Tin Whisker Group Teleconferences

John R. Barnes
October 18, 2016
jrbarnes@iglou.com

The Tin Whisker Group is an informal, nationwide network of engineers and researchers who are interested in:

Most of our members are or have been involved in the development and manufacturing of high-reliability electronics for manned spacecraft, satellites, rockets, missiles, airplanes, automobiles, medical devices, etc.

We hold a teleconference (telecon) almost every Wednesday, starting at 11:00am Eastern Time (10:00am Central Time, 9:00am Mountain Time, 8:00am Pacific Time) and usually lasting 2+ hours. We try to have one or two technical presentations each month by experts on tin whiskers and related topics. If one or more of our members has recently attended a conference, symposium, or other meeting that concerns tin whiskers, they share the most important non-confidential results from the meeting with us. Then we finish with a general discussion of tin whisker-related subjects.

To join the Tin Whisker Group, please contact Bill Rollins, who founded and is the Moderator of the Group.

The following documents have been provided by Tin Whisker Group members as background information on tin whiskers.
Date Member Document
April 6, 2016 Tetsuya Ima Yamaha Revs Your Heart
February 10, 2016 Diana Shvydka and V. G. Karpov Surface parameters determining a metal propensity for whiskers
May 6, 2015 Tom Woodrow Keyence VK-9700 3D Laser Confocal Microscope
December 1, 2015 John Barnes Bibliography for Tin Whiskers

 

Since late 2010/early 2011, the Tin Whisker Group has had numerous discussions about the likelihood of tin whiskers causing at least some of the Sudden Unintended Acceleration (SUA) problems with Toyota cars and trucks. Many of our members own and drive Toyota vehicles, so we have a personal interest in:

Several of our members, who work for the National Aeronautics and Space Administration (NASA), were involved in the National Highway Traffic Safety Administration (NHTSA) investigation of Toyota SUA problems. Several other members have been and are currently Expert Witnesses in lawsuits against car manufacturers for Unintended Acceleration problems. Dr. Antony F. Anderson, a consultant in the United Kingdom (UK), recently joined the group. He has been investigating Unintended Acceleration problems with various manufacturers' vehicles for over 8 years. Antony has written the following reports on Unintended Acceleration problems around the world:

Below is a nearly-complete list of presentations that have been made to the Tin Whisker Group since I joined in December 2008, compiled from my saved E-mails on the subject. Unfortunately, this folder exceeded 2.15GB a couple of weeks ago, trashing both the copy on my computer and the back-up copy on a flash drive. To recover from this problem, I had to restore the folder from a back-up DVD dated December 25, 2013. Therefore my list of presentations for the first quarter of 2014 may be incomplete. I also had a major computer crash a few years ago, and may have lost some E-mails then. So, if you have any additions or corrections to this web page, please E-mail them to me at jrbarnes@iglou.com, and I will acknowledge your contribution at the bottom of the web page.

tin whisker mitigation
Date Presenter Presentation
October 12, 2016 Jonathan Harris The Impact of Plated Layer Contamination on Semiconductor Assembly: A Failure Analysis Perspective (part 1)

The Impact of Plated Layer Contamination on Semiconductor Assembly: A Failure Analysis Perspective (part 2)

CMC Laboratories, Inc.

September 7, 2016 Stephan J. Meschter Strategic Environmental Research and Development Program (SERDP) Nanoparticle enhanced conformal coating project: Coating modeling for tin whisker mitigation (presentation)

Strategic Environmental Research and Development Program (SERDP) Nanoparticle enhanced conformal coating project: Coating modeling for tin whisker mitigation (paper)

August 24, 2016 Stephan J. Meschter Enabling Lead-free in the DoD through Risk Mitigation: Program Management and Systems Engineering Overview
June 15, 2016 &
June 22, 2016
Gordon Davy Preventing Tin Whisker Growth Risk (.pdf)
Preventing Tin Whisker Growth Risk (.pps)
Preventing Tin Whisker Growth Risk Rev. A (.pps)
June 1, 2016 Steve Smith,
Bill Rollins
The Whisker-Tough Conformal Coating: A Certain Solution to an Uncertain Problem
Engineering Requirements for a Tin-Whisker-Risk-Controlling Conformal Coating to be used in a Missile
Tin whisker captivation by the Whisker-Tough Magnum conformal coating
Effects of Conformal Coat on Tin Whisker Growth
May 18, 2016 David Pinsky Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow
May 11, 2016 Indranath Dutta,
Bhaskar Majumdar
Influence of Indium Addition on Whisker Growth in Electroplated Tin
Rationale for the Auger Studies
December 9, 2015 Eric Chason and Fei Pei Sn whisker formation as a stress-induced nucleation and growth process
November 11, 2015 Victor Karpov Verifying the electrostatic theory of whiskers
October 21, 2015 Victor Karpov Electric field stimulated growth of Zn and Sn whiskers
April 8, 2015 &
April 15, 2015
Victor Karpov Understanding the movements of metal whiskers (presentation),
Understanding the movements of metal whiskers (paper)
January 28, 2015 & February 4, 2015 Carol Handwerker Handwerker Purdue update January 2015

December 3, 2014 Stephan Meschter 2009-mccormack-whisker-bridging-assessment.pdf

meschter mckeown 2014 modeling Whisker group 2014-11-13.pptx

TQFP128 example-whisker calculator 2014-11-13.docx

Whisker_Risk_Model_3_2.xls

November 12, 2014 Stephan Meschter and Polina Snugovsky Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Tin Whisker Growth on SAC305 Assemblies and Risk Modeling
  Joe Smetana iNEMI Tin Whisker Projects: Test Development, Risk Mitigation, and Fundamental Theory Development
October 15, 2014 Anthony Vasko Rapid Growth of Whiskers in Evaporated Tin Films Under Influence of Electric Field
Aug. 27 & Sept. 3, 2014 Victor Karpov Electrostatic Theory of Metal Whiskers

Backup information:
Electrostatic theory of metal whiskers
New Theory Explains Mysterious Growth of Metal Strands
Secret of `Metal Whiskers' in Electronics Finally Revealed?
ScienceShot: How to Shave Metal Whiskers
Tiny hairy metals threaten technology, but science holds the solution

June 18, 2014 Gordon Davy Evaluating Moisture and Corrosion Risk in Hermetic Packages
Feb. 12, 2014 Tom Donnelly Design for Reliability Guidelines
Nov. 20, 2013 Dave Hillman An Investigation into the Tin Pest Phenomena: 3 Years and Counting
Nov. 6, 2013 Nik Chawla In situ Mechanical Testing of Sn Whiskers
May 8, 2013 Eric Chason Correlating Whisker/Hillock Growth with Compressive Stress in Sn during Thermal Cycling
Apr. 24, 2013 Jeff Montgomery AEM, Inc.
Mar. 6, 2013 Dave Hillman, and
Tom Lesniewski
An Investigation of Whisker Growth on Tin Coated Wire and Braid
Feb. 13, 2013 David Pinsky Lead-Free and Supply Chain Manangement for High Reliability Systems
Jan. 30, 2013 Carol Handwerker Tin Whisker Formation: A Predictive Model Based on Local Microstructure and Grain Boundary Properties
Jan. 23, 2013 Tony Rafanelli Dependable Electronics with Lead-Free Components/Systems Overview
Jan. 16, 2013 Tony Rafanelli Dependable Electronics with Lead-Free Components/Systems Overview
Jan. 9, 2013 Don Susan Tin Whisker Work at Sandia National Laboratories
Nov. 6, 2012 Don Tyler Robotic Hot Solder Dip for Prevention of Tin Whiskers and Weak Solder Joints
July 25, 2012 Stephan Meschter SERDP Tin Whisker Testing and Modeling: Low Stress Conditions
July 11, 2012 Michael Osterman CALCE Whisker Research
June 6, 2012 Jeff Chinn IST Super-Hydrophobic ALD Coatings
May 16, 2012 Andrew D. Kostic The Aerospace Corporation Lead-Free Working Group (LFWG)
Apr. 25, 2012 Mike Bozack Research Activities in Surface Physics
Mar. 21, 2012 Mike Bozack Research Activities in Surface Physics
Mar. 7, 2012 Joe Smetana Variations in Thermal Cycling Response of Pb-free Solder Due to Isothermal Preconditioning
Feb. 29, 2012 Joe Smetana HDPUG Pb-Free Board Materials Reliability Project 2: Moisture Sensitivity and Its Effect on Delamination
Feb. 22, 2012 Eric Chason Real-Time Study of Whisker/Hillock Formation in Sn-Cu Systems by EBSD Characterization
Feb. 15, 2012 Michael J. Bozack Research Activities in Surface Physics
Feb. 8, 2012 Joe Smetana The Effects of Lead-Free Reflow On Conductive Anodic Filament (CAF) Performance of Materials
Feb. 1, 2012 Nik Chawla Overview of Pb-free Solder Research Activities
Jan. 25, 2012 Gordon Davy Tin-Whisker-Impenetrable Metal Cap Process for Electronic Assemblies: An Analysis of Cap TW Penetrability and Prevention vs. Mitigation
Jan. 18, 2012 Joe Smetana A Standard Multilayer Printed Wiring Board for Material Reliability Evaluations
Jan. 18, 2012 Joe Smetana Reliability Testing of PWB Plated through Holes in Air-to-Air Thermal Cycling and Interconnect Stress Testing after Pb-free Reflow Preconditioning
Jan. 11, 2012 Michael Osterman Assessment of Tin Whisker Mitigation for Conformally Coated SnPb Assemblies
Dec. 21, 2011 Gordon Davy Tin-Whisker-Impenetrable Metal Cap Process for Electronic Assemblies: An Analysis of Cap TW Penetrability and Prevention vs. Mitigation
Dec. 7, 2011 Gordon Davy Tin-Whisker-Impenetrable Metal Cap Process for Electronic Assemblies: An Analysis of Cap TW Penetrability and Prevention vs. Mitigation
Nov. 16, 2011 Gordon Davy Tin-Whisker-Impenetrable Metal Cap Process for Electronic Assemblies: An Analysis of Cap TW Penetrability and Prevention vs. Mitigation
Nov. 9, 2011 Gordon Davy Tin-Whisker-Impenetrable Metal Cap Process for Electronic Assemblies: An Analysis of Cap TW Penetrability and Prevention vs. Mitigation
Nov. 2, 2011 Gordon Davy Tin-Whisker-Impenetrable Metal Cap Process for Electronic Assemblies: An Analysis of Cap TW Penetrability and Prevention vs. Mitigation
Oct. 26, 2011 Nicholas Clore Identification and Counting Procedure for Tin Whiskers, Hillocks, and Other Surface Defects
Oct. 19, 2011 Gordon Davy Tin-Whisker-Impenetrable Metal Cap Process for Electronic Assemblies: An Analysis of Cap TW Penetrability and Prevention vs. Mitigation
Oct. 12, 2011 Jay Brusse Electrical Failure of an Accelerator Pedal Position Sensor Caused by a Tin Whisker and Discussion of Investigative Techniques Used for Whisker Detection
Aug. 31, 2011 Andrew D. Kostic Lead-free Electronics Reliability - An Update
Aug. 24, 2011 Andrew D. Kostic Lead-free Electronics Reliability - An Update
Aug. 10, 2011 Joe Smetana Pb-free Solder Joint Reliability in a Mildly Accelerated Test Condition
July 27, 2011 Joe Smetana The Effects of Non-filled Microvia in Pad on Pb-free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal Cycling
July 13, 2011 Steve Smith Fluid Physics
June 22, 2011 Dave Gilbert Toyota Sudden Unintended Acceleration
May 11, 2011 Tom Hester Tin Whisker Self-Mitigation in Surface Mount Components
Mar. 23, 2011 Bill Vuono Cleaning Fluid Entrapment under Vented Flip Chip Packages
Feb. 23, 2011 Fred Verdi Susceptibility Testing for Tin Whiskers
Feb. 16, 2011 John Osenbach Creep and It's Affect on Sn Whisker Growth
Feb. 9, 2011 John Osenbach Creep and It's Affect on Sn Whisker Growth
Jan. 26, 2011 Anduin Touw GEIA-HB-0005-4 Guidelines for Performing Reliability Assessment for Pb Free Assemblies used in Aerospace and High-Performance Electronic Applications
Jan. 19, 2011 Anduin Touw GEIA-STD-0005-2 Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems, Rev A draft 1/5/11
Dec. 22, 2010 Henning Leidecker Metal Vapor Sparking and Arcing
Dec. 8, 2010 Steve Smith,
Bill Rollins, and
Charlie Minter
The Whisker-Tough Conformal Coating: A Certain Solution to an Uncertain Problem
Nov. 17, 2010 Gordon Davy Can Method 1018 Test Results Indicate Corrosion Risk?
Nov. 3, 2010 Eric Chason How do whiskers and hillocks grow in Pb-free Sn coatings?
Oct. 20, 2010 Tom Woodrow Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy, Part III
Oct. 13, 2010 Terry Munson Flip-Chip BGA Fluid Entrapment and Mask Porosity Problems
Oct. 6, 2010 Terry Munson Lidded FCBGA Fluid Entrapment and Mask Porosity
Sept. 22, 2010 David Pinsky Application-Specific Tin Whisker Risk Assessment Algorithm- Update 2010
Sept. 8, 2010 Bob Landman,
Gordon Davy, and
Denny Fritz
Whisker-Impenetrable Selective Metal Cap Process for Electronic Assemblies
Aug. 18, 2010 Gordon Davy OEMs' Pb-free and Tin Whisker Options - Prevention vs. "Mitigation"
June 16, 2010 Pylin Sarobol The Effects of Local Film Properties on Whisker and Hillock Growth on Sn, Sn-Cu and Sn-Cu-Pb Electroplated Films
June 9, 2010 Aaron E. Pedigo Understanding Fundamental Tin Whisker Growth Mechanisms by Characterizing Film Properties
May 26, 2010 Tom Woodrow Composition of Tin Whiskers on Tin-Plated Brass
May 26, 2010 Mike Bozack (tin whiskers growing on thin film tin over a zinc substrate)
May 19, 2010 S. Meschter Lead-to-lead spacing considerations a part of a comprehensive 2B tin whisker mitigation strategy
April 10, 2010 Tom Lesniewski Assessment of Whisker Growth from Tin Coated Wire and Cable
Mar. 31, 2010 Lyudmyla Panashchenko Plating Dendrite Formations on Sn plating
Jan. 27, 2010 John Osenbach,
Maureen Williams,
Carol Handwerker, and
George Galyon
Sn Whiskers
Jan. 20,2010 Lyudmyla Panashchenko Evaluation of Environmental Tests for Tin Whisker Assessment
Dec. 9, 2009 Tom Woodrow Effects of Pb on the Diffusion of Tin within Tin Platings
Dec. 2, 2009 Jim Blanche Leadfree Technology Experiment in a Space Environment
Nov. 18, 2009 Lyudmyla Panashchenko Fat Metal Whiskers
July 22, 2009   Some Examples of "Whiskers" from Tin-Based Alloys
July 15, 2009 Stephan Meschter A Probabilistic Assessment of Component Lead-to-Lead Tin Whisker Bridging
July 8, 2009 Eric Chason Sn whisker formation: relationship between intermetallic formation, stress and whisker nucleation
June 24, 2009 Kurt Kessel NASA-DoD Lead-Free Electronics Project
June 10, 2009 Joe Smetana iNEMI Recommendations on Lead Free Finishes for Components Used in High-Reliability Products
May 13, 2009 Joe Smetana Theory of Tin Whisker Growth "The End Game"
Apr. 29, 2009   The Fusing of Wires and Tin Whiskers
Apr. 22, 2009   The Fusing of Wires and Tin Whiskers
Feb. 25, 2009 Peter Borgesen Lead-Free Solder Joint Reliability Oxymoron? (I like it, but ...)
Feb. 18, 2009 Gordon Davy Interfacial Layer Growth Kinetics
Jan. 28, 2009 Karim Courey Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part I
Dec. 17, 2008 Stephan Meschter Effect of hot solder dipping on part stresses
Last revised October 18, 2016