AMPACITY (CURRENT-CARRYING CAPACITY) OF PRINTED CIRCUIT BOARDS- Bibliography

AMPACITY (CURRENT-CARRYING CAPACITY) OF PRINTED CIRCUIT BOARDS
Bibliography

This web site is being maintained by John R. Barnes, who was the President and Chief Engineer of dBi Corporation from 2002 to September 30, 2013, when we closed because ObamaCrap made it too expensive for us to remain in business.

John R. Barnes KS4GL, PE, NCE, NCT, ESDC Eng, ESDC Tech, PSE, Master EMC Design Engineer, SM IEEE
December 31, 2010
jrbarnes@iglou.com

BOOKS:

[1] Baker, D., Koehler, D. C., Fleckenstein, W. O., Roden, C. E., Sabia, R., Physical Design of Electronic Systems volume IV: Design Process . Prentice-Hall, Englewood Cliffs, NJ, 1972.

[2] Beaty, H. Wayne, Electrical Engineering Materials Reference Guide. McGraw-Hill, New York, 1990.

[3] Clark, Raymond H., Printed Circuit Engineering. Van Nostrand Reinhold, New York, 1989.

[4] Classon, Frank, Surface Mount Technology for Concurrent Engineering and Manufacturing. McGraw-Hill, New York, 1993.

[5] Cook, Jesse S. III, Printed Circuit Design and Drafting. Tad Institute, Cambridge, MA, 1967.

[6] Coombs, Clyde F. Jr., Multilayer and Flexible Circuits. McGraw-Hill, New York, 1990.

[7] Coombs, Clyde F. Jr., Printed Circuits Handbook 3rd ed.. McGraw-Hill, New York, 1988.

[8] Einarson, Norman S., Printed Circuit Technology. 1977.

[9] Ginsberg, Gerald L., Printed Circuits Design. McGraw-Hill, New York, 1991.

[10] Harper, Charles A., Electronic Packaging and Interconnection Handbook 3rd ed.. McGraw-Hill, New York, 2000.

[11] Harper, Charles A., Handbook of Electronic Packaging. McGraw-Hill, New York, 1969.

[12] Harper, Charles A., Handbook of Materials and Processes for Electronics. McGraw-Hill, New York, 1970.

[13] Harper, Charles A., Handbook of Wiring, Cabling, and Interconnecting for Electronics. McGraw-Hill, New York, 1972.

[14] Johnson, Howard W., and Graham, Martin, High-Speed Digital Design. Prentice Hall, Upper Saddle River, NJ, 1993.

[14a] Laverghetta, Thomas, Microwave Materials & Fabrication Techniques 2nd ed, Artech House, Boston, 1991.

[15] Leonida, Giovanni, Handbook of Printed Circuit Design, Manufacture, Components & Assembly. Electrochemical Publications, 1981.

[16] Lindsey, Darryl, The Design & Drafting of Printed Circuits . McGraw-Hill, New York, 1979.

[17] Lund, Preben, Generation of Precision Artwork for Printed Circuit Boards. John Wiley & Sons, New York, 1978.

[18] Matisoff, Bernard S., Wiring and Cable Designer's Handbook . TAB, 1987.

[19] Prasad, Ray P., Surface Mount Technology, Van Nostrand Reinhold, New York. 1989.

[20] Scarlett, J. A., An Introduction to Printed Circuit Board Technology. Electrochemical Publications, 1984.

[21] Scarlett, J. A., The Multilayer Printed Circuit Board Handbook . Electrochemical Publications, 1985.

[22] Scarlett, J. A., Printed Circuit Boards for Microelectronics . Electrochemical Publications, 1980.

[23] Villanucci, Robert S., Avtgis, Alexander W., and Megow, William F., Electronic Techniques. Prentice-Hall, Engelwood Cliffs, NJ, 1986.

[23a] Wadell, Brian C., Transmission Line Design Handbook, Artech House, Boston, 1991.

REPORTS/STANDARDS:

[24] IPC, Controlled Impedance Circuit Boards and High Speed Logic Design, IPC-2141, IPC, Northbrook, IL, April 1996.

[25] IPC, Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques, IPC-D-317A, IPC, Northbrook, IL.

[26] IPC, Generic Standard on Printed Circuit Board Design, IPC-2221, IPC, Northbrook, IL, February 1996.

[27] IPC, Metal Foil for Printed Wiring Applications, IPC-MF-150F, IPC, Northbrook, IL, October 1991.

[28] IPC, Metal Foil for Printed Wiring Applications, Amendment 1, IPC-MF-150F, IPC, Northbrook, IL, August 1992.

[29] IPC, Sectional Design Standard for Rigid Organic Printed Boards , IPC, Northbrook, IL, February 1998.

[30] IPC, Specification for Base Materials for Rigid and Multilayer Printed Boards, IPC, Northbrook, IL, December 1997.

[31] Department of Defense, Military Standard Flexible and Rigid-Flex Printed-Wiring for Electronic Equipment Design Requirements for , MIL-STD-2118, 4 MAY 1984. (download from http://www.dodssp.daps.mil/)

[32] Department of Defense, Military Standard Printed Wiring for Electronic Equipment, MIL-STD-275E, 31 December 1984. (download from http://www.dodssp.daps.mil/)

[33] Department of Defense, Military Specification Sheet, Printed Wiring Board General Specification for (and slash sheets), MIL-S-13949H Amendment 1, 30 September 1993. (download from http://www.dodssp.daps.mil/)

PAPERS, APPLICATION NOTES, MAGAZINE ARTICLES, REPORTS, AND WEB PAGES:

[34] "Ampacities and Mechanical Properties of Rectangular Copper Bus Bars." (download from http://busbar.copper.org/ampacity/busbar.htm)

[35] "Bishop Graphics Printed Circuit Drafting Technical Manual & Catalog 107A," 1985.

[36] "Bus Bar Electrical Ampacity Charts." (download from http://www.stormcopper.com/design/ampacity.htm)

[37] "Busbar Design Copper Specifications." (download from http://www.stormcopper.com/design/prod01.htm)

[38] "Bussco Laminated Bus Bars Design Guide."

[39] "CDA Bus Bar Sizing Guide." (download from http://busbar.copper.org/ampacity/busT1.htm)

[40] "Copper Specifications." (downloaded from http://www.stormcopper.com/design/prod01.htm)

[41] "Current Carrying Capacity of Flex-Circuit Conductors," Minco Application Aid No. 23, 1991.

[42] "DC Line Resistance and Current Carrying Capacity." (download from http://www.merix.com/resourcecntr/tech/dc_line.doc)

[43] "Design Criteria." (download from http://www.atlee.com/BusBars_DesignCriteriaMain.asp)

[44] "Electrodeposited vs. Rolled Copper." (download from http://www.merix.com/main_res.html)

[45] "Electronic Substrates." (download from http://www.arlonmed.com/page2.htm)

[46] "Flex-Circuit Design Guide," Minco Application Aid #24, March 2000. (download from http://www.minco.com/pdf/aa24.pdf)

[47] "General Tables." (download from http://www.tridentalloys.com/impalloy/tablcond.htm)

[48] "High-Speed Board Design Techniques," Vantis, publication 16356, August 1997. (download from http://cselab.snu.ac.kr/course/cad99/highspeed.pdf)

[49] "IBM Design Guide Electronic Packaging," IBM ZZ45-4016-1.

[50] "IBM Engineering Specification 899279, Printed Wiring Board PTH/SMT Specification Raw Carrier Specification."

[51] "IBM Materials, Finshes & Processes," IBM C-P 0-0205-001, Jan. 1997.

[52] "IMT Busbar Tables." (download from http://www.imtp.com/stables.htm)

[53] "Insulating Laminate." (download from http://www.swecomica.com/)

[54] "IPC Workshop High Speed Design," IPC, 1997.

[55] "Lexmark Electronics Electronic Card/Panel Design Guideline Version 1.1."

[56] "Lexmark International, Incorporated 43H2362 Engineering Specification Printed Wirinf Board (PWB)," 23 May 1996.

[57] "Main Power Distribution Bus Bars," Eldre.

[58] "Manufacturing Capabilities." (downloaded from http://www.microtech-group.ltd.uk/capabilities.html)

[59] "Material Specifications for Printed Circuit Boards (Sliderule)," Dynacircuits, 1985.

[60] "Materials," Jet Technologies. (download from http://www.gojet.com/material.htm)

[61] "Mecondor Bus Bars."

[62] "Mini-bus and Q-Pac Bus Bars," Circuit Components.

[63] "M824/825 Mini/Bus Printed Circuit Busbars," Rogers. (download from http://www.rogers-corp.com/nv/m824.htm)

[64] "Novaclad(R) Designing with a New Class of Materials," Sheldahl.

[65] "PCB Design Information." (download from http://www.aracnet.com/~gpatrick/pcb.html)

[66] "Polyclad Laminates," Polyclad. (download from http://www.polyclad-usa.com/laminates/products/index.shtml#high)

[67] "Polyclad Product Guide," Polyclad. (downloaded from http://www.polyclad-usa.com/polycld3.htm)

[68] "Power Distribution on the PCB," Eldre.

[69] "Power Distribution Solutions from Eldre," Eldre.

[70] "Power Distribution with Noise Control and without Decoupling Capacitors," Eldre.

[71] "Solving High-Current Design Problems with Ultra-Thick Copper." (downloaded from http://www.upeinc.com/copper_pc.htm)

[72] "Specifications," Jet Technologies. (downloaded from http://www.gojet.com/specifications.htm)

[73] "Thermal & Reliability Study on High Current Thermal Vias & Output Pins," Synqor Application Note 00-08-01. (download from http://www.synqor.com/pdf/appnt_Thermal_Relief_Study.pdf)

[74] "Thermal Relief Vias," Synqor Application Note 00-06-1.

[75] "Trace Width Calculations."

[76] "Using the IPC Temperature Charts," UltraCAD. (download from http://www.ultracad.com/using_ipc_temp_charts.pdf)

[77] APeder01, "Re: ...copper foil thickness...," TechNet archive #018517, 26 Mar 1998. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9803&L=TechNet&P=R33036&I=-3)

[78] Bell, Les, "Re[2]:Heavy Metal! - The Book," DesignerCouncil archive, 15 Apr 1996. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind96&L=DesignerCouncil&P=R13983&I=-3)

[79] Beltz, Walter, personal communication, August 10, 1999.

[80] Brooks, Douglas, and Graves, Dave, "Current Carrying Capacity of Vias," 2002. (download from http://www.ultracad.com/viacurrent.pdf)

[81] Brooks, Doug. "Fusing Current: When Traces Melt Without a Trace," Printed Circuit Design, vol. 15 no. 12, pp. 53, December 1998. (download from http://www.ultracad.com/fusing.pdf)

[82] Brooks, Doug, "How to Gauge Traces," Printed Circuit Design , vol. no., pp., January 2001. (download from http://www.ultracad.com/wiregauge.pdf)

[83] Brooks, Douglas, "Temperature Rise in PCB Traces," PCB Design Conference, West, March 23-27, 1998. (download from http://www.ultracad.com/pcbtemp.pdf)

[84] Buetow, Mike, "Air and Space: Voltage Behavior Gets a New Look," PC Fab, vol. 23 no. 11, pp. 8-12, November 2000.

[85] Buetow, Mike, "Re: current vs trace width graphs," DesignerCouncil archive #1600, 17 SEP 1997. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9709&L=DesignerCouncil&P=R8730&I=-3)

[86] Campbell, Larry. "Thermal relief not sufficient for current -Reply," DesignerCouncil archive #002810, 22 Jun 1998. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9806&L=DesignerCouncil&P=R4523&I=6)

[86a] Coneybeer, Robert T., Black, W. Z., and Bush, R. A., "Steady-State and Transient Ampacity of Bus Bar," IEEE Transactions on Power Delivery , vol. 9 no. 4, pp. 1822-1829, Oct. 1994.

[87] Dimino,Christopher A., Dodballapur, Ravi, and Pomes, James A., "A Low Inductance, Simplified Snubber, Power Inverter Implementation," HFPC, pp. 502-509, April 1994 Proceedings.

[88] Doeling, Wally, "Question on design of heat-reliefs," DESIGNERCOUNCIL archive, 15 Dec 95. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind95&L=DesignerCouncil&P=R20525&I=-3)

[89] Doeling, Wally, "Re: Design: vias: current carrying capability," TechNet archive #016140, 19 Dec 1997. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9712&L=TechNet&P=R28223&I=-3)

[90] Ferrari, Gary, "Re: Re[2] - heavy copper...," DesignerCouncil archive, 18 Apr 1996. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind96&L=DesignerCouncil&P=R14927&I=-3)

[91] Ferrari, Gary, "Re: DES: Current Through Vias," TechNet archive #003916, 25 Jun 1996. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind96&L=TechNet&P=R172115&I=-3)

[92] Ffitch, Clive, "Re: DES: Current carrying capacity of innerlayer planes," TechNet archive #011117, 19 May 97. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9705&L=TechNet&P=R22418&I=-3)

[93] Frank, Frank, "Re: thermal relief not sufficient for current," DesignerCouncil archives #002808, 19 June 1998. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9806&L=DesignerCouncil&P=R4351&I=-3)

[94] Friar, Michael E., and McClurg, Roger H., "Printed Circuits and High Currents," Design News, vol. 23 no. 25, pp. 103-107, December 6, 1968.

[95] Gagnon, Gerald, "Re: Maximum FR4 operating temperature," TechNet archive #019748, 11 May 1998. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9805&L=TechNet&P=R21540&I=-3)

[96] Gentchev, Angel, "Designing high-current VRM-compliant CPU power supplies," EDN, vol. no. 22, pp. 155-158, October 26, 2000.

[97] Gregory, Steve, "Re: Exacta Circuits," TechNet archive #000383, 11 Aug 1995. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind95&L=TechNet&P=R20458&I=-3)

[98] Hersey, Ralph, "DES: RE>Sheet Resistivity of 1 OZ. Copper," TechNet archive #005858, 14 Oct 1996. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind96&L=TechNet&P=R305081&I=-3)

[99] Hersey, Ralph, "FAB- E-Glass Vs S-Glass," TechNet archive #002111, 1 Mar 1996. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind96&L=TechNet&P=R42284&I=-3)

[100] Hersey, Ralph, "FWD>DES/FAB - hole wall thic," TechNet archive #002519, 10 Apr 1996. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind96&L=TechNet&P=R67141&I=-3)

[101] Hersey, Ralph, "FWD>more heavy copper...," TechNet archive #004116, 10 Jul 1996. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind96&L=TechNet&P=R184938&I=-3)

[102] Hersey, Ralph, "FWD>RE>Conductor widths," TechNet archive #002533, 11 Apr 1996. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind96&L=TechNet&P=R68091&I=-3)

[103] Hersey, Ralph, "Re: IPC spec IPC-A-600D," TechNet archive #001984, 21 Feb 1996. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind96&L=TechNet&P=R34835&I=-3)

[104] Hersey, Ralph, "Re: Circuit width and spacing," TechNet archive #015122, 11 Nov 1997. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9711&L=TechNet&P=R20069&I=-3)

[105] Hersey, Ralph, "Re: Current Capacity of vias," TechNet archive #024099, 4 Sep 1998. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9809&L=TechNet&P=R6867&I=-3)

[106] Hersey, Ralph, "Re: current carrying capacity of vias," TechNet archive #019464, 1 May 1998. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9805&L=TechNet&P=R2037&I=-3)

[107] Hersey, Ralph, "RE>DES>Current Carrying Capacity," TechNet archives #005871, 15 Oct 1996. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind96&L=TechNet&P=R306100&I=-3)

[108] Hersey, Ralph, "Re: Design: vias:current carrying capacity," TechNet archive #016126, 19 Dec 1997. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9712&L=TechNet&P=R27252&I=-3)

[109] Hersey, Ralph, "Re: RE>Ground Planes," TechNet archive #001813, 12 Feb 1996. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind96&L=TechNet&P=R25323&I=-3)

[110] Hersey, Ralph, "Re: Thermals DERATING Curves," TechNet archive #010688, 25 Apr 1997. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9704&L=TechNet&P=R44086&I=-3)

[111] Hersey, Ralph, "Re: Trace Widths for PCB's," TechNet archive #019791, 11 May 1998. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9805&L=TechNet&P=R23940&I=-3)

[112] Hersey, Ralph, "Re>DES>Current Carrying Capacity," TechNet archive #5871, 15 Oct 1996. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind96&L=TechNet&P=R306100&I=-3)

[113] Hinton, Phil, "Re: FAB: IPC-4101 vs Mil-S-13949," TechNet archive #018181, 13 Mar 1998. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9803&L=TechNet&P=R14292&I=-3)

[114] Hurst, Joe, "Re: current carrying capacity of vias," TechNet archive #019461, 1 May 1998. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9805&L=TechNet&P=R1855&I=-3)

[115] Hybiske, Tom, "Re: FR4 versus FR5," TechNet archive #000571, 07 Sep 1995. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind95&L=TechNet&P=R30962&I=-3)

[116] Jennings, C. W., "Electrical Properties of Printed Wiring Boards," Sandia Labs SAND75-0663, May 1976.

[117] Jodoin, Claude J., "Designer's Viewpoint," Printed Circuit Design, vol. 14 no. 8, pp. 41-42, August 1997.

[117a] Jouppi, Michael R., and Mason, Robert, "Current-Carrying Capacity of PWB Internal Conductors in Space Environments," iTherm 2000 Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 23-26, 2000, pp. 255-263.

[118] Landis, Jim, "Shopping for High-Density PCBs," EP&P, vol. 40 no. 3, pp. 44-49, March 2000.

[119] Lewandowski, Bob, "Re: [SI-LIST]: Current flow limit for wire bonding," SI-List, October 4, 2000.

[119a] Ling, Yun, "On Current Carrying Capacities of PCB Traces," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1683-1693.

[120] Lomax, Abdulrahmam, "Re: Current Capacity of via holes," DesignerCouncil archive #003207, 15 Sep 1998. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9809&L=DesignerCouncil&P=R9160&I=-3)

[121] Lux, Jim, "High Voltage Fuses," 1997. (download from http://home.earthlink.net/~jimlux/hv/fuses.htm)

[122] Magee, Andrew P., "Heat Rise Calculations," TechNet archive #006727, 15 Nov 1996. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind96&L=TechNet&P=R368492&I=-3)

[123] Magee, Andrew P., "Re: Copper Thickness Designation," TechNet archive #001556, 24 Jan 1996. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind96&L=TechNet&P=R10895&I=-3)

[124] Magee, Andy, "Re: High Current PCB," Technet archive #026751, 13 Jan 1999. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9901&L=TechNet&P=R21316&I=-3)

[125] Mander, David, "re: FR-4 vs FR-5," TechNet archive #000579, 08 Sep 1995. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind95&L=TechNet&P=R31359&I=-3)

[126] Martocchi, Sandra, "Derating Too Conservative for Today's PWBs," Printed Circuit Design, vol. 17 no. 4, pp. 36, April 2000.

[126a] May, J. Thomas, Gordon, M. L., Piwnica, W. M., and Bray, S. B., "The DC Fusing Current and Safe Operating Current of Microelectronic Bonding Wires," International Symposium for Testing and Failure Analysis, Los Angeles, CA, Nov. 6-10, 1989, pp. 121-131.

[127] McHardy, John, and Gandhi, Mahendra, "Empirical Equation for Sizing Copper PWB Traces," IPCWorks 1997, technical paper SO6-2-1, 1997.

[128] McKean, Doug, "Re: Current Capacity of vias," TechNet archive #024104, 4 Sep 1998. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9809&L=TechNet&P=R7252&I=-3)

[129] McKean, Doug, "Re: Design: vias: current carrying capacity," TechNet archive #016146, 19 Dec 1997. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9712&L=TechNet&P=R28733&I=-3)

[130] McKean, Doug, "Re: Temperature Rise on a Trace," TechNet archive #026221, 15 Dec 1998. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9812&L=TechNet&P=R24471&I=-3)

[131] McMaster, Mike, "RE: Specifying copper thickness," TechNet archive #031629, 25 Jun 1999. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9906&L=TechNet&P=R80101&I=-3)

[132] Mei, Lum Wee, "Re: Current capacity of vias," TechNet archive #024102, 5 Sep 1998. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9809&L=TechNet&P=R7046&I=-3)

[133] Mei, Lum Wee, "Re: [DC] max current for via's," DesignerCouncil archive #003085, 31 Aug 1998. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9808&L=DesignerCouncil&P=R5915&I=-3)

[134] Olson, Jack, "Re: current vs trace width graphs," DesignerCouncil archive #1594, 15 Sep 1997. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9709&L=DesignerCouncil&P=R8051&I=-3)

[135] Olson, Jack, "Re: heavy copper...," DesignerCouncil archive #500, 13 Apr 1996. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind96&L=DesignerCouncil&P=R13628&I=-3)

[135a] Pan, Tsung-Yu, Poulson, Russell H., and Blair, Howard D., "Current Carrying Capacity of Copper Conductors in Printed Wiring Boards," 1993 Proceedings 43rd Electronic Components & Technology Conference, Orlando, FL, June 1-4, 1993, pp. 1061-1066.

[136] Rainal, A. J., "Current-Carrying Capacity of Fine-Line Printed Conductors," Bell System Technical Journal, vol. 60 no. 7, pp. 1375-1388, September 1981.

[137] Rainal, A. J., "Temperature Rise at a Constriction in a Current- Carrying Printed Conductor," Bell System Technical Journal, vol. 55 no. 2, pp. 233-268, February 1976.

[138] Ritchey, Lee W., "A Surbey and Tutorial of Dielectric Materials Used int the Manufacture of Printed Circuit Boards," Circuitree, November 1999.

[139] Seeger, Jeff, "Re: High Current PCB," TechNet archive #026771, 14 JAN 1999. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9901&L=TechNet&P=R22545&I=-3)

[140] Sober, Doug, "Re: FR4 versus FR5," TechNet archive #000637, 14 Sep 1995. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind95&L=TechNet&P=R34779&I=-3)

[141] Sober, Doug, "Re: Specifying copper thickness," TechNet archive #031634, 25 Jun 1999. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9906&L=TechNet&P=R80358&I=-3)

[142] Stevenson, Craig, personal communication, July 13, 1999.

[142a] Suppanz, Brad, "PCB Trace Width Calculator," 1998. (download from http://www.geocities.com/CapeCanaveral/Lab/9643/TraceWidth.htm)

[143] Sugden, Mary, and Johnson, Mona, "Conductor Width - Part 1," Printed Circuit Design, vol. 14 no. 10, pp. 38-39, October 1997.

[144] Sugden, Mary, and Johnson, Mona, "Holes - Part 1," Printed Circuit Design, vol. 14 no. 5, pp. 34-35, May 1997.

[145] Weick, Walter W., "Measuring Printed Circuits' Current-Carrying Capacity," Western Electric Engineer, vol. 5, pp. 39-41, 1961.

[146] Tarzwell, Robert G., and Basista, David, "Planar Transformers Dissipate Up to 150 kW With Copper Trace Windings," PCIM, vol. 26 no. 3, pp. 58-64, March 2000.

[147] Tarzwell, Robert, "Solving High-Current Design Problems with Ultra-Thick Copper," US-Tech Interactive, February 1998. (download from http://www.upeinc.com/prismckt/copper.htm)

[148] Williams, Lisa, "Re: current vs trace width graphs," DesignerCouncil archive #1602, 17 Sep 1997. (download from http://listserv.ipc.org/scripts/wa.exe?A2=ind9709&L=DesignerCouncil&P=R9241&I=-3)

[149] Won, "Re: [SI-LIST] Current flow limit for wire bonding," SI-List, October 4, 2000.

ACKNOWLEDGEMENTS I would like to thank Jonathan Fasig for contributing to this bibliography.

Please send critiques, corrections, and/or additions to jrbarnes@iglou.com , or by snailmail to:
John Barnes
216 Hillsboro Ave
Lexington, KY 40511-2105

dBi Corporation was a one-man test house (testing laboratory) based in Lexington, Kentucky, testing a wide variety of commercial electronic products for electromagnetic compatibility (EMC), electromagnetic interference (EMI), and electrostatic discharge (ESD) under its ISO 17025 accreditation. dBi was founded in Winchester, Kentucky in 1995 by Donald R. Bush, shortly after he retired from 30 years service with IBM Lexington's/ Lexmark's EMC Lab. John R. Barnes, who'd worked with Don at IBM Lexington and Lexmark, bought dBi in 2002 after Don's death, and moved the company to Lexington, Kentucky. John closed dBi at 11:59pm EDT on September 30, 2013, because ObamaCrap had increased operating expenses to the point that we could no longer afford to remain in business.

We'd like to thank all of the clients who chose dBi to test their products from 1995 to 2013. Below is a brief summary of our accomplishments during the 18 years we were in business.

From 1995 to 2001, under Don Bush's ownership and operation, dBi:

Did the official approval testing of 141 products developed by 20 client companies.
Did the official FCC/ Industry Canada (IC) Verification and Declaration of Conformity (DoC) testing of 92 products.
Did the official FCC/IC Certification testing of 15 products.
Did the official CE Marking testing of 100 products.

From 2002 to 2013, under John Barnes' ownership and operation, dBi:

Tested 389 products and 2 testers developed by 44 client companies.
Did the official approval testing of 357 products and 2 testers, getting all but 5 of them to meet all of the FCC, Industry Canada (IC), CE Marking, C-Tick, and Regulatory Compliance Mark (RCM) standards and requirements for their desired market areas.
Did the official FCC/IC Verification and Declaration of Conformity (DoC) testing of 296 products.
Did the official FCC/IC Certification testing of 24 products.
Did the official CE Marking testing of 271 products and 2 testers.
Did the official e-Mark testing of 3 products.
Did the official Australia/New Zealand Verification testing of 170 products.
Co-sponsored John's writing the Robust Electronic Design Reference Book, Volumes I and II.
Served as an expert witness on electronics in three lawsuits.

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Last revised December 31, 2010.

Go to Main Web Site Index	Go to Full Standards Index	Go to ITE Standards Index	Go to Residential/ Commercial Standards Index	Go to Industrial Standards Index
Go to Lab Equipment Standards Index	Go to Audio/ Video Equipment Standards Index	Go to Lamps/ Luminaires Standards Index	Go to Appliance Standards Index