Tin whiskers are conductive filaments that can spontaneously grow from tin plating and some tin alloys (i.e. solders). Typical tin whiskers are 2 to 3 microns (0.002 to 0.003mm) in diameter--" about 1/40th the diameter of a human hair-- and can carry 10's of milliamps of current without melting. If a tin whisker connects two signal traces, or connects a signal trace to a power/ ground trace, the resulting short-circuit can make the equipment fail intermittently or permanently. But if a tin whisker crosses a battery or turned-on power supply, it may melt and form a plasma that can carry 100's of amps of current, damaging or destroying the equipment!
Up until about year 2000, tin whiskers were almost unknown in the electronics industry, because we mainly used tin-lead solders, tin-lead platings on printed circuit boards (PCB's), and tin-lead platings and tin-lead terminations on electronic components. As little as 2 to 3% lead alloyed with tin gives us almost-perfect protection against the growth of tin whiskers .
But about 2000, the European Union (EU) started pushing for the removal of lead from electronic equipment. On February 13, 2003, the EU published the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Directive (RoHS Directive, Directive 2002/95/EC (now replaced by Directive 2011/65/EU)), to take effect on July 1, 2006. This Directive almost totally bans the use of lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB's), and polybrominated diphenyl ethers (PBDE's) in electronic products and equipment.
This ban on lead introduced a variety of new failure modes that:
As a result, since 2000 there has been a tremendous amount of research by electronics manufacturers, universities, and consultants, trying to find alternative ways to:
Buschow, K. H. J., Cahn, Robert, Flemings, Merton C., Ilschner, Bernhard, Kramer, Edward J., Mahajan, Subhash, and Veyssiere, Patrick, Encyclopedia of Materials: Science and Technology, Volume 10. (Katz, J. D., "Whiskers," pp. 9570-9574.) Pergamon, 2001. ISBN 0080431526. $7,295.00 list price.
Dunn, Barrie D., Materials and Processes for Spacecraft and High Reliability Applications . Chichester, United Kingdom: Springer, 2016. ISBN 978-3-319-79474-7. $154.26 list price.
Fukuda, Mitsuo, Reliability and Degradation of Semiconductor Lasers and LEDs. Boston: Artech House, 1991. ISBN 0890064652.
Gilman, J. J., The Art and Science of Growing Crystals. New York: John Wiley & Sons, 1963.
Grossmann, Gunter, and Zardini, Christian, The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects. New York: Springer, 2011. ISBN 978-0-85729-235-3. $129.00 list price.
Henshall, Greg, Bath, Jasbir, and Handwerker, Carol A., Lead-Free Solder Process Development. Hoboken, NJ: John Wiley & Sons, 2011. ISBN 978-0-470-41074-5. $99.95 list price.
Kato, Takahiko, Handwerker, Carol A., and Bath, Jasbir, Mitigating Tin Whisker Risks: Theory and Practice. Hoboken, NJ: IEEE Press, 2016. ISBN 9780470907238.
Levitt, Albert P., Whisker Technology. New York: Wiley-Interscience, 1970. ISBN 471-53150-2.
Licari, James J., and Enlow, Leonard R., Hybrid Microcircuit Technology Handbook: Materials, Processes, Design, Testing and Production, 2nd Edition. Westwood, NJ: Noyes Publications, 1998. ISBN 0815514239. $180.00 list price.
Lin, Kwang-Lung, Solder Materials. London: World Scientific Publishing, 2018. ISBN 978-981-3237-60-5. $143.47 list price.
Tan, A. C., Tin and Solder Plating in the Semiconductor Industry. New York: Chapman & Hall, 1993. ISBN 0-412-48240-1.
Wright, Roger N., Wire Technology: Process Engineering and Metallurgy. Elsevier, 2011. ISBN 978-0-12-382092-1.
Ph. D. and Master's Theses on Tin Whiskers
(revised 10/19/2020)
Bhardwaj, Divya, Development of Lead Free Thermal Fuse Wires Using Ohno Continuous Casting. Master's Thesis for University of Toronto, Toronto, Canada, 2008.
Bhassyvasantha, Sherin, Mitigation of Tin Whiskers in Electroplated Tin Coatings by Effective Doping: The Role of Surface and Subsurface. Master's Thesis for New Mexico Institute of Mining and Technology, Socorro, NM, May 2018.
Bierman, Matthew John, Dislocations in One-Dimensional Semiconductor Crystals: Nanowires, Nanotubes, and Whiskers. Ph. D. Thesis for University of Wisconsin - Madison, Madison, WI, 2009.
Booth, Bruce Lee, Magnetoresistance Oscillations in Antimony Doped Gray Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1967.
Borra, Venkata Shesha Vamsi, Metal Whiskers: The Role of Electric Fields in the Formation Mechanism and Methods for Whisker Growth Mitigation. Ph. D. Thesis for University of Toledo, Toledo, OH, Dec. 2017.
Buchovecky, Eric J., Numerical Simulation of Stress Generation and Whisker Growth in Sn Films. Ph. D. Thesis for Brown University, Providence, RI, May 2010.
Chakraborty, Aritra, Using Chemo-Thermo-Mechanically Coupled Crystal Plasticity Simulations to Investigate the Process of Whisker Formation in b-Sn Thin Films. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2019.
Chandler, Gary Jesse Howard, Growth of Whiskers in the Indium-Tin Alloy System and the effect of Elastic Strain on Tc in alpha Indium-Tin. Master's Thesis for Clemson University, Clemson, SC, Aug. 1972.
Chen, Wei-Hsun, Evaluation of Local Anisotropic Elasticity and Thermal Expansion on Whisker Formation Sites in beta-tin Thin Films. Ph. D. Thesis for Purdue University, West Lafayette, IN, Aug. 2014.
Cheng, Jing, Tin Whiskers in Electronic Packaging: Mechanism and Modeling. Ph. D. Thesis for University of Rochester, Rochester, NY, 2011.
Chin, Erica, Templated Synthesis and Characterization of Multi-segmented Nanowires for Sensor and Optical Device Applications. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, 2009.
Clore, Nicholas G., Identification and Counting Procedure for Tin Whiskers, Hillocks, and Other Surface Defects. Master's Thesis for Purdue University, Hammond, IN, Dec. 2011.
Courey, Karim J., An Investigation of the Electrical Short Circuit Characteristics of Tin Whiskers. Ph. D. Thesis for University of Miami, Coral Gables, FL, May 2008.
Crandall, Erika R., Factors Governing Tin Whisker Growth. Ph. D. Thesis for Auburn University, Auburn, AL, 2012.
Dhiman, Rajat, Design and Qualification of a Robust Polyurethane Based Conformal Coating Process for SODIMMs. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2018.
Diaz Gonzalez, Alfredo J., Pb-Free Electronics: From Nanotechnology to Combinatorial Materials Science. Master's Thesis for University of Puerto Rico, Mayaguez, Puerto Rico, 2013.
Dimitrovska, Aleksandra, Mitigation Strategies of Tin(Sn) Whisker Growth, Ph. D. Thesis for Southern Methodist University, Dallas, TX, December 19, 2009.
Dong, Fei, Polyurethane-Based Conformal Coatings for Tin Whisker Mitigation. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2018.
Dudek, Martha A., Microstructure, Mechanical and Oxidation Behavior of RE-containing Pb-free Solders. Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2009.
Fang, Tong, Tin Whisker Risk Assessment Studies. Ph. D. Thesis for University of Maryland, College Park, MD, 2005.
Fukuda, Yuki, Experimental Investigations of Whisker Formation on Tin Platings . Ph. D. Thesis for University of Maryland, College Park, MD, 2005.
Gao, Fan, Lead-Free Nano-solders on Metallic Nanowires: Synthesis, Characterization, and Thermal Reflow Properties. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, April 21, 2009.
Gullapalli, Vikranth, Study of Metal Whiskers Growth and Mitigation Technique using Additive Manufacturing. Master's Thesis for University of North Texas, Denton, TX, Aug. 2015.
Han, Jung Kyu, Effect of Thermo-Electromigration on Copper Dissolution and Intermetallic Compound Formation in Flip-Chip Pb-free Solder Joints. Ph. D. Thesis for University of California, Los Angeles, CA, 2011.
Han, Sungwon, Assessment of an Electrical Shorting and Metal Vapor Arcing Potential of Tin Whiskers. Ph. D. Thesis for University of Maryland, College Park, MD, 2012.
Haspel, Dan, Developing a Dual-Layer System for the Mitigation of Tin Whiskers . Ph. D. Thesis for LOUGHBOROUGH University, Loughborough, United Kingdom, 2018.
Horvath, Barbara, Examination of Tin Whisker Growth in Electronic Assemblies. Ph. D. Thesis for Budapest University of Technology and Economics, Budapest, Hungary, 2012.
Jafreen, Rifat, A Cost Model for Assessing the Transition to Lead-Free Electronics . Master's Thesis for University of Maryland, College Park, MD, 2008.
Janiuk, Szymon, Tin Whisker Growth and Mitigation with a Nanocrysytalline Nickel Coating . Master's Thesis for University of Toronto, Toronto, Ontario, Canada, 2015.
Kao, Hui-Ju, Effect of Cu additives on Sn whisker formation and interfacial reaction of Sn(Cu) finishes. Master's Thesis for National Central University, Jhong-Li, Taiwan, May 23, 2005.
Killefer, Morgan, Whisker Growth Induced by Gamma Radiation on Glass Coated with Sn Thin Films. Master's Thesis for University of Toledo, Toledo, OH, Aug. 2017.
Kohnke, Elton Everett, Electrical Conductivity, Magnetoresistance, and Hall Effect in Gray Tin Filaments. Ph. D. Thesis for Northwestern University, Evanston, IL, July 1955.
Koppes, John Patrick, Effect of Crystallographic Orientation on Hillock Formation in Thermally Cycled Large Grain Tin Films. Ph. D. Thesis for Purdue University, West Lafayette, IN, Aug. 2012.
Kosiba, Eva, Characterization of Low Melting Temperature, Low-Ag, Bi-Containing, Pb-Free Solder Alloys. Master's Thesis for University of Toronto, Toronto, Canada, 2016.
Lee, Hoyong, Avionics Reliability Assurance Guidelines for High Altitude Applications . Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2012.
Lee, Taekyeong, Electromigration and Solid State Aging of Flip Chip Solder Joints and Analysis of Sn Whisker on Lead-frame. Ph. D. Thesis for University of California, Los Angeles, CA, 2001.
Maganty, Suraj, Enhanced Conformal Coatings for Tin Whisker Mitigation. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2017.
Mahan, Kenneth Howard, Advanced Adhesion Strength Testing Methods of Thin Film Multilayers in Electronic Packaging Systems. Ph. D. Thesis for University of Maryland, College Park, MD, 2016.
Niraula, Dipesh, Physics and applications of conductive filaments in electronic structures: from metal whiskers to solid state memory. Ph. D. Thesis for University of Toledo, Toldeo, OH, May 2019.
Panashchenko, Lyudmyla, Evaluation of Environmental Tests for Tin Whisker Assessment. Master's Thesis for University of Maryland, College Park, MD, 2009.
Pandian, Guru Prasad, Effect of Long-term Aging on Lead-free Solder (SAC405) and Surface Finish (Pure Tin). Master's Thesis for University of Maryland, College Park, MD, 2017.
Pedigo, Aaron E., The Influence of the Effective Physical Properties of Tin Electrodeposited Films on the Growth of Tin Whiskers. Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2011.
Pinol, Lesly Agnes, Fundamental Studies of Tin Whiskering in Microelectronics Finishes . Ph. D. Thesis for University of Maryland, College Park, MD, 2010.
Regalado, Irene Lujan, Characterization of Thermo-Mechanical Damage in Tin and Sintered Nano-Silver Solders. Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2018.
Rodekohr, Chad L., Material Factors Influencing Metallic Whisker Growth. Ph. D. Thesis for Auburn University, Auburn, AL, Dec. 19, 2008.
Sabbagh, N. A. J., Tin Whisker Growth in the Communication Industry. Master's Thesis for Sir George Williams University, Montreal, Canada, Apr. 1973.
Sarobol, Pylin, Effects of Local Film Properties on the Nucleation and Growth of Tin Whiskers and Hillocks. Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2013.
Sengupta, Shirsho, Effects of Solder-Dipping as a Termination Re-finishing Technique . Masters Thesis for University of Maryland, College Park, MD, June 2006.
Spitzner, Matthew James, Response of tin whiskers to dynamic input: Mathematical modeling and experimental property measurement. Master's Thesis for Iowa State University, Ames, IA, 2009.
Stuttle, Christopher James, The Electrodeposition of Tin Coatings from Deep Eutectic Solvents and their Subsequent Whisker Growth. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, Sept. 2014.
Sun, Yong, Micro/Nano-Scale Investigation on Tin Alloys and Tin Dioxide Nanowires . Ph. D. Thesis for University of South Carolina, Columbia, SC, 2012.
Vallabhaneni, Venkata Sathya Sai Renuka, Environmental-Induced Damage in Tin (Sn) and Aluminum (Al) Alloys . Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2017.
Wang, Weiqiang, Solder Joint Reliability of Sn and SnBi Finished and Refinished Sn (SAC/SnPb) SMT Packages Under Temperature Cycling Test. Master's Thesis for University of Maryland, College Park, MD, 2009.
Wang, Yibo, A Numerical Model of Anisotropic Mass Transport Through Grain Boundary Networks. Master's Thesis for Lehigh University, Bethlehem, PA, Sept. 2011.
Wang, Ying, Microstructure Evolution and Surface Defect Formation in Tin Films . Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2014.
Papers, Reports, Presentations, and Magazine Articles
on Tin Whiskers (revised 2/4/2021)
"100% Sn Plating Whisker Growth Study," AMD, Jan. 10, 2003.
A Guide To Lead-Free Soldering for Assemblers & Sub-Contractors, Version 2.6, $68 from Roger Bilham Consultancy
"Back Up Block 1 Whisker on Cu," June 6, 2003.
"Back Up Block 2 Whisker on NiFe," June 6, 2003.
"Basler Power Supplies," Westinghouse Nuclear Tech Bulletin TB-02-5, July 12, 2002.
"BMPCOE Strives to Mitigate Tin Whiskers," COTS Journal, vol. xx no. xx, pp. 60-63, Sept. 2003.
"Boeing 601 (f.k.a. Hughes HS 601)."
"Close Shave," Printed Circuit Design and Manufacture, vol. 20 no. 8, pp. 10, Aug. 2003.
"Coating to stop tin whisker growth?," Circuitnet, Aug. 14, 2006.
"Comments on Test Methods & Criteria for Tin Whiskers in Surface Mount Passive Devices," EIA/ECA-CB22, Nov. 2005.
"Control of Whisker Growth in Tin Alloy Coatings," ST Microelectronics Application Note AN2035, Nov. 2004.
"Electrodeposited Pb-free Solder and Whisker Prevention," Journal of Research of the National Institute of Standards and Technology, vol. 106 no. 2, pp. 490, Mar./Apr. 2001.
"Elimination of Lead from Electrical and Electronic Equipment - the Dilemma of Tin-Whisker Growth," Eurocomp, no. 7, pp. 3-6, Autumn 2004.
"European directives vs. Tin Whiskers & Tin Pest," finishing.com .
"Examples of tin-whiskers failures," evertiq, Oct. 11, 2007.
"Examples of Whiskergrowing in Industry Applications," 3rd Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Genova, Italy, Mar. 21, 2012.
"GEIA-HB-0005-4 Guidelines for Performing Reliability Assessment for Pb Free Assemblies used in Aerospace and High-Performance Electronic Applications," Sept. 23, 2010.
"GEIA-STD-0005-2 Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems," Rev A draft 1/5/11.
"Getting the Lead Out," Appliance Design, vol. xx no. x, pp. xx-xx, Feb. 2006.
"Glitch silences millions of pagers," Star-Bulletin, May 20, 1998.
Green-Guard 701 Aug. 15, 2009.
"High-Speed, Non-Whiskering Tin for Semiconductor Packages," Products Finishing, vol. 47 no. 12, pp. 80, Sept. 1983.
"Hot-Dip Tin Process Said to Prevent Whisker Formation," Products Finishing, vol. 73 no. 7, pp. 11, Apr. 2009.
"HP says RoHS making whiskers problem worse," evertiq, Feb. 22, 2005.
"HP's Position Statement on Tin-based Plating for Lead-free Components," Apr. 7, 2003.
"Hughes Satellite Failures Continue To Plague New Owner," Electronics Weekly, Apr. 24, 2001.
"Hughes Seeks To Salvage Satellites," Television Digest with Consumer Electronics, vol. xx no. xx, pp. xx-xx, Sept. 11, 2000.
"Inadvertent Reactor Trip and Partial Safety Injection Due to Tin Whisker," United States Nuclear Regulatory Commission, NRC Information Notice 2005-25, Aug. 25, 2005.
"Industry Groups Continue Focus on Tin Whiskers," CPMT Society Outlook , vol. 1, pp. 3-4, 2005.
"iNEMI Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products Version 4 (12-1-06)," iNEMI, Dec. 1, 2006.
"iNEMI Tin Whisker Accelerated Test Project Test Method for Evaluating Tin Whisker Growth on Plated Surfaces." International Electronics Manufacturing Initiative, June 17, 2004.
"iNEMI tin whisker group publishes updated recommendations," Tin World, no. 17, pp. 11, Spring 2007.
"iNEMI Tin Whisker user group publishes updated recommendations to help reduce risk of tin whiskers," emsnow, Dec. 20, 2006.
"iNEMI Tin Whisker Workshop," Tin World, no. 18, pp. 14, Early Summer 2007.
"iNEMI Updates Tin Whiskers Findings," SMT Web Exclusive Article.
"Inspections, Compliance, Enforcement, and Criminal Investigations Tin Wiskers Problems, Causes, and Solutions," Food and Drug Administration, Mar. 14, 1986.
"Interim Recommendations on Lead-Free Finishes for Components Used in High- Reliability Products,", NEMI, Mar. 2004.
"ITG Subject: Tin Whiskers - Problems, Causes, and Solutions," Department of Health, Education, and Welfare Public Health Service Food and Drug Administration *ORA/ORO/DEIO/IB*, Mar. 14, 1986.
"JEDEC and IPC Release Tin Whisker Acceptance Testing," Tin World , no. 14, pp. 11, 2006.
"JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," CircuiTree, vol. 19 no. 5, pp. xx-xx, May 2006.
"JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," PCB007, May 4, 2006.
"JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," FPGA and Structured ASIC Journal, vol. xx no. x, pp. xx-xx, May 4, 2006.
"JEDEC and IPC release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," emsnow, May 5, 2006.
"JEDEC, iNEMI Update Tin Whisker and Lead-Free Surface Finish Guidelines," CircuiTree, vol. 18 no. 7, pp. xx-xx, July 2005.
"JEDEC, IPC Release Tin Whisker Acceptance Testing Standard," Circuitree, vol. 19 no. 6, pp. xx-xx, June 2006.
"JEDEC, IPC Release Tin Whisker Standards," Printed Circuit Design and Manufacture, vol. 23 no. 6, pp. 8, June 2006.
"JEDEC Releases Standard for Tin Whisker Testing and iNEMI User Group Updates Lead-Free Surface Finish Guidelines," PCB007, May 24, 2005.
"JEITA Whisker Test Method Project," IPC and SOLDERTEC Global Conference, Brussels, June 2003.
"JESD201, Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes," Arlington, VA: JEDEC Solid State Technology Association, Mar. 2006.
"JESD22A121, Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes," JEDEC Solid State Technology Association, May 2005.
"JESD22A121.01, Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes," JEDEC Solid State Technology Association, Oct. 2005.
"JETRO Releases the Results of its Survey of Japanese Manufacturers in Europe and Turkey," PCB007, May 26, 2006.
"JP002, Current Tin Whiskers Theory and Mitigation Practices Guideline," Arlington, VA: JEDEC Solid State Technology Association and Bannockburn, IL: IPC, Mar. 2006.
Lead-Free Defect Guide 2, SMART Group, 2010.
"Lead Free Electronics Impact on DoD Programs," DMSMS Conference 2007, Orlando, FL, Oct. 29, 2007, pp. xx-xx.
Lead Free Electronics Manhattan Project Phase 2. ACI Technologies, Feb. 10, 2010.
"Lead Free Product Testing," Trace Laboratories-East.
"Lead Free Product Testing/Tin Whisker Testing," Trace Laboratories-East.
"Lead-Free solder failure mechanisms: What are Tin Whiskers?," LiveWire, no. 11, pp. xx-xx, .Nov./Dec. 2003.
"Lead Free Tin Whiskering Study: Grayhill DIP Switches," Grayhill, May 11, 2004.
"Lead-free: Whiskers on Tin," Tyco Electronics.
"Leadfree Solder and Tin Whiskers Program Guidance (draft)," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.
"Legs 1, 2 & 3: Olin 194 8lead SOIC Molded/Singulated."
"Matte Tin Plating Whisker Data," Lattice Product Bulletin PB1227H, Nov. 2010.
"MAUDE Adverse Event Report," 1996.
"MAUDE Adverse Event Report," 2008.
"Metal Whiskers," Science, New Series, vol. 123 no. 3209, pp. 1165, June 29, 1956.
"Metallic Whisker Sources," Worldwide Environmental Services, 2004.
"Nano Whiskers."
"NASA's Suggestions for Reducing Risk of Tin Whisker Induced Failures," Products Finishing, vol. 74 no. 12, pp. 32, Sept. 2010.
"NEMI Group Releases Draft Proposal of Tin Whisker Acceptance Test Requirements," CircuiTree, vol. 17 no. 6, pp. xx-xx. June 2004.
"NEMI Issues Revised Tin Whisker Acceptance Test Requirements," NEMI, Aug. 30, 2004.
"NEMI issues revised tin whisker acceptance test requirements," PCB007, Aug. 30, 2004.
"NEMI issues revised tin whisker acceptance test requirements," emsnow, Sept. 6, 2004.
"NEMI issues revised tin whisker test requirements," TIN World , no. 7, pp. 17, 2004.
"NEMI team recommends three test conditions for evaluating tin whisker growth," PCB007, Oct. 6, 2003.
"NEMI Team Recommends Three Test Conditions for Evaluating Tin Whisker Growth," CircuiTree, vol. 16 no. 12, pp. xx-xx, Dec. 2003.
"NEMI's Tin Whisker Project reports initial test results, reviews modeling efforts at APEX 2002," PCB007, Feb. 8, 2002.
"New additive limits tin whiskers," Solid State Technology, vol. 51 no. 1, pp. 23, Jan. 2008.
"New Immersion Tin Process PRESA RMK-30: Tin Whisker Issue," Uyemura, Mar. 2007.
"New Standards on Tin Whisker Mitigation," Circuits Assembly, vol. 17 no. 4, pp. 36, Apr. 2006.
"New tin whisker standard," Tin World, no. 18, pp. 16, Early Summer 2007.
"New TWI proposed project: Tin Whiskers - reducing the risk," TWI LiveWire, issue 14, Summer 2004.
"Nickel-coated Components Solve Electrical Problem," Nickel, vol. 20 no. 2, pp. 5, Mar. 2005.
"On Trial In Brazil," Air Safety Week, vol. 21 no. 23, June 11, 2007.
"Pb-Free Components," DfR Solutions, Mar. 3, 2010.
"Plating's Effects on Electronics Assembly," Printed Circuit Design and Fab/Circuits Assembly, vol. 27 no. 7, pp. 40, July 2010.
"Position Paper on Risks to High-Reliability Electronics and Associated Hardware from Pure Tin Coatings," July 25, 2002.
"Potential Tin Whiskers on Printed Circuit Board Components," Westinghouse Nuclear Tech Bulletin TB-05-4, June 8, 2005.
"Qualification of Lead Free Component Plating Finishes," Nov. 3, 2003.
"Qualification Procedure for Tin Whisker Formation in Lead-free Connector Terminal Finishes," Molex.
"Rationale for the Auger Studies," Tin Whisker Group teleconference, May 11, 2016.
"Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products," iNEMI Tin Whisker User Group, Version 3, May 2005.
"Reduce the risk of tin Whiskers in lead-free RJ connectors," Xmultiple Application Note, xxxx.
"Reducing the risk of tin whiskers on lead-free products," RF Design, vol. xx no. x, pp. xx-xx, May 10, 2006.
"Requested Exemption from the requirements of Article 4(1) of Directive 2002/95/EC," Swatch, Jan. 12, 2006.
"Resolution of Generic Safety Issues: Issue 200: Tin Whiskers (NUREG-0933, Main Report with Supplements 1-33) Nov. 3, 2010.
"Risks of Conductive Whiskers in High-Reliability Electronics and Associated Hardware from Pure Tin Coatings," June 19, 2002.
"Robotic Solder Dip Solves Tin Whisker Problem," Navy Mantech, 2005.
"RoHS at QP Semiconductor," QP Semiconductor Application Note 114 Rev. 2.0, Feb. 2008.
"Scientists Research Tin Pest and Whiskers," SMT Web Exclusive Article. (Apr. 3, 2009)
"Second ECTC iNEMI Tin Whisker Workshop," Components, Packaging, and Manufacturing Technology Society Newsletter, vol. 28 no. 2, pp. 8-9, June 2005.
"Set of recommendations to help reduce risk of Tin Whiskers," evertiq, Dec. 18, 2006.
"Shaving the Risk of Tin Whiskers," NITON Application Bulletin , Mar. 17, 2004.
"Shaving the whiskers for lead-free production," European Semiconductor, vol. 26 no. 11, pp. 17, Nov. 1, 2004.
"Some Examples of "Whiskers" from Tin-Based Alloys," Tin Whisker Group teleconference, July 22, 2009.
"Standards aim to reduce the risk of tin whiskers," Test & Measurement World, vol. 26 no. 4, pp. xx-xx, May 4, 2006.
"Standards aim to reduce the risk of tin whiskers," Test & Measurement World, vol. 26 no. 5, pp. 12, June 2006.
"Suppression of Tin Whisker Growth through Optimized Tin Plating Chemistry Formulation Technistan EP," Technic. (2004)
"Technical Service Bulletin: Tin Whiskers in MOD10 Relays." GE Power Management, MOD10 SB1-00.03.27, Mar. 27, 2000.
"Technical Support to the National Highway Traffic Safety Administration (NHTSA) on the Reported Toyota Motor Corporation (TMC) Unintended Acceleration (UA) Investigation, Version 1.0." NASA. Jan. 18, 2011.
"Testing for Tin Whisker Mitigation," Design News, June 27, 2005.
"The Facts about Tin Whiskers," Electronic Components, Assemblies & Materials Association, EIA/ECA-CB19, Aug. 2004.
"The Fusing of Wires and Tin Whiskers," Tin Whisker Group teleconferences, Apr. 22, 2009 and Apr. 29, 2009.
"The Growth of Tin Whisker," Samsung.
"The problem of 'tin whiskers' cannot be neglected," Dataweek , vol. xx no. xx, pp. xx-xx, July 28, 2004.
"The Relation between Whisker and Stress," Hynix Semiconductor. Sept. 2002.
"Thermal cycling test of tin-bismuth and tin plating," Ishihara Chemical Co., 2008.
"Three organizations from US, Europe, Japan cooperating to develop tin whisker test method," PCB007, July 18, 2003.
"Tin-Nickel Alloy Plating Does Not Grow Whiskers in Five Years," Tin and its Uses, no. 64, pp. 15, 1964.
"Tin-Nickel versus Metal "Whiskers"," Tin and its Uses, no. 52, pp. 8, 1961.
"Tin "Noodles"???." Mar. 17, 2004.
"Tin Whisker Acceptance Test Requirements," NEMI Tin Whisker Users Group, July 28, 2004.
"Tin Whisker Experience - Rocket Motor Initiator Failure Analysis."
"Tin Whisker Experiences," June 19, 2002.
"Tin Whisker Growth Evaluation Results," Kemet, Mar. 30, 2004.
"Tin Whisker Imagery," empfasis, pp. 9, Apr. 2009.
"Tin Whisker Info "Brief"," On Semiconductor Application Note TND311, May 2003.
"Tin-whisker issues deserve to be on the front burner," Military & AerospaceElectronics. (May 12, 2006)
"Tin Whisker Mitigation & Conformal Coating," Surface Mount Technology (SMT), vol. 28 no. 2, pp. 57, Feb. 2013.
"Tin Whisker Mitigation on New and Stored Parts," Printed Circuit Design and Fab/ Circuits Assembly, vol. 29 no. 3, pp. 36-37, Mar. 2012.
"Tin Whisker Qualification and Reliability Testing," Printed Circuit Design and Fab/ Circuits Assembly, vol. 28 no. 10, pp. 37,39, Oct. 2011.
"Tin Whisker References."
"Tin Whisker Specs Defined," Metals and Interconnects, vol. 18 no. 7, pp. xx, Aug. 2004.
"Tin Whisker User Group Publishes Updated Set of Recommendations Help Reduce Risk of Tin Whiskers," PCB007, Dec. 15, 2006.
"Tin Whisker Workshop." (Apr. 2, 2005)
"Tin Whiskering Borders on Urban Legend," Design News, vol. 60 no. 11, pp. xx, Aug. 15, 2005.
"Tin Whiskers," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Dec. 7, 2003.
"Tin Whiskers," Sept. 14, 2004.
"Tin Whiskers." (Apr. 3, 2005)
"Tin Whiskers," Circuitnet, May 14, 2007.
"Tin Whiskers 2012," 3rd Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Genova, Italy, Mar. 21, 2012.
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Spiers, Simon,
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Lead-Free Surface Finishes for Electronic Components: Tin Whisker Growth
(before Oct. 2, 2012)
Mechanism of Tin Whisker Growth in Electronics (before Aug. 18, 2020)
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Melting a TIN WHISKER Using a Volt/Ohm Meter, Youtube, May 3, 2012.
Brusse, Jay,
Metal whisker growing from the header/seal area of a package enclosure for a
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Brusse, Jay,
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NASA Anecdote #1: 20 Years to Failure, (before Mar. 26, 2005)
NASA Anecdote #2: Tin Whiskers on Waveguide, (before Mar. 26, 2005)
NASA Anecdote #3: Field Failures Due to Tin Whiskers Breaking Loose from Matte
Tin-Plated RF Enclosure Lids, (before Mar. 26, 2005)
NASA Anecdote #4- Tin Whiskers on Shield of GPS Units, (before Mar. 26,
2005)
NASA Anecdote #5: Field Failures Due to Tin Whiskers on Circuit Breaker
Contacts, (before Mar. 26, 2005)
NASA Anecdote #7: Tin Whiskers on RF Shield/Bracket, Aug. 3, 2009.
NASA Anecdote: Tin Whiskers Inside of AF114 Transistors, Aug. 3, 2009.
NASA Anecdote: Tin Whiskers on Bus Bars, Aug. 3, 2009.
NASA Anecdote: Tin Whiskers on Oscilloscope Probes (2007), Aug. 3, 2009.
NASA Basic Info/FAQ, (before Feb. 22, 2009)
NASA Experiment 2, (before Apr. 15, 2005)
Kadesch. Jong S.,
NASA Goddard Space Flight Center Effect of Uralane Conformal Coating on Tin
Whisker Growth, Apr. 20, 2005.
NASA Goddard Space Flight Center Electromagnetic Relay Manufacturer Survey
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NASA Goddard Space Flight Center Experiment #2 Photo Gallery, Apr. 20,
2005.
NASA Goddard Space Flight Center Experiment 1, (before Apr. 15, 2005)
NASA Goddard Space Flight Center Experiment 3, Apr. 20, 2005.
NASA Goddard Space Flight Center Experiment 4, (before Apr. 15, 2005)
NASA Goddard Space Flight Center Experiment 5, (before Apr. 15, 2005)
NASA Goddard Space Flight Center Experiment 6: Simulation of Whisker Growth
, (before Apr. 15, 2005)
NASA Goddard Space Flight Center Experiment 7: Matte Tin Plated IC Leadframe
Examination, Apr. 20, 2005.
NASA Goddard Space Flight Center Photo of the Month, (before Apr. 2, 2005)
NASA Goddard Space Flight Center Re-emergence of an Old Problem with
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NASA Goddard Space Flight Center Specification Language Related to Pure Tin
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NASA Goddard Space Flight Center Summary of Specification Language for Pure
Tin (before Mar. 26, 2005)
NASA Goddard Space Flight Center Tin Whisker Photo, Apr. 20, 2005.
NASA Goddard Space Flight Center Tin Whisker Photo, Apr. 20, 2005.
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NASA Literature References, (before Apr. 24, 2005)
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NASA Metal Whiskers from Sn-Ag-Cu Alloy Systems, (before July 14, 2008)
NASA Photo Gallery, (before Mar. 26, 2005)
NASA Photo of the Month Archives December 2003 Sn-Pb Whiskers, (before
Mar. 26, 2005)
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2005)
NASA Tin Whisker Anecdote: Swiss Radio & Telephone, June 9, 2008.
NASA Video Gallery. (before Aug. 18, 2020)
NASA What's New, Jan. 24, 2011.
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NASA Whisker Failures, (before Mar. 26, 2005)
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Plating (before Feb. 12, 2011)
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2007.
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2017.
Sn Whisker (before Nov. 14, 2015)
Soviet ILS teardown with a tin whiskers surprise, Youtube, Nov. 27, 2015.
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The Trouble with Tin: Get the Lead Out! (before Fall 2000)
Tin Whisker Alert 2008.
Perton, Marc,
"Tin whisker" crisis threatens global electronic systems (before
May 17, 2005)
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Tin Whisker Mitigation - Adding Lead to Chip Size Components with Pure-Tin
Terminals (before May 17, 2005)
Tin Whisker Summary (before Feb. 13, 2011)
Tin Whisker Testing (before Aug. 18, 2020)
Tin Whiskers (before Feb. 13, 2011)
Tin Whiskers (before Feb. 2, 2005)
Tin Whiskers 2004.
Tin Whiskers 2008.
Tin Whiskers "A New Problem" (before Feb. 22, 2009)
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Tin whiskers causes and prevention 2008.
Brusse, Jay,
Tin Whiskers-Dsub Connector Shell, Youtube, Nov. 21, 2009.
Robertson, Jordan,
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Spiers, Simon,
Tin whiskers inside a AF117 transistor, Youtube, Jan. 6, 2014.
Brusse, Jay,
Tin Whiskers Inside Electromagnetic Relay, Youtube, Nov. 21, 2009.
Brusse, Jay,
Tin Whiskers on Card Guides, Youtube, Nov. 21, 2009.
Brusse, Jay,
Tin Whiskers on Electromagnetic Relays, Youtube, Nov. 21, 2009.
Brusse, Jay,
Tin Whiskers on Lincoln's Beard, Nov. 25, 2009.
Brusse, Jay,
Tin Whiskers on Terminal Lugs, Youtube, Nov. 21, 2009.
Brusse, Jay,
Tin Whiskers on Variable Air Capacitor, Youtube, Nov. 21, 2009.
Tin Whiskers (Tech Tip #2) (before Apr. 30, 2005)
Tin Whiskers with Special Morphology July 14, 2008.
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"What are Tin Whiskers?." (before Nov. 22, 2015)
"What Are Tin Whiskers?" (before Nov. 22, 2015)
What are Tin Whiskers? (before Apr. 24, 2005)
What Are Tin Whiskers? (before Feb. 24, 2009)
What's Inside Your PC? (before May 25, 2009)
Whisker growth over a 12 minute period (before Nov. 14, 2015)
Whisker growth over a 19 minute period (before Nov. 14, 2015)
Whisker (metallurgy) (before May 20, 2009)
Whiskers in germanium transistors etc
"Will electronic equipment fail from tin-whisker shorts?," SourceESB, Feb.
9, 2005.
Oudat, Osama, Arora, Vidheesha, Parsai, E. Ishmael, Karpov, Victor G., and
Shvydka, Diana,
"Gamma- and x-ray accelerated tin whisker development," Journal of
Physics D: Applied Physics, vol. 53 no. 49, pp. 495305-1-495305-9,
Dec. 2020.
https://doi.org/10.1088/1361-6463/abb38d
Chen, Wei-Hsun, Wang, Congying, Sarobol, Pylin, Blendell, John, and
Handwerker, Carol,
"Local variations in grain formation, grain boundary sliding, and whisker
growth along grain boundaries in large-grain Sn films," Scripta
Materialia, vol. 187, pp. 458-463, Oct. 2020.
Illes, Balazs, Krammer, Oliver, Hurtony, Tamas, Dusek, Karel, Busek, David,
and Skwarek, Agata,
"Kinetics of Sn whisker growth from Sn thin-films on Cu substrate,"
Journal of Materials Science: Materials in Electronics, vol. 31 no. 19,
pp. 16314-16323, Oct. 2020.
https://doi.org/10.1007/s10854-020-04180-2
Wang, Changchang, Chen, Yinbo, and Liu, Zhi-Quan,
"Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC
During Aging," Acta Metallurgica Sinica (China), vol. 33 no. 10,
pp. 1388-1396, Oct. 2020.
https://doi.org/10.1007/s40195-020-01059-3
Shvydka, Diana, and Karpov, Victor G.,
"Gamma and x-ray accelerated tin whisker development," Tin Whisker Group
teleconference, Oct. 14, 2020.
Wang, Zekun, Flowers, George T., and Bozack, Michael,
"The Influence of Limitation of Sputtered Tin Area Through Mesh Grids on Sn
Whiskering," 2020 IEEE 66th Holm Conference on Electrical Contacts and
Intensive Course, San Antonio, TX, Oct. 4-7, 2020, pp. 137-143.
"Reduce the risk of tin Whiskers in lead-free RJ connectors," Xmultiple
Application Note, xxxx. (found 10/2/2020)
Toleno, Brian,
"Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers,"
Henkel Corp. (found 9/30/2020)
Otsubo, Fumitaka, Era, Hidenori, Tsuru, Yutaka, and Hirano, Shigeru,
"TEM analysis of whiskers formation over tin-plated films," Materials
Chemistry and Physics, vol. 251, pp. 122985-1-122985-6, Sept. 1, 2020.
Mechanism of Tin Whisker Growth in Electronics (before Aug. 18, 2020)
NASA Video Gallery. (before Aug. 18, 2020)
Tin Whisker Testing (before Aug. 18, 2020)
Tian, Shuang, Gong, Xiaohua, Zhou, Jian, and Xue, Feng,
"Growth behaviors of tin whiskers on Sn-Al coating," 2020 21st
International Conference on Electronic Packaging Technology, Guangzhou,
China, Aug. 12-15, 2020, pp. xx-xx.
Xu, Hui, and Zou, Yabing,
"Characteristics and analysis methods for connector whisker growth,"
2020 21st International Conference on Electronic Packaging Technology,
Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.
Zhang, Peng, Xue, Songbai, and Wang, Jianhao,
"New challenges of miniaturization of electronic devices: Electromigration and
thermomigration in lead-free solder joints," Materials & Design,
vol. 192, pp. 108726-1-108726-17, July 2020,
https://doi.org/10.1016/j.matdes.2020.108726
Xu, Chen, Zhang, Yun, Fan, C., and Abys, J.,
"Understanding Whisker Phenomenon: Driving Force for Whisker Formation,"
Cookson Electronics. (found June 2020)
Jagtap, Piyush, Jain, Nupur, and Chason, Eric,
"Whisker growth under a controlled driving force: Pressure induced whisker
nucleation and growth," Scripta Materialia, vol. 182, pp. 43-47,
June 2020.
Cai, Xiaorong, Handwerker, Carol A., Blendell, John E., and Koslowski,
Marisol,
"Shallow grain formation in Sn thin films," Acta Materialia, vol.
192, pp. 1-10, June 15, 2020.
Illes, Balazs, Batorfi, Reka, Hurtony, Tamas, Krammer, Oliver, Harsanyi,
Gabor, Pietrikova, Alena, Skwarek, Agata, and Witek, Krzysztof,
"Whisker Development from SAC0307-Mn07 Solder Alloy," 2020 43rd
International Spring Seminar on Electronics Technology, Liptovsky
Mikulas, Slovakia, May 14-15, 2020, pp. xx-xx.
Zhang, Xundi, Yang, Chenlin, Sun, Menglong, Hu, Anmin, Li, Ming, Gao, Liming,
Hang, Tao, and Ling, Huiqin,
"Inhibition of tin whisker by electroplating ultra-thin Co-W amorphous barrier
layer," Materials Characterization, vol. 162, pp.
110221-1-110221-8, Apr. 2020.
Ebner, Karen, Demeo, Robert, Villiers, Janet, Goossens, Andrew, Mantoni,
Daniel, and McCarthy, Lenna,
"An Automated TIN WHISKER RISK ASSESSMENT Process Resulting in Significant
Cost Savings," Printed Circuit Design and Fab/ Circuits Assembly
, vol. 37 no. 2, pp. 46-49, Feb. 2020.
Majumdar, B. S., Dutta, I., Bhassyvasantha, S., and Mahapatra, S. Das,
"Recent Advances in Mitigation of Whiskers from Electroplated Tin," JOM
, vol. 72 no. 2, pp. 906-917, Feb. 2020.
Liu, Yushuang, Lu, Chengjie, Zhang, Peigen, Yu, Jin, Zhang, Yamei, and Sun,
Zheng Ming,
"Mechanisms behind the spontaneous growth of Tin whiskers on the Ti2SnC
ceramics," Acta Materialia, vol. 185, pp. 433-440, Feb. 15, 2020.
Zhang, Yan, Zhang, Peigen, He, Wei, and Sun, Zhengming,
"Tin whisker growth on immiscible Al-Sn alloy," Journal of Materials
Science: Materials in Electronics, vol. 31 no. 2, pp. 1328-1334, Jan.
2020.
Vianco, P. T., Cummings, D. P., Kotula, P. G., Mckenzie, B. M., Lowery, L.
M., Williams, S., and Banga, D.,
"Mitigation of Long Whisker Growth Based upon the Dynamic Recrystallization
Mechanism," Journal of Electronic Materials, vol. 49 no. 1, pp.
888-904, Jan. 2020.
Delhaise, Andre M., Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, and
Bagheri, Zohreh,
"Tin Whisker Formation in Bismuth-Containing Lead-Free Solder Alloys After
Long-Term Ambient Temperature, High Humidity Storage, Part I: Whisker
Inspection Results," SMTA Journal, vol. 32 no. 2, pp. 14-26,
2019.
Haspel, D. M., Ashworth, M. A., Wilcox, G. D., Bao, X., and Mortimer, R. J.,
"The effect of different post-electroplating surface modification treatments
on tin whisker growth," Transactions of the IMF, vol. 97 no. 3,
pp. 129-139, 2019.
https://doi.org/10.1080/00202967.2019.1587263
Mokhtar, Noor Zaimah Mohd, Salleh, Mohd Arif Anuar Mohd, Hashim, Aimi
Noorliyana, and Nazri, Sufian Firdaus,
"Effects of Gallium addition on the thermal properties and whiskers growth
under electrical current stressing," Materials Science and Engineering
, vol. 701, pp. 012001-1-012001-7, 2019.
Hashim, Aimi Noorliyana, Salleh, Mohd Arif Anuar Mohd, Mokhtar, Noor Zaimah
Mohd, and Idris, Shahida,
"Tin (Sn) whisker growth from electroplated Sn finished," Materials
Science and Engineering, vol. 701, pp. 012005-1-012005-6, 2019.
Hashim, Aimi Noorliyana, Salleh, Mohd Arif Anuar Mohd, and Mokhtar, Noor
Zaimah Mohd,
"Morphology Analysis of Spontaneous Tin (Sn) Whisker Growth on Lead-Free
Solder," Materials Science and Engineering, vol. 551, pp.
012095-1-012095-6, 2019.
Mokhtar, Noor Zaimah Mohd, Salleh, Mohd Arif Anuar Mohd, and Hashim, Aimi
Noorliyana,
"Preliminary Study of Electrical Current Stressing on Tin Whisker Formation,"
Materials Science and Engineering, vol. 551, pp.
012096-1-012096-5, 2019.
Kutilainen, Terho, Pudas, Marko, Ashworth, Mark A., Lehto, Tero, Wu, Liang,
Wilcox, Geoffrey D., Wang, Jing, Collander, Paul, and Hokka, Jussi,
"Atomic Layer Deposition (ALD) to Mitigate Tin Whisker Growth and Corrosion
Issues on Printed Circuit Board Assemblies," Journal of Electronic
Materials, vol. 48 no. 11, pp. 7573-7584, Nov. 2019.
Sharma, Ashutosh, Park, Young Min, Lee, Sangyeob, and Ahn, Byungmin,
"Morphology, resistivity and corrosion behavior of tin coatings plated from
citric acid bath," Materials Research Express, vol. 6 no. 11,
pp. 116589-1-116589-10, Nov. 2019.
Illes, Balazs, Hurtony, Tamas, Krammer, Oliver, Medgyes, Balint, Dusek, Karel,
and Busek, David,
"Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker
Development from Sn Thin-Films," Materials, vol. 12 no. 21, pp.
3609-1-3609-11, Nov. 1, 2019.
Ahn, Seongki, Kadoya, Takahiro, Nara, Hiroki, Yokoshima, Tokihiko, Momma,
Toshiyuki, and Osaka, Tetsuya,
"Tin addition for mechanical and electronic improvement of electrodeposited
Si-O-C composite anode for lithium-ion battery," Journal of Power
Sources, vol. 437, pp. 226858-1-226858-6, Oct. 15, 2019.
Lin, Wen-Chih, Tseng, Tsan-Hsien, Liu, Wei, Huang, Kuo-Shuo, Chen, Hao, Lee,
Hsin-Yi, Ku, Ching-Shun, and Wu, Albert T.,
"Effect of Sn Film Grain Size and Thickness on Kinetics of Spontaneous Sn
Whisker Growth," JOM, vol. 71 no. 9, pp. 3041-3048, Sept. 2019.
Schetty, Rob,
"Next-Gen Corrosion-Resistant Finishes for Electronics," Products
Finishing, vol. 83 no. 12, pp. 28-31, Sept. 2019.
Delhaise, Andre M., Meschter, Stephan, Bagheri, Zohreh, Snugovsky, Polina, and
Kennedy, Jeff,
"Evaluation of Tin Whisker Formation on SOT and Discrete Components Assembled
with Bismuth-Containing Lead-Free Solder Alloys After Short-Term High
Temperature, High Humidity Storage," Proceedings of SMTA International
, Rosemont, IL, Sept. 22-26, 2019, pp. 323-343.
Rafanelli, Anthony J.,
"Status of Pb-Free Risk Mitigation for Aerospace and Defense - An "Attitude
Adjustment" Perspective," Proceedings of SMTA International,
Rosemont, IL, Sept. 22-26, 2019, pp. 478-483.
Saito, Akira, and Nishikawa, Hiroshi,
"Tin Whisker Growth Mechanism on Tin Plating of MLCCs Mounted with
Sn-3.5Ag-8In-0.5Bi Solder in 30°C60%RH," 2019 22nd European
Microelectronics and Packaging Conference & Exhibition, Pisa, Italy,
Sept. 16-19, 2019. pp. xx-xx.
Kutilainen, Terho, Pudas, Marko, Ashworth, Mark A., Wilcox, Geoffrey D., and
Hokka, Jussi,
"ALD Coatings to Mitigate Against Tin Whiskers and Upgrade the Environmental
Durability of Electronic Circuit Boards," 2019 22nd European
Microelectronics and Packaging Conference & Exhibition, Pisa, Italy,
Sept. 16-19, 2019. pp. xx-xx.
Wu, Jie, Xue, Songbai, Wang, Jingwen, and Wu, Mingfang,
"Effect of in-situ formed Pr-coated Al2O3 nanoparticles on interfacial
microstructure and shear behavior of Sn-0.3Ag-0.7Cu-0.06Pr/Cu solder joints
during isothermal aging," Journal of Alloys and Compounds, vol.
799, pp. 124-136, Aug. 30, 2019.
Tu, K. N., and Gusak, A. M.,
"A unified model of mean-time-to-failure for electromigration,
thermomigration, and stress-migration based on entropy production,"
Journal of Applied Physics, vol. 126 no. 7, pp. 075109-1-075109-6, Aug.
21, 2019.
Long, Xiaoping, and Li, Ming,
"Effect of Cu and Ni micro-nanocones interlayer on the growth of tin whisker,"
2019 20th International Conference on Electronic Packaging Technology
, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.
Sun, Xiaowei, Li, Weiming, and Chen, Mingsheng,
"Influence of the BGA solder joint microstructure on the thermal cycling
reliability," 2019 20th International Conference on Electronic Packaging
Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.
Wu, Liang, and Cobley, Andrew J.,
"Investigation into the effects of magnetic agitation and pulsed current on
the development of SnCu alloy electrodeposits," Thin Solid Films,
vol. 683, pp. 118-127, Aug. 1, 2019.
Hasn, S., Vavrik, D., Dusek, K., and Pichotka, M.,
"u-CT investigation of tin whisker growth mechanisms," 21st
International Workshop on Radiation Imaging Detectors, Crete, Greece,
July 7-12, 2019, pp. xx-xx.
Oudat, Osama A., Borra, Vamsi, Georgiev, Daniel G., and Karpov, Victor G.,
"Corrigendum: The statistics of tin whisker diameters versus the underlying
film grains," Journal of Physics D: Applied Physics, vol. 52 no.
24, pp. 249501-1, June 12, 2019.
Niraula, Dipesh,
Physics and applications of conductive filaments in electronic
structures: from metal whiskers to solid state memory. Ph. D. Thesis
for University of Toledo, Toldeo, OH, May 2019.
Illes, Balazs, Hurtony, Tamas, Krammer, Oliver, Batorfi, Reka, Medgyes,
Balint, and Harsanyi, Gabor,
"Early Stage Whisker Development from Sn Thin Film on Cu Substrate,"
2019 42nd International Spring Seminar on Electronics Technology,
Wroclaw, Poland, May 15-19, 2019, pp. xx-xx.
Crandall, Erika,
"Metal Whisker Mitigation Strategies for Press-Fit Pin Connections,"
10th Electronic Materials and Assembly Processes for Space (EMPS)
Workshop, Villepinte, France, May 15-16, 2019, pp. xx-xx.
Pudas, Marko, Kutilainen, Terho, and Hokka, Jussi,
"ALD Coatings Mitigate Tin Whiskers and Upgrade Environmental Durability of
Electronic Circuit Boards," 10th Electronic Materials and Assembly
Processes for Space (EMPS) Workshop, Villepinte, France, May 15-16,
2019, pp. xx-xx.
Wickham, Martin, Kent, Laura, Lewis, Adam, and Clayton, Kate,
"New Results from National Physics Laboratory Whiskers Study - up to 5 years
of testing," 10th Electronic Materials and Assembly Processes for
Space (EMPS) Workshop, Villepinte, France, May 15-16, 2019, pp. xx-xx.
Illes, Balazs, Skwarek, Agata, Ratajczak, Jacek, Dusek, Karel, and Busek,
David,
"The influence of the crystallographic structure of the intermetallic grains
on tin whisker growth," Journal of Alloys and Compounds, vol.
785, pp. 774-780, May 15, 2019.
Wu, Jie, Xue, Songbai, Wang, Jingwen, and Wu, Mingfang,
"Coupling effects of rare-earth Pr and Al2O3 nanoparticles on the
microstructure and properties of Sn-0.3Ag-0.7Cu low-Ag solder," Journal
of Alloys and Compounds, vol. 784, pp. 471-487, May 5, 2019.
Oudat, Osama A., Borra, Vamsi, Georgiev, Daniel G., and Karpov, Victor G.,
"The statistics of tin whisker diameters versus the underlying film grains,"
Journal of Physics D: Applied Physics, vol. 52 no. 16, pp.
165305-1-165305-8, Apr. 17, 2019.
Hektor, Johan, Micha, Jean-Sebastien, Hall, Stephen A., Iyengar, Srinivasan,
and Ristinmaa, Matti,
"Long term evolution of microstructure and stress around tin whiskers
investigated using scanning Laue microdiffraction," Acta Materialia
, vol. 168, pp. 210-221, Apr. 15, 2019.
Hektor, Johan, Hall, Stephen A., Henningsson, N. Axel, Engqvist, Jonas,
Ristinmaa, Matti, Lenrick, Filip, and Wright, Jonathan P.,
"Scanning 3DXRD Measurement of Grain Growth, Stress, and Formation of Cu6Sn5
around a Tin Whisker during Heat Treatment," Materials, vol. 12
no. 3, pp. 446-1-446-16, Feb. 2019.
Lasky, Ronald C., and Balch, Annaka,
"Tin Whiskers 101: 2019," Pan Pacific Symposium 2019 Proceedings,
Kauai, HI, Feb. 11-14, 2019, pp. xx-xx.
Lujan-Regalado, Irene, Kirubanandham, Antony, Williams, Jason J., and Chawla,
Nikhilesh,
"Nucleation and Growth of Tin Hillocks by In Situ Nanoindentation,"
Journal of Electronic Materials, vol. 48 no. 1, pp. 58-71, Jan. 2019.
Chason, Eric, Pei, Fei, Jain, Nupur, and Hitt, Andrew,
"Studying the Effect of Grain Size on Whisker Nucleation and Growth Kinetics
Using Thermal Strain," Journal of Electronic Materials, vol. 48
no. 1, pp. 17-24, Jan. 2019.
Chakraborty, Aritra, and Eisenlohr, Philip,
"Chemo-thermo-mechanically Coupled Crystal Plasticity Simulation of Stress
Evolution in Thermally Strained b-Sn Films," Journal of Electronic
Materials, vol. 48 no. 1, pp. 85-91, Jan. 2019.
NASA Whisker Anecdotes, Jan. 17, 2019.
Dhiman, Rajat,
Design and Qualification of a Robust Polyurethane Based Conformal
Coating Process for SODIMMs. Master's Thesis for State University of
New York at Binghamton, Binghamton, NY, 2018.
Dong, Fei,
Polyurethane-Based Conformal Coatings for Tin Whisker Mitigation.
Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY,
2018.
Haspel, Dan,
Developing a Dual-Layer System for the Mitigation of Tin Whiskers
. Ph. D. Thesis for LOUGHBOROUGH University, Loughborough, United
Kingdom, 2018.
Lin, Kwang-Lung,
Solder Materials. London: World Scientific Publishing, 2018.
ISBN 978-981-3237-60-5.
$143.47 list price.
Mahim, Z., Salleh, M. A. A., and Khor, C. Y.,
"The Effects of Oxidation Layer, Temperature, and Stress on Tin Whisker
Growth: A Short Review," Materials Science and Engineering, vol.
318, pp. 012063-1-012063-6, 2018.
Borra, Vamsi, Oudat, Osama, Georgiev, Daniel G., Karpov, Victor G., and
Shvydka, Diana,
"Metal whisker growth induced by localized, high-intensity DC electric
fields," MRS Advances, vol. 3 no. 57-58, pp. 3367-3372, Nov.
2018.
DOI: https://doi.org/10.1557/adv.2018.374
Bhassyvasantha, S., Fredj, N., Mahapatra, S. D., Jennings, W., Dutta, I., and
Majumdar, B. S.,
"Whisker Mitigation Mechanisms in Indium-Doped Tin Thin Films: Role of the
Surface," Journal of Electronic Materials, vol. 47 no. 10, pp.
6229-6240, Oct. 2018.
Timsitx, Roland S.,
"On the Melting of Ohmic-Heated Nanowires and Electrical Contacts," 2018
IEEE Holm Conference on Electrical Contacts, Albuquerque, NM, Oct.
14-18, 2018, pp. 373-380.
Jackson, Robert L., and Crandall, Erika R.,
"A Multiphysics Coupled Electro-thermo-mechanical Model of Whisker Shorting,"
2018 IEEE Holm Conference on Electrical Contacts, Albuquerque,
NM, Oct. 14-18, 2018, pp. 48-55.
Lasky, Ronald C.,
"Copper-Tin Intermetallics: Their Importance, Growth Rate, and Nature,"
SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18,
2018, pp. xx-xx.
Jagtap, Piyush, Sethuraman, Vijay A., and Kumar, Praveen,
"Critical Evaluation of Relative Importance of Stress and Stress Gradient in
Whisker Growth in Sn Coatings," Journal of Electronic Materials,
vol. 47 no. 9, pp. 5229-5242, Sept. 2018.
Hashim, Aimi Noorliyana, and Salleh, Mohd Arif Anuar Mohd,
"Spontaneous Tin (Sn) Whisker Growth from Electroplated Tin and Lead-Free Tin
Alloys Coatings: A Short Review," Solid State Phenomena, vol.
280, pp. 151-156, Aug. 2018.
Mahim, Z., Ismail, N. A., Salleh, M. A. A. Mohd, and Khor, C. Y.,
"The Effect of Temperature on Tin Whisker Growth under Mechanical Stress,"
Solid State Phenomena, vol. 280, pp. 194-199, Aug. 2018.
Mokhtar, N. Mohd, and Salleh, M. A. A. Mohd,
"Sn Whiskers Nucleation and Growth - Short Review," Solid State
Phenomena, vol. 280, pp. 175-180, Aug. 2018.
Tsukui, Tsutomu, Takeuchi, Yoshihiro, Ueshima, Minoru, Takenaka, Junichi,
Takeuchi, Makoto, Sasaki, Kihichi, Kobayashi, Yoshikazu, and Sasabe, Toshiki,
"Study on Whisker Growth on Solder Joints-Part I: Study on Acceleration Test
Method," IEEE Transactions on Components, Packaging, and Manufacturing
Technology, vol. 8 no. 8, pp. 1477-1486, Aug. 2018.
Jagtap, Piyush, Narayan, P. Ramesh, and Kumar, Praveen,
"Effect of Substrate Composition on Whisker Growth in Sn Coatings,"
Journal of Electronic Materials, vol. 47 no. 7, pp. 4177-4189, July
2018.
Chakraborty, Aritra, and Eisenlohr, Philip,
"A full-field crystal plasticity study on how texture and grain structure
influences hydrostatic stress in thermally strained b-Sn films,"
Journal of Applied Physics, vol. 124 no. 2, pp. 025302-1-025302-8, July
14, 2018.
Delhaise, Andre M., Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, and
Bagheri, Zohreh,
"Evaluation of Tin Whisker Formation in Bismuth-Containing Lead-Free Solder
Alloys After Long-Term Ambient Temperature, High Humidity Storage,"
International Conference for Electronics Enabling Technologies 2018
Proceedings, Markham, Ontario, Canada, June 5-7, 2018, pp. xx-xx.
Bhassyvasantha, Sherin,
Mitigation of Tin Whiskers in Electroplated Tin Coatings by Effective
Doping: The Role of Surface and Subsurface. Master's Thesis for New
Mexico Institute of Mining and Technology, Socorro, NM, May 2018.
Borra, Vamsi, Georgiev, Daniel G., Karpov, V. G., and Shvydka, Diana,
"Microscopic Structure of Metal Whiskers," Physical Review Applied
, vol. 9 no. 5, pp. 054029-1-054029-9, May 2018.
Regalado, Irene Lujan,
Characterization of Thermo-Mechanical Damage in Tin and Sintered
Nano-Silver Solders. Ph. D. Thesis for Arizona State University,
Tempe, AZ, May 2018.
Panashchenko, Lyudmyla,
"Tin Whisker Growth on Sn77.2-In20-Ag2.8 Solder," 2018 CMSE
Components for Military & Space Electronics Training & Exhibition, Los
Angeles, CA, May 7-10, 2018, pp. xx-xx.
Kuwano, Noriyuki, Lias, Marina binti, Nordin, Nur Azmah binti, Soejima,
Youhei, and Nayan, Ahmad Rafiqan bin,
"Preliminary Study on Deformation and Recrystallization Behavior of Pure Tin
for Mitigation of Whisker Growth," Solid State Phenomena, vol.
273, pp. 107-111, Apr. 2018.
Zhang, Xiao, Yang, Yang, Xu, Fangfang, Li, Tie, and Wang, Yuelin,
"In-situ TEM mechanical characterization of nanowire in atomic scale using
MEMS device," Microsystem Technologies, vol. 24 no. 4, pp.
2045-2049, Apr. 2018.
Sun, Menglong, Dong, Mengya, Wang, Dongfan, Ling, Huiqin, Hu, An-min, and Li,
Ming,
"Growth behavior of tin whisker on SnAg microbump under compressive stress,"
Scripta Materialia, vol. 147, pp. 114-118, Apr. 1, 2018.
Wickham, Martin,
"Tin Whiskers on PCBs," Printed Circuit Design and Fab/ Circuits
Assembly, vol. 35 no. 4, pp. 89, Apr. 2018.
Hektor, Johan, Marijon, Jean-Baptiste, Ristinmaa, Matti, Hall, Stephen A.,
Hallberg, Hakan, Iyengar, Srinivasan, Micha, Jean-Sebastien, Robach, Odile,
Grennerat, Fanny, and Castelnau, Olivier,
"Evidence of 3D strain gradients associated with tin whisker growth,"
Scripta Materialia, vol. 144, pp. 1-4, Feb. 2018.
Huang, Chien-Ming, Nunez, Daniel, Coburn, James, and Pecht, Michael,
"Risk of tin whiskers in the nuclear industry," Microelectronics
Reliability, vol. 81, pp. 22-30, Feb. 2018.
Chason, Eric, Vasquez, Justin, Pei, Fei, Jain, Nupur, and Hitt, Andrew,
"Quantifying the Effect of Stress on Sn Whisker Nucleation Kinetics,"
Journal of Electronic Materials, vol. 47 no. 1, pp. 103-109, Jan. 2018.
Illes, Balazs, Horvath, Barbara, Geczy, Attila, Krammer, Oliver, and Dusek,
Karel,
"Corrosion-induced tin whisker growth in electronic devices: a review,"
Soldering & Surface Mount Technology, vol. 29 no. 1, pp. 59-68,
2017.
Maganty, Suraj,
Enhanced Conformal Coatings for Tin Whisker Mitigation. Ph. D.
Thesis for State University of New York at Binghamton, Binghamton, NY, 2017.
Pandian, Guru Prasad,
Effect of Long-term Aging on Lead-free Solder (SAC405) and Surface
Finish (Pure Tin). Master's Thesis for University of Maryland,
College Park, MD, 2017.
Starkey, Pete,
"Tin Whisker mitigation methodologies," Transactions of the IMF,
vol. 95 no. 4, pp. 180-182, 2017.
https://doi.org/10.1080/00202967.2017.1283896
Wickham, Martin, Lewis, Adam, and Clayton, Kate,
"1000 Days of Testing Tin Whiskering PCB Assemblies to Determine the
Suitability of Conformal Coatings to Mitigate Against Shorting," SMTA
Journal, vol. 30 no. 4, pp. 22-30, 2017.
Zhao, Heng, Liu, Qing-bin, Lan, Yuan-pei, Wang, Hua, and Yao, Da-wei,
"The Application and Research Status of Tin Whisker Formation in Electric
Usage," AIP Conference Proceedings, vol. 1839, pp.
020003-1-020003-10, 2017.
https://doi.org/10.1063/1.4982368
Borra, Venkata Shesha Vamsi,
Metal Whiskers: The Role of Electric Fields in the Formation Mechanism
and Methods for Whisker Growth Mitigation. Ph. D. Thesis for
University of Toledo, Toledo, OH, Dec. 2017.
Sun, Menglong, Long, Xiaoping, Dong, Mengya, Xia, Yuanyuan, Hu, Fengtian, Hu,
An-min, and Li, Ming,
"Mitigation of tin whisker growth by inserting Ni nanocones," Materials
Characterization, vol. 134, pp. 354-361, Dec. 2017.
Wu, Jie, Xue, Songbai, Wang, Jingwen, and Wang, Jianxin,
"Comparative studies on microelectronic reliability issue of Sn whisker growth
in Sn-0.3Ag-0.7Cu-1Pr solder under different environments,"
Microelectronics Reliability, vol. 79, pp. 124-135, Dec. 2017.
Borra, Vamsi, Itapu, Srikanth, and Georgiev, Daniel G.,
"Sn whisker growth mitigation by using NiO sublayers," Journal of
Physics D: Applied Physics, vol. 50 no. 47, pp. 475309-1-475309-7, Nov.
29, 2017.
Mahapatra, S. Das, and Dutta, I.,
"Role of surface oxide in mitigating tin whisker growth: A finite element
study," Materials Science and Engineering: A, vol. 706, pp.
181-191, Oct. 26, 2017.
https://doi.org/10.1016/j.msea.2017.09.006
He, Flora, Fung, Alex, Li, Crystal, Chan, Dennis, Yip, Derek, Yee, Dennis,
Cao, Shuzhao, and Cao, Xi,
"Studies of Tin Whisker Growth under High External Pressure," 2017 12th
International Microsystems, Packaging, Assembly and Circuits Technology
Conference, Taipei, Taiwan, Oct. 25-27, 2017, pp. 102-106.
Borra, Vamsi, and Georgiev, Daniel G.,
"Part - 2: Whisker characterization," Tin Whisker Group teleconference,
October 18, 2017.
Brusse, Jay,
Metal whisker growing from the header/seal area of a package enclosure for a
crystal, Youtube, Oct. 16, 2017.
Killefer, Morgan, Borra, Vamsi, Al-Bayati, Ahmed, Georgiev, Daniel G., Karpov,
Victor G., Parsai, E. Ishmael, and Shvydka, Diana,
"Whisker growth on Sn thin film accelerated under gamma-ray induced electric
field," Journal of Physics D: Applied Physics, vol. 50 no. 40,
pp. 405302-1-405302-7, Oct. 11, 2017.
Borra, Vamsi, and Georgiev, Daniel G.,
"Part - 1: Whisker characterization," Tin Whisker Group teleconference,
October 11, 2017.
Chen, Yujie, An, Xianghai, and Liao, Xiaozhou,
"Mechanical behaviors of nanowires," Applied Physics Reviews,
vol. 4 no. 3, pp. 031104-1-031104-29, Sept. 2017.
https://doi.org/10.1063/1.4989649
Lasky, Ronald C., Nash, Christopher, Hall, W. James, and Zarrow, Phil,
"RoHS: How Has it Gone Eleven Years Later," SMTA International 2017
Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 833-842.
Wickham, Martin, Lewis, Adam, and Clayton, Kate,
"1000 Days of Testing Tin Whiskering PCB Assemblies to Determine the
Suitability of Conformal Coatings to Mitigate Against Shorting," SMTA
International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp.
1007-1014.
Yang, Fuqian, and Shi, Yu,
"Analysis of whisker growth on a surface of revolution," Physics Letters
A, vol. 381 no. 34, pp. 2767-2771, Sept. 12, 2017.
Hayashi, Yujiro, Setoyama, Daigo, and Seno, Yoshiki,
"Scanning Three-Dimensional X-Ray Diffraction Microscopy with a High-Energy
Microbeam at SPring-8," Materials Science Forum, vol. 905, pp.
157-164, Aug. 2017.
Killefer, Morgan,
Whisker Growth Induced by Gamma Radiation on Glass Coated with Sn Thin
Films. Master's Thesis for University of Toledo, Toledo, OH, Aug.
2017.
Jagtap, Piyush, Chakraborty, Aritra, Eisenlohr, Philip, and Kumar, Praveen,
"Identification of whisker grain in Sn coatings by analyzing crystallographic
micro-texture using electron back-scatter diffraction," Acta Materialia
, vol. 134, pp. 346-359, Aug. 1, 2017.
Wu, Jie, Xue, Songbai, Wang, Jingwen, Wang, Jianxin, and Liu, Shuang,
"Effect of Pr addition on properties and Sn whisker growth of Sn-0.3Ag-0.7Cu
low-Ag solder for electronic packaging," Journal of Materials Science:
Materials in Electronics, vol. 28 no. 14, pp. 10230-10244, July 2017.
Krammer, Oliver, Illes, Balazs, Batorfi, Reka, and Dusek, Karel,
"Automatic characterisation method for statistical evaluation of tin whisker
growth," Microelectronics Reliability, vol. 73, pp. 14-21, June
2017.
Hillman, David,
"Characterization of the Capability of Conformal Coating to Inhibit Tin
Whisker Growth," International Conference on Soldering & Reliability
2017 Proceedings, Toronto, Ontario, Canada, June 6-8, 2017, pp. xx-xx.
Mahapatra, S. Das, Majumdar, B. S., Dutta, I., and Bhassyvasantha, S.,
"Eliminating Whisker Growth by Indium Addition in Electroplated Sn on Copper
Substrate," Journal of Electronic Materials, vol. 46 no. 7, pp.
4062-4075, July 2017.
Subedi, Biwas, Niraula, Dipesh, and Karpov, Victor G.,
"The stochastic growth of metal whiskers," Applied Physics Letters
, vol. 110 no. 25, pp. 251604-1-251604-5, June 19, 2017.
Wickham, Martin, Gopee, Vimal, Lewis, Adam, Clayton, Kate, and Thomas, Owen,
"Tin Whiskers Testing Using Conformal Coatings as a Mitigation," Tin
Whisker Group teleconference, July 19, 2017.
Shvydka, Diana, Killefer, Morgan, Borra, Vamsi, Georgiev, Daniel G., Karpov,
Victor G., and Parsai, E. Ishmael,
"Whisker growth on Sn thin film accelerated under gamma-ray induced electric
field,", Tin Whisker Group teleconference, July 12, 2017.
Karpov, Victor,
"The stochastic growth of metal whiskers (presentation)," Tin Whisker Group
teleconference, June 7, 2017.
Subedi, Biswas, Niraula, Dipesh, and Karpov, Victor G.,
"Stochastic growth of metal whiskers (Presentation),"
All Documents on Tin Whiskers in Reverse
Chronological Order (revised 12/10/2020)
Please note: if a web page doesn't have a date, the date that I
found it is in parentheses.
Articles In Press: 0 books, 0 theses, 0 papers, and 0 web pages on tin
whiskers
2021: 0 books, 0 theses, 1 paper, and 0 web pages on tin whiskers
Tian, Shuang, Cao, Ruihua, Zhou, Jian, Xue, Feng, Liu, Yushuang, Zhang,
Peigen, and Sun, ZhengMing,
"A comparative study on the growth behaviors of Sn whiskers and hillocks in a
Sn-Al alloy coating under different environments," Journal of Alloys and
Compounds, vol. 853, pp. 157101-1-157101-12, Feb. 5, 2021.
https://doi.org/10.1016/j.jallcom.2020.157101
2020: 0 books, 0 theses, 23 papers, and 3 web pages on tin whiskers
Bagheripoor, Mahdi, and Klassen, Robert,
"Effect of crystal orientation on the size effects of nano-scale fcc metals,"
Materials Science and Technology, vol. 36 no. 17, pp. 1829-1850,
2020.
https://doi.org/10.1080/02670836.2020.1839193
2019: 0 books, 2 theses, 36 papers, and 1 web page on tin whiskers
Chakraborty, Aritra,
Using Chemo-Thermo-Mechanically Coupled Crystal Plasticity Simulations
to Investigate the Process of Whisker Formation in b-Sn Thin Films.
Ph. D. Thesis for Michigan State University, East Lansing, MI, 2019.
2018: 1 book, 5 theses, 24 papers, and 0 web pages on tin whiskers
Alagarsamy, Karthik, Kohani, Mehdi, Fortier, Aleksandra, and Pecht, Michael
G.,
"Risk of Tin Whiskers in Medical Devices," Journal of Biomedical
Engineering and Research, vol. 2 no. 101, pp. 1-10, 2018.
2017: 0 books, 5 theses, 45 papers, and 2 web pages on tin whiskers
Amin, N. L. M., Yusof, S. Z., Kahar, M. N. A., Bakar, T. A. A., O, A., and
Fadil, N. A.,
"Tin Whiskers Formation and Growth on Immersion Sn Surface Finish under
External Stresses by Bending," Materials Science and Engineering,
vol. 238, pp. 012001-1-012001-5, 2017.
Subedi, Biswas, Niraula, Dipesh, and Karpov, Victor G., "The stochastic growth of metal whiskers (paper)," Tin Whisker Group teleconference, June 7, 2017.
Vallabhaneni, Venkata Sathya Sai Renuka, Environmental-Induced Damage in Tin (Sn) and Aluminum (Al) Alloys . Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2017.
Mahapatra, S. Das, Majumdar, B. S., and Dutta, I., "Elimination of Tin Whisker Growth by Indium Addition to Electroplated Tin in Electronic Packages," 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 30-June 2, 2017, pp. 1425-1432.
Ashworth, M. A., Pearson, H., Wilcox, G. D., Bao, X., and Brightwell, C., "The Development of a Tin-Whisker Mitigating Conformal Coating," 8th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Noordwijk, the Netherlands, May 10-12, 2017, pp. xx-xx.
Haspel, D. M., Ashworth, M. A., Wilcox, G. D., and Bao, X., "The Use of Post-Electroplating Surface Modification Treatments to Mitigate Tin Whisker Growth," 8th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Noordwijk, the Netherlands, May 10-12, 2017, pp. xx-xx.
Pudas, Marko, "Atomic Layer Deposition (ALD) for Tin Whisker Mitigation on Pb-free Surfaces (2015-2016)," 8th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Noordwijk, the Netherlands, May 10-12, 2017, pp. xx-xx.
Wickham, Martin, Lewis, Adam, Clayton, Kate, and Thomas, Owen, "1000 Days of Tin Whiskers Testing Using Conformal Coatings as a Mitigation," 8th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Noordwijk, the Netherlands, May 10-12, 2017, pp. xx-xx.
Gopee, Vimal, "UV Inspection and Thickness Measurement of Conformal Coatings," NPL Webinar, May 9, 2017.
Zhang, Zhihao, Cao, Huijun, Xiao, Yong, Cao, Yong, Li, Mingyu, and Yu, Yuxi, "Electromigration-induced growth mode transition of anodic Cu6Sn5 grains in Cu|SnAg3.0Cu0.5|Cu lap-type interconnects," Journal of Alloys and Compounds, vol. 703, pp. 1-9, May 5, 2017.
Pei, Fei, Buchovecky, Eric, Bower, Allan, and Chason, Eric, "Stress evolution and whisker growth during thermal cycling of Sn films: A comparison of analytical modeling and experiments," Acta Materialia , vol. 129, pp. 462-473, May 1, 2017.
Liu, Y., Zhang, P., Ling, C., Ding, J., Tian, W. B., Zhang, Y. M., and Sun, Z. M., "Spontaneous Sn whisker formation on Ti2SnC," Journal of Materials Science: Materials in Electronics, vol. 28 no. 8, pp. 5788-5795, Apr. 2017.
Bozack, Michael J., Snipes, Erica K., and Flowers, George T., "Influence of Small Weight Percentages of Bi and Systematic Coefficient of Thermal Expansion Variations on Sn Whiskering," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 7 no. 3, pp. 338-344, Mar. 2017.
Yin, Qiyue, Gao, Fan, Wang, Jirui, Gu, Zhiyong, Stach, Eric A., and Zhou, Guangwen, "Length-dependent melting behavior of Sn nanowires," Journal of Materials Research, vol. 32 no. 6, pp. 1194-1202, Mar. 2017.
Reducing tin whisker related failures in electronics, Youtube, Mar. 31, 2017.
Wu, L., Ashworth, M. A., and Wilcox, G. D., "Investigation of Whisker Growth from Alkaline Non-cyanide Zinc Electrodeposits," Journal of Electronic Materials, vol. 46 no. 2, pp. 1114-1127, Feb. 2017.
Sharma, Ashutosh, Das, Siddhartha, and Das, Karabi, "Effect of different electrolytes on the microstructure, corrosion and whisker growth of pulse plated tin coatings," Microelectronic Engineering , vol. 170, pp. 59-68, Feb. 25, 2017.
Illes, Balazs, Skwarek, Agata, Batorfi, Reka, Ratajczak, Jacek, Czerwinski, Andrzej, Krammer, Oliver, Medgyes, Balint, Horvath, Barbara, and Hurtony, Tamas, "Whisker growth from vacuum evaporated submicron Sn thin films," Surface and Coatings Technology, vol. 311, pp. 216-222, Feb. 15, 2017 https://doi.org/10.1016/j.surfcoat.2017.01.011
Zhao, L., Chakraborty, P., Tonks, M. R., and Szlufarska, I., "On the plastic driving force of grain boundary migration: A fully coupled phase field and crystal plasticity model," Computational Materials Science, vol. 128, pp. 320-330, Feb. 15, 2017.
Sellers, Keith M., "Got Whiskers?," Surface Mount Technology (SMT), vol. 32 no. 1, pp. 92,94, Jan. 2017.
Dunn, Barrie D., Materials and Processes for Spacecraft and High Reliability Applications . Chichester, United Kingdom: Springer, 2016. ISBN 978-3-319-79474-7. $154.26 list price.
Harpaintner, Alfons, "Whisker Growth and Mitigation," Wurth Elektronik White Paper WPP001, 2016.
Kato, Takahiko, Handwerker, Carol A., and Bath, Jasbir, Mitigating Tin Whisker Risks: Theory and Practice. Hoboken, NJ: IEEE Press, 2016. ISBN 9780470907238.
Kosiba, Eva, Characterization of Low Melting Temperature, Low-Ag, Bi-Containing, Pb-Free Solder Alloys. Master's Thesis for University of Toronto, Toronto, Canada, 2016.
Li, M. Y., Yang, H. F., Zhang, Z. H., Gu, J. H., and Yang, S. H., "Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention," Scientific Reports, vol. 6, pp. 27522-1-27522-10, 2016. https://doi-org.ezproxy.uky.edu/10.1038/srep27522
Mahan, Kenneth Howard, Advanced Adhesion Strength Testing Methods of Thin Film Multilayers in Electronic Packaging Systems. Ph. D. Thesis for University of Maryland, College Park, MD, 2016.
Misner, Bruce M., "Validated Solder Coverage for Tin Whisker Mitigation of 0402 Ceramic Capacitors: An Exercise in Technically Sound Cost Reduction," SMTA Journal, vol. 29 no. 3, pp. 25-29, 2016.
Elnyakov, Dmitry, Kalmykov, Konstantin, Tarelkin, Sergey, and Dunaev, Sergey, "Isothermal sections of Tm-Ag-Sn and Lu-Ag-Sn ternary systems at 873 K," Journal of Alloys and Compounds, vol. 688 pt. B, pp. 828-839, Dec. 15, 2016.
Sanchez-Soares, Alfonso, and Greer, James C., "A Semimetal Nanowire Rectifier: Balancing Quantum Confinement and Surface Electronegativity," Nano letters, vol. 16 no. 12, pp. 7639-7644, Dec. 14, 2016. DOI: 10.1021/acs.nanolett.6b03612
Yang, Fuqian, "A Nonlinear Viscous Model for Sn-Whisker Growth," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 47 no. 12, pp. 5882-5889, Dec. 2016. https://doi.org/10.1007/s11661-016-3530-7
Chen, Wei-Hsun, Sarobol, Pylin, Handwerker, Carol A., and Blendell, John E., "Heterogeneous Stress Relaxation Processes at Grain Boundaries in High-Sn Solder Films: Effects of Sn Anisotropy and Grain Geometry During Thermal Cycling," JOM, vol. 68 no. 11, pp. 2888-2899, Nov. 2016.
Jagtap, Piyush, and Kumar, Praveen, "Macro and Micro-Texture Study for Understanding Whisker Growth in Sn Coatings," 2016 IEEE 18th Electronics Packaging Technology Conference , Singapore, Nov. 30-Dec. 3, 2016, pp. 165-170.
Hwang, Jennie S., "The Theory Behind Tin Whisker Phenomena, Part 5," Surface Mount Technology (SMT), vol. 31 no. 11, pp. 12,14, Nov. 2016.
Xue, Weihuang, and Gu, Wenhua, "Conductivity size effect of polycrystalline metal nanowires," AIP Advances, vol. 6 no. 11, pp. 115001-1-115001-8, Nov. 2016.
Bhatia, M. A., Adlakha, I., Lu, G., and Solanki, K. N., "Generalized stacking fault energies and slip in b-tin," Scripta Materialia, vol. 123, pp. 21-25, Oct. 2016.
Bozack, M. J., Snipes, S. K., and Flowers, G. N., "Methods for fast, reliable growth of Sn whiskers," Surface Science , vol. 652, pp. 355-366, Oct. 2016. https://doi.org/10.1016/j.susc.2016.01.010
Hwang, Jennie S., "The Theory Behind Tin Whisker Phenomena, Part 4," Surface Mount Technology (SMT), vol. 31 no. 9, pp. 12,14,16, Sept. 2016.
Pinsky, David, Hester, Tom, Touw, Anduin, and Hillman, Dave, "Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin," Surface Mount Technology (SMT), vol. 31 no. 9, pp. 36,38-42,44-45, Sept. 2016.
Zhang, Liang, Yang, Fan, and Zhong, Su-juan, "Effect of Nd on whiskers growth behavior of SnAgCu solders in electronic packaging," Journal of Materials Science: Materials in Electronics , vol. 27 no. 9, pp. 9584-9588, Sept. 2016.
Rafanelli, Anthony J., "Living With Pb-Free in High Performance Engineering Design," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 407-412.
Ansari, Lida, Fagas, Giorgos, and Greer, James C., "Strain induced effects on electronic structure of semi-metallic and semiconducting tin nanowires," Applied Physics Letters, vol. 105 no. 12, pp. 123105-1-123105-4, Sept. 22, 2016.
McKeown, S., Meschter, S., Snugovsky, P., Kennedy, J., Bagheri, Z., Keeping, J., Cho, J., Edwards, D., and Elsken, K., "Strategic Environmental Research and Development Program (SERDP) Nanoparticle enhanced conformal coating project: Coating modeling for tin whisker mitigation," Tin Whisker Group teleconference, Sept. 7, 2016.
Liu, Y., Zhang, P., Zhang, Y. M., Ding, J., Shi, J. J., and Sun, Z. M., "Spontaneous growth of Sn whiskers and a new formation mechanism," Materials Letters, vol. 178, pp. 111-114, Sept. 1, 2016.
Meschter, Stephan, "Enabling Lead-free in the DoD through Risk Mitigation: Program Management and Systems Engineering Overview," Tin Whisker Group teleconference, Aug. 24, 2016.
Philippi, Bastian, Kirchlechner, Christoph, Micha, Jean Sebastien, and Dehm, Gerhard, "Size and orientation dependent mechanical behavior of body-centered tetragonal Sn at 0.6 of the melting temperature," Acta Materialia , vol. 115, pp. 76-82, Aug. 15, 2016.
Pecht, Michael, Shibutani, Tadahiro, and Wu, Lifeng, "A reliability assessment guide for the transition planning to lead-free electronics for companies whose products are RoHS exempted or excluded," Microelectronics Reliability, vol. 62, pp. 113-123, July 2016.
Wickham, Martin, Thomas, Owen, Clayton, Kate, Lewis, Adam, and Hunt, Chris, "How Good Are Conformal Coatings at Preventing Sn Whisker Failures?," National Physical Laboratory, July 20, 2016.
Zhang, Liang, Yang, Fan, and Zhong, Su-juan, "Whisker growth on SnAgCu-xPr solders in electronic packaging," Journal of Materials Science: Materials in Electronics, vol. 27 no. 6, pp. 5618-5621, June 2016.
Landman, Bob, Davy, Gordon, and Fritz, Dennis, "Preventing Tin Whisker Growth Risk," Tin Whisker Group teleconference, June 15, 2016.
Tsujimoto, Masanobu, Hashimoto, Shigeo, Kiso, Masayuki, Ikumoto, Raihei, Kano, Toshikazu, Kanamori, Genki, Gudeczauskas, Don, and Gruenwald, Al, "The Elimination of Whiskers from Electroplated Tin, NASF SURFIN 2016, Las Vegas, NV, June 6, 2016, pp. xx-xx.
Banerjee, S., Dutta, I., and Majumdar, B. S., "A molecular dynamics evaluation of the effect of dopant addition on grain boundary diffusion in tin: Implication for whisker growth," Materials Science and Engineering: A, vol. 666, pp. 191-198, June 1, 2016.
Smith, Steve, "Tin whisker captivation by the Whisker-Tough Magnum(TM) conformal coating," Tin Whisker Group teleconference, June 1, 2016.
Rollins, Bill, "Engineering Requirements for a Tin-Whisker-Risk-Controlling Conformal Coating to be used in a Missile," Tin Whisker Group teleconference, June 1, 2016.
Fortier, Aleksandra, Kong, Fanrong, and Kovacevic, Radovan, "Fundamental FEM Modeling Approach of Residual Stress Propagation in Sn-Based Electroplated Films Prone to Sn Whiskers Growth," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 6 no. 5, pp. 805-813, May 2016.
Busek, David, Vavra, Jan, and Dusek, Karel, "Whisker growth and its dependence on substrate type and applied stress," 2016 39th International Spring Seminar on Electronics Technology, Pilsen, Czech Republic, May 18-22, 2016, pp. 263-266.
Illes, Balazs, Skwarek, Agata, Krammer, Oliver, Medgyes, Balint, Horvath, Barbara, and Batorfi, Reka, "Tin Whisker Growth from Tin Thin Film," 2016 39th International Spring Seminar on Electronics Technology, Pilsen, Czech Republic, May 18-22, 2016, pp. 173-178.
Stoyanov, Stoyan, Stewart, Paul, and Bailey, Chris, "Vulnerability Study of Hot Solder Dipped COTS Components," 2016 39th International Spring Seminar on Electronics Technology, Pilsen, Czech Republic, May 18-22, 2016, pp. 193-198.
Pinsky, David, Hester, Tom, Touw, Anduin, and Hillman, Dave, "Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow." Tin Whisker Group teleconference, May 18, 2016.
Dutta, Indranath, and Majumdar, Bhaskar, "Rationale for the Auger Studies," Tin Whisker Group teleconference, May 11, 2016.
Mahapatra, S. Das, Meinshausen, L., Bhassyvasantha, S., Yang, H., Banerjee, S., Majumdar, B. S., and Dutta, I., "Influence of Indium Addition on Whisker Growth in Electroplated Tin," Tin Whisker Group teleconference, May 11, 2016.
Meschter, S., Cho, J., Maganty, S., Edwards, D., Romansky, M., Keeping, J., Snugovsky, P., McMahon, J., Bagheri, Zohreh, and Kennedy, J., "Strategic Environmental Research and Development Program (SERDP) Layered Nanoparticle Enhanced Conformal Coating for Whisker Mitigation," International Conference on Soldering & Reliability 2016 Proceedings , Toronto, Ontario, Canada, May 9-11, 2016, pp. xx-xx.
Snugovsky, Polina, Meschter, Stephan, Kennedy, Jeff, and Bagheri, Zohreh, "REMAP Materials Project M2: High Temperature High Humidity Corrosion and Tin Whisker Evaluation of Bi Containing Lead-Free Alloys," International Conference on Soldering & Reliability 2016 Proceedings, Toronto, Ontario, Canada, May 9-11, 2016, pp. xx-xx.
Janata, Jiri, "The Chalkboard: Work Function in Electrochemistry," Electrochemical Society Interface, vol. 25 no. 4, pp. 56-58, Winter 2016.
Chen, Hao, Lee, Hsin Yi, Ku, Ching Shun, and Wu, Albert T., "Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures," Journal of Materials Science, vol. 51 no. 7, pp. 3600-3606, Apr. 2016.
Kim, Sang Hoon, Hui, Kwun Nam, Kim, Yong-Jin, Lim, Tae-Soo, Yang, Dong-Yeol, Kim, Ki Bong, Kim, Young Ja, and Yang, Sangsun, "Oxidation resistant effects of Ag2S in Sn-Ag-Al solder: A mechanism for higher electrical conductivity and less whisker growth," Corrosion Science, vol. 105, pp. 25-35, Apr. 2016.
Xue, Peng, Wang, Ke-Hong, Zhou, Qi, Huang, Jun, Long, Wei-min, and Zhang, Qing-ke, "Effect of Nd on tin whisker growth in Sn-Zn soldered joint," Journal of Materials Science: Materials in Electronics, vol. 27 no. 4, pp. 3742-3747, Apr. 2016.
Anderson, Antony F., "Case Study: NHTSA's Denial of Dr Raghavan's Petition to Investigate Sudden Acceleration in Toyota Vehicles Fitted With Electronic Throttles," IEEE Access, Apr. 21, 2016.
Iwamoto, Hiroyuki, Munekata, Osamu, and Tsuruta, Kaichi, "Study on the Mitigation Solder of the External Stress Type Whisker," 2016 International Conference on Electronics Packaging, Hokkaido, Japan, Apr. 20-22, 2016, pp. 333-336.
Hektor, Johan, Ristinmaa, Matti, Hallberg, Hakan, Hall, Stephen A., and Iyengar, Srinivasan, "Coupled diffusion-deformation multiphase field model for elastoplastic materials applied to the growth of Cu6Sn5," Acta Materialia, vol. 108, pp. 98-109, Apr. 15, 2016.
Haspel, Dan, Ashworth, Mark, Wilcox, Geoff, and Mortimer, Roger, "The Development of Post-Electroplating Surface Modification Treatments to Mitigate Tin Whisker Growth," 7th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Portsmouth, United Kingdom, Apr. 13-14, 2016, pp. xx-xx.
Pinsky, David, Hester, Tom, Touw, Anduin, and Hillman, Dave, "Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin," 7th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Portsmouth, United Kingdom, Apr. 13-14, 2016, pp. xx-xx.
Pudas, Marko, Kutilainen, Terho, Collander, Paul, Wang, Jing, Ashworth, Mark A., Wilcox, Geoffrey D., and Hokka, Jussi, "Atomic Layer Deposition (ALD) for Tin Whisker Mitigation on Pb-free Surfaces," 7th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Portsmouth, United Kingdom, Apr. 13-14, 2016, pp. xx-xx.
Bhattacharya, Sumit, Sharma, Ashutosh, Das, Siddhartha, and Das, Karabi, "Synthesis and Properties of Pulse Electrodeposited Lead-Free Tin-Based Sn/ZrSiO4 Nanocomposite Coatings," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 47 no. 3, pp. 1292-1312, Mar. 2016. https://doi.org/10.1007/s11661-015-3313-6
Pei, Fei, Jadhav, Nitin, Buchovecky, Eric, Bower, Allan F., Chason, Eric, Liu, Wenjun, Tischler, Jonathan Z., Ice, Gene E., and Xu, Ruqing, "In-situ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation," Journal of Applied Physics, vol. 119 no. 10, pp. 105302-1-105302-11, Mar. 14, 2016.
Wang, Fei, and Nestler, Britta, "Detachment of nanowires driven by capillarity," Scripta Materialia , vol. 113, pp. 167-170, Mar. 1, 2016.
Borra, Vamsi, Georgiev, Daniel G., and Karpov, Victor G., "Cultivating Metal Whiskers by Surface Plasmon Polariton Excitation," MRS Advances, vol. 1 no. 12, pp. 805-810, Feb. 2016. https://doi.org/10.1557/adv.2016.160
Shvydka, Diana, and Karpov, V. G., "Surface parameters determining a metal propensity for whiskers," Journal of Applied Physics, vol. 119 no. 8, pp. 085301-1-085301-8, Feb. 28, 2016.
Walsh, F. C., and Low, C. T. J., "A review of developments in the electrodeposition of tin," Surface and Coatings Technology, vol. 288, pp. 79-94, Feb. 25, 2016. https://doi.org/10.1016/j.surfcoat.2015.12.081
Ma, Limin, Zuo, Yong, Liu, Sihan, Guo, Fu, Lee, Andre, and Subramanian, K. N., "Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders," Journal of Alloys and Compounds, vol. 657, pp. 400-407, Feb. 5, 2016.
Ma, Limin, Zuo, Yong, Liu, Sihan, and Guo, Fu, "Whisker Growth Behavior of Sn58Bi Solder Coatings Under Isothermal Aging," Journal of Electronic Materials, vol. 45 no. 1, pp. 44-50, Jan. 2016.
Meinshausen, L., Bhassyvasantha, S., Majumdar, B. S., and Dutta, I., "Influence of Indium Addition on Whisker Mitigation in Electroplated Tin Coatings on Copper Substrates," Journal of Electronic Materials, vol. 45 no. 1, pp. 791-801, Jan. 2016.
Pei, Fei, Bower, Allan F., and Chason, Eric, "Quantifying the Rates of Sn Whisker Growth and Plastic Strain Relaxation Using Thermally-Induced Stress," Journal of Electronic Materials, vol. 45 no. 1, pp. 21-29, Jan. 2016.
Zhu, Yong, "In Situ Nanomechanical Testing of Crystalline Nanowires in Electron Microscopes," JOM, vol. 68 no. 1, pp. 84-93, Jan. 2016.
NASA Other Metal Whiskers, Jan. 4, 2016.
Hom, Bance, and Winkler, Sandra, "History repeats itself in the form of matte tin," Advanced Packaging, vol. xx no. xx, pp. xx-xx, ??. (2015)
Janiuk, Szymon, Tin Whisker Growth and Mitigation with a Nanocrysytalline Nickel Coating . Master's Thesis for University of Toronto, Toronto, Ontario, Canada, 2015.
Lim, Hooi Peng, Ourdjini, Ali, Bakar, Tuty Asma Abu, and Tesfamichael, Tuquabo, "The effects of humidity on tin whisker growth by immersion tin plating and tin solder dipping surface finishes," Procedia Manufacturing, vol. 2, pp. 275-279, 2015. https://doi.org/10.1016/j.promfg.2015.07.048
McKeown, Stephen A., Meschter, Stephan J., Snugovsky, Polina, and Kennedy, Jeffery, "SERDP Tin Whisker Testing and Modeling: Simplified Whisker Risk Model Development," SMTA Journal, vol. 28 no. 1, pp. 13-29, 2015.
Tokio, Kanae, "Sn Plating to Replace Sn-Pb Plating," Journal of The Surface Finishing Society of Japan, vol. 66 no. 5, pp. 191-194, 2015.
Zhang, P., Zhang, Y. M., and Sun, Z. M., "Spontaneous Growth of Metal Whiskers on Surfaces of Solids: A Review," Journal of Materials Science and Technology, vol. 31 no. 7, pp. 675-698, 2015. DOI: 10.1016/j.jmst.2015.04.001
Vasko, Anthony C., Grice, Corey R., Kostic, Andrew D., and Karpov, Victor G., "Evidence of electric-field-accelerated growth of tin whiskers," MRS Communications, vol. 5 no. 4, pp. 619-622, Dec. 2015.
Vianco, P. T., and Neilsen, M. K., "Dynamic Recrystallization Model for Whisker and Hillock Growth," Sandia Report SAND2015-9335J, 2015.
Vianco, P. T., and Neilsen, M. K., "Dynamic Recrystallization Model for Whisker and Hillock Growth," Sandia Report SAND2015-6236J, 2015.
Eckold, P., Sellers, M. S., Niewa, R., and Hugel, W., "The surface energies of b-Sn - A new concept for corrosion and whisker mitigation," Microelectronics Reliability, vol. 55 no. 12 pt. B, pp. 2799-2807, Dec. 2015.
Hillman, Dave, Wilcoxon, Ross, Lower, Nate, and Grossman, Dan, "Alkali Silicate Glass Coatings for Mitigating the Risks of Tin Whiskers," Journal of Electronic Materials, vol. 44 no. 12, pp. 4864-4883, Dec. 2015.
Chen, Jie Shi, Ye, Cheng Hui, Chen, Jun Mei, Xu, Ji Jin, Yu, Chun, and Lu, Hao, "Sn whiskers mitigation by refining grains of Cu substrate during the room temperature exposure," Materials Letters, vol. 161, pp. 201-204, Dec. 15, 2015.
Chason, Eric, and Pei, Fei, "Sn whisker formation as a stress-induced nucleation and growth process," Tin Whisker Group teleconference, Dec. 9, 2015.
Hwang, Jennie S., "A Look at the Theory behind Tin Whisker Phenomena, Part 3," Surface Mount Technology (SMT), vol. 30 no. 11, pp. 12,14-15, Nov. 2015.
Rohwer, Lauren E. S., and Martin, James E., "Platelet Composite Coatings for Tin Whisker Mitigation," Journal of Electronic Materials, vol. 44 no. 11, pp. 4424-4433, Nov. 2015. (Sandia Report SAND2015-8335J)
Niraula, D., and Karpov, V. G., "The probabilistic distribution of metal whisker lengths," Journal of Applied Physics, vol. 118 no. 20, pp. 205301-1-205301-5, Nov. 28, 2015.
Soviet ILS teardown with a tin whiskers surprise, Youtube, Nov. 27, 2015.
"What are Tin Whiskers?." (before Nov. 22, 2015)
"What Are Tin Whiskers?" (before Nov. 22, 2015)
Sn Whisker (before Nov. 14, 2015)
Whisker growth over a 12 minute period (before Nov. 14, 2015)
Whisker growth over a 19 minute period (before Nov. 14, 2015)
Karpov, Victor,
"Verifying the electrostatic theory of whiskers," Tin Whisker Group
teleconference, Nov. 11, 2015.
Chiu, Yi-Hsin, Minutillo, Nicholas G., Williams, Robert E. A., Smith, Greg J.,
McComb, David W., Carlin, John A., Johnston-Halperin, Ezekiel, and Yang,
Fengyuan,
"Photoluminescence evolution in GaAs/AlGaAs core/shell nanowires grown by
MOCVD: Effects of core growth temperature and substrate orientation,"
Journal of Crystal Growth, vol. 429, pp. 1-5, Nov. 1, 2015.
Chang, Jaewon, Kang, Sung K., Lee, Jae-Ho, Kim, Keun-Soo, and Lee, Hyuck Mo,
"Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed
Sn Films," Journal of Electronic Materials, vol. 44 no. 10, pp.
3486-3499, Oct. 2015.
Chason, Eric, and Pei, Fei,
"Measuring the Stress Dependence of Nucleation and Growth Processes in Sn
Whisker Formation," JOM, vol. 67 no. 10, pp. 2416-2424, Oct.
2015.
Illes, Balazs, Hurtony, Tamas, and Medgyes, Balint,
"Effect of current load on corrosion induced tin whisker growth from SnAgCu
solder alloys," Corrosion Science, vol. 99, pp. 313-319, Oct.
2015.
Vianco, P. T., Neilsen, M. K., Rejent, J. A., and Grant, R. P.,
"Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and
Hillock Growth on Sn Thin Films," Journal of Electronic Materials
, vol. 44 no. 10, pp. 4012-4034, Oct. 2015.
Chason, Eric, and Pei, Fei,
"Sn whisker formation as a stress-induced nucleation and growth process,"
The Latest Findings on Tin Whiskers in Electronics Webinar, Oct. 29, 2015, pp.
xx-xx.
Handwerker, Carol, Blendell, John, Wang, Ying, Chen, Wei-Hsun, Sarobol, Pylin,
Koppes, John, Pedigo, Aaron, Yoo, Byung-Gil, Phillipi, Bastian, Kraft, Oliver,
Dehm, Gerhard, Williams, Maureen, Chatain, Dominique, and Curriotto, Stephano,
"Stress Relaxation in Tin Films: Whisker Nucleation and Growth," The Latest
Findings on Tin Whiskers in Electronics Webinar, Oct. 29, 2015, pp. xx-xx.
Osterman, Michael,
"Tin Whisker Mitigation," The Latest Findings on Tin Whiskers in
Electronics Webinar, Oct. 29, 2015, pp. xx-xx.
Snugovsky, Polina,
"Issues and Whisker Mitigation for those Using SAC Solder and Tin Surface
Finishes," The Latest Findings on Tin Whiskers in Electronics Webinar,
Oct. 29, 2015, pp. xx-xx.
Batorfi, Reka, Illes, Balazs, and Krammer, Oliver,
"Whisker Formation from SnAgCu Alloys and Tin Platings - Review on the Latest
Results," 2015 IEEE 21st International Symposium for Design and
Technology in Electronic Packaging, Brasov, Romania, Oct. 22-25, 2015,
pp. 373-376.
McCulloch, J., Niraula, D., Grice, C. R., Warrell, G., Vasko, A., Irving, R.,
Georgiev, D., Borra, V., Karpov, V. G., Parsai, E. I., and Shvydka, D.,
"Electric field stimulated growth of Zn and Sn whiskers," Tin Whisker Group
teleconference, Oct. 21, 2015.
Snipes, E. K., Flowers, G. T., Lall, P., and Bozack, M. J.,
"Influence on Sn Whiskering of Controlled Bismuth Additions to Sputtered Sn
Films," 2015 IEEE 61st Holm Conference on Electrical Contacts,
San Diego, CA, Oct. 11-14, 2015, pp. 54-58.
Video showing Tin Whiskers, Youtube Oct, 5, 2015.
Vasko, A. C., Warrell, G. R., Parsai, E. I., Karpov, V. G., and Shvydka,
Diana,
"Electron beam induced growth of tin whiskers," Journal of Applied
Physics, vol. 118 no. 12, pp. 125301-1-125301-5, Sept. 28, 2015.
McKeown, S., Meschter, S., Snugovsky, P., Kennedy, J., Bagheri, Z., Keeping,
J., Cho, J., Edwards, D., and Elsken, K.,
"Strategic Environmental Research and Development Program (SERDP) Nanoparticle
enhanced conformal coating project: Coating modeling for tin whisker
mitigation," Proceedings of SMTA International, Rosemont, IL,
Sept. 27-Oct. 1, 2015, pp. 695-710.
McKeown, S., Meschter, S., Snugovsky, P., Kennedy, J., Bagheri, Z., Keeping,
J., Cho, J., Edwards, D., and Elsken, K.,
"Strategic Environmental Research and Development Program (SERDP) Nanoparticle
Enhanced Conformal Coating Project: Coating Modeling For Tin Whisker
Mitigation (Presentation)," SMTA International 2015 Proceedings,
Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 695-710.
Stoyanov, S., and Bailey, C.,
"Modelling the impact of refinishing processes on COTS components for use in
aerospace applications," Microelectronics Reliability, vol. 55
no. 9-10, pp. 1271-1279, Aug.-Sept. 2015.
Hester, Thomas, and Pinsky, David,
"Tin Whisker Self-Mitigation in Surface Mount Components Attached with Leaded
Solder Alloys," Surface Mount Technology (SMT), pp.
70,72-74,76-78,80 Sept. 2015.
Liu, Ting, Ding, Dongyan, Hu, Yu, and Gong, Yihua,
"Tin whisker growth on electroplated Sn multilayers," Journal of
Materials Science: Materials in Electronics, vol. 26 no. 9, pp.
6411-6418, Sept. 2015.
Cho, Junghyun, Maganty, Suraj, and Meschter, Stephan J.,
"Innovating the Microstructure of Polyurethane Conformal Coatings for Tin
Whisker Mitigation," SMTA International 2015 Proceedings,
Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 718-725.
Maalekian, Mehran, Xu, Yuan, and Seelig, Karl,
"Effect of Bi Content on Properties of Low Silver SAC Solders," SMTA
International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015,
pp. 191-198.
Thomas, Owen, Hunt, Chris, Wickham, Martin, and Clayton, Kate,
"Long Term Monitoring and Failure Detection of Tin Whiskers Bridging Adjacent
Leads on SOIC Components," SMTA International 2015 Proceedings,
Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 711-717.
Gullapalli, Vikranth,
Study of Metal Whiskers Growth and Mitigation Technique using Additive
Manufacturing. Master's Thesis for University of North Texas, Denton,
TX, Aug. 2015.
Kuwano, Noriyuki, Horikami, Sadanori, and Linas, Marina,
"Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder
Materials for Mitigation of Whiskers," Materials Science Forum,
vol. 827, pp. 341-346, Aug. 2015.
Zhang, Liang, Sun, Lei, Han, Ji-guang, and Guo, Yong-huan,
"Sizes effect of CeSn3 on the whiskers growth of SnAgCuCe solder joints in
electronic packaging," Journal of Materials Science: Materials in
Electronics, vol. 26 no. 8, pp. 6194-6197, Aug. 2015.
Rohwer, Lauren,
"Tin Whisker Mitigation," 2015 Joint Munitions Technical Advisory
Committee Meeting, Lawrence Livermore National Laboratory, Aug. 18-20,
2015, pp. xx-xx. (Sandia Report SAND2015-6765PE)
Yao, Z. X., Yin, L. M., Wang, G., Tian, X. K., and Yao, Z. Y.,
"The effect of current stressing and external loading on the growth of tin
whiskers," 2015 16th International Conference on Electronic Packaging
Technology, Changsha, China, Aug. 11-14, 2015, pp. 734-736.
Hwang, Jennie S.,
"The Theory Behind Tin Whisker Phenomena, Part 2," Surface Mount
Technology, vol. 30 no. 7, pp. 8,10-11, July 2015.
Meschter, Stephan J., Snugovsky, Polina, Kennedy, Jeffery, Bagheri, Zohreh,
and Kosiba, Eva,
"Strategic Environmental Research and Development Program (SERDP) Tin Whisker
Testing and Modeling: Thermal Cycling Testing," SMTA Journal,
vol. 28 no. 2, pp. 15-35, June 2015.
Sakakida, Tomomi, Kubouchi, Tatsuo, Miyano, Yasuyuki, Takahashi, Mamoru, and
Kamiya, Osamu,
"Effect of Environment on Sn Whisker Growth during Welding of Electronic
Wires," Advanced Materials Research, vol. 1110, pp. 235-240, June
2015.
Shvydka, D., Warrell, G., Parsai, E., Karpov, V., and Vasko, A.,
"SU-E-T-447: Growth of Metal Whiskers Under External Beam Irradiation:
Experimental Evidence and Implications in Medical Electronic Devices for
Radiation Therapy Treatments," Medical Physics, vol. 42 no.
6 part 19, pp. 3437, June 2015.
Karpov, V. G.,
"Understanding the movements of metal whiskers," Journal of Applied
Physics, vol. 117 no. 23, pp. 235303-1-235303-11, June 21, 2015.
Cai, Huacheng, Wang, Wendong, Liu, Peiwen, Wang, Guangming, Liu, Ankang, He,
Zhe, Cheng, Zhaofang, Zhang, Shengli, and Xia, Minggang,
"Enhanced synthesis of Sn nanowires with aid of Se atom via physical vapor
transport," Journal of Crystal Growth, vol. 420, pp. 42-46, June
15, 2015.
Al-Salman, Rihab, Sommer, Heino, Brezesinski, Torsten, and Janek, Jurgen,
"Template-Free Electrochemical Synthesis of High Aspect Ratio Sn Nanowires in
Ionic Liquids: A General Route to Large-Area Metal and Semimetal Nanowire
Arrays?," Chemistry of Materials, vol. 27 no. 11, pp. 3830-3837,
June 9, 2015.
Huang, Lin, Jian, Wei, Lin, Bing, Wen, Yuren, Gu, Lin, and Wang, Jiangyong,
"Thermodynamic understanding of Sn whisker growth on the Cu surface in
Cu(top)-Sn(bottom) bilayer system upon room temperature aging," Journal
of Applied Physics, vol. 117 no. 21, pp. 215308-1-215308-8, June 7,
2015.
Jahedi, Mohammad, Ardeljan, Milan, Beyerlein, Irene J., Paydar, Mohammad
Hossein, and Knezevic, Marko,
"Enhancement of orientation gradients during simple shear deformation by
application of simple compression," Journal of Applied Physics,
vol. 117 no. 21, pp. 214309-1-214309-11, June 7, 2015.
Hwang, Jennie,
"The Theory Behind Tin Whisker Phenomena, Part 1," Surface Mount
Technology (SMT), vol. 30 no. 5, pp. 8,10-11, May 2015.
Zhang, Junxiong, Xue, Songbai, Xue, Peng, and Liu, Shuang,
"Thermodynamic reaction mechanism of the intermetallic compounds of SnxNdy and
GaxNdy in soldered joint of Sn-9Zn-1Ga-0.5Nd," Journal of Materials
Science: Materials in Electronics, vol. 26 no. 5, pp. 3064-3068, May
2015.
Meschter, Stephan, Ekstrom, Evan, Snugovsky, Polina, Kennedy, Jeff, Bagheri,
Zohreh, and Kosiba, Eva,
"Strategic Environmental Research and Development Program (SERDP) Tin Whisker
Testing and Modeling: Long Term Low Temperature High Humidity Testing,"
International Conference on Soldering & Reliability 2015 Proceedings
, Toronto, Ontario, Canada, May 19-21, 2015, pp. xx-xx.
Illes, Balazs, and Fehervari, Norbert,
"Relation Between Tin Whiskering Ability Sn/Ag/Cu Solder Alloys and Current
Load," 2015 38th International Spring Seminar on Electronics Technology
, Eger, Hungary, May 6-10, 2015, pp. 173-178.
Doudrick, Kyle, Chinn, Jeff, Williams, Jason, Chawla, Nikhilesh, and
Rykaczewski, Konrad,
"Rapid method for testing efficacy of nano-engineered coatings for mitigating
tin whisker growth," Microelectronics Reliability, vol. 55 no. 5,
pp. 832-837, Apr. 2015.
He, A., and Ivey, D. G.,
"Microstructural study of Sn films electrodeposited on Cu substrates: Sn
whiskers and Cu6Sn5 precipitates," Journal of Materials Science,
vol. 50 no. 7, pp. 2944-2959, Apr. 2015.
Jagtap, Piyush, and Kumar, Praveen,
"Manipulating Crystallographic Texture of Sn Coatings by Optimization of
Electrodeposition Process Conditions to Suppress Growth of Whiskers,"
Journal of Electronic Materials, vol. 44 no. 4, pp. 1206-1219, Apr.
2015.
Karpov, V. G.,
"Understanding the movements of metal whiskers (paper)," Tin Whisker
Group teleconference, Apr. 8 & 15, 2015.
Mairen, Dimas Jesus Morilla,
"Tin Whisker Growth on Surface Mount Devices: A Study Using Standarized
Test Conditions," 6th Electronic Materials and Assembly Processes
for Space (EMPS) Workshop, Oberpfaffenhofen, Germany, Apr. 15-16, 2015,
pp. xx-xx.
Tyler, Don, and Dennehy, Charley,
"Reliability of Ball Grid Arrays Converted from Pb-free to Tin-Lead by Robotic
Hot Solder Dip (RHSD)," 6th Electronic Materials and Assembly
Processes for Space (EMPS) Workshop, Oberpfaffenhofen, Germany, Apr.
15-16, 2015, pp. xx-xx.
Wickham, Martin, Thomas, Owen, Clayton, Kate, and Hunt, Chris,
"Measurement of tin whisker growth on printed circuit board assemblies and the
effect of mitigation techniques," 6th Electronic Materials and
Assembly Processes for Space (EMPS) Workshop, Oberpfaffenhofen,
Germany, Apr. 15-16, 2015, pp. xx-xx.
Karpov, V. G.,
"Understanding the movements of metal whiskers (presentation)," Tin Whisker
Group teleconference, Apr. 8 & 15, 2015.
Hemmila, Samu, Gao, Anran, Lu, Na, Li, Tie, Wang, Yuelin, and Kallio, Pasi,
"Integration of microfluidic sample delivery system on silicon nanowire-based
biosensor," Microsystem Technologies, vol. 21 no. 3, pp.
571-580, Mar. 2015.
Stein, J., Tineo, C. A. Cordova, Welzel, U., Huege, W., and Mittemeijer, E.
J.,
"Microstructural Development and Possible Whiskering Behavior of Thin Sn Films
Electrodeposited on Cu(Zn) Substrates," Journal of Electronic Materials
, vol. 44 no. 3, pp. 886-894, Mar. 2015.
Stein, J., Welzel, U., Leineweber, A., Huegel, W., and Mittemeijer, E. J.,
"The crystallographic growth directions of Sn whiskers," Acta Materialia
, vol. 86, pp. 102-109, Mar. 2015.
Chason, E., Engwall, A. M., Miller, C. M., Chen, C.-H., Bhandari, A., Soni,
S. K., Hearne, S. J., Freund, L. B., and Sheldon, B. W.,
"Stress evolution during growth of 1-D island arrays: Kinetics and length
scaling," Scripta Materialia, vol. 97, pp. 33-36, Mar. 1, 2015.
Hillman, David, and Wilcoxon, Ross,
"Tin Whisker Risk Assessment of a Tin Surface Finished Connector,"
Surface Mount Technology (SMT), vol. 30 no. 2, pp.
68,70-72,74-76,78-79, Feb. 2015.
Holtzer, Mitch,
"Minimizing the Risk of Tin Whisker Formation in Lead-Free Assemblies,"
Surface Mount Technology (SMT), vol. 30 no. 2, pp. 80,82, Feb. 2015.
Karpov, V. G.,
"Electrostatic Mechanism of Nucleation and Growth of Metal Whiskers,"
Surface Mount Technology (SMT), vol. 30 no. 2, pp.
28,30-32,34-36,38-40,42-45, Feb. 2015.
Lasky, Ronald C.,
"Risk and Mitigation for Tin Whiskers and Tin Pest," Surface Mount
Technology (SMT), vol. 30 no. 2, pp. 18,20-22,24,26-27, Feb. 2015.
Osterman, Michael,
"Tin Whiskers Remain a Concern," Surface Mount Technology (SMT),
vol. 30 no. 2, pp. 50,52-54, Feb. 2015.
Sentz, Scott,
"The Unpredictability of Tin Whiskers Endures," Surface Mount Technology
(SMT), vol. 30 no. 2, pp. 62,64-65, Feb. 2015.
Skwarek, A., Witek, K., Pluska, M., and Czerwinski, A.,
"Tin Whisker Growth on the Surface of Tin-Rich Lead-Free Alloys,"
Surface Mount Technology (SMT), vol. 30 no. 2, pp. 56,58-60, Feb. 2015.
Kim, Gye Hyun, and Thompson, Carl V.,
"Effect of surface energy anisotropy on Rayleigh-like solid-state dewetting
and nanowire stability," Acta Materialia, vol. 84, pp. 190-201,
Feb. 1, 2015.
Ashworth, M. A., Haspel, D., Wu, L., Wilcox, G. D., and Mortimer, R. J.,
"An Investigation into the Effect of a Post-electroplating Electrochemical
Oxidation Treatment on Tin Whisker Formation," Journal of Electronic
Materials, vol. 44 no. 1, pp. 442-456, Jan. 2015.
Ashworth, M. A., Wilcox, G. D., Higginson, R. L., Heath, R. J., Liu, C., and
Mortimer, R. J.,
"The effect of electroplating parameters and substrate material on tin whisker
formation," Microelectronics Reliability, vol. 55 no. 1, pp.
180-191, Jan. 2015.
Wang, Ying, Yoo, Byung-Gil, Phillipi, Bastian, Handwerker, Carol, Blendell,
John, Kraft, Oliver, and Dehm, Gerhard,
"Stress Relaxation in Tin Films during Cyclic Bending and Thermal Cycling,"
Tin Whisker Group teleconference, Jan. 28 & Feb. 4, 2015.
Spiers, Simon,
Inside an AF114 transistor with tin whiskers, Youtube, Jan. 24, 2015.
Hopper, Ann,
"Controlled Modification of Surfaces at the nanoscale," Transactions of
the IMF, vol. 92 no. 3, pp. 123-124, 2014.
https://doi.org/10.1179/0020296714Z.000000000181
Stuttle, C. J., Ashworth, M. A., Wilcox, G. D., and Mortimer, R. J.,
"Characterisation of tin-copper intermetallic growth in electrodeposited tin
coatings using electrochemical oxidation techniques," Transactions of
the IMF, vol. 92 no. 5, pp. 272-281, 2014.
https://doi.org/10.1179/0020296714Z.000000000174
McKeown, Stephen, Meschter, Stephan, Snugovsky, Polina, and Kennedy, Jeffery,
"SERDP Tin Whisker Testing and Modeling: Whisker Geometric Risk Model
Development," Tin Whisker Group teleconference, Dec. 3, 2014.
Fadil, Nor Akmal, Yusof, Siti Zahira, Ourdjini, Ali, and Bakar, Tuty Asma Abu,
"Effect of the Formation of CuO flowers and SnO2 on the Growth of Tin Whiskers
on Immersion Tin Surface Finish," Applied Mechanics and Materials
, vol. 695, pp. 301-305, Nov. 2014.
Kazimierczak, Honorata, Ozga, Piotr, Slupska, Monika, Swiatek, Zbigniew, and
Berent, Katarzyna,
"Electrodeposition of Sn-Mn Layers from Aqueous Citrate Electrolytes,"
Journal of the Electrochemical Society, vol. 161 no. 6, pp. D309-D320,
2014.
Michael, Joseph R., Susan, Don F., and McKenzie, Bonnie,
"2D and 3D EBSD and TKD: Examples from Tin Whiskers," Sandia Report
SAND2014-16904PE, 2014.
Michael, Joseph R., Rye, Michael J., Susan, Don F., and McKenzie, Bonnie,
"Crystallographic Characterization of Whiskers using EBSD: Examples from Tin
Whiskers," Sandia Report SAND2014-0231C, 2014.
Sycheva, Anna, Radanyi, Adam and Gacsi, Zoltan,
"Studying Pressure Induced Whiskers Formation from Sn-rich Surfaces,"
Materials Science Forum, vol. 790/791, pp. 271-276, May 2014.
Vianco, P. T., Neilsen, M. K., Rejent, J. A., and Grant, R. P.,
"Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and
Hillock Growth on Thin Films," Sandia Report SAND2014-15673J, 2014.
Chason, E., Pei, F., Briant, C. L., Kesari, H., and Bower, A. F.,
"Significance of Nucleation Kinetics in Sn Whisker Formation," Journal
of Electronic Materials, vol. 43 no. 12, pp. 4435-4441, Dec. 2014.
Illes, Balazs, and Horvath, Barbara,
"Tin whisker growth from micro-alloyed SAC solders in corrosive climate,"
Journal of Alloys and Compounds, vol. 616, pp. 116-121, Dec. 15,
2014.
Pei, F., Briant, C. L., Kesari, H., Bower, A. F., and Chason, E.,
"Kinetics of Sn whisker nucleation using thermally induced stress,"
Scripta Materialia, vol. 93, pp. 16-19, Dec. 15, 2014.
Eckold, P., Niewa, R., and Hugel, W.,
"Texture of electrodeposited tin layers and its influence on their corrosion
behavior," Microelectronics Reliability, vol. 54 no. 11, pp.
2578-2585, Nov. 2014.
Meschter, S., Snugovsky, P., Bagheri, Z., Kosiba, E., Romansky, M., Kennedy,
J., Snugovsky, L., and Perovic, D.,
"Whisker Formation on SAC305 Soldered Assemblies," JOM, vol. 66
no. 11, pp. 2320-2333, Nov. 2014.
Qiang, Lei, and Huang, Zaixing,
"A physical model and analysis for whisker growth caused by chemical
intermetallic reaction," Microelectronics Reliability, vol. 54
no. 11, pp. 2494-2500, Nov. 2014.
Shilyaeva, Yulia, Gavrilov, Sergey, and Matyna, Larisa,
"Melting of indium, tin, and zinc nanowires embedded in the pores of anodic
aluminum oxide," Journal of Thermal Analysis and Calorimetry,
vol. 118 no. 2, pp. 937-942, Nov. 2014.
Stein, J., Rehm, S., Welzel, U., Huegel, W., and Mittemeijer, E. J.,
"The Role of Silver in Mitigation of Whisker Formation on Thin Tin Films,"
Journal of Electronic Materials, vol. 43 no. 11, pp. 4308-4316,
Nov. 2014.
Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and
Kosiba, Eva,
"Strategic Environmental Research and Development Program (SERDP) Tin Whisker
Testing and Modeling: Tin Whisker Growth on SAC305 Assemblies and Risk
Modeling," Tin Whisker Group teleconference, Nov. 12, 2014.
Rohwer, Lauren,
"Platelet composite coatings for tin whisker mitigation," 8th
International Symposium on Tin Whiskers, Raleigh, NC, Oct. 29, 2014,
pp. xx-xx. (Sandia Report SAND2014-18755C)
Vakanas, G. P., Vandecasteele, B., Schaubroek, D., De Messemaeker, J.,
Willems, G., Ashworth, M. A., Wilcox, G. D., and De Wolf, I.,
"Sn whisker evaluations in 3D microbumped structures," Microelectronics
Reliability, vol. 54 no. 9-10, pp. 1982-1987, Sept.-Oct. 2014.
Stuttle, Christopher James,
The Electrodeposition of Tin Coatings from Deep Eutectic Solvents and
their Subsequent Whisker Growth. Ph. D. Thesis for Loughborough
University, Loughborough, United Kingdom, Sept. 2014.
Chen, Wei-Hsun,
Evaluation of Local Anisotropic Elasticity and Thermal Expansion on
Whisker Formation Sites in beta-tin Thin Films. Ph. D. Thesis for
Purdue University, West Lafayette, IN, Aug. 2014.
Bush, Peter, Galyon, George, Handwerker, Carol, Osenbach, John, Parker,
Richard, Reynolds, Heidi, Schroeder, Valeska, Smetana, Joseph, Su, Peng,
Williams, Maureen, and Woodrow, Tom,
"iNEMI Tin Whisker Projects: Test Development, Risk Mitigation, and
Fundamental Theory Development," Tin Whisker Group teleconference, Oct. 22,
2014.
Vasko, A., and Karpov, V.,
"Rapid Growth of Whiskers in Evaporated Tin Films Under Influence of Electric
Field," Tin Whisker Group teleconference, Oct. 15, 2014.
Schetty, Rob,
"Effects of Electrodeposited Matte Tin Crystal Orientation and Grain Structure
on Tin Whisker Growth Propensity Using Stress-Inducing Test Methods,"
2014 IEEE 60th Holm Conference on Electrical Contacts, New Orleans, LA,
Oct. 12-15, 2014, pp. xx-xx.
Snipes, E. K., Flowers, G. T., Lall, P., and Bozack, M. J.,
"Impact of Thermal Cycling and Background Gas Environment on Tin Whiskering,"
2014 IEEE 60th Holm Conference on Electrical Contacts, New
Orleans, LA, Oct. 12-15, 2014, pp. xx-xx.
Hillman, Dave, Wilcoxon, Ross, Lower, Nate, and Grossman, Dan,
"Tin Whisker Inorganic Coating Evaluation (TWICE)," Conference
Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014,
pp. 476-488.
Lasky, Ronald,
"Risk and Mitigation for Tin Whiskers and Tin Pest," Conference
Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014,
pp. 444-448.
Meschter, S., Cho, J., Maganty, S., Starkey, D., Gomez, M., Edwards, D.,
Ekin, A., Elsken, K., Keeping, J., Snugovsky, P., Kosiba, Eva, Bagheri,
Zohreh, and Kennedy, Jeff,
"Strategic Environmental Research and Development Program (SERDP) Nanoparticle
Enhanced Conformal Coating for Whisker Mitigation," Conference
Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014,
pp. 489-529.
Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and
Kosiba, Eva,
"Strategic Environmental Research and Development Program (SERDP) Tin Whisker
Testing and Modeling: Tin Whisker Growth on SAC305 Assemblies,"
Conference Proceedings of SMTA International, Rosemont, IL, Sept.
28-Oct. 2, 2014, pp. 449-475.
Oezkoek, Mustafa, Mertens, Hubertus, and Bruder, Maren,
"Immersion Tin Surface Finish - Reviewing the Past and a Look to the Future,"
Conference Proceedings of SMTA International, Rosemont, IL,
Sept. 28-Oct. 2, 2014, pp. 941-944.
Cho, Junghyun, Meschter, Stephan J., Maganty, Suraj, Starkey, Dale, Gomez,
Mario, Edwards, David G., Ekin, Abdullah, Elsken, Kevin, Keeping, Jason,
Snugovsky, Polina, Kennedy, Jeff, and Romansky, Marianne,
"Polyurethane Conformal Coatings Filled with Hard Nanoparticles for Tin
Whisker Mitigation," SMTAnews & Journal of Surface Mount Technology
, vol. 27 no. 3, pp. 15-21, July-Sept. 2014.
Hwang, Jennie S.,
"Tin Whiskers, Part 6: Preventive and Mitigating Measures - Strategy and
Tactics," Surface Mount Technology (SMT), vol. 29 no. 9, pp.
12,14-15, Sept. 2014.
Mahan, Kenny, Sun, Yong, Han, Bongtae, Han, Sungwon, and Osterman, Mike,
"Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin
Whisker Growth," Journal of Electronic Packaging, vol. 136
no. 3, pp. 031004-1-031004-7, Sept. 2014.
Seelig, Karl, and O'Neil, Tim,
"Tin Whisker Study Conclusions," Printed Circuit Design and Fab/
Circuits Assembly, vol. 31 no. 9, pp. 52-54, Sept. 2014.
Su, Chien-Hao, Chen, Hao, Lee, Hsin-Yi, Liu, Cheng Yi, Ku, Ching-Shun, and Wu,
Albert T.,
"Kinetic Analysis of Spontaneous Whisker Growth on Pre-treated Surfaces with
Weak Oxide," Journal of Electronic Materials, vol. 43 no. 9, pp.
3290-3295, Sept. 2014.
Xue, Peng, Xue, Song-bai, Shen, Yi-Fu, Long, Fei, and Zhu, Hong,
"Mechanism of Reaction Between Nd and Ga in Sn-Zn-0.5Ga-xNd Solder,"
Journal of Electronic Materials, vol. 43 no. 9, pp. 3404-3410, Sept.
2014.
Stoyanov, Stoyan, Dabek, Alexander, and Bailey, Chris,
"Thermo-mechanical Impact of Laser-induced Solder Ball Attach Process on Ball
Grid Arrays," 2014 Electronics System-Integration Technology Conference
, Helsinki, Finland, Sept. 16-18, 2014, pp. xx-xx.
Melcioiu, Georgiana, Serban, Viorel-Aurel, Ashworth, Mark, Codrean, Cosmin,
Lita, Marin, and Wilcox, Geoffrey D.,
"An evaluation of Sn-Cu-Ga and Sn-Cu-Ag solder alloys for applications within
the electronics industry," Solid State Phenomena, vol. 216, pp.
91-96, Aug. 2014.
Xue, Peng, Xue, Song-bai, Shen, Yi-fu, Long, Fei, and Zhu, Hong,
"Wettability and interfacial whiskers of Sn-9Zn-0.5Ga-0.08Nd solder with Sn,
SnBi and Au/Ni coatings," Journal of Materials Science: Materials in
Electronics, vol. 25 no. 8, pp. 3520-3525, Aug. 2014.
Karpov, Victor,
"Electrostatic Theory of Metal Whiskers," Tin Whisker Group teleconference,
Aug. 27 & Sept. 3, 2014.
Hao, Hu, He, Hongwen, and Lu, Yuan,
"Study of Tin Whisker Growth Accelerated by Rare Earth Phase and the Mechanism
of Tin Whisker Growth," 2014 15th International Conference on Electronic
Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1120-1126.
He, Hongwen, Cao, Liqiang, Hao, Hu, Ma, Limin, and Guo, Fu,
"Whisker growth in the crack region of the cathode interface during current
stressing process in lead-free solder joints," 2014 15th International
Conference on Electronic Packaging Technology, Chengdu, China, Aug.
12-15, 2014, pp. 1491-1494.
Liu, Ting, Ding, Dongyan, Hu, Yu, and Gong, Yihua,
"Effect of Interfacial Reaction on Tin Whisker Formation of Sn/Ni Films
Deposited on Copper Lead-frame," 2014 15th International Conference on
Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp.
1005-1009.
Yao, Z. X., Yin, L. M., Lu, Y. H., gang, W., Chen, Z. G., and Yao, Z. X.,
"Acceleration of the growth of tin whisker by thermal aging and external
tension," 2014 15th International Conference on Electronic Packaging
Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1096-1099.
Yao, Z. X., Yin, L. M., Zhang, L. P., Zhou, J., and Yao, Z. X.,
"The effect of coating thickness and external force on the growth of tin
whisker," 2014 15th International Conference on Electronic Packaging
Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1100-1103.
Czerwinski, A., Skwarek, A., Pluska, M., Ratajczak, J., and Witek, K.,
"Whisker Growth in Tin Alloys on Glass-Epoxy Laminate," Surface Mount
Technology (SMT), vol. 29 no. 7, pp. 30,32,34-36,38-39, July 2014.
Gupta, Abhishek,
"Hard-Won Knowledge Mitigates Effects Of Tin Whiskers," Electronic
Design, vol. 62 no. 7, pp. 35-38, July 2014.
Hwang, Jennie S.,
"Tin Whiskers: Capsulization," Surface Mount Technology (SMT)
, vol. 29 no. 7, pp. 16,18-22,24-26,28-29, July 2014.
Seelig, Karl, and O'Neill, Tim,
"Can the Right Alloy Prevent Tin Whisker Formation?," Printed
Circuit Design and Fab/ Circuits Assembly, vol. 31 no. 7, pp. 40-41,
July 2014.
Woody, Linda, and Fox, William,
"Tin Whisker Risk Management by Conformal Coating," Surface Mount
Technology (SMT), vol. 29 no. 7, pp. 40,42-44,46-48,50,52-58, July
2014.
Lim, Hooi Peng, Ourdjini, Ali, and Bakar, Tuty Asma Abu,
"The Effects of Nickel Underlayer and Solder Dipping as Tin Whisker
Mitigations in Tin Surface Finishes," Applied Mechanics and Materials
, vol. 554, pp. 47-51, June 2014.
Xue, Peng, Xue, Song-bai, Shen, Yi-fu, and Zhu, Hong,
"Inhibiting the growth of Sn whisker in Sn-9Zn lead-free solder by Nd and Ga,"
Journal of Materials Science: Materials in Electronics, vol. 25
no. 6, pp. 2671-2675, June 2014.
Diyatmika, Wahyu, Chu, J. P., Yen, Y. W., Chang, W. Z., and Hsueh, C. H.,
"Thin film metallic glass as an underlayer for tin whisker mitigation: A
room-temperature evaluation," Thin Solid Films, vol. 561, pp.
93-97, June 30, 2014.
"Tin whiskers on printed circuit boards: Consequences for safety components in
machine construction," IFA, May 2014.
Hwang, Jennie S.,
"Tin Whiskers, Part 5: Impact of Testing Conditions," Surface Mount
Technology (SMT), vol. 29 no. 5, pp. 12,14-15, May 2014.
Karpov, V. G.,
"Electrostatic Theory of Metal Whiskers," Physical Review Applied
, vol. 1 no. 4, pp. 044001-1-0044001-13, May 2014.
Seelig, Karl, and O'Neill, Tim,
"Tin Whisker Revelations," Printed Circuit Design and Fab/ Circuits
Assembly, vol. 31 no. 5, pp. 71-72, May 2014.
Wickman, Martin, Clayton, Kate, Hunt, Chris, and Dunn, Barrie,
"Sn Whiskers and their Mitigation for Space, Aerospace and Defence
Electronics," 5th Electronic Materials and Assembly Processes for
Space (EMPS) Workshop, Noordwijk, The Netherlands, May 2014, pp. xx-xx.
Wang, Ying,
Microstructure Evolution and Surface Defect Formation in Tin Films
. Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2014.
Cho, Junghyun, Meschter, Stephan J., Maganty, Suraj, Starkey, Dale, Gomez,
Mario, Edwards, David G., Ekin, Abdullah, Elsken, Kevin, Keeping, Jason,
Snugovsky, Polina, Kennedy, Jeff, and Romansky, Marianne,
"Polyurethane Conformal Coatings Filled with Hard Nanoparticles for Tin
Whisker Mitigation," International Conference on Soldering &
Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.
McKeown, Stephen A., Meschter, Stephan J., Snugovsky, Polina, and Kennedy,
Jeffery,
"SERDP Tin Whisker Testing and Modeling: Simplified Whisker Risk Model
Development," International Conference on Soldering & Reliability
2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.
Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and
Kosiba, Eva,
"Strategic Environmental Research and Development Program (SERDP) Tin Whisker
Testing and Modeling: Thermal Cycling Testing," International Conference
on Soldering & Reliability 2014, Toronto, Ontario, Canada, May
13-15, 2014, pp. xx-xx.
Illes, Balazs, and Horvath, Barbara,
"Tin Whisker Growth from Low Ag Content Micro-Alloyed SAC Solders,"
Proceedings of the 2014 37th International Spring Seminar on Electronics
Technology, Dresden, Germany, May 7-11, 2014, pp. 152-157.
Placek, Martin, Dusek, Karel, and Urbanek, Jan,
"Whiskers Growth on Thick Tin Layers and Various Types of Surfaces,"
Proceedings of the 2014 37th International Spring Seminar on Electronics
Technology, Dresden, Germany, May 7-11, 2014, pp. 193-197.
Stoyanov, Stoyan, Dabek, Alexander, and Bailey, Chris,
"Hot Nitrogen Deballing of Ball Grid Arrays," Proceedings of the 2014
37th International Spring Seminar on Electronics Technology, Dresden,
Germany, May 7-11, 2014, pp. 44-49.
Ashworth, Mark A., Wilcox, Geoffrey D., Higginson, Rebecca L., Heath, Richard
J., and Liu, Changqing,
"An Investigation into Zinc Diffusion and Tin Whisker Growth for Electroplated
Tin Deposits on Brass," Journal of Electronic Materials, vol. 43
no. 4, pp. 1005-1016, Apr. 2014.
Elbasiony, A. M. R., Zein El Abedin, S., and Endres, F.,
"Electrochemical synthesis of freestanding tin nanowires from ionic liquids,"
Journal of Solid State Electrochemistry, vol. 18 no. 4, pp.
951-957, Apr. 2014.
Singh, S. S., Sarkar, R., Xie, H.-X., Mayer, C., Rajagopalan, J., and Chawla,
N.,
"Tensile Behavior of Single-Crystal Tin Whiskers," Journal of Electronic
Materials, vol. 43 no. 4, pp. 978-982, Apr. 2014.
Wang, Jing, Ashworth, Mark A., and Wilcox, Geoffrey D.,
"An Investigation Into the Role of Lead as a Suppressant for Tin Whisker
Growth in Electronics," IEEE Transactions on Components, Packaging, and
Manufacturing Technology, vol. 4 no. 4, pp. 727-740, Apr. 2014.
Anderson, Antony F.,
"Intermittent Electrical Contact Resistance as a Contributory Factor in the
Loss of Automobile Speed Control Functional Integrity," IEEE Access, Apr.
9, 2014.
Munson, Terry,
"Tin Whiskering on PCBA Capacitors in Storage (Inside ESD Bag, Inside a Sealed
Cardboard Box)," Foresite. (before Apr. 3, 2014)
Tsujimoto, Masanobu,
"Study of tin whisker inhibiting systems Controlling the copper substrate
roughness and controlling the tin deposit crystal structure," IPC
Symposium on Tin Whiskers, pp. xx-xx. (before Apr. 3, 2014)
Hwang, Jennie S.,
"Tin Whiskers, Part 4: Causes and Contributing Factors," Surface Mount
Technology (SMT), vol. 29 no. 3, pp. 12-16, Mar. 2014.
Li, Qingqian, Chan, Y. C., and Chen, Zhong,
"Tin whiskers growth of SnAgIn solder on Kovar substrate with Au/Ni plating,"
Journal of Materials Science: Materials in Electronics, vol. 25
no. 3, pp. 1222-1227, Mar. 2014.
Na, Seong-Hun, Lee, Mi-Ri, Park, Hwa-Sun, Kim, Heung-Kyu, and Suh, Su-Jeong,
"Effect of a High-Temperature Pre-Bake Treatment on Whisker Formation Under
Various Thermal and Humidity Conditions for Electrodeposited Tin Films on
Copper Substrates," Metals and Materials International, vol. 20
no. 2, pp. 367-373, Mar. 2014.
Maalekian, Mehran, Seelig, Karl, and O'Neill, Timothy,
"Sample Preparation for Mitigating Tin Whiskers in Alternative Lead-Free
Alloys," IPC APEX Expo 2014, Las Vegas, NV, Mar. 25-27, 2014,
pp. xx-xx.
Seelig, Karl F.,
"Sample Preparation for Mitigating Tin Whiskers in Alternative Lead-Free
Alloys," IPC APEX Expo 2014, Las Vegas, NV, Mar. 25-27, 2014,
pp. xx-xx.
Woody, Linda, and Fox, William,
"Tin Whisker Risk Management by Conformal Coating," IPC APEX Expo
2014, Las Vegas, NV, Mar. 25-27, 2014, pp. xx-xx.
Mackay, David T., Janish, Matthew T., Sahaym, Uttara, Kotula, Paul G.,
Jungjohann, Katherine L., Carter, C. Barry, and Norton, M. Grant.,
"Template-free electrochemical synthesis of tin nanostructures," Journal
of Materials Science, vol. 49 no. 4, pp. 1476-1483, Feb. 2014.
Wang, Ying, Blendell, John E., and Handwerker, Carol A.,
"Evolution of tin whiskers and subsiding grains in thermal cycling,"
Journal of Materials Science, vol. 49 no. 3, pp. 1099-1113, Feb. 2014.
Chang, Jaewon, Kang, Sung K., Lee, Jae-Ho, Kim, Keun-Soo, and Lee, Hyuck Mo,
"Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a
Function of Plating Variables and Storage Conditions," Journal of
Electronic Materials, vol. 43 no. 1, pp. 259-269, Jan. 2014.
George, Elviz, and Pecht, Michael,
"Tin whisker analysis of an automotive engine control unit,"
Microelectronics Reliability, vol. 54 no. 1, pp. 214-219, Jan. 2014.
Jo, Jung-Lae, Nagao, Shijo, Hamasaki, Kyoko, Tsujimoto, Masanobu, Sugahara,
Tohru, and Suganuma, Katsuaki,
"Mitigation of Sn Whisker Growth by Small Bi Additions," Journal of
Electronic Materials, vol. 43 no. 1, pp. 1-8, Jan. 2014.
Liu, Sihan, Ma, Limin, Shu, Yutian, Subramanian, K. N., Lee, Andre, and Guo,
Fu,
"Effects of POSS-Silanol Addition on Whisker Formation in Sn-Based Pb-Free
Electronic Solders," Journal of Electronic Materials, vol. 43 no.
1, pp. 26-32, Jan. 2014.
Pei, Fei, and Chason, Eric,
"In Situ Measurement of Stress and Whisker/Hillock Density During Thermal
Cycling of Sn Layers," Journal of Electronic Materials, vol. 43
no. 1, pp. 80-87, Jan. 2014.
Yeh, Min-Chi, Li, Jyun Lin, Lo, Pei Jen, Yu, Rick, Yu, Cheng-Fu, and Hsieh,
Ker-Chang,
"Corrosion behavior of pure tin deposit under 55 °C/85 % RH reliability test,"
Journal of Materials Science: Materials in Electronics, vol. 25
no. 1, pp. 317-322, Jan. 2014.
Chen, Wei-Hsun, Sarobol, Pylin, Holaday, John R., Handwerker, Carol A., and
Blendell, John E.,
"Effect of crystallographic texture, anisotropic elasticity, and thermal
expansion on whisker formation in b-Sn thin films," Journal of Materials
Research, vol. 29 no. 2, pp. 197-206, Jan. 28, 2014.
Spiers, Simon,
Tin whiskers inside a AF117 transistor, Youtube, Jan. 6, 2014.
Bunyan, D., Ashworth, M. A., Wilcox, G. D., Higginson, R. L., Heath, R. J.,
and Liu, C.,
"Tin whisker growth from electroplated finishes - a review,"
Transactions of the IMF, vol. 91 no. 5, pp. 249-259, 2013.
https://doi.org/10.1179/0020296713Z.000000000119
Diaz Gonzalez, Alfredo J.,
Pb-Free Electronics: From Nanotechnology to Combinatorial Materials
Science. Master's Thesis for University of Puerto Rico, Mayaguez,
Puerto Rico, 2013.
Diyatmika, Wahyu, Chu, Jinn P., Yen, Y. W., and Hsueh, C. H.,
"Sn whisker mitigation by a thin metallic-glass underlayer in Cu-Sn,"
Applied Physics Letters, vol. 103, pp. 241912-1-241912-4, 2013.
Dunn, Barrie, Turner, Ian, and Barnes, Cathy,
"A study into the re-processing of pure tin termination finishes into
tin-lead," Soldering & Surface Mount Technology, vol. 25 no.
4, pp. xx-xx, 2013.
Ye, Huan, Xue, Songbai, Chen, Cheng, and Li, Yang,
"Growth behaviors of tin whisker in RE-doped Sn-Zn-Ga solder," Soldering
& Surface Mount Technology, vol. 25 no. 3, pp. 139-144, 2013.
Sharma, Ashutosh, Bhattacharya, Sumit, Das, Siddhartha, and Das, Karabi,
"Fabrication of Sn-Ag/CeO2 Electro-Composite Solder by Pulse
Electrodeposition," Metallurgical and Materials Transactions A: Physical
Metallurgy and Materials Science, vol. 44 no. 12, pp. 5587-5601, Dec.
2013.
https://doi.org/10.1007/s11661-013-1894-5
Stein, Jendrik, Welzel, Udo, Huegel, Werner, Blatt, Sabine, and Mittemeijer,
Eric Jan,
"Aging-time-resolved in situ microstructural investigation of tin films
electroplated on copper substrates, applying two-dimensional-detector X-ray
diffraction," Journal of Applied Crystallography, vol. 46 no. 6,
pp. 1645-1653, Dec. 2013.
Zou, Shiwen, Li, Xiaogang, Dong, Chaofang, Ding, Kangkang, and Xiao, Kui,
"Electrochemical migration, whisker formation, and corrosion behavior of
printed circuit board under wet H2S environment," Electrochimica Acta
, vol. 114, pp. 363-371, Dec. 30, 2013.
https://doi.org/10.1016/j.electacta.2013.10.051
Rahal, Mohamad,
"Innovative Circuits to Detect Faults in Accelerator Pedal Sensor Wires in
Modern Vehicles," 2013 25th International Conference on Microelectronics
, Beirut, Lebanon, Dec. 15-18, 2013, pp. xx-xx.
Hwang, Jennie S.,
"Tin Whiskers: Concerns and Potential Impact," Surface Mount Technology
(SMT), vol. 28 no. 11, pp. 12,14-15, Nov. 2013.
Yan, X. L., Lin, M., and Wang, J. Y.,
"Equilibrium and kinetic surface segregations in Cu-Sn thin films,"
Applied Physics A, vol. 113 no. 2, pp. 423-430, Nov. 2013.
https://doi.org/10.1007/s00339-013-7570-1
Horvath, Barbara, Shinohara, Tadashi, and Illes, Balazs,
"Corrosion properties of tin-copper alloy coatings in aspect of tin whisker
growth," Journal of Alloys and Compounds, vol. 577, pp. 439-444,
Nov. 15, 2013.
Lasky, Ronald C.,
"Tin Whiskers 101," Medical Electronics Symposium 2013 Proceedings
, Milpitas, CA, Nov. 12-13, 2013, pp. xx-xx.
Gupta, Abhishek,
"Don't Let Tin Whiskers Destroy Your Design," Electronic Design,
vol. 61 no. 13, pp. 63-66, Nov. 7, 2013.
Chawla, Nik,
"In situ Mechanical Testing of Sn Whiskers," Tin Whisker Group teleconference,
Nov. 6, 2013.
Jo, Jung-Lae, Nagao, Shijo, Sugahara, Tohru, Tsujimoto, Masanobu, and
Suganuma, Katsuaki,
"Thermal stress driven Sn whisker growth: in air and in vacuum," Journal
of Materials Science: Materials in Electronics, vol. 24 no. 10, pp.
3897-3904, Oct. 2013.
Lu, Qingru, Huang, Hui, and Chen, Debing,
"Analysis of the research status of tin whisker's influence on lead-free
soldering," Advanced Materials Research, vol. 834-836, pp.
876-879, Oct. 2013.
Nishimura, Tetsuro,
"Pushing the Limits of Lead-Free Soldering," Surface Mount Technology
(SMT), vol. 28 no. 10, pp. 12,14-16,18-20,22,24,26, Oct. 2013.
Sarobol, P., Wang, Y., Chen, W. H., Pedigo, A. E., Koppes, J. P., Blendell,
J. E., and Handwerker, C. A.,
"A Predictive Model for Whisker Formation Based on Local Microstructure and
Grain Boundary Properties," JOM, vol. 65 no. 10, pp. 1350-1361,
Oct. 2013.
Sentz, Scott,
"Fusion Processing of Surface Mount Components to Mitigate Tin Whiskers,"
Microwave Journal, vol. 56 no. 10, pp. 144,146,148,150,152, Oct.
2013.
Diyatmika, Wahyu, Chu, J. P., and Yen, Y. W.,
"Effects of Annealing on Sn Whisker Formation: Role of Cu Alloy Seed Layer,"
2013 8th International Microsystems, Packaging, Assembly and Circuits
Technology Conference, Taipei, Taiwan, Oct. 22-25, 2013, pp. 319-322.
Cable, Alan, and Cox, Roger,
"Lead Tinning Requirements for the 21st Century," SMTA International
2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp.
577-582.
Daya, Andrew, and Ramkumar, S. Manian,
"Effect of Mixed Alloy BGA Re-Balling on Board Level Drop Test Reliability,"
SMTA International 2013 Conference Proceedings, Fort Worth, TX,
Oct. 13-17, 2013, pp. 859-865.
Naugler, Don, and Wetterman, Bob,
"Ultra-Fine Pitch Reballing - What Needs to Change?," SMTA International
2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp.
853-858.
Schoeller, Harry, and Meilunas, Michael,
"Fine Pitch Re-ball and Reliability," SMTA International 2013 Conference
Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 551-558.
Huang, Lin, Lin, Xuenian, Chen, Renwu, and Wang, Jiangyong,
"Sn whisker growth in Cu(top)-Sn(bottom) bilayer system upon room temperature
aging," Advanced Materials Research, vol. 785-786, pp. 918-923,
Sept. 2013.
Hwang, Jennie S.,
"Tin Whiskers: Phenomena and Observations," Surface Mount Technology
(SMT), vol. 28 no. 9, pp. 12-13, Sept. 2013.
Snipes, E. K., Flowers, G.,T., Lall, P., and Bozack, M. J.,
"Role of Incorporated Hydrogen and Sputtered Grain Size on Tin Whiskering,"
2013 IEEE 59th Holm Conference on Electrical Contacts, Newport,
RI, Sept. 22-25, 2013, pp. xx-xx.
Jo, Jung-Lae, Kim, Keun-Soo, Sugahara, Tohru, Nagao, Shijo, Hamasaki, Kyoko,
Tsujimoto, Masanobu, and Suganuma, Katsuaki,
"Least lead addition to mitigate tin whisker for ambient storage,"
Journal of Materials Science: Materials in Electronics, vol. 24 no. 8,
pp. 3108-3115, Aug. 2013.
Stoyanov, Stoyan, Bailey, Chris, Alam, M. O., Yin, Chunyan, Best, Chris,
Tollafield, Peter, Crawford, Rob, Parker, Mike, and Scott, Jim,
"Modelling methodology for thermal analysis of hot solder dip process,"
Microelectronics Reliability, vol. 53 no. 8, pp. 1055-1067, Aug. 2013.
Weinberger, Christopher R.,
"Modeling Tin Whisker Growth," Sandia Report 2013-6818, Aug. 2013.
Liu, Sihan, Ma, Limin, Shu, Yutian, Zuo, Yong, and Guo, Fu,
"Effects of POSS-Silanol Addition on the Whisker Formation in Sn3.0Ag0.5Cu
Pb-Free Solder," 2013 14th International Conference on Electronic
Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 765-768.
Liu, Ting, Ding, Dongyan, Hu, Yu, and Gong, Yihua,
"Tin Whisker Growth on Electroplating Sn Bilayer," 2013 14th
International Conference on Electronic Packaging Technology, Dalian,
China, Aug. 11-14, 2013, pp. 931-936.
Horvath, Barbara,
"Influence of copper diffusion on the shape of whiskers grown on bright tin
layers," Microelectronics Reliability, vol. 53 no. 7, pp.
1009-1020, July 2013.
Zhang, Shizhong, Rong, Weibin, and Sun, Lining,
"Development of a Nanomanipualtion System for Handling Nanowires," Key
Engineering Materials, vol. 562-565, pp. 1092-1097, July 2013.
Bin, Zhou, Zhonghua, Wan, Xunping, Li, and Yun-fei, En,
"Research on Tin Whisker Growth of Pure Tin Plating of Different Lead
Substrates," 2013 20th IEEE International Symposium on the Physical and
Failure Analysis of Integrated Circuits, Suzhou, China, July 15-19,
2013, pp. 611-614.
Chason, Eric, Jadhav, Nitin, Pei, Fei, Buchovecky, Eric, and Bower, Allan,
"Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms,"
Progress in Surface Science, vol. 88 no. 2, pp. 103-131, May
2013.
https://doi.org/10.1016/j.progsurf.2013.02.002
Sarobol, Pylin,
Effects of Local Film Properties on the Nucleation and Growth of Tin
Whiskers and Hillocks. Ph. D. Thesis for Purdue University, West
Lafayette, IN, May 2013.
Chockalingam, K., Tonks, M. R., Hales, J. D., Gaston, D. R., Millett, P. C.,
and Zhang, Liangzhe,
"Crystal plasticity with Jacobian-Free Newton-Krylov," Computational
Mechanics, vol. 51 no. 5, pp. 617-627, May 2013.
Hwang, Jennie S.,
"Tin Whiskers: Clarity First," Surface Mount Technology (SMT),
vol. 28 no. 5, pp. 12,14,16, May 2013.
Illes, Balazs, and Horvath, Barbara,
"Whiskering behaviour of immersion tin surface coating,"
Microelectronics Reliability, vol. 53 no. 5, pp. 755-760, May 2013.
Wickham, Martin,
"The Attraction of Sn Whiskers," 4th Electronic Materials and
Assembly Processes for Space (EMPS) Workshop, Aalborg, Denmark, May 29,
2013.
Kang, Sung K., Chang, Jaewon, Lee, Jae-Ho, Kim, Keun-Soo, and Lee, Hyuck Mo,
"Plastic Deformation Effect on Sn Whisker Growth in Electroplated Sn and Sn-Ag
Solders," 2013 IEEE 63rd Electronic Components and Technology Conference
, Las Vegas, NV, May 28-31, 2013, pp. 1018-1023.
Sarobol, P., Koppes, J. P., Chen, W. H., Su, P., Blendell, J. E., and
Handwerker, C. A.,
"Recrystallization as a nucleation mechanism for whiskers and hillocks on
thermally cycled Sn-alloy solder films," Materials Letters, vol.
99, pp. 76-80, May 15, 2013.
Cho, Junghyun, Meschter, Stephan J., Maganty, Suraj, Starkey, Dale, Gomez,
Mario, Edwards, David G., Ekin, Abdullah, Elsken, Kevin, Keeping, Jason,
Snugovsky, Polina, and Kennedy, Jeff,
"Characterization of Hybrid Conformal Coatings Used for Mitigating Tin Whisker
Growth," International Conference on Soldering & Reliability 2013
Proceedings, Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.
Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and
Kosiba, Eva,
"SERDP Tin Whisker Testing and Modeling: High Temperature/High Humidity
Conditions," International Conference on Soldering & Reliability
2013 Proceedings, Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.
Tsujimoto, Masanobu, Hashimoto, Shigeo, Kiso, Masayuki, Ikumoto, Raihei, Kano,
Toshikazu, Kanamori, Genki, Gudeczauskas, Don, and Milad, George,
"The Elimination of Whiskers from Electroplated Tin," International
Conference on Soldering & Reliability 2013 Proceedings, Toronto,
Ontario, Canada, May 14-17, 2013, pp. xx-xx.
Chason, Eric,
"Correlating Whisker/Hillock Growth with Compressive Stress in Sn during
Thermal Cycling," Tin Whisker Group teleconference, May 8, 2013.
Pei, Fei, and Chason, Eric,
"Correlating Whisker/Hillock Growth with Compressive Stress in Sn during
Thermal Cycling," Tin Whisker Group Teleconference, May 8, 2013.
Kim, Keun-Soo, Kim, Sun-Sik, Yorikado, Yuuhi, Suganuma, Katsuaki, Tsujimoto,
Masanobu, and Yanada, Isamu,
"Sn whisker growth on Sn plating with or without surface treatment during the
room temperature exposure," Journal of Alloys and Compounds, vol.
558, pp. 125-130, May 5, 2013.
Ye, Huan, Xue, Songbai, and Pecht, Michael,
"Effects of thermal cycling on rare earth (Pr)-induced Sn whisker/hillock
growth," Materials Letters, vol. 98, pp. 78-81, May 1, 2013.
Hillman, Craig,
"What's the secret to tin whiskers?," Global SMT and Packaging
, vol. 13 no. 4, pp. 38-39,41, Apr. 2013.
Marques, V. M. F., Johnston, C., and Grant, P. S.,
"Nanomechanical characterization of Sn-Ag-Cu/Cu joints-Part 1: Young's
modulus, hardness and deformation mechanisms as a function of temperature,"
Acta Materialia, vol. 61 no, 7, pp. 2460-2470, Apr. 2013.
Sarobol, P., Blendell, J. E., and Handwerker, C. A.,
"Whisker and hillock growth via coupled localized Coble creep, grain boundary
sliding, and shear induced grain boundary migration," Acta Materialia
, vol. 61 no. 6, pp. 1991-2003, Apr. 2013.
Yeh, T. K., Lin, K. L., and Mohanty, U. S.,
"Effect of Ag on the Microstructure of Sn-8.5Zn-xAg-0.01Al-0.1Ga Solders Under
High-Temperature and High-Humidity Conditions," Journal of Electronic
Materials, vol. 42 no. 4, pp. 616-627, Apr. 2013.
Montgomery, Jeff,
"AEM, Inc.," Tin Whisker Group teleconference, Apr. 24, 2013.
Li, Ruying, Zhang, Yong, and Sun, Xueliang,
"Self-assembly synthesis and mechanism investigation of branched core-shell
hybrids of tin nanowires and carbon nanotubes," Journal of Materials
Research, vol. 28 no. 7, pp. 969-975, Apr. 14, 2013.
Larson, Kent,
"Increasing Electronics Reliability With Conformal Coatings," Design
News, vol. 68 no. 3, pp. 36-38, Mar. 2013.
Susan, Donald, Michael, Joseph, Grant, Richard P., Mckenzie, Bonnie, and
Yelton, W. Graham,
"Morphology and Growth Kinetics of Straight and Kinked Tin Whiskers,"
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials
Science, vol. 44 no. 3, pp. 1485-1496, Mar. 2013.
https://doi.org/10.1007/s11661-012-1488-7
Sarobol, Pylin, Chen, Wei-Hsun, Pedigo, Aaron E., Su, Peng, Blendell, John E.,
and Handwerker, Carol A.,
"Effects of local grain misorientation and b-Sn elastic anisotropy on whisker
and hillock formation," Journal of Materials Research, vol. 28 no.
5, pp. 747-756, Mar. 14, 2013.
Sarobol, Pylin, Chen, Wei-Hsun, Pedigo, Aaron E., Su, Peng, Blendell, John E.,
and Handwerker, Carol A.,
"Effects of local grain misorientation and b-Sn elastic anisotropy on whisker
and hillock formation - CORRIGENDUM," Journal of Materials Research
, vol. 28 no. 5, pp. 785, Mar. 14, 2013.
Hillman, Dave, and Lesniewski, Tom,
"An Investigation of Whisker Growth on Tin Coated Wire and Braid," Tin Whisker
Group teleconference, Mar. 6, 2013.
"Tin Whisker Mitigation & Conformal Coating," Surface Mount
Technology (SMT), vol. 28 no. 2, pp. 57, Feb. 2013.
Devlin, Mark,
"Technically Revisited: Elminiating Tin Whiskers," Finishing World
, pp. 23,26, Feb. 2013.
Hong, Won Sik, Oh, Chul Min, and Kim, Do Seop,
"Mitigation and Verification Methods for Sn Whisker Growth in Pb-Free
Automotive Electronics." Journal of Electronic Materials, vol. 42
no. 2, pp. 332-347, Feb. 2013.
Jadhav, Nitin, Williams, Maureen, Pei, Fei, Stafford, Gery, and Chason, Eric,
"Altering the Mechanical Properties of Sn Films by Alloying with Bi: Mimicking
the Effect of Pb to Suppress Whiskers," Journal of Electronic Materials
, vol. 42 no. 2, pp. 312-318, Feb. 2013.
Williams, J. J., Chapman, N. C., and Chawla, N.,
"Mechanisms of Sn Hillock Growth in Vacuum by In Situ Nanoindentation in a
Scanning Electron Microscope (SEM)." Journal of Electronic Materials
, vol. 42 no. 2, pp. 224-229, Feb. 2013.
Hunt, Chris, Wickham, Martin, Zou, Ling, Thomas, Owen, and Zhang, Bufa,
"Assessment of Reterminated RoHS Components for SnPb Applications,"
IPC APEX Expo 2013, San Diego, CA, Feb. 17-21, 2013, pp. xx-xx.
Li, Cai-Fu, Liu, Zhi-Quan, and Shang, Jian-Ku,
"The effects of temperature and humidity on the growth of tin whisker and
hillock from Sn5Nd alloy," Journal of Alloys and Compounds, vol.
550, pp. 231-238, Feb. 15, 2013.
Li, Cai-Fu, and Liu, Zhi-Quan,
"Microstructure and growth mechanism of tin whiskers on RESn3 compounds,"
Acta Materialia, vol. 61 no. 2, pp. 589-601, Jan. 2013.
Handwerker, Carol,
"Tin Whisker Formation: A Predictive Model Based on Local Microstructure and
Grain Boundary Properties," Tin Whisker Group teleconference, Jan. 30, 2013.
Sarobol, Pylin, Chen, Wei-Hsun, Wang, Ying, Koppes, John P., Pedigo, Aaron E.,
Su, Peng, Blendell, John E., and Handwerker, Carol A.,
"Tin Whisker Formation: A Predictive Model Based on Local Microstructure and
Grain Boundary Properties," Tin Whisker Group Teleconference, Jan. 30, 2013.
van den Bosch, Brett,
"Cause of tin whiskers identified," Dataweek, vol. 36 no. 1,
pp. 4, Jan. 23, 2013.
Wang, Z., Adhikari, S. S., Kroener, M., Kojda, D., Mitdank, R., Fischer, S.
F., Toellner, W., Nielsch, K., and Woias, P.,
"Electrical Conductivity and Seebeck Coefficient Measurements of Single
Nanowires by Utilizing a Microfabricated Thermoelectric Nanowire
Characterization Platform," 2013 IEEE 26th International Conference on
Micro Electro Mechanical Systems, Taipei, Taiwan, Jan. 20-24, 2013, pp.
508-511.
Susan, Don,
"Tin Whisker Work at Sandia National Laboratories," Tin Whisker Group
teleconference, Jan. 9, 2013.
Crandall, Erika R.,
Factors Governing Tin Whisker Growth. Ph. D. Thesis for
Auburn University, Auburn, AL, 2012.
Han, Sungwon,
Assessment of an Electrical Shorting and Metal Vapor Arcing Potential of
Tin Whiskers. Ph. D. Thesis for University of Maryland, College Park,
MD, 2012.
Horvath, Barbara,
Examination of Tin Whisker Growth in Electronic Assemblies.
Ph. D. Thesis for Budapest University of Technology and Economics, Budapest,
Hungary, 2012.
Lee, Hoyong,
Avionics Reliability Assurance Guidelines for High Altitude Applications
. Ph. D. Thesis for State University of New York at Binghamton,
Binghamton, NY, 2012.
Michael, Joseph R., McKenzie, Bonnie, and Susan, Don F.,
"Crystallographic Characterization of Whiskers using EBSD: Examples from Tin
Whiskers," Sandia Report SAND2012-0278C, 2012.
Mizuguchi, Yukiko, Murakami, Yosuke, Tomiya, Shigetaka, Asai, Tadashi, Kiga,
Tomoya, and Suganuma, Katsuaki,
"Effect of Crystal Orientation on Sn Whisker-Free Sn-Ag-Cu Plating,"
Materials Transactions, vol. 53 no. 12, pp. 2078-2084, 2012.
Murakami, Koji, Hino, Makoto, Mitooka, Yutaka, and Kanadani, Teruto,
"Formation and Growth of Tin Whiskers on Aluminum-Tin Alloys," Materials
Transactions, vol. 53 no. 1, pp. 209-216, 2012.
Sun, Yong,
Micro/Nano-Scale Investigation on Tin Alloys and Tin Dioxide Nanowires
. Ph. D. Thesis for University of South Carolina, Columbia, SC, 2012.
Xue, Peng, Xue, Songbai, Shen, Yifu, Xiao, Zhengxiang, Zhu, Hong, Long,
Weimin, and Yu, Xinquan,
"Effect of Pr on properties and Sn whisker growth of Sn-9Zn-xPr solder,"
Soldering & Surface Mount Technology, vol. 24 no. 4, pp.
280-286, 2012.
Anderson, A. F.,
"Provisional notes on the CTS electronic accelerator pedals as used in some
Toyota vehicles," Dec. 15, 2012.
Liu, Ting, Ding, Dongyan, Wang, Yiqing, Hu, Yu, Gong, Yihua, and Galuschki,
Klaus-Peter,
"Ni Barrier for Tin Whisker Mitigation," 2012 2nd IEEE CPMT Symposium
Japan, Kyoto, Japan, Dec. 10-12, 2012, pp. xx-xx.
Onuki, Hiroshi, and Shibutani, Tadahiro,
"In-situ Observation of Whisker Nucleation in Air with AFM," 2012 2nd
IEEE CPMT Symposium Japan, Kyoto, Japan, Dec. 10-12, 2012, pp. xx-xx.
Crandall, E. R., Flowers, G. T., Lall, P., and Bozack, M. J.,
"Whisker Growth From Sn Solder Alloys," 2012 IEEE 14th Electronics
Packaging Technology Conference, Singapore, Singapore, Dec. 5-7, 2012,
pp. 671-675.
Tyler, Don,
"Robotic Hot Solder Dip for Prevention of Tin Whiskers and Weak Solder
Joints," Tin Whisker Group teleconference, Nov. 6, 2012.
Anglin, Benjamin Stewart,
Investigation and Characterization of Thermoelastic Eigenstresses Near
Microstructural Features and the Application to Tin Whisker Growth.
Ph. D. Thesis for Carnegie Mellon University, Pittsburgh, PA, Oct. 2012.
Chada, Srinivas,
"Topics in Lead-Free Solders: Interfacial and Sn Whisker Growth," JOM
, vol. 64 no. 10, pp. 1174-1175, Oct. 2012.
Dunn, B. D.,
"Guidelines for Creating a Lead-Free Control Plan," European Space Agency
STM-281, Oct. 2012.
Pei, Fei, Jadhav, Nitin, and Chason, Eric,
"Correlation Between Surface Morphology Evolution and Grain Structure:
Whisker/Hillock Formation in Sn-Cu," JOM, vol. 64 no. 10, pp.
1176-1183, Oct. 2012.
Tulkoff, Cheryl,
"A New & Better Approach to Tin Whisker Mitigation (Tutorial 14),"
SMTA International Conference, Orlando, FL, Oct. 15, 2012.
Pinsky, David,
"Tin Whisker Risk Management for High Reliability Systems," SMTA
International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18,
2012, pp. xx-xx.
Lead-Free Surface Finishes for Electronic Components: Tin Whisker Growth
(before Oct. 2, 2012)
Jiang, N., Yang, M., Novak, J., Igor, P., and Osterman, M.,
"Sn whiskers removed by energy photo flashing," Applied Surface Science
, vol. 258 no. 24, pp. 9599-9603, Oct. 1, 2012.
Han, Sungwon, Osterman, Michael, Meschter, Stephan, and Pecht, Michael,
"Evaluation of Effectiveness of Conformal Coatings as Tin Whisker Mitigation,"
Journal of Electronic Materials, vol. 41 no. 9, pp. 2508-2518,
Sept. 2012.
Korsunsky, Alexander M., Hofmann, Felix, Abbey, Brian, Song, Xu, Belnoue,
Jonathan P., Mocuta, Cristian, and Dolbnya, Igor,
"Analysis of the internal structure and lattice (mis)orientation in individual
grains of deformed CP nickel polycrystals by synchrotron X-ray
micro-diffraction and microscopy," International Journal of Fatigue
, vol. 42, pp. 1-13, Sept. 2012.
https://doi.org/10.1016/j.ijfatigue.2011.03.003
Zapanta, Loren R.,
"Tin Whisker White Paper: JESD201 Approach," Cypress, Sept. 2012.
Crandall, E. R., Flowers, G. T., Lall, P., Snipes, E. K., and Bozack, M. J.,
"The Influence of Surface Oxides on Whiskering," 2012 IEEE 58th Holm
Conference on Electrical Contacts, Portland, OR, Sept. 23-26, 2012, pp.
xx-xx.
Crandall, E. R., Flowers, G. T., Lall, P., and Bozack, M. J.,
"Whisker Prevention Using Hard Metal Cap Layers," 2012 IEEE 58th Holm
Conference on Electrical Contacts, Portland, OR, Sept. 23-26, 2012, pp.
xx-xx.
Shin, Ho Sun, Jeon, Seong Gi, Yu, Jin, and Song, Jae Yong,
"Transformation of Sn nanowires to oxide nanotubes by a localized corrosion
process," Materials Letters, vol. 82, pp. 22-25, Sept. 1, 2012.
Fortier, Aleksandra, and Kovacevic, Radovan,
"Internal Microstructure Investigation of Tin Whisker Growth Using FIB
Technology," Journal of Electronic Materials, vol. 41 no. 8, pp.
2029-2034, Aug. 2012.
Han, Sungwon, Osterman, Michael, and Pecht, Michael,
"Likelihood of Metal Vapor Arc by Tin Whiskers," Surface Mount
Technology (SMT), vol. 27 no. 8, pp. 48-50,52,54,56, Aug. 2012.
Koppes, John Patrick,
Effect of Crystallographic Orientation on Hillock Formation in Thermally
Cycled Large Grain Tin Films. Ph. D. Thesis for Purdue University,
West Lafayette, IN, Aug. 2012.
Lee, David M., and Pinol, Lesly A.,
"Effects of Tin and Copper Nanotexturization on Tin Whisker Formation,"
Surface Mount Technology (SMT), vol. 27 no. 8, pp.
18-20,22-24,26,28,30, Aug. 2012.
Lesniewski, Thomas, and Hillman, Dave,
"An Investigation of Whisker Growth on Tin-Coated Wire and Braid,"
Surface Mount Technology (SMT), vol. 27 no. 8, pp.
32-34,36,38-40,42-43, Aug. 2012.
Sentz, Scott,
"Tin Whisker Mitigation Process for Surface Mount Components," Surface
Mount Technology (SMT), vol. 27 no. 8, pp. 58-60,62, Aug. 2012.
Liu, Ting, Ding, Dongyan, Wang, Yiqing, Hu, Yu, Gong, Yihua, and Galuschki,
Klaus-Peter,
"Tin Whisker Growth on Bright Sn Films Supported by Lead-frame Alloy
Substrates," 2012 13th International Conference on Electronic Packaging
Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012,
pp. 1145-1149.
Liu, Zhi-Quan, and Li, Cai-Fu,
"Spontaneous tin whisker growth from rare-earth tin alloys," 2012 13th
International Conference on Electronic Packaging Technology and High Density
Packaging, Guilin, China, Aug. 13-16, 2012, pp. 373-375.
Yin, C. Y., Best, C., Bailey, C., Stoyanov, S., and Alam, M. O.,
"Statistical Analysis of the Impacts of Refinishing Process on the Reliability
of Microelectronics Components," 2012 13th International Conference on
Electronic Packaging Technology and High Density Packaging, Guilin,
China, Aug. 13-16, 2012, pp. 1377-1381.
Yuan, Jiaojiao, Wang, Xuefang, Lv, Zhicheng, Shi, Shuai, Wang, Yuzhe, and Liu,
Sheng,
"Study of Factors Influencing Tin Whisker Growth," 2012 13th
International Conference on Electronic Packaging Technology and High Density
Packaging, Guilin, China, Aug. 13-16, 2012, pp. 940-944.
Blanche, J. F., and Strickland, S. M.,
"Lead-Free Experiment in a Space Environment," NASA/TM-2012-217463, July
2012.
Kuwano, Noriyuki, Horikami, Sadanori, Maeda, Masanori, and Sosiati, Harini,
"TEM and SEM Analysis for Formation Mechanism of Tin Whiskers," Advanced
Materials Research, vol. 545, pp. 16-20, July 2012.
Mizuguchi, Yukiko, Murakami, Yosuke, Tomiya, Shigetaka, Asai, Tadashi, Kiga,
Tomoya, and Suganuma, Katsuaki,
"Effect of Crystal Orientation on Mechanically Induced Sn Whiskers on Sn-Cu
Plating," Journal of Electronic Materials, vol. 41 no. 7, pp.
1859-1867, July 2012.
Tian, Jun, and Hao, Hu,
"Rapid Growth of Tin Whiskers on the Surface of Sn3.8Ag0.7Cu1.0Y Alloy,"
Advanced Materials Research, vol. 557-559, pp. 1397-1403, July
2012.
Chang, Jaewon, Seo, Sun-Kyoung, Cho, Moon Gi, Lee, Dong Nyung, Kang, Kyoo-Sik,
and Lee, Hyuck Mo,
"Effects of Be and Co addition on the growth of Sn whiskers and the properties
of Sn-based Pb-free solders," Journal of Materials Research, vol.
27 no. 14, pp. 1877-1886, July 28, 2012.
Ye, Huan, Xue, Songbai, and Pecht, Michael,
"Evaluation of the microstructure and whisker growth in Sn-Zn-Ga solder with
Pr content," Journal of Materials Research, vol. 27 no. 14, pp.
1887-1894, July 28, 2012.
Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and
Kosiba, Eva,
"SERDP Tin Whisker Testing and Modeling: Low Stress Conditions," Tin
Whisker Group Teleconference, July 25, 2012.
Murray, Charles,
Tin Whiskers Again Cited as Potential Problem for Toyotas, DesignNews,
July 25, 2012.
Osterman, Michael,
"CALCE Whisker Research," Tin Whisker Group teleconference, July 11, 2012.
Sharma, Ashutosh, Bhattacharya, Sumit, Sen, Ranjan, Reddy, B. S. B., Fecht,
H.-J., Das, Karabi, and Das, Siddhartha,
"Influence of current density on microstructure of pulse electrodeposited tin
coatings," Materials Characterization, vol. 68, pp. 22-32, June
2012.
Horvath, Barbara, Illes, Balazs, Shinohara, Tadashi, and Harsanyi, Gabor,
"Whisker growth on annealed and recrystallized tin platings," Thin Solid
Films, vol. 520 no. 17, pp. 5733-5740, June 30, 2012.
Xian, Ai-Ping, and Liu, Meng,
"Effect of humidity on tin whisker growth from Sn3Nd intermetallic compound,"
Journal of Materials Research, vol. 27 no. 12, pp. 1652-1662,
June 28, 2012.
Chinn, Jeff,
"IST Super-Hydrophobic ALD Coatings," Tin Whisker Group teleconference, June
6, 2012.
Fortier, Aleksandra, and Pecht, Michael G.,
"Comparative Study of Metal Films and Their Affinity for Metal Whisker
Growth," IEEE Transactions on Components, Packaging, and Manufacturing
Technology, vol. 2 no. 5, pp. 739-747, May 2012.
Terasaki, Takeshi, Kato, Takahiko, Iwasaki, Tomio, Ookura, Yasutaka,
Nakamura, Masato, Ishii, Hideki, and Yamamoto, Kenji,
"Prediction of Tin-Whiskers Generation during Thermal Cycle Test Using Stress
and Mass-Diffusion Analysis," 2012 IEEE 62nd Electronic Components and
Technology Conference, San Diego, CA, May 29-June 1, 2012, pp.
1183-1189.
Pei, Fei, Jadhav, Nitin, and Chason, Eric,
"Correlating whisker growth and grain structure on Sn-Cu samples by real-time
scanning electron microscopy and backscattering diffraction characterization
," Applied Physics Letters, vol. 100 no. 22, pp.
221902-1-221902-4, May 28, 2012.
Kostic, Andrew D.,
"The Aerospace Corporation Lead-Free Working Group (LFWG)," Tin Whisker Group
teleconference, May 16, 2012.
Meschter, Stephen, Snugovsky, Polina, Kennedy, Jeff, McKeown, Steve, Bagheri,
Zohreh, and Kosiba, Eva,
"Tin Whisker Testing and Modeling: Low Stress Conditions," International
Conference on Soldering and Reliability, Toronto, Ontario, Canada, May
16-18, 2012, pp. xx-xx.
Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and
Kosiba, Eva,
"Tin Whisker Testing: Low Stress Conditions," International Conference
on Soldering and Reliability, Toronto, Ontario, Canada, May 15-18,
2012, pp. xx-xx.
Illes, Balazs, Horvath, Barbara, Lipak, Balazs, and Geczy, Attila,
"Investigating Whisker Growth on Immersion Tin Surface Finishing," 2012
35th International Spring Seminar on Electronics Technology, Bad
Aussee, Austria, May 9-13, 2012, pp. 242-247.
Anderson, Antony,
"Sudden Acceleration/Surge Incident Brandon Street, Wellington NZ," May
9, 2012.
Brusse, Jay,
Melting a TIN WHISKER Using a Volt/Ohm Meter, Youtube, May 3, 2012.
Kinoshita, Y., Matsushima, H., and Ohno, N.,
"Predicting active slip systems in b-Sn from ideal shear resistance,"
Modelling and Simulation in Materials Science and Engineering,
vol. 20 no. 3, pp. 035003-1-035003-9, Apr. 2012.
Panashchenko, Lyudmyla,
"The Art of Appreciating Metal Whiskers: A Practical Guide for Electronics
Professionals," IPC Tin Whisker Symposium, Dallas, TX, Apr.
17, 2012, pp. xx-xx.
Panaschenko, Lyudmyla,
"The Art of Metal Whisker Appreciation: A Practical Guide for Electronics
Professionals," IPC International Tin Whisker Conference,
Fort Worth, TX, Apr. 17-19, 2012, pp. xx-xx.
Stoyanov, Stoyan, Bailey, Chris, Tollafield, Peter, Crawford, Rob, Parker,
Mike, Scott, Jim, and Roulston, John,
"Thermal Modelling and Optimisation of Hot Solder Dip Process," 2012
13th International Conference on Thermal, Mechanical and Multi-Physics
Simulation and Experiments in Microelectronics and Microsystems,
Lisbon, Portugal, Apr. 16-18, 2012, pp. xx-xx.
Hillman, Dave,
"Tin Whiskers: A 2012 State of the Industry Assessment," IPC Webinar, Apr. 5,
2012.
"Tin Whisker Mitigation on New and Stored Parts," Printed Circuit Design
and Fab/ Circuits Assembly, vol. 29 no. 3, pp. 36-37, Mar. 2012.
Desmarest, S. Godard,
"Reliability of Pb-free solders for harsh environment electronic assemblies,"
Materials Science and Technology, vol. 28 no. 3, pp. 257-273,
Mar. 2012.
Jadhav, Nitin, Wasserman, Jacob, Pei, Fei, and Chason, Eric,
"Stress Relaxation in Sn-Based Films: Effects of Pb Alloying, Grain Size, and
Microstructure," Journal of Electronic Materials, vol. 41 no. 3,
pp. 588-595, Mar. 2012.
"Examples of Whiskergrowing in Industry Applications," 3rd
Electronic Materials and Assembly Processes for Space (EMPS) Workshop,
Genova, Italy, Mar. 21, 2012.
"Tin Whiskers 2012," 3rd Electronic Materials and Assembly Processes
for Space (EMPS) Workshop, Genova, Italy, Mar. 21, 2012.
Dunn, Barrie,
"Conformal Coatings - the importance of mechanical properties with respect to
tin whisker mitigation," 3rd Electronic Materials and Assembly
Processes for Space (EMPS) Workshop, Genova, Italy, Mar. 21, 2012.
Hunt, Christopher,
"An Overview of NPL studies related to Spacecraft electronics'," 3rd
Electronic Materials and Assembly Processes for Space (EMPS) Workshop,
Genova, Italy, Mar. 21, 2012.
Mozdzen, Grazyna, Jogl, Christian, and Schorn, Leopold,
"Study on Tin Whiskers: Microstructure, Formation and Thickness of Tin Oxide,"
3rd Electronic Materials and Assembly Processes for Space (EMPS)
Workshop, Genova, Italy, Mar. 21, 2012.
Hao, Hu, Xu, Guangchen, Song, Yonglun, Shi, Yaowu, and Guo, Fu,
"A Model for Rapid Tin Whisker Growth on the Surface of ErSn3 Phase,"
Journal of Electronic Materials, vol. 41 no. 2, pp. 184-189, Feb. 2012.
Milad, George,
"The Elimination of Whiskers from Electroplated Tin," Metal Finishing
, vol. 110 no. 1, pp. 10-15, Jan.-Feb. 2012.
Snugovsky, Polina, Meschter, Stephan, Bagheri, Zohreh, Kosiba, Eva, Romansky,
Marianne, and Kennedy, Jeffrey,
"Whisker Formation Induced by Component and Assembly Ionic Contamination,"
Journal of Electronic Materials, vol. 41 no. 2, pp. 204-223, Feb.
2012.
Smetana, Joe,
"HDPUG Pb-Free Board Materials Reliability Project 2: Moisture Sensitivity and
Its Effect on Delamination," Tin Whisker Group teleconference, Feb. 29, 2012.
Tranitz, Hans-Peter, and Dunker, Sebastian,
"Growth Mechanisms of Tin Whiskers at Press-in Technology," IPC APEX
EXPO, San Diego, CA, Feb. 28, 2012.
Biglari, M. H., Nazarian, A., Denteneer, R., Biglari Jr., M., and Kodentsov,
A. A.,
"Reliability of BGA Solder Joints after Re-Balling Process," IPC
APEX Expo 2012, San Diego, CA, Feb. 28-Mar. 1, 2012, pp. xx-xx.
Hillman, Dave, Pearson, Tim, and Lesniewski, Thomas,
"An Investigation of Whisker Growth on Tin Coated Wire and Braid,"
IPC APEX Expo 2012, San Diego, CA, Feb. 28-Mar. 1, 2012, pp. xx-xx.
Lee, David M., and Pinol, Lesly A.,
"Effects of Tin and Copper Nanotexturization on Tin Whisker Formation,"
IPC APEX Expo 2012, San Diego, CA, Feb. 28-Mar. 1, 2012, pp.
xx-xx.
Chason, Eric,
"Real-Time Study of Whisker/Hillock Formation in Sn-Cu Systems by EBSD
Characterization," Tin Whisker Group teleconference, Feb. 22, 2012.
Pei, Fei, Jadhav, Nitin, Buchovecky, Eric, Chason, Eric, Bower, Allan, and
Kumar, Sharvan,
"Real-Time Study of Whisker/Hillock Formation in Sn-Cu Systems by EBSD
Characterization," Tin Whisker Group Teleconference, Feb. 22, 2012.
Bozack, Michael J.,
"Research Activities in Surface Physics," Tin Whisker Group teleconferences,
Feb. 15, 2012, Mar. 21, 2012, and Apr. 25, 2012.
Mason, Maribeth, Eng, Genghmun, Leung, Martin, Stupian, Gary, and Yeoh,
Terence,
"Tin Whisker Risk Assessment for Space Systems," Electronic Device
Failure Analysis, vol. 14 no. 1, pp. 14-20, Feb. 2012.
Chawla, Nik,
"Overview of Pb-free Solder Research Activities," Tin Whisker Group
teleconference, Feb. 1, 2012.
Nakai, Kiyomichi, Sakamoto, Tatsuaki, Miyamoto, Takeaki, and Kobayashi, Sengo,
"Formation of whisker in pure Sn under tensile stress and a method of its
suppression," Materials Science Forum, vol. 706-709, pp. 751-756,
Jan. 2012.
Sorensen, Henning O., Schmidt, Soren, Wright, Jonathan P., Vaughan, Gavin B.
M., Techert, Simone, Garman, Elspeth F., Oddershede, Jette, Davaasambuu, Jav,
Paithankar, Karthik S., Gundlach, Carsten, and Poulsen, Henning F.,
"Multigrain crystallography," Zeitschrift fur Kristallographie -
Crystalline Materials, vol. 227 no. 1, pp. 63-78, Jan. 2012.
Susan, Donald F., Michael, Joseph R., Yelton, W. Graham, McKenzie, Bonnie B.,
Grant, Richard P., Pillars, Jamin, and Rodriguez, Mark A.,
"Understanding and Predicting Metallic Whisker Growth and its Effects on
Reliability: LDRD Final Report,", Sandia Report SAND2012-0519, Jan. 2012.
Umeno, Yoshitaka, and Negami, Jun,
"Atomistic Simulation of Stress-Induced Grain Boundary Diffusion: For
Tin-Whisker Problem," Materials Science Forum, vol. 706-709, pp.
1545-1549, Jan. 2012.
Smetana, Joe,
"A Standard Multilayer Printed Wiring Board for Material Reliability
Evaluations," Tin Whisker Group teleconference, Jan. 18, 2012.
Osterman, Michael,
"Assessment of Tin Whisker Mitigation for Conformally Coated SnPb Assemblies,"
Tin Whisker Group teleconference, Jan. 11, 2012.
Grossmann, Gunter, and Zardini, Christian,
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality
Issues of Lead-Free Solder Interconnects. New York: Springer, 2011.
ISBN 978-0-85729-235-3.
$129.00 list price.
Han, Jung Kyu,
Effect of Thermo-Electromigration on Copper Dissolution and
Intermetallic Compound Formation in Flip-Chip Pb-free Solder Joints.
Ph. D. Thesis for University of California, Los Angeles, CA, 2011.
Henshall, Greg, Bath, Jasbir, and Handwerker, Carol A.,
Lead-Free Solder Process Development. Hoboken, NJ: John Wiley
& Sons, 2011. ISBN 978-0-470-41074-5.
$99.95 list price.
Hino, Makoto, Murakami, Koji, Mitooka, Yutaka, Muraoka, Ken, and Takamizawa,
Masao,
"Effect of Corrosion Atmosphere Using Environmental Test Chamber on Whisker
Growth of Tin Electroplating," Journal of The Surface Finishing
Society of Japan, vol. 62 no. 1, pp. 41-46, 2011.
Hua, L., Su, M. W., Zhang, W. J., and Hu, Q. L.,
"Electrochemical migration and rapid whisker growth of Zn and Bi dopings in
Sn-3.0Ag-0.5Cu Solder in 3wt.% NaCl Solution," Advanced Materials
Research, vol. 239-242, pp. 1751-1760, 2011.
Liu, Meng, and Xian, AiPing,
"TEM observation of tin whisker," Science China Technological Sciences
, vol. 54 no. 6, pp. 1546-1550, 2011.
Liu, W., Zschack, P., Tischler, J., Ice, G., and Larson, B.,
"X-ray Laue Diffraction Microscopy in 3D at the Advanced Photon Source,"
AIP Conference Proceedings, vol. 1365, pp. 108-111, 2011.
https://doi.org/10.1063/1.3625316
Meschter, Stephan, McKeown, Steve, Snugovsky, Polina, Kennedy, Jeff, and
Kosiba, Eva,
"Tin Whisker Testing and Risk Modeling Project," SMTA Journal,
vol. 24 no. 3, pp. 23-31, 2011.
Michael, Joseph R., McKenzie, Bonnie, and Susan, Don F.,
"Crystallographic Characterization of Whiskers using EBSD: Examples from Tin
Whiskers," Sandia Report SAND2011-5221C, 2011.
Milad, George,
"The elimination of whiskers from electroplated tin," Circuit World
, vol. 37 no. 4, pp. 10-15, 2011.
Murakami, Koji, Hino, Makoto, Mitooka, Yutaka, and Kanadani, Teruto,
"Formation and growth of tin whiskers on aluminum-tin alloys," Journal
of Japan Institute of Light Metals, vol. 61 no. 4, pp. 142-148, 2011.
Skwarek, Agata, Pluska, Mariusz, Ratajczak, Jacek, Czerwinski, Andrzej, Witek,
Krzysztof, and Szwagierczak, Dorota,
"Analysis of tin whisker growth on lead-free alloys with Ni presence under
thermal shock stress," Materials Science and Engineering B: Solid-State
Materials for Advanced Technology, vol. 176 no. 4, pp. 352-357, 2011.
https://doi.org/10.1016/j.mseb.2010.10.001
Sood, Bhanu, Osterman, Michael, and Pecht, Michael,
"Tin whisker analysis of Toyota's electronic throttle controls," Circuit
World, vol. 37 no. 3, pp. 4-9, 2011.
Su, Chien-Hao, Chen, Hao, Lee, Hsin-Yi, and Wu, Albert T.,
"Controlled positions and kinetic analysis of spontaneous tin whisker growth,"
Applied Physics Letters, vol. 99, pp. 131906-1-131906-3, 2011.
Susan, D. F., Vianco, P. T., Yelton, W. G., and Michael, J. R.,
"Recent Tin Whisker Research at Sandia," Sandia Report SAND2011-9133C,
2011.
Wright, Roger N.,
Wire Technology: Process Engineering and Metallurgy. Elsevier,
2011. ISBN 978-0-12-382092-1.
Zhang, Jinsong, and Zhang, Jianhua,
"Estimation of whiskers growth on Sn coating of Cu-Leads in different
accelerated tests," Advanced Materials Research, vol. 160-162,
pp. 1575-1581, 2011.
Clore, Nicholas G.,
Identification and Counting Procedure for Tin Whiskers, Hillocks, and
Other Surface Defects. Master's Thesis for Purdue University, Hammond,
IN, Dec. 2011.
Hua, L., and Yang, C.,
"Corrosion behavior, whisker growth, and electrochemical migration of
Sn-3.0Ag-0.5Cu solder doping with In and Zn in NaCl solution,"
Microelectronics Reliability, vol. 51 no. 12, pp. 2274-2283, Dec. 2011.
https://doi.org/10.1016/j.microrel.2011.06.023
Li, C. F., Liu, Z. Q., Shang, P. J., and Shang, J. K.,
"In situ investigation on the oxidation behavior of a RESn3 film by
transmission electron microscopy," Scripta Materialia, vol. 65
no. 12, pp. 1049-1052, Dec. 2011.
Pinol, Lesly A., Melngailis, John, Charles, Harry K., Lee, David M., Deacon,
Ryan, Coles, George, and Clatterbaugh, Guy,
"Influence of Tin Deposition Methods on Tin Whisker Formation," IEEE
Transactions on Components, Packaging and Manufacturing Technology,
vol. 1 no. 12, pp. 2028-2032, Dec. 2011.
O'Boyle, John,
"Tin Whiskers Are Real and Complex," maxim integrated Tutorials 5250, Dec.
13, 2011.
Baated, Alongheng, Kim, Keun-Soo, and Suganuma, Katsuaki,
"Effect of intermetallic growth rate on spontaneous whisker growth from a tin
coating on copper," Journal of Materials Science: Materials in
Electronics, vol. 22 no. 11, pp. 1685-1693, Nov. 2011.
Baated, Alongheng, Hamasaki, Kyoko, Kim, Sun Sik, Kim, Keun-Soo, and Suganuma,
Katsuaki,
"Whisker Growth Behavior of Sn and Sn Alloy Lead-Free Finishes," Journal
of Electronic Materials, vol. 40 no. 11, pp. 2278-2289, Nov. 2011.
Fjelstad, Joe,
"Whiskers - a coming of age event in the life of electronics too?,"
Global SMT and Packaging, vol. 11 no. 11, pp. 88-89, Nov. 2011.
Sobiech, M., Teufel, J., Welzel, U., Mittemeijer, E. J., and Hugel, W.,
"Stress Relaxation Mechanisms of Sn and SnPb Coatings Electrodeposited on Cu:
Avoidance of Whiskering," Journal of Electronic Materials, vol.
40 no. 11, pp. 2300-2313, Nov. 2011.
Suganuma, Katsuaki, Baated, Alongheng, Kim, Keun-Soo, Hamasaki, Kyoko, Nemoto,
Norio, Nakagawa, Tsuyoshi, and Yamada, Toshiyuki,
"Sn whisker growth during thermal cycling," Acta Materialia, vol.
59 no. 19, pp. 7255-7267, Nov. 2011.
"Tin Whisker Qualification and Reliability Testing," Printed Circuit
Design and Fab/ Circuits Assembly, vol. 28 no. 10, pp. 37,39, Oct.
2011.
Chason, Eric, Jadhav, Nitin, and Pei, Fei,
"Effect of Layer Properties on Stress Evolution, Intermetallic Volume, and
Density during Tin Whisker Formation," JOM, vol. 63 no. 10, pp.
62-68, Oct. 2011.
Cheng, Jing, Yang, Fuqian, Vianco, Paul T., Zhang, Bei, and Li, James C. M.,
"Optimum Thickness of Sn Film for Whisker Growth," Journal of Electronic
Materials, vol. 40 no. 10, pp. 2069-2075, Oct. 2011.
Osenbach, J. W.,
"Tin Whiskers: An Illustrated Guide to Growth Mechanisms and Morphologies,"
JOM, vol. 63 no. 10, pp. 57-60, Oct. 2011.
Horvath, Barbara, Illes, Balazs, Shinohara, Tadashi, and Harsanyi, Gabor,
"Effects of Humidity on Tin Whisker Growth - Investigated on Ni and Ag
Underplated Layer Construction," Thin Solid Films, vol. 520 No.
1, pp. 384-390, Oct. 31, 2011.
Clore, Nicholas,
"Identification and Counting Procedure for Tin Whiskers, Hillocks, and Other
Surface Defects," Tin Whisker Group teleconference, Oct. 26, 2011.
Illes, Balazs, Horvath, Barbara, Shinohara, Tadashi, and Harsanyi, Gabor,
"Tin Whisker Growth from Sn-Cu (0.5 wt%) Surface Finishes," 2011 IEEE
17th International Symposium for Design and Technology in Electronic Packaging
, Timisoara, Romania, Oct. 20-23, 2011, pp. 49-54.
Davy, Gordon,
"Tin-Whisker-Impenetrable Metal Cap Process for Electronic Assemblies: An
Analysis of Cap TW Penetrability and Prevention vs. Mitigation," Tin Whisker
Group teleconferences, Oct. 19, 2011, Nov. 2, 2011, Nov. 9, 2011, Nov. 16,
2011, Dec. 7, 2011, Dec. 21, 2011, and Jan. 25, 2012.
Hillman, Dave, and Hamand, Matt,
"Tin Whiskers: A 2011 State of the Industry Assessment (Tutorial T6),"
SMTA International 2011 Conference, Fort Worth, TX, Oct. 16-20, 2011.
Primavera, Anthony A.,
"In-process Reduction/Mitigation of Tin Whiskers by Condensing Vapor Reflow,"
SMTA International 2011 Conference Proceedings, Fort Worth, TX,
Oct. 16-20, 2011, pp. 873-880.
Sarobol, Pylin, Chen, Wei-Hsun, Blendell, John E., Su, Peng, and Handwerker,
Carol A.,
"Effects of Grain Misorientations & Strain Distribution on the Location of
Whisker Formation on Electroplated Sn-Cu films," SMTA International 2011
Conference, Fort Worth, TX, Oct. 16-20, 2011.
Brusse, Jay,
"Electrical Failure of an Accelerator Pedal Position Sensor Caused by a Tin
Whisker and Discussion of Investigative Techniques Used for Whisker
Detection," Tin Whisker Group teleconference, Oct. 12, 2011.
Pillars, Jamin, Susan, Don, Michael, Joseph, Limmer, Stephen, and Yelton,
Graham,
"Controlling the Direction of Strain Energy Driving Forces Responsible for
Whisker Growth," 5th Annual Sn Whisker Symposium, College
Park, MD, Sept. 2011, pp. xx-xx. (Sandia Report SAND2011-6490C)
Shi, Hong-Chang, and Xian, Ai-Ping,
"Tin Whisker Growth on NdSn3 Powder," Journal of Electronic Materials
, vol. 40 no. 9, pp. 1962-1966, Sept. 2011.
Sun, Yong, Hoffman, Elizabeth N., Lam, Poh-Sang, and Li, Xiaodong,
"Evaluation of local strain evolution from metallic whisker formation,"
Scripta Materialia, vol. 65 no. 5, pp. 388-391, Sept. 2011.
Wang, Yibo,
A Numerical Model of Anisotropic Mass Transport Through Grain Boundary
Networks. Master's Thesis for Lehigh University, Bethlehem, PA, Sept.
2011.
"iNEMI Updates Tin Whiskers Findings," SMT Web Exclusive Article. (before
Sept. 16, 2011)
"Nano Whiskers." (before Sept. 16, 2011)
"Tin Whiskers Syfer Surface Mount Capacitors," Syfer Application Note
AN0019 Issue 3. (before Sept. 16, 2011)
Hilty, Robert D.,
"Tin Whiskers in Electronics Components," Tyco Electronics. (before Sept.
16, 2011)
Vicenzo, Antonello,
"Tin Whiskers: Testing and Mitigation." SEMICON Europa 2006,
Munich, Germany, Apr. 5, 2006, pp. xx-xx. (before Sept. 16, 2011)
Leidecker, Henning, Panashchenko, Lyudmyla, and Brusse, Jay,
"Electrical Failure of an Accelerator Pedal Position Sensor Caused by a Tin
Whisker and Discussion of Investigative Techniques Used for Whisker
Detection," 5th International Tin Whisker Symposium, College
Park, MD, Sept. 14-15, 2011, pp. xx-xx.
Susan, Don F., Michael, Joe, McKenzie, Bonnie, and Yelton, Graham,
"Crystallographic Analysis of Tin Whiskers with SEM/EBSD," 5th
Annual Tin Whisker Conference, College Park, MD, Sept. 14-15, 2011, pp.
xx-xx. (Sandia Report SAND2011-7551C).
Crandall, E. R., Flowers, G. T., Jackson, R., Lall, P., and Bozack, M. J.,
"Growth of Sn Whiskers Under Net Compressive and Tensile Stress States,"
2011 IEEE 57th Holm Conference on Electrical Contacts,
Minneapolis, MN, Sept. 11-14, 2011, pp. xx-xx.
Crandall, E. R., Flowers, G. T., Lall, P., and Bozack, M. J.,
"Whisker Growth Under Controlled Humidity Exposure," 2011 IEEE 57th Holm
Conference on Electrical Contacts, Minneapolis, MN, Sept. 11-14, 2011,
pp. xx-xx.
Rodekohr, C. L, Flowers, G. T., Bozack, M. J., Jackson, R., Martens, R., Zhao,
Z., Crandall, E. R., Starman, V., Bitner, T., and Street, J.,
"Correlation of Intrinsic Thin Film Stress Evolution and IMC Growth with
Whisker Growth," 2011 IEEE 57th Holm Conference on Electrical Contacts
, Minneapolis, MN, Sept. 11-14, 2011, pp. xx-xx.
Zak, Pavel, Tucan, Marek, and Kudlacek, Ivan,
"Lead-free Car Electronics According to Updated ELV Directive," 2011
International Conference on Applied Electronics, Pilsen, Czech
Republic, Sept. 7-8, 2011, pp. xx-xx.
Jain, C. C., Chen, C. L., Lai, H. J., and Chuang, T. H.,
"The Inhibition of Tin Whiskers on the Surface of Sn-8Zn-3Bi-0.5Ce Solders,"
Journal of Materials Engineering and Performance, vol. 20 no. 6,
pp. 1042-1048, Aug. 2011.
Xu, C. H., Qin, X. M., Guo, W. H., and Li, Y.,
"Protrusion and whisker growth on tin coated copper substrate under stresses,"
Materials Science and Technology, vol. 27 no. 8, pp. 1271-1274,
Aug. 2011.
Zeng, Guang, Xue, Songbai, Zhang, Liang, Gao, Lili, Lai, Zhongmin, and Luo,
Jiadong,
"Properties and microstructure of Sn-0.7Cu-0.05Ni solder bearing rare earth
element Pr," Journal of Materials Science: Materials in Electronics
, vol. 22 no. 8, pp. 1101-1108, Aug. 2011.
Shin, Ho Sun, Yu, Jin, Song, Jae Yong, and Park, Hyun Min,
"Size-dependent lattice parameters of microstructure-controlled Sn nanowires,"
Journal of Materials Research, vol. 26 no. 16, pp. 2033-2039,
Aug. 28, 2011.
Kostic, Andrew D.,
"Lead-free Electronics Reliability - An Update," Tin Whisker Group
teleconferences, Aug. 24, 2011 and Aug. 31, 2011.
Ampeg B-12-XY: Tin Whiskers!, Aug. 2, 2011.
Smetana, Joe,
"Pb-free Solder Joint Reliability in a Mildly Accelerated Test Condition," Tin
Whisker Group teleconference, Aug. 10, 2011.
Hao, Hu, Tian, Jun, Xu, Guangchen, Guo, Fu, Song, Yonglun, and Shi, Yaowu,
"Irregular Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0RE Solder
Joints," 2011 12th International Conference on Electronic Packaging
Technology and High Density Packaging, Shanghai, China, Aug. 8-11,
2011, pp. 793-796.
Li, Cai-Fu, Liu, Zhi-Quan, and Shang, Jian-Ku,
"Transmission Electron Microscopy Investigations on the Growth of Tin Whiskers
from CeSn3 Substrate," 2011 12th International Conference on Electronic
Packaging Technology and High Density Packaging, Shanghai, China, Aug.
8-11, 2011, pp. 903-906.
Liu, Ting, Wang, Yiqing, Ding, Dongyan, Galuschki, Klaus-Peter, Hu, Yu,
Gong, Yihua, Li, Ming, and Mao, Dali,
"Tin Whisker Formation on Electroless Tin Films Deposited on Lead-frame
Alloys," 2011 12th International Conference on Electronic Packaging
Technology and High Density Packaging, Shanghai, China, Aug. 8-11,
2011, pp. 810-814.
Galyon, George,
"Whisker Formation Concepts - The End Game," IEEE Transactions on
Components, Packaging and Manufacturing Technology, vol. 1 no. 7, pp.
1098-1109, July 2011.
Lee, Hua-Xing, Chan, Kah-Yoong, and Shakur, Mohd Hamdi Abdul,
"Effects of Annealing on Sn Whisker Formation Under Temperature Cycling and
Isothermal Storage Conditions," IEEE Transactions on Components,
Packaging and Manufacturing Technology, vol. 1 no. 7, pp. 1110-1115,
July 2011.
Lienert, U., Li, S. F., Hefferan, C. M., Lind, J., Suter, R. M., Bernier, J.
V., Barton, N. R., Brandes, M. C., Mills, M. J., Miller, M. P., Jakobsen, B.,
and Pantleon, W.,
"High-Energy Diffraction Microscopy at the Advanced Photon Source," JOM
, vol. 63 no. 7, pp. 70-77, July 2011.
Michael, J. R., McKenzie, B. B., and Susan, D. F.,
"Crystallographic Characterization of Whiskers Using EBSD,"
Microscopy and Microanalyses, vol. 17 no. S2, pp. 392-393, July 2011.
Welzel, Udo,
"Breakthroughs in understanding elastic grain interaction and whisker
formation made possible by advances in X-ray power diffraction,"
International Journal of Materials Research, vol. 102 no. 7, pp.
846-860, July 2011.
DOI: 10.3139/146.110539
Naor-Pomerantz, Adi, Eliaz, Noam, and Gileadi, Eliezer,
"Electrodeposition of rhenium-tin nanowires," Electrochimica Acta
, vol. 56 no. 18, pp. 6361-6370, July 15, 2011.
https://doi.org/10.1016/j.electacta.2011.05.022
Smith, Steve,
"Fluid Physics," Tin Whisker Group teleconference, July 13, 2011.
Mathew, Sony, Wang, Weiqiang, Osterman, Michael, and Pecht, Michael,
"Assessment of Solder-Dipping as a Tin Whisker Mitigation Strategy,"
IEEE Transactions on Components, Packaging and Manufacturing Technology
, vol. 1 no. 6, pp. 957-963, June 2011.
Wang, Jiangiang, Bi, Kedong, and Chen, Yunfei,
"Molecular dynamic simulations of contact thermal resistance between two
individual silicon nanowires," Key Engineering Materials, vol.
483, pp. 663-667, June 2011.
Yen, Yee-Wen, Liou, Wei-kai, and Jao, Chien-Chung,
"Investigation of Interfacial Reactions and Sn Whisker Formation in the Matte
Sn Layer With NiP/Ni/Cu and Ni/Cu Multilayer Systems," IEEE Transactions
on Components, Packaging and Manufacturing Technology, vol. 1 no. 6,
pp. 951-956, June 2011.
Sobiech, Matthias, Kruger, Carmen, Welzel, Udo, Wang, Jiang-Yang, Mittemeijer,
Eric Jan, and Hugel, Werner,
"Phase formation at the Sn/Cu interface during room temperature aging:
Microstructural evolution, whiskering, and interface thermodynamics,"
Journal of Materials Research, vol. 26 no. 12, pp. 1482-1493, June 28,
2011.
Zeng, Guang, Xue, Songbai, Gao, Lili, Zhang, Liang, Hu, Yuhua, and Lai,
Zhongmin,
"Interfacial microstructure and properties of Sn-0.7Cu-0.05Ni/Cu solder joint
with rare earth Nd addition," Journal of Alloys and Compounds,
vol. 509 no. 25, pp. 7152-7161, June 23, 2011.
Gilbert, Dave,
"Toyota Sudden Unintended Acceleration," Tin Whisker Group teleconference,
June 22, 2011.
Cheng, Jing, Vianco, Paul T., Zhang, Bei, and Li, James C. M.,
"Nucleation and growth of tin whiskers," Applied Physics Letters,
vol. 98 no. 24, pp. 241910-1-241910-3, June 13, 2011.
Buetow, Mike,
"USAF Seeks Sn Whisker Mitigation Proposals," Printed Circuit Design
and Fab/ Circuits Assembly, vol. 28 no. 5, pp. 10, May 2011.
Pedigo, Aaron E.,
The Influence of the Effective Physical Properties of Tin
Electrodeposited Films on the Growth of Tin Whiskers. Ph. D. Thesis
for Purdue University, West Lafayette, IN, May 2011.
Kane, Sean, Liberman, Ellen, DiViesti, Tony, Click, Felix, and MacDonald,
Melanie,
"An Examination of the National Highway Traffic Safety Administration and the
National Aeronautics and Space Administration Engineering Safety Center
Assessment and Technical Evaluation of Toyota Electronic Throttle Control
(ETC) Systems and Unintended Acceleration," May 23, 2011.
Chinniah, Karuna, Amundan, Kalai Selvan, Kee, Tan Suan, Gill, Diesh, and Raj,
Sundra,
"Studies on a Newly Discovered White Whiskers Causing Battery Leakage,"
South East Asia Technical Conference on Electronics Assembly Technologies 2011
, Penang, Malaysia, May 19-20, 2011, pp. xx-xx.
Hester, Tom,
"Tin Whisker Self-Mitigation in Surface Mount Components," Tin Whisker Group
teleconference, May 11, 2011.
Illes, Balazs, Horvath, Barbara, and Lipak, Balazs,
"Investigating Whisker Growth on Annealed and Recrystallized Tin Platings,"
2011 34th International Spring Seminar on Electronics Technology,
Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 141-146.
Zak, Pavel, Tucan, Marek, and Kudlacek, Ivan,
"Tin Coating of Connectors - Reliability Risk for Electrical Equipment,"
2011 34th International Spring Seminar on Electronics Technology,
Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 229-233.
Landman, Robert J., Davy, Gordon, and Fritz, Dennis D.,
"Whisker-Impenetrable Metal Cap Process for Electronic Assemblies,"
International Conference on Soldering & Reliability 2011 Proceedings
, Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.
McCormick, Heather, Chow, Jimmy, Snugovsky, Polina, Kosiba, Eva, and
Meschter, Stephan,
"Development of a Test Vehicle for the Study of Tin Whiskers,"
International Conference on Soldering & Reliability 2011 Proceedings
, Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.
Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, McKeown, Steve, and
Kosiba, Eva,
"Tin Whisker Testing and Risk Modeling Project," International
Conference on Soldering & Reliability 2011 Proceedings, Toronto,
Ontario, Canada, May 4-6, 2011, pp. xx-xx.
Perovic, Doug, Snugovsky, Leonid, Rutter, John, Snugovsky, Polina, Bagheri,
Zohreh, and Meschter, Stephan,
"Microstructure and Whisker Growth of SAC Solder Alloys with Rare Earth
Additions in Different Environments," International Conference on
Soldering & Reliability 2011 Proceedings, Toronto, Ontario, Canada,
May 4-6, 2011, pp. xx-xx.
Hunt, Christopher,
"Reliability issues with lead-free," 2nd Electronic Materials and
Assembly Processes for Space (EMPS) Workshop, Paris, France, May 4,
2011.
Susan, Don, Vianco, Paul, Yelton, Graham, and Michael, Joe,
"Recent Research on Tin Whiskers at Sandia," 5th International
Brazing and Soldering Conference, Las Vegas, NV, Apr. 27, 2011, pp.
xx-xx. (Sandia Report SAND2012-3310C)
Lee, David M., and Pinol, Lesly A.,
"Effects of Tin Whisker Formation on Nanocrystalline Copper," IPC
APEX Expo Technical Conference 2011, Las Vegas, NV, April 12-14, 2011,
pp. xx-xx.
Tsujimoto, Masanobu, Hashimoto, Shigeo, Kiso, Masayuki, Ikumoto, Raihei,
Kano, Toshikazu, Kanamori, Genki, Gudeczauskas, Don, and Milad, George,
"The Elimination of Whiskers from Electroplated Tin," IPC APEX Expo
Technical Conference 2011, Las Vegas, NV, April 12-14, 2011 pp.
555-603.
Mason, Maribeth, Eng, Genghmun, Leung, Martin, Stupian, Gary, and Yeoh,
Terence,
"Microanalysis for Tin Whisker Risk Assessment," 2011 IEEE International
Reliability Physics Symposium, Monterey, CA, Apr. 10-14, 2011, pp.
2G.3.1-2G.3.5.
Savage, Timothy Scott,
"The Implications of RoHS on Active Implantable Medical Devices," 2011
IEEE International Reliability Physics Symposium, Monterey, CA, Apr.
10-14, 2011, pp. 3B.1.1-3B.1.7.
Buetow, Mike,
"Tin Ears," Printed Circuit Design and Fab/ Circuits Assembly
, vol 28 no. 3, pp. 6, Mar. 2011.
Buetow, Mike,
"Tin Whiskers Found in Toyota ETC," Printed Circuit Design and Fab/
Circuits Assembly, vol 28 no. 3, pp. 10,12, Mar. 2011.
Chuang, Tung-Han, and Jain, Chao-Chi,
"Morphology of the Tin Whiskers on the Surface of a Sn-3Ag-0.5Cu-0.5Nd Alloy,"
Metallurgical and Materials Transactions A: Physical Metallurgy and
Materials Science, vol. 42 no. 3, pp. 684-691, Mar. 2011.
https://doi.org/10.1007/s11661-010-0454-5
Howard, H. P., Cheng, J., Vianco, P. T., and Li, J. C. M.,
"Interface flow mechanism for tin whisker growth," Acta Materialia
, vol. 59 no. 5, pp. 1957-1963, Mar. 2011.
Ulrich, O., Biquard, X., Bleuet, P., Geaymond, O., Gergaud, P., Micha, J. S.,
Robach, O., and Rieutord, F.,
"A new white beam x-ray microdiffraction setup on the BM32 beamline at the
European Synchrotron Radiation Facility," Review of Scientific
Instruments, vol. 82 no. 3, pp. 033908-1-033908-6, Mar. 2011.
Asrar, Nausha,
"Detrimental Effects of Excessive Gold Plating on Lead-Free Solder Joints,"
Electronic Device Failure Analysis, vol. 13 no. 1, pp.
4,6-8,10-11, Feb. 2011.
Verdi, Fred,
"Susceptibility Testing for Tin Whiskers," Tin Whisker Group teleconference,
Feb. 23, 2011.
Tin Whisker Summary (before Feb. 13, 2011)
Tin Whiskers (before Feb. 13, 2011)
Pb-free (Lead Free) Frequently Asked Questions (before Feb. 12, 2011)
Plating (before Feb. 12, 2011)
Osenbach, John,
"Creep and It's Affect on Sn Whisker Growth," Tin Whisker Group
teleconferences, Feb. 9, 2011 and Feb. 16, 2011.
Ye, Huan, Xue, Songbai, Zhang, Liang, Xiao, Zhengxiang, Hu, Yuhua, Lai,
Zhongmin, and Zhu, Hong,
"Sn whisker growth in Sn-9Zn-0.5Ga-0.7Pr lead-free solder," Journal of
Alloys and Compounds, vol. 509 no. 5, pp. L52-L55, Feb. 3, 2011.
Li, Juchuan, Yang, Fuqian, Ye, Jia, and Cheng, Yang-Tse,
"Whisker formation on a thin film tin lithium-ion battery anode,"
Journal of Power Sources, vol. 196 no. 3, pp. 1474-1477, Feb. 1, 2011.
Cheng, Jing, Vianco, Paul T., Subjeck, Joeseph, and Li, James C. M.,
"An assessment of Sn whiskers and depleted area formation in thin Sn films
using quantitative image analysis," Journal of Materials Science,
vol. 46 no. 1, pp. 263-274, Jan. 2011.
Chuang, Tung-Han, and Wu, Hsing-Fei,
"Effects of Ce Addition on the Microstructure and Mechanical Properties of
Sn-58Bi Solder Joints," Journal of Electronic Materials, vol. 40
no. 1, pp. 71-77, Jan. 2011.
Yen, Yee-Wen, Li, Chao-Kang, Tsou, Meng-Yu, and Shao, Pei-Sheng,
"Substrate Shape Effect on the Sn Whisker Growth in the Electroplating Matte
Sn System," Japanese Journal of Applied Physics, vol. 50 no. 1S2,
pp. 01BJ07-1-01BJ07-4, Jan. 2011.
Zhang, Wan, Guebey, Jonas, and Toben, Michael,
"A Novel Electrolyte for the High Speed Electrodeposition of Bright Pure Tin
at Elevated Temperatures," Metal Finishing, vol. 109 no. 1-2, pp,
13-19, Jan.-Feb. 2011.
Touw, Anduin,
"GEIA-HB-0005-4 Guidelines for Performing Reliability Assessment for Pb Free
Assemblies used in Aerospace and High-Performance Electronic Applications,"
Tin Whisker Group teleconference, Jan. 26, 2011.
NASA What's New, Jan. 24, 2011.
Touw, Anduin,
"GEIA-STD-0005-2 Standard for Mitigating the Effects of Tin Whiskers in
Aerospace and High Performance Electronic Systems, Rev A draft 1/5/11," Tin
Whisker Group teleconference, Jan. 19, 2011.
"Technical Support to the National Highway Traffic Safety Administration
(NHTSA) on the Reported Toyota Motor Corporation (TMC) Unintended Acceleration
(UA) Investigation, Version 1.0." NASA. Jan. 18, 2011.
"GEIA-STD-0005-2 Standard for Mitigating the Effects of Tin Whiskers in
Aerospace and High Performance Electronic Systems," Rev A draft Jan. 5, 2011.
Galyon, George T.,
"Tin Whisker to Dos-2010." 2010.
Kim, Keun-Soo, Kim, Sun-Sik, Kim, Seong-Jun, Suganuma, Katsuaki, Tsujimoto,
Masanobu, and Yanada, Isamu,
"Prevention of Sn whisker formation by surface treatment of Sn plating Part
II," 2010.
Kuwano, Noriyuki, Jinnouchi, Atsushi, Horikami, Sadanori, Hirokado, Naruyoshi,
and Sosiati, Harini,
"Effects of Post-Plating Reflow on Changes in Crystal Grain Size of
Sn-2 mass%Bi Alloy Plating with Thermal Cycling Treatment," Materials
Transactions, vol. 51 no. 10, pp. 1741-1746, 2010.
Liang, S. W., Chen, Chih, Han, J. K., Xu, Luhua, Tu, K. N., and Lai, Yi-Shao,
"Blocking hillock and whisker growth by intermetallic compound formation in
Sn-0.7Cu flip chip solder joints under electromigration," Journal of
Applied Physics, vol. 107 no. 9, pp. 093715-1-093715-4, 2010.
Murakami, Koji, Okano, Masako, Hino, Makoto, Takamizawa, Masao, and Nakai,
Kiyomichi,
"Mechanism of Generation and Suppression of Tin Whiskers on Tin and Tin-Lead
Plated Films," Materials Transactions, vol. 51 no. 1, pp.
143-151, 2010.
Pinol, Lesly Agnes,
Fundamental Studies of Tin Whiskering in Microelectronics Finishes
. Ph. D. Thesis for University of Maryland, College Park, MD, 2010.
Wilcox, G. D.,
"Whiskers," Transactions of the IMF, vol. 88 no. 2, pp. 81-82,
2010.
https://doi.org/10.1179/174591910X12646066373883
Xiao, X., Sachdev, A. K., Haddad, D., Li, Y., Sheldon, B. W., and Soni, S. K.,
"Stress-induced Sn Nanowires from Si-Sn Nanocomposite Coatings," Applied
Physics Letters, vol. 97, pp. 141904-1-141904-3, 2010.
Beilis, Isak I., Koulik, Yosef, Boxman, Raymond L., and Arbilly, David,
"Thin film deposition using a plasma source with a hot refractory anode vacuum
arc," Journal of Materials Science, vol. 45 no. 23, pp.
6325-6331, Dec. 2010.
Champaign, Robert F., and Ogden, Robert R.,
"Microscopy Study of Tin Whiskers," Journal of Failure Analysis and
Prevention, vol. 10 no. 6, pp. 444-449, Dec. 2010.
Miller, Sarah M., Sahaym, Uttara, and Norton, M. Grant,
"Effect of Substrate Composition on Sn Whisker Growth in Pure Sn Films,"
Metallurgical and Materials Transactions A, vol. 41 no. 13, pp.
3386-3395, Dec. 2010.
https://doi.org/10.1007/s11661-010-0431-z
Zhang, Jinsong, and Zhang, Jianhua,
"Mechanism of whisker growth on pure Sn coating of Cu leads in the high
temperature/humidity storage tests," Applied Mechanics and Materials
, vol. 44-47, pp. 2691-2695, Dec. 2010.
Illes, Balazs, Horvath, Barbara, and Harsanyi, Gabor,
"Effect of strongly oxidizing environment on whisker growth form tin coating,"
Surface and Coatings Technology, vol. 205 no. 7, pp. 2262-2266,
Dec. 25, 2010.
https://doi.org/10.1016/j.surfcoat.2010.09.012
Leidecker, Henning,
"Metal Vapor Sparking and Arcing," Tin Whisker Group teleconference, Dec. 22,
2010.
Smith, Steve, Rollins, Bill, and Minter, Charlie,
"The Whisker-Tough Conformal Coating: A Certain Solution to an Uncertain
Problem," Tin Whisker Group teleconference, Dec. 8, 2010.
Panashchenko, Lyudmyla, Brusse, Jay, and Leidecker, Henning,
"Long Term Investigation of Urethane Conformal Coating Against Tin Whisker
Growth," IPC Tin Whiskers Conference, Chicago, IL, Dec. 6-7,
2010, pp. xx-xx.
Verdi, Fred, Yu, Phillip, Sneh, Ofer, Toscano, Lenora, and Gallager, George,
"Susceptibility Testing for Tin Whiskers," IPC Tin Whiskers Conference
, Chicago, IL, Dec. 6-7, 2010, pp. xx-xx.
"Matte Tin Plating Whisker Data," Lattice Product Bulletin PB1227H, Nov.
2010.
Ozaltun, Sevim, and Karadeniz, Serdar,
"Development of an apparatus for determining the free tin thickness on
tin-plated copper wire," Wire Journal International, vol. 43 no.
11, pp. 63-67, Nov. 2010.
Chang, Ming, Chen, Po-Cheng, Lin, Chung-Po, and Chang, Yu-Han,
"Assembly of Nanostructures by Using a Mechanical Nanomanipulator," Key
Engineering Materials, vol. 450, pp. 263-266, Nov. 2010.
Sauter, L., Seekamp, A., Shibata, Y., Kanameda, Y., and Yamashita, H.,
"Whisker mitigation measures for Sn-plated Cu for different stress tests,"
Microelectronics Reliability, vol. 50 no. 9-11, pp. 1631-1635,
Sept.-Nov. 2010.
Sobiech, M., Kruger, C., Welzel, U., Wang, J. Y., Mittemeijer, E. J., and
Hugel, W.,
"Evolution of microstructure and stress of and associated whisker growth on Sn
layers sputter-deposited on Cu substrates," Journal of Materials
Research, vol. 25 no. 11, pp. 2166-2174, Nov. 2010.
Smith, Steve, Rollins, Bill, and Minter, Charlie,
"The Whisker-Tough Conformal Coating: A Certain Solution to an Uncertain
Problem," DMC 2010, Las Vegas, NV, Nov. 29-Dec. 2, 2010, pp.
xx-xx.
Handwerker, Carol A.,
"iNEMI Tin Whisker Project: Overview," CARE Innovation 2010,
Vienna, Austria, Nov. 8-11, 2010, pp. xx-xx.
Champaign, Robert,
"Sn Whiskers?," McKinney Failure Analysis Lab. (before Nov. 5, 2010)
Handwerker, C. A., Pedigo, A. E., Sarabol, P., Blendell, J. E., and Su, Peng,
"Tin Whisker and Surface Defect Formation on Electroplated Films and Reflowed
Joints." (before Nov. 5, 2010)
Kurtz, Olaf, Kuhlkamp, Peter, Barthelmes, Jurgen, and Ruther, Robert,
"Reducing and Preventing Tin Corrosion Whiskers," SMT Web Exclusive
Article. (before Nov. 5, 2010)
Landman, Robert J.,
"Tin Whiskers - A Long Term RoHS Reliability Problem." (before Nov. 5,
2010)
Smetana, Joe,
"NIPP-NPP-2009-053," (before Nov. 5, 2010)
"Resolution of Generic Safety Issues: Issue 200: Tin Whiskers (NUREG-0933,
Main Report with Supplements 1-33) Nov. 3, 2010.
Chason, Eric,
"How do whiskers and hillocks grow in Pb-free Sn coatings?," Tin Whisker Group
teleconference, Nov. 3, 2010.
Baated, Alongheng, Kim, Keun-Soo, Suganuma, Katsuaki, Huang, Sharon, Jurcik,
Benjamin, Nozawa, Shigeyoshi, and Ueshima, Minoru,
"Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu
solders," Journal of Materials Science: Materials in Electronics,
vol. 21 no. 10, pp. 1066-1075, Oct. 2010.
Mallik, Aditi, and Stout, Roger,
"Simulation Methods for Predicting Fusing Current and Time for Encapsulated
Wire Bonds," CITE>IEEE Transactions on Electronics Packaging Manufacturing
, vol. 33 no. 4, pp. 255-264, Oct. 2010.
Chason, Eric, Jadhav, Nitin, Buchvecky, Eric, Bower, Allan, and Kumar,
Sharvan,
"How do whiskers and hillocks grow in Pb-free Sn coatings?," SMTA
International 2010 Conference (Presentations), Orlando, FL, Oct. 24-28,
2010.
Leonardi, Nicholas,
"Bridging Supply Chain Gap for Exempt High-Reliability OEM's Tin Whisker
Mitigation and Counterfeit Detection," SMTA International 2010
Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 179-184.
Lichau, Daniel,
"Image Processing, Quantification and Model Reconstructions in SEM/FIB,"
Club Image 3D, Le Bourget du Lac, France, Oct. 20, 2010, pp.
xx-xx.
Woodrow, Tom,
"Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy, Part
III," Tin Whisker Group teleconference, Oct. 20, 2010.
Tsou, Meng-Yu, Yen, Yee-Wen, Shao, Pei-Sheng, and Jao, Chien-Chung,
"Investigation of Sn Whisker Growth in the Matte Sn/Alloy 42 Substrate Coated
Different Metallic Layers," 2010 5th International Microsystems
Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan,
Oct. 20-22, 2010, pp. xx-xx.
Lichau, Daniel,
"Image Processing, Quantification and Model Reconstructions in SEM/FIB: Case
studies," European Focused Ion Beam Users Group Meeting,
Gatea, Italy, Oct. 11, 2010, pp. xx-xx.
Crandall, E. R., Flowers, G. T., Dean, R. N., and Bozack, M. J.,
"Growth of Sn Whiskers on Semiconductor and Insulator Surfaces," 2010
Proceedings of the 56th IEEE Holm Conference on Electrical Contacts,
Charleston, SC, Oct. 4-7, 2010, pp. xx-xx.
Crandall, E. R., Flowers, G. T., Dean, R. N., and Bozack, M. J.,
"Oxidation-Induced Growth of Sn Whiskers in a Pure Oxygen Gas Environment,"
2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts
, Charleston, SC, Oct. 4-7, 2010, pp. xx-xx.
"NASA's Suggestions for Reducing Risk of Tin Whisker Induced Failures,"
Products Finishing, vol. 74 no. 12, pp. 32, Sept. 2010.
Frolov, T., Boettinger, W. J., and Mishin, Y.,
"Atomistic simulation of hillock growth," Acta Materialia, vol.
58 no. 16, pp. 5471-5480, Sept. 2010.
Pennington, Tim,
"Shaving the Whisker Problem," Products Finishing, vol. 74 no.
12, pp. 30-31,33-35, Sept. 2010.
Varkey, Bijumon, Christian, Bev, Liu, Julie, Romanov, Alexandre, and Moorhead,
Philip,
"Not Whiskers or Hillocks, But Tin Bumps on RF Shielding Cans," IEEE
Transactions on Device and Materials Reliability, vol. 10 no. 3, pp.
353-359, Sept. 2010.
Che, F. X., Zhu, W. H., Poh, Edith S. W., Zhang, X. W., and Zhang, X. R.,
"The study of mechanical properties of Sn-Ag-Cu lead-free solders with
different Ag contents and Ni doping under different strain rates and
temperatures," Journal of Alloys and Compounds, vol. 507 no. 1,
pp. 215-224, Sept. 24, 2010.
"GEIA-HB-0005-4 Guidelines for Performing Reliability Assessment for Pb Free
Assemblies used in Aerospace and High-Performance Electronic Applications,"
Sept. 23, 2010.
Pinsky, David,
"Application-Specific Tin Whisker Risk Assessment Algorithm- Update 2010," Tin
Whisker Group teleconference, Sept. 22, 2010.
Sellers, Keith M.,
"Real Reliability Concerns in the Medical Electronics World," Medical
Electronics Symposium 2010 Proceedings, Tempe, AZ, Sept. 22-23, 2010,
pp. xx-xx.
Kim, Kyung-Seob, Yang, Jun-Mo, and Ahn, Jae-Pyoung,
"The effect of electric current and surface oxidization on the growth of Sn
whiskers," Applied Surface Science, vol. 256 no. 23, pp.
7166-7174, Sept. 15, 2010.
Burke, John,
"Get SMART: Tin Whiskers Eliminated!,". Sept. 9, 2010.
Landman, Bob, Davy, Gordon, and Fritz, Denny,
"Tin-Whisker-Impenetrable Selective Metal Cap Process for Electronic
Assemblies," Tin Whisker Group teleconference, Sept. 8, 2010.
Nie, Lei, Mueller, Maik, Osterman Michael, and Pecht, Michael,
"Microstructural Analysis of Reballed Tin-Lead, Lead-Free, and Mixed Ball Grid
Array Assemblies Under Temperature Cycling Test," Journal of Electronic
Materials, vol. 39 no. 8, pp. 1218-1232, Aug. 2010.
Yu, Cheng-Fu, Chan, Chi-Ming, and Hsieh, Ker-Chang,
"The effect of tin grain structure on whisker growth," Microelectronics
Reliability, vol. 50 no. 8, pp. 1146-1151, Aug. 2010.
Yu, Cheng-Fu, and Hsieh, Ker-Chang,
"The Mechanism of Residual Stress Relief for Various Tin Grain Structures,"
Journal of Electronic Materials, vol. 39 no. 8, pp. 1315-1318,
Aug. 2010.
Yelton, Graham, Susan, Don, Michael, Joseph, and Shore, Daniel,
"Understanding and Predicting Metallic Whisker Growth as a Function of
Electrodeposited Morphology," 217th ECS Meeting, Vancouver,
British Columbia, Canada, Apr. 25-30, 2010, pp. xx-xx. (Sandia Report
SAND2010-2517C)
Davy, Gordon,
"OEMs' Pb-free and Tin Whisker Options - Prevention vs. "Mitigation"," Tin
Whisker Group teleconference, Aug. 18, 2010.
Wang, Yiqing, Ding, Dongyan, Liu, Ting, Galuschki, Klaus-Peter, Hu, Yu, Gong,
Angela, Shen, Ming, Sun, Hongqi, Wang, Xianfeng, Sun, Jiangyan, Li, Ming, and
Mao, Dali,
"Effect of Ni Barrier on the Tin Whisker Formation of Electroplating Sn on
Lead-frame Alloy," 2010 11th International Conference on Electronic
Packaging Technology & High Density Packaging, Xi'an, China, Aug.
16-19, 2010, pp. 980-983.
"Plating's Effects on Electronics Assembly," Printed Circuit Design
and Fab/Circuits Assembly, vol. 27 no. 7, pp. 40, July 2010.
Bozack, Michael J., Crandall, Erika R., Rodekohr, Chad L., Dean, Robert N.,
Flowers, George T., and, Suhling, Jeffrey C.,
"High Lateral Resolution Auger Electron Spectroscopic (AES) Measurements for
Sn Whiskers on Brass," IEEE Transactions on Electronics Packaging
Manufacturing, vol. 33 no. 3, pp. 198-204, July 2010.
Dimitrovska, Aleksandra, and Kovacevic, Radovan,
"Environmental Influence on Sn Whisker Growth," IEEE Transactions on
Electronics Packaging Manufacturing, vol. 33 no. 3, pp. 193-197, July
2010.
Han, Sungwon, Osterman, Michael, and Pecht, Michael G.,
"Electrical Shorting Propensity of Tin Whiskers," IEEE Transactions on
Electronics Packaging Manufacturing, vol. 33 no. 3, pp. 205-211, July
2010.
Jadhav, Nitin, Buchovecky, Eric, Chason, Eric, and Bower, Allan,
"Real-time SEM/FIB Studies of Whisker Growth and Surface Modification,"
JOM, vol. 62 no. 7, pp. 30-37, July 2010.
Jadhav, Nitin, Buchovecky, Eric J., Reinbold, Lucine, Kumar, Sharvan, Bower,
Allan F., and Chason, Eric,
"Understanding the Correlation Between Intermetallic Growth, Stress Evolution,
and Sn Whisker Nucleation," IEEE Transactions on Electronics Packaging
Manufacturing, vol. 33 no. 3, pp. 183-192, July 2010.
Kato, Takahiko, Akahoshi, Haruo, Nakamura, Masato, Terasaki, Takeshi,
Iwasaki, Tomio, Hashimoto, Tomoaki, and Nishimura, Asao,
"Correlation Between Whisker Initiation and Compressive Stress in
Electrodeposited Tin-Copper Coating on Copper Leadframes," IEEE
Transactions on Electronics Packaging Manufacturing, vol. 33 no. 3, pp.
165-176, July 2010.
Osterman, Michael,
"Introduction to the Special Issue on Tin Whiskers," IEEE Transactions
on Electronics Packaging Manufacturing, vol. 33 no. 3, pp. 157-158,
July 2010.
Sarobol, Pylin, Pedigo, Aaron E., Su, Peng, Blendell, John E., and Handwerker,
Carol A.,
"Defect Morphology and Texture in Sn, Sn-Cu, and Sn-Cu-Pb Electroplated
Films," IEEE Transactions on Electronics Packaging Manufacturing,
vol. 33 no. 3, pp. 159-164, July 2010.
Shibutani, Tadahiro,
"Effect of Grain Size on Pressure-Induced Tin Whisker Formation," IEEE
Transactions on Electronics Packaging Manufacturing, vol. 33 no. 3, pp.
177-182, July 2010.
Susan, D. F., Michael, J. R., Grant, R. P., and Yelton, W. G.,
"Tin Whiskers: Electron Microscopy and EBSD Characterization,"
Microscopy and Microanalyses, vol. 16 no. S2, pp. 792-793, July 2010.
Zhao, M., and Jiang, Q.,
"Size effect on thermal properties in low-dimensional materials," Key
Engineering Materials, vol. 444, pp. 189-218, July 2010.
Sahaym, Uttara, Miller, Stephanie L., and Norton, M. Grant,
"Effect of plating temperature on Sn surface morphology,"
Materials Letters, vol. 64 no. 14, pp. 1547-1550, July 31, 2010.
Liu, Haiyan, Zhu, Qingsheng, Zhang, Li, Wang, Zhongguang, and Shang, Jian Ku,
"Enhanced stress relaxation of Sn-3.8Ag-0.7Cu solder by electrical current,"
Journal of Materials Research, vol. 25 no. 6, pp. 1172-1178, June
2010.
Lin, Hsiu-Jen, and Chuang, Tung-Han,
"Effects of Ce and Zn additions on the microstructure and mechanical
properties of Sn-3Ag-0.5Cu solder joints," Journal of Alloys and
Compounds, vol. 500 no. 2, pp. 167-174, June 25, 2010.
Chou, George J. S., and Hilty, Robert D.,
"Tin Reflow for Tin Whisker Mitigation," 4th International Symposium on Tin
Whiskers, College Park, MD, June 23-24, 2010, pp. xx-xx.
Leidecker, Henning, Brusse, Jay, and Panashchenko, Lyudmyla,
"Metal Vapor Sparking and Arcing," 4th International Symposium on Tin
Whiskers, College Park, MD, June 23-24, 2010, pp. xx-xx.
Sampson, Michael J.,
"Lead-Free Electronics: Impact for Space Electronics," NASA. June 22-24,
2010.
Blanche, Jim, and Strickland, Mark,
"Working with Consortia - Advanced Packaging Reliability," 2010 NEPP
Electronics Technology Workshop, Greenbelt, MD, June 22, 2010, pp.
xx-xx.
Sarobol, Pylin,
"The Effects of Local Film Properties on Whisker and Hillock Growth on Sn,
Sn-Cu and Sn-Cu-Pb Electroplated Films," Tin Whisker Group teleconference,
June 16, 2010.
Pedigo, Aaron E.,
"Understanding Fundamental Tin Whisker Growth Mechanisms by Characterizing
Film Properties," Tin Whisker Group teleconference, June 9, 2010.
Sarobol, Pylin, Pedigo, Aaron, Blendell, John, Handwerker, Carol, Su, Peng,
Li, Li, and Xue, Jie,
"A Synchrotron Micro-Diffraction Investigation of Crystallographic Texture of
High-Sn Alloy Films and its Effects on Whisker Growth," 2010 Proceedings
60th Electronic Components and Technology Conference , Las Vegas, NV,
June 1-4, 2010, pp. 162-169.
Shin, Ho Sun, Song, Jae Yong, and Yu, Jin,
"Lattice Deformation of Sn Nanowires for the Application to
Nano-interconnection Technology," 2010 Proceedings 60th Electronic
Components and Technology Conference, Las Vegas, NV, June 1-4, 2010,
pp. 1861-1865.
Buchovecky, Eric J.,
Numerical Simulation of Stress Generation and Whisker Growth in Sn
Films. Ph. D. Thesis for Brown University, Providence, RI, May 2010.
Dudek, M. A., and Chawla, N.,
"Nanoindentation of rare earth-Sn intermetallics in Pb-free solders,"
Intermetallics, vol. 18 no. 5, pp. 1016-1020, May 2010.
The Lead Free Electronics Manhattan Project - Phase II. The
Benchmarking and Best Practices Center of Excellence, May 31, 2010. pp.
131-132,Appendix C.
Bozack, M. J., Crandall, E. R., Rodekohr, C. E., Flowers, G. T., and Lall,
P.,
"Influence of Surface Composition and Substrate Roughness on Tin Whisker
Growth," Tin Whisker Group teleconference, May 26, 2010.
Bozack, Mike,
"(tin whiskers growing on thin film tin over a zinc substrate)." Tin Whisker
Group teleconference, May 26, 2010.
Woodrow, Tom,
"Composition of Tin Whiskers on Tin-Plated Brass," Tin Whisker Group
teleconference, May 26, 2010.
Meschter, S.,
"Lead-to-lead spacing considerations a part of a comprehensive 2B tin whisker
mitigation strategy," Tin Whisker Group teleconference, May 19, 2010.
Howell, Keith, Koshi, Masuo, Masuda, Junya, Nishimura, Tetsuro, Nozu, Takashi,
and Sweatman, Keith,
"Effect of Soldering Method and Flux Type on Whisker Growth in SAC305,"
International Conference on Soldering & Reliability 2010 Proceedings
, Toronto, Ontario, Canada, May 17-20, 2010, pp. xx-xx.
Meschter, S. J., McKeown, S. A., Feathers, R., and Arseneau, E.,
"BGA Re-Balling from Pb-Free to Sn-Pb Metallurgy," International
Conference on Soldering & Reliability 2010 Proceedings, Toronto,
Ontario, Canada, May 17-20, 2010, pp. xx-xx.
Arazna, Aneta, Koziol, Grazyna, and Steplewski, Wojciech,
"Investigation of Tin Whiskers Formation," 2010 33rd International
Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16,
2010, pp. 183-185.
Jiri, Podzemsky, Martin, Copjan, Jan, URbanek, and Karel, Dusek,
"Evaluation of Tin Whisker Growth," 2010 33rd International Spring
Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp.
179-182.
Courey, Karim J., Asfour, Shihab S., Onar, Arzu, Bayliss, Jon A., Ludwig,
Larry L., and Wright, Maria C.,
"Estimating the Probability of Electrical Short Circuits from Tin Whiskers -
Part II," 2010 Aircraft Airworthiness & Sustainment Conference
, Austin, TX, May 10-13, 2010, pp. xx-xx.
Cheng, Jing, Vianco, Paul T., and Li, James C. M.,
"Hollow tin/chromium whiskers," Applied Physics Letters, vol. 96
no. 18, pp. 184102-1-184102-3, May 3, 2010.
Cheng, Jing, Chen, Samuel, Vianco, Paul T., and Li, James C. M.,
"Quantitative analysis for hillocks grown from electroplated Sn film,"
Journal of Applied Physics, vol. 107 no. 7, pp. 074902-1-074902-4, Apr.
2010.
Stafford, G. R., Williams, M. E., Shin, J. W., Moon, K.-W., Beauchamp, C. R.,
and Boettinger, W. J.,
"Whisker Formation in Pb-Free Surface Finishes," ECS Transactions
, vol. 28 no. 2, pp. 499-512, Apr. 2010.
https://doi.org/10.1149/1.3372604
Fox, William, and Woody, Linda,
"Conformal Coatings for Tin Whisker Risk Management," Proceedings
2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp.
S11_01-1-S11_01-12.
Rotchadl, Hal,
"Bridging Supply Chain Gap for Exempt High-Reliability OEM's,"
Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr.
6-9, 2010, pp. S12_01-1-S12_01-9.
Sweatman, Keith, Masuda, Junya, Nozu, Takashi, Koshi, Masuo, and Nishimura,
Tetsuro,
"Effect of Soldering Method, Temperature, and Humidity on Whisker Growth in
the Presence of Flux Residues," Proceedings 2010 Technical
Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp.
S11_02-1-S11_02-5.
Dudek, M. A., and Chawla, N.,
"Effect of Rare-Earth (La, Ce, and Y) Additions on the Microstructure and
Mechanical Behavior of Sn-3.9Ag-0.7Cu Solder Alloy," Metallurgical and
Materials Transactions A, vol. 41 no. 3, pp. 610-620, Mar. 2010.
Kurtz, Olaf, Barthelmes, Jurgen, Kuhlkamp, Peter, Ruther, Robert, and Neoh,
Ding-Ghee,
"Big Grain and Flat Morphology - A New Tin Electrolyte for Minimal Whiskering
and Excellent Solderability," Metal Finishing, vol. 108 no. 3,
pp. 22-28, Mar. 2010.
https://doi.org/10.1016/S0026-0576(10)00015-2
Panashchenko, Lyudmyla,
"Plating Dendrite Formations on Sn plating," Tin Whisker Group teleconference,
Mar. 31, 2010.
"Pb-Free Components," DfR Solutions, Mar. 3, 2010.
Lin, Hsiu-Jen, and Chuang, Tung-Han,
"Effects of Ce and La Additions on the Microstructure and Mechanical
Properties of Sn-9Zn Solder Joints," Journal of Electronic Materials
, vol. 39 no. 2, pp. 200-208, Feb. 2010.
Roters, F., Eisenlohr, P., Hantcherli, L., Tjahjanto, D. D., Bieler, T. R.,
and Raabe, D.,
"Overview of constitutive laws, kinematics, homogenization and multiscale
methods in crystal plasticity finite-element modeling: Theory, experiments,
applications," Acta Materialia, vol. 58 no. 4, pp. 1152-1211,
Feb. 2010.
Stadem, Richard, and Cristea, Cornel,
"A Novel Process for Automated Lead Tinning," Printed Circuit Design
and Fab/ Circuits Assembly, vol. 27 no. 2, pp. 40-42, Feb. 2010.
Hunt, Christopher, and Wickham, Martin,
"Mitigation of Tin Whiskers With Polymer Coatings," International
Symposium on Advanced Packaging Materials, Cambridge, England, Feb.
28-Mar. 2, 2010, pp. 78-87.
Hunt, Christopher, and Wickham, Martin,
"Reliability Issues with Lead-Free," Electronic Materials and
Assembly Processes for Space (EMPS) Workshop, Portsmouth, England, Feb.
17, 2010.
Lead Free Electronics Manhattan Project Phase 2. ACI
Technologies, Feb. 10, 2010.
Turbini, Laura J.,
"Growing Tin and Other Dangerous Whiskers," Surface Mount Technology
, Feb. 5, 2010.
He, Hongwen, Xu, Guangchen, and Guo, Fu,
"Electromigration-induced Bi-rich whisker growth in Cu/Sn-58Bi/Cu solder
joints," Journal of Materials Science, vol. 45 no. 2, pp.
334-340, Jan. 2010.
Hino, Makoto, Murakami, Koji, Mitooka, Yutaka, Takamizawa, Masao, Naka,
Toshihide, and Nakai, Kiyomichi,
"Mechanism of Whisker Growth Suppression by Lead Co-deposition on
Electroplated Tin Film," Materials Science Forum, vol. 638-642,
pp. 835-840, Jan. 2010.
Nakai, Kiyomichi, Sakamoto, Tatsuaki, Kobayashi, Sengo, Arakawa, Kazuto,
Mori, Hirotaro, Takamizawa, Masao, Murakami, Koji, and Hino, Makoto,
"A Model for Nucleation and Growth Processes of Tin Whisker," Materials
Science Forum, vol. 638-642, pp. 2688-2693, Jan. 2010.
Osenbach, John W., Reynolds, Heidi L., Henshall, Gregory, Parker, Richard
Dixon, and Su, Peng,
"Tin Whisker Test Development- Temperature and Humidity Effects Part II:
Acceleration Model Development," IEEE Transactions on Electronics
Packaging Manufacturing, vol. 33 no. 1, pp. 16-24, Jan. 2010.
Reynolds, Heidi L., Osenbach, John W., Henshall, Gregory, Parker, Richard D.,
and Su, Peng,
"Tin Whisker Test Development- Temperature and Humidity Effects Part I:
Experimental Design, Observations, and Data Collection," IEEE
Transactions on Electronics Packaging Manufacturing, vol. 33 no. 1, pp.
1-15, Jan. 2010.
Osenbach, John, Williams, Maureen, Handwerker, Carol, and Galyon, George,
"Sn Whiskers," Tin Whisker Group teleconference, Jan. 27, 2010.
Sweatman, Keith, Masuda, Junya, Nozu, Takashi, Koshi, Masuo, and Nishimura,
Tetsuro,
"Corrosion Driven Whisker Growth in SAC305," 2010 Pan Pacific
Microelectronics Symposium & Tabletop Exhibition, Koloa, HI, Jan.
26-28, 2010, pp. xx-xx.
Panashchenko, Lyudmyla,
"Evaluation of Environmental Tests for Tin Whisker Assessment," Tin
Whisker Group teleconference, Jan. 20, 2010.
Panashchenko, Lyudmyla,
"Evaluation of Environmental Tests for Tin Whisker Assessment (presentation),"
Tin Whisker Group teleconference, Jan. 20, 2010.
2014: 0 books, 3 theses, 86 papers, and 1 web page on tin whiskers
Dunn, Barrie D., and Mozdzen, Grazyna,
"Tin Oxide Coverage on Tin Whisker surfaces, Measurements and Implications for
Electronic Circuits," Soldering & Surface Mount Technology,
vol. 26 no. 3, pp. xx-xx, 2014.
2013: 0 books, 2 theses, 74 papers, and 0 web pages on tin whiskers
Ashworth, M. A., Wilcox, G. D., Higginson, R. L., Heath, R. J., and Liu, C.,
"Effect of direct current and pulse plating parameters on tin whisker growth
from tin electrodeposits on copper and brass substrates," Transactions
of the IMF, vol. 91 no. 5, pp. 260-268, 2013.
https://doi.org/10.1179/0020296713Z.000000000116
2012: 0 books, 7 theses, 88 papers, and 3 web pages on tin whiskers
Ansari, Lida, Fagas, Giorgos, Colinge, Jean-Pierre, and Greer, James C.,
"A Proposed Confinement Modulated Gap Nanowire Transistor Based on a Metal
(Tin)," Nano letters, vol. 12 no. 5, pp. 2222-2227, 2012.
DOI: 10.1021/nl2040817
2011: 3 books, 5 theses, 105 papers, and 6 web pages on tin whiskers
Cheng, Jing,
Tin Whiskers in Electronic Packaging: Mechanism and Modeling.
Ph. D. Thesis for University of Rochester, Rochester, NY, 2011.
2010: 2 books, 2 theses, 115 papers, and 0 web pages on tin whiskers
Lead-Free Defect Guide 2, SMART Group, 2010.
2009: 0 books, 8 theses, 111 papers, and 27 web pages on tin whiskers
Aragon, Joseph, Wavrik, Richard, and Witham, John,
"Tin Whisker Mitigation Methods," Sandia Report SAND2009-4735C, 2009.
Bierman, Matthew John, Dislocations in One-Dimensional Semiconductor Crystals: Nanowires, Nanotubes, and Whiskers. Ph. D. Thesis for University of Wisconsin - Madison, Madison, WI, 2009.
Buchovecky, Eric J., Du, Ningning, and Bower, Allan F., "A model of Sn whisker growth by coupled plastic flow and grain boundary diffusion," Applied Physics Letters, vol. 94 no. 19, pp. 191904-1-191904-3, 2009.
Cantoro, M., Brammertz, G., Richard, O., Bender, H., Clemente, F., Leys, M., Degroote, S., Caymax, M., Heyns, M., and De Gendt, S., "Controlled III/V Nanowire Growth by Selective-Area Vapor-Phase Epitaxy," Journal of the Electrochemical Society, vol. 156 no. 11, pp. H860-H868, 2009.
Chin, Erica, Templated Synthesis and Characterization of Multi-segmented Nanowires for Sensor and Optical Device Applications. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, 2009.
Hino, Makoto, Mitooka, Yutaka, Murakami, Koji, Takamizawa, Masao, and Nishimura, Nobuyuki, "Melting Treatment of Tin Electroplating by Laser Irradiation," Journal of The Surface Finishing Society of Japan, vol. 60 no. 2, pp. 134-136, 2009.
Mathew, Sony, Osterman, Michael, Pecht, Michael, and Dunlevey, Frank, "Evaluation of pure tin plated copper alloy substrates for tin whiskers," Circuit World, vol. 35 no. 1, pp. 3-8, 2009.
Mitooka, Yutaka, Murakami, Koji, Hino, Makoto, Takamizawa, Masao, and Takada, Jun, "Effect of Laser Irradiation on Generation and Growth of Whiskers in Tin-Electroplated Film," Materials Transactions, vol. 50 no. 9, pp. 2247-2252, 2009.
Nakai, K., Sakamoto, T., Kobayashi, S., Takamizawa, M., Murakami, K., and Hino, M., "A model for nucleation of tin whisker through dislocation behavior," Journal of Physics: Conference Series, vol. 165, no. 012089, 2009.
Okamoto, Naoki, Fujii, Yuko, Kurihara, Hiroaki, and Kondo, Kazuo, "Effects of Microstructure of Deposited Sn Films and Orientation Index of Cu Foils on Sn Whisker Formation Using Substitutionally-Deposited Sn Films," Materials Transactions, vol. 50 no. 11, pp. 2570-2577, 2009.
Okamoto, Naoki, Fujii, Yuko, Kurihara, Hiroaki, and Kondo, Kazuo, "Effects of Structures of Substrates on Sn Whisker Formation Using Substitutionally-Deposited Sn Films," Materials Transactions, vol. 50 no. 10, pp. 2403-2409, 2009.
Panashchenko, Lyudmyla, Evaluation of Environmental Tests for Tin Whisker Assessment. Master's Thesis for University of Maryland, College Park, MD, 2009.
Panashchenko, Lyudmyla, "Whisker Length Measurement: a Validation Study," Center for Advanced Life Cycle Engineering, 2009.
Skwarek, A., Ratajczak, J., Czerwinski, A., Witek, K. and Kulawik, J., "Effect of Cu addition on whisker formation in tin-rich solder alloys under thermal shock stress," Applied Surface Science, vol. 255 no. 15, pp. 7100-7103, 2009.
Sobiech, M., Wohlschlogel, M., Welzel, U., Mittemeijer, E. J., Hugel, W., Seekamp, A., Liu, W., and Ice, G. E., "Local, submicron, strain gradients as the cause of Sn whisker growth," Applied Physics Letters, vol. 94 no. xx, pp. 221901-1-221901-3, 2009.
Spitzner, Matthew James, Response of tin whiskers to dynamic input: Mathematical modeling and experimental property measurement. Master's Thesis for Iowa State University, Ames, IA, 2009.
Wang, Weiqiang, Solder Joint Reliability of Sn and SnBi Finished and Refinished Sn (SAC/SnPb) SMT Packages Under Temperature Cycling Test. Master's Thesis for University of Maryland, College Park, MD, 2009.
Aragon, Joseph, Rohwer, Lauren, Wavrik, R., and Witham, J., "Tin Whisker Mitigation Methods," 28th Compatibility, Aging & Stockpile Stewardship Conference, Albuquerque, NM, Fall 2009, pp. xx-xx. (Sandia Report SAND2009-6058C)
Brusse, Jay, "Tin Whisker Observations on Tin-Coated Copper Bus Bar Obtained from "A Large Paper Mill in Sweden"," Dec. 2009.
Buchovecky, Eric, Jadhav, Nitin, Bower, Allan F., and Chason, Eric, "Finite element modeling of stress evolution in Sn films due to growth of Cu6Sn5 intermetallic compound," Journal of Electronic Materials, vol. 38 no. 12, pp. 2676-2684, Dec. 2009.
Chuang, Tung-Han, Cheng, Chih-Yuan, and Chang, Tao-Chih, "Evaluations of Whisker Growth and Fatigue Reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce Solder Ball Grid Array Packages," Journal of Electronic Materials, vol. 38 no. 12, pp. 2762-2769, Dec. 2009.
Dimitrovska, Aleksandra, and Kovacevic, Radovan, "Mitigation of Sn Whisker Growth by Composite Ni/Sn Plating," Journal of Electronic Materials, vol. 38 no. 12, pp. 2516-2524, Dec. 2009.
Dimitrovska, Aleksandra, and Kovacevic, Radovan, "The Effect of Micro-Alloying of Sn Plating on Mitigation of Sn Whisker Growth," Journal of Electronic Materials, vol. 38 no. 12, pp. 2726-2734, Dec. 2009.
Guo, Fu, Xu, Guangchen, He, Hongwen, Zhao, Mengke, Sun, Jia, and Wang, C. Henry, "Effect of Electromigration and Isothermal Aging on the Formation of Metal Whiskers and Hillocks in Eutectic Sn-Bi Solder Joints and Reaction Films," Journal of Electronic Materials, vol. 38 no. 12, pp. 2647-2658, Dec. 2009.
Nie, Lei, Osterman, Michael, Song, Fubin, Lo, Jeffery, Lee, S. W. Ricky, and Pecht, Michael, "Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages," IEEE Transactions on Components and Packaging Technologies , vol. 32 no. 4, pp. 901-908, Dec. 2009.
Reinbold, Lucine, Jadhav, Nitin, Chason, Eric, and Kumar, K. Sharvan, "Relation of Sn whisker formation to intermetallic growth: Results from a novel Sn-Cu "bimetal ledge specimen"," Journal of Materials Research , vol. 24 no. 12, pp. 3583-3589, Dec. 2009.
Dimitrovska, Aleksandra, Mitigation Strategies of Tin(Sn) Whisker Growth, Ph. D. Thesis for Southern Methodist University, Dallas, TX, Dec. 19, 2009.
Woodrow, Tom, "Effects of Pb on the Diffusion of Tin within Tin Platings," Tin Whisker Group teleconference, Dec. 9, 2009.
Schetty, Rob, and Sepp, William, "Minimization of Tin Whisker Growth for Ultra-Low Tin Whisker Applications," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 225-234.
Asai, Tadashi, Kiga, Tomoya, Taniguchi, Yoshikuni, Morikawa, Hiroshi, and Sumiyama, Kenji, "Suppression of External-Stress-Induced Formation of Tin Whisker by Annealing of Electroplated Sn-Ag Alloy Films," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 73 no. 11, pp. 823-832, Nov. 2009.
Ice, Gene E., and Pang, Judy W. L., "Tutorial on x-ray microLaue diffraction," Materials Characterization , vol. 60 no. 11, pp. 1191-1201, Nov. 2009.
Liu, Meng, and Xian, Ai-Ping, "Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition," Journal of Electronic Materials, vol. 38 no. 11, pp. 2353-2361, Nov. 2009.
Ogden, Robert R., and Champaign, Robert F., "Tin Whisker Observations," Circuits Assembly, vol. 20 no. 11, pp. 26-29, Nov. 2009.
Shin, Seung-Jung, Kim, Jae-Jung, and Son, Young Kap, "Analysis of plating grain size effect on whisker," Journal of Mechanical Science and Technology, vol. 23 no. 11 , pp. 2885-2890, Nov. 2009.
Brusse, Jay, Tin Whiskers on Lincoln's Beard, Nov. 25, 2009.
Tin Whiskers on Card Guides Nov. 21, 2009.
Panashchenko, Lyudmyla, "Lincoln's Beard Growing Whiskers," CALCE UMD, Nov. 20, 2009.
Panashchenko, Lyudmyla, "Fat Metal Whiskers," Tin Whisker Group teleconference, Nov. 18, 2009.
Brusse, Jay, Metal Whiskers-Inspection Video #5: Transistor Package, Youtube, Nov. 21, 2009.
Brusse, Jay, Metal Whiskers-Optical Inspection #1, Youtube, Nov. 21, 2009.
Brusse, Jay, Metal Whiskers-Optical Inspection #2, Youtube, Nov. 21, 2009.
Brusse, Jay, Metal Whiskers-Optical Inspection Video #4, Youtube, Nov. 21, 2009.
Brusse, Jay, Tin Whisker Growth Kinetics, Youtube, Nov. 21, 2009.
Brusse, Jay, Tin Whiskers-Dsub Connector Shell, Youtube, Nov. 21, 2009.
Brusse, Jay, Tin Whiskers Inside Electromagnetic Relay, Youtube, Nov. 21, 2009.
Brusse, Jay, Tin Whiskers on Card Guides, Youtube, Nov. 21, 2009.
Brusse, Jay, Tin Whiskers on Electromagnetic Relays, Youtube, Nov. 21, 2009.
Brusse, Jay, Tin Whiskers on Terminal Lugs, Youtube, Nov. 21, 2009.
Brusse, Jay, Tin Whiskers on Variable Air Capacitor, Youtube, Nov. 21, 2009.
Lin, Hsiu-Jen, Lin, Jian-Shian, and Chuang, Tung-Han, "Electromigration of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads," Journal of Alloys and Compounds , vol. 487 no. 1-2, pp. 458-465, Nov. 13, 2009.
Liu, Meng, and Xian, Ai-Ping, "Spontaneous growth of whiskers on RE-bearing intermetallic compounds of Sn-RE, In-RE, and Pb-RE," Journal of Alloys and Compounds, vol. 486 no. 1-2, pp. 590-596, Nov. 3, 2009.
Osenbach, John W., "Creep and its effect on Sn whisker growth," Journal of Applied Physics , vol. 106 no. 9, pp. 094903-1-094903-10, Nov. 1, 2009.
Woodrow, Thomas A., "Effects of Pb on the Diffusion of Tin Within Tin Platings," 2009 AIMS Harsh Environments Electronics Symposium, San Diego, CA, Oct. 5-6, 2009, pp. 935-954.
Baated, Alongheng, Kim, Keun-Soo, Suganuma, Katsuaki, Huang, Sharon, Jurcik, Benjamin, Nozawa, Shigeyoshi, Stone, Bryan, and Ueshima, Minoru, "Effects of Reflow Atmosphere and Flux on Tin Whisker Growth of Sn-Ag-Cu Solder," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 802-808.
Cheng, Jing, and Vianco, Paul T., "In-Place Tracking for Tin Whiskers and Tin Depleted Areas at Different Stress Status," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 612-618.
Hillman, David, "False Tin Whiskers: Masquerading Tin Copper Intermetallics," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 607-611.
Hunt, Christopher, "Implementation and Reliability Issues with Lead-Free Solders," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 295-307.
Lesniewski, Thomas, "Assessment of Whisker Growth from Tin Coated Wire and Cable," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 619-627.
Lesniewski, Tom, "Assessment of Whisker Growth from Tin Coated Wire and Cable (Presentation)," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 619-627.
Nie, Lei, Osterman, Michael, and Pecht, Michael, "Assessing Reliability of Reballed Ball Grid Array Assemblies Under Temperature Cycling Test," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 98-104.
Rotchadl, Hal, "Bridging Supply Chain Gap for Exempt High-Reliability OEM's," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 646-653.
Whytock, Paul, "Stubble Trouble-Beating Back Those Tin Whiskers," Electronic Design, vol. 57 no. 20, pp. 38, Oct. 1, 2009.
Dudek, M. A., and Chawla, N., "Mechanisms for Sn whisker growth in rare earth-containing Pb-free solders," Acta Materialia, vol. 57 no. 15, pp. 4588-4599, Sept. 2009.
Kurtz, Olaf, Barthelmes, Jurgen, Kuhlkamp, Peter, Ruther, Robert, and Neoh, Ding-Ghee, "Anti-corrosion solution for reduction and prevention of corrosion whiskers," Tin World, no. 28, pp. 10-15, Autumn 2009.
Vianco, P. T., and Rejent, J. A., "Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part I: A Model," Journal of Electronic Materials, vol. 38 no. 9, pp. 1815-1825, Sept. 2009.
Vianco, P. T., and Rejent, J. A., "Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part II: Experimental Study," Journal of Electronic Materials, vol. 38 no. 9, pp. 1826-1837, Sept. 2009.
Wickham, M., and Hunt, C., "Evaluation of the Ability of Conformal Coatings to Inhibit Tin Whiskering," NPL Report MAT 36, Sept. 2009.
Xian, Ai-Ping, and Liu, Meng, "Observations of continuous tin whisker growth in NdSn3 intermetallic compound," Journal of Materials Research, vol. 24 no. 9, pp. 2775-2783, Sept. 2009.
Courey, Karim, Wright, Clara, Asfour, Shihab, Onar, Arzu, Bayliss, Jon, and Ludwig, Larry, "An Empirical Model for Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part II," NASA, Sept. 29, 2009.
Horvath, Barbara, and Harsanyi, Gabor, "Mechanical Stress Induced Whiskers," 2009 15th International Symposium for Design and Technology of Electronics Packages, Gyula, Hungary, Sept. 17-20, 2009, pp. 389-393.
Hao, Hu, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, and Guo, Fu, "Oxidization-Induced Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0Er Alloy," Metallurgical and Materials Transactions A, vol. 40 no. 8, pp. 2016-2021, Aug. 2009. https://doi.org/10.1007/s11661-009-9871-8
Webb III, Edmund B., "Pesky Stubble: Recent Progress and Remaining Challenges in Controlling Sn Whiskers," 4th Meeting of TAPS: Challenges in Mechanics and Materials, Boulder, CO, Aug. 2009, pp. xx-xx. (Sandia Report SAND2009-4865C)
Green-Guard 701 Aug. 15, 2009.
Chang, Jeffrey, and Lee, Bing, "Sn Whisker Concern in IC Packaging for High Reliability Application," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1014-1018.
Nie, Lei, Dong, Mingzhi, Cai, Jian, Osterman, Michael, and Pecht, Michael, "Interfacial Reaction of Reballed BGAs under Isothermal Aging Conditions," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 633-641.
Zhao, Mengke, Hao, Hu, Xu, Guangchen, Sun, Jia, Shi, Yaowu, and Guo, Fu, "Fundamental Studies on Whisker Growth in Sn-based Solders," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 585-588.
NASA Anecdote #7: Tin Whiskers on RF Shield/Bracket, Aug. 3, 2009.
NASA Anecdote: Tin Whiskers Inside of AF114 Transistors, Aug. 3, 2009.
NASA Anecdote: Tin Whiskers on Bus Bars, Aug. 3, 2009.
NASA Anecdote: Tin Whiskers on Oscilloscope Probes (2007), Aug. 3, 2009.
Brusse, Jay, "Some Examples of "Whiskers" from Tin-Based Alloys," Perot Systems, July 2009.
"Some Examples of "Whiskers" from Tin-Based Alloys," Tin Whisker Group teleconference, July 22, 2009.
Fujimura, Issei, Vardaman, E. Jan, and Lenihan, Timothy G., "Tin Whisker Prevention with SnBi Plating," InterPACK '09, July 22, 2009.
Geisler, Karl J. L., "Solder Fatigue Impacts of Conformal Coating for Tin Whisker Mitigation on Chip-Scale Thin Small Outline Packages," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 915-920.
Quintero-Aguilo, Pedro O., Caceres-Valencia, Pablo, Valentin, Ricky, and Diaz, Alfredo, "Combinatorial Studies for the Minimization of Tin Whiskers Growth in Lead Free Electronics," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 347.
Chen, Chih-ming, and Chen, Yu-jen, "Growth orientation of the tin whiskers on an electrodeposited Sn thin film under three-point bending," Materials Letters, vol. 63 no. 17, pp. 1517-1520, July 15, 2009.
Chen, Kai, Tamura, N., Kunz, M., Tu, K. N., and Lai, Yi-Shao, "In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction," Journal of Applied Physics, vol. 106 no. 2, pp. 023502-1-023502-4, July 15, 2009.
McCormack, Steve, and Meschter, Stephan, "A Probabilistic Assessment of Component Lead-to-Lead Tin Whisker Bridging," Tin Whisker Group teleconference, July 15, 2009.
Meschter, Stephan, "A Probabilistic Assessment of Component Lead-to-Lead Tin Whisker Bridging," Tin Whisker Group teleconference, July 15, 2009.
Chason, Eric, "Sn whisker formation: relationship between intermetallic formation, stress and whisker nucleation," Tin Whisker Group teleconference, July 8, 2009.
Chuang, Tung-Han, and Chi, Chih-Chien, "Effect of adding Ge on rapid whisker growth of Sn-3Ag-0.5Cu-0.5Ce alloy," Journal of Alloys and Compounds, vol. 480 no. 2, pp. 974-980, July 8, 2009.
Benka, Stephen G., "How tin whiskers grow," Physics Today, vol. 62 no. 7, pp. 23, July 1, 2009. https://doi-org.ezproxy.uky.edu/10.1063/1.4797168
Chiu, Tsung-Chieh, and Lin, Kwang-Lung, "The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint," Scripta Materialia, vol. 60 no. 12, pp. 1121-1124, June 2009.
Guo, Fu, Zhao, Mengke, Xia, Zhidong, Lei, Yongping, Li, Xiaoyan, and Shi, Yaowu, "Lead-free Solders with Rare Earth Additions," JOM, vol. 61 no. 6, pp. 39-44, June 2009.
Liu, Meng, and Xian, Ai-Ping, "Tin whisker growth on bulk Sn-Pb eutectic doping with Nd," Microelectronics Reliability, vol. 49 no. 6, pp. 667-672, June 2009. https://doi.org/10.1016/j.microrel.2009.03.012
Skwarek, Agata, Witek, Krzysztof, and Ratajczak, Jacek, "Risk of whiskers formation on the surface of commercially available tin-rich alloys under thermal shocks," Microelectronics Reliability, vol. 49 no. 6, pp. 569-572, June 2009. https://doi.org/10.1016/j.microrel.2009.02.026
Kessel, Kurt, "NASA-DoD Lead-Free Electronics Project," Tin Whisker Group teleconference, June 24, 2009.
Courey, Karim J., Asfour, Shihab S., Onar, Arzu, Bayliss, Jon A., Ludwig, Larry L., and Wright, Maria C., "Developing an Empirical Model for Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part II," 3rd International Symposium on Tin Whiskers, Lyngby, Denmark, June 23-24, 2009, pp. xx-xx.
Courey, Karim J., Asfour, Shihab S., Onar, Arzu, Bayliss, Jon A., Ludwig, Larry L., and Wright, Maria C., "Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part II," 3rd International Symposium on Tin Whiskers, Lyngby, Denmark, June 23-24, 2009, pp. xx-xx.
Smetana, Joe, "iNEMI Recommendations on Lead Free Finishes for Components Used in High-Reliability Products," Tin Whisker Group teleconference, June 10, 2009.
Dudek, Martha A., Microstructure, Mechanical and Oxidation Behavior of RE-containing Pb-free Solders. Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2009.
Verdi, Fred, "Tin Whiskers: Mitigation With Conformal Coatings Part II," empfasis , pp. 1,7, May 2009.
Panashchenko, Lyudmyla, and Osterman, Michael, "Examination of Nickel Underlayer as a Tin Whisker Mitigator," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1037-1043.
Su, Peng, Lee, C. J., Li, Li, Xue, Jie, Khan, Boaz, Moazeni, Reza, and Hartranft, Marc, "Practical Assessment of Tin Whisker Growth Risk due to Environmental Temperature Variations," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 736-741.
Terasaki, Takeshi, Iwasaki, Tomio, Okura, Yasutaka, Suzuki, Tomohisa, Kato, Takahiko, Nakamura, Masato, and Hashimoto, Tomoaki, "Evaluation of Tin-whisker Growth During Thermal-cycle Testing Using Stress- and Mass-diffusion Analysis," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 277-284.
What's Inside Your PC? (before May 25, 2009)
Kessel, Kurt, "Space Shuttle Program - Tin Whisker Mitigation: Labor Hour Rough Order of Magnitude (ROM) Estimate," NASA, May 20, 2009.
Whisker (metallurgy) (before May 20, 2009)
Panashchenko, Lyudmyla, and Osterman, Michael, "Examination of Nickel Underlayer as a Tin Whisker Mitigator (presentation)," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1037-1043.
McCormack, S., and Meschter, S., "Probabilistic Assessment of Component Lead-to-Lead Tin Whisker Bridging," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.
Smetana, Joe, "Theory of Tin Whisker Growth "The End Game"," Tin Whisker Group teleconference, May 13, 2009.
Horvath, Barbara, Illes, Balazs, and Harsanyi, Gabor, "Investigation of Tin Whisker Growth: The Effects of Ni and Ag Underplates," 32nd International Spring Seminar on Electronics Technology, Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.
"Hot-Dip Tin Process Said to Prevent Whisker Formation," Products Finishing, vol. 73 no. 7, pp. 11, Apr. 2009.
"Tin Whisker Imagery," empfasis, pp. 9, Apr. 2009.
Verdi, Fred, "Tin Whiskers: Risks with Lead Free Part I," empfasis, pp. 1,7, Apr. 2009.
Wilson, J. R., "Lead-free RoHS on military electronics procurement," Military & Aerospace Electronics, vol. 20 no. 4, pp. 24-29, Apr. 2009.
"The Fusing of Wires and Tin Whiskers," Tin Whisker Group teleconferences, Apr. 22, 2009 and Apr. 29, 2009.
Gao, Fan, Lead-Free Nano-solders on Metallic Nanowires: Synthesis, Characterization, and Thermal Reflow Properties. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, Apr. 21, 2009.
"Scientists Research Tin Pest and Whiskers," SMT Web Exclusive Article. (Apr. 3, 2009)
Chen, Yu-jen, and Chen, Chih-ming, "Mitigative Tin Whisker Growth Under Mechanically Applied Tensile Stress," Journal of Electronic Materials, vol. 38 no. 3, pp. 415-419, Mar. 2009.
Chuang, Tung-Han, and Lin, Hsiu-Jen, "Inhibition of Whisker Growth on the Surface of Sn-3Ag-0.5Cu-0.5Ce Solder Alloyed with Zn," Journal of Electronic Materials, vol. 38 no. 3, pp. 420-424, Mar. 2009.
Mitooka, Yutaka, Murakami, Koji, Hino, Makoto, Takamizawa, Masao, and Takada, Jun, "Effect of Laser Irradiation on Generation and Growth of Whiskers in Tin-Electroplated Film," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 73 no. 3, pp. 226-233, Mar. 2009.
Shibutani, Tadahiro, Osterman, Michael, and Pecht, Michael, "Standards for Tin Whisker Test Methods on Lead-Free Components," IEEE Transactions on Components and Packaging Technologies, vol. 32 no. 1, pp. 216-219, Mar. 2009.
Wickham, Martin, Jennett, Nigel, Nunn, John, Gohil, Dipak, and Hunt, Chris, "Measuring Tin Whiskering Propensity: Measuring Internal Stress in Tin Coatings by Nanoindentation," NPL Report MAT 29, Mar. 2009.
Wu, Albert T., and Ding, Y. C., "The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment," Microelectronics Reliability, vol. 49 no. 3, pp. 318-322, Mar. 2009. https://doi.org/10.1016/j.microrel.2008.11.002
Munson, Terry, and Solis, Paco, ""Metal Whiskers" Does Surface Contamination Have an Effect of Whisker Formation?," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.
Rotchadl, Hal, "Bridging Supply Chain Gap for Exempt High-Reliability OEM's," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.
Hu, Chi-Chang, Tsai, Yi-Da, Lin, Chi-Cheng, Lee, Gen-Lan, Chen, Sinn-Wen, Lee, Tai-Chou, and Wen, Ten-Chin, "Anomalous growth of whisker-like bismuth-tin extrusions from tin-enriched tin-Bi deposits," Journal of Alloys and Compounds, vol. 472 no. 1-2, pp. 121-126, Mar. 20, 2009.
Verdi, Fred W., "Lead Free Electronics, Tin Whisker Risks, and Mitigation Techniques," Mar. 11, 2009.
Panashchenko, Lyudmyla, "Non-Whisker Formations on Sn plating," Center for Advanced Life Cycle Engineering, Mar. 3, 2009.
Kim, Dongchoul, "Evolution of micro solder joints under electromigration and elastic field," Journal of Mechanical Science and Technology, vol. 23 no. 2, pp. 489-497, Feb. 2009.
Dudek, M. A., and Chawla, N., "Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders," Journal of Electronic Materials, vol. 38 no. 2, pp. 210-220, Feb. 2009.
Borgesen, Peter, "Lead-Free Solder Joint Reliability Oxymoron? (I like it, but ...)," Tin Whisker Group teleconference, Feb. 25, 2009.
Hybrid Plastics Achieves a Milestone with Nanoscopic Materials for Suppression of Tin Whiskers from Lead-free Solders (before Feb. 24, 2009)
What Are Tin Whiskers? (before Feb. 24, 2009)
Martin, Holly, An Introduction to Tin Whiskers (before Feb. 24, 2009)
NASA Basic Info/FAQ, (before Feb. 22, 2009)
Pure Tin Plating Prohibition (before Feb. 22, 2009)
Tin Whiskers "A New Problem" (before Feb. 22, 2009)
Panashchenko, Lyudmyla, "Melting Whiskers," Center for Advanced Life Cycle Engineering, Feb. 13, 2009.
Spiegel, Rob, "Robots dip lead to end tin whiskers," Design News, Feb. 6, 2009.
NASA SILVER WHISKER Photo Gallery, Feb. 5, 2009.
Courey, Karim J., Asfour, Shihab S., Onar, Arzu, Bayliss, Jon A., Ludwig, Lawrence L., and Wright, Maria C., "Tin Whisker Electrical Short Circuit Characteristics - Part II," IEEE Transactions on Electronics Packaging Manufacturing, vol. 32 no. 1, pp. 41-48, Jan. 2009.
Saito, M., Sasaki, H., Katou, K., Toba, T., and Homma, T., "Effect of Cu Seed Layers on the Properties of Electroplated Sn-Cu Films," Journal of the Electrochemical Society, vol. 156 no. 5, pp. E86-E90, Jan. 2009.
Yu, Hongwen, Hu, Shejun, Hou, Xianhua, Ru, Qiang, Zhao, Lingzhi, and Li, Weishan, "Electrochemical Performance of Tin-Aluminum Thin Film Anodes for Lithium Ion Battery," Materials Science Forum, vol. 610-613, pp. 467-471, Jan. 2009.
Courey, Karim, "Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part I," Tin Whisker Group teleconference, Jan. 28, 2009.
"Thermal cycling test of tin-bismuth and tin plating," Ishihara Chemical Co., 2008.
Tin Whisker Alert 2008.
Tin Whiskers 2008.
Tin whiskers causes and prevention 2008.
Bhardwaj, Divya, Development of Lead Free Thermal Fuse Wires Using Ohno Continuous Casting. Master's Thesis for University of Toronto, Toronto, Canada, 2008.
Chen, Keming, and Wilcox, Geoffrey D., "Tin-Manganese Alloy Electrodeposits: II. Corrosion Performance Studies," Journal of the Electrochemical Society, vol. 155 no. 2, pp. C53-C61, 2008.
Fischer, Gerd, and Esser, Bob, "Tin Whiskers," 2004-2007.
Hino, Makoto, Murakami, Koji, Mitooka, Yutaka, Takamizawa, Masao, Naka, Toshihide, and Nakai, Kiyomichi, "Lead Transfer to the Surface into Electrodeposited Tin Film and the Whisker Growth," Journal of the Surface Finishing Society of Japan, vol. 59 no. 12, pp. 925-930, 2008.
Jafreen, Rifat, A Cost Model for Assessing the Transition to Lead-Free Electronics . Master's Thesis for University of Maryland, College Park, MD, 2008.
Kawano, Shunsuke, and Tomomori, Tatsuo, "About the Characteristic and Whisker of Pre-coated Aluminum Sheet for Solder," Journal of the Surface Finishing Society of Japan, vol. 59 no. 4, pp. 232-236, 2008.
Kiga, Tomoya, Asai, Tadashi, Mizuguchi, Yukiko, Murakami, Yosuke, Tanaka, Shinji, and Tomiya, Shigetaka, "Test Method and Mechanism Analysis for Tin Whisker Growth by Mechanical Stress," Journal of the Surface Finishing Society of Japan, vol. 59 no. 4, pp. 223-227, 2008.
Moriuchi, Hiroyuki, "Approach for External Stress Type Whisker Mitigation," Journal of the Surface Finishing Society of Japan, vol. 59 no. 4, pp. 218-222, 2008.
Ohgaki, Masataka, "Structural Analysis of Whisker on Lead-free Plate," Journal of the Surface Finishing Society of Japan, vol. 59 no. 4, pp. 237-241, 2008.
Southworth, A. R., Ho, C. E., Lee, A., and Subramanian K. N., "Effect of strain on whisker growth in matte tin," Soldering & Surface Mount Technology, vol. 20 no. 1, pp. 4-7, 2008.
Sperling, Ed, "Off-The-Shelf Migraines," EECatalog. 2008.
Suganuma, Katsuaki, "Research Trends of Tin Whiskers and Current under Standing of the Mechanism," Journal of the Surface Finishing Society of Japan, vol. 59 no. 4, pp. 210-217, 2008.
Tanabe, Kazuhiko, Toshima, Hiroshi, and Toyoda, Yoshitaka, "The Consideration of Whisker Growth Mechanism on Lead Free Soldering," Journal of the Surface Finishing Society of Japan, vol. 59 no. 4, pp. 228-231, 2008.
Chuang, T. H., and Lin, H. J., "Size Effect of Rare-Earth Intermetallics in Sn-9Zn-0.5Ce and Sn-3Ag-0.5Cu-0.5Ce Solders on the Growth of Tin Whiskers," Metallurgical and Materials Transactions A, vol. 39 no. 12, pp. 2862-2866, Dec. 2008. https://doi.org/10.1007/s11661-008-9632-0
Ice, Gene E., "The Future of Spatially-Resolved Polychromatic Neutron and X-Ray Microdiffraction," Metallurgical Transactions A, vol. 39 no. 13, pp. 3058-3064, Dec. 2008. https://doi.org/10.1007/s11661-008-9570-x
Nardone, Keith, "Combating the military's tin whisker threat: no-lead strategies for power products," Military & Aerospace Electronics, Dec. 2008.
Wickham, M., and Hunt, C., "Test Method for Measurement of the Propensity for Conformal Coatings to Inhibit Tin Whiskering," NPL Report MAT 28, Dec. 2008.
Yang, Fuqian, and Li, Yan, "Indentation-induced tin whiskers on electroplated tin coatings," Journal of Applied Physics, vol. 104 no. 11, pp. 113512-1-113512-4, Dec. 2008.
Rodekohr, Chad L., Material Factors Influencing Metallic Whisker Growth. Ph. D. Thesis for Auburn University, Auburn, AL, Dec. 19, 2008.
Courey, Karim, Asfour, Shihab, Bayliss, Jon, Ludwig, Larry, and Wright, Clara, "Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part I," NASA-DoD Lead-Free Electronics Project Consortium, December 16, 2008, pp. xx-xx.
Pinsky, David A., "An updated Application-Specific Tin Whisker Risk Assessment Algorith, and its use within a process compliant to GEIS-STD-0005-2." (before Dec. 14, 2008)
Pinsky, David A., "Enhancements to Current Tin Whisker Risk Assessment Methods." (before Dec. 14, 2008)
Lee, Jeffrey ChangBing, "The Whisker Mitigation Efficiency of Ni Underlayer for IC Packaging on Board," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1060-1065.
Shibutani, Tadahiro, and Yu, Qiang, "Pressure Induced Tin Whisker Formation on SnCu Finish by Nanoindentation Creep," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1442-1447.
Sosiati, H., Hirokado, N., Kuwano, N., and Ohno, Y., "Transmission Electron Microscopy of Spontaneous Tin (Sn) Whisker Growth under High Temperature/Humidity Storage," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1054-1059.
Sriyarunya, Anocha, Tondtan, Jiraporn, and Tukiman, Hasmani, "Matte Tin (Sn) Plating of Semiconductor Devices - Update of Whisker Growth Study," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 94-102.
Courey, Karim, Wright, Clara, Asfour, Shihab, Bayliss, Jon, and Ludwig, Larry, "An Empirical Model for Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part I," NASA, Dec. 3, 2008.
Courey, Karim, Asfour, Shihab, Bayliss, Jon, Ludwig, Larry, and Wright, Clara, "Estimating the Probability of Electrical Short Circuits from Tin Whiskers," NASA-DoD Lead-Free Electronics Project Consortium, Dec. 3, 2008.
Aragon, Joseph, Wavrik, Richard, Vianco, Paul, Witham, John, and McKenzie, Bonnie, "Tin Whisker Mitigation Methods," Defense Manufacturing Conference , Orlando, FL, Dec. 1-4, 2008, pp. xx-xx. (Sandia Report SAND2008-7346C)
Kumar, K. S., Reinbold, L., Bower, A. F., and Chason, E., "Plastic deformation processes in Cu/Sn bimetallic films," Journal of Materials Research, vol. 23 no. 11, pp. 2916-2934, Nov. 2008.
Touw, Anduin E., "Tin Whisker Investigation of SnPb Plated Parts with Marginal Pb Content," Boeing, Nov. 17, 2008.
Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla, "Metal Whiskers: A Discussion of Risks and Mitigation," Symposium on Part Reprocessing, Tin Whisker Mitigation and Assembly Rework, Nov. 12, 2008.
Hillman, David, Margheim, Sue, and Straw, Eric, "The Use of Tin/Bismuth Plating for Tin Whisker Mitigation on Fabricated Mechanical Parts," Symposium on Reprocessing Tin Whisker Mitigation, and Assembly Rework, College Park, MD, Nov. 11-12, 2008, pp. xx-xx.
Woodrow, Tom, and Ledbury, Eugene, "Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy, Part III," Symposium on Reprocessing, Tin Whisker Mitigation and Assembly Rework, College Park, MD, Nov. 11-12, 2008, pp. xx-xx.
Chen, Chih-Ming, and Shih, Po-Yuan, "A peculiar composite structure of carbon nanofibers growing on a microsized tin whisker," Journal of Materials Research, vol. 23 no. 10, pp. 2668-2673, Oct. 2008.
Lin, Chih-Kuang, and Lin, Tung-Hsien, "Effects of continuously applied stress on tin whisker growth," Microelectronics Reliability, vol. 48 no. 10, pp. 1737-1740, Oct. 2008.
van Kan, J. A., Zhang, F., Chiam, S. Y., Osipowicz, T., Bettiol, A. A., and Watt, F., "Proton beam writing: a platform technology for nanowire production," Microsystem Technologies, vol. 14 no. 9-11, pp. 1343-1348, Oct. 2008.
McKeown, Stephen, and Meschter, Stephan, "Effect of hot solder dipping on part stresses," 2008 ASME International Mechanical Engineering Congress and Exposition, Boston, MA, Oct. 31-Nov. 6, 2008, pp. xx-xx.
Rodekohr, C. L., Flowers, G. T., Suhling, J. C., and Bozack, M. J., "Auger Electron Spectroscopic (AES) Measurements on High Aspect Ratio Tin Whiskers," Proceedings of the 54th IEEE Holm Conference on Electrical Contacts, Orlando, FL, Oct. 27-29, 2008, pp. 232-237.
Huang, Wei, "Failure Probability Evaluation Due to Tin Whiskers Caused Leads Bridging on Compressive Contact Connectors," IEEE Transactions on Reliability , vol. 57 no. 3, pp. 426-430, Sept. 2008.
"Whiskers on Monitor PCBs," Center for Advanced Life Cycle Engineering, Sept. 5, 2008.
"Whiskers on USB housing of PC Mother Board," Center for Advanced Life Cycle Engineering, Sept. 5, 2008.
Lee, Jeffrey ChangBing, "Ni Underlayer Efficiency Investigation for Whisker Mitigation in IC Packaging," 2nd Electronics Systemintegration Technology Conference , Greenwich, London, UK, Sept. 1-4, 2008, pp. 453-458.
Kurtz, Olaf, Barthelmes, Juergen, and Martin, Kevin, "Anti-Corrosion Solution for Reduction and Prevention of Corrosion Whiskers," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 739-744.
Kurtz, Olaf, Kuhlkamp, Peter, Barthelmes, Jurgen, Ruther, Robert, and Neoh, D. G., "Anti-corrosion solution for reduction and prevention of corrosion whiskers," Tin World, no. 23, pp. 8-12, Summer 2008.
Shi, Yaowu, and Hao, Hu, "Tin Whiskers with Special Morphology," Beijing University of Technology, July 2008.
Shibutani, Tadahiro, Yu, Qiang, Shiratori, Masaki, and Pecht, Michael G., "Pressure-induced tin whisker formation," Microelectronics Reliability , vol. 48 no. 7, pp. 1033-1039, July 2008. https://doi.org/10.1016/j.microrel.2008.04.009
Wei, C. C., Liu, P. C., Chen, Chih, and Tu, K. N., "Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes," Journal of Materials Research, vol. 23 no. 7, pp. 2017-2022, July 2008.
NASA Metal Whiskers from Sn-Ag-Cu Alloy Systems, (before July 14, 2008)
Tin Whiskers with Special Morphology July 14, 2008.
Shibutani, Tadahiro, Yu, Qiang, and Shiratori, Masaki, "Effect of Creep Properties on Pressure Induced Tin Whisker Formation," Proceedings - The 2nd IEEE International Conference on Secure System Integration and Reliability Improvement, Yokohama, Japan, July 14-17, 2008, pp. 197-198.
Sobiech, M., Welzel, U., Mittemeijer, E. J., Hugel, W., and Seekamp, A., "Driving force for Sn whisker growth in the system Cu-Sn," Applied Physics Letters, vol. 93 no. 1, pp. 011906-1-011906-3, July 7, 2008.
Tan, Y. Y., On, Dinah, Krishnan, J., "Early Whisker Detection through Intermetallic Compound (IMC) Grain Size," 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 7-11, 2008, pp. xx-xx.
Moelans, N., Blanpain, B., and Wollants, P., "Quantitative analysis of grain boundary properties in a generalized phase field model for grain growth in anisotropic systems," Physical Review B , vol. 78 no. 2, pp. 024113-1-024113-23, July 1, 2008.
Chen, Min-Na, Ding, Shi-Jin, Sun, Qing-Qing, Zhang, Wei, David, and Wang, Li-Kang, "Effect of Pulse-Plated Nickel Barriers on Tin Whisker Growth for Pure Tin Solder Joints," Journal of Electronic Materials, vol. 37 no. 6, pp. 894-900, June 2008.
Ciarcia, Steve, "It's All In The Whiskers," Circuit Cellar, no. 215, pp. 96, June 2008.
Fontana, Pietro, "SEM Images of a 27 Year Old Sample Containing Tin Whiskers in Comparison to Salt (NaCl) Whiskers," June 2008.
Okamoto, Naoki, Fujii, Yuko, Kurihara, Hiroaki, and Kondo, Kazuo, "Effect of the Structures within the Substrates for Sn Whisker Formation," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals , vol. 72 no. 6, pp. 413-419, June 2008.
Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla, "Metal Whiskers," Nuclear Procurement Issues Committee (NUPIC) Meeting, June 19, 2008.
Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla, "Metal Whiskers," UNOVIS Consortium Meeting, Owego, NY, June 18, 2008.
Meschter, S., "Lead-to-lead spacing considerations a part of a comprehensive 2B tin whisker mitigation strategy," AIA/GEIA/AMC LEAP Meeting, June 10-11, 2008, pp. xx-xx.
NASA Tin Whisker Anecdote: Swiss Radio & Telephone, June 9, 2008.
Courey, Karim J., An Investigation of the Electrical Short Circuit Characteristics of Tin Whiskers. Ph. D. Thesis for University of Miami, Coral Gables, FL, May 2008.
Falcone, Joe, and Tanabe, Goji, "Minimizing Tin Whiskering in Microminiature Connector Design," ECN Electronic Component News (Supplement), vol. 52 no. 5, pp. 10-11, May 2008.
Pinsky, David A., "The role of dissolved hydrogen and other trace impurities on propensity of tin deposits to grow whiskers," Microelectronics Reliability, vol. 48 no. 5, pp. 675-681, May 2008. https://doi.org/10.1016/j.microrel.2008.01.008
Qi, Haiyu, Ganesan, Sanka, and Pecht, Michael, "No-fault-found and intermittent failures in electronic products," Microelectronics Reliability, vol. 48 no. 5, pp. 663-674, May 2008.
Sampson, Michael J., "Developing a NASA Lead-Free Policy for Electronics Lessons Learned,"
TRISMAC 08 Joint NASA/ESA/JAXA Conference, Noordwijk, The Netherlands, May 2008, pp. xx-xx.
Cheng, Jing, Chen, Samuel, Vianco, Paul, and Li, James C. M., "A New Mechanism for Hillock Formation over Electrodeposited Thin Tin Film," 2008 Proceedings 58th Electronic Components & Technology Conference , Lake Buena Vista, FL, May 27-30, 2008, pp. 472-477.
Han, Sung-Won, Kim, Kyung-Seob, Yu, Chung-Hee, Osterman, Michael, and Pecht, Michael, "Observations of the Spontaneous Growth of Tin Whiskers in Various Reliability Conditions," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1484-1490.
Pedigo, A. E., Handwerker, C. A., and Blendell, J. E., "Whiskers, Hillocks, and Film Stress Evolution in Electroplated Sn and Sn-Cu Films," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1498-1504.
Brusse, Jay, "Whisker Presentation to AAMI Cardiac Rhythm Device Management Committee," May 15, 2008.
Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla, "Metal Whiskers," Association for Advancement of Medical Instrumentation (AAMI) Cardiac Rhythm Management Device Committee, San Francisco, CA, May 13, 2008.
Snugovsky, Polina, Bagheri, Zohreh, and Romansky, Marianne, "Whisker Growth on SAC Solder Joints: Microstructure Analysis," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.
Snugovsky, Polina, Bagheri, Zohreh, and Romansky, Marianne, "Whisker Growth on SAC Solder Joints: Microstructure Analysis (presentation)," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.
Buetow, Mike, "Tin Whiskers Email Forum Open," Circuits Assembly, vol. 19. no. 4, pp. 14, Apr. 2008.
Chason, E., Jadhav, N., Chan, W. L., Reinbold, L., and Kumar, K. S., "Whisker formation in Sn and Pb-Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes," Applied Physics Letters, vol. 92, no. x, pp. 171901-1-171901-3, Apr. 2008.
Kim, Kyung-Seob, Kim, Jin-Hyeok, and Han, Sung-Won, "The effect of postbake treatment on whisker growth under high temperature and humidity conditions on tin-plated Cu substrates," Materials Letters , vol. 62 no. 12-13, pp. 1867-1870, Apr. 30, 2008. https://doi.org/10.1016/j.matlet.2007.10.027
Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla, "Metal Whiskers: Failure Modes and Mitigation Strategies," 2nd International Symposium on Tin Whiskers, Tokyo, Japan, Apr. 24, 2008.
Moon, Kil-Won, Boettinger, William J., Ma, Li, Williams, Maureen, and Morris, Dylan, "Whisker/Hillock Formation on As-electrodeposited and Indentation Stressed Sn Film," 2nd International Symposium on Tin Whiskers, Tokyo, Japan, Apr. 24-25, 2008, pp. xx-xx.
Pinsky, David A., "Tin Whiskers: Managing Risks," Overcoming the Reliability Challenge: An IPC Summit, Andover, MA, Apr. 15, 2008, pp. xx-xx.
Lesniewski, Tom, and Higley, Tom, "Effects of Tin Mitigation Processes on Whisker Growth and Solder Joint Reliability for Chip and Small-Outline Package Components," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S13:01.
Nie, Lei, Osterman, Michael, Pecht, Michael, Song, Fubin, Lo, Jeffrey, and Lee, S. W. Ricky, "Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. P-07.
Chuang, T. H., Chi, C. C., and Lin, H. J., "Formation of Whiskers and Hillocks on the Surface of Sn-6.6RE Alloys," Metallurgical and Materials Transactions A, vol. 39 no. 3, pp. 604-612, Mar. 2008. https://doi.org/10.1007/s11661-007-9426-9
Hillman, David, and Pauls, Doug, "A Summary of Tin Whisker Research References," IPC-WP-009, Mar. 2008.
Liang, J., Dariavach, N., and Shangguan, D., "Tin Whisker Nucleation and Growth on Sn-Pb Eutectic Coating Layer Inside Plated Through Holes With Press-Fit Pins," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 1, pp. 152-158, Mar. 2008.
Murakami, Koji, Hino, Makoto, Takamizawa, Masao, and Nakai, Kiyomichi, "Mechanism of Generation and Growth of Whiskers on Tin Electroplating," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 72 no. 3, pp. 168-175, Mar. 2008.
Russick, Edward M., and Thayer, Gayle Echo, "Conformal Coating Value/Risk Assessment for Sandia Satellite Programs," Sandia Report SAND2008-1125, Mar. 2008.
Takamizawa, Masao, Naka, Toshihide, Hino, Makoto, Murakami, Koji, Mitooka, Yutaka, and Nakai, Kiyomichi, "Effect of Lead Co-Deposition on the Whisker Growth on Electrodeposited Tin Film," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 72 no. 3, pp. 229-235, Mar. 2008.
"RoHS at QP Semiconductor," QP Semiconductor Application Note 114 Rev. 2.0, Feb. 2008.
"New additive limits tin whiskers," Solid State Technology, vol. 51 no. 1, pp. 23, Jan. 2008.
Buetow, Mike, "Report: XRF a Viable RoHS, Tin Whisker Screener," Circuits Assembly , vol. 19 no. 1, pp. 8, Jan. 2008.
Courey, Karim J., Asfour, Shihab S., Bayliss, Jon A., Ludwig, Lawrence L., and Zapata, Maria C., "Tin Whisker Electrical Short Circuit Characteristics - Part I," IEEE Transactions on Electronics Packaging Manufacturing, vol. 31 no 1, pp. 32-40, Jan. 2008.
Jiang, Bo, and Xian, Ai-Ping, "Whisker growth on tin finishes of different electrolytes," Microelectronics Reliability, vol. 48 no. 1, pp. 105-110, Jan. 2008. https://doi.org/10.1016/j.microrel.2007.02.002
Kim, K. S., Yu, C. H., Han, S. W., Yang, K. C., and Kim, J. H., "Investigation of relation between intermetallic and tin whisker growths under ambient condition," Microelectronics Reliability, vol. 48 no. 1, pp. 111-118, Jan. 2008. https://doi.org/10.1016/j.microrel.2007.01.088
Lin, Y. W., Lai, Yi-Shao, Lin, Y. L., Tu, Chun-Te, and Kao, C. R., "Tin Whisker Growth Induced by High Electron Current Density," Journal of Electronic Materials, vol. 37 no. 1, pp. 17-22, Jan. 2008.
Nakadaira, Yoshikuni, Jeong, Seyoung, Shim, Jongbo, Seo, Jaiseok, Min, Sunhee, Cho, Taeje, Kang, Sayoon, and Oh, Seyong, "Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling," Microelectronics Reliability , vol. 48 no. 1, pp. 83-104, Jan. 2008. https://doi.org/10.1016/j.microrel.2007.01.091
Nychka, John A., Li, Yan, Yang, Fuqian, and Chen, Rong, "Can Whiskers Grow on Bulk Lead-Free Solder?," Journal of Electronic Materials, vol. 37 no. 1, pp. 90-95, Jan. 2008.
Wei, C. C., Liu, P. C., Chen, Chih, Lee, Jeffrey C. B., and Chen, P. C., "Relieving Sn Whisker Growth Driven by Oxidation on Cu Leadframe by Annealing and Reflowing Treatments," 2008 Pan Pacific Microelectronics Symposium & Exhibit, Kauai, HI, Jan. 22-24, 2008, pp. xx-xx.
Aragon, Joseph, Wavrik, Richard, Vianco, Paul, and Witham, John, "Tin Whisker Mitigation Methods," Defense Semiconductor Association Meeting, Las Vegas, NV, Jan. 14-17, 2008, pp. xx-xx. (Sandia Report SAND2008-0117C)
Courey, Karim J.,
NASA, Jan. 1, 2008.
2007: 0 books, 0 theses, 103 papers, and 6 web pages on tin whiskers
Barr, Stephanie,
"Mitigating and Preventing the Growth of Tin and Other Metal Whiskers on
Critical Hardware," The Aerospace Corporation, 2007.
Barr, Stephanie, "Mitigating and Preventing the Growth of Tin and Other Metal Whiskers on Critical Hardware (presentation)," The Aerospace Corporation, 2007.
Barthelmes, Jurgen, Crema, Paolo, and Kuhlkamp, Peter, "Whisker Growth during Heat-Humidity Storage - Mechanism and Factors of Influence," SEMICON Singapore 2007, Singapore, 2007, pp. xx-xx.
Fang, Tong, Mathew, Sony, Osterman, Michael, and Pecht, Michael, "Assessment of risk resulting from unattached tin whisker bridging," Circuit World, vol. 33 no. 1, pp. 5-8, 2007.
Garich, H., McCrabb, H., Taylor, E. J., and Inman, M., "Controlling Whisker Formation in Tin-Based Solders Using Electrically Mediated Electrodeposition," ECS Transactions, vol. 6 no. 8, pp. 153-163, 2007.
Jiang, Bo, and Xian, Ai-Ping, "Observations of ribbon-like whiskers on tin finish surface," Journal of Materials Science: Materials in Electronics, vol. 18 no. 5, pp. 513-518, 2007.
Johnson, Howard, "Rollback the Lead-Free Initiative," High-Speed Digital Design Online Newsletter, vol. 10 no. 1, pp. xx-xx, 2007.
Ouyang, Fan-Yi, Chen, Kai, Tu, K. N., and Lai, Yi-Shao, "Effect of current crowding on whisker growth at the anode in flip chip solder joints," Applied Physics Letters, vol. 91, pp. 231919-1-231919-3, 2007.
Smetana, Joe, "Theory of Tin Whisker Growth "The End Game"," iNEMI Tin Whisker Workshop at ECTC May 31, 2005 Updated 2007.
Tsuji, Kiyotaka, "Growth Mechanism of Tin Whisker," Journal of the Surface Finishing Society of Japan, vol. 58 no. 7, pp. 406-411, 2007.
Welzel, U., and Mittemeijer, E. J., "Stress evolution in thin films; diffusion and reactions," Defect and Diffusion Forum, vol. 264, pp. 71-78, 2007.
Chuang, Tung-Han, Lin, Hsiu-Jen, and Chi, Chih-Chien, "Oxidation-Induced Whisker Growth on the Surface of Sn-6.6(La, Ce) Alloy," Journal of Electronic Materials, vol. 36 no. 12, pp. 1697-1702, Dec. 2007.
Lin, Shih-Kang, Yorikado, Yuhi, Jiang, Junxiang, Kim, Keun-Soo, Suganuma, Katsuaki, Chen, Sinn-Wen, Tsujimoto, Masanobu, and Yanada, Isamu, "Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers," Journal of Electronic Materials, vol. 36 no. 12, pp. 1732-1734, Dec. 2007.
Nakadaira, Yoshikuni, Jeong, Seyoung, Shim, Jongbo, Seo, Jaiseok, Min, Sunhee, Cho, Taeje, Kang, Sayoon, and Oh, Seyong, "Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling," Microelectronics Reliability , vol. 47 no. 12, pp. 1928-1949, Dec. 2007. https://doi.org/10.1016/j.microrel.2007.03.008
Subbarayan, G., Kinyanjui, R., Deutsch, J., and Baker, M., "An Experimental Study of a Components Termination Finish Conversion Process: The Robotic Stripping and Solder Termination Process," SMTAnews & Journal of Surface Mount Technology, vol. 20 no. 4, pp. 11-20, Oct.-Dec. 2007.
Preliminary Guidance for Optical Inspection for Metal Whiskers Dec. 10, 2007.
Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla, "Metal Whiskers: Failure Modes and Mitigation Strategies," Microelectronics Reliability and Qualification Workshop, Los Angeles, CA, Dec. 4-5, 2007, pp. xx-xx.
Mason, Maribeth, and Eng, Genghmun, "Understanding Tin Plasmas: A New Approach to Tin Whisker Risk Assessment," Microelectronics Reliability and Qualification Workshop, Los Angeles, CA, Dec. 4-5, 2007, pp. xx-xx.
Kushner, Arthur S., "Plating Clinic: Tin Whiskers Revisited," Products Finishing, vol. 71 no. 14, pp. 61-63, Nov. 2007.
Li, Shi-Bo, Bei, Guo-Ping, Zhai, Hong-Xiang, Zhang, Zhi-Li, Zhou, Yang, and Li, Cui-Wei, "The origin of driving force for the formation of Sn whiskers at room temperature," Journal of Materials Research, vol. 22 no. 11, pp. 3226-3232, Nov. 2007.
Mason, M. S., and Eng, G., "Understanding tin plasmas in vacuum: A new approach to tin whisker risk assessment," Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, vol. 25 no. 6, pp. 1562-1566, Nov. 2007.
Brown, Neil, "A Summary of Methods for Minimizing Tin Whisker Growth," Shipley Electronic & Industrial Finishing. (before Nov. 11, 2007)
Xu, Chen, Fan, Chonglun, Vysotskaya, Anna, Abys, Joseph A., Zhang, Yun, Hopkins, Leslie, and Stevie, Fred, "Understanding Whisker Phenomenon - Part II: Competitive Mechanisms," Electroplating Chemicals and Services. (before Nov. 11, 2007)
Barthelmes, Jurgen, Lagorce-Broc, Florence, Kuhlkamp, Peter, Kok, Sia-Wing, and Neoh, Din-Ghee, "Different Storage Conditions have Different Whisker Growth Mechanisms - Can Bright Tin be an Alternative to Matt Tin ?," 31st International Conference on Electronics Manufacturing and Technology, Kuala Lumpur, Malasia, Nov. 8-10, 2007, pp. 257-261.
Say, Wen C., and Chen, Chien Chon, "Formation of Tin Whiskers and Spheres on Anodic Aluminum Oxide Template," Japanese Journal of Applied Physics, vol. 46 no. 11, pp. 7577-7580, Nov. 6, 2007.
Field, Karen, "A Dog's RF Tag Fails - Is RoHS the Culprit?," Electronics Weekly , Nov. 5, 2007.
Kato, Takahiko, Akahoshi, Haruo, Nakamura, Masato; Hashimoto, Tomoaki, and Nishimura, Asao, "Effects of Minor Elements in Cu Leadframe on Whisker Initiation From Electrodeposited Sn/Cu Coating," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 4, pp. 258-269, Oct. 2007.
Kato, Takahiko, Akahoshi, Haruo, Terasaki, Takeshi, Iwasaki, Tomio, Nakamura, Masato, Hashimoto, Tomoaki, and Nishimura, Asao, "Whisker Initiation Behavior from Electrodeposited Sn/Cu Coating on Cu Leadframe," Materials Science Forum, vol. 561-565 part 3, pp. 1685-1688, Oct. 2007.
Sorensen, N. Rob, and Vianco, Paul, "The Sn Whisker Issue in High-Reliability Electronics," DoD Fusing Group Briefing, Oct. 30, 2007, pp. xx-xx. (Sandia Report SAND2007-7023C)
Sampson, Michael J., "The Development of a NASA Lead-Free Policy for Electronics," 20th JAXA Microelectronics Workshop, Tsukuba, Japan, Oct. 29, 2007, pp. xx-xx.
"Lead Free Electronics Impact on DoD Programs," DMSMS Conference 2007, Orlando, FL, Oct. 29, 2007, pp. xx-xx.
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Robertson, Jordan, 'Tin whiskers' imperil electronics, Yahoo! News, Oct. 8, 2007.
Robertson, Jordan, "'Tin Whiskers' ruin electronics, stoke debate over anti-lead regulations," Dayton Daily News, Oct. 7, 2007, pp. A29.
Robertson, Jordan, "Tiny 'tin whiskers' imperil electronics," USA Today, Oct. 7, 2007.
Yu, C. H., Kang, H. S., Kim, K. S., Han, S. W., and Yang, K. C., "Effects of Postbake on the Microstructure and Whisker Growth of Matte Sn Finish," 12th International Symposium on Advanced Packaging Materials , San Jose, CA, Oct. 3-5, 2007, pp. 158-164.
Lin, Y. W., and Kao, C. Robert, "Tin Whisker Growth Induced by High Electron Current Density," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 62-65.
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Woolley, Mark, and Choi, Jae, "The Effects of Tin Whisker Testing on Solder Connections," IPC Review , vol. 48 no. 8, pp. 6, Sept. 2007.
Tanaka, Toru, Kawaguchi, Hiroshi, Terao, Takashi, Babasaki, Tadatoshi, and Yamasaki, Mikio, "Modeling of Fuses for DC Power Supply Systems Including Arcing Time Analysis," 29th International Telecommunications Energy Conference , Rome, Italy, Sept. 30-Oct. 4, 2007, pp. 135-141.
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DeBeasi, Ryan, "Metal whiskers photo gallery," Network World, Aug. 27, 2007.
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Zhao, Fang, Wang, Qian, and Lee, Taekoo, "Characteristics of Tin Whisker Growth on Matte Tin Surface Finishes by Acceleration Conditions," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.
"iNEMI Tin Whisker Workshop," Tin World, no. 18, pp. 14, Early Summer 2007.
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Lin, Shih-kang, Yorikado, Yuhi, Jiang, Junxiang, Kim, Keun-Soo, Suganuma, Katsuaki, Chen, Sinn-wen, Tsujimoto, Masanobu, and Yanada, Isamu, "Mechanical deformation-induced Sn whiskers growth on electroplated films in the advanced flexible electronic packaging," Journal of Materials Research, vol. 22 no. 7, pp. 1975-1986, July 2007.
Rovner, Sophie L., "Coping With Whiskers: 'The Five Stages Of Metal Whisker Grief'," Chemical & Engineering News, vol. 85 no. 29, pp. xx-xx, July 16, 2007.
Rovner, Sophie L., "Stopping the Tin Whisker Stalkers," Chemical and Engineering News , vol. 85 no. 29, pp. 30-33, July 16, 2007.
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Subbarayan, Guhan, Kinyanjul, Robert, Tsai, Pei Fang Jenneifer, and Srihari, Krishnaswami, "Mechanical Reliability Evaluation of Stripped and Replated Component Termination Finishes," Proceedings of the ASME InterPack Conference, Volume 1, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 43-49.
Takeshita, Yuki, and Kimura, Yuji, "Generating Behavior of Whisker on Pb Free Sn Plating and Its Control," Proceedings of the ASME InterPack Conference, Volume 1, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 591-594.
Yang, Fuqian, "Analysis of the lattice diffusion-controlled growth of metallic whiskers," Journal of Physics D: Applied Physics, vol. 40 no. 13, pp. 4034-4038, July 7, 2007.
Asrar, Nausha, Vancauwenberghe, Oliver, and Prangere, Sebastien, "Tin Whiskers Formation on an Electronic Product: A Case Study," Journal of Failure Analysis and Prevention, vol. 7 no. 3, pp. 179-182, June 2007.
Liang, Jin, Xu, Zhi-Hui, and Li, Xiaodong, "Whisker nucleation in indentation residual stress field on tin plated component leads," Journal of Materials Science: Materials in Electronics , vol. 18 no. 6, pp. 599-604, June 2007.
Munson, Terry, "SAC Whiskers?," Circuits Assembly, vol. 18 no. 6, pp. 58, June 2007.
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Mathew, Sony, Osterman, Michael, Shibutani, Tadahiro, Yu, Qiang, and Pecht, Michael, "Tin Whiskers: How to Mitigate and Manage the Risks," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.
Subbarayan, Guhan, Kinyanjui, Robert, and Deutsch, Joel, "An Experimental Study of a Components Termination Finish Conversion Process: The Robotic Stripping and Solder Dipping Process," Successful Lead-Free/RoHS Strategies Conference 2007, Boxborough, MA, June 21, 2007, pp. xx-xx.
Hillman, Craig, Fischer, Gerd, and Esser, Robert, "Tin Whisker Risk Assessment Case Study," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.
Mathew, Sony, Osterman, Michael, and Pecht, Michael, "Evaluating Tin Whisker Mitigation Strategies: Conformal Coatings and Plating Technique," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.
Seelig, Karl, and Nishimura, Tetsuro, "A Unique Tin Whisker Growth Study of Nine Lead Free Alloys," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.
Shibutani, Tadahiro, Yu, Qiang, Shiratori, Masaki, and Pecht, Michael G., "Evaluation of Pressure-Induced Tin Whisker Formation," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.
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Chuang, Tung-Han, "Temperature Effects on the Whiskers in Rare-Earth Doped Sn-3Ag-0.5Cu-0.5Ce Solder Joints," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 38A no. 5, pp. 1048-1055, May 2007. https://doi.org/10.1007/s11661-007-9126-5
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Lee, Jeffrey C. B., Chen, P. C., and Tyan, C. G., "The Sn Whisker Growth Evolution of IC Packaging on the PC Board Assembly," 2007 Proceedings 57th Electronic Components & Technology Conference , Reno, NV, May 29-June 1, 2007, pp. 1964-1970.
Sobiech, M., Welzel, U., Schuster, R., Mittemeijer, E. J., Hugel, W., Seekamp, A., and Muller, V., "The Microstructure and State of Stress of Sn Thin Films after Post-Plating Annealing: An Explanation for the Suppression of Whisker Formation?," 2007 Proceedings 57th Electronic Components & Technology Conference , Reno, NV, May 29-June 1, 2007, pp. 192-197.
Handwerker, Carol, Pedigo, Aaron, Blendell, John, Williams, Maureen, Moon, Kil-Won, Stafford, Gery, Boettinger, Bill, Munson, Terry, Fritz, Denny, Latta, Gary, and Ganster, Andy, "Whisker to Hillock Transition: Stress Relaxation Mechanisms in Sn, Sn-Cu, and Sn-Pb Films," iNEMI Tin Whisker Workshop, Reno, NV, pp. xx-xx, May 29, 2007.
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Tyler, Donald, "Tin Whisker Mitigation Through Robotic Hot Solder Dip (RHSD)," 2007 Medical Electronics Symposium, Minneapolis, MN, May 1-3, 2007, pp. xx-xx.
Garich, H., Taylor, E. J., Sun, J., Panashchenko, L., Mathew, S., Osterman, M., and Pecht, M., "Evaluation of Faradayic Plating Method for Controlling Tin Whisker Growth," Proceedings of CALCE International Symposium on Tin Whiskers , College Park, MD, Apr. 24-25, 2007, pp. xx-xx.
Hillman, David, Margheim, Sue, and Straw, Eric, "The Use of Tin/Bismuth Plating for Tin Whisker Mitigation on Fabricated Mechanical Parts," 1st International Symposium on Tin Whiskers, College Park, MD, Apr. 24-25, 2007, pp. xx-xx.
Leidecker, Henning, and Brusse, Jay, "Metal Whiskering: Tin, Zinc, and Cadmium," Proceedings of CALCE International Symposium on Tin Whiskers, College Park, MD, Apr. 24-25, 2007, pp. xx-xx.
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Mason, Maribeth, and Eng, Genghmun, "Understanding Tin Plasmas: A New Approach to Tin Whisker Risk Assessment," Proceedings 45th Annual IEEE International Reliability Physics Symposium , Phoenix, AZ, Apr. 15-19, 2007, pp. 150-155.
Mason, Maribeth, and Eng, Genghmun, "Understanding Tin Plasmas: A New Approach to Tin Whisker Risk Assessment (presentation)," Proceedings 45th Annual IEEE International Reliability Physics Symposium, Phoenix, AZ, Apr. 15-19, 2007, pp. 150-155.
Hilty, Robert D., and Corman, Ned, "An Electrical Characterization of Tin Whisker Shorting," Materials Research Society Spring Meeting, San Francisco, CA, Apr. 9-13, 2007, pp. xx-xx.
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Chuang, Tung-Han, and Yen, Shiu-Fang, "Abnormal Tin Whisker Growth in Rare Earth Element-Doped Sn3Ag0.5CuXCe Solder Joints," Materials Science Forum, vol. 539-543 part 4, pp. 4019-4024, Mar. 2007.
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Osenbach, J. W., DeLucca, J. M., Potteiger, B. D., Amin, A., and Baiocchi, F. A., "Sn-whiskers: truths and myths," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 283-305, Mar. 2007.
Puttlitz, Karl J., and Galyon, George T., "Impact of the ROHS Directive on high-performance electronic systems Part II: key reliability issues preventing the implementation of lead-free solders," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 347-365, Mar. 2007.
Tu, K. N., Chen, Chih, and Wu, Albert T., "Stress analysis of spontaneous Sn whisker growth," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 269-281, Mar. 2007.
Williams, M. E., Moon, K.-W., Boettinger, W. J., Josell, D., and Deal, A. D., "Hillock and Whisker Growth on Sn and SnCu Electrodeposits on a Substrate Not Forming Interfacial Intermetallic Compounds," Journal of Electronic Materials, vol. 36 no. 3, pp. 214-219, Mar. 2007.
Zou, Ling, and Hunt, Chris, "Test Method for Conformal Coating Protection Performance of Electronic Assembly in Harsh Environments," NPL Report DEPC-MPR 060, Mar. 2007.
Hardin, Winn, "RoHS Part II: Lighten Up on Heavy Metals," Machine Vision Online, Mar. 27, 2007.
Aragon, Joseph, Wavrik, Richard, Vianco, Paul, Witham, John, and Bou, Jimmy, "Tin Whisker Mitigation Methods," 11th International Components for Military and Space Electronics Conference, Mar. 12-15, 2007, pp. xx-xx. (Sandia Report SAND2007-0400C)
Anderson, Richard A., "Reviewing RoHS Compliance For Harsh Environments," Microwaves & RF, vol. 46 no. 2, pp. 66, 68, 70, 72, 74, 76, 79-80, 82, 84, Feb. 2007.
Heffner, Tracy, "iNEMI Tin Whisker User Group Publishes Updated Set of Recommendations," Printed Circuit Design and Manufacture, vol. 24 no. 2, pp. 10, Feb. 2007.
Munson, Terry, "Metal Whiskers," Foresite, Feb. 28, 2007.
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NASA GSFC Experiments, Feb. 22, 2007.
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Chuang, T. H., Lin, H. J., and Chi, C. C., "Rapid growth of tin whiskers on the surface of Sn-6.6Lu alloy," Scripta Materialia, vol. 56 no. 1, pp. 45-48, Jan. 2007.
Frye, Asa, Galyon, George T., and Palmer, Larry, "Crystallographic Texture and Whiskers in Electrodeposited Tin Films," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 1, pp. 2-10, Jan. 2007.
Fukuda, Yuki, Osterman, Michael, and Pecht, Michael, "Length Distribution Analysis for Tin Whisker Growth," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 1, pp. 36-40, Jan. 2007.
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Osenbach, J. W., DeLucca, J. M., Potteiger, B. D., Amin, A., Shook, R. L., and Baiocchi, F. A., "Sn Corrosion and Its Influence on Whisker Growth," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 1, pp. 23-35, Jan. 2007.
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Barthelmes, Jurgen, Kuhlkamp, Peter, Lagorce-Broc, Florence, and Neoh, Din-Ghee, "Quantification of the influence of all important physical and chemical Tin plating bath parameters on the propensity for whisker formation," SEMICON Singapore 2006, Singapore, 2006, pp. xx-xx.
Chen, Keming, and Wilcox, Geoffrey D., "Tin-Manganese Alloy Electrodeposits: I. Electrodeposition and Microstructural Characterization," Journal of the Electrochemical Society, vol. 153 no. 9, pp. C634-C640, 2006.
Dittes, M., Oberndorff, P., Crema, P., and Su, P., "Tin Whisker Formation - A Stress Relieve Phenomenon," AIP Conference Proceedings, vol. 817, pp. 348-359, 2006. https://doi.org/10.1063/1.2173568
Fang, Tong, Osterman, Michael, Mathew, Sony, and Pecht, Michael, "Tin whisker risk assessment," Circuit World, vol. 32 no. 3, pp. 25-29, 2006.
Muraki, Taiji, Ohnishi, Chiaki, Ikedo, Kenshi, Udono, Naoyasu, Mori, Shigeru, Sugiura, Shinichi, and Watanabe, Hiromichi, "Development of lead free vehicle products," Fujitsu Ten Technical Journal, no. 26, pp. 42-48, 2006.
Tsuji, Kiyotaka, "Study on the Mechanism of Sn Whisker Growth Part I Relation between Whisker Growth and the Structure of Deposits," Journal of the Surface Finishing Society of Japan, vol. 57 no. 6, pp. 451-458, 2006.
Tsuji, Kiyotaka, "Study on the Mechanism of Sn Whisker Growth Part II Estimation of Excessive Energy & Its Origin," Journal of the Surface Finishing Society of Japan, vol. 57 no. 7, pp. 529-536, 2006.
Wen, Shixue, and Szpunar, Jerzy A., "Cathodic Potential Oscillations of Sn(II) Reduction and Hydrogen Evolution in Acid Stannous Sulfate Solutions," Journal of the Electrochemical Society , vol. 153 no. 3, pp. E45-E51, 2006.
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Zhang, Wan, and Schwager, Felix, "Effects of Lead on Tin Whisker Elimination," Journal of the Electrochemical Society, vol. 153 no. 5, pp. C337-C343, 2006.
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Chuang, Tung-Han, "Rapid whisker growth on the surface of Sn-3Ag-0.5Cu-1.0Ce solder joints," Scripta Materialia, vol. 55 no. 11, pp. 983-986, Dec. 2006.
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Roos, Gina, "iNEMI updates tin whisker guidelines," Industrial Control Design Line, Dec. 18, 2006.
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Lee, Chieh-Ju, and Reynolds, Heidi, "Tin Whisker Accelerated Test Project," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.
Iwane, Y., Morizono, Y., Ohno, Y., and Kuwano, N., "Behavior of Whisker Growth on Tin Plated Fe-42%Ni Substrates," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 150-153.
Sosiati, H., Kuwano, N., Hata, S., Iwane, Y., Morizono, Y., and Ohno, Y., "Tin Whisker Formation on a Lead-free Solder Alloy Studied by Transmission Electron Microscopy," 8th Electronics Packaging Technology Conference , Singapore, Dec. 6-8, 2006, pp. 398-403.
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Tsutsumi, Keisuke, Iwane, Yuicji, Morizono, Yasuhiro, Kozuka, Toshiyuki, and Ohno, Yasuhide, "Whisker Formation Behavior on Tin Film Plated in High Magnetic Field," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 722-725.
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Takeuchi, Makoto, Kamiyama, Kouichi, and Suganuma, Katsuaki, "Suppression of Tin Whisker Formation on Fine Pitch Connectors by Surface Roughening," Journal of Electronic Materials, vol. 35 no. 11, pp. 1918-1925, Nov. 2006.
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Morris Jr., J. W., "Lead-Free Solder Issues in MIcroelectronics," 15th Workshop on Crystalline Silicon Solar Cells and Modules: Materials and Processes, Vail, CO, Aug. 7-10, 2005, pp. 129-131.
Spiegel, Rob, "Serious Doubts Among Engineers on Tin Whisker Testing," Design News , Aug. 5, 2005.
"JEDEC, iNEMI Update Tin Whisker and Lead-Free Surface Finish Guidelines," CircuiTree, vol. 18 no. 7, pp. xx-xx, July 2005.
Deshmukh, Rajan, "Tin Whiskers and the Impending RoHS Conversion to Lead-Free," empfasis, pp. 1-2, July 2005.
Fjelstad, Joe, "Tin Whiskers = a lead-free 'time bomb'?," Global SMT & Packaging, vol. 5 no. 6, pp. 4, June/July 2005.
Fukuda, Yuki, and Osterman, Michael, "Tin Whiskers: What's the Risk?," Lead-free Electronics, July 2005.
Sakuyama, Seiki, and Kutami, Michinori, "Substitute Materials for Complete Elimination of Hazardous Substances - Study of Whisker Growth on Lead-Free Plating," Fujitsu Scientific and Technical Journal, vol. 41 no. 2, pp. 217-224, July 2005.
Rizzo, Sam, "Evaluating tin whiskers," Green SupplyLine, July 18, 2005.
Liang, Jin, Li, Xiaodong, Xu, Zhi-Hui, and Shangguan, Dongkai, "Indentation Induced Tin Whisker Formation on Tin Plated Component Leads," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B, San Francisco, CA, July 17-22, 2005, pp. 1199-1205.
"Leadfree Solder and Tin Whiskers Program Guidance (draft)," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.
Osterman, Michael, "CALCE Research on Risk Assessment, Mitigation, and Management for Pb-free Electronics," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.
Sampson, Michael J., "Lead-free from One NASA Perspective," Lead-free Summit, Philadelphia, PA, July 13, 2005, pp. xx-xx.
Daddona, Patricia, "Reactor Shutdown: Dominion Learns Big Lesson From A Tiny `tin Whisker'," The Day, July 4, 2005.
Yu, H. C., Liu, S. H., and Chen, Chih, "Study of electromigration in thin tin film using edge displacement method," Journal of Applied Physics, vol. 98 no. 1, pp. 013540-1-013540-4, July 1, 2005.
"Second ECTC iNEMI Tin Whisker Workshop," Components, Packaging, and Manufacturing Technology Society Newsletter, vol. 28 no. 2, pp. 8-9, June 2005.
Lee, Miky, Hillman, Craig, and Kim, Duksoo, "Industry News: How to predict failure mechanisms in LED and laser diodes," Military & Aerospace Electronics, vol. 16 no. 6, pp. xx-xx, June 2005.
Song, Jenn-Ming, Lui, Truan-Sheng, Chang, Yea-Luen, and Chen, Li-Hui, "Tin whiskers of bulk solders generated under resonance," Journal of Materials Research, vol. 20 no. 6, pp. 1385-1388, June 2005.
"Testing for Tin Whisker Mitigation," Design News, June 27, 2005.
Ice, G. E., Larson, B. C., Tischler, J. Z., Liu, W., and Yang, W., "X-ray microbeam measurements of subgrain stress distributions in polycrystalline materials," Materials Science and Engineering: A, Structural Materials, vol. 399 no. 1-2, pp. 43-48, June 15, 2005. https://doi.org/10.1016/j.msea.2005.02.035
Bush, Steve, "High temps, stresses cause whiskers," Electronics Weekly, June 13, 2005.
"Potential Tin Whiskers on Printed Circuit Board Components," Westinghouse Nuclear Tech Bulletin TB-05-4, June 8, 2005.
McCullen, Jack,and Gupta, Vivek, "Sn-Whisker Test Standards Correlation to Market Segment Use Conditions," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.
Zhang, Yun, "Can Thin Sn over Ni be an Answer to Tin Whiskers?," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.
Spiegel, Rob, "iNEMI Releases Tests to ID Tin Whisker Problems," Electronic News , June 6, 2005.
Spiegel, Rob, "Tests spot tin whisker problems," Electronics Weekly, June 6, 2005.
"JESD22A121, Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes," JEDEC Solid State Technology Association, May 2005.
"Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products," iNEMI Tin Whisker User Group, Version 3, May 2005.
Cho, Sungil, Yu, Jin, Kang, Sung K., and Shih, Da-Yuan, "Oxidation Study of Pure Tin and its Alloys via Electrochemical Reduction Analysis," Journal of Electronic Materials, vol. 34 no. 5, pp. 635-642, May 2005.
Hunt, Chris, "Predicting Tin Whisker Growth," Microelectronics News, no. 21, pp. 3, Spring 2005.
Ding, Min, Su, Peng, and Chopin, S., "Effects of Trim and Form on the Microstructure and Whisker Growth Propensity of Sn Finish," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 452-456.
Galyon, G. T., Xu, C., Lal, S., Notohardjono, B., and Palmer, L., "The Integrated Theory of Whisker Formation - A Stress Analysis," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 421-428.
Oberndorff, P., Dittes, M., Crema, P., and Chopin, S., "Whisker Formation on Matte Sn Influencing of High Humidity," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 429-433.
Su, Peng, Ding, Min, and Chopin, Sheila, "Effects of Reflow on the Microstructure and Whisker Growth Propensity of Sn Finish," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 434-440.
Zhao, Jie-Hua, Su, Peng, Ding, Min, Chopin, Sheila, and Ho, Paul S., "Microstructure-Based Stress Modeling of Tin Whisker Growth," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 137-144.
Norvell, Robin, "JEDEC, iNEMI Releases Help Scratch Tin Whiskers," Circuits Assembly , vol. 16 no. 6, pp. xx-xx, May 25, 2005.
Roos, Gina, "iNEMI releases standard for tin whisker testing, updates lead-free surface finish guidelines," Green SupplyLine, May 25, 2005.
"JEDEC Releases Standard for Tin Whisker Testing and iNEMI User Group Updates Lead-Free Surface Finish Guidelines," PCB007, May 24, 2005.
Kao, Hui-Ju, Effect of Cu additives on Sn whisker formation and interfacial reaction of Sn(Cu) finishes. Master's Thesis for National Central University, Jhong-Li, Taiwan, May 23, 2005.
Lead Finish Material Candidates and Pros/Cons (before May 17, 2005)
Tin Whisker Mitigation - Adding Lead to Chip Size Components with Pure-Tin Terminals (before May 17, 2005)
Perton, Marc, "Tin whisker" crisis threatens global electronic systems (before May 17, 2005)
Cassette, Dennis J., "Lead-Free Solder," Department of the Air Force Airworthiness Advisory AA-05-01, May 9, 2005.
Sob, M., Pokluda, J., Cerny, M., Sandera, P., and Vitek, V., "Theoretical Strength of Metals and Intermetallics from First Principles," Materials Science Forum, vol. 482, pp. 33-38, Apr. 2005.
Minter, Charlie, "Tin Whiskers: A New DMSMS Issue," DMSMS COE Newsletter, vol. 3 no. 3, pp. 3-4, Apr. 2005.
Tin Whiskers (Tech Tip #2) (before Apr. 30, 2005)
NASA Literature References, (before Apr. 24, 2005)
What are Tin Whiskers? (before Apr. 24, 2005)
Kadesch. Jong S., NASA Goddard Space Flight Center Effect of Uralane Conformal Coating on Tin Whisker Growth, Apr. 20, 2005.
NASA Goddard Space Flight Center Electromagnetic Relay Manufacturer Survey , Apr. 20, 2005.
NASA Goddard Space Flight Center Experiment #2 Photo Gallery, Apr. 20, 2005.
NASA Goddard Space Flight Center Experiment 3, Apr. 20, 2005.
NASA Goddard Space Flight Center Experiment 7: Matte Tin Plated IC Leadframe Examination, Apr. 20, 2005.
NASA Goddard Space Flight Center Re-emergence of an Old Problem with Potentially Catastrophic Consequences, Apr. 20, 2005.
NASA Goddard Space Flight Center Tin Whisker Photo, Apr. 20, 2005.
NASA Goddard Space Flight Center Tin Whisker Photo, Apr. 20, 2005.
Gupta, Vivek, and McCullen, Jack, "Correlation of Proposed Sn-Whisker Test Standards to Market Segment Use Conditions," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.
Hilty, Robert D., and Corman, Ned, "Tin Whisker Reliability Assessment by Monte Carlo Simulation," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.
Liang, J., Li, X., Xu, Z., and Shangguan, D., "Nano-indentation Study on Whisker Formation on Tin Plated Component Leads," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.
Woodrow, Thomas A., and Ledbury, Eugene A., "Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy," IPC/JEDEC 8th International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.
Woodrow, Thomas A., and Ledbury, Eugene A., "Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy (Presentation)," IPC/JEDEC 8th International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.
Testing for Tin Whisker Growth (before Apr. 16, 2005)
NASA Goddard Space Flight Center Experiment 1, (before Apr. 15, 2005)
NASA Experiment 2, (before Apr. 15, 2005)
NASA Goddard Space Flight Center Experiment 4, (before Apr. 15, 2005)
NASA Goddard Space Flight Center Experiment 5, (before Apr. 15, 2005)
NASA Goddard Space Flight Center Experiment 6: Simulation of Whisker Growth , (before Apr. 15, 2005)
NASA Goddard Space Flight Center GSFC Experiments (before Apr. 15, 2005)
"Tin Whiskers." (before Apr. 3, 2005)
"TW System Failures," NAVSEA, Apr. 3, 2005.
NASA Goddard Space Flight Center Photo of the Month, (before Apr. 2, 2005)
"Tin Whisker Workshop." (Apr. 2, 2005)
"Nickel-coated Components Solve Electrical Problem," Nickel, vol. 20 no. 2, pp. 5, Mar. 2005.
"Tin whiskers - reducing the risk," LiveWire, no. 15, pp. xx-xx, Feb./Mar. 2005.
Ice, G. E., Larson, B. C., Yang, W., Budai, J. D., Tischler, J. Z., Pang, J. W. L., Barabash, R. I., and Liu, W., "Polychromatic X-ray microdiffraction studies of mesoscale structure and dynamics," Journal of Synchrotron Radiation, vol. 12 no. 2, pp. 155-162, Mar. 2005.
Jobb, Dean, "Nickel-coating Solves Electrical Problem: Nickel offers a solution to trimming 'tin whiskers'," Nickel, vol. 20 no. 2, pp. xx-xx, Mar. 2005.
Spiegel, Rob, "Crying Wolf or Seeing Real Whiskers?," Avnet Advantage, Mar. 2005.
NASA Anecdote #1: 20 Years to Failure, (before Mar. 26, 2005)
NASA Anecdote #2: Tin Whiskers on Waveguide, (before Mar. 26, 2005)
NASA Anecdote #3: Field Failures Due to Tin Whiskers Breaking Loose from Matte Tin-Plated RF Enclosure Lids, (before Mar. 26, 2005)
NASA Anecdote #4- Tin Whiskers on Shield of GPS Units, (before Mar. 26, 2005)
NASA Anecdote #5: Field Failures Due to Tin Whiskers on Circuit Breaker Contacts, (before Mar. 26, 2005)
NASA Goddard Space Flight Center Basic Info/FAQ (before Mar. 26, 2005)
NASA Photo Gallery, (before Mar. 26, 2005)
NASA Photo of the Month Archives December 2003 Sn-Pb Whiskers, (before Mar. 26, 2005)
NASA Goddard Space Flight Center Specification Language Related to Pure Tin (before Mar. 26, 2005)
NASA Goddard Space Flight Center Summary of Specification Language for Pure Tin (before Mar. 26, 2005)
NASA Tin Whisker (and Other Metal Whisker) Homepage, (before Mar. 26, 2005)
NASA Whisker Failures, (before Mar. 26, 2005)
Bolin, Dick, and Bosze, Wayne, "RoHS and Tin Whisker Issues for Resistive Components," Proceedings of the 25th Symposium for Passive Components, Palm Springs, CA, Mar. 21-24, 2005, pp. 102-107.
"Tin wisker might delay RoHS schedule," Industry News, vol. xx no. xx, pp. xx-xx, Mar. 18, 2005.
Spiegel, Rob, "Threat of Tin Whiskers Haunts Rush to Lead-Free," Electronic News , Mar. 17, 2005.
Spiegel, Rob, "Tin whiskers haunt rush to Pb-free," Electronics Weekly, Mar. 17, 2005.
Klerk, Jacob, "Sn Plating and Whiskers," Mar. 9, 2005.
Bush, Steve, "Tin industry backs Pb-free reliability," Electronics Weekly, Mar. 2, 2005.
Rickett, B., Elmgren, P., Flowers, G., Gale, S., and Suhling, J., "Whisker Formation Potential in Pb-Free Electroplated Connector Finishes," Circuits Assembly, vol. 16 no. 2, pp. 52-59, Feb. 2005.
Schewe, Phillip F., "Physics Update," Physics Today, vol. 58 no. 2, pp. 9, Feb. 2005.
Welzel, U., Ligot, J., Lamparter, P., Vermeulen, A. C., and Mittemeijer, E. J., "Stress analysis of polycrystalline thin films and surface regions by X-ray diffraction," Journal of Applied Crystallography, vol. 38 no. 1, pp. 1-29, Feb. 2005.
Buetow, Mike, "HP, Sony Seek RoHS Exemptions," Feb. 28, 2005.
"HP says RoHS making whiskers problem worse," evertiq, Feb. 22, 2005.
Belmonte, Joe, and Apell, Marc, "Practical Pb Free Assembly," IPC APEX/EXPO 2005, Anaheim, CA, Feb. 22-24, 2005, (445 pages long).
Bush, Steve, "Tin whiskers brush with RoHS," Electronics Weekly, Feb. 18, 2005.
Chen, Keming, and Wilcox, Geoffrey D., "Observations of the Spontaneous Growth of Tin Whiskers on Tin-Manganese Alloy Electrodeposits," Physical Review Letters, vol. 94 no. 6, pp. 066104-1 to 066104-4, Feb. 18, 2005.
Williams, Alun, "Tin whiskers brush with RoHS," Electronics Weekly, Feb. 18, 2005.
Bush, Steve, "Tin whiskers have a brush with RoHS Directive over exemption," Electronics Weekly, Feb. 16, 2005.
Roos, Gina, "Trace Labs offers tin whisker testing," Green SupplyLine, Feb. 10, 2005.
"Will electronic equipment fail from tin-whisker shorts?," SourceESB, Feb. 9, 2005.
Tin Whiskers (before Feb. 2, 2005)
Schewe, Philip F., "Soft-metal whiskers," Physics Today, vol. 58 no. 2, pp. 9, Feb. 1, 2005. https://doi-org.ezproxy.uky.edu/10.1063/1.4796866
Arendt, N., Baron, F., Benz, V., Letterer, M., Merkle, H., Schroeder, S., and Wessling, B., "A New Whisker-Reducing Immersion Tin Technology," CircuiTree , vol. 18 no. 1, pp. 10, 12, 14, Jan. 2005.
Galyon, George T., and Palmer, L., "An Integrated Theory of Whisker Formation: The Physical Metallurgy of Whisker Formation and the Role of Internal Stress," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 17-40, Jan. 2005.
Galyon, George T., "Annotated Tin Whisker Bibliography and Anthology," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 94-122, Jan. 2005.
Hilty, Robert D., Corman, Ned, and Herrmann, Hank, "Electrostatic Fields and Current-Flow Impact on Whisker Growth," IEEE Transactions on Electronics Packaging Manufacturing, vol. 28 no. 1, pp. 75-84, Jan. 2005.
Lal, Sudarshan, and Moyer, Thomas D., "Role of Intrinsic Stresses in the Phenomena of Tin Whiskers in Electrical Connectors," IEEE Transactions on Electronics Packaging Manufacturing," ,vol. 28 no. 1, pp. 63-74, Jan. 2005.
Osenbach, John W., Shook, Richard L., Vaccaro, Brian T., Potteiger, Brian D., Amin, Ahmed N., Hooghan, K. N., Suratkar, P., and Ruengsinsub, P., "Sn Whiskers: Material, Design, Processing, and Post-Plate Reflow Effects and Development of an Overall Phenomenological Theory," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 36-62, Jan. 2005.
Sakamoto, Ichizo, "Whisker Test Methods of JEITA Whisker Growth Mechanism for Test Methods," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 10-16, Jan. 2005.
Vo, Nick, Kwoka, Mark, and Bush, Peter, "Tin Whisker Test Standardization," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 3-9, Jan. 2005.
Whiteman, Lee, "Lead Free Analytical Services," emphasis, pp. 4, 6, Jan. 2005.
Wickman, Martin, Fry, Tony, Gohil, Dipak, and Hunt, Chris, "Developing a Test Method to Characterise Internal Stress in Tin Coatings: Phase 2," NPL Report DEPC-MPR 014, Jan. 2005.
Xu, Chen, Zhang, Yun, Fan, Chonglun, and Abys, Joseph A., "Driving Force for the Formation of Sn Whiskers: Compressive Stress-- Pathways for Its Generation and Remedies for Its Elimination and Minimization," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 31-35, Jan. 2005.
Zhang, Wan, Egli, Andre, Schwager, Felix, and Brown, Neil, "Investigation of Sn-Cu Intermetallic Compounds by AFM: New Aspects of the Role of Intermetallic Compounds in Whisker Formation," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 85-93, Jan. 2005.
"Trace Laboratories-Central Announces Their New Tin Whisker Testing Program (iNEMI-Specified)," Trace Laboratories. Jan. 26, 2005.
Forno, Richard, "Tin Whiskers: The Next Y2K Problem?," Inforwarrior, Jan. 20, 2005.
Perton, Marc, "Tin whisker" crisis threatens global electronic systems Jan. 20, 2005.
"When Electronics Get Five O'Clock Shadow," Jan. 5, 2005.
"NEMI issues revised tin whisker test requirements," TIN World , no. 7, pp. 17, 2004.
"Suppression of Tin Whisker Growth through Optimized Tin Plating Chemistry Formulation Technistan EP," Technic. (2004)
Arai, Susumu, "Recent Status of Plating Technology for Lead-Free Soldering," Journal of The Surface Finishing Society of Japan, vol. 55 no. 9, pp. 576-581, 2004.
Moyer, Thomas D., "Designed Experiment to Determine the Reliability of Various Commercial Plating Baths and the Key Factors Affecting Whisker Formation," FCI, 2004.
Schroeder, Valeska, "HP experience with tin whisker inspection training," Hewlett-Packard, 2004.
Whitlaw, Keith, Egli, Andre, and Toben, Mike, "Preventing whiskers in electrodeposited tin for semiconductor lead frame applications," Circuit World, vol. 30 no. 2, pp. 20-24, 2004.
Tin Whiskers 2004.
Schetty, R., "Suppression of Tin Whisker Growth through Optimized Tin Plating Chemistry Formulation Technistan EP," Technic Inc, 2004.
Garrou, Phil, and Gedney, Ron, "Tin Whiskers: An Industry Perspective," Advanced Packaging, vol. 13 no. 12, pp. 14, Dec. 2004.
Amato, Ivan, "Tin Whiskers: The Next Y2K Problem?," Fortune, vol. xx no. xx, pp. xx-xx, Dec. 29, 2004.
Sriyarunya, Anocha, Tondtan, Jiraporn, and Bansal, Dhiraj, "Matte Tin (Sn) Plating: Whisker Growth Study," 2004 Electronics Packaging Technology Conference, Dec. 8-10, 2004, pp. 281-288.
Goldsmith, Steven, "Agere Confirms Mitigation of Tin Whiskers by Nickel," EMU, vol. 18 no. 11, pp. 6-8, Dec. 2004.
"Control of Whisker Growth in Tin Alloy Coatings," ST Microelectronics Application Note AN2035, Nov. 2004.
Cooke, Mike, "Shaving the whiskers for lead-free production," European Semiconductor, vol. xx no. xx, pp. xx-xx, Nov. 2004.
Galyon, George, Smetana, Joe, and Vo, Nick, "Cause of Tin Whiskers Remains Elusive," Lead-free Electronics , vol. xx no. xx, pp. xx-xx, Nov. 2004.
Galyon, George, Smetana, Joe, and Vo, Nick, "Cause of Tin Whiskers Remains Elusive," Advanced Packaging, vol. 13 no. Nov2004 Supplement, pp. 16-18, Nov. 2004.
Chason, Eric, Reinbold, Lucine, and Kumar, Sharvan, "Whisker Formation in Sn Coatings on Cu," Materials Research Society Symposium Proceedings Volume 851, Materials for Space Applications, Boston, MA, Nov. 29-Dec. 3, 2004, pp. 239-244.
"Whisker Woes," Air Safety Week, vol. 18 no. 45, pp. xx-xx, Nov. 22, 2004.
Verdi, Fred W., "Electroplated Tin and Tin Whiskers in Lead Free Electronics," Nov. 5, 2004.
"Shaving the whiskers for lead-free production," European Semiconductor, vol. 26 no. 11, pp. 17, Nov. 1, 2004.
Baliga, John, "Can Nickel Barriers Eliminate Tin Whiskers?," Semiconductor International, vol. 27 no. 12, pp. 38, Nov. 1, 2004.
Arendt, N., Baron, F., Benz, V., Letterer, M., Merkle, H., Schroeder, S., Wessling, B., "A Superior Whisker-Reducing Immersion Tin Technology," OnBoard Technology, vol. xx no. xx, pp. 30-32, Oct. 2004.
Hutchinson, Bevis, Oliver, James, Nylen, Margareta, and Hagstrom, Joacim, "Whisker Growth from Tin Coatings," Materials Science Forum, vol. 467-470, pp. 465-470, Oct. 2004.
"Whisker Formation on Tin Plated Cu based Leadframes: Results and Conclusions," Oct. 29, 2004.
"Whisker Formation on Tin Plated FeNi42: Results and Conclusions," Oct. 29, 2004.
Dittes, Marc, Oberndorff, Pascal, Crema, Paolo, and Chopin, Sheila, "A Two Step Approach for the Release of Lead Free Component Finishes with Respect to Whisker Risk," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.
Hugel, W., Kirchner, V., Keller, R., Schimitzek, R., Krinke, J., Guber, M., Welzel, U., and Mittemeijer, E. J., "Results from Detailed Investigations of the Propensity of Whisker Growth Under Different Conditions," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.
Jeong, Seyoung, Lee, Sung-Ki, Kim, Namseog, Yoshikuni, Nakadaira, Choi, Heekook, and Oh, Seyong, "Mitigation of Whisker by Reflow in Matte Sn Finished Alloy42 Lead Frame Package," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.
Letterer, Michael, "Whisker-Reducing Immersion Tin Technology," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.
Schetty, Rob, "Minimization of Tin Whisker Growth in Pb-Free Component Production Applications," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.
Xu, Chen, Zhang, Yun, Fan, Conglun, Walsh, E., and Abys, Joseph A., "An Innovative Whisker Reduction/Elimination Solution," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies , Frankfurt, Germany, Oct. 20-22, 2004.
"Elimination of Lead from Electrical and Electronic Equipment - the Dilemma of Tin-Whisker Growth," Eurocomp, no. 7, pp. 3-6, Autumn 2004.
Koyano, Hidekatsu, "Current Situation of Lead-Free Solder Plating and Prevention of Tin Whisker," Hyomen Gijutsu (Journal of the Surface Finishing Society of Japan) , vol. 55 no. 9, pp. 586-589, Sept. 2004.
Kuhlkamp, Peter "Bleifreie galvanische Beschichtung von elektronischen Bauteilen unter Vermeidung der Whiskerbildung," Galvanotechnik, vol. 95 no. 9, pp. 2119-2132, Sept. 2004.
Reed, Greg, "Test procedures needed for tin whisker failures," Test & Measurement World, vol. 24 no. 8, pp. A2, Sept. 2004.
Vardaman, E. Jan, "Tin Whiskers: An Old Problem Reappears," Circuits Assembly, vol. 15 no. 9, pp. 22-23, Sept. 2004.
Fukuda, Yuki, Fang, Tong, Pecht, Michael, and Osterman, Michael, "Effect of Heat Treatment on Tin Whisker Growth," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 717-723.
Galyon, George T., "A History of Tin Whisker Theory: 1946 to 2004." 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 696-706.
Osenbach, J. W., Shook, R. L., Vaccaro, B. T., Amin, A., Potteiger, B. D., and Hooghan, K. N., "Tin Whisker Mitigation: Application of Post Mold Nickel Underplate on Copper Based Lead Frames and Effects of Board Assembly Reflow," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 724-734.
Rickett, B., Elmgren, P., Flowers, G., Gale, S., and Suhling, J., "Potential for Whisker Formation in Lead-Free Electroplated Connector Finishes," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 707-716.
Tanaka, Toru, and Yamasaki, Mikio, "Modeling of Fuses for Melting Time and Fusing Current Analysis," 26th Annual International Telecommunications Energy Conference, Chicago, IL, Sept. 19-23, 2004, pp. 671-675.
"Tin Whiskers," Sept. 14, 2004.
Choi, Wanuk, Lee, Jeong Yong, Jung, Bok Hwan, and Lim, Hong Sup, "Microstructure and electrochemical properties of a nanometer-scale tin anode for lithium secondary batteries," Journal of Power Sources, vol. 136 no. 1, pp. 154-159, Sept. 10, 2004.
"NEMI issues revised tin whisker acceptance test requirements," emsnow, Sept. 6, 2004.
Roos, Gina, "NEMI revises tin whisker test requirements," Green SupplyLine , Sept. 2, 2004.
Roos, Gina, "NEMI revises tin whisker test requirements," eeProductCenter , Sept. 2, 2004.
Roos, Gina, "NEMI revises tin whisker test requirements," eeProductCenter , Sept. 2, 2004.
"The Facts about Tin Whiskers," Electronic Components, Assemblies & Materials Association, EIA/ECA-CB19, Aug. 2004.
"Tin Whisker Specs Defined," Metals and Interconnects, vol. 18 no. 7, pp. xx, Aug. 2004.
Galyon, G. T., and Gedney, Ron, "Avoiding Tin Whisker Reliability Problems," Circuits Assembly, vol. 15 no. 8, pp. 26-31, Aug. 2004.
Kushner, Arthur S., "Plating Clinic: Tin Whiskers Again," Products Finishing, vol. 68 no. 11, pp. 22-26, Aug. 2004.
Buetow, Mike, "NEMI Revises Tin Whisker Guidance," Circuits Assembly, vol. 15 no. 9, pp. xx-xx, Aug. 31, 2004.
Sampson, Michael J., and Leidecker, Henning, "NASA Goddard Space Flight Center Comments Regarding JEDEC Ballot JC-14-04-226," NASA, Aug. 31, 2004.
"NEMI Issues Revised Tin Whisker Acceptance Test Requirements," NEMI, Aug. 30, 2004.
"NEMI issues revised tin whisker acceptance test requirements," PCB007, Aug. 30, 2004.
Sriyarunya, Anocha, and Bansal, Dhiraj, "Matte Tin (Sn) Plating Of Semiconductor Devices - Whisker Growth Study," Proceedings of IPC/JEDEC 6th International Conference on Lead-Free Electronic Assemblies and Components, Singapore, Aug. 18-20, 2004, pp. xx-xx.
"New TWI proposed project: Tin Whiskers - reducing the risk," TWI LiveWire, issue 14, Summer 2004.
Song, J. Y., Yu, Jin, and Lee, T. Y., "Effects of reactive diffusion on stress evolution in Cu-Sn films," Scripta Materialia, vol. 51 no. 2, pp. 167-170, July 2004.
"The problem of 'tin whiskers' cannot be neglected," Dataweek , vol. xx no. xx, pp. xx-xx, July 28, 2004.
"Tin Whisker Acceptance Test Requirements," NEMI Tin Whisker Users Group, July 28, 2004.
Smetana, Joe, "NEMI Tin Whisker User Group," July 28, 2004.
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I would like to thank David Hillman for contributing to this study.
Please send critiques, corrections, and/or additions to
jrbarnes@iglou.com , or
by snailmail to:
John Barnes
216 Hillsboro Ave
Lexington, KY 40511-2105
Last revised February 5, 2021