 8/4/2021

," IEEE Transactions on Electromagnetic Compatibility, vol. 63 no. 2, pp. , 2021.

-------------------------------------------------------
IEEE Transactions on Electron Devices
IRE Transactions on Electron Devices
{ IEEE XPLORE (v10#1-), UK online & eng TK7870.I2, (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/4/2021
v10#1-v68#8(21) checked 8/4/2021

--------------------------------------------------------
IEEE Transactions on Electronics Packaging Manufacturing
IEEE Transactions on Electronics Packaging and Manufacturing
{ IEEE XPLORE (v22#1-v33#4), CSULA north TK7836.I423, RU fondren TK7870.I643, UK online & eng TK7869.I1850, UM online, USC TK7836.I423, UT online & hodges TK7800.I544, UTo online & carlson, WSU online & sci (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/2/2021
v18#1-v21#2,v22#1-v33#4(98, ended publication) all issues checked 8/2/2021

--------------------------------------------------------
IEEE Transactions on Industrial Electronics
{ IEEE XPLORE (v29#1-), UK online & eng TK7800.I22, (many other universities also subscribe to IEEE XPLORE), }
18 items found as of 8/4/2021
v29#1-v68#11(21) checked 8/4/2021

," IEEE Transactions on Industrial Electronics, vol. 67 no. 4, pp. , Apr. 2020.

--------------------------------------------------
IEEE Transactions on Industry Applications
IEEE Transactions on Industry and General Applications
{ IEEE XPLORE (v8#1-), UK online & eng TK1.I39 & remote TK1.I39, (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/4/2021
v8#1(72)-v57#4(21) checked 8/4/2021

," IEEE Transactions on Industry Applications, vol. 56 no. 3-2, pp. 2021.

--------------------------------------------------------
IEEE Transactions on Instrumentation and Measurement
{ IEEE XPLORE (v12#1-), (many other universities also subscribe to IEEE XPLORE), }
13 items found as of 8/4/2021
v12#1-v70#1(21) checked 8/4/2021

--------------------------------------------------------
IEEE Transactions on Magnetics
{ IEEE XPLORE (v1#1-), UK online & remote TK454.4.M3I48, (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/4/2021
v1#1-v57#8(21) all issues checked 8/4/2021

--------------------------------------------------------
IEEE Transactions on Manufacturing Technology
{ IEEE XPLORE (v1#1-v6#4), (many other universities also subscribe to IEEE XPLORE), }
items found as of 8/2/2021
v1#1-v6#4(77, ended publication) all issues checked 8/2/2021

--------------------------------------------------
IEEE Transactions on Microwave Theory and Techniques
{ IEEE XPLORE (v11#1-), Lexmark, UK online, UM online, UT online (many other universities also subscribe to IEEE XPLORE), }
16 items found as of 8/4/2021
v11#1-v69#7(21) checked 8/4/2021

--------------------------------------------------------
IEEE Transactions on Mobile Computing
{ IEEE XPLORE (v1#1-), UK online & remote QA76.59.I53, (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/4/2021
v1#1-v20#9(21) all issues checked 8/4/2021

--------------------------------------------------------
IEEE Transactions on Nanotechnology
{ IEEE XPLORE (v1#1-), }
>=20 items found as of 8/4/2021
v1#1-v20#1(21) all issues checked 8/4/2021

--------------------------------------------------------
IEEE Transactions on Nuclear Science
{ IEEE XPLORE (v10#1-), UK online & TK9001.I2, (many other universities also subscribe to IEEE XPLORE), }
7 items found as of 8/4/2021
v10#1-v12#6(65), v60#1(13)-v68#7(21) checked 8/4/2021

," IEEE Transactions on Nuclear Science, vol. 68 no. 5-1, pp. , 2021.

*** here for IEEE XPLORE 4/4/2021 *** about 0.6 per year --------------------------------------------------------
IEEE Transactions on Parts, Hybrids, and Packaging
{ IEEE XPLORE (v7#2-v13#4), (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/2/2021
v7#2-v13#4(71, ended publication) all issues checked 8/2/2021

--------------------------------------------------------
IEEE Transactions on Parts, Materials, and Packaging
{ IEEE XPLORE (v1#1-v7#1), (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/2/2021
v1#1-v7#1(71, ended publication) all issues checked 8/2/2021

--------------------------------------------------------
IEEE Transactions on Plasma Science
{ IEEE XPLORE (v1#1-), OSU online & sel QC717.6I3, UC eng TA2001.I18, UD online & roesch 2nd, UK online & eng TA2001.I18a, UL online & TA2001.I18, UM online, UT online & hodges QC717.6.I44, (many other universities also subscribe to IEEE XPLORE), }
19 items found as of 8/4/2021
v1#1-v49#7(21) all issues checked 8/4/2021

," IEEE Transactions on Plasma Science, vol. 49 no. 5, pp. , May 2021.

--------------------------------------------------------
IEEE Transactions on Power Delivery
{ IEEE XPLORE (v1#1-), UK online & remote TK3001.I330, (many other universities also subscribe to IEEE XPLORE), }
5 items found as of 8/4/2021
v1#1-v36#4(21) all issues checked 8/4/2021

--------------------------------------------------------
IEEE Transactions on Power Electronics
{ IEEE XPLORE (v1#1-), (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/4/2021
v1#1-v36#11(21) all issues checked 8/4/2021

--------------------------------------------------------
IEEE Transactions on Product Engineering and Production
{ IEEE XPLORE (v7#1-v9#1), (many other universities also subscribe to IEEE XPLORE), }
items found as of 8/2/2021
v7#1-v9#1(ended publication) all issues checked 8/2/2021

--------------------------------------------------
IEEE Transactions on Reliability
{ IEEE XPLORE (v12#1-), FAU online & wimberly TK7800.I16, FIU online & green TK7800.I16, UK online, UM online, UMi online & richter TK7800.I16 (many other universities also subscribe to IEEE XPLORE), }
9 items found as of 8/4/2021
v12#1-v70#2(21) checked 8/4/2021

--------------------------------------------------------
IEEE Transactions on Robotics
IEEE Transactions on Robotics and Automation
IEEE Journal on Robotics and Automation
{ IEEE XPLORE (v20#4-), (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/4/2021
v20#4-v37#3(21) checked 8/4/2021

," IEEE Transactions on Robotics, vol. 37 no. 2. pp. , 2021.

--------------------------------------------------------
IEEE Transactions on Software Engineering
{ IEEE XPLORE (v1#1-), UK online & remote QA76.6.I17, (many other universities also subscribe to IEEE XPLORE), }
3 items found as of 8/4/2021
v1#1-v7#6(81), v31#1(05)-v47#6(21) checked 8/4/2021

," IEEE Transactions on Software Engineering, vol. SE-7 no. 6, pp. , 1981.

*** here for IEEE XPLORE 8/4/2021 *** about 0.1 per year --------------------------------------------------------
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
{ IEEE XPLORE (v1#1-), UK online & eng TK7874.I3360, (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/4/2021
v1#1-v29#8(21) all issues checked 8/4/2021

--------------------------------------------------------
IEEE Vehicle Power and Propulsion Conference
2005 IEEE Conference Vehicle Power and Propulsion
VPPC
{ IEEE XPLORE (05-), (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
05-20 checked 8/3/2021

--------------------------------------------------------
2013 17th IEEE Workshop on Signal and Power Integrity
Proceedings 9th IEEE Workshop on Signal Propagation on Interconnects
SPI
{ IEEE XPLORE (02,04-), (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
02,04-20 checked 8/3/2021

--------------------------------------------------------
2005 IEEE/ACES International Conference on Wireless Communications and Applied Computational Electromagnetics
{ IEEE XPLORE (05), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
05 checked 8/3/2021

--------------------------------------------------------
IEEE/ACM International Conference on Computer Aided Design
ICCAD
{ IEEE XPLORE (88-), UK eng TK7874.I3235, (many other universities also subscribe to IEEE XPLORE), }
3 items found as of 8/3/2021
88-20 checked 8/3/2021

--------------------------------------------------------
Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium
Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium
Fourth IEEE/CHMT European Electronic Manufacturing Technology Symposium
Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium
Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium
32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium
2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium
1999 IEEE/CPMT International Electronics Manufacturing Technology Symposium
IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium
2004 IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium
IEEE/SEMI STS: International Electronics Manufacturing Technology
1998 IEMT/IMC Proceedings
1st 1997 IEMT/IMC Symposium
31st International Conference on Electronics Manufacturing and Technology
International Electronic Manufacturing Technology 2006
Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference
Proceedings of the Twenty-Fourth IEEE/CPMT Electronics Manufacturing Technology Symposium
Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium
IEMT
IMC
{ IEEE XPLORE (1-2,4-9,11-13,15-18,21-24,26-), AU online & rbd TK7836.I334, FSU dirac TK7881.I34, GIT online, Lexmark, MSU eng TK7881.I5, NWU online, OSU online & sel TS176.I463, PU hicks 621.381In8p, SMU sci TK7836.I4, UC online & microfiche 64 97CM 3606-8, UCB eng TK7881.I51 & pascal TK7881.I51, UCF main TK7836.I55, UF online, UH TK7881.I23, UK online & eng TK7801.I18 & TK7881.I420, UM online, UT hodges TK7836.I55, UTAr sel TK7836.I4, UTD online, (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
1-9,11-38(18) checked 8/3/2021

," (10th IEMT), Tokyo, Japan, 1991.

(9th in Washington D.C. was Oct. 1-2, 1990) (11th was Sept. 16-18, 1991) Proceedings of the 1991 Japan International Electronic Manufacturing Technology Symposium, Tokyo, Japan, June 26-28, 1991.

Proceedings from the 10th IEEE (1991 Japan) International Electronics Manufacturing Technology (IEMT) Symposium,. Tokyo,. Japan, June, 1991.

--------------------------------------------------------
IEEE/CPMT International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
2005 IEEE/CPMT 10th International Symposium on Advanced Packaging Materials International Symposium on Advanced Packaging Materials 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface 2001 International Symposium on Advanced Packaging Materials 8th International Symposium on Advanced Packaging Materials Proceedings 9th International Symposium on Advanced Packaging Materials Proceedings International Symposium on Advanced Packaging Materials, Processes, Properties and Interfaces
APM
{ IEEE XPLORE (97-07,10-11,13-), CMU online & eng TK7870.15.I586 & offsite 621.381046I614P, OSU sel TK7870.15.I586, UK online, UM online, WSU online & sci TK7881.I2 (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
97-07,10-11,13 checked 8/3/2021

--------------------------------------------------------
2002 IEEE/CPMT Photonic Devices and Systems Packaging Symposium
item found as of 1/30/2011 catalog

John H. Lau / Agilent Technologies, Inc., CA S. W. Ricky Lee "Thermal Analysis of Vertical-Cavity Surface-Emitting LED/VCSEL Assembly with Lead-Free Flip Chip Interconnects," 2002 IEEE/CPMT Photonic Devices and Systems Packaging Symposium , Palo Alto, CA, July 14-16, 2002, pp. .

J. Lau, Z. Mei, S. Pang, C. Amsden, J. Rayner and S. Pan "Nonlinear Time and Temperature Dependent Analysis of the Lead-Free Solder Sealing Ring of Photonic Switch," 2002 IEEE/CPMT Photonic Devices and Systems Packaging Symposium , Palo Alto, CA, July 14-16, 2002, pp. .

--------------------------------------------------------
2013 IEEE/RSJ International Conference on Intelligent Robots and Systems
IROS
{ IEEE XPLORE (88-), (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
88-20 checked 8/3/2021

--------------------------------------------------------
2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference
ASMC
{ IEEE XPLORE (90-), UK online, UM online? (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/3/2021
90-21 checked 8/3/2021

--------------------------------------------------------
IEEJ Transactions on Fundamentals and Materials
{ https://www.jstage.jst.go.jp/browse/ieejfms/list/-char/en }
items found as of 1/9/2014

(new reference 1/9/2014)
Takuro Tsuji, Kouji Himeno, and Osamu Fujiwara, "Reduction of Variation in Magnetic Fields and its Experimental Verification for Indirect Discharges of ESD Generators onto Tapered-Type Vertical Coupling Plane," v132#1, pp. 51-56, 2012. https://doi.org/10.1541/ieejfms.132.51

(not at UK, not found) Shigeki Minegishi, "Recent Topics on Electrostatic Discharge ESD from Viewpoint of EMC," v132#5, pp. 335-338, 2012. https://doi.org/10.1541/ieejfms.132.335

(not at UK, not found) Baran, Janusz, and Sroka, Jan, "Frequency Approach to Analysis of ESD Pulse," v132#5, pp. 339-344, 2012. https://doi.org/10.1541/ieejfms.132.339

(not at UK, not found) Ken Kawamata, "Measurement of Radiated Electromagnetic Field due to Low Voltage ESD with Spherical Electrode in 1-3GHz Frequency Bandwidth," v132#5, pp. 345-349, 2012. https://doi.org/10.1541/ieejfms.132.345

(not at UK, not found) Yamanaka, Yukio, Adachi, Takashi, Ishigami, Shinobu, Mori, Ikuko, Taka, Yoshinori, and Fujiwara, Osamu, "Measurement and Validation of Transfer Impedance of IEC Calibration Current Target for Electrostatic Discharge Generators," v132#5, pp. 350-355, 2012. https://doi.org/10.1541/ieejfms.132.350

(not at UK, not found) Y. Yamanaka, F. Toya, S. Ishigami, and O. Fujiwara, "Waveform Distortion of Discharge Rising Currents caused by Built-in Inductor for Contact Discharges of Electrostatic Discharge Generators," v132#5, pp. 362-367, May 2012. https://doi.org/10.1541/ieejfms.132.362

(not at UK, not found) --------------------------------------------------------
IEEJ Transactions on Industry Applications
{ https://www.jstage.jst.go.jp/browse/ieejias/list/-char/en }
item found as of 1/30/2011 catalog

--------------------------------------------------------
IEEJ Transactions on Power and Energy
Denki Gakkai ronbunshi. B, Enerugi
{https://www.jstage.jst.go.jp/browse/ieejpes/list/-char/en AU online, FAU online, FIU online, IU online, LH closed, MIT barker TK.D3933, MST online, NWU online, OkSU online, OSU online, SDSU online, UDe online, UF online, UIC online, UMC online, USF online, UTo online, }
1 item found as of 11/6/2020 catalog
v129#1-v129#9 checked 8/7/2013

--------------------------------------------------------
IEICE EMCJ
Electromagnetic Compatibility Technical Reports (IEICE EMCJ)
Institute of Electronics, Information and Communication Engineers (Japan)
{ }
(new reference 12/23/2013)
Katsura & Kaji EMCJ81-21 1981

Honda, M., and Takeyoshi, K., "ESD Characteristics and Their Effect on Computers," Electromagnetic Com. J., vol. 83 no. 209, pp. 25-30, Dec. 1983

Honda vol. 83 no. 292, pp. 13-17, Mar. 1984;

vol. 85 no. 86, pp. 39-42, July 1985;

vol. 86 no.107, pp 17-22, July 1986.

Honda v 86 p 33-38 Jan 1987

Honda v 88 no 5 p 1-4 1988

Higuchi EMCJ89-6 1989

Tomita EMCJ89-70 1989

Masugi v 90-55 p 83-89 Oct 1990

Honda v 91 p 29-33 Dec 1991

Yokoshima v 93 p 13-18 Oct 1993

--------------------------------------------------------
IEICE Transactions on Communications
{ https://www.jstage.jst.go.jp/browse/transcom/list/-char/en SMU sci, UCF online, UF online, UM online, USC grand, }
>=20 items found as of 8/8/2021 catalog
vE90.B#1(07)-vE104.B#8(21) checked 8/8/2021

*** new reference 3/15/2021 *** Takeshi ISHIDA, Osamu FUJIWARA Combined Effects of Test Voltages and Climatic Conditions on Air Discharge Currents from ESD Generator with Two Different Approach Speeds ," IEICE Transactions on Communications, vol. E103.B no. 12, pp. 1432-1437, Dec. 2020. https://doi.org/10.1587/transcom.2019EBP3191

--------------------------------------------------------
IEICE Transactions on Electronics
IEICE Transactions Electronics
{ https://www.jstage.jst.go.jp/browse/transele/list/-char/en MSU sci, UCF online, UF online, UM online, USC grand, }
13 items found as of 8/8/2021 catalog
vE90.C#8(07)-vE104.C#8(21) checked 8/8/2021

*** new reference 3/16/2021 *** ," IEICE Transactions on Electronics, vol. E104.C no. 6, pp. , June 2021.

Daisaku MUKAIYAMA, Masayoshi YAMAMOTO Effect of Tunnel Pits Radius Variation on the Electric Characteristics of Aluminum Electrolytic Capacitor ," IEICE Transactions on Electronics, vol. E104.C no. 1, pp. 22-33, Jan. 2021. https://doi.org/10.1587/transele.2020ECP5009

--------------------------------------------------------
IET Circuits, Devices & Systems
{ IEEE XPLORE (v1#1-), UD online, UK online, UM online, VU online (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/4/2021
v1#1-v14#8 all issues checked 8/4/2021

--------------------------------------------------------
IET Electronics
IET Communications Engineer
IEE Communications Engineer
{ http://www.iee.org/oncomms/sector/communications/magazine.cfm IEEE XPLORE (v1#1-v5#6), NWU online, OSU online, UD roesch, UK online, UL online & kersey TK6540.R262322, UM online, UT hodges TK5101.A1C64 (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/2/2021
v1#1-v5#6(07,ended publication) all issues checked 8/2/2021

--------------------------------------------------------
IET Electronics Systems and Software
{ IEEE XPLORE (v1#1-v5#6), UM online (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/2/2021
v1#1-v5#6(07,ended publication) all issues checked 8/2/2021

--------------------------------------------------------
IET Manufacturing
IEE Manufacturing Engineer
Manufacturing Engineer
{ IEEE XPLORE (v73#1-), IU online, NWU online, OSU online, PU online & eng 670.5P942, UC eng TJ1180.A1A6, UCI online, UIC online, UK online, UL online, UM online, UT online (many other universities also subscribe to IEEE XPLORE), }
9 items found as of 8/2/2021
v73#1-v86#6(07,ended publication) checked 8/2/2021

--------------------------------------------------------
IET Micro & Nano Letters
{ IEEE XPLORE (v1#1-), }
>=20 items found as of 8/4/2021
v1#1-v15#10(20) all issues checked 8/4/2021
searched for tin whisker(s) and Sn whisker(s) on 8/7/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/7/2020
searched for indium whisker(s) on 8/7/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/7/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight on 8/7/2020

searched for gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 10/10/2020

--------------------------------------------------------
2007 IET Seminar on Micro Electro-Mechanical Systems
{ IEEE XPLORE (07), }
item found as of 8/3/2021
07 checked 8/3/2021

--------------------------------------------------------
IIE Annual Conference and Expo
Proceedings of the 2007 Industrial Engineering Research Conference
{ AU rbd T55.45.I57, GIT T55.45.I49, MIT online & dewey CDROM T58.A2A512, MST wilson T55.45.I49, NEU snell TS5.45.A472a, OkSU main 658.506A512pd, UC eng cdrom T55.45.I145, UM CDROM, UMX175, UOk online, UTA eng cdrom 902, }
2 items found as of 1/30/2011
checked 10/19/2010

--------------------------------------------------------
III-Vs Review
{ https://www.sciencedirect.com/journal/iii-vs-review/issues MST online, OkSU online, OSU online, PU online & chem 621.3815205T4133, SDSU online, UC online, UCI online, UCSD online, UK online, UM online, UOk online, UT online, UTo online, }
1 item found as of 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 12/4/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/4/2020
searched for indium whisker(s) on 12/4/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/4/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/4/2020

-------------------------------------------------------
IMAPS Advanced Passive Technology Workshop
item found as of 1/30/2011 catalog

(new reference 6/8/2009)
H. Windlas, P.M. Raj, S. Bhattacharya and Rao R Tummala, "Optimized Suspension Formulations for Improved Dielectric Properties of Ceramic-polymer Nanocomposites for Integral Capacitor, " IMAPS Advanced Passive Technology Workshop, Denver, CO, April 2000.

--------------------------------------------------------
IMAPS Advanced Technology Workshop on Integrated Passives
Proceedings of the Advanced Technology Workshop on Passive Integration
1 item found as of 12/10/2013 catalog

(new reference 6/8/2009)
S. Bhattacharya, S. Dalmia, D. Balaraman, P. M. Raj, F. Ayazi, M. Swaminathan and R. Tummala, "Fabrication and RF Characterization of Embedded High Q Inductors and Capacitors on Organic Laminates for System-on-Package (SOP) Application", Proceedings of the Advanced Technology Workshop on Passive Integration, Ogniguit, ME, June, 2002.

Raghuveer, R., S., Burkett, L. Schaper, R., Ulrich, B. Rogers, and R. Geil, "Decoupling Capacitors by Reactive, Sputtering and Anodization Processes," Proc. IMAPS Advanced Technology Workshop on Passive Integration, Marco Island, FL, January 2005.

Schaper, L., and R. K., Ulrich, "Electrical Performance Limitations of On-Package Decoupling Capacitors," IMAPS Advanced Technology Workshop on Integrated Passives, January 2005.

Ulrich, R., L. Schaper, and V. Joshi, "Decoupling Simulation for Embedded Capacitors," IMAPS Advanced Technology Workshop on Integrated Passives, January 2005.

P. Markondeya Raj, Devarajan Balaraman, Vinu Govind, Isaac Robin Abothu, Swapan Bhattacharya, Madhavan Swaminathan and Rao Tummala, "supercapacitive nanocomposite thin films suitable for embedded decoupling capacitors", Accepted for International Workshop on Integrated Passives, Marco Island, International International Microelectronics and Packaging Society, to be held during January 25-26, 2005.

--------------------------------------------------------
IMAPS International Conference on Emerging Microelectronics
item found as of 1/30/2011 catalog

(new reference 6/8/2009)
O. Misman, Swapan Bhattacharya, Ahmet Erbil, and Rao Tummala, "PWB Compatible Thick and Thin Film Integral Capacitors, " IMAPS International Conference on Emerging Microelectronics, EMIT 2K, Bangalore, India, February 2000, TP6-1, pp. 143-150.

--------------------------------------------------------
Implementing Lead-Free Electronics Workshop
1 item found as of 1/30/2011 catalog

-------------------------------------------------------
Impurities and Imperfections
{ OSU depos TN690.A53, UC sw depos TN690.A565, UK eng TN690.A54, UM offsite TN690.A4935, UT hodges TN690.A54, VU sci TN690.A54, }
1 item found as of 1/30/2011

--------------------------------------------------------
IN Compliance Magazine
{ http://www.incompliancemag.com/ }
12 items found as of 6/16/2018
Jan10-dec14,oct15,dec15-feb16,may16-jun16,oct17,dec17 checked 6/16/2018

--------------------------------------------------------
IN Compliance Magazine 2010 Annual Guide
IN Compliance 2012 Annual Reference Guide
{ http://www.incompliancemag.com/ }
8 items found as of 1/22/2017
10-14,16 checked 1/22/2017

--------------------------------------------------------
Indian Journal of Pure & Applied Physics
{ http://op.niscair.res.in/index.php/IJPAP/issue/archive MST online, OkSU online, OSU depos QC1I3915, SIUC morris 52815-5301, UCSD s&e QC1.I3935, UK online & king QC1.I53, UOk bizzell QC1.I53, }
1 item found as of 1/20/2021

--------------------------------------------------------
Industrial and Engineering Chemistry
{ https://pubs.acs.org/loi/iechad MST online, NWU online & sci 660.5A613, OSU sel TP1J861 & depos TP1J861, PU eng 624.1Am28a & 660.05An78 & hicks 660.5In2 & 660.5In2n, SDSU online, SIUC online, SIUE storage, UAr mullins TP1.C35, UCSD online, UD roesch, UE, UIC daley TP1.C35 & warehouse TP1.I6, UK online, UL kersey TP1.I6 & TP1.C35 & TP1.I615, UM online & shapiro TP1.I62 & buhr RA421.I38 & buhr TP1.I62, USD online, UT online & hodges closed TP1.I6, }
1 item found as of 1/20/2021
checked 1/20/2021

searched for tin whisker(s) and Sn whisker(s) on 1/23/2021
searched for zinc whisker(s) & Zn whisker(s) on 1/23/2021
searched for indium whisker(s) on 1/23/2021
searched for cadmium whisker(s) & Cd whisker(s) on 1/23/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 1/23/2021

--------------------------------------------------------
Industrial Control Design Line
{ http://www.industrialcontroldesignline.com/ }
>=20 items found as of 1/30/2011
checked 4/4/2009

--------------------------------------------------------
Industrial-Ecology UC-Discovery Grant Research Symposium: Electronic Design, Manufacturing, and the Environment
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Industrial Engineering Chemical Research
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Industrial Finishing
{ AU rbd TT325.A1I6, FIT online, GIT online & main TT300.I45X, MST online, OkSU stillwater 698.305I42, PU eng 667.605In2, SIUC morris 52825-6671, UAr mullins per microfiche, UK online, UL kersey TT325.A1I6, UM online, UOk online, USD online, UT online, WSU online & storage, }
1 item found as of 1/20/2021

--------------------------------------------------------
Industry News
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Industry Week
{ http://www.industryweek.com/ MST online, OkSU online, SDSU online, SIUC online, SIUE lovejoy microfiche, UAr online, UCSD online, UK online, UOk online, USD online, }
4 items found as of 6/202021
Jan04-Apr09 checked 6/20/2021

--------------------------------------------------------
Information Display
{ https://onlinelibrary.wiley.com/loi/2637496x FIU green TK7882.I6I6, Lexmark, PU hicks 001.55505In3, SIUC morris 52837-6211, UAr online, UCSD s&e TK1.S2, UNCC TK7882.I6, UPi storage, UTor eng TK7882.I6I6, UWa davis TK7882.I6I6, }
2 items found as of 8/11/2021 catalog
v2#5-v7#12,v19#1-v37#4(21) checked 8/11/2021

--------------------------------------------------------
Infowarrior
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
InfoWorld
{ OSU online, UC online, UD online, UK online, UL online, UM online, UT online, VU online, }
6 items found as of 1/20/2021

--------------------------------------------------------
InLCA/LCN 2006 Conferencia Internacional Ciclo de Vida
InLCA/LCM Internet Conference
International Life Cycle Assessment and Management xxxx
{ http://lcacenter.org/LCA8/program.html checked 4/4/2009 http://www.lcacenter.org/InLCA2007/program.html checked 4/4/2009 http://www.lcacenter.org/InLCA2006/sessions.html checked 4/4/2009 http://www.lcacenter.org/cilca2005.html http://www.lcacenter.org/InLCA2004/sessions.html checked 4/4/2009 http://lcacenter.org/InLCA-LCM03/Technical_Program.htm checked 4/4/2009 http://www.lcacenter.org/lca-lcm/index.html checked 4/4/2009 http://www.lcacenter.org/InLCA/agenda.htm checked 4/4/2009, BYU online, IU online, }
4 items found as of 3/16/2021 catalog
00-04,06-08 checked 3/16/2021

"," Conferencia Internacional Ciclo de Vida, San Jose, Costa Rica, Apr. 25-28, 2005, pp. .

--------------------------------------------------------
Innovation
{ http://www.shimadzu.com/about/magazine/index.html, UAr online, UCSD online, UK online, USD online, }
1 item found as of 6/20/2021 catalog
#26-#37 checked 6/20/2021

--------------------------------------------------------
Inorganic Materials
{ https://link.springer.com/journal/10789/volumes-and-issues KYVL, MST online, NWU sci 620.11I58, OkSU online, OSU online & depos TN4A51, PU online & chem 620.11In7, SDSU online, SIUC morris 56056-5461, UAr online, UC online, UCSD online, UD roesch, UIC online & warehouse TN4.A334643, UK online, UL kersey TN4.A334643, UM online, USD online, UT online, }
5 items found as of 1/20/2021
searched for tin whisker(s) & Sn whisker(s) on 9/2/2020
searched for zinc whisker(s) & Zn whisker(s) on 9/2/2020
searched for indium whisker(s) on 9/2/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/2/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/2/2020

--------------------------------------------------------
Inside Supply Management
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Institute
{ SIUC online, UCSD online, }
1 item found as of 1/30/2011
v33#2 checked 11/9/2009

--------------------------------------------------------
The Institution of Engineering and Technology Seminar on MEMS Sensors and Actuators 2006
{ IEEE XPLORE (06), }
item found as of 8/3/2021
06 checked 8/3/2021

--------------------------------------------------------
Institute of Metal Finishing Annual Technical Conference and Exhibition
{ LH TS653.A1I52, }
1 item found as of 1/30/2011 catalog

Smart, D, Such, T. E.; Wake, S. J. NOVEL TRIVALENT CHROMIUM ELECTROPLATING BATH. Technical Papers, Annual Technical Conference and Exhibition - Institute of Metal Finishing, vol. 1, 1983, pp. 41-72

--------------------------------------------------------
Institute of Physical Chemistry, Academy of Sciences of the USSR
{ }
item found as of 2/8/2011 catalog

(new reference 2/8/2011)
Gerbunova, K.M., and V.K. Glazaunova, "Present State of the Problem of Spontaneous Growth of Whisker Crystals on Electrolytic Coatings," Institute of Physical Chemistry, Academy of Sciences of the USSR, vol. 20, no. 3, pp. 342-358, 1984.

--------------------------------------------------------
Instruments and Experimental Techniques
{ https://link.springer.com/journal/10786/volumes-and-issues EBSCOA, AU online, BYU hbll QC53.P213, FSU online, GIT online, IU online, LH closed, LU gray QC53.P213, MoSU QC53.P2132, MST online, NWU online, OGI online, OkSU online, OrSU valley QC53P72, OSU online, PU online, RU fondren QC53.P213, SDSU online, SU online, SIUC online, UAB sterne QC53.P213, UAH online, UAr online, UC online, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UIUC online, UK online, UM online & shapiro QC1.P893 & buhr Q184.P943, UMC online, UNF online, UOk online, USD online, USF online, USU online, UT online, UTA online, UTo online, WrSU online, }
2 items found as of 8/6/2021
v46#3-v64#4(21) checked 8/6/2021

--------------------------------------------------------
Insulation/Circuits
Insulation
{ OSU depos TK1.I55, PU hicks 621.305In7, SIUC storage 56143-6211, SMU storage. UIC warehouse TK1.I46, UM buhr TK1.I597, UT hodges TK3331.I68, }
4 items found as of 1/30/2011 catalog

--------------------------------------------------------
Integrated System Design
{ UM offsite TK7874.A761, USC TK7874.A76, UT online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Integration of Photonics into the Manufacturing Process
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Intel Halogen Free Symposium
>=20 items found as of 1/30/2011 catalog
08 checked 9/22/2008

--------------------------------------------------------
Intel Technology Journal
{ http://www.intel.com/technology/itj/ EBSCOB, CSULA online, CSULB online, GIT online, OSU online, UCF online, UF online, UK online, UM online, UPi online, USC online, UT online, VU online, }
7 items found as of 8/6/2021 catalog
v1#1-v19#1(15) all issues checked 8/6/2021

--------------------------------------------------------
Interactive Week
{ OSU online, UK online, UM online, VU online, }
1 item found as of 1/20/2021

--------------------------------------------------------
Interface Science
{ https://link.springer.com/journal/10793/volumes-and-issues FAU online, FIU online, MST online, OkSU online, OSU online & sel QD506.A1I55, PU online, SDSU online, SIUC online, UC online, UCSD online, UD online, UIC online, UK online, UM online, UMi online, USD online, UT online, }
2 items found as of 8/2/2021
v1#1-v12#4(ended publication) all issues checked 8/2/2021
searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

--------------------------------------------------------
Interference Technology
{ http://www.interferencetechnology.com/, }
items found as of 1/30/2011 catalog
checked 1/30/2011

--------------------------------------------------------
Interference Technology Annual Guide 2003
{ http://www.interferencetechnology.com/, }
1 item found as of 1/30/2011 catalog
03 checked 1/30/2011

Annual Guide 2003, pp. 160-173, 2003. --------------------------------------------------------
Interference Technology EMC Design & Test Guide 2004
{ http://www.interferencetechnology.com/, }
1 item found as of 12/29 catalog
04,15 checked 12/29/2015

--------------------------------------------------------
Interference Technology 2008 EMC Directory & Design Guide
Interference Technology EMC Directory & Design Guide 2007
{ http://www.interferencetechnology.com/ }
10 items found as of 6/10/2019 catalog
05,07-13,15-16,18-19 checked 6/10/2019

--------------------------------------------------------
Interference Technology 2008 EMC Test & Design Guide
Interference Technology EMC Test & Design Guide 2003
{ http://www.interferencetechnology.com/ }
10 items found as of 1/2/2014 catalog
03,07-14 checked 1/2/2015

--------------------------------------------------------
Interference Technology Europe EMC Guide
{ http://www.interferencetechnology.com/, }
items found as of 2/15/2014 catalog
12 checked 2/15/2014

--------------------------------------------------------
Intermetallics
{ https://www.sciencedirect.com/journal/intermetallics/issues AU online, CSULB online, FSU online, GIT online, LH closed, MST online, NWU online, OkSU online, OSU online, PU online, RU online, SDSU online, UC online, UCF online, UCI online, UCSD online, UD online, UDe online, UF online, UIC online, UK online (pay), UM online, UMC online, UOk online, USC grand, USD online, USF online, USU online, UT online, UTA online, UTo online, WrSU online, }
>=20 items found as of 8/8/2021
v14#1-v136(21) checked 8/8/2021
," Intermetallics, vol. 128, pp. , Jan. 2021.

searched for tin whisker(s) and Sn whisker(s) on 12/4/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/4/2020
searched for indium whisker(s) on 12/4/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/4/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/4/2020

(new reference 12/4/2020)
dudek, m. a., and chawla, n., "nanoindentation of rare earth-sn intermetallics in pb-free solders," intermetallics, vol. 18 no. 5, pp. 1016-1020, may 2010. https://doi.org/10.1016/j.intermet.2010.01.028

belyakov, s. a., and gourlay, c. m., "nisn4 formation during the solidification of sn-ni alloys," intermetallics, vol. 25, pp. 48-59, june 2012. https://doi.org/10.1016/j.intermet.2012.02.010

Boulet, P, D MazzoneR Ferro The system Ce–Ag–Sn: phase equilibria and magnetic properties Intermetallics Volume 7, Issue 8, August 1999, pp. 931-935 https://doi.org/10.1016/S0966-9795(98)00144-7

Chen, Shanxing, Wei ZhouPing Wu The structural, elastic, electronic and thermodynamic properties of hexagonal ?-Cu6-xNixSn5 (x = 0, 0.5, 1, 1.5 and 2) intermetallic compounds Intermetallics Volume 54, November 2014, pp. 187-192 https://doi.org/10.1016/j.intermet.2014.06.009

Coreño-Alonso, O., x Unit cell volume of intermetallic compounds calculated using volume size factors Intermetallics Volume 14, Issue 5, May 2006, pp. 475-482 https://doi.org/10.1016/j.intermet.2005.05.014

Huang, Yu-Chih, Wojciech GierlotkaSinn-Wen Chen Sn–Bi–Fe thermodynamic modeling and Sn–Bi/Fe interfacial reactions Intermetallics Volume 18, Issue 5, May 2010, pp. 984-991 https://doi.org/10.1016/j.intermet.2010.01.026

Nogita, Kazuhiro, x Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys Intermetallics Volume 18, Issue 1, January 2010, pp. 145-149 https://doi.org/10.1016/j.intermet.2009.07.005

Schmetterer, Clemens, Hans FlandorferHerbert Ipser A new investigation of the system Ni–Sn Intermetallics Volume 15, Issue 7, July 2007, pp. 869-884 https://doi.org/10.1016/j.intermet.2006.10.045

Schmetterer, Clemens, Divakar RajamohanHans Flandorfer The high-temperature phase equilibria of the Ni–Sn–Zn system: Isothermal sections Intermetallics Volume 19, Issue 10, October 2011, pp. 1489-1501 https://doi.org/10.1016/j.intermet.2011.05.025

Vassilev, G. P., K. I. LilovaJ. C. Gachon Calorimetric and phase diagram studies of the Co–Sn system Intermetallics Volume 15, Issue 9, September 2007, pp. 1156-1162 https://doi.org/10.1016/j.intermet.2007.02.006

Zanicchi, G., D. MazzoneR. Ferro Yb–Cu–Sn system: the isothermal section at 400°C Intermetallics Volume 7, Issue 8, August 1999, pp. 957-966 https://doi.org/10.1016/S0966-9795(99)00003-5

--------------------------------------------------------
Internal Conference on Lead Free Electronics
item found as of 1/30/2011 catalog

Use of Lead Free Solder Alloys in Electrical & Electronic Devices for the Automotive Industry Internal Conference on Lead Free Electronics, Soldertec. IPC. Junio 2003 pag 409.

--------------------------------------------------------
The 1991 International Aerospace and Ground Conference on Lightning and Static Electricity
{ MSU storage microfiche NASA CP-2356, OSU sel TL521.3.N28, UC online & ceas microfiche NASA N85-16343, UK storage microfiche NAS1.55:2356, UL ekstrom gov microforms NAS1.55:2356, USC grand, UT hodges microfiche C55.13/6:AE8, UTAr central gov microfiche C 55.13/6:AE8, UTD us microfiche NAS1.55:2356, VU central gov C55.13/6:AE8 & central gov C55.13/6:AG8/ADD, }
1 item found as of 1/30/2011

--------------------------------------------------------
3rd International Brazing and Soldering Conference, Apr. 23-27, 2006, San Antonio, TX.
{ UPi online, USC online, }
2 items found as of 1/30/2011 catalog

Martin, J. J., Vianco, Paul Thomas, Hlava, Paul Frank, Rejent, Jerome Andrew ; Susan, Donald Francis Evaluation of the effects of Au content on intermetallic compound layer growth in Pb-Sn and Sn-Ag-Cu solder joints.

--------------------------------------------------------
(new source 6/20/2020)
11th International Components for Military and Space Electronics Conference Mar. 12-15, 2007
CMSE
{ }
12th International Components for Military and Space Electronics Conference (CMSE 08), San Diego, California,. February 11-14, 2008
13th International Components for Military and Space Electronics Conference (CMSE 09), San Diego, California,. February 9-12, 2009
1 item found as of 6/22/2020

--------------------------------------------------------
2011 International Conference and Seminar of Young Specialists on Micro/Nanotechnologies and Electron Devices
2010 International Conference and Seminar on Micro/Nanotechnologies and Electron Devices
{ IEEE XPLORE (10-), (many other universities also subscribe to IEEE XPLORE), }
4 items found as of 8/3/2021
10-20 checked 8/3/2021

--------------------------------------------------------
2002 International Conference on Advanced Packaging and Systems
{ GIT, UCSD s&e TK7870.15.I5733, UOk bizzell TK7870.15.I38, UTor eng TK7870.15.I574, UWa davis TR5.S6x, }
1 item found as of 1/30/2011 catalog
02

--------------------------------------------------------
2011 15th International Conference on Advanced Robotics
ICAR
{ IEEE XPLORE (91,93,97,05,09,11,13,15,17,19), }
19 items found as of 8/3/2021
91,93,97,05,09,11,13,15,17,19 checked 8/3/2021

--------------------------------------------------------
2012 Ninth International Conference on Advanced Semiconductor Devices and Microsystems
{ IEEE XPLORE (98,00-12,14-16,18,20), (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/3/2021
98,00-12,14-16,18,20 checked 8/3/2021

--------------------------------------------------------
The 1998 International Conference on Advances in Welding Technology
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
4th International Conference on Antennas and Propagation
International Conference on Antennas and Propagation
{ IEEE XPLORE (89,91,03), (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/3/2021
89,91,03 checked 8/3/2021

--------------------------------------------------------
2010 International Conference on Applied Electronics
{ IEEE XPLORE (06.09-), (many other universities also subscribe to IEEE XPLORE), }
3 items found as of 8/3/2021
06,09-20 checked 8/3/2021

--------------------------------------------------------
2017 2nd International Conference on Automation, Cognitive Science, Optics, Micro Electro--Mechanical System, and Information Technology
ICACOMIT
{ IEEE XPLORE (15,17), }
item found as of 8/3/2021
15,17 checked 8/3/2021

--------------------------------------------------------
2013 13th International Conference on Autonomous Robot Systems
{ IEEE XPLORE (13), }
1 item found as of 8/3/2021
13 checked 8/3/2021

--------------------------------------------------------
2004 International Conference on Business of Electronic Product Reliability and Liability
International Conference on Business of Electronic Product Reliability and Liability
Proceedings International IEEE Conference on Business of Electronic Product Reliability and Liability
{ IEEE XPLORE (04), UK online (many other universities also subscribe to IEEE XPLORE), }
8 items found as of 8/3/2021 catalog
04 checked 8/3/2021

R. Schetty, Y. Zhang, and K. Hwang, "Whisker growth: The substrate effect and beyond," in Proc. IEEE Conf. Electronic Product Reliability and Liability Shenzen, China, Jan. 2003, pp. 1-5.

--------------------------------------------------------
2009 International Conference on Clean Electrical Power
ICCEP
{ IEEE XPLORE (07,09,11,13,15,17,19), (many other universities also subscribe to IEEE XPLORE), }
6 items found as of 8/3/2021
07,09,11,13,15,17,19 checked 8/3/2021

--------------------------------------------------------
2001 International Conference on Computer Design
ICCD
{ IEEE XPLORE (88-), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
88-20 checked 8/3/2021

--------------------------------------------------------
2011 3rd International Conference on Computer Research and Development
ICCRD
{ IEEE XPLORE (10-11,21), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
10-11,21 checked 8/3/2021

--------------------------------------------------------
2012 International Conference on Computer Science & Service System
CSSS
{ IEEE XPLORE (11-), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
11-12 checked 8/3/2021

--------------------------------------------------------
2010 11th International Conference on Control Automation Robotics & Vision
ICARCV
{ IEEE XPLORE (02,04,06,08,10,12,14,16,18,20), }
6 items found as of 8/3/2021
02,04,06,08,10,12,14,16,18,20 checked 8/3/2021

--------------------------------------------------------
International Conference on Crystal Growth
{ FAU wimberly NAS 1.26:190919 & NAS 1.26:190920, NEU snell NAS 1.26.190919 & NAS 1.26.190920, SDSU microform NAS 1.26:190919 & NAS 1.26:190920, SMU fondren microform NAS 1.26:190920, UTAr central gov microfiche NAS 1.26:190919, UTD gov microfiche NAS 1.26:190919, UTo carlson microform NAS1.26:190919, }
item found as of 1/30/2011 catalog

Kawanara, R. S. Nango, T. Hascgawa, and M. Ohtani, "Role of Lead in Growth Suppression and Growth Mechanism of Tin Proper Whisker", International Conference on Crystal Growth ...(ICCGCPS), vol. 10, n. 2, 148-156 1983

--------------------------------------------------------
International Conference on Digital Printing Technologies
{ AU rbd Z252.5.N46I57, GIT main Z252.5.N64I58x, Lexmark Z252.5.N64I58, MIT barker Z252.5.N64.A38, }
items found as of 1/30/2011 catalog

(new reference 12/30/2008)
Seeley, Todd, .Ensuring compliance to the RoHS and WEEE directives International Conference on Digital Printing Technologies, v 2006, NIP22: 22nd International Conference on Digital Printing Technologies - Final Program and Proceedings, 2006, p 521

--------------------------------------------------------
International Conference on Electrical Contacts
ICEC
{ IEEE XPLORE (12,14), (many other universities also subscribe to IEEE XPLORE), }
items found as of 8/3/2021
12,14 checked 8/3/2021

--------------------------------------------------------
2010 International Conference on Electrical Engineering/Electronics Computer Telecommunications and Information Technology
6th International Conference on Electrical Engineering/ Electronics, Computer, Telecommunications and Information Technology
ECTI-CON
{ IEEE XPLORE (08-), (many other universities also subscribe to IEEE XPLORE), }
4 items found as of 8/3/2021
08-21 checked 8/3/2021

--------------------------------------------------------
(new source 7/15/2020)
7th International Conference on Electroceramics
{ }
1 item found as of 7/15/2020

--------------------------------------------------------
1995 International Conference on Electromagnetic Interference and Compatibility
INCEMIC
{ IEEE XPLORE (95,97,99,02-03,06,08,15-16,18), (many other universities also subscribe to IEEE XPLORE), }
8 items found as of 8/3/2021
95,97,99,02-03,06,08,15-16,18 checked 8/3/2021

--------------------------------------------------------
2010 International Conference on Electronic Devices, Systems and Applications
ICEDSA
{ IEEE XPLORE (10-12,16), (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/3/2021
10-12,16 checked 8/3/2021

--------------------------------------------------------
9th International Conference on Electronic Materials and Packaging
2002 EMAP Conference
2005 International Symposium on Electronics Materials and Packaging
IEEE International Symposium on Electronic Materials and Packaging
International Conference on Electronic Materials and Packaging
International Symposium on Electronic Materials and Packaging
Proceedings of the 4th International Symposium on Electronic Materials and Packaging
EMAP
{ http://www.cpmt.org/proceedings/order.html IEEE XPLORE (00-02,05-08,12,16,18), UK online, UM online (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
00-02,05-08,12,16,18 checked 8/3/2021

--------------------------------------------------------
9th International Conference on Electronic Measurement & Instruments
ICEMI
{ IEEE XPLORE (07,09,11,13,15,17,19), UK online, UM online (many other universities also subscribe to IEEE XPLORE), }
4 items found as of 8/3/2021
07,09,11,13,15,17,19 checked 8/3/2021

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2006 7th International Conference on Electronic Packaging Technology
Fifth International Conference on Electronic Packaging Technology
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging
Fifth International Conference on Electronic Packaging Technology Proceedings
International Conference on Electronic Packaging Technology & High Density Packaging
ICEPT
{ IEEE XPLORE (03-), UK online, UM online (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
03-20 checked 8/3/2021

--------------------------------------------------------
(new source 8/25/2020)
International Conference on Electronics Packaging
Proceedings of International Conference on Electronics Packaging
ICEP
{ IEEE XPLORE (14-19,21), }
>=20 items found as of 8/3/2021
14-19,21 checked 8/3/2021

(new reference 6/7/2009)
R. Tummala, S. Dalmia, D. Balaraman, J. Hobbs, H. Windlass, A. Bavisi, P. M. Raj, S. H. Lee, S. Bhattacharya, G. White, F. Ayazi, M. Swaminathan, ]]A. Erbil and T. Ogawa "Recent Advances in Integral Passives Research at Georgia Tech", International Conference on Electronics Packaging, Tokyo, Japan, Apr. 17-19, 2002, pp. 116-123.

--------------------------------------------------------
2nd International Conference on Embedded Passives
{ }
1 item found as of 12/11/2013
checked 12/11/2013

--------------------------------------------------------
International Conference on Energy and Environment Technology
ICEET
{ IEEE XPLORE (09-), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
09 checked 8/3/2021

--------------------------------------------------------
Nth International Conference on the Enhancement and Promotion of Computational Methods in Engineering and Science
{ FSU dirac TA329.I56, GIT main-5e TA329.I56x, RU fondren TA329.I56, UTo online, WrSU online, }
1 item found as of 1/30/2011

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International Conference of Fracture
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
International Conference on Gas Discharges
Third International Conference on Gas Discharges
{ IEEE XPLORE (08), (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/3/2021
08 checked 8/3/2021

--------------------------------------------------------
23rd International Conference on Industrial Electronics, Control and Instrumentation
{ IEEE XPLORE (91-97), (many other universities also subscribe to IEEE XPLORE), }
15 items found as of 8/3/2021
91-97 checked 8/3/2021

--------------------------------------------------------
2010 5th International Conference on Information and Automation for Sustainability
ICIAFS
{ IEEE XPLORE (07-08,10,12,14,16,18), }
2 items found as of 8/3/2021
07-08,10,12,14,16,18 checked 8/3/2021

--------------------------------------------------------
6th International Conference on Information Technology Based Higher Education and Training
ITHET
{ IEEE XPLORE (04-06,10-), UK online, UM online (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
04-06,10-19 checked 8/3/2021

--------------------------------------------------------
2006 4th International Conference on Integrated Power Systems
2010 6th International Conference on Integrated Power Electronics Systems
CIPS
{ IEEE XPLORE (06,08,10,12,14,16,18,20), (many other universities also subscribe to IEEE XPLORE), }
17 items found as of 8/3/2021
06,08,10,12,14,16,18,20 checked 8/3/2021

--------------------------------------------------------
International Conference on Lead-free Soldering
Second International Conference on Lead Free Electronics
>=20 items found as of 1/30/2011 catalog
05-06 checked 4/28/2007

--------------------------------------------------------
2010 International Conference on Management and Service Science
International Conference on Management and Service Science
{ IEEE XPLORE (09-), (many other universities also subscribe to IEEE XPLORE), }
9 items found as of 8/3/2021 (out of 5080+ papers)
09-11 checked 8/3/2021

--------------------------------------------------------
1998 International Conference on Mathematical Methods in Electromagnetic Theory
MMET
{ IEEE XPLORE (96,98,00,02,04,06,08,10,12,14,16,18), }
1 item found as of 8/3/2021
96,98,00,02,04,06,08,10,12,14,16,18 checked 8/3/2021

--------------------------------------------------------
2011 Second International Conference on Mechanic Automation and Control Engineering
{ IEEE XPLORE (10-11), (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/3/2021
10-11 checked 8/3/2021

*** (1580 papers in 2010, 2050 in 2011) *** --------------------------------------------------------
2006 International Conference on MEMS, NANO, and Smart Systems
{ IEEE XPLORE (03-06,09), }
item found as of 8/3/2021
03-06,09 checked 8/3/2021

--------------------------------------------------------
2010 27th International Conference on Microelectronics Proceedings
Proceedings of IEEE 24rd International Conference on Microelectronics
Proceedings of 2008 26th International Conference on Microelectronics
{ IEEE XPLORE (95-), UCI online (many other universities also subscribe to IEEE XPLORE), }
5 items found as of 8/3/2021
95-20 checked 8/3/2021

--------------------------------------------------------
International Conference on Microwave Technology and Computational Electromagnetics
ICMTCE
{ IEEE XPLORE (09,11,13), }
1 item found as of 8/3/2021
09,11,13 checked 8/3/2021

--------------------------------------------------------
2012 13th International Conference on Optimization of Electrical and Electronic Equipment
Proceedings of the 6th International Conference on Optimization of Electrical and Electronic Equipments
OPTIM
{ IEEE XPLORE (98,08,10,12,14-15,17,19), (many other universities also subscribe to IEEE XPLORE), }
5 items found as of 8/3/2021
98,08,10,12,14-15,17,19 checked 8/3/2021

--------------------------------------------------------
2018 XIV-th International Conference on Perspective Technologies and Methods in MEMS Design
MEMSTECH
{ IEEE XPLORE (06-11,15-), }
item found as of 8/3/2021
06-11,15-21 checked 8/3/2021

--------------------------------------------------------
2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering
{ IEEE XPLORE (11-13,19), (many other universities also subscribe to IEEE XPLORE), }
7 items found as of 8/3/2021
11-13,19 checked 8/3/2021

--------------------------------------------------------
3rd International Conference on Recent Advances in Space Technologies
Nth International Conference on Advances in Space Technologies
RAST
ICAST
{ IEEE XPLORE (03-15,17,19), UK online, UM online (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
03-15,17,19 checked 8/3/2021

--------------------------------------------------------
International Conference on Soldering and Reliability
ICSR
SMTA International Conference on Soldering and Reliability
{ http://www.smta.org/ http://www.circuitinsight.com/ }
>=20 items found as of 11/26/2020
07-18 checked 11/26/2020

--------------------------------------------------------
2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology
8th International Conference on Solid-State and Integrated Circuit Technology
{ IEEE XPLORE (95,98,01,04,06,08,10,12,14,16,18,20), UM online? (many other universities also subscribe to IEEE XPLORE), }
8 items found as of 8/3/2021
95,98,01,04,06,08,10,12,14,16,18,20 checked 8/3/2021

----------------------------------------------------
2010 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems
Eurosime04 Conference
7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems
Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems
EUROSIME
{ IEEE XPLORE (04-), UK online (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
04-21 checked 8/3/2021

--------------------------------------------------------
19th International Conference on VLSI Design
{ IEEE XPLORE (92-), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
92-21 checked 8/3/2021

--------------------------------------------------------
2010 International Forum on Strategic Technology
IFOST
{ IEEE XPLORE (06-08,10-14,16-), (many other universities also subscribe to IEEE XPLORE), }
6 items found as of 8/3/2021
06-08,10-14,16 checked 8/3/2021

--------------------------------------------------------
International Heat Treatment and Surface Engineering
{ https://www.tandfonline.com/loi/yhse20 FAU wimberly TN672.I545, }
1 item found as of 11/29/2020 catalog
searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

--------------------------------------------------------
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics
2nd IEEE International Interdisciplinary Conference on Portable Information Devices, 2008 and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
POLYTRONIC
{ IEEE XPLORE (01-02,04-05,07-), LH closed, UK online, UM online (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
01-02,04-05,07 checked 8/3/2021

----------------------------------------------------
2010 International Interconnect Technology Conference
Proceedings of the IEEE 2008 International Interconnect Technology Conference
{ IEEE XPLORE (98-), UK online (many other universities also subscribe to IEEE XPLORE), }
13 items found as of 8/3/2021
98-18 checked 8/3/2021

--------------------------------------------------------
International Journal of Adhesion and Adhesives
{ https://www.sciencedirect.com/journal/international-journal-of-adhesion-and-adhesives/issues MST online, OkSU online, OSU online, SDSU online, UC online, UCI online, UCSD online, UK online SD (pay), UM online, UOk online, UT online, UTo online, WSU online, }
>=20 items found as of 8/8/2021
v1#1-v109(21) all issues checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 12/4/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/4/2020
searched for indium whisker(s) on 12/4/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/4/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/4/2020

(new reference 12/4/2020)
Gnecco, F., E. RicciR. Novakovic Wetting behaviour and reactivity of lead free Au–In–Sn and Bi–In–Sn alloys on copper substrates International Journal of Adhesion and Adhesives Volume 27, Issue 5, July 2007, pp. 409-416 https://doi.org/10.1016/j.ijadhadh.2006.09.008

Aradhana, Ruchi, Smita MohantySanjay Kumar Nayak A review on epoxy-based electrically conductive adhesives International Journal of Adhesion and Adhesives Volume 99, June 2020, 102596 https://doi.org/10.1016/j.ijadhadh.2020.102596

--------------------------------------------------------
International Journal of Advanced Manufacturing Technology
{ IU online, MST online, OkSU online, OSU online, PU online & eng 670.4205In8, SDSU online, SIUC online, UAr online, UC online, UCI online, UCSD online, UD online, UK online, UOk online, UT online, UTo online & carlson, }
1 item found as of 1/20/2021

-------------------------------------------------------
International Journal of Cast Metals Research
{ https://www.tandfonline.com/loi/ycmr20 LH closed, MST wilson TS228.99.C371, UCSD online, UK online, UM online, }
1 item found as of 1/20/2021
searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

--------------------------------------------------------
International Journal of Computational Engineering Science
{ CSULA online, CSULB online, OSU online, SMU online, UK online, USC TA329.I59, UT online, UTAr online, UTD online, VU online, }
1 item found as of 1/20/2021

--------------------------------------------------------
International Journal of Computer Integrated Manufacturing
{ https://www.tandfonline.com/loi/tcim20 EBSCOB, AU online, BYU online, CSULA online, CSULB online, FSU online, GIT online, IU online, LH closed, MoSU TS155.6.I593, MST online, NWU online, OGI online, OkSU online, OrSU online, OSU online, PU online, SDSU online, SIUC online, SMU online, SU online, UAH online, UAr online, UC online, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UK online & eng TS155.6.I593, UMC online, UOk online, UPi online, USD online, USF online, USU online, UT online, UTAr online, UTD online, UTo online, WrSU online, }
3 items found as of 8/6/2021 catalog
v20#1-v34#5(21) checked 8/6/2021
searched for tin whisker(s) & Sn whisker(s) on 11/30/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/30/2020
searched for indium whisker(s) on 11/30/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/30/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/30/2020

--------------------------------------------------------
International Journal of Damage Mechanics
{ https://journals.sagepub.com/loi/ijda MST online, MSU online, NWU online, OkSU online, OSU online, SDSU online, SIUC online, SIUE lovejoy, UCSD online, UD online, UIC online, UK online, UM online, UOk online, USD online, UTo online, WSU online, }
1 item found as of 1/20/2021

--------------------------------------------------------
International Journal of Electronics
{ https://www.tandfonline.com/loi/tetn20 CMU online & eng, CSULA online, CSULB online, FAU online, FIU online, MST online, NWU online, OkSU online, OSU online & sel TK7800.J6, PU online, SDSU online, SIUC online, SIUE lovejoy, SMU online, UAr online, UC eng TK7800.J6, UCSD online, UD roesch, UE, UIC online, UM online, UMi online, UOk online, UPi online, USC TK7800.J6, USD online, UT online, UTAr online, UTD online, }
1 item found as of 8/9/2021 catalog
v73#5,v87#1(00)-v108#7(21) checked 8/9/2021
searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

--------------------------------------------------------
International Journal of Environment and Pollution
{ https://www.inderscience.com/info/inissues.php?jcode=ijep FIU green TD1.I5, GIT main-5e TD1.I573, UMi richter E170.I593, }
2 items found as of 1/30/2011
v5#1-v15#4 checked 7/25/2010

--------------------------------------------------------
International Journal of Environmental Technology and Management
{ https://www.inderscience.com/jhome.php?jcode=ijetm LH closed, UMC, UMk mnl, UTor online, }
2 items found as of 11/7/2020 catalog

--------------------------------------------------------
International Journal of Fatigue
{ https://www.sciencedirect.com/journal/international-journal-of-fatigue/issues AU online, FSU online, GIT online, LH closed, MST online, NWU online, OkSU online, OrSU valley TA418.38.I6, OSU online, PU online, RU online, SDSU online, TTU, UAr mullins TA418.38.I53, UC online, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UIUC online, UK online & eng TA418.38.I53, UM online, UMC online, UOk online, USF online, USU online, UT online, UTA online, UTo online, WrSU online, }
>=20 items found as of 8/8/2021
v27#1-v151(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 12/4/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/4/2020
searched for indium whisker(s) on 12/4/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/4/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/4/2020

--------------------------------------------------------
International Journal of Fracture
{ https://link.springer.com/journal/10704/volumes-and-issues EBSCOA, AU online, BYU hbll TA409.I5, FSU online, GIT online, IU online, LH closed, LU gray TA409.I5, MoSU TA409.I5, MST online, NWU online, OGI online, OkSU online, OrSU online, OSU online, PU online, RU online, SDSU online, SIUC online, SIUE lovejoy, SU online, TTU, UAB sterne TA409.I5, UAH n1, UC online, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UIUC online, UK online & eng TA409.I5, UM online, UMC online, UNF online, UOk online, USD online, USF online, UT online, UTA online, UTo online, WrSU online, }
4 items found as of 8/6/2021
v137#1-v229#1(21) checked 8/6/2021
searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

--------------------------------------------------------
International Journal of Life Cycle Assessment
{ https://link.springer.com/journal/11367/volumes-and-issues AU online, CSULB online, FSU online, GIT online, IU online, MST online, NWU online, OGI online, OkSU online, OrSU online, OSU online, PU online, SDSU online, SIUC online, SMU online, UC online, UCI langson HF5415.155.I58, UCSD online, UDe online, UF online, UK online, UM online, UMC online, UOk online, USC HF5415.155.I58, USD online, USF online, UTA online, UTD online, UTo online, WrSU online, }
>=20 items found as of 8/9/2021
v1#1-v26#7(21) all issues checked 8/9/2021
searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

--------------------------------------------------------
International Journal of Manufacturing Technology and Management
{ https://www.inderscience.com/info/inissues.php?jcode=ijmtm UM online, VU online, }
1 item found as of 1/30/2011

--------------------------------------------------------
International Journal of Materials and Product Technology
{ https://www.inderscience.com/info/inissues.php?jcode=ijmpt GIT main-5e TA401.I788, LH closed, PU hicks 20.1105In8, UM offsite TA401.I657, UTor online, }
2 items found as of 6/11/2015
v1#1-v43#4 all issues checked 6/11/2015

--------------------------------------------------------
International Journal of Materials and Structural Integrity
{ https://www.inderscience.com/jhome.php?jcode=ijmsi }
4 items found as of 11/7/2020 catalog

--------------------------------------------------------
International Journal of Materials Research
Journal of Materials Research
International Journal of Materials Research and Advanced Techniques
Materials Research and Advanced Technologies
Zeitschrift fur Metallkunde
{ https://www.hanser-elibrary.com/loi/ijmr https://www.scienceopen.com/search#(%27v%27~3_%27id%27~%27%27_%27isExactMatch%27~true_%27context%27~(%27collection%27~(%27id%27~%274a5d6fd9-29e6-48af-aba9-ef8bdbc42409%27_%27kind%27~0)_%27kind%27~11)_%27kind%27~77_%27order%27~0_%27orderLowestFirst%27~false_%27query%27~%27Udo%20Welzel%27_%27filters%27~!(%27kind%27~42_%27query%27~%27%5C%27International%20Journal%20of%20Materials%20Research%5C%27%27)*_%27hideOthers%27~false) AU rbd TN3.Z45, CMU online & eng, CSM lakes, FSU remote 660.5Z48, GIT main TN3.Z45, IU b-alf TN3.Z48, LH closed, MSU eng TN3.Z45, NWU sci L669.05Z48, OrSU valley TN3.Z4 & storage TN3.Z4, OSU sel TN3Z48, PU eng 669.05Z3 & hicks 669.05Z3, RU fondren TN3.Z45, TTU microform, UC online & eng TN1.Z45 & eng TN3.Z45, UCF main TN3.Z45, UCSD s&e TN1.Z489, UDe penrose TN3.Z45 & pascal TN3.Z45, UF sci TN3.Z45, UIC warehouse TN3.Z45, UIUC eng Q.669.05IN, UK eng TN603.Z483 & remote TN603.Z483, UL eng TN603.Z483, UM offsite TN3.Z48 (v37-), UMC depos 669.105In8, UPi eng, USC TN3.Z45, USF center E-8271, UT online & hodges TN3.Z45, UTA eng 669.05Z37, UTor eng TN3.Z452, WrSU dunbar TN3.Z45, WSU sci, }
>=20 items found as of 6/11/2015 catalog
v77#1-v104#12 checked 6/11/2015

-------------------------------------------------------
International Journal of Microcircuits and Electronic Packaging
{ http://www.imaps.org/journal/index1.asp PU eng 621.3817In7 & 621.38104605J826, MSU sci, UC cdrom TK7870.15.I58 & eng TK7870.15.I58, UM offsite TK7870.15.I581, WSU sci, }
>=20 items found as of 6/11/2015 catalog
v15#1-v25#3 checked 6/11/2015

--------------------------------------------------------
International Journal of Microelectronic Packaging Materials and Technologies
item found as of 1/30/2011 catalog

Li, Li, Morris, J.E. "Introduction to electrically conductive adhesives International Journal of Microelectronic Packaging Materials and Technologies, vol. 1 no. 3, 1998, pp. 159-175.

--------------------------------------------------------
(new source 7/7/2020)
International Journal of Modern Physics B
{ https://www.worldscientific.com/worldscinet/ijmpb }
( new reference 7/7/2020)
Reliability Estimation and Failure Analysis of Multilayer Ceramic Chip Capacitors Seok Jun Yang, Jin Woo Kim, Dong Su Ryu, Myung Soo Kim, and Joong Soon Jang International Journal of Modern Physics BVol. 17, No. 08n09, pp. 1318-1323 (2003)

--------------------------------------------------------
International Journal for Multiscale Computational Engineering
{ CMU online, USC TA329.I595, }
1 item found as of 8/8/2012 catalog

--------------------------------------------------------
(new source 6/22/2020)
International Journal of Nanoelectronics and Materials
{ https://ijneam.unimap.edu.my/index.php/articleold UK online, }
1 item found as of 1/20/2021

--------------------------------------------------------
International Journal of Physical Distribution & Logistics Management
{ https://www.emerald.com/insight/publication/issn/0960-0035 IU online, MST online, NWU online, OSU online & bus HF5415.7.I572, PU hicks 658.7805In8, SDSU online, SIUC online, UAr online, UC online & langsam HF5415.7.I55, UCSD online, UIC online & daley HF5415.7.I552, UK online, UL ekstrom HF5415.7.I61, UM online, UOk online, USD online, UT online & hodges HF5415.6.I68, }
1 item found as of 1/20/2021
searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

--------------------------------------------------------
International Journal of Production Research
{ https://www.tandfonline.com/loi/tprs20 EBSCOB, FAU online, FIU green TS155.A1I64, MST online, NWU online & sci L658.505I61, OSU online & sel T175A1I54, PU online & eng 658.5705In8 & hicks 658.5705In8, SDSU online, SIUC online, UAr online, UC online & eng TS155.A1I64, UCSD online, UIC online & daley TS155.A1I64, UK online & eng TS155.A1I64, UL kersey TS155.A1I64, UM online, UMi online, UOk online, USD online, UT online & hodges HD28.I59, }
5 items found as of 8/6/2021
v45#1-v59#15(21) checked 8/6/2021

--------------------------------------------------------
International Journal of Services and Standards
{ LH closed, }
1 item found as of 1/30/2011

--------------------------------------------------------
International Journal of Solids & Structures
{ https://www.sciencedirect.com/journal/international-journal-of-solids-and-structures/issues MST online, OkSU online, OSU online & TA349I5, SDSU online, SIUC online, SIUE lovejoy, UAr mullins TA349.I5, UCSD online, UK online sd (pay) & eng TA349.I5, UL online & kersey TA349.I5, UOk online, UT online, }
8 items found as of 8/8/2021
v36#1,v42#1-v225(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 12/4/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/4/2020
searched for indium whisker(s) on 12/4/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/4/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/4/2020

--------------------------------------------------------
International Journal of Thermophysics
{ https://link.springer.com/journal/10765/volumes-and-issues MST online, OkSU online, OSU online, PU online & eng 620.11296In7, SDSU online, SIUC online, UAr mullins QC192.I57, UC online & phys QC192.I57, UCI online, UCSD online, UD online, UK online & eng QC192.I57, UM online & shapiro QC192.I615, UOk online, USD online, UT online & hodges QC192.I57, UTo online, }
19 items found as of 8/9/2021
v24#1-v42#11(21) checked 8/9/2021
searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

------------------------------------------------------
International Materials Reviews
International Metallurgical Reviews
Metallurgical Reviews
{ https://www.tandfonline.com/loi/yimr20 CMU online & eng, CSULB online, MSU online, OSU online, UC ceas TN1.M479, UK online & eng TN1.M513, UL robotics TN1.I5, UM online, UPi online, USC TN1.M513, UT online, UTAr online, UTD online, }
7 items found as of 1/20/2021

searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

Example: https://doi.org/10.1179/imr.year.volume.no.page

--------------------------------------------------------
6th International Metal Finishing Conference Proceedings of the 6th International Metal Finishing Conference
1 item found as of 1/30/2011 catalog

S. C. Britton and M. Clarke, "Effects of diffusion from brass substrates into electrodeposited tin coatings on corrosion resistance and whisker growth," in Proc. 6th Int. Metal Finishing Conf., May 1964, pp. 205-211.

--------------------------------------------------------
4th International Microsystems, Packaging, Assembly and Circuits Technology Conference
International Microsystems, Packaging, Assembly Conference Taiwan
Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference
{ IEEE XPLORE (06-), UM online? (many other universities also subscribe to IEEE XPLORE), UT online, }
>=20 items found as of 8/3/2021
06-20 checked 8/3/2021

--------------------------------------------------------
(new source 12/23/2013)
International Physics Conference
{ }

(new reference 12/23/2013)
Wilson v 48 1979 p 73-83

--------------------------------------------------------
2010 14th International Power Electronics and Motion Control Conference
12th International Power Electronics and Motion Control Conference
13th Power Electronics and Motion Control Conference
PEMC
{ IEEE XPLORE (06,08,10,14,16,18,21), (many other universities also subscribe to IEEE XPLORE), }
3 items found as of 8/3/2021
06,08,10,14,16,18,21 checked 8/3/2021

--------------------------------------------------------
4th International SAMPE Electronics Conference
{ AU rbd TK7871.I577, CMU eng TK7871.I577, NEU snell TK7871.I577, PSU millar TK7871.I577a, SDSU TK7871.I577, UD roesch TK7871.I577, UNCC compact TK7871.I577, UPi storage TK7871I577, USU lee TK7871.I577, UT hodges TK7871.I577, }
5 items found as of 11/8/2012 catalog
87-93,98-00,02 checked 11/8/2012

Barbieri, R.; Coppari, G.; Rudland, D. Use of adhesive technology in the replacement of solder for the manufacture of the new fiat 500 ignition system International SAMPE Electronics Conference, vol. 7, 1994, pp. 51-56

McCormack, M.; Jin, S. Design and properties of new, Pb-free solder alloys International SAMPE Electronics Conference, vol. 7, 1994, pp. 394-404

Li, Lin, Chung, D.D.L. "Z-axis anisotropic electrically conducting polymer-matrix composite film International SAMPE Electronics Conference, vol. 7, 1994, pp. 482-486

Jackson, A.M., Artakl, I., Vianco, P.T. Manufacturing feasibility of several lead-free solders for electronic assembly Conference: 7. International Society for the Advancement of Material and Process Engineering materials processes electronics conference,Parssipany, NJ (United States),21-23 Jun 1994; Other Information: PBD: [1994]

--------------------------------------------------------
48th International SAMPE Symposium and Exposition
{ CMU eng TA 401.3.I586, FAU wimberly TA401.3.I582 & TA401.3.S632, SIUC morris TA401.3.I585a, OSU sel TA401.3N36, UM offsite TL950.S63, RyU TA401.3.I585, UNCC TA401.3.I585a, UOk eng TA401.3.I583, UPi eng TA401.3I, UTA eng TA401.3.I585A, }
2 items found as of 6/11/2015 catalog
v28,v31-v49 checked 6/11/2015

--------------------------------------------------------
International SAMPE Technical Conference
Proceedings of the 1995 International SAMPE Technical Conference
{ FAU wimberly TA401.3.I584, OkSU main 629.134206S678p, OSU sel TL950A1N32, SDSU TL953.I58, SIUC online, SIUE lovejoy cdrom TA401.3.I584, SMU sci TA401.3.I584, UC depos TA401.3.I584 & eng TA401.3.N37, UCB eng TL698.N294, UCI sci TA418.9.C6I5935, UCSD s&e TA401.3.I584, UM offsite TA401.3.S675, UNCC compact TS170.I57, UOk eng various, UTA eng TA401.3.I59, UTo depos TL698.N28, UTor eng TA401.3.I67, WSU sci TA401.3.I584, }
5 items found as of 6/15/2015 catalog
69-70,74-02 checked 6/15/2015

--------------------------------------------------------
2007 International Semiconductor Device Research Symposium
International Semiconductor Device Research Symposium
ISDRS
{ IEEE XPLORE (01,03,05,07,09,11), (many other universities also subscribe to IEEE XPLORE), }
4 items found as of 8/3/2021
01,03,05,07,09,11 checked 8/3/2021

--------------------------------------------------------
2007 International Solid-State Sensors, Actuators and Microsystems Conference
TRANSDUCERS
{ IEEE XPLORE (91,95,97,03,05,07,09,11,13,15.17,19), UM online (many other universities also subscribe to IEEE XPLORE), }
4 items found as of 8/3/2021
91,95,97.03,05,07,09,11,13,15,17,19 checked 8/3/2021

--------------------------------------------------------
2010 33rd International Spring Seminar on Electronics Technology
32nd International Spring Seminar on Electronics Technology
ISSE
{ IEEE XPLORE (01,03-), UK online (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
01,03-21 checked 8/3/2021

--------------------------------------------------------
International Surface Engineering Congress - Proceedings of the 1st Congress
Proceedings of the International Surface Engineering Congress
{ UCSD s&e TA418.7.I548, UM offsite TA418.7.I57, UPi online, USC online, }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
2010 3rd International Symposium on Electrical and Electronics Engineering
ISEEE
{ IEEE XPLORE (10,13,17,19), (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/3/2021
10,13,17,19 checked 8/3/2021

--------------------------------------------------------
International Symposium on Electrical Insulating Materials
Proceedings of 2005 International Symposium on Electrical Insulating Materials
Proceedings of the Twenty-First Symposium on Electrical Insulating Materials
{ IEEE XPLORE (88,95,98,01,05,08,11,14,17,20), UK online (many other universities also subscribe to IEEE XPLORE), }
9 items found as of 8/3/2021
88,95,98,01,05,08,11,14,17,20 checked 8/3/2021

--------------------------------------------------------
2012 International Symposium on Electromagnetic Compatibility
Proceedings of the 2013 International Symposium on Electromagnetic Compatibility
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity
EMC Europe 2011 York
2008 International Symposium on Electromagnetic Compatibility (EMC Europe)
EMC EUROPE
{ IEEE XPLORE (08-09,11-14,16-), (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
08-09,11-14,16-20 checked 8/3/2021

--------------------------------------------------------
2010 9th International Symposium on Electronics and Telecommunications
ISETC
{ IEEE XPLORE (10,12,14,16,18,20), (many other universities also subscribe to IEEE XPLORE), }
6 items found as of 8/3/2021
10,12,14,16,18,20 checked 8/3/2021

--------------------------------------------------------
2003 3rd International Symposium on Environmentally Conscious Design and Inverse Manufacturing
EcoDesign'99 Proceedings: First International Symposium on Environmentally Conscious Design and Inverse Manufacturing
Environmentally Conscious Design and Inverse Manufacturing
Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing
Proceedings of EcoDesign 2007
Proceedings of EcoDesign2003: Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing
Proceedings of the First International Symposium on Environmentally Conscious Design and Inverse Manufacturing
{ IEEE XPLORE (99-), UK online (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021 catalog
99-05 all issues checked 8/3/2021

(new reference 2/8/2011)
Vo, N., M. Tsuriya, "Whisker Assessment of Tin-based Finishes for Leadframe Packages", Proceedings of EcoDesign 2003 Japan Symposium, Tokyo, Japan: Dec. 5, 2002, pp. B-5-1, 120-123

--------------------------------------------------------
International Symposium on High Density Packaging and Microsystem Integration
7th IEEE CPMT International Conference on High Density Microsystem Design, Packaging and Failure Analysis
Proceedings of the 2006 IEEE CPMT Conference on High Density Microsystem Design, Packaging and Component Failure Analysis
Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis
Proceedings of International Symposium on High Density Packaging and Microsystem Integration xxxx
{ IEEE XPLORE (04-), OSU online, UK online (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
04-13 checked 8/3/2021

searched for tin whisker(s) and Sn whisker(s) on 1/23/2021
searched for zinc whisker(s) & Zn whisker(s) on 1/23/2021
searched for indium whisker(s) on 1/23/2021
searched for cadmium whisker(s) & Cd whisker(s) on 1/23/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 1/23/2021

--------------------------------------------------------
International Symposium on High Voltage Engineering

{ IEEE XPLORE (99), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
99 checked 8/3/2021

(new reference 1/14/2014)
Singer 5th 1987

Pommerenke 8th 1993

--------------------------------------------------------
2015 16th International Symposium on Quality Electronic Design
Sixth International Symposium on Quality of Electronic Design
Proceedings of the Fourth International Symposium on Quality Electronic Design
ISQED
{ IEEE XPLORE (00-), (many other universities also subscribe to IEEE XPLORE), }
3 items found as of 8/3/2021
00-21 all issues checked 8/3/2021

--------------------------------------------------------
International Symposium on Tantalum and Niobium
{ LH closed TN490.T2I54, UTA eng TN490T2I58, UTor eng TN490.T2I54, }
item found as of 1/30/2011 catalog

(new reference 6/5/2009)
Nakata, Takehiko, Morimoto, K., Saiki, Y., and Nishiyama, T., "History of the Development of Tantalum Capacitor and Future Trend," International Symposium on Tantalum and Niobium, Goslar, Germany, Sept. 1995.

--------------------------------------------------------
2nd International Symposium on Tin Whiskers
2 items found as of 1/30/2011 catalog

(new reference 11/17/2010)
51. M. Sobiech, M. Wohlschlo"gel, U. Welzel, E.J. Mittemeijer, W. Hu"gel, A. Seekamp, M. Garza, M. Koyuncu, W. Liu, and G.E. Ice: Driving force for whisker formation on Sn thin films deposited on Cu, 3rd International Symposium on Tin Whiskers in Denmark (CALCE, Copenhagen, 2009).

--------------------------------------------------------
21st International Telecommunications Energy Conference
Proceedings of 2013 35th International Telecommunications Energy Conference
INTELEC
{ IEEE XPLORE (78-79,82-00,02-), UK eng TK6271.I57a, (many other universities also subscribe to IEEE XPLORE), }
11 items found as of 8/3/2021
78-79,82-00,02-18 checked 8/3/2021

--------------------------------------------------------
International Test Conference
2005 IEEE International Test Conference
xxxx IEEE International Test Proceedings
2006 IEEE International Test Proceedings
Proceedings - International Test Conference
{ IEEE XPLORE (88-), UM online? (many other universities also subscribe to IEEE XPLORE), }
3 items found as of 8/3/2021
88-20 checked 8/3/2021

--------------------------------------------------------
(new source 6/28/2020)
International Tin Research
{ }
(new reference 6/28/2020)
[osenbach3 4] P. Harris, International Tin Research ITPI Report No. 724, 1994. --------------------------------------------------------
Second International Wafer-Level Packaging Congress
International Wafer Level Packaging Congress
{ http://www.smta.org/knowledge/knowledge.cfm, }
>=20 items found as of 11/26/2020
04-18 checked 11/26/2020

--------------------------------------------------------
International Workshop for Lead- and Halide-free Electronics
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
9th International Workshop and Tutorials on Electron Devices and Materials
Nth Annual xxx International Siberian Workshop and Tutorial on Electron Devices and Materials
Nth Annual xxx International Workshop and Tutorial on Electron Devices and Materials
8th Siberian Russian Workshop and Tutorial on Electron Devices and Materials
{ IEEE XPLORE (00-08), UK online, UM online? (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/3/2021
00-08 all issues checked 8/3/2021

--------------------------------------------------------
(new source 7/18/2020)
21st International Workshop on Radiation Imaging Detectors
{ }
1 item found as of 7/18/2020
searched for tin whisker(s) and Sn whisker(s) on 7/18/2020

--------------------------------------------------------
15th International Workshop on Thermal Investigations of ICs and Systems
Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems
Proceedings of the 12th International Workshop on THERMal INvestigations of ICs and Systems
THERMINIC
{ IEEE XPLORE (07-), UM online? (many other universities also subscribe to IEEE XPLORE), }
9 items found as of 8/3/2021
07-20 checked 8/3/2021

---------------------------------------------------------
Fourteenth International Wroclaw Symposium and Exhibition on Electromagnetic Compatibility
International Wroclaw Symposium on Electromagnetic Compatibility
{ }
5 items found as of 1/30/2011 catalog

(new reference 1/9/2014)
Vick 1996 p 596-599

Ikuko Mori, "Estimation of Rise Time and Frequency Spectra of Discharge Current Waveforms for Air Discharges of an ESD-Gun with Low Charge Voltages," 20th International Wroclaw Symposium on EMC, Wroclaw, Poland, Sept. 13-17, 2010, pp. 757-761.

--------------------------------------------------------
2009 20th International Zurich Symposium on Electromagnetic Compatibility
Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility
Electromagnetic Compatibility 2003
2005 International Symposium on Electromagnetic Compatibility
18th International Zurich Symposium on Electromagnetic Compatibility
EMC ZURICH
EMC-ZURICH
{ IEEE XPLORE (06-09), UK online, UM online (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
06-09 checked 8/3/2021

--------------------------------------------------------
Eight InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
InterSociety Conference on Thermal Phenomena in Electronic Systems
6th InterSociety Conference on Thermomechanical Phenomena in Electronic Systems
Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
ITHERM
{ IEEE XPLORE (88-12,14,16-), FSU dirac TK7870.25.I6, OSU sel TK7870.25.I44, UK online & eng TK7870.25.I56, UM online, UT hodges TK7870.25.I68 (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021 catalog
88-12,14,16-20 checked 8/3/2021

--------------------------------------------------------
Intertek Labtest Sparkle
{ }
4 items found as of 1/30/2011 catalog

--------------------------------------------------------
Proceedings of the IPC Printed Circuits Expo, Boston, MA, Apr. 24-27, 1994
IPC Printed Circuits Expo 1995: Proceedings of the Technical Conference, San Diego, CA, Apr. 30-May 4, 1995
IPC Printed Circuits Expo '96: Proceedings of the Technical Conference, San Jose, CA, Mar. 3-7, 1996
IPC Printed Circuits Expo '97, San Jose, CA, Mar. 9-13, 1997
Proceedings of IPC Printed Circuits Expo '98, Long Beach, CA, Apr. 26-30, 1998
IPC Printed Circuits Expo '99 - Proceedings of the Technical Conference, Long Beach, CA, Mar. 14-18. 1999
IPC Printed Circuits Expo 2000, San Diego, CA, Apr. 4-6, 2000
IPC SMEMA Council APEX 2000, Long Beach, CA, Mar. 12-16, 2000
IPC SMEMA Council APEX 2001, San Diego, CA, Jan. 14-18, 2001
Proceedings of the IPC Printed Circuits Expo 2001, Anaheim, CA, Apr. 1-5, 2001
IPC SMEMA Council's APEX 2002, San Diego, CA, Jan. 19-24, 2002
IPC SMEMA Council APEX 2003, Anaheim, CA, Mar. 31-Apr. 2, 2003
Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004
IPC Circuits Expo, Apex and Designer Summit 2005, Anaheim, CA, Feb. 22-24, 2005
IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings, Anaheim, CA, Feb. 8-10, 2006
IPC Printed Circuits Expo, APEX and the Designers Summit, Los Angeles, CA, Feb. 20-22, 2007
IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008
2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009
Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010
IPC APEX Expo Technical Conference 2011, Las Vegas, NV, April 12-14, 2011
IPC APEX Expo 2012, San Diego, CA, Feb. 28-Mar. 1, 2012
IPC APEX Expo 2013, San Diego, CA, Feb. 17-21, 2013
IPC APEX Expo 2014, Las Vegas, NV, Mar. 25-27, 2014
IPC APEX Expo 2015, San Diego, CA, Feb. 22-26, 2015
IPC APEX Expo 2016, Las Vegas, NV, Mar. 13-17, 2016
IPC APEX Expo 2017, San Diego, CA, Feb. 12-16, 2017
IPC APEX Expo 2018, San Diego, CA, Feb. 27-Mar, 1, 2018
IPC APEX Expo 2019, San Diego, CA, Jan. 26-31, 2019
IPC APEX Expo 2020, San Diego, CA, Feb. 1-6, 2020
IPC APEX Expo 2021, San Diego, CA, Jan. 23-28, 2021.
{ http://www.circuitinsight.com/, http://www.pwbrc.org/, }
>=20 items found as of 1/11/2021 catalog
04,06,08,10 checked 1/11/2021

(new reference 1/9/2014)
Arra, M, Shangguan, D, Yi, S, Fockenberger, H, and Thalhammer, R, "Development of Lead-Free Wave Soldering Processes," Proceedings of APEX 2002, San Diego, CA, Jan. 2002, pp. 4(1)-4(10).

I. Boguslavsky, P., Bush, E. Kam-Lum, M. Kwoka, J. McCullen, and N. Vo, "Tin whisker project," in Proc. APEX Conf., Apr. 2002.

Freedman, Martin G, "JEDEC's Lead-Free Position," IPC SMEMA Council's APEX 2002, San Diego, CA, Jan. 19-24, 2002, pp. 242?

Lal, S, "Lead-Free Development of Electronic Connectors," Proceedings of the IPC SMEMA Council APEX, Jan. 2002, pp. S01-1-1 to S01-1-14.

Xu, C, Zhang, Y, Fan, C, Abys, J, Hopkins, L, and Stevie, F. Understanding Whisker Phenomenon: Driving Force for the Whisker Formation IPC SMEMA Council APEX 2002, S06 2-1

Zhang, Y., C. Xu, C. Fan, J. Abys and A. Vysotskaya, "Understanding Whisker Phenomenon: Whisker Index and Tin/Copper, Tin/Nickel Interface", Proceedings of the IPC SMEMA Council APEX, pp. S06-1-1 thru S06-1-11, January 2002

Zhang, Y, Xu, C, Pan, C, Abys, J, and Vysotskaya, A, "Understanding Whisker Growth Phenomenon _ Part 1, Growth Kinetics," Proceedings of the APEX Meeting, San Diego, CA, Jan. 2002.

Bush, P, Jones, G, and Boguslavsky, I, "Relationships of Copper Diffusion and Surface Oxide Formation to Tin Whisker Growth," APEX 2003, Anaheim, CA, Apr. 1, 2003.

Colfax, Richard, O'Keefe, Matthew, Amick, Patricia, Kleine, David, Vetter, Steve, and Murry, Dale, mjokeefe@umr.edu. "Perspectives on Repaired Lead-Free Solder Joints" Apex, Anaheim, CA, Feb. 22-24, 2005

Geiger, David, Shangguan, Dongkai, Sj”berg, Jonas, and Castello, Todd, dongkaishangguan@flextronics.com. "Lead-Free Solder Flip Chips on FR-4 Substrates with Different Assembly Processes and Materials" Apex, Anaheim, CA, Feb. 22-24, 2005

Gleason, Jerry, Schroeder, Valeska, and Henshall, Gregory, Lau, John, Dauksher, Walter, and Sullivan, Bob, "Design, Materials and Assembly Process of High-Density Packages with a Low-Temperature Lead-Free Solder (SnBiAg)" (Apex, Anaheim, CA, Feb. 22-24, 2005

Tanaka, Hirokazu, "Corrosion Factor and Effects of Tin-Zinc Lead-Free Solder on Copper Substrate in Environmental Tests" Apex, Anaheim, CA, Feb. 22-24, 2005

Woolley, Mark, and Choi, Jae, woolleym@avaya.com. "The Use of SAC Solder and Pb-Free Materials in the Repair Scenario" Apex, Anaheim, CA, Feb. 22-24, 2005

Bath, Jasbir, Chih, Pan Wei, Saludsod Jr., Hamlet, Jay, Roger, and Chou, Tzu-Chein, jasbirbath@ca.slr.com. "Use of EDXRF for RoHS Compliance Screening in PCBA Manufacturing" (IPC Printed Circuits Expo, APEX and the Designers Summit, Los Angeles, CA, Feb. 20-22, 2007)

Kumar, Rakesh, rkumar@scscoatings.com "Parylene as a suppressant for Tin Whiskers Growth on Printed Circuit Boards" (IPC Printed Circuits Expo, APEX and the Designers Summit, Los Angeles, CA, Feb. 20-22, 2007)

Long, Gary, Embree, Todd, Mukadam, Muffadal, Parupalli, Satish, and Vasudevan, Vasu, gary.b.long@intel.com. "Lead-Free Assembly Impacts on Laminate Material Properties and `Pad Crater' Failures" (IPC Printed Circuits Expo, APEX and the Designers Summit, Los Angeles, CA, Feb. 20-22, 2007)

Nandagopal, Bala, Teng, Sue, and Watson, Doug, sue.teng@cisco.com "Effect of OSP Chemistry on the Hole Fill Performance During Pb-Free Wave Soldering" (IPC Printed Circuits Expo, APEX and the Designers Summit, Los Angeles, CA, Feb. 20-22, 2007)

Snugovsky, Polina, Bagheri, S., Bagheri, Z., and Romansky, M., polina@celestica.com "The New Lead-Free Assembly Rework Solution Using Low Melting Alloys" (IPC Printed Circuits Expo, APEX and the Designers Summit, Los Angeles, CA, Feb. 20-22, 2007)

Jing Fan, Art Ackerman, Doug Katze, Jayesh Shah, Matthew Eveline, Nishitha Andra, and Daniel Blazej, x Effects of Environmental Exposure on the Performance of Electrically Conductive Film Adhesives for RF Grounding Applications "," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. .

Quyen Chu, Girish Wable, Anthony Babasa, Evan Doxtad, Michael Lapitan, Michael Santos, Josh Solon, Ken Hubbard, Gnyaneshwar Ramakrishna, Greg Henshall, Ahmer Syed, Ranjit Pandher, and Chrys Shea "Low-Silver BGA Assembly Phase I - Reflow Considerations and Joint Homogeneity Third Report: Comparison of Four Low-Silver Sphere Alloys and Assembly Process Sensitivities," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. .

Jouppi, Michael R., "The Value of IPC-2152," Proceedings 2010 Technical Conference APEX EXPO , Las Vegas, NV, Apr. 6-9, 2010, pp. S22_03-1-S22_03-9.

Larry D. Timberlake, "A Combination Flame Retardant Curing Agent Material for Non-Halogan PCB Laminates," Apr. 2011.

Richard Coyle, "The Relationship Between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array," Feb. 2012.

Joseph Flanagan, "Low Temperature Lead-Free Assembly via Transient Liquid Phase Sintering," Feb. 2012.

-------------------------------------------------------
IPC Brussels
8 items found as of 1/30/2011 catalog
08 checked 5/25/2009

--------------------------------------------------------
IPC Conference
{ GIT main-6e TK7868.P7I56X, }
1 item found as of 6/22/2020 catalog
81

Schetty, R, "Whisker Growth Studies". Proceedings of IPC Annual Meeting, Session Y, paper B, Oct. 2001, Orlando, PL, USA.

Egli, A., W Zhang, J Heber, F. Schwager, M. Toben, "Where Crystal Planes Meet: Contribution to the Understanding of the Tin Whisker Growth Process", IPC Conference (New Orleans), Nov. 2002
A. Egli, W. Zhang, J. Heber, F. Schwater, and M. Toben, "Where crystal planes meet: Contribution to the understanding of the whisker growth process," in IPC Annu. Meeting, Nov. 2002, pp. S08-3-1-S-8-3-5.

Kumar, G. Achut, "Lead-Free Matte-Sn Termination for Lead Frame Packages," IPC-JEDEC Conference, Taipei, Taiwan Dec. 2002 pag 38.

Shangguan, D., Managing Compatibility Issues For Transitioning To vol. Manufacturing For Lead-Free Pcb Assembly. Keynote session presentation. Proceedings of 2003 International Printed Circuit & Electronics Assembly Fair Technical Conference and

--------------------------------------------------------
IPC/iNEMI Reliability summit
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
IPC/JEDEC Global Conference on Lead-Free Reliability and Reliability Testing for RoHS Lead-Free Electronics
item found as of 1/30/2011 catalog

Cavanaugh, David, "Impact of Surface Finish Choice on Reliability Test Results: Data Analysis of HALT Testing on the Reliant TV-3" (IPC/JEDEC Global Conference on Lead Free Reliability and Reliability Testing for RoHS Lead-Free Electronics, Boston, MA, Apr. 10-12, 2007)

de Sousa, Isabel, Henderson, Donald W., Patry, Luc, and Martel, Robert, donwhend@us.ibm.com. "Characterization and Reliability of Increased Cu Levels in SAC Alloys" IPC/JEDEC Global Conference on Lead Free Reliability and Reliability Testing for RoHS Lead-Free Electronics, Boston, MA, Apr. 10-12, 2007)

Faure, Christiane, Elkins, Mark, Bath, Jasbir, Unterborn, Aaron, Mainwaring, Stephen, Willie, Dennis, Zhou, Xiang, and Watson, Doug, christianefaure@fr.slr.com. "Shrinkage Hole Effect on Lead-Free Pin Through-Hole Solder Joint Reliability" (IPC/JEDEC Global Conference on Lead-Free Reliability and Reliability Testing for RoHS Lead-Free Electronics, Boston, MA, Apr. 10-12, 2007)

Ma, L., Donaldson, A., Walwadkar, S., Hsu, I., alan.w.donaldson@intel.com. "Reliability Challenges of Lead-Free (LF) Plated Through-Hole (PTH) Mini-pot Rework" (IPC/JEDEC Global Conference on Lead Free Reliability and Reliability Testing for RoHS Lead-Free Electronics, Boston, MA, Apr. 10-12, 2007)

Nishikawa, Hiroshi, Miki, Kousuke, and Takemoto, Tadashi, "Evaluation of Sn-3.5Ag Based Solder Joint by Ball Impact Test" (IPC/JEDEC Global Conference on Lead-Free Reliability and Reliability Testing for RoHS Lead-Free Electronics, Boston, MA, Apr. 10-12, 2007)

--------------------------------------------------------
IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies
International Conference on Lead Free: Electronic Components and Assemblies
IPC and JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies
Proceedings of IPC/JEDEC 6th International Conference on Lead-Free Electronic Assemblies and Components
>=20 items found as of 1/30/2011 catalog
3,5,7-8,12

Schetty, R., "Tin Whisker Growth & The Metallurgical Properties of Electrodeposited Tin", IPC/JEDEC International Conference on Lead-Free Electronic Assemblies, Mar. 2002, pp. 137-145

Schetty, R., "Tin Whisker Growth & The Metallurgical Properties of Electrodeposited Tin", IPC/JEDEC International Conference on Lead-Free Electronic Assemblies, March 2002, pp. 137-145

Bergman, David W, "Why Industry Needs a Life Cycle Environmental Impact Evaluation of Tin-lead and lead-free solder", International Conference on Lead Free: Electronic Components and Assemblies, San Jose, CA, May 1-2, 2002, pp. 24.

Lal, S., "Tin Whiskers: Their Appearance and Reduction in Electronic Connectors", 2nd IPC-JEDEC International Conference on Pb-Free Electronic Components and Assemblies, Taipei, Taiwan, Dec. 10, 2002, pp. 107-126

Freedman, M, and Lycoudes, N. JEDEC's Lead-Free Position Internat. Conf. On Lead-Free Electronic Comp. And Assem, p. 356 (2002)

Goudarzi, V. Lead-Free Solder Paste Evaluation and Implementation in Personal Communication Products Internat. Conf. On Lead-Free Electronic Comp. And Assem, p. 182 (2002)

Nimmo, K. Review of European Legislation and Lead-Free Technology Roadmap Internat. Conf. On Lead-Free Electronic Comp. And Assem, p.18 (2002)

Prasad, S. NEMI Pb-Free Task Group Report Internat. Conf. On Lead-Free Electronic Comp. And Assem, p. 68 (2002)

Romm, D. and Abbott, D. Component Issues for Lead-Free Processing Internat. Conf. On Lead-Free Electronic Comp. And Assem, p. 200 (2002)

Schetty, R. Tin Whisker Growth and the Metallurgical Properties of Electrodeposited Tin Internat. Conf. On Lead-Free Electronic Comp. And Assem, p. 139 (2002)

R. Schetty, "Tin whisker growth \\\& the metallurgical properties of electrodeposited tin," in Proc. IPC/JEDEC Pb-Free Conf., May 2002, pp. 1-25.

R. Schetty, Y. Zhang, and K. Hwang, "Whisker growth: The substrate effect and beyond," presented at the IPC-JEDEC Pb-Free Conf. Taipei, Taiwan, pp. 1-5, Dec. 2002.

S. Madra, "Thermo-mechanical characterization of lead-free tin plating: X-ray diffraction measurements and correlation with analytical and numerical models," in Proc. IPC-JEDEC Conf. Frankfurt, Germany, Jun. 2003.

K. Whitlaw, A. Egli, and M. Toben, "Preventing whiskers in electrodeposited tin for semiconductor lead frame applications," in IPC Int. Conf. Lead-Free Electronics Brussels, Belgium, Jun. 2003.

Geiger, D., Arra, M., and Shangguan, D., Evaluation of Sn-Zn Solder Paste. Proceedings of IPC/JEDEC 2004 International Conference on Lead-Free Electronic Assemblies and Components, Singapore, Aug. 18-20, 2004.

Bixenman, Mike, Miller, Erik, and Rueda, Fernando, mike_bix@kyzen.com "Lessons Learned and Best Practices Developed for Cleaning Lead-Free Flux Residues from Printed Circuit Assemblies and Advanced Packages" (IPC/Jedec International Conference on Lead Free Electronic Components and Assemblies, Boston, MA, Dec. 5-7, 2006)

Kato, Takahiko, Akahoshi, Haruo, Nakamura, Masato, Hashimoto, Tomoaki, and Nishimura, Asao, "Effect of Cu Leadframe Substance on Whisker Initiation from Electrodeposited Sn/Cu Coating" (IPC/Jedec International Conference on Lead Free Electronic Components and Assemblies, Boston, MA, Dec. 5-7, 2006)

--------------------------------------------------------
IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics
12 items found as of 1/30/2011 catalog
08 checked 9/20/2008

--------------------------------------------------------
IPC/JEDEC Lead Free Conference
Proceedings of IPC/JEDEC Lead Free Conference
{ }
item found as of 2/16/2011 catalog

(new reference 2/16/2011)
Oberndorff, P., M. Dittes, P. Crema, and S. Chopin, "Whisker Formation on Matte Sn Influencing Factors and Mitigation An Update," Proceedings of IPC/JEDEC Lead Free Conference, Dec 2004.

--------------------------------------------------------
IPC/JEDEC Lead Free North America Conference
{ }
2 items found as of 1/30/2011 catalog

--------------------------------------------------------
2008 IPC Midwest Show Proceedings 14 items found as of 1/30/2011 catalog
08

Chris Hunt, x "Tin Allotropic Transformation ~ Tin Pest," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. .

Ning-Cheng Lee, x "A Compliant and Creep Resistant SAC-Al(Ni) Alloy," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. .

Lei Nie, Michael Osterman, Michael Pecht, Fubin Song, Jeffrey Lo, and Ricky Lee, x "Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. .

M. Brizoux, A. Grivon, P. Snugovsky, and B. J. Smith, x "Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. .

Hikari Murai, x "The Evaluation of CAF Property for Narrow TH Pitch PCBs," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. .

H. K. Lee, Y. C. Chu, M. H. Chun, S. H. Jeon, and K. H. Kim, x "A Study of Reliability between Solder Alloy and Pad Materials," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. .

John Andresakis, Jin Hwang, and Pranabes Pramanik, x "Embedded Capacitor Material and Design Considerations for High Frequency Modules," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. .

--------------------------------------------------------
IPC/NEMI Meeting
{ }
2 items found as of 1/30/2011 catalog

--------------------------------------------------------
IPC Printed Circuits Expo
IPC 2002
{ http://www.pwbrc.org/, GIT main-6e TK7868.P7I63X, Lexmark TK7868.P7I63, }
>=20 items found as of 1/30/2011 catalog
94,98 checked 4/4/2008

"," IPC Expo, San Diego, CA, May 2-4, 1995, pp. .

"," IPC Printed Circuits Expo, San Jose, CA, Mar. 3-7, 1996, pp. .

"," IPC/SMTA Electronics Assembly Expo 1998, Providence, RI, Oct. 24-29, 1998, pp. .

"," IPC Printed Circuits Expo 1999, Long Beach, CA, Mar. 14-18, 1999, pp. .

"," Printed Circuits Expo 2000, San Diego, CA, Apr. 2-6, 2000, pp. .

--------------------------------------------------------
IPC Review
>=20 items found as of 1/30/2011 catalog
Dec05-Sept06,Nov06-Apr09 checked 5/24/2006

--------------------------------------------------------
IPC/SMTA High performance Cleaning and Contamination Conference
{ }
item found as of 7/25/2012 catalog

(new reference 7/25/2012)
P. Snugovsky, S. Meschter, P. Kapadia, M. Romansky, J. Kennedy and E. Kosiba, "Influence of Board and Component Cleanliness on Whisker Formation" the IPC/SMTA High performance Cleaning and Contamination Conference, November 17-18, 2010

--------------------------------------------------------
IPC-Soldertec 2004 Lead-Free Conference
IPC/Soldertec Global 3rd International Conference on Lead Free Electronics
IPC and SOLDERTEC Global Conference
IPC and Soldertec Global Conference on Lead Free Electronics
Proceedings, Soldertec
>=20 items found as of 1/30/2011 catalog

Maire, O. et al, "Backward Compatibility of Lead-Free BGA: Microstructural Characterization and Reliability," Proceedings IPC Soldertec, Malmo, Sweden, 2006.

--------------------------------------------------------
IPC Summit on Surface Finishes
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
IPC Symposium on Tin Whiskers
{ }
1 item found as of 2/13/2011 catalog

--------------------------------------------------------
IPC Tin Whisker Conference
IPC Tin Whiskers Conference
{ }
2 items found as of 3/31/2011 catalog

(new reference 7/25/2012)
P. Snugovsky, S. Meschter, Z. Bagheri, E. Kosiba, M. Romansky, J. Kennedy, "Tin Whisker Mitigation in Assembly," IPC Tin Whisker Conference, Fort Worth, Texas April 17-19, 2012

--------------------------------------------------------
IPC Works
IPC Works '99
{ http://www.pwbrc.org/ }
10 items found as of 1/30/2011 catalog
checked 4/4/2009

"," IPC Works '99, Minneapolis, MN, Oct. 23-28, 1999, pp. xx-xx.

R. Schetty, "Minimization of tin whisker formation for lead-free electronics finishing," in Proc. IPC Works Conf. Miami, FL, 2000, pp. S-02-R-S-02-3-6.

--------------------------------------------------------
IRE Transactions on Component Parts
Transactions of the IRE Professional Group on Component Parts
{ IEEE XPLORE (v2#1-v9#4), (many other universities also subscribe to IEEE XPLORE), }
15 items found as of 8/2/2021
v1#1-v9#4(62, ended publication) all issues checked 8/2/2021

--------------------------------------------------------
IRE Transactions on Product Engineering and Production
{ IEEE XPLORE (v5#1-v6#4), (many other universities also subscribe to IEEE XPLORE), }
items found as of 8/2/2021
v5#1-v6#4(62, ended publication) all issues checked 8/2/2021

--------------------------------------------------
IRE Transactions on Production Techniques
{ IEEE XPLORE (v1#1-v6#1), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/2/2021
v1#1-v6#1(59, ended publication) all issues checked 8/2/2021

--------------------------------------------------
Irish Independent
{ OSU online, UD online, UK online, UM online, VU online, }
1 item found as of 1/20/2021

--------------------------------------------------------
IT Professional
{ IEEE XPLORE (v1#1-), UK online & remote T58.5.I82, (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/4/2021
v1#1-v23#3(21) all issues checked 8/4/2021

searched for tin whisker(s) and Sn whisker(s) on 1/23/2021
searched for zinc whisker(s) & Zn whisker(s) on 1/23/2021
searched for indium whisker(s) on 1/23/2021
searched for cadmium whisker(s) & Cd whisker(s) on 1/23/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 1/23/2021

--------------------------------------------------------
itbusiness.ca
{ http://www.itbusiness.ca/ }
1 item found as of 1/30/2011

--------------------------------------------------------
ITEM 2002
{ VU online, }
>=20 items found as of 4/9/2014 catalog
83,85-90,95-00 checked 4/9/2014

--------------------------------------------------------
ITEM Update 2002
{ }
1 item found as of 4/9/2014 catalog
88,90-94,96,01-02 checked 4/9/2014

--------------------------------------------------------
It's Not Easy Being Green
7 items found as of 1/30/2011 catalog
09 checked 4/26/2009

--------------------------------------------------------
56th IWCS Conference - Proceedings of the International Wire and Cable Symposium
Proceedings of the 57th International Wire and Cable Symposium
{ http://ecadigitallibrary.com/conference.php?cid=17 }
12 items found as of 1/30/2011 catalog
05-08 checked 7/10/2009

(new reference 12/30/2008)
Kiddoo, David B., .Cable component material innovations for stringent fire safety and environmental compliance requirements 56th IWCS Conference - Proceedings of the International Wire and Cable Symposium, Inc., IWCS 2007, 56th IWCS Conference - Proceedings of the International Wire and Cable Symposium, Inc., IWCS 2007, 2007, p 204-211

--------------------------------------------------------
Izvestiya Vysshikh Uchebnykh Zavedenii
{ AU rbd QA1.I9941, CSULB online, FSU storage 530.5I99Y, GIT storage QA1.A3493, LH closed, MST depos 510.5R92, OkSU main 510.5S7295, PU hicks 510.5So89, SDSU QA1.A3493, SIUC storage 54135-5101, SIUE storage, TTU, UAr mullins QA1.A3493, UC math QA1.A462, UCF online & main QA1.S684, UCSD s&e QA1.S732, UD remote, UH QA1.A3493, UK king QA1.R7813, UL ekstrom QA1.A3493, UM shapiro QA1.R973, WSU sci, }
item found as of 1/30/2011 catalog

D. M. Vasil"ev and V. K. Glazunova, "The X-ray analysis of residual stresses in tin coatings," Izv. Vyssh., UChebn. Zaved., Chern. Metall., vol. 9, no. 15, pp. 151-154, 1965.

JJJJ--------------------------------------------------------
Jahrbuch der Kaiserlich-Koniglichen Geologischen Reichsanstalt
{ MST depos 554.36Au79j, UM shapiro QE266.A3 & buhr QE266.A3, UOk geol QE266.A165, }
1 item found as of 1/30/2011

--------------------------------------------------------
Jane's Defence Weekly
{ CPL washington, IU wells, UF530.J35, OSU online & main, UF530J36, SDSU, UF530.J35, UAr mullins, UF530.J35, UCSD ssh, UF530.J35, UK young, UF530.J35, UM online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Japanese Journal of Applied Physics
{ https://iopscience.iop.org/journal/1347-4065 MST online, OkSU online, OSU online & sel TA4J34, SDSU online, SIUC online, SIUE lovejoy, UAr online, UCSD online, UK online & chem/phys QC1.J39, UM online, UOk online, UTo online & carlson, WSU sci, }
>=20 items found as of 1/20/2021
v46#11,v47#8 checked 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 7/18/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/7/2020
searched for indium whisker(s) on 8/7/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/7/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight on 8/7/2020

searched for gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 10/10/2020 --------------------------------------------------------
JAXA Microelectronics Workshop
{ }
1 item found as of 2/9//2011 catalog

--------------------------------------------------------
2002 JEDEC Conference
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
JEDEC/JEITA Joint Meeting #11
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
JEDEX
item found as of 1/30/2011 catalog

Vo, N., "Whisker Growth Evaluations of Tin-Based Plating Finishes", JEDEX 2002 Conference, Santa Clara, CA, Mar. 25, 2002

Vo, N., "Whisker Growth Evaluations of Tin-Based Plating Finishes", JEDEX 2002 Conference, Santa Clara, CA, March 25, 2002

--------------------------------------------------------
JEE
{ OSU sel TK7800J22, }
4 items found as of 1/30/2011 catalog

--------------------------------------------------------
JISSO/PROTEC Forum
JISSO/PROTEC Forum 2002
{ }
2 items found as of 1/30/2011 catalog

--------------------------------------------------------
9th Joint FAA/DoD/NASA Aging Aircraft Conference
{ FAU wimberly govdoc NAS1.55:208982/PT1-, SIUE lovejoy microfiche NAS1.55:208982, UOk gov NAS1.55:208982/PT1-, SDSU gov NAS1.55:208982/PT1, UCSD s&e TL671.1.J65, USC online, UTAr central gov microfiche NAS 1.55:208982/PT1, UTor aero NASA CP 1999 208982, }
4 items found as of 1/30/2011 catalog
97,06 checked 10/5/2009

--------------------------------------------------------
2004 Joint International Meeting of the Electrochemical Society
204th Meeting of the Electrochemical Society
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
7th Joint MMM-INTERMAG Conference
{ IEEE XPLORE (98), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
checked on 8/3/2021

--------------------------------------------------------
JOM
Journal of Metals
{ https://link.springer.com/journal/11837/volumes-and-issues MST wilson TN1.A513, NWU online & sci 669.05.86, OkSU online, OSU online & TN1J62, PU hicks 669.05J82, SDSU online, SIUC online, UAr mullins per microfilm TN1.A513, UC eng TN1.J68 & depos TN1.J68, UCSD online, UD online, UE microform, UIC online & warehouse TN1.A513, UK online & eng TN1.A513, UL kersey TN1.A513, UM online, UOk online USC online, UT online & hodges TN1.A513, }
>=20 items found as of 8/9/2021
v43#6-v73#8(21) checked 8/9/2021
searched for tin whisker(s) and Sn whisker(s) on 7/18/2020

searched for zinc whisker(s) and Zn whisker(s) on 9/13/2020
searched for indium whisker(s) on 9/13/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/13/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/13/2020 (new reference 2/23/2021)
," JOM, vol. 73 no. 2, pp. , Feb. 2021.

Masanori Usui, Toshikazu Satoh, Hidehiko Kimura Reliability of Cu Nanoparticles/Bi-Sn Solder Hybrid Bonding Under Cyclic Thermal Stresses ," JOM, vol. 73 no. 2, pp. 600-608, Feb. 2021. https://doi.org/10.1007/s11837-020-04521-w

--------------------------------------------------------
Journal of Adhesion Science and Technology
{ https://www.tandfonline.com/loi/tast20 EBSCOA, OkSU online, OSU online, PU online & eng 547.7P7695, SDSU online, SIUC online, UA online, UC online & eng QC183.J65, UCSD online, UIC online, UK online (pay) & eng QC183.J650, UOk online, USD online, UT online, UTo online, WSU sci, }
>=20 items found as of 8/6/2021
v1#1-v35#15(21) all issues checked 8/6/2021
searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

--------------------------------------------------------
Journal of Alloys and Compounds
Journal of the Less-Common Metals
{ https://www.sciencedirect.com/journal/journal-of-alloys-and-compounds/issues https://www.sciencedirect.com/journal/journal-of-the-less-common-metals/issues IU bloomington alf TN1.J88, MST online, NWU online & sci 669.05J861, OkSU online, OSU online & sel TN1J7 & sel TN1J72, PU hicks 669.9J82, SDSU online, SIUC online, SIUE storage, UC online & phys N1.J7, UCSD online, UIC online & sci, UK online sd & chem/phys TN1.J7 & king TN1.J7, UL online & kersey TN1.J7, UM online & shapiro TN1.J89 & buhr TN1.J89, UOk online, UT online & hodges TN1.J7 & closed TN1.J7, }
>=20 items found as of 8/8/2021
v330#1-v882(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 7/18/2020
searched for zinc whisker(s) and Zn whisker(s) on 9/13/2020
searched for indium whisker(s) on 9/13/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/13/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/13/2020

(new reference 3/11/2021)
," Journal of Alloys and Compounds, vol. 870, pp. , July 25, 2021.

Yuanyuan Qiao, Ning Zhao, and Haitao Ma, x "Heredity of preferred orientation of b-Sn grains in Cu/SAC305/Cu micro solder joints," Journal of Alloys and Compounds, vol. 868, pp. 159146-1-159146, July 5, 2021. https://doi.org/10.1016/j.jallcom.2021.159146

Hossein Madanipour, Yi-Ram Kim, Choong-Un Kim, Dibyajat Mishra, Patrick Thompson Study of electromigration in Sn-Ag-Cu micro solder joint with Ni interfacial layer ," Journal of Alloys and Compounds, vol. 862, pp. 158043-1-158043, May 5, 2021. https://doi.org/10.1016/j.jallcom.2020.158043

--------------------------------------------------------
Journal of the American Chemical Society
{ https://pubs.acs.org/loi/jacsat IU online & bloomington chem QD1.A5, MST online, NWU online & sci 540.5A51, OCU online, OkSU online, OSU online & sel QD1A54, PU online & chem 540.6Am3j & hicks 540.5Am32 & 540.5J816, SDSU online, SIUC online, SIUE online, UAr online, UC online & chem QD1.A5, UCSD online, UD online & roesch, UE online, UIC online & sci, UK chem/phys QD1.A5, UL online & kersey QD1.A5, UM online, UOk online, USD online, UT online & hodges QD1.A5, }
1 item found as of 1/30/2011

searched for tin whisker(s) and Sn whisker(s) on 1/24/2021
searched for zinc whisker(s) & Zn whisker(s) on 1/24/2021
searched for indium whisker(s) on 1/24/2021
searched for cadmium whisker(s) & Cd whisker(s) on 1/24/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 1/24/2021

--------------------------------------------------------
Journal of Analytical and Applied Pyrolysis
{ https://www.sciencedirect.com/journal/journal-of-analytical-and-applied-pyrolysis/issues AU online, FSU online, GIT main QD281.P9J68X, IU online, LH closed, MST online, NWU online, OkSU online, OrSU online, OSU online, PU online, RU online, SDSU online, UC online, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UIUC online, UK online, UM online, UMC online, UNF online, UOk online, USF online, USU online, UT online, UTo online, WrSU online, }
1 item found as of 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 12/4/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/4/2020
searched for indium whisker(s) on 12/4/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/4/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/4/2020

(new reference 12/4/2020)
Krenek, Tomáš, Petr BezdickaJosef Pola IR laser-induced CVD of ß-Sn/SnSi-nanodisperse alloys from stannane–silane mixture Journal of Analytical and Applied Pyrolysis Volume 86, Issue 2, November 2009, pp. 381-385 https://doi.org/10.1016/j.jaap.2009.07.001

--------------------------------------------------------
Journal of Analytical Atomic Spectrometry
{ https://pubs.rsc.org/en/journals/journalissues/ja#pnlissues AU online, FIT evans, GIT online, IU online, LH closed, MST online, NWU online, OkSU online, OrSU online, OSU online, PU chem 543.085J826, RU online, SDSU online, SIUC online, UAr online, UC online, UCI online, UCSD online, UF online, UIC online, UIUC online, UK online, UM online & shapiro QD96.A8A611, UMC online, UOk online, USF online, UT online, UTA online, UTo online, WrSU online, }
1 item found as of 1/20/2021
v22#10 checked 1/20/2021

--------------------------------------------------------
Journal of Applied Crystallography
{ http://journals.iucr.org/j/contents/backissues.html, CSULB online, MSU online, OSU online, UC online, UD online, UK online & storage QD901.J6, UL online, UM online, USC grand, UT online, UTAr online, UTD online, VU online, }
5 items found as of 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 7/19/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/8/2020
searched for indium whisker(s) on 8/8/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/8/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight on 8/8/2020
> searched for gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/1/2020

--------------------------------------------------------
Journal of Applied Electrochemistry
{ IU online, MST online, NWU online, OkSU online, OSU online & sel TP250J68, PU online & eng 660.29705J826, SDSU online, SIUC online, UAr online, UC online & eng TP250.J68, UCSD online, UD online, UIC online, UK online & chem/phys TP250.J68, UL kersey TP250.J68, UM online & buhr QD551.J86, UOk online, USD online, UT online & hodges TP250.J68, }
1 item found as of 1/20/2021

--------------------------------------------------------
(new source 6/28/2020)
Journal of Applied Mechanics
{ https://asmedigitalcollection.asme.org/appliedmechanics/issue UK online, }
1 item found as of 1/20/2021

------------------------------------------------------
Journal of Applied Physics
{ https://aip.scitation.org/toc/jap/current IEEE XPLORE, KYVL, Lexmark, MST online, MSU eng QC1.J83, NWU online & sci 530.5J86, OkSU online, OSU online & sel QC1P5742, PU online & phys 530.5P564 & eng 538.06C76p, SDSU online, SIUC online, SIUE online, UAr online, UC online & geo QC1.P6, UCSD online, UE, UIC online & periodical, UK online & chem/phys QC1.J83, UL kersey QC1.J83, UM online, USD online, UT online & hodges QC1.J83, UTo online & carlson & depos, WSU online & sci, (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/4/2021
v38#8,v107#4 checked 8/4/2021
searched for tin whisker(s) and Sn whisker(s) on 7/19/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/5/2020
searched for indium whisker(s) on 8/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/3/2020

--------------------------------------------------------
Journal of Applied Polymer Science
{ https://onlinelibrary.wiley.com/loi/10974628 FAU online, FIU online, LU gray TP156.P6J6, MST wilson TP156.P6J6, OkSU online, RU online & fondren TP156.P6J6, SDSU online, SIUC online, SIUE lovejoy, TTU online, UAr online, UCI online, UCSD online, UH online, UK online, UM online, UMi online, UNCC online, UOk online, UPi online, USD online, UT online, UTo online & carlson & depos, UWa online, VU online, WSU online & sci, }
>=20 items found as of 8/11/2021 catalog
v56#7-v138#42(21) checked 8/11/2021

(new reference 3/13/2021)
Kezhen Yin, Jingwei Zhang, Zhenpeng Li, Jingxing Feng, Ci Zhang, Xinyue Chen, Andrew Olah, Donald E. Schuele, Lei Zhu, and Eric Baer, x Polymer multilayer films for high temperature capacitor application ," Journal of Applied Polymer Science, vol. 136 no. 20, pp. 47535-1-47535-, May 20, 2019. https://doi.org/10.1002/app.47535

Shuna Meng Hui He Yunchao Jia Peng Yu Bai Huang Jian Chen Effect of nanoparticles on the mechanical properties of acrylonitrile–butadiene–styrene specimens fabricated by fused deposition modeling ," Journal of Applied Polymer Science, vol. 134 no. 7, pp. 44470-1-44470-, Feb. 15, 2017. https://doi.org/10.1002/app.44470

Xiaoyun An, Jingjing Ma, Kai Wang, Maosheng Zhan, Growth of silver nanowires on carbon fiber to produce hybrid/waterborne polyurethane composites with improved electrical properties ," Journal of Applied Polymer Science, vol. 133 no. 9, pp. 43056-1-43056-, Mar. 5, 2016. https://doi.org/10.1002/app.43056

--------------------------------------------------------
Journal of Applied Surface Finishing
1 item found as of 1/30/2011 catalog

Brooman, Eric W., x "Nickel- and Cobalt-based Nanocomposite Chromium Coating Alternatives," Journal of Applied Surface Finishing, vol. 1 no. 1, pp. xx-xx, Jan.-Mar. 2006.

Lal, S.,, and Moyer, T. D., x "Tin-Bismuth Finishes and the Phenomenon of Whiskers," Journal of Applied Surface Finishing, vol. 1 no. 1, pp. xx-xx, Jan.-Mar. 2006.

Olsen, K. P., and Ivey, D. G., x "Pulsed Electrodeposited Sn-Cu Alloys for Use as Pb-Free Component Finishes in Microelectronic Applications," Journal of Applied Surface Finishing , vol. 1 no. 1, pp. xx-xx, Jan.-Mar. 2006.

--------------------------------------------------------
Journal of Beijing University of Technology
Beijing Gongye Daxue Xuebao
{ https://journal.bjut.edu.cn/EN/article/showOldVolumn.do UCSD online, UOk online, UTo online, UTor online, }
1 item found as of 11/6/2020 catalog

--------------------------------------------------------
(new source 10/1/2020)
Journal of Biomedical Engineering and Research
{ http://www.jscholaronline.org/journals/journal-of-biomedical-engineering-and-research/ }
1 item found as of 10/1/2020

--------------------------------------------------------
Journal of Central South University
Zhongnan Daxue Xuebao
{ https://link.springer.com/journal/11771/volumes-and-issues FAU online, LH closed, OSU sel TN600.J68, UCSD online, UD online, UK online (pay), UMi online, UNCC online, UOk online, UPi online, USC TN600.J68, UTD online, UTor online, }
>=20 items found as of 8/9/2021
v1#1-v28#6(21) all issues checked 8/9/2021
searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

--------------------------------------------------------
Journal of Central South University (Science and Technology)
Zhongnan Daxue Xuebao (Ziran Kexue Ban)
{ https://caod.oriprobe.com/journals/zngydxxb/Journal_of_Central_South_University__Science_and_Technology_.htm FAU online, LH closed, OSU sel TN600.J68, UCSD online, UK online (pay), UMi online, UNCC online, UOk online, UPi online, USC TN600.J68, UTD online, UTor online, }
(new reference 12/30/2008)
Han, Zong-Jie, Ju, Jin-Long, Xue, Song-Bai, Fang, Dian-Song, Wang, Jian-Xin, and Yao, Li-Hua, "Microstructures of Sn-Ag-Cu lead-free soldered joints with diode-laser soldering," Journal of Central South University (Science and Technology)/ Zhongnan Daxue Xuebao (Ziran Kexue Ban), vol. 37 no. 2, pp. 229-234, Apr. 2006. Language: Chinese

(not at UK)

Li, Xiao-Yan, Yang, Xiao-Hua, Wu, Ben-Sheng, and Yan, Yong-Chang, "Evolution of intermetallic compounds in SnAg and SnAgCu lead-free solder joints during aging," Journal of Central South University (Science and Technology)/ Zhongnan Daxue Xuebao (Ziran Kexue Ban), vol. 38 no. 1, pp. 30-35, Feb. 2007. Language: Chinese

(not at UK)

Jiang, Li, Yang, Ke-Ling, Zhou, Jie-Min, Xiang, Ke, and Wang, Wen-Jie, "In situ measuring electronic-resistance strains of Sn-.5Ag solder joints creep," Journal of Central South University (Science and Technology)/ Zhongnan Daxue Xuebao (Ziran Kexue Ban), vol. 39 no. 1, pp. 80-85, Feb. 2008. Language: Chinese

(not at UK)

-------------------------------------------------------
Journal of Chemical & Engineering Data
Journal of Chemical and Engineering Data
{ https://pubs.acs.org/loi/jceaax AU online, CBU, FSU online, GIT online, LH closed, MST online, NWU online, OCU online, OGI online, OrSU online, OSU online, PU online, SDSU online, SIUC online, SIUE lovejoy, SPU online, SU online, TTU online, UAB online, UAH n1, UAr online, UC online, UCF online, UCI online, UCSD online, UD online, UDe online, UE online, UF online, UIC online, UK online, UM online, UMC online, USD online, USF online, USU online, UT online, UTA online, UTo online, WrSU online, }
1 item found as of 1/20/2021
checked 1/20/2021

-------------------------------------------------------
Journal of Chemical Education
{ https://pubs.acs.org/loi/jceda8 CBU 540.7M6, Lexmark, MST online, NWU sci 540.28J86 & 540.78T343, OCU beam, OkSU online, OSU online & sel QD1J865, PU chem 540.5J82, SDSU online, SIUC online, SIUE online, TTU, UAr online, UC chem QD1.J9, UCSD online, UD online & roesch, UE online, UIC online & sci, UK online & chem/phys QD1.J93, UL kersey QD1.J93, UM online, UMe online & chem, USD online, UT online & hodges QD1.J93, }
1 item found as of 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 10/10/2020
searched for zinc whisker(s) and Zn whisker(s) on 10/10/2020
searched for indium whisker(s) on 10/10/2020
searched for cadmium whisker(s) and Cd whisker(s) on 10/10/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/2/2020

--------------------------------------------------------
Journal of the Chemical Industry (USSR)
item found as of 1/30/2011 catalog

Ivanova and Fedorchenko, J. Chem Ind. (USSR) 18, No. 15-16, 40 (1941).

--------------------------------------------------------
Journal of Chemical Industry and Engineering (China)
Huagong Xuebao
{ https://caod.oriprobe.com/journals/hgxb/Journal_of_Chemical_Industry_and_Engineering_China_.htm LH closed, }
1 item found as of 1/30/2011

--------------------------------------------------------
Journal of Chemical Physics
{ https://aip.scitation.org/toc/jcp/current EBSCOA, CBU, CSULA QD1.J94, CSULB online, IU online & bloomington chem QD1.J836, MST online, NWU online & sci L541.05J863, OkSU online, OSU online & sel QC1J87, PU online & chem 530.5J821 & phys 530.5J821 SCSU online, SIUC online, SIUE online, SMU online, TTU online, UAr online, UC online & chem QD1.J94 & phys QD1.J94, UCSD online, UD online & roesch, UE, UIC online & sci, UK online & chem/phys DQ1.J94, UL kersey QD1.J94, UM online, UMe online & chem, UOk online, USC grand, USD online, UT online & hodges QD1.J94, UTAr online, UTD online, }
>=20 items found as of 1/20/2021
v82#1-v82#2(Jan85) checked 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 9/3/2020
searched for zinc whisker(s) and Zn whisker(s) on 9/3/2020
searched for indium whisker(s) on 9/3/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/3/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/3/2020

," Journal of Chemical Physics, vol. 82 no. 1, pp. , Jan. 1, 1985.

*** here for UK sometime *** (new reference 9/3/2020)
Nishida, Masahiko, "Application of molecular orbital method to crystalline solids: Calculation of the electronic energy bands of diamond-type crystals," Journal of Chemical Physics, vol. 69 no. 3, pp. 956-962, Aug. 1, 1978.

(not at UK) Theoretical studies of lithium incorporation into á-Sn(100) J. Chem. Phys. 138, 054706 (2013); 10.1063/1.4789525 avrami, melvin, "kinetics of phase change, i: general theory," journal of chemical physics, vol. 7 no. 12, pp. 1103-1112, dec. 1939.

avrami, melvin, "kinetics of phase change, ii: transformation-time relations for random distribution of nuclei," journal of chemical physics, vol. 8 no. 2, pp. 212-224, feb. 1940.

sears, g. w., and coleman, r. v., "growth mechanism of near-perfect crystals," journal of chemical physics , vol. 25 no. 4, pp. 635-637, oct. 1956

? vermilyea, d. a., "electrodeposition onto metal whiskers," journal of chemical physics , vol. 27 no. x, pp. 814-815, 1957

gomer, robert, "field emission from mercury whiskers," journal of chemical physics , vol. 26 no. 5, pp. 1333-1334, may 1957.

courtney, welby g., "crystal growth of silver metal. mechanism and kinetics," journal of chemical physics, vol. 27 no. 5, pp. 1349-1356, dec. 1957.

gomer, robert, "field emission from mercury whiskers," journal of chemical physics , vol. 28 no. 3, pp. 457-464, mar. 1958.

webb, w. w., and riebling, e. f., "on the growth of metal whiskers by hydrogen reduction of halides," journal of chemical physics, vol. 28 no. 6, pp. 1242-1245, june 1958.

? melmed, a. j., and hayward, d. o., "on the occurrence of fivefold rotational symmetry in metal whiskers," journal of chemical physics, vol. 31 no. x, pp. 545-546, 1959.

? melmed, a. j., and gomer, r., "field emission from metal whiskers," journal of chemical physics , vol. 30 no. x, pp. 586-587, 1959.

morelock, c. r., and sears, g. w., "growth mechanism of copper whiskers by hydrogen reduction of cuprous iodide," journal of chemical physics, vol. 31 no. 4, pp. 926-928, oct. 1959.

sears, gerald w., "dislocation etchings," journal of chemical physics, vol. 32 no. 5, pp. 1317-1322, may 1960.

sears, g. w., "nucleation and growth of mercury crystals at low supersaturation," journal of chemical physics, vol. 33 no. 2, pp. 563-567, aug. 1960.

morelock, c. r., and sears, g. w., "growth of whiskers by chemical reactions," journal of chemical physics , vol. 34 no. 3, pp. 1008-1009, mar. 1961.

? hudson j. b., and sears, g. w., "evaporation of zinc whiskers," journal of chemical physics, vol. 35 no. x, pp. 1509-1510, 1961.

melmed, a. j., and gomer, r., "field emission from whiskers," journal of chemical physics, vol. 34 no. 5, pp. 1802-1812, may 1961.

parker, robert l., and kushner, lawrence m., "growth rates of zinc crystals from the vapor phase," journal of chemical physics, vol. 35 no. 4, pp. 1345-1348, oct. 1961.

blakely, j. m., and jackson, k. a., "growth of crystal whiskers," journal of chemical physics, vol. 37 no. 2, pp. 428-430, july 15, 1962.

? sears, g. w., "ultimate strength of crystals," journal of chemical physics, vol. 36 no. x, pp. 862, 1962.

stager, r. a., balchan, a. s., and drickamer, h. g., "high-pressure phase transition in metallic tin," journal of chemical physics, vol. 37 no. 5, pp. 1154, sept. 1, 1962.

parker, r. l., and hardy, s. c., "vapor-phase growth kinetics of potassium whiskers by field emission," journal of chemical physics, vol. 37 no. 8, pp. 1606-1609, oct. 13, 1962.

melmed, allan j., "field-electron and field-ion emission from single vapor-grown whiskers," journal of chemical physics, vol. 38 no. 3, pp. 607-612, feb. 1, 1963.

thompson, w. a., "lead whisker growth from the metallic vapor phase," journal of chemical physics, vol. 68 no. 4, pp. 1854-1856, feb. 15, 1978.

v82#1-v82#2(Jan85) checked 10/19/2015
--------------------------------------------------------
Journal of the Chinese Institute of Engineers
Chung-Kuo, Kung Ch'eng Hsueh K'an
Zhongguo gong cheng xue kan (Online) { https://www.tandfonline.com/loi/tcie20 AU rbd TA4.C3578, BYU hbll TA1.C48x, CMU eng, CSULB online, FAU online, FIU online, IU online, LH closed, MST wilson TA1.C45, OkSU online, OrSU valley TA1.C44, OSU sel TA4.C45, PU eng 620.005C472 & hicks 620.005C472, SDSU online, UAr online, UC eng TA4.C3478, UCI sci drum TA1.C387, UCSD online, UDe online, UF online, UIUC eng 620.5JOC, UM online, UMC online, UOk online, UPi online, USU merrill-cazier, UT hodges TA4.C3578, UTAr depos TA1.C45, UTo online, UTor eng TA1.C47, }
6 items found as of 8/9/2021 catalog
v1#1-v44#5(21) all issues checked 8/9/2021
searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

--------------------------------------------------------
Journal of Cleaner Production
{ https://www.sciencedirect.com/journal/journal-of-cleaner-production/issues AU online, CMU online, FAU online, FIU online, FSU online, GIT online, IU online, LU gray, NWU online, OGI online, OkSU online, OSU online, PU online, RU online, SDSU online, UC online, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UM online, UMC online, UMI online, UNCC online, UNF online, UOk online, USF online, USU online, UT online, UTo online, UTor online, UWa online, WrSU online, }
>=20 items found as of 8/8/2021 catalog
v1#1-v314(21) all issues checked 8/8/2021

--------------------------------------------------------
Journal of Computational and Theoretical Nanoscience
{ https://www.ingentaconnect.com/content/asp/jctn NWU sci L620.505J86, PU online, RU online, UC biol T174.7.J676, UM offsite T174.7.J676, }
4 items found as of 5/19/2014 catalog
v1#1-v9#12 all issues checked 5/19/2014

--------------------------------------------------------
Journal of Crystal Growth
{ https://www.sciencedirect.com/journal/journal-of-crystal-growth/issues EBSCOA, CMU online & eng, CSULB online, MST online, OkSU online, OSU online & sel QD921J6, SDSU online, SIUC morris 53065-5481, SMYU online, UAr online, UCSD online, UK online sd (pay) & eng QD921.J6, UL online & ekstrom QD921.J67, UM online sd (pay), UOk online, UPi online, USC grand, UT online & hodges QD901.J68, UTAr online, UTD online, }
>=20 items found as of 8/6/2021
v1#1-v570(21) all issues checked 8/6/2021
searched for tin whisker(s) and Sn whisker(s) on 8/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/5/2020
searched for indium whisker(s) on 8/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/3/2020

new reference 7/10/2021
," Journal of Crystal Growth, vol. 568-569, pp. , 2021.

Yuri Yu. Hervieu On the kinetics of the early stage of growth of III-V nanowires ," Journal of Crystal Growth, vol. 568-569, pp. 126187-1-126187-, Aug. 15, 2021. https://doi.org/10.1016/j.jcrysgro.2021.126187

--------------------------------------------------------
Journal of Dalian University of Technology
Dalian li gong da xue zhu ban
{ http://www.oriprobe.com/journals/dllgdxxb.html LH closed, UCSD online, UOk online, UPi online, USC AS452.D34D35, UTor online, }
1 item found as of 1/30/2011 catalog

(new reference 12/29/2008)
Liu, Xiao-Ying, Ma, Hai-Tao, Wang, Lai .Effect of super-fine oxide powders on mechanical properties and microstructures of Sn-58Bi Dalian Ligong Daxue Xuebao/Journal of Dalian University of Technology, v 48, n 1, January, 2008, p 51-57 Language: Chinese

Zhao, Ning, Wang, Jian-Hui, Pan, Xue-Min, Ma, Hai-Tao, Wang, Lai .Effect of Cu content on microstructure and interfacial reactions of Sn-based lead-free solders Dalian Ligong Daxue Xuebao/Journal of Dalian University of Technology, v 48, n 5, September, 2008, p 661-667 Language: Chinese

--------------------------------------------------------
Journal of Electroanalytical Chemistry
{ https://www.sciencedirect.com/journal/journal-of-electroanalytical-chemistry/issues MST online, OkSU online, OSU online & QD115A1J6, SDSU online, SIUC morris 51557-5403, SIUE lovejoy, UAr online, UCSD online, UK online sd & chem/phys QD551.J6, UL kersey QD551.J6, UMe chem, UOk online, UT online, }
3 items found as of 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 12/4/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/4/2020
searched for indium whisker(s) on 12/4/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/4/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/4/2020

--------------------------------------------------------
Journal of Electroceramics
{ https://link.springer.com/journal/10832/volumes-and-issues AU online, FSU online, GIT online, IU online, LH closed, MST online, OGI online, OkSU online, OrSU online, OSU online, PU online, SDSU online, SIUC online, SU online, UC online, UCF online, UCI online, UCSD online, UD online, UDe online, UF online, UIC online, UIUC online, UK online, UM online, UMC online, UOk online, USD online, USF online, UTA online, WrSU online, }
>=20 items found as of 8/9/2021
v1#1-v44#4(20) all issues checked 8/9/2021
searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

--------------------------------------------------------
Journal of the Electrochemical Society
{ https://iopscience.iop.org/journal/1945-7111 MST online, OkSU online, OSU online & sel TP250E5, SDSU online, SIUC online, SIUE online, TTU, UAr online, UC eng TP250.E5, UCSD online, UE, UK online sd & chem/phys TP250.E595, UL kersey TP250.E542, UM online, UMe chem, UOk online, UT online, }
>=20 items found as of 8/8/2021
v167#12-v168#8(21) checked as of 8/8/2021

searched for tin whisker(s) and Sn whisker(s) on 7/18/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/8/2020
searched for indium whisker(s) on 8/8/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/8/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/4/2020

--------------------------------------------------------
Journal of Electronic Materials
{ https://link.springer.com/journal/11664/volumes-and-issues CMU online, CSULB online, OSU sel TK7871J66, PU eng 621.38105 J826, SDSU online, TTU online, UAr online, UCSD online, UIC daley periodicals, UK online & eng TK7871.J66, UL kersey TK7871.J66, UM online, UOi online, USC grand, USD online, }
>=20 items found as of 8/9/2021
v1#1-v50#9(21) all issues checked 8/9/2021
searched for tin whisker(s) and Sn whisker(s) on 8/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/5/2020
searched for indium whisker(s) on 8/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/3/2020

(new reference 2/23/2021)
," Journal of Electronic Materials, vol. 50 no. 9, pp. , Sept. 2021.

Yongping Gan, Zhe Yu, Hui Huang Highly Efficient Synthesis of Silicon Nanowires from Molten Salt Electrolysis Cell with a Ceramic Diaphragm ," Journal of Electronic Materials, vol. 50 no. 9, pp. 5021-5028, Sept. 2021, https://doi.org/10.1007/s11664-021-08941-5

Chengyu GuanJun ZouMingming Shi Influence of Soldering Temperature on Microstructure and Thermal Properties of FC-LED Filaments Soldered with SAC0307 ," Journal of Electronic Materials, vol. 50 no. 7, pp. 4186-4195, July 2021. https://doi.org/10.1007/s11664-021-08957-x

Yupeng Wang, Haibin Liu, Hung-Chun Wu Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Sputter Cu-Ti Alloy Film UBM ," Journal of Electronic Materials, vol. 50 no. 6, pp. 3692-3698, June 2021. https://doi.org/10.1007/s11664-021-08925-5

Sonia Blel, C. Bilel Modeling of the Growth Mechanisms of GaAsBi and GaAs Nanowires ," Journal of Electronic Materials, vol. 50 no. 6, pp. 3380-3384, June 2021. https://doi.org/10.1007/s11664-021-08850-7

Zheng Liu, Li Yang, Hui Ming Gao IMC Growth and Mechanical Properties of Cu/In-48Sn/Cu Solder Joints ," Journal of Electronic Materials, vol. 50 no. 6, pp. 3326-3333, June 2021. https://doi.org/10.1007/s11664-021-08844-5

Sadegh Mirmehdi,Amir Nourani, Ahmad Assempour, x Influence of Joint Arrangement on the Fracture Behavior of Lead-Free Solder Joints ," Journal of Electronic Materials, vol. 50 no. 4, pp. 2117-2128, Apr. 2021. https://doi.org/10.1007/s11664-021-08748-4

Z. J. Zhang, and M. L. Huang, x In Situ Observation of Electromigration-Induced Anomalous Precipitation of Ag3Sn Phase in Ag-Containing Solder Joints ," Journal of Electronic Materials, vol. 50 no. 4, pp. 2111-2116, Apr. 2021. https://doi.org/10.1007/s11664-020-08670-1

S. F. N. Muhd Amli, M. A. A. Mohd Salleh, K. Nogita Origin of Primary Cu6Sn5 in Hypoeutectic Solder Alloys and a Method of Suppression to Improve Mechanical Properties ," Journal of Electronic Materials, vol. 50 no. 3, pp. 710-722, Mar. 2021. https://doi.org/10.1007/s11664-020-08428-9

--------------------------------------------------------
Journal of Electronic Packaging
Journal of Electronic Packaging, Transactions of the ASME
ASME Journal of Electronic Packaging
{ https://asmedigitalcollection.asme.org/electronicpackaging/issue/browse-by-year CBU, CMU online & eng, CSULa north TK7870.J656, CSULB online, FAU online & wimberly TK7870.J656, FIU online & green TK7870.J656, GIT online & main-6e TK7870.J68X, MST online, NWU online, OkSU online, OSU online & TK7870J58, PU online & eng 621.381046J826, SDSU TK7870.J656, SIUC online, SIUE lovejoy, TTU online, UAB online & sterne TK7870.J656, UAr online, UCF online & main TK7870.J656, UCI online & sci TK7870.J656, UCSD online, UF online & sci TK7870.J656, UH online, UIC online & daley TK7870.J656, UK online & eng TK7870.J656, UL kersey TK7870.J656, UM online, UMi online & richter TK7870.J656, UOk online, UPi online, USC grand, UT online, VU online & TK7870.J656, }
>=20 items found as of 6/20/2021 catalog
v111#1-v143#3(21) checked 6/20/2021

searched for tin whisker(s) and Sn whisker(s) on 1/24/2021
searched for zinc whisker(s) & Zn whisker(s) on 1/24/2021
searched for indium whisker(s) on 1/24/2021
searched for cadmium whisker(s) & Cd whisker(s) on 1/24/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 1/24/2021

(new reference 2/26/2021)
," Journal of Electronic Packaging, vol. 143 no. 2, pp. , 2021.

John H. Lau State of the Art of Lead-Free Solder Joint Reliability ," Journal of Electronic Packaging, vol. 143 no. 2, pp. 020803-1-020803, June 2021. doi: https://doi.org/10.1115/1.4048037

Minghong Jian, Sinan Su, Sa'd Hamasha, Mohammad M. Hamasha, Atif Alkhazali Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint ," Journal of Electronic Packaging, vol. 143 no. 1, pp. 011008-1-011008-, Mar. 2021. https://doi.org/10.1115/1.4047341

Yuan, Jianwen, Huang, Chao, Chen, Jimin, Liu, Furong, and Qiu, Yi, "Investigation on Laser Direct Welding of Quad Flat Pack Components," Journal of Electronic Packaging, vol. 135 no. 4, pp. 044501-1-044501-, Dec. 2013. https://doi.org/10.1115/1.4025251

Mahan, Kenny, Rosen, David, and Han, Bongtae, "Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions," Journal of Electronic Packaging, vol. 138 no. 4, pp. 041003-1-041003-, Dec. 2016. https://doi.org/10.1115/1.4034454

Shah, Jimil M., Awe, Oluwaseun, Gebrehiwot, Betsegaw, Agonafer, Dereje, Singh, Prabjit, Kannan, Naveen, and Kaler, Mike, "Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope," Journal of Electronic Packaging, vol. 139 no. 2, pp. 020903-1-020903-, June 2017. https://doi.org/10.1115/1.4036363

Shah, Jimil M., Misrak, Abel, Agonafer, Dereje, and Kaler, Mike, "Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization," Journal of Electronic Packaging, vol. 141 no. 3, pp. 031003-1-031003-, Sept. 2019. https://doi.org/10.1115/1.4043481

Awe, Oluwaseun, Shah, Jimil M., Agonafer, Dereje, Singh, Prabjit, Kannan, Naveen, and Kaler, Mike, "Experimental Description of Information Technology Equipment Reliability Exposed to a Data Center Using Airside Economizer Operating in Recommended and Allowable ASHRAE Envelopes in an ANSI/ISA Classified G2 Environment," Journal of Electronic Packaging, vol. 142 no. 2, pp. 024501-1-024501-, June 2020. https://doi.org/10.1115/1.4046556

Chao, Nien-Hua, Dispenza, John A., and DeAngelis, Mario, "Advanced Methodologies for Developing Improved Potted Smart Munitions for High-G Applications," Journal of Electronic Packaging, vol. 135 no. 3, pp. 031002-1-031002-, Sept. 2013. https://doi.org/10.1115/1.4024301

Chao, N. H., and Carlucci, D. E., "New Electronic Packaging Method for Potted Guidance Electronics to Sustain Temperature Cycling and Survive High-G Applications," Journal of Electronic Packaging, vol. 141 no. 2, pp. 021003-1-021003-12, June 2019. https://doi.org/10.1115/1.4042471

Travis Dale, Yuvraj Singh, Ian Bernander, Ganesh Subbarayan, Carol Handwerker, Peng Su, Bernard Glasauer "Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads," Journal of Electronic Packaging , vol. 142 no. 4, pp. 041001-1-041001-, Dec. 2020. doi: https://doi.org/10.1115/1.4048109

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Journal of Electronics Manufacturing
{ https://www.worldscientific.com/worldscinet/jem EBSCOB, CSULA online, CSULB online, MIT online, NEU snell T1.J3240, OkSU online, OSU online, SDSU online, SMU online, UAr online, UCSD online, UK online, UOk online, UPi online, USC TK7836.J676, USD online, UT online, UTAr online, UTD online, UTo online, }
>=20 items found as of 8/2/2021 catalog
v1#1-V11#2(02, ended publication) all issues checked 8/2/2021

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Journal of Electrostatics
{ https://www.sciencedirect.com/journal/journal-of-electrostatics/issues CMU online & eng, CSULB online, GIT online, MSU online, OSU online, UC online, UCF online, UF online, UM online, UPi online, USC QC570.J68, UT online, UTAr online, UTD online, VU online, }
>=20 items found as of 8/8/2021
v1#1-v112(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 12/4/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/4/2020
searched for indium whisker(s) on 12/4/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/4/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/4/2020

(new reference 6/10/2021)
William D Greason Pages Electrostatic discharge characteristics for the human body and circuit packs ," Journal of Electrostatics, vol. 59 no. 3-4, pp. 285-300, Oct. 2003. https://doi.org/10.1016/S0304-3886(03)00090-1

Sven Bönisch, David Pommerenke, Wilfried Kalkner Pages Broadband measurement of ESD risetimes to distinguish between different discharge mechanisms ," Journal of Electrostatics, vol. 56 no. 3, pp. 363-383, Oct. 2002. https://doi.org/10.1016/S0304-3886(02)00056-6

J.H Tortai, A Denat, N Bonifaci Self-healing of capacitors with metallized film technology:: experimental observations and theoretical model ," Journal of Electrostatics, vol. 53 no. 2, pp. 159-169, Aug. 2001. https://doi.org/10.1016/S0304-3886(01)00138-3

Steve Van den Berghe, Daniel De Zutter Study of ESD signal entry through coaxial cable shields ," Journal of Electrostatics, vol. 44 no. 3-4, pp. 135-148, Sept. 1998. https://doi.org/10.1016/S0304-3886(98)00035-7

Zhiyu Wang, Suijun Yang, Shuliang Ye "An equivalent discharge model of electrostatics spark," Journal of Electrostatics, vol. 111, pp. 103576-1-103576-, May 2021. https://doi.org/10.1016/j.elstat.2021.103576

Francis, C. R., x Electrostatic charging problems of spacecraft pp. 265-280 ," Journal of Electrostatics>/CITE>, vol. 11 no. 3, pp. , 1982. https://doi.org/10.1016/0304-3886(82)90017-1

Gallo, C. F., W.L. Lama Some charge exchange phenomena explained by a classical model of the work function pp. 145-150 ," Journal of Electrostatics>/CITE>, vol. 2 no. 2, pp. , June 1976. https://doi.org/10.1016/0304-3886(76)90005-X

Pommerenke, David, x ESD: transient fields, arc simulation and rise time limit Journal of Electrostatics Volume 36, Issue 1, November 1995, pp. 31-54 https://doi.org/10.1016/0304-3886(95)00033-7

Lin, Weigan, Yumin Xiang Electrostatic force on the walls of a rectangular coaxial line Journal of Electrostatics Volume 43, Issue 4, 1 June 1998, pp. 275-283 https://doi.org/10.1016/S0304-3886(98)00006-0

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Journal of Environmental Management
{ https://www.sciencedirect.com/journal/journal-of-environmental-management/issues AU online, BoU online, BYU online, CSULB online, FAU online, FIU online, FSU online, LH closed, MIT online, MST online, NWU online, OGI online, OkSU online, OrSU online, OSU online, PU online, RyU online, SDSU online, SIUC online, UAr online, UC online, UCF online, UCI online, UCSD online, UD online, UDe online, UF online, UIC online, UIUC online, UK online (pay), UM online, UMC online, UMi online, UNCC online, UNF online, USC grand, USD online, USF online, USU online, UT online, UTA online, UTo online, UWa online, }
16 items found as of 8/8/2021
v78#1-v295(21) checked 8/8/2021

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Journal of Environmental Monitoring
{ OSU online, UC online, UK online & remote TD172.J58, UL online, UM online, }
1 item found as of 1/20/2021

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Journal of Environmental Quality
{ MST online, OkSU online, OSU faes S1J863, SDSU online, SIUC online, SIUE online, TTU online, UAr online, UCSD online, UE, UK young S1.J780, UL ekstrom S1.J78, UMe law, UOk online, USD online, UT online, }
1 item found as of 1/30/2011
v5#4 checked 4/4/2008

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Journal of Environmental Science and Health - Part C Environmental Carcinogenesis and Ecotoxicology Reviews
{ GIT online & main RC268.5.J68, MST online, OkSU online, OSU online, PU life 301.3105En95c, SDSU online, SIUC online, UAr online, UC sw depos TD172.E564, UCF online, UCI online, UCSD online, UM online, UOk online, USD online, UT online, UTo online, }
1 item found as of 1/30/2011

-------------------------------------------------------
(new source 7/7/2020)
Journal of the European Ceramic Society
{ https://www. sciencedirect.com/journal/journal-of-the-european-ceramic-society/issues UK online, }
1 item found as of 1/20/2021

-------------------------------------------------------
Journal of Experimental and Theoretical Physics
Zhurnal eksperimentalnoi i teoreticheskoi fiziki
{ https://link.springer.com/journal/11447/volumes-and-issues AU online, BoU online, BYU lee QC1.Z472, CMU online & eng, CSULA online, CSULB online, FAU online & wimberly QC1.Z472, FIT online, FIU online & green QC1.Z472, FSU online, GIT online & main-4e QC1.Z4713 & main-4e QC1.Z472, IU b-swain QC1.S73, LH closed, LU gray QC1.Z5, MIT online, MST wilson QC1.Z472, MSU remote QC1.Z472 & sci QC1.Z472, NEU snell QC1.J4030, NWU online & sci L530.5Z63X, OGI online, OrSU online, OSU online & sel QC1S67902, PU online & phys 530.5So1E & hicks 530.5Z58p & 530.6R92, RU online, SDSU online, SIUC morris 54139-5302 & storage 530.5Z63, SMU online, SU online, TU tisch QC1.Z472 & tisch microforms MFR351, UAB sterne QC1.Z472, UAH online, UAr storage QC1.Z472, UC online, UCB mathphysics QC1.Z472 & pascal QC1.Z472, UCF online, UCI online, UCSD online, UD online, UDe online, UF online, UIC online & warehouse QC1.Z47, UIUC online, UK online, UL online & kersey QC1.Z472, UM online & shapiro QC1.Z62 & buhr QC1.Z62, UMC online, UMi online & richter QC1.Z472, UOk bizzell QC1.Z472, UPi online & storage, USC online, USD online, USF online, UT hodges QC1.Z472, UTA online, UTAr online, UTD online, UTo online, VU online & sci QC1.Z472, WrSU online, WSU sci, }
1 item found as of 1/20/2021 catalog
searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

(new reference 1/20/2021)
A. Komar and K. Ivanov, Exptl. Theoret. Phys. (USSR) (Zhurnal Eksperimentalnoi i teoreticheskoi Fiziki) 6, 256 (1936).

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Journal of Failure Analysis and Prevention
{ https://link.springer.com/journal/11668/volumes-and-issues EBSCOA, CSULB online, FAU online, OkSU online, SDSU online, SMU online, UCI online, UCSD online, UD online, UK online (pay), UMi online, UNCC online, UOk online, UPi online, USC TA169.5.P73, USD online, UTAr online, UTD online, UTor online, UWa online, }
13 items found as of 8/6/2021
v1#1-v21#2(21) all issues checked 8/6/2021
searched for tin whisker(s) & Sn whisker(s) on 9/3/2020
searched for zinc whisker(s) & Zn whisker(s) on 9/3/2020
searched for indium whisker(s) on 9/3/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/3/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/3/2020

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Journal of the Franklin Institute
{ https://www.sciencedirect.com/journal/journal-of-the-franklin-institute/issues CBU, MST online, NWU online, OkSU online, OSU online & depos T1.F83, PU online & hicks 605J82, SDSU online, SIUC storage 52526-6002, SIUE storage, TTU, UAr storage T1.F8, UC eng T1.F8, UCSD online, UE, UIC online & daley T1.F8, UK online sd & young T1.F8 & S2 Reel 282-287, UL kersey T1.F8, UM online, UOk online, USD online, UT online & hodges T1.F8, }
1 item found as of 1/20/2021
searched for tin whisker(s) & Sn whisker(s) on 9/5/2020
searched for zinc whisker(s) & Zn whisker(s) on 9/5/2020
searched for indium whisker(s) on 9/5/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/5/2020

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Journal of Functional Materials
Gongneng Cailiao
{ http://www.oriprobe.com/journals/gncl.html }
item found as of 1/30/2011 catalog

(new reference 12/29/2008)
Effect of cooling rates on the microstructure and mechanical behavior of Sn-Ag solder Shen, Jun; Gao, Hou-Xiu; Liu, Yong-Chang; Wei, Chen; Yang, Yu-Qin Gongneng Cailiao/Journal of Functional Materials, vol. 36 no. 1, Jan. 2005, pp. 47-49 Language: Chinese

Liu, Peng, Gao, Yuan, Guo, Fu, Lei, Yong-Ping, Xia, Zhi-Dong, and Shi, Yao-Wu, "Progress and research in lead-free composite solder," Journal of Functional Materials, vol. 37 no. Supplement, pp. 823-826, Sept. 2006.

Zhang, Jin-Song, Li, Juan-Juan, Wu, Feng-Shun, Zhu, Yu-Chun, An, Bing, Wu, Yi-Ping .Behavior of whisker growth from the pure Sn coating under the temperature cycling condition Gongneng Cailiao/Journal of Functional Materials, v 38, n 11, Nov., 2007, p 1837-1840 Language: Chinese

Li, Wen-Bu, Wang, Luo-Li, Yu, Jie, Wang, Chen .Study on preparation and properties of anisotropic conductive adhesive film Gongneng Cailiao/Journal of Functional Materials, v 39, n 1, January, 2008, p 57-59+63 Language: Chinese

Zhang, Zhi-Hao, Shi, Li-Yi, Dai, Kai, Yu, Xing-Xin, Zhu, Wei-De .Study on preparation and properties of a new nano-size conductive adhesive Gongneng Cailiao/Journal of Functional Materials, v 39, n 2, February, 2008, p 337-340 Language: Chinese

Xu, Dong-Xia, Lei, Yong-Ping, Zhang, Bing-Bing, Zhu, Lei, Xia, Zhi-Dong, Shi, Yao-Wu, Guo, Fu .Wettability evaluation of new soldering fluxes for Sn-Zn lead-free solder Gongneng Cailiao/Journal of Functional Materials, v 39, n 4, April, 2008, p 701-704 Language: Chinese

Lei, Gang, Yang, Wen-Bin, Wei, Ming, Zhou, Yuan-Lin, Xie, Chang-Qiong, He, Fang-Fang, Zhang, Bing-Jie, Zhang, Xin-Chao .Study on electroless Ni-P plating of glass fiber Gongneng Cailiao/Journal of Functional Materials, v 39, n 7, July, 2008, p 1128-1130 Language: Chinese

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Journal of Functional Materials and Devices
Gongneng Cailiao yu Qijian Xuebao
{ https://caod.oriprobe.com/journals/gnclyqjxb/Journal_of_Functional_Materials_and_Devices.htm }
item found as of 1/30/2011 catalog

Zhang, Dong-Mei, Ding, Gui-Fu, Wang, Hong, Jiang, Zheng, Yao, Jin-Yuan Low temperature hermetic bonding process based on electrodeposited Sn/Bi alloy Gongneng Cailiao yu Qijian Xuebao/Journal of Functional Materials and Devices, v 12, n 3, June 2006, p 211-214 Language: Chinese

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Journal of Hazardous Materials
{ https://www.sciencedirect.com/journal/journal-of-hazardous-materials/issues CSULB online, FAU online, FIU online, FSU online & dirac 660.5J8633, GIT online & main T55.3.H3J68, IU online, MST wilson T55.3.H3J68, OkSU online, OSU online, PU online & eng 628.532D433 & eng 363.1705J826, SDSU online, SIUC online, UAr online, UC online & eng T55.3.H3J68 & sw depos T55.3.H3J68, UCF online, UCI online & sci T55.3H3J6, UCSD online, UK online (pay) & eng T55.3.H3J68, UM online, UMi online & richter T55.3.H3J68, UNCC online, UOk online, USC online, UT online & hodges T55.3.H3J68, UTo online & carlson, UTor online, UWa online, }
>=20 items found as of 8/8/2021
v129#1-3,v136#3,v139#3,v161#1-v417(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 12/4/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/4/2020
searched for indium whisker(s) on 12/4/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/4/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/4/2020

------------------------------------------------------
Journal of Hebei University of Science and Technology
Hebei ke ji da xue xue bao
{ https://caod.oriprobe.com/journals/hbkjdx/Journal_of_Hebei_University_of_Science_and_Technology.htm LH closed, UCSD online, UOk online, }
item found as of 1/30/2011 catalog

Hua, Man (Material Sci. & Eng. Coll., Henan Sci. & Technol. Univ., Luoyang, China); Zhang Ke-Ke; Yang Jie; Cheng Guang-Hui; Huang Jin-Liang Present situation of microjoining lead-free solder and application of rare earth Journal of Hebei University of Science and Technology, v 26, n 1, Feb. 2005, p 10-13

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Journal of Henan University of Science and Technology (Natural Science)
Henan Keji Daxue Xuebao (Ziran Kexue Ban)
{ UCSD online, UOk online,
item found as of 1/30/2011 catalog

Influence of Ag on Microstructure and Mechanical Properties of Sn-57Bi Lead-Free Solder Henan Keji Daxue Xuebao (Ziran Kexue Ban) / (Journal of Henan University of Science and Technology) (Natural Science) (China), vol. 25, pp. 10-13, June 2004

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Journal of High Temperature Society of Japan
Koon Gakkai shi
{ CSULB online, LH closed, OkSU online, }
1 item found as of 1/30/2011

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Journal of Huazhong University of Science and Technology (Natural Science Edition)
Huazhong Keji Daxue Xuebao (Ziran Kexue Ban)
{ LH closed, UOk online, UTo online, UTor online, }
item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Wu, Fengshun, Zhang, Weigang, Zhang, Jinsong, Wu, Yiping .Four-point probe measurement of electromigration failure Huazhong Keji Daxue Xuebao (Ziran Kexue Ban)/Journal of Huazhong University of Science and Technology (Natural Science Edition), v 35, n 6, June, 2007, p 85-88 Language: Chinese

Zhang, Jinsong, Zhu, Yuchun, Li, Juanjuan, Wu, Yiping .Relations between the chemical composition of Sn finish and Sn whisker growth under temperature cycling Huazhong Keji Daxue Xuebao (Ziran Kexue Ban)/Journal of Huazhong University of Science and Technology (Natural Science Edition), v 36, n 3, March, 2008, p 24-27 Language: Chinese

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Journal of Hunan University Natural Sciences
Journal of Hunan University (Natural Sciences)
Hunan Daxue Xuebao
{ http://jonuns.com/index.php/journal/search UOk online, UTo online, UTor online, }
item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Yang, Shi-Qiang, Lei, Xiao-Juan, Li, Yuan-Shan, Chen, Zhen-Hua .Microstructure and physical properties of Sn-20Bi-X lead-free solders Hunan Daxue Xuebao/Journal of Hunan University Natural Sciences, v 34, n 3, March, 2007, p 49-52 Language: Chinese

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Journal of Industrial Ecology
{ https://onlinelibrary.wiley.com/loi/15309290 EBSCOA, BoU online, CPL washington, CSULA online, CSULB online, IU online, KYVL, MIT online, MST online, NEU online, OkSU online, OSU online & sel TS161.J68, PU online & eng 658.408J826, SDSU online, SIUC online, SMU online, TU online, UAr online, UC online & daap TS1.J68, UCSD online, UIC online, UK online, UM online & shapiro TS161.J681, UOk online, USC TS161.J68, USD online, UT online, UTAr online, UTD online, }
>=20 items found as of 8/6/2021
v1#1-v25#3(21) all issues checked 8/6/2021

-------------------------------------------------------
Journal of the Institute of Metals
{ MST depos 671In7, NWU sci 660.6I591j, OkSU stillwater 669.06I59j, OSU sel TN1I5, PU hicks 669.06In7 & 669.005M57, SDSU compact TN1.I57, SIUC morris 54571-6691, TTU, UAr mullins per-microfilm TS200.J67, UC eng TS200.I5 & sw depos TS200.I5, UCSD s&e TN1.I605, UD roesch, UIC warehouse TS200.I5, UK eng TS200.I5, UM buhr TN1.I59j, UOk bizzell TS200.I5, UT hodges closed TS200.I5, UTo carlson, WSU sci, }
3 items found as of 1/30/2011

Brinson and Moore, J. Inst. Metals, 1951, 79, 429. *** not applicable ***

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(new source 7/7/2020)
Journal of Intelligent Material Systems and Structures
{ https://journals.sagepub.com/loi/jima UK online, }
1 item found as of 1/20/2021

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(new source 6/28/2020)
Journal of the Iron and steel institute
J. Iron Steel Inst., London
{ }
(new reference 6/28/2020)
[osenbach3 33] N. J. Petch, J. Iron Steel Inst., London 174, 25 a1953b. --------------------------------------------------------
Journal of Irreproducible Results
{ OSU sel Q167.J68, UC ceas Q167.J68 & sw depos Q167.J68, UL health, UT hodges Q167.J68, }
1 item found as of 1/30/2011

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Journal of the Japan Institute of Energy
Nihon Enerugi Gakkaishi
{ https://www.jstage.jst.go.jp/browse/jie/list/-char/en CSULB online, FIU online, IU online, LH closed, NWU online, OSU online, SDSU online, SU online, UF online, UK online, UMi online, UMC online, UPi online, }
item found as of 8/8/2021 catalog
v86#1-v100#7(21) checked 8/8/2021

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Journal of Japan Institute of Light Metals
Keikinzoku
{ https://www.jstage.jst.go.jp/browse/jilm/list/-char/en AU online, CSULB online, LH closed, MST online, NWU online, OSU online, SDSU online, SU online, UCB online, UCI online, UCSD online, UDe online, UK online, UMC online, VU online, }
11 items found as of 8/8/2021 catalog
v44#1-v71#6(21) checked 8/8/2021

searched for tin whisker(s) & Sn whisker(s) on 5/11/2021
searched for zinc whisker(s) & Zn whisker(s) on 5/11/2021
searched for indium whisker(s) on 5/11/2021
searched for cadmium whisker(s) & Cd whisker(s) on 5/11/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 5/11/2021

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Journal of the Japan Institute of Metals and Materials
Journal of the Japan Institute of Metals
Journal of Japan Institute of Metals
Nihon Kinzoku Gakkaishi
Nippon Kinzoku Gakkaishi
{ https://www.jstage.jst.go.jp/browse/jinstmet/list/-char/en https://www.jstage.jst.go.jp/browse/jinstmet1937/list/-char/en CMU eng, CSULB online, GIT main TN4.N48X, LH closed, MIT hayden TN.J35, MST depos 20.1605N627, NWU sci L669.06J35n, PU eng 669.06J27j & hicks 669.06J27j, RU fondren TN4.N5, UC eng TN4.J6, UF online, UH TA459.N54, UK online, UTor eng TN4.N45, }
>=20 items found as of 8/8/2021 catalog
v38#10,v53#3,v54#1-v85#8(21) checked 8/8/2021

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Journal of Japan Research Institute for Advanced Copper-Base Materials and Technologies
{ https://ci.nii.ac.jp/ncid/AA11995570?l=en LH closed, }
1 item found as of 1/30/2011 catalog

Takemoto, T Interfacial reaction between copper and lead-free solder and reliability of solder joint. Journal of Japan Research Institute for Advanced Copper-Base Materials and Technologies. Vol. 43, pp. 6-11. 2004

Kodama, A, Shibuya, Y, Honda, J, Kimura, N, Nobuyoshi, R, Whisker growth on lead-free plating. Journal of Japan Research Institute for Advanced Copper-Base Materials and Technologies. Vol. 43, pp. 246-250. 2004

Uenishi, K, Hirose, A, Kobayashi, K F Effect of platings on Cu surface on reliability of micro joints using Sn-Ag based lead free solders. Journal of Japan Research Institute for Advanced Copper-Base Materials and Technologies. Vol. 43, pp. 251-255. 2004

--------------------------------------------------------
Journal of the Japan Society for Heat Treatment
Netsu Shori
{ LH closed, }
1 item found as of 1/30/2011

--------------------------------------------------------
Journal of Japan Society of Mechanical Engineers
item found as of 1/30/2011 catalog

Yoshimura, J, UMeda, H, Nakayama i, T, Aoyama i, K, Design engineering - system Journal of Japan Society of Mechanical Engineers. Vol. 106, no. 1017, pp. 626-629. Aug. 2003

--------------------------------------------------------
Journal of the Japan Society of Powder and Powder Metallurgy
Funtai Oyobi Fummatsu Yakin
{ https://www.jstage.jst.go.jp/browse/jjspm/list/-char/en FIU online, GIT main-6e TN695.F8X, LH closed, UCI online, UK online, }
1 item found as of 1/20/2021 catalog
v27#1-v28#8,v54#11 checked 1/20/2021

--------------------------------------------------------
Journal of the Japan Welding Society
Yosetsu Gakkai Shi
{ https://www.jstage.jst.go.jp/browse/jjws/list/-char/en CSULB online, LH closed, OkSU online, OSU sel TS227.A1Y676, UF online, UIUC eng Q.671.5205YOS, UK online, }
5 items found as of 1/20/2021

--------------------------------------------------------
Journal of the Korean Institute of Metals and Materials
{ LH closed, }
1 item found as of 1/30/2011

--------------------------------------------------------
(new source 6/22/2020)
Journal of the Korean Physical Society
J. Korean Phys. Soc.
{ https://link.springer.com/journal/40042/volumes-and-issues }
(new reference 6/22/2020)
H. Park, D.-Y. Kim, S.-J. Hwang, and Y.-C. Joo, J. Korean Phys. Soc., 45, 1257 (2004) --------------------------------------------------------
Journal of Manufacturing Science and Engineering
{ https://asmedigitalcollection.asme.org/manufacturingscience/issue/browse-by-year AU online, BYU online, CBU, FIT online, FSU online, GIT online, IU online, Lexmark, LH closed, LU gray TJ1.A7, MST online, NWU online, OCU beam microfilm, OkSU ONLINE, OrSU online, OSU online, PU online, SDSU TA1.J634, SIUC online, SIUE online, SU online, TTU, UAB online, UAH n1, UAr online, UC online, UCF online, UCI online, UCSD online, UDe online, UE online, UF online, UIC online, UIUC online, UK online & eng TA1.J634, UM online, UMC online, USF online, USU online, UT online, UTA online, UTo online, }
3 items found as of 6/20/2021
v118#2-v143#7(21) checked 6/20/2021

--------------------------------------------------------
Journal of Materials Chemistry
{ http://www.rsc.org/Publishing/Journals/jm/ AU online, BYU online, FSU online, GIT online, IU online, LH online, MST online, NWU online, OkSU online, OrSU online, OSU online, PU online, RU online, SDSU online, SIUC online, SIUE online, TTU, UAr online, UC online, UCF online, UCI online, UCSD online, UD online, UDe online, UF online, UIC online, UIUC online, UK online, UM online, UMC online, UMe online, UOk online, USF online, UTA online, UTo online, WrSU online, }
2 items found as of 1/20/2021
searched for tin whisker(s) and Sn whisker(s) on 12/20/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/20/2020
searched for indium whisker(s) on 12/20/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/20/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/20/2020

--------------------------------------------------------
Journal of Materials Engineering
Cailiao Gongcheng
{ https://link.springer.com/journal/135/volumes-and-issues MIT hayden TA.J863, NEU snell T1.J4920, OkSU main 620.1105J86531, RU fondren TA401.J675, SIUC storage 53165-6262, TU online, UCSD s&e TA1.J8283, UK online, USC TA401.J675, UTAr depos TA401.J675, UTS+D online, UTor eng TA401.J6852, }
item found as of 1/20/2021 catalog
searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

(new reference 12/30/2008)
Wang, Da-Yong, Gu, Xiao-Long, Zhang, Li-Min Sn-Bi-Sb lead free solder Cailiao Gongcheng/Journal of Materials Engineering, n, SUPPL., July 2006, p 229-231+235 Language: Chinese

Wang, Jian-Xin, Xue, Song-Bai, Han, Zong-Jie, Yu, Sheng-Lin, Chen, Yan, Study on wettability of Sn-Ag-Cu-Ce solder and mechanical properties of soldered joints Cailiao Gongcheng/Journal of Materials Engineering, n 9, September, 2008, p 5-8 Language: Chinese

Han, Zong-Jie, Xue, Song-Bai, Wang, Jian-Xin, Zhang, Liang, Yu, Sheng-Lin .Study on wettability and spreadability of lead-free solder with diode laser soldering process Cailiao Gongcheng/Journal of Materials Engineering, n 9, September, 2008, p 76-79 Language: Chinese

-------------------------------------------------------
Journal of Materials Engineering and Performance
{ https://link.springer.com/journal/11665/volumes-and-issues AU rbd TA401.J6752, FAU online, FIU online, GIT online & main TA401.J674, NEU online, OkSU online, OSU sel TA401J623, SDSU online, SMU online, UC eng TA401.J674, UCI online & sci TA401.J676, UCSD online, UK online, UL kersey TA401.J674, UMi online, UNCC online, UOk online, UPi online, USC online, USD online, UTAr depos TA401.J676, UTD online, UTor online, UWa online, VU online, }
>=20 items found as of 8/9/2021 catalog
v1#1-v30#8(21) all issues checked 8/9/2021
searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

(new reference 2/23/2021)
," Journal of Materials Engineering and Performance, vol. 30 no. 2, pp. , 2021.

A. Ravi Shankar, K. Praveen, John Philip Failure of Printed Circuit Boards during Storage and Service: Leaked Capacitors and White Residue ," Journal of Materials Engineering and Performance, vol. 29 no. 10, pp. 6402-6411, Oct. 2020. https://doi.org/10.1007/s11665-020-05148-3

Jianglei Fan, Hengtao Zhai, Jianxiu Liu Effect of Ni Content on the Microstructure Formation and Properties of Sn-0.7Cu-xNi Solder Alloys ," Journal of Materials Engineering and Performance, vol. 29 no. 8, pp. 4934-4943, Aug. 2020. https://doi.org/10.1007/s11665-020-04996-3

Eunice Y. Seo, Jong E. Ryu Influence of Reflow Profile on Thermal Fatigue Behaviors of Solder Ball Joints ," Journal of Materials Engineering and Performance, vol. 29 no. 6, pp. 4095-4104, June 2020. https://doi.org/10.1007/s11665-020-04899-3

Zuozhu Yin Mei Lin Ziyuan Wu Effect of Doped Nano-Ni on Microstructure Evolution and Mechanical Behavior of Sn-3.0Ag-0.5Cu (SAC305)/Cu-2.0Be Solder Joint during Isothermal Aging ," Journal of Materials Engineering and Performance, vol. 29 no. 5, pp. 3315-3323, May 2020. https://doi.org/10.1007/s11665-020-04838-2

Monalisa Char,Amit K. Chakraborty, Abhijit Kar Retardation Effect of Tin Multilayer on Sn-3.0Ag-0.5Cu (SAC305)-Based Solder Joint Interface ," Journal of Materials Engineering and Performance, vol. 29 no. 4, pp. 2305-2315, Apr. 2020. https://doi.org/10.1007/s11665-020-04730-z

A. A. El-Daly, K. M. Zohdy, M. Ragab Corrosion and Electrochemical Behavior of Sn-2Ag-0.5Cu Lead-Free Solders Solidified with Magnet Stirring ," Journal of Materials Engineering and Performance, vol. 28 no. 8, pp. 4680-4692, Aug. 2019. https://doi.org/10.1007/s11665-019-04227-4

D. E. Helling Lead Whisker Formation in the Gold-Lead System ," Journal of Materials Engineering and Performance, vol. 28 no. 4, pp. 1936-1941, Apr. 2019. https://doi.org/10.1007/s11665-019-03948-w

Leipeng Yang, Shujuan Li, Qilong Yuan Experimental Investigations for Optimizing the Extrusion Parameters on FDM PLA Printed Parts ," Journal of Materials Engineering and Performance, vol. 28 no. 1, pp. 169-182, Jan. 2019. https://doi.org/10.1007/s11665-018-3784-x

Yanqing Lai, Xiaowu Hu, Yulong Li Effect of Ni Addition to Sn0.7Cu Solder Alloy on Thermal Behavior, Microstructure, and Mechanical Properties ," Journal of Materials Engineering and Performance, vol. 27 no. 12, pp. 6564-6576, Dec. 2018. https://doi.org/10.1007/s11665-018-3734-7

Mirko Rocci, Valeria Demontis, Francesco Rossella Suspended InAs Nanowire-Based Devices for Thermal Conductivity Measurement Using the 3? Method ," Journal of Materials Engineering and Performance, vol. 27 no. 12, pp. 6299-6305, Dec. 2018. https://doi.org/10.1007/s11665-018-3715-x

Elisabetta Dimaggio, Dario Narducci, Giovanni Pennelli Fabrication of Silicon Nanowire Forests for Thermoelectric Applications by Metal-Assisted Chemical Etching ," Journal of Materials Engineering and Performance, vol. 27 no. 12, pp. 6279-6285, Dec. 2018. https://doi.org/10.1007/s11665-018-3605-2

D. Soares, H. Leit, F. Macedo Effect of the Soldering Atmosphere on the Wettability Between Sn4.0Ag0.5Cu (in wt.%) Lead-Free Solder Paste and Various Substrates ," Journal of Materials Engineering and Performance, vol. 27 no. 10, pp. 5011-5017, Oct. 2018. https://doi.org/10.1007/s11665-018-3419-2

Sanjay Tikale, K. Narayan Prabhu Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy ," Journal of Materials Engineering and Performance, vol. 27 no. 6, pp. 3102-3111, June 2018. https://doi.org/10.1007/s11665-018-3390-y

Zhenghong Wang, Chuantong Chen, Katsuaki Suganuma Electrochemical Behavior of Sn-9Zn-xTi Lead-Free Solders in Neutral 0.5M NaCl Solution ," Journal of Materials Engineering and Performance, vol. 27 no. 5, pp. 2182-2191, May 2018. https://doi.org/10.1007/s11665-018-3312-z

M. Hasnine, M. J. Bozack Effects of Isothermal Aging on the Thermal Expansion of Several Sn-Based Lead-Free Solder Alloys ," Journal of Materials Engineering and Performance, vol. 27 no. 2, pp. 1274-1280, Feb. 2018. https://doi.org/10.1007/s11665-018-3235-8

A. F. Abd El-Rehim, H. Y. Zahran, S. AlFaify The Mechanical and Microstructural Changes of Sn-Ag-Bi Solders with Cooling Rate and Bi Content Variations ," Journal of Materials Engineering and Performance, vol. 27 no. 2, pp. 344-352, 2018. https://doi.org/10.1007/s11665-017-3104-x

Li Yang, Haixiang Liu, Huakuan Yu Study on the Reliability of Carbon Nanotube-Reinforced Sn-58Bi Lead-Free Solder Joints ," Journal of Materials Engineering and Performance, vol. 26 no. 12, pp. 6028-6036, Dec. 2017. https://doi.org/10.1007/s11665-017-3033-8

Mrunali Sona, K. Narayan Prabhu The Effect of Wetting Gravity Regime on Shear Strength of SAC and Sn-Pb Solder Lap Joints ," Journal of Materials Engineering and Performance, vol. 26 no. 9, pp. 4177-4187, Sept. 2017. https://doi.org/10.1007/s11665-017-2857-6

G. F. Ban, F. L. Sun, S. N. Cong Influence of Cu Nanoparticles on Microstructure and Mechanical Properties of Sn0.7Ag0.5Cu-BiNi/Cu Solder Joint ," Journal of Materials Engineering and Performance, vol. 26 no. 3, pp. 1069-1075, Mar. 2017. https://doi.org/10.1007/s11665-017-2528-7

Guoji Zhao, Yanxia Jing, Jianhua Chen Effects of Rapid Solidification Process and 0.1 wt.% Pr Addition on Properties of Sn-9Zn Alloy and Cu/Solder/Cu Joints ," Journal of Materials Engineering and Performance, vol. 25 no. 5, pp. 2037-2042, May 2016. https://doi.org/10.1007/s11665-016-2046-z

Katarzyna Berent, Przemyslaw Fima, Janusz Pstrus Erratum to: Wetting and Microstructure Evolution of the Sn-Zn-Ag/Cu Interface ," Journal of Materials Engineering and Performance, vol. 23 no. 5, pp. 1634, May 2014. https://doi.org/10.1007/s11665-014-1003-y

Katarzyna Berent, Przemyslaw Fima, Janusz Pstrus Wetting and Microstructure Evolution of the Sn-Zn-Ag/Cu Interface ," Journal of Materials Engineering and Performance, vol. 23 no. 5, pp. 1630-1633, May 2014. https://doi.org/10.1007/s11665-014-0929-4

Ohira, Chika, Fujii, Hidetoshi, and Morisada, Yoshiaki, Temperature Dependence of Surface Tension of Sn-Ag Alloys," Journal of Materials Engineering and Performance, vol. 23 no. 5, pp. 1561-1567, May 2014. https://doi.org/10.1007/s11665-013-0858-7

--------------------------------------------------------
Journal of Materials Processing Technology
{ https://www.sciencedirect.com/journal/journal-of-materials-processing-technology/issues CSULB online, MST online, OkSU online, SDSU online, SMU online, UCSD online, UK online sd, UM online, UOk online, USC TS200.J64, UT online & hodges TJ1.J67, UTAr online, UTD online, }
>=20 items found as of 8/8/2021 catalog
v21#1(90)-v297(21) checked 8/8/2021
*** new reference 6/15/2021 *** Sy-Wei Lo, Yuung-Hwa Lu Wire drawing dies with prescribed variations of strain rate ," Journal of Materials Processing Technology, vol. 123 no. 2, pp. 212-218, Apr. 30, 2002. https://doi.org/10.1016/S0924-0136(02)00033-X

Zlatko Kampuš Analysis of factors influencing accuracy in the drawing of round rods ," Journal of Materials Processing Technology, vol. 87 no. 1-3, pp. 90-96, Mar. 15, 1999. https://doi.org/10.1016/S0924-0136(98)00336-7

Guoyi Tang, Mingxin Zheng, Yonghua Zhu, Jie Zhang, ... Qun Li The application of the electro-plastic technique in the cold-drawing of steel wires ," Journal of Materials Processing Technology, vol. 84 no. 1-3, pp. 268-270, Dec. 1, 1998. https://doi.org/10.1016/S0924-0136(98)00229-5

Aly El-Domiaty, Sadek Z. Kassab Temperature rise in wire-drawing ," Journal of Materials Processing Technology, vol. 83 no. 1-3, pp. 72-83, Nov. 1, 1998. https://doi.org/10.1016/S0924-0136(98)00045-4

Z.X. Xiong, K.Z. Baba-Kishi Preparation and properties of (SrxPb1-x)TiO3 ceramics for high voltage capacitors ," Journal of Materials Processing Technology, vol. 63 no. 1-3, pp. 313-316, Jan. 1997. https://doi.org/10.1016/S0924-0136(96)02642-8

Michael T. Hillery, Vincent J. McCabe Wire drawing at elevated temperatures using different die materials and lubricants ," Journal of Materials Processing Technology, vol. 55 no. 2, pp. 53-57, Nov. 15, 1995. https://doi.org/10.1016/0924-0136(95)01784-4

Muharrem Yilmaz Failures during the production and usage of steel wires ," Journal of Materials Processing Technology, vol. 171 no. 2, pp. 232-239, Jan. 20, 2006. https://doi.org/10.1016/j.jmatprotec.2005.07.007

searched for tin whisker(s) and Sn whisker(s) on 12/4/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/4/2020
searched for indium whisker(s) on 12/4/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/4/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/4/2020

--------------------------------------------------------
Journal of Materials Research
{ https://link.springer.com/journal/43578/volumes-and-issues AU rbd TA404.2.J68, FSU dirac 620.5J86423, GIT online & main-5e TA404.2.J68, MST wilson TA404.2.J68, OkSU online, OSU sel TA410M38, SIUC online, UC eng TA401.J675, UCF online & main TA404.2.J68, UCI online & sci TA404.2J68, UCSD online, UH TA404.2.J68, UK online & chem/phys TA404.2.J68, UL online & ekstrom TA404.2.J68, UM online, UOk online, UT online & hodges TA404.2.J68, UTor eng TA404.2.J68, UWa online, }
>=20 items found as of 8/9/2021
v1#1-v36#13(21) all issues checked 8/9/2021
searched for tin whisker(s) and Sn whisker(s) on 8/6/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/6/2020
searched for indium whisker(s) on 8/6/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/6/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/18/2020 (new reference 8/9/2021)
," Journal of Materials Research, vol. 36 no. 13, pp. , July 2021.

Z. Y. Liang, S. S. Xiang G. M. Pharr Effects of crystal orientation on the indentation creep of b-tin ," Journal of Materials Research, vol. 36 no. 12, pp. 2434-2443, June 2021. https://doi.org/10.1557/s43578-021-00165-x

--------------------------------------------------------
Journal of Materials Science
{ https://link.springer.com/journal/10853/volumes-and-issues EBSCOA, CSULA online, CSULB online, FSU dirac 620.5J8648, GIT online & main TA401.J68x, KYVL, MST online, OkSU online, OSU online & sel TK7871J665, SDSU online, SIUC online, SMU online, TTU, UAB online & sterne TK7871.J665, UAr storage TA401.J68, UC online & sw depos TA401.J684, UCF online & main TA401.J68, UCI online & sci TA401.J68, UCSD online, UD online & roesch, UK online & TK7871.J60, UL online & kersey TA401.J68, UM online, UNCC online, UOk online, USC grand, USD online, UT online & hodges TK7871.J665, UTD online, }
>=20 items found as of 8/6/2021
v1#1-v56#28(21) all issues checked 8/6/2021
(new reference 1/21/2021)
Liu, Xinmei; Yang, Chunyang; Yang, Wenlong; Lin, Jiaqi; Liang, Chen; Zhao, Xu. One-pot synthesis of uniform Cu nanowires and their enhanced non-enzymatic glucose sensor performance. ," Journal of Materials Science, vol. 56 no. 9, pp. 5520-5531, 2021. DOI: 10.1007/s10853-020-05617-z

(not at UK) searched for tin whisker(s) and Sn whisker(s) on 8/7/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/7/2020
searched for indium whisker(s) on 8/7/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/7/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/3/2020

--------------------------------------------------------
(new source 10/1/2020)
Journal of Materials Science and Chemical Engineering
{ https://www.scirp.org/journal/msce/ UK online, }
1 item found as of 1/21/2021

-------------------------------------------------------
Journal of Materials Science and Technology
{ http://www.jmst.org/EN/article/showTenYearOldVolumn.do LH closed, NWU online, RU fondren TA459.C48, UF sci TA401.J683, UIUC eng Q.669.05CH1, UTo online, }
>=20 items found as of 5/2/2021
v5#1-v67(21) checked 5/2/2021

(new reference 3/1/2021)
," Journal of Materials Science and Technology, vol. 67, pp. , 2021.

Y.K. Zhu, Q.Y. Chen, Q. Wang, H.Y. Yu, R. Li, J.P. Hou, Z.J. Zhang, G.P. Zhang, Z.F. Zhang Effect of stress profile on microstructure evolution of cold-drawn commercially pure aluminum wire analyzed by finite element simulation ," Journal of Materials Science and Technology, vol. 34 no. 7, pp. 1214-1221, July 2018. DOI: 10.1016/j.jmst.2017.07.011

Luo X.M., Song Z.M., Li M.L., Wang Q., Zhang G.P. Microstructural Evolution and Service Performance of Cold-drawn Pure Aluminum Conductor Wires ," Journal of Materials Science and Technology, vol. 33 no. 9, pp. 1039-1043, Sept. 2017. DOI: 10.1016/j.jmst.2016.11.018

Yu Han, Yuejun Ouyang, Zhihui Xie, Jinri Chen, Fangfang Chang, Gang Yu Controlled Growth of Pt-Au Alloy Nanowires and Their Performance for Formic Acid Electrooxidation ," Journal of Materials Science and Technology, vol. 32 no. 7, pp. 639-645, July 2016. DOI: 10.1016/j.jmst.2016.04.014

Peigen Zhang, Yamei Zhang, Zhengming Sun Spontaneous Growth of Metal Whiskers on Surfaces of Solids: A Review ," Journal of Materials Science and Technology, vol. 31 no. 7, pp. 675-698, July 2015. DOI: 10.1016/j.jmst.2015.04.001

Mijeong Kang, Hyoban Lee, Taejoon Kang, Bongsoo Kim Synthesis, Properties, and Biological Application of Perfect Crystal Gold Nanowires: A Review ," Journal of Materials Science and Technology, vol. 31 no. 6, pp. 573-580, June 2015. DOI: 10.1016/j.jmst.2015.01.007

Dong Liang, Juan Du, Xuan P.A. Gao InAs Nanowire Devices with Strong Gate Tunability: Fundamental Electron Transport Properties and Application Prospects: A Review ," Journal of Materials Science and Technology, vol. 31 no. 6, pp. 542-555, June 2015. DOI: 10.1016/j.jmst.2015.01.006

Matthew J. Crane, Peter J. Pauzauskie Mass Transport in Nanowire Synthesis: An Overview of Scalable Nanomanufacturing ," Journal of Materials Science and Technology, vol. 31 no. 6, pp. 523-532, June 2015. DOI: 10.1016/j.jmst.2015.01.009

M.L. Huang, F. Yang Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG Joints ," Journal of Materials Science and Technology, vol. 31 no. 3, pp. 252-256, Mar. 2015. DOI: 10.1016/j.jmst.2015.01.003

Cheng Yang, Youhong Tang, Zijin Su, Zhexu Zhang, Cheng Fang Preparation of Silver Nanowires via a Rapid, Scalable and Green Pathway ," Journal of Materials Science and Technology, vol. 31 no. 1, pp. 16-22, Jan. 2015. DOI: 10.1016/j.jmst.2014.02.001

--------------------------------------------------------
Journal of Materials Science Letters
{ https://link.springer.com/journal/10855/volumes-and-issues OSU online, UC online, UD online, UK online & eng TA401.J68, UL online, UM online, UT online, VU online, }
7 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

--------------------------------------------------------
Journal of Materials Science: Materials in Electronics
{ https://link.springer.com/journal/10854/volumes-and-issues FSU online & dirac 620.5J86482, GIT online & main TK7871.J665, MST online, NWU online & sci L 621.38105J864, OkSU online, OSU online & sel TK7871J665, PU online & eng 621.38105J8265, SDSU online, SIUC online, UAB online & sterne TK7871.J665, UAH salmon, UC online & eng TA401.J684, UCF online & main TA401.J684, UCI online & sci TK7870.J687, UCSD online, UD online & roesch, UIC online & daley TK7871.J68, UK online & eng TK7871.J60, UL kersey TK7871.J665, UM online, UOk online, USD online, UT online, }
>=20 items found as of 8/9/2021
v1#1-v32#15(21) all issues checked 8/9/2021
searched for tin whisker(s) and Sn whisker(s) on 8/6/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/6/2020
searched for indium whisker(s) on 8/6/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/6/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/3/2020

(new reference 2/23/2021)
," Journal of Materials Science: Materials in Electronics, vol. 32 no. 15, pp. , Aug. 2021.

Jianxin Wang, Hao Su, Xixi Shi Growth behavior of IMCs in Sn–1.0Ag–0.5Cu–xBi/Ni joints during isothermal aging ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 15, pp. 20777-20792, Aug. 2021. https://doi.org/10.1007/s10854-021-06591-1

A. A. El-Daly, A. A. Ibrahiem, N. A. M. Eid Development of Sn-1.0Ag-0.7Cu composite solder with improved resistivity and strength–ductility synergy through additions of Ni, Te and MWCNT ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 14, pp. 19871-19889, July 2021. https://doi.org/10.1007/s10854-021-06512-2

Nan JiangLiang ZhangLei Zhang Microstructure evolution of Cu/Sn58Bi/Cu solder joint bearing graphene nanosheets for 3D packaging ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 12, pp. 16970-16978, June 2021. https://doi.org/10.1007/s10854-021-06261-2

Shuai LiYushuang LiuZhengming Sun Interface energy-driven indium whisker growth on ceramic substrates ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 12, pp. 16881-16888, June 2021. https://doi.org/10.1007/s10854-021-06250-5

J. RenM. L. Huang Board-level drop reliability and fracture behavior of low-temperature soldering Sn–Ag–Cu/Sn–Bi–X hybrid BGA solder joints for consumer electronics ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 11, pp. 15453-15465, June 2021. https://doi.org/10.1007/s10854-021-06094-z

Hui-Jun HeXi-Xue LiuLigen Wang Microstructural evolution of the Sn-51Bi-0.9Sb-1.0Ag/Cu soldering interface during isothermal aging ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 11, pp. 15003-15010, June 2021. https://doi.org/10.1007/s10854-021-06053-8

Ping-Chen Chiang, Yu-An Shen, Chih-Ming Chen Effects of impurities on void formation at the interface between Sn-3.0Ag-0.5Cu and Cu electroplated films ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 9, pp. 11944-11951, May 2021. https://doi.org/10.1007/s10854-021-05824-7

Chu Tang, Wenhui Zhu, Liancheng Wang Thermomechanical reliability of a Cu/Sn-3.5Ag solder joint with a Ni insertion layer in flip chip bonding for 3D interconnection ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 9, pp. 11893-11909, May 2021. https://doi.org/10.1007/s10854-021-05819-4

C. Clement Raj, C. G. Jothi Prakash, R. Prasanth Engineering electrode/electrolyte interfacial properties of nanotube arrays for high-capacitance supercapacitors ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 8, pp. 11119-11128, Apr. 2021. https://doi.org/10.1007/s10854-021-05778-w

Hailan Ma, Bingge Zhao, Yulai Gao A SnBiAgIn solder alloy with exceptional mechanical properties by rapid quenching ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 6, pp. 8167-8173, Mar. 2021. https://doi.org/10.1007/s10854-021-05539-9

Wenyi Yang, D. D. L. Chung Effect of the cooling rate in solidification on the electrical behavior of solder ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 6, pp. 7867-7874, Mar. 2021. https://doi.org/10.1007/s10854-021-05511-7

Bingfeng Guo, Haitao Ma, Xinhong Chu Effect of the degree of supercooling on growth mechanism of Cu6Sn5 in pure Sn/Cu solder joint ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 6, pp. 7528-7540, Mar. 2021. https://doi.org/10.1007/s10854-021-05467-8

Ruyu Tian, Yanhong Tian, Huhao Sun Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG solder joints under extreme temperature thermal shock ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 6, pp. 6890-6899, Mar. 2021. https://doi.org/10.1007/s10854-021-05395-7

Harindra Kumar Kannojia, Pradeep Dixit A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 6, pp. 6742-6777, Mar. 2021. https://doi.org/10.1007/s10854-021-05412-9

Wenyi Yang, D. D. L. Chung Electric polarization and depolarization of solder, and their effects on electrical conduction ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 5, pp. 6214-6227, Mar. 2021. https://doi.org/10.1007/s10854-021-05337-3

A. M. El-Taher, S. E. Abd El Azeem, A. A. Ibrahiem Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 5, pp. 6199-6213, Mar. 2021. https://doi.org/10.1007/s10854-021-05336-4

Naseem Abbas, Jun Kim, Seok-min Kim Monolithic fabrication of vertical silicon nanowire gas sensor with a top porous copper electrode using glancing angle deposition ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 4, pp. 5233-5242, Feb. 2021. https://doi.org/10.1007/s10854-021-05255-4

M. A. Azmah Hanim, Anusha Baradi Dasan, K. Vidyatharran Influence of porous Cu interlayer on the intermetallic compound layer and shear strength of MWCNT-reinforced SAC 305 composite solder joints ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 4, pp. 4515-4528, Feb. 2021. https://doi.org/10.1007/s10854-020-05194-6

Nan Jiang, Liang Zhang, Lei Zhang Influence of doping Ti particles on intermetallic compounds growth at Sn58Bi/Cu interface during solid–liquid diffusion ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 3, pp. 3341-3351, Feb. 2021. https://doi.org/10.1007/s10854-020-05082-z

Ping Yang, Xiangbo Zeng Effect of hydrogenated silicon film microstructure on the surface states of n-type silicon nanowires and solar cells ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 3, pp. 3066-3071, Feb. 2021. https://doi.org/10.1007/s10854-020-05056-1

Sanjay Tikale, K. Narayan Prabhu Bond shear strength of Al2O3 nanoparticles reinforced 2220-capacitor/SAC305 solder interconnects reflowed on bare and Ni-coated copper substrate ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 3, pp. 2865-2886, Feb. 2021. https://doi.org/10.1007/s10854-020-05040-9

Scott Fuller, Mohamed Sheikh, Tae-Kyu Lee Impact of in situ current stressing on Sn-based solder joint shear stability ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 3, pp. 2853-2864, Feb. 2021. https://doi.org/10.1007/s10854-020-05038-3

Kai-kai Xu, Liang Zhang, Nan Jiang Effect of CNTs on the intermetallic compound growth between Sn solder and Cu substrate during aging and reflowing ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 3, pp. 2655-2666, Feb. 2021. https://doi.org/10.1007/s10854-020-04755-z

Yinbo Chen, Zhi-Chao Meng, Zhi-Quan Liu Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 2, pp. 2172-2186, Jan. 2021. https://doi.org/10.1007/s10854-020-04982-4

Wonil Seo, Min-Su Kim, Sehoon Yoo Growth of intermetallic compounds and brittle fracture behavior of Sn-Ag-Cu/ENIG joint with columnar Ni-P layer ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 1, pp. 1042-1051, Jan. 2021. https://doi.org/10.1007/s10854-020-04879-2

Zifeng He, Huiqin Li, Jingsong Liu Temperature stability of lead-free BST-BZN relaxor ferroelectric ceramics for energy storage capacitors ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 1, pp. 752-763, Jan. 2021. https://doi.org/10.1007/s10854-020-04854-x

Jyun-Yang Wang, Yi-Xuan Lin, Cheng-Yi Liu Effect of Ag solutes on the solid-state Cu dissolution in the Sn3.5Ag ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 1, pp. 567-576, Jan. 2021. https://doi.org/10.1007/s10854-020-04839-w

Nafis Ahmed, P. Ramasamy, C. Balaji Crystallization of PECVD grown Si nanowire and its characterization using confocal Raman and EELS studies ," Journal of Materials Science: Materials in Electronics, vol. 32 no. 1, pp. 204-209, Jan. 2021. https://doi.org/10.1007/s10854-020-04754-0

--------------------------------------------------------
(new source 6/28/2020)
Journal of the Mechanical Behavior of Materials
{ https://www.degruyter.com/view/journals/jmbm/jmbm-overview.xml?language=en&tab_body=toc-78025 UK online, }
1 item found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 7/19/2020

*** search for whiskers and tin pest *** --------------------------------------------------------
Journal of Mechanical Engineering
Strojniski Vestnik
{ https://www.sv-jme.eu/view-articles/ CSULA north TJ1.J6, CSULB online, LH closed, UK online, UPi online, USC TJ104.65J68, UTD online, }
item found as of 1/21/2021 catalog

--------------------------------------------------------
(new source 9/15/2020)
Journal of Mechanical Science and Technology
{ https://link.springer.com/journal/12206/volumes-and-issues UK online, }
2 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 9/16/2020
searched for zinc whisker(s) and Zn whisker(s) on 9/16/2020
searched for indium whisker(s) on 9/16/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/16/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/16/2020

--------------------------------------------------------
Journal of the Mechanics and Physics of Solids
{ https://www.sciencedirect.com/journal/journal-of-the-mechanics-and-physics-of-solids/issues IU online & bloomington swain QC1.J884 & alf QC1.J884, MST online, OkSU online, OSU online & sel QC1J886, PU online & eng 530.5J825 & phys 530.5J825, SDSU online, SIUC online, SIUE lovejoy, TTU online, UC online & eng TA350.J6, UCSD online, UIC online & sci TA350.J68, UK online & eng TA350.J68, UL online, UM online, UOk online, UT online & hodges TA350.J68, }
3 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 7/19/2020
searched for zinc whisker(s) & Zn whisker(s) on 9/5/2020
searched for indium whisker(s) on 9/5/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/5/2020

--------------------------------------------------------
Journal of Metals
{ IU bloomington alf TN1.J86, MST wilson TN1.A513, NWU online & sci 669.05J86, OkSU stillwater north_boomer 669.05J86, OSU sel TN1J6, PU eng 672M564h & 669.05J82 & hicks 669.05J82, SDSU compact TN1.J6, SIUC morris 51828-6711, UAr mullins per-microfiche TN1.A513, UC eng TN1.J67 & sw depos TN1.J67, UCSD s&e TN1.J829, UE, UIC online & daley TN1.A516, UK eng TN1.A513, UL ekstrom TN1.A513, UM online, UMe mcwherter, UOk bizzell TN1.A513, USD online, UT hodges TN1.A513, }
item found as of 1/30/2011

Frye, Stansbury and McElroy, J. Metals, 1953, 5, 219. *** not applicable ***

Probst and Sinnott, J. Metals, 1955, 7, 215. *** not applicable ***

D. W. White, J. Metals 7, 1221 (1955). *** not applicable ***

--------------------------------------------------------
Journal of Metastable and Nanocrystalline Materials
{ https://www.scientific.net/JMNM GIT online, UCF online, UM online, }
2 items found as of 1/20/2021

--------------------------------------------------------
Journal of Micro/Nanolithography, MEMS, and MOEMS
Journal of Micro/Nanolithography, MEMS, and MOEMS Letters
Journal of microlithography, microfabrication, and microsystems
{ https://www.spiedigitallibrary.org/journals/journal-of-micro-nanolithography-mems-and-moems/issues AU online, FSU online, IU online, LH closed, MST online, NWU online, OGI online, OkSU online, PU online, RU online, SDSU online, UC online, UCI online, UCSD online, UDe online, UF online, UIUC online, UK online, UM online, UMC online, UOk online, UT online, UTA eng TK7874J6668, UTo online, }
1 item found as of 6/20/2021
v1#1-v20#1(21) all issues checked 6/20/2021

--------------------------------------------------------
Journal of Microelectromechanical Systems
{ IEEE XPLORE (v1#1-), }
13 items found as of 8/4/2021
v1#1-v30#4(21) all issues checked 8/4/2021

searched for tin whisker(s) and Sn whisker(s) on 1/23/2021
searched for zinc whisker(s) & Zn whisker(s) on 1/23/2021
searched for indium whisker(s) on 1/23/2021
searched for cadmium whisker(s) & Cd whisker(s) on 1/23/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 1/23/2021

--------------------------------------------------------
Journal of Microelectronics and Electronic Packaging
{ https://meridian.allenpress.com/jmep PU eng 621.3817In7 & 621.38104605J826, SMU sci, UAr mullins TK7870.15.I581, UK online, UM online, }
>=20 items found as of 6/20/2021
v1#1-v18#1(21) all issues checked 6/20/2021

--------------------------------------------------------
Journal of Micromechanics and Microengineering
{ https://iopscience.iop.org/journal/0960-1317 IU online, MST online, NWU online & sci L620.105J865, OSU online, PU online, SIUC online, UAr online, UC online & eng QC176.8.M5J687, UCSD online, UD online, UIC online & sci QC176.8.M5J68, UK online & eng QC176.8.M5J68, UL kersey QC176.8.M5J6, UM online, UOk online, USD online, UT online & hodges QC176.8.M5J68, }
18 items found as of 8/8/2021
v14#1-v31#9(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 8/8/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/8/2020
searched for indium whisker(s) on 8/8/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/8/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight on 8/8/2020
searched for gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 10/10/2020

," Journal of Micromechanics and Microengineering, vol. 31 no. 5, pp. , 2021.

--------------------------------------------------------
Journal of Nano Research
{ https://www.scientific.net/JNanoR GIT online, UK online, UM online, }
1 item found as of 1/21/2021 catalog

--------------------------------------------------------
(new source 10/15/2020)
Journal of Nanoparticle Research

{ https://link.springer.com/journal/11051/volumes-and-issues UK online, }
1 item found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

--------------------------------------------------------
Journal of Non-Crystalline Solids
{ https://www.sciencedirect.com/journal/journal-of-non-crystalline-solids/issues CSULB online, MST online, NWU online & sci 541.05J8635, OkSU online, OSU online & sel TP845J65, PU chem 666.105J826 & phys 666.105J826 & hicks 666.105J826, SDSU online, SIUC online, TTU, UAr online, UC online & phys TP845.J65, UCSD online, UD online, UIC online & daley TP845.J65, UK online sd (pay) & eng TP845.J65, UL online & kersey TP845.J65, UM online & shapiro QC1.J8695 & buhr TP845.J86, UOk online, USC online, UT online & hodges TP845.J65, }
13 items found as of 8/8/2021
v354#1-v570(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 12/4/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/4/2020
searched for indium whisker(s) on 12/4/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/4/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/4/2020

--------------------------------------------------------
Journal of Nuclear Materials
{ https://www.sciencedirect.com/journal/journal-of-nuclear-materials/issues MST online, NWU online, OkSU online, OSU online & sel QC770J62, PU online & eng 621.48J826 & hicks 621.48J826, SDSU online, SIUC storage P000105, UAr storage TK9185.A1J6, UC online & eng TK9185.A1J6, UCSD online, UIC online & sci TK9185.A1j6, UK online & eng TK9185.A1J6, UL online & ekstrom TK9185.A1J6, UM online, UOk online, UT online & hodges TN4.J68, }
item found as of 1/21/2021

--------------------------------------------------------
Journal of Phase Equilibria and Diffusion
Bulletin of Alloy Phase Diagrams
Journal of Phase Equilibria
{ https://link.springer.com/journal/11669/volumes-and-issues CMU eng, CSULB online, FAU online, GIT online & main-6e TS650.B84x, MST wilson TN689.B84, NWU sci L669.9405B936, OkSU online, OSU sel TN689.J68, PU eng 669.9405J826, SDSU online, SMU online, UCSD online, UK online, UL kersey TN689.B84, UM online, UMi online, UNCC online, UOk online, UPi online, USC TN689.J68, USD online, UT hodges TN690.B84, UTAr online, UTD online, UTo carlson, UTor online, UWa online, VU online, }
>=20 items found as of 8/9/2021 catalog
v10#4-v42#3(21) checked 8/9/2021

searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

--------------------------------------------------------
Journal of Physical Chemistry B
Journal of Physical Chemistry
{ https://pubs.acs.org/loi/jpchax https://pubs.acs.org/loi/jpcbfk MST online, SDSU online, SIUC online, SIUE online, UAr online, UCSD online, UE online, UK online & chem/phys QD1.J85 & king QD1.J85, UM online, UMe chem, UOk online, USD online, UT online & hodges QD1.J952, UTo online & bowman-oddy & carlson, WSU online, }
7 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/20/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/20/2020
searched for indium whisker(s) on 12/20/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/20/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/20/2020

--------------------------------------------------------
Journal of the Physical Society of Japan
{ https://journals.jps.jp/loi/jpsj CSULA north QC1.P515, CSULB online, IU bloomington alf QC1.T62, MST online, NWU online & sci L530.5P577j, OkSU online, OSU online & sel QC1P5749, PU online & phys 530.6P56 & 530.6P557j, SDSU QC1.P47, SIUC morris 53779-5301, SIUE lovejoy, TTU, UAr online, UC online & phys QC1.N5, UCSD online, UIC sci, UK online & chem/phys QC1.P559 & king QC1.P559, UL kersey QC1.P47, UM online & shapiro QC1.P5815 & buhr QC1.P5815, UOk online, USC grand, UT hodges QC1.P47, }
10 items found as of 1/21/2021

searched for tin whisker(s) and Sn whisker(s) on 9/6/2020
searched for zinc whisker(s) & Zn whisker(s) on 9/6/2020
searched for indium whisker(s) on 9/6/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/6/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/6/2020

--------------------------------------------------------
Journal of Physics and Chemistry of Solids
{ https://www.sciencedirect.com/journal/journal-of-physics-and-chemistry-of-solids/issues MST online, NWU online & sci 539.2P578, OkSU online, OSU online & sel QC176P35, PU online & phys 530.5So44 & hicks 530.5P5641, SDSU online, SIUC online, SIUE online, TTU, UAr online, UC online & phys QC176.P45, UCSD online, UIC online & sci & warehouse QC176.A1J6, UK online & chem/phys QC176.A1J6 & king QC176.A1J6 & remote QC176.A1J6, UL online & kersey QC176.A1J6, UM online & shapiro QC1.P58282A6 & buhr QC173.P57, UMe mcwherter, UOk online, UT online & hodges QC171.P39, }
16 items found as of 1/21/2021
v69#5 checked 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 9/4/2020
searched for zinc whisker(s) and Zn whisker(s) on 9/4/2020
searched for indium whisker(s) on 9/4/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/4/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/4/2020

--------------------------------------------------------
(new source 9/4/2020)
Journal of Physics C: Solid State Physics

{ https://iopscience.iop.org/journal/0022-3719 }
2 items found as of 12/20/2020
searched for tin whisker(s) and Sn whisker(s) on 12/20/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/20/2020
searched for indium whisker(s) on 12/20/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/20/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/20/2020

--------------------------------------------------------
Journal of Physics: Condensed Matter
{ https://iopscience.iop.org/journal/0953-8984 OSU online, UC online, UD online, UK online & remote QC173.4.C65J680, UL online, UM online, UT online, VU online, }
4 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/20/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/20/2020
searched for indium whisker(s) on 12/20/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/20/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/20/2020

--------------------------------------------------------
Journal of Physics: Conference Series
Journal of Physics Conference Series
{ https://iopscience.iop.org/year/1742-6596/Y2020 AU online, BYU online, FAU online, FIT online, FIU online, FSU online, IU online, LH online, MST online, NWU online, OGI online, OrSU online, OSU online, PU online, RyU online, SDSU online, SIUC online, SU online, UAB online, UAr online, UC online, UCI online, UCSD online, UDe online, UF online, UIC online, UK online, UM online, UMC online, UMi online, UNCC online, USD online, USU online, UT online, UTA online, UTo online, UTor online, UWa online, }
5 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/20/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/20/2020
searched for indium whisker(s) on 12/20/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/20/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/20/2020

--------------------------------------------------------
Journal of Physics D: Applied Physics
{ https://iopscience.iop.org/volume/0022-3727/53 AU online, BYU online, FIT online, FSU online, GIT online, IU online, LH closed, LU gray QC1.J848, MoSU QC1.I55, MST online, NWU online, OGI online, OrSU valley QC1.B7, OSU online, PU online, RU online, SDSU QC1.I5482, IUC online, SIUE lovejoy, SU online, UAB online, UAr online, UC online, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UIUC online, UK online & remote QC1.J848, UM online & shapiro QC1.B86 & buhr QC1.B86, UMC online, UMe mcwherter, UOk online, USD online, USF online, USU online, UT online, UTA online, UTo online, WrSU online, }
19 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 7/18/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/8/2020
searched for indium whisker(s) on 8/8/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/8/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 10/10/2020

--------------------------------------------------------
Journal of Physics F: Metal Physics
{ https://iopscience.iop.org/journal/0305-4608 OSU online, UC online, UK online, UL robotics QC1.J6252, UM online, UT online, VU online, }
2 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/20/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/20/2020
searched for indium whisker(s) on 12/20/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/20/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/20/2020

--------------------------------------------------------
Journal of Physics (USSR)
{ MST depos 530.5J826, NWU sci L530.5J863, OkSU online, OSU sel QC1J88, PU phys 530.5J822 & hicks 530.05J826, SIUC storage 55707-5301, UC phys QC1.J87, UCSD s&e QC1.J832, UK chem/phys QC770.J67, UM buhr QC1.J87, UT online & hodges QC1.J846, }
1 item found as of 1/30/2011

--------------------------------------------------------
Journal of Polymer Science, Part A: Polymer Chemistry
{ https://onlinelibrary.wiley.com/loi/26424169 Lexmark, MST wilson QD471.J64, NWU online & sci L541.7J861, OkSU online, OSU online & sel QD1J83212, PU hicks 540.5J828a1 & 540.5J828b, SDSU online, SIUC online, SIUE lovejoy, UAr mullins QD471.J6425, UC online & chem QD471.J6425, UCSD online, UD online, UIC daley QD471.J642, UK online & chem/phys QD281.P6J82, UL kersey QD471.J6425, UM online & shapiro QD1.J8722, UOk online, USD online, UT online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Journal of Power Sources
{ https://www.sciencedirect.com/journal/journal-of-power-sources/issues UK online (v1#1-), }
11 items found as of 8/8/2021
v1#1-v507(21) all issues checked 8/8/2021
*** new reference 7/3/2021 *** Mohammed E. Fouda, Anis Allagui, Ahmed S. Elwakil, Ahmed Eltawil, Fadi Kurdahi Supercapacitor discharge under constant resistance, constant current and constant power loads ," Journal of Power Sources, vol. 435, pp. 226829-1-226829-, Sept. 30, 2019. https://doi.org/10.1016/j.jpowsour.2019.226829

Pankaj Saha, Satadru Dey, Munmun Khanra Accurate estimation of state-of-charge of supercapacitor under uncertain leakage and open circuit voltage map ," Journal of Power Sources, vol. 434, pp. 226696-1-226696-, Sept. 15, 2019. https://doi.org/10.1016/j.jpowsour.2019.226696

Hannah M. Fellows, Marveh Forghani, Olivier Crosnier, Scott W. Donne Modelling voltametric data from electrochemical capacitors ," Journal of Power Sources, vol. 417, pp. 193-206, Mar. 31, 2019. https://doi.org/10.1016/j.jpowsour.2018.11.078

Paulo R. Bueno Nanoscale origins of super-capacitance phenomena ," Journal of Power Sources, vol. 414, pp. 420-434, Feb. 28, 2019. https://doi.org/10.1016/j.jpowsour.2019.01.010

A.A. Moya Identification of characteristic time constants in the initial dynamic response of electric double layer capacitors from high-frequency electrochemical impedance ," Journal of Power Sources, vol. 397, pp. 124-133, Sept. 1, 2018. https://doi.org/10.1016/j.jpowsour.2018.07.015

Jingyuan Zhao, Yinhan Gao, Andrew F. Burke Performance testing of supercapacitors: Important issues and uncertainties ," Journal of Power Sources, vol. 363, pp. 327-340, Sept. 30, 2017. https://doi.org/10.1016/j.jpowsour.2017.07.066

Lei Zhang, Xiaosong Hu, Zhenpo Wang, Fengchun Sun, David G. Dorrell Fractional-order modeling and State-of-Charge estimation for ultracapacitors ," Journal of Power Sources, vol. 314, pp. 28-34, May 15, 2016. https://doi.org/10.1016/j.jpowsour.2016.01.066

V.V. Uchaikin, R.T. Sibatov, S.A. Ambrozevich Comment on “Review of characterization methods for supercapacitor modelling” ," Journal of Power Sources, vol. 307, pp. 112-113, Mar. 1, 2016. https://doi.org/10.1016/j.jpowsour.2015.12.051

Jocelyn E. Zuliani, Johnathon N. Caguiat, Donald W. Kirk, Charles Q. Jia Considerations for consistent characterization of electrochemical double-layer capacitor performance ," Journal of Power Sources, vol. 290, pp. 136-143, Sept. 20, 2015. https://doi.org/10.1016/j.jpowsour.2015.04.019

Vlasta Sedlakova, Josef Sikula, Jiri Majzner, Petr Sedlak, ... Petr Vasina Supercapacitor equivalent electrical circuit model based on charges redistribution by diffusion ," Journal of Power Sources, vol. 286, pp. 58-65, July 15, 2015. https://doi.org/10.1016/j.jpowsour.2015.03.122

Ross Drummond, David A. Howey, Stephen R. Duncan Low-order mathematical modelling of electric double layer supercapacitors using spectral methods ," Journal of Power Sources, vol. 277, pp. 317-328, Mar. 1, 2015. https://doi.org/10.1016/j.jpowsour.2014.11.116

S. Allu, B. Velamur Asokan, W.A. Shelton, B. Philip, S. Pannala A generalized multi-dimensional mathematical model for charging and discharging processes in a supercapacitor ," Journal of Power Sources, vol. 256, pp. 369-382, June 15, 2014. https://doi.org/10.1016/j.jpowsour.2014.01.054

A.M. Bittner, M. Zhu, Y. Yang, H.F. Waibel, ... C.J. Weber Ageing of electrochemical double layer capacitors ," Journal of Power Sources, vol. 203, pp. 262-273, Apr. 1, 2012. https://doi.org/10.1016/j.jpowsour.2011.10.083

Songhun Yoon, Chul Wee Lee, Seung M. Oh Characterization of equivalent series resistance of electric double-layer capacitor electrodes using transient analysis ," Journal of Power Sources, vol. 195 no. 13, pp. 4391-4399, July 1, 2010. https://doi.org/10.1016/j.jpowsour.2010.01.086

Oliver Bohlen, Julia Kowal, Dirk Uwe Sauer Ageing behaviour of electrochemical double layer capacitors: Part II. Lifetime simulation model for dynamic applications ," Journal of Power Sources, vol. 173 no. 1, pp. 626-632, Nov. 8, 2007. https://doi.org/10.1016/j.jpowsour.2007.07.059

Philippe Azaïs, Laurent Duclaux, Pierre Florian, Dominique Massiot, ... François Béguin Causes of supercapacitors ageing in organic electrolyte ," Journal of Power Sources, vol. 171 no. 2, pp. 1046-1053, Sept. 27, 2007. https://doi.org/10.1016/j.jpowsour.2007.07.001

Mark W. Verbrugge, Ping Liu, Souren Soukiazian Activated-carbon electric-double-layer capacitors: electrochemical characterization and adaptive algorithm implementation ," Journal of Power Sources, vol. 141 no. 2, pp. 369-385, Mar. 1, 2005. https://doi.org/10.1016/j.jpowsour.2004.09.034

B.E. Conway, W.G. Pell Power limitations of supercapacitor operation associated with resistance and capacitance distribution in porous electrode devices ," Journal of Power Sources, vol. 105 no. 2, pp. 169-181, Mar. 20, 2002. https://doi.org/10.1016/S0378-7753(01)00936-3

Andrew Burke Ultracapacitors: why, how, and where is the technology ," Journal of Power Sources, vol. 91 no. 1, pp. 37-50, Nov. 2000. https://doi.org/10.1016/S0378-7753(00)00485-7

searched for tin whisker(s) and Sn whisker(s) on 7/19/2020
searched for zinc whisker(s) and Zn whisker(s) on 9/15/2020
searched for indium whisker(s) on 9/15/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/15/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/15/2020

--------------------------------------------------------
Journal fur Praktische Chemie
Journal fur Praktische Chemie, Chemiker-Zeitung
{ https://onlinelibrary.wiley.com/loi/15213897b/year/1909 NWU online & sci 540.5J86, OkSU stillwater 540.5J8551, OSU online & sel TP1J84 & sel compact TP1.J84, PU online & chem 540.5J81 & hicks 660.5C424, SDSU online, SIUE storage, UAr online, UC chem (Oesper Rm) TP1.J66, UCSD online, UD online, UIC online & sci QD1.J75, UK online & chem/phys QD1.J75, UL kersey QD1.J81 & microform, UM online & shapiro QD1.J873 & hatcher QD1.J862 & buhr QD1.J862, UOk online, UT online & hodges & closed QD1.J6, UTo online & bowman-oddy, WSU online & storage 780.82D659 Ser1v16 & sci, }
2 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/19/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/19/2020
searched for indium whisker(s) on 12/19/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/19/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/19/2020

--------------------------------------------------------
Journal of Quality Technology
{ https://www.tandfonline.com/loi/ujqt20 AU online, BYU hbll TS156.Q3 J65, CBU, FIT online, FSU online, GIT online, IU online, Lexmark, LH closed, LU gray TS156.Q3J65, MST online, NWU online, OkSU online, OrSU valley TS156.Q3J6, OSU sel TS156.Q3J65, PU online, RU fondren TS156.Q3J65, SDSU online, SIUC online, TTU online, UAB sterne TS156.Q3J65, UAH n1, UAr online, UC eng TS156.Q3J65, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UIUC online, UK remote TS156.Q3J65, UM online, UMC online, UNF online, UOk online, USF online, USU merrill-cazier TS155.A1I6, UT hodges TS155.A1J68, UTA eng 658.56205J826, UTo carlson, WrSU dunbar TS156.Q3J65, }
1 item found as of 11/29/2020
v40#4 checked 11/29/2020
searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

--------------------------------------------------------
Journal of Rare Earths
{ https://www.sciencedirect.com/journal/journal-of-rare-earths/issues FAU online, LH closed, OkSU online, SMU online, UMi online, UNCC online, UTor online, VU online, }
7 items found as of 8/8/2021 catalog
v24#1-v39#9(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 12/4/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/4/2020
searched for indium whisker(s) on 12/4/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/4/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/4/2020

(new reference 3/11/2021
," Journal of Rare Earths, vol. 39 no. 6, pp. , June 2021.

Licong Kang, Chunxiang Cui, Yuanyuan Zhang, Wei Yang, ... Sen Cui Electrochemical synthesis, structure characterization and magnetic properties of TbxFe7Co3 (x=0, 0.6, 0.8) nanowires ," Journal of Rare Earths, vol. 39 no. 5, pp. 565-571, May 2021. https://doi.org/10.1016/j.jre.2020.10.006

Liang ZHANG, Lei TIAN, Yonghuan GUO, Lei SUN, Yong MIN Wettability of SnCuNi-xEu solders and mechanical properties of solder joints ," Journal of Rare Earths, vol. 32 no. 12, pp. 1184-1188, Dec. 2014. https://doi.org/10.1016/S1002-0721(14)60201-5

Liang ZHANG, Junhua CUI, Jiguang HAN, Yonghuan GUO, Chengwen HE Microstructures and properties of SnZn-xEr lead-free solders ," Journal of Rare Earths, vol. 30 no. 8, pp. 790-793, Aug. 2012. https://doi.org/10.1016/S1002-0721(12)60131-8

ZHANG, Liang, Lei TIANYong MIN Wettability of SnCuNi-xEu solders and mechanical properties of solder joints Journal of Rare Earths Volume 32, Issue 12, December 2014, pp. 1184-1188 https://doi.org/10.1016/S1002-0721(14)60201-5

--------------------------------------------------------
Journal of Reinforced Plastics and Composites
{ https://journals.sagepub.com/loi/jrpa BYU online, FSU online, GIT online & main-5e TA418.9.R4568X, IU online, LH closed, MST online, NWU online, OGI online, OkSU online, OSU online, PU online, RU online, SDSU online, SIUC online, SU online, UC online, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UIUC online, UK online, UM online, UMC online, UOk online, USD online, USF online, USU online, UTo online, WrSU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Journal of the Reliability Information Analysis Center
{ UTor online, }
9 items found as of 4/6/2014 catalog
4Q07-2Q10,Jan11-v21#2(Dec12) checked 4/6/2014

--------------------------------------------------------
Journal of Research of the National Institute of Standards and Technology
{ https://www.nist.gov/nist-research-library/journal-research-nist/past-papers CSULA online, CSULB online, OSU online, UC online, UD online, UK online & young gov C13.22, UL online, UM online, USC grand, UT online, VU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
(new source 6/25/2020)
J. Res. Phys. Chem. Chem. Phys.
{ }
(new reference 6/25/2020)
M. Winter, Z. Phys. Chemie-Int. J. Res. Phys. Chem. Chem. Phys. 223 (2009) 1395–1406. --------------------------------------------------------
Journal of Shanghai Jiaotong University
Shanghai Jiaotong Daxue Xuebao
{ https://caod.oriprobe.com/journals/shjtdxxb-e/Journal_of_Shanghai_Jiaotong_University.htm https://caod.oriprobe.com/journals/SHJT/Journal_of_Shanghai_Jiaotong_University.htm FAU online, LH closed, OSU online, SDSU online, UC online, UCSD online, UIUC oak Q4.S488, UK online, UM online & shapiro Q4.S52, UMC online, UMi online, UOk online, UPi online, USF online, UTD online, UTo online, UTor online, WrSU online, }
1 item found as of 6/20/2021 catalog
v13#1-v26#2(21) checked 6/20/2021

(new reference 12/29/2008)
Xu, Dong-Xia, Lei, Yong-Ping, Xia, Zhi-Dong, Guo, Fu, Shi, Yao-Wu .Current status and trends in research on soldering flux for lead-free solder in electronic assembly Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n, SUPPL., April, 2007, p 53-57+61 Language: Chinese

Zhang, Jin-Song, Wu, Yi-Ping, Zhu, Yu-Chun, Li, Juan-Juan, Wu, Feng-Shun, An, Bing .Whisker formation on pure Sn coating of leadframe under temperature cycling condition Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n, SUPPL., April, 2007, p 62-65 Language: Chinese

Li, Feng-Hui, Li, Xiao-Yan, Yan, Yong-Chang .Growth of IMC in SnAgCu/Cu butt solder joint during thermal aging Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n, SUPPL., April, 2007, p 66-70 Language: Chinese

Jiang, Yan-Feng, Zhang, Xiao-Bo .Interfacial reactions and reliability with lead (Pb)-free solders Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n, SUPPL., April, 2007, p 71-74 Language: Chinese

Li, Xiao-Xia, Zhu, Rong-Lin .Effect of lead-free soldering technology on the reliability of PCB Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n, SUPPL., April, 2007, p 95-99+105 Language: Chinese

Gao, Feng, Wang, Cui-Ping, Liu, Xing-Jun .CALPHAD method and its applications in Pb-free solders Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n, SUPPL., April, 2007, p 100-105 Language: Chinese

Su, Xi-Ran, Yang, Dao-Guo, Zhu, Lan-Fen, Kang, Xue-Jing .Effect of temperature, moisture and vapor pressure on delamination in a PBGA during reflow soldering process Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n, SUPPL., April, 2007, p 106-110 Language: Chinese

Zhou, Bin, Pan, Kai-Lin, Yan, Yi-Lin .Thermal distortion simulation of lead free PCB assembly during reflow soldering process Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n, SUPPL., April, 2007, p 111-115 Language: Chinese

Pan, Kai-Lin, Zhao, Xiao-Yun, Yan, Yi-Lin, Zhou, Bin .EU RoHS directive compliance operation guidance Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n, SUPPL., April, 2007, p 116-119 Language: Chinese

Luo, Dao-Jun, Zou, Ya-Bing .Copper-diffusion induced failure of lead-free solder joints Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n, SUPPL., April, 2007, p 120-122+126 Language: Chinese

Shuai, Di, Jin, Xing, Guo, Shi-Da, Yu, Kwangsu .Reliability analysis of Sn-Bi plating chips Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n, SUPPL., April, 2007, p 154-156

Niu, Xiao-Yan, Li, Zhi-Gang, Yuan, Guo-Zheng, Shu, Xue-Feng .Dynamic compressive properties of lead-free solder Journal of Shanghai Jiaotong University (Science), v 13, n, SUPPL., April, 2008, p 74-77

Lin, Wei-Cheng, .Void-free vacuum reflow soldering of ball grid array Journal of Shanghai Jiaotong University (Science), v 13, n, SUPPL., April, 2008, p 82-86

Sun, Li, Qi, Fang-Juan, Hou, Zhe-Zhe, Qin, Cha .Prediction of Sn-Ag solder properties based on BP algorithm of artificial neutral network Journal of Shanghai Jiaotong University (Science), v 13, n, SUPPL., April, 2008, p 138-140

Fan, Ping-Yue, Qi, Bo, Wang, Jia-Ji .Fatigue behavior of BGA soldering under board level drop test Journal of Shanghai Jiaotong University (Science), v 13, n, SUPPL., April, 2008, p 141-144

--------------------------------------------------------
Journal of Shenyang University of Technology (China)
Shenyang Gongye Daxue Xuebao
{ https://caod.oriprobe.com/journals/sygydxxb/Journal_of_Shenyang_University_of_Technology.htm LH closed, UCSD online, }
item found as of 1/30/2011 catalog

Effect of alloying elements on properties and microstructure of Sn-Bi-Sb-Ag-Cu-Re lead-free solder Shenyang Gongye Daxue Xuebao (Journal of Shenyang University of Technology) (China), vol. 27, pp. 377-380, Aug. 2005

--------------------------------------------------------
Journal of the Society of Chemical Industry
Kogyo kagaku zasshi
{ https://onlinelibrary.wiley.com/loi/19349971 IU bloomington alf TP1.S6, MST depos TP1.S6 & depos 660.5J82s, OkSU stillwater 660.6S678j, OSU depos TP1S66, PU hicks 540.5B77 & 660.6So1j, SDSU TP1.S599, SIUC morris microfilm, SIUE lovejoy, UAr storage TP1.S6, UC sw depos TP1.S6, UCSD s&e QD1.N63, UIC warehouse TP1.K59, UK king TP200.J68, UL kersey TP1.S6, UM buhr TP1.S677j, UOk bizzell 660.5So13j, UTo depos, WSU sci & storage, }
1 item found as of 1/30/2011

--------------------------------------------------------
Journal of the Society for Information Display
{ FIU green TK7882.I6I6, GIT online & main TK7882.I6568, Lexmark, LH closed, NWU sci 621.3987J86, OkSU online, PU online, SIUC morris TK7882.I6J68, UC eng TK7882.I6J68, UIUC eng 621.3805JOU, UNCC TK7882.I6J68, UTA pcl TK5103.5N342, }
1 item found as of 1/30/2011
v16#7 checked 3/24/2010

--------------------------------------------------------
Journal of the Society of Materials Science
Zairyo
{ https://www.jstage.jst.go.jp/browse/jsms/list/-char/en FIU online, LH closed, MIT online, NWU online, UIUC eng 620.105ZA, UTor eng TA401.Z3, }
5 items found as of 8/8/2021 catalog
v53#1-v70#7(21) checked 8/8/2021

--------------------------------------------------------
Journal of Solar Energy Engineering
{ https://asmedigitalcollection.asme.org/solarenergyengineering/issue AU online, BYU hbll TJ810.J83x, FIT online, GIT online, IU online, LH closed, LU gray TJ1.A7, MoSU TJ810.S6, MST online, NWU online, OCU beam microfiche, OkSU online, OrSU online, OSU online, PU online, RU online, SDSU TJ810.T69, SIUC online, SIUE lovejoy, UAB online, UAH n1, UAr online, UC online, UCF online, UCI online, UCSD s&e TJ1.J828, UDe online, UE online, UF online, UIC online, UIUC online, UK online & eng TJ810.T69, UM online, UMC online, UOk online, USF online, USU online, UT online, UTA online, UTO online, }
1 item found as of 1/21/2021
v130#2 checked 1/21/2021

--------------------------------------------------------
Journal of Solid State Electrochemistry
{ https://link.springer.com/journal/10008/volumes-and-issues CSULB online, FAU online, FIU online, FSU online, GIT online, MST online, NWU online, OkSU online, OSU online, SDSU online, SIUC online, SMU online, UC online & depos QD551.J68, UCF online, UCSd online, UD online, UK online, UMi online, UNCC online, UOk online, UPi online, USC online, USD online, UT online, UTAr online, UTD online, UTor online, UWa online, }
>=20 items found as of 8/9/2021
v1#1-v25#7(21) all issues checked 8/9/2021
searched for tin whisker(s) and Sn whisker(s) on 7/19/2020
searched for zinc whisker(s) and Zn whisker(s) on 9/15/2020
searched for indium whisker(s) on 9/15/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/15/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/16/2020

--------------------------------------------------------
Journal of Solid Waste Technology and Management
{ https://www.ingentaconnect.com/content/jswt/jswt GIT main-5e TD785.J86, LH closed, OSU online, PU eng 628.405J826, UAr mullins TD785.N35, UCF main TD785.J86, UCSD online, UOk online, USF tampa TD785.J68, UTo online, WrSU online, }
2 items found as of 1/30/2011

--------------------------------------------------------
Journal of South China University of Technology
Huanan Ligong Daxue Xuebao
{ LH closed, UCSD online, UOk online, UTo online, UTor online, }
item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Zeng, Zhen-Ou, Zou, Jin-Guang, Zhao, Guo-Peng, Liu, Jian-Ping .Performance of trivalent and hexavalent chromium passivation films based on zinc plating Huanan Ligong Daxue Xuebao/Journal of South China University of Technology (Natural Science), v 35, n 5, May, 2007, p 104-108 Language: Chinese

--------------------------------------------------------
Journal of Southeast University (Natural Science Edition)
Dongnan Daxue Xuebao (Ziran Kexue Ban)
{ https://www.oriprobe.com/journals/dndxxb.html AU rbd, FSU strozier 959.005J864, GIT main-5e T1.T84, LH closed, OSU depos T1.T84, UCSD online, UOk online, UPi online, UTo online, UTor online & eng T1.J842, }
1 item found as of 1/30/2011 catalog
v34#2-v34#4,v35#1-v36#6 checked 10/30/2010

(new reference 12/30/2008)
Xue, Feng, Zhou, Jian, Li, Peipei, Fang, Yili .Effect of interface reaction and interface tension on wettability of Sn-Zn-Bi solders Dongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Southeast University (Natural Science Edition), v 37, n 4, July, 2007, p 634-638 Language: Chinese

Wang, Changliang, Zhou, Jian, Sun, Yangshan, Fang, Yili .Investigation on oxidation resistance of Sn-8Zn-3Bi lead-free solder alloys Dongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Southeast University (Natural Science Edition), v 38, n 4, July, 2008, p 693-697 Language: Chinese

--------------------------------------------------------
Journal of the Surface Finishing Society of Japan
Hyomen Gijutsu
{ https://www.jstage.jst.go.jp/browse/sfj/57/7/_contents/-char/en, CSULB online, FAU online, FIU online, NWU online, OkSU online, SDSU online, UCI online, UCSD online, UK online, UMi online, UPi online, UTor online, }
>=20 items found as of 8/8/2021 catalog
v54#1-v72#7(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 8/14/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/15/2020
searched for indium whisker(s) on 8/15/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/15/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 10/10/2020

(new reference 5/14/2021)
Yoshida, Atsushi, Nagahara, Kazuhiro, and Tanaka, Atsushi, "Aluminum Electrolytic Capacitor Suitable for High-frequency Power Converters," Journal of the Surface Finishing Society of Japan, vol. 69 no. 12, pp. 571-576, Dec. 2018. https://doi.org/10.4139/sfj.69.571

Osajima, Mitsuhiro, "Guide of a Chromium (III) Electroplating," Journal of the Surface Finishing Society of Japan, vol. 69 no. 6, pp. 237-239, June 2018. https://doi.org/10.4139/sfj.69.237

Onodera, Hiroyuki, "Current Status of Trivalent Chromium Plating and Its Overseas Trends," Journal of the Surface Finishing Society of Japan, vol. 69 no. 6, pp. 234-236, June 2018. https://doi.org/10.4139/sfj.69.234

Shimpo, Ryokichi, "Hard Chromium Plating Using Trivalent Chromium Baths," Journal of the Surface Finishing Society of Japan, vol. 69 no. 6, pp. 219-225, June 2018. https://doi.org/10.4139/sfj.69.219

Murakami, Koji, and Hino, Makoto, "Generation and Growth of Whiskers Relating to Plated Films of Tin," Journal of the Surface Finishing Society of Japan, vol. 65 no. 3, pp. 135-139, Mar. 2014. https://doi.org/10.4139/sfj.65.135

Suganuma, Katsuaki, "Sn Whiskering Mechanism and its Evaluation," Journal of the Surface Finishing Society of Japan, vol. 63 no. 11, pp. 677-680, Nov. 2012. https://doi.org/10.4139/sfj.63.677

Tsuchida, Tetsuyuki, Okubo, Toshikazu, Kano, Takahiro, and Shohji, Ikuo, "The Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder Joint," Journal of the Surface Finishing Society of Japan, vol. 63 no. 4, pp. 233-238, Apr. 2012. https://doi.org/10.4139/sfj.63.233

Ikemoto, Sachi, Kitahara, Yasuko, Oda, Takehide, Noguchi, Toshiaki, Maeda, Chizuko, and Yamashita, Masaaki, "Application of FE-EPMA Evaluation to Microstructure between Pb-free Solder Alloy and Ni-P Coating Layer," Journal of the Surface Finishing Society of Japan, vol. 62 no. 5, pp. 273-275, May 2011. https://doi.org/10.4139/sfj.62.273

--------------------------------------------------------
(new source 9/15/2020)
Journal of Surface Investigation: X-ray, Synchrotron and Neutron Techniques
{ https://link.springer.com/journal/11700/volumes-and-issues UK online, }

1 item found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 9/16/2020
searched for zinc whisker(s) and Zn whisker(s) on 9/16/2020
searched for indium whisker(s) on 9/16/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/16/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/16/2020

--------------------------------------------------------
Journal of Synchrotron Radiation
{ https://journals.iucr.org/s/services/archive.html OkSU online, OSU online, SDSU online, SIUC online, UAr online, UC chem QC793.5.E627J68, UCSD online, UK online, UL online, UOk online, USD online, }
2 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 7/19/2020
searched for zinc whisker(s) & Zn whisker(s) on 9/1/2020
searched for indium whisker(s) on 9/1/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/1/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/1/2020

--------------------------------------------------------
Journal of Technical Physics (USSR)
{ https://link.springer.com/journal/11454/volumes-and-issues GIT main TA355.P75 & storage TA355.P75, IU bloomington alf QA935.A2P7, LH closed, MIT storage, MST depos 534.05P941, PU hicks 620.101P941, UC eng & sw depos TA355.P75, UCB mathphys TA355.P75, UCSD s&e TA1.P962, UIC daley TA355.P75, UM offsite QC1.P912B, USC sel, }
4 items found as of 11/26/2020 catalog
searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

(new reference 11/26/2020)
Kostenetz, V. I., and Ivanchenko, A. M., "Mechanical Properties of Metals and Alloys in Tension at Low Temperatures (-196 and -253 C): Part IV - Solders," Journal of Technical Physics (USSR), vol. 16 no. 5, pp. 551-554 (1946).

--------------------------------------------------------
Journal of Testing and Evaluation
{ https://www.astm.org/DIGITAL_LIBRARY/JOURNALS/TESTEVAL/jote_issues.html FAU online & wimberly TA401.J675, FIU online & green TA401.J672, MST wilson TA401.J862, OkSU main 620.004405J86, OSU sel TA401.J65, SIUC morris 53285-6202, SDSU TA401.J672, SIUE online, TTU online, UAr mullins TA401.J672, UCSD online, UK online & eng TA401.J67, UL kersey TA401.J672, UMe online & mcwherter, UMi online & richter TA401.J672, UNCC online, UOk online, UT online & hodges TA401.J683, UTor online, UWa davis TA401.J675x, }
5 items found as of 6/20/2021
v25#1-v49#3(21) checked 6/20/2021

--------------------------------------------------------
Journal of Thermal Analysis & Calorimetry
{ https://link.springer.com/journal/10973/volumes-and-issues EBSCOA, AU online, BYU hbll QD515.J65, FSU online, GIT main QD515.J65, IU online, LH closed, MST online, NWU online, OGI online, OkSU online, OrSU online, OSU online, PU online, RU online, SDSU online, SIUC online, SU online, UAH online, UAr online, UC online, UCF online, UCI online, UCSD online, UD online, UDe online, UF online, UIC online, UK online (pay), UM online & shapiro QD515.J86, UMC online, UNF online, USD online, USF online, USU online, UT online, UTA online, UTo online, WrSU online, }
19 items found as of 8/6/2021
v87#1-v145#5(21) checked 8/6/2021
searched for tin whisker(s) and Sn whisker(s) on 7/19/2020
searched for zinc whisker(s) and Zn whisker(s) on 9/16/2020
searched for indium whisker(s) on 9/16/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/16/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/16/2020

--------------------------------------------------------
Journal of Thermal Stresses
{ https://www.tandfonline.com/loi/uths20 AU online, FAU online, FSU online, GIT online & main TA418.58J68, IU online, LH closed, MoSU TA418.58.J68, MST online, NWU online, OGI online, OrSU online, OSU online, PU online, SDSU online, SIUC online, UAH online, UAr mullins per-microfiche TA418.58.J68, UC eng TA418.58.J68, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UIUC online, UK online & eng TA418.58.J68, UM online,UMC online, UOk online, USD online, USF online, UT online, UTA online, UTo online, WrSU online, }
1 item found as of 1/21/2021
searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

--------------------------------------------------------
Journal of Toxicology and Environmental Health Part A
{ https://www.tandfonline.com/loi/uteh20 OSU online, UC online, UK online & med W1JO966K, UL health, UM online, UT online, VU online, }
1 item found as of 1/21/2021
searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

--------------------------------------------------------
Journal of Tribology
Journal of Lubrication Technology
{ CBU, MST online, MSU online & eng TJ1075.A2J6, NWU online & sci L621.06A51Ser.F, OCU beam, OkSU online, OSU online, PU eng 621.06Am3F, SDSU TJ1075.A2J68, SIUC online, SIUE lovejoy, TTU online, UAr online, UC online & eng TJ1.A7Ser.F, UCSD online, UE online, UIC daley TJ1075.A2J682, UK eng TJ1075.A2J68, UL kersey TJ1075.A2J69, UM online, UOk online, UT online & hodges TJ1075.A2J6, UTo online & carlson, WSU online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Journal of University of Science and Technology Beijing
Beijing ke ji da xue xue bao
{ LH closed, OkSU online, OSU sel TS300.P45, PU eng 669.105J826, UCSD online, UOk online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Journal of Vacuum Science and Technology
Zhenkong Kexue yu Jishu Xuebao
{ https://avs.scitation.org/toc/jvs/current CSULA north TJ940.J67, CSULB online, FIU green TJ940.J67, LH closed, MST wilson TJ940.J67, SDSU online, SIUC online SIUE storage, UCSD online, UK online, UMi richter TJ940.J67, UNCC online, UOk online, USC grand, USD online, UTor online, UWa online, }
6 items found as of 1/21/2021
v27#3 checked 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/20/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/20/2020
searched for indium whisker(s) on 12/20/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/20/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/20/2020

--------------------------------------------------------
Journal of Vacuum Science & Technology A: Vacuum Surfaces, and Films
Zhenkong Kexue yu Jishu Xuebao
{ https://avs.scitation.org/toc/jva/current FIU green TJ940.J67, Lexmark, MST wilson TJ940.J67, OkSU online, OSU TJ940A1J6, SDSU online, SIUE online, TTU, UAr online, UCSD online, UK online & chem/phys TJ940.J67, UL kersey TJ940.J6, UMe online & mcwherter, UMi richter TJ940.J668, UOk online, USD online, UT online, UTor online, UWa online, }
>=20 items found as of 6/20/2021
v1#1-v2#4(84), v8#3, v25#1-v39#3(21) checked 6/20/2021
searched for tin whisker(s) and Sn whisker(s) on 12/20/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/20/2020
searched for indium whisker(s) on 12/20/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/20/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/20/2020

--------------------------------------------------------
Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
{ https://avs.scitation.org/toc/jvb/current UK online & remote TJ940.J67, }
>=20 items found as of 6/20/2021
v12#2, v30#1(12)-v39#3(21) checked 6/20/2021
searched for tin whisker(s) and Sn whisker(s) on 11/24/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/24/2020
searched for indium whisker(s) on 11/24/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/24/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/24/2020

--------------------------------------------------------
Journal of Vibration and Shock
Zhendong yu Chongji
{ https://www.oriprobe.com/journals/zdycj.html UTo online, }
item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Liu, Fang, Meng, Guang, Zhao, Mei .Progress in research of SMT solder joint reliability during drop impact Zhendong yu Chongji/Journal of Vibration and Shock, v 26, n 10, October, 2007, p 92-95 Language: Chinese

Liu, Fang, Meng, Guang, Zhao, Mei, Zhao, Jun-Feng .Finite element analysis for lead-free solder joints under a board level drop impact Zhendong yu Chongji/Journal of Vibration and Shock, v 27, n 2, February, 2008, p 75-77 Language: Chinese

--------------------------------------------------------
Journal of Wuhan University of Technology
Journal of Wuhan University of Technology- Materials Science
Journal Wuhan University of Technology
Wuhan Ligong Daxue Xuebao
{ FAU online, LH closed, TU online, UCSD online, UMi online, UOk online, UPi online, USC TA401.J698, UTD online, UTor online, }
7 items found as of 10/21/2011 catalog
v17#1-v26#4 checked 10/21/2011

(new reference 12/29/2008)
Yan, Qin-Yun (School of Physics Science and Technology, Central South University); Zhou, Ji-Cheng; Yang, Dan "Research on bonding properties of electrically conductive adhesives for hybrid microcircuits application," Wuhan Ligong Daxue Xuebao/Journal of Wuhan University of Technology, vol. 28 no. 3, Mar. 2006, pp. 18-21 Language: Chinese.

KKKK--------------------------------------------------------
Kawasaki Steel Technical Report
{ NWU sci 669.14K422, SIUC online, UPI storage, UTA eng TS300.K282, }
1 item found as of 1/30/2011 catalog
v1-v47 checked 9/18/2009

--------------------------------------------------------
Kemet TechTopics
>=20 items found as of 12/14/2013 catalog
v1#1-v2#1,v2#3,v2#5-v2#8,v3#2,v3#4-v4#1,v4#5-v4#7,v5#2,v5#5,v6#1-v6#2,v8#3 checked 12/14/2013

--------------------------------------------------------
KEMET Update
2 items found as of 1/30/2011 catalog

(new reference 6/5/2009)
Prymak, John, "Update - Ceramic versus Tantalum," KEMET Update, Sept. 2004.

--------------------------------------------------------
Key Engineering Materials
{ https://www.scientific.net/KEM MST online, NWU various, OkSU stillwater 620.1105K44, OSU sel various, PU eng 620.11292M465a, UC online & eng TA404.8.M433, UCSD online, UD roesch various, UK online & eng TA401.M42, UM online, UT hodges TA404.8.M433, UTo carlson TA401.M42, WSU sci TA401.M42, }
>=20 items found as of 1/21/2021
v297-v300,v312,v340-341,v345-346,v353-358,v364-366,v373-374,v385-387,v415, v421-v422,v462-v463 checked 1/21/2021

searched for tin whisker(s) and Sn whisker(s) on 10/12/2020

searched for zinc whisker(s) and Zn whisker(s) on 10/12/2020
searched for indium whisker(s) on 10/12/2020
searched for cadmium whisker(s) and Cd whisker(s) on 10/12/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 10/12/2020 searched for nanowire(s), mesowire(s), microwire(s) on 10/12/2020 --------------------------------------------------------
KG Technical Conference
item found as of 1/30/2011 catalog

Jordan, Manfred, Max Scholotter, Electroplating of Lead-Free Tin Alloys, GMBH & Co. KG Technical Conference Taipei, Taiwan Dec. 2002 pag 48.

--------------------------------------------------------
Kimmel Gerke Bullets
13 items found as of 12/23/2013
v1#1-Winter14 all issues checked 12/23/2013

--------------------------------------------------------
Koninklijke Akademie van Wetenschappen te Amsterdam
{ }

--------------------------------------------------------
Korean Journal of Materials Research
{ UPi online, }
item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Lim, Gi-Tae, Lee, Jang-Hee, Kim, Byoung-Joon, Lee, Ki-Wook, Lee, Min-Jae, Joo, Young-Chang, Park, Young-Bae .Effect of thermal aging on intermetallic compound growth kinetics of Au stud bump Korean Journal of Materials Research, v 18, n 1, January, 2008, p 45-50 Language: Korean

--------------------------------------------------------
Kunststoffe Plast Europe
{ https://www.kunststoffe.de/en/journal/archive GIT main-6e TP1101.K82X, LH closed, PU eng 660.5K96b, UC sw depos TP1101.K91, }
item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Mark, Frank E., .Verwerten von altkunststoffen aus E+E (Recovery of used plastics from E+E) Kunststoffe Plast Europe, v 92, n 9, September, 2002, p 6-9+22-24+26-27 Language: German, English

Vorspohl, Klaus, Sartorius, Ingo .Kunststoffe in elektro- und elektronikgeraten (Plastics in electric and electronic appliances) Kunststoffe Plast Europe, v 93, n 12, 2003, p 28-31+57-61 Language: German, English

Weber, Martin .Produkte fur innovative Verfahren (Products for innovative processes) Kunststoffe Plast Europe, v 94, n 12, 2004, p 98-101 Language: German

-------------------------------------------------------
KWPCA Journal
{ }
1 item found as of 1/30/2011 catalog

LLLL--------------------------------------------------------
LA Times
{ OSU online, UM online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Langmuir
{ https://pubs.acs.org/loi/langd5 FAU online, FIU online, MST online, OkSU north_boomer 541.34505L284, RyU online, SDSU online, SIUC online, TTU online & QD506.A1L35, UAr online, UCSD online, UE online, UK online, UM online & shapiro QD506.A1L284, UMi richter QD506.A1L35, UNCC online, UOk bizzell QD506.A1L284, USD online, UT online, UTo online & carlson, UWa online, WSU sci, }
3 items found as of 1/21/2021
v21#8,v24#16-v25#21 checked 1/21/2021

--------------------------------------------------------
Laser Focus World
{ http://www.erbium.nl/press/Laser%20Focus%20World%20-%20Materials%20researchers%20pursue%20micro-%20and%20nanophotonics.htm, OSU online, UC phys TK7872.L3L2, UD online, UK online & storage TA1501.L37, UL online, UM online, UT online, VU online, }
2 items found as of 1/21/2021

--------------------------------------------------------
LAWE
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Lead-Free Connection
>=20 items found as of 1/30/2011 catalog
v1#1-v4#1 all issues checked 4/3/2009

--------------------------------------------------------
Lead-Free Electronics: Positioning Massachusetts Companies as Industry Leaders
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Lead Free Electronics Workshop
2 items found as of 1/30/2011 catalog

--------------------------------------------------------
Lead-Free Magazine
>=20 items found as of 12/17/2013 catalog
checked 12/17/2013

--------------------------------------------------------
Lead-Free Soldering Seminar 2001
6 items found as of 1/30/2011 catalog

--------------------------------------------------------
Lead Free Soldering Summit
14 items found as of 1/30/2011 catalog
05 checked 4/3/2009

--------------------------------------------------------
2000 Lead Free Symposium Conference Proceedings
{ http://www.smta.org/knowledge/knowledge.cfm, }
15 items found as of 11/26/2020 catalog
00 checked 11/26/2020

--------------------------------------------------------
2006 Lead-Free Technology Workshop
10 items found as of 1/30/2011 catalog
06

--------------------------------------------------------
Lead-Zinc-Tin '80
{ CMU eng TN785.T17, OSU depos TN785.W6, UK eng TN785.T17, }
1 item found as of 8/6/2012 catalog

--------------------------------------------------------
LEADOUT Controlling a Lead Free Process Workshop
{ }
2 items found as of 1/30/2011 catalog

--------------------------------------------------------
LEADOUT Hands On Lead-Free Workshop
{ }
6 items found as of 1/30/2011 catalog

--------------------------------------------------------
Lecture Notes in Computer Science
{ AU rbd various, CBU online, GIT various, LU gray various, MST wilson various, NWU sci various, OGI various, OkSU online, OrSU valley various, OSU sel various, PU online, RU fondren various, SDSU various, SIUC morris various, SIUE lovejoy various, SPU various, SU leml various, TTU online, UAB sterne various, UAH online, UAr mullins QA75.5.L42, UC math various, UCF online, UCI online, UCSD online, UDe penrode various, UF online, UIC online, UIUC eng various, UK online, UM misc, UMC various, UMe math, UOk online, USF online, USD online, UTA pcl various, UTo carlson various, WrSU swdepos various, }
1 item found as of 1/21/2021
v5315 checked 1/21/2021

--------------------------------------------------------
letsrecycle.com
1 item found as of 1/30/2011

--------------------------------------------------------
Life Cycle Assessment VIII
{ }
2 items found as of 1/30/2011 catalog

--------------------------------------------------------
Lighting Journal
{ LH closed, PU hicks 621.326IL6i, USC online, }
1 item found as of 1/30/2011 catalog

(new reference 12/29/2008)
Howard, Allan .Advisory notes on the WEEE Directive Lighting Journal (Rugby, England), v 70, n 5, September/October, 2005, p 44-45

Anon .Last word from westminster Lighting Journal (Rugby, England), v 70, n 6, November/December, 2005, p 52

--------------------------------------------------------
Lightwave
{ CPL washington, IU online, MST online, NWU online, OkSU online, OSU online, SDSU online, SIUC online, UAr online, UCSD online, UIC online, UK online, UL kersey TA1800.L55, UOk online, USD online, UT online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Linear Technology
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Liquid Crystal Newsletter No. 19
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
LiveWire
{ CSULB online, OSU depos TK1.L78, UK remote LB1027.L570, UM online, }
3 items found as of 1/30/2011 catalog

--------------------------------------------------------
Low Temperature Physics
Fizika Nizkikh Temperatur
{ https://aip.scitation.org/toc/ltp/current CSULB online, OSU QC278.F519, UC online, UD online, UK online, UM online, UT online, VU online, }
2 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 11/28/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/28/2020
searched for indium whisker(s) on 11/28/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/28/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/28/2020

MMMM--------------------------------------------------------
Machine Design
{ http://machinedesign.texterity.com/machinedesign/20081211/?u1=texterity, EBSCOA, EBSCOB,CBU, CPL washington, IU online, KYVL, Lexmark, MST online, NWU sci 621.05M149, OSU sel TJ1.M138, PU eng 621.05M176, SDSU online, SIUC morris 53359-6251, TTU online, UAr online, UC eng TJ1.M18, UCSD online, UD roesch, UE online, UIC daley TJ1.M15, UK online & eng TJ1.M15, UL kersey TJ1.M15, UM online, USD online, UT hodges TJ1.M15, }
6 items found as of 8/6/2021
v85#10-v92#6,v92#12-v93#7(21) checked 8/6/2021

--------------------------------------------------------
Machine Vision Online
{ http://www.machinevisiononline.org/ }
2 items found as of 2/13/2011

--------------------------------------------------------
Macromolecular Rapid Communications
{ https://onlinelibrary.wiley.com/loi/15213927 AU online, BYU online, FSU online, GIT online, IU online, LH closed, MST online, NWU online, OGI online, OkSU online, OrSU online, OSU online, PU online, RU online, SDSU online, SIUC online, SU online, UAB online, UAr online, UC online, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UIUC online, UK online, UM online, UMC online, UNF online, UOk online, USD online, USF online, USU online, UT online, UTA online, UTo online, WrSU online, }
1 item found as of 1/21/2021
v29#3 checked 1/21/2021

--------------------------------------------------------
Macromolecules
{ https://pubs.acs.org/loi/mamobx CBU, FAU online, FIU online, MST online, RyU online, SIUC online, TTU online & QD380.M32, UAr online, UCSD online, UE online, UK online, UM buhr QD471.M177, UMi online, UNCC online, USD online, UT online, UTor online, UWa online, }
2 items found as of 1/21/2021
v42#1-v43#14(10) checked 1/21/2021

--------------------------------------------------------
Magnesium technology xxxx
{ FSU dirac TN799.M2M26, LH TN799.M2, MIT hayden TN799.M2M196 & hayden TN799.M2.M26 & hayden TN799.M2M35, MST wilson TN799.M2M2595, NWU sci 669.723M1964 OSU sel TN799.M2M26, PU eng 669.723Em56p & 669.723M274, RU fondren TN799.M2M258 TTU TN799.M2M26, UCF main TN799.M2M258, UH TN799.M2M26, UK eng TN799.M2M26, UM online, UOk eng TN799.M2M272, UTo carlson TN799.M2M26, }
item found as of 6/11/2015 catalog
86,87,00,02-04,07,09 checked 6/11/2015

Magnesium technology 2005 : proceedings of the symposium held during the 2005 TMS Annual Meeting in San Francisco, California, U.S.A., Feb. 13-17, 2005 /

--------------------------------------------------------
Magnetic Recording Conference 1995
{ IEEE XPLORE (93-96,20), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
93-96,20 checked 8/3/2021

--------------------------------------------------------
Magnetism and Magnetic Materials
{ CMU storage 538.082C74M, CSULA north oversize QC761.C61, CSULB QC750.J64, OSU sel QC761.C62, SMU storage TK454.4.M3M3, UC phys QC761.C6, UK sci QC761.C6, UL robotics QC761.C6, UM online, UT storage QC761.C6, UTAr depos QC761.C61, UTD main QC761.C6, VU sci QC761.C6, }
4 items found as of 6/29/2017 catalog
71-76 checked 6/29/2017

--------------------------------------------------------
Manufacturing Business Technology
{ http://www.mbtmag.com/ IU online, Lexmark, NWU online, OkSU main 670.5M29411, OSU online, PU eng 670.285M319, SDSU online, SIUC online, UAr online, UCSD online, UIC online, UM offsite TS155.A1M391, UOk online, USD online, UT online, }
4 items found as of 9/24/2014
-Jun09 checked 9/24/2014

--------------------------------------------------------
Manufacturing Computer Solutions
{ SMU online, }
item found as of 1/30/2011 catalog

WEEE won't come you'll just have easy to wait Dwyer, John Manufacturing Computer Solutions, vol. 11 no. 3, Mar. 2005, pp. 36-37

--------------------------------------------------------
Manufacturing Engineering
{ CBU, Lexmark, MST online, OkSU online, OSU sel TJ1180A1P92, SDSU online, SIUC morris 53371-6214, SIUE lovejoy microfiche, TTU, UAr online, UCSD online, UE, UK online & eng TJ1180.A1A6, UL kersey TJ1180.A1A6, UT online, }
item found as of 1/21/2021

--------------------------------------------------------
Marb. Ber.
Marbach? Marbacher?
Bericht, Berichte?
item found as of 1/30/2011

F. Richarz, Marb. Ber. 1904, S. 61.

A. Wigand, Marb. Ber. 1904, S. 61.

F. Richarz, Marb. Ber. 1904, S. 66.

A. Wigand, Marb. Ber. 1906, S. 196.

--------------------------------------------------------
Marquette Law Review
{ OSU online, UC law K13.A76, UD online, UK online & law, UL law, UM online, UT online, VU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Maryland Research
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Massachusetts Toxic Use Reduction Institute 2nd Workshop on Lead-Free Electronics
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Materia Japan
Bulletin of the Japan Institute of Metals
Nihon Kinzoku Gakkai kaiho
{ https://www.jstage.jst.go.jp/browse/materia/list/-char/en LH closed, RU fondren TN4.M5, }
1 item found as of 1/30/2011
v43#8

--------------------------------------------------------
Material Science and Technology
Cailiao Kexue yu Gongyi
{ LH closed, UF online, UPi online, USC grand, UTo online, }
items found as of 2/3/2014 catalog

(new reference 12/30/2008)
Wu, An-Ru, Xia, Chang-Qing .Study of the property of Sn-Ag-Sb-Zn lead-free solder containing trace elements Cailiao Kexue yu Gongyi/Material Science and Technology, v 15, n 5, October, 2007, p 730-733 Language: Chinese

Tian, Jun, Hao, Hu, Shi, Yao-Wu, Lei, Yong-Ping, Xia, Zhi-Dong .Microstructure and performance of SnAgCuEr lead-free solders with rare earth Cailiao Kexue yu Gongyi/Material Science and Technology, v 16, n 2, April, 2008, p 281-283 Language: Chinese

Huang, Hui-Zhen, Zhou, Lang, Wei, Xiu-Qin, Ye, Zhe-Chuan .Microstructures of solidified Sn-9Zn lead-free solder alloy and their evolution in aging Cailiao Kexue yu Gongyi/Material Science and Technology, v 16, n 3, June, 2008, p 374-377 Language: Chinese

--------------------------------------------------------
(new source 6/7/2020)
Materials
{ https://www.mdpi.com/journal/materials UK online, }
4 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 7/19/2020
searched for zinc whisker(s) and Zn whisker(s) on 9/16/2020
searched for indium whisker(s) on 9/16/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/16/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/16/2020

--------------------------------------------------------
Materials and Corrosion
Werkstoffe und Korrosion
{ https://onlinelibrary.wiley.com/loi/15214176 AU online, BYU online, FSU online, GIT online, LH closed, LU gray TA401.W45, MST online, NWU online, OrSU online, OSU online, PU eng 691.7W49 & hicks 691.7W49, RU online, SDSU online, SIUC online, UAB online, UAr online, UC online, UCF online, UCI online, UCSD online, UIC online, UIUC online, UK online, UM online & buhr TS200.W48, UMC online, UNF online, UPi online, USF online, USU online, UTA storage 669.05W493, UTo online, WrSU online, }
10 items found as of 8/11/2021 catalog
v57#1-v72#8(21) checked 8/11/2021
searched for tin whisker(s) and Sn whisker(s) on 12/19/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/19/2020
searched for indium whisker(s) on 12/19/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/19/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/19/2020

--------------------------------------------------------
Materials and Design
{ https://www.sciencedirect.com/journal/materials-and-design/issues https://www.sciencedirect.com/journal/materials-and-design-1980-2015/issues AU online, GIT online & main-5e TA401.M375X, LH closed, MST wilson TA401.I79, NWU online, OkSU online, OrSU online, OSU online, PU online, RU online, SDSU online, UC online, UCI online, UDe online, UF online, UIC online, UIUC online, UK online, UM online, UMC online, USD online, USU online, UTA online, UTo online, WrSU online, }
6 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/4/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/4/2020
searched for indium whisker(s) on 12/4/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/4/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/4/2020

--------------------------------------------------------
Materials and Manufacturing Processes
{ https://www.tandfonline.com/loi/lmmp20 CSULA online, CSULB TS176 .A24, OkSU online, SDSU online, SIUC online, SMU online, UAr online, UCSD online, UK online, UM online, UOk online, UPi online, USC TS183.A38, USD online, UT online, UTAr online, UTD online, }
14 items found as of 8/9/2021 catalog
v1#1-v36#11(21) checked 8/9/2021
searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

(new reference 5/7/2021)
Sumit Guha, Christos Kyriacou, James Withers, Raouf Loutfy & Robert Dowding A Low Cost Synthesis Technique for Tungsten Whiskers of <100> Orientation ," Materials and Manufacturing Processes, vol. 9 no. 6, pp. 1061-1086, 1994. https://doi.org/10.1080/10426919408934976

--------------------------------------------------------
Materials at High Temperatures
{ https://www.tandfonline.com/loi/ymht20 EBSCOA, CSULB online, OSU online, SMU online, UC online, UK online, UM online, USC TA418.26.H54, UTAr online, UTD online, }
2 items found as of 8/6/2021 catalog
v13#1-v13#4,v26#4-v38#4(21) checked 8/6/2021
searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

--------------------------------------------------------
Materials Australia
{ LH closed, UM online sd, }
1 item found as of 1/30/2011
v46#2-v46#3

--------------------------------------------------------
Materials Characterization
{ https://www.sciencedirect.com/journal/materials-characterization/issues CSULB online, OSU depos TN690.A1M373, SMU online, UC online, UD online, UK online & remote TN690.M39, UL robotics TA417.2.M219, UM online, USC grand, UT online, UTAr online, UTD online, VU online, }
6 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 7/19/2020
searched for zinc whisker(s) and Zn whisker(s) on 9/16/2020
searched for indium whisker(s) on 9/16/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/16/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/16/2020

--------------------------------------------------------
Materials Chemistry and Physics
{ https://www.sciencedirect.com/journal/materials-chemistry-and-physics/issues CSULB online, FAU online, FIU online, OkSU online, OSU online, RyU online, SDSU online, SMU online, UCSD online, UK online (pay), UM online sd, UMi online, UNCC online, UPi online, USC grand, UT online, UTAr online, UTD online, UTor online, UWa online, }
>=20 items found as of 8/8/2021 catalog
v110#1-v272(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 12/4/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/4/2020
searched for indium whisker(s) on 12/4/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/4/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/4/2020

(new reference 12/4/2020)
Bowering, Norbert, x Induction of tin pest for cleaning tin-drop contaminated optics ," Materials Chemistry and Physics, vol. Volume 198, 1 September 2017, pp. 236-242 https://doi.org/10.1016/j.matchemphys.2017.06.011

(not at UK) Jin, Wei, Zhijie LiY. Q. Fu Mg ion dynamics in anode materials of Sn and Bi for Mg-ion batteries ," Materials Chemistry and Physics, vol. Volume 182, 1 October 2016, pp. 167-172 https://doi.org/10.1016/j.matchemphys.2016.07.019

(not at UK) otsubo, fumitaka, hidenori erashigeru hirano tem analysis of whiskers formation over tin-plated films materials chemistry and physics volume 251, 1 september 2020, 122985 https://doi.org/10.1016/j.matchemphys.2020.122985

(not at UK) Satizabal, Luz M., Diego CostaWislei R. Osório Microstructural array and solute content affecting electrochemical behavior of SnAg and SnBi alloys compared with a traditional SnPb alloy ," Materials Chemistry and Physics, vol. Volume 223, 1 February 2019, pp. 410-425 https://doi.org/10.1016/j.matchemphys.2018.11.003

(not at UK) Skwarek, Agata, Piotr ZachariaszKrzysztof Witek Early stage detection of ß?a transition in Sn by Mössbauer spectroscopy ," Materials Chemistry and Physics, vol. Volume 182, 1 October 2016, pp. 10-14 https://doi.org/10.1016/j.matchemphys.2016.07.061

(not at UK) Skwarek, Agata, Piotr ZachariaszKrzysztof Witek Inoculator dependent induced growth of a-Sn ," Materials Chemistry and Physics, vol. Volume 166, 15 September 2015, pp. 16-19 https://doi.org/10.1016/j.matchemphys.2015.09.017

(not at UK) Tu, K. N., x Cu/Sn interfacial reactions: thin-film case versus bulk case ," Materials Chemistry and Physics, vol. Volume 46, Issues 2–3, November–December 1996, pp. 217-223 https://doi.org/10.1016/S0254-0584(97)80016-8

(not at UK) --------------------------------------------------------
Materials Engineering
{ CBU, Lexmark, MST wilson TN1.M34, OkSU stillwater TN1.M34, SDSU TN1.M34, TTU, UAr mullins TN1.M34, UCSD s&e TN1.M4253, UE, UK eng TN1.M34, UL kersey TN1.M34, OSU sel TN1M58, }
item found as of 1/30/2011

--------------------------------------------------------
Materials for Mechanical Engineering
item found as of 1/30/2011 catalog

Zhou, Jian, Sun, Yang-Shan, Xue, Feng Current status and trends in research of lead-free solders in electronics. Mater. Mech. Eng. Vol. 29, no. 3, pp. 11-13, 21. Mar. 2005

--------------------------------------------------------
Materials Issues in Art and Archaeology VI
{ https://www.cambridge.org/core/journals/mrs-online-proceedings-library-archive/opl-collections/materials-issues-in-art-and-archaeology CMU hunt CC135.M34, OSU thompson CC135.M34, UC online, UM online, UPi hillman CC135.M34, USC CC135.M34, UT hodges CC79.3.M36 & CC135.M36, VU central CC135.M34, }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Materials Letters
{ https://www.sciencedirect.com/journal/materials-letters/issues CSULB online, FAU online, FIU online, FSU online & dirac 620.5M4255, GIT online & main-5e TA401.M377X, IU bloomington swain TA401.M37, NWU online, OkSU online, OSU online & sel TA401M289, PU eng 620.1105M418 & hicks 620.1105M418, RU fondren TA401.M328, RyU online, SDSU online, SMU online, UAr online, UC online & eng TA401.M37, UCF online, UCSD online, UIC online, UK online (pay), UM online, UMi online, UNCC online, UOk online, USC grand, UT online, UTAr online, UTD online, UTor online, UWa online, VU online, }
>=20 items found as of 8/8/2021
V38#1-V302(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 12/4/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/4/2020
searched for indium whisker(s) on 12/4/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/4/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/4/2020

(new reference 1/21/2021)
," Materials Letters, vol. 298, pp. , 2021.

Yongkang Xu, Lianbi Li, Yuan Zang, Jichao Hu, ... Jeong-Hyun Cho Forward bending of silicon nanowires induced by strain distribution in asymmetric growth ," Materials Letters, vol. 297, pp. 129929-1-129929-, Aug. 15, 2021. https://doi.org/10.1016/j.matlet.2021.129929

Chuang Qiao, Xu Sun, Youzhi Wang, Long Hao, Xizhong An A perspective on effect by Ag addition to corrosion evolution of Pb-free Sn solder ," Materials Letters, vol. 297, pp. 129935-1-129935-, Aug. 15, 2021. https://doi.org/10.1016/j.matlet.2021.129935

Yan-Syun Huang, Hsin-Yu Chen, Chien-Neng Liao Growth of nanotwinned Cu nanowires in modified anodic aluminum oxide templates ," Materials Letters, vol. 288, pp. 129381-1-129381-, 2021. https://doi.org/10.1016/j.matlet.2021.129381

Collin Fleshman, Rui-Wen Song, Su-Yueh Tsai, Jenq-Gong Duh Phase identification and interface evolution of ENIG/Cu-core SAC305/ENIG solder joints after the thermal-electrical coupling reliability test ," Materials Letters, vol. 275, pp. 128104-1-128104-, Sept. 15, 2020. https://doi.org/10.1016/j.matlet.2020.128104

Jun Zhu, Gongguo Zhang, Weiwei Chang, Xiaoqian Luan, ... Yiqun Zheng Facile synthesis of silver nanorods/nanowires with sub-20 nm diameter and their trimetallic hollow derivatives using tiny Au seeds ," Materials Letters, vol. 272, pp. 127804-1-127804-, Aug. 1, 2020. https://doi.org/10.1016/j.matlet.2020.127804

Rui-Wen Song, Collin Jordon Fleshman, Hao Chen, Su-Yueh Tsai, Jenq-Gong Duh Suppressing interfacial voids in Cu/In/Cu microbump with Sn and Cu addition ," Materials Letters, vol. 259, pp. 126855-1-126855-, Jan. 15, 2020. https://doi.org/10.1016/j.matlet.2019.126855

Yuancheng Li, Menglong Sun, Siru Ren, Huiqin Ling, ... Ming Li The influence of non-uniform copper oxide layer on tin whisker growth and tin whisker growth behavior in SnAg microbumps with small diameter ," Materials Letters, vol. 258, pp. 126773-1-126773-, Jan. 1, 2020. https://doi.org/10.1016/j.matlet.2019.126773

Aging resistance of the Sn-Ag-Cu solder joints doped with Mo nanoparticles Linmei Yang, Shanyu Quan, Cong Liu, Guimei Shi Pages 191-194 ," Materials Letters, vol. 253, pp. , Oct. 15, 2019. https://doi.org/10.1016/j.matlet.2019.06.068

Amarsingh Bhabu Kanagaraj, Prerna Chaturvedi, Hamad Al Yassi, Lina Orabi, ... Daniel S. Choi Electrochemically grown vertical CdTe nanowire arrays on a flexible/transparent substrate ," Materials Letters, vol. 253, pp. 113-116, Oct. 15, 2019. https://doi.org/10.1016/j.matlet.2019.06.051

He Gao, Fuxiang Wei, Caixia Lin, Tie Shu, ... Xuping Zhang Growth behavior of intermetallic compounds on Sn-10Bi-0.7Cu-0.15Co/Co interface under multiple reflows ," Materials Letters, vol. 252, pp. 92-95, Oct. 1, 2019. https://doi.org/10.1016/j.matlet.2019.05.100

chen, chih-ming, yu-jen chen growth orientation of the tin whiskers on an electrodeposited sn thin film under three-point bending materials letters volume 63, issue 17, 15 july 2009, pp. 1517-1520 https://doi.org/10.1016/j.matlet.2009.04.006

chen, jie shi, cheng hui yehao lu sn whiskers mitigation by refining grains of cu substrate during the room temperature exposure materials letters volume 161, 15 december 2015, pp. 201-204 https://doi.org/10.1016/j.matlet.2015.08.074

Hofmann, F., X. SongA. M. Korsunsky High energy transmission micro-beam Laue synchrotron X-ray diffraction Materials Letters Volume 64, Issue 11, 15 June 2010, pp. 1302-1305 https://doi.org/10.1016/j.matlet.2010.03.014

kim, kyung-seob, jin-hyeok kimsung-won han the effect of postbake treatment on whisker growth under high temperature and humidity conditions on tin-plated cu substrates materials letters volume 62, issues 12–13, 30 april 2008, pp. 1867-1870 https://doi.org/10.1016/j.matlet.2007.10.027

Li, Yuancheng, Menglong SunMing Li The influence of non-uniform copper oxide layer on tin whisker growth and tin whisker growth behavior in SnAg microbumps with small diameter Materials Letters Volume 258, 1 January 2020, 126773 https://doi.org/10.1016/j.matlet.2019.126773

Lin, Hsiu-Jen, Tung-Han Chuang The effect of 0.5wt.% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads Materials Letters Volume 64, Issue 4, 28 February 2010, pp. 506-509 https://doi.org/10.1016/j.matlet.2009.11.058

liu, y., p. zhangz. m. sun spontaneous growth of sn whiskers and a new formation mechanism materials letters volume 178, 1 september 2016, pp. 111-114 https://doi.org/10.1016/j.matlet.2016.04.173

oh, chulmin, shijo nagaokatsuaki suganuma hillock growth dynamics for ag stress migration bonding materials letters volume 137, 15 december 2014, pp. 170-173 https://doi.org/10.1016/j.matlet.2014.09.006

Peng, Xinsheng, Guosheng WuAicheng Chen Growth and characterization of free-standing single crystalline tin and tin oxide nanobelts Materials Letters Volume 62, Issues 12–13, 30 April 2008, pp. 1969-1972 https://doi.org/10.1016/j.matlet.2007.10.054

Rahman, Abu Zayed Mohammad Saliqur, Pay Ying ChiaA. S. M. A. Haseeb Mechanical properties of intermetallic compounds in electrodeposited multilayered thin film at small scale by nanoindentation Materials Letters Volume 147, 15 May 2015, pp. 50-53 https://doi.org/10.1016/j.matlet.2015.01.127

Saka, M., R. Nakanishi Fabrication of Al thin wire by utilizing controlled accumulation of atoms due to electromigration Materials Letters Volume 60, Issues 17–18, August 2006, pp. 2129-2131 https://doi.org/10.1016/j.matlet.2005.12.107

sarobol, p., j. p. koppesc. a. handwerker recrystallization as a nucleation mechanism for whiskers and hillocks on thermally cycled sn-alloy solder films materials letters volume 99, 15 may 2013, pp. 76-80 https://doi.org/10.1016/j.matlet.2013.02.066

ye, huan, songbai xuemichael pecht effects of thermal cycling on rare earth (pr)-induced sn whisker/hillock growth materials letters volume 98, 1 may 2013, pp. 78-81 https://doi.org/10.1016/j.matlet.2013.01.065

Goswami, R., S. B. QadriG. G. Jernigan Stabilization of diamond cubic Sn nanodots in Ge Materials Letters Volume 187, 15 January 2017, pp. 126-128 https://doi.org/10.1016/j.matlet.2016.10.061

Joo, Yeon Jun, Tadashi Takemoto Transformation of Sn–Cu alloy from white tin to gray tin Materials Letters Volume 56, Issue 5, November 2002, pp. 793-796 https://doi.org/10.1016/S0167-577X(02)00615-8

lu, yebo, yuan limasumi saka forming long ag thin wires by using stress migration materials letters volume 171, 15 may 2016, pp. 72-74 https://doi.org/10.1016/j.matlet.2016.02.064

Vnuk, F., A. DeMonteR. W. Smith The composition dependence of the grey tin ? white tin transition in dilute tin-germanium alloys Materials Letters Volume 2, Issue 1, July 1983, pp. 67-70 https://doi.org/10.1016/0167-577X(83)90036-8

--------------------------------------------------------
Materials Performance
{ MST wilson TA462.M373, OkSU main 620.1122M4271, OSU TA462A1M322, SDSU TA462.M373, SIUC morris 53392-6203, UAr mullins TA462.M373, UCSD s&e TA1.M426, UK eng TA462.M373, }
1 item found as of 1/30/2011
v29#4

--------------------------------------------------------
Materials Research Bulletin
{ https://www.sciencedirect.com/journal/materials-research-bulletin/issues CSULB online, OSU online, SMU online, UC online, UK online (pay) & eng TA404.2.M36, UL robotic TA404.2.M36, UM online, USC online, UT online, UTAr online, UTD online, VU online, }
1 item found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

(new reference 12/5/2020)
Druzhinin, A., I. OstrovskiiK. Rogacki Peculiarities of magnetoresistance in InSb whiskers at cryogenic temperatures Materials Research Bulletin Volume 72, December 2015, pp. 324-330 https://doi.org/10.1016/j.materresbull.2015.08.016

Guo, Bingfeng, Anil KunwarHaitao Ma Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints Materials Research Bulletin Volume 99, March 2018, pp. 239-248 https://doi.org/10.1016/j.materresbull.2017.11.022

Li, Yuan, Ryo MatsuuraMasumi Saka Controlling surface morphology of Sn thin-film to enhance cycling performance in lithium ion batteries Materials Research Bulletin Volume 87, March 2017, pp. 155-160 https://doi.org/10.1016/j.materresbull.2016.11.041

--------------------------------------------------------
(new source 9/4/2020)
Materials Research Express
{ https://iopscience.iop.org/journal/2053-1591 UK online, }
2 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 9/6/2020

searched for zinc whisker(s) & Zn whisker(s) on 9/6/2020
searched for indium whisker(s) on 9/6/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/6/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/6/2020

--------------------------------------------------------
Materials Research Society Spring Meeting
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Materials Research Society Symposium Proceedings
Materials Research Society Symposia Proceedings
{ AU rbd various, FAU wimberly TK7874.A332, FSU dirac various, GIT online & main-5e various, MIT online, MST wilson various, OkSU main 621.381046A244, OSU book TA418.6.B42, SDSU various, SIUC morris various, TTU various, UAB sterne various, UAH salmon various, UAr mullins verious, UC eng TA401.3.C637, UCF main various, UCSD online, UF sci various, UH TK7801.15.E44, UM various, UMe mcwherter various, UMi richter TK7874.A332USF various, UT various, UTo various, WSU various, }
19 items found as of 1/30/2011
#986 checked 10/16/2010

--------------------------------------------------------
Materials Science and Engineering
{ https://www.sciencedirect.com/journal/materials-science-and-engineering/issues CSULB TA401.M384, OSU sel TA401.M34, SMU online, UC online, UD roesch, UK online & eng TA401.M384, UL robotic TA401.M383, UM online, UPi storage, UT online, UTAr depos TA401.M384, UTD online, VU online, }
18 items found as of 8/8/2021 catalog
v19#1-v26#2(76) checked 8/81/2021 (last issue was volume 100, April 1988)
*** here for internet 8/8/2021 *** searched for tin whisker(s) and Sn whisker(s) on 7/18/2020

searched for zinc whisker(s) and Zn whisker(s) on 9/16/2020
searched for indium whisker(s) on 9/16/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/16/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/16/2020

--------------------------------------------------------
Materials Science and Engineering: A, Structural Materials
{ https://www.sciencedirect.com/journal/materials-science-and-engineering-a/issues EBSCOA, AU online, CSULB TA401.M3842, MST wilson TA401.M3612, OkSU online, OSU sel TA401.M34, SIUC online, SMU online, TTU, UAB sterne TA401.M384, UAr mullins TA401.M384, UCF online, UCSD online, UK online sd (pay) & eng TA401.M382, UM online, UT online & hodges TA401.M38, UTD online, }
>=20 items found as of 8/6/2021 catalog
v419#1-v823(21) checked 8/6/2021
(new reference 8/6/2021)
," Materials Science and Engineering: A, Structural Materials, vol. 823, pp. , Aug. 2021.

Hirata, Yuki; Yang, Chih-han; Lin, Shih-kang; Nishikawa, Hiroshi. Improvements in mechanical properties of Sn–Bi alloys with addition of Zn and In. ," Materials Science and Engineering: A, Structural Materials, vol. 813, pp. , May 2021. DOI: 10.1016/j.msea.2021.141131

Yin, Limeng; Zhang, Zhongwen; Su, Zilong; Zhang, Hehe; Zuo, Cunguo; Yao, Zongxiang; Wang, Gang; Zhang, Long; Zhang, Yupeng Interfacial microstructure evolution and properties of Sn-0.3Ag-0.7Cu–xSiC solder joints. ," Materials Science and Engineering: A, Structural Materials, vol. 809, pp. , Mar. 2021. DOI 10.1016/j.msea.2021.140995

Duy Le Han, Yu-An Shen, Siliang He, Hiroshi Nishikawa Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy ," Materials Science and Engineering: A, Structural Materials, vol. 804, pp. 140785-1-140785-, Feb. 15, 2021. https://doi.org/10.1016/j.msea.2021.140785

Quan Zhou, Tae-Kyu Lee, Thomas R. Bieler In-situ characterization of solidification and microstructural evolution during interrupted thermal fatigue in SAC305 and SAC105 solder joints using high energy X-ray diffraction and post-mortem EBSD analysis ," Materials Science and Engineering: A, Structural Materials, vol. 802, pp. 140584-1-140584-, Jan. 20, 2021. https://doi.org/10.1016/j.msea.2020.140584

(not at UK) searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

(new reference 12/5/2020)
Shiori Gondo, Rena Tanemura, Ryuki Mitsui, Satoshi Kajino, ... Shinsuke Suzuki Relationship between mesoscale structure and ductility of drawn high carbon steel wire ," Materials Science and Engineering: A, Structural Materials, vol. 800, pp. 140283-1-140283-, Jan. 7, 2021. https://doi.org/10.1016/j.msea.2020.140283

F. Khodabakhshi, M. Zareghomsheh, G. Khatibi Nanoindentation creep properties of lead-free nanocomposite solders reinforced by modified carbon nanotubes ," Materials Science and Engineering: A, Structural Materials, vol. 797, pp. 140203-1-140203-, Oct. 21, 2020. https://doi.org/10.1016/j.msea.2020.140203

Hanchen Feng, Feng Fang, Xuefeng Zhou, Xiaodan Zhang, ... Jianqing Jiang Heavily cold drawn iron wires: Role of nano-lamellae in enhancing the tensile strength ," Materials Science and Engineering: A, Structural Materials, vol. 796, pp. 140017-1-140017-, Oct. 7, 2020. https://doi.org/10.1016/j.msea.2020.140017

Hui Cao, Zhiyuan Rui, Fuqian Yang Mechanical properties of Cu nanowires: Effects of cross-sectional area and temperature ," Materials Science and Engineering: A, Structural Materials, vol. 791, pp. 139644-1-139644-, July 22, 2020. https://doi.org/10.1016/j.msea.2020.139644

Sanjay Tikale, K. Narayan Prabhu Development of low-silver content SAC0307 solder alloy with Al2O3 nanoparticles ," Materials Science and Engineering: A, Structural Materials, vol. 787, pp. 139439-1-139439-, June 10, 2020. https://doi.org/10.1016/j.msea.2020.139439

Sarvesha, R., Aditya GokhaleSudhanshu S. Singh Effect of crystal orientation on indentation-induced deformation behavior of zinc ," Materials Science and Engineering: A, Structural Materials, vol. Volume 776, 3 March 2020, 139064 https://doi.org/10.1016/j.msea.2020.139064

--------------------------------------------------------
Materials Science and Engineering B: Solid-State Materials for Advanced Technology
{ https://www.sciencedirect.com/journal/materials-science-and-engineering-b/issues EBSCOA, MST online, NWU online & sci L620.105M4251b, OkSU online, OSU online & sel TA401.M342, PU hicks 620.105M419b, SIUC morris 56989-6201, TTU, UAr mullins TA401.M3842, UC online & eng TA401.M3944, UCSD online, UIC online & daley TA401.M386, UK online sd (pay), UL online & kersey TA401.M3833, UM online, UT online & hodges TA401.M342, }
>=20 items found as of 8/6/2021
v148#1-3,v164#3,v223 checked 8/6/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

(new reference 12/5/2020)
Boussaha, R., H. FitouriA. Rebey In situ monitoring of InAsBi alloy grown under alternated bismuth flows by metalorganic vapor phase epitaxy Materials Science and Engineering: B Volume 241, February 2019, pp. 22-26 https://doi.org/10.1016/j.mseb.2019.02.006

Skwarek, Agata, Mariusz PluskaKrzysztof Witek Influence of laminate type on tin whisker growth in tin-rich lead-free solder alloys ," Materials Science and Engineering: B, vol. Volume 177, Issue 15, 1 September 2012, pp. 1286-1291 https://doi.org/10.1016/j.mseb.2012.03.039

Tsukamoto, H., T. NishimuraK. Nogita Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates ," Materials Science and Engineering: B, vol. Volume 171, Issues 1–3, 25 July 2010, pp. 162-171 https://doi.org/10.1016/j.mseb.2010.03.092

--------------------------------------------------------
Materials Science and Engineering C
{ https://www.sciencedirect.com/journal/materials-science-and-engineering-c/issues EBSCOA, MST online, NWU online & sci L620.1105M4254, OkSU online, OSU online & sel TA401M343, PU hicks 620.105M419c, TTU, UC online & eng TA401.M3862, UCSD online, UIC online, UK online sd, UL online & kersey TA401.M3834, UM online, UT online & hodges TA401.M343, }
item found as of 8/6/2021

--------------------------------------------------------
Materials Science and Engineering R: Reports
{ https://www.sciencedirect.com/journal/materials-science-and-engineering-r-reports/issues EBSCOA, CSULB online, MSU online, OSU online, UC online, UK online & eng TA401.M3846, UL robotic TA401.M3846, UM online, USC grand, UT online, UTD online, VU online, }
5 items found as of 8/6/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

(new reference 12/5/2020)
Tu, K. N., Yingxia Liu Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology Materials Science and Engineering: R: Reports Volume 136, April 2019, pp. 1-12 https://doi.org/10.1016/j.mser.2018.09.002

Zhang, Liang, K. N. Tu Structure and properties of lead-free solders bearing micro and nano particles ," Materials Science and Engineering: R: Reports, vol. Volume 82, August 2014, pp. 1-32 https://doi.org/10.1016/j.mser.2014.06.001

--------------------------------------------------------
Materials Science & Technology
{ https://www.tandfonline.com/loi/ymst20 EBSCOA, AU rbd TS200.M4742, CBU online, MST online, NWU online & sci 669.05M58a, OkSU stillwater 669.05M425, OSU sel TA401.M34, PU online, SDSU online, SIUC online, UAB online & sterne TA459.M42, UAH online, UAr online, UC eng TA459.M42, UCSD online, UK online (pay), UL kersey TA401.M383, UM online, USD online, UT online & hodges TN1.M492, }
>=20 items found as of 8/6/2021
v1#1-v37#6(21) all issues checked 8/6/2021
searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

--------------------------------------------------------
Materials Science Forum
{ https://www.scientific.net/MSF ISU online, MST wilson TA401.M29, NWU sci 620.112M4255, OSU sel various, UAr verious, UC online & various, UCSD online, UIC daley TA401.3.M3793, UK eng TA401.3.M3793, UM online & various, UMe mcwherter, UMi richter various, UNCC TA418.9.N35I57, UNL eng TA401.3.P33, UT hodges TA401.3.M3793 & various, UTo carlson TA401.3.M3793, WSU sci TN695.I593, }
>=20 items found as of 1/21/2021
v534-536,v539-545,v561-565,v575-578,v580-582,638-642,694 checked 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 10/11/2020

searched for zinc whisker(s) and Zn whisker(s) on 10/11/2020
searched for indium whisker(s) on 10/11/2020
searched for cadmium whisker(s) and Cd whisker(s) on 10/11/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 10/11/2020 searched for nanowire(s), mesowire(s), microwire(s) on 10/11/2020 Example: https://doi.org/10.4028/www.scientific.net/MSF.volume.page --------------------------------------------------------
Materials Science in Semiconductor Processing
{ https://www.sciencedirect.com/journal/materials-science-in-semiconductor-processing/issues AU online, CSULB online, FAU online, FIU online, FSU online, GIT online, LH closed, MST online, NWU online, OGI online, OkSU online, OrSU online, OSU online, PU online, RU online, RyU online, SDSU online, SMU online, UAr online, UCF online, UCI online, UCSD online, UDe online, UF online, UIUC online, UM online, UMC online, UMi online, UNCC online, UNF online, USC TK7871.85M36782, USF online, USU online, UT online, UTA online, UTAr online, UTD online, UTo online, UWa online, WrSU online, }
>=20 items found as of 8/8/2021 catalog
v9#1-v134(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

(new reference 12/5/2020)
," Materials Science in Semiconductor Processing, vol. 127, pp. , 2021.

Yan Sun, Lei Liu, Zhisheng Lv, Xingyue Zhangyang, ... Jian Tian Theoretical study on the improvement of optoelectronic properties of Al_xGa_(1-x) As nanowires with variable Al content adsorbed by metal nanoparticles ," Materials Science in Semiconductor Processing, vol. 125, pp. 105630-1-105630-, Apr. 2021. https://doi.org/10.1016/j.mssp.2020.105630

Burcu Arpapay, Ugur Serincan Convex-like GaAs nanowires grown on Si (111) substrates ," Materials Science in Semiconductor Processing, vol. 107, pp. 104817-1-104817-, Mar. 2020. https://doi.org/10.1016/j.mssp.2019.104817

Nafis Ahmed, P. Ramasamy, P. Balaji Bhargav, Arokiyadoss Rayerfrancis, Balaji Chandra Development of silicon nanowires with optimized characteristics and fabrication of radial junction solar cells with < 100?nm amorphous silicon absorber layer Article ," Materials Science in Semiconductor Processing, vol. 106, pp. 104778-1-104778-, Feb. 2020. https://doi.org/10.1016/j.mssp.2019.104778

Sanchar Acharya, Binita Tongbram, Indradev S. Samajdar, Anil Kottantharayil What causes Poole-Frenkel transport in VLS grown silicon nanowires? ," Materials Science in Semiconductor Processing, vol. 105, pp. 104749-1-104749-, Jan. 2020. https://doi.org/10.1016/j.mssp.2019.104749

Le Thanh Cong, Nguyen Thi Ngoc Lam, Nguyen Truong Giang, Pham The Kien, ... Ngo Ngoc Ha N-type silicon nanowires prepared by silver metal-assisted chemical etching: Fabrication and optical properties ," Materials Science in Semiconductor Processing, vol. 90, pp. 198-204, Feb. 2019. https://doi.org/10.1016/j.mssp.2018.10.026

Li, Bin, Gao Niu, Laixi Sun, Lu Yao, ... Yafei Zhang Design optimization and antireflection of silicon nanowire arrays fabricated by Au-assisted chemical etching pp. 1-8 ," Materials Science in Semiconductor Processing, vol. 82, pp. , Aug. 1, 2018. https://doi.org/10.1016/j.mssp.2018.03.026

dayeh, shadi a., renjie chenjoonseop sim progress in doping semiconductor nanowires during growth materials science in semiconductor processing volume 62, may 2017, pp. 135-155 https://doi.org/10.1016/j.mssp.2016.10.016

druzhinin, a., i. bolshakovan. liakh-kaguy low temperature magnetoresistance of insb whiskers materials science in semiconductor processing volume 40, december 2015, pp. 550-555 https://doi.org/10.1016/j.mssp.2015.07.030

Druzhinin, A. A., I. P. OstrovskiiIu. R. Kogut Strain effect on magnetoresistance of SiGe solid solution whiskers at low temperatures Materials Science in Semiconductor Processing Volume 14, Issue 1, March 2011, pp. 18-22 https://doi.org/10.1016/j.mssp.2010.12.012

druzhinin, a., i. ostrovskiir. koretskii strain-induced effects in p-type si whiskers at low temperatures materials science in semiconductor processing volume 40, december 2015, pp. 766-771 https://doi.org/10.1016/j.mssp.2015.07.015

Druzhinin, Anatolij, Igor OstrovskiiIurii Kogut Thermoelectric properties of Si–Ge whiskers Materials Science in Semiconductor Processing Volume 9, Issues 4–5, August–October 2006, pp. 853-857 https://doi.org/10.1016/j.mssp.2006.08.070

Druzhinin, Anatolij, Igor OstrovskiiNatalia Liakh Study of piezoresistance in GexSi1-x whiskers for sensor application Materials Science in Semiconductor Processing Volume 8, Issues 1–3, February–June 2005, pp. 193-196 https://doi.org/10.1016/j.mssp.2004.09.038

Fasoli, A., W. I. Milne Overview and status of bottom-up silicon nanowire electronics Materials Science in Semiconductor Processing Volume 15, Issue 6, December 2012, pp. 601-614 https://doi.org/10.1016/j.mssp.2012.05.010

Kim, Jong Su, x Ga-migration on a Ga-rich and As-stabilized surfaces: Ga-droplet and GaAs- nanostructure formation Materials Science in Semiconductor Processing Volume 57, January 2017, pp. 70-76 https://doi.org/10.1016/j.mssp.2016.10.003

Shah, Sayyar A., Shen Cui Preparation of silicon nanomaterials by arc discharge Materials Science in Semiconductor Processing Volume 40, December 2015, pp. 491-500 https://doi.org/10.1016/j.mssp.2015.06.037

Ridder, C, M FanciulliG Weyer Precipitation of Sn in metastable, pseudomorphic Si0.95Sn0.05 films grown by molecular beam epitaxy Materials Science in Semiconductor Processing Volume 3, Issue 4, 1 August 2000, pp. 251-255 https://doi.org/10.1016/S1369-8001(00)00040-8

Synkiewicz, Beata, Agata SkwarekKrzysztof Witek Vapour phase soldering used for quality improvement of semiconductor thermogenerators (TEGs) assembly Materials Science in Semiconductor Processing Volume 38, October 2015, pp. 346-351 https://doi.org/10.1016/j.mssp.2014.12.004

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Materials Science Research International
{ LH closed, USC TA401.M38464, }
1 item found as of 1/30/2011

--------------------------------------------------------
Materials Technology
{ Materials Technology OSU online, UC online, UM online, UT hodges TA401.M25, }
2 items found as of 1/30/2011
v22#3 checked 3/9/2009

--------------------------------------------------------
Materials, Technology and Reliability of Advanced Interconnects
{ CMU eng TK7871.85.M3454, FSU dirac TK7871.85.M36783, PU eng 621.38152M41895, SDSU TK7871.85.M384, UAr mullins TK7871.85.M3454, UC eng TK7871.85.M3454, UCSD s&e TK7871.85.M35 & TK7871.85.M369 & TK7871.85.M3692, UM online, UMi richter TK7871.85.M3454, UOk eng TK7871.85.M3454, UPi online, USC online, UTAr sel TK7871.85.M345, UTor eng TK7871.85.M36783, UWa davis TK7871.85.M3454x, }
4 items found as of 7/2/2017 catalog
00-01,03-05 checked 7/2/2017

--------------------------------------------------------
Materials Transactions
Materials Transactions, JIM
{ https://www.jim.or.jp/journal/e/ CMU eng, CSULB online, FIU online, LH closed, NWU sci 669.06J35t, OkSU main 669.06N719tb, OSU sel TN4.N53, PU eng 669.06J27t & hicks 669.06J27t, RU fondren TN4.N52, SIUC morris 52963-6693, UC eng TN4.N5, UCI sci TN4.N5, UCSD s&e TN1.N7, UM online, UMe online & mcwherter, UOk bizzell TN4.N5, USC TN4.N5, UT hodges TS300.N56, UTor eng TN4.N462 & TN4 .N4622, WSU online & sci, }
>=20 items found as of 8/4/2018 catalog
v30#1-v59#8 checked 8/4/2018

--------------------------------------------------------
Materials World
Materials world the journal of the Institute of Materials
{ https://www.tandfonline.com/loi/ymaw20 BYU hbll TP785.B863x, FIT online, FSU online, GIT main TN1.M3737, LH closed, MST online, NWU online, OkSU stillwater 669.05M4255, OSU online, PU eng 620.1005M4184 & eng 669.05M5766, SDSU online, SIUC online, SU online, TTU, UCI online, UCSD online, UDe online, UIUC eng Q.620.1105MAT, UK remote TN1.M51543 & TN1.M3737, UM online, UMC online, UNF online, UOk online, UPi storage, USD online, USF online, UT hodges TN1.M3737, UTA online, WrSU online, }
15 items found as of 8/9/2021 catalog
v1#1-v24#3(16) all issues checked 8/9/2021

--------------------------------------------------------
Materialwissenschaft und Werkstofftechnik
{ https://onlinelibrary.wiley.com/loi/15214052 FAU online, MST online, OkSU online, OSU online, SDSU online, SIUC online, SMU online, UAr online, UC online & sw depos TA401.Z38, UCSD online, UD online, UK online, UL online wiley, UM online, UMi online, UOk online, UPi online, USC TA401.Z38, USD online, UT online, UTD online, }
6 items found as of 8/11/2021 catalog
v39#1-v52#7(21) checked 8/11/2021
searched for tin whisker(s) and Sn whisker(s) on 12/19/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/19/2020
searched for indium whisker(s) on 12/19/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/19/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/19/2020

--------------------------------------------------------
Maxim Engineering Journal
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Measurement and Control
{ https://journals.sagepub.com/loi/maca GIT storage TJ212.M37 & main-5e TA165.M4X, LH closed, LU gray TJ1313.I9, NWU sci L620.7805M484, OkSU main 629.805M4843, OSU sel TJ212.M4, PU hicks 629.805M463, SIUC morris 51555-6812, SMU sci, UCI sci drum TJ212M372, UCSD s&e TK1.M484, UIUC eng 629.805ME, UK online, UM online & buhr TA165.A1M48, UMe mcwherter, USC sel, UTA online, WrSU online, }
1 item found as of 1/21/2021 catalog

(new reference 12/30/2008)
Wade, Martin .Recycling Waste Electrical and Electronic Equipment Measurement and Control, v 38, n 7, September, 2005, p 212

--------------------------------------------------------
Measurement Science and Technology
{ https://iopscience.iop.org/journal/0957-0233 CSULA north QC39.M397, CSULB online, MSU online, OSU online, UC online, UD online, UK online & remote QC39.M4250, UL online, UM online, USC online, UT online, UTAr online, UTD online, VU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Mechanics of Advanced Materials and Structures
{ https://www.tandfonline.com/loi/umcm20 EBSCOA, AU online, FIT online, GIT online & main-5e TA418.9.C6M42, IU online, LH closed, MST online, NWU online, OGI online, OkSU online, OrSU online, OSU online, PU online, SDSU online, SIUC online, SU online, UAH online, UAr online, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UIUC online, UK online, UM online, UMC online, UOk online, USD online, USF online, USU online, UT online, UTo online, WrSU online, }
2 items found as of 8/6/2021
v14#1-v28#16(21) checked 8/6/2021
searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

--------------------------------------------------------
Mechanics of Materials
{ https://www.sciencedirect.com/journal/mechanics-of-materials/issues AU online, FAU online, FIU online, FSU online, GIT online & main-5e TA409.M424X, LH closed, NWU online, OkSU online, PU online, UC online, UCF online, UCI online, UCSD online, UD online, UDe online, UIC online, UK online (pay), UM online, UMi online, UNCC online, USF online, UTA online, UWa online, }
5 items found as of 8/8/2021
v1#1-v160(21) all issues checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

(new reference 4/20/2021)
," Mechanics of Materials, vol. 157, pp. , June 2021.

M. W. Xie, G. Chen, J. Yang, and W. L. Xu "Temperature- and rate-dependent deformation behaviors of SAC305 solder using crystal plasticity model," Mechanics of Materials, vol. 157, pp. 103834-1-103834-, June 2021. https://doi.org/10.1016/j.mechmat.2021.103834

Ho, Duc Tam, Soon KimSung Youb Kim Ideal strength of nanoscale materials induced by elastic instability Mechanics of Materials Volume 141, January 2020, 103241 https://doi.org/10.1016/j.mechmat.2019.103241

Erinc, M., P. J. G. SchreursM. G. D. Geers Intergranular thermal fatigue damage evolution in SnAgCu lead-free solder Mechanics of Materials Volume 40, Issue 10, October 2008, pp. 780-791 https://doi.org/10.1016/j.mechmat.2008.04.005

--------------------------------------------------------
Medical Device & Diagnostic Industry
{ https://www.mddionline.com/ RyU online, SDSU online, USC HD9994.M42, UTAr online, }
11 items found as of 1/30/2011 catalog
v30#7-v32#3 checked 10/8/2010

(new reference 12/23/2013)
Kimmel "Protecting Medical Devices from Electrostatic Discharge" May 1994 p 196

--------------------------------------------------------
Medical Electronics Design
1 item found as of 1/4/2014 catalog
v2#1-v2#2,v2#4 checked 1/4/2014

--------------------------------------------------------
Medical Electronics Manufacturing
{ FIU online, SDSU online, USC, }
3 items found as of 1/30/2011 catalog
Fall09-Spring10 checked 10/8/2010

--------------------------------------------------------
2008 Medical Electronics Symposium
2006 Medical Electronics Symposium Conference Proceedings
{ http://www.smta.org/knowledge/knowledge.cfm, }
>=20 items found as of 11/26/2020
04-15 checked 11/26/2020

--------------------------------------------------------
Medical Physics
{ http://aapm.onlinelibrary.wiley.com/hub/journal/10.1002/(ISSN)2473-4209/ UD online, }
1 item found as of 5/26/2017

(new reference 10/14/2020)
J.Borg, D.W.O. Rogers, Spectra and air-kermastrength for encapsulated 192Ir sources, Med. Physics 26, 2441 (1999)

--------------------------------------------------------
Medical Product Manufacturing News
{ FIU online, SDSU online, UPi online, USC R856.A1M4, }
4 items found as of 9/4/2015 catalog
mar97-dec09,jan15-apr15 checked 9/4/2015

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(new source 6/22/2020)
4th Meeting of TAPS
{ }
1 item found as of 6/22/2020

--------------------------------------------------------
Memoires de l'Academie de St. Petersbourg
M‚moires de l'Acad‚mie imp‚riale des sciences de St.-P‚tersbourg
Zapiski Imperatorskoi Akadem
{ ISU storage Q7AK14M7, IU bloomington wells AS262.A3, MSU oversize K321.R8 NWU sci L520.6A313, OSU sel MICROFICHE3AS7, UC phys AS262.L443M, UCB pascal 506Ak13mser.7, UCSD rare oversize QL613.Z35, UM buhr various, UMi microfilm 7453, UPi online, VU annex 506.A312m, }
item found as of 1/30/2011 catalog

Fritzsche, J., Mem. Acad. St. Petersbourg (1), 7 nr. 5, pp. 15 (1870).

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Metal Finish
item found as of 1/30/2011 catalog

INDIRA KS;, UDUPA HVK SULFAMATE BATHS FOR LEAD AND LEAD ALLOY DEPOSITION Metal Finish, vol. 69 no. 1, Jan. 1971, pp. 94-101

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Metal Finishing
{ https://www.sciencedirect.com/journal/metal-finishing/issues BoU online, CMU eng, CSULA TS550.M581, CSULB online, Lexmark, NEU online & snell T1.M4900, OkSU online, OSU online & sel TS550M5, eng TK7870.M456, UCF online &, UC online & eng UCF online &, UC online & eng TS550.M4, UCSD online, UK eng TS213.B7 & king TS550.M3, UM online sd & buhr TS200.M5873, UMi online, UNCC online, USC grand, UT online & hodges TS550.M3, UTAr online, UTD online, UTor online, UWa online, VU online, }
>=20 items found as of 8/2/2021 catalog
v73#1-v111#6(13, ended publication) checked 8/2/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

(new reference 12/5/2020)
Pure tin electroplating process Metal Finishing Volume 100, Issues 11–12, November–December 2002, Page 96 https://doi.org/10.1016/S0026-0576(02)80972-2

Tin plating method Metal Finishing Volume 102, Issue 4, April 2004, Page 71 https://doi.org/10.1016/S0026-0576(04)90278-4

Whisker prevent technology Metal Finishing Volume 109, Issue 3, April–May 2011, Page 43 https://doi.org/10.1016/S0026-0576(11)80043-7

Baldwin, Phil C., x Final thoughts regarding pulse plating Metal Finishing Volume 96, Issue 7, July 1998, pp. 12, 14 https://doi.org/10.1016/S0026-0576(98)80022-6

Budman, Edward, Michael McCoy Tin-zinc plating Metal Finishing Volume 93, Issue 9, September 1995, pp. 10-11, 14-15 https://doi.org/10.1016/0026-0576(95)99497-X

Budman, Edward, Robert R. Sizelove Zinc alloy plating Metal Finishing Volume 97, Issue 1, Supplement 1, January 1999, pp. 338-345 https://doi.org/10.1016/S0026-0576(99)80036-1

Budman, Edward, Robert R. Sizelove Zinc alloy plating Metal Finishing Volume 98, Issue 1, January 2000, pp. 334-339 https://doi.org/10.1016/S0026-0576(00)80343-8

Budman, Edward, Robert R. Sizelove Zinc alloy plating Metal Finishing Volume 99, Supplement 1, January 2001, pp. 334-339 https://doi.org/10.1016/S0026-0576(01)85294-6

Budman, Edward, Robert R. Sizelove Zinc alloy plating Metal Finishing Volume 100, Supplement 1, January 2002, pp. 320-325 https://doi.org/10.1016/S0026-0576(02)82036-0

Doyle, Colleen, Neil BrownMeital Bardize Factors influencing the solderability of lead-free electrodeposits Metal Finishing Volume 100, Issue 1, January 2002, pp. 10-12, 14-17 https://doi.org/10.1016/S0026-0576(02)80003-4

Endicott, Duane W., x The challenge of a lead-free finish for semiconductor pins Metal Finishing Volume 95, Issue 1, January 1997, pp. 50, 52, 54 https://doi.org/10.1016/S0026-0576(97)81807-7

Hirsch, Stanley, Charles Rosenstein Tin, lead, and tin-lead plating Metal Finishing Volume 97, Issue 1, 1999, pp. 304-318 https://doi.org/10.1016/S0026-0576(00)83091-3

Hirsch, Stanley, Charles Rosenstein Tin, lead, and tin-lead plating Metal Finishing Volume 97, Issue 1, Supplement 1, January 1999, pp. 309-324 https://doi.org/10.1016/S0026-0576(99)80033-6

Hirsch, Stanley, Charles Rosenstein Tin, lead, and tin-lead plating Metal Finishing Volume 98, Issue 1, January 2000, pp. 304, 306-308, 310-312, 314-316, 318 https://doi.org/10.1016/S0026-0576(00)80340-2

Hirsch, Stanley, Charles Rosenstein Tin, lead, and tin-lead plating Metal Finishing Volume 99, Supplement 1, January 2001, pp. 305-319 https://doi.org/10.1016/S0026-0576(01)85291-0

Hirsch, Stanley, Charles Rosenstein Tin, lead, and tin-lead plating Metal Finishing Volume 100, Supplement 1, January 2002, pp. 291-306 https://doi.org/10.1016/S0026-0576(02)82033-5

Hirsch, Stanley, x Tin-lead, lead and tin plating Metal Finishing Volume 93, Issue 1, Supplement 1, January 1995, pp. 298, 300, 302-306, 308, 310-313 https://doi.org/10.1016/0026-0576(95)93379-G

Jordan, Manfred, x Lead-free tin alloys—laboratory curiosities or capable processes? Metal Finishing Volume 101, Issue 1, January 2003, pp. 8, 10-12, 14, 16 https://doi.org/10.1016/S0026-0576(03)80004-1

Kanegsberg, Barbara, Ed Kanegsberg The Right Surface Preparation for Electronic Components Metal Finishing Volume 111, Issue 1, January–February 2013, pp. 37-38 https://doi.org/10.1016/S0026-0576(13)70177-6

Larochelle, Michael, x Trends in connector plating Metal Finishing Volume 99, Issue 1, January 2001, pp. 10-14 https://doi.org/10.1016/S0026-0576(01)80526-2

Maltanava, H. M., O. N. VrublevskayaT. N. Vorobyova Electrochemical Deposition of Gold-Tin Alloy from Propyleneglycol Electrolyte Metal Finishing Volume 111, Issue 6, November–December 2013, pp. 28-34 https://doi.org/10.1016/S0026-0576(13)70282-4

Milad, George, Mario Orduz Surface finishes in a lead-free world: RoHS regulations force alternative formulations, processes Metal Finishing Volume 105, Issue 1, January 2007, pp. 25-28 https://doi.org/10.1016/S0026-0576(07)80007-9

Mooney, Ted, x Zinc whiskers Metal Finishing Volume 93, Issue 10, October 1995, pp. 61-62 https://doi.org/10.1016/0026-0576(95)93858-3

Mooney, Ted, x Zinc whiskers again Metal Finishing Volume 94, Issue 9, September 1996, Page 68 https://doi.org/10.1016/S0026-0576(96)91346-X

Murphy, Michael, x Electrodeposited metals: Copper and copper alloys Metal Finishing Volume 93, Issue 2, February 1995, pp. 33-34 https://doi.org/10.1016/0026-0576(95)96060-0

Murphy, Michael, x Electrodeposited metals: Precious metals and their alloys Metal Finishing Volume 93, Issue 2, February 1995, pp. 36-37 https://doi.org/10.1016/0026-0576(95)96064-3

Murphy, x Electrodeposited metals: Tin and tin alloys Metal Finishing Volume 93, Issue 2, February 1995, pp. 34, 36 https://doi.org/10.1016/0026-0576(95)96062-7

Murphy, Michael, x Electrodeposited metals: Zinc and zinc alloys Metal Finishing Volume 93, Issue 2, February 1995, Page 36 https://doi.org/10.1016/0026-0576(95)96063-5

Schetty, Rob, Bill Sepp Implementation of Lead-Free Component Finishes in Mass Production: Acceptance test requirements must be diligently evaluated before any lead-free plating alternative is validated Metal Finishing Volume 104, Issue 10, October 2006, pp. 50-55 https://doi.org/10.1016/S0026-0576(06)80324-7

Vasantha, V. S., Malathy PushpavanamV. S. Muralidharan Tin deposition from a gluconate bath Metal Finishing Volume 93, Issue 10, October 1995, pp. 16, 18-20 https://doi.org/10.1016/0026-0576(96)80426-0

Walsh, Donald E., George MiladDonald Gudeczauskas Final finish: printed circuit boards Metal Finishing Volume 101, Issue 1, January 2003, pp. 25-26 https://doi.org/10.1016/S0026-0576(03)80006-5

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Metal Industry
{ MSU remote TS200.M35, NWU sci L671.05M5871, OSU depos TS550M52, PU eng 669.05M558 & hicks 669.05M558, UC sw depos TS550.M4, UK king TS550.M3, UM buhr TS200.M587, UT hodges closed TS550.M3, WSU sci & storage, }
--------------------------------------------------------
Metal Powder Report
{ https://www.sciencedirect.com/journal/metal-powder-report/issues CSULB online, OSU online, UC online, UK online, UM online, USC TN695.M43, UT online, VU online, }
1 item found as of 1/21/2021

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Metal Progress
{ MST wilson TS200.M36, OSU sel TS200A76, SDSU TS200.M36, SIUC morris 53451-6711, TTU, UAr mullins TS200.M36, UCSD s&e TS1.M587, UE, UK eng TS200.M36, UL kersey TS200.M36, UOk bizzell TS200.M36, UT hodges & storage TS200.M36, UTo carlson & storage, WSU sci & storage, }
2 items found as of 1/30/2011

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(new source 6/22/2020)
Metal Science
{ https://www.tandfonline.com/loi/ymst18 UK storage TN1.M567, }
1 item found as of 11/30/2020

--------------------------------------------------------
Metal Science and Heat Treatment
{ https://link.springer.com/journal/11041/volumes-and-issues MST online, OkSU online, SDSU online, SIUC online, UAr online, UC online & eng TN671.M4, UCSD online, UK online & eng TN4.M3213, UM online, USD online, UT online & hodges TN4.M4, }
1 item found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 7/19/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/13/2020
searched for indium whisker(s) on 8/13/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/13/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/8/2020

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Metal Science of Joining
{ }
3 items found as of 1/30/2011

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Metalloberflaeche
{ AU rbd TS200.M464, CMU eng, LH closed, UM buhr TS200.M5899, }
5 items found as of 1/30/2011 catalog

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Metallurgical Analysis
Yejin Fenxi
{ http://www.oriprobe.com/journals/yjfx.html LH closed, }
item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Zhang, Jia-Qi, Zhu, Zi-Ping, Wang, Jun-Xiang .Comparison of methods for stripping steel sheet coating and determining hexavalent chromium Yejin Fenxi/Metallurgical Analysis, v 28, n 2, February, 2008, p 59-62 Language: Chinese

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Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
{ https://link.springer.com/journal/11661/volumes-and-issues CPL, MST online, OkSU online, OSU sel TS200.M6192, PU eng 669.005M5641a, RyU online, SDSU online, SIUC morris 51829-6693, TTU online, UAr online, UC eng TN1.M481 pt.A, UCI online & sci TS300.M4, UCSD online, UD online, UH TN1.M531, UK online (pay) & eng TN689.M47, UL kersey TN689.M47, UM online, UNCC online, UOk online, USD online, UT hodges TS300.M475, UTor online, UWa online, VU online, }
>=20 items found as of 8/9/2021
v28#1-v52#9(21) checked 8/9/2021
searched for tin whisker(s) and Sn whisker(s) on 7/19/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/13/2020
searched for indium whisker(s) on 8/13/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/13/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 10/10/2020

--------------------------------------------------------
Metallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science
{ https://link.springer.com/journal/11663/volumes-and-issues CSULB TN1.M443, OSU depos TS200.M61932, UC online, UD online, UK online & eng TN689.M48, UM online, USC grand, UT online, VU online, }
1 item found as of 1/21/2021

searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

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Metallurgical Review of MMIJ
{ UU marriott TN1.M4725, }
item found as of 1/30/2011

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(new source 6/28/2020)
Metallurgical Transactions
{ }
(new reference 6/28/2020)
[osenbach3 32] F. A. Mohamed, K. L. Murty, and J. W. Morris, Jr., Metall. Trans. 4, 935 a1973b. --------------------------------------------------------
Metallurgical Transactions A
{ https://link.springer.com/journal/11661/volumes-and-issues CSULA north TN1.M515,CSULB online, OSU online, UC online, UK eng TN689.M47, UL robotic TN689.M47, UM online, USC grand, UT online, VU sci TN1.M514, }
18 items found as of 11/26/2020
searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

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Metals and Alloys
{ IU indianapolis, OkSU north_boomer 669.05M588, OSU sel TN1M582 & depos TN1M58 & TN1M582, PU hicks 669.05M556, SDSU compact TN1.M34, SIUE lovejoy, UAr mullins TN1.M34, UC sw depos TS200.M4, UCSD s&e TN1.M4253, UIC warehouse TN1.M35, UL kersey TN1.M34, UM buhr TN690.M587m, UT hodges microfilm TN1.M34, }
1 item found as of 1/30/2011

--------------------------------------------------------
Metals and Interconnects
1 item found as of 1/30/2011

--------------------------------------------------------
Metals and Materials
{ NWU sci 669.005M587 & 669.05M5876, OkSU main 669.05M58758, OSU depos TN1M507, PU hicks 669.06In7b & 669.005M563, SDSU TN1.M4, SIUC morris 54561-6691, UAr mullins TN1.M435, UC online & eng TN1.M482, UCSD s&e TN1.M5878, UD roesch, UIC warehouse TN1.M5756, UK eng TN1.M5756, UM online, UT hodges TN1.M483, }
1 item found as of 1/30/2011

dunn, b. d. vol. xx no. xx, pp. 34-38, mar. 1975. --------------------------------------------------------
Metals and Materials International
{ https://link.springer.com/journal/12540/volumes-and-issues }
1 item found as of 8/9/2021
v1#1-v27#8(21) all issues checked 8/9/2021
searched for tin whisker(s) and Sn whisker(s) on 11/26/2020
searched for zinc whisker(s) and Zn whisker(s) on 11/26/2020
searched for indium whisker(s) on 11/26/2020
searched for cadmium whisker(s) and Cd whisker(s) on 11/26/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 11/26/2020

(new reference 5/22/2021)
," Metals and Materials International, vol. 27 no. 7, pp. , 2021.

Hyun ParkSang-Hyeok KimHyo-Jong Lee Effect of Wire-Drawing Process Conditions on Secondary Recrystallization Behavior During Annealing in High-Purity Copper Wires ," Metals and Materials International, vol. 27 no. 7, pp. 2220-2229, July 2021. https://doi.org/10.1007/s12540-020-00682-0

S. Jayesh, Jacob Elias Experimental Investigation on the Effect of Ag Addition on Ternary Lead Free Solder Alloy –Sn–0.5Cu–3Bi ," Metals and Materials International, vol. 26 no. 1, pp. 107-114, Jan. 2020. https://doi.org/10.1007/s12540-019-00305-3

Ashutosh Sharma, Ashok K. Srivastava, Byungmin Ahn Impact of Non-Reactive Ceria Nanoparticles on the Wettability and Reaction Kinetics Between Lead-Free Sn–58Bi and Cu Pad ," Metals and Materials International, vol. 25 no. 4, pp. 1027-1038, July 2019. https://doi.org/10.1007/s12540-019-00250-1

Shengyan Shang, Anil Kunwar, Yunpeng Wang Effect of the \(\text {TiO}_2\) Nanoparticles on the Growth Behavior of Intermetallics in Sn/Cu Solder Joints ," Metals and Materials International, vol. 25 no. 2, pp. 499-507, Mar. 2019. https://doi.org/10.1007/s12540-018-0189-1

Shinwoong Joung, Wonjong Nam Effects of Alloying Elements, Si and Cr, on Aging and Delamination Behaviors in Cold-Drawn and Subsequently Annealed Hyper-eutectoid Steel Wires ," Metals and Materials International, vol. 25 no. 1, pp. 34-44, Jan. 2019. https://doi.org/10.1007/s12540-018-0153-0

Tuo Xin, Guiju Liu, Yiqian Wang Three Distinct Deformation Behaviors of Cementite Lamellae in a Cold-Drawn Pearlitic Wire ," Metals and Materials International, vol. 24 no. 4, pp. 840-844, July 2018. https://doi.org/10.1007/s12540-018-0101-z

Yu Tack Kim, Kwang-Bum Kim, Eo-Hyun Yoo Effect of electrode balance on performance degradation and gas emission in stacked-type electrochemical capacitors ," Metals and Materials International, vol. 21 no. 6, pp. 1123-1132, Nov. 2015. https://doi.org/10.1007/s12540-015-5474-7

Joong-Ki Hwang, Il-Heon Son, Nack J. Kim Effect of reduction of area on microstructure and mechanical properties of twinning-induced plasticity steel during wire drawing ," Metals and Materials International, vol. 21 no. 5, pp. 815-822, Sept. 2015. https://doi.org/10.1007/s12540-015-5273-1

N. Zhao, M. L. Huang, Z. J. Zhang Influence of rare earth Ce addition on the microstructure, properties and soldering reaction of pure Sn ," Metals and Materials International, vol. 20 no. 5, pp. 953-958, Sept. 2014. https://doi.org/10.1007/s12540-014-5021-y

Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung Effect of rare earth metal Ce addition to Sn-Ag solder on interfacial reactions with Cu substrate ," Metals and Materials International, vol. 20 no. 3, pp. 515-519, May 2014. https://doi.org/10.1007/s12540-014-3016-3

Seong-Hun Na, Mi-Ri Lee, Su-Jeong Suh Effect of a high-temperature pre-bake treatment on whisker formation under various thermal and humidity conditions for electrodeposited tin films on copper substrates ," Metals and Materials International, vol. 20 no. 2, pp. 367-373, Mar. 2014. https://doi.org/10.1007/s12540-014-2016-7

*** have *** Minoru Aoyagi, Takefumi Hiraguri, Yuuta Hishinuma Growth mechanisms for atypical forms of silicon nanowires ," Metals and Materials International, vol. 19 no. 1, pp. 87-92, Jan. 2013. https://doi.org/10.1007/s12540-013-1014-5

Jung Min Lee, Fan Xia, Won Il Park Growth of single crystal GaAs nanowires by a surface diffusion-mediated solid-liquid-solid process ," Metals and Materials International, vol. 18 no. 5, pp. 875-879, Oct. 2012. https://doi.org/10.1007/s12540-012-5020-9

K. B. Lee, J. H. Seo, H. R. Yang A simple route for the synthesis of copper nanowires ," Metals and Materials International, vol. 18 no. 4, pp. 727-730, Aug. 2012. https://doi.org/10.1007/s12540-012-4017-8

E. Cadirli, U. Boyuk, N. Marasli Effect of solidification parameters on the microstructure of directionally solidified Sn-Bi-Zn lead-free solder ," Metals and Materials International, vol. 18 no. 2, pp. 349-354, Apr. 2012. https://doi.org/10.1007/s12540-012-2021-7

Wengming Tang, Yang Hu, Shubin Huang Fabrication of Sn-Cu alloy solder by pulse electroplating on the metalized Si wafer ," Metals and Materials International, vol. 18 no. 1, pp. 177-183, Feb. 2012. https://doi.org/10.1007/s12540-012-0022-1

Fatma Meydaneri, Mehtap Payveren, Necmettin Marasli Experimental determination of interfacial energy for solid Zn solution in the Sn-Zn eutectic system ," Metals and Materials International, vol. 18 no. 1, pp. 95-104, Feb. 2012. https://doi.org/10.1007/s12540-012-0012-3

A-Mi Yu, Mok-Soon Kim, Jong-Hyun Lee Wetting and interfacial reaction characteristics of Sn-1.2Ag-0.5Cu-xIn quaternary solder alloys ," Metals and Materials International, vol. 17 no. 3, pp. 521-526, June 2011. https://doi.org/10.1007/s12540-011-0634-x

Young-Gon Lee, Jun-Gyu Park, Jae-Pil Jung Electrodeposition of the Sn-58 wt.%Bi layer for low-temperature soldering ," Metals and Materials International, vol. 17 no. 1, pp. 117-121, Feb. 2011. https://doi.org/10.1007/s12540-011-0216-y

Kee-Ahn Lee, Young-Min Jin, Mun-Chul Kim Continuous strip casting, microstructure and properties of Au-Sn soldering alloy ," Metals and Materials International, vol. 17 no. 1, pp. 7-14, Feb. 2011. https://doi.org/10.1007/s12540-011-0202-4

Sezen Aksoz, Yavuz Ocak, Necmettin Marasli Determination of thermo-electrical properties in Sn based alloys ," Metals and Materials International, vol. 16 no. 3, pp. 507-515, June 2010. https://doi.org/10.1007/s12540-010-0624-4

Jong-Woong Kim, Seung-Boo Jung Failure mechanism of Pb-bearing and Pb-free solder joints under high-speed shear loading ," Metals and Materials International, vol. 16 no. 1, pp. 7-12, Feb. 2010. https://doi.org/10.1007/s12540-010-0007-x

Eun-Ha Kim, Byeong-Joo Lee Size dependency of melting point of crystalline nano particles and nano wires: A thermodynamic modeling ," Metals and Materials International, vol. 15 no. 4, pp. 531-537, Aug. 2009. https://doi.org/10.1007/s12540-009-0531-8

Bo-Mook Chung, Kyoung-Kook Hong, Joo-Youl Huh Decomposition of Cu6Sn5 particles in solder for the growth of a ternary (Cu1-xNix)6Sn5 layer on a Ni substrate ," Metals and Materials International, vol. 15 no. 3, pp. 487-492, June 2009. https://doi.org/10.1007/s12540-009-0487-8

Seunghyun Cho, Jinwon Choi, Hangoo Kim Study on the behavior characteristics of solder balls for FCBGA package ," Metals and Materials International, vol. 15 no. 2, pp. 299-1-299-, Apr. 2009. https://doi.org/10.1007/s12540-009-0299-x

Minsung Jeon, Koichi Kamisako Synthesis of Au-catalyzed silicon nanowires by hydrogen radical-assisted deposition method ," Metals and Materials International, vol. 15 no. 1, pp. 83-1-83-, Feb. 2009. https://doi.org/10.1007/s12540-009-0083-y

Jong-Hyun Lee, A-Mi Yu, Namhyun Kang Reaction properties and interfacial intermetallics for Sn-xAg-0.5Cu solders as a function of Ag content ," Metals and Materials International, vol. 14 no. 5, pp. 649-654, Oct. 2008. https://doi.org/10.3365/met.mat.2008.10.649

Han-Kyu Seong, Myeong-Ha Kim, Jae-Gwan Park Electrochemical characteristics of single crystalline nanowires and their driven mechanism ," Metals and Materials International, vol. 14 no. 4, pp. 477-1-477-, Aug. 2008. https://doi.org/10.3365/met.mat.2008.08.477

Jong-Woong Kim, Young-Chul Lee, Seung-Boo Jung Effect of bonding conditions on conduction behavior of anisotropic conductive film interconnection ," Metals and Materials International, vol. 14 no. 3, pp. 373-379, June 2008. https://doi.org/10.3365/met.mat.2008.06.373

D. B. Park, J. W. Lee, W. J. Nam Effects of the annealing temperature and time on the microstructural evolution and corresponding the mechanical properties of cold-drawn steel wires ," Metals and Materials International, vol. 14 no. 1, pp. 59-1-59-, Feb. 2008. https://doi.org/10.3365/met.mat.2008.02.059

A-Mi Yu, Chang-Woo Lee, Jong-Hyun Lee The effect of the addition of in on the reaction and mechanical properties of Sn-1.0Ag-0.5Cu solder alloy ," Metals and Materials International, vol. 13 no. 6, pp. 517-1-517-, Dec. 2007. https://doi.org/10.1007/BF03027912

J. M. Atienza, M. Elices, A. Valiente Residual stresses and durability in cold drawn eutectoid steel wires ," Metals and Materials International, vol. 13 no. 2, pp. 139-143, Apr. 2007. https://doi.org/10.1007/BF03027564

Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung Mechanical strength test method for solder ball joint in BGA package ," Metals and Materials International, vol. 11 no. 2, pp. 121-1-121-, Apr. 2005. https://doi.org/10.1007/BF03027455

Jong-Hyun Lee, Dong-Hyuk Shin, Yong-Seog Kim Dissolution of Cu into Sn-based solders during reflow soldering ," Metals and Materials International, vol. 9 no. 6, pp. 577-581, Dec. 2003. https://doi.org/10.1007/BF03027258

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Metalurgija
{ AU online, FIT online, FSU online, IU online, LH closed, MST online, NWU online, OGI online, OkSU online, OrSU online, SDSU online, SIUC online, SU online, UDe online, UF online, UIC online, UIUC oak Q.669.05MEG, UK online, UMC online, UTo online, WrSU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Metaux et Corrosion
{ LH closed, PU hicks 669.05M5605 MWU sci L620.1122M587, UK eng TN1.M480, UM buhr TS200.M63, WSU storage, }
1 item found as of 1/30/2011

--------------------------------------------------------
MICRO
{ OkSU online, SDSU online, SIUE lovejoy, UAr mullins QA76.5.M52153, UCSD ssh annex QA75.5.M5, }
4 items found as of 8/2/2021
Jan1997-July2006 (ended publication) checked 8/2/2021

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2001 Microelectromechanical Systems Conference
{ IEEE XPLORE (01), }
item found as of 8/3/2021
01 checked 8/3/2021

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Microelectronic Engineering
{ https://www.sciencedirect.com/journal/microelectronic-engineering/issues CSULB online, FAU online, FIU online, OkSU online, OSU online, PU online & eng 621.38413405M583, RyU online, SDSU online, SMU online, UC online & eng TK7871.85.M5, UCI online & sci TK7871.85M527, UCSD online, UK online (pay), UM online, UMi online, UNCC online, UOk online, UPi online, USC TK7871.85.M516, UT online, UTAr online, UTD online, UTo online, UTor online, UWa online, }
>=20 items found as of 8/8/2021 catalog
v60#1-v246(21) checked 8/8/2021
(new reference 12/5/2020)

esfahani, m. nasr, mustafa yilmazb. erdem alaca monolithic technology for silicon nanowires in high-topography architectures microelectronic engineering volumes 183–184, 5 november 2017, pp. 42-47 https://doi.org/10.1016/j.mee.2017.10.001

Gutmannsbauer, W., H. J. HugE. Meyer Scanning probe microscopy for nanometer inspections and industrial applications Microelectronic Engineering Volume 32, Issues 1–4, September 1996, pp. 389-409 https://doi.org/10.1016/0167-9317(95)00371-1

Kalem, S., P. WernerU. Södervall Microscopic Si whiskers Microelectronic Engineering Volume 88, Issue 8, August 2011, pp. 2593-2596 https://doi.org/10.1016/j.mee.2011.02.072

Niu, Junjie, Jian ShaDeren Yang Crystallization and disappearance of defects of the annealed silicon nanowires Microelectronic Engineering Volume 66, Issues 1–4, April 2003, pp. 65-69 https://doi.org/10.1016/S0167-9317(03)00026-1

sharma, ashutosh, siddhartha daskarabi das effect of different electrolytes on the microstructure, corrosion and whisker growth of pulse plated tin coatings microelectronic engineering volume 170, 25 february 2017, pp. 59-68 https://doi.org/10.1016/j.mee.2016.12.029

Vakanas, George, O. MinhoEric Beyne Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects Microelectronic Engineering Volume 140, 1 June 2015, pp. 72-80 https://doi.org/10.1016/j.mee.2015.04.116

Zhao, Qinghua, Zhuo ChenMing Li Formation of SnAg solder bump by multilayer electroplating Microelectronic Engineering Volume 106, June 2013, pp. 33-37 https://doi.org/10.1016/j.mee.2013.01.055

Di Maio, D., C. Hunt On the absence of the ß to a Sn allotropic transformation in solder joints made from paste and metal powder Microelectronic Engineering Volume 88, Issue 1, January 2011, pp. 117-120 https://doi.org/10.1016/j.mee.2010.09.011

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Microelectronics International
{ https://www.emerald.com/insight/publication/issn/1356-5362 MST online, NWU online, OkSU online, OSU online, RyU online, SDSU online, UAr online, UC online, UIC online, UK online, UM online, UNCC online, UOk online, UT online, UTor online, UWa online, }
>=20 items found as of 8/8/2021
v1#1-v38#1(21) all issues checked 8/8/2021

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Microelectronics Journal
{ https://www.sciencedirect.com/journal/microelectronics-journal/issues IU online, MST online, OkSU online, OSU online, PU online & eng 621.381705M584, SDSU online, UAr online, UC online & eng TK7874.M476, UCSD online, UIC online, UK online sd (pay), UL online & kersey TK7874.M476, UM online, UOk online, UT online, }
12 items found as of 8/8/2021
v31#1-v114(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

(new reference 12/5/2020)
Hanreich, G, J NicolicsG Stangl Investigation of the thermal performance of micro-whisker structured silicon heat spreaders for power devices Microelectronics Journal Volume 31, Issues 11–12, December 2000, pp. 969-973 https://doi.org/10.1016/S0026-2692(00)00095-1

Klimovskaya, A. I., Free-standing submicrometre filament crystals of Si and GexSi1 - x Microelectronics Journal Volume 28, Issue 1, January 1997, pp. 13-22 https://doi.org/10.1016/S0026-2692(96)00008-0

Richards, B. P., P. K. Footner Failure analysis in semiconductor devices – rationale, methodology and practice Microelectronics Journal Volume 15, Issue 1, January–February 1984, pp. 5-25 https://doi.org/10.1016/S0026-2692(84)80003-8

Anjard, Ronald P., x Solder pastes for microelectronics Microelectronics Journal Volume 15, Issue 2, March–April 1984, pp. 53-64 https://doi.org/10.1016/S0026-2692(84)80034-8

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Microelectronics News
{ SDSU online, }
>=20 items found as of 1/30/2011 catalog
#16-#24 checked 4/3/2009

*** search for whiskers and tin pest *** --------------------------------------------------------
Microelectronics Reliability
Microelectronics and Reliability
{ https://www.sciencedirect.com/journal/microelectronics-reliability/issues AU online & rbd TK7870.M456, CSULB online, FAU wimberly TK7870.M456, FIU online, MST depos 621.381El25m, NWU sci L621.3805E3852, OkSU online, OSU online, PU online & eng online, RyU online, SDSU online, SIUC online, SMU online, UAB online, UC online & eng TK7870.M456, UCF online & main TK7870.M456, UCSD online, UIC online &, UIC warehouse TK7870.M456, UK king TK7870.M456, UM online, UMi online, UNCC online, UOk online, UPi storage, USC TK7870.M456, UT online & hodges TK7800.E54, UTAr online, UTD online, UTor online, UWa online, VU online, WSU online, }
>=20 items found as of 8/8/2021 catalog
v30#1(90)-v123(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

(new reference 4/20/2021)
," Microelectronics Reliability, vol. 122, pp. , July 2021.

Karsten Meier, Maximilian Ochmann, David Leslie, Abhijit Dasgupta, Karlheinz Bock The effect of low temperature conditions on vibration durability of SAC105 interconnects ," Microelectronics Reliability, vol. 122, pp. 114160-1-114160-, July 2021. https://doi.org/10.1016/j.microrel.2021.114160

Mazullah, Muhammad Sadiq, Maaz Khan, Abdul Mateen, ... Jawad Khan Thermal aging impact on microstructure, creep and corrosion behavior of lead-free solder alloy (SAC387) use in electronics ," Microelectronics Reliability, vol. 122, pp. 114180-1-114180-, July 2021. https://doi.org/10.1016/j.microrel.2021.114180

M. Kuczynska, Y. Maniar, U. Becker, S. Weihe Effect of shear and tensile-dominant cyclic loading on failure in SnAgCu solder ," Microelectronics Reliability, vol. 120, pp. 114101-1-114101-, May 2021. https://doi.org/10.1016/j.microrel.2021.114101

Shuai Zhang, Hongyun Zhao, Hongbo Xu, Xing Fu Accelerative reliability tests for Sn3.0Ag0.5Cu solder joints under thermal cycling coupling with current stressing ," Microelectronics Reliability, vol. 120, pp. 114094-1-114094-, May 2021. https://doi.org/10.1016/j.microrel.2021.114094

Willem D. van Driel, J. W. Bikker, and M. Tijink, x "Prediction of software reliability," Microelectronics Reliability , vol. 119, pp. 114074-1-114074-, Apr. 2021. https://doi.org/10.1016/j.microrel.2021.114074

Hung-Chun Yang, and Tz-Cheng Chiu, x "A unified viscoplastic model for characterizing the softening behavior of the Sn3.0Ag0.5Cu solder under monotonic and cyclic loading conditions," Microelectronics Reliability, vol. 119, pp. 114086-1-114086-, Apr. 2021. https://doi.org/10.1016/j.microrel.2021.114086

Munshi M. Basit, David Burdick, Heshmat Aglan "Analysis of the viscoplastic behavior of Pb-free solder using lap shear joints," Microelectronics Reliability, vol. 119, pp. 114091-1-114091-, Apr. 2021. https://doi.org/10.1016/j.microrel.2021.114091

Mostafa AbdelAziz, Di Erick Xu, Guotao Wang, Michael Mayer "Electromigration in solder joints: A cross-sectioned model system for real-time observation," Microelectronics Reliability, vol. 119, pp. 114068-1-114068-, Apr. 2021. https://doi.org/10.1016/j.microrel.2021.114068

Chongyang Cai, Jiefeng Xu, Huayan Wang, and S. B. Park, x "A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs," Microelectronics Reliability , vol. 119, pp. 114065-1-114065-, Apr. 2021. https://doi.org/10.1016/j.microrel.2021.114065

Siou-Han Hu, Ting-Chun Lin, Chin-Li Kao, Fei-Ya Huang, ... Jui-Chao Kuo Effects of bismuth additions on mechanical property and microstructure of SAC-Bi solder joint under current stressing ," Microelectronics Reliability, vol. 117, pp. 114041-1-114041-, Feb. 2021. https://doi.org/10.1016/j.microrel.2021.114041

Nathan Jack, Brett Carn, Josh Morris Toward standardization of low impedance contact CDM ," Microelectronics Reliability, vol. 116, pp. 114011-1-114011-, Jan. 2021. https://doi.org/10.1016/j.microrel.2020.114011

Musa T. Zarmai, Chike F. Oduoza Impact of inter-metallic compound thickness on thermo-mechanical reliability of solder joints in solar cell assembly ," Microelectronics Reliability, vol. 116, pp. 114008-1-114008-, Jan. 2021. https://doi.org/10.1016/j.microrel.2020.114008

Cody J. Marbut, Bakhtiyar Nafis, David Huitink Accelerated mechanical low cycle fatigue in isothermal solder interconnects ," Microelectronics Reliability, vol. 116, pp. 113998-1-113998-, Jan. 2021. https://doi.org/10.1016/j.microrel.2020.113998

Hongbo Qin, Tianhan Liu, Wangyun Li, Wu Yue, Daoguo Yang Influence of microstructure inhomogeneity on the current density and temperature gradient in microscale line-type Sn58Bi solder joints under current stressing ," Microelectronics Reliability, vol. 115, pp. 113995-1-113995-, Dec. 2020. https://doi.org/10.1016/j.microrel.2020.113995

N. Delmonte, D. Cabezuelo, I. Kortabarria, D. Santoro, ... P. Cova A method to extract lumped thermal networks of capacitors for reliability oriented design ," Microelectronics Reliability, vol. 114, pp. 113737-1-113737-, Nov. 2020. https://doi.org/10.1016/j.microrel.2020.113737

Chunlin Lv, Jinjun Liu, Yan Zhang, Wanjun Lei, Rui Cao An improved lifetime prediction method for metallized film capacitor considering harmonics and degradation process ," Microelectronics Reliability, vol. 114, pp. 113892-1-113892-, Nov. 2020. https://doi.org/10.1016/j.microrel.2020.113892

Hao Niu, Shujuan Wang, Xuerong Ye Reliability-oriented optimization of aluminum electrolytic capacitor considering uncertain mission profile ," Microelectronics Reliability, vol. 114, pp. 113817-1-113817-, Nov. 2020. https://doi.org/10.1016/j.microrel.2020.113817

E. Ben Romdhane, A. Guédon-Gracia, S. Pin, P. Roumanille, H. Frémont Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components ," Microelectronics Reliability, vol. 114, pp. 113812-1-113812-, Nov. 2020. https://doi.org/10.1016/j.microrel.2020.113812

Yuxiong Pan, Guifa Zhou, Xu Wang, Fen Kuang A rapid life-prediction approach for solder joints based on modified Engelmaier fatigue model ," Microelectronics Reliability, vol. 114, pp. 113844-1-113844-, Nov. 2020. https://doi.org/10.1016/j.microrel.2020.113844

Nicholas May, Joseph Favata, Bahar Ahmadi, Pouya Tavousi, Sina Shahbazmohamadi Correlative microscopy workflow for precise targeted failure analysis of multi-layer ceramic capacitors ," Microelectronics Reliability, vol. 114, pp. 113858-1-113858-, Nov. 2020. https://doi.org/10.1016/j.microrel.2020.113858

Jiaxin Yuan, Sujuan Zhang, Bo Wan, Guicui Fu, Maogong Jiang Damage based PoF model of solder joints under temperature cycling and electric coupling condition ," Microelectronics Reliability, vol. 114, pp. 113814-1-113814-, Nov. 2020. https://doi.org/10.1016/j.microrel.2020.113814

Sanjay Tikale, K. Narayan Prabhu Performance and reliability of Al2O3 nanoparticles doped multicomponent Sn-3.0Ag-0.5Cu-Ni-Ge solder alloy ," Microelectronics Reliability, vol. 113, pp. 113933-1-113933-, Oct. 2020. https://doi.org/10.1016/j.microrel.2020.113933

Choong-Jae Lee, Byeong-Uk Hwang, Kyung Deuk Min, Jae-Ha Kim, Seung-Boo Jung Bending reliability of Ni–MWCNT composite solder with a differential structure ," Microelectronics Reliability, vol. 113, pp. 113934-1-113934-, Oct. 2020. https://doi.org/10.1016/j.microrel.2020.113934

A.E. Hammad, M. Ragab Achieving microstructure refinement and superior mechanical performance of Sn-2.0Ag-0.5Cu-2.0Zn (SACZ) solder alloy with rotary magnetic field ," Microelectronics Reliability, vol. 113, pp. 113932-1-113932-, Oct. 2020. https://doi.org/10.1016/j.microrel.2020.113932

Jose Romero, Michael H. Azarian, Michael Pecht Reliability analysis of multilayer polymer aluminum electrolytic capacitors ," Microelectronics Reliability, vol. 112, pp. 113725-1-113725-, Sept. 2020. https://doi.org/10.1016/j.microrel.2020.113725

Haksan Jeong, Kyung Deuk Min, Choong-Jae Lee, Jae-Ha Kim, Seung-Boo Jung Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test ," Microelectronics Reliability, vol. 112, pp. 113918-1-113918-, Sept. 2020. https://doi.org/10.1016/j.microrel.2020.113918

Qiaoli Lin, Changsheng Ye, Ran Sui Wetting of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders ," Microelectronics Reliability, vol. 111, pp. 113722-1-113722-, Aug. 2020. https://doi.org/10.1016/j.microrel.2020.113722

Houman Zahedmanesh, Kris Vanstreels Mechanical integrity of back-end-of-line with Ru nanowires and airgaps ," Microelectronics Reliability, vol. 110, pp. 113700-1-113700-, July 2020. https://doi.org/10.1016/j.microrel.2020.113700

Hongbo Xu, Fa Liu, Li Zhou, Hongyun Zhao, Mingyu Li Failure mechanism of lead-free component boards in thermomechanical test based on recrystallization enhanced cracking ," Microelectronics Reliability, vol. 110, pp. 113623-1-113623-, July 2020. https://doi.org/10.1016/j.microrel.2020.113623

T.T. Dele-Afolabi, M.A. Azmah Hanim, R. Calin, R.A. Ilyas Microstructure evolution and hardness of MWCNT-reinforced Sn-5Sb/Cu composite solder joints under different thermal aging conditions ," Microelectronics Reliability, vol. 110, pp. 113681-1-113681-, July 2020. https://doi.org/10.1016/j.microrel.2020.113681

Zheng-Duo Wang, Xing-He Luan, Zheng Zhou, Feng-Shun Wu, ... Hui Liu The two-phase flow simulation and experimental research on the formation of solder voids in power module ," Microelectronics Reliability, vol. 109, pp. 113675-1-113675-, June 2020. https://doi.org/10.1016/j.microrel.2020.113675

Juha Hagberg, Olli Nousiainen, Jussi Putaala, Olli Salmela, ... Heli Jantunen Effect of voids on thermomechanical cracking in lead-free Sn3Ag0.5Cu interconnections of power modules ," Microelectronics Reliability, vol. 109, pp. 113674-1-113674-, June 2020. https://doi.org/10.1016/j.microrel.2020.113674

Deng Yun Chen, Michael Osterman, Abhijit Dasgupta Energy based modeling for temperature cycling induced tin silver copper solder interconnect fatigue life ," Microelectronics Reliability, vol. 109, pp. 113651-1-113651-, June 2020. https://doi.org/10.1016/j.microrel.2020.113651

G. Chen, X.H. Wang, J. Yang, W.L. Xu, Q. Lin Effect of micromorphology on corrosion and mechanical properties of SAC305 lead-free solders ," Microelectronics Reliability, vol. 108, pp. 113634-1-113634-, May 2020. https://doi.org/10.1016/j.microrel.2020.113634

Greg O'Sullivan, Theo Smedes, Richard Derikx, Artemio Garcia, Bob Knoppers Over-stress and under-stress effects in CDM testing ," Microelectronics Reliability, vol. 108, pp. 113625-1-113625-, May 2020. https://doi.org/10.1016/j.microrel.2020.113625

Zhao Zhipeng, Zhang Xiaomin, Tan Shulin, Wu Zhouzhi, Zhang Hengjia Growth of intermetallic compounds in solder joints based on strongly coupled thermo–mechano–electro–diffusional theory ," Microelectronics Reliability, vol. 107, pp. 113621-1-113621-, Apr. 2020. https://doi.org/10.1016/j.microrel.2020.113621

Noor Muhammad, Zhigeng Fang, Muhammad Shoaib Remaining useful life (RUL) estimation of electronic solder joints in rugged environment under random vibration ," Microelectronics Reliability, vol. 107, pp. 113614-1-113614-, Apr. 2020. https://doi.org/10.1016/j.microrel.2020.113614

Xiangxia Kong, Junjun Zhai, Fenglian Sun, Yang Liu, Hao Zhang Combined effect of Bi and Ni elements on the mechanical properties of low-Ag Cu/Sn-0.7Ag-0.5Cu/Cu solder joints ," Microelectronics Reliability, vol. 107, pp. 113618-1-113618-, Apr. 2020. https://doi.org/10.1016/j.microrel.2020.113618

Wenjie Wang, Zubin Chen, Shaobin Wang, Xu Long Mechanics-based acceleration for estimating thermal fatigue life of electronic packaging structure ," Microelectronics Reliability, vol. 107, pp. 113616-1-113616-, Apr. 2020. https://doi.org/10.1016/j.microrel.2020.113616

Jianglei Fan, Zhanyun Liu, Hengtao Zhai, Xiao Wang, ... Jianxiu Liu Effect of Co content on the microstructure, spreadability, conductivity and corrosion resistance of Sn-0.7Cu alloy ," Microelectronics Reliability, vol. 107, pp. 113615-1-113615-, Apr. 2020. https://doi.org/10.1016/j.microrel.2020.113615

J. Thambi, U. Tetzlaff, A. Schiessl, K.-D. Lang, M. Waltz Evaluation of the relationship between stress and lifetime of Pb-free solder joints subjected to vibration load using a generalized local stress approach ," Microelectronics Reliability, vol. 106, pp. 113560-1-113560-, Mar. 2020. https://doi.org/10.1016/j.microrel.2019.113560

Jose A. Romero, Michael H. Azarian, Michael Pecht Life model for tantalum electrolytic capacitors with conductive polymers ," Microelectronics Reliability, vol. 104, pp. 113550-1-113550-, Jan. 2020. https://doi.org/10.1016/j.microrel.2019.113550

Wenbin Tang, Xu Long, Fuqian Yang Tensile deformation and microstructures of Sn–3.0Ag–0.5Cu solder joints: Effect of annealing temperature ," Microelectronics Reliability, vol. 104, pp. 113555-1-113555-, Jan. 2020. https://doi.org/10.1016/j.microrel.2019.113555

Raed Al Athamneh, Dania Bani Hani, Haneen Ali, Sa'd Hamasha Reliability modeling for aged SAC305 solder joints cycled in accelerated shear fatigue test ," Microelectronics Reliability, vol. 104, pp. 113507-1-113507-, Jan. 2020. https://doi.org/10.1016/j.microrel.2019.113507

S. Pin, A. Gracia, J.Y. Delétage, J. Fouquet, H. Frémont Robustness of BGAs: Parametric study of voids' distribution in SAC solder joints ," Microelectronics Reliability, vol. 102, pp. 113484-1-113484-, Nov. 2019. https://doi.org/10.1016/j.microrel.2019.113484

Tong An, Fei Qin, Bin Zhou, Pei Chen, ... Tao Tang Vibration lifetime estimation of PBGA solder joints using Steinberg model ," Microelectronics Reliability, vol. 102, pp. 113474-1-113474-, Nov. 2019. https://doi.org/10.1016/j.microrel.2019.113474

Iuliana Panchenko, Klaus-Juergen Wolter, Kristof Croes, Ingrid De Wolf, ... M. Juergen Wolf Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking ," Microelectronics Reliability, vol. 102, pp. 113296-1-113296-, Nov. 2019. https://doi.org/10.1016/j.microrel.2019.05.011

J. Mei, R. Haug, S. Hinderberger, T. Grözinger, A. Zimmermann Void formation in solder joints under power cycling conditions and its effect on reliability ," Microelectronics Reliability, vol. 100-101, pp. 113350-1-113350-, Sept. 2019. https://doi.org/10.1016/j.microrel.2019.06.042

Shuai Zhao, Shaowei Chen, Huai Wang Degradation modeling for reliability estimation of DC film capacitors subject to humidity acceleration ," Microelectronics Reliability, vol. 100-101, pp. 113401-1-113401-, Sept. 2019. https://doi.org/10.1016/j.microrel.2019.113401

Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko, Jun-Hyuk Son, ... Chang-Woo Lee Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate ," Microelectronics Reliability, vol. 99, pp. 62-73, Aug. 2019. https://doi.org/10.1016/j.microrel.2019.05.019

Zeyang Zheng, Ping-Chen Chiang, Yu-Ting Huang, Wei-Ting Wang, ... Shien-Ping Feng Study of grain size effect of Cu metallization on interfacial microstructures of solder joints ," Microelectronics Reliability, vol. 99, pp. 44-51, Aug. 2019. https://doi.org/10.1016/j.microrel.2019.05.018

Thomas Schriefer, Maximilian Hofmann A hybrid frequency-time-domain approach to determine the vibration fatigue life of electronic devices ," Microelectronics Reliability, vol. 98, pp. 86-94, July 2019. https://doi.org/10.1016/j.microrel.2019.04.001

E.H. Wong A new creep fatigue model for solder joints ," Microelectronics Reliability, vol. 98, pp. 153-160, July 2019. https://doi.org/10.1016/j.microrel.2019.05.012

Omid Mokhtari A review: Formation of voids in solder joint during the transient liquid phase bonding process - Causes and solutions ," Microelectronics Reliability, vol. 98, pp. 95-105, July 2019. https://doi.org/10.1016/j.microrel.2019.04.024

A.A. Ibrahiem, A.A. El-Daly Investigation on multi-temperature short-term stress and creep relaxation of Sn-Ag-Cu-In solder alloys under the effect of rotating magnetic field ," Microelectronics Reliability, vol. 98, pp. 10-18, July 2019. https://doi.org/10.1016/j.microrel.2019.04.020

Fan-Yi Ouyang, Gong-Lin Hong, Yuan-Ruei Hsu, Shan-Yu Mao, Wei-Jun Liu Thermomigration in Co/SnAg/Co and Cu/SnAg/Co sandwich structure ," Microelectronics Reliability, vol. 97, pp. 16-23, June 2019. https://doi.org/10.1016/j.microrel.2019.03.005

Qizhi Wang, Qingyi Liu, Zheng Zhang, Min Miao, ... Fei Su An observation and explanation of interior cracking at the interface of solder by electromigration ," Microelectronics Reliability, vol. 97, pp. 79-84, June 2019. https://doi.org/10.1016/j.microrel.2019.04.013

Yee-Wen Yen, Andromeda Dwi Laksono, Chiao-Yi Yang Investigation of the interfacial reactions between Sn-3.0 wt%Ag-0.5 wt%Cu solder and CuTi alloy (C1990HP) ," Microelectronics Reliability, vol. 96, pp. 29-36, May 2019. https://doi.org/10.1016/j.microrel.2019.03.006

P. Borgesen, L. Wentlent, T. Alghoul, R. Sivasubramony, ... C. Greene A mechanistic model of damage evolution in lead free solder joints under combinations of vibration and thermal cycling with varying amplitudes ," Microelectronics Reliability, vol. 95, pp. 65-73, Apr. 2019. https://doi.org/10.1016/j.microrel.2019.02.001

Y.S. Chiu, H.Y. Yu, H.T. Hung, Y.W. Wang, C.R. Kao Phase formation and microstructure evolution in Cu/In/Cu joints ," Microelectronics Reliability, vol. 95, pp. 18-27, Apr. 2019. https://doi.org/10.1016/j.microrel.2019.02.004

Jiang Xia, Lin Yang, Qunxing Liu, Qi Peng, ... GuoYuan Li Comparison of fatigue life prediction methods for solder joints under random vibration loading ," Microelectronics Reliability, vol. 95, pp. 58-64, Apr. 2019. https://doi.org/10.1016/j.microrel.2019.02.008

Saeed Akbari, Andreas Lövberg, Per-Erik Tegehall, Klas Brinkfeldt, Dag Andersson Effect of PCB cracks on thermal cycling reliability of passive microelectronic components with single-grained solder joints ," Microelectronics Reliability, vol. 93, pp. 61-71, Feb. 2019. https://doi.org/10.1016/j.microrel.2019.01.006

Nathan Valentine, Michael H. Azarian, Michael Pecht Metallized film capacitors used for EMI filtering: A reliability review ," Microelectronics Reliability, vol. 92, pp. 123-135, Jan. 2019. https://doi.org/10.1016/j.microrel.2018.11.003

Yousra Bettahi, Caroline Richard Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling ," Microelectronics Reliability, vol. 92, pp. 20-26, Jan. 2019. https://doi.org/10.1016/j.microrel.2018.11.005

Ze Zhu, Yan-cheong Chan, and Fengshun Wu, x Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect ," Microelectronics Reliability, vol. 92, pp. 12-19, Jan. 2019. https://doi.org/10.1016/j.microrel.2018.11.006

M. Kuczynska, N. Schafet, U. Becker, R. Metasch, ... S. Weihe Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load Special section ," Microelectronics Reliability, vol. 91 pt. 1, pp. 67-85, Dec. 2018. https://doi.org/10.1016/j.microrel.2018.06.007

S. Pin, A. Guédon-Gracia, J.-Y. Delétage, H. Frémont Creep measurement and choice of creep laws for BGA assemblies' reliability simulation ," Microelectronics Reliability, vol. 88-90, pp. 1172-1176, Sept. 2018. https://doi.org/10.1016/j.microrel.2018.07.029

I. Vernica, H. Wang, F. Blaabjerg Uncertainty analysis of capacitor reliability prediction due to uneven thermal loading in photovoltaic applications ," Microelectronics Reliability, vol. 88-90, pp. 1036-1041, Sept. 2018. https://doi.org/10.1016/j.microrel.2018.07.059

T. Fujiwara, K. Yamamoto, H. Kimura Quantification of lead-free solder fatigue by EBSD analysis ," Microelectronics Reliability, vol. 88-90, pp. 691-694, Sept. 2018. https://doi.org/10.1016/j.microrel.2018.07.006

J. Mei, R. Haug, O. Lanier, T. Grözinger, A. Zimmermann Effect of Joule heating on the reliability of solder joints under power cycling conditions ," Microelectronics Reliability, vol. 88-90, pp. 684-690, Sept. 2018. https://doi.org/10.1016/j.microrel.2018.06.053

A.B. Temsamani, S. Kauffmann, S. Helsen, T. Gaens, V. Driesen Physics-of-Failure (PoF) methodology for qualification and lifetime assessment of supercapacitors for industrial applications ," Microelectronics Reliability, vol. 88-90, pp. 54-60, Sept. 2018. https://doi.org/10.1016/j.microrel.2018.06.084

ashworth, m. a., g. d. wilcoxr. j. mortimer the effect of electroplating parameters and substrate material on tin whisker formation microelectronics reliability volume 55, issue 1, january 2015, pp. 180-191 https://doi.org/10.1016/j.microrel.2014.10.005

Bisschop, J., x Reliability methods and standards Microelectronics Reliability Volume 47, Issues 9–11, September–November 2007, pp. 1330-1335 https://doi.org/10.1016/j.microrel.2007.07.084

Cheng, Shunfeng, Chien-Ming HuangMichael Pecht A review of lead-free solders for electronics applications Microelectronics Reliability Volume 75, August 2017, pp. 77-95 https://doi.org/10.1016/j.microrel.2017.06.016

Chiu, Tz-Cheng, Jyun-Ji LinVikas Gupta Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load Microelectronics Reliability Volume 50, Issue 12, December 2010, pp. 2037-2050 https://doi.org/10.1016/j.microrel.2010.06.012

cornelius, ben, shay treivishmichael pecht the phenomenon of tin pest: a review microelectronics reliability volume 79, december 2017, pp. 175-192 https://doi.org/10.1016/j.microrel.2017.10.030

doudrick, kyle, jeff chinnkonrad rykaczewski rapid method for testing efficacy of nano-engineered coatings for mitigating tin whisker growth microelectronics reliability volume 55, issue 5, april 2015, pp. 832-837 https://doi.org/10.1016/j.microrel.2015.02.014

eckold, p., r. niewaw. hügel texture of electrodeposited tin layers and its influence on their corrosion behavior microelectronics reliability volume 54, issue 11, november 2014, pp. 2578-2585 https://doi.org/10.1016/j.microrel.2014.06.006

eckold, p., m. s. sellersw. hügel the surface energies of ß-sn — a new concept for corrosion and whisker mitigation microelectronics reliability volume 55, issue 12, part b, december 2015, pp. 2799-2807 https://doi.org/10.1016/j.microrel.2015.08.018

Fang, Tong, Michael OstermanMichael Pecht Statistical analysis of tin whisker growth Microelectronics Reliability Volume 46, Issues 5–6, May–June 2006, pp. 846-849 https://doi.org/10.1016/j.microrel.2005.06.002

fukuda, yuki, michael ostermanmichael pecht the impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth microelectronics reliability volume 47, issue 1, january 2007, pp. 88-92 https://doi.org/10.1016/j.microrel.2006.04.011

George, Elviz, Michael Pecht RoHS compliance in safety and reliability critical electronics Microelectronics Reliability Volume 65, October 2016, pp. 1-7 https://doi.org/10.1016/j.microrel.2016.07.150

george, elviz, michael pecht tin whisker analysis of an automotive engine control unit microelectronics reliability volume 54, issue 1, january 2014, pp. 214-219 https://doi.org/10.1016/j.microrel.2013.07.134

horváth, barbara, x influence of copper diffusion on the shape of whiskers grown on bright tin layers microelectronics reliability volume 53, issue 7, july 2013, pp. 1009-1020 https://doi.org/10.1016/j.microrel.2013.03.008

hua, l., c. yang corrosion behavior, whisker growth, and electrochemical migration of sn–3.0ag–0.5cu solder doping with in and zn in nacl solution microelectronics reliability volume 51, issue 12, december 2011, pp. 2274-2283 https://doi.org/10.1016/j.microrel.2011.06.023

huang, chien-ming, daniel nunezmichael pecht risk of tin whiskers in the nuclear industry microelectronics reliability volume 81, february 2018, pp. 22-30 https://doi.org/10.1016/j.microrel.2017.12.019

illés, balázs, barbara horváth whiskering behaviour of immersion tin surface coating microelectronics reliability volume 53, issue 5, may 2013, pp. 755-760 https://doi.org/10.1016/j.microrel.2013.02.001

jiang, bo, ai-ping xian whisker growth on tin finishes of different electrolytes microelectronics reliability volume 48, issue 1, january 2008, pp. 105-110 https://doi.org/10.1016/j.microrel.2007.02.002

kim, k. s., c. h. yuj. h. kim investigation of relation between intermetallic and tin whisker growths under ambient condition microelectronics reliability volume 48, issue 1, january 2008, pp. 111-118 https://doi.org/10.1016/j.microrel.2007.01.088

kim, k. s., c. h. yuj. m. yang tin whisker formation of lead-free plated leadframes microelectronics reliability Volume 46, Issue 7, July 2006, pp. 1080-1086 https://doi.org/10.1016/j.microrel.2005.08.007

Kotadia, Hiren R., Philip D. HowesSamjid H. Mannan A review: On the development of low melting temperature Pb-free solders Microelectronics Reliability Volume 54, Issues 6–7, June–July 2014, pp. 1253-1273 https://doi.org/10.1016/j.microrel.2014.02.025

krammer, olivér, balázs illéskarel dušek automatic characterisation method for statistical evaluation of tin whisker growth microelectronics reliability volume 73, june 2017, pp. 14-21 https://doi.org/10.1016/j.microrel.2017.04.007

Lai, Yi-Shao, Ho-Ming TongKing-Ning Tu Recent research advances in Pb-free solders Microelectronics Reliability Volume 49, Issue 3, March 2009, pp. 221-222 https://doi.org/10.1016/j.microrel.2009.02.007

Lillie, Edwin, Peter SandbornDavid Humphrey Assessing the value of a lead-free solder control plan using cost-based FMEA Microelectronics Reliability Volume 55, Issue 6, May 2015, pp. 969-979 https://doi.org/10.1016/j.microrel.2015.02.022

Lin, Chih-Kuang, Tung-Hsien Lin Effects of continuously applied stress on tin whisker growth Microelectronics Reliability Volume 48, Issue 10, October 2008, pp. 1737-1740 https://doi.org/10.1016/j.microrel.2008.04.013

Lin, Hsiu-Jen, Tung-Han Chuang Interfacial microstructure and bonding strength of Sn–3Ag–0.5Cu and Sn–3Ag–0.5Cu–0.5Ce–xZn solder BGA packages with immersion Ag surface finish Microelectronics Reliability Volume 51, Issue 2, February 2011, pp. 445-452 https://doi.org/10.1016/j.microrel.2010.07.061

Man, Jennifa Nga, Li, Diganta DasPatrick McCluskey Review of shelf life evaluation methods and a physics of failure approach for shelf life estimation for electronic components Microelectronics Reliability Volume 99, August 2019, pp. 152-160 https://doi.org/10.1016/j.microrel.2019.05.022

nakadaira, yoshikuni, seyoung jeongseyong oh growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling microelectronics reliability volume 47, issue 12, december 2007, pp. 1928-1949 https://doi.org/10.1016/j.microrel.2007.03.008

nakadaira, yoshikuni, seyoung jeongseyong oh growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling microelectronics reliability volume 48, issue 1, january 2008, pp. 83-104 https://doi.org/10.1016/j.microrel.2007.01.091

pecht, michael, tadahiro shibutanilifeng wu a reliability assessment guide for the transition planning to lead-free electronics for companies whose products are rohs exempted or excluded microelectronics reliability volume 62, july 2016, pp. 113-123 https://doi.org/10.1016/j.microrel.2016.03.020

pinsky, david a., x the role of dissolved hydrogen and other trace impurities on propensity of tin deposits to grow whiskers microelectronics reliability volume 48, issue 5, may 2008, pp. 675-681 https://doi.org/10.1016/j.microrel.2008.01.008

Plieninger, R., M. DittesK. Pressel Modern IC packaging trends and their reliability implications Microelectronics Reliability Volume 46, Issues 9–11, September–November 2006, pp. 1868-1873 https://doi.org/10.1016/j.microrel.2006.08.008

qi, haiyu, sanka ganesanmichael pecht no-fault-found and intermittent failures in electronic products microelectronics reliability volume 48, issue 5, may 2008, pp. 663-674 https://doi.org/10.1016/j.microrel.2008.02.003

Shibutani, Tadahiro, Ji WuMichael Pecht Key reliability concerns with lead-free connectors Microelectronics Reliability Volume 48, Issue 10, October 2008, pp. 1613-1627 https://doi.org/10.1016/j.microrel.2008.06.004

Shibutani, Tadahiro, Jing Wen Sun Nucleation and shrinkage of defects on the surface of tin induced by local strain distribution Microelectronics Reliability Volume 79, December 2017, pp. 119-123 https://doi.org/10.1016/j.microrel.2017.10.026

shibutani, tadahiro, qiang yumichael g. pecht pressure-induced tin whisker formation microelectronics reliability volume 48, issue 7, july 2008, pp. 1033-1039 https://doi.org/10.1016/j.microrel.2008.04.009

skwarek, agata, krzysztof witekjacek ratajczak risk of whiskers formation on the surface of commercially available tin-rich alloys under thermal shocks microelectronics reliability volume 49, issue 6, june 2009, pp. 569-572 https://doi.org/10.1016/j.microrel.2009.02.026

stoyanov, s., c. bailey modelling the impact of refinishing processes on cots components for use in aerospace applications microelectronics reliability volume 55, issues 9–10, august–september 2015, pp. 1271-1279 https://doi.org/10.1016/j.microrel.2015.07.030

stoyanov, stoyan, chris baileyjim scott modelling methodology for thermal analysis of hot solder dip process microelectronics reliability volume 53, issue 8, august 2013, pp. 1055-1067 https://doi.org/10.1016/j.microrel.2013.02.018

Stoyanov, Stoyan, Chris BaileyGeorgios Tourloukis Similarity approach for reducing qualification tests of electronic components Microelectronics Reliability Volume 67, December 2016, pp. 111-119 https://doi.org/10.1016/j.microrel.2016.10.017

Sun, Bo, Yu LiXueyong Chen Remaining useful life prediction of aviation circular electrical connectors using vibration-induced physical model and particle filtering method Microelectronics Reliability Volume 92, January 2019, pp. 114-122 https://doi.org/10.1016/j.microrel.2018.11.015

Tian, Yu, Jing HanFu Guo The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn-3.0Ag-0.5Cu solder joints Microelectronics Reliability Volume 80, January 2018, pp. 7-13 https://doi.org/10.1016/j.microrel.2017.11.005

Vallabhaneni, Renuka, Ehsan IzadiNikhilesh Chawla In situ tensile testing of tin (Sn) whiskers in a focused ion beam (FIB)/scanning electron microscope (SEM) Microelectronics Reliability Volume 79, December 2017, pp. 314-320 https://doi.org/10.1016/j.microrel.2017.07.042

wu, albert t., y. c. ding the suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment microelectronics reliability volume 49, issue 3, march 2009, pp. 318-322 https://doi.org/10.1016/j.microrel.2008.11.002

Yin, Chunyan, Chris BestStoyan Stoyanov Statistical analysis of the impact of refinishing process on leaded components Microelectronics Reliability Volume 55, Issue 2, February 2015, pp. 424-431 https://doi.org/10.1016/j.microrel.2014.11.001

yu, cheng-fu, chi-ming chanker-chang hsieh the effect of tin grain structure on whisker growth microelectronics reliability volume 50, issue 8, august 2010, pp. 1146-1151 https://doi.org/10.1016/j.microrel.2010.04.019

Zhu, Ze, Yan-Cheong ChanFengshun Wu Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing Microelectronics Reliability Volume 91, Part 2, December 2018, pp. 179-182 https://doi.org/10.1016/j.microrel.2018.10.002

Kim, Keun-Soo, Takayuki ImanishiRikiya Kato Properties of low temperature Sn–Ag–Bi–In solder systems Microelectronics Reliability Volume 47, Issue 7, July 2007, pp. 1113-1119 https://doi.org/10.1016/j.microrel.2006.06.012

Muller, W. H., x Morphology changes in solder joints––experimental evidence and physical understanding Microelectronics Reliability Volume 44, Issue 12, December 2004, pp. 1901-1914 https://doi.org/10.1016/j.microrel.2004.04.020

peng, weiqun, x an investigation of sn pest in pure sn and sn-based solders microelectronics reliability volume 49, issue 1, january 2009, pp. 86-91 https://doi.org/10.1016/j.microrel.2008.11.001

zachariasz, piotr, agata skwarekkrzysztof witek mössbauer studies of ß???a phase transition in sn-rich solder alloys microelectronics reliability volume 82, march 2018, pp. 165-170 https://doi.org/10.1016/j.microrel.2018.01.016

--------------------------------------------------------
Micromaterials and Nanomaterials
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
MicroNews
{ http://www.i-micronews.com/micronews/subscribe/, }
1 item found as of 1/30/2011

--------------------------------------------------------
Microprocessors and Microsystems
{ https://www.sciencedirect.com/journal/microprocessors-and-microsystems/issues EBSCOA, CSULB online, OSU online, SMU online, UC online, UK online (pay), UL online, UM online, USC grand, UT online, UTAr online, UTD online, }
9 items found as of 8/6/2021
v3#1-v84(21) checked 8/6/2021

(new reference 8/6/2021)
R.H.L Ong, M.J Pont, W Peasgood A comparison of software-based techniques intended to increase the reliability of embedded applications in the presence of EMI ," Microprocessors and Microsystems, vol. 24 no. 10, pp. 481-491, Mar. 1, 2001. https://doi.org/10.1016/S0141-9331(00)00095-8

--------------------------------------------------------
(new source 6/22/2020)
Microscopy and Microanalyses
{ https://www.cambridge.org/core/journals/microscopy-and-microanalysis }
2 items found as of 11/6/2020

--------------------------------------------------------
Microsystem Technologies
Microsystem technologies sensors, actuators, systems integration
{ https://link.springer.com/journal/542/volumes-and-issues AU online, FSU online, GIT online, IU online, MST online, NWU online, OGI online, OkSU online, OrSU online, OSU online, PU online, RU online, SDSU online, SIUC online, UC online, UCF online, UCI online, UCSD online, UD online, UDe online, UF online, UIC online, UK online (pay), UM online, UMC online, UNF online, UOk online, USD online, USF online, UT online, UTA online, UTo online, }
>=20 items found as of 8/9/2021
v11#1-v27#9(21) checked 8/9/2021
searched for tin whisker(s) and Sn whisker(s) on 8/13/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/13/2020
searched for indium whisker(s) on 8/13/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/13/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 10/10/2020

--------------------------------------------------------
Microsystems for Measurement and Instrumentation
{ IEEE XPLORE (12-14), }
item found as of 8/3/2021
12-14 checked 8/3/2021

--------------------------------------------------------
Microwave Engineering Europe
{ CSULB online, FIU online, IU online, MSU online, NWU online, OkSU online, OSU online, SDSU online, SIUC online, SMU online, UAr online, UCB online, UIC online, UMi online, UOk online, UPi online, USC TK7876, USD online, UTAr online, UTD online, VU online, WSU online, }
item found as of 8/4/2013 catalog
Sep30,01-Jul12,02 checked 8/4/2013

"High frequency passives roundup - Integration and packaging," Microwave Engineering Europe no. FEB., Feb. 2006, p 16-18

--------------------------------------------------------
Microwave Journal
{ https://www.microwavejournal.com/publications/1/editions/250 https://www.thefreelibrary.com/Microwave+Journal-p25185 EBSCOA, GIT online, OSU online, UC ceas TK7876.M5345 & sw depos TK7876.M5345, UCF online, UF online, UK eng TK7876.M536, UL robotic TK7800.M5, UM online, UT online, VU online, }
4 items found as of 8/6/2021
v54#1(11)-v64#7(21) checked 8/6/2021

searched for tin whisker(s) and Sn whisker(s) on 1/26/2021
searched for zinc whisker(s) & Zn whisker(s) on 1/26/2021
searched for indium whisker(s) on 1/26/2021
searched for cadmium whisker(s) & Cd whisker(s) on 1/26/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 1/26/2021

--------------------------------------------------------
Microwave Product Digest
7 items found as of 6/12/2016
may09,aug09-dec09,jul11,jul12,may13-apr16 checked 6/12/2016

-------------------------------------------------------
Microwaves & RF
{ http://mwrf.com/ FIU online, MST online, OCU beam microfiche, OkSU online, SDSU online, SIUC online, TTU, UAr online, UCSD online, UK online, UMi online, UOk online, USD online, }
6 items found as of 6/20/2021
v42#11(03)-v58#8,v58#10-v59#12(20) checked 6/20/2021

-------------------------------------------------------
MIDCON/82 Conference Record
{ }
1 item found as of 1/30/2011

(new reference 12/23/2013)
Byrne 1982 session 28/4 p 1-13

--------------------------------------------------------
Military & Aerospace Electronics
{ https://www.militaryaerospace.com/magazine EBSCOA, EBSCOB, http://mae.pennnet.com/, IU bloomington alf UG485.M484, KYVL, MST online, NWU online, OkSU online, OSU online, SDSU online, SIUC online, UAr online, UCSD online, UIC online, UK online, UOk online, USD online, UT online, }
>=20 items found as of 8/6/2021
Jan00-v32#7(21) checked 8/6/2021
searched for tin whisker(s) and Sn whisker(s) on 7/20/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/8/2020
searched for indium whisker(s) on 8/8/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/8/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight on 8/8/2020
searched for gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 10/10/2020

--------------------------------------------------------
Military Electronics/Countermeasures
{ }

(new reference 12/23/2013)
McAteer June 1979

--------------------------------------------------------
Mineral Processing
Aufbereitungs-Technik
{ https://www.at-minerals.com/en/archive.html LH closed, OSU sel TA401.A85, SDSU online, UIUC main Q.620.105AU, USU online, }
2 items found as of 1/30/2011 catalog

(new reference 12/29/2008)
Anon .Einsatz von fritsch labormuhlen fur WEEE und RoHS-tests (Application of fritsch laboratory mills for WEEE and RoHS tests) Aufbereitungs-Technik/Mineral Processing, v 47, n 6, June, 2006, p 48 Language: German, English

Schunicht, Jorg .Ruckgewinnung von Metallen aus E-Schrott-Moderne Sortierverfahren in der Praxis (Recovery of metals from waste electrical and electronic equipment - Modern separating processes in the field) Aufbereitungs-Technik/Mineral Processing, v 48, n 9, September, 2007, p 4-10 Language: German, English

--------------------------------------------------------
Minerals Engineering
{ https://www.sciencedirect.com/journal/minerals-engineering/issues IU online, MST online, OkSU online, OSU online, SDSU online, SIUC online, UC online, UCSD online, UIC online, UK online sd, UL online, UM online, UOk online, UT online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Minerals Yearbook: Volume I. -- Metals and Minerals
{ http://minerals.usgs.gov/minerals/pubs/myb.html CMU online, CSULA online, CSULB online, MSU online, OSU online, UC online, UD online, UK online & sci TN23.U6 & eng TN23.M560 & law I28.37 & spec coll TN23.M560 & young gov I19.165 & storage I28.37, UL online, UM online, USC grand, UT online, UTAr online, VU online, }
>=20 items found as of 1/21/2021 catalog

--------------------------------------------------------
Mobile Handset DesignLine
{ http://www.mobilehandsetdesignline.com/, }
1 item found as of 1/30/2011
checked 4/3/2009

--------------------------------------------------------
Modeling, Control, and Optimization in Ferrous and Non-Ferrous Industry
{ LH TN605.M62, MST wilson TN605.M57, }
1 item found as of 1/30/2011

--------------------------------------------------------
Modelling and Simulation in Materials Science and Engineering
{ http://www.hindawi.com/journals/mse/contents.html https://iopscience.iop.org/journal/0965-0393 AU online, BYU online, FIT online, GIT online, IU online, LH closed, MST online, NWU online, OGI online, OkSU online, OrSU online, OSU online, PU online, RU online, SIUC online, SU online, UAB online, UAr online, UC online, UCI online, UCSD online, UD online, UDe online, UIC online, UIUC online, UK online, UM online, UMc online, UOk online, USD online, USU online, UT online, UTA online, UTo online, WrSU online, }
2 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/21/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/21/2020
searched for indium whisker(s) on 12/21/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/21/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/21/2020

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Modern Chemical Industry
Xiandai Huagong
{ https://caod.oriprobe.com/journals/xdhg/Modern_Chemical_Industry.htm LH closed, UTAr online, }
item found as of 1/30/2011 catalog

Lin, Xiao, Cao, Hong-Bin, Li, Yu-Ping, Zheng, Shi-Li, Zhang, Yi Advances in precious metal recovery from WEEE Xiandai Huagong/Modern Chemical Industry, vol. 26 no. 6, June 2006, p 12-16 Language: Chinese

-------------------------------------------------------
Modern Plastics Worldwide
{ http://www.plasticstoday.com/mpw, AU online, BYU hbll TP1101.M63x, FIT online, FIU green TP986.A1M6, FSU online, GIT online & main-6e TP986.A1M6, IU online, LH closed, LU gray TP986.A1M6, NWU sci L660.5M689, OCU beam microfiche, OrSU valley TP986.A1M6, OSU online, PU online, RU fondren TP986.A1M6, SDSU TP986.A1M6, SIUC morris 53510-6732, SMU online, SU online, TTU, UAr mullins TP986.A1M63, UC cas TP986.A2M58, UCF main TP986.A1M6, UDe online, UF online, UIC daley TP986.A1M6, UM online, UMC online, UMi richter TP986.A1M6, UNF online, UOk bizzell TP986.A1M6, UPi eng, USC TP986.A1M6, USF online, USU merrill-cazier TP1101.M622, UTA online, UTAr online, UTD online, UTo online, WrSU online, }
1 item found as of 9/24/2014 catalog
v82#1-v88#3 checked 9/24/2014

--------------------------------------------------------
Molecular Physics
{ https://www.tandfonline.com/loi/tmph20 AU online, FSU online, LH closed, MST online, NWU online, OGI online, OkSU online, OrSU valley QC173.M57, OSU sel QC173.A1M6, PU online, RU online, SDSU online, SIUC online, SIUE lovejoy, SU online, UAB online, UAr online, UCF online, UCI drum QC173.M57, UCSD online, UD online, UDe online, UF online, UIC online, UIUC online, UK online, UM online, UMc online, UMe online, USF online, USU online, UTA online, UTo online, WrSU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Monatshefte fur Chemie und verwandte Teile anderer Wissenschaften
{ IU bloomington chem QD1.M7 & alf QD1.M7, MST depos 540.5M742, NWU online & sci 540.5M736, OkSU stillwater 540.5M736, OSU online & sel QD1M73, PU online & chem 541.378M7325 & hicks 540.5M74, SDSU QD1.M58, SIUC mclafferty 540.5M736, UAr storage QD1.M7, UC online & chem QD1.M7, UCSD online, UIC sci, UK online & chem/phys QD1.M7 & young S92-79, UL kersey QD1.M7, UM online & shapiro QD1.M74 & hatcher FILM X3067, UOk chem/math QD1.M7, USD online, UT online & hodges QD1.M6, }
1 item found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 9/7/2020

searched for zinc whisker(s) & Zn whisker(s) on 9/7/2020
searched for indium whisker(s) on 9/7/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/7/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/7/2020

--------------------------------------------------------
(new source 10/31/2020)
MRS Advances
{ https://link.springer.com/journal/43580/volumes-and-issues }
2 item found as of 11/27/2020

searched for tin whisker(s) and Sn whisker(s) on 11/27/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/27/2020
searched for indium whisker(s) on 11/27/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/27/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/27/2020

--------------------------------------------------------
MRS Bulletin
{ https://www.cambridge.org/core/journals/mrs-bulletin/all-issues FIU online, OkSU online, OSU sel TA401.M97, UCSD online, UM online, UMi online, UNCC TA401.M78, UPi online, USC TA401.M78, UTor online, UWa online, }
16 items found as of 10/17/2020 catalog
v32#1-v40#12 checked 10/17/2020

--------------------------------------------------------
(new source 10/1/2020)
MRS Communications
{ https://www.cambridge.org/core/journals/mrs-communications }
1 item found as of 10/1/2020

--------------------------------------------------------
MX
{ CSULB online, FAU online, FIU online, MST online, OkSU online, SDSU online, SIUC online, SMU online, UAr online, UK online, UMi online, UPi online, USD online, UTAr online, UTD online, }
2 items found as of 1/21/2021 catalog
May04-Dec09(09) checked 1/21/2021

NNNN--------------------------------------------------------
(new source 10/10/2020)
Nano Hybrids and Composites
{ https://www.scientific.net/NHC UK online (pay), }
--------------------------------------------------------
Nano letters
{ https://pubs.acs.org/loi/nalefd CSULB online, OSU online, UK online & remote T174.7.N345, UM online, USC grand, UT online, }
9 items found as of 1/21/2021

searched for tin whisker(s) and Sn whisker(s) on 1/23/2021
searched for zinc whisker(s) & Zn whisker(s) on 1/23/2021
searched for indium whisker(s) on 1/23/2021
searched for cadmium whisker(s) & Cd whisker(s) on 1/23/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 1/23/2021

--------------------------------------------------------
Nanostructured Materials
{ https://www.sciencedirect.com/journal/nanostructured-materials/issues CSULA palmer TA418.9.N35N3523, CSULB online, OSU depos T174.7.N3, UC online, UK online, UM online, USC grand, UT online, VU online, }
1 item found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

--------------------------------------------------------
Nanotechnology
{ https://iopscience.iop.org/journal/0957-4484 CSULB online, OSU depos TA165.N3, UC online, UD online, UK online, UL robotic T174.7.N37, UM digital, USC grand, UT online, VU online, }
11 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/20/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/20/2020
searched for indium whisker(s) on 12/20/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/20/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/20/2020

--------------------------------------------------------
Nanotechnology and Precision Engineering
Nami Jishu yu Jingmi Gongcheng
{ LH closed, UTo online, }
item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Xu, Hong-Bo, Li, Ming-Yu, Kim, Jong-Myung, Kim, Dae-Won .Interfacial reaction and shear properties of lead-free Sn.5Ag solder bumps reflowed by induction self heating Nami Jishu yu Jingmi Gongcheng/Nanotechnology and Precision Engineering, v 5, n 3, September, 2007, p 157-163

--------------------------------------------------------
NARTE News
{ }

(new reference 12/23/2013)
Chase v 14 no 1 1996 p 22

--------------------------------------------------------
(new source 7/6/2020)
NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop
{ }
1 item found as of 7/6/2020

," NASA Electronic Parts and Packaging Electronics Technology Workshop , Greenbelt, MD, June 17-19, 2014, pp. xx-xx.

--------------------------------------------------------
NASA Tech Briefs
{ http://www.techbriefs.com/ AU online, BYU hbll TL521.3.T4U551x, FIT govdocs, FSU online, GIT gov NAS1.29/3-2, IU various, LH closed, LU gray documents, MoSU online, MST online, NWU main NAS1.29/3-2, OCU beam, OkSU online, OrSU valley TL521.A5391, OSU sel TL521.N23 & sel TL521.N177, PU online, RU fondren gov NAS1.29/3-2, SDSU online, SIUC online, UAH n1, UAr mullins TL521.A3523, UC online, UCF online, UCI online, UCSD s&e TL521.A3263, UD online, UDe online, UF online, UIC online, UIUC online, UK online & various, UM online, UMC online, UMe mcwherter, UNF online, USF online, USU merrill-cazier NAS1.29/3, UT online, UTA pcl T1N3855, UTo online, WrSU online, }
4 items found as of 1/21/2021
v32#2-v39#12 checked 1/21/2021

--------------------------------------------------------
NASA Technical Reports Server
{ https://ntrs.nasa.gov/ }
>=20 items found as of 2/4/2021
searched for tin whisker(s) and Sn whisker(s) on 2/2/2021

searched for zinc whisker(s) & Zn whisker(s) on 2/2/2021
searched for indium whisker(s) on 2/2/2021
searched for cadmium whisker(s) & Cd whisker(s) on 2/2/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 2/2/2021

--------------------------------------------------------
National Academies Press
{ http://www.nap.edu/, UM online, }
1 item found as of 1/30/2011

--------------------------------------------------------
National Bureau of Standards Circular
{ https://archive.org/details/NBSCirculars?&and[]=year%3A%221953%22 OSU tho special QC100.U56, SMU storage, UC sw depos QC1.U55, UD roesch C13.4 & roesch QC157.U58, UL robotic QC100.U555, UM online, USC grand, VU annex various, }
2 items found as of 1/30/2011 catalog

--------------------------------------------------------
National Bureau of Standards Report
{ UCSD s&e Q1.U60185, UM hatcher QD511.A1.U582 & buhr Z699.I493x, UW suzallo govpub us C13.38:NBS-4576, }
item found as of 5/19/2014 catalog

J. H. Becker, p. 4576 NBS-4576? (1956).

--------------------------------------------------------
National Ground Water Association Conference
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
National Research Council of Canada
{ UCSD srlf Q1.N2963, }
item found as of 1/30/2011 catalog

Paatsch, W, Kiesner, A. FORMATION OF HIGHLY CORROSION RESISTANT CONVERSION LAYERS BY ZINC ANODIZING. Natl Research Council of Canada, 1984, pp. 107-108, 389-391

--------------------------------------------------------
Nature
{ https://www.nature.com/nature/volumes CPL, MST online, OkSU online, SIUC morris 53572-5001, UAr online, UCSD online, UD roesch, UE, UIC online, UK online & chem/phys Q1.N2 & king Q1.N2 & young Q1.N2 & med W1NA81, UL kersey Q1.N2, USD online, UT online & hodges Q1.N2, }
10 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 1/23/2021
searched for zinc whisker(s) & Zn whisker(s) on 1/23/2021
searched for indium whisker(s) on 1/23/2021
searched for cadmium whisker(s) & Cd whisker(s) on 1/23/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 1/23/2021

(new reference 1/23/2021)
Hall, E. O., "Formation of Compact Pieces of Grey Tin," Nature, vol. 175 no. , pp. 165-166, 1955. https://doi-org.ezproxy.uky.edu/10.1038/175165b0

(not at UK) J. W. Price nature, 169 (1952), p. 792. *** not applicable ***

--------------------------------------------------------
Nature Physics
{ OSU online, UC online, UD online, UK online, UM online, UT online, VU online, }
1 item found as of 1/21/2021
v3#2 checked 1/21/2021

searched for tin whisker(s) and Sn whisker(s) on 1/23/2021
searched for zinc whisker(s) & Zn whisker(s) on 1/23/2021
searched for indium whisker(s) on 1/23/2021
searched for cadmium whisker(s) & Cd whisker(s) on 1/23/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 1/23/2021

--------------------------------------------------------
Naturwissenschaften
{ CSULA north QC1.S797, OSU sel Q111.E67, UC online, UD roesch, UK online & remote Q3.N7, UL health, UM online, USC x 574/.05, UT online, VU online, }
1 item found as of 1/21/2021

searched for tin whisker(s) and Sn whisker(s) on 1/23/2021
searched for zinc whisker(s) & Zn whisker(s) on 1/23/2021
searched for indium whisker(s) on 1/23/2021
searched for cadmium whisker(s) & Cd whisker(s) on 1/23/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 1/23/2021

--------------------------------------------------------
Naval-Industry R&D Partnership Conference 2003
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
NCMS Embedded Capacitance Conference
2 items found as of 1/30/2011 catalog

--------------------------------------------------------
NEC Technical Journal
NEC giho
{ http://www.nec.co.jp/techrep/en/journal/index.html FIU online, GIT main QC501.N112, LH closed, MST online, OSU sel TK4.N222, UCSD srlf TK7800.N42, UK online, UTor online, UWa online, }
4 items found as of 6/20/2021
v1#1-v15#1(21) all issues checked 6/20/2021

--------------------------------------------------------
Nederlands Tijdschrift voor Natuurkunde
{ GIT storage QC1.N4, LH closed, OSU sel QC1N37, RU fondren QC1.N39, UM hatcher QC1.N377 & buhr QC1.N377, WSU storage, }
1 item found as of 1/30/2011 catalog
v20

--------------------------------------------------------
NEMI/IPC Lead-Free Symposium
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
NEMI RoHS/Pb-Free Summit
{ }
4 items found as of 1/30/2011 catalog

--------------------------------------------------------
NEPCON Shanghai 2008
{ http://www.smta.org/knowledge/knowledge.cfm, }
12 items found as of 11/26/2020
07-08 checked 11/26/2020

*** here for SMTA 11/26/2020 *** Shangguan, D., Key Topics in Lead-Free Solder PCB Assembly. Proceedings of NEPCON Shanghai, China, 2003, pp. 111-121.

--------------------------------------------------------
2002 NEPCON West - Fiberoptic Expo Conference Proceedings
NEPCON UK
NEPCON/West
1980 Nepcon/West Conference
Proceedings of NEPCON
Proceedings of the Technical Program NEPCON East '96
Proceedings of the Technical Program NEPCON West 2000
{ http://www.smta.org/knowledge/knowledge.cfm, http://www.smartgroup.org/members/seminar.asp, GIT main-6e TK7874.N33X, IU indianapolis TK7874.N33, Lexmark TK7874.N35, LH TK7870.N3, MIT storage TK7870.N2767, OkSU main 621.3819N277p, SDSU TS195.I58, SMU sci TK7874.N33, UCSD s&e TK7874.N33, UL kersey TK7870.15.N46, UM offsite TK7870.N29 & buhr TK7870.N29, UMi richter TK7874.N33, UT hodges TK7870.N34, UTAr depos TK7874.N33, UTo depos TK7874.N33, }
>=20 items found as of 11/26/2020 catalog
64,71,74,79-81,83,85,87west,89east,90,91west,92east,92west,94east,94west, 95east,95west, 96east,96west,97east,97west,98west,99east,99west,00west,02, checked 11/26/2020

NEPCON, Birmingham, Oct. 1-3, 2002, pp. xx-xx.

NEPCON South, Brighton, Apr. 2-3, 2003, pp. xx-xx.

NEPCON North, Harrogate, Sept. 16-17, 2003, pp. xx-xx.

--------------------------------------------------------
Network World
NetworkWorldFusion
{ http://www.networkworld.com/aboutus/index.html OSU online, UD online, UK online, UM online, UT online, VU online, }
5 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/21/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/21/2020
searched for indium whisker(s) on 12/21/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/21/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/21/2020

--------------------------------------------------------
Neue Museumskunde
{ UMc depos AM49.N46, }
item found as of 1/30/2011 catalog

(new reference 2/11/2009)
W., Kurzmann, Neue Museumskunde 1960, 3, 56.

M. Keáler, Neue Museumskunde 1960, 3, 60.

--------------------------------------------------------
New Electronics
{ https://www.newelectronics.co.uk/digital-magazine/ http://www.neon.co.uk/ UK online, }
9 items found as of 1/21/2021 catalog
v36#7-v36#19,v40#1,23jul19-10sep19 checked 1/21/2021

," newelectronics, pp. , Sept. 10, 2019.

(new reference 12/30/2008)
Nevison, Gary .You must comply! New Electronics, v 37, n 6, Mar 23, 2004, p 47-48

Knivett, Vanessa .A 'green' partnership New Electronics, v 38, n 1, Jan 11, 2005, p 23-24

--------------------------------------------------------
NEWMOA Web Conference
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Newsweek
{ OSU online, UC langsam AP2.N59 & langsam microforms 5038 & cler, UD online, UK online & young AP2.N6772, UL online, UM online, UT online, VU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Nickel
{ CSULB online, SMU online, UC online, UK storage microfiche I28.92, UM hatcher HD9539.N9625, UT online, UTAr online, VU online, }
3 items found as of 1/30/2011

--------------------------------------------------------
Nikkei Electronics Asia
{ http://techon.nikkeibp.co.jp/article/HONSHI/20081229/163420/ }
11 items found as of 1/30/2011
checked 4/3/2009

--------------------------------------------------------
Nippon Steel Technical Report
{ CMU eng, OSU TS300N566, RyU online, UPi storage, UTA eng TS300.N566, UTor online, }
1 item found as of 1/30/2011 catalog
v21-v86 checked 9/18/2009

--------------------------------------------------------
NIST Tech Beat
{ http://www.nist.gov/public_affairs/techbeat/archive.htm CSULB online, SMU online, UC online, UD online, UT online, UTAr online, UTD online, VU online, }
1 item found as of 1/30/2011 catalog

*** search for whiskers and tin pest *** --------------------------------------------------------
NIST Workshop
{ UC various, UD roesch gov C13.58, VU central gov C13.10, }
1 item found as of 2/12/2011 catalog

--------------------------------------------------------
NITON Application Bulletin
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
NPL
National Physical Laboratory
{ http://eprintspublications.npl.co.uk/cgi/search/simple?exp=0%7C1%7C-date%2Fcreators_name%2Ftitle%7Carchive%7C-%7Cq%3Aabstract%2Fcreators_name%2Fdate%2Fdocuments%2Ftitle%3AALL%3AIN%3Atin%7C-%7Ceprint_status%3Aeprint_status%3AANY%3AEQ%3Aarchive%7Cmetadata_visibility%3Ametadata_visibility%3AANY%3AEQ%3Ashow&_action_search=1&order=-date%2Fcreators_name%2Ftitle&screen=Search&cache=47520&search_offset=20 -CMMT(A)297, -DEPC-MN038, -DEPC-MPR060, -MAT18, -MATC(A)164, -MATC(MN)57, -MN02, }
>=20 items found as of 9/21/2020 catalog
checked 9/21/2020

Bailey, C. Bailey, Christopher -- checked 9/21/2020 Brewin, A. Brewin, Alan -- checked 9/21/2020 Cusack, P. -- checked 9/21/2020 Di Maio, D. Di Maio, Davide -- checked 9/21/2020 Dinsdale, Alan -- checked 9/21/2020 Dusek, M. Dusek, Milos -- checked 9/21/2020 Fry, Tony -- checked 9/21/2020 Fulton, I. -- checked 9/21/2020 Gohil, Dipak -- checked 9/21/2020 Green, Simon -- checked 9/21/2020 Hitchens, Lee -- checked 9/21/2020 Hunt, C. Hunt, C. P. Hunt, Chris Hunt, Christopher -- checked 9/21/2020 Jennett, Nigel -- checked 9/21/2020 Jonck, Fredirikus -- checked 9/21/2020 Jonck, R -- checked 9/21/2020 Kamara, E. Kamara, Elisha -- checked 9/21/2020 Lea, Deborah -- checked 9/21/2020 Le Toux, Thomas -- checked 9/21/2020 Levoguer, C. Levoguer, C. L. -- checked 9/21/2020 Lu, H. Lu, Hua -- checked 9/21/2020 Lua, H., -- checked 9/21/2020 Murdoch, C. Murdock, Charles -- checked 9/21/2020 Nimmo, K. -- checked 9/21/2020 Nottay, J. Nottay, Jaspal -- checked 9/21/2020 Nunn, John -- checked 9/21/2020 Peters, S. -- checked 9/21/2020 Richards, B. P. -- checked 9/21/2020 Ridler, N. -- checked 9/21/2020 Salter, M. -- checked 9/21/2020 Subotic, B. -- checked 9/21/2020 Thomas, O. Thomas, Owen -- checked 9/21/2020 Tomlins, P. E. -- checked 9/21/2020 Wickham, M. Wickham, M. J. Wickham, Martin -- checked 9/21/2020 Willis, B. -- checked 9/21/2020 Zou, L. Zou, Ling -- checked 9/21/2020 CMMT(A) 27, 41, 168, 170, 199, 213, (214), 243, 268, 273, 274, 277, 284, 297 DEPC-MN 001, 021, 038 DEPC-MPR 005, 014, 021, 028, 030, 031, 032, 033, 036, 038, 039, 044, 045, 046, 047, 048, 054, 058, 060 MAT 1, 2, 4, 6, 10, 15, 18, 21, 26, 28, 29, 35, 36, 38, (64) MATC(A) 11, 12, 18, 47, 50, 51, 55, 69, 73, 79, 83, 85, 89, 91, 106, 107, 109, 119, 122, 128, 141, 148, 155, 156, 157, 163, 164 MATC(MN) 57 MN 2 --------------------------------------------------------
NS Electronics Bangkok Technical Conference
item found as of 1/30/2011 catalog

Layson, Arlene V., Qualification of Matte Tin as an Alternative for Tin lead no. S Electronics Bangkok Technical Conference Taipei, Taiwan Dec. 2002 pag 61.

--------------------------------------------------------
NSF-MUSES Workshop
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
2004 NSTI Nanotechnology Conference and Trade Show
{ UM offsite T174.7.N3735, UOk bizzell T174.7.N368, UTor eng T174.7.N373752, UWa davis TK7874.N3195x, }
1 item found as of 6/11/2015 catalog
03-04 checked 6/11/2015

--------------------------------------------------------
Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
{ https://www.sciencedirect.com/journal/nuclear-instruments-and-methods-in-physics-research-section-a-accelerators-spectrometers-detectors-and-associated-equipment/issues IU online, MST online, OkSU online, OSU online & sel QC786A1N83, PU online & phys 539.7N877a, SDSU online, SIUC storage 50962-6814, UAr mullins QC786.N75, UC online & phys QC786.N754, UCI online & sci QC785.5N824, UCSD online, UD online, UK online & chem/phys QC785.5.N82, UL ekstrom QC786.N76, UM online, UOk online, UT hodges QC786.N75, UTo online & carlson, }
2 items found as of 1/21/2021
v577#3 checked 1/21/2021

-------------------------------------------------------
Nuclear Procurement Issues Committee (NUPIC) Meeting
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
(new source 6/30/2020)
Nukleonik
{ }
(new reference 6/30/2020)
[fiedler 6] G. Pawlicki, Nukleonik. 1"2,1123 (1967). --------------------------------------------------------
Nutrition Action Health Letter
{ https://www.thefreelibrary.com/Nutrition+Action+Healthletter-p262 OSU online, UC langsam TX341.N87, UK online, UM online, UT online, VU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Nuts and Volts
{ SIUC online, }
1 item found as of 4/3/2021
v26#1-v31#9,v31#11-v33#10,v33#12-v35#5,v35#7-v36#3,v36#5-v38#3,v38#5-v39#7, v40#1-2020#3 checked 4/3/2021

OOOO--------------------------------------------------------
Oberflachen Polysurfaces
{ LH closed, }
1 item found as of 1/30/2011

--------------------------------------------------------
Second OECD Workshop on Environmentally Sound Management of Wastes Destined for Recovery Operations
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
OEN
{ UMi online, }
item found as of 1/30/2011 catalog

WEEE update and industry comment [electronic product recycling] oen, June 2005, p 16-18

--------------------------------------------------------
Official Board Markets
{ AU online, FIT online, FSU online, GIT online & main-4w HD9839.P3O33, IU online, OSU online, SIUC online, SU online, UCSD online, UDe online, UF online, UM online, UMC online, UNF online, UOk online, USF online, UTo online, WrSU online, }
item found as of 1/30/2011

--------------------------------------------------------
OKI Technical Review
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
OnBoard Technology
{ }
9 items found as of 1/30/2011 catalog

--------------------------------------------------------
Optics and Laser Technology
{ https://www.sciencedirect.com/journal/optics-and-laser-technology/issues FAU online, FIU online, MST online, OkSU online, OSU online, SDSU online, TTU, UAr online, UCSD online, UK online sd (pay), UL online & kersey QC350.O66, UMi online, UOk online, UT online, }
3 items found as of 7/10/2021
v41#1-v142(21) checked 7/10/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

--------------------------------------------------------
2001 Optoelectronics and Telecom Proceedings
{ http://www.smta.org/knowledge/proceedings.cfm, }
items found as of 11/26/2020
01 checked 11/26/2020

--------------------------------------------------------
(new source 6/22/2020)
osti.gov
{https://www.osti.gov/search/, }
>= 20 items found as of 6/22/2020

2755 14961 83040 91947 97035 106617 109509 128669 186727 206566 208383 219457 221940 258183 378903 383632 448091 486010 486150 527902 537385 642720 666160 676869 750240 759050 761872 770407 783992 929522 990960 1022184 1038184 1078507 1078793 1096472 1106056 1106066 1106204 1106224 1106613 1107712 1114620 1114643 1116374 1117341 1117431 1118304 1118335 1118705 1124209 1124250 1140291 1140729 1141068 1141880 1141886 1142136 1142243 1142490 1142641 1142781 1143520 1146081 1146122 1146848 1146922 1148152 1182977 1213651 1236220 1264067 1264073 1266905 1267094 1268182 1278777 1299980 1314574 1315425 1347531 1356221 1413990 1427290 1427292 1456330 1465848 1487428 1502148 1508891 1510414 1594273 10103434 10111920 10130317 10169303 10173365 10196570 --------------------------------------------------------
Overcoming the Reliability Challenge: An IPC Summit
15 items found as of 1/30/2011 catalog
08 checked 9/21/2008

PPPP--------------------------------------------------------
Paint & Powder
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Pakkred Technical Conference
item found as of 1/30/2011 catalog

Sriyarunya, Anocha, Lead-Free Plating on Integrated Circuits, AMD(Thailand) LTD. Pakkred Technical Conference Taipei, Taiwan Dec. 2002 pag 94

Stoney, G. G., Proc. R. Soc, 82, 173, 1909.

--------------------------------------------------------
2009 Pan Pacific Microelectronics Symposium & Exhibit
Pan Pacific Microelectronics Symposium
2006 Pan Pacific Symposium Conference Proceedings
{ http://www.smta.org/knowledge/knowledge.cfm, http://www.circuitinsight.com/, }
>=20 items found as of 11/26/2020
97,99-20 checked 11/26/2020

--------------------------------------------------------
Partners in Environmental Technology Technical Symposium and Workshop
{ }

item found as of 7/25/2012 catalog

(new reference 7/25/2012)
Meschter and Snugovsky, "Tin-Whisker Testing and Modeling (SERDP-1753)" Partners in Environmental Technology Technical Symposium and Workshop, Washington, D.C., November 30-December 2, 2010.

--------------------------------------------------------
Passive Component
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Passive Component Industry
{ http://www.passivecomponentmagazine.com/pci-magazine-archives/, }
1 item found as of 12/10/2013
checked ?

--------------------------------------------------------
Nth Passive Components Symposium
25th Annual Passive Components Conference
Proceedings of the 25th Symposium for Passive Components
{ }
>=20 items found as of 12/8/2013 catalog
05 checked 12/8/2013

--------------------------------------------------------
Passivity of Metals and Semiconductors
{ OSU sel QD501.I597, UC sw depos QD501.I6345, UT hodges QD501.I6345, VU annex QD501.I6345, }
1 item found as of 1/30/2011

--------------------------------------------------------
Pb-Free Workshop
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
PC Fab
Printed Circuit Fabrication
( EBSCOB, CSULA online, MSU online, UK online, UM online, UTAr online, UTD online, }
>=20 items found as of 8/2/2021 catalog
v21#1-v26#4(09,ended publication) checked 8/2/2021

--------------------------------------------------------
PC Week
{ http://www.zdnet.com/, OSU online, UK online & young oversize QA75.5.P37, UM online, UT online, VU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
PCB Design Conference East xxxx
PCB West
item found as of 1/30/2011 catalog

Maria Leet Socolof, and Jack R. Geibig, "Life Cycle Assessment of Lead-Free Solder," PCB Design Conference East 2004, Manchester, NH, Oct. 5-6, 2004. E-mailed 11/19/2007

Geibig, Jack, and Socolof, Maria, jgeibig@utk.edu. "Lifecycle Assessment of Lead-free Solders in the Electronics Industry: Application and Insights" (PCB Design West, Mar. 2005)

--------------------------------------------------------
PCB Update
{ }
12 items found as of 1/30/2011 catalog

--------------------------------------------------------
PCB007
{ http://www.pcb007.com/ }
>=20 items found as of 1/30/2011 catalog
checked 4/3/2009

--------------------------------------------------------
1998 PCIM Conference
PCIM Inter `98 Japan Conference
{ UTD online, }
1 item found as of 1/30/2011 catalog

(new reference 6/5/2009)
> Prymak, John, "Low ESR Tantalum Developments for SMPS Applications," PCIM Inter `98 Japan Conference, Japan, Apr. 1998.

--------------------------------------------------------
Personal Engineering
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Philosophical Magazine
Philosophical Magazine A: Physics of Condensed Matter, Structure, Defects and Mechanical Properties
London, Edinburgh and Dublin Philosophical Magazine and Journal of Science
{ https://www.tandfonline.com/loi/tphm20 https://www.tandfonline.com/loi/tpha20 CSULA online, CSULB orca QC1.P55, FAU online & wimberly Q1.P5, FIU green Q1.P5, KU anschulz Q1.P5, MST depos 505P54, MSU remote Q1.P5, NWU sci 530.5L84, OkSU online, OSU online & Q1P586, PU phys 530.5P54s, SDSU Q1.P5, SIUC online, TTU, UAr online, UC phys Q1.P5, UCF online, UCSD online, UIC warehouse Q1.P5, UK online & chem/phys QC1.A36, UL kersey Q1.P5, UM online, UMi online & richter Q1.L8, UOk online, USC online, UT online & hodges Q1.P5, UTo depos, WSU sci & storage, WUSL westc QC1.P36, }
>=20 items found as of 1/21/2021
searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

(new reference 6/22/2020)
G. W. Sears. On the formation and properties of helical dislocations. Phil. Mag., 2:355-377, 1957. -------------------------------------------------------
Philosophical Magazine Letters
{ https://www.tandfonline.com/loi/tphl20 IU online & swain QC176.A1P49, MST online, OkSU online, OSU online & sel QC1P47, PU online & phys 530.5P54L, SIUC online, SIUE lovejoy, UAr online, UC online & phys Q1.P52, UCI online & sci Q1P512, UCSD online, UK online & chem/phys QC176.A1P4420, UM online, UNCC online, UOk online, USD online, UT online & hodges Q1.P53, UTo online & carlson, }
2 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 7/20/2020

searched for zinc whisker(s) and Zn whisker(s) on 9/17/2020
searched for indium whisker(s) on 9/17/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/17/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/17/2020

-------------------------------------------------------
Photonics Spectra
{ http://www.photonicsspectra.com/google/, CPL washington, IU QC350.O624, MST wilson TS510.O6, NWU sci 535.8405O62, OkSU stillwater 681.405P575, PU hicks 535.05Op71, SIUC storage 56191-6811, SIUE lovejoy, UC phys QC350.O66, UCSD s&e QC1.O6186, UD roesch, UIC warehouse TS510.O6, UM shapiro QC350.O622, UT online & hodges TS510.O6, }
item found as of 5/15/2014
-Dec08,Oct11,Dec11-Apr12 checked 5/15/2014

------------------------------------------------------
Photonics Tech Briefs
{ http://www.ptbmagazine.com/, }
1 item found as of 1/30/2011
-Mar09 checked 4/3/2009

-------------------------------------------------------
Physica
{ https://www.sciencedirect.com/journal/physica/issues OSU depos QC1.B64, UC online, UD roesch, UK online & remote QC1.P38, UL robotic QC1.P38, UM online, }
4 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

-------------------------------------------------------
Physica B: Condensed Matter
{ https://www.sciencedirect.com/journal/physica-b-condensed-matter/issues IU online & bloomington swain QC1.P4532 & alf QC1.P4532, MST online, NWU online & sci 530.5P5784, OkSU online, OSU online & sel QC1P5619213, PU online, SDSU online, SIUC online, SIUE lovejoy, TTU, UAr online, UC online & phys QC1.P45, UCSD online, UIC sci QC1.P38332, UK online sd, UL online & kersey QC1.P3832, UM online & shapiro QC1.P578131, UMe mcwherter, UT online & hodges QC1.P3814, }
5 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

-------------------------------------------------------
(new source 6/28/2020)
Physica D: Nonlinear Phenomena
{ https://www.sciencedirect.com/journal/physica-d-nonlinear-phenomena/issues UK online, }
-------------------------------------------------------
Physica E: Low-dimensional Systems and Nanostructures
{ https://www.sciencedirect.com/journal/physica-e-low-dimensional-systems-and-nanostructures/issues OSU online, UC online, UK online & remote QC1.P387, UL online, UM online, UT online, VU online, }
1 item found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

-------------------------------------------------------
Physica Scripta
{ https://iopscience.iop.org/journal/1402-4896 OSU online, UC online, UD online, UK online & remote QC1.P392, UL online, UM online, UT online, VU sci various, }
1 item found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/22/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/22/2020
searched for indium whisker(s) on 12/22/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/22/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/22/2020

--------------------------------------------------------
Physica Status Solidi
Physica Status Solidi. A, Applications and materials science
Physica status solidi. A, Applied Research
{ https://onlinelibrary.wiley.com/loi/15213951 https://onlinelibrary.wiley.com/loi/18626319 IU bloomington alf QC176.A1P522, MST online, NWU online & sel 539.205P578, OkSU online, OSU sel QC1P564, PU online & phys 530.5P562 & 530.4105P569a & 530.4105P569b, SDSU QC176.A1P5, SIUC online, SIUE storage, TTU, UAr mullins QC176.A1P5, UC online & phys QC176.A1P4, UCSD online, UD online & roesch, UIC warehouse QC176.A1P5, UK online & chem/phys QC176.A1P5 & storage QC176.A1 P5, UL kersey QC176.A1P5 & QC176.A1P513, UM online & shapiro QC1.P579, UOk online, UT online & hodges & closed QC176.A1P5, }
16 items found as of 1/21/2021
v23#2 checked 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/19/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/19/2020
searched for indium whisker(s) on 12/19/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/19/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/19/2020

-------------------------------------------------------
Physical Metallurgy of Metal Forming
{ }
1 item found as of 12/22/2020
searched for tin whisker(s) and Sn whisker(s) on 12/22/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/22/2020
searched for indium whisker(s) on 12/22/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/22/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/22/2020

--------------------------------------------------------
Physical Review
{ https://journals.aps.org/archive/browse CBU, MST online, NWU sci L530.5P578, OkSU online, OSU online & sel QC1S6805, SDSU online, SIUC online, SIUE online, TTU online, UAr online, UCSD online, UE, UK chem/phys QC1.P4, UL kersey QC1.P4, UOk online, USD online, UT online & hodges QC1.P4, }
17 items found as of 12/22/2020
searched for tin whisker(s) and Sn whisker(s) on 12/22/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/22/2020
searched for indium whisker(s) on 12/22/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/22/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/22/2020

--------------------------------------------------------
Physical Review Applied
{ https://journals.aps.org/prapplied/ UK online, UM online, }
5 items found as of 6/20/2021
v1#1-v15#5(21) all issues checked 6/20/2021
searched for tin whisker(s) and Sn whisker(s) on 12/22/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/22/2020
searched for indium whisker(s) on 12/22/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/22/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/22/2020

(new reference 2/26/2021)
," Physical Review Applied, vol. 15 no. 4, pp. , Mar. 2021.

A. Attiaoui, É. Bouthillier, G. Daligou, A. Kumar, S. Assali, and O. Moutanabbir Phys. Rev. Applied 15, (2021) – Published 20 January 2021 Extended Short-Wave Infrared Absorption in Group-IV Nanowire Arrays ," Physical Review Applied, vol. 15 no. 1, pp. 014034-1-014034-, Jan. 2021. https://doi.org/10.1103/PhysRevApplied.15.014034

--------------------------------------------------------
(new source 6/25/2020)
Physical Review B
{ https://journals.aps.org/prb/ UK online, }
15 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 7/20/2020

searched for zinc whisker(s) & Zn whisker(s) on 9/7/2020
searched for indium whisker(s) on 9/7/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/7/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/7/2020

Example http://dx.doi.org/10.1103/PhysRevB.volume.page --------------------------------------------------------
Physical Review Letters
{ https://journals.aps.org/prl/ IU online & bloomington swain QC1.P51 & alf QC1.P51, MST online, NWU online & sci L530.5P57811, OkSU online, OSU online & sel QC1P571 & depos QC1P571, PU online & chem 530.5P56a & phys 530.5P56a & hicks 530.5P56a, SDSU online, SIUC online, SIUE online, TTU online, UAr online, UC online & phys QC1.P48, UCSD online, UD online & roesch remote, UE, UIC sci, UK online & chem/phys QC1.P4 & QC1.P43, UL kersey QC1.P4315 & QC1.P432, UM online & shapiro QC1.P5813 & buhr QC1.P5813, UOk online, USD online, UT online & hodges QC1.P43, }
6 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 7/20/2020

searched for zinc whisker(s) & Zn whisker(s) on 9/17/2020
searched for indium whisker(s) on 9/17/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/17/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 12/22/2020

--------------------------------------------------------
Physics Letters A
{ https://www.sciencedirect.com/journal/physics-letters-a/issues IU online, MST online, OkSU online, OSU online, PU online & chem 530.5P56415a & phys 530.5P56415a, SDSU online, SIUC online, SIUE online, UAr online, UC online, UCI online & sci QC1.P656, UK online & chem/phys QC1.P45, UM online, UOk online, UT online & hodges QC1.P653, UTo online & carlson & nw depos, }
2 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 7/20/2020

searched for zinc whisker(s) and Zn whisker(s) on 8/13/2020

searched for indium zinc whisker(s) on 8/13/2020

searched for cadmium whisker(s) and Cd whisker(s) on 8/13/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

--------------------------------------------------------
Physics of Metals and Metallography

{ https://link.springer.com/journal/11508/volumes-and-issues UK online, }
1 item found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 11/27/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/27/2020
searched for indium whisker(s) on 11/27/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/27/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/27/2020

(new reference 9/5/2020)
1. G. DEMCHUK, A. A. KRALINA AND YE. P. ROMANOV, Phys. Met. and Metallog., 17 (1964) No. 3, 54.

-------------------------------------------------------
Physics Today
{ https://physicstoday.scitation.org/toc/pto/current CBU, IU online & bloomington swain QC1.P54 & alf QC1.P54, KYVL, MST online, NWU online & sci 530.5P5787, OCU beam OcSU online, OSU online & sel QC1P5753, PU phys 621.05In25 & 530.5P5642 & chem 530.5P5642, SDSU online, SIUC online, SIUE lovejoy, TTU, UAr online, UC phys QC1.P65, UCSD online, UD online & roesch, UE, UIC online & sci QC1.P658, UK online & chem/phys QC1.P658, UL kersey QC28.I49 & QC1.P658, UM online & shapiro QC1.P583, UOk online, USD online, UT online & hodges QC1.P658, }
3 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/20/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/20/2020
searched for indium whisker(s) on 12/20/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/20/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/20/2020

--------------------------------------------------------
(new source 9/15/2020)
Physik der kondensierten Materie
{ }
1 item found as of 9/15/2020

--------------------------------------------------------
Physikalische Zeitschrift der Sowjetunion
{ IU bloomington alf QC1.P574, NWU sci 530.5P5785, OSU sel compact QC1P582, PU phys 530.5P568, UAr storage QC1.P77, UC phys QC1.P75, UM buhr QC1.P587, UOk bizzell QC1.P77, }
1 item found as of 1/30/2011

--------------------------------------------------------
Pigment & Resin Technology
{ https://www.emerald.com/insight/publication/issn/0369-9420 CSULA online, OSU online, SMU online, UC online, UD online, UK online, UM online, USC TP934.P342, UTD online, VU online, }
6 items found as of 1/21/2021
searched for tin whisker(s) & Sn whisker(s) on 11/29/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/29/2020
searched for indium whisker(s) on 11/29/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/29/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/29/2020

--------------------------------------------------------
Plant Engineer (London)
{ AU rbd TJ164.I643, LH closed, }
item found as of 1/30/2011 catalog

Cork, Laura Recovery position Plant Engineer (London), vol. 50 no. 3, May/June 2006, p 22-23

--------------------------------------------------------
Plastic Design & Processing
{ }
(new reference 12/23/2013)
Portable Metallizing Sytem Apr 1978

-------------------------------------------------------
Plastics Additives and Compounding
Plastics, Additives & Compounding
{ https://www.sciencedirect.com/journal/plastics-additives-and-compounding/issues MST online, OkSU online, OSU online, SDSU online, UCF online, UCSD online, UM online, UT online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Plastics Design Forum
{ UC sw depos TP1101.P5115, }

(new reference 12/23/2013)
Shielding Against Mar/Apr 1979

Litman Mar/Apr 1981 p 68-81

--------------------------------------------------------
Plastics Engineering
{ https://www.onlinelibrary.wiley.com/loi/19419635 AU online, CBU, FIU online, FSU online, GIT online & main-6e TP1101.52X, Lexmark, LH closed, LU gray TP986.A1S573, MST online, NWU sci L668.405S111, OCU beam, OkSU online, OrSU valley TP986.A1S2, OSU sel TP986.A1S62, PU eng 668.45So15 & hicks 668.45So15, RU online, SDSU online, SIUC morris 53832-6732, SU online, UAr online, UC eng TP986.A1S15, UCF main TP986.A1S573, UCSD s&e TP1.S64, UDe online, UF online, UIC online, UIUC online, UK eng TP1101.P513, UM online, UMC online, UMi online, UNF online, UPi online, USF online, UTA online, UTo carlson, WrSU dunbar TP1101.P513, }
5 items found as of 8/11/2021 catalog
v62#1-v77#6(21) 78/112021

--------------------------------------------------------
Plastics Engineering EUROPE
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Plastics Technology
{ http://www.ptonline.com/ EBSCOA, EBSCOB, IU online, Lexmark, MST online, NWU online & sci 668.405P717, OSU online & sel TP986A1P72, PU eng 668.45P698 & hicks 668.45P698, SDSU online, SIUE online, UAr online, UC cas TP1101.P557 & eng TP1101.P557, UCSD online, UD roesch, UIC online & warehouse TP1101.P557, UK online & eng TP1101.P557 & eng microfilm S-33, UL kersey TP986.A1P529 & film x31TO22, UM online & buhr TP986.A1P74, USD online, UT online, }
10 items found as of 8/6/2021
v52#2-v67#8(21) checked 8/6/2021

--------------------------------------------------------
Plastics World
{ OSU depos TP986.A1P74, UC ceas TP1101.P562, UL robotic TP1101.P562, UM online, UT hodges TP986.A1P7, VU online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Plating and Surface Finishing
Monthly Review American Electroplaters Society
Plating
Plating: Monthly Review American Electroplaters Society
{ http://www.sterc.org/subs/psf.php https://www.tib.eu/en/search/id/TIBKAT%3A129430722/Plating-and-surface-finishing-journal-of-the-American/ AU rbd TS670.P5, CMU eng, CSULB online, IU indianapolis, Lexmark, MIT hayden TS.P716 & storage TS.P716, MST wilson TS670.A3, MSU eng TS670.A1P5, NEU snell T1.P3810, NWU sci L671.7305P716, OkSU main 671.05P7161, OSU depos TS670A1A5, SIUC morris 53835-6712, SMU sci, UC depos TS670.A3 & eng TS670.A3, UCSD s&e TS1.P73, UD roesch 2nd, UH TS670.A1P55, UIC warehouse TS670.A3, UM shapiro TS670.A1A5 & buhr TS670.A1A5 & buhr TS670.A1A51 & buhr TS670.A1A51B, UTAr depos TS670 .A3, UTD TS670.A3, UWa annex TS670.A3, }
>=20 items found as of 5/15/2014 catalog
v11-v12,v18,v31,v34-v95#12 checked 5/15/2014

--------------------------------------------------------
Politecnico
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Pollution Engineering
{ MST online, OCU beam, OkSU online, OSU online, PU eng 628.505P766, SDSU online, SIUC online, UAr online, UCI online & sci TD172P66, UD online & roesch, UK online, UL TD172.P66, UM online, USD online, UT online & hodges TD172.P66, UTo online & carlson, }
1 item found as of 1/21/2021

-------------------------------------------------------
Polymer
{ https://www.sciencedirect.com/journal/polymer/issues MST online, SDSU online, SIUC online, UAr storage TP156.P6P6, UCSD online, UK online sd, UM aael closed TP156.P6P67, USD online, UT online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Polymer Degradation and Stability
{ https://www.sciencedirect.com/journal/polymer-degradation-and-stability/issues AU online, FSU online, GIT online, LH closed, MST online, NWU online, OrSU valley QD380P637, OSU online, PU online, RU online, SDSU online, UC online, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UIUC online, UK online & eng QD380.P637, UM online, UMC online, UNF online, UOk online, USF online, USU online, UT online, UTA online, UTo online, WrSU online, }
1 item found as of 1/21/2021
v88#1 checked 1/21/2021

--------------------------------------------------------
Polymer Engineering and Science
{ https://onlinelibrary.wiley.com/loi/15482634 IU online & bloomington alf TP986.A1S5722, Lexmark, MST online, NWU online & sci L668.405P783, OCU beam microfiche, OkSU online, OSU online & sel TP986A1S7, PU online & eng 668.405So13 & hicks 668.405So13, SDSU online, SIUC online, UAr online, UC online & eng TP986.A1S25, UCSD online, UD online & roesch, UIC online & daley TP986.A1S5722, UK online & eng TP986.A1.S5722, UL kersey TP1101.P564 & film x31TP23, UM online & buhr TP986.A1S674, UOk online, USD online, UT online & hodges TP986.A1S5722, }
2 items found as of 1/21/2021

--------------------------------------------------------
Polymer Preprints (American Chemical Society)
{ CBU, FSU dirac 540.5A5121, GIT online & QD281.P6A53c, IU online, MST online, SIUC storage P001350, TTU QD281.P6A53, UAr mullins QD281.P6A53, UCF main QD281.P6A53, UCSD s&e QD1.A505, UIC online, UOk online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Polymeric Materials Science and Engineering
Gaofenzi Cailiao Kexue Yu Gongcheng
{ LH closed, MIT hayden TP935.A512 & storage TP935.A512, MST wilson TP934.C63, NWU sci 668.905P7834, OkSU main 668.905P783, SMU sci TP935.A515, UAH n1, UCSD s&e TP1105.C6, UF sci TP935.A515, UNCC compact QD380.P65, USC grand, UTo online, UTor eng TP156.C57A53, UWa davis TP935.A515, }
item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Peng, Jun-Hua, Wu, Bo-Lin, Feng, Xiao-Ming, Tan, Song-Ting .Surface morphology and electrical conductive properties of Cu-coated polyester powder prepared by electroless plating Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering, v 24, n 7, July, 2008, p 74-76+81 Language: Chinese

--------------------------------------------------------
Polymers for Advanced Technologies
{ https://onlinelibrary.wiley.com/loi/10991581 AU online, BYU online, FSU online, GIT online, IU online, LH closed, MST online, NWU online, OkSU online, RU online, SDSU online, SIUC online, UAB online, UAr online, UC online, UCF online, UCI online, UCSD online, UF online, UIC online, UIUC online, UK online wiley, UM online, UMC online, UNF online, UOk online, USD online, USF online, USU online, UT online, UTo online, WrSU online, }
1 item found as of 1/21/2021
v19#7 checked 1/21/2021

--------------------------------------------------------
Polymers Paint Colour Journal
{ MSU online, NWU online, OSU online, SIUC online, UIC online, UT online, WSU online & sci, }
1 item found as of 1/30/2011

--------------------------------------------------------
Portable Design
{ OSU online, UD online, UK online, UM online, VU online, }
2 items found as of 1/21/2021

(new reference 12/23/2013)
Russell Feb 1999 "power Protection Comes to Fore in Today's Shrinking System Designs"

(not at UK) --------------------------------------------------------
Portuguese Conference on Artificial intelligence
EPIA
{ IEEE XPLORE (05), }
1 item found as of 8/3/2021
05 checked 8/3/2021

--------------------------------------------------------
Powder Metallurgy
{ https://www.tandfonline.com/loi/ypom20 CSULA online, CSULB online, OSU depos TN695.A1P5, UC ceas TN695.P675 & sw depos TN695.P675, UK online & remote TN695.P63, UM online, USC grand, UT online, VU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Power 2001
{ UK online, UM hatcher PS634.F41, }
1 item found as of 1/21/2021

--------------------------------------------------------
Power Architecture Community Newsletter
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Power Conversion & Intelligent Motion
{ https://www.jstage.jst.go.jp/browse/jipe1995/list/-char/en }
3 items found as of 1/30/2011 catalog

--------------------------------------------------------
Power Conversion Proceedings
{ }

(new reference 12/23/2013)
Clark, O. M., "Immunization Solid State Controls from Electrical Overstress," Oct. 1990, pp. 77-81

--------------------------------------------------------
Power Electronics
Power Electronics Technology
{ http://powerelectronics.com/ IU online, MST online, NWU online, OkSU online, OSU online, PU eng 621.381505P87, SDSU online, SIUC online, UCSD online, UIC online, UOk online, USD online, UT online, }
19 items found as of 12/30/2013 catalog
v31#1-v37#4,Jul13 checked 12/30/2013

(new reference 12/23/2013)
Clark, O. M., "Transient Voltage Suppresser: Types and Applications," 1990, pp. 20-26.

--------------------------------------------------------
Power Engineer
IET Power Engineer
Power Engineering Journal
{ IEEE XPLORE (v17#1-), UK online, (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/2/2021
v17#1(03)-v21#6(07,ended publication) checked 8/2/2021

--------------------------------------------------------
2012 Power Forum
{ }
1 item found as of 12/12/2013
checked 12/12/2013

--------------------------------------------------------
Power Management DesignLine
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Powertechnics
{ }
1 item found as of 1/30/2011 catalog

(new reference 12/23/2013)
Maytum v 5 no 1 Jan 1989 p 43-44

--------------------------------------------------------
PR Newswire
{ http://www.prnewswire.com/, OSU online, UD online, Uk online, UM online, VU online, } 1 item found as of 1/21/2021

--------------------------------------------------------
Practical Lead-Free Rework & Repair Workshop
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Practical Metallography
Praktische Metallographie
{ AU rbd TN690.P65, LH closed, OSU sel TN690.A1P7, UF sci TN690.P65, UIUC main 669.9505PR, UK remote TN690.P65, UTor eng TN690.P73, }
1 item found as of 1/30/2011
v44#10 checked 10/25/2009

--------------------------------------------------------
Printed Circuit Board Specification and Procurement Workshop
{ }
1 item found as of 1/30/2011 catalog

-- ------------------------------------------------------
Printed Circuit Design and Fab/ Circuits Assembly
Printed Circuit Design
Printed Circuit Design and Fab
Printed Circuit Design and Manufacture
{ https://www.pcdandf.com/pcdesign/index.php/2020-magazine-archive https://www.thefreelibrary.com/Printed+Circuit+Design+%26+Fab-p2985 https://www.thefreelibrary.com/Printed+Circuit+Design+%26+Fab+Circuits+Assembly-p24499 https://www.thefreelibrary.com/Printed+Circuit+Design+%26+Manufacture-p2327 AU online, CSULA online, CSULB online, FIU online, GIT-6e TK7868.P7P37x MIT online, MSU online, NEU online, OkSU online, RyU online, SDSU online, SMU online, UCI sci TK7867.P756, UF online, UK online, UMi online, UNCC online, UNF online, UOk online, USC TK7867.P756, USD online, UT online, UTAr online, UTD online, UTo online, UTor online, WSU online, }
>=20 items found as of 8/11/2021
v1#2-v38#8 checked 8/11/2021
searched for tin whisker(s) and Sn whisker(s) on 12/20/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/20/2020
searched for indium whisker(s) on 12/20/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/20/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/20/2020

--------------------------------------------------------
Printed Circuit Europe
{ }
2 items found as of 1/30/2011 catalog

--------------------------------------------------------
Printed Circuit Fabrication
{ AU online, CSULB online, FIT online, FIU online, GIT online & main-6e TK7874.P75X, Lexmark, LH closed, MIT online, MSU online, NEU online, NWU online, OkSU online, OSU online, RyU online, SDSU online, SIUC online, SMU online, UCB online & eng TK7868.P7P75, UCF online, UCI online & sci TK7868.P7P75, UCSD online, UF online, UM online, UMi online, UNCC online, UNF online, UOk online, USD online, USC TK7868.P7P75, UT online, UTA online & eng TK7868.P7P75, UTAr online, UTD online, UTor online, VU online, WSU online, }
13 items found as of 8/2/2021 catalog
v6#1-v7#6,v8#1-v26#3(ended publication) checked 8/2/2021

--------------------------------------------------------
(new source 7/1/2020)
Procedia Manufacturing
{ https://www.sciencedirect.com/journal/procedia-manufacturing/issues }
1 item found as of 11/7/2020

--------------------------------------------------------
Proceedings - A&WMA Annual Meeting
Proceedings of the Air & Waste Management Association's Annual Meeting
{ CBU online, GIT main-5e TD881.A52C (CDROM), OSU sel file TD884.A1S6, UC online, UCI sci TD881.A345, }
item found as of 1/30/2011 catalog

Raybourn, Michael, Weber, Jo Ann Proposition #65 risk assessment for arsenic and hexavalent chromium Proceedings - A&WMA Annual Meeting, vol. 4, 1989, 23p

Freeman, Gary R, Holliday, Ronald B. Toxic materials and flight safety. The aerospace industry struggles with chromium substitution Proceedings - A&WMA Annual Meeting, vol. 5, 1989, 17p

--------------------------------------------------------
Proceedings of the Academy of Science of the USSR
Doklady Akademii nauk SSSR
{ AU rbd closed Q60.A52, FSU online & dirac 550.5A3131y, GIT main AS262.S3663, KU anschulz AS262.S3663, MSU eng TP185.A4 & sci QD453.A1 A37, NWU online & sci 541.06A313p, OkSU stillwater 550.6A313d, OSU sel QA1.S6819 & sel QD1A318 & sel QD1.A325 & depos AS262A6257SERA, PU hicks 550.6Ak1pGE, SIUE storage, UAB sterne AS262.S3663, UAr mullins TP1.A34, UC chem QD1.A35 & lloyd AS262.S3663, UCF main QK1.A35913, UF sci Q4.A42x, UI main fAS262.A623, UIC daley TP1.A34 & various, UK eng TP1.A34 & King AS262.S3663, UL ekstrom QD1.A352 &, UL kersey QD1.A352, UM online & buhr QE1.A2783 & buhr TP1.A323 & shapiro QE1.A2783 & shapiro QD1.A353 & shapiro QD1.A353 & hatcher AS262.P53, UNL ldrf AS262.S3663, UT hodges QE1.A25183, UTo carlson, WSU sci, }
2 items found as of 1/30/2011

--------------------------------------------------------
Proceedings of the ACS Division of Polymeric Material
Polymeric Materials: Science and Engineering
{ UM offsite TP935.P65, USC grand, UTor eng TP156.C57A53, }
item found as of 11/3/2013 catalog
01

Iezzi, Robert A, CRITICAL PROCESS PARAMETERS AFFECTING THE CORROSION RESISTANCE OF ZINC-RICH ORGANIC COATINGS. Polymeric Materials Science and Engineering, Proceedings of the ACS Division of Polymeric Material, vol. 51, 1984, p 243

--------------------------------------------------------
Proceedings of the 20th AESF/EPA Conference for Environmental Excellence
10th AESF/EPA Conference on Environmental Control for the Metal Finishing Industry
2002 AESF/EPA Conference for Environmental Excellence
22nd AESF/EPA Conference for Environmental Excellence
2004 AESF/EPA Conference for Environmental & Process Excellence
18th AESF/EPA Pollution Prevention and Control Conference
Proceedings 14th AESF/EPA Conference on Environmental Control for the Surface Finishing Industry
Proceedings AESF/EPA Conference for Environmental Excellence
Proceedings 2004 AESF/EPA Conference for Environmental & Process Excellence
Proceedings of the 19th AESF/EPA Pollution Prevention and Control Conference
{ http://www.nmfrc.org/subs/conf.cfm, IU bloomington wells, }
>=20 items found as of 1/30/2011 catalog
93-95,97-04

," 7th AESF/EPA Conference on Pollution Control for the Metal Finishing Industry, Orlando, FL, Jan. 27-29, 1986, pp. xx-xx.

," 8th AESF/EPA Conference on Pollution Control for the Metal Finishing Industry, Sept. 1987, pp. xx-xx.

," 9th, 1988, pp. xx-xx.

," 10th AESF/EPA Conference on Environmental Control for the Metal Finishing Industry, 1989, pp. xx-xx.

," 11th AESF/EPA Conference on Environmental Control for the Surface Finishing Industry, 1990, pp. xx-xx.

," Proceedings of the 12th Annual AESF/EPA Conference on Environmental Control for the Surface Finishing Industry, Orlando, FL, Jan. 28-30, 1991. pp. xx-xx.

," Proceedings 13th AESF/EPA Conference on Environmental Control for the Surface Finishing Industry, Orlando, FL, Jan. 27-29, 1992, pp. xx-xx.

." Proceedings 14th AESF/EPA Conference on Environmental Control for the Surface Finishing Industry, Jan. 1993, pp. xx-xx.

," 15th AESF/EPA Pollution Prevention and Control Conference, Orlando, FL, Jan. 24-27, 1994, pp. xx-xx.

," 16th AESF/EPA Pollution Prevention and Control Conference, Orlando, FL, Feb. 13-15, 1995, pp. xx-xx,

," 17th AESF/EPA Pollution Prevention and Control Conference, Orlando, FL, Feb. 5-7, 1996, pp. xx-xx.

," 18th AESF/EPA Pollution Prevention and Control Conference, Orlando, FL, Jan. 27-29, 1997, pp. xx-xx.

," Proceedings of the 19th AESF/EPA Pollution Prevention and Control Conference, Orlando, FL, Jan. 26-28, 1998, pp. xx-xx.

," Proceedings of the 20th AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 25-29, 1999, pp. xx-xx.

Keith Legg & Bruce Sartwell Hard Chrome Alternatives Team Update Improving Performance While Reducing Cost, ," 21st AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 17-19, 2000, pp. xx-xx.

Dr. Brent Lee & Stephen M. Koelzer; Vacuum Deposition of Chromium as an Alternative to Hexavalent or Trivalent Chromium Plating, 2000, Jan, 21st AESF/EPA Conference ," 21st AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 17-19, 2000, pp. xx-xx.

," 21st AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 17-19, 2000, pp. xx-xx.

," 22nd AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 29-Feb. 1, 2001, pp. xx-xx.

T. Naguy, M. Klingenberg, M. Neidbalson, M. Pavlik & D. Schario Non-line-of-sight (NLOS) Hard Chromium Alternatives Status Report, 2002, Jan, ," 2002 AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 28-30, 2002, pp. xx-xx.

Michael Kane " Environmentally Acceptable Technologies For the Replacement of Cadmium Coatings for Defense Applications, 2002, Jan, ," 2002 AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 28-30, 2002, pp. xx-xx.

Craig Matsdorf Trivalent Chromium Pretreatments for Defense Applications, 2002, Jan, ," 2002 AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 28-30, 2002, pp. xx-xx.

J.L. McCrea, G. Palumbo, M. Marcoccia & U. Erb Electrodeposited Nanocrystalline Cobalt-Iron Alloys As an Environmentally Benign Replacement to Hard Chrome Plating, 2002, Jan, ," 2002 AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 28-30, 2002, pp. xx-xx.

," 2002 AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 28-30, 2002, pp. xx-xx.

," Proceedings 2003 AESF/EPA Conference for Environmental & Process Excellence, Daytona, FL, Feb. 3-7, 2003, pp. xx-xx.

," Proceedings 2003 AESF/EPA Conference for Environmental & Process Excellence, Daytona, FL, Feb. 3-7, 2003, pp. xx-xx.

," Proceedings 2004 AESF/EPA Conference for Environmental & Process Excellence, Orlando, FL, Jan. 26-29, 2004, pp. xx-xx.

--------------------------------------------------------
Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition
2010 Twenty-Fifth Annual IEEE Applied Power Electronics Conference and Exposition
Annual Applied Power Electronics Conference and Exposition
Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition
IEEE Applied Power Electronics Conference and Exposition
Proceedings of the Eleventh Annual Applied Power Electronics Conference and Exposition
Proceedings of 2002 IEEE Applied Power Electronics Conference
APEC
{ IEEE XPLORE (88-), OSU online & sel TK7881.15I34, UC online & depos TK7881.15.I32, UK online & eng TK7881.15.I32a, UM online, UT hodges TK7881.15.I14 (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
88-21 checked 8/3/2021

--------------------------------------------------------
Proceedings of the Ninth Annual International Electronics Packaging Conference
4th International Electronic Packaging and Technology Conference
Proceedings of the 1996 International Electronics Packaging Conference
Proceedings of the technical conference: Nth annual International Electronics Packaging Conference
{ UCSD s&e TK7870.15.I5735 & TK7870.I6138, UTor eng TK7870.15.J65, UWa online, }
11 items found as of 4/21/2011 catalog

(new reference 6/7/2009)
Matsuoka, H, Tsukagoshi, I. "New type of anisotropic conductive film with high connection reliability and finer pitch densities Proceedings of the 1993 International Electronics Packaging Conference, 1993, pp. 489

Devarajan Balaraman, P. Markondeya Raj, Ravindra Tanikella, Swapan Bhattacharya, Paul Kohl, and Rao Tummala, "Low Temperature Synthesis (100øC) Hydrothermal Synthesis of High-K Low Loss BaTiO 3 Films for Integral Capacitors", 4 th International Electronic Packaging and Technology Conference, Singapore, pp. 79-84, December 10-12, 2002.

--------------------------------------------------------
Proceedings 1976 Annual Reliability and Maintainability Symposium
54th Annual Reliability & Maintainability Symposium
Annual Reliability and Maintainability Symposium 2002 Proceedings
2010 Proceedings - Annual Reliability and Maintainability Symposium
Proceedings of the Annual Reliability and Maintainability Symposium
RAMS
{ IEEE XPLORE (84,88-), OSU sel TS173.S92, UK online (many other universities also subscribe to IEEE XPLORE), }
16 items found as of 8/3/2021
84,88-20 checked 8/3/2021

--------------------------------------------------------
Proceedings, Annual Technical Conference - Society of Vacuum Coaters
{ CMU online, LH closed, UC eng cdrom TS695.S621, UCB online, UCSD online, UOk online, UTA cdrom 526, VU online, }
items found as of 1/30/2011 catalog

(new reference 2/13/2011)
Weis, M, Manty, B. Overview of hexavalent chromium plating alternatives Proceedings, Annual Technical Conference - Society of Vacuum Coaters, 1995, pp. 325-330

--------------------------------------------------------
Proceedings of XX International Conference on Electromagnetic Disturbances
{ }
items found as of 1/9/2014

(new reference 1/9/2014)
Ikuko Mori, "Estimation of Gap Breakdown Field for Air Discharges of ESD-Gun with Low Charge Voltages," XX, Sept. 22-24, 2010, pp. 111-114.

--------------------------------------------------------
Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
xxxx Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
{ BYU hbll TA174.A475, UTor eng TA174.D465, UWa davis TA174.A3174, }
1 item found as of 1/30/2011

--------------------------------------------------------
Proceedings of the xxxx ASME International Mechanical Engineering Conference & Exposition
Proceedings of the ASME International Mechanical Engineering Congress and Exposition
Proceedings of IMECE'03 { MIT barker TJ5.I58, MST wilson TA190.E66, UH TK7870.15.A66 & TK7870.15.A67, USF various, UTor eng TJ5.I573, UWa davis TJ5.I53, }
7 items found as of 1/30/2011 catalog

(new reference 12/30/2008)
Lau, J., R. Lee and Shangguan, D., Thermal Fatigue Life Prediction of Lead-Free Solder Joints. Proceedings of ASME International Mechanical Engineering Conference & Exposition no. ov. 13-19, 2004, Anaheim, CA.

Tang, Zhenming, Park, Seungbae, Lee, H. .Effect of board-level reflow on adhesion between lead-free solder and underfill in flip-chip BGA packages ASME International Mechanical Engineering Congress and Exposition, Proceedings, v 5, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007, 2008, p 9-14

Mukherjee, Shantanu, Tsai, Pei-Fang Jennifer, Castro, Manuel, Srihari, Krishnaswami, Van Nguyen, D. .PB-free wave soldering of thick printed circuit boards using no-clean VOC free flux ASME International Mechanical Engineering Congress and Exposition, Proceedings, v 5, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007, 2008, p 143-147

Ramkumar, S. Manian, Srihari, Krishnaswami .Modeling and experimental verification of the contact resistance of a novel anisotropic conductive adhesive ASME International Mechanical Engineering Congress and Exposition, Proceedings, v 5, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007, 2008, p 149-157

Cuddalorepatta, Gayatri, Dasgupta, Abhijit .Viscoplastic behavior of hypo-eutectic Sn.0Ag.5Cu PB-free alloy under creep loading conditions ASME International Mechanical Engineering Congress and Exposition, Proceedings, v 5, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007, 2008, p 159-166

Bhate, D., Chan, D., Subbarayan, G., Chiu, T.C., Edwards, D., Gupta, V. .Constitutive behavior of Sn.8Ag.7Cu and Sn.0Ag.5Cu alloys at creep and low strain rate regimes ASME International Mechanical Engineering Congress and Exposition, Proceedings, v 5, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007, 2008, p 183-196

Faizan, Mohammad, Wang, Guo-Xiang .Effect of thermal processing on the dissolution of micro/nano-size metal particles in lead-free composite solders ASME International Mechanical Engineering Congress and Exposition, Proceedings, v 5, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007, 2008, p 263-268

Miyauchi, Hiroki, Yu, Qiang, Shibutani, Tadahiro, Shiratori, Masaki .A study on evaluation technique for the fatigue life scatter of lead-free solder joints ASME International Mechanical Engineering Congress and Exposition, Proceedings, v 5, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007, 2008, p 325-332

--------------------------------------------------------
(new source 6/22/2020)
Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
{ }
2 items found as of 6/22/2020

--------------------------------------------------------
Proceedings of the ASME Manufacturing Engineering Division
American Society of Mechanical Engineers, Manufacturing Engineering Division, MED
{ CMU online, UM offsite TS176.I68, RU TS176.P72854, }
2 items found as of 6/11/2015 catalog
00-03 checked 6/11/2015

--------------------------------------------------------
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
{ UM online, }
>=27 items found as of 1/30/2011 catalog

--------------------------------------------------------
Proceedings of the ASME Pressure Vessels and Piping Conference
xxxx Proceedings of the ASME Pressure Vessels and Piping Conference
{ BYU hbll TJ930.P74x, GIT main-5e TJ930.P73, LH open, OrSU valley TJ930.P73, PU eng 681.76041P941, RU fondren TJ930.P83, UCSD s&e TA654.6.A86, UIUC eng 620P926p, UM online, UNCC compact TA492.B63A86, UTA eng TJ930P73, UTor eng TJ930.P83, UWa davis TJ930.P73, }
1 item found as of 1/30/2011

--------------------------------------------------------
Proceedings of ASM's 2nd Electronic Packaging: Materials and Processes Conference
{ CSULB TK7872.P2E54, }
2 items found as of 1/30/2011 catalog

--------------------------------------------------------
Proc. Brit. Assoc. Refridgeration
item found as of 1/30/2011 catalog

J. E. Daniels, D. J. Macnaughton, Proc. Brit. Assoc. Refridgeration, 33 (1936-37), p. 78.

--------------------------------------------------------
Proceedings of CALCE International Symposium on Tin Whiskers
3 items found as of 1/30/2011 catalog

--------------------------------------------------------
(new source 7/7/2020)
Proceedings of Symposium on Capacitor Technologies, Applications and Reliability,
{ }
(new reference 7/7/2020)
W. J. Minford, Accelerated Life Testing and Reliability of High K Multilayer Ceramic Capacitors, Proceedings of Symposium on Capacitor Technologies, Applications and Reliability, 1981, pp. 93-97. --------------------------------------------------------
(new source 7/7/2020 old)
Proceedings Chromates Symposium
{ }
(new references 7/7/2020 old)
Koppel, W. Benjamin, and Hathaway, James A., "The Acute Chemical Effect of Chromium Compounds in Man," Proceedings Chromates Symposium - 80, Rockville, MD, Sept. 16-18, 1980, pp. 24-30.

Kennedy, Gerald L, and Morgan, James F., "Toxicity of Lead Chromates," Proceedings Chromates Symposium - 80 , Rockville, MD, Sept. 16-18, 1980, pp. 43-60.

Dickenson, John, "Chromate Pigments in Surface Coatings, Inks and Plastics," Proceedings Chromates Symposium - 80, Rockville, MD, Sept. 16-18, 1980, pp. 155-164.

Sattelmeier, Gerald A, "Application of Chromium Bearing Paint in the Automobile Industry," Proceedings Chromates Symposium - 80, Rockville, MD, Sept. 16-18, 1980, pp. 165-177.

Braddock, John W., "Application of Chromium Bearing Paints - Aerospace Industry," Proceedings Chromates Symposium - 80, Rockville, MD, Sept. 16-18, 1980, pp. 178-182.

Secor, Robert H., "Chromate Paints in Shipbuilding," Proceedings Chromates Symposium - 80 , Rockville, MD, Sept. 16-18, 1980, pp. 183-186.

--------------------------------------------------------
Proceedings of 14th CIRP International Conference on Life Cycle Engineering
{ FAU online, IU online, MIT online & barker HF5415.155.C57, PU online, TU online, UC eng HF5414.155.C57, UCF main TS176.C57, UCI sci bar TS176.C534, UCSD online, UIUC online & eng 658.5C496i, UM online, USC online, UT online, UTA online, UTAr sel TS176.C534, UTo online, UWa online, WrSU online, }
2 items found as of 6/13/2015 catalog
07 checked 6/13/2015

(Advances in Life Cycle Engineering for Sustainable Manufacturing Businesses)

--------------------------------------------------------
Proceedings from Components for Military and Space Electronics xxxx
item found as of 1/30/2011 catalog

(new reference 6/5/2009)
Prymak, Antoniades, Blais, Hill, Lai, Riedl, Schmidt, Sloka, and Staubli, "Flexible Termination - Reliability in Stringent Environments," Proceedings from Components for Military and Space Electronics 2009, San Diego, CA, Feb. 2009.

--------------------------------------------------------
Proceedings of the Design, Automation and Test in Europe Conference and Exhibition
{ IEEE XPLORE (98-), (many other universities also subscribe to IEEE XPLORE), }
4 items found as of 8/3/2021
98-21 checked 8/3/2021

--------------------------------------------------------
Proceedings of Electronic Circuit World Convention
item found as of 1/30/2011 catalog

F. Wolfert and N. Vo, "Assessment of Pb-free finishes for leadframe packaging," in IPC Elec. Circuits World Convention, 2002, paper IPC56.

Shangguan, D., Optimization of Lead-Free Soldering Processes for vol. Manufacturing. To appear in Proceedings of Electronic Circuit World Convention 10, Feb. 21-24, 2005, Anaheim, CA.

--------------------------------------------------------
2010 Proceedings 60th Electronic Components and Technology Conference
1997 Electronic Components and Technology Conference
59th Electronic Components & Technology Conference
1968 Electronic Components Conference
IEEE Electronic Components Conference
Proceedings 1967 Electronic Components Conference
Proceedings of Electrical Components Conference
Proceedings of the 1996 Electronic Components and Technology Conference
Proceedings of the 39th Electronic Components Conference
Proceedings of the 38th Electronics Components Conference
1990 Proceedings 40th Electronic Components Conference
1988 Proceedings 38th Electronics Components Conference
Proceedings - 1970 20th Electronic Components Conference
Proceedings of the IEEE Electronic Components Technology Conference
ECTC
{ IEEE XPLORE (88-) http://ecadigitallibrary.com/conference.php?cid=17, CSULB TK7801 .E54, MSU eng TK7801.A5, OSU online & sel & compact TK7801.A5, RU fondren TK7801.A5, UCB online, UD roesch, UK online & eng TK7801.A5 & TK7869.E43, UM online, USU merrill-cazier TK7801.A5, UT hodges TK7801.A5, WUSL westc TK7801.A5 (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021 catalog
56-58,64,66-20 checked 8/3/2021

--------------------------------------------------------
Proceedings of the 1997 1st Electronic Packaging Technology Conference
Proceedings of 2nd Electronics Packaging Technology Conference
2005 7th Electronic Packaging Technology Conference
4th Electronics Packaging Technology Conference
2011 IEEE 13th Electronics Packaging Technology Conference EPTC
{ IEEE XPLORE (97-), NWU online, UIC daley TK7870.15.E426, UK online & eng TK7870.15.E4298 (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
97-20 all issues checked 8/3/2021

--------------------------------------------------------
Proceedings of the 5th European Conference on Additives and Colors
item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Tange, Lein, Borms, R., Goebelbecker, S., Georlette, P., Reznick, G., Yaakov, Y. Bar .Sustainable use of brominated flame retardants in plastics Proceedings of the 5th European Conference on Additives and Colors, Proceedings of the 5th European Conference on Additives and Colors, 2007, 5p

--------------------------------------------------------
Proc. European Electromagnetic International Symp Electromagnetic Environments and Consequences
{ }

(new reference 12/23/2013)
Inzoli "Electrostatic discharges on spacecraft: the genesis, risk and protection," May 30-June 3, 1994, pp. 23-35.

--------------------------------------------------------
Proceedings of the Nth European Microwave Integrated Circuits Conference
Gallium Arsenide and Other Semiconductor Application Symposium
EuMIC
{ IEEE XPLORE (05-), UM online (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
05-20 checked 8/3/2021

--------------------------------------------------------
Proceedings of the 1976 GOMAC Conference

{ UK TK7874.G580, }
(new reference 12/23/2013)
Hinkernell Nov 1976 pp. 350-353

--------------------------------------------------------
Proceedings 2000 HD International Conference on High-Density Interconnect and Systems Packaging
2001 HD International Conference on High-Density Interconnect and Systems Packaging
2000 International Conference on High-Density Interconnect and Systems Packaging
{ GIT, SIUC mclafferty 621.381046I614, UCB eng TK7874.I569, UCSD s&e TK7874.I569, UH TK7874.I569, UTor eng TK7874.H3, UWa davis TR5.S6x, }
8 items found as of 8/4/2013
99-01

--------------------------------------------------------
Proceedings of the High Level SMT Conference
item found as of 1/30/2011 catalog

Shangguan, D., Strategy for Environmental Leadership in Electronics Manufacturing: Lead-Free and Beyond. Proceedings of the High Level SMT Conference, Shanghai, China, Apr. 2004.

--------------------------------------------------------
Proceedings of the 2nd IAASS Conference
{ UTor eng cdrom TL867.I58, }
item found as of 1/30/2011 catalog

(new reference 12/31/2008)
Barr, Stephanie, .Mitigating and preventing the growth of tin and other metal whiskers on critical hardware European Space Agency, (Special Publication) ESA SP, n SP-645, July, 2007, Proceedings of the 2nd IAASS Conference: Space Safety in a Global World, 9p

--------------------------------------------------------
Proceedings of the IEEE
{ IEEE XPLORE (v1#1-), UK online & remote TK5700.I6, (many other universities also subscribe to IEEE XPLORE), }
5 items found as of 1/21/2021

*** here for IEEE XPLORE 1/21/2021 *** --------------------------------------------------------
Proceedings of the IEEE 2007 Custom Integrated Circuits Conference
IEEE 1994 Custom Integrated Circuits Conference
IEEE Custom Integrated Circuits Conference
CICC
{ IEEE XPLORE (88-15,17-), UK online, UM online? (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
88-15,17-21 checked 8/3/2021

(new reference 12/23/2013)
Neelakantaswamy 1986 p 400-403 "MOS Scaling Effects on ESD-Based Failures"

--------------------------------------------------------
2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts Holm Conference
Proceedings of the Annual Holm Conference on Electrical Contacts
Proceedings of the 52nd Holm Conference on Electrical Contacts
Proceedings of the Forty-Sixth IEEE Holm Conference on Electrical Contacts
{ IEEE XPLORE (88-), OSU online, UK online & eng TK2831.I530 (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
88-20 checked 8/3/2021

--------------------------------------------------------
Proceedings - The 2nd IEEE International Conference on Secure System Integration and Reliability Improvement
The Nth IEEE International Conference on Secure System Integration and Reliability Improvement
SSIRI
{ IEEE XPLORE (08-), UM online? (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
08-14 checked 8/3/2021

--------------------------------------------------------
Proceedings of the 2008 IEEE International Power Modulators and High Voltage Conference
Conference Record of the 2006 Twenty-Seventh International Power Modulator Symposium
IEEE Conference Record of the 1990 Nineteenth Power Modulator Symposium
Proceedings of the 26th International Power Modulator Symposium and 2004 High Voltage Workshop
{ IEEE XPLORE (88,90,92,94,96,98,00,02,04,06,08,10,12,14,16,18), (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
88,90,92,94,96,98,00,02,04,06,08,10,12,14,16,18 checked 8/3/2021

--------------------------------------------------------
2015 IEEE International Symposium on Electromagnetic Compatibility and EMC Europe
2012 IEEE International Symposium on Electromagnetic Compatibility Proceedings
Proceedings IEEE International Symposium on Electromagnetic Compatibility
2003 IEEE Symposium on Electromagnetic Compatibility Symposium Record
1975 IEEE Electromagnetic Compatibility Symposium Record
2001 IEEE EMC International Symposium Symposium Record
1999 IEEE EMC Symposium
1999 IEEE EMC Symposium Record
2002 IEEE International Symposium on Electromagnetic Compatibility Workshops & Tutorials
IEEE 1997 International Symposium on Electromagnetic Compatibility
IEEE International Symposium on Electromagnetic Compatibility
IEEE 1989 National Symposium on Electromagnetic Compatibility Symposium Record
IEEE International Symposium on Electromagnetic Compatibility Symposium Record
1984 International Symposium on Electromagnetic Compatibility
IEEE International Symposium on EMC
{ IEEE XPLORE (88-), (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
88-20 checked 8/3/2021

--------------------------------------------------------
Proceedings of 2002 IEEE International Symposium on Industrial Electronics
ISIE
{ IEEE XPLORE (92-), (many other universities also subscribe to IEEE XPLORE), }
14 items found as of 8/3/2021
92-20 checked 8/3/2021

--------------------------------------------------------
Proceedings 1996 IEEE Multi-Chip Module Conference
Proceedings of the 1994 IEEE Multi-Chip Module Conference
Proceedings 1999 International Conference on High-Density Packaging and MCMs
Proceedings of the 1997 International Conference on Multichip Modules
Proceedings of the 1998 International Conference on Multichip Modules and High Density Packaging
{ IEEE XPLORE (92-99), MSU eng TK7870.15.I34, OSU sel TK7869.I44 & sel TK7869.I49, UC eng TK7874.I59433, UD roesch TK7870.15.I3238, UK online, UM online, (many other universities also subscribe to IEEE XPLORE), }
9 items found as of 8/3/2021
92-99 checked 8/3/2021

--------------------------------------------------------
Proceedings of the IEEE 2000 National Aerospace and Electronics Conference
IEEE 1986 National Aerospace and Electronics Conference
National Aerospace & Electronics Conference
NAECON
{ IEEE XPLORE (88-98,00,08-12,14-), LH TL695.N3, NWU sci L629.1326N277p, OSU sel TL693N3, PU eng 621.38406N206p & hicks 621.38406N206p, UC sw depos TL693.N3, UCB pascal TL693.N3, UIC electronic & daley TL693.N3, UK online, UM online, UT hodges TL693.N3 (many other universities also subscribe to IEEE XPLORE), }
5 items found as of 8/3/2021
88-98,00,08-12,14-19 checked 8/3/2021

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Proceedings of III International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory
DIPED
{ IEEE XPLORE (97-), (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/3/2021
97-20 checked 8/3/2021

--------------------------------------------------------
Proceedings of IMAPS (International Microelectronics And Packaging Society)
IMAPS Poland Conference 2000
Proceedings of IMAPS Nordic
{ UAH salmon TK7874.I5725, UOk bizzell TK7874.I59, }
2 items found as of 1/30/2011 catalog

(new reference 6/7/2009)
Leidecker, H, and Kadesch, J. S, "Effects of, URalane Conformal Coating on Tin Whisker Growth," Proceedings of IMAPS Nordic, Sept. 10-13, 2000, pp. 108-116.

H. Windlass, P. Raj, D. Balaraman, S. Bhattacharya and Rao R Tummala, "Colloidal Processing of Polymer Ceramic Nanocomposites for Integral Capacitors, " Proceedings of the IMAPS International Symposium on Advanced Packaging Materials, pp. 393-398, Braselton, GA, April 2001.

D. Balaraman, P. Markondeya Raj, S. K. Bhattacharya and R. R. Tummala, "Novel Hydrothermal Processing of Ceramic-polymer Composites for Integral Capacitor Applications, " Presented at IMAPS 2002, International symposium on packaging materials, processes and interfaces, Stone Mountain, Georgia, March 3-5, 2002.

Sjoberg, J, Geiger, D. A, Shangguan, D, and Castello, T, "Alternative Assembly Methods for Lead-Free Solder Flip Chips on FR-4 Substrates," Proceedings of IMAPS Nordic, 2004.

Arra, M, Geiger, D, Shangguan, D, and Sjoberg, J, "Study Of Component Self-Alignment During Reflow Using Sn/Pb And Sn/Ag/Cu Solders," Proceedings of IMAPS Nordic, 2004.

Lau, J. H, Lee, S. W. Ricky, Shangguan, D, Lau, D, and, Kung, T, "Thermal-Fatigue Life Prediction Equations for Lead-Free Solder Joints on Lead-Free Printed Circuit Board (PCB)," Proceedings of IMAPS 2004 , Long Beach, CA no. ov. 2004.

Lau, J, Castello, T, Shangguan, D, Dauksher, w, Smetana, J, Horsley, R, Love, D, Menis, I, and, Sullivan, B, "Failure Analysis of Lead-Free Solder Joints for an 1657 CCGA (Ceramic Column Grid Array) Package," Proceedings of IMAPS, Long Beach, CA, 2004.

K. Lee, R., Pucha, M. Varadarajan, S. Bhattacharya, S. Sitaraman, R. Tummala, "Reliability assessment of embedded capacitors in multi-layered microvia organic Substrates", Proceedings of the IMAPS International Symposium on Microelectronics, Philadelphia,September 2005, pp 98-104.

P. Muthana, M. Swaminathan, R. Tummala, V., Sundaraman, L. Wan, S. Bhattacharya, E. Engin, P. Raj, "Design, modeling, and measurement of embedded decoupling capacitors for power delivery in the mid-frequency", Proceedings of the IMAPS International Symposium on Microelectronics, Philadelphia, September, 2005, pp 506-511.

P. Markondeya Raj, Devarajan Balaraman, Vinu Govind, Isaac Robin Abothu, Swapan Bhattacharya, Madhavan Swaminathan and Rao Tummala, "supercapacitive nanocomposite thin films suitable for embedded decoupling capacitors", Accepted for International Workshop on Integrated Passives, Marco Island, International International Microelectronics and Packaging Society, to be held during January 25-26, 2005.

--------------------------------------------------------
(new source 10/26/2020)
Proceedings of the Imperial Academy
{ https://www.jstage.jst.go.jp/browse/pjab1912/list/-char/en UK online, }
1 item found as of 1/21/2021

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Proceedings of the 2007 Industrial Engineering Research Conference
{ UC ceas a-v coll T55.45.I49 & sw depos T56.25.A53, }
2 items found as of 1/30/2011

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Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture
Proceedings of the Institution of Mechanical Engineers - Part L - Journal of Materials: Design & Applications
{ IEEE XPLORE, AU online, BYU hbll TJ1.P862, CSULA online, CSULB online, FIT online, FSU online, GIT online, IU online, LH closed, MST online, NWU online, OCU beam, OGI online, OkSU online, OrSU online, OSU online, PU online, RU fondren TJ1.I5pt.B, SDSU online, SIUC online, SIUE lovejoy microfiche, SU online, UAB sterne TJ1.I5 pt.B, UAH online, UAr online, UCF online, UCI online, UCSD online, UDe online, UE, UF online, UIC online, UK online & eng TJ1.I5pt.B, UM online, UMC online, UOk online, USC TA401.P662, USD online, USF online, USU online, UTA online, UTo online, WrSU online, }
3 items found as of 1/21/2021
v222#5 checked 1/21/2021

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Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing
4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing
{ IEEE XPLORE (98,00), UK online, UM online (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
98,00 checked 8/3/2021

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Proceedings of 7th International Conference on EcoBalance
{ USC online, }
1 item found as of 1/30/2011 catalog

"," Proceedings of 7th International Conference on EcoBalance, Tsukuba, Japan, Nov. 14-16, 2006, pp. .

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Proceedings of International Conference on Electrical Contact Phenomena
{ CMU offsite 621.316I61P, }
1 item found as of 3/31/2011 catalog

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Proceedings of the International Conference on Electroceramics
item found as of 1/30/2011 catalog

(new reference 6/8/2009)
Devarajan Balaraman, P. Markondeya Raj, Lixi Wan, Michael Sacks, Sid Dalmia, Madhavan Swaminathan and Rao Tummala, "BaTiO 3 films by low-temperature hydrothermal techniques for next-generation packaging applications", Proceedings of the International Conference on Electroceramics, MIT, Cambridge, August 4-6, 2003

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Proceedings of the 6th International Conference on Properties and Applications of Dielectric Materials
{ IEEE XPLORE (88,91,94,97,00,03,06,09,12,15,18,21), (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
88,91,94,97,00,03,06,09,12,15,18,21 checked 8/3/2021

--------------------------------------------------------
Proceedings of the International Conference on Restoration, Recycling and Rejuvenation
item found as of 1/30/2011 catalog

Bonoli, Alessandra, Goldoni, Silvia WEEE treatment and recycling processes: A case study about mobile telephones batteries recycling project Proceedings of the International Conference on Restoration, Recycling and Rejuvenation Technology for Engineering and Architecture Application, Proceedings of the International Conference on Restoration, Recycling and Rejuvenation Technology for Engineering and Architecture Application, 2004, pp. 287-296

--------------------------------------------------------
Proceedings of the 5th international conference on Software engineering
ICSE
{ IEEE XPLORE (88-13,15-), OSU QA76.6.I54 2-hour loan, UK QA76.6.N373a 76-02, UNC QA76.6.N373a }

item found as of 8/3/2021
88-13,15-21 checked 8/3/2021

(new reference 12/23/2013)
"A Robust B-tree implementation" San Diego, CA Mar 9-12, 1981 p 63-70

--------------------------------------------------------
Proceedings of the 18th International Conference on Surface Modification Technologies
{ UTA eng TN689.2.S97, }
item found as of 1/30/2011 catalog

Etcheverry, B., Le Coz, F., Alexis, J., Paris, J.-Y., Petit, J.A., Bonino, J.P. Mechanical properties of electroless co-deposited Ni-P/talc composite coatings Proceedings of the 18th International Conference on Surface Modification Technologies, vol. 2006, 2006, p 355-363

-------------------------------------------------------
Proceedings of 2004 International IEEE Conference on the Asian Green Electronics
Proceedings of 2005 International Conference on Asian Green Electronics
AGEC
{ IEEE XPLORE (04-05), UK online (many other universities also subscribe to IEEE XPLORE), }
>=20 items found as of 8/3/2021
04-05 checked 8/3/2021

--------------------------------------------------------
Proceedings of the 4th International Microelectronic System 95 Conference
item found as of 1/30/2011 catalog

Garj, V. K., Reliability on surface mount solder joint, Proc. 4th. Int. Microelectronic System 95 Conf,19 (1995).

--------------------------------------------------------
Proceedings of the Second International Symposium on Electronic Packaging Technology
item found as of 1/30/2011 catalog
97-98,03

Shangguan, D, and G. Gao, Environmentally Conscious Manufacturing Technologies for Automotive Electronics. Proceedings of the Second International Symposium on Electronic Packaging Technology (ISEPT '96), Dec. 1996, Shanghai, China, pp. 391-402.

--------------------------------------------------------
2000 International Symposium on Microelectronics
1975 International Microelectronic Symposium
Proceedings of the 1983 International Microelectronics Symposium
Proceedings 2003 International Symposium on Microelectronics
Proceedings of the 41st International Symposium on Microelectronics
Proceedings of the Third International Symposium on Microelectronics and Packaging
{ AU rbd TK7874.I59, CSULB online, FSU dirac TK7874.I5925, GIT main-6e TK7874.I5925, Lexmark TK7874.I5918, MIT storage TK7874.S989, NEU snell TA1505.P7, UCB eng TK7874.I5918, UCF main TK7874.I592, UCSD s&e TK7874.I592, UF sci TK7874.I5918a, UOk bizzell TK7874.I59, UTor eng TK7874.I567, UWa davis TK7874.S9 & TR5.S6x, WSU sci TS510.P76, }
>=20 items found as of 8/4/2013 catalog
71-03 checked 8/4/2013

(new reference 6/7/2009)
P. Chahal, R. R. Tummala, and M.G. Allen, "Integrated Capacitors using Polymer-Ceramic Comp. For MCM -L, "3 rd International Symposium on Microelectronics, pp. 126-131, 1996.

--------------------------------------------------------
1983 Proceedings: The Second International Symposium on Non-Conventional Energy Technology
{ CSULA palmer TJ163.15.I583, }
1 item found as of 1/30/2011

--------------------------------------------------------
Proceedings of the 20th International Symposium on Power Semiconductor Devices & IC's
ISPSD
{ IEEE XPLORE (90-), UCI online, UK online (many other universities also subscribe to IEEE XPLORE), }
3 items found as of 8/3/2021
90-21 checked 8/3/2021

--------------------------------------------------------
Proceedings of the International Symposium, Recycling and Reuse of Waste Materials
{ UTor eng TD794.5.I64, UWa davis TD785.R43x, }
item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Siikamaki, L.A. Raija .End-of-life Cathode Ray Tube glass as a raw material for hollow ware glass products Recycling and Reuse of Waste Materials, Proceedings of the International Symposium, Recycling and Reuse of Waste Materials, Proceedings of the International Symposium, 2003, p 743-750

--------------------------------------------------------
Proceedings of the International Conference on Test and Measurement
{ IEEE XPLORE (09), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
09 checked 8/3/2021

--------------------------------------------------------
Proceedings of the 31st International Symposium for Testing and Failure Analysis
Advanced Techniques in Failure Analysis Symposium (ATFA)
AFTA
Conference Proceedings from the International Symposium for Testing and Failure Analysis
19th International Symposium for Testing & Failure Analysis
ISTFA Proceedings
Proceedings of the 20th International Symposium on Testing and Failure Analysis
{ CMU eng TK7871.I59A & offsite 621.381I6124P, LH CDRM, OrSU valley TK7871.I591, OSU sel TK7870.A38 & sel TK7870.A3822, SMU storage TK7871.85.A244, UC eng TK7871.I48, UCB eng TK7871.I595, UM offsite TK401.I581, UNL eng TK7871.85.A244, UOk eng various, USC online, UT hodges TK7871.85.A39 & hodges TK7871.I4735, UTA eng cdrom 381, UTAr depos TK7870.A284, UTor eng TK7871.I59, }
>=20 items found as of 6/11/2015 catalog
76-83,86,89,91,93-07 checked 6/11/2015

(new reference 12/30/2008)
Evans, K. L, Anderson, T. A.; Kirkman, D. C. COMPARATIVE ANALYTICAL TECHNIQUES FOR THE DETERMINATION OF Pb IN SOLDER PLATED LEADS. AFTA Inc, 1984, pp. 247-253

Williams, Esther H. tin whiskers on flat pack lead plating between solder dip and sealing glass. AFTA, 1985, pp. 16-21

Williams, E. H., "Tin Whiskers on Flat Pack Lead Plating Between Solder Dip and Sealing Glass," ISTFA Proceedings, pp. 16-21, 1985.

Williams, E.H., "Tin Whiskers on Flat Pack Lead Plating Between Solder Dip and Sealing Glass," ISTFA Proceedings, pp. 16-21, 1985.

Rutter 1988 p 111

Westerhuyzen, D. H. Van, Backes, P. G., J.F. Linder, S.C. Merrell and R.L. Poeschel, "Tin Whisker Induced Failure in Vacuum," l8th International Symposium for Testing & Failure Analysis, v. 18, pp.407-412, Oct. 17, 1992.

Van Westerhuyzen, D.H., P.G. Backes, J.F. Linder, S.C. Merrell and R.L. Poeschel, "Tin Whisker Induced Failure in Vacuum," 18th International Symposium for Testing & Failure Analysis, pp. 407-412, October 17, 1992.

Armendariz, Norman J, Paulraj, Prawin Materials Characterization of Lead Free Compositions for Minimum Temperature SMT Processes at the SLI-Second Level Interconnect Solder Joint ISTFA 2004: 30th International Symposium for Testing and Failure Analysis, Boston, MA, USA, 14-18 Nov. 2004. pp. 261-266. 2004

--------------------------------------------------------
Proceedings of the 18th International Technical Meeting of the Satellite Division of The Institute of Navigation
{ AU rbd TL798.N3I58, }
item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Paynter, Gord, Banas, Vince .Compliance of NovAtel's GPS-702L antenna to the European union's new WEEE (Waste Electrical and Electronic Equipment) and RoHS (Restriction of the use of Certain Hazardous Substances) directives Proceedings of the 18th International Technical Meeting of the Satellite Division of The Institute of Navigation, ION GNSS 2005, v 2005, Proceedings of the 18th International Technical Meeting of the Satellite Divisionof The Institute of Navigation, ION GNSS 2005, 2005, p 2253-2262

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Proceedings of the 2003 International Thermal Spray Conference
International Thermal Spray Conference
Proceedings of the 15th International Thermal Spray Conference
Proceedings of the International Thermal Spray Conference
{ CMU eng TS655.I63, OkSU main 671.734N2775, UCI sci TS655.I63, UM online, UOk eng TS655.I635, UT hodges TS655.I63, UTor eng TS655.I63, UWa davis TS655.I63, }
7 items found as of 6/11/2015 catalog
92,98,00-04 checked 6/11/2015

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Proceedings Fifth International Workshop on System-on-Chip for Real-Time Applications
{ IEEE XPLORE (03-06), (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/3/2021
03-06 checked 8/3/2021

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Proceedings of the 1995 30th Intersociety Energy Conversion Engineering Conference
IECEC
{ IEEE XPLORE (89-90,96-97,00-02), UK storage TK2896.I55a, (many other universities also subscribe to IEEE XPLORE), }
7 items found as of 8/3/2021
89-90,96-97,00-02 checked 8/3/2021

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Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition
Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems
IPACK'01 Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition
Proceedings of IPACK'01 The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition
{ }
>=20 items found as of 1/30/2011 catalog
11 checked 11/3/2013

--------------------------------------------------------
Proceedings of IPC Annual Meeting 2003
Proc. IPC Annual Meeting and Technical Conference
1 item found as of 1/30/2011 catalog

R. Schetty, "Whisker growth studies," in Proc. IPC Annu. Meeting and Technical Conf., Oct. 2001, pp. S03-7-1-S03-7-4.

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Proceedings of the 1999 Joint Meeting of the European Frequency and Time Forum and the IEEE International Frequency Control Symposium
Tenth European Frequency and Time Forum
2010 IEEE International Frequency Control Symposium
FCS
{ IEEE XPLORE (56-), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
56-19 checked 8/3/2021

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Proceedings of the Koninklijke Nederlandse Akademie van Wetenschappen, Series B
Koninklijke Nederlandse Akademie van Wetenschappen
Koninklijke Akademie van Wetenschappen te Amsterdam
Proceedings of the Academy of Science, Amsterdam
Proceedings of the Section of Sciences
Proceedings of the Section of Sciences, Series B: Physical Sciences
Verslag koninklijke Nederlandsche Akadamie von Wetenschappen, Amsterdam
{ AU rbd closed Q57.A532, FSU remote 505.A313, GIT main-4e QC1.A538X, IU b-geol Q57.A5, LH closed, MoSU Q57.A535, MSU main Q57.A5SerB, NEU snell Q1.P5890, NWU online & sci L506A32p, OrSU valley Q57.A5, OSU online, PU online & phys 506Ak1pB & 506Ak1pD & hicks 5]06Ak1pC, RU fondren Q57.A451, UC swdepos AS244.A532, UCSD s&e Q1.A3055, UIUC biol 069AM2E, UK king Q57.P76, UM shapiro QC1.A3114 & hatcher AS244.A433 & buhr AS244.A433 & buhr Q57.A74 & buhr Q57.A73, UT hodges closed AS244.A536, UTA life Q1K655K, UTo online, VU annex QA1.A45, }
>=20 items found as of 1/30/2011 catalog

E. Cohen and C. van Eijk, Versl. Akad. Amsterdam, 8, 36, 102 (1899).

Versl. Kon. Acad. v. Wet. te Amsterdam 21, 661 (1912).

E. Cohen and W. A. T. Cohen de Meester, Verslag koninklijke Nederlandsche Akadamie von Wetenschappen, Amsterdam, 90 (1938), p. 9.

E. Cohen and W. A. T. Cohen de Meester, Verslag koninklijke Nederlandsche Akadamie von Wetenschappen, Amsterdam, 91 (1938), p. 5, 8.

W. G. Burgers, Allotropic transition and recrystallisation of tin, Koninkl. Ned. Akud. Wetenschup. Proc., B57 (1954) 13-17.

W. G. Burgers and L. J. Groen, Formation of compact pieces of grey tin, Koninkl. Ned. Akud. Wetenschap. Proc., B57 (1954) 79-80.

W. G. Burgers and Keshin Kuo, An X-ray investigation of the white to grey transformation of tin, Koninkl. Ned. Akad. Wetenschap. Proc., B59 (1956) 288-297.

--------------------------------------------------------
Proceedings of the Fourth Pacific Rim International Conference on Advanced Materials and Processing
PRICM
Pacific Rim International Conference On Advanced Materials and Processing
(can be found in Materials Science Forum)
{ AU rbd TA401.3.F57, CMU eng TA401.3.M3793, UT hodges TA401.3.M3793, UTor eng TA401.3.P33, }
PRICM-5 = Materials Science Forum Volumes 475-479 PRICM-6 = Materials Science Forum Volumes 561-565 PRICM-7 = Materials Science Forum Volumes 654-656 1 item found as of 8/6/2012 catalog
92

Boettinger, W. J. Handwerker, C. A. Johnson, C. E. Moon, K. Stafford, G. R. Williams, M. E. (METALLURGY DIVISION - 855) The Formation of Whiskers on Electroplated Tin Pacific Rim International Conference On Advanced Materials and Processing, Dec. 11-15, 2001, Honolulu, HI - Dec. 1, 2001

--------------------------------------------------------
Proceedings of the Physical Society, B
Proceedings of the Physical Society
{ https://iopscience.iop.org/journal/0370-1301 https://iopscience.iop.org/journal/0959-5309 IU online & bloomington alf QC1.P53, MST online, NWU online, OkSU online, OSU online & sel QC1P574, PU online & hicks 530.05J826 & 530.4105J826 & 530.6L84, SDSU compact QC1.P5, SIUC online, SIUE storage, TTU, UAr online, UCSD online, UIC online & warehouse QC1.P5, UK king QC1.P5, UL kersey QC1.P5, UM online & buhr QC1.P5821, UOk online, USD online, UT hodges closed QC1.P5, }
6 items found as of 1/30/2011

--------------------------------------------------------
Proceedings 26th Relay Conference
50th International Relay Conference
National Relay Conference
{ UK eng TK2851.N27, }
2 items found as of 1/30/2011
02

--------------------------------------------------------
(new source 6/28/2020)
Proceedings of The Royal Society A: Mathematical, Physical and Engineering Sciences
{ https://www.jstor.org/journal/procmathphysengi UK online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Proceedings of the Royal Society of London
Proceedings of the Royal Society of London, Series A, Mathematical and Physical Sciences
{ https://www.jstor.org/journal/procroyasocilond IU online & bloomington alf Q41.R82, MST online, MSU online, NWU online & sci 506R89, OSU online & sel Q41L82 & depos Q41L82, PU online & hicks 506R81p, SDSU online, SIUC online, TTU, UAr online, UC online & biol Q41.L82, UCSD online, UD online, UE, UIC online & warehouse Q41.L84A2, UK online & chem/phys Q41.L7, UL online & kersey Q41.L7, UM online & shapiro QC1.R888 & hatcher Q41.L8P8 & buhr Q41.L8P8, UOk online, USD online, UT online & hodges closed Q41.L7, UTo carlson microform, WSU storage, }
8 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 9/8/2020
searched for zinc whisker(s) & Zn whisker(s) on 9/8/2020
searched for indium whisker(s) on 9/8/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/8/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/8/2020

--------------------------------------------------------
Proceedings of the 2004 SEM X International Congress and Exposition on Experimental and Applied Mechanics
{ LH closed, TTU TA648.3.S633, UC eng TA648.3.S633, UM CDROM, UMX229, UOk eng TA349.I485a, USC online, }
1 item found as of 1/30/2011 catalog
04,08 checked 7/3/2010

(new reference 12/30/2008)
Liang, Cai, Prorok, B.C. .Determination of thin film elastic modulus by magnetostrictive sensor and finite element simulation Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007, v 2, Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007, 2007, p 1025-1031

J.C., Suhling, H.S. Gale, R.W. Johnson, M.N. Islam, T. Shete, P. Lall, M.J. Bozack, J.L. Evans, Auburn University; P. Seto, T. Gupta, J.R. Thompson, DaimlerChrysler – Huntsville Electronics Thermal Cycling Reliability of Chip Resistor Lead Free Solder Joints "," Proceedings of the 2004 SEM X International Congress and Exposition on Experimantal and Applied Mechanics, Costa Mesa, CA, June 7-10, 2004, pp. .

--------------------------------------------------------
Proceedings of SPIE
Proceedings of SPIE - The International Society for Optical Engineering
{ CSULA north various, CSULB online, Lexmark various, MST wilson various, MSU various, NWU online, OSU sel various & TS155.7.E585, PU eng 621.381D4945, RyU various, SDSU various, SIUC morris various, SIUE lovejoy various, TTU QC370.5.S64, UAr mullins various, UC eng QD139.P6X72, UCB eng TK7874.I5918, UCSD online, UK eng various, UL Kersey various, UM online & various, UMe mcwherter various, UNCC online, USC TS510.P632, UT hodges various, UTAr online, UTo various, UTor eng various, UWa online, WSU various, }
12 items found as of 1/30/2011

--------------------------------------------------------
Proceedings of the University of Durham Philosophical Society Series A Science
{ IU bloomington wells Q41.D9, MIT storage 506.42D96, MSU main Q111.D8, UC lloyd AS122.D895, UM buhr Q41.D96 UTA storage 506.D934P, WSU storage, }
item found as of 1/30/2011 catalog

I. A. Richmond and J. A. Smythe, Proc. Univ. Durham Phil. Soc. 10, 48 (1938).

--------------------------------------------------------
(new source 7/7/2020)
Proceedings of the Workshop on the Reliability of Multilayer Ceramic Capacitors
{ }
(new reference 7/7/2020)
B. S. Rawal and N. H. Chan, Failure Analysis of Multilayer Ceramic Capacitors, Proceedings of the Workshop on the Reliability of Multilayer Ceramic Capacitors, 1981, pp. 118-124. --------------------------------------------------------
Process Engineering (London)
{ CBU, CPL washington, IU online, MST online, NWU sci 660.5P963, OkSU online, OSU online & sel TP1P7, SDSU online, SIUC online, TTU online, UAr online, UCSD online, UD roesch, UK online, UL online & kersey TP1.P6835, UM online, USD online, UT online & hodges TS155.A1P76, }
1 item found as of 1/21/2021

--------------------------------------------------------
Product Design & Development
{ https://www.thefreelibrary.com/Product+Design+%26+Development-p25547 MST online, OkSU online, SDSU online, SIUC online, SMU online, UAr online, UCI online, UCSD online, UK online, USD online, UT online, UTD online, }
8 items found as of 6/20/2021 catalog
Oct05-v64#12(09) checked 6/20/2021
searched for tin whisker(s) and Sn whisker(s) on 12/21/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/21/2020
searched for indium whisker(s) on 12/21/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/21/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/21/2020

--------------------------------------------------------
Product Engineering
{ CBU, MST depos 621.05P942m, OSU sel TS1P96, SDSU TS1.P7, SIUC storage 56404-6701, TTU UAr storage TS1.P7, UE, UK eng TS1.P7, UL kersey TJ184.C53, }
item found as of 1/30/2011

--------------------------------------------------------
Product Engineering & Quality
{ }
1 item found as of 2/16/2011

--------------------------------------------------------
Product Finishing
{ EBSCOB, AU online, CSULA online, CSULB online, GIT online, MIT online, NWU online, OSU online, SDSU online, SMU online, UAH online, UAr online, UCB online, UCI online, UCSD online, UF online, UK online, UMi online, UOk online, USC TS200.P73, USD online, UT online, UTAr online, UTD online, UTo online, VU online, WSU storage, }
4 items found as of 8/6/2021 catalog
v52#8-v55#5(02) checked 8/6/2021

"Tin plating: report on application of US process," Product Finishing , vol. 27 no. 10, pp. 10-11, 14, Oct. 1974.

Anon NEW TRIVALENT CHROMIUM PLATING PROCESS. Product Finishing (London), vol. 28 no. 8, Aug. 1975, pp. 30-32

--------------------------------------------------------
Products Finishing
PF Online

{ https://www.pfonline.com/articles/issues https://pf.mydigitalpublication.com/publication/?m=59270&l=1&p=0&view=issuelistBrowser https://www.pfonline.com/articles EBSCOB, http://www.pfonline.com/, AU online & rbd TS200.P73, CSULA north TS200.P73, CSULB online, FIU online, KSU hale TS200.P73, MST online, MSU online, NWU online, OkSU online, OSU online, SDSU online, SIUC online, SMU online, UAH online, UAr online, UC cas microfilm 60, UCI online, UCSD online, UF online & sci TS200.P73, UK online, UL kersey TS200.P73, UM online & buhr TS200.P96, UMi online, UNF online, UOk online, USC TS200.P73, USD online, UT online, UTAr online, UTD online, UTo online, VU online & annex TS200.P73, WSU online & storage, }
>=20 items found as of 8/6/2021 catalog
v65#5-v85#11(21) checked 8/6/2021
searched for tin whisker(s) and Sn whisker(s) on 7/20/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/7/2020
searched for indium whisker(s) on 8/7/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/7/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight on 8/7/2020

searched for gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 10/10/2020

--------------------------------------------------------
Professional Engineering
{ EBSCOA, EBSCOB, FIU online, IU online, KYVL, MST online, MSU online & eng TJ1.R7, NWU online, OkSU online, OSU online, PU eng 621.06In7cp, SDSU online, SIUC online, SIUE lovejoy microfiche, UAr online, UC eng TJ1.C6, UCI sci TJ.I527, UIC online, UK online & eng TJ1.J820, UM online, UMi online, USD online, UT online, UTo online & carlson, WSU online, }
8 items found as of 8/6/2021
v10#1(97),v12#10-v16#21(03),v18#19,v22#1-v33#5(20) checked 8/6/2021
searched for tin whisker(s) and Sn whisker(s) on 12/21/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/21/2020
searched for indium whisker(s) on 12/21/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/21/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/21/2020

--------------------------------------------------------
Prognostics and Health Management Conference
International Conference on Prognostics and Health Management
PHM
{ IEEE XPLORE (08,10-), (many other universities also subscribe to IEEE XPLORE), }
8 items found as of 8/3/2021
08,10-21 checked 8/3/2021

--------------------------------------------------------
Progress in Electromagnetics Research Symposium 2002
{ UC langsam micro gov NAS1.2:P94/7, UK eng QC759.6.P76, UL gov microforms NAS1.12/7:93-17 & NAS1.2:P94/7, UM online, UT hodges doc NAS1.12/7:93-17, VU central gov NAS1.12/7:93-17, }
1 item found as of 1/30/2011

--------------------------------------------------------
Progress in Materials Science
{ https://www.sciencedirect.com/journal/progress-in-materials-science/issues AU online, BYU hbll TN690.P76x, FIT TN1.P76, FSU online, GIT online, LH closed, LU gray TN1.P76, MST online, NWU online, OkSU online, OrSU online, OSU online, PU online, RU online, SDSU online, SIUC online, SIUE online, TTU, UAB sterne QC1.P884, UAr mullins QC1.P884, UC online, UCF online, UCI online, UCSD online, UDe online, UE TN1.P76, UF online, UIC online, UIUC online, UK online & eng QC1.P884, UM online, UMC online, UMe eng TN1P76, UNF online, UOk online, USF online, UTA online, UTo online, WrSU online, }
item found as of 1/21/2021
v53#5 checked 1/21/2021

--------------------------------------------------------
Progress in Photovoltaics: Research and Applications
{ https://onlinelibrary.wiley.com/loi/1099159x AU online, BYU online, FSU online, GIT online, IU online, MST online, NWU online, OkSU online, OrSU online, OSU online, RU online, RyU online, SDSU online, SIUC online, UAB online, UAr online, UC online, UCF online, UCI online, UCSD online, UF online, UIC online, UIUC online, UK online wiley, UM online, UMC online, UNF online, UOk online, USD online, USF online, USU online, UT online, UTo online, WrSU online, }
1 item found as of 1/21/2021
v16#2,v17#7 checked 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/19/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/19/2020
searched for indium whisker(s) on 12/19/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/19/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/19/2020

--------------------------------------------------------
Progress in Rubber, Plastics & Recycling Technology
{ https://journals.sagepub.com/loi/prpa FIT online, FIU online, IU online, LH closed, NEU online, OkSU online, OSU online, SDSU online, SMU online, UDe online, UF online, UK online, UM online, UMi online, USC TS1870, UTor online, }
1 item found as of 6/20/2021 catalog
v20#3-v37#2(21) checked 6/20/2021

--------------------------------------------------------
(new source 6/22/2020)
Progress in Surface Science
{ https://www.sciencedirect.com/journal/progress-in-surface-science/issues UK online (pay), }
1 item found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

--------------------------------------------------------
Prometheus
{ LH closed, MST online, OkSU online, SDSU online, SIUC online, UAr mullins L11.P954, USD online, UT online, UTo online, UTo online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Protection of Metals
Protection of Metals and Physical Chemistry of Surfaces
Zashchita metallov
{ https://link.springer.com/journal/11124/volumes-and-issues EBSCOA, IU online, MST online, MSU online, OkSU online, OSU online & sel TA462A1P7, PU online & eng 620.105Z19E, SDSU online, SIUC online, UAr online, UC online, UCSD online, UD online, UK online (pay) & eng TA462.P76, UM online, UOk online, USD online, UT online, UTo online, WSU storage, }
7 items found as of 8/6/2021
v20#3-v57#2(21) checked 8/6/2021
searched for tin whisker(s) and Sn whisker(s) on 7/20/2020

searched for zinc whisker(s) and Zn whisker(s) on 9/18/2020
searched for indium whisker(s) on 9/18/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/18/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/18/2020

--------------------------------------------------------
PRWeb
{ http://www.prweb.com/ MST online, }
13 items found as of 1/30/2011
checked 4/3/2009

--------------------------------------------------------
Publications de l'Institut de Recherches de la Siderurgie, IRSID
item found as of 1/30/2011 catalog

Philbert, Publications de l'Institut de Recherches de la Siderurgie, IRSID, A, 1956, 139.

--------------------------------------------------------
Purchasing
Purchasing.com
{ CPL, IU online, Lexmark, MST online, OkSU online, OSU bus HF5001.P985, SDSU online, SIUC online, TTU, UAr mullins HF5001.P8, UC langsam HF5001.P8, UCSD online, UE, UL ekstrom HF5001.P8, UM online, USD online, UT online, }
>=20 items found as of 1/30/2011
Jan15,98-v139#4(Apr10) checked 6/14/2010

QQQQ--------------------------------------------------------
( Quality
{ UC sw depos TS156.A1Q33, UD roesch, UK online, UL robotic TS156.A1Q33, UM online, UT online, VU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Quality and Reliability Engineering International
{ https://onlinelibrary.wiley.com/loi/10991638 AU online, BYU TA168.Q83x, FSU online, GIT online, IU online, LH closed, MST online, NWU online, OGI online, OkSU online, OrSU online, OSU online, SDSU online, SIUC online, SU online, UAB online, UAr online, UC online, UCF online, UCI online, UCSD online, UD online, UDe online, UF online, UIC online, UIUC online, UK online, UL online & robotic TA169.Q34, UM online, UMC online, UNF online, UOk online, USD online, USF online, USU online, UTo online, WrSU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Quality Digest
{ Lexmark, }
13 items found as of 1/30/2011
-v29#4 checked 5/3/2009

*** here for online 1/14/2015 *** --------------------------------------------------------
2005 Quantum Electronics and Laser Science Conference
QELS
{ IEEE XPLORE (94-), NWU online, PU eng 621.366Qu254p & hicks 621.366Qu254p, UC phys QC685.Q82, UD roesch QC685.Q36, UK online & eng QC685.I58, UM online, UT hodges QC685.Q82 (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 2/16/2021

*** here for IEEE XPLORE 2/16/2021 *** --------------------------------------------------------
Quarterly Journal of the Japan Welding Society
Yosetsu Gakkai Ronbunshu
{ https://www.jstage.jst.go.jp/browse/qjjws/list/-char/en FAU online, FIU online, LH closed, OSU sel TS227.A1Y676, RyU online, SDSU online, UCB online, UCSD online, UF online, UK online, UMi online, UPi online, UTA online, UTor online, VU online, }
12 items found as of 8/8/2021
v1#1(83)-v39#3(21) all checked 8/8/2021

--------------------------------------------------------
Quarterly Report (Batelle Memorial Institute)
item found as of 1/30/2011 catalog

Quarterly Rep. no. ov. 1949.

RRRR--------------------------------------------------------
R&D Review of Toyota CRDL
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Radiation Effects & Defects in Solids
{ https://www.tandfonline.com/loi/grad20 EBSCOA, AU online, CSULA online, CSULB online, GIT online & main QD601.A1R254, IU online, KYVL, MST online, OkSU online, OSU online & sel QD625.R344, PU phys 548.05C889, SDSU online, SIUC online, UAB sterne QD601.A1R254, TTU, UAH online, UAr online, UC phys QD601.A1R28, UCF online, UCSD online, UF online, UK online, UM online, UOk online, USC sel, USD online, UT online & hodges QC770.R23, UTo online, WSU sci, }
17 items found as of 8/6/2021
v164#1-v176#6(21) checked 8/6/2021
searched for tin whisker(s) & Sn whisker(s) on 11/30/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/30/2020
searched for indium whisker(s) on 11/30/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/30/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/30/2020

--------------------------------------------------------
Rare Metal Materials and Engineering
Xiyou Jinshu Cailiao yu Gongcheng
{ LH closed, OkSU online, SMU online, TU online, UMi online, UNCC online, }
4 items found as of 10/21/2011 catalog
v37#1-v40#6 checked 10/21/2011
searched for tin whisker(s) and Sn whisker(s) on 12/22/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/22/2020
searched for indium whisker(s) on 12/22/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/22/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/22/2020

(new reference 12/30/2008)
Xia, Zhidong, Lei, Yongping, Shi, Yaowu An analysis of patent situation, impurity control and standard of lead-free solders Xiyou Jinshu Cailiao yu Gongcheng (Rare Metal Materials and Engineering). Vol. 33, Suppl. 2, pp. 147-151. Dec. 2004

Zhou, Jian (Southeast University), Sun, Yangshan, Xue, Feng "Influence of indium on wetting behaviors of Sn-8Zn-3Bi lead-free solders," Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, vol. 35 no. 4, Apr. 2006, pp. 613-616 Language: Chinese.

Zhang, Keke, Wang, Yaoli, Fan, Yanli, Zhu, Yaomin, Zhang, Xin, Yan, Yanfu .Effect of Ce-La mixed rare earth content and environment conditions on the creep rupture life of SnAgCu solder joints Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, v 36, n 8, August, 2007, p 1473-1476 Language: Chinese

Yu, Yang, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan, Chen, Shujun .Relation between the Surface condition and microstructure of solder balls Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, v 37, n 6, June, 2008, p 1092-1094 Language: Chinese

--------------------------------------------------------
RCA Review
{ CMU eng, CSULA north TK6540.R111, CSULB orca TK6540.R12, OSU sel TK6540.R27, SMU sci, UC ceas TK6540.R3 & ceas microfilm 19, UCF main TK7800.R24, UD remote, UF sci TK6540.R12, UK storage TK6540.R12, UL robotic TK6540.R12, USC grand 621.38405.R111, UT hodges TK6540.R12, UTAr depos TK6540.R12, UTD TK6540.R111, VU annex TK6540.R12, }
1 item found as of 8/3/2012 catalog
v1#1-v47#4(86) all issues checked 8/3/2012

--------------------------------------------------------
Recycled Paper News
{ GIT main-6e TS1120.5.R448, }
item found as of 1/30/2011

--------------------------------------------------------
Recycling Today
{ MST online, MSU online, OSU online, UOk online, USF online, UTo carlson, WSU online, }
5 items found as of 1/30/2011

--------------------------------------------------------
Renewable Energy
{ https://www.sciencedirect.com/journal/renewable-energy/issues MST online, OSU online, PU eng 621.04205R293, SDSU online, UC online & depos TJ807.R465, UCSD online, UD online, UIC online, UK online sd, UL online & kersey TJ810.S782, UM online, UT online, UTo online, WSU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Resources, Conservation and Recycling
Resources, Conservation, and Recycling
{ https://www.sciencedirect.com/journal/resources-conservation-and-recycling/issues BoU online, FAU online, FIU online, IU online, MIT online & storage, NEU online, OkSU online, OSU online & sel TP995.A1R4322, PU online & eng 639.905R7655, RyU online, SDSU online, SMU online, TU online, UC online & geo TD794.5.C663, UCSD online, UIC online, UM online & shapiro TD794.5.R46, UMi online, UNCC online, UPi online, UT online, UTD online, UTor online, UWa online, }
>=20 items found as of 8/8/2021 catalog
v1#1(2000)-v173(21) all issues checked 8/8/2021

--------------------------------------------------------
2007 REU Research Accomplishments
{ }
3 items found as of 2/9/2011

--------------------------------------------------------
Review
{ CSULB online, UC online, UK online & young oversize HX1.W380 & young PR1.R33 & young PR1.R32, UL various, UM various, UT online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Review of Scientific Instruments
{ https://aip.scitation.org/toc/rsi/current UK online & sci Q184.R5 & remote Q184.R5, }
12 items found as of 1/21/2021

searched for tin whisker(s) and Sn whisker(s) on 7/20/2020

searched for zinc whisker(s) and Zn whisker(s) on 9/18/2020
searched for indium whisker(s) on 9/18/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/18/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/18/2020

--------------------------------------------------------
Reviews of Modern Physics
{ https://journals.aps.org/rmp/issues CBU, IU online & bloomington swain QC1.R3 & alf QC1.R3, MST online, NWU online & sci 530.5R454, OkSU online, OSU online & sel QC1P572, PU online & phys 530.5R315, SDSU online, SIUC online, SIUE online, TTU online, UAr online, UC online & phys QC1.R43, UCSD online, UD online & roesch, UE online, UIC online & sci, UK online & chem/phys QC1.R4, UL kersey QC1.R4, UM online & shapiro QC1.R454 & buhr QC1.R454, UOk online, USD online, UT online & hodges QC1.R4, }
2 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 7/20/2020

searched for zinc whisker(s) & Zn whisker(s) on 9/7/2020
searched for indium whisker(s) on 9/7/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/7/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/7/2020

--------------------------------------------------------
Revue Roumaine de Physique
{ KU anschulz QC1.R43, MSU remote QC1.R43 & sci QC1.R43, PU hicks 530R328, SIUC storage 53960-5301, UK king QC1.R43, UM shapiro QC1.R473, WSU sci, }
1 item found as of 1/30/2011

--------------------------------------------------------
RF Design
{ http://rfdesign.com/ MST online, SDSU online, }
2 items found as of 1/30/2011
Jan07 checked 8/29/2010

(new reference 12/23/2013)
Gerke Nov 1988 p 65-71

--------------------------------------------------------
(new source 6/22/2020)
29th Rio Grande Symposium on Advanced Materials
{ }
1 item found as of 6/22/2020

--------------------------------------------------------
Risk Analysis
{ https://onlinelibrary.wiley.com/loi/15396924 CSULB online, MST online, OkSU online, OSU online, SDSU online, SIUC online, SMU online, UC online, UCSD online, UK online & young T174.5.R55, UL online & kersey T174.5.R54, USC T174.5.R55, USD online, UT online, UTD online, }
4 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/19/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/19/2020
searched for indium whisker(s) on 12/19/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/19/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/19/2020

--------------------------------------------------------
RoHS Compliance & LEADOUT Seminar
{ }
5 items found as of 1/30/2011 catalog

--------------------------------------------------------
Route
{ http://dc.ipc.org/Route.htm }
16 items found as of 1/30/2011 catalog
Jan98-Jun08 checked 4/3/2009

--------------------------------------------------------
RTE Business
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Rubber Expo 03
item found as of 1/30/2011 catalog

(new reference 2/13/2011)
Kang, Donghee, Desai, Keyur, Ho, Kicherl, Sung, Changmo, Mead, Joey LEAD FREE ELASTOMER STABILIZATION FOR WIRE AND CABLE APPLICATIONS Rubber Expo 03: 2003 Technical Meeting of the American Chemical Society, Rubber Division, Cleveland, OH, USA, 14-17 Oct. 2003. 2003

--------------------------------------------------------
Russian Journal of Applied Chemistry
Zhurnal Prikladnoi Khimii
{ https://link.springer.com/journal/11167/volumes-and-issues IU bloomington alf TP1.A35, MST depos 660.5J826b, MSU remote TP1.Z6313, NWU online & sci 660.5Z63 & 660.5Z63X, OkSU stillwater 660.5Z63, OSU online & sel TP1.K45, PU chem 540.5Z9E, SDSU online, SIUC storage 660.5Z63, UC online, UD online, UIC online & sci TP1.Z6314, UK online & king TP1.Z6313, UM shapiro TP1.Z65 & buhr TP1.Z653, UOk online, USD online, UT hodges TP1.A35, }
1 item found as of 1/21/2021

searched for tin whisker(s) and Sn whisker(s) on 11/27/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/27/2020
searched for indium whisker(s) on 11/27/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/27/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/27/2020

--------------------------------------------------------
Russian Microelectronics
Mikroelektronika
{ https://link.springer.com/journal/11180/volumes-and-issues CSULB online, OSU online, UC online, UD online, UK online, UM online, USC TK7874.M478, UT online, VU online, }
2 items found as of 1/21/2021

searched for tin whisker(s) and Sn whisker(s) on 11/27/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/27/2020
searched for indium whisker(s) on 11/27/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/27/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/27/2020

--------------------------------------------------------
Russian Physics Journal
Izvestiia VUZ. Fizika
{ https://link.springer.com/journal/11182/volumes-and-issues OSU online, UC online, UD online, UK online, UM online, UT online, VU online, }
1 item found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 11/27/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/27/2020
searched for indium whisker(s) on 11/27/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/27/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/27/2020

SSSS--------------------------------------------------------
Sadhana - Academy Proceedings in Engineering Sciences
{ https://link.springer.com/journal/12046/volumes-and-issues AU online, BYU online, FIT online, FSU online, GIT online, LH closed, MST online, OGI online, OkSU online, OSU online, PU online, SDSU online, SIUC morris 52797-6202, SU online, UAB online, UC online, UCI online, UCSD online, UDe online, UF online, UF online, UIC online, UIUC online, UK online, UM online, UMC online, USD online, USF online, USU online, UTo online, WrSU online, }
1 item found as of 1/21/2021
v33#3 checked 1/21/2021

searched for tin whisker(s) and Sn whisker(s) on 11/27/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/27/2020
searched for indium whisker(s) on 11/27/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/27/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/27/2020

--------------------------------------------------------
SAE Journal
{ CSULA palmer oversize TL1.S63, CSULB orca TL1.S5, MST wilson TL1.S5, OkSU stillwater 629.105S111, OSU sel TL1S671, SDSU TL1.S5, SIUC morris 51601-6292, UAr mullins TL1.S5, UCSD online, UK eng TL1.S5, UL kersey TL1.S6, UMe mcwherter, UOk bizzell TL1.S5, USC grand TL1.S5, V.65, }
item found as of 1/30/2011

--------------------------------------------------------
SAE Technical Paper Series
{ https://www.sae.org/publications/technical-papers/ LH closed, MST wilson microfiche TL1.S552, MSU various, OSU sel reference microform MICROFICHE2TL1, SDSU various, TTU various, UAr mullins TL240.S3, UC eng microfiche SAE, UCSD sio TC1662.A46, UK eng microfiche & CDROM CS 95-2, UM online, UMe mcwherter various, USC TLno.1(Fiche), UT hodges Microfiche TL1.S6, UTA microform, WSU sci, }
1 item found as of 1/30/2011

Iezzi, Robert A, CRITICAL PROCESS PARAMETERS AFFECTING ZINCROMETAL PERFORMANCE. SAE International Congress and Exposition, Detroit, Michigan, Feb. 27-Mar. 2, 1984. SAE Technical Paper Series, 1984, 840209p

*** NOT APPLICABLE *** --------------------------------------------------------
SAE Transactions
SAE Quarterly Transactions
SAE 1991 Transactions Journal of Aerospace
{ https://www.jstor.org/journal/saetransactions CSULA palmer oversize TL1.S63, CSULB orca TL1.S6, MST wilson TL1.S6, OkSU stillwater microfiche, OSU sel TL1S62, SDSU TL1.S6, SIUC morris oversize TL1.S6, SIUE lovejoy TL1.S6, SMU storage TL1.S6, TTU, UAr mullins TL1.S6, UC eng TL1.S6, UCSD s&e TL1.S6934, UE TL1.S6, UK online & eng TL1.S6, UL kersey TL1.S6, UMe mcwherter TL1.S6, UOk bizzell TL1.S6, USC grand, }
1 item found as of 1/21/2021

--------------------------------------------------------
SAE 2000 World Congress
{ UM offsite TL278.S241, }
1 item found as of 1/30/2011

--------------------------------------------------------
SAMPE Journal
Journal of Advanced Materials
SAMPE Quarterly
{ https://www.nasampe.org/general/custom.asp?page=journal_bld OSU sel TL950.S57, SDSU TA401.S617, SIUC morris 53995-6201, UC depos TL950.S5825, UCSD s&e TL1.S3, UK eng TL950.S5825, UM offsite TA401.M433, UNCC TL950.S5825, UOk eng TL950.S583, UPi storage, USC grand, UT hodges TA401.S46, UTA eng TL950.S5825, UTor eng TL950.S5, WSU sci, }
3 items found as of 6/11/2015 catalog
v1#1-v45#4 all issues checked 6/11/2015

--------------------------------------------------------
San Francisco Chronicle
{ UK online, UM online, VU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
(new source 10/3/2020)
Sci-Hub
{ https://sci-hub.se/, }
>=20 items found as of 10/16/2020

finding papers from their doi numbers, in formal 10.xxxx/yyyyyyyyyyyy

--------------------------------------------------------
Science
{ https://science.sciencemag.org/content/by/year OkSU online, SDSU Q1.S35, UAr online, UCSD online, UD roesch, UE online, UIC online, UK online & chem/phys Q1.S35 & eng Q1.S35 & king Q1.S35 & young Q1.S35, UL online & kersey Q1.S35, UM online & shapiro Q1.S394 & buhr Q1.S39, USD online, UT online Q1.S39, }
14 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 9/8/2020
searched for zinc whisker(s) & Zn whisker(s) on 9/8/2020
searched for indium whisker(s) on 9/8/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/8/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/8/2020

Example: http://dx.doi.org/10.1126/science.volume.number.page --------------------------------------------------------
Science and Engineering Review of Doshisha University
{ https://doshisha.repo.nii.ac.jp/index.php?action=pages_view_main&active_action=repository_view_main_item_snippet&index_id=3812&pn=1&count=50&order=7&lang=japanese&page_id=13&block_id=100 GIT online, OSU thompson Q77.D6, UF sci TA4.D722x, UK online, UM buhr Q1.D72, UPi eng, }
item found as of 1/21/2021 catalog

(new reference 2/9/2011)
Growth of silver whiskers and transport of silver atoms in silver chalcogenides Sci. Eng. Rev. Doshisha Univ. Vol. 15, pp. 1-35 1974

(not at UK) --------------------------------------------------------
Science and Technology of Advanced Materials
{ https://www.sciencedirect.com/journal/science-and-technology-of-advanced-materials/issues MST online, OkSU online, OSU online, SDSU online, SIUC online, UAr online, UC online, UCSD online, UK online, UM online sd, USD online, UT online, UTo online, WSU online, }
1 item found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/22/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/22/2020
searched for indium whisker(s) on 12/22/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/22/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/22/2020

--------------------------------------------------------
Science & Technology of Welding & Joining
{ https://www.tandfonline.com/loi/ystw20 EBSCOA, AU online, BYU online, FSU online, GIT online, IU online, LH closed, NWU online, OGI online, OkSU online, OrSU online, OSU online, RyU online, SDSU online, SIUC online, SU online, UAH online, UAr online, UCI online, UCSD online, UDe online, UF online, UIC online, UK online (pay), UMC online, UMi online, UNCC online, UOk online, UPi online, USD online, USF online, USU online, UT online, UTo online, UTor online, UWa online, WrSU online, }
12 items found as of 8/6/2021 catalog
v8#1-v26#6(21) checked 8/6/2021
searched for tin whisker(s) and Sn whisker(s) on 12/22/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/22/2020
searched for indium whisker(s) on 12/22/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/22/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/22/2020

--------------------------------------------------------
(new source 9/15/2020)
Science China Technological Sciences
{ https://caod.oriprobe.com/journals/JEXG/Science_China_Technological_Sciences.htm UK online, }
2 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 9/16/2020
searched for zinc whisker(s) and Zn whisker(s) on 9/16/2020
searched for indium whisker(s) on 9/16/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/16/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/16/2020

--------------------------------------------------------
Science Friday
{ VU online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Science News
{ http://www.sciencenews.org/view/page/id/41/title/Help_%2B_FAQ, OSU online, UC online, UD online, UK online & young Q1.S76, UL online, UM online, UT online, VU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
(new source 9/8/2020)
The Science News-Letter
Science News Letter
{ https://www.jstor.org/journal/scienewslett UK online (JSTOR), }
2 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 9/8/2020
searched for zinc whisker(s) & Zn whisker(s) on 9/8/2020
searched for indium whisker(s) on 9/8/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/8/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/8/2020

--------------------------------------------------------
Science of the Total Environment
{ https://www.sciencedirect.com/journal/science-of-the-total-environment/issues MST online, MSU online & main TD172.S35, NWU online, OkSU online, OSU online & vet RA565S375, PU online & eng 363.7305Sci27, SDSU online, SIUC online, SIUE online, UC online & sw depos, UCSD online, UIC online & sci RA565.S365, UK online & chem/phys RA565.S365, UL online, UM online & pub health RA421.S423, UT online, UTo online & carlson, WSU online & sci, }
1 item found as of 1/21/2021

--------------------------------------------------------
ScienceDaily
{ http://www.sciencedaily.com/about.htm, }
1 item found as of 1/30/2011

--------------------------------------------------------
Scientific American
{ http://www.scientificamerican.com/sciammag/ CSULB orca T1.S5, UC online, UD online, UK online & eng T1.S5, UL robotic T1.S5 & various, UM online, USC grand, UT online, VU online, }
2 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 9/8/2020
searched for zinc whisker(s) & Zn whisker(s) on 9/8/2020
searched for indium whisker(s) on 9/8/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/8/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/8/2020

--------------------------------------------------------
(new source 10/11/2020)
scientific.net
{ https://main.scientific.net/Search/Search? }
checked 1/21/2021

--------------------------------------------------------
(new source 1/23/2021)
Scientific Reports

1 item found as of 1/21/2021

searched for tin whisker(s) and Sn whisker(s) on 1/23/2021
searched for zinc whisker(s) & Zn whisker(s) on 1/23/2021
searched for indium whisker(s) on 1/23/2021
searched for cadmium whisker(s) & Cd whisker(s) on 1/23/2021
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 1/23/2021

--------------------------------------------------------
Scrap
{ http://www.scrap.org/, GIT main HD9575.A1S37, LH closed, }
1 item found as of 1/30/2011

--------------------------------------------------------
Screen Printing
{ LH closed, RyU TT273.A1S33, UOk bizzell TT273.S33, }
3 items found as of 1/30/2011

-------------------------------------------------------
Scripta Materialia
Scripta Metallurgica et Materialia
{ https://www.sciencedirect.com/journal/scripta-materialia/issues https://www.sciencedirect.com/journal/scripta-metallurgica-et-materialia/issues BoU online, CSULB online, MIT online & hayden TN.S434, MST online, NEU online, NWU, OkSU online, OSU online & sel TN1.S443, PU online & eng 669.005Scr34, RyU online, SDSU online, SIUC online, TU online & tisch TN1.S36, TTU, UC online, UCI online & sci TN.S3, UCSD online, UK online sd & eng TN1.S36, UL online & kersey TN1.S36, UM online, UNCC online, UOk online, USC grand, UT online & hodges TN1.S36, UTo online, UTor online, UWa online, WSU online & sci, }
>=20 items found as of 8/8/2021
v25#10,v48#1-v203(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 7/20/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/7/2020
searched for indium whisker(s) on 8/7/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/7/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/7/2020

(new reference 2/20/2021)
," Scripta Materialia, vol. 199, pp. , July 1, 2021.

A. Mazumdar, A. Thamizhavel, V. Nanal, R.G. Pillay, ... S. Mallikarjunachary "Synchrotron x-ray diffraction studies of the a<=>b structural phase transition in Sn and Sn-Cu," Scripta Materialia, vol. 199, pp. 113858-1-113858-, July 1, 2021. https://doi.org/10.1016/j.scriptamat.2021.113858

Abhay Gupta, Chandan Srivastava Temperature driven texture and grain boundary engineering of electrodeposited ß-Sn coatings and its effect on the coating corrosion behaviour: Five-parameter grain boundary character distribution analysis study ," Scripta Materialia, vol. 196, pp. 113763-1-113763-, Apr. 15, 2021. https://doi.org/10.1016/j.scriptamat.2021.113763

P. Corte-Leon, V. Zhukova, J.M. Blanco, M. Ipatov, ... A. Zhukov Development of iron-rich microwires with a unique combination of magnetic properties ," Scripta Materialia, vol. 195, pp. 113726-1-113726-, 2021. https://doi.org/10.1016/j.scriptamat.2021.113726

--------------------------------------------------------
Scripta Metallurgica
{ https://www.sciencedirect.com/journal/scripta-metallurgica/issues MST wilson TN1.S4, OkSU online, OSU sel TN1.S44, SDSU compact TN1.S3, SIUC storage 54043-6691, TTU, UCI online & sci TN1.S3, UCSD online, UK online & eng TN1.S31, UL kersey TN1.S36, UOk online, UT online, UTO depos, WSU sci, }
4 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 7/20/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/13/2020
searched for indium whisker(s) on 8/13/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/13/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/18/2020

--------------------------------------------------------
Seattle Post Intelligencer
{ OSU online, UD online, UK online, UM online, VU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
SEI Technical Review
{ http://www.sei.co.jp/tr_e/ UK online, UTor online, }
4 items found as of 6/20/2021 catalog
53-91(oct20) checked 6/20/2021

--------------------------------------------------------
SEMICON
SEMICON 2006 China
SEMICON 2005 Europe
SEMICON Singapore 2007
SEMICON West
{ UM buhr TK7871.85.S45411, }
10 items found as of 1/30/2011 catalog

--------------------------------------------------------
Semiconductor Device Reliability
{ }

(new reference 12/23/2013)
DeChiaro Series E v 175 1989 p 379-412

--------------------------------------------------------
2002 Semiconductor Equipment and Materials International
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Semiconductor International
{ IU online, KYVL, Lexmark, MST online, NWU online, OkSU online, OSU online, PU eng 621.3815205Se52, SDSU online, SIUC online, UAr online, UC eng TK7871.85.S44, UCSD online, UIC online & daley TK7871.85.S464, UL kersey TK7871.85.S464, UM online, USD online, UT online, }
16 items found as of 1/30/2011

(new reference 12/23/2013)
Unger Aprl 1982

(not at UK) baliga, john, "tin for no-lead solder," semiconductor international, vol. 22 no. 8, pp. 74, july 1999.

baliga, john, "the emperor's new lead-free clothes," semiconductor international , vol. 23 no. 10, pp. 21, sept. 2000.

dance, brian, "european producers call for lead-free world standard," semiconductor international, vol. 24 no. 10, pp. 50, sept. 2001.

bogatin, eric, "lead-free is coming," semiconductor international, vol. 25, no. 4, pp. 42, apr. 2002.

reed, greg, "packaging according to lead-free mandates," semiconductor international, vol. 26 no. 9, pp. 44, aug. 1, 2003.

reed, greg, "moisture prevention for packaged semiconductors," semiconductor international, vol. 26 no. 11, pp. 36, oct. 2003.

frear, darrel, "the lead-free solder challenge," semiconductor international, vol. 26 no. 11, pp. sp-20, oct. 2003.

? collier, terence, "qualifying packages at 260øc," semiconductor international, vol. xx no. xx, pp. xx, dec. 1, 2003.

reed, greg, "lead-free debate: all over but the shouting," semiconductor international, vol. 27 no. 5, pp. 15, may 2004.

? schischke, karsten, "the lead-free challenge: materials for assembly and packaging," semiconductor international, vol. xx no. xx, pp. xx-xx, aug. 2004.

baliga, john, "can nickel barriers eliminate tin whiskers?," semiconductor international, vol. 27 no. 12, pp. 38, nov. 1, 2004.

? spiegel, rob, "gaps in the lead-free conversion," semiconductor international , vol. xx no. xx, pp. xx, dec. 16, 2004.

labennett, richard, and yeh, shing, "wafer bumping: fine-pitch and lead-free solder," semiconductor international, vol. 28 no. 4, pp. 83-88, apr. 2005.

? baliga, john, "nanotechnology comes to the lead-free rescue," semiconductor international, vol. xx, no. xx, pp. 32, may 1, 2005

peters, laura, "lead-free brings out problem of brittle fracture," semiconductor international, vol. 28 no. 11, pp. 38, oct.2005.

patterson, timothy, "the high-speed, low-cost, lead-free challenge for flip-chips," semiconductor international, vol. 28 no. 11, pp. sp-4-sp-8, oct. 2005.

--------------------------------------------------------
Semiconductor Packaging
{ http://www.semiconductorpackagingnews.com/, }
1 item found as of 1/30/2011

--------------------------------------------------------
(new source 9/4/2020)
Semiconductor Science and Technology
{ https://iopscience.iop.org/journal/0268-1242 UK online, }
4 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 7/20/2020

searched for zinc whisker(s) & Zn whisker(s) on 9/7/2020
searched for indium whisker(s) on 9/7/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/7/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/7/2020

--------------------------------------------------------
Semiconductor Thermal Measurement and Management Symposium
SEMI-THERM
{ IEEE XPLORE (88-), (many other universities also subscribe to IEEE XPLORE), }
2 items found as of 8/3/2021
88-21 checked 8/3/2021

--------------------------------------------------------
Semimfg.com
{ http://www.semimfg.com/, }
1 item found as of 1/30/2011

--------------------------------------------------------
Sensors
{ https://www.mdpi.com/journal/sensors CSULB online, MSU online, OSU online, UD online, UK online & remote TA165.S458, UL robotic TJ212 S42, UM online, USC TA165.S458, UTAr online, UTD online, VU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Sensors and Actuators
{ https://www.sciencedirect.com/journal/sensors-and-actuators/issues CSULB online, OSU online, UC online, UK online & eng TL272.5.S460 & remote TK7881.2.S46, UL robotic TK7881.2.S46, UM online, USC grand, VU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Sensors and Actuators A: Physical
{ https://www.sciencedirect.com/journal/sensors-and-actuators-a-physical/issues MST online, OkSU online, OSU online & TK7881.2S46, TTU, UCSD online, UK online sd & eng TL272.S480 & TK7881.2.S46, UL kersey TK7881.2.S46, UMe, UT online, }
7 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/20/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/20/2020
searched for indium whisker(s) on 12/20/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/20/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/20/2020

--------------------------------------------------------
Sensors Magazine
{ IU online, MSU eng TA165.S458, NWU online, OSU online, PU eng 681.205Se59, UIC online, UK eng TA165.S458, UL kersey TJ212.S42, UT online, WSU sci, }
1 item found as of 1/30/2011

--------------------------------------------------------
si-list
{ http://www.freelists.org/archive/si-list, http://www.si-list.net/, }
1 item found as of 1/30/2011

--------------------------------------------------------
SID Conference Record of the International Display Research Conference
1 item found as of 1/30/2011 catalog
91

Watanabe, Itsuo, Gotoh, Yasushi, Kobayashi, Kouji "Packaging technologies using anisotropic conductive adhesive films in FPDs SID Conference Record of the International Display Research Conference, 2001, pp. 553-556

--------------------------------------------------------
(new source 11/8/2020)
Signal Integrity Journal
{ https://www.signalintegrityjournal.com/ }
1 item found as of 11/8/2020
v2#1 checked 11/8/2020

--------------------------------------------------------
Sitzungberichte der Eosterreichischen Akadamie der Wissenschaften in Wien
item found as of 1/30/2011 catalog

Hasslinger, Sitzb. Akad. Wien, 117, 501 (1908).

--------------------------------------------------------
Sitzungsberichte der koniglich Akadamie der Wissenschaften zu Amsterdam
{ UT hodges closed AS142.V33, }
item found as of 1/30/2011 catalog

Sitzungsberichte der konigl. Akadamie der Wissenschaften zu Amsterdam June 24, 1899

Sitzungsberichte der konigl. Akadamie der Wissenschaften zu Amsterdam Sept. 30, 1899

--------------------------------------------------------
SMART Group
SMART Group "All You Ever Wanted to Know About Lead-Free" Seminar
SMART Group 8th Annual Lead-Free Seminar
SMART Group 6th Annual Lead-Free Seminar and Table-top Exhibition
SMART Group Ireland Lead-free Seminar
SMART Group Ireland Lead-Free Wave Soldering Workshop
SMART Group Lead-Free Seminar
SMART Group Lead-Free Seminar 2000
SMART Group/NPL Lead Free Seminar 2003
SMART/LEADOUT Lead-Free Implementation Seminar
{ http://www.smartgroup.org/members/seminar.asp, }
>=20 items found as of 1/30/2011 catalog
99-01,03-04

," SMART Group Lead Free and 0201 Assembly and Soldering Seminar, High Wycombe, United Kingdom, Feb. 14, 2002.

," Design For Manufacture Considerations for Lead-Free, Cork, Ireland, Dec. 2, 2004.

," SMART Group 7th Annual Lead Free Seminar, High Wycombe, United Kingdom, Feb. 2005.

--------------------------------------------------------
SMARTer
{ http://www.smartgroup.org/ }
2 items found as of 1/30/2011 catalog
Dec08 checked 4/9/2009

--------------------------------------------------------
SMT Web Exclusive Article
{ http://smt.pennnet.com/display_category/35/2008/HMST/3/Home-Page/ }
>=20 items found as of 1/30/2011
98-09 checked 4/3/2009

"," SMT Web Exclusive Article.

--------------------------------------------------------
SMTA China East Technical Conference 2008
{ https://www.smta.org/knowledge/proceedings.cfm, }
>=20 items found as of 11/26/2020
07-08,12,14-15,17 checked 11/26/2020

--------------------------------------------------------
SMTA China South 2017 Proceedings
{ https://www.smta.org/knowledge/proceedings.cfm, }
4 items found as of 11/26/2020
17 checked 11/26/2020

--------------------------------------------------------
Conference Proceedings SMTA International
SMTA International 2010 Conference Proceedings
Proceedings of the SMTA International Conference
Proceedings, Surface Mount International Conference
SMTA International
SMTA International ATE Show
2008 SMTA International Conference Proceedings
SMTA International Conference
Surface Mount International Conference & Exposition Proceedings of the Technical Program
SMTA International Conference Proceedings
SMTA International Proceedings 2000
SMTA Technical Conference
1998 Surface Mount International Conference Proceedings
1995 Surface Mount International Conference Proceedings of the Technical Program
Surface Mount International Proceedings of the Technical Program
{ http://www.smta.org/knowledge/knowledge.cfm, http://www.circuitinsight.com/, Lexmark TK7868.P67S87, LH closed & open, UK eng TK7868.P7S870, UTA eng TK7868P7S935, }
>=20 items found as of 1/6/2021 catalog
92-93,95-20 checked 1/6/2021

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SMTA/IMAPS Mini-Symposium
{ }
2 items found as of 1/30/2011 catalog

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SMTA-IPC High-Reliability Cleaning and Conformal Coating Conference 2014
{ http://www.smta.org/, }
2 items found as of 11/26/2020
14,16 checked 11/26/2020

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SMTA Journal
SMTAnews & Journal of Surface Mount Technology
Journal of SMT
Journal of Surface Mount Technology
{ http://www.smta.org/ }
>=20 items found as of 11/26/2020
v12#1-v32#3(19) checked 11/26/2020

," SMTA Journal, vol. 32 no. 3, pp. , 2019.

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Software and Microsystems
{ IEEE XPLORE (v1#1-v4#6), UK online, (many other universities also subscribe to IEEE XPLORE), }
4 items found as of 8/2/2021
v1#1-v4#6(ended publication) all issues checked 8/2/2021

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Solar Energy Materials and Solar Cells
{ https://www.sciencedirect.com/journal/solar-energy-materials-and-solar-cells/issues AU online, FIT evans, FSU online, GIT online & main-5e TJ812.7.S64, LH closed, MST online, NWU online, OkSU online, OrSU online, OSU online, PU online, RU online, SDSU online, UAr online, UC online, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UIUC online, UK online, UM online, UMC online, UNF online, UOk online, USF online, USU online, UT online, UTA online, UTo online, WrSU online, }
2 items found as of 1/21/2021

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Soldering & Assembly Technology
item found as of 1/30/2011 catalog

Baudry, I, and Kerros, G, "Focused Ion Beam in Microelectronics Packaging Applications - Leadfree Plating Analysis," Soldering &, Assembly Technology, vol. 3 Nov. 3, 2001.

Baudry, I., and G. Kerros, "Focused Ion Beam in Microelectronics Packaging Applications - Leadfree Plating Analysis-", Soldering & Assembly Technology, www.lead-free.org, November, 3, 2001.

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Soldering & Surface Mount Technology
{ https://www.emerald.com/insight/publication/issn/0954-0911 AU online, FIT online, FSU online, GIT online, IU online, LH closed, MIT online, MSU online, NEU online, NWU online, OkSU online, OSU online, RyU online, SDSU online, SMU online, UA online, UAr online, UC online, UCB online, UCF online, UCSD online, UD online, UF online, UK online, UL online, UM online, UMC online, UNF online, UOk online, UT online, UTD online, UTo online, UWa online, VU online, WSU online, }
>=20 items found as of 8/8/2021 catalog
v1#1-v9#2,v10#1-vv33#4(21) all issues checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 7/20/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/8/2020
searched for indium whisker(s) on 8/8/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/8/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/2/2020

(new reference 7/10/2021)
," Soldering & Surface Mount Technology, vol. 33 no. 4, pp. , 2021.

Chung-Yung Lin Interfacial reaction between Ni particle reinforcements and liquid Sn-based eutectic solders ," Soldering & Surface Mount Technology, vol. 33 no. 4, pp. , 2021.

Waluyo Adi Siswanto, Kirill Borodin, Zaid Hamid Mahmoud, A. Surendar, Sami Sajjadifar, Galiya Abdilova, Jun Chang Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems ," Soldering & Surface Mount Technology, vol. 33 no. 4, pp. , 2021.

Gui-sheng Gan, Liujie Jiang, Shiqi Chen, Yongqiang Deng, Donghua Yang, Zhaoqi Jiang, Huadong Cao, Mizhe Tian, Qianzhu Xu, Xin Liu Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperature ," Soldering & Surface Mount Technology, vol. 33 no. 4, pp. , 2021.

Xu Han, Xiaoyan Li, Peng Yao, Dalong Chen Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints ," Soldering & Surface Mount Technology, vol. 33 no. 4, pp. , 2021.

Riaz Muhammad, Umair Ali Optimized cerium addition for microstructure and mechanical properties of SAC305 ," Soldering & Surface Mount Technology, vol. 33 no. 4, pp. , 2021.

Buen Zhang, Noor H. Jabarullah, Ayad F. Alkaim, Svetlana Danshina, Irina V. Krasnopevtseva, Yuan Zheng, Nisith Geetha Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling ," Soldering & Surface Mount Technology, vol. 33 no. 3, pp. , 2021.

Feng Wang, Fangfang Zhang, Qixiang Huang, Mohammad Salmani An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems ," Soldering & Surface Mount Technology, vol. 33 no. 3, pp. , 2021.

Guang Ren, Maurice Collins Effect of Sb additions on the creep behaviour of low temperature lead-free Sn–8Zn–3Bi solder alloy ," Soldering & Surface Mount Technology, vol. 33 no. 3, pp. , 2021.

Hao Zou, Fang Xie, Bo Du, G. Kavithaa Useful lifetime estimation of solder joints in power semiconductors employed in current source and voltage source inverters ," Soldering & Surface Mount Technology, vol. 33 no. 3, pp. , 2021.

Wenhui Cai, Fei Huang, Kai Liu, Mohammed Alaazim "An investigation on function of current type on solder joint degradation in electronic packages," Soldering & Surface Mount Technology, vol. 33 no. 2, pp. 105-111, 2020. https://doi.org/10.1108/SSMT-06-2020-0025

Rabiatul Adawiyah Mohamed Anuar, and Saliza Azlina Osman, x "The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces," Soldering & Surface Mount Technology, vol. 33 no. 2, pp. 75-85, 2020. https://doi.org/10.1108/SSMT-03-2019-0009

Ren, W., Lu, M., Liu, S., and Shangguan, D., "Thermal Mechanical Property Testing of Lead-Free Solder Joints," Soldering &am; Surface Mount Technology, vol. 9 no. 3, pp. 37-40, 1997.

(not at UK) --------------------------------------------------------
Soldering Science & Technology Club
SSTC Meeting #22
1 item found as of 1/30/2011 catalog

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Solid State Communications
{ https://www.sciencedirect.com/journal/solid-state-communications/issues CSULA north QC176.A1S6, CSULB online, MST online, OkSU online, OSU online & sel QC176A1S6, SDSU online, SIUC online, SIUE online, UAr online, UK online sd & chem/phys QC176.A1, UL online & kersey QC176.A1S6, UMe online & mcwherter, UOk online, USC grand, USD online, UT online, }
3 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

(new reference 12/5/2020)
Davis, J. H., M. J. SkoveE. P. Stillwell Superconducting transition temperature and resistivity of tin whiskers as a function of uniaxial tension Solid State Communications Volume 4, Issue 11, November 1966, pp. 597-600 https://doi.org/10.1016/0038-1098(66)90142-6

israeloff, n. e., m. b. weissmanr. l. jacobsen are copper whiskers noisy? solid state communications volume 66, issue 8, may 1988, pp. 805-808 https://doi.org/10.1016/0038-1098(88)90390-0

Leemann, C., M. J. SkoveE. P. Stillwell Excess “1ƒ” noise in bismuth whiskers Solid State Communications Volume 35, Issue 2, July 1980, pp. 97-100 https://doi.org/10.1016/0038-1098(80)90222-7

Meyer, J. D., R. Tidecks Investigation of the current induced phase transition of superconducting tin whiskers with several potential probes Solid State Communications Volume 24, Issue 9, December 1977, pp. 639-641 https://doi.org/10.1016/0038-1098(77)90380-5

Meyer, J. D., R. Tidecks Mutual influence of voltage steps in the V–I characteristics of current-carrying superconducting tin whiskers Solid State Communications Volume 24, Issue 9, December 1977, pp. 643-646 https://doi.org/10.1016/0038-1098(77)90381-7

Meyer, J. D., R. Tidecks The influence of the mean free path on the current induced superconducting/normal conducting transition of tin whiskers with indium impurities Solid State Communications Volume 18, Issue 3, 1976, pp. 305-307 https://doi.org/10.1016/0038-1098(76)90009-0

Schulz, U., R. Tidecks Current-induced superconducting — normal transition of zinc whiskers near the critical temperature Solid State Communications Volume 57, Issue 10, March 1986, pp. 829-833 https://doi.org/10.1016/0038-1098(86)90186-9

Schulz, U., R. Tidecks Hysteresis of the dissipative phase-slip state in superconducting zinc whiskers Solid State Communications Volume 66, Issue 1, April 1988, pp. 59-62 https://doi.org/10.1016/0038-1098(88)90492-9

Slama, G., R. Tidecks The influence of the electron mean free path on phase-slip centers in indium whiskers Solid State Communications Volume 44, Issue 3, October 1982, pp. 425-429 https://doi.org/10.1016/0038-1098(82)90886-9

Bloom, S., T. K. Bergstresser Band structure of a-Sn, InSb and CdTe including spin-orbit effects Solid State Communications Volume 6, Issue 7, July 1968, pp. 465-467 https://doi.org/10.1016/0038-1098(68)90056-2

Cardona, Manuel, x Band structure of gray tin under uniaxial stress Solid State Communications Volume 5, Issue 4, April 1967, pp. 233-235 https://doi.org/10.1016/0038-1098(67)90263-3

Cardona, Manuel, Paul McElroyKerry L. Shaklee Electroreflectance and band structure of gray tin Solid State Communications Volume 4, Issue 7, July 1966, pp. 319-321 https://doi.org/10.1016/0038-1098(66)90178-5

Fukumoto, Hirofumi, Hiroaki MyorenMasaki Ichihara Formation of a-Sn by chemical sputtering of ß-Sn target in hydrogen plasma Solid State Communications Volume 62, Issue 4, April 1987, pp. 309-311 https://doi.org/10.1016/0038-1098(87)90818-0

Gupta, R. P., S. K. SinhaMarvin L. Cohen Dielectric function and phonon spectrum of grey tin Solid State Communications Volume 14, Issue 12, 15 June 1974, pp. 1313-1316 https://doi.org/10.1016/0038-1098(74)90655-3

Higginbotham, C. W., Fred H. PollakManuel Cardona Optical constants of germanium and gray tin the k. p method Solid State Communications Volume 5, Issue 7, July 1967, pp. 513-516 https://doi.org/10.1016/0038-1098(67)90535-2

Jaros, M., x Covalent effects in a-Sn Solid State Communications Volume 7, Issue 7, 1 April 1969, pp. 521-523 https://doi.org/10.1016/0038-1098(69)90866-7

Lannin, Jeffrey S., x Low frequency Raman scattering in amorphous materials: a-Ge, a-InSb, and a-Ge0.5Sn0.5 Solid State Communications Volume 11, Issue 11, December 1972, pp. 1523-1527 https://doi.org/10.1016/0038-1098(72)90513-3

Leung, W., L. Liu Hole structure of gray tin under tensile stress Solid State Communications Volume 16, Issue 3, 1 February 1975, pp. 285-288 https://doi.org/10.1016/0038-1098(75)90169-6

Myhra, S., x Acceptor resonances and electrically active point defects in a-Sn Solid State Communications Volume 36, Issue 9, December 1980, pp. 793-795 https://doi.org/10.1016/0038-1098(80)90014-9

Price, D. L., J. M. Rowe The crystal dynamics of grey (a) tin at 90°K Solid State Communications Volume 7, Issue 19, 1 October 1969, pp. 1433-1438 https://doi.org/10.1016/0038-1098(69)90318-4

Vogl, W., G. Vogl Defect cascades and point defects in low-temperature neutron irradiated a-tin monitored by Mössbauer spectroscopy Solid State Communications Volume 17, Issue 8, 15 October 1975, pp. 1029-1033 https://doi.org/10.1016/0038-1098(75)90247-1

Yu, Chun, Junyan LiuJunmei Chen Ab initio calculation of the properties and pressure induced transition of Sn Solid State Communications Volume 140, Issues 11–12, December 2006, pp. 538-543 https://doi.org/10.1016/j.ssc.2006.09.026

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Solid State Electronics
{ https://www.sciencedirect.com/journal/solid-state-electronics/issues CSULA north TK7800.S65, CSULB orca TK7872.S4S546, OSU depos TK7872.S4S57, UC online, UK online & storage TK7872.S4S546, UL online, UM online, UT online, VU online, }
1 item found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

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(new source 6/25/2020)
Solid State Ionics
{ https://www.sciencedirect.com/journal/solid-state-ionics/issues UK online, }
1 item found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

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Solid State Phenomena
{ https://www.scientific.net/SSP OSU sel QD543.A1D524, UC online, UF sci QD543.S64, UM online, UT hodges QD543 .D49 pt.B, }
>=20 items found as of 10/17/2020 catalog
v17-18,v41,v105,v111,v138 checked 10/17/2020
searched for tin whisker(s) and Sn whisker(s) on 10/11/2020

searched for zinc whisker(s) and Zn whisker(s) on 10/11/2020
searched for indium whisker(s) on 10/11/2020
searched for cadmium whisker(s) and Cd whisker(s) on 10/11/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 10/11/2020 searched for nanowire(s), mesowire(s), microwire(s) on 10/11/2020 Example: https://sci-hub.se/10.4028/www.scientific.net/SSP.282.101 --------------------------------------------------------
Solid State Physics
{ CBU 539.2So44, MST wilson QC173.S477, NWU various, OkSU stillwater 531.7S686, PU eng 539.2So4 & phys 539.2So4 & hicks 530.4105J826, SIUE lovejoy QC173.S477, UAr phys QC1.S797 & QC173.S477, UC phys QC173.S48, UCSD online, UD roesch QC173.S686, UK chem/phys QC173.S477, UL kersey QC1.J622, UM online, UMe mcwherter, USD cl QC173.S477, UT hodges QC173.S477, }
3 items found as of 1/30/2011

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Solid State Technology
{ http://solidstatetechnology.us/index.php/JSST/issue/archive EBSCOA, EBSCOB, Lexmark, MST wilson TK7872.S4S44, OkSU online, OSU online & sel TK7872.S4A1S4, PU phys 537.22Se55, SDSU online, SIUC morris 54108-6213, TTU, UAr online, UCSD online, UD online & roesch, UK online & eng TK7872.S4S45, UL kersey TK7872.S4S44, UM online, USD online, UT online, }
11 items found as of 8/6/2021
v15#1-v27#8,v28#2-v29#11,v33#1,v33#3-v33#8,v48#1-v62#1(19) checked 8/6/2021
searched for tin whisker(s) and Sn whisker(s) on 7/20/2020

searched for zinc whisker(s) and Zn whisker(s) on 9/18/2020
searched for indium whisker(s) on 9/18/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/18/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/18/2020

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South East Asia Technical Training Conference on Electronics Assembly Technologies 2012 Proceedings
{ http://www.smta.org/knowledge/proceedings_list.cfm?event_id=649 }
>=20 items found as of 11/26/2020
11-17 checked 11/26/2020

," SE Asia Technical Conference on Electronics Assembly, Penang, Malasia, Aug. 14-15, 2018, pp. .

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Southcon/87 Conference Record
Conference Record Southcon/95
{ IEEE XPLORE (94-96), UK eng TK5.S67, (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
94-96 checked 8/3/2021

(new reference 12/23/2013)
Welsher 1989

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South East Asia Technical Conference on Electronics Assembly Technologies 2011
>=20 items found as of 7/7/2018
11-17 checked 7/7/2018

(Southeast Asia Technical Conference 2018 May 8-10, 2018 Kuala Lumpur, Malaysia;) --------------------------------------------------------
Thirty-Ninth Southeastern Symposium on System Theory
SSST
{ IEEE XPLORE (88-98,01-), }
1 item found as of 8/3/2021
88-98,01-13 checked 8/3/2021

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Southwest Symposium on Mixed-Signal Design
( IEEE XPLORE (99-01,03), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
99-01,03 checked 8/3/2021

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Soviet Physics - Crystallography
Crystallography Reports
Kristallografiia
Kristallografiya
{ AU rbd QD901.K7135, FSU online & dirac 540.5K92Y & storage 540.5K92Y, GIT online & main QD901.K7 & storage QD901.K7, IU bloomington alf QD901.K92, MST wilson QD901.K7135, OSU online & geo QD901K719 SDSC compact QD901.S6, SIUC storage 54137-5481, SIUE lovejoy, UAr storage QD901.K7135, UC online, UCF online, UCSD s&e QD1.S7321, UK online & storage QD901.K7135, UL online & QD901.K7135, UM online & shapiro QD901.S73 & buhr QD901.S73, UNL ldrf QD901.K1135, UOk bizzell QD901.K7135, USD online, UT hodges QD901.S63, UTo online & carlson, }
4 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/9/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/9/2020
searched for indium whisker(s) on 12/9/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/9/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/9/2020

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Soviet Physics-- Technical Physics
{ USU sel QC1.Z651, UC phys QC1.Z52, UL robotic QC1.S795, UT hodges QC1.S795,  VU sci QC1.S795 & annex QC1.S795, }
2 items found as of 1/30/2011

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Soviet Physics Uspekhi
{ https://iopscience.iop.org/journal/0038-5670 AU online, BYU lee QC1.U812, CSULA north QC1.U812, CSULB online, FIT online, FSU online, GIT 4e QC1.U812, IU online, LH online, MST depos 530.5 So89u, NWU online, OGI online, OkSU main 530.5S7297, OrSU valley QC1.U83, OSU sel QC1.U82, PU online, SDSU QC1.U812, SIUC storage 54143-5301, SIUE lovejoy, SU online, TTU, UAB sterne QC1.U812, UAr online, UC geomathphys QC1.U812, UCF online, UCI sci drum QC1.U812, UCSD s&e QC1.S7328, UDe online, UF online, UIC online, UIUC oak 530.5US2, UK online & sci QC1.U812, UM online, UMe mcwherter, UOk online, USC sel, USF online, UTA physmath QC1U812, UTo online, UTor online, UWa davis QC1.U812, WrSU dunbar QC1.U812, }
3 items found as of 1/21/2021

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Space 2005
item found as of 5/19/2014 catalog

Barnes, Charles E, Sampson, Michael J, LaBel, Kenneth A, The NEPP and NEPAG Programs: Providing Parts Assurance for Space Systems Success Space 2005, Long Beach, CA, USA, 30, Aug.-1 Sept. 2005. 21 pp. 2005

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Space.com
{ http://www.space.com/, }
1 item found as of 1/30/2011

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Space Daily
 { CSULB online, OSU online, UD online, UK online, UM online, USC , VU online, }
1 item found as of 1/21/2021

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Space News
{ MIT online & barker TL.S725, UCB eng TL787.S6724, UM shapiro QB1.S77385, VU sci TL787.S6724, }
item found as of 1/30/2011 catalog

Silverstein, S., "Reasons for Failure Lost With Galaxy 4," Space News, pp.3 and pp.20, Aug. 17-23, 1998.

Silverstein, S., "Reasons for Failure Lost With Galaxy 4," Space News, pp.3 and pp.20, August 17-23, 1998.

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2013 Spanish Conference on Electron Devices
{ IEEE XPLORE (05,07,09,11,13,15,17-8,21-), (many other universities also subscribe to IEEE XPLORE), }
5 items found as of 8/3/2021
05,07,09,11,13,15,17-18,21 checked 8/3/2021

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Special Casting and Nonferrous Alloys
Tezhong Zhuzao Ji Youse Hejin
{ LH closed, }
item found as of 1/30/2011 catalog

(new reference 12/31/2008)
Huang, Huizhen (Nanchang University), Huang, Qisen, Peng, Shu, Zhou, Lang "Effects of Ag addition on properties of Sn-9Zn lead-free solder alloys," Tezhong Zhuzao Ji Youse Hejin/Special Casting and Nonferrous Alloys, vol. 26 no. 3, Mar. 2006, pp. 179-181 Language: Chinese.

Fan, Yanli, Zhang, Keke, Wang, Yaoli, Zhu, Yaomin, Zhang, Xin, Yan, Yanfu .Effects of Ni on the performance of Sn.5Ag.7Cu.1RE solder alloy and its solder joints Tezhong Zhuzao Ji Youse Hejin/Special Casting and Nonferrous Alloys, v 27, n 8, August, 2007, p 651-653 Language: Chinese

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Spectrochimica Acta - Part B Atomic Spectroscopy
{ https://www.sciencedirect.com/journal/spectrochimica-acta-part-b-atomic-spectroscopy/issues AU online, BYU hbll QD95.S633Pt.B, FSU online, GIT online, IU online, LH closed, LU gray, MoSU QD95.A1S62B, MST wilson QD95.A1S62, NWU online, OrSU online, OSU online, RU online, SDSU QD95.A1S623, SIUC online, SIUE lovejoy, UAr mullins chem od QD95.S634, UC online, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UIUC online, UK online & sci QD95.S634, UM online & shapiro QD1.S74 & buhr QD1.S74, UMC online, UMe online & chem, UNF online, UOk online, USF online, USU online, UT online, UTA online, UTo online, WrSU online, }
1 item found as of 1/21/2021
v62#2 checked 1/21/2021

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Spectroscopy
{ AU online, FSU online, GIT online, MST online, NWU online, OGI online, OkSU online, OrSU valley QC451.B2, OSU online, PU chem 543.085805Sp31, SDSU online, SIUC online, SU online, TTU QC451.S63, UAH online, UAr online, UC online, UCI online, UCSD online, UDe online, UF online, UIC online, UK online & sci QC450.S637 & sci QD1.F58no.86, UM online & shapiro QC450.S63, UMC online, UMe mcwherter, UNF online, USD online, USF online, UTA online, UTo online, WrSU online, }
1 item found as of 1/21/2021
v22#7 checked 1/21/2021

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Spectroscopy and Spectral Analysis
Guang, Pu Xue Yu Guang, Pu Fen Xi
{ http://www.oriprobe.com/journals/gpxygpfx.html UTA storage QD95G836, UTo online, }
item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Hua, Li, Wu, Yi-Ping, An, Bing, Lai, Xiao-Wei .Determination of heavy metals for RoHS compliance by ICP-OES spectrometry coupled with microwave extraction system Guang, Pu Xue Yu Guang, Pu Fen Xi/Spectroscopy and Spectral Analysis, v 28, n 11, November, 2008, p 2665-2670 Language: Chinese

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Speeding Edge
{ http://www.speedingedge.com/, }
1 item found as of 1/30/2011

--------------------------------------------------------
(new source 10/17/2020)
SPIN
{ https://www.worldscientific.com/worldscinet/spin UK online, }
1 item found as of 1/21/2021

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Standardization News
ASTM Standardization News
{ https://www.astm.org/standardization-news/?q=static-pages/standardization-news-issue-archive AU rbd 410.M382, CSM online & eng, CSULA north TA368.A517, CSULB orca TA401.A23, FAU wimberly TA401.S7 & TA368.A517, FIU online, FSU dirac 620.5A51263, Lexmark, MST wilson TA368.A517, OkSU online, OSU sel TA368A5, PU eng 620.004Am35 & hicks 620.004Am35, RyU TA404.5.A1S83, SDSU compact TA401.A684, SIUC online, SIUE lovejoy, SMU storage, TTU, UAr online, UC eng TA401.A51, UCI sci TA368A517, UD roesch, UF sci TA368.A517, UH TA401.A43, UK online & eng TA368.A519, UL TA368.A517, UMi richter TA368.A519, UNCC TA368.A517, UPi online, USC grand, UT hodges TA401.A693, UTAr online, UTo carlson, UTor eng TA410.A44, UWa davis TA401.A55x, }
9 items found as of 6/20/2021 catalog
v8#1-jun21 checked 6/20/2021

-------------------------------------------------------
Star-Bulletin
{ UK young microfilm S95-51 & young microfilm S91-354, UM online, }
1 item found as of 2/12/2011

-------------------------------------------------------
Steel Times
{ MST wilson TN1.I7, OkSU stillwater north_boomer 672.05, OSU online & sel TS300.I69, SIUC online, UCSD online, UT online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Steel Times International
{ MST online, OSU online & sel TS300.S845, SDSU online, SIUC online, UCSD online, UOk online, USD online, UT online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Structural Integrity & Reliability in Lead-Free
{ }
7 items found as of 1/30/2011 catalog

--------------------------------------------------------
Studien zur Erhaltung von Musikinstrumenten
{ UTor music ML460.S915, }
item found as of 1/30/2011 catalog

(new reference 2/11/2009)
A. Eckert, in: F. Hellwig, Ed., Studien zur Erhaltung von Musikinstrumenten - Ko"lner Beitra"ge zur Restaurierung und Konservierung von kunst- und kulturgut, Vol. 17, Siegl Verlag, Mu"nchen 2006, pp. 181-292, ISBN 978-3-935643- 33-7.

--------------------------------------------------------
Studies in Conservation
Etudes de conservation
{ https://www.tandfonline.com/loi/ysic20 IU online & bloomington fine N8560.S853, MST online, NWU online & deering 708S933, OkSU online, OSU online & fine N8560A1S75, SDSU online, SIUC online, UAr online, UC online & class AM1.A7, UCSD online, UD online, UE online, UIC online & daley N8560.S82, UK online & fine arts N8560.S82, UL art N8560.S82, UM online & fine arts N1.S92 & buhr N1.S92, UMe online & mcwherter, USD online, UT online, }
3 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 9/8/2020
searched for zinc whisker(s) & Zn whisker(s) on 9/8/2020
searched for indium whisker(s) on 9/8/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/8/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/8/2020

--------------------------------------------------------
Successful Lead-Free/RoHS Strategies Conference
( http://www.smta.org/knowledge/proceedings.cfm }
17 items found as of 11/26/2020
07 checked 11/26/2020

--------------------------------------------------------
Supply Chain Management Review
{ http://www.scmr.com/, CSULA online, CSULB online, OSU online, UD online, UK online, UM online, USC HF5415.7.S933, UT online, VU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Supply Chain Manufacturing & Logistics
Supply Chain Systems Magazine
{ http://66.195.41.11/index.php?option=com_frontpage&Itemid=1, }
1 item found as of 1/30/2011
checked 4/3/2009

--------------------------------------------------------
Supply Chain Systems
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Supply & Demand Chain Executive
{ http://www.sdcexec.com/ MST online, OkSU online, SDSU online, SIUC online, UAr online, UCSD online, UK online, UOk online, USD online, }
6 items found as of 1/21/2021 catalog
-Mar09 checked 1/21/2021

--------------------------------------------------------
Supply Management
{ http://www.supplymanagement.com/ AU online, GIT online, MST online, NWU online, PU online, SDSU online, UAr online, UM online, UMc online, }
1 item found as of 1/30/2011

--------------------------------------------------------
SupplyChainBrain.com
{ http://www.supplychainbrain.com/content/index.php, }
1 item found as of 1/30/2011

--------------------------------------------------------
Surface and Coatings Technology
{ https://www.sciencedirect.com/journal/surface-and-coatings-technology/issues MST online, OkSU online, OSU online, SDSU online, SIUC online, UAr online, UC depos TS670.A1E43, UCSD online, UK online sd (pay), UL online & kersey TS670.A1E43, UOk online, UT online, }
>=20 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

(new reference 12/5/2020)
Mahapatra, S. Das, I. Dutta Co-electrodeposition of tin with 0.2–20% indium: Implications on tin whisker growth Surface and Coatings Technology Volume 337, 15 March 2018, pp. 478-483 https://doi.org/10.1016/j.surfcoat.2018.01.061

(not at UK) Santini, A., N. BazzanellaA. Miotello Growth of Pb-nanowires in one single process by co-sputtering of Al–Pb targets Surface and Coatings Technology Volume 206, Issue 13, 25 February 2012, pp. 3104-3108 https://doi.org/10.1016/j.surfcoat.2011.12.035

(not at UK) --------------------------------------------------------
Surface Coatings International Part B: Coatings Transactions
{ https://link.springer.com/journal/12167/volumes-and-issues AU rbd TP934.O53, LH closed, MST online, MSU online, SIUC morris 58964-5001, UL kersey TP934.O382, }
1 item found as of 11/27/2020
searched for tin whisker(s) and Sn whisker(s) on 11/27/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/27/2020
searched for indium whisker(s) on 11/27/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/27/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/27/2020

--------------------------------------------------------
Surface Engineering
{ https://www.tandfonline.com/loi/ysue20 OSU sel TA418.7.S88, SDSU online, SIUC online, UAr online, UC online, UCSD online, UK online, USD online, UT online, }
3 items found as of 1/21/2021
v24#5 checked 1/21/2021
searched for tin whisker(s) & Sn whisker(s) on 11/30/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/30/2020
searched for indium whisker(s) on 11/30/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/30/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/30/2020

--------------------------------------------------------
2000 Surface Finishes Forum Conference Proceedings
{ http://www.smta.org/knowledge/knowledge.cfm }
5 items found as of 11/26/2020
00 checked 11/26/2020

--------------------------------------------------------
Surface and Interface Analysis
{ https://onlinelibrary.wiley.com/loi/10969918 SMU online, OSU online, UC online, UD online, UK online & remote QC173.4.S94S96, UM online, USC grand, UT online, UTAr online, UTD online, VU online, }
2 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/19/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/19/2020
searched for indium whisker(s) on 12/19/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/19/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/19/2020

--------------------------------------------------------
Surface Mount Technology (SMT)
SMT
SMT Magazine
SMT Supplement
Surface Mount Technology online Article
{ http://www.smtonline.com/pages/smtmagazine.cgi Lexmark, MST online, OSU online, SDSU online, SIUC online, UCSD online, UK online, UOk online, USD online, UT online & hodges TK1.A3I462, UTo online, }
>=20 items found as of 6/20/2021
v5#1-v5#5,v5#8-dec20(20) checked 6/20/2021
searched for tin whisker(s) and Sn whisker(s) on 8/6/2020
searched for zinc whisker(s) and Zn whisker(s) on 8/6/2020
searched for indium whisker(s) on 8/6/2020
searched for cadmium whisker(s) and Cd whisker(s) on 8/6/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/8/2020

--------------------------------------------------------
Surface Science
{ https://www.sciencedirect.com/journal/surface-science/issues AU online, FSU online, GIT online, LH closed, LU gray QD506.S8, MST online, NWU online, OGI sci, OkSU online, OrSU valley QD506.S9, OSU online, PU online, RU online, SDSU online, SIUC online, TTU, UAB sterne QD506.S8, UAr online, UC online, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UIUC online, UK online & remote QD506.S8, UM online & shapiro QC1.S955 & buhr QD1.S95 UNC online, UMe online & mcwherter, UNF online, USF online, UTA online, UTo online, WrSU online, }
3 items found as of 1/21/2021
#652 checked 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

--------------------------------------------------------
Surface World & Product Finishing
item found as of 1/30/2011 catalog

Jordan, Manfred Lead-free tin-alloy plating for mass-production. Surface World. Vol. 11 no. o. 1, pp. 40-42, 44, 46. Jan.-Feb. 2004

MacDermid "Iridite NCP" - a non-chrome aluminium passivate for RoHS, WEEE and ELV compliance. Surface World &, Product Finishing. Vol. 12 no. o. 6, pp. 44, 46, 48. June 2005

--------------------------------------------------------
Sustainable Planning and Development
{ UM aael HD75.6.I5773, }
1 item found as of 1/30/2011

--------------------------------------------------------
Synthetic Metals
{ https://www.sciencedirect.com/journal/synthetic-metals/issues MST online, OkSU online, SDSU online, UCSD online, UK online sd, UM online & shapiro QC1.S9888, UMe online & mcwherter, UOk online, UT online, }
2 items found as of 1/21/2021

--------------------------------------------------------
Symposium on Counterfeit Electronic Parts (East) 2012 Proceedings
{ http://www.smta.org/knowledge/proceedings.cfm, }
items found as of 11/26/2020
11-12 checked 11/26/2020

--------------------------------------------------------
2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
DTIP
{ IEEE XPLORE (03,08-), (many other universities also subscribe to IEEE XPLORE), }
4 items found as of 8/3/2021
03,08-20 checked 8/3/2021

--------------------------------------------------------
Symposium on Electromagnetic Security for Information Protection
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Symposium on the Mechanism of Phase Transformations in Metals
Mechanism of Phase Transformation in Metals
Mechanism of Phase Transformations in Metals
{ UK eng TN600.I570 no.18, }
1 item found as of 1/30/2011

Hardy and Heal, Symposium on the Mechanism of Phase Transformations in Metals, Inst. Metals, 1955, p. 1. *** not applicable ***

--------------------------------------------------------
2002 Symposium on VLSI Circuits Digest of Technical Papers
2010 IEEE Symposium on VLSI Circuits
VLSIC
{ IEEE XPLORE (88-), (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
88-21 checked 8/3/2021

TTTT--------------------------------------------------------
Taipei Times
{ UK online, UM online, VU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Taiwan Economic News
{ OSU online, UK online, UM online, VU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
tdctrade.com
{ http://www.hktdc.com/, }
1 item found as of 1/30/2011

--------------------------------------------------------
TDK Tech Briefs
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Technic Technical Conference
item found as of 1/30/2011 catalog

Schetty, Rob, Tin Whisker Growth &, the Metallurgical Properties of Electrodeposited, Tin. Technic Technical Conference San Jose,CA May 2002 pag. 242.

--------------------------------------------------------
2004 Technical Meeting of the American Chemical Society
1 item found as of 1/30/2011 catalog

Kang, Dong-Hee, Desai, Keyur, Lee, Jingu, Hwang, Sinyoung, Sung, Changmo, Mead, Joey the electrical properties of metallocene epdm for wire and cable applications 2004 Technical Meeting of the American Chemical Society, Rubber Division, Grand Rapids, MI, USA, 17-19 May 2004. 2004

--------------------------------------------------------
Technical Papers of Third Environmental Management and Technology Conference/North America
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Technological Forecasting and Social Change
{ https://www.sciencedirect.com/journal/technological-forecasting-and-social-change/issues IU online, MST online, NWU online & main 658.05T252, OkSU online, OSU online & sel T174A1T42, PU online & manage 658.4005T226 & hicks 658.4005T226, SDSU online, SIUE online, UAr mullins T174.T38, UC online & eng T174.T38, UCSD online, UIC online & daley T174.T38, UK online sd, UL online & ekstrom T174.T38, UM online, UOk online, UT online & hodges T174.T43, }
1 item found as of 1/21/2021

--------------------------------------------------------
Technology Futures Conference
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Technology Review
{ http://www.technologyreview.com/magazine/ AU online, CBU, CSULA online, CSULB online, FSU online, GIT online, Lexmark, LH closed, LU gray T171.M47, MST online, NWU online, OGI online, OkSU online, OrSU valley microfilm T1.T4, OSU online, PU online, RU fondren T171.M47, SDSU online, SIUC online, SIUE lovejoy, SMU online, SU online, TTU, UAB sterne T171.M47, UAH online, UAr online, UC online, UCF online, UCI online, UCSD online, UDe online, UE online, UF online, UIC online, UIUC online, UK online, UMC online, UNF online, USC grand, USD online, USF online, USU auto T171.M37, UTA online, UTAr online, UTD online, UTo online, WrSU online, }
2 items found as of 1/21/2021

--------------------------------------------------------
Technology Today
{ UM buhr T47.D28, USC , }
2 items found as of 1/30/2011

--------------------------------------------------------
TechOnline
{ http://www.techonline.com/ }
4 items found as of 1/30/2011
checked 4/3/2009

--------------------------------------------------------
(new source 7/7/2020)
Tehnicki Vjesnik
{ https://hrcak.srce.hr/tehnicki-vjesnik UK online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Teknisk Ugeblads Afdeling for Kemi og Bergvaesen
{ AU rbd T4.T3, LH closed, RyU online, UM buhr T4.T47, UTor sci T4.T3, }
1 item found as of 1/30/2011

--------------------------------------------------------
2002 Telecom Hardware Solutions Conference Proceedings
{ http://www.smta.org/knowledge/knowledge.cfm, }
2 items found as of 11/26/2020
02 checked 11/26/2020

--------------------------------------------------------
Telecom Products
{ UM online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Telephony
{ CSULA online, CSULB online, OSU thompson microfiche TK1.T27, UC langsam TK1.T36, UK online & young TK1.T36, UL robotic TK1.T36, UM online, USC TK1.T36, UT online, VU online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Television Digest with Consumer Electronics
{ CSULB online, OSU online, UM online, USC grand, VU online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Test & Measurement World
{ IU online, MST online, NWU online, OkSU online, OSU online, PU eng 621.38154805T2869, SDSU online, SIUC online, UAr online, UCSD online, UIC online, UM online, UOk online, USD online, UT online, }
>=20 items found as of 8/2/2021
v31#1-v31#4,v31#6,v32#5-v32#6(ended publication) checked 8/2/2021

*** search for whiskers and tin pest *** --------------------------------------------------------
Test Method Standard Microcircuits
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Test Method Standard Semiconductor Devices
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Thermochimica Acta
{ https://www.sciencedirect.com/journal/thermochimica-acta/issues AU online, BYU online, FIT online, FSU online, GIT online, IU online, LH closed, MST online, NWU online, OkSU online, OrSU valley QD1.T53, OSU online, PU online, RU online, SDSU online, TTU, UC online, UCF online, UCI online, UCSD online, UDe online, UF online, UIC online, UIUC online, UK online (pay) & storage QD510.T5, UL online & robotic QD510.T5, UM online & shapiro QD510.T42, UMC online, UNF online, UOk online, USD online, USF online, USU online, UT online, UTA online, UTo online, WrSU online, }
>=20 items found as of 8/8/2021
v472#1-v702(21) checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 12/5/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/5/2020
searched for indium whisker(s) on 12/5/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/5/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/5/2020

--------------------------------------------------------
Thermodynamics in Physical Metallurgy
{ CMU offsiteTN690.A51T, OSU sel TN690.A6, UC ceas TN690.A57, UK eng TN690.A57, UPi storage TN690.A5119t, USC grand, UT hodges TN690.A57, }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Thermophysical Properties
{ FAU wimberly gov C13.2:T34, FIU green C13.2:T34, UK eng QC175.3.S950, UMi richter mezzanine C13.2:T34, }
item found as of 1/30/2011 catalog

A METHOD OF MEASURING THERMAL CAPACITY OF PARTS TO BE MOUNTED ON A PRINTED WRUNG BOARD AND ITS APPLICATION TO REFLOW SIMULATION Thermophysical Properties, pp. 89-91, 2003

--------------------------------------------------------
Thin Solid Films
{ https://www.sciencedirect.com/journal/thin-solid-films/issues CSULA north TK7871.15.F5T45, CSULB online, MST online, OkSU online, OSU online & sel TA407A1T4, SDSU online, SIUC online, TTU, UAr mullins QC378.T44, UCB online, UCI online & sci QC378.T45, UK online sd (pay) & eng TK7871.15.F5T45, UL online & kersey QC176.A1T47, UM online sd & shapiro QC1.T44, UMe online & mcwherter, UOk online, USC grand, UT online, UTo online & carlson, WSU online & sci, }
>=20 items found as of 8/8/2021
v1#1-v733(21) all issues checked 8/8/2021
searched for tin whisker(s) and Sn whisker(s) on 7/20/2020

searched for zinc whisker(s) and Zn whisker(s) on 9/18/2020
searched for indium whisker(s) on 9/18/2020
searched for cadmium whisker(s) and Cd whisker(s) on 9/18/2020

searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/18/2020

--------------------------------------------------------
TIC Conference
{ }
2 items found as of 1/30/2011

--------------------------------------------------------
Time
{ UD online & roesch microform, UK online & young AP2.T37, UL online, UT online, VU online, }
2 items found as of 1/21/2021

--------------------------------------------------------
Tin and its Uses
{ IU bloomington alf TN793.A1T4, MIT storage TS.T587, MST wilson TN793.A1T4, NWU sci L669.6T5871, OkSU north_boomer 671.05T587, OSU depos TN793.A1T58, PU eng 669.6In8, SIUC storage 54238-6691, TTU TN793.A1T4, UM buhr TP245.T8A1T6, UOk bizzell TN793.A1, UTo carlson, VU sci TN793.A1T4, WSU sci, }
>=20 items found as of 7/9/2012
#1-#165 all issues checked 7/9/2012

--------------------------------------------------------
Tin World
>=20 items found as of 12/19/2013 catalog
1-2,4,7,Apex,11-28,30 checked 12/19/2013

--------------------------------------------------------
TMS Annual Meeting
{ MIT hayden TA401.3.M56, UT hodges various, }
item found as of 1/30/2011 catalog

(new reference 12/1/2010)
Prevention of Sn Whisker Formation by Surface Treatment of Sn Plating (invited), K. Suganuma, K.-S. Kim, Y. Yorikado, M. Tsujimoto, I. Yanada 136th TMS Annual Meeting & Exhibition, Orlando, TX, Feb.26-28 (2007)

Snugovsky, P. et al, "Microstructure, Defects, and Reliability of Mixed Pb-free/SnPb Assemblies" TMS Annual Meeting 2008 New Orleans, LA

Antrekowitsch, H., Potesser, M., Spruzina, W., Prior, F. .Metallurgical recycling of electronic scrap TMS Annual Meeting, v 2006, EPD Congress 2006 - Proceedings of Sessions and Symposia sponsored by the Extraction and Processing Division of The Minerals, Metals and Materials Society held during the 2006 TMS Annual Meeting, 2006, p 899-908

Kuo, Chen-Ming, Hsu, Esher .Waste home appliances recycling in some European and Asian countries TMS Annual Meeting, Recycling and Waste Processing 2007 - Proceedings of Symposium held during the 2007 TMS Annual Meeting, 2007, p 111-120

Powers, Mike, .An investigation of hexavalent-free chromate conversion coatings for test and measurement instrumentation TMS Annual Meeting, v 3, TMS2008 - 137th Annual Meeting and Exhibition Supplemental Proceedings: Materials Processing and Properties, 2008, p 295-300

Hui, Zhao, Nalagatla, Dinesh Reddy, Sekulic, Dusan P. .Wetting kinetics of eutectic lead and lead-free solders: Spreading over Cu surface TMS Annual Meeting, v 1, TMS2008 - 137th Annual Meeting and Exhibition Supplemental Proceedings: Materials Processing and Properties, 2008, p 619-624

Prevention of Sn Whisker Formation by Surface Treatment of Sn Plating Part II Keun-Soo Kim, Suk-Sik Kim, Seong-Jun Kim, Katusaki Suganuma, 2008, TMS Annual Meeting.

Huxiao Xie, Nikhilesh Chawla, Kabir Mirpuri, Aleks Aleksov Mechanisms of Deformation in Cerium (Ce)-Containing Pb-Free Solders Pb-Free Solders and Other Materials for Emerging Interconnect and Packaging Technologies (2011 TMS Annual Meeting & Exhibition)

Whisker Formation Induced by Component and Assembly Ionic Contamination, TMS2011, February 27 -March 3, 2011

Microstructure Formation and Whisker Growth in SAC105 Solder Joints with Rare Earth Elements, TMS2011, February 27 -March 3, 2011

--------------------------------------------------------
TMS Lead Free Workshop
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
TMS Letters
4 items found as of 1/30/2011 catalog
v1#1-v3#2 all issues checked 11/29/2007

--------------------------------------------------------
TMS Light Metals
{ CMU eng TN773.L416, FAU wimberly TN773.L54, LH closed & open, UK eng TN773.L53, USU merrill-cazier TN799.M2M259, }
1 item found as of 8/6/2012 catalog
08 checked 8/6/2012

--------------------------------------------------------
Toxic Link
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Toxics Use Reduction Institute
TURI
{ http://www.turi.org/TURI_Publications }
4 items found as of 7/5/2020
checked 7/5/2020

-------------------------------------------------------
Transactions of the American Institute of Mining and Metallurgical Engineers
{ IU bloomington alf TN1.A5 & indianapolis TN1.A5, MST wilson TN1.A5, MSU eng TN1.A5, NWU sci 622.06A51, OkSU stillwater 622.06A512t, PU hicks 622.06Am3 & 622.06Am3m, SDSU compact TN1.A52, SIUC mclafferty 622.062A512T, UAr storage TN1.A5, UC sw depos TN1.A5, UIC warehouse TN1.A5, UK eng TN1.A5, UMe earth TN1A5, UOk geol TN1.S7, UT hodges TN1.A5, UTo depos, WSU sci, }
1 item found as of 1/30/2011

Johnson and Mehl, Trans. Amer. Inst. Min. Met. Eng., 1939, 135, 416. *** not applicable ***

Bunshah and Mehl, Trans. Amer. Inst. Min. Met, Eng., 1953, 197, 1251. *** not applicable ***

--------------------------------------------------------
Transactions of American Society for Metals
{ CSM lakes, CSULB orca TS300.A76, IU indianapolis, MST wilson 669.105Am3, MSU eng TS200.A76, OkSU stillwater 669.06A512t, OSU sel TS200A75, PU hicks 669.106Am33, SDSU compact TS300.A76, TTU, UC sw depos TS300.A76, UCSD s&e TN1.A5378, UD roesch, UK eng TS300.A76, UL kersey TS300.A76, UM offsite TS300.A565t & buhr TS300.A565t, UMC online, UOk bizzell TS300.A76, USC grand, UTo depos, WSU sci, }
item found as of 1/30/2011

--------------------------------------------------------
Transactions of the ASAE
{ https://elibrary.asabe.org/toc_landing.asp?conf=t1 OSU online, UK online & young S671.A452, UM buhr S671.A497A3, UT hodges S671.A5, }
2 items found as of 1/21/2021

--------------------------------------------------------
Transactions of the China Welding Institution (China)
Hanjie Xuebao
{ https://www.oriprobe.com/journals/hjxb.html LH closed, }
1 item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Interfacial reaction between lead-free solder and Cu pad Hanjie Xuebao/Transactions of the China Welding Institution, vol. 26, pp. 9-12, 2005

(not at UK) Han, Zong-Jie, Xue, Song-Bai, Wang, Jian-Xin, Wang, Shao-Bo .Effects of Sn-Cu-Ni-Ce solder on mechanical properties of micro-joints soldered with diode-laser soldering system Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 1, January, 2007, p 33-36 Language: Chinese

(not at UK) Wang, Jian-Xin, Xue, Song-Bai, Huang, Xiang, Han, Zong-Jie, Yu, Sheng-Lin .Effects of N2 protection on wettability of Sn-Cu-Ni-Ce lead-free solder Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 1, January, 2007, p 49-52 Language: Chinese

(not at UK) Zhang, Xinping, Yu, Chuanbao, Zhang, Yupeng, Zhu, Min .Creep-resistant performance of two lead-free solders and comparison with Sn60Pb40 solder Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 2, February, 2007, p 1-4 Language: Chinese

(not at UK) Wei, Guoqiang, Kuang, Min, Yang, Yongqiang .Interfacial reaction of Sn-9Zn/Cu joint with Cu particle-rein forced composite solder Sn-9Zn Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 5, May, 2007, p 105-108 Language: Chinese

(not at UK) Wang, Hui, Xue, Songbai, Chen, Wenxue, Wang, Jianxin .Effect of Ag, Al, Ga addition on wettability of Sn-9Zn lead-free solder Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 8, August, 2007, p 33-36+44 Language: Chinese

(not at UK) Yan, Yanfu, Ji, Lianqing, Zhang, Keke, Yan, Hongxing, Feng, Lifang .Foundation of steady state creep constitutive equation of SnCu soldered joints Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 9, September, 2007, p 75-79 Language: Chinese

(not at UK) Zhang, Liang, Xue, Songbai, Lu, Fangyan, Han, Zongjie .Finite element analysis on soldered joint reliability of QFP device with different solders Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 10, October, 2007, p 45-48+52 Language: Chinese

(not at UK) Meng, Gongge, Yang, Tuoyu, Chen, Leida .Microstructure and melting property of Sn-.5Ag-.7Cu-XGe solder Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 10, October, 2007, p 65-68 Language: Chinese

(not at UK) Han, Zongjie, Xue, Songbai, Zhang, Xin, Wang, Jianxin, Fei, Xiaojian, Yu, Shenglin .Diode laser soldering for chip resistor component Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 11, November, 2007, p 49-52 Language: Chinese

(not at UK) Shi, Yiping, Xue, Songbai, Wang, Jianxin, Gu, Liyong, Gu, Wenhua .Effects of Ce on spreadability of Sn-Cu-Ni lead-free solder and mechanical properties of soldered joints Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 11, November, 2007, p 73-77 Language: Chinese

(not at UK) Zhang, Xin, Xue, Songbai, Han, Zongjie, Han, Xianpeng .Influence of diode-laser soldering procedure on mechanical properties and microstructure of Sn-Ag-Cu soldered joint Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 2, February, 2008, p 22-26 Language: Chinese

(not at UK) Yu, Chun, Xiao, Junyan, Lu, Hao .Effects of .0% Zn or Ni additions on interfacial reaction and growth of intermetallics in Sn-.5Ag/Cu joint Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 3, March, 2008, p 81-83 Language: Chinese

(not at UK) Xue, Songbai, Wang, Jianxin, Yu, Shenglin, Shi, Yiping, Han, Zongjie .Effects of thermal cycling on mechanical property of chip resistor joints soldered with Sn-Cu-Ni-Ce solder Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 4, April, 2008, p 5-8 Language: Chinese

(not at UK) Chen, Wenxue, Xue, Songbai, Wang, Hui, Han, Zongjie .Effects of Ga on properties of Sn-9Zn lead-free solder Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 4, April, 2008, p 37-40 Language: Chinese

(not at UK) Han, Zongjie, Xue, Songbai, Wang, Jianxin, Yu, Shenglin, Fei, Xiaojian, Zhang, Liang .Thermal cycling of rectangular chip resistor joints soldered with lead-free solder by diode laser Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 5, May, 2008, p 53-56 Language: Chinese

(not at UK) Chen, Leida, Meng, Gongge, Liu, Xiaojing, Li, Zhengping .Influence of Sb on Sn-.7Cu solder's melting point and soldering interface Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 5, May, 2008, p 105-108 Language: Chinese

(not at UK) Wang, Lifeng, Sun, Fenglian, Liu, Xiaojing, Liang, Ying .Design of Sn-Ag-Cu-Bi solder alloy and analysis on microstructure and properties Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 7, July, 2008, p 9-12 Language: Chinese

(not at UK) Meng, Gongge, Yang, Tuoyu, Chen, Leida, Wang, Shizhen, Li, Caifu .Effect of Ge on the SnAgCu/Cu soldering interface Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 7, July, 2008, p 51-53+56 Language: Chinese

(not at UK) Chen, Wenxue, Xue, Songbai, Wang, Hui, Hu, Yuhua .Wettability of lead-free solders of Sn-Zn-xAl Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 8, August, 2008, p 37-40+44 Language: Chinese

(not at UK) Fang, Yili, Zhou, Jian, Xue, Feng, Sun, Yangshan .High-temperature oxidation behavior of Sn-8Zn-3Bi-P and its effect on properties Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 8, August, 2008, p 89-92+96 Language: Chinese

(not at UK) Zhang, Liang, Xue, Songbai, Han, Zongjie, Yu, Shenglin, Sheng, Zhong .Investigation of mechanical property and fracture morphology of lead-free soldered joints of fine pitch devices Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 9, September, 2008, p 35-38 Language: Chinese

(not at UK) Meng, Gongge, Li, Caifu, Yang, Tuoyu, Chen, Leida .Effect of germanium on shearing strength and fracture surface of SnAgCu/Cu soldering joint Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 9, September, 2008, p 59-62 Language: Chinese

(not at UK) Sun, Fenglian, Hu, Wengang, Wang, Lifeng, Ma, Xin .Influence of Bi on the melting point and wettability of Sn-.3Ag-.7Cu lead-free solder Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 10, October, 2008, p 5-8 Language: Chinese

(not at UK) Zhang, Liang, Xue, Songbai, Zeng, Guang, Han, Zongjie, Yu, Shenglin .Study on mechanical properties and numerical simulation of fine pitch devices soldered joints Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 10, October, 2008, p 89-92 Language: Chinese

(not at UK) --------------------------------------------------------
Transactions of the Faraday Society
{ https://pubs.rsc.org/en/journals/journalissues/tf#!issueid=tf1971_67_0&type=archive&issnprint=0014-7672 CBU, IU online & bloomington alf TK1.F2, MST online, NWU online & sci 540.6F219, OSU sel QD71F21 & depos QD71.F21, PU online & chem 541.3F22 & hicks 541.3F22, SIUC online, SIUE storage, TTU QD450.F21, UAr online, UC chem (Oesper Rm) TK1.F25, UCSD online, UE, UIC warehouse QD1.C585, UK online & chem/phys QD450.F21, UL kersey QD1.C6152, UM shapiro QD1.C5239, UOk online, UT hodges closed TK1.F25, }
2 items found as of 1/21/2021
searched for tin whisker(s) & Sn whisker(s) on 9/2/2020
searched for zinc whisker(s) & Zn whisker(s) on 9/2/2020
searched for indium whisker(s) on 9/2/2020
searched for cadmium whisker(s) & Cd whisker(s) on 9/2/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 9/2/2020

--------------------------------------------------------
Transactions of the Institute of Metal Finishing
Transactions of the IMF
{ https://www.tandfonline.com/loi/ytim20 CMU eng, LH closed, MST wilson TS653.I55, OrSU valley TS200.I47, SIUC morris 52856-6711, UM online & buhr TS670.A1I57, UOk online, UPi online, USC TS200.I475A2, UTor online, UWa annex TS200.I475A2, WSU storage, }
>=20 items found as of 8/9/2021
v3-v99#4(21) checked 8/9/2021
searched for tin whisker(s) & Sn whisker(s) on 11/30/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/30/2020
searched for indium whisker(s) on 11/30/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/30/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/30/2020

--------------------------------------------------------
Transactions of the Institute of Mining & Metallurgy
{ OkSU online, UK eng TN1.I6, OSU sel TJ4.O86, }
item found as of 1/30/2011

--------------------------------------------------------
Transactions of the Institution of Mining & Metallurgy, Section C
{ CSULB online, OSU sel TN1.I565, UK remote TN1.I6, UM online, }
2 items found as of 1/30/2011

--------------------------------------------------------
Transactions of the IRE Professional Group on Component Parts
{ IEEE XPLORE (v1#1-v4#1), (many other universities also subscribe to IEEE XPLORE), }
4 items found as of 8/2/2021
v1#1-v4#1(54, ended publication) all issues checked 8/2/2021

--------------------------------------------------------
Transactions of the Japan Society of Mechanical Engineers
Nihon Kikai Gakkai Ronbunshu, A Hen
Nippon Kikai Gakkai Ronbunshu, A Hen
{ https://www.jstage.jst.go.jp/browse/kikaic/list/-char/en CSULB online, FIU online, LH closed, MIT barker TA.N6912 & storage TA.N6912, NWU sci 621.06S678tserA, PU eng 621.06, RyU online, UT hodges TJ4.J3, }
3 items found as of 8/17/2011

--------------------------------------------------------
Transactions of the Japanese Institute of Metals
{CMU eng, }
item found as of 1/30/2011 catalog

Handwerker, C. A. (METALLURGY DIVISION - 855) Research Trends in Lead-Free Soldering in the U.S.: NCMS Lead-Free Solder Project and the NEMI Lead-Free Solder Project Transactions of the Japanese Institute of Metals - Dec. 1, 1999

--------------------------------------------------------
Transactions of the Metallurgical Society of AIME
Transactions of the American Institute of Mining Engineers
{ BYU lee TN23.A5154x, IU bloomington geo TN1.A5 & geo TN600.M375 & alf TN1.A5, MST depos 622.06Am3, MSU eng TN1.A5 & eng TN600.M37, NWU sci 622.06A51 & sci 622.06A51me, OkSU stillwater 669.06M587t, OSU various, PU hicks 669.005M5641 & hicks 669.05J82 & hicks 622.06Am31m & hicks 669.106Am33, SDSU compact TN1.A51, SIUC morris 51829-6691, UAr mullins TN1.M4, UC sw depos TN1.A5, UIC warehouse TN600.M375, UK eng TN1.A5 & eng TS300.A76, UOk bizzell 669.05 M5652t, UT hodges TN1.A5, UTo depos, WSU sci, }
2 items found as of 1/30/2011

--------------------------------------------------------
Transactions of the Newcomen Society
Transactions - Newcomen Society for the Study of the History of Engineering and Technology
{ https://www.tandfonline.com/loi/yhet20 OkSU stillwater 620.9N541t, SIUC online, UMe mcwherter T1N47, UOk online, UTo carlson, UU marriott T1.N47, }
1 item found as of 11/30/2020
searched for tin whisker(s) & Sn whisker(s) on 11/30/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/30/2020
searched for indium whisker(s) on 11/30/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/30/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/30/2020

--------------------------------------------------------
Transactions of Nonferrous Metals Society of China
{ https://caod.oriprobe.com/journals/zgysjsxb-e/Transactions_of_Nonferrous_Metals_Society_of_China.htm FAU online, LH closed, OkSU main 669.05T772, RU fondren TN758.T72, RyU online, SMU online, UMi online, UNCC online, UPi hillman, UTor online, VU online, }
18 items found as of 10/21/2011 catalog
v16#s1-v16#s2,v16#1-v21#8 checked 10/21/2011

-------------------------------------------------------
TUV Rheinland World News
9 items found as of 1/30/2011 catalog
Jan2001-Oct2006 checked 4/3/2009

-------------------------------------------------------
TWI LiveWire
{ }
3 items found as of 1/30/2011 catalog

--------------------------------------------------------
TWICE; This Week in Consumer Electronics { http://www.twice.com/archive/ OSU online, UD online, UK online, UM online, UT online, VU online, }
1 item found as of 1/21/2021

UUUU--------------------------------------------------------
U. S. Tech
{ http://www.us-tech.com/ }
3 items found as of 1/30/2011
-Mar09,Oct10 checked 11/8/2010

--------------------------------------------------------
Ukrainskij Fizychnyl Zhurnal
{ KSU hale QC1.U35, }
item found as of 1/30/2011 catalog

A. I. Bichovs'kij, UKrainskij Fiz. Zh., 7 (1963) 609.

--------------------------------------------------------
2013 UKSim 15th International Conference on Computer Modelling and Simulation
2014 European Modelling Symposium
UKSIM
{ IEEE XPLORE (08-), (many other universities also subscribe to IEEE XPLORE), }
3 items found as of 8/3/2021
08-17 checked 8/3/2021

--------------------------------------------------------
Ultrasonics Sonochemistry
{ https://www.sciencedirect.com/journal/ultrasonics-sonochemistry/issues MST online, NWU sci L534.05U471, OkSU online, OSU online & sel QD801.U48, PU online & eng 541.305UL85, SDSU online, SIUC online, UC online, UCSD online, UD online & roesch, UI online, UIC online, UK online sd & eng QD801.U48, UL online & kersey QD801.U48, UM online, UOk online, UT online, }
1 item found as of 1/21/2021

--------------------------------------------------------
Understanding ESD in Magnetic Recording
{ }

(new reference 12/23/2013)
Wallash May 22, 1997 p. 101

Cheung May 22, 1997

Kimball p. 89-100

--------------------------------------------------------
Unisys World
{ UM online, VU online, }
1 item found as of 1/30/2011

*** search for whiskers and tin pest *** --------------------------------------------------------
UNOVIS Consortium Meeting
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
UPB Scientific Bulletin, Series B: Chemistry and Materials Science
{ https://www.scientificbulletin.upb.ro/Engleza/archives_engl.html }
item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Mandea, Florentina, Jitaru, Ioana .Chromate-free pretreatment for metallic Surface UPB Scientific Bulletin, Series B: Chemistry and Materials Science, v 69, n 3, 2007, p 3-8

--------------------------------------------------------
Update Intertek
1 item found as of 1/30/2011
08-1 checked 4/6/2009

--------------------------------------------------------
USA Today
{ OSU online, UD online, UK online, UL ekstrom L11.S36, UM online, UT online, VU online, }
1 item found as of 1/21/2021

VVVV--------------------------------------------------------
VDI Berichte
{ AU rbd TA3.V15, LH closed, NWU sci L620.6V4892, PU hicks 620.5Z3a, SMU storage, TTU, UAB sterne TA3.V15, UAr mullins TA3.V15, UCI various, UCSD srlf TA1.V489, UM online & buhr TA3.V39, UTor eng TA3.V516, }
item found as of 1/30/2011 catalog

(new reference 12/31/2008)
Ehrhardt, H., Becker, R., Rup, Th., Wolff, J. .Die Bedeutung der Applikation fur die Zuverlassigkeit von Bleifreien Steuergeraten (Mission profile and reliability of lead free control units) VDI Berichte, n 2000, 2007, p 549-561 Language: German

(not at UK) --------------------------------------------------------
Vestnik metallopromyshlennosti
{ LH closed, OSU depos HD9506.S652V47, UM buhr TJ4.V58, }
item found as of 1/30/2011 catalog

P. P. Belyaev and S. P. Markova, Vestnik Metalloprom. 17, 111 (1937).

--------------------------------------------------------
Vision Systems Design
{ http://www.vision-systems.com/ UK online, }
2 items found as of 6/20/2021
v19#1-v26#3(21) checked 6/20/2021

--------------------------------------------------------
(new source 10/1/2020)
VMEbus Systems
{ }
1 item found as of 10/1/2020

WWWW--------------------------------------------------------
Wafer & Device Packaging and Interconnect
{ Http://www.waferpackaging.com/ }
4 items found as of 1/30/2011 catalog
v1#1-v1#7 all issues checked 11/8/2010

--------------------------------------------------------
Waste Management
{ https://www.sciencedirect.com/journal/waste-management/issues AU online, FAU online, FIU online, FSU online, LH closed, LU gray TD811.5.N82, MST online, OGI online, OkSU online, OSU online, PU eng 658.56705N882, RyU online, SDSU online, SIUC online, UCF online, UCI online, UD online, UF online, UIC online, UIUC online, UMC online, UMe online, UMi online, UNF online, USD online, USF online, USU online, UTA online, UTor online, UWa online, }
>=20 items found as of 8/8/2021
v26#1-v131(21) checked 8/8/2021

--------------------------------------------------------
Waste Management and Research
{ https://www.sciencedirect.com/journal/waste-management-and-research/issues FAU online, FIU online, MST online, NWU online, OkSU online, OSU online, PU online & eng 628.405W288, SDSU online, SIUC online, UAr mullins TD896.W35, UC online & eng TP995.A1W39, UCSD online, UD online, UK online sage, UM online, UMi online, UOk online, USD online, UT online, }
>=20 items found as of 8/8/2021
v1#1-v38#12(20) all issues checked 8/8/2021

--------------------------------------------------------
Waste News
{ MST online, SDSU online, SIUC online, UAr online, UCSD online, UOk online, USD online, }
15 items found as of 1/30/2011
checked 4/3/2009

--------------------------------------------------------
Wear
{ https://www.sciencedirect.com/journal/wear/issues CSULB online, OSU sel TA401.W36, UC online, UD online, UK online, UM online, USC TA401.W4, VU sci TA401.W4 & annex TA401.W4, }
1 item found as of 1/21/2021

--------------------------------------------------------
Welding, Bonding, and Fastening 1984
{ OSU sel TL521.3.N28, UC online, UK storage microfiche NAS1.55:2387, UL ekstrom gov microform NAS1.55:2387, UT hodges microfiche NAS1.55:2387, }
1 item found as of 1/30/2011

--------------------------------------------------------
Welding Design & Fabrication
{ http://weldingdesign.com/ EBSCOB, AU online, BYU hbll TS227.A168, FIT online, IU online, LH closed, LU gray microfilm TS227.A168, MST online, NWU online, OGI online, OkSU online, OrSU valley TS227.A15I6, OSU online, PU eng 669.173In25 & hicks 669.173In25, RU Fondren TS227.A16, SDSU online, SIUC online, SU online, TTU, UAr mullins TS227.A168, UC eng TS227.A168, UAH online, UCI online, UDe online, UF online, UIC daley TS227.A168, UIUC online, UK online & remote TS227.A168, UM online, UMC online, UOk online, USD online, USU online, UT online, UTA online, UTo online, WrSU online, }
4 items found as of 8/6/2021
v78#1-v82#9(09) checked 8/6/2021

--------------------------------------------------------
Welding in the World
{ https://link.springer.com/journal/40194/volumes-and-issues AU rbd TS227.A28, LH closed, OkSU stillwater 671.5205W445, OSU online, UC online, UT hodges TS227.A183, UTo online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Welding International
{ https://www.tandfonline.com/loi/twld20 AU rbd TS227.A2852, FAU online, FSU online, LH closed, OkSU online, OSU online, RyU online, UC sw depos chem TK4660.A1A42127, UDe online, UIUC eng Q.671.5205, UNF online, USF online, USU online, UTo online, UTor online, UWa online, }
1 item found as of 11/27/2020
searched for tin whisker(s) and Sn whisker(s) on 11/27/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/27/2020
searched for indium whisker(s) on 11/27/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/27/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/27/2020

--------------------------------------------------------
Welding Journal
{ AU rbd TS227.A15, MST wilson TS227.A15, OkSU stillwater 671.05W4455, OSU sel TS227A5, RU fondren TS227.A15, SDSU TS227.A15, SIUC online, SIUE lovejoy, TTU online, UAr mullins TS227.A15, UC eng TS227.A15, UCSD online, UK online, UL kersey TS227.A15, UOk bizzell TS227.A15 & eng TS227.A15, UT hodges TS227.A15, UTA eng 671.06.AM35, VU sci TS227.A15, }
4 items found as of 1/21/2021
v80#10,v85#3,v86#3,v86#9 checked 1/21/2021

--------------------------------------------------------
WESCON/80 Conference Record
{ IEEE XPLORE (57-60,93-98), CSULA palmer oversize TK7801.W48a, CSULB orca TK7800.W4, GIT oline, OSU depos TK7800.W42, UC ceas microforms 6496CM3592-7, UCF main TK7800.W111, UD roesch TK7800.W4, UF sci TK7801.W471, UK eng TK7800.W111, UM online, UT hodges TK7800.W4, (many other universities also subscribe to IEEE XPLORE), }
1 item found as of 8/3/2021
57-60,65,67,93-98 checked 8/3/2021

--------------------------------------------------------
Wire & Cable Technology International
4 items found as of 1/30/2011

--------------------------------------------------------
Wire Journal
{ LH closed, MST depos 671.84W743j, MSU eng TS270.A1 W57, OkSU stillwater 671.8405W7981, PU hicks 671.8405W744 & eng 671.8405W744, SIUC storage 51095-6711, UM buhr TS270.A1W82, }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
Wire Journal International
{ http://www.wirenet.org/wji/WJIAI.htm NWU online, OkSU stillwater 671.8405W7982, PU eng 671.8405W744 & hicks 671.8405W744, SIUC online, UCI online, UCSD online, UIC warehouse TS270.A1W57, UM online, WSU online, }
>=20 items found as of 8/4/2018 catalog
v30#1-v45#1 checked 8/4/2018

--------------------------------------------------------
Wireless Design
{ }
1 item found as of 1/30/2011

--------------------------------------------------------
Wireless Design & Development
{ http://www.wirelessdesignmag.com/Default.aspx?CommonCount=0 FIU online, MST online, OkSU online, SDSU online, SIUC online, UAr online, UCSD online, UK online, UMi online, UOk online, USD online, }
6 items found as of 6/20/2021
dec08,may09-dec18 checked 6/20/2021

--------------------------------------------------------
Wireless Systems Design
{ http://wirelessdevnet.tradepub.com/free/wsd/ OSU online, UD online, UK online, UM online, UT online, VU online, }
2 items found as of 1/21/2021

--------------------------------------------------------
Wireless Week
{ http://www.wirelessweek.com/ OSU online, UD online, UK online, UM online, UT online, VU online, }
3 items found as of 1/21/2021

--------------------------------------------------------
Wiring Harness News
{ }
3 items found as of 10/26/2015 catalog
sep-oct15

--------------------------------------------------------
Works Management
{ MST online, IU online, NWU online, OkSU online, OSU online, SDSU online, SIUC online, UAr online, UCSD online, UK online, UM online, USD online, UT online, }
1 item found as of 1/21/2021

--------------------------------------------------------
15th Workshop on Crystalline Silicon Solar Cells and Modules: Materials and Processes
{ CSULB online, }
1 item found as of 1/30/2011

--------------------------------------------------------
Workshop on Devices, Interconnects, and Packaging for Next Generation Computing and Communication Applications
{ http://www.cpmt.org/mem/, }
1 item found as of 1/30/2011 catalog
03 checked 8/24/2010

--------------------------------------------------------
World Electronics Forum
{ }
1 item found as of 1/30/2011 catalog

--------------------------------------------------------
World of Metallurgy
Erzmetall
{ https://www.gdmb.de/en/gdmb-verlag-gmbh/publishing-programme/world-of-metallurgy/ LH closed, MST wilson TN3.Z42, PU eng 669.05Z28 & hicks 669.05Z28, }
1 item found as of 1/30/2011 catalog

(new reference 12/30/2008)
Vanbellen, Francis, Chintinne, Mathias ."Extreme makeover": UPMR's Hoboken plant World of Metallurgy - ERZMETALL, v 61, n 1, January/February, 2008, p 14-19

(not at UK) -------------------------------------------------------
www.cleanrooms.com
{ http://www.electroiq.com/index/Semiconductors/facilities.html, }
1 item found as of 1/30/2011

XXXX--------------------------------------------------------
X-Ray Spectrometry
{ https://onlinelibrary.wiley.com/loi/10974539 IU online, LH closed, MST online, MSU online, NWU online & sci L537.5352X13, OkSU online, OSU online, SDSU online, SIUC storage 54355-5351, UAr online, UC online & geo QC481.X16, UCSD online, UD online, UIC online, UK online & geol QC481.X16, UM online & shapiro QC481.X161, USD online, UT online & hodges QC173.X75, UTo online & carlson, WSU online & sci, }
3 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 12/19/2020
searched for zinc whisker(s) and Zn whisker(s) on 12/19/2020
searched for indium whisker(s) on 12/19/2020
searched for cadmium whisker(s) and Cd whisker(s) on 12/19/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, grey tin, gray Sn, grey Sn, alpha tin, alpha Sn, tin allotropy, and tin allotropic on 12/19/2020

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Xcell Journal
{ https://www.xilinx.com/about/xcell-publications/xcell-journal.html, }
1 item found as of 3/1/2021
#1-#94(16) checked 3/1/2021

YYYY--------------------------------------------------------
Yazawa International Symposium: Metallurgical and Materials Processing: Principles and Techologies
{ MST wilson TN605.Y39, UM offsite TN605.T39, }
5 items found as of 6/11/2015 catalog
03 checked 6/11/2015

ZZZZ--------------------------------------------------------
ZDNet News
ZDNet News from ZDWire
ZDNet UK
{ CSULB online, VU online, }
2 items found as of 1/30/2011

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Zeitschrift fur Anorganische Chemie
{ https://onlinelibrary.wiley.com/loi/15213749 OSU sel QD1.Z473, UK online & remote QD1.Z4, UL robotic QD1.Z4, UM online, UT storage QD1.Z4, }
2 items found as of 1/21/2021

--------------------------------------------------------
Zeitschrift fur anorganische und allgemeine Chemie
{ https://onlinelibrary.wiley.com/loi/15213749 IU online & bloomington chem QD1.Z37 & alf QD1.Z37, MST online, MSU online & sci QD1.Z4, NWU online & sci 546.05Z48, OSU online & sel QD1Z473 & depos QD1Z473, SDSU online, SIUC storage 54363-5402, SIUE lovejoy, TTU, UAr online, UC online & chem (Oesper Rm) QD1.Z4, UCSD online, UD online, UIC online & sci QD1.Z4, UK online & chem/phys QD1.Z4, UL online & kersey QD1.Z4, UM online & shapiro QD1.Z5, UOk online, USD online, UT online & hodges & closed QD1.Z4, }
2 items found as of 1/21/2021

--------------------------------------------------------
Zeitschrift fur Elektrochemie
{ https://onlinelibrary.wiley.com/loi/00059021b?activeYear=1929 CMU mellon TP250.Z6, IU bloomington alf QD1.Z48, MST depos 541.175Z3, MSU remote TP250.D4, NWU sci 660.5Z48, OkSU stillwater 660.5Z48, OSU sel TP250Z48, PU hicks 540.5Z3, SDSU compact TP250.Z6, SIUC storage 51544-6212, SMU storage, UC chem (Oesper Rm) TP250.Z6, UCSD online, UD roesch, UIC warehouse TP250.Z6, UK chem/phys TP250.Z6, UL kersey TP250.Z6, UM shapiro QD1.Z52 & buhr QD1.Z52, UOk storage TP250.Z6, USC grand, UT hodges closed TP250.Z6, WSU sci, }
6 items found as of 11/7/2020 catalog

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Zeitschrift fur Elektrochemie Berichte der Bunsengesellschaft fur Physikalische Chemie
{ }
1 item found as of 1/30/2011

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(new source 7/1/2020)
Zeitschrift fur Kristallographie - Crystalline Materials
{ https://www.degruyter.com/view/journals/zkri/zkri-overview.xml?tab_body=toc-78025 UK online, }
1 item found as of 1/21/2021

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(new source 6/28/2020)
Zeitschrift fur Metallkunde
International Journal of Materials Research
{ https://www.hanser-elibrary.com/loi/ijmr }
2 items found as of 11/2/2020

(new reference 6/28/2020)
[fiedler 2] A. Politycki and H.-P. Kehrer, Z. Metallk. 59,309 (1968). - Lorenz, M., Z. Metallk., vol. 59 pp. 419, 1968.

[fiedler 3] A. Politycki and H.-P. Kehrer, Z. Metallk. 60,17 (1969). --------------------------------------------------------
Zeitschrift fur Physik
{ IU bloomington swain QC1.Z4 & alf QC1.Z4, MST online, NWU sci 530.5Z484, OkSU main 530.5P57832, OSU sel QC1Z48, PU phys 530.5Z373b, SDSU compact QC1.Z37, SIUC morris 54376-5392, SIUE lovejoy, TTU, UAr storage QC1.Z45, UC phys QC1.Z4, UCSD online, UD online, UIC sci QC1.Z48, UK chem/phys QC1.Z48 & king QC793.Z450, UL kersey QC1.Z412 & QC1.Z4, UM online & shapiro QC1.Z48 & buhr QC1,Z48, UOk online, UT hodges & closed QC1.Z44, UTor sci QC1.Z4502, UWa online, }
1 item found as of 1/30/2011
v37#2 checked 10/3/2009

(new reference 6/28/2020)
Polanyi, M., and Schmid, E., Z. Phys., vol. 32 pp. 684, 1925.

Obinata, I., and Schmid, E., Z. Phys., vol. 82 pp. 224, 1933.

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Zeitschrift fur Physik B Condensed Matter
{ https://link.springer.com/journal/257/volumes-and-issues OSU depos QC176.A1Z452, UC online, UD online. UK online & storage QC176.A1Z48, UL robotic QC176.A1P55, UM online, UT online, VU online, }
7 items found as of 1/21/2021
searched for tin whisker(s) and Sn whisker(s) on 11/27/2020
searched for zinc whisker(s) & Zn whisker(s) on 11/27/2020
searched for indium whisker(s) on 11/27/2020
searched for cadmium whisker(s) & Cd whisker(s) on 11/27/2020
searched for tin pest, tin plague, tin leprosy, tin disease, tin blight, gray tin, gray Sn, grey tin, grey Sn, alpha tin, alpha Sn, tin allotropic, tin allotropy on 11/27/2020

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Zeitschrift fur Physikalische Chemie
{ https://www.degruyter.com/view/journals/zpch/zpch-overview.xml?language=en&tab_body=toc-78025 CMU online & mellon QD1.Z42 & offsite QD1.Z42, IU bloomington chem QD1.Z46 & alf QD1.Z46, MST wilson QD1.Z46, MSU sci QD1.Z45, NWU online & sci 541.05Z481, OkSU stillwater 540.5Z485, SDSU QD1.Z45 & QD1.Z455, SIUC morris 54379-5401, SIUE lovejoy, TTU, UAr storage QD1.Z45, UC chem (Oesper Rm) QD1.Z46 & QD1.Z45, UCSD s&e QD1.Z491, UD roesch remote, UK online (pay) & chem/phys QD1.Z46 & king QD1.Z46 & young S 92-85, UL kersey QD1.Z46 & microforms, UM shapiro QD1.Z56, UOk chem-math QD1.Z46, UPi storage, UT hodges & storage QD1.Z45, UTo bowman-oddy, WSU sci, }
>=20 items found as of 1/21/2021 catalog

(new reference 1/18/2015)
A. J. Melmed J Phys Chem 1962? vol. 34, 1802

(not at UK) Haubelt, R., Mennicke, S., and Dittmar, W., "Bestimmung der spezifischen freien Oberflachenenergie des festen Kaliums," Zeitschrift fur Physikalische Chemie, vol. 95 no. 4-6, pp. 187-196, 1975.

(not at UK online) Kloppel, A., and Dittmar, W., "uber den Mechanismus des Wachstumsstopps von Kaliumwhiskern," Zeitschrift fur Physikalische Chemie, vol. 95 no. 4-6, pp. 209-214, 1975.

(not at UK online) Grunze, M., Hirschwald, W., and Thull, E., "Der Einfluss einer intensiven Sauerstoffbehandlung auf die thermische, chemische und photochemische Stabilitat von Zinkoxid," Zeitschrift fur Physikalische Chemie, vol. 100 no. 3-6, pp. 201-216, 1976.

(not at UK online) Khrussanova, M., Terzieva, M., Peshev, P., Konstanchuk, I., and Ivanov, E., "Hydriding Kinetics of Mixtures Containing Some 3d-Transition Metal Oxides and Magnesium," Zeitschrift fur Physikalische Chemie, vol. 164 part 2, pp. 1261-1266, 1989.

(not at UK online) Bernauer, O., "Metal Hydride Storages," Zeitschrift fur Physikalische Chemie, vol. 164 part 2, pp. 1381-1390, 1989.

(not at UK online) --------------------------------------------------------
ZVO Report
{ }
1 item found as of 1/30/2011

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Peng, W, Zeng, K, Kivilahti, J, Performer: Literature Review on Potential Lead-Free Solder Systems Helsinki University of Technology, Espoo (Finland). Dept. of Electrical and Communications Engineering. 2000. 68p. Report: ISBN-951-22-4979-0, HUT-EPT-1

https://ethesis.helsinki.fi/en/ ---------------------------------------------------------------------------- Zhang, Y Tin Whiskers: Modeling Whisker Programme at ITRI Aug. 17, 2001, Letter to D. Dittes @ ITRI found on NEMI Web

Zhang, Y Tin Whiskers: Modeling Meeting Minutes Sept. 12, 2001 Zhang, Y, Vo no., Lal, S, Oberle, B. Tin Whiskers: Modeling Meeting Minutes Sept. 19, 2001, Aug. 17, 2001, Letter to D. Dittes @ ITRI found on NEMI Web page:

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Olsen, D. Lead-Free Coating Technology: Review of Tin Whiskers and Recommendations Consultant report contracted by ON Semiconductor, Dec. 31, 2000

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Carsem (Malaysia) Elimination of Lead (Pb) on External Lead Finishing for Electronic Components Presentation c.a 2001

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Strube, Gernot, X-Ray Diffraction and whisker growth. Is there any correlation? SCHLOTTER Internal Conference on Lead Free Electronics. Soldertec. IPC. Junio 2003 pag 158.

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Thermo mechanical fatigue of solder joint: A new comprehensive test method.

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Toben, Michael, Egli, Andre, Jochen Heber, Anja Vinckier, Felix Schwager Tin Whiskers In Electrodeposits: An Overview of the Mechanisms, Shipley Company, LLC, Freeport no. Y Shipley Schweiz AG, Lucerne .

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Seeling, Karl, and David, Suraski. Lead-Free Technology: A New Material Challenge,

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http://www.sae.org/technical/standards/AIR5444 SAE International, "Investigation of Whisker Formation on Tin Plated Conductors", SAE Standard AIR5444, Dec. 1998.

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Schetty, Rob, Egli, Andre, Jochen Heber, Anja Vinckier, Lead-Free Finishes Whisker Studies and Practical Methods for Minimizing the Risk of Whisker Growth, Shipley report.

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Product/Process Problem Alert Bulletin 9202, The Aerospace Corporation, May 14, 1992.

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Moore, D. E., "Tin Whisker Problem on Military Specifications Items," Oct. 1, 1992. 14. H.S.

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Lin, C. M, "Tin Whisker Growth on IC Lead Finish-A Review," AT&T Bell Laboratories Technical Memorandum: TM52221-840709-01, July 9, 1984.

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Lead-Free Soldering for Surface Mount Technology Applications

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Inter-Office Memo, "Elimination of Tin Whisker Growth of Tin Plated Chip Capacitors", Murata Erie North America Inc. (internal report), Apr. 1987.

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Helber, D., "Tin Whisker Formation", A Presentation at Aerospace Corporation no. ov. 19, 1992.

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Gauldin, R., "Tin whiskers on Hybrid Power Converter Lids," JPL Failure Analysis Laboratory (SEM log 7370), July 22, 1998.

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Brooks, P. J., "JC-13.2 New Business item: Addition of Matte Tin Final Lead or Terminal Finish to MIL-PRF-38535", Addendum to JC-13.2 Agenda at January 2001 Meeting, San Antonio, Texas, Jan. 11, 2001.

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Conwell, D., "Zinc Whisker Shorting in Vacuum", LMAO Astronautics Mission Success, July 20, 2001.

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Backes, P. G, "Selected Programs Shorting Failure Investigation Final Report (FASS 1298)," Hughes Technical Internal Correspondence, Oct. 16, 1991.

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Morose, Greg, Harriman, Liz, et al, greg@turi.org. New England Lead Free Electronics Consortium--Phase III Efforts" --------------------------------------------------------
"How to Avoid Metallic Growth Problems on Electronic Hardware," IPC Tech Report IPC-TR-476, 1977.

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"Slide Presentation: Tin Whiskers: Re-emergence of an Old Problem with Potentially Catastrophic Consequences," Oct. 6, 1998.

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"Tin Whisker Technical Assessment," Aerospace/AF SSD.

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"Tin Whiskers Formation in Electronic Components," Lessons Learned Notice by Lockheed Martin Astronautics (internal report) no. otice # LLN-98-06, pp. 1-4, July 1998.

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Understanding Stencil Printing Requirements for a Lead-free Mass Imaging Process --------------------------------------------------------
Boguslavsky, I Tin Whiskers: Modeling Meeting Minutes Sept. 12, 2001 Telcon#5 Sept. 12, 2001, Telcon#5:

Boguslavsky, I NEMI Whisker Modeling Group DOE (1-24-02) NEMI Whisker Modeling Group DOE (1-24-02)

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Schloetter SLOTOTIN 40 Plating Description www.schloetter.co.uk/electronics/s22.html

Whisker Test Method Confirmation for ChipPac's Matte Tin Chemistry ChipPac Jul 18, (2002) presented at NEMI

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Space Views Article, "Mexican Satellite Failure May Be Linked to Past Problem", August 30, 2000.

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Product Liability Directive ( 85/374/EEC), amended by Directive 1999/34/EC (no changes 12/18/2008) End of Life Vehicles Directive (ELV Directive, 2000/53/EC) Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Directive ( RoHS Directive, 2002/95/EC) Council Decision COM(2004) 606, adopted Sept. 23, 2004) Commission Decision 2005/618/EC published, August 19, 2005 first amendment, which was published in volume 48 issue L214 page 65 second amendment to the RoHS Directive was published in volume 48 issue L271 Commission Decision 2005/747/EC published Oct. 25, 2005 third amendment to the RoHS Directive was published in volume 48 issue L280 Commission Decision 2006/310/EC published Apr. 26, 2006, fourth amendment to the RoHS Directive was published in volume 49 issue L115 Commission Decision 2006/691/EC published Oct. 12, 2006 fifth amendment to the RoHS Directive was published in volume 49 issue L283 Commission Decision 2006/692/EC published October 12, 2006, sixth amendment to the RoHS Directive was published in volume 49 issue L283 Commission Decision 2006/690/EC published Oct. 12, 2006 seventh amendment to the RoHS Directive was published in volume 49 issue L283

Waste Electrical and Electronic Equipment Directive (WEEE Directive, 2002/96/EC) Directive 2003/108/EC published in volume 46 issue L345 Commission Decision 2004/249/EC is a questionaire Commision Decision 2005/369/EC on Rules

Restrictions on the Marketing and Use of Certain Dangerous Substances and Preparations Directive (Directive 76/769/EEC)

Batteries and Accumulators Containing Certain Dangerous Substances Directive (Battery Directive, 91/157/EEC) in volume xx issue L78 Directive 98/101/EC published in volume 42 issue L1

Energy-using Products (EuP) Directive (EuP Directive, 2005/32/EC) in Volume 48 issue L191

Batteries and accumulators and waste batteries and accumulators (new Batteries Directive, 2006/66/EC) in volume 49 issue L266

Management Methods for the Prevention and Control of Pollutants from Electronic Information Products law, often referred to as "China RoHS ". "Measures for Administration of the Pollution Control of Electronic Information Products," May 9, 2006.

REACH Directive 1907/2006 of 18 December 2006. http://eur-lex.europa.eu/LexUriServ/LexUriServ.do?uri=OJ:L:2006:396:0001:0849:EN:PDF

E-waste laws: (Argentina) (Australia) (Brazil) (California) Health and Safety Code 108920-108923 PBB, PBDE (California) Rechargeable Battery Recycling Act of 2006 July 1, 2006 (California) Electronic Waste Recycling Act Jan 2007 (Canada - Nova Scotia) (Chile) (China) Reduction of Hazardous Substances March 1, 2007 (China) Management Methods on Controlling Pollution by Electronic Information Products (Columbia) (Connecticut) (EPA) Management of Electronic Waste in the United States (EU) revision to 1991 Battery Directive Sept 2008 (Illinois) (India) http://www.element14.com/community/docs/DOC-27283/l/india-weee-and-rohs (Japan) J-MOSS (Korea) The Act for Resource Recycling of Electrical/Electronic Products and Automobiles July 1, 2007 (Korea) The Act for Resource Recycling of Electrical and Electronic Equipment and Vehicles (Maine) (Malaysia) (Maryland) (Massachusetts) (Michigan) (Minnesota) (New Jersey) Electronic Waste Recycling Act Jan 1, 2009 RoHS (New York) E-waste (New York City) (New Zealand) (Oregon) (Pennsylvania) (South Korea) (Taiwan) (Texas) (Thailand) (Venezuela) (Washington) HR 2595

books

Miller, Frederic P., Vandome, Agnes F., and McBrewster, John, Mains Power around the World: Mains power around the world, Alternating current, Delta-wye transformer, Electrical wiring, Electricity, Industrial and multiphase power plugs and sockets. USA: Alphascript, 2009. ISBN 978-613-0-08143-0. $66.00 list price.

http://eur-lex.europa.eu/legal-content/EN/TXT/PDF/?uri=CELEX:32012L0019&rid=6 DIRECTIVE 2012/19/EU OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 4 July 2012 on waste electrical and electronic equipment (WEEE) (recast) Volume 55 L 197 July 4, 2012.

the lead free electronics manhattan project - phase ii. the benchmarking and best practices center of excellence, may 31, 2010. [manhattan2.pdf]

Kanagasabapathy, M., Electrochemical & Electrical Basics for Capacitors and Supercapacitors: Techniacl Perspective. Kindle Direct Publishing, 2020, ISBN 9798579819352.

theses (ESD)

theses (power distribution)

theses (tin pest)

theses (tin whiskers) make 2 copies

theses (whiskers)

theses (RoHS)

web pages (ESD)

web pages (power distribution)

web pages (tin pest)

web pages (tin whiskers) make 2 copies

web pages (whiskers)

web pages (RoHS)

papers (ESD)

Luo, Guang-Xiao, Huang, Ke, Zhou, Jian-Chi, Zhang, Wei, Pommerenke, David, and Holliman, Jimmy, "Design of an Artificial Dummy for Human Metal Model ESD," IEEE Transactions on Electromagnetic Compatibility, vol. 63 no. 1, pp. 319-323, Feb. 2021.

Maghlakelidze, Giorgi, Shen, Li, Gossner, Harald, Pommerenke, David, and Kim, DongHyun, "IC Pin Modeling and Mitigation of ESD-Induced Soft Failures," IEEE Transactions on Electromagnetic Compatibility, vol. 63 no. 2, pp. 375-383, Apr. 2021.

papers (power distribution)

"Anode and Cathode Foil: Market Dynamics of Thin Foil Etching and Winding," Passive Component Industry (Aluminum Electrolytics Markets & Competition), vol. 2 no. 4, pp. 26,30,32, May/June 2000.

Capacitor Self-resonant Frequency and Signal Integrity

Adams, Tom, "Two New Nondestructive Tools for Capacitor Evaluation," Passive Component Industry (Film Capacitors Market Outlook), vol. 5 no. 4, pp. 28-29, July/Aug. 2003.

Adler, Philipp, and Mallwitz, Regine, "Time-based Reliability Analysis of Electrolytic Capacitors for Automotive Applications Using Multi-Domain Simulation," 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, St Julians, Malta, Apr. 19-21, 2021, pp. xx-xx.

Alwitt, Robert S., and Liu, Yamming, "Electrolytes for High Voltage Aluminum Electrolyte Capacitors," Passive Component Industry (Aluminum Electrolytics Markets & Competition), vol. 2 no. 4, pp. 14-18,22-24, May/June 2000.

Amaral, Acacio M. R., and Cardoso, A. J. Marques, "An Economic Offline Technique for Estimating the Equivalent Circuit of Aluminum Electrolytic Capacitors," IEEE Transactions on Instrumentation and Measurement, vol. 57 no. 12, pp. 2697-2710, Dec. 2008.

Belko, Victor O., Emelyanov, Oleg A., Ivanov, Ivan O., and Plotnikov, Andrey P., "Self-Healing Processes of Metallized Film Capacitors in Overload Modes-Part 1: Experimental Observations," IEEE Transactions on Plasma Science , vol. 49 no. 5, pp. 1580-1587, May 2021.

Brennan, T. F., "Ceramic Capacitor Insulation Resistance Failures Accelerated by Low Voltage," IEEE Transactions on Electron Devices, vol. 26 no. 1, pp. 102-108, Jan. 1979.

Chen, Jun, and Hashimoto, Masanori, "A Frequency-Dependent Target Impedance Method Fulfilling Voltage Drop Constraints in Multiple Frequency Ranges," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 10 no. 11, pp. 1769-1781, Nov. 2020.

Eged, Bertalan, and Balogh, Laszlo, "Analytical Calculation of the Impedance of Lossy Power/Ground Planes," IEEE Transactions on Instrumentation and Measurement, vol. 52 no. 6, pp. 1886-1891, Dec. 2003.

Gleichauf, Jonas, Maniar, Youssef, and Wiese, Steffen, "Test Screening of Solder Joints Under Combined Cyclic Thermal and Bending Load for Automotive Applications," 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, St Julians, Malta, Apr. 19-21, 2021, pp. xx-xx.

Hahn, Randy, and Pritchard, Kim, "Strategies for Manufacturing Ultra Low ESR Tantalum Capacitors," Passive Component Industry (Ceramic & Tantalum Capacitors), vol. 7 no. 1, pp. 16-18,20,39, Jan./Feb. 2005.

Harris, Kevin W., McDuff, Glen, and Burkes, Tommy R., "Evaluation of Electrolytic Capacitors for High Peak Current Pulse Duty," IEEE Transactions on Electron Devices, vol. 38 no. 4, pp. 758-766, Apr. 1991.

Huang, Robert, "Radial Lead Film Capacitors Testing/Sorting Machine," Passive Component Industry (Film Capacitors Market Outlook), vol. 5 no. 4, pp. 24,26, July/Aug. 2003.

Murphy, Arthur T., and Young, Frederick J., "High Frequency Performance of Multilayer Capacitors," IEEE Transactions on Microwave Theory and Techniques, vol. 43 no. 9, pp. 2007-2015, Sept. 1995.

Olalla, David, and Chandran, Suresh, "New Metallized Polypropylene Film Capacitors for Resonant Applications in the Lighting Industry," Passive Component Industry (Film Capacitors Market Outlook), vol. 5 no. 4, pp. 21-22, July/Aug. 2003.

Pozdeev-Freeman, Yuri, "How Far Can We Go with High CV Tantalum Capacitors?," Passive Component Industry (Ceramic & Tantalum Capacitors), vol. 7 no. 1, pp. 6-8,10-11,24, Jan./Feb. 2005.

Radhakrishnan, Kaladhar, Swaminathan, Madhavan, and Bhattacharyya, Bidyut K., "Power Delivery for High-Performance Microprocessors- Challenges, Solutions, and Future Trends," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 11 no. 4, pp. 655-671, Apr. 2021.

Ragoisha, Genady, and Aniskevich, Yauhen, "Comment to the article "How to measure and report the capacity of electrochemical double layers, supercapacitors, and their electrode materials" [1]," Journal of Solid State Electrochemistry, vol. 25 no. 3, pp. 753, Mar. 2021. https://doi.org/10.1007/s10008-020-04880-z

Ran, Z. Y., Du, B. X., Xiao, M., Liu, H. L., and Xing, J. W., "Effect of Crystallization Regulation on the Breakdown Strength of Metallized Polypropylene Film Capacitors," IEEE Transactions on Dielectrics and Electrical Insulation, vol. 28 no. 1, pp. 175-182, Feb. 2021.

Schnack, Jasper, Bruckner, Sven, Suncksen, Herwig, Schumann, Ulf, and Mallwitz, Regine, "Analysis and Optimization of Electrolytic Capacitor Technology for High-Frequency Integrated Inverter," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 11 no. 6, pp. 999-1011, June 2021.

Shibata, Tsugumichi, and Kato, Yoshito, "Characterization of Multi-Layer Ceramic Chip Capacitors up to mm-Wave Frequencies for High-Speed Digital Signal Coupling," IEICE Transactions on Electronics, vol. E103.C no. 11, pp. 575-581, Nov. 2020. https://doi.org/10.1587/transele.2019ESP0004

Stewart, Mark, "AVX FlexiTerm: A Soft Termination MLCC Solution to Guard Against Capacitor Crack Failures," Passive Component Industry (Ceramic & Tantalum Capacitors), vol. 7 no. 1, pp. 12-14,22,38, Jan./Feb. 2005.

Sun, Yin, Wu, Songping, Zhang, Jianmin, Hwang, Chulsoon, and Yang, Zhiping, "Corrections to "Measurement Methodologies for Acoustic Noise Induced by Multilayer Ceramic Capacitors of Power Distribution Network in Mobile Systems"," IEEE Transactions on Electromagnetic Compatibility, vol. 63 no. 2, pp. 645-645, Apr. 2021.

Sun, Yin, Wu, Songping, Zhang, Jianmin, Hwang, Chulsoon, and Yang, Zhiping, "Corrections to "Simulation Methodologies for Acoustic Noise Induced by Multilayer Ceramic Capacitors of Power Distribution Network in Mobile Systems"," IEEE Transactions on Electromagnetic Compatibility, vol. 63 no. 2, pp. 646-646, Apr. 2021.

Sun, Yin, Wu, Songping, Zhang, Jianmin, Hwang, Chulsoon, and Yang, Zhiping, "Simulation Methodologies for Acoustic Noise Induced by Multilayer Ceramic Capacitors of Power Distribution Network in Mobile Systems," IEEE Transactions on Electromagnetic Compatibility, vol. 63 no. 2, pp. 589-597, Apr. 2021.

Teverovsky, Alexander, "Breakdown and Self-healing in Tantalum Capacitors," IEEE Transactions on Dielectrics and Electrical Insulation, vol. 28 no. 2, pp. 663-671, Apr. 2021.

Teverovsky, Alexander, "Popcorning Failures in Polymer and MnO2 Tantalum Capacitors," IEEE Transactions on Device and Materials Reliability, vol. 21 no. 1, pp. 33-40, Mar. 2021.

Vetter, Harald, "Power Capacitor Chips for Automotive Low Power Converters," Passive Component Industry (Film Capacitors Market Outlook), vol. 5 no. 4, pp. 32-33, July/Aug. 2003.

Yao, Shi, Wei, Xing-Chang, and Ding, Li, "Modeling of Loaded Nonuniform Grid Power Distribution Network With Arbitrary Shapes," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 11 no. 1, pp. 90-97, Jan. 2021.

Zhang, Yi, Wang, Zhongxu, Zhao, Shuai, Blaabjerg, Frede, and Wang, Huai, "Lifetime Prediction of the Film Capacitor based on Early Degradation Information," 2021 IEEE Applied Power Electronics Conference and Exposition, virtual conference, June 14-17, 2021, pp. 407-412.

papers (tin pest)

papers (tin whiskers) make 2 copies of list

Ghaffarian, Reza, "Ball Grid Array Assembly Reliability," NASA Electronic Parts and Packaging Program, 2004.

Iwamoto, Hiroyuki, Nakamura, Katsuji, Tsuruta, Kaichi, and Munekata, Osamu, "Study on Suppression of External Stress Type Tin Whisker by PR Current Method," 2021 International Conference on Electronics Packaging, Tokyo, Japan, May 12-14, 2021, pp. 75-76. [Iwamoto_Hiroyuki_2021.pdf]

Kozak, Martin, and Dusek, Karel, "Influence of Stress Factors on the Whiskers Growth on Sn-Cu Based Surfaces," 2021 44th International Spring Seminar on Electronics Technology, virtual, May 5-9, 2021, pp. xx-xx. [Kozak_Martin_2021.pdf]

Liu, Yushuang, Zhang, Peigen, Yu, Jin, Chen, Jian, Zhang, Yamei, and Sun, Zhengming, "Confining effect of oxide film on tin whisker growth," Journal of Materials Science and Technology, vol. 35 no. 8, pp. 1735-1739, Aug. 2019. DOI: 10.1016/j.jmst.2019.03.042 [Liu_Yushuang_2019.pdf]

Sakamoto, Yoshinori, Yamazaki, Wataru, Shimura, Masaomi, and Ishihara, Sotomi, "On Sn Whisker Suppressing Mechanism by Heat Treatment to the Double Layrer Plating System(Sn/Cu)," Journal of the Japan Institute of Metals and Materials, vol. 82 no. 5, pp. 153-161, May 2018. https://doi.org/10.2320/jinstmet.J2017032 [Sakamoto_Yoshinori_2018.pdf]

Sakamoto, Yoshinori, Tsuda, Kazuto, Yamazaki, Wataru, Shimura, Masaomi, and Ishihara, Sotomi, "Study on the Length Distribution and the Growth Rate of Sn Whiskers Generated on Sn/Cu Plating System," Journal of the Japan Institute of Metals and Materials, vol. 83 no. 8, pp. 273-281, Aug. 2019. https://doi.org/10.2320/jinstmet.J2019012 [Sakamoto_Yoshinori_2019.pdf]

Smetana, Joe, Coyle, Richard, Lundeen, Eric, Muntele, Iulia, Danko, Scott, Hubble. Neil, and Christian, Bev, "Board Thickness Effect on Accelerated Thermal Cycle Reliability," APEX EXPO 2010, virtual conference, Mar. 8-12, 2021, pp. xx-xx.

Tang, Jingwen, Zhang, Peigen, Liu, Yushuang, Lu, Chengjie, Zhang, Yan, He, Wei, Tian, Wubian, Zhang, Wei, and Sun, Zhengming, "Selective growth of tin whiskers from its alloys on Ti2SnC," Journal of Materials Science and Technology, vol. 54, pp. 206-210, Oct. 1, 2020. DOI: 10.1016/j.jmst.2020.02.081 [Tang_Jingwen_2020.pdf]

Ghaffarian, Reza, "Ball Grid Array Assembly Reliability," NASA Electronic Parts and Packaging Program, 2004.

Iwamoto, Hiroyuki, Nakamura, Katsuji, Tsuruta, Kaichi, and Munekata, Osamu, "Study on Suppression of External Stress Type Tin Whisker by PR Current Method," 2021 International Conference on Electronics Packaging, Tokyo, Japan, May 12-14, 2021, pp. 75-76. [Iwamoto_Hiroyuki_2021.pdf]

Kozak, Martin, and Dusek, Karel, "Influence of Stress Factors on the Whiskers Growth on Sn-Cu Based Surfaces," 2021 44th International Spring Seminar on Electronics Technology, virtual, May 5-9, 2021, pp. xx-xx. [Kozak_Martin_2021.pdf]

Liu, Yushuang, Zhang, Peigen, Yu, Jin, Chen, Jian, Zhang, Yamei, and Sun, Zhengming, "Confining effect of oxide film on tin whisker growth," Journal of Materials Science and Technology, vol. 35 no. 8, pp. 1735-1739, Aug. 2019. DOI: 10.1016/j.jmst.2019.03.042 [Liu_Yushuang_2019.pdf]

Sakamoto, Yoshinori, Yamazaki, Wataru, Shimura, Masaomi, and Ishihara, Sotomi, "On Sn Whisker Suppressing Mechanism by Heat Treatment to the Double Layrer Plating System(Sn/Cu)," Journal of the Japan Institute of Metals and Materials, vol. 82 no. 5, pp. 153-161, May 2018. https://doi.org/10.2320/jinstmet.J2017032 [Sakamoto_Yoshinori_2018.pdf]

Sakamoto, Yoshinori, Tsuda, Kazuto, Yamazaki, Wataru, Shimura, Masaomi, and Ishihara, Sotomi, "Study on the Length Distribution and the Growth Rate of Sn Whiskers Generated on Sn/Cu Plating System," Journal of the Japan Institute of Metals and Materials, vol. 83 no. 8, pp. 273-281, Aug. 2019. https://doi.org/10.2320/jinstmet.J2019012 [Sakamoto_Yoshinori_2019.pdf]

Smetana, Joe, Coyle, Richard, Lundeen, Eric, Muntele, Iulia, Danko, Scott, Hubble. Neil, and Christian, Bev, "Board Thickness Effect on Accelerated Thermal Cycle Reliability," APEX EXPO 2010, virtual conference, Mar. 8-12, 2021, pp. xx-xx.

Tang, Jingwen, Zhang, Peigen, Liu, Yushuang, Lu, Chengjie, Zhang, Yan, He, Wei, Tian, Wubian, Zhang, Wei, and Sun, Zhengming, "Selective growth of tin whiskers from its alloys on Ti2SnC," Journal of Materials Science and Technology, vol. 54, pp. 206-210, Oct. 1, 2020. DOI: 10.1016/j.jmst.2020.02.081 [Tang_Jingwen_2020.pdf]

papers (whiskers)

Behroudj, A., Salimitari, P., Nilsen M., and Strehle, S., "Exploring nanowire regrowth for the integration of bottom-up grown silicon nanowires into AFM scanning probes," Journal of Micromechanics and Microengineering, vol. 31 no. 5, pp. 055010-1-055010-11, May 2021. https://doi.org/10.1088/1361-6439/abf332 [Behroudj_A_2021.pdf]

Ghaffarian, Reza, "Ball Grid Array Assembly Reliability," NASA Electronic Parts and Packaging Program, 2004.

Iwamoto, Hiroyuki, Nakamura, Katsuji, Tsuruta, Kaichi, and Munekata, Osamu, "Study on Suppression of External Stress Type Tin Whisker by PR Current Method," 2021 International Conference on Electronics Packaging, Tokyo, Japan, May 12-14, 2021, pp. 75-76. [Iwamoto_Hiroyuki_2021.pdf]

Jafari, Majid, Bang, Chan-Woo, Han, Jong-Chan, Kim, Kyeong-Min, Na, Seon-Hyeong, Park, Chan-Gyung, and Lee, Byeong-Joo, "Evolution of microstructure and tensile properties of cold-drawn hyper-eutectoid steel wires during post-deformation annealing," Journal of Materials Science and Technology, vol. 41, pp. 1-11, Mar. 15, 2020. DOI: 10.1016/j.jmst.2019.08.054 [Jafari_Majid_2020.pdf]

Kozak, Martin, and Dusek, Karel, "Influence of Stress Factors on the Whiskers Growth on Sn-Cu Based Surfaces," 2021 44th International Spring Seminar on Electronics Technology, virtual, May 5-9, 2021, pp. xx-xx. [Kozak_Martin_2021.pdf]

Liu, Yushuang, Zhang, Peigen, Yu, Jin, Chen, Jian, Zhang, Yamei, and Sun, Zhengming, "Confining effect of oxide film on tin whisker growth," Journal of Materials Science and Technology, vol. 35 no. 8, pp. 1735-1739, Aug. 2019. DOI: 10.1016/j.jmst.2019.03.042 [Liu_Yushuang_2019.pdf]

Moreno, Julian A., Bran, Cristina, Vazquez, Manuel, and Kosel, Jurgen, "Cylindrical Magnetic Nanowires Applications," IEEE Transactions on Magnetics, vol. 57 no. 4, pp. 800317-1-800317-17, Apr. 2021. [Moreno_Julian_A_2021.pdf]

Sakamoto, Yoshinori, Yamazaki, Wataru, Shimura, Masaomi, and Ishihara, Sotomi, "On Sn Whisker Suppressing Mechanism by Heat Treatment to the Double Layrer Plating System(Sn/Cu)," Journal of the Japan Institute of Metals and Materials, vol. 82 no. 5, pp. 153-161, May 2018. https://doi.org/10.2320/jinstmet.J2017032 [Sakamoto_Yoshinori_2018.pdf]

Sakamoto, Yoshinori, Tsuda, Kazuto, Yamazaki, Wataru, Shimura, Masaomi, and Ishihara, Sotomi, "Study on the Length Distribution and the Growth Rate of Sn Whiskers Generated on Sn/Cu Plating System," Journal of the Japan Institute of Metals and Materials, vol. 83 no. 8, pp. 273-281, Aug. 2019. https://doi.org/10.2320/jinstmet.J2019012 [Sakamoto_Yoshinori_2019.pdf]

Smetana, Joe, Coyle, Richard, Lundeen, Eric, Muntele, Iulia, Danko, Scott, Hubble. Neil, and Christian, Bev, "Board Thickness Effect on Accelerated Thermal Cycle Reliability," APEX EXPO 2010, virtual conference, Mar. 8-12, 2021, pp. xx-xx.

Tang, Jingwen, Zhang, Peigen, Liu, Yushuang, Lu, Chengjie, Zhang, Yan, He, Wei, Tian, Wubian, Zhang, Wei, and Sun, Zhengming, "Selective growth of tin whiskers from its alloys on Ti2SnC," Journal of Materials Science and Technology, vol. 54, pp. 206-210, Oct. 1, 2020. DOI: 10.1016/j.jmst.2020.02.081 [Tang_Jingwen_2020.pdf]

Tunghathaithip, Naraphorn, Lertvachirapaiboon, Chutiparn, Shinbo, Kazunari, Kato, Keizo, Tungasmita, Sukkaneste, and Baba, Akira, "Fabrication of Silicon Nanowires by Metal-Catalyzed Electroless Etching Method and Their Application in Solar Cell," IEICE Transactions on Electronics, vol. E104.C no. 6, pp. 180-183, June 2021. https://doi.org/10.1587/transele.2020OMS0008 [Tunghathaithip_Naraphorn_2021.pdf]

Zhao, Shuchun, Zhu, Qi, An, Xianghai, Wei, Hua, Song, Kexing, Mao, Scott X., and Wang, Jiangwei, "In situ atomistic observation of the deformation mechanism of Au nanowires with twin-twin intersection," Journal of Materials Science and Technology, vol. 53, pp. 118-125, Sept. 15, 2020. DOI: 10.1016/j.jmst.2020.03.044 [Zhao_Shuchun_2020.pdf]

papers (RoHS)

Aspandiar, R., Murayama, K., Goonetilleke, P., Radhakrishnan, J., and Fu, H., "Post Mechanical Shock Test Failure Analysis on Mixed SnAgCu-BiSn BGA Solder Joints," 2021 International Conference on Electronics Packaging, Tokyo, Japan, May 12-14, 2021, pp. 137-138.

Behroudj, A., Salimitari, P., Nilsen M., and Strehle, S., "Exploring nanowire regrowth for the integration of bottom-up grown silicon nanowires into AFM scanning probes," Journal of Micromechanics and Microengineering, vol. 31 no. 5, pp. 055010-1-055010-11, May 2021. https://doi.org/10.1088/1361-6439/abf332 [Behroudj_A_2021.pdf]

Chen, Yaojun, Jing, Bo, Li, Jianfeng, Jiao, Xiaoxuan, Hu, Jiaxing, and Wang, Yun, "Failure Analysis and Modeling of Solder Joints in BGA Packaged Electronic Chips," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 11 no. 1, pp. 43-50, Jan. 2021.

Chen, Zhiwen, Ma, Kun, Liu, Li, Lee, Ning-Cheng, Liu, Guoyou, Yan, Jiasheng, Li, Hui, Liu, Sheng, Ruan, Meng, Pan, Huiming, Lu, Wenli, and Ding, Jiaqi, "Mechanical Performance and Reliability of a Sn-Ag-Cu-Sb Alloy at Elevated Temperatures," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 11 no. 7, pp. 1081-1087, July 2021.

Chu, Liu, Zhou, Peng, Shi, Jiajia, and Braun, Robin, "Sensitivity Analysis for Geometrical Parameters of BGA in Flip-Chip Packaging Under Random Shear Stress and Thermal Temperature," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 11 no. 5, pp. 765-777, May 2021.

Delhaise, Andre M., Tan, Ivan, Snugovsky, Polina, Kennedy, Jeff, Brillantes, Mikaella, Perovic, Doug D., Hillman, David, Adams, David, Meschter, Stephan, Kammer, Milea, and Straznicky, Ivan, "Restoration of Lead-Free Bismuth Containing Solder Joints," circuit insight, Mar. 25, 2021.

Deshpande, Abhishek, Jiang, Qian, and Dasgupta, Abhijit, "Variability of Mechanical Cycling Durability of SAC305 Solder Joints: Model-Based Assessment using Grain-scale Modeling of Cyclic Shear Loading," 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , St Julians, Malta, Apr. 19-21, 2021, pp. xx-xx.

Fima, Przemyslaw, Pstrus, Janusz, and Gancarz, Tomasz, "Wetting and Interfacial Chemistry of SnZnCu Alloys with Cu and Al Substrates," Journal of Materials Engineering and Performance , vol. 23 no. 5, pp. 1530-1535, May 2014. https://doi.org/10.1007/s11665-014-0867-1

Fros, Denis, and Vesely, Petr, "Comparative Study Focused on Mechanical Properties of Solder Joints Considering Solder Pad Surface Finish," 2021 44th International Spring Seminar on Electronics Technology, virtual, May 5-9, 2021, pp. xx-xx.

Gancarz, Tomasz, Fima, Przemyslaw, and Pstrus, Janusz, "Thermal Expansion, Electrical Resistivity, and Spreading Area of Sn-Zn-In Alloys," Journal of Materials Engineering and Performance, vol. 23 no. 5, pp. 1524-1529, May 2014. https://doi.org/10.1007/s11665-013-0825-3

Gancarz, Tomasz, and Fima, Przemyslaw, "Wetting and Interfacial Chemistry of Sn-Zn-Ga Alloys with Cu Substrate," Journal of Materials Engineering and Performance, vol. 25 no. 8, pp. 3358-3365, Aug. 2016. https://doi.org/10.1007/s11665-016-2029-0

Ghaffarian, Reza, "Ball Grid Array Assembly Reliability," NASA Electronic Parts and Packaging Program, 2004.

Gleichauf, Jonas, Maniar, Youssef, and Wiese, Steffen, "Test Screening of Solder Joints Under Combined Cyclic Thermal and Bending Load for Automotive Applications," 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, St Julians, Malta, Apr. 19-21, 2021, pp. xx-xx.

Ha, Job, Yu, Yeon-seop, and Cho, Kang-Young, "Solder Joint Reliability of Double sided Assembled PLP Package," 2020 IEEE 22nd Electronics Packaging Technology Conference, Singapore, Dec. 2-4, 2020, pp. 408-412.

Illes, Balazs, Skwarek, Agata, Krammer, Oliver, Straubinger, Daniel, Lako, Bence, Harsanyi, Gabor, and Witek, Krzysztof, "Soldering with SACX0307-(TiO2/ZnO) nano-composite solder alloys," 2021 44th International Spring Seminar on Electronics Technology, virtual, May 5-9, 2021, pp. xx-xx.

Iwamoto, Hiroyuki, Nakamura, Katsuji, Tsuruta, Kaichi, and Munekata, Osamu, "Study on Suppression of External Stress Type Tin Whisker by PR Current Method," 2021 International Conference on Electronics Packaging, Tokyo, Japan, May 12-14, 2021, pp. 75-76. [Iwamoto_Hiroyuki_2021.pdf]

Jaafar, Norhanani Binte, Choong, Chong Ser, Siang, Sharon Lim Pei, and Chong, Chai Tai, "Thermal Aging and Ball Shear Characterization of SAC-X Solders for Wafer Level Packaging," 2020 IEEE 22nd Electronics Packaging Technology Conference, Singapore, Dec. 2-4, 2020, pp. 321-325.

Jafari, Majid, Bang, Chan-Woo, Han, Jong-Chan, Kim, Kyeong-Min, Na, Seon-Hyeong, Park, Chan-Gyung, and Lee, Byeong-Joo, "Evolution of microstructure and tensile properties of cold-drawn hyper-eutectoid steel wires during post-deformation annealing," Journal of Materials Science and Technology, vol. 41, pp. 1-11, Mar. 15, 2020. DOI: 10.1016/j.jmst.2019.08.054 [Jafari_Majid_2020.pdf]

Kadlecova, Anna, Kralova, Iva, and Vesely, Petr, "Mechanical and Thermal Consequences of Added Phosphorus and Gallium in Lead-free Alloy Based on Bismuth and Tin," 2021 44th International Spring Seminar on Electronics Technology, virtual, May 5-9, 2021, pp. xx-xx.

Kavitha, M., Mahmoud, Zaid Hamid, Kishore, Kakarla Hari, Petrov, A. M., Lekomtsev, Aleksandr, Iliushin, Pavel, Zekiy, Angelina Olegovna, and Salmani, Mohammad, "Application of Steinberg Model for Vibration Lifetime Evaluation of Sn-Ag-Cu-Based Solder Joints in Power Semiconductors," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 11 no. 3, pp. 444-450, Mar. 2021.

Kozak, Martin, and Dusek, Karel, "Influence of Stress Factors on the Whiskers Growth on Sn-Cu Based Surfaces," 2021 44th International Spring Seminar on Electronics Technology, virtual, May 5-9, 2021, pp. xx-xx. [Kozak_Martin_2021.pdf]

Kralova, Iva, Kadlecova, Anna, Vesely, Petr, and Dusek, Karel, "Influence of Added Phosphorus and Gallium in Lead-free Bismuth-Tin Alloys on Wetting and Intermetallic Compounds," 2021 44th International Spring Seminar on Electronics Technology, virtual, May 5-9, 2021, pp. xx-xx.

Kunwar, Anil, An, Lili, Liu, Jiahui, Shang, Shengyan, Raback, Peter, Ma, Haitao, and Song, Xueguan, "A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering," Journal of Materials Science and Technology, vol. 50, pp. 115-127, Aug. 1, 2020. DOI: 10.1016/j.jmst.2019.12.036

Liu, Yushuang, Zhang, Peigen, Yu, Jin, Chen, Jian, Zhang, Yamei, and Sun, Zhengming, "Confining effect of oxide film on tin whisker growth," Journal of Materials Science and Technology, vol. 35 no. 8, pp. 1735-1739, Aug. 2019. DOI: 10.1016/j.jmst.2019.03.042 [Liu_Yushuang_2019.pdf]

Mach, Pavel, and Horak, Martin, "Study of Changes in the Dissipation Factor of PP Film Capacitors Caused by Heat Treatment," 2021 44th International Spring Seminar on Electronics Technology, virtual, May 5-9, 2021, pp. xx-xx.

Miki, Shota, Kawakami, Koyuki, Murayama, Kei, and Oi, Kiyoshi, "Development of High Reliability Joint of Sn-Bi Solder for 2.3D Organic Package," 2021 International Conference on Electronics Packaging, Tokyo, Japan, May 12-14, 2021, pp. 91-92.

Moreno, Julian A., Bran, Cristina, Vazquez, Manuel, and Kosel, Jurgen, "Cylindrical Magnetic Nanowires Applications," IEEE Transactions on Magnetics, vol. 57 no. 4, pp. 800317-1-800317-17, Apr. 2021. [Moreno_Julian_A_2021.pdf]

Pan, Ke, Ha, Jong Hwan, Wang, Huayan, Xu, Jiefeng, and Park, Seungbae, "An Analysis of Solder Joint Formation and Self-Alignment of Chip Capacitors,"