Bibliography for Tin Whiskers

This web site is being maintained by John R. Barnes, who was the President and Chief Engineer of dBi Corporation from 2002 to September 30, 2013, when we closed because ObamaCrap made it too expensive for us to remain in business.

John R. Barnes KS4GL, PE, NCE, NCT, ESDC Eng, ESDC Tech, PSE, Master EMC Design Engineer, SM IEEE (retired)
February 5, 2021
jrbarnes@iglou.com

This bibliography now has references to 1,924 documents that I have collected on tin whiskers since 2004, including: with about 583 links to documents that as of September 2020 can be downloaded from the Internet for free.

Tin whiskers are conductive filaments that can spontaneously grow from tin plating and some tin alloys (i.e. solders). Typical tin whiskers are 2 to 3 microns (0.002 to 0.003mm) in diameter--" about 1/40th the diameter of a human hair-- and can carry 10's of milliamps of current without melting. If a tin whisker connects two signal traces, or connects a signal trace to a power/ ground trace, the resulting short-circuit can make the equipment fail intermittently or permanently. But if a tin whisker crosses a battery or turned-on power supply, it may melt and form a plasma that can carry 100's of amps of current, damaging or destroying the equipment!

Up until about year 2000, tin whiskers were almost unknown in the electronics industry, because we mainly used tin-lead solders, tin-lead platings on printed circuit boards (PCB's), and tin-lead platings and tin-lead terminations on electronic components. As little as 2 to 3% lead alloyed with tin gives us almost-perfect protection against the growth of tin whiskers .

But about 2000, the European Union (EU) started pushing for the removal of lead from electronic equipment. On February 13, 2003, the EU published the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Directive (RoHS Directive, Directive 2002/95/EC (now replaced by Directive 2011/65/EU)), to take effect on July 1, 2006. This Directive almost totally bans the use of lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB's), and polybrominated diphenyl ethers (PBDE's) in electronic products and equipment.

This ban on lead introduced a variety of new failure modes that:

of electronic products and equipment, with tin whiskers being the worst problem. We used to be able to get 20 to 30 years of use out of an electronic product. But with lead-free electronics, we are lucky if they last more than a couple of months after their warranties run out.

As a result, since 2000 there has been a tremendous amount of research by electronics manufacturers, universities, and consultants, trying to find alternative ways to:

in electronic products and equipment.


Books on Tin Whiskers (revised 9/28/2020)

The Lead Free Electronics Manhattan Project - Phase II. The Benchmarking and Best Practices Center of Excellence, May 31, 2010. pp. 131-132,Appendix C.

Buschow, K. H. J., Cahn, Robert, Flemings, Merton C., Ilschner, Bernhard, Kramer, Edward J., Mahajan, Subhash, and Veyssiere, Patrick, Encyclopedia of Materials: Science and Technology, Volume 10. (Katz, J. D., "Whiskers," pp. 9570-9574.) Pergamon, 2001. ISBN 0080431526. $7,295.00 list price.

Dunn, Barrie D., Materials and Processes for Spacecraft and High Reliability Applications . Chichester, United Kingdom: Springer, 2016. ISBN 978-3-319-79474-7. $154.26 list price.

Fukuda, Mitsuo, Reliability and Degradation of Semiconductor Lasers and LEDs. Boston: Artech House, 1991. ISBN 0890064652.

Gilman, J. J., The Art and Science of Growing Crystals. New York: John Wiley & Sons, 1963.

Grossmann, Gunter, and Zardini, Christian, The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects. New York: Springer, 2011. ISBN 978-0-85729-235-3. $129.00 list price.

Henshall, Greg, Bath, Jasbir, and Handwerker, Carol A., Lead-Free Solder Process Development. Hoboken, NJ: John Wiley & Sons, 2011. ISBN 978-0-470-41074-5. $99.95 list price.

Kato, Takahiko, Handwerker, Carol A., and Bath, Jasbir, Mitigating Tin Whisker Risks: Theory and Practice. Hoboken, NJ: IEEE Press, 2016. ISBN 9780470907238.

Levitt, Albert P., Whisker Technology. New York: Wiley-Interscience, 1970. ISBN 471-53150-2.

Licari, James J., and Enlow, Leonard R., Hybrid Microcircuit Technology Handbook: Materials, Processes, Design, Testing and Production, 2nd Edition. Westwood, NJ: Noyes Publications, 1998. ISBN 0815514239. $180.00 list price.

Lin, Kwang-Lung, Solder Materials. London: World Scientific Publishing, 2018. ISBN 978-981-3237-60-5. $143.47 list price.

Tan, A. C., Tin and Solder Plating in the Semiconductor Industry. New York: Chapman & Hall, 1993. ISBN 0-412-48240-1.

Wright, Roger N., Wire Technology: Process Engineering and Metallurgy. Elsevier, 2011. ISBN 978-0-12-382092-1.


Ph. D. and Master's Theses on Tin Whiskers (revised 10/19/2020)

Anglin, Benjamin Stewart, Investigation and Characterization of Thermoelastic Eigenstresses Near Microstructural Features and the Application to Tin Whisker Growth. Ph. D. Thesis for Carnegie Mellon University, Pittsburgh, PA, Oct. 2012.

Bhardwaj, Divya, Development of Lead Free Thermal Fuse Wires Using Ohno Continuous Casting. Master's Thesis for University of Toronto, Toronto, Canada, 2008.

Bhassyvasantha, Sherin, Mitigation of Tin Whiskers in Electroplated Tin Coatings by Effective Doping: The Role of Surface and Subsurface. Master's Thesis for New Mexico Institute of Mining and Technology, Socorro, NM, May 2018.

Bierman, Matthew John, Dislocations in One-Dimensional Semiconductor Crystals: Nanowires, Nanotubes, and Whiskers. Ph. D. Thesis for University of Wisconsin - Madison, Madison, WI, 2009.

Booth, Bruce Lee, Magnetoresistance Oscillations in Antimony Doped Gray Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1967.

Borra, Venkata Shesha Vamsi, Metal Whiskers: The Role of Electric Fields in the Formation Mechanism and Methods for Whisker Growth Mitigation. Ph. D. Thesis for University of Toledo, Toledo, OH, Dec. 2017.

Buchovecky, Eric J., Numerical Simulation of Stress Generation and Whisker Growth in Sn Films. Ph. D. Thesis for Brown University, Providence, RI, May 2010.

Chakraborty, Aritra, Using Chemo-Thermo-Mechanically Coupled Crystal Plasticity Simulations to Investigate the Process of Whisker Formation in b-Sn Thin Films. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2019.

Chandler, Gary Jesse Howard, Growth of Whiskers in the Indium-Tin Alloy System and the effect of Elastic Strain on Tc in alpha Indium-Tin. Master's Thesis for Clemson University, Clemson, SC, Aug. 1972.

Chen, Wei-Hsun, Evaluation of Local Anisotropic Elasticity and Thermal Expansion on Whisker Formation Sites in beta-tin Thin Films. Ph. D. Thesis for Purdue University, West Lafayette, IN, Aug. 2014.

Cheng, Jing, Tin Whiskers in Electronic Packaging: Mechanism and Modeling. Ph. D. Thesis for University of Rochester, Rochester, NY, 2011.

Chin, Erica, Templated Synthesis and Characterization of Multi-segmented Nanowires for Sensor and Optical Device Applications. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, 2009.

Clore, Nicholas G., Identification and Counting Procedure for Tin Whiskers, Hillocks, and Other Surface Defects. Master's Thesis for Purdue University, Hammond, IN, Dec. 2011.

Courey, Karim J., An Investigation of the Electrical Short Circuit Characteristics of Tin Whiskers. Ph. D. Thesis for University of Miami, Coral Gables, FL, May 2008.

Crandall, Erika R., Factors Governing Tin Whisker Growth. Ph. D. Thesis for Auburn University, Auburn, AL, 2012.

Dhiman, Rajat, Design and Qualification of a Robust Polyurethane Based Conformal Coating Process for SODIMMs. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2018.

Diaz Gonzalez, Alfredo J., Pb-Free Electronics: From Nanotechnology to Combinatorial Materials Science. Master's Thesis for University of Puerto Rico, Mayaguez, Puerto Rico, 2013.

Dimitrovska, Aleksandra, Mitigation Strategies of Tin(Sn) Whisker Growth, Ph. D. Thesis for Southern Methodist University, Dallas, TX, December 19, 2009.

Dong, Fei, Polyurethane-Based Conformal Coatings for Tin Whisker Mitigation. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2018.

Dudek, Martha A., Microstructure, Mechanical and Oxidation Behavior of RE-containing Pb-free Solders. Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2009.

Fang, Tong, Tin Whisker Risk Assessment Studies. Ph. D. Thesis for University of Maryland, College Park, MD, 2005.

Fukuda, Yuki, Experimental Investigations of Whisker Formation on Tin Platings . Ph. D. Thesis for University of Maryland, College Park, MD, 2005.

Gao, Fan, Lead-Free Nano-solders on Metallic Nanowires: Synthesis, Characterization, and Thermal Reflow Properties. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, April 21, 2009.

Gullapalli, Vikranth, Study of Metal Whiskers Growth and Mitigation Technique using Additive Manufacturing. Master's Thesis for University of North Texas, Denton, TX, Aug. 2015.

Han, Jung Kyu, Effect of Thermo-Electromigration on Copper Dissolution and Intermetallic Compound Formation in Flip-Chip Pb-free Solder Joints. Ph. D. Thesis for University of California, Los Angeles, CA, 2011.

Han, Sungwon, Assessment of an Electrical Shorting and Metal Vapor Arcing Potential of Tin Whiskers. Ph. D. Thesis for University of Maryland, College Park, MD, 2012.

Haspel, Dan, Developing a Dual-Layer System for the Mitigation of Tin Whiskers . Ph. D. Thesis for LOUGHBOROUGH University, Loughborough, United Kingdom, 2018.

Horvath, Barbara, Examination of Tin Whisker Growth in Electronic Assemblies. Ph. D. Thesis for Budapest University of Technology and Economics, Budapest, Hungary, 2012.

Jafreen, Rifat, A Cost Model for Assessing the Transition to Lead-Free Electronics . Master's Thesis for University of Maryland, College Park, MD, 2008.

Janiuk, Szymon, Tin Whisker Growth and Mitigation with a Nanocrysytalline Nickel Coating . Master's Thesis for University of Toronto, Toronto, Ontario, Canada, 2015.

Kao, Hui-Ju, Effect of Cu additives on Sn whisker formation and interfacial reaction of Sn(Cu) finishes. Master's Thesis for National Central University, Jhong-Li, Taiwan, May 23, 2005.

Killefer, Morgan, Whisker Growth Induced by Gamma Radiation on Glass Coated with Sn Thin Films. Master's Thesis for University of Toledo, Toledo, OH, Aug. 2017.

Kohnke, Elton Everett, Electrical Conductivity, Magnetoresistance, and Hall Effect in Gray Tin Filaments. Ph. D. Thesis for Northwestern University, Evanston, IL, July 1955.

Koppes, John Patrick, Effect of Crystallographic Orientation on Hillock Formation in Thermally Cycled Large Grain Tin Films. Ph. D. Thesis for Purdue University, West Lafayette, IN, Aug. 2012.

Kosiba, Eva, Characterization of Low Melting Temperature, Low-Ag, Bi-Containing, Pb-Free Solder Alloys. Master's Thesis for University of Toronto, Toronto, Canada, 2016.

Lee, Hoyong, Avionics Reliability Assurance Guidelines for High Altitude Applications . Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2012.

Lee, Taekyeong, Electromigration and Solid State Aging of Flip Chip Solder Joints and Analysis of Sn Whisker on Lead-frame. Ph. D. Thesis for University of California, Los Angeles, CA, 2001.

Maganty, Suraj, Enhanced Conformal Coatings for Tin Whisker Mitigation. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2017.

Mahan, Kenneth Howard, Advanced Adhesion Strength Testing Methods of Thin Film Multilayers in Electronic Packaging Systems. Ph. D. Thesis for University of Maryland, College Park, MD, 2016.

Niraula, Dipesh, Physics and applications of conductive filaments in electronic structures: from metal whiskers to solid state memory. Ph. D. Thesis for University of Toledo, Toldeo, OH, May 2019.

Panashchenko, Lyudmyla, Evaluation of Environmental Tests for Tin Whisker Assessment. Master's Thesis for University of Maryland, College Park, MD, 2009.

Pandian, Guru Prasad, Effect of Long-term Aging on Lead-free Solder (SAC405) and Surface Finish (Pure Tin). Master's Thesis for University of Maryland, College Park, MD, 2017.

Pedigo, Aaron E., The Influence of the Effective Physical Properties of Tin Electrodeposited Films on the Growth of Tin Whiskers. Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2011.

Pinol, Lesly Agnes, Fundamental Studies of Tin Whiskering in Microelectronics Finishes . Ph. D. Thesis for University of Maryland, College Park, MD, 2010.

Regalado, Irene Lujan, Characterization of Thermo-Mechanical Damage in Tin and Sintered Nano-Silver Solders. Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2018.

Rodekohr, Chad L., Material Factors Influencing Metallic Whisker Growth. Ph. D. Thesis for Auburn University, Auburn, AL, Dec. 19, 2008.

Sabbagh, N. A. J., Tin Whisker Growth in the Communication Industry. Master's Thesis for Sir George Williams University, Montreal, Canada, Apr. 1973.

Sarobol, Pylin, Effects of Local Film Properties on the Nucleation and Growth of Tin Whiskers and Hillocks. Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2013.

Sengupta, Shirsho, Effects of Solder-Dipping as a Termination Re-finishing Technique . Masters Thesis for University of Maryland, College Park, MD, June 2006.

Spitzner, Matthew James, Response of tin whiskers to dynamic input: Mathematical modeling and experimental property measurement. Master's Thesis for Iowa State University, Ames, IA, 2009.

Stuttle, Christopher James, The Electrodeposition of Tin Coatings from Deep Eutectic Solvents and their Subsequent Whisker Growth. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, Sept. 2014.

Sun, Yong, Micro/Nano-Scale Investigation on Tin Alloys and Tin Dioxide Nanowires . Ph. D. Thesis for University of South Carolina, Columbia, SC, 2012.

Vallabhaneni, Venkata Sathya Sai Renuka, Environmental-Induced Damage in Tin (Sn) and Aluminum (Al) Alloys . Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2017.

Wang, Weiqiang, Solder Joint Reliability of Sn and SnBi Finished and Refinished Sn (SAC/SnPb) SMT Packages Under Temperature Cycling Test. Master's Thesis for University of Maryland, College Park, MD, 2009.

Wang, Yibo, A Numerical Model of Anisotropic Mass Transport Through Grain Boundary Networks. Master's Thesis for Lehigh University, Bethlehem, PA, Sept. 2011.

Wang, Ying, Microstructure Evolution and Surface Defect Formation in Tin Films . Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2014.


Papers, Reports, Presentations, and Magazine Articles on Tin Whiskers (revised 2/4/2021)

First author's last name beginning with: A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

????

"100% Sn Plating Whisker Growth Study," AMD, Jan. 10, 2003.

A Guide To Lead-Free Soldering for Assemblers & Sub-Contractors, Version 2.6, $68 from Roger Bilham Consultancy

"Back Up Block 1 Whisker on Cu," June 6, 2003.

"Back Up Block 2 Whisker on NiFe," June 6, 2003.

"Basler Power Supplies," Westinghouse Nuclear Tech Bulletin TB-02-5, July 12, 2002.

"BMPCOE Strives to Mitigate Tin Whiskers," COTS Journal, vol. xx no. xx, pp. 60-63, Sept. 2003.

"Boeing 601 (f.k.a. Hughes HS 601)."

"Close Shave," Printed Circuit Design and Manufacture, vol. 20 no. 8, pp. 10, Aug. 2003.

"Coating to stop tin whisker growth?," Circuitnet, Aug. 14, 2006.

"Comments on Test Methods & Criteria for Tin Whiskers in Surface Mount Passive Devices," EIA/ECA-CB22, Nov. 2005.

"Control of Whisker Growth in Tin Alloy Coatings," ST Microelectronics Application Note AN2035, Nov. 2004.

"Electrodeposited Pb-free Solder and Whisker Prevention," Journal of Research of the National Institute of Standards and Technology, vol. 106 no. 2, pp. 490, Mar./Apr. 2001.

"Elimination of Lead from Electrical and Electronic Equipment - the Dilemma of Tin-Whisker Growth," Eurocomp, no. 7, pp. 3-6, Autumn 2004.

"European directives vs. Tin Whiskers & Tin Pest," finishing.com .

"Examples of tin-whiskers failures," evertiq, Oct. 11, 2007.

"Examples of Whiskergrowing in Industry Applications," 3rd Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Genova, Italy, Mar. 21, 2012.

"GEIA-HB-0005-4 Guidelines for Performing Reliability Assessment for Pb Free Assemblies used in Aerospace and High-Performance Electronic Applications," Sept. 23, 2010.

"GEIA-STD-0005-2 Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems," Rev A draft 1/5/11.

"Getting the Lead Out," Appliance Design, vol. xx no. x, pp. xx-xx, Feb. 2006.

"Glitch silences millions of pagers," Star-Bulletin, May 20, 1998.

Green-Guard 701 Aug. 15, 2009.

"High-Speed, Non-Whiskering Tin for Semiconductor Packages," Products Finishing, vol. 47 no. 12, pp. 80, Sept. 1983.

"Hot-Dip Tin Process Said to Prevent Whisker Formation," Products Finishing, vol. 73 no. 7, pp. 11, Apr. 2009.

"HP says RoHS making whiskers problem worse," evertiq, Feb. 22, 2005.

"HP's Position Statement on Tin-based Plating for Lead-free Components," Apr. 7, 2003.

"Hughes Satellite Failures Continue To Plague New Owner," Electronics Weekly, Apr. 24, 2001.

"Hughes Seeks To Salvage Satellites," Television Digest with Consumer Electronics, vol. xx no. xx, pp. xx-xx, Sept. 11, 2000.

"Inadvertent Reactor Trip and Partial Safety Injection Due to Tin Whisker," United States Nuclear Regulatory Commission, NRC Information Notice 2005-25, Aug. 25, 2005.

"Industry Groups Continue Focus on Tin Whiskers," CPMT Society Outlook , vol. 1, pp. 3-4, 2005.

"iNEMI Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products Version 4 (12-1-06)," iNEMI, Dec. 1, 2006.

"iNEMI Tin Whisker Accelerated Test Project Test Method for Evaluating Tin Whisker Growth on Plated Surfaces." International Electronics Manufacturing Initiative, June 17, 2004.

"iNEMI tin whisker group publishes updated recommendations," Tin World, no. 17, pp. 11, Spring 2007.

"iNEMI Tin Whisker user group publishes updated recommendations to help reduce risk of tin whiskers," emsnow, Dec. 20, 2006.

"iNEMI Tin Whisker Workshop," Tin World, no. 18, pp. 14, Early Summer 2007.

"iNEMI Updates Tin Whiskers Findings," SMT Web Exclusive Article.

"Inspections, Compliance, Enforcement, and Criminal Investigations Tin Wiskers Problems, Causes, and Solutions," Food and Drug Administration, Mar. 14, 1986.

"Interim Recommendations on Lead-Free Finishes for Components Used in High- Reliability Products,", NEMI, Mar. 2004.

"ITG Subject: Tin Whiskers - Problems, Causes, and Solutions," Department of Health, Education, and Welfare Public Health Service Food and Drug Administration *ORA/ORO/DEIO/IB*, Mar. 14, 1986.

"JEDEC and IPC Release Tin Whisker Acceptance Testing," Tin World , no. 14, pp. 11, 2006.

"JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," CircuiTree, vol. 19 no. 5, pp. xx-xx, May 2006.

"JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," PCB007, May 4, 2006.

"JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," FPGA and Structured ASIC Journal, vol. xx no. x, pp. xx-xx, May 4, 2006.

"JEDEC and IPC release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," emsnow, May 5, 2006.

"JEDEC, iNEMI Update Tin Whisker and Lead-Free Surface Finish Guidelines," CircuiTree, vol. 18 no. 7, pp. xx-xx, July 2005.

"JEDEC, IPC Release Tin Whisker Acceptance Testing Standard," Circuitree, vol. 19 no. 6, pp. xx-xx, June 2006.

"JEDEC, IPC Release Tin Whisker Standards," Printed Circuit Design and Manufacture, vol. 23 no. 6, pp. 8, June 2006.

"JEDEC Releases Standard for Tin Whisker Testing and iNEMI User Group Updates Lead-Free Surface Finish Guidelines," PCB007, May 24, 2005.

"JEITA Whisker Test Method Project," IPC and SOLDERTEC Global Conference, Brussels, June 2003.

"JESD201, Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes," Arlington, VA: JEDEC Solid State Technology Association, Mar. 2006.

"JESD22A121, Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes," JEDEC Solid State Technology Association, May 2005.

"JESD22A121.01, Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes," JEDEC Solid State Technology Association, Oct. 2005.

"JETRO Releases the Results of its Survey of Japanese Manufacturers in Europe and Turkey," PCB007, May 26, 2006.

"JP002, Current Tin Whiskers Theory and Mitigation Practices Guideline," Arlington, VA: JEDEC Solid State Technology Association and Bannockburn, IL: IPC, Mar. 2006.

Lead-Free Defect Guide 2, SMART Group, 2010.

"Lead Free Electronics Impact on DoD Programs," DMSMS Conference 2007, Orlando, FL, Oct. 29, 2007, pp. xx-xx.

Lead Free Electronics Manhattan Project Phase 2. ACI Technologies, Feb. 10, 2010.

"Lead Free Product Testing," Trace Laboratories-East.

"Lead Free Product Testing/Tin Whisker Testing," Trace Laboratories-East.

"Lead-Free solder failure mechanisms: What are Tin Whiskers?," LiveWire, no. 11, pp. xx-xx, .Nov./Dec. 2003.

"Lead Free Tin Whiskering Study: Grayhill DIP Switches," Grayhill, May 11, 2004.

"Lead-free: Whiskers on Tin," Tyco Electronics.

"Leadfree Solder and Tin Whiskers Program Guidance (draft)," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.

"Legs 1, 2 & 3: Olin 194 8lead SOIC Molded/Singulated."

"Matte Tin Plating Whisker Data," Lattice Product Bulletin PB1227H, Nov. 2010.

"MAUDE Adverse Event Report," 1996.

"MAUDE Adverse Event Report," 2008.

"Metal Whiskers," Science, New Series, vol. 123 no. 3209, pp. 1165, June 29, 1956.

"Metallic Whisker Sources," Worldwide Environmental Services, 2004.

"Nano Whiskers."

"NASA's Suggestions for Reducing Risk of Tin Whisker Induced Failures," Products Finishing, vol. 74 no. 12, pp. 32, Sept. 2010.

"NEMI Group Releases Draft Proposal of Tin Whisker Acceptance Test Requirements," CircuiTree, vol. 17 no. 6, pp. xx-xx. June 2004.

"NEMI Issues Revised Tin Whisker Acceptance Test Requirements," NEMI, Aug. 30, 2004.

"NEMI issues revised tin whisker acceptance test requirements," PCB007, Aug. 30, 2004.

"NEMI issues revised tin whisker acceptance test requirements," emsnow, Sept. 6, 2004.

"NEMI issues revised tin whisker test requirements," TIN World , no. 7, pp. 17, 2004.

"NEMI team recommends three test conditions for evaluating tin whisker growth," PCB007, Oct. 6, 2003.

"NEMI Team Recommends Three Test Conditions for Evaluating Tin Whisker Growth," CircuiTree, vol. 16 no. 12, pp. xx-xx, Dec. 2003.

"NEMI's Tin Whisker Project reports initial test results, reviews modeling efforts at APEX 2002," PCB007, Feb. 8, 2002.

"New additive limits tin whiskers," Solid State Technology, vol. 51 no. 1, pp. 23, Jan. 2008.

"New Immersion Tin Process PRESA RMK-30: Tin Whisker Issue," Uyemura, Mar. 2007.

"New Standards on Tin Whisker Mitigation," Circuits Assembly, vol. 17 no. 4, pp. 36, Apr. 2006.

"New tin whisker standard," Tin World, no. 18, pp. 16, Early Summer 2007.

"New TWI proposed project: Tin Whiskers - reducing the risk," TWI LiveWire, issue 14, Summer 2004.

"Nickel-coated Components Solve Electrical Problem," Nickel, vol. 20 no. 2, pp. 5, Mar. 2005.

"On Trial In Brazil," Air Safety Week, vol. 21 no. 23, June 11, 2007.

"Pb-Free Components," DfR Solutions, Mar. 3, 2010.

"Plating's Effects on Electronics Assembly," Printed Circuit Design and Fab/Circuits Assembly, vol. 27 no. 7, pp. 40, July 2010.

"Position Paper on Risks to High-Reliability Electronics and Associated Hardware from Pure Tin Coatings," July 25, 2002.

"Potential Tin Whiskers on Printed Circuit Board Components," Westinghouse Nuclear Tech Bulletin TB-05-4, June 8, 2005.

Problem Advisory FV5-P-06-01A

"Qualification of Lead Free Component Plating Finishes," Nov. 3, 2003.

"Qualification Procedure for Tin Whisker Formation in Lead-free Connector Terminal Finishes," Molex.

"Rationale for the Auger Studies," Tin Whisker Group teleconference, May 11, 2016.

"Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products," iNEMI Tin Whisker User Group, Version 3, May 2005.

"Reduce the risk of tin Whiskers in lead-free RJ connectors," Xmultiple Application Note, xxxx.

"Reducing the risk of tin whiskers on lead-free products," RF Design, vol. xx no. x, pp. xx-xx, May 10, 2006.

"Requested Exemption from the requirements of Article 4(1) of Directive 2002/95/EC," Swatch, Jan. 12, 2006.

"Resolution of Generic Safety Issues: Issue 200: Tin Whiskers (NUREG-0933, Main Report with Supplements 1-33) Nov. 3, 2010.

"Risks of Conductive Whiskers in High-Reliability Electronics and Associated Hardware from Pure Tin Coatings," June 19, 2002.

"Robotic Solder Dip Solves Tin Whisker Problem," Navy Mantech, 2005.

"RoHS at QP Semiconductor," QP Semiconductor Application Note 114 Rev. 2.0, Feb. 2008.

"Scientists Research Tin Pest and Whiskers," SMT Web Exclusive Article. (Apr. 3, 2009)

"Second ECTC iNEMI Tin Whisker Workshop," Components, Packaging, and Manufacturing Technology Society Newsletter, vol. 28 no. 2, pp. 8-9, June 2005.

"Set of recommendations to help reduce risk of Tin Whiskers," evertiq, Dec. 18, 2006.

"Shaving the Risk of Tin Whiskers," NITON Application Bulletin , Mar. 17, 2004.

"Shaving the whiskers for lead-free production," European Semiconductor, vol. 26 no. 11, pp. 17, Nov. 1, 2004.

"Some Examples of "Whiskers" from Tin-Based Alloys," Tin Whisker Group teleconference, July 22, 2009.

"Standards aim to reduce the risk of tin whiskers," Test & Measurement World, vol. 26 no. 4, pp. xx-xx, May 4, 2006.

"Standards aim to reduce the risk of tin whiskers," Test & Measurement World, vol. 26 no. 5, pp. 12, June 2006.

"Suppression of Tin Whisker Growth through Optimized Tin Plating Chemistry Formulation Technistan EP," Technic. (2004)

"Technical Service Bulletin: Tin Whiskers in MOD10 Relays." GE Power Management, MOD10 SB1-00.03.27, Mar. 27, 2000.

"Technical Support to the National Highway Traffic Safety Administration (NHTSA) on the Reported Toyota Motor Corporation (TMC) Unintended Acceleration (UA) Investigation, Version 1.0." NASA. Jan. 18, 2011.

"Testing for Tin Whisker Mitigation," Design News, June 27, 2005.

"The Facts about Tin Whiskers," Electronic Components, Assemblies & Materials Association, EIA/ECA-CB19, Aug. 2004.

"The Fusing of Wires and Tin Whiskers," Tin Whisker Group teleconferences, Apr. 22, 2009 and Apr. 29, 2009.

"The Growth of Tin Whisker," Samsung.

"The problem of 'tin whiskers' cannot be neglected," Dataweek , vol. xx no. xx, pp. xx-xx, July 28, 2004.

"The Relation between Whisker and Stress," Hynix Semiconductor. Sept. 2002.

"Thermal cycling test of tin-bismuth and tin plating," Ishihara Chemical Co., 2008.

"Three organizations from US, Europe, Japan cooperating to develop tin whisker test method," PCB007, July 18, 2003.

"Tin-Nickel Alloy Plating Does Not Grow Whiskers in Five Years," Tin and its Uses, no. 64, pp. 15, 1964.

"Tin-Nickel versus Metal "Whiskers"," Tin and its Uses, no. 52, pp. 8, 1961.

"Tin "Noodles"???." Mar. 17, 2004.

"Tin Whisker Acceptance Test Requirements," NEMI Tin Whisker Users Group, July 28, 2004.

"Tin Whisker Experience - Rocket Motor Initiator Failure Analysis."

"Tin Whisker Experiences," June 19, 2002.

"Tin Whisker Growth Evaluation Results," Kemet, Mar. 30, 2004.

"Tin Whisker Imagery," empfasis, pp. 9, Apr. 2009.

"Tin Whisker Info "Brief"," On Semiconductor Application Note TND311, May 2003.

"Tin-whisker issues deserve to be on the front burner," Military & AerospaceElectronics. (May 12, 2006)

"Tin Whisker Mitigation & Conformal Coating," Surface Mount Technology (SMT), vol. 28 no. 2, pp. 57, Feb. 2013.

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GGGG

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HHHH

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Xu, Chen, Zhang, Yun, Fan, Chonglun, and Abys, Joseph A., "Understanding Whisker Phenomenon: The Driving Force for Whisker Formation," CircuiTree, vol. 15 no. 5, pp. xx, May 2002.

Xu, Chen, Fan, Chonglun, Zhang, Yun, and Abys, Joseph A., "Whisker Prevention," OnBoard Technology, vol. xx no. xx, pp. 30-34, Feb. 2004.

Xu, Hui, and Zou, Yabing, "Characteristics and analysis methods for connector whisker growth," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Xue, Peng, Wang, Ke-Hong, Zhou, Qi, Huang, Jun, Long, Wei-min, and Zhang, Qing-ke, "Effect of Nd on tin whisker growth in Sn-Zn soldered joint," Journal of Materials Science: Materials in Electronics, vol. 27 no. 4, pp. 3742-3747, Apr. 2016.

Xue, Peng, Xue, Songbai, Shen, Yifu, Xiao, Zhengxiang, Zhu, Hong, Long, Weimin, and Yu, Xinquan, "Effect of Pr on properties and Sn whisker growth of Sn-9Zn-xPr solder," Soldering & Surface Mount Technology, vol. 24 no. 4, pp. 280-286, 2012.

Xue, Peng, Xue, Song-bai, Shen, Yi-fu, and Zhu, Hong, "Inhibiting the growth of Sn whisker in Sn-9Zn lead-free solder by Nd and Ga," Journal of Materials Science: Materials in Electronics, vol. 25 no. 6, pp. 2671-2675, June 2014.

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Xue, Peng, Xue, Song-bai, Shen, Yi-fu, Long, Fei, and Zhu, Hong, "Wettability and interfacial whiskers of Sn-9Zn-0.5Ga-0.08Nd solder with Sn, SnBi and Au/Ni coatings," Journal of Materials Science: Materials in Electronics, vol. 25 no. 8, pp. 3520-3525, Aug. 2014.

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YYYY

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Yao, Z. X., Yin, L. M., Wang, G., Tian, X. K., and Yao, Z. Y., "The effect of current stressing and external loading on the growth of tin whiskers," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 734-736.

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Yelton, Graham, Susan, Don, Michael, Joseph, and Shore, Daniel, "Understanding and Predicting Metallic Whisker Growth as a Function of Electrodeposited Morphology," 217th ECS Meeting, Vancouver, British Columbia, Canada, Apr. 25-30, 2010, pp. xx-xx. (Sandia Report SAND2010-2517C)

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Yen, Yee-Wen, Liou, Wei-kai, and Jao, Chien-Chung, "Investigation of Interfacial Reactions and Sn Whisker Formation in the Matte Sn Layer With NiP/Ni/Cu and Ni/Cu Multilayer Systems," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 6, pp. 951-956, June 2011.

Yen, Yee-Wen, Li, Chao-Kang, Tsou, Meng-Yu, and Shao, Pei-Sheng, "Substrate Shape Effect on the Sn Whisker Growth in the Electroplating Matte Sn System," Japanese Journal of Applied Physics, vol. 50 no. 1S2, pp. 01BJ07-1-01BJ07-4, Jan. 2011.

Yin, C. Y., Best, C., Bailey, C., Stoyanov, S., and Alam, M. O., "Statistical Analysis of the Impacts of Refinishing Process on the Reliability of Microelectronics Components," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1377-1381.

Yin, Qiyue, Gao, Fan, Wang, Jirui, Gu, Zhiyong, Stach, Eric A., and Zhou, Guangwen, "Length-dependent melting behavior of Sn nanowires," Journal of Materials Research, vol. 32 no. 6, pp. 1194-1202, Mar. 2017.

Yu, C. H., Kang, H. S., Kim, K. S., Han, S. W., and Yang, K. C., "Effects of Postbake on the Microstructure and Whisker Growth of Matte Sn Finish," 12th International Symposium on Advanced Packaging Materials , San Jose, CA, Oct. 3-5, 2007, pp. 158-164.

Yu, Cheng-Fu, Chan, Chi-Ming, and Hsieh, Ker-Chang, "The effect of tin grain structure on whisker growth," Microelectronics Reliability, vol. 50 no. 8, pp. 1146-1151, Aug. 2010.

Yu, Cheng-Fu, and Hsieh, Ker-Chang, "The Mechanism of Residual Stress Relief for Various Tin Grain Structures," Journal of Electronic Materials, vol. 39 no. 8, pp. 1315-1318, Aug. 2010.

Yu, H. C., Liu, S. H., and Chen, Chih, "Study of electromigration in thin tin film using edge displacement method," Journal of Applied Physics, vol. 98 no. 1, pp. 013540-1-013540-4, July 1, 2005.

Yu, Hongwen, Hu, Shejun, Hou, Xianhua, Ru, Qiang, Zhao, Lingzhi, and Li, Weishan, "Electrochemical Performance of Tin-Aluminum Thin Film Anodes for Lithium Ion Battery," Materials Science Forum, vol. 610-613, pp. 467-471, Jan. 2009.

Yuan, Jiaojiao, Wang, Xuefang, Lv, Zhicheng, Shi, Shuai, Wang, Yuzhe, and Liu, Sheng, "Study of Factors Influencing Tin Whisker Growth," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 940-944.

ZZZZ

Zaccari, J. S., "Pure Tin Plated Leads - Problems and Mitigation," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies , San Jose, CA, Apr. 23-24, 2003, pp. 258-261.

Zaccari, Joe, "Lead-Free Component Finishes: Problems and Mitigation," 2004 IEEE Microelectronics Reliability and Qualification Workshop, Manhattan Beach, CA, Feb. 3-4, 2004, pp. xx-xx.

Zaccari, Joseph, "Lead-Free Component Finishes - Problems and Mitigation," 2004 Medical Electronics Symposium Conference Proceedings, Bloomington, MN, May 19-20, 2004, pp. xx-xx.

Zak, Pavel, Tucan, Marek, and Kudlacek, Ivan, "Lead-free Car Electronics According to Updated ELV Directive," 2011 International Conference on Applied Electronics, Pilsen, Czech Republic, Sept. 7-8, 2011, pp. xx-xx.

Zak, Pavel, Tucan, Marek, and Kudlacek, Ivan, "Tin Coating of Connectors - Reliability Risk for Electrical Equipment," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 229-233.

Zakraysek, L., "Whisker Growth From a Bright Acid Tin Electrodeposit," Plating and Surface Finishing, vol. 64 no. 3, pp. 38-43, Mar. 1977.

Zapanta, Loren R., "Tin Whisker White Paper: JESD201 Approach," Cypress, Sept. 2012.

Zeng, Guang, Xue, Songbai, Gao, Lili, Zhang, Liang, Hu, Yuhua, and Lai, Zhongmin, "Interfacial microstructure and properties of Sn-0.7Cu-0.05Ni/Cu solder joint with rare earth Nd addition," Journal of Alloys and Compounds, vol. 509 no. 25, pp. 7152-7161, June 23, 2011.

Zeng, Guang, Xue, Songbai, Zhang, Liang, Gao, Lili, Lai, Zhongmin, and Luo, Jiadong, "Properties and microstructure of Sn-0.7Cu-0.05Ni solder bearing rare earth element Pr," Journal of Materials Science: Materials in Electronics , vol. 22 no. 8, pp. 1101-1108, Aug. 2011.

Zhang, Jinsong, and Zhang, Jianhua, "Estimation of whiskers growth on Sn coating of Cu-Leads in different accelerated tests," Advanced Materials Research, vol. 160-162, pp. 1575-1581, 2011.

Zhang, Jinsong, and Zhang, Jianhua, "Mechanism of whisker growth on pure Sn coating of Cu leads in the high temperature/humidity storage tests," Applied Mechanics and Materials , vol. 44-47, pp. 2691-2695, Dec. 2010.

Zhang, Junxiong, Xue, Songbai, Xue, Peng, and Liu, Shuang, "Thermodynamic reaction mechanism of the intermetallic compounds of SnxNdy and GaxNdy in soldered joint of Sn-9Zn-1Ga-0.5Nd," Journal of Materials Science: Materials in Electronics, vol. 26 no. 5, pp. 3064-3068, May 2015.

Zhang, Liang, Yang, Fan, and Zhong, Su-juan, "Effect of Nd on whiskers growth behavior of SnAgCu solders in electronic packaging," Journal of Materials Science: Materials in Electronics , vol. 27 no. 9, pp. 9584-9588, Sept. 2016.

Zhang, Liang, Sun, Lei, Han, Ji-guang, and Guo, Yong-huan, "Sizes effect of CeSn3 on the whiskers growth of SnAgCuCe solder joints in electronic packaging," Journal of Materials Science: Materials in Electronics, vol. 26 no. 8, pp. 6194-6197, Aug. 2015.

Zhang, Liang, Yang, Fan, and Zhong, Su-juan, "Whisker growth on SnAgCu-xPr solders in electronic packaging," Journal of Materials Science: Materials in Electronics, vol. 27 no. 6, pp. 5618-5621, June 2016.

Zhang, P., Zhang, Y. M., and Sun, Z. M., "Spontaneous Growth of Metal Whiskers on Surfaces of Solids: A Review," Journal of Materials Science and Technology, vol. 31 no. 7, pp. 675-698, 2015. DOI: 10.1016/j.jmst.2015.04.001

Zhang, Peng, Xue, Songbai, and Wang, Jianhao, "New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints," Materials & Design, vol. 192, pp. 108726-1-108726-17, July 2020, https://doi.org/10.1016/j.matdes.2020.108726

Zhang, Shizhong, Rong, Weibin, and Sun, Lining, "Development of a Nanomanipualtion System for Handling Nanowires," Key Engineering Materials, vol. 562-565, pp. 1092-1097, July 2013.

Zhang, Wan, Guebey, Jonas, and Toben, Michael, "A Novel Electrolyte for the High Speed Electrodeposition of Bright Pure Tin at Elevated Temperatures," Metal Finishing, vol. 109 no. 1-2, pp, 13-19, Jan.-Feb. 2011.

Zhang, Wan, and Schwager, Felix, "Effects of Lead on Tin Whisker Elimination," iNEMI Tin Whisker Workshop, San Diego, CA, May 30, 2006, pp. xx-xx.

Zhang, Wan, and Schwager, Felix, "Effects of Lead on Tin Whisker Elimination," Journal of the Electrochemical Society, vol. 153 no. 5, pp. C337-C343, 2006.

Zhang, Wan, Egli, Andre, Schwager, Felix, and Brown, Neil, "Investigation of Sn-Cu Intermetallic Compounds by AFM: New Aspects of the Role of Intermetallic Compounds in Whisker Formation," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 85-93, Jan. 2005.

Zhang, Xiao, Yang, Yang, Xu, Fangfang, Li, Tie, and Wang, Yuelin, "In-situ TEM mechanical characterization of nanowire in atomic scale using MEMS device," Microsystem Technologies, vol. 24 no. 4, pp. 2045-2049, Apr. 2018.

Zhang, Xundi, Yang, Chenlin, Sun, Menglong, Hu, Anmin, Li, Ming, Gao, Liming, Hang, Tao, and Ling, Huiqin, "Inhibition of tin whisker by electroplating ultra-thin Co-W amorphous barrier layer," Materials Characterization, vol. 162, pp. 110221-1-110221-8, Apr. 2020.

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Zhang, Y., Breck, G., Humiec, F., Murski, K., and Abys, A., "An Alternative Surface Finish for Tin/Lead Solders: Pure Tin," Surface Mount International Proceedings of the Technical Program, Volume II, San Jose, CA, Sept. 10-12, 1996, pp. 641-649.

Zhang, Y., Fan, C., Xu, C., Khaselev, O., and Abys, J. A., "Tin Whisker Growth - Substrate Effect Understanding CTE Mismatch and IMC Formation," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S27-2-1-S27-2-20.

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Zhang, Yan, Zhang, Peigen, He, Wei, and Sun, Zhengming, "Tin whisker growth on immiscible Al-Sn alloy," Journal of Materials Science: Materials in Electronics, vol. 31 no. 2, pp. 1328-1334, Jan. 2020.

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Zhang, Zhihao, Cao, Huijun, Xiao, Yong, Cao, Yong, Li, Mingyu, and Yu, Yuxi, "Electromigration-induced growth mode transition of anodic Cu6Sn5 grains in Cu|SnAg3.0Cu0.5|Cu lap-type interconnects," Journal of Alloys and Compounds, vol. 703, pp. 1-9, May 5, 2017.

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Web Pages on Tin Whiskers (revised 10/19/2020)

Please note: if a web page doesn't have a date, the date that I found it is in parentheses.

Ampeg B-12-XY: Tin Whiskers!, Aug. 2, 2011.

Martin, Holly, An Introduction to Tin Whiskers (before Feb. 24, 2009)

Hybrid Plastics Achieves a Milestone with Nanoscopic Materials for Suppression of Tin Whiskers from Lead-free Solders (before Feb. 24, 2009)

Spiers, Simon, Inside an AF114 transistor with tin whiskers, Youtube, Jan. 24, 2015.

Lead Finish Material Candidates and Pros/Cons (before May 17, 2005)

Lead-Free Surface Finishes for Electronic Components: Tin Whisker Growth (before Oct. 2, 2012)

Mechanism of Tin Whisker Growth in Electronics (before Aug. 18, 2020)

Brusse, Jay, Melting a TIN WHISKER Using a Volt/Ohm Meter, Youtube, May 3, 2012.

Brusse, Jay, Metal whisker growing from the header/seal area of a package enclosure for a crystal, Youtube, Oct. 16, 2017.

Brusse, Jay, Metal Whiskers-Inspection Video #5: Transistor Package, Youtube, Nov. 21, 2009.

Brusse, Jay, Metal Whiskers-Optical Inspection #1, Youtube, Nov. 21, 2009.

Brusse, Jay, Metal Whiskers-Optical Inspection #2, Youtube, Nov. 21, 2009.

Brusse, Jay, Metal Whiskers-Optical Inspection Video #4, Youtube, Nov. 21, 2009.

NASA Anecdote #1: 20 Years to Failure, (before Mar. 26, 2005)

NASA Anecdote #2: Tin Whiskers on Waveguide, (before Mar. 26, 2005)

NASA Anecdote #3: Field Failures Due to Tin Whiskers Breaking Loose from Matte Tin-Plated RF Enclosure Lids, (before Mar. 26, 2005)

NASA Anecdote #4- Tin Whiskers on Shield of GPS Units, (before Mar. 26, 2005)

NASA Anecdote #5: Field Failures Due to Tin Whiskers on Circuit Breaker Contacts, (before Mar. 26, 2005)

NASA Anecdote #7: Tin Whiskers on RF Shield/Bracket, Aug. 3, 2009.

NASA Anecdote: Tin Whiskers Inside of AF114 Transistors, Aug. 3, 2009.

NASA Anecdote: Tin Whiskers on Bus Bars, Aug. 3, 2009.

NASA Anecdote: Tin Whiskers on Oscilloscope Probes (2007), Aug. 3, 2009.

NASA Basic Info/FAQ, (before Feb. 22, 2009)

NASA Experiment 2, (before Apr. 15, 2005)

Kadesch. Jong S., NASA Goddard Space Flight Center Effect of Uralane Conformal Coating on Tin Whisker Growth, Apr. 20, 2005.

NASA Goddard Space Flight Center Electromagnetic Relay Manufacturer Survey , Apr. 20, 2005.

NASA Goddard Space Flight Center Experiment #2 Photo Gallery, Apr. 20, 2005.

NASA Goddard Space Flight Center Experiment 1, (before Apr. 15, 2005)

NASA Goddard Space Flight Center Experiment 3, Apr. 20, 2005.

NASA Goddard Space Flight Center Experiment 4, (before Apr. 15, 2005)

NASA Goddard Space Flight Center Experiment 5, (before Apr. 15, 2005)

NASA Goddard Space Flight Center Experiment 6: Simulation of Whisker Growth , (before Apr. 15, 2005)

NASA Goddard Space Flight Center Experiment 7: Matte Tin Plated IC Leadframe Examination, Apr. 20, 2005.

NASA Goddard Space Flight Center Photo of the Month, (before Apr. 2, 2005)

NASA Goddard Space Flight Center Re-emergence of an Old Problem with Potentially Catastrophic Consequences, Apr. 20, 2005.

NASA Goddard Space Flight Center Specification Language Related to Pure Tin (before Mar. 26, 2005)

NASA Goddard Space Flight Center Summary of Specification Language for Pure Tin (before Mar. 26, 2005)

NASA Goddard Space Flight Center Tin Whisker Photo, Apr. 20, 2005.

NASA Goddard Space Flight Center Tin Whisker Photo, Apr. 20, 2005.

NASA GSFC Experiments, (before Apr. 15, 2005)

NASA Literature References, (before Apr. 24, 2005)

NASA Metal "Dendrites" are NOT the Same as Metal "Whiskers", Feb. 22, 2007.

NASA Metal Whiskers from Sn-Ag-Cu Alloy Systems, (before July 14, 2008)

NASA Photo Gallery, (before Mar. 26, 2005)

NASA Photo of the Month Archives December 2003 Sn-Pb Whiskers, (before Mar. 26, 2005)

NASA Tin Whisker (and Other Metal Whisker) Homepage, (before Mar. 26, 2005)

NASA Tin Whisker Anecdote: Swiss Radio & Telephone, June 9, 2008.

NASA Video Gallery. (before Aug. 18, 2020)

NASA What's New, Jan. 24, 2011.

NASA Whisker Anecdotes, Jan. 17, 2019.

NASA Whisker Failures, (before Mar. 26, 2005)

Pb-free (Lead Free) Frequently Asked Questions (before Feb. 12, 2011)

Plating (before Feb. 12, 2011)

Preliminary Guidance for Optical Inspection for Metal Whiskers Dec. 10, 2007.

Pure Tin Plating Prohibition (before Feb. 22, 2009)

Reducing tin whisker related failures in electronics, Youtube, Mar. 31, 2017.

Sn Whisker (before Nov. 14, 2015)

Soviet ILS teardown with a tin whiskers surprise, Youtube, Nov. 27, 2015.

Testing for Tin Whisker Growth (before Apr. 16, 2005)

The Trouble with Tin: Get the Lead Out! (before Fall 2000)

Tin Whisker Alert 2008.

Perton, Marc, "Tin whisker" crisis threatens global electronic systems (before May 17, 2005)

Brusse, Jay, Tin Whisker Growth Kinetics, Youtube, Nov. 21, 2009.

Tin Whisker Mitigation - Adding Lead to Chip Size Components with Pure-Tin Terminals (before May 17, 2005)

Tin Whisker Summary (before Feb. 13, 2011)

Tin Whisker Testing (before Aug. 18, 2020)

Tin Whiskers (before Feb. 13, 2011)

Tin Whiskers (before Feb. 2, 2005)

Tin Whiskers 2004.

Tin Whiskers 2008.

Tin Whiskers "A New Problem" (before Feb. 22, 2009)

Murray, Charles, Tin Whiskers Again Cited as Potential Problem for Toyotas, DesignNews, July 25, 2012.

Tin whiskers causes and prevention 2008.

Brusse, Jay, Tin Whiskers-Dsub Connector Shell, Youtube, Nov. 21, 2009.

Robertson, Jordan, 'Tin whiskers' imperil electronics, Yahoo! News, Oct. 8, 2007.

Spiers, Simon, Tin whiskers inside a AF117 transistor, Youtube, Jan. 6, 2014.

Brusse, Jay, Tin Whiskers Inside Electromagnetic Relay, Youtube, Nov. 21, 2009.

Brusse, Jay, Tin Whiskers on Card Guides, Youtube, Nov. 21, 2009.

Brusse, Jay, Tin Whiskers on Electromagnetic Relays, Youtube, Nov. 21, 2009.

Brusse, Jay, Tin Whiskers on Lincoln's Beard, Nov. 25, 2009.

Brusse, Jay, Tin Whiskers on Terminal Lugs, Youtube, Nov. 21, 2009.

Brusse, Jay, Tin Whiskers on Variable Air Capacitor, Youtube, Nov. 21, 2009.

Tin Whiskers (Tech Tip #2) (before Apr. 30, 2005)

Tin Whiskers with Special Morphology July 14, 2008.

Video showing Tin Whiskers, Youtube Oct, 5, 2015.

"What are Tin Whiskers?." (before Nov. 22, 2015)

"What Are Tin Whiskers?" (before Nov. 22, 2015)

What are Tin Whiskers? (before Apr. 24, 2005)

What Are Tin Whiskers? (before Feb. 24, 2009)

What's Inside Your PC? (before May 25, 2009)

Whisker growth over a 12 minute period (before Nov. 14, 2015)

Whisker growth over a 19 minute period (before Nov. 14, 2015)

Whisker (metallurgy) (before May 20, 2009)

Whiskers in germanium transistors etc

"Will electronic equipment fail from tin-whisker shorts?," SourceESB, Feb. 9, 2005.


All Documents on Tin Whiskers in Reverse Chronological Order (revised 12/10/2020)

Please note: if a web page doesn't have a date, the date that I found it is in parentheses.

Articles In Press: 0 books, 0 theses, 0 papers, and 0 web pages on tin whiskers

2021: 0 books, 0 theses, 1 paper, and 0 web pages on tin whiskers

Tian, Shuang, Cao, Ruihua, Zhou, Jian, Xue, Feng, Liu, Yushuang, Zhang, Peigen, and Sun, ZhengMing, "A comparative study on the growth behaviors of Sn whiskers and hillocks in a Sn-Al alloy coating under different environments," Journal of Alloys and Compounds, vol. 853, pp. 157101-1-157101-12, Feb. 5, 2021. https://doi.org/10.1016/j.jallcom.2020.157101

2020: 0 books, 0 theses, 23 papers, and 3 web pages on tin whiskers

Bagheripoor, Mahdi, and Klassen, Robert, "Effect of crystal orientation on the size effects of nano-scale fcc metals," Materials Science and Technology, vol. 36 no. 17, pp. 1829-1850, 2020. https://doi.org/10.1080/02670836.2020.1839193

Oudat, Osama, Arora, Vidheesha, Parsai, E. Ishmael, Karpov, Victor G., and Shvydka, Diana, "Gamma- and x-ray accelerated tin whisker development," Journal of Physics D: Applied Physics, vol. 53 no. 49, pp. 495305-1-495305-9, Dec. 2020. https://doi.org/10.1088/1361-6463/abb38d

Chen, Wei-Hsun, Wang, Congying, Sarobol, Pylin, Blendell, John, and Handwerker, Carol, "Local variations in grain formation, grain boundary sliding, and whisker growth along grain boundaries in large-grain Sn films," Scripta Materialia, vol. 187, pp. 458-463, Oct. 2020.

Illes, Balazs, Krammer, Oliver, Hurtony, Tamas, Dusek, Karel, Busek, David, and Skwarek, Agata, "Kinetics of Sn whisker growth from Sn thin-films on Cu substrate," Journal of Materials Science: Materials in Electronics, vol. 31 no. 19, pp. 16314-16323, Oct. 2020. https://doi.org/10.1007/s10854-020-04180-2

Wang, Changchang, Chen, Yinbo, and Liu, Zhi-Quan, "Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging," Acta Metallurgica Sinica (China), vol. 33 no. 10, pp. 1388-1396, Oct. 2020. https://doi.org/10.1007/s40195-020-01059-3

Shvydka, Diana, and Karpov, Victor G., "Gamma and x-ray accelerated tin whisker development," Tin Whisker Group teleconference, Oct. 14, 2020.

Wang, Zekun, Flowers, George T., and Bozack, Michael, "The Influence of Limitation of Sputtered Tin Area Through Mesh Grids on Sn Whiskering," 2020 IEEE 66th Holm Conference on Electrical Contacts and Intensive Course, San Antonio, TX, Oct. 4-7, 2020, pp. 137-143.

"Reduce the risk of tin Whiskers in lead-free RJ connectors," Xmultiple Application Note, xxxx. (found 10/2/2020)

Toleno, Brian, "Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers," Henkel Corp. (found 9/30/2020)

Otsubo, Fumitaka, Era, Hidenori, Tsuru, Yutaka, and Hirano, Shigeru, "TEM analysis of whiskers formation over tin-plated films," Materials Chemistry and Physics, vol. 251, pp. 122985-1-122985-6, Sept. 1, 2020.

Mechanism of Tin Whisker Growth in Electronics (before Aug. 18, 2020)

NASA Video Gallery. (before Aug. 18, 2020)

Tin Whisker Testing (before Aug. 18, 2020)

Tian, Shuang, Gong, Xiaohua, Zhou, Jian, and Xue, Feng, "Growth behaviors of tin whiskers on Sn-Al coating," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Xu, Hui, and Zou, Yabing, "Characteristics and analysis methods for connector whisker growth," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Zhang, Peng, Xue, Songbai, and Wang, Jianhao, "New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints," Materials & Design, vol. 192, pp. 108726-1-108726-17, July 2020, https://doi.org/10.1016/j.matdes.2020.108726

Xu, Chen, Zhang, Yun, Fan, C., and Abys, J., "Understanding Whisker Phenomenon: Driving Force for Whisker Formation," Cookson Electronics. (found June 2020)

Jagtap, Piyush, Jain, Nupur, and Chason, Eric, "Whisker growth under a controlled driving force: Pressure induced whisker nucleation and growth," Scripta Materialia, vol. 182, pp. 43-47, June 2020.

Cai, Xiaorong, Handwerker, Carol A., Blendell, John E., and Koslowski, Marisol, "Shallow grain formation in Sn thin films," Acta Materialia, vol. 192, pp. 1-10, June 15, 2020.

Illes, Balazs, Batorfi, Reka, Hurtony, Tamas, Krammer, Oliver, Harsanyi, Gabor, Pietrikova, Alena, Skwarek, Agata, and Witek, Krzysztof, "Whisker Development from SAC0307-Mn07 Solder Alloy," 2020 43rd International Spring Seminar on Electronics Technology, Liptovsky Mikulas, Slovakia, May 14-15, 2020, pp. xx-xx.

Zhang, Xundi, Yang, Chenlin, Sun, Menglong, Hu, Anmin, Li, Ming, Gao, Liming, Hang, Tao, and Ling, Huiqin, "Inhibition of tin whisker by electroplating ultra-thin Co-W amorphous barrier layer," Materials Characterization, vol. 162, pp. 110221-1-110221-8, Apr. 2020.

Ebner, Karen, Demeo, Robert, Villiers, Janet, Goossens, Andrew, Mantoni, Daniel, and McCarthy, Lenna, "An Automated TIN WHISKER RISK ASSESSMENT Process Resulting in Significant Cost Savings," Printed Circuit Design and Fab/ Circuits Assembly , vol. 37 no. 2, pp. 46-49, Feb. 2020.

Majumdar, B. S., Dutta, I., Bhassyvasantha, S., and Mahapatra, S. Das, "Recent Advances in Mitigation of Whiskers from Electroplated Tin," JOM , vol. 72 no. 2, pp. 906-917, Feb. 2020.

Liu, Yushuang, Lu, Chengjie, Zhang, Peigen, Yu, Jin, Zhang, Yamei, and Sun, Zheng Ming, "Mechanisms behind the spontaneous growth of Tin whiskers on the Ti2SnC ceramics," Acta Materialia, vol. 185, pp. 433-440, Feb. 15, 2020.

Zhang, Yan, Zhang, Peigen, He, Wei, and Sun, Zhengming, "Tin whisker growth on immiscible Al-Sn alloy," Journal of Materials Science: Materials in Electronics, vol. 31 no. 2, pp. 1328-1334, Jan. 2020.

Vianco, P. T., Cummings, D. P., Kotula, P. G., Mckenzie, B. M., Lowery, L. M., Williams, S., and Banga, D., "Mitigation of Long Whisker Growth Based upon the Dynamic Recrystallization Mechanism," Journal of Electronic Materials, vol. 49 no. 1, pp. 888-904, Jan. 2020.

2019: 0 books, 2 theses, 36 papers, and 1 web page on tin whiskers

Chakraborty, Aritra, Using Chemo-Thermo-Mechanically Coupled Crystal Plasticity Simulations to Investigate the Process of Whisker Formation in b-Sn Thin Films. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2019.

Delhaise, Andre M., Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, and Bagheri, Zohreh, "Tin Whisker Formation in Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage, Part I: Whisker Inspection Results," SMTA Journal, vol. 32 no. 2, pp. 14-26, 2019.

Haspel, D. M., Ashworth, M. A., Wilcox, G. D., Bao, X., and Mortimer, R. J., "The effect of different post-electroplating surface modification treatments on tin whisker growth," Transactions of the IMF, vol. 97 no. 3, pp. 129-139, 2019. https://doi.org/10.1080/00202967.2019.1587263

Mokhtar, Noor Zaimah Mohd, Salleh, Mohd Arif Anuar Mohd, Hashim, Aimi Noorliyana, and Nazri, Sufian Firdaus, "Effects of Gallium addition on the thermal properties and whiskers growth under electrical current stressing," Materials Science and Engineering , vol. 701, pp. 012001-1-012001-7, 2019.

Hashim, Aimi Noorliyana, Salleh, Mohd Arif Anuar Mohd, Mokhtar, Noor Zaimah Mohd, and Idris, Shahida, "Tin (Sn) whisker growth from electroplated Sn finished," Materials Science and Engineering, vol. 701, pp. 012005-1-012005-6, 2019.

Hashim, Aimi Noorliyana, Salleh, Mohd Arif Anuar Mohd, and Mokhtar, Noor Zaimah Mohd, "Morphology Analysis of Spontaneous Tin (Sn) Whisker Growth on Lead-Free Solder," Materials Science and Engineering, vol. 551, pp. 012095-1-012095-6, 2019.

Mokhtar, Noor Zaimah Mohd, Salleh, Mohd Arif Anuar Mohd, and Hashim, Aimi Noorliyana, "Preliminary Study of Electrical Current Stressing on Tin Whisker Formation," Materials Science and Engineering, vol. 551, pp. 012096-1-012096-5, 2019.

Kutilainen, Terho, Pudas, Marko, Ashworth, Mark A., Lehto, Tero, Wu, Liang, Wilcox, Geoffrey D., Wang, Jing, Collander, Paul, and Hokka, Jussi, "Atomic Layer Deposition (ALD) to Mitigate Tin Whisker Growth and Corrosion Issues on Printed Circuit Board Assemblies," Journal of Electronic Materials, vol. 48 no. 11, pp. 7573-7584, Nov. 2019.

Sharma, Ashutosh, Park, Young Min, Lee, Sangyeob, and Ahn, Byungmin, "Morphology, resistivity and corrosion behavior of tin coatings plated from citric acid bath," Materials Research Express, vol. 6 no. 11, pp. 116589-1-116589-10, Nov. 2019.

Illes, Balazs, Hurtony, Tamas, Krammer, Oliver, Medgyes, Balint, Dusek, Karel, and Busek, David, "Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films," Materials, vol. 12 no. 21, pp. 3609-1-3609-11, Nov. 1, 2019.

Ahn, Seongki, Kadoya, Takahiro, Nara, Hiroki, Yokoshima, Tokihiko, Momma, Toshiyuki, and Osaka, Tetsuya, "Tin addition for mechanical and electronic improvement of electrodeposited Si-O-C composite anode for lithium-ion battery," Journal of Power Sources, vol. 437, pp. 226858-1-226858-6, Oct. 15, 2019.

Lin, Wen-Chih, Tseng, Tsan-Hsien, Liu, Wei, Huang, Kuo-Shuo, Chen, Hao, Lee, Hsin-Yi, Ku, Ching-Shun, and Wu, Albert T., "Effect of Sn Film Grain Size and Thickness on Kinetics of Spontaneous Sn Whisker Growth," JOM, vol. 71 no. 9, pp. 3041-3048, Sept. 2019.

Schetty, Rob, "Next-Gen Corrosion-Resistant Finishes for Electronics," Products Finishing, vol. 83 no. 12, pp. 28-31, Sept. 2019.

Delhaise, Andre M., Meschter, Stephan, Bagheri, Zohreh, Snugovsky, Polina, and Kennedy, Jeff, "Evaluation of Tin Whisker Formation on SOT and Discrete Components Assembled with Bismuth-Containing Lead-Free Solder Alloys After Short-Term High Temperature, High Humidity Storage," Proceedings of SMTA International , Rosemont, IL, Sept. 22-26, 2019, pp. 323-343.

Rafanelli, Anthony J., "Status of Pb-Free Risk Mitigation for Aerospace and Defense - An "Attitude Adjustment" Perspective," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 478-483.

Saito, Akira, and Nishikawa, Hiroshi, "Tin Whisker Growth Mechanism on Tin Plating of MLCCs Mounted with Sn-3.5Ag-8In-0.5Bi Solder in 30°C60%RH," 2019 22nd European Microelectronics and Packaging Conference & Exhibition, Pisa, Italy, Sept. 16-19, 2019. pp. xx-xx.

Kutilainen, Terho, Pudas, Marko, Ashworth, Mark A., Wilcox, Geoffrey D., and Hokka, Jussi, "ALD Coatings to Mitigate Against Tin Whiskers and Upgrade the Environmental Durability of Electronic Circuit Boards," 2019 22nd European Microelectronics and Packaging Conference & Exhibition, Pisa, Italy, Sept. 16-19, 2019. pp. xx-xx.

Wu, Jie, Xue, Songbai, Wang, Jingwen, and Wu, Mingfang, "Effect of in-situ formed Pr-coated Al2O3 nanoparticles on interfacial microstructure and shear behavior of Sn-0.3Ag-0.7Cu-0.06Pr/Cu solder joints during isothermal aging," Journal of Alloys and Compounds, vol. 799, pp. 124-136, Aug. 30, 2019.

Tu, K. N., and Gusak, A. M., "A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production," Journal of Applied Physics, vol. 126 no. 7, pp. 075109-1-075109-6, Aug. 21, 2019.

Long, Xiaoping, and Li, Ming, "Effect of Cu and Ni micro-nanocones interlayer on the growth of tin whisker," 2019 20th International Conference on Electronic Packaging Technology , Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Sun, Xiaowei, Li, Weiming, and Chen, Mingsheng, "Influence of the BGA solder joint microstructure on the thermal cycling reliability," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Wu, Liang, and Cobley, Andrew J., "Investigation into the effects of magnetic agitation and pulsed current on the development of SnCu alloy electrodeposits," Thin Solid Films, vol. 683, pp. 118-127, Aug. 1, 2019.

Hasn, S., Vavrik, D., Dusek, K., and Pichotka, M., "u-CT investigation of tin whisker growth mechanisms," 21st International Workshop on Radiation Imaging Detectors, Crete, Greece, July 7-12, 2019, pp. xx-xx.

Oudat, Osama A., Borra, Vamsi, Georgiev, Daniel G., and Karpov, Victor G., "Corrigendum: The statistics of tin whisker diameters versus the underlying film grains," Journal of Physics D: Applied Physics, vol. 52 no. 24, pp. 249501-1, June 12, 2019.

Niraula, Dipesh, Physics and applications of conductive filaments in electronic structures: from metal whiskers to solid state memory. Ph. D. Thesis for University of Toledo, Toldeo, OH, May 2019.

Illes, Balazs, Hurtony, Tamas, Krammer, Oliver, Batorfi, Reka, Medgyes, Balint, and Harsanyi, Gabor, "Early Stage Whisker Development from Sn Thin Film on Cu Substrate," 2019 42nd International Spring Seminar on Electronics Technology, Wroclaw, Poland, May 15-19, 2019, pp. xx-xx.

Crandall, Erika, "Metal Whisker Mitigation Strategies for Press-Fit Pin Connections," 10th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Villepinte, France, May 15-16, 2019, pp. xx-xx.

Pudas, Marko, Kutilainen, Terho, and Hokka, Jussi, "ALD Coatings Mitigate Tin Whiskers and Upgrade Environmental Durability of Electronic Circuit Boards," 10th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Villepinte, France, May 15-16, 2019, pp. xx-xx.

Wickham, Martin, Kent, Laura, Lewis, Adam, and Clayton, Kate, "New Results from National Physics Laboratory Whiskers Study - up to 5 years of testing," 10th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Villepinte, France, May 15-16, 2019, pp. xx-xx.

Illes, Balazs, Skwarek, Agata, Ratajczak, Jacek, Dusek, Karel, and Busek, David, "The influence of the crystallographic structure of the intermetallic grains on tin whisker growth," Journal of Alloys and Compounds, vol. 785, pp. 774-780, May 15, 2019.

Wu, Jie, Xue, Songbai, Wang, Jingwen, and Wu, Mingfang, "Coupling effects of rare-earth Pr and Al2O3 nanoparticles on the microstructure and properties of Sn-0.3Ag-0.7Cu low-Ag solder," Journal of Alloys and Compounds, vol. 784, pp. 471-487, May 5, 2019.

Oudat, Osama A., Borra, Vamsi, Georgiev, Daniel G., and Karpov, Victor G., "The statistics of tin whisker diameters versus the underlying film grains," Journal of Physics D: Applied Physics, vol. 52 no. 16, pp. 165305-1-165305-8, Apr. 17, 2019.

Hektor, Johan, Micha, Jean-Sebastien, Hall, Stephen A., Iyengar, Srinivasan, and Ristinmaa, Matti, "Long term evolution of microstructure and stress around tin whiskers investigated using scanning Laue microdiffraction," Acta Materialia , vol. 168, pp. 210-221, Apr. 15, 2019.

Hektor, Johan, Hall, Stephen A., Henningsson, N. Axel, Engqvist, Jonas, Ristinmaa, Matti, Lenrick, Filip, and Wright, Jonathan P., "Scanning 3DXRD Measurement of Grain Growth, Stress, and Formation of Cu6Sn5 around a Tin Whisker during Heat Treatment," Materials, vol. 12 no. 3, pp. 446-1-446-16, Feb. 2019.

Lasky, Ronald C., and Balch, Annaka, "Tin Whiskers 101: 2019," Pan Pacific Symposium 2019 Proceedings, Kauai, HI, Feb. 11-14, 2019, pp. xx-xx.

Lujan-Regalado, Irene, Kirubanandham, Antony, Williams, Jason J., and Chawla, Nikhilesh, "Nucleation and Growth of Tin Hillocks by In Situ Nanoindentation," Journal of Electronic Materials, vol. 48 no. 1, pp. 58-71, Jan. 2019.

Chason, Eric, Pei, Fei, Jain, Nupur, and Hitt, Andrew, "Studying the Effect of Grain Size on Whisker Nucleation and Growth Kinetics Using Thermal Strain," Journal of Electronic Materials, vol. 48 no. 1, pp. 17-24, Jan. 2019.

Chakraborty, Aritra, and Eisenlohr, Philip, "Chemo-thermo-mechanically Coupled Crystal Plasticity Simulation of Stress Evolution in Thermally Strained b-Sn Films," Journal of Electronic Materials, vol. 48 no. 1, pp. 85-91, Jan. 2019.

NASA Whisker Anecdotes, Jan. 17, 2019.

2018: 1 book, 5 theses, 24 papers, and 0 web pages on tin whiskers

Alagarsamy, Karthik, Kohani, Mehdi, Fortier, Aleksandra, and Pecht, Michael G., "Risk of Tin Whiskers in Medical Devices," Journal of Biomedical Engineering and Research, vol. 2 no. 101, pp. 1-10, 2018.

Dhiman, Rajat, Design and Qualification of a Robust Polyurethane Based Conformal Coating Process for SODIMMs. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2018.

Dong, Fei, Polyurethane-Based Conformal Coatings for Tin Whisker Mitigation. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2018.

Haspel, Dan, Developing a Dual-Layer System for the Mitigation of Tin Whiskers . Ph. D. Thesis for LOUGHBOROUGH University, Loughborough, United Kingdom, 2018.

Lin, Kwang-Lung, Solder Materials. London: World Scientific Publishing, 2018. ISBN 978-981-3237-60-5. $143.47 list price.

Mahim, Z., Salleh, M. A. A., and Khor, C. Y., "The Effects of Oxidation Layer, Temperature, and Stress on Tin Whisker Growth: A Short Review," Materials Science and Engineering, vol. 318, pp. 012063-1-012063-6, 2018.

Borra, Vamsi, Oudat, Osama, Georgiev, Daniel G., Karpov, Victor G., and Shvydka, Diana, "Metal whisker growth induced by localized, high-intensity DC electric fields," MRS Advances, vol. 3 no. 57-58, pp. 3367-3372, Nov. 2018. DOI: https://doi.org/10.1557/adv.2018.374

Bhassyvasantha, S., Fredj, N., Mahapatra, S. D., Jennings, W., Dutta, I., and Majumdar, B. S., "Whisker Mitigation Mechanisms in Indium-Doped Tin Thin Films: Role of the Surface," Journal of Electronic Materials, vol. 47 no. 10, pp. 6229-6240, Oct. 2018.

Timsitx, Roland S., "On the Melting of Ohmic-Heated Nanowires and Electrical Contacts," 2018 IEEE Holm Conference on Electrical Contacts, Albuquerque, NM, Oct. 14-18, 2018, pp. 373-380.

Jackson, Robert L., and Crandall, Erika R., "A Multiphysics Coupled Electro-thermo-mechanical Model of Whisker Shorting," 2018 IEEE Holm Conference on Electrical Contacts, Albuquerque, NM, Oct. 14-18, 2018, pp. 48-55.

Lasky, Ronald C., "Copper-Tin Intermetallics: Their Importance, Growth Rate, and Nature," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Jagtap, Piyush, Sethuraman, Vijay A., and Kumar, Praveen, "Critical Evaluation of Relative Importance of Stress and Stress Gradient in Whisker Growth in Sn Coatings," Journal of Electronic Materials, vol. 47 no. 9, pp. 5229-5242, Sept. 2018.

Hashim, Aimi Noorliyana, and Salleh, Mohd Arif Anuar Mohd, "Spontaneous Tin (Sn) Whisker Growth from Electroplated Tin and Lead-Free Tin Alloys Coatings: A Short Review," Solid State Phenomena, vol. 280, pp. 151-156, Aug. 2018.

Mahim, Z., Ismail, N. A., Salleh, M. A. A. Mohd, and Khor, C. Y., "The Effect of Temperature on Tin Whisker Growth under Mechanical Stress," Solid State Phenomena, vol. 280, pp. 194-199, Aug. 2018.

Mokhtar, N. Mohd, and Salleh, M. A. A. Mohd, "Sn Whiskers Nucleation and Growth - Short Review," Solid State Phenomena, vol. 280, pp. 175-180, Aug. 2018.

Tsukui, Tsutomu, Takeuchi, Yoshihiro, Ueshima, Minoru, Takenaka, Junichi, Takeuchi, Makoto, Sasaki, Kihichi, Kobayashi, Yoshikazu, and Sasabe, Toshiki, "Study on Whisker Growth on Solder Joints-Part I: Study on Acceleration Test Method," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 8 no. 8, pp. 1477-1486, Aug. 2018.

Jagtap, Piyush, Narayan, P. Ramesh, and Kumar, Praveen, "Effect of Substrate Composition on Whisker Growth in Sn Coatings," Journal of Electronic Materials, vol. 47 no. 7, pp. 4177-4189, July 2018.

Chakraborty, Aritra, and Eisenlohr, Philip, "A full-field crystal plasticity study on how texture and grain structure influences hydrostatic stress in thermally strained b-Sn films," Journal of Applied Physics, vol. 124 no. 2, pp. 025302-1-025302-8, July 14, 2018.

Delhaise, Andre M., Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, and Bagheri, Zohreh, "Evaluation of Tin Whisker Formation in Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage," International Conference for Electronics Enabling Technologies 2018 Proceedings, Markham, Ontario, Canada, June 5-7, 2018, pp. xx-xx.

Bhassyvasantha, Sherin, Mitigation of Tin Whiskers in Electroplated Tin Coatings by Effective Doping: The Role of Surface and Subsurface. Master's Thesis for New Mexico Institute of Mining and Technology, Socorro, NM, May 2018.

Borra, Vamsi, Georgiev, Daniel G., Karpov, V. G., and Shvydka, Diana, "Microscopic Structure of Metal Whiskers," Physical Review Applied , vol. 9 no. 5, pp. 054029-1-054029-9, May 2018.

Regalado, Irene Lujan, Characterization of Thermo-Mechanical Damage in Tin and Sintered Nano-Silver Solders. Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2018.

Panashchenko, Lyudmyla, "Tin Whisker Growth on Sn77.2-In20-Ag2.8 Solder," 2018 CMSE Components for Military & Space Electronics Training & Exhibition, Los Angeles, CA, May 7-10, 2018, pp. xx-xx.

Kuwano, Noriyuki, Lias, Marina binti, Nordin, Nur Azmah binti, Soejima, Youhei, and Nayan, Ahmad Rafiqan bin, "Preliminary Study on Deformation and Recrystallization Behavior of Pure Tin for Mitigation of Whisker Growth," Solid State Phenomena, vol. 273, pp. 107-111, Apr. 2018.

Zhang, Xiao, Yang, Yang, Xu, Fangfang, Li, Tie, and Wang, Yuelin, "In-situ TEM mechanical characterization of nanowire in atomic scale using MEMS device," Microsystem Technologies, vol. 24 no. 4, pp. 2045-2049, Apr. 2018.

Sun, Menglong, Dong, Mengya, Wang, Dongfan, Ling, Huiqin, Hu, An-min, and Li, Ming, "Growth behavior of tin whisker on SnAg microbump under compressive stress," Scripta Materialia, vol. 147, pp. 114-118, Apr. 1, 2018.

Wickham, Martin, "Tin Whiskers on PCBs," Printed Circuit Design and Fab/ Circuits Assembly, vol. 35 no. 4, pp. 89, Apr. 2018.

Hektor, Johan, Marijon, Jean-Baptiste, Ristinmaa, Matti, Hall, Stephen A., Hallberg, Hakan, Iyengar, Srinivasan, Micha, Jean-Sebastien, Robach, Odile, Grennerat, Fanny, and Castelnau, Olivier, "Evidence of 3D strain gradients associated with tin whisker growth," Scripta Materialia, vol. 144, pp. 1-4, Feb. 2018.

Huang, Chien-Ming, Nunez, Daniel, Coburn, James, and Pecht, Michael, "Risk of tin whiskers in the nuclear industry," Microelectronics Reliability, vol. 81, pp. 22-30, Feb. 2018.

Chason, Eric, Vasquez, Justin, Pei, Fei, Jain, Nupur, and Hitt, Andrew, "Quantifying the Effect of Stress on Sn Whisker Nucleation Kinetics," Journal of Electronic Materials, vol. 47 no. 1, pp. 103-109, Jan. 2018.

2017: 0 books, 5 theses, 45 papers, and 2 web pages on tin whiskers

Amin, N. L. M., Yusof, S. Z., Kahar, M. N. A., Bakar, T. A. A., O, A., and Fadil, N. A., "Tin Whiskers Formation and Growth on Immersion Sn Surface Finish under External Stresses by Bending," Materials Science and Engineering, vol. 238, pp. 012001-1-012001-5, 2017.

Illes, Balazs, Horvath, Barbara, Geczy, Attila, Krammer, Oliver, and Dusek, Karel, "Corrosion-induced tin whisker growth in electronic devices: a review," Soldering & Surface Mount Technology, vol. 29 no. 1, pp. 59-68, 2017.

Maganty, Suraj, Enhanced Conformal Coatings for Tin Whisker Mitigation. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2017.

Pandian, Guru Prasad, Effect of Long-term Aging on Lead-free Solder (SAC405) and Surface Finish (Pure Tin). Master's Thesis for University of Maryland, College Park, MD, 2017.

Starkey, Pete, "Tin Whisker mitigation methodologies," Transactions of the IMF, vol. 95 no. 4, pp. 180-182, 2017. https://doi.org/10.1080/00202967.2017.1283896

Wickham, Martin, Lewis, Adam, and Clayton, Kate, "1000 Days of Testing Tin Whiskering PCB Assemblies to Determine the Suitability of Conformal Coatings to Mitigate Against Shorting," SMTA Journal, vol. 30 no. 4, pp. 22-30, 2017.

Zhao, Heng, Liu, Qing-bin, Lan, Yuan-pei, Wang, Hua, and Yao, Da-wei, "The Application and Research Status of Tin Whisker Formation in Electric Usage," AIP Conference Proceedings, vol. 1839, pp. 020003-1-020003-10, 2017. https://doi.org/10.1063/1.4982368

Borra, Venkata Shesha Vamsi, Metal Whiskers: The Role of Electric Fields in the Formation Mechanism and Methods for Whisker Growth Mitigation. Ph. D. Thesis for University of Toledo, Toledo, OH, Dec. 2017.

Sun, Menglong, Long, Xiaoping, Dong, Mengya, Xia, Yuanyuan, Hu, Fengtian, Hu, An-min, and Li, Ming, "Mitigation of tin whisker growth by inserting Ni nanocones," Materials Characterization, vol. 134, pp. 354-361, Dec. 2017.

Wu, Jie, Xue, Songbai, Wang, Jingwen, and Wang, Jianxin, "Comparative studies on microelectronic reliability issue of Sn whisker growth in Sn-0.3Ag-0.7Cu-1Pr solder under different environments," Microelectronics Reliability, vol. 79, pp. 124-135, Dec. 2017.

Borra, Vamsi, Itapu, Srikanth, and Georgiev, Daniel G., "Sn whisker growth mitigation by using NiO sublayers," Journal of Physics D: Applied Physics, vol. 50 no. 47, pp. 475309-1-475309-7, Nov. 29, 2017.

Mahapatra, S. Das, and Dutta, I., "Role of surface oxide in mitigating tin whisker growth: A finite element study," Materials Science and Engineering: A, vol. 706, pp. 181-191, Oct. 26, 2017. https://doi.org/10.1016/j.msea.2017.09.006

He, Flora, Fung, Alex, Li, Crystal, Chan, Dennis, Yip, Derek, Yee, Dennis, Cao, Shuzhao, and Cao, Xi, "Studies of Tin Whisker Growth under High External Pressure," 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 25-27, 2017, pp. 102-106.

Borra, Vamsi, and Georgiev, Daniel G., "Part - 2: Whisker characterization," Tin Whisker Group teleconference, October 18, 2017.

Brusse, Jay, Metal whisker growing from the header/seal area of a package enclosure for a crystal, Youtube, Oct. 16, 2017.

Killefer, Morgan, Borra, Vamsi, Al-Bayati, Ahmed, Georgiev, Daniel G., Karpov, Victor G., Parsai, E. Ishmael, and Shvydka, Diana, "Whisker growth on Sn thin film accelerated under gamma-ray induced electric field," Journal of Physics D: Applied Physics, vol. 50 no. 40, pp. 405302-1-405302-7, Oct. 11, 2017.

Borra, Vamsi, and Georgiev, Daniel G., "Part - 1: Whisker characterization," Tin Whisker Group teleconference, October 11, 2017.

Chen, Yujie, An, Xianghai, and Liao, Xiaozhou, "Mechanical behaviors of nanowires," Applied Physics Reviews, vol. 4 no. 3, pp. 031104-1-031104-29, Sept. 2017. https://doi.org/10.1063/1.4989649

Lasky, Ronald C., Nash, Christopher, Hall, W. James, and Zarrow, Phil, "RoHS: How Has it Gone Eleven Years Later," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 833-842.

Wickham, Martin, Lewis, Adam, and Clayton, Kate, "1000 Days of Testing Tin Whiskering PCB Assemblies to Determine the Suitability of Conformal Coatings to Mitigate Against Shorting," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 1007-1014.

Yang, Fuqian, and Shi, Yu, "Analysis of whisker growth on a surface of revolution," Physics Letters A, vol. 381 no. 34, pp. 2767-2771, Sept. 12, 2017.

Hayashi, Yujiro, Setoyama, Daigo, and Seno, Yoshiki, "Scanning Three-Dimensional X-Ray Diffraction Microscopy with a High-Energy Microbeam at SPring-8," Materials Science Forum, vol. 905, pp. 157-164, Aug. 2017.

Killefer, Morgan, Whisker Growth Induced by Gamma Radiation on Glass Coated with Sn Thin Films. Master's Thesis for University of Toledo, Toledo, OH, Aug. 2017.

Jagtap, Piyush, Chakraborty, Aritra, Eisenlohr, Philip, and Kumar, Praveen, "Identification of whisker grain in Sn coatings by analyzing crystallographic micro-texture using electron back-scatter diffraction," Acta Materialia , vol. 134, pp. 346-359, Aug. 1, 2017.

Wu, Jie, Xue, Songbai, Wang, Jingwen, Wang, Jianxin, and Liu, Shuang, "Effect of Pr addition on properties and Sn whisker growth of Sn-0.3Ag-0.7Cu low-Ag solder for electronic packaging," Journal of Materials Science: Materials in Electronics, vol. 28 no. 14, pp. 10230-10244, July 2017.

Krammer, Oliver, Illes, Balazs, Batorfi, Reka, and Dusek, Karel, "Automatic characterisation method for statistical evaluation of tin whisker growth," Microelectronics Reliability, vol. 73, pp. 14-21, June 2017.

Hillman, David, "Characterization of the Capability of Conformal Coating to Inhibit Tin Whisker Growth," International Conference on Soldering & Reliability 2017 Proceedings, Toronto, Ontario, Canada, June 6-8, 2017, pp. xx-xx.

Mahapatra, S. Das, Majumdar, B. S., Dutta, I., and Bhassyvasantha, S., "Eliminating Whisker Growth by Indium Addition in Electroplated Sn on Copper Substrate," Journal of Electronic Materials, vol. 46 no. 7, pp. 4062-4075, July 2017.

Subedi, Biwas, Niraula, Dipesh, and Karpov, Victor G., "The stochastic growth of metal whiskers," Applied Physics Letters , vol. 110 no. 25, pp. 251604-1-251604-5, June 19, 2017.

Wickham, Martin, Gopee, Vimal, Lewis, Adam, Clayton, Kate, and Thomas, Owen, "Tin Whiskers Testing Using Conformal Coatings as a Mitigation," Tin Whisker Group teleconference, July 19, 2017.

Shvydka, Diana, Killefer, Morgan, Borra, Vamsi, Georgiev, Daniel G., Karpov, Victor G., and Parsai, E. Ishmael, "Whisker growth on Sn thin film accelerated under gamma-ray induced electric field,", Tin Whisker Group teleconference, July 12, 2017.

Karpov, Victor, "The stochastic growth of metal whiskers (presentation)," Tin Whisker Group teleconference, June 7, 2017.

Subedi, Biswas, Niraula, Dipesh, and Karpov, Victor G., "Stochastic growth of metal whiskers (Presentation)," Tin Whisker Group teleconference, June 7, 2017.

Subedi, Biswas, Niraula, Dipesh, and Karpov, Victor G., "The stochastic growth of metal whiskers (paper)," Tin Whisker Group teleconference, June 7, 2017.

Vallabhaneni, Venkata Sathya Sai Renuka, Environmental-Induced Damage in Tin (Sn) and Aluminum (Al) Alloys . Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2017.

Mahapatra, S. Das, Majumdar, B. S., and Dutta, I., "Elimination of Tin Whisker Growth by Indium Addition to Electroplated Tin in Electronic Packages," 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 30-June 2, 2017, pp. 1425-1432.

Ashworth, M. A., Pearson, H., Wilcox, G. D., Bao, X., and Brightwell, C., "The Development of a Tin-Whisker Mitigating Conformal Coating," 8th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Noordwijk, the Netherlands, May 10-12, 2017, pp. xx-xx.

Haspel, D. M., Ashworth, M. A., Wilcox, G. D., and Bao, X., "The Use of Post-Electroplating Surface Modification Treatments to Mitigate Tin Whisker Growth," 8th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Noordwijk, the Netherlands, May 10-12, 2017, pp. xx-xx.

Pudas, Marko, "Atomic Layer Deposition (ALD) for Tin Whisker Mitigation on Pb-free Surfaces (2015-2016)," 8th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Noordwijk, the Netherlands, May 10-12, 2017, pp. xx-xx.

Wickham, Martin, Lewis, Adam, Clayton, Kate, and Thomas, Owen, "1000 Days of Tin Whiskers Testing Using Conformal Coatings as a Mitigation," 8th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Noordwijk, the Netherlands, May 10-12, 2017, pp. xx-xx.

Gopee, Vimal, "UV Inspection and Thickness Measurement of Conformal Coatings," NPL Webinar, May 9, 2017.

Zhang, Zhihao, Cao, Huijun, Xiao, Yong, Cao, Yong, Li, Mingyu, and Yu, Yuxi, "Electromigration-induced growth mode transition of anodic Cu6Sn5 grains in Cu|SnAg3.0Cu0.5|Cu lap-type interconnects," Journal of Alloys and Compounds, vol. 703, pp. 1-9, May 5, 2017.

Pei, Fei, Buchovecky, Eric, Bower, Allan, and Chason, Eric, "Stress evolution and whisker growth during thermal cycling of Sn films: A comparison of analytical modeling and experiments," Acta Materialia , vol. 129, pp. 462-473, May 1, 2017.

Liu, Y., Zhang, P., Ling, C., Ding, J., Tian, W. B., Zhang, Y. M., and Sun, Z. M., "Spontaneous Sn whisker formation on Ti2SnC," Journal of Materials Science: Materials in Electronics, vol. 28 no. 8, pp. 5788-5795, Apr. 2017.

Bozack, Michael J., Snipes, Erica K., and Flowers, George T., "Influence of Small Weight Percentages of Bi and Systematic Coefficient of Thermal Expansion Variations on Sn Whiskering," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 7 no. 3, pp. 338-344, Mar. 2017.

Yin, Qiyue, Gao, Fan, Wang, Jirui, Gu, Zhiyong, Stach, Eric A., and Zhou, Guangwen, "Length-dependent melting behavior of Sn nanowires," Journal of Materials Research, vol. 32 no. 6, pp. 1194-1202, Mar. 2017.

Reducing tin whisker related failures in electronics, Youtube, Mar. 31, 2017.

Wu, L., Ashworth, M. A., and Wilcox, G. D., "Investigation of Whisker Growth from Alkaline Non-cyanide Zinc Electrodeposits," Journal of Electronic Materials, vol. 46 no. 2, pp. 1114-1127, Feb. 2017.

Sharma, Ashutosh, Das, Siddhartha, and Das, Karabi, "Effect of different electrolytes on the microstructure, corrosion and whisker growth of pulse plated tin coatings," Microelectronic Engineering , vol. 170, pp. 59-68, Feb. 25, 2017.

Illes, Balazs, Skwarek, Agata, Batorfi, Reka, Ratajczak, Jacek, Czerwinski, Andrzej, Krammer, Oliver, Medgyes, Balint, Horvath, Barbara, and Hurtony, Tamas, "Whisker growth from vacuum evaporated submicron Sn thin films," Surface and Coatings Technology, vol. 311, pp. 216-222, Feb. 15, 2017 https://doi.org/10.1016/j.surfcoat.2017.01.011

Zhao, L., Chakraborty, P., Tonks, M. R., and Szlufarska, I., "On the plastic driving force of grain boundary migration: A fully coupled phase field and crystal plasticity model," Computational Materials Science, vol. 128, pp. 320-330, Feb. 15, 2017.

Sellers, Keith M., "Got Whiskers?," Surface Mount Technology (SMT), vol. 32 no. 1, pp. 92,94, Jan. 2017.

2016: 2 books, 2 theses, 62 papers, and 1 web page on tin whiskers

Ashworth, Mark Andrew, and Dunn, Barrie, "An investigation of tin whisker growth over a 32-year period," Circuit World, vol. 42 no. 4, pp. 183-196, 2016.

Dunn, Barrie D., Materials and Processes for Spacecraft and High Reliability Applications . Chichester, United Kingdom: Springer, 2016. ISBN 978-3-319-79474-7. $154.26 list price.

Harpaintner, Alfons, "Whisker Growth and Mitigation," Wurth Elektronik White Paper WPP001, 2016.

Kato, Takahiko, Handwerker, Carol A., and Bath, Jasbir, Mitigating Tin Whisker Risks: Theory and Practice. Hoboken, NJ: IEEE Press, 2016. ISBN 9780470907238.

Kosiba, Eva, Characterization of Low Melting Temperature, Low-Ag, Bi-Containing, Pb-Free Solder Alloys. Master's Thesis for University of Toronto, Toronto, Canada, 2016.

Li, M. Y., Yang, H. F., Zhang, Z. H., Gu, J. H., and Yang, S. H., "Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention," Scientific Reports, vol. 6, pp. 27522-1-27522-10, 2016. https://doi-org.ezproxy.uky.edu/10.1038/srep27522

Mahan, Kenneth Howard, Advanced Adhesion Strength Testing Methods of Thin Film Multilayers in Electronic Packaging Systems. Ph. D. Thesis for University of Maryland, College Park, MD, 2016.

Misner, Bruce M., "Validated Solder Coverage for Tin Whisker Mitigation of 0402 Ceramic Capacitors: An Exercise in Technically Sound Cost Reduction," SMTA Journal, vol. 29 no. 3, pp. 25-29, 2016.

Elnyakov, Dmitry, Kalmykov, Konstantin, Tarelkin, Sergey, and Dunaev, Sergey, "Isothermal sections of Tm-Ag-Sn and Lu-Ag-Sn ternary systems at 873 K," Journal of Alloys and Compounds, vol. 688 pt. B, pp. 828-839, Dec. 15, 2016.

Sanchez-Soares, Alfonso, and Greer, James C., "A Semimetal Nanowire Rectifier: Balancing Quantum Confinement and Surface Electronegativity," Nano letters, vol. 16 no. 12, pp. 7639-7644, Dec. 14, 2016. DOI: 10.1021/acs.nanolett.6b03612

Yang, Fuqian, "A Nonlinear Viscous Model for Sn-Whisker Growth," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 47 no. 12, pp. 5882-5889, Dec. 2016. https://doi.org/10.1007/s11661-016-3530-7

Chen, Wei-Hsun, Sarobol, Pylin, Handwerker, Carol A., and Blendell, John E., "Heterogeneous Stress Relaxation Processes at Grain Boundaries in High-Sn Solder Films: Effects of Sn Anisotropy and Grain Geometry During Thermal Cycling," JOM, vol. 68 no. 11, pp. 2888-2899, Nov. 2016.

Jagtap, Piyush, and Kumar, Praveen, "Macro and Micro-Texture Study for Understanding Whisker Growth in Sn Coatings," 2016 IEEE 18th Electronics Packaging Technology Conference , Singapore, Nov. 30-Dec. 3, 2016, pp. 165-170.

Hwang, Jennie S., "The Theory Behind Tin Whisker Phenomena, Part 5," Surface Mount Technology (SMT), vol. 31 no. 11, pp. 12,14, Nov. 2016.

Xue, Weihuang, and Gu, Wenhua, "Conductivity size effect of polycrystalline metal nanowires," AIP Advances, vol. 6 no. 11, pp. 115001-1-115001-8, Nov. 2016.

Bhatia, M. A., Adlakha, I., Lu, G., and Solanki, K. N., "Generalized stacking fault energies and slip in b-tin," Scripta Materialia, vol. 123, pp. 21-25, Oct. 2016.

Bozack, M. J., Snipes, S. K., and Flowers, G. N., "Methods for fast, reliable growth of Sn whiskers," Surface Science , vol. 652, pp. 355-366, Oct. 2016. https://doi.org/10.1016/j.susc.2016.01.010

Hwang, Jennie S., "The Theory Behind Tin Whisker Phenomena, Part 4," Surface Mount Technology (SMT), vol. 31 no. 9, pp. 12,14,16, Sept. 2016.

Pinsky, David, Hester, Tom, Touw, Anduin, and Hillman, Dave, "Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin," Surface Mount Technology (SMT), vol. 31 no. 9, pp. 36,38-42,44-45, Sept. 2016.

Zhang, Liang, Yang, Fan, and Zhong, Su-juan, "Effect of Nd on whiskers growth behavior of SnAgCu solders in electronic packaging," Journal of Materials Science: Materials in Electronics , vol. 27 no. 9, pp. 9584-9588, Sept. 2016.

Rafanelli, Anthony J., "Living With Pb-Free in High Performance Engineering Design," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 407-412.

Ansari, Lida, Fagas, Giorgos, and Greer, James C., "Strain induced effects on electronic structure of semi-metallic and semiconducting tin nanowires," Applied Physics Letters, vol. 105 no. 12, pp. 123105-1-123105-4, Sept. 22, 2016.

McKeown, S., Meschter, S., Snugovsky, P., Kennedy, J., Bagheri, Z., Keeping, J., Cho, J., Edwards, D., and Elsken, K., "Strategic Environmental Research and Development Program (SERDP) Nanoparticle enhanced conformal coating project: Coating modeling for tin whisker mitigation," Tin Whisker Group teleconference, Sept. 7, 2016.

Liu, Y., Zhang, P., Zhang, Y. M., Ding, J., Shi, J. J., and Sun, Z. M., "Spontaneous growth of Sn whiskers and a new formation mechanism," Materials Letters, vol. 178, pp. 111-114, Sept. 1, 2016.

Meschter, Stephan, "Enabling Lead-free in the DoD through Risk Mitigation: Program Management and Systems Engineering Overview," Tin Whisker Group teleconference, Aug. 24, 2016.

Philippi, Bastian, Kirchlechner, Christoph, Micha, Jean Sebastien, and Dehm, Gerhard, "Size and orientation dependent mechanical behavior of body-centered tetragonal Sn at 0.6 of the melting temperature," Acta Materialia , vol. 115, pp. 76-82, Aug. 15, 2016.

Pecht, Michael, Shibutani, Tadahiro, and Wu, Lifeng, "A reliability assessment guide for the transition planning to lead-free electronics for companies whose products are RoHS exempted or excluded," Microelectronics Reliability, vol. 62, pp. 113-123, July 2016.

Wickham, Martin, Thomas, Owen, Clayton, Kate, Lewis, Adam, and Hunt, Chris, "How Good Are Conformal Coatings at Preventing Sn Whisker Failures?," National Physical Laboratory, July 20, 2016.

Zhang, Liang, Yang, Fan, and Zhong, Su-juan, "Whisker growth on SnAgCu-xPr solders in electronic packaging," Journal of Materials Science: Materials in Electronics, vol. 27 no. 6, pp. 5618-5621, June 2016.

Landman, Bob, Davy, Gordon, and Fritz, Dennis, "Preventing Tin Whisker Growth Risk," Tin Whisker Group teleconference, June 15, 2016.

Tsujimoto, Masanobu, Hashimoto, Shigeo, Kiso, Masayuki, Ikumoto, Raihei, Kano, Toshikazu, Kanamori, Genki, Gudeczauskas, Don, and Gruenwald, Al, "The Elimination of Whiskers from Electroplated Tin, NASF SURFIN 2016, Las Vegas, NV, June 6, 2016, pp. xx-xx.

Banerjee, S., Dutta, I., and Majumdar, B. S., "A molecular dynamics evaluation of the effect of dopant addition on grain boundary diffusion in tin: Implication for whisker growth," Materials Science and Engineering: A, vol. 666, pp. 191-198, June 1, 2016.

Smith, Steve, "Tin whisker captivation by the Whisker-Tough Magnum(TM) conformal coating," Tin Whisker Group teleconference, June 1, 2016.

Rollins, Bill, "Engineering Requirements for a Tin-Whisker-Risk-Controlling Conformal Coating to be used in a Missile," Tin Whisker Group teleconference, June 1, 2016.

Fortier, Aleksandra, Kong, Fanrong, and Kovacevic, Radovan, "Fundamental FEM Modeling Approach of Residual Stress Propagation in Sn-Based Electroplated Films Prone to Sn Whiskers Growth," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 6 no. 5, pp. 805-813, May 2016.

Busek, David, Vavra, Jan, and Dusek, Karel, "Whisker growth and its dependence on substrate type and applied stress," 2016 39th International Spring Seminar on Electronics Technology, Pilsen, Czech Republic, May 18-22, 2016, pp. 263-266.

Illes, Balazs, Skwarek, Agata, Krammer, Oliver, Medgyes, Balint, Horvath, Barbara, and Batorfi, Reka, "Tin Whisker Growth from Tin Thin Film," 2016 39th International Spring Seminar on Electronics Technology, Pilsen, Czech Republic, May 18-22, 2016, pp. 173-178.

Stoyanov, Stoyan, Stewart, Paul, and Bailey, Chris, "Vulnerability Study of Hot Solder Dipped COTS Components," 2016 39th International Spring Seminar on Electronics Technology, Pilsen, Czech Republic, May 18-22, 2016, pp. 193-198.

Pinsky, David, Hester, Tom, Touw, Anduin, and Hillman, Dave, "Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow." Tin Whisker Group teleconference, May 18, 2016.

Dutta, Indranath, and Majumdar, Bhaskar, "Rationale for the Auger Studies," Tin Whisker Group teleconference, May 11, 2016.

Mahapatra, S. Das, Meinshausen, L., Bhassyvasantha, S., Yang, H., Banerjee, S., Majumdar, B. S., and Dutta, I., "Influence of Indium Addition on Whisker Growth in Electroplated Tin," Tin Whisker Group teleconference, May 11, 2016.

Meschter, S., Cho, J., Maganty, S., Edwards, D., Romansky, M., Keeping, J., Snugovsky, P., McMahon, J., Bagheri, Zohreh, and Kennedy, J., "Strategic Environmental Research and Development Program (SERDP) Layered Nanoparticle Enhanced Conformal Coating for Whisker Mitigation," International Conference on Soldering & Reliability 2016 Proceedings , Toronto, Ontario, Canada, May 9-11, 2016, pp. xx-xx.

Snugovsky, Polina, Meschter, Stephan, Kennedy, Jeff, and Bagheri, Zohreh, "REMAP Materials Project M2: High Temperature High Humidity Corrosion and Tin Whisker Evaluation of Bi Containing Lead-Free Alloys," International Conference on Soldering & Reliability 2016 Proceedings, Toronto, Ontario, Canada, May 9-11, 2016, pp. xx-xx.

Janata, Jiri, "The Chalkboard: Work Function in Electrochemistry," Electrochemical Society Interface, vol. 25 no. 4, pp. 56-58, Winter 2016.

Chen, Hao, Lee, Hsin Yi, Ku, Ching Shun, and Wu, Albert T., "Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures," Journal of Materials Science, vol. 51 no. 7, pp. 3600-3606, Apr. 2016.

Kim, Sang Hoon, Hui, Kwun Nam, Kim, Yong-Jin, Lim, Tae-Soo, Yang, Dong-Yeol, Kim, Ki Bong, Kim, Young Ja, and Yang, Sangsun, "Oxidation resistant effects of Ag2S in Sn-Ag-Al solder: A mechanism for higher electrical conductivity and less whisker growth," Corrosion Science, vol. 105, pp. 25-35, Apr. 2016.

Xue, Peng, Wang, Ke-Hong, Zhou, Qi, Huang, Jun, Long, Wei-min, and Zhang, Qing-ke, "Effect of Nd on tin whisker growth in Sn-Zn soldered joint," Journal of Materials Science: Materials in Electronics, vol. 27 no. 4, pp. 3742-3747, Apr. 2016.

Anderson, Antony F., "Case Study: NHTSA's Denial of Dr Raghavan's Petition to Investigate Sudden Acceleration in Toyota Vehicles Fitted With Electronic Throttles," IEEE Access, Apr. 21, 2016.

Iwamoto, Hiroyuki, Munekata, Osamu, and Tsuruta, Kaichi, "Study on the Mitigation Solder of the External Stress Type Whisker," 2016 International Conference on Electronics Packaging, Hokkaido, Japan, Apr. 20-22, 2016, pp. 333-336.

Hektor, Johan, Ristinmaa, Matti, Hallberg, Hakan, Hall, Stephen A., and Iyengar, Srinivasan, "Coupled diffusion-deformation multiphase field model for elastoplastic materials applied to the growth of Cu6Sn5," Acta Materialia, vol. 108, pp. 98-109, Apr. 15, 2016.

Haspel, Dan, Ashworth, Mark, Wilcox, Geoff, and Mortimer, Roger, "The Development of Post-Electroplating Surface Modification Treatments to Mitigate Tin Whisker Growth," 7th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Portsmouth, United Kingdom, Apr. 13-14, 2016, pp. xx-xx.

Pinsky, David, Hester, Tom, Touw, Anduin, and Hillman, Dave, "Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin," 7th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Portsmouth, United Kingdom, Apr. 13-14, 2016, pp. xx-xx.

Pudas, Marko, Kutilainen, Terho, Collander, Paul, Wang, Jing, Ashworth, Mark A., Wilcox, Geoffrey D., and Hokka, Jussi, "Atomic Layer Deposition (ALD) for Tin Whisker Mitigation on Pb-free Surfaces," 7th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Portsmouth, United Kingdom, Apr. 13-14, 2016, pp. xx-xx.

Bhattacharya, Sumit, Sharma, Ashutosh, Das, Siddhartha, and Das, Karabi, "Synthesis and Properties of Pulse Electrodeposited Lead-Free Tin-Based Sn/ZrSiO4 Nanocomposite Coatings," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 47 no. 3, pp. 1292-1312, Mar. 2016. https://doi.org/10.1007/s11661-015-3313-6

Pei, Fei, Jadhav, Nitin, Buchovecky, Eric, Bower, Allan F., Chason, Eric, Liu, Wenjun, Tischler, Jonathan Z., Ice, Gene E., and Xu, Ruqing, "In-situ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation," Journal of Applied Physics, vol. 119 no. 10, pp. 105302-1-105302-11, Mar. 14, 2016.

Wang, Fei, and Nestler, Britta, "Detachment of nanowires driven by capillarity," Scripta Materialia , vol. 113, pp. 167-170, Mar. 1, 2016.

Borra, Vamsi, Georgiev, Daniel G., and Karpov, Victor G., "Cultivating Metal Whiskers by Surface Plasmon Polariton Excitation," MRS Advances, vol. 1 no. 12, pp. 805-810, Feb. 2016. https://doi.org/10.1557/adv.2016.160

Shvydka, Diana, and Karpov, V. G., "Surface parameters determining a metal propensity for whiskers," Journal of Applied Physics, vol. 119 no. 8, pp. 085301-1-085301-8, Feb. 28, 2016.

Walsh, F. C., and Low, C. T. J., "A review of developments in the electrodeposition of tin," Surface and Coatings Technology, vol. 288, pp. 79-94, Feb. 25, 2016. https://doi.org/10.1016/j.surfcoat.2015.12.081

Ma, Limin, Zuo, Yong, Liu, Sihan, Guo, Fu, Lee, Andre, and Subramanian, K. N., "Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders," Journal of Alloys and Compounds, vol. 657, pp. 400-407, Feb. 5, 2016.

Ma, Limin, Zuo, Yong, Liu, Sihan, and Guo, Fu, "Whisker Growth Behavior of Sn58Bi Solder Coatings Under Isothermal Aging," Journal of Electronic Materials, vol. 45 no. 1, pp. 44-50, Jan. 2016.

Meinshausen, L., Bhassyvasantha, S., Majumdar, B. S., and Dutta, I., "Influence of Indium Addition on Whisker Mitigation in Electroplated Tin Coatings on Copper Substrates," Journal of Electronic Materials, vol. 45 no. 1, pp. 791-801, Jan. 2016.

Pei, Fei, Bower, Allan F., and Chason, Eric, "Quantifying the Rates of Sn Whisker Growth and Plastic Strain Relaxation Using Thermally-Induced Stress," Journal of Electronic Materials, vol. 45 no. 1, pp. 21-29, Jan. 2016.

Zhu, Yong, "In Situ Nanomechanical Testing of Crystalline Nanowires in Electron Microscopes," JOM, vol. 68 no. 1, pp. 84-93, Jan. 2016.

NASA Other Metal Whiskers, Jan. 4, 2016.

2015: 0 books, 2 theses, 78 papers, and 8 web pages on tin whiskers

Haspel, D. M., Ashworth, M. A., Wu, L., Wilcox, G. D., and Mortimer, R. J., "Tin whisker mitigation by means of a post-electroplating electrochemical oxidation treatment," Transactions of the IMF, vol. 93 no. 6, pp. 332-341, 2015. https://doi.org/10.1080/00202967.2015.1117258

Hom, Bance, and Winkler, Sandra, "History repeats itself in the form of matte tin," Advanced Packaging, vol. xx no. xx, pp. xx-xx, ??. (2015)

Janiuk, Szymon, Tin Whisker Growth and Mitigation with a Nanocrysytalline Nickel Coating . Master's Thesis for University of Toronto, Toronto, Ontario, Canada, 2015.

Lim, Hooi Peng, Ourdjini, Ali, Bakar, Tuty Asma Abu, and Tesfamichael, Tuquabo, "The effects of humidity on tin whisker growth by immersion tin plating and tin solder dipping surface finishes," Procedia Manufacturing, vol. 2, pp. 275-279, 2015. https://doi.org/10.1016/j.promfg.2015.07.048

McKeown, Stephen A., Meschter, Stephan J., Snugovsky, Polina, and Kennedy, Jeffery, "SERDP Tin Whisker Testing and Modeling: Simplified Whisker Risk Model Development," SMTA Journal, vol. 28 no. 1, pp. 13-29, 2015.

Tokio, Kanae, "Sn Plating to Replace Sn-Pb Plating," Journal of The Surface Finishing Society of Japan, vol. 66 no. 5, pp. 191-194, 2015.

Zhang, P., Zhang, Y. M., and Sun, Z. M., "Spontaneous Growth of Metal Whiskers on Surfaces of Solids: A Review," Journal of Materials Science and Technology, vol. 31 no. 7, pp. 675-698, 2015. DOI: 10.1016/j.jmst.2015.04.001

Vasko, Anthony C., Grice, Corey R., Kostic, Andrew D., and Karpov, Victor G., "Evidence of electric-field-accelerated growth of tin whiskers," MRS Communications, vol. 5 no. 4, pp. 619-622, Dec. 2015.

Vianco, P. T., and Neilsen, M. K., "Dynamic Recrystallization Model for Whisker and Hillock Growth," Sandia Report SAND2015-9335J, 2015.

Vianco, P. T., and Neilsen, M. K., "Dynamic Recrystallization Model for Whisker and Hillock Growth," Sandia Report SAND2015-6236J, 2015.

Eckold, P., Sellers, M. S., Niewa, R., and Hugel, W., "The surface energies of b-Sn - A new concept for corrosion and whisker mitigation," Microelectronics Reliability, vol. 55 no. 12 pt. B, pp. 2799-2807, Dec. 2015.

Hillman, Dave, Wilcoxon, Ross, Lower, Nate, and Grossman, Dan, "Alkali Silicate Glass Coatings for Mitigating the Risks of Tin Whiskers," Journal of Electronic Materials, vol. 44 no. 12, pp. 4864-4883, Dec. 2015.

Chen, Jie Shi, Ye, Cheng Hui, Chen, Jun Mei, Xu, Ji Jin, Yu, Chun, and Lu, Hao, "Sn whiskers mitigation by refining grains of Cu substrate during the room temperature exposure," Materials Letters, vol. 161, pp. 201-204, Dec. 15, 2015.

Chason, Eric, and Pei, Fei, "Sn whisker formation as a stress-induced nucleation and growth process," Tin Whisker Group teleconference, Dec. 9, 2015.

Hwang, Jennie S., "A Look at the Theory behind Tin Whisker Phenomena, Part 3," Surface Mount Technology (SMT), vol. 30 no. 11, pp. 12,14-15, Nov. 2015.

Rohwer, Lauren E. S., and Martin, James E., "Platelet Composite Coatings for Tin Whisker Mitigation," Journal of Electronic Materials, vol. 44 no. 11, pp. 4424-4433, Nov. 2015. (Sandia Report SAND2015-8335J)

Niraula, D., and Karpov, V. G., "The probabilistic distribution of metal whisker lengths," Journal of Applied Physics, vol. 118 no. 20, pp. 205301-1-205301-5, Nov. 28, 2015.

Soviet ILS teardown with a tin whiskers surprise, Youtube, Nov. 27, 2015.

"What are Tin Whiskers?." (before Nov. 22, 2015)

"What Are Tin Whiskers?" (before Nov. 22, 2015)

Sn Whisker (before Nov. 14, 2015)

Whisker growth over a 12 minute period (before Nov. 14, 2015)

Whisker growth over a 19 minute period (before Nov. 14, 2015)

Karpov, Victor, "Verifying the electrostatic theory of whiskers," Tin Whisker Group teleconference, Nov. 11, 2015.

Chiu, Yi-Hsin, Minutillo, Nicholas G., Williams, Robert E. A., Smith, Greg J., McComb, David W., Carlin, John A., Johnston-Halperin, Ezekiel, and Yang, Fengyuan, "Photoluminescence evolution in GaAs/AlGaAs core/shell nanowires grown by MOCVD: Effects of core growth temperature and substrate orientation," Journal of Crystal Growth, vol. 429, pp. 1-5, Nov. 1, 2015.

Chang, Jaewon, Kang, Sung K., Lee, Jae-Ho, Kim, Keun-Soo, and Lee, Hyuck Mo, "Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed Sn Films," Journal of Electronic Materials, vol. 44 no. 10, pp. 3486-3499, Oct. 2015.

Chason, Eric, and Pei, Fei, "Measuring the Stress Dependence of Nucleation and Growth Processes in Sn Whisker Formation," JOM, vol. 67 no. 10, pp. 2416-2424, Oct. 2015.

Illes, Balazs, Hurtony, Tamas, and Medgyes, Balint, "Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys," Corrosion Science, vol. 99, pp. 313-319, Oct. 2015.

Vianco, P. T., Neilsen, M. K., Rejent, J. A., and Grant, R. P., "Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth on Sn Thin Films," Journal of Electronic Materials , vol. 44 no. 10, pp. 4012-4034, Oct. 2015.

Chason, Eric, and Pei, Fei, "Sn whisker formation as a stress-induced nucleation and growth process," The Latest Findings on Tin Whiskers in Electronics Webinar, Oct. 29, 2015, pp. xx-xx.

Handwerker, Carol, Blendell, John, Wang, Ying, Chen, Wei-Hsun, Sarobol, Pylin, Koppes, John, Pedigo, Aaron, Yoo, Byung-Gil, Phillipi, Bastian, Kraft, Oliver, Dehm, Gerhard, Williams, Maureen, Chatain, Dominique, and Curriotto, Stephano, "Stress Relaxation in Tin Films: Whisker Nucleation and Growth," The Latest Findings on Tin Whiskers in Electronics Webinar, Oct. 29, 2015, pp. xx-xx.

Osterman, Michael, "Tin Whisker Mitigation," The Latest Findings on Tin Whiskers in Electronics Webinar, Oct. 29, 2015, pp. xx-xx.

Snugovsky, Polina, "Issues and Whisker Mitigation for those Using SAC Solder and Tin Surface Finishes," The Latest Findings on Tin Whiskers in Electronics Webinar, Oct. 29, 2015, pp. xx-xx.

Batorfi, Reka, Illes, Balazs, and Krammer, Oliver, "Whisker Formation from SnAgCu Alloys and Tin Platings - Review on the Latest Results," 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging, Brasov, Romania, Oct. 22-25, 2015, pp. 373-376.

McCulloch, J., Niraula, D., Grice, C. R., Warrell, G., Vasko, A., Irving, R., Georgiev, D., Borra, V., Karpov, V. G., Parsai, E. I., and Shvydka, D., "Electric field stimulated growth of Zn and Sn whiskers," Tin Whisker Group teleconference, Oct. 21, 2015.

Snipes, E. K., Flowers, G. T., Lall, P., and Bozack, M. J., "Influence on Sn Whiskering of Controlled Bismuth Additions to Sputtered Sn Films," 2015 IEEE 61st Holm Conference on Electrical Contacts, San Diego, CA, Oct. 11-14, 2015, pp. 54-58.

Video showing Tin Whiskers, Youtube Oct, 5, 2015.

Vasko, A. C., Warrell, G. R., Parsai, E. I., Karpov, V. G., and Shvydka, Diana, "Electron beam induced growth of tin whiskers," Journal of Applied Physics, vol. 118 no. 12, pp. 125301-1-125301-5, Sept. 28, 2015.

McKeown, S., Meschter, S., Snugovsky, P., Kennedy, J., Bagheri, Z., Keeping, J., Cho, J., Edwards, D., and Elsken, K., "Strategic Environmental Research and Development Program (SERDP) Nanoparticle enhanced conformal coating project: Coating modeling for tin whisker mitigation," Proceedings of SMTA International, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 695-710.

McKeown, S., Meschter, S., Snugovsky, P., Kennedy, J., Bagheri, Z., Keeping, J., Cho, J., Edwards, D., and Elsken, K., "Strategic Environmental Research and Development Program (SERDP) Nanoparticle Enhanced Conformal Coating Project: Coating Modeling For Tin Whisker Mitigation (Presentation)," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 695-710.

Stoyanov, S., and Bailey, C., "Modelling the impact of refinishing processes on COTS components for use in aerospace applications," Microelectronics Reliability, vol. 55 no. 9-10, pp. 1271-1279, Aug.-Sept. 2015.

Hester, Thomas, and Pinsky, David, "Tin Whisker Self-Mitigation in Surface Mount Components Attached with Leaded Solder Alloys," Surface Mount Technology (SMT), pp. 70,72-74,76-78,80 Sept. 2015.

Liu, Ting, Ding, Dongyan, Hu, Yu, and Gong, Yihua, "Tin whisker growth on electroplated Sn multilayers," Journal of Materials Science: Materials in Electronics, vol. 26 no. 9, pp. 6411-6418, Sept. 2015.

Cho, Junghyun, Maganty, Suraj, and Meschter, Stephan J., "Innovating the Microstructure of Polyurethane Conformal Coatings for Tin Whisker Mitigation," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 718-725.

Maalekian, Mehran, Xu, Yuan, and Seelig, Karl, "Effect of Bi Content on Properties of Low Silver SAC Solders," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 191-198.

Thomas, Owen, Hunt, Chris, Wickham, Martin, and Clayton, Kate, "Long Term Monitoring and Failure Detection of Tin Whiskers Bridging Adjacent Leads on SOIC Components," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 711-717.

Gullapalli, Vikranth, Study of Metal Whiskers Growth and Mitigation Technique using Additive Manufacturing. Master's Thesis for University of North Texas, Denton, TX, Aug. 2015.

Kuwano, Noriyuki, Horikami, Sadanori, and Linas, Marina, "Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers," Materials Science Forum, vol. 827, pp. 341-346, Aug. 2015.

Zhang, Liang, Sun, Lei, Han, Ji-guang, and Guo, Yong-huan, "Sizes effect of CeSn3 on the whiskers growth of SnAgCuCe solder joints in electronic packaging," Journal of Materials Science: Materials in Electronics, vol. 26 no. 8, pp. 6194-6197, Aug. 2015.

Rohwer, Lauren, "Tin Whisker Mitigation," 2015 Joint Munitions Technical Advisory Committee Meeting, Lawrence Livermore National Laboratory, Aug. 18-20, 2015, pp. xx-xx. (Sandia Report SAND2015-6765PE)

Yao, Z. X., Yin, L. M., Wang, G., Tian, X. K., and Yao, Z. Y., "The effect of current stressing and external loading on the growth of tin whiskers," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 734-736.

Hwang, Jennie S., "The Theory Behind Tin Whisker Phenomena, Part 2," Surface Mount Technology, vol. 30 no. 7, pp. 8,10-11, July 2015.

Meschter, Stephan J., Snugovsky, Polina, Kennedy, Jeffery, Bagheri, Zohreh, and Kosiba, Eva, "Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Thermal Cycling Testing," SMTA Journal, vol. 28 no. 2, pp. 15-35, June 2015.

Sakakida, Tomomi, Kubouchi, Tatsuo, Miyano, Yasuyuki, Takahashi, Mamoru, and Kamiya, Osamu, "Effect of Environment on Sn Whisker Growth during Welding of Electronic Wires," Advanced Materials Research, vol. 1110, pp. 235-240, June 2015.

Shvydka, D., Warrell, G., Parsai, E., Karpov, V., and Vasko, A., "SU-E-T-447: Growth of Metal Whiskers Under External Beam Irradiation: Experimental Evidence and Implications in Medical Electronic Devices for Radiation Therapy Treatments," Medical Physics, vol. 42 no. 6 part 19, pp. 3437, June 2015.

Karpov, V. G., "Understanding the movements of metal whiskers," Journal of Applied Physics, vol. 117 no. 23, pp. 235303-1-235303-11, June 21, 2015.

Cai, Huacheng, Wang, Wendong, Liu, Peiwen, Wang, Guangming, Liu, Ankang, He, Zhe, Cheng, Zhaofang, Zhang, Shengli, and Xia, Minggang, "Enhanced synthesis of Sn nanowires with aid of Se atom via physical vapor transport," Journal of Crystal Growth, vol. 420, pp. 42-46, June 15, 2015.

Al-Salman, Rihab, Sommer, Heino, Brezesinski, Torsten, and Janek, Jurgen, "Template-Free Electrochemical Synthesis of High Aspect Ratio Sn Nanowires in Ionic Liquids: A General Route to Large-Area Metal and Semimetal Nanowire Arrays?," Chemistry of Materials, vol. 27 no. 11, pp. 3830-3837, June 9, 2015.

Huang, Lin, Jian, Wei, Lin, Bing, Wen, Yuren, Gu, Lin, and Wang, Jiangyong, "Thermodynamic understanding of Sn whisker growth on the Cu surface in Cu(top)-Sn(bottom) bilayer system upon room temperature aging," Journal of Applied Physics, vol. 117 no. 21, pp. 215308-1-215308-8, June 7, 2015.

Jahedi, Mohammad, Ardeljan, Milan, Beyerlein, Irene J., Paydar, Mohammad Hossein, and Knezevic, Marko, "Enhancement of orientation gradients during simple shear deformation by application of simple compression," Journal of Applied Physics, vol. 117 no. 21, pp. 214309-1-214309-11, June 7, 2015.

Hwang, Jennie, "The Theory Behind Tin Whisker Phenomena, Part 1," Surface Mount Technology (SMT), vol. 30 no. 5, pp. 8,10-11, May 2015.

Zhang, Junxiong, Xue, Songbai, Xue, Peng, and Liu, Shuang, "Thermodynamic reaction mechanism of the intermetallic compounds of SnxNdy and GaxNdy in soldered joint of Sn-9Zn-1Ga-0.5Nd," Journal of Materials Science: Materials in Electronics, vol. 26 no. 5, pp. 3064-3068, May 2015.

Meschter, Stephan, Ekstrom, Evan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and Kosiba, Eva, "Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Long Term Low Temperature High Humidity Testing," International Conference on Soldering & Reliability 2015 Proceedings , Toronto, Ontario, Canada, May 19-21, 2015, pp. xx-xx.

Illes, Balazs, and Fehervari, Norbert, "Relation Between Tin Whiskering Ability Sn/Ag/Cu Solder Alloys and Current Load," 2015 38th International Spring Seminar on Electronics Technology , Eger, Hungary, May 6-10, 2015, pp. 173-178.

Doudrick, Kyle, Chinn, Jeff, Williams, Jason, Chawla, Nikhilesh, and Rykaczewski, Konrad, "Rapid method for testing efficacy of nano-engineered coatings for mitigating tin whisker growth," Microelectronics Reliability, vol. 55 no. 5, pp. 832-837, Apr. 2015.

He, A., and Ivey, D. G., "Microstructural study of Sn films electrodeposited on Cu substrates: Sn whiskers and Cu6Sn5 precipitates," Journal of Materials Science, vol. 50 no. 7, pp. 2944-2959, Apr. 2015.

Jagtap, Piyush, and Kumar, Praveen, "Manipulating Crystallographic Texture of Sn Coatings by Optimization of Electrodeposition Process Conditions to Suppress Growth of Whiskers," Journal of Electronic Materials, vol. 44 no. 4, pp. 1206-1219, Apr. 2015.

Karpov, V. G., "Understanding the movements of metal whiskers (paper)," Tin Whisker Group teleconference, Apr. 8 & 15, 2015.

Mairen, Dimas Jesus Morilla, "Tin Whisker Growth on Surface Mount Devices: A Study Using Standarized Test Conditions," 6th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Oberpfaffenhofen, Germany, Apr. 15-16, 2015, pp. xx-xx.

Tyler, Don, and Dennehy, Charley, "Reliability of Ball Grid Arrays Converted from Pb-free to Tin-Lead by Robotic Hot Solder Dip (RHSD)," 6th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Oberpfaffenhofen, Germany, Apr. 15-16, 2015, pp. xx-xx.

Wickham, Martin, Thomas, Owen, Clayton, Kate, and Hunt, Chris, "Measurement of tin whisker growth on printed circuit board assemblies and the effect of mitigation techniques," 6th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Oberpfaffenhofen, Germany, Apr. 15-16, 2015, pp. xx-xx.

Karpov, V. G., "Understanding the movements of metal whiskers (presentation)," Tin Whisker Group teleconference, Apr. 8 & 15, 2015.

Hemmila, Samu, Gao, Anran, Lu, Na, Li, Tie, Wang, Yuelin, and Kallio, Pasi, "Integration of microfluidic sample delivery system on silicon nanowire-based biosensor," Microsystem Technologies, vol. 21 no. 3, pp. 571-580, Mar. 2015.

Stein, J., Tineo, C. A. Cordova, Welzel, U., Huege, W., and Mittemeijer, E. J., "Microstructural Development and Possible Whiskering Behavior of Thin Sn Films Electrodeposited on Cu(Zn) Substrates," Journal of Electronic Materials , vol. 44 no. 3, pp. 886-894, Mar. 2015.

Stein, J., Welzel, U., Leineweber, A., Huegel, W., and Mittemeijer, E. J., "The crystallographic growth directions of Sn whiskers," Acta Materialia , vol. 86, pp. 102-109, Mar. 2015.

Chason, E., Engwall, A. M., Miller, C. M., Chen, C.-H., Bhandari, A., Soni, S. K., Hearne, S. J., Freund, L. B., and Sheldon, B. W., "Stress evolution during growth of 1-D island arrays: Kinetics and length scaling," Scripta Materialia, vol. 97, pp. 33-36, Mar. 1, 2015.

Hillman, David, and Wilcoxon, Ross, "Tin Whisker Risk Assessment of a Tin Surface Finished Connector," Surface Mount Technology (SMT), vol. 30 no. 2, pp. 68,70-72,74-76,78-79, Feb. 2015.

Holtzer, Mitch, "Minimizing the Risk of Tin Whisker Formation in Lead-Free Assemblies," Surface Mount Technology (SMT), vol. 30 no. 2, pp. 80,82, Feb. 2015.

Karpov, V. G., "Electrostatic Mechanism of Nucleation and Growth of Metal Whiskers," Surface Mount Technology (SMT), vol. 30 no. 2, pp. 28,30-32,34-36,38-40,42-45, Feb. 2015.

Lasky, Ronald C., "Risk and Mitigation for Tin Whiskers and Tin Pest," Surface Mount Technology (SMT), vol. 30 no. 2, pp. 18,20-22,24,26-27, Feb. 2015.

Osterman, Michael, "Tin Whiskers Remain a Concern," Surface Mount Technology (SMT), vol. 30 no. 2, pp. 50,52-54, Feb. 2015.

Sentz, Scott, "The Unpredictability of Tin Whiskers Endures," Surface Mount Technology (SMT), vol. 30 no. 2, pp. 62,64-65, Feb. 2015.

Skwarek, A., Witek, K., Pluska, M., and Czerwinski, A., "Tin Whisker Growth on the Surface of Tin-Rich Lead-Free Alloys," Surface Mount Technology (SMT), vol. 30 no. 2, pp. 56,58-60, Feb. 2015.

Kim, Gye Hyun, and Thompson, Carl V., "Effect of surface energy anisotropy on Rayleigh-like solid-state dewetting and nanowire stability," Acta Materialia, vol. 84, pp. 190-201, Feb. 1, 2015.

Ashworth, M. A., Haspel, D., Wu, L., Wilcox, G. D., and Mortimer, R. J., "An Investigation into the Effect of a Post-electroplating Electrochemical Oxidation Treatment on Tin Whisker Formation," Journal of Electronic Materials, vol. 44 no. 1, pp. 442-456, Jan. 2015.

Ashworth, M. A., Wilcox, G. D., Higginson, R. L., Heath, R. J., Liu, C., and Mortimer, R. J., "The effect of electroplating parameters and substrate material on tin whisker formation," Microelectronics Reliability, vol. 55 no. 1, pp. 180-191, Jan. 2015.

Wang, Ying, Yoo, Byung-Gil, Phillipi, Bastian, Handwerker, Carol, Blendell, John, Kraft, Oliver, and Dehm, Gerhard, "Stress Relaxation in Tin Films during Cyclic Bending and Thermal Cycling," Tin Whisker Group teleconference, Jan. 28 & Feb. 4, 2015.

Spiers, Simon, Inside an AF114 transistor with tin whiskers, Youtube, Jan. 24, 2015.

2014: 0 books, 3 theses, 86 papers, and 1 web page on tin whiskers

Dunn, Barrie D., and Mozdzen, Grazyna, "Tin Oxide Coverage on Tin Whisker surfaces, Measurements and Implications for Electronic Circuits," Soldering & Surface Mount Technology, vol. 26 no. 3, pp. xx-xx, 2014.

Hopper, Ann, "Controlled Modification of Surfaces at the nanoscale," Transactions of the IMF, vol. 92 no. 3, pp. 123-124, 2014. https://doi.org/10.1179/0020296714Z.000000000181

Stuttle, C. J., Ashworth, M. A., Wilcox, G. D., and Mortimer, R. J., "Characterisation of tin-copper intermetallic growth in electrodeposited tin coatings using electrochemical oxidation techniques," Transactions of the IMF, vol. 92 no. 5, pp. 272-281, 2014. https://doi.org/10.1179/0020296714Z.000000000174

McKeown, Stephen, Meschter, Stephan, Snugovsky, Polina, and Kennedy, Jeffery, "SERDP Tin Whisker Testing and Modeling: Whisker Geometric Risk Model Development," Tin Whisker Group teleconference, Dec. 3, 2014.

Fadil, Nor Akmal, Yusof, Siti Zahira, Ourdjini, Ali, and Bakar, Tuty Asma Abu, "Effect of the Formation of CuO flowers and SnO2 on the Growth of Tin Whiskers on Immersion Tin Surface Finish," Applied Mechanics and Materials , vol. 695, pp. 301-305, Nov. 2014.

Kazimierczak, Honorata, Ozga, Piotr, Slupska, Monika, Swiatek, Zbigniew, and Berent, Katarzyna, "Electrodeposition of Sn-Mn Layers from Aqueous Citrate Electrolytes," Journal of the Electrochemical Society, vol. 161 no. 6, pp. D309-D320, 2014.

Michael, Joseph R., Susan, Don F., and McKenzie, Bonnie, "2D and 3D EBSD and TKD: Examples from Tin Whiskers," Sandia Report SAND2014-16904PE, 2014.

Michael, Joseph R., Rye, Michael J., Susan, Don F., and McKenzie, Bonnie, "Crystallographic Characterization of Whiskers using EBSD: Examples from Tin Whiskers," Sandia Report SAND2014-0231C, 2014.

Sycheva, Anna, Radanyi, Adam and Gacsi, Zoltan, "Studying Pressure Induced Whiskers Formation from Sn-rich Surfaces," Materials Science Forum, vol. 790/791, pp. 271-276, May 2014.

Vianco, P. T., Neilsen, M. K., Rejent, J. A., and Grant, R. P., "Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth on Thin Films," Sandia Report SAND2014-15673J, 2014.

Chason, E., Pei, F., Briant, C. L., Kesari, H., and Bower, A. F., "Significance of Nucleation Kinetics in Sn Whisker Formation," Journal of Electronic Materials, vol. 43 no. 12, pp. 4435-4441, Dec. 2014.

Illes, Balazs, and Horvath, Barbara, "Tin whisker growth from micro-alloyed SAC solders in corrosive climate," Journal of Alloys and Compounds, vol. 616, pp. 116-121, Dec. 15, 2014.

Pei, F., Briant, C. L., Kesari, H., Bower, A. F., and Chason, E., "Kinetics of Sn whisker nucleation using thermally induced stress," Scripta Materialia, vol. 93, pp. 16-19, Dec. 15, 2014.

Eckold, P., Niewa, R., and Hugel, W., "Texture of electrodeposited tin layers and its influence on their corrosion behavior," Microelectronics Reliability, vol. 54 no. 11, pp. 2578-2585, Nov. 2014.

Meschter, S., Snugovsky, P., Bagheri, Z., Kosiba, E., Romansky, M., Kennedy, J., Snugovsky, L., and Perovic, D., "Whisker Formation on SAC305 Soldered Assemblies," JOM, vol. 66 no. 11, pp. 2320-2333, Nov. 2014.

Qiang, Lei, and Huang, Zaixing, "A physical model and analysis for whisker growth caused by chemical intermetallic reaction," Microelectronics Reliability, vol. 54 no. 11, pp. 2494-2500, Nov. 2014.

Shilyaeva, Yulia, Gavrilov, Sergey, and Matyna, Larisa, "Melting of indium, tin, and zinc nanowires embedded in the pores of anodic aluminum oxide," Journal of Thermal Analysis and Calorimetry, vol. 118 no. 2, pp. 937-942, Nov. 2014.

Stein, J., Rehm, S., Welzel, U., Huegel, W., and Mittemeijer, E. J., "The Role of Silver in Mitigation of Whisker Formation on Thin Tin Films," Journal of Electronic Materials, vol. 43 no. 11, pp. 4308-4316, Nov. 2014.

Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and Kosiba, Eva, "Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Tin Whisker Growth on SAC305 Assemblies and Risk Modeling," Tin Whisker Group teleconference, Nov. 12, 2014.

Rohwer, Lauren, "Platelet composite coatings for tin whisker mitigation," 8th International Symposium on Tin Whiskers, Raleigh, NC, Oct. 29, 2014, pp. xx-xx. (Sandia Report SAND2014-18755C)

Vakanas, G. P., Vandecasteele, B., Schaubroek, D., De Messemaeker, J., Willems, G., Ashworth, M. A., Wilcox, G. D., and De Wolf, I., "Sn whisker evaluations in 3D microbumped structures," Microelectronics Reliability, vol. 54 no. 9-10, pp. 1982-1987, Sept.-Oct. 2014.

Stuttle, Christopher James, The Electrodeposition of Tin Coatings from Deep Eutectic Solvents and their Subsequent Whisker Growth. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, Sept. 2014.

Chen, Wei-Hsun, Evaluation of Local Anisotropic Elasticity and Thermal Expansion on Whisker Formation Sites in beta-tin Thin Films. Ph. D. Thesis for Purdue University, West Lafayette, IN, Aug. 2014.

Bush, Peter, Galyon, George, Handwerker, Carol, Osenbach, John, Parker, Richard, Reynolds, Heidi, Schroeder, Valeska, Smetana, Joseph, Su, Peng, Williams, Maureen, and Woodrow, Tom, "iNEMI Tin Whisker Projects: Test Development, Risk Mitigation, and Fundamental Theory Development," Tin Whisker Group teleconference, Oct. 22, 2014.

Vasko, A., and Karpov, V., "Rapid Growth of Whiskers in Evaporated Tin Films Under Influence of Electric Field," Tin Whisker Group teleconference, Oct. 15, 2014.

Schetty, Rob, "Effects of Electrodeposited Matte Tin Crystal Orientation and Grain Structure on Tin Whisker Growth Propensity Using Stress-Inducing Test Methods," 2014 IEEE 60th Holm Conference on Electrical Contacts, New Orleans, LA, Oct. 12-15, 2014, pp. xx-xx.

Snipes, E. K., Flowers, G. T., Lall, P., and Bozack, M. J., "Impact of Thermal Cycling and Background Gas Environment on Tin Whiskering," 2014 IEEE 60th Holm Conference on Electrical Contacts, New Orleans, LA, Oct. 12-15, 2014, pp. xx-xx.

Hillman, Dave, Wilcoxon, Ross, Lower, Nate, and Grossman, Dan, "Tin Whisker Inorganic Coating Evaluation (TWICE)," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 476-488.

Lasky, Ronald, "Risk and Mitigation for Tin Whiskers and Tin Pest," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 444-448.

Meschter, S., Cho, J., Maganty, S., Starkey, D., Gomez, M., Edwards, D., Ekin, A., Elsken, K., Keeping, J., Snugovsky, P., Kosiba, Eva, Bagheri, Zohreh, and Kennedy, Jeff, "Strategic Environmental Research and Development Program (SERDP) Nanoparticle Enhanced Conformal Coating for Whisker Mitigation," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 489-529.

Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and Kosiba, Eva, "Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Tin Whisker Growth on SAC305 Assemblies," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 449-475.

Oezkoek, Mustafa, Mertens, Hubertus, and Bruder, Maren, "Immersion Tin Surface Finish - Reviewing the Past and a Look to the Future," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 941-944.

Cho, Junghyun, Meschter, Stephan J., Maganty, Suraj, Starkey, Dale, Gomez, Mario, Edwards, David G., Ekin, Abdullah, Elsken, Kevin, Keeping, Jason, Snugovsky, Polina, Kennedy, Jeff, and Romansky, Marianne, "Polyurethane Conformal Coatings Filled with Hard Nanoparticles for Tin Whisker Mitigation," SMTAnews & Journal of Surface Mount Technology , vol. 27 no. 3, pp. 15-21, July-Sept. 2014.

Hwang, Jennie S., "Tin Whiskers, Part 6: Preventive and Mitigating Measures - Strategy and Tactics," Surface Mount Technology (SMT), vol. 29 no. 9, pp. 12,14-15, Sept. 2014.

Mahan, Kenny, Sun, Yong, Han, Bongtae, Han, Sungwon, and Osterman, Mike, "Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth," Journal of Electronic Packaging, vol. 136 no. 3, pp. 031004-1-031004-7, Sept. 2014.

Seelig, Karl, and O'Neil, Tim, "Tin Whisker Study Conclusions," Printed Circuit Design and Fab/ Circuits Assembly, vol. 31 no. 9, pp. 52-54, Sept. 2014.

Su, Chien-Hao, Chen, Hao, Lee, Hsin-Yi, Liu, Cheng Yi, Ku, Ching-Shun, and Wu, Albert T., "Kinetic Analysis of Spontaneous Whisker Growth on Pre-treated Surfaces with Weak Oxide," Journal of Electronic Materials, vol. 43 no. 9, pp. 3290-3295, Sept. 2014.

Xue, Peng, Xue, Song-bai, Shen, Yi-Fu, Long, Fei, and Zhu, Hong, "Mechanism of Reaction Between Nd and Ga in Sn-Zn-0.5Ga-xNd Solder," Journal of Electronic Materials, vol. 43 no. 9, pp. 3404-3410, Sept. 2014.

Stoyanov, Stoyan, Dabek, Alexander, and Bailey, Chris, "Thermo-mechanical Impact of Laser-induced Solder Ball Attach Process on Ball Grid Arrays," 2014 Electronics System-Integration Technology Conference , Helsinki, Finland, Sept. 16-18, 2014, pp. xx-xx.

Melcioiu, Georgiana, Serban, Viorel-Aurel, Ashworth, Mark, Codrean, Cosmin, Lita, Marin, and Wilcox, Geoffrey D., "An evaluation of Sn-Cu-Ga and Sn-Cu-Ag solder alloys for applications within the electronics industry," Solid State Phenomena, vol. 216, pp. 91-96, Aug. 2014.

Xue, Peng, Xue, Song-bai, Shen, Yi-fu, Long, Fei, and Zhu, Hong, "Wettability and interfacial whiskers of Sn-9Zn-0.5Ga-0.08Nd solder with Sn, SnBi and Au/Ni coatings," Journal of Materials Science: Materials in Electronics, vol. 25 no. 8, pp. 3520-3525, Aug. 2014.

Karpov, Victor, "Electrostatic Theory of Metal Whiskers," Tin Whisker Group teleconference, Aug. 27 & Sept. 3, 2014.

Hao, Hu, He, Hongwen, and Lu, Yuan, "Study of Tin Whisker Growth Accelerated by Rare Earth Phase and the Mechanism of Tin Whisker Growth," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1120-1126.

He, Hongwen, Cao, Liqiang, Hao, Hu, Ma, Limin, and Guo, Fu, "Whisker growth in the crack region of the cathode interface during current stressing process in lead-free solder joints," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1491-1494.

Liu, Ting, Ding, Dongyan, Hu, Yu, and Gong, Yihua, "Effect of Interfacial Reaction on Tin Whisker Formation of Sn/Ni Films Deposited on Copper Lead-frame," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1005-1009.

Yao, Z. X., Yin, L. M., Lu, Y. H., gang, W., Chen, Z. G., and Yao, Z. X., "Acceleration of the growth of tin whisker by thermal aging and external tension," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1096-1099.

Yao, Z. X., Yin, L. M., Zhang, L. P., Zhou, J., and Yao, Z. X., "The effect of coating thickness and external force on the growth of tin whisker," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1100-1103.

Czerwinski, A., Skwarek, A., Pluska, M., Ratajczak, J., and Witek, K., "Whisker Growth in Tin Alloys on Glass-Epoxy Laminate," Surface Mount Technology (SMT), vol. 29 no. 7, pp. 30,32,34-36,38-39, July 2014.

Gupta, Abhishek, "Hard-Won Knowledge Mitigates Effects Of Tin Whiskers," Electronic Design, vol. 62 no. 7, pp. 35-38, July 2014.

Hwang, Jennie S., "Tin Whiskers: Capsulization," Surface Mount Technology (SMT) , vol. 29 no. 7, pp. 16,18-22,24-26,28-29, July 2014.

Seelig, Karl, and O'Neill, Tim, "Can the Right Alloy Prevent Tin Whisker Formation?," Printed Circuit Design and Fab/ Circuits Assembly, vol. 31 no. 7, pp. 40-41, July 2014.

Woody, Linda, and Fox, William, "Tin Whisker Risk Management by Conformal Coating," Surface Mount Technology (SMT), vol. 29 no. 7, pp. 40,42-44,46-48,50,52-58, July 2014.

Lim, Hooi Peng, Ourdjini, Ali, and Bakar, Tuty Asma Abu, "The Effects of Nickel Underlayer and Solder Dipping as Tin Whisker Mitigations in Tin Surface Finishes," Applied Mechanics and Materials , vol. 554, pp. 47-51, June 2014.

Xue, Peng, Xue, Song-bai, Shen, Yi-fu, and Zhu, Hong, "Inhibiting the growth of Sn whisker in Sn-9Zn lead-free solder by Nd and Ga," Journal of Materials Science: Materials in Electronics, vol. 25 no. 6, pp. 2671-2675, June 2014.

Diyatmika, Wahyu, Chu, J. P., Yen, Y. W., Chang, W. Z., and Hsueh, C. H., "Thin film metallic glass as an underlayer for tin whisker mitigation: A room-temperature evaluation," Thin Solid Films, vol. 561, pp. 93-97, June 30, 2014.

"Tin whiskers on printed circuit boards: Consequences for safety components in machine construction," IFA, May 2014.

Hwang, Jennie S., "Tin Whiskers, Part 5: Impact of Testing Conditions," Surface Mount Technology (SMT), vol. 29 no. 5, pp. 12,14-15, May 2014.

Karpov, V. G., "Electrostatic Theory of Metal Whiskers," Physical Review Applied , vol. 1 no. 4, pp. 044001-1-0044001-13, May 2014.

Seelig, Karl, and O'Neill, Tim, "Tin Whisker Revelations," Printed Circuit Design and Fab/ Circuits Assembly, vol. 31 no. 5, pp. 71-72, May 2014.

Wickman, Martin, Clayton, Kate, Hunt, Chris, and Dunn, Barrie, "Sn Whiskers and their Mitigation for Space, Aerospace and Defence Electronics," 5th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Noordwijk, The Netherlands, May 2014, pp. xx-xx.

Wang, Ying, Microstructure Evolution and Surface Defect Formation in Tin Films . Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2014.

Cho, Junghyun, Meschter, Stephan J., Maganty, Suraj, Starkey, Dale, Gomez, Mario, Edwards, David G., Ekin, Abdullah, Elsken, Kevin, Keeping, Jason, Snugovsky, Polina, Kennedy, Jeff, and Romansky, Marianne, "Polyurethane Conformal Coatings Filled with Hard Nanoparticles for Tin Whisker Mitigation," International Conference on Soldering & Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.

McKeown, Stephen A., Meschter, Stephan J., Snugovsky, Polina, and Kennedy, Jeffery, "SERDP Tin Whisker Testing and Modeling: Simplified Whisker Risk Model Development," International Conference on Soldering & Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.

Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and Kosiba, Eva, "Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Thermal Cycling Testing," International Conference on Soldering & Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.

Illes, Balazs, and Horvath, Barbara, "Tin Whisker Growth from Low Ag Content Micro-Alloyed SAC Solders," Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, Dresden, Germany, May 7-11, 2014, pp. 152-157.

Placek, Martin, Dusek, Karel, and Urbanek, Jan, "Whiskers Growth on Thick Tin Layers and Various Types of Surfaces," Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, Dresden, Germany, May 7-11, 2014, pp. 193-197.

Stoyanov, Stoyan, Dabek, Alexander, and Bailey, Chris, "Hot Nitrogen Deballing of Ball Grid Arrays," Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, Dresden, Germany, May 7-11, 2014, pp. 44-49.

Ashworth, Mark A., Wilcox, Geoffrey D., Higginson, Rebecca L., Heath, Richard J., and Liu, Changqing, "An Investigation into Zinc Diffusion and Tin Whisker Growth for Electroplated Tin Deposits on Brass," Journal of Electronic Materials, vol. 43 no. 4, pp. 1005-1016, Apr. 2014.

Elbasiony, A. M. R., Zein El Abedin, S., and Endres, F., "Electrochemical synthesis of freestanding tin nanowires from ionic liquids," Journal of Solid State Electrochemistry, vol. 18 no. 4, pp. 951-957, Apr. 2014.

Singh, S. S., Sarkar, R., Xie, H.-X., Mayer, C., Rajagopalan, J., and Chawla, N., "Tensile Behavior of Single-Crystal Tin Whiskers," Journal of Electronic Materials, vol. 43 no. 4, pp. 978-982, Apr. 2014.

Wang, Jing, Ashworth, Mark A., and Wilcox, Geoffrey D., "An Investigation Into the Role of Lead as a Suppressant for Tin Whisker Growth in Electronics," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 4 no. 4, pp. 727-740, Apr. 2014.

Anderson, Antony F., "Intermittent Electrical Contact Resistance as a Contributory Factor in the Loss of Automobile Speed Control Functional Integrity," IEEE Access, Apr. 9, 2014.

Munson, Terry, "Tin Whiskering on PCBA Capacitors in Storage (Inside ESD Bag, Inside a Sealed Cardboard Box)," Foresite. (before Apr. 3, 2014)

Tsujimoto, Masanobu, "Study of tin whisker inhibiting systems Controlling the copper substrate roughness and controlling the tin deposit crystal structure," IPC Symposium on Tin Whiskers, pp. xx-xx. (before Apr. 3, 2014)

Hwang, Jennie S., "Tin Whiskers, Part 4: Causes and Contributing Factors," Surface Mount Technology (SMT), vol. 29 no. 3, pp. 12-16, Mar. 2014.

Li, Qingqian, Chan, Y. C., and Chen, Zhong, "Tin whiskers growth of SnAgIn solder on Kovar substrate with Au/Ni plating," Journal of Materials Science: Materials in Electronics, vol. 25 no. 3, pp. 1222-1227, Mar. 2014.

Na, Seong-Hun, Lee, Mi-Ri, Park, Hwa-Sun, Kim, Heung-Kyu, and Suh, Su-Jeong, "Effect of a High-Temperature Pre-Bake Treatment on Whisker Formation Under Various Thermal and Humidity Conditions for Electrodeposited Tin Films on Copper Substrates," Metals and Materials International, vol. 20 no. 2, pp. 367-373, Mar. 2014.

Maalekian, Mehran, Seelig, Karl, and O'Neill, Timothy, "Sample Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys," IPC APEX Expo 2014, Las Vegas, NV, Mar. 25-27, 2014, pp. xx-xx.

Seelig, Karl F., "Sample Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys," IPC APEX Expo 2014, Las Vegas, NV, Mar. 25-27, 2014, pp. xx-xx.

Woody, Linda, and Fox, William, "Tin Whisker Risk Management by Conformal Coating," IPC APEX Expo 2014, Las Vegas, NV, Mar. 25-27, 2014, pp. xx-xx.

Mackay, David T., Janish, Matthew T., Sahaym, Uttara, Kotula, Paul G., Jungjohann, Katherine L., Carter, C. Barry, and Norton, M. Grant., "Template-free electrochemical synthesis of tin nanostructures," Journal of Materials Science, vol. 49 no. 4, pp. 1476-1483, Feb. 2014.

Wang, Ying, Blendell, John E., and Handwerker, Carol A., "Evolution of tin whiskers and subsiding grains in thermal cycling," Journal of Materials Science, vol. 49 no. 3, pp. 1099-1113, Feb. 2014.

Chang, Jaewon, Kang, Sung K., Lee, Jae-Ho, Kim, Keun-Soo, and Lee, Hyuck Mo, "Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions," Journal of Electronic Materials, vol. 43 no. 1, pp. 259-269, Jan. 2014.

George, Elviz, and Pecht, Michael, "Tin whisker analysis of an automotive engine control unit," Microelectronics Reliability, vol. 54 no. 1, pp. 214-219, Jan. 2014.

Jo, Jung-Lae, Nagao, Shijo, Hamasaki, Kyoko, Tsujimoto, Masanobu, Sugahara, Tohru, and Suganuma, Katsuaki, "Mitigation of Sn Whisker Growth by Small Bi Additions," Journal of Electronic Materials, vol. 43 no. 1, pp. 1-8, Jan. 2014.

Liu, Sihan, Ma, Limin, Shu, Yutian, Subramanian, K. N., Lee, Andre, and Guo, Fu, "Effects of POSS-Silanol Addition on Whisker Formation in Sn-Based Pb-Free Electronic Solders," Journal of Electronic Materials, vol. 43 no. 1, pp. 26-32, Jan. 2014.

Pei, Fei, and Chason, Eric, "In Situ Measurement of Stress and Whisker/Hillock Density During Thermal Cycling of Sn Layers," Journal of Electronic Materials, vol. 43 no. 1, pp. 80-87, Jan. 2014.

Yeh, Min-Chi, Li, Jyun Lin, Lo, Pei Jen, Yu, Rick, Yu, Cheng-Fu, and Hsieh, Ker-Chang, "Corrosion behavior of pure tin deposit under 55 °C/85 % RH reliability test," Journal of Materials Science: Materials in Electronics, vol. 25 no. 1, pp. 317-322, Jan. 2014.

Chen, Wei-Hsun, Sarobol, Pylin, Holaday, John R., Handwerker, Carol A., and Blendell, John E., "Effect of crystallographic texture, anisotropic elasticity, and thermal expansion on whisker formation in b-Sn thin films," Journal of Materials Research, vol. 29 no. 2, pp. 197-206, Jan. 28, 2014.

Spiers, Simon, Tin whiskers inside a AF117 transistor, Youtube, Jan. 6, 2014.

2013: 0 books, 2 theses, 74 papers, and 0 web pages on tin whiskers

Ashworth, M. A., Wilcox, G. D., Higginson, R. L., Heath, R. J., and Liu, C., "Effect of direct current and pulse plating parameters on tin whisker growth from tin electrodeposits on copper and brass substrates," Transactions of the IMF, vol. 91 no. 5, pp. 260-268, 2013. https://doi.org/10.1179/0020296713Z.000000000116

Bunyan, D., Ashworth, M. A., Wilcox, G. D., Higginson, R. L., Heath, R. J., and Liu, C., "Tin whisker growth from electroplated finishes - a review," Transactions of the IMF, vol. 91 no. 5, pp. 249-259, 2013. https://doi.org/10.1179/0020296713Z.000000000119

Diaz Gonzalez, Alfredo J., Pb-Free Electronics: From Nanotechnology to Combinatorial Materials Science. Master's Thesis for University of Puerto Rico, Mayaguez, Puerto Rico, 2013.

Diyatmika, Wahyu, Chu, Jinn P., Yen, Y. W., and Hsueh, C. H., "Sn whisker mitigation by a thin metallic-glass underlayer in Cu-Sn," Applied Physics Letters, vol. 103, pp. 241912-1-241912-4, 2013.

Dunn, Barrie, Turner, Ian, and Barnes, Cathy, "A study into the re-processing of pure tin termination finishes into tin-lead," Soldering & Surface Mount Technology, vol. 25 no. 4, pp. xx-xx, 2013.

Ye, Huan, Xue, Songbai, Chen, Cheng, and Li, Yang, "Growth behaviors of tin whisker in RE-doped Sn-Zn-Ga solder," Soldering & Surface Mount Technology, vol. 25 no. 3, pp. 139-144, 2013.

Sharma, Ashutosh, Bhattacharya, Sumit, Das, Siddhartha, and Das, Karabi, "Fabrication of Sn-Ag/CeO2 Electro-Composite Solder by Pulse Electrodeposition," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 44 no. 12, pp. 5587-5601, Dec. 2013. https://doi.org/10.1007/s11661-013-1894-5

Stein, Jendrik, Welzel, Udo, Huegel, Werner, Blatt, Sabine, and Mittemeijer, Eric Jan, "Aging-time-resolved in situ microstructural investigation of tin films electroplated on copper substrates, applying two-dimensional-detector X-ray diffraction," Journal of Applied Crystallography, vol. 46 no. 6, pp. 1645-1653, Dec. 2013.

Zou, Shiwen, Li, Xiaogang, Dong, Chaofang, Ding, Kangkang, and Xiao, Kui, "Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment," Electrochimica Acta , vol. 114, pp. 363-371, Dec. 30, 2013. https://doi.org/10.1016/j.electacta.2013.10.051

Rahal, Mohamad, "Innovative Circuits to Detect Faults in Accelerator Pedal Sensor Wires in Modern Vehicles," 2013 25th International Conference on Microelectronics , Beirut, Lebanon, Dec. 15-18, 2013, pp. xx-xx.

Hwang, Jennie S., "Tin Whiskers: Concerns and Potential Impact," Surface Mount Technology (SMT), vol. 28 no. 11, pp. 12,14-15, Nov. 2013.

Yan, X. L., Lin, M., and Wang, J. Y., "Equilibrium and kinetic surface segregations in Cu-Sn thin films," Applied Physics A, vol. 113 no. 2, pp. 423-430, Nov. 2013. https://doi.org/10.1007/s00339-013-7570-1

Horvath, Barbara, Shinohara, Tadashi, and Illes, Balazs, "Corrosion properties of tin-copper alloy coatings in aspect of tin whisker growth," Journal of Alloys and Compounds, vol. 577, pp. 439-444, Nov. 15, 2013.

Lasky, Ronald C., "Tin Whiskers 101," Medical Electronics Symposium 2013 Proceedings , Milpitas, CA, Nov. 12-13, 2013, pp. xx-xx.

Gupta, Abhishek, "Don't Let Tin Whiskers Destroy Your Design," Electronic Design, vol. 61 no. 13, pp. 63-66, Nov. 7, 2013.

Chawla, Nik, "In situ Mechanical Testing of Sn Whiskers," Tin Whisker Group teleconference, Nov. 6, 2013.

Jo, Jung-Lae, Nagao, Shijo, Sugahara, Tohru, Tsujimoto, Masanobu, and Suganuma, Katsuaki, "Thermal stress driven Sn whisker growth: in air and in vacuum," Journal of Materials Science: Materials in Electronics, vol. 24 no. 10, pp. 3897-3904, Oct. 2013.

Lu, Qingru, Huang, Hui, and Chen, Debing, "Analysis of the research status of tin whisker's influence on lead-free soldering," Advanced Materials Research, vol. 834-836, pp. 876-879, Oct. 2013.

Nishimura, Tetsuro, "Pushing the Limits of Lead-Free Soldering," Surface Mount Technology (SMT), vol. 28 no. 10, pp. 12,14-16,18-20,22,24,26, Oct. 2013.

Sarobol, P., Wang, Y., Chen, W. H., Pedigo, A. E., Koppes, J. P., Blendell, J. E., and Handwerker, C. A., "A Predictive Model for Whisker Formation Based on Local Microstructure and Grain Boundary Properties," JOM, vol. 65 no. 10, pp. 1350-1361, Oct. 2013.

Sentz, Scott, "Fusion Processing of Surface Mount Components to Mitigate Tin Whiskers," Microwave Journal, vol. 56 no. 10, pp. 144,146,148,150,152, Oct. 2013.

Diyatmika, Wahyu, Chu, J. P., and Yen, Y. W., "Effects of Annealing on Sn Whisker Formation: Role of Cu Alloy Seed Layer," 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 22-25, 2013, pp. 319-322.

Cable, Alan, and Cox, Roger, "Lead Tinning Requirements for the 21st Century," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 577-582.

Daya, Andrew, and Ramkumar, S. Manian, "Effect of Mixed Alloy BGA Re-Balling on Board Level Drop Test Reliability," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 859-865.

Naugler, Don, and Wetterman, Bob, "Ultra-Fine Pitch Reballing - What Needs to Change?," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 853-858.

Schoeller, Harry, and Meilunas, Michael, "Fine Pitch Re-ball and Reliability," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 551-558.

Huang, Lin, Lin, Xuenian, Chen, Renwu, and Wang, Jiangyong, "Sn whisker growth in Cu(top)-Sn(bottom) bilayer system upon room temperature aging," Advanced Materials Research, vol. 785-786, pp. 918-923, Sept. 2013.

Hwang, Jennie S., "Tin Whiskers: Phenomena and Observations," Surface Mount Technology (SMT), vol. 28 no. 9, pp. 12-13, Sept. 2013.

Snipes, E. K., Flowers, G.,T., Lall, P., and Bozack, M. J., "Role of Incorporated Hydrogen and Sputtered Grain Size on Tin Whiskering," 2013 IEEE 59th Holm Conference on Electrical Contacts, Newport, RI, Sept. 22-25, 2013, pp. xx-xx.

Jo, Jung-Lae, Kim, Keun-Soo, Sugahara, Tohru, Nagao, Shijo, Hamasaki, Kyoko, Tsujimoto, Masanobu, and Suganuma, Katsuaki, "Least lead addition to mitigate tin whisker for ambient storage," Journal of Materials Science: Materials in Electronics, vol. 24 no. 8, pp. 3108-3115, Aug. 2013.

Stoyanov, Stoyan, Bailey, Chris, Alam, M. O., Yin, Chunyan, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike, and Scott, Jim, "Modelling methodology for thermal analysis of hot solder dip process," Microelectronics Reliability, vol. 53 no. 8, pp. 1055-1067, Aug. 2013.

Weinberger, Christopher R., "Modeling Tin Whisker Growth," Sandia Report 2013-6818, Aug. 2013.

Liu, Sihan, Ma, Limin, Shu, Yutian, Zuo, Yong, and Guo, Fu, "Effects of POSS-Silanol Addition on the Whisker Formation in Sn3.0Ag0.5Cu Pb-Free Solder," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 765-768.

Liu, Ting, Ding, Dongyan, Hu, Yu, and Gong, Yihua, "Tin Whisker Growth on Electroplating Sn Bilayer," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 931-936.

Horvath, Barbara, "Influence of copper diffusion on the shape of whiskers grown on bright tin layers," Microelectronics Reliability, vol. 53 no. 7, pp. 1009-1020, July 2013.

Zhang, Shizhong, Rong, Weibin, and Sun, Lining, "Development of a Nanomanipualtion System for Handling Nanowires," Key Engineering Materials, vol. 562-565, pp. 1092-1097, July 2013.

Bin, Zhou, Zhonghua, Wan, Xunping, Li, and Yun-fei, En, "Research on Tin Whisker Growth of Pure Tin Plating of Different Lead Substrates," 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Suzhou, China, July 15-19, 2013, pp. 611-614.

Chason, Eric, Jadhav, Nitin, Pei, Fei, Buchovecky, Eric, and Bower, Allan, "Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms," Progress in Surface Science, vol. 88 no. 2, pp. 103-131, May 2013. https://doi.org/10.1016/j.progsurf.2013.02.002

Sarobol, Pylin, Effects of Local Film Properties on the Nucleation and Growth of Tin Whiskers and Hillocks. Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2013.

Chockalingam, K., Tonks, M. R., Hales, J. D., Gaston, D. R., Millett, P. C., and Zhang, Liangzhe, "Crystal plasticity with Jacobian-Free Newton-Krylov," Computational Mechanics, vol. 51 no. 5, pp. 617-627, May 2013.

Hwang, Jennie S., "Tin Whiskers: Clarity First," Surface Mount Technology (SMT), vol. 28 no. 5, pp. 12,14,16, May 2013.

Illes, Balazs, and Horvath, Barbara, "Whiskering behaviour of immersion tin surface coating," Microelectronics Reliability, vol. 53 no. 5, pp. 755-760, May 2013.

Wickham, Martin, "The Attraction of Sn Whiskers," 4th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Aalborg, Denmark, May 29, 2013.

Kang, Sung K., Chang, Jaewon, Lee, Jae-Ho, Kim, Keun-Soo, and Lee, Hyuck Mo, "Plastic Deformation Effect on Sn Whisker Growth in Electroplated Sn and Sn-Ag Solders," 2013 IEEE 63rd Electronic Components and Technology Conference , Las Vegas, NV, May 28-31, 2013, pp. 1018-1023.

Sarobol, P., Koppes, J. P., Chen, W. H., Su, P., Blendell, J. E., and Handwerker, C. A., "Recrystallization as a nucleation mechanism for whiskers and hillocks on thermally cycled Sn-alloy solder films," Materials Letters, vol. 99, pp. 76-80, May 15, 2013.

Cho, Junghyun, Meschter, Stephan J., Maganty, Suraj, Starkey, Dale, Gomez, Mario, Edwards, David G., Ekin, Abdullah, Elsken, Kevin, Keeping, Jason, Snugovsky, Polina, and Kennedy, Jeff, "Characterization of Hybrid Conformal Coatings Used for Mitigating Tin Whisker Growth," International Conference on Soldering & Reliability 2013 Proceedings, Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.

Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and Kosiba, Eva, "SERDP Tin Whisker Testing and Modeling: High Temperature/High Humidity Conditions," International Conference on Soldering & Reliability 2013 Proceedings, Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.

Tsujimoto, Masanobu, Hashimoto, Shigeo, Kiso, Masayuki, Ikumoto, Raihei, Kano, Toshikazu, Kanamori, Genki, Gudeczauskas, Don, and Milad, George, "The Elimination of Whiskers from Electroplated Tin," International Conference on Soldering & Reliability 2013 Proceedings, Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.

Chason, Eric, "Correlating Whisker/Hillock Growth with Compressive Stress in Sn during Thermal Cycling," Tin Whisker Group teleconference, May 8, 2013.

Pei, Fei, and Chason, Eric, "Correlating Whisker/Hillock Growth with Compressive Stress in Sn during Thermal Cycling," Tin Whisker Group Teleconference, May 8, 2013.

Kim, Keun-Soo, Kim, Sun-Sik, Yorikado, Yuuhi, Suganuma, Katsuaki, Tsujimoto, Masanobu, and Yanada, Isamu, "Sn whisker growth on Sn plating with or without surface treatment during the room temperature exposure," Journal of Alloys and Compounds, vol. 558, pp. 125-130, May 5, 2013.

Ye, Huan, Xue, Songbai, and Pecht, Michael, "Effects of thermal cycling on rare earth (Pr)-induced Sn whisker/hillock growth," Materials Letters, vol. 98, pp. 78-81, May 1, 2013.

Hillman, Craig, "What's the secret to tin whiskers?," Global SMT and Packaging , vol. 13 no. 4, pp. 38-39,41, Apr. 2013.

Marques, V. M. F., Johnston, C., and Grant, P. S., "Nanomechanical characterization of Sn-Ag-Cu/Cu joints-Part 1: Young's modulus, hardness and deformation mechanisms as a function of temperature," Acta Materialia, vol. 61 no, 7, pp. 2460-2470, Apr. 2013.

Sarobol, P., Blendell, J. E., and Handwerker, C. A., "Whisker and hillock growth via coupled localized Coble creep, grain boundary sliding, and shear induced grain boundary migration," Acta Materialia , vol. 61 no. 6, pp. 1991-2003, Apr. 2013.

Yeh, T. K., Lin, K. L., and Mohanty, U. S., "Effect of Ag on the Microstructure of Sn-8.5Zn-xAg-0.01Al-0.1Ga Solders Under High-Temperature and High-Humidity Conditions," Journal of Electronic Materials, vol. 42 no. 4, pp. 616-627, Apr. 2013.

Montgomery, Jeff, "AEM, Inc.," Tin Whisker Group teleconference, Apr. 24, 2013.

Li, Ruying, Zhang, Yong, and Sun, Xueliang, "Self-assembly synthesis and mechanism investigation of branched core-shell hybrids of tin nanowires and carbon nanotubes," Journal of Materials Research, vol. 28 no. 7, pp. 969-975, Apr. 14, 2013.

Larson, Kent, "Increasing Electronics Reliability With Conformal Coatings," Design News, vol. 68 no. 3, pp. 36-38, Mar. 2013.

Susan, Donald, Michael, Joseph, Grant, Richard P., Mckenzie, Bonnie, and Yelton, W. Graham, "Morphology and Growth Kinetics of Straight and Kinked Tin Whiskers," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 44 no. 3, pp. 1485-1496, Mar. 2013. https://doi.org/10.1007/s11661-012-1488-7

Sarobol, Pylin, Chen, Wei-Hsun, Pedigo, Aaron E., Su, Peng, Blendell, John E., and Handwerker, Carol A., "Effects of local grain misorientation and b-Sn elastic anisotropy on whisker and hillock formation," Journal of Materials Research, vol. 28 no. 5, pp. 747-756, Mar. 14, 2013.

Sarobol, Pylin, Chen, Wei-Hsun, Pedigo, Aaron E., Su, Peng, Blendell, John E., and Handwerker, Carol A., "Effects of local grain misorientation and b-Sn elastic anisotropy on whisker and hillock formation - CORRIGENDUM," Journal of Materials Research , vol. 28 no. 5, pp. 785, Mar. 14, 2013.

Hillman, Dave, and Lesniewski, Tom, "An Investigation of Whisker Growth on Tin Coated Wire and Braid," Tin Whisker Group teleconference, Mar. 6, 2013.

"Tin Whisker Mitigation & Conformal Coating," Surface Mount Technology (SMT), vol. 28 no. 2, pp. 57, Feb. 2013.

Devlin, Mark, "Technically Revisited: Elminiating Tin Whiskers," Finishing World , pp. 23,26, Feb. 2013.

Hong, Won Sik, Oh, Chul Min, and Kim, Do Seop, "Mitigation and Verification Methods for Sn Whisker Growth in Pb-Free Automotive Electronics." Journal of Electronic Materials, vol. 42 no. 2, pp. 332-347, Feb. 2013.

Jadhav, Nitin, Williams, Maureen, Pei, Fei, Stafford, Gery, and Chason, Eric, "Altering the Mechanical Properties of Sn Films by Alloying with Bi: Mimicking the Effect of Pb to Suppress Whiskers," Journal of Electronic Materials , vol. 42 no. 2, pp. 312-318, Feb. 2013.

Williams, J. J., Chapman, N. C., and Chawla, N., "Mechanisms of Sn Hillock Growth in Vacuum by In Situ Nanoindentation in a Scanning Electron Microscope (SEM)." Journal of Electronic Materials , vol. 42 no. 2, pp. 224-229, Feb. 2013.

Hunt, Chris, Wickham, Martin, Zou, Ling, Thomas, Owen, and Zhang, Bufa, "Assessment of Reterminated RoHS Components for SnPb Applications," IPC APEX Expo 2013, San Diego, CA, Feb. 17-21, 2013, pp. xx-xx.

Li, Cai-Fu, Liu, Zhi-Quan, and Shang, Jian-Ku, "The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy," Journal of Alloys and Compounds, vol. 550, pp. 231-238, Feb. 15, 2013.

Li, Cai-Fu, and Liu, Zhi-Quan, "Microstructure and growth mechanism of tin whiskers on RESn3 compounds," Acta Materialia, vol. 61 no. 2, pp. 589-601, Jan. 2013.

Handwerker, Carol, "Tin Whisker Formation: A Predictive Model Based on Local Microstructure and Grain Boundary Properties," Tin Whisker Group teleconference, Jan. 30, 2013.

Sarobol, Pylin, Chen, Wei-Hsun, Wang, Ying, Koppes, John P., Pedigo, Aaron E., Su, Peng, Blendell, John E., and Handwerker, Carol A., "Tin Whisker Formation: A Predictive Model Based on Local Microstructure and Grain Boundary Properties," Tin Whisker Group Teleconference, Jan. 30, 2013.

van den Bosch, Brett, "Cause of tin whiskers identified," Dataweek, vol. 36 no. 1, pp. 4, Jan. 23, 2013.

Wang, Z., Adhikari, S. S., Kroener, M., Kojda, D., Mitdank, R., Fischer, S. F., Toellner, W., Nielsch, K., and Woias, P., "Electrical Conductivity and Seebeck Coefficient Measurements of Single Nanowires by Utilizing a Microfabricated Thermoelectric Nanowire Characterization Platform," 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems, Taipei, Taiwan, Jan. 20-24, 2013, pp. 508-511.

Susan, Don, "Tin Whisker Work at Sandia National Laboratories," Tin Whisker Group teleconference, Jan. 9, 2013.

2012: 0 books, 7 theses, 88 papers, and 3 web pages on tin whiskers

Ansari, Lida, Fagas, Giorgos, Colinge, Jean-Pierre, and Greer, James C., "A Proposed Confinement Modulated Gap Nanowire Transistor Based on a Metal (Tin)," Nano letters, vol. 12 no. 5, pp. 2222-2227, 2012. DOI: 10.1021/nl2040817

Crandall, Erika R., Factors Governing Tin Whisker Growth. Ph. D. Thesis for Auburn University, Auburn, AL, 2012.

Han, Sungwon, Assessment of an Electrical Shorting and Metal Vapor Arcing Potential of Tin Whiskers. Ph. D. Thesis for University of Maryland, College Park, MD, 2012.

Horvath, Barbara, Examination of Tin Whisker Growth in Electronic Assemblies. Ph. D. Thesis for Budapest University of Technology and Economics, Budapest, Hungary, 2012.

Lee, Hoyong, Avionics Reliability Assurance Guidelines for High Altitude Applications . Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2012.

Michael, Joseph R., McKenzie, Bonnie, and Susan, Don F., "Crystallographic Characterization of Whiskers using EBSD: Examples from Tin Whiskers," Sandia Report SAND2012-0278C, 2012.

Mizuguchi, Yukiko, Murakami, Yosuke, Tomiya, Shigetaka, Asai, Tadashi, Kiga, Tomoya, and Suganuma, Katsuaki, "Effect of Crystal Orientation on Sn Whisker-Free Sn-Ag-Cu Plating," Materials Transactions, vol. 53 no. 12, pp. 2078-2084, 2012.

Murakami, Koji, Hino, Makoto, Mitooka, Yutaka, and Kanadani, Teruto, "Formation and Growth of Tin Whiskers on Aluminum-Tin Alloys," Materials Transactions, vol. 53 no. 1, pp. 209-216, 2012.

Sun, Yong, Micro/Nano-Scale Investigation on Tin Alloys and Tin Dioxide Nanowires . Ph. D. Thesis for University of South Carolina, Columbia, SC, 2012.

Xue, Peng, Xue, Songbai, Shen, Yifu, Xiao, Zhengxiang, Zhu, Hong, Long, Weimin, and Yu, Xinquan, "Effect of Pr on properties and Sn whisker growth of Sn-9Zn-xPr solder," Soldering & Surface Mount Technology, vol. 24 no. 4, pp. 280-286, 2012.

Anderson, A. F., "Provisional notes on the CTS electronic accelerator pedals as used in some Toyota vehicles," Dec. 15, 2012.

Liu, Ting, Ding, Dongyan, Wang, Yiqing, Hu, Yu, Gong, Yihua, and Galuschki, Klaus-Peter, "Ni Barrier for Tin Whisker Mitigation," 2012 2nd IEEE CPMT Symposium Japan, Kyoto, Japan, Dec. 10-12, 2012, pp. xx-xx.

Onuki, Hiroshi, and Shibutani, Tadahiro, "In-situ Observation of Whisker Nucleation in Air with AFM," 2012 2nd IEEE CPMT Symposium Japan, Kyoto, Japan, Dec. 10-12, 2012, pp. xx-xx.

Crandall, E. R., Flowers, G. T., Lall, P., and Bozack, M. J., "Whisker Growth From Sn Solder Alloys," 2012 IEEE 14th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 5-7, 2012, pp. 671-675.

Tyler, Don, "Robotic Hot Solder Dip for Prevention of Tin Whiskers and Weak Solder Joints," Tin Whisker Group teleconference, Nov. 6, 2012.

Anglin, Benjamin Stewart, Investigation and Characterization of Thermoelastic Eigenstresses Near Microstructural Features and the Application to Tin Whisker Growth. Ph. D. Thesis for Carnegie Mellon University, Pittsburgh, PA, Oct. 2012.

Chada, Srinivas, "Topics in Lead-Free Solders: Interfacial and Sn Whisker Growth," JOM , vol. 64 no. 10, pp. 1174-1175, Oct. 2012.

Dunn, B. D., "Guidelines for Creating a Lead-Free Control Plan," European Space Agency STM-281, Oct. 2012.

Pei, Fei, Jadhav, Nitin, and Chason, Eric, "Correlation Between Surface Morphology Evolution and Grain Structure: Whisker/Hillock Formation in Sn-Cu," JOM, vol. 64 no. 10, pp. 1176-1183, Oct. 2012.

Tulkoff, Cheryl, "A New & Better Approach to Tin Whisker Mitigation (Tutorial 14)," SMTA International Conference, Orlando, FL, Oct. 15, 2012.

Pinsky, David, "Tin Whisker Risk Management for High Reliability Systems," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. xx-xx.

Lead-Free Surface Finishes for Electronic Components: Tin Whisker Growth (before Oct. 2, 2012)

Jiang, N., Yang, M., Novak, J., Igor, P., and Osterman, M., "Sn whiskers removed by energy photo flashing," Applied Surface Science , vol. 258 no. 24, pp. 9599-9603, Oct. 1, 2012.

Han, Sungwon, Osterman, Michael, Meschter, Stephan, and Pecht, Michael, "Evaluation of Effectiveness of Conformal Coatings as Tin Whisker Mitigation," Journal of Electronic Materials, vol. 41 no. 9, pp. 2508-2518, Sept. 2012.

Korsunsky, Alexander M., Hofmann, Felix, Abbey, Brian, Song, Xu, Belnoue, Jonathan P., Mocuta, Cristian, and Dolbnya, Igor, "Analysis of the internal structure and lattice (mis)orientation in individual grains of deformed CP nickel polycrystals by synchrotron X-ray micro-diffraction and microscopy," International Journal of Fatigue , vol. 42, pp. 1-13, Sept. 2012. https://doi.org/10.1016/j.ijfatigue.2011.03.003

Zapanta, Loren R., "Tin Whisker White Paper: JESD201 Approach," Cypress, Sept. 2012.

Crandall, E. R., Flowers, G. T., Lall, P., Snipes, E. K., and Bozack, M. J., "The Influence of Surface Oxides on Whiskering," 2012 IEEE 58th Holm Conference on Electrical Contacts, Portland, OR, Sept. 23-26, 2012, pp. xx-xx.

Crandall, E. R., Flowers, G. T., Lall, P., and Bozack, M. J., "Whisker Prevention Using Hard Metal Cap Layers," 2012 IEEE 58th Holm Conference on Electrical Contacts, Portland, OR, Sept. 23-26, 2012, pp. xx-xx.

Shin, Ho Sun, Jeon, Seong Gi, Yu, Jin, and Song, Jae Yong, "Transformation of Sn nanowires to oxide nanotubes by a localized corrosion process," Materials Letters, vol. 82, pp. 22-25, Sept. 1, 2012.

Fortier, Aleksandra, and Kovacevic, Radovan, "Internal Microstructure Investigation of Tin Whisker Growth Using FIB Technology," Journal of Electronic Materials, vol. 41 no. 8, pp. 2029-2034, Aug. 2012.

Han, Sungwon, Osterman, Michael, and Pecht, Michael, "Likelihood of Metal Vapor Arc by Tin Whiskers," Surface Mount Technology (SMT), vol. 27 no. 8, pp. 48-50,52,54,56, Aug. 2012.

Koppes, John Patrick, Effect of Crystallographic Orientation on Hillock Formation in Thermally Cycled Large Grain Tin Films. Ph. D. Thesis for Purdue University, West Lafayette, IN, Aug. 2012.

Lee, David M., and Pinol, Lesly A., "Effects of Tin and Copper Nanotexturization on Tin Whisker Formation," Surface Mount Technology (SMT), vol. 27 no. 8, pp. 18-20,22-24,26,28,30, Aug. 2012.

Lesniewski, Thomas, and Hillman, Dave, "An Investigation of Whisker Growth on Tin-Coated Wire and Braid," Surface Mount Technology (SMT), vol. 27 no. 8, pp. 32-34,36,38-40,42-43, Aug. 2012.

Sentz, Scott, "Tin Whisker Mitigation Process for Surface Mount Components," Surface Mount Technology (SMT), vol. 27 no. 8, pp. 58-60,62, Aug. 2012.

Liu, Ting, Ding, Dongyan, Wang, Yiqing, Hu, Yu, Gong, Yihua, and Galuschki, Klaus-Peter, "Tin Whisker Growth on Bright Sn Films Supported by Lead-frame Alloy Substrates," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1145-1149.

Liu, Zhi-Quan, and Li, Cai-Fu, "Spontaneous tin whisker growth from rare-earth tin alloys," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 373-375.

Yin, C. Y., Best, C., Bailey, C., Stoyanov, S., and Alam, M. O., "Statistical Analysis of the Impacts of Refinishing Process on the Reliability of Microelectronics Components," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1377-1381.

Yuan, Jiaojiao, Wang, Xuefang, Lv, Zhicheng, Shi, Shuai, Wang, Yuzhe, and Liu, Sheng, "Study of Factors Influencing Tin Whisker Growth," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 940-944.

Blanche, J. F., and Strickland, S. M., "Lead-Free Experiment in a Space Environment," NASA/TM-2012-217463, July 2012.

Kuwano, Noriyuki, Horikami, Sadanori, Maeda, Masanori, and Sosiati, Harini, "TEM and SEM Analysis for Formation Mechanism of Tin Whiskers," Advanced Materials Research, vol. 545, pp. 16-20, July 2012.

Mizuguchi, Yukiko, Murakami, Yosuke, Tomiya, Shigetaka, Asai, Tadashi, Kiga, Tomoya, and Suganuma, Katsuaki, "Effect of Crystal Orientation on Mechanically Induced Sn Whiskers on Sn-Cu Plating," Journal of Electronic Materials, vol. 41 no. 7, pp. 1859-1867, July 2012.

Tian, Jun, and Hao, Hu, "Rapid Growth of Tin Whiskers on the Surface of Sn3.8Ag0.7Cu1.0Y Alloy," Advanced Materials Research, vol. 557-559, pp. 1397-1403, July 2012.

Chang, Jaewon, Seo, Sun-Kyoung, Cho, Moon Gi, Lee, Dong Nyung, Kang, Kyoo-Sik, and Lee, Hyuck Mo, "Effects of Be and Co addition on the growth of Sn whiskers and the properties of Sn-based Pb-free solders," Journal of Materials Research, vol. 27 no. 14, pp. 1877-1886, July 28, 2012.

Ye, Huan, Xue, Songbai, and Pecht, Michael, "Evaluation of the microstructure and whisker growth in Sn-Zn-Ga solder with Pr content," Journal of Materials Research, vol. 27 no. 14, pp. 1887-1894, July 28, 2012.

Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and Kosiba, Eva, "SERDP Tin Whisker Testing and Modeling: Low Stress Conditions," Tin Whisker Group Teleconference, July 25, 2012.

Murray, Charles, Tin Whiskers Again Cited as Potential Problem for Toyotas, DesignNews, July 25, 2012.

Osterman, Michael, "CALCE Whisker Research," Tin Whisker Group teleconference, July 11, 2012.

Sharma, Ashutosh, Bhattacharya, Sumit, Sen, Ranjan, Reddy, B. S. B., Fecht, H.-J., Das, Karabi, and Das, Siddhartha, "Influence of current density on microstructure of pulse electrodeposited tin coatings," Materials Characterization, vol. 68, pp. 22-32, June 2012.

Horvath, Barbara, Illes, Balazs, Shinohara, Tadashi, and Harsanyi, Gabor, "Whisker growth on annealed and recrystallized tin platings," Thin Solid Films, vol. 520 no. 17, pp. 5733-5740, June 30, 2012.

Xian, Ai-Ping, and Liu, Meng, "Effect of humidity on tin whisker growth from Sn3Nd intermetallic compound," Journal of Materials Research, vol. 27 no. 12, pp. 1652-1662, June 28, 2012.

Chinn, Jeff, "IST Super-Hydrophobic ALD Coatings," Tin Whisker Group teleconference, June 6, 2012.

Fortier, Aleksandra, and Pecht, Michael G., "Comparative Study of Metal Films and Their Affinity for Metal Whisker Growth," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 5, pp. 739-747, May 2012.

Terasaki, Takeshi, Kato, Takahiko, Iwasaki, Tomio, Ookura, Yasutaka, Nakamura, Masato, Ishii, Hideki, and Yamamoto, Kenji, "Prediction of Tin-Whiskers Generation during Thermal Cycle Test Using Stress and Mass-Diffusion Analysis," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 1183-1189.

Pei, Fei, Jadhav, Nitin, and Chason, Eric, "Correlating whisker growth and grain structure on Sn-Cu samples by real-time scanning electron microscopy and backscattering diffraction characterization ," Applied Physics Letters, vol. 100 no. 22, pp. 221902-1-221902-4, May 28, 2012.

Kostic, Andrew D., "The Aerospace Corporation Lead-Free Working Group (LFWG)," Tin Whisker Group teleconference, May 16, 2012.

Meschter, Stephen, Snugovsky, Polina, Kennedy, Jeff, McKeown, Steve, Bagheri, Zohreh, and Kosiba, Eva, "Tin Whisker Testing and Modeling: Low Stress Conditions," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 16-18, 2012, pp. xx-xx.

Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and Kosiba, Eva, "Tin Whisker Testing: Low Stress Conditions," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 15-18, 2012, pp. xx-xx.

Illes, Balazs, Horvath, Barbara, Lipak, Balazs, and Geczy, Attila, "Investigating Whisker Growth on Immersion Tin Surface Finishing," 2012 35th International Spring Seminar on Electronics Technology, Bad Aussee, Austria, May 9-13, 2012, pp. 242-247.

Anderson, Antony, "Sudden Acceleration/Surge Incident Brandon Street, Wellington NZ," May 9, 2012.

Brusse, Jay, Melting a TIN WHISKER Using a Volt/Ohm Meter, Youtube, May 3, 2012.

Kinoshita, Y., Matsushima, H., and Ohno, N., "Predicting active slip systems in b-Sn from ideal shear resistance," Modelling and Simulation in Materials Science and Engineering, vol. 20 no. 3, pp. 035003-1-035003-9, Apr. 2012.

Panashchenko, Lyudmyla, "The Art of Appreciating Metal Whiskers: A Practical Guide for Electronics Professionals," IPC Tin Whisker Symposium, Dallas, TX, Apr. 17, 2012, pp. xx-xx.

Panaschenko, Lyudmyla, "The Art of Metal Whisker Appreciation: A Practical Guide for Electronics Professionals," IPC International Tin Whisker Conference, Fort Worth, TX, Apr. 17-19, 2012, pp. xx-xx.

Stoyanov, Stoyan, Bailey, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim, and Roulston, John, "Thermal Modelling and Optimisation of Hot Solder Dip Process," 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Lisbon, Portugal, Apr. 16-18, 2012, pp. xx-xx.

Hillman, Dave, "Tin Whiskers: A 2012 State of the Industry Assessment," IPC Webinar, Apr. 5, 2012.

"Tin Whisker Mitigation on New and Stored Parts," Printed Circuit Design and Fab/ Circuits Assembly, vol. 29 no. 3, pp. 36-37, Mar. 2012.

Desmarest, S. Godard, "Reliability of Pb-free solders for harsh environment electronic assemblies," Materials Science and Technology, vol. 28 no. 3, pp. 257-273, Mar. 2012.

Jadhav, Nitin, Wasserman, Jacob, Pei, Fei, and Chason, Eric, "Stress Relaxation in Sn-Based Films: Effects of Pb Alloying, Grain Size, and Microstructure," Journal of Electronic Materials, vol. 41 no. 3, pp. 588-595, Mar. 2012.

"Examples of Whiskergrowing in Industry Applications," 3rd Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Genova, Italy, Mar. 21, 2012.

"Tin Whiskers 2012," 3rd Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Genova, Italy, Mar. 21, 2012.

Dunn, Barrie, "Conformal Coatings - the importance of mechanical properties with respect to tin whisker mitigation," 3rd Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Genova, Italy, Mar. 21, 2012.

Hunt, Christopher, "An Overview of NPL studies related to Spacecraft electronics'," 3rd Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Genova, Italy, Mar. 21, 2012.

Mozdzen, Grazyna, Jogl, Christian, and Schorn, Leopold, "Study on Tin Whiskers: Microstructure, Formation and Thickness of Tin Oxide," 3rd Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Genova, Italy, Mar. 21, 2012.

Hao, Hu, Xu, Guangchen, Song, Yonglun, Shi, Yaowu, and Guo, Fu, "A Model for Rapid Tin Whisker Growth on the Surface of ErSn3 Phase," Journal of Electronic Materials, vol. 41 no. 2, pp. 184-189, Feb. 2012.

Milad, George, "The Elimination of Whiskers from Electroplated Tin," Metal Finishing , vol. 110 no. 1, pp. 10-15, Jan.-Feb. 2012.

Snugovsky, Polina, Meschter, Stephan, Bagheri, Zohreh, Kosiba, Eva, Romansky, Marianne, and Kennedy, Jeffrey, "Whisker Formation Induced by Component and Assembly Ionic Contamination," Journal of Electronic Materials, vol. 41 no. 2, pp. 204-223, Feb. 2012.

Smetana, Joe, "HDPUG Pb-Free Board Materials Reliability Project 2: Moisture Sensitivity and Its Effect on Delamination," Tin Whisker Group teleconference, Feb. 29, 2012.

Tranitz, Hans-Peter, and Dunker, Sebastian, "Growth Mechanisms of Tin Whiskers at Press-in Technology," IPC APEX EXPO, San Diego, CA, Feb. 28, 2012.

Biglari, M. H., Nazarian, A., Denteneer, R., Biglari Jr., M., and Kodentsov, A. A., "Reliability of BGA Solder Joints after Re-Balling Process," IPC APEX Expo 2012, San Diego, CA, Feb. 28-Mar. 1, 2012, pp. xx-xx.

Hillman, Dave, Pearson, Tim, and Lesniewski, Thomas, "An Investigation of Whisker Growth on Tin Coated Wire and Braid," IPC APEX Expo 2012, San Diego, CA, Feb. 28-Mar. 1, 2012, pp. xx-xx.

Lee, David M., and Pinol, Lesly A., "Effects of Tin and Copper Nanotexturization on Tin Whisker Formation," IPC APEX Expo 2012, San Diego, CA, Feb. 28-Mar. 1, 2012, pp. xx-xx.

Chason, Eric, "Real-Time Study of Whisker/Hillock Formation in Sn-Cu Systems by EBSD Characterization," Tin Whisker Group teleconference, Feb. 22, 2012.

Pei, Fei, Jadhav, Nitin, Buchovecky, Eric, Chason, Eric, Bower, Allan, and Kumar, Sharvan, "Real-Time Study of Whisker/Hillock Formation in Sn-Cu Systems by EBSD Characterization," Tin Whisker Group Teleconference, Feb. 22, 2012.

Bozack, Michael J., "Research Activities in Surface Physics," Tin Whisker Group teleconferences, Feb. 15, 2012, Mar. 21, 2012, and Apr. 25, 2012.

Mason, Maribeth, Eng, Genghmun, Leung, Martin, Stupian, Gary, and Yeoh, Terence, "Tin Whisker Risk Assessment for Space Systems," Electronic Device Failure Analysis, vol. 14 no. 1, pp. 14-20, Feb. 2012.

Chawla, Nik, "Overview of Pb-free Solder Research Activities," Tin Whisker Group teleconference, Feb. 1, 2012.

Nakai, Kiyomichi, Sakamoto, Tatsuaki, Miyamoto, Takeaki, and Kobayashi, Sengo, "Formation of whisker in pure Sn under tensile stress and a method of its suppression," Materials Science Forum, vol. 706-709, pp. 751-756, Jan. 2012.

Sorensen, Henning O., Schmidt, Soren, Wright, Jonathan P., Vaughan, Gavin B. M., Techert, Simone, Garman, Elspeth F., Oddershede, Jette, Davaasambuu, Jav, Paithankar, Karthik S., Gundlach, Carsten, and Poulsen, Henning F., "Multigrain crystallography," Zeitschrift fur Kristallographie - Crystalline Materials, vol. 227 no. 1, pp. 63-78, Jan. 2012.

Susan, Donald F., Michael, Joseph R., Yelton, W. Graham, McKenzie, Bonnie B., Grant, Richard P., Pillars, Jamin, and Rodriguez, Mark A., "Understanding and Predicting Metallic Whisker Growth and its Effects on Reliability: LDRD Final Report,", Sandia Report SAND2012-0519, Jan. 2012.

Umeno, Yoshitaka, and Negami, Jun, "Atomistic Simulation of Stress-Induced Grain Boundary Diffusion: For Tin-Whisker Problem," Materials Science Forum, vol. 706-709, pp. 1545-1549, Jan. 2012.

Smetana, Joe, "A Standard Multilayer Printed Wiring Board for Material Reliability Evaluations," Tin Whisker Group teleconference, Jan. 18, 2012.

Osterman, Michael, "Assessment of Tin Whisker Mitigation for Conformally Coated SnPb Assemblies," Tin Whisker Group teleconference, Jan. 11, 2012.

2011: 3 books, 5 theses, 105 papers, and 6 web pages on tin whiskers

Cheng, Jing, Tin Whiskers in Electronic Packaging: Mechanism and Modeling. Ph. D. Thesis for University of Rochester, Rochester, NY, 2011.

Grossmann, Gunter, and Zardini, Christian, The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects. New York: Springer, 2011. ISBN 978-0-85729-235-3. $129.00 list price.

Han, Jung Kyu, Effect of Thermo-Electromigration on Copper Dissolution and Intermetallic Compound Formation in Flip-Chip Pb-free Solder Joints. Ph. D. Thesis for University of California, Los Angeles, CA, 2011.

Henshall, Greg, Bath, Jasbir, and Handwerker, Carol A., Lead-Free Solder Process Development. Hoboken, NJ: John Wiley & Sons, 2011. ISBN 978-0-470-41074-5. $99.95 list price.

Hino, Makoto, Murakami, Koji, Mitooka, Yutaka, Muraoka, Ken, and Takamizawa, Masao, "Effect of Corrosion Atmosphere Using Environmental Test Chamber on Whisker Growth of Tin Electroplating," Journal of The Surface Finishing Society of Japan, vol. 62 no. 1, pp. 41-46, 2011.

Hua, L., Su, M. W., Zhang, W. J., and Hu, Q. L., "Electrochemical migration and rapid whisker growth of Zn and Bi dopings in Sn-3.0Ag-0.5Cu Solder in 3wt.% NaCl Solution," Advanced Materials Research, vol. 239-242, pp. 1751-1760, 2011.

Liu, Meng, and Xian, AiPing, "TEM observation of tin whisker," Science China Technological Sciences , vol. 54 no. 6, pp. 1546-1550, 2011.

Liu, W., Zschack, P., Tischler, J., Ice, G., and Larson, B., "X-ray Laue Diffraction Microscopy in 3D at the Advanced Photon Source," AIP Conference Proceedings, vol. 1365, pp. 108-111, 2011. https://doi.org/10.1063/1.3625316

Meschter, Stephan, McKeown, Steve, Snugovsky, Polina, Kennedy, Jeff, and Kosiba, Eva, "Tin Whisker Testing and Risk Modeling Project," SMTA Journal, vol. 24 no. 3, pp. 23-31, 2011.

Michael, Joseph R., McKenzie, Bonnie, and Susan, Don F., "Crystallographic Characterization of Whiskers using EBSD: Examples from Tin Whiskers," Sandia Report SAND2011-5221C, 2011.

Milad, George, "The elimination of whiskers from electroplated tin," Circuit World , vol. 37 no. 4, pp. 10-15, 2011.

Murakami, Koji, Hino, Makoto, Mitooka, Yutaka, and Kanadani, Teruto, "Formation and growth of tin whiskers on aluminum-tin alloys," Journal of Japan Institute of Light Metals, vol. 61 no. 4, pp. 142-148, 2011.

Skwarek, Agata, Pluska, Mariusz, Ratajczak, Jacek, Czerwinski, Andrzej, Witek, Krzysztof, and Szwagierczak, Dorota, "Analysis of tin whisker growth on lead-free alloys with Ni presence under thermal shock stress," Materials Science and Engineering B: Solid-State Materials for Advanced Technology, vol. 176 no. 4, pp. 352-357, 2011. https://doi.org/10.1016/j.mseb.2010.10.001

Sood, Bhanu, Osterman, Michael, and Pecht, Michael, "Tin whisker analysis of Toyota's electronic throttle controls," Circuit World, vol. 37 no. 3, pp. 4-9, 2011.

Su, Chien-Hao, Chen, Hao, Lee, Hsin-Yi, and Wu, Albert T., "Controlled positions and kinetic analysis of spontaneous tin whisker growth," Applied Physics Letters, vol. 99, pp. 131906-1-131906-3, 2011.

Susan, D. F., Vianco, P. T., Yelton, W. G., and Michael, J. R., "Recent Tin Whisker Research at Sandia," Sandia Report SAND2011-9133C, 2011.

Wright, Roger N., Wire Technology: Process Engineering and Metallurgy. Elsevier, 2011. ISBN 978-0-12-382092-1.

Zhang, Jinsong, and Zhang, Jianhua, "Estimation of whiskers growth on Sn coating of Cu-Leads in different accelerated tests," Advanced Materials Research, vol. 160-162, pp. 1575-1581, 2011.

Clore, Nicholas G., Identification and Counting Procedure for Tin Whiskers, Hillocks, and Other Surface Defects. Master's Thesis for Purdue University, Hammond, IN, Dec. 2011.

Hua, L., and Yang, C., "Corrosion behavior, whisker growth, and electrochemical migration of Sn-3.0Ag-0.5Cu solder doping with In and Zn in NaCl solution," Microelectronics Reliability, vol. 51 no. 12, pp. 2274-2283, Dec. 2011. https://doi.org/10.1016/j.microrel.2011.06.023

Li, C. F., Liu, Z. Q., Shang, P. J., and Shang, J. K., "In situ investigation on the oxidation behavior of a RESn3 film by transmission electron microscopy," Scripta Materialia, vol. 65 no. 12, pp. 1049-1052, Dec. 2011.

Pinol, Lesly A., Melngailis, John, Charles, Harry K., Lee, David M., Deacon, Ryan, Coles, George, and Clatterbaugh, Guy, "Influence of Tin Deposition Methods on Tin Whisker Formation," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 12, pp. 2028-2032, Dec. 2011.

O'Boyle, John, "Tin Whiskers Are Real and Complex," maxim integrated Tutorials 5250, Dec. 13, 2011.

Baated, Alongheng, Kim, Keun-Soo, and Suganuma, Katsuaki, "Effect of intermetallic growth rate on spontaneous whisker growth from a tin coating on copper," Journal of Materials Science: Materials in Electronics, vol. 22 no. 11, pp. 1685-1693, Nov. 2011.

Baated, Alongheng, Hamasaki, Kyoko, Kim, Sun Sik, Kim, Keun-Soo, and Suganuma, Katsuaki, "Whisker Growth Behavior of Sn and Sn Alloy Lead-Free Finishes," Journal of Electronic Materials, vol. 40 no. 11, pp. 2278-2289, Nov. 2011.

Fjelstad, Joe, "Whiskers - a coming of age event in the life of electronics too?," Global SMT and Packaging, vol. 11 no. 11, pp. 88-89, Nov. 2011.

Sobiech, M., Teufel, J., Welzel, U., Mittemeijer, E. J., and Hugel, W., "Stress Relaxation Mechanisms of Sn and SnPb Coatings Electrodeposited on Cu: Avoidance of Whiskering," Journal of Electronic Materials, vol. 40 no. 11, pp. 2300-2313, Nov. 2011.

Suganuma, Katsuaki, Baated, Alongheng, Kim, Keun-Soo, Hamasaki, Kyoko, Nemoto, Norio, Nakagawa, Tsuyoshi, and Yamada, Toshiyuki, "Sn whisker growth during thermal cycling," Acta Materialia, vol. 59 no. 19, pp. 7255-7267, Nov. 2011.

"Tin Whisker Qualification and Reliability Testing," Printed Circuit Design and Fab/ Circuits Assembly, vol. 28 no. 10, pp. 37,39, Oct. 2011.

Chason, Eric, Jadhav, Nitin, and Pei, Fei, "Effect of Layer Properties on Stress Evolution, Intermetallic Volume, and Density during Tin Whisker Formation," JOM, vol. 63 no. 10, pp. 62-68, Oct. 2011.

Cheng, Jing, Yang, Fuqian, Vianco, Paul T., Zhang, Bei, and Li, James C. M., "Optimum Thickness of Sn Film for Whisker Growth," Journal of Electronic Materials, vol. 40 no. 10, pp. 2069-2075, Oct. 2011.

Osenbach, J. W., "Tin Whiskers: An Illustrated Guide to Growth Mechanisms and Morphologies," JOM, vol. 63 no. 10, pp. 57-60, Oct. 2011.

Horvath, Barbara, Illes, Balazs, Shinohara, Tadashi, and Harsanyi, Gabor, "Effects of Humidity on Tin Whisker Growth - Investigated on Ni and Ag Underplated Layer Construction," Thin Solid Films, vol. 520 No. 1, pp. 384-390, Oct. 31, 2011.

Clore, Nicholas, "Identification and Counting Procedure for Tin Whiskers, Hillocks, and Other Surface Defects," Tin Whisker Group teleconference, Oct. 26, 2011.

Illes, Balazs, Horvath, Barbara, Shinohara, Tadashi, and Harsanyi, Gabor, "Tin Whisker Growth from Sn-Cu (0.5 wt%) Surface Finishes," 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging , Timisoara, Romania, Oct. 20-23, 2011, pp. 49-54.

Davy, Gordon, "Tin-Whisker-Impenetrable Metal Cap Process for Electronic Assemblies: An Analysis of Cap TW Penetrability and Prevention vs. Mitigation," Tin Whisker Group teleconferences, Oct. 19, 2011, Nov. 2, 2011, Nov. 9, 2011, Nov. 16, 2011, Dec. 7, 2011, Dec. 21, 2011, and Jan. 25, 2012.

Hillman, Dave, and Hamand, Matt, "Tin Whiskers: A 2011 State of the Industry Assessment (Tutorial T6)," SMTA International 2011 Conference, Fort Worth, TX, Oct. 16-20, 2011.

Primavera, Anthony A., "In-process Reduction/Mitigation of Tin Whiskers by Condensing Vapor Reflow," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 873-880.

Sarobol, Pylin, Chen, Wei-Hsun, Blendell, John E., Su, Peng, and Handwerker, Carol A., "Effects of Grain Misorientations & Strain Distribution on the Location of Whisker Formation on Electroplated Sn-Cu films," SMTA International 2011 Conference, Fort Worth, TX, Oct. 16-20, 2011.

Brusse, Jay, "Electrical Failure of an Accelerator Pedal Position Sensor Caused by a Tin Whisker and Discussion of Investigative Techniques Used for Whisker Detection," Tin Whisker Group teleconference, Oct. 12, 2011.

Pillars, Jamin, Susan, Don, Michael, Joseph, Limmer, Stephen, and Yelton, Graham, "Controlling the Direction of Strain Energy Driving Forces Responsible for Whisker Growth," 5th Annual Sn Whisker Symposium, College Park, MD, Sept. 2011, pp. xx-xx. (Sandia Report SAND2011-6490C)

Shi, Hong-Chang, and Xian, Ai-Ping, "Tin Whisker Growth on NdSn3 Powder," Journal of Electronic Materials , vol. 40 no. 9, pp. 1962-1966, Sept. 2011.

Sun, Yong, Hoffman, Elizabeth N., Lam, Poh-Sang, and Li, Xiaodong, "Evaluation of local strain evolution from metallic whisker formation," Scripta Materialia, vol. 65 no. 5, pp. 388-391, Sept. 2011.

Wang, Yibo, A Numerical Model of Anisotropic Mass Transport Through Grain Boundary Networks. Master's Thesis for Lehigh University, Bethlehem, PA, Sept. 2011.

"iNEMI Updates Tin Whiskers Findings," SMT Web Exclusive Article. (before Sept. 16, 2011)

"Nano Whiskers." (before Sept. 16, 2011)

"Tin Whiskers Syfer Surface Mount Capacitors," Syfer Application Note AN0019 Issue 3. (before Sept. 16, 2011)

Hilty, Robert D., "Tin Whiskers in Electronics Components," Tyco Electronics. (before Sept. 16, 2011)

Vicenzo, Antonello, "Tin Whiskers: Testing and Mitigation." SEMICON Europa 2006, Munich, Germany, Apr. 5, 2006, pp. xx-xx. (before Sept. 16, 2011)

Leidecker, Henning, Panashchenko, Lyudmyla, and Brusse, Jay, "Electrical Failure of an Accelerator Pedal Position Sensor Caused by a Tin Whisker and Discussion of Investigative Techniques Used for Whisker Detection," 5th International Tin Whisker Symposium, College Park, MD, Sept. 14-15, 2011, pp. xx-xx.

Susan, Don F., Michael, Joe, McKenzie, Bonnie, and Yelton, Graham, "Crystallographic Analysis of Tin Whiskers with SEM/EBSD," 5th Annual Tin Whisker Conference, College Park, MD, Sept. 14-15, 2011, pp. xx-xx. (Sandia Report SAND2011-7551C).

Crandall, E. R., Flowers, G. T., Jackson, R., Lall, P., and Bozack, M. J., "Growth of Sn Whiskers Under Net Compressive and Tensile Stress States," 2011 IEEE 57th Holm Conference on Electrical Contacts, Minneapolis, MN, Sept. 11-14, 2011, pp. xx-xx.

Crandall, E. R., Flowers, G. T., Lall, P., and Bozack, M. J., "Whisker Growth Under Controlled Humidity Exposure," 2011 IEEE 57th Holm Conference on Electrical Contacts, Minneapolis, MN, Sept. 11-14, 2011, pp. xx-xx.

Rodekohr, C. L, Flowers, G. T., Bozack, M. J., Jackson, R., Martens, R., Zhao, Z., Crandall, E. R., Starman, V., Bitner, T., and Street, J., "Correlation of Intrinsic Thin Film Stress Evolution and IMC Growth with Whisker Growth," 2011 IEEE 57th Holm Conference on Electrical Contacts , Minneapolis, MN, Sept. 11-14, 2011, pp. xx-xx.

Zak, Pavel, Tucan, Marek, and Kudlacek, Ivan, "Lead-free Car Electronics According to Updated ELV Directive," 2011 International Conference on Applied Electronics, Pilsen, Czech Republic, Sept. 7-8, 2011, pp. xx-xx.

Jain, C. C., Chen, C. L., Lai, H. J., and Chuang, T. H., "The Inhibition of Tin Whiskers on the Surface of Sn-8Zn-3Bi-0.5Ce Solders," Journal of Materials Engineering and Performance, vol. 20 no. 6, pp. 1042-1048, Aug. 2011.

Xu, C. H., Qin, X. M., Guo, W. H., and Li, Y., "Protrusion and whisker growth on tin coated copper substrate under stresses," Materials Science and Technology, vol. 27 no. 8, pp. 1271-1274, Aug. 2011.

Zeng, Guang, Xue, Songbai, Zhang, Liang, Gao, Lili, Lai, Zhongmin, and Luo, Jiadong, "Properties and microstructure of Sn-0.7Cu-0.05Ni solder bearing rare earth element Pr," Journal of Materials Science: Materials in Electronics , vol. 22 no. 8, pp. 1101-1108, Aug. 2011.

Shin, Ho Sun, Yu, Jin, Song, Jae Yong, and Park, Hyun Min, "Size-dependent lattice parameters of microstructure-controlled Sn nanowires," Journal of Materials Research, vol. 26 no. 16, pp. 2033-2039, Aug. 28, 2011.

Kostic, Andrew D., "Lead-free Electronics Reliability - An Update," Tin Whisker Group teleconferences, Aug. 24, 2011 and Aug. 31, 2011.

Ampeg B-12-XY: Tin Whiskers!, Aug. 2, 2011.

Smetana, Joe, "Pb-free Solder Joint Reliability in a Mildly Accelerated Test Condition," Tin Whisker Group teleconference, Aug. 10, 2011.

Hao, Hu, Tian, Jun, Xu, Guangchen, Guo, Fu, Song, Yonglun, and Shi, Yaowu, "Irregular Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0RE Solder Joints," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 793-796.

Li, Cai-Fu, Liu, Zhi-Quan, and Shang, Jian-Ku, "Transmission Electron Microscopy Investigations on the Growth of Tin Whiskers from CeSn3 Substrate," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 903-906.

Liu, Ting, Wang, Yiqing, Ding, Dongyan, Galuschki, Klaus-Peter, Hu, Yu, Gong, Yihua, Li, Ming, and Mao, Dali, "Tin Whisker Formation on Electroless Tin Films Deposited on Lead-frame Alloys," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 810-814.

Galyon, George, "Whisker Formation Concepts - The End Game," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 7, pp. 1098-1109, July 2011.

Lee, Hua-Xing, Chan, Kah-Yoong, and Shakur, Mohd Hamdi Abdul, "Effects of Annealing on Sn Whisker Formation Under Temperature Cycling and Isothermal Storage Conditions," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 7, pp. 1110-1115, July 2011.

Lienert, U., Li, S. F., Hefferan, C. M., Lind, J., Suter, R. M., Bernier, J. V., Barton, N. R., Brandes, M. C., Mills, M. J., Miller, M. P., Jakobsen, B., and Pantleon, W., "High-Energy Diffraction Microscopy at the Advanced Photon Source," JOM , vol. 63 no. 7, pp. 70-77, July 2011.

Michael, J. R., McKenzie, B. B., and Susan, D. F., "Crystallographic Characterization of Whiskers Using EBSD," Microscopy and Microanalyses, vol. 17 no. S2, pp. 392-393, July 2011.

Welzel, Udo, "Breakthroughs in understanding elastic grain interaction and whisker formation made possible by advances in X-ray power diffraction," International Journal of Materials Research, vol. 102 no. 7, pp. 846-860, July 2011. DOI: 10.3139/146.110539

Naor-Pomerantz, Adi, Eliaz, Noam, and Gileadi, Eliezer, "Electrodeposition of rhenium-tin nanowires," Electrochimica Acta , vol. 56 no. 18, pp. 6361-6370, July 15, 2011. https://doi.org/10.1016/j.electacta.2011.05.022

Smith, Steve, "Fluid Physics," Tin Whisker Group teleconference, July 13, 2011.

Mathew, Sony, Wang, Weiqiang, Osterman, Michael, and Pecht, Michael, "Assessment of Solder-Dipping as a Tin Whisker Mitigation Strategy," IEEE Transactions on Components, Packaging and Manufacturing Technology , vol. 1 no. 6, pp. 957-963, June 2011.

Wang, Jiangiang, Bi, Kedong, and Chen, Yunfei, "Molecular dynamic simulations of contact thermal resistance between two individual silicon nanowires," Key Engineering Materials, vol. 483, pp. 663-667, June 2011.

Yen, Yee-Wen, Liou, Wei-kai, and Jao, Chien-Chung, "Investigation of Interfacial Reactions and Sn Whisker Formation in the Matte Sn Layer With NiP/Ni/Cu and Ni/Cu Multilayer Systems," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 6, pp. 951-956, June 2011.

Sobiech, Matthias, Kruger, Carmen, Welzel, Udo, Wang, Jiang-Yang, Mittemeijer, Eric Jan, and Hugel, Werner, "Phase formation at the Sn/Cu interface during room temperature aging: Microstructural evolution, whiskering, and interface thermodynamics," Journal of Materials Research, vol. 26 no. 12, pp. 1482-1493, June 28, 2011.

Zeng, Guang, Xue, Songbai, Gao, Lili, Zhang, Liang, Hu, Yuhua, and Lai, Zhongmin, "Interfacial microstructure and properties of Sn-0.7Cu-0.05Ni/Cu solder joint with rare earth Nd addition," Journal of Alloys and Compounds, vol. 509 no. 25, pp. 7152-7161, June 23, 2011.

Gilbert, Dave, "Toyota Sudden Unintended Acceleration," Tin Whisker Group teleconference, June 22, 2011.

Cheng, Jing, Vianco, Paul T., Zhang, Bei, and Li, James C. M., "Nucleation and growth of tin whiskers," Applied Physics Letters, vol. 98 no. 24, pp. 241910-1-241910-3, June 13, 2011.

Buetow, Mike, "USAF Seeks Sn Whisker Mitigation Proposals," Printed Circuit Design and Fab/ Circuits Assembly, vol. 28 no. 5, pp. 10, May 2011.

Pedigo, Aaron E., The Influence of the Effective Physical Properties of Tin Electrodeposited Films on the Growth of Tin Whiskers. Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2011.

Kane, Sean, Liberman, Ellen, DiViesti, Tony, Click, Felix, and MacDonald, Melanie, "An Examination of the National Highway Traffic Safety Administration and the National Aeronautics and Space Administration Engineering Safety Center Assessment and Technical Evaluation of Toyota Electronic Throttle Control (ETC) Systems and Unintended Acceleration," May 23, 2011.

Chinniah, Karuna, Amundan, Kalai Selvan, Kee, Tan Suan, Gill, Diesh, and Raj, Sundra, "Studies on a Newly Discovered White Whiskers Causing Battery Leakage," South East Asia Technical Conference on Electronics Assembly Technologies 2011 , Penang, Malaysia, May 19-20, 2011, pp. xx-xx.

Hester, Tom, "Tin Whisker Self-Mitigation in Surface Mount Components," Tin Whisker Group teleconference, May 11, 2011.

Illes, Balazs, Horvath, Barbara, and Lipak, Balazs, "Investigating Whisker Growth on Annealed and Recrystallized Tin Platings," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 141-146.

Zak, Pavel, Tucan, Marek, and Kudlacek, Ivan, "Tin Coating of Connectors - Reliability Risk for Electrical Equipment," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 229-233.

Landman, Robert J., Davy, Gordon, and Fritz, Dennis D., "Whisker-Impenetrable Metal Cap Process for Electronic Assemblies," International Conference on Soldering & Reliability 2011 Proceedings , Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

McCormick, Heather, Chow, Jimmy, Snugovsky, Polina, Kosiba, Eva, and Meschter, Stephan, "Development of a Test Vehicle for the Study of Tin Whiskers," International Conference on Soldering & Reliability 2011 Proceedings , Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, McKeown, Steve, and Kosiba, Eva, "Tin Whisker Testing and Risk Modeling Project," International Conference on Soldering & Reliability 2011 Proceedings, Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

Perovic, Doug, Snugovsky, Leonid, Rutter, John, Snugovsky, Polina, Bagheri, Zohreh, and Meschter, Stephan, "Microstructure and Whisker Growth of SAC Solder Alloys with Rare Earth Additions in Different Environments," International Conference on Soldering & Reliability 2011 Proceedings, Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

Hunt, Christopher, "Reliability issues with lead-free," 2nd Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Paris, France, May 4, 2011.

Susan, Don, Vianco, Paul, Yelton, Graham, and Michael, Joe, "Recent Research on Tin Whiskers at Sandia," 5th International Brazing and Soldering Conference, Las Vegas, NV, Apr. 27, 2011, pp. xx-xx. (Sandia Report SAND2012-3310C)

Lee, David M., and Pinol, Lesly A., "Effects of Tin Whisker Formation on Nanocrystalline Copper," IPC APEX Expo Technical Conference 2011, Las Vegas, NV, April 12-14, 2011, pp. xx-xx.

Tsujimoto, Masanobu, Hashimoto, Shigeo, Kiso, Masayuki, Ikumoto, Raihei, Kano, Toshikazu, Kanamori, Genki, Gudeczauskas, Don, and Milad, George, "The Elimination of Whiskers from Electroplated Tin," IPC APEX Expo Technical Conference 2011, Las Vegas, NV, April 12-14, 2011 pp. 555-603.

Mason, Maribeth, Eng, Genghmun, Leung, Martin, Stupian, Gary, and Yeoh, Terence, "Microanalysis for Tin Whisker Risk Assessment," 2011 IEEE International Reliability Physics Symposium, Monterey, CA, Apr. 10-14, 2011, pp. 2G.3.1-2G.3.5.

Savage, Timothy Scott, "The Implications of RoHS on Active Implantable Medical Devices," 2011 IEEE International Reliability Physics Symposium, Monterey, CA, Apr. 10-14, 2011, pp. 3B.1.1-3B.1.7.

Buetow, Mike, "Tin Ears," Printed Circuit Design and Fab/ Circuits Assembly , vol 28 no. 3, pp. 6, Mar. 2011.

Buetow, Mike, "Tin Whiskers Found in Toyota ETC," Printed Circuit Design and Fab/ Circuits Assembly, vol 28 no. 3, pp. 10,12, Mar. 2011.

Chuang, Tung-Han, and Jain, Chao-Chi, "Morphology of the Tin Whiskers on the Surface of a Sn-3Ag-0.5Cu-0.5Nd Alloy," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 42 no. 3, pp. 684-691, Mar. 2011. https://doi.org/10.1007/s11661-010-0454-5

Howard, H. P., Cheng, J., Vianco, P. T., and Li, J. C. M., "Interface flow mechanism for tin whisker growth," Acta Materialia , vol. 59 no. 5, pp. 1957-1963, Mar. 2011.

Ulrich, O., Biquard, X., Bleuet, P., Geaymond, O., Gergaud, P., Micha, J. S., Robach, O., and Rieutord, F., "A new white beam x-ray microdiffraction setup on the BM32 beamline at the European Synchrotron Radiation Facility," Review of Scientific Instruments, vol. 82 no. 3, pp. 033908-1-033908-6, Mar. 2011.

Asrar, Nausha, "Detrimental Effects of Excessive Gold Plating on Lead-Free Solder Joints," Electronic Device Failure Analysis, vol. 13 no. 1, pp. 4,6-8,10-11, Feb. 2011.

Verdi, Fred, "Susceptibility Testing for Tin Whiskers," Tin Whisker Group teleconference, Feb. 23, 2011.

Tin Whisker Summary (before Feb. 13, 2011)

Tin Whiskers (before Feb. 13, 2011)

Pb-free (Lead Free) Frequently Asked Questions (before Feb. 12, 2011)

Plating (before Feb. 12, 2011)

Osenbach, John, "Creep and It's Affect on Sn Whisker Growth," Tin Whisker Group teleconferences, Feb. 9, 2011 and Feb. 16, 2011.

Ye, Huan, Xue, Songbai, Zhang, Liang, Xiao, Zhengxiang, Hu, Yuhua, Lai, Zhongmin, and Zhu, Hong, "Sn whisker growth in Sn-9Zn-0.5Ga-0.7Pr lead-free solder," Journal of Alloys and Compounds, vol. 509 no. 5, pp. L52-L55, Feb. 3, 2011.

Li, Juchuan, Yang, Fuqian, Ye, Jia, and Cheng, Yang-Tse, "Whisker formation on a thin film tin lithium-ion battery anode," Journal of Power Sources, vol. 196 no. 3, pp. 1474-1477, Feb. 1, 2011.

Cheng, Jing, Vianco, Paul T., Subjeck, Joeseph, and Li, James C. M., "An assessment of Sn whiskers and depleted area formation in thin Sn films using quantitative image analysis," Journal of Materials Science, vol. 46 no. 1, pp. 263-274, Jan. 2011.

Chuang, Tung-Han, and Wu, Hsing-Fei, "Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder Joints," Journal of Electronic Materials, vol. 40 no. 1, pp. 71-77, Jan. 2011.

Yen, Yee-Wen, Li, Chao-Kang, Tsou, Meng-Yu, and Shao, Pei-Sheng, "Substrate Shape Effect on the Sn Whisker Growth in the Electroplating Matte Sn System," Japanese Journal of Applied Physics, vol. 50 no. 1S2, pp. 01BJ07-1-01BJ07-4, Jan. 2011.

Zhang, Wan, Guebey, Jonas, and Toben, Michael, "A Novel Electrolyte for the High Speed Electrodeposition of Bright Pure Tin at Elevated Temperatures," Metal Finishing, vol. 109 no. 1-2, pp, 13-19, Jan.-Feb. 2011.

Touw, Anduin, "GEIA-HB-0005-4 Guidelines for Performing Reliability Assessment for Pb Free Assemblies used in Aerospace and High-Performance Electronic Applications," Tin Whisker Group teleconference, Jan. 26, 2011.

NASA What's New, Jan. 24, 2011.

Touw, Anduin, "GEIA-STD-0005-2 Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems, Rev A draft 1/5/11," Tin Whisker Group teleconference, Jan. 19, 2011.

"Technical Support to the National Highway Traffic Safety Administration (NHTSA) on the Reported Toyota Motor Corporation (TMC) Unintended Acceleration (UA) Investigation, Version 1.0." NASA. Jan. 18, 2011.

"GEIA-STD-0005-2 Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems," Rev A draft Jan. 5, 2011.

2010: 2 books, 2 theses, 115 papers, and 0 web pages on tin whiskers

Lead-Free Defect Guide 2, SMART Group, 2010.

Galyon, George T., "Tin Whisker to Dos-2010." 2010.

Kim, Keun-Soo, Kim, Sun-Sik, Kim, Seong-Jun, Suganuma, Katsuaki, Tsujimoto, Masanobu, and Yanada, Isamu, "Prevention of Sn whisker formation by surface treatment of Sn plating Part II," 2010.

Kuwano, Noriyuki, Jinnouchi, Atsushi, Horikami, Sadanori, Hirokado, Naruyoshi, and Sosiati, Harini, "Effects of Post-Plating Reflow on Changes in Crystal Grain Size of Sn-2 mass%Bi Alloy Plating with Thermal Cycling Treatment," Materials Transactions, vol. 51 no. 10, pp. 1741-1746, 2010.

Liang, S. W., Chen, Chih, Han, J. K., Xu, Luhua, Tu, K. N., and Lai, Yi-Shao, "Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration," Journal of Applied Physics, vol. 107 no. 9, pp. 093715-1-093715-4, 2010.

Murakami, Koji, Okano, Masako, Hino, Makoto, Takamizawa, Masao, and Nakai, Kiyomichi, "Mechanism of Generation and Suppression of Tin Whiskers on Tin and Tin-Lead Plated Films," Materials Transactions, vol. 51 no. 1, pp. 143-151, 2010.

Pinol, Lesly Agnes, Fundamental Studies of Tin Whiskering in Microelectronics Finishes . Ph. D. Thesis for University of Maryland, College Park, MD, 2010.

Wilcox, G. D., "Whiskers," Transactions of the IMF, vol. 88 no. 2, pp. 81-82, 2010. https://doi.org/10.1179/174591910X12646066373883

Xiao, X., Sachdev, A. K., Haddad, D., Li, Y., Sheldon, B. W., and Soni, S. K., "Stress-induced Sn Nanowires from Si-Sn Nanocomposite Coatings," Applied Physics Letters, vol. 97, pp. 141904-1-141904-3, 2010.

Beilis, Isak I., Koulik, Yosef, Boxman, Raymond L., and Arbilly, David, "Thin film deposition using a plasma source with a hot refractory anode vacuum arc," Journal of Materials Science, vol. 45 no. 23, pp. 6325-6331, Dec. 2010.

Champaign, Robert F., and Ogden, Robert R., "Microscopy Study of Tin Whiskers," Journal of Failure Analysis and Prevention, vol. 10 no. 6, pp. 444-449, Dec. 2010.

Miller, Sarah M., Sahaym, Uttara, and Norton, M. Grant, "Effect of Substrate Composition on Sn Whisker Growth in Pure Sn Films," Metallurgical and Materials Transactions A, vol. 41 no. 13, pp. 3386-3395, Dec. 2010. https://doi.org/10.1007/s11661-010-0431-z

Zhang, Jinsong, and Zhang, Jianhua, "Mechanism of whisker growth on pure Sn coating of Cu leads in the high temperature/humidity storage tests," Applied Mechanics and Materials , vol. 44-47, pp. 2691-2695, Dec. 2010.

Illes, Balazs, Horvath, Barbara, and Harsanyi, Gabor, "Effect of strongly oxidizing environment on whisker growth form tin coating," Surface and Coatings Technology, vol. 205 no. 7, pp. 2262-2266, Dec. 25, 2010. https://doi.org/10.1016/j.surfcoat.2010.09.012

Leidecker, Henning, "Metal Vapor Sparking and Arcing," Tin Whisker Group teleconference, Dec. 22, 2010.

Smith, Steve, Rollins, Bill, and Minter, Charlie, "The Whisker-Tough Conformal Coating: A Certain Solution to an Uncertain Problem," Tin Whisker Group teleconference, Dec. 8, 2010.

Panashchenko, Lyudmyla, Brusse, Jay, and Leidecker, Henning, "Long Term Investigation of Urethane Conformal Coating Against Tin Whisker Growth," IPC Tin Whiskers Conference, Chicago, IL, Dec. 6-7, 2010, pp. xx-xx.

Verdi, Fred, Yu, Phillip, Sneh, Ofer, Toscano, Lenora, and Gallager, George, "Susceptibility Testing for Tin Whiskers," IPC Tin Whiskers Conference , Chicago, IL, Dec. 6-7, 2010, pp. xx-xx.

"Matte Tin Plating Whisker Data," Lattice Product Bulletin PB1227H, Nov. 2010.

Ozaltun, Sevim, and Karadeniz, Serdar, "Development of an apparatus for determining the free tin thickness on tin-plated copper wire," Wire Journal International, vol. 43 no. 11, pp. 63-67, Nov. 2010.

Chang, Ming, Chen, Po-Cheng, Lin, Chung-Po, and Chang, Yu-Han, "Assembly of Nanostructures by Using a Mechanical Nanomanipulator," Key Engineering Materials, vol. 450, pp. 263-266, Nov. 2010.

Sauter, L., Seekamp, A., Shibata, Y., Kanameda, Y., and Yamashita, H., "Whisker mitigation measures for Sn-plated Cu for different stress tests," Microelectronics Reliability, vol. 50 no. 9-11, pp. 1631-1635, Sept.-Nov. 2010.

Sobiech, M., Kruger, C., Welzel, U., Wang, J. Y., Mittemeijer, E. J., and Hugel, W., "Evolution of microstructure and stress of and associated whisker growth on Sn layers sputter-deposited on Cu substrates," Journal of Materials Research, vol. 25 no. 11, pp. 2166-2174, Nov. 2010.

Smith, Steve, Rollins, Bill, and Minter, Charlie, "The Whisker-Tough Conformal Coating: A Certain Solution to an Uncertain Problem," DMC 2010, Las Vegas, NV, Nov. 29-Dec. 2, 2010, pp. xx-xx.

Handwerker, Carol A., "iNEMI Tin Whisker Project: Overview," CARE Innovation 2010, Vienna, Austria, Nov. 8-11, 2010, pp. xx-xx.

Champaign, Robert, "Sn Whiskers?," McKinney Failure Analysis Lab. (before Nov. 5, 2010)

Handwerker, C. A., Pedigo, A. E., Sarabol, P., Blendell, J. E., and Su, Peng, "Tin Whisker and Surface Defect Formation on Electroplated Films and Reflowed Joints." (before Nov. 5, 2010)

Kurtz, Olaf, Kuhlkamp, Peter, Barthelmes, Jurgen, and Ruther, Robert, "Reducing and Preventing Tin Corrosion Whiskers," SMT Web Exclusive Article. (before Nov. 5, 2010)

Landman, Robert J., "Tin Whiskers - A Long Term RoHS Reliability Problem." (before Nov. 5, 2010)

Smetana, Joe, "NIPP-NPP-2009-053," (before Nov. 5, 2010)

"Resolution of Generic Safety Issues: Issue 200: Tin Whiskers (NUREG-0933, Main Report with Supplements 1-33) Nov. 3, 2010.

Chason, Eric, "How do whiskers and hillocks grow in Pb-free Sn coatings?," Tin Whisker Group teleconference, Nov. 3, 2010.

Baated, Alongheng, Kim, Keun-Soo, Suganuma, Katsuaki, Huang, Sharon, Jurcik, Benjamin, Nozawa, Shigeyoshi, and Ueshima, Minoru, "Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu solders," Journal of Materials Science: Materials in Electronics, vol. 21 no. 10, pp. 1066-1075, Oct. 2010.

Mallik, Aditi, and Stout, Roger, "Simulation Methods for Predicting Fusing Current and Time for Encapsulated Wire Bonds," CITE>IEEE Transactions on Electronics Packaging Manufacturing , vol. 33 no. 4, pp. 255-264, Oct. 2010.

Chason, Eric, Jadhav, Nitin, Buchvecky, Eric, Bower, Allan, and Kumar, Sharvan, "How do whiskers and hillocks grow in Pb-free Sn coatings?," SMTA International 2010 Conference (Presentations), Orlando, FL, Oct. 24-28, 2010.

Leonardi, Nicholas, "Bridging Supply Chain Gap for Exempt High-Reliability OEM's Tin Whisker Mitigation and Counterfeit Detection," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 179-184.

Lichau, Daniel, "Image Processing, Quantification and Model Reconstructions in SEM/FIB," Club Image 3D, Le Bourget du Lac, France, Oct. 20, 2010, pp. xx-xx.

Woodrow, Tom, "Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy, Part III," Tin Whisker Group teleconference, Oct. 20, 2010.

Tsou, Meng-Yu, Yen, Yee-Wen, Shao, Pei-Sheng, and Jao, Chien-Chung, "Investigation of Sn Whisker Growth in the Matte Sn/Alloy 42 Substrate Coated Different Metallic Layers," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Lichau, Daniel, "Image Processing, Quantification and Model Reconstructions in SEM/FIB: Case studies," European Focused Ion Beam Users Group Meeting, Gatea, Italy, Oct. 11, 2010, pp. xx-xx.

Crandall, E. R., Flowers, G. T., Dean, R. N., and Bozack, M. J., "Growth of Sn Whiskers on Semiconductor and Insulator Surfaces," 2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts, Charleston, SC, Oct. 4-7, 2010, pp. xx-xx.

Crandall, E. R., Flowers, G. T., Dean, R. N., and Bozack, M. J., "Oxidation-Induced Growth of Sn Whiskers in a Pure Oxygen Gas Environment," 2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts , Charleston, SC, Oct. 4-7, 2010, pp. xx-xx.

"NASA's Suggestions for Reducing Risk of Tin Whisker Induced Failures," Products Finishing, vol. 74 no. 12, pp. 32, Sept. 2010.

Frolov, T., Boettinger, W. J., and Mishin, Y., "Atomistic simulation of hillock growth," Acta Materialia, vol. 58 no. 16, pp. 5471-5480, Sept. 2010.

Pennington, Tim, "Shaving the Whisker Problem," Products Finishing, vol. 74 no. 12, pp. 30-31,33-35, Sept. 2010.

Varkey, Bijumon, Christian, Bev, Liu, Julie, Romanov, Alexandre, and Moorhead, Philip, "Not Whiskers or Hillocks, But Tin Bumps on RF Shielding Cans," IEEE Transactions on Device and Materials Reliability, vol. 10 no. 3, pp. 353-359, Sept. 2010.

Che, F. X., Zhu, W. H., Poh, Edith S. W., Zhang, X. W., and Zhang, X. R., "The study of mechanical properties of Sn-Ag-Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures," Journal of Alloys and Compounds, vol. 507 no. 1, pp. 215-224, Sept. 24, 2010.

"GEIA-HB-0005-4 Guidelines for Performing Reliability Assessment for Pb Free Assemblies used in Aerospace and High-Performance Electronic Applications," Sept. 23, 2010.

Pinsky, David, "Application-Specific Tin Whisker Risk Assessment Algorithm- Update 2010," Tin Whisker Group teleconference, Sept. 22, 2010.

Sellers, Keith M., "Real Reliability Concerns in the Medical Electronics World," Medical Electronics Symposium 2010 Proceedings, Tempe, AZ, Sept. 22-23, 2010, pp. xx-xx.

Kim, Kyung-Seob, Yang, Jun-Mo, and Ahn, Jae-Pyoung, "The effect of electric current and surface oxidization on the growth of Sn whiskers," Applied Surface Science, vol. 256 no. 23, pp. 7166-7174, Sept. 15, 2010.

Burke, John, "Get SMART: Tin Whiskers Eliminated!,". Sept. 9, 2010.

Landman, Bob, Davy, Gordon, and Fritz, Denny, "Tin-Whisker-Impenetrable Selective Metal Cap Process for Electronic Assemblies," Tin Whisker Group teleconference, Sept. 8, 2010.

Nie, Lei, Mueller, Maik, Osterman Michael, and Pecht, Michael, "Microstructural Analysis of Reballed Tin-Lead, Lead-Free, and Mixed Ball Grid Array Assemblies Under Temperature Cycling Test," Journal of Electronic Materials, vol. 39 no. 8, pp. 1218-1232, Aug. 2010.

Yu, Cheng-Fu, Chan, Chi-Ming, and Hsieh, Ker-Chang, "The effect of tin grain structure on whisker growth," Microelectronics Reliability, vol. 50 no. 8, pp. 1146-1151, Aug. 2010.

Yu, Cheng-Fu, and Hsieh, Ker-Chang, "The Mechanism of Residual Stress Relief for Various Tin Grain Structures," Journal of Electronic Materials, vol. 39 no. 8, pp. 1315-1318, Aug. 2010.

Yelton, Graham, Susan, Don, Michael, Joseph, and Shore, Daniel, "Understanding and Predicting Metallic Whisker Growth as a Function of Electrodeposited Morphology," 217th ECS Meeting, Vancouver, British Columbia, Canada, Apr. 25-30, 2010, pp. xx-xx. (Sandia Report SAND2010-2517C)

Davy, Gordon, "OEMs' Pb-free and Tin Whisker Options - Prevention vs. "Mitigation"," Tin Whisker Group teleconference, Aug. 18, 2010.

Wang, Yiqing, Ding, Dongyan, Liu, Ting, Galuschki, Klaus-Peter, Hu, Yu, Gong, Angela, Shen, Ming, Sun, Hongqi, Wang, Xianfeng, Sun, Jiangyan, Li, Ming, and Mao, Dali, "Effect of Ni Barrier on the Tin Whisker Formation of Electroplating Sn on Lead-frame Alloy," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 980-983.

"Plating's Effects on Electronics Assembly," Printed Circuit Design and Fab/Circuits Assembly, vol. 27 no. 7, pp. 40, July 2010.

Bozack, Michael J., Crandall, Erika R., Rodekohr, Chad L., Dean, Robert N., Flowers, George T., and, Suhling, Jeffrey C., "High Lateral Resolution Auger Electron Spectroscopic (AES) Measurements for Sn Whiskers on Brass," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 3, pp. 198-204, July 2010.

Dimitrovska, Aleksandra, and Kovacevic, Radovan, "Environmental Influence on Sn Whisker Growth," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 3, pp. 193-197, July 2010.

Han, Sungwon, Osterman, Michael, and Pecht, Michael G., "Electrical Shorting Propensity of Tin Whiskers," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 3, pp. 205-211, July 2010.

Jadhav, Nitin, Buchovecky, Eric, Chason, Eric, and Bower, Allan, "Real-time SEM/FIB Studies of Whisker Growth and Surface Modification," JOM, vol. 62 no. 7, pp. 30-37, July 2010.

Jadhav, Nitin, Buchovecky, Eric J., Reinbold, Lucine, Kumar, Sharvan, Bower, Allan F., and Chason, Eric, "Understanding the Correlation Between Intermetallic Growth, Stress Evolution, and Sn Whisker Nucleation," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 3, pp. 183-192, July 2010.

Kato, Takahiko, Akahoshi, Haruo, Nakamura, Masato, Terasaki, Takeshi, Iwasaki, Tomio, Hashimoto, Tomoaki, and Nishimura, Asao, "Correlation Between Whisker Initiation and Compressive Stress in Electrodeposited Tin-Copper Coating on Copper Leadframes," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 3, pp. 165-176, July 2010.

Osterman, Michael, "Introduction to the Special Issue on Tin Whiskers," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 3, pp. 157-158, July 2010.

Sarobol, Pylin, Pedigo, Aaron E., Su, Peng, Blendell, John E., and Handwerker, Carol A., "Defect Morphology and Texture in Sn, Sn-Cu, and Sn-Cu-Pb Electroplated Films," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 3, pp. 159-164, July 2010.

Shibutani, Tadahiro, "Effect of Grain Size on Pressure-Induced Tin Whisker Formation," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 3, pp. 177-182, July 2010.

Susan, D. F., Michael, J. R., Grant, R. P., and Yelton, W. G., "Tin Whiskers: Electron Microscopy and EBSD Characterization," Microscopy and Microanalyses, vol. 16 no. S2, pp. 792-793, July 2010.

Zhao, M., and Jiang, Q., "Size effect on thermal properties in low-dimensional materials," Key Engineering Materials, vol. 444, pp. 189-218, July 2010.

Sahaym, Uttara, Miller, Stephanie L., and Norton, M. Grant, "Effect of plating temperature on Sn surface morphology," Materials Letters, vol. 64 no. 14, pp. 1547-1550, July 31, 2010.

Liu, Haiyan, Zhu, Qingsheng, Zhang, Li, Wang, Zhongguang, and Shang, Jian Ku, "Enhanced stress relaxation of Sn-3.8Ag-0.7Cu solder by electrical current," Journal of Materials Research, vol. 25 no. 6, pp. 1172-1178, June 2010.

Lin, Hsiu-Jen, and Chuang, Tung-Han, "Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn-3Ag-0.5Cu solder joints," Journal of Alloys and Compounds, vol. 500 no. 2, pp. 167-174, June 25, 2010.

Chou, George J. S., and Hilty, Robert D., "Tin Reflow for Tin Whisker Mitigation," 4th International Symposium on Tin Whiskers, College Park, MD, June 23-24, 2010, pp. xx-xx.

Leidecker, Henning, Brusse, Jay, and Panashchenko, Lyudmyla, "Metal Vapor Sparking and Arcing," 4th International Symposium on Tin Whiskers, College Park, MD, June 23-24, 2010, pp. xx-xx.

Sampson, Michael J., "Lead-Free Electronics: Impact for Space Electronics," NASA. June 22-24, 2010.

Blanche, Jim, and Strickland, Mark, "Working with Consortia - Advanced Packaging Reliability," 2010 NEPP Electronics Technology Workshop, Greenbelt, MD, June 22, 2010, pp. xx-xx.

Sarobol, Pylin, "The Effects of Local Film Properties on Whisker and Hillock Growth on Sn, Sn-Cu and Sn-Cu-Pb Electroplated Films," Tin Whisker Group teleconference, June 16, 2010.

Pedigo, Aaron E., "Understanding Fundamental Tin Whisker Growth Mechanisms by Characterizing Film Properties," Tin Whisker Group teleconference, June 9, 2010.

Sarobol, Pylin, Pedigo, Aaron, Blendell, John, Handwerker, Carol, Su, Peng, Li, Li, and Xue, Jie, "A Synchrotron Micro-Diffraction Investigation of Crystallographic Texture of High-Sn Alloy Films and its Effects on Whisker Growth," 2010 Proceedings 60th Electronic Components and Technology Conference , Las Vegas, NV, June 1-4, 2010, pp. 162-169.

Shin, Ho Sun, Song, Jae Yong, and Yu, Jin, "Lattice Deformation of Sn Nanowires for the Application to Nano-interconnection Technology," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1861-1865.

Buchovecky, Eric J., Numerical Simulation of Stress Generation and Whisker Growth in Sn Films. Ph. D. Thesis for Brown University, Providence, RI, May 2010.

Dudek, M. A., and Chawla, N., "Nanoindentation of rare earth-Sn intermetallics in Pb-free solders," Intermetallics, vol. 18 no. 5, pp. 1016-1020, May 2010.

The Lead Free Electronics Manhattan Project - Phase II. The Benchmarking and Best Practices Center of Excellence, May 31, 2010. pp. 131-132,Appendix C.

Bozack, M. J., Crandall, E. R., Rodekohr, C. E., Flowers, G. T., and Lall, P., "Influence of Surface Composition and Substrate Roughness on Tin Whisker Growth," Tin Whisker Group teleconference, May 26, 2010.

Bozack, Mike, "(tin whiskers growing on thin film tin over a zinc substrate)." Tin Whisker Group teleconference, May 26, 2010.

Woodrow, Tom, "Composition of Tin Whiskers on Tin-Plated Brass," Tin Whisker Group teleconference, May 26, 2010.

Meschter, S., "Lead-to-lead spacing considerations a part of a comprehensive 2B tin whisker mitigation strategy," Tin Whisker Group teleconference, May 19, 2010.

Howell, Keith, Koshi, Masuo, Masuda, Junya, Nishimura, Tetsuro, Nozu, Takashi, and Sweatman, Keith, "Effect of Soldering Method and Flux Type on Whisker Growth in SAC305," International Conference on Soldering & Reliability 2010 Proceedings , Toronto, Ontario, Canada, May 17-20, 2010, pp. xx-xx.

Meschter, S. J., McKeown, S. A., Feathers, R., and Arseneau, E., "BGA Re-Balling from Pb-Free to Sn-Pb Metallurgy," International Conference on Soldering & Reliability 2010 Proceedings, Toronto, Ontario, Canada, May 17-20, 2010, pp. xx-xx.

Arazna, Aneta, Koziol, Grazyna, and Steplewski, Wojciech, "Investigation of Tin Whiskers Formation," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 183-185.

Jiri, Podzemsky, Martin, Copjan, Jan, URbanek, and Karel, Dusek, "Evaluation of Tin Whisker Growth," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 179-182.

Courey, Karim J., Asfour, Shihab S., Onar, Arzu, Bayliss, Jon A., Ludwig, Larry L., and Wright, Maria C., "Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part II," 2010 Aircraft Airworthiness & Sustainment Conference , Austin, TX, May 10-13, 2010, pp. xx-xx.

Cheng, Jing, Vianco, Paul T., and Li, James C. M., "Hollow tin/chromium whiskers," Applied Physics Letters, vol. 96 no. 18, pp. 184102-1-184102-3, May 3, 2010.

Cheng, Jing, Chen, Samuel, Vianco, Paul T., and Li, James C. M., "Quantitative analysis for hillocks grown from electroplated Sn film," Journal of Applied Physics, vol. 107 no. 7, pp. 074902-1-074902-4, Apr. 2010.

Stafford, G. R., Williams, M. E., Shin, J. W., Moon, K.-W., Beauchamp, C. R., and Boettinger, W. J., "Whisker Formation in Pb-Free Surface Finishes," ECS Transactions , vol. 28 no. 2, pp. 499-512, Apr. 2010. https://doi.org/10.1149/1.3372604

Fox, William, and Woody, Linda, "Conformal Coatings for Tin Whisker Risk Management," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S11_01-1-S11_01-12.

Rotchadl, Hal, "Bridging Supply Chain Gap for Exempt High-Reliability OEM's," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S12_01-1-S12_01-9.

Sweatman, Keith, Masuda, Junya, Nozu, Takashi, Koshi, Masuo, and Nishimura, Tetsuro, "Effect of Soldering Method, Temperature, and Humidity on Whisker Growth in the Presence of Flux Residues," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S11_02-1-S11_02-5.

Dudek, M. A., and Chawla, N., "Effect of Rare-Earth (La, Ce, and Y) Additions on the Microstructure and Mechanical Behavior of Sn-3.9Ag-0.7Cu Solder Alloy," Metallurgical and Materials Transactions A, vol. 41 no. 3, pp. 610-620, Mar. 2010.

Kurtz, Olaf, Barthelmes, Jurgen, Kuhlkamp, Peter, Ruther, Robert, and Neoh, Ding-Ghee, "Big Grain and Flat Morphology - A New Tin Electrolyte for Minimal Whiskering and Excellent Solderability," Metal Finishing, vol. 108 no. 3, pp. 22-28, Mar. 2010. https://doi.org/10.1016/S0026-0576(10)00015-2

Panashchenko, Lyudmyla, "Plating Dendrite Formations on Sn plating," Tin Whisker Group teleconference, Mar. 31, 2010.

"Pb-Free Components," DfR Solutions, Mar. 3, 2010.

Lin, Hsiu-Jen, and Chuang, Tung-Han, "Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints," Journal of Electronic Materials , vol. 39 no. 2, pp. 200-208, Feb. 2010.

Roters, F., Eisenlohr, P., Hantcherli, L., Tjahjanto, D. D., Bieler, T. R., and Raabe, D., "Overview of constitutive laws, kinematics, homogenization and multiscale methods in crystal plasticity finite-element modeling: Theory, experiments, applications," Acta Materialia, vol. 58 no. 4, pp. 1152-1211, Feb. 2010.

Stadem, Richard, and Cristea, Cornel, "A Novel Process for Automated Lead Tinning," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 2, pp. 40-42, Feb. 2010.

Hunt, Christopher, and Wickham, Martin, "Mitigation of Tin Whiskers With Polymer Coatings," International Symposium on Advanced Packaging Materials, Cambridge, England, Feb. 28-Mar. 2, 2010, pp. 78-87.

Hunt, Christopher, and Wickham, Martin, "Reliability Issues with Lead-Free," Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Portsmouth, England, Feb. 17, 2010.

Lead Free Electronics Manhattan Project Phase 2. ACI Technologies, Feb. 10, 2010.

Turbini, Laura J., "Growing Tin and Other Dangerous Whiskers," Surface Mount Technology , Feb. 5, 2010.

He, Hongwen, Xu, Guangchen, and Guo, Fu, "Electromigration-induced Bi-rich whisker growth in Cu/Sn-58Bi/Cu solder joints," Journal of Materials Science, vol. 45 no. 2, pp. 334-340, Jan. 2010.

Hino, Makoto, Murakami, Koji, Mitooka, Yutaka, Takamizawa, Masao, Naka, Toshihide, and Nakai, Kiyomichi, "Mechanism of Whisker Growth Suppression by Lead Co-deposition on Electroplated Tin Film," Materials Science Forum, vol. 638-642, pp. 835-840, Jan. 2010.

Nakai, Kiyomichi, Sakamoto, Tatsuaki, Kobayashi, Sengo, Arakawa, Kazuto, Mori, Hirotaro, Takamizawa, Masao, Murakami, Koji, and Hino, Makoto, "A Model for Nucleation and Growth Processes of Tin Whisker," Materials Science Forum, vol. 638-642, pp. 2688-2693, Jan. 2010.

Osenbach, John W., Reynolds, Heidi L., Henshall, Gregory, Parker, Richard Dixon, and Su, Peng, "Tin Whisker Test Development- Temperature and Humidity Effects Part II: Acceleration Model Development," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 1, pp. 16-24, Jan. 2010.

Reynolds, Heidi L., Osenbach, John W., Henshall, Gregory, Parker, Richard D., and Su, Peng, "Tin Whisker Test Development- Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 1, pp. 1-15, Jan. 2010.

Osenbach, John, Williams, Maureen, Handwerker, Carol, and Galyon, George, "Sn Whiskers," Tin Whisker Group teleconference, Jan. 27, 2010.

Sweatman, Keith, Masuda, Junya, Nozu, Takashi, Koshi, Masuo, and Nishimura, Tetsuro, "Corrosion Driven Whisker Growth in SAC305," 2010 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, Koloa, HI, Jan. 26-28, 2010, pp. xx-xx.

Panashchenko, Lyudmyla, "Evaluation of Environmental Tests for Tin Whisker Assessment," Tin Whisker Group teleconference, Jan. 20, 2010.

Panashchenko, Lyudmyla, "Evaluation of Environmental Tests for Tin Whisker Assessment (presentation)," Tin Whisker Group teleconference, Jan. 20, 2010.

2009: 0 books, 8 theses, 111 papers, and 27 web pages on tin whiskers

Aragon, Joseph, Wavrik, Richard, and Witham, John, "Tin Whisker Mitigation Methods," Sandia Report SAND2009-4735C, 2009.

Bierman, Matthew John, Dislocations in One-Dimensional Semiconductor Crystals: Nanowires, Nanotubes, and Whiskers. Ph. D. Thesis for University of Wisconsin - Madison, Madison, WI, 2009.

Buchovecky, Eric J., Du, Ningning, and Bower, Allan F., "A model of Sn whisker growth by coupled plastic flow and grain boundary diffusion," Applied Physics Letters, vol. 94 no. 19, pp. 191904-1-191904-3, 2009.

Cantoro, M., Brammertz, G., Richard, O., Bender, H., Clemente, F., Leys, M., Degroote, S., Caymax, M., Heyns, M., and De Gendt, S., "Controlled III/V Nanowire Growth by Selective-Area Vapor-Phase Epitaxy," Journal of the Electrochemical Society, vol. 156 no. 11, pp. H860-H868, 2009.

Chin, Erica, Templated Synthesis and Characterization of Multi-segmented Nanowires for Sensor and Optical Device Applications. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, 2009.

Hino, Makoto, Mitooka, Yutaka, Murakami, Koji, Takamizawa, Masao, and Nishimura, Nobuyuki, "Melting Treatment of Tin Electroplating by Laser Irradiation," Journal of The Surface Finishing Society of Japan, vol. 60 no. 2, pp. 134-136, 2009.

Mathew, Sony, Osterman, Michael, Pecht, Michael, and Dunlevey, Frank, "Evaluation of pure tin plated copper alloy substrates for tin whiskers," Circuit World, vol. 35 no. 1, pp. 3-8, 2009.

Mitooka, Yutaka, Murakami, Koji, Hino, Makoto, Takamizawa, Masao, and Takada, Jun, "Effect of Laser Irradiation on Generation and Growth of Whiskers in Tin-Electroplated Film," Materials Transactions, vol. 50 no. 9, pp. 2247-2252, 2009.

Nakai, K., Sakamoto, T., Kobayashi, S., Takamizawa, M., Murakami, K., and Hino, M., "A model for nucleation of tin whisker through dislocation behavior," Journal of Physics: Conference Series, vol. 165, no. 012089, 2009.

Okamoto, Naoki, Fujii, Yuko, Kurihara, Hiroaki, and Kondo, Kazuo, "Effects of Microstructure of Deposited Sn Films and Orientation Index of Cu Foils on Sn Whisker Formation Using Substitutionally-Deposited Sn Films," Materials Transactions, vol. 50 no. 11, pp. 2570-2577, 2009.

Okamoto, Naoki, Fujii, Yuko, Kurihara, Hiroaki, and Kondo, Kazuo, "Effects of Structures of Substrates on Sn Whisker Formation Using Substitutionally-Deposited Sn Films," Materials Transactions, vol. 50 no. 10, pp. 2403-2409, 2009.

Panashchenko, Lyudmyla, Evaluation of Environmental Tests for Tin Whisker Assessment. Master's Thesis for University of Maryland, College Park, MD, 2009.

Panashchenko, Lyudmyla, "Whisker Length Measurement: a Validation Study," Center for Advanced Life Cycle Engineering, 2009.

Skwarek, A., Ratajczak, J., Czerwinski, A., Witek, K. and Kulawik, J., "Effect of Cu addition on whisker formation in tin-rich solder alloys under thermal shock stress," Applied Surface Science, vol. 255 no. 15, pp. 7100-7103, 2009.

Sobiech, M., Wohlschlogel, M., Welzel, U., Mittemeijer, E. J., Hugel, W., Seekamp, A., Liu, W., and Ice, G. E., "Local, submicron, strain gradients as the cause of Sn whisker growth," Applied Physics Letters, vol. 94 no. xx, pp. 221901-1-221901-3, 2009.

Spitzner, Matthew James, Response of tin whiskers to dynamic input: Mathematical modeling and experimental property measurement. Master's Thesis for Iowa State University, Ames, IA, 2009.

Wang, Weiqiang, Solder Joint Reliability of Sn and SnBi Finished and Refinished Sn (SAC/SnPb) SMT Packages Under Temperature Cycling Test. Master's Thesis for University of Maryland, College Park, MD, 2009.

Aragon, Joseph, Rohwer, Lauren, Wavrik, R., and Witham, J., "Tin Whisker Mitigation Methods," 28th Compatibility, Aging & Stockpile Stewardship Conference, Albuquerque, NM, Fall 2009, pp. xx-xx. (Sandia Report SAND2009-6058C)

Brusse, Jay, "Tin Whisker Observations on Tin-Coated Copper Bus Bar Obtained from "A Large Paper Mill in Sweden"," Dec. 2009.

Buchovecky, Eric, Jadhav, Nitin, Bower, Allan F., and Chason, Eric, "Finite element modeling of stress evolution in Sn films due to growth of Cu6Sn5 intermetallic compound," Journal of Electronic Materials, vol. 38 no. 12, pp. 2676-2684, Dec. 2009.

Chuang, Tung-Han, Cheng, Chih-Yuan, and Chang, Tao-Chih, "Evaluations of Whisker Growth and Fatigue Reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce Solder Ball Grid Array Packages," Journal of Electronic Materials, vol. 38 no. 12, pp. 2762-2769, Dec. 2009.

Dimitrovska, Aleksandra, and Kovacevic, Radovan, "Mitigation of Sn Whisker Growth by Composite Ni/Sn Plating," Journal of Electronic Materials, vol. 38 no. 12, pp. 2516-2524, Dec. 2009.

Dimitrovska, Aleksandra, and Kovacevic, Radovan, "The Effect of Micro-Alloying of Sn Plating on Mitigation of Sn Whisker Growth," Journal of Electronic Materials, vol. 38 no. 12, pp. 2726-2734, Dec. 2009.

Guo, Fu, Xu, Guangchen, He, Hongwen, Zhao, Mengke, Sun, Jia, and Wang, C. Henry, "Effect of Electromigration and Isothermal Aging on the Formation of Metal Whiskers and Hillocks in Eutectic Sn-Bi Solder Joints and Reaction Films," Journal of Electronic Materials, vol. 38 no. 12, pp. 2647-2658, Dec. 2009.

Nie, Lei, Osterman, Michael, Song, Fubin, Lo, Jeffery, Lee, S. W. Ricky, and Pecht, Michael, "Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages," IEEE Transactions on Components and Packaging Technologies , vol. 32 no. 4, pp. 901-908, Dec. 2009.

Reinbold, Lucine, Jadhav, Nitin, Chason, Eric, and Kumar, K. Sharvan, "Relation of Sn whisker formation to intermetallic growth: Results from a novel Sn-Cu "bimetal ledge specimen"," Journal of Materials Research , vol. 24 no. 12, pp. 3583-3589, Dec. 2009.

Dimitrovska, Aleksandra, Mitigation Strategies of Tin(Sn) Whisker Growth, Ph. D. Thesis for Southern Methodist University, Dallas, TX, Dec. 19, 2009.

Woodrow, Tom, "Effects of Pb on the Diffusion of Tin within Tin Platings," Tin Whisker Group teleconference, Dec. 9, 2009.

Schetty, Rob, and Sepp, William, "Minimization of Tin Whisker Growth for Ultra-Low Tin Whisker Applications," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 225-234.

Asai, Tadashi, Kiga, Tomoya, Taniguchi, Yoshikuni, Morikawa, Hiroshi, and Sumiyama, Kenji, "Suppression of External-Stress-Induced Formation of Tin Whisker by Annealing of Electroplated Sn-Ag Alloy Films," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 73 no. 11, pp. 823-832, Nov. 2009.

Ice, Gene E., and Pang, Judy W. L., "Tutorial on x-ray microLaue diffraction," Materials Characterization , vol. 60 no. 11, pp. 1191-1201, Nov. 2009.

Liu, Meng, and Xian, Ai-Ping, "Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition," Journal of Electronic Materials, vol. 38 no. 11, pp. 2353-2361, Nov. 2009.

Ogden, Robert R., and Champaign, Robert F., "Tin Whisker Observations," Circuits Assembly, vol. 20 no. 11, pp. 26-29, Nov. 2009.

Shin, Seung-Jung, Kim, Jae-Jung, and Son, Young Kap, "Analysis of plating grain size effect on whisker," Journal of Mechanical Science and Technology, vol. 23 no. 11 , pp. 2885-2890, Nov. 2009.

Brusse, Jay, Tin Whiskers on Lincoln's Beard, Nov. 25, 2009.

Tin Whiskers on Card Guides Nov. 21, 2009.

Panashchenko, Lyudmyla, "Lincoln's Beard Growing Whiskers," CALCE UMD, Nov. 20, 2009.

Panashchenko, Lyudmyla, "Fat Metal Whiskers," Tin Whisker Group teleconference, Nov. 18, 2009.

Brusse, Jay, Metal Whiskers-Inspection Video #5: Transistor Package, Youtube, Nov. 21, 2009.

Brusse, Jay, Metal Whiskers-Optical Inspection #1, Youtube, Nov. 21, 2009.

Brusse, Jay, Metal Whiskers-Optical Inspection #2, Youtube, Nov. 21, 2009.

Brusse, Jay, Metal Whiskers-Optical Inspection Video #4, Youtube, Nov. 21, 2009.

Brusse, Jay, Tin Whisker Growth Kinetics, Youtube, Nov. 21, 2009.

Brusse, Jay, Tin Whiskers-Dsub Connector Shell, Youtube, Nov. 21, 2009.

Brusse, Jay, Tin Whiskers Inside Electromagnetic Relay, Youtube, Nov. 21, 2009.

Brusse, Jay, Tin Whiskers on Card Guides, Youtube, Nov. 21, 2009.

Brusse, Jay, Tin Whiskers on Electromagnetic Relays, Youtube, Nov. 21, 2009.

Brusse, Jay, Tin Whiskers on Terminal Lugs, Youtube, Nov. 21, 2009.

Brusse, Jay, Tin Whiskers on Variable Air Capacitor, Youtube, Nov. 21, 2009.

Lin, Hsiu-Jen, Lin, Jian-Shian, and Chuang, Tung-Han, "Electromigration of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads," Journal of Alloys and Compounds , vol. 487 no. 1-2, pp. 458-465, Nov. 13, 2009.

Liu, Meng, and Xian, Ai-Ping, "Spontaneous growth of whiskers on RE-bearing intermetallic compounds of Sn-RE, In-RE, and Pb-RE," Journal of Alloys and Compounds, vol. 486 no. 1-2, pp. 590-596, Nov. 3, 2009.

Osenbach, John W., "Creep and its effect on Sn whisker growth," Journal of Applied Physics , vol. 106 no. 9, pp. 094903-1-094903-10, Nov. 1, 2009.

Woodrow, Thomas A., "Effects of Pb on the Diffusion of Tin Within Tin Platings," 2009 AIMS Harsh Environments Electronics Symposium, San Diego, CA, Oct. 5-6, 2009, pp. 935-954.

Baated, Alongheng, Kim, Keun-Soo, Suganuma, Katsuaki, Huang, Sharon, Jurcik, Benjamin, Nozawa, Shigeyoshi, Stone, Bryan, and Ueshima, Minoru, "Effects of Reflow Atmosphere and Flux on Tin Whisker Growth of Sn-Ag-Cu Solder," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 802-808.

Cheng, Jing, and Vianco, Paul T., "In-Place Tracking for Tin Whiskers and Tin Depleted Areas at Different Stress Status," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 612-618.

Hillman, David, "False Tin Whiskers: Masquerading Tin Copper Intermetallics," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 607-611.

Hunt, Christopher, "Implementation and Reliability Issues with Lead-Free Solders," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 295-307.

Lesniewski, Thomas, "Assessment of Whisker Growth from Tin Coated Wire and Cable," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 619-627.

Lesniewski, Tom, "Assessment of Whisker Growth from Tin Coated Wire and Cable (Presentation)," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 619-627.

Nie, Lei, Osterman, Michael, and Pecht, Michael, "Assessing Reliability of Reballed Ball Grid Array Assemblies Under Temperature Cycling Test," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 98-104.

Rotchadl, Hal, "Bridging Supply Chain Gap for Exempt High-Reliability OEM's," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 646-653.

Whytock, Paul, "Stubble Trouble-Beating Back Those Tin Whiskers," Electronic Design, vol. 57 no. 20, pp. 38, Oct. 1, 2009.

Dudek, M. A., and Chawla, N., "Mechanisms for Sn whisker growth in rare earth-containing Pb-free solders," Acta Materialia, vol. 57 no. 15, pp. 4588-4599, Sept. 2009.

Kurtz, Olaf, Barthelmes, Jurgen, Kuhlkamp, Peter, Ruther, Robert, and Neoh, Ding-Ghee, "Anti-corrosion solution for reduction and prevention of corrosion whiskers," Tin World, no. 28, pp. 10-15, Autumn 2009.

Vianco, P. T., and Rejent, J. A., "Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part I: A Model," Journal of Electronic Materials, vol. 38 no. 9, pp. 1815-1825, Sept. 2009.

Vianco, P. T., and Rejent, J. A., "Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part II: Experimental Study," Journal of Electronic Materials, vol. 38 no. 9, pp. 1826-1837, Sept. 2009.

Wickham, M., and Hunt, C., "Evaluation of the Ability of Conformal Coatings to Inhibit Tin Whiskering," NPL Report MAT 36, Sept. 2009.

Xian, Ai-Ping, and Liu, Meng, "Observations of continuous tin whisker growth in NdSn3 intermetallic compound," Journal of Materials Research, vol. 24 no. 9, pp. 2775-2783, Sept. 2009.

Courey, Karim, Wright, Clara, Asfour, Shihab, Onar, Arzu, Bayliss, Jon, and Ludwig, Larry, "An Empirical Model for Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part II," NASA, Sept. 29, 2009.

Horvath, Barbara, and Harsanyi, Gabor, "Mechanical Stress Induced Whiskers," 2009 15th International Symposium for Design and Technology of Electronics Packages, Gyula, Hungary, Sept. 17-20, 2009, pp. 389-393.

Hao, Hu, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, and Guo, Fu, "Oxidization-Induced Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0Er Alloy," Metallurgical and Materials Transactions A, vol. 40 no. 8, pp. 2016-2021, Aug. 2009. https://doi.org/10.1007/s11661-009-9871-8

Webb III, Edmund B., "Pesky Stubble: Recent Progress and Remaining Challenges in Controlling Sn Whiskers," 4th Meeting of TAPS: Challenges in Mechanics and Materials, Boulder, CO, Aug. 2009, pp. xx-xx. (Sandia Report SAND2009-4865C)

Green-Guard 701 Aug. 15, 2009.

Chang, Jeffrey, and Lee, Bing, "Sn Whisker Concern in IC Packaging for High Reliability Application," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1014-1018.

Nie, Lei, Dong, Mingzhi, Cai, Jian, Osterman, Michael, and Pecht, Michael, "Interfacial Reaction of Reballed BGAs under Isothermal Aging Conditions," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 633-641.

Zhao, Mengke, Hao, Hu, Xu, Guangchen, Sun, Jia, Shi, Yaowu, and Guo, Fu, "Fundamental Studies on Whisker Growth in Sn-based Solders," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 585-588.

NASA Anecdote #7: Tin Whiskers on RF Shield/Bracket, Aug. 3, 2009.

NASA Anecdote: Tin Whiskers Inside of AF114 Transistors, Aug. 3, 2009.

NASA Anecdote: Tin Whiskers on Bus Bars, Aug. 3, 2009.

NASA Anecdote: Tin Whiskers on Oscilloscope Probes (2007), Aug. 3, 2009.

Brusse, Jay, "Some Examples of "Whiskers" from Tin-Based Alloys," Perot Systems, July 2009.

"Some Examples of "Whiskers" from Tin-Based Alloys," Tin Whisker Group teleconference, July 22, 2009.

Fujimura, Issei, Vardaman, E. Jan, and Lenihan, Timothy G., "Tin Whisker Prevention with SnBi Plating," InterPACK '09, July 22, 2009.

Geisler, Karl J. L., "Solder Fatigue Impacts of Conformal Coating for Tin Whisker Mitigation on Chip-Scale Thin Small Outline Packages," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 915-920.

Quintero-Aguilo, Pedro O., Caceres-Valencia, Pablo, Valentin, Ricky, and Diaz, Alfredo, "Combinatorial Studies for the Minimization of Tin Whiskers Growth in Lead Free Electronics," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 347.

Chen, Chih-ming, and Chen, Yu-jen, "Growth orientation of the tin whiskers on an electrodeposited Sn thin film under three-point bending," Materials Letters, vol. 63 no. 17, pp. 1517-1520, July 15, 2009.

Chen, Kai, Tamura, N., Kunz, M., Tu, K. N., and Lai, Yi-Shao, "In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction," Journal of Applied Physics, vol. 106 no. 2, pp. 023502-1-023502-4, July 15, 2009.

McCormack, Steve, and Meschter, Stephan, "A Probabilistic Assessment of Component Lead-to-Lead Tin Whisker Bridging," Tin Whisker Group teleconference, July 15, 2009.

Meschter, Stephan, "A Probabilistic Assessment of Component Lead-to-Lead Tin Whisker Bridging," Tin Whisker Group teleconference, July 15, 2009.

Chason, Eric, "Sn whisker formation: relationship between intermetallic formation, stress and whisker nucleation," Tin Whisker Group teleconference, July 8, 2009.

Chuang, Tung-Han, and Chi, Chih-Chien, "Effect of adding Ge on rapid whisker growth of Sn-3Ag-0.5Cu-0.5Ce alloy," Journal of Alloys and Compounds, vol. 480 no. 2, pp. 974-980, July 8, 2009.

Benka, Stephen G., "How tin whiskers grow," Physics Today, vol. 62 no. 7, pp. 23, July 1, 2009. https://doi-org.ezproxy.uky.edu/10.1063/1.4797168

Chiu, Tsung-Chieh, and Lin, Kwang-Lung, "The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint," Scripta Materialia, vol. 60 no. 12, pp. 1121-1124, June 2009.

Guo, Fu, Zhao, Mengke, Xia, Zhidong, Lei, Yongping, Li, Xiaoyan, and Shi, Yaowu, "Lead-free Solders with Rare Earth Additions," JOM, vol. 61 no. 6, pp. 39-44, June 2009.

Liu, Meng, and Xian, Ai-Ping, "Tin whisker growth on bulk Sn-Pb eutectic doping with Nd," Microelectronics Reliability, vol. 49 no. 6, pp. 667-672, June 2009. https://doi.org/10.1016/j.microrel.2009.03.012

Skwarek, Agata, Witek, Krzysztof, and Ratajczak, Jacek, "Risk of whiskers formation on the surface of commercially available tin-rich alloys under thermal shocks," Microelectronics Reliability, vol. 49 no. 6, pp. 569-572, June 2009. https://doi.org/10.1016/j.microrel.2009.02.026

Kessel, Kurt, "NASA-DoD Lead-Free Electronics Project," Tin Whisker Group teleconference, June 24, 2009.

Courey, Karim J., Asfour, Shihab S., Onar, Arzu, Bayliss, Jon A., Ludwig, Larry L., and Wright, Maria C., "Developing an Empirical Model for Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part II," 3rd International Symposium on Tin Whiskers, Lyngby, Denmark, June 23-24, 2009, pp. xx-xx.

Courey, Karim J., Asfour, Shihab S., Onar, Arzu, Bayliss, Jon A., Ludwig, Larry L., and Wright, Maria C., "Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part II," 3rd International Symposium on Tin Whiskers, Lyngby, Denmark, June 23-24, 2009, pp. xx-xx.

Smetana, Joe, "iNEMI Recommendations on Lead Free Finishes for Components Used in High-Reliability Products," Tin Whisker Group teleconference, June 10, 2009.

Dudek, Martha A., Microstructure, Mechanical and Oxidation Behavior of RE-containing Pb-free Solders. Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2009.

Verdi, Fred, "Tin Whiskers: Mitigation With Conformal Coatings Part II," empfasis , pp. 1,7, May 2009.

Panashchenko, Lyudmyla, and Osterman, Michael, "Examination of Nickel Underlayer as a Tin Whisker Mitigator," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1037-1043.

Su, Peng, Lee, C. J., Li, Li, Xue, Jie, Khan, Boaz, Moazeni, Reza, and Hartranft, Marc, "Practical Assessment of Tin Whisker Growth Risk due to Environmental Temperature Variations," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 736-741.

Terasaki, Takeshi, Iwasaki, Tomio, Okura, Yasutaka, Suzuki, Tomohisa, Kato, Takahiko, Nakamura, Masato, and Hashimoto, Tomoaki, "Evaluation of Tin-whisker Growth During Thermal-cycle Testing Using Stress- and Mass-diffusion Analysis," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 277-284.

What's Inside Your PC? (before May 25, 2009)

Kessel, Kurt, "Space Shuttle Program - Tin Whisker Mitigation: Labor Hour Rough Order of Magnitude (ROM) Estimate," NASA, May 20, 2009.

Whisker (metallurgy) (before May 20, 2009)

Panashchenko, Lyudmyla, and Osterman, Michael, "Examination of Nickel Underlayer as a Tin Whisker Mitigator (presentation)," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1037-1043.

McCormack, S., and Meschter, S., "Probabilistic Assessment of Component Lead-to-Lead Tin Whisker Bridging," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

Smetana, Joe, "Theory of Tin Whisker Growth "The End Game"," Tin Whisker Group teleconference, May 13, 2009.

Horvath, Barbara, Illes, Balazs, and Harsanyi, Gabor, "Investigation of Tin Whisker Growth: The Effects of Ni and Ag Underplates," 32nd International Spring Seminar on Electronics Technology, Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.

"Hot-Dip Tin Process Said to Prevent Whisker Formation," Products Finishing, vol. 73 no. 7, pp. 11, Apr. 2009.

"Tin Whisker Imagery," empfasis, pp. 9, Apr. 2009.

Verdi, Fred, "Tin Whiskers: Risks with Lead Free Part I," empfasis, pp. 1,7, Apr. 2009.

Wilson, J. R., "Lead-free RoHS on military electronics procurement," Military & Aerospace Electronics, vol. 20 no. 4, pp. 24-29, Apr. 2009.

"The Fusing of Wires and Tin Whiskers," Tin Whisker Group teleconferences, Apr. 22, 2009 and Apr. 29, 2009.

Gao, Fan, Lead-Free Nano-solders on Metallic Nanowires: Synthesis, Characterization, and Thermal Reflow Properties. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, Apr. 21, 2009.

"Scientists Research Tin Pest and Whiskers," SMT Web Exclusive Article. (Apr. 3, 2009)

Chen, Yu-jen, and Chen, Chih-ming, "Mitigative Tin Whisker Growth Under Mechanically Applied Tensile Stress," Journal of Electronic Materials, vol. 38 no. 3, pp. 415-419, Mar. 2009.

Chuang, Tung-Han, and Lin, Hsiu-Jen, "Inhibition of Whisker Growth on the Surface of Sn-3Ag-0.5Cu-0.5Ce Solder Alloyed with Zn," Journal of Electronic Materials, vol. 38 no. 3, pp. 420-424, Mar. 2009.

Mitooka, Yutaka, Murakami, Koji, Hino, Makoto, Takamizawa, Masao, and Takada, Jun, "Effect of Laser Irradiation on Generation and Growth of Whiskers in Tin-Electroplated Film," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 73 no. 3, pp. 226-233, Mar. 2009.

Shibutani, Tadahiro, Osterman, Michael, and Pecht, Michael, "Standards for Tin Whisker Test Methods on Lead-Free Components," IEEE Transactions on Components and Packaging Technologies, vol. 32 no. 1, pp. 216-219, Mar. 2009.

Wickham, Martin, Jennett, Nigel, Nunn, John, Gohil, Dipak, and Hunt, Chris, "Measuring Tin Whiskering Propensity: Measuring Internal Stress in Tin Coatings by Nanoindentation," NPL Report MAT 29, Mar. 2009.

Wu, Albert T., and Ding, Y. C., "The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment," Microelectronics Reliability, vol. 49 no. 3, pp. 318-322, Mar. 2009. https://doi.org/10.1016/j.microrel.2008.11.002

Munson, Terry, and Solis, Paco, ""Metal Whiskers" Does Surface Contamination Have an Effect of Whisker Formation?," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Rotchadl, Hal, "Bridging Supply Chain Gap for Exempt High-Reliability OEM's," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Hu, Chi-Chang, Tsai, Yi-Da, Lin, Chi-Cheng, Lee, Gen-Lan, Chen, Sinn-Wen, Lee, Tai-Chou, and Wen, Ten-Chin, "Anomalous growth of whisker-like bismuth-tin extrusions from tin-enriched tin-Bi deposits," Journal of Alloys and Compounds, vol. 472 no. 1-2, pp. 121-126, Mar. 20, 2009.

Verdi, Fred W., "Lead Free Electronics, Tin Whisker Risks, and Mitigation Techniques," Mar. 11, 2009.

Panashchenko, Lyudmyla, "Non-Whisker Formations on Sn plating," Center for Advanced Life Cycle Engineering, Mar. 3, 2009.

Kim, Dongchoul, "Evolution of micro solder joints under electromigration and elastic field," Journal of Mechanical Science and Technology, vol. 23 no. 2, pp. 489-497, Feb. 2009.

Dudek, M. A., and Chawla, N., "Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders," Journal of Electronic Materials, vol. 38 no. 2, pp. 210-220, Feb. 2009.

Borgesen, Peter, "Lead-Free Solder Joint Reliability Oxymoron? (I like it, but ...)," Tin Whisker Group teleconference, Feb. 25, 2009.

Hybrid Plastics Achieves a Milestone with Nanoscopic Materials for Suppression of Tin Whiskers from Lead-free Solders (before Feb. 24, 2009)

What Are Tin Whiskers? (before Feb. 24, 2009)

Martin, Holly, An Introduction to Tin Whiskers (before Feb. 24, 2009)

NASA Basic Info/FAQ, (before Feb. 22, 2009)

Pure Tin Plating Prohibition (before Feb. 22, 2009)

Tin Whiskers "A New Problem" (before Feb. 22, 2009)

Panashchenko, Lyudmyla, "Melting Whiskers," Center for Advanced Life Cycle Engineering, Feb. 13, 2009.

Spiegel, Rob, "Robots dip lead to end tin whiskers," Design News, Feb. 6, 2009.

NASA SILVER WHISKER Photo Gallery, Feb. 5, 2009.

Courey, Karim J., Asfour, Shihab S., Onar, Arzu, Bayliss, Jon A., Ludwig, Lawrence L., and Wright, Maria C., "Tin Whisker Electrical Short Circuit Characteristics - Part II," IEEE Transactions on Electronics Packaging Manufacturing, vol. 32 no. 1, pp. 41-48, Jan. 2009.

Saito, M., Sasaki, H., Katou, K., Toba, T., and Homma, T., "Effect of Cu Seed Layers on the Properties of Electroplated Sn-Cu Films," Journal of the Electrochemical Society, vol. 156 no. 5, pp. E86-E90, Jan. 2009.

Yu, Hongwen, Hu, Shejun, Hou, Xianhua, Ru, Qiang, Zhao, Lingzhi, and Li, Weishan, "Electrochemical Performance of Tin-Aluminum Thin Film Anodes for Lithium Ion Battery," Materials Science Forum, vol. 610-613, pp. 467-471, Jan. 2009.

Courey, Karim, "Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part I," Tin Whisker Group teleconference, Jan. 28, 2009.

2008: 0 books, 4 theses, 93 papers, and 6 web pages on tin whiskers

"MAUDE Adverse Event Report," 2008.

"Thermal cycling test of tin-bismuth and tin plating," Ishihara Chemical Co., 2008.

Tin Whisker Alert 2008.

Tin Whiskers 2008.

Tin whiskers causes and prevention 2008.

Bhardwaj, Divya, Development of Lead Free Thermal Fuse Wires Using Ohno Continuous Casting. Master's Thesis for University of Toronto, Toronto, Canada, 2008.

Chen, Keming, and Wilcox, Geoffrey D., "Tin-Manganese Alloy Electrodeposits: II. Corrosion Performance Studies," Journal of the Electrochemical Society, vol. 155 no. 2, pp. C53-C61, 2008.

Fischer, Gerd, and Esser, Bob, "Tin Whiskers," 2004-2007.

Hino, Makoto, Murakami, Koji, Mitooka, Yutaka, Takamizawa, Masao, Naka, Toshihide, and Nakai, Kiyomichi, "Lead Transfer to the Surface into Electrodeposited Tin Film and the Whisker Growth," Journal of the Surface Finishing Society of Japan, vol. 59 no. 12, pp. 925-930, 2008.

Jafreen, Rifat, A Cost Model for Assessing the Transition to Lead-Free Electronics . Master's Thesis for University of Maryland, College Park, MD, 2008.

Kawano, Shunsuke, and Tomomori, Tatsuo, "About the Characteristic and Whisker of Pre-coated Aluminum Sheet for Solder," Journal of the Surface Finishing Society of Japan, vol. 59 no. 4, pp. 232-236, 2008.

Kiga, Tomoya, Asai, Tadashi, Mizuguchi, Yukiko, Murakami, Yosuke, Tanaka, Shinji, and Tomiya, Shigetaka, "Test Method and Mechanism Analysis for Tin Whisker Growth by Mechanical Stress," Journal of the Surface Finishing Society of Japan, vol. 59 no. 4, pp. 223-227, 2008.

Moriuchi, Hiroyuki, "Approach for External Stress Type Whisker Mitigation," Journal of the Surface Finishing Society of Japan, vol. 59 no. 4, pp. 218-222, 2008.

Ohgaki, Masataka, "Structural Analysis of Whisker on Lead-free Plate," Journal of the Surface Finishing Society of Japan, vol. 59 no. 4, pp. 237-241, 2008.

Southworth, A. R., Ho, C. E., Lee, A., and Subramanian K. N., "Effect of strain on whisker growth in matte tin," Soldering & Surface Mount Technology, vol. 20 no. 1, pp. 4-7, 2008.

Sperling, Ed, "Off-The-Shelf Migraines," EECatalog. 2008.

Suganuma, Katsuaki, "Research Trends of Tin Whiskers and Current under Standing of the Mechanism," Journal of the Surface Finishing Society of Japan, vol. 59 no. 4, pp. 210-217, 2008.

Tanabe, Kazuhiko, Toshima, Hiroshi, and Toyoda, Yoshitaka, "The Consideration of Whisker Growth Mechanism on Lead Free Soldering," Journal of the Surface Finishing Society of Japan, vol. 59 no. 4, pp. 228-231, 2008.

Chuang, T. H., and Lin, H. J., "Size Effect of Rare-Earth Intermetallics in Sn-9Zn-0.5Ce and Sn-3Ag-0.5Cu-0.5Ce Solders on the Growth of Tin Whiskers," Metallurgical and Materials Transactions A, vol. 39 no. 12, pp. 2862-2866, Dec. 2008. https://doi.org/10.1007/s11661-008-9632-0

Ice, Gene E., "The Future of Spatially-Resolved Polychromatic Neutron and X-Ray Microdiffraction," Metallurgical Transactions A, vol. 39 no. 13, pp. 3058-3064, Dec. 2008. https://doi.org/10.1007/s11661-008-9570-x

Nardone, Keith, "Combating the military's tin whisker threat: no-lead strategies for power products," Military & Aerospace Electronics, Dec. 2008.

Wickham, M., and Hunt, C., "Test Method for Measurement of the Propensity for Conformal Coatings to Inhibit Tin Whiskering," NPL Report MAT 28, Dec. 2008.

Yang, Fuqian, and Li, Yan, "Indentation-induced tin whiskers on electroplated tin coatings," Journal of Applied Physics, vol. 104 no. 11, pp. 113512-1-113512-4, Dec. 2008.

Rodekohr, Chad L., Material Factors Influencing Metallic Whisker Growth. Ph. D. Thesis for Auburn University, Auburn, AL, Dec. 19, 2008.

Courey, Karim, Asfour, Shihab, Bayliss, Jon, Ludwig, Larry, and Wright, Clara, "Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part I," NASA-DoD Lead-Free Electronics Project Consortium, December 16, 2008, pp. xx-xx.

Pinsky, David A., "An updated Application-Specific Tin Whisker Risk Assessment Algorith, and its use within a process compliant to GEIS-STD-0005-2." (before Dec. 14, 2008)

Pinsky, David A., "Enhancements to Current Tin Whisker Risk Assessment Methods." (before Dec. 14, 2008)

Lee, Jeffrey ChangBing, "The Whisker Mitigation Efficiency of Ni Underlayer for IC Packaging on Board," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1060-1065.

Shibutani, Tadahiro, and Yu, Qiang, "Pressure Induced Tin Whisker Formation on SnCu Finish by Nanoindentation Creep," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1442-1447.

Sosiati, H., Hirokado, N., Kuwano, N., and Ohno, Y., "Transmission Electron Microscopy of Spontaneous Tin (Sn) Whisker Growth under High Temperature/Humidity Storage," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1054-1059.

Sriyarunya, Anocha, Tondtan, Jiraporn, and Tukiman, Hasmani, "Matte Tin (Sn) Plating of Semiconductor Devices - Update of Whisker Growth Study," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 94-102.

Courey, Karim, Wright, Clara, Asfour, Shihab, Bayliss, Jon, and Ludwig, Larry, "An Empirical Model for Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part I," NASA, Dec. 3, 2008.

Courey, Karim, Asfour, Shihab, Bayliss, Jon, Ludwig, Larry, and Wright, Clara, "Estimating the Probability of Electrical Short Circuits from Tin Whiskers," NASA-DoD Lead-Free Electronics Project Consortium, Dec. 3, 2008.

Aragon, Joseph, Wavrik, Richard, Vianco, Paul, Witham, John, and McKenzie, Bonnie, "Tin Whisker Mitigation Methods," Defense Manufacturing Conference , Orlando, FL, Dec. 1-4, 2008, pp. xx-xx. (Sandia Report SAND2008-7346C)

Kumar, K. S., Reinbold, L., Bower, A. F., and Chason, E., "Plastic deformation processes in Cu/Sn bimetallic films," Journal of Materials Research, vol. 23 no. 11, pp. 2916-2934, Nov. 2008.

Touw, Anduin E., "Tin Whisker Investigation of SnPb Plated Parts with Marginal Pb Content," Boeing, Nov. 17, 2008.

Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla, "Metal Whiskers: A Discussion of Risks and Mitigation," Symposium on Part Reprocessing, Tin Whisker Mitigation and Assembly Rework, Nov. 12, 2008.

Hillman, David, Margheim, Sue, and Straw, Eric, "The Use of Tin/Bismuth Plating for Tin Whisker Mitigation on Fabricated Mechanical Parts," Symposium on Reprocessing Tin Whisker Mitigation, and Assembly Rework, College Park, MD, Nov. 11-12, 2008, pp. xx-xx.

Woodrow, Tom, and Ledbury, Eugene, "Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy, Part III," Symposium on Reprocessing, Tin Whisker Mitigation and Assembly Rework, College Park, MD, Nov. 11-12, 2008, pp. xx-xx.

Chen, Chih-Ming, and Shih, Po-Yuan, "A peculiar composite structure of carbon nanofibers growing on a microsized tin whisker," Journal of Materials Research, vol. 23 no. 10, pp. 2668-2673, Oct. 2008.

Lin, Chih-Kuang, and Lin, Tung-Hsien, "Effects of continuously applied stress on tin whisker growth," Microelectronics Reliability, vol. 48 no. 10, pp. 1737-1740, Oct. 2008.

van Kan, J. A., Zhang, F., Chiam, S. Y., Osipowicz, T., Bettiol, A. A., and Watt, F., "Proton beam writing: a platform technology for nanowire production," Microsystem Technologies, vol. 14 no. 9-11, pp. 1343-1348, Oct. 2008.

McKeown, Stephen, and Meschter, Stephan, "Effect of hot solder dipping on part stresses," 2008 ASME International Mechanical Engineering Congress and Exposition, Boston, MA, Oct. 31-Nov. 6, 2008, pp. xx-xx.

Rodekohr, C. L., Flowers, G. T., Suhling, J. C., and Bozack, M. J., "Auger Electron Spectroscopic (AES) Measurements on High Aspect Ratio Tin Whiskers," Proceedings of the 54th IEEE Holm Conference on Electrical Contacts, Orlando, FL, Oct. 27-29, 2008, pp. 232-237.

Huang, Wei, "Failure Probability Evaluation Due to Tin Whiskers Caused Leads Bridging on Compressive Contact Connectors," IEEE Transactions on Reliability , vol. 57 no. 3, pp. 426-430, Sept. 2008.

"Whiskers on Monitor PCBs," Center for Advanced Life Cycle Engineering, Sept. 5, 2008.

"Whiskers on USB housing of PC Mother Board," Center for Advanced Life Cycle Engineering, Sept. 5, 2008.

Lee, Jeffrey ChangBing, "Ni Underlayer Efficiency Investigation for Whisker Mitigation in IC Packaging," 2nd Electronics Systemintegration Technology Conference , Greenwich, London, UK, Sept. 1-4, 2008, pp. 453-458.

Kurtz, Olaf, Barthelmes, Juergen, and Martin, Kevin, "Anti-Corrosion Solution for Reduction and Prevention of Corrosion Whiskers," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 739-744.

Kurtz, Olaf, Kuhlkamp, Peter, Barthelmes, Jurgen, Ruther, Robert, and Neoh, D. G., "Anti-corrosion solution for reduction and prevention of corrosion whiskers," Tin World, no. 23, pp. 8-12, Summer 2008.

Shi, Yaowu, and Hao, Hu, "Tin Whiskers with Special Morphology," Beijing University of Technology, July 2008.

Shibutani, Tadahiro, Yu, Qiang, Shiratori, Masaki, and Pecht, Michael G., "Pressure-induced tin whisker formation," Microelectronics Reliability , vol. 48 no. 7, pp. 1033-1039, July 2008. https://doi.org/10.1016/j.microrel.2008.04.009

Wei, C. C., Liu, P. C., Chen, Chih, and Tu, K. N., "Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes," Journal of Materials Research, vol. 23 no. 7, pp. 2017-2022, July 2008.

NASA Metal Whiskers from Sn-Ag-Cu Alloy Systems, (before July 14, 2008)

Tin Whiskers with Special Morphology July 14, 2008.

Shibutani, Tadahiro, Yu, Qiang, and Shiratori, Masaki, "Effect of Creep Properties on Pressure Induced Tin Whisker Formation," Proceedings - The 2nd IEEE International Conference on Secure System Integration and Reliability Improvement, Yokohama, Japan, July 14-17, 2008, pp. 197-198.

Sobiech, M., Welzel, U., Mittemeijer, E. J., Hugel, W., and Seekamp, A., "Driving force for Sn whisker growth in the system Cu-Sn," Applied Physics Letters, vol. 93 no. 1, pp. 011906-1-011906-3, July 7, 2008.

Tan, Y. Y., On, Dinah, Krishnan, J., "Early Whisker Detection through Intermetallic Compound (IMC) Grain Size," 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 7-11, 2008, pp. xx-xx.

Moelans, N., Blanpain, B., and Wollants, P., "Quantitative analysis of grain boundary properties in a generalized phase field model for grain growth in anisotropic systems," Physical Review B , vol. 78 no. 2, pp. 024113-1-024113-23, July 1, 2008.

Chen, Min-Na, Ding, Shi-Jin, Sun, Qing-Qing, Zhang, Wei, David, and Wang, Li-Kang, "Effect of Pulse-Plated Nickel Barriers on Tin Whisker Growth for Pure Tin Solder Joints," Journal of Electronic Materials, vol. 37 no. 6, pp. 894-900, June 2008.

Ciarcia, Steve, "It's All In The Whiskers," Circuit Cellar, no. 215, pp. 96, June 2008.

Fontana, Pietro, "SEM Images of a 27 Year Old Sample Containing Tin Whiskers in Comparison to Salt (NaCl) Whiskers," June 2008.

Okamoto, Naoki, Fujii, Yuko, Kurihara, Hiroaki, and Kondo, Kazuo, "Effect of the Structures within the Substrates for Sn Whisker Formation," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals , vol. 72 no. 6, pp. 413-419, June 2008.

Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla, "Metal Whiskers," Nuclear Procurement Issues Committee (NUPIC) Meeting, June 19, 2008.

Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla, "Metal Whiskers," UNOVIS Consortium Meeting, Owego, NY, June 18, 2008.

Meschter, S., "Lead-to-lead spacing considerations a part of a comprehensive 2B tin whisker mitigation strategy," AIA/GEIA/AMC LEAP Meeting, June 10-11, 2008, pp. xx-xx.

NASA Tin Whisker Anecdote: Swiss Radio & Telephone, June 9, 2008.

Courey, Karim J., An Investigation of the Electrical Short Circuit Characteristics of Tin Whiskers. Ph. D. Thesis for University of Miami, Coral Gables, FL, May 2008.

Falcone, Joe, and Tanabe, Goji, "Minimizing Tin Whiskering in Microminiature Connector Design," ECN Electronic Component News (Supplement), vol. 52 no. 5, pp. 10-11, May 2008.

Pinsky, David A., "The role of dissolved hydrogen and other trace impurities on propensity of tin deposits to grow whiskers," Microelectronics Reliability, vol. 48 no. 5, pp. 675-681, May 2008. https://doi.org/10.1016/j.microrel.2008.01.008

Qi, Haiyu, Ganesan, Sanka, and Pecht, Michael, "No-fault-found and intermittent failures in electronic products," Microelectronics Reliability, vol. 48 no. 5, pp. 663-674, May 2008.

Sampson, Michael J., "Developing a NASA Lead-Free Policy for Electronics Lessons Learned,"

TRISMAC 08 Joint NASA/ESA/JAXA Conference, Noordwijk, The Netherlands, May 2008, pp. xx-xx.

Cheng, Jing, Chen, Samuel, Vianco, Paul, and Li, James C. M., "A New Mechanism for Hillock Formation over Electrodeposited Thin Tin Film," 2008 Proceedings 58th Electronic Components & Technology Conference , Lake Buena Vista, FL, May 27-30, 2008, pp. 472-477.

Han, Sung-Won, Kim, Kyung-Seob, Yu, Chung-Hee, Osterman, Michael, and Pecht, Michael, "Observations of the Spontaneous Growth of Tin Whiskers in Various Reliability Conditions," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1484-1490.

Pedigo, A. E., Handwerker, C. A., and Blendell, J. E., "Whiskers, Hillocks, and Film Stress Evolution in Electroplated Sn and Sn-Cu Films," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1498-1504.

Brusse, Jay, "Whisker Presentation to AAMI Cardiac Rhythm Device Management Committee," May 15, 2008.

Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla, "Metal Whiskers," Association for Advancement of Medical Instrumentation (AAMI) Cardiac Rhythm Management Device Committee, San Francisco, CA, May 13, 2008.

Snugovsky, Polina, Bagheri, Zohreh, and Romansky, Marianne, "Whisker Growth on SAC Solder Joints: Microstructure Analysis," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Snugovsky, Polina, Bagheri, Zohreh, and Romansky, Marianne, "Whisker Growth on SAC Solder Joints: Microstructure Analysis (presentation)," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Buetow, Mike, "Tin Whiskers Email Forum Open," Circuits Assembly, vol. 19. no. 4, pp. 14, Apr. 2008.

Chason, E., Jadhav, N., Chan, W. L., Reinbold, L., and Kumar, K. S., "Whisker formation in Sn and Pb-Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes," Applied Physics Letters, vol. 92, no. x, pp. 171901-1-171901-3, Apr. 2008.

Kim, Kyung-Seob, Kim, Jin-Hyeok, and Han, Sung-Won, "The effect of postbake treatment on whisker growth under high temperature and humidity conditions on tin-plated Cu substrates," Materials Letters , vol. 62 no. 12-13, pp. 1867-1870, Apr. 30, 2008. https://doi.org/10.1016/j.matlet.2007.10.027

Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla, "Metal Whiskers: Failure Modes and Mitigation Strategies," 2nd International Symposium on Tin Whiskers, Tokyo, Japan, Apr. 24, 2008.

Moon, Kil-Won, Boettinger, William J., Ma, Li, Williams, Maureen, and Morris, Dylan, "Whisker/Hillock Formation on As-electrodeposited and Indentation Stressed Sn Film," 2nd International Symposium on Tin Whiskers, Tokyo, Japan, Apr. 24-25, 2008, pp. xx-xx.

Pinsky, David A., "Tin Whiskers: Managing Risks," Overcoming the Reliability Challenge: An IPC Summit, Andover, MA, Apr. 15, 2008, pp. xx-xx.

Lesniewski, Tom, and Higley, Tom, "Effects of Tin Mitigation Processes on Whisker Growth and Solder Joint Reliability for Chip and Small-Outline Package Components," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S13:01.

Nie, Lei, Osterman, Michael, Pecht, Michael, Song, Fubin, Lo, Jeffrey, and Lee, S. W. Ricky, "Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. P-07.

Chuang, T. H., Chi, C. C., and Lin, H. J., "Formation of Whiskers and Hillocks on the Surface of Sn-6.6RE Alloys," Metallurgical and Materials Transactions A, vol. 39 no. 3, pp. 604-612, Mar. 2008. https://doi.org/10.1007/s11661-007-9426-9

Hillman, David, and Pauls, Doug, "A Summary of Tin Whisker Research References," IPC-WP-009, Mar. 2008.

Liang, J., Dariavach, N., and Shangguan, D., "Tin Whisker Nucleation and Growth on Sn-Pb Eutectic Coating Layer Inside Plated Through Holes With Press-Fit Pins," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 1, pp. 152-158, Mar. 2008.

Murakami, Koji, Hino, Makoto, Takamizawa, Masao, and Nakai, Kiyomichi, "Mechanism of Generation and Growth of Whiskers on Tin Electroplating," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 72 no. 3, pp. 168-175, Mar. 2008.

Russick, Edward M., and Thayer, Gayle Echo, "Conformal Coating Value/Risk Assessment for Sandia Satellite Programs," Sandia Report SAND2008-1125, Mar. 2008.

Takamizawa, Masao, Naka, Toshihide, Hino, Makoto, Murakami, Koji, Mitooka, Yutaka, and Nakai, Kiyomichi, "Effect of Lead Co-Deposition on the Whisker Growth on Electrodeposited Tin Film," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 72 no. 3, pp. 229-235, Mar. 2008.

"RoHS at QP Semiconductor," QP Semiconductor Application Note 114 Rev. 2.0, Feb. 2008.

"New additive limits tin whiskers," Solid State Technology, vol. 51 no. 1, pp. 23, Jan. 2008.

Buetow, Mike, "Report: XRF a Viable RoHS, Tin Whisker Screener," Circuits Assembly , vol. 19 no. 1, pp. 8, Jan. 2008.

Courey, Karim J., Asfour, Shihab S., Bayliss, Jon A., Ludwig, Lawrence L., and Zapata, Maria C., "Tin Whisker Electrical Short Circuit Characteristics - Part I," IEEE Transactions on Electronics Packaging Manufacturing, vol. 31 no 1, pp. 32-40, Jan. 2008.

Jiang, Bo, and Xian, Ai-Ping, "Whisker growth on tin finishes of different electrolytes," Microelectronics Reliability, vol. 48 no. 1, pp. 105-110, Jan. 2008. https://doi.org/10.1016/j.microrel.2007.02.002

Kim, K. S., Yu, C. H., Han, S. W., Yang, K. C., and Kim, J. H., "Investigation of relation between intermetallic and tin whisker growths under ambient condition," Microelectronics Reliability, vol. 48 no. 1, pp. 111-118, Jan. 2008. https://doi.org/10.1016/j.microrel.2007.01.088

Lin, Y. W., Lai, Yi-Shao, Lin, Y. L., Tu, Chun-Te, and Kao, C. R., "Tin Whisker Growth Induced by High Electron Current Density," Journal of Electronic Materials, vol. 37 no. 1, pp. 17-22, Jan. 2008.

Nakadaira, Yoshikuni, Jeong, Seyoung, Shim, Jongbo, Seo, Jaiseok, Min, Sunhee, Cho, Taeje, Kang, Sayoon, and Oh, Seyong, "Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling," Microelectronics Reliability , vol. 48 no. 1, pp. 83-104, Jan. 2008. https://doi.org/10.1016/j.microrel.2007.01.091

Nychka, John A., Li, Yan, Yang, Fuqian, and Chen, Rong, "Can Whiskers Grow on Bulk Lead-Free Solder?," Journal of Electronic Materials, vol. 37 no. 1, pp. 90-95, Jan. 2008.

Wei, C. C., Liu, P. C., Chen, Chih, Lee, Jeffrey C. B., and Chen, P. C., "Relieving Sn Whisker Growth Driven by Oxidation on Cu Leadframe by Annealing and Reflowing Treatments," 2008 Pan Pacific Microelectronics Symposium & Exhibit, Kauai, HI, Jan. 22-24, 2008, pp. xx-xx.

Aragon, Joseph, Wavrik, Richard, Vianco, Paul, and Witham, John, "Tin Whisker Mitigation Methods," Defense Semiconductor Association Meeting, Las Vegas, NV, Jan. 14-17, 2008, pp. xx-xx. (Sandia Report SAND2008-0117C)

Courey, Karim J., NASA, Jan. 1, 2008.

2007: 0 books, 0 theses, 103 papers, and 6 web pages on tin whiskers

Barr, Stephanie, "Mitigating and Preventing the Growth of Tin and Other Metal Whiskers on Critical Hardware," The Aerospace Corporation, 2007.

Barr, Stephanie, "Mitigating and Preventing the Growth of Tin and Other Metal Whiskers on Critical Hardware (presentation)," The Aerospace Corporation, 2007.

Barthelmes, Jurgen, Crema, Paolo, and Kuhlkamp, Peter, "Whisker Growth during Heat-Humidity Storage - Mechanism and Factors of Influence," SEMICON Singapore 2007, Singapore, 2007, pp. xx-xx.

Fang, Tong, Mathew, Sony, Osterman, Michael, and Pecht, Michael, "Assessment of risk resulting from unattached tin whisker bridging," Circuit World, vol. 33 no. 1, pp. 5-8, 2007.

Garich, H., McCrabb, H., Taylor, E. J., and Inman, M., "Controlling Whisker Formation in Tin-Based Solders Using Electrically Mediated Electrodeposition," ECS Transactions, vol. 6 no. 8, pp. 153-163, 2007.

Jiang, Bo, and Xian, Ai-Ping, "Observations of ribbon-like whiskers on tin finish surface," Journal of Materials Science: Materials in Electronics, vol. 18 no. 5, pp. 513-518, 2007.

Johnson, Howard, "Rollback the Lead-Free Initiative," High-Speed Digital Design Online Newsletter, vol. 10 no. 1, pp. xx-xx, 2007.

Ouyang, Fan-Yi, Chen, Kai, Tu, K. N., and Lai, Yi-Shao, "Effect of current crowding on whisker growth at the anode in flip chip solder joints," Applied Physics Letters, vol. 91, pp. 231919-1-231919-3, 2007.

Smetana, Joe, "Theory of Tin Whisker Growth "The End Game"," iNEMI Tin Whisker Workshop at ECTC May 31, 2005 Updated 2007.

Tsuji, Kiyotaka, "Growth Mechanism of Tin Whisker," Journal of the Surface Finishing Society of Japan, vol. 58 no. 7, pp. 406-411, 2007.

Welzel, U., and Mittemeijer, E. J., "Stress evolution in thin films; diffusion and reactions," Defect and Diffusion Forum, vol. 264, pp. 71-78, 2007.

Chuang, Tung-Han, Lin, Hsiu-Jen, and Chi, Chih-Chien, "Oxidation-Induced Whisker Growth on the Surface of Sn-6.6(La, Ce) Alloy," Journal of Electronic Materials, vol. 36 no. 12, pp. 1697-1702, Dec. 2007.

Lin, Shih-Kang, Yorikado, Yuhi, Jiang, Junxiang, Kim, Keun-Soo, Suganuma, Katsuaki, Chen, Sinn-Wen, Tsujimoto, Masanobu, and Yanada, Isamu, "Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers," Journal of Electronic Materials, vol. 36 no. 12, pp. 1732-1734, Dec. 2007.

Nakadaira, Yoshikuni, Jeong, Seyoung, Shim, Jongbo, Seo, Jaiseok, Min, Sunhee, Cho, Taeje, Kang, Sayoon, and Oh, Seyong, "Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling," Microelectronics Reliability , vol. 47 no. 12, pp. 1928-1949, Dec. 2007. https://doi.org/10.1016/j.microrel.2007.03.008

Subbarayan, G., Kinyanjui, R., Deutsch, J., and Baker, M., "An Experimental Study of a Components Termination Finish Conversion Process: The Robotic Stripping and Solder Termination Process," SMTAnews & Journal of Surface Mount Technology, vol. 20 no. 4, pp. 11-20, Oct.-Dec. 2007.

Preliminary Guidance for Optical Inspection for Metal Whiskers Dec. 10, 2007.

Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla, "Metal Whiskers: Failure Modes and Mitigation Strategies," Microelectronics Reliability and Qualification Workshop, Los Angeles, CA, Dec. 4-5, 2007, pp. xx-xx.

Mason, Maribeth, and Eng, Genghmun, "Understanding Tin Plasmas: A New Approach to Tin Whisker Risk Assessment," Microelectronics Reliability and Qualification Workshop, Los Angeles, CA, Dec. 4-5, 2007, pp. xx-xx.

Kushner, Arthur S., "Plating Clinic: Tin Whiskers Revisited," Products Finishing, vol. 71 no. 14, pp. 61-63, Nov. 2007.

Li, Shi-Bo, Bei, Guo-Ping, Zhai, Hong-Xiang, Zhang, Zhi-Li, Zhou, Yang, and Li, Cui-Wei, "The origin of driving force for the formation of Sn whiskers at room temperature," Journal of Materials Research, vol. 22 no. 11, pp. 3226-3232, Nov. 2007.

Mason, M. S., and Eng, G., "Understanding tin plasmas in vacuum: A new approach to tin whisker risk assessment," Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, vol. 25 no. 6, pp. 1562-1566, Nov. 2007.

Brown, Neil, "A Summary of Methods for Minimizing Tin Whisker Growth," Shipley Electronic & Industrial Finishing. (before Nov. 11, 2007)

Xu, Chen, Fan, Chonglun, Vysotskaya, Anna, Abys, Joseph A., Zhang, Yun, Hopkins, Leslie, and Stevie, Fred, "Understanding Whisker Phenomenon - Part II: Competitive Mechanisms," Electroplating Chemicals and Services. (before Nov. 11, 2007)

Barthelmes, Jurgen, Lagorce-Broc, Florence, Kuhlkamp, Peter, Kok, Sia-Wing, and Neoh, Din-Ghee, "Different Storage Conditions have Different Whisker Growth Mechanisms - Can Bright Tin be an Alternative to Matt Tin ?," 31st International Conference on Electronics Manufacturing and Technology, Kuala Lumpur, Malasia, Nov. 8-10, 2007, pp. 257-261.

Say, Wen C., and Chen, Chien Chon, "Formation of Tin Whiskers and Spheres on Anodic Aluminum Oxide Template," Japanese Journal of Applied Physics, vol. 46 no. 11, pp. 7577-7580, Nov. 6, 2007.

Field, Karen, "A Dog's RF Tag Fails - Is RoHS the Culprit?," Electronics Weekly , Nov. 5, 2007.

Kato, Takahiko, Akahoshi, Haruo, Nakamura, Masato; Hashimoto, Tomoaki, and Nishimura, Asao, "Effects of Minor Elements in Cu Leadframe on Whisker Initiation From Electrodeposited Sn/Cu Coating," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 4, pp. 258-269, Oct. 2007.

Kato, Takahiko, Akahoshi, Haruo, Terasaki, Takeshi, Iwasaki, Tomio, Nakamura, Masato, Hashimoto, Tomoaki, and Nishimura, Asao, "Whisker Initiation Behavior from Electrodeposited Sn/Cu Coating on Cu Leadframe," Materials Science Forum, vol. 561-565 part 3, pp. 1685-1688, Oct. 2007.

Sorensen, N. Rob, and Vianco, Paul, "The Sn Whisker Issue in High-Reliability Electronics," DoD Fusing Group Briefing, Oct. 30, 2007, pp. xx-xx. (Sandia Report SAND2007-7023C)

Sampson, Michael J., "The Development of a NASA Lead-Free Policy for Electronics," 20th JAXA Microelectronics Workshop, Tsukuba, Japan, Oct. 29, 2007, pp. xx-xx.

"Lead Free Electronics Impact on DoD Programs," DMSMS Conference 2007, Orlando, FL, Oct. 29, 2007, pp. xx-xx.

"Examples of tin-whiskers failures," evertiq, Oct. 11, 2007.

Robertson, Jordan, 'Tin whiskers' imperil electronics, Yahoo! News, Oct. 8, 2007.

Robertson, Jordan, "'Tin Whiskers' ruin electronics, stoke debate over anti-lead regulations," Dayton Daily News, Oct. 7, 2007, pp. A29.

Robertson, Jordan, "Tiny 'tin whiskers' imperil electronics," USA Today, Oct. 7, 2007.

Yu, C. H., Kang, H. S., Kim, K. S., Han, S. W., and Yang, K. C., "Effects of Postbake on the Microstructure and Whisker Growth of Matte Sn Finish," 12th International Symposium on Advanced Packaging Materials , San Jose, CA, Oct. 3-5, 2007, pp. 158-164.

Lin, Y. W., and Kao, C. Robert, "Tin Whisker Growth Induced by High Electron Current Density," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 62-65.

Jiang, B., and Xian, A.-P., "Spontaneous growth of tin whiskers on tin-rare-earth alloys," Philosophical Magazine Letters, vol. 87 no. 9, pp. 657-662, Sept. 2007.

McCullen, Jack, "8.5 Tin Whisker Status", JEDEC/JEITA Joint Meeting #11, Kagoshima, Japan, Sept. 2007.

Woolley, Mark, and Choi, Jae, "The Effects of Tin Whisker Testing on Solder Connections," IPC Review , vol. 48 no. 8, pp. 6, Sept. 2007.

Tanaka, Toru, Kawaguchi, Hiroshi, Terao, Takashi, Babasaki, Tadatoshi, and Yamasaki, Mikio, "Modeling of Fuses for DC Power Supply Systems Including Arcing Time Analysis," 29th International Telecommunications Energy Conference , Rome, Italy, Sept. 30-Oct. 4, 2007, pp. 135-141.

Debeasi, Ryan, "Get up to scratch on metal whiskers," Network World, vol. 24 no. 34, pp. 24, Sept. 3, 2007.

DeBeasi, Ryan, "How to keep metal whiskers from wrecking your data center," Network World, Aug. 27, 2007.

DeBeasi, Ryan, "How worried should you be about metal whiskers?," Network World , Aug. 27, 2007.

DeBeasi, Ryan, "Metal whiskers photo gallery," Network World, Aug. 27, 2007.

Wei, C. C., Liu, P. C., Chen, Chih, Lee, Jeffrey C.B., and Wang, I Ping, "Relieving Sn whisker growth driven by oxidation on Cu leadframe by annealing and reflowing treatments," Journal of Applied Physics, vol. 102 no. 4, pp. 043521-1-043521-7, Aug. 15, 2007.

Zhao, Fang, Wang, Qian, and Lee, Taekoo, "Characteristics of Tin Whisker Growth on Matte Tin Surface Finishes by Acceleration Conditions," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

"iNEMI Tin Whisker Workshop," Tin World, no. 18, pp. 14, Early Summer 2007.

"New tin whisker standard," Tin World, no. 18, pp. 16, Early Summer 2007.

Lin, Shih-kang, Yorikado, Yuhi, Jiang, Junxiang, Kim, Keun-Soo, Suganuma, Katsuaki, Chen, Sinn-wen, Tsujimoto, Masanobu, and Yanada, Isamu, "Mechanical deformation-induced Sn whiskers growth on electroplated films in the advanced flexible electronic packaging," Journal of Materials Research, vol. 22 no. 7, pp. 1975-1986, July 2007.

Rovner, Sophie L., "Coping With Whiskers: 'The Five Stages Of Metal Whisker Grief'," Chemical & Engineering News, vol. 85 no. 29, pp. xx-xx, July 16, 2007.

Rovner, Sophie L., "Stopping the Tin Whisker Stalkers," Chemical and Engineering News , vol. 85 no. 29, pp. 30-33, July 16, 2007.

Vo, Nick, "Board-Level Whisker Testing," Apex, July 12, 2007.

Subbarayan, Guhan, Kinyanjul, Robert, Tsai, Pei Fang Jenneifer, and Srihari, Krishnaswami, "Mechanical Reliability Evaluation of Stripped and Replated Component Termination Finishes," Proceedings of the ASME InterPack Conference, Volume 1, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 43-49.

Takeshita, Yuki, and Kimura, Yuji, "Generating Behavior of Whisker on Pb Free Sn Plating and Its Control," Proceedings of the ASME InterPack Conference, Volume 1, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 591-594.

Yang, Fuqian, "Analysis of the lattice diffusion-controlled growth of metallic whiskers," Journal of Physics D: Applied Physics, vol. 40 no. 13, pp. 4034-4038, July 7, 2007.

Asrar, Nausha, Vancauwenberghe, Oliver, and Prangere, Sebastien, "Tin Whiskers Formation on an Electronic Product: A Case Study," Journal of Failure Analysis and Prevention, vol. 7 no. 3, pp. 179-182, June 2007.

Liang, Jin, Xu, Zhi-Hui, and Li, Xiaodong, "Whisker nucleation in indentation residual stress field on tin plated component leads," Journal of Materials Science: Materials in Electronics , vol. 18 no. 6, pp. 599-604, June 2007.

Munson, Terry, "SAC Whiskers?," Circuits Assembly, vol. 18 no. 6, pp. 58, June 2007.

Smetana, Joe, "iNEMI updates tin whisker recommendations," Global SMT and Packaging, vol. 7 no. 6, pp. 14, 16-18, June 2007.

Mathew, Sony, Osterman, Michael, Shibutani, Tadahiro, Yu, Qiang, and Pecht, Michael, "Tin Whiskers: How to Mitigate and Manage the Risks," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Subbarayan, Guhan, Kinyanjui, Robert, and Deutsch, Joel, "An Experimental Study of a Components Termination Finish Conversion Process: The Robotic Stripping and Solder Dipping Process," Successful Lead-Free/RoHS Strategies Conference 2007, Boxborough, MA, June 21, 2007, pp. xx-xx.

Hillman, Craig, Fischer, Gerd, and Esser, Robert, "Tin Whisker Risk Assessment Case Study," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Mathew, Sony, Osterman, Michael, and Pecht, Michael, "Evaluating Tin Whisker Mitigation Strategies: Conformal Coatings and Plating Technique," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Seelig, Karl, and Nishimura, Tetsuro, "A Unique Tin Whisker Growth Study of Nine Lead Free Alloys," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Shibutani, Tadahiro, Yu, Qiang, Shiratori, Masaki, and Pecht, Michael G., "Evaluation of Pressure-Induced Tin Whisker Formation," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Baylakoglu, Ilknur, "Reliability Concerns of Lead-free Solder Use in Aerospace Applications," 3rd International Conference on Recent Advances in Space Technologies , Istanbul, Turkey, June 14-16, 2007, pp. 158-164.

"On Trial In Brazil," Air Safety Week, vol. 21 no. 23, June 11, 2007.

"iNEMI tin whisker group publishes updated recommendations," Tin World, no. 17, pp. 11, Spring 2007.

Chuang, Tung-Han, "Temperature Effects on the Whiskers in Rare-Earth Doped Sn-3Ag-0.5Cu-0.5Ce Solder Joints," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 38A no. 5, pp. 1048-1055, May 2007. https://doi.org/10.1007/s11661-007-9126-5

Uchic, Michael D., Holzer, Lorenz, Inkson, Beverley J., Principe, Edward L., and Munroe, Paul, "Three-Dimensional Microstructural Characterization Using Focused Ion Beam Tomography," MRS Bulletin, vol. 32 no. 5, pp. 408-416, May 2007.

Lee, Jeffrey C. B., Chen, P. C., and Tyan, C. G., "The Sn Whisker Growth Evolution of IC Packaging on the PC Board Assembly," 2007 Proceedings 57th Electronic Components & Technology Conference , Reno, NV, May 29-June 1, 2007, pp. 1964-1970.

Sobiech, M., Welzel, U., Schuster, R., Mittemeijer, E. J., Hugel, W., Seekamp, A., and Muller, V., "The Microstructure and State of Stress of Sn Thin Films after Post-Plating Annealing: An Explanation for the Suppression of Whisker Formation?," 2007 Proceedings 57th Electronic Components & Technology Conference , Reno, NV, May 29-June 1, 2007, pp. 192-197.

Handwerker, Carol, Pedigo, Aaron, Blendell, John, Williams, Maureen, Moon, Kil-Won, Stafford, Gery, Boettinger, Bill, Munson, Terry, Fritz, Denny, Latta, Gary, and Ganster, Andy, "Whisker to Hillock Transition: Stress Relaxation Mechanisms in Sn, Sn-Cu, and Sn-Pb Films," iNEMI Tin Whisker Workshop, Reno, NV, pp. xx-xx, May 29, 2007.

"Tin Whiskers," Circuitnet, May 14, 2007.

Tyler, Donald, "Tin Whisker Mitigation Through Robotic Hot Solder Dip (RHSD)," 2007 Medical Electronics Symposium, Minneapolis, MN, May 1-3, 2007, pp. xx-xx.

Garich, H., Taylor, E. J., Sun, J., Panashchenko, L., Mathew, S., Osterman, M., and Pecht, M., "Evaluation of Faradayic Plating Method for Controlling Tin Whisker Growth," Proceedings of CALCE International Symposium on Tin Whiskers , College Park, MD, Apr. 24-25, 2007, pp. xx-xx.

Hillman, David, Margheim, Sue, and Straw, Eric, "The Use of Tin/Bismuth Plating for Tin Whisker Mitigation on Fabricated Mechanical Parts," 1st International Symposium on Tin Whiskers, College Park, MD, Apr. 24-25, 2007, pp. xx-xx.

Leidecker, Henning, and Brusse, Jay, "Metal Whiskering: Tin, Zinc, and Cadmium," Proceedings of CALCE International Symposium on Tin Whiskers, College Park, MD, Apr. 24-25, 2007, pp. xx-xx.

Nishimi, Keith, "Space Shuttle Program Tin Whisker Mitigation," Proceedings of CALCE International Symposium on Tin Whiskers, College Park, MD, Apr. 24-25, 2007, pp. xx-xx.

Seelig, Karl, and Nishimura, Tetsuro, "A Unique Tin Whisker Growth Study of Nine Lead Free Alloys," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Mason, Maribeth, and Eng, Genghmun, "Understanding Tin Plasmas: A New Approach to Tin Whisker Risk Assessment," Proceedings 45th Annual IEEE International Reliability Physics Symposium , Phoenix, AZ, Apr. 15-19, 2007, pp. 150-155.

Mason, Maribeth, and Eng, Genghmun, "Understanding Tin Plasmas: A New Approach to Tin Whisker Risk Assessment (presentation)," Proceedings 45th Annual IEEE International Reliability Physics Symposium, Phoenix, AZ, Apr. 15-19, 2007, pp. 150-155.

Hilty, Robert D., and Corman, Ned, "An Electrical Characterization of Tin Whisker Shorting," Materials Research Society Spring Meeting, San Francisco, CA, Apr. 9-13, 2007, pp. xx-xx.

"New Immersion Tin Process PRESA RMK-30: Tin Whisker Issue," Uyemura, Mar. 2007.

Chuang, Tung-Han, and Yen, Shiu-Fang, "Abnormal Tin Whisker Growth in Rare Earth Element-Doped Sn3Ag0.5CuXCe Solder Joints," Materials Science Forum, vol. 539-543 part 4, pp. 4019-4024, Mar. 2007.

Moriuchi, Hiroyuki, Tadokoro, Yoshihiro, Sato, Masahide, Furusawa, Takeshi, and Suzuki, Noboru, "Microstructure of External Stress Whiskers and Mechanical Indentation Test Method," Journal of Electronic Materials, vol. 36 no. 3, pp. 220-225, Mar. 2007.

Osenbach, J. W., DeLucca, J. M., Potteiger, B. D., Amin, A., and Baiocchi, F. A., "Sn-whiskers: truths and myths," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 283-305, Mar. 2007.

Puttlitz, Karl J., and Galyon, George T., "Impact of the ROHS Directive on high-performance electronic systems Part II: key reliability issues preventing the implementation of lead-free solders," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 347-365, Mar. 2007.

Tu, K. N., Chen, Chih, and Wu, Albert T., "Stress analysis of spontaneous Sn whisker growth," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 269-281, Mar. 2007.

Williams, M. E., Moon, K.-W., Boettinger, W. J., Josell, D., and Deal, A. D., "Hillock and Whisker Growth on Sn and SnCu Electrodeposits on a Substrate Not Forming Interfacial Intermetallic Compounds," Journal of Electronic Materials, vol. 36 no. 3, pp. 214-219, Mar. 2007.

Zou, Ling, and Hunt, Chris, "Test Method for Conformal Coating Protection Performance of Electronic Assembly in Harsh Environments," NPL Report DEPC-MPR 060, Mar. 2007.

Hardin, Winn, "RoHS Part II: Lighten Up on Heavy Metals," Machine Vision Online, Mar. 27, 2007.

Aragon, Joseph, Wavrik, Richard, Vianco, Paul, Witham, John, and Bou, Jimmy, "Tin Whisker Mitigation Methods," 11th International Components for Military and Space Electronics Conference, Mar. 12-15, 2007, pp. xx-xx. (Sandia Report SAND2007-0400C)

Anderson, Richard A., "Reviewing RoHS Compliance For Harsh Environments," Microwaves & RF, vol. 46 no. 2, pp. 66, 68, 70, 72, 74, 76, 79-80, 82, 84, Feb. 2007.

Heffner, Tracy, "iNEMI Tin Whisker User Group Publishes Updated Set of Recommendations," Printed Circuit Design and Manufacture, vol. 24 no. 2, pp. 10, Feb. 2007.

Munson, Terry, "Metal Whiskers," Foresite, Feb. 28, 2007.

NASA GOLD Whiskers, Feb. 22, 2007.

NASA GSFC Experiments, Feb. 22, 2007.

NASA Metal "Dendrites" are NOT the Same as Metal "Whiskers", Feb. 22, 2007.

NASA Related Links, Feb. 22, 2007.

Chuang, T. H., Lin, H. J., and Chi, C. C., "Rapid growth of tin whiskers on the surface of Sn-6.6Lu alloy," Scripta Materialia, vol. 56 no. 1, pp. 45-48, Jan. 2007.

Frye, Asa, Galyon, George T., and Palmer, Larry, "Crystallographic Texture and Whiskers in Electrodeposited Tin Films," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 1, pp. 2-10, Jan. 2007.

Fukuda, Yuki, Osterman, Michael, and Pecht, Michael, "Length Distribution Analysis for Tin Whisker Growth," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 1, pp. 36-40, Jan. 2007.

Fukuda, Yuki, Osterman, Michael, and Pecht, Michael, "The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth," Microelectronics Reliability, vol. 47 no. 1, pp. 88-92, Jan. 2007. https://doi.org/10.1016/j.microrel.2006.04.011

Gedney, Ronald W., "Foreward Special Section on Tin Whiskers," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 30 no. 1, pp. xx-xx, Jan. 2007.

Osenbach, J. W., DeLucca, J. M., Potteiger, B. D., Amin, A., Shook, R. L., and Baiocchi, F. A., "Sn Corrosion and Its Influence on Whisker Growth," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 1, pp. 23-35, Jan. 2007.

Smetana, Joe, "Theory of Tin Whisker Growth: "The End Game"," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 1, pp. 11-22, Jan. 2007.

Copon, Sonny M., "Whisker Test Report," Amkor Technology Whisker Test Report #20060623 Rev. 00, Jan. 15, 2007.

2006: 0 books, 1 thesis, 131 papers, and 1 web page on tin whiskers

"JEDEC and IPC Release Tin Whisker Acceptance Testing," Tin World , no. 14, pp. 11, 2006.

Barthelmes, Jurgen, Kuhlkamp, Peter, Lagorce-Broc, Florence, and Neoh, Din-Ghee, "Quantification of the influence of all important physical and chemical Tin plating bath parameters on the propensity for whisker formation," SEMICON Singapore 2006, Singapore, 2006, pp. xx-xx.

Chen, Keming, and Wilcox, Geoffrey D., "Tin-Manganese Alloy Electrodeposits: I. Electrodeposition and Microstructural Characterization," Journal of the Electrochemical Society, vol. 153 no. 9, pp. C634-C640, 2006.

Dittes, M., Oberndorff, P., Crema, P., and Su, P., "Tin Whisker Formation - A Stress Relieve Phenomenon," AIP Conference Proceedings, vol. 817, pp. 348-359, 2006. https://doi.org/10.1063/1.2173568

Fang, Tong, Osterman, Michael, Mathew, Sony, and Pecht, Michael, "Tin whisker risk assessment," Circuit World, vol. 32 no. 3, pp. 25-29, 2006.

Muraki, Taiji, Ohnishi, Chiaki, Ikedo, Kenshi, Udono, Naoyasu, Mori, Shigeru, Sugiura, Shinichi, and Watanabe, Hiromichi, "Development of lead free vehicle products," Fujitsu Ten Technical Journal, no. 26, pp. 42-48, 2006.

Tsuji, Kiyotaka, "Study on the Mechanism of Sn Whisker Growth Part I Relation between Whisker Growth and the Structure of Deposits," Journal of the Surface Finishing Society of Japan, vol. 57 no. 6, pp. 451-458, 2006.

Tsuji, Kiyotaka, "Study on the Mechanism of Sn Whisker Growth Part II Estimation of Excessive Energy & Its Origin," Journal of the Surface Finishing Society of Japan, vol. 57 no. 7, pp. 529-536, 2006.

Wen, Shixue, and Szpunar, Jerzy A., "Cathodic Potential Oscillations of Sn(II) Reduction and Hydrogen Evolution in Acid Stannous Sulfate Solutions," Journal of the Electrochemical Society , vol. 153 no. 3, pp. E45-E51, 2006.

Woodrow, Tom, "Keyence VK-9700 3D Laser Confocal Microscope," Boeing, 2006.

Zhang, Wan, and Schwager, Felix, "Effects of Lead on Tin Whisker Elimination," Journal of the Electrochemical Society, vol. 153 no. 5, pp. C337-C343, 2006.

Zhao, Jie, Li, Ning, Cui, Guofeng, and Zhao, Jianwei, "Study on Immersion Tin Process by Electrochemical Methods and Molecular Orbital Theory," Journal of the Electrochemical Society, vol. 153 no. 12, pp. C848-C853, 2006.

Chuang, Tung-Han, "Rapid whisker growth on the surface of Sn-3Ag-0.5Cu-1.0Ce solder joints," Scripta Materialia, vol. 55 no. 11, pp. 983-986, Dec. 2006.

Birkett, M. "Tin Whisker Formation Test Report," TT electronics Welwyn Components, Dec. 2006.

Sprovieri, John, "Trimming Whiskers," Assembly, vol. xx no. xx, pp. xx-xx, Dec. 2006.

Winterstein, J. P., and Norton, M. G., "The influence of porosity on whisker growth in electroplated tin films," Journal of Materials Research, vol. 21 no. 12, pp. 2971-2974, Dec. 2006.

"iNEMI Tin Whisker user group publishes updated recommendations to help reduce risk of tin whiskers," emsnow, Dec. 20, 2006.

"Set of recommendations to help reduce risk of Tin Whiskers," evertiq, Dec. 18, 2006.

Roos, Gina, "iNEMI updates tin whisker guidelines," Industrial Control Design Line, Dec. 18, 2006.

Roos, Gina, "iNEMI updates tin whisker guidelines," Green SupplyLine, Dec. 18, 2006.

"Tin Whisker User Group Publishes Updated Set of Recommendations Help Reduce Risk of Tin Whiskers," PCB007, Dec. 15, 2006.

Lee, Chieh-Ju, and Reynolds, Heidi, "Tin Whisker Accelerated Test Project," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Iwane, Y., Morizono, Y., Ohno, Y., and Kuwano, N., "Behavior of Whisker Growth on Tin Plated Fe-42%Ni Substrates," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 150-153.

Sosiati, H., Kuwano, N., Hata, S., Iwane, Y., Morizono, Y., and Ohno, Y., "Tin Whisker Formation on a Lead-free Solder Alloy Studied by Transmission Electron Microscopy," 8th Electronics Packaging Technology Conference , Singapore, Dec. 6-8, 2006, pp. 398-403.

Sriyarunya, Anocha, and Tondtan, Jiraporn, "Tin Whisker Mitigation Study on Alloy 42 Pure Tin Plating" 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 726-732.

Tsutsumi, Keisuke, Iwane, Yuicji, Morizono, Yasuhiro, Kozuka, Toshiyuki, and Ohno, Yasuhide, "Whisker Formation Behavior on Tin Film Plated in High Magnetic Field," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 722-725.

"iNEMI Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products Version 4 (12-1-06)," iNEMI, Dec. 1, 2006.

Takeuchi, Makoto, Kamiyama, Kouichi, and Suganuma, Katsuaki, "Suppression of Tin Whisker Formation on Fine Pitch Connectors by Surface Roughening," Journal of Electronic Materials, vol. 35 no. 11, pp. 1918-1925, Nov. 2006.

"The Growth of Tin Whisker," Samsung. (before Nov. 26, 2006)

"Tin Whisker References." (before Nov. 26, 2006)

Hunt, Christopher, "Measuring Tin Whisker Propensity." (before Nov. 26, 2006)

Tsuji, Kiyotaka, "Roll of Grain-boundary Free Energy & Surface Free Energy for Tin Whisker Growth," Ishihara Chemical Co. (before Nov. 26, 2006)

Zhang, Yun, Xu, Chen, Fan, Chonglun, Vysotskaya, Anna, and Abys, Joseph A., "Understanding Whisker Phenomenon - Part I: Growth Rates," Electroplating Chemicals and Services. (before Nov. 26, 2006)

Buetow, Mike, "GEIA Publishes Tin Whiskers Spec, 2 Others," Circuits Assembly , vol. 17 no. 10, pp. 6, Oct. 2006.

Evans, Rich, "Analysis of the Effects of Tin Whiskers at High Frequencies," IEEE Transactions on Electronics Packaging Manufacturing, vol. 29 no. 4, pp. 274-279, Oct. 2006.

Fukuda, Yuki, Osterman, Michael, and Pecht, Michael, "The Effect of Annealing on Tin Whisker Growth," IEEE Transactions on Electronics Packaging Manufacturing, vol. 29 no. 4, pp. 252-258, Oct. 2006.

Kao, H. J., Wu, W. C., Tsai, S. T., and Liu, C. Y., "Effect of Cu Additives on Sn Whisker Formation of Sn(Cu) Finishes," Journal of Electronic Materials, vol. 35 no. 10, pp. 1885-1891, Oct. 2006.

Kumar, A., Welzel, U., and Mittemeijer, E. J., "A method for the non-destructive analysis of gradients of mechanical stresses by X-ray diffraction measurements at fixed penetration/information depths," Journal of Applied Crystallography, vol. 39 no. 5, pp. 633-646, Oct. 2006.

Oberndorff, Pascal, Dittes, Marc, Crema, Paolo, Su, Peng, and Yu, Elton, "Humidity Effects on Sn Whisker Formation," IEEE Transactions on Electronics Packaging Manufacturing, vol. 29 no. 4, pp. 239-245, Oct. 2006.

Schroeder, Valeska, Bush, Peter, Williams, Maureen, Vo, Nhat (Nick), and Reynolds, Heidi L., "Tin Whisker Test Method Development," IEEE Transactions on Electronics Packaging Manufacturing, vol. 29 no. 4, pp. 231-238, Oct. 2006.

Shibutani, Tadahiro, Yu, Qiang, Yamashita, Takuma, and Shiratori, Masaki, "Stress-Induced Tin Whisker Initiation Under Contact Loading," IEEE Transactions on Electronics Packaging Manufacturing, vol. 29 no. 4, pp. 259-264, Oct. 2006.

Su, Peng, Howell, Jim, and Chopin, Sheila, "A Statistical Study of Sn Whisker Population and Growth During Elevated Temperature and Humidity Tests," IEEE Transactions on Electronics Packaging Manufacturing, vol. 29 no. 4, pp. 246-251, Oct. 2006.

Zhao, Jie-Hao, Su, Peng, Ding, Min, Chopin, Sheila, and Ho, Paul S., "Microstructure-Based Stress Modeling of Tin Whisker Growth," IEEE Transactions on Electronics Packaging Manufacturing, vol. 29 no. 4, pp. 265-273, Oct. 2006.

Fukuda, Yuki, Osterman, Michael, and Pecht, Michael, "Lead-free: Electrical Influence on Tin Whisker Growth," Surface Mount Technology (SMT), vol. 20 no. 9, pp. 41-42, Sept. 2006.

Klaus, M., Denks, I. A., and Genzel, Ch., "X-Ray Diffraction Analysis of Nonuniform Residual Stress Fields sii(t) under Difficult Conditions," Materials Science Forum, vol. 524-525, pp. 601-606, Sept. 2006.

Lavery, Patrick, "Tin whiskers and RoHS: a perspective," Electronic Products, vol. 49 no. 4, pp. 93, Sept. 2006.

Lee, Jeffrey C. B., Chen, P. C, Hsu, Hana, and Tyan, C. G, "The Effect of Surface Mounting Process on the Board Level Whisker Growth," IPC Review, vol. 47 no. 8, pp. 9, Sept. 2006.

Lee, Jeffrey C. B., Chen, P. C., Hsu, Hana, and Tyan, C. G., "The Effect of Surface Mounting Process on the Board Level Whisker Growth," Route, Sept. 2006.

Muller, Wolfgang H., "The Importance of Residual Stresses in Microelectronic Products and Materials," Materials Science Forum, vol. 524-525, pp. 1-10, Sept. 2006.

Sosiati, H., Hata, S., Kuwano, N., Iwane, Y., Morizono, Y., and Ohno, Y., "Microstructural Characterization of Whiskers and Oxidized Surfaces on Sn/FeNi42 and Pb-free Alloys," CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept. 25-28, 2006, pp. xx-xx.

Lee, Jeffrey C. B., and Tyan, C. G., "The Effect of Surface Mounting Process on Whisker Growth in IC Package," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 666-673.

Su, Peng, Bai, Song, Ding, Min, and Chopin, Sheila, "The Effects of Plating Parameters on the Microstructure and Whisker Growth Propensity of Pure Sn Finish," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 571-578.

Treichel, Todd H., "Reliability of Space Flight Crystal Controlled Oscillator Using Lead-Free Surface Mount Technology," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 536-546.

Woodrow, Thomas A., and Ledbury, Eugene A., "Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy, Part II," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 972-1004.

Woodrow, Thomas A., "Tracer Diffusion in Whisker-Prone Tin Platings," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 674-723.

Woodrow, Tom, "Tracer Diffusion in Whisker-Prone Tin Platings (presentation)," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 674-723.

Chuang, Tung-Han, and Yen, Shiu-Fang, "Abnormal Growth of Tin Whiskers in a Sn3Ag0.5Cu0.5Ce Solder Ball Grid Array Package," Journal of Electronic Materials, vol. 35 no. 8, pp. 1621-1627, Aug. 2006.

"Coating to stop tin whisker growth?," Circuitnet, Aug. 14, 2006.

Jiang, B., and Xian, A.-P., "Discontinuous growth of tin whiskers," Philosophical Magazine Letters , vol. 86 no. 8, pp. 521-527, Aug. 1, 2006.

Hundt, Michael, "Controlling tin whiskers in Pb-free assemblies," Electronic Products, vol. 49 no. 2, pp. 81-82, July 2006.

Hunter, Craig, and Reynolds, Chris, "Avoiding tin whiskers in Sn-Cu-plated connectors," Connector Specifier, vol. 22 no. 5, pp. 30, June/July 2006.

Kim, K. S., Yu, C. H., and Yang, J. M., "Tin whisker formation of lead-free plated leadframes," Microelectronics Reliability, vol. 46 no. 7, pp. 1080-1086, July 2006. https://doi.org/10.1016/j.microrel.2005.08.007

Stafford, G. R., Williams, M. E., Johnson, C. E., Moon, K.-W., Bertocci, U., Kongstein, O., and Boettinger, W. J., "Whisker Formation in Pb-Free Surface Finishes," ECS Transactions , vol. 1 no. 13, pp. 71-86, July 2006. https://doi.org/10.1149/1.2214599

Zou, Ling, and Hunt, Chris, "Protection Performance of Conformal Coatings in Harsh Environments," NPL Report DEPC-MPR 054, July 2006.

Mathew, Sony, Osterman, Michael, and Pecht, Michael, "Tin Whiskers," Circuitnet, July 24, 2006.

Pecht, Michael, "Tin Whiskers," Circuitnet, July 24, 2006.

Henshall, Greg, "Impact of second-level board assembly on tin whisker growth," Green SupplyLine, July 21, 2006.

Roos, Gina, "GEIA to release lead-free standards for high-reliability industries," EE Times Europe, July 20, 2006.

Roos, Gina, "GEIA to release lead-free standards for high-reliability industries," Green SupplyLine, July 20, 2006.

Roos, Gina, "GEIA to release lead-free standards for high-reliability industries," EE Times, July 20, 2006.

Minter, Charlie, "Tin Whiskers: Reliability Risk That Adds a New Dimension to DMSMS," 2006 Diminishing Sources and Material Shortages (DMSMS) Conference , Charlotte, NC, July 10-13, 2006.

Liu, Xingsheng, Davis, Ronald W., Hughes, Lawrence C., Rasmussen, Michael H., Bhat, Rajaram, Zah, Chung-En, and Stradling, Jim, "A study on the reliability of indium solder die bonding of high power semiconductor lasers," Journal of Applied Physics, vol. 100 no. 1, pp. 013104-1-013104-11, July 1, 2006.

"JEDEC, IPC Release Tin Whisker Acceptance Testing Standard," Circuitree, vol. 19 no. 6, pp. xx-xx, June 2006.

"JEDEC, IPC Release Tin Whisker Standards," Printed Circuit Design and Manufacture, vol. 23 no. 6, pp. 8, June 2006.

"Standards aim to reduce the risk of tin whiskers," Test & Measurement World, vol. 26 no. 5, pp. 12, June 2006.

Boisvert, Michelle M., "Tin Whisker Standards Help Alleviate Risk," Surface Mount Technology (SMT), vol. 20 no. 6, pp. 12, June 2006.

Chopin, Sheila, and Su, Peng, "Mitigating Whisker Growth on Electroplated Tin Finishes," Surface Mount Technology (SMT), vol. 20 no. 6, pp. xx-xx, June 2006.

Sengupta, Shirsho, Effects of Solder-Dipping as a Termination Re-finishing Technique . Masters Thesis for University of Maryland, College Park, MD, June 2006.

Fang, Tong, Osterman. Michael, and Pecht, Michael, "Statistical analysis of tin whisker growth," Microelectronics Reliability, vol. 46 no. 5-6, pp. 846-849, May-June 2006.

Fang, Tony, Matthew, Sony, Osterman, Michael, and Pecht, Michael, "Tin Whisker Risk Assessment for Electronic Products," Journal of the Reliability Information Analysis Center, pp. 10-11, 2nd Quarter 2006.

Jiang, Bo, and Xian, Ai-Ping, "Tin Whisker Growth under Cycling Current Pulse," Proceedings of the 2006 IEEE CPMT Conference on High Density Microsystem Design, Packaging and Component Failure Analysis, Shanghai, June 27-28, 2006, pp. 280-284.

"Whiskers Can't Be Eliminated," Design News, vol. 61 no. 9, pp. xx, June 26, 2006.

Buetow, Mike, "Close Shave? NASA Dismisses Sn Whisker Worries," Circuits Assembly , vol. xx no. x, pp. xx-xx, June 9, 2006.

Bergin, Chris, "NASA rebuttal of Tin Whisker dissent," NASA, June 8, 2006.

"JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," CircuiTree, vol. 19 no. 5, pp. xx-xx, May 2006.

Fang, Tong, Mathew, Sony, Osterman, Michael, and Pecht, Michael, "Assessing Tin Whisker Risk in Electronic Products," Surface Mount Technology (SMT), vol. 20 no. 5, pp. 24-25, May 2006.

Norvell, Robin, "JEDEC Standardizes Tin Whisker Acceptance Criteria," Circuits Assembly, vol. 17 no. 5, pp. xx-xx, May 2006.

Zhang, Wan, and Schwager, Felix, "Effects of Lead on Tin Whisker Elimination," iNEMI Tin Whisker Workshop, San Diego, CA, May 30, 2006, pp. xx-xx.

"JETRO Releases the Results of its Survey of Japanese Manufacturers in Europe and Turkey," PCB007, May 26, 2006.

Problem Advisory FV5-P-06-01A. May 19, 2006.

"Tin-whisker issues deserve to be on the front burner," Military & AerospaceElectronics. (May 12, 2006)

Elliott, Mick, "RoHS rules will hit supply of non-compliant components," Electronics Weekly, May 12, 2006.

Miller, Harvey, "The Swatch Group Struggles with Lead-Free, Applies for Exemption," PCB007, May 11, 2006.

"Reducing the risk of tin whiskers on lead-free products," RF Design, vol. xx no. x, pp. xx-xx, May 10, 2006.

Kim, Kyung-Seob, Yu, Chung-Hee, and Yang, Jun-Mo, "Behavior of tin whisker formation and growth on lead-free solder finish," Thin Solid Films, vol. 504 no. 1-2, pp. 350-354, May 10, 2006.

Olsson, Jesper, "Get used to your tin whiskers," evertiq, May 9, 2006.

Sperling, Ed, "RoHS will lead to tin whiskers," Electronics Weekly, May 8, 2006.

"JEDEC and IPC release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," emsnow, May 5, 2006.

Olsson, Jesper, "New tin whisker testing and reporting standard," evertiq, May 5, 2006.

Sperling, Ed, "Get Used To Tin Whiskers," Electronic News, May 5, 2006.

"JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," PCB007, May 4, 2006.

"JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," FPGA and Structured ASIC Journal, vol. xx no. x, pp. xx-xx, May 4, 2006.

"Standards aim to reduce the risk of tin whiskers," Test & Measurement World, vol. 26 no. 4, pp. xx-xx, May 4, 2006.

Roos, Gina, "JEDEC, iNEMI release tin whisker standard," Green SupplyLine , May 4, 2006.

"New Standards on Tin Whisker Mitigation," Circuits Assembly, vol. 17 no. 4, pp. 36, Apr. 2006.

Leidecker, Henning, and Brusse, Jay, "Tin Whiskers: A History of Documented Electrical System Failures," NASA, Apr. 2006.

Halvorson, Todd, "NASA Plans Partial Fix for Discovery Orbiter to Reduce ISS Risk," Florida Today, Apr. 27, 2006.

Parker, Richard, "More Than You Needed To Know About Tin Whiskers," SMTA/IMAPS Mini-Symposium, Indianapolis, IN, Apr. 24, 2006.

Dr. RoHS, "Dr RoHS: BGA solder balls and tin whiskers," Electronics Weekly , Apr. 19, 2006.

Rollins, William P., Pinsky, David A., Minter, Charles S., Toussaint, Gary, Das, Diganta, and Tyler, Donald, "Final Report on the Transformational Manufacturing Technology Initiative (TMTI) ManTech Research Project S1057: Tin Whisker Mitigation," Apr. 12, 2006.

"JESD201, Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes," Arlington, VA: JEDEC Solid State Technology Association, Mar. 2006.

"JP002, Current Tin Whiskers Theory and Mitigation Practices Guideline," Arlington, VA: JEDEC Solid State Technology Association and Bannockburn, IL: IPC, Mar. 2006.

Hayashida, Yoshitou, Takahashi, Yoshiyuki, Ohno, Takao, and Shohji, Ikuo, "Whisker-Free Pb-Free Solder through Alloying," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 70 no. 3, pp. 220-225, Mar. 2006.

Verdi, Fred, "GEAI Tin Whisker Industry Standard," empfasis, pp. xx-xx, Mar. 2006.

Geren, David, "Reduction of Hazardous Substances (RoHS)," CineMag Application Note AN-105, Mar. 29, 2006.

Dunn, Barrie, "15-1/2 Years of Tin Whisker Growth - Results of SEM Inspections Made on Tin Electroplated C-Ring Specimens," ESTEC Materials Report 4562, Mar. 22, 2006.

Liang, J., Morand, G., Dariavach, N., and Shangguan, D., "Tin Whisker Formation Kinetics on Sn-Pb HASL Coating Layer Inside Plated Through Holes With Press-Fit Complaint Pins," 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 41.

Osenbach, John, "Sn-Whiskers: Truths and Myths," 2006 Lead-Free Technology Workshop , San Antonio, TX, Mar. 12, 2006, pp. xx-xx.

Kayser, David, "http://www.agingaircraftconference.org/all_files/28/28b/28b-ppt.pdf"> "Lead-free Solder & Tin Whiskers Situation Summary," 9th Joint FAA/DoD/NASA Aging Aircraft Conference, Atlanta, GA, Mar. 6-9, 2006.

Rollins, William P., Pinsky, David A., Minter, Charles S., Toussaint, Gary, Das, Diganta, and Tyler, Donald, "(Draft) Final Report on the Transformational Manufacturing Technology Initiative (TMTI) ManTech Research Project S1057: Tin Whisker Mitigation," Mar. 3, 2006.

"Getting the Lead Out," Appliance Design, vol. xx no. x, pp. xx-xx, Feb. 2006.

Lavery, Patrick, "Strategies to Mitigate the Tin Whisker Phenomenon, Rev. 1.1" Vicor Corp., Feb. 2006.

DiBugnara, Ray, "Mitigating tin whisker risks," Green SupplyLine, Feb. 28, 2006.

Xu, Chen, Zhang, Yun, Fan, Chonglun, and Abys, Joseph A., "Thin Sn over Ni: A Practical And Effective Whisker Mitigation Strategy For Leadframe," IPC Printed Circuits Expo, APEX and the Designer Summit , Anaheim, CA, Feb. 8-10, 2006, pp. S04-01-1-S-4-01-7.

Chen, Chien-Chon, Bisrat, Y., Luo, Z. P., Schaak, R. E., Chao, C.-G., and Lagoudas, D. C., "Fabrication of single-crystal tin nanowires by hydraulic pressure injection," Nanotechnology, vol. 17 no. 2, pp. 367-374, Jan. 2006.

Kim, Keun-Soo, Matsuura, Toshinori, and Suganuma, Katsuaki, "Effects of Bi and Pb on oxidation in humidity for low-temperature lead-free solder systems," Journal of Electronic Materials, vol. 35 no. 1, pp. 41-47, Jan. 2006.

Smetana, Joe, and Gedney, Ron, "Tin Whisker Management Guidelines, Part 2," Circuits Assembly , vol. 17 no. 1, pp. 64-65, Jan. 2006.

Smetana, Joe, and Gedney, Ron, "Tin Whisker Management Guidelines, Part 2," Printed Circuit Design and Manufacture, vol. 23 no. 1, pp. 14, Jan. 2006.

"Requested Exemption from the requirements of Article 4(1) of Directive 2002/95/EC," Swatch, Jan. 12, 2006.

Spiegel, Rob, "Tin whisker debate roars on," Design News, vol. xx no. x, pp. xx-xx, Jan. 9, 2006.

Smetana, Joe, and Gedney, Ron, "Tin Whisker Management Guidelines, Part 2," Jan. 1, 2006.

2005: 0 books, 3 theses, 150 papers, and 33 web pages on tin whiskers

A Guide To Lead-Free Soldering for Assemblers & Sub-Contractors, Version 2.6, $68 from Roger Bilham Consultancy

"Industry Groups Continue Focus on Tin Whiskers," CPMT Society Outlook , vol. 1, pp. 3-4, 2005.

"Robotic Solder Dip Solves Tin Whisker Problem," Navy Mantech, 2005.

Choi, Chung-Seog, Shong, Kil-Mok, Kim, Dong-Ook, Kim, Dong-Woo, and Kim, Young-Seok, "Analysis of Dispersive Characteristics and Structures of Copper Wire Melted by Overcurrent," IEEJ Transactions on Power and Energy, vol. 125 no. 12, pp. 1327-1331, 2005.

Fang, Tong, Tin Whisker Risk Assessment Studies. Ph. D. Thesis for University of Maryland, College Park, Maryland. 2005.

Fukuda, Yuki, Experimental Investigations of Whisker Formation on Tin Platings . Ph. D. Thesis for University of Maryland, College Park, Maryland. 2005.

McCullen, Jack, and Gupta, Vivek, "Sn-Whisker Test Standards Correlation to Market Segment Use Conditions," Lead-Free Magazine, vol. 5, 2005.

Meeh, Peter, "Immersion tin: a proven final finish for printed circuit boards providing reliable solderability and marginal formation of tin whiskers," Circuit World, vol. 31 no. 1, pp. 28-40, 2005.

Pinsky, David, "A Methodology to Evaluate Tin Whisker Risk Levels," technology today, 2005 Issue 3.

Pinsky, David, Rafanelli, Tony, and Rollins, Bill, "Partnering with Industry: Transitioning to Lead-Free Electronics," technology today, 2005 Issue 3.

Schroeder, Sabine, "Superior, whisker-reduced immersion tin technology," Circuit World , vol. 31 no. 4, pp. 42-46, 2005.

Tu, King-Ning, Suh, Jong-ook, Wu, Albert Tzu-Chia, Tamura, Nobumichi, and Tung, Chih-Hang, "Mechanism and Prevention of Spontaneous Tin Whisker Growth," Materials Transactions, vol. 46 no. 11, pp. 2300-2308, 2005.

"Tin Whiskers and Conversion to Pb-Free," Circuits Assembly, vol. 16 no. 12, pp. 38-40, Dec. 2005.

Kim, Kyung-Seob, Han, Wan-Ok, and Han, Sung-Won, "Whisker Growth on Surface Treatment in the Pure Tin Plating," Journal of Electronic Materials, vol. 34 no. 12, pp. 1579-1585, Dec. 2005.

Kostic, Andrew D., "Current Understanding of the Quality and Reliability of Lead-free Tin," Microelectronics Reliability & Qualification Workshop, Manhattan Beach, CA, Dec. 2005, pp. xx-xx.

Smetana, Joe, and Gedney, Ron, "Tin Whisker Management Guidelines," Circuits Assembly, vol. 16 no. 12, pp. 42, Dec. 2005.

Smetana, Joe, and Gedney, Ron, "Tin Whisker Management Guidelines," Printed Circuit Design and Manufacture, vol. 22 no. 12, pp. 14, 16-17, Dec. 2005.

Wolfgong, W. John, Ogden, Bob, Champaign, Robert, and Waller, Barbara, "Surface Oxidation as a Tin Whisker Growth Mechanism," Circuits Assembly, vol. 16 no. 12, pp. 24-27, Dec. 2005.

Minter, Charlie, "Robotic Solder Dip - A Key Technique for Mitigating Reliability Risk Posed by Tin Whiskers," DoD Diminishing Manufacturing Sources & Material Shortages (DMSMS) Workshop, San Antonio, TX, Dec. 13-15, 2005, pp. xx-xx.

Olsson, Jesper, ""The Formation of Whiskers on Electroplated Tin Containing Copper"," evertiq, Dec. 7, 2005.

Sengupta, Shirsho, Das, Diganta, Ganesan, Sanka, Pecht, Michael, Lin, T. Y., and Rollins, William, "Effects of Re-finishing of Terminations by Solder-Dipping on Plastic Quad Flatpack Electronic Parts," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2, Singapore, Dec. 7-9, 2005, pp. 768-773.

Smetana, Joe, and Gedney, Ron, "Tin Whisker Management Guidelines," Dec. 1, 2005.

"Comments on Test Methods & Criteria for Tin Whiskers in Surface Mount Passive Devices," EIA/ECA-CB22, Nov. 2005.

Boettinger, W. J., Johnson, C. E., Bendersky, L. A., Moon, K.-W., Williams, M. E., and Stafford, G. R., "Whisker and Hillock formation on Sn, Sn-Cu and Sn-Pb electrodeposits," Acta Materialia, vol. 53 no. 19, pp. 5033-5050, Nov. 2005.

Brusse, Jay, "Tin Whiskers Growing Inside -45 Year Old AF114 Germanium Transistors," Nov. 2005.

Reinbold, L., Chason, E., Jadhav, N., Kelly, V., Holmes, P., Shin, J. W., Chan, W. L., Kumar, K. S., and Barr, G., "Degradation in Sn Films due to Whisker Formation," Degradation Processes in Nanostructured Materials (Materials Research Society Symposium Proceedings, vol. 887), Boston, MA, Nov. 28-Dec. 1, 2005, pp. 197-207.

Moon, K.-W., Williams, M. E., Johnson, C. E., Stafford, G. R., Handwerker, C. A., and Boettinger, W. J., "The Formation of Whiskers on Electroplated Tin Containing Copper," PCB007, Nov. 21, 2005.

"Boeing 601 (f.k.a. Hughes HS 601)." (before Nov. 20, 2005)

"European directives vs. Tin Whiskers & Tin Pest," finishing.com . (before Nov. 20, 2005)

"Lead Free Product Testing," Trace Laboratories-East. (before Nov. 20, 2005)

"Lead Free Product Testing/Tin Whisker Testing," Trace Laboratories-East. (before Nov. 20, 2005)

"Lead-free: Whiskers on Tin," Tyco Electronics. (before Nov. 20, 2005)

"Qualification Procedure for Tin Whisker Formation in Lead-free Connector Terminal Finishes," Molex. (before Nov. 20, 2005)

"Tin Whisker Experience - Rocket Motor Initiator Failure Analysis." (before Nov. 20, 2005)

"UCLA Department of Materials Science and Engineering." (before Nov. 20, 2005)

"Whisker control plating process YWL SYSTEM," Yuken. (before Nov. 20, 2005)

Ando, Toshihiro, Shibata, Masamitsu, Okada, Seiichi, and Namasuya, Yoshikazu, "Stress Analysis and Accelerated Evaluation of Tin Whisker under Thermal Shock Stress," Murata. (before Nov. 20, 2005)

Boguslavsky, Irina, Bush, Peter, Kam-Lum, Elsa, Kwoka, Mark, McCullen, Jack, and Vo, Nick, "NEMI Sn Tin Whisker Project." (before Nov. 20, 2005)

Custer, Kevin, "Help... My MASTR II has lost receiver sensitivity." (before Nov. 20, 2005)

D'Agostino, Saverio, and Evans, Ken, "Tin Whiskers: 1 What Are They?," Electronic Parts Engineering. (before Nov. 20, 2005)

D'Agostino, Saverio, and Evans, Ken, "Tin Whiskers: 2 MER Whiskers: The Problem & Solution," Electronic Parts Engineering. (before Nov. 20, 2005)

D'Agostino, Saverio, and Evans, Ken, "Tin Whiskers: 3 Other Data" Electronic Parts Engineering. (before Nov. 20, 2005)

Dittes, M., Oberndorff, P., and Crema, P., "Whisker Root Cause and Respective Test Conditions." (before Nov. 20, 2005)

Dittes, Marc, Oberndorff, Pascal, Crema, Paolo, and Schroeder, Valeska, "The Effect of Temperature Cycling on Tin Whisker Formation." (before Nov. 20, 2005)

Galyon, George T., Plamer, Larry, "Tin Whisker Microstructural Analysis," IBM eSG. (before Nov. 20, 2005)

Kuhlkamp, Peter, "Lead(Pb)-Free Plating for Electronics and Avoidance of Whisker Formation," Atotech. (before Nov. 20, 2005)

Oberndorff, P., Dittes, M., and Crema, P., "Whisker Testing: Reality of Fiction?." (before Nov. 20, 2005)

Pinsky. David, and Lambert, Elizabeth, "Tin Whisker Risk Mitigation for High-Reliability Systems Integrators and Designers," Reliability Analysis Laboratory. (before Nov. 20, 2005)

Radman, John M., "Test Procedures for Determining the Amount of Tin Whisker Formation," Trace Laboratories-East. (before Nov. 20, 2005)

Sakamoto, Ichizo, "Whisker Test Methods of JEITA." (before Nov. 20, 2005)

Winterstein, Jonathan, "Tin Whiskers Studied by Scanning Electronic Microscopy." (before Nov. 20, 2005)

Xu, Chen, "Stress in Electroplated Sn: Its Measurement and Implication in Spontaneous Whisker Growth," Cookson Electronics. (before Nov. 20, 2005)

Tu, K. N., and Li, J. C. M., "Spontaneous whisker growth on lead-free solder finishes," Materials Science and Engineering: A, vol. 409 no. 1-2, pp. 131-139, Nov. 15, 2005. https://doi.org/10.1016/j.msea.2005.06.074

Mason, John, "European Space Agency frets over pure tin," Electronics Weekly , Nov. 11, 2005.

Mason, John, "European Space Agency Frets Over Pure Tin," Electronic News, Nov. 10, 2005.

"JESD22A121.01, Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes," JEDEC Solid State Technology Association, Oct. 2005.

Galyon, George, Palmer, Larry, and Gedney, Ron, "Theory closes in on causes of tin whiskers," Global SMT & Packaging, vol. 5 no. 9, pp. 10, 12-14, Oct. 2005.

Keller, John, "Lead-free solder: A train wreck in the making," Military & Aerospace Electronics, vol. 16 no. 10, pp. 1,10, Oct. 2005.

Martel, Mike, "Focused on Tin Whiskers: Potential for Catastrophe?," Circuitnet , Oct. 17, 2005.

Mei, Zequn, Teng, Sue, and Ahmad, Mudasir, "Shock, Vibration, and Wind Tunnel Tests of Electronic Components with Sn Whiskers," IPC/JEDEC 10th International Conference on Lead-free Electronic Components and Assemblies, Brussels, Belgium, Oct. 17-19, 2005, pp. xx-xx.

Mensah, A., and Hunt, C., "The Role of Permeability and Ion Transport in Conformal Coating Protection," NPL Report DEPC-MPR 032, Sept. 2005.

Moon, K.-W., Johnson, C. E., Williams, M. E., Kongstein, O., Stafford, G. R. Handwerker, C. A., and Boettinger, W. J., "Observed Correlation of Sn Oxide Film to Sn Whisker Growth in Sn-Cu Electrodeposit for Pb-Free Solders," Journal of Electronic Materials , vol. 34 no. 9, pp. L31-L33, Sept. 2005.

Quinnell, Richard A., "Tackling tin whisker test," Test & Measurement World, vol. 25 no. 8, pp. 79-80, Sept. 2005.

Hoffman, E. N., Barsoum, M. W., Wang, W., Doherty, R. D., and Zavaliangos, A., "On the Spontaneous Growth of Soft Metallic Whiskers," Proceedings of the Fifty-First IEEE Holm Conference on Electrical Contacts, Chicago, IL, Sept. 26-28, 2005, pp. 121-126.

"Tin Whiskers: Companies Taking Cover Under iNEMI Guidelines," Design News, vol. 60 no. 12, pp. xx, Sept 5, 2005.

Ciufo, Chris A., "RoHS and tin whiskers: The industry’s next 10-year problem," VMEbus Systems, vol. no. , pp. , Aug. 2005.

Kushner, Arthur S., "Plating Clinic: Tin Whiskers," Products Finishing, vol. 69 no. 11, pp. 24,26-28, Aug. 2005.

Smetana, Joe, "Minimizing Tin Whiskers," Surface Mount Technology (SMT), vol. 19 no. 8, pp. xx-xx, Aug. 2005.

"Inadvertent Reactor Trip and Partial Safety Injection Due to Tin Whisker," United States Nuclear Regulatory Commission, NRC Information Notice 2005-25, Aug. 25, 2005.

"TO-220 Lead Free and RoHS Compliance Document," International Rectifier. Aug. 23, 2005.

Pease, Bob, "Bob's Mailbox," Electronic Design, vol. 53 no. 18, pp. 22, Aug. 18, 2005.

"Tin Whiskering Borders on Urban Legend," Design News, vol. 60 no. 11, pp. xx, Aug. 15, 2005.

Morris Jr., J. W., "Lead-Free Solder Issues in MIcroelectronics," 15th Workshop on Crystalline Silicon Solar Cells and Modules: Materials and Processes, Vail, CO, Aug. 7-10, 2005, pp. 129-131.

Spiegel, Rob, "Serious Doubts Among Engineers on Tin Whisker Testing," Design News , Aug. 5, 2005.

"JEDEC, iNEMI Update Tin Whisker and Lead-Free Surface Finish Guidelines," CircuiTree, vol. 18 no. 7, pp. xx-xx, July 2005.

Deshmukh, Rajan, "Tin Whiskers and the Impending RoHS Conversion to Lead-Free," empfasis, pp. 1-2, July 2005.

Fjelstad, Joe, "Tin Whiskers = a lead-free 'time bomb'?," Global SMT & Packaging, vol. 5 no. 6, pp. 4, June/July 2005.

Fukuda, Yuki, and Osterman, Michael, "Tin Whiskers: What's the Risk?," Lead-free Electronics, July 2005.

Sakuyama, Seiki, and Kutami, Michinori, "Substitute Materials for Complete Elimination of Hazardous Substances - Study of Whisker Growth on Lead-Free Plating," Fujitsu Scientific and Technical Journal, vol. 41 no. 2, pp. 217-224, July 2005.

Rizzo, Sam, "Evaluating tin whiskers," Green SupplyLine, July 18, 2005.

Liang, Jin, Li, Xiaodong, Xu, Zhi-Hui, and Shangguan, Dongkai, "Indentation Induced Tin Whisker Formation on Tin Plated Component Leads," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B, San Francisco, CA, July 17-22, 2005, pp. 1199-1205.

"Leadfree Solder and Tin Whiskers Program Guidance (draft)," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.

Osterman, Michael, "CALCE Research on Risk Assessment, Mitigation, and Management for Pb-free Electronics," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.

Sampson, Michael J., "Lead-free from One NASA Perspective," Lead-free Summit, Philadelphia, PA, July 13, 2005, pp. xx-xx.

Daddona, Patricia, "Reactor Shutdown: Dominion Learns Big Lesson From A Tiny `tin Whisker'," The Day, July 4, 2005.

Yu, H. C., Liu, S. H., and Chen, Chih, "Study of electromigration in thin tin film using edge displacement method," Journal of Applied Physics, vol. 98 no. 1, pp. 013540-1-013540-4, July 1, 2005.

"Second ECTC iNEMI Tin Whisker Workshop," Components, Packaging, and Manufacturing Technology Society Newsletter, vol. 28 no. 2, pp. 8-9, June 2005.

Lee, Miky, Hillman, Craig, and Kim, Duksoo, "Industry News: How to predict failure mechanisms in LED and laser diodes," Military & Aerospace Electronics, vol. 16 no. 6, pp. xx-xx, June 2005.

Song, Jenn-Ming, Lui, Truan-Sheng, Chang, Yea-Luen, and Chen, Li-Hui, "Tin whiskers of bulk solders generated under resonance," Journal of Materials Research, vol. 20 no. 6, pp. 1385-1388, June 2005.

"Testing for Tin Whisker Mitigation," Design News, June 27, 2005.

Ice, G. E., Larson, B. C., Tischler, J. Z., Liu, W., and Yang, W., "X-ray microbeam measurements of subgrain stress distributions in polycrystalline materials," Materials Science and Engineering: A, Structural Materials, vol. 399 no. 1-2, pp. 43-48, June 15, 2005. https://doi.org/10.1016/j.msea.2005.02.035

Bush, Steve, "High temps, stresses cause whiskers," Electronics Weekly, June 13, 2005.

"Potential Tin Whiskers on Printed Circuit Board Components," Westinghouse Nuclear Tech Bulletin TB-05-4, June 8, 2005.

McCullen, Jack,and Gupta, Vivek, "Sn-Whisker Test Standards Correlation to Market Segment Use Conditions," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Zhang, Yun, "Can Thin Sn over Ni be an Answer to Tin Whiskers?," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Spiegel, Rob, "iNEMI Releases Tests to ID Tin Whisker Problems," Electronic News , June 6, 2005.

Spiegel, Rob, "Tests spot tin whisker problems," Electronics Weekly, June 6, 2005.

"JESD22A121, Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes," JEDEC Solid State Technology Association, May 2005.

"Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products," iNEMI Tin Whisker User Group, Version 3, May 2005.

Cho, Sungil, Yu, Jin, Kang, Sung K., and Shih, Da-Yuan, "Oxidation Study of Pure Tin and its Alloys via Electrochemical Reduction Analysis," Journal of Electronic Materials, vol. 34 no. 5, pp. 635-642, May 2005.

Hunt, Chris, "Predicting Tin Whisker Growth," Microelectronics News, no. 21, pp. 3, Spring 2005.

Ding, Min, Su, Peng, and Chopin, S., "Effects of Trim and Form on the Microstructure and Whisker Growth Propensity of Sn Finish," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 452-456.

Galyon, G. T., Xu, C., Lal, S., Notohardjono, B., and Palmer, L., "The Integrated Theory of Whisker Formation - A Stress Analysis," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 421-428.

Oberndorff, P., Dittes, M., Crema, P., and Chopin, S., "Whisker Formation on Matte Sn Influencing of High Humidity," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 429-433.

Su, Peng, Ding, Min, and Chopin, Sheila, "Effects of Reflow on the Microstructure and Whisker Growth Propensity of Sn Finish," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 434-440.

Zhao, Jie-Hua, Su, Peng, Ding, Min, Chopin, Sheila, and Ho, Paul S., "Microstructure-Based Stress Modeling of Tin Whisker Growth," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 137-144.

Norvell, Robin, "JEDEC, iNEMI Releases Help Scratch Tin Whiskers," Circuits Assembly , vol. 16 no. 6, pp. xx-xx, May 25, 2005.

Roos, Gina, "iNEMI releases standard for tin whisker testing, updates lead-free surface finish guidelines," Green SupplyLine, May 25, 2005.

"JEDEC Releases Standard for Tin Whisker Testing and iNEMI User Group Updates Lead-Free Surface Finish Guidelines," PCB007, May 24, 2005.

Kao, Hui-Ju, Effect of Cu additives on Sn whisker formation and interfacial reaction of Sn(Cu) finishes. Master's Thesis for National Central University, Jhong-Li, Taiwan, May 23, 2005.

Lead Finish Material Candidates and Pros/Cons (before May 17, 2005)

Tin Whisker Mitigation - Adding Lead to Chip Size Components with Pure-Tin Terminals (before May 17, 2005)

Perton, Marc, "Tin whisker" crisis threatens global electronic systems (before May 17, 2005)

Cassette, Dennis J., "Lead-Free Solder," Department of the Air Force Airworthiness Advisory AA-05-01, May 9, 2005.

Sob, M., Pokluda, J., Cerny, M., Sandera, P., and Vitek, V., "Theoretical Strength of Metals and Intermetallics from First Principles," Materials Science Forum, vol. 482, pp. 33-38, Apr. 2005.

Minter, Charlie, "Tin Whiskers: A New DMSMS Issue," DMSMS COE Newsletter, vol. 3 no. 3, pp. 3-4, Apr. 2005.

Tin Whiskers (Tech Tip #2) (before Apr. 30, 2005)

NASA Literature References, (before Apr. 24, 2005)

What are Tin Whiskers? (before Apr. 24, 2005)

Kadesch. Jong S., NASA Goddard Space Flight Center Effect of Uralane Conformal Coating on Tin Whisker Growth, Apr. 20, 2005.

NASA Goddard Space Flight Center Electromagnetic Relay Manufacturer Survey , Apr. 20, 2005.

NASA Goddard Space Flight Center Experiment #2 Photo Gallery, Apr. 20, 2005.

NASA Goddard Space Flight Center Experiment 3, Apr. 20, 2005.

NASA Goddard Space Flight Center Experiment 7: Matte Tin Plated IC Leadframe Examination, Apr. 20, 2005.

NASA Goddard Space Flight Center Re-emergence of an Old Problem with Potentially Catastrophic Consequences, Apr. 20, 2005.

NASA Goddard Space Flight Center Tin Whisker Photo, Apr. 20, 2005.

NASA Goddard Space Flight Center Tin Whisker Photo, Apr. 20, 2005.

Gupta, Vivek, and McCullen, Jack, "Correlation of Proposed Sn-Whisker Test Standards to Market Segment Use Conditions," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Hilty, Robert D., and Corman, Ned, "Tin Whisker Reliability Assessment by Monte Carlo Simulation," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Liang, J., Li, X., Xu, Z., and Shangguan, D., "Nano-indentation Study on Whisker Formation on Tin Plated Component Leads," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Woodrow, Thomas A., and Ledbury, Eugene A., "Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy," IPC/JEDEC 8th International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Woodrow, Thomas A., and Ledbury, Eugene A., "Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy (Presentation)," IPC/JEDEC 8th International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Testing for Tin Whisker Growth (before Apr. 16, 2005)

NASA Goddard Space Flight Center Experiment 1, (before Apr. 15, 2005)

NASA Experiment 2, (before Apr. 15, 2005)

NASA Goddard Space Flight Center Experiment 4, (before Apr. 15, 2005)

NASA Goddard Space Flight Center Experiment 5, (before Apr. 15, 2005)

NASA Goddard Space Flight Center Experiment 6: Simulation of Whisker Growth , (before Apr. 15, 2005)

NASA Goddard Space Flight Center GSFC Experiments (before Apr. 15, 2005)

"Tin Whiskers." (before Apr. 3, 2005)

"TW System Failures," NAVSEA, Apr. 3, 2005.

NASA Goddard Space Flight Center Photo of the Month, (before Apr. 2, 2005)

"Tin Whisker Workshop." (Apr. 2, 2005)

"Nickel-coated Components Solve Electrical Problem," Nickel, vol. 20 no. 2, pp. 5, Mar. 2005.

"Tin whiskers - reducing the risk," LiveWire, no. 15, pp. xx-xx, Feb./Mar. 2005.

Ice, G. E., Larson, B. C., Yang, W., Budai, J. D., Tischler, J. Z., Pang, J. W. L., Barabash, R. I., and Liu, W., "Polychromatic X-ray microdiffraction studies of mesoscale structure and dynamics," Journal of Synchrotron Radiation, vol. 12 no. 2, pp. 155-162, Mar. 2005.

Jobb, Dean, "Nickel-coating Solves Electrical Problem: Nickel offers a solution to trimming 'tin whiskers'," Nickel, vol. 20 no. 2, pp. xx-xx, Mar. 2005.

Spiegel, Rob, "Crying Wolf or Seeing Real Whiskers?," Avnet Advantage, Mar. 2005.

NASA Anecdote #1: 20 Years to Failure, (before Mar. 26, 2005)

NASA Anecdote #2: Tin Whiskers on Waveguide, (before Mar. 26, 2005)

NASA Anecdote #3: Field Failures Due to Tin Whiskers Breaking Loose from Matte Tin-Plated RF Enclosure Lids, (before Mar. 26, 2005)

NASA Anecdote #4- Tin Whiskers on Shield of GPS Units, (before Mar. 26, 2005)

NASA Anecdote #5: Field Failures Due to Tin Whiskers on Circuit Breaker Contacts, (before Mar. 26, 2005)

NASA Goddard Space Flight Center Basic Info/FAQ (before Mar. 26, 2005)

NASA Photo Gallery, (before Mar. 26, 2005)

NASA Photo of the Month Archives December 2003 Sn-Pb Whiskers, (before Mar. 26, 2005)

NASA Goddard Space Flight Center Specification Language Related to Pure Tin (before Mar. 26, 2005)

NASA Goddard Space Flight Center Summary of Specification Language for Pure Tin (before Mar. 26, 2005)

NASA Tin Whisker (and Other Metal Whisker) Homepage, (before Mar. 26, 2005)

NASA Whisker Failures, (before Mar. 26, 2005)

Bolin, Dick, and Bosze, Wayne, "RoHS and Tin Whisker Issues for Resistive Components," Proceedings of the 25th Symposium for Passive Components, Palm Springs, CA, Mar. 21-24, 2005, pp. 102-107.

"Tin wisker might delay RoHS schedule," Industry News, vol. xx no. xx, pp. xx-xx, Mar. 18, 2005.

Spiegel, Rob, "Threat of Tin Whiskers Haunts Rush to Lead-Free," Electronic News , Mar. 17, 2005.

Spiegel, Rob, "Tin whiskers haunt rush to Pb-free," Electronics Weekly, Mar. 17, 2005.

Klerk, Jacob, "Sn Plating and Whiskers," Mar. 9, 2005.

Bush, Steve, "Tin industry backs Pb-free reliability," Electronics Weekly, Mar. 2, 2005.

Rickett, B., Elmgren, P., Flowers, G., Gale, S., and Suhling, J., "Whisker Formation Potential in Pb-Free Electroplated Connector Finishes," Circuits Assembly, vol. 16 no. 2, pp. 52-59, Feb. 2005.

Schewe, Phillip F., "Physics Update," Physics Today, vol. 58 no. 2, pp. 9, Feb. 2005.

Welzel, U., Ligot, J., Lamparter, P., Vermeulen, A. C., and Mittemeijer, E. J., "Stress analysis of polycrystalline thin films and surface regions by X-ray diffraction," Journal of Applied Crystallography, vol. 38 no. 1, pp. 1-29, Feb. 2005.

Buetow, Mike, "HP, Sony Seek RoHS Exemptions," Feb. 28, 2005.

"HP says RoHS making whiskers problem worse," evertiq, Feb. 22, 2005.

Belmonte, Joe, and Apell, Marc, "Practical Pb Free Assembly," IPC APEX/EXPO 2005, Anaheim, CA, Feb. 22-24, 2005, (445 pages long).

Bush, Steve, "Tin whiskers brush with RoHS," Electronics Weekly, Feb. 18, 2005.

Chen, Keming, and Wilcox, Geoffrey D., "Observations of the Spontaneous Growth of Tin Whiskers on Tin-Manganese Alloy Electrodeposits," Physical Review Letters, vol. 94 no. 6, pp. 066104-1 to 066104-4, Feb. 18, 2005.

Williams, Alun, "Tin whiskers brush with RoHS," Electronics Weekly, Feb. 18, 2005.

Bush, Steve, "Tin whiskers have a brush with RoHS Directive over exemption," Electronics Weekly, Feb. 16, 2005.

Roos, Gina, "Trace Labs offers tin whisker testing," Green SupplyLine, Feb. 10, 2005.

"Will electronic equipment fail from tin-whisker shorts?," SourceESB, Feb. 9, 2005.

Tin Whiskers (before Feb. 2, 2005)

Schewe, Philip F., "Soft-metal whiskers," Physics Today, vol. 58 no. 2, pp. 9, Feb. 1, 2005. https://doi-org.ezproxy.uky.edu/10.1063/1.4796866

Arendt, N., Baron, F., Benz, V., Letterer, M., Merkle, H., Schroeder, S., and Wessling, B., "A New Whisker-Reducing Immersion Tin Technology," CircuiTree , vol. 18 no. 1, pp. 10, 12, 14, Jan. 2005.

Galyon, George T., and Palmer, L., "An Integrated Theory of Whisker Formation: The Physical Metallurgy of Whisker Formation and the Role of Internal Stress," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 17-40, Jan. 2005.

Galyon, George T., "Annotated Tin Whisker Bibliography and Anthology," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 94-122, Jan. 2005.

Hilty, Robert D., Corman, Ned, and Herrmann, Hank, "Electrostatic Fields and Current-Flow Impact on Whisker Growth," IEEE Transactions on Electronics Packaging Manufacturing, vol. 28 no. 1, pp. 75-84, Jan. 2005.

Lal, Sudarshan, and Moyer, Thomas D., "Role of Intrinsic Stresses in the Phenomena of Tin Whiskers in Electrical Connectors," IEEE Transactions on Electronics Packaging Manufacturing," ,vol. 28 no. 1, pp. 63-74, Jan. 2005.

Osenbach, John W., Shook, Richard L., Vaccaro, Brian T., Potteiger, Brian D., Amin, Ahmed N., Hooghan, K. N., Suratkar, P., and Ruengsinsub, P., "Sn Whiskers: Material, Design, Processing, and Post-Plate Reflow Effects and Development of an Overall Phenomenological Theory," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 36-62, Jan. 2005.

Sakamoto, Ichizo, "Whisker Test Methods of JEITA Whisker Growth Mechanism for Test Methods," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 10-16, Jan. 2005.

Vo, Nick, Kwoka, Mark, and Bush, Peter, "Tin Whisker Test Standardization," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 3-9, Jan. 2005.

Whiteman, Lee, "Lead Free Analytical Services," emphasis, pp. 4, 6, Jan. 2005.

Wickman, Martin, Fry, Tony, Gohil, Dipak, and Hunt, Chris, "Developing a Test Method to Characterise Internal Stress in Tin Coatings: Phase 2," NPL Report DEPC-MPR 014, Jan. 2005.

Xu, Chen, Zhang, Yun, Fan, Chonglun, and Abys, Joseph A., "Driving Force for the Formation of Sn Whiskers: Compressive Stress-- Pathways for Its Generation and Remedies for Its Elimination and Minimization," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 31-35, Jan. 2005.

Zhang, Wan, Egli, Andre, Schwager, Felix, and Brown, Neil, "Investigation of Sn-Cu Intermetallic Compounds by AFM: New Aspects of the Role of Intermetallic Compounds in Whisker Formation," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 85-93, Jan. 2005.

"Trace Laboratories-Central Announces Their New Tin Whisker Testing Program (iNEMI-Specified)," Trace Laboratories. Jan. 26, 2005.

Forno, Richard, "Tin Whiskers: The Next Y2K Problem?," Inforwarrior, Jan. 20, 2005.

Perton, Marc, "Tin whisker" crisis threatens global electronic systems Jan. 20, 2005.

"When Electronics Get Five O'Clock Shadow," Jan. 5, 2005.

2004: 0 books, 0 theses, 90 papers, and 1 web page on tin whiskers

"Metallic Whisker Sources," Worldwide Environmental Services, 2004.

"NEMI issues revised tin whisker test requirements," TIN World , no. 7, pp. 17, 2004.

"Suppression of Tin Whisker Growth through Optimized Tin Plating Chemistry Formulation Technistan EP," Technic. (2004)

Arai, Susumu, "Recent Status of Plating Technology for Lead-Free Soldering," Journal of The Surface Finishing Society of Japan, vol. 55 no. 9, pp. 576-581, 2004.

Moyer, Thomas D., "Designed Experiment to Determine the Reliability of Various Commercial Plating Baths and the Key Factors Affecting Whisker Formation," FCI, 2004.

Schroeder, Valeska, "HP experience with tin whisker inspection training," Hewlett-Packard, 2004.

Whitlaw, Keith, Egli, Andre, and Toben, Mike, "Preventing whiskers in electrodeposited tin for semiconductor lead frame applications," Circuit World, vol. 30 no. 2, pp. 20-24, 2004.

Tin Whiskers 2004.

Schetty, R., "Suppression of Tin Whisker Growth through Optimized Tin Plating Chemistry Formulation Technistan EP," Technic Inc, 2004.

Garrou, Phil, and Gedney, Ron, "Tin Whiskers: An Industry Perspective," Advanced Packaging, vol. 13 no. 12, pp. 14, Dec. 2004.

Amato, Ivan, "Tin Whiskers: The Next Y2K Problem?," Fortune, vol. xx no. xx, pp. xx-xx, Dec. 29, 2004.

Sriyarunya, Anocha, Tondtan, Jiraporn, and Bansal, Dhiraj, "Matte Tin (Sn) Plating: Whisker Growth Study," 2004 Electronics Packaging Technology Conference, Dec. 8-10, 2004, pp. 281-288.

Goldsmith, Steven, "Agere Confirms Mitigation of Tin Whiskers by Nickel," EMU, vol. 18 no. 11, pp. 6-8, Dec. 2004.

"Control of Whisker Growth in Tin Alloy Coatings," ST Microelectronics Application Note AN2035, Nov. 2004.

Cooke, Mike, "Shaving the whiskers for lead-free production," European Semiconductor, vol. xx no. xx, pp. xx-xx, Nov. 2004.

Galyon, George, Smetana, Joe, and Vo, Nick, "Cause of Tin Whiskers Remains Elusive," Lead-free Electronics , vol. xx no. xx, pp. xx-xx, Nov. 2004.

Galyon, George, Smetana, Joe, and Vo, Nick, "Cause of Tin Whiskers Remains Elusive," Advanced Packaging, vol. 13 no. Nov2004 Supplement, pp. 16-18, Nov. 2004.

Chason, Eric, Reinbold, Lucine, and Kumar, Sharvan, "Whisker Formation in Sn Coatings on Cu," Materials Research Society Symposium Proceedings Volume 851, Materials for Space Applications, Boston, MA, Nov. 29-Dec. 3, 2004, pp. 239-244.

"Whisker Woes," Air Safety Week, vol. 18 no. 45, pp. xx-xx, Nov. 22, 2004.

Verdi, Fred W., "Electroplated Tin and Tin Whiskers in Lead Free Electronics," Nov. 5, 2004.

"Shaving the whiskers for lead-free production," European Semiconductor, vol. 26 no. 11, pp. 17, Nov. 1, 2004.

Baliga, John, "Can Nickel Barriers Eliminate Tin Whiskers?," Semiconductor International, vol. 27 no. 12, pp. 38, Nov. 1, 2004.

Arendt, N., Baron, F., Benz, V., Letterer, M., Merkle, H., Schroeder, S., Wessling, B., "A Superior Whisker-Reducing Immersion Tin Technology," OnBoard Technology, vol. xx no. xx, pp. 30-32, Oct. 2004.

Hutchinson, Bevis, Oliver, James, Nylen, Margareta, and Hagstrom, Joacim, "Whisker Growth from Tin Coatings," Materials Science Forum, vol. 467-470, pp. 465-470, Oct. 2004.

"Whisker Formation on Tin Plated Cu based Leadframes: Results and Conclusions," Oct. 29, 2004.

"Whisker Formation on Tin Plated FeNi42: Results and Conclusions," Oct. 29, 2004.

Dittes, Marc, Oberndorff, Pascal, Crema, Paolo, and Chopin, Sheila, "A Two Step Approach for the Release of Lead Free Component Finishes with Respect to Whisker Risk," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Hugel, W., Kirchner, V., Keller, R., Schimitzek, R., Krinke, J., Guber, M., Welzel, U., and Mittemeijer, E. J., "Results from Detailed Investigations of the Propensity of Whisker Growth Under Different Conditions," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Jeong, Seyoung, Lee, Sung-Ki, Kim, Namseog, Yoshikuni, Nakadaira, Choi, Heekook, and Oh, Seyong, "Mitigation of Whisker by Reflow in Matte Sn Finished Alloy42 Lead Frame Package," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Letterer, Michael, "Whisker-Reducing Immersion Tin Technology," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Schetty, Rob, "Minimization of Tin Whisker Growth in Pb-Free Component Production Applications," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Xu, Chen, Zhang, Yun, Fan, Conglun, Walsh, E., and Abys, Joseph A., "An Innovative Whisker Reduction/Elimination Solution," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies , Frankfurt, Germany, Oct. 20-22, 2004.

"Elimination of Lead from Electrical and Electronic Equipment - the Dilemma of Tin-Whisker Growth," Eurocomp, no. 7, pp. 3-6, Autumn 2004.

Koyano, Hidekatsu, "Current Situation of Lead-Free Solder Plating and Prevention of Tin Whisker," Hyomen Gijutsu (Journal of the Surface Finishing Society of Japan) , vol. 55 no. 9, pp. 586-589, Sept. 2004.

Kuhlkamp, Peter "Bleifreie galvanische Beschichtung von elektronischen Bauteilen unter Vermeidung der Whiskerbildung," Galvanotechnik, vol. 95 no. 9, pp. 2119-2132, Sept. 2004.

Reed, Greg, "Test procedures needed for tin whisker failures," Test & Measurement World, vol. 24 no. 8, pp. A2, Sept. 2004.

Vardaman, E. Jan, "Tin Whiskers: An Old Problem Reappears," Circuits Assembly, vol. 15 no. 9, pp. 22-23, Sept. 2004.

Fukuda, Yuki, Fang, Tong, Pecht, Michael, and Osterman, Michael, "Effect of Heat Treatment on Tin Whisker Growth," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 717-723.

Galyon, George T., "A History of Tin Whisker Theory: 1946 to 2004." 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 696-706.

Osenbach, J. W., Shook, R. L., Vaccaro, B. T., Amin, A., Potteiger, B. D., and Hooghan, K. N., "Tin Whisker Mitigation: Application of Post Mold Nickel Underplate on Copper Based Lead Frames and Effects of Board Assembly Reflow," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 724-734.

Rickett, B., Elmgren, P., Flowers, G., Gale, S., and Suhling, J., "Potential for Whisker Formation in Lead-Free Electroplated Connector Finishes," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 707-716.

Tanaka, Toru, and Yamasaki, Mikio, "Modeling of Fuses for Melting Time and Fusing Current Analysis," 26th Annual International Telecommunications Energy Conference, Chicago, IL, Sept. 19-23, 2004, pp. 671-675.

"Tin Whiskers," Sept. 14, 2004.

Choi, Wanuk, Lee, Jeong Yong, Jung, Bok Hwan, and Lim, Hong Sup, "Microstructure and electrochemical properties of a nanometer-scale tin anode for lithium secondary batteries," Journal of Power Sources, vol. 136 no. 1, pp. 154-159, Sept. 10, 2004.

"NEMI issues revised tin whisker acceptance test requirements," emsnow, Sept. 6, 2004.

Roos, Gina, "NEMI revises tin whisker test requirements," Green SupplyLine , Sept. 2, 2004.

Roos, Gina, "NEMI revises tin whisker test requirements," eeProductCenter , Sept. 2, 2004.

Roos, Gina, "NEMI revises tin whisker test requirements," eeProductCenter , Sept. 2, 2004.

"The Facts about Tin Whiskers," Electronic Components, Assemblies & Materials Association, EIA/ECA-CB19, Aug. 2004.

"Tin Whisker Specs Defined," Metals and Interconnects, vol. 18 no. 7, pp. xx, Aug. 2004.

Galyon, G. T., and Gedney, Ron, "Avoiding Tin Whisker Reliability Problems," Circuits Assembly, vol. 15 no. 8, pp. 26-31, Aug. 2004.

Kushner, Arthur S., "Plating Clinic: Tin Whiskers Again," Products Finishing, vol. 68 no. 11, pp. 22-26, Aug. 2004.

Buetow, Mike, "NEMI Revises Tin Whisker Guidance," Circuits Assembly, vol. 15 no. 9, pp. xx-xx, Aug. 31, 2004.

Sampson, Michael J., and Leidecker, Henning, "NASA Goddard Space Flight Center Comments Regarding JEDEC Ballot JC-14-04-226," NASA, Aug. 31, 2004.

"NEMI Issues Revised Tin Whisker Acceptance Test Requirements," NEMI, Aug. 30, 2004.

"NEMI issues revised tin whisker acceptance test requirements," PCB007, Aug. 30, 2004.

Sriyarunya, Anocha, and Bansal, Dhiraj, "Matte Tin (Sn) Plating Of Semiconductor Devices - Whisker Growth Study," Proceedings of IPC/JEDEC 6th International Conference on Lead-Free Electronic Assemblies and Components, Singapore, Aug. 18-20, 2004, pp. xx-xx.

"New TWI proposed project: Tin Whiskers - reducing the risk," TWI LiveWire, issue 14, Summer 2004.

Song, J. Y., Yu, Jin, and Lee, T. Y., "Effects of reactive diffusion on stress evolution in Cu-Sn films," Scripta Materialia, vol. 51 no. 2, pp. 167-170, July 2004.

"The problem of 'tin whiskers' cannot be neglected," Dataweek , vol. xx no. xx, pp. xx-xx, July 28, 2004.

"Tin Whisker Acceptance Test Requirements," NEMI Tin Whisker Users Group, July 28, 2004.

Smetana, Joe, "NEMI Tin Whisker User Group," July 28, 2004.

"NEMI Group Releases Draft Proposal of Tin Whisker Acceptance Test Requirements," CircuiTree, vol. 17 no. 6, pp. xx-xx. June 2004.

"Whisker Formation Test Report," Phoenix Passive Components. June 2004.

Ellis, Timothy W., "The Future of Gold in Electronics," Gold Bulletin, vol. 37 no. 1-2, pp. 68-71, June 2004.

Grupen-Shemansky, Melissa, "Overcoming Tin Whisker Problems on Lead-free Packaging," Advanced Packaging, vol. 13 no. 6, pp. 24, June 2004.

Pinsky, David, Osterman, Michael, and Ganesan, Sanka, "Tin Whiskering Risk Factors," IEEE Transactions on Components and Packaging Technologies, vol. 27 no. 2, pp. 427-431, June 2004.

Zhang, Y., Fan, C., Xu, C., Khaselev, O., and Abys, J. A., "Tin Whisker Growth - Substrate Effect: Understanding CTE Mismatch and IMC Formation," CircuiTree, vol. 17 no. 6, pp. xx, June 2004.

Lal, Sudarshan, and Moyer, Thomas D., "Making the Lead-free Transition: The Enigma of Tin Whiskers in Connector Applications," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 234-253.

Barsoum, M. W., Hoffman, E. N., Doherty, R. D., Gupta, S., and Zavaliangos, A., "Driving Force and Mechanism for Spontaneous Metal Whisker Formation," Physical Review Letters, vol. 93 no. 20, pp. 206104-1-206104-4, June 25, 2004.

Gedney, Ron, Smetana, Joe, Vo, Nhat, and Galyon, George, "NEMI Tin Whisker Projects." Second International Conference on Lead Free Electronics, Amsterdam, Netherlands, June 21-23, 2004, pp. xx-xx.

"iNEMI Tin Whisker Accelerated Test Project Test Method for Evaluating Tin Whisker Growth on Plated Surfaces." International Electronics Manufacturing Initiative, June 17, 2004.

Liu, S. H., Chen, Chih, Liu, P. C., and Chou, T., "Tin whisker growth driven by electrical currents," Journal of Applied Physics, vol. 95 no. 12, pp. 7742-7747, June 15, 2004. https://doi.org/10.1063/1.1712019

Osenbach, J. W., Shook, R. L., Vaccaro, B. T., Potteiger, B. D., Amin, A., and Ruengsinsub, P., "Lead Free Packaging and Sn-Whiskers," 2004 Proceedings 54th Electronic Components & Technology Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1314-1324.

Zaccari, Joseph, "Lead-Free Component Finishes - Problems and Mitigation," 2004 Medical Electronics Symposium Conference Proceedings, Bloomington, MN, May 19-20, 2004, pp. xx-xx.

"Lead Free Tin Whiskering Study: Grayhill DIP Switches," Grayhill, May 11, 2004.

Schetty, Rob, "Electrodeposited Tin Properties & Their Effect on Component Finish Reliability," 2004 International Conference on Business of Electronic Product Reliability and Liability, Apr. 27-30, 2004, pp. 29-34.

Bjorndahl, William D., Singleton, Leon, Griese, Richard, and Chong, Frank, "Detection of Tin Plating and Tin Whisker Mitigation," 42nd Annual Reliability Physics Symposium, Apr. 25-29, 2004, pp. 563-564.

"Interim Recommendations on Lead-Free Finishes for Components Used in High- Reliability Products,", NEMI, Mar. 2004.

Gurav, Abhijit, and Stacy, Bruce, "Whiskering Evaluation of Capacitors Mounted with Lead Free Solders," IPC/JEDEC 5th International Conference on Lead Free Electronic Components and Assemblies, Mar. 2004.

Winterstein, J. P., LeBret, J. B., and Norton, M. G., "Characteristics of tin whiskers formed on sputter-deposited films-an aging study," Journal of Materials Research, vol. 19 no. 3, pp. 689-692, Mar. 2004.

"Tin Whisker Growth Evaluation Results," Kemet, Mar. 30, 2004.

Osenbach, J. W., Shook, R. L., Vaccaro, B. T., Amin, A., Potteiger, B. D., and Hooghan, K. N., "The Effects of Board Attachment Processing on Sn Whisker Formation on Electroplated Matte-Sn on Cu Alloy Lead Frames," Proceedings of IPC/JEDEC Lead Free Conference, San Jose, CA, Mar. 18, 2004, pp. xx-xx.

"Shaving the Risk of Tin Whiskers," NITON Application Bulletin , Mar. 17, 2004.

"Tin "Noodles"???." Mar. 17, 2004.

Xu, Chen, Fan, Chonglun, Zhang, Yun, and Abys, Joseph A., "Whisker Prevention," OnBoard Technology, vol. xx no. xx, pp. 30-34, Feb. 2004.

Kostic, Andrew D., "Tin Whiskers - A "New" Problem," Feb. 25, 2004.

Bush, P., Jones, G. L., and Boguslavsky, I., "Relationships of Copper Diffusion and Surface Oxide Formation to Tin Whisker Growth," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. PS-07-1-PS-07-05.

Zhang, Y., Fan, C., Xu, C., Khaselev, O., and Abys, J. A., "Tin Whisker Growth - Substrate Effect Understanding CTE Mismatch and IMC Formation," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S27-2-1-S27-2-20.

Hunt, Christopher, "Pitfalls on the Path to Lead-Free," SMART Group 6th Annual Lead-Free Seminar and Table-top Exhibition, High Wycombe, United Kingdom, Feb. 3, 2004.

Zaccari, Joe, "Lead-Free Component Finishes: Problems and Mitigation," 2004 IEEE Microelectronics Reliability and Qualification Workshop, Manhattan Beach, CA, Feb. 3-4, 2004, pp. xx-xx.

2003: 0 books, 0 theses, 61 papers, and 0 web pages on tin whiskers

Oberndorff, P. J. T. L., Dittes, M., and Petit, L., "Intermetallic Formation in Relation to Tin Whiskers." 2003.

"Lead-Free solder failure mechanisms: What are Tin Whiskers?," LiveWire, no. 11, pp. xx-xx, .Nov./Dec. 2003.

"NEMI Team Recommends Three Test Conditions for Evaluating Tin Whisker Growth," CircuiTree, vol. 16 no. 12, pp. xx-xx, Dec. 2003.

Lau, John H., and Pan, Stephen H., "3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components," Journal of Electronic Packaging, vol. 125 no. 4, pp. 621-624, Dec. 2003. https://doi.org/10.1115/1.1604805

Leidecker, Henning, Greenwell, Chris, and Brusse, Jay, "Whiskers of Tin-Lead (Sn-Pb) on REFLOWED Die Attach Solder Used in the Manufacture of a Laser Diode Array," NASA, Dec. 2003.

Dittes, Marc, Oberndorff, Pascal, Crema, Paolo, and Schroeder, Valeska, "Tin Whisker Formation in Thermal Cycling Conditions," 2003 Electronics Packaging Technology Conference, Dec. 10-12, 2003, pp. 183-188.

Egli, Andre, Zhang, Wan, and Schwager, Felix, "New Approaches to Whisker Free Tin Deposits," 2003 5th Conference on Electronics Packaging Technology, Dec 10-12, 2003, pp. 55-58.

Choi, W. J., Lee, T. Y., Tu, K. N., Tamura, N., Celestre, R. S., MacDowell, A. A., Bong, Y. Y., and Nguyen, Luu, "Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction," Acta Materialia, vol. 51 no. 20, pp. 6253-6261, Dec. 8, 2003.

"Tin Whiskers," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Dec. 7, 2003.

Livingston, Henry, "GEB-0002: Reducing the Risk of Tin Whisker-Induced Failures in Electronic Equipment," BAE Systems, Dec. 1, 2003.

Brusse, Jay, "A Discussion of the Significance of Metal Whisker Formation to the High Reliability Community," Nov. 2003.

Galyon, George T., "Annotated Tin Whisker Bibliography and Anthology," Nov. 2003.

Vo, Nhat, Boguslavsky, Irina, and Bush, Peter, "NEMI Recommends Standard Test Methods to Assess Propensity for Tin Whisker Growth," Surface Mount Technology (SMT), vol. 17 no. 11, pp. 36-41, Nov. 2003.

Whiteman, Lee, "Tin Whiskers Part III," Empfasis, Nov. 2003.

"Qualification of Lead Free Component Plating Finishes," Nov. 3, 2003.

Ellis, Tim, "Tin Whiskers Part II," National Electronics Manufacturing Center of Excellence, Oct. 2003.

Okada, Seiichi, Higuchi, Shoichi, and Ando, Toshihiro, "Field Reliability Estimation of Tin Whiskers Generated by Thermal-Cycling Stress," Capacitor and Resistor Technology Symposium (CARTS) Europe , Oct. 2003, pp. xx-xx.

Wickham, Martin, Fry, Tony, and Hunt, Chris, "Developing a Test Method to Characterise Internal Stress in Tin Coatings: Phase 1," NPL Report MATC(A)148, Oct. 2003.

"NEMI team recommends three test conditions for evaluating tin whisker growth," PCB007, Oct. 6, 2003.

Oosterhout, Hans van, Hendrikx, Jos, Duis, Patrick, and Ocket, Tom, "Lead free manufacturing," Tyco Electronics Report Project Nr. B033353, Oct. 3, 2003.

"BMPCOE Strives to Mitigate Tin Whiskers," COTS Journal, vol. xx no. xx, pp. 60-63, Sept. 2003.

Ellis, Tim, "Tin Whiskers," National Electronics Manufacturing Center of Excellence, Sept. 2003.

Levine, Bernard, "Facing a Lead-Free Future," Semimfg.com, pp 31-54, Sept. 2003.

Boguslavsky, Irina, "NEMI Tin Whisker Test Project," SMTA International, Chicago, IL, Sept. 25, 2003.

Boguslavsky, Irina, Bush, Peter, Kam-Lum, Elsa, Kwoka, Mark, McCullen, Jack, Spalding, Keithm Vo, Nick, and Williams, Maureen, "NEMI Tin Whisker Test Method Standards," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 670-675.

"Close Shave," Printed Circuit Design and Manufacture, vol. 20 no. 8, pp. 10, Aug. 2003.

Woodrow, Tom, Rollins, Bill, Nalley, Pat, and Ogden, Bob, "Tin Whisker Mitigation Study: Phase I. Evaluation of Environments for Growing Tin Whiskers," Aug. 1, 2003.

Galyon, George T., "Annotated Tin Whisker Bibliography," July 2003.

Galyon, George T., "NEMI Tin Whisker Modeling Project Interim Report," NEMI, July 21, 2003.

"Three organizations from US, Europe, Japan cooperating to develop tin whisker test method," PCB007, July 18, 2003.

"JEITA Whisker Test Method Project," IPC and SOLDERTEC Global Conference, Brussels, June 2003.

Lal, Sudarshan, "Tin Whiskers: Their Appearance & Minimization In Electronic Connectors," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 267-288.

Tsuji, Kiyotaka, "Role of Grain-boundary-free Energy & Surface-free Energy for Tin Whisker Growth," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 169-186.

Whitlaw, Keith, and Crosby, Jeff, "An Investigation into Methods for Minimising Tin Whisker Growth," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 289-298.

Abbott, Don, and Romm, Doug, "TI Tin Whisker and Pb-Free Finish Evaluations," Lead Free Electronics Workshop, Marlborough, MA, June 19, 2003.

Bush, Steve, "Fears of tin whisker growth in solder trimmed by tests," Electronics Weekly, June 11, 2003.

"Back Up Block 1 Whisker on Cu," June 6, 2003.

"Back Up Block 2 Whisker on NiFe," June 6, 2003.

Sun, Qian, and Selvaduray, Guna, "Understanding and Minimizing Tin Whiskers," San Jose State University, June 4, 2003.

Phillips, Edward H., "Inside Avionics," Aviation Week & Space Technology, vol. 158 no. 22, pp. 51, June 2, 2003.

"Tin Whisker Info "Brief"," On Semiconductor Application Note TND311, May 2003.

Dittes, Marc, "Leadframe Packages with Matt Pure Tin Electroplated Surface Finish," Infineon Technology Technical Note, May 2003.

Sun, Qian, "Understanding and Minimization of Tin Whiskers," Spring 2003.

Dittes, M., Obendorff, P., and Petit, L., "Tin Whisker Formation - Results, Test Methods and Countermeasures," 2003 Proceedings 53rd Electronic Components & Technology Conference , New Orleans, LA, May 27-30, 2003, pp. 822-826.

Lau, John H., Pan, Stephen H., and Xu, Chen, "3D Large Deformation and Nonlinear Stress Analyses of Tin Whisker Initiation and Growth on Lead-Free Components," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 692-697.

Boguslavsky, Irina, "NEMI Sn Tin Whisker Project," JISSO/PROTEC Forum, Japan, May 15-16, 2003.

Kushner, Arthur S., "Plating Clinic: Tin Whiskers all over the Place," Products Finishing , vol. 67 no. 7, pp. p. 16-18, Apr. 2003.

Eng, G., Gutierrez, D. A., Hoskinson, C. T., Tueling, M. B., and Stupian, G. W., "Review of Aerospace pre- and post-Project 1998 Tin Whisker Work," The Aerospace Corporation, Apr. 30, 2003.

Jeffers, Basil S., "Capacitor Tin Whisker White Paper - Is It Tinned Yet?," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies , San Jose, CA, Apr. 23-24, 2003, pp. 220-229.

Zaccari, J. S., "Pure Tin Plated Leads - Problems and Mitigation," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies , San Jose, CA, Apr. 23-24, 2003, pp. 258-261.

"HP's Position Statement on Tin-based Plating for Lead-free Components," Apr. 7, 2003.

Streeter, Donald E., "Rapidly delivering war-winning capability," CTMA Symposium: Lead-Free Solder, Apr. 2, 2003.

LeBret, J. B., and Norton, M. G., "Electron microscopy study of tin whisker growth," Journal of Materials Research, vol. 18 no. 3, pp. 585-593, Mar. 2003.

Schetty, Rob, "Tin Whisker Studies- Experimentation & Mechanistic Understanding," Plating & Surface Finishing, vol. 90 no. 3, pp. 48-51, Mar. 2003.

Blum, Werner, Kullmann, Rainer, Wegner, Gerald L., and Kuhl, Reiner W., "Pure Tin: Differentiated View on the Risk of Whisker Formation," 23rd Capacitor and Resistor Technology Symposium, Scottsdale, AZ, Mar. 31-Apr. 3, 2003, pp. 148-154.

Boguslavsky, Irina, "Recrystallization Principles Applied to Whisker Growth in Tin." IPC SMEMA Council APEX 2003, Anaheim, CA, Mar. 31-Apr. 2, 2003, pp. S12-4-1 to S12-4-10.

Okada, Seiichi, "View on Countermeasures for Sn Whiskers for Lead-free Soldering," Murata, Mar. 13, 2003.

Romm, Douglas W., Abbott, Donald C., Grenney, Stu, and Khan, Muhammad, "Whisker Evaluation of Tin-Plated Logic Component Leads," Texas Instruments Application Report SZZA037A, Feb. 2003.

Long, Mark, "Adopting a Hardened Approach to Space-based System Designs," e-inSITE, Feb. 5, 2003.

Verton, Dan, "U.S. urged to add more protection to GPS systems," Computerworld , vol. xx no. xx, pp. xx-xx, Jan. 24, 2003.

"100% Sn Plating Whisker Growth Study," AMD, Jan 10, 2003.

2002: 0 books, 0 theses, 43 papers, and 0 web pages on tin whiskers

Lau, John H., and Pan, Stephen H., "3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components," 2002 NEPCON West - Fiberoptic Expo Conference Proceedings , 2002, pp. 293-297.

Oberndorff, P. J. T. L., Dittes, M., Petit, L., Chen, C. C., Klerk, J., and Kluizenaar, E. E. de, "Tin Whiskers on Lead-free Platings," 2002 Semiconductor Equipment and Materials International, 2002, pp. xx-xx.

Pinsky, David, "Tin Whisker Application Specific Risk Assessment Algorithm," Reliability Analysis Laboratory, 2002.

Prasad, Swaminath, "Sn Whiskers Standards Committee Status," Apex 2002, 2002, pp. xx-xx.

Press, Joseph Henry, "Storms from the Sun: The Emerging Science of Space Weather," The National Academies Press, 2002.

"Legs 1, 2 & 3: Olin 194 8lead SOIC Molded/Singulated." Nov. 2002.

Klubochkin, A. V., Budueva, V. G., and Sakulin, B. M., "Special Features of Nucleation and Growth of Tin Crystals in the Temperature Range of Its Polymorphic Transformation," Metal Science and Heat Treatment, vol. 44 no. 11-12, pp. 505-509, Nov. 2002.

Schroeder, Valeska, "Effects of room temperature aging on assembled and non-assembled platings," IPC, Nov. 2002, pp. xx-xx.

Spalding, Keith, "Tin Whisker Test - Phase II Passives." Nov. 2002.

Boguslavsky, Irina, and Williams, Maureen, "NEMI Sn Whisker Modeling Group Part 1: Overview and Results," IPC/NEMI Meeting, New Orleans, LA, Nov. 7, 2002, pp. xx-xx.

Boguslavsky, Irina, and Bush, Peter, "NEMI Tin Whisker Test Group Phase 2 DOE Results," IPC 2002, New Orleans, LA, Nov. 7, 2002, pp. xx-xx.

Prasad, Swaminath, "Sn Whiskers Standards Committee: An Overview," IPC 2002, New Orleans, LA, Nov. 7, 2002.

Williams, Maureen, and Boguslavsky, Irina, "NEMI Sn Whisker Modeling Group Part 2: Future Work," IPC/NEMI Meeting, New Orleans, LA, Nov. 7, 2002, pp. xx-xx.

Siplon, Jocelyn P., Ewell, Gary J., Frasco, Eric, Brusse, Jay A., and Gibson, Tom, "Tin Whiskers On Discrete Components: The Problem," Proceedings of the 28th International Symposium for Testing and Failure Analysis, Phoenix, AZ, Nov. 3-7, 2002, pp. 421-434.

Friesen, C., and Thompson, C. V., "Reversible Stress Relaxation during Precoalescence Interruptions of Volmer-Weber Thin Film Growth," Physical Review Letters, vol. 89 no. 12, pp. 126103-1-126103-4, Sept. 16, 2002.

Davy, Gordon, "Relay Failure Caused by Tin Whiskers," Northrop Grumman Electronic Systems, Oct. 2002.

Elmgren, Pete, "Tin Whisker Formation on Lead-Free Coatings," Molex, Oct. 2002.

Brusse, Jay, Ewell, Gary, and Siplon, Jocelyn, "Tin Whiskers: Attributes and Mitigation," CARTS Europe, Oct. 15-17, 2002, pp. 221-233.

"The Relation between Whisker and Stress," Hynix Semiconductor. Sept. 2002.

Garshasb, Masoud, "Analysis of tin- and nickel-plated copper wire failures for quality improvement," Wire Journal International, vol. 35 no. 9, pp. 86-90, Sept. 2002.

Boguslavsky, Irena, "Whiskers: Truth and Mystery," IPC/NEMI Symposium on Lead-Free Electronics, Montreal, Canada, Sept. 19, 2002, pp. xx-xx.

Osterman, M., "Mitigation Strategies for Tin Whiskers," Aug. 28, 2002.

"Position Paper on Risks to High-Reliability Electronics and Associated Hardware from Pure Tin Coatings," July 25, 2002.

"Basler Power Supplies," Westinghouse Nuclear Tech Bulletin TB-02-5, July 12, 2002.

Sheng, George T. T., Hu, C. F., Choi, W. J., Tu, K. N., Bong, Y. Y., and Nguyen, Luu, "Tin whiskers studied by focused ion beam imaging and transmission electron microscopy," Journal of Applied Physics, vol. 92 no. 1, pp. 64-69, July 1, 2002.

Brusse, Jay, "Tin Whisker Observations on Pure Tin-Plated Ceramic Chip Capacitors," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-28, 2002, pp. 45-61.

Brusse, Jay, "Tin Whisker Observations on Pure Tin-Plated Ceramic Chip Capacitors (presentation)," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-28, 2002, pp. 45-61.

Brusse, Jay, "Tin Whisker Observations on Pure Tin-Plated Ceramic Chip Capacitors," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 296-312.

Schetty, Rob, "Tin Whisker Studies - Experimentation & Mechanistic Understanding," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 124-134.

Whitlaw, Keith, and Crosby, Jeff, "An Empirical Study into Whisker-Growth of Tin & Tin Alloy Electrodeposits," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 136-147.

Williams, M. E., Johnson, C. E., Moon, K.-W., Stafford, G. R., Handwerker, C. A., and Boettinger, W. J., "Whisker Formation on Electroplated Sn-Cu," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 148-159.

"Risks of Conductive Whiskers in High-Reliability Electronics and Associated Hardware from Pure Tin Coatings," June 19, 2002.

"Tin Whisker Experiences," June 19, 2002.

Vicenzo, A., Cavallotti, P. L., and Crema, P., "Electrochemical Control of Whisker Growth on Electrodeposited Tin Coatings," Transactions of the Institute of Metal Finishing, vol. 80 no. 3, pp. 79-84, May 2002. https://doi.org/10.1080/00202967.2002.11871438

Xu, Chen, Zhang, Yun, Fan, Chonglun, and Abys, Joseph A., "Understanding Whisker Phenomenon: The Driving Force for Whisker Formation," CircuiTree, vol. 15 no. 5, pp. xx, May 2002.

Choi, W. J., Lee, T. Y., Tu, K. N., Tamura, N., Celestre, R. S., MacDowell, A. A., Bong, Y. Y., Nguyen, L., and Sheng, George T. T., "Structure and Kinetics of Sn Whisker Growth on Pb-Free Solder Finish," 2002 Proceedings 52nd Electronic Components & Technology Conference , San Diego, CA, May 28-31, 2002, pp. 628-633.

Long, Mark, "Processor Problem Continues To Dog Boeing Satellites," e-inSITE, May 14, 2002.

Levine, Bernard, "Will 'Tin Whiskers' Grow When You Get the Lead Out?," Electronic News, Mar. 25, 2002.

Brusse, Jay A., Ewell, Gary J., and Siplon, Jocelyn P. "Tin Whiskers: Attributes and Mitigation," 22nd Capacitor and Resistor Technology Symposium, New Orleans, LA, Mar. 25-29, 2002, pp. 67-80.

Brusse, Jay, Ewell, Gary, and Siplon, Jocelyn, "Tin Whiskers: Attributes and Mitigation (presentation)," 22nd Capacitor and Resistor Technology Symposium, New Orleans, LA, Mar. 25-29, 2002, pp. 67-80.

Rinne, C. Lizzul, Hren, John J., and Fedkiw, Peter S., "Electrodeposition of Tin Needle-Like Structures," Journal of the Electrochemical Society, vol. 149 no. 3, pp. C150-C158, Feb. 2002.

Larson, B. C., Yang, Wenge, Ice, G. E., Budai, J. D., and Tischler, J. Z., "Three-dimensional X-ray structural microscopy with submicrometre resolution," Nature, vol. 415 no. 6874, pp. 887-890, Feb. 21, 2002.

"NEMI's Tin Whisker Project reports initial test results, reviews modeling efforts at APEX 2002," PCB007, Feb. 8, 2002.

2001: 1 book, 1 thesis, 16 papers, and 1 web page on tin whiskers

Buschow, K. H. J., Cahn, Robert, Flemings, Merton C., Ilschner, Bernhard, Kramer, Edward J., Mahajan, Subhash, and Veyssiere, Patrick, Encyclopedia of Materials: Science and Technology, Volume 10. (Katz, J. D., "Whiskers," pp. 9570-9574.) Pergamon, 2001. ISBN 0080431526. $7,295.00 list price.

Lee, Taekyeong, Electromigration and Solid State Aging of Flip Chip Solder Joints and Analysis of Sn Whisker on Lead-frame. Ph. D. Thesis for University of California, Los Angeles, CA, 2001.

Moon, K.-W., Williams, M. E., Johnson, C. E., Stafford, G. R., Handwerker, C. A., and Boettinger, W. J., "The Formation of Whiskers on Electroplated Tin Containing Copper," Proceedings of the Fourth Pacific Rim International Conference on Advanced Materials and Processing, Sendai, Japan, 2001, pp. 1115-1118.

Schetty, Rob, "Minimization of tin whisker formation for lead-free electronics finishing," Circuit World, vol. 27 no. 2, pp. 17-20, 2001.

Xu, Chen, Zhang, Yun, Fan, Chonglun, Vysotskaya, Anna, Abys, Joseph A., Hopkins, Leslie, and Stevie, Fred, "Understanding Whisker Phenomenon - Mechanisms Study," 2001 SMTA International Conference Proceedings, Chicago, IL, Sept. 30-Oct. 4, 2001, pp. xx-xx.

Chen, Hong, and Li, J. C. M., "Impression creep of a viscous layer," Journal of Materials Research , vol. 16 no. 9, pp. 2709-2715, Sept. 2001.

Cermelli, Paolo, and Gurtin, Morton E., "On the characterization of geometrically necessary dislocations in finite plasticity," Journal of the Mechanics and Physics of Solids, vol. 49 no. 7, pp. 1539-1568, July 2001.

Kadesch, Jong S., and Brusse, Jay, "The Continuing Dangers of Tin Whiskers and Attempts to Control Them with Conformal Coating." EEE Links, vol. xx no. xx, pp. xx-xx, July 2001.

Gagliano, Robert A. and Fine, Morris E., "Growth of n-Phase Scallops and Whiskers in Liquid Tin-Solid Copper Reaction Couples," JOM, vol. 53 no. 6, pp. 33-38, June 2001.

Brusse, Jay, "Survey of MIL Ceramic Capacitor Manufacturers Regarding Termination Finishes," NEPAG, May 23, 2001.

Stevens, Craig, "Relay Failures Induced by the Growth of Tin Whiskers: A Case Study," IEEE Boston Reliability Chapter 38th Annual Spring Reliability Symposium , May 16, 2001.

Sampson, Michael J., "The NASA EEE Parts Assurance Group (NEPAG)," NASA, May 1, 2001.

"Electrodeposited Pb-free Solder and Whisker Prevention," Journal of Research of the National Institute of Standards and Technology, vol. 106 no. 2, pp. 490, Mar./Apr. 2001.

"Hughes Satellite Failures Continue To Plague New Owner," Electronics Weekly, Apr. 24, 2001.

Bidin, Rahamat, Tagapulot, Rosemarie, Lao, Carl Nichelle D., and Manalac, Rodel, "Lead-Free Packaging", Advanced Packaging, vol. 10 no. 4, pp. xx-xx, Apr. 2001.

Houghtaling, Pamela, "Putting a `Whisker-Free' Face on Electronic Parts," NIST Tech Beat , vol. xx no. xx, pp. xx-xx, Mar./Apr. 2001.

Custer, Kevin, "Help... My Receiver has lost Sensitivity!", March 2001.

Yen, Andrew C., Hongyu, Zheng, Wynn, Richard Thet, Yaohui, Zhang, and Wang, Lingfai, "A Method of Investigating Fine Shorting Whiskers Within a Leadframe Molded Package," IEEE Transactions on Advanced Packaging, vol. 24 no. 1, pp. 99-103, Feb. 2001.

Barthelmy, Michael, "Problems with Pure Tin Coatings," NASA GSFC Materials Engineering Branch, Jan. 17, 2001.

2000: 0 books, 0 theses, 12 papers, and 2 web pages on tin whiskers

Kadesch, Jong S., "Effects of Conformal Coat on Tin Whisker Growth," EEE Links, vol. 6 no. 1, pp. 20-22, 2000.

Zhang, Yun, Xu, Chen, Fan, Chonglun, and Abys, Joseph A., "Tin Whisker Growth and Prevention," Journal of SMT, vol. 13 no. 4, pp. 1-9, Oct. 2000.

"Tin whiskers a problem with immersion tin pwb finishes? ," finishing.com. Oct. 3, 2000.

The Trouble with Tin: Get the Lead Out! (before Fall 2000)

Blair, Alan, "Analyze This...," Plating & Surface Finishing, vol. 87 no. 9, pp. 47, Sept. 2000.

Hampshire, Bill, and Hymes. Les, "Shaving Tin Whiskers," Circuits Assembly, vol. 11 no. 9, pp. 50,52,54, Sept. 2000.

"Hughes Seeks To Salvage Satellites," Television Digest with Consumer Electronics, vol. xx no. xx, pp. xx-xx, Sept. 11, 2000.

Kadesch, Jong S., and Leidecker, Henning, "Effects of Conformal Coat on Tin Whisker Growth," Proceedings of IMAPS Nordic, Sept. 10-13, 2000, pp. 108-116.

Foust, Jeff, "Mexican Satellite Failure: Possible Link to Past Problem," Space.com, Aug. 30, 2000.

Ray, Justin, "Satellite failure causes communications blackout," Spaceflight Now , Aug. 29, 2000.

Tomlins, P. E., Nottay, J., and Zou, L., "The Influence Of Thermal Cycling On The Adhesion Of Conformal Coatings," NPL Report CMMT(A)277, July 2000.

Barnett, M. R., Kelly, G. L., and Hodgson, P. D., "Predicting the Critical Strain for Dynamic Recrystallization using the Kinetics of Static Recrystallization," Scripta Materialia, vol. 43 no. 4, pp. 365-369, July 28, 2000.

"Technical Service Bulletin: Tin Whiskers in MOD10 Relays." GE Power Management, MOD10 SB1-00.03.27, Mar. 27, 2000.

1999: 0 books, 0 theses, 6 papers, and 0 web pages on tin whiskers

Duzgun, B., Ekinci, A. E., Karaman, I., and Ucar, N., "Investigation of Dislocation Movements and Deformation Characteristics in b-Sn Single Crystals," Journal of the Mechanical Behavior of Materials , vol. 10 no. 3, pp. 187-203, 1999.

"Tin whiskers in electronic," finishing.com. Dec. 16, 1999.

Kepler, K. D., Vaughey, J. T., and Thackeray, M. M., "Copper-tin anodes for rechargeable lithium batteries: an example of the matrix effect in an intermetallic system," Journal of Power Sources , vol. 81-82, pp. 383-387, Sept. 1999.

Winter, Martin, and Besenhard, Jurgen O., "Electrochemical lithiation of tin and tin-based intermetallics and composites," Electrochimica Acta, vol. 45 no. 1-2, pp. 31-50, Sept. 30, 1999.

Nix, W. D., and Clemens, B. M., "Crystallite coalescence: A mechanism for intrinsic tensile stresses in thin films," Journal of Materials Research, vol. 14 no. 8, pp. 3467-3473, Aug. 1999.

Felps, Bruce, "'Whiskers' Caused Satellite Failure: Galaxy IV Outage Blamed On Interstellar Phenomenon," Wireless Week, vol. xx no. xx, pp. xx-xx, May 17, 1999.

1998: 1 book, 0 theses, 17 papers, and 0 web pages on tin whiskers

Lee, Dong Nyung, "Spontaneous growth mechanism of tin whiskers," Seoul National University, 1998.

Licari, James J., and Enlow, Leonard R., Hybrid Microcircuit Technology Handbook: Materials, Processes, Design, Testing and Production, 2nd Edition. Westwood, NJ: Noyes Publications, 1998. ISBN 0815514239. $180.00 list price.

Brusse, Jay, "Tin Whiskers: Revisiting an Old Problem." EEE Links, vol. 4 no. 4, pp. 5-7, Dec. 1998.

Kadesch, Jong S., and Brusse, Jay, "Electromagnetic Relay Manufacturer Survey," Dec. 1998.

Sampson, Michael J., "Tin Whiskers: Amendment," NASA Parts Advisory NA-044A, Dec. 17, 1998.

Sampson, Michael J., "Tin Whiskers," NASA Parts Advisory NA-044, Oct. 23, 1998.

Nordwall, Bruce D., , "Filter Center," Aviation Week & Space Technology, vol. 149 no. 7, pp. 47, Aug. 17, 1998.

Pressman, Aaron, "Galaxy IV Satellite Loss Explained - Tiny Space Crystals Responsible," Aug. 12, 1998.

Lee, B.-Z., and Lee, D. N., "Spontaneous growth mechanism of tin whiskers," Acta Materialia, vol. 46 no. 10, pp. 3701-3714. June 12, 1998.

Rogers, Adam, "The Day the Beepers Died," Newsweek, vol. 131 no. 22, pp. 48, June 1, 1998.

Thibodeau, Patrick, "Satellite failure is a wake-up call to users," Computerworld , vol. xx no. xx, pp. xx-xx, May 25, 1998.

Coatney, Mark, "PanAmSat's $100 Million Problem," May 21, 1998.

"Glitch silences millions of pagers," Star-Bulletin, May 20, 1998.

Karon, Tony, "Rogue Satellite Blanks Pagers," Time, May 20, 1998.

Macavinta, Courtney, "The Great Galaxy 4 Satellite Pager Disaster," CNET News.com, May 20, 1998.

Thibodeau, Patrick, "Satellite glitch spawns big headaches," Computerworld, vol. xx no. xx, pp. xx-xx, May 20, 1998.

Kuznetsov, V. I., and Tulin, V. A., "Synchronization of high-frequency vibrations of slipping phase centers in a tin whisker under microwave radiation," Journal of Experimental and Theoretical Physics, vol. 86 no. 4, pp. 745-750, Apr. 1998. doi 10.1134/1.558535

Ewell, G. J., and Moore, F., "Tin Whiskers and Passive Components: A Review of the Concerns," 18th Capacitor and Resistor Technology Symposium, Huntington Beach, CA, Mar. 9-13, 1998, pp. 222-228.

1997: 0 books, 0 theses, 9 papers, and 0 web pages on tin whiskers

Burstner, Gerhard, and Frohlich, Eckhard, "Electroplating versus Hot- Dipped Tinning a Comparison of Application - Experiences," CARTS-Europe '97 Symposium, Prague, 1997, pp. xx-xx.

Hill, Lisa, "SEM Imaging of Tin Whiskers," 1997.

Smogunov, A. N., Kurkina, L. I., Kurganskii, S. I., and Farberovich, O. V., "Electronic structure of simple metal whiskers," Surface Science, vol. 391 no. 1-3, pp. 245-251, Nov. 26, 1997.

Colin, J., Grilhe, J., and Junqua, N., "Surface instabilities of a stressed cylindrical whisker," Philosophical Magazine A: Physics of Condensed Matter, Structure, Defects and Mechanical Properties, vol. 76 no. 4, pp. 793-805, Oct. 1997. https://doi.org/10.1080/01418619708214211

Endo, M, Higuchi, S., Tokuda, Y., and Sakabe, Y., "Elimination of Whisker Growth on Tin Plated Electrodes", Proceedings of the 23rd International symposium for Testing and Failure Analysis, Santa Clara, CA, Oct. 27-31, 1997, pp. 305-311.

Hughes, D. A., and Hansen, N., "High Angle Boundaries Formed by Grain Subdivision Mechanisms," Acta Materialia, vol. 45 no. 9, pp. 3871-3886, Sept. 1997.

Ravelo, R., and Baskes, M., "Equilibrium and Thermodynamic Properties of Grey, White, and Liquid Tin," Physical Review Letters, vol. 79 no. 13, pp. 2482-2485, Sept. 29, 1997.

Kylner, Carina, and Mattsson, Lars, "An optical instrument for overall stress and local stress relaxation analysis in thin metal films," Review of Scientific Instruments, vol. 68 no. 1, pp. 143-149, Jan. 1997.

Yang, Fuqian, "Creep due to grain boundary diffusion and grain boundary viscous flow," Journal of Physics D: Applied Physics, vol. 30 no. 2, pp. 286-288, Jan. 21, 1997.

1996: 0 books, 0 theses, 5 papers, and 0 web pages on tin whiskers

"MAUDE Adverse Event Report," 1996.

Yang, J., Winter, M., and Besenhard, J. O., "Small particle size multiphase Li-alloy anodes for lithium-ion batteries," Solid State Ionics, vol. 90 no. 1-4, pp. 281-287, Sept. 1996.

Zhang, Y., Breck, G., Humiec, F., Murski, K., and Abys, A., "An Alternative Surface Finish for Tin/Lead Solders: Pure Tin," Surface Mount International Proceedings of the Technical Program, Volume II, San Jose, CA, Sept. 10-12, 1996, pp. 641-649.

Zhang, Y., and Abys, J. A., "An Alternative Surface Finish for Tin/Lead solders - Pure Tin," Proceedings AESF SUR/FIN '96, Cleveland, OH, June 10-13, 1996, pp. 223-246.

Thompson, Carl V., and Carel, Roland, "Stress and Grain Growth in Thin Films," Journal of the Mechanics and Physics of Solids, vol. 44 no. 5, pp. 657-673, May 1996.

1995: 0 books, 0 theses, 6 papers, and 0 web pages on tin whiskers

Yang, Fuqian, Li, J. C. M., and Shih, C. W., "Computer simulation of impression creep using the hyperbolic sine stress law," Materials Science and Engineering: A, Structural Materials, vol. 201 no. 1-2, pp. 50-57, Oct. 1995.

Kuhl, Reiner, and Mills, Sherrye, "Assuring Whisker-free Components," Surface Mount Technology (SMT) , vol.9 no. 6, pp. 48-49, June 1995.

Bergauer, A., Bangert, H., Eisenmenger-Sittner, Ch., and Barna, P. B., "Whisker growth on sputtered AlSn (20 wt.% Sn) films," Thin Solid Films , vol. 258 no. 1-2, pp. 115-122, Mar. 15, 1995.

MacKay, Colin A., "Method of inhibiting tin whisker growth," U. S. Patent 5,393,573, Feb. 28, 1995.

Yang, Fuqian, and Li, J. C. M., "Impression and diffusional creep of anisotropic media," Journal of Applied Physics, vol. 77 no. 1, pp. 110-117, Jan. 1995.

Yang, Fuqian, and Li, J. C. M., "Comments on "A Model for Nano-Indentation Creep"," Scripta Metallurgica et Materialia, vol. 32 no. 1, pp. 139-144, Jan. 1, 1995.

1994: 0 books, 0 theses, 3 papers, and 0 web pages on tin whiskers

Arutyunov, K. Yu., Danilova, N. P., and Nikolaeva, A. A., "Galvanomagnetic properties of quasi-one-dimensional superconductors," Journal of Applied Physics, vol. 76 no. 10, pp. 7139-7141, Nov. 15, 1994.

Arutyunov, K. Yu., Danilova, N. P., and Nikolaeva, A. A., "Nonequilibrium transport in superconducting filaments," Proceedings of the 4th International Conference and Exhibition: World Congress on Superconductivity, Volume 1, Orlando, FL, June 27-July 1, 1994, pp. 359-368.

Tu, K. N., "Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions," Physical Review B, vol. 49 no. 3, pp. 2030-2034, Jan. 15, 1994.

1993: 1 book, 0 theses, 4 papers, and 0 web pages on tin whiskers

Tan, A. C., Tin and Solder Plating in the Semiconductor Industry. New York: Chapman & Hall, 1993. ISBN 0-412-48240-1.

Li, W. B., and Warren, R., "A Model for Nano-indentation Creep," Acta Metallurgica et Materialia , vol. 41 no. 10, pp. 3065-3069, Oct. 1993.

Yang, Fuqian, and Li, J. C. M., "Impression creep of a thin film by vacancy diffusion. I. Straight punch," Journal of Applied Physics, vol. 74 no. 7, pp. 4382-4389, Oct. 1, 1993.

Chang, C. Y., and Vook, R. W., "The effect of surface aluminum oxide films on thermally induced hillock formation," Thin solid Films, vol. 228 no. 1-2, pp. 205-209, May 15, 1993.

McDowell, Mark E., "Tin Whiskers: A Case Study," Aerospace Applications Conference , Jan. 31-Feb. 5, 1993, pp. 207-215.

1992: 0 books, 0 theses, 3 papers, and 0 web pages on tin whiskers

Stupian, G. W., "Tin Whiskers in Electronic Circuits," Aerospace Report No. TR-92 (2925-7), Dec. 20, 1992.

Park, Hyun Soo, "Requirements to Preclude the Growth of Tin Whiskers," NASA Memo no. ASA Parts Project Office-Code 310, Goddard space Flight Center to QR/Director, Reliability, Maintainability, and Quality Assurance Divisin, Feb. 14, 1992.

Park, Hyun Soo, "Precluding Tin Whiskers," NASA, Feb, 7, 1992.

1991: 1 book, 0 theses, 2 papers, and 0 web pages on tin whiskers

Fukuda, Mitsuo, Reliability and Degradation of Semiconductor Lasers and LEDs. Boston: Artech House, 1991. ISBN 0890064652.

Durney, Larry, "PF finishing clinic," Products Finishing, vol. 55 no. 6, pp. 18, 20, Mar. 1991.

Tidecks, R., and Yang, X., "Breakdown of superconductivity in a microcontact between two whiskers - Evidence for discrete excited states of a phase-slip center," Zeitschrift fur Physik B Condensed Matter, vol. 83 no. 1, pp. 119-123, Feb. 1991. https://doi.org/10.1007/BF01314405

1990: 0 books, 0 theses, 3 papers, and 0 web pages on tin whiskers

Cunningham, Kathleen M., and Donahue, Michael P., "Tin Whiskers: Mechanism of Growth and Prevention," 4th International SAMPE Electronics Conference, Volume 4, Albuquerque, NM, June 12-14, 1990. pp. 569-575.

Bandyopadhyay, A. K., and Sen, S. K., "A study of intermetallic compound formation in a copper-tin bimetallic couple," Journal of Applied Physics, vol. 67 no. 8, pp. 3681-3688, Apr. 15, 1990.

Selcuker, Ahmet, and Johnson, Michael, "Microstructural Characterization of Electrodeposited Tin Layer in Relation to Whisker Growth", 10th Capacitor and Resistor Technology Symposium , San Francisco, CA, Mar. 28-29, 1990, pp. 196-199.

1989: 0 books, 0 theses, and 3 papers on tin whiskers

Nix, William D., "Mechanical Properties of Thin Films," metallurgical Transactions A , vol. 20 no. 11, pp. 2217-2245, Nov. 1989.

Corbid, L., "Constraints on the Use of Tin Plate in Miniature Electronic Packages," 3rd International SAMPE Electronics Conference, Volume 3, Los Angeles, CA, June 20-22, 1989, pp. 773-779.

Nagasaka, Muneo, "Temperature Dependence of Plastic Deformation in White Tin Single Crystals," Japanese Journal of Applied Physics, vol. 28 pt. 1 no. 3, pp. 446-452, Mar. 1989.

1988: 0 books, 0 theses, and 1 paper on tin whiskers

Dunn, B. D., "Mechanical and Electrical Characteristics of Tin Whiskers with Special Reference to Spacecraft Systems," European Space Agency (ESA) Journal, vol. 12, pp. 1-17, Jan. 14, 1988.

1987: 0 books, 0 theses, and 5 papers on tin whiskers

Baker, Richard G., "Conclusion: Whisker Growth," Plating and Surface Finishing, vol. 74 no. 11, pp. 12, 66, Nov. 1987.

Baker, Richard G., "Spontaneous Metallic Whisker Growth," Plating and Surface Finishing , vol. 74 no. 10, pp. 10, Oct. 1987.

Dunn, B. D., "A Laboratory Study of Tin Whisker Growth," European Space Agency (ESA) STR-223, Sept. 1987.

Gabe, D. R., "Whisker growth on tin electrodeposits," Transactions of the Institute of Metal Finishing, vol. 65 no. 3, pp. 115, Aug. 1987. https://doi.org/10.1080/00202967.1987.11870783

Halimi, R., Chpilevski, E. M., Gorbatchevski, D. A., and Yazitchenko, C. A., "Formation de "Whiskers" et de "Hillocks" sur la Surface des Couches Minces de Cu/Sn," Thin Solid Films, vol. 150 no. 2/3, pp. 357-368, July 6, 1987.

1986: 0 books, 0 theses, and 5 papers on tin whiskers

Doerner, M. F., Gardner, D. S., and Nix, W. D., "Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques," Journal of Materials Research, vol. 1 no. 6, pp. 845-851, Dec. 1986.

Poker, D. B., Schubert, J., and Stritzker, B., "Ion-induced Growth of Whiskers on Sn Films, Beam-Solid Interactions and Transient Processes (Materials Research Society Symposia Proceedings, Volume 74), Dec. 1-4, 1986, pp. 529-534.

Nordwall, Bruce D., "Air Force Links Radar Problems to Growth of Tin Whiskers," Aviation Week & Space Technology, vol. 124 no. 26, pp. 65, 67, 69, June 20, 1986.

"Inspections, Compliance, Enforcement, and Criminal Investigations Tin Wiskers Problems, Causes, and Solutions," Food and Drug Administration, Mar. 14, 1986.

"ITG Subject: Tin Whiskers - Problems, Causes, and Solutions," Department of Health, Education, and Welfare Public Health Service Food and Drug Administration *ORA/ORO/DEIO/IB*, Mar. 14, 1986.

1985: 0 books, 0 theses, and 0 papers on tin whiskers

1984: 0 books, 0 theses, and 7 papers on tin whiskers

Tidecks, R., "Properties of a Weak Link with Tunable Strength in a Quasi-One-Dimensional Superconductor," Zeitschrift fur Physik B Condensed Matter, vol. 57 no. 2, pp. 127-136, Oct. 1984. https://doi.org/10.1007/BF02071962

Singh, Prabjit, and Ohring, Milton, "Tracer study of diffusion and electromigration in thin tin films," Journal of Applied Physics, vol. 56 no. 4, pp. 899-907, Aug. 15, 1984.

Endicott, Duane W., and Kisner, Kim T., "A Proposed Mechanism for Metallic Whisker Growth," Proceedings of the 71st American Electroplaters Society SUR/FIN '84, New York, NY, July 16-19, 1984, Session J - Electronics I, pp. 1-20.

Gorbunova, K. M., and Glazunova, V. K., "Present State of the Problem of Spontaneous Growth of Whisker Crystals on Electrolytic Coatings," Protection of Metals (English translation of Zaschita Metallov), vol. 20 no. 3, pp. 269-282, May-June 1984.

Gaidukov, Yu. P., "Electronic properties of whiskers," Soviet Physics Uspekhi, vol. 27 no. 4, pp. 256-272, Apr. 1984.

Sakai, T., and Jonas, J. J., "Overview no. 35 Dynamic Recrystallization: Mechanical and Microstructural Considerations," Acta Metallurgica, vol. 32 no. 2, pp. 189-209, Feb. 1984.

Mizuishi, Ken'ichi, "Some aspects of bonding-solder deterioration observed in long-lived semiconductor lasers: Solder migration and whisker growth," Journal of Applied Physics, vol.55 no. 2, pp. 289-295, Jan. 15, 1984.

1983: 0 books, 0 theses, and 2 papers on tin whiskers

"High-Speed, Non-Whiskering Tin for Semiconductor Packages," Products Finishing, vol. 47 no. 12, pp. 80, Sept. 1983.

Kawanaka, Ryusuke, Fujiwara, Kenzo, Nango, Shigeyuki, and Hasegawa, Tomoharu, "Influence of Impurities on the Growth of Tin Whiskers," Japanese Journal of Applied Physics, vol. 22 no. 6, pp. 917-922, June 1983.

1982: 0 books, 0 theses, and 1 paper on tin whiskers

Kakeshita, Tomoyuki, Shimizu, Ken'ichi, Kawanaka, Ryusuke, and Hasegawa, Tomoharu, "Grain size effect of electro-plated tin coatings on whisker growth," Journal of Materials Science, vol. 17 no. 9, pp. 2560-2566, Sept. 1982.

1981: 0 books, 0 theses, and 0 papers on tin whiskers

1980: 0 books, 0 theses, and 2 papers on tin whiskers

Fujiwara, Kenzo, and Kawananka, Ryusuke, "Observation of the tin whisker by micro-Auger electron spectroscopy," Journal of Applied Physics, vol. 51 no. 12, pp. 6231-6237, Dec. 1980.

Chu, S. N. G., and Li, J. C. M., "Localized Stress Relaxation by Impression Testing," Materials Science and Engineering, vol. 45 no. 2, pp. 167-171, Sept. 1980.

1979: 0 books, 0 theses, and 3 papers on tin whiskers

Tidecks, R., and von Minnigerode, G., "The Influence of High-Frequency Radiation on the U-I Characteristics of Superconducting Tin Whiskers," Physica Status Solidi (a), vol. 52 no. 2, pp. 421-426, 1979. https://doi-org.ezproxy.uky.edu/10.1002/pssa.2210520208

Tidecks, R., and Meyer, J. D., "Current-Induced Resistive State of Superconducting Tin Whiskers with Indium Impurities," Zeitschrift fur Physik B Condensed Matter, vol. 32 no. 4, pp. 363-374, Dec. 1979. https://doi.org/10.1007/BF02109465

Grimmer, Hans, "The Distribution of Disorientation Angles if All Relative Orientations of Neighbouring Grains Are Equally Probable," Scripta Metallurgica, vol. 13 no. 2, pp. 161-164, Feb. 1979.

1978: 0 books, 0 theses, and 2 papers on tin whiskers

Gluck, P., "On Current Carrying Superconducting Tin Whiskers," Physics Letters A , vol. 66 no. 5, pp. 425-426, June 12, 1978.

Hada, Yoshikatsu, Marikawa, Osamu, and Togami, Hideki, "Study of Tin Whiskers on Electromagnetic Relay Parts," Proceedings 26th Relay Conference, Stillwater, OK, Apr. 25-25, 1978, pp. 9-1 to 9-5.

1977: 0 books, 0 theses, and 5 papers on tin whiskers

Chu, S. N. G., and Li, J. C. M., "Impression creep; a new creep test," Journal of Materials Science , vol. 12 no. 11, pp. 2200-2208, Nov. 1977.

Bader, W. G., "Identification of Fused Tin Coatings On Integrated Circuit Device Leads," Plating and Surface Finishing, vol. 64 no. 8, pp. 56-57, Aug. 1977.

Smith, George A., "How to Avoid Metallic Growth on Electronic Hardware," Circuits Manufacturing, vol. 17 no. 7, pp. 66,68,70-72, July 1977.

Zakraysek, L., "Whisker Growth From a Bright Acid Tin Electrodeposit," Plating and Surface Finishing, vol. 64 no. 3, pp. 38-43, Mar. 1977.

Cook Jr., J. W., Davis, W. T., Chandler, J. H., and Skove, M. J., "Effect of stress on the superconducting transition temperature in indium, indium-alloy, tin, and tin-alloy whisker samples," Physical Review B , vol. 15 no. 3, pp. 1357-1369, Feb. 1, 1977.

1976: 0 books, 0 theses, and 5 papers on tin whiskers

Dunn, B. D., "Whisker Formation on Electronic Materials." ESA Scientific and Technical Review, vol. 2 no. 1, pp. 1-22, 1976.

Siegel, H. M., Self, W. B., Johnson, R. M., and Wiseman, C. D., "Rapid determination of metal whiskers growth axes," Journal of Applied Physics, vol. 47 no. 10, pp. 4688-4690, Oct. 1976.

Dunn, B. D., "Whisker Formation on Electronic Materials," Circuit World, vol. 2 no. 4, pp. 32-40, July 1976.

Diehl, R. P, and Cifaldi, N. A., "Eliminate Whisker Growth on Contacts by Using a Tin Alloy Plate," Insulation/Circuits, vol. 22 no. 4, pp. 37-39, Apr. 1976.

Lindborg, U., "A Model for the Spontaneous Growth of Zinc, Cadmium, and Tin Whiskers," Acta Metallurgica, vol. 24 no. 2, pp. 181-186, Feb. 1976.

1975: 0 books, 0 theses, and 4 papers on tin whiskers

Fiedler, R., and Vagera, I., "On the Burgers Vectors in b-Sn Single Crystals," Physica status solidi. A, vol. 32 no. 2, pp. 419-424, Dec. 16, 1975.

Mayer, James W., Poate, John M., and Tu, King-Ning, "Thin Films and Solid-Phase Reactions," Science, New Series, vol. 190 no. 4211, pp. 228-234, Oct. 17, 1975.

Meyer, J. D., "Negative Differential Resistance in the V(I)-Characteristic of Superconducting Sn-Whiskers," Applied Physics, vol. 7 no. 2, pp. 127-130, June 1975. https://doi.org/10.1007/BF00884222

Sabbagh, N. A. J., and McQueen, H. J., "Tin Whiskers: Causes & Remedies," Metal Finishing, vol. 73 no. 3, pp. 27-31, Mar. 1975.

1974: 0 books, 0 theses, and 3 papers on tin whiskers

Chaudhari, P., "Hillock growth in thin films," Journal of Applied Physics, vol. 45 no. 10, pp. 4339-4346, Oct. 1974.

Britton, S. C., "Spontaneous Growth of Whiskers on Tin Coatings: 20 Years of Observation," Transactions of the Institute of Metal Finishing, vol. 52, pp. 95-102, Apr. 3, 1974. https://doi.org/10.1080/00202967.1974.11870313

Morris, R. B., and Bonfield, W., "The Crystallography of Alpha-Tin Whiskers," Scripta Metallurgica , vol. 8 no. 3, pp. 231-236, Mar. 1974.

1973: 0 books, 1 thesis, and 3 papers on tin whiskers

Meyer, J. D., "Spannungsstufen in den U(T)-Ubergangskurven und U(I)-Kennlinien stromtragender Zinn-Whisker," Applied Physics, vol. 2 no. 6, pp. 303-320, Dec. 1973. https://doi.org/10.1007/BF00896936

Jafri, A., "Fighting Whisker Growth in the Communication Industry," Plating, vol. 60 no. 4, pp. 358-361, Apr. 1973.

Sabbagh, N. A. J., Tin Whisker Growth in the Communication Industry. Master's Thesis for Sir George Williams University, Montreal, Canada, Apr. 1973.

Tu, K. N, "Interdiffusion and Reaction in Bimetallic Cu-Sn Thin Films," Acta Metallurgica, vol. 21 no. 4, pp. 347-354, Apr. 1973.

1972: 0 books, 1 thesis, and 5 papers on tin whiskers

Kehrer, H.-P., and Zaminer, Christian, "Crystal Growth - Growth of Tin Whiskers in the Scanning Electron Microscope," 1972.

Overcash, D. R., Stillwell, E. P., Skove, M. J., and Davis, J. H., "Deformation Twinning in Zn, Sn, and Bi Single Crystal Whiskers", Philosophical Magazine, vol. 25 no. 6, pp. 1481-1488, 1972. https://doi.org/10.1080/14786437208223867

Powell, B. E., and Skove, M. J., "Combinations of Third-Order Elastic Constants of Tin," Physica Status Solidi (a), vol. 9 no. 1, pp. K11-K14, 1972. https://doi-org.ezproxy.uky.edu/10.1002/pssa.2210090150

Chandler, Gary Jesse Howard, Growth of Whiskers in the Indium-Tin Alloy System and the effect of Elastic Strain on Tc in alpha Indium-Tin. Master's Thesis for Clemson University, Clemson, SC, Aug. 1972.

Rothberg, Barbara D., "Superconductivity and Mechanical Twinning of Tin Whiskers," Philosophical Magazine, vol. 25 no. 6, pp. 1473-1480, June 1972. https://doi.org/10.1080/14786437208223866

Fiedler, R., and Lang, A. R., "Dislocation Generation at Surfaces of Tin Single Crystals," Journal of Materials Science, vol. 7 no. 5, pp. 531-542, May 1972.

1971: 0 books, 0 theses, and 4 papers on tin whiskers

Overcash, D. R., Watlington, C. L., Skove, M. J., and Stillwell, E. P., "Temperature Dependence of the Critical Current in Tin and Indium Whiskers," Physica, vol. 55, no. xx, pp. 317-323, Oct. 1971. https://doi.org/10.1016/0031-8914(71)90269-2

Possin, G. E., "Superconductivity in Nearly One-Dimensional Tin Wires," Physica, vol. 55, pp. 339-343, Oct. 1971. https://doi.org/10.1016/0031-8914(71)90271-0

Warburton, R. J., Patton, B. R., Webb, W. W., and Wilkins, J. W., "Fluctuation Effects in the Resistive Transition of Thin Filamentary Superconductors," Physica, vol. 55, pp. 324-338, Oct. 1971, https://doi.org/10.1016/0031-8914(71)90270-9

Glazunova, V. K., and Gorbunova, K. M., "Spontaneous Growth of Whiskers from Electrodeposited Coatings," Journal of Crystal Growth, vol. 10 no. 1, pp. 85-90, June 1971.

1970: 1 book, 0 theses, and 4 papers on tin whiskers

Levitt, Albert P., Whisker Technology. New York: Wiley-Interscience, 1970. ISBN 471-53150-2.

Davis, Jack H., "Investigation of the Effect of Gravity on the Growth of Crystal Whiskers, Interim report No. 1 Part A," NASA, June 1970.

Kehrer, H.-P., and Kadereit, H. G., "Tracer Experiments on the Growth of Tin Whiskers," Applied Physics Letters, vol. 16 no. 11, pp. 411-412, June 1, 1970.

Key, P. L., "Surface Morphology of Whisker Crystals of Tin, Zinc and Cadmium," Proceedings - 1970 20th Electronic Components Conference, Washington, D. C., May 13-15, 1970, pp. 155-160.

1969: 0 books, 0 theses, and 3 papers on tin whiskers

Furuta, Noboru, and Hamamura, Kenji, "Growth Mechanism of Proper Tin-Whisker," Japanese Journal of Applied Physics, vol. 8 no. 12, pp. 1404-1410, Dec. 1969.

Sines, G., Nakashima, A., and Hanna, W., "Uniformity of composition of alloy whiskers grown from the solid," Scripta Metallurgica, vol. 3 no. 8, pp. 589-590, Aug. 1969.

Stillwell, E. P., Skove, M. J., Overcash, D. R., and Gettys, W. B., "Measurement of the Electron Mean Free Path Using a Bending Effect," Zeitschrift fur Physik B Condensed Matter, vol. 9 no. 1-2, pp. 183-191, Mar. 1969. https://doi.org/10.1007/BF02422551

1968: 0 books, 0 theses, and 2 papers on tin whiskers

Rozen, M., "Practical Whisker Growth Control Methods," Plating, vol. 55 no. 11, pp. 1155-1160, Nov. 1968.

Bouton, G. M., and Bader, W. G., "Migration and Whisker Growths of Tin and Solders Induced on Thin Metal Films by Direct Current and Heat," 1968 Electronic Components Conference , Washington, D. C., May 8-10, 1968, pp. 135-140.

1967: 0 books, 1 thesis, and 4 papers on tin whiskers

"Whisker-free Tin Coatings for Electronic Components," Tin and its Uses , no. 74, pp. 5, 1967.

Smith, J. F., "Whisker Growth on Electrodeposited Tin," Transactions of the Institute of Metal Finishing, vol. 45, pp. 9-11, 1967. https://doi.org/10.1080/00202967.1967.11870012

Fullerton, John G., "Determination of Current Capacity of Small Dimension Wires and Bars," Sixth Annual Reliability Physics Symposium, Los Angeles, CA, Nov. 6-8, 1967, pp. 256.

Ellis, W. C., "Whisker Crystals Grown from Solder Terminations in an Electrotransport Process," Journal of Crystal Growth, vol. 1 no. 4, pp. 204-206, Oct. 1967.

Booth, Bruce Lee, Magnetoresistance Oscillations in Antimony Doped Gray Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1967.

1966: 0 books, 0 theses, and 3 papers on tin whiskers

Berry, R. W., Bouton, G. M., Ellis, W. C., and Engling, D. E., "Growth of Whisker Crystals and Related Morphologies by Electrotransport," Applied Physics Letters, vol. 9 no. 7, pp. 263-265, Oct. 1, 1966.

Ellis, W. C., "Morphology of Whisker Crystals of Tin, Zinc, and Cadmium Grown Spontaneously from the Solid," Transactions of the Metallurgical Society of AIME , vol. 236 no. xx, pp. 872-875, June 1966.

Arnold, S. M., "Repressing the Growth of Tin Whiskers," Plating, vol. 53 no. 1, pp. 16-19, Jan. 1966.

1965: 0 books, 0 theses, and 2 papers on tin whiskers

Powell, B. E., and Skove, M. J., "Elastic Strength of Tin Whiskers in Tensile Tests," Journal of Applied Physics, vol. 36 no. 4, pp. 1495-1496, 1965.

Furuta, Noboru, "Growing Process of Kinked Tin Whiskers" Japanese Journal of Applied Physics, vol. 4 no. 2, pp. 155-156, Feb. 15, 1965.

1964: 0 books, 0 theses, and 4 papers on tin whiskers

"Tin-Nickel Alloy Plating Does Not Grow Whiskers in Five Years," Tin and its Uses, no. 64, pp. 15, 1964.

Coleman, R. V., "The Growth and Properties of Whiskers," Metallurgical Reviews, vol. 9 no. 1, pp. 261-304, 1964. https://doi.org/10.1179/mtlr.1964.9.1.261

Britton, S. C., and Clarke, M., "Effects of Diffusion from Brass Substrates into Electrodeposited Tin Coatings on Corrosion Resistance and Whisker Growth," 6th International Metal Finishing Conference, London, United Kingdom, May 25-29, 1964, pp. 205-211.

Pitt, Charles H., and Henning, Robert G., "Pressure-Induced Growth of Metal Whiskers," Journal of Applied Physics , vol. 35 no. 2, pp. 459-460, Feb. 1964.

1963: 0 books, 0 theses, and 3 papers on tin whiskers

Gilman, J. J., The Art and Science of Growing Crystals. New York: John Wiley & Sons, 1963.

Coble, R. L., "A Model for Boundary Diffusion Controlled Creep in Polycrystalline Materials," Journal of Applied Physics, vol. 34 no. 6, pp. 1679-1682, June 1963.

Glazunova, V. K., and Kudryavtsev, N. T., "An Investigation of the Conditions of Spontaneous Growth of Filiform Crystals on Electrolytic Coatings," Zhurnal Prikladnoi Khimii, vol. 36 no. 3, pp. 543-550, Mar. 1963.

1962: 0 books, 0 theses, and 2 papers on tin whiskers

Lemkey, F. D., and Kraft, R. W., "Tensile Testing Technique for Submicron Specimens," Review of Scientific Instruments, vol. 33 no. 8, pp. 846-849, Aug. 1962.

Glazunova, V. K., "A Study of the Influence of Certain Factors on the Growth of Filamentary Tin Crystals," Soviet Physics - Crystallography, vol. 7, no. 5, pp. 616-618, Mar.-Apr. 1962.

1961: 0 books, 0 theses, and 2 papers on tin whiskers

"Tin-Nickel versus Metal "Whiskers"," Tin and its Uses, no. 52, pp. 8, 1961.

Deshpande, V. T., and Sirdeshmukh, D. B., "Thermal Expansion of Tetragonal Tin," Acta Crystallographica, vol. 14 no. 4, pp. 355-356, Apr. 1961.

1960: 0 books, 0 theses, and 6 papers on tin whiskers

Price, P. B., "On Microcreep in Zinc Whiskers," The Philosophical Magazine: A Journal of Theoretical Experimental and Applied Physics, vol. 5 no. 52, pp. 417-419, 1960. https://doi.org/10.1080/14786436008235860

Rayne, J. A., and Chandrasekhar, B. S., "Elastic Constants of b tin from 4.2°K to 300°K," Physical Review , vol. 120 no. 5, pp. 1658-1663, Dec. 1, 1960. https://doi.org/10.1103/PhysRev.120.1658

Brenner, S. S., "Metal "Whiskers"," Scientific American, vol. 203 no. 1, pp. 64-72, July 1960.

Sines, George, "Filamentary Crystals grown from the Solid Metal," Journal of the Physical Society of Japan, vol. 15 no. 7, pp. 1199-1210, July 1960.

House, D. G., and Vernon, E. V., "Determination of the elastic moduli of tin single crystals, and their variation with temperature," British Journal of Applied Physics, vol. 11 no. 6, pp. 254-259, June 1960.

Meakin, J. D., and Klokholm, E., "Self-Diffusion in Tin Single Crystals," Transactions of the Metallurgical Society of AIME, vol. 218, pp. 463-466, June 1960.

1959: 0 books, 0 theses, and 6 papers on tin whiskers

Arnold, S. M., "The Growth of Metal Whiskers on Electrical Components," Proceedings of Electrical Components Conference, pp. 75-82, 1959.

Rollins Jr., Fred R., "Specimen Holder for Deforming Whiskers in an Electron Microscope," Review of Scientific Instruments, vol. 30, pp. 603-604, 1959.

Fontanella, Ethel L., and DeBlois, R. W., "Techniques for Handling Metallic Whiskers," Review of Scientific Instruments, vol. 30 no. 11, pp. 982, Nov. 1959.

Holmes, E. L., and Winegard, W. C., "Grain Growth in Zone-Refined Tin," Acta Metallurgica, vol. 7 no. 6, pp. 411-414, June 1959.

Fraser, Malcolm J., "A Source of Natural Tin Whiskers," Nature, vol. 183, pp. 670, Mar. 7, 1959. https://doi-org.ezproxy.uky.edu/10.1038/183670a0

Nadgornyi, E. M., Osip'yan, Yu. A., Perkas, M. D., and Rozenberg, V. M., x "Filamentary Crystals with Almost the Theoretical Strength of Perfect Crystals," Soviet Physics Uspekhi, vol. 2 no. 2, pp. 282-304, Feb. 1959.

1958: 0 books, 0 theses, and 7 papers on tin whiskers

Brenner, S. S., "Growth and Properties of "Whiskers"," Science, vol. 128 no. 3324, pp. 569-575, Sept. 12, 1958.

Brenner, S. S., "Properties of Whiskers," Growth and Perfection of Crystals, Cooperstown, NY, Aug. 27-29, 1958, pp. 157-190. (Edited by Doremus, R. H., Roberts, B. W., and Turnbull, David.)

Ellis, W. C., Gibbons, D. F., and Treuting, R. G., "Growth of Metal Whiskers from the Solid," Growth and Perfection of Crystals, Cooperstown, NY, Aug. 27-29, 1958, pp. 102-120. (Edited by Doremus, R. H., Roberts, B. W., and Turnbull, David.)

Nabarro, F. R., N., and Jackson, P. J., "Growth of Crystal Whiskers," Growth and Perfection of Crystals, Cooperstown, NY, Aug. 27-29, 1958, pp. 13-101. (Edited by Doremus, R. H., Roberts, B. W., and Turnbull, David.)

Webb, W. W., "Dislocation Structure of Whiskers," Growth and Perfection of Crystals , Cooperstown, NY, Aug. 27-29, 1958, pp. 230-238. (Edited by Doremus, R. H., Roberts, B. W., and Turnbull, David.)

Smith, H. G., and Rundle, R. E., "X-Ray Investigation of Perfection in Tin Whiskers," Journal of Applied Physics, vol. 29 no. 4, pp. 679-683, Apr. 1958.

Franks, J., "Growth of Whiskers in the Solid Phase," Acta Metallurgica, vol. 6 no. 2, pp. 103-109, Feb. 1958.

1957: 0 books, 0 theses, and 6 papers on tin whiskers

Treuting, R. G., and Arnold, S. M., "Orientation Habits of Metal Whiskers," Acta Metallurgica, vol. 5 no. 10, pp. 598, Oct. 1957.

Bradley, D. E., Franks, J., and Rush, P. E., "Electron Microscopy of Tin Whiskers using Carbon Replicas," Proc. Phys. Soc. B, vol. 70 no. 9, pp. 889-892, Sept. 1, 1957. https://doi.org/10.1088/0370-1301/70/9/412

Brenner, S. S., and Morelock, C. R., "Cross Sectioning of Whiskers," Review of Scientific Instruments, vol. 28 no. 8, pp. 652-653, Aug. 1957.

Baker, G. S. "Angular Bends in Whiskers," Acta Metallurgica, vol. 5 no. 7, pp. 353-357, July 1957.

Roberts, E. C., and Lawrence, S. C., "Whisker-on-whisker Growth," Acta Metallurgica, vol. 5 no. 6, pp. 335, June 1957.

Treuting, R. G., "Torsional Strain and the Screw Dislocation in Whisker Crystals," Acta Metallurgica, vol. 5 no. 3, pp. 173-175, Mar. 1957.

1956: 0 books, 0 theses, and 9 papers on tin whiskers

Arnold, S. M., and Koonce, S. Eloise, "Filamentary Growths on Metals at Elevated Temperatures," Journal of Applied Physics, vol. 27 no. 8, pp. 964, 1956.

Brenner, S. S., "Tensile Strength of Whiskers," Journal of Applied Physics, vol. 27 no. 12, pp. 1484-1491, Dec. 1, 1956.

Hirsch, Peter B., "X-ray Experiments on Tin Whiskers," Dislocations and Mechanical Properties of Crystals, Lake Placid, Sept. 6-8, 1956, pp. 545-547.

Newkirk, Arthur E., "Hardness of Substances in the Ideal State," Science, New Series, vol. 124 no. 3213, pp. 172-173, July 27, 1956.

"Metal Whiskers," Science, New Series, vol. 123 no. 3209, pp. 1165, June 29, 1956.

Arnold, S. M., "The Growth and Properties of Metal Whiskers," Proceedings of the 43rd Annual Convention of the American Electroplaters Society, Washington, June 17-21, 1956, pp. 26-31.

Brenner, S. S, and Sears, G. W, "Mechanism of Whisker Growth - III Nature of Growth Sites," Acta Metallurgica, vol. 4 no. 3, pp. 268-270, May 1956.

Franks, J., "Metal Whiskers," Nature, vol. 177 no. 4517, pp. 984, May 26, 1956.

Thomas, E. E., "Tin Whisker Studies, Observation of Some Hollow Whiskers and Some Sharply Irregular External Forms," Acta Metallurgica, vol. 4 no. 1, pp. 94, Jan. 1956.

1955: 0 books, 1 thesis, and 6 papers on tin whiskers

Prasad, S. C., and Wooster, W. A., "The Study of the Elastic Constants of White Tin by Diffuse X-ray Reflexion," Acta Crystallographica, vol. 8 no. 11, pp. 682-686, Nov. 1955.

Levy, Paul W., and Kammerer, Otto F., ""Spiral Polygon" Tin Whiskers," Journal of Applied Physics, vol. 26 no. 9, pp. 1182-1183, Sept. 1955.

Kohnke, Elton Everett, Electrical Conductivity, Magnetoresistance, and Hall Effect in Gray Tin Filaments. Ph. D. Thesis for Northwestern University, Evanston, IL, July 1955.

"Tin "Whiskers" Studied at Very Low Temperature," The Science News-Letter, vol. 67 no. 21, pp. 326, May 21, 1955.

Hasiguti, R. R., "A Tentative Explanation of the Accelerated Growth of Tin Whiskers," Acta Metallurgica, vol. 3, no. 2, pp. 200-201, Mar. 1955.

Nicholas, J. F., "The Mechanisms of Self-diffusion in Tin," Acta Metallurgica, vol. 3 no. 2, pp. 178-181, Mar. 1955.

Lutes, O. S., and Maxwell, E., "Superconducting Transitions in Tin Whiskers," Physical Review, vol. 97 no. 6, pp. 1718-1720, Mar. 15, 1955. https://doi.org/10.1103/PhysRev.97.1718

1954: 0 books, 0 theses, and 4 papers on tin whiskers

Arnold, S. M., "A hidden cause of failure in electronic equipment: Metal Whiskers," Electrical Manufacturing, vol. xx no. x, pp. 110-114, Nov. 1954.

Fisher, R. M., Darken, L. S., and Carroll, K. G., "Accelerated Growth of Tin Whiskers," Acta Metallurgica, vol. 2 no. 3, pp. 368-369,371-373, May 1954.

Turnbull, D., and Hoffman, R. E., "The Effect of Relative Crystal and Boundary Orientations on Grain Boundary Diffusion Rates," Acta Metallurgica, vol. 2 no. 3, pp. 419-426, May 1954.

Koonce, S. Eloise, and Arnold, S. M., "Metal Whiskers," Journal of Applied Physics, vol. 25 no. 1, pp. 134-135, Jan. 1954.

1953: 0 books, 0 theses, and 3 papers on tin whiskers

Frank, F. C., "On Tin Whiskers," The Philosophical Magazine, vol. 44 Seventh Series no. 355, pp. 854-860, Aug. 1953. https://doi.org/10.1080/14786440808520351

Eshelby, J. D., "A Tentative Theory of Metallic Whisker Growth," Physical Review, vol. 91 no. 3, pp. 755-776, Aug. 1, 1953. https://doi.org/10.1103/PhysRev.91.755.2

Koonce, S. Eloise, and Arnold, S. M., "Growth of Metal Whiskers," Journal of Applied Physics, vol. 24 no. 3, pp. 365-366, Mar. 1953.

1952: 0 books, 0 theses, and 1 paper on tin whiskers

Herring, Conyers, and Galt, J. K., "Elastic and Plastic Properties of Very Small Metal Specimens," Physical Review, vol. 85 no. 6, pp. 1060-1061, Mar. 15, 1952. https://doi.org/10.1103/PhysRev.85.1060.2

1951: 0 books, 0 theses, and 3 papers on tin whiskers

Dienes, G. J., "On the Volume Diffusion of Metals," Journal of Applied Physics, vol. 22 no. 6, pp. 848-849, 1951.

Compton, K. G., Mendizza, A., and Arnold, S. M., "Filamentary Growths on Metal Surfaces - "Whiskers"," Corrosion , vol. 7 no. 10, pp. 327-334, Oct. 1951.

Hoffman, R. E., and Turnbull, D., "Lattice and Grain Boundary Self-Diffusion in Silver," Journal of Applied Physics, vol. 22 no. 5, pp. 634-639, May 1951.

1948-1950: 0 books, 0 theses, and 1 paper on tin whiskers

Herring, Conyers, "Diffusional Viscosity of a Polycrystalline Solid," Journal of Applied Physics, vol. 21 no. 5, pp. 437-445, May 1950.

1947: 0 books, 0 theses, and 1 paper on tin whiskers

Hunsicker, H. Y., and Kempf, L. W., "Aluminum Alloys for Bearings," SAE Quarterly Transactions, vol. 1 no. 1, pp. 6-26, Jan. 1947.

1945-1946: 0 books, 0 theses, and 0 papers on tin whiskers

1944: 0 books, 0 theses, and 2 papers on tin whiskers

Kronsbein, John, and Smart, Alan, "Electro-Plating on Wire," Transactions of the IMF, vol. 20 no. 1, pp. 31-38, 1944. https://doi.org/10.1080/00202967.1944.11869428

Onderdonk, I. M., "Short-Time Current Required to Melt Copper Conductors," Electrical World, vol. 121 no. 26, pp. 98, June 24, 1944.

1889-1943: 0 books, 0 theses, and 0 papers on tin whiskers

1888: 0 books, 0 theses, and 1 paper on tin whiskers

Preece, W. H., "On the Heating Effects of Electric Currents. No. III," Proceedings of the Royal Society of London, vol. 44, pp. 109-111, Apr. 19, 1888.

1887: 0 books, 0 theses, and 1 paper on tin whiskers

Preece, William Henry, "On the Heating Effects of Electric Currents. No. II," Proceedings of the Royal Society of London, vol. 43, pp. 280-295, Dec. 22, 1887.

1885-1886: 0 books, 0 theses, and 0 papers on tin whiskers

1884: 0 books, 0 theses, and 1 paper on tin whiskers

Preece, William Henry, "On the Heating Effects of Electric Currents," Proceedings of the Royal Society of London, vol. 36, pp. 464-471, Apr. 3, 1884.

I would like to thank David Hillman for contributing to this study.

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Last revised February 5, 2021