Bibliography for Designing Lead-Free,
RoHS-Compliant, and WEEE-Compliant Electronics

This web site is being maintained by John R. Barnes, who was the President and Chief Engineer of dBi Corporation from 2002 to September 30, 2013, when we closed because ObamaCrap made it too expensive for us to remain in business.

John R. Barnes KS4GL, PE, NCE, NCT, ESDC Eng, ESDC Tech, PSE, Master EMC Design Engineer, SM IEEE
February 5, 2021
jrbarnes@iglou.com

This web page now has references to approximately 27,135 documents on lead-free electronics: As a follow-on to writing Robust Electronic Design Reference Book, Volumes I and II in 2003, in late 2004 I started seriously researching:

My plan was to write a Chapter 20.5 for my books, in the form of a web page that would be freely-available, summarizing the:

needed to manufacture RoHS-compliant electronic products-- and hopefully still have good quality, good reliability, and long lifetimes. The transition from tin/lead-based to lead-free electronics looked like it would be very painful and expensive. But I didn't think that the European Union would be so stupid as to issue legislation that would turn all electronics into crap!

In late 2012, 6 years after the RoHS Directive went into effect on July 1, 2006, manufacturers finally seemed to be approaching the quality level (good out-of-the-box) we had up through late 2005 with tin/lead-based electronics. But the reliability and longevity of RoHS-compliant electronics are still pitiful compared to what we had with tin/lead-based electronics. I've heard many stories of RoHS-compliant electronics, purchased new with 1-year warranties, that died after just 13 months of use. With a lot of searching, we sometimes can find new electronic products with 3-year manufacturers' warranties. But they are rare-- 90-day and 1-year manufacturers' warranties are much more common nowadays. And 4 out of the last 5 ADSL modems that I've gotten from the phone company all crapped out between 11 and 14 months after they were installed-- *one* lasted 25 months.

I had to change my Internet provider in October 2016. After making sure that the modem I've been using since June 21, 2016 worked with my new ISP, I bought it from my previous ISP as a used unit. And I bought two more of these (used) ADSL modems on Ebay for about $25 each. When this modem crapped out at 11-1/2 months, it took me just minutes to install a spare modem. But several critical parameters were hidden in low-level menus (and weren't documented in my notebook). So it took me a couple of hours with the old modem-- which was fully functional *except* for connecting to the Internet-- to get the spare ADSL modem working with my ISP. Basically, I had my Internet connection working again in one evening. And the very next day another one of these ADSL modems showed up on Ebay, so I bought it to get back to 2 spares for this RoHS-compliant product!

In the 16 years since I started this study in late 2004, I've:

doing research on these subjects, and collecting 27,000+ documents on lead-free electronics. My library on lead-free electronics now takes up over half of my office and has overflowed into two livingrooms, filling three bookcases and ten file cabinets with:

In this mass of material I have found tens of thousands of references to failure modes of lead-free solders, that were unknown or extremely rare in tin/lead solders:

The higher processing temperatures of lead-free solders, along with all of these new failure modes, have dramatically reduced the quality, reliability, and longevity of RoHS- compliant electronics-- produced since early 2006-- versus equivalent tin/lead- based electronics that were manufactured from about 1950 through 2005.

Based on my reading, and years of helping clients develop RoHS-compliant electronic products, I believe that: If you buy a lead-free RoHS-compliant electronic device-- and if it works when you first turn it on-- it should be safe and fully-functional for at least one year. If you are lucky, it may even last a couple of years longer... versus the 20+ years use that we can easily get out of many tin/lead-based electronic products!

For myself and my companies, in early 2005 I adopted the following version of the "Precautionary Principle", which so far has worked very well for me:

  1. Don't buy-- or fly in-- anything manufactured in Europe.
  2. Don't buy new electronic/electrical stuff, if you can find an older item (manufactured before 2006) that will do the job.
  3. If you buy a new, expensive electronic/electrical item, get the longest warranty that you can for it.
  4. If you buy a new, inexpensive electronic/electrical item, buy at least three, to give yourself a fighting chance that one of them will still work when you need it.
  5. If you are replacing an older, working unit, HANG ON TO THE OLD ONE!

Thus I have been very selective about buying any electrical or electronic stuff since year-end 2005. If I can find what I want as used, refurbished, or "new old stock" (NOS) on ebay or at a hamfest-- manufactured before 2006 (when the RoHS Directive went into effect)-- I feel comfortable just going ahead and buying it. If what I want is only available as new items, manufactured since the beginning of 2006, I do some hard thinking: Do I absolutely need this item? Will it pay for itself within the first three months that I will own it? Or do I just want the item? In many cases I'll say "Screw it. I'm not going to waste my money on lead-free crap". If I still really need the item, I will investigate various candidates based on the features/ functions/ etc. that are important to me, and sort the list by key factors to determine the desireability of each candidate. And if I discover that a candidate was designed or made in Europe, it automatically goes to the bottom of the list. Then I start working down through the list, top-to-bottom, checking for availability, sources, and prices. Once I have found three or so good candidates, I dig up all the information that I can find about them: specifications, datasheets, manuals, warranties, application notes, people's comments/ complaints about them, etc., If several candidates look like they will meet my needs, I usually make my final choice based on:

  1. A local store has the item-- so that they can take the unit out of the box in the store and prove to me that it will at least power up-- before I take it home.
  2. The longest manufacturer's warranty.

As a result, when I am considering buying some new electronic item, or something such as a car or appliance that contains electronics, I usually spend about 1 day doing research for every $100 that I expect to spend.

In July 2011 (5 years after the RoHS Directive went into effect), I made my first purchase of over $50 worth of RoHS-compliant electronics. I didn't want to, but when my 12-year old main computer monitor (a Sony Trinitron GDM-500PS) crapped out, I didn't have much choice. I first went to the public library, and checked Consumer Reports going back 3 years. Acer, Apple, Dell, Lenovo, and ViewSonic all had 2 or more wide-screen LCD monitors that were given high marks by Consumer Reports. Then I went around town, checking local stores to see which brands/models they carried. I then spent 4 days, researching some 50 models of >= 21-inch LCD monitors on the stores' and manufacturers' web sites. Comparing the features of the different models, the decisive factors for me came down to overall width, manufacturer's warranty period, and whether the monitor came with the video and monitor cables. I came down to a "short list" of 5 ViewSonic monitors, any one of which would meet my needs very well. Then I called the local stores, and found one which had several ViewSonic VX2450wm-LED monitors in stock. I bought two of them, with 3-year manufacturer's warranty, for $400 plus sales tax. It took me about an hour to get both monitors installed on my computer and working at 1920 x 1080 resolution (the primary monitor at 24-bit color and the secondary monitor at 16-bit color). So far, both monitors have been working okay for five years. But we shall see how they do long term for reliability and longevity...

Maybe 1% of the documents that I have collected on these subjects say "Lead is bad. Remove it at any cost." (I've seen estimates that complying with the RoHS Directive will cost between $40,000,000,000 and $100,000,000,000 worldwide, and will cause 5 to 6 times as much environmental damage as if it had not been enacted.) About half of the documents say "here are ways that we can try to comply with the RoHS Directive and its clones, by investing huge amounts of engineering and manufacturing time, money, and management focus." But the gist of the rest of the documents that I have collected is:

Manufacturers of lead-free/ RoHS-compliant electronics-- and their lawyers-- may want to carefully study Article 7 in the European Product Liability Directive ( Directive 85/374/EEC + Directive 1999/34/EC) which offers this defense: "The producer shall not be liable as a result of this Directive if he proves... (d) that the defect is due to compliance of the product with mandatory regulations issued by the public authorities... "

The RoHS Directive has been in place for 14 years now, and so far I haven't read about any big fires, airplane crashes, or other major disasters that have been traced to lead-free electronics. Although there is now considerable evidence pointing to tin whiskers causing some of the Sudden Unintended Accelleration (SUA) problems with Toyota vehicles....

Technology Forecasters did a study in late 2007/early 2008 for the Consumer Electronics Association (CEA) on "Economic Impact of the European Union RoHS Directive on the Electronics Industry". Page 48 of this report, which came out January 21, 2008, said that in its first 1-1/2 years the RoHS Directive had cost the worldwide electronics industry $38.25 billion ($38,250,000,000), with an on-going cost of $3.7 billion ($3,700,000,000) per year!

Personally, since the RoHS Directive went into effect, I've restricted myself to buying maybe two or three pieces of new test equipment or computer stuff that costs more than $20 each per year. But I only do so if I expect the item to pay for itself within 3 months. I also treat all new electronics very tenderly, and try not to drop them onto any hard surfaces. If this new equipment is AC powered, I only plug it into a live outlet when I or someone else is around. If it is battery powered, I take out the batteries whenever the new electronic equipment is not in use. (These precautions play hell with clocks, by the way.) If the item costs less than $20, I'll probably buy three or more, to have a fighting chance that at least one unit will work when I need it.

Early in my study, I decided to pull this information together as a web page, to make it:

I figured that this should be a one-month project. But one week later I moved this bibliography into its own web page, because it was 15 pages long, and I figured it would be of interest only to really serious researchers... Well, this bibliography is now 1,961 pages long. I've spent thousands of hours searching the Internet, and joined four more technical societies to get access to their online databases. So far on this project, I've made 438 trips to 11 libraries in Kentucky, and 193 trips to 85 science/ engineering libraries in 25 other states (Alabama, Arkansas, California, Colorado, Florida, Georgia, Hawaii, Illinois, Indiana, Iowa, Kansas, Massachusetts, Michigan, Missouri, Montana, Nebraska, North Carolina, Ohio, Oklahoma, Oregon, Pennsylvania, Tennessee, Texas, Utah, and Washington) and one province (Ontario), For example, the following picture shows some 330+ papers (13,697 through 14,028) that I collected on 6 trips in three weeks to libraries in Kentucky, Tennessee, and Georgia...

In January 2016 I became a Donovan Scholar, and started taking classes at the University of Kentucky (UK). Then UK moved the Engineering Library from Anderson Tower, making it much less convenient for me to stop in the library before/between classes. But as a UK student I have online access to the UK libraries from home. Before the COVID-19 lockdown of 2020, I would spend 4 to 8 evenings per month checking 128 to 221 magazines/ journals and the proceedings of 136 to 200 conferences/ symposiums for the latest information on:

During the COVID-19 lockdown, I've been working on my studies via the Internet, usually spending about 6 days per week on them. And in the last 9 months (mid-May 2020 to February 2021) I've found over 1,863 additional documents on tin whiskers, tin pest, and other aspects of lead-free electronics. At least this project has kept me from going stir crazy with boredom!

This bibliography now has:

I started the research in my personal and company libraries, and on the Internet with my own computer, using: When I check out a new library, in addition to searching through their collection, I like to see if they have any full-text engineering/ science databases such as: I'm still hunting for hundreds of papers and magazine articles whose titles have popped up during my searches, but that I haven't been able to find yet. If you have leads on any of these, please E-mail me at jrbarnes@iglou.com, and I will acknowledge your help at the bottom of this web page.

If a reference can be downloaded from the Internet for free, I've included a link from its title to the appropriate web page. Some web sites require you to register online before accessing some of their documents. If a book, CDROM, paper, or report is in print, I show the list price and include a link to at least one source. Even if an item is out of print, you might be able to buy it from one of the sources listed on my web page Internet Sources for Electronics Books, Standards, Manuals, Journals, and Magazines.

My web page, Designing Lead-Free, RoHS-Compliant, and WEEE-Compliant Electronics, where I started to summarize this huge mass of data, is 55 pages long-- with only 4 out of 20 sections reasonably complete. Like my books, both of these web pages are primarily aimed at electrical and electronic engineers who design and develop electronic products and electronic equipment for a living. We face more challenges than ever before:

I try to update this web page once each quarter. Please send any critiques, corrections, and pointers to additional sources to me at jrbarnes@iglou.com.

Government Regulations on Lead-Free, RoHS, and WEEE (revised 9/11/2011)

The United States (US) passed the Toxic Substances Control Act in 1976, giving the Environmental Protection Agency (EPA) the power to regulate the manufacturing and importing of toxic substances into the US.

The European Union has very strict laws on product liability. In general, if a person can prove that someone was killed or injured-- or their property was damaged-- by a product, the "producer" must fully compensate the injured party. Even if the producer had only a tiny fraction of the overall responsibility for the injury! Underlaying numerous Product Safety Directives (EN 60950, EN 60065, EN 61010, and EN 60601-1-2 to name just a few) is the Product Liability Directive ( 85/374/EEC), which was published in volume 28 issue L210 pages 29-33 of the Official Journal of the European Union (OJ) on August 7, 1985.

This Directive was amended by Directive 1999/34/EC in volume 42 issue L141 pages 20-21 of the OJ on June 4, 1999. The consolidated text of these two Directives is available on the EUR-Lex website. One defense that the producer (manufacturer, importer, or the person whose name or trade mark is on the product) can use is in Article 7: "The producer shall not be liable as a result of this Directive if he proves... (d) that the defect is due to compliance of the product with mandatory regulations issued by the public authorities... "

Japan passed the Act on the Promotion of Effective Utilization of Resources Act No. 48 of 1991 (Japan "RoHS") in 2000.

The European Union published the End of Life Vehicles Directive (ELV Directive, 2000/53/EC) in volume 43 issue L269 pages 34-42 of the Official Journal of the European Union (OJ) on October 21, 2000, and has amended it a number of times since then, This Directive took effect on July 1, 2002, and with some exceptions (Annex II), totally bans the use of (Article 4.2(a)):

in vehicles. The Department of Trade and Industry (DTI) in the United Kingdom has gotten the impurity limits for the ELV Directive also to be applied to the RoHS Directive.

The European Union published the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Directive ( RoHS Directive, 2002/95/EC) in volume 46 issue L37 pages 19-23 of the Official Journal of the European Union (OJ) on February 13, 2003. This Directive took effect on July 1, 2006, and with some exceptions (Annex) totally bans the use of (Article 4.1):

in electronic and electrical products and equipment.

Article 2.3 explicitly states that spare parts for the repair of electrical and electronic equipment put on the market before July 1, 2006 do not fall under the RoHS Directive. Nor does the reuse of electrical and electronic equipment put on the market before July 1, 2006. I.e., the electrical equipment is already in the European Union, and out of the manufacturer's control as of July 1, 2006. Owners of equipment acquired before this date may repair or upgrade their equipment, to extend its lifetime, instead of being forced to discard it.

Council Decision COM(2004) 606, adopted Sept. 23, 2004), amends the Annex of the RoHS Directive to permit-- in any application that was not already exempted--a homogenous material to contain a maximum of:

The RoHS Directive was amended 12 times between 2005 and 2010 by Commission Decisions, and once by a Directive, mainly adding exemptions for specific uses of these materials.

The European Union published the RoHS Recast (RoHS 2.0), Directive 2011/65/EU in volume 54 issue L174 pages 88-110 of the Official Journal of the European Union (OJ) on July 1, 2011. It takes effect on January 3, 2013, and brings in:

To help manufacturers, importers, and others understand their responsibilities, risks, and liabilities under European Directives, in 2000 the European Commission published the "Guide to the Implementation of Directives Based on New Approach and Global Approach". This is commonly called the "Blue Book", or "Blue Guide", and can help you understand just how European authorities will interpret these Directives when it is unclear whether/how a Directive applies to a specific product or situation.

The DTI has published a draft of the United Kingdom's version of the RoHS Directive as "Part IV - The RoHS Directive - draft implementing Regulations."

The official version of the UK law came out as Statutory Instrument 2006 No. 1463,

The DTI has also published draft Guidance Notes for the RoHS Directive, dated July 2004.

A revised draft RoHS REGULATIONS Government Guidance Notes came out in August 2005.

The final RoHS REGULATIONS Government Guidance Notes came out in November 2005.

The DTI published the RoHS Enforcement Guidance Document, Version 1 in May 2006.

The European Union published the Waste Electrical and Electronic Equipment Directive (WEEE Directive, 2002/96/EC) in volume 46 issue L37 pages 24-38 of the Official Journal of the European Union (OJ) on February 13, 2003. Directive 2003/108/EC, published in volume 46 issue L345 pages 106-107 of the OJ on December 31, 2003, amends Article 9 of the WEEE Directive with regard to the financing of WEEE for businesses. The WEEE Directive:

The DTI has published a draft of the United Kingdom's version of the WEEE Directive as "Part II - The WEEE Directive - draft implementing Regulations."

The DTI has also published draft Guidance Notes for the WEEE Directive, dated July 2004. According to these Guidance Notes, producers must register with the (UK) National Clearing House by August 13, 2005 (pages 4, 20-21).

Commission Decision 2004/249/EC is a questionaire for Member States of the EU, on reporting the implementation of the WEEE Directive.

Commision Decision 2005/369/EC on rules for Member States to monitor compliance with the WEEE Directive.

The European Union also bans many flame retardants that might be used in printed circuit boards (PCB's) under the Restrictions on the Marketing and Use of Certain Dangerous Substances and Preparations Directive (Directive 76/769/EEC) which has been amended 39 times since it was published in the Official Journal of the European Union (OJ) on September 27, 1976.

The European Union published the Batteries and Accumulators Containing Certain Dangerous Substances Directive (Battery Directive, 91/157/EEC) in volume xx issue L78 pages 38-41 of the Official Journal of the European Union (OJ) on March 26, 1991. Directive 98/101/EC, published in volume 42 issue L1 pages 1-2 of the OJ on January 5, 1999, clarifies the limitations on mercury in batteries. The Battery Directive permits lead-acid and nickel-cadmium batteries to be used in electrical and electronic equipment as long as they contain less than 0.0005% by weight of mercury. Button cells and batteries made from button cells are permitted to contain up to 2% mercury by weight (Article 3.1).

The European Union published the Energy-using Products (EuP) Directive (EuP Directive, 2005/32/EC) in Volume 48 issue L191 pages 29-58 of the Official Journal of the European Union (OJ) on July 22, 2005. This Directive took effect on August 11, 2005. It sets up a framework for regulating products that:

A major concern is the total energy required:

The European Union published a new Batteries and accumulators and waste batteries and accumulators (new Batteries Directive, 2006/66/EC) in volume 49 issue L266 pages 1-14 of the Official Journal of the European Union (OJ) on September 26, 2006. This Directive takes effect on September 26, 2009. Article 4 places limits on the mercury (Hg) and cadmium (Cd) content of batteries, but most of the Directive is concerned with collecting and recycling.

China's Ministry of Information Industry has drafted a Management Methods for the Prevention and Control of Pollutants from Electronic Information Products law, often referred to as "China RoHS ". This law also bans:

in products using electronic information technology.

Grace Lin's web site has an unofficial translation of "Administrative Measure on the Control of Pollution Caused by Electronic Information Products," dated Mar. 2, 2006.

China RoHS actually consists of several interconnected laws: "Measures for Administration of the Pollution Control of Electronic Information Products," May 9, 2006.

Another unofficial translation by the AeA is Management Methods for Controlling Pollution by Electronic Information Products."

"Electronic Information Products Classification and Explanations," Mar. 16, 2006.

"General Rule of Environment-Friendly Use Period of Electronic Information Products, Draft,"

"Marking for Control of Pollution Caused by Electronic Information Products," Nov. 6, 2006.

"Packaging Recycling Marks," Jan. 1, 2002.

"Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products," Nov. 6, 2006.

"Testing Methods for Regulated Substances in Electronic Information Products, Draft,"

California passed Proposition 65, the Safe Drinking Water and Toxic Enforcement Act of 1986 in 1986. This act affects companies who:

Electrical/electronic products which are handled frequently, such as portable stereos and hair dryers, may require a warning label on units sold in California. The concern is trace amounts of listed chemicals, such as lead or cadmium, in the power cord or housing. If users handle the unit, then eat without washing their hands, they could ingest some of the chemical(s). If the total exposure to any listed chemical exceeds 0.1% of the amount that could have an "observable effect", then the manufacturer can be fined $2,500 per day per violation. Needless to say, some lawyers and law firms in California have found filing Proposition 65 lawsuits to be extremely profitable...

California adopted Senate Bill No. 20 (SB20) on September 25, 2003, banning the use of certain materials in some types of electronic equipment, and setting up a system for the collection and recycling of certain types of electronic waste.

California adopted Senate Bill No. 50 (SB50) on September 29, 2003, amending SB20 in a number of areas, but the combination is usually still referred to as "SB20". SB20 and SB50 create a number of bureaucratic hurdles and snares for anyone who sells-- or wants to sell-- video display devices with screens larger than 4 inches diagonal (with some exceptions, SB50, pages 9, 11; SB20, page 9) to consumers in California:

California Legal Council's digest of SB20, on page 6, 25214.10 says "The department shall adopt regulations ... that prohibit an electronic device from being sold or offered for sale in this state (my italics) if the electronic device is prohibited from being sold or offered for sale in the European Union ... to the extent that Directive 2002/95/EC ... prohibits that sale due to the presence of certain heavy metals". On page 13, 42474(c) says "Civil liability in an amount of up to twenty-five thousand dollars ($25,000) may be administratively imposed by the board against manufacturers for failure to comply with this chapter...".

California Legal Council's digest of SB50, on page 2, (3) says "The act requires each manufacturer of an electronic device who sells a covered electronic device in this state to submit an annual report to the board on the number of electronic devices sold by the manufacturer". On page 6, 25214.10.1 specifies the information that a manufacturer must suppy to retailers and the State Board of Equalization. On page 9, 42463(f) defines the "covered electronic devices". On page 10, 42463(n) defines "manufacturer". On page 11, 42463(t) defines "video display device". On pages 11 and 12, 42464.6(a) gives the Department of Toxic Substances Control the authority to determine what is, or is not, a "covered electronic device". On pages 13 and 14, 42465.2 specifies the information that the manufacturer must supply to the California Integrated Waste Management Board, consumers, and the Department of Toxic Substances Control.

For the actual implementation of SB20 and SB50, California's Health and Safety Code Section 25214.9-25214.10.2, under 25214.10(a) effectively bans lead, cadmium, mercury, and hexavalent chromium in "covered electronic devices" to the limits permitted by the RoHS Directive by January 1, 2007, or the effective date of the RoHS Directive, whichever comes later.

Furthermore, California's Public Resources Code Section 42463, 42463(f) defines "covered electronic device", 42463(n) defines "manufacturer", and 42463(t) defines "video display device".

California's actual regulations implementing SB20 and SB50 are in Emergency Regulations. 18660.5(23) has this snare for manufacturers-- "These catagories include, but are not limited to, (my italics) ...". 18660.41 specifies information that manufacturers must report to the California Integrated Waste Management Board, while 18660.42 specifies information that manufacturers must provide to consumers.

Washington passed Engrossed Substitute House Bill 2488 (EGHB2488) on March 29, 2004 to establish a statewide recycling system for waste electronics.

Maine adopted LD 743 (amended by HP 549) on May 14, 2003. This law bans disposal of CRT's in landfills after January 1, 2006.

In late 2005/ early 2006 Maine adopted an electronic waste law under 38 MRSA Section 1610 to establish a statewide recycling system for waste electronics.

Massachusetts, under 310 CMR 19 paragraph 19.017(3)(c), has not permitted cathode ray tubes (CRT's) to be deposited in landfills, or incinerated, since April 1, 2000.

Minnesota adopted H.F. No. 882 in 2003. This law bans disposal of CRT's in landfills after July 1, 2005.

Maryland adopted House Bill 575 on May 10, 2005. This law requires computer manufacturers that manufactured more than 1,000 computers per year, averaged over the last three years, to register with the (Maryland) Department of the Environment if they wish to sell new computers in the state after December 31, 2005. The initial registration fee is $5,000. The registration fee then drops to $500 per year if the manufacturer has implemented a "computer takeback program". Otherwise the registration fee continues at $5,000 per year. This law will expire December 31, 2010 unless it is renewed by the legislature.

Magazines/Newsletters on Lead-Free, RoHS, and WEEE (revised 3/29/2005)

Advanced Packaging

circuitnet

CircuitTree

Circuits Assembly

Electronics Manufacture and Test

ElectronicsWeekly

Global SMT & Packaging

Journal of Electronic Materials

LEAD-FREE Connection $195/year, published quarterly.

Lead-Free Magazine

New Electronics

Soldering & Surface Mount Technology

Surface Mount Technology

Mailing Lists on Lead-Free, RoHS, and WEEE (revised 5/27/2009)

Halogenfree mailing list for subscription; also see IPC Halogenfree Archives

Leadfree mailing list for subscription; also see IPC LeadFree Archives

NoLeadTech mailing list for subscription; also see IPC NoLeadTech Archives

RoHS for subscription

Tin Whiskers mailing list

Web Sites on Lead-Free, RoHS, and WEEE (revised 5/27/2009)

AIM Lead free

Database for Solder Properties with Emphasis on New Lead-free Solders Release 4.0

Dionics

E3/E4 Initiative

EC Directive on Waste Electrical and Electronic Equipment (WEEE) and EC Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS)

Eco-Info & Lead (Pb)-Free: Lead (Pb)-Free Solutions from Texas Instruments

Electronics Manufacturing Productivity Facility

Electronics Weekly

elfnet

eRecycle.org

Green SupplyLine

HDP User Group

Infopool - On-line Information Resource about Lead-free Solders and Technologies

International Conference on Lead Free Electronics "Towards implementation of the RHS Directive"

International National Electronics Manufacturing Initiative (iNEMI)

IPC Halogenfree Archives

IPC LeadFree Archives

IPC LoLeadTech Archives

Lead-free & RoHS Directive compliance services

Lead-Free Electronics

Lead-Free Forum

Lead-Free Information

Lead-Free Magazine

Lead-Free Solder Testing for High Reliability (Project 1)

Lead-Free Solutions: Making Lead-Free a Reality Today

leadfreesoldering.com

Materials Technology @ TMS

NASA-DOD Lead-Free Electronics (Project 2)

NASA Goddard Space Flight Center Tin Whisker (and Other Metal Whisker) Homepage

National Electronics Manufacturing Initiative (NEMI)

National Metal Finishing Resource Center

National Physical Laboratory

News on Lead-free

Pb-Free

PCB Update

Printed Wiring Board Resource Center

RoHS

RoHS-International

RoHS Simplified (Department of Trade and Industry).

SMART Group

Speedline Technologies White Papers

Texas Instruments Quality & Pb-Free

Toxics Use Reduction Institute

WEEE Forum

WEEE recycling Network

WEICHLOETEN.de

www.envirowise.gov.uk

www.SMTinfo.net

Books on Lead-Free, RoHS, and WEEE (revised 10/28/2020)

10th Report on Carcinogens. U. S. Department of Health and Human Services, 2002.

ASM Engineered Materials Reference Book. Metals Park, OH: ASM International, 1989. ISBN 0-87170-350-5.

Electronic Materials Handbook, Volume 1: Packaging. Materials Park, OH: ASM International, 1989. ISBN 0-87170-285-1. $140.00 list price.

Equilibrium Data for Tin Alloys. Greenford, Middlesex, UK: Tin Reasearch Institute, 1949.

Handbook of Aluminum, 3rd Edition. St. Louis, MO: Metal Goods Service Centers.

Materials Used for Brazing Welding, Soldering Arc Cutting, and Metallizing. Department of the Army Technical Manual TM 9-237/1. Department of the Air Force Technical Order TO 34W4-1-10. May 1960.

Metal Statistics 1998, Nonferrous Edition, 90th Edition. New York: Cahners, 1998. $95.00 list price.

Metals Handbook, 1939 Edition. Cleveland, OH: American Society for Metals, 1939.

Metals Handbook, 9th Edition, Volume 2: Properties and Selection: Nonferrous Alloys and Pure Metals. Metals Park, OH: American Society for Metals, 1979.

NIOSH Pocket Guide to Chemical Hazards. Kutztown, PA: Hazardous Materials Publishing, 1994.

Rational Use of Potentially Scarce Metals. Brussels, Belgium: NATO Scientic Affairs Division, 1976.

Solder Alloy Data: Mechanical properties of solders and soldered joints. International Tin Research Institute, 1986 (I.T.R.I. Publication No. 656).

Soldering Manual. New York: American Welding Society, 1959.

The Lead Free Electronics Manhattan Project - Phase I. ACI Technologies, July 30, 2009.

The Lead Free Electronics Manhattan Project - Phase II. The Benchmarking and Best Practices Center of Excellence, May 31, 2010.

The Mechanism of Phase Transformation in Metals. London: The Institute of Metals, 1956.

The New Quick Pocket Reference for Tin-Lead and Lead-Free Solder Assembly. Cranston, RI: AIM, 2008.

The Properties of Tin. Greenford, Middlesex, England: Tin Research Institute, 1954.

The Quick Pocket Reference for Solder Assembly. Cranston, RI: AIM, 2000.

The Quick Pocket Reference for Tin-Lead and Lead-Free Solder Assembly. Cranston, RI: AIM, 2008.

Soldering Manual. New York: American Welding Society, 1959. pp. 52.

The Welding, Brazing, and Soldering of Copper & Its Alloys . Radlett, Herts.: Copper Development Association, 1952.

Abbott, David, Inorganic Chemistry. London: Mills & Boon, 1965.

Addison, W. E., The Allotropy of the Elements. London: Oldbourne Press, 1964.

Allen, B. M., Soldering and Welding. New York: Drake, 1975.

Andrae, A. S. G., Global Life Cycle Impact Assessments of Material Shifts: The Example of a Lead-free Electronics Industry. London: Springer, 2010. ISBN 978-1-84882-660-1. $129.00 list price.

Andrews, D. R., Soldering Brazing Welding and Adhesives. The Institution of Production Engineers, 1978.

Antler, Morton, Contact Technology for Electronic Connectors. (lecture notes for a class given at Lexmark International on May 15-16, 1996).

Aristotle (translated by Dowdall, L. D.), The Works of Aristotle Translated into English: de Mirabilibus Auscultationibus. Oxford: Clarendon Press, 1909. pp. 834 (chapter 50, page 27 of the .pdf file).

Avner, Sidney H., Introduction to Physical Metallurgy. New York: McGraw-Hill, 1964.

Bakoglu, H. B., Circuits, Interconnections, and Packaging for VLSI. New York: Addison-Wesley, 1990. ISBN 0-201-06008-6.

Barber, Clifford L., Solder... its fundamentals and usage, 2nd Edition. Kester Solder, 1961.

Barnes, John R., Robust Electronic Design Reference Book, Volumes 1 and 2. Boston, MA: Kluwer Academic Publishers, 2004. ISBN 1-4020-7739-4. $430.00 list price. This web page and its companion web page Designing Lead-Free, RoHS-Compliant, and WEEE-Compliant Electronics supplement these two books, and when completed may be considered as Chapter 20.5 in Volume 1.

Barrett, C. S., and Massalski, T. B., Structure of Metals: Crystallographic Methods, Principles and Data . New York: Pergamon, 1980.

Barrett, Charles S., Structure of Metals: Crystallographic Methods, Principles, and Data . New York: McGraw-Hill, 1943.

Barry, B. T. K., and Thwaites, C. J., Tin and Its Alloys and Compounds. New York: Halsted Press, 1983.

Bath, Jasbir, Lead-Free Soldering. New York: Springer, 2007. ISBN 978-0-387-32466-1. $129.00 list price.

Beaty, H. Wayne, Electrical Engineering Materials Reference Guide. New York: McGraw-Hill, 1990. ISBN 0-07-004196-2.

Bell Telephone Laboratories, Physical Design of Electronic Systems: Volume II Materials Technology . Englewood Cliffs, NJ: Prentice-Hall, 1970. ISBN 13-666362-1.

Berger, Melvin, Hazardous Substances: A Reference. Hillside, NJ: Enslow Publishers, 1986. ISBN 0-89490-116-8.

Best, Joel, Flavor of the Month: Why Smart People Fall for Fads. Berkeley, CA: University of California Press, 2006. ISBN 0-520-23626-8. $19.95 list price.

Billatos, Samir B., and Basaly, Nadia A., Green Technology and Design for the Environment. Washington, D. C.: Taylor & Francis, 1997. ISBN 1-56032-460-0. $93.42 list price.

Boyer, Howard E., and Gall, Timothy L,, Metals Handbook: Desk Edition. Metals Park, OH: American Society for Metals, 1985. ISBN 0-87170-188-X.

Bradley, Edwin, Handwerker, Carol A., Bath, Jasbir, Parker, Richard D., and Gedney, Ronald W., Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing . Hoboken, NJ: John Wiley & Sons, 2007. ISBN 978-0-471-44887-7. $99.95 list price.

Brandes, Eric A., Smithell's Metals Reference Book. Boston, MA: Butterworths, 1983. ISBN 0-408-71053-5.

Brandes, E. A., and Brook, G. B., Smithells Metals Reference Book, 7th Edition. Woburn, MA: Elsevier Butterworth-Heinemann, 1998. ISBN 0750636246.

Brick, R. M., and Phillips, Arthur, Structure and Property of Alloys. New York: McGraw-Hill, 1949.

Burns, R. M., and Bradley, W. W., Protective Coatings for Metals, 3rd Edition. New York: Reinhold Publishing, 1967.

Buschow, K. H. J., Cahn, Robert, Flemings, Merton C., Ilschner, Bernhard, Kramer, Edward J., Mahajan, Subhash, and Veyssiere, Patrick, Encyclopedia of Materials: Science and Technology, Volume 10. (Katz, J. D., "Whiskers," pp. 9570-9574.) Pergamon, 2001. ISBN 0080431526. $7,295.00 list price.

Cahn, Robert W. and Haansen, Peter, Physical Metallurgy, 4th Edition, Volume 1. New York: Elsevier North Holland, 1996. ISBN 0444898751. $995.00 list price for 3-volume set.

Cain, Tubal, Soldering and Brazing. Poole, Dorset, United Kingdom: Special Interest Model Books, 2003.

Cairns, J. H., and Gilbert, P. T., The Technology of Heavy Non-Ferrous Metals and Alloys. London: George Newnes, 1967.

Callenberg, Mona, Tenntradsbroderier. Vasteras, Sweden: ICA bokforlag, 1997. ISBN 91-534-1816-6.

Capillo, Carmen, Surface Mount Technology. New York: McGraw-Hill, 1990. ISBN 0-07-009781-X.

Carson, H. Tom, and Cox, Doye B., Handbook on Hazardous Materials Management, 4th Edition. Institute of Hazardous Materials Management, 1992.

Castelli, James, Nash, Carl, Ditlow. Clarence, and Pecht, Michael, Sudden Acceleration: The Myth of Driver Error. College Park, MD: CALCE, 2003. ISBN 0-9707174-5-8.

Chalmers, Bruce, and King, R., Progress in Metal Physics, Volume 5. New York: Interscience, 1954.

Cheremisinoff, Paul N., and Cheremisinoff, Nicholas P., Lead: A Guidebook to Hazard Detection, Remediation, and Control. Englewood Cliffs, NJ: PTR Prentice Hall, 1993. ISBN 0-13-012436-2.

Christian, J. W., The Theory of Transformations in Metals and Alloys. London: Pergamon Press, 1965.

Classon, Frank, Surface Mount Technology for Concurrent Engineering and Manufacturing . New York: McGraw-Hill, 1993. ISBN 0-07-011200-2.

Clauser, Henry R., Encyclopedia/Handbook of Materials, Parts and Finishes. Westport, CT: Technomic Publishing, 1976.

Cohen, Ernst, Physico-Chemical Metamorphosis and Some Problems in Piezochemistry . New York: McGraw-Hill, 1928.

Coombs, Jr., Clyde F., Printed Circuits Handbook, 3rd Edition. New York: McGraw-Hill, 1988. ISBN 0-07-012609-7.

Coombs, Jr., Clyde F., Printed Circuits Handbook, 5th Edition. New York: McGraw-Hill, 2001. ISBN 0-07-135016-0. $125.00 list price.

Coombs, Jr., Clyde F., Printed Circuits Handbook, 6th Edition. New York: McGraw-Hill, 2008. ISBN 0-07-146734-3. $135.00 list price.

Cralley, Lewis J., Cralley, Lester V., and Bus, James S., Patty's Industrial Hygiene and Toxicology, 3rd Edition, Volume III, Part B. New York: John Wiley & Sons, 1995, ISBN 0-471-53065-4.

Crowson, Richard, The Handbook of Manufacturing Engineering, 2nd Edition. New York: CRC Taylor & French, 2006. ISBN 0-8493-5554-0. $139.95 list price.

Cullity, B. D., Elements of X-Ray Diffraction, 2nd Edition. Reading, MA: Addison-Wesley, 1967. ISBN 0-201-01174-3.

Darken, Lawrence S., Gurry, Robert W., Physical Chemistry of Metals. New York: McGraw-Hill, 1953.

Dehlinger, Ulrich, Chemische Physik der Metalle und Legierungen. Liepzig, Germany: Akademische Verlagsgesellschaft, 1939.

Denison, Richard A., and Ruston, John, Recycling & Incineration: Evaluating the Choices. Washington, D. C.: Island Press, 1990. ISBN 1-55963-054-X. $50.00 list price.

Dillard, Clyde R., and Goldberg, David E., Chemistry Reactions, Structure and Properties. New York: MacMillan, 1971.

Doan, Gilbert E., and Mahla, Elbert M., The Principles of Physical Metallurgy, Second Edition. New York: McGraw-Hill, 1941.

Dunn, Barrie D., Materials and Processes for Spacecraft and High Reliability Applications . Chichester, United Kingdom: Springer, 2016. ISBN 978-3-319-79474-7. $154.26 list price.

Dunn, Barrie D., Metallurgical Assessment of Spacecraft Parts, Materials and Processes . New York: John Wiley & Sons, 1997. ISBN 047196428X. $280.00 list price.

Durairaj, Rajkumar, Rheology and processing of pastes for electronic packaging materials: Novel rheological characterisation techniques for lead-free solder pastes and electrical conductive adhesives. VDM Verlag Dr. Muller, 2009. ISBN 978-3-639-15746-8. $70.00 list price.

Durney, Lawrence J., Electroplating Engineering Handbook, 4th Edition. New York: Van Nostrand Reinhold, 1984. ISBN 0-442-22002-2.

Earnshaw, A., and Greenwood, Norman, Chemistry of the Elements, 2nd Edition. Elsevier, 1997. List price $99.95.

Edwards, Joseph, Coating and Surface Treatment Systems for Metals: A Comprehensive Guide to Selection. Materials Park, OH: ASM International, 1997. pp. 254-261.

Elices, M., and Llorca, J., Fiber Fracture. Oxford, UK: Elsevier, 2002. ISBN 0080441041. $199.00 list price.

Emsley, John, Molecules at an Exhibition - Portraits of Intriguing Materials in Everyday Life, New York: Oxford University Press, 1998. ISBN 0192862065. $17.95 list price.

Emsley, John, Nature's Building Blocks: An A-Z Guide to the Elements. Oxford University Press, 2001. ISBN 0198503407. $17.95 list price.

Evans, John W., A Guide to Lead-free Solders. London: Springer-Verlag, 2007. ISBN 978-1-84628-309-3. $129.00 list price.

Flinn, Richard A., and Trojan, Paul K., Engineering Materials and Their Applications, Second Edition. Dallas, TX: Houghton Mifflin, 1981. ISBN 0-395-29645-5.

Forsythe, W. E., Smithsonian Physical Tables, 9th Edition. Knovel, 1954.

Frear, D. R., Morgan, H. D., Burcheit, S. N., and Lau, J. H., The Mechanics of Solder Alloy Interconnects. New York: Van Nostrand Reinhold, 1994. ISBN 0-442-01505-4. $215.00 list price.

Frear, D. R., Jones, W. B., and Kinsman, K. R., Solder Mechanics: A State of the Art Assessment. Warrendale, PA: The Minerals, Metals & Materials Society, 1990. ISBN 0-87339-131-4.

Fukuda, Mitsuo, Reliability and Degradation of Semiconductor Lasers and LEDs. Boston, MA: Artech House, 1991. ISBN 0-89006-465-2. $138.00 list price.

Ganesan, Sanka, and Pecht, Michael, Lead-free Electronics 2004 Edition. College Park, MD: CALCE EOSC Press, 2003. ISBN 0-9707174-7-4. $100 list price.

Ganesan, Sanka, and Pecht, Michael. Lead-free Electronics. Hoboken, NJ: John Wiley & Sons, 2006. ISBN 0-471-78617-9. $99.95 list price.

Gilleo, Ken, Area Array Packaging Handbook: Manufacturing and Assembly. New York: McGraw-Hill, 2002. ISBN 0-07-137493-0. $125.00 list price.

Gilleo, Ken, Area Array Packaging Materials: Adhesives, Pastes, and Lead-Free. New York: McGraw-Hill, 2004. ISBN 0-07-142828-3. $130.00 list price.

Gilman, J. J., The Art and Science of Growing Crystals. New York: John Wiley & Sons, 1963.

Goldberg, Lee H., and Middleton, Wendy, Green Electronics/Green Bottom Line: Environmentally Responsible Engineering. Boston, MA: Newnes, 2000. ISBN 0-7506-9993-0. $59.95 list price.

Goodman, P., A Guide to Compliance with the RoHS Directive. ERA Technology. ISBN 0-7008-0780, £175.00 list price. (do not have)

Gordon, Pamela J., Lean and Green: Profit for Your Workplace and the Environment. San Francisco, CA: Berrett-Koehler, 2001. ISBN 1-57675-17088. $24.95 list price.

Graham, A. Kenneth, and Pinkerton, H. L., Electroplating Engineering Handbook. New York: Reinhold Publishing, 1955.

Greenfield, L. T., and Forrester, P. G., The Properties of Tin Alloys. Greenford, Middlesex, England: Tin Research Institute, Oct. 1947.

Grossman, Elizabeth, High Tech Trash: Digital Devices, Hidden Toxics, and Human Health . Washington: Shearwater Books, 2006. ISBN 1-55963-554-1. $19.95 list price.

Grossmann, Gunter, and Zardini, Christian, The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects. New York: Springer, 2011. ISBN 978-0-85729-235-3. $129.00 list price.

Hamer, Donald W., and Biggers, James V., Thick Film Hybrid Microcircuit Technology. New York: Wiley-Interscience, 1972. ISBN 0-471-34700-0.

Hampel, Clifford A., The Encyclopedia of the Chemical Elements. New York: Reinhold, 1968.

Harland, David M., and Lorenz, Ralph D., Space Systems Failures: Disasters and Rescues of Satellites, Rockets and Space Probes. Chichester, UK: Praxis, 2005. ISBN 0-387-21519-0. $29.95 list price.

Harper, Charles A., and Sampson, Ronald M., Electronic Materials & Processes Handbook, 2nd Edition. New York: McGraw-Hill, 1994. ISBN 0-07-054299-6.

Harper, Charles A., Electronic Materials and Processes Handbook, 3rd Edition. New York: McGraw-Hill, 2004. ISBN 0-07-140214-4. $125.00 list price.

Harper, Charles A., Electronic Packaging & Interconnection Handbook, 2nd Edition. New York: McGraw-Hill, 1997. ISBN 0-07-026694-8.

Harper, Charles A., Electronic Packaging & Interconnection Handbook, 3rd Edition. New York: McGraw-Hill, 2000. ISBN 0-07-134745-3.

Harper, Charles A., Electronic Packaging and Interconnection Handbook, 4th Edition. New York: McGraw-Hill, 2005. ISBN 0-07-143048-2. $150.00 list price.

Harper, Charles A., Handbook of Electronic Packaging. New York: McGraw-Hill, 1969.

Harper, Charles A., Handbook of Materials and Processes for Electronics. New York: McGraw-Hill, 1970.

Harper, Charles A., Handbook of Materials for Product Design. New York: McGraw-Hill, 2001. ISBN 0-07-135406-9. $125.00 list price.

Harper, Charles A., Handbook of Wiring, Cabling, and Interconnecting for Electronics. New York: McGraw-Hill, 1972.

Harper, Charles A., High Performance Printed Circuit Boards. New York: McGraw-Hill, 2000. ISBN 0-07-026713-8. $79.00 list price.

Hausner, Henry H., Modern Materials: Advances in Development and Applications, Volume 2 . New York: Academic Press, 1960.

Hedges, E. S., and Homer, C. E., The Properties of Tin, 3rd Revised Edition. International Tin Research and Development Council, 1937.

Hedges, Ernest S., Tin and Its Alloys. London, Edward Arnold, 1960.

Henshall, Greg, Bath, Jasbir, and Handwerker, Carol A., Lead-Free Solder Process Development. Hoboken, NJ: John Wiley & Sons, 2011. ISBN 978-0-470-41074-5. $99.95 list price.

Hoare, W. E., and Hedges, E. S., Tinplate. London: Edward Arnold, 1945.

Hobart, James F., Soft Soldering, Hard Soldering and Brazing. New York: D. Van Nostrand, 1919.

Hollomon Jr., James K., Surface-Mount Technology for PC Boards. Indianapolis, IN: Prompt Publications, 1995. ISBN 0-7906-1060-4. $45.95 list price.

Holm, Ragnar, Electric Contacts Handbook, 3rd Edition. Berlin, Springer-Verlag, 1958.

Honeycombe, R. W. K., The Plastic Deformation of Metals. Edward Arnold, 1984.

Hoyt, Samuel L., Metals and Alloys Data Book. New York: Reinhold Publishing, 1943.

Hoyt, Samuel L., Metals Properties. New York: McGraw-Hill, 1954.

Hudson, John B., Surface Science: An Introduction. New York: John Wiley & Sons, 1998. ISBN 0471252395.

Hume-Rothery, William, Atomic Theory for Students of Metallurgy. London: Institute of Metals, 1955.

Hume-Rothery, William, Electrons, Atoms, Metals and Alloys, 3rd Edition. New York: Dover,1963.

Hume-Rothery, William, and Raynor, G. V., The Structure of Metals and Alloys. London: The Institute of Metals, 1956.

Humpston, Giles, and Jacobson, David M., Principles of Soldering. Materials Park, OH: ASM, 2004. ISBN 0-87170-792-6. $165.00 list price.

Humpston, Giles, and Jacobson, David M., Principles of Soldering and Brazing. Materials Park, OH: ASM International, 1993. ISBN 0-87170-462-5. $165.00 list price.

Hwang, Jennie S., Ball Grid Array & Fine Pitch Peripheral Interconnections. Electrochemical Publications, 1995. ISBN 0-901150-29-0.

Hwang, Jennie S., Environment-Friendly Electronics: Lead-Free Technology. Electrochemical Publications, 2001. ISBN 0-901150-40-1. $238 list price.

Hwang, Jennie S., Implementing Lead-Free Electronics. New York: McGraw-Hill, 2005. ISBN 0-07-144374-6. $99.95 list price.

Hwang, Jennie S., Modern Solder Technology for Competitive Electronics Manufacturing . New York: McGraw-Hill, 1996. ISBN 0-07-031749-6. $89.95 list price.

Hwang, Jennie S., Solder Paste in Electronics Packaging. New York: Van Nostrand Reinhold, 1989. ISBN 0-442-20754-9. available from Amazon.com

Jeffries, Zay, and Archer, Robert S., The Science of Metals. New York: McGraw-Hill, 1924.

Johnson, Colin C., and Kevra, Joseph, Solder Paste Technology: Principles and Applications. Blue Ridge Summit, PA: TAB Professional and Reference Books, 1989. ISBN 0-8306-3203-4. available from Amazon.com

Jordan, Manfred, The Electrodeposition of Tin and its Alloys. Saulgau/Wurtt, Germany: Eugen G. Leuze Publishers, 1995. ISBN 3-87480-118-7.

Joseph, Shany, and Phatak, Girish, Electroplating of Lead Free Solder for Electronics. New York: Nova Science Publishers, 2011. ISBN 978-1-61668-753-3. $43.00 list price.

Joshi, P. B., and Ramakrishnan, P., Materials for Electrical and Electronic Contacts: Processing, Properties, and Applications. Enfield, NH: Science Publishers, 2004. ISBN 1-57808-269-2. $118.00 list price.

Jowett, C. E., Compatibility and Testing of Electronic Components. New York: John Wiley & Sons, 1972.

Jowett, C. E., Reliable Electronic Assembly Production. Blue Ridge Summit, PA: TAB Books, 1970.

Judd, Mike, and Brindley, Keith, Soldering in Electronics Assembly. Oxford: Newnes, 1999. ISBN 0750635452. $120.00 list price.

Kaldis, E., Current Topics in Material Science, Volume 1. (Givargizov, E. I., "Growth of Whiskers by the Vapor-Liquid-Solid Mechanism,", pp. 79-145.) New York: North-Holland Publishing, 1978.

Kato, Takahiko, Handwerker, Carol A., and Bath, Jasbir, Mitigating Tin Whisker Risks: Theory and Practice. Hoboken, NJ: IEEE Press, 2016. ISBN 9780470907238.

Kesler, Stephen E., Mineral Resources, Economics and the Environment. Macmillan College Publishing, New York, 1994. ISBN: 0-02-362842-1.

Kessel, Irene, and O'Conner, John T., Getting the Lead Out: The Complete Resource for Preventing and Coping with Lead Poisoning , Revised Edition. Cambridge, MA: Perseus Publishing, 2001. ISBN 0-7382-0499-4. $18.00 list price.

Kittel, Charles, Introduction to Solid State Physics, 5th Edition. New York: John Wiley & Sons, 1976.

Klaassen, Curtis D., Casarett & Doull's Toxicology: The Basic Science of Poisons. McGraw-Hill, 2001. List price $105.00.

Kubasek, Nancy K., and Silverman, Gary S., Environmental Law, 3rd Edition. Upper Saddle River, NJ: Prentice Hall, 2000. ISBN 0-13-014121-6.

Kuehr, Ruediger, and Williams, Eric, Computers and the Environment: Understanding and Managing their Impacts . Boston, MA: Kluwer Academic Publishers, 2003. ISBN 1-4020-1680-8. $39.95 list price.

Lall, Pradeep, Pecht, Michael G., and Hakim, Edward B., Influence of Temperature on Microelectronics and System Reliability . New York: CRC Press, 1997. ISBN 0-8493-9450-3. $109.95 list price.

Lancaster, J. F., The Metallurgy of Welding Brazing and Soldering. New York: Americal Elsevier, 1965.

Lashko, N. F., and Lashko-Avakyan, S. V., Brazing and Soldering of Metals. Jerusalem: Israel Program for Scientific Translations, 1961.

Lau, John H., Wong, C. P., Prince, John L., and Nakayama, Wataru, Electronic Packaging: Design, Materials, Process, and Reliability . New York: McGraw-Hill, 1998. ISBN 0-07-037135-0.

Lau, John H., Wong, C. P., Lee, Ning Cheng, and Lee, S. W. Ricky, Electronics Manufacturing with Lead-Free, Halogen-Free & Conductive Adhesive Materials. New York: McGraw-Hill, 2003. ISBN 0-07-138624-6. $125 list price.

Lau, John H., Flip Chip Technologies. New York: McGraw-Hill, 1996. ISBN 0-07-036609-8.

Lau, John H., Reliability of RoHS-Compliant 2D and 3D IC Interconnects. New York: McGraw Hill, 2011. ISBN 978-0-07-175379-1. $125.00 list price.

Lau, John H., Solder Joint Reliability: Theory and Applications. New York: Van Nostrand Reinhold, 1991. ISBN 0-442-00260-2. $227.00 list price.

Le Couteur, Penny, and Burreson, Jay, Napoleon's Buttons: How 17 Molecules Changed History. New York: Jeremy P. Tarcher/Putnam, 2003. $14.95 list price.

Le Grand, Rupert, The New American Machinist's Handbook. New York: McGraw-Hill, 1955.

Lee, Ning-Cheng, Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies. Boston, MA: Newnes, 2001. ISBN 0-7506-7218-8. $83.95 list price.

Lee, Thomas W., and Pabbisetty, Seshu V., Microelectronic Failure Analysis Desk Reference, 3rd Edition. Materials Park, OH: ASM International, 1993. ISBN 0-87170-479-X.

Leidheiser Jr., Henry, The Corrosion of Copper, Tin, and Their Alloys. New York: John Wiley & Sons, 1971. ISBN 0-471-52600-2.

Leighou, Robert B., Chemistry of Engineering Materials. New York: McGraw-Hill, 1942.

Levitt, Albert P., Whisker Technology. New York: Wiley-Interscience, 1970. ISBN 471-53150-2.

Lewis, Grace Ross, 1001 chemicals in everyday products, 2nd Edition. New York: John Wiley & Sons, 1999. ISBN 0-471-29212-5. $79.95 list price.

Lewis Sr., Richard J., Hazardous Chemicals Desk Reference, 2nd Edition. New York: Van Nostrand Reinhold, 1991. ISBN 0-442-000497-4.

Lewis Sr., Richard J., Sax's Dangerous Properties of Industrial Materials, 8th Edition, Volume II. New York: Van Nostrand Reinhold, 1992. ISBN 0-442-01277-2. $625.00 list price for 3-volume set.

Lewis Sr., Richard J., Sax's Dangerous Properties of Industrial Materials, 8th Edition, Volume III. New York: Van Nostrand Reinhold, 1992. ISBN 0-442-01278-0. $625.00 list price for 3-volume set.

Licari, James J., and Swanson, Dale W., Adhesives Technology for Electronic Applications: Materials, Processing, Reliability. William Andrew Publishing, 2005. List price $165.00.

Licari, James J., and Enlow, Leonard R., Hybrid Microcircuit Technology Handbook, 2nd Edition. Westwood, NF: Noyes Publications, 1989. ISBN 0815511523. $139.00 list price.

Licari, James J., and Enlow, Leonard R., Hybrid Microcircuit Technology Handbook: Materials, Processes, Design, Testing and Production, 2nd Edition. Westwood, NJ: Noyes Publications, 1998. ISBN 0815514239. $180.00 list price.

Lide, David R., CRC Handbook of Chemistry and Physics, 82nd Edition 2001-2002. New York: CRC Press, 2001. ISBN 0-8493-0482-2. pp. 4-32.

Liddell, Donald M., Handbook of Nonferrous Metallurgy. New York: McGraw-Hill, 1945.

Liddell, Donald M., and Doan, Gilbert E., The Principles of Metallurgy. New York: McGraw-Hill, 1933.

Lide, David R., CRC Handbook of Chemistry and Physics, 82nd Edition 2001-2002. New York: CRC Press, 2001. ISBN 0-8493-0482-2.

Lin, Kwang-Lung, Solder Materials. London: World Scientific Publishing, 2018. ISBN 978-981-3237-60-5. $143.47 list price.

Liu, Johan, Conductive Adhesives for Electronics Packaging. Electrochemical Publications, 1999. ISBN 0-901150-37-1.

Liu, Weifeng, and Pecht, Michael, IC Component Sockets. Hoboken, NJ: John Wiley & Sons, 2004. ISBN 0-471-46050-8. $73.50 list price.

Louis, Henry, Metallurgy of Tin. New York: McGraw-Hill, 1911.

Lowenheim, Frederick A., Modern Electroplating, 2nd Edition. New York: John Wiley & Sons, 1963.

Lu, Daniel, and Wong, C. P., Materials for Advanced Packaging. New York: Springer, 2010. ISBN 978-1-4419-4611-9. $129.00 list price.

Lyman, Taylor, Metals Handbook, 8th Edition, Volume 1. Novelty, OH: American Society for Metals, 1961.

Lynch, Charles T., CRC Handbook of Materials Science, Volume I: General Properties. Boca Raton, FL: CRC Press, 1974. ISBN 0-87819-231-X.

Lynch, Charles T., CRC Handbook of Materials Science, Volume II: Metals, Composites, and Refractory Materials. Boca Raton, FL: CRC Press, 1975. ISBN 0-87819-232-8.

Lynch, Charles T., Practical Handbook of Materials Science. Boca Raton, FL: CRC Press, 1989. ISBN 0-8493-3702-X.

Madenci, Erdogan, Guven, Ibrahim, and Kilie, Bahattin, Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS(R). Boston, MA: Kluwer Academic Publishers, 2003. ISBN 1-4020-7330-5. $186.00 list price.

Manko, Howard H., Soldering Handbook for Printed Circuits and Surface Mounting. New York: Van Nostrand Reinhold, 1986. ISBN 0442-26423-2. available from Amazon.com

Manko, Howard H., Solders and Soldering: Materials, Design, Production, and Analysis for Reliable Bonding, 3rd Edition. New York: McGraw-Hill, 1992. ISBN 0-07-039970-0. $79.95 list price.

Manko, Howard H., Solders and Soldering, 4th Edition. New York: McGraw-Hill, 2001. ISBN 0-07-134417-9.

Mantell, C. L., Tin: Its Mining, Production, Technology, and Applications. New York: Chemical Catalog Company, 1929.

Mantell, C. L., Tin: Its Mining, Production, Technology, and Applications, 2nd Edition . New York: Reinhold, 1949.

Mantell, Charles L., Engineering Materials Handbook. New York: McGraw-Hill, 1958.

Mathewson, C. W., Modern Uses of Nonferrous Metals. New York: American Institute of Mining and Metallurgical Engineers, 1953.

Meaden, George Terence, Electrical Resistance of Metals. New York: Plenum Press, 1965.

Mendenhall, J. Howard, Understanding Copper Alloys. Malabar, FL: Robert E. Krieger Publishing, 1989. ISBN 0-89874-855-0.

Mickelson, Alan R., Basavanhally, Nagesh R., and Lee, Yung-Cheng, Optoelectronic Packaging. New York: John Wiley & Sons, 1997. ISBN 0-471-11188-0. $115.00 list price.

Miner, Douglas F., and Seastone, John B., Handbook of Engineering Materials, 1st Edition. New York: McGraw-Hill, 1955.

Moore, Thomas M., and McKenna, Robert G., Characterization of Integrated Circuit Packaging Materials. Boston, MA: Butterworth-Heinemann, 1993. ISBN 0-7506-9267-7.

Moosbrugger, Charles, and Cverna, Fran, ASM Read Reference Electrical and Magnetic Properties of Metals. Materials Park, OH: ASM International, 2000. ISBN 0-87170-690-3. $167.00 list price.

Murr, Lawrence E., Interfacial Phenomena in Metals and Alloys. Don Mills, Ontario: Addison-Wesley, 1975. ISBN 0-201-04884-1.

Neely, W. Brock, Introduction to Chemical Exposure and Risk Assessment. Boca Raton, FL: Lewis Publishers, 1994. ISBN 1-56670-094-9.

Neumuller, Otto-Albrecht, Rompps Chemie-Lexikon, Volume 6. Stuttgart, Germany: Franckh'sche Verlagshandlung, 1988. ISBN 3-440-04516-1.

Newton, Joseph, An Introduction to Metallurgy, 2nd Edition. New York: John Wiley & Sons, 1947.

Nicholson, Morris E., Electronic Packaging and Corrosion in Microelectronics. ASM, 1987. ISBN 0-87170-291-6.

Nightingale, S. J., Tin Solders: A Modern Study of the Properties of Tin Solders and Soldered Joints, 2nd Edition. Brooklyn, NY: Chemical Publishing, 1942.

Nippes, Ernest F., Metals Handbook, 9th Edition, Volume 6: Welding, Brazing, and Soldering . Metals Park, OH: American Society for Metals, 1983. ISBN 0-87170-007-7.

Nowick, A. S., and Burton, J. J., Diffusion in Solids. New York: Academic Press, 1975.

Oberg, Erik, Machinery's Handbook, 20th Edition. New York: Industrial Press, 1975.

Pang, John Hock Lye, Lead Free Solder: Mechanics and Reliability. New York: Springer, 2012. ISBN 978-1-4614-0462-0. $129.00 list price.

Parker, Earl R., Materials Data Book. New York: McGraw-Hill, 1967.

Paul, William, and Warschauer, Douglas M., Solids Under Pressure, New York: McGraw-Hill, 1963.

Pearson, W. B., A Handbook of Lattice Spacings and Structures of Metals and Alloys . New York: Pergamon Press, 1958.

Pearson, W. B., A Handbook of Lattice Spacings and Structures of Metals and Alloys, Volume 2. New York: Pergamon Press, 1967.

Pecht, Michael, Bumiller, Elissa M., Douthit, David A., and Pecht, Joan, Contamination of Electronic Assemblies. New York: CRC Press, 2003. ISBN 0849314836. $169.95 list price.

Pecht, Michael, Agarwal, Rakish, McCluskey, Patrick, Dishongh, Terrance, Javadpour, Sirus, and Mahajan, Rahul, Electronic Packaging Materials and Their Properties. New York: CRC Press, 1999. ISBN 0-8493-9625-5. $109.95 list price.

Pecht, Michael, Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability. New York: John Wiley & Sons, 1994. ISBN 0-471-59446-6. $175.00 list price.

Perry, Robert H., and Green, Donald W., Perry's Chemical Engineers' Handbook, 7th Edition. McGraw-Hill, 1997. List price $150.00.

Plumbridge, W. J, Matela, Raymond J., and Westwater, A., Structural Integrity and Reliability in Electronics: Enhancing Performance in a Lead-Free Environment. Boston: Kluwer Academic Publishers, 2004. ISBN 1-4020-1765-0. $154 list price.

Pohanish, Richard P., Sittig's Handbook of Toxic and Hazardous Chemicals and Carcinogens, Volumes 1 and 2. William Andrew Publishing, 2002. List price $495.00.

Pojasek, Robert B., Toxic and Hazardous Waste Disposal, Volume One: Processes for Stabilization/ Solidification. Ann Arbor, MI: Ann Arbor Science Publishers, 1979. ISBN 0-250-40251-3.

Pollack, Herman W., Materials Science and Metallurgy. Reston, VA: Reston Publishing, 1977.

Prager, Jan C., Environmental Contaminant Reference Databook, Volumes 1-3. John Wiley & Sons, 1998.

Price, J. W., Tin and Tin-Alloy Plating. Great Britain: Electrochemical Publications, 1983.

Prise, Walter J., Electronic Circuit Packaging. Columbus, OH: Charles E. Merrill Books, 1967.

Puippe, Jean-Claude, and Leaman, Frank, Theory and Practice of Pulse Plating. Orlando, FL: American Electroplaters and Surface Finishers Society, 1986. pp. 189-208.

Puttlitz. Karl J., and Stalter, Kathleen A., Handbook of Lead-Free Solder Technology for Microelectronic Assemblies . New York: Marcel Dekker, 2004. ISBN 0-8247-4870-0. $225 list price.

Rabilloud, Guy, High-Performance Polymers Chemistry and Applications, Volume 1: Conductive Adhesives. Paris, France: Editions Technip, 1997. ISBN 9-782710-807162.

Rawdon, Henry S., Protective Metallic Coatings. New York: Chemical Catalog Co., 1928.

Reed-Hill, Robert E., Physical Metallurgy Principles. Princeton, NJ: D. Van Nostrand, 1964.

Rhines, Frederick N., Non-Ferrous Metallography Notes, Part II: Copper and the White Metals . Pittsburgh, PA: Carnegie Institute of Technology, 1948.

Richardson, H. L. "Bill", What Makes You Think We Read the Bills?. Ottawa, IL: Caroline House Books, 1978.

Ritchey, Lee W., Right the First Time: A Practical Handbook on High Speed PCB and System Design, Volume 2. Speeding Edge, 2006. ISBN 0-9741936-0-7.

Roberge, Pierre R., Handbook of Corrosion Engineering. McGraw-Hill, 2000. List price $115.00.

Rose, Robert M., Shepard, Lawrence A., and Wulff, John, Structure and Properties of Materials, Volume IV: Electronic Properties . New York: John Wiley & Sons, 1996.

Rosenthal, Murray P., Mini/Micro Soldering and Wire Wrapping. Rochelle Park, NJ: Hayden, 1978.

Safranek, William H., The Properties of Electrodeposited Metals and Alloys, 2nd Edition . Orlando, FL: American Electroplaters and Surface Finishers Society, 1986. ISBN 0-936569-00-X.

Sax, N. Irving, Dangerous Properties of Industrial Materials, 5th Edition. New York: Van Nostrand Reinhold, 1979. ISBN 0-442-27373-8.

Sax, N. Irving, and Lewis Sr., Richard J., Rapid Guide to Hazardous Chemicals in the Workplace. New York: Van Nostrand Reinhold, 1986. ISBN 0-442-28220-6.

Schapiro, Mark, Exposed: The Toxic Chemistry of Everyday Products and What's at Stake for American Power. White River Junction, VT: Chelsea Green Publishing, 2007. ISBN 1603580581. $16.95 list price.

Schlabach, T. D., and Rider, D. K., Printed and Integrated Circuitry: Materials and Processes. New York: McGraw-Hill, 1963.

Schlesinger, Mordechay, and Paunovic, Milan, Modern Electroplating, 4th Edition. New York: John Wiley & Sons, 2000. ISBN 0-471-16824-6. $184.00 list price.

Seitz, Frederick, and Turnbull, David, Solid State Physics, Volume 3. New York: Academic Press, 1956.

Seitz, Frederick, The Modern Theory of Solids. New York: McGraw-Hill, 1940.

Seitz, Frederick, The Physics of Metals. New York: McGraw-Hill, 1943.

Seraphim, Donald P., Lasky, Ronald, and Li, Che-Yu, Principles of Electronic Packaging. New York: McGraw-Hill, 1989. ISBN 0-07-056306-3.

Shangguan, Dongkai, Lead-Free Solder Interconnect Reliability. Materials Park, OH: ASM International, 2005. ISBN 0-87170-816-7. $195.00 list price.

Shemilt, H. R., Printed Circuit Troubleshooting. Scotland: Electrochemical Productions, 1974.

Sheng, William W., and Colino, Ronald P., Power Electronic Modules: Design and Manufacture. Ann Arbor, MI: CRC Press, 2004. $99.95 list price.

Shina, Sammy G., Green Electronics Design & Manufacturing: Implementing Lead-Free and RoHS-Compliant Global Products. New York: McGraw-Hill, 2008. ISBN 978-0-07-149594-3. $99.95 list price.

Shreir, L. L., Jarman, R. A., and Burstein, G. T., Corrosion, 3rd Edition, Volume 1. Woburn, MA: Elsevier Butterworth-Heinemann, 1994. ISBN 0750610778.

Singh, P., and Viswanadham, Puligandla, Failure Modes And Mechanisms in Electronic Packages. (copy on order.)

Smallman, R. E., and Bishop, R. J., Modern Physical Metallurgy and Materials Engineering: Science, process, applications, 6th Edition. Boston, MA: Elsevier Butterworth-Heinemann, 1999. ISBN 0750645644. $68.00 list price.

Smith, Morton C., Principles of Physical Metallurgy. New York: Harper & Brothers, 1956.

Smithells, Colin J., Metals Reference Book, 3rd Edition, Volume 1. Washington: Butterworths, 1962.

Smithells, Colin J., Metals Reference Book, 3rd Edition, Volume 2. Washington: Butterworths, 1962.

Strauss, Rudolf, SMT Soldering Handbook, 2nd Edition. Oxford, UK: Newnes, 1998. ISBN 0-7506-3589-4. $104.95 list price.

Stwertka, Albert, A Guide to the Elements. New York: Oxford University Press, 1996.

Subramanian, K. N., Lead-free Solders: Materials Reliability for Electronics. John Wiley & Sons, 2012. ISBN 9780470971826. $195.00 list price.

Suganuma, Katsuaki, Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact. New York: Marcell Dekker, 2004. ISBN 0-8247-4102-1. $165 list price.

Tammann, Gustav, Lehrbuch der Metallographie: Chemie und Physik der Metalle und ihrer Legierungen. Leipzig, Germany: Leopold Voss, 1923.

Tan, A. C., Lead Finishing in Semiconductor Devices: Soldering. New Jersey: World Scientific, 1989. ISBN 9971-50-679-3. $65.00 list price.

Tan, A. C., Tin and Solder Plating in the Semiconductor Industry. New York: Chapman & Hall, 1993. ISBN 0-412-48240-1.

Tautscher, Carl J., The Contamination of Printed Wiring Boards and Assemblies. Bothell, WA: Omega Scientific Services, 1976.

Teed, P. Litherland, The Properties of Metallic Materials at Low Temperatures. New York: John Wiley & Sons, 1950.

Tenner, Edward, Why Things Bite Back: Technology and the Revenge of Unintended Consequences. Alfred A. Knopf, New York, 1997. ISBN: 0679747567. $15.95 list price.

Thwaites, C. J., Capillary Joining - Brazing and Soft-Soldering. New York: Research Studies Press, 1982. ISBN 0-471-10167-2.

Thwaites, C. J., and Barry, B. T. K., Soldering. Oxford University Press, 1975. ISBN: 019859139X.

Tu, King-Ning, Solder Joint Technology: Materials, Properties, and Reliability. Springer, 2007. ISBN 0-387-38890-7. $149.00 list price.

Tummala, Rao R., Fundamentals of Microsystems Packaging. New York: McGraw-Hill, 2001. ISBN 0-07-137169-9. $89.95 list price.

Tummala, Rao R., and Rymaszewski, Eugene J., Microelectronics Packaging Handbook. New York: Van Nostrand Reinhold, 1989. ISBN 0-442-20578-3.

Tummala, Rao R., Rymaszewski, Eugene J., and Klopfenstein, Alan G., Microelectronics Packaging Handbook, 3-Part Set. New York: International Thompson Publishing, 1997. ISBN 0-412-08431-7, 0-412-08441-4, and 0-412-08451-1. $185.00 list price.

Tung, Chih-Hang, Sheng, George T. T. Sheng, and Lu, Chih-Yuan, ULSI Semiconductor Technology Atlas. John Wiley & Sons, 2003. ISBN 0471457728. $132.00 list price.

van Arkel, A. E., Reine Metalle, Berlin, Germany: Verlag von Julius Springer, 1939.

Verhoeven, John D., Fundamentals of Physical Metallurgy. New York: John Wiley & Sons, 1975.

Verma, Ajit Ram, and Krishna, P., Polymorphism and Polytypism in Crystals. New York: John Wiley & Sons, 1966.

Vianco, Paul T., Soldering Handbook, 3rd Edition. Miami, FL: American Welding Society, 1999. ISBN 0-87171-618-6.

Viswanadham, Puligandla, and Singh, Pratap, Failure Modes and Mechanisms in Electronic Packages. New York: International Thomson Publishing, 1998. ISBN 0-412-10591-8. $150.00 list price.

Wagner, Travis P., The Hazardous Waste Q & A. New York: Van Nostrand Reinhold, 1990. ISBN 0-442-23842-8. $115.00 list price.

Wassink, R. J. Klein, Soldering in Electronics, 2nd Edition. Electrochemical Publications, 1989. ISBN 0 901150 24 X. Available from Amazon.

Westbrook, J. H., and Fleischer, R. L., Intermetallic Compounds, Volume 1. John Wiley & Sons, 2000. List price $205.00.

Wilhelm, Donald, The Book of Metals. New York: Harper & Brothers, 1932.

Woodgate, Ralph W., Handbook of Machine Soldering: A Guide for the Soldering of Electronic Printed Wiring Assemblies. New York: John Wiley & Sons, 1983. ISBN 0-471-87540-6.

Wright, Roger N., Wire Technology: Process Engineering and Metallurgy. Elsevier, 2011. ISBN 978-0-12-382092-1.

Wyckoff, Ralph W. G., Crystal Structures, Volume 1. New York: Interscience Publishers, 1960.

Yost, Frederick G., Hosking, F. Michael, and Frear, Darrel R., The Mechanics of Solder Alloy Wetting & Spreading. New York: Van Nostrand Reinhold, 1993. ISBN 0-442-01752-9. $215.00 list price.

Ph. D. and Master's Theses on Lead-Free, RoHS, and WEEE (revised 10/3/2020)

Abbas, Abid Alrahman, Impact of Conformal Coating Material on the Long-Term Reliability of Ball Grid Array Solder Joints. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2019.

Abdelhadi, Ousama Mohamed Omer, Size Effects in Tin-Based Lead-Free Solder Joints: Kinetics of Bond Formation and Mechanical Characteristics. Ph. D. Thesis for University of Alabama, Tuscaloosa, AL, 2013.

Abtew, Mulugeta, Effect of Cooling Rate, Silver Composition, Dwell Time and Solder Joint Size on the Reliability of Tin-Silver-Copper Solder Joints. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2010.

Adeogba, Tonye, Effect of Reflow Variables on the Nanoscale Mechanical Properties of Lead Free Solders. Master's Thesis for University of Texas at Arlington, Arlington, TX, Dec. 2009.

Alghoul, Thaer M., Mechanisms of Deformation of Lead-Free Sn-Ag-Cu Solder Joints in Cycling . Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2019.

Alipour, Manijeh Mohammad, Thermal Diffusivity Determination in Sn-Based Lead-Free Solder Alloys . Ph. D. Thesis for University of Alabama, Huntsville, AL, 2011.

Allenby, Braden R., Design for environment: Implementing industrial ecology. Ph. D. Thesis for Rutgers the State University of New Jersey, New Brunswick, NJ, May 1992.

Al-Momani, Emad Shehadeh, Reliability Modeling of Lead-Free Electronics under Thermal Cycling Conditions. Ph. D. Thesis for State University of New York, Binghamton, NY, 2011.

Al-Yafawi, Abdullah, Electronic Packages Fatigue Life Predicion under Random Vibration Loading Conditions. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2010.

Anastasio, Onofrio A., An Approach for Impression Creep of Lead-Free Microelectronic Solders . Master's Thesis for Naval Postgraduate School, Monterey, CA. June 2002.

Anglin, Benjamin Stewart, Investigation and Characterization of Thermoelastic Eigenstresses Near Microstructural Features and the Application to Tin Whisker Growth. Ph. D. Thesis for Carnegie Mellon University, Pittsburgh, PA, Oct. 2012.

Anson, Scott J., Analysis of Lead Free Tin-Silver-Copper and Tin-Lead Solder Wetting Reactions. Ph. D. Thesis for State University of New York, Binghamton, University, Binghamton, NY, 2007.

Arfaei, Babak, The Effects of Nucleation and Solidification Mechanisms on the Microstructure and Thermomechanical Response of Sn-Ag-Cu Solder Joints. Ph. D. Thesis for State University of New York at Binghamton, Binghamton University, Binghamton, NY, 2010.

Athavale, Saurabh N., A Comparison of Different Mechanical Testing Protocols on the Reliability of a Pb-free Solder System. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2008.

Athavale, Saurabh, Effect of Cu Concentration and Cooling Rate on Microstructure of Sn-3.9Ag-XCu. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2006.

Bai, Guofeng, Low-Temperature Sintering of Nanoscale Silver Paste for Semiconductor Device Interconnection. Ph. D. Thesis for Virginia Polytechnic Institute and State University, Blacksburg, VA, Oct. 2005.

Bangalore, Sudhindra Nagaraj, Evaluation of conductive adhesives for Surface Mount Technology. Master's Thesis for University of Louisville, Louisville, KY, June 1992.

Barreda Esparza, Jorge Luis, Fabrication and Characterization of Heterogeneous Nanowires. Ph. D. Thesis for Florida State University, Tallahassee, FL, 2017.

Barry, Nathan, Lead-Free Solders for High-Reliability Applications: High-Cycle Fatigue Studies. Doctor of Engineering Thesis for University of Birmingham, Birmingham, United Kingdom, Oct. 23, 2008.

Beaumont, Matthew Hall, Characterization of Indalloy 227 Non Lead Solder. Ph. D. Thesis for Purdue University, West Lafayette, IN, Dec. 1999.

Becker, James Hall, Crystal Growth and Electrical and Optical Properties of Gray Tin. Ph. D. Thesis for Cornell University, June 1957.

Belbase, Hemant, Lead Free Soldering Materials, Reliability and Process Optimization . Master's Thesis for University of Massachusetts Lowell, Lowell, MA, Oct. 25, 2000.

Benedict, Michael Scott, Heterogeneous Nucleation of Sn in Sn-Ag-Cu Solder Joints. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.

Berger, Barry Nathaniel, Study of the Use of the Weibull Distribution and Compliance of the Reliability of Lead-Free Solder in Accelerated Thermal Cycling Through Varying Solder Volume, Pitch, and Thermal Range with Previously Established Materials Models. Master's Thesis for State University of New York, Binghamton, NY, 2012.

Berrios, Antonio Tavarez, Modeling the Reflow Process of an Actual PCB. Master's Thesis for University of Puerto Rico, Mayaguez, PR, 2001.

Bhalerao, Vikram, Process Development and Reliability Study for 01005 Components in a Lead-Free Assembly Environment. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2008.

Bhardwaj, Divya, Development of Lead Free Thermal Fuse Wires Using Ohno Continuous Casting. Master's Thesis for University of Toronto, Toronto, Canada, 2008.

Bhassyvasantha, Sherin, Mitigation of Tin Whiskers in Electroplated Tin Coatings by Effective Doping: The Role of Surface and Subsurface. Master's Thesis for New Mexico Institute of Mining and Technology, Socorro, NM, May 2018.

Bhave, Aniket, A Leaded and Lead-Free Solder Paste Evaluation Screening Procedure . Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2005.

Bierman, Matthew John, Dislocations in One-Dimensional Semiconductor Crystals: Nanowires, Nanotubes, and Whiskers. Ph. D. Thesis for University of Wisconsin - Madison, Madison, WI, 2009.

Bilderback, Donald Heywood, X-Ray Determination of the Valence Charge Density of Grey Tin, Indium-Antimonide, and Gallium-Arsenide. Ph. D. Thesis for Purdue University, West Lafayette, IN, Aug. 1975.

Bjeletich, John George, Dekinking of Copper Whiskers. Master's Thesis for Montana School of Mines, Butte, MT, 1961.

Bloomer, Tamara Ellis, Microstructural and mechanical properties of a novel lead-free solder . Master's Thesis for Iowa State University, Ames, IA, 1999.

Boesenberg, Adam James, Development of Al, Mn, & Zn doped Sn-Ag-Cu solders for electronic assembly, Master's Thesis for Iowa State University, Ames, IA, 2011.

Booth, Bruce Lee, Magnetoresistance Oscillations in Antimony Doped Gray Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1967.

Borra, Venkata Shesha Vamsi, Metal Whiskers: The Role of Electric Fields in the Formation Mechanism and Methods for Whisker Growth Mitigation. Ph. D. Thesis for University of Toledo, Toledo, OH, Dec. 2017.

Bowers, Trevor S., Microstructural Evolution of Nickel-Enhanced Tin-Copper Solder Joints on Nickel/Gold and Immersion Silver PCB Finishes. Master's Thesis for University of Alabama in Huntsville, Huntville, AL, 2006.

Brenner, Sidney S., The Growth and Mechanical Properties of Metal Whiskers. Ph. D. Thesis for Rensselaer Polytechnic Institute, Troy, New York, May 1957.

Bruno, Felix, An Experimental Study on Voids in Area Array Devices for Mixed Alloy Assemblies. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2006.

Buchovecky, Eric J., Numerical Simulation of Stress Generation and Whisker Growth in Sn Films. Ph. D. Thesis for Brown University, Providence, RI, May 2010.

Bukhari, Sarfaraz, Evaluation of the Effects of Processing Conditions on Shear Strength in Pb-Free Surface Mount Assembly. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2004.

Busta, Heinz, Uniaxial-tensile-stress-modified Galvanomagnetic Properties of Gray Tin . Ph. D. Thesis for Northwestern University, Evanston, IL, June 1974.

Caputo, Antonio, Conductive Anodic Filament (CAF) Formation. Ph. D. Thesis for University of Toronto, Toronto, Canada, 2010.

Chada, Srinivas, Effect of Processing Parameters and Thermal Cycling on the Microstructure and Strength of Eutectic Sn-Ag Solder on Cu. Ph. D. Thesis for Marquette University, Milwaukee, WI, May 1998.

Chae, Seung-Hyun, Electromigration and Thermomigration Reliability of Lead-Free Solder Joints for Advanced Packaging Applications. Ph. D. Thesis for University of Texas at Austin, Austin, TX, May 2010.

Chai, Fei, Solder Interconnect Life Prediction under Complex Temperature Cycling with Varying Mean and Amplitude. Ph. D. Thesis for University of Maryland, College Park, MD, 2013.

Chakraborty, Aritra, Using Chemo-Thermo-Mechanically Coupled Crystal Plasticity Simulations to Investigate the Process of Whisker Formation in b-Sn Thin Films. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2019.

Chaloupka, Andrew Charles, Lead-Free Electronics Use and Repair Dynamic Simulation. Master's Thesis for University of Maryland, College Park, MD, 2009.

Chan, Dennis King, A Maximum Entropy Fracture Model for Low and High Strain-Rate Fracture in SnAgCu Alloys. Ph. D. Thesis for Purdue University, West Lafayette, IN, Aug. 2012.

Chan, Yuen Sing, Investigation into Characteristics of Thermal Fatigue Modeling of Lead-Free Solder Joints and Optimization of Temperature Cycling Profile. Ph. D. Thesis for Hong Kong University of Science and Technology, Hong Kong, Jan. 2011.

Chandler, Gary Jesse Howard, Growth of Whiskers in the Indium-Tin Alloy System and the effect of Elastic Strain on Tc in alpha Indium-Tin. Master's Thesis for Clemson University, Clemson, SC, Aug. 1972.

Chang, Won, CSP Drop Test Performance Comparison for Different Solder Ball Materials . Master's Thesis for San Jose State University, San Jose, CA, May 2005.

Chao, Huang-Lin, Electromigration Enhanced Kinetics of Cu-Sn Intermetallic Compounds in Pb Free Solder Joints and Cu Low-k Dual Damascene Processing Using Step and Flash Imprint Lithography. Ph. D. Thesis for the University of Texas at Austin, Austin, TX, May 2009.

Chapaneri, Roshan, A Study of Hexavalent and Trivalent Chromium Conversion Coatings on Zinc Surfaces. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, 2010.

Chauhan, Preeti Singh, Microstructural Characterization and Thermal Cycling Reliability of Solders under Isothermal Aging and Electrical Current. Ph. D. Thesis for University of Maryland, College Park, MD, 2012.

Chavali, Sri Chaitra Jyotsna, Diffusion Driven Microstructural Evolution And Its Effect On Mechanical Behavior Of Sn-Ag-Cu Solder Alloys. Ph. D. Thesis for Purdue University, West Lafayette, IN, Dec. 2012.

Chaware, Raghunandan, Underfill Process Development for Lead Free Flip Chip Assembly. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2004.

Chen, Kai, Synchrotron polychromatic X-ray Laue microdiffraction studies of electromigration in Al (Cu) interconnects and Pb-free solder joints. Ph. D. Thesis for University of California, Los Angeles, CA, 2009.

Chen, Wei-Hsun, Evaluation of Local Anisotropic Elasticity and Thermal Expansion on Whisker Formation Sites in beta-tin Thin Films. Ph. D. Thesis for Purdue University, West Lafayette, IN, Aug. 2014.

Cheng, Jing, Tin Whiskers in Electronic Packaging: Mechanism and Modeling. Ph. D. Thesis for University of Rochester, Rochester, NY, 2011.

Chennagiri, Gurudutt, Rework of Lead-Free Area Array Packages Assembled on Ultra-thin Flexible Substrates. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.

Chin, Erica, Templated Synthesis and Characterization of Multi-segmented Nanowires for Sensor and Optical Device Applications. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, 2009.

Chin, Melida, Electrical Contact Resistance of Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging. Ph. D. Thesis for University of Michigan, Ann Arbor, MI, 2005.

Choi, Daechul, Statistical and Physical Analyses of Electromigration-induced Failure in Lead-free Flip Chip Solder Joints. Ph.D. Thesis for University of California, Los Angeles, CA, 2011.

Choi, Sunglak, An Investigation of Aging Kinetics and Creep Deformation in Composite Solders with In-Situ Particulate Reinforcements. Master's Thesis for Michigan State University, East Lansing, MI, 1997.

Choi, Sunglak, Studies on In-Situ Particulate Reinforced Sn-Ag Composite Solders Relevant to Thermomechanical Fatigue Issues. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2001.

Choi, Woojin, Reliability of Pb-free Solders in Electronic Packaging Technology . Ph. D. Thesis for University of California, Los Angeles, CA, 2002.

Choubey, Anupam, Microstructural Changes Under Isothermal Aging and Their Influence on Thermal Fatigue Reliability for Tin-Lead and Lead-Free Solder Joints, Including Microstructural Changes Under Isothermal Aging in Mixed Solder Joints. Ph. D. Thesis for University of Maryland, College Park, MD, 2007.

Choudhuri, Deep, Influence of Nano-structured Chemicals on the Microstructures and Mechanical Reliability of Lead-Free Tin-Based Solders. Ph. D. Thesis for Michigan State University, MI, 2009.

Chowdhury, Md Mahmudur Rahman, Mechanical Characterization and Aging Induced Evolution of Cyclic Properties and Microstructure of Lead-Free Solder Materials. Ph. D. Thesis for Auburn University, Auburn, AL, May 2, 2020.

Ciocci, Richard C., Assessing the Migration to Lead-Free Electronic Products. Ph. D. Thesis for University of Maryland, College Park, MD, 2001.

Clore, Nicholas G., Identification and Counting Procedure for Tin Whiskers, Hillocks, and Other Surface Defects. Master's Thesis for Purdue University, Hammond, IN, Dec. 2011.

Collins, Andrew, Corrosion Inhibition for an Aluminum Substrate Bonded with an Electrically Conductive Adhesive. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, 2003.

Cool, Raymond D., The Kinetics of Polymorphic Transitions of Solids. Ph. D. Thesis for University of Virginia, Charlottesville, VA, 1928.

Courey, Karim J., An Investigation of the Electrical Short Circuit Characteristics of Tin Whiskers. Ph. D. Thesis for University of Miami, Coral Gables, FL, May 2008.

Crandall, Erika R., Factors Governing Tin Whisker Growth. Ph. D. Thesis for Auburn University, Auburn, AL, 2012.

Crandall, Michael Adam, Effect of Intermetallic Growth on Durability of High Temperature Solders (SnAg, SAC305, SAC+Mn, SnAg+Cu Nano) in Thermal and Vibration Environments . M.S. Thesis for University of Maryland, College Park, MD, 2011.

Crum II, John Alan, Production of Tin and Tin-based Alloy Spheres via Multi-Orifice Uniform Droplet Spraying. Master's Thesis for Northeastern University, Boston, MA, Apr. 2012.

Cuddalorepatta, Gayatri, Evolution of the Microstructure and Viscoplastic Behavior of Microscale SAC305 Solder Joints as a Function of Mechanical Fatigue Damage. Ph. D. Thesis for University of Maryland, College Park, MD, 2010.

Dandu, Pridhvi, Finite Element Modeling on Electromigration of Solder Joints in Wafer Level Packages. Master's Thesis for Lamar University, Beaumont, TX, Aug. 2009.

Dang, Tung C., Lead-Free Solders in Surface Mount Electronic Assemblies: Designs for Quality and Reliability. Master's Thesis for California State University, Dominguez Hills, CA, Fall 2011.

Darbandi, Payam, Crystal Plasticity Finite Element Analysis of Deformation Behaviour in SAC305 Solder Joint. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2014.

Delhaise, Andre, Solid-State Diffusion of Bismuth in Tin-Rich, Lead-Free Solder Alloys . Ph. D. Thesis for University of Toronto, Toronto, Canada, 2018.

Desrochers, Brigitte, Reliability of Soldered Joints for Aerospace Applications. Master's Thesis for Ryerson University, Toronto, Ontario, Canada, 2007.

Deubzer, Otmar, Explorative Study into the Sustainable Use and Substitution of Soldering Metals in Electronics: Ecological and Economical Consequences of the Ban of Leas in Electronics and Lessons to Be Learned for the Future. Graad van Doktor (Ph. D.) Thesis for Technische Universiteit Delft, Delft, Nederland, 2007.

Dhakal, Ramji, Failure Mechanism of Lead-Free Sn-Ag-Cu Solder BGA Interconnects. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2005.

Dhakal, Ramji, Microstructure Based Experimental and Finite Element Analysis of Failure Mechanism of Pb-Free BGA Interconnects. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2008.

Dhiman, Rajat, Design and Qualification of a Robust Polyurethane Based Conformal Coating Process for SODIMMs. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2018.

Diaz Gonzalez, Alfredo J., Pb-Free Electronics: From Nanotechnology to Combinatorial Materials Science. Master's Thesis for University of Puerto Rico, Mayaguez, Puerto Rico, 2013.

Dimitrovska, Aleksandra, Mitigation Strategies of Tin(Sn) Whisker Growth, Ph. D. Thesis for Southern Methodist University, Dallas, TX, December 19, 2009.

Ding, Fei, Flip Chip and Lid Attachment Assembly Process Development. Ph. D. Thesis for Auburn University, Auburn, AL, Dec. 15, 2006.

Ding, Min, Investigation of Electromigration Reliability of Solder Joint in Flip-Chip Packages. Ph. D. Thesis for the University of Texas at Austin, Austin, TX, Aug. 2007.

Doerk, Gregory Stephen, Synthesis, Characterization, and Integration of Silicon Nanowires for Nanosystems Technology. Ph. D. Thesis for University of California, Berkeley, Berkeley, CA, Fall 2010.

Dong, Fei, Polyurethane-Based Conformal Coatings for Tin Whisker Mitigation. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2018.

Dong, Jaimee Ilene, The Effects of the Transition from Tin-lead to Lead-free Solder on Metal Flow in the United States. Ph. D. Thesis for Yale University, New Haven, CT, May 2008.

Du, Yingjie, Mechanical Properties Characterization of Lead-Free Solder Bumps and Ultra-Low-K Dielectrics by Nanoindentation. Ph. D. Thesis for University of Texas at Dallas, Dallas, TX, May 2015.

Dudek, Martha A., Microstructure, Mechanical and Oxidation Behavior of RE-containing Pb-free Solders. Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2009.

Edington, Joe Don, Development and Characterization of Cerium Oxide Coatings Deposited by Spontaneous Processes on Metallic Substrates. Ph. D. Thesis for University of Missouri - Rolla, Rolla, MS, 2004.

Ege, Efe Sinan, Thermo-mechanical Properties and Integrity of Metallic Interconnects in Microelectronics. Ph. D. Thesis for University of New Mexico, Albuquerque, NM, Dec. 2003.

Elbarbary, Mostafa, Elasto-Plastic Material Properties of Lead-Free Solder by Finite Element Analysis and Nanoindentation Test. Master's Thesis for Lamar University, Beaumont, TX, May 2018.

Emery, Robert Thomas, Isotropic Conductive Adhesives for Use in the Microelectronics Industry . Master's Thesis for University of Toronto, Toronto, Canada, 1996.

Faizan, Mohammad, Experimental Study and Modeling of Metal Dissolution and Intermetallic Compound Growth During Soldering. Ph. D. Thesis for University of Akron, Akron, OH, Dec. 2007.

Fallah-Adl, Ali, Development of a Robust and Integrated Methodology for Predicting the Reliability of Microelectronic Packaging Systems. Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2013.

Fang, Tong, Tin Whisker Risk Assessment Studies. Ph. D. Thesis for University of Maryland, College Park, MD, 2005.

Fei, Huiyang, Multiscale Modeling of Mechanical Shock Behavior of Environmentally-Benign Lead-Free Solders in Electronic Packaging. Ph. D. Thesis for Arizona State University, Tempe, AZ, August 2011.

Feyissa, Frezer Assefa, A Reliability Study on Tin Based Lead Free Microjoint Including Intermetallics and Void Evolution. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2015.

Fiedler, Brent Alan, Fatigue Failure Kinetics and Structural Changes in Lead-Free Interconnects due to Mechanical and Thermal Cycling. Ph. D. Thesis for Northwestern University, Evanston, IL, June 2010.

Fojas, Paul B., The Influence of Cold Work on the Wettability of Pb-Free Solders on Copper. Master's Thesis for San Jose State University, San Jose, CA, Dec. 2002.

Forest, Louis, Soudures Sans-Plomb Pour la Microelectronique. Master's Thesis for Ecole Polytechnique de Montreal, Montreal, Canada, Apr. 2008.

Fountoukidis, Evangelos, Thermo-Mechanical Response of Monolithic and NiTi Shape Memory Alloy Fiber Reinforced Sn-3.8Ag-0.7Cu Solder. Masters Thesis for Naval Postgraduate School, Monterey, CA. Sept. 2005.

Fukuda, Yuki, Experimental Investigations of Whisker Formation on Tin Platings . Ph. D. Thesis for University of Maryland, College Park, MD, 2005.

Gagliano, Robert Andrew, Characterization of the Growth Behavior of Cu-Sn Intermetallics in Liquid Tin/Solid Copper Reaction Couples. Ph. D. Thesis for Northwestern University, Evanston, IL, Dec. 2002.

Gan, Hua, Polarity Effect of Electromigration on Intermetallic Compound (IMC) Formation in Pb-free Solder V-groove Samples. Ph. D. Thesis for University of California, Los Angeles, CA, 2004.

Gao, Fan, Fundamental Investigation and Development of Lead-Free Nanosolders for Nanowire Assembly and Nano-Joining. Ph. D. Thesis for University of Massachusetts Lowell, Lowell, MA, 2012.

Gao, Fan, Lead-Free Nano-solders on Metallic Nanowires: Synthesis, Characterization, and Thermal Reflow Properties. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, April 21, 2009.

Gao, Mao, The Intermetallic Formation and Growth Kinetics at the Interface of Near Eutectic Sn-Ag-Cu Solder Alloys and Au/Ni Metallization. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2010.

George, Elviz, Thermal Cycling Reliability of Lead-Free Solders (SAC305 and Sn3.5Ag) for High Temperature Applications. Master's Thesis for University of Maryland, College Park, MD, 2010.

Ghorbani, Hamid Reza, Analytical Modeling of Thermal Stresses in Solder Joints - Application to Reliability Prediction. Ph. D. Thesis for University of Toronto, Toronto, Canada, 2006.

Ghosh, Santaneel, A Non-contact Measurement Technique at the Micro Scale. Ph. D. Thesis for University of Arizona, Tucson, AZ, 2005.

Ghosh, Santanu, Finite Element Analysis of Moisture and Thermal Induced Stress in Flip Chip Packages. Master's Thesis for University of Texas at Arlington, Arlington, TX, May 2006.

Gill, Amares Singh, Influence of Alumina and Titanium Dioxide Nanoparticles Reinforcement on Sn-3.0Ag-0.5Cu and Sn-58Bi Solder Alloys. Master's Thesis for Multimedia University, Malaysia, July 2015.

Godbole, Gaurav Vinod, Pad Cratering: Characterizing Crack Propagation and the Effects of Humidity and Reflow on Reliability. Master's Thesis for State University of New York at Binghamton, Binghamton University, Binghamton, NY, 2009.

Goland, Allen Nathan, Thermoelectric Properties of Gray Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, Aug. 1956.

Goldstein, Julia L. Freer, Microstructural Development and Mechanical Behavior of Eutectic Bismuth-Tin and Eutectic Indium-Tin in Response to High Temperature Deformation (Lawrence Berkeley Laboratory Report LBL 34909). Ph. D. Thesis for University of California, Berkeley, CA, Nov. 1993.

Gong, Jicheng, Microstructural Features and Mechanical Behaviour of Lead Free Solders for Microelectronic Packaging. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, 2007.

Gopakumar, Sunil, An Experimental Approach to Develop Process Windows for Lead-Free Flip Chip Assembly from a Yield and Reliability Perspective. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2003.

Gordon, Matthew, A Nacreous Self-Assembled Nanolaminate for Corrosion Resistance on 2024-Al Alloy. Masters Thesis for Virginia Polytechnic Institute and State University, Blacksburg, VA, May 24, 2001.

Gosavi, Mridula, Reliability Testing and Modeling of Linear Image Sensor Devices. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2006.

Greene, Christopher M., Lead-Free Solder Paste Printing for EMS Providers. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2001.

Greenlaw, Tamara, Cross-Functional Environmental Initiatives: Addressing Restriction of Hazardous Substance (RoHS) Technical Challenges at Sun Microsystems. Master's Thesis for Massachusetts Institute of Technology, Cambridge, MA, June 2005.

Gregory, Patrice Belnora, Comparison of Interconnect Failures of Electronic Components Mounted on FR-4 Boards with Sn37Pb and Sn3.0Ag0.5Cu Solders Under Rapid Loading Conditions. Ph. D. Thesis for University of Maryland, College Park, MD, 2010.

Groen, Luiken Jan, Kinetiek van de Allotrope Omzetting in Tin. Echeikundig Ingenieur Thesis, Delft, Netherlands, Oct. 31, 1956.

Gu, Huandi, Interfacial Reaction of Sn-Based Solder Joint in the Package System . Master's Thesis for University of Texas at Arlington, Arlington, TX, Aug. 2014.

Guinane, James, Rework Methods for Stacked PCB SMT Assemblies. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2008.

Gullapalli, Vikranth, Study of Metal Whiskers Growth and Mitigation Technique using Additive Manufacturing. Master's Thesis for University of North Texas, Denton, TX, Aug. 2015.

Guo, Fu, Studies on Lead-Free Solders Reinforced with Mechanically-Incorporated Cu, Ag, and Ni Particles. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2002.

Guo, Weiqing, Testing Methodology for Reflow Soldering Process Compatibility Evaluation of Surface Mount Technology. Ph. D. Thesis for University of Texas at Austin, Austin, TX, May 2001.

Guruprasad, Pradosh, Comparison of High Speed Impact Test of Solder Joints with Board Level Drop Test. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2013.

Hamid, Mohd Foad Abdul, Thermomigration: An Experimental Damage Mechanics Study on Nanoelectronic Lead-Free Solder Alloys. Ph. D. Thesis for State University of New York at Buffalo, Buffalo, NY, May 2008.

Han, Chunfen, Electrodeposition of Pb-free, Sn-based Alloy Solder Films. Ph. D. Thesis for University of Alberta, Edmonton, Canada, Fall 2009.

Han, Jung Kyu, Effect of Thermo-Electromigration on Copper Dissolution and Intermetallic Compound Formation in Flip-Chip Pb-free Solder Joints. Ph. D. Thesis for University of California, Los Angeles, CA, 2011.

Han, Sungwon, Assessment of an Electrical Shorting and Metal Vapor Arcing Potential of Tin Whiskers. Ph. D. Thesis for University of Maryland, College Park, MD, 2012.

Haspel, Dan, Developing a Dual-Layer System for the Mitigation of Tin Whiskers . Ph. D. Thesis for LOUGHBOROUGH University, Loughborough, United Kingdom, 2018.

Haswell, Peter Lewis, Durability Assessment and Microstructural Observations of Selected Solder Alloys. Ph. D. Thesis for University of Maryland, College Park, MD, 2001.

Hegde, Pradeep, Mechanical Behaviour and Reliability of Sn3.8Ag0.7Cu Solder for a Surface Mount Assembly. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, Dec. 2008.

Hensler, Donald Henry, Oscillatory Microwave Magnetoconductivity in Gray Tin. Ph. D. Thesis for University of Wisconsin, Madison, WI, Jan. 1963.

Hinkley Jr., Everett David, Oscillatory Magnetoresistance in Gray Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1963.

Hodges, S. LeAnn, Evaluation of Lead Free Solder and No-Clean Flux for Attachment of High Power Components to Direct Bond Copper. Master's Thesis for University of Kentucky, Lexington, KY, 1996.

Horvath, Barbara, Examination of Tin Whisker Growth in Electronic Assemblies. Ph. D. Thesis for Budapest University of Technology and Economics, Budapest, Hungary, 2012.

Hossain, Mohammad Masum, Development of Constitutive Equation Parameters and Reliability Evaluations of SnAgCu Interconnects. Ph. D. Thesis for University of Texas, Arlington, TX, May 2006.

How, Yew Seng, Modeling of Impression Testing to Obtain Mechanical Properties of Lead-Free Solders Microelectronic Interconnects. Masters Thesis for Naval Postgraduate School, Monterey, CA. Dec. 2005.

Huang, Xingjia, Investigation and Analysis on the Solder Ball Shear Strength of Plastic Ball Grid Array, Chip Scale, and Flip Chip Packages with Eutectic Pb-Sn and Pb-free Solders. Ph. D. Thesis for Hong Kong University of Science and Technology, Hong Kong, Jan. 2003.

Huang, Zhe, Fracture of Lead-Free Solder Joints for Electronic Applications: Effects of Material, Processing and Loading Conditions. Ph. D. Thesis for Washington State University, Washington, May 2013.

Huang, Zhiheng, Materials Issues in the Transition to Lead-Free Solder Alloys and Joint Miniaturization. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, Sept. 2005.

Hughes, William L., Synthesis and Characterization of Zinc Oxide Nanostructures for Piezoelectric Applications. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, Dec. 2006.

Hwang, Tae-Kyung, Effects of microstructure on material behaviors and fatigue properties of lead-free solder materials. Ph. D. Thesis for Korea Advanced Institute of Science and Technology, Daejeon, Korea, Nov. 28, 2006.

Ibitayo, Oladimeji Olalekan, Evaluation of Various Die-Attachment Materials and Processes for Power Electronics Packaging. Master's Thesis for Howard University, Washington, D.C., Dec. 2008.

Islam, Md Syful, Peripheral Soldering of Flip Chip Joints on Passive RFID Tags. Ph. D. Thesis for University of Nevada, Las Vegas, NV, May 2011.

Islam, Mohd Nokibul, Investigations on Damage Mechanics and Life Prediction of Fine-Pitch Electronics in Harsh Environments. Ph. D. Thesis for Auburn University, Auburn, AL, Aug. 8, 2005.

Iyer, Ganesh R., Role of Intermetallics for Both Tin-Lead and Lead-Free Solder Structures and Its Solder Pad Combination. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2005.

Iyer, Satyanarayan Shivkumar, Assembly, Reliability, and Rework of Stacked CSP Components. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2008.

Jadhav, Susheel Ganeshrao, Stress Relaxation in Lead-Free Solder Joints. Master's Thesis for Michigan State University, East Lansing, MI, 2001.

Jafreen, Rifat, A Cost Model for Assessing the Transition to Lead-Free Electronics . Master's Thesis for University of Maryland, College Park, MD, 2008.

Jain, Sameer, Research and Application of a Thermal Management Device (CoolCap(TM)) for Electronic Assemblies. Master's Thesis for State University of New York, Binghamton, NY, 2006.

Jain, Sujit, Green Synthesis and Applications of Polyaniline Derivatives. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, 2009.

Jakkali, Vaidehi, Finite Element Modeling of the Effect of Reflow Porosity on the Mechanical Behavior of Pb-free Solder Joints. Master's Thesis for Arizona State University, Tempe, AZ, Dec. 2011.

Janiuk, Szymon, Tin Whisker Growth and Mitigation with a Nanocrysytalline Nickel Coating . Master's Thesis for University of Toronto, Toronto, Ontario, Canada, 2015.

Jaradat, Younis, Reliability of SnAgCu and Mixed Solders under Variable Loading Conditions. Ph. D. Thesis for State University of New York, Binghamton, NY, 2012.

Jiang, Hongjin, Synthesis of Tin, Silver and Their Alloy Nanoparticles for Lead-Free Interconnect Applications. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, Apr. 2008.

Jiang, Tong, Modeling of Failure Mechanism and Life Prediction of Lead-Free BGA Solder Joint under Repetitive Mechanical Drop Loading. Ph. D. Thesis for Hong Kong University of Science and Technology, Hong Kong, Sept. 2012.

Johnson, Michael R., Evaluating Remanufacturing and Demanufacturing for Extended Producer Responsibility & Sustainable Product Management. Ph. D. Thesis for University of Windsor, Windsor, Ontario, Canada, Jan. 2002.

Joshi, Rahul V., Thermo-mechanical Behavior of Tin-Lead and Lead-Free Ceramic Column Grid Array Packages. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2005.

Joshi, Shantanu M., On Controlling and Correlating Microstructure of Pb-Free Solder Joints to Reliability under Accelerated Loading Conditions. Master's Thesis for State University of New York at Binghamton, Binhamton, NY, 2013.

Juarez, Joseph Moses, Accelerated Life Testing of Electronic Circuit Boards with Applications in Lead-Free Design. Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2012.

Kabade, Rajendra R., Metallurgical Investigation of Ag-Cu-Sn Lead-Free Solder with the Addition of Au. Master's Thesis for University of Texas at Arlington, Arlington, TX, Aug. 2003.

Kagwade, Sanjay Vasudeo, Surface Analytical and Electrochemical Studies of Aircraft Alloy Pretreatments and their Influence on Corrosion. Ph. D. Thesis for State University of New York, Stony Brook, NY, Dec. 1997.

Kaila, Rishi, Investigation of Mixed Solder Assemblies & Novel Lead-Free Solder Alloys. Master's Thesis for University of Toronto, Toronto, Canada, 2011.

Kalkundri, Kaustubh Jayant, Investigation of Electromigration Behavior in Lead-Free Flip Chip Solder Bumps. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2010.

Kannammal Palaniappan, Sakthi Cibi, A Study on Process, Strength and Microstructure Analysis of Low Temperature SnBi-Containing Solder Pastes Mixed with Lead-free Solder Balls . Master's Thesis for Rochester Institute of Technology, Rochester, NY, Sept. 2016.

Kao, Hui-Ju, Effect of Cu additives on Sn whisker formation and interfacial reaction of Sn(Cu) finishes. Master's Thesis for National Central University, Jhong-Li, Taiwan, May 23, 2005.

Karunakaran, Deepak, 3D modeling of void nucleation and initial void growth due to Tin diffusion as a result of electromigration in polycrystalline lead-free solders . Master's Thesis for Arizona State University, Tempe, AZ, Aug. 2016.

Katsis, Dimosthenis C., Thermal Characterization of Die-Attach Degradation in the Power MOSFET . Ph. D. Thesis for Virginia Polytechnic Institute and State University, Blacksburg, VA, Jan. 16, 2003.

Kaushik, Muthur Srinath Purushotham, A Statistically Based Evaluation of Creep and Shear Behaviour of Monolithic and Composite Lead Free Solders for Microelectronic Applications . Master's Thesis for University of Texas at Arlington, Arlington, TX, Dec. 2004.

Keimasi, Mohammadreza, Flex Cracking and Temperature-Humidity-Bias Effects on Reliability of Multilayer Ceramic Capacitors. Ph. D. Thesis for University of Maryland, College Park, MD, 2007.

Kelly, Marion Branch, 4D Microstructural Characterization of Electromigration and Thermal Aging Damage in Tin-Rich Solder Joints. Ph. D. Thesis for Arizona State University, Tempe, AZ, July 2019.

Khasawneh, Saif S., Towards a Quantitative Mechanistic Understanding of Thermal Cycling of Lead-Free Solder Joints. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2014.

Killefer, Morgan, Whisker Growth Induced by Gamma Radiation on Glass Coated with Sn Thin Films. Master's Thesis for University of Toledo, Toledo, OH, Aug. 2017.

Kim, Dong Hyun, Reliability Study of SnPb and SnAg Solder Joints in PBGA Packages . Ph. D. Thesis for The University of Texas at Austin, Austin, TX, Dec. 2007.

Kim, Dongwook, Fluxless Flip Chip Bonding Processes and Aerial Fluxless Bonding Technology. Ph. D. Thesis for University of California, Irvine, CA, 2004.

Kim, Harqkyun, Wetting Kinetics and Interfacial Reaction of Lead(Pb)-based and lead(Pb)-free Solder Alloys on Cu and Ni Metallizations in Electronic Packaging. Ph. D. Thesis for University of California, Los Angeles, CA, 1996.

Kim, Hye-Rim, Growth and Low Frequency Noise Properties of Grey Tin Films. Ph. D. Thesis for Cornell University, Ithaca, NY, May 1991.

Kim, Jeong-Min, Effect of Aging on the Transformation of Phases in Solder Joint of PBGA Packaging. Master's Thesis for University of Texas at Arlington, Arlington, TX, Dec. 2009.

Kim, Jongsung, Fluxless Bonding Technology Using Electroplated Multilayer Solder Structures. Ph. D. Thesis for University of California, Irvine, CA, 2007.

Kim, Patrick Gu-Ho, Wetting Behaviors and Interfacial Reactions of Pb-containing and Pb-free Solder Alloys on Au, Pd, Ni Foils, Leadframes, and Under Bump Thin Film Metallizations in Electronic Packaging. Ph. D. Thesis for University of California, Los Angeles, CA, 1998.

Kindesjo, Ulrika, Phasing out lead in solders: An assessment of possible impacts of material substitution in electronic solders on the recycling of printed circuit boards. Master's Thesis for University of Lund, Lund, Sweden, Oct. 2002.

Kinney, Christopher Charles, The Effect of an Imposed Current on the Creep of SnAgCu Interconnects . Ph. D. Thesis for University of California, Berkeley, CA, Fall 2009.

Kinyanjui, Robert Kamau, Thermal Processes and Solidification Kinetics of Evolution of the Microstructure of Sn-xAg-yCu (0 <=x<=4.0; 0<=y<=1.4) Solder Alloys. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2005.

Kirkpatrick, Timothy, The Kinetics of Tin Solidification in Lead-Free Solder Joints. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2006.

Kohnke, Elton Everett, Electrical Conductivity, Magnetoresistance, and Hall Effect in Gray Tin Filaments. Ph. D. Thesis for Northwestern University, Evanston, IL, July 1955.

Koppes, John Patrick, Effect of Crystallographic Orientation on Hillock Formation in Thermally Cycled Large Grain Tin Films. Ph. D. Thesis for Purdue University, West Lafayette, IN, Aug. 2012.

Kosiba, Eva, Characterization of Low Melting Temperature, Low-Ag, Bi-Containing, Pb-Free Solder Alloys. Master's Thesis for University of Toronto, Toronto, Canada, 2016.

Kumar, Santosh, Microvoid Formation and Kirkendall Effect in Lead-Free Solder Joints , Ph. D. Thesis for Purdue University, West Lafayette, IN, Aug. 2010.

Ladani, Leila Jannesari, Damage Initiation and Evolution in Voided and Unvoided Lead Free Solder Joints Under Cyclic Thermo-mechanical Loading. Ph. D. Thesis for University of Maryland, College Park, MD, 2006.

Lam, Carl, Integrating Hazardous Materials Characterization and Assessment Tools to Guide Pollution Prevention in Electronic Products and Manufacturing. Ph. D. Thesis for University of California, Davis, CA, 2011.

Lara, Leticia, Effect of Grain Orientation on Electromigration in Sn-0.7Cu Solder Joints. Master's Thesis for Arizona State University, Tempe, AZ, Dec. 2013.

Lavine, Charles Frederic, Two-band Galvanomagnetic Effects in Gray Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1968.

Lee, Hoyong, Avionics Reliability Assurance Guidelines for High Altitude Applications . Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2012.

Lee, Jong-Gi, Investigation of Thermomechanical Fatigue (TMF) Behavior in Tin-Silver Based Solder Joints. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2005.

Lee, Kyuoh, Development of Thermo-Mechanically Reliable Lead-Free Solder Alloys . Ph. D. Thesis for University of California, Berkeley, CA, Fall 2007.

Lee, Taekyeong, Electromigration and Solid State Aging of Flip Chip Solder Joints and Analysis of Sn Whisker on Lead-frame. Ph. D. Thesis for University of California, Los Angeles, CA, 2001.

Lee, Yuri, Constitutive Property Testing and Reliability Assessment of Lead-Free Solder Joint. Master's Thesis for University of Maryland, College Park, MD, 2010.

Leung, Wai-Bor, Electronic Properties of Gray Tin in the Presence of an External Magnetic Field. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1974.

Levo, Timothy James, Drop Test Energy Relationship to Reliability. Master's Thesis for State University of New York, Binghamton, NY, 2009.

Li, Dezhi, Properties and Behaviour of Pb-Free Solders in Flip-Chip Scale Solder Interconnections. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, Aug. 2005.

Li, Haiying, Study of Thermally Reworkable Epoxy Materials and Thermal Conductivity Enhancement Using Carbon Fiber for Electronics Packaging. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, Nov. 2003.

Li, Jing, Evaluation and Improvement of the Robustness of a PCB Pad in a Lead-Free Environment. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.

Li, Li, Basic and Applied Studies of Electrically Conductive Adhesives. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 1995.

Li, Shidong, A Multi-Scale Damage Mechanics Framework for Nanoelectronics Interconnects and Solder Joints. Ph. D. Thesis for State University of New York at Buffalo, Buffalo, NY, 2009.

Li, Yi, High Performance Electrically Conductive Adhesives (ECAs) for Leadfree Interconnects. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, Dec. 2007.

Li, Yuquan, Flip Chip and Heat Spreader Attachment Development. Ph. D. Thesis for Auburn University, Auburn, AL, May 9, 2009.

Li, Zhaozhi, A Novel Three Dimensional Wafer Level Chip Scale Packaging Technology- Manufacturing Process Development and Reliability Characterizations. Ph. D. Thesis for Auburn University, Auburn, AL, Aug. 9, 2010.

Lin, Dechao, Development of Lead-Free Solders Reinforced by Nanoparticles. Ph. D. Thesis for Southern Methodist University, Dallas, TX, May 20, 2006.

Lin, Xuan, An Environmentally Compliant Cerium-Based Conversion Coating for Aluminum Protection. Ph. D. Thesis for University of Missouri - Rolla, Rola, MO, 1998.

Linares, Xioranny, The Influence of Sn Orientation on the Electromigration of Idealized Lead-free Interconnects. Ph. D. Thesis for University of California, Berkeley, CA, Summer 2015.

Lindquist, Rolf Eugene, The Infrared Optical Properties of Single-crystal Gray Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1963.

Linteau, Mark W., Impression Creep in Near Eutectic Tin-Lead and Tin-Silver Solders . Master's Thesis for University of Texas at Arlington, Arlington, TX, May 1997.

Liu, Li, Deposition and Application of Electroless Ni-W-P Under Bump Metallisation for High Temperature Lead-Free Solder Interconnects. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, Nov. 2016.

Liu, Pilin, Roles of Interfacial Reaction on Mechanical Properties of Solder Interfaces. Ph. D. Thesis for University of Illinois at Urbana-Champaign, Urbana, IL, 2004.

Liu, Yingxia, Reliability Studies of Pb-Free Solder Joints Down to 1 um in Diameter . Ph. D. Thesis for University of California, Los Angeles, CA, 2016.

Liu, Yueli, Lead-Free Assembly and Reliability of Chip Scale Packages and 01005 Components. Ph. D. Thesis for Auburn University, Auburn, AL, May 11, 2006.

Lohokare, Saurabh, A Novel Conductive-Polymer-Based Integration Process for High-Performance Flip-Chip Packages. Ph. D. Thesis for University of Delaware, Newark, DE, Summer 2004.

Loomans, Michael Eugene, Phase Equilibria in Potential Pb-Free Solder Alloy Systems. Ph. D. Thesis for Northwestern University, Evanston, IL, Dec. 1999.

Lu, Daoqiang, Fundamental Understanding of Electrically Conductive Adhesives (ECA's) . Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, July 2000.

Lu, Yuan, Effect of Ag and Cu on Sn-x%Ag-y%Cu Interconnects. Ph. D. Thesis for Wayne State University, Detroit, MI, 2006.

Ma, Hongtao, Characterization of Lead-Free Solders for Electronic Packaging. Ph. D. Thesis for Auburn University, Auburn, AL, 2007.

Madeni, Juan Carlos, Mechanical properties and kinetics of intermetallics growth in four lead-free solder alloys, Sn-3.2Ag-0.8Cu, Sn-3.5Ag, Sn-0.7Cu and Sn-8.9Zn, applied to copper substrates. Master's Thesis for Colorado School of Mines, Golden, CO, Nov. 1, 2002.

Maganty, Suraj, Enhanced Conformal Coatings for Tin Whisker Mitigation. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2017.

Mahan, Kenneth Howard, Advanced Adhesion Strength Testing Methods of Thin Film Multilayers in Electronic Packaging Systems. Ph. D. Thesis for University of Maryland, College Park, MD, 2016.

Mahim Shirazi, Sam, Toward a mechanistic understanding of the damage evolution of SnAgCu solder joints in accelerated thermal cycling test. Ph. D. Thesis for State University of New York at Binghamton, 2015.

Majeed, Sulman, Rework & Reliability of Area Array Component. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2009.

Mallampati, Sandeep, High Bismuth Alloys as Lead-Free Alternatives for Interconnects in High-Temperature Electronics. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2017.

Mao, Jie, Nucleation Promotion of Sn-Ag-Cu Lead-Free Solder Alloys via Micro Alloying. Ph. D. Thesis for Rensselaer Polytechnic Institute, Troy, NY, Apr. 2014.

Marquez de Tino, Ursula, Reduction of Nitrogen Consumption of Lead-Free Reflow Processes and Prediction Models for Behaviors of Lead-Free Assemblies. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2009.

Mathai, Elizabeth, Optical Studies of Crystal Surfaces -Tellurium and Zinc-Antimony. Ph. D. Thesis for Maharaja Sayajirao University of Baroda, Vadodara, India, May 1971.

Matijevic, Ivan, Characterization of the Solvus Transformation in Ternary and Quaternary Bismuth Containing Lead-Free Solder Alloys. Master's Thesis for University of Toronto, Toronto, Canada, 2017.

Matin, Md. Abdul, Microstructure evolution and thermomechanical fatigue of solder materials. Ph. D. Thesis for Technische Universiteit Eindhoven, Eindhoven, Netherlands, Nov. 16, 2005.

Mavoori, Hareesh, Mechanical Properties and Fatigue Lifetime Prediction of Solders for Electronic Applications: Tin-Silver and Tin-Zinc Eutectics. Ph. D. Thesis for Northwestern University, Evanston, IL, 1996.

McCabe, Rodney James, Creep of InSb and SbSn Strengthened Tin-based Alloys: Effect of Precipitate Size, Shape, and Spacing. Ph. D. Thesis for Northwestern University, Evanston, IL, Dec. 2000.

McDougall, Jeffrey Lee, An Analysis of Global and Localized Creep Strains and Creep Properties of Non-Composite and Composite Lead-Free Solders at Room and Elevated Temperatures. Master's Thesis for Michigan State University, East Lansing, MI, 1998.

Mei, Yuhai, Stress Evolution in a Conductive Adhesive during Curing and Cooling . Ph. D. Thesis for University of Michigan, Ann Arbor, MI, 2000.

Mertens, James Charles Edwin, Quantifying Electromigration Processes in Sn-0.7Cu Solder with Lab-Scale X-Ray Computed Micro-Tomography. Ph. D, Thesis for Arizona State University, Tempe, AX, 2015.

Miller, Chad M., Development of a new Pb-free solder: Sn-Ag-Cu. MS Thesis for Iowa State University, Ames, IA, Feb. 10, 1995, IS-T-1728.

Mirza, Fahad, Investigation of the Impact Response of Lead-Free Electronic Assemblies and Comparison of Drop with Cyclic 4-point Bend Test. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.

Moon, Sungwook, Magnetically Aligned Z-Axis Anisotropic Conductive Adhesive and Its Applications. Ph. D. Thesis for Purdue University, West Lafayette, IN, Aug. 2010.

Morose, Gregory J., Electronics Assembly, Rework, and Reliability Evaluation Using Lead-Free Soldering Materials, Halogen-Free Laminate Materials, and Surface Finishes with Nanomaterials. Sc. D. Thesis for University of Massachusetts Lowell, Lowell, MA, 2008.

Morris, Eric Leon, Use of Cerium-Based Inhibitors in Electrochemically Deposited Coatings for the Corrosion Protection of Aluminum Alloys. Ph. D. Thesis for University of Missouri - Rolla, Rolla, MO, 2000.

Mudge Jr., Wilbur L., Kinetics of the alpha to/from beta Transformation of Pure Tin. Master's Thesis for University of Pennsylvania, Philadelphia, PA, June 1949.

Mukherjee, Shantanu, Lead-Free Wave Soldering of 'Thick' PCB Using Sn 3.8%Ag 0.07%Cu and No-Clean VOC-Free Flux. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.

Mukherjee, Subhasis, Multiscale Modeling of Anisotropic Creep Response of SnAgCu Single Crystal. Ph. D. Thesis for University of Maryland, College Park, MD, 2015.

Munukutla, Aravind, Tensile Properties of Lead Free Solders. Master's Thesis for University of Texas at Arlington, Arlington, TX, Dec. 2004.

Muza, Anthony R., Lead-Free Solutions for High and Low Temperature Solder Interconnects . Master's Thesis for Purdue University, West Lafayette, IN, Dec. 2009.

Nadimpalli, Siva Prasad Varma, Characterization and Prediction of Fracture within Solder Joints and Circuit Boards . Ph. D. Thesis for University of Toronto, Toronto, Canada, 2011.

Nagarkar, Kaustubh Ravindra, A Systems Approach to Ultra-fine Pitch Flip Chip Interconnect Packaging . Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2005.

Nair, Vineethkumar R., Estimation of Relative Rate of Copper Dissolution in Wave Soldering and Through-Hole Rework Process by Designing an Experiment for Soldering Parameters and PCB Features. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2012.

Nambiar, Sudeep, Process Development of 01005 Assembly. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.

Neuder, Heather Aurelia, In-Situ Phosphatizing Coatings for Aerospace, OEM and Coil Coating Applications. Ph. D. Thesis for Northern Illinois University, DeKalb, IL, Dec. 2003.

Nguyen, Tung Thanh, Characterization of the Elasto-plastic Behavior of Actual Sn-Ag-Cu Solder Joints Using DIC. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2010.

Nie, Lei, Temperature Cycling Reliability of Reballed and Reworked Ball Grid Array Packages in SnPb and SAC Assembly. Ph. D. Thesis for University of Maryland, College Park, MD, 2010.

Niraula, Dipesh, Physics and applications of conductive filaments in electronic structures: from metal whiskers to solid state memory. Ph. D. Thesis for University of Toledo, Toldeo, OH, May 2019.

Nourani, Amir, Strain-rate Dependent Fracture Load Prediction of Lead-free Solder Joints. Ph. D. Thesis for University of Toronto, Toronto, Canada, 2016.

Obaidat, Mazin, Reliability of Lead-Free Solders under Realistic Service Conditions . Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2013.

Oberc, Timothy James, Reliability of Lead-Free High Temperature Surface Mount Component Attaches. Master's Thesis for University of Maryland, College Park, MD, 2008.

Padilla, Eric, Characterization of Local Deformation in Pb-free Solder Joints Using Three Dimensional (3D) X-ray Microtomography. Master's Thesis for Arizona State University, Tempe, AZ, May 2012.

Panashchenko, Lyudmyla, Evaluation of Environmental Tests for Tin Whisker Assessment. Master's Thesis for University of Maryland, College Park, MD, 2009.

Panchagade, Dhananjay R., Damage Prediction of Lead Free Ball Grid Array Packages Under Shock and Drop Environment. Ph. D. Thesis for Auburn University, Auburn, AL, May 10, 2007.

Pandian, Guru Prasad, Effect of Long-term Aging on Lead-free Solder (SAC405) and Surface Finish (Pure Tin). Master's Thesis for University of Maryland, College Park, MD, 2017.

Paquette, Beth Miller, Harmonic Vibration Testing of Electronic Components Attached to Printed Wiring Boards with SAC305 and Eutectic SnPb Solder . Master's Thesis for University of Maryland, College Park, MD, 2010.

Park, Tae-Sang, A Study on Mechanical Fatigue Behaviors of Ball Grid Array Solder Joints for Electronic Packaging. Ph. D. Thesis for Korea Advanced Institute of Science and Technology, Daejeon, Korea, May 30, 2004.

Patel, Chandradip Pravinbhai, Performance Assessment of MEMS Gyroscope and Shock Durability Evaluation of SAC305-X Solders for High Temperature Applications. Ph. D. Thesis for University of Maryland, College Park, MD, 2014.

Pease, David Eugene, Deformation and Interface Morphology for the Alpha to Beta and Beta to Alpha Phase Transformation of Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1972.

Pedigo, Aaron E., The Influence of the Effective Physical Properties of Tin Electrodeposited Films on the Growth of Tin Whiskers. Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2011.

Peercy, Paul S., Helicon Propagation in Indium Antimonide and Gray Tin. Ph. D. Thesis for University of Wisconsin, Madison, WI, 1966.

Pei, Min, Effects of Lanthanum Doping on the Microstructure and Mechanical Behavior of a SnAg Alloy. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, May 2007.

Pierce, David Michael, Continuum Damage Mechanics Based Failure Prediction Methodology for 95.5Sn-3.9Ag-0.6Cu Solder Alloy Interconnects in Electronic Packaging. Ph. D. Thesis for Stanford University, Stanford, CA, June 2007.

Pinol, Lesly Agnes, Fundamental Studies of Tin Whiskering in Microelectronics Finishes . Ph. D. Thesis for University of Maryland, College Park, MD, 2010.

Plaza, Gustavo Alberto, Impact of Board Pad Finish on the SnPb and Lead-free Solder Interconnect Reliability for Leadless Chip Resistors under Random Vibration Loading. Master's Thesis for University of Maryland, College Park, MD, 2008.

Puthenparambil, Abhilash, Effect of Bonding Pressure on Reliability of Anisotropic Conductive Adhesives Joints in a Silicon-to-Flex-Substrate Interconnection. Master's Thesis for Binghamton University, State University of New York, Binghamton, NY, 2006.

Qasaimeh, Awni, Study of the Damage Evolution Function of SnAgCu in Cycling. Ph. D. Thesis for State University of New York, Binghamton, NY, 2012.

Qi, Yan, Accelerated Thermal Fatigue of SnPb and Pb-Free Solder Joints: Effect of Temperature Range and Rate of Change. Ph. D. Thesis for University of Toronto, Toronto, Canada, 2005.

Qin, Yi, Electrodeposition and Characterisation of Lead-Free Solder Alloys for Electronics Interconnection. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, Oct. 2010.

Quintero, Pedro O., Development of a Shifting Melting Point Ag-In Paste Via Transient Liquid Phase Sintering for High Temperature Environments. Ph. D. Thesis for University of Maryland, College Park, MD, 2008.

Quran, Mohammad M., Effect of Pad Location Relative to Glass Weave on Cratering and Underfill Process Improvement and Material Evaluation. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2014.

Raghavan, Venkatesh Arasanipalai, Pad Cratering: Development of a Test Protocol and Quantification of the Effects of 'Latent Damage' at the Joint Level and Assembly Level, Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2010.

Rajagopal, Subramanian, Transition of Low-Volume Complex Electronic System Industries to Lead-Free Electronics. Master's Thesis for University of Maryland, College Park, MD, 2003.

Rajathurai, Karunaharan, Synthesis and Characterization of Tin Nanorods and Tin-Indium Nanoparticles as Nanosolder Materials. Master's Thesis for University of Massachusetts, Lowell, MA, 2011.

Ramkumar, S. Manian, Process Analysis and Performance Characterization of a Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Assembly. Ph. D. Thesis for Binghamton University, State University of New York, Binghamton, NY, 2007.

Raut, Rahul, Thermal Management of Heat Sensitive Components in Pb-Free Assembly and Rework Process. Master's Thesis for State University of New York, Binghamton, NY, 2005.

Ready IV, William Judson, Reliability Investigation of Printed Wiring Boards Processed with Water Soluble Flux Constituents. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, July 2000.

Reeve, Thomas C., Nucleation, Growth, and Structure of Beta-Tin in Tin-Based Lead-Free Solders. Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2018.

Regalado, Irene Lujan, Characterization of Thermo-Mechanical Damage in Tin and Sintered Nano-Silver Solders. Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2018.

Reinbold, Lucine Kabakian, Kinetics of Interfacial Reaction and Stress Evolution in Bimetallic Copper-Tin Thin Films. Ph. D. Thesis for Brown University, Providence, RI, May 2007.

Ren, Fei, Polarity Effect of Electromigration on Mechanical Properties of Lead-Free Solder Joints. Ph. D. Thesis for University of California, Los Angeles, CA, 2006.

Reuse, Rolando, Thermomechanical Behavior of Monolithic Sn-Ag-Cu Solder and Copper Fiber Reinforced Solders. Masters Thesis for Naval Postgraduate School, Monterey, CA. Sept. 2005.

Reynolds, Heidi Linch, Creep of Two-Phase Microstructures for Microelectronic Applications (Lawrence Berkeley National Laboratory Report LBNL42733). Ph. D. Thesis for University of California, Berkeley, CA, Dec. 1998.

Rhee, Hongjoo, Roles of Service Parameters on the Mechanical Behavior of Lead-Free Solder Joints. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2005.

Robiaee, Ala Al, Evaluation of the Printability of Lead Versus Lead Free Solder Pastes . Master's Thesis for Ryerson University, Toronto, Ontario, Canada, 2005.

Rodekohr, Chad L., Material Factors Influencing Metallic Whisker Growth. Ph. D. Thesis for Auburn University, Auburn, AL, Dec. 19, 2008.

Rogers, Keith Leslie, An Analytical and Experimental Investigation of Filament Formation in Glass/Epoxy Composites. Ph. D. Thesis for University of Maryland, College Park, MD, 2005.

Roman, Bernard John, Stress-Induced Bandgap and Related Phenomena in Gray Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1969.

Rowley, Jonathan Gabriel, The Role of Soldering Process Variables on Properties of Lead-Free Solder Joints. Master's Thesis for University of Texas at Arlington, Arlington, TX, Aug. 2003.

Rozgonyi, George A., Field Emission Microscope Studies of the Effect of Crystallographic Orientation and Surface Defects on the Chemisorption and Oxidation of Copper Whiskers. Ph. D. Thesis for University of Arizona, Tucson, AZ, 1964.

Sabbagh, N. A. J., Tin Whisker Growth in the Communication Industry. Master's Thesis for Sir George Williams University, Montreal, Canada, Apr. 1973.

Sadiq, Muhammad, Design and Fabrication of Lanthanum-Doped SN-AG-Cu Lead-Free Solder for the Next Generation of Microelectronics Applications in Severe Environment , Ph. D. Thesis for Georgia Institute of Technology, Georgia, Aug. 2012.

Sajjala, Sandeep Reddy, Optimizing Stencil and Pad Design for 0201 Components in a Lead-Free Assembly. Master's Thesis for State University of New York, Binghamton, NY, 2006.

Sanapala, Ravikumar, Characterization of FR-4 Printed Circuit Board Laminates Before and After Exposure to Lead-Free Soldering Conditions. Master's Thesis for University of Maryland, College Park, MD, Aug. 2008.

Sane, Shantanu Madhavrao, Disturbed State Concept Based Constitutive Modeling for Reliability Analysis of Lead Free Solders in Electronic Packaging and for Prediction of Glacial Motion. Ph. D. Thesis for University of Arizona, Tucson, AZ, 2007.

Sani-Bakhtiari, Paymon, Surface Mount DC/DC Converter Attachment to Printed Circuit Board . Master's Thesis for University of Toronto, Toronto, Canada, 2002.

Sarobol, Pylin, Effects of Local Film Properties on the Nucleation and Growth of Tin Whiskers and Hillocks. Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2013.

Sattiraju, Seshagirirao V., Wetting Studies of Pb-Free Solders on Pb-Free PWB Finishes. Ph. D. Thesis for Auburn University, Auburn, AL, Aug. 5, 2002.

Schnabl, Karl, A Systematic Study on the Reliability of Lead-Free Solder Alternatives Including Sn Based Microbump Configurations and Cu Based Nanomaterials. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2014.

Seastrom, Charles Collmar, Observations on the Dissolution Behavior of Iron Whiskers. Ph. D. Thesis for Ohio State University, Columbus, OH, 1962.

Seddon, Michael John, Characterization and Comparison of Creep Properties for Tin-Indium-Silver Solder Joints. Master's Thesis for University of Arizona, Tucson, AZ, 1996.

Sellers, Michael S., Atomistic Modeling of the Microstructure and Transport Properties of Lead-Free Solder Alloys. Ph. D. Thesis for State University of New York at Buffalo, Buffalo, NY, August 23, 2010.

Selvaraj, Mukesh K., An Experimental Study of Electromigration in Flip Chip Packages. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.

Sengupta, Shirsho, Effects of Solder-Dipping as a Termination Re-finishing Technique . Masters Thesis for University of Maryland, College Park, MD, June 2006.

Sha, Chu-Hsuan, Silver Flip Chip Interconnect Technology and Solid State Bonding. Ph. D. Thesis for University of California, Irvine, CA, 2011.

Shah, Vatsal, Pb-Free Process Development and Microstructural Analysis of Capacitor Filter Assemblies Using Solder Preforms. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2005.

Sharon, Gilad, Modeling the Physics of Failure for Electronic Packaging Components Subjected to Thermal and Mechanical Loading. Ph. D. Thesis for University of Maryland, College Park, MD, 2011.

Shemenski, Robert Martin, The Defect Structures and Dissolution Characteristics of Iron Filamentary Single Crystals. Ph. D. Thesis for Ohio State University, Columbus, OH, 1964.

Shirley, Dwayne R., Transient and Steady-State Creep in a Sn-Ag-Cu Lead-Free Solder Alloy: Experiments and Modeling. Ph. D. Thesis for University of Toronto, Toronto, Canada, 2009.

Sidhu, Rajen Singh, Thermomechanical Behavior of Sn-Rich (Pb-Free) Solders. Ph. D. Thesis for Arizona State University, Tempe, AZ, Aug. 2007.

Singh, Harmandeep, Study of Thermal Fatigue of Wafer Level Packages under Temperature Cycling. Master's Thesis for Lamar University, Beaumont, TX, Dec. 2008.

So, William W., Fluxless Indium and Silver-Indium Bonding Processes for Photonics and High Temperature Electronics. Ph. D. Thesis for University of California, Irvine, CA, 1999.

Song, Fubin, Experimental Investigation on Testing Conditions of Solder Ball Shear and Pull Tests and the Correlation with Board Level Mechanical Drop Test . Ph. D. Thesis for Hong Kong University of Science and Technology, Hong Kong, Aug. 2007.

Song, Ho Geon, Microstructural Evolution of Eutectic Au-Sn Solder Joints (Lawrence Berkeley National Laboratory Report LBNL50573). Ph. D. Thesis for University of California, Berkeley, CA, May 2002.

Song, Yubao, Study of Pulse Plating and Reaction Mechanism of Trivalent Chromium Deposition Process. Ph. D. Thesis for Clarkson University, Potsdam, NY, Apr. 20, 2000.

Spitzner, Matthew James, Response of tin whiskers to dynamic input: Mathematical modeling and experimental property measurement. Master's Thesis for Iowa State University, Ames, IA, 2009.

Srinivas, Vikram, Modeling Rate Dependent Durability of Low-Ag SAC Interconnects for Area Array Packages under Torsion Loads. Master's Thesis for University of Maryland, College Park, MD, 2010.

Stark, Brian H., Thin Film Technologies for Hermetic and Vacuum Packaging of MEMS. Ph. D. Thesis for University of Michigan, Ann Arbor, MI, 2004.

Stinson-Bagby, Kelly, Microstructural Evolution in Thermally Cycled Large-Area Lead and Lead-Free Solder Joints. Master's Thesis for Virginia Polytechnic Institute and State University, Blacksburg, VA, June 7, 2002.

Stromswold, Eric Ivan, Characterization of eutectic tin-silver solder joints. Ph. D. Thesis for University of Rochester, Rochester, NY, 1993.

Stuttle, Christopher James, The Electrodeposition of Tin Coatings from Deep Eutectic Solvents and their Subsequent Whisker Growth. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, Sept. 2014.

Su, Bin, Electrical, Thermomechanical and Reliability Modeling of Electrically Conductive Adhesives. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, May 2006.

Su, Peng, A Study on the Reliability of Flip Chip Solder Joints. Ph. D. Thesis for Cornell University, Ithaca, NY, Jan. 2001.

Subbaiyan, Sudharsan, A Physical Model Examination of Micro-brazing Reaction with Gallium and Copper. Master's Thesis for Queen's University, Kingston, Ontario, Canada, Apr. 2005.

Subbarayan, Guhan, A Systematic Approach for Selection of Best Pb-Free Printed Circuit Board (PCB) Surface Finish. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.

Suh, Jongook, Orientation distribution, morphology, and size distribution of Cu6Sn5 intermetallic compound in reactions between molten solder and Cu in flip chip solder joints. Ph. D. Thesis for University of California, Los Angeles, CA, 2006.

Sun, Yong, Micro/Nano-Scale Investigation on Tin Alloys and Tin Dioxide Nanowires . Ph. D. Thesis for University of South Carolina, Columbia, SC, 2012.

Swanson, Tayler John, Properties of Mixing SAC Solder Alloys with Bismuth-containing Solder Alloys for a Low Reflow Temperature Process. Master's Thesis for Rochester Institute of Technology, Rochester, NY, Dec. 17, 2018.

Syarbaini, Luthfia Amra, Microstructural Evolution during Stress Relaxation of Gold Thin Films . Master's Thesis for Purdue University, West Lafayette, IN, Dec. 2013.

Tabatabaei, Salomeh, Synthesis and Characterization of Two Component Alloy Nanoparticles. Ph. D. Thesis for Rice University, Houston, TX, 2010.

Talebanpour, Babak, Microstructural Effects on Creep and Fracture Mechanics of Sn-Ag-Cu Solders. Ph. D. Thesis for Washington State University, Pullman, WA, Aug. 2015.

Tan, Wei, Development of Convective Reflow-Projection Moire Warpage Measurement System and Prediction of Solder Bump Reliability on Board Assemblies Affected by Warpage. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, Apr. 2008.

Tang, Zhenming, Interfacial Reliability of Pb-Free Flip-Chip BGA Package. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2008.

Tashtoush, Tariq H., Effect of Lead-Free Solder Joint's Size and Configuration on Mechanical Properties, Microstructure, and Aging Kinetics. Ph. D. Thesis for Binghamton University, Binghamton, NY, 2013.

Telang, Adwait U., Characterization of Deformation in Sn-Ag Lead-Free Solders During Thermomechanical Fatigue Using Orientation Imaging Microscopy. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2004.

Telang, Adwait U., Characterization of Microstructural Evolution of Crept, Aged and Thermomechanically Fatigued Eutectic Sn-Ag Solder Joints using Orientation Imaging Microscopy. Master's Thesis for Michigan State University, East Lansing, MI, 2002.

Theeven, J. G. A., Creep and Failure of Lead-Free Solder Alloys. Master's Thesis for Eindhoven University of Technology, Eindhoven, Netherlands, Mar. 2002.

Tonapi, Sandeep Shrikant, Assembly and Reliability of Lead-Free Flip Chips. Ph. D. Thesis for State University of New York, Binghamton, NY, 2001.

Tong, Michael Shou-Ming, The Use of Nickel/Aluminum Explosively Reactive Nanolayers as Localized Heat Sources in Solder Joints. Ph. D. Thesis for University of California, Los Angeles, CA, 2009.

Tu, Li-Wei, Shubnikov-de Haas and Size Effects of Substrate Stabilized Gray Tin Epilayers Grown by Molecular Beam Epitaxy. Ph. D. Thesis for Northwestern University, Evanston, IL, Dec. 1989.

Tucker, Jonathon P., Microstructural Effects on Constitutive and Fatigue Fracture Behavior of SnAgCu Solder. Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2012.

Tufte, Obert Norman, Growth and Semiconducting Properties of Gray Tin Single Crystals. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1960.

Tumne, Pushkraj Satish, Investigation of Bulk Solder and Intermetallic Failures in Pb-free BGA by Joint Level Testing. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2009.

Tunga, Krishna Rajaram, Study of Sn-Ag-Cu Alloy Reliability Through Material Microstructure Evolution and Laser Moire Interferometry. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, Aug. 2008.

Turner, Gregory Alan, A Novel Method for Direct Solder Bump Pull Testing using Lead-Free Solders. Master's Thesis for University of Rhode Island, Kingston, RI, 2015.

Vaddiraju, Sreeram, Chemical and Reactive Vapor Transport Methods for the Synthesis of Inorganic Nanowires and Nanowire Arrays. Ph. D. Thesis for University of Louisville, Louisville, KY, Dec. 2006.

Vallabhaneni, Venkata Sathya Sai Renuka, Environmental-Induced Damage in Tin (Sn) and Aluminum (Al) Alloys . Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2017.

Varghese, Joseph, Effect of Dynamic Flexural Loading on the Durability and Failure Site of Solder Inteconnects of Printed Wiring Assemblies. Ph. D. Thesis for University of Maryland, College Park, MD, 2007.

Varia, Ronak, Investigations of Polymer-Cored Solder Balls and Fan-Out Technologies in Wafer Level Packaging. Master's Thesis for Lamar University, Beaumont, TX, Aug. 2010.

Venkatadri, Vikram, Quantitative Assessment of Long Term Aging Effects on the Mechanical Properties of Lead Free Solder Joints. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2009.

Vijayanath, Vignesh, Assembly Process Development for Fine Pitch (0.4 mm) Package-On-Package Devices in a Lead-Free Assembly Environment. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2010.

Virupaxappa, Hanchinamani, Novel Additives for Conductive Epoxy Adhesive. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, 2001.

Vishwanathan, Krishnan, Process Development and Microstructural Analysis of Capacitor Filter Assemblies Using Lead Free Solder Preforms. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.

Vollweiler, Fred O. P., Intermetallic Growth at the Interface between Copper and Bismuth-Tin Solder. Masters Thesis for Naval Postgraduate School, Monterey, CA. Sept. 1993.

Wagner, Robert John, Free Carrier Reflectivity of Gray Tin Single Crystals. Ph. D. Thesis for Northwestern University, Evanston, IL, Aug. 1967.

Walleser, Jason Kenneth, Microstructure control of the Sn-Ag-Cu-X solder alloy system through nucleation catalysis of Sn. Master's Thesis for Iowa State University, Ames, IA, 2008.

Wang, Daijiao, Experimental Study of Void Formation in Solder Joints of Flip-Chip Assemblies. Ph. D. Thesis for University of Texas at Austin, Austin, TX, May 2005.

Wang, Pin J., Fluxless Bonding of Thermal Expansion Mismatch Materials. Ph. D. Thesis for University of California, Irvine, CA, 2009.

Wang, Qing, Mechanical Properties and Microstructure Investigation of Sn-Ag-Cu Lead Free Solder for Electronic Package Applications. Ph. D. Thesis for Auburn University, Auburn, AL, Dec. 16, 2005.

Wang, Rainey Yu, The Morphology Study of Zinc Electrodeposits from Alkaline Zincate Solutions. Ph. D. Thesis for University of Toronto, Toronto, Canada, 2006.

Wang, Weiqiang, Solder Joint Reliability of Sn and SnBi Finished and Refinished Sn (SAC/SnPb) SMT Packages Under Temperature Cycling Test. Master's Thesis for University of Maryland, College Park, MD, 2009.

Wang, Yibo, A Numerical Model of Anisotropic Mass Transport Through Grain Boundary Networks. Master's Thesis for Lehigh University, Bethlehem, PA, Sept. 2011.

Wang, Ying, Microstructure Evolution and Surface Defect Formation in Tin Films . Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2014.

Watts, James D., The production of lead-free solder spheres for the electronics industry using materials jetting. Master's Thesis for Loughborough University, Loughborough, United Kingdom, Feb. 2001.

Wei, Yong, Electronically Conductive Adhesives: Conduction Mechanisms, Mechanical Behavior and Durability. Ph. D. Thesis for Clarkson University, Potsdam, NY, Apr. 1995.

Welch III, Warren Cornelius, Vacuum and Hermetic Packaging of MEMS Using Solder. Ph. D. Thesis for University of Michigan, Ann Arbor, MI, 2008.

Wentlent, Luke Arthur, Evolution of the Deformation Behavior of Sn-Rich Solders during Cyclic Fatigue. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2015.

Wentlent, Luke, On the Microstructure of Pb-Free Solder Joints: Implications for Accelerated Thermal Cycling and Finite Element Modeling. Master's Thesis for State University of New York, Binghamton, NY, 2012.

Wernicki, Evan, Synthesis and Characterization of Lead-Free Tin-Silver Nanosolders and Their Application to Halogen-Free Nanosolder Pastes. Master's Thesis for University of Massachusetts Lowell, Lowell, AM, 2015.

Wolfson, Robert George, Transformation Studies of Gray - Tin Single Crystals. Master's Thesis for Northwestern University, Evanston, IL, June 1960.

Wong, Anthony Yin-Bong, Implementation and Qualification of a Prototype Tester for Reflow Soldering Process Compatibility Evaluation of Surface Mount Technology Components. Ph. D. Thesis for University of Texas at Austin, Austin, TX, Dec. 2002.

Wright, William L., Processing of NiTi Reinforced Adaptive Solder for Electronic Packaging . Masters Thesis for Naval Postgraduate School, Monterey, CA. Mar. 2004.

Wu, Chun-I, Fabrication and Site Specific Growth of Nanowires. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2006.

Wu, Ji, Electrical Characterization and Reliability Assessment of Lead-Free Solder Coated Electrical Contacts. Ph. D. Thesis for University of Maryland, College Park, MD, 2003.

Wu, Liang, Investigation of zinc whisker growth from electrodeposits produced using commercial electroplating baths. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, Dec. 2016

Xiao, Qiang, Constitutive Model Development for Lead Free Solder Alloys at Multiple Specimen Scales. Ph. D. Thesis for University of Wyoming, Laramie, WY, Dec. 2004.

Xie, Huxiao, Properties of Cerium Containing Lead Free Solder, Ph. D. Thesis for Arizona State University, Arizona, Oct. 2012.

Xing, Yan, Study of Thermal and Chemical Factors Which Influence Solidification of Tin in Near Eutectic Sn-3.0Ag-XCu Lead Free Solder. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2006.

Xu, Huili, Grain Structure Evolution of Tin-Based Lead-Free Solder Joints in Electronic Packaging Assembly and Its Impacts on the Fatigue Reliability . Ph. D. Thesis for University of Texas at Arlington, Arlington, TX, Dec. 2013.

Xu, Shuangyan, Evaluating Thermal and Mechanical Properties of Electrically Conductive Adhesives for Electronic Applications. Ph. D. Thesis for Virginia Polytechnic Institute and State University, Blacksburg, VA, Apr. 2001. link checked 8/21/2020

Xu, Xinyue, Applied Meta-Analysis of Lead-Free Solder Reliability. Master's Thesis for Arizona State University, Tempe, AZ, Dec. 2014.

Yang, Chaoran, Characterization and Modeling of the Failure Mechanism of Copper-Tin (Cu-Sn) Intermetallic Compounds in Lead-free Solder Joints. Ph. D. Thesis for Hong Kong University of Science and Technology, Hong Kong, 2015.

Yang, Fan-Yi Ou, Electromigration and Thermomigration in Pb-free SnAgCu and Eutectic SnPb Flip Chip Solder Joints. Ph. D. Thesis for University of California, Los Angeles, CA, 2007.

Yang, Hong, Mechanical and Thermomechanical Stability Issues of 96.5SN-3.5AG Solder Joints in Microelectronic Packages. Ph. D. Thesis for North Carolina State University, Raleigh, NC, 1998.

Yang, Linlin, Lead-Free Solder Reliability in Combined Environments. Ph. D. Thesis for State University of New York, Binghamton, NY, 2011.

Yang, Quan, Modeling and Characterization for Small-Scale Packaging Applications . Ph. D. Thesis for State University of New York, Binghamton, NY, 2004.

Yang, Se-Young, Reliability Evaluation for Flip-Chip Electronic packaging Using Optical Measurement Techniques. Ph. D. Thesis for Korea Advanced Institute of Science and Technology, Daejeon, Korea, Nov. 29, 2004.

Yang, Wenge, Process-Structure-Property Relationship for Eutectic Sn-Ag Solder Joints . Ph. D. Thesis for Rensselaer Polytechnic Institute, Troy, NY, Aug. 1995.

Yao, Wei, Damage Mechanics of Electromigration and Thermomigration in Electronics Packaging Solder Joints under Time Varying Current Loading. Ph. D. Thesis for State University of New York at Buffalo, Buffalo, NY, Mar. 19, 2013.

Yao, Yao, Modeling the Mechanical Properties of Intermetallic/Solder Interfaces . Ph. D. Thesis for Northwestern University, Evanston, IL, Dec. 2008.

Yazzie, Kyle, Mechanical Shock Behavior of Environmentally-Benign Pb-free Solders . Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2012.

Ye, Hua, Mechanical Behavior of Microelectronics and Power Electronics Solder Joints Under High Current Density: Analytical Modeling and Experimental Investigation. Ph. D. Thesis for State University of New York, Buffalo, NY, June 1, 2004.

Yoon, Ji-Young, A Research for the Moisture-Induced Properties of ACF Package Materials . Master's Thesis for Korea Advanced Institute of Science and Technology, Daejeon, Korea, Dec. 27, 2006.

Young, Poh-shien, Measurements of Electrical Conductivity of Filaments of Gray Tin and Gray Tin Alloys. Master's Thesis for Oklahoma Agricultural and Mechanical College (now Oklahoma State University), Stillwater, OK, May 1957.

Yu, Hao, Combined Thermal, Thermodynamic and Kinetic Modelling for the Reliability of High-Density Lead-Free Solder Interconnections. Doctor of Science in Technology Thesis for Helsinki University of Technology, Espoo, Finland, 2006.

Zahedi, Fahad, Reliability of Lead-Free Solder Under Cyclic Bending. Master's Thesis for University of Texas at Arlington, Arlington, TX, May 2006.

Zbrzezny, Adam R., Characterization and Modeling of Microstructural Evolution of Near-Eutectic Sn-Ag-Cu Solder Joints. Ph. D. Thesis for University of Toronto, Toronto, Canada, 2004.

Zha, Xu, Numerical Analysis of Lead-free Solder Joints: Effects of Thermal Cycling and Electromigration. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, Mar. 2016.

Zhan, Sheng, Surface Insulation Resistance Degradation and Electrochemical Migration on Printed Circuit Boards. Ph. D. Thesis for University of Maryland, College Park, MD, 2007.

Zhan, Yumei, Micro Zero-Insertion-Force (ZIF) Connector for Multi-Substrate Packages . Ph. D. Thesis for Michigan Technological University, Houghton, MI, Dec. 2003.

Zhang, Hongqing, Thermal and Electromigration Induced Strain and Microstructure Evolution in Metal Conductor Lines. Ph. D. Thesis for Lehigh University, Bethlehem, PA, July 2008.

Zhang, Qian, Isothermal Mechanical and Thermomechanical Durability Characterization of Selected Pb-Free Solders. Ph. D. Thesis for University of Maryland, College Park, MD, 2004.

Zhang, Rongwei, Novel Conductive Adhesives for Electronic Packaging Applications: A Way Towards Economical, Highly Conductive, Low Temperature and Flexible Interconnects. Ph. D, Thesis for Georgia Institute of Technology, Atlanta, GA, May 2011.

Zhang, Xuefeng, Chip Package Interaction (CPI) and Its Impact on the Reliability of Flip-Chip Packages. Ph. D. Thesis for University of Texas at Austin, Austin, TX, Dec. 2009.

Zhang, Yifei, The Effects of Aging on the Mechanical Behavior of Lead Free and Mixed Formulation Solder Alloys. Ph. D. Thesis for Auburn University, Auburn, AL, Aug. 9, 2010.

Zhang, Zheming, Ball Grid Array Solder Joint Reliability under Impact Test. Ph. D. Thesis for Hong Kong University of Science and Technology, Hong Kong, Aug. 2010.

Zhang, Zhongqin, Nucleation and Growth Kinetics of Tin and Tin-Silver Alloy During Initial Stages of Electrodeposition. Ph. D. Thesis for University of New Hampshire, Durham, NH, Dec. 2004.

Zhao, Ping, Creep Corrosion over Plastic Encapsulated Microcircuit Packages with Noble Metal Pre-plated Leadframes. Ph. D. Thesis for University of Maryland, College Park, MD, 2005.

Zheng, Yunqi, Effect of Surface Finishes and Intermetallics on the Reliability of SnAgCu Interconnects. Ph. D. Thesis for University of Maryland, College Park, MD, 2005.

Zhou, Bite, Characterization of Tin Crystal Orientation Evolution During Thermal Cycling in Lead-Free Solder Joints. Ph. D. Thesis for Michigan State University, Michigan, 2012.

Zhou, Jianguo, Processing of Generic Circuits by Conductive Adhesives: Geometrical and Rheological Considerations. Ph. D. Thesis for University of Akron, Akron, OH, May 2007.

Zhou, Xiaoying, Life Cycle Thinking and Assessment Tools on Environmentally-Benign Electronics: Convergent Optimization of Materials Use, End-of-Life Strategy and Environmental Policies. Ph. D. Thesis for University of California, Davis, CA, 2007.

Zhou, Yuxun, Harmonic and Random Vibration Durability Investigation for Sn3.0Ag0.5Cu Solder Interconnects. Ph. D. Thesis for University of Maryland, College Park, MD, 2008.

Zribi, Anis, Kinetics of Intermetallic Growth at the Interfaces of Soldered Metallizations. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2002.

CDROM's on Lead-Free, RoHS, and WEEE (revised 10/21/2006)

5 Steps to Lead-Free Soldering, free from Vitronics Soltec

A Guide To Lead-Free Soldering for Assemblers & Sub-Contractors, Version 2.6, $68 from Roger Bilham Consultancy

AIM Lead-Free Information, Version 4.1, from AIM.

Assembly Technology Expo, Sept. 26-28, 2006, from Nihon Superior.

e3 survival toolkit, 499 British pounds + value-added tax from eco3 (do not have)

EMC & Compliance Yearbook Plus Information Bank 2005.

Guide to Lead-Free Wave Soldering, 99 British pounds + value-added tax from Soldertec Global (do not have)

Handsoldering and De-soldering with Lead-Free Solder, 99 British pounds + value-added tax from Soldertec Global (do not have)

Lead-Free Assembly and Soldering Cook Book3, $195 from Electronics.CA Publications (do not have)

Lead-Free: Fantasy or Fact?, $75.00 from MEPTEC (do not have)

Lead-Free Hand Soldering & DeSoldering Interactive CD-ROM, $195.00 from electronics.ca publications (do not have)

Lead-Free Solder CD-ROM, $570 for NCMS members, $670 for non-members from National Center for Manufacturing Sciences (do not have)

Lead-Free Solder Implementation Summit, $75.00 from MEPTEC (do not have)

Lead-Free Soldering Interactive Cook Book 3, $195.00 from electronics.ca publications

Lead-Free Watch: Countdown to July 1, 2006.

MacDermid's Patented Immersion Silver Solderability Preservative

Reflow Soldering with Lead-Free Solder Paste, 99 British pounds + value-added tax from Soldertec Global (do not have)

RoHS Ready Lead-Free Solutions, from Kester.

Round Robin Testing and Analysis of Lead Free Solder Pastes with Alloys of Tin, Silver and Copper, $99.00 for members and $199.00 for non-members from SMTA

SMTA TechScan Compendium: The State-of-the-Art in Pb-free Soldering Technology, $85.00 for members and $105.00 for non-members from SMTA

SN100C Lead-Free Alloy, Version 1.3, from AIM.

Summit on Lead-Free Solder Implementation, $75.00 from MEPTEC (do not have)

Papers, Reports, and Magazine Articles on Lead-Free, RoHS, and WEEE (revised 2/5/2021)

First author's last name beginning with: A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

????

"(editorial)," SMTA Journal, vol. 19 no. 1, pp. 10, Jan.-Mar. 2006.

"0201 capacitors creating process problem," Circuitnet, Sept. 25, 2006.

"100% Sn Plating Whisker Growth Study," AMD, Jan 10, 2003.

"12-month shelf life for chemical silver," evertiq, Nov. 11, 2005.

"1st Meeting of RoHS Enforcement Bodies Network."

"2004 - 10/01/2004 - OSHA Proposes Revised Rule on Hexavalent Chromium," Occupational Safety & Health Administration, Oct. 1, 2004.

"2006 (2nd) TMS State of Art Pb-free Technology Workshop Panel Discussion Summary," 2006 Lead-Free Technology Workshop, San Antonio, TX, Mar. 12, 2006, pp. xx-xx.

"2006: The Year of RoHS," Manufacturing.net, June 21, 2006.

"2008 Review of Directive 2002/96/EC on waste electrical and electronic equipment (WEEE),"

"2009 Industry Forecast," Surface Mount Technology (SMT), vol. 22 no. 12, pp. 8,11-17,19-20,22-23, Dec. 2008.

"3M provides information on the new OSHA hexavalent chromium standard," Welding Design and Fabrication, vol. 79 no. 5, pp, 6-7, May 2006.

"7 more RoHS exemptions proposed," evertiq, June 6, 2008.

"A big answer to a WEEE problem," Department of Trade and Industry, July 25, 2006.

"A Brief History of Lead," EDN, vol. 47 no. 9, pp. 57, Apr. 18, 2002.

"A Citizen's Guide to Producer Responsibility," Feb. 2003.

"A Flood of New Environmental Laws," SourceESB, July 13, 2006.

A Guide To Lead-Free Soldering for Assemblers & Sub-Contractors, Version 2.6, $68 from Roger Bilham Consultancy

"A legal look at environmental compliance," SourceESB, Mar. 22, 2006.

"A New Standard for Tin-Nickel I. S. O. 2179: International Standard for Electroplated Coatings of Tin-nickel Alloy," Tin and its Uses, no. 94, pp. 7, 1972.

"A new way to grow microwires," Electronics Manufacture and Test , Feb. 4, 2011.

"A practical precaution against introducing zinc whiskers," finishing.com.

"A quiet introduction for the RoHS Directive?," Components in Electronics, vol. xx no. xx, pp. xx-xx, Aug. 2006.

"A Research Program on SAC Lead Free Alloys," IPC Solder Products Value Council.

"A Review of California and Maine's electronics recycling programs," INFORM, Dec. 2006.

"A round-table discussion examining issues around the forthcoming European Restrictions of Hazardous Substances (RoHS) and electrical waste (WEEE) directives," Electronics Weekly, Feb. 11, 2004.

"A Study of Lead-Free Wave Soldering,", AIM.

"A WEEE bit late," Electronics Manufacture and Test, pp. xx-xx, Mar. 2006.

"A WEEE Warning," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Sept. 19, 2007.

"A Year of Many Conversions!," Lead-Free Connection, vol. 4 no. 1, pp. 1, Feb. 2007.

"A320's electrical system falters," evertiq, Aug. 11, 2008.

"About RoHS enforcement," Dataweek, vol. xx no. xx, pp. xx-xx, Sept. 20, 2006.

"Achieving a Competitive Advantage Through RoHS Compliance," PCB007 , July 28, 2005.

"ACI Lead Free Manufacturing for Navy Systems," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.

"Act for Resource Recycling of Electrical and Electronic Equipment and Vehicles - Korea RoHS, WEEE & ELV," ERA Technology, 2008.

"Actel goes green on 100% of its FPGA products," SourceESB, Dec. 15, 2004.

"Action to take on WEEE and RoHS," Electronics Weekly, Dec. 10, 2004.

"Adaption to scientific and technical progress under Directive 2002/95/EC," Oko-Institut e.V., 2007.

"Additional Revisions to the RoHS Directive = A Bumpy Ride for IPC Members," IPC Review, vol. 2 no. 2, pp. 8, Mar./Apr. 2009.

"Additional RoHS Exemptions Sought," Circuits Assembly, vol. 16 no. 3, pp. 8, Oct. 2005.

"Advanced AP Maine Touts Recycling Computer Monitors," Appliance Design, vol. xx no. x, pp. xx-xx, Jan. 2006.

"Advantages and Disadvantages of AOI Methodologies in Lead-Free PCB Assembly," AOI Solutions.

"Advantages of vapour phase reflow for lead-free soldering," Dataweek, Oct. 1, 2008.

"AEM, Inc."

"Africa Discusses E-waste at COP8," SMT Web Exclusive Article.

"After RoHS Deadline - Glut or Shortages?," SourceESB, Nov. 16, 2006.

"Agere discovers lead-free packaging method," Advanced Packaging , vol. xx no. xx, pp. xx-xx, Sept. 21, 2004.

"Agere Systems Uncovers Method to Overcome Barriers to Global Lead-Free Chip Implementation," Agere Systems, Sept. 20, 2004.

"Agere's Lead-free (Pb-free) Plating Capabilities Matte tin (Sn) versus matte Sn-over-nickel (Ni) underplate," Agere, Sept. 2004.

"Ageus now offers China RoHS compliance services," EE Times - Asia , vol. xx no. xx, pp. xx-xx, Apr. 4, 2006.

"Ageus Solutions: A Leader in UK WEEE Support," PCB007, Jan. 5, 2007.

"Ageus Solutions Launches New China RoHS Services," PCB007, Mar. 31, 2006.

"Ageus Solutions Provides China RoHS Services to Electronics Industry," PCB007, Oct. 24, 2006.

"AIM Lead-Free Validation Program," AIM.

"Alarming Facts About RoHS Compliance," Printed Circuit Design and Manufacture, vol. 23 no. 9, pp. 10, Sept. 2006.

"All Aboard -- Next Stop is Lead-Free Electronics," Lead-Free Connection, vol. 1 no. 1, pp. 1, July 2004.

"Allotropic Transformation of Tin," Tin and its Uses, no. 161, pp. 3, 1989.

"Allotropy," Advanced Materials & Processes, vol. 167 no. 2, pp. 81, Feb. 2009.

"Alloy Selection Team: Alloy Database," Mar. 16, 2000.

"Alloy Temperature Chart," Kester, July 19, 2002.

"Alloy Verdict: 'No Difference'," Printed Circuit Design and Manufacture , vol. 20 no. 10, pp. 10, Oct. 2003.

"Alloys that we've selected."

"Alternatives," Transactions of the Institute of Metal Finishing, vol. 75 no. 1, pp. B3-B4, Jan. 1997.

"Alternatives to Cadmium Plating: Reflections Five Years Later," Plating and Surface Finishing, vol. 69 no. 11, pp. 34-43, Nov. 1982.

"An Assessment of the Use of Lead in Electronics Assembly: Part 1," Circuit World, vol. 19 no. 2, pp. 18-24, 1993.

"An Assessment of the Use of Lead in Electronics Assembly: Part 2," Circuit World, vol. 19 no. 3, pp. 25-31, 1993.

"An Inherent Advantage of Tin-Nickel Coatings: Compressive State Reduces Corrosion," Tin and its Uses, no. 55, pp. 2-3, 1962.

"An Interview with the Editor of a new book, "Lead-Free Solder Interconnect Reliability"," Circuitnet, Jan. 30, 2006.

"An Introduction to Lead-Free Soldering," AIM.

"An Update: Elimination of Lead from Electronics," Boeing Environmental Technotes, vol. 7 no. 4, pp. 1-4, Nov. 2002.

"Analytical Procedures for Portable Lead-Free Alloy Test Data," IPC Solder Products Value Council Lead-Free Technical White Paper, May 2010.

"Analyzing lead-free soldering defects in wave soldering using Taguchi methods," Dataweek, vol. xx no. xx, pp. xx-xx, Feb. 23, 2005.

"Analyzing Thermal Fatigue," Circuits Assembly, vol. 18 no. 1, pp. 52-53, Jan. 2007.

"Announcement of "Guidelines for the Management of Chemical Substances in Products"," Japan Green Procurement Survey Standardization Initiative (JGPSSI), Sept. 27, 2005.

"Another Candidate Wave Solder."

"Another satellite to replace wayward pager relay," CNN Interactive, May 20, 1998.

"Anti-Counterfeiting Trade Agreement Negotiations Urged to Start," Circuitnet, Mar. 6, 2008.

"Apathy over legislation could damage electronics industry," European Electronics Engineer, vol. xx no. xx, pp. xx-xx, Nov. 11, 2003.

"Application for an additional exemption from RoHS for Fine Pitch Flexible Applications."

"Application of Fritsch Laboratory Mills for WEEE and RoHS Tests," Aufbereitungs-Technik/Mineral Processing, vol. 47 no. 6, pp. 48, June 2006.

"Applications of Low-Temperature Tin-bismuth and Tin-bismuth-silver Lead-free Alloy Solder Pastes," Surface Mount Technology (SMT), vol. 28 no. 6, pp. 12,14-16,18-20,22-24,26-28,30,32-33, July 2013.

"Applications of Tin-Nickel Alloy Electroplate," Tin and its Uses , no. 78, pp. 5-6, 1968.

"Approach and Return of Experience on Lead Free Introduction in Various Industrial Sectors," SERMA Technologies.

"Are Counterfeit Parts Going Compliant?," SourceESB, Jan. 11, 2006.

"Are electronics companies on target for lead-free RoHS deadlines?," Circuit World, vol. 31 no. 3, pp. xx, 2005.

"Are equipment companies mandated to meet lead-free requirements?," Circuitnet, Apr. 24, 2006.

"Are the military and telecommunications industries off the hook on RoHS?," SourceESB, Jan. 26, 2005.

"Are You Ready for RoHS?," EDN, July 21, 2005.

"Are You Ready for RoHS?," ECN Supplement, pp. 1, Nov. 2005.

"Are You Ready for RoHS Compliance?," Review, vol. 45 no. 9, pp. 2-5, Nov. 2004.

"Are you ready to collect & recycle WEEE in Germany from 23 March?," evertiq, Mar. 17, 2006.

"Are your parts the real deal?," Electronics Manufacture and Test , vol. xx no. xx, pp. xx-xx, June 9, 2008.

"Are Zinc Whiskers Growing in Your Computer Room?"

"Arrow adds green data," Purchasing, vol. xx no. xx, pp. xx-xx, Aug. 4, 2005.

"Arrow Electronics Delivering Critical Environmental Data On More Than 2.3 Million Components," Arrow Electronics, June 29, 2004.

"Arrow Electronics Enables OEMs to Check RoHS Compliancy at No Cost through ArrowNAC.com," PCB007, Apr. 20, 2006.

"Arrow Electronics Offers Critical Environmental Data for Customers," PCB007, July 13, 2005.

"Arrow Helps Get the Lead Out."

"Arrow releases WEEE-guide," evertiq, Aug. 2, 2005.

"Artesyn's Approach to RoHS Compliance," Artesyn, Sept. 14-15, 2005.

"As RoHS Deadline Looms, Universal Compliance in Doubt," Supply & Demand Chain Executive, vol. xx no. x, pp. xx-xx, xxxx.

"Asian firms on track to meet RoHS rules," emsnow, July 11, 2006.

"Ask Dr RoHS: problems with lead-free BGA solder balls," Electronics Weekly, Apr. 20, 2006.

"Ask the Expert," Medical Product Manufacturing News, vol. xx no. xx, pp. xx-xx, 2006.

"ASK the Experts," TUV Rheinland World News, pp. 2, Mar./Apr. 2005.

"ASK the Experts," TUV Rheinland World News, pp. 8, Sept./Oct. 2005.

"Assemblers to Suppliers: Which Lead-free Alloy?," Surface Mount Technology (SMT), vol. 14 no. 2, pp. xx-xx, Feb. 2000.

"Assemblies Go PoP," Circuits Assembly, vol. 18 no. 12, pp. 34-35, Dec. 2007.

"Assembling High-Lead (Pb) DS2502 Flip-Chips in a Pb-Free Assembly Flow," EE Times - Asia, vol. xx no. xx, pp. xx-xx, June 8, 2005.

"Assembling High-Lead (Pb) DS2761 Flip-Chips in a Pb-Free Assembly Flow," Maxim Application Note 3599, Sept. 16, 2005.

"Assembly Guidelines: Sterling Silver & MacStan Immersion Tin Coated PCB's," HKPCA Journal, no. 12, pp. 1-7.

"Assembly Lines: Japan Leads in Lead-Free," Assembly, vol. xx no. xx, pp. xx-xx, Oct. 2004.

"Assessing Life-Cycle Impacts," EPA, May 2002.

"Assessment of Responses to the Third Consultation Documents: WEEE and RoHS Directives," DTI, Nov. 2004.

"ASTM Declarable Substances Committee Publishes New REACH Standard," CircuiTree, vol. 21 no. 6, pp. xx-xx, June 2008.

"ASTM Establishes Committee on "Declarable Substances"," Conformity , vol. 10 no. 11, pp. 50, Nov. 2005.

"ASTM Establishes Committee on "Declarable Substances"," Conformity , pp. 214, Conformity 2006: The Annual Guide.

"At Deadline," Waste News, vol. xx no. x, pp. xx-xx, Feb. 27, 2006.

"At the Sharp, (Toshiba and Panasonic) end of US recycling," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Jan. 7, 2008.

"Autocatalytic Deposition of Tin," Tin and its Uses, no. 128, pp. 10-11, 1981.

"Avnet offers RoHS compliance data," Purchasing, vol. xx no. xx, pp. xx-xx, Nov. 4, 2004.

"Avoid the BGA Voids," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 11, pp. 40, Nov. 2010.

"Back Up Block 1 Whisker on Cu," June 6, 2003.

"Back Up Block 2 Whisker on NiFe," June 6, 2003.

"Back Up Block 3 Solderability," June 6, 2003.

"Background information on the environmental and health threat posed by Cadmium, in the context of the proposal on a directive on batteries and accumulators and spent batteries and accumulators (COM(2003)723)," EEB, Jan. 2004.

"Baking lead-free and lead PCB's before assembly," Circuitnet , Feb. 4, 2007.

"Ban Lifted on Deca-BDE Flame Ratardants," Printed Circuit Design and Fab, vol. 25 no. 7, pp. 8, July 2008.

"Ban on Lead May Accelerate Component Obsolescence Problems," Lead-free Electronics, Nov. 2004.

"Banish Black Pad and Other PCB Laminate Issues," Circuitnet, Sept. 9, 2008.

"Baroque Magnificence in Tin An Austrian Shrine," Tin and its Uses , no. 43, pp. 1-7, Summer 1958.

"Base Material Selection Tool," Polyclad.

"Basel e-Waste Conference Convenes," Surface Mount Technology Online Article, June 23, 2008.

"Basler Power Supplies," Westinghouse Nuclear Tech Bulletin TB-02-5, July 12, 2002.

"Battling Corrosion - and Making it Green," Products Finishing , vol. 73 no. 9, pp. 8, June 2009.

"BCF says that REACH is good for UK coatings industry." Finishing , vol. 30 no. 1, pp. 4, Jan.-Feb. 2006.

"Best, Inc. Lead-Free Roadmap," Best, June 6, 2005.

"Best Practices External / Customer Ready Version Rev. 1.0," Sun Microsystems, Inc., July 7, 2000.

"Better than Chrome?," Products Finishing, vol. 73 no. 11, pp. 8-9, Aug. 2009.

"BFR Restrictions in Many US States to Follow EU's RoHS," Conformity , vol. 10 no. 9, pp. 53-54, Sept. 2005.

"BFR Restrictions in Many U.S. States Expected to Follow EU's RoHS," Conformity, pp. 214, Conformity 2006: The Annual Guide.

"BGA re-balled with lead free spheres," Circuitnet, June 4, 2006.

"BGA Repair for Mixed Assemblies," Circuits Assembly, vol. 17 no. 5, pp. 54, May 2006.

"BGA Replacement limit," Circuitnet, Jan. 26, 2009.

"BGA Rework - with or without solder paste," Circuitnet, Sept. 17, 2007.

"Black Pad - Though Rare, the Infamous and Irreparable PCB Defect Can Have Disastrous Consequences," IPC Review, vol. 2 no. 2, pp. 5, Mar./Apr. 2009.

"BMPCOE Strives to Mitigate Tin Whiskers," COTS Journal, vol. xx no. xx, pp. 60-63, Sept. 2003.

"Boeing 601 (f.k.a. Hughes HS 601)."

"Boots pleads guilty to WEEE breaches," RTE Business, Jan. 24, 2006.

"Bridge-free Wave Soldering of Fine Pitch QFP," Tin World, no. 12, pp. 16, Winter 2006.

"BT Task Force: BTTF 116-3 Title: Waste from electrical and electronic equipment (WEEE)," CENELEC, Dec. 23, 2004.

"Building consensus," Electronics Supply & Manufacturing, Feb. 2005.

"Building consensus," Green SupplyLine, Feb. 1, 2005.

"Bumps on Cu pillars tighten pitch," Solid State Technology, vol. 45 no. 11, pp. 24, Nov. 2002.

"Cadmium Plating," finishing.com.

"Cadmium Plating Prohibition," NASA Electronic Parts and Packaging Program.

"Cadmium whiskers on Hubble," finishing.com.

"CAF," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, June 7, 2002.

"California Expands RoHS Regulations," Conformity, 2007 Engineers' Reference Guide, pp. 222, 2007.

"California Goes the RoHS Way," Quality Digest, vol. 27 no. 4, pp. 9, Apr. 2007.

"California Implements Battery Recycling Requirements," Conformity , 2007 Engineers' Reference Guide, pp. 222-223, 2007.

"California Implements Tough Battery Recycling Requirements," Conformity, vol. 11 no. 2, pp. 46, Feb. 2006.

"California Proposition 65 Information for Wire and Cable Manufacturers," NEMA, Sept. 2002.

"Californian REACH-type initiative," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, May 5, 2008.

"Call for unique part numbers to differentiate ball metallurgies on Pb-free BGA components," Tin World, no. 18, pp. 13, Early Summer 2007.

"Calumet Electronics Presents New RoHS Compliance Informational Video: Lead-Free Finishes and Material Selection," PCB007, Sept. 6, 2005.

"Cambridge Environmental Assessments take the strain out of REACH registration," Anti-Corrosion Methods and Materials, vol. 56 no. 1, pp. xx-xx, 2009.

"Can I upgrade my Long wave IR/convection oven for use with lead-free?," Circuitnet, July 10, 2006.

"Can I use my old oven for lead-free reflow?," Circuitnet, May 7, 2006.

"Can lead-free solder joints be good looking? (and give better sound quality?)," Connector Specifier, Dec. 15, 2003.

"Can PCB's designed for Sn/Pb be used in a Pb free assembly?," Circuitnet, Apr. 17, 2006.

"Canadian Firms Next to Adopt RoHS Standard?," www.metalfinishing.com/, July 27, 2006.

"Caring about Electrical Waste Needn't Cost the Earth," PCB007 , Dec. 15, 2006.

"Case Study in Successful Lead-free Implementation using Both SAC305 and K100 Solders," Lead-Free Connection, vol. 3 no. 2, pp. 1, Aug. 2006.

"Case Study: One company's lead-free journey," Global SMT and Packaging, vol. 7 no. 10, pp. 58, 60-61, Oct. 2007.

"Case study: Orchestrating RoHS implementation of TI's E&PS global products," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 106.

"CEA Recommends a National Framework for Electronics Recycling to Congress," PCB007, Sept. 8, 2005.

"Challenges and Efforts Toward Commercialization of Lead-free Solder- Road Map 2000 for Commercialization of Lead-free Solder- ver 1.3," Japan Electronic Industry Development Association (JEIDA).

"Challenges in Manufacturing Reliable Lead Free Components," Altera, Feb. 2004.

"CHALLENGES of Pb-free compliance overcome," Electronics Manufacture and Test, pp. xx-xx, Mar. 2005.

"Change Leaded to Lead-Free, Lead-Free to Leaded," Design News , vol. 61 no. 11, pp. 26, Aug. 14, 2006.

"Chapter C: Conductive Polymers Level 1: Introduction."

"Chapter C: Conductive Polymers Level 2: Conclusions and Guidelines."

"Chemical Regulation Challenges Industry," Standardization News, vol. 35 no. 2, pp. 16-21, Mar./Apr. 2008.

"Chemicals Known to the State to Cause Cancer or Reproductive Toxicity," State of California Environmental Protection Agency, Mar. 4, 2005.

"Chicken or egg? EMS leads the way on lead-free," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, June 2004.

"China Acts on Hazardous Substances Ban," IPC Review, pp. 7, Sept. 2005.

"China "Complying with RoHS"," PCB007, Nov. 17, 2006.

"China eyes European environmental directives," Connector Specifier , Jan. 20, 2005.

"China Eyes European Environmental Directives," Advanced Packaging , vol. xx no. xx, pp. xx-xx, Jan. 20, 2005.

"China kicks off own version of RoHS directive," Global Sources , Jan. 30, 2007.

"China lags as the RoHS deadline nears," SourceESB, Apr. 6, 2006.

"China Promulgates "RoHS Plus" Laws," IPC Review, pp. 22, Apr. 2006.

"China Readies RoHS Marking and Limits Standards," Conformity, 2007 Engineers' Reference Guide, pp. 221, 2007.

"China RoHS- Deja Vu?," Surface Mount Technology (SMT), vol. 20 no. 12, pp. 14, Dec. 2006.

"China RoHS Gold and Silver Packages: The Fastest, Simplest, and Most Affordable Way to China RoHS Compliance," PCB007, Nov. 3, 2006.

"China RoHS Guidance Notes V3.0 Including Standards FAQ Updates and Much More," PCB007, Apr. 2, 2007.

"China RoHS Standards Ready - Marking Required Only On Products Exceeding Concentration Limits," PRWeb, May 20, 2006.

"China RoHS Standards Ready - Marking Required Only On Products Exceeding Concentration Limits," PCB007, May 20, 2006.

"China RoHS Standards to Become Effective March 1," Circuitree, vol. 20 no. 2, pp. 28, Feb. 2007.

"China-RoHS test service for European exporters," emsnow, Mar. 1, 2007.

"China RoHS versus EU RoHS," Update Intertek, no. 2008-1, pp. 18, 2008.

"China's own RoHS law to come into effect on March 2007," Global Sources, July 12, 2006.

"China's RoHS Marking and Limits Standards Ready for Approval," Conformity, vol. 11 no. 8, pp. 88, 90, Aug. 2006.

"China's RoHS - Vague and Obstructive," Design News, vol. 61 no. 2, pp. xx, Feb. 6, 2006.

"Chinese Government Delegation Coming to US to Explain New Environmental Regulations Impacting the High-Tech Industry," PCB007, Oct. 11, 2006.

"Christmas gadgets add to recycling headache," EE Times Europe , Dec. 14, 2007.

"Chrom(VI)freie Fahrzeugindustrie," Galvanotechnik, vol. 97 no. 7, pp. 1708-12, July 2006.

"Chromate Coating from Trivalent Solution," Products Finishing, vol. 47 no. 11, pp. 64-65, Aug. 1983.

"Chrome-free coil coating primers -- it's time to switch," Finishing , vol. 28 no. 6, pp. 22, Sept./Oct. 2004.

"Chrome free pre-treatment launched," Finishing, vol. 30 no. 2, pp. 14-15, Mar./Apr. 2006.

"Chromium: Science, Technology and the Future," Plating and Surface Finishing, vol. 92 no. 6, pp. 14-16, June 2005.

"Cleaner product design: a practical approach."

"Cleaner product design: an introduction for industry."

"Cleaning residue after wave solder process," Circuitnet, Oct. 15, 2007.

"Cleaning tin-lead and lead-free boards," Circuitnet, Apr. 2, 2007.

"Close Shave," Printed Circuit Design and Manufacture, vol. 20 no. 8, pp. 10, Aug. 2003.

"Coated Wire and Cable Industry: Lead Alternatives and Testing for Restricted Substances," Toxics Use Reduction Institute, Mar. 23, 2004.

"Coating or encapsulating tin-lead solder joints?," Circuitnet , Sept. 24, 2007.

"Coating to stop tin whisker growth?," Circuitnet, Aug. 14, 2006.

"Coil Coating Org Offer RoHS Tutorial," Products Finishing , vol. 73 no. 9, pp. 8, June 2009.

"Coming environmental rules won't protect European PCB makers, says Numakura," PCB007, Oct. 31, 2003.

"Coming Up ROSA," Circuits Assembly, vol. 18 no. 10, pp. 46-47, Oct. 2007.

"Comment - Free from Pb-free? It's not so clear-cut," Components in Electronics, vol. xx no. xx, pp. xx-xx, May 2004.

"Comment on Greenpeace iPhone study," emsnow, Oct. 22, 2007.

"Comments on Test Methods & Criteria for Tin Whiskers in Surface Mount Passive Devices," EIA/ECA-CB22, Nov. 2005.

"Comments on the Greenpeace iPhone study," evertiq, Oct. 20, 2007.

"Commission adopts Communication on Precautionary Principle," Feb. 2, 2000.

"Commission ruling shock on DecaBDE," emsnow, July 17, 2006.

"Companies May Not be Included in New Manufacturing Contracts if Their Employees Don't Know What RoHS and WEEE Stand For," PRWeb, Dec. 5, 2005.

"Companies offer RoHS compliance services," SourceESB, Feb. 22, 2006.

"Comparison of Electroless Ni/Immersion Au vs. Electrolytic Ni/Au," Merix.

"Comparison of halogen free base materials," PCB007, Oct. 21, 2000.

"Complete list of EU RoHS Exemptions, Issue 1.0," Nov. 10, 2006.

"Complying to RoHS," Purchasing, vol. xx no. xx, pp. xx-xx, May 19, 2005.

"Component Event Management Expert PCNalert Introduces Lead-Free Parts Category to Component Database," Business Wire, vol. xx no. xx, pp. xx-xx, Aug. 25, 2003.

"Component Heat Resistance to Lead-Free Reflow Soldering," Tyco Electronics Test Specification 109-201, Mar. 3, 2004.

"Component Heat Resistance to Wave Soldering," Tyco Electronics Test Specification 109-202, Feb. 12, 2004.

"Component Pb conversion helps OEMs find economic equalizer," Circuitnet, Nov. 29, 2007.

"Component Shift During Reflow," Circuitnet, Oct. 29, 2007.

"Component Solderability Workshop Proceedings (18-19 September 1991)", Electronics Manufacturing Productivity Facility PC0012, Sept. 18-19, 1991.

"Components to be Next Lead-Free Headache," IEE Review, vol. 49 no. 11, pp. 12, Dec. 2003.

"Computer Manufacturer To Offer Customers Free Recycling," Conformity, vol. 11 no. 9, pp. 62-63, Sept. 2006.

"Concentration Limits, Marking Standards Set for China RoHS," SMT Web Exclusive Article.

"Concerns over lead-free solder," Elektron, vol. 24 no. 6, pp. 17, June 2006.

"Concerns over RoHS revisions," Electronics Manufacture and Test , vol. xx no. xx, pp. xx-xx, June 30, 2008.

"Concerns raised over 'lead-free' solder health," Dataweek, vol. xx no. xx, pp. xx-xx, June 14, 2006.

"Confused about WEE/RoHS? Help is at hand," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, May 2004.

"Confusion in the UK over WEEE," evertiq, Feb. 7, 2007.

"Confusion over exemptions to RoHS rules," Components in Electronics , vol. xx no. xx, pp. xx-xx, Mar. 2006.

"Confusion Reigns while Lead-Free Conquers," May 2, 2005.

"Considerations for Printing Lead-free Solder Paste," AIM.

"Consumers choosing green products," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Aug. 11, 2008.

"Control of Whisker Growth in Tin Alloy Coatings," ST Microelectronics Application Note AN2035, Nov. 2004.

"Converting to VOC-Free Fluxes," Circuits Assembly, vol. 19 no. 9, pp. 49, Sept. 2008.

"Copper Alloy Guide," Olin Brass.

"Copper dissolution," Feb. 12, 2010.

"Copper Dissolution issue," Circuitnet, Nov. 5, 2006.

"Cored Solder Wire," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Mar. 17, 2008.

"Correction on California's RoHS Regulations," Conformity, vol. 12 no. 1, pp. 10, Jan. 2007.

"Cost Effective, Nontoxic Process for Depositing Thick, Highly Wear Resistant Chromium Coatings," Materials Technology, vol. 11 no. 2, pp. 43-45, Mar-Apr. 1996

"Cost-Effective Support for RoHS Compliance: A New Innov-X Initiative," PCB007, July 25, 2006.

"Cost of Chrome Regulation: $26M Annually," Products Finishing, vol. 75 no. 1, pp. 9-10, Oct. 2010.

"Cost of Lead-Free Solder Materials," Adhesives & Sealants Industry, vol. 14 no. 7, pp. 37-39, July 2007.

"Cost of recycling PCs is lower than expected," Electronics Weekly , June 2, 2006.

"Countdown To Compliance," CircuiTree, vol. 18 no. 12, pp. 7, Dec. 2005.

"Counterfeiting Moves Up the Technology Ladder," SourceESB, Sept. 19, 2006.

"Counterfeits 'not just from the Far East'," Components in Electronics, vol. xx no. xx, pp. xx-xx, May 2006.

"Counting the Cost of Component Counterfeiting," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Oct. 29, 2007.

"Creep Analysis of Lead-Free Solders Undergoing Thermal Loading," NASA Tech Briefs, vol. 32 no. 2, pp. xx-xx, Feb. 2008.

"Critical Reliability Challenges for the International Technology Roadmap for Semiconductors (ITRS)," International SEMATECH Technology Transfer #03024377A-TR.

"Cure or treatment for tin disease," finishing.com.

"Current status of EU lead-free soldering," evertiq, Mar. 30, 2005.

"Customer Relationship Module Adds Marketing Benefits To WEEE Compliance Websites," PCB007, July 7, 2006.

"Database for Properties of Lead-Free Solder Alloys, Version 1.0."

"Database of defects," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Jan 7, 2008.

"Dauernde Herausforderung - die Diskussion um die Verwendung von Chrom(VI)," Galvanotechnik, vol. xx no. xx, pp. 1447-1449, June 2008.

"Deca-BDE exemption from EU RoHS directive awaits council approval," emsnow, Apr. 21, 2005.

"Deca-BDE Exemption - Statement on Greens Press Release," evertiq , July 14, 2006.

"Deca-BDE Exemption - Statement on Greens Press Release," PCB007 , July 14, 2006.

"DEFECTS down with inert soldering," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Feb. 2005.

"Defense Engineers Still See Problems With Lead-Free Parts," Design News, vol. 61 no. 6, pp. xx, Apr. 24, 2006.

"Deflux Eutectic and Lead-Free Assemblies," Circuitnet, Sept. 4, 2007.

"DEK concludes research on lead-free pastes," EE Times - Asia , vol. xx no. xx, pp. xx-xx, June 5, 2006.

"DEK Report Details Lead-free Stencil Design Rules," SMT Web Exclusive Article.

"Delay of the WEEE Directive Implementation In the UK," PRWeb , May 3, 2005.

"Design and assembly process implementation for BGAs released," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Apr. 21, 2008.

"Design Chain launches China RoHS site," Design News, vol. 61 no. 7, pp. xx, May 15, 2006.

"Design engineers and obsolescence - the distributor interface," Components in Electronics, vol. xx no. xx, pp. xx-xx, May 2005.

"Design for Environment: Phase I."

"Developing expertise in Pb-free materials," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, Sept. 2004.

"Developments in Chromium Plating," Plating and Surface Finishing , vol. 74 no. 7, pp. 29-32, July 1987.

"DFx Lead-Free Review," Dell.

"Diagnosing Intermittent BGA Connections," Circuits Assembly, vol. 19. no. 3, pp. 60, Mar. 2008.

"Did You Know?," TUV Rheinland World News, pp. 9, May/June 2005.

"DirectFET Technology: Materials and Practices Application Note," International Rectifier Application Note AN-1050, Sept. 2003.

"Directive 2002/95/EC on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS). Check List for Requests for Additional Exemptions."

"Directive 2002/96/EC (WEEE) Overview on National Registers in Member States," ORGALIME, July 15, 2005.

"Distinct Part Numbers Major Request at RoHS Summit," SMT Web Exclusive Article.

"Distinctive Part Numbers for RoHS-compliant Parts Desired," Advanced Packaging, vol. xx no. xx, pp. xx-xx, Apr. 28, 2005.

"Distribution in 2005: Slow and Steady," Hynix Semiconductor, Jan. 26, 2005.

"Distributor wants a U.S. RoHS law," Purchasing, vol. xx no. xx, pp. xx-xx, Oct. 19, 2006.

"Distributor warns of Pb-free complacency and offers data," Electronics Weekly, Feb. 6, 2004.

"Distributors need to show RoHS compliance," Purchasing, vol. xx no. xx, pp. xx-xx, Nov. 2, 2006.

"Distributors' Position Paper on Lead Free Product Transition and RoHS Compliance," National Electronic Distributors Association, June 22, 2004.

"Distributors see smooth RoHS conversion," Purchasing, vol. xx no. xx, pp. xx-xx, June 15, 2006.

"Distributors take dominant role as RoHS ripples through," Components in Electronics, vol. xx no. xx, pp. xx-xx, Feb. 2005.

"Donate Rather Than Dump That Redundant Computer - UK Businesses are Asked," PRWeb, Nov. 15, 2004.

"Dr Dongkai Shangguan, PhD, Corporate Technology Leadership Group, Flextronics, discusses lead free solder reliability," EMasia, Jan. 2009.

"Dr RoHS answers your questions," Electronics Weekly, Apr. 19, 2006.

"Dr. Ron Lasky: A Solder Alloy and Solder Paste Overview," Surface Mount Technology (SMT), pp. 10,12-14,16, May 2020.

"Drawing Notes for documenting RoHS and Lead Free Capable Material, Merix.

"Drawing the Line: How Green Electronics Turn Brown When Exposed to the Light of Day," IPC Review, vol. 48 no. 5, pp. 19, June 2007.

"Dross recovery," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Oct. 7, 2006.

"DTI Report: Lead-Free Awareness Up," Printed Circuit Fabrication , vol. 23 no. 7, pp. 18,20, July 2000.

"DTSC Calls for Comments Regarding Green Chemistry Initiative," PCB007, May 14, 2008.

"Dumb down directives - please!," Components in Electronics, vol. xx no. xx, pp. xx-xx, Aug. 2005.

"Dutch Government Bans PS ones," Dec. 4, 2001.

"Dynacast Announces Results of Research into Alternative Diecast Coatings for Compliance with Pending EC Regulations to Eliminate Hexavalent Chromium Finishes," Dynacast, Nov. 5, 2002.

"E-waste campaign unveiled," Components in Electronics, Dec./Jan. 2008.

"E2open Delivers First Eco-Compliance Solution to Fully Support the IPC-1752 Standard," PCB007, Feb. 8, 2006.

"EC welcomes agreement on WEEE, Restriction of Hazardous Substances," PCB007, Nov. 1, 2002.

"Eco-Design: EuP Directive Update," Components in Electronics , vol. xx no. xx, pp. xx-xx, May 2006.

"Economic Impact of the European Union RoHS Directive on the Electronics Industry," Technology Forecasters Inc., Jan. 21, 2008.

"EEB and Greenpeace recommendations on Commission proposal for a directive on batteries and accumulators and spent batteries and accumulators (COM(2003)723," June 2, 2004.

"Effect on Eutectic Melting point for a multiple alloy board," Circuitnet, July 13, 2008.

"EFIP Calls for Alternative to EU's Proposed Lead Ban," Circuits Assembly, vol. 10 no. 8, pp. 8, Aug. 1999.

"EIA and JGPSSI to Update International Joint Industry Guide for Electronic Products," Electronic Industry Alliance (EIA) and Japan Green Procurement Survey Standardization Initiative (JGPSSI), Sept. 13, 2006.

"EIA, JGPSSI, and JEDEC Unveil New International Joint Industry Guide for Electronic Products," Electronic Industry Alliance, May 25, 2005.

"EIPC SpeedNews - European PCB Industry Snapshot," PCB007, Jan. 31, 2006.

"Electric gadgets "must get greener"," The Chemical Engineer (London) , no. 765, pp. 5, Mar. 2005.

"Electrically Conducting Adhesives," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Nov. 7, 2002.

"Electrodeposited Pb-free Solder and Whisker Prevention," Journal of Research of the National Institute of Standards and Technology, vol. 106 no. 2, pp. 490, Mar./Apr. 2001.

"Electronic and electrical waste: EU Commission Takes Legal Action Against Eight Member States," PCB007, July 14, 2005.

"Electronic Design's Guide To New International Environmental Laws."

"Electronic Finishes," Reliable Plating.

"Electronics companies urge EU to restrict more RoHS in electronic products," evertiq, May 19, 2010.

"Electronics Industry Calls for Federal RoHS Legislation," Design News , vol. 61 no. 16, pp. 26, Nov. 6, 2006.

"Electronics Industry is Severely Unprepared for REACH Regulation," Power Electronics Technology, vol. 34 no. 8, pp. 10-11, Aug. 2008.

"Electronics Industry Lacks Awareness of UK Ban on Brominated Flame Retardants," Surface Mount Technology (SMT), vol. 18 no. 11, pp. 27, Nov. 2004.

"Electronics Industry Takes Aim at Hazardous Substances," Quality Digest , vol. 25 no. 6, pp. 9, June 2005.

"Electronics Makers Race to Meet RoHS Deadline," CENS.com, Nov. 3, 2005.

"Electronics Makers Race to Meet RoHS Deadline," CENS.com, Mar. 13, 2006.

"Electronics Makers Race to Meet RoHS Deadline," PCB007, June 13, 2006.

"Electronics manufacturers must go beyond 'green' laws," evertiq , Nov. 30, 2006.

"Electronics recycling hits a Weee problem," Professional Engineering , vol. 18 no. 15, pp. 17, Aug. 17, 2005.

"Electronics Recycling Legislation in the USA & Canada - Actual and Pending," Apr. 29, 2005.

"Electronics Recycling: What to Expect from Global Mandates," PCB007 , Jan. 17, 2005.

"Electro-scrap mountains still growing," Professional Engineering , vol. 19 no. 1, pp. 38-39, Jan. 11, 2006.

"ELFNET and COST 531 Deliver Lead-Free Solder Alloy Properties Database," evertiq, May 22, 2006.

"ELFNET Delivers 'Issues To Solutions' Initiative in Lead-Free Soldering," evertiq, Nov. 22, 2005.

"ELFNET Launches European Roadmap," SMT Web Exclusive Article.

"ELFNET publishes lead-free soldering status report 2006," emsnow , Apr. 9, 2007.

"Eliminating Lead Solder," Sharp.

"Elimination of Lead from Electrical and Electronic Equipment - the Dilemma of Tin-Whisker Growth," Eurocomp, no. 7, pp. 3-6, Autumn 2004.

"EMA Design Automation and Ageus Solutions Align Forces; Making RoHS/WEEE Compliance an Inherent Part of the Design Process," PCB007, Mar. 21, 2006.

"EMSF Monitors Low-silver BGAs," SMT Web Exclusive Article.

"EN 62321:2009, Electrotechnical products - Determination of levels of six regulated substances (lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls, polybrominated diphenyl ethers)," British Standards Institution (BSI), Apr. 2009.

"End of Life Recycling Technologies - Hard Drive Impairment," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 359.

"Energy-Use for Electronic Products (EuP) in Play," Printed Circuit Design and Fab, vol. 25 no. 9, pp. 10, Sept. 2008.

"Engineers Doubt UK Sustainability Policy," IEE Review, vol. 50 no. xx, pp. 16, Sept. 2004.

"Engineers doubt UK sustainability policy," Power Engineer, vol. 18 no. 5, pp. 6, Oct./Nov. 2004.

"Enhancing Pb-free Solder Joint Reliability," PCB007, Mar. 3, 2006.

"ENIG and ImAg Finishes with Pb-Free Paste," Circuits Assembly , vol. 17 no. 8, pp. 54, Aug. 2006.

"ENVIRON and COCIR cooperate on REACH & RoHS compliance," evertiq, Sept. 1, 2008.

"ENVIRON Assists Electronics Companies to Comply with WEEE Regulations in France," PCB007, Sept. 5, 2006.

"Environ Celebrates 15th Pan-European WEEE Website," PCB007, May 31, 2006.

"Environmental Aging Effects on the Durability of Electrically Conductive Adhesive Joints."

"Environmental Compliance: A Year in Review and What 2009 Will Bring," IPC Review, vol. 2 no. 1, pp. 14-15, Jan./Feb. 2009.

"Environmental Management System," EE Times - Asia, vol. xx no. xx, pp. xx-xx, Dec. 13, 2004.

"Environmental Outlook for 2007," IPC Review, vol. 48 no. 1, pp. 19,22, Jan. 2007.

"Environmental Regs Cause Slow Moving Train Wreck for Companies That Are Not Ready," PRWeb, Aug. 19, 2005.

"Environmental regulations become patchwork nightmare," SourceESB, Aug. 10, 2005.

"Environmental Regulatory Update," Conformity, vol. 11 no. 4, pp. 11, Apr. 2006.

"Environmental Regulatory Update," Conformity, vol. 11 no. 5, pp. 62, May 2006.

"Environmental Regulatory Update," Conformity, vol. 11 no. 6, pp. 56, 58, June 2006.

"Environmental Regulatory Update," Conformity, vol. 11 no. 7, pp. 45, July 2006.

"Environmentally-safe FPC," Fujikura Technical Review, no. 33, pp. 57, Jan. 2004.

"Envirowise steers SMEs toward compliance," Green SupplyLine, May 1, 2005.

"EPA Amends CRT Recycling Regulations," Conformity, vol. 11 no. 11, pp. 9, Nov. 2006.

"EPA Amends CRT Recycling Requirements," Conformity, 2007 Engineers' Reference Guide, pp. 223, 2007.

"EPA Award recognizes air force move to use non-chromate conversion coatings," Pigment & Resin Technology, vol. 33 no. 6, pp. xx, 2004.

"EPA Proposes Tighter Chromium Limits," Products Finishing, vol. 76 no. 6, pp. 12, Mar. 2012.

"EPA Rationale for New Chromium Limits and NASF Response," Products Finishing, vol. 76 no. 6, pp. 12, Mar. 2012.

"EPA Releases Report on U.S. Electronic Waste," Conformity, 2008 Engineers' Reference Guide, pp. 238, 2008.

"EPA to Examine TBBPA Alternatives," IPC Review, vol. 47 no. 6, pp. 22, July 2006.

"Epson implements program to eliminate RoHS Directive chemicals," PCB007, Oct. 2, 2004.

"EPTE Newsletter from DKN Research - JPCA Show 2006 (Part IV) - Materials," PCB007, June 27, 2006.

"Equilibrium Diagram of the Tin-Antimony Alloy System," Tin and its Uses , no. 25, pp. 8, Dec. 1951.

"Equilibrium Diagram of the Tin-Nickel Alloy System," Tin and its Uses , no. 24, pp. 6, July 1957.

"Equilibrium Diagrams Tin-Copper," Tin and its Uses, no. 23, pp. 7-8, Dec. 1950.

"Equipment Market Benefits from Lead-free Laws," SMT Web Exclusive Article.

"Equipment waste tops one million tonnes a year," Electronic Product Design, vol. xx no. xx, pp. xx-xx, Mar. 18, 2008.

"ERA reviewing Category 8 & 9 for RoHS Directive," evertiq, Dec. 1, 2005.

"ERA Technology on British industry readiness to implement lead-free solder ban: smaller PCB makers not ready," PCB007, Jan. 20, 2003.

"ERA wins EC contract for review of RoHS Directive exemptions."

"ERNI publishes roadmap for RoHS compliance," Connector Specifier , vol. 20 no. 10, pp. xx-xx, Oct. 2004.

"EU Adopts REACH," SMT Web Exclusive Article.

"Eu-Altauto-Richtlinie bereinigt Markt der Galvanikanbieter," Galvanotechnik, vol. xx no. xx, pp. 2108-2110, Sept. 2005.

"EU and China RoHS Compliance Now Faster and Easier: Full IPC 1752 Functionality is Now Available in Material Declaration Wizard Software MDW/1752," PRWeb, Oct. 5, 2006.

"EU Announces Consultation on New Exemption List," Dec. 23, 2004.

"EU Approves TBBPA, Is Commended By Albemarle," CircuiTree, vol. 21 no. 4, pp. xx-xx, Apr. 2008.

"EU backs landmark chemicals law," BBC News, Dec. 13, 2005.

"EU chemicals law 'could disrupt supply chains'," Professional Engineering, vol. 23 no. 9, pp. 3, June 2, 2010.

"EU Commission Amends Exemptions to The RoHS Directive," Conformity , vol. 11 no. 1, pp. 46, Jan. 2006.

"EU Commission Extends RoHS Directive Exemption for Shielding," Conformity, vol. 12 no. 1, pp. 42, Jan. 2007.

"EU Commission Examines RoHS "Loophole"," Conformity, vol. 11 no. 8, pp. 9, Aug. 2006.

"EU Commission Poised to Review WEEE Directive," Conformity, vol. 11 no. 10, pp. 72, Oct. 2006.

"EU Commission Publishes New WEEE Directive," IN Compliance Magazine , pp. 8, Oct. 2012.

"EU Commission Releases Guidance Document on General Product Safety Directive," Conformity, vol. 11 no. 3, pp. 44, Mar. 2006.

"EU Commission Requests Feedback on RoHS Impact Assessment," PCB007, June 16, 2008.

"EU Competent Authorities Confirm No Restrictions on Deca-BDE," CircuiTree, vol. 20 no. 12, pp. xx-xx, Dec. 2007.

"EU confirms no classification of TBBPA for health," evertiq, Nov. 25, 2005.

"EU Considers Lowering Targets for Battery Collection," Conformity , vol. 11 no. 3, pp. 44, Mar. 2006.

"EU-Court ruling does not question flame retardant Deca-BDE," evertiq, Apr. 2, 2008.

"EU Debates RoHS Exemptions,"

"EU Debates RoHS Exemptions," Advanced Packaging, vol. xx no. xx, pp. xx-xx, Mar. 29, 2005.

"EU decision supports continued use of Deca-BDE, says EBFRIP," PCB007, June 2, 2004.

"EU directive threatens suppliers," Automotive Engineer, vol. 28 no. 5, pp. 4-5, May 2003.

"EU governments looking to increase RoHS enforcement," evertiq , Oct. 17, 2008.

"EU governments looking to increase RoHS enforcement," Circuit World , vol. 35 no. 1, pp. xx-xx, 2009.

"EU Green Rule Forces China To Raise Appliance Prices," Appliance Design, vol. xx no. xx, pp. xx-xx, June 17, 2005.

"EU in a muddle over banned substance wavers," Feb. 18, 2005.

"EU Issues Correction on New Battery Directive," Conformity, vol. 12 no. 1, pp. 42, Jan. 2007.

"EU launches monitoring for deca-BDE, hesitates over RoHS exemption," Additives for Polymers, vol. 2005 no. 7, pp. 11-12, July 2005.

"EU measures most important in reducing risks of flame retardants in Sweden," evertiq, Mar. 30, 2006.

"EU Parliament Approves New Battery Directive," Conformity, vol. 11 no. 10, pp. 72, Oct. 2006.

"EU Policies on Electric and Electronic Waste Q&A," PCB007, July 12, 2005.

"EU Ready to Ban More Chemicals," Design News, vol. 61 no. 1, pp. xx, Jan. 9, 2006.

"EU Releases New Battery Directive," Conformity, vol. 11 no. 12, pp. 10, Dec. 2006.

"EU Releases Proposed RoHS Revisions," PCB007, Dec. 9, 2008.

"EU Releases Proposed RoHS Revisions," PCB007, Dec. 10, 2008.

"EU Requests Input on RoHS, WEEE," SMT Web Exclusive Article.

"EU RoHS "Enforcement Guidance" Document Available," Conformity , vol. 11 no. 8, pp. 9, Aug. 2006.

"EU Rules Curb Chinese Exports," Appliance Design, vol. xx no. x, pp. xx-xx, July 2006.

"EU Sets Eco-design Directive Framework to be Condition of CE Marking," Conformity, vol. 10 no. 10, pp. 70, Oct. 2005.

"EU TAC exempts FFL technology in RoHS," Global Sources, Feb. 28, 2006.

"EU Tightens RoHS Exemptions," Conformity, 2007 Engineers' Reference Guide, pp. 221, 2007.

"EU to Impose EUP Directive in August 2007," CENS.com, Aug. 28, 2006.

"EU, UK, France to block Swedish attempt to ban Deca-BDE," evertiq , Feb. 28, 2006.

"EU Updates RoHS FAQs," Conformity, vol. 11 no. 12, pp. 10, Dec. 2006.

"EU-wide REACH Enforcement Project Coordinated," SMT Web Exclusive Article.

"EuP to challenge makers of "energy-using products" in 2007," EE Times - Asia, vol. xx no. xx, pp. xx-xx, Oct. 9, 2006.

"European Commission Checklist."

"European Commission Sets Official RoHS Limits," Conformity, pp. 213, Conformity 2006: The Annual Guide.

"European COST Action 531L Basic Lead-free Soldering Research," Tin World, no. 17, pp. 6-, Spring 2007.

"European directives vs. Tin Whiskers & Tin Pest," finishing.com .

"European directives: web advice for best environmental practice," European Electronics Engineer, vol. xx no. xx, pp. xx-xx, Jan 11, 2002.

"European governments look to increase RoHS enforcement," Electronics Manufacture and Test, Oct. 21, 2008.

"European green directives expected to hit hard Taiwan`s economy," CENS.com, May 23, 2005.

"European Lead-free Technology Roadmap Ver1: February 2002," Soldertec, Feb. 2002.

"European REACH Targets Chromium and Cobalt," Products Finishing, vol. 76 no. 5, pp. 10-11, Feb. 2012.

"European RoHS directive may cause component inventory misalignment," Military & Aerospace Electronics, vol. 18 no. 1, pp. xx-xx, Jan. 2007.

"European Standard approved, setting out marking requirements under WEEE law," tdctrade.com, no. 23, Nov. 25, 2004.

"European Union Set to Implement Ban on Hazardous Substances in Electronic Equipment," JOM, vol. 58 no. 6, pp. 8-9, June 2006.

"EU's WEEE Directive May Be Revised," Conformity, 2007 Engineers' Reference Guide, pp. 222, 2007.

"Eutectic reflow for Pb-free BGAs," Circuitnet, Apr. 21, 2008.

"Evaluation of Environmentally-sensitive Material Content in IT Products," Feb. 20, 2003.

"Evidence of Poor Practice," Circuits Assembly, vol. 18 no. 4, pp. xx-xx, Apr. 2007.

"Examples of tin-whiskers failures," evertiq, Oct. 11, 2007.

"Examples of Whiskergrowing in Industry Applications," 3rd Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Genova, Italy, Mar. 21, 2012.

"Executive Guide: RoHS and compliance," Electronic Business, July 11, 2006.

"Executive Summary: Responses to Third WEEE and RoHS Consultation."

"Exel Launches 'The WEEE Oracle'," PCB007, Jan. 13, 2006.

"Exemption application of RoHSUSA Inc 5/20/06."

"Expanding the Electronics Assembly Process Window with the New Generation of Solder Pastes," AIM.

"Experiments show lead-free pastes will give great results with 0201s," evertiq, May 22, 2006.

"Experiments show lead-free pastes will give great results with 0201s," Dataweek, vol. xx no. xx, pp. xx-xx, Oct. 4, 2006.

"Extrusion Process."

"FACTSHEET: WEEE and RoHS DIRECTIVES."

"Fake parts, real threat," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, July 11, 2008.

"FAQs for WEEE/RoHS Directives."

"FAQS for WEEE/RoHS Directives," TUV Rheinland.

"FARNELLinone Guide to RoHS Compliance, Part 1," Jan. 2005.

"FARNELLinone Guide to RoHS Compliance, Part 2," Jan. 2005.

"Fast Moving Tin-Nickel Plating," Tin and its Uses, no. 69, pp. 6, 1965.

"Faster Tin Plating from Alkaline Baths: The Tin Sol Process," Tin and its Uses, no. 88, pp. 11-12, 1971.

"Federal Court Upholds OSHA Chromium PEL," Products Finishing , vol. 73 no. 8, pp. 13, May 2009.

"Federal Electronics Introduces RoHS Conversion Services," PRWeb , Dec. 7, 2005.

""Federal RoHS Legislation Is Imperative", Warns Newark InOne, As EU Law Takes Hold," PCB007, Sept. 19, 2006.

"Federal RoHS legislation is imperative warns US distributor," Tin World, no. 15, pp. 13, 2006.

"FEI-hosted debate on lead-free components and PCBs looks for 'ways forward' in a lead-free world," PCB007, Nov. 30, 2001.

"Fewer steps, more flexibility for lead-free wafer bumps," Solid State Technology, vol. 47 no. 12, pp, 18, 20, Dec. 2004.

"Fillet Lifting," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Feb. 7, 2006.

"Final Report: "2007 Lexus ES-350 Unintended Acceleration"," Apr. 30, 2008.

"Finding leaded parts after the RoHS deadline," SourceESB, July 27, 2005.

"Finishing Industry - Department of Defense Meet for 3rd Defense Metal Finishing Workshop Held in Utah," Plating & Surface Finishing , vol. 94 no. 7, pp. 12-13, July. 2007.

"Finite element models evaluate lead-free solders," Advanced Materials & Processes, vol. 166 no. 5, pp. 18, May 2008.

"Firms on Track to Meet RoHS Rules," CENS.com, July 11, 2006.

"Firms on Track to Meet RoHS Rules," PCB007, July 11, 2006.

"First WEEE prosecution carried out," evertiq, Jan. 30, 2006.

"Flame Retardants in Printed Circuit Boards (Draft)," IPC Brussels , Brussels, Belgium, June 18, 2008, pp. xx-xx.

"Flexible WEEE Collections from Wincanton," PCB007, June 5, 2006.

"Flexibility is Key to Handling Lead-free Reflow," PCB007, Mar. 6, 2006.

"Flip Chip on FPC," Fujikura Technical Review, no. 29, pp. 66-67, Jan. 2000.

"Flowchart to determine if equipment is within the scope of RoHS," Rogers.

"Flowchart to determine if equipment is within the scope of WEEE," Rogers.

"Foretelling Failure," Product Design & Development, vol. 62 no. 7, pp. 38, July 2007.

"Former U.S. Ambassador to EU Warns of Threat to REACH," PCB007 , May 30, 2008.

"Forward planning can reduce obsolescence risks," Components in Electronics, vol. xx no. xx, pp. xx-xx, May 2005.

"Fragility of Pb-free Solder Joints," Universal Instruments.

"Free RoHS BOM service offered," Purchasing, vol. xx no. xx, pp. xx-xx, Nov. 3, 2005.

"Free web service on offer for environmental rules," Electronics Weekly, Feb. 15, 2006.

"Freescale Networking and Communications Products Pb-Green Strategy," Freescale Semiconductor, 2004.

"Frequently Asked Questions About China's RoHS Requirements," Conformity , vol. 12 no. 3, pp. 62, Mar. 2007.

"Frequently Asked Questions (FAQ) About The European Union's WEEE and RoHS Directives," SEMI, July 20, 2005.

"Frequently Asked Questions About the EU's RoHS and WEEE Directives," Conformity, 2007 Engineers' Reference Guide, pp. 203-211, 2007.

"Frequently Asked Questions on Directive 2002/95/EC on the Restriction of the Use of certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) and Directive 2002/96/EC on Waste Electrical and Electronic Equipment," European Commission, Aug. 2006.

"Frequently asked questions on RoHS and WEEE," Dataweek, vol. xx no. xx, pp. xx-xx, Sept. 20, 2006.

"From the Makers of RoHS... New and Improved Chemicals Regulation Coming Soon to a Government Near You," IPC Review, vol. 47 no. 11, pp. 22-23, Dec. 2006.

"From the Online E2E Forum," Design News, vol. 61 no. 12, pp. 10, Sept. 4, 2006.

"Fujitsu announces details of stage 4 of environmental protection program," PCB007, June 7, 2004.

"Fujitsu will finish shift to lead-free soldering in October 2000," PCB007, July 14, 2000.

"Fume Extraction For Healthy Lead-Free Rework," evertiq, Aug. 31, 2006.

"G2: Arts: Out&about: Art: WEEE man's warning," The Guardian , Apr. 28, 2005.

"Gain a Competitive Advantage Through Design for Environmental Compliance." Enovia.

"Galvanic Attack in Immersion Silver Processing: Causes and Remedies," MacDermid Technical Report No. 211, Feb. 28, 2005.

"Galvano- und Oberflaechentechnik fur Elektronikanwendungen," Galvanotechnik, vol. xx no. xx, pp. 629-635, Mar. 2006.

"GE Power Management Service Bulletin," GE, Mar. 27, 2000.

"GEIA-HB-0005-4 Guidelines for Performing Reliability Assessment for Pb Free Assemblies used in Aerospace and High-Performance Electronic Applications," Sept. 23, 2010.

"GEIA-STD-0005-2 Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems," Rev A draft 1/5/11.

"GEIA prepares to release three new standards dealing with lead-free electronics," Dataweek, vol. xx no. xx, pp. xx-xx, Sept. 20, 2006.

"GEIA Prepares to Release Three New Standards Dealing with the Lead-Free," PCB007, Sept. 7, 2006.

"General Purpose Lead-Free Assembly System Implementation Guideline."

"Getting the lead out," Air Safety Week, vol. xx no. xx, pp. xx-xx, July 26, 2004.

"Getting the Lead Out," Appliance Design, vol. xx no. x, pp. xx-xx, Feb. 2006.

"Getting The Lead Out," Electronic Design, vol. 52 no. 10, pp. 10, May 10, 2004.

"Getting the Lead Out - European Regulations Force Electronics Companies to Clean up, Impact Local Manufacturers and Distributors," PRWeb , May 24, 2005.

"Glitch silences millions of pagers," Star-Bulletin, May 20, 1998.

"Global Institute of Logistics Publishes White Paper on the Waste Electrical and Electronic (WEEE) Directive," PRWeb, Mar. 6, 2006.

"Global Institute of Logistics Publishes White Paper on the Waste Electrical and Electronic (WEEE) Directive," PCB007, Mar. 7, 2006.

"Global Transition to Pb-free/Green Electronics," CALCE, 2004.

"Go Green: Allied Electronics Launches RoHS Knowledge Center," Allied Electronics, Aug. 12, 2005.

"Good looking lead-free solder joints (and better sound quality?)," PCB007, Dec. 16, 2003.

"Got any old fashioned - leaded - spare parts?," SourceESB, Mar. 9, 2006.

"Government to shed light on waste directive," Electronics Weekly , Nov. 19, 2003.

"Green Electronics Desired," Appliance Design, vol. 57 no. 2, pp. 9, Feb. 2009.

"Green gadgets: the Greenpeace search continues," evertiq, Jan. 28, 2009.

"Green initiatives can payoff," Components in Electronics, vol. xx no. xx, pp. xx-xx, July 2004.

"Green laws hitting from all corners," SourceESB, Oct. 5, 2005.

"Green Materials Market Will Reach $8.7 Billion By 2010," PCB007 , Nov. 23, 2005.

"Green/Pb Free Technology Solution," Amkor.

"Green Product: 2nd level reliability of tin plated components," Infineon.

"Green Product: Affected materials," Infineon.

"Green Product: Solderability of tin plated components (V1.3)." Infineon.

"Green Semiconductor Packaging: Addressing the Environmental Concerns of the 21st Century," IDT, Nov. 2004.

"Greenpeace exposes illegal dumping of e-waste in Nigeria," evertiq , Feb. 19, 2009.

"Greenpeace ranks Apple last in greenness," emsnow, Apr. 4, 2007.

"Greenpeace: Toxic E-Waste in China and India Dumps," Design News , vol. 60 no. 14, pp. xx, Oct. 10, 2005.

"Greenpeace's campaign against brominated flame retardants continues to ignore fire safety," evertiq, Apr. 16, 2008.

"Growing Adoption of Lead-Free Electronic Assemblies Challenged by Materials and Process Considerations," Appliance Design, vol. xx no. xx, pp. xx-xx, Aug. 24, 2004.

"Growth in PC Recycling, Refurbishing to Meet Expanding Regulations, IDC Says," Electronic News, Nov. 1, 2005.

"Guidance Document on the Appliance of Substances under Special Attention in Electric & Electronic - Products, Version 2.2," Nov. 25, 2002.

"Guidance for the Lead-Free Marking of Materials, Components and Mounted boards used in Electronic and Electric Equipment," JEITA, Sept. 5, 2004.

"Guide for U.S. High-Tech Companies Describes Far-Reaching Strategic Impact of European Environmental Laws." Surface Mount Technology Online, Apr. 29, 2003.

"Guidelines for Suppliers Transitioning to RoHS Compliant Components (Rev. 1.1),"

"Guidelines for the Management of Chemical Substances in Products, Version 1.1," Japan Green Procurement Survey Standardization Initiative (JGPSSI), Oct. 27, 2006.

"Hakko and Pb-Free Soldering Tips,", American Hakko Products.

"Half of electronic product companies plan to convert component for RoHS compliance," emsnow, Jan. 10, 2007.

"HALF won't make the Pb-free deadline," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Jan. 2006.

"Halogen-free is not for free!," emsnow, Sept. 15, 2006.

"Halogenated fire retardants," Electronics Manufacture and Test , vol. xx no. xx, pp. xx-xx, Apr. 7, 2004.

"Halogenated flame retardants continue to dominate Chinese market," evertiq, Oct. 24, 2007.

"Halogens and Halides - Jan 08," Alpha.

"Halt WEEE Implementation Say U.K.'s Main Domestic Appliance Producers," Appliance Design, vol. xx no. x, pp. xx-xx, June 2006.

"Hand-held tool tests for lead in electronics," Military & Aerospace Electronics, vol. 16 no. 1 pp. xx-xx, Jan. 2005.

"Hand-held XRF analyzer suggestion," Circuitnet, July 31, 2006.

"Hand soldering for Lead-Free," Circuitnet, Sept. 18, 2006.

"Hand soldering process for lead-free," Circuitnet, Sept. 25, 2006.

"Happy 10th Anniversary SN100C," Electronics Production World , Jan. 22, 2009.

"Happy 10th Anniversary SN100C," Global SMT and Packaging, vol. 9 no. 2, Feb. 2009, pp. 28-30.

"Happy 10th aniversary SN100C!," Tin World, no. 27, pp. 12-15, Summer 2009.

"Harsh life for Pb-free," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, Apr. 2004.

"HASL PCB's compared to OSP?," Circuitnet, Feb. 12, 2007.

"HASL Replacement - Immersion White Tin," Omni Graphics.

"Havoc in the supply chain," Purchasing, vol. xx no. xx, pp. xx-xx, Dec. 9, 2004.

"Hazardous Materials Concerns and Tyco Electronic Products," Tyco Electronics, Sept. 2004.

"HCL Launches RoHS Compliance Management System For Medical Device Users," PCB007, May 18, 2006.

"Help is at hand for producers who will soon be responsible for their waste electrical goods," Mar. 1, 2002.

"Help Oppose REACH-Type Legislation in Senate This Week," CircuiTree , vol. 21 no. 4, pp. xx-xx, Apr. 2008.

"Helping Companies "Go Green"," Supply & Demand Chain Executive , vol. xx no. x, pp. xx-xx, xxxx.

"Helping OEMs meet environmental responsibilities," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, July 14, 2008.

"HEPCO's LeadHoundC Chases RoHS/WEEE and Leaded Compliance," PCB007 , Feb. 15, 2006.

"Here WEEE go," Materials World, vol. 13 no. 5, pp. 4, May 2005.

"hex-chrome alternatives directory," Metal Finishing, vol. 106 no. 4, pp. 69, Apr. 2008.

"High Density Anisotropic Conductive Film," btechcorp.

"High frequency vibration tests of Sn-Pb and lead-free solder joints," Tin World, no. 19, pp. 14, Autumn 2007.

"High Performance Low Cost Interconnections for Flip Chip Attachment with Electrically Conductive Adhesive," DOE/AL/98817--T1, DARPA TRP No. DE-FC-04094AL98817.

"High-Speed, Non-Whiskering Tin for Semiconductor Packages," Products Finishing, vol. 47 no. 12, pp. 80, Sept. 1983.

"High Tech Industry's Use of Chemical in Products."

"High Temperature Lead-Free Solders: Tools for the Microelectronics Industry," "High Temperature Report," Anadigics Application Note, Apr. 2003.

"Hitachi's Pb-Free Solder Retains Bond Strength at 200C," PCB007 , Mar. 2008, .

"Hot Air Leveling in the Lead-Free Environment," CircuiTree, vol. 19 no. 2, pp. xx-xx, Feb. 2006.

"Hot-Dip Tin Process Said to Prevent Whisker Formation," Products Finishing, vol. 73 no. 7, pp. 11, Apr. 2009.

"Hour One: High-tech Breakdown," Science Friday, vol. xx no. xx, pp. xx-xx, May 22, 1998.

"How Advantages of Vapour Phase for Lead-Free Reflow Can Impact Production," SMART Group 8th Annual Lead-Free Seminar + 'Question Time' & Table-Top Exhibition, High Wycombe, United Kingdom, Feb. 16, 2006.

"how far, how fast?," Coretec, 2004.

"How lead-free trends impact distribution," Purchasing, vol. 134 no. 7, pp. 30, Apr. 21, 2005.

"How many zones are adequate for lead free profile," Circuitnet , May 12, 2008.

"How Much Lead to Get Out?," EDN, vol. 47 no. 9, pp. 58, Apr. 18, 2002.

"How to comply with the RoHS Directive," ERA Technology.

"How-to Guide: Reduce RoHS Compliance Risk Using Portable XRF Analyzers," Assembly, vol. xx no. xx, pp. xx-xx, Mar. 17, 2006.

"HP boasts of electronics recycling," Electronics Weekly, July 16, 2007.

"HP says RoHS making whiskers problem worse," evertiq, Feb. 22, 2005.

"HP's Position Statement on Tin-based Plating for Lead-free Components," Apr. 7, 2003.

"HUG debates EPA study, solder finishes," Printed Circuit Fabrication , vol. 24 no. 1, pp. 18,20, Jan. 2001.

"Hughes Satellite Failures Continue To Plague New Owner," Electronics Weekly, Apr. 24, 2001.

"Hughes Seeks To Salvage Satellites," Television Digest with Consumer Electronics, vol. xx no. xx, pp. xx-xx, Sept. 11, 2000.

"IBM Taps Solution to Ensure RoHS Compliance," Supply & Demand Chain Executive," June 13, 2005.

"IDB to help LCD TV, electric-vehicle makers set up model "green" plants," CENS.com, June 30, 2005.

"Identification is Requested by Law on Plastics Containers and Packaging, and on Paper Containers and Packaging," Ministry of Economy, Trade and Industry.

"Identification of Non-Line-of-Sight Hard Chromium Alternatives (Task N.229)."

"Identifying Industry Sectors in the Northeast That Emit or Transfer Lead or Lead Compounds (Draft)," Northeast Waste Management Officials' Association (NEWMOA), Dec. 2001.

"IDT: 99 percent lead free already," SourceESB, Dec. 1, 2004.

"IEC, IPC Highlight Inadequacies Of Traditional Test Methods For Ensuring Reliability Of Lead-Free Electronic Assemblies," PCB007, July 20, 2006.

"IEC, IPC highlight inadequacies of traditional test methods for ensuring reliability of lead-free electronic assemblies," emsnow, July 20, 2006.

"IEC, IPC highlights inadequacies of traditional test methods for ensuring reliability of lead-free electronic assemblies," Dataweek, vol. xx no. xx, pp. xx-xx, Aug. 23, 2006.

"IEC/PAS 61906: Procedure for the declaration of materials in products of the electrotechnical and electronic industry," Dec. 17, 2004.

"IECQ Launches Lead-Free Certification Program for Electronics," Compliance Engineering, vol. 22 no. 2, pp. 18, 20, 2005 EMC Update.

"IKP Department of Life-Cycle Engineering," University of Stuttgart.

"Immersion Tin Finish," Electronics Manufacture and Test, Oct. 27, 2008.

"Impact of EU's Energy Use Directive Could Be Significant," June 2, 2006.

"Impact of EU's Energy Use Directive Could Be Significant," Conformity, vol. 11 no. 8, pp. 9, Aug. 2006.

"Impact of Lead Free Implementation - Solder Selection," SMART Group 8th Annual Lead-Free Seminar + 'Question Time' & Table-Top Exhibition, High Wycombe, United Kingdom, Feb. 16, 2006.

"Impact of the RoHS Directive on Electronic Products Sold in the United States," INFORM, Sept. 2003.

"Impact of Unknown Component Alloy Finish During the Lead-free Transition Period," National Physical Laboratory, Nov. 2003.

"Implementing Cleaner Printed Wiring Board Technologies: Surface Finishes," , United States Environmental Protection Agency, Mar. 2000.

"Important information concerning forthcoming Government legislation: Directive on Waste Electrical and Electronic Equipment (WEEE), Directive on the Restriction of use of certain Hazardous Substances (RoHS): A guide to the marketing, product development and manufacturing actions you need to take."

"Imposing Standards for RoHS Compliance," EuroAsia Semiconductor , vol. xx no. xx, pp. xx-xx, Nov. 2005.

"Improved Design Life and Environmentally Aware Manufacturing of Electronics Assemblies by Lead-Free Soldering: "IDEALS"," May 1996.

"Inadvertent Reactor Trip and Partial Safety Injection Due to Tin Whisker," United States Nuclear Regulatory Commission, NRC Information Notice 2005-25, Aug. 25, 2005.

"Increases in Silver Prices Affect Material Costs," Advanced Packaging, vol. 15 no. 7, pp. 10, July 2006.

"Industry and Governments Study RoHS Harmonization," IPC Review, vol. 48 no. 7, pp. 12-14, Aug. 2007.

"Industry braces for the lead-free conversion," SourceESB, Nov. 3, 2004.

"Industry calls for non-compliant parts," SourceESB, Oct. 19, 2005.

"Industry Groups Continue Focus on Tin Whiskers," CPMT Society Outlook , vol. 1, pp. 3-4, 2005.

"Industry not prepared for REACH," Electronics Manufacture and Test , vol. xx no. xx, pp. xx-xx, Aug. 4, 2008.

"Industry Sees First Prosecution for RoHS Noncompliance," IPC Review , vol. 48 no. 10, pp. 6, Dec. 2007.

"Industry Voices Call for U.S. RoHS," SMT Web Exclusive Article.

"Industry Vows to Eliminate Mercury in Button Cell Batteries," Conformity, vol. 11 no. 6, pp. 56, June 2006.

"iNEMI HFR-Free Leadership Program launches with 22 companies participating," Circuitree, vol. 22 no. 9, pp. 9-10, Sept. 2009.

"iNEMI Hi-Rel Group Tackles Lead-free Manufacturing Challenges," SMT Web Exclusive Article.

"iNEMI High-Reliability Group Makes Recommendations for Pb-Free Manufacturing Requirements," PCB007, Mar. 7, 2006.

"iNEMI High-Reliability Group makes recommendations for Pb-Free manufacturing requirements," emsnow, Mar. 8, 2006.

"iNEMI High-Reliability Group makes recommendations for Pb-free manufacturing requirements," Tin World, no. 13, pp. 17, Spring 2006.

"iNEMI High-Reliability Group Publishes Guidelines for Subassemblies in High-Reliability Applications," PCB007, June 23, 2006.

"iNEMI High-Reliability Group publishes guidelines for subassemblies in high-reliability applications," emsnow, July 5, 2006.

"iNEMI High-Reliability Group publishes guidelines for subassemblies in high-reliability applications," July 17, 2006.

"iNEMI High-Reliability Task Force Position Statement on RoHS5 & RoHS6 Subassembly Modules," iNEMI.

"iNEMI, IPC and RosettaNet Collaborate on Development of Specifications for Materials Declarations," PCB007, Apr. 21, 2005.

"iNEMI / IPC Meeting at Productronica Focuses on Implementation of Materials Composition Data Exchange Standards," PCB007, Nov. 1, 2005.

"iNEMI launches new collaborative efforts," evertiq, Apr. 2, 2008.

"iNEMI Lead-Free Assembly & Rework Project Reports Results at IPC Printed Circuit Expo/APEX/Designers Summit."

"iNEMI Makes Recommendations for Managing Pb-Free Alloy Alternatives," CircuiTree, vol. 21 no. 7, pp. xx-xx, July 2008.

"iNEMI Makes Recommendations for Pb-Free Manufacturing Requirements," CircuiTree, vol. 19 no. 3, pp. xx-xx, Mar. 2006.

"iNEMI Makes Recommendations for Pb-Free Manufacturing Requirements," CircuiTree, vol. 19 no. 5, pp. xx-xx, May 2006.

"iNEMI Members Call for Unique Part Numbers for Ball Metallurgies on Lead-Free Components," Printed Circuit Design and Manufacture, vol. 24 no. 6, pp. 10, June 2007.

"iNEMI members call for unique part numbers to differentiate ball metallurgies on Pb-Free BGA components," emsnow, May 9, 2007.

"iNEMI Members Laud Material Declarations Standard," SMT Web Exclusive Article.

"iNEMI Members Want Unique Part Numbers for RoHS-Compliant Components," CircuiTree, Apr. 27, 2005.

"iNEMI members want unique part numbers for RoHS-compliant components," emsnow, Apr. 28, 2005.

"iNEMI Members Want Unique Part Numbers for RoHS-Compliant Components," PCB007, Apr. 27, 2005.

"iNEMI Mobilizes for Tin/lead BGAs," SMT Web Exclusive Article.

"iNEMI Organizes Task Group to Address Availability of SnPb BGAs," Circuitree, vol. 19 no. 11, pp. xx-xx, Nov. 2006.

"iNEMI Organizes Task Group to Address Availability of SnPb BGAs," PCB007, Nov. 8, 2006.

"iNEMA organises task group to address availability of SnPg BGAs," Tin World, no. 16, pp. 14, 2006.

"iNEMI publishes book about Lead-Free," evertiq, Nov. 4, 2007.

"iNEMI Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products Version 4 (12-1-06)," iNEMI, Dec. 1, 2006.

"iNEMI recommends approaches for managing Pb-Free alloy alternatives," evertiq, July 10, 2008.

"iNEMA recommends approaches for managing Pb-free alloy alternatives," Tin World, no. 23, pp. 7, Summer 2008.

"iNEMI recommends approaches for managing Pb-free alloy alternatives," emsnow, July 16, 2008.

"iNEMI releases standards for RoHS transition," SourceESB, Sept. 21, 2005.

"iNEMI Task Force Addresses Lead-free Issues," Advanced Packaging , vol. xx no. xx, pp. xx-xx, Aug. 25, 2005.

"iNEMI Task Force Addresses RoHS Transition Issues," iNEMI, Aug. 25, 2005.

"iNEMI Task Force Addresses RoHS Transition Issues," PCB007, Aug. 25, 2005.

"iNemi task force addresses RoHS transitions issues," emsnow, Sept. 8, 2005.

"iNEMI Tin Whisker Accelerated Test Project Test Method for Evaluating Tin Whisker Growth on Plated Surfaces." International Electronics Manufacturing Initiative, June 17, 2004.

"iNEMI tin whisker group publishes updated recommendations," Tin World, no. 17, pp. 11, Spring 2007.

"iNEMI Tin Whisker user group publishes updated recommendations to help reduce risk of tin whiskers," emsnow, Dec. 20, 2006.

"iNEMI Tin Whisker Workshop," Tin World, no. 18, pp. 14, Early Summer 2007.

"iNEMI Updates Tin Whiskers Findings," SMT Web Exclusive Article.

"iNEMI want unique part numbers for RoHS-compliant components," evertiq, Apr. 29, 2005.

"iNEMI Whitepaper Tracks Members' Progress," Surface Mount Technology (SMT), vol. 26 no. 2, pp. 16, Feb. 2011.

"iNEMI's recommendations for Pb-Free Manufacturing Requirements," evertiq, 2006. Mar. 8,

"Information Gathering Exercise to provide information for the review of Directive 2002/96/EC of the European Parliament and of the Council on Waste Electrical and Electronic Equipment (WEEE)," (Consultation period ended Aug. 11, 2006.)

"Information on China's Planned RoHS Regulations," Conformity , vol. 11 no. 6, pp. 56, June 2006.

"Information Resource on the EU's RoHS, WEEE Directives," Conformity , vol. 11 no. 7, pp. 45, July 2006.

"Information shows how to meet EU RoHS regulations," Advanced Materials & Processes, vol. 164 no. 2, pp. 24-25, Feb. 2006.

"Innov-X Responds to the European Union's RoHS Toxic Metals Directive for Electronics," EExpress, vol. xx no. xx, pp. xx-xx, Jan. 5, 2005.

"Innovative Technology: X-Ray Fluorescence Field Analysis," Northeast Waste Management Officials' Association (NEWMOA), Sept. 21, 1999.

"Input for Information Gathering Exercise for review of Directive 2002/96/EC." AeA, EICTA, and Japan Business Council in Europe, Aug. 11, 2006.

"Inspection Guide Illustrates Defects," SMT Web Exclusive Article.

"Inspections, Compliance, Enforcement, and Criminal Investigations Tin Wiskers Problems, Causes, and Solutions," Food and Drug Administration, Mar. 14, 1986.

"Intel eliminates lead from future microprocessors," emsnow, May 25, 2007.

"Intel's 95 per cent lead reduction does not satisfy RoHS," Electronics Weekly, Apr. 14, 2004.

"Interconnection Substrates - Ceramic," 2004 IMAPS-CII / iNEMI Roadmaps.

"Interconnects pose several lead-free challenges," Green SupplyLine , Apr. 11, 2005.

"Interim Recommendations on Lead-Free Finishes for Components Used in High- Reliability Products,", NEMI, Mar. 2004.

"Intermetallics," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Mar. 7, 2004.

"International Tin Research Council Annual Report 1976," International Tin Research Institute, 1976.

"International Tin Research Council Annual Report 1977," International Tin Research Institute, 1977.

"International Tin Research Council Annual Report for 1980," International Tin Research Institute, 1980.

"International Tin Research Council Annual Report for 1982," International Tin Research Institute, 1982.

"International Tin Research Council Annual Report for 1983," International Tin Research Institute, 1983.

"International Tin Research Council Annual Report for 1984," International Tin Research Institute, 1984.

"Intertek Labtest signed a global services agreement with Matsushita Electric Industrial Co., Ltd on hazardous substance testing," Intertek Labtest Sparkle, vol. 174, May 2004.

"IPC-1066, Marking, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices," Bannockburn, IL: IPC, Nov. 2004.

"IPC-1081, Conflict Minerals Due Diligence Best Practices Guideline, Final Draft for Industry Review," Bannockburn, IL: IPC, July 2012.

"IPC-7351 Revs Forward," IPC Review, vol. 49 no. 3, pp. 10-12, Mar./Apr. 2007.

"IPC and JEDEC 'leading the way to lead-free'," PCB007, Jan. 14, 2004.

"IPC announces RoHS lead-free certification program, solder results," Connector Specifier, pp. 1, 6, Feb. 2006.

"IPC cert for RoHS program now available," evertiq, May 5, 2006.

"IPC Certification for RoHS Lead Free Electronics Assembly Process Capability Program Now Available," PCB007 , May 4, 2006.

"IPC Concerned with Oko-Institut Proposed Chemical Bans," Printed Circuit Design and Fab, vol. 25 no. 8, pp. 8, Aug. 2008.

"IPC continues to oppose RoHS amendments," Dataweek, pp. xx-xx, June 23, 2010.

"IPC Council Reports Best Lead-Free Solder," CircuiTree, vol. 18 no. 8, pp. xx-xx, Aug. 2005.

"IPC Counters RoHS Expansion Discussion," Surface Mount Technology Online Article, May 19, 2008.

"IPC Delivers Comments to the U.S. CPSC On Electronic Devices," PCB007, Nov. 13, 2008.

"IPC Determines Replacement for Lead Solder," Electronic News , July 4, 2005.

"IPC fights RoHS expansion proposal," Dataweek, vol. xx no. xx, pp. xx-xx, July 23, 2008.

"IPC Government Relations Committee Urges Industry to Pursue R&D Tax Credit for Lead-Free Implementation Costs," CircuiTree, vol. 21 no. 3, pp. xx-xx, Mar. 2008.

"IPC Halogen-Free TG Releases TBBPA Report," CircuiTree, vol. 21 no. 4, pp. xx-xx, Apr. 2008.

"IPC Helps Industry Work Through Materials Declaration Implementation," IPC Review, vol. 46 no. 11, pp. 23, Dec. 2005.

"IPC Initiates Scientific Dialogue on Proposed RoHS Expansion," PCB007, May 20, 2008.

"IPC Intel Lead Free Symposium Examines the Issues," IPC Review, vol. 47 no. 4, pp. 10, May 2006.

"IPC Introduces RoHS Lead Free Certification Program," PCB007 , Jan. 23, 2006.

"IPC Issues Call to Action on RoHS ," SMT Web Exclusive Article.

"IPC J-STD-075 Classifies Worst-Case Thermal Process Limitations for Electronic Components," CircuiTree, vol. 21 no. 9, pp. xx-xx, Sept. 2008.

"IPC/JEDEC J-STD-709 Definition of Maximum Limits on the Low-Halogens Bromine & Chlorine Used in Materials for Certain Electronic Components and Assemblies (Final Draft for Industry Review)," Bannockburn, IL: IPC, Sept. 2008.

"IPC launches lead-free website," Advanced Packaging, vol. xx no. xx, pp. xx-xx, Aug. 18, 2004.

"IPC lead-free study shows dissatisfaction with component manufacturers," Tin World, no. 15, pp. 9, 2006.

"IPC National Technology Roadmap: Electronic Interconnections 2002/2003 Overview."

"IPC outcry over proposed RoHS expansion," Dataweek, vol. xx no. xx, pp. xx-xx, June 11, 2008.

"IPC Prepares Industry for RoHS Compliance," SMT Web Exclusive Article.

"IPC publishes findings from round robin test program on lead-free solder," PCB007, Aug. 13, 2003.

"IPC publishes IPC-1752," emsnow, Mar. 13, 2006.

"IPC Publishes IPC-1752, Materials Declaration Management Standard," evertiq, Feb. 2, 2006.

"IPC Publishes IPC-1752, Materials Declaration Management Standard," CircuiTree, vol. 19 no. 3, pp. xx-xx, Mar. 2006.

"IPC Publishes Materials Declaration Standard," IPC Review, pp. 27, Feb./Mar. 2006.

"IPC Publishes Materials Declaration Standard," Route, Mar. 2006.

"IPC publishes revisions to IPC-A-610 and J-STD standards," Global SMT & Packaging, vol. 5 no. 4, pp. 42, Apr. 2005.

"IPC released lead free solder paste guide," evertiq, July 18, 2005.

"IPC releases REACH Guidebook," Tin World, no. 25, pp. 15, Winter 2008/2009.

"IPC Releases REACH Guidebook," SMT Web Exclusive Article.

"IPC Releases REACH Guidebook As Pre-Registration Deadline Approaches," PCB007, Nov. 11, 2008.

"IPC releases Revision B of IPC-7711/7721," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Feb. 4, 2008.

"IPC Releases Revision B of IPC-7711/7721 Lead Free Support and Inspection Guidelines for Repairs and Modifications," IPC Review, vol. 1 no. 1, pp. 3, Mar./Apr. 2008.

"IPC Roadmap: A Guide for Assembly of Lead-Free Electronics," June 2000.

"IPC sets replacement for lead solder," electronicsweekly.com , July 4, 2005.

"IPC sets replacement for lead solder," Electronics Weekly, July 4, 2005.

"IPC simplify RoHS declaration process," Circuit World, vol. 32 no. 3, pp. xx-xx, 2006.

"IPC Solder Products Value Council Releases White Paper on Increased Costs of Lead Free Solder Materials," Circuitree, vol. 19 no. 6, pp. xx-xx, June 2006.

"IPC Solder Products Value Council Releases White Paper on Increased Costs of Lead Free Solder Materials," PCB007, June 12, 2006.

"IPC SPVC announces research paper on solder joint voids for lead free solder," Soldering & Surface Mount Technology, vol. 18 no. 2, pp. xx-xx, 2006.

"IPC SPVC Announces Research Paper on Solder Joint Voids for Lead Free Solder, " PCB007, Dec. 15, 2005.

"IPC-SPVC-WP-006 Round Robin Testing and Analysis: Lead-Free Alloys: Tin, Silver and Copper," IPC, July 2003.

"IPC submit RoHS concerns," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Jan. 27, 2008.

"IPC submitted comments to the RoHS directive," evertiq, Jan. 22, 2008.

"IPC survey reveals electronics industry not prepared for reach," Circuit World, vol. 34 no. 3, pp. xx, 2008.

"IPC Urges California Members to Contact Department of Toxic Substances Regarding the Green Chemistry Initiative," CircuiTree, vol. 21 no. 4, pp. xx-xx, Apr. 2008.

"IPC urges no RoHS changes," Connector Specifier, vol. 24 no. 2, pp. 1,4, Mar. 2008.

"IPC voices concerns over RoHS revision developments," evertiq , Oct. 26, 2008.

"IPC Web Site Fights Halogen Fires," Printed Circuit Fabrication, vol. 23 no. 7, pp. 18, July 2000.

"IPC Works on RoHS Material Declaration Standards," Conformity , vol. 10 no. 11, pp. 48, 50, Nov. 2005.

"IPC Works on RoHS Material Declaration Standards," Conformity, pp. 213-214, Conformity 2006: The Annual Guide.

"IPC's Ball Grid Array Guideline Goes Lead Free," IPC Review, vol. 47 no. 5, pp. 12-13, June 2006.

"IPC's SPVC Answers the Million Dollar Question: What's Industry's Best Lead Free Solder?," PCB007, June 30, 2005.

"Is it possible to run Pb-Free reflow without nitrogen?," Circuitnet , May 24, 2006.

"Is lead contamination during cleaning of PB-free stencils possible?," Circuitnet, Aug. 21, 2006.

"Is PCB Baking Necessary?," Circuitnet, Mar. 16, 2009.

"Is solder supply to the EU at risk?," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Sept. 22, 2008.

"Is the electronics industry prepared for the RoHS directive?," Electronic Products, vol. 48 no. 9, pp. 35, 37-38, 40, 42-43, Feb. 2006.

"Is WEEE regulation a waste of time?," evertiq, Dec. 22, 2006.

"Isola Launches IS415," CircuiTree, vol. 17 no. xx, pp. 58, Sept. 2004.

"Isola Technology Overview," Isola, Mar. 2005.

"'Issues To Solutions' Initiative in Lead-Free Soldering," evertiq , Oct. 11, 2005.

"It is Easier Being Greener," Metal Finishing, vol. 106 no. 4, pp. 62-65, Apr. 2008.

"ITG Subject: Tin Whiskers - Problems, Causes, and Solutions," Department of Health, Education, and Welfare Public Health Service Food and Drug Administration *ORA/ORO/DEIO/IB*, Mar. 14, 1986.

"ITRI Annual Report for 1990," International Tin Research Institute, 1990.

"ITRI raises concerns over effect of new EU regulations on solder supply to Europe," Tin World, no. 24, pp. 15, Autumn 2008.

"It's Time To Get The Lead Out Of Our Designs," Electronic Design, vol. 48 no. 25, pp. 56, Dec. 4, 2000.

"J-STD-020B, IPC/JEDEC J-STD-020B, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices," Arlington, VA: JEDEC Solid State Technology Association, July 2002.

"J-STD-020C, IPC/JEDEC J-STD-020C Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices," Arlington, VA: JEDEC Solid State Technology Association, July 2004.

"J-STD-033A, IPC/JEDEC J-STD-033A, Joint Industry Standard Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices," Arlington, VA: JEDEC Solid State Technology Association, July 2002.

"J-STD-033B, IPC/JEDEC J-STD-033B Joint Industry Standard Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices," arlington, va: jedec solid state technology association, Oct. 2005.

"J-STD-075, EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes," Arlington, VA: JEDEC Solid State Technology Association, Apr. 2008.

"JAPAN progresses down the lead-free path," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, Apr. 2001.

"Japanese OEMs' Lead-free Initiative," Electronic Business, Feb. 1, 2000.

"JCAA/JG-PP Lead-Free Solder Project Joint Test Report Executive Summary (Draft)," NASA Acquisition Pollution Prevention (AP2) Office, Kennedy Space Center, FL, July 14, 2006.

"JCAA/JG-PP lead-free solder project reports," emsnow, June 15, 2006.

"JCAA/JG-PP Lead-Free Solder Study Results," PCB007, June 19, 2006.

"JEDEC and IPC Release Tin Whisker Acceptance Testing," Tin World , no. 14, pp. 11, 2006.

"JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," CircuiTree, vol. 19 no. 5, pp. xx-xx, May 2006.

"JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," PCB007, May 4, 2006.

"JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," FPGA and Structured ASIC Journal, vol. xx no. x, pp. xx-xx, May 4, 2006.

"JEDEC and IPC release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," emsnow, May 5, 2006.

"JEDEC, iNEMI Update Tin Whisker and Lead-Free Surface Finish Guidelines," CircuiTree, vol. 18 no. 7, pp. xx-xx, July 2005.

"JEDEC, IPC Release Tin Whisker Acceptance Testing Standard," Circuitree, vol. 19 no. 6, pp. xx-xx, June 2006.

"JEDEC, IPC Release Tin Whisker Standards," Printed Circuit Design and Manufacture, vol. 23 no. 6, pp. 8, June 2006.

"JEDEC Releases Standard for Tin Whisker Testing and iNEMI User Group Updates Lead-Free Surface Finish Guidelines," PCB007, May 24, 2005.

"JEITA ETR-7021. Guidance for the Lead-Free Marking of Materials, Components and Mounted Boards used in Electronic and Electric Equipment, Japan Electronics and Information Technologies Industries Association, June 2004,

"JEITA Whisker Test Method Project," IPC and SOLDERTEC Global Conference, Brussels, June 2003.

"JEP113-B, Symbol and Labels for Moisture-Sensitive Devices," Arlington, VA: JEDEC Solid State Technology Association, May 1999.

"JESD201, Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes," Arlington, VA: JEDEC Solid State Technology Association, Mar. 2006.

"JESD22-B102D, Solderability," Arlington, VA: JEDEC Solid State Technology Association, Sept. 2004.

"JESD22-B106C, Resistance to Soldering Temperature for Through-Hole Mounted Devices," Arlington, VA: JEDEC Solid State Technology Association, Feb. 2005.

"JESD22A121, Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes," JEDEC Solid State Technology Association, May 2005.

"JESD22A121.01, Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes," JEDEC Solid State Technology Association, Oct. 2005.

"JESD97, Marking, Symbols, and Labels for Identification of Lead (Pb) Free Assemblies, Components, and Devices," Arlington, VA: JEDEC Solid State Technology Association, 2004.

"JETRO Releases the Results of its Survey of Japanese Manufacturers in Europe and Turkey," PCB007, May 26, 2006.

"JGPSSI Guidelines for the Management of Chemical Substances in Products Ver. 1.1 (List of Revisions to Main Text)," Japan Green Procurement Survey Standardization Initiative (JGPSSI), Nov. 7, 2006.

"JIG-101, Joint Industry Guide (JIG), Material Composition Declaration for Electronic Products," Arlington, VA: JEDEC Solid State Technology Association, Apr. 2005.

"JIG Detailed Chemicals List (with JGPSSI Substsnce No.)," Japan Green Procurement Survey Standardization Initiative (JGPSSI), Apr. 26, 2006.

"JIS C 0950:2005, The marking for presence of the specific chemical substances for electrical and electronic equipment," JEITA, 2005. (Also called J-MOSS, or Japan RoHS)

"Joint DoD/ NASA/ Industry Lead Free Solder Project," Joint Council on Aging Aircraft/Joint Group on Pollution Prevention. (only printed out through section 3.3.3)

"Joint Industry Guide: Material Composition Declaration Guide (Draft)," Sept. 19, 2003.

"Joint Lead-Free Solder Test Program for High Reliability Military and Space Applications."

"Joint Position Paper: Implementation of the EU Battery Directive: Ensuring the Workability of the Batterie Removability Requirement," ACEA, AeA, ceced, EICTA, FHS, Japan Business Council in Europe, Dec. 7, 2006.

"JP002, Current Tin Whiskers Theory and Mitigation Practices Guideline," Arlington, VA: JEDEC Solid State Technology Association and Bannockburn, IL: IPC, Mar. 2006.

"Korea and China Formalizing RoHS Requirements," IPC Review, vol. 48 no. 5, pp. 5, June 2007.

"Korea gets behind RoHS," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Jan. 7, 2008.

"Korea Moves Ahead with Plans for RoHS Regulations," Conformity , vol. 11 no. 8, pp. 88, Aug. 2006.

"Korea Moves Ahead with RoHS Requirements," Conformity, 2007 Engineers' Reference Guide, pp. 221-222, 2007.

"Korea Moves to Adopt RoHS-like Requirements," Conformity, vol. 11 no. 7, pp. 45, July 2006.

"Korrosionsschutz ohne Chrom(VI) Nur noch 739 Tage Chromatierung - und dann?," Galvanotechnik, vol. xx no. xx, pp. 2674-2682, Nov. 2005.

"Lack of component data threatens RoHS plans," Electronics Weekly , Feb. 11, 2004.

"Landfill Alloys Help Manufacturers Get the Lead Out of Electronics," Science News, June 10, 2005.

"Latest lead-free research highlights new stencil design rules," evertiq, Nov. 18, 2005.

"Latest moves to get industry lead-free," Electronics Times, vol. xx no. xx, pp, xx-xx, Mar. 27, 2000.

"Latest OEM Push to "Green" Needs More Science," Printed Circuit Design and Fab, vol. 25 no. 7, pp. 10, July 2008.

"Latest Plating Technology for the PCB industry," Transactions of the Institute of Metal Finishing, vol. 86 no. 6, pp. 293, Nov. 2008.

"Latest Solder Mask Spec Addresses Lead-Free," Printed Circuit Design and Manufacture, vol. 24 no. 3, pp. 10, Mar. 2007.

"Launch of Report: XRF Measurement of Residual Materials in Electronics," Circuitnet, Nov. 28, 2007.

"Lead Elimination from Printed Wiring Assemblies (Get the Lead Out!)," Boeing Environmental Technotes, vol. 7 no. 1, pp. 1-4, Feb. 2002.

"Lead Free Electronics Impact on DoD Programs," DMSMS Conference 2007, Orlando, FL, Oct. 29, 2007, pp. xx-xx.

"Lead-free: a weighty debate," Electroline, 2003.

"Lead-Free Activities," KOA, Oct. 2002.

"Lead-Free Alloy Information," AIM.

"Lead-Free Alloy Trends for the Assembly of Mixed Technology PWB's," Proceedings of the Technical Program NEPCON West 2000, Volume 2, Anaheim, CA, Feb. 29-Mar. 2, 2000, pp. 1091-1093.

"Lead-free Alloys Effect Back-end Manufacturing Technologies," Advanced Packaging, vol. xx no. xx, pp. xx-xx, Sept. 21, 2005.

"Lead-free Alloys Impact Back-end Semi Manufacturing Dynamics," ElectronicNews, May 11, 2005.

"Lead-free Alloys Impact Dynamics of Back-end Semiconductor Manufacturing Technologies," PCB007, May 10, 2005.

"Lead Free Alloys Impact Dynamics of Back-end Semiconductor Manufacturing Technologies," PCB007, Sept. 21, 2006.

"Lead-Free Alloys Impact Manufacturing," Electronic News, Sept. 21, 2005.

"Lead-free alloys impact manufacturing," Electronics Weekly, Sept. 22, 2005.

"Lead-Free Alloys - The Way Forward," Lead free Soldering Technology Center.

"Lead-Free and RoHS Are in Full Swing ... are you ready?," Lead-Free Connection, vol. 2 no. 2, pp. 1, June 2005.

"Lead-free and RoHS developments in China," evertiq, Dec. 3, 2004.

"Lead-Free Assemby -- Close Relationships with Suppliers Goes a Long Way," Lead-Free Connection, vol. 1 no. 2, pp. 1, Nov. 2004.

"Lead-free bar solder for wave soldering," Circuitnet, Mar. 4, 2007.

"Lead Free BGA Reflow," Circuitnet, June 25, 2007.

"Lead free BGA's and HASL," Circuitnet, Sept. 5, 2006.

"Lead-free brought to book," Electronics Manufacture and Test , vol. xx no. xx, pp. xx-xx, Nov. 5, 2007.

"Lead-Free/Cadmium-Free Metals & Alloys," Indium Corporation of America.

"Lead-free causes headaches for military manufacturers," Components in Electronics, vol. xx no. xx, pp. xx-xx, May 2006.

"Lead-free commercially close, but likelihood only 18%," Solid State Technology, vol. 45 no. 8, pp. 22, 24, Aug. 2002.

"Lead-free connector rework," Circuitnet, Apr. 2, 2007.

"Lead-Free Conversion Program," STMicroelectronics, June 2, 2004.

"Lead-free conversion update," Purchasing, vol. xx no. xx, pp. xx-xx, Jan. 13, 2005.

"Lead-free debacle threatens the industry - for nothing, says expert Miller," PCB007, Nov. 10, 2004.

Lead-Free Defect Guide 2, SMART Group, 2010.

"Lead Free Dross Removal," Circuitnet, Sept. 15, 2008.

"Lead-Free ECTC Panel," Components, Packaging, and Manufacturing Technology Society Newsletter, vol. 28 no. 2, pp. 14, June 2005.

"Lead-Free Electronic Industry," Toxics Use Reduction Institute.

"Lead-free electronic solder: report asks "Why?"," PCB007, Apr. 18, 2002.

"Lead Free Electronics Assembly: How Will This Unfold?," Prismark Partners LLC, May 2002.

"Lead-free Electronics in Aerospace Systems," Boeing, Nov. 16, 2006.

Lead Free Electronics Manhattan Project Phase 2. ACI Technologies, Feb. 10, 2010.

"Lead Free Electronics pose reliability problems," NAVAIR News Release E200709171, Sept. 17, 2007.

"Lead-free electronics - virtual panel discussion," Elektron, vol. xx no. xx, pp. 10-12, Oct. 2005.

"Lead-free exemptions--FYI." Connector Specifier, vol. 21 no. 2, pp. xx-xx, Feb. 2005.

"Lead Free Flux," Circuitnet, Sept. 2, 2008.

"Lead-free: Friction and Wear," Tyco Electronics.

"Lead-free: get the FAQs," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, Mar. 2004.

"Lead Free: How Will IPC Standards Change?," Route, Sept. 2005.

"Lead-Free Implementation Checklist," Speedline Technologies, 2005.

"Lead-free initiatives expand horizons for selective soldering technology," Tin World, no. 30, pp. 15-16, Spring 2010.

"Lead-Free Introduction."

"Lead-Free Just Keeps Going and Going and ...," Design News, vol. 60 no. 9, pp. xx, June 27, 2005.

"Lead Free Materials, Merix.

""Lead-Free or Not to Be", That is the Question," PCB007, Mar. 14, 2005.

"Lead-Free Packages," Mindspeed SMT Application Note.

"Lead-free packaging for semiconductor devices," E3 presentation, June 2003.

"Lead-free packaging for semiconductor devices," E4 presentation, Oct. 29, 2004.

"Lead-free parts need extensive testing," SourceESB, Nov. 2, 2005.

"Lead-free parts: Welcome to the messy supply chain," SourceESB, Jan. 12, 2005.

"Lead-free PCBs gradually gain dominance in Asia," Global Sources , July 10, 2006.

"Lead-free: Polymers at high temp," Tyco Electronics.

"Lead-Free Process Support Guide," Balver Zinn.

"Lead Free Product Testing," Trace Laboratories-East.

"Lead Free Product Testing/Tin Whisker Testing," Trace Laboratories-East.

"Lead-Free Program Overview," Intel.

"Lead-Free Project Builds Momentum," Circuits Assembly, vol. 11 no. 11, pp. 12, Nov 2000.

"Lead Free (Pure Tin) Solder Coastings," State of the Art, Aug. 26, 2003.

"Lead-Free "Ready" Checklist," Arrow Electronics.

"Lead-free reflow puts new demands on rework equipment," Dataweek , vol. xx no. xx, pp. xx-xx, May 5, 2004.

"Lead-Free Reflow Soldering," Circuitnet, Jan. 15, 2007.

"Lead-Free Risk Mitigation - A Case Study," aci.

"Lead-Free RoHS Assembly Training," Kester, 2006.

"Lead-free Semiconductors: Technologies and Roadmaps," STMicroelectronics, Mar. 2003.

"Lead-free solder alloy data provided in European database," Advanced Materials & Processes, vol. 164 no. 9, pp. 19-20, Sept. 2006.

"Lead-Free Solder Alloys," American Hakko Products.

"Lead-Free Solder Assembly for Mixed Technology Circuit Boards."

"Lead-Free solder failure mechanisms," TWI LiveWire, issue 11, Nov./Dec. 2003.

"Lead-Free solder failure mechanisms: What are Tin Whiskers?," LiveWire, no. 11, pp. xx-xx, .Nov./Dec. 2003.

"Lead-Free Solder Frequently Asked Questions:," Indium Corporation of America.

"Lead Free Solder From The HASL Process - The Newest Surface Finish Alternative," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

"Lead-free solder health concerns raised," Dataweek, vol. xx no. xx, pp. xx-xx, June 14, 2006.

"Lead-Free Solder Lessens Environmental Burden," Defense Tech Briefs , vol. 2 no. 3, pp. 36, June 2008.

"Lead-free solder licensed worldwide as EU lead-free rules take effect," Dataweek, vol. xx no. xx, pp. xx-xx, Sept. 20, 2006.

"Lead-free solder pastes drop-in replacements?," Circuitnet, Apr. 3, 2006.

"Lead Free Solder Process Compatibility," Wiring Harness News, vol. xx no. xx, pp. xx-xx, Nov./Dec. 2002.

"Lead-Free Solder Report," Adhesives & Sealants Industry, vol. 12 no. 11, pp. 76, Nov. 2005.

"Lead-free solder SN100C (Sn-Cu-Ni+Ge)," Nihon Superior.

"Lead-free solder: the issues," Envirowise EN287.

"Lead Free Solder: "Why Bother"," SMART Group Lead-Free Seminar 1999 , High Wycombe, UK, Feb. 10, 1999.

"Lead-free: Solderballs and BGA," Tyco Electronics, Oct. 2002.

"Lead Free: Solderability," Tyco Electronics.

"Lead-free soldering and tools," Dataweek, vol. xx no. xx, pp. xx-xx, July 28, 2004.

"Lead-free soldering and tools," Dataweek, vol. xx no. xx, pp. xx-xx, Oct. 19, 2005.

"Lead-free soldering defects exposed," TWI, Feb. 23, 2005.

"Lead-free soldering defects exposed," Connect, vol. xx no. xx, pp. xx-xx, Feb. 23, 2005.

"Lead Free Soldering for Sustainment," empfasis, pp. xx-xx, Mar./Apr. 2003.

"Lead-free Soldering for the Attachment of uBGA Packages," Tessera Application Note, Jan. 2001.

"Lead-Free Soldering Guide," AIM.

"Lead-free soldering - One Year On.," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, May 2000.

"Lead-free soldering problem," Circuitnet, Jan. 29, 2007.

"Lead Free Soldering Rapid Response Project," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.

"Lead-free soldering: reduce process variation by measuring wetting," TWI LiveWire, no. 16, Apr.-May 2005.

"Lead-free soldering term?," Circuitnet, May 21, 2007.

"Lead-Free Soldering with High-Power Diode Lasers," Coherent Application Tech Note, Mar. 2002.

"Lead-free solders and electromechanical switches," Machine Design , vol. xx no. xx, pp. 54, Apr. 1, 2004.

"Lead-free solders increase the need for bench-top fume extraction," Dataweek, vol. xx no. xx, pp. xx-xx, Mar. 21, 2007.

"LEAD-FREE solution at your fingertips," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, May 2002.

"Lead-Free Technology Experiment in a Space Environment."

"Lead-free Terminal Performance," NIC Components Corp., Dec. 26, 2002.

"Lead Free Tin Whiskering Study: Grayhill DIP Switches," Grayhill, May 11, 2004.

"Lead-free transition using HAL lead-free boards," Circuitnet , Aug. 7, 2006.

"Lead Free Update," Purchasing, vol. xx no. xx, pp. xx-xx, Dec. 9, 2004.

"Lead Free Update," Purchasing, vol. xx no. xx, pp. xx-xx, Apr. 21, 2005.

"Lead Free Update," Purchasing, vol. xx no. xx, pp. xx-xx, Aug. 11, 2005.

"Lead Free Update: How connector makers plan to comply with RoHs mandate," Purchasing, vol. xx no. xx, pp. xx-xx, Feb. 17, 2005.

Lead-Free Watch: Countdown to July 1, 2005

"Lead-Free Wave Solder Processing CPS Study Phase I," Alpha-Fry Technologies.

"Lead-free wave soldering evaluation update," Soldering & Surface Mount Technology, vol. 15 no. 2, pp. xx, 2003.

"Lead-free: Whiskers on Tin," Tyco Electronics.

"Lead Free World," Sierra Proto Express.

"Lead in solder, bromine in epoxy - Guilt by association," PCB007 , July 5, 2000.

"Lead in Solders for Servers," AeA, EICTA.

"Lead levels in lead-free process," Circuitnet, Nov. 20, 2006.

"Lead (Pb)-free Product," Samsung Electronics, July 2002.

"Leaded Solder on ROHS Compliant Parts?," Circuitnet, June 2, 2008.

"Leaders in SMT Kester," Surface Mount Technology (SMT), vol. 23 no. 2, pp. 13, Mar.-Apr. 2009.

"Leaders in SMT: Nihon Superior," Surface Mount Technology (SMT), vol. 22 no. 7, pp. 7, July 2008.

"Leaders in SMT: phoenix|x-ray Systems+Services, Inc," Surface Mount Technology (SMT), vol. 22 no. 8, pp. 15-17, Aug. 2008.

"Leadfree Solder and Tin Whiskers Program Guidance (draft)," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.

"Leadfreesoldering Casebook."

"Legs 1, 2 & 3: Olin 194 8lead SOIC Molded/Singulated."

"Letter Re: "Industry Steps Up to Make the World A Bit Cleaner" or "Who's Responsible for the Lead-Free Mess"?," PCB007, June 14, 2006.

"Letter Re: "Industry Steps Up to Make the World A Bit Cleaner" or "Who's Responsible for the Lead-Free Mess?"," PCB007, June 27, 2006.

"Letters," Circuits Assembly, vol. 17 no. 9, pp. 8, Sept. 2006.

"Letters to the Editor," Military & Aerospace Electronics , vol. 16 no. 12, pp. xx-xx, Dec. 2005.

"Letters/CS Forum," Connector Specifier, vol. 21 no. 12, pp. 12, Dec. 2005.

"List: All substances that are possibly included in the new RoHS-directive," evertiq, Mar. 28, 2008.

"List of Banned, Restricted, and Materials Requiring Disclosure," Agere Systems.

"Locking into chrome free zinc," Finishing, vol. 32 no. 6, pp. 40,42, Nov.-Dec. 2008.

"Looking beyond RoHS & WEEE," Electronics Manufacture and Test , vol. xx no. xx, pp. xx-xx, June 7, 2006.

"Low Cost, Lead-Free Soldering Technology to Improve the Competitiveness of European SMEs," LEADOUT Hands On Lead-Free Workshop, Manchester, United Kingdom, June 21, 2006.

"Low cost lead-free soldering technology to improve the competitiveness of European SMEs," Connect, no. 153, pp. 8, Mar./Apr. 2008.

"Low cost resource for WEEE education," Electronics Weekly, Nov. 16, 2005.

"Low-halogen Electronics: The Next Lead Free?," IPC Review, vol. 48 no. 10, pp. 22-23, Dec. 2007.

"Lucent Technologies EC&S Hosts Open House At Its Staten Island Headquarters," Plating & Surface Finishing, vol. 88 no. 3, pp. 14, Mar. 2001.

"Lucent Technologies Venture announces electroplating process that gets the lead out of solder materials," Lucent Technologies, Apr. 28, 1999.

"Major OEMs, EMS Providers and Suppliers Pledge Support for IPC-1752," PCB007, Feb. 8, 2006.

"Major OEMs, EMS Providers and Suppliers Pledge Support for IPC-1752," IPC Review, pp. 5, 6, Apr. 2006.

"Makers inch their way to RoHS compliance," Global Sources, June 2, 2006.

"Making Product Information Work for the Environment," Integrated Product Policy Working Group on Product Information, Nov. 15, 2006.

"Making Sense of RoHS Related Labels," Arrow.

"Making the Transition," Recycling Today, vol. xx no. x, pp. xx-xx, Oct. 15, 2004.

"Management Summary."

"Manncorp Releases XBox Rework Solution," SMT Web Exclusive Article.

"Market for green materials to reach $8.7 billion by 2010," evertiq , Nov. 24, 2005.

"Marking - Comparison of Standards or Guidelines," SMARTgroup.

"Marking of Electrical and Electronic Equipment," Mar. 3, 2005.

"Marking, Symbols and Labels for Identification of Lead (Pb) Free Assemblies, Components and Devices."

"Maryland adopts electronics recycling law," WasteNews.com, May 13, 2005.

"Mastering Materials Declaration: Watch Out for Criminalization," IPC Review, vol. 47 no. 6, pp. 16-18, July 2006.

"Material Composition," RosettaNet.

"Material Composition Survey and Response Manual, Second Edition," Japan Green Procurement Survey Standardization Initiative (JGPSSI), May 26, 2006.

"Material Declaration: Who's in Charge?,"

"Materials Declaration Standard Users Speak Up," IPC Review, vol. 48 no. 8, pp. 15-16, Sept. 2007.

"Matsushita (Panasonic) develops new AdIT(R) technology employing conductive adhesives," PCB007, July 18, 2002.

"Matte Tin Plating Whisker Data," Lattice Product Bulletin PB1227H, Nov. 2010.

"MAUDE Adverse Event Report," 1996.

"MAUDE Adverse Event Report," 2008.

"Maximum thermal stress temperatures," Circuitnet, Nov. 19, 2007.

"MaxiTech.biz: Guide to Computer Recycling," PRWeb, July 7, 2005.

"Maxitech.biz Say That Obsolete PCs Don't Need to Add to the UK's 'e-Waste Mountain'," PRWeb, Jan. 2, 2005.

"Measurement methods for conductive adhesives."

"Measurements of Copper Dissolution in Lead-Free Solder Alloys." Circuitree, vol. 20 no. 1, pp. 51, Jan. 2007.

"Mechanical Plating with Tin-Cadmium Alloy," Tin and its Uses, no. 112, pp. x-x, 1977.

"Mechanism of Crystal Growth Discovered," Bell Laboratories Record , vol. 48 no. 4, pp. 142-143, Apr. 1964.

Electronic Products, vol. 48 no. 2, pp. 47-59, July 2005.

"Meeting the RoHS Deadline: A Three Step Guide to Compliance," PartMiner, 2005.

"Melting point of lead free solder."

"Metal Storehouse," Nickel, vol. 17 no. 3, pp. xx-xx, Mar. 2002.

"Metal Whiskers," Science, New Series, vol. 123 no. 3209, pp. 1165, Jun. 29, 1956.

"Metal Whiskers," finishing.com.

"Metallic Whisker Sources," Worldwide Environmental Services, 2004.

"Metallurgical Division Publications - NISTIR 6797 Technical Highlights,"

"Micro-balling with lead-free HASL and SAC alloy," Circuitnet , Dec. 14, 2009.

"Microsectioning of Lead-Free Solder Joints," empfasis, pp. xx-xx, July 2001.

"MicroStar BGA Packaging Reference Guide, 3rd Edition," Texas Instruments SSYZ015B, Sept. 2000.

"Military/Aerospace Forum," Electronic Products, vol. 49 no. 10, pp. 83, 85-92, Mar. 2007.

Electronic Products, vol. 47 no. 10, pp. 73-85, Mar. 2005.

"Military Facing Obsolescence Issues by RoHS," Design News, June 23, 2005.

"Minnesota Finisher Offers High-Purity Aluminum As an Environmentally Friendly Coating," Plating & Surface Finishing, vol. 89 no. 6, pp. 14-15, June 2002.

"Minutes of Declaration Process Management Meeting, Fiesta Inn - Tempe, AZ, January 19-21, 2005," IPC.

"Mitsubishi outlines lead-free solder efforts," PCB007, Aug. 19, 2003.

"Mix Solder," Nihon Superior Co., Ltd., Nov 1, 2004.

"Moisture-Sensitive Devices," Assembly, vol. xx no. xx, pp. xx-xx, Apr. 2006.

"Molecular Wires & Corrosion Control Boost Performance Of Conductive Adhesives," Space Daily, vol. xx no. xx, pp. xx-xx, Mar. 14, 2005.

"Most Asian companies will be RoHS compliant," Purchasing, vol. xx no. xx, pp. xx-xx, Mar. 16, 2006.

"Most Consumers Don't Care about Green," Design News, vol. 61 no. 12, pp. 24, Sept. 4, 2006.

"Most Design Engineers Are Ready For RoHS," Design News, vol. 61 no. 10, pp. xx-xx, July 17, 2006.

"Most discarded electronic devices are reused, study finds," Waste News, vol. xx no. x, pp. xx-xx, Oct. 24, 2006.

"Most Hong Kong manufacturers are RoHs compliant," Purchasing , vol. xx no. xx, pp. xx-xx, Feb. 23, 2006.

"Most want U.S. RoHS law," Purchasing, vol. xx no. xx, pp. xx-xx, Jan. 4, 2007.

"Moving into REACH?," Materials World, vol. 12 no. 8, pp. 27-29, Aug. 2004.

"Multi-metal Test Simplifies RoHS Screening," SMT Web Exclusive Article.

"Multiple Lead-free Profile," Circuitnet, June 30, 2008.

"Murata RoHS & Lead Reduction Activities," Murata, Sept. 23, 2004.

"MVR International Lauches www.mvr-gree.com: A Complete Resource Center About RoHS and Other Environmental Regulations," June 15, 2005.

"MVR to launch RoHS web site," evertiq, June 22, 2005.

"Nano Whiskers."

"Nanowire breakthrough could lead to roll-out solar panels, flexible electronics," American Ceramic Society Bulletin, vol. 92 no. 9, pp. 11, Dec. 2013.

"NASA's Suggestions for Reducing Risk of Tin Whisker Induced Failures," Products Finishing, vol. 74 no. 12, pp. 32, Sept. 2010.

"National Physical Laboratory announces new report," emsnow, July 2, 2004.

"NEDA seeks part numbers for Pb-free components," Purchasing, vol. xx no. xx, pp. xx-xx, Sept. 16, 2004.

"Need lead-free wire solder for hand soldering," Circuitnet, Sept. 25, 2006.

"NEMA Argues Against California's Proposed Battery Recycling Law," Conformity, vol. 11 no. 7, pp. 45, July 2006.

"NEMI backs standard for lead-free parts," Connector Specifier , vol. 20 no. 7, pp. xx-xx, July 2004.

"NEMI Group Releases Draft Proposal of Tin Whisker Acceptance Test Requirements," CircuiTree, vol. 17 no. 6, pp. xx-xx. June 2004.

"NEMI Group Recommends Tin/Silver/Copper Alloy as Industry Standard for Lead-Free Solder Reflow in Board Assemblies," NEMI, Jan. 24, 2000.

"NEMI Issues Revised Tin Whisker Acceptance Test Requirements," NEMI, Aug. 30, 2004.

"NEMI issues revised tin whisker acceptance test requirements," PCB007, Aug. 30, 2004.

"NEMI issues revised tin whisker acceptance test requirements," emsnow, Sept. 6, 2004.

"NEMI issues revised tin whisker test requirements," TIN World , no. 7, pp. 17, 2004.

"NEMI, ITRI Investigate Lead-Free Compatibility," Circuits Assembly , vol. 11 no. 7, pp. 16, July 2000.

"NEMI makes lead-free part identification recommendations," Advanced Packaging, vol. xx no. xx, pp. xx-xx, June 22, 2004.

"NEMI makes recommendations for Lead-Free part identfication," emsnow, June 14, 2004.

"NEMI makes recommendations for lead-free part identification," PCB007, June 22, 2004.

"NEMI Recommends Industry Standard Lead-free Solder," Surface Mount Technology (SMT), vol. 14 no. 3, pp. xx-xx, Mar. 2000.

"NEMI Recommends Lead-Free Alloy," Printed Circuit Design and Manufacture, vol. 17 no. 3, pp. 6, Mar. 2000.

"NEMI Recommends Lead-Free Part ID Process," Electronic News, June 11, 2004.

"NEMI team recommends three test conditions for evaluating tin whisker growth," PCB007, Oct. 6, 2003.

"NEMI Team Recommends Three Test Conditions for Evaluating Tin Whisker Growth," CircuiTree, vol. 16 no. 12, pp. xx-xx, Dec. 2003.

"NEMI's Tin Whisker Project reports initial test results, reviews modeling efforts at APEX 2002," PCB007, Feb. 8, 2002.

"New additive limits tin whiskers," Solid State Technology, vol. 51 no. 1, pp. 23, Jan. 2008.

"New Calif. law requires retailers to take back rechargeable batteries," Waste News, vol. xx no. x, pp. xx-xx, Oct. 13, 2006.

"New classification released," Electronics Manufacture and Test , vol. xx no. xx, pp. xx-xx, Sept. 8, 2008.

"New E-Waste Recycling Laws Threaten Revenue Predictability and Profitability," PCB007, Aug. 22, 2006.

"New EU Battery Directive Released," Conformity, 2007 Engineers' Reference Guide, pp. 222, 2007.

"New EU Directive Targets Product Lifecycle," Design News, vol. 60 no. 13, pp. xx, Sept 26, 2005.

"New EU environment directives estimated to cloud NT$200 billion Taiwanese hi-tech exports," CENS.com, Jan. 17, 2005.

"New Guideline for producing Pb Free released," evertiq, Apr. 26, 2010.

"New handheld XRF analyzer for fast, reliable and non-destructive RoHS compliance screening from Oxford Instruments," PCB007, June 27, 2005.

"New Immersion Tin Process PRESA RMK-30: Tin Whisker Issue," Uyemura, Mar. 2007.

"New iNEMI lead-free book," Tin World, no. 20, pp. 15, Winter 2007.

"New IPC-1752, Materials Declaration Management Standard," evertiq , Mar. 10, 2006.

"New IPC Guide to Environmental Megatrends Steers Companies Through Environmental Regulations and Issues," CircuiTree, vol. 21 no. 9, pp. xx-xx, Sept. 2008.

"New I. T. R. I. Tin-Zinc Plating Bath," Tin and its Uses, no. 163, pp. 2, 1990.

"New Jersey Enacts Electronic Waste Recycling Regulations," Conformity , vol. 13 no. 4, pp. 78, Apr. 2008.

"New Jersey Enacts Electronic Waste Recycling Regulations," Conformity, 2009 Engineers' Reference Guide, pp. 197, 2009.

"New Lead-Free Implementation Checklist," PCB007, Apr. 29, 2005.

"New machine tests lead free solders," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Apr. 21, 2008.

"New magnetic solders developed by Yale," Tin World, no. 30, pp. 11, Spring 2010.

"New Pb-free technologies boost product reliability," Dataweek , vol. xx no. xx, pp. xx-xx, Oct. 18, 2006.

"New Project on SnAgCu Impact Tolerance," PCB007, Mar. 31, 2005.

"New REACH Compliance Guidelines," Products Finishing, vol. 73 no. 10, pp. 10, July 2009.

"New Research Reveals Many US Companies Ignoring New RoHS Law," PCB007, Oct. 5, 2006.

"New Research shows that Flame Retardant Chemicals Save Lives and Money," evertiq, June 29, 2006.

"New research study on intermetallic growth," Tin World, no. 22, Early Summer 2008, pp. 14-15.

"New revision for BGA assembly standard," Dataweek, vol. xx no. xx, pp. xx-xx, May 14, 2008.

"New RoHS business compliance program," evertiq, Mar. 20, 2006.

"New standard could simplify RoHS data exchange," Manufacturing Business Technology, vol. xx no. xx, pp. xx-xx, Jan. 2006.

"New Standard to Provide Efficient Mechanism for the Exchange of Materials Content Information," iNEMI, Apr. 20, 2005.

"New standards define revised test parameters for guaranteeing integrity of RoHS-compliant products," Dataweek, vol. xx no. xx, pp. xx-xx, Nov. 1, 2006.

"New Standards Development Committee on Declarable Substances in Materials is formed within ASTM International," the emc journal, no. 59, pp. 11, July 2005.

"New Standards on Tin Whisker Mitigation," Circuits Assembly, vol. 17 no. 4, pp. 36, Apr. 2006.

"New Supplier RoHS Audit Form Can Help with RoHS Compliance," IPC Review , vol. 47 no. 1, pp. 4, Jan. 2006.

"New tin whisker standard," Tin World, no. 18, pp. 16, Early Summer 2007.

"New Tool Eases Lead-Free Parts Selection," Printed Circuit Design and Manufacture, vol. 22 no. 8, pp. 8, Aug. 2005.

"New Tool Eases Pb-Free Parts Selection," Circuits Assembly, vol. 16 no. 8, pp. 12, Aug. 2005.

"New TWI proposed project: Tin Whiskers - reducing the risk," TWI LiveWire, issue 14, Summer 2004.

"New twists in environmental compliance rules," SourceESB, Nov. 30, 2005.

"New WEEE Legislation May Be Near," Conformity, vol. 11 no. 5, pp. 41, May 2006.

"New WWF study on food only identifies formerly used flame retardant Penta-BDE," evertiq, Sept. 29, 2006.

"New XRF material analyzer slashes throughput times," Tin World , no. 20, pp. 17, Winter 2007.

"Newark InOne has RoHs help," Purchasing, vol. xx no. xx, pp. xx-xx, Feb. 2, 2006.

"Newark InOne offers RoHS catalog," Purchasing, vol. xx no. xx, pp. xx-xx, Mar. 2, 2006.

"Newark InOne Revamps Website Around RoHS Compliance Steps," PCB007 , Jan. 31, 2006.

"Newark InOne revamps Website for RoHS conversion," SourceESB, Feb. 10, 2006.

"NGOs continue to put pressure on electronics companies despite fire safety risks," evertiq, Jan. 21, 2008.

"Nickel Addition Turns Tin-Copper into a Viable Lead-free Solder," PCB007, Feb. 16, 2005.

"Nickel-coated Components Solve Electrical Problem," Nickel, vol. 20 no. 2, pp. 5, Mar. 2005.

"Ningbo: RoHS compliance in full swing," Global Sources, Sept. 13, 2006.

"NITROGEN is more than just hot air," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, Feb. 2001.

"No Votes Force Changes to J-STD-709," Printed Circuit Design and Fab , vol. 26 no. 6, pp. 8, June 2009.

"Nokia tops latest Greenpeace 'Greener Electronics Guide'," evertiq , Sept. 16, 2008.

"No-Lead and Horizontal Hot Air Leveling," Proceedings of the Technical Program NEPCON West '95, Volume 2, Anaheim, CA, Feb. 26-Mar. 2, 1995, pp. 1087-1092.

"Non-Lead Stabilizers for PVC Wire & Cable," Plastics Technology , vol. 52 no. 5, pp. 39, May 2006.

"NoNE lead-free soldering guideline Version 2 - November 2004," Nov. 2004.

"Norwegian RoHS, 18 substances banned," evertiq, July 24, 2007.

"NPL creating Industry Defect Database," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Aug. 17, 2007.

"NPL: Design & Build of Unique Machine," Circuitnet, Apr. 24, 2008.

"NPL develop low cycle isothermal testing for lead-free solders," Tin World, no. 22, Early Summer 2008, pp. 15.

"NPL Effect of Voiding on Lead-Free Reliability Report," Tin World , no. 12, pp. 15, Winter 2006.

"NPL releases report on effect of voiding on lead-free reliability," emsnow, Oct. 6, 2005.

"NPL Report: The Measurement of Creep Rates and Stress Relaxation for Micro Sized Lead-free Solder Joints," PCB007, July 25, 2005.

"NPL SSTC lead-free meeting previews unique video of tin transformation," emsnow, June 1, 2007.

"NPL to measure copper dissolution in lead-free solder alloys," Tin World, no. 16, pp. 17, 2006.

"NPL wins 'Best International Paper at IPC/APEX," Tin World, no. 13, pp. 16, Spring 2006.

"NSAI Launches RoHS Certificate Program," Circuitnet, Oct. 19, 2007.

"NT$20B.Taiwan-made Products Fail to Meet RoHS Directive," CENS.com , Apr. 3, 2006.

"NT$20B.Taiwan-made Products Fail to Meet RoHS Directive," PCB007 , Apr. 3, 2006.

"Oeko-Institut Calls for Industry Input on RoHS Review," PCB007 , Mar. 17, 2008.

"Oki Electric Completes Hexavalent Chromium-free Screws for its Mechatronic Products," PCB007, Mar. 15, 2005.

"Oki switches its screws to fit RoHS legislation" Engineeringtalk , Mar. 16, 2005.

"Oki Terminates Six Chemical Substances Subject to RoHS for Its Stepping Motors," PCB007, Feb. 21, 2005.

"Omikron Immersion White Tin," Florida CirTech, Feb. 19, 1998.

"On-line REACH service," Finishing, vol. 32 no. 4, pp. 8, July-Aug. 2008.

"On-Site Lead Screening of Electronic Components," Niron Application Bulletin.

"One-third are still not lead-free prepared," Electronicstalk , Mar. 31, 2005.

"On Trial In Brazil," Air Safety Week, vol. 21 no. 23, June 11, 2007.

"Online "Game" Tests Knowledge of RoHS," Conformity, vol. 11 no. 7, pp. 45, July 2006.

"Only two years to go lead-free," European Electronics Engineer , vol. xx no. xx, pp. xx-xx, Jan. 2005.

"Ontario Recycling E-Waste," Appliance Design, vol. 56 no. 5, pp. 14-15, Sept. 2008.

"Optimizing Mixed Metal Manufacturing," PCB007, Nov. 20, 2006.

"ORGALIME POSITION concerning the marking requirements of article 10(3) and article 11 (2) of Directive 2002/96/EC (WEEE)," May 13, 2003.

"OSHA Ordered to Set New Chromium Limits," Chemical Market Reporter , vol. 263 no. 15, pp. 3, Apr. 14, 2003.

"OSP," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Oct. 7, 2004.

"Other Environmental Regulatory News," Conformity, vol. 11 no. 3, pp. 44,-45, Mar. 2006.

"Other Environmental Requirements."

"Overcoming zinc whisker," finishing.com.

"Overview of Lead Free Solder Research," Center for Advanced Vehicle Electronics (CAVE).

"Palm's Treo falls foul of European pollution law,", May 26, 2006.

"PANalytical," X-Ray Spectrometry, vol. 33 no. 5, pp. 391, Sept./Oct. 2004.

"Part II - The WEEE Directive - draft implementing Regulations."

"Part IV - The RoHS Directive - draft implementing Regulations."

"Part Movement During Reflow," Circuitnet, Dec. 4, 2007.

"PartMiner Adds Lead-Free and RoHS Material Content Data to Its CAPS Electronic Component Database," Business Wire, vol. xx no. xx, pp. xx-xx, Dec. 15, 2004.

"Passport to Lead-Free," evertiq, May 10, 2005.

"Patent Protected Lead-Free Alloys and the User," SMART Group 8th Annual Lead-Free Seminar + 'Question Time' & Table-Top Exhibition, High Wycombe, United Kingdom, Feb. 16, 2006.

"Pb-Free Components," DfR Solutions, Mar. 3, 2010.

"Pb-free era," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Feb. 7, 2006.

"Pb-free FAQs," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, Dec 2003.

"Pb-free Impact on PCB Purchasing Whitepaper," NexLogic.

"Pb-Free Issues and the EPA," empfasis, pp. xx-xx, Feb. 2001.

"PB-Free solder properties database," Components in Electronics , vol. xx no. xx, pp. xx-xx, June 2006.

"Pb-Free Solder Wetting Tests," Circuits Assembly, vol. 19 no. 12, pp. 32, Dec. 2008.

"PC makers must follow the toughest green laws," Global Sources , Feb. 2, 2007.

"Phones, printers to be tested first under China RoHS," Purchasing , vol. 138 no. 11, pp. 45-46, Nov. 2009.

"Plating thickness for lead-free HASL," Circuitnet, Apr. 10, 2007.

"Plating's Effects on Electronics Assembly," Printed Circuit Design and Fab/Circuits Assembly, vol. 27 no. 7, pp. 40, July 2010.

"Plaudits and criticisms in green electronics review," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, June 30, 2008.

"Pollution Prevention Technology Profile Trivalent Chromium Replacements for Hexavalent Chromium Plating," Northeast Waste Management Officials' Association (NEWMOA), Nov. 18, 2003.

"Polyclad Laminates Publishes Lead-Free Material Selection Guide," June 28, 2005.

"Polymer Solder Balls," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Dec. 17, 2007.

"Popcorning," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Feb. 7, 2005.

"Position Paper on Risks to High-Reliability Electronics and Associated Hardware from Pure Tin Coatings," Jul. 25, 2002.

"Poster and Calendar Aid RoHS Compliance," Design News, vol. 61 no. 4, pp. xx, Mar. 20, 2006.

"Potential Magnitude of Additional Demand for Copper, Silver, Tin, and Bismuth for Lead-free Solder Alternatives," Abt Associates, Nov. 20, 2002.

"Potential Regional Coordination on Pollution Prevention Technologies and Resources for Industry Sectors Emitting or Transferring Lead or Lead Compounds in the Northeast (Draft)," Northeast Waste Management Officials' Association (NEWMOA), Sept. 2002.

"Potential Tin Whiskers on Printed Circuit Board Components," Westinghouse Nuclear Tech Bulletin TB-05-4, June 8, 2005.

"Power Supply Failures: The Problem with Zinc Whiskers," Apr. 5, 2005.

"Pre-Bake Standard for Rework," Circuitnet, Jan. 12, 2009.

"Precision Analytical Weights Protected with Electrodeposited Tin-Nickel Alloy," Tin and its Uses, no. 31, pp. 11, Apr. 1955.

"Premier Farnell Feedback on the EC Directives on RoHS & WEEE," Farnellinone.

"Premier Farnell RoHS Legislation and Technical Manual Step-by-step Guide (Version 2)," Farnell inone, 2005.

"Principles of cleaner design," electronicsweekly.com, Dec. 9, 2004.

"Printed Board Laminates," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, June 7, 2006.

"Printing Lead Free Solder Paste," LEADOUT Hands On Lead-Free Workshop , Manchester, United Kingdom, June 21, 2006.

Problem Advisory FV5-P-06-01A

"Procedure for handling moisture sensitive PCB's," Circuitnet , July 28, 2008.

"Procedure for the declaration of materials in products of the electrochemical and electronic industry," IEC, 2004.

"Process Changes for Electronics Manufacturing: LEAD FREE SOLDERING: Implications for Barcode Labels," Lead-Free Magazine, vol. 3, Feb. 2005.

"process guidelines to Lead-free assembly," Cookson Electronics.

"Product Manual: Familiarization and Training Guide," Alpha.

"Profile of the Surface Finishing Use Cluster."

"Profiling for Large BGA Attachment," Circuits Assembly, vol. 19 no. 2, pp. 33-34, Feb. 2008.

"Profiling for the Attachment of Large Ball Grid Array Packages," empfasis, pp. xx-xx, Nov. 2007.

"Progress of Tin-Zinc Alloy Plating," Tin and its Uses, no. 24, pp. 11-12, July 1951.

"Progress on lead-free components spotty," SourceESB, Nov. 17, 2004.

"Proper method to bake PCB's," Circuitnet, Nov. 20, 2006.

"Proposal for a Battery Directive repealing Directive 91/157/EEC: EICTA position on the implications for design and manufacturing of Electrical and Electronic Equipment," EICTA, Feb. 5, 2006.

"Proposals for Further Exemptions from the Requirements of Article 4(1) of Directive 2002/95/EC for Specific Applications of Lead, Mercury, Cadmium, Hexavalent Chromium," Japan Business Council in Europe.

"Proposed restriction of organo-halogen compounds and its possible impact on the electronics sector," IPC Brussels, Brussels, Belgium, June 18, 2008, pp. xx-xx.

"Proposed RoHS Revisions Released: IPC Remains Cautious Until Directive is Finalized," IPC Review, vol. 2 no. 1, pp. 2, Jan./Feb. 2009.

"Proposition 65 in Plain English," California Environmental Protection Agency.

"Providing lead-free data," Purchasing, vol. xx no. xx, pp. xx-xx, Apr. 7, 2005.

"Publication Provides Information on Implementing Lead-Free Solder," Electronic Device Failure Analysis, vol. 10 no. 1, pp. 37, Feb. 2008.

"Purchasers face new environmental deadline," Purchasing, vol. xx no. xx, pp. xx-xx, May 25, 2006.

"Pure silver flakes conduct electricity and heat," Microelectronics International, vol. 17 no. 1, pp. xx-xx, 2000.

"Q&A (FAQ) regarding JIG,Survey and Response Manual, and Survey Response Tool Ver. 3," Japan Green Procurement Survey Standardization Initiative (JGPSSI), Mar. 30, 2006.

"Qualification of Lead Free Component Plating Finishes," Nov. 3, 2003.

"Qualification Procedure for Tin Whisker Formation in Lead-free Connector Terminal Finishes," Molex.

"QUALITY dips in isotropic conductive adhesive," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Oct. 2004.

"Quality Evaluation Data for Lead-free SMD Area Array Packages Seiko Epson, Aug. 30, 2002.

"Quality Evaluation Data for Lead-free SMD Peripheral Packages (Sn-Bi plating) Seiko Epson, Aug. 30, 2002.

"Quantifying lead-free solder spread," EMasia, Mar. 2006.

"Question & Answer," Waste News, vol. xx no. x, pp. xx-xx, Apr. 28, 2003.

"Question: Are RO4000(R) materials compatible with lead-free processes?."

"Questions and Answers from October 26, 2006 AeA China RoHS Conference."

"Questions for your board maker on RoHS," Electronics Supply & Manufacturing, Sept. 2005.

"Racing towards RoHS," Electronic Product Design, vol. xx no. xx, pp. xx-xx, June 1, 2006.

"Rationale for the Auger Studies," Tin Whisker Group teleconference, May 11, 2016.

"REACH and its potential impact on coil coating," Finishing, vol. 28 no. 4, pp. 28, 30, May-June 2004.

"REACH Chemical Regulation Is Now EU Law," IPC Review, vol. 48 no. 2, pp. 6, Feb. 2007.

"REACH Chemical Regulation is Now EU Law," IPC Review, vol. 49 no. 3, pp. 22-23, Mar./Apr. 2007.

"REACH for knowledge.(news)," Finishing, vol. 31 no. 4, pp. 10, July-Aug. 2007.

"REACH implementation Begins in 2008," Products Finishing, vol. 72 no. 7, pp. 12-13, Apr. 2008.

"REACH: Is Industry Ready for this EU Regulatory Tidal Wave?," IPC Review, vol. 1 no. 4, pp. 11, Sept./Oct. 2008.

"REACH Out of Reach?," PCB007, July 29, 2008.

"REACH Puts 300 Chemicals on SIN List," Printed Circuit Design and Fab , vol 25 no. 11, pp. 8, Nov. 2008.

"REACH registration fees," Finishing, vol. 32 no. 3, pp. 6, May-June 2008.

"REACH Strategy and Preparation," 2008 IPC Midwest Show Proceedings , Schaumburg, IL, Sept. 23-24, 2008, pp. xx-xx.

"REACH-ing for Answers," Products Finishing, vol. 72 no. 9, pp. 10, June 2008.

"Reaching Forward," Adhesives & Sealants Industry, vol. 13 no. 7, pp. 26, July, 2006.

"REACH-ing Out," Plating and Surface Finishing, vol. 95 no. 8, pp. 12-13, Aug. 2008.

"REACH-ing out," Finishing, vol. 32 no. 5, pp. 6, Sept.-Oct. 2008.

"Ready for REACH?," Appliance Design, vol. 56 no. 5, pp. 18, Sept. 2008.

"Recommendations for Pb-Free Manufacturing Requirements," Adhesives & Sealants Industry, vol. xx no. xx, pp. xx-xx, July 2006.

"Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products," iNEMI Tin Whisker User Group, Version 3, May 2005.

"Recommendations for Pb-Free Manufacturing Requirements," Adhesives & Sealants Industry, vol. 13 no. 7, pp. 35, July 2006.

"Recycling?," Green SupplyLine, May 1, 2005.

"Recycling fee threat to small electronics retailers," letsrecycle.com, Mar. 20, 2006.

"Recycling Technology Advances and New Material Development Key to Successful E-Waste Recovery," PCB007, June 5, 2006.

"Reduce process variation in lead free soldering," Connect, no. 138, pp. 8, Sept.-Oct. 2005.

"Reduce the risk of tin Whiskers in lead-free RJ connectors," Xmultiple Application Note, xxxx.

"Reduce voids in QFN pb-free reflow process," Circuitnet, Apr. 28, 2008.

"Reducing the rising tide of electronic scrap," Materials World, vol. 10 no. 11, pp. 16-17, Nov. 2002.

"Reducing the risk of tin whiskers on lead-free products," RF Design, vol. xx no. x, pp. xx-xx, May 10, 2006.

"Re-educating the approach to recycling," Components in Electronics, Feb. 2008.

"Reflecting on the environment," Finishing, vol. 14 no. 5, pp. 35, May 1990.

"Reflow and wave soldering OSP Boards," Circuitnet, Dec. 11, 2006.

"Reflow for leaded and lead-free assemblies," Circuitnet, Sept. 9, 2007.

"Reflow oven profilers," Circuitnet, Oct. 23, 2006.

"Reflow parameters for lead-free BGA," Circuitnet, Feb. 4, 2007.

"Reflow Profiling of Power PCBs," Circuits Assembly, vol. 17 no. 6, pp. 38-39, June 2006.

"Reflow Soldering Guidelines for Lead-Free Packages," Altera Application Note 353, July 2004.

"Regarding lead free, can I use the reflow ovens I currently have in production?," Circuitnet, June 26, 2006.

"Regulatory Update," Conformity, vol. 11 no. 8, pp. 90, Aug. 2006.

"Relay Contact Life," Tyco Electronics Application Note.

"Release and Introduction of Survey Response Tools Ver.3 & Related Manuals in English," Japan Green Procurement Survey Standardization Initiative (JGPSSI), Feb. 1, 2006.

"Reliability of SN100C," Nihon Superior Co., Ltd., Mar. 24, 2005.

"Reliability Test Matrices for Lead-Free Solder Evaluation Project #1," AMD, Jan. 22, 2002.

"Reminder to register chemicals under REACH; ECHA launches new web site to help," Anti-Corrosion Methods and Materials, vol. 55 no. 5, pp. xx, 2008.

"Removal of Lead Shakes Up the Manufacturing Chain," Conformity , vol. 10 no. 8, pp. 28-35, Aug. 2005.

"Remove and replace a 240 pin connector," Circuitnet, Oct. 16, 2006.

"Replacing Lead-Based Solder: Molecular Wires And Corrosion Control Boost Performance Of Electrically Conductive Adhesives," ScienceDaily , vol. xx no. xx, pp, xx-xx, Mar. 30, 2005.

"Report - RoHS Request for more exemptions Dec 2004," Dec. 2004.

"Reports on Lead-Free Soldering Research Available," Conformity , vol. 11 no. 5, pp. 41, May 2006.

"Request for exempt on RoHS-directive 2002/95/EC for separable interface connectors," FCI, Sept. 15, 2004.

"Requested Exemption from the requirements of Article 4(1) of Directive 2002/95/EC," Swatch, Jan. 12, 2006.

"Research and Markets Announces Regulations Impacting Green Labelling," Advanced Packaging, vol. xx no. xx, pp. xx-xx, Oct. 14, 2004.

"Research Updates on PCBs, RoHS, Economy, and PCs," SMT Web Exclusive Article.

"Researcher Develops New Electroplating Process That Gets the Lead Out of Solder," Lucent Technologies, Apr. 28, 1999.

"Researchers Develop Environmentally Friendly Coatings for Military Applications," Products Finishing, vol. 70 no. 12, pp, 12, Sept. 2006.

"Resistance Welding of Tin and Tin-Zinc Alloy Coated Mild Steel Sheet," Tin and its Uses, no. 21, pp. 15-20, Oct. 1949.

"Resolution of Generic Safety Issues: Issue 200: Tin Whiskers (NUREG-0933, Main Report with Supplements 1-33)

"Response to Stakeholder Consultation on Adaptation to Scientific and Technical Progress under Directive 2002/95/EC for the Purpose of a Possible Amendment of the Annex," Japan Business Council in Europe, July 5, 2004.

"Restriction of Hazardous Substances," EE Times - Asia, vol. xx no. xx, pp. xx-xx, Dec. 3, 2004.

"Restriction of Hazardous Substances: Compliance Strategy Rev 2," Anadigics, Nov. 2004.

"Restriction of Hazardous Substances (RoHS) Directive 5 months to implementation," SMART Group 8th Annual Lead-Free Seminar + 'Question Time' & Table-Top Exhibition, High Wycombe, United Kingdom, Feb. 16, 2006.

"Results from the Soldertec Global European Pb-Free Marking Survey," Jan. 2004.

"Results of IPC Survey on REACH Preparedness in the North American and European Electronic Interconnect Industry," IPC, July 2008.

"Results of National Electronic Distributor Association Meeting," PCB007, Feb. 1, 2005.

"Review of Directive 2002/95/EC (RoHS) Categories 8 and 9 - Stakeholder Meeting," ERA Technology, Apr. 2006.

"Revised Directives," Appliance Design, vol. 57 no. 2, pp. 7-8, Feb. 2009.

"Revised RoHS directives proposed," Electronics Manufacture and Test , Dec. 8, 2008.

"Revision B of IPC-7095 Now Available," CircuiTree, vol. 21 no. 4, pp. xx-xx, Apr. 2008.

"Revolutionary methodology," Electronics Manufacture and Test , vol. xx no. xx, pp. xx-xx, Aug. 9, 2007.

"Rework - The Hidden Phenomenon?."

"Reworking BGAs/CSPs Using Lead-Free Solders," OK International.

"Reworking Pb-Free PCBs," Circuits Assembly, vol. 19 no. 10, pp. 35, Oct. 2008.

"Risks of Conductive Whiskers in High-Reliability Electronics and Associated Hardware from Pure Tin Coatings," June 19, 2002.

"RMD Instruments to Showcase A New Feature for LeadTracer-RoHS System at SMTA," Circuitnet, Aug. 11, 2008.

"RMD to Exhibit New Feature for LeadTracer-RoHS System at IPC Midwest," Circuitnet, Sept. 17, 2008.

"Road to RoHS," CircuiTree, vol. 18 no. 8, pp. xx-xx, Aug. 2005.

"Road to RoHS," CircuiTree, Sept. 1, 2005.

"Road to RoHS," CircuiTree, vol. 18 no. 9, pp. xx-xx, Sept. 2005.

"Road to RoHS," CircuiTree, vol. 18 no. 10, pp. xx-xx, Oct. 2005.

"Road to RoHS," CircuiTree, vol. 18 no. 11, pp. xx-xx, Nov. 2005.

"Road to RoHS," CircuiTree, vol. 18 no. 12, pp. xx-xx, Dec. 2005.

"Road to RoHS," CircuiTree, vol. 19 no. 1, pp. xx-xx, Jan. 2006.

"Road to RoHS," CircuiTree, vol. 19 no. 2, pp. xx-xx, Feb. 2006.

"Robotic Solder Dip Solves Tin Whisker Problem," Navy Mantech, 2005.

"RoHS," EICTA, Sept. 15, 2004.

"RoHS Amendment: Commission Exempts DecaBDE and Lead in Bronze Bushings," Conformity, vol. 10 no. 12, pp. 54, Dec. 2005.

"RoHS and lead-free: how the regulations impact you," Dataweek , vol. xx no. xx, pp. xx-xx, Oct. 4, 2006.

"RoHS and Material Declarations," Surface Mount Technology, vol. xx no. xx, pp. xx-xx, xxx. xxxx

"RoHS and WEEE: could you be exempt?," Components in Electronics , vol. xx no. xx, pp. xx-xx, Nov. 2005.

"RoHS and WEEE: Suppliers rattled to full compliance," Telecom Products, July 29, 2005.

"RoHS Assurance Tests To Support Materials Declarations," evertiq , May 18, 2006.

"RoHS at QP Semiconductor," QP Semiconductor Application Note 114 Rev. 2.0, Feb. 2008.

"RoHS Brings Glee to Some and Gloom to Others in Taiwan Electronics Parts Sector," CENS.com, Jan. 5, 2007.

"RoHS catalog released," Purchasing, vol. xx no. xx, pp. xx-xx, Mar. 16, 2006.

"RoHS Challenges Business Practices Too," Embedded Technology, pp. 2, 4, Mar. 2006.

"RoHS clarification at last," Components in Electronics, vol. xx no. xx, pp. xx-xx, Aug. 2004.

"RoHS Compliance," ECN, vol. 50 no. 1, pp. 53, Jan. 2006.

"RoHS Compliance," Components in Electronics, vol. xx no. xx, pp. xx-xx, Feb. 2006.

"RoHS compliance easier with JIG-101," evertiq, June 1, 2005.

"RoHS compliance for SMT and Through-hole equipment," Circuitnet , May 29, 2006.

"RoHS compliance is about 25%," Purchasing, vol. 134 no. 7., pp. 20, Apr. 21, 2005.

"RoHS Compliance - No Quick Fix," PCB007, Feb. 9, 2006.

"RoHS compliance of assembly machine transferred to European facility," Circuitnet, June 11, 2006.

"RoHS compliance slow but steady in mainland China, Taiwan," Global Sources, Jan. 8, 2007.

"RoHS compliance testing," EuroAsia Semiconductor, vol. xx no. xx, pp. xx-xx, Aug. 2006.

"RoHS Compliance Testing Resource Now On-line at www.rohsbyxrf.com," PCB007, Aug. 15, 2005.

"RoHS compliant chips with their own marking," evertiq, July 21, 2005.

"ROHS Conformance -- Related Notes."

"RoHS could crimp connector supply," Purchasing, vol. xx no. xx, pp. xx-xx, Mar. 30, 2006.

"RoHS deadline: Closer to ready," SourceESB, Dec. 14, 2005.

"RoHS Directive Compliance Procrastinators and Naysayers Take Heed," IPC Review, pp. 16-17, Sept. 2005.

"RoHS Directive Doomed to Fail, Says Environmental Consultant," CircuiTree, vol. 19 no. 3, pp. xx-xx, Mar. 2006.

"RoHS Directives," (Dionics)

"RoHS - electronic products must display environmental protection stickers," emsnow, Feb. 28, 2007.

"RoHS Enforcement," Components in Electronics, vol. xx no. xx, pp. xx-xx, Feb. 2006.

"RoHS Enforcement Still a Mystery, But Will Include Testing," Design News, vol. 61 no. 5, pp. xx, Apr. 10, 2006.

"RoHS: European Commission Sets Official Limits," Conformity, vol. 10 no. 11, pp. 8. 10, Nov. 2005.

"RoHS Exemption... A Blessing or A Curse?," Chip Scale Review, vol. 12 no. 5, pp. 86, July 2008.

"RoHS exemption for agricultural equipment in Europe," Circuitnet , Aug. 14, 2006.

"RoHS exemptions list available on the web," Electronics Weekly , Aug. 21, 2006.

"RoHS exemptions situation becomes clearer," evertiq, Jan. 3, 2005.

"RoHS existing products vs. new products," Circuitnet, May 1, 2006.

"RoHS Guidance Notes Reissued," Circuits Assembly, vol. 16 no. 3, pp. 11, Oct. 2005.

"RoHS Guidance Re-issued," evertiq, Aug. 18, 2005.

"RoHS guidelines issued by UK enforcer," Electronics Weekly, May 31, 2006.

"RoHS Hampers Product Innovation," SourceESB, June 29, 2006.

"RoHS impacts MRO parts," SourceESB, Nov. 16, 2005.

"RoHS in China delayed," evertiq, Jan. 11, 2006.

"RoHS: Is time running out for business to comply?," Apr. 22, 2005.

"RoHS isn't just inconvenient; it's potentially deadly," EE Times , Oct. 9, 2006.

"RoHS: It's all still happening," Electronics News, Sept. 3, 2008.

"RoHS Law for US? Newark InOne Poll Says 'Yes' 2 to 1," PCB007 , Dec. 21, 2006.

"RoHS less rosy from across the pond," Electronics Manufacture and Test, pp. xx-xx, July 2006.

"RoHS: Most suppliers to change part numbers," Purchasing, vol. xx no. xx, pp. xx-xx, Nov. 29, 2005.

"RoHS panel discussion," EngineerIT, pp. 46-48, Jan. 2008.

"RoHS Part Numbering: The Continuing Saga," Design News, vol. 60 no. 8, pp. xx, June 6, 2005.

"RoHS PCB Specification - What Has To Change?," evertiq, Dec. 10, 2006.

"RoHS PCB specification - what has to change?," Soldering & Surface Mount Technology, vol. 19 no. 1, pp. xx-xx, 2007.

"RoHS - perspectives of a PWB manufacturer," IPC Brussels, Brussels, Belgium, June 18, 2008, pp. xx-xx.

"RoHS poll stirs debate," Purchasing, vol. xx no. xx, pp. xx-xx, Nov. 2, 2006.

"RoHS, REACH and You," IPC Review, vol. 1 no. 1, pp. 11, Mar./Apr. 2008.

"RoHS Readiness," Sanmina-Sci, June 2004.

"RoHS Regs are the Start - Not the "End-game"," Printed Circuit Design and Manufacture, vol. 24 no. 2, pp. insert, Feb. 2007.

"RoHS remains a burning issue," Electronics Manufacture and Test , vol. xx no. xx, pp. xx-xx, May 19, 2008.

"RoHS Revisited," Application Reference Materials, pp. 1-2,4,6,8,10, July 2008.

"RoHS Revisited," Electronic Products, July 2008.

"RoHS Routes to Compliance," SMART/LEADOUT Lead-Free Implementation Seminar, Leicestershire, United Kingdom, May 23, 2006.

"RoHS Scope Are you in or out?,"

"RoHS screening service announced," evertiq, Mar. 3, 2005.

"RoHS: "Stakeholders" Plead Their Cases for Exemption," Conformity , vol. 10 no. 11, pp. 10, Nov. 2005.

"RoHS substances (Hg, Pb, Cr(VI), Cd, PBB and pBDE) in electrical and electronic equipment in Belgium (Final Report)," Federal Public Service Health, Food Chain Safety and Environments, Directorate-General Environment, Brussels, Nov. 2005.

"RoHS Support Service Established," PCB007, Aug. 28, 2006.

"RoHS: the good, the bad and the ugly," Dataweek, vol. xx no. xx, pp. xx-xx, Apr. 6, 2005.

"RoHS: the good, the bad and the ugly," Electronicstalk, Mar. 14, 2005.

"RoHS: Third-Party Certification," CircuiTree, vol. 19 no. 4, pp. xx-xx, Apr. 2006.

"RoHS: Time Running Out to Prepare," Manufacturing Engineer, vol. 82 no. 6, pp. 5, Dec. 2003/Jan. 2004.

"RoHS to obsolete entire catalogues overnight," Dataweek, vol. xx no. xx, pp. xx-xx, Mar. 24, 2004.

"RoHS Transition Should be a Company-Wide Concern," Lead-Free Connection, vol. 2 no. 4, pp. 1, Dec. 2005.

"RoHS Troubles Affect Taiwan Industry," Surface Mount Technology Online, Aug. 22, 2006.

"RoHS uncertainties - is there a light at the end of the tunnel?," Components in Electronics, vol. xx no. xx, pp. xx-xx, Nov. 2006.

"RoHS Under Fire for Weak Science," Design News, vol. 61 no. 13, pp. 30, Sept. 25, 2006.

"RoHS Under Review: IPC Urges Commission to Aim for Science-based Regulations with Thorough Consideration of Life Cycle Impacts," PCB007, Jan. 21, 2008.

"RoHS under review - IPC urges commission to aim for science-based regulations with thorough consideration of life cycle impacts," emsnow, Jan. 22, 2008.

"RoHS Under Review: IPC Urges Commission to Aim for Science-based Regulations with Thorough Consideration of Life Cycle Impacts," Tin World , no. 21, pp. 13, Spring 2008.

"Ron Lasky: A Solder Alloy and Solder Paste Overview," Surface Mount Technology (SMT), pp. 10,12-14,16, May 2020.

"Round Robin Testing and Analysis of Lead Free Solder Pastes with Alloys of Tin, Silver and Copper: Final Report,", IPC Solder Products Value Council.

"Round Robin Testing and Analysis of Lead Free Solder Pastes with Alloys of Tin, Silver and Copper: Phase II DOWN-SELECT and ASSEMBLY REPORT," IPC Solder Products Value Council.

"RS trusts in Fischer," Finishing, vol. 30 no. 2, pp. 26, Mar./Apr. 2006.

"Rushing out RoHS help - part one: distribution," SourceESB, Jan. 25, 2006.

"RUWEL AG Offers Numerous Lead-free Alternatives for Circuit Boards," PCB007, Sept. 19, 2005.

"Ruwel says advancing on 'green circuit board'," PCB007, Aug. 28, 2003.

"Same Parts, New Numbers?," Electrospec, vol. xx no. xx, pp. xx-xx. Aug. 12, 2004.

"Satellite Failure Will Hurt Channel One's Second-Quarter Results," Electronic Education Report, vol. 5 no. 11, pp. 6-x, June 10, 1998.

"Scientists Research Tin Pest and Whiskers," SMT Web Exclusive Article.

"Scope of UL PCB Silver Task Group," PCB007, Oct. 9, 2006.

"Schwarzenegger Terminates State RoHS Bill," Printed Circuit Design and Manufacture, vol. 24 no. 11, pp. 10, Nov. 2007.

"Schwarzennegger Vetoes AB 48," IPC Review, vol. 48 no. 9, pp. 7, Oct./Nov. 2007.

"Second ECTC iNEMI Tin Whisker Workshop," Components, Packaging, and Manufacturing Technology Society Newsletter, vol. 28 no. 2, pp. 8-9, June 2005.

"Second European Lead-Free Soldering Technology Roadmap," Soldertec, Feb. 2003.

"Secondary Reflow of Lead-Free Joints," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, July 1, 2007.

"Selective Finishing: Stannatech The Unique Immersion Tin Process," Atotech.

"Self-Declaration of conformance (Example) Version 1," Japan Green Procurement Survey Standardization Initiative, Sept. 27, 2005.

"SEMI Regulatory Alert on "China RoHS"," SEMI, Oct. 3, 2006.

"SEMI warns members to take action on China RoHS," Global Sources , Nov. 14, 2006.

"Separate wash systems for leaded and non-lead boards?," Circuitnet , Apr. 24, 2006.

"Set of recommendations to help reduce risk of Tin Whiskers," evertiq, Dec. 18, 2006.

"Set up for lead-free wave soldering," Circuitnet, Feb. 9, 2009.

"Seven questions to ask your board maker on RoHS," Green SupplyLine , Sept. 5, 2005.

"Seven Substances Recommended for Inclusion in REACH Authorization List," PCB007, Jan. 20, 2009.

"Shaving the Risk of Tin Whiskers," NITON Application Bulletin , Mar. 17, 2004.

"Shaving the whiskers for lead-free production," European Semiconductor, vol. 26 no. 11, pp. 17, Nov. 1, 2004.

"Shea Keynote Looks Ahead," SMT Web Exclusive Article.

"Shelf-Life Evaluation of Nickel/Palladium Lead Finish for Integrated Circuits," Texas Instruments SZZA002, Apr. 1998.

"Should the U.S. employ RoHS-like standards for imported products?," Product Design & Development, vol. 63 no. 9, pp. 34-35, Sept. 2008.

"SILVER takes the HASL out of board manufacture," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, June 2003.

"Since we build to customer spec are we safe from Material Declaration ...," Circuitnet, May 15, 2006.

"Sitzung vom 25. October," Berichte der Deutschen Chemischen Gesellschaft, vol. 2, pp. 540-541, 1869.

"Six RoHS Exemptions Added," SMT Web Exclusive Article.

"SMART Group Lead-Free Soldering Mission to Japan," SMART Group, Feb. 19-23, 2001.

"SMART Group unveils 'Lead-free Experience 4' report," Tin World , no. 15, pp. 10, 2006.

"SMD's solderen."

"SMT Epoxy for lead-free wave soldering," Circuitnet, July 30, 2007.

"Sn-Ag-Cu: key to a lead-free Europe_and world," Control Engineering , vol. xx no. xx, pp. xx-xx, Feb. 14, 2006.

"Sn-plating in respect to proposed Nemi test conditions," Oct. 29, 2004.

"SN100C Celebrates a Remarkable Milestone," Surface Mount Technology (SMT), vol. 23 no. 1, pp. 4-5, Jan.-Feb. 2009.

"So, you think you're ready?," Components in Electronics, vol. xx no. xx, pp. xx-xx, Feb. 2005.

"Solder costs still soaring," Electronics Manufacture and Test , vol. xx no. xx, pp. xx-xx, Apr. 18, 2007.

"Solder leveled - Hot Air Solder Leveled (HASL)," Electronics Manufacture and Test, Nov. 17, 2008.

"Solderable Finishes," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Jan. 7, 2003.

"Solderability of Tin-Coated Copper," Plating, vol. 52 no. 4, pp. 315-321, Apr. 1965.

"Soldering reliability using SAC 305...," Circuitnet, Apr. 23, 2007.

"Solderability Tests," ST Microelectronics Application Note AN2036, Nov. 2004.

"Soldering Compatibility (Backward and Forward)," ST Application Note AN2034, Nov. 2004.

"Soldering On," Electronics Times, vol. xx no. xx, pp. xx-xx, Nov. 20, 2000.

"Soldering Resistance and Moisture Sensitivity Level (MSL) Classification of STMicroelectronics Lead-Free Devices," ST Microelectronics Application Note AN2033, Nov. 2004.

"Soldering tips for the 'lead-free' process," Dataweek, vol. xx no. xx, pp. xx-xx, July 26, 2006.

"Solders come to attention," Environmental Engineering, vol. 13 no. 2, pp. 10, June 2000.

"Solders in Electronics: A Life-Cycle Assessment Summary," United States Environmental Protection Agency, EPA-744-S-05-001, Aug. 2005.

"Solectron Hosts Environmental Compliance Roundtable," PCB007 , Apr. 15, 2005.

"Solectron Reaches RoHS Goals," Electronic News, Dec. 5, 2005.

"Solutions - and complications - emerge for RoHS directive," Manufacturing Business Technology, vol. 23 no. 4, pp. 16, Apr. 2005.

"Some electronics OEMs design out bromine, chlorine from products," Purchasing, vol. 138 no. 11, pp. 44-45, Nov. 2009.

"Some Examples of "Whiskers" from Tin-Based Alloys," Tin Whisker Group teleconference, July 22, 2009.

"Some useful lead-free soldering websites," Dataweek, vol. xx no. xx, pp. xx-xx, Sept. 20, 2006.

"Sony to recycle electronics for free," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Aug. 17, 2007.

"Sound planning prepares the way for Pb-free," Electronics Manufacture & Test, pp. 9-10, Jan. 2005.

"SPECIFICATIONS To Invitation to Tender DG ENV.G.4/ETU/2006/xxxx."

"Specifying the design rules," Electronic Product Design, vol. xx no. xx, pp. xx-xx, Jan. 1, 2008.

"Spectrometer measures Pb contamination," Dataweek, vol. xx no. xx, pp. xx-xx, July 28, 2004.

"Speedline Completes Study on Lead-free Process Optimization," Advanced Packaging, Aug. 29, 2005.

"Speedline Technologies Launches Web Site as Resource on Lead-Free SMT Manufacturing," PCB007, Apr. 5, 2005.

"Spotlight on Pb-free alternatives," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, July 11, 2008.

"Stakeholder Consultation on Adaptation to Scientific and Technical Progress Under Directive 2002/95/EC for the Purpose of a Possible Amendment of the Annex," AeA EICTA, July 5, 2004.

"Stakeholder consultation on Adaptation to scientific and technical progress under Directive 2002/95/EC of the European Parliament and of the Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment for the purpose of a possible amendment of the annex."

"Stakeholder consultation on Adaptation to scientific and technical progress under Directive 2002/95/EC of the European Parliament and of the Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment for the purpose of a possible amendment of the annex," (The first consultation period ended July 5, 2004.)

"Stakeholder consultation on Adaptation to scientific and technical progress under Directive 2002/95/EC of the European Parliament and of the Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment for the purpose of a possible amendment of the annex."

"Stakeholder consultation on Adaptation to scientific and technical progress under Directive 2002/95/EC of the European Parliament and of the Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment for the purpose of a possible amendment of the annex," (The second consultation period ended Feb. 11, 2005.)

"Stakeholder consultation on Adaptation to scientific and technical progress under Directive 2002/95/EC of the European Parliament and of the Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment for the purpose of a possible amendment of the annex," (The third consultation period ended Oct. 28, 2005.)

"Stakeholder consultation on Adaptation to scientific and technical progress under Directive 2002/95/EC of the European Parliament and of the Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment for the purpose of a possible amendment of the annex," (The fourth consultation period ended Feb. 10, 2006.)

"Stakeholder consultation on Adaptation to scientific and technical progress under Directive 2002/95/EC of the European Parliament and of the Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment for the purpose of a possible amendment of the annex," (The fifth consultation period ended May 15, 2006.)

"Stakeholder consultation on Adaptation to scientific and technical progress under Directive 2002/95/EC of the European Parliament and of the Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment for the purpose of a possible amendment of the annex," (The sixth consultation period ended Jan. 10, 2007.)

"Standard Addresses Environmental Issues with Computers," Nuts and Volts , pp. 10, June 2006.

"Standard Released for Worse Case Thermal Limits," Surface Mount Technology (SMT), vol. 22 no. 10, pp. 8, Oct. 2008.

"Standard Specification for Electrodeposited Coatings of Tin", ASTM Standard B 545 - 97, West Conshohocken, PA: American Society for Testing and Materials, 1997.

"Standardizing RoHS materials declaration," Apr. 1, 2005.

"Standards aim to reduce the risk of tin whiskers," Test & Measurement World, vol. 26 no. 4, pp. xx-xx, May 4, 2006.

"Standards aim to reduce the risk of tin whiskers," Test & Measurement World, vol. 26 no. 5, pp. 12, June 2006.

"Standards for Compliance Documentation," Design News, vol. 60 no. 10, pp. xx, July 18, 2005.

"Steady As It Goes: IPC Hosts Executive Market and Technology Forum in Hong Kong," IPC Review, vol. 47 no. 6, pp. 12-13, July 2006.

"Stencil Apertures and Board Finish Requirements," Circuitnet , May 5, 2008.

"Step-by-Step Guide to Compliance with the RoHS Directive."

"Stop the HOP," Circuits Assembly, vol. 19 no. 8, pp. 33, Aug. 2008.

"Storagetek's RoHS/WEEE Projects," Oct. 19. 2004.

"Study Reveals State of RoHS-Compliance in China," Printed Circuit Design and Manufacture, vol. 24 no. 1, pp. 8, Jan. 2007.

"Subject: Harmonization of national producer registers," EICTA, May 31, 2006.

"Subject: Impact of REACH on downstream users," AeA, ceced, EICTA, EECA ESIA, Nov. 23, 2006.

"Surface-Mount Device Assembly: Electrically Conductive Adhesive May Replace Solder," Circuits Assembly, vol. 11 no. 4, pp. 82, Apr. 2000.

"Summary of Data on Municipal Solid Waste Landfill Leachate Characteristics - "Criteria for Municipal Solid Waste Landfills" (40 CFR Part 258)," (U. S.) Environmental Protection Agency EPA/530-SW-88-038, PB88-242441, July 1988.

"Supplier Summit Confronts Status of RoHS Conversion," SourceESB, Nov. 29, 2006.

"Supply change management key to RoHS compliance," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, Sept. 2004.

"Suppression of Tin Whisker Growth through Optimized Tin Plating Chemistry Formulation Technistan EP," Technic.

"Surface Finish Options," Data Circuit Systems, May 2002.

"Surface Finish Options," Merix, Aug 2002.

"Surface Finishing for Printed Circuit Boards," Teledyne Electronic Technologies.

"Survey Finds 83 Percent of Manufacturers at High to Severe Risk of Not Being Able to Track, Document and Report on RoHS Compliance," PCB007 , Aug. 4, 2006.

"Survey on Lead Free Solder Systems: Results of a Danish R&D project on the environmental and technical impacts of substituting lead containing solders by lead free solder systems," 2003.

"Survey Response Tools Ver. 3 Operation Manual, Second Edition," Japan Green Procurement Survey Standardization Initiative, June 9, 2006.

"Survey Shows Europe Mostly Ready for RoHS," Design News, vol. 61 no. 6, pp. xx, Apr. 24, 2006.

"Survey shows skepticism on national E-waste agreement," Connector Specifier, vol. 21 no. 2, pp. xx-xx, Feb. 2005.

"Survey shows slow RoHS compliance," Purchasing, vol. xx no. xx, pp. xx-xx, Oct. 6, 2006.

"Susceptibility to "Tin Pest"," Nihon Superior.

"Sustainable design: not just for architecture any more," Green SupplyLine, Mar. 16, 2007.

"Sustainable design of electrical and electronic products to control costs and comply with legislation."

"Switch makers deal with RoHS," Purchasing, vol. xx no. xx, pp. xx-xx, Feb. 23, 2006.

"Switch Tips: Lead-free solders and electromechanical switches," Machine Design.

"Switching to Unleaded," Printed Circuit Fabrication, vol. 23 no. 6, pp. 24, June 2000.

"Symposium on Tin and Tin Alloy Coatings," Tin and its Uses, no. 117, pp. x-x, 1978.

"TAC votes on RoHS Exemptions."

"Tackling e-waste in Africa," Dataweek, Apr. 1, 2009.

"Taiwan Inspects for RoHS Compliance," Design News, vol. 61 no. 3, pp. xx, Feb. 27, 2006.

"Taiwan Prepares for RoHS," PCB007, Mar. 31, 2005.

"Taiwanese Electronics Sector Faces RoHS Test," CENS.com, July 30, 2006.

"Taiwanese IT Manufacturers Detected Not Compliant With RoHS," Taiwan Economic News, Aug. 22, 2006.

"Taiwanese LCD-TV Suppliers Make Themselves RoHS Compliant," CENS.com, July 31, 2006.

"Taiwanese Manufacturers Move to Comply With EuP Directive," CENS.com, Oct. 19, 2006.

"Taiwanese Tool Makers Turn to Eco-Friendly Products to Meet RoHS Requirements," CENS.com, Sept. 25, 2006.

"Taiwan`s IT and Electronics Industries Go Green," CENS.com, Oct. 26, 2004.

"Taiwan`s Production of Electronic Components To Grow 9% in 2005," CENS.com, Sept. 8, 2005.

"Taiwan`s Production of Electronic Components To Grow 9% in 2005," CENS.com, Aug. 4, 2005.

"Taking responsibility, tapping opportunity: How will consumer elecxtronics companies respond to WEEE mandate?," IBM Business Consulting Services.

"Tax credits for RoHS implementation," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Mar. 17, 2008.

"TBBPA Risk Assessment Concluded," PCB007, Sept. 19, 2007.

"TBBPA unlikely to be banned under RoHS," Dataweek, Feb. 18, 2009.

"Tech Tips... Identifying Counerfeit Components," empfasis, pp. xx-xx, Nov. 2007.

"Tech Tips... Implementing Lead-Free Soldering," empfasis, pp. xx-xx, Sept. 2002.

"Technic Announces Surface Oxidation Reduction Patent," CircuiTree , vol. 19 no. 3, pp. xx-xx, Mar. 2006.

"Technical Service Bulletin: Tin Whiskers in MOD10 Relays." GE Power Management, MOD10 SB1-00.03.27, Mar. 27, 2000.

"Technical Support to the National Highway Traffic Safety Administration (NHTSA) on the Reported Toyota Motor Corporation (TMC) Unintended Acceleration (UA) Investigation, Version 1.0." NASA, Jan. 18, 2011.

"Technology provides the key to WEEE," LAWE, vol. xx no. xx, pp. xx-xx, Jan. 2003.

"TechSearch Int'l Study Finds Embedded Components to be Most Significant Developments," Circuitnet, Feb. 7, 2008.

"Tell DTSC That Green Chemistry Initiative Is the Wrong Approach, Participate in EPA Public Workshop," CircuiTree, vol. 21 no. 4, pp. xx-xx, Apr. 2008.

"Test Protocols for Evaluation of New Lead-Free Alloys Outlined in New White Paper by IPC Solder Products Value Council."

"Test Strategy considerations for lead-free," Agilent Technologies Lead-free Seminar Part II.

"Texas Instruments' RoHS 'Gold' Aids Customers in RoHS Transition," CircuiTree, vol. 18 no. 8, pp. xx-xx, Aug. 2005.

"Texas of USA - Proposal of Electronic Equipment Waste Management," Intertek Labtest Sparkle, vol. 192, Feb. 2005.

"Tg and Td for lead free process," Circuitnet, Jan. 7, 2008.

"The Challenges Facing Lead-Free Soldering," Electroline, 2000.

"The Clock is Ticking... How Far Are You from the Finish Line?," Lead-Free Connection, vol. 2 no. 1, pp. 1, Jan. 2005.

"The Contagious Diseases of Metals," Scientific American, vol. 102 no. 26, pp. 517-518, June 25, 1910.

"The E. U. Environmental Directives," Innovation, no. 36, pp. 13-14, July 2004.

"The Effect of Voiding in Solder Interconnections Formed from Lead Free Solder Pastes with Alloys of Tin, Silver and Copper," IPC Solder Products Value Council.

"The Effects of Lead on Lead-Free Electronics Assembly," AIM.

"The Electrodeposition of Tin," The Brass world and Platers Guide , vol. 3 no. 9, pp. 296, Sept. 1907.

"The Electronic Interconnection Supply Chain's Response to Oko-Institut's Recommendations for Proposed Revisions to the RoHS Directive," IPC.

"The Emergence of Information Technology (IT) Waste," The Gallon Environment Letter, vol. 6 no. 31, dec. 19, 2002.

"The end of leaded commercial parts: Part 1," SourceESB, Apr. 19, 2006.

"The end of leaded commercial parts: Part 2," SourceESB, May 3, 2006.

"The EU's RoHS and WEEE Directives: The EU Commission Offers Guidance on these Important Directives," Conformity, vol. 11 no. 1, pp. 10, 12-17, Jan. 2006.

"The Exemption Process."

"The Experts look at the issues," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Jan.-Feb. 2000.

"The Facts about Tin Whiskers," Electronic Components, Assemblies & Materials Association, EIA/ECA-CB19, Aug. 2004.

"The Failure of Tin Beer Cooling Coils," Tin and its Uses, no. 3, pp. 13, Oct. 1939.

"The Fusing of Wires and Tin Whiskers," Tin Whisker Group teleconferences, Apr. 22, 2009 and Apr. 29, 2009.

"The government is not doing enough on RoHS," Electronics World, vol. 111 no. 1834, pp. 5, Oct. 2005.

"The Growth of Tin Whisker," Samsung.

"The Hidden Challenges of Manufacturing Lead-free Elelctronics," Analog Zone.

"The Interview - AIM President Rick Black in conversation with the editor," Tin World, no. 14, pp. 8-9, 2006.

"The Interview - Colin Longworth of solder producer DKL Metals talks to Tin World," Tin World, no. 15, pp. 6-7, 2006.

"The IPC-1750 Series - A family of supplier declaration standards," emsnow, June 13, 2005.

"The iPhone's hazardous chemicals," evertiq, Oct. 17, 2007.

"The Joint Industry Guide (JIG) and Actions to Be Taken by the JGPSSI," Japan Green Procurement Survey Standardization Initiative (JGPSSI), May 26, 2005.

"The Latest in BGA Implementation Strategy," IPC-7095 Revision A Oct. 2004.

"The lead-free debacle threatens the industry - for nothing!," emsnow, Nov. 12, 2004.

"The Lead-Free Electronics Assembly Implementation Handbook," AIM, 2004.

""The measurement of creep rates and stress relaxation for micro-sized lead-free solder joints"," Soldering & Surface Mount Technology , vol. 17 no. 4, pp. xx-xx, 2005.

"The Mechanism of Ag2S Formation," Product Engineering & Quality , Oct. 2002, pp. xx-xx.

"The Need for Lead-Free and Green Semiconductor Packages," TDK.

"The New Tin-Nickel Alloy Electroplate," Tin and its Uses, no. 25, pp. 9, Dec. 1951.

"The Pb-Free Control Plan," Printed Circuit Design and Fab/Circuits Assembly, vol. 29 no. 8, pp. 40, Aug. 2010.

"The PDX Standard: Used for Material Declaration," IPC.

"The problem of 'tin whiskers' cannot be neglected," Dataweek , vol. xx no. xx, pp. xx-xx, July 28, 2004.

"The Program Manager's Guide to Pb-Free," Circuits Assembly, vol. 17 no. 3, pp. 50-51, Mar. 2006.

"The Reballing Process," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 9, pp. 46, Sept. 2010.

"The Relation between Whisker and Stress," Hynix Semiconductor.

"The Review of Directive 2002/96/EC of the European Parliament and of the Council on Waste Electrical and Electronic Equipment.

"The RoHS Directive Implementation," European Organization for Conformity Assessment (EOTC).

"The rush to RoHS compliance," Purchasing, vol. xx no. xx, pp. xx-xx, Mar. 16, 2006.

"The SAC-SnPb Dilemma," Circuits Assembly, vol. 19. no. 6, pp. 34, June 2008.

"The Spread of RoHS," IPC Review, vol. 47 no. 8, pp. 12-13, Sept. 2006.

"The Spread of RoHS," Route, Sept. 2006.

"The Transition to Lead-Free: Lead Free Soldering and the 5DX," 5DX User Group Meeting, Loveland, CO, Mar. 2005.

"The Trend to Tin-Zinc Coatings," Tin and its Uses, no. 59, pp. 12-13, 1963.

"The Waste Electrical and Electronic Equipment (WEEE) and Restriction of certain Hazardous Substances in electrical equipment (ROHS) Directives: Responses to the Discussion paper of 28 March 2003: Executive summary and comment," Department of Trade and Industry, July 2003.

"The Waste Electrical and Electronic Equipment (WEEE) directive - impacts on it disposal, re-use and recycling," Dec. 3, 2004.

"The Waste Electrical and Electronic Equipment (WEEE) directive - impacts on it disposal, re-use and recycling," Dec. 17, 2004.

"The WEEE directive could be helped with protocols," Electronics World , vol. 112 no. 1837, pp. 7, Jan. 2006.

"There's more to Pb-free production than just a Pb-free product," 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 149.

"Thermal Analysis of Lead-Free Solder."

"Thermal cycling test of tin-bismuth and tin plating," Ishihara Chemical Co., 2008.

"Thermisches Spritzen - eine attraktive Erganzung zum Hartverchromen," Galvanotechnik, vol. xx no. xx, pp. 3002-3003, Dec. 2007.

"Three organizations from US, Europe, Japan cooperating to develop tin whisker test method," PCB007, July 18, 2003.

"Think about disposal during design," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Sept. 7, 2006.

"THINK you are lead-free? Prove it," Electronics Manufacture and Test, pp. xx-xx, Mar. 2006.

"TI offers "Gold"," Purchasing, vol. xx no. xx, pp. xx-xx, Sept. 15, 2005.

"Time for a U.S. RoHS Law? Poll Respondents Say Yes by 2-to-1," Supply & Demand Chain Executive, vol. xx no. x, pp. xx-xx, xxxx.

"Tin."

"Tin Against Corrosion," Tin and its Uses, no. 41, pp. 9-10, Winter 1957.

"Tin-Antimony Equilibrium Diagram," Tin and its Uses, no. 51, pp. 8-9, 1961.

"Tin as Semiconductor," Science News Letter, vol 58 no. 8, pp. 118, Aug. 19, 1950.

"Tin-Bismuth Melt-Out Cores for Tennis Racket Frame," Tin and its Uses , no. 129, pp. 15-16, 1981.

"Tin-Cobalt Alloy Plating," Tin and its Uses, no. 121, pp. x, 1979.

"Tin disease, organ pipes and Napoleonic buttons," Advanced Materials & Processes, vol. 162 no. 4, pp. 51, Apr. 2004.

"Tin in Modern Technology 2: Soldering," Tin and its Uses, no. 90, pp. 3-5, 1971.

"Tin-lead and no-lead compatibility issues," Circuitnet, Oct. 20, 2008.

"Tin lead soldering of lead free components," Circuitnet, Oct. 30, 2006.

"Tin-Nickel - A Pre-stressed Coating," Tin and its Uses, no. 58, pp. 14, 1963.

"Tin-Nickel Alloy Plating Current Progress," Tin and its Uses, no. 28, pp. 10-11, June 1953.

"Tin-Nickel Alloy Plating Does Not Grow Whiskers in Five Years," Tin and its Uses, no. 64, pp. 15, 1964.

"Tin-Nickel on Watches and Drawing Instruments," Tin and its Uses , no. 44, pp. 1-3, Autumn 1958.

"Tin-Nickel Plating for Railway Signal Relays," Tin and its Uses, no. 51, pp. 6, 1961.

"Tin Nickel Plating Today," Tin and its Uses, no. 102, pp. 3-5, 1974.

"Tin-Nickel versus Metal "Whiskers"," Tin and its Uses, no. 52, pp. 8, 1961.

"Tin "Noodles"???."

"Tin Pest," finishing.com.

"Tin Pest," Nihon Superior.

"Tin plating for very cold environments; alloying to avoid tin pest," finishing.com

"Tin/Silver/Copper Solder Increases Voids," Design News, vol. 61 no. 4, pp. xx, Mar. 20, 2006.

"Tin Structures."

"Tin Technology Ltd. granted UKAS accreditation for chemical tests in support of the RoHS and WEEE Directives," Tin World, no. 19, pp. 14, Autumn 2007.

"Tin touted as lead replacement in machining steel," Purchasing , vol. xx no. xx, pp. xx-xx, Sept. 2, 1999.

"Tin Whisker Acceptance Test Requirements," NEMI Tin Whisker Users Group, July 28, 2004.

"Tin Whisker Experience - Rocket Motor Initiator Failure Analysis."

"Tin Whisker Experiences," June 19, 2002.

"Tin Whisker Growth Evaluation Results," Kemet, Mar. 30, 2004.

"Tin Whisker Imagery," empfasis, pp. 9, Apr. 2009.

"Tin Whisker Info "Brief"," On Semiconductor Application Note TND311, May 2003.

"Tin Whisker Migration on New and Stored Parts," Printed Circuit Design and Fab/ Circuits Assembly, vol. 29 no. 3, pp. 36-37, Mar. 2012.

"Tin Whisker Mitigation & Conformal Coating," Surface Mount Technology (SMT), vol. 28 no. 2, pp. 57, Feb. 2013.

"Tin Whisker Qualification and Reliability Testing," Printed Circuit Design and Fab/ Circuits Assembly, vol. 28 no. 10, pp. 37,39, Oct. 2011.

"Tin Whisker References."

"Tin Whisker Specs Defined," Metals and Interconnects, vol. 18 no. 7, pp. xx, Aug. 2004.

"Tin Whisker User Group Publishes Updated Set of Recommendations Help Reduce Risk of Tin Whiskers," PCB007, Dec. 15, 2006.

"Tin Whisker Workshop."

"Tin Whiskering Borders on Urban Legend," Design News, vol. 60 no. 11, pp. xx, Aug. 15, 2005.

"Tin Whiskers," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Dec. 7, 2003.

"Tin Whiskers," Sept. 14, 2004.

"Tin Whiskers."

"Tin Whiskers," Circuitnet, May 14, 2007.

"Tin Whiskers 2012," 3rd Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Genova, Italy, Mar. 21, 2012.

"Tin whiskers a problem with immersion tin pwb finishes? ," finishing.com.

"Tin Whiskers and Conversion to Pb-Free," Circuits Assembly, vol. 16 no. 12, pp. 38-40, Dec. 2005.

"Tin Whiskers: Companies Taking Cover Under iNEMI Guidelines," Design News, vol. 60 no. 12, pp. xx, Sept 5, 2005.

"Tin whiskers in electronic," finishing.com.

"Tin whiskers on printed circuit boards: Consequences for safety components in machine construction," IFA, May 2014.

"Tin whiskers - reducing the risk," LiveWire, no. 15, pp. xx-xx, Feb./Mar. 2005.

"Tin "Whiskers" Studied at Very Low Temperature," The Science News-Letter, vol. 67 no. 21, pp. 326, May 21, 1955.

"Tin Whiskers Syfer Surface Mount Capacitors," Syfer Application Note AN0019 Issue 3.

"Tin wisker might delay RoHS schedule," Industry News, vol. xx no. xx, pp. xx-xx, Mar. 18, 2005.

"Tin-Zinc-Coated Steel Tubes Challenge Copper for Central Heating," Tin and its Uses, no. 78, pp. 12, 1968.

"Tin-Zinc Coatings," Tin and its Uses, no. 17, pp. 5-8, 14, Oct. 1946.

"Tin-Zinc Plating Grows Up," Tin and its Uses, no. 29, pp. 9, Sept. 1953.

"Tinning no lead soldered wires with leaded solder," Circuitnet , Aug. 28, 2006.

"TI's RoHS 'Gold' Aids Customers in RoHS Transition," PR Newswire , Aug. 15, 2005.

"Titanium Wave Solder Upgrades from NEA," PCB007, July 3, 2006.

"TO-220 Lead Free and RoHS Compliance Document," International Rectifier.

"To the Attention of the members of the EU Technical Adaptation Committee (TAC) on WEEE/ROHS," EICTA, Feb. 13, 2006.

"To the Attention of the members of the EU Technical Adaptation Committee (TAC) on WEEE/ROHS," EICTA, Mar. 7, 2006.

"Tombstone problems," Circuitnet, Nov. 5, 2006.

"Tombstone Troubleshooting," PCB007, Sept. 29, 2005.

"Top Ten Myths About RoHS."

"Toshiba Announces Website With Information on RoHS-Compatible and Lead(Pb)-Free Products," PCB007, Aug. 17, 2005.

"Total Parts Plus Increases RoHS Data Coverage," June 22, 2005.

"Total Parts Plus Increases RoHS Data Coverage," PCB007, June 23, 2005.

"Towards a RoHSy future, the final furlong," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, June 7, 2006.

"Toxic and Hazardous Materials in Electronics," Five Winds International, Oct. 2001.

"Toxic Chemicals Can Keep Products Off the Shelves," GreenBiz.com.

"Toxicological Review of Hexavalent Chromium," U. S. Environmental Protection Agency, Aug. 1998.

"Trace Laboratories-Central Announces Their New Tin Whisker Testing Program (iNEMI-Specified)," Trace Laboratories.

"Trade alliance launches RoHS/WEEE services," evertiq, Mar. 18, 2006.

"Trade Groups Agree to 2005 Lead Ban Plan," Printed Circuit Design , vol. 20 no. 2, pp. 7, Feb. 2003.

"Transformation of Tin," Tin and its Uses, no. 14, pp. 14, May 1943.

"Transition to RoHS: The Seven Common Pitfalls to Avoid," Arena Solutions & Symphony Consulting, 2005.

"Transitioning to Lead (Pb)-Free Manufacturing with Toshiba Semiconductor Products," Toshiba America Electronic Components, Aug. 2004.

"Transitioning to Lead(Pb)-Free Manufacturing with Toshiba Semiconductor Products," Toshiba America Electronic Components, Sept. 2005.

"Transposition of the WEEE and RoHS Directives in Other EU Member States: January 2005," Perchards, Jan. 2005.

"Transposition of the WEEE and RoHS Directives in Other EU Member States: July 2005," Perchards, July 2005.

"Transposition of the WEEE and RoHS Directives in Other EU Member States: November 2005," Perchards, Nov. 2005.

"Transposition of the WEEE Directive in Other EU Member States," Perchards, Nov. 2003.

"Transposition of the WEEE Directive in Other EU Member States: September 2004," Perchards, Sept. 2004.

"Transposition of the WEEE Directive in Other EU Member States: January 2005," Perchards, Jan. 2005.

"Trivalent Chrome - A Real Alternative," Finishing, vol. 7 no. 10, pp. 20-22, Oct. 1983.

"Trivalent Chromium Plating for a Safer Workplace & Environment," Transactions of the Institute of Metal Finishing, vol. 80 no. 2, pp. B10-B12, Mar. 2002.

"Trivalent chromium: the second generation," Finishing Industries , vol. 1 no. 8, pp. 3, Aug. 1977.

"Trojan urges WEEE compliance not denial," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Sept. 9, 2008.

"Tug-of-War Over Halogen-Free Issue," PCB007, May 22, 2008.

"TV manufacturing industry urges rethink on EU Waste Directive," PCB007, Oct. 24, 2001.

"TW System Failures," NAVSEA, Apr. 3, 2005.

"Two years to lead free," Manufacturing Engineer, vol. 83 no. 4, pp. 7, Aug./Sept. 2004.

"Tyco Electronics Material Declaration Strategy," Tyco Electronics, Sept. 20, 2004.

"Typical Analyses of Various Brands of Tin," Tin and its Uses, no. 27, pp. 6-7, Nov. 1952.

"Typical Tin Analyses," Tin and its Uses, no. 77, pp. 8-9, 1968.

"U.K. Outlines WEEE Implementation," SMT Web Exclusive Article.

"U.K. Prepares WEEE Roadmap," SMT Web Exclusive Article.

"U.N.: Europe can do more to recycle electronic waste," EE Times , vol. xx no. xx, pp. xx-xx, Nov. 15, 2007.

"U.S. Guidelines Tout National E-recycling," SMT Web Exclusive Article.

"U. S. Weighs In on Domestic RoHS," Surface Mount Technology (SMT) , vol. 20 no. 11, pp. 12, Nov. 2006.

"U.S Worries but UK Offers Solutions to the WEEE Directive Compliance on E-Waste Disposal," Feb. 22, 2005.

"UCLA Department of Materials Science and Engineering."

"UK delays rollout of EU waste law," Financial Times Information , Apr. 7, 2005.

"UK - DTI update on RoHS and WEEE - Thursday 24th March 2005," Mar. 24, 2005.

"UK Manufacturers set up recycling company," emsnow, Jan. 19, 2004.

"UK Meets WEEE Collection Target," Manufacturing Engineer, vol 82 no. 4, pp. 6, Aug./Sept. 2003.

"UK postponed implementation date for WEEE until June 2006," evertiq, Aug. 11, 2005.

"UK RoHS Enforcement Agency Decided," Conformity, vol. 10 no. 11, pp. 48, Nov. 2005.

"UK RoHS Enforcement Agency Decided," Conformity, pp. 213, Conformity 2006: The Annual Guide.

"UK Site Offers Due Diligence," Design News, vol. 61 no. 2, pp. xx, Feb. 6, 2006.

"UK Takes Lead on Lead-Free Soldering," Printed Circuit Fabrication , vol. 23 no. 2, pp. 6, Feb. 2000.

"UL Affirms Acceptance of Immersion Silver Circuit Board Finishes," Circuitree, vol. 19 no. 10, pp. xx-xx, Oct. 2006.

"UL Announces New Restricted Substances Compliance Solutions (RSCS) - Designed to help organizations meet strict 2006 European Union directives," 2004.

"UL Program Helps in Meeting EU RoHS Compliance,"Wire & Cable Technology International, vol. 33 no. 3, pp. 70, May/June 2005.

"UL program offers help for RoHS compliance," Green SupplyLine , Nov. 17, 2004.

"UL's New Services for Restricted Substances Help OEMs and Manufacturers Self-declare Compliance to RoHS," PCB007, Dec. 11, 2006.

"UN Models Task Force on WEEE," SMT Web Exclusive Article.

"Unawareness of recent UK Ban," evertiq, Sept. 13, 2004.

"Understanding RoHS: What it Means to U.S. Manufacturers," Shimadzu.

"Unofficial note of the Technical Adaptation Committee on the WEEE & RoHS Directives: Brussels, 10 December 2004," Dec. 10, 2004.

"Update of Global Trends in Lead-Free Soldering," SMTA International Conference, Chicago, IL, Sept. 26-29, 2004, pp. xx-xx.

"Update on WEEE and RoHS," Cookson Electronics, Apr. 2005.

"Updated Surface Insulation Resistance Testing Vital for Mission-critical Electronic Assemblies Manufactured with Lead-free Alloys," PCB007 , Oct. 3, 2006.

"US Electronics Industry is in Real Trouble," PCB007.

"US group has lead-free code," Electronics Weekly, June 14, 2004.

"US House Bill Proposes to Ban Common Elements," Printed Circuit Design and Fab, vol. 26 no. 7, pp. 8, July 2009.

"USA - State-Level Programmes for Electrical/Electronic Products Continue to Proliferate," Sept. 11, 2006.

"Using Focused Infra-Red To Simplify Lead-Free BGA Rework," evertiq , Apr. 12, 2006.

"Using Focused Infra-Red To Simplify Lead-Free BGA Rework," PCB007 , Apr. 12, 2006.

"Using non-RoHS components in RoHS process," Circuitnet, Apr. 16, 2007.

"Using tin-lead solder on RoHS parts," Circuitnet, June 11, 2007.

"Vapor Phase Fusion of Pure Tin Electroplate," Solid State Technology , vol. 26 no. 3, pp. 141-142, Mar. 1983.

"Vapour Phase Perfect for Pb-free soldering!?," LEADOUT Hands On Lead-Free Workshop, Manchester, United Kingdom, June 21, 2006.

"VCA Will Enforce WEEE in U.K.," SMT Web Exclusive Article.

"Verifying RoHS compliance," Products Finishing, vol. 70 no. 11, pp. 64, Aug. 2006.

"Verizon NEBS(TM) Compliance: Qualification Requirements for Printed Board Assemblies Manufactured with Lead-Free Solder for use in Telecommunications Equipment," Verizon Technical Purchasing Requirements VZ.TPR.9307 issue 1, Sept. 2009.

"Victor Japan using Sn-Zn-system, lead-free solder in business printers since April," PCB007, Sept. 16, 2002.

"Voids in BGA's," Circuitnet, Nov. 5, 2007.

"Voids in leadless packages," Circuitnet, Aug. 18, 2008.

"Wave soldering lead-free components," Circuitnet, Nov. 27, 2006.

"Wave Soldering Problems," Circuitnet, Aug. 11, 2008.

"Wear Resistance of Tin-Nickel Electroplate," Tin and its Uses, no. 54, pp. 4, 1962.

"WEEE & RoHS Directives Update," Intertek Labtest Sparkle , vol. 188, Feb. 2005.

"WEEE & ROHS... Preparing for the Future."

"WEEE breathing space for suppliers," evertiq, Mar. 31, 2005.

"WEEE - Commission Issues Reporting Guidelines For Member States," Conformity, vol. 10 no. 7, pp. 44, July 2005.

"WEEE deadline delayed in UK," evertiq, Jan. 12, 2006.

"WEEE Directive Forces Reduction in the Variety of Plastics Used In Electrical and Electronic Equipment," PCB007, Sept. 21, 2005.

"WEEE Directive - Is Your Business Prepared?," PRWeb, Mar. 23, 2005.

"WEEE Directive Update," Intertek Labtest Sparkle, vol. 180, Aug. 2004.

"WEEE Forum Guidance Document," WEEE Forum.

"WEEE Forum Questions and Answers," WEEE Forum.

"WEEE help available," Purchasing, vol. xx no. xx, pp. xx-xx, Sept. 1, 2005.

"WEEE help from t2e," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Mar. 10, 2008.

"WEEE implementation put back - but you still have to mark mouldings from August," British Plastics & Rubber, pp. 34, Apr. 2005.

"WEEE Official in EU," SMT Web Exclusive Article.

"WEEE reminder," Tin World, no. 17, pp. 8, Spring 2007.

"WEEE review in the U.K.," Electronics Supply & Manufacturing , May 2006.

"WEEE review in the U.K.," Green SupplyLine, May 1, 2006.

"WEEE/RoHS Directives Implementation: Part I - Overview," Department of Trade and Industry.

"WEEE/RoHS Directives Implementation: Part II - WEEE Directive Implementation," Department of Trade and Industry.

"WEEE/RoHS Directives Implementation: Part III - WEEE/RoHS Directives Implementation," Department of Trade and Industry.

"WEEE - RoHS Impact on Passive Components," NIC Components.

"WEEE/RoHS Info/Links," Conformity, vol. 10 no. 10, pp. 10-11, Oct. 2005.

"WEEE/ROHS Update," Conformity, vol. 10 no. 11, pp. 8, Nov. 2005.

"WEEE rule to push up production costs of Taiwanese electronics suppliers," CENS.com, Jan. 10, 2005.

"WEEE Update in Major Economies: UK, France, Germany, Italy," Conformity, vol. 10 no. 11, pp. 10, 48, Nov. 2005.

"WEEE Update in UK, France, Germany and Italy," Conformity, pp. 213, Conformity 2006: The Annual Guide.

"WEEE, WEEE, WEEE all the way to eBay," evertiq, Apr. 19, 2006.

"WEEE yields more lightweight, modular devices," Global Sources , July 11, 2006.

"Wetting," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Dec. 7, 2006.

"Wetting Problem SAC finished component," Circuitnet, July 28, 2008.

"What are some cost implications of lead-free conversion?," Circuitnet, Mar. 23, 2006.

"What Are Tin Whiskers?"

"What are Tin Whiskers?."

"What challenges does the military/aerospace industry face?," Electronic Products, vol. xx no. xx, pp. xx-xx, Mar. 2006.

"What happens to leaded parts after RoHS?," SourceESB, July 13, 2005.

"What is horizontal convection reflow technology?," Dataweek, vol. xx no. xx, pp. xx-xx, Feb. 21, 2007.

"What is Pb-free?," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, May 7, 2004.

"What is the permissible limit of Cu in Pb-Sn solders?," Connect , vol. xx no. xx, pp. xx-xx, 2000.

"What is Tin Pest and how does it occur?," LiveWire, no. 11, pp. xx-xx, Nov./Dec. 2003.

"What type of cleaner method is preferred for lead-free stencils?," Circuitnet, July 17, 2006.

"What You Need to Know About ACPEIP (China RoHS)," evertiq, Jan. 23, 2007.

"What's industry's best lead free solder?," evertiq, July 5, 2005.

"What's Inside Your PC?."

"What's Next After RoHS?," IPC Review, pp. 19, 22, Sept. 2005.

"What's RoHS' cost?," Purchasing, vol. xx no. xx, pp. xx-xx, Sept. 29, 2005.

"Wheelie bin symbol", Feb. 11, 2005.

"When Electronics Get Five O'Clock Shadow," Jan. 5, 2005.

"When is oven drying mandatory," Circuitnet, Sept. 27, 2009.

"Where to Go for Green," EDN, vol. 53 no. 21, pp. S12-S13, Oct, 2008.

"Whisker control plating process YWL SYSTEM," Yuken.

"Whisker Formation on Tin Plated Cu based Leadframes: Results and Conclusions," Oct. 29. 2004.

"Whisker Formation on Tin Plated FeNi42: Results and Conclusions," Oct. 29, 2004.

"Whisker Formation Test Report," Phoenix Passive Components.

"Whisker-free Tin Coatings for Electronic Components," Tin and its Uses , no. 74, pp. 5, 1967.

"Whisker Woes," Air Safety Week, vol. 18 no. 45, pp. xx-xx, Nov. 22, 2004.

"Whiskers Can't Be Eliminated," Design News, vol. 61 no. 9, pp. xx, June 26, 2006.

"Whiskers on Monitor PCBs," Center for Advanced Life Cycle Engineering, Sept. 5, 2008.

"Whiskers on USB housing of PC Mother Board," Center for Advanced Life Cycle Engineering, Sept. 5, 2008.

"Whitepaper (Draft)," Pb-Free Electronics Risk Management (PERM) Consortium, Aug. 17, 2009.

"Whitepaper," Pb-Free Electronics Risk Management (PERM) Consortium, Dec. 2009.

"Who is taking the lead?," Electronic Product Design, vol. 25 no. 6, pp. 35-36, June 2004.

"Why Lead-free?," Almit.

"Widespread Reporting Error Surrounding BSEF," PCB007, Jan. 17, 2006.

"Will Discoloration Tarnish ImAg Reliability?," Circuits Assembly , vol. 20 no. 2, pp. 28, Feb. 2009.

"Will electronic equipment fail from tin-whisker shorts?," SourceESB, Feb. 9, 2005.

"Will Plasma panels move out of RoHS?," evertiq, Feb. 23, 2006.

"Wohler Technologies Policy on RoHS & WEEE," PCB007, Oct. 10, 2005.

"World refined tin production," Tin World, no. 22, Early Summer 2008, pp. 16-17.

"World Refined Tin Production," Tin World, no. 23, pp. 16-17, Summer 2008.

"World Refined Tin Production," Tin World, no. 24, pp. 16-17, Autumn 2008.

"World Tin Mine Production," Tin World, no. 25, pp. 17, Winter 2008/2009.

"World Tin Mine Production," Tin World, no. 26, pp. 17, Spring 2009.

"World Tin Mine Production," Tin World, no. 27, pp. 17, Summer 2009.

"World Tin Mine Production," Tin World, no. 28, pp. 17, Autumn 2009.

"World Tin Mine Production," Tin World, no. 30, pp. 17, Spring 2010.

"Worldwide lead-free certification," Elektron, vol. 22 no. 5, pp. 13, May 2005.

"Worldwide lead-free certification for electronics launched by IECQ," Apr. 22, 2005.

"Working to Get the Lead Out," Journal of the Reliability Information Analysis Center, pp. 2-4, 2nd Quarter 2006.

"X-ray Screening for RoHS Compliance," Design News, vol. 61 no. 2, pp. xx, Feb. 6, 2006.

"XRF analyzers measure traces of lead in solders," Advanced Materials & Processes, vol. 163 no. 2, pp. 23, Feb. 2005.

"XRF, Close Up," Circuits Assembly, vol. 17 no. 2, pp. 84-85, Feb. 2006.

"You can't sweep this one under the rug," Components in Electronics , vol. xx no. xx, pp. xx-xx, Feb. 2005.

"You have Choices For Lead-free Wave Selective and Tinning Operations," Lead-Free Connection, vol. 3 no. 1, pp. 1, May 2006.

"Zinc Contamination in High Technology Facilities.,"

"Zinc "whiskers"," finishing.com.

"Zinc Whiskers Growing on Raised Floor Tiles are Causing Conductive Contamination Failures and Equipment Shutdowns," The Uptime Institute.

AAAA

Aamir, Muhammad, Muhammad, Riaz, Tolouei-Rad, Majid, Giasin, Khaled, and Silberschmidt, Vadim V., "A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics," Soldering & Surface Mount Technology, vol. 32 no. 2, pp. 115-126, 2020.

Aamir, Muhammad, Izhar, , Waqas, Muhammad, Iqbal, Muhammad, Hanif, Muhammad Imran, and Muhammad, Riaz, "Fuzzy logic approach for investigation of microstructure and mechanical properties of Sn96.5-Ag3.0-Cu0.5 lead free solder alloy," Soldering & Surface Mount Technology, vol. 29 no. 4, pp. 191-198, 2017.

Aamir, Muhammad, Muhammad, Riaz, Ahmed, Naseer, and Waqas, Muhammad, "Impact of thermal aging on the intermetallic compound particle size and mechanical properties of lead free solder for green electronics," Microelectronics Reliability, vol. 78, pp. 311-318, Nov. 2017.

Aamir, Muhammad, Tolouei-Rad, Majid, Din, Israr Ud, Giasin, Khaled, and Vafadar, Ana, "Performance of SAC305 and SAC305-0.4La lead free electronic solders at high temperature," Soldering & Surface Mount Technology, vol. 31 no. 4, pp. 250-260, 2019.

Aasmundtveit, Knut E., Tekseth, Kim Robert, Breiby, Dag W., and Nguyen, Hoang-Vu, "High-energy X-ray Tomography for 3D Void Characterization in Au-Sn Solid-Liquid Interdiffusion (SLID) Bonds," 2019 22nd European Microelectronics and Packaging Conference & Exhibition, Pisa, Italy, Sept. 16-19, 2019. pp. xx-xx.

Aasmundtveit, Knut E., Eggen, Trym, Manh, Tung, and Nguyen, Hoang-Vu, "In-Bi low-temperature SLID bonding for piezoelectric materials," Soldering & Surface Mount Technology, vol. 30 no. 2, pp. 100-105, 2018.

Abbas, M. Hassib, "Kinetics of Aluminum Chromating," Metal Finishing, vol. 93 no. 12, pp. 8, 10, 12-13, Dec. 1995.

Abbas, Sanaa Razzaq, Gumaan, Mohammed S., and Shalaby, Rizk Mostafa, "Chromium effects on the microstructural, mechanical and thermal properties of a rapidly solidified eutectic Sn-Ag alloy," Soldering & Surface Mount Technology, vol. 32 no. 3, pp. 137-145, 2020.

Abbasi, Nasir M., Yu, Haojie, Wang, Li, Abdin, Zain-ul-, Amer, Wael A., Akram, Muhammad, Khalid, Hamad, Chen, Yongsheng, Saleem, Muhammad, Sun, Ruoli, and Shan, Jie, "Preparation of silver nanowires and their application in conducting polymer nanocomposites," Materials Chemistry and Physics, vol. 166, pp. 1-15, Sept. 15, 2015.

Abbott, Andrew P., Capper, Glen, McKenzie, Katy J., and Ryder, Karl S., "Electrodeposition of zinc-tin alloys from deep eutectic solvents based on choline chloride," Journal of Electroanalytical Chemistry, vol. 599 no. 2, pp. 288-294, Jan. 15, 2007. https://doi.org/10.1016/j.jelechem.2006.04.024

Abbott, Don, "Technical Challenges for Pb-Free Components," Massachusetts Toxic Use Reduction Institute 2nd Workshop on Lead-Free Electronics, June 29, 2000.

Abbott, Don, and Romm, Doug, "TI Tin Whisker and Pb-Free Finish Evaluations," Lead Free Electronics Workshop, Marlborough, MA, June 19, 2003.

Abbott, Donald, Romm, Douglas, and Lange, Bernhard, "A Nickel-palladium-gold IC Lead Finish and the Potential for Solder Joint Embrittlement," 2002 Advanced Technology Symposium Conference Proceedings, 2002, pp. xx-xx.

Abbott, Donald, Romm, Douglas, and Lange, Bernhard, "A Nickel-Palladium-Gold Integrated Circuit Lead Finish and Its Potential for Solder Joint Embrittlement," Texas Instruments Application Report SZZA031, Dec. 2001.

Abbott, Donald C., "Nickel/Palladium Finish for Leadframes," IEEE Transactions on Components and Packaging Technology, vol. 22 no. 1, pp. 99-103, Mar. 1999.

Abbott, Donald C., and Romm, Douglas W., "Palladium Plating: A Lead Free Finish for IC Leadframes," 1995 Proceedings 45th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 1995, pp. 1068-1072.

Abbott, Donald, Anderson, Richard, Pasquito, Helena, Wilkish, George, Harriman, Liz, Kistler, Marie, Pinsky, David, Quealy, Mark, Shina, Sammy, and Walters, Karen, "Testing and Analysis of Surface Mounted Lead Free Soldering Materials and Processes," IPC SMEMA Council APEX 2003, Anaheim, CA, Mar. 31-Apr. 2, 2003, pp. xx-xx.

Abbott, Donald C., "Nickel/Palladium Finish for Leadframes," IEEE Transactions on Components and Packaging Technology, vol. 22 no. 1, pp. 99-103, Mar. 1999.

Abdel-Hady, Hecham, Ma, Hongtao, Suhling, Jeffrey C., Islam, M. Saiful, and Lall, Pradeep, "Measurement of the Constitutive Behavior of Lead Free Solders," Proceedings of the 2004 SEM X International Congress and Exposition on Experimantal and Applied Mechanics, Costa Mesa, CA, June 7-10, 2004, pp. 345-349.

Abdelhadi, Ousama M., and Ladani, Leila, "Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints," Journal of Electronic Packaging, vol. 135 no. 2, pp. 021004-1-021004-10, June 2013.

Abdelhadi, Ousama M., and Ladani, Leila, "IMC growth of Sn-3.5Ag/Cu system: Combined chemical reaction and diffusion mechanisms," Journal of Alloys and Compounds, vol. 537, pp. 87-99, Oct. 5, 2012.

Abd-Elnaiem, Alaa M., Mebed, A. M., Gaber, A., and Abdel-Rahim, M. A., "Tailoring the porous nanostructure of porous anodic alumina membrane with the impurity control," Journal of Alloys and Compounds, vol. 659, pp. 270-278, Feb. 25, 2016.

Abdulhamid, M. F., Basaran, C., and Hopkins, D. C., "Effect of Thermomigration in Lead-Free Solder Alloy Mechanical Properties," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Abdulhamid, Mohd F., and Basaran, Cemal, "Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties," Journal of Electronic Packaging, vol. 131 no. 1, pp. 011002-1-011002-12, Mar. 2009.

Abdulhamid, Mohd F., Li, Shidong, and Basaran, Cemal, "Thermomigration in lead-free solder joints," International Journal of Materials and Structural Integrity, vol. 2 no. 1-2, pp. 11-34, June 2008. DOI: 10.1504/IJMSI.2008.018898

Abdulhamid, Mohd F., Basaran, Cemal, and Lai, Yi-Shao, "Thermomigration Versus Electromigration in Microelectronics Solder Joints," IEEE Transactions on Advanced Packaging, vol. 32 no. 3, pp. 627-635, Aug. 2009.

Abdullah, I., Ismail, R., and Jalar, A., "Strain Rate Effect on Micromechanical Properties of SnAgCu Solder Wire," 2014 IEEE International Conference on Semiconductor Electronics, Kuala Lumpur, Malaysia, Aug, 27-29, 2014, pp. 343-346.

Abdullah, Izhan, Zulkifli, Muhammad Nubli, Jalar, Azman, and Ismail, Roslina, "Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates," Soldering & Surface Mount Technology, vol. 29 no. 2, pp. 110-117, 2017.

Abdullah, Izhan, Zulkifli, Muhammad Nubli, Jalar, Azman, and Ismail, R., "Deformation behavior relationship between tensile and nanoindentation tests of SAC305 lead-free solder wire," Soldering & Surface Mount Technology , vol. 30 no. 3, pp. 194-202, 2018.

Abdullah, Izhan, Zulkifli, Muhammad Nubli, Jalar, Azman, Ismail, Roslina, and Ambak, Mohd Arrifin, "Relationship of Mechanical and Micromechanical Properties with Microstructural Evolution of Sn-3.0Ag-0.5Cu (SAC305) Solder Wire Under Varied Tensile Strain Rates and Temperatures," Journal of Electronic Materials , vol. 48 no. 5, pp. 2826-2839, May 2019.

Abdullah, Mikrajuddin, Shi, Frank G., Chungpaiboonpatana, Surasit, Okuyama, Kikuo, Davidson, Craig, and Adams, Joseph M., "Electrically Isotropic Conductive Adhesives: an Effective Contact Resistance Model for Conductivity Development," 1999 International Symposium on Advanced Packaging Materials, Braselton, GA, Mar. 14-17, 1999, pp. 282-287.

Abdullah, Zakaria, and Rahman, Mohamed Abdul, "High Temperature Storage Performance for Au Sn Diffusion Soldering on Cu Leadframe Substrate," 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Melaka, Malaysia, Nov. 30-Dec. 2, 2010, pp. xx-xx.

Abel, Nicholas, "What about mixing a leaded BGA on a board using Lead-Free paste? Or vice-versa?," Lead-Free Magazine.

Aberg, Ingvar, Vescovi, Giuliano, Asoli, Damir, Naseem, Umear, Gilboy, James P., Sundvall, Christian, Dahlgren, Andreas, Svensson, K. Erik, Anttu, Nicklas, Bjork, Mikael T., and Samuelson, Lars, "A GaAs Nanowire Array Solar Cell with 15.3% Efficiency at 1 Sun," 2015 IEEE 42nd Photovoltaic Specialist Conference, New Orleans, LA, June 14-19, 2015, pp. xx-xx.

Aberg, Ingvar, Vescovi, Giuliano, Asoli, Damir, Naseem, Umear, Gilboy, James P., Sundvall, Christian, Dahlgren, Andreas, Svensson, K. Erik, Anttu, Nicklas, Bjork, Mikael T., and Samuelson, Lars, "A GaAs Nanowire Array Solar Cell With 15.3% Efficiency at 1 Sun," IEEE Journal of Photovoltaics, vol. 6 no. 1, pp. 185-190, Jan. 2016.

Abermann, R., and Koch, R., "The Internal Stress in Thin Silver, Copper and Gold Films," Thin Solid Films, vol. 129 no. 1-2, pp. 71-78, July 12, 1985.

Abhyankar, Hrushikesh, Webb, D. Patrick, Hutt, David A., and West, G., "Adhesion of Thermoplastics to Materials used in Electronics (Tin)," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 296-303.

Abidh, Gerard, "Matching Cleaning Process to Solder Alloy," Surface Mount Technology (SMT), vol. 22 no. 12, pp. 24-26,31, Dec. 2008.

Abraham, Jisha Annie, Pagare, Gitanjali, Chouhan, Sunil Singh, and Sanyal, Sankar P., "Structural, electronic, elastic, mechanical and thermal behavior of RESn3(RE = Y, La and Ce) compounds: A first principles study," Intermetallics , vol. 51, pp. 1-10, Aug. 2014.

Abrams, Fern, "California Green Chemistry Takes Lists to Another Level," Circuitree, vol. 23 no. 1, pp. xx-xx, Jan. 2010.

Abrams, Fern, "China Publishes RoHS-Like Laws," evertiq, Nov. 25, 2005.

Abrams, Fern "Dealing with the devil: Could REACH be better than ROHS?," Electronic Business, Feb. 5, 2008.

Abrams, Fern, "Environmentally Speaking," CircuiTree, vol. 19 no. 4, pp. xx-xx, Apr. 2006.

Abrams, Fern, "Environmentally Speaking," Circuitree, vol. 19 no. 10, pp. xx-xx, Oct. 2006.

Abrams, Fern, "Environmentally Speaking," CircuiTree, vol. 20 no. 4, pp. xx-xx, Apr. 2007.

Abrams, Fern, "Environmentally Speaking -- Fern Abrams," CircuiTree, vol. 18 no. 7, pp. xx-xx, July 2005.

Abrams, Fern, "Environmentally Speaking -- Fern Abrams," CircuiTree, vol. 18 no. 10, pp. xx-xx, Oct. 2005.

Abrams, Fern, "Environmentally Speaking: Despite Unclear Environmental Impacts, OEMs Make Clear Announcements on Halogen-Free Electronics," CircuiTree, vol. 21 no. 4, pp. xx-xx, Apr. 2008.

Abrams, Fern, "Environmentally Speaking: Drawing the Line - How Green Electronics Turn Brown When Exposed to the Light of Day," CircuiTree, vol. 20 no. 7, pp. xx-xx, July 2007.

Abrams, Fern, "Environmentally Speaking -- Fern Abrams: Keeping Warm in Maine," CircuiTree, vol. 17 no. 4, pp. xx, Apr. 2004.

Abrams, Fern, "Environmentally Speaking - Fern Abrams: Lead Bans Spreading Like Wildfire," CircuiTree, vol. 17 no. 7, pp. xx, July 2004.

Abrams, Fern, "Environmentally Speaking: In Pursuit of Better Global Regulations," CircuiTree, vol. 20 no. 10, pp. xx-xx, Oct. 2007.

Abrams, Fern, "Get the Facts on Federalizing RoHS," IPC Review, vol. 48 no. 2, pp. 15,17, Feb. 2007.

Abrams, Fern, "Has Greenpeace Gone Too Far?," Circuitree, vol. 23 no. 4, pp. xx-xx, Apr. 2010.

Abrams, Fern, "IPC Halogen-Free Position and Perspective," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Abrams, Fern, "Materials Declaration for Eco-Compliance," IPC.

Abrams, Fern, "REACH: Is Industry Ready for This EU Regulatory Tidal Wave?," Circuitree, vol. 21 no. 10, pp. xx-xx, Oct. 2008.

Abrams, Fern, "Regulation, Standards, and Science: Where Are We on Halogen Free?," Circuitree, vol. 22 no. 10, pp. xx, Sept. 2009.

Abrams, Fern, "Social and Environmental Goals Pose Never-Ending Supply Chain Challenges: New Regulations Go Beyond Restricted Materials," Surface Mount Technology (SMT), vol. 26 no. 9, pp. 24-26,28, Sept. 2011.

Abrams, Fern, "Troubling road ahead with EU RoHS Directive," Circuitree, vol. 22 no. 4, pp. 21, Apr. 2009.

Abrams, Fern, "What's in Your Electronics Equipment?," Circuits Assembly , vol. 16 no. 1, pp. 58, Jan. 2005.

Abtew, M., and Selvaduray, G., "Lead-free Solders in Microelectronics," Materials Science and Engineering, vol. 27 no. 5-6, pp. 95-141, June 2000. https://doi.org/10.1016/S0927-796X(00)00010-3

Abtew, Mulugeta, Kinyanjui, Robert, Nuchsupap, Narong, Chavasiri, Thanarkhom, Yingyod, Net-Hin, Saetang, Paiboon, Krapun, Jakrit, and Jikratoke, Kriangsak, "Effect of Inert Atmosphere Reflow and Solder Paste Volume on the Microstructure and Mechanical Strength of Mixed Sn-Ag-Cu and Sn-Pb Solder Joints," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 74-78.

Abtew, Mulugeta, and Selvaduray, Guna, "Lead Free Solders for Surface Mount Technology Applications (Part 1)," Chip Scale Review, vol. xx no. xx, pp. xx, Mar. 1998.

Abtew, Mulugeta, and Selvaduray, Guna, "Lead Free Solders for Surface Mount Technology Applications (Part 2)," Chip Scale Review, vol. xx no. xx, pp. xx, Mar. 1998.

Abtew, Mulugeta, and Selvaduray, Guna, "Lead-free Solders in Microelectronics," Materials Science and Engineering: R: Reports, vol. 27 no. 5-6, pp. 95-141, June 1, 2000.

Abtew, Mulugeta, "Wetting Characteristics of Lead Free Solders for High Volume Surface Mount Application," Proceedings of the Technical Program NEPCON West 2000, Volume 2, Anaheim, CA, Feb. 29-Mar. 2, 2000, pp. 1089-1090.

Abu Bakar, M. S., and Rahimifard, S., "An integrated framework for planning of recycling activities in electrical and electronic sector," International Journal of Computer Integrated Manufacturing, vol. 21 no. 6, pp. 617-630, Sept. 2008.

Abueed, Mohammed, Belhadi, Mohamed, Wei, Xin, and Hamasha, Sa'd, "Combined Creep and Fatigue Loadings on SAC305 Solder Joint," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 243-249.

Abueed, Mohammed, Alathamneh, Raed, Hamasha, Sa'd, Suhling, Jeff, and Lall, Pradeep, "Effect of Creep and Fatigue on Individual SAC305 Solder Joint Reliability in Iso-Thermal Cycling," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 306-314.

Abueed, Mohammed, Athamenh, Raed, Hamasha, Sa'd, Suhling, Jeff, and Lall, Pradeep, "Effect of Fatigue on Individual SAC305 Solder Joints Reliability at Elevated Temperature," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 1043-1050.

Abys, Joseph A., "Analysis of Adhesion Failures of Thermally Treated Tin-plated Copper Using AES," Plating & Surface Finishing, vol. 88 no. 7, pp. 28-29, July 2001.

Abys, J. A., Maisano, J. J., Kadija, I. V., Kudrak, E. J., and Nakahara, S., "Annealing Behavior of Palladium-Nickel Alloy Deposits," Plating & Surface Finishing, vol. 83 no. 8, pp. 43-49, Aug. 1996.

Abys, Joseph A., "Optimization of Tin Plating Process For Adhesive Bonding," Plating & Surface Finishing, vol. 87 no. 11, pp. 32-33, Nov. 2000.

Abys, Joseph A., "Solderability & Wirebonding Performance Of Nickel/Palladium-plated Leadframes," Plating & Surface Finishing, vol. 88 no. 5, pp. 114-115, May 2001.

Abys, Joseph A., "The Effect of Base Metal Impurities on the Solderability & Wirebonding of Semiconductor Leadframes," Plating & Surface Finishing, vol. 87 no. 1, pp. 54-55, Jan. 2000.

Abys, Joseph A., "The Effect of Carbon Content on the Solderability/ Reflowability of Tin & Tin-Lead Electrodeposits," Plating & Surface Finishing, vol. 87 no. 3, pp. 50-51, Mar. 2000.

Abys, Joseph A., "The Effect of Chromium Contamination In a Tin Plating Bath," Plating & Surface Finishing, vol. 88 no. 3, pp. 50-51, Mar. 2001.

Acchione, T., and Scalzo, M., "Room Temperature LED and D-PAK Type Component-Attach and Reliability Testing," South East Asia Technical Training Conference on Electronics Assembly Technologies 2011 Proceedings, Penang, Malaysia, May 19-20, 2011, pp. xx-xx.

Accorsi, John, "The right mix: morphology and dispersion of carbon black in the stabilization of weather resistant polyethylenes," Wire Journal International, vol. 35 no. 3, pp. 98-105, Mar. 2002.

Acharya, Sanchar, and Kottantharayil, Anil, "Poole-Frenkel Transport in Gold Catalyzed VLS Grown Silicon Nanowires," IEEE Transactions on Electron Devices, vol. 65 no. 5, pp. 1685-1691, May 2018.

Achilias, D. S., Antonakou, E. V., Koutsokosta, E., and Lappas, A. A., "Chemical Recycling of Polymers from Waste Electric and Electronic Equipment," Journal of Applied Polymer Science, vol. 114 no. 1, pp. 212-221, Oct. 5, 2009.

Achillas, Ch., Vlachokostas, Ch., Moussiopoulos, N., Perkoulidis, G., Banias, G., and Mastropavlos, M., "Electronic waste management cost: a scenario-based analysis for Greece," Waste Management and Research, vol. 29 no. 9, pp. 963-972, Sept. 2011.

Adachi, M., Ohuchi, S., and Totsuka, N., "New Mode Crack of LSI Package in the Solder Reflow Process," Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium, San Francisco, CA, Sept. 16-18, 1991, pp. 171-174.

Adachi, Naoya, Fukawa, Tadashi, Tatewaki, Yoko, Shirai, Hirofusa, and Kimura, Mutsumi, "Anisotropic Electronic Conductivity in Layer-By-Layer Composite Film Composed of Water-Soluble Conjugated Polymers and SWNTs," Macromolecular Rapid Communications, vol. 29 no. 23, pp. 1877-1881, Dec. 1, 2008.

Adachi, Sadao, "Optical properties of a-Sn," Journal of Applied Physics, vol. 66 no. 2, pp. 813-819, July 15, 1989.

Adam, Achim, and Staschko, Klaus, "Bleifreie Schichten fur Lageranwendungen," Galvanotechnik, vol. xx no. xx, pp. 1335-1341, June 2005.

Adam, Sandor, Medgyes, Balint, Rigler, Daniel, Szabo, Bence, and Gal, Laszlo, "Electrochemical Migration of SAC305 Solders and Tin Surface Finish in NaCI Environment," 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging, Iasi, Romania, Oct. 25-28, 2018, pp. 71-75.

Adami-Sampson, Mike, "Designs on Environmental Compliance," Electronic News, Dec. 21, 2005.

Adami-Sampson, Mike, Cooper, Dolores, and Zepp. Mike, "The countdown begins," Electronics Supply & Manufacturing , Mar. 2006.

Adami-Sampson, Mike, Cooper, Dolores, and Zepp, Mike, "The RoHS countdown begins," Green SupplyLine, Mar. 1, 2006.

Adams, Jackie A., Lau, Sophia S., and Chew, L. H., "Building a Global Technologically Efficient Supply Chain," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Adams, Jacklin, Galyon, George, and Chew, L. H., "Environmental Regulatory Roadmap: A Recent History and a Look Forward," International Conference on Soldering & Reliability 2010 Proceedings, Toronto, Ontario, Canada, May 17-20, 2010, pp. xx-xx.

Adams, Jacklin, Galyon, George, and Chew, L. H., "Environmental Regulatory Roadmap: A Recent History and a Look Forward," SMTA Journal, vol. 23 no. 3, pp. 31-39, 2010.

Adams, Jackie, Cole, Marie, Fletcher, Mary Beth, Galyon, George, Grosskopf, Curtis, Quick, John, and Lau, Sophia, "EU RoHS Exemptions, Technology and Trends Since Promulgation," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 225-233.

Adams, Jackie, Liu, Hai L. H., Chew, L. H., Kelly, Matthew, and Wilcox, Jim, "Industry Challenges with China Envrionmental Product Regulations," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Adams, Jackie, "RoHs Compliance: Take A Supply-Chain Perspective," Electronic Design, vol. 53 no. 26, pp. 20, Nov. 17, 2005.

Adams, Jackie, Godown, Terry, Lyjak, Kenneth, Ferretti, Louis, Cordioli, Mina, Samson, Darren, and White, Fabio, "RoHS vs. REACH: What Does This Mean to I/T Hardware Companies and Data Management?," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 585-591.

Adams, Jacklin, "Achieving RoHS Compliance and the Integrated Supply Chain," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics , Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Adams, Larry, "Metals and Metal Parts: Troubling Tin Tendrils," Appliance Design , vol. xx no. x, pp. xx-xx, Nov. 2006.

Adams, Sean, Stratton, Paul, and Hunt, Chris, "Atmosphere Effects on the Comparative Solderability of Eutectic Tin-Silver-Copper and Tin-Lead Alloys," 2001 Advanced Packaging Technology Conference Proceedings, 2001, pp. xx-xx.

Adams, Tom, "A close look at mixed-solder boards," EMasia, May 2007.

Adams, Tom, "Acoustic Imaging In Transition To Pb-Free Processing," OnBoard Technology, vol. xx no. xx, pp. 10-11, Sept. 2004.

Adams, Tom, "Damage-Free Alloy Conversion for Medical Components,", Medical Electronics Manufacturing, pp. 3638,40-42, Fall 2009.

Adams, Tom, "Finding packaging defects in BGAs," Global SMT and Packaging , vol. 5 no. 4, pp. 32-33, Apr. 2005.

Adams, Tom, "Lead-free solder proposals put pressure on electronics manufacturers," Military & Aerospace Electronics, vol. 11 no. 7, pp. 3-4, July 2000.

Adams, Tom, "Moving to Lead-Free Solder for Medical Electronics," Medical Electronics Manufacturing, vol. xx no. xx, pp. 18-20, Spring 2002.

Adams, Tom, "Revised moisture sensitivity standard includes lead-free components," Military & Aerospace Electronics, Aug. 2008.

Adams, Tom, "Standard gives guidance for alloy conversion using hot-solder dip," Military & Aerospace Electronics, Dec. 2008.

Adams, Tom, and Martell, Steve, "The Moisture Sensitivity Standard Goes Pb-Free," Circuits Assembly , vol. 18 no. 1, pp. 40, 42, 44, Jan. 2007.

Adamson, Philip, "Lead-free Packaging for Discrete Power Semiconductors," 2002 JEDEC Conference, Apr./May 2002.

Adawiyah, M. A. Rabiatul, and Azlina, O. Saliza, "Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints," Journal of Alloys and Compounds , vol. 740, pp. 958-966, Apr. 5, 2018.

Adawiyah, M. A. Rabiatul, and Azlina, O. Saliza, "Interfacial reaction between SAC305 lead-free solders and ENImAg surface finish and bare copper," Materialwissenschaft und Werkstofftechnik , vol. 48 no. 3-4, pp. 235-240, Apr. 2017.

Adawiyah, M. A. Rabiatul, Hafiz, A. B. M., Azlina, O. Saliza, Zolhafizi, J., Azrina, W. M. Wan Nur, and Azmir, O. Shahrul, "The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg," Materialwissenschaft und Werkstofftechnik, vol. 50 no. 3, pp. 295-301, Mar. 2019.

Aday, Jon, and Evans, John L., "Thick Film Silver Multilayers for Under-the-Hood Automotive Applications," Proceedings 1993 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 2105), Dallas, TX, Nov. 9-11, 1993, pp. 126-131.

Addamiano, Arrigo, and Davey, John E., "A New Type of Gallium Arsenide Whiskers," Journal of Crystal Growth , vol. 10 no. 2, pp. 194-198, July 1971.

Addamiano, Arrigo, "Coiled Crystals of Gallium Arsenide," Journal of Crystal Growth, vol. 11 no. 3, pp. 351-354, Dec. 1971.

Addison, C. A., and Kedward, E. C., "The Development of Chromium Based Electrodeposited Composite Coatings," Transactions of the Institute of Metal Finishing, vol. 55 no. 2, pp. 41-46, Summer 1977.

Adeva, P., Caruana, G., Ruano, O. A., and Torralba, M., "Microstructure and high temperature mechanical properties of tin," Materials Science and Engineering: A, vol. 194 no. 1, pp. 17-23, April 1995.

Adler, C., Klink, G., Feil, M., Ansorge, F., and Reichl, H., "Assembly of ultra thin and flexible ICs," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing , Espoo, Finland, June 18-21, 2000, pp. 20-23.

Adli, Nisrin, Razak, Nurul Razliana Abdul, and Saud, Norainiza, "Physical and Mechanical Behaviors of SnCu-based Lead-free Solder Alloys with an Addition of Aluminium," Applied Mechanics and Materials, vol. 815, pp. 64-68, Nov. 2015.

Advani, Gurmukh, and Yadav, Om Prakash, "A Unified Model Approach for Solder Joint Life Prediction," 2015 Annual Reliability and Maintainability Symposium, Palm Harbor, FL, Jan. 26-29, 2015, pp. xx-xx.

Aernoudt, Etienne A. D., "Drawing induced structural and mechanical anisotropy," Wire Journal International, vol. 42 no. 12, pp. 60-71, Dec. 2009.

Affolter, Bruno, "Automatic and Secure Rework in a Lead-Free Environment," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 624-628.

Afshari, Sia, and Hall, W. J., "XRF - a reality check," Global SMT and Packaging, vol. 7 no. 1, pp. 44, 46, 48, Jan. 2007.

Afshari, Sia, and Hall, W. J., "XRF - A Reality Check," Lead-Free Magazine.

Agar, Joshua C., Lin, Katy J., Zhang, Rongwei, Durden, Jessica, Lawrence, Kevin, Moon, Kyoung-Sik, and Wong, C. P., "Deconstructing the Myth of Percolation in Electrically Conductive Adhesives and Its Implications," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1713-1718.

Agar, Joshua C., Durden, Jessica, Zhang, Rongwei, Staiculescu, Daniela, and Wong, C. P., "Kinetically Controlled Assembly Of terpheny-4,4"-dithiol Self-Assembled Monolayers (SAMs) for Highly Conductive Anisotropically Conductive Adhesives (ACA)," 2011 IEEE 61st Electronic Components and Technology Conference , Lake Buena Vista, FL, May 31-June 3, 2011, pp. 661-666.

Agarwal, Ravi, Ranjan, Rakesh, and Sarkar, Papiya, "Scrapping the Hi-Tech Myth: Computer Waste in India," Toxic Link , Feb. 2003.

Aggarwal, Ankur O., Abothu, Isaac R., Raj, P. Markondeya, Sacks, Michael. D., and Tummala, Rao R., "Lead-Free Solder Films Via Novel Solution Synthesis Routes," IEEE Transactions on Components and Packaging Technologies, vol. 30 no. 3, pp. 486-493, Sept. 2007.

Aggarwal, Ankur O., Raj, P. Markondeya, Abothu, Isaac R., Ravi, D., Sacks, Michael D., Tay, Andrew A. O., and Tummala, Rao R., "Material Synthesis Routes for Thin Film Bonding Interfaces in Reworkable and Bumpless Nano-Interconnects," 2004 9th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 24-26, 2004, pp. 69-73.

Aggarwal, Ankur O., Raj, P. Markondeya, and Tummala, Rao R., "Metal-Polymer Composite Interconnections for Ultra Fine-Pitch Wafer Level Packaging," IEEE Transactions on Advanced Packaging, vol. 30 no. 3, pp. 384-392, Aug. 2007.

Aggarwal, Ankur O., Raj, P. Markondeya, Abothu, Isaac R., Sacks, Michael D., Tay, Andrew A. O., and Tummala, Rao R., "New Paradigm in IC-Package Interconnections by Reworkable Nano-Interconnects," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 451-460.

Aggarwal, Ankur O., Raj, P. Markondeya, Lee, Baik-Woo, Yim, Myung Jin, Iyer, M., Wong, C. P., and Tummala, Rao R., "Thermomechanical Reliability of Nickel Pillar Interconnections Replacing Flip-Chip Solder Without Underfill," IEEE Transactions on Electronics Packaging Manufacturing, vol. 31 no. 4, pp. 341-354, Oct. 2008.

Aghazadeh, Mostafa, "Halogen-Free.... A Global Perspective," Intel Halogen Free Symposium , Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Agonafer, Dereje, and Hossain, Mohammad Masum, "Development of Constitutive Equations and Novel Methodology for Failure Prediction Models for SAC Lead-free Alloys," 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 13-14.

Agroskin, S., Geiger Jr., D., Griswold, B., Min, B. Y., Reinschmidt, R., Lasiter, J., Mathews, P. B., and Chong, F. C., "Reworking Multichip Modules," Electronic Packaging & Production , vol. 35 no. 3, pp. 42-45, Mar. 1995.

Aguanno, Mauro, Collins, Maurice, Burke, Cillian, Reid, Michael, Ryan, Claire, and Punch, Jeff, "Reliability Testing of Doped Lead Free Solder Alloys," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 492-498.

Aguayo, Art, and Kuszaj, Michael, "High Frequency Materials: Setting the Pace for Lead-free Processing," Circuitree, vol. 19 no. 6, pp. xx-xx, June 2006.

Aguilera, N. B. Palacios, Mollinger, J. R., Bastemeijer, J., Zhou, J., French, P. J., and Bossche, A., "Gluing as an Alternative to Solder Flexible Batteries for its use in System-in-a-package: Preliminary Results," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 550-555.

Aguirre, Patricio, "HOW safe is the lead-free environment," Electronics Manufacture and Test, pp. xx-xx, June 2006.

Agwai, Abigail, Guven, Ibrahim, and Madenci, Erdogan, "Peridynamic Theory for Impact Damage Prediction and Propagation in Electronic Packages due to Drop," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1048-1053.

Ahat, Shawkret, Du, Liguang, Sheng, Mei, Luo, Le, Kempe, Wolfgang, and Freytag, Juergen, "Effect of Aging on the Microstructure and Shear Strength of SnPnAg/Ni-P/Cu and SnAg/Ni-P/Cu Solder Joints," Journal of Electronic Materials, vol. 29 no. 9, pp. 1105-1109, Sept. 2000.

Ahat, Shawkret, Weidong, Huang, Mei, Sheng, and Le, Luo, "Joint Shape, Microstructure, and Shear Strength of Lead-Free Solder Joints with Different Component Terminations," Journal of Electronic Materials, vol. 31 no. 2, pp. 136-141, Feb. 2002.

Ahat, Shawkret, Sheng, Mei, and Luo, Le, "Microstructure and Shear Strength Evolution of SnAg/Cu Surface Mount Solder Joint during Aging," Journal of Electronic Materials, vol. 30 no. 10, pp. 1317-1322, Oct. 2001.

Ahlborn, H., and Wassermann, G., "Entstehung und Orientierung von Wolfram-Whiskern," Acta Metallurgica , vol. 8 no. 12, pp. 897-898, Dec. 1960.

Ahmad, I., Jiun, Hoh Huey, Leng, Eu Poh, Majlis, B. Y., Jalar, A., and Wagiran, R., "A Study on Inter-Metallic Compound Formation and Structure of Lead Free SnAgCu Solder System," IEEE International Conference on Semiconductor Electronics, Kuala Lumpur, Malasia, Nov. 29-Dec. 1, 2006, pp. 545-548.

Ahmad, Ibrahym, Seman, Anasyida Abu, and Mohamad, Ahmad Azmin, "Investigation of anodic dissolution behaviour of intermetallic compound in Sn-3Ag-0.5Cu solder alloy by cyclic voltammetry," Soldering & Surface Mount Technology, vol. 31 no. 4, pp. 211-220, 2019.

Ahmad, Ibrahim, Majlis, B.Y., Jalar, A., and Leng, Eu Poh, "Optimization Of Nickel Thickness On Substrate For TBGA Using SAC387 Solder Material," 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium, San Jose, CA, Oct. 3-5, 2007, pp. 192-194.

Ahmad, Ibrahim, Jalar, Azman, Majlis, Burhanuddin Yeop, Leng, Eu Poh, and San, Yong Soo, "Solder Joint Strength Of Lead Free Solders under Multiple Reflow and High Temperature Storage Condition," IEEE International Conference on Semiconductor Electronics, Kuala Lumpur, Malasia, Nov. 29-Dec. 1, 2006, pp. 541-544.

Ahmad, Mudasir, Burlingame, Jennifer, and Guirguis, Cherif, "Comprehensive Methodology to Characterize and Mitigate BGA Pad Cratering in Printed Circuit Boards," SMTAnews & Journal of Surface Mount Technology, vol. 22 no. 1, pp. 21-28, Jan.-Mar. 2009.

Ahmad, Mudasir, Liu, Kuo-Chuan, Ramakrishna, Gnyaneshwar, and Xue, Jie, "Impact of Backwards Compatible Assembly on BGA Thermomechanical Reliability and Mechanical Shock, Pre- and Post-Aging," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 306-321.

Ahmad, Mudasir, Senk, David, and Burlingame, Jennifer, "Methodology to Characterize Pad Cratering Under BGA Pads in Printed Circuit Boards," 2008 Pan Pacific Microelectronics Symposium & Exhibit , Kauai, HI, Jan. 22-24, 2008, pp. xx-xx.

Ahmad, Mudasir, Xie, Weidong, Liu, Kuo-Chuan, Xue, Jie, and Towne, Dave, "Parametric Acceleration Transforms for Lead-Free Solder Joint Reliability under Thermal Cycling Conditions," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 682-691.

Ahmad, Mudasir, and Wang, Qiang (Johnson), "Predicting Strength and Pad Cratering Failures Under BGA Pads," Surface Mount Technology (SMT), vol. 29 no. 1, pp. 48,50-52,54-59, Jan. 2014.

Ahmad, Mudasir, Duggan, Rich, Hu, Tom, Ong, Brett, Ralph, Carter, Sethuraman, Sundar, and Shangguan, Dongkai, "Strain Gage Testing: Standardization," Surface Mount Technology , vol. 19 no. 7, pp. xx-xx, July 2005.

Ahmad, Mudasir, Burlingame, Jennifer, and Guirguis, Cherif, "Validated Test Method to Characterize and Quantify Pad Cratering Under Bga Pads on Printed Circuit Boards," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Ahmad, Naeem, Saeed, Ahmad, Khan, Suleman, Hassan, Fahad, Li, W. J., Shah,, Saqlain A., Majid, Abdul, and Han, X. F., "Investigation of easy axis transition and magnetodynamics in Ni76Fe24 nanowires and Ni77Fe23 nanotubes synthesized by DC electrodeposition," Journal of Alloys and Compounds, vol. 725, pp. 123-128, Nov. 25, 2017.

Ahmad, Omar, "The status of RoHS-compliant component supply," Electronic Products, vol. 48 no. 8, pp. 89, Jan. 2006.

Ahmar, Joseph Al, and Wiese, Steffen, "FEM Simulation of Cracks in MLCC during Reflow Soldering," 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Dresden, Germany, Apr. 3-5, 2017, pp. xx-xx.

Ahmar, Joseph Al, Wiss, Erik, and Wiese, Steffen, "Fracture Probability of MLCC in Dependence of Solder Fillet Height," 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Dresden, Germany, Apr. 3-5, 2017, pp. xx-xx.

Ahmed, Mansur, Fouzder, Tama, Sharif, A., Gain, Asit Kumar, and Chan, Y. C., "Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy," Microelectronics Reliability, vol. 50 no. 8, pp. 1134-1141, Aug. 2010.

Ahmed, Md. Tusher, Motalab, Mohammad, and Suhling, Jeffrey C., "Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint," Journal of Electronic Materials, vol. 50 no. 1, pp. 233-248, Jan. 2021. https://doi-org.ezproxy.uky.edu/10.1007/s11664-020-08514-y

Ahmed, Mohammad Faisal, Li, Yan, and Zeng, Changchun, "Stretchable and compressible piezoresistive sensors from auxetic foam and silver nanowire," Materials Chemistry and Physics, vol. 229, pp. 167-173, May 1, 2019.

Ahmed, Nafis, Bhargav, P. Balaji, Rayerfrancis, Arokiyadoss, Chandra, Balaji, and Ramasamy, P., "Study the effect of plasma power density and gold catalyst thickness on Silicon Nanowires growth by Plasma Enhanced Chemical Vapour Deposition," Materials Letters, vol. 219, pp. 127-130, May 15, 2018.

Ahmed, Omar, Jalilvand, Golareh, Fernandez, Hector, Su, Peng, Lee, Tae-Kyu, and Jiang, Tengfei, "Long-Term Reliability of Solder Joints in 3D ICs Under Near-Application Conditions," 2019 IEEE 69th Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2019, pp. 1106-1112.

Ahmed, Sudan, Basit, Munshi, Suhling, Jeffrey C., and Lall, Pradeep, "Effects of Aging on SAC-Bi Solder Materials," 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 31-June 3, 2016, pp. 746-754.

Ahmed, Sudan, Suhling, Jeffrey C., and Lall, Pradeep, "Evaluation of Aging Induced Microstructural Evolution in Lead Free Solders Using Scanning Probe Microscopy," 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29-June 1, 2018, pp. 1062-1070.

Ahmed, Sudan, Hasnine, Md, Suhling, Jeffrey C., and Lall, Pradeep, "Mechanical Characterization of SAC Solder Joints at High Temperature Using Nanoindentation," 2017 IEEE 67th Electronic Components and Technology Conference, Orlando, FL, May 30-June 2, 2017, pp. 1128-1135.

Ahmed, Sudan, Wu, Jing, Fu, Nianjun, Suhling, Jeffrey C., and Lall, Pradeep, "Quantification and Modeling of Microstructural Evolution in Lead Free Solders During Long Term Isothermal Aging," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 162-171.

Ahmed, Sudan, Suhling, Jeffrey C., and Lall, Pradeep, "The Anand Parameters of Aging Resistant Doped Solder Alloys," 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 30-June 2, 2017, pp. 1416-1424.

Ahn, Jae Hyun, Lee, Jae-Hyun, Koo, Tae-Woong, Kang, MyungGil, Whang, Dongmok, and Hwang, SungWoo, "Synthesis of Small Diameter Silicon Nanowires on SiO2 and Si3N4 Surfaces," IEICE Transactions on Electronics, vol. E93.C no. 5, pp. 546-551, 2010.

Ahn, Junehyeon, Kim, Hongkwon, Byun, Kangho, Lee, Youngmin, Jang, Donghoon, and Kim, Byungsung. "Drop Test for Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Treatment Application that is Suitable to a Low-Cost Fine Pitch and Easy Fabrication," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 929-935.

Ahn, Jung-Ho, Kim, Yong-Jin, and Wang, Guoxiu, "Electrochemical properties of SnO2 nanowires prepared by a simple heat treatment of Sn-Ag alloys," Journal of Alloys and Compounds, vol. xxx no. x-x, pp. xxx-xxx, xxxx.

Ahn, Seongki, Kadoya, Takahiro, Nara, Hiroki, Yokoshima, Tokihiko, Momma, Toshiyuki, and Osaka, Tetsuya, "Tin addition for mechanical and electronic improvement of electrodeposited Si-O-C composite anode for lithium-ion battery," Journal of Power Sources, vol. 437, pp. 226858-1-226858-6, Oct. 15, 2019.

Ahn, Seung-Ho, and Kwon, Young-Shin, "Popcorn Phenomena in a Ball Grid Array Package," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, vol. 18 no. 3, pp. 491-495, Aug. 1995.

Ahn, Seungyoung, Ryu, Woonghwan, Yim, Myung-Jin, Lee, Junho, Jeon, Young-Doo, Kim, Woopoung, Paik, Kyung-Wook, and Kim, Joungho, "Over 10 GHz Equivalent Circuit Model of ACF Flip-chip Interconnect using Ni-filled Ball and Au-coated Polymer Balls," Proceedings of the Twenty-Fourth IEEE/CPMT Electronics Manufacturing Technology Symposium, Oct. 18-19, 1999, pp. 421-425.

Ahsan, Mohammad Al, Hasan, S. M. Kamrul, Fahim, Abdullah, Suhling, Jeffrey C., and Lall, Pradeep, "Effect of Different Thermal Cycling Profiles on the Mechanical Behavior of SAC305 Lead Free Solder," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 1170-1179.

Aiba, Akihiro, Kawamura, Kazumi, and Kumagai, Masashi, "Novel Cyanide Free Electroless Au Plating for the Reliable Joint Between Ni-P/Au and Sn-Ag-Cu Based Lead Free Solder," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B, San Francisco, CA, July 17-22, 2005, pp. 873-877.

Aiba, Akihiro, "Post Surface Treatment Agent and Technology for IC Leadframe with High Performance and Reliability," Journal of the Surface Finishing Society of Japan, vol. 60 no. 4, pp. 243-247, 2009.

Aichele, Thomas, Tribu, Adrien, Sallen, Gregory, Bocquel, Juanita, Bellet-Amalric, Edith, Bougerol, Catherine, Poizat, Jean-Philippe, Kheng, Kuntheak, Andre, Regis, Tatarenko, Serge, and Mariette, Henri, "CdSe quantum dots in ZnSe nanowires as efficient source for single photons up to 220 K," Journal of Crystal Growth, vol. 311 no. 7, pp. 2123-2127, Mar. 15, 2009.

Aichele, Thomas, Tribu, Adrien, Bougerol, Catherine, Kheng, Kuntheak, Andre, Regis, and Tatarenko, Serge, "Defect-free ZnSe nanowire and nanoneedle nanostructures," Applied Physics Letters, vol. 93, pp. 143106-1-143106-3, 2008.

Aifantis, K. E., and Dempsey, J. P., "Stable crack growth in nanostructured Li-batteries," Journal of Power Sources, vol. 143 no. 1-2, pp. 203-211, Apr. 27, 2005.

Aihara, Masami, "Material Properties and Practical Use Situation of Sn-Ag-In-Bi Solder System," Harima Chemicals.

Aish, M. M., and Starostenkov, M. D., "Deformation and Fracture of Metallic Nanowires," Solid State Phenomena , vol. 258, pp. 277-280, Dec. 2016.

Aisha, Siti Rabiatull, Ourdjini, A., Wah, N. M., How, H. C, and Chin, Y. T, "Interfacial Reactions of SAC305 and SAC405 Solders on Electroless Ni(P)/Immersion Au and Electroless Ni(B)/Immersion Au Finishes," 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium , Melaka, Malaysia, Nov. 30-Dec. 2, 2010, pp. xx-xx.

Ait Mani, Abdenacer, and Arch, Manon, "Direct Attach LED Soldering by New Printable AuSn Paste," 2015 European Microelectronics Packaging Conference, Friedrichshafen, Germany, Sept. 14-16, 2015, pp. xx-xx.

Aizawa, Hirofumi, Yoshida, Hideto, and Sakai, Shin-ichi, "Current results and future perspectives for Japanese recycling of home electrical appliances," Resources, Conservation and Recycling, vol. 52 no. 12 , pp. 1399-1410, Oct. 2008.

Ajmera, Abhinav, Ramkumar, S. Manian, and Liu, Ti Lin, "Finite Element Modeling and Experimental Validation of Conventional and High Speed Shear Testing in Pb-Free Environment," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1021-1030.

Akabori, M., Sladek, K., Hardtdegen, H., Schapers, Th., and Grutzmacher, D., "Influence of growth temperature on the selective area MOVPE of InAs nanowires on GaAs (1 1 1) B using N2 carrier gas," Journal of Crystal Growth , vol. 311 no. 15, pp. 3813-3816, July 15, 2009.

Akada, Yusuke, Tatsumi, Hiroaki, Yamaguchi, Takuto, Hirose, Akio, Morita, Toshiaki, and Ide, Eiichi, "Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior," Materials Transactions, vol. 49 no. 7, pp. 1537-1545, July 2008.

Akamatsu, M., Ohno, N., Takahashi, H., and Kawakami, T., "Comparison of Cyclic Inelastic Features of a Lead-Free Solder Alloy and a Nickel-Base Superalloy," Key Engineering Materials, vol. 274-276, pp. 763-768, 2004.

Akamatsu, Masafumi, Nakane, Kazuhiko, and Ohno, Nobutada, "Implicit Stress Integration for High-Temperature Inelastic Constitutive Models Using Linearization," Key Engineering Materials, vol. 340-341 II, pp. 907-912, 2007.

Akamatsu, Toshiya, Ueda, Hidefumi, Ochiai, Masayuki, and Horikoshi, Eiji, "Joint Reliability of Flip Chip Interconnection with Sn-Bi Solder," 2003 Pan Pacific Symposium Conference Proceedings, Feb. 18-20, 2003, pp. xx-xx.

Akamatsu, Toshiya, Yamagishi, Yasuo, Imamura, Kazuyuki, Yamaguchi, Osamu, and Minamizawa, Masaharu, "Solder Joint Reliability of BGA Package with Sn-Bi System Solder Balls," Proceedings 2001 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4587), Baltimore, MD, Oct. 9-11, 2001, pp. 547-552.

Akatiff, Clark, "Is this Ban Really Necessary? A Critical Investigation of the CRT Ban," May 2002.

Akazawa, Masamichi, and Hasegawa, Hideki, "MBE growth and in situ XPS characterization of silicon interlayers on (1 1 1)B surfaces for passivation of GaAs quantum wire devices," Journal of Crystal Growth, vol. 301-302, pp. 951-954, Apr. 2007.

Akbari, Saeed, Nourani, Amir, and Spelt, Jan K., "Effect of Solder Joint Length on Fracture Under Bending," Journal of Electronic Materials, vol. 45 no. 1, pp. 473-485, Jan. 2016.

Akbari, Saeed, and Spelt, Jan K., "Fracture Performance of BGA/PCB Underfilled Assemblies," International Conference on Soldering & Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.

Akenji, Lewis, Hotta, Yasuhiko, Bengtsson, Magnus, and Hayashi, Shiko, "EPR policies for electronics in developing Asia: an adapted phase-in approach," Waste Management and Research, vol. 29 no. 9, pp. 919-930, Sept. 2011.

Akhavan, Vahid, Ghosh, Rudy, Pillai, Nikhil, Chou, Harry, and Schroder, Kurt, "Use of Flash Lamps to Achieve Non-equilibrium Soldering and Assembly Utilizing Conventional SAC Alloys," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 585-588.

Akhtar, A. M. Zetty, Wirda, K.Hardinna, Aisha, I. Siti Rabiatull, and Mahadzir, I., "Microstructure Evolution at the Solder Joint during Isothermal Aging," 2014 IEEE 36th International Electronics Manufacturing Technology Conference , Johor, Malaysia , Nov. 11-13, 2014, pp. xx-xx.

Akhtar, Masyood, and Anklekar, Rupendra M., "Effect of Lead and Cadmium-Free Glasses on Reliability and Microstructural Development of Pb-Free Silver End Termination for MLCC Application," Proceedings of the 25th Symposium for Passive Components, Palm Springs, CA, Mar. 21-24, 2005, pp. 199-207.

Akhtar, Masyood, "Effect of Lead and Cadmium Free Glasses on Reliability of the Silver End Termination for MLCC Application," 2005 International Symposium on Electronics Materials and Packaging, Tokyo, Japan, Dec. 11-14, 2005, pp. 67-73.

Akin, Meriem Ben-Salah, Rissing, Lutz, and Heumann, Wolfgang, "Enabling Eutectic Soldering of 3D Opto-Electronics onto Low Tg Flexible Polymers," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 1595-1600.

Akinade, K., Burgess, R., Campbell, M., Carver, S., Sanderson, L., Wade, R., and Melton, C., "Lead-free Solder Pastes Evaluation at Motorola Transmission Products Division," Soldering & Surface Mount Technology, vol. 7 no. 2, pp. 50-54, May 1995.

Akkara, Francy John, Zhao, Cong, Sreenivasan, Arvind, Su, Sinan, Abueed, Mohammed, Hamasha, Sa'd, Ali, Haneen, Suhling, Jeff, and Lall, Pradeep, "Effect of Combining Solder Pastes with SAC305 Spheres on Component Reliability in Harsh Thermal Cycling," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , Orlando, FL, May 26-29, 2020, pp. 1322-1327.

Akkara, Francy John, Zhao, Cong, Athamenh, Raed, Su, Sinan, Abueed, Mohammed, Hamasha, Sa'd, Suhling, Jeff, and Lall, Pradeep, "Effect of Solder Sphere Alloys and Surface Finishes on the Reliability of Lead-Free Solder Joints in Accelerated Thermal Cycling," 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29-June 1, 2018, pp. 1374-1380.

Akkara, Francy John, Su, Sinan, Thirugnanasambandam, Sivasubramanian, Dawahdeh, Ahmad, Qasaimeh, Awni, Evans, John, and Hamasha, Sa'd, "Effects of Long-Term Aging on SnAgCu Solder Joints Reliability in Mechanical Cycling Fatigue," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 419-425.

Akkara, Francy John, Zhao, Cong, Abueed, Mohammed, Su, Sinan, Hamasha, Sa'd, Suhling, Jeffrey, and Lall, Pradeep, "Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes on the Component Reliability in Harsh Thermal Cycling," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Akkara, Francy John, Abueed, Mohammed, Belhadi, Mohamed, Wei, Xin, Hamasha, Sa'd, Ali, Haneen, Suhling, Jeff, and Lall, Pradeep, "Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. xx-xx.

Akkara, Francy John, Zhao, Cong, Ahmed, Sudan, Abueed, Mohammed, Su, Sinan, Hamasha, Sa'd, Suhling, Jeffrey, and Lall, Pradeep, "Thermal Cycling Reliability of Newly Developed Lead-Free Solders for Harsh Environments," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 315-322.

Akopyan, I. Kh., Labzovskaya, M. E., Novikov, B. V., and Tsagan-Mandzhieva, D. A., "Photostimulated Growth of Whiskers in AgI-Type Superionic Crystals," Journal of Technical Physics (USSR), vol. 57 no. 2, pp. 220-224, Feb. 2012. https://doi.org/10.1134/S1063784212020028

Akram, Slaman, "Lead-Free Electronics: Searching for a Lead Replacement," Future Fab International, vol. 9, pp. xx-xx, Jan. 7, 2000.

Aksoy, Burcu, Kalay, Yunus Eren, and Unalan, Husnu Emrah, "Germanium nanowire synthesis using solid precursors," Journal of Crystal Growth, vol. 392, pp. 20-29, Apr. 15, 2014.

Aksoz, Namik, Ozturk, Esra, Bayram, Umit, Aksoz, Sezen, Kervan, Selcuk, Ulgen, Ahmet, and Marasli, Necmettin, "Thermal Conductivity Variation with Temperature for Lead-Free Ternary Eutectic Solders," Journal of Electronic Materials, vol. 42 no. 12, pp. 3573-3581, Dec. 2013.

Akutsu, Takahiro, Yu, Qiang, and Nishimura, Yuji, "Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 550-555.

Akutsu, Takahiro, and Yu, Qiang, "Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints," Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, Volume 2, Portland, OR, July 6-8, 2011, pp. 691-699.

Al Ahmar, Joseph, and Wiese, Steffen, "FEM Simulation of Cracks in MLCC during Reflow Soldering," 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Dresden, Germany, Apr. 3-5, 2017, pp. xx-xx.

Al Ahmar, Joseph, Wiss, Erik, and Wiese, Steffen, "Fracture Probability of MLCC in Dependence of Solder Fillet Height," 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Dresden, Germany, Apr. 3-5, 2017, pp. xx-xx.

Alagarsamy, Karthik, Kohani, Mehdi, Fortier, Aleksandra, and Pecht, Michael G., "Risk of Tin Whiskers in Medical Devices," Journal of Biomedical Engineering and Research, vol. 2 no. 101, pp. 1-10, 2018.

Alam, Javed, Riaz, Ufana, and Ahmad, Sharif, "Development of nanostructured polyaniline dispersed smart anticorrosive composite coatings," Polymers for Advanced Technologies, vol. 19 no. 7, pp. 882-888, July 2008.

Alam, Khairul, and Sajjad, Redwan N., "Electronic Properties and Orientation-Dependent Performance of InAs Nanowire Transistors," IEEE Transactions on Electron Devices, vol. 57 no. 11, pp. 2880-2885, Nov. 2010.

Alam, M. E., Nai, S. M. L., and Gupta, M., "Development of high strength Sn-Cu solder using copper particles at nanolength scale," Journal of Alloys and Compounds, vol. 476 no. 1-2, pp. 199-206, May 12, 2009.

Alam, M. E., Nai, S. M. L., and Gupta, M., "Effect of Amount of Cu on the Intermetallic Layer Thickness Between Sn-Cu Solders and Cu Substrates," Journal of Electronic Materials, vol. 38 no. 12, pp. 2479-2488, Dec. 2009.

Alam, M. O., Chan, Y. C., and Tu, K. N., "Effect of 0.5 wt % Cu addition in Sn-3.5%Ag solder on the dissolution rate of Cu metallization," Journal of Applied Physics, vol. 94 no. 12, pp. 7904-7909, Dec. 15, 2003.

Alam, M. O., Chan. Y. C., Tu. N., and Kivilahti, K., "Effect of 0.5 wt % Cu in Sn-3.5%Ag Solder Balls on the Solid State Interfacial Reaction with Au/Ni/Cu Bond Pads for Ball Grid Array (BGA) Applications," Chemistry of Materials, vol. 17 no. 9, pp. 2223-2226, May 3, 2005.

Alam, M. O., Chan, Y. C., and Tu, K. N., "Effect of 0.5 wt % Cu in Sn-3.5%Ag Solder on the Interfacial Reaction with Au/Ni Metallization," Chemistry of Materials, vol. 15 no. 23, pp, 4340-4342, 2003.

Alam, M. O., Chan, Y. C., and Tu, K. N., "Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn-Ag solder and Au/electroless Ni(P)/Cu bond pad," Journal of Applied Physics, vol. 94 no. 6, pp. 4108-4115, Sept. 15, 2003.

Alam, M. O., Lu, Hua, Bailey, Chris, and Chan, Y. C., "Finite-Element Simulation of Stress Intensity Factors in Solder Joint Intermetallic Compounds," IEEE Transactions on Device and Materials Reliability, vol. 9 no. 1, pp. 40-48, Mar. 2009.

Alam, M. O., Lu, H., Bailey, Chris, and Chan, Y. C., "Fracture Mechanics Analysis of Cracks in Solder Joint Intermetallic Compounds," 2nd Electronics Systemintegration Technology Conference , Greenwich, London, UK, Sept. 1-4, 2008, pp. 757-762.

Alam, M. O., Lu, H., Bailey, Chris, and Chan, Y. C., "Fracture mechanics analysis of solder joint intermetallic compounds in shear test," Computational Materials Science, vol. 45 no. 2, pp. 576-583, Apr. 2009.

Alam, M. O., Bailey, Chris, Wu, B. Y., Yang, Dan, and Chan, Y. C., "High Current Density induced Damage Mechanisms in Electronic Solder Joints: A State-of-the-Art Review," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Alam, M. O., Chan, Y. C., and Hung, K. C., "Interfacial Reaction of Pb-Sn Solder and Sn-Ag Solder with Electroless Ni Deposit during Reflow," Journal of Electronic Materials, vol. 31 no. 10, pp. 1117-1121, Oct. 2002.

Alam, M. O., and Chan, Y. C., "Interfacial Reaction Phenomena of Sn-Pb Solder with Au/Ni/Cu Metallization," Chemistry of Materials, vol. 17 no. 5, pp. 927-930, mar. 8, 2005.

Alam, M. O., Chan, Y. C., and Hung, K. C., "Reaction Kinetics of Pb-Sn and Sn-Ag Solder Balls with Electroless Ni-P/Cu Pad During Reflow Soldering in Microelectronic Packaging," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1650-1657.

Alam, M. O., Lu, H., Bailey, Chris, Wu, B. Y., and Chan, Y. C., "Shear Strength Analysis of Ball Grid Array (BGA) Solder Interfaces," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 770-773.

Alam, M. O., Dan, Yang, Wu, B. Y., Chan, Y. C., Rufer, L., and Bailey, C., "Solid State Growth Kinetics of Complex Intermetallics in the Pb-free Ball Grid Array (BGA) Solder Joint for MEMS Packaging," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 211-213.

Alam, M. O., and Chan, Y. C., "Solid-state growth kinetics of Ni3Sn4 at the Sn-3.5Ag solder/Ni interface," Journal of Applied Physics, vol. 98 no. 12, pp. 123527-1-123527-4, Dec. 15, 2005.

Alam, Mohammad Ohidul, and Chan, Y. C., "Effect of 0.5 wt% Cu in Sn-3.5%Ag Solder to Retard Interfacial Reactions With the Electroless Ni-P Metallization for BGA Solder Joints Application," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 2, pp. 431-438, June 2008.

Alam, Mohammad S., Hassan, K. M. Rafidh, Suhling, Jeffrey C., and Lall, Pradeep, "A Comparative Study of the High Temperature Mechanical Behavior of Lead Free Solders," 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29-June 1, 2018, pp. 1314-1323.

Alam, Mohammad S., Hassan, K. M. Rafidh, Suhling, Jeffrey C., and Lall, Pradeep, "High Temperature Aging Effects in SAC and SAC+X Lead Free Solders," 2019 IEEE 69th Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2019, pp. 1815-1825.

Alam, Mohammad S., Hassan, K. M. Rafidh, Suhling, Jeffrey C., and Lall, Pradeep, "High Temperature Mechanical Behavior of SAC and SAC+X Lead Free Solders," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 1781-1789.

Alam, Mohammad S., Hassan, K. M. Rafidh, Fahim, Abdullah, Wu, Jing, Ahmed, Sudan, Suhling, Jeffrey C., and Lall, Pradeep, "Investigation of the Mechanical Behavior of SAC305 Solder Joints at Extreme High Temperatures Using Nanoindentation," 2020 IEEE 70th Electronic Components and Technology Conference, Lake Buena Vista, AL, May 26-29, 2020, pp. 2175-2184.

Alam, Mohammad S., Hassan, KM Rafidh, Suhling, Jeffrey C., and Lall, Pradeep, "Mechanical Characterization and Microstructural Evolution of SAC and SAC+X Lead Free Solders Subjected to High Temperature Aging," 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 28-31, 2019, pp. 319-328.

Alam, Mohammad S., Basit, Munshi, Suhling, Jeffrey C., and Lall, Pradeep, "Mechanical Characterization of SAC305 Lead Free Solder at High Temperatures," 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 31-June 3, 2016, pp. 755-760.

Alarifi, Hani, Hu, Anming, Yavuz, Mustafa, and Zhou, Y. Norman, "Silver Nanoparticle Paste for Low-Temperature Bonding of Copper," Journal of Electronic Materials, vol. xx no. x, pp. xx-xx, xxxx.

Alaviitala, Tiina, and Mattila, Tuomas J., "Engineered nanomaterials reduce but do not resolve life cycle environmental impacts of power capacitors," Journal of Cleaner Production, vol. 93, pp. 347-353, Apr. 15, 2015.

Alaya, Mohamed Amine, Gal, Laszlo, Hurtony, Tamas, Medgyes, Balint, Straubinger, Daniel, I, Al-Maaiteh Tareq, Illes, Balazs, and Geczy, Attila, "Wetting of different lead free solder alloys during vapour phase soldering," 2019 42nd International Spring Seminar on Electronics Technology, Wroclaw, Poland, May 15-19, 2019, pp. xx-xx.

Albano, M., Fichera, G. V., Rovetta, T., Guida, G., Licchelli, M., Merlo, C., Cofrancesco, P., Milanese, C., and Malagodi, M., "Microstructural investigations on historical organ pipes," Journal of Materials Science, vol. 52 no. 16, pp. 9859-9871, Aug. 2017.

Alber, Sebastian, Greif, Andre, and Rodrigo, Julio, "Results from the SEES Project: Recyclability and Sustainability of Automotive Electrical and Electronic Systems," InLCA/LCN 2006, Washington, DC, Oct. 4-6, 2006, pp. xx-xx.

Albert, F.,and Schmidt, M., "Laserstrahlbasiertes Reparaturloten in der Elektronik-Produktion (Laser based rework in electronic production)," Materialwissenschaft und Werkstofftechnik, vol. 36 no. 2, pp. 69-74, Feb. 2005.

Alberth, W., and Schumacher, H., "Lead-free Soldering - A Challenge for Base Materials," Isola, Jan. 3, 2005.

Alberti, R., Longoni, A., Klatka, T., Guazzoni, C., Gianoncelli, A., Bacescu, D., and Kaulich, B., "A Low Energy X-Ray Fluorescence Spectrometer for Elemental Mapping X-Ray Microscopy," IEEE Nuclear Science Symposium Conference Record, Dresden, Germany, Oct. 19-25, 2008, pp. 1564-1566.

Albrecht, H.-J., Brodie, D. S., Gunn, A. J., Muller, W. H., and Reuben, R. L., "A Study of Microstructural Change of Lead-Containing and Lead Free Solders," 2002 Pan Pacific Symposium Conference Proceedings, Maui, Hawaii, Feb. 5-7, 2002, pp. xx-xx.

Albrecht, H.-J., Brodie, D. S., Gunn, A. J., Muller, W. H., and Reuben, R. L., "A Study of Microstructural Change of Lead-Containing and Lead-Free Solders," Journal of SMT, vol. 15 no. 2, pp. 30-39, Apr. 2002.

Albrecht, H.-J., "Advanced Packages and Board Level Reliability," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 203-208.

Albrecht, H.-J., Walter, H., and Lantzsch, M., "Alternative Lead Free Ball Materials with Improved Interface Properties," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 686-692.

Albrecht, H.-J., "Board Level Reliability of Lead Free Soldered Interconnections," 2000 SMTA International Conference Proceedings, Chicago, IL, Sept. 24-28, 2000, pp. xx-xx.

Albrecht, H.-J., Wilke, K., and Brodie, D. S., "Board Level Reliability of Lead-Free Soldered Interconnections," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Albrecht, H.-J., and Wilke, K., "Board Level Reliability of Lead-Free Soldered Interconnects on Conventional and Area Array Components," 2001 SMTA International Conference Proceedings, Chicago, IL, Sept. 30-Oct. 4, 2001, pp. xx-xx.

Albrecht, H.-J., Heimann, M., Gotze, Ch., and Loffler, M., "Board Level Reliability of Lead-Free Soldered Interconnects - Test Methods," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 380-389.

Albrecht, H.-J., "Interface Description and Failure Mechanism of SnAgCu Solders in BGA Packages," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 309-313.

Albrecht, H.-J., and Strogies, J., "Investigations studying the electromigration phenomena in interconnects," 2014 Electronics System-Integration Technology Conference, Helsinki, Finland, Sept. 16-18, 2014, pp. xx-xx.

Albrecht, H.-J., and Loffler, M., "Lead-Free Solder Alloy Optimization for Improved Reliability," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 126-133.

Albrecht, H.-J., "Lead-Free Solder Joints and Failure Mechanism on Different Finishes," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 584-590.

Albrecht, H.-J., Fruhauf, P., and Wilke, K., "Pb-Free Alloy Alternatives: Reliability Investigation," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 308-316.

Albrecht, Hans-Jurgen, and Wilke, Klaus, "Material-Dependent Reliability Characteristics of Lead-Free Solder Joints," 1st Electronics Systemintegration Technology Conference, Volume 1 , Dresden, Germany, Sept. 5-7, 2006, pp. 133-138.

Albrecht, Hans-Jurgen, "Siemens AG Berlin: Overview about the Project Group Reliability and Lead-free Activities," Siemens AG, 2003.

Albright, Brian, "European Environmental Regulations Pose Supply Chain Challenge," Frontline Solutions, vol. xx no. xx, pp. xx-xx. Mar. 15, 2005.

Alducin, Diego, Borja, Raul, Ortega, Eduardo, Velazquez-Salazar, J. Jesus, Covarrubias, Mario, Santoyo, Fernando Mendoza, Bazan-Diaz, Lourdes, Sanchez, John Eder, Torres, Nayely, Ponce, Arturo, and Jose-Yacaman, Miguel, "In situ transmission electron microscopy mechanical deformation and fracture of a silver nanowire," Scripta Materialia, vol. 113, pp. 63-67, Mar. 1, 2016.

Alexander, Curt, "Cleaning Flux Residue in Hand Solder Rework and the Effects on SIR," Circuits Assembly, vol. 17 no. 9, pp. 65-66, Sept. 2006.

Alexander, Ralph B., "Ion Implantation Comes to the Rescue of Hard Chromium Plating," Plating & Surface Finishing, vol. 83 no. 7, pp. 9-11, July 1996.

Alexis, J., Adrian, D., Masri, T., and Petit, J. A., "Adherence of Electrodeposited Zn-Ni Coatings on EN AW2024 T3 Aluminium Alloy," Surface Engineering, vol. 20 no. 2, pp. 121-127, Apr. 2004.

Al-Ezzi, Athil, Al-Bawee, Abbas, Dawood, Feryal, and Shehab, Abeer A., "Effect of Bismuth Addition on Physical Properties of Sn-Zn Lead-Free Solder Alloy," Journal of Electronic Materials, vol. 48 no. 12, pp. 8089-8095, Dec. 2019.

Alfred, Yeo, Bernd, Ebersberger, and Charles, Lee, "Consideration of temperature and current stress testing on flip chip solder interconnects," Microelectronics Reliability, vol. 48 no. 11-12, pp. 1847-1856, Nov.-Dec. 2008.

Al-Ganainy, G. S., "Creep Characteristics of a New Pb-Free Soldering Sn-In Pewter," Physica Status Solidi (A) - Applications and Materials Science, vol. 193 no. 2, pp. 226-235, Sept. 2002.

Al-Ganainy, G. S., El-Daly, A. A., Fawzy, A., and Hussein, N., "Effect of adding nanometric ZnO particles on thermal, microstructure and tensile creep properties of Sn-6.5 wt%Zn-3 wt%In solder alloy," Journal of Materials Science: Materials in Electronics, vol. 28 no. 17, pp. 13303-13312, Sept. 2017.

Al-Ganainy, G. S., "Effect of heat treatment on the work-hardening parameters of a new Pb-free solder Sn-9.8 wt% In alloy," Physica Status Solidi (A), vol. 199 no. 2, pp. 169-176, Aug. 14, 2003.

Al-Ganainy, G. S., El-Khalek, A. M. Abd, and Sakr, M. S., "Influence of heat treatment on stress-strain behaviour and lattice parameters of Sn-In alloy," Materials Science and Technology, vol. xx no. xx, pp. xx-xx, xxxx.

Algarni, Zaina, Singh, Abhay, and Philipose, U., "Role of chemical potential and limitations of growth kinematics on stoichiometry of indium antimonide nanowires," Materials Chemistry and Physics, vol. 219, pp. 196-203, Nov. 1, 2018.

Alghoul, T., Wentlent, L., Sivasubramony, R., Greene, C., Thompson, P., and Borgesen, P., "Diffusion Creep of Realistic SnAgCu Solder Joints at Times and Stresses of Relevance to Thermal Fatigue," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 10 no. 2, pp. 288-295, Feb. 2020.

Alghoul, T., Wentlent, L., Sivasubramony, R., Greene, C., Thompson, P., and Borgesen, P., "Effects of Thermal Cycling on Creep of SnAgCu Solder Joints," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 9 no. 5, pp. 888-894, May 2019.

Alghoul, Thaer, Watson, Dustin, Adams, Nardeeka, Khasawneh, Saif, Batieha, Farhan, Greene, Chris, and Borgesen, Peter, "Constitutive Relations for Finite Element Modeling of SnAgCu in Thermal Cycling -- How Wrong We Were!," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 1726-1732.

Alghoul, Thaer M., Yadav, Manu, Thekkut, Sanoop, Sivasubramony, Rajesh S., Greene, Christopher M., Poliks, Mark D., Borgesen, Peter, Wentlent, Luke, Meilunas, Michael, Stoffel, Nancy, Shaddock, David M., and Yin, Liang, "Low Temperature Solder Attach of SnAgCu Bumped Components for a Flexible Hybrid Electronics Based Medical Monitor," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 948-953.

Ali, Bakhtiar, "Advancement in microstructure and mechanical properties of lanthanum-doped tin-silver-copper lead free solders by optimizing the lanthanum doping concentration," Soldering & Surface Mount Technology, vol. 27 no. 2, pp. 69-75, 2015.

Ali, Bakhtiar, Sabri, Mohd Faizul Mohd, Said, Suhana Mohd, Sukiman, Nazatul Liana, Jauhari, Iswadi, and Soin, Norhayati, "High impact reliability and high temperature performance of Fe and Bi added Sn-1Ag-0.5Cu solder alloys," Journal of Materials Science: Materials in Electronics, vol. 28 no. 10, pp. 7277-7285, May 2017.

Ali, Bakhtiar, Sabri, Mohd Faizul Mohd, Jauhari, Iswadi, and Sukiman, Nazatul Liana, "Impact toughness, hardness and shear strength of Fe and Bi added Sn-1Ag-0.5Cu lead-free solders," Microelectronics Reliability, vol. 63, pp. 224-230, Aug. 2016.

Ali, Bakhtiar, Sabri, Mohd Faizul Mohd, Sukiman, Nazatul Liana, and Jauhari, Iswadi, "Microhardness and shear performance of Fe/Bi-bearing SAC105 solder alloys under high temperature aging," Journal of Materials Science: Materials in Electronics, vol. 28 no. 1, pp. 197-206, Jan. 2017.

Ali, Bakhtiar, Sabri, Mohd Faizul Mohd, Said, Suhana Mohd, Sukiman, Nazatul Liana, Jauhari, Iswadi, and Mahdavifard, Mohammad Hossein, "Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment," Microelectronics Reliability , vol. 82, pp. 171-178, Mar. 2018.

Ali, Bakhtiar, Sabri, Mohd Faizul Mohd, Said, Suhana Mohd, Mahdavifard, Mohammad Hossein, Sukiman, Nazatul Liana, and Jauhari, Iswadi, "Microstructural Modification of Sn-0.7Cu Solder Alloys by Fe/Bi-Addition for Achieving High Mechanical Performance," Journal of Electronic Materials , vol. 46 no. 8, pp. 4755-4764, Aug. 2017.

Ali, L., Chan, Y. C., and Alam, M. O., "The effect of thermal cycling on the contact resistance of anisotropic conductive joints," Soldering & Surface Mount Technology, vol. 17 no. 3, pp. 20-31, 2005.

Ali, Lafir, Chan, Y. C., and Alam, M. O., "Effect of Bump Characteristics and Temperature Variation on the Online Contact Resistance of Anisotropic Conductive Joints," Journal of Electronic Materials, vol. 33 no. 9, pp. 1028-1035, Sept. 2004.

Ali, Lafir, and Chan, Y. C., "Impact of RoHS/WEEE - On Effective Recycling - Electronics System Integration," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 521-524.

Ali, Lafir, Chan, Y. C., and Alam, M. O., "Reliability of anisotropic conductive joints for bumpless flip-Chip on flex packages under thermal stresses," Journal of Microelectronics and Electronic Packaging, vol. 2 no. 4, pp. 269-280, Fourth Quarter 2005.

Ali, Syed W., "Mixed Signal Design Considerations," Printed Circuit Design and Fab , vol 25 no. 10, pp. 29-31, Oct. 2008.

Aliwell, Rick, "Lead Free Seminar: A Component Manufacturers View," SMART Group Lead-Free Seminar 2000, High Wycombe, UK, Feb. 10, 2000.

Alkorta, J., and Sevillano, J. Gil, "Measuring the strain rate sensitivity by instrumented indentation. Application to an ultrafine grain (equal channel angular-pressed) eutectic Sn-Bi alloy," Journal of Materials Research, vol. 19 no. 1, pp. 282-290, Jan. 2004.

Allachi, H., Chaouket, F., and Draoui, K., "Protection against corrosion in marine environments of AA6060 aluminium alloy by cerium chlorides," Journal of Alloys and Compounds, vol. 491 no. 1-2, pp. 223-229, Feb. 18, 2010.

Allain, P. E., Le Roux, X., Parrain, F., and Bosseboeuf, A., "Large initial compressive stress in top-down fabricated silicon nanowires evidenced by static buckling," Journal of Micromechanics and Microengineering, vol. 23 no. 1, pp. 015014-1-015014-8, Jan. 2013.

Allain, Pierre Etienne, Parrain, Fabien, Bosseboeuf, Alain, Maaroufi, Seifeddine, Coste, Philippe, and Walther, Arnaud, "Large-Range MEMS Motion Detection With Subangstrom Noise Level Using an Integrated Piezoresistive Silicon Nanowire," IEEE/ASME Journal of Microelectromechanical Systems, vol. 22 no. 3, pp. 716-722, June 2013.

Allan, Keri, "system failure," Engineering and Technology, vol. 3 no. 20, pp. 66-67, Nov. 22-Dec. 5, 2008.

Allan, W. J., and Webb, W. W., "Some observations on mechanisms of growth of metal whiskers," Acta Metallurgica, vol. 7 no. 9, pp. 646-648, Sept. 1959.

Allder, Brian, "Lead Free Soldering," SMART Group Ireland Lead-free Seminar, Dublin, Ireland, Oct. 22, 2003.

Allen, Aileen, Henshall, Gregory, Troxel, Kris, Miremadi, Jian, Benedetto, Elizabeth, Holder, Helen, and Roesch, Michael, "Acceptance Testing of BGA Ball Alloys," 2010 Proceedings 60th Electronic Components and Technology Conference , Las Vegas, NV, June 1-4, 2010, pp. 182-187.

Allen, Joseph G., McClean, Michael D., Stapleton, Heather M., and Webster, Thomas F., "Linking PBDEs in House Dust to Consumer Products using X-ray Fluorescence," Environmental Science & Technology, vol. 42 no. 11, pp. 4222-4228, 2008.

Allen, Marybeth, "Honey, I Shrunk the Process Window," Advanced Packaging, vol. 15 no. 2, pp. 12, Feb. 2006.

Allen, Sarah L., Notis, Michael R., Chromik, Richard R., and Vinci, Richard P., "Coarsening in tin-silver-copper lead-free solder alloys," Lehigh University.

Allen, Sarah L., Notis, Michael R., Chromik, Richard R., and Vinci, Richard P., "Microstructural evolution in lead-free solder alloys: Part I. Cast Sn-Ag-Cu eutectic," Journal of Materials Research, vol. 19 no. 5, pp. 1417-1424, May 2004.

Allen, Sarah L., Notis, Michael R., Chromik, Richard R., Vinci, Richard P., Lewis, Daniel J., and Schaefer, Robert, "Microstructural evolution in lead-free solder alloys: Part II. Directionally solidified Sn-Ag-Cu, Sn-Cu and Sn-Ag," Journal of Materials Research , vol. 19 no. 5, pp. 1425-1431, May 2004.

Allen, Woody, Heimann, Nancy, and Soucie, Wayne, "Replacing Chromates," Proceedings 2004 AESF/EPA Conference for Environmental & Process Excellence, Orlando, FL, Jan. 26-29, 2004, pp. 99-106.

Allenby, B. R., Ciccarclli, J. P., Artaki, I., Fisher, J. R., Schoenthaler, D., Carroll, T. A., Dahringer, D. W., Degani, Y., Freund, R. S., Graedel, T. E., Lyons, A. M., Plewes, J. T., Gherman, C., Solomon, H., Melton, C., Munie, G. C., and Socolowski, N., "An Assessment of the Use of Lead in Electronic Assembly," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume I, San Jose, CA, Sept. 1-3, 1992, pp. 1-28.

Allison, Martin, "Lead-Free Soldering Status In Japan and Main Europe 2003," SMART Group 6th Annual Lead-Free Seminar and Table-top Exhibition, High Wycombe, United Kingdom, Feb. 3, 2004.

Allison, Martin, "Senju Metal Industry," SMART Group Pin In Hole Odd Form Assembly and Soldering Workshop, Bracknell, United Kingdom, Sept. 24, 2002.

Almasi-Kashi, M., Ramazani, A., Kheyri, F., and Jafari-Khamse, E., "The effect of magnetic layer thickness on magnetic properties of Fe/Cu multilayer nanowires," Materials Chemistry and Physics, vol. 144 no. 3, pp. 230-234, Apr. 15, 2014.

Almeida, C. M. V. B., Madureira, M. A., Bonilla, S. H., and Giannetti, B. F., "Assessing the replacement of lead in solders: effects on resource use and human health," Journal of Cleaner Production, vol. 47, pp. 457-464, May 2013.

Almeida, E., "Surface Treatments and Coatings for Metals. A General Overview. 1. Surface Treatments, Surface Preparation, and the Nature of Coatings," Industrial Engineering Chemical Research, vol. 40 no. 1, pp. 3-14, 2001.

Al-Momani, Emad, Khasawneh, Mohammed T., and Sammakia, Bahgat, "A Closed-Form Norris-Landzberg Solder Reliability Model," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 530-535.

Al-Momani, Emad S., Borgesen, Peter, Khasawneh, Mohammad, Sammakia, Bahgat, Alqudah, Rajaa, and Meilunas, Michael, "A Tool for Predicting Reliability of Lead-Free Soldered Electronic Packages under Thermal Cycling Conditions," International Conference on Soldering & Reliability 2010 Proceedings, Toronto, Ontario, Canada, May 17-20, 2010, pp. xx-xx.

Al-Momani, Emad S., Khasawneh, Mohammad T., and Sammakia, Bahgat, "An Approach for Assessing the Long-Term Reliability of Lead-Free Electronics Under In-Field Conditions," IEEE Transactions on Device and Materials Reliability, vol. 16 no. 4, pp. 532-540, Dec. 2016.

Al-Mufti, A. Wesam, Hashim, U., and Adam, Tijjani, "Effect of electric potential into conductance silicon nanowire distribution," Microsystem Technologies, vol. 21 no. 3, pp. 693-697, Mar. 2015.

Alonso, Juan C., Dose, Julia, Fleischer, Gunter, Geraghty, Kate, Greif, Andre, Rodrigo, Julio, and Schmidt, Wulf-Peter, "Electrical and Electronic Components in the Automotive Sector: Economic and Environmental Assessment," International Journal of Life Cycle Assessment, vol. 12 no. 5, pp. 328-335, July 2007.

Alonzo, Juan Carlos, and Cubero, Jose Antonio, "Use of Pb-Free Solder Alloys in Electrical & Electronic Devices for the Automotive Industry." IPC and Soldertec Global Conference on Lead Free Electronics, Brussels, Belgium, June 11-12, 2003, pp. xx-xx.

Alpern, P., Lee, K. C., and Tilgner, R., "Effect of long and short Pb-free soldering profiles of IPC/JEDEC J-STD-020 on plastic SMD packages," Microelectronics Reliability, vol. 44, no. 9-11, pp. 1293-1297, Sept.-Nov. 2004.

Alpern, Peter, and Lee, Kheng Chooi, "Moisture-Induced Delamination in Plastic Encapsulated Microelectronic Devices: A Physics of Failure Approach," IEEE Transactions on Device and Materials Reliability, vol. 8 no. 3, pp. 478-483, Sept. 2008.

Al-Salman, Rihab, Sommer, Heino, Brezesinski, Torsten, and Janek, Jurgen, "Template-Free Electrochemical Synthesis of High Aspect Ratio Sn Nanowires in Ionic Liquids: A General Route to Large-Area Metal and Semimetal Nanowire Arrays?," Chemistry of Materials, vol. 27 no. 11, pp. 3830-3837, June 9, 2015.

Alsharif, Nouf A., Martinez-Banderas, Aldo I., Merzaban, Jasmeen, Ravasi, Timothy, and Kosel, Jurgen, "Biofunctionalizing Magnetic Nanowires Toward Targeting and Killing Leukemia Cancer Cells," IEEE Transactions on Magnetics, vol. 55 no. 2 part 1, pp. 5400105, Feb. 2019.

Alston, Sue M., Clark, Allan D., Arnold, J. Cris, and Stein, Bridget K., "Environmental Impact of Pyrolysis of Mixed WEEE Plastics Part 1: Experimental Pyrolysis Data," Environmental Science & Technology, vol. 45 no. 21, pp. 9380-9385, Nov. 1, 2011.

Alston, Sue M., and Arnold, J. Cris, "Environmental Impact of Pyrolysis of Mixed WEEE Plastics Part 2: Life Cycle Assessment," Environmental Science & Technology, vol. 45 no. 21, pp. 9386-9392, Nov. 1, 2011.

Al-Taay, H. F., Mahdi, M. A., Parlevliet, D., and Jennings, P., "Controlling the diameter of silicon nanowires grown using a tin catalyst," Materials Science in Semiconductor Processing, vol. 16 no. 1, pp. 15-22, Feb. 2013.

Altay, M. Cumbul, and Eroglu, S., "Chemical vapor deposition of Ge nanowires from readily available GeO2 and CH4 precursors," Journal of Crystal Growth, vol. 551, pp. 125886-1-125886-5, Dec. 2020. https://doi.org/10.1016/j.jcrysgro.2020.125886

Altay, M. Cumbul, and Eroglu, S., "Growth of Ge Nanowires by Chemical Vapor Deposition at Atmospheric Pressure Using Readily Available Precursors GeO2 and C2H5OH," JOM, vol. 72 no. 12, pp. 4340-4345, Dec. 2020. https://doi-org.ezproxy.uky.edu/10.1007/s11837-020-04401-3

Altmayer, Frank, "4 Questions (On Platers' Minds)."

Altmayer, Frank, "A visit from old man "whiskers"," Plating &Surface Finishing , vol. 90 no. 2, pp. 16-17, Feb. 2003.

Altmayer, Frank, "Colombo, Part 1," Plating & Surface Finishing, vol. 86 no. 3, pp. 58-60, Mar. 1999.

Altmayer, Frank, "Comparing Substitutes for Cr and CU, to Prevent Pollution," Plating & Surface Finishing, vol. 80 no. 2, pp. 40, 42-43, Feb. 1993.

Altmayer, Frank, "Comparing Substitutes for Cr and CU, to Prevent Pollution, Part Two" Plating & Surface Finishing, vol. 80 no. 3, pp. 32-35, 37, Mar. 1993.

Altmayer, Frank, "Complying with Cadmium Standards," Plating & Surface Finishing , vol. 80 no. 4, pp. 60-61, Apr. 1993.

Altmayer, Frank, "ELV, WEE, RoHS and Hex-Chrome Testing," Products Finishing, vol. 70 no. 11, pp. 58-61, Aug. 2006.

Altmayer, Frank, "From the Mailbox: Fastener Questions," Plating & Surface Finishing , vol. 78 no. 12, pp. 35-36, Dec. 1991.

Altmayer, Frank, "Hexavalent Chromium Headaches," Plating and Surface Finishing, vol. 92 no. 3, pp. 30-31, Mar. 2005.

Altmayer, Frank, "Is Cadmium Finished?," Plating & Surface Finishing, vol. 94 no. 2, pp. 16-18, Feb. 2007.

Altmayer, Frank, "Is Cadmium Finished? (Continued)," Plating & Surface Finishing , vol. 94 no. 3, pp. 22-23, 26, Mar. 2007.

Altmayer, Frank, "Mail Call," Plating & Surface Finishing, vol. 92 no. 10, pp. 30-31, Oct. 2005.

Altmayer, Frank, "More RoHS/ELV/WEEE Confusion," Plating & Surface Finishing, vol. 93 no. 5, pp. 24, 28, May. 2006.

Altmayer, Frank, "Test Finished Parts for Hex Chrome," Plating & Surface Finishing , vol. 91 no. 12, pp. 20, 23, Dec. 2004.

Altmayer, Frank, "The Hunt for Quicksilver," Plating & Surface Finishing, vol. 80 no. 1, pp. 35-37, Jan. 1993.

Altmayer, Frank, "Tin Basics," Plating and Surface Finishing, vol. 92 no. 5, pp. 36-37, May 2005.

Altmayer, Frank, ""Verboten"," Plating and Surface Finishing, vol. 92 no. 9, pp. 20-21, Sept. 2005.

Altmayer, Frank, "WEEE + RoHS + ELV = Co + N + F + U + S + I + O + N," Plating & Surface Finishing, vol. 92 no. 2, pp. 12-13, Feb. 2006.

Altmayer, Frank, "What Causes Macro-Cracks In Chromium Deposits," Plating & Surface Finishing, vol. 89 no. 12, pp. 40, Dec. 2002.

Altmayer, Frank, "What is RoHS?," Plating & Surface Finishing, vol. 91 no. 10, pp. 30-34, Oct. 2004.

Alvarado, Rey, Keser, Beth, Zhou, Eric, Schwarz, Mark, Bezuk, Steve, Wang, Henry, and Heng, Kok-Lin, "Study of New Alloy Composition for Solder Balls - Identifying Material Properties as Key Leading Indicators Toward Improved Board Level Performance," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1753-1757.

Alvarez, Samuel, Ye, Shengrong, Flowers, Patrick F., and Wiley, Benjamin J., "Photocatalytic Growth of Copper Nanowires from Cu2O Seeds," Chemistry of Materials, vol. 27 no. 2, pp. 570-573, Jan. 27, 2015.

Alvarez-Caicoya, Jaime, Cosme-Torres, Antonio J., and Ortiz-Rivera, Eduardo I., "Compact Fluorescent Lamps, an Anticipatory Mind to Mercury," IEEE Potentials, vol. 30 no. 1, pp. 35-38, Jan./Feb. 2011.

Al-Yafawi, Abdullah, Patil, Saket, Yu, Da, Park, Seungbae, Pitarresi, James, and Goo, Namseo, "Random Vibration Test for Electronic Assemblies Fatigue Life Estimation," 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June 2-5, 2010, pp. xx-xx.

Al-Yafawi, Abdullah, Yu, Da, Park, Seungbae, Pitarresi, James, and Chung, Soonwan, "Reliability Assessment of Electronic Components under Random Vibration Loading," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 431-436.

Amagai, Masazumi, "A study of nanoparticles in Sn-Ag based lead free solders," Microelectronics Reliability, vol. 48 no. 1, pp. 1-16, Jan. 2008.

Amagai, Masazumi, "A Study of Nano Particles in SnAg-Based Lead Free Solders for Intermetallic Compounds and Drop Test Performance" Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1170-1190.

Amagai, Masazumi, "A study of nanoparticles in Sn-Ag based lead free solders," Microelectronics Reliability, vol. 48 no. 1, pp. 1-16, Jan. 2008.

Amagai, Masazumi, Toyoda, Yoshitaka, Ohnishi, Tsukasa, and Akita, Satoru, "High Drop Test Reliability: Lead-free Solders," 54th Electronic Components & Technology Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1304-1309.

Amagai, Masazumi, Toyoda, Yoshitaka, and Tajima, Takeshi, "High Solder Joint Reliability with Lead Free Solders," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 317-322.

Amagai, Masazumi, Watanabe, Masako, Omiya, Masaki, Kishimoto, Kikuo, and Shibuya, Toshikazu, "Mechanical characterization of Sn-Ag-based lead-free solders," Microelectronics Reliability, vol. 42 no. 6, pp. 951-966, June 2002.

Amagai, Masazumi, Suzuki, Yutaka, Abe, Kenji, Kim, YoungBae, and Sano, Hitoyuki, "Package-On-Package Mechanical Reliability Characterization," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 557-570.

Amalu, E. H., Lau, W. K., Ekere, N. N., Bhatti, R. S., Mallik, S., Otiaba, K. C., and Takyi, G., "A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits," Microelectronic Engineering, vol. 88 no. 7, pp. 1610-1617, July 2011.

Amalu, Emeka H., and Ekere, N. N., "Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling," Computational Materials Science , vol. 65, pp. 470-484, Dec. 2012.

Amalu, Emeka H., and Ekere, Ndy N., "High temperature reliability of lead-free solder joints in a flip chip assembly," Journal of Materials Processing Technology, vol. 212 no. 2, pp. 471-483, Feb. 2012.

Amalu, Emeka H., and Ekere, Ndy N., "Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations," Microelectronics Reliability, vol. xx no. x, pp. xx-xx, xxxx.

Amami, Kazukoshi, Yuhaku, Satoru, Shiraishi, Tukasa, Itagaki, Minehiro, Bessho, Yoshihiro, Eda, Kazuo, and Ishida, Toru, "Stud-bump Bonding Technique onto an Advanced Organic Substrate for MCM-Ls," 1st 1997 IEMT/IMC Symposium, Tokyo, Japan, Apr. 16-18, 1997, pp. 164-168.

Amarasekera, Jay, Liu, Bo, Cartier, Herve, and Chopin, Alexis, "Halogen-Free Flame Retardant High Temperature Materials for Lead-Free Soldering Applications," 2006 Medical Electronics Symposium Conference Proceedings, Minneapolis, MN, May 15-17, 2006, pp. xx-xx.

Amato, Ivan, "Tin Whiskers: The Next Y2K Problem?," Fortune, vol. xx no. xx, pp. xx-xx, Dec. 29, 2004.

Ameen, Sadia, Park, Doo-Ri, and Shin, Hyung Shik, "Silicon nanowires arrays for visible light driven photocatalytic degradation of rose bengal dye," Journal of Materials Science: Materials in Electronics, vol. 27 no. 10, pp. 10460-10467, Oct. 2016.

Ameer, M. A., Ghoneim, A. A., and Fekry, A. M., "The electrochemical behavior of Sn-Ag binary alloys in sulfate solutions," Materials and Corrosion, vol. 61 no. 7, pp. 580-589, July 2010.

Amelinckx, S., Bontinck, W., Dekeyser, W., and Seitz, F., "On the Formation and Properties of Helical Dislocations," The Philosophical Magazine, series 8 vol. 2 no. 15, pp. 355-378, Mar. 1957.

Amey, Earle B., "Gold," Minerals Yearbook: Volume I. -- Metals and Minerals, 2003.

Amin, N. L. M., Yusof, S. Z., Kahar, M. N. A., Bakar, T. A. A., O, A., and Fadil, N. A., "Tin Whiskers Formation and Growth on Immersion Sn Surface Finish under External Stresses by Bending," Materials Science and Engineering, vol. 238, pp. 012001-1-012001-5, 2017.

Amin, Nur Aishah Aminah Mohd, Shnawah, Dhafer Abdulameer, Said, Suhana Mohd, Sabri, Mohd Faizul Mohd, and Arof, Hamzah, "Effect of Ag content and the minor alloying element Fe on the electrical resistivity of Sn-Ag-Cu solder alloy," Journal of Alloys and Compounds , vol. 599, pp. 114-120, June 25, 2014.

Amir, Dudi, Walwadkar, Satyajit, Aravamudhan, Srinivasa, May, Lilia, and Tang, Kok Kwan, "Causes, Characterization and Mitigation of Non Wet Open Defects for Area Array Components," South East Asia Technical Training Conference on Electronics Assembly Technologies 2013 Proceedings, Penang, Malaysia, Apr. 17-19, 2013, pp. xx-xx.

Amir, Dudi, Aspandiar, Raiyo, Buttars, Scott, Chin, Wei Wei, and Gill, Paramjeet, "Head - and - Pillow SMT Failure Modes," SMTA International Conference , San Diego, CA, Oct. 4-8, 2009, pp. 409-421.

Amir, Dudi, "Head-and-Pillow SMT Failure Modes (Tutorial 20)," SMTA International 2011 Conference, Fort Worth, TX, Oct. 16-20, 2011.

Amistoso, Jose Omar S., and Amorsolo Jr., Alberto V., "Study of Thermal Aging Effects on Intermetallic Growth Mechanisms and Shear Strength Behavior of Wafer-Level Solder Bumps," IEEE Transactions on Components and Packaging Technologies, vol. 32 no. 2, pp. 405-414, June 2009.

Amistoso, Jose Omar S., and Amorsolo Jr., Alberto V., "The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105 Solder Bumps," Journal of Electronic Packaging, vol. 131 no. 4, pp. 041004-1-041004-6, Dec. 2009.

Amla, Tarun, "Conductive Anodic Filament Growth Failure," IPC Printed Circuits Expo 2002, pp. S08-2-1 to S08-2-6.

Amla, Tarun, "Conductive Anodic Filament Growth Failure," Printed Circuit Fabrication , vol. 25 no. 7, pp. 40-43, July 2002.

Ammons, Jane C., Assavapokee, Tiravat, Newton, David, and Realff, Matthew J., "Reverse production system design for recycling under uncertainty," Environmentally Conscious Manufacturing II (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4569), Newton, USA, Oct. 28-29, 2001, pp. 1-12.

Amoli, Behnam Meschi, Trinidad, Josh, Hu, Anming, Zhou, Y. Norman, and Zhao, Boxin, "Highly electrically conductive adhesives using silver nanoparticle (Ag NP)-decorated graphene: the effect of NPs sintering on the electrical conductivity improvement," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Amoli, Behnam Meschi, Hu, Anming, Zhou, Norman Y., and Zhao, Boxin, "Recent progresses on hybrid micro-nano filler systems for electrically conductive adhesives (ECAs) applications," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Amoli, Behnam Meschi, Trinidad, Josh, Zhou, Norman Y., Zhao, Boxin, Chen, Alex, Persic, John, and Lyn, Robert, "The Use of Graphene to Replace Silver in Electricaly Conductive Adhesives - An Study on Electrical Conductivity and Mechanical Properties," International Conference on Soldering & Reliability 2015 Proceedings , Toronto, Ontario, Canada, May 19-21, 2015, pp. xx-xx.

Amore, S., Delsante, S., Parodi, N., and Borzone, G., "Calorimetric Investigation of the Cu-Sn-Bi Lead-Free Solder System," Journal of Thermal Analysis and Calorimetry, vol. 92 no. 1, pp. 227-232, Apr. 2008.

Amore, S., Delsante, S., Parodi, N., and Borzone, G., "Thermochemistry of Pd-In, Pd-Sn and Pd-Zn alloy systems," Thermochimica Acta, vol. 481 no. 1-2, pp. 1-6, Jan. 5, 2009.

Amore, S., Ricci, E., Borzone, G., and Novakovic, R., "Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates," Materials Science and Engineering: A, vol. 495 no. 1-2, pp. 108-112, Nov. 15, 2008.

Amore, Stefano, Ricci, Enrica, Lanata, Tiziana, and Novakovic, Rada, "Surface tension and wetting behaviour of molten Cu-Sn alloys," Journal of Alloys and Compounds, vol. 452 no. 1, pp. 161-166, Mar. 6, 2008.

Amorosi, Drew, "Court of Appeals Upholds OSHA's Hex-Chrome PEL," Metal Finishing , vol. 107 no. 5, pp. 16-17, May 2009.

Amram, Dor, Kovalenko, Oleg, Klinger, Leonid, and Rabkin, Eugen, "Capillary-driven growth of metallic nanowires," Scripta Materialia , vol. 109, pp. 44-47, Dec. 2015.

An, Bing, and Wu, Chi-man Lawrence, "Evaluation of Wettability of Composite Solder Alloy Reinforced with Silver and Copper Particles," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

An, Bing, Cai, Xiong-hui, Chu, Hua-bin, Lai, Xiao-wei, Wu, Feng-Shun, and Wu, Yi-ping, "Flex Reliability of RFID Inlays Assembled by Anisotropic Conductive Adhesive," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

An, Bing, Wu, Yiping, Cai, Xionghui, and Wu, Fengshun, "Reliability of RFID Tag Inlay Assembled by Anisotropic Conductive Adhesive," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 1203-1207.

An, Bing, Gu, Guoqiang, Zhang, Wenfei, and Wu, Yiping, "Shear Creep Behavior of Sn-3Ag-0.5Cu Solder Bumps in Ball Grid Array," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 257-261.

An, Chengqiang, Liu, Chunming, Wang, Hao, and Zhang, Shudi, "Research On The Corrosion Resistance Of Tinplate With Reflowing Technology," Advanced Materials Research, vol. 989-994, pp. 208-211, July 2014.

An, Lili, Ma, Haitao, Qu, Lin, Wang, Jie, Liu, Jiahui, and Huang, Mingliang, "The Effect of Laser-soldering Parameters on the Sn-Ag-Cu/Cu Interfacial Reaction," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 264-267.

An, M., Zhang, Y., Zhang, J., Yang, Z., and Tu, Z., "Mechanism of Additives in Electroplating of Zn-Zn Alloy," Plating & Surface Finishing, vol. 86 no. 5, pp. 130-132, May 1999.

An, Qi, Wang, Chunqing, Zhao, Xiangxi, and Wang, Hong, "The Mechanism Study of Low-Temperature Brittle Fracture of Bulk Sn-Based Solder," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1233-1237.

An, R., Wang, C. Q., and Tian, Y. H., "Elastic Property of Cu3Sn Determined by a First-Principles Calculation on the Basis of its Crystal Substructure," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

An, Rong, Wang, Chunqing, and Tian, Yanhong, "Depiction of the Elastic Anisotropy of AuSn4 and AuSn2 from First-principles Calculations," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 611-616.

An, Rong, Wang, Chunqing, and Tian, Yanhong, "Determination of the Elastic Properties of Au5Sn and AuSn from Ab Initio Calculations," Journal of Electronic Materials, vol. 37 no. 7, pp. 968-974, July 2008.

An, Rong, Wang, Chunqing, Tian, Yanhong, and Wu, Huaping, "Determination of the Elastic Properties of Cu3Sn Through First-Principles Calculations," Journal of Electronic Materials, vol. 37 no. 4, pp. 477-482, Apr. 2008.

An, Rong, Tian, Yanhong, Zhang, Rui, and Wang, Chunqing, "Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints," Journal of Materials Science: Materials in Electronics, vol. 26 no. 5, pp. 2674-2681, May 2015.

An, Rong, Wang, Chunqing, and Tian, Yanhong, "First-Principles Study on the Elastic Anisotropy of Au-Sn Intermetallic Compounds," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

An, Rong, Ma, Huiwen, Li, Hailong, Zheng, Zhen, and Wang, Chunqing, "Formation of single phase Cu-Sn IMCs via layer-by-layer electroplating of Cu and Sn metals," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 980-984.

An, Tong, and Qin, Fei, "A Simplified Computational Model for Solder Joints under Drop Impact Loadings," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 209-214.

An, Tong, Qin, Fei, and Xia, Guofeng, "Analytical Solutions and a Numerical Approach for Diffusion-Induced Stresses in Intermetallic Compound Layers of Solder Joints," Journal of Electronic Packaging, vol. 136 no. 1, pp. 011001-1-0110018, Mar. 2014.

An, Tong, and Qin, Fei, "Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading," Journal of Electronic Packaging, vol. 133 no. 3, pp. 031004-1-031004-7, Sept. 2011.

An, Tong, and Qin, Fei, "Effects of PCB Dynamic Responses on Solder Joint Stress," International Conference on Electronic Packaging Technology & High Density Packaging , Beijing, China, Aug. 10-13, 2009, pp. 370-373.

An, Tong, and Qin, Fei, "Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates," Microelectronics Reliability, vol. 54 no. 5, pp. 932-938, May 2014.

An, Tong, and Qin, Fei, "Fracture Simulation of Solder Joint Interface by Cohesive Zone Model," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 260-266.

An, Tong, Qin, Fei, and Li, Jiangang, "Influence of Strain Rate Effect on Behavior of Solder Joints under Drop Impact Loadings," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 375-378.

An, Tong, and Qin, Fei, "Intergranular cracking simulation of the intermetallic compound layer in solder joints," Computational Materials Science, vol. 79, pp. 1-14, Nov. 2013.

An, Tong, Qin, Fei, and Li, Jiangang, "Mechanical behavior of solder joints under dynamic four-point impact bending," Microelectronics Reliability, vol. 51 no. 5, pp. 1011-1019, May 2011.

An, Tong, and Qin, Fei, "Numerical simulation of the intermetallic compound cracking in solder joint," 2014 15th International Conference on Electronic Packaging Technology , Chengdu, China, Aug. 12-15, 2014, pp. 693-697.

An, Tong, and Qin, Fei, "Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints," Journal of Electronic Packaging , vol. 138 no. 1, pp. 011002-1-011002-10, Mar. 2016.

Anand, Ashok, and Mui, Y. C., "Lead-free Solder Evaluation For Ball Attache Process," Proceedings of 4th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2002, pp. 6-10.

Anandakumar, S., Rani, V. Sudha, Rao, B. Parvatheeswara, Yoon, Seok Soo, Jeong, J.-R., and Kim, CheolGi, "Template Synthesis of Cobalt Nanowires Using PS-b-PMMA Block Copolymer," IEEE Transactions on Magnetics, vol. 45 no. 10, pp. 4063-4066, Oct. 2009.

Anasyida, A. S., Nurulakmal, M. S., Yusoff, M., and Teh, C. L., "Microstructural study of Sn-3.0Ag0.5Cu alloy on Cu/NiP-coated substrate by addition of Fe, Sb and Ce," Advanced Materials Research, vol. 858, pp. 116-121, Nov. 2013.

Anaya, Francisco, "Wave Solder Thermal Profiling," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 2, pp. 46-47, Feb. 2010.

Anbe, Yoshinobu, "Why do solder spikes form?," Global SMT & Packaging, vol. 6 no. 4, pp. 34, 36, 38, Apr. 2006.

Anderson, A. F., "Re the Tanya Spotts EDR results," Mar. 2012.

Anderson, A. F., "Review of VRTC MEMORANDUM REPORT EA-07-010 VRTC-DCD-7113," Oct. 11, 2009.

Anderson, Antony F., "Case Study: NHTSA's Denial of Dr Raghavan's Petition to Investigate Sudden Acceleration in Toyota Vehicles Fitted With Electronic Throttles," IEEE Access, Apr. 21, 2016.

Anderson, Antony, "Comments on NHTSA 2014-0108: Intermittent Electronic/ Software Malfunctions - Learning from Failures," Dec. 2, 2014.

Anderson, Antony F., "Intermittent Electrical Contact Resistance as a Contributory Factor in the Loss of Automobile Speed Control Functional Integrity," IEEE Access, Apr. 9, 2014.

Anderson, Antony, "Sudden Acceleration/Surge Incident Brandon Street, Wellington NZ," May 9, 2012.

Anderson, Antony, Kir, Brian, and Armstrong, Keith, "The Poor Quality of Functional Safety Engineering in the Automobile Industry," Inside Functional Safety, pp. xx-xx, 2010.

Anderson, Antony, Kir, Brian, and Armstrong, Keith, "The Poor Quality of Functional Safety Engineering in the Automobile Industry."

Anderson, Antony, Kirk, Brian, Armstrong, Keith, "The Present Limitations of Motor Vehicle Electronic Data Recording," Dec. 11, 2010.

Anderson, A. F., "Provisional notes on the CTS electronic accelerator pedals as used in some Toyota vehicles," Dec. 15, 2012.

Anderson, I. E., Foley, J. C., Cook, B. A., Harringa, J., Terpstra, R. L., and Unal, O., "Alloying Effects in Near-Eutectic Sn-Ag-Cu Solder Alloys for Improved Microstructural Stability," Journal of Electronic Materials, vol. 30 no. 9, pp. 1050-1059, Sept. 2001.

Anderson, I. E., and Harringa, J. L., "Elevated Temperature Aging of Solder Joints Based on Sn-Ag-Cu: Effects on Joint Microstructure and Shear Strength," Journal of Electronic Materials, vol. 33 no. 12, pp. 1485-1496, Dec. 2004.

Anderson, I. E., Cook, B. A., Harringa, J., and Terpstra, R. L., "Microstructural Modifications and Properties of Sn-Ag-Cu Solder Joints Induced by Alloying," Journal of Electronic Materials, vol. 31 no. 11, pp. 1166-1174, Nov. 2002.

Anderson, I. E., Walleser, J., and Harringa, J. L., "Observations of Nucleation Catalysis Effects during Solidification of SnAgCuX Solder Joints," JOM, vol. 59 no. 7, pp. 38-43, July 2007.

Anderson, I. E., Cook, B. A., Harringa, J. L. and Terpstra, R. L. "Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and Properties," JOM, vol. 54 no. 6, pp. 26-29, June 2002.

Anderson, I. E., and Harringa, J. L., "Suppression of Void Coalescence in Thermal Aging of Tin-Silver-Copper-X Solder Joints," Journal of Electronic Materials, vol. 35 no. 1, pp. 94-106, Jan. 2006.

Anderson, Iver E., Boesenberg, Adam, Harringa, Joel, Riegner, David, Steinmetz, Andrew, and Hillman, David, "Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints," Journal of Electronic Materials, vol. 41 no. 2, pp. 390-397, Feb. 2012.

Anderson, Iver E., Bloomer, Tamara E., Foley, James C., and Terpstra, Robert L., "Development of Eutectic and Near-eutectic Sn-Ag-Cu Solder Alloys for Lead-Free Electronic Assemblies," IPC Works '99, Minneapolis, MN, Oct. 23-28, 1999, pp. xx-xx.

Anderson, Iver E., "Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications," Journal of Materials Science: Materials in Electronics , vol. 18 no. 1-3, pp. 55-76, Mar. 2007.

Anderson, Iver E., Cook, Bruce A., Harringa, Joel, Terpstra, Robert L., Foley, James C., and Unal, Ozer, "Effects of Alloying in Near-Eutectic Tin-Silver-Copper Solder Joints," Materials Transactions, vol. 43 no. 8, pp. 1827-1832, Aug. 2002.

Anderson, Iver E., Kirkland, Kenneth, and Willenberg, Wayne, "Implementing Pb-free Soldering," Surface Mount Technology (SMT), vol. 14 no. 11, pp. 78-81, Nov. 2000.

Anderson, Iver E., Walleser, Jason W., Harringa, Joel L., Laabs, Fran, and Kracher, Alfred, "Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design," Journal of Electronic Materials, vol. 38 no. 12, pp. 2770-2779, Dec. 2009.

Anderson, Iver E., Choquette, Stephanie, Reeve, Kathlene (Thomas), and Handwerker, Carol, "Pb-Free Solders and Other Joining Materials for Potential Replacement of High-Pb Hierarchical Solders," Pan Pacific Symposium 2018 Proceedings , Kamuela, HI, Feb. 5-8, 2018, pp. xx-xx.

Anderson, Iver E., "Tin-Silver-Copper: A Lead Free Solder for Broad Applications," Proceedings of the Technical Program NEPCON West '96, Volume 2, Anaheim, CA, Feb. 25-29, 1996, pp. 882-887.

Anderson, Iver E., "Tin-Silver-Copper: A Lead Free Solder for Capacitor Interconnects," 1996 Proceedings 16th Capacitor and Resistor Technology Symposium, New Orleans, LA, Mar. 11-15, 1996, pp. 63-65.

Anderson, Lynda L., and Mahoney Jr., Robert, "Converting Cable Assembly Manufacturing to Lead Free Solder," International Conference on Soldering & Reliability 2013 Proceedings , Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.

Anderson, Mark, "What an E-Waste," IEEE Spectrum, vol. 47 no. 9, pp. 72, Sept. 2010.

Anderson, R., Chilukuri, R., Tee, T. Y., Koo, C. P., Ng, H. S., Rogers, B., and Syed, A., "Advances in WLCSP technologies for growing market needs," Global SMT and Packaging, vol. 10 no. 3, pp. 26-28,30,32, Mar, 2010.

Anderson, R., Chilukuri, R., Tee, T. Y., Koo, C. P., Ng, H. S., Rogers, B., and Syed, A., "Advances in WLCSP Technologies for Growing Market Needs," Wafer & Device Packaging and Interconnect, vol. 1 no. 5, pp. 14-18, June/July 2010.

Anderson, Rex, Tee, Tong Yan, Tan, Long Bin, Ng, Hun Shen, Low, Jim Hee, Khoo, Choong Peng, Moody, Robert, and Rogers, Boyd, "Integrated Testing, Modeling and Failure Analysis of CSPnl for Enhanced Board Level Reliability," SMTA International Wafer-Level Packaging Conference , San Jose, CA, Oct. 13-16, 2008, pp. xx-xx.

Anderson, Rex, Tee, Tong Yan, and Tan, Long Bin, "Integrated testing, modeling and failure analysis of CSPnl for board level reliability," Global SMT and Packaging, vol. 10 no. 6, pp. 16-18,20,22-23, June 2010.

Anderson, Richard A., "Reviewing RoHS Compliance For Harsh Environments," Microwaves & RF, vol. 46 no. 2, pp. 66, 68, 70, 72, 74, 76, 79-80, 82, 84, Feb. 2007.

Anderson, Richard A., Paquette, Stan, and Wilkish, George, "TCP replaces hexavalent chromium coatings in enclosures," Green SupplyLine, Apr. 7, 2006.

Anderson, Steve, "An Expert Looks at the IssuesTM," Chip Scale Review, vol. xx no. xx, pp. xx-xx, July-Aug. 2000.

Anderson, Thomas A., "Get the lead out," Green SupplyLine, July 25, 2005.

Anderson, Thomas, "Getting the lead out," EE Times - Asia, vol. xx no. xx, pp. xx-xx, Nov. 1, 2005.

Anderson, Vance, "DoD Efforts to Address RoHS and WEEE Lead-Free Impacts," 9th Joint FAA/DoD/NASA Aging Aircraft Conference, Atlanta, GA, Mar. 6-9, 2006.

Anderson, Vance, "Lead-Free Impacts on DoD Microelectronics," DoD Diminishing Manufacturing Sources & Material Shortages (DMSMS) Workshop, San Antonio, TX, Dec. 13-15, 2005, pp. xx-xx.

Anderson, Vance, "Restriction of Hazardous Substances (RoHS) Panel," DoD Diminishing Manufacturing Sources and Material Shortages Conference, Charlotte, NC, July 11. 2006, pp. xx-xx.

Andersson, C., Liu, L., and Liu, J., "Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 152-160.

Andersson, C., Lai, Z., Liu, J., Jiang, H., and Yu, Y., "Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders," Materials Science and Engineering A, vol. 394 no. 1-2, pp. 20-27, Mar. 15, 2005.

Andersson, C., and Liu, J., "Effect of corrosion on the low cycle fatigue behavior of Sn-4.0Ag-0.5Cu lead-free solder joints," International Journal of Fatigue, vol. 30 no. 5, pp. 917-930, May 2008. https://doi.org/10.1016/j.ijfatigue.2007.06.009

Andersson, C., Andersson, D. R., Tegehall, P. E., and Liu, J., "Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints," Microelectronics Reliability, vol. 47 no. 2-3, pp. 266-272, Feb.-Mar. 2007.

Andersson, C., and Liu, J., "Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free Solder Joints in Different Corrosive Environmental Conditions," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 457-467.

Andersson, C., Vandevelde, B., Noritake, C., Sun, P., Tegehall, P. E., Andersson, D. R., Wetter, G., and Liu, J., "Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages," Soldering & Surface Mount Technology, vol. 21 no. 2, pp. 28-38, 2009.

Andersson, Cristina, Lai, Zonghe, Liu, Johan, Jiang, Hairong, and Yu, Yongning, "Comparison Of Isothermal Mechanical Fatigue Properties Of Lead-Free Solder Joints And Bulk Solders," Fifth International Conference on Electronic Packaging Technology Proceedings, Shanghai, China, Oct. 28-30, 2003, pp. 371-376.

Andersson, Cristina, Andersson, Dag R., Tegehall, Per-Erik, Andersson, Jan, and Liu, Johan, "Correlation Between Thermomechanical Reliability of BGAs and Manufacturing Process Parameters," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Andersson, Cristina, Andersson, Dag R., Tegehall, Per-Erik, and Liu, Johan, "Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of lead free solder joints of different electronic components," Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems , Brussels, Belgium, May 9-12, 2004, pp. 455-464.

Andersson, Christina, Sun, Peng, and Liu, Johan, "Low Cycle Fatigue of Sn-based Lead-free Solder Joints and the Analysis of Fatigue Life Prediction Uncertainty," Proceedings of the 2006 IEEE CPMT Conference on High Density Microsystem Design, Packaging and Component Failure Analysis, Shanghai, June 27-28, 2006, pp. 272-279.

Andersson, K., Salmela, O., Perttula, A., Sarkka, J., and Tammenmaa, M., "Measurement of acceleration factor for lead-free solder (SnAg3.8Cu0.7) in thermal cycling test of BGA components and calibration of lead-free solder joint model for life prediction by finite element analyses," Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, Apr. 18-20, 2005, pp. 448-453.

Andersson, Cristina, Zou, Changdong, Yang, Bin, Gao, Yulai, Liu, Johan, and Zhai, Qijie, "Recent Advances in the Synthesis of Lead-free Solder Nanoparticle," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 915-921.

Andersson, Cristina, Sun, Peng, and Liu, Johan, "Tensile properties and microstructural characterization of Sn-0.7Cu-0.4Co bulk solder alloy for electronics applications," Journal of Alloys and Compounds, vol. 457 no. 1-2, pp. 97-105, June 12, 2008.

Andersson, Cristina, Tegehall, Per-Erik, Andersson, Dag R., Wetter, Goran, and Liu, Johan. "Thermal Cycling Aging Effect on the Shear Strength, Microstructure, Intermetallic Compounds (IMC) and Crack Initiation and Propagation of Reflow Soldered Sn-3.8Ag-0.7Cu and Wave Soldered Sn-3.5Ag Ceramic Chip Components," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 2, pp. 331-344, June 2008.

Ando, Toshihiro, Shibata, Masamitsu, Okada, Seiichi, and Namasuya, Yoshikazu, "Stress Analysis and Accelerated Evaluation of Tin Whisker under Thermal Shock Stress," Murata.

Andrae, Anders S. G., Itsubo, Norihiro, and Inaba, Atsushi, "Applicability and Accuracy Improvement for Life-Cycle Assessment in Microelectronics Packaging," Proceedings of 7th International Conference on EcoBalance, Tsukuba, Japan, Nov. 14-16, 2006, pp. 281-284.

Andrae, Anders S. G., Andersson, Dag R., Ramberg, Cecilia, Bengtsson, Gunnar, and Liu, Johan, "Application of Simplified Methods for Partial Environmental Assessment of Microelectronics Soldering Materials and Processes in Small and Medium Sized Enterprises," Gate to Environmental and Health Sciences (Internet-Journal Gate to EHS), no. 5, May 18, 2005, pp. 1-8.

Andrae, Anders S. G., Itsubo, Norihiro, Yamaguchi, Hiroshi, and Inaba, Atsushi, "Conductive Adhesives vs. Solder Paste: A Comparative Life Cycle Based Screening," Proceedings of 14th CIRP International Conference on Life Cycle Engineering, Tokyo, Japan, June 11-13, 2007, pp. 285-290.

Andrae, Anders S. G., and Liu, Johan, "Consequential Toxicity Assessment of the Global Shift to Pb-free Solder Paste," Proceedings of International Conference on Electronics Packaging , Tokyo, Japan, Apr. 19-21, 2006, pp. 298-303.

Andrae, Anders S. G., Itsubo, Norihiro, Yamaguchi, Hiroshi, and Inaba, Atsushi, "Environmental Implications of the Substitution of Silver-based Interconnection Materials as evaluated by Life Cycle Assessment," Proceedings of EcoDesign 2007, Tokyo, Japan, Dec. 10-13, 2007, pp. C3-4-2F.

Andrae, Anders S. G., Itsubo, Norihiro, and Inaba, Atsushi, "Global environmental impact assessment of the Pb-free shift," Soldering & Surface Mount Technology, vol. 19 no. 2, pp. 18-28, 2007.

Andrae, Anders S. G., Zou, Gang, and Liu, Johan, "LCA of Electronic Products: An environmental assessment of Gallium Arsenide Monolithic Microwave Integrated Circuit System-In-a-Package (SIP) Switch Product," International Journal of Life Cycle Assessment, vol. 9 no. 1, pp. 45-52, Jan. 2004.

Andrae, Anders S. G., and Andersen, Otto, "Life cycle assessment of integrated circuit packaging technologies," International Journal of Life Cycle Assessment, vol. 16 no. 3, pp. 258-267, Mar. 2011.

Andrae, Anders S. G., Itsubo, Norihiro, Yamaguchi, Hiroshi, and Inaba, Atsushi, "Life cycle assessment of Japanese high-temperature Japanese conductive adhesives," Environmental Science & Technology, vol. 42 no. 8, pp. 3084-3089, 2008.

Andrae, Anders S. G., Itsubo, Norihiro, Yamaguchi, Hiroshi, and Inaba, Atsushi, "Life cycle assessment of Japanese high-temperature Japanese conductive adhesives," Environmental Science & Technology, vol. ? no. ?, pp. xx-xx, Jan. 22, 2008.

Andrae, Anders S. G., Itsubo, Norihiro, Yamaguchi, Hiroshi, and Inaba, Atsushi, "Screening Life Cycle Assessment of Silver-Based Conductive Adhesive vs. Lead-Based Solder and Plating Materials," Materials Transactions, vol. 48 no. 8, pp. 2212-2218, 2007.

Andrae, Anders S. G., Andersson, Dag R., and Liu, Johan, "Significance of intermediate production processes in life cycle assessment of electronic products assessed using a generic compact model," Journal of Cleaner Production, vol. 13 no. 13-14, pp. 1269-1279, Nov.-Dec. 2005.

Andrae, Anders S. G., and Ekvall, Tomas, "The Shift to Lead-Free Solders - An Analysis of the Environmental Effects Using Two Different Life Cycle Inventory Models," InLCA/LCM Internet Conference, July 11-24, 2004, pp. xx-xx.

Andre, K. L., Zhang, D. M., Gutierrez, H. R., Dickey, E. C., Samarth, N. S., and Mohney, S. E., "Characterization of Zn1-xMnxSe nanowires and nanoribbons with cation sublattice ordering," Journal of Crystal Growth, vol. 375, pp. 95-99, July 15, 2013.

Andreola, Fernanda, Barbieri, Luisa, Corradi, Anna, and Lancellotti, Isabella, "Cathode ray tube glass recycling: an example of clean technology," Waste Management and Research, vol. 23 no. 4, pp. 314-321, Aug. 2005.

Andrews, Aaron Maxwell, Klang, Pavel, Detz, Hermann, Lugstein, Alois, Schrambock, Matthias, Steinmair, Mathias, Hyun, Youn-Joo, Bertagnolli, Emmerich, Muller, Thomas, Unterrainer, Karl, Schrenk, Werner, and Strasser, Gottfried, "MBE Growth of GaAs Whiskers on Si Nanowires," AIP Conference Proceedings, vol. 1199, pp. 261-262, 2010.

Andrews, Clinton J., and Swain, Mathew, "Institutional factors affecting life-cycle impacts of microcomputers," Resources, Conservation, and Recycling, vol. 31 no. 2, pp. 171-188, Feb. 2001.

Andrews, Paul, Parry, Gareth, and Reid, Paul, "Learning From MICROVIA FAILURE in Lead-Free Assembly," Printed Circuit Design and Manufacture, vol. 23 no. 6, pp. 32-36, June 2006.

Andrews, Steve, "Implementing RoHS in the U. K.," Circuits Assembly, vol. 17 no. 2, pp. 88-89, Feb. 2006.

Andrews, Steve, "Implementing RoHS in the U. K.," Printed Circuit Design and Manufacture, vol. 23 no. 2, pp. 16-17, Feb. 2006.

Andrews, Steve, "The Restriction of Hazardous Substances (RoHS) Directive," SMART Group "All You Ever Wanted to Know About Lead-Free" Seminar, High Wycombe, United Kingdom, Nov. 1, 2005.

Andrews, Steve, "The Restriction of Hazardous Substances (RoHS) Directive - Towards Implementation in the UK and across Europe," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Andrews, Steve, "The Restriction of Hazardous Substances (RoHS) Directive - Update on Implementation in the UK and Across Europe," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies , San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Andrews, Steve, "The Restriction of Hazardous Substances (RoHS) Directive - update on implementation in the UK and across Europe," IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies , Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.

Andrews, Steve, "The RoHS Directive Consultation, Compliance & Enforcement," SMART Group 6th Annual Lead-Free Seminar and Table-top Exhibition, High Wycombe, United Kingdom, Feb. 3, 2004.

Andrews, Steve, "The RoHS Directive - The end for lead soldering?," SMART Group/NPL Lead Free Seminar 2003, Feb. 23, 2003.

Andrle, Claudia, and Bauspieá, Christoph, "Bestimmung von sechswertigem Chrom in Korrosionsschutzschichten," ZVO Report, Ausgabe 3, pp. xx-xx, June 2004.

Andrle, Claudia, Sonntag, Birgit, Vogel, Roland, and Silomon, Martin, "Cr(VI)-Free Post-Treatment Processes for Zinc & Zinc Alloys," 22nd AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 29-Feb. 1, 2001, pp. xx-xx.

Angles, R. M., "Some Practical Aspects of Tin-Nickel Plating," Tin and its Uses, no. 48, pp. 1-4, Autumn 1958.

Anglin, Chris, Briggs, Ed, Jensen, Tim, and Lasky, Ron, "Fine Powder Solder Pastes: Stencil Printing and Reflow in Lead-Free Assembly," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Anhock, Sabine, Oppermann, Hermann, Kallmayer, Christine, Aschenbrenner, R., Thomas, Ludwig, and Reichl, Herbert, "Investigations of Au-Sn alloys on different end-metallizations for high temperature applications," Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium, Berlin, Germany, Apr. 27-29, 1998, pp. 156-165.

Ani, Fakhrozi Che, Jalar, Azman, Saad, Abdullah Aziz, Khor, Chu Yee, Abas, Mohamad Aizat, Bachok, Zuraihana, and Othman, Norinsan Kamil, "Characterization of SAC - x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly," Soldering & Surface Mount Technology , vol. 31 no. 2, pp. 109-124, 2019.

Ani, Fakhrozi Che, Jalar, Azman, Saad, Abdullah Aziz, Khor, Chu Yee, Ismail, Roslina, Bachok, Zuraihana, Abas, Mohamad Aizat, and Othman, Norinsan Kamil, "SAC-xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly," Soldering & Surface Mount Technology , vol. 30 no. 1, pp. 1-13, 2018.

Anjard Sr., Ronald P., "Solder Pastes for Electronics - A Status Report," Tin and its Uses , no. 143, pp. 13-17, 1985.

Ansara, I., Bros, J. P., and Gambino, M., "Thermodynamic Analysis of the Germanium-Based Ternary Systems (Al-Ga-Ge, Al-Ge-Sn, Ga-Ge-Sn)," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 3 no. 3, pp. 225-233, 1979.

Ansari, Lida, Fagas, Giorgos, Colinge, Jean-Pierre, and Greer, James C., "A Proposed Confinement Modulated Gap Nanowire Transistor Based on a Metal (Tin)," Nano letters, vol. 12 no. 5, pp. 2222-2227, 2012. DOI: 10.1021/nl2040817

Ansari, Lida, Fagas, Giorgos, and Greer, James C., "Strain induced effects on electronic structure of semi-metallic and semiconducting tin nanowires," Applied Physics Letters, vol. 105 no. 12, pp. 123105-1-123105-4, Sept. 22, 2016.

Anselm, Martin K., and Roggeman, Brian, "Testing Intermetallic Fragility on ENIG Upon Addition of Limitless Cu," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 64-71.

Anselm, Martin K., and Roggeman, Brian, "Testing Intermetallic Fragility on ENIG upon Addition of Limitless Cu," Surface Mount Technology (SMT), vol. 29 no. 2, pp. 30,32-34,36-41, Feb. 2014.

Anselm, Martin, and Jones, Wayne, "Tools and techniques for material assessment in advanced technologies," Global SMT and Packaging, vol. 14 no. 1, pp. 8-12,14-15, Jan. 2014.

Anson, Scott, McLaughlin, Michael, and Argueta, Abner, "Evaluation of Solder Pastes for High Reliability Applications," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 800-807.

Anson, Scott J., Slezak, Jacob G., and Srihari, Krishnaswami, "Investigation of Enhanced Solder Wetting in 63Sn/37Pb and Sn-Ag-Cu Lead Free Alloy," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1737-1744.

Anson, Scott J., and Slezak, Jacob G., "Organic Solderability Preservative Lead Free Reflow Processing," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 607-612.

Anson, Scott J., Slezak, Jacob G., and Srihari, Krishnaswami, "Reflow Process Enhancement and Wetting Analysis in 63Sn/37Pb and Sn-Ag-Cu Lead-Free Alloy," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 90-99.

Anthony, George, and Pfeiffer, Joseph, "New flame retardant TPVs for electrical applications." Wire Journal International, vol. 37 no. 8, pp. 64-68, Aug. 2004.

Antler, M., Feder, M., Hornig, C. F., and Bohland, J., "The Corrosion Behavior of Single and Multiphase Tin-Nickel Alloy Electrodeposits," Plating and Surface Finishing, vol. 63 no. 7, pp. 30-33, July 1976.

Anton, Bryce R., Shahin, George E., and Mishra, Brajendra, "A Comparison of Hexavalent & Trivalent Chromium for Use as a Base Material for Decorative PVD Coatings," Proceedings 2003 AESF/EPA Conference for Environmental & Process Excellence, Daytona, FL, Feb. 3-7, 2003, pp. 273-280.

Antoniou, Antonia, and Bastawros, Ashraf F., "Deformation characteristics of tin-based solder joints," Journal of Materials Research, vol. 18 no. 10, pp. 2304-2309, Oct. 2003.

Anuar, S. Khairul, Mariatti, M., Azizan, A., Mang, N. Chee, and Tham, W. T., "Effect of different types of silver and epoxy systems on the properties of silver/epoxy conductive adhesives," Journal of Materials Science: Materials in Electronics, vol. 22 no. 7, pp. 757-764, July 2011.

Aoe, Taeko, "Eco-efficiency and ecodesign in electrical and electronic products," Journal of Cleaner Production, vol. 15 no. 15, pp. 1406-1414, Oct. 2007.

Aoi, Tatsuki, "Japan Frets Over EU Environmental Regs," Electronic News, June 14, 2004.

Aoi, Tatsuki, "Japan frets over RoHS Directive," Electronics Weekly, June 15, 2004.

Aoki, Masamitsu, "Environment Regulation in Europe-WEEE/RoHS & REACH ," Journal of the Surface Finishing Society of Japan, vol. 57 no. 12, pp. 813-822, 2006.

Aoki, Toyohiro, Nakamura, Eiji, Hisada, Takashi, Mori, Hiroyuki, and Yamamichi, Shintaro, "Flip Chip Joining with Low Temperature Solders and Thermal Gradient Bonding," 2017 International Conference on Electronics Packaging, Yamagata, Japan, Apr. 19-22, 2017, pp. 216-219.

Aoki, Yuichi, Nagai, Takayuki, Katayanagi, Hiroko, and Tanaka, Hirokazu, "Evaluating lead-free plating using gas corrosion tests," Espec Technology Report, no. 12, pp. 23-28, Oct. 2001.

Aoki, Yuichi, Tanaka, Hirokazu, and Katayanagi, Hiroko, "Factors affecting reliability of Sn-Ag-Cu solder," Espec Technology Report, no. 15, pp. 1-9, Apr. 2003.

Aoki, Yuichi, Nakagawa, Yasutoshi, Toi, Keiko, Tanaka, Hirokazu, and Suyama, Katsumasa, "Solder Joint Reliability of Tin-Zinc-Bismuth Lead-free Solder under Environmental Stress," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Aoki, Yuichi, Tsuje, Ichisaku, and Nagai, Takayuki, "The effect of ramp rate on temperature cycle fatigue in solder joints," ESPEC Technology Report, no. 25, pp. 4-13, Sept. 15, 2007.

Aoki, Yuichi, Tsujie, Ichisaku, and Nagai, Takayuki, "The effect of ramp rate on thermal fatigue testing of solder joints," ESPEC Technology Report, no. 27, pp. 1-13, xxxx.

Aoues, Younes, Makhloufi, Abderahman, Pougnet, Philippe, and El-Hami, Abdelkhalak, "Robustness study of solder joints of different compositions by using Stochastic Finite Element Modeling," 2014 8th International Conference on Integrated Power Systems, Nuremberg, Germany, Feb. 25-27, 2014, pp. xx-xx.

Aoyama, M., and Saka, M., "Evaluation of electromigration resistance of lead-free solders using unpassivated stripe-shaped samples," Microsystem Technologies, vol. 21 no. 8, pp. 1777-1785, Aug. 2015.

Apell, Marc C., "Considerations for Lead-Free Reflow Soldering," Circuits Assembly, vol. 15 no. 3, pp. 28-30, Mar. 2004.

Apell, Marc, Formella, Tad, and Johnson, Alden, "Effects of Cooling Slopes in Lead Free Reflow," IPC APEX/EXPO 2005 , Anaheim, CA, Feb. 22-24, 2005, pp. xx-xx.

Apell, Marc C., "Lead-Free Reflow Soldering Equipment Considerations," Thermal and Cleaning Systems.

Apell, Marc, Formella, Tad, Dautenhahn, Jon, Miller, Rick, and Hueste, Greg, "OmniExcel(TM) Thermal profiling for Pb-Free Alloys," Cookson Electronics Equipment.

Apell, Marc, Dautenhahn, Jon, Formella, Tad, and Morris, Jim, "Power Consumption and Closed-loop Nitrogen Control Considerations in Lead-free Reflow," IPC SMEMA Council APEX 2004, Anaheim, CA, Feb. 24-26, 2004, pp. S19-1-1-S19-1-5.

Apisitpuvakul, Witoon, Piumsomboon, Pornpote, Watts, Daniel J., and Koetsinchai, Woranut, "LCA of spent fluorescent lamps in Thailand at various rates of recycling," Journal of Cleaner Production, vol. 16 no. 10, pp. 1046-1061, July 2008.

Apparavu, Naidu, Sjoberg, Jonas, Geiger, David A., and Shangguan, Dongkai, "Process Development, Repair and Reliability Evaluation for Inline Package on Package (PoP) assembly," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Appelbaum, Alec, "Europe Cracks Down on E-Waste," IEEE Spectrum, vol. 39 no. 5, pp. 46-51, May 2002.

Appell, David, "CMEs - If The Sun Spits, The Earth Could Fry," Mar. 1, 1999.

Aptekar', I. L., and Styrkas, A. D., "Inert Supports as Carriers of Tin-Plague Infection from InSb to beta-Sn," High-Purity Substances (a translation of Vysokochistye Veshchestva) vol. 7 no. 3, pp. 282-284, May-June 1993.

Aptekar', I. L., and Styrkas, A. D., "Nature of Memory in the Case of a Phase Transition in Tin After a beta-alpha-beta Cycle," High-Purity Substances (a translation of Vysokochistye Veshchestva) vol. 7 no. 3, pp. 285-288, May-June 1993.

Aptekar', I. L., Styrkas, A. D., and Aptekar', L. I., "The Nature of Tin Plague," High-Purity Substances (a translation of Vysokochistye Veshchestva) vol. 7 no. 3, pp. 289-292, May-June 1993.

Arabi, F., Theolier, L., Youssef, T., Medina, M., Deletage, J.-Y., and Woirgard, E., "Effect of voids on crack propagation in AuSn die attach for high-temperature power modules," 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Dresden, Germany, Apr. 3-5, 2017, pp. xx-xx.

Arabi, F., Theolier, L., Martineau, D., Deletage, J.-Y., Medina, M., and Woirgard, E., "Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices," Microelectronics Reliability, vol. 64, pp. 409-414, Sept. 2016.

Arafat, M. M., Haseeb, A. S. M. A., and Johan, Mohd Rafie, "Interfacial reaction and dissolution behavior of Cu substrate in molten Sn-3.8Ag-0.7Cu in the presence of Mo nanoparticles," Soldering & Surface Mount Technology, vol. 23 no. 3, pp. 140-149, 2011.

Arafat, M. M., and Haseeb, A. S. M. A., "Interfacial Reaction and Dissolution Behavior of Cu Substrate in Molten Sn-3.8Ag-0.7Cu-nano Mo Composite Solder," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 953-956.

Arafat, M. M., Haseeb, A. S. M. A., and Johan, Mohd Rafie, "Reflow Behavior of Mo Nanoparticle Added Sn-3.8Ag-0.7 Cu Solder," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Arafat, Y., Yang, H., Dutta, I., Kumar, P. A., and Datta, B., "A Model for Intermetallic Growth in Thin Sn Joints Between Cu Substrates: Application to Solder Microjoints," Journal of Electronic Materials , vol. 49 no. 5, pp. 3367-3382, May 2020.

Aragon, Joseph, Wavrik, Richard, Vianco, Paul, Witham, John, and Bou, Jimmy, "Tin Whisker Mitigation Methods," 11th International Components for Military and Space Electronics Conference, Mar. 12-15, 2007, pp. xx-xx. (Sandia Report SAND2007-0400C)

Aragon, Joseph, Wavrik, Richard, Vianco, Paul, and Witham, John, "Tin Whisker Mitigation Methods," Defense Semiconductor Association Meeting, Las Vegas, NV, Jan. 14-17, 2008, pp. xx-xx. (Sandia Report SAND2008-0117C)

Aragon, Joseph, Wavrik, Richard, Vianco, Paul, Witham, John, and McKenzie, Bonnie, "Tin Whisker Mitigation Methods," Defense Manufacturing Conference , Orlando, FL, Dec. 1-4, 2008, pp. xx-xx. (Sandia Report SAND2008-7346C)

Aragon, Joseph, Wavrik, Richard, and Witham, John, "Tin Whisker Mitigation Methods," Sandia Report SAND2009-4735C, 2009.

Aragon, Joseph, Rohwer, Lauren, Wavrik, R., and Witham, J., "Tin Whisker Mitigation Methods," 28th Compatibility, Aging & Stockpile Stewardship Conference, Albuquerque, NM, Fall 2009, pp. xx-xx. (Sandia Report SAND2009-6058C)

Arai, Susumu, and Watanabe, Tohru, "Microstructure of Sn-Ag Alloys Electrodeposited from Pyrophosphate-Iodide Solutions," Materials Transactions, vol. 49 no. 4, pp. 439-445, Apr. 2008.

Arai, Susumu, "Recent Status of Plating Technology for Lead-Free Soldering," Journal of The Surface Finishing Society of Japan, vol. 55 no. 9, pp. 576-581, 2004.

Arai, T., Iiyori, H., Hiromasu, Y., Atsumi, M., Ioku, S., and Furuta, K., "Aluminum-based gate structure for active-matrix liquid crystal displays," IBM Journal of Research and Development, vol. 42 no. 3/4, pp. 491-499, May-July 1998.

Araki, Teppei, Uemura, Takafumi, Yoshimoto, Shusuke, Takemoto, Ashuya, Noda, Yuki, Izumi, Shintaro, and Sekitani, Tsuyoshi, "Wireless Monitoring Using a Stretchable and Transparent Sensor Sheet Containing Metal Nanowires," Advanced Materials, vol. 32 no. 15, pp. 1902684-1-1902684-17, Apr. 16, 2020. https://doi-org.ezproxy.uky.edu/10.1002/adma.201902684

Aravamudhan, Srinivasa, Apell, Marc, Belmonte, Joe, Van-Diep, Gerald Pham, and Harrell, Jeff, "Effect of Oxygen Concentration During Reflow on Tombstoning for Passive Resistors for Lead-Free Assemblies," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 67-73.

Aravamudhan, Srinivas, Aspandiar, Raiyo, May, Lilia, Nad, Suddhasattwa, Mokler, Scott, and Amir, Dudi, "Impact of Low Silver Solder Pastes on Area Array Solder Joint Quality," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 599-603.

Aravamudhan, Srinivasa, Belmonte, Joe, and Pham-Van-Diep, Gerald, "Self-Centering of Chip Components in a Pb-Free Assembly as a Function of Component and Solder Paste Print Offsets," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 851-860.

Aravamudhan, Srinivasa, Belmonte, Joe, Bhosale, Anand, Johnson, Alden, Mattero, Pat, Moore, Karl, and Pham-Van-Diep, Gerald, ""The Creation and Building of a Lead Free Product" A Case Study," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Aravamudhan, Srinivasa, Belmonte, Joe, Bhosale, Anand, Johnson, Alden, Mattero, Pat, Moore, Karl, and Pham-Van-Diep, Gerald, "The Creation and Building of a Pb-Free Product," Circuits Assembly , vol. 17 no. 4, pp. 34, Apr. 2006.

Aravamudhan, Srinivasa, Belmonte, Joe, and Pham-Van-Diep, Gerald, "Tin/lead vs. Lead-free: A Question of Print Accuracy," Surface Mount Technology (SMT), vol. 20 no. 2, pp. 42, 44, 47, Feb. 2006.

Arazna, Aneta, Koziol, Grazyna, Steplewski, Wojciech, and Borecki, Janusz, "Assessment of lead-free solder pastes with different type of powder for fine-pitch application," 31st International Spring Seminar on Electronics Technology, Budapest, Hungary, May 7-11, 2008, pp. 579-584.

Arazna, Aneta, Koscielski, Marek, Sitek, Anna, Steplewski, Wojciech, Janeczek, Kamil, Lipiec, Krzysztof, Rafalik, Ireneusz, and Sitek, Janusz, "Comparison of SAC and new Pb-free solder alloy for special application," 2020 IEEE 8th Electronics System-Integration Technology Conference , Tonsberg, Norway, Sept. 15-18, 2020, pp. xx-xx.

Arazna, Aneta, Koziol, Grazyna, Steplewski, Wojciech, and Lipiec, Krzysztof, "Head on pillow defects in BGAs solder joints," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Arazna, Aneta, Koziol, Grazyna, and Steplewski, Wojciech, "Investigation of Tin Whiskers Formation," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 183-185.

Archana, J., Navaneethan, M., Ponnusamy, S., Hayakawa, Y., and Muthamizhcelvan, C., "Chemical synthesis of monodispersed ZnSe nanowires and its functional properties," Materials Letters, vol. 81, pp. 59-61, Aug. 15, 2012.

Ardente., Fulvio, Mathieux, Fabrice, and Recchioni, Marco, "Recycling of electronic displays: Analysis of pre-processing and potential ecodesign improvements," Resources, Conservation and Recycling, vol. 92, pp. 158-171, Nov. 2014.

Arellano, Jorge, Subbarayan, Guhan, and Russo, Richard, "Optimization and Qualification of Lead Free Wave Soldering Process Using SAC 305 Solder Alloy," IPC Review, vol. 47 no. 11, pp. 8, Dec. 2006.

Arellano, Jorge, Subbarayan, Guban, and Warnock, Buck, "Optimization and Qualification of Lead Free Wave Soldering Process Using sac 305 Solder Alloy," Route, Dec. 2006.

Arenas, Mario F., and Acoff, Viola L., "Contact Angle Measurements of Sn-Ag and Sn-Cu Lead-Free Solders on Copper Substrates," Journal of Electronic Materials, vol. 33 no. 12, pp. 1452-1458, Dec. 2004.

Arenas, Mario F., He, Min, and Acoff, Viola L., "Effect of Flux on the Wetting Characteristics of SnAg, SnCu. SnAgBi, and SnAgCu Lead-Free Solders on Copper Substrates," Journal of Electronic Materials, vol. 35 no. 7, pp. 1530-1536, July 2006.

Arendt, N., Baron, F., Benz, V., Letterer, M., Merkle, H., Schroeder, S., and Wessling, B., "A New Whisker-Reducing Immersion Tin Technology," CircuiTree , vol. 18 no. 1, pp. 10, 12, 14, Jan. 2005.

Arendt, N., Baron, F., Benz, V., Letterer, M., Merkle, H., Schroeder, S., Wessling, B., "A Superior Whisker-Reducing Immersion Tin Technology," OnBoard Technology, vol. xx no. xx, pp. 30-32, Oct. 2004.

Arendt, N., Arribas-Sanchez, C., Gleeson, S., Posdorfer, J., Rischka, M., Thun, M., Wessling, B., and Zeysing, B., "Innovative Final Nanofinish for PCBs With Organic Metal," CircuiTree, vol. 20 no. 10, pp. xx-xx, Oct. 2007.

Arendt, N., Wessling, B., Thun, M., Arribas-Sanchez, C., Gleeson, S., Posdorfer, J., Rischka, M., and Zeysing, B., "Nanotechnology for Lead-Free PWB Final Finishes with the Organic Metal," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 260-264.

Arensman, Russ, "The Greening of technology," Electronic Business, May 1, 2001.

Aresti, A., Garbato, L., and Rucci, A., "Some Cohesive Energy Features of Tetrahedral Semiconductors," Journal of Physics and Chemistry of Solids, vol. 45 no. 3, pp. 361-365, 1984.

Arfaei, B., Kim, N., and Cotts, E. J., "Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature," Journal of Electronic Materials, vol. 41 no. 2, pp. 362-374, Feb. 2012.

Arfaei, B., Tashtoush, T., Kim, N., Wentlent, L., Cotts, E., and Borgesen, P., "Dependence of SnAgCu Solder Joint Properties on Solder Microstructure," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 125-132.

Arfaei, B., Wentlent, L., Joshi, S., Alazzam, A., Tashtoush, T., Halaweh, M., Chivukula, S., Yin, L., Meilunas, M., Cotts, E., and Borgesen, P., "Improving the Thermomechanical Behavior of Lead Free Solder Joints by Controlling the Microstructure," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 392-398.

Arfaei, B., Xing, Y., Woods, J., Wolcott, J., Tumne, P., Borgesen, P., and Cotts, E., "The Effect of Sn Grain Number and Orientation on the Shear Fatigue Life of SnAgCu Solder Joints," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 459-465.

Arfaei, Babak, Anselm, Martin, Mutuku, Francis, and Cotts, Eric, "A.R.E.A. - Effect of PCB Surface Finish on Sn Grain Morphology and Thermal Fatigue Performance of Lead Free Solder Joints," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 406-414.

Arfaei, Babak, and Cotts, Eric, "Correlations Between the Microstructure and Fatigue Life of Near-Eutectic Sn-Ag-Cu Pb-Free Solders," Journal of Electronic Materials, vol. 38 no. 12, pp. 2617-2627, Dec. 2009.

Arfaei, Babak, Mutuku, Francis, Sweatman, Keith, Lee, Ning-Cheng, Cotts, Eric, and Coyle, Richard, "Dependence of Solder Joint Reliability on Solder Volume, Composition and Printed Circuit Board Surface Finish," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 655-665.

Arfaei, Babak, Mutuku, Francis, and Cotts, Eric, "Effect of PCB Surface Finish on Sn Grain Morphology and Thermal Fatigue Performance of Lead-Free Solder Joints," SMTAnews & Journal of Surface Mount Technology, vol. 28 no. 4, pp. 13-20, Oct.-Dec. 2015.

Arfaei, Babak, Anselm, Martin, Joshi, Shantanu, Mahin-Shirazi, Sam, Borgesen, Peter, Cotts, Eric, Wilcox, James, and Coyle, Richard, "Effect of Sn Grain Morphology on Failure Mechanism and Reliability of Lead-Free Solder Joints in Thermal Cycling Tests," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 539-550.

Arfaei, Babak, Mutuku, Francis, Coyle, Richard, Cotts, Eric, and Wilcox, Jim, "Failure Mechanism and Microstructural Evolution of Pb-free Solder Alloys in Thermal Cycling Tests: Effect of Solder Composition and Sn Grain Morphology," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 118-126.

Arfaei, Babak, Mutuku, Francis, Coyle, Richard, and Cotts, Eric, "Influence of Microalloying Elements on Reliability of SnAgCu Solder Joints," Proceedings of SMTA Pan Pacific Symposium, Kauai, HI, Feb. 2-5, 2015, pp. xx-xx.

Arfaei, Babak, Mutuku, Francis, Coyle, Richard, and Cotts, Eric, "Influence of Microalloying Elements on Reliability of SnAgCu Solder Joints," SMTA Journal, vol. 29 no. 2, pp. 13-20, 2016.

Arfaei, Babak, "Lead-Free Solders: Focus on Fundamentals, Reliability, and Applications," JOM, vol. 66 no. 11, pp. 2309-2310, Nov. 2014.

Arfaei, Babak, Mahin-Shirazi, Sam, Joshi, Shantanu, Anselm, Martin, Borgesen, Peter, Cotts, Eric, Wilcox, James, and Coyle, Richard, "Reliability and Failure Mechanism of Solder Joints in Thermal Cycling Tests," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 976-985.

Armendariz, Norman J., and Vasudevan, Vasu, "Effect of Baking Time and Temperature on Lead Free Second Level Interconnect Solder Joint Microstructures, Microhardness and IMC Morphology," 2005 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Armendariz, Norman J., and Paulraj, Prawin, "Materials Characterization of Lead Free Compositions for Minimum Temperature SMT Processes at the SLI-Second Level Interconnect Solder Joint," Proceedings of the 30th International Symposium for Testing and Failure Analysis, Worchester (Boston), MA, Nov. 14-18, 2004, pp. 261-266.

Arnold, Henri, "Lead tracer checks RoHS compatibility," EE Times Europe, Mar. 7, 2007.

Arnold, J. W., and Suzuki, O., "Effects of Corrosive Treatment on Stainless Steel Surface Finishes and Bacterial Attachment," Transactions of the ASAE, vol. 46 no. 6, pp. 1595-1602, 2003.

Arnold, J. W., Boothe, D. H., and Bailey, B. W., "Parameters of Treated Stainless Steel Surfaces Important for Resistance to Bacterial Contamination," Transactions of the ASAE, vol. 44 no. 2, pp. 347-356, 2001.

Arnold, Jim, McElroy, Jim, and Gedney, Ron, "Roadmap of Lead-Free Assembly in North America," JISSO/PROTEC Forum 2002, Japan, Nov. 19-20, 2002.

Arnold, Joelle, and Sweatman, Keith, "Accelerated Reliability Testing of Ni-Modified SnCu and SAC305," IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics, Raleigh, NC, Mar. 11-12, 2008, pp. xx-xx.

Arnold, Joelle, Binfield, Seth, Gulbrandsen, Steph, and Blattau, Nathan, "Impact of Process Control in Pb-Free to SnPb Reballing Techniques Part 1: Control of Thermal Exposure," International Conference on Soldering & Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.

Arnold, Joelle, "Impact of Process Control in Pb-Free to SnPb Reballing Techniques - Part 2: Contamination and Cleaning," SMTA-IPC High-Reliability Cleaning and Conformal Coating Conference 2014, Schaumburg, IL, Nov. 18-20, 2014, pp. xx-xx.

Arnold, Joelle, and Sweatman, Keith, "Reliability Testing of Ni-Modified SnCu and SAC305 - Vibration," IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics, Raleigh, NC, Mar. 11, 2008, pp. xx-xx.

Arnold, Joelle, Blattau, Nathan, Hillman, Craig, and Sweatman, Keith, "Reliability Testing of Ni-Modified SnCu and SAC305 - Accelerated Thermal Cycling," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 187-190.

Arnold, Joelle, and Sweatman, Keith, "Reliability Testing of Ni-Modified SnCu and SAC305 - Vibration," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 191-194.

Arnold, Rocky R., "New Product Development Challenges of Design for Environmental Compliance and Design for Electromagnetic Compliance," 2004 IEEE International Symposium on Electronics & the Environment Conference Record, Scottsdale, AZ, May 10-13, 2004, pp. 287-291.

Arnold, S. M., "A hidden cause of failure in electronic equipment: Metal Whiskers," Electrical Manufacturing, vol. xx no. x, pp. 110-114, Nov. 1954.

Arnold, S. M., and Koonce, S. Eloise, "Filamentary Growths on Metals at Elevated Temperatures," Journal of Applied Physics, vol. 27 no. 8, pp. 964, 1956.

Arnold, S. M., "Repressing the Growth of Tin Whiskers," Plating, vol. 53 no. 1, pp. 16-19, Jan. 1966.

Arnold, S. M., "The Growth and Properties of Metal Whiskers," Proceedings of the 43rd Annual Convention of the American Electroplaters Society, Washington, June 17-21, 1956, pp. 26-31.

Arnold, S. M., "The Growth of Metal Whiskers on Electrical Components," Proceedings of Electrical Components Conference, pp. 75-82, 1959.

Arra, Minna, Geiger, David, Shangguan, Dongkai, Sjoberg, Jonas, "A study of SMT assembly processes for fine pitch CSP packages," Soldering & Surface Mount Technology, vol. 16 no. 3, pp. 16-21, 2004.

Arra, Minna, Shangguan, Dongkai, Sundelin, Janne, Lepisto, Toivo, and Ristolainen, Eero, "Aging Mechanism of Immersion Tin and Silver PCB Surface Finishes in Lead-Free Solder Applications," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 23-24, 2003, pp. 169-179.

Arra, Minna, Castello, Todd, Shangguan, Dongkai, and Ristolainen, Eero, "Characterization of Mechanical Performance of Sn/Ag/Cu Solder Joints with Different Component Lead Coatings," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 728-734.

Arra, Minna, Castello, Todd, Shangguan, Dongkai, and Ristolainen, Eero, "Characterization of Mechanical Performance of Sn/Ag/Cu Solder Joints with Different Component Lead Coatings," Lead-Free Magazine.

Arra, Minna, Castello, Todd, Shangguan, Dongkai, and Ristolainen, Eero, "Characterization of mechanical performance of Sn/Ag/Cu solder joints with different component lead coatings," Soldering & Surface Mount Technology, vol. 16 no. 1, pp. 35-43, 2004.

Arra, Minna, Shangguan, Dongkai, Yi, Sammy, Thalhammer, Robert, and Fockenberger, Harald, "Development of Lead-Free Wave Soldering Process," IEEE Transactions on Electronics Packaging Manufacturing , vol. 25 no. 4, pp. 289-299, Oct. 2002.

Arra, Minna, Shangguan, Dongkai, Ristolainen, Eero, and Lepisto, Toivo, "Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards," Soldering & Surface Mount Technology, vol. 14 no. 2, pp. 18-25, 2002.

Arra, Minna, Geiger, David, Shangguan, Dongkai, and Sjoberg, Jonas, "Fine pitch component self-alignment with Sn/Pb and Sn/Ag/Cu solders," Global SMT and Packaging, vol. 6 no. 6, pp. 16, 18, 20-21, June/July 2006.

Arra, Minna, Geiger, David, Shangguan, Dongkai, Yi, Sammy, Grebenstein, Frank, Fockenberger, Harald, Kerk, K. H., and Wong, Harris, "Performance Evaluation of Lead-Free Solder Pastes," 2001 SMTA International Conference Proceedings, Chicago, IL, Sept. 30-Oct. 4, 2001, pp. 850-857.

Arra, Minna, Xie, DongJi, and Shangguan, Dongkai, "Performance of Lead-Free Solder Joints Under Dynamic Mechanical Loading," 2002 Proceedings 52nd Electronic Components & Technology Conference , San Diego, CA, May 28-31, 2002, pp. 1256-1262.

Arra, Minna, Xie, DongJi, and Shangguan, Dongkai, "Performance of QFP Lead-Free Solder Joints Under Dynamic Mechanical Loading," The International Journal of Microcircuits and Electronic Packaging , vol. 24 no. 4, pp. 346-365, Fourth Quarter 2001.

Arra, Minna, Xie, DongJi, and Shangguan, Dongkai, "Performance of QFP Lead-Free Solder Joints Under Dynamic Mechanical Loading," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 346-365.

Arra, Minna, Shangguan, Dongkai, Ristolainen, Eero, and Lepisto, Toivo, "Solder Balling of Lead-Free Solder Pastes," Journal of Electronic Materials, vol. 31 no. 11, pp. 1130-1138, Nov. 2002.

Arra, Minna, Shangguan, Dongkai, Xie, DongJi, Sundeline, Janne, Lepisto, Toivo, and Ristolainen, Eero, "Study of Immersion Silver and Tin Printed-Circuit-Board Surface Finishes in Lead-Free Solder Applications," Journal of Electronic Materials , vol. 33 no. 9, pp. 977-990, Sept. 2004.

Arra, Minna, Geiger, David, Shangguan, Dongkai, and Sjoberg, Jonas, "Study of SMT Assembly Processes for Fine Pitch CSP Packages," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S07-1-1-S07-1-10.

Arra, Minna, Shangguan, Dongkai, and Xie, DongJi, "Wetting of Fresh and Aged Immersion Tin and Silver Surface Finishes by Sn/Ag/Cu Solder," HKPCA Journal, no. 10, pp. 1-9.

Arrott, A. S., and Heinrich, B., "Application of magnetization measurements in iron to high temperature thermometry," Journal of Applied Physics, vol. 52 no. 3, pp. 2113-2115, Mar. 1981.

Arrott, A. S., Heinrich, B., and Bloomberg, D. S., "Domain Configurations, Bloch Walls and Magnetization Processes in Iron Whiskers from D.C. to 200 kHz. Theory and Experiment II," AIP Conference Proceedings, vol. 10, pp. 941-960, 1973.

Arrott, A. S., Heinrich, B., and Bloomberg, D. S., "Magnetization Processes and Eddy Currents in Iron Whiskers," AIP Conference Proceedings, vol. 5, pp. 897-901, 1972.

Arrott, A. S., and Lee, J.-G., "Simple function for a complex domain configuration," Journal of Applied Physics, vol. 79 no. 8, pp. 5752-5754, Apr. 15, 1996.

Arrott, A. S., Heinrich, B., and Noakes, J. E., "The Role of Dipole-Dipole Interactions in the Critical Behavior of Ferromagnetic Materials," AIP Conference Proceedings, vol. 10, pp. 822-826, 1973.

Arrowsmith, Peter, "Investigation of Field Failures of Power Systems: A Different Whisker Story," International Conference on Soldering & Reliability 2015 Proceedings, Toronto, Ontario, Canada, May 19-21, 2015, pp. xx-xx.

Arslanian, Gregory K., Lin, Minfa, Wressell, Amy, and Mebrahtu, Tom, "Effects of solder reflow conditions on electronics packaging and PCB assemblies," EMasia, Mar. 2009.

Artaki, I., Ray, U., Rejent, Jerome A., and Vianco, Paul T., "An Evaluation of Prototype Circuit Boards Assembled with a Sn-Ag Bi Solder," Sandia Report SAND99-2273C, Sept. 1999.

Artaki, I., Ray, U., Gordon, H. M., and Opila, R. L., "Corrosion Protection of Copper Using Organic Soldering Preservatives," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume I, San Jose, CA, Sept. 1-3, 1992, pp. 503-511.

Artaki, I., Jackson, A. M., and Vianco, P. T., "Evaluation of Lead-Free Solder Joints in Electronic Assemblies," Journal of Electronic Materials, vol. 23 no. 8, pp. 757-764, Aug. 1994.

Artaki, I., Jackson, A. M., and Vianco, P. T., "Fine Pitch Surface Mount Assembly with Lead-Free, Low Residue Solder Paste," Surface Mount International Conference & Exposition Proceedings of the Technical Program, San Jose, CA, Aug. 28-Sept. 1, 1994, pp. 449-459.

Artaki, I., Jackson, A. M., and Vianco, P. T., "Fine Pitch Surface Mount Technology Assembly with Lead-free, Low Residue Solder Paste," Soldering & Surface Mount Technology, vol. 7 no. 2, pp. 27-32, 1995.

Artaki, I., Ray, U., Jackson, A. M., Gordon, H. M., and Vianco, P. T., "Solderability Preservative Coatings: Electroless Tin vs Organic Azoles," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume I, San Jose, CA, Aug. 31-Sept. 2, 1993, pp. 414-420.

Artaki, I., Ray, U., Jackson, A. M., Gordon, H. M., and Vianco, P. T., "Solderability Preservative Coatings: Electroless Tin vs Organic Azoles," Circuit World, vol. 20 no. 3, pp. 23-26, 1994.

Artaki, I., Finley, D. W., Jackson, A. M., Ray, U., and Vianco, P. T., "Wave Soldering with Lead-Free Solders," Surface Mount International Proceedings of the Technical Program, San Jose, CA, Aug. 29-31, 1995, pp. 495-510 (Sandia Report SAND-95-1372C).

Artaki, I., Finley, D. W., Jackson, A. M., Ray, U., and Vianco, P. T., "Wave soldering with Pb-free solders," Sandia Report SAND-95-1372C, July 1995.

Artaki, Iris, Noctor, Donna, Desantis, Charles, Desaulnier, Willie, Felton, Lawrence, Palmer, Mark, Felty, Joe, Greaves, John, Handwerker, Carol, Mather, John, Schroeder, Scott, Napp, Duane, Pan, Tsung-Yu, Rosser, Jerald, Vianco, Paul, Whitten, Gordon, and Zhu, Yun, "Research Trends in Lead-Free Soldering in the U.S.: NCMS Lead-Free Solder Project," Proceedings of the First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Feb. 1-3, 1999, pp. 602-605.

Arulvanan, Periannan, Zhong, Zhaowei, and Shi, Xunqing, "Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints," Microelectronics Reliability , vol. 46 no. 2-4, pp. 432-439, Feb.-Apr. 2006.

Arutyunov, K. Yu., Danilova, N. P., and Nikolaeva, A. A., "Galvanomagnetic properties of quasi-one-dimensional superconductors," Journal of Applied Physics, vol. 76 no. 10, pp. 7139-7141, Nov. 15, 1994.

Arutyunov, K. Yu., Danilova, N. P., and Nikolaeva, A. A., "Nonequilibrium transport in superconducting filaments," Proceedings of the 4th International Conference and Exhibition: World Congress on Superconductivity, Volume 1, Orlando, FL, June 27-July 1, 1994, pp. 359-368.

Arya, Sandeep, Khan, Saleem, Lehana, Parveen, Gupta, Ishan, and Kumar, Suresh, "Electrical properties of electrodeposited zinc selenide (ZnSe) nanowires," Journal of Materials Science: Materials in Electronics, vol. 25 no. 9, pp. 4150-4155, Sept. 2014.

Asai, Hironori, "Introduction to the MES Conference: Recent Changes," Advancing Microelectronics, vol. 33 no. 3, pp. 30-32, May/June 2006.

Asai, Shin'Ichiro, Saruta, Ueki, Tobita, Masayuki, Takano, Minoru, and Miyashita, Yasuo, "Development of an Anisotropic Conductive Adhesive Film (ACAF) from Epoxy Resins," Journal of Applied Polymer Science, vol. 56 no. 7, pp. 769-777, May 16, 1995.

Asai, Tadashi, Kiga, Tomoya, Taniguchi, Yoshikuni, Morikawa, Hiroshi, and Sumiyama, Kenji, "Suppression of External-Stress-Induced Formation of Tin Whisker by Annealing of Electroplated Sn-Ag Alloy Films," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 73 no. 11, pp. 823-832, Nov. 2009.

Asakawa, Motoo, Sasaki, Wataru, and Shishido, Shunsuke, "Effect of die approach geometry and bearing length on residual stress after bar drawing," Wire Journal International, vol. 35 no. 10, pp. 68-72, Oct. 2002.

Asakura, Yoshihiro, and Takahashi, Yasuo, "Feature Extraction of Pb Free Solder Fillet Profile by an Image Processing Taking the Profile Scattering into Consideration," Quarterly Journal of the Japan Welding Society/ Yosetsu Gakkai Ronbunshu, vol. 22 no. 2, pp. 323-333, 2004.

Aschenbrenner, R., Miessner, R., and Reichl, H., "Adhesive Flip Chip Bonding on Flexible Substrates," The First IEEE International Symposium on Polymeric Electronics Packaging, Oct. 26-30, 1997, pp. 86-94.

Aschenbrenner, R., Miessner, R., Becker, K. F., and Reichl, H., "Characterization of Adhesive Materials for High Circuit Density Applications," 4th International Symposium on Advanced Packaging Materials, Brazelton, GA, Mar. 15-18, 1998, pp. 248-255.

Aschenbrenner, R., Ostmann, A., Motulla, G., Zakel, E., and Reichl, H., "Flip Chip Attachment Using Anisotropic Conductive Adhesives and Electroless Nickel Bumps," Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, Oct. 14-16, 1996, pp. 26-33.

Aschenbrenner, R., Zakel, E., Azdasht, G., Kloeser, A., and Reichl, H., "Fluxless Flip Chip Bonding on Flexible Substrates: A Comparison Between Adhesive Bonding and Soldering," 1995 Surface Mount International Conference Proceedings of the Technical Program, San Jose, CA, Aug. 29-31, 1995, pp. 91-101.

Aschenbrenner, R., Zakel, E., Azdasht, G., Kloeser, A., and Reichl, H., "Fluxless Flip-chip Bonding on Flexible Substrates: A Comparison between Adhesive Bonding and Soldering," Soldering & Surface Mount Technology, vol. 8 no. 2, pp. 5-11, 1996.

Aschenbrenner, Rolf, Ostmann, Andreas, Motulla, Gerald, Zakel, Elke, and Reichl, Herbert, "Flip Chip Attachment Using Anisotropic Conductive Adhesives and Electroless Nickel Bumps," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C, vol. 20 no. 2, pp. 95-100, Apr. 1997.

Ashida. Kisho, Kawano, Kenya, Tanaka, Naotaka, Nishikizawa, Atsushi, and Koike, Nobuya, "Strength Evaluation of Conductive Adhesive Paste for Die Bonding during Reflow Soldering," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 825-831.

Ashiru, O. A., "Morphological and Hardness Properties of Bright and Leveled Silver Electrodeposit," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Ashkhotov, O. G., Ashkhotova, I. B., and Krymshokalova, D. A., "On the Mechanism of Electron-Stimulated Formation of a Nanosize C-Sn Coating on a Tin Surface," Physics of Metals and Metallography, vol. 110 no. 6, pp. 553-556, Dec. 2010. https://doi.org/10.1134/S0031918X10120057

Ashmore, Clive, and Zahn, Michael, "Improvements in Pb-free Stencils," Circuits Assembly, vol. 17 no. 12, pp. 26, 28-29, Dec. 2006.

Ashmore, Clive, and Goldsmith, Rick, "Investigating Mass Imaging Lead Free Materials Using Enclosed Print Head Technology," 2002 NEPCON West - Fiberoptic Expo Conference Proceedings , 2002, pp. 308-314.

Ashmore, Clive, "Mass Imaging of Lead Free Materials - What Impact Does Stencil Technology Have?," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 734-737.

Ashmore, Clive, "Mass Imaging Performance with Lead-free Solder," Surface Mount Technology (SMT), vol. 18 no. 11, pp. xx-xx, Nov. 2004.

Ashmore, Clive, "Optimizing the Print Process for Lead Free Manufacturing," IPC Review , vol. 48 no. 1, pp. 7, Jan. 2007.

Ashmore, Clive, "Optimizing the Print Process for Robust Lead-Free Manufacturing," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Ashmore, Clive, "Optimizing the Print Process for Lead Free Manufacturing," Route , Jan. 2007.

Ashmore, Clive, "The business of lead-free assembly," emsnow, Mar. 10, 2005.

Ashmore, Clive, "Understanding Pb-Free Stencil Requirements," Circuits Assembly , vol. 17 no. 2, pp. 44-45, 47-49, Feb. 2006.

Ashmore, Clive, "Understanding Stencil Requirements for a Lead Free Mass Imaging Process," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S23-03-1-S23-03-11.

Ashmore, Clive, "Understanding stencil requirements for a lead-free mass imaging process," Global SMT and Packaging, vol. 6 no. 2, pp. 10, 12, 14, 16, 18, Feb. 2006.

Ashmore, Clive, "Understanding stencil requirements for a lead-free mass-imaging process," Dataweek, vol. xx no. xx, pp. xx-xx, Nov. 1, 2006.

Ashmore, Clive, "Will your printing process be affected by Pb-free?," Circuits Assembly, vol. 16 no. 3, pp. 22, Mar. 2005.

Ashmore, Clive, "Will Your Printing Process Be Affected by Pb-Free?," Lead-Free Magazine, vol. 5, 2005.

Ashtiani, Fama Ghaffari, George, Allen Jose, Heinrich, Thomas, Wolfangel, Simon, Shirangi, Hossein, and Klein, Christian, "Solder Joint Reliability Investigation of Chip Scale Package with Plastic Core Solder Balls on Thermomechanically Loaded PCBs," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 244-250.

Ashworth, M. A., Haspel, D., Wu, L., Wilcox, G. D., and Mortimer, R. J., "An Investigation into the Effect of a Post-electroplating Electrochemical Oxidation Treatment on Tin Whisker Formation," Journal of Electronic Materials, vol. 44 no. 1, pp. 442-456, Jan. 2015.

Ashworth, M. A., Wilcox, G. D., Higginson, R. L., Heath, R. J., and Liu, C., "Effect of direct current and pulse plating parameters on tin whisker growth from tin electrodeposits on copper and brass substrates," Transactions of the IMF, vol. 91 no. 5, pp. 260-268, 2013. https://doi.org/10.1179/0020296713Z.000000000116

Ashworth, M. A., Pearson, H., Wilcox, G. D., Bao, X., and Brightwell, C., "The Development of a Tin-Whisker Mitigating Conformal Coating," 8th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Noordwijk, the Netherlands, May 10-12, 2017, pp. xx-xx.

Ashworth, M. A., Wilcox, G. D., Higginson, R. L., Heath, R. J., Liu, C., and Mortimer, R. J., "The effect of electroplating parameters and substrate material on tin whisker formation," Microelectronics Reliability, vol. 55 no. 1, pp. 180-191, Jan. 2015.

Ashworth, Mark A., Wilcox, Geoffrey D., Higginson, Rebecca L., Heath, Richard J., and Liu, Changqing, "An Investigation into Zinc Diffusion and Tin Whisker Growth for Electroplated Tin Deposits on Brass," Journal of Electronic Materials, vol. 43 no. 4, pp. 1005-1016, Apr. 2014.

Ashworth, Mark Andrew, and Dunn, Barrie, "An investigation of tin whisker growth over a 32-year period," Circuit World, vol. 42 no. 4, pp. 183-196, 2016.

Askari, Davood, and Feng, Gang, "Finite element analysis of nanowire indentation on a flat substrate," Journal of Materials Research, vol. 27 no. 3, pp. 586-591, Feb. 14, 2012.

Askham, Cecilia, "REACH and LCA--methodological approaches and challenges," International Journal of Life Cycle Assessment, vol. 17 no. 1, pp. 43-57, Jan. 2012.

Ashkhotov, O. G., Ashkhotova, I. B., and Krymshokalova, D. A., "On the Mechanism of Electron-Stimulated Formation of a Nanosize C-Sn Coating on a Tin Surface," Physics of Metals and Metallography, vol. 110 no. 6, pp. 553-556, Dec. 2010. https://doi.org/10.1134/S0031918X10120057

Asom, M. T., Kortan, A. R., Kimerling, L. C., and Farrow, R. C., "Structure and stability of metastable a-Sn," Applied Physics Letters , vol. 55 no. 14, pp. 1439-1441, Oct. 2, 1989.

Aspandiar, Raiyo F., "Voids in Solder Joints," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 406-413.

Aspandiar, Raiyo F., "Voids in Solder Joints," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 406-413.

Aspandiar, Raiyo F., "Voids in Solder Joints," Journal of SMT, vol. 19 no. 4, pp. 28-36, 2006.

Asrar, Nausha, "Detrimental Effects of Excessive Gold Plating on Lead-Free Solder Joints," Journal of Failure Analysis and Prevention, vol. 10 no. 1, pp. 50-55, Feb. 2010.

Asrar, Nausha, "Detrimental Effects of Excessive Gold Plating on Lead-Free Solder Joints," Electronic Device Failure Analysis, vol. 13 no. 1, pp. 4,6-8,10-11, Feb. 2011.

Asrar, Nausha, "Solder/Metallization Interdiffusion - Case Studies," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 384-388.

Asrar, Nausha, Vancauwenberghe, Oliver, and Prangere, Sebastien, "Tin Whiskers Formation on an Electronic Product: A Case Study," Journal of Failure Analysis and Prevention, vol. 7 no. 3, pp. 179-182, June 2007.

Asri, Asma Kamarul, and Hamzah, Esah, "Corrosion Behaviour of Lead-free and Sn-Pb Solders in 3.5wt% NaCl," Advanced Materials Research, vol. 686, pp. 250-260, Apr. 2013.

Asryan, N. A., and Mikula, A., "Thermodynamic Properties of Bi-Sn Melts," Inorganic Materials, vol. 40 no. 4, pp. 386-390, Apr. 2004.

Asryan, Nadezhda, and Mikula, Adolf, "Thermodynamic properties of liquid Bi-Sn alloys," Zeitschrift fur Metallkunde, vol. 95 no. 3, pp. 132-135, Mar. 2004.

Asthana, R., "Capillarity in Composite Fabrication," Key Engineering Materials , vol. 151-152, pp. 86-135, 1998.

Aston, Adam, Reinhardt, Andy, and Tiplady, Rachel, "Europe's Push for Less-Toxic Tech," BusinessWeek online, Aug. 9, 2005.

Astrom, Anders, "The Effect of Nitrogen Reflow Soldering in a Lead-Free Process," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 715-721.

Athamneh, Raed Al, Abueed, Mohammed, Hani, Dania Bani, and Hamasha, Sa'd, "Effect of Aging on SAC305 Solder Joints Reliability in Accelerated Fatigue Shear Test," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Athamneh, Raed Al, Abueed, Mohammed, Hani, Dania Bani, Su, Sinan, Hamasha, Sa'd, Suhling, Jeffery, and Lall, Pradeep, "Effect of Aging on the Fatigue Life and Shear Strength of SAC305 Solder Joints in Actual Setting Conditions," 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , Las Vegas, NV, May 28-31, 2019, pp. 1146-1154.

Athamneh, Raed Al, and Hamasha, Sa'd, "Fatigue Behavior of SAC-Bi and SAC305 Solder Joints With Aging," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 10 no. 4, pp. 611-620, Apr. 2020.

Athamneh, Raed Al, Hani, Dania Bani, Ali, Haneen, and Hamasha, Sa'd, "Fatigue Life Degradation Modeling of SnAgCu Solder Joints After Aging," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 10 no. 7, pp. 1175-1184, July 2020.

Atkinson, Phil, "The Impact of Pb-free on Processes and Equipment," SMART Group Ireland Lead-free Seminar, Dublin, Ireland, Oct. 22, 2003.

Atlee, Jennifer, and Kirchain, Randolph, "Operational Sustainability Metrics Assessing Metric Effectiveness in the Context of Electronics-Recycling Systems," Environmental Science & Technology, vol. 40 no. 14, pp. 4506-4513, 2006.

Attada, Bhargava, and Oberoi, Mandeep Singh, "Sanctions Against Sn/Pb Solder Paste," Surface Mount Technology , vol. 17 no. 9, pp. 64-65, Sept. 2003.

Attanasio, Claudia, and Colloca, Laura, "PVC improvement: a new range of eco-compounds," Wire Journal International, vol. 41 no. 3, pp. 80-85, Mar. 2008.

Aubry, S., and Ortiz, M., "The Mechanics of Deformation-Induced Subgrain-Dislocation Structures in Metallic Crystals at Large Strains," Proceedings: Mathematical, Physical and Engineering Sciences, vol. 459 no. 2040, pp. 3131-3158, Dec. 8, 2003.

Aucot, Michael, "Compact Fluorescent Bulbs and Mercury Pollution: Using Material Flow Analysis to Prioritize Concerns," Journal of Industrial Ecology, vol. 13 no. 5, pp. 658-661, Oct. 2009.

Augis, J. A., DeNure, D. G., LuValle, M. J., Mitchell, J. P., Pinnel, M. R., and Welsher, T. L., "A Humidity Threshold for Conductive Anodic Filaments in Epoxy Glass Printed Wiring Boards," 3rd International SAMPE Electronics Conference, Volume 3, Los Angeles, CA, June 20-22, 1989, pp. 1023-1030.

Aurelio, G., Sommadossi, S. A., and Cuello, G. J., "Crystal Structure of Cu-Sn-In Alloys Around the n-Phase Field Studied by Neutron Diffraction," Journal of Electronic Materials, vol. 41 no. 11, pp. 3223-3231, Nov. 2012.

Aurelio, G., Sommadossi, S. A., and Cuello, G. J., "Neutron diffraction study of stability and phase transitions in Cu-Sn-In alloys as alternative Pb-free solders," Journal of Applied Physics , vol. 112 no. 5, pp. 053520-1-053520-7, Sept. 1, 2012.

Austen, Paul, "Sensitive Component Degradation," Surface Mount Technology (SMT) , vol. 23 no. 3, pp. 15, May/June 2009.

Austin, A. E., Richard, N. A., and Wood, Van E., "Surface and Grain-Boundary Diffusion of Gold-Copper," Journal of Applied Physics, vol. 37 no. 10, pp. 3650-3658, Sept. 1966.

Austin, Timothy B., "WEEE and RoHS - Environmental Design Strategies," Society of Plastics Engineers Annual Technical Conference 2006 ANTEC 2006 Conference Proceedings, Volume 4, Charlotte, NC, May 7-11, 2006, pp. 1829-1831.

Avery, William F., and Baskin, Philip A., "The Performance of Fluxes and Lead-Free Solder Alloys In Soldering of Aluminum," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 16-18, 2012, pp. xx-xx.

Avigal, Y., and Schieber, M., "Hollow Whiskers of Silicon Grown by Pyrolysis of Alkyl-Silicon Compounds on Polycrystalline Quartz Substrates," Journal of Crystal Growth, vol. 26 no. 1, pp. 157-161, Nov. 1974.

Avila, German, "Design for Compliance," Appliance Design, vol. 53 no. 11, pp. 38-39, Nov. 2005.

Avila, German, "Looking Beyond RoHS and WEEE," IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies, Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.

Avila, German, "LOOKING beyond RoHS and WEEE," Electronics Manufacture and Test , pp. xx-xx, June 2006.

Avila, German, "Product Development for RoHS and WEEE Compliance," Surface Mount Technology (SMT), vol. 20 no. 5, pp. 28-31, May 2006.

Avila, Robert, "It seems that everyone can do lead-free rework, so what is the big deal?," Lead-Free Magazine.

Avram, Adrian, Carstea, Horea, Tanase, Mihail, Lie, Ioan, and Babaita, Mircea, "The Impact of Manufacturing Issues above Lead Free Soldering Alloys," 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, Vienna, Austria, May 19-20, 2005, pp. 293-297.

Avrami, Melvin, "Kinetics of Phase Change, I: General Theory," Journal of Chemical Physics, vol. 7 no. 12, pp. 1103-1112, Dec. 1939.

Avrami, Melvin, "Kinetics of Phase Change, II: Transformation-Time Relations for Random Distribution of Nuclei," Journal of Chemical Physics, vol. 8 no. 2, pp. 212-224, Feb. 1940.

Aw, Jie Li, Lee, Jong Bum, Jaafar, Norhanani, Ding, Mian Zhi, Lim, Li-Shiah, Choong, Chong Ser, and Rao, Vempati Srinivasa, "Low Temperature Bonding Studies of Au-Studs and AuSn-Solder Bumps on Au-Surface using Ultrasonic Energy," 2013 IEEE 15th Electronics Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp. 384-388.

Awe, O. E., and Oshakuade, O. M., "Theoretical prediction of thermodynamic activities of all components in the Bi-Sb-Sn ternary lead-free solder system and Pb-Bi-Sb-Sn quaternary system," Thermochimica Acta, vol. 589, pp. 47-55, Aug. 10, 2014.

Ayari-Kanoun, A., Oberson, V., Paquin, I., Fortin, C., Fontaine, R., Danovitch, D., and Drouin, D., "Study of influential parameters for Lead-Free Flip chip solder joint cracking," 2013 European Microelectronics Packaging Conference, Grenoble, France, Sept. 9-12, 2013, pp. xx-xx.

Ayers, J. E., and Ghandhi, S. K., "The Epitaxy of Germanium on Gallium Arsenide," Journal of Crystal Growth, vol. 89 no. 4, pp. 371-377, July 1, 1988.

Aygun, Kemal, "Electrical Impacts of Halogen-Free Substrates," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Azizsoltani, Hamoon, and Haldar, Achintya, "Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept," Journal of Electronic Packaging, vol. 140 no. 4, pp. 041003-1-041003-11, Dec. 2018.

Azlina, O.Saliza, Ourdjini, A., and Hanim, M. A. Azmah, "The effect of nickel doping on SAC305 lead-free solders and EN(B)EPIG surface finish," 2014 IEEE 36th International Electronics Manufacturing Technology Conference, Johor, Malaysia , Nov. 11-13, 2014, pp. xx-xx.

Azpeitia, L. A., Gervasi, C. A., and Bolzan, A. E., "Electrochemical aspects of tin electrodeposition on copper in acid solutions," Electrochimica Acta, vol. 298, pp. 400-412, Mar. 1, 2019.

Azuma, Keisuke, Sakajiri, Koichi, Matsumoto, Hidetoshi, Kang, Sungmin, Watanabe, Junji, and Tokita, Masatoshi, "Facile fabrication of transparent and conductive nanowire networks by wet chemical etching with an electrospun nanofiber mask template," Materials Letters, vol. 115, pp. 187-189, Jan. 15, 2014.

BBBB

Baated, Alongheng, Kim, Keun-Soo, and Suganuma, Katsuaki, "Effect of intermetallic growth rate on spontaneous whisker growth from a tin coating on copper," Journal of Materials Science: Materials in Electronics, vol. 22 no. 11, pp. 1685-1693, Nov. 2011.

Baated, Alongheng, Kim, Keun-Soo, Suganuma, Katsuaki, Huang, Sharon, Jurcik, Benjamin, Nozawa, Shigeyoshi, and Ueshima, Minoru, "Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu solders," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Baated, Alongheng, Kim, Keun-Soo, Suganuma, Katsuaki, Huang, Sharon, Jurcik, Benjamin, Nozawa, Shigeyoshi, Stone, Bryan, and Ueshima, Minoru, "Effects of Reflow Atmosphere and Flux on Tin Whisker Growth of Sn-Ag-Cu Solder," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 802-808.

Baated, Alongheng, Kim, Keun-Soo, Suganuma, Katsuaki, Huang, Sharon, Jurcik, Benjamin, Nozawa, Shigeyoshi, and Ueshima, Minoru, "Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu solders," Journal of Materials Science: Materials in Electronics, vol. 21 no. 10, pp. 1066-1075, Oct. 2010.

Baated, Alongheng, Kim, Keun-Soo, and Suganuma, Katsuaki, "Investigation of Mechanism for Spontaneous Zinc Whisker Growth from an Electroplated Zinc Coating," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1019-1022.

Baated, Alongheng, Jiang, Junxiang, Kim, Keun-Soo, Suganuma, Katsuaki, Huang, Sharon, Jurcik, Benjamin, Nozawa, Shigeyoshi, and Ueshima, Minoru, "Sn-Ag-Cu Soldering Reliability as Influenced by Process Atmosphere," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 1, pp. 38-43, Jan. 2010.

Baated, Alongheng, Jiang, Junxiang, Kim, Keun-Soo, Suganuma, Katsuaki, Huang, Sharon, Jurcik, Benjamin, Nozawa, Shigeyoshi, and Ueshima, Minoru, "Sn-Ag-Cu Soldering Reliability Influenced by Process Atmosphere," International Symposium on High Density Packaging and Microsystem Integration , Shanghai, China, June 26-28, 2007, pp. xx-xx.

Baated, Alongheng, Hamasaki, Kyoko, Kim, Sun Sik, Kim, Keun-Soo, and Suganuma, Katsuaki, "Whisker Growth Behavior of Sn and Sn Alloy Lead-Free Finishes," Journal of Electronic Materials, vol. 40 no. 11, pp. 2278-2289, Nov. 2011.

Baated, Alongheng, Kim, Keun-Soo, and Suganuma, Katsuaki, "Whisker growth from an electroplated zinc coating," Journal of Materials Research, vol. 25 no. 11, pp. 2175-2182, Nov. 2010.

Baba, Shunji, "Low Cost Flip Chip Technology for Organic Substrates," 1997 Proceedings 47th Electronic Components & Technology Conference, San Jose, CA, May 18-21, 1997, pp. 268-273.

Babaghorbani, P., Nai, S. M. L., and Gupta, M., "Development of lead-free Sn-3.5Ag/SnO2 nanocomposite solders," Journal of Materials Science: Materials in Electronics, vol. 20 no. 6, pp. 571-576, June 2009.

Babaghorbani, P., and Gupta, M., "Enhancing the Mechanical Response of a Lead-Free Solder Using an Energy-Efficient Microwave Sintering Route," Journal of Electronic Materials, vol. 37 no. 6, pp. 860-866, June 2008.

Babaghorbani, P., Nai, S. M. L., and Gupta, M., "Integrating copper at the nanometer length scale with Sn-3.5Ag solder to develop high performance nanocomposites," Materials Science and Technology, vol. 25 no. 10, pp. 1258-1264, Oct. 2009.

Babaghorbani, P., Nai, S. M. L., and Gupta, M., "Reinforcements at nanometer length scale and the electrical resistivity of lead-free solders," Journal of Alloys and Compounds, vol. 478 no. 1-2, pp. 458-461, June 10, 2009.

Babbitt, Callie W., and Ryen, Erinn, "Bridging the Gap in Forward and Reverse Supply Chains for Evolving Electronic Products," 2010 IEEE International Symposium on Sustainable Systems and Technology, Arlington, VA, May 17-19, 2010, pp. xx-xx.

Babbitt, Callie, Kahhat, Ramzy, and Willliams, Eric, "Disposition flows and management of end-of-life computers from U.S. universities," Life Cycle Assessment VIII, Seattle, WA, Sept. 30-Oct. 2, 2008, pp. xx-xx.

Babbitt, Callie W., Williams, Eric, and Kahhat, Ramzy, "Institutional Disposition and Management of End-of-Life Electronics," Environmental Science & Technology, vol. 45 no. 12, pp. 5366-5372, June 15, 2011.

Baber, Forrest, and Guven, Ibrahim, "Solder Joint Fatigue Life Prediction of Electronic Packages Using Combined FEA and Peridynamics," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 225-231.

Baber, Forrest, and Guven, Ibrahim, "Solder joint fatigue life prediction using peridynamic approach," Microelectronics Reliability, vol. 79, pp. 20-31, Dec. 2017.

Babu, Balakrishnan Ramesh, Parande, Anand Kuber, and Basha, Chiya Ahmed, "Electrical and electronic waste: a global environmental problem," Waste Management and Research, vol. 25 no. 4, pp. 307-318, Aug. 2007.

Babu, J. Bubesh, and Yoh, Kanji, "Effect of As/In-flux on the growth of InAs nanowire by molecular beam epitaxy," Journal of Crystal Growth, vol. 323 no. 1, pp. 301-303, May 15, 2011.

Babu, J. Bubesh, and Yoh, Kanji, "Growth rate enhancement of InAs nanowire by molecular beam epitaxy," Journal of Crystal Growth, vol. 322 no. 1, pp. 10-14, May 1, 2011.

Bacconnier, B., Lormand, G., Papapietro, M., Achard, M., and Papon, A.-M., "A study of heating rate and texture influences on annealing hillocks by a statistical characterization of Al thin-film topography," Journal of Applied Physics, vol. 64 no. 11, pp. 6483-6489, Dec. 1, 1988.

Bacigalupi, Robert J., "Effect of Magnetic Field on Iron Whisker Growth," Journal of Applied Physics, vol. 34, pp. 999-1000, 1963.

Badan, Juan A., Marotti, Ricardo E., Dalchiele, Enrique A., Ariosa, Daniel, Martin, Francisco, Leinen, Dietmar, Ochoa, Efrain, and Ramos-Barrado, Jose R., "Optical properties of Si nanowires: Dependence on substrate crystallographic orientation and light polarization," Journal of Materials Research , vol. 30 no. 6, pp. 753-760, Mar. 28, 2015.

Bader, W. G., "Dissolution and Formation of Intermetallics in the Soldering Process," Physical Metallurgy of Metal Forming, St. Louis, Missouri, Oct. 16-17, 1980, pp. 257-268.

Bader, W. G., "Identification of Fused Tin Coatings On Integrated Circuit Device Leads," Plating and Surface Finishing, vol. 64 no. 8, pp. 56-57, Aug. 1977.

Bader. W. G., "Soldering, the Essential Link in Electronics," Lead-Zinc-Tin '80 , Las Vegas, NV, Feb. 24-28, 1980, pp. 939-950.

Badwe, Nilesh, Byrd, Kevin, Jin, Ou, and Goonetilleke, Pubudu, "Sn-Bi Low-Temperature Homogeneous Solder Joint Microstructure, Reliability and Failure Mechanism," Printed Circuit Design and Fab/ Circuits Assembly, vol. 37 no. 2, pp. 50-55, Feb. 2020.

Badwe, Nilesh, "Sn-Bi Solder Paste Supply Chain Overview," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. xx-xx.

Badwe, Nilesh, Stafford, Jason, Cook, Jeff, Sidhu, Rajen, and Goonetilleke, Pubudu, "Thermal Cycle and Drop Shock Performance of Homogeneous Tin-Bismuth and Tin-Silver-Copper Solder Joints," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 451-456.

Badwe, Nilesh, Byrd, Kevin, Jin, Ou, and Goonetilleke, Pubudu, "Tin-Bismuth Low Temperature Homogeneous Second Level Interconnect Solder Joint Microstructure, Reliability, and Failure Mechanism," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 507-512.

Bae, Ho-Eun, Choi, Kwang-Seong, Bae, Hyun-Cheol, Eom, Yong-Sung, and Bae, Dong-sik, "Fine-Pitch, Low-volume SoP(Solder-on-Pad) Process," 2012 IEEE 14th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 5-7, 2012, pp. 723-727.

Bae, Hyun-Cheol, Lee, Haksun, Eom, Yong-Sung, and Choi, Kwang-Seong, "Novel Low-Volume Solder-on-Pad for Fine Pitch Cu Pillar Bump," 2013 European Microelectronics Packaging Conference, Grenoble, France, Sept. 9-12, 2013, pp. xx-xx.

Bae, Joonho, Kulkarni, Niraj N., Zhou, Ji Ping, Ekerdt, John G., and Shih, Chih-Kang, "VLS growth of Si nanocones using Ga and Al catalysts," Journal of Crystal Growth, vol. 310 no. 20, pp. 4407-4411, Oct. 1, 2008.

Bae, K.-S., and Kim, S.-J., "Interdiffusion Analysis of the Soldering Reactions in Sn-3.5Ag/Cu Couple," Journal of Electronic Materials, vol. 30 no. 11, pp. 1452-1457, Nov. 2001.

Bae, Kyoo-Sik, and Kim, Si-Jung, "Microstructure and adhesion properties of Sn-0.7Cu/Cu solder joints," Journal of Materials Research, vol. 17 no. 4, pp. 743-746, Apr. 2002.

Baek, Hyun Moo, Jin, Young Gwan, Hwang, Sun Kwang, Im, Yong-Taek, Son, Il-Heon, and Lee, Duk-Lak, "Numerical study on the evolution of surface defects in wire drawing," Journal of Materials Processing Technology, vol. 212 no. 4, pp. 776-785, Apr. 2012.

Baek, Rock-Hyun, Baek, Chang-Ki, Choi, Hyun-Sik, Lee, Jeong-Soo, Yeoh, Yun Young, Yeo, Kyoung Hwan, Kim, Dong-Won, Kim, Kinam, Kim, Dae M., and Jeong, Yoon-Ha, "Characterization and Modeling of 1/f Noise in Si-nanowire FETs: Effects of Cylindrical Geometry and Different Processing of Oxides," IEEE Transactions on Nanotechnology, vol. 10 no. 3, pp. 417-423, May 2011.

Baek, Sung-min, Park, Yujin, Oh, Cheolmin, Chun, Eun-joon, and Kang, Namhyun, "Modeling and Experimental Verification of Intermetallic Compounds Grown by Electromigration and Thermomigration for Sn-0.7Cu Solders," Journal of Electronic Materials, vol. 48 no. 1, pp. 142-151, Jan. 2019.

Baek, Yong-Ho, Chung, Bo-Mook, Choi, Young-Sik, Choi, Jaeho, and Huh, Joo-Youl, "Effects of Ni3Sn4 and (Cu,Ni)6Sn5 intermetallic layers on cross-interaction between Pd and Ni in solder joints," Journal of Alloys and Compounds , vol. 579, pp. 75-81, Dec. 5, 2013.

Bag, Rajesh K., Lohani, J., Tyagi, R., Pandya, D. K., and Singh, R., "MOVPE growth of in situ Ga catalyzed AlGaAs nanowires on sapphire substrate," Journal of Materials Science: Materials in Electronics, vol. 27 no. 3, pp. 2335-2341, Mar. 2016.

Bagal, Vivekanand S., Patil, Girish P., Suryawanshi, Sachin R., More, Mahendra A., and Chavan, Padmakar G., "Vapour-liquid-solid-assisted growth of cadmium telluride nanowires and their field emission properties," IET Micro & Nano Letters, vol. 11 no. 3, pp. 160-163, Mar. 2016.

Baggerman, A. F. J., and Batenburg, M. J., "Reliable Au-Sn Flip Chip Bonding on Flexible Prints," 1994 Proceedings 44th Electronic Components & Technology Conference, Washington, D.C., May 1-4, 1994, pp. 900-905.

Baggerman, Antal F. J., and Batenburg, Martin J., "Reliable Au-Sn Flip-Chip Bonding on Flexible Prints," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, vol. 18 no. 2, pp. 257-263, May 1995.

Baggio, Thomas J., Suetsugu, Kenichiro, and Okumura, Takeo, "Challenges and Solutions for Lead-Free Soldering of Large PCB Assembly," APEX 2000, Long Beach, CA, Mar. 14-16, 2000, pp. P-MT3/1-1-P-MT#/1-7.

Baggio, Tom, "Case Studies of Lead-Free Technology Implemented in Panasonic Electronic Products," Proceedings of the Technical Program NEPCON West 2000, Volume 1, Anaheim, CA, Feb. 29-Mar. 2, 2000. pp. 451-469.

Baggio, Tom, and Suetsugu, Kenichiro, "Guidelines for Lead-free Processing," Surface Mount Technology (SMT), vol. 13 no. 9, pp. 60-66, Sept. 1999.

Baghchesara, Mohammad Amin, Cheraghizade, Mohsen, and Yousefi, Ramin, "Growth and characterization of ZnTe nanowires grown in a large scale by a CVD method," Materials Letters, vol. 162, pp. 195-198, Jan. 1, 2016.

Baghchesara, Mohammad Amin, Cheraghizade, Mohsen, Jamali-Sheini, Farid, and Yousefi, Ramin, "Photovoltaic and photodetector performance of metal telluride nanowires grown by a simple CVD method," Journal of Materials Science: Materials in Electronics, vol. 28 no. 5, pp. 4475-4480, Mar. 2017.

Bagheri, S., Snugovsky, P., Bagheri, Z., Hamilton, C., McCormick, H., and Romansky, M., "Low Melting Alloys: A New Solution to Lead Free Rework Process Issues," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 341-348.

Bagheri, S., Snugovsky, P., Bagheri, Z., Hamilton, C., and McCormick, H., "Solder Joint Microstructure and Reliability Study of Plastic Ball Grid Array (PBGA196) and Micro Lead Frame (MLF) Components in Lead Free Processes," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

Bagheri, S., Snugovsky, P., Bagheri, Z., Hamilton, C., and McCormick, H., "Solder Joint Microstructure and Reliability Study of Plastic Ball Grid Array (PBGA196) and Micro Lead Frame (MLF20) Components in Lead Free Processes," Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb. 10-12, 2009, pp. 269-279.

Bagheri, Simin, Snugovsky, Polina, Bagheri, Zohreh, Romansky, Marianne, Kelly, Matthew, Cole, Marie, Interrante, Mario, Matin, Gregory, and Bergeron, Christian, "Solder Joint Microstructure and Reliability Study of Ceramic Ball Grid Array (CBGA) Components," International Conference on Lead-free Soldering , Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Bagheri, Simin, Snugovsky, Polina, Bagheri, Zohreh, Hamilton, Craig, and McCormick, Heather, "Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Lead Free Alloys," International Conference on Soldering and Reliability , Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Bagheri, Simin, Snugovsky, Polina, Bagheri, Zohreh, Hamilton, Craig, and McCormick, Heather, "Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Lead Free Alloys," 2008 SMTA International Conference Proceedings , Orlando, FL, Aug. 17-21, 2008, pp. 586-596.

Bagheri, Simin, Snugovsky, Polina, Bagheri, Zohreh, Hamilton Craig, and McCormick, Heather, "Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys," Circuits Assembly, vol. 19 no. 9, pp. 46-48,62, Sept. 2008.

Bagheripoor, Mahdi, and Klassen, Robert, "Effect of crystal orientation on the size effects of nano-scale fcc metals," Materials Science and Technology, vol. 36 no. 17, pp. 1829-1850, 2020. https://doi.org/10.1080/02670836.2020.1839193

Bagnetto, Laura Angela, "Getting the Lead Out: Rapid tooling process speeds CT equipment upgrade," Medical Product Manufacturing News, pp. xx-xx, July 2003.

Bahari, Zahra, Elgadi, Mohamed, Rivet, Jacques, and Dugue, Jerome, "Experimental study of the ternary Ag-Cu-In phase diagram," Journal of Alloys and Compounds, vol. xxx no. x-x, pp. xxx-xxx, xxxx.

Baheti, Varun A., Kumar, Praveen, and Paul, Aloke, "Effect of Au, Pd and Pt addition in Cu on the growth of intermetallic compounds and the Kirkendall voids in the Cu-Sn system," Journal of Materials Science: Materials in Electronics, vol. 28 no. 22, pp. 17014-17019, Nov. 2017.

Baheti, Varun A., Kashyap, Sanjay, Kumar, Praveen, Chattopadhyay, Kamanio, and Paul, Aloke, "Solid-state diffusion-controlled growth of the intermediate phases from room temperature to an elevated temperature in the Cu-Sn and the Ni-Sn systems," Journal of Alloys and Compounds, vol. 727, pp. 832-840, Dec. 15, 2017.

Bai, John G., Zhang, Zhiye Zach, Calata, Jesus N., and Lu, Guo-Quan, "Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 3, pp. 589-593, Sept. 2006.

Bai, Ning, Chen, Xu, and Fang, Zhou, "Effect of Strain Rate and Temperature on the Tensile Properties of Tin-Based Lead-Free Solder Alloys," Journal of Electronic Materials, vol. 37 no. 7, pp. 1012-1019, July 2008.

Bai, Ning, Chen, Xu, and Gao, Hong, "Simulation of uniaxial tensile properties for lead-free solders with modified Anand model," Materials and Design, vol. 30 no. 1, pp. 122-128, Jan. 2009.

Bai, Ning, Chen, Xu, and Li, Xin, "Torsional Fatigue of 63Sn-37Pb and Sn-0.7Cu Solders," Key Engineering Materials, vol. 353-358, pp. 2908-2911, 2007.

Bai, Xiaohui, and Wen, Dianzhong, "Study on Fabrication Pt nanowires for memristor," Applied Mechanics and Materials, vol. 58-60, pp. 513-517, June 2011.

Baid, Chitra, and Wright, Roger N., "Flow stresses for the modeling of stainless steel and nickel wire drawing," Wire Journal International, vol. 37 no. 3, pp. 66-69, Mar. 2004.

Baig, Zaeem, Mirza, Fahad, Parekh, Hardik, and Agonafer, Dereje, "3-D Fracture Analysis of the BEoL Region of a Flip Chip Package During Die Attach Process," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 163-168.

Baig, Zaeem, Mirza, Fahad, Parekh, Hardik, and Agonafer, Dereje, "3-D Fracture Analysis of the BEoL Region of a Flip Chip Package During Die Attach Process," SMTAnews & Journal of Surface Mount Technology , vol. 27 no. 2, pp. 19-24, Apr.-June 2014.

Baig, Zaeem, Shetty, Tejas S., Sakib, A R. Nazmus, Mirza, Fahad, and Agonafer, Dereje, "Impact of Replacing Sn-Ag Bumps with Cu pillars on the BEoL Cu/Low-k Fracture Under Reflow - A Computational Study," 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 27-30, 2014, pp. 473-477.

Bailey, C., Lu, H., Yin, C., and Stoyanov, S. "Modelling the Reliability of Green Electronic Interconnects," Proceedings of 2004 International IEEE Conference on the Asian Green Electronics, Hong Kong, China, Jan 5-9, 2004, pp. 63-67.

Bailey, Chris, Stoyanov, Stoyan, Best, Chris, Yin, Chunyan, Alam, M. O., Tollafield, Peter, Stewart, Paul, and Roulston, John, "Assessment of Refinishing Processes for Electronic Components in High Reliability Applications," 2013 IEEE 15th Electronics Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp. 156-161.

Bailey, Chris, "Impact of Lead-Free Components and Technology Scaling for High Reliability Applications," 18th Annual Pan Pacific Microelectronics Symposium , Wailea-Makena, HI, Jan. 22-24, 2013, pp. xx-xx.

Bajad, Nupur, Kulkarni, Harshada, Dhole, Satish, Thakur, Shiwani, and Tonapi, Sandeep, "Effect of Solder Joint Size on Fatigue Life of WL-CSP under Accelerated Thermal Cycling Using FEM," 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 27-30, 2014, pp. 1145-1153.

Bajat, J. B., Miskovic-Stankovic, V. B., Maksimovic, M. D., Drazic, D. M., and Zec, S., "Electrochemical deposition and characterization of Zn-Co alloys and corrosion protection by electrodeposited epoxy coating on Zn-Co alloy," Electrochimica Acta, vol. 47 no. 25, pp. 4101-4112, Sept. 25, 2002.

Bajat, J. B., Stankovic, S., and Jokic, B. M., "Electrochemical deposition and corrosion stability of Zn-Co alloys," Journal of Solid State Electrochemistry, vol. 13 no. 5, pp. 755-762, May 2009.

Bajkowski, Julian, "Zinc whiskers tangle data centre ops," ComputerWorld, vol. xx no. xx, pp. xx, Feb. 12, 2004.

Bakan, Gokhan, Khan, Niaz, Cywar, Adam, Cil, Kadir, Akbulut, Mustafa, Gokirmak, Ali, and Silva, Helena, "Self-heating of silicon microwires: Crystallization and thermoelectric effects," Journal of Materials Research, vol. 26 no. 9, pp. 1061-1071, May 14, 2011.

Baker, G. S. "Angular Bends in Whiskers," Acta Metallurgica, vol. 5 no. 7, pp. 353-357, July 1957.

Baker, George S., "Growth Bends in Iron Whiskers," Journal of Applied Physics, vol. 27, pp. 1561-1562, 1956.

Baker, Gil, and Pops, Horace, "New perspectives on annealing analysis," Wire Journal International , vol. 37 no. 3, pp. 70-81, Mar. 2004.

Baker, R. G., and Holden, C. A., "Investigation Of Zinc-Nickel Alloy Electrodeposits - Part 1. Rack Plating," The 71st AES Annual Technical Conference Proceedings, New York, NY, July 1984, session N-2 pp. xx-xx.

Baker, Richard G., "Conclusion: Whisker Growth," Plating and Surface Finishing, vol. 74 no. 11, pp. 12, 66, Nov. 1987.

Baker, Richard G., "Spontaneous Metallic Whisker Growth," Plating and Surface Finishing , vol. 74 no. 10, pp. 10, Oct. 1987.

Baker, Richard G, and Holden, Clarence A, "Zinc-nickel alloy electrodeposits: rack plating," Plating and Surface Finishing, vol. 72 no. 3, pp. 54-57, Mar. 1985.

Bakhishev, Teymur, and Subramanian, Vivek, "Investigation of Gold Nanoparticle Inks for Low-Temperature Lead-Free Packaging Technology," Journal of Electronic Materials, vol. 38 no. 12, pp. 2720-2725, Dec. 2009.

Bakkali, S., Jazouli, T., Cherkaoui, M., EbnTouhami, M., El Hajjaji, N., and Chassaing, E., "Influence of M12 Organic Additive On the Electrodeposition of Tin From an Acid Sulfate Solution," Plating & Surface Finishing, vol. 90 no. 1, pp. 46-49, Jan. 2003.

Bakri, Sitty Nur Syafa, Surif, Salmijah, and Ramasamy, Rajeswari K., "A Case Study of Life Cycle Assessment (LCA) on Ballast for Fluorescent Lamp in Malaysia," 2008 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 19-21, 2008, pp. xx-xx.

Bakshi, Bhavik R., and Ukidwe, Nandan U., "The Role of Thermodynamics in Life Cycle Assessment of Existing and Emerging Technologies," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 15-20.

Balabas, M. V., Sushkov, A. O., and Budker, D., "Rubidium 'whiskers' in a vapour cell," Nature Physics, vol. 3 no. 2, pp. 2, Jan. 2007.

Balackyi, Joe, "Practical Solutions to Lead Free Reflow Soldering," LEADOUT Hands On Lead-Free Workshop, Manchester, United Kingdom, June 21, 2006.

Balakrisnan, B., Chum, C. C., Li, M., Chen, Z., and Cahyadi, T., "Fracture Toughness of Cu-Sn Intermetallic Thin Films," Journal of Electronic Materials, vol. 32 no. 3, pp. 166-171, Mar. 2003.

Balaraju, J. N., Selvi, V. Ezhil, and Rajam, K. S., "Electrochemical Behavior of Nanocrystalline Ni-P Alloys Containing Tin and Tungsten," Protection of Metals and Physical Chemistry of Surfaces , vol. 46 no. 6, pp. 686-691, Nov. 2010.

Balasbas, Victor, "EAS: Meeting the Total Lead-Free Challenge with Technology," U. S. Tech , vol. xx no. xx, pp. xx-xx, June 2006.

Baldwin, Daniel F., "Flip Chip Interconnection Using Copper Wire Bumps," Advanced Packaging, vol. 15 no. 3, pp. 44, Mar. 2006.

Baldwin, Daniel F., Deshmukh, Rajan D., and Hau, Christine S., "Gallium Alloy Interconnects for Flip-Chip Assembly Applications," 1996 Proceedings 46th Electronic Components & Technology Conference, Orlando, FL, May 28-31, 1996, pp. 1143-1150.

Baldwin, Daniel F., Deshmukh, Rajan D., and Hau, Christine S., "Gallium Alloy Interconnects For Flip-Chip Assembly Applications," IEEE Transactions on Components and Packaging Technologies, vol. 23 no. 2, pp. 360-366, June 2000.

Baldwin, Daniel F.,Hau, Christine S., and Deshmukh, Rajan D., "Preparation and Properties of Gallium Alloys for Use as Microelectronic Interconnect Materials," International Journal of Microcircuits and Electronic Packaging, vol. 19 no. 1, pp. 37-45, First Quarter 1996.

Baldwin, Daniel F., Baynham, Grant, Boustedt, Katarina, and Wennerholm, Claes, "Processing and Reliability of Flip Chip with Lead-Free Solders on Halogen-Free Microvia Substrates," Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium, San Jose, CA, July 17-18, 2002, pp. 310-315.

Baldwin, Daniel, and Kazmierowicz, Philip, "Taking the Pain Out of Lead-Free Reflow," Assembly, vol. xx no. xx, pp. xx-xx, Dec. 2003.

Baldwin, K. R., and Smith, C. J. E., "Advances in Replacements for Cadmium Plating in Aerospace Applications," Transactions of the Institute of Metal Finishing, vol. 74 no. 6, pp. 202-209, Nov. 1996.

Baldwin, K. R., and Smith, C. J. E., "Repair of Metal Coatings Using Environmentally Compliant Brush Plating Solutions," Plating & Surface Finishing, vol. 84. no. 7, pp. 23-28, July 1997.

Balela, Mary Donnabelle L., Yagi, Shunsuke, and Matsubara, Eiichiro, "Fabrication of Cobalt Nanowires by Electroless Deposition under External Magnetic Field," Journal Of The Electrochemical Society, vol. 158 no. 4, pp. D210-d216, 2011. doi 10.1149/1.3545065

Balela, Mary Donnabelle L., Yagi, Shunsuke, and Matsubara, Eiichiro, "Growth of Cobalt Nanowires under External Magnetic Field," Advanced Materials Research, vol. 911, pp. 136-140, Mar. 2014.

Balela, Mary Donnabelle L., Dulin, Lalaine M., Garcia, Erica A., and Tica, Ma. Janelle H., "Synthesis and Characterization of Cobalt-Nickel Nanowires Formed under External Magnetic Field," Applied Mechanics and Materials, vol. 799-800, pp. 120-124, Oct. 2015.

Bali, R., Fleury, E., Han, S. H., and Ahn, J. P., "Interfacial intermetallic phases and nanoeutectic in rapidly quenched Sn-Ag-Cu on Au under bump metallization," Journal of Alloys and Compounds, vol. 457 no. 1-2, pp. 113-117, June 12, 2008.

Baliga, John, "Can Nickel Barriers Eliminate Tin Whiskers?," Semiconductor International, vol. 27 no. 12, pp. 38, Nov. 1, 2004.

Baliga, John, "Nanotechnology Comes to the Lead-Free Rescue," Semiconductor International, vol. xx, no. xx, pp. 32, May 1, 2005.

Baliga, John, "The Emperor's New Lead-Free Clothes," Semiconductor International , vol. 23 no. 10, pp. 21, Sept. 2000.

Baliga, John, "Tin for No-Lead Solder," Semiconductor International, vol. 22 no. 8, pp. 74, July 1999.

Baljko, Jennifer, "RoHS worries unabated," Electronics Supply & Manufacturing , Sept. 2006.

Baljko, Jennifer, "RoHS worries unabated," Green SupplyLine, Sept. 1, 2006.

Balkan, H., Vrtis, J., Lu, H., King, B., Trimmer, B., Meilon, J., and Alvarado, R., "Wafer Level Packaging: Current Solutions and Developing Trends," Wafer-Level Congress and Exhibition Conference Proceedings, San Jose, CA, Oct. 10-12, 2004, pp. xx-xx.

Balkan, Haluk, Patterson, Deborah, Burgess, Guy, Carlson, Craig, Elenius, Peter, Johnson, Michael, Rooney, Brian, Sanchez, Joseph, Stepniak, David, and Wood, Jim, "Flip Chip Reliability: Comparative Characterization of Lead Free (Sn/Ag/Cu) and 63Sn/Pb Eutectic Solder," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1263-1269.

Ball, J., Mendis, B. G., and Reehal, H. S., "The effects of substrate self-biasing on the growth of Sn-catalysed silicon nanowires grown at low pressure," Journal of Materials Science, vol. 49 no. 5, pp. 2078-2084, Mar. 2014.

Ball, Richard, "Business can make money from WEEE, says recycle firm," Electronics Weekly, Mar. 1, 2004.

Ball, Richard, "Comprehensive WEEE and RoHS toolkit released," Electronics Weekly , Nov. 1, 2005.

Ball, Richard, "Copper posts replace solder balls at Intel," Electronics Weekly , Jan. 26, 2006.

Ball, Richard, "Electronic waste directive delayed in UK," Electronics Weekly , Aug. 10, 2005.

Ball, Richard, "EU studies RoHS exemptions," Electronics Weekly, Oct. 26, 2004.

Ball, Richard, "European Parliament to update Battery Directive," Electronics Weekly, May 4, 2004.

Ball, Richard, "Lead-Free Confusion Must Be Cleared Up, Says U.K.," Electronics Weekly, May 26, 2004.

Ball, Richard, "Manufacturer calls for lead-free marking," Electronics Weekly , Aug. 4, 2004.

Ball, Richard, "Pb-free will increase PCB costs," Electronics Weekly, Dec. 6, 2004.

Ball, Richard, "Power wiring legislation is imminent," Electronics Weekly, Jan. 26, 2006.

Ball, Richard, "RoHS: Distributor calls for new part numbers," Electronics Weekly , Sept. 19, 2005.

Ball, Richard, "RoHS PCB Specification - What Has to Change?," Electronics Weekly , Dec. 19, 2006.

Ball, Richard, "Standard aids RoHS compliance," ElectronicsWeekly.com, May 26, 2005.

Ball, Richard, "Suppliers Have Less Than a Year for RoHS Compliance," Electronics Weekly, Aug. 18, 2004.

Ball, Richard, "Test house supports SMEs with RoHS website," electronicsweekly.com , Sept. 21, 2005.

Ball, Richard, "U.K. Manufacturers Fail to Tackle Lead-Free Directive," Electronics Weekly, Oct. 22, 2003.

Ball, Richard, "UK government publishes rules for WEEE directive," Electronics Weekly, Dec. 12, 2006.

Ball, Richard, "UK Government sets WEEE timetable," Electronics Weekly, July 25, 2006.

Ball, Richard, "WEEE Directive Delayed in U.K.," Electronics Weekly, Aug. 11, 2005.

Ball, Richard, "WEEE legislation vague, advice conflicting," Electronics Weekly , Dec. 21, 2006.

Ball, Richard, "WEEE/RoHS Directives doomed to fail, says consultant," Electronics Weekly, Mar. 23, 2006.

Ballantyne, Andy, Forrest, Greg, Goosey, Martin, Griguceviciene, Asta, Juodkazyte, Jurga, Kellner, Rod, Kosenko, Aleksandr, Ramanauskas, Rimantas, Ryder, Karl, Selskis, Algirdas, Tarozaite, Rima, and Veninga, Erik, "Advanced surface protection for improved reliability PCB systems (ASPIS)," Circuit World, vol. 38 no. 1, pp. 21-29, 2012.

Ballentyne, D. W. G., "The preparation and properties of certain technologically important semimetals and semiconductors," Metallurgical Reviews, vol. 16 no. 1, pp. 149-160, 1971. https://doi.org/10.1179/mtlr.1971.16.1.149

Ballesteros-Gomez, Ana, de Boer, Jacob, and Leonards, Pim E. G., "A Novel Brominated Triazine-based Flame Retardant (TTBP-TAZ) in Plastic Consumer Products and Indoor Dust," Environmental Science & Technology, vol. 48 no. 8, pp. 4468-4474, Apr. 15, 2014.

Ballinger, Stuart, "Get wise on waste," Engineer, vol. 293 no. 7716, pp. 25, Jan 29, 2007.

Balluch, B., Smetana, W., and Fleischer, W., "A Modified Wetting Balance Set-Up for the Evaluation of Lead-Free Solder / Flux / Metallization Systems," 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, Vienna, Austria, May 19-20, 2005, pp. 150-155.

Balogh, Balint, Illyefalvi-Vitez, Zs., Kotora, Gy., Harvey, T., Kirkpatrick, D., and Farmer, G., "Qualification and Reliability Tests of Flexible Printed Circuits," 30th International Spring Seminar on Electronics Technology, Cluj-Napoca, Romania, May 9-13, 2007, pp. 82-87.

Balsavar, Rajiv, "X-ray Inspection of Voids in BGA Joints with Respect to the IPC-7095A Specification," IPC Printed Circuits Expo, APEX and the Designer Summit , Anaheim, CA, Feb. 8-10, 2006, pp. S16-02-1-S16-02-4.

Ban, Gaofang, Sun, Fenglian, Liu, Yang, and Cong, Shaonan, "Effect of nano-Cu addition on microstructure evolution of Sn0.7Ag0.5Cu-BiNi/Cu solder joint," Soldering & Surface Mount Technology, vol. 29 no. 2, pp. 92-98, 2017.

Bandar, A. R., Gifford, R. B., Misiolek, W. Z., and Coulter, J. P., "Impact of Die Geometry on Microhardness and Grain Size of Cold-Drawn Steel Wire," Materials and Manufacturing Processes, vol. 19 no. 3, pp. 507-521, May 2004.

Bando, Atsushi, "WEEE & RoHS/ELV Directive and Analysis Technique of Hazardous Substances," Journal of the Surface Finishing Society of Japan, vol. 57 no. 12, pp. 843-849, 2006.

Bandyopadhyay, A. K., and Sen, S. K., "A study of intermetallic compound formation in a copper-tin bimetallic couple," Journal of Applied Physics, vol. 67 no. 8, pp. 3681-3688, Apr. 15, 1990.

Banerji, Kingshuk, and Bradley, Edwin, "Manufacturability and Reliability of Products Assembled with New PCB Finishes," Surface Mount International Conference & Exposition Proceedings of the Technical Program, San Jose, CA, Aug. 28-Sept. 1, 1994, pp. 584-590.

Banerjee, S., Dutta, I., and Majumdar, B. S., "A molecular dynamics evaluation of the effect of dopant addition on grain boundary diffusion in tin: Implication for whisker growth," Materials Science and Engineering: A, vol. 666, pp. 191-198, June 1, 2016. https://doi.org/10.1016/j.msea.2016.04.049

Baney, Brenda B., Bezier, Pascal, Campbell, Michael S., Parker, Richard D., Sneller, Pamela A, Walls, Delbert R., Walsh, Matthew R,. Whiteside, Richard L., and Whitten, Gordon C. "Implementation of Lead-Free Solder for Automotive Electronics," SAE 2000 World Congress, Detroit, MI, Mar. 6-9, 2000.

Baney, Brenda, "WEEE Directive and Its Supply-Chain Ramifications," Printed Circuit Fabrication, vol. 25 no. 9, pp. 42,44, Sept. 2002.

Baney, Brenda, "What I Learned about the Environment Last Year," Printed Circuit Fabrication, vol. 25 no. 1, pp. 44, Jan. 2002.

Baney, Brenda, "What's Up with Lead-free?," Printed Circuit Fabrication, vol. 24 no. 5, pp. 68-69, May 2001.

Bang, Junghwan, Yu, Dong-Yurl, Ko, Yong-Ho, Kim, Min-Su, Nishikawa, Hiroshi, and Lee, Chang-Woo, "Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint," Journal of Alloys and Compounds, vol. 728, pp. 992-1001, Dec. 25, 2017.

Bang, Junghwan, Yu, Dong-Yurl, Ko, Yong-Ho, Nishikawa, Hiroshi, and Lee, Chang-Woo, "Intermetallic Compound Formation and Mechanical Property of Sn-Cu-xCr/Cu Lead-Free Solder Joint," Pan Pacific Symposium 2018 Proceedings, Kamuela, HI, Feb. 5-8, 2018, pp. xx-xx.

Bang, Woong Ho, Chen, Liang-Shan, Kim, Choong-Un, Lee, Tae-Kyu, and Liu, Kuo-Chuan, "Rate Dependence of Bending Fatigue Failure Characteristics of Lead-Free Solder Joint," 59th Electronic Components & Technology Conference , San Diego, CA, May 26-29, 2009, pp. 2070-2074.

Banh, Peter, Delhaise, Andre M., and Perovic, Doug D., "The Study of Dissolution of Bi Precipitates in Sn Using a Novel In Situ Heating Technique in the SEM," SMTA Journal, vol. 32 no. 2, pp. 7-13, 2019.

Banijamali, Bahareh, and Mohammed, Ilyas, "Advanced Simulation/Modeling and Reliability of Fine Pitch (130um) Lead-Free Flip-Chip Package," 2008 ASME International Mechanical Engineering Congress and Exposition, Volume 6, Boston, MA, Oct. 31-Nov. 6, 2008, pp. 235-243.

Banks, Donald R., Burnette, Terry E., Cho, Yeuk-Chow (Dennis), DeMarco, William T., and Mawer, Andrew J., "The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability," Surface Mount International Proceedings of the Technical Program, Volume I, San Jose, CA, Sept. 10-12, 1996, pp. 121-126.

Bansal, Anjul, Nayak, Rajarama, Iyer, Shiva, Vishwanath, MS, and Krishnankutty, Subash, "WEEE & RoHS Impact, Current Challenges & Strategy," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Bansal, Anurag, Ramakrishna, Gnyaneshwar, and Liu, Kuo-Chuan, "A New Approach for Early Detection of PCB Pad Cratering Failures," IPC APEX Expo Technical Conference 2011, Las Vegas, NV, April 12-14, 2011, pp. xx-xx.

Bansal, Anurag, Lee, Tae-Kyu, Liu, Kuo-Chuan, and Xue, Jie, "Effects of Isothermal Aging and In-Situ Current Stress on the Reliability of Lead-Free Solder Joints," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1529-1535.

Bansal, Anurag, Liu, Kuo-Chuan, and Xue, Jie, "Evaluation of Defects in Lead-Free BGA Solder Joints Under Random Vibration Stress," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 150-156.

Bansal, Anurag, Liu, Kuo-Chuan, and Xue, Jie, "Evaluation of Defects in Lead-Free BGA Solder Joints under Random Vibration Stress," SMTA Journal, vol. 24 no. 1, pp. 11-17, 2011.

Bansal, Anurag, Yoon, Sam, and Mahadev, Vadali, "Flexural Strength of BGA Solder Joints with ENIG Substrate Finish Using 4-Point Bend Test," 2005 Pan Pacific Symposium Conference Proceedings , Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Bansal, Anurag, Yoon, Sam, and Mahadev, Vadali, "Flexural Strength of BGA Solder Joints with ENIG Substrate Finish using 4-Point Bend Test," SMTA Journal, vol. 18 no. 2, pp. 23-29, Apr. 2005.

Bansal, Anurag, Ramakrishna, Gnyaneshwar, and Liu, Kuo-Chuan, "Method for Early Detection of PCB Bending Induced Pad Cratering," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1255-1262.

Bao, Nifa, Hu, Xiaowu, Li, Yulong, and Jiang, Xiongxin, "Effects of thermal aging on growth behavior of interfacial intermetallic compound of dip soldered Sn/Cu joints," Journal of Materials Science: Materials in Electronics, vol. 29 no. 10, pp. 8863-8875, May 2018.

Bao, Nuo, Wang, Chunjie, Zhu, Lin, and Song, Shunguang, "Effects of Different Solder Alloys on Reliability of 3D PLUS Solder Joint," Advanced Materials Research, vol. 314-316, pp. 1038-1042, 2011.

Bao, Tran Thai, Kim, Yunkyum, Lee, Joonho, and Lee, Jung-Goo, "Preparation and Thermal Analysis of Sn-Ag Nano Solders," Materials Transactions, vol. 51 no. 12, pp. 2145-2149, 2010.

Baral, Anil, and Engelken, Robert, "Modeling, Optimization, and Comparative Analysis of Trivalent Chromium Electrodeposition from Aqueous Glycine and Formic Acid Baths," Journal of the Electrochemical Society, vol. 152 no. 7, pp. C504-C512, 2005.

Barba-Gutierrez, Y., Adenso-Diaz, B., and Hopp, M., "An analysis of some environmental consequences of European electrical and electronic waste regulation," Resources, Conservation and Recycling , vol. 52 no. 3, pp. 481-495, Jan. 2008.

Barbetta, Mike, "Surface Finishes: an OEM Perspective," CircuiTree, vol. 16 no. 5, pp. xx, May 2003.

Barbetta, Mike, "The Search for the Universal Surface Finish," Printed Circuit Design and Manufacture, vol. 21 no. 2, pp. 34, 36-38, Feb. 2004.

Barbieri, R., Coppari, G., and Rudland, D., "The Use of Adhesive Technology in the Replacement of Solder for the Manufacture of the New Fiat 500 Ignition System," Electro International 1994, Boston, MA, May 10-12, 1994, pp. 879-884.

Barbini, Denis, and Marquez, Ursula, "Cooling Rates in Lead-free and Tin/lead Reflow," Surface Mount Technology (SMT), vol. 19 no. 4, pp. 36-37, Apr. 2005.

Barbini, Denis, Diepstraten, Gerjan, "Five steps to successful lead-free soldering," Circuits Assembly , vol. 12 no. 4, pp. 42-49, Apr. 2001.

Barbini, Denis, "Implementation of a Lead Free Wave Soldering Process: An In-Depth Look at the Critical Issues," 2005 Pan Pacific Symposium Conference Proceedings , Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Barbini, Denis, and Wang, Paul, "Implementing Lead-Free Wave Soldering," Circuits Assembly, vol. 16 no. 5, pp. 43-44, May 2005.

Barbini, Denis, Jean, Denis, Longgood, Stuart, Howell, Keith, and Miremadi, Jian, "iNEMI Lead-Free Wave Soldering Project: An Investigation of Reliability of Through-Hole Electrical Interconnects," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 666-673.

Barbini, Denis, Chu, Quyen, Jean, Denis, Longgood, Stuart, Lotosky, Paul, and Shea, Chrys, "Lead Free Wave Soldering: Influence of Alloys, Board Design, and Process Parameters on Defect Formation," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 751-759.

Barbini, Denis, "Lead Free Wave Soldering: Process Optimization and Joint Performance," SMTA International 2010 Conference (Presentations), Orlando, FL, Oct. 24-28, 2010.

Barbini, Denis, Wang, Paul, Biocca, Peter, Chu, Quyen, Dick, Tim, Jean, Denis, Longgood, Stuart, Shea, Chrys, Sweatman, Keith, and Yuen, Mike, "Lead Free Wave Soldering: Process Optimization for Simple to Highly Complex Boards," 2007 Pan Pacific Microelectronics Symposium & Exhibit , Maui, HI, Jan. 30-Feb. 1, 2007, pp. xx-xx.

Barbini, Denis, Wang, Paul, Biocca, Peter, Chu, Quyen, Dick, Tim, Jean, Denis, Longgood, Stuart, Shea, Chrys, Sweatman, Keith, and Yuen, Mike, "Lead Free Wave Soldering: Process Optimization for Simple to Highly Complex Boards," SMTAnews & Journal of Surface Mount Technology, vol. 20 no. 2, pp. 19-27, Apr.-June 2007.

Barbini, Denis, Wang, Paul, Biocca, Peter, Chu, Quyen, Dick, Tim, Jean, Denis, Longgood, Stuart, Shea, Chrys, Sweatman, Keith, and Yuen, Mike, "Lead Free Wave Soldering: Process Optimization for Simple to Highly Complex Boards," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Barbini, Denis, Jean, Denis, Longgood, Stuart, Howell, Keith, and Miremadi, Jian, "Lead-Free Wave Soldering Project: Performance of Lead Free Through-Hole Electrical Interconnects," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 766-773.

Barbini, Denis, Marquez de Tino, Ursula, Kalkundri, Kaustubh, and Diepstraten, Gerjan, "Liquid Soldering Techniques and Process Optimization - A Case Study for Low Defect Wave and Selective Soldering Processes," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 255-263.

Barbini, Denis, "Optimizing Selective Soldering," Circuits Assembly, vol. 20 no. 9, pp. 37, Sept. 2009.

Barbini, Denis, "Pad Cratering: Assessing Long Term Reliability Risks," Medical Electronics Symposium 2011 Proceedings, Tempe, AZ, Sept. 27-28, 2011, pp. xx-xx.

Barbini, Denis, Diepstraten, Gerjan, and Marquez, Ursula, "Process Considerations for Optimizing a Reflow Profile," Surface Mount Technology (SMT), vol. 19 no. 7, pp. 28, 30-31, July 2005.

Barbini, Denis, "Protecting the Pb-Free Solder Pot," Circuits Assembly, vol. 17 no. 3, pp. 52, Mar. 2006.

Barbini, Denis, "Requirements for Implementation of Lead-free Soldering," Surface Mount Technology (SMT), vol. 18 no. 4, pp. 52, Apr. 2004.

Barbini, Denis, and Meilunas, Michael, "Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size, Cyclic Strain and Microstructure," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 292-300.

Barbini, Denis, "STEP 2: Process Control," Surface Mount Technology (SMT), vol. 21 no. 2, pp. 55-57, Feb. 2007.

Barbini, Denis, "TGA Analysis of No-Clean Pb-Free Flux Behavior," Circuits Assembly , vol. 19. no. 4, pp. 65, Apr. 2008.

Barbini, Denis, and Geibig, Jack, "The Relationship between Reflow Soldering Processes and Power Consumption," Surface Mount Technology (SMT), vol. 18 no. 10, pp. 28-32, Oct. 2004.

Barbini, Denis, and Wang, Paul, "Wave solder: Process otptimization for simple to complex boards," Global SMT and Packaging, vol. 7 no. 9, pp. 10-12, 14, 16-17, Sept. 2007.

Barbosa, Flavia V., Teixeira, Jose C. F., Teixeira, Senhorinha F. C. F., Lima, Rui A. M. M., Soares, Delfim F., and Pinho, Diana M. D., "Rheology of F620 solder paste and flux," Soldering & Surface Mount Technology, vol. 31 no. 2, pp. 125-132, 2019.

Barger, Mike, "Flip Chip Assembly with Stud Bumping," empfasis, pp. xx-xx, Jan. 2008.

Barghouthi, Nasma, "Canada raises the bar for responsible electronics recycling," Green SupplyLine, Nov. 17, 2006.

Barik, El Mostafa, Gillot, Charlotte, and Hodaj, Fiqiri, "Optimization of soldering experiments for power devices interconnection and packaging," 2020 IEEE 8th Electronics System-Integration Technology Conference, Tonsberg, Norway, Sept. 15-18, 2020, pp. xx-xx.

Barman, Binay Kumar Deb, Singh, Shobhit Pratap, and Kumar, Praveen, "Processing and mechanical behavior of Cu-Bi alloys with high volume fraction of Bi: Suitability for high temperature soldering application," Materials Science and Engineering: A, vol. 666, pp. 339-349, June 1, 2016.

Barnett, M. R., Kelly, G. L., and Hodgson, P. D., "Predicting the Critical Strain for Dynamic Recrystallization using the Kinetics of Static Recrystallization," Scripta Materialia, vol. 43 no. 4, pp. 365-369, July 28, 2000.

Barney, Linda, and Rubinger, Jack, "The Cost of Compliance: A Case Study," CircuiTree, vol. 19 no. 1, pp. xx-xx, Jan. 2006.

Barns, R. L., and Ellis, W. C., "Whisker Crystals of Gallium Arsenide and Gallium Phosphide Grown by the Vapor-Liquid-Solid Mechanism," Journal of Applied Physics, vol. 36 no. 7, pp. 2296-2301, July 1965.

Barnstead, Mike, "Electroless Nickel: Beyond ELV," Products Finishing, vol. 71 no. 6, pp. xx-xx, Mar. 2007.

Barnstead, Mike, Beckett, Duncan, and Morcos, Boules, "EN Versus EN," Products Finishing, vol. 74 no. 1, pp. 18-21, Oct. 2009.

Barnstead, Mike, "Review & Forecast: Environmental Compliance Changes Approach to Business," Metal Finishing, vol. xx no. xx, pp. xx-xx, Jan. 6, 2006.

Barnstead, Mike, and Bieler, Chrissy, "Trivalent Chromium for a New Generation," Metal Finishing, vol. 107 no. 1, pp. 27-30,33, Jan. 2009.

Barr, Gordon O., "Influences on Solderability and Cleanliness by the Use of Various Copper Protection Media," Proceedings of the Technical Program NEPCON West '95, Volume 1, Anaheim, CA, Feb. 26-Mar. 2, 1995, pp. 382-390.

Barr, Michael, "Unintended acceleration and other embedded software bugs," Embedded Systems Design (ESD), vol. 24 no. 3, pp. 9-10,12,29, Apr. 2011.

Barr, Stephanie, "Mitigating and Preventing the Growth of Tin and Other Metal Whiskers on Critical Hardware," The Aerospace Corporation, 2007.

Barr, Stephanie, "Mitigating and Preventing the Growth of Tin and Other Metal Whiskers on Critical Hardware (presentation)," The Aerospace Corporation, 2007.

Barrett, Kelly, "Learning to Drop Lead," Electronic News, vol. 46 no. 38, pp. 74, Sept. 18, 2000.

Barrett, Kelly, "Search for Packaging Survivors," Electronic News, vol. 46 no. 30, pp. 56, July 24, 2000.

Barry Jr., Edward P., "Use of Tin on Electrical Components for Space Vehicles," Department of the Air Force SMC Regulation 800-27.

Barry, John D., Ervin, Matthew, Molstad, Jay, Wickenden, Alma, Brintlinger, Todd, Hoffman, Patrik, and Meingailis, John, "Electron beam induced deposition of low resistivity platinum from Pt(PF3)4," Journal of Vacuum Science & Technology B, vol. 24 no. 6, pp. 3165-3168, Nov./Dec. 2006.

Barry, N., Jones, I. P., Hirst, T., Fox, I. M., and Robins, F., "High-cycle fatigue testing of Pb-free solder joints," Soldering & Surface Mount Technology, vol. 19 no. 2, pp. 29-38, 2007.

Barsoum, M. W., Hoffman, E. N., Doherty, R. D., Gupta, S., and Zavaliangos, A., "Driving Force and Mechanism for Spontaneous Metal Whisker Formation," Physical Review Letters, vol. 93 no. 20, pp. 206104-1-206104-4, June 25, 2004.

Bartels, F., Morris Jr., J. W., Dalke, G., and Gust, W., "Intermetallic Phase Formation in Thin Solid-Liquid Diffusion Couples," Journal of Electronic Materials, vol. 23 no. 8, pp. 787-790, Aug. 1994.

Bartels, F., Linch, H., Xu, P., and Morris Jr., J. W., "Mechanical Properties of Sn-Bi Solder Joints," Proceedings of the 20th International Symposium on Testing and Failure Analysis, Los Angeles, CA, Nov. 13-18, 1994, pp. 479-483.

Barten, P. G. J., "Continue waarneming van het rekristallisatie-proces bij metalen met gepolariseerd licht," Nederlands Tijdschrift voor Natuurkunde, vol. 20, pp. 25-35, 1954.

Barth, Sven, Kolesnik, Maria M., Donegan, Keith, Krstic, Vojislav, and Holmes, Justin D., "Diameter-Controlled Solid-Phase Seeding of Germanium Nanowires: Structural Characterization and Electrical Transport Properties," Chemistry of Materials, vol. 23 no. 14, pp. 3335-3340, July 26, 2011.

Barthelmes, J., Wunderlich, C., Danker, M., and Neoh, D.-G.,, "Successfully Linking Leadframe Roughening Processes for Adhesion Improvement to the Ultra Thin Ni/Pd/Au Technology," SEMICON 2005 Singapore , Singapore, 2005, pp. xx-xx.

Barthelmes, Jurgen, Wunderlich, Christian, and Lam, Patrick, "A New Generation of Leadframe (LF) Roughening for MSL Improvement," SEMICON 2006 China, China, 2006, pp. xx-xx.

Barthelmes, Jurgen, Lagorce-Broc, Florence, Kuhlkamp, Peter, Kok, Sia-Wing, and Neoh, Din-Ghee, "Different Storage Conditions have Different Whisker Growth Mechanisms - Can Bright Tin be an Alternative to Matt Tin?," International Electronic Manufacturing Technology 2006, Kuala Lumpur, Malasia, 2006, pp. xx-xx.

Barthelmes, Jurgen, Lagorce-Broc, Florence, Kuhlkamp, Peter, Kok, Sia-Wing, and Neoh, Din-Ghee, "Different Storage Conditions have Different Whisker Growth Mechanisms - Can Bright Tin be an Alternative to Matt Tin ?," 31st International Conference on Electronics Manufacturing and Technology, Kuala Lumpur, Malasia, Nov. 8-10, 2007, pp. 257-261.

Barthelmes, Jurgen, Kok, Sia-Wing, Neoh, Din-Ghee, and Kurtz, Olaf, "Highly efficient corrosion protection for plated pure tin surfaces," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Barthelmes, Jurgen, Kuhlkamp, Peter, Lagorce-Broc, Florence, and Neoh, Din-Ghee, "Quantification of the influence of all important physical and chemical Tin plating bath parameters on the propensity for whisker formation," SEMICON Singapore 2006, Singapore, 2006, pp. xx-xx.

Barthelmes, Jurgen, and Yap, Yoon Foong, "Reliable Adhesion-Enhanced Leadframes plated with Ultrathin Ni/Pd/Au," SEMICON 2005 Europe, 2005, pp. xx-xx.

Barthelmes, Jurgen, Crema, Paolo, Kuhlkamp, Peter, and Kurtz, Olaf, "The necessity of corrosion protection for solderable pure tin deposits on IC outer leads," European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Barthelmes, Jurgen, Crema, Paolo, and Kuhlkamp, Peter, "Whisker Growth during Heat-Humidity Storage - Mechanism and Factors of Influence," SEMICON Singapore 2007, Singapore, 2007, pp. xx-xx.

Barthelmy, Michael, "Problems with Pure Tin Coatings," NASA GSFC Materials Engineering Branch, Jan. 17, 2001.

Bartholomew, P. M., "Review of Conductive Adhesives and Inks for Microengineered Devices," IEE Colloquium on Assembly and Connections in Microsystems (Digest no. 1997/004), Feb. 26, 1997, pp. 6/1-6/3.

Bartlett, R. J., and Kimble, J. M., "Behavior of Chromium in Soils: II. Hexavalent Forms," Journal of Environmental Quality, vol. 5 no. 4, pp. 383-386, Oct.-Dec. 1976.

Barto, Seba, and Mach, Pavel, "Climatic Resistance of Electrically Conductive Adhesive Modified with Silver Nanoparticles," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 128-130.

Barto, Seba, and Mach, Pavel, "Influence of Curing Process Parameters on Quality of Electrically Conductive Joints," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 147-150.

Barto, Seba, Cinert, Jakub, and Mach, Pavel, "Influence of Thermal Aging on the Reliability of Electrically Conductive Adhesives," 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging, Timisoara, Romania, Oct. 20-23, 2011, pp. 305-308.

Barto, Seba, and Mach, Pavel, "Resistance and Non-Linearity of Electrically Conductive Adhesives Aged by Thermal, Humidity and Combined Aging," 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging, Timisoara, Romania, Oct. 20-23, 2011, pp. 59-62.

Barto, Seba, and Mach, Pavel, "Sensitivity of Resistance, Noise and Nonlinearity of Conductive Adhesive Joints to Changes in Adhesive," 2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging, Oradea, Romania, Oct. 20-23, 2016, pp. 40-43.

Barto, Seba, and Mach, Pavel, "Tolerance Design of Curing Process of Electrically Conductive Adhesives," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 103-106.

Barto, Seba, and Radev, Radoslav, "Using Fractional Factorial Experiments for Determination of Factors Influencing Parameters of Electrically Conductive Adhesives," 2012 35th International Spring Seminar on Electronics Technology, Bad Aussee, Austria, May 9-13, 2012, pp. 266-269.

Barton, Bruce, and Shea, Chrys, "Lead-free implementation: Time to get practical," EMasia, July 2005.

Barton, Bruce, Shea, Chrys, Belmonte, Joe, and Kirby, Ken, "Practical Pb-Free Implementation," Circuits Assembly, vol. 16 no. 9, pp. 40-47, Sept. 2005.

Bartosik, Lukasz, Stafiej, Janusz, and Caprio, Dung Di, "3D simulations of ordered nanopore growth in alumina," Electrochimica Acta, vol. 188, pp. 218-221, Jan. 10, 2016.

Basaran, Cemal, and Lin, Minghui, "Electromigration induced strain field simulations for nanoelectronics lead-free solder joints," International Journal of Solids & Structures, vol. 44 no. 14-15, pp. 4909-4924, July 2007.

Basaran, Cemal, and Abdulhamid, Mohd F., "Low temperature electromigration and thermomigration in lead-free solder joints," Mechanics of Materials, vol. 41 no. 11, pp. 1223-1241, Nov. 2009.

Basaran, Cemal, Li, Shidong, Hopkins, Douglas C., and Yao, Wei, "Mean Time to Failure of SnAgCuNi Solder Joints under DC," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 518-520.

Basaran, Cemal, Sellers, Michael S., Schultz, Andrew J., Kofke, David A., and Lee, Yongchang, "Solder Joint Grain Boundary Structure and Diffusivity via Molecular Dynamics Simulations," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 514-517.

Basaran, Cernal, "Damage Mechanics of Solder Joints Under High Current Density," Key Engineering Materials, vol. 345-356 II, pp. 1403-1410, 2007.

Basavanhally, Nagesh R., Chang, David D., Cranston, Benjamin H., and Seger Jr., Steven G., "Direct Chip Interconnect with Adhesive-Connector Films," 1992 Proceedings 42nd Electronic Components & Technology Conference, San Diego, CA, May 18-20, 1992, pp. 487-491.

Basavanhally, Nagesh R., Chang, David D., Cranston, Ben, and Segar Jr., Steve G., "Direct Chip Interconnect with Adhesive Conductor Films," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 15 no. 6, pp. 972-976, Dec. 1992.

Basdere, Bahadir, and Seliger, Guenther, "Disassembly Factories for Electrical and Electronic Products To Recover Resources in Product and Material Cycles," Environmental Science & Technology, vol. 37 no. 23, pp. 5354-5362, 2003.

Bashir, M. Nasir, Haseeb, A. S. M. A., Rahman, Abu Zayed M. Saliqur, and Fazal, M. A., "Effect of Ni Nanoparticles on Intermetallic Compounds Formation in SAC305 Solder Joint under High Current Density," 2014 IEEE 36th International Electronics Manufacturing Technology Conference, Johor, Malaysia , Nov. 11-13, 2014, pp. xx-xx.

Bashir, M. Nasir, and Haseeb, A. S. M. A., "Improving mechanical and electrical properties of Cu/SAC305/Cu solder joints under electromigration by using Ni nanoparticles doped flux," Journal of Materials Science: Materials in Electronics, vol. 29 no. 4, pp. 3182-3188, Feb. 2018.

Bashir, M. Nasir, Haseeb, A. S. M. A., Rahman, Abu Zayed Mohammad Saliqur, Fazal, M. A., and Kao, C. R., "Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping," Journal of Materials Science, vol. 50 no. 20, pp. 6748-6756, Oct. 2015.

Basit, Munshi M., Motalab, Mohammad, Suhling, Jeffrey C., and Lall, Pradeep, "The Effects of Aging on the Anand Viscoplastic Constitutive Model for SAC305 Solder," 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 27-30, 2014, pp. 112-126.

Basit, Munshi M., Motalab, Mohammad, Roberts, Jordan C., Suhling, Jeffrey C., and Lall, Pradeep, "The Effects of Silver Content and Solidification Profile on the Anand Constitutive Model for SAC Lead Free Solders," 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , Orlando, FL, May 27-30, 2014, pp. 488-502.

Basit, Munshi M., Motalab, Mohammad, Suhling, Jeffrey C., Hai, Zhou, Evans, John, Bozack, Michael J., and Lall, Pradeep, "Thermal Cycling Reliability of Aged PBGA Assemblies - Comparison of Weibull Failure Data and Finite Element Model Predictions," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 106-117.

Baskin, Philip, "Challenges in Attaining Lead-Free Solders," Welding Journal, vol. 86 no. 3, pp. 58-61, Mar. 2007.

Bassett, Glenn, and Lesem, Don, "A love affair with lead," Electronic Products, vol. 48 no. 1, pp. 79-80, June 2005.

Bassett, Glenn, "Countdown to RoHS and Beyond," Avnet Advantage, May 2006.

Bassett, Glenn, "Design for Environment -- Running Out of Time," Avnet Advantage , Feb. 2005.

Bassett, Glenn, "In Search of Restricted Substances," Avnet Advantage, Nov. 2004.

Bassett, Glenn, "It's Real When You Read About It in the Wall Street Journal," Avnet Advantage, May 2005.

Bastecki, Chris, "A Benchmark Process for the Lead-Free Assembly of Mixed Technology PCB's," Sept. 1999.

Bastecki, Chris, "Lead-Free Assembly of Mixed-Technology PCBs," Surface Mount Technology (SMT), vol. 11 no. 5, pp. 52-58, May 1997.

Bastin, Lisa Hamburg, "Lead Free: How to Deal," Circuits Assembly, vol. 15 no. 7, pp. 7, July 2004.

Bastin, Lisa Hamburg, "Lead Free: Time's Running Out," Lead-Free Magazine, vol. 2.

Bastow, Eric, "5 Solder Families and How They Work," Advanced Materials & Processes, vol. xx no. xx, pp. 26-29, Dec. 2003.

Bastow, Eric, "Reflow Profiling on the Electrical reliability of No-Clean Solder Paste Flux Residues," Surface Mount Technology (SMT), vol. 30 no. 4, pp. 8,1012,14,16-18,20-22,24-25, Apr. 2015.

Bastow, Eric, and Jensen, Timothy, "The Proliferation of Lead-Free Alloys," SMTA International Conference , San Diego, CA, Oct. 4-8, 2009, pp. 453-457.

Bates, James A., "Comparison of Alkaline Zinc-Nickel and Acid Zinc-Nickel as a Replacement Coating for Cadmium," 15th AESF/EPA Pollution Prevention and Control Conference, Orlando, FL, Jan. 24-27, 1994, pp. 155-165.

Bates, James A., "Comparison of Alkaline Zn-Ni & Acid Zn-Ni As a Replacement Coating for Cadmium," Plating & Surface Finishing, vol. 81 no. 4, pp. 36-40, Apr. 1994.

Bath, J., Garcia, R., Uchida, N., Takahashi, H., Clark, G., and Itoh, M., "Part I: Developing tin-lead and lead-free solder pastes," EngineerIT , pp. 35-37, Nov. 2009.

Bath, J., Garcia, R., Uchida, N., Takahashi, H., Clark, G., and Itoh, M., "Part II: Developing tin-lead and lead-free solder pastes," EngineerIT , pp. 38-40, Jan, 2010.

Bath, Jasbir, Clark, Gordon, Jensen, Tim, Michalkiewicz, Renee, and Toleno, Brian, "A review of halogen/halide-free test methods and classifications for soldering materials," Global SMT and Packaging, vol. 11 no. 6, pp. 26-31,58, June 2011.

Bath, Jasbir, Itoh, Manabu, Clark, Gordon, Mori, Kimiaki, Takahashi, Hajime, Yokota, Kyosuke, and Garcia, Roberto, "An Investigation into Low Silver Lead-Free Alloy Solder Paste for Electronics Manufacturing Applications," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 731-740.

Bath, Jasbir, Itoh, Manabu, Clark, Gordon, Fuji, Masatoshi, Takahashi, Hajime, and Garcia, Roberto, "An Investigation into the Development of Lead-Free Solder Paste for Package on Package (PoP) Component Manufacturing Applications," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 1-4.

Bath, Jasbir, Itoh, Manabu, Clark, Gordon, Fuji, Masatoshi, Takahashi, Hajime, and Garcia, Roberto, "An Investigation into the Development of Lead-Free Solder Paste for Package on Package (PoP) Component Manufacturing Applications," SMTA Journal , vol. 23 no. 4, pp. 30-35, 2010.

Bath, Jasbir, Itoh, Manabu, Clark, Gordon, Uchida, Noriyoshi, Takahashi, Hajime, and Garcia, Roberto, "An Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes to Reduce Voiding in Large Contact Area Power Transistor/QFN Type Components," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 909-914.

Bath, Jasbir, "Assessment of Low-Ag Solder Alloys for General Lead-Free Assembly," Surface Mount Technology (SMT), vol. 27 no. 2, pp. 58-60,62,64,66-68, Feb. 2012.

Bath, Jasbir, "Can Existing Tools Survive Pb-Free Soldering?," Circuits Assembly , vol. 16 no. 7, pp. 39, July 2005.

Bath, Jasbir, "Can Existing Tools Survive Pb-Free Soldering?," Printed Circuit Design and Manufacture, vol. 22 no. 7, pp. 18, 20-21, July 2005.

Bath, Jasbir, Joshi, Shantanu, and Segura, Roberto, "Evaluations on the Mixing of the Tin-Bismuth Paste with Sn3ag0.5Cu BGA Components in Terms of Peak Temperature, Time Over Melting and Paste Volume," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 159-168.

Bath, Jasbir, Chu, Quyen, Ghalib, Nabel, Han, Charlie, and Smith, Greg, "iNEMI Lead-Free Micro-BGA, CBGA, Mictor Connector and Through-Hole DIP Rework Evaluations," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 144-151.

Bath, Jasbir, Garcia, Roberto, Uchida, Noriyoshi, Takahashi, Hajime, Clark, Gordon, and Itoh, Manabu, "Investigation and Development of Tin-Lead and Lead-Free Solder Pastes to Reduce the Head-in-Pillow Component Soldering Defect," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 430-437.

Bath, Jasbir, Garcia, Roberto, Uchida, Noriyoshi, Takahashi, Hajime, Clark, Gordon, and Itoh, Manabu, "Investigation and development of tin-lead and lead-free solder pastes to reduce head-in-pillow defects," Global SMT and Packaging, vol. 9 no. 12, pp. 10-12,14-16, Dec. 2009.

Bath, Jasbir, Wilmot, Lee, McCullen, Jack, and Abrams, Fern, "IPC/JEDEC J-STD-609A Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S22_02-1-S22_02-35.

Bath, Jasbir, and Wilmot, Lee, "IPC Lead-Free Labeling Standard," IPC Printed Circuits Expo, Anaheim, CA, Feb. 24-26, 2004, pp. xx-xx.

Bath, Jasbir, Wageman, Mike, Chu, Quyen, Ghalib, Nabel, Donaldson, Alan, Matias, Jose, and Hernandez, Eddie, "Lead-Free and Tin-Lead Rework Development Activities Within the NEMI Lead-Free Assembly and Rework Project," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 184-197.

Bath, Jasbir, and Hueste, Gregory, "Lead-free Sn3.5Ag and Sn0.7Cu Wave Solder Evaluation with VOC-free No-clean and Water Soluble Fluxes," 2001 Advanced Packaging Technology Conference Proceedings, 2001, pp. xx-xx.

Bath, Jasbir, "NEMI Lead-free Rework Development Phase 3,", NEMI, Mar. 2004.

Bath. Jasbir, "Practical Lessons for Pb-Free," Circuits Assembly, vol. 18 no. 10, pp. 18, Oct. 2007.

Bath, Jasbir, Sethuraman, Sundar, Zhou, Xiang, Willie, Dennis, Hyland, Kim, Newman, Keith, Hu, Livia, Love, Dave, Reynolds, Heidi, Kochi, Ken, Chiang, Diana, Chin, Vicki, Teng, Sue, Ahmed, Mudasir, Henshall, Greg, Schroeder, Valeska, Nguyen, Quang, Maheswari, Abhay, Lee, M. J., Clech, Jean-Paul, Cannis, Jeff, Lau, John, and Gibson, Chris, "Reliability Evaluation of Lead-Free SnAgCu PBGA676 Components Using Tin-Lead and Lead-Free SnAgCu Solder Paste," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 891-901.

Bath, Jasbir, Jay, Roger, Bennett, Lenora, Tan, Suan Kee, Chih, Pan Wei, and Lucuta, Adrian, "Repeatability Analysis of EDXRF Equipment for RoHS Compliance Screening for Soldering Materials used in PCBA Manufacturing," 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium, San Jose, CA, Oct. 3-5, 2007, pp. 339-345.

Bath, Jasbir, Handwerker, Carol, and Bradley. Edwin, "Research Update: Lead-Free Solder Alternatives," Circuits Assembly , vol. 11 no. 5, pp. 30-38,40, May 2000.

Bath, Jasbir, and Chu, Quyen, "STEP 10: Rework and Repair," Surface Mount Technology (SMT), vol. 19 no. 11, pp. 40-42, Nov. 2005.

Bath, Jasbir, and Crombez, Emmanuelle, "Surface Mount Assembly Evaluations with Lead-free Solder Pastes," 2000 Lead Free Symposium Conference Proceedings, 2000, pp. xx-xx.

Bath, Jasbir, Asai, Kentaro, Joshi, Shantanu, Harris, Jack, and Segura, Roberto, "Voiding Study on Soldered Chip and Power Transistor (BTC) Components with Different Lead-Free Solder Pastes," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 219-225.

Bath, Jasmir, "A Manufacturable Lead-Free Surface-Mount Process?," Circuits Assembly, vol. 14 no. 1, pp. 26-30, Jan. 2003.

Batieha, F., Hamasha, S., Jaradat, Y., Wentlent, L., Qasaimeh, A., and Borgesen, P., "Challenges for the Prediction of Solder Joint Life in Long Term Vibration," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1553-1559.

Batieha, F., Feyissa, F., Hamasha, S., Shirazi, S., Wentlent, L., Ogutu, P., Dimitrov, N., Fey, E., and Borgesen, P., "Intermetallics Issues and Challenges in 2.5/3D Assembly Microjoints," Proceedings of SMTA Pan Pacific Symposium, Kauai, HI, Feb. 2-5, 2015, pp. xx-xx.

Batorfi, Reka, Szoke, Peter, Olah, Zoltan, Geczy, Attila, Ruszinko, Miklos, and, ILlyefalvi-Vitez, Zsolt, "Bumping Technologies of Fine-Pitch BGA Components," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 107-112.

Batorfi, Reka, "Examination of Soldering Defect Formation at QFN Components," 2015 38th International Spring Seminar on Electronics Technology, Eger, Hungary, May 6-10, 2015, pp. 320-323.

Batorfi, Reka, Storcz, Richard, and Ruszinko, Miklos, "Investigating Hole Filling in Pin-in-Paste Technology for Vapour Phase Soldering," 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging, Galati, Romania, Oct. 24-27, 2013, pp. 59-64.

Batorfi, Reka, Illes, Balazs, and Krammer, Oliver, "Whisker Formation from SnAgCu Alloys and Tin Platings - Review on the Latest Results," 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging, Brasov, Romania, Oct. 22-25, 2015, pp. 373-376.

Battaion, Michael, "Environmental Overview - REACH," It's Not Easy Being Green, San Jose, CA, Feb. 4-5, 2009, pp. xx-xx.

Battermann, Achim, Gunther, B., and Schafer, H., "UV-Curable Conductive Adhesives for 3-D MID Application," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, Germany, Oct. 21-24, 2001, pp. 181-184

Baudrand, Don, "Conversion Coatings for Aluminum and Magnesium," Plating and Surface Finishing, vol. 92 no. 1, pp. 30-34, 44, Jan. 2005.

Baudrand, Don, "Electroless Palladium, Past and Future," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. 49-51.

Baudrand, Don, "Electroless Plating Processes Developing Technologies for Electroless Nickel, Palladium and Gold," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Baudrand, Don, "Electroplating/Electroless Plating for Electronic Applications," Products Finishing, vol. xx no. xx, pp. xx-xx, June 9, 2003.

Baudrand, Donald W., "Failure of Electroplated deposits, Detection and Prevention," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. 577-587.

Bauer, Brian D., and O'Neill, Michael P., "Are You Ready for Lead-free Solder Paste?," Surface Mount Technology (SMT), vol. 14 no. 4, pp. 69-70, Apr. 2000.

Bauer, Brian D., and O'Neill, Michael P., "Are You Ready for Lead-free Solder Paste?," Surface Mount Technology (Special Supplement, SMT), vol. 14 no. 6, pp. 11-12, June 2000.

Bauer, Brian, "Making the Move to Lead-free Requires Teamwork," Surface Mount Technology (SMT), vol. 18 no. 11, pp. xx-xx, Nov. 23, 2004.

Bauer, Brian, and Lathrop, Rick, "Solder Materials," Surface Mount Technology (SMT), vol. 12 no. 3, pp. 90, 92, 94-95, Mar. 1998.

Bauer, J., Gottschalch, V., Paetzelt, H., Wagner, G., Fuhrmann, B., and Leipner, H. S., "MOVPE growth and real structure of vertical-aligned GaAs nanowires," Journal of Crystal Growth, vol. 298, pp. 625-630, Jan. 2007.

Bauer, J., Gottschalch, V., Paetzelt, H., and Wagner, G., "VLS growth of GaAs/(InGa)As/GaAs axial double-heterostructure nanowires by MOVPE," Journal of Crystal Growth, vol. 310 no. 23, pp. 5106-5110, Nov. 15. 2008.

Bauer, Laura Ann, Reich, Daniel H., and Meyer, Gerald J., "Selective Functionalization of Two-Component Magnetic Nanowires," Langmuir, vol. 19 no. x, pp. 7043-7048, 2003.

Bauer, R., Ebersberger, B., Kupfer, C., and Alexa, L., "Reliability Investigations on SnAg Bumps on Substrate Pads with Different Pad Finish," AIP Conference Proceedings, vol. 817, pp. 360-365, 2006.

Baumann, Marji, "Deciphering Pb-free labeling on integrated circuits," Electronic Products, vol. 48 no. 6, pp. 83, Nov. 2005.

Baumann, Marji, and Celaya, Phill, "Using lead-free devices in a standard process with lead solder," Green SupplyLine, Apr. 14, 2006.

Baumgartner, Tobias, Manessis, Dionysios, Topper, Michael, Hauck, Karin, Ostmann, Andreas, Reichl, Herbert, Jorge, Pedro Goncalo C. T., and Yamada, Hidehiro, "Printing Solder Paste in Dry Film - A Low Cost Fine-Pitch Bumping Technique," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 609-612.

Bautin, V. A., Kostitsyna, E. V., Popova, A. V., Gudoshnikov, S. A., Ignatov, A. S., and Usov, N. A., "Glass shell etching to control residual quenching stress in Co-rich amorphous ferromagnetic microwires," Journal of Alloys and Compounds, vol. 731, pp. 18-23, Jan. 15, 2018.

Bayati, M. R., Shariat, M. H., and Janghorban, K., "Design of chemical composition and optimum working conditions for trivalent black chromium electroplating bath used for solar thermal collectors," Renewable Energy, vol. 30 no. 14, pp. 2163-2178, Nov. 2005.

Bayersdorfer, Maik, Kemethmueller, Martin, Steuff, Wolfgang, and Scharf, Michael, "Leoni Histral - The cadmium-free alternative for cable manufacturers," Wire Journal International, vol. 41 no. 6, pp. 67-71, June 2008.

Bayes, Martin, and Horn, Al, "Effects of Conductor Surface Condition on High Frequency Loss," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S18-3-1-S18-3-11.

Bayes, Martin, and Horn, Al, "Effects of conductor surface condition on signal integrity," Circuit World, vol. 30 no. 3, pp. xx, 2004.

Bayes, Martin, "Materials Matters: Solder Joint Reliability," PCB007, June 27, 2008.

Baylakoglu, Ilknur, Hamarat, Seref, Gokmen, Haluk, and Meric, Esra, "Case Study for High Volume Lead-Free Wave Soldering Process with Environmental Benefits," Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, New Orleans, LA, May 16-19, 2005, pp. 102-106.

Baylakoglu, Ilknur, "Reliability Concerns of Lead-free Solder Use in Aerospace Applications," 3rd International Conference on Recent Advances in Space Technologies , Istanbul, Turkey, June 14-16, 2007, pp. 158-164.

Baynham, Grant, Baldwin, Daniel F., Boustedt, Katarina, Johansson, Anette, Wennerholm, Claes, Patterson, Deborah, and Elenius, Peter, "Flip Chip Processing of Lead-Free Solders and Halogen-Free High Density Microvia Substrates," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 1101-1105.

Baynham, Grant, Baldwin, Daniel F., Boustedt, Katarina, and Wennerholm, Claes, "Flip Chip with Lead-Free Solders on Halogen-Free Microvia Substrates," 2001 Proceedings 51st Electronic Components & Technology Conference , Orlando, FL, May 29-June 1, 2001, pp. 1135-1139.

Baynham, Grant, Baldwin, Daniel F., Boustedt, Katarina, Kandelid, Stefan, Mattsson, Fredrik, Wennerholm, Claes, Johansson, Anette, Patterson, Deborah, Elenius, Peter, and Balkan, Haluk, "Lead-free Flip Chip Processing with Halogen-free High Density Microvia Substrates," Twenty-Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium, Santa Clara, CA, Oct. 2-3, 2000, pp. 263-269.

Bazilchuk, Molly, Kristiansen, Helge, and He, Jianying, "Influence of metallization and size on the conductive properties of metal-coated polymer particles in anisotropic conductive adhesive," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 1920-1925.

Bazu, Marius, Ilian, Virgil Emil, Galateanu, Lucian, Varsescu, Dragos, and Pietrikova, Alena, "Reliability Testing of Lead-Free Solder Joints," 2012 35th International Spring Seminar on Electronics Technology, Bad Aussee, Austria, May 9-13, 2012, pp. 173-177.

Bchir, Omar, and Stage, Roger, "Intel Halogen Free Component Key Properties and Reliability Test Results," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Beair, William, and Vuono, William, "Lead Free to SnPb BGA Reballing Process and Reliability," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 379-383.

Beard, Adrian, Klimes, Michael, and Wietschorke, Ulrich, "Non-halogenated phosphorus, inorganic and nitrogen flame retardants for electronics: update on market situation, drivers and trends," Electronics Goes Green 2012+, Berlin, Germany, Sept. 9-12, 2012, pp. xx-xx.

Beattie, S. D., Hatchard, T., Bonakdarpour, A., Hewitt, K. C., and Dahn, J. R., "Anomalous, High-Voltage Irreversible Capacity in Tin Electrodes for Lithium Batteries," Journal of the Electrochemical Society, vol. 150 no. 6. pp. A701-A705, 2003.

Beaumont, Mitch, and Okamoto, Kiyoshi, "EuP Directive impacts design activities," Green SupplyLine, Dec. 8, 2006.

Beauvillier, Luc, "The Quest for the Ultimate Surface Finish," Printed Circuit Design, vol. 19 no. 6, pp. 27-31, June 2002.

Beazant, Gareth, "Electro-scrap mountains still growing," Professional Engineering , vol. 19 no. 1, pp. 38-39, Jan. 11, 2006.

Becht, Joachim, Tosun, Umut, Wack, Harald, Schweigart, Helmut, Ellis, Dirk, and Afshari, Sia, "Eutectic & Lead-free Defluxing in One Process," Surface Mount Technology (SMT), vol. 21 no. 5, pp. 39-41, May 2007.

Beck, Albrecht, "Overcoming the challenges of lead-free wave soldering," Global SMT and Packaging, vol. 12 no. 8, pp. 8-11, Aug. 2012.

Beck, Erin, "Performance Validation of Thin-Film Sulfuric Acid Anodization (TFSAA) on Aluminum Alloys," Proceedings 2003 AESF/EPA Conference for Environmental & Process Excellence, Daytona, FL, Feb. 3-7, 2003, pp. 339-356.

Becker, J. H., "On the Linear Rate of Transformation of White to Gray Tin," Bulletin of the American Physical Society, Series II, vol. 1 no. 1, pp. 45, Jan. 30, 1956.

Becker, J. H., "On the Quality of Gray Tin Crystals and Their Rate of Growth," Journal of Applied Physics, vol. 29 no. 7, pp. 1110-1121, July 1958.

Becker, J. H., "Studies of Crystal Growth, and Electrical and Optical Properties of Gray Tin," Physical Review, Second Series, vol. 98 no. 4, pp. 1192, May 15, 1955.

Beckett, Duncan, and Terrell, Greg, "Notes From the Field," Products Finishing, vol. 73 no. 7, pp. 19-22, Apr. 2009.

Beckett, Duncan, Szczypka, John, Morcos, Boules, and Terrell, Greg, "Troubleshooting RoHS-compliant Electroless Nickel," Metal Finishing , vol. 107 no. 6, pp. 33-38, June 2009.

Bedner, David, and He, Michael, "Halogen-free materials with improved thermal and electrical properties," Circuit World, vol. 35 no. 3, pp. 3-7, 2009.

Bedner, David, "New Halogen-Free Materials Their Time Has Finally Arrived," CircuiTree, vol. 21 no. 9, pp. xx-xx, Sept. 2008.

Beelen-Hendrikx, C. C. M., Klerk, J., and van der Water, J. T., "Lead-free Semiconductor Packaging," Proceedings of 4th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2002, pp. 11-19.

Beelen-Hendrikx, Caroline, and Verguld, Martin, "Trends in Electronic Packaging and Assembly for Portable Consumer Products," Proceedings of 3rd Electronics Packaging Technology Conference, Singapore, Dec. 5-7, 2000, pp. 24-32.

Beer, Detlef, "Lead-free: AOI in High-volume Production Assemblies," Surface Mount Technology (SMT), vol. 20 no. 1, pp. xx-xx, Jan. 2006.

Begin, Mathieu, "RFID Helps Achieve Lead-free Compliance," Surface Mount Technology (SMT), vol. 19 no. 11, pp. 48, Nov. 2005.

Beh, Key Shin, Leong, Jenn Seong, Loh, Wei Keat, and Tan, Wool Aun, "Solder Joint Reliability Challenges in Sub 1.00mm Ball Pitch for Flip Chip Ball Grid Array," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B, San Francisco, CA, July 17-22, 2005, pp. 1449-1454.

Beheshti, Mohammadsadegh, Choi, Junseo, Geng, Xiaohua, Podlaha-Murphy, Elizabeth, and Park, Sunggook, "Patterned electromagnetic alignment of magnetic nanowires," Microelectronic Engineering, vol. 193, pp. 71-78, June 5, 2018.

Behner, U., Haug, R., Schutz, R., and Hartnagel, H. L., "Characterization of Anisotropically Conductive Adhesive Interconnections by 1/f Noise Measurements," The First IEEE International Symposium on Polymeric Electronics Packaging, Oct. 26-30, 1997, pp. 243-248.

Behner, U., Czaya, C.-P., Haug, R., Hauschild, F.-D., Jiang, H., Kaloudis, M., Kotthaus, S., Kuschel, S., Schuetz, R., Schultze, F., Treutler, C. P. O., and Vogel, W., "Low-Cost Direct Chip Attach: Comparison of SMD Compatible FC Soldering with Anisotropically Conductive Adhesive FC Bonding," 1998 IEMT/IMC Proceedings, Tokyo, Japan, Apr. 15-17, 1998, pp. 358-363.

Behner, U., Czaya, C.-P., Haug, R., Hauschild, F.-D., Jiang, H., Kaloudis, M., Kotthaus, S., Kuschel, S., Schuetz, R., Schultze, F., Treutler, C. P. O., and Vogel, W., "Low-Cost Direct Chip Attach: Comparison of SMD Compatible FC Soldering with Anisotropically Conductive Adhesive FC bonding," Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium, Berlin, Germany, Apr. 27-29, 1998, pp. 49-54.

Behner, Ulrich, Haug, Ralf, Schutz, Reiner, and Hartnagel, Hans L., "Characterization of Anisotropically Conductive Adhesive Interconnections by 1/f Noise Measurements," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 21 no. 2, pp. 243-247, June 1998.

Behura, Sanjay K., Yang, Qiaoqin, Hirose, Akira, Jani, Omkar, and Mukhopadhyay, Indrajit, "Catalyst-free synthesis of silicon nanowires by oxidation and reduction process," Journal of Materials Science, vol. 49 no. 10, pp. 3592-3597, May 2014.

Beica, Rozalia, Wang, Kai, and Brown, Neil, "Tin-Silver Electroplating of Pb-free Wafer Bumps," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 835-840.

Beigle, Steve, "Alternate Metal Finishes for Wire Bond and Soldering Applications," Alpha Metals.

Beigle, Steve, "Alternate Metal Finishes for Wire Bond and Soldering Applications," IPC Printed Circuits Expo, San Jose, CA, Mar. 3-7, 1996, pp. S9-2-1-S9-2-6.

Beigle, Steve, "Non-Precious Metal Coatings for Fine Pitch Assembly and Direct Chip Attachment," Surface Mount International Proceedings of the Technical Program, Volume II, San Jose, CA, Sept. 10-12, 1996, pp. 780-785.

Beilis, Isak I., Koulik, Yosef, Boxman, Raymond L., and Arbilly, David, "Thin film deposition using a plasma source with a hot refractory anode vacuum arc," Journal of Materials Science, vol. 45 no. 23, pp. 6325-6331, Dec. 2010.

Belashov, O., and Spelt, J. K., "Thermal stress concentration factors for defects in plated-through-vias," Microelectronics Reliability, vol. 48 no. 2, pp. 225-244, Feb. 2008.

Belavic, Darko, Rocak, Dubravka, Plut, Janeta Fajfar, Hrovat, Marko, Pavlic, Janez, Drozd, Zdzizlaw, Macek, Srecko, Mcgill, Ian, and Bukat, Krystyna, "An Introduction of RoHS Legislation in SMD Thick-Film Hybrid Technology - a Case Study," 1st Electronics Systemintegration Technology Conference, Volume 2, Dresden, Germany, Sept. 5-7, 2006, pp. 690-695.

Belhadi, Mohamed El Amine, Akkara, Francy, Jian, Minghong, and Hamasha, Sa'd, "Effect of New SAC-Bi Solder Pastes on Thermal Cycling Reliability Considering Aging," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 333-338.

Belhadi, Mohamed El Amine, Wentlent, Luke, Athamneh, Raed Al, and Hamasha, Sa'd, "Mechanical Properties of SAC-Bi Solder Alloys with Aging," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 431-438.

Belhadi, Mohamed El Amine, Akkara, Francy John, Athamenh, Raed, Abueed, Mohammed, Hamasha, Sa'd, Ali, Haneen, Suhling, Jeff, and Lall, Pradeep, "The Effect of Bi on the Mechanical Properties of Aged SAC Solder Joint," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 1100-1105.

Belhenini, Soufyane, Bouchou, Abdelhake, Dosseul, Franck, and Tougui, Abdellah, "3-D finite elements simulation of drop test reliability on a Chip Scale Package: focus on the component architecture and materials," 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Lisbon, Portugal, Apr. 16-18, 2012, pp. xx-xx.

Belhenini, Soufyane, Tougui, Abdellah, Bouchou, Abdelhake, Mohan, Ranganathan, and Dosseul, Franck, "3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters," Journal of Electronic Materials, vol. 43 no. 3, pp. 708-716, Mar. 2014.

Bell, H., Heinze, R., Wohlrabe, H., Pfulb, J., Yamada, H., and Oswald, F., "Lead-Free Reflow Soldering," Circuitnet, Mar. 2009.

Bell, Hans, "A Comparison of Convection and Condensation Pb-Free Reflow Soldering," Circuits Assembly, vol. 17 no. 5, pp. 50, May 2006.

Bell, Hans, Kolossa, Thomas, and Fischer, Peter, "Surface Tension and Load-Carrying Capacities of Solder," Surface Mount Technology (SMT), vol. 28 no. 5, pp. 18,20-22,24-26,28-29, May 2013.

Bell, Hans, "Vacuum Soldering and Void-Free, Lead Free Solder Joints," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S13-01-1-S13-01-5.

Bell, M. I., "Valence force potential calculations of the lattice dynamics of diamond-type crystals," Journal of Chemical Physics, vol. 62 no. 8, pp. 3357-3358, Apr. 15, 1975.

Bell. Richard, "Lead-Free: Will Alternative Alloys Really Work?," Circuits Assembly , vol. 11 no. 9, pp. 120, Sept. 2000.

Bellemare, Rich, "RoHS and ELV Compliant Electroless Nickel," Products Finishing , vol. xx no. xx, pp. xx-xx, Oct. 2005.

Bellet-Amalric, E., Elouneg-Jamroz, M., Rueda-Fonseca, P., Bounouar, S., Den Hertog, M., Bougerol, C., Andre, R., Genuist, Y., Poizat, J. P., Kheng, K., Cibert, J., and Tatarenko, S., "Growth of II-VI ZnSe/CdSe nanowires for quantum dot luminescence," Journal of Crystal Growth, vol. 378, pp. 233-237, Sept. 1, 2013.

Belmonte, Joe, "Doing the Poka-Yoke," Circuits Assembly, vol. 17 no. 12, pp. 22, Dec. 2006.

Belmonte, Joe, "Lead Free Reflow & Wave Soldering Process Considerations," SMART Group "All You Ever Wanted to Know About Lead-Free" Seminar, High Wycombe, United Kingdom, Nov. 1, 2005.

Belmonte, Joe, "Pb-Free and SnPb Solder Printing, Compared," Circuits Assembly , vol. 16 no. 8, pp. 20, Aug. 2005.

Belmonte, Joe, and Apell, Marc, "Practical Pb Free Assembly," IPC APEX/EXPO 2005, Anaheim, CA, Feb. 22-24, 2005, (445 pages long).

Belmonte, Joe, Shah, Vatsal, Mohanty, Rita, Jensen, Tim, Lasky, Ron, and Bishop, Jeff, "Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. xx-xx.

Belmonte, Joe, Shah, Vatsal, Mohanty, Rita, Jensen, Tim, Lasky, Ron, and Bishop, Jeff, "Process Development for 01005 Lead Free Passive Assembly: Stencil Printing," IPC Review, vol. 48 no. 2, pp. 8, Feb. 2007.

Belmonte, Joe, "Six Steps to Lead Free Process Implementation," IPC APEX/EXPO 2005 , Anaheim, CA, Feb. 22-24, 2005, pp. xx-xx.

Belmonte, Joe, "Six Steps to Lead Free Process Implementation," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Belmonte, Joe, "STEP 2: Process Control," Surface Mount Technology (SMT), vol. 19 no. 2, pp. xx-xx, Feb. 2005.

Belmonte, Joe, "Trends in the Stencil Printing Process," Surface Mount Technology , vol. 19 no. 11, pp. xx-xx, Nov. 2005.

Belouet, C., Villard, C., Fages, C., and Keller, D., "Achievement of Homogeneous AuSn Solder by Pulsed Laser-Assisted Deposition," Journal of Electronic Materials, vol. 28 no. 10, pp. 1123-1126, Oct. 1999.

Belov, Ilja, Arwidson, Jonas, Poder, Ralf, Johannesson, Par, and Leisner, Peter, "The Effect of Variations in Temperature Cycling Profile and Mechanical Properties of Solder on Thermo-mechanical Reliability of a Lead-free BGA Package," 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Budapest, Hungary, Apr. 19-22, 2015, pp. xx-xx.

Belyakov, S., Atkinson, H. V., and Gill, S. P. A., "Crystallographically Faceted Void Formation in the Matrix of Lead-Free Solder Joints," Journal of Electronic Materials, vol. 39 no. 8, pp. 1295-1297, Aug. 2010.

Belyakov, S. A., and Gourlay, C. M., "Heterogeneous nucleation of bSn on NiSn4, PdSn4 and PtSn4," Acta Materialia, vol. 71, pp. 56-68, June 2014.

Belyakov, S. A., Nishimura, T., Sweatman, K., Nogita, K., and Gourlay, C. M., "Influence of Bi additions on the distinct bSn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%)," 2016 International Conference on Electronics Packaging, Hokkaido, Japan, Apr. 20-22, 2016, pp. 222-225.

Belyakov, S. A., Xian, J. W., Sweatman, K., Nishimura, T., Akaiwa, T., and Gourlay, C. M., "Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints," Journal of Alloys and Compounds, vol. 701, pp. 321-334, Apr. 15, 2017.

Belyakov, S. A., and Gourlay, C. M., "Metastable eutectic in Pb-free joints between Sn-3.5Ag and Ni-based substrates," Materials Letters, vol. 148, pp. 91-95, June 1, 2015.

Belyakov, S. A., Gourlay, C. M., Coyle, R., Johnson, C., and Arfaei, B., "Microstructure Evolution During Thermal Fatigue of a SAC Solder Containing 5.5%Sb," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 432-441.

Belyakov, S. A., and Gourlay, C. M., "NiSn4 formation during the solidification of Sn-Ni alloys," Intermetallics, vol. 25, pp. 48-59, June 2012.

Belyakov, S. A., and Gourlay, C. M., "NiSn4 Formation in As-Soldered Ni-Sn and ENIG-Sn Couples," Journal of Electronic Materials, vol. 41 no. 12, pp. 3331-3341, Dec. 2012.

Belyakov, S. A., and Gourlay, C. M., "NiSn4 in Solder Joints Between Sn-3.5Ag and Ni, ENIG or ENEPIG," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1273-1279.

Belyakov, S. A., Nishimura, T., Akaiwa, T., Sweatman, K., Nogita, K., and Gourlay, C. M., "Optimization of Ni and Bi levels in Sn-0.7Cu-xNi-yBi solders for improved interconnection reliability," 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Nagasaki, Japan, Apr. 17-21, 2018, pp. 211-215.

Belyakov, S. A., Arfaei, B., Johnson, C., Howell, K., Coyle, R., and Gourlay, C. M., "Phase Formation and Solid Solubility in High Reliability Pb-Free Solders Containing Bi, Sb or In," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 492-506.

Belyakov, S. A., Xian, J., Zeng, G., Sweatman, K., Nishimura, T., Akaiwa, T., and Gourlay, C. M., "Precipitation and coarsening of bismuth plates in Sn-Ag-Cu-Bi and Sn-Cu-Ni-Bi solder joints," Journal of Materials Science: Materials in Electronics , vol. 30 no. 1, pp. 378-390, Jan. 2019.

Belyakov, S. A., Sweatman, K., Akaiwa, T., Nishimura, T., and Gourlay, C. M., "Precipitation of Bi and SbSn Phases in Next-Generation Pb-Free Solders," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 484-491.

Belyakov, S. A., and Gourlay, C. M., "Recommended values for the bSn solidus line in Sn-Bi alloys," Thermochimica Acta, vol. 654, pp. 65-69, Aug. 10, 2017.

Belyakov, S. A., Nishimura, T., Akaiwa, T., Sweatman, K., and Gourlay, C. M., "Role of Bi in microstructure formation of Sn-Cu-Ni based BGAs on Cu metallizations," 2017 International Conference on Electronics Packaging , Yamagata, Japan, Apr. 19-22, 2017, pp. 232-236.

Belyakov, S. A., Nishimura, T., Akaiwa, T., Sweatman, K., Nogita, K., and Gourlay, C. M., "Role of Bi, Sb and In in microstructure formation and properties of Sn-0.7Cu-0.05Ni-X BGA interconnections," 2019 International Conference on Electronics Packaging, Niigata, Japan, Apr. 17-20, 2019, pp. 235-239.

Belyakov, S. A., and Gourlay, C. M., "Role of Fe impurities in the nucleation of metastable NiSn4," Intermetallics, vol. 37, pp. 32-41, June 2013.

Belyakov, S. A., and Gourlay, C. M., "The Influence of Cu on Metastable NiSn4 in Sn-3.5Ag-xCu/ENIG Joints," Journal of Electronic Materials, vol. 45 no. 1, pp. 12-20, Jan. 2016.

Belyakov, Sergey A., "Nitrogen in Reflow Soldering of Lead-Free Solders," 8th Siberian Russian Workshop and Tutorial on Electron Devices and Materials, Novosibirsk, Russia, July 1-5, 2007, pp. 84-85.

Belyakov, Sergey A., "Ultrasonic Modification of Sn-Ag-Cu Alloy Microstructure," 9th International Workshop and Tutorials on Electron Devices and Materials, Novosibirsk, Russia, July 1-5, 2008, pp. 58-59.

Benaben, P., "SURMAT 06: New challenges in surface treatment," Transactions of the Institute of Metal Finishing, vol. 85 no. 2, pp. 66-67, Mar. 2007.

Benaben, Patrick, "Some Aspects of Recent Development on Functional Trivalent Chromium Plating," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 373-381.

Benaben, Patrick, "Thick, Hard Electrodeposits From a Trivalent Chromium Bath," Plating & Surface Finishing, vol. 76 no. 11, pp. 60-63, Nov. 1989.

Benabou, L., Sun, Z., and Dahoo, P. R., "A thermo-mechanical cohesive zone model for solder joint lifetime prediction," International Journal of Fatigue, vol. 49, pp. 18-30, Apr. 2013. https://doi.org/10.1016/j.ijfatigue.2012.12.008

Bender, Dave, "Halogen Free - Impact on Connectors," Intel Halogen Free Symposium , Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Benedetto, Elizabeth Elias, Allen, Aileen, Troxel, Kris, and Miremadi, Jian, "Acceptance Testing of Pb-free Bar Solder Alloys," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 583-589.

Benedetto, Elizabeth Elias, "Evaluation of Palladium Lead Plating," Surface Mount Technology (SMT) , vol. 13 no. 2, pp. 90, 92, 94, 96, Feb. 1999.

Benedetto, Elizabeth Elias, "Lead Free Solder on Compaq's Aero Handheld Computer," 2001 Advanced Packaging Technology Conference Proceedings, 2001, pp. xx-xx.

Benedetto, Elizabeth Elias, "Solderability and Board Level Reliability of Palladium Plated, Fine Pitch Components," 1998 Surface Mount International Conference Proceedings , San Jose, CA, Aug. 23-27, 1998, pp. 624-632.

Benes, M., Placek, V., Matuschek, G., Kettrup, A. A., Gyoryova, K., Emmerich, W. D., and Balek, V., "Lifetime Simulation and Thermal Characterization of PVC Cable Insulation Materials," Journal of Thermal Analysis and Calorimetry, vol. xx no. x, pp. xx-xx, xxxx.

Bengston, Jon, and DePotov, Richard, "Comparing Soldering Results of ENIG and EPIG Post-steam Exposure," Surface Mount Technology (SMT), vol. 34 no. 9, pp. 88,90-94,96, Sept. 2019.

Benka, Stephen G., "How tin whiskers grow," Physics Today, vol. 62 no. 7, pp. 23, July 1, 2009. https://doi-org.ezproxy.uky.edu/10.1063/1.4797168

BenKinney, Marie, Arora, Ashish, and Swart, Jan, "The Influence of Regulatory Changes on Unique Product Designs," IEEE Symposium on Product Compliance Engineering, Longmont, CO, Oct. 22-23, 2007, pp. xx-xx.

Bennetts, Ben, "Lead-free solder may shift test methods toward boundary scan," Connect, vol. xx no. xx, pp. xx-xx, May 2004.

Benson, Duane, "Black Pad - And Then Some," SMT Web Exclusive Article.

Benson, Duane, "Commentary: Comply with RoHS in four easy steps," Electronic Business, July 11, 2006.

Benson, Duane, "RoHS in Four Steps," SMT Web Exclusive Article.

Benson, Duane, "Should You Mask 0.4 mm BGA Pads?," Printed Circuit Design and Fab/ Circuits Assembly, vol 28 no. 2, pp. 19, Feb. 2011.

Benson, Edward J., "Using Silicone Materials in Lead-Free CSP Processing," Chip Scale Review, vol. xx no. xx, pp. xx-xx, May-June 2001.

Benson, R. C., Phillips, T. E., and deHaas, N., "Volatile Species from Conductive Die Attach Adhesives," 1989 Proceedings 39th Electronic Components Conference, Houson, TX, May 22-24, 1989, pp. 301-308.

Benson, Richard C., Romenesko, Bruce M., Nall, Berry H., DeHaas, Newman, and Charles Jr., Harry K., "Current-Leakage Failures in Hybrid Microcircuits," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 9 no. 4, pp. 403-409, Dec. 1986.

Benson, Richard C., Phillips, Terry E., and DeHaas, Newman, "Volatile Species from Conductive Die Attach Adhesives," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 12 no. 4, pp. 571-577, Dec. 1989.

Bent, Westin R., and Turbini, Laura J., "Identifying the Chemicals Responsible for Conductive Anodic Filament (CAF) Enhancement," 1999 SMTA International Conference Proceedings, San Jose, CA, Sept. 12-16, 1999, pp. xx-xx.

Bentzen, Brian Sloth, Ebdrup, Lars, and Juul, Poul, "Pb-free Production Case," Mar. 30, 2004.

Bentzen, Brian Sloth, "Lead-free Requires Process Changes," Surface Mount Technology (SMT), vol. 17 no. 12, pp. xx-xx, Dec. 2003.

Bentzen, Brian Sloth, "The Green Production Task," Circuits Assembly, vol. 15 no. 2, pp. xx-xx, Feb. 2004.

Beranek, M. W., Rassaian, M., Tang, C.-H., St. John, C. L., and Loebs, V. A., "Characterization of 63Sn37Pb and 80Au2OSn Solder Sealed Optical Fiber Feedthroughs Subjected to Repetitive Thermal Cycling," IEEE Transactions on Advanced Packaging, vol. 24 no. 4, pp. 576-585, Nov. 2001.

Bereznycky, Paul, "Ask the EMPF Helpline!," empfasis, pp. 2,7, June 2009.

Bergauer, A., Bangert, H., Eisenmenger-Sittner, Ch., and Barna, P. B., "Whisker growth on sputtered AlSn (20 wt.% Sn) films," Thin Solid Films , vol. 258 no. 1-2, pp. 115-122, Mar. 15, 1995.

Bergendahl, Carl Gunnar, "Electronics Goes Halogen-Free: International Driving Forces and the Availability and Potential of Halogen-Free Alternatives," Proceedings of the 2000 IEEE International Symposium on Electronics and the Environment , San Francisco, CA, May 8-10, 2000, pp. 54-58.

Bergendahl, Carl Gunnar, Lichtenvort, Kerstin, Johansson, Glenn, Zackrisson, Mats, and Nyyssonen, Jonna, "Environmental and economic implications of a shift to halogen-free printed wiring boards," Circuit World, vol. 31 no. 3, pp. 26-31, 2005.

Berger, Ivan, "E-Cycling Made Easier," The Institute, vol. 30 no. 3, pp. 1, 19, Sept. 2006.

Berger, Robert, Bexell, Ulf, Grehk, T. Mikael, and Hornstrom, Sven-Erik, "A comparative study of the corrosion protective properties of chromium and chromium free passivation methods," Surface and Coatings Technology , vol. 202 no. 2, pp. 391-397, Nov. 25, 2007.

Berger, Thomas, "PCB production & test: tips from pros on lead-free processes Part 1 - Issues in hot air solder levelling (HASL)," Global SMT and Packaging , vol. 8 no. 7, pp. 18,20-21, July 2008.

Bergeson, Lynn, "Don't let REACH become a stretch," Chemical Processing, vol. xx no. x, pp. xx-xx, May 2004.

Bergeson, Lynn L., "EU's New Chemical Policy Will Hurt U.S. Competitiveness," Chemical Processing, vol. xx no. x, pp. xx-xx, Aug. 2003.

Bergeson, Lynn L., "It's Here ... and It Ain't Pretty," Chemical Processing, vol. xx no. x, pp. xx-xx, July 2003.

Bergeson, Lynn L., "RoHS, WEEE and Related EU Directives," Pollution Engineering, vol. 38 no. 9, pp. 15, Sept. 2006.

Bergeson, Lynn, "The impact of the European Union's directives on the U.S.," Chemical Processing, vol. 69 no. 8, pp. xx-xx, Aug. 2006.

Bergfeldt, Britta, Fisher, Michael M., Lehner, Theo, Mark, Frank E., Gruettner, Werner, Dresch, Hans, Dima, Bogdan, Kramer, Kai, and Vehlow, Juergen, "Large Scale Co-combustion Demonstration of Electrical and Electronic Shredder Residue at the Wuerzburg Municipal Solid Waste Incinerator (MHKW)," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 302-308.

Bergin, Chris, "NASA rebuttal of Tin Whisker dissent," NASA, June 8, 2006.

Bergman, David, "A Research Program on SAC Lead Free Alloys," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies , Frankfurt, Germany, Oct. 20-22, 2004.

Bergman, David, "IPC Technical Review -- David Bergman: IPC's Lead-Free Position: Still Standing," CircuiTree, vol. 14 no. 10, pp. xx, Oct. 2001.

Bergman, David, "Our goal has been to assist the industry as it works towards the orderly conversion to lead free soldering," Lead-Free Magazine, vol. 3, Feb. 2005.

Bergman. David, "Wacko, Inevitable, Irrelevant- Oh My!," Circuits Assembly, vol. 10 no. 8, pp. 80, Aug. 1999.

Bergman, Dieter, "20th Anniversary Perspective: What's Happening-2010: Part 3 - The Impact of Technology Roadmaps in the Last Decade," CircuiTree, vol. 21 no. 7, pp. xx-xx, July 2008.

Bergman, Dieter, "Establishing BGA "Void Protocols" per IPC-7095," IPC Review, vol. 48 no. 8, pp. 16-19, Sept. 2007.

Bergman, Stephanie, and Subramanian, K. N., "Critical studies to improve service reliability of Sn-Ag-Cu solder joints by thermal treatments," Journal of Materials Science: Materials in Electronics, vol. 23 no. 7, pp. 1442-1448, July 2012.

Bergmann, Rene, Tang, Peter Torben, Hansen, Hans Norgaard, and Moller, Per, "In-Situ Investigation of Lead-Free Solder Alloy Formation using a Hot-Plate Microscope," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 252-256.

Bergner, Danielle M., "The Electronic Waste Recycling Act of 2003: California's Response to the Electronic Waste Crisis," Marquette Law Review, vol. 88 no. 2, pp. 377-389, Fall 2004.

Bergum, Erik J., "CAF Resistance of NON-DICY FR-4," Printed Circuit Fabrication, vol. 25 no. 9, pp. 26,28,30, Sept. 2002.

Bergum, Erik J., and Humby, David, "Lead Free Assembly: A Practical Tool for Laminate Materials Selection," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Bergum, Erik, "Material World: A Funny Thing Happened on the Way to Trying to Be Green.," CircuiTree, vol. 20 no. 10, pp. xx-xx, Oct. 2007.

Berman, Jeff, "IPC gets the lead out of packaging standards," EDN, vol. xx no. xx, pp. xx-xx, Mar. 1, 2005.

Berman, Ronald J., "Customer Advisory - CA04-AGR-08: Backward Compatibility of Pb-Free Leadframe Decices," Agere Systems.

Bernal, J. D., "The Complex Structure of the Copper-Tin Intermetallic Compounds," Nature, vol. 122, pp. 54, July 14, 1928.

Bernard, David, and Willis, Bob, "A Suggested Process for Detecting Counterfeit Components," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 756-761.

Bernard, David, "An A-to-Z Guide to X-Ray Inspection, Part II," Circuits Assembly , vol. 19 no. 1, pp. 34, Jan. 2008.

Bernard, David, and Ainsworth, Steve, "Comparing Digital and Analogue X-ray Inspection for BGA, Flip Chip and CSP Analysis," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S05-2-1-S05-2-5.

Bernard, David, and Willis, Bob, "Correlating the Presence of Popcorned BGA Devices Post Reflow with Solder-Ball Diameter Measurements from X-ray Inspection," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 768-773.

Bernard, David, "Counterfeit Detection," Surface Mount Technology (SMT), vol. 22 no. 8, pp. 14, Aug. 2008.

Bernard, David, and Bryant, Keith, "Does PCB Pad Finish Affect Voiding Levels in Lead-Free Assemblies?," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 569-573.

Bernard, David, "Implications of Using Lead-Free Solders on X-Ray Inspection of Flip Chips and BGAs," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. xx-xx.

Bernard, David, "Lead-free Solder X-ray Inspection Implications," Surface Mount Technology (SMT), vol. 17 no. 10, pp. 48, Oct. 2003.

Bernard, David, and Willis, Bob, "Measurement Variation in PIHR Pb-Free Solder Joints," Circuits Assembly, vol. 17 no. 3, pp. 54, Mar. 2006.

Bernard, David, "Measurement Variation in the Fill of Intrusively Reflowed Lead Free Solder Joints with Different Board Finishes by X-ray Inspection," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 697-703.

Bernard, David, "Pb-Free, Moisture Sensitivity and X-Ray Inspection," Circuits Assembly, vol. 16 no. 8, pp. 26-27, Aug. 2005.

Bernard, David, and Willis, Bob, "Pin-in-hole reflow (PIHR) and lead-free solder joints," Global SMT and Packaging, vol. 7 no. 10, pp. 10-12, 14-15, Oct. 2007.

Bernard, David, "X-ray Inspection of Low-Temperature Solder Joints," Printed Circuit Design and Fab/ Circuits Assembly, vol. 37 no. 11, pp. 42-43, Nov. 2020.

Bernardin, T., Dupre, L., Burnier, L., Gentile, P., Peyrade, D., Zelsmann, M., and Buttard, D., "Organized porous alumina membranes for high density silicon nanowires growth," Microelectronic Engineering, vol. 88 no. 9, pp. 2844-2847, Sept. 2011.

Bernasko, P. K., Mallik, S., Ekere, N.,N., Seman, A., and Takyi, G., "Effect of Reflow Profile and Thermal Cycle Ageing on the Intermetallic Formation and Growth in Lead-free Soldering," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 986-990.

Bernasko, Peter K., Mallik, Sabuj, and Takyi, G., "Effect of Intermetallic Compound Layer Thickness on the Shear Strength of 1206 Chip Resistor Solder Joint," Soldering & Surface Mount Technology, vol. 27 no. 1, pp. xx-xx, 2015.

Bernauer, Christian, Kuntze, Torsten, Behrens, Volker, and Honig, Thomas, "Substitution of Silver/Cadmium oxide in High Voltage Disconnectors," Proceedings of the Fifty-First IEEE Holm Conference on Electrical Contacts , Chicago, IL, Sept. 26-28, 2005, pp. 42-47.

Bernede, J. C., Cattin, L., Morsli, M., and Berredjem, Y., "Ultra-thin metal layer passivation of the transparent conductive anode in organic solar cells," Solar Energy Materials and Solar Cells, vol. 92 no. 11, pp. 1508-1515, Nov. 2008.

Berni, Rossella, Catelani, Marcantonio, Fiesoli, Caterina, and Scarano, Valeria L., "A Comparison of Alloy-Surface Finish Combinations Considering Different Component Package Types and Their Impact on Soldering Reliability," IEEE Transactions on Reliability, vol. 65 no. 1, pp. 272-281, Mar. 2016.

Bernier, D., "Effect of Aging on the Solderability of Various Plated Surfaces," Plating, vol. 61 no. 9, pp. 842-845, Sept. 1974.

Bernier, Dennis, "An Expert Looks at the IssuesTM," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Sept.-Oct. 1999.

Berntson, Ross, Dixon, Doug, Holtzer, Mitch, Moloznik, Bruce, and Rothschild, Stan, "Heavy Metals," Adhesives & Sealants Industry, vol. xx no. xx, pp. xx-xx, Sept. 2007.

Berroukche, A., Soudini, B., and Amara, K., "Molecular dynamics simulation study of structural, elastic and thermodynamic properties of tin below 286 K," International Journal of Nanoelectronics and Materials, vol. 1 no. 1, pp. 41-51, Jan. 2008.

Berry, Paul, "Thermal Gradient Adhesion Testing," SMT Web Exclusive Article.

Berry, R. W., Bouton, G. M., Ellis, W. C., and Engling, D. E., "Growth of Whisker Crystals and Related Morphologies by Electrotransport," Applied Physics Letters, vol. 9 no. 7, pp. 263-265, Oct. 1, 1966.

Berry, Steve, and Winkler, Sandra, "Are you ready for RoHS?," Chip Scale Review, vol. xx no. xx, pp. xx-xx, 2006.

Berta, Bob, "Manufacturer's Corner: DynamicIR for Lead-Free Rework," empfasis , pp. xx-xx, Feb. 2006.

Berta, Robert, "Manufacturer's Corner Dage X-Ray: Popcorning," empfasis, pp. 10, Apr. 2007.

Berta, Robert, "Manufacturer's Corner Rework Equipment," empfasis, pp. 10, Mar. 2007.

Bertheau, J., Bleuet, P., Pantel, Roland, Charbonnier, J., Hodaj, F., Coudrain, P., and Hotellier, N., "Microstructural and Morphological Characterization of SnAgCu Micro-bumps for Integration in 3D Interconnects," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 1127-1132.

Bertheau, Julien, Hodaj, Fiqiri, Hotellier, Nicolas, and Charbonnier, Jean, "Effect of intermetallic compound thickness on shear strength of 25 um diameter Cu-pillars," Intermetallics, vol. 51, pp. 37-47, Aug. 2014.

Berthou, M., Retailleau, P., Fremont, H., Guedon-Gracia, A., and Jephos-Davennel, C., "Influence of PCB design and materials on chip solder joint reliability," 2010 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems , Bordeaux, France, Apr. 26-28, 2010, pp. xx-xx.

Berthou, M., Retailleau, P., Fremont, H., Guedon-Gracia, A., and Jephos-Davennel, C., "Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage," Microelectronics Reliability , vol. 49 no. 9-11, pp. 1267-1272, Sept.-Nov. 2009.

Berti, G. A., Monti, M., Bietresato, M., and D'Angelo, L., "Micro Wire-Drawing: Experiments And Modelling," AIP Conference Proceedings, vol. 908, pp. 711-716, 2007.

Bertling, Silvio, "Evaluating Laminates for High Temperature Assembly," The Board Authority, vol. xx no. xx, pp. 20-23, 2005.

Bertocci, F., and Grandoni, A., "Corrosion of Tin-Indium Solder during the Manufacturing Process of Biomedical Ultrasound Transducers," 2019 22nd European Microelectronics and Packaging Conference & Exhibition, Pisa, Italy, Sept. 16-19, 2019. pp. xx-xx.

Bertrand, Nathalie, Desgranges, Clara, Gauvain, Danielle, Monceau, Daniel, and Poquillon, Dominique, "Low Temperature Oxidation of Pure Iron: Growth Kinetics and Scale Morphologies," Materials Science Forum, vol. 461-464, pp. 591-598, 2004.

Beshai, M. H. N., Habib, S. K., Yassein, A. M., Saad, G., and El-Naby, M. M. Hasab, "Effect of SnSb Particle Size on Creep Behavior under Power Law Regime of Sn-10%Sb Alloy," Crystal Research Technology, vol. 34 no. 1, pp. 119-126, 1999.

Bestetti, M., Lecis, N., Magagnin, L., Pirovano, R., and Cavallotti, P. L., "Alternatives to coatings from Chromium VI baths," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 714-724.

Bestetti, M., Vicenzo, A., and Cavallotti, P. L., "Electrodeposition of Cu-Sn and Ag-Sn alloys from thiourea containing electrolytes," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 745-754.

Bestetti, M., Vicenzo, A., Lombardi, I., and Cavallotti, P. L., "Tin-copper Alloys Electroplating from Thiourea Solutions," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 584-592.

Betts, Kellyn S., "World's greenest PC goes global," Environmental Science & Technology, vol. 36 no. 19, pp. 368A-371A, Oct. 1, 2002.

Betts, Mitch, "'Zinc Whiskers' Vex Aussie Data Centers," Computerworld, vol. xx no. xx, pp. xx-xx, Dec. 13, 2004.

Beuers, J., Pteschek, G., and Schlamp, G., "Mechanical Properties of Soft Solder Materials for Electronic Applications," Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium, San Francisco, CA, Sept. 16-18, 1991, pp. 120-130.

Beyer, H., Sivasubramaniam, V., Bayer, M., and Hartmann, S., "Reliability of Lead-free Large Area Solder Joints in IGBT Modules with Respect to Passive and Active Thermal Cycling," 9th International Conference on Integrated Power Electronics Systems, Hamburg, Germany, Feb. 8-10, 2016, pp. xx-xx.

Bhagat, S. M., and Lubitz, P., "F.M.R. in H.C.P. Cobalt Whiskers," Magnetism and Magnetic Materials - 1972 (18th Annual Conference-Denver) Number, 10 Part 1, Denver, CO, Nov. 28-Dec. 1, 1972, pp. 125-129.

Bhagat, S. M., and Lubitz, P., "F.M.R. in H.C.P. Cobalt Whiskers," AIP Conference Proceedings, vol. 10, pp. 125-129, 1973.

Bhagat, S. M., Hirst, L. L., and Anderson, J. R., "Ferromagnetic Resonance in Nickel and Iron," Journal of Applied Physics , vol. 37 no. 1, pp. 194-197, Jan. 1966.

Bhassyvasantha, S., Fredj, N., Mahapatra, S. D., Jennings, W., Dutta, I., and Majumdar, B. S., "Whisker Mitigation Mechanisms in Indium-Doped Tin Thin Films: Role of the Surface," Journal of Electronic Materials, vol. 47 no. 10, pp. 6229-6240, Oct. 2018.

Bhat, Kiran N., Prabhu, K. N., and Satyanarayan, , "Effect of reflow temperature and substrate roughness on wettability, IMC growth and shear strength of SAC387/Cu bonds," Journal of Materials Science: Materials in Electronics, vol. 25 no. 2, pp. 864-872, Feb. 2014.

Bhate, D., Chan, D., Subbarayan, G., and Nguyen, L., "A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints," Journal of Electronic Packaging, vol. 130 no. 2, pp. 021003-1-021003-9, June 2008.

Bhate, D., and Subbarayan, G., "A Nonlinear Fracture Mechanics Perspective on Solder Joint Failure: Going Beyond the Coffin-Manson Equation," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , San Diego, CA, May 30-June 2, 2006, pp. 1220-1225.

Bhate, D., Chan, D., Subbarayan, G., Chiu, T. C., Gupta, V., and Edwards, D., "Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys at Creep and Low Strain Rate Regimes," 2007 ASME International Mechanical Engineering Conference and Exposition, Volume 5, Seattle, WA, Nov. 11-15, 2007, pp. 183-196.

Bhate, D., Chan, D., Subbarayan, G., and Nguyen, L., "Fatigue Crack Growth and Life Descriptions of Sn3.8Ag0.7Cu Solder Joints: A Computational and Experimental Study," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 558-565.

Bhate, D., Subbarayan, G., Zhao, J., Gupta, V., and Edwards, D., "Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits," Journal of Electronic Packaging, vol. 131 no. 4, pp. 044502-1-044502-3, Dec. 2009.

Bhate, D., Chan, D., and Subbarayan, G., "Non-Empirical Modeling of Fatigue in Lead-Free Solder Joints: Fatigue Failure Analysis and Estimation of Fracture Parameters," 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Como, Italy, Apr. 24-26, 2006, pp. xx-xx.

Bhate, D., Chan, D., Subbarayan, G., and Chiu, T. C., "Solder Interconnection Specimen Design and Test Control Procedure for Valid Constitutive Modeling of Solder Alloys," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , San Diego, CA, May 30-June 2, 2006, pp. 977-983.

Bhate, Dhruv, Chan, Dennis, Subbarayan, Ganesh, Chiu, Tz Cheng, Gupta, Vikas, and Edwards, Darvin R., "Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys at Creep and Low Strain Rate Regimes," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 3, pp. 622-633, Sept. 2008.

Bhatia, Gaytri, and Siegel, Jocelyn, "Summary of Lead-Free Solder Performance Based on Existing Data Provided by the Electronics Industry," Abt Associates, Dec. 4, 2002.

Bhatia, M. A., Adlakha, I., Lu, G., and Solanki, K. N., "Generalized stacking fault energies and slip in b-tin," Scripta Materialia, vol. 123, pp. 21-25, Oct. 2016.

Bhatkal, Ravi M., Patel, Amit, and Pandher, Ranjit, "High Reliability Interconnects for High Power LED Assembly," South East Asia Technical Training Conference on Electronics Assembly Technologies 2016 Proceedings, Penang, Malaysia, Apr, 12-14, 2016, pp. xx-xx.

Bhatt, H. J., "Superior Aluminum for Interconnections of Integrated Circuits," Applied Physics Letters, vol. 19 no. 2, pp. 30-33, July 15, 1971.

Bhatt, Harish, "Alternatives to Hexavalent Chromium to Comply with European Union's Directives (ELV, RoHS and WEEE)," Plating & Surface Finishing , vol. 93 no. 10, pp. 20-23, Oct. 2006.

Bhatt, Harish, "Status Update for End-of-Life Vehicle (ELV) Directive; Replacement of Hexavalent Cr in Automotive Industry," Proceedings 2003 AESF/EPA Conference for Environmental & Process Excellence, Daytona, FL, Feb. 3-7, 2003, pp. 31-37.

Bhatt, Harish, Manavbasi, Alp, and Rosenquist, Danielle, "Trivalent Chromium for Enhanced Corrosion Protection on Aluminum Surfaces," Metal Finishing, vol. 107 no. 6, pp. 39-47, June 2009.

Bhatt, Harish, Manavbasi, Alp, and Rosenquist, Danielle, "Trivalent Chromium for Enhanced Corrosion Protection on Aluminum Surfaces," Metal Finishing, vol. 107 no. 7-8, pp. 31-37, July-Aug. 2009.

Bhatt, V. P., and Trivedi, S. B., "Chemical and Thermal Etching of Se-Te Whisker Crystals," Journal of Crystal Growth, vol. 37 no. 1, pp. 23-28, Jan. 1977.

Bhatta, Rudra P., Henderson, Mark, Eufrasio, Andreza, Pegg, Ian L., and Dutta, Biprodas, "Properties of p- and n-Type PbTe Microwires for Thermoelectric Devices," Journal of Electronic Materials, vol. 43 no. 11, pp. 4056-4063, Nov. 2014.

Bhattacharya, Sitangshu, and Mallik, Ramesh Chandra, "Electrical Resistance and Seebeck Coefficient in PbTe Nanowires," Journal of Electronic Materials, vol. 41 no. 6, pp. 1421-1428, June 2012.

Bhattacharya, Sumit, Sharma, Ashutosh, Das, Siddhartha, and Das, Karabi, "Synthesis and Properties of Pulse Electrodeposited Lead-Free Tin-Based Sn/ZrSiO4 Nanocomposite Coatings," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 47 no. 3, pp. 1292-1312, Mar. 2016. https://doi.org/10.1007/s11661-015-3313-6

Bhatti, Pardeep K., Pei, Min, and Fan, Xuejun, "Reliability Analysis of SnPb and SnAgCu Solder Joints in FC-BGA Packages with Thermal Enabling Preload," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 601-606.

Bhavankar, Anand, "Ask the EMPF Helpline!," empfasis, pp. 2,8-9, July 2009.

Bhimarasetti, Gopinath, and Sunkara, Mahendra K., "Synthesis of Sub-20-nm-Sized Bismuth 1-D Structures Using Gallium-Bismuth Systems," Journal of Physical Chemistry B, vol. 109 no. 34, pp. 16219-16222, Sept. 1, 2005.

Bhuie, A. K., Ogunseitan, O. A., Saphores, J.-D.M., and Shapiro, A. A., "Environmental and Economic Trade-offs in Consumer Electronic Products Recycling: A case study of cell phones and computers," 2004 IEEE International Symposium on Electronics & the Environment Conference Record, Scottsdale, AZ, May 10-13, 2004, pp. 74-79.

Bhukari, S., Santos, D. L., Lehman, L. P., and Cotts, E., "Continued Evaluation of the Effects of Processing Conditions and Aging Treatments on Shear Strength and Microstructure in Pb-Free Surface Mount Assembly," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Bi, Jinglin, Hu, Anmin, Hu, Jing, Luo, Tingbi, Li, Ming, and Mao, Dali, "Effect of Cr additions on interfacial reaction between the Sn-Zn-Bi solder and Cu/electroplated Ni substrates," Microelectronics Reliability, vol. 51 no. 3, pp. 636-641, Mar. 2011.

Bi, Jinglin, Hu, Anmin, Li, Ming, and Mao, Dali, "The evolution of interfacial microstructure of Sn3.5Ag solder bump with Cu under-bump metallization," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 369-373.

Bi, Wenzhen, Ju, Guokui, Lin, Fei, Xie, Shifang, and Wei, Xicheng, "Interfacial IMC layer growth and tensile properties of low-silver Cu/SACBE/Cu solder joints," Soldering & Surface Mount Technology, vol. 24 no. 4, pp. 249-256, 2012.

Biancomano, Vincent, "IPC reactivates lead-free solder issue," Electronic Engineering Times, no. 1288, pp. 74, Sept. 22, 2003.

Biancomano, Vinvent, "IPC reactivates lead-free solder issue,", EE Times, Sept. 18, 2003.

Biancomano, Vincent, "IPC reactivates lead-free solder issue," Green SupplyLine, Sept. 18, 2003.

Biancomano, Vinvent, "IPC reactivates lead-free solder issue," eeProductCenter, Sept. 18, 2003.

Bibber, John W., "Chromate - Free Conversion Coatings For Aluminum," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 425-433.

Bibber, John W., "Chromate-Free Conversion Coatings For Aluminum," Plating & Surface Finishing, vol. 90 no. 3, pp. 40-43, Mar. 2003.

Bibber, John W., "Conversion Coatings For Magnesium and its Alloys," AESF SUR/FIN 2004 , Chicago, IL, June 28-July 1, 2004, pp. 438-447.

Bibber, John W., "Non-Chrome-Containing Conversion Coatings for Zinc and Zinc Alloys," Metal Finishing, vol. 106 no. 4, pp. 41-46, Apr. 2008.

Bibber, John W., "Zincate- or Stannate-free Plating of Magnesium, Aluminum, and Titanium," Metal Finishing, vol. 107 no. 7-8, pp. 28-30, July-Aug. 2009.

Bidin, Rahamat, Tagapulot, Rosemarie, Lao, Carl Nichelle D., and Manalac, Rodel, "Lead-Free Packaging", Advanced Packaging, vol. 10 no. 4, pp. xx-xx, Apr. 2001.

Bielawski, M., "Hard Chromium Plating Alternative Technologies," Canadian Aeronautics and Space Journal, vol. 46 no. 3, pp. 140-149, Sept. 2000.

Bieler, T. R., Jiang, H., Lehman, L. P., Kirkpatrick, T., and Cotts, E. J., "Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1462-1467.

Bieler, Thomas R., and Telang, Adwait U., "Analysis of Slip Behavior in a Single Shear Lap Lead-Free Solder Joint During Simple Shear at 25°C and 0.1/s," Journal of Electronic Materials, vol. 38 no. 12, pp. 2694-2701, Dec. 2009.

Bieler, Thomas R., Telang, Adwait U., Cotts, Eric J., Lehman, Larry P., Zamiri, A., and Pourboghrat, F., "Deformation and Microstructural Evolution Processes in Lead-Free Sn-Ag Solder Joints due to Creep, Aging and ThermoMechanical Fatigue and Preliminary Results on SAC Ball Grid Arrays," 2006 Lead-Free Technology Workshop , San Antonio, TX, Mar. 12, 2006, pp. xx-xx.

Bieler, Thomas R., Jiang, Hairong, Lehman, Lawrence P., Kirkpatrick, Tim, Cotts, Eric J., and Nandagopal, Bala, "Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 2, pp. 370-381, June 2008.

Bieler, Thomas R., Lee, Tae-kyu, and Liu, Kuo-Chuan, "Methodology for Analyzing Strain States During In Situ Thermomechanical Cycling in Individual Lead-Free Solder Joints Using Synchrotron Radiation," Journal of Electronic Materials, vol. 38 no. 12, pp. 2712-2719, Dec. 2009.

Bieler, Thomas R., Zhou, Bite, Blair, Lauren, Zamiri, Amir, Darbandi, Payam, Pourboghrat, Farhang, Lee, Tae-Kyu, and Liu, Kuo-Chuan, "The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints," Journal of Electronic Materials, vol. 41 no. 2, pp. 283-301, Feb. 2012.

Bigas, M., and Cabruja, E., "Characterisation of electroplated Sn/Ag solder bumps," Microelectronics Journal, vol. 37 no. 4, pp. 308-316, Apr. 2006.

Bigas, M., and Cabruja, E., "High density of electrodeposited Sn/Ag bumps for flip chip connection," Microelectronic Engineering, vol. 83 no. 3, pp. 399-403, Mar. 2006.

Bigelow, Peter, "A Turning Point," Printed Circuit Design and Manufacture, vol. 23 no. 7, pp. 14, July 2006.

Bigelow, Peter, "Ethics on Display," Printed Circuit Design and Manufacture, vol. 23 no. 3, pp. 14, Mar. 2006.

Bigelow, Peter, "Keep It Simple, Stupid!," Printed Circuit Design and Manufacture , vol. 22 no. 8, pp. 14, Aug. 2005.

Bigelow, Peter, "Why Lead-free Feels Like the End," Printed Circuit Design & Manufacture, vol. xx no. xx, pp. 18, Aug. 2004.

Biglari, M. H., and Fox, F., "CLOSER look at lead-free joints," Electronics Manufacture and Test , pp. xx-xx, Mar. 2006.

Biglari, M. H., Das, A., Krassenburg, L. C. P., Brom, J. H. G., van Veen, N. J. A., and Kodentsov, A. A., "Low-Temperature Soldering Using Ordered Alloys," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Biglari, M. H., Kox, F., Hermans, M., and Kodentsov, A., "Reliability Aspects of Lead-Free Soldering in Industrial Applications," 1st Electronics Systemintegration Technology Conference, Volume 1 , Dresden, Germany, Sept. 5-7, 2006, pp. 481-484.

Biglari, M. H., Nazarian, A., Denteneer, R., Biglari Jr., M., and Kodentsov, A. A., "Reliability of BGA Solder Joints after Re-Balling Process," IPC APEX Expo 2012, San Diego, CA, Feb. 28-Mar. 1, 2012, pp. xx-xx.

Bigum, Marianne, Brogaard, Line, and Christensen, Thomas H., "Metal recovery from high-grade WEEE: A life cycle assessment," Journal of Hazardous Materials, vol. 207-208, pp. 8-14, Mar. 15, 2012.

Bigum, Marianne, Petersen, Claus, Christensen, Thomas H., and Scheutz, Charlotte, "WEEE and portable batteries in residual household waste: Quantification and characterisation of misplaced waste," Waste Management, vol. 33 no. 11, pp. 2372-2380, Nov. 2013.

Bijimi, D., and Gabe, D. R., "Passivation Studies using Group VIA Anions. I. Anodic treatment of tin," British Corrosion Journal, vol. 18 no. 2, pp. 88-92, 1983.

Bijl, A. J., and Kolkmeijer, N. H., "De Kristalstructuur van Het Grauwe Tin," Chemisch Weekblad, vol. 15 nr. 40, pp. 1264, Oct. 5, 1918.

Bijl, A. J., and Kolkmeijer, N. H., "De Kristalstructuur van Tin," Chemisch Weekblad, vol. 15 no. 35, pp. 1077-1079, Aug. 31, 1918.

Bijl, A. J., and Kolkmeijer, N. H., "Investigation by means of X-rays of the crystal-structure of white and grey tin. I," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 21 no. 3, pp. 405-408, 1919.

Bijl, A. J., and Kolkmeijer, N. H., "Investigation by means of X-rays of the crystal-structure of white and grey tin, II. The structure of white tin," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 21 no. 4, pp. 494-500, 1919.

Bijl, A. J., and Kolkmeijer, N. H., "Investigation by means of X-rays of the crystal-structure of white and grey tin, III. The structure of grey tin," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 21 no. 4, pp. 501-504, 1919.

Bikulcius, G., "Control of Thickness of Corrosion-Resistant Zn-Fe, Zn-Co & Zn-Ni Coatings," Plating & Surface Finishing, vol. 84 no. 8, pp. 30, 32, Aug. 1997.

Bilek, J., Atkinson, J. K., and Wakeham, W. A., "Thermal Conductivity of Molten Lead-Free Solders," International Journal of Thermophysics, vol. 27 no. 1, pp. 92-102, Jan. 2006.

Biligiri, Suresh, "RoHS Screening Via XRF Technology: A Guideline to Selecting Systems," Metal Finishing, vol. 105 no. 4, pp. 29-31, 33, Apr. 2007.

Billah, M. Muktadir, and Shorowordi, Kazi Mohammad, "Effect of Micron Size Ni Particle Addition on Microstructure, Thermal and Mechanical Properties of Sn-9Zn Lead-free Solder Alloy," Applied Mechanics and Materials, vol. 229-231, pp. 271-275, Nov. 2012.

Billah, Md. Muktadir, Shorowordi, Kazi Mohammad, and Sharif, Ahmed, "Effect of micron size Ni particle addition in Sn-8Zn-3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties," Journal of Alloys and Compounds, vol. 585, pp. 32-39, Feb. 5, 2014.

Billah, Md Muktadir, and Chen, Quanfang, "Strength of MWCNT-Reinforced 70Sn-30Bi Solder Alloys," Journal of Electronic Materials, vol. 45 no. 1, pp. 98-103, Jan. 2016.

Bin, Jian, and Chen, Jeng-I, "Lead-Free Process Compatible No Flow Prepreg for Rigid-Flex PCB," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 377-380.

Bin, Yao, and Yabing, Zou, "Key Failure Modes of Solder Joints on ENIG PCBs and Root Cause Analysis," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1205-1208.

Bin, Yao, Yudong, Lu, and Daojun, Luo, "Key Failure Modes of Solder Joints on HASL PCBs and Root Cause Analysis," 2013 14th International Conference on Electronic Packaging Technology , Dalian, China, Aug. 11-14, 2013, pp. 742-745.

Bin, Yao, Hui, Chen, Yudong, Lu, and Daojun, Luo, "Study of Key Failure Modes of PTH in High Density Printed Board and Case Study," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 923-927.

Bin, Zhou, Qing, Zhou, Kailin, Pan, and Ganggang, Liu, "Extraction of Anand Model Parameters for Mixed Solder Material by Tensile Test," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1340-1343.

Bin, Zhou, Zhonghua, Wan, Xunping, Li, and Yun-fei, En, "Research on Tin Whisker Growth of Pure Tin Plating of Different Lead Substrates," 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Suzhou, China, July 15-19, 2013, pp. 611-614.

Bin, Zhou, Qing, Zhou, and Yun-fei, En, "Study on Interfacial Behavior and Shear Strength of Lead-free Micro-interconnect Bump after SnPb Reballing," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging , Guilin, China, Aug. 13-16, 2012, pp. 1317-1319.

Bing, An, Hua-bin, Chu, Jing-qiang, He, Jia, Wang, Li, Hua, Feng-Shun, Wu, and Yi-ping, Wu, "Low Cost Smart Labels Assembled by Anisotropically Conductive Adhesive," Proceedings of the 2006 IEEE CPMT Conference on High Density Microsystem Design, Packaging and Component Failure Analysis, Shanghai, June 27-28, 2006, pp. 228-231.

Biocca, Peter, "2005: A Year of Many Questions and Answers" Lead-Free Connection , vol. 2 no. 4, pp. 2-6, Dec. 2005.

Biocca, Peter, and Khan, Zulki, "Attaining Lead-free Solder Joint Reliability," Surface Mount Technology (SMT), vol. 19 no. 11, pp. 34-35, Nov. 2005.

Biocca, Peter, and Rivas, Carlos, "Case Study on the Validation of SAC305 & SnCu Based Solders in SMT, Wave and Hand-Soldering at the Contract Assembler Level," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Biocca, Peter, and Rivas, Carlos, "Case Study on the Validation of SAC305 and SnCu-Based Solders in SMT, Wave and Hand-Soldering at the Contract Assembler Level," 12th International Symposium on Advanced Packaging Materials, San Jose, CA, Oct. 3-5, 2007, pp. 152-157.

Biocca, Peter, and Rivas, Carlos, "Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-Soldering at the Contract Assembler Level," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Biocca, Peter, and Rivas, Carlos, "Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-Soldering at the Contract Assembler Level," Lead-Free Magazine.

Biocca, Peter. "Coming Soon: Lead-free Soldering in America," Surface Mount Technology (SMT), vol. 17 no. 10, pp. 22, Oct. 2003.

Biocca, Peter, "Creating of a Company Lead-free RoHS Implementation Plan" International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Biocca, Peter, "Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences," Kester.

Biocca, Peter, "Creating solder joint reliability with tin-copper based solders," EMasia, May 2007.

Biocca, Peter, "Developing a Reliable Lead-free SMT Assembly Process," Lead-Free Connection, vol. 1 no. 2, pp. 2-4, Nov. 2004.

Biocca, Peter, "Global Update on Lead-Free Solders," 1998 Surface Mount International Conference Proceedings, San Jose, CA, Aug. 23-27, 1998, pp. xx-xx.

Biocca, Peter, "Global Update on Lead-free Solders," Surface Mount Technology (SMT) , vol. 13 no. 6, pp. 64-67, June 1999.

Biocca, Peter, "How do you create a RoHS compliant lead-free roadmap?," emsnow , Dec. 13, 2004.

Biocca, Peter, "How Do You Create a RoHS Compliant - Lead-Free Roadmap?," Lead-Free Magazine, vol. 5, 2005.

Biocca, Peter, "Lead-free Alloys for Wave and SMT Assembly Status Report," Proceedings of the Technical Program NEPCON West 2000, Volume 1, Anaheim, CA, Feb. 29-Mar. 2, 2000, pp. 423-431.

Biocca, Peter, "Lead-free Alloys for Wave and SMT Assembly Assembly with Two Alloys," 2000 Lead Free Symposium Conference Proceedings, 2000, pp. xx-xx.

Biocca, Peter, "Lead-free and Lead Contamination," Surface Mount Technology (SMT) , vol. 18 no. 10, pp. 50, Oct. 2004.

Biocca, Peter, "Lead-free and RoHS Implimentation - Questions from the frontline," emsnow, Aug. 24, 2005.

Biocca, Peter, "Lead-free and RoHS Implementation - Questions from the Frontline, Part 1."

Biocca, Peter, "Lead-free and RoHS Implementation - Questions from the Frontline, Part 2."

Biocca, Peter, "Lead-free and RoHS Implimentation - Questions from the Frontline, Part 3," emsnow, Feb. 8, 2006.

Biocca, Peter, "Lead-free and RoHS implimentation questions from the frontline, Part 4," emsnow, Aug. 1, 2006.

Biocca, Peter, "Lead-free and RoHS Implimentation: Moving Forward with Questions as Always," Lead-Free Connection, vol. 3 no. 2, pp. 2-5, Aug. 2006.

Biocca, Peter, Tuerlings, Serge, Ishizaki, Yuzo, and Tan, Su-Lynn, "Lead-Free and RoHS: Its Global Reach," Lead-Free Connection, vol. 2 no. 3, pp. 1-5, Sept. 2005.

Biocca, Peter, "Lead-Free Connection Frequently Asked Questions," Lead-Free Connection, vol. 1 no. 1, pp. 9-10, July 2004.

Biocca, Peter, "Lead-Free Connection Frequently Asked Questions," Lead-Free Connection, vol. 1 no. 2, pp. 11, Nov. 2004.

Biocca, Peter, "Lead-free Defects in Reflow Soldering,", Feb. 15, 2005.

Biocca, Peter, "Lead-Free Defects in Reflow Soldering - How to Prevent Them," emsnow, Feb. 17, 2005.

Biocca, Peter, "Lead-free hand-soldering - ending the nightmares," emsnow, Apr. 26, 2006.

Biocca, Peter, "Lead-free Hand Soldering - Ending The Nightmares," Lead-Free Connection, vol. 3 no. 1, pp. 2-4, May 2006.

Biocca, Peter, "Lead-free Is Here. Where Are You?," SMT Web Exclusive Article.

Biocca, Peter, "Lead-free is more than solder," Nov. 24, 2004.

Biocca, Peter, "Lead-Free Reliability -- Building it Right the First Time," Lead-Free Connection, vol. 2 no. 2, pp. 2-5, June 2005.

Biocca, Peter, "Lead-free reliability - building it right the first time," emsnow , June 8, 2005.

Biocca, Peter, "Lead-Free Rework Experiences Using SAC and Sn-Cu Based Alloys," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 825-829.

Biocca, Peter, "Lead-free SMT - Considerations in Developing a Reliable Soldering Process," emsnow, Jan. 16, 2005.

Biocca, Peter, "Lead-free SMT soldering defects - how to prevent them," Global SMT & Packaging, vol. 4 no. 9, pp. 11-14, Oct. 2004.

Biocca, Peter, "Lead-free SMT Soldering Defects -- How to Prevent Them," Lead-Free Connection, vol. 2 no. 1, pp. 2-5, Jan. 2005.

Biocca, Peter, "Lead-free SMT soldering defects - how to prevent them," Dataweek , vol. xx no. xx, pp. xx-xx, Feb. 22, 2006.

Biocca, Peter, "Lead-free soldering and RoHS implementation - Questions from the Frontline, Part 2," emsnow, Nov. 22, 2005.

Biocca, Peter, "Lead-Free Wave Soldering," Lead-Free Connection, vol. 1 no. 1, pp. 2-4, July 2004.

Biocca, Peter, "Lead-free Wave Soldering - Some Insight on How to Develop a Process that Works," emsnow, Apr. 5, 2005.

Biocca, Peter, "Optimizing Lead-free Reflow Processes," Surface Mount Technology (SMT), vol. 19 no. 2, pp. 76, 78, 80, Feb. 2005.

Biocca, Peter, "Optimizing the Lead-free Reflow Process For Reliability and Defects Reduction," Lead-Free Magazine, vol. 5, 2005.

Biocca, Peter, "Preventing Lead-free Reflow Defects and Maintaining Process Yields," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Biocca, Peter, "Preventing Lead-free SMT Soldering Defects," Surface Mount Technology (SMT), vol. 28 no. 1, pp. 68-70,72,74-75, Jan. 2013.

Biocca, Peter, "Reliable Lead-free Wave and SMT Processes," Advanced Packaging , vol. 10 no. 8, pp. xx-xx, Aug. 2001.

Biocca, Peter, "Reliable Lead-free Wave and SMT Processes," Lead-free Electronics , Nov. 2004.

Biocca, Peter, "Reliable lead-free wave and SMT processes," Dataweek, vol. xx no. xx, pp. xx-xx, Feb. 22, 2006.

Biocca, Peter, "SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control," Lead-Free Magazine.

Biocca, Peter, "Solder Material," Lead-Free Magazine.

Biocca, Peter, "Solder Material," Lead-Free Magazine.

Biocca, Peter, "Solder Paste," Lead-Free Magazine.

Biocca, Peter, "Solder Paste," Lead-Free Magazine, vol. 3, Feb. 2005.

Biocca, Peter, "Solder Safety and Disposal Management," Proceedings of the Technical Program NEPCON West '94, Volume 2, Anaheim, CA, Feb. 27-Mar. 4, 1994, pp. 867-873.

Biocca, Peter, "STEP 3: Solder Materials," Surface Mount Technology (SMT), vol. 21 no. 3, pp. 26-28, Mar. 2007.

Biocca, Peter, "The turtle and the hare: beating the RoHS deadline anyway," Global SMT and Packaging, vol. 6 no. 2, pp. 20-22, 24, 26, Feb. 2006.

Biocca, Peter, and Rivas, Carlos, "The validation of SAC305 and SnCu-based solders at the contract assembler level," Global SMT and Packaging, vol. 7 no. 2, pp. 10-12, 14, 16, Feb. 2007.

Biocca, Peter, "Tin-copper based solder options for lead-free assembly," Global SMT and Packaging, vol. 6 no. 10, pp. 23-25, Nov./Dec. 2006.

Biocca, Peter, "Tin-Copper Based Solder Options for Lead-free Assembly," Lead-Free Connection, vol. 4 no. 1, pp. 2-5, Feb. 2007.

Biocca, Peter, "Worldwide Usage of Lead-free Solder Alloys for SMT," APEX 2000 , Long Beach, CA, Mar. 14-16, 2000, pp. P-MT2/1-1-P-MT2/1-3.

Birch, Bill, and Furlong, Jason, "Materials Testing of PWB Substrates to Determine Survivability Through Lead Free Assembly," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 431-448.

Birch, Bill, "Reliability Testing of PWB Plated Through Holes Using Interconnect Stress Testing Thermal Cycling Before and After Pb-Free Reflow Preconditioning," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 1032-1045.

Bird, Elliott J., Nelson, Kyle A., Harb, John N., and Wheeler, Dean R., "Investigation of additives for electroless plating of nanowires," Electrochimica Acta, vol. 70, pp. 69-75, May 30, 2012.

Bird, James "Mark", and Cannis, Jeff, 'Amkor Green/Pb Free Perspective," SAC Meeting, Dec. 2, 2003.

Bird, James "Mark", "JEDEC Position on Environmentally Friendly Products," Dec. 2, 2003.

Bird, Mark, "Changes to JEDEC's Moisture Sensitivity Classification for SMDs Likely Soon," Chip Scale Review, vol. xx no. xx, pp. xx-xx, July-Aug. 2000.

Bird, Mark, "Marking, symbols and labels to identify lead-free assemblies, devices and parts," Chip Scale Review, vol. xx no. xx, pp. xx-xx, July 2004.

Bird, Mark, "MRT Reflow Conditions for Lead-Free Packages Challenge Standards Group," Chip Scale Review, vol. xx no. xx, pp. xx-xx, July 2003.

Bird, Mark, "MRT Reflow Conditions for Lead-Free Packages Challenge Standards Group."

Bird, Mark, "New Lead-Free Finishes Require Testing to Determine Best Reflow Temperatures," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Nov.-Dec. 2001.

Bird, Mark, "Testing Packages with Lead-Free Finishes? MRT Reflow Standard Is Finally Revealed," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Nov.-Dec. 2002.

Birdsong, Barry, and Benninger, Glenn, "Counterfeit Parts - Mission Impact," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. FF-05.

Birkett, M. "Tin Whisker Formation Test Report," TT electronics Welwyn Components, Dec. 2006.

Birloaga, Ionela, De Michelis, Ida, Ferella, Francesco, Buzatu, Mihai, and Veglio, Francesco, "Study on the influence of various factors in the hydrometallurgical processing of waste printed circuit boards for copper and gold recovery," Waste Management, vol. 33 no. 4, pp. 935-941, Apr. 2013.

Birzer, Christian, Rakow, Bernd, Steiner, Rainer, and Walter, Juergen, "Drop Test Reliability Improvement of Lead-free Fine Pitch BGA Using Different Solder Ball Composition," Proceedings of 7th Electronic Packaging Technology Conference, Volume 1, Singapore, Dec. 7-9, 2005, pp. 255-261.

Birzer, Christian, Stoeckl, Stephan, Schuetz, Gerhard, and Fink, Markus, "Reliability Investigations of Leadless QFN Packages until End-of-Life with Application Specific Board Level Stress Tests," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 594-600.

Bishop, B. M., "Nikalium Dentures Plated with Tin-Nickel," Tin and its Uses, no. 132, pp. 10-11, 1982.

Bishop, Craig V., and Wynn, Paul C., "Erratum: Replacing Hexavalent Chromium," Transactions of the Institute of Metal Finishing, vol. 79 no. 3, pp. B34, May 2001.

Bishop, Craig V., and Loar, Gary, "Multiple-step Alternatives to Chromate Passivation," 1999 Aerospace/Airline Plating & Metal Finishing Forum, Jacksonville, FL, Apr. 20-22, 1999, pp. 107-111.

Bishop, Craig V., and Kochilla, John R., "Non-Hexavalent Chrome Passivation Technologies for Zinc and Zinc Alloys," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Bishop, Ronald, "Get the Lead Out: A Follow-Up by Bishop & Associates, Inc.," TTI.

Biswas, K., Qin, Y., DaSilva, M., Reifenberger, R., and Sands, T., "Electrical properties of individual gold nanowires arrayed in a porous anodic alimina template," Physica Status Solidi. A, Applications and materials science, vol. 204 no. 9, pp. 3152-3158, Sept. 2007.

Biswas, Kalyan, Liu, Shiguo, Zhang, Xiaowu, and Chai, T. C., "Thermo-mechanical Design of Large Die Fine Pitch Copper/Low-k FCBGA and Lead-free Interconnections," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Biswas, Subhajit, Doherty, Jessica, Majumdar, Dipanwita, Ghoshal, Tandra, Rahme, Kamil, Conroy, Michelle, Singha, Achintya, Morris, Michael A., and Holmes, Justin D., "Diameter-Controlled Germanium Nanowires with Lamellar Twinning and Polytypes," Chemistry of Materials, vol. 27 no. 9, pp. 3408-3416, May 12, 2015.

Bitton, Franck, "High Stakes: Reworking High-Precision, High-Reliability Boards," Circuits Assembly, vol. 15 no. 8, pp. 22-25, Aug. 2004.

Biunno, Nicholas, "A Root Cause Failure Mechanism for Solder Joint Integrity of Electroless Nickel / Immersion Gold Surface Finishes," IPC Printed Circuits Expo 1999, Long Beach, CA, Mar. 14-18, 1999, pp. S18-5-1-S18-5-8.

Biunno, Nicholas, and Barbetta, Michael, "A Root Cause Failure Mechanism for Solder Joint Integrity of Electroless Nickel/Immersion Gold Surface Finishes," 1999 SMTA International Conference Proceedings, San Jose, CA, Sept. 12-16, 1999, pp. xx-xx.

Biunno, Nicholas, and Barbetta, Michael, "A Root Cause Failure Mechanism for Solder Joint Integrity of Electroless Nickel / Immersion Gold Surface Finishes," 2000 Surface Finishes Forum Conference Proceedings, May 4, 2000, pp. xx-xx.

Bivins, Beth A., Juan, Alexia A., and Lee, Ning-Cheng, "Cleaning of Lead Free Solder Paste Residues," SMARTgroup.

Bivins, Beth A., Juan, Alexia A., Starkweather, Byron, Lee, Ning-Cheng, and Negi, Shailendra, "Post Solder Cleaning of Lead Free Solder Paste Residues," 2000 SMTA International Conference Proceedings, Chicago, IL, Sept. 24-28, 2000, pp. xx-xx.

Bixenman, Mike, "Cleaning," SMT Supplement, vol. 15 no. 7, pp. 30-34, July 1.

Bixenman, Mike, "How Will Electronic Precision Cleaning be Impacted When Adopting Lead-free Solder Technology," 2000 Lead Free Symposium Conference Proceedings , 2000, pp. xx-xx.

Bixenman, Mike, "Increased Interest in Cleaning Pb-Free Flux Residues," Circuitnet , May 16, 2007.

Bixenman, Mike, Lee, Ning-Chen, and Stach, Steve, "Ionic Cleanliness Testing Research of Printed Wiring Boards for Purposes of Process Control," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 690-703.

Bixenman, Mike, Ellis, Dirk, and Owens, Steve, "Lead-Free Soldering: DOE Study to Understand its Affect on Electronic Assembly Defluxing," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S33-2-1-S33-2-6.

Bixenman, Mike, "Matching the cleaning agent to the flux residue," Global SMT and Packaging, vol. 10 no. 8, pp. 14,16-17, Aug. 2010.

Bixenman, Mike, "Pb-free Cleaning Process Development," Circuitnet, Dec. 13, 2006.

Bixenman, Mike, "Quantifying Cleaning Relevance When Manufacturing Lead-Free Printed Circuit Board Assemblies," International Conference on Soldering and Reliability , Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Bixenman, Mike, "Reliability and Cleaning Find an Important Correlation," Circuitnet , Dec. 10, 2007.

Bixenman, Mike, "Step-by-Step: Cleaning," Surface Mount Technology (SMT), vol. 14 no. 9, pp. xx-xx, Sept. 2000.

Bixenman, Mike, "Step-by-Step: Cleaning," Lead-free Electronics, vol. xx no. xx, pp. xx-xx, Nov. 2004.

Bixenman, Mike, Miller, Erik, and Rueda, Fernando, "Ten lessons learned in cleaning Pb-free flux residues," Global SMT and Packaging, vol. 7 no. 1, pp. 10-11, 14-16, 18-19, Jan. 2007.

Bixenman, Mike, Miller, Erik, and Rueda, Fernando, "Ten Lessons Learned in Cleaning Pb-Free Flux Residues," Lead-Free Magazine.

Bixenman, Mike, and Stach, Steve, "Validity of the IPC R.O.S.E. Method 2.3.25 Researched," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S02_03-1-S02_03-9.

Bjerklie, Steve, "A pox on hexavalent chromium," Metal Finishing, vol. 103 no. 3, pp. 8-12, Mar. 2005.

Bjerklie, Steve, "Looking for Mr. Good Chrome," Metal Finishing, vol. 105 no. 5, pp. 21-23, May 2007.

Bjork, Mikael T., Schmid, Heinz, Breslin, Chris M., Gignac, Lynne, and Riel. Heike, "InAs nanowire growth on oxide-masked <111> silicon," Journal of Crystal Growth, vol. 344 no. 1, pp. 31-37, Apr. 1, 2012.

Bjorklof, A., "Electroless Bumped Bare Dice on Flexible Substrates," Microelectronics International, vol. 13 no. 2, pp. 40-52, 1996.

Bjorndahl, William D., Singleton, Leon, Griese, Richard, and Chong, Frank, "Detection of Tin Plating and Tin Whisker Mitigation," 42nd Annual Reliability Physics Symposium, Apr. 25-29, 2004, pp. 563-564.

Black, Harvey, "Getting the Lead Out of Electronics," Environmental Health Perspectives , vol 113 no. 10, pp. A682-A685, Oct. 2005.

Black, James R., "Electromigration Failure Modes in Aluminum Metallization for Semiconductor Devices," Proceedings of the IEEE, vol. 57 no. 9, pp. 1587-1594, Sept. 1969.

Blackshear, Edmund, Lombardi, Thomas, Pompeo, Frank, Audet, Jean, Kim, KyungMooon, Jeong, YoungHyuk, Choi, JoonYoung, Lee, JoonYeob, Park, ChangWoo, Kondo, Kyoji, Matsumoto, Shunichiro, and Miyazawa, Yoichi, "Advanced Laminate Carrier Module Warpage Considerations for 32nm Pb-free, FC PBGA Package Design and Assembly," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 523-529.

Blair, A., Abys, J. A., and Fan, C., "Palladium-plated Lead Frames -- Current Technology for Electroplaters," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. 661-669.

Blair, Alan, Dullaghan, C. A., Stacy, B. F., and Kwok, Jimmy. "An Economic Alternative to Decorative Palladium Plating - Palladium-Cobalt," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. 765-770.

Blair, Alan, "Analyze This...," Plating & Surface Finishing, vol. 87 no. 9, pp. 47, Sept. 2000.

Blair, Howard D., Pan, Tsung-Yu, Cooper, Ronald P., Nicholson, John M., Poulson, Russell H., Stine, Sandra C., Ezis, Katie, and Mitlin, David, "Copper Dissolution in Molten Solders," Proceedings of the Technical Program NEPCON West '94, Volume 1, Anaheim, CA, Feb. 27-Mar. 4, 1994, pp. 543-555.

Blair, Howard D., Pan, Tsung-Yu, and Nicholson, John M., "Intermetallic Compound Growth on Ni, Au/Ni, and Pd/Ni Substrates with Sn/Pb, Sn/Ag, and Sn Solders," 1998 Proceedings 48th Electronic Components & Technology Conference, Seattle, WA, May 25-28, 1998, pp. 259-267.

Blair, Howard D., Pan, Tsung-Yu, Nicholson, John M., Cooper, Ronald P., Oh, Sung-Won, and Farah, Ahmad R., "Manufacturing Concerns of the Electronic Industry Regarding Intermetallic Compound Formation During the Soldering Stage," Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, Oct. 14-16, 1996, pp. 282-292.

Blake, N., and Smith, R. W., "Electron microscopy of grey tin," Journal of Materials Science Letters , vol. 5 no. 1, pp. 103-104, Jan. 1986. https://doi.org/10.1007/BF01671454

Blakely, J. M., and Jackson, K. A., "Growth of Crystal Whiskers," Journal of Chemical Physics, vol. 37 no. 2, pp. 428-430, July 15, 1962.

Blanche, J. F., and Strickland, S. M., "Lead-Free Experiment in a Space Environment," NASA/TM-2012-217463, July 2012.

Blanche, Jim, and Strickland, Mark, "Working with Consortia - Advanced Packaging Reliability," 2010 NEPP Electronics Technology Workshop, Greenbelt, MD, June 22, 2010, pp. xx-xx.

Blass, D., Meilunas, M., and Borgesen, P., "On the Incorporation of Fine Pitch Lead Free CSPs in High Reliability SnPb Based Microelectronics Assemblies," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 1, pp. 92-99, Jan. 2011.

Blattau, N., Barker, D., and Hillman, C., "Lead Free Solder and Flex Cracking Failures in Ceramic Capacitors," 24th Annual Capacitor and Resistor Technology Symposium, San Antonio, TX, Mar. 29-Apr. 1, 2004, pp. 101-105.

Blattau, N., Hillman, C., Wiest, C., Wright, J., and Schatz, R., "Pb-Free Reflow Effect on Electrolytic Capacitors," Electronics World , vol. 112 no. 1850, pp. 18-22, Feb. 2007.

Blattau, N., Wright, J., Schatz, R., and Hillman, C., "Robustness of Surface-Mount Aluminum Electrolytic Capacitors When Subjected to Pb-free Reflow," Passive Component Industry, vol. x no. x, pp. 6,8-11, Nov./Dec. 2005.

Blattau, Nathan, Arnold, Joelle, Fischer, Gerd, and Hillman, Craig, "1st Order Failure Model for Area Array CSP Devices with Pb-Free Solder," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. xx-xx.

Blattau, Nathan, and Hillman, Craig, "A Comparison of the Isothermal Fatigue Behavior of Sn-Ag-Cu to Sn-Pb Solder," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 884-890.

Blattau, Nathan, and Hillman, Craig, "A Comparison of the Isothermal Fatigue Behavior of Sn-Ag-Cu to Sn-Pb Solder," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S34-02-1-S34-02-15.

Blattau, Nathan, and Hillman, Craig, "An Engelmaier Model for Leadless Ceramic Chip Devices with Lead Free Solder," IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies, Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.

Blattau, Nathan, and Hillman, Craig, "An Engelmaier Model for Leadless Ceramic Chip Devices with Pb-FreeSolder," Journal of the Reliability Information Analysis Center, pp. 6-11, First Quarter 2007.

Blattau, Nathan, and Hillman, Craig, "Design Guidelines for Ceramic Capacitors Attached with SAC Solder," IPC/APEX, Anaheim, California, Feb. 7-10, 2006, pp. xx-xx.

Blattau, Nathan, and Hillman, Craig, "First Order Failure Model for Leadless Ceramic Chip Devices with Pb-Free Solder," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 148-153.

Blattau, Nathan, and Hillman, Craig, "Has the Electronics Industry Missed the Boat on Pb-free? - Failures in Ceramic Capacitors with Pb-free Solder Interconnects -," 5th International Lead Free Conference on Electronic Components and Assemblies , San Jose, CA, March 18-19, 2004, pp. xx-xx.

Blattau, Nathan, Priimak, Danko, Arnold, Joelle, and Hillman, Craig, "Rapid Power Cycling of Pb-Free Soldered Components," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 913-916.

Blattau, Nathan, Gormally, Patrick, Iannaccone, Vin, Harvilchuck, Laurence, and Hillman, Craig, "Robustness of Surface Mount Multilayer Ceramic Capacitors Assembled with Pb-Free Solder," 2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.

Blazek, Michele, and Koomey, Jonathan G., "Predicting Future Power Requirements for the IT Sector: Making the Case for Including Life-Cycle Implications in Design of Servers," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment , San Francisco, CA, May 8-11, 2006, pp. 126-131.

Blech, I. A., and Meieran, E. S., "Electromigration in Thin Al Films," Journal of Applied Physics, vol. 40 no. 2, pp. 485-491, Feb. 1969.

Blech, I. A., Petroff, P. M., Tai, K. L., and Kumar, V., "Whisker Growth in Al Thin Films," Journal of Crystal Growth, vol. 32 no. 2, pp. 161-169, Feb. 1976.

Blekker, Kai, Munstermann, Benjamin, Matiss, Andreas, Do, Quoc Thai, Regolin, Ingo, Brockerhoff, Wolfgang, Prost, Werner, and Tegude, Franz-Josef, "High-Frequency Measurements on InAs Nanowire Field-Effect Transistors Using Coplanar Waveguide Contacts," IEEE Transactions on Nanotechnology , vol. 9 no. 4, pp. 432-437, July 2010.

Blekker, Kai, Richter, Rene, Oda, Ryosuke, Taniyama, Satoshi, Benner, Oliver, Keller, Gregor, Munstermann, Benjamin, Lysov, Andrey, Regolin, Ingo, Waho, Takao, and Prost, Werner, "InAs Nanowire Circuits Fabricated by Field-Assisted Self-Assembly on a Host Substrate," IEICE Transactions on Electronics, vol. E95.C no. 8, pp. 1369-1375, 2012.

Bloem, J., "Nucleation and Growth of Silicon by CVD," Journal of Crystal Growth , vol. 50 no. 3, pp. 581-604, Nov. 1980.

Bloembergen, N., "Nuclear Magnetic Relaxation in Semiconductors," Physica, vol. 20 no. 7-12, pp. 1130-1133, 1954. https://doi.org/10.1016/S0031-8914(54)80253-9

Blomberg, Lars, ""The RoHS directive should be reconsidered!"," evertiq, Dec. 12, 2008.

Bloom, Terry, Lautzenhiser, Frans, and Rine, Mark, "Plating to LTCC," 204th Meeting of the Electrochemical Society, Orlando, FL, Oct. 12-15, 2003, pp. xx-xx.

Blouin, Glen, "Is Canadian e-waste an environmental disaster in waiting?," canada.com, Jan. 20, 2006.

Blowes, David, "Tracking Hexavalent Cr in Groundwater," Science, vol. 295 no. 5562, pp. 2024-2025, Mar. 15, 2002.

Blum, A. I., and Goryunova, N. A., "(russian)," Doklady Akademii nauk SSSR, vol. 75 no. 3, pp. 367-370, 1950.

Blum, P. L., Pelissier, J., and Silvestre, G., "An Investigation of Soldered Copper-Tin Bond Brittleness by Electron Microscopy," Solid State Technology, vol. 16 no. 3, pp. 55-58, Mar. 1973.

Blum, Werner, Kullmann, Rainer, Wegner, Gerald L., and Kuhl, Reiner W., "Pure Tin: Differentiated View on the Risk of Whisker Formation," 23rd Capacitor and Resistor Technology Symposium, Scottsdale, AZ, Mar. 31-Apr. 3, 2003, pp. 148-154.

Blustein, G, Amo, B del, and Romagnoli, R., "The influence of the solubility of zinc phosphate pigments on their anticorrosive behaviour," Pigment and Resin Technology, vol. 29 no. 2, pp. 100-107, 2000.

Bo, Lai Zheng, Keat, Loh Wei, and Tamin, Mohd Nasir, "Damage Mechanics of Solder/IMC Interface Fracture in Pb-Free Solder Interconnects," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 731-736.

Bo, Lai Zheng, Kamsah, Nazri, Keat, Loh Wei, and Tamin, Mohd Nasir, "Mechanics of Sn-4Ag-0.5Cu Solder Joints in a Ball Grid Array Assembly during Reflow and Temperature Cycles," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Boareto, J. C., Metasch, R., Roellig, M., Wendhausen, P. A. P., and Wolter, K. J., "Influence of Indium on microstructure and creep properties of SnAg3.5InX (X=0,2,4,8) solder alloys," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Boareto, J. C., Rodrigues, G. V. S., Mastropietro, M. F., Wendhausen, P. A. P., and Wolter, K. -J., "Introduction of Nanosized Al2O3 in Sn-Ag3,5 Solders by Mechanical Alloying," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Bobe, Alexander, Regener, Doris, Dietze, Gabriele, and Heyse, Hartmut, "Veranderung Bleifreier Mikrolotkontakte bei Thermischer Beanspruchung (Changes of Lead Free Solder Joints under Thermal Loading)," Practical Metallography, vol. 44 no. 10, pp. 476-492, Oct. 2007.

Bobzin, K., Lugscheider, E., Zhuang, H., Ernst, F., Bagcivan, N., Maes, M., Rosing, J., Ferrara, S., Erdle, A., and Kramer, A., "New soldering processes and solder systems for hybrid microsystems: developments and applications," Microsystem Technologies, vol. 12 no. 7, pp. 620-625, June 2006.

Bock, E. M., "Guidelines for the Successful Use of Tin Plate on Connector Contacts," Proceedings of The International Technical Conference of SUR/FIN, Baltimore, MD, June 26-29, 1995, pp. 591-596.

Bock, Edward, "Mateability of Tin to Gold, Palladium, and Silver," 1990 Proceedings 40th Electronic Components & Technology Conference, Las Vegas, NV, May 20-23, 1990, pp. 840-844.

Bock, Geoff, "TESTING, QUALITY & STANDARDS: Wake Up on Waste," Appliance Design , vol. xx no. xx, pp. xx-xx, Feb. 1, 2005.

Bock, Geoff, "Wake Up on Waste," Appliance Design, vol. 53 no. 2, pp. 36-37, Feb. 2005.

Bock, Geoffrey, "ASTM F40 Committee Addresses Standards on Declarable Substances in Materials," TUV Rheinland World News, pp. 13-14, July/Aug. 2006.

Bock, Geoffrey, "Back to the Future?," TUV Rheinland World News, pp. 4-5, Nov./Dec. 2005.

Bock, Geoffrey, "Committee F40 and the Need for Standards on Declarable Substances in Materials," Standardization News, vol. 34 no. 7, pp. 23, July 2006.

Bock, Geoffrey, "Don't qet locked out of Europe," Machine Design, vol. 77 no. 11, pp. 96-98, June 2, 2005.

Bock, Geoffrey, "Life Cycle Management of Products," TUV Rheinland World News , pp. 6-8, Mar./Apr. 2005.

Bock, Geoffrey, "Lock Out! Manufacturers Must Comply with New Environmental Directives or Miss Out on the European Market," TUV Rheinland World News, pp. 6-8, Jan./Feb. 2005.

Bock, Geoffrey, "Uncovering the New Waste Directives," TUV Rheinland World News , pp. 10, Mar./Apr. 2004.

Bock, Geoff, "Wake Up on Waste," Appliance Design, vol. xx no. x, pp. xx-xx, Feb. 2006.

Bock, Geoffrey, "WEEE/RoHS: Back to the Future? Looking Back to Protect Your Future," Manufacturing.net, Jan. 18, 2006.

Bock, Geoffrey, "WEEE/RoHS Directives Self Declaration vs. Third Party Compliance," TUV Rheinland World News, pp. 3-4, Mar./Apr. 2006.

Bockmair, G., "Non-Chromate Surface Protection for Aircraft Maintenance," Advanced Materials Research, vol. 38, pp. 7-13, 2008.

Bockmair, Georg, and Kranzeder, Katharina, "Surface Protection for Aircraft Maintenance by Means of Zinc Rich Primers," Advanced Materials Research, vol. 138, pp. 41-46, 2010.

Bodger, B. E., McGrann, R. T. R., and Somerville, D. A., "The Evaluation of Tungsten Carbide Thermal Spray Coatings as Replacements for Electrodeposited Chrome Plating on Aircraft Landing Gear," Plating & Surface Finishing, vol. 84 no. 9, pp. 28-31, Sept. 1997.

Bodington, Juan Carlos, Eklin, Lauri, and Ojanen, Jari, "Minimizing power and energy consumption in the Outokumpu UPCAST process," Wire Journal International, vol. 36 no. 9, pp. 82-85, Sept. 2003.

Bodiul, P. P., Gitsu, D. V., Dolma, V. A., Miglei, M. F., and Zegrya, G. G., "The Thermopower in Bismuth Whiskers," Physica Status Solidi (a), vol. 53 no. 1, pp. 87-93, May 16, 1979.

Boehme, Mario, and Ensinger, Wolfgang, "From Nanowheat to Nanograss: A Preparation Method to Achieve Free Standing Nanostructures Having a High Length/Diameter Aspect Ratio," Advanced Engineering Materials, vol. 13 no. 5, pp. 373-375, May 2011.

Boeschlin, Jean-Philippe, and Purschel, Marco, "Automotive MOSFET Package for Lead Free Reflow Soldering Processes," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics , Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Boesenberg, Adam J., Anderson, Iver E., and Harringa, Joel L., "Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al," Journal of Electronic Materials, vol. 41 no. 7, pp. 1868-1881, July 2012.

Boettcher, Lars, Ostmann, Andreas, Manessis, Dionysios, Reichl, Herbert, Whitmore, Mark, and Staddon, Michael, "Development of 3D-Redistribution and Balling Technologies for Fabrication of Vertical Power Devices," SMTA Journal, vol. 18 no. 1, pp. 27-35, Jan. 2005.

Boettinger, W. J., Vaudin, M. D., Williams, M. E., Bendersjy, L. A., and Wagner, W. R., "Electronic Backscattered Diffraction and Energy Dispersive X-Ray Spectroscopy Study of the Phase NiSn4," Journal of Electronic Materials, vol. 32 no. 6, pp. 511-515, June 2003.

Boettinger, W. J., Handwerker, C. A., Newbury, B., Pan, T. Y., and Nicholson, J. M., "Mechanism of Fillet Lifting in Sn-Bi Alloys," Journal of Electronic Materials, vol. 31 no. 5, pp. 545-550, May 2002.

Boettinger, W. J., Johnson, C. E., Bendersky, L. A., Moon, K.-W., Williams, M. E., and Stafford, G. R., "Whisker and Hillock formation on Sn, Sn-Cu and Sn-Pb electrodeposits," Acta Materialia, vol. 53 no. 19, pp. 5033-5050, Nov. 2005.

Bogart, Matthew, and Brown, Harlan, "Lead-Free Glass Formulations for Passive Component Termination," 2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.

Bogert, Jim, "X-ray fluorescence spectroscopy enables RoHS action-level analysis," Connector Specifier, vol. 23 no. 3, pp. 16-18, June-July 2007.

Boggs, David W., "Introducing the OSP Process as an Alternative to Hasl."

Bogatin, Eric, "Lead-Free Is Coming," Semiconductor International, vol. 25, no. 4, pp. 42, Apr. 2002.

Bograchev, Daniil A., Volgin, Vladimir M., and Davydov, Alexey D., "Simulation of inhomogeneous pores filling in template electrodeposition of ordered metal nanowire arrays," Electrochimica Acta, vol. 112, pp. 279-286, Dec. 1, 2013.

Boguski, Robert, "When Failure Analysis is a Matter of Interpretation," Printed Circuit Design and Fab/ Circuits Assembly, vol. 31 no. 3, pp. 72-74, Mar. 2014.

Boguslavsky, I., "Materials Properties of Palladium Alloy Electrodeposits," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. 491-497.

Boguslavsky, I., Abys, J. A., Straschil, H., Tsuruta, H., Maisano, J., and Eckert, V., "New PdNi Plating Bath: Chemically Benign and Environmentally Friendly," Technical Conference Proceedings AESF SUR/FIN, Detroit, MI, June 23-26, 1997, pp. 363-368.

Boguslavsky, I., Abys, J. A., Kudrak, E. J., Williams, M. A., and Ong, T. C., "Pd-Ni-plated Lids for Frame-Lid Assemblies," Plating & Surface Finishing, vol. 83 no. 2, pp. 72-77, Feb. 1996.

Boguslavsky, Irina, "NEMI Sn Tin Whisker Project," JISSO/PROTEC Forum, Japan, May 15-16, 2003.

Boguslavsky, Irina, Bush, Peter, Kam-Lum, Elsa, Kwoka, Mark, McCullen, Jack, and Vo, Nick, "NEMI Sn Tin Whisker Project."

Boguslavsky, Irina, and Williams, Maureen, "NEMI Sn Whisker Modeling Group Part 1: Overview and Results," IPC/NEMI Meeting, New Orleans, LA, Nov. 7, 2002, pp. xx-xx.

Boguslavsky, Irina, and Bush, Peter, "NEMI Tin Whisker Test Group Phase 2 DOE Results," IPC 2002, New Orleans, LA, Nov. 7, 2002, pp. xx-xx.

Boguslavsky, Irina, Bush, Peter, Kam-Lum, Elsa, Kwoka, Mark, McCullen, Jack, Spalding, Keithm Vo, Nick, and Williams, Maureen, "NEMI Tin Whisker Test Method Standards," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 670-675.

Boguslavsky, Irina, "NEMI Tin Whisker Test Project," SMTA International, Chicago, IL, Sept. 25, 2003.

Boguslavsky, Irina, Straschil, H. K., Abys, J. A., Eckert, V. T., and Breck, G. F., "Palladium Cobalt -- A New Finish for Electronic Applications," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. xx-xx.

Boguslavsky, Irina, "Recrystallization Principles Applied to Whisker Growth in Tin." IPC SMEMA Council APEX 2003, Anaheim, CA, Mar. 31-Apr. 2, 2003, pp. S12-4-1 to S12-4-10.

"Whiskers: Truth and Mystery," IPC/NEMI Symposium on Lead-Free Electronics, Montreal, Canada, Sept. 19, 2002, pp. xx-xx.

Bohm, J., Volkert, C. A., Monig, R., Balk, T. J., and Arzt, E., "Electromigration-Induced Damage in Bamboo Al Interconnects," Journal of Electronic Materials, vol. 31 no. 1, pp. 45-49, Jan. 2002.

Bohm, Johannes, Wolter, Klaus-Juergen, and Heuer, Henning, "Solder Joint Inspection with Induction Thermography," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 1509-1516.

Bohme, Bjorn, Rollig, Mike, Wiese, Steffen, and Wolter, Klaus-Jurgen, "Lifetime Modeling based on an Advanced Test Chip Configuration for Lead-free Solder Joints," 29th International Spring Seminar on Electronics Technology, St. Marienthal, Germany, May 10-14, 2006, pp. 26-31.

Bohme, Thomas, and Muller, Wolfgang H., "Theoretical and experimental investigations of microstructural changes in lead-free solders," Computational Materials Science, vol. 43 no. 1, pp. 221-228, July 2008.

Bohnenkamp, Ulrich, "Produkt-und Prozessengineering fur Elecktronische Baugruppen," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Bohr, Philipp, "Policy Tools for Electronics Recycling: Characteristics of a specific certificate market design," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 132-137.

Boian, Jeffrey, "A strategy for implementing RoHS-compliant materials in engineering functions," Green SupplyLine, Dec. 15, 2006.

Boian, Jeffrey, "Recommending a Strategy for Implemeting RoHS Compliant Materials in Engineering Functions," Successful Lead-Free/RoHS Strategies Conference , Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Boisvert, Michelle M., "A Closer Look at Lead-free Solder," Surface Mount Technology (SMT) , Nov. 15, 2005.

Boisvert, Michelle M., "From the Editor," SMT Web Exclusive Article.

Boisvert, Michelle M., "Lead-Free: The Directives Draw Near," Surface Mount Technology , vol. 19 no. 8, pp. xx-xx, Aug. 2005.

Boisvert, Michelle M., "PB-free: How Close Are You?," Surface Mount Technology (SMT) , vol. 18 no. 12, pp. 4, Dec. 2004.

Boisvert, Michelle M., "Standardizing Material Declarations Globally," Surface Mount Technology (SMT), vol. 20 no. 4, pp. xx-xx, Apr. 2006.

Boisvert, Michelle M., "Tin Whisker Standards Help Alleviate Risk," Surface Mount Technology (SMT), vol. 20 no. 6, pp. 12, June 2006.

Boisvert, Michelle, "WEEE, RoHS, and a Trail of Breadcrumbs," SMT Web Exclusive Article.

Bojarski, Zbigniew, and Surowiec, Marian, "Morphology and Dislocation Structure of Iron Whiskers," Journal of Crystal Growth, vol. 46 no. 1, pp. 43-50, Jan. 1979.

Bokalo, Peter, Shahbazi, Samson, and Sims, Theresa D., "A Case Study of Lead Free Thick Film Conductors with Lead Free Solder Alloys," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 71-76.

Bokhout, H., and van Lent, P. H., "Electric properties of gray tin single crystals grown in tin-mercury alloys," Journal of Physics and Chemistry of Solids, vol. 24 no. 5, pp. 704-706, May 1963.

Boks, C., and Stevels, A., "Essential perspectives for design for environment. Experiences from the electronics industry," International Journal of Production Research , vol. 45 no. 18-19, pp. 4021-4039, Sept. 2007.

Boks, Casper, and Stevels, Ab, "Maturing markets for recycled plastics from WEEE: An elaboration on the consequences for the evaluation of future end-of-life scenarios," Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 11-15, 2001, pp. 520-526.

Boles, Steven T., Thompson, Carl V., and Fitzgerald, Eugene A., "Influence of indium and phosphine on Au-catalyzed InP nanowire growth on Si substrates," Journal of Crystal Growth, vol. 311 no. 5, pp. 1446-1450, Feb. 15, 2009.

Bolger, Justin C., Reynolds, Mark, and Popielarczyk, Jeff, "Area Bonding Conductive (ABC) Adhesives for Flex Circuit Connection to LTCC/MCM Substrates," 1995 Proceedings 45th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 1995, pp. 529-533.

Bolger, Justin C., and Gilleo, Ken, "Area Bonding Conductive Epoxy Adhesive Preforms for Grid Array and MCM Substrate Attach," Proceedings of the 1994 IEEE Multi-Chip Module Conference, Mar. 15-17, 1994, pp. 77-82.

Bolger, Justin C., and Czarnowski, John M., "Area Bonding Conductive Epoxy Adhesives for Low Cost Grid Array Chip Carriers," Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, Oct. 2-4, 1995, pp. 422-427.

Bolger, Justin C., Sylva, John M., and McGovern, James F., "Conductive Epoxy Adhesives to Replace Solder," Surface Mount Technology (SMT), vol. 6 no. 2, pp. 66,68,70, Feb. 1992.

Bolger, Justin C., McGovern, James F., and Sylva, John M., "Conductive Epoxy Surface Mount Adhesives for Solder Replacement." Proceedings of the Technical Program NEPCON West '91, Volume III, Anaheim, CA, Feb. 24-28, 1991, pp. 1955-1962.

Bolger, Michael, and Carrington, Clark, "Methylmercury Hazards and Risks - What is the Question?," Proceedings of the 31st Intersociety Energy Conversion Engineering Conference, Volume 4 , Washington, D.C., Aug. 11-16, 1996, pp. 2330-2334.

Bolin, Dick, and Bosze, Wayne, "RoHS and Tin Whisker Issues for Resistive Components," Proceedings of the 25th Symposium for Passive Components, Palm Springs, CA, Mar. 21-24, 2005, pp. 102-107.

Bolinger, Nancy J., "BFR and PVC Phase Out," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Bolshakova, I., Kost, Ya., Makido, O., and Shurygin, F., "Mathematical simulation, synthesis, characterization and application of indium arsenide whiskers," Journal of Crystal Growth, vol. 310 no. 7-9, pp. 2254-2259, Apr. 2008.

Bonafede, Salvatore, Huffman, Alan, and Palmer, W. Devereux, "Layer Structure and Thickness Effects on Electroplated AuSn Solder Bump Composition," IEEE Transactions on Components and Packaging Technologies , vol. 29 no. 3, pp. 604-609, Sept. 2006.

Bondarenko, V. A., "Electrodeposition of Whiskers and Thread-Like Crystals," Electrochimica Acta, vol. 29 no. Issue 7, pp. 887-891, July 1984. https://doi.org/10.1016/0013-4686(84)87132-7

Bonnaud, E. L., and Gudmundson, P., "Influence of Component Position on Lead-Free Solder Interconnections during Drop Test," Proceedings of 7th Electronic Packaging Technology Conference, Volume 1, Singapore, Dec. 7-9, 2005, pp. 54-57.

Bonnaud, E. L., and Gudmundson, P., "Lead-Free Solder Cyclic Plasticity Characterization for Drop Test Simulations," 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Como, Italy, Apr. 24-26, 2006, pp. xx-xx.

Bonnaud, Etienne L., "Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations," Journal of Electronic Packaging, vol. 133 no. 4, pp. 041013-1-041013-9, Dec. 2011.

Bonner, J. K. "Kirk", Castillo, L. Del, and Mehta, A., "Choosing the Right Lead-free Solder for Hi-rel Printed Wiring Assemblies," 48th International SAMPE Symposium and Exposition, Long Beach, CA, May 11-15, 2003, pp. 483-491.

Bonner, J. K. "Kirk", Castillo, L. del, and Mehta, A., "Hi-rel lead-free printed wiring assemblies," SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Bonner, J. K. "Kirk", Castillo, L. Del, and Mehta, A., "Issues concering the replacement of lead in Hi-Rel electronic applications," Industrial-Ecology UC-Discovery Grant Research Symposium: Electronic Design, Manufacturing, and the Environment, Apr. 3-4, 2003.

Bonoli, Alessandra, Goldoni, Silvia, and Guerra, Galliano, "Analysis of WEEE treatment methodologies within the Meaning of Directive 2002/96/EC of the European Parliament," REWAS'04 - Global Symposium on Recycling, Waste Treatment and Clean Technology, Volume III, Madrid, Spain, Sept. 26-29, 2004, pp. 2873-2874.

Bonyar, Attila, Hurtony, Tamas, and David, Szabolcs, "Investigation of the oxidation process at the copper-solder interface with atomic force microscopy," 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging, Alba Iulia, Romania, Oct. 25-28, 2012, pp. 317-320.

Bonyar, Attila, Hurtony, Tamas, and Harsanyi, Gabor, "Selective Electrochemical Etching for the Investigation of Solder Joint Microstructures," 2012 35th International Spring Seminar on Electronics Technology, Bad Aussee, Austria, May 9-13, 2012, pp. 89-94.

Booker, Chrisopher, "Is this the craziest EU law of all?," Nov. 6, 2006.

Boon, Jane E., Isaacs, Jacqueline A., and Gupta, Surendra M., "Economic Sensitivity for End of Life Planning and Processing of Personal Computers," Journal of Electronics Manufacturing, vol. 11 no. 1, pp. 81-93, Mar. 2002.

Boone, LeRoy, Campbell, Gerard P., and Palacio, Lourdes C., "Lead-free Wave Solder Alloy Selection: Reliability Is Key," Surface Mount Technology (SMT), vol. 19 no. 9, pp. xx-xx, Sept. 2005.

Bootsma, G. A., and Gassen, H. J., "A Quantitative Study on the Growth of Silicon Whiskers from Silane and Germanium Whiskers from Germane," Journal of Crystal Growth, vol. 10 no. 3, pp. 223-234, Aug. 1971.

Bora, Mumtaz Y., "Lead Free Assembly Qualification of Stacked MicroVia Boards," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S12-02-1-S12-02-6.

Borg, B. Mattias, Johansson, Jonas, Storm, Kristian, and Deppert, Knut, "Geometric model for metalorganic vapour phase epitaxy of dense nanowire arrays," Journal of Crystal Growth, vol. 366, pp. 15-19, Mar. 1, 2013.

Borgesen, P., Wentlent, L., Alghoul, T., Joshi, S., Sivasubramony, R., Yadav, M., Thekkut, S., Cuevas, J. L. Then, Alvarez, L. E., and Greene, C., "A Mechanistic Model for the Life of Solder Joints under Realistic Long-Term Service Conditions," 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Toulouse, France, Apr. 15-18, 2018, pp. xx-xx.

Borgesen, P., Yang, L., Qasaimeh, A., Yin, L., and Anselm, M., "A Mechanistically Justified Model for Life of SnAgCu Solder Joints in Thermal Cycling," 18th Annual Pan Pacific Microelectronics Symposium, Wailea-Makena, HI, Jan. 22-24, 2013, pp. xx-xx.

Borgesen, P., Blass, D., and Meilunas, M., "Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies," Journal of Electronic Packaging, vol. 134 no. 1, pp. 011010-1-011010-8, Mar. 2012.

Borgesen, P., Hamasha, S., Wentlent, L., Watson, D., and Greene, C., "Interpreting Accelerated Test Results for Lead Free Solder Joints," Pan Pacific Symposium 2016 Proceedings, Waimea, HI, Jan. 25-28, 2016, pp. xx-xx.

Borgesen, P., Cotts, E., and Dutta, I., "Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 536-546.

Borgesen, P., Hamasha, S., Obaidat, M., Raghavan, V., Dai, X., Meilunas, M., and Anselm, M., "Solder joint reliability under realistic service conditions," Microelectronics Reliability, vol. 53 no. 9-11 pp. 1587-1591, Sept.-Nov. 2013.

Borgesen, P., Jiang, J., Sivasubramony, R., Alvarez, L. E., Alghoul, T., Greene, C., Wentlent, L., and Meilunas, M., "Thermal Cycling - It Doesn't Have to be a Waste of Time and Money," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 370-378.

Borgesen, Peter, Wentlent, Luke, Hamasha, Sa'd, Khasawneh, Saif, Shirazi, Sam, Schmitz, Debora, Alghoul, Thaer, Greene, Chris, and Yin, Liang, "A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints," Journal of Electronic Materials, vol. 47 no. 5, pp. 2526-2544, May 2018.

Borgesen, Peter, Yin, Liang, and Kondos, Pericles, "Acceleration of the growth of Cu3Sn voids in solder joints," Microelectronics Reliability, vol. 52 no. 6, pp. 1121-1127, June 2012.

Borgesen, Peter, Yin, Liang, and Kondos, Pericles, "Assessing the risk of "Kirkendall voiding" in Cu3Sn," Microelectronics Reliability, vol. 51 no. 4, pp. 837-846, Apr. 2011.

Borgesen, Peter, "Assessment of Microelectronics Interconnect Reliability - Current Practice and Trends," 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Ghent, Belgium, Apr. 7-9, 2014, pp. xx-xx.

Borgesen, Peter, Yang, Linlin, Qasaimeh, Awni, Arfaei, Babak, Yin, Liang, Roggeman, Brian, and Meilunas, Michael, "Damage Accumulation In Pb-Free Solder Joints For Complex Loading Histories," 2011 Pan Pacific Microelectronics Symposium & Tabletop Exhibition , Kamuela, HI, Jan. 18-20, 2011, pp. xx-xx.

Borgesen, Peter, Dutta, Indranath, Meschter, Stephan, and Osterman, Michael, "DoD Lead-free Electronics Risk Mitigation: Lead-free Solder Basics for Systems Engineers," Tin Whisker Group teleconference, Mar. 29, 2017.

Borgesen, Peter, Al-Momani, Emad, and Meilunas, Michael, "Effect of Dwell Time on the Life of Lead Free BGA Joints in Thermal Cycling," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 377-383.

Borgesen, Peter, and Meilunas, Michael, "Effects of Solder Paste Volume and Reflow Profiles on the Thermal Cycling Performance of Mixed SnAgCu/SnPb Solder Joints," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 8, pp. 1205-1213, Aug. 2011.

Borgeson, Peter, "Ensuring Quality in Implantable Electronics," Assembly, vol. xx no. xx, pp. xx-xx, Feb. 7, 2006.

Borgesen, Peter, and Henderson, Donald W., "Fragility of Pb-free Solder Joints," Universal Instruments, Nov. 8, 2004.

Borgesen, Peter, and Cotts, Eric, "Implantable Medical Electronics Assembly Quality and Reliability Considerations," Journal of SMT, vol. 17 no. 3, pp. 25-33, July 2004.

Borgesen, Peter, and Cotts, Eric, "Implatable Medical Electronics Assembly - Quality and Reliability Considerations," Universal Instruments.

Borgesen, Peter, Yin, Liang, Kondos, Pericles A., Roggeman, Brian, Cotts, Eric, Tumne, Pushkraj, Li, Jing, and Srihari, Krishnaswami, "Interconnect Reliability in Medical Microelectronics Applications," 2008 Medical Electronics Symposium, Anaheim, CA, Jan. 29-31, 2008, pp. xx-xx.

Borgesen, Peter, "Lead-Free Solder Joint Reliability Oxymoron? (I like it, but ...)," Tin Whisker Group teleconference, Feb. 25, 2009.

Borgesen, Peter, Bieler, Thomas, Lehman, L. P., and Cotts, E. J., "Pb-Free Solder: New Materials Considerations for Microelectronics Processing," MRS Bulletin, vol. 32 no. 4, pp. 360-365, Apr. 2007.

Borgesen, Peter, and Sykes, Bob, "Predicting Brittle Fracture Failures," Surface Mount Technology , vol. 19 no. 10, pp. xx-xx, Oct. 2005.

Borgesen, Peter, and Sykes, Bob, "Predicting Brittle Fracture Failures," Advanced Packaging, vol. 14 no. 10, pp. 30-31, Oct. 2005.

Borgesen, Peter, Yin, Liang, Kondos, Pericles, Henderson, Donald W., Servis, Greg, Therriault, Joseph, Wang, Ju, and Srihari, K., "Sporadic Degradation in Board Level Drop Reliability - Those Aren't All Kirkendall Voids!," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 136-146.

Borgesen, Peter, and Schnabl, Karl, "Unique Behavior and Properties of Cu Pillar and Micro Bump Solder Joints," flipchips.com Tutorial 124, Oct. 2013.

Borgne, Brice Le, Salaun, Anne-Claire, and Pichon, Laurent, "Electrical properties of self-aligned gate-all-around polycrystalline silicon nanowires field-effect transistors," Microelectronic Engineering, vol. 150, pp. 32-38, Jan. 25, 2016.

Borgstrom, M., Deppert, K., Samuelson, L., and Seifert, W., "Size- and shape-controlled GaAs nano-whiskers grown by MOVPE: a growth study," Journal of Crystal Growth, vol. 260 no. 1-2, pp. 18-22, Jan. 2, 2004.

Borkes, Tom, and McDonough, Pat, "The Economical Development of a Lead-Free Assembly Process: A Practical Case Study that Minimized Conversion and Operational Costs," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 798-805.

Borle, W. N., Jayakumar, V., Sharda, G. D., Bal, M., and Seth, G. L., "On the Growth of Silicon Crystals in an Internal Work Coil Type Float Zoner," Journal of Crystal Growth, vol. 19 no. 4, pp. 359-360, July 1973.

Bornemann, Alfred, ""Tin Disease" in Solder Type Alloys," Symposium on Solder (ASTM Special Technical Publication No. 189), Atlantic City, NJ, June 19-20, 1956, pp. 129-148.

Borra, Vamsi, Georgiev, Daniel G., and Karpov, Victor G., "Cultivating Metal Whiskers by Surface Plasmon Polariton Excitation," MRS Advances, vol. 1 no. 12, pp. 805-810, Feb. 2016. https://doi.org/10.1557/adv.2016.160

Borra, Vamsi, Oudat, Osama, Georgiev, Daniel G., Karpov, Victor G., and Shvydka, Diana, "Metal whisker growth induced by localized, high-intensity DC electric fields," MRS Advances, vol. 3 no. 57-58, pp. 3367-3372, Nov. 2018. DOI: https://doi.org/10.1557/adv.2018.374

Borra, Vamsi, Georgiev, Daniel G., Karpov, V. G., and Shvydka, Diana, "Microscopic Structure of Metal Whiskers," Physical Review Applied , vol. 9 no. 5, pp. 054029-1-054029-9, May 2018.

Borra, Vamsi, and Georgiev, Daniel G., "Part - 1: Whisker characterization," Tin Whisker Group teleconference, October 11, 2017.

Borra, Vamsi, and Georgiev, Daniel G., "Part - 2: Whisker characterization," Tin Whisker Group teleconference, October 18, 2017.

Borra, Vamsi, Itapu, Srikanth, and Georgiev, Daniel G., "Sn whisker growth mitigation by using NiO sublayers," Journal of Physics D: Applied Physics, vol. 50 no. 47, pp. 475309-1-475309-7, Nov. 29, 2017.

Borras, Ana, Macias-Montero, Manuel, Romero-Gomez, Pablo, and Gonzalez-Elipe, Agustin R., "Supported plasma-made 1D heterostructures: perspectives and applications," Journal of Physics D: Applied Physics, vol. 44 no. 17, pp. 174016-1-174016-9, May 4, 2011.

Borras, Mario, Ratchev, Roumen, Lanier, Olivier, Guyenot, Michael, and Coutellier, Daniel, "Vibration Reliability of SMD Pb-free Solder Joints," 2010 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, Bordeaux, France, Apr. 26-28, 2010, pp. xx-xx.

Borruso, Marty, "Finishers' Think Tank," Plating & Surface Finishing, vol. 79 no. 7, pp. 34-35, July 1992.

Borruso, Marty, "Finishers' Think Tank," Plating & Surface Finishing, vol. 81 no. 1, pp. 34-35, Jan. 1994.

Borruso, Marty, "Finishers' Think Tank," Plating & Surface Finishing, vol. 81 no. 4, pp. 55-56, Apr. 1994.

Borruso, Marty, "Finisher's Think Tank," Plating & Surface Finishing, vol. 82 no. 5, pp. 122-123, May 1995.

Borruso, Marty, "Finishers' Think Tank," Plating & Surface Finishing, vol. 82 no. 11, pp. 41-42, Nov. 1995.

Borusso, Marty, "Finishers' Think Tank," Plating & Surface Finishing, vol. 83 no. 2, pp. 49, Feb. 1996.

Borusso, Marty, "Finishers' Think Tank," Plating & Surface Finishing, vol. 83 no. 6, pp. 40-41, June 1996.

Borusso, Marty, "Finishers' Think Tank," Plating & Surface Finishing, vol. 83 no. 7, pp. 30-31, July 1996.

Borruso, Marty, "Finishers' Think Tank," Plating & Surface Finishing, vol. 84 no. 4, pp. 40, Apr. 1997.

Borthakur, Anwesha, and Singh, Pardeep, "Researches on informal E-waste recycling sector: It's time for a "Lab to Land" approach," Journal of Hazardous Materials, vol. 323 pp. 730-732, Feb. 2017.

Borzone, G., Parodi, N., Cacciamani, G., and Watson, A., "Phase equilibria in the Au-In-Sn ternary system," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 33 no. 1, pp. 17-22, Mar. 2009.

Bosco, N. S., and Zok, F. W., "Critical interlayer thickness for transient liquid phase bonding in the Cu-Sn system," Acta Materialia, vol. 52 no. 10, pp. 2965-2972, June 7, 2004.

Bosco, Nick, Silverman, Timothy J., and Kurtz, Sarah, "Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints," Microelectronics Reliability, vol. 62, pp. 124-129, July 2016.

Botelho, Anabela, Dias, Marta Ferreira, Ferreira, Carla, and Pinto, Ligia M. Costa, "The market of electrical and electronic equipment waste in Portugal: Analysis of take-back consumers' decisions," Waste Management and Research , vol. 34 no. 10, pp. 1074-1080, Oct. 2016.

Botsford, Krista, "China RoHS vs. EU RoHS," EMasia, Oct. 2007.

Botsford, Krista, "China RoHS vs. EU RoHS Myths & Misconceptions," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Botsford, Krista, "Data Storage System Design: Best Practices for Industry (Focusing on RoHS-Type Legislation)," Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb. 10-12, 2009, pp. 88-91.

Botsford, Krista, "Eco-compliance: What, When, & Why: Focusing on European Union and China," Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb. 10-12, 2009, pp. 1-5.

Botsford, Krista, "Environmental Compliance Documentation," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Botsford, Krista, "Environmental Compliance Documentation: More than Materials Declaration," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Botsford, Krista, "EU RoHS Recast: Are you ready?," 2010 IEEE Symposium on Product Compliance Engineering, Boston, MA, Oct. 18-20, 2010, pp. xx-xx.

Botsford, Krista, "EU RoHS Recast: Are you ready?," SMTA International 2010 Conference (Presentations), Orlando, FL, Oct. 24-28, 2010.

Botsford, Krista, "EU RoHS Recast: Is your company ready, Are your products ready," 2010 IEEE Symposium on Product Compliance Engineering, Boston, MA, Oct. 18-20, 2010, pp. xx-xx.

Botsford, Krista, "EU RoHS vs. China RoHS," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Botsford, Krista, "EU RoHS VS. CHINA RoHS," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S09:02.

Botsford, Krista, ""It keeps going and going and going..."," IN Compliance Magazine 2010 Annual Guide, pp. 106,108-10, 2010.

Botsford, Krista, "Medical Devices and Eco-Compliance: A Proactive Approach," 2008 Medical Electronics Symposium, Anaheim, CA, Jan. 29-31, 2008, pp. xx-xx.

Botsford, Krista, "Preparing for Product Environmental Compliance: A Method for the Madness," 2010 IEEE Symposium on Product Compliance Engineering, Boston, MA, Oct. 18-20, 2010, pp. xx-xx.

Botsford, Krista, "RoHS compliance: Four misconceptions that could cripple your company," EMasia, May 2007.

Botsford, Krista, "RoHS Documentation: More than Materials Declaration," IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies , Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.

Botsford, Krista, "RoHS Recast - Are you ready?," Medical Electronics Symposium 2010 Proceedings, Tempe, AZ, Sept. 22-23, 2010, pp. xx-xx.

Botsford, Krista, "RoHS Update: Exemptions Expiring, Recast Vote Delayed," IN Compliance Magazine, pp. 5, Nov. 2010.

Botsford, Krista, "Using Materials Declaration to Meet Future Product-based Environmental Reporting Requirements," IPC Review, vol. 48 no. 8, pp. 7,9, Sept. 2007.

Botwin, Brad, "Counterfeits and the U.S. Industrial Base," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Bouarroudj, Mounira, Khatir, Zoubir, Ousten, Jean-Pierre, and Lefebvre, Stephane, "Temperature-Level Effect on Solder Lifetime During Thermal Cycling of Power Modules," IEEE Transactions on Device and Materials Reliability, vol. 8 no. 3, pp. 471-477, Sept. 2008.

Boukhicha, Rym, Vincent, Laetitia, Renard, Charles, Gardes, Cyrille, Yam, Vy, Fossard, Frederic, Patriarche, Gilles, Jabeen, Fauzia, and Bouchier, Daniel, "Gold nanocluster distribution on faceted and kinked Si nanowires," Thin Solid Films, vol. 520 no. 8, pp. 3304-3308, Feb. 1, 2012.

Boulanger, J. P., and LaPierre, R. R., "Unveiling transient GaAs/GaP nanowire growth behavior using group V oscillations," Journal of Crystal Growth, vol. 388, pp. 116-123, Feb. 15, 2014.

Boulanger, Jonathan P., and LaPierre, Ray R., "Polytype formation in GaAs/GaP axial nanowire heterostructures," Journal of Crystal Growth, vol. 332 no. 1, pp. 21-26, Oct. 1, 2011.

Boulos, Makram, Hamilton, Craig, Moreno, Mario, Mendez, Ramon, Soto, German, and Herrera, Jessica, "Selective Wave Soldering DoE to Develop DFM Guidelines for Lead and Lead-Free Assemblies," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 276-283.

Boulos, Makram, Hamilton, Craig, Moreno, Mario, Mendez, Ramon, Soto, German, and Herrera, Jessica, "Selective Wave Soldering DoE to Develop DfM Guidelines for Lead and Pb-Free Assemblies," Circuits Assembly, vol. 20 no. 1, pp. 26,28-30,32-34, Jan. 2009.

Boulouiz, Aziz, and Sabbar, Abdelaziz, "Pb-free solders: Experimental and calculated enthalpy of mixing of the liquid Au-In-Sn-Zn quaternary system," Thermochimica Acta, vol. 575, pp. 151-158, Jan. 10, 2014.

Boumendil, Jean-Jack, and Preti, Pascal, "Phase convection: Reflow soldering in the lead-free era," EMasia , Aug. 2007.

Bouravleuv, A. D., Sibirev, N. V., Statkute, G., Cirlin, G. E., Lipsanen, H., and Dubrovskii, V. G., "Influence of substrate temperature on the shape of GaAs nanowires grown by Au-assisted MOVPE," Journal of Crystal Growth, vol. 312 no. 10, pp. 1676-1682, May 1, 2010.

Bourdelaise, R. A., "Solderless Alternatives to Surface Mount Component Attachment," Soldering & Surface Mount Technology, vol. 3 no. 2, pp. 13-23, 1991.

Bourekas, Phil, "Green semiconductor packaging: Addressing the environmental concerns of the 21st century," EE Times - Asia, vol. xx no. xx, pp. xx-xx, Feb. 1, 2006.

Bourgoin, Ron, "Ambient Temperature Superconducting Filaments," 1983 Proceedings: The Second International Symposium on Non-Conventional Energy Technology , 1983.

Bouton, G. M., and Bader, W. G., "Migration and Whisker Growths of Tin and Solders Induced on Thin Metal Films by Direct Current and Heat," 1968 Electronic Components Conference , Washington, D. C., May 8-10, 1968, pp. 135-140.

Bouvier, Rachel, and Wagner, Travis, "The influence of collection facility attributes on household collection rates of electronic waste: The case of televisions and computer monitors," Resources, Conservation and Recycling, vol. 55 no. 11, pp. 1051-1059, Sept. 2011.

Bower, A. F., Fridline, D., Kumar, A., Shih, C. F., Xia, L., and Zhang, Y. W., "Finite Element Analysis of Electromigration and Stress in Interconnects," AIP Conference Proceedings, vol. 418, pp. 291-302, 1998.

Bowering, Norbert, and Meier, Christian, "Sticking behavior and transformation of tin droplets on silicon wafers and multilayer-coated mirrors," Applied Physics A, vol. 125 no. 9, pp. 633, Sept. 2019. https://doi.org/10.1007/s00339-019-2927-8

Bowers, Trevor S., Evans, John L., and Bozack, Michael J., "Reliability Comparison of Leaded, Array, and Leadless Packages on Alternative PWB Finishes," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. xx-xx.

Bowman, Heather S., "US Electronic Product Stewardship," IPC Printed Circuits Expo , Anaheim, CA, Feb. 24-26, 2004, pp. xx-xx.

Bowman Jr., R. C., Adams, P. M., Engelhardt, M. A., and Hochst, H., "Structural characterization of a-Sn and a-Sn1-x Gex alloys grown by molecular beam epitaxy on CdTe and InSb," Journal of Vacuum Science & Technology A: Vacuum Surfaces, and Films, vol. 8 no. 3, pp. 1577-1581, May 1990. https://doi-org.ezproxy.uky.edu/10.1116/1.576768

Bowser, Brad A., and Ellis, Todd, "Common Sense in RoHS Compliance,"Wire & Cable Technology International, vol. 33 no. 3, pp. 60-62, May/June 2005.

Boyd, Bill, "Advanced coating technologies for lead-free solders," Global SMT and Packaging, vol. 7 no. 6, pp. 10-12, June 2007.

Boyd, Bill, "Put Your Coat On," Assembly, vol. 51 no. 4, pp. 52-55, Apr. 2008.

Boyle, Richard, and Hoo, Nick, "Lead-Free Testing for RoHS Compliance," emsnow, July 25, 2005.

Boyle, Richard, "Lead Free Troubleshooting," SMART Group Ireland Lead-free Seminar , Dublin, Ireland, Oct. 22, 2003.

Boyle, Richard, "Wave set up," SMART Group Ireland Lead-Free Wave Soldering Workshop , Dublin, Ireland, Feb. 24, 2005.

Boyuk, U., and Marasli, N., "Dependency of eutectic spacings and microhardness on the temperature gradient for directionally solidified Sn-Ag-u lead-free solder," Materials Chemistry and Physics, vol. 119 no. 3, pp. 442-448, Feb. 15, 2010.

Boyuk, U., and Marasli, N., "The microstructure parameters and microhardness of directionally solidified Sn-Ag-Cu eutectic alloy," Journal of Alloys and Compounds, vol. 485 no. 1-2, pp. 264-269, Oct. 19, 2009.

Bozack, M. J., Crandall, E. R., Rodekohr, C. E., Flowers, G. T., and Lall, P., "Influence of Surface Composition and Substrate Roughness on Tin Whisker Growth," Tin Whisker Group teleconference, May 26, 2010.

Bozack, M. J., Suhling, J. C., Zhang, Y., Cai, Z., and Lall, P., "Influence of Surface Segregation on Wetting of Sn-Ag-Cu (SAC) Series and Pb-Containing Solder Alloys," Journal of Electronic Materials, vol. 40 no. 10, pp. 2093-2104, Oct. 2011.

Bozack, M. J., Snipes, S. K., and Flowers, G. N., "Methods for fast, reliable growth of Sn whiskers," Surface Science , vol. 652, pp. 355-366, Oct. 2016. https://doi.org/10.1016/j.susc.2016.01.010

Bozack, M. J., and Johnson, R. W., "Real-Time Scanning Electron Microscopy and Auger Spectroscopy of Wetting in Sn-3.3Au-4.8Bi Solder Paste Wetted to Ni-Au," Journal of Electronic Materials, vol. 34 no. 3, pp. 248-265, Mar. 2005.

Bozack, Michael J., Crandall, Erika R., Rodekohr, Chad L., Dean, Robert N., Flowers, George T., and, Suhling, Jeffrey C., "High Lateral Resolution Auger Electron Spectroscopic (AES) Measurements for Sn Whiskers on Brass," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 3, pp. 198-204, July 2010.

Bozack, Michael J., Snipes, Erica K., and Flowers, George T., "Influence of Small Weight Percentages of Bi and Systematic Coefficient of Thermal Expansion Variations on Sn Whiskering," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 7 no. 3, pp. 338-344, Mar. 2017.

Bozack, Michael J., "Research Activities in Surface Physics," Tin Whisker Group teleconferences, Feb. 15, 2012, Mar. 21, 2012, and Apr. 25, 2012.

Bozack, Mike, "(tin whiskers growing on thin film tin over a zinc substrate)." Tin Whisker Group teleconference, May 26, 2010.

Bozyazi, Ebru, Urgen, Mustafa, and Cakir, Ali Fuat, "Comparison of Reciprocating Wear Behavior of Electrolytic Hard Chrome And Arc-PVD CrN Coatings," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 705-713.

Brachmann, Matthias, "Is everybody ready?," emsnow, Dec. 21, 2004.

Brachmann, matthias, "Performance implications for non-solder materials used in the lead-free process (Part 1)," emsnow, Mar. 23, 2005.

Bracht, Stephen, Ball, Aghavni, and Salerno, Lisa, "Another Look at Lead-Free Solder Joint Reliability Under Random Vibration," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Bracht, Stephen, Ball, Aghavni, and Salerno, Lisa, "Another Look at Lead-Free Solder Joint Reliability Under Random Vibration," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 851-856.

Brack, Lance A., Mehrotra, Mradul, Simeus, Emmanuel J., Stegura, Stephen R., Weakley, Martin L., Reynolds, Adam S., Scionti, Martin L., and Thomas, William C., "DOE Results for Lead-Free Solder Process Development for Harsh Environment Considerations," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 547-557.

Bradford, Jeff, "JCAA/JG-PP Lead-Free Solder Project: Combined Environments Test," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Bradford, Jeff, Felty, Joe, and Russell, Bill, "JCAA/JG-PP Lead-Free Solder Project: Combined Environments Test," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 824-840.

Bradford, Jeff, Felty, Joe, and Russell, "JCAA/JG-PP Lead Free Solder Project: Combined Solder Project: Combined Environments Test," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S20-03-1-S20-03-34.

Bradley, D. E., Franks, J., and Rush, P. E., "Electron Microscopy of Tin Whiskers using Carbon Replicas," Proc. Phys. Soc. B, vol. 70 no. 9, pp. 889-892, Sept. 1, 1957. https://doi.org/10.1088/0370-1301/70/9/412

Bradley, Dennis, and Wade, Gwen K., "Be Careful With That!," Quality Digest, vol. 26 no. 3, pp. 33-37, Mar. 2006.

Bradley, Edwin, "Environmental Work Goes On," Electronic News, Jan. 21, 2002.

Bradley, Edwin, Bath, Jasbir, Whitten, Gordon, and Chada, Srinivas, "Lead-free project focuses on electronics assemblies," Advanced Packaging, vol. xx no. xx, pp. xx-xx, Feb. 2000.

Bradley, Edwin, "Lead-Free Solder Assembly: Impact and Opportunity," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 41-46.

Bradley, Edwin, Snowdon, Ken, and Gedney. Ronald, "Lead-Free Update," Circuits Assembly, vol. 10 no. 12, pp. 30-?, Dec. 1999.

Bradley, Edwin, Handwerker, Carol, and Sohn, John E., "NEMI Report: A Single Lead-free Alloy is Recommended," Surface Mount Technology (SMT), vol. 17 no. 1, pp. 24-25, Jan. 2003.

Bradley III, Edwin, and Hranisavljevic, Jasmina, "Characterization of the Melting and Wetting of Sn-Ag-X Solders," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 1443-1448.

Bradley III, Edwin, and Hranisavljevic, Jasmina, "Characterization of the Melting and Wetting of Sn-Ag-X Solders," IEEE Transactions on Electronics Packaging Manufacturing, vol. 24 no. 4, pp. 255-260, Oct. 2001.

Bradley, Tony, "Compliance: Beyond RoHS," Electronic Business, June 20, 2006.

Bradshaw, Charles, "Electrical Testing of No-lead-No-clean Paste Residues, No-clean Paste Residues, and Conductive Adhesive Residues to Predict ICT testability and Test Efficiencies," 2001 Advanced Packaging Technology Conference Proceedings, 2001, pp. xx-xx.

Brady, Bryan, "RoHS and High Reliability and Military: Good News and Bad News," Technology Review, vol. 12 no. 8, pp. 2, Aug. 2006.

Brady, Randall J.. "The Other War," Products Finishing, vol. 74 no. 3, pp. 10-15, Dec. 2009.

Braga, M. H., Malheiros, L. F., Soares, D., Ferreira, J., and Castro, F., "Experimental Phase Diagram of the Ternary Bi-Sn-Zn," Materials Science Forum, vol. 514-516, pp. 1682-1688, 2006.

Bragg, Jason, Zbrezny, Adam, Lai, Albert, Subramaniam, Suthakaran, Riccitelli, George, and McCormick, Heather, "Bend and Drop Testing Results for a Lead-free and Tin-lead 45 mm Flip Chip BGA," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Bragg, Jason, "Pb-Free FA Case Studies," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Bragg, W. L., "Discussion, Part I," Proceedings of the Physical Society, vol. 51 part 1 no. 289, pp. 54-55, Jan. 1940.

Bramlage, Silke, and Wolter, Klaus-Jurgen, "Intermetallic Compound Growth in Lead Free Solder Joints on Ag-Based Thick Film Coductors," 31st International Spring Seminar on Electronics Technology, Budapest, Hungary, May 7-11, 2008, pp. 32-36.

Bran, C., Ivanov, Yu. P., Trabada, D. G., Tomkowicz, J., del Real, R. P., Chubykalo-Fesenko, O., and Vazquez, M., "Structural Dependence of Magnetic Properties in Co-Based Nanowires: Experiments and Micromagnetic Simulations," IEEE Transactions on Magnetics, vol. 49 No. 8 part 1, pp. 4491-4497, Aug. 2013.

Brandmair, Andreas, Bohme, Thomas, and Muller, Wolfgang H., "Changes in the microstructure of materials and their impact on reliability: experiments and modeling," Microsystem Technologies, vol. 15 no. 1, pp. 201-215, Jan. 2009.

Brandmann, Christina, and Altvater, Meike, "Growing Regulatory Complexity as Challenge - Strategies for Managing Compliance with International Waste Regulations," Electronics Goes Green 2012+, Berlin, Germany, Sept. 9-12, 2012, pp. xx-xx.

Brannagan, D. J., "Enabling Factors Toward Production of Nanostructured Steel On an Industrial Scale." Journal of Materials Engineering and Performance, vol. 14, pp. 5-9, 2005.

Branzei, M., Svasta, P., Miculescu, F., Miculescu, M., and Plotog, I. , "Correlation between the Thermophysical Properties, Geometry and Microstructure of the SAC305 and SAC-X typical Solder Joints," 2009 15th International Symposium for Design and Technology of Electronics Packages , Gyula, Hungary, Sept. 17-20, 2009, pp. 129-133.

Branzei, M., Miculescu, F., Bibis, A., Cristea, I., Plotog, I., Varzaru, G., and Mihailescu, B., "Lead/Lead Free Solder Joints Comparative Electrical Tests as Function of Microstructure and Soldering Thermal Profile," 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging , Galati, Romania, Oct. 24-27, 2013, pp. 255-258.

Branzei, M., Plotog, I., Mihailescu, B., Matei, A. A., and Cucu, T. C., "Microstructure Morphology of No-Clean Lead-Free Solder Alloys Used in Automotive Industry," 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging, Constanta, Romania, Oct. 26-29, 2017, pp. 78-81.

Branzei, M., Plotog, I., Varzaru, G., and Cucu, T. C., "Thermophysical properties of some low temperature lead-free solder pastes dedicated to automotive applications," 2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging, Oradea, Romania, Oct. 20-23, 2016, pp. 44-47.

Branzei, Mihai, Vladescu, Marian, Plotog, Ioan, and Cucu, Traian, "Comparative Shear Tests of Two Low Melting Point Solder Pastes Relating to their Thermal Diffusivity," 2017 40th International Spring Seminar on Electronics Technology, Sofia, Bulgaria, May 10-14, 2017, pp. xx-xx.

Branzei, Mihai, Mihailescu, Bogdan, and Pencea, Ion, "Lead/Lead-Free Solder Alloys Shear Tests Correlations with Structure at Different Temperatures," Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, Dresden, Germany, May 7-11, 2014, pp. 252-255.

Branzei, Mihai, Varzaru, Gaudentiu, and Svasta, Paul Mugurel, "Shear Strength Function of Temperature for Lead/Lead-Free Alloys Samples Obtained with Different Cooling Rate," 2015 38th International Spring Seminar on Electronics Technology, Eger, Hungary, May 6-10, 2015, pp. 255-260.

Branzei, Mihai, Pencea, Ion, Plotog, Ioan, Miculescu, Florin, Cristea, Ionut, and Thumm, Andreas, "The Mischmetal and Bi94Zn6 Effect Alloying on SACX 0307," 2013 36th International Spring Seminar on Electronics Technology, Alba Iulia, Romania, May 8-12, 2013, pp. 24-29.

Brassard, Jeff, "Decorative Chromium Electroplating - A Process in Transition," Metal Finishing, vol. 86 no. 6, pp. 105, 107-108, June 1988.

Braterman, P. S., Marshall, J. L., Sees, J., Tan, C., and Zhao, J., "Examination of Various Soldered Surfaces and Electronic Components by Confocal Microscopy," Soldering & Surface Mount Technology, vol. 7 no. 2, pp. 22-26, 1995.

Bratin, P., Pavlov, Michael, and Chalyt, Gene, "Surface evaluation of the silver finishes via sequential electrochemical reduction analysis (SERA)," Circuit World, vol. 25 no. 1, pp. 59-64, 1998.

Bratin, Peter, Chalyt, Gene, Pavlov, Michael, and Gluzman, Rita, "Control of Tin and Tin/lead Electroplating Solutions by Cyclic Voltammetric Stripping," IPC Printed Circuits Expo, San Jose, CA, Mar. 3-7, 1996, pp. S16-1-1-S16-1-14.

Bratin, Peter, Pavlov, Michael, and Chalyt, Gene, "Evaluating Finishes Using SERA," Printed Circuit Fabrication, vol. 22 no. 5, pp. 30-32,34,36-37, May 1999.

Bratin, Peter, Chalyt, Gene, Hayward, Fred "Skip", and Pavlov, Michael, "SERA tin evaluation for surface finish," EE Times - Asia, vol. xx no. xx, pp. xx-xx, Apr. 15, 2001.

Bratin, Peter, Chalyt, Gene, Hayward, Fred, and Pavlov, Michael, "Tin Finishes," Printed Circuit Fabrication, vol. 23 no. 2, pp. 48-52,54, Feb. 2000.

Bratnikov, Alexander, and Lasky, Ronald, "Assembly of Large PWBs in a RoHS 6 Environment," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference , Las Vegas, NV, Apr. 1-3, 2008, pp. S12:02.

Bratnikov, Alexander, Billerica, Jabil, and Lasky, Ronald C., "Assembly of Large PWBs in a RoHS Environment," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. xx-xx.

Braun, Christian Seeberg, and Dirckinck-Holmfeld, Kasper Remmen, "Implementing WEEE in Denmark - Has Extended Producer Responsibility been the Outcome?," Proceedings of 2005 International Conference on Asian Green Electronics, Shang Hai, China, Mar. 15-18, 2005, pp. 67-75.

Braun, Martin, "The WEEE & RoHS Directives - A Manufacturer's Point of View," 2004.

Braun, T., Becker, K.-F., Sommer, J.-P., Loher, T., Schottenloher, K., Kohl, R., Pufall, R., Bader, V., Koch, M., Aschenbrenner, R., and Reichl, H., "High Temperature Potential of Flip Chip Assemblies for Automotive Applications," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 1, Orlando, FL, May 31-June 3, 2005, pp. 376-383.

Braun, T., Becker, K.-F., Koch, M., Bader, V., Aschenbrenner, R., and Reichl, H., "High-temperature reliability of Flip Chip assemblies," Microelectronics Reliability, vol. 46 no. 1, pp. 144-154, Jan. 2006.

Braun, T., Wunderle, B., Becker, K.-F., Koch, M., Bader, V., Aschenbrenner, R., and Reichl, H., "Improved Reliability of Leadfree Flip Chip Assemblies Using Direct Underfilling by Transfer Molding," 31st International Conference on Electronics Manufacturing and Technology, Kuala Lumpur, Malasia, Nov. 8-10, 2007, pp. 27-34.

Braunovic, M., "Effect of Intermetallic Phases on the Performance of Tin-Plated Copper Connections and Conductors," Proceedings of the Forty-Ninth IEEE Holm Conference on Electrical Contacts, Washington, D.C., Sept. 8-10, 2003, pp. 124-131.

Braunovic, M., and Gagnon, D., "Formation of Intermetallics in Lead-Free Systems," Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts, Brussels, Belgium, Oct. 4-5, 2004, pp. 267-273.

Braunovic, M., Gagnon, D., and Rodrigue, L., "Nanoscale Mechanical Properties of Intermetallics in Lead-Free Systems," Proceedings of the 52nd Holm Conference on Electrical Contacts, Montreal, Quebec, Canada, Sept. 25-27, 2006, pp. 117-123.

Braunovic, Milenko, Gagnon, Daniel, and Rodrigue, Lisa, "Nanoscale Mechanical Properties of Intermetallics in Lead-Free Systems," IEEE Transactions on Components and Packaging Technologies, vol. 32 no. 2, pp. 440-446, June 2009.

Braunwarth, Louisa, Amrhein, Sebastian, Schreck, Timo, and Kaloudis, Michael, "Ecological comparison of soldering and sintering as die-attach technologies in power electronics," Journal of Cleaner Production, vol. 102, pp. 408-417, Sept. 2015.

Breck, G. F., Dullaghan, C. A., Maisano, J., Abys, J. A., Boguslavsky, I., and Schnayderman, G., "PdCo - A Successful Scale-up to the Production Environment," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. 563-571.

Brehler, Jos, "Storage of Lead-Free Components," evertiq, Feb. 3, 2006.

Brenner, S. S., and Morelock, C. R., "Cross Sectioning of Whiskers," Review of Scientific Instruments, vol. 28 no. 8, pp. 652-653, Aug. 1957.

Brenner, S. S., "Further observations on the growth of silver whiskers from silver chloride," Acta Metallurgica, vol. 7 no. 10, pp. 677-678, Oct. 1959.

Brenner, S. S., "Growth and Properties of "Whiskers"," Science, vol. 128 no. 3324, pp. 569-575, Sept. 12, 1958.

Brenner, S. S, and Sears, G. W, "Mechanism of Whisker Growth - III Nature of Growth Sites," Acta Metallurgica, vol. 4 no. 3, pp. 268-270, May 1956.

Brenner, S. S., "Metal "Whiskers"," Scientific American, vol. 203 no. 1, pp. 64-72, July 1960.

Brenner, S. S., "Plastic Deformation of Copper and Silver Whiskers," Journal of Applied Physics, vol. 28 no. 9, pp. 1023-1026, Sept. 1957.

Brenner, S. S., "Properties of Whiskers," Growth and Perfection of Crystals, Cooperstown, NY, Aug. 27-29, 1958, pp. 157-190. (Edited by Doremus, R. H., Roberts, B. W., and Turnbull, David.)

Brenner, S. S., "Strength of Gold Whiskers," Journal of Applied Physics, vol. 30, pp. 266-267, 1959.

Brenner, S. S., "Tensile Strength of Whiskers," Journal of Applied Physics, vol. 27 no. 12, pp. 1484-1491, Dec. 1, 1956.

Brenner, Sidney S., "The Growth of Whiskers by the Reduction of Metal Salts," Acta Metallurgica, vol. 4 no. 1, pp. 62-74, Jan. 1956.

Brenner, S. S., and Morelock, C. R., "The High-Temperature Recovery of Deformed Copper Whiskers," Acta Metallurgica, vol. 4 no. 1, pp. 89-90, Jan. 1956.

Breuer, Steffen, Hilse, Maria, Geelhaar, Lutz, and Riechert, Henning, "Nucleation and growth of Au-assisted GaAs nanowires on GaAs(1 1 1)B and Si(1 1 1) in comparison," Journal of Crystal Growth, vol. 323 no. 1, pp. 311-314, May 15, 2011.

Brewer, Roland, and Gregoire, Steve, "Supply-chain Management: Asset Recovery & Disposition," Surface Mount Technology (SMT), vol. 20 no. 12, pp. 32, 34, Dec. 2006.

Brewin, Alan, "Are Laminates Resistant to Lead-free Reflow?," Microelectronics News, no. 17, pp. 2, June 2003.

Brewin, Alan, "Conductive Anodic Filament Growth in PWB Substrates," Microelectronics News, no. 18, pp. 1-2, Dec. 2003.

Brewin, Alan, Zou, Ling, and Hunt, Christopher, "Development of New Solderability Test Fluxes," NPL Report MATC(A)122, Sept. 2002.

Brewin, Alan, "I'm Exempt - Can I Relax?," Microelectronics News, no. 21, pp. 3, Spring 2005.

Brewin, Alan, "Impact of Lead-Free on Processing and Reliability of Laminates," SMART Group/NPL Lead Free Seminar 2003, Feb. 23, 2003.

Brewin, Alan, and Zou, Ling, "Lead Free and Other Process Effects on Conductive Anodic Filamentation Resistance of Glass Reinforced Epoxy Laminates," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S33-1-1-S33-1-7.

Brewin, Alan, "Lightening the lead-free load," Microelectronics News, no. 23, pp. 2, Winter 2006.

Brewin, Alan, "Realistic Solderability Testing with Lead-free Solders," Microelectronics News, no. 16, pp. 2, Jan. 2003.

Brewin, Alan, Hunt, Christopher, Dusek, Milos, and Nottay, Jaspal, "Reliability of Joints Formed with Mixed Alloy Solders," NPL Report MATC(A)85, Apr. 2002.

Brewin, Alan, "Reliability: the Main Issue for Lead-free," Microelectronics News , no. 19, pp. 2, July 2004.

Brewin, Alan, "Solder Contamination," Microelectronics News, no. 18, pp. 3, Dec. 2003.

Brewin, Alan, "Solderability Pre-heating Worries Overcome," Microelectronics News , no. 19, pp. 4, July 2004.

Brewin, Alan, "Solderability Testing and Soldering Defect Levels," SMART PPM Monitoring Workshop, Jan. 27, 2003.

Brewin, Alan, "SSTC Meeting Underlines Issues," Microelectronics News, no. 20, pp. 3, Autumn 2004.

Brewin, Alan, Zou, Ling, and Hunt, Christopher, "Stability of Electronic Components in Lead-Free Processing," NPL Report MATC(A)79, Dec. 2001.

Brewin, Alan, Zou, Ling, and Hunt, Christopher, "Susceptibility of Glass-Reinforced Epoxy Laminates to Conductive Anodic Filamentation," NPL Report MATC(A)155, Jan. 2004.

Brewin, Alan, "The Most Frequently Asked Questions on Lead-free," May 26, 2005.

Brewin, Alan, "The Science of Reliability," SMART Group Ireland Lead-free Seminar , Dublin, Ireland, Oct. 22, 2003.

Brewin, Peter, "New Chemicals Policy - what's the fuss all about?," Materials World , vol. 11 no. 9, pp. 20-22, Sept. 2003.

Brewin, Peter, "REACH in the final stretch," Materials World, vol. 14 no. 1, pp. 6, Jan. 2006.

Brewin, Peter, "REACHing out," Materials World, vol. 14 no. 3, pp. 24-26, Mar. 2006.

Brick, V. B., Larikov, L. N., and Falchenko, V. M., "The effect of impurities on the b->a transformation process in tin," Kristall und Technik, vol. 14 no. 2, pp. 135-140, 1979. https://doi-org.ezproxy.uky.edu/10.1002/crat.19790140202

Bridges, Jade, and Stuart, Amanda, "REACH Regulation Impacts on Exporters to EU," Circuitnet, Apr. 6, 2009.

Briggs, Ed, and Lasky, Ron, "Best Practices Reflow Profiling for Lead-Free SMT Assembly," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 639-645.

Briggs, Ed, and Lasky, Ron, "Process Guidelines to Ensure Optimal SMT Electronics Assembly," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 16-18, 2012, pp. xx-xx.

Briggs, Edward, and Lasky, Ronald, "STEP 7: Flux Chemistry for Lead-free SMT," Surface Mount Technology (SMT), vol. 22 no. 8, pp. 24,26, Aug. 2008.

Brinkley, Anne, "IBM Environmental Requirements for Materials, Part, and Products," IBM Engineering Specification 46G3772, July 28, 2003.

Brinkman, Don, "Designing for ROHS: Select the right lead-free-connector design for heat-sensitive applications," EDN, vol. 54 no. 5, pp. 40-41, Mar. 5, 2009.

Brinkman, Don, "Designing for RoHS: Select the right lead free connector design for heat sensitive applications," EMasia, May 2009.

Brist, Gary, "PCB Reliability Challenges," Overcoming the Reliability Challenge: An IPC Summit, Andover, MA, Apr. 15, 2008, pp. xx-xx.

Britt, Linda, "Ask the EMPF Helpline!," empfasis, pp. 5, Aug. 2005.

Britton, S. C., "Behavior of Tin Alloy Coatings," Tin and its Uses, no. 50, pp. 6-8, 1960.

Britton, S. C., and Clarke, M., "Effects of Diffusion from Brass Substrates into Electrodeposited Tin Coatings on Corrosion Resistance and Whisker Growth," 6th International Metal Finishing Conference, London, United Kingdom, May 25-29, 1964, pp. 205-211.

Britton, S. C., "Spontaneous Growth of Whiskers on Tin Coatings: 20 Years of Observation," Transactions of the Institute of Metal Finishing, vol. 52, pp. 95-102, Apr. 3, 1974. https://doi.org/10.1080/00202967.1974.11870313

Britton, S. C., "Tin Alloy Coatings as Alternatives to Nickel-Chromium," Tin and its Uses, no. 33, pp. 10-12, Oct. 1955.

Brizoux, M., Grivon, A., Smith, B. J., and Snugovsky, P., "Industrial Backward Solution for Lead Free Exempted AHP* Electronic Products," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S15:01.

Broadbent, Eliot K., Towner, Janet M., Towsend, Paul H., and Vander Plas, Hubert A., "Electromigration-induced short-circuit failure in aluminum underlaid with chemically vapor deposited tungsten," Journal of Applied Physics, vol. 63 no. 6, pp. 1917-1923, Mar. 15, 1988.

Brockman, Daniel, and Wyrostek, Michael, "Chromium Alternative Solves Problem," Products Finishing, vol. xx no. xx, pp. xx-xx, June 9, 2003.

Brodie, D. S., Gunn, A. J., Muller, W. H., and Reuben, R. L., Toward a Better Understanding of Morphology Changes in Solders Using Phase Field Theories: Quantitative Modeling and Experimental Verification," Proceedings of 4th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2002, pp. 404-409.

Brodt, Klaud, "Heat transfer in forced convection reflow soldering systems: lead-free solder paste, a new challenge," Dataweek, vol. xx no. xx, pp. xx-xx, July 4, 2001.

Broerman, J. G., "A Conjecture on the Anomalous Mobility of a-Sn," Journal of Physics and Chemistry of Solids, vol. 32 no. 6, pp. 1263-1267, 1971.

Brondum, Klaus, and Larson, Gary, "Reinventing Chrome Coatings," Products Finishing, vol. 70 no. 3, pp. 48-52, Dec. 2005.

Brodusch, Ludovic, and Sanchez, Juan Carlos, "Continuous hydrogen measurement in liquid copper - what can we learn?," Wire Journal International, vol. 36 no. 8, pp. 75-79, Aug. 2003.

Bronsted, J. N., "Studien zur chemischen Affinitat. IX. Die allotrope Zinnumwandlung," Zeitschrift fur physikalische Chemie, vol. 88, no. 4, pp. 479-489, 1914.

Bronsted, J. N., "Untersuchungen uber die Spezifische Warme. I," Zeitschrift fur Elektrochemie, vol. 18 no. 16, pp. 714-717, Aug. 15, 1912.

Brooks, Andy, Woollard, Siobhan, Hennighan, Gareth, and von Werne, Timothy, "Inhibition of Creep Corrosion Using Plasma Deposited Fluoropolymer Coating," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 987-992.

Brooks, B. T., "Tin Disease and Polar Exploration," Science, New Series, vol. 40 no. 1022, pp. 166-167, July 31, 1914.

Brooks, Richard, Day, David, and Goudarzi, Vahid, "Changing to Pb-free Profoundly Impacts the Manufacturing Production Process."

Brooks, Richard, Day, David, and Goudarzi, Vahid, "Get the Lead out," Adhesives & Sealants Industry, vol. 12 no. 7, pp. 23-28, July 2005.

Brooks, Timothy W., "A Lead-Free Alloy for Electronics Soldering," Circuits Assembly, vol. 4 no. 10, pp. 58-60, Oct. 1993.

Brooks, William E., "Mercury," Minerals Yearbook: Volume I. -- Metals and Minerals, 2003.

Brooman, E., Kolek, J., Naguy, T., Klingenberg, M., Pavlik, M., and Schario, D., "Air Force Hard Chromium Coatings Replacement Efforts," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 688-696.

Brooman, Eric W., "Alternatives to Cadmium Coatings for Electrical/Electronic Applications," Plating & Surface Finishing, vol. 80 no. 2, pp. 29-35, Feb. 1993.

Brooman, Eric W., "Compliant Electrodeposited and Electroless Nano-Structured and Nano-Composite Coatings to Replace Chromium Coatings, Part 1" Galvanotechnik , vol. xx no. xx, pp. 2843-2853, Dec. 2005.

Brooman, Eric W., Adams, John W., and Manty, Brian A., ""High-Priority Chemicals" Environmental Impact in the Aircraft and Parts Industry (I)," 30th Aerospace/Airline Plating & Metal Finishing Forum, 1994, pp. xx-xx.

Brost, Brent, and Faller, Harlan, "Understanding How Pb-Free Platings Affect Production-Test Cost, Throughput and Yield," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Nov.-Dec. 2005.

Brouillard, Michael J., and England, Raymond O., "A Metal Finisher's Evaluation of Commercially Available Lead-Free Solder Coatings," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. 406-420.

Brouillard, M. J., and England, Raymond O., "A Metal Finisher's Evaluation of Commercially Available Lead-Free Solder Coatings," Plating & Surface Finishing, vol. 88 no. 1, pp. 38-45, Jan. 2001.

Brouillard, Michael J., "Solderability Study Comparing the Effects of Barrier Layers on Thermally Aged, Tin-plated Brass," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. 255-267.

Brower, Jay, "PB-free solder evaluation: Rane Corp. lab notes case study," Global SMT & Packaging, vol. 5 no. 5, pp. 27-28, May 2005.

Brown, Bob, "Testing your mettle: Zinc whiskers in the data center," NetworkWorldFusion, Nov. 1, 2004.

Brown, Craig, "Hand soldering with lead-free alloys," EMasia, Jan. 2006.

Brown, Craig, "How To Get Lead-Free Rework Right First Time," OnBoard Technology , vol. xx no. xx, pp. 52-54, Feb. 2004.

Brown, Craig, "Reworking lead-free array packages," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Jan 7, 2007.

Brown, Craig, "Thermal Repeatability in Lead-Free Array Rework," Circuits Assembly, vol. 15 no. 4, pp. 40-43, Apr. 2004.

Brown, E. G., "Researches into the Action of Fusible Cutouts."

Brown, J. Teye, Popat, Ajay M., O'Neal, Chad B., and Xie, Yixiang, "Intermetallic Effects of Electroplated Lead-Free Solder Bumps Using a Novel Single Chamber Electroplating Process for Large Diameter Wafers," Proceedings of the ASME InterPack Conference, Volume 2, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 743-748.

Brown, Jack, "Agere Systems Advanced Lead-Free Packaging," Microwaves & RF , vol. xx no. xx, pp. xx, Sept. 29, 2004.

Brown, Jay, "High Conductivity Nickel-Fiber ACF," flipchips.com, May 2007.

Brown, Jim, "Seven best practices to achieving higher levels of compliance," Green SupplyLine, Oct. 16, 2006.

Brown, Kevin, "Chromium-free pre-treatments prior to painting," Anti-Corrosion Methods and Materials, vol. 44 no. 5, pp. 323-327, 1997.

Brown, Neil, "A Summary of Methods for Minimizing Tin Whisker Growth," Shipley Electronic & Industrial Finishing.

Brown, Neil, and Toben, Michael, "Overview of the lead-free movement in the electronics industry," TIN World, no. 4, pp. 13-14, 2004.

Brown, Neil, Imanari, Masaaki, Suda, Kazuyuki, and Shimazu, Motoya, "Pure Tin Electroplating Process for pH Sensitive Devices," Proceedings of the 25th Symposium for Passive Components, Palm Springs, CA, Mar. 21-24, 2005, pp. 108-111.

Brown, Orville, and Sridharan, Srinivasan, "Lead and Cadmium Free Low Temperature Firing Thick Print Copper Inks," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 648-654.

Brown, Steve, "Development of a Fatigue Resistant Lead-Free Alloy for High Reliability Under Hood Applications," SMTA China East 2014 Proceedings, Shanghai, China, Apr. 23-25, 2014, pp. xx-xx.

Brown, Steve, "Harsh Environment Applications for Lead-free Solder Systems," SMART Group 6th Annual Lead-Free Seminar and Table-top Exhibition, High Wycombe, United Kingdom, Feb. 3, 2004.

Brown, Steve, "Harsh life for lead-free solders," Electronics Manufacture and Test , vol. xx no. xx, pp. xx, Mar. 2004.

Brown, Steve, Holtzer, Mitch, and Renaud, Gilbert, "Process Considerations in Reducing Voiding in High Reliability Lead Free Solder Joints," SMTA China East 2015 Proceedings, Shanghai, China, Apr. 21-24, 2015, pp. xx-xx.

Brown, Steve, and Shea, Chrys, "The Lead-Free Wave Solder Process and Its Effect on Laminates," NEPCON Shanghai 2007, Shanghai, China, Apr. 24-27, 2007, pp. xx-xx.

Brown, Steve, "Wave goodbye to high material costs," Electronics Manufacture and Test , vol. xx no. xx, pp. xx, July 2004.

Browning, Myron E., and Lindsay, James H., "Important Considerations in Hard Chromium Plating," Plating & Surface Finishing, vol. 89 no. 4, pp. 10-15, Apr. 2002.

Brownlee, L. D., "Lattice Constant of Grey Tin," Nature, vol. 166 no. 4220, pp. 482, Sept. 16, 1950.

Brown-West, Boma M., Gregory, Jeremy R., and Kirchain, Randolph E., "Modeling Electronic Waste Recovery Systems Under Uncertainty," 2010 IEEE International Symposium on Sustainable Systems and Technology, Arlington, VA, May 17-19, 2010, pp. xx-xx.

Brown-West, Boma M., Gregory, Jeremy R., and Kirchain, Randolph E., "Modeling Electronic Waste Recovery Systems Under Uncertainty," 2010 IEEE International Symposium on Sustainable Systems and Technology, Arlington, VA, May 17-19, 2010, pp. xx-xx.

Brudzisz, Anna, Sulka, Grzegorz D., and Brzozka, Agnieszka, "A facile approach to silver nanowire array electrode preparation and its application for chloroform reduction," Electrochimica Acta, vol. 362, pp. 137110-1-137110-15, Dec. 1, 2020. https://doi.org/10.1016/j.electacta.2020.137110

Brumer, Herbert, "Chromating," Products Finishing, vol. xx no. xx, pp. xx-xx, June 9, 2003.

Bruneel, Patrick, "Warning not for pro RoHS people," July 26, 2006.

Bruner, Dan M., "Z-Axis Adhesive Film Interconnect Using 150 Micron and 75 Micron Pitch Flex Circuits," The International Journal of Microcircuits and Electronic Packaging, vol. 18 no. 3, pp. 311-318, Third Quarter 1995.

Brunetti, B., Gozzi, D., Iervolino, M., Piacente, V., Zanicchi, G., Parodi, N., and Borzone, G., "Bismuth activity in lead-free solder Bi-In-Sn alloys," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 30 no. 4, pp. 431-442, Dec. 2006.

Brunetti, B., Gozzi, D., Iervolino, M., Latini, A., and Piacente, V., "Thermodynamics of Bismuth in the Molten Ag-Bi-Sn System," Journal of Chemical & Engineering Data, vol. 52 no. 4, pp. 1394-1400, 2007.

Bruno, Felix, Grano, Frank, and Srihari, K., "Effect of the Reflow Profile on BGA Voiding in a Lead-Free Process," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 291-296.

Bruno, Lars, and Gustafson, Benny, "Head-on-Pillow Defect Detection: X-Ray Inspection Limitations," Journal of Microelectronics and Electronic Packaging, vol. 16 no. 2, pp. 91-102, Apr. 2019.

Brusse, Jay, "A Discussion of the Significance of Metal Whisker Formation to the High Reliability Community," Nov. 2003.

Brusse, J., "Aluminum Whiskers," Aug. 2004.

Brusse, Jay, and Panashchenko, Lyudmyla, ""Cable Tray #1" Zinc Whiskers Detected on Zinc-Coated Steel Cable Tray," Nov. 1, 2012.

Brusse, Jay, and Panashchenko, Lyudmyla, ""Cable Tray #2" Zinc Whiskers Detected on Zinc-Coated Steel Cable Tray," Nov. 1, 2012.

Brusse, Jay, and Sampson, Michael, "Could Zinc Whiskers Be Impacting Your Electronic Systems? Raise Your Awareness," NASA, Sept. 25, 2003.

Brusse, Jay, "Could Zinc Whiskers Be Impacting Your Electronics?," NASA, Apr. 2, 2003.

Brusse, Jay, "Electrical Failure of an Accelerator Pedal Position Sensor Caused by a Tin Whisker and Discussion of Investigative Techniques Used for Whisker Detection," Tin Whisker Group teleconference, Oct. 12, 2011.

Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla, "Metal Whiskers," Association for Advancement of Medical Instrumentation (AAMI) Cardiac Rhythm Management Device Committee, San Francisco, CA, May 13, 2008.

Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla, "Metal Whiskers," UNOVIS Consortium Meeting, Owego, NY, June 18, 2008.

Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla, "Metal Whiskers," Nuclear Procurement Issues Committee (NUPIC) Meeting, June 19, 2008.

Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla, "Metal Whiskers: A Discussion of Risks and Mitigation," Symposium on Part Reprocessing, Tin Whisker Mitigation and Assembly Rework, Nov. 12, 2008.

Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla, "Metal Whiskers: Failure Modes and Mitigation Strategies," Microelectronics Reliability and Qualification Workshop, Los Angeles, CA, Dec. 4-5, 2007, pp. xx-xx.

Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla, "Metal Whiskers: Failure Modes and Mitigation Strategies," 2nd International Symposium on Tin Whiskers, Tokyo, Japan, April 24, 2008.

Brusse, Jay, "Some Examples of "Whiskers" from Tin-Based Alloys," Perot Systems, July 2009.

Brusse, Jay, "Survey of MIL Ceramic Capacitor Manufacturers Regarding Termination Finishes," NEPAG, May 23, 2001.

Brusse, Jay, "Tin Whisker Observations on Pure Tin-Plated Ceramic Chip Capacitors," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-28, 2002, pp. 45-61.

Brusse, Jay, "Tin Whisker Observations on Pure Tin-Plated Ceramic Chip Capacitors (presentation)," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-28, 2002, pp. 45-61.

Brusse, Jay, "Tin Whisker Observations on Pure Tin-Plated Ceramic Chip Capacitors," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 296-312.

Brusse, Jay, "Tin Whisker Observations on Tin-Coated Copper Bus Bar Obtained from "A Large Paper Mill in Sweden"," Dec. 2009.

Brusse, Jay A., Ewell, Gary J., and Siplon, Jocelyn P. "Tin Whiskers: Attributes and Mitigation," 22nd Capacitor and Resistor Technology Symposium, New Orleans, LA, Mar. 25-29, 2002, pp. 67-80.

Brusse, Jay, Ewell, Gary, and Siplon, Jocelyn, "Tin Whiskers: Attributes and Mitigation (presentation)," 22nd Capacitor and Resistor Technology Symposium, New Orleans, LA, Mar. 25-29, 002, pp. 67-80.

Brusse, Jay, Ewell, Gary, and Siplon, Jocelyn, "Tin Whiskers: Attributes and Mitigation," CARTS Europe, Oct. 15-17, 2002, pp. 221-233.

Brusse, Jay, "Tin Whiskers Growing Inside -45 Year Old AF114 Germanium Transistors," Nov. 2005.

Brusse, Jay, "Tin Whiskers: Revisiting an Old Problem." EEE Links, vol. 4 no. 4, pp. 5-7, Dec. 1998.

Brusse, Jay, "Whisker Presentation to AAMI Cardiac Rhythm Device Management Committee," May 15, 2008.

Brusse, Jay, "Zinc Whiskers: Could Zinc Whiskers Be Impacting Your Electronics?," QSS Group, Apr. 2, 2003.

Brusse, Jay, and Sampson, Michael, "Zinc Whiskers: Hidden Cause of Equipment Failure," IT Professional , vol. 6 no. 6, pp. 43-47, Nov./Dec. 2004.

Brusse, Jay, and Purves, Austin, "Zinc Whiskers on Hot Dip Galvanized Steel & Demo of Effect of Electrostatic Attraction on Metal Whiskers (Movie)."

Brusse, Jay, and Panashchenko, Lyudmyla, "Zinc Whiskers on Hot Dip Galvanized Steel Pipe," Mar. 2009.

Bruzel, Alan, "Tin Disease," Apr. 3, 2000.

Bryant, Keith, "Does PCB pad finish affect voiding levels in lead-free assemblies," Dataweek, vol. xx no. xx, pp. xx-xx, July 26, 2006.

Bryant, Keith, "Does PCB pad finish affect voiding levels in lead-free assemblies," evertiq, Sept. 18, 2006.

Bryant, Keith, Guide to BGA Assembly & Soldering Defects. 2019.

Bryant, Keith, "Investigating Voids," Circuits Assembly, vol. 15 no. 6, pp. 18-20, June 2004.

Bryant, Keith, Hoo, Nick, and Lodge, Dominic, "Use of digital X-ray imaging as a process control tool for lead-free PWB assembly," Dataweek, vol. xx no. xx, pp. xx-xx, Oct. 4, 2006.

Bryant, Keith, "X-Ray Inspection as a Process Control Tool," LEADOUT Controlling a Lead Free Process Workshop, St Albans, United Kingdom, Sept. 7, 2006.

Bryant, Paul J., and Gutshall, Paul L., "Rotating Sample Holder for Microscopic Observation of Whiskers," Review of Scientific Instruments, vol. 30, pp. 1126-1127, 1959.

Bryce, Robert, "Computer Compost," Interactive Week, vol. 8 no. 6, pp. 46-48, Feb. 12, 2001.

Buchenauer, C. J., Cardona, M., and Pollak, F. H., "ERRATA: Raman Scattering in Gray Tin," Physical Review B, vol. 4 no. 8, pp. 2833, Oct. 15, 1971.

Buchenauer, C. J., Cardona, M., and Pollak, F. H., "Raman Scattering in Gray Tin," Physical Review B, vol. 3 no. 4, pp. 1243-1244, Feb. 15, 1971.

Bucher, Volker, "DLC-Schichten als Ersatz fur Chromschichten," Galvanotechnik , vol. 97 no. 4, pp. 814-818, Apr. 2006.

Buchheit, R. G., Drewien, C. A., and Stoner, G. E., "Chromate-Free Talc Chemical Conversion Coatings for Aluminum Alloys," Sandia Report SAND93-1648C, CONF-930571--28.

Buchheit, R. G., Drewien, C. A., Martinez, M. A., and Stoner, G. E., "Processing and Properties of Chromate-Free Conversion Coatings on Aluminum," Sandia Report SAND94-3141C, CONF-950304--8.

Buchi, Richard H., "Alternative, Non-toxic Chromates Meet Military Aircraft Specs," Metal Finishing, vol. 105 no. 4, pp. 37-40, Apr. 2007.

Buchi, Richard H., Paterson, Ken, and Gowers, Clyde J., "Elimination of Chromates in Paint Preparation," 21st AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 17-19, 2000, pp. 147-154.

Buchi, Richard H., Paterson, Ken, and Gowers, Clyde J., "Elimination of Chromates in Paint Preparation," Plating & Surface Finishing, vol. 87 no. 2, pp. 10-14, Feb. 2000.

Buchovecky, Eric J., Du, Ningning, and Bower, Allan F., "A model of Sn whisker growth by coupled plastic flow and grain boundary diffusion," Applied Physics Letters, vol. 94 no. 19, pp. 191904-1-191904-3, 2009.

Buchovecky, Eric, Jadhav, Nitin, Bower, Allan F., and Chason, Eric, "Finite element modeling of stress evolution in Sn films due to growth of Cu6Sn5 intermetallic compound," Journal of Electronic Materials, vol. 38 no. 12, pp. 2676-2684, Dec. 2009.

Buckley, Paul, "European ecodesign rules and related legislation," Electronic Products, vol. 50 no. 6, pp. 83-84, Nov. 2007.

Budman, Edward, and Stevens, David, "Tin-Zinc Plating," Transactions of the Institute of Metal Finishing , vol. 76 no. 3, pp. B34-B37, May 1998.

Budman, Edward, and Stevens, David, "Tin-zinc plating," Anti-Corrosion Methods and Materials, vol. 45 no. 5, pp. 327-332, 1998.

Buenaflor, Leah, Dal, Sheila Liza, and Estinozo, Ian, "Thermal Profiling to Overcome Flux Residue Formation in a No-clean Solder Paste for Lead-free Surface Mount Technology," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Buetow, Mike, "A Declaration of RoHS Compliance," PCB Update, June 30, 2006.

Buetow, Mike, "A Declaration of RoHS Compliance," Circuits Assembly, vol. 17 no. 8, pp. 6, Aug. 2006.

Buetow, Mike, "A Reliable Source for Interconnect Reliability," PCB Update, Sept. 16, 2005.

Buetow, Mike, "A Sober Look at J-STD-709," Circuits Assembly, vol. 20 no. 3, pp. 6, Mar. 2009.

Buetow, Mike, "All Cracked Up: MSDs Still Driving Us Nuts," Circuits Assembly, vol. 16 no. 5, pp. 6, May 2005.

Buetow, Mike, "At RadiSys, No Detail's Too Small," Circuits Assembly, vol. 18 no. 4, pp. 5, Apr. 2007.

Buetow, Mike, ""Be a Manager, Go To Jail"," Circuits Assembly, vol. 16 no. 3, pp. 5, Oct. 2005.

Buetow, Mike, "Bench Strength," Circuits Assembly, vol. 16 no. 11, pp. 18, Nov. 2005.

Buetow, Mike, "BEST Symposium Highlights Practical Rework Techniques," Circuits Assembly, vol. 19 no. 10, pp. 12, Oct. 2008.

Buetow, Mike, "Beyond the Whales, Greenpeace Looking at Lead in PC's," Circuits Assembly, vol. 17 no. 11, pp. 9, Nov. 2006.

Buetow, Mike, "C4 'Bumps' Competition Aside," PCB Update, July 15, 2005.

Buetow, Mike, "Cal Urged to Back Down on Chemicals Ban," Circuits Assembly, vol. 19. no. 6, pp. 8, June 2008.

Buetow, Mike, "Canada OK's Continued Rosin Acid Use," Printed Circuit Design and Fab/ Circuits Assembly, vol. 29 no. 8, pp. 12, Aug. 2010.

Buetow, Mike, "China RoHS: Oxymoronic - and Real," Circuits Assembly, vol. 18 no. 1, pp. 6, Jan. 2007.

Buetow, Mike, "Close Shave? NASA Dismisses Sn Whisker Worries," Circuits Assembly , vol. xx no. x, pp. xx-xx, June 9, 2006.

Buetow, Mike, "'Conflict Minerals' Bills Advance in US," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 6, pp. 10,12, June 2010.

Buetow, Mike, "Deca-BDE Status Still Pending, BSEF Asserts," Circuits Assembly, vol. 17 no. 8, pp. 10, 12, Aug. 2006.

Buetow, Mike, "DEK Pubishes Pb-Free Stencil Guidelines," Circuits Assembly, vol. 17 no. 1, pp. 10, Jan. 2006.

Buetow, Mike, "Differences Acute Between EU, China RoHS Laws,"Circuits Assembly , vol. 17 no. 12, pp. 12, 14, Dec. 2006.

Buetow, Mike, "Do OEMs Have Tin Ears?," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 3, pp. 6, Mar. 2010.

Buetow, Mike, "Dover: Buy and Fold?," Circuits Assembly, vol. 17 no. 9, pp. 6, Sept. 2006.

Buetow, Mike, "'eBook' Offers Guidance on Revised RoHS," Printed Circuit Design and Fab/ Circuits Assembly, vol 28 no. 4, pp. 10, Apr. 2011.

Buetow, Mike, "EC Adds Lead Exemptions, Seeks Others," Circuits Assembly, vol. 18 no. 1, pp. 12, Jan. 2007.

Buetow, Mike, "EC Adopts WEEE, Hazardous Substance Proposals," Circuits Assembly , vol. 11 no. 8, pp. 8, Aug. 2000.

Buetow, Mike, "EC Adopts WEEE Proposal," Printed Circuit Fabrication, vol. 23 no. 8, pp. 12,14, Aug. 2000.

Buetow, Mike, "ECHA Proposes 15 New Candidate SVHCs," Circuits Assembly, vol. 20 no. 10, pp. 8, Oct. 2009.

Buetow, Mike, "ECHA Targets 8 More Substances for Restriction," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 4, pp. 8, Apr. 2010.

Buetow, Mike, "Electronic Systems' Explains RoHS Strategy at Seminar," Circuits Assembly, vol. 17 no. 5, pp. 12, May 2006.

Buetow, Mike, "Electronics OEMS Have Greenpeace Seeing Red," Circuits Assembly, vol. 17 no. 10, pp. 9, Oct. 2006.

Buetow, Mike, "Eliminating the Lead Threat (And Other Soldering Issues)," Surface Mount Technology (SMT), vol. 7 no. 1, pp. 66-67, Jan. 1993.

Buetow, Mike, "EP Drops Demands for New RoHS Substances," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 12, pp. 8, Dec. 2010.

Buetow, Mike, "EU Chemicals Law Will Stretch Manufacturers' Resources," Circuits Assembly, vol. 17 no. 12, pp. 8, 10, Dec. 2006.

Buetow, Mike, "EU Committee Votes to Further Assess Substances in RoHS Directive," Printed Circuit Design and Fab/Circuits Assembly, vol. 27 no. 7, pp. 10, July 2010.

Buetow, Mike, "EU Extends RoHS Coverage," Printed Circuit Design and Fab/ Circuits Assembly, vol 28 no. 7, pp. 10, July 2011.

Buetow, Mike, "EU Sets RoHS Max. Concentration Levels," Circuits Assembly, vol. 16 no. 11, pp. 13, Nov. 2005.

Buetow, Mike, "Feeling Rosin's Burn," Circuits Assembly, vol. 20 no. 11, pp. 6, Nov. 2009.

Buetow, Mike, "Finality over Finishes?," PCB Update, May 6, 2005.

Buetow, Mike, "Fired Up Over Nepcon China Venue," Circuits Assembly, vol. 17 no. 6, pp. 4, June 2006.

Buetow, Mike, "For Lead, No Blue Sky," Printed Circuit Design and Manufacture , vol. 21 no. 4, pp. 48, Apr. 2004.

Buetow, Mike, "For PCBs, the Finish is in Sight," Printed Circuit Fabrication, vol. 23 no. 1, pp. 60-61, Jan. 2000.

Buetow, Mike, "France to Enact Stiff REACH Penalties," Circuits Assembly, vol. 20 no. 4, pp. 10, Apr. 2009.

Buetow, Mike, "Free Calculator Eases Surface Finish Dilemma," Circuits Assembly , vol. 18 no. 8, pp. 8, Aug. 2007.

Buetow, Mike, "Frost: Aerospace, Defense Face Pb-Free Challenges," Circuits Assembly , vol. 18 no. 10, pp. 12, Oct. 2007.

"GEIA Publishes Tin Whiskers Spec, 2 Others," Circuits Assembly , vol. 17 no. 10, pp. 6, Oct. 2006.

Buetow, Mike, "Henkel: No Limits in Sight," Circuits Assembly, vol. 16 no. 2, pp. 22, Feb. 2005.

Buetow, Mike, "'Homogenous': Definition Under Fire," Printed Circuit Design and Manufacture, vol. 21 no. 7, pp. 48, July 2004.

Buetow, Mike, "House Wants Deca BFR Out Too," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 2, pp. 10, Feb. 2010.

Buetow, Mike, "`How Flexible Can You Be?'," Circuits Assembly, vol. 16 no. 5, pp. 12, May 2005.

Buetow, Mike, "HP, Sony Seek RoHS Exemptions," Feb. 28, 2005.

Buetow, Mike, "IEC Bails on RoHS Marking Specs," Circuits Assembly, vol. 17 no. 2, pp. 16, Feb. 2006.

Buetow, Mike, "Industry News," Circuits Assembly, vol. 16 no. 2, pp. 8-16, Feb. 2005.

Buetow, Mike, "iNEMI Publishes Pb-Free Tome," Circuits Assembly, vol. 18 no. 12, pp. 10, Dec. 2007.

Buetow, Mike, "iNEMI Releases Creep Corrosion Risk Guidelines," Printed Circuit Design and Fab/ Circuits Assembly, vol 29 no. 7, pp. 12,14, July 2012.

Buetow, Mike, "iNEMI Seeks to Resolve Pb-Free Alloy, Failure Issues," Circuits Assembly, vol. 19. no. 6, pp. 12, June 2008.

Buetow, Mike, "Input Sought on RoHS 2 FAQ," Printed Circuit Design and Fab/ Circuits Assembly, vol 29 no. 8, pp. 8, Aug. 2012.

Buetow, Mike, "IPC 'Concerned' Over Proposed IEEE Environmental Standards," Printed Circuit Design and Fab/Circuits Assembly, vol. 29 no. 8, pp. 10, Aug. 2010.

Buetow, Mike, "IPC Gets in on Pb-Free Certification Act," Circuits Assembly, vol. 17 no. 3, pp. 10, Mar. 2006.

Buetow, Mike, "IPC Opposes EPA's Proposed Toxic Substances Rule," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 10, pp. 9, Oct. 2010.

Buetow, Mike, "IPC rebuts Proposed RoHS Revisions," Circuits Assembly, vol. 19 no. 11, pp. 8, Nov. 2008.

Buetow, Mike, "IPC Releases Pad Cratering Spec," Printed Circuit Design and Fab/ Circuits Assembly, vol. 28 no. 5, pp. 12, May 2011.

Buetow, Mike, "IPC Releases TAL White Paper," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 2, pp. 10, Feb. 2010.

Buetow, Mike, "IPC Standard Updated for Pb-, Halogen-Free Base Materials," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 2, pp. 10, Feb. 2010.

Buetow, Mike, "IPC to Develop Data Exchange Standard for Conflict Minerals Regulation," Printed Circuit Design and Fab/ Circuits Assembly, vol. 28 no. 9, pp. 12,15, Sept. 2011.

Buetow, Mike, "ISO for Pb-Free?," PCB Update, Aug. 19, 2005.

Buetow, Mike, "Korea Drafts RoHS Rules," Circuits Assembly, vol. 17 no. 6, pp. 6, June 2006.

Buetow, Mike, "Korea Passes RoHS Law," Circuits Assembly, vol. 18 no. 6, pp. 12-14, June 2007.

Buetow, Mike, "'Lack of Martha Stewarts' Slowing XRF Acceptance," Circuits Assembly , vol. 19. no. 6, pp. 10, June 2008.

Buetow, Mike, "Latest Solder Mask Spec Addresses Pb-Free," Circuits Assembly, vol. 18 no. 3, pp. 6, 8, Mar. 2007.

Buetow, Mike, "Low-Silver Solders Sparkle," Circuits Assembly, vol. 16 no. 8, pp. 5, Aug. 2005.

Buetow, Mike, "MassTech EMS Offers Pb-Free Conversion Program," Circuits Assembly , vol. 16 no. 12, pp. 8, Dec. 2005.

Buetow, Mike, "Mother's Milk," Printed Circuit Design and Manufacture, vol. 21 no. 3, pp. 51, Mar. 2004.

Buetow, Mike, "Moving Targets," Circuits Assembly, vol. 20 no. 5, pp. 6, May 2009.

Buetow, Mike, "'Nay' Voters Fired Up Against Low Bromine Spec," Circuits Assembly , vol. 20 no. 9, pp. 8, Sept. 2009.

Buetow, Mike, "NEMI Revises Tin Whisker Guidance," Circuits Assembly, vol. 15 no. 9, pp. xx-xx, Aug. 31, 2004.

Buetow, Mike, "No Fly Zone," Circuits Assembly, vol. 16 no. 7, pp. 6, July 2005.

Buetow, Mike, "'No' Votes Force Changes to J-STD-709," Circuits Assembly, vol. 20 no. 6, pp. 6, June 2009.

Buetow, Mike, "NPL Devises Pb-free Alloy Tester," Circuits Assembly, vol. 19. no. 6, pp. 10, June 2008.

Buetow, Mike, "OEM Group Calls for Steady Supply of SnPb Parts," Circuits Assembly, Aug. 26, 2005.

Buetow, Mike, "Oko, Fraunhofer Recommand Discontinuation of 7 RoHS Exemptions," Circuits Assembly, vol. 20 no. 5, pp. 12, May 2009.

Buetow, Mike, "On Silver, Gold and Holidays," Printed Circuit Design and Fab/ Circuits Assembly, vol. 28 no. 12, pp. 6, Dec. 2011.

Buetow, Mike, "Paper: Halogen-Free Packages Reveal New Failure Modes," Printed Circuit Design and Fab/ Circuits Assembly, vol. 29 no. 2, pp. 8,10, Feb. 2012.

Buetow, Mike, "Possible RoHS Followup 'Arbitrary and Capricious,' IPC Claims," Circuits Assembly, vol. 19. no. 5, pp. 8, May 2008.

Buetow, Mike, "Profiles in Standards," Circuits Assembly, vol. 19 no. 10, pp. 6, Oct. 2008.

Buetow, Mike, "Proposed RoHS Revisions to Include Medical Devices," Circuits Assembly , vol. 20 no. 2, pp. 8,10, Feb. 2009.

Buetow, Mike, "Proposed Spec Sets the Pb-Free Mark," Circuits Assembly, vol. 17 no. 8, pp. 10, Aug. 2006.

Buetow, Mike, "REACH Now a Reality," Circuits Assembly, vol. 20 no. 7, pp. 8, July 2009.

Buetow, Mike, "REACH Update: 300 Chemicals on SIN List," Circuits Assembly, vol. 19 no. 11, pp. 8, Nov. 2008.

Buetow, Mike, "Recycling by Legislation," Printed Circuit Fabrication, vol. 25 no. 2, pp. 42,48, Feb. 2002.

Buetow, Mike, "Report: Pb-Free Still a Fraction of Production," Circuits Assembly , vol. 17 no. 12, pp. 12, Dec. 2006.

Buetow, Mike, "Report: There's No 'We' in 'WEEE'," Circuits Assembly, vol. 17 no. 6, pp. 6, June 2006.

"Report: XRF a Viable RoHS, Tin Whisker Screener," Circuits Assembly , vol. 19 no. 1, pp. 8, Jan. 2008.

Buetow, Mike, "Revised EU RoHS Directive Published," Printed Circuit Design and Fab/ Circuits Assembly, vol. 28 no. 8, pp. 14, Aug. 2011.

Buetow, Mike, "Rising Silver Costs Up Solder Costs at Henkel," Circuits Assembly , vol. 17 no. 7, pp. 14, July 2006.

Buetow, Mike, "RoHS Exemption Sought for Semi Gear," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 3, pp. 12, Mar. 2010.

Buetow, Mike, "RoHS Exemptions Input Released," Circuits Assembly, vol. 19. no. 6, pp. 8, June 2008.

Buetow, Mike, "RoHS Testing, Reporting Standards Progressing," Circuits Assembly , vol. 16 no. 12, pp. 10, Dec. 2005.

Buetow, Mike, "Shot Down?," Circuits Assembly, vol. 18 no. 5, pp. 5, May 2007.

Buetow, Mike, "Smart Group to Release Updated Pb-Free Defect Guide," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 9, pp. 10, Sept. 2010.

Buetow, Mike, "SMTA Panel Talks Lean, Pb-Free and the Economy," Circuits Assembly , vol. 19 no. 7, pp. 8,10,12,14, July 2008.

Buetow, Mike, "Solder Vendors Find 'No Difference' in Tested SAC Alloys," Circuits Assembly, vol. 15 no. 11, pp. xx-xx, Nov. 2004.

Buetow, Mike, "Solder Vendors: 'No Difference' in Tested SAC Alloys," Circuits Assembly, vol. 16 no. 1, pp. 8, Jan. 2005.

Buetow, Mike, "Solder Vendors: Voiding Doesn't Affect Joint Reliability," Circuits Assembly, vol. 17 no. 2, pp. 12, Feb. 2006.

Buetow, Mike, "Solder Verdict In: SAC 305 the Favorite," Circuits Assembly, July 1, 2005.

Buetow, Mike, "Starting a Fire," Circuits Assembly, vol. 20 no. 2, pp. 6, Feb. 2009.

Buetow, Mike, "Study: Look for the Lead-free Label?," Printed Circuit Fabrication , vol. 23 no. 4, pp. 24,26, Apr. 2000.

Buetow, Mike, "Survey: Pb-Free Soldering Now Dominates Europe," Circuits Assembly , vol. 18 no. 6, pp. 12, June 2007.

Buetow, Mike, "The Conflict Over `Conflict Metals' Audits," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 1, pp. 4, Jan. 2010.

Buetow, Mike, "The End of Pb-Free Wave Soldering?," Circuits Assembly, vol. 18 no. 7, pp. 14, July 2007.

Buetow, Mike, "The No-Lead Tide," Printed Circuit Fabrication, vol. 21 no. 11, pp. 62-63, Nov. 1998.

Buetow, Mike, "The Pb-Free Matrix," PCB Update, Oct. 14, 2005.

Buetow, Mike, "The REACH Pandemic," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 9, pp. 6, Sept. 2010.

Buetow, Mike, "Tin Drum Still Beating," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 2, pp. 6, Feb. 2010.

Buetow, Mike, "Tin Ears," Printed Circuit Design and Fab/ Circuits Assembly , vol 28 no. 3, pp. 6, Mar. 2011.

Buetow, Mike, "Tin Men," Circuits Assembly, vol. 19. no. 3, pp. 18, Mar. 2008.

Buetow, Mike, "Tin Men, Or Why 'Pb-Free Isn't Free'," Circuits Assembly, vol. 15 no. 11, pp. xx-xx, Oct. 27, 2004.

Buetow, Mike, "Tin Whiskers Email Forum Open," Circuits Assembly, vol. 19. no. 4, pp. 14, Apr. 2008.

Buetow, Mike, "Tin Whiskers Found in Toyota ETC," Printed Circuit Design and Fab/ Circuits Assembly, vol 28 no. 3, pp. 10,12, Mar. 2011.

Buetow, Mike, "Trade Bodies Meet in Lead-Free Quest," Printed Circuit Fabrication , vol. 25 no. 4, pp. 7, Apr. 2002.

Buetow, Mike, "UK DTI Issues WEEE Consultation Document," Circuits Assembly, vol. 17 no. 9, pp. 14, Sept. 2006.

Buetow, Mike, "UK DTI Puts WEEE under Review" Circuits Assembly, vol. 17 no. 2, pp. 12, Feb. 2006.

Buetow, Mike, "Unleaded: EU Directive Pushed Back," Printed Circuit Fabrication , vol. 23 no. 7, pp. 10, July 2000.

Buetow, Mike, "Urgency Lacking on Pb-Free," Lead-Free Magazine, vol. 3, Feb. 2005.

Buetow, Mike, "US Enacts 'Conflict Metal' Law," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 9, pp. 10, Sept. 2010.

Buetow, Mike, "US EPA to Propose DecaBDE Phaseout," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 2, pp. 8, Feb. 2010.

Buetow, Mike, "US GAO Report Spurs EPA Action on Electronics Recycling," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 10, pp. 9-10, Oct. 2010.

Buetow, Mike, "US House Bill Proposes to Ban Common Elements," Circuits Assembly , vol. 20 no. 7, pp. 6, July 2009.

Buetow, Mike, "USAF Seeks Sn Whisker Mitigation Proposals," Printed Circuit Design and Fab/ Circuits Assembly, vol. 28 no. 5, pp. 10, May 2011.

Buetow, Mike, "Web Sites Aid Pb-Free Transition," Circuits Assembly, vol. 16 no. 6, pp. 10, June 2005.

Buetow, Mike, "White Paper Outlines Tests for Pb-Free Alloy Evaluation," Printed Circuit Design and Fab/Circuits Assembly, vol. 27 no. 7, pp. 12, July 2010.

Buetow, Mike, "Wisconsin, NYC Pushing Electronics Recycling Bills," Circuits Assembly , vol. 19 no. 1, pp. 10, Jan. 2008.

Buetow, Mike, "'You Have to Be Prepared to Change'," Circuits Assembly, vol. 17 no. 5, pp. 18, 20, May 2006.

Buguski, Robert, "When Failure Analysis is a Matter of Interpretation," Printed Circuit Design and Fab/ Circuits Assembly, vol. 31 no. 3, pp. 72-74, Mar. 2014.

Bui, Q. V., and Jung, S. B., "Characterization of low speed shear test reliability of Sn-1.0Ag-XCe/ENEPIG solder joint," Journal of Alloys and Compounds, vol. 560, pp. 54-61, May 25, 2013.

Bui, Q. V., Nam, N. D., Noh, B.-I., Kar, A., Kim, J.-G., and Jung, S.-B., "Effect of Ag addition on the corrosion properties of Sn-based solder alloys," Materials and Corrosion, vol. 61 no. 1, pp. 30-33, Jan. 2010.

Bui, Q. V., Nam, N. D., Yoon, J. W., Choi, D. H., Kar, A., Kim, J. G., and Jung, S. B., "Effect of Gold on the Corrosion Behavior of an Electroless Nickel/Immersion Gold Surface Finish," Journal of Electronic Materials, vol. 40 no. 9, pp. 1937-1942, Sept. 2011.

Bui, Q. V., and Jung, S. B., "Effect of Pd thickness on wettability and interfacial reaction of Sn-1.0Ag-Ce solders on ENEPIG surface finish," Journal of Materials Science: Materials in Electronics, vol. 25 no. 1, pp. 423-430, Jan. 2014.

Bui, Q. V., and Jung, S. B., "Evaluation of mechanical properties of low-Ag ball grid array solder joints using a high-speed ball shear test," Journal of Alloys and Compounds , vol. 589, pp. 590-595, Mar. 15, 2014.

Bukat, K., Sitek, J., Kisiel, R., Moser, Z., Gasior, W., Koscielski, M., and Pstrus, J., "Evaluation of the influence of Bi and Sb additions to Sn-Ag-Cu and Sn-Zn alloys on their surface tension and wetting properties using analysis of variance - ANOVA," Soldering & Surface Mount Technology, vol. 20 no. 4, pp. 9-19, 2008.

Bukat, K., Moser, Z., Sitek, J., Gasior, W., Koscielski, M., and Pstrus, J., "Investigation of Sn-Zn-Bi solders - Part I: Surface tension, interfacial tension and density measurements of SnZn7Bi solders," Soldering &, Surface Mount Technology, vol. 22 no. 3, pp. 10-16, 2010.

Bukat, K., Sitek, J., Koscielski, M., Moser, Z., Gasior, W., and Pstrus, J., "Investigation of Sn-Zn-Bi solders - Part II: wetting measurements on Sn-Zn7Bi solders on copper and on PCBs with lead-free finishes by means of the wetting balance method," Soldering & Surface Mount Technology, vol. 22 no. 4, pp. 13-19, 2010.

Bukat, K., Sitek, J., Koscielski, M., Jakubowska, M., Sloma, M., Mlozniak, A., and Niedzwiedz, W., "SAC 305 solder paste with carbon nanotubes - part I: investigation of the influence of the carbon nanotubes on the SAC solder paste properties," Soldering & Surface Mount Technology, vol. 24 no. 4, pp. 267-279, 2012.

Bukat, K., Koscielski, M., Sitek, J., Jakubowska, M., and Mlozniak, A., "Silver nanoparticles effect on the wettability of Sn-Ag-Cu solder pastes and solder joints microstructure on copper," Soldering & Surface Mount Technology, vol. 23 no. 3, pp. 150-160, 2011.

Bukat, Krystyna, Sitek, Janusz, Koscielski, Marek, Moser, Zbigniew, Gasior, Wladyslaw, and Pstrus, Janusz, "Investigation of the wetting of PCBs with SnCu (HASL) and Snimm finishes by SnZnBiIn solders," Soldering & Surface Mount Technology, vol. 24 no. 1, pp. 4-11, 2012.

Bukat, Krystyna, Koscielski, Marek, Sitek, Janusz, Jakubowska, Malgorzata, and Mlozniak, Anna, "Properties of the SAC Solder Paste with Different Nanoparticles," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 537-541.

Bukat, Krystyna, Sitek, Janusz, Koscielski, Marek, Niedzwiedz, Wojciech, Mlozniak, Anna, and Jakubowska, Malgorzata, "SAC solder paste with carbon nanotubes. Part II. Carbon nanotubes' effect on solder joints' mechanical properties and microstructure," Soldering & Surface Mount Technology, vol. 25 no. 4, pp. xx-xx, 2013.

Bukhari, S., Santos, D., Lehman, L., and Cotts, E., "Continued Evaluation of the Effects of Processing Conditions and Aging Treatments on Pb-Free Shear Strength and Microstructure," 2005 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Bukhari, S., Santos, D. L., Lehman, L. P., and Cotts, E., "Evaluation of the Effects of Processing Conditions on Shear Strength and Microstructure in Pb-Free Surface Mount Assembly," 2004 Pan Pacific Symposium Conference Proceedings, Kahuku, Oahu, Hawaii, Feb. 10-12, 2004, pp. xx-xx.

Bukhari, S., Santos, D. L., Lehman, L. P., and Cotts, E., "Evaluation of the Effects of Processing Conditions on Shear Strength and Microstructure in Pb-Free Surface Mount Assembly," Journal of SMT, vol. 17 no. 2, pp. 42-47, Apr. 2004.

Bulkeley, Debra, "Companies still ill-prepared for compliance, especially with RoHS," Electronic Business, Aug. 8, 2006.

Bulkeley, Debra, "Software to the rescue," Electronic Business, Apr. 1, 2006.

Bullmer, Russ, "Electronics Industry Races to Go Green," ECN Supplement, pp. 13-14, Nov. 2005.

Bultitude, John, McConnell, John, Jones, Lonnie, Miller, Galen, Magee, Jim, Templeton, Allen, Gurav, Abhijit, and Phillips, Reggie, "A Comparison Between Solders & Transient Liquid Phase Sintered Interconnects in High Temperature Multilayer Ceramic Capacitors," Journal of Microelectronics and Electronic Packaging, vol. 14 no. 4, pp. 150-157, Oct. 2017.

Bultitude, John, McConnell, John, and Shearer, Catherine, "High temperature capacitors and transient liquid phase interconnects for Pb-solder replacement," Journal of Materials Science: Materials in Electronics, vol. 26 no. 12, pp. 9236-9242, Dec. 2015.

Bulwith, Ronald A., "Impurities in Tin/Lead Fluoborate Plating," Printed Circuit Fabrication , vol. 11 no. 8, pp. 46,48-56,58-59, Aug. 1988.

Bulwith, Ronald A., Trosky, Michael, Picchione, Louis M., and Hug, Darlene, "The 'Black Pad' failure mechanism - from beginning to end," Global SMT & Packaging, vol. 2 no. 6, pp. 9-13, Sept. 2002.

Bum, Lee Jong, Yuan, Hwang How, Chih, Pan Wei, and Daniel, Rhee Min Woo, "Interfacial Reaction and Reliability of High Temperature Die Attach Solders for Power Electronics," 2015 IEEE 17th Electronics Packaging and Technology Conference, Singapore, Dec. 2-4, 2015, pp. xx-xx.

Bundy, F. P., "Behavior of Carbon at Very High Pressures and Temperatures," Proceedings of the Koninklijke Nederlandse Akademie van Wetenschappen, Series B, vol. 72 no. 5, pp. 302-316, 1969.

Bunea, R., Plotog, I., Svasta, P., Pietrikova, A., and Durisin, J., "Infrared Analysis of Temperature Distribution on the Surface of a Populated PCB," 2010 33rd International Spring Seminar on Electronics Technology , Warsaw, Poland, May 12-16, 2010, pp. 174-178.

Bunea, R., Svasta, P., and Marghescu, C., "Modeling and Simulation of Pb-free Solder Joints Behavior During Laser Soldering Correlated to the 4P Model," 2009 15th International Symposium for Design and Technology of Electronics Packages, Gyula, Hungary, Sept. 17-20, 2009, pp. 379-382.

Bunea, Radu, Svasta, Paul, Illyefalvi-Vitez, Zsolt, Batorfi, Reka, and Geczy, Attila, "Optimizing Laser Soldering of SMD Components: From Theory to Practice," 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging, Timisoara, Romania, Oct. 20-23, 2011, pp. 55-58.

Bunyan, D., Ashworth, M. A., Wilcox, G. D., Higginson, R. L., Heath, R. J., and Liu, C., "Tin whisker growth from electroplated finishes - a review," Transactions of the IMF, vol. 91 no. 5, pp. 249-259, 2013. https://doi.org/10.1179/0020296713Z.000000000119

Buonomo, Antonio, Schiavo, Alessandro Lo, and Rotulo, Fabrizio, "Optimizing Pb-Free SMT Process Parameters," Circuits Assembly , vol. 16 no. 1, pp. 22-25, Jan. 2005.

Buratynski, E. K., "Thermomechanical Modeling of Direct Chip Interconnection Assembly," Journal of Electronic Packaging, Transactions of the ASME, vol. 115 no. 4, pp. 382-391, Dec. 1993.

Burgers, J. M., "Geometrical Considerations Concerning the Structural Irregularities to be Assumed in a Crystal," Proceedings of the Physical Society, vol. 51 part 1 no. 289, pp. 23-33, Jan. 1940.

Burgers, W. G., and Groen, L. J., "Mechanism and Kinetics of the Allotropic Transformation of Tin," Discussions of the Faraday Society, vol. 23, pp. 183-195, 1957.

Burgess, David, "Electromigration History and Failure Analysis," Electronic Device Failure Analysis, vol. 16 no. 3, pp. 14-16,18-19, Aug. 2014.

Burgess, Michael R., "How to optimize stencil and squeegee blades for lead-free printing," Green SupplyLine, Mar. 27, 2006.

Burgess, Michael R., and Coleman, William E., "Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S06-02-1-S06-02-12.

Burgess, Michael R., and Coleman, William E., "Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S23-01-1-S23-01-11.

Burgess, Michael R., "Precision placement of the solder brick is critical for defect-free lead-free printing," Green SupplyLine, May 25, 2006.

Burgess, Michael R., "Stencil and squeegee blade choices impact lead-free solder paste printing," Green SupplyLine, Feb. 21, 2006.

Burke, Cillian, and Punch, Jeff, "A Comparison of the Creep Behavior of Joint-Scale SAC105 and SAC305 Solder Alloys," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 4 no. 3, pp. 516-527, Mar. 2014.

Burke, Cillian, and Punch, Jeff, "A Comparison of the Creep Behaviour of Joint-Scale SAC105 and SAC305 Solder Samples under Shear Conditions," 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Lisbon, Portugal, Apr. 16-18, 2012, pp. xx-xx.

Burke, Cillian, Punch, Jeff, and Collins, Maurice, "Creep Behavior of Joint-Scale Sn1.0Ag0.5Cu Solder Shear Samples," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 505-512.

Burke, John, "A Catalytic Convertor," Circuits Assembly, vol. 18 no. 4, pp. 54, Apr. 2007.

Burke, John, "A Chance for Sanity," Circuits Assembly, vol. 18 no. 6, pp. 56, June 2007.

Burke, John, "A guide to collecting hazardous materials data," Green SupplyLine , Jan. 31, 2006.

Burke, John, "Get SMART: Tin Whiskers Eliminated!," Sept. 9, 2010.

Burke, John, "Hard Lessons of RoHS," Circuits Assembly, vol. 18 no. 2, pp. 94-95, Feb. 2007.

Burke, John, "It might be lead free, but it's definitely not green," Green SupplyLine, May 1, 2006.

Burke, John, "Letter to the Editor: Dr Ron - Dust Off Your Driver! Re: "Repeal RoHS" Movement Emerges," PCB007, Oct. 5, 2006.

Burke, John, "RoHS: Long-Term Perspective and Legal and Trade Challenges," Mar. 8, 2006.

Burke, John, "The EU RoHS Consultants - Who ARE these Guys?," PCB007, Sept. 18, 2006.

Burke, John, "Whither Due Diligence?," Circuits Assembly, vol. 18 no. 1, pp. 56, 62, Jan. 2007.

Burke, John, "Whose Conscience?," Circuits Assembly, vol. 18 no. 3, pp. 56, Mar. 2007.

Burke, Richard, "Control and Stability in Lead-free Reflow," Surface Mount Technology (SMT), vol. 20 no. 9, pp. 24-26, 28, Sept. 2006.

Burlacu, Dragos, Nguyen, Luu, and Kivilahti, Jorma, "Effects of the Solder Oxide Layer on High Frequency Signal Propagation in Pb-Free Interconnections," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 2, Orlando, FL, May 31-June 3, 2005, pp. 1874-1879.

Burlacu, Dragos, Nguyen, Luu, and Kivilahti, Jorma, "Influence of Solder Microstructure and Oxide Layers on High Frequency Electrical Losses of WL-CSP Pb-Free Interconnections," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 577-583.

Burling, S., and Shiokawa, K., "Electroless Gold for Micro and Macro Electronic Applications," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Burling, Steven, Hemsley, Stewart, and Hu, Jianqiao, "Silver Keeps Pace," Products Finishing, vol. 72 no. 2, pp. xx-xx, Nov. 2007.

Burnette, Terry, Koschmieder, Thomas, and Shumway, Russell, "Solder-Joint Reliability and Board Assembly of PQFN Packages," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 425-430.

Burns, Neil Douglas, "A Tin Pest Failure," Journal of Failure Analysis and Prevention, vol. 9 no. 5, pp. 461-465, Oct. 2009.

Burns, Phil, and Fitzgerald, Mike, "CEMs help to manage product lifecycle," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Mar. 26, 2008.

Burns, Tim, "The Medical Relevance of PVC," Medical Device & Diagnostic Industry, vol. 29 no. 11, pp. 19, Nov. 2007.

Burr, Donald, "Lead Free Manufacturing, Is It Really New?," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 861-868.

Burstein, E., Mills, D. L., and Wallis, R. F., "Interband Electronic Raman Scattering in Semimetals and Semiconductors," Physical Review B, vol. 4 no. 8, pp. 2429-2436, Oct. 15, 1971.

Burstner, Gerhard, and Frohlich, Eckhard, "Electroplating versus Hot- Dipped Tinning a Comparison of Application - Experiences," CARTS-Europe '97 Symposium, Prague, 1997, pp. xx-xx.

Burstner, Gerhard, and Frohlich, Eckhard, "The Hot-dip Tinning Process for Lead-free Electrical Connections," 17th Capacitor and Resistor Technology Symposium, Jupiter, FL, Mar. 24-27, 1997, pp. 174-180.

Burtt, Nigel, "Component Obsolescence," IEE Review, vol. 51 no. 2, pp. 6, Feb. 2005.

Burtt, Nigel, "New Environmental Regulations - Beyond REACH?," SMARTer, Dec. 2008.

Burtt, Nigel, "SMART Group 8th Annual Lead-Free Seminar: Lead-Free User Experience," SMART Group 8th Annual Lead-Free Seminar + 'Question Time' & Table-Top Exhibition, High Wycombe, United Kingdom, Feb. 16, 2006.

Busby, James, Dang, Bing, Gruber, Peter, Hawken, David, Shah, Jayshree, Weisman, Renee, Perfecto, Eric, Ruhmer, Klaus, and Buchwalter, Stephen, "C4NP Lead Free Solder Bumping and 3D Micro Bumping," 2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, Cambridge, MA, May 5-7, 2008, pp. 333-339.

Busch, G., and Mooser, E., "Die magnetischen Eigenschaften der Halbleiter mit besonderer Berucksichtigung des grauen Zinns," Helvetica Physica Acta, vol. 26 no. 6, pp. 611-656, Nov. 1953.

Busch, G., Wieland, J., and Zoller, H., "Elektrische Eigenschaften des grauen Zinns," Helvetica Physica Acta , vol. 24 no. 1, pp. 48-62, 1951.

Busch, G., and Mooser, E., "Magnetische Suszeptibilitat des grauen Zinns," Zeitschrift fur physikalische Chemie, vol. 198 no. 1-4, pp. 23-29, Oct. 1951.

Busch, G. A., and Kern, R., "Semiconducting Properties of Gray Tin," Solid State Physics, vol. 11, pp. 1-40, 1960. https://doi.org/10.1016/S0081-1947(08)60166-6

Busch, G., and Wieland, J., "Untersuchungen uber den Mechanismus der elektrischen Leitfahigkeit des grauen Zinns," Helvetica Physica Acta, vol. 26 no. 7-7, pp. 697-730, Dec. 1953.

Busch, G., Wieland, J., and Zoller, H., "Versuche zur Messung der elektrischen Leitfahlgkeit des grauen Zinns," Helvetica Physica Acta, vol. 23, pp. 528-529, 1950.

Busek, D., and Mach, P., "Electrical connection network within an electrically conductive adhesive," 31st International Spring Seminar on Electronics Technology, Budapest, Hungary, May 7-11, 2008, pp. 184-188.

Busek, D., Dusek, K., Ruzicka, D., Placek, M., Mach, P., Urbanek, J., and Stary, J., "Flux effect on void quantity and size in soldered joints," Microelectronics Reliability, vol. 60, pp. 135-140, May 2016.

Busek, D., Dusek, K., and Renza, O., "Study of temperature profile influence on intermetallic growth," 2017 40th International Spring Seminar on Electronics Technology, Sofia, Bulgaria, May 10-14, 2017, pp. xx-xx.

Busek, David, Beshajova, Ivana, and Kodad, Tomas, "Assembly Method and Its Influence on Electrically Conductive Adhesives and Solder Pastes Joints Durability," 2015 38th International Spring Seminar on Electronics Technology, Eger, Hungary, May 6-10, 2015, pp. 310-314.

Busek, David, Radev, Radoslav, and Mach, Pavel, "Can conductive adhesives with nanoparticles beat commonly used electrically conductive adhesives without nanoparticles?," 30th International Spring Seminar on Electronics Technology, Cluj-Napoca, Romania, May 9-13, 2007, pp. 7-11.

Busek, David, Selepova, Jirina, and Mach, Pavel, "Correlations Between Mechanical and Electrical Parameters of Modified Electrically Conductive Adhesives," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 118-121.

Busek, David, "Dendritic Growth at Constant Voltage Between Electrodes Coated by SnBiAg, SAC, SnCu and SnPb Solder," 2020 43rd International Spring Seminar on Electronics Technology, Liptovsky Mikulas, Slovakia, May 14-15, 2020, pp. xx-xx.

Busek, David, and Mach, Pavel, "Study of Glass Transition Temperature of Electrically Conductive Adhesives," 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging, Alba Iulia, Romania, Oct. 25-28, 2012, pp. 143-146.

Busek, David, Dusek, Karel, Beran, Tomas, and Vesely, Petr, "Thermo-Mechanical Test of SnBi and SnCu Solder Joints on Different Surface Finishes," 2019 42nd International Spring Seminar on Electronics Technology, Wroclaw, Poland, May 15-19, 2019, pp. xx-xx.

Busek, David, Pilarcikova, Ivana, and Mach, Pavel, "Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 10-13.

Busek, David, Vavra, Jan, and Dusek, Karel, "Whisker growth and its dependence on substrate type and applied stress," 2016 39th International Spring Seminar on Electronics Technology, Pilsen, Czech Republic, May 18-22, 2016, pp. 263-266.

Bush, Geraldine T., and Stebel, Michael D., "Measuring Plating Thickness with X-ray Fluorescence," Plating and Surface Finishing, vol. 70 no. 9, pp. 80-84, Sept. 1983.

Bush, P., Jones, G. L., and Boguslavsky, I., "Relationships of Copper Diffusion and Surface Oxide Formation to Tin Whisker Growth," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. PS-07-1-PS-07-05.

Bush, Peter, Galyon, George, Handwerker, Carol, Osenbach, John, Parker, Richard, Reynolds, Heidi, Schroeder, Valeska, Smetana, Joseph, Su, Peng, Williams, Maureen, and Woodrow, Tom, "iNEMI Tin Whisker Projects: Test Development, Risk Mitigation, and Fundamental Theory Development," Tin Whisker Group teleconference, October 22, 2014.

Bush, Steve, "A lead-free timebomb," Electronics Weekly, July 28, 2004.

Bush, Steve, "Adhesives could replace solder," Electronics Weekly, June 16, 2005.

Bush, Steve, "B2B firms must comply with WEEE rules three months early," Electronics Weekly, Nov. 7, 2006.

Bush, Steve, "Batteries charged for disposal," Electronics Weekly, Sept. 9, 2005.

Bush, Steve, "China gets act together on RoHS compliance," Electronics Weekly , Nov. 13, 2006.

Bush, Steve, "Competition in Europe pulls down recycling costs," Electronics Weekly, June 22, 2006.

Bush, Steve, "Concern at small battery 'free riders'," Electronics Weekly, Feb. 8, 2006.

Bush, Steve, "Conformity Certificates Will Not Satisfy RoHS," Electronic News , Nov. 9, 2005.

Bush, Steve, "Conformity certificates will not satisfy RoHS legislation," Electronics Weekly, Nov. 9, 2005.

Bush, Steve, "Detrimental voids discovered in Pb-free solder joints - University of Leicester," Electronics Weekly, June 25, 2009.

Bush, Steve, "Distributors offer useful advice on lead-free," Electronics Weekly , Apr. 7, 2004.

Bush, Steve, "Does Europe's RoHS Contain Lead Loophole?," Electronics Weekly , Feb. 26, 2004.

Bush, Steve, "Electronics shows no interest in EU's looming lead-free deadline," electronicsweekly.com, Sept. 11, 2002.

Bush, Steve, "Europe decides lead-free exemptions," Electronics Weekly, Oct. 13, 2004.

Bush, Steve, "European Commission short-circuits RoHS exemptions debate," Electronics Weekly, July 12, 2006.

Bush, Steve, "European energy law 'more profound than RoHS'," Electronics Weekly , May 17, 2006.

Bush, Steve, "European firms struggle to meet WEEE recovery targets," Electronics Weekly, Sept. 13, 2006.

Bush, Steve, "European initiatives to rescue lead-free disaster," Electronics Weekly, Jan. 22, 2003.

Bush, Steve, "Fears of tin whisker growth in solder trimmed by tests," Electronics Weekly, June 11, 2003.

Bush. Steve, "Fog thickens for Europe's Pb-free rules," Electronics Weekly , May 18, 2004.

Bush, Steve, "Fog Thickens Over Europe's Lead-Free Rules," Electronics Weekly , Mar. 24, 2004.

Bush, Steve, "Government must put cash behind recycling," electronicsweekly.com , Apr. 30, 2003.

Bush, Steve, "Government must put cash behind recycling technology opportunity," electronicsweekly.com, Apr. 30, 2003.

Bush, Steve, "Government sticks to RoHS deadline," Electronics Weekly, June 28, 2006.

Bush, Steve, "High-performance lead-free chip 'impossible' claims IR," Electronics Weekly, May 23, 2001.

Bush, Steve, "High temps, stresses cause whiskers," Electronics Weekly, June 13, 2005.

Bush, Steve, "Ignorance of RoHS will strip SMEs of markets," Electronics Weekly , Sept. 7, 2005.

Bush, Steve, "Japan's waste policy puts UK to shame," Electronics Weekly, Jan. 18, 2006.

Bush, Steve, "Lack of data threatens RoHS plans," Electronics Weekly, Feb. 11, 2004.

Bush, Steve, "Last chance to affect lead-free and waste directives," electronicsweekly.com, Aug. 4, 2004.

Bush, Steve, "Lead-free Directive text rejected," electronicsweekly.com, June 16, 2004.

Bush, Steve, "Lead-free loophole allows firms to sidestep European RoHS directive," Electronics Weekly, Feb. 25, 2004.

Bush, Steve, "Lead-free loophole sidesteps RoHS directive," Electronics Weekly , May 18, 2004.

Bush, Steve, "Lead-free: PCB coating," Electronics Weekly, Nov. 3, 2004.

Bush, Steve, "MEPs call "foul" on Pb-free exemptions," Electronics Weekly, Mar. 8, 2005.

Bush, Steve, "Naming of the parts," Electronics Weekly, Sept. 14, 2004.

Bush, Steve, "NPL tests lead-free solder joints," Electronics Weekly, Nov. 25, 2004.

Bush, Steve, "'Odd' definition creates RoHS Directive loophole," Electronics Weekly, May 4, 2004.

Bush, Steve, "Panel Studies Lead Contamination," Electronics Weekly, June 21, 2005.

Bush, Steve, "Pb-Free Manufacturing Support Offered," ElectronicNews, May 20, 2005.

Bush, Steve, "Philips Attacks Ambiguous Wording in Europe's RoHS," Electronics Weekly, May 19, 2004.

Bush, Steve, "Proposed new RoHS Directives explained," ElectronicsWeekly.com , Dec. 3, 2008.

Bush, Steve, "Purging the pollutants for RoHS and WEEE," Electronics Weekly , Dec. 5, 2005.

Bush, Steve, "Recycling target agreed on draft Battery Directive," Electronics Weekly, May 11, 2006.

Bush, Steve, "Rocky road to RoHS compliance," Electronics Weekly, Mar. 2, 2005.

Bush, Steve, "RoHS crackdown is working in the U.K.," Electronics Weekly, Feb.14, 2007.

Bush, Steve, "RoHS: Distributor calls for new part numbers," Electronics Weekly , Sept. 19, 2005.

Bush, Steve, "RoHS overhaul of exemptions starts next year," Electronics Weekly , Oct. 11, 2007.

Bush, Steve, "RoHS test technique comes under scrutiny," Electronics Weekly , July 19, 2006.

Bush, Steve, "RoHS, WEEE and ELV Directive analysis machine," Electronics Weekly , Aug. 16, 2004.

Bush, Steve, "Sign up for WEEE now, U.K. Environment Agency says," Electronics Weekly, Mar. 21, 2007.

Bush, Steve, "SMEs still shun Pb-free," electronicsweekly.com, Jan. 14, 2003.

Bush, Steve, "Suppliers get WEEE breathing space," ElectronicsWeekly.com, Mar. 29, 2005.

Bush, Steve, "Third of European Companies Unprepared for Lead-Free," Electronics Weekly, Apr. 13, 2005.

Bush, Steve, "Third of firms unprepared for Pb-free," Electronics Weekly, Apr. 13, 2005.

Bush, Steve, "Tin industry argues for reliability of Pb-free PCBs," Electronics Weekly, Mar. 2, 2005.

Bush, Steve, "Tin industry backs Pb-free reliability," Electronics Weekly, Mar. 2, 2005.

Bush, Steve, "Tin whiskers brush with RoHS," Electronics Weekly, Feb. 18, 2005.

Bush, Steve, "Tin whiskers have a brush with RoHS Directive over exemption," Electronics Weekly, Feb. 16, 2005.

Bush, Steve, "Truce called on lead-free directive," Electronics Weekly, July 21, 2004.

Bush, Steve, "U.K. Readies RoHS Enforcement," Electronics Weekly, July 29, 2005.

Bush, Steve, "U.K. Sticks to RoHS Deadline," Electronics Weekly, June 28, 2006.

Bush, Steve, "UK authorities get tough over RoHS," Electronics Weekly, July 5, 2006.

Bush, Steve, "UK firms don't lead on lead-free," electronicsweekly.com, Sept. 11, 2002.

Bush, Steve, "UK links with Japan for lead-free plan," Electronics Weekly, Jan. 22, 2003.

Bush, Steve, "UK starts consultation for WEEE Directive proposals," Electronics Weekly, Apr. 5, 2006.

Bush, Steve, "Uncertainty over battery recycling targets," Electronics Weekly , Aug. 14, 2006.

Bush, Steve, "US researchers warn chip makers over solder stress," Electronics Weekly, Sept. 24, 2003.

Bush, Steve, "WEEE Directive compliance scheme launched," Electronics Weekly , July 26, 2004.

Bush, Steve, "Weights and measures lab to enforce RoHS," Electronics Weekly , July 26, 2005.

Bush, Steve, "Will the US market play hard-ball over RoHS?," Electronics Weekly , Sept. 28, 2006.

Butel, Nicole, "Comparison of the Level 2 Characteristics of HITCE(TM) Substrate Assembled with SAC and High Lead Balls," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 442-459.

Butler, John, "Ask the EMPF Helpline!," empfasis, pp. xx-xx, End of year 2005.

Butler, Mike, "New adhesives for 260°C Reflow," SMART Group/NPL Lead Free Seminar 2003 , Feb. 23, 2003.

Buttars, Scott K., "Design for BGA Lead-Free Solder Joint Reliability," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 293-299.

Buttars, Scott K., Fan, Chonglun, and Aspandiar, Raiyo, "Should Intermetallic Thickness Measurements be Needed to Determine Solder Joint Reliability," SMTA International 2012 Conference Proceedings , Orlando, FL, Oct. 14-18, 2012, pp. 73-82.

Buttars, Scott K., Fan, Chonglun, and Aspandiar, Raiyo F., "Should Intermetallic Thickness Measurements be Needed to Determine Solder Joint Reliability," SMTA Journal, vol. 25 no. 4, pp. 13-22, 2012.

Butterfield, Andrew, Visintainer. Valerie, and Goudarzi, Vahid, "Lead Free Solder Flux Vehicle Selection Process," 2000 SMTA International Conference Proceedings, Chicago, IL, Sept. 24-28, 2000, pp. xx-xx.

Butterfield, Andrew, Visintainer, Valerie, and Goudarzi, Vahid, "Lead Free Solder Paste Flux Evaluation and Implementation in Personal Communication Devices," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 1420-1425.

Buysse, Dan, "Terminal blocks: Through-hole reflow technology makes the grade," Connector Specifier, vol. 20 no. 10, pp. xx-xx, Oct. 2004.

Buyukbay, Basak, Ciliz, Nilgun, Goren, Gun Evren, and Mammadov, Aydin, "Cleaner production application as a sustainable production strategy, in a Turkish Printed Circuit Board Plant," Resources, Conservation and Recycling, vol. 54 no. 10, pp. 744-751, Aug. 2010.

Byle, Fritz, and Liu, Jin, "A Novel Low-Cost, High-Performance Thermally and Electrically Conductive Adhesive," 2005 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Byle, Fritz, and Liu, Jin, "A novel, low-cost, high-performance, thermally and electrically conductive adhesives," Global SMT & Packaging, vol. 5 no. 2, pp. 10-12, 14, 16, Feb. 2005.

Byle, Fritz, Jean, Denis, and Lee, Dale, "A Study of Copper Dissolution in Pb-Free Solder Fountain Systems," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 183-187.

Byranvand, Mahdi Malekshahi, and Kharat, Ali Nemati, One pot green synthesis of gold nanowires using pomegranate juice," Materials Letters, vol. 134, pp. 64-66, Nov. 1, 2014.

Byrd, Kevin, Gmerek, Gerald, and Carlo, Hector, "Comparison of Surface Mount Yields for Tin-Bismuth Low Temperature Solder vs. SAC in an Aggressive Motherboard Design," SMTA International 2020 , virtual conference, Sept. 28-Oct. 23, 2020, pp. 299-304.

CCCC

Caballero-Calero, Olga, and Martin-Gonzalez, Marisol, "Thermoelectric nanowires: A brief prospective," Scripta Materialia , vol. 111, pp. 54-57, Jan. 15, 2016.

Cable, Al, "Why is Lead Tinning a Required Process?," Surface Mount Technology (SMT), vol. 26 no. 11, pp. 68-70, Nov. 2011.

Cable, Alan, "Clearing Up Dross," Printed Circuit Design and Fab/ Circuits Assembly , vol 28 no. 2, pp. 35, Feb. 2011.

Cable, Alan, "Key Process Issues for Lead-free Selective Soldering," Circuitnet , Mar. 2009.

Cable, Alan, "Lead-Free Selective Soldering - Applications, Advantages, and Case Studies," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 272-277.

Cable, Alan, and Cox, Roger, "Lead Tinning Requirements for the 21st Century," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 577-582.

Cable, Alan, "Productivity and Cost Efficiency of Lead-Free Selective Soldering," IPC Review, vol. 48 no. 10, pp. 9, Dec. 2007.

Cable, Alan, "Re-tinning New Components for High-Rel Assembly," Printed Circuit Design and Fab/ Circuits Assembly, vol. 29 no. 1, pp. 46, Jan. 2012.

Cable, Alan, "Successful Lead-Tinning," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 5, pp. 52, May 2010.

Cabrera, J. M., Cubero, J. A., Subirats, A., and Prado, J. M., "High Temperature Behavior of Eutectic Sn-Pb and Sn-Ag Soldering Alloys," Materials Science Forum, vol. 442, pp. 37-42, 2003.

Cabrera, N., and Price, P. B., "The Mechanical Properties of Zinc Whiskers," Growth and Perfection of Crystals, Cooperstown, NY, Aug. 27-29, 1958, pp. 204-213. (Edited by Doremus, R. H., Roberts, B. W., and Turnbull, David.)

Cacciamani, G., Borzone, G., and Watson, A., "Thermodynamic modelling and assessment of the Au-In-Sn system," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 33 no. 1, pp. 100-108, Mar. 2009.

Cadirli, E., Sahin, M., Kayali, R., Ari, M., and Durmus, S., "Dependence of electrical and thermal conductivity on temperature in directionally solidified Sn-3.5 wt% Ag eutectic alloy," Journal of Materials Science: Materials in Electronics, vol. 22 no. 11, pp. 1709-1714, Nov. 2011.

Cadirli, E., Boyuk, U., Engin, S., Kaya, H., Marasli, N., and Ulgen, A., "Experimental investigation of the effect of solidification processing parameters on the rod spacings in the Sn-1.2 wt.% Cu alloy," Journal of Alloys and Compounds, vol. 486 no. 1-2, pp. 199-206, Nov. 3, 2009.

Cadirli, E., and Sahin, M., "Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn-3.5 wt% Ag eutectic solder," Journal of Materials Science: Materials in Electronics, vol. 23 no. 1, pp. 31-40, Jan. 2012.

Cadirli, E., Boyuk, U., Engin, S., Kaya, H., Marasli, N., and Ari, M., "Investigation of microhardness and thermo-electrical properties in the Sn-Cu hypereutectic alloy," Journal of Materials Science: Materials in Electronics, vol. 21 no. 5, pp. 468-474, May 2010.

Cadirli, E., Boyuk, U., Engin, S., Kaya, H., Marasli, N., Keslioglu, K., and Ulgen, A., "Investigation of the effect of solidification processing parameters on the rod spacings and variation of microhardness with the rod spacing in the Sn-Cu hypereutectic alloy," Journal of Materials Science: Materials in Electronics, vol. 21 no. 6, pp. 608-618, June 2010.

Cadirli, E., and Kaya, H., "The effect of composition on microhardness and determination of electrical and thermal properties in the Sn-Cu alloys," Journal of Materials Science: Materials in Electronics, vol. 22 no. 9, pp. 1378-1386, Sept. 2011.

Cadirli, E., Boyuk, U., Kaya, H., Marasli, N., Keslioglu, K., Akbulut, S., and Ocak, Y., "The effect of growth rate on microstructure and microindentation hardness in the In-Bi-Sn ternary alloy at low melting point," Journal of Alloys and Compounds, vol. 470 no. 1-2, pp. 150-156, Feb. 20, 2009.

Cadirli, Emin, Boyuk, Ugur, Kaya, Hasan, and Marash, Necmettin, "Determination of mechanical, electrical and thermal properties of the Sn-Bi-Zn ternary alloy," Journal of Non-Crystalline Solids, vol. 357 no. 15, pp. 2876-2881, July 15, 2011.

Caers, J. F. J. M., Zhao, X. J., Wong, E. H., Seah, S. K. W., Selvanayagam, C. S., van Driel, W. D., Owens, N., Leoni, M., Tan, L. C., Eu, P. L., Lai, Yi-Shao, and Yeh, Chang-Lin, "A Study of Crack Propagation in Pb-Free Solder Joints," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 2, pp. 84-90, Apr. 2010.

Caers, J. F. J. M., Wong, E. H., Seah, S. K. W., Zhao, X. J., Selvanayagam, C. S., van Driel, W. D., Owens, N., Leoni, M., Tan, L. C., Eu, P. L., Lai, Yi-Shao, and Yeh, Chang-Lin, "A Study of Crack Propagation in Pb-free Solder Joints under Drop Impact," 2008 Proceedings 58th Electronic Components & Technology Conference , Lake Buena Vista, FL, May 27-30, 2008, pp. 1166-1172.

Caers, J. F. J. M., and Kessels, F. J. H., "Aging Kinetics for Temperature Loads of z-Conductive Adhesives In-Situ Monitoring of the Contact Resistance of Heat Seal Connectors," 1997 Proceedings 47th Electronic Components & Technology Conference, San Jose, CA, May 18-21, 1997, pp. 153-157.

Caers, J. F. J. M., Zhao, X. J., de Vries, J. W. C., Wong, E. H., Kums, G., and Engelfriet, A. R. C., "HART: A New Highly Accelerated Robustness Test for Conductive Adhesive Interconnects," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1695-1699.

Caers, J. F. J. M., Zhao, X. J., and Eggink, H. J., "Study on the Reliability of High Power Device Assemblies Using High-Pb Solder Alternatives: An Overview," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 342-349.

Cagle Jr., F. Wm., and Eyring, Henry, "An Application of the Absolute Rate Theory to Phase Changes in Solids," Journal of Physical Chemistry, vol. 57 no. 9, pp. 942-946, Jan. 4, 1954.

Cagno, Enrico, Magalini, Federico, and Trucco, Paolo, "Modelling and planning of Product Recovery Network: the case study of end-of-life refrigerators in Italy," International Journal of Environmental Technology and Management, vol. 8 no. 4, pp. 385-404, Mar. 2008. DOI: 10.1504/IJETM.2008.017509

Cahill, Rachel, Grimes, Sue M., and Wilson, David C., "Extended producer responsibility for packaging wastes and WEEE - a comparison of implementation and the role of local authorities across Europe," Waste Management and Research, vol. 29 no. 5, pp. 455-479, May 2011.

Cahn, R. W., "A New Theory of Recrystallization Nuclei," Proceedings of the Physical Society, B, vol. 63 part 4 no. 364B, pp. 323-336, Apr. 1, 1950.

Cai, Chongyang, Xu, Jiefeng, Wang, Huayan, and Park, Seungbae, "Reliability of homogeneous Sn-Bi and hybrid Sn-Bi/SAC BGAs," 2020 IEEE 70th Electronic Components and Technology Conference, Lake Buena Vista, AL, May 26-29, 2020, pp. 1496-1501.

Cai, Chongyang, An, Rong, Wang, Chunqing, and Tian, Yanhong, "Void propensity in solder joints on a single copper pad with a grain size spectrum tuned by strain annealing," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1612-1616.

Cai, Huacheng, Wang, Wendong, Liu, Peiwen, Wang, Guangming, Liu, Ankang, He, Zhe, Cheng, Zhaofang, Zhang, Shengli, and Xia, Minggang, "Enhanced synthesis of Sn nanowires with aid of Se atom via physical vapor transport," Journal of Crystal Growth, vol. 420, pp. 42-46, June 15, 2015.

Cai, Jian, Wang, Junqiang, Wang, Qian, Liu, Ziyu, Wang, Dejun, Seo, Sun-Kyoung, and Cho, Tae-Je, "Low Temperature Solid-State-Diffusion Bonding for Fine-Pitch Cu/Sn/Cu Interconnect," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1616-1623.

Cai, M., Xie, D. J., Chen, W. B., Wu, B. Y., Yang, D. G., and Zhang, G. Q., "A novel soldering method to evaluate PCB pad cratering for pin-pull testing," Microelectronics Reliability, vol. 53 no. 9-11 pp. 1568-1574, Sept.-Nov. 2013.

Cai, M., Xie, D. J., Zhang, Z., Hu, Billy, Su, X. X., Tao, Y, and Wu, B. Y., "Investigation on PCB Pad Strength," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 1226-1229.

Cai, Q., Ye, L., Xu, B. J., Di, Z. F., Jin, Q. H., and Zhao, J. L., "Fabrication and Biochemical Sensing Applications of Controllable Germanium Nanowires Array," 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, Anchorage, AK, June 21-25, 2015, pp. 510-513.

Cai, Shuguang, Xiao, Xueqing, Ye, Xiaoyun, Li, Wei, and Zheng, Chan, "Nonlinear optical and optical limiting properties of ultra-long gold nanowires," Materials Letters, vol. 166, pp. 51-54, Mar. 1, 2016.

Cai, Xia, Huang, Weidong, Xu, Bulu, Kaltenpoth, Gidela, and Cheng, Zhaonian, "A Study of Moisture Diffusion in Plastic Packaging," Journal of Electronic Materials, vol. 31 no. 5, pp. 449-455, May 2002.

Cai, Xiaorong, Handwerker, Carol A., Blendell, John E., and Koslowski, Marisol, "Shallow grain formation in Sn thin films," Acta Materialia, vol. 192, pp. 1-10, June 15, 2020.

Cai, Xiong-hui, An, Bing, Wu, Feng-shun, and Wu, Yi-ping, "Assembly of flexible RFID tag inlays with anisotropic conductive paste (ACP)," Circuit World, vol. 35 no. 4, pp. 40-45, 2009.

Cai, Xiong-hui, An, Bing, Lai, Xiao-wei, Wu, Yi-ping, and Wu, Feng-shun, "Reliability Evaluation on Flexible RFID Tag Inlay Packaged by Anisotropic Conductive Adhesive," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Cai, Xiong-hui, An, Bing, Wu, Yi-ping, Wu, Feng-shun, and Lai, Xiao-wei, "Research on the Contact Resistance and Reliability of Flexible RFID Tag Inlays Packaged by Anisotropic Conductive Paste," International Conference on Electronic Packaging Technology & High Density Packaging , Shanghai, China, July 28-31, 2008, pp. xx-xx.

Cai, Xiong-hui, Chen, Xian-cai, An, Bing, Wu, Feng-shun, and Wu, Yi-ping, "The Effects of Bonding Parameters on the Reliability Performance of Flexible RFID Tag Inlays Packaged by Anisotropic Conductive Adhesive," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1054-1058.

Cai, Xiong-hui, Zhai, Ai-xia, and Cheng, Chuan-song, "The preparation and the reliability study of an anisotropic conductive paste (ACP) for RFID tag inlays' packaging," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 368-371.

Cai, Zijie, Suhling, Jeffrey C., Lall, Pradeep, and Bozack, Michael J., "Aging Induced Mechanical Property Degradation and Microstructure Evolution of SAC+X Lead Free Solder Alloys," Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 1, Burlingame, CA, July 16-18, 2013, pp. V001T07A016-1-V001T07A016-13.

Cai, Zijie, Suhling, Jeffrey C., Lall, Pradeep, and Bozack, Michael J., "Mitigation of Lead Free Solder Aging Effects using Doped SAC-X Alloys," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 896-909.

Cai, Zijie, Zhang, Yifei, Suhling, Jeffrey C., Lall, Pradeep, Johnson, R. Wayne, and Bozack, Michael J., "Reduction of Lead Free Solder Aging Effects using Doped SAC Alloys," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1493-1511.

Cai, Zijie, Suhling, Jeffrey C., Lall, Pradeep, and Bozack, Michael J., "The Effects of Dopants on the Aging Behavior of Lead Free Solders," Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, Volume 2, Portland, OR, July 6-8, 2011, pp. 733-748.

Cairns, Lisa Ann, "Ensuring RoHS 2 success with agility," Solid State Technology, vol. 56 no. 3, pp. 33, May 2013.

Cairns, Lisa Ann, "Ensuring RoHS 2 success with agility," Advanced Packaging, vol. 56 no. 3, pp. 33, May 2013.

Calata, J. N., Bai, G., Lei, G., and Lu, G-Q., "Nanoscale Silver Paste and its Sintering for Attaching Semiconductor Devices," 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 35.

Calata, Jesus N., Lu, Guo-Quan, Ngo, Khai, and Nguyen, Luu, "Electromigration in Sintered Nanoscale Silver Films at Elevated Temperature," Journal of Electronic Materials, vol. xx no. x, pp. xx-xx, xxxx.

Calata, Jesus N., Lei, Thomas G., and Lu, Guo-Quan, "Low Temperature Sintering of Nanosilver Paste for High-Temperature Device Interconnection," empfasis, pp. 1-3, Nov. 2006.

Calder, Bruce, and Smith, Ian, "Korea "RoHS" Not Like RoHS at All, Really," Conformity, vol. 13 no. 3, pp. 26,28-30, Mar. 2008.

Calder, Bruce, "RoHS enforcement: Penalties and lost sales," Green SupplyLine , Apr. 9, 2007.

Calder, James, "Electronic Waste: How Waste Leads to Design Challenges," IN Compliance Magazine, pp. 36-38,40, Apr. 2010.

Callol, Pedro, "Reach consortia: a law perspective," Electronics Supply & Manufacturing, Feb. 2007.

Calvery, Herbert O., "Illnesses Traced to Cadmium Food Containers," Metal Finishing, vol. 40. no. 3, pp. 134-135, Mar. 1942.

Camilleri, Duncan, "Thermo-mechanical behaviour of DBC substrate assemblies subject to soldering fabrication processes," Soldering & Surface Mount Technology, vol. 24 no. 2, pp. xx-xx, 2012.

Cammi, Davide, Rodiek, Beatrice, Zimmermann, Kseniia, Kuck, Stefan, and Voss, Tobias, "Toward a metrological calibration of the conversion efficiency in GaAs nanowire-based photodetectors," Journal of Materials Research, vol. 32 no. 13, pp. 2464-2470, July 2017.

Camp, Richard, "SMART 2001 - Lead Free," Lead-Free Soldering Seminar 2001, High Wycombe, United Kingdom, Feb. 15, 2001.

Campbell, Gerard, Ingham, Tony, and Brown, Steve, "Development of a High Performance Lead-Free Wave Solder Alloy,", IPC/JEDEC 7th International Conference on Lead-Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20, 2004, pp. xx-xx.

Campuzano-Contreras, Ana L., "Assembly of JCAA/JG-PP Test Vehicles," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 763-770.

Campuzano-Contreras, (Ana) Lety, "JCAA/JGPP Test Vehicle Assembly," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Campuzano-Contreras, Ana L., ""Rework" Test Vehicles of JCAA/JG-PP Lead-Free Solder Project," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 818-824.

Canadell, Nuria Sirvent, and Zamora, Miguel Garcia, "Drawability of fire-refined copper in a Multiwire at high speed," Wire Journal International, vol. 37 no. 9, pp. 58-61, Sept. 2004.

Cannella, Joe, "Tech Tips... BGA Reballing," empfasis, pp. 9-10, Sept. 2006.

Cannis, Jeff, "Definition of "Green" IC Packages," Amkor, Dec. 16, 2003.

Cannis, Jeff, "Green IC packaging," Advanced Packaging, vol. 10 no. 8, pp. xx-xx, Aug. 2001.

Cannis, Jeff, "Reinventing the integrated circuit is more than just a lead-free issue," Advanced Packaging, vol. xx no. xx, pp. xx-xx, Aug. 2001.

Cannon, Mark, "A Novel IR Rework System," Circuits Assembly, vol. 16 no. 11, pp. 34, 36-37, Nov. 2005.

Cannon, Mark, "Considerations for Implementing Lead-Free Soldering," Circuits Assembly, vol. 15 no. 9, pp. 46-48, 51, Sept. 2004.

Cannon. Mark, Klenke, Bob, and Zarrow, Phil, "Improving Hand Soldering Operational Costs and Process Control," Circuits Assembly, vol. 17 no. 7, pp. 28-31, 33, July 2006.

Cannon, Mark, Klenke, Bob, and Zarrow, Phil, "Integrating AOI and Selective Soldering," Circuits Assembly, vol. 17 no. 2, pp. 50-55, Feb. 2006.

Cannon, Mark, "Lead Free First Article Inspection: The Key to Success," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference , Anaheim, CA, Feb. 24-26, 2004, pp. S05-5-1-S05-5-9.

Cannon, Mark, and Friedrich, Juergen, "Lead free Flip Chip and Chip Scale Package inspection," EMasia , July 2006.

Cannon, Mark, and Friedrich, Juergen, "Lead Free Flip Chip and Chip Scale Package Inspection: New Challenges Will Require New Inspection Technologies," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Cannon, Mark, Klenke, Bob, and Zarrow, Phil, "Lead-Free Hand Soldering: New Technologies for Enhancing the Weakest Link in the Lead-Free Rework and Repair Process Control Chain," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 258-263.

Cannon, Mark, Klenke, Bob, and Zarrow, Phil, "Lead-Free Soldering by Hand," Assembly, vol. 50 no. 5, pp. 50-55, May 2007.

Cannon, Mark, and Friedrich, Juergen, "Pb-Free Flip Chip and CSP Inspection," Circuits Assembly, vol. 16 no. 7, pp. 38, July 2005.

Cannon, Mark, "The true costs of lead-free implementation," EMasia, Nov. 2004.

Cannon, Mark, and Friedrich, Juergen, "Topside Solder Ball Defects," Assembly, vol. 48 no. 7, pp. 86-89, July 2005.

Cantoro, M., Brammertz, G., Richard, O., Bender, H., Clemente, F., Leys, M., Degroote, S., Caymax, M., Heyns, M., and De Gendt, S., "Controlled III/V Nanowire Growth by Selective-Area Vapor-Phase Epitaxy," Journal of the Electrochemical Society, vol. 156 no. 11, pp. H860-H868, 2009.

Cantrell, Mark, "Japan's Best-Kept Pb-Free Secret," California Eastern Laboratories.

Cantrell, Mark, ""Japan's Best-Kept Pb-Free Secret," Microwave Product Digest , pp. 5, Jan. 2005.

Canumalla, S., Ludwig, K., Pedigo, R., and Fitzgerald, T., "A Study on Ranking of Commercial Fluxes for Electrochemical Migration (ECM) Propensity for Cu, Sn and Ag Surface Finishes," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 625-632.

Canumalla, Sridhar, "Robust Design of Third Level Packaging in Portable Electronics: Solder Joint Reliability under Dynamic Mechanical Loading," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1187-1195.

Canumalla, Sridhar, "Robust Design of Third-Level Packaging in Portable Electronics: Solder Joint Reliability Under Dynamic Mechanical Loading," IEEE Transactions on Components and Packaging Technologies, vol. 32 no. 2, pp. 396-404, June 2009.

Cao, Huadong, Gan, Guisheng, Tian, Mizhe, Jiang, Liujie, Liu, Cong, Zhang, Chunhong, Sun, Pengfei, Liu, Xin, and Wu, Yiping, "Effect of Ag content on microstructure and fatigue crack of SAC lead-free solder balls under rapid thermal fatigue," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Cao, Huijun, and Zhang, Zhihao, "Inherent growth habit of Cu6Sn5 phase at the liquid Sn0.7wt%Cu solder/ (111)Cu joint interface," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 352-355.

Cao, Liqiang, Lai, Zonghe, and Liu, Johan, "Effect of Curing Condition of Adhesion Strength and ACA Flip-Chip Contact resistance," Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis , Shanghai, China, June 30-July 3, 2004, pp. 254-258.

Cao, Liqiang, Li, Shiming, Lai, Zonghe, and Liu, Johan, "Formulation and Characterization of Anisotropic Conductive Adhesive Paste for Microelectronics Packaging Applications," Journal of Electronic Materials, vol. 34 no. 11, pp. 1420-1427, Nov. 2005.

Cao, Liqiang, Lai, Zonghe, and Liu, Johan, "Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate," Journal of Electronic Packaging, Transactions of the ASME, vol. 127 no. 1, pp. 43-46, Mar. 2005.

Cao, M., Butler, S., Benoit, J. T., Jiang, Y., Radhakrishnan, R., Chen, Y., Bendapudi, S., and Horne, Steve, "Thermal Stress Analysis/Life Prediction of Concentrating Photovoltaic Module," Journal of Solar Energy Engineering, vol. 130 no. 2, pp. 021011-1-021011-9, May 2008.

Cao, T.-S., Vachey, C., Montmitonnet, P., and Bouchard, P.-O., "Comparison of reduction ability between multi-stage cold drawing and rolling of stainless steel wire - Experimental and numerical investigations of damage," Journal of Materials Processing Technology, vol. 217, pp. 30-47, Mar. 2015.

Cao, Xiao, Wang, Tao, Ngo, Khai D. T., and Lu, Guo-Quan, "Characterization of Lead-Free Solder and Sintered Nano-Silver Die-Attach Layers Using Thermal Impedance," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 4, pp. 495-501, Apr. 2001.

Capell, Mike, "AMS Electronics Preferred Parts List," Nov. 1, 2001.

Capitano, Joseph L., and Devaney, John R., "Reliability Improvement by Removing Electrical Interrupts in Equipment which Result in "retest O. K.", "Can"t Duplicate," "No Defect Found"," IEEE 1986 National Aerospace and Electronics Conference, Volume 4, Dayton, OH, May 19-23, 1986, pp. 1110-1114.

Caputo, A., Turbini, L. J., and Perovic, D. D, "The Chemical Nature of Bromide-Containing Conductive Anodic Filament," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Caputo, Antonio, Turbini, Laura J., and Perovic, Doug D., "Characterization and Electrochemical Mechanism for Bromide-Containing Conductive Anodic Filament (CAF) Failure," Journal of Electronic Materials, vol. 40 no. 9, pp. 1884-1894, Sept. 2011.

Caputo, Antonio, Turbini, Laura J., and Perovic, Doug D., "Conductive Anodic Filament (CAF) Formation Part I: the Influence of Water-Soluble Flux on Its Formation," Journal of Electronic Materials , vol. 39 no. 1, pp. 85-91, Jan. 2010.

Caputo, Antonio, Turbini, Laura J., and Perovic, Doug D., "Conductive Anodic Filament Formation Part II: Electrochemical Reactions Leading to CAF," Journal of Electronic Materials, vol. 39 no. 1, pp. 92-96, Jan. 2010.

Caputo, Antonio, Turbini, Laura J., and Perovic, Doug D., "Design limitations related to conductive anodic filament formation in a micro-world," Microsystem Technologies, vol. 15 no. 1, pp. 39-44, Jan. 2009.

Car, Diana, Wang, Jia, Verheijen, Marcel A., Bakkers, Erik P. A. M., and Plissard, Sebastien R., "Rationally Designed Single-Crystalline Nanowire Networks," Advanced Materials, vol. 26 no. 28, pp. 4875-4879, July 23, 2014.

Carano, Michael, "Achieving an ENIG Resistant LPI Solder Mask Process," Printed Circuit Design and Manufacture, vol. 24 no. 8, pp. 20, Aug. 2007.

Carano, Michael, "Black Pad & Brittle Fracture: Controlling the ENIG Process," PCB007, May 10, 2011.

Carano, Michael, and Burger, Lee, "Building Reliability into the PWB: Optimization of the Desmear and Metalization Processes for Use on High Frequency and Lead Free Laminate Materials," IPC Printed Circuits Expo, APEX and the Designer Summit , Anaheim, CA, Feb. 8-10, 2006, pp. S32-01-1-S32-01-11.

Carano, Michael, "Final Finishes and Their Compatibility with Lead Free Soldering," IPC/JEDEC 8th International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, W-06.

Carano, Michael, Bill Bowerman, and Burger, Lee, "Final Finishes for High Temperature Applications: A Comparison of OSP and Immersion Silver Final Finish Coatings," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S19:01.

Carano, Michael, and Hunt, John, "Improved organic solderability preservatives for mixed metal finishes," Rockwood Electronic Materials Electrochemicals.

Carano, Michael, and Saeki, Koji, "Improved Organic Solderability Preservatives (OSPs) for Mixed Metal Finishes," CircuiTree, vol. 17 no. 5, pp. xx, May 2004.

Carano, Michael, "Optimiizing the Organic Solderability Preservative Process (OSP) for Lead-Free Assembly," 2008 SMTA International Conference Proceedings , Orlando, FL, Aug. 17-21, 2008, pp. 284-289.

Carano, Michael, "Plated Through-Hole Voiding - Root Causes and Corrective Actions," CircuiTree, vol. 21 no. 2, pp. xx-xx, Feb. 2008.

Carano, Michael, "The evolution of organic solderability preservatives (OSPs) from a temporary protectant to a leadership position in surface finishing chemistry," Circuit World, vol. 37 no. 2, pp. 12-19, 2011.

Carano, Michael, "Tin Plating," Plating & Surface Finishing, vol. 82 no. 8, pp. 72, 74, Aug. 1995.

Carano, Michael, "Tin Plating," Plating & Surface Finishing, vol. 84 no. 8, pp. 73-74, Aug. 1997.

Carano, Michael, "Tin Plating," Plating & Surface Finishing, vol. 85 no. 11, pp. 66-67, Nov. 1998.

Carano, Michael, "Tin Plating," Plating & Surface Finishing, vol. 87 no. 8, pp. 64-65, Aug. 2000.

Carano, Michael, "Tin Plating," Plating & Surface Finishing, vol. 88 no. 8, pp. 54-55, Aug. 2001.

Carano, Michael, "Tin Plating," Plating & Surface Finishing, vol. 89 no. 8, pp. 49-50, Aug. 2002.

Carano, Michael, "Tin Plating," Plating & Surface Finishing, vol. 90 no. 8, pp. 43, 45, Aug. 2003.

Carano, Michael, "Tin plating," Plating & Surface Finishing, vol. 91 no. 8, pp. 35, 37, Aug. 2004.

Carano, Michael, "Tin Plating," Plating & Surface Finishing, vol. 94 no. 11, pp. 37-38, Nov. 2006.

Carano, Michael, "Tin-Lead Plating," Plating & Surface Finishing, vol. 82 no. 8, pp. 76, 78, Aug. 1995.

Carano, Michael, "Tin-Lead Plating," Plating & Surface Finishing, vol. 84 no. 8, pp. 75-76, Aug. 1997.

Carano, Michael, "Tin-Lead Plating," Plating & Surface Finishing, vol. 85 no. 11, pp. 68-69, Nov. 1998.

Carano, Michael, "Tin-Lead Plating," Plating & Surface Finishing, vol. 87 no. 8, pp. 66-67, Aug. 2000.

Carano, Michael, "Tin-Lead Plating," Plating & Surface Finishing, vol. 88 no. 8, pp. 56-57, Aug. 2001.

Carano, Michael, "Tin-Lead Plating," Plating & Surface Finishing, vol. 89 no. 8, pp. 51-52, Aug. 2002.

Carano, Michael, "Tin-Lead Plating," Plating & Surface Finishing, vol. 90 no. 8, pp. 44-45, Aug. 2003.

Carano, Michael, "Tin-Lead Plating," Plating & Surface Finishing, vol. 91 no. 8, pp. 36-37, Aug. 2004.

Carano, Michael, "Tin-Lead Plating," Plating & Surface Finishing, vol. 94 no. 11, pp. 39, 41, Nov. 2006.

Carano, Michael, "Trouble in Your Tank: Should ENIG be Used on High-Value PCBs?," PCB007, Mar. 1, 2011.

Carbone, James, "Allied simplifies RoHS packing slip," Purchasing, vol. xx no. xx, pp. xx-xx, June 1, 2006.

Carbone, James, "Catalogers offer RoHS help," Purchasing, vol. xx no. xx, pp. xx-xx, Oct. 6, 2005.

Carbone, James, "China RoHS demands more from buyers," Purchasing, vol. 136 no. 2, pp. xx-xx, Feb. 15, 2007.

Carbone, Jim, "Commodity costs drive some connector tags up," Purchasing, vol. xx no. xx, pp. xx-xx, Apr. 20, 2006.

Carbone, Jim, "Confusion over RoHS," Purchasing, vol. xx no. xx, pp. xx-xx, May 26, 2005.

Carbone, James, "Electronics OEMs face WEEE deadline, too," Purchasing, vol. 139 no. 19, pp. xx-xx, Nov. 17, 2005.

Carbone, Jim, "Get ready for REACH and RoHS 2," Purchasing, vol 138 no. 6, pp. 40-42, June 2009.

Carbone, Jim, "Get the lead out!," Purchasing, vol. xx no. xx, pp. xx-xx, Oct. 23, 2003.

Carbone, Jim, "IPC concerned about RoHS expansion," Purchasing, vol. xx no. xx, pp. xx-xx, May 19, 2008.

Carbone, James, "Lead ban's impacts on EMS," Purchasing, vol. xx no. xx, pp. xx-xx, Oct. 28, 2004.

Carbone, James, "Lead-free compliance will be expensive," Purchasing, vol. xx no. xx, pp. xx-xx, Nov. 4, 2004.

Carbone, James, "Lead-free part numbers to be issued," Purchasing, vol. xx no. xx, pp. xx-xx, July 7, 2005.

Carbone, James, "NEDA calls for new Pb-free part numbers," Purchasing, vol. xx no. xx, pp. xx-xx, July 23, 2004.

Carbone, James, "Poll finds support for a U.S RoHS law," Purchasing, vol. xx no. xx, pp. xx-xx, Oct. 5, 2006.

Carbone, James, "Prepare for China RoHS," Purchasing, vol. xx no. xx, pp. xx-xx, Dec. 7, 2006.

Carbone, James, "Proposal presumes RoHS compliance," Purchasing, vol. xx no. xx, pp. xx-xx, Oct. 27, 2005.

Carbone, James, "RoHS changes the parts you buy," Purchasing, vol. 134 no. 19, pp. xx-xx, Nov. 17, 2005.

Carbone, James, "RoHS cost: $32 billion and counting," Purchasing, vol. xx no. 6, pp. xx-xx, June 12, 2008.

Carbone, James, "RoHS enforcement rules still unclear," Purchasing, vol. 135 no. 9, pp. xx-xx, June 15, 2006.

Carbone, James, "RoHS has been costly to distributors," Purchasing, vol. xx no. xx, pp. xx-xx, June 1, 2006.

Carbone, James, "RoHS impacts distribution," Purchasing, vol. xx no. xx, pp. xx-xx, Nov. 3, 2005.

Carbone, James, "RoHS means more electronic component obsolescence," Purchasing , vol. 135 no. 18, pp. xx-xx, Dec. 14, 2006.

Carbone, James, "RoHS: The tip of the environmental iceberg," Purchasing, vol. 135 no. 9, pp. xx-xx, June 15, 2006.

Carbone, James, "RoHS to create opportunities for distributors," Purchasing, vol. xx no. xx, pp. xx-xx, Apr. 6, 2006.

Carbone, James, "Supply of RoHS parts tightens," Purchasing, vol. 135 no. 10, pp. xx-xx, July 13, 2006.

Carbone, James, "The clock is ticking," Purchasing, vol. 134 no. 11, pp. 28-32, June 16, 2005.

Carbone, James, "Watch out for bogus RoHS parts," Purchasing, vol. 135 no. 8, pp. xx-xx, May 18, 2006.

Carbone, James, "What's Hot," Purchasing, vol. 133 no. 19, pp. xx-xx, Nov. 18, 2004.

Carbone, James, "What's Hot," Purchasing, vol. 134 no. 13, pp. xx-xx, Aug. 11, 2005.

Carbone, Jim, "Confusion over RoHS," Purchasing.com, May 26, 2005.

Carbone, Jim, "Get the lead out!," Purchasing, vol. 132 no. 16, pp. xx, Oct. 23, 2003.

Cardetta, V. L., Mancini, A. M., Manfredotti, C., and Rizzo, A., "Growth and Habit of GaSe Crystals Obtained from Vapour by Various Methods," Journal of Crystal Growth, vol. 17, pp. 155-161, Dec. 1972.

Cargnello, Matteo, Agarwal, Rahul, Klein, Dahlia R., Diroll, Benjamin T., Agarwal, Ritesh, and Murray, Christopher B., "Uniform Bimetallic Nanocrystals by High-Temperature Seed-Mediated Colloidal Synthesis and Their Catalytic Properties for Semiconducting Nanowire Growth," Chemistry of Materials, vol. 27 no. 16, pp. 5833-5838, Aug. 25, 2015.

Carlin Jr., James F., "Antimony," Minerals Yearbook: Volume I. -- Metals and Minerals , 2003.

Carlin Jr., James F., "Tin," Minerals Yearbook: Volume I. -- Metals and Minerals, 2003.

Carlson, Caron, "What Went Wrong?: High Costs Don't Support Benefits," Wireless Week, vol. xx no. xx, pp. xx-xx, May 25, 1998.

Carlton, Gary N., "Hexavalent Chromium Exposures During Full-Aircraft Corrosion Control," AIHA Journal, vol. 64 no. 5, pp. 668-672, Sept.-Oct. 2003.

Carney, F., Carney, G., Heckman, J., Nagarkar, M., Schaper, J., Seddon, M., and Woolsey, E., "Development and Characterization of Tin-Capped Gold Bumps in TAB," SUR/FIN '94 Technical Conference Proceedings, Indianapolis, IN, June 20-23, 1994, pp. 91-96.

Carpenter, Burton, Koschmieder, Thomas, Wilkerson, Brett, Hauck, Torsten, and Arthur, John, "Design and Material Parameter Effects on BGA Solder Joint Reliability for Automotive Applications," Conference Proceedings of SMTA International , Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 99-111.

Carpenter, Burton, and Koschmieder, Thomas, "Solder-Joint Reliability of 0.8mm BGA Packages for Automotive Applications," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 28-39.

Carpenter, Burton, Benson, Mollie, Sakib, A. R. Nazmus, Mawer, Andrew, Galles, Paul, and Fahim, Abdullah, "Solder-Joint Reliability of a 0.65mm Pitch Molded Array Package for Automotive Applications," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 270-279.

Carpenter, Burton, Mawer, Andrew, and Yeung, Betty, "Solder-Joint Reliability of a Large Body Molded Array Package," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 84-93.

Carpenter, Burton, Mawer, Andrew, Benson, Mollie, Arthur, John, and Yeung, Betty, "Solder-Joint Reliability of BGA Packages in Automotive Applications," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 142-148.

Carpenter, E. O. S., and Farr, J. P. G., "Characterization of Zinc-Cobalt Electrodeposits," Transactions of the Institute of Metal Finishing, vol. 76 no. 4, pp. 135-143, July 1998.

Carpenter, H. C. H., and Elam, Constance F., "Crystal Growth and Recrystallization in Metals," Journal of the Institute of Metals, vol. 29 no. 2, pp. 83-131, 1920.

Carpenter, Neil, "Conductive Surface Mount Adhesives as a Solder Alternative," Lead-Free Soldering Seminar 2001, High Wycombe, United Kingdom, Feb. 15, 2001.

Carrabine, Laura, "Update: The RoHS Compliance Debate," Design World, vol. 4 no. 11, pp. 15, Nov. 2009.

Carrasco, Rigo A., Zamarripa, Cesy M., Zollner, Stefan, Menendez, Jose, Chastang, Stephanie A., Duan, Jinsong, Grzybowski, Gordon J., Claflin, Bruce B., and Kiefer, Arnold M., "The direct bandgap of gray a-tin investigated by infrared ellipsometry," Applied Physics Letters, vol. 113 no. 23, pp. 232104-1-232104-5, Dec. 3, 2018.

Carrell, John, Zhang, Hong-Chao, Li, Hua, and Fan, Chengcheng, "End-of-Life Analysis of Analog CATV Converters," IEEE International Symposium on Sustainable Systems and Technology, Phoenix, AZ, May 18-20, 2009, pp. xx-xx.

Carreno-Gallardo, C., Estrada-Guel, I., Neri-Flores, M., and Martinez-Sanchez, R., "Lead-Free Solder System Bi5-Ag3-Cu0.5-Sn Prepared by Mechanical Alloying," Journal of Metastable and Nanocrystalline Materials, vol. 24-25, pp. 451-454, 2005.

Carrier, Patrick, "Designing a PCB for power integrity," EDA Tech Forum, vol. 7 no. 5, pp. 48-50, Sep. 2010.

Carroll, Doug, Bates, Chris, Zampino, Marc, and Jones, Kinzy, "A Novel Technique for Modeling Solder Joint Failure During System Level Drop Simulations," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 2, 2006, pp. 861-868.

Carroll, George, "Pb-Free Parts MIA," Circuits Assembly, vol. 16 no. 6, pp. 6, June 2005.

Carsac, Claude, Uner, Jason, and Theriault, Martin, "Inert Soldering With Lead-Free Alloys: Review And Evaluation," IPC SMEMA Council APEX 2001, San Diego, CA, Jan. 14-18, 2001, pp. SM2-3-1 to SM2-3-10.

Carson, Flynn, and Jeong, Tae Sung, "Drop Test Performance of Lead Free FBGA Packages," Second International Wafer-Level Packaging Congress, San Jose, CA, Nov. 3-4, 2005, pp. 116-121.

Carson, George, and Todd, Michael, "Component Materials Facing New Challenges: Eliminate Lead and Improve Performance," Chip Scale Review, vol. xx no. xx, pp. xx-xx, June 2005.

Carson, George, and Todd, Michael, "Lead astray," European Semiconductor, vol. 27 no. 3, pp. 15-16, Mar. 2005.

Carter, V. E., and Christie, I. R. A., "The Outdoor Exposure Performance of Chromium Electrodeposited from a Trivalent Electrolyte," Transactions of the Institute of Metal Finishing , vol. 51 no. 2, pp. 41-46, 1973.

Carter-Berrios, Mary, "Race to the RoHS deadline," Green SupplyLine, Mar. 24, 2006.

Caruana, Claudia M., "'It Isn't Easy Being Green'," Metal Finishing, vol. 104 no. 5, pp. 44-46, May 2006.

Carvajal, Joan J., "Tailored nanowire with embedded quantum dot yields bright single-photon source," MRS Bulletin, vol. 37 no. 5, pp. 462-463, May 2012.

Casali, Dick, "Fracture Toughness of Various Printed Circuit Board Surface Finishes Soldered with Lead Free Solder," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 560-567.

Casatelli, Linda, "Environmental Regulations: A Double-Edged Sword for Metal Finishers," Metal Finishing, vol. 106 no. 4, pp. 36-40, Apr. 2008.

Caselli, Derek, and Ning, Cun-Zheng, "CdSe Nanowire Solar Cells," 2013 IEEE 39th Photovoltaic Specialists Conference, Tampa, FL, June 16-21, 2013, pp. 268-270.

Casey, Paul, and Pecht, Michael, "Assessing lead-free intellectual property," Circuit World, vol. 30 no. 2, pp. 46-51, 2004.

Casey, Paul, and Pecht, Michael, "Intellectual Property Challenges for Lead-Free Electronics," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 23-24, 2003, pp. 7-37.

Casey, Paul, and Pecht, Michael, "The Technical, Social, and Legal Outlook for Lead-Free Solders," Proceedings of the 4th International Symposium on Electronic Materials and Packaging, Kaohsiung, Taiwan, Dec. 4-6, 2002, pp. 15-24.

Cassell, S. O. Skip, "Lead Solders vs. Lead Free Solders," Proceedings of The International Technical Conference of SUR/FIN, Baltimore, MD, June 26-29, 1995, pp. 549-552.

Cassette, Dennis J., "Lead-Free Solder," Department of the Air Force Airworthiness Advisory AA-05-01, May 9, 2005.

Castaneda, S. I., Rueda, F., Diaz, R., Ripalda, J. M., and Montero, I., "Whiskers in indium tin oxide films obtained by electron beam evaporation," Journal of Applied Physics, vol. 83 no. 4, pp. 1995-2002, Feb. 15, 1998.

Casteletti, L. C., Nucci, Rafael, Neto, A. Lombardi, Arnoni, E. A. B., and Totten, G. E., "Hard chromium substitution using HVOF coatings," International Heat Treatment and Surface Engineering, vol. 2 no. 1, pp. 27-31, Mar. 2008. https://doi.org/10.1179/174951508X309774

Castell, Alice, Clift, Roland, and France, Chris, "Extended Producer Responsibility Policy in the European Union: A Horse or a Camel?," Journal of Industrial Ecology, vol. 8 no. 1/2, pp. 4-7, Winter 2004.

Castellanos, Alejandro, Feng, Zhen (Jane), Geiger, David, and Kurwa, Murad, "Head-In-Pillow X-Ray Inspection," Surface Mount Technology (SMT) , vol. 29 no. 5, pp. 16,18-22,24-26,28-29, May 2014.

Castello, Todd, Rooney, Dan, and Shangguan, Dongkai, "Failure Analysis Techniques for Lead Free Solder Joints," Proceedings of the 31st International Symposium for Testing and Failure Analysis, San Jose, CA, Nov. 6-10, 2005, pp. 295-301.

Castello, Todd, Rooney, Dan, and Shangguan Dongkai, "Failure analysis techniques for lead-free solder joints," Soldering & Surface Mount Technology, vol. 18 no. 4, pp. 21-27, 2006.

Castello, Todd, Geiger, Dave, Shangguan, Dongkai, and Sjoeberg, Jonas, "Flip Chip Assembly on PCB," Surface Mount Technology (SMT), vol. 19 no. 5, pp. xx-xx, May 2005.

Castorina, Stephanie , "All Eyes on California- What Will Green Chemistry Mean for the Rest of Us?," Circuitree, vol. 23 no. 7, pp. xx-xx, July 2010.

Castorina, Stephanie, "All Eyes on California- What Will Green Chemistry Mean for the Rest of Us?," Circuitree, vol. 23 no. 6, pp. 36, Summer 2010.

Castorina, Stephanie, "EU Lawmakers' Science-Based Decision Won't Stop Call for Removal of Halogens," Surface Mount Technology (SMT), vol. 26 no. 2, pp. 12-14, Feb. 2011.

Caswell, Greg, "Nanobond(R) Assembly - A Rapid, Room Temperature Soldering Process," Advancing Microelectronics, vol. 36 no. 6, pp. 6-10, Nov./Dec. 2009.

Caswell, Greg, "Pb-Free Manufacturing from a Tier III EMS Perspective," Circuits Assembly, vol. 18 no. 11, pp. 32, 34-35, Nov. 2007.

Catelani, Marcantonio, Scarano, Valeria L., Singuaroli, Roberto, Palchetti, Paolo, and Bertocci, Francesco, "Experimental Performance Analysis Of New Ag Conductive Glues For Electronic Applications," Conference Record - IEEE Instrumentation and Measurement Technology Conference, Victoria, British Columbia, Canada, May 12-15, 2008, pp. 270-273.

Catelani, Marcantonio, and Scarano, Valeria L., "Measurement Method for Failure Prognosis in Lead-Free Interconnections," 2012 IEEE International Instrumentation and Measurement Technology Conference, Graz, Austria, May 13-16, 2012, pp. 483-487.

Catelani, Marcantonio, and Scarano, Valeria L., "Medical Ultrasound Transducers with SAC Soldering Technology: A New Accelerated Life Model," 2011 IEEE International Workshop on Medical Measurements and Applications Proceedings, Bari, Italy, May 30-31, 2011, pp. 451-455.

Catelani, Marcantonio, Scarano, Valeria L., Bertocci, Francesco, Singuaroli, Roberto, Gelli, Francesca, and Spicci, Lorenzo, "New Soldering Technology for Transducers: Characterization of a Medical Ultrasound Phase Array Probe," IEEE International Workshop on Medical Measurements and Applications, Cetraro, Italy, May 29-30, 2009, pp. 183-186.

Catelani, Marcantonio, Scarano, Valeria L., Bertocci, Francesco, and Berni, Rossella, "Optimization of the Soldering Process With ECAs in Electronic Equipment: Characterization Measurement and Experimental Design," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 10, pp. 1616-1626, Oct. 2011.

Catelani, Marcantonio, Scarano, Valeria L., Bertocci, Francesco, Singuaroli, Roberto, Palchetti, Paolo, and Grandoni, Andrea, "Thermal Stress on Silver Conductive Adhesive Solder Joints: Performance Evaluation of Medical Ultrasound Array Transducer," IEEE Instrumentation and Measurement Technology Conference, Singapore, May 5-7, 2009, pp. 468-471.

Catelani, Marcantonio, Scarano, Valeria L., Bertocci, Francesco, and Singuaroli, Roberto, "Vibration Tests on Prototypes of Ultrasound Array Transducer: Evaluation of Soldering Electrical Performances," 2010 IEEE Instrumentation and Measurement Technology Conference, Austin, TX, May 3-6, 2010, pp. 432-436.

Cathrall, Graeme, "RoHS: Co-ordinating the supply chain," Electronics Weekly, Apr. 12, 2005.

Cato, Lisa, and Klingenberg, Melissa, "Improving Aluminum Ion Vapor Deposition," 2002 AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 28-30, 2002, pp. xx-xx.

Cato, Lisa, and Klingenberg, Melissa, "Ion Beam and Plasma Based Alternatives to Chrome Plating of Gas Turbine Engine Parts," 22nd AESF/EPA Conference for Environmental Excellence , Orlando, FL, Jan. 29-Feb. 1, 2001, pp. xx-xx.

Cato, Lisa, and Klingenberg, Melissa, "Ion Beam and Plasma Based Alternatives to Chrome Plating of Gas Turbine Engine Parts," 2002 AESF/EPA Conference for Environmental Excellence , Orlando, FL, Jan. 28-30, 2002, pp. xx-xx.

Cattaneo, L., Franz, S., Albertini, F., Ranzieri, P., Vicenzo, A., Bestetti, M., and Cavallotti, P. L., "Electrodeposition of hexagonal Co nanowires with large magnetocrystalline anisotropy," Electrochimica Acta, vol. 85, pp. 57-65, Dec. 15, 2012.

Cavallotti, P. L., "ACD Co-P as Interlayer for Soldering in Microelectronics."

Cavallotti, P. L., Lombardi, L., Magagnin, L., and Sirtori, V., "ACD Co-P for Lead-free Soldering in Microelectronics," 2004 Joint International Meeting of the Electrochemical Society, Honolulu, Hawaii, Oct. 3-8, 2004.

Cavallotti, P. L., Lombardi, L., Magagnin, L,, and Sirtori, V., "ACD Co-P Interlayers in Soldering with Tin Alloys for Microelectronics," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 386-393.

Cavallotti, P. L., Bestetti, M., Magagnin, L., Nobili, L., and Vicenzo, A., "Electrodeposition of Intermetallics of Ag, Cu and Au with Sn," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Cavallotti, P. L., Nobili, L., Zangari, G., and Sirtori, V., "Tin and Bismuth Substitutes for Electrodeposited Lead," SUR/FIN '94 Technical Conference Proceedings, Indianapolis, IN, June 20-23, 1994, pp. 499-508.

Cavasin, Daniel, "An Investigation of Reliability and Solder Joint Microstructure Evolution of Select Pb-Free FCBGA Pad Finish and Solder Ball Alloy Combinations," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1798-1805.

Cavasin, Daniel, Anani, Majed, Rittman, Gary, and Casto, Jim, "Board Level Characterization of Pb-free Sn-3.5Ag Versus Eutectic Pb-Sn BGA Solder Joint Reliability," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 129-135.

Cavasin, Daniel, Brice-Heames, Ken, and Arab, Anwar, "Improvements in the Reliability and Manufacturability of an Integrated RF Power Amplifier Module System-In-Package, via Implementation of Conductive Epoxy Adhesive for Selected SMT Components," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1404-1407.

Cavasin, Daniel, and Zheng, Robert, "Microstructural Evolution Leading to Brittle Fracture in the Pb-Free Sn-4.0Ag-0.5Cu Ball Grid Array Solder Sphere Alloy," TMS Letters, vol. 1 no. 8, pp. 163-164. 2004.

Cavasin, Daniel, "The Impact of Interfacial Void Formation on Pb-free Sn-4.0Ag-0.5Cu BGA Solder Joint Integrity," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1191-1195.

Cavasin, Daniel, "Yellow Solder: An Assessment of the Quality and Reliability of Pb-free Lead Finishes and Solder Ball Alloys Exhibiting Excessive Sn Oxidation" Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1060-1063.

Cavero, D., Stewart, K., and Morsi, K., "Novel Ballistic Processing of Sn-0.7Cu Thick Films," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 48 no. 1, pp. 46-50, Jan. 2017.

Cecen, V., Boudenne, A., Ibos, L., Novak, I., Nogellova, Z., Prokes, J., and Krupa, I., "Electrical, mechanical and adhesive properties of ethylene-vinylacetate copolymer (EVA) filled with wollastonite fibers coated by silver," European Polymer Journal, vol. 44 no. 11, pp. 3827-3834, Nov. 2008.

Cech, R. E., "The Nucleation of Nickel Whiskers," Acta Metallurgica, vol. 7 no. 12, pp. 787-792, Dec. 1959.

Cech. R. E., "The Role of Halide-Cycle Reactions in the Growth of Nickel Whiskers," Acta Metallurgica, vol. 9 no. 5, pp. 459-463, May 1961.

Cederberg, J. G., Waldrip, K. E., and Peake, G. M., "Pendeoepitaxy of GaAs and In0.15Ga0.85As using laterally oxidized GaAs/Al0.96Ga0.04As templates," Journal of Crystal Growth, vol. 272 no. 1-4, pp. 588-595, Dec. 10, 2004.

Celik, Emrah, Guven, Ibrahim, and Madenci, Erdogan, "Mechanical Characterization of Nickel Nanowires by using a Customized Atomic Microscope in Scanning Electron Microscope," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1999-2006.

Celikin, M., Maalekian, M., and Pekguleryuz, M., "Effect of Bi Additions on the Creep Behaviour of SAC Solder Alloys," Journal of Electronic Materials, vol. 47 no. 10, pp. 5842-5849, Oct. 2018.

Celikin, M., Maalekian, M., and Pekguleryuz, M., "Effect of Sb Additions on the Creep Behaviour of Bi Containing SAC Alloys," Journal of Electronic Materials, vol. 48 no. 9, pp. 5562-5569, Sept. 2019.

Cennamo, Greg, "Surface Mount Reflow Profile Impacts on Reliability," 2018 Annual Reliability and Maintainability Symposium, Reno, NV, Jan. 22-25, 2018, pp. xx-xx.

Ceric, H., de Orio, R. L., and Selberherr, S., "Analysis of Solder Bump Electromigration Reliability," 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Suzhou, China, July 15-19, 2013, pp. 705-708.

Ceric, H., and Selberherr, S., "Compact Model for Solder Bump Electromigration Failure," 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, Grenoble, France, May 18-21, 2015, pp. 159-162.

Ceric, H., and Selberherr, S., "Electromigration Induced Failure of Solder Bumps and the Role of IMC," 2014 IEEE InternationalInterconnect Technology Conference/ Advanced Metallization Conference, San Jose, CA, May 20-23, 2014, pp. 265-267.

Ceric, Hajdin, and Selberherr, Siegfried, "Electromigration Reliability of Solder Bumps," 2014 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, Singapore, June 30-July 4, 2014, pp. 336-339.

Cermelli, Paolo, and Gurtin, Morton E., "On the characterization of geometrically necessary dislocations in finite plasticity," Journal of the Mechanics and Physics of Solids, vol. 49 no. 7, pp. 1539-1568, July 2001.

Cervi, Bob, "made for life," Engineering and Technology, vol. 3 no. 12, pp. 66-67, July 5-18, 2008.

Chacon, Mercedes, Manriquez, Jorge A., Mendoza, Jose L., and Toleno, Brian, "Isothermal Aging of Lead-free Joints," Surface Mount Technology (SMT), vol. 21 no. 2, pp. 5153, Feb. 2007.

Chada, S., Laub, W., Fournelle, R. A., and Shangguan, D., "An Improved Numerical Method for Predicting Intermetallic Layer Thickness Developed during the Formation of Solder Joints on Cu Substrates," Journal of Electronic Materials, vol. 28 no. 11, pp. 1194-1202, Nov. 1999.

Chada, S., Fournelle, R. A., Laub, W., and Shangguan, D., "Copper Substrate Dissolution in Eutectic Sn-Ag Solder and Its Effect on Microstructure," Journal of Electronic Materials, vol. 29 no. 10, pp. 1214-1221, Oct. 2000.

Chada, S, Herrmann, A, Laub, W, Fournelle, R, Shangguan, D, and Achari, A, "Microstructural Investigation of Sn-Ag and Sn-Ag Solder Joints," Soldering & Surface Mount Technology, vol. 9 no. 2, pp. 9-13, 21, 1997.

Chada, S., Laub, W., Fournelle, R. A., and Shangguan, D., "Microstructural Evolution of Sn-Ag Solder Joints Resulting from Substrate Copper Dissolution," 1999 SMTA International Conference Proceedings , San Jose, CA, Sept. 12-16, 1999, pp. 412-418.

Chada, Srinivas, Currie, Mark, Toleno, Brian, Steen, Hector, and Boyle, Richard, "Developing a Pb-Free Solder Through Micro-Alloying," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 724-730.

Chada, Srinivas, and Bradley III, Edwin, "Investigation of Immersion Silver PCB Finishes for Portable Product Applications," 2001 SMTA International Conference Proceedings, Chicago, IL, Sept. 30-Oct. 4, 2001, pp. xx-xx.

Chada, Srinivas, "Lead-Free Implementation: Reliability, Alloy Development, and New Technology," JOM, vol. 58 no. 6, pp. 56, June 2006.

Chada, Srinivas, "Lead-free Solders: Reliability, an Ongoing Saga," JOM, vol. 63 no. 10, pp. 56, Oct. 2011.

Chada, Srinivas, "Lead-Free Solders: Reliability and Other Issues a Year after the Legislation," JOM, vol. 59 no. 7, pp. 19, July 2007.

Chada, Srinivas, "Lead-free Solders: Still Learning, Adapting, and Working Out the Kinks," JOM, vol. 62 no. 7, pp. 15, July 2010.

Chada, Srinivas, Herrmann, Ann, Laub, Werner, Fournelle, Raymond, Shangguan, Dongkai, and Achari, Achyuta, "Microstructural Investigation of Sn-Ag and Sn-Pb-Ag Solder Joints," Proceedings of the Technical Program NEPCON West '96, Volume 1, Anaheim, CA, Feb. 25-29, 1996, pp. 195-205.

Chada, Srinivas, "Topics in Lead-Free Solders: Interfacial and Sn Whisker Growth," JOM , vol. 64 no. 10, pp. 1174-1175, Oct. 2012.

Chada, Srinivas, "Topics in Lead-Free Solders: Restriction of Hazardous Substances Recast (RoHS2)," JOM, vol. 65 no. 10, pp. 1348-1349, Oct. 2013.

Chae, Seung-Hyun, Im, Jay, Uehling, Trent, and Ho, Paul S., "Effects of UBM Thickness, Contact Trace Structure and Solder Joint Scaling on Electromigration Reliability of Pb-Free Solder Joints," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 354-359.

Chae, Seung-Hyun, Zhang, Xuefeng, Chao, Huang-Lin, Lu, Kuan-Hsun, Ho, Paul S., Ding, Min, Su, Peng, Uehling, Trent, and Ramanathan, Lakshmi N., "Electromigration Lifetime Statistics for Pb-Free Solder Joints with Cu and Ni UBM in Plastic Flip-Chip Packages," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 650-656.

Chae, Seung-Hyun, Zhang, Xuefeng, Lu, Kuan-Hsun, Chao, Huang-Lin, Ho, Paul S., Ding, Min, Su. Peng, Uehling, Trent, and Ramanathan, Lakshmi, "Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 247-258, Mar. 2007.

Chae, Seung-Hyun, Chao, Brook, Zhang, Xuefeng, Im, Jay, and Ho, Paul S., "Investigation of Intermetallic Compound Growth Enhanced by Electromigration in Pb-Free Solder Joints," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1442-1449.

Chai, Fei, Osterman, Michael, and Pecht, Michael, "Reliability of Gull-Wing and Leadless Packages Subjected to Temperature Cycling After Rework," IEEE Transactions on Device and Materials Reliability, vol. 12 no. 2, pp. 510-519, June 2012.

Chai, Fei, Osterman, Michael, and Pecht, Michael, "Strain-Range-Based Solder Life Predictions Under Temperature Cycling With Varying Amplitude and Mean," IEEE Transactions on Device and Materials Reliability, vol. 14 no. 1, pp. 351-357, Mar. 2014.

Chai, Jingrui, Jiang, Xiping, Gao, Xudong, Wang, Zhengwen, Yin, Peng, Wang, Qian, and Dong, Gang, "A Comprehensive Failure Analysis and A Study on Reliability for BGA Solder Joints Crack of DDR Modules," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Chai, T. C., Yu, D. Q., Lau, John, Zhu, W. H., and Zhang, X. R., "Angled High Strain Rate Shear Testing for SnAgCu Solder Balls," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 623-628.

Chai, W. S., Gupta, M., Tay, A. A. O., and Caers, J. F. J., "Effect of Gold Layer Thickness on the Characteristics of Flip-chip Interconnects," Proceedings of 4th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2002, pp. 150-155.

Chaillot, A., Tegehall, P.-E., Venet, N., and Hokka, J., "ENEPIG finish: An Alternative Solution for Space Printed Circuit Boards," 5th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Noordwijk, The Netherlands, May 2014, pp. xx-xx.

Chaillot, A., Venet, N., Tegehall, P-E., Hokka, J., and Lortal, J-L., "ENEPIG finish: An Alternative Solution for Space Printed Circuit Boards (PCB)," 2013 European Microelectronics Packaging Conference, Grenoble, France, Sept. 9-12, 2013, pp. xx-xx.

Chaillot, A., Grieu, M., Munier, C., Lombaert-Valot, I., Bousquet, S., Chastanet, C., Canaud, J-P., Dumonteil, R., Villard, S., Raynal, P., and Maron, D., "Fatigue life prediction models developed for Green Electronics in Aeronautical and Military Communication Systems (GEAMCOS)," 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, Delft, Netherlands, Apr. 26-29, 2009, pp. xx-xx.

Chaillot, A., Massiot, G., Munier, C., Lombaert-Valot, I., Bousquet, S., Chastanet, C., Plouseau, D., Munier, E., Maron, D., Raynal, P., Villard, S., and Dumonteil, R., "Finite Element Modelling (FEM) of Green Electronics in Aeronautical and Military Communication Systems (GEAMCOS)," Proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, London, England, Apr. 15-18, 2007, pp. xx-xx.

Chakraborty, Aritra, and Eisenlohr, Philip, "A full-field crystal plasticity study on how texture and grain structure influences hydrostatic stress in thermally strained b-Sn films," Journal of Applied Physics, vol. 124 no. 2, pp. 025302-1-025302-8, July 14, 2018.

Chakraborty, Aritra, and Eisenlohr, Philip, "Chemo-thermo-mechanically Coupled Crystal Plasticity Simulation of Stress Evolution in Thermally Strained b-Sn Films," Journal of Electronic Materials, vol. 48 no. 1, pp. 85-91, Jan. 2019.

Chakravarty, A. N., Sharma, Lokesh Kurma, and Gupta, Sameer, "Problem of dark wire - a new approach," Wire Journal International , vol. 35 no. 6, pp. 82-85, June 2002.

Chakravorty, Manotosh, and Raychaudhuri, A. K., "Size induced large upward shift of magnetic transition temperatures in nanowires of rare-earth transition metal alloy GdxCo1-x(x=0.4)," Journal of Alloys and Compounds, vol. 764, pp. 155-161, Oct. 5, 2018.

Chalco, Pedro, and Blackshear, Edmund, "Reliability Issues of BGA Packages Attached with Lead-Free Solder," Advances in Electronic Packaging 2001, Volume 1, Kauai, Hawaii, July 8-13, 2001, pp. 221-228.

Chalco, Pedro, "Solder Fatigue Reliability Issues in Lead-Free BGA Packages," 2002 Pan Pacific Symposium Conference Proceedings, Maui, Hawaii, Feb. 5-7, 2002, pp. xx-xx.

Chaloupka, Andrew C., Sandborn, Peter A., and Konoza, Anthony, "Thermal Cycling Ramifications of Lead-Free Solder on the Electronic Assembly Repair Process," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 6, pp. 964-974, June 2011.

Chaminade, C., Fogarassy, E., and Boisselier, D., "Diode laser soldering using a lead-free filler material for electronic packaging structures," Applied Surface Science, vol. 252 no. 13, pp. 4406-4410, Apr. 30, 2006.

Champaign, Robert F., Roepsch, Jodi A., and Downey, Marlin R., "Case Study: The Effect of Severe Black Pad Defect on Solder Bonds on Ball Grid Array Components," 2002 Advanced Technology Symposium Conference Proceedings, 2002, pp. xx-xx.

Champaign, Robert F., and Ogden, Robert R., "Microscopy Study of Tin Whiskers," Journal of Failure Analysis and Prevention, vol. 10 no. 6, pp. 444-449, Dec. 2010.

Champaign, Robert, "Sn Whiskers?," McKinney Failure Analysis Lab.

Chan, Alex, Brown, Paul, Bruno, Lars, Knoph, Anne-Kathrine, Sack, Thilo, Geiger, David, Mendez, David, Abtew, Mulugeta, Muntele, Iulia, and Meilunas, Michael, "Collaboration Between OEM and EMS to Combat Head on Pillowing Defects: Part 1 - AXI Capability for HoP Detection," International Conference on Soldering & Reliability 2013 Proceedings, Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.

Chan, Alex, Brown, Paul, Bruno, Lars, Knoph, Anne-Kathrine, Sack, Thilo, Geiger, David, Mendez, David, Abtew, Mulugeta, Muntele, Iulia, and Meilunas, Michael, "Collaboration Between OEM and EMS to Combat Head On Pillowing Defects: Part 1 - AXI Capability for HOP Detection," SMTAnews & Journal of Surface Mount Technology, vol. 26 no. 3, pp. 15-22, July-Sept. 2013.

Chan, Alex, Brown, Paul, Coyle, Richard, Bruno, Lars, Knoph, Anne-Kathrine, Sack, Thilo, Geiger, David, Mendez, David, Kulterman, Ron, Abtew, Mulugeta, Muntele, Iulia, and VanDreel, Kirk, "Collaboration Between OEM and EMS to Combat Head on Pillowing Defects: Part 2 - Warpage Acceptance Proposal," International Conference on Soldering & Reliability 2013 Proceedings, Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.

Chan, Alex, Brown, Paul, Coyle, Richard, Bruno, Lars, Knoph, Anne-Kathrine, Sack, Thilo, Geiger, David, Mendez, David, Kulterman, Ron, Abtew, Mulugeta, Muntele, Iulia, and VanDreel, Kirk, "Collaboration Between OEM and EMS to Combat Head on Pillowing Defects: Part 2 - Warpage Acceptance Proposal," SMTA China East 2014 Proceedings , Shanghai, China, Apr. 23-25, 2014, pp. xx-xx.

Chan, Alex, Brown, Paul, Coyle, Richard, Bruno, Lars, Knoph, Anne-Kathrine, Sack, Thilo, Geiger, David, Mendez, David, Kulterman, Ron, Abtew, Mulugeta, Muntele, Iulia, and Vandreel, Kirk, "Collaboration Between OEM and EMS to Combat Head On Pillowing Defects: Part 2 - Warpage Acceptance Proposal," SMTAnews & Journal of Surface Mount Technology, vol. 26 no. 3, pp. 23-30, July-Sept. 2013.

Chan, Alex, Brown, Paul, Coyle, Richard, Bruno, Lars, Knoph, Anne-Kathrine, Sack, Thilo, Geiger, David, Mendez, David, Kulterman, Ron, Abtew, Mulugeta, Muntele, Iulia, and Vandreel, Kirk, "Collaboration between OEM and EMS to Combat Head-on-Pillowing Defects, Part 2: Warpage Acceptance Proposal," Surface Mount Technology (SMT), pp. 38,40-42,44-46,48-53, Aug. 2015.

Chan, Alex, Khan, Aman, and Kinyanjui, Robert, "Second Level Solder Joint Reliability of Quad Flat No-Lead (QFN) Packages for Use in IPC Class-2 Assemblies," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 412-419.

Chan, Alex, Khan, Aman, and Kinyanjui, R., "Solder Joint Reliability in High Reliability Application for QFN Type Packages ," International Conference on Soldering and Reliability , Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Chan, Alex, "The Path of Taking High Reliability Products to Lead-Free," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 130-140.

Chan, C. F., Lahiri, S. K., Yuan, P., and How, J. B. H., "An Intermetallic Study of Solder Joints with Sn-Ag-Cu Lead-free Solder," Proceedings of 3rd Electronics Packaging Technology Conference, Singapore, Dec. 5-7, 2000, pp. 72-80.

Chan, C. M., Tong, K.,H., Leung, S.,L., Wong, P. S., Yee, K.,W., and Bayes, M. W., "Development of Novel Immersion Gold for Electroless Nickel Immersion Gold Process (ENIG) in PCB Applications," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Chan, C. M., Tong, K. H., and Kwok, R. W. M., "Intermetallic compound formation and solderability for immersion tin," Circuit World, vol. 32 no. 4, pp. 3-8, 2006.

Chan, D., Bhate, D., Subbarayan, G., Love, D., and Sullivan, R., "Effects of Dwell Time on the Fatigue Life of Sn3.8Ag0.7Cu and Sn3.0Ag0.5Cu Solder Joints During Simulated Power Cycling," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 227-234.

Chan, D., Subbarayan, G., and Nguyen, L., "Maximum-Entropy Principle for Modeling Damage and Fracture in Solder Joints," Journal of Electronic Materials, vol. 41 no. 2, pp. 398-411, Feb. 2012.

Chan, Dennis, Bhate, Dhruv, Subbarayan, Ganesh, and Nguyen, Luu, "Characterization of Crack Fronts in a WLCSP Package: Experiments and Models for Application of a Multiscale Fracture Theory," Proceedings of the ASME 2009 InterPack Conference, Volume 2, San Francisco, CA, July 19-23, 2009, pp. 199-205.

Chan, Dennis, Nie, Xu, Bhate, Dhruv, Subbarayan, Ganesh, Chen, Weinong Wayne, and Dutta, Indranath, "Constitutive Models for Intermediate- and High-Strain Rate Flow Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Solder Alloys," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 1, pp. 133-146, Jan. 2013.

Chan, Dennis, Nie, Xu, Bhate, Dhruv, Subbarayan, Ganesh, and Dutta, Indranath, "High Strain Rate Behavior of Sn3.8Ag0.7Cu Solder Alloys and its Influence on the Fracture Location Within Solder Joints," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 989-995.

Chan, Dennis, Bhate, Dhruv, Subbarayan, Ganesh, Zhao, Jeff, and Edwards, Darvin, "Predicting Crack Growth and Fatigue Lives of QFN Solder Joints using a Multiscale Fracture Model," Proceedings of the ASME 2009 InterPack Conference, Volume 2, San Francisco, CA, July 19-23, 2009, pp. 207-213.

Chan, Edward K. L., Gao, Bo, and Yuen, Matthew M. F., "Reliability Study of RFID Flip Chip Assembly by Isotropic Conductive Adhesive through Computer Simulation," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1030-1033.

Chan, Freddie, and Seng, Seet Keng, "Lead Free Solder Joints reliability and Process control," NEPCON Shanghai, Shanghai, China, Apr. 24-27. 2007, pp. xx-xx.

Chan, Janet K. Y., Xing, Guan Hua, Xu, Ying, Liang, Ying, Chen, Ling Xuan, Wu, Sheng Chun, Wong, Chris K. C., Leung, Clement K. M., and Wong, Ming H., "Body Loadings and Health Risk Assessment of Polychlorinated Dibenzo-p-dioxins and Dibenzofurans at an Intensive Electronic Waste Recycling Site in China," Environmental Science & Technology, vol. 41 no. 22, pp. 7668-7674, 2007.

Chan, K. C., Zhong, Z. W., and Ong, K. W., "Investigation of Cr/Cu/Cu/Ni Under Bump Metallization for Lead-free Applications," Proceedings of 4th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2002, pp. 270-275.

Chan, K. C., Chai, T. C., Wong, E. H., and Lim, T. B., "The Impact of Die Attach Material on Type II Popcorn Cracking," Proceedings of 2nd Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 1998, pp. 331-337.

Chan, K. K., Yeung, N. H., Chan, Y. C., Tam, S. C., and Lee, K. K., "Microwave Curing of Anisotropic Conductive Film: Effects of Principal Parameters on Curing Situation," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1701-1704.

Chan, K. L., Mariatti, M., Lockman, Z., and Sim, L. C., "Effect of ultrasonication medium on the properties of copper nanoparticle-filled epoxy composite for electrical conductive adhesive (ECA) application," Journal of Materials Science: Materials in Electronics , vol. 21 no. 8, pp. 772-778, Aug. 2010.

Chan, Kenneth, Kwok, Raymund W. M., and Bayes, Martin, "A new generation of electroless nickel immersion gold (ENIG) process for PWB surface finishes," KWPCA Journal, no. 13, pp. 1-7.

Chan, Mu-Hsuan, Liao, Yi-Chian, Lin, Chun-Tang, Chuang, Kuan-Weir, Huang, Huei-Nuan, Yeh, Chi-Tung, Tseng, Wen-Tsung, and Lai, Jeng-Yuan, "Thermal Cycling Effect on Intermetallic Formation with Various Surface Finish of Micro Bump Interconnect for 3D Package," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 2163-2167.

Chan, S. K., Cai, Y., Wang, N., and Sou, I. K., "Growth temperature dependence of MBE-grown ZnSe Nanowires," Journal of Crystal Growth, vol. 301-302, pp. 866-870, Apr. 2007.

Chan, Y. C., Uddin, M. A., Alam, M. O., and Chan, H. P., "Curing Kinetics of Anisotropic Conductive Adhesive Film," Journal of Electronic Materials, vol. 32 no. 3, pp. 131-136, Mar. 2003.

Chan, Y. C., Hung, K. C., Tang, C. W., and Wu, C. M. L., "Degradation Mechanisms of Anisotropic Conductive Adhesive Joints for Flip Chip on Flex Applications," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 141-146.

Chan, Y. C., and Luk, D. Y., "Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature," Microelectronics Reliability, vol. 42 no. 8, pp. 1185-1194, Aug. 2002.

Chan, Y. C., and Luk, D. Y., "Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure," Microelectronics Reliability, vol. 42 no. 8, pp. 1195-1204, Aug. 2002.

Chan, Y. C., Tan, S. C., Lui, Nelson S. M., and Tan, C. W., "Electrical Characterization of NCP- and NCF-Bonded Fine-Pitch Flip-Chip-on-Flexible Packages," IEEE Transactions on Advanced Packaging , vol. 30 no. 1, pp. 142-147, Feb. 2007.

Chan, Y. C., Chiu, M. Y., and Chuang, T. H., "Intermetallic compounds formed during the soldering reactions of eutectic Sn-9Zn with Cu and Ni substrates," Zeitschrift fur Metallkunde, vol. 93 no. 2, pp. 95-98, Feb. 2002.

Chan, Y. H., Arafat, M. M., and Haseeb, A. S. M. A., "Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn-3.8Ag-0.7Cu solder and copper substrate," Soldering & Surface Mount Technology, vol. 25 no. 2, pp. 91-98, 2013.

Chan, Y. S., Yang, C., and Lee, S. W. Ricky, "Assessment of Relative Thermal Fatigue Life of SAC Lead-Free and Tin-Lead Solders with Custom-Made BGA Assemblies Creating Various Stress Ranges," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 803-807.

Chan, Y. S., and Lee, S. W. Ricky, "Detailed Investigation on the Creep Damage Accumulation of Lead-free Solder Joints under Accelerated Temperature Cycling," 2010 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, Bordeaux, France, Apr. 26-28, 2010, pp. xx-xx.

Chan, Y. S., Song, F., Lo, C. C. Jeffery, Lee, Eddie, and Lee, S. W. Ricky, "Predictive Modeling and Experimental Validation of Lead-Free Solder Joint Reliability under Temperature Cycling," Prognostics and Health Management Conference, Macau, China, Jan. 12-14, 2010, pp. xx-xx.

Chan, Y. Sing, Song, F. B., Lee, S. W. Ricky, Yang, C. R., and Lo, Jeffery C. C., "Comparison of Fatigue Crack Initiation/Propagation and Daisy-chain Resistance in Lead-free Solder Joints under Temperature Cycling Test," Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, Volume 1, Portland, OR, July 6-8, 2011, pp. 579-583.

Chan, Y. Sing, and Lee, S. W. Ricky, "Considerations in Solution Stabilization for Thermal Fatigue Modeling of Lead-free Solder Joints," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1070-1078.

Chan, Y. Sing, Song, Fubin, and Lee, S. W. Ricky, "Investigation on Lead-free Solder Joint Reliability of Edge-bonded CBGA under Temperature Cycling," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 500-505.

Chan, Ya-ting, Chen, Yue-ting, and Chen, Chih-chi, "Solid State Interfacial Reactions in SAC305/Ni-Co Couples," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Chan, Yan Cheong, Li, Yi, Wu, Fengshun, and Chen, Zhong, "Failure mechanisms of solder interconnects under current stressing - a progress update from recent studies on novel interconnect materials," 2016 IEEE 18th Electronics Packaging Technology Conference, Singapore, Nov. 30-Dec. 3, 2016, pp. 417-426.

Chancerel, Perrine, Meskers, Christina E. M., Hageluken, Christian, and Rotte, Vera Susanne, "Assessment of Precious Metal Flows During Preprocessing of Waste Electrical and Electronic Equipment," Journal of Industrial Ecology, vol. 13 no. 5, pp. 791-810, Oct. 2009.

Chancerel, Perrine, and Rotter, Susanne, "Recycling-oriented characterization of small waste electrical and electronic equipment," Waste Management, vol. 29 no. 8, pp. 2336-2352, Aug. 2009.

Chancerel, Perrine, Bolland, Til, and Rotter, Vera Susanne, "Status of pre-processing of waste electrical and electronic equipment in Germany and its influence on the recovery of gold," Waste Management and Research, vol. 29 no. 3, pp. 309-317, Mar. 2011.

Chanchani, Rajen, Treece, Keith, and Dressendorfer, Paul, "mini Ball Grid Array (mBGA) Assembly on MCM-L Boards," 1997 Proceedings 47th Electronic Components & Technology Conference, San Jose, CA, May 18-21, 1997, pp. 656-663.

Chandrasekaran, Hari, Sumanasekara, Gamini U., and Sunkara, Mahendra K., "Rationalization of Nanowire Synthesis Using Low-Melting Point Metals," Journal of Physical Chemistry B, vol. 110 no. 37, pp. 18351-18357, Sept. 21, 2006.

Chang, C. C., Yang, S. C., Chen, Y. J., and Kao, C. R., "Consumption of Cu pad during multiple reflows if Ni-doped SnAgCu solder," Journal of Materials Research, vol. 102 no. 5, pp. 579-583, May 2011.

Chang, C. C., and Kao, C. R., "Dissolution and Interfacial Reaction between Cu and Sn-Ag-Cu Solders," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 54-57.

Chang, C. C., Lin, Y. W., Wang, Y. W., and Kao, C. R., "The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering," Journal of Alloys and Compounds, vol. xxx no. x, pp. xx-xx, xxxx.

Chang, C. Y., and Vook, R. W., "The effect of surface aluminum oxide films on thermally induced hillock formation," Thin solid Films, vol. 228 no. 1-2, pp. 205-209, May 15, 1993.

Chang, C. Y., and Vook, R. W., "Topography and microstructure of Al films formed under various deposition conditions," Journal of Vacuum Science & Technology A: Vacuum Surfaces, and Films, vol. 9 no. 3, pp. 559-562, May/June 1991.

Chang, C. W., Lee, Q. P., Ho, C. E., and Kao, C. R., "Cross-Interaction Between Au and Cu in Au/Sn/Cu Ternary Diffusion Couples," Journal of Electronic Materials, vol. 35 no. 2, pp. 366-371, Feb. 2006.

Chang, C. W., Ho, C. E., Yang, S. C., and Kao, C. R., "Kinetics of AuSn4 Migration in Lead-Free Solders," Journal of Electronic Materials, vol. 35 no. 11, pp. 1948-1954, Nov. 2006.

Chang, Chao-Cheng, "Influences of Strain Rate on Copper Nanowire in Tension," Key Engineering Materials, vol. 450, pp. 153-156, Nov. 2010.

Chang, Che-Wei, and Lin, Kwang-Lung, "Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn-25Sn-xTi," Journal of Materials Science: Materials in Electronics, vol. 29 no. 13, pp. 10962-10968, July 2018.

Chang, Che-Wei, and Lin, Kwang-Lung, "High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders," Journal of Electronic Materials, vol. 48 no. 1, pp. 135-141, Jan. 2019.

Chang, Che-Wei, and Lin, Kwang-Lung, "The microstructure and shear behavior of Zn-25Sn-xTi solder joints with Ni substrate," Journal of Materials Science: Materials in Electronics , vol. 30 no. 14, pp. 13090-13098, July 2019.

Chang, Cheng-an, Chen, Sinn-wen, Chiu, Chen-nan, and Huang, Yu-chih, "Primary Solidification Phases of the Sn-Rich Sn-Ag-Cu-Ni Quaternary System," Journal of Electronic Materials, vol. 34 no. 8, pp. 1135-1142, Aug. 2005.

Chang, Chien Wei, Yang, Su Chun, Tu, Chun-Te, and Kao, C. Robert, "Cross-Interaction between Ni and Cu across Sn Layers with Different Thickness," Journal of Electronic Materials, vol. 36 no. 11, pp. 1455-1461, Nov. 2007.

Chang, Chih-Chiang, and Kao, C. Robert, "Effects of Cu content on the Dissolution rate of Cu for Real Solder Joint during Reflow Soldering," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 44-47.

Chang, D. D., Fulton, J. A., Ling, H. C., Schmidt, M. B., Sinitski, R. E., and Wong, C. P., "Accelerated Life Test of Z-Axis Conductive Adhesives," 1993 Proceedings 43rd Electronic Components & Technology Conference, Orlando, FL, June 1-4, 1993, pp. 211-217.

Chang, D. D., Fulton, J. A., Ling, H. C., Schmidt, M. B., Sinitski, R. E., and Wong, C. P., "Accelerated Life Test of Z-Axis Conductive Adhesives," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 16 no. 8, pp. 836-842, Dec. 1993.

Chang, D. D., Crawford, P. A., Fulton, J. A., McBride, R., Schmidt, M. B., Sinitski, R. E., and Wong, C. P., "An Overview and Evaluation of Anisotropically Conductive Adhesive Films for Fine Pitch Electronic Assembly," 1993 Proceedings 43rd Electronic Components & Technology Conference, Orlando, FL, June 1-4, 1993, pp. 320-326.

Chang, D. D., Fulton, J. A., Lyons, A. M., and Nis, J. R., "Design Considerations for the Implementation of Anisotropic Conductive Adhesive Interconnection," Proceedings of the Technical Program NEPCON West '92, Volume III, Anaheim, CA, Feb. 23-27, 1992, pp. 1381-1389.

Chang, David D., Crawford, Patricia A., Fulton, Joe A., Mcbride, Richard, Schmidt, Maureen B., Sinitski, Raymond E., and Wong, C. P., "An Overview and Evaluation of Anisotropically Conductive Adhesive Films for Fine Pitch Electronic Assembly," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 16 no. 8, pp. 828-835, Dec. 1993.

Chang, David, Bai, Frank, Wang, Y. P., and Hsiao, C. S., "The Study of OSP as Reliable Surface Finish of BGA Substrate," 2004 6th International Conference on Electronic Packaging Technology, Singapore, Dec. 8-10, 2004, pp. 149-153.

Chang, E. K., Li, H., and Adams, S. M., "Reflow Atmosphere Effects on an Organic Solderability Preservative (OSP) Coating," Surface Mount International Proceedings of the Technical Program, San Jose, CA, Aug. 29-31, 1995, pp. 913-917.

Chang, Graver, Chen, Mark, Lee, Dem, Lee, Jeffrey, Ramakrishna, Gnyaneshwar, Oliver, Jennifer, and Chou, Tacio, "A New Detection Method for the Onset of PCB Pad Cratering," 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 22-25, 2013, pp. 96-100.

Chang, Graver, Chen, Cherie, and Lee, Jeffrey, "The Application of Pad Adhesion for the Validation of Halogen Free Pad Cratering Concern," 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 24-26, 2012, pp. 384-387.

Chang, Graver Chuan-Chun, Yu, Chi-Ko, Shao, Tina, Chen, Cherie, Lee, Jeffrey, Bansal, Anurag, and Liu, Kuo-Chuan, "The Investigation of Defect Screening Methodology using Mechanical Stress Test for Pb-free Module Product," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Chang, Graver Chuan-Chun, Yu, Chi-Ko, Shao, Tina, Chen, Cherie, and Lee, Jeffrey, "The Relationship of Life Prediction Between Cyclic Bending and Thermal Cycle Testing on CSP Package," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 1064-1068.

Chang, Harvey, Huang, Jay, Ku, J. L., Hsieh, Ander, and Lee, Andrew, "The Study of Mini-wave Soldering Process in Lead Free Assembly," NEPCON Shanghai 2007, Shanghai, China, Apr. 24-27, 2007, pp. xx-xx.

Chang, Hong, Chen, Hongtao, Li, Mingyu, Wang, Ling, and Fu, Yonggao, "Generation of Tin(II) Oxide Crystals on Lead-Free Solder Joints in Deionized Water," Journal of Electronic Materials, vol. 38 no. 10, pp. 2170-2178, Oct. 2009.

Chang, Hsiu-yu, Chen, Sinn-wen, Wong, David Shan-hill, and Hsu, Hsiu-Feng, "Determination of reactive wetting properties of Sn, Sn-Cu, Sn-Ag, and Sn-Pb alloys using a wetting balance technique," Journal of Materials Research , vol. 18 no. 6, pp. 1420-1428, June 2003.

Chang, Hung-Jen, Chang, Tao-Chih, Zhan, Chau-Jie, and Chou, Jung-Hua, "Evaluation of Various Surface Finished Halogen-Free Printed Circuit Board Assembly Under Four-Point Bending Test," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 11, pp. 1747-1754, Nov. 2011.

Chang, Hung-Jen, Zhan, Chau-Jie, Chang, Tao-Chih, and Chou, Jung-Hua, "Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test," Journal of Electronic Packaging, vol. 134 no. 1, pp. 011011-1-011011-6, Mar. 2012.

Chang, Hung-Jen, Chou, Jung-Hua, Chang, Tao-Chih, Zhan, Chau-Jie, Hon, Min-Hsiung, and Hsi, Chi-Shiung, "Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly," Journal of Electronic Packaging, vol. 133 no. 2, pp. 021004-1-021004-8, June 2011.

Chang, J., Wang, L., Dirk, J., and Xie, X., "Finite Element Modeling Predicts the Effects of Voids on Thermal Shock Reliability and Thermal Resistance of Power Device," Welding Journal , vol. 85 no. 3, pp. 63S-70S, Mar. 2006.

Chang, Jaewon, Seo, Sun-Kyoung, Cho, Moon Gi, Lee, Dong Nyung, Kang, Kyoo-Sik, and Lee, Hyuck Mo, "Effects of Be and Co addition on the growth of Sn whiskers and the properties of Sn-based Pb-free solders," Journal of Materials Research, vol. 27 no. 14, pp. 1877-1886, July 28, 2012.

Chang, Jaewon, Kang, Sung K., Lee, Jae-Ho, Kim, Keun-Soo, and Lee, Hyuck Mo, "Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions," Journal of Electronic Materials, vol. 43 no. 1, pp. 259-269, Jan. 2014.

Chang, Jaewon, Seo, Sun-Kyoung, and Lee, Hyuck Mo, "Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C," Journal of Electronic Materials, vol. 39 no. 12, pp. 2643-2652, Dec. 2010.

Chang, Jaewon, Kang, Sung K., Lee, Jae-Ho, Kim, Keun-Soo, and Lee, Hyuck Mo, "Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed Sn Films," Journal of Electronic Materials, vol. 44 no. 10, pp. 3486-3499, Oct. 2015.

Chang, Jeffrey, and Lee, Bing, "Sn Whisker Concern in IC Packaging for High Reliability Application," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1014-1018.

Chang, Jing-Shiun, and Yen, Yee-Wen, "Investigation of the Interfacial Reactions and Mechanical Strength in the Sn-Ag-Cu (SAC)/Cu-Be Alloy (Alloy 25) couple," 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Nagasaki, Japan, Apr. 17-21, 2018, pp. 97-101.

Chang, Jong-hyeon, Hong, Jangwon, and Pak, James Jungho, "Self-arrangement of solder balls by using the surface wettability difference," Materials Letters, vol. 64 no. 11, pp. 1283-1286, June 15, 2010.

Chang, Junling, Janz, Dirk, Kempe, W., and Xie, Xiaoming, "Degradation of Sn-Ag-Cu heat-sink attachment during thermal shock cycling," Soldering & Surface Mount Technology, vol. 17 no. 4, pp. 10-16, 2005.

Chang, Junling, Xia, Yanhhua, and Xie, Xiaoming, "On the Formation of Cu-Ni-Sn Tertiary Intermetallics in SMT Solder Joints," Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, China, June 30-July 3, 2004, pp. 66-69.

Chang, Kevin, Lai, Jen Yuan, Pu, Hanping, Wang, Yu-po, Hsiao, C. S., Chen, Andreas S., and Lo, Randy H. Y., "Flip Chip Quad Flat No-Lead (FC-QFN)," Second International Wafer-Level Packaging Congress, San Jose, CA, Nov. 3-4, 2005, pp. 65-70.

Chang, Kuo-Chin, Lee, Chang-Chun, Pu, Han-Ping, and Lii, Mirng-Ji, "Enhancing Component Level Reliability of Pb-Free Flip Chip Package of Cu/Low-K Devices Using FEM-Based Sensitivity Analysis," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 75-78.

Chang, Le, Zhou, Chang-Yu, Wen, Lei-Lei, Li, Jian, and He, Xiao-Hua, "Molecular dynamics study of strain rate effects on tensile behavior of single crystal titanium nanowire," Computational Materials Science, vol. 128, pp. 348-358, Feb. 15, 2017.

Chang, Mei, and De Jonghe, Lutgard C., "Whisker Growth in Reduction of Oxides," Metallurgical and Materials Transactions B, vol. 15 no. 4, pp. 685-694,Dec. 1984.

Chang, Ming, Chen, Po-Cheng, Lin, Chung-Po, and Chang, Yu-Han, "Assembly of Nanostructures by Using a Mechanical Nanomanipulator," Key Engineering Materials, vol. 450, pp. 263-266, Nov. 2010.

Chang, Ming, Kao, Ching-Yuan, and Halim, Dani-Saputra, "Investigation of Electrical Characteristics of Gold Nanowire under Tensile Test," Key Engineering Materials, vol. 516, pp. 299-304, June 2012.

Chang, Rui Wu, and McCluskey, F. Patrick, "Constitutive Relations of Indium in Extreme-Temperature Electronic Packaging Based on Anand Model," Journal of Electronic Materials, vol. xx no. x, pp. xx-xx, xxxx.

Chang, S. H., and Wu, S. K., "Damping characteristics of Sn-3Ag-0.5Cu and Sn-37Pb solders studied by dynamic mechanical analysis," Scripta Materialia, vol. 63 no. 10, pp. 957-960, Nov. 2010.

Chang, S. H., and Wu, S. K., "Low-frequency damping properties of eutectic Sn-Bi and In-Sn solders," Scripta Materialia, vol. 64 no. 8, pp. 757-760, Apr. 2011.

Chang, S. Y., "Active Soldering of ZnS-SiO2 Sputtering Targets to Copper Backing Plates Using an Sn56Bi4Ti(Ce, Ga) Filler," Materials and Manufacturing Processes, vol. 21 no. 8, pp. 761-765, 2006.

Chang, S. Y., Chuang, T. H., and Yang, C. L., "Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3.5Ag4Ti(Ce,Ga) Filler," Journal of Electronic Materials, vol. 36 no. 9, pp. 1193-1198, Sept. 2007.

Chang, S. Y., Tsao, L. C., Wu, M. W., and Chen, C. W., "The morphology and kinetic evolution of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5Al2O3 composite solder/Cu interface during soldering reaction," Journal of Materials Science: Materials in Electronics , vol. 23 no. 1, pp. 100-107, Jan. 2012.

Chang, Shih-Chang, Lin, Sheng-Chih, and Hsieh, Ker-Chang, "Phase reaction in Sn-9Zn solder with Ni/Au surface finish bond-pad at 175 °C ageing," Journal of Alloys and Compounds, vol. 428 no. 1-1, pp. 179-184, Jan. 31, 2007.

Chang, Shih-Chang, Lin, Sheng-Chih, and Hsieg, Ker-Chang, "The Formation and Growth of Intermetallic Compounds in Sn-Zn and Sn-Zn-Al Solder with Ni/Au Surface Finish Bond Pad," Journal of Electronic Materials, vol. 35 no. 3, pp. 399-405, Mar. 2006.

Chang, Shining, Wang, Rocky, Xiang, Yu, and Chang, Gibson, "Solder Cracking Mechanism Correlation to Alloy Composition under Thermal Cycling Stress (Part 1)," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 552-557.

Chang, Shou-Yi, Huang, Yi-Chung, and Lin, Yu-Mu, "Mechanical property and fracture behavior characterizations of 96.5 Sn-3.0 Ag-0.5 Cu solder joints," Journal of Alloys and Compounds, vol. 490 no. 1-2, pp. 508-514, Feb. 4, 2010.

Chang, Shu-Ming, Uang, Ruoh-Huey, Liou, Dau-Chi, Hu, Hsu-Tien, Chen, Kuo-Chuan, Chen, Yu-Fang, and Chen, Yu-Hua, "Investigation of Electroplating Ni UBM for Pb-free Solders," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1209-1214.

Chang, Shyh-Ming, Jou, Jwo-Huei, Hsieh, Adam, Chen, Tai-Hong, Chang, Ching-Yun, Wang, Yung-Hao, and Huang, Chun-Ming, "Characteristic study of anisotropic-conductive film for chip-on-film packaging," Microelectronics Reliability, vol. 41 no. 12, pp. 2001-2009, Dec. 2001.

Chang, Shyh-Ming, Jou, Jwo-Huei, Hsieh, Adam, Chen, Tai-Hong, Chang, Ching-Yun, Wang, Yung-Hao, Lin, Hong-Yu, and Huang, Chun-Ming, "Characteristic Study of Chip-on-Film Interconnection," Proceedings of SPIE - The International Society for Optical Engineering, Volume 4079, Taipei, Taiwan, 2000, pp. 228-xxx.

Chang, Taehoo, Kim, Jeongmin, Song, Min-Jung, and Lee, Wooyoung, "Proton irradiation effects on the thermoelectric properties in single-crystalline Bi nanowires," AIP Advances, vol. 5 no. 5, pp. 057101-1-057101-8, May 2015.

Chang, Tao-Chih, Hon, Min-Hsiung, and Wang, Moo-Chin, "Adhesion Strength of the Sn-9Zn-xAg/Cu Interface," Journal of Electronic Materials, vol. 32 no. 6, pp. 516-522, June 2003.

Chang, Tao-Chih, Wang, Moo-Chin, and Hon, Min-Hsiung, "Crystal growth of the intermetallic compounds at the Sn-9Zn-xAg/Cu interface during isothermal aging," Journal of Crystal Growth, vol. 252 no. 1-3, pp. 401-412, 2003.

Chang, Tao-Chih, Wang, Moo-Chin, and Hon, Min-Hsiung, "Effect of Ag addition on the structures of intermetallic compounds and the adhesion strength of the Sn-9Zn-xAg/Cu interface," Journal of Crystal Growth, vol. 252 no. 1-3, pp. 391-400, May 2003.

Chang, Tao-Chih, Wang, Moo-Chin, and Hon, Min-Hsiung, "Effect of aging on the growth of intermetallic compounds at the interface of Sn-9Zn-xAg/Cu substrates," Journal of Crystal Growth, vol. 250 no. 1-2, pp. 236-243, Mar. 2003.

Chang, Tao-Chih, Hon, Min-Hsiung, Wang, Moo-Chin, and Lin, Dong-Yih, "Effect of Thermal Cycling on the Adhesion Strength of Sn-9Zn-xAg-Cu Interface," IEEE Transactions on Advanced Packaging, vol. 27 no. 1, pp. 158-164, Feb. 2004.

Chang, Tao-Chih, Hsu, Ying-Tun, Hon, Min-Hsiung, and Wang, Moo-Chin, "Enhancement of the wettability and solder joint reliability at the Sn-9Zn-0.5Ag lead-free solder alloy-Cu interface by Ag precoating," Journal of Alloys and Compounds, vol. 360 no. 1-2, pp. 217-224, Oct. 6, 2003.

Chang, Tao-Chih, Wang, Moo-Chin, and Hon, Min-Hsiung, "Growth and morphology of the intermetallic compounds formed at the Sn-9Zn-2.5Ag/Cu interface," Journal of Alloys and Compounds, vol. 402 no. 1-2, pp. 141-148, Oct. 27, 2005.

Chang, Tao-Chih, Chang, Hung-Jen, Zhan, Chau-Jie, Chang, Jing-Yao, Fan, Jia-Wen, and Chou, Jung-Hua, "Influence of Intermetallic Compound on the Stress Distribution and Fatigue Life of Halogen-free Printed Circuit Board Assembly," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 220-223.

Chang, Tao-Chih, Hon, Min-Hsiung, and Wang, Moo-Chin, "Intermetallic compounds formation and interfacial adhesion strength of Sn-9Zn-0.5Ag solder alloy hot-dipped on Cu substrate," Journal of Alloys and Compounds, vol. 352 no. 1-2, pp. 168-172, Mar. 2003.

Chang, Tao-Chih, Hon, Min-Hsiung, and Wang, Moo-Chin, "Intermetallic compounds formed at the interface between Cu substrate and an Sn-9Zn-0.5Ag lead-free solder," Materials Research Bulletin, vol. 38 no. 5, pp. 909-916, Apr. 30, 2003.

Chang, Tao-Chih, Chou, Shih-Min, Hon, Min-Hsiung, and Wang, Moo-Chin, "Microstructure and adhesion strength of Sn-9Zn-xAg lead-free solders wetted on Cu substrate," Materials Science and Engineering A, vol. 429 no. 1-2, pp, 36-42, Aug. 15, 2006.

Chang, Tao-Chih, Wang, Moo-Chin, and Hon, Min-Hsiung, "Morphology and adhesion strength of the Sn-9Zn-3.5Ag/Cu interface after aging," Journal of Crystal Growth, vol. 263 no. 1-4, pp. 223-231, Mar. 1, 2004.

Chang, Tao-Chih, Wang, Jian-Wen, Wang, Moo-Chin, and Hon, Min-Hsiung, "Solderability of Sn-9Zn-0.5Ag-1In lead-free solder on Cu substrate: Part 1. Thermal properties, microstructure, corrosion and oxidation resistance," Journal of Alloys and Compounds, vol. 422 no. 1-2, pp. 239-243, Sept. 28, 2006.

Chang, Tao-Chih, Hon, Min-Hsiung, and Wang, Moo-Chin, "Solid-State Reactions at the Sn-9Zn-xAg Lead-Free Solders/Cu Interface," Electrochemical and Solid-State Letters, vol. 6 no. 6, pp. C82-C84, June 2003.

Chang, Tao-Chih, Hon, Min-Hsiung, and Wang, Moo-Chin, "Thermal Characteristics and Intermetallic Compounds Formed at Sn-9Zn-0.5Ag/Cu Interface," Materials Transactions, vol. 45 no. 3, pp. 606-613, Mar. 2004.

Chang, Tao-Chih, Wang, Moo-Chin, and Hon, Min-Hsiung, "Thermal Properties and Interfacial Reaction between the Sn-9Zn-xAg Lead-Free Solders and Cu Substrate," Metallurgical and Materials Transactions A , vol. 36A, no. 11, pp. 3019-3029, Nov. 2005.

Chang, Won, Jiang, Don-Son, and Selvaduray, Guna, "CSP Drop Test Performance Comparison for Different Solder Ball Materials," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Chang, Yuan-Wei, Cheng, Yin, Xu, Feng, Helfen, Lukas, Tian, Tian, Michiel, Marco Di, Chen, Chih, Tu, King-Ning, and Baumbach, Tilo, "Study of Discrete Voids Formation in Flip-Chip Solder Joints due to Electromigration Using In-Situ 3D Laminography and Finite-Element Modeling," 2016 IEEE 18th Electronics Packaging Technology Conference, Singapore, Nov. 30-Dec. 3, 2016, pp. 141-146.

Chang, Yuan-Wei, Cheng, Yin, Xu, Feng, Helfen, Lukas, Tian, Tian, Michiel, Marco Di, Chen, Chih, Tu, King-Ning, and Baumbach, Tilo, "Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling," Acta Materialia, vol. 117, pp. 100-110, Sept. 15, 2016.

Chang, Yuneng, Chen, Yalian, Wu, Ruykuo, Chen, Kuanhon, and Lin, Johnyi, "Polycrystalline Copper Whiskers and Networks Observed in MOCVD."

Chang, Zue-Chin, Ling, J. Y., and Chen, C. C., "AC Plus Deposition Method to Fabricate Array Ni Nanowires," Materials Science Forum, vol. 916, pp. 249-253, Mar. 2018.

Chang-Chien, Yu-Chien, Song, Jenn-Ming, Huang, Bo-Chang, Chen, Wei-Ting, Shie, Chi-Rung, and Hsu, Chuang-Yao, "Oxidation properties of Sn-Cu-Ni solders with minor alloying additions," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Chantaramanee, S., Wisutmethangoon, S., Sikong, L., and Plookphol, T., "Development of a lead-free composite solder from Sn-Ag-Cu and Ag-coated carbon nanotubes," Journal of Materials Science: Materials in Electronics, vol. 24 no. 10, pp. 3707-3715, Oct. 2013.

Chao, Brook, Chae, Seung-Hyun, Zhang, Xuefeng, Lu, Kuan-Hsun, Ding, Min, Im, Jay, and Ho, Paul S., "Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints," Journal of Applied Physics, vol. 100 no. 8, pp. 084909-1-084909-10, 2006.

Chao, Brook, Chae, Seung-Hyun, Zhang, Xuefeng, Lu, Kuan-Hsun, Im, Jay, and Ho, P. S., "Investigation of diffusion and electromigration parameters for Cu-Sn intermetallic compounds in Pb-free solders using simulated annealing," Acta Materialia, vol. 55 no. 8, pp. 2805-2814, May 2007.

Chao, Brook, Chae, Seung-Hyun, Zhang, Xuefeng, and Ho, Paul S., "Kinetic Analysis of Electromigration Enhanced Intermetallic Growth and Void Formation in Pb-Free Solders," Proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, London, England, Apr. 15-18, 2007, pp. xx-xx.

Chao, Brook Huang-Lin, Zhang, Xuefeng, Chae, Seung-Hyun, and Ho, Paul S., "Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints," Microelectronics Reliability, vol. 49 no. 3, pp. 253-263, Mar. 2009.

Chao, Fang-Lin, "Household Batteries Collection Behavior and the Emotional Aspects of Collection Bin Design," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 361.

Chao, Huang-Lin,Chae, Seung-Hyun, Zhang, Xuefeng, Lu, Kuan-Hsun, Im, Jay, and Ho, Paul S., "Kinetic Analysis of Current Enhanced Intermetallic Growth and Its Effect on Electromigration Reliability of Solder Joints," IEEE International 44th Annual Reliability Physics Symposium Proceedings, San Jose, CA, Mar. 26-30, 2006, pp. 250-255.

Chao, Wei-Shan, Wang, Wen-Hao, Luo, Tzeng-Cherng, Huang, Te-Chun, Liao, Ming-Chieh, and Wei, Tzu-Hsia, "The Comparison on The Corrosion Resistance of Different Kinds of PCB Surface Finishing: OSP, LF HASL and ENIG," 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 24-26, 2012, pp. 159-162.

Chao, Yi-Hsiang, Chen, Sinn-Wen, Chang, Chih-Hong, and Chen, Chih-Chi, "Phase Equilibria of Sn-Co-Ni System and Interfacial Reactions in Sn/(Co, Ni) Couples," Metallurgical and Materials Transactions A, vol. 39 no. 3, pp. 477-489, Mar. 2008.

Chaohui, Hu, and Lina, Zhou, "Conductive Anodic Filament Reliability and Failure Analysis for Halogen-Free Packaging Substrate" 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 344-347.

Chaowasakoo, Tanawan, Ng, Teng Hoon, Songninluck, Jinda, Stern, Margaret B. and Ankireddi, Sai, "Indium Solder as a Thermal Interface Material Using Fluxless Bonding Technology," Semiconductor Thermal Measurement and Management Symposium , San Jose, CA, Mar. 15-19, 2009, pp. 180-185.

Chapaneri, R., Ebbage, A. J., Wilcox, G. D., Critchlow, G. W., Chojnicki, A., Pearson, T., and Rowan, A. J., "Effect of heat treatment on promoting zinc whisker growth from bright zinc electrodeposited coatings," Transactions of the Institute of Metal Finishing, vol. 87 no. 3, pp. 159-162, May 2009. https://doi.org/10.1179/174591909X438956

Chapman, A. H., "Relative Effectiveness of Antimony, Lead and Bismuth in Retarding the beta -> alpha Transformation of Tin," Tin and its Uses, no. 160, pp. 2-3, 1989.

Chapman, A. H., Hampshire, W. B., and Maykuth, D. J., "Tin Coatings: Present and Future," Plating and Surface Finishing , vol. 70 no. 12, pp. 40-44, Dec. 1983.

Chappell, Jeff, "Agilent Sees Through Lead," Electronic News, vol. 46 no. 21, pp. 26, May 22, 2000.

Chappell, Jeff, "California Sets Compliance Pace," Electronic News, Sept. 7, 2005.

Chappell, Jeff, "DTI lays out WEEE implementation intentions," Electronic Weekly , Mar. 29, 2006.

Chappell, Jeff, "Making Electronics Recycling Cost Effective," Electronic News , Apr. 13, 2006.

Chappell, Jeff, "Metal Powders May Hold Promise for Lead Free Solder, Adhesive," Electronic News, Feb. 9, 2006.

Chappell, Jeff, "Ready or Not: Environmental Laws Are Coming," Electronic News , July 27, 2005.

Chappell, Jeff, "Ready or not, environmental laws are coming," Electronics Weekly , July 28, 2005.

Chappell, Jeff, "Recycling Europa," Electronic News, vol. 48 no. 12, pp. 1, 28, Mar. 18, 2002.

Chappell, Jeff, "Standards Loom for RoHS Materials Declaration," Electronic News , Jan. 25, 2006.

Chappell, Jeff, "Standards mooted for RoHS reporting," Electronics Weekly, Jan 26, 2006.

Chappell, Jeff, "U.K. Hedges on WEEE, Others Proceed," Electronic News, Mar. 5, 2006.

Charles, Harry K., and Simadurai, Nihal, "Electronics and the Environment," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1705-1713.

Charles Jr., Harry K., "Electronics, Energy, and the Environments: A Brief Overview," Advancing Microelectronics, vol. 37 no. 1, pp. 35-39, Jan./Feb. 2010.

Charles, J. E., Gardiner, R. B., and Myhra, S., "Variations in Thermoelectric Power and D.C. Resistivity in Sequentially Irradiated and Annealed n- and p-type Doped a-Tin," Radiation Effects , vol. 25 no. 3, pp. 145-154, 1975. https://doi.org/10.1080/00337577508235382

Charruau, Stephane, "Modelling Electrical Conductivity of Anisotropic Chemical Adhesives," 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Zalaegerszeg, Hungary, June 23-26, 2002, pp. 7-12.

Charsley, P., "Some Observations of Slip Lines on Deformed Copper Whiskers," Acta Metallurgica, vol. 8 no. 6, pp. 353-355, June 1960.

Charyk, Dagmara, Tyson, Tom, Stafstrom, Eric, and Morrissey, Ron, "Optimizing Immersion Silver Chemistries for Copper," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S14:02.

Chase, Lon E., Johns, William C., "Airborne Radar Evaluation of Printed Circuit Conductive Filament Growth," 2000 SMTA International Conference Proceedings, Chicago, IL, Sept. 24-28, 2000, pp. xx-xx.

Chase, Lon, Viswanadham, Puligandla, and Dunford, Steven, "Comparison of Ag, Ni/Au, and Solder PWB Surface Finishes on the Second Level Reliability of Fine Pitch Area Array Assemblies," 2000 SMTA International Conference Proceedings, Chicago, IL, Sept. 24-28, 2000, pp. xx-xx.

Chason, E., Pei, F., Briant, C. L., Kesari, H., and Bower, A. F., "Significance of Nucleation Kinetics in Sn Whisker Formation," Journal of Electronic Materials, vol. 43 no. 12, pp. 4435-4441, Dec. 2014.

Chason, E., Engwall, A. M., Miller, C. M., Chen, C.-H., Bhandari, A., Soni, S. K., Hearne, S. J., Freund, L. B., and Sheldon, B. W., "Stress evolution during growth of 1-D island arrays: Kinetics and length scaling," Scripta Materialia, vol. 97, pp. 33-36, Mar. 1, 2015.

Chason, E., Jadhav, N., Chan, W. L., Reinbold, L., and Kumar, K. S., "Whisker formation in Sn and Pb-Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes," Applied Physics Letters, vol. 92, no. x, pp. 171901-1-171901-3, Apr. 2008.

Chason, Eric, "Correlating Whisker/Hillock Growth with Compressive Stress in Sn during Thermal Cycling," Tin Whisker Group teleconference, May 8, 2013.

Chason, Eric, Jadhav, Nitin, and Pei, Fei, "Effect of Layer Properties on Stress Evolution, Intermetallic Volume, and Density during Tin Whisker Formation," JOM, vol. 63 no. 10, pp. 62-68, Oct. 2011.

Chason, Eric, Jadhav, Nitin, Pei, Fei, Buchovecky, Eric, and Bower, Allan, "Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms," Progress in Surface Science, vol. 88 no. 2, pp. 103-131, May 2013. https://doi.org/10.1016/j.progsurf.2013.02.002

Chason, Eric, Jadhav, Nitin, Buchvecky, Eric, Bower, Allan, and Kumar, Sharvan, "How do whiskers and hillocks grow in Pb-free Sn coatings?," SMTA International 2010 Conference (Presentations), Orlando, FL, Oct. 24-28, 2010.

Chason, Eric, "How do whiskers and hillocks grow in Pb-free Sn coatings?," Tin Whisker Group teleconference, Nov. 3, 2010.

Chason, Eric, and Pei, Fei, "Measuring the Stress Dependence of Nucleation and Growth Processes in Sn Whisker Formation," JOM, vol. 67 no. 10, pp. 2416-2424, Oct. 2015.

Chason, Eric, Vasquez, Justin, Pei, Fei, Jain, Nupur, and Hitt, Andrew, "Quantifying the Effect of Stress on Sn Whisker Nucleation Kinetics," Journal of Electronic Materials, vol. 47 no. 1, pp. 103-109, Jan. 2018.

Chason, Eric, "Real-Time Study of Whisker/Hillock Formation in Sn-Cu Systems by EBSD Characterization," Tin Whisker Group teleconference, Feb. 22, 2012.

Chason, Eric, and Pei, Fei, "Sn whisker formation as a stress-induced nucleation and growth process," The Latest Findings on Tin Whiskers in Electronics Webinar, Oct. 29, 2015, pp. xx-xx.

Chason, Eric, and Pei, Fei, "Sn whisker formation as a stress-induced nucleation and growth process," Tin Whisker Group teleconference, Dec. 9, 2015.

Chason, Eric, "Sn whisker formation: relationship between intermetallic formation, stress and whisker nucleation," Tin Whisker Group teleconference, July 8, 2009.

Chason, Eric, Pei, Fei, Jain, Nupur, and Hitt, Andrew, "Studying the Effect of Grain Size on Whisker Nucleation and Growth Kinetics Using Thermal Strain," Journal of Electronic Materials, vol. 48 no. 1, pp. 17-24, Jan. 2019.

Chason, Eric, Reinbold, Lucine, and Kumar, Sharvan, "Whisker Formation in Sn Coatings on Cu," Materials Research Society Symposium Proceedings Volume 851, Materials for Space Applications, Boston, MA, Nov. 29-Dec. 3, 2004, pp. 239-244.

Chatillon, C., Hodaj, F., and Pisch, A., "Thermodynamics of GaAs nanowire MBE growth with gold droplets," Journal of Crystal Growth, vol. 311 no. 14, pp. 3598-3608, July 1, 2009.

Chatterjee, Abhijit, "First-principles Investigation of the Structural and Electronic Properties of Cu Based Intermetallics," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 132-136.

Chatterji, Indraneel, "Backward Compatibility, Are We Ready - A Case Study," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 416-424.

Chatterji, Indraneel, Santos, Daryl, and Andros, Frank, "The Effect of Aging on the Shear Strength of Lead-Free and Lead-Bearing BGA Solder Spheres," 2002 NEPCON West - Fiberoptic Expo Conference Proceedings, 2002, pp. 277-287.

Chaudhari, Mugdha, Chowdhury, A S M Raufur R, Rahangdale, Unique, Misrak, Abel, Rajmane, Pavan, Doiphode, Aniruddha, and Agonafer, Dereje, "Reliability Assessment of BGA Solder Joints - Megtron 6 Vs FR4 Printed Circuit Boards," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 136-141.

Chaudhari, P., "Hillock growth in thin films," Journal of Applied Physics, vol. 45 no. 10, pp. 4339-4346, Oct. 1974.

Chauhan, Preeti, Osterman, Michael, Lee, S. W. Ricky, and Pecht, Michael, "Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability," IEEE Transactions on Components and Packaging Technologies , vol. 32 no. 3, pp. 693-700, Sept. 2009.

Chauhan, Preeti, Mukherjee, Subhasis, Osterman, Michael, Dasgupta, Abhijit, and Pecht, Michael, "Effect of Isothermal Aging on Microstructure and Creep Properties of SAC305 Solder - A Micromechanics Approach," Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 1, Burlingame, CA, July 16-18, 2013, pp. V001T07A009-1-V001T07A009-7.

Chauhan, Preeti, Osterman, Michael, and Pecht, Michael, "Impact of Thermal Aging on the Growth of Cu-Sn Intermetallic Compounds in Pb-Free Solder Joints in 2512 Resistors," Proceedings of the ASME International Mechanical Engineering Congress & Exposition, Volume 5: Electronics and Photonics, Lake Buena Vista, FL, Nov. 13-19, 2009, pp. 199-210.

Chauhan, Preeti, Mueller, Maik, Osterman, Michael, and Pecht, Michael, "Impact of Thermal Aging on the Thermal Fatigue Durability of Pb-free Solder Joints," 2010 3rd Electronic System-Integration Technology Conference , Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Chauhan, R. P., Gehlawat, Devender, Kaur, Amandeep, and Rana, Pallavi, "Ion beam-induced variation in electrical conductivity of Ag nanowires," Radiation Effects and Defects in Solids, vol. 168 no. 7-8, pp. 484-489, 2013.

Chauhan, R. P., and Kaur, Amandeep, "Study of size dependent variation in electrical and structural properties of zinc nanowires," Journal of Materials Science: Materials in Electronics , vol. 26 no. 7, pp. 5295-5302, July 2015.

Chavali, S., Singh, Y., Kumar, P., Subbarayan, G., Dutta, I., and Edwards, D. R., "Aging Aware Constitutive Models for SnAgCu Solder Alloys," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 701-705.

Chavali, S., Singh, Y., Subbarayan, G., Bansal, A., and Ahmad, M., "Cooling Rate, Pad Finish Effects on Mechanical Behavior of SnAgCu Alloys," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 424-430.

Chavali, S., Singh, Y., Subbarayan, G., Bansal, A., and Ahmad, M., "Effect of pad surface finish and reflow cooling rate on the microstructure and the mechanical behavior of SnAgCu solder alloys," Microelectronics Reliability, vol. 53 no. 6, pp. 892-898, June 2013.

Chavez, R., Vakulov, D., Gazibegovic, S., Car, D., Kendig, D., Tay, A. A. O., Shakouri, A., and Bakkers, E. P. A. M., "Thermopower Characterization of InSb Nanowires Using Thermoreflectance," 2017 23rd International Workshop on Thermal Investigations of ICs and Systems, Amsterdam, Netherlands, Sept. 27-29, 2017, pp. xx-xx.

Chaware, Raghunandan, Stiborek, Leon, Libres, Jeremias, Marquez, Manots, Odegard, Charles, Cowens, Marvin, and Venkateswaran, Muthiah, "Effect of Compatibility Between Fluxes and Cyanate Ester Underfill on Lead Free Flip Chip Assembly and Reliability," Advancing Microelectronics , vol. 33 no. 5, pp. 10-16, 18, Sept./Oct. 2006.

Chawla, N., Shen, Y.-L., Deng, X., and Ege, E. S., "An Evaluation of the Lap-Shear Test for Sn-Rich Solder/Cu Couples: Experiments and Simulation," Journal of Electronic Materials, vol. 33 no. 12, pp. 1589-1595, Dec. 2004.

Chawla, N., Ochoa, F., Ganesh, V. V., Deng, X., Koopman, M., Chawla, K. K., and Scarritt, S., "Measurement and prediction of Young's modulus of a Pb-free solder," Journal of Materials Science: Materials in Electronics, vol. 15 no. 6, pp. 385-388, June 2004.

Chawla, N., and Sidhu, R. S., "Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 175-189, Mar. 2007.

Chawla, N., "Thermomechanical behaviour of environmentally benign Pb-free solders," International Materials Reviews, vol. 54 no. 6, pp. 368-384, Nov. 2009.

Chawla, Nik, "In situ Mechanical Testing of Sn Whiskers," Tin Whisker Group teleconference, Nov. 6, 2013.

Chawla, Nik, "Overview of Pb-free Solder Research Activities," Tin Whisker Group teleconference, Feb. 1, 2012.

Che, F. X., Poh, Edith Candy, Zhu, W. H., and Xiong, B. S., "Ag Content Effect on Mechanical Properties of Sn-xAg-0.5Cu Solders," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 546-552.

Che, F. X., and Pang, John H. L., "Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn-3.8Ag-0.7Cu solder joints," Journal of Alloys and Compounds , vol. 541, pp. 6-13, Nov. 15, 2012.

Che, F. X., Pang, John H. L., Zhu, W. H., Sun, Wei, Sun, Anthony, Wang, C. K., and Tan, H. B., "Comprehensive Modeling of Stress-Strain Behavior for Lead-Free Solder Joints under Board-Level Drop Impact Loading Condition," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 528-535.

Che, F. X., Zhu, W. H., Poh, Edith S. W., Zhang, X. R., Zhang, Xiaowu, Chai, T. C., and Gao, S., "Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition," Journal of Electronic Materials, vol. 40 no. 3, pp. 344-354, Mar. 2011.

Che, F. X., Pang, H. L. J., Zhu, W. H., and Sun, Anthony Y. S., "Cyclic Bend Fatigue Reliability Investigation for Sn-Ag-Cu Solder Joints," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 313-317.

Che, F. X., and Luan, J. E., "Effect of Microstructure Design on Reliability of FBGA Lead-Free Solder Joints," European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Che, F. X., Luan, J. E., and Baraton, Xavier, "Effect of Silver Content and Nickel Dopant on Mechanical Properties of Sn-Ag-based Solders," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 485-490.

Che, F. X., and Pang, John H. L., "Fatigue Reliability Analysis of Sn-Ag-Cu Solder Joints Subject to Thermal Cycling," IEEE Transactions on Device and Materials Reliability, vol. 3 no. 1, pp. 36-49, Mar. 2013.

Che, F. X., and Pang, John H. L., "Harsh Solder Joint Reliability Tests By Impact Drop and Highly Accelerated Life Test (HALT)," 2004 6th International Conference on Electronic Packaging Technology, Singapore, Dec. 8-10, 2004, pp. 205-209.

Che, F. X., Pang, John H. L., Xiong, B. S., Xu, Luhua, and Low, T. H., "Lead Free Solder Joint Reliability Characterization for PBGA, PQFP and TSSOP Assemblies," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 916-921.

Che, F. X., Pang, H. L. J., Zhu, W. H., Sun, Wei, and Sun, Anthony Y. S., "Modeling Constitutive Model Effect on Reliability of Lead-Free Solder Joints," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Che, F. X., Zhu, W. H., Zhang, Xiaowu, and Chai, T. C., "Reliability Assessment for Cu/Low-k Structure based on Bump Shear Modeling and Simulation Method," 9th Electronics Packaging Technology Conference , Singapore, Dec. 10-12, 2007, pp. 27-31.

Che, F. X., "Study on Board Level Solder Joint Reliability for Extreme Large Fan-Out WLP under Temperature Cycling," 2016 IEEE 18th Electronics Packaging Technology Conference, Singapore, Nov. 30-Dec. 3, 2016, pp. 207-212.

Che, F. X., and Pang, John H. L., "Study on reliability of PQFP assembly with lead free solder joints under random vibration test," Microelectronics Reliability, vol. 55 no. 12 pt. B, pp. 2769-2776, Dec. 2015.

Che, F. X., Zhu, W. H., Poh, Edith S. W., Zhang, X. W., and Zhang, X. R., "The study of mechanical properties of Sn-Ag-Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures," Journal of Alloys and Compounds, vol. 507 no. 1, pp. 215-224, Sept. 24, 2010.

Che, F. X., and Pang, John H. L., "Vibration reliability test and finite element analysis for flip chip solder joints," Microelectronics Reliability, vol. xx no. x, pp. xx-xx, xxxx.

Che, Fa-Xing, Pang, H. L. J., Chong, Desmond Y. R., and Low, Patrick T. H., "Bend Fatigue Reliability Test and Analysis for Pb-free Solder Joint," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2 , Singapore, Dec. 7-9, 2005, pp. 868-872.

Che, Fa Xing, Yap, Daniel, Luan, Jing En, Goh, Kim Yong, and Ma, Yi Yi, "Design for Cyclic Bending Reliability of Large PBGA Assembly Using Experimental and Numerical Methods," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1171-1177.

Che, Fa-Xing, Pang, John H. L., and Xu, L. H., "IMC Consideration in FEA Simulation for Pb-Free Solder Joint Reliability," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 2, 2006, pp. 1018-1023.

Che, Fa Xing, "Material Characterization and Low Cycle Fatigue Model of Low Ag Content Lead-Free Solder," IEEE Transactions on Device and Materials Reliability , vol. 17 no. 2, pp. 298-306, June 2017.

Che, Fa Xing, Zhang, Xiaowu, Zhu, Wen Hui, and Chai, Tai Chong, "Reliability Evaluation for Copper/Low-k Structures Based on Experimental and Numerical Methods," IEEE Transactions on Device and Materials Reliability, vol. 8 no. 3, pp. 455-463, Sept. 2008.

Che, Fa Xing, and Pang, John H. L. "Study on Board-Level Drop Impact Reliability of Sn-Ag-Cu Solder Joint by Considering Strain Rate Dependent Properties of Solder," IEEE Transactions on Device and Materials Reliability, vol. 15 no. 2, pp. 181-190, June 2015.

Che, Faxing, Luan, Jing-En, Goh, Kim Yong, and Baraton, Xavier, "Drop impact life model development for FBGA assembly with lead-free solder joint," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 656-662.

Che, Fa-Xing, Luan, Jing-En, Yap, Daniel, Goh, Kim-Yong, and Baraton, Xavier, "Thermal cycling fatigue model development for FBGA assembly with Sn-Ag-based lead-free solder," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Chee, Choong Kooi, Chin, Yoong Tatt, Sterrett, Terry, He, Yi, Sow, H. P., Manepali, Rahul, and Chandran, Dennis, "Lead-free Compatible Underfill Materials For Flip Chip Applications," 2002 Proceedings 52nd Electronic Components & Technology Conference , San Diego, CA, May 28-31, 2002, pp. 417-424.

Chee, Choong Kooi, Lim, Szu Shing, Rudge, V. A., Periarnan, Shanggar, Ong, Ai Lin, Chan, Hwa Wei, and Then, Edward, "Lead-free Molded Underfill Technology for Exposed Die Flip Chip Packages Assembled in a Molded Matrix Array Packages Form," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 962-970.

Cheiwchanchamnangij, Tawainan, Birkel, Thomas, Lambrecht, Walter R. L., and Efros, Al. L., "GaAs Nanowires: A New Place to Explore Polytype Physics," Materials Science Forum, vol. 717-720, pp. 565-568, May 2012.

Chellaih, Titus, Kumar, Girish, and Prabhu, K. Narayan, "Effect of thermal contact heat transfer on solidification of Pb-Sn and Pb-free solders," Materials and Design, vol. 28 no. 3, pp. 1006-1011, 2007.

Chellvarajoo, Srivalli, and Abdullah, M. Z., "Investigation on nano-reinforced solder paste after reflow soldering part 1: Effects of nano-reinforced solder paste on melting, hardness, spreading rate, and wetting quality," Microelectronics Reliability, vol. 84, pp. 230-237, May 2018.

Chen, B. L., and Li, G. Y., "An Investigation of Effects of Sb on the Intermetallic Formation in Sn-3.5Ag-0.7Cu Solder Joints," IEEE Transactions on Components and Packaging Technologies, vol. 28 no. 3, pp. 534-541, Sept. 2005.

Chen, B. L., and Li, G. Y., "Effects of Antimony on the Growth of Intermetallic Compounds in Sa-Ag-Cu Pb-free Solder Joints," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1235-1242.

Chen, B. L., and Li, G. Y., "Influence of Sb on IMC growth in Sn-Ag-Cu-Sb Pb-free solder joints in reflow process," Thin Solid Films, vol. 462-463, pp. 395-401, Sept. 2004.

Chen, Bin, Gao, Qiang, Chang, Li, Wang, Yanbo, Chen, Zibin, Liao, Xiaozhou, Tan, Hark Hoe, Zou, Jin, Ringer, Simon P., and Jagadish, Chennupati, "Attraction of semiconductor nanowires: An in situ observation," Acta Materialia, vol. 61 no. 19, pp. 7166-7172, Nov. 2013.

Chen, Bingjie, Wang, Kaimin, and Yao, Yao, "Thermal cycling aging effects on the tensile property of lead-free solder Sn-3Ag-0.5Cu," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 708-711.

Chen, C. C., Chen, K. H., Wu, Y. S., Tsao, P. H., and Leu, S. T., "WLCSP Solder Ball Interconnection Enhancement for High Temperature Stress Reliability," 2020 IEEE 70th Electronic Components and Technology Conference, Lake Buena Vista, AL, May 26-29, 2020, pp. 1212-1217.

Chen, C. H., and Tai, K. L., "Whisker Growth induced by Ag photodoping in glassy Ge x Se1-x films," Applied Physics Letters, vol. 37 no. 12, pp. 1075-1077, Dec. 15, 1980.

Chen, C. N., Chen, B. Z., Wu, W. H., and Ho, C. E., "Correlation between Ag Content and Cu Pad Consumption in Lead-Free Solder Joints under Electron Current Stressing," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging , Shanghai, China, Aug. 8-11, 2011, pp. 846-850.

Chen, C. S., Wan, C. C., and Wang, Y. Y., "Effect of Agitation on Tin-Lead Alloy Deposition In a Methane Sulfonate System," Plating & Surface Finishing, vol. 88 no. 1, pp. 86-89, Jan. 2001.

Chen, C., Ho, C. E., Lin, A. H., and Kao, C. R., "Long-Term Aging Study on the Solid-State Reaction Between 58Bi42Sn Solder and Ni Substrate," Journal of Electronic Materials, vol. 29 no. 10, pp. 1200-1206, Oct. 2000.

Chen, Cai, Zhang, Lei, Lai, Qingquan, Li, Caifu, and Shang, J. K., "Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating," Journal of Materials Science: Materials in Electronics, vol. 22 no. 9, pp. 1234-1238, Sept. 2011.

Chen, Cai, Zhang, Lei, Zhao, Jiaxi, Cao Lihua, and Shang, J. K., "Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints," Journal of Electronic Materials, vol. 41 no. 9, pp. 2487-2494, Sept. 2012.

Chen, Cai, Zhang, Lei, Lizhang, Lai, C. M., Kuo, Eric, and Tan, K. H., "The Investigation of High Temperature Joint Generated by Low Temperature Process," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 271-274.

Chen, Casper, Chiang, Joshua, and Lee, F. Y., "De-mystifying materials selection for lead-free soldering," Circuit World, vol. 32, no. 2, pp. 18-22, 2006.

Chen, Catherine H., Wong, Wallace, Lo, Jeffery C. C., Song, Fubin, and Lee, S. W. Ricky, "Characterization and Comparison of Five SAC-based Solder Pastes for Pb-free Reflow Soldering," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Chen, Chang-Sheng, Lin, Yo-Shen, Chen, Wei-Ting, Shyu, Chin-Sun, Lay, Shinn-Juh, and Lee, Min-Lin, "PCB Embedded Capacitor with Central Via Connection Structure for RF Application," Electrical Design of Advanced Packaging and Systems Symposium, Seoul, Korea, Dec. 10-12, 2008, pp. 77-80.

Chen, Cheng-Chih, Lee, Jeffrey Chang-Bing, Lee, Dem, and Chen, Cherie, "Dielectric Material Characterization for the PCB Pad Cratering Resistance," SMTA China South 2017 Proceedings, Shenzhen, China, Aug. 28-31, 2017, pp. xx-xx.

Chen, Cheng-Chih, Lee, Jeffrey ChangBing, Lin, Hung-Chieh, Chang, Yu-Hsien, Lee, Dem, and Liou, Peggy, "Ion Bombardment Methodology for Lead Free Solder Microstructure Characterization," 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 22-24, 2014, pp. 418-421.

Chen, Cheng-Fu, and Peterson, Daniel C., "Stress Buildup of Sn3.5Ag Soldered Stacked CSPs to Board-Level Drop Impact," IEEE Transactions on Components, Packaging and Manufacturing Technology , vol. 1 no. 3, pp. 344-351, Mar. 2001.

Chen, Cherie, "Creep Corrosion Occurrence on TQFP IC Package," 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 24-26, 2012, pp. 149-158.

Chen, Chia-Ju, Chen, Chih-Ming, Horng, Ray-Hua, Wuu, Dong-Sing, and Hong, Jhih-Sin, "Thermal Management and Interfacial Properties in High-Power GaN-Based Light-Emitting Diodes Employing Diamond-Added Sn-3 wt.%Ag-0.5 wt.%Cu Solder as a Die-Attach Material," Journal of Electronic Materials, vol. 39 no. 12, pp. 2618-2626, Dec. 2010.

Chen, Chiao-Wen, Chiu, Tsung-Chieh, Chiu, Ying-Ta, Lee, Chiu-Wen, and Lin, Kwang-Lung, "Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps," Intermetallics, vol. 85, pp. 117-124, June 2017.

Chen, Chiao-Wen, Lin, Kwang-Lung, Chiu, Ying-Ta, Kao, Chin-Li, Lee, Chiu-Wen, and Yang, Ping-Feng, "The IMC Formation and Progress in the Copper Pillar Cu/Sn1.8Ag /OSP-Cu Microbump Structure upon Current Stressing," 2014 IEEE 16th Electronics Packaging Technology Conference, Singapore, Dec. 3-5, 2014, pp. 518-521.

Chen, Chien-Chon, Bisrat, Y., Luo, Z. P., Schaak, R. E., Chao, C.-G., and Lagoudas, D. C., "Fabrication of single-crystal tin nanowires by hydraulic pressure injection," Nanotechnology, vol. 17 no. 2, pp. 367-374, Jan. 2006.

Chen, Chien Chon, Chen, Chi Liang, and Lai, Yi-Sheng, "Template Assisted Fabrication of Pt-Sn Core-Shell Nanospheres," Materials Chemistry and Physics, vol. 131 no. 1-2, pp. 250-253, Dec. 15, 2011.

Chen, Chienchih, Suhling, Jeffrey C., and Lall, Pradeep, "Improved Finite Element Modeling Strategies with Multipoint Constraints for BGA Packages Subjected to Thermal Cycling," 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , Orlando, FL, May 30-June 2, 2017, pp. 1456-1465.

Chen, Chih-chi, and Tseng, Yan-lun, "Cross-Interaction in Cu/Sn/Co/Sn/Ni and Cu/Sn-Co/Co/Sn-Co/Ni Couples," Journal of Electronic Materials, vol. xx no. x, pp. xx-xx, xxxx.

Chen, Chih, Tong, H. M., and Tu, K. N., "Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints," Annual Review of Materials Research, vol. 40, pp. 531-555, June 2010.

Chen, Chih, "Electromigration in Flip-chip solder joints," 8th International Conference on Solid-State and Integrated Circuit Technology , Shanghai, China, Oct. 23-26, 2006, pp. 2121-2124.

Chen, Chih, and Liang, S. W., "Electromigration issues in lead-free solder joints," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 259-268, Mar. 2007.

Chen, Chih-chi, and Chen, Yue-ting, "Alternating reaction phases in Sn-Cu/Ni-Co solid-state reactions," Journal of Alloys and Compounds, vol. 545, pp. 28-31, Dec. 25, 2012.

Chen, Chih-chi, Chen, Sinn-wen, and Chang, Chih-horng, "Characterization of the ternary phase at the Sn/Ni-V joint," Journal of Materials Research, vol. 23 no. 10, pp. 2743-2748, Oct. 2008.

Chen, Chih-Chi, and Tseng, Yan-Lun, "Cross-Interaction in Cu/Sn/Co/Sn/Ni and Cu/Sn-Co/Co/Sn-Co/Ni Couples," Journal of Electronic Materials, vol. 44 no. 3, pp. 1021-1027, Mar. 2015.

Chen, Chih-chi, Chen, Sinn-wen, and Chang, Chih-horng, "Electromigration effects upon the Sn/Ni-7 wt % V interfacial reactions," Journal of Applied Physics, vol. 103 no. 6, pp. 063518-1-063518-4, 2008.

Chen, Chih-Chi, Chan, Ya-Ting, and Chen, Yue-Ting, "Interfacial reactions between Sn-Cu solders and Ni-Co alloys at 250 °C ," Journal of Materials Research, vol. 25 no. 7, pp. 1321-1328, July 2010.

Chen, Chih-chi, Chen, Sin-Wen, and Kao, Ching-Ya, "Interfacial Reactions in the Sn-(Ag)/(Ni,V) Couples and Phase Equilibria of the Sn-Ni-V System at the Sn-Rich Corner," Journal of Electronic Materials, vol. 35 no. 5, pp. 922-928, May 2006.

Chen, Chih-Chi, Gierlotka, Wojcieh, and Chen, Sinn-Wen, "Phase Equilibria of the Sn-V System and Interfacial Reactions in Sn/V Couples," Journal of Electronic Materials, vol. 37 no. 11, pp. 1727-1733, Nov. 2008.

Chen, Chih-chi, and Chan, Ya-ting, "Sn/Ni-Co solid/solid interfacial reactions," Intermetallics, vol. 18 no. 4, pp. 649-654, Apr. 2010.

Chen, Chih-chi, Chen, Sinn-wen, and Chang, Chih-horng, "Solid/solid interfacial reactions between Sn-0.7 wt% Cu and Ni-7 wt% V," Journal of Materials Research, vol. 23 no. 7, pp. 1895-1901, July 2008.

Chen, Chih-Chi, and Chen, Sinn-Wen, "The Sn/Ni-7Wt.%V Interfacial Reactions," Journal of Electronic Materials, vol. 35 no. 9, pp. 1701-1707, Sept. 2006.

Chen, Chih-Hao, Chakroborty, Subhendu, Lee, Boon-Ho, Chen, Hsiang-Chuan, Wang, Chang-Meng, and Wu, Albert T., "Assessment of microstructure and shear strength for low melting point tin-free alloys on Cu," Materials Science and Engineering: A, vol. 708, pp. 142-148, Dec. 21, 2017.

Chen, Chih-Hao, Lee, Boon-Ho, Chen, Hsiang-Chuan, Wang, Chang-Meng, and Wu, Albert T., "Development of New Low Melting Solder Alloys," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 2501-2506.

Chen, Chih-hao, Lin, Chi-pu, and Chen, Chih-ming, "Effect of Cu Thickness on the Evolution of the Reaction Products at the Sn-9wt.%Zn Solder/Cu Interface During Reflow," Journal of Electronic Materials, vol. 38 no. 1, pp. 61-69, Jan. 2009.

Chen, Chih-Hao, Lee, Boon-Ho, Chen, Hsiang-Chua, Wang, Chang-Meng, and Wu, Albert T., "Interfacial Reactions of Low-Melting Sn-Bi-Ga Solder Alloy on Cu Substrate," Journal of Electronic Materials, vol. 45 no. 1, pp. 197-202, Jan. 2016.

Chen, Chih-Ming, and Shih, Po-Yuan, "A peculiar composite structure of carbon nanofibers growing on a microsized tin whisker," Journal of Materials Research, vol. 23 no. 10, pp. 2668-2673, Oct. 2008.

Chen, Chih-ming, and Huang, Chih-chieh, "Atomic migration in eutectic SnBi solder alloys due to current stressing," Journal of Materials Research, vol. 23 no. 4, pp. 1051-1056, Apr. 2008.

Chen, Chih-ming, Hung, Yu-min, Lin, Chi-pu, and Su, Wen-Chiung, "Effect of temperature on microstructural changes of the Sn-9 wt.% Zn lead-free solder stripe under current stressing," Materials Chemistry and Physics, vol. 115 no. 1, pp. 367-370, May 15, 2009.

Chen, Chih-Ming, Huang, Chih-Chieh, Liao, Chien-Neng, and Liou, Kuen-Ming, "Effects of Copper Doping on Microstructural Evolution in Eutectic SnBi Solder Stripes under Annealing and Current Stressing," Journal of Electronic Materials, vol. 36 no. 7, pp. 760-765, July 2007.

Chen, Chih-ming, and Huang, Chih-chieh, "Effects of silver doping on electromigration of eutectic SnBi solder," Journal of Alloys and Compounds, vol. 461 no. 1-2, pp. 235-241, Aug. 11, 2008.

Chen, Chih-Ming, and Chen, Sinn-Wen, "Electric Current Effects on Sn/Ag Interfacial Reactions," Journal of Electronic Materials, vol. 28 no. 7, pp. 902-906, July 1999.

Chen, Chih-Ming, and Chen, Sinn-wen, "Electromigration effect upon the Sn-0.7 wt% Cu/Ni and Sn-3.5 wt% Ag/Ni interfacial reactions," Journal of Applied Physics, vol. 90 no. 3, pp. 1208-1214, Aug. 1, 2001.

Chen, Chih-Ming, and Chen, Sinn-Wen, "Electromigration Effect Upon the Zn/Ni and Bi/Ni Interfacial Reactions," Journal of Electronic Materials, vol. 29 no. 10, pp. 1222-1228, Oct. 2000.

Chen, Chih-ming, and Chen, Sinn-wen, "Electromigration effects upon the low-temperature Sn/Ni interfacial reactions," Journal of Materials Research, vol. 18 no. 6, pp. 1293-1296, June 2003.

Chen, Chih-Ming, Chen, Long-Tai, and Lin, Ya-Shiu, "Electromigration-Induced Bi Segregation in Eutectice SnBi Solder Joint," Journal of Electronic Materials, vol. 36 no. 2, pp. 168-172, Feb. 2007.

Chen, Chih-ming, Hung, Yu-min, and Lin, Ching-hsuan, "Electromigration of Sn-8 wt.% Zn-3 wt.% Bi and Sn-9 wt.% Zn-1 wt.% Cu solders," Journal of Alloys and Compounds, vol. 475 no. 1-2, pp. 238-244, May 5, 2009.

Chen, Chih-ming, and Chen, Yu-jen, "Growth orientation of the tin whiskers on an electrodeposited Sn thin film under three-point bending," Materials Letters, vol. 63 no. 17, pp. 1517-1520, July 15, 2009.

Chen, Chih-ming, and Chen, Chih-hao, "Interfacial Reactions between Eutectic SnZn Solder and Bulk or Thin-Film Cu Substrates," Journal of Electronic Materials, vol. 36 no. 10, pp. 1363-1371, Oct. 2007.

Chen, Chih-ming, Hsu, Chia-ming, and Chen, Sinn-wen, "Interfacial Reactions in Sn-Co-(Cu)/Ni Couples With/Without Current Stressing," Journal of Electronic Materials, vol. 41 no. 11, pp. 3205-3214, Nov. 2012.

Chen, Chih-Ming, Chen, Chih-Hao, Lin, Chi-Pu, and Su, Wen-Chiung, "Morphological Evolution of the Reaction Product at the Sn-9wt.%Zn/Thin-Film Cu Interface," Journal of Electronic Materials, vol. 37 no. 10, pp. 1605-1610, Oct. 2008.

Chen, Chih-ming, Hsu, Chia-ming, Zhao, Jingrui, and Chen, Sinn-wen, "Sn-Co-(Cu) / Ni solid/solid interfacial reactions," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Chen, Chuan, Cai, Jian, Wang, Qian, Wang, Yuming, Zou, Guisheng, Zhao, Zhengyu, and Park, Chang Yong, "Characterization of After-Reflow Misalignment on Head-in-Pillow Defect in BGA Assembly," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1177-1180.

Chen, Chun-Han, Chen, Bing-Hung, and Hong, L., "Role of Cu2+ as an Additive in an Electroless Nickel-Phosphorus Plating System: A Stabilizer or a Codeposit?"," Chemistry of Materials, vol. 18 no. 13, pp. 2959-2968, 2006.

Chen, Chun-Hao, Hsu, Shih-Wen, and Chuang, Tung-Han, "Interfacial Reactions of Ag and Ag-4Pd Stud Bumps with Sn-3Ag-0.5Cu Solder for Flip Chip Packaging," Journal of Electronic Materials, vol. 50 no. 1, pp. 249-257, Jan. 2021. https://doi-org.ezproxy.uky.edu/10.1007

Chen, Chun-Hsiung, "The 'IMC rings' growth mechanism in Sn-Ag-Cu solder ball and NiAu-plated BGA ball pad," Journal of the Chinese Institute of Engineers, vol. 36 no. 4, pp. 542-549, 2013.

Chen, Chun-Jen, and Lin, Kwang-Lung, "Electroless Ni-Cu-P Barrier Between Si/Ti/Al Pad and Sn-Pb Flip-Chip Solder Bumps," IEEE Transactions on Components and Packaging Technologies , vol. 24 no. 4, pp. 691-697, Dec. 2001.

Chen, Cliff, Huang, Michk, and Lewis, Theron, "Novel Method for PTH Soldering Driven by the Thermal Restrictions of a PTH LCD Device," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 222-229.

Chen, Cong, Shen, Linlin, and Niu, Xiaoyan, "Mechanical Response of Low Silver Lead-Free Solder under Dynamic Vickers Indentations," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 987-989.

Chen, Cong, Yu, Yingjie, and Niu, Xiaoyan, "Study on mechanical properties of low silver lead-free solders under combined compression and shear loading," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 809-811.

Chen, Dapeng, Qiao, Xueliang, Qiu, Xiaolin, Tan, Fatang, Chen, Jianguo, and Jiang, Renzhi, "Effect of silver nanostructures on the resistivity of electrically conductive adhesives composed of silver flakes," Journal of Materials Science: Materials in Electronics, vol. 21 no. 5, pp. 486-490, May 2010.

Chen, Dapeng, Qiao, Xueliang, and Chen, Jianguo, "Morphology-controlled synthesis of silver nanostructures via a solvothermal method," Journal of Materials Science: Materials in Electronics, vol. 22 no. 9, pp. 1335-1339, Sept. 2011.

Chen, Delphic, Ho, Cheng-En, and Kuo, Jui-Chao, "Current stressing-induced growth of Cu3Sn in Cu/Sn/Cu solder joints," Materials Letters, vol. 65 no. 8, pp. 1276-1279, Apr. 30, 2011.

Chen, Deng Yun, Manoharan, Subramani, McClusky, Patrick, and Osterman, Michael, "Impact of 10-Year Room Temperature Aging on SAC105," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 424-430.

Chen, Ding Wang, Leung, Alex, Chen, Alex, Rodriquez, Raul, Wang, Paul P. E., and Miller, Michael, "Manufacturing Qualification for the Latest Gaming Device with Pb-Free Assembly Process," 2007 Pan Pacific Microelectronics Symposium & Exhibit, Maui, HI, Jan. 30-Feb. 1, 2007, pp. xx-xx.

Chen, Dongchu, Gong, Wenhui, Huang, Zhuzhou, and Li, Wenfang, "A Study of the Environment-friendly Chrome-free Chemical Conversion Coating on 2024 Aluminium Alloy," Materials Science Forum, vol. 575-578 part 2, pp. 864-868, 2008.

Chen, Fang, Du, Yunfei, Zeng, Rongchang, Gan, Guisheng, and Du, Changhua, "Thermodynamics of Oxidation on Pb-Free Solders at Elevated Temperature," Materials Science Forum, vol. 610-613, pp. 526-530, 2009.

Chen, Fei-Jun, Yan, Shi, and Yang, Zhen-Guo, "Failure Analysis on Electrolytic Ni/Au Surface Finish of PCB Used for Wire Bonding and Soldering," Soldering & Surface Mount Technology, vol. 26 no. 4, pp. xx-xx, 2014.

Chen, Gang, Yu, Lin, Mei, Yun-Hui, Li, Xin, Chen, Xu, and Lu, Guo-Quan, "Reliability comparison between SAC305 joint and sintered nanosilver joint at high temperatures for power electronic packaging," Journal of Materials Processing Technology, vol. 214 no. 9. pp. 1900-1908, Sept. 2014.

Chen, Guang, Huang, Bomin, Liu, Hui, Chan, Y. C., Tang, Zirong, and Wu, Fengshun, "An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solder," Soldering & Surface Mount Technology, vol. 28 no. 2, pp. 84-92, 2016.

Chen, Guang, Wu, Fengshun, Liu, Changqing, and Chan, Y. C., "Effect of Fullerene-C60&C70 on the Microstructure and Properties of 96.5Sn-3Ag-0.5Cu Solder," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1262-1267.

Chen, Guang, Wu, Fengshun, Xia, Weisheng, Liu, Hui, and Liu, Changqing, "Effect of Ni-coated graphene on the performance of SAC305 solder," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 209-213.

Chen, Guang, Wu, Fengshun, Liu, Changqing, Xia, Weisheng, and Liu, Hui, "Effects of fullerenes reinforcement on the performance of 96.5Sn-3Ag-0.5Cu lead-free solder," Materials Science and Engineering: A, vol. 636, pp. 484-492, June 11, 2015.

Chen, Guang, Cui, Xinzhan, Wu, Yaofeng, Li, Wei, and Wu, Fengshun, "Microstructural, compositional and hardness evolutions of 96.5Sn-3Ag-0.5Cu/TiC composite solder under thermo-migration stressing," Journal of Materials Science: Materials in Electronics, vol. 31 no. 12, pp. 9492-9503, June 2020.

Chen, Guang, Liu, Li, Silberschmidt, Vadim V., Liu, Changqing, Wu, Fengshun, and Chan, Y. C., "Microstructural evolution of 96.5Sn-3Ag-0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient," Journal of Materials Science: Materials in Electronics, vol. 29 no. 7, pp. 5253-5263, Apr. 2018.

Chen, Guang, Wu, Fengshun, Liu, Changqing, Silberschmidt, Vadim V., and Chan, Y. C., "Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets," Journal of Alloys and Compounds , vol. 656, pp. 500-509, Jan. 25, 2016.

Chen, Guang, Cui, Xinzhan, Wu, Yaofeng, Li, Wei, and Wu, Fengshun, "Performance of 96.5Sn-3Ag-0.5Cu/fullerene composite solder under isothermal ageing and high-current stressing," Soldering & Surface Mount Technology , vol. 33 no. 1, pp. 35-46, 2021.

Chen, Guang, Peng, Hao, Silberschmidt, Vadim V., Chan, Y. C., Liu, Changqing, and Wu, Fengshun, "Performance of Sn-3.0Ag-0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing," Journal of Alloys and Compounds, vol. 685, pp. 680-689, Nov. 15, 2016.

Chen, Guang, Liu, Li, Silberschmidt, Vadim V., Chan, Y. C., Liu, Changqing, and Wu, Fengshun, "Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycle," Soldering & Surface Mount Technology, vol. 28 no. 3, pp. 159-166, 2016.

Chen, Guang, Li, Jiqiang, Kuang, Xinwen, Wu, Yaofeng, and Wu, Fengshun, "The study on reliability of Ni-coated graphene doped SAC305 lead-free composite solders under high current-density stressing," Soldering & Surface Mount Technology, vol. 31 no. 4, pp. 261-270, 2019.

Chen, Guang, Liu, Li, Du, Juan, Silberschmidt, Vadim V., Chan, Y. C., Liu, Changqing, and Wu, Fengshun, "Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles," Journal of Materials Science, vol. 51 no. 22, pp. 10077-10091, Nov. 2016.

Chen, Guo-Liang, Zhou, Min-Bo, Zhang, Lang, Lin, Yuan-Jiang, Zhang, Yu-Peng, and Zhang, Xin-Ping, "Influence of the zinc-oxide/salt content in the aluminum soldering flux on interfacial microstructure and mechanical property of Sn-0.7Cu/Al joints in assembling LED lighting components," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 958-962.

Chen, Guohai, Li, Xiaoyan, and Ma, Jusheng, "Effect of Thermal Cycling on the Growth of Intermetallic Compounds at the Sn-Zn-Bi-In-P Lead-Free Solder/Cu Interface," Journal of Electronic Materials, vol. 35 no. 10, pp. 1873-1878, Oct. 2006.

Chen, Guohai, Ma, Jusheng, and Geng, Zhiting, "Fabrication and Properties of Lead-free Sn-Ag-Cu-Ga Solder Alloy," Materials Science Forum, vol. 475-479, pp. 1747-1750, 2005.

Chen, Guohai, Li, Xiaoyan, Geng, Zhiting, and Ma, Jusheng, "The Study on the New Type Lead-Free Solder Alloys Sn-Zn-Ga," Xiyou Jinshu Cailiao yu Gongcheng/Rare Metal Materials and Engineering, vol. 33 no. 11, pp. 1222-1225, Nov. 2004.

Chen, H. T., Wang, C. Q., Yan, C., Li, M. Y., and Huang, Y., "Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging," Journal of Electronic Materials, vol. 36 no. 1, pp. 26-32, Jan. 2007.

Chen, H. T., Wang, C. Q., Yan, C., Li, M. Y., and Huang, Y., "Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging (Erratum)," Journal of Electronic Materials, vol. 36 no. 10, pp. 1405, Oct. 2007.

Chen, H. T., Wang, C. Q., Yan, C., Huang, Y., and Tian, Y. H., "Effects of Solder Volume on Formation and Redeposition of Au-Containing Intermetallics in Ni/Au-SnAgCu-Ni(P) Solder Joints," Journal of Electronic Materials, vol. 36 no. 1, pp. 33-39, Jan. 2007.

Chen, H. T., Wang, L., Han, J., Li, M. Y., Wu, Q. B., and Kim, J. M., "Grain Orientation Evolution and Deformation Behaviors in Pb-Free Solder Interconnects Under Mechanical Stresses," Journal of Electronic Materials, vol. 40 no. 12, pp. 2445-2457, Dec. 2011.

Chen, H. T., Mattila, T., Li, J., Liu, X. W., Li, M. Y., and Kivilahti, J. K., "Localized Recrystallization and Cracking Behavior of Lead-free Solder Interconnections under Thermal Cycling," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 562-568.

Chen, H. T., Wang, C. Q., and Li, M. Y., "Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling," Microelectronics Reliability, vol. 46 no. 8, pp. 1348-1356, Aug. 2006.

Chen, Haiyan, Jie, Xiaohua, Zhang, Haiyan, Chen, YUlong, and Guo, Li, "Preparation and Property of SnXCuNiBi Solder Alloy," Advanced Materials Research, vol. 146-147, pp. 485-490, 2011.

Chen, Haiyan, Chen, Ziliang, Lai, Zhenmin, Li, Yi, and Guo, Li, "The effects of ultrasonic treatments on the microstructure and mechanical properties of SAC0307 solder," Journal of Materials Processing Technology, vol. 266, pp. 619-626, Apr. 2019.

Chen, Hao, Tsai, Yi-Ling, Chang, Yu-Ting, and Wu, Albert T., "Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes," Journal of Alloys and Compounds, vol. 671, pp. 100-108, June 25, 2016.

Chen, Hao, Lee, Hsin Yi, Ku, Ching Shun, and Wu, Albert T., "Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures," Journal of Materials Science, vol. 51 no. 7, pp. 3600-3606, Apr. 2016.

Chen, Hao, Chou, Tzu-Ting, Fleshman, Collin, and Duh, Jenq-Gong, "Investigating the Effect of Ag Content on Mechanical Properties of Sn-Ag-Cu Micro-BGA Joints," Journal of Electronic Materials, vol. 48 no. 10, pp. 6866-6871, Oct. 2019.

Chen, Hong, and Li, J. C. M., "Impression creep of a viscous layer," Journal of Materials Research , vol. 16 no. 9, pp. 2709-2715, Sept. 2001.

Chen, Hongtao, Li, Jue, and Li, Mingyu, "Dependence of recrystallization on grain morphology of Sn-based solder interconnects under thermomechanical stress," Journal of Alloys and Compounds, vol. 540, pp. 32-35, Nov. 5, 2012.

Chen, Hongtao, Wang, Chunqing, Li, Mingyu, and Tian, Dewen, "Effect of Thermal Aging on the Microstructure Evolution and Solder Joint Reliability in Hard Disk Drive Under Mechanical Shock," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 4, pp. 831-836, Dec. 2008.

Chen, Hongtao, Wang, Chunqing, Li, Mingyu, and Tian, Dewen, "Influence of Thermal Cycling on the Microstructure and Shear Strength of Sn3.5Ag0.75Cu and Sn63Pb37 Solder Joints on Au/Ni Metallization," Journal of Materials Science and Technology, vol. 23 no. 1, pp. 68-72, Jan. 2007.

Chen, Hongtao, Han, Jing, Li, Jue, and Li, Mingyu, "Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing," Microelectronics Reliability, vol. 52 no. 6, pp. 1112-1120, June 2012.

Chen, Hongtao, Mueller, Maik, Mattila, Tonu Tuomas, Li, Jue, Liu, Xuwen, Wolter, Klaus-Juergen, and Paulasto-Krockel, Mervi, "Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling," Journal of Materials Research, vol. 26 no. 16, pp. 2103-2116, Aug. 28, 2011.

Chen, Hongtao, Mueller, Maik, Mattila, Toni Tuomas, Li, Jue, Liu, Xuwen, Wolter, Klaus-Juergen, and Paulasto-Krockel, Mervi, "Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling - ERRATUM," Journal of Materials Research, vol. 27 no. 6, pp. 978, Mar. 28, 2012.

Chen, Hongtao, Han, Jing, and Li, Mingyu, "Localized Recrystallization Induced by Subgrain Rotation in Sn-3.0Ag-0.5Cu Ball Grid Array Solder Interconnects During Thermal Cycling," Journal of Electronic Materials, vol. 40 no. 12, pp. 2470-2479, Dec. 2011.

Chen, Hongtao, Hang, Chunjin, Fu, Xing, and Li, Mingyu, "Microstructure and Grain Orientation Evolution in Sn-3.0Ag-0.5Cu Solder Interconnects Under Electrical Current Stressing," Journal of Electronic Materials, vol. 44 no. 10, pp. 3880-3887, Oct. 2015.

Chen, Hongtao, Wang, Ling, Han, Jing, Li, Mingyu, and Liu, Hao, "Microstructure, orientation and damage evolution in SnPb, SnAgCu, and mixed solder interconnects under thermomechanical stress," Microelectronic Engineering, vol. 96, pp. 82-91, Aug. 2012.

Chen, Hsiao-Yun, Chen, Chih, Wu, Pu-Wei, Shieh, Jia-Min, Cheng, Shing-Song, and Hensen, Karl, "Effect of Polyethylene Glycol Additives on Pulse Electroplating of SnAg Solder," Journal of Electronic Materials, vol. 37 no. 2, pp. 224-230, Feb. 2008.

Chen, Hsiao-Yun, and Chen, Chih, "Enhancing Sn-Ag Solder Joints Electromigration Lifetime via the Under-Bump-Metallization Structure Design," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1144-1147.

Chen, Hsiao-Yun, Chen, Chih, and Tu, King-Ning, "Failure induced by thermomigration of interstitial Cu in Pb-free flip chip solder joints," Applied Physics Letters, vol. 93 no. 12, pp. 122103-1-122103-3, Sept. 22, 2008.

Chen, Hsiao-Yun, and Chen, Chih, "In-situ Observation of the Failure Induced by Thermomigration of Interstitial Cu in Pb-free Flip Chip Solder Joints," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 319-324.

Chen, Hsiao-Yun, and Chen, Chih, "Kinetic study of eutectic Sn-3.5Ag and Electroplated Ni metallization in flip-chip solder joints," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 262-267.

Chen, Hsiao-Yun, and Chen, Chih, "Kinetic study of the intermetallic compound formation between eutectic Sn-3.5Ag alloys and electroplated Ni metallization in flip-chip solder joints," Journal of Materials Research, vol. 27 no. 8, pp. 1169-1177, Apr. 28, 2012.

Chen, Hsiao-Yun, and Chen, Chih, "Measurement of electromigration activation energy in eutectic SnPb and SnAg flip-chip solder joints with Cu and Ni under-bump metallization," Journal of Materials Research, vol. 25 no. 9, pp. 1847-1853, Sept. 2010.

Chen, Hsiao-Yun, and Chen, Chih, "Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints," Journal of Materials Research, vol. 26 no. 8, pp. 983-991, Apr. 28, 2011.

Chen, Hsiao-Yun, Lin, Han-Wen, Liu, Chien-Min, Chang, Yuan-Wei, Huang, Annie T., and Chen, Chih, "Thermomigration of Ti in flip-chip solder joints," Scripta Materialia , vol. 66 no. 9, pp. 694-697, May 2012.

Chen, Hsin-yuan, Hsu, Kuo-yuan, Lin, Tsung-shu, and Leu, Jihperng, "Thermal Behavior Analysis of Lead-free Flip-Chip Ball Grid Array Packages with Different Underfill Material Properties," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Chen, HuiMing, Liao, Jinfa, Wu, Shanjiang, Gong, Liukui, Wang, Junfeng, and Wang, Hang, "Effects of Dy substitution for Sn on the solderability and mechanical property of the standard near eutectic Sn-Ag-Cu alloy," Journal of Materials Science: Materials in Electronics, vol. 29 no. 15, pp. 12662-12668, Aug. 2018.

Chen, HuiMing, Guo, ChengJun, Huang, JiaPeng, and Wang, Hang, "Influence of gallium addition in Sn-Ag-Cu lead-fee solder," Journal of Materials Science: Materials in Electronics, vol. 26 no. 7, pp. 5459-5464, July 2015.

Chen, Jeff, Gross, Michael, and Meakin, Craig, "PEEK for Lead-Free Soldering Processes and Electronics Applications," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 1-6.

Chen, Jeng-I., He, Sanny, and Zhang, Elren, "Characterization of Low Loss Materials for High Frequency PCB Application," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 373-376.

Chen, Jian, Ma, Xiaoguang, Li, Jun, Yao, Yuhong, Yan, Wen, and Fan, Xinhui, "Formation of High-Angle Dislocation Boundaries in Drawn Single Crystal Copper Wires," Materials Transactions, JIM, vol. 56 no. 7, pp. 1052-1057, 2015.

Chen, Jian-Qiang, Guo, Jing-Dong, Ma, Hui-Cai, Wei, Song, and Shang, Jian-Ku, "Cu6Sn5 intermetallic compound anisotropy introduced by single crystal Sn under current stress," Journal of Alloys and Compounds, vol. 695, pp. 3290-3298, Feb. 25, 2017.

Chen, Jian-Qiang, and Guo, Jing-Dong, "Effect of Sn grain orientation on polarity effect in Sn-Ag-Cu solder joints during electromigration," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 911-914.

Chen, Jian-Qiang, Liu, Kai-Lang, Guo, Jing-Dong, Ma, Hui-Cai, Wei, Song, and Shang, Jian-Ku, "Electromigration anisotropy introduced by tin orientation in solder joints," Journal of Alloys and Compounds, vol. 703, pp. 264-271, May 5, 2017.

Chen, Jian-Qiang, Guo, Jing-Dong, Ma, Hui-Cai, Liu, Kai-Lang, Zhu, Qing-sheng, and Shang, Jian Ku, "Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects," Journal of Materials Research, vol. 30 no. 8, pp. 1065-1071, Apr. 28, 2015.

Chen, Jibing, Xie, Yu, He, Zhanwen, Wan, Nong, and Wu, Yiping, "Analysis on the Thermal Fatigue Behavior of Single SnAgCu Solder Joint," 2019 20th International Conference on Electronic Packaging Technology , Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Chen, Jibing, Wan, Nong, Li, Juying, He, Zhanwen, Yin, Yanfang, and Wu, Yiping, "Effect of microstructure and IMC on single SnAgCu solder joint by rapid thermal cycles," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 960-963.

Chen, Jibing, Wu, Yiping, and An, Bing, "Effect of rapid thermal cycles on the microstructure of single solder joint," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 1000-1003.

Chen, Jibing, An, Bing, Li, Cong, Guo, Wei, and Wu, Yiping, "Electromagnetic induced heating for rapid thermal cycling of single SnAgCu solder joint in double substrates," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 129-133.

Chen, Jibing, Lv, Weiwen, An, Bing, Zhou, Longzao, and Wu, Yiping, "Influence of rapid thermal cycling on the microstructures of single SnAgCu and SnPb solder joints," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 848-852.

Chen, Jibing, Yin, Yanfang, Ye, Jianping, and Wu, Yiping, "Investigation on fatigue behavior of single SnAgCu/SnPb solder joint by rapid thermal cycling," Soldering & Surface Mount Technology, vol. 27 no. 2, pp. 76-83, 2015.

Chen, Jibing, Wan, Nong, Li, Juying, He, Zhanwen, and Wu, Yiping, "Research on microstructures of double interfaces SAC305 solder joint by RPC," 2017 18th International Conference on Electronic Packaging Technology , Harbin, China, Aug. 16-19, 2017, pp. 301-304.

Chen, Jibing, Wan, Nong, Li, Juying, He, Zhanwen, and Wu, Yiping, "Study on thermal fatigue characteristics of lead-free SAC305 solder joint by RPC," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 652-655.

Chen, Jie, Shen, Jun, Min, Dong, and Peng, Changfei, "Influence of minor Bi additions on the interfacial morphology between Sn-Zn-xBi solders and a Cu layer," Journal of Materials Science: Materials in Electronics, vol. 20 no. 11, pp. 1112-1117, Nov. 2009.

Chen, Jie, Shen, Jun, Xie, Weidong, and Liu, Hui, "Intermetallic reactions in a Sn-3.5Ag-1.5In solder ball-grid-array package with Au/Ni/Cu pads," Journal of Materials Science: Materials in Electronics, vol. 22 no. 11, pp. 1703-1708, Nov. 2011.

Chen, Jie, Shen, Jun, Lai, Shiqiang, Min, Dong, and Wang, Xiaochuan, "Microstructural evolution of intermetallic compounds in Sn-3.5Ag-X (X = 0, 0.75Ni, 1.0Zn and 1.5In)/Cu solder joints during liquid aging," Journal of Alloys and Compounds, vol. 489 no. 2, pp. 631-637, Jan. 21, 2010.

Chen, Jie-Shi, Xu, Meng-Jia, Jin, Yu-Jing, Wang, Kai-Yun, Chun, Yu, and Lu, Hao, "Effect of electric field and Sn grain orientation on Cu consumption in Sn/Cu solder joint," Computational Materials Science, vol. 95, pp. 166-171, Dec. 2014.

Chen, Jie, and Wen, Yulan, "Reliability analysis of Conductive Adhesive Joints on Aluminum," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 209-212.

Chen, Jie Shi, Ye, Cheng Hui, Chen, Jun Mei, Xu, Ji Jin, Yu, Chun, and Lu, Hao, "Sn whiskers mitigation by refining grains of Cu substrate during the room temperature exposure," Materials Letters, vol. 161, pp. 201-204, Dec. 15, 2015.

Chen, Jie-Shi, Ye, Cheng-Hui, Yu, Chun, and Lu, Hao, "The micro-mechanism for the effect of Sn grain orientation on substrate consumption in Sn solder joints," Computational Materials Science , vol. 108a, pp. 1-7, Oct. 2015.

Chen, Jing-Yu, Tsai, Ho-Cheng, and Wu, Pu-Wei, "Galvanostatic Electrodeposition of SnCu2.4Ni1.2 as a Lead-free Solder," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Chen, Jiunn, Lai, Yi-Shao, and Yang, Ping-Feng, "First-Principles Calculations of Elastic Properties of Cu-Sn Crystalline Phases," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 193-196.

Chen, Jiunn, Lai, Yi-Shao, and Yang, Ping-Feng, "First-Principles Calculations of Elastic Properties of Cu3Sn and Cu6Sn5 Intermetallics," IEEE Transactions on Advanced Packaging, vol. 32 no. 4, pp. 754-757, Nov. 2009.

Chen, Jiunn, and Lai, Yi-Shao, "Towards elastic anisotropy and strain-induced void formation in Cu-Sn crystalline phases," Microelectronics Reliability, vol. 49 no. 3, pp. 264-268, Mar. 2009.

Chen, Jun, Hu, Anmin, Long, Xinjiang, and Li, Ming, "A Risk Assessment Method for Void in SnAg Solder Bump Influence on Reliability of Flip Chip Packaging," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 367-371.

Chen, K., Liu, C., Whalley, D. C., Hutt, D. A., Li, J. F., and Mannan, S. H., "A comparative study of the interfacial reaction between electroless Ni-P coatings and molten tin," Acta Materialia, vol. xx no. xx, pp. xxxx-xxxx, xxxx.

Chen, K., Liu, C., Whalley, D. C., Hutt, D. A., Li, J. F., and Mannan, S. H., "Electroless Ni-W-P Alloys as Barrier Coatings for Liquid Solder Interconnects," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 421-427.

Chen, K. C., Telang, A., Lee, J. G., and Subramanian, K. N., "Damage Accumulation under Repeated Reverse Stressing of Sn-Ag Solder Joints," Journal of Electronic Materials, vol. 31 no. 11, pp. 1181-1189, Nov. 2002.

Chen, K. M., and Lin, T. S., "Copper pillar bump design optimization for lead free flip-chip packaging," Journal of Materials Science: Materials in Electronics, vol. 21 no. 3, pp. 278-284, Mar. 2010.

Chen, K. M., "Die Crack Study for 40 nm Lead Free Flip Chip Packaging," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 730-733.

Chen, K. M., Ho, K. K., and Jiang, D. S., "Impact of Lead Free Solder Materials on Board Level Reliability for Low-K WLCSP," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 243-245.

Chen, K. M., "Lead-Free Solder Material and Chip Thickness Impact on Board-Level Reliability for Low-K WLCSP," IEEE Transactions on Advanced Packaging , vol. 33 no. 2, pp. 340-347, May 2010.

Chen, K. M., Tang, K. H., and Liu, J. S., "Reliability evaluation of BOAC and normal pad stacked-chip packaging using low-K wafers," Microelectronics Reliability, vol. 48 no. 3, pp. 408-415, Mar. 2008.

Chen, K. M., "Ultra low-k die crack study for lead free solder bump flip-chip packaging," Journal of Materials Science: Materials in Electronics, vol. 22 no. 8, pp. 988-994, Aug. 2011.

Chen, Kai, Wang, Dongfan, Ling, Huiqin, Hu, Anmin, Li, Ming, Zhang, Wenqi, and Cao, Liqiang, "Effects of Sn grain size on intermetallic compounds formation in 5 um diameter Cu/Sn pillar bumps," Journal of Materials Science: Materials in Electronics, vol. 29 no. 22, pp. 19484-19490, Nov. 2018.

Chen, Kai, Tamura, N., Kunz, M., Tu, K. N., and Lai, Yi-Shao, "In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction," Journal of Applied Physics, vol. 106 no. 2, pp. 023502-1-023502-4, July 15, 2009.

Chen, Kai, Tamura, N., Kunz, M., Tu, K. N., and Lai, Yi-Shao, "In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction," Lawrence Berkeley National Laboratory, 2009.

Chen, Kai, Tamura, N., and Tu, K. N., "In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction," Lawrence Berkeley National Laboratory, 2008.

Chen, Kai-Chi, Li, Hsun-Tien, Hsu, Chia-Wen, and Yang, Ching-Ping, "Properties and Reliability Test of Anisotropic Conductive Film in Chip on Glass Package," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 51-55.

Chen, Kang-I, Cheng, Shou-Chang, Wu, Sean, and Lin, Kwang-Lung, "Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn-9Zn eutectic alloy," Journal of Alloys and Compounds, vol. 416 no. 1-2, pp. 98-105, June 8, 2006.

Chen, Kang-I., and Lin, Kwang-Lung, "The Microstructures and Mechanical Properties of the Sn-Zn-Ag-Al-Ga Solder Alloys- the Effect of Ag," Journal of Electronic Materials, vol. 31 no. 8, pp. 861-867, Aug. 2002.

Chen, Kang-I, and Lin, Kwang-Lung, "The Microstructures and Mechanical Properties of the Sn-Zn-Ag-Al-Ga Solder Alloys- The Effect of Ga," Journal of Electronic Materials, vol. 32 no. 10, pp. 1111-1116, Oct. 2003.

Chen, Keming, and Wilcox, Geoffrey D., "Observations of the Spontaneous Growth of Tin Whiskers on Tin-Manganese Alloy Electrodeposits," Physical Review Letters, vol. 94 no. 6, pp. 066104-1 to 066104-4, Feb. 18, 2005.

Chen, Keming, and Wilcox, Geoffrey D., "Tin-Manganese Alloy Electrodeposits: I. Electrodeposition and Microstructural Characterization," Journal of the Electrochemical Society, vol. 153 no. 9, pp. C634-C640, 2006.

Chen, Keming, and Wilcox, Geoffrey D., "Tin-Manganese Alloy Electrodeposits: II. Corrosion Performance Studies," Journal of the Electrochemical Society, vol. 155 no. 2, pp. C53-C61, 2008.

Chen, Kuan-Jen, Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, and Chen, Yu-Wen, "Characterizations of Cu/Sn-Zn Solder/Ag Interfaces on Photovoltaic Ribbon for Silicon Solar Cells," IEEE Journal of Photovoltaics, vol. 5 no. 1, pp. 202-205, Jan. 2015.

Chen, Kuan-Jen, Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, Qiu, Dai-Wen, and Chou, Ta-Lung, "Effects of Electrical Current on Microstructure and Interface Properties of Sn-Ag-Cu/Ag Photovoltaic Ribbons," Materials Transactions, vol. 54 no. 7, pp. 1155-1159, 2013.

Chen, Kuan-Jen, Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, Qiu, Dai-Wen, and Chou, Ta-Lung, "Microstructure and electrical mechanism of Sn-xAg-Cu PV-ribbon for solar cells," Microelectronic Engineering, vol. 116, pp. 33-39, Mar. 25, 2014.

Chen, Kuen-da, Chen, Hao, and Yen, Yee-wen, "Interfacial reactions of Sn-0.7Cu, Sn-58Bi and Sn-9Zn Lead-free Solders with the Au/Ni/SUS 304 Substrate," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 606-608.

Chen, Kuo Ming, Guu, Yunn Horng, and Lin, Tsung Shu, "Lead-Free Flip-Chip Packaging Affects on Ultralow-k Chip Delamination," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 12, pp. 1985-1991, Dec. 2012.

Chen, L. D., and Huang, Mingliang, "Effect of Electromigration on Intermetallic Compound Formation in Cu/Sn/Cu Interconnect," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 666-669.

Chen, L. D., Huang, M. L., and Zhou, S. M., "Effect of Electromigration on Intermetallic Compound Formation in Line-Type Cu/Sn/Cu and Cu/Sn/Ni Interconnects," 2010 Proceedings 60th Electronic Components and Technology Conference , Las Vegas, NV, June 1-4, 2010, pp. 176-181.

Chen, L. D., Huang, M. L., and Zhou, S. M., "Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconnect," Journal of Alloys and Compounds, vol. 504 no. 2, pp. 535-541, Aug. 20, 2010.

Chen, L. J., and Falicov, L. M., "Pseudopotential calculation of the stacking fault energy in diamond, germanium, and grey tin," The Philosophical Magazine: A Journal of Theoretical Experimental and Applied Physics, vol. 29 no. 5, pp. 1133-1136, 1974. https://doi.org/10.1080/14786437408226597

Chen, Leida, Huang, Mingliang, Zhou, Shaoming, Ye, Song, Ye, Yuming, Wang, Jifan, and Cao, Xi, "Effect of Electromigration on Interfacial Reaction of Cu/Sn3.0Ag0.5Cu/Ni Solder Joint at High Temperature," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 316-320.

Chen, Leida, Huang, Mingliang, Zhou, Shaoming, and Ye, Song, "Effect of Electromigration on the Cu-Ni Cross-interaction in Line-type Cu/Sn/Ni Interconnect," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 324-329.

Chen, Leida, Feng, Yi, Liu, Xiaoyan, and Huang, Mingliang, "Effects of Temperature and Current Density on (Au, Pd, Ni)Sn4 Redistribution and Ni-P Consumption in Ni/Sn3.0Ag0.5Cu/ENEPIG Flip Chip Solder Joints," 2013 14th International Conference on Electronic Packaging Technology , Dalian, China, Aug. 11-14, 2013, pp. 1064-1069.

Chen, Limin, Ye, Yuming, Liu, Sang, Chen, Syber, Tu, Yunhua, Song, Zhiwei, and Xiang, Zhao, "The Influence of Process Parameters to Double-sided Assembly BGA Reliability in Backward Compatible Soldering," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 219-223.

Chen, Limin, Liu, Sang, Ye, Yuming, Tu, Yunhua, Song, zhiwei, Xiang, Zhao, and Xu, Zhi, "The influence of reflow peak temperature on BGA solder joints' mechanical reliability in backside compatible soldering," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Chen, Liu, Lai, Zonghe, Cheng, Zhaonian, and Liu, Johan, "Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection," Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, China, June 30-July 3, 2004, pp. 134-140.

Chen, Liu Caroline, Lai, Zonghe, Cheng, Zhaonian, and Liu, Johan, "Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection," Journal of Electronic Packaging, vol. 128 no. 3, pp. 177-183, Sept. 2006.

Chen, Long-tai, and Chen, Chih-ming, "Electromigration study in the eutectic SnBi solder joint on the Ni/Au metallization," Journal of Materials Research, vol. 21 no. 4, pp. 962-969, Apr. 2006.

Chen, Mengjun, Zhang, Sha, Huang, Jinxiu, and Chen, Haiyan, "Lead during the leaching process of copper from waste printed circuit boards by five typical ionic liquid acids," Journal of Cleaner Production , vol. 95, pp. 142-147, May 15, 2015.

Chen, Min-Na, Ding, Shi-Jin, Sun, Qing-Qing, Zhang, Wei, David, and Wang, Li-Kang, "Effect of Pulse-Plated Nickel Barriers on Tin Whisker Growth for Pure Tin Solder Joints," Journal of Electronic Materials, vol. 37 no. 6, pp. 894-900, June 2008.

Chen, Ming, and Zhang, Fan, "End-of-Life Vehicle Recovery in China: Consideration and Innovation Following the EU ELV Directive," JOM, vol. 61 no. 3, pp. 45-52, Mar. 2009.

Chen, Ming, "Investigation on end-of-life electric and electronic equipment recycling and disposal system in China: legislation, education and dissemination," Journal of Central South University of Technology, vol. 12 no. 2, pp. 148-152, Oct. 2005.

Chen, Ming-Yao, Lin, Han-wen, and Chen, Chih, "Effect of Sn Grain Orientation on Formation of Cu6Sn5 Intermetallic Compound Under Current Stressing," Journal of Electronic Materials, vol. 46 no. 4, pp. 2179-2184, Apr. 2017.

Chen, Ming-Yao, Liang, Y. C., and Chen, Chih, "Electromigration in reduced-height solder joints with Cu pillars," Journal of Materials Science: Materials in Electronics, vol. 27 no. 4, pp. 3715-3722, Apr. 2016.

Chen, Mingxiang, Peng, Cong, Chen, Xing, and Liu, Sheng, "Study on Microstructures and Tensile Properties of Active Solder Alloy," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1736-1739.

Chen, Olivia H., Byrd, Kevin, Mokler, Scott, Tang, Kok Kwan, and Aspandiar, Raiyo, "Comparison of the Mechanical Shock/Drop Reliability of Flip Chip BGA (FCBGA) Solder Joints Formed by Soldering with Low Temperature BiSn-Based Resin Reinforced Solder Pastes," International Conference on Soldering & Reliability 2015 Proceedings, Toronto, Ontario, Canada, May 19-21, 2015, pp. xx-xx.

Chen, Olivia H., Molina, Al, Aspandiar, Raiyo, Byrd, Kevin, Mokler, Scott, and Tang, Kok Kwan, "Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups Formed by Reflow Soldering SAC Solder Balls BGAs with BiSnAg and Resin Reinforced BiSn-Based Solder Pastes," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 215-222.

Chen, Olivia H., Gao, James, Pan, Tim C. C., Tang, Kok Kwan, Aspandiar, Raiyo, Byrd, Kevin, Zhou, Bite, Mokler, Scott, and Molina, Al, "Solder Joint Reliability on Mixed SAC-BiSn Ball Grid Array Solder Joints Formed With Resin Reinforced Bi-Sn Metallurgy Solder Pastes," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 216-228.

Chen, Panfeng, "The WEEE Challenge to China," Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 12-14, 2005, pp. 532-534.

Chen, Ping, Zhao, Xiuchen, Wang, Yong, Zheng, Bing, Liu, Chengliang, and Chen, Siqi, "Effect of nano a-Fe2O3 additions on physical and mechanical properties of Sn-1.0Ag-0.7Cu-xFe2O3 low Ag lead-free solders," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Chen, Ping, Zhao, Xiuchen, Wang, Yong, Liu, Ying, Li, Hong, and Gu, Yue, "Enhancement of mean-time-to-failure of Sn3.0Ag0.5Cu solder bump joint under current stressing via controlling bump shape," Journal of Materials Science: Materials in Electronics, vol. 26 no. 3, pp. 1940-1949, Mar. 2015.

Chen, Qiang, and Li, Guoyuan, "Effects of Dopants on Wettability and Microstructure Evolution of Lead-Free solder joints," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 314-318.

Chen, Qin, "Common Status of LTS," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. xx-xx.

Chen, Rong, and Yang, Fuqian, "Effect of DC Current on the Creep Deformation of Tin," Journal of Electronic Materials, vol. 39 no. 12, pp. 2611-2617, Dec. 2010.

Chen, Rong-Sheng, Wu, Ray-Wen, and Liao, Wen-Chi, "Optimal Design of Drop Impact for TFBGA by Concept of Average Stress within Finite Grid Region," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 841-848.

Chen, S., Sun, P., Wei, X. C., Cheng, Z. N., and Liu, J., "Coffin-Manson equation of Sn-4.0Ag-0.5Cu solder joint," Soldering & Surface Mount Technology, vol. 21 no. 2, pp. 48-54, 2009.

Chen, S., Zhao, N., Qiao, Y. Y., Wang, Y. P., Ma, H. T., and Wu, C. M. L., "Growth behavior and orientation evolution of Cu6Sn5 grains in micro interconnect during isothermal reflow," 2019 IEEE 69th Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2019, pp. 1629-1634.

Chen, S.-W., Chiu, C.-N., and Hsieh, K.-C., "Phase Equilibria of the Sn-Ag-Cu-Ni Quaternary System at 210°C," Journal of Electronic Materials, vol. 36 no. 3, pp. 197-206, Mar. 2007.

Chen, Shanxing, Zhou, Wei, and Wu, Ping, "Effect of Zn Additions on the Mechanical Properties of Cu6Sn5-Based IMCs: Theoretical and Experimental Investigations," Journal of Electronic Materials, vol. 44 no. 10, pp. 3920-3926, Oct. 2015.

Chen, Shanyong, Li, Ying, Jin, Rong, Guan, Youwei, Ni, Haitao, Wan, Qunhua, and Li, Lu, "A systematic and effective research procedure for silver nanowire ink," Journal of Alloys and Compounds, vol. 706, pp. 164-175, June 5, 2017.

Chen, Shih-Hsun, Chen, Chien-Chon, Luo, Z. P., and Chao, Chuen-Guang, "Fabrication and characterization of eutectic bismuth-tin (Bi-Sn) nanowires," Materials Letters, vol. 63 no. 13-14, pp. 1165-1168, May 31, 2009. https://doi.org/10.1016/j.matlet.2009.02.019

Chen, Shih-Hsun, Wang, Chiu-Yen, Chen, Yung-Chang, Hun, Chien-Wan, Chen, Shih-Fan, and Yang, Sheng-Min, "Fabrication of pure aluminum nanowires by using injection molding process in ambient air," Materials Letters, vol. 148, pp. 30-33, June 1, 2015.

Chen, Shih Hsun, Chen, Chien Chon, and Chao, Chuen Guang, "Novel Morphology and Solidification Behavior of Eutectic Bismuth-Tin (Bi-Sn) Nanowires," Journal of Alloys and Compounds, vol. 481 no. 1-2, pp. 270-273, July 29, 2009.

Chen, Shu, Theodorou, Ioannis G., Goode, Angela E., Gow, Andrew, Schwander, Stephan, Zhang, Jufeng (Jim), Chung, Kian Fan, Tetley, Teresa D., Shaffer, Milo S., Ryan, Mary P., and Porter, Alexandra E., "High-Resolution Analytical Electron Microscopy Reveals Cell Culture Media-Induced Changes to the Chemistry of Silver Nanowires," Environmental Science & Technology, vol. 47 no. 23, pp. 13813-13821, Dec. 3, 2013.

Chen, Shu, Chu, Youping, Zheng, Jufang, and Li, Zelin, "Study on the two dealloying modes in the electrooxidation of Au-Sn alloys by in situ Raman spectroscopy," Electrochimica Acta, vol. 54 no. 3, pp. 1102-1108, Jan. 1, 2009.

Chen, Si, Zhang, Lili, Liu, Johan, Gao, Yulai, and Zhai, Qijie, "A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder," Materials Transactions, vol. 51 no. 10, pp. 1720-1726, 2010.

Chen, Si, Wu, Qiushi, Fu, Zhiwei, Huang, Yun, Yao, Bin, and Zhou, Bin, "Black equation of the electromigration lifetime for ceramic package with lead bumps and plastic package with lead-free bump," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Chen, Si, Luo, Xin, Jiang, Di, Ye, Lilei, Edwards, Michael, and Liu, Johan, "Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 5 no. 8, pp. 1186-1196, Aug. 2015.

Chen, Si, Sun, Peng, Wei, Xicheng, Cheng, Zhaonian, and Liu, Johan, "Studies of Solder Joint Reliability under Mechanical Bending Test on FR-4 PCBs with Sn-4.0Ag-0.5Cu Solder Paste," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Chen, Si, Cheng, Zhaonian, Liu, Johan, Gao, Yulai, and Zhai, Qijie, "The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1240-1245.

Chen, Sinn-Wen, Lin, Jhe-Yu, Hsu, Chia-Ming, Chang, Jui-Shen, Duh, Jenq-Gong, and Wang, Chao-Hong, "Ag Whisker Formation in Ag-In-Se Alloys," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 44 no. 12, pp. 5281-5283, Dec. 2013. https://doi.org/10.1007/s11661-013-2030-2

Chen, Sinn-wen, Chen, Yu-kai, Wu, Hsin-jay, Huang, Yu-chih, and Chen, Chih-ming, "Co Solubility in Sn and Interfacial Reactions in Sn-Co/Ni Couples," Journal of Electronic Materials, vol. 39 no. 11, pp. 2418-2428, Nov. 2010.

Chen, Sinn-Wen, Lin, Chao-Ching, and Chen, Chihming, "Determination of the Melting and Solidification Characteristics of Solders Using Differential Scanning Calorimetry," Metallurgical and Materials Transactions A, vol. 29 no. 7, pp. 1965-1972, July 1998.

Chen, Sinn-Wen, Chang, Jui-Shen, Pan, Kevin, Hsu, Chia-Ming, and Hsu, Che-Wei, "Directional Solidification and Liquidus Projection of the Sn-Co-Cu System," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 44 no. 4, pp. 1656-1664, Apr. 2013.

Chen, Sinn-Wen, and Wang, Chao-Hong, "Effects of electromigration on interfacial reactions in cast Sn/Cu joints," Journal of Materials Research, vol. 22 no. 3, pp. 695-702, Mar. 2007.

Chen, Sinn-Wen, Chen, Chih-Ming, and Liu, Wen-Chyuarn, "Electric Current Effects Upon the Sn\Cu and Sn\Ni Interfacial Reactions," Journal of Electronic Materials, vol. 27 no. 11, pp. 1193-1197, Nov. 1998.

Chen, Sinn-wen, and Chen, Chih-ming, "Electromigration Effects upon Interfacial Reactions," JOM, vol. 55 no. 2, pp. 62-67, Feb. 2003.

Chen, Sinn-wen, Lin, Shih-kang, and Jao, Jui-meng, "Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints," Materials Transactions, vol. 45 no. 3, pp. 661-665, Mar. 2004.

Chen, Sinn-Wen, Lin, Yu-Ren, Wu, Hsin-Jay, Chang, Ru-Bo, Hsu, Chia-Ming, and Lin, Hong-Ming, "Evolution of the Sn/Ni-8.0 at.%V interfacial reaction paths," Journal of Materials Research, vol. 26 no. 22, pp. 2838-2843, Nov. 28, 2011.

Chen, Sinn-Wen, and yen, Yee-Wen, "Interfacial Reactions in Ag-Sn/Cu Couples," Journal of Electronic Materials, vol. 28 no. 11, pp. 1203-1208, Nov. 1999.

Chen, Sinn-wen, and Chen, Chih-chi, "Interfacial Reactions in Sn-0.7wt.%Cu/Ni-V Couples at 250°C," Journal of Electronic Materials, vol. 36 no. 9, pp. 1121-1128, Sept. 2007.

Chen, Sinn-wen, Chen, Tung-kai, Chang, Jui-shen, Hsu, Chia-ming, and Chen, Wei-an, "Interfacial Reactions in Sn-Ag/Co Couples," Journal of Electronic Materials, vol. 43 no. 2, pp. 636-639, Feb. 2014.

Chen, Sinn-wen, Chen Chih-chi, and Chang, Chih-horng, "Interfacial reactions in Sn/Ni-7 wt.%V couple," Scripta Materialia , vol. 56 no. 6, pp. 453-456, Mar. 2007.

Chen, Sinn-Wen, Lin, Shih-Kang, and Yang, Ching-Feng, "Interfacial Reactions in the Pb-Free Composite Solders with Indium Layers," Journal of Electronic Materials, vol. 35 no. 1, pp. 72-75, Jan. 2006.

Chen, Sinn-Wen, and Yen, Yee-Wen, "Interfacial Reactions in the Sn-Ag/Au Couples," Journal of Electronic Materials, vol. 30 no. 9, pp. 1133-1137, Sept. 2001.

Chen, Sinn-Wen, Wu, Shyr-Harn, and Lee, Shou-Wei, "Interfacial Reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu, and Sn/(Cu,Ni) Systems," Journal of Electronic Materials, vol. 32 no. 11, pp. 1188-1194, Nov. 2003.

Chen, Sinn-wen, Yang, Ching-feng, Wu, Hsin-jay, Chang, Ru-Bo, and Hsu, Chia-ming, "Interfacial reactions in the Sn-In-Zn/Ag and Sn-In-Zn/Ni couples," Materials Chemistry and Physics, vol. 132 no. 2-3, pp. 481-487, Feb. 15, 2012.

Chen, Sinn-wen, Zi, An-ren, Chen, Po-yin, Wu, Hsin-jay, Chen, Yu-kai, and Wang, Chao-hong, "Interfacial reactions in the Sn-Sb/Ag and Sn-Sb/Cu couples," Materials Chemistry and Physics, vol. 111 no. 1, pp. 17-19, Sept. 15, 2008.

Chen, Sinn-wen, and Wang, Chao-hong, "Interfacial reactions of Sn-Cu/Ni couples at 250°C," Journal of Materials Research, vol. 21 no. 9, pp. 2270-2277, Sept. 2006.

Chen, Sinn-Wen, Chiu, Wan-Ting, Gierlotka, Wojciech, Chang, Jui-Shen, and Wang, Chao-Hong, "Liquidus Projection and Thermodynamic Modeling of a Sn-Ag-Zn System," Journal of Electronic Materials, vol. 46 no. 12, pp. 6910-6921, Dec. 2017.

Chen, Sinn-wen, Hsu, Hsiu-feng, and Lin, Chih-wei, "Liquidus projection of the ternary Ag-Sn-Ni system," Journal of Materials Research, vol. 19 no. 8, pp. 2262-2267, Aug. 2004.

Chen, Sinn-wen, Chen, Tung-Kai, Hsu, Chia-ming, Chang, Jui-Shen, and Pan, Kevin, "Liquidus Projections of Sn-Co-Ni and Sn-Rich Sn-Ag-Co-Ni Systems," Journal of Electronic Materials, vol. 43 no. 7, pp. 2487-2497, July 2014.

Chen, Sinn-Wen, Chen, Po-Yin, and Wang, Chao-Hong, "Lowering of Sn-Sb Alloy Melting Poiints Caused by Substrate Dissolution," Journal of Electronic Materials, vol. 35 no. 11, pp. 1982-1985, Nov. 2006.

Chen, Sinn-Wen, Lee, Shou-Wei, and Yip, Ming-Chuen, "Mechanical Properties and Intermetallic Compound Formation at the SnNi and Sn-0.7 wt.%Cu/Ni Joints," Journal of Electronic Materials, vol. 32 no. 11, pp. 1284-1289, Nov. 2003.

Chen, Sinn-Wen, Wang, Chao-Hong, Lin Shih-Kang, and Chiu, Chen-Nan, "Phase Diagrams of Pb-Free Solders and their Related Materials Systems," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 19-37, Mar. 2007.

Chen, Sinn-wen, Wu, Hsin-jay, Huang, Yu-chih, and Gierlotka, Wojciech, "Phase equilibria and solidification of ternary Sn-Bi-Ag alloys," Journal of Alloys and Compounds, vol. 497 no. 1-2, pp. 110-117, May 14, 2010.

Chen, Sinn-Wen, and Chang, Cheng-An, "Phase Equilibria of the Sn-Ag-Cu-Ni Quaternary System at the Sn-Rich Corner," Journal of Electronic Materials, vol. 33 no. 10, pp. 1071-1079, Oct. 2004.

Chen, Sinn-wen, Zi, An-ren, Gierlotka, Wojciech, Yang, Ching-feng, Wang, Chao-hong, Lin, Shih-kang, and Hsu, Chia-ming, "Phase equilibria of Sn-Sb-Cu system," Materials Chemistry and Physics , vol. 132 no. 2-3, pp. 703-715, Feb. 15, 2012.

Chen, Sinn-Wen, Chen, Chih-Chi, Gierlotka, Wojcieh, Zi, An-Ren, Chen, Po-Yin, and Wu, Hsin-Jay, "Phase Equilibria of the Sn-Sb Binary System," Journal of Electronic Materials, vol. 37 no. 7, pp. 992-1002, July 2008.

Chen, Sinn-Wen, Chen, Po-Yin, Chiu, Chen-Nan, Huang, Yu-Chih, and Wang, Chao-Hong, "Phase Equilibria of the Sn-Sb-Ag Ternary System (I): Experimental," Metallurgical and Materials Transactions A, vol. 39 no. 13, pp. 3191-3198, Dec. 2008.

Chen, Sinn-wen, Wang, Chao-hong, Lin, Shih-kang, Chiu, Chen-nan, and Chen, Chih-chi, "Phase Transformation and Microstructural Evolution in Solder Joints," JOM, vol. 59 no. 1, pp. 39-43, Jan. 2007.

Chen, Sinn-wen, Hsu, Che-wei, Lin, Shih-kang, and Hsu, Chia-ming, "Reaction evolution in Sn-20.0 wt% In-2.8 wt% Ag/Ni couples," Journal of Materials Research, vol. 28 no. 23, pp. 3257-3260, Dec. 14, 2013.

Chen, Sinn-wen, Lee, Wan-yu, Hsu, Chia-ming, Yang, Ching-feng, Hsu, Hsin-yun, and Wu, Hsin-jay, "Sn-In-Ag phase equilibria and Sn-In-(Ag)/Ag interfacial reactions," Materials Chemistry and Physics, vol. 128 no. 3, pp. 357-364, Aug. 15, 2011.

Chen, Sujie, and Guo, Xiaojun, "Improving the Sensitivity of Elastic Capacitive Pressure Sensors Using Silver Nanowire Mesh Electrodes," IEEE Transactions on Nanotechnology, vol. 14 no. 4, pp. 619-623, July 2015.

Chen, T., Dutta, I., and Jadhav, S., "Effect of Ag and Cu Concentrations on Creep of Sn-Based Solders," Proceedings of the ASME InterPack Conference, Volume 2, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 399-405.

Chen, T., and Dutta, I., "Effect of Ag and Cu Concentrations on the Creep Behavior of Sn-Based Solders," Journal of Electronic Materials, vol. 37 no. 3, pp. 347-354, Mar. 2008.

Chen, Tianrui, Wang, Haifeng, Yang, Hui, and Guo, Xingzhong, "Synthesis and Characterizing of High Aspect Ratio Silver Nanowires by Polyol Process," Key Engineering Materials, vol. 768, pp. 75-84, Apr. 2018.

Chen, Tim, Wang, Jinlin, and Lu, Daoqiang, "Emerging Challenges of Underfill for Flip Chip Application," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 175-179.

Chen, Tong, "Metal hydroxides for flame retardant wire and cable compounds," Wire Journal International, vol. 38 no. 2, pp. 57-61, Feb. 2005.

Chen, Tung-kai, Hsu, Chia-ming, and Chen, Sinn-wen, "Liquidus projection of Sn-Co-Ni ternary system," 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 24-26, 2012, pp. 359-362.

Chen, Tzu Yu, Liang, S. W., and Chen, Chih, "Effect of Passivation Opening Design on Electromigration Reliability Issue in Flip-Chip Solder Joints," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 267-270.

Chen, W.-M., McCloskey, P., Byrne, P., Cheasty, P., Duffy, G., Rohan, J. F., Boardman, J., Mulcahy, A., and O'Mathuna, S. C., "Degradation of Electroless Ni(P) Under-Bump Metallization in Sn3.5Ag and Sn37Pb Solders during High-Temperature Storage," Journal of Electronic Materials, vol. 33 no. 8, pp. 900-907, Aug. 2004.

Chen, W. M., Kang, S. K., and Kao, C. R., "Effects of Ti addition to Sn-Ag and Sn-Cu solders," CITE>Journal of Alloys and Compounds, vol. 520, pp. 244-249, Apr. 15, 2012.

Chen, W.-M., McCloskey, P., and O'Mathuna, S. C., "Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders," Microelectronics Reliability , vol. 46 no. 5-6, pp. 896-904, May-June 2006.

Chen, W. M., Yang, T. L., Chung, C. K., and Kao, C. R., "Orientation Relationship between Ni and Cu6Sn5 Formed during Soldering Reaction," Scripta Materialia, vol. xx no. xx, pp. xx-xx, xxxx.

Chen, W. M., and Kao, C. R., "Spectacular Epitaxial Growth of (Cu, Ni)6Sn5 Formed on Ni Substrate," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Chen, W. M., Kang, S. K., and Kao, C. R., "Systematic Investigation of Sn-Ag and Sn-Cu Modified by Minor Alloying Element of Titanium," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 729-735.

Chen, W. M., Yang, S. C., Tsai, M. H., and Kao, C. R., "Uncovering the driving force for massive spalling in the Sn-Cu/Ni system," Scripta Materialia, vol. 63 no. 1, pp. 47-49, July 2010.

Chen, W. T., Ho, C. E., and Kao, C. R., "Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders," Journal of Materials Research, vol. 17 no. 2, pp. 263-266, Feb. 2002.

Chen, W. T., Tsai, R. Y., Lin, Y. L., and Kao, C. R., "Effect of Copper Concentration on the Solid-State Aging Reactions Between Tin-Copper Lead-Free Solders and Nickel," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Chen, W. T., Tsai, R. Y., Lin, Y. L., and Kao, C. R., "Effect of Copper Concentration on the Solid-State Aging Reactions Between Tin-Copper Lead-Free Solders and Nickel," Journal of SMT, vol. 15 no. 4, pp. 40-44, Oct. 2002.

Chen, Wei-Chieh, Chen, Li-Hsing, Lin, Yen-Ting, and Lin, Hao-Hsiung, "Growth direction control of InAs nanowires on (0 0 1) Si substrate with SiO2/Si nano-trench," Journal of Crystal Growth, vol. 463, pp. 27-32, Apr. 1, 2017.

Chen, Wei-Hsun, Sarobol, Pylin, Holaday, John R., Handwerker, Carol A., and Blendell, John E., "Effect of crystallographic texture, anisotropic elasticity, and thermal expansion on whisker formation in b-Sn thin films," Journal of Materials Research, vol. 29 no. 2, pp. 197-206, Jan. 28, 2014.

Chen, Wei-Hsun, Sarobol, Pylin, Handwerker, Carol A., and Blendell, John E., "Heterogeneous Stress Relaxation Processes at Grain Boundaries in High-Sn Solder Films: Effects of Sn Anisotropy and Grain Geometry During Thermal Cycling," JOM, vol. 68 no. 11, pp. 2888-2899, Nov. 2016.

Chen, Wei-Hsun, Wang, Congying, Sarobol, Pylin, Blendell, John, and Handwerker, Carol, "Local variations in grain formation, grain boundary sliding, and whisker growth along grain boundaries in large-grain Sn films," Scripta Materialia, vol. 187, pp. 458-463, Oct. 2020.

Chen, Wei-Jhen, Lee, Yue-Lin, Wu, Ti-Yuan, Chen, Tzu-Ching, Hsu, Chih-Hui, and Lin, Ming-Tzer, "Effects of Electrical Current and External Stress on the Electromigration of Intermetallic Compounds Between the Flip-Chip Solder and Copper Substrate," Journal of Electronic Materials, vol. 47 no. 1, pp. 35-48, Jan. 2018.

Chen, Wei-Min, Zhang, Li-Jun, Du, Yong, and Huang, Bai-Yun, "Diffusivities and Atomic Mobilities of Sn-Ag and Sn-In Melts," Journal of Electronic Materials, vol. 43 no. 4, pp. 1131-1143, Apr. 2014.

Chen, Wei-Min, Zhang, Li-Jun, Liu, Dan-Dan, Du, Yong, and Tan, Cheng-Yu, "Diffusivities and Atomic Mobilities of Sn-Bi and Sn-Pb Melts," Journal of Electronic Materials, vol. 42 no. 6, pp. 1158-1170, June 2013.

Chen, Wei-Yu, Chiu, Tsung-Chieh, Lin, Kwang-Lung, Wu, Albert T., Jang, Wei-Luen, Dong, Chung-Li, amd Lee, Hsin-Yi, "Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress," Scripta Materialia, vol. 68 no. 5, pp. 317-320, Mar. 2013.

Chen, Wei-Yu, Chiu, Tsung-Chieh, Lin, Kwang-Lung, and Lai, Yi-Shao, "Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint," Intermetallics, vol. 26, pp. 40-43, July 2012.

Chen, Wei-Yu, Tu, Wei, Chang, Hsiang-Ching, Chou, Tzu-Ting, and Duh, Jenq-Gong, "Growth orientation of Cu-Sn IMC in Cu/Sn-3.5Ag/Cu-xZn microbumps and Zn-doped solder joints," Materials Letters, vol. 134, pp. 184-186, Nov. 1, 2014.

Chen, Wei-Yu, Yu, Chi-Yang, and Duh, Jenq-Gong, "Improving the shear strength of Sn-Ag-Cu-Ni/Cu-Zn solder joints via modifying the microstructure and phase stability of Cu-Sn intermetallic compounds," Intermetallics, vol. 54, pp. 181-186, Nov. 2014.

Chen, Wei-Yu, Chou, Tzu-Ting, Tu, Wei, Chang, Hsiang-Ching, Lee, Christine Jill, and Duh, Jenq-Gong, "Retarding the Cu-Sn and Ag-Sn intermetallic compounds by applying Cu-xZn alloy on micro-bump in novel 3D-IC technologies," Journal of Materials Science: Materials in Electronics, vol. 26 no. 4, pp. 2357-2362, Apr. 2015.

Chen, Wei-Yu, Yu, Chi-Yang, and Duh, Jenq-Gong, "Suppressing the growth of interfacial Cu-Sn intermetallic compounds in the Sn-3.0Ag-0.5Cu-0.1Ni/Cu-15Zn solder joint during thermal aging," Journal of Materials Science, vol. 47 no. 9, pp. 4012-4018, May 2012.

Chen, Wei-Yu, and Duh, Jenq-Gong, "Suppression of Cu3Sn layer and formation of multi-orientation IMCs during thermal aging in Cu/Sn-3.5Ag/Cu-15Zn transient liquid-phase bonding in novel 3D-IC Technologies," Materials Letters, vol. 186, pp. 279-282, Jan. 1, 2017.

Chen, Weimin, Zhang, Lijun, and Du, Yong, "Diffusivities and atomic mobilities in Sn-Ag-In and Sn-Ag-Sb melts," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 52, pp. 159-168, Mar. 2016.

Chen, Wen-Chih, and Hong, I-Hsuan, "Selecting an E-Scrap Reverse Production System Design Considering Multicriteria and Uncertainty," IEEE Transactions on Electronics Packaging Manufacturing, vol. 31 no. 4, pp. 326-332, Oct. 2008.

Chen, Wen-Hwa, Yu, Ching-Feng, Cheng, Hsien-Chie, and Lu, Su-Tsai, "Crystal size and direction dependence of the elastic properties of Cu3Sn through molecular dynamics simulation and nanoindentation testing," Microelectronics Reliability, vol. 52 no. 8, pp. 1699-1710, Aug. 2012.

Chen, Wen-Hwa, Yu, Ching-Feng, Cheng, Hsien-Chie, Tsai, Yu-min, and Lu, Su-Tsai, "IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging," Microelectronics Reliability , vol. 53 no. 1, pp. 30-40, Jan. 2013.

Chen, Wen-Hwa, Cheng, Hsien-Chie, and Yu, Ching-Feng, "On the Mechanical Properties of Cu3Sn Intermetallic Compound through Molecular Dynamics Simulation and Nanoindentation Testing," 2010 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, Bordeaux, France, Apr. 26-28, 2010, pp. xx-xx.

Chen, Wen-Lin, Yu, Chi-Yang, Ho, Cheng-Ying, and Duh, Jenq-Gong, "Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn-Ag-Cu solder joints," Materials Science and Engineering: A, vol. 613, pp. 193-200, Sept. 8, 2014.

Chen, Wen Xue, Xue, Song Bai, Wang, Hui, Wang, Jian Xin, Han, Zong Jie, and Gao, Li Li, "Effects of Ag on microstructures, wettabilities of Sn-9Zn-xAg solders as well as mechanical properties of soldered joints," Journal of Materials Science: Materials in Electronics, vol. 21 no. 5, pp. 461-467, May 2010.

Chen, Wenjun, Deng, Dunying, and Xiao, Fei, "Electrically conductive adhesives filled with surface modified copper particles," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 288-291.

Chen, Wenjun, Deng, Dunying, and Xiao, Fei, "Isotropically Conductive Adhesives filled with copper nanoparticles and micron-sized flakes," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 280-283.

Chen, Wenxue, Xue, Songbai, Wang, Hui, and Hu, Yuhua, "Effects of Ag on Properties of Sn-9Zn Lead-Free Solder," Rare Metal Materials and Engineering, vol. 39 no. 10, pp. 1702-1706, Oct. 2010.

Chen, WenXue, Xue, Songbai, Wang, Hui, Hu, YuHua, and Wang, Jianxin, "Effects of rare earth Ce on properties of Sn-9Zn lead-free solder," Journal of Materials Science: Materials in Electronics, vol. 21 no. 7, pp. 719-725, July 2010.

Chen, Wenxue, Xue, Songbai, Wang, Hui, Wang, Jianxin, and Han, Zongjie, "Investigation on properties of Ga to Sn-9Zn lead-free solder," Journal of Materials Science: Materials in Electronics, vol. 21 no. 5, pp. 496-502, May 2010.

Chen, Wen-Xue, Xue, Song-Bai, Wang, Hui, and Hu, Yu-Hua, "Reliability studies of Sn-9Zn/Cu and Sn-9Zn-0.3Ag/Cu soldered joints with aging treatment," Journal of Materials Science: Materials in Electronics , vol. 21 no. 8, pp. 779-786, Aug. 2010.

Chen, X. C., Tao, Bo, and Yin, Z. P., "Bulk Resistance Evaluation of Anisotropic Conductive Adhesive Particles Considering the Current Bending Effect," Journal of Electronic Packaging , vol. 134 no. 3, pp. 031007-1-031007-8, Sept. 2012.

Chen, X., Li, M., Ren, X. X., Hu, A. M., and Mao, D. L., "Effect of Small Additions of Alloying Elements on the Properties of Sn-Zn Eutectic Alloy," Journal of Electronic Materials, vol. 35 no. 9, pp. 1734-1739, Sept. 2006.

Chen, X. L., Lan, Y. C., Li, J. Y., Cao, Y. G., and He, M., "Radial growth dynamics of nanowires," Journal of Crystal Growth, vol. 222 no. 3, pp. 586-590, Jan. 2001.

Chen, Xi, Hu, Anmin, Li, Ming, and Mao, Dali, "Effect of a trace of Cr on intermetallic compound layer for tin-zinc lead-free solder joint during aging," Journal of Alloys and Compounds , vol. 470 no. 1-2, pp. 429-433, Feb. 20, 2009.

Chen, Xi, Hu, Anmin, Li, Ming, and Mao, Dali, "Effect of Aging on the Interfacial Reaction between Sn-9Zn-xCr Solder and Cu Substrate," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Chen, Xi, Li, Ming, Ren, Xiaoxue, and Mao, Dali, "Effects of Alloying Elements on the Characteristics of Sn-Zn Lead-free Solder," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Chen, Xi, Hu, Anmin, Li, Ming, and Mao, Dali, "Study on the properties of Sn-9Zn-xCr lead-free solder," Journal of Alloys and Compounds, vol. 459 no. 1-2, pp. 478-484, July 14, 2008.

Chen, Xiancai, Tao, Bo, and Yin, Zhouping, "Investigation of Bulk Resistance for Metal-Coated Polymer Particles Used in Anisotropic Conductive Adhesive," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 485-491.

Chen, Xiancai, Tao, Bo, and Yin, Zhouping, "Simulation for the Contact Resistance of a Single Anisotropic Conductive Adhesive Particle with Rough Surface," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging , Shanghai, China, Aug. 8-11, 2011, pp. 596-600.

Chen, Xiangchen, and Tan, Cher Ming, "Modeling and analysis of gate-all-around silicon nanowire FET," Microelectronics Reliability, vol. 54 no. 6-7, pp. 1103-1108, June-July 2014.

Chen, Xiansong, "Chip Resistor/Capacitor Attachment Using Conductive Epoxy for Hybrid Fiber Optic Modules," Advances in Electronic Packaging 2001, Volume 3, Kauai, Hawaii, July 8-13, 2001, pp. 1497-1502.

Chen, Xiaoer, Wang, Jing, Odoom-Wubah, Tareque, Jing, Xiaolian, Huang, Jiale, Li, Qingbiao, and Zheng, Yanmei, "Microorganism-assisted synthesis of Au/Pd/Ag nanowires," Materials Letters, vol. 165, pp. 29-32, Feb. 15, 2016.

Chen, Xu, Zhang, Jun, Jiao, Chunlei, and Liu, Yanmin, "Bonding Parameters of Anisotropic Conductive Adhesive Film and Peeling Strength," Key Engineering Materials, vol. 297-300 part 2, pp. 918-924, Nov. 2005.

Chen, Xu, Zhang, Jun, Jiao, Chunlei, and Liu, Yanmin, "Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection," Microelectronics Reliability , vol. 46 no. 5-6, pp. 774-785, May-June 2006.

Chen, Xu, Zhou, Jian, Xue, Feng, and Yao, Yao, "Mechanical deformation behavior and mechanism of Sn-58Bi solder alloys under different temperatures and strain rates," Materials Science and Engineering: A, vol. 662, pp. 251-257, Apr. 28, 2016.

Chen, Xu, Zhang, Jun, and Wang, Z. P., "Microscopic Observation of Failure Mechanism of Anisotropic Conductive Film for Flip-chip Joining," The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 453-457.

Chen, Xu, Xue, Feng, Zhou, Jian, Liu, Sidong, and Qian, Guotong, "Microstructure, Thermal and Wetting Properties of Sn-Bi-Zn Lead-Free Solder," Journal of Electronic Materials, vol. 42 no. 8, pp. 2708-2715, Aug. 2013.

Chen, Xu, Zhou, Jian, Xue, Feng, Bai, Jing, and Yao, Yao, "Microstructures and Mechanical Properties of Sn-0.1Ag-0.7Cu-(Co, Ni, and Nd) Lead-Free Solders," Journal of Electronic Materials, vol. 44 no. 2, pp. 725-732, Feb. 2015.

Chen, Xu, Chen, Gang, and Sakane, Masao, "Modified Anand Constitutive Model for Lead-free Solder SN-3.5AG," The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 447-452.

Chen, Xu, and Chen, Gang, and Sakane, Masao, "Prediction of Stress-Strain Relationship With an Improved Anand Constitutive Model For Lead-Free Solder Sn-3.5Ag," IEEE Transactions on Components and Packaging Technologies, vol. 28 no. 1, pp. 111-116, Mar. 2005.

Chen, Xuanlong, Cheng, Ji, Wu, Huiwei, and Liu, Liyuan, "Open Failure Mechanisms of FCBGA Package under Temperature Cycling Stress," 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits, Chengdu, China, July 4-7, 2017, pp. xx-xx.

Chen, Y. H., Shao, T. L., Liu, P. C., Chen, Chih, and Chou, T., "Microstructural evolution during electromigration in eutectic SnAg solder bumps," Journal of Materials Research, vol. 20 no. 9, pp. 2432-2442, Sept. 2005.

Chen, Y., Huang, M. L., and Zhao, N., "Microstructure and interfacial reactions of Sn-Au-Ag solder joints on Cu and Ni substrates," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 534-537.

Chen, Y. J., Huang, K. Y., Chen, H. T., and Kao, C. R., "Au and Pd Embrittlement in Space-Confined Soldering Reactions for 3D IC Applications," 2013 IEEE International Symposium on Advanced Packaging Materials, Irvine, CA, Feb. 27-Mar. 1, 2013, pp. 102-112.

Chen, Y. J., Chang, C. C., Lin, H. Y., Hsu, S. C., and Liu, C. Y., "Fabrication of vertical thin-GaN light-emitting diode by low-temperature Cu/Sn/Ag wafer bonding," Microelectronics Reliability, vol. 52 no. 2, pp. 381-384, Feb. 2012.

Chen, Y. J., Chung, C. K., Yang, C. R., and Kao, C. R., "Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics," Microelectronics Reliability, vol. 53 no. 1, pp. 47-52, Jan. 2013.

Chen, Y. R., Pan, Y. T., Shen, G. S., Liu, D. S., Kuo, C. Y., and Hsu, C. L., "High Speed Testing Method on Leaf-free Solder," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 309-313.

Chen, Y. S., Lee, Yang-Sin, and Lin, Yu-Cheng, "Comparison among Individual Thermal Cycling, Vibration Test and the Combined Test for the Life Estimation of Electronic Components," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 385-388.

Chen, Y. S., Wang, C. S., Fan, C. T., Chang, K. C., and Pu, H. P., "Reliability Assessment of Sn-Pb and Pb-free Solder Joints under the Cyclic Bend and Shear Tests," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Chen, Y. S., Wang, C. S., Wang, T. C., Chan, W. H., Chang, K. C., and Yuan, T. D., "Solder Joint Reliability Assessment for Flip Chip Ball Grid Array Components with Various Designs in Lead-Free Solder Materials and Solder Mask Dimensions," Journal of Electronic Materials, vol. 36 no. 1, pp. 6-16, Jan. 2007.

Chen, Y. Z., Csiszar, G., Cizek, J., Shi, X. H., Borchers, C., Li, Y. J., Liu, F., and Kirchheim, R., "Defect Recovery in Severely Deformed Ferrite Lamellae During Annealing and Its Impact on the Softening of Cold-Drawn Pearlitic Steel Wires," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 47 no. 2, pp. 726-738, Feb. 2016.

Chen, Yanbiao, Yang, Youwen, Chen, Xiangying, Liu, Fei, and Xie, Ting, "Orientation-controllable growth of Sb nanowire arrays by pulsed electrodeposition," Materials Chemistry and Physics, vol. 126 no. 1-2, pp. 386-390, Mar. 15, 2011.

Chen, Yarong, Tian, Yanhong, and Wang, Chunqing, "Interfacial Reaction between Lead-free Solder Ball and Au/Ni/Cu Pad during Laser Reflow Soldering," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Chen, Yarong, He, Zongpeng, Zhang, Zhenming, Yang, Meng, and An, Rong, "Mechanical property and void ratio of several Pb-containing and Pb-free solder joints in space power electronics," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 340-342.

Chen, Yen-Heng, Wang, Yung-Yun, and Wan, Chi-Chao, "Microstructural characteristics of immersion tin coatings on copper circuitries in circuit boards," Surface and Coatings Technology, vol. 202 no. 3, pp. 417-424, Dec. 5, 2007. https://doi.org/10.1016/j.surfcoat.2007.06.004

Chen, Yi-Chia, So, Wwilliam W., and Lee, Chin C., "A Fluxless Bonding Technology Using Indium-Silver Multilayer Composites," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 20 no. 1, pp. 46-51, Mar. 1997.

Chen, Yi-Chia, and Lee, Chin C., "Multilayer Tin-Silver Composite Solders Deposited in High Vacuum," Proceedings of the 1995 International Electronics Packaging Conference, San Diego, CA, Sept. 24-27, 1995, pp. 258-264.

Chen, Yi-Yu, Duh, Jenq-Gong, and Chiou, Bi-Shiou, "The effect of substrate surface roughness on the wettability of Sn-Bi solders," Journal of Materials Science: Materials in Electronics, vol. 11 no. 4, pp. 279-283, June 2000.

Chen, Yilong, Jia, Jianyuan, Fu, Hongzhi, and Zeng, Zhi, "Analysis of the BGA solder Sn-3.0Ag-0.5Cu crack interface and a prediction of the fatigue life under tensile stress," International Journal of Fatigue , vol. 87, pp. 216-224, June 2016.

Chen, Yilong, Jia, Jianyuan, Fu, Hongzhi, and Zhu, Zhaofei, "Development of numerical algorithm to guide solder joint structure and component structural design during manufacturing," Microelectronics Reliability, vol. 71, pp. 134-142, Apr. 2017.

Chen, Yinbo, Wang, Changchang, and Liu, Zhi-Quan, "Fracture characteristic and microstructure evolution of new Sn-Bi-Ag(Cu) solder joints," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Chen, Yinbo, Gao, Yuzhou, Liu, Zhi-Quan, Zhang, Hao, Sugahara, Tohru, Nagao, Shijo, and Suganuma, Katsuaki, "Investigation on the melting and tensile properties of Bi-containing SAC105 lead-free solder alloys," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 464-468.

Chen, Ying, Men, Weiyang, Yuan, Zenghui, Kang, Rui, and Mosleh, Ali, "Nonlinear Damage Accumulation Rule for Solder Life Prediction Under Combined Temperature Profile With Varying Amplitude," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 9 no. 1, pp. 39-50, Jan. 2019.

Chen, Ying, Kraft, Oliver, and Walter, Mario, "Size effects in thin coarse-grained gold microwires under tensile and torsional loading," Acta Materialia, vol. 87, pp. 78-85, Apr. 1, 2015.

Chen, Yu-jen, and Chen, Chih-ming, "Mitigative Tin Whisker Growth Under Mechanically Applied Tensile Stress," Journal of Electronic Materials, vol. 38 no. 3, pp. 415-419, Mar. 2009.

Chen, Yu-Kai, Hsu, Chia-Ming, Chen, Sinn-Wen, Chen, Chih-Ming, and Huang, Yu-Chih, "Phase Equilibria of Sn-Co-Cu Ternary System," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 43 no. 10, pp. 3586-3595, Oct. 2012.

Chen, Yu-Ren, Shen, G. S., Yang, Hung-Chun, and Chiu, Tz-Cheng, "Interconnect Reliability Modeling for Lead-Free Fan-Out Chip Scale Package," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 115-119.

Chen, Yuan, Li, Jinhui, Liu, Lili, and Zhao, Nana, "Polybrominated diphenyl ethers fate in China: A review with an emphasis on environmental contamination levels, human exposure and regulation," Journal of Environmental Management, vol. 113, pp. 22-30, Dec. 30, 2012.

Chen, Yuanming, He, Wei, Zhou, Guoyun, Tao, Zhihua, Wang, Yang, and Luo, Daojun, "Failure Mechanism of Solder Bubbles in PCB Vias during High-temperature Assembly," Circuit World, vol. 39 no. 3, pp. xx-xx, 2013.

Chen, Yue-ting, and Chen, Chih-chi, "Phase Equlibria Studies of the Sn-Sb-Ni System at 270°C," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Chen, Yue-ting, Fang, Gu, and Chen, Chih-chi, "The Isothermal Section of the Sn-Sb-Ni Ternary System at 270°C," Journal of Electronic Materials, vol. 43 no. 9, pp. 3324-3332, Sept. 2014.

Chen, Yue-ting, Chan, Ya-ting, and Chen, Chih-chi, "Wettability and interfacial reactions between the molten Sn-3.0 wt%-Ag-0.5 wt%Cu solder (SAC305) and Ni-Co alloys," Journal of Alloys and Compounds, vol. 507 no. 2, pp. 419-424, Oct. 8, 2010.

Chen, Yujie, An, Xianghai, and Liao, Xiaozhou, "Mechanical behaviors of nanowires," Applied Physics Reviews, vol. 4 no. 3, pp. 031104-1-031104-29, Sept. 2017. https://doi.org/10.1063/1.4989649

Chen, Yunxia, Jin, Yi, and Kang, Rui, "Coupling damage and reliability modeling for creep and fatigue of solder joint," Microelectronics Reliability, vol. 75, pp. 233-238, Aug. 2017.

Chen, Z., He, M., Kumar, A., and Qi, G. J., "Effect of Interfacial Reaction on the Tensile Strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P Solder Joints," Journal of Electronic Materials, vol. 36 no. 1, pp. 17-25, Jan. 2007.

Chen, Z., Talebanpour, B., Huang, Z., Kumar, P., and Dutta, I., "Effect of Processing on the Microstructure and Fracture of Solder Microbumps in 3D Packages," 2013 IEEE 15th Electronics Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp. 534-537.

Chen, Z. G., Shi, Y. W., Xia, Z. D., and Yan, Y. F., "Study on the Microstructure of a Novel Lead-Free Solder Alloy SnAgCu-RE and Its Soldered Joints," Journal of Electronic Materials, vol. 31 no. 10, pp. 1122-1128, Oct. 2002.

Chen, Zhaohui, Jung, Boo Yang, Lim, Sharon Pei Siang, Ho, David Soon Wee, and Zhang, Xiaowu, "Simulation and Testing for Drop Impact Reliability of 3D eWLP," 2015 IEEE 17th Electronics Packaging and Technology Conference, Singapore, Dec. 2-4, 2015, pp. xx-xx.

Chen, Zhe, Chen, Feng, and Tan, Nai-Di, "Controlled solvothermal synthesis of ultrahigh-aspect-ratio Sb2Se3 nanowires and their photoconductive properties," Journal of Materials Science: Materials in Electronics, vol. 26 no. 2, pp. 970-977, Feb. 2015.

Chen, Zhi Gang, and Kim, Young-Ho, "Characteristics of the Interfacial Microstructure of Chip-on-Plastic Joints under Thermal Cycling and Aging Treatment," Journal of Electronic Materials, vol. 36 no. 1, pp. 45-55, Jan. 2007.

Chen, Zhigang, Shi, Yaowu, and Xia, Zhidong, "Constitutive Relations on Creep for SnAgCuRE Lead-Free Solder Joints," Journal of Electronic Materials, vol. 33 no. 9, pp. 964-971, Sept. 2004.

Chen, Zhigang, Shi, Yaowu, Xia, Zhidong, and Yan, Yanfu, "Properties of Lead-Free Solder SnAgCu Containing Minute Amounts of Rare Earth," Journal of Electronic Materials, vol. 32 no. 4, pp. 235-243, Apr. 2003.

Chen, Zhiwen, An, Bing, Wu, Yiping, Liu, Changqing, and Parkin, Rob, "An Investigation of the Influence of Intermetallic Compounds on CompressiveCreep of SAC305/Copper Solder Joints by Modeling," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 322-329.

Chen, Zhiwen, An, Bing, Wu, Yiping, Liu, Changqing, and Parkin, Rob, "Dimensional change in micro-scale solder joint induced by evolution of IMCs," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1234-1239.

Chen, Zhiwen, An, Bing, Wu, Yiping, Liu, Changqing, and Parkin, Rob, "Influence of IMCs Volume Ratio in Micro-scale Solder Joints on their Mechanical Integrity," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 710-716.

Chen, Zhiwen, Liu, Changqing, Wu, Yiping, and An, Bing, "Perpendicular Growth Characteristics of Cu-Sn Intermetallic Compounds at the Surface of 99Sn-1Cu/Cu Solder Interconnects," Journal of Electronic Materials, vol. 44 no. 12, pp. 4836-4845, Dec. 2015.

Chen, Zhiwen, Liu, Changqing, Wu, Yiping, An, Bing, and Zhou, Longzao, "Study of Height Reduction of Sn99Cu1/Cu Solder Joints as a Result of Isothermal Aging," Journal of Electronic Materials, vol. 44 no. 11, pp. 4058-4064, Nov. 2015.

Chen, Zhong, Kumar, Aditya, and Mona, M., "Effect of Phosphorus Content on Cu/Ni-P/Sn-3.5Ag Solder Joint Strength after Multiple Reflows," Journal of Electronic Materials, vol. 35 no. 12, pp. 2126-2134, Dec. 2006.

Chen, Zhong, Cahyadi, Tommy, Li, Ming, Balakrisnan, Bavani, and Chum, Chan Choy, "Fracture Toughness of Cu-Sn Intennetallic Compounds in Electronic Packages," 2003 Proceedings 53rd Electronic Components & Technology Conference , New Orleans, LA, May 27-30, 2003, pp. 844-847.

Chen, Zhong, He, Min, and Qi, Guojun, "Morphology and Kinetic Study of the Interfacial Reaction between the Sn-3.5Ag Solder and Electroless Ni-P Metallization," Journal of Electronic Materials, vol. 33 no. 12, pp. 1465-1472, Dec. 2004.

Chen, Zhuo, He, Hu, Hu, Anmin, and Li, Ming, "Effect of solder alloy composition on its solid-state bonding quality with Ni microcones," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 1497-1500.

Chen, Zhuo, Tian, Wenya, Li, Junhui, and Zhu, Wenhui, "Intermetallic Growth Induced Large-Scale Void Growth and Cracking Failure in Line-Type Cu/Solder/Cu Joints Under Current Stressing," Journal of Electronic Materials, vol. 47 no. 4, pp. 2499-2506, Apr. 2018.

Cheng, Anderson, Chang, Henry H. Y., and Lin, Chia-Yen, "Low Loss & Novel Halogen-Free Laminates for High Frequency Device Applications," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S21_03-1-S21_03-4.

Cheng, Chih-Min, Smith, Sherri L., O'Hara, Wanda, and Buffa, Vito, "Conductive Epoxy Adhesives as Viable Alternatives to Solder: Sn/Pb Component Compatibility," 2002 Advanced Technology Symposium Conference Proceedings, 2002, pp. xx-xx.

Cheng, Chih-Min, Buffa, Vito, O'Hara, Wanda, Xia, Bo, and Shah, Jayesh, "Low cost, high speed reel-to-reel RFID tag assembly," Global SMT & Packaging, vol. 5 no. 7, pp. 17-21, Aug. 2005.

Cheng, Cong-qian, Zhao, Jie, and Xu, Yang, "Effect of high magnetic field on the morphology of (Cu, Ni)6Sn5 at Sn0.3Ni/Cu interface," Materials Letters, vol. xx no. xx, pp. xx-xx, xxxx.

Cheng, Cong-qian, Zhao, Jie, and Xu, Yang, "Kinetics of intermetallic compound layers and Cu dissolution at Sn1.5Cu/Cu interface under high magnetic field," Journal of Materials Research , vol. 25 no. 2, pp. 359-367, Feb. 2, 2010.

Cheng, Cong Qian, Yang, Fen, Zhao, Jie, Wang, Li Hua, and Li, Xiao Gang, "Leaching of heavy metal elements in solder alloys," Corrosion Science , vol. 53 no. 5, pp. 1738-1747, May 2011.

Cheng, Cong-qian, Yang, Peng, Zhao, Jie, Zhu, Feng, and Song, Qing-Yang, "The Growth Behavior of Intermetallic Compound Layers of Sn-3Ag/Cu and Sn/Cu Joints during Soldering and Aging," Proceedings of the 2006 IEEE CPMT Conference on High Density Microsystem Design, Packaging and Component Failure Analysis, Shanghai, June 27-28, 2006, pp. 265-268.

Cheng, Cong qian, Zhao, Jie, Xu, Yang, and Yang, Peng, "The Growth Behaviors of IMC Layers at Soldered and Diffusion Bonding Sn/Cu Interfaces and the Effects of High Magnetic Field," Key Engineering Materials, vol. 373-374, pp. 480-483, 2008.

Cheng, Cong-qian, Zhao, Jie, Xu, Yang, Xu, Fu-min, and Huang, Ming-liang, "The Growth Behaviors of IMC Layers in Solid-liquid Interfacial Reactions of Sn1.5Cu/Cu in High Magnetic Field," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Cheng, Cong-qian, Zhao, Jie, Xu, Yang, Xu, Fu-Min, and Huang, Ming-liang, "The growth behaviours of IMC layers in solid-liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fields," Soldering & Surface Mount Technology, vol. 21 no. 2, pp. 14-18, 2009.

Cheng, Dong-Ming, Wang, Li-Jun, Liu, Yun, Cao, Yu-lian, Li, Li-na, and Gao, Fu-bin, "Solder with discontinuous melting point in semiconductor laser arrays and stacks," Optics & Laser Technology, vol. 35 no. 1, pp. 61-63, Feb. 2003.

Cheng, Fangjie, Ma, Zhaolong, Wang, Ying, and Zou, Qingbin, "Creep Behaviors of Sn0.7Cu0.1Co0.05Ni/Cu Soldering Joints," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 4 no. 12, pp. 2058-2065, Dec. 2014.

Cheng, Fangjie, Nishikawa, Hiroshi, and Takemoto, Tadashi, "Effects of Isothermal Aging on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu-0.2Co Solder," Materials Science Forum, vol. 580-582, pp. 239-242, 2008.

Cheng, Fangjie, Nishikawa, Hiroshi, and Takemoto, Tadashi, "Estimation of the Thermal Fatigue Resistance and Creep Properties of the Co/Ni-Bearing SAC305 Lead-Free Solders by the Strain Rate Change Tensile Test," Materials Transactions, vol. 49 no. 7, pp. 1503-1507, July 2008.

Cheng, Fangjie, Gao, Feng, Nishikawa, Hiroshi, and Takemoto, Tadashi, "Interaction behavior between the additives and Sn in Sn-3.0Ag-0.5Cu-based solder alloys and the relevant joint solderability," Journal of Alloys and Compounds, vol. xxx no. xxx, pp. xx-xx, xxxx.

Cheng, Fangjie, Nishikawa, Hiroshi, and Takemoto, Tadashi, "Microstructural and mechanical properties of Sn-Ag-Cu lead-free solders with minor addition of Ni and/or Co," Journal of Materials Science, vol. 43 no. 10, pp. 3643-3648, May 2008.

Cheng, Fangjie, Gao, Feng, Zhang, Jianyou, Jin, Wenshan, and Xiao, Xin, "Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys," Journal of Materials Science, vol. 46 no. 10, pp. 3424-3429, May 2011.

Cheng, Hsi-Kuei, Huang, Chin-Wen, Lee, Hsuan, Wang, Ying-Lang, Liu, Tzeng-Feng, and Chen, Chih-Ming, "Interfacial reactions between Cu and SnAgCu solder doped with minor Ni," Journal of Alloys and Compounds, vol. 622, pp. 529-534, Feb. 15, 2014.

Cheng, Hsi-Kuei, Lin, Yu-Jie, Chen, Chih-Ming, Liu, Kuo-Chio, Wang, Ying-Lang, and Liu, Tzeng-Feng, "Microstructural Evolution of Cu/Solder/Cu Pillar-Type Structures with Different Diffusion Barriers," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 47 no. 8, pp. 3971-3980, Aug. 2016.

Cheng, Hsien-Chie, Ho, Cheng-Lin, Chen, Wen-Chih, and Yang, Sheng-Shu, "A Study of Process-Induced Deformations of Anisotropic Conductive Film (ACF) Assembly," IEEE Transactions on Components and Packaging Technologies , vol. 29 no. 3, pp. 577-588, Sept. 2006.

Cheng, Hsien-Chie, Ma, Jian-Hao, Fang, Jiunn, and Lu, Su-Tsai, "Mechanical Analysis of Ultra-Thin-Chip-on-Flex (UTCOF) with Anisotropic Conductive Adhesive (ACA) Joints," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Cheng, Hsien-Chie, Lin, Chieh-Sheng, Chen, Wen-Hwa, Hsu, Yung-Yue, and Uang, Ruoh-Huey, "Process-dependent Thermal-mechanical Analysis and Design of a Novel Nanowire-based Anisotropic Conductive Film Assembly," International Microsystems, Packaging, Assembly Conference Taiwan, Taipei, Taiwan, Oct. 18-20, 2006, pp. xx-xx.

Cheng, Hsien-Chie, Hong, Ruei-You, Hu, Hsuan-Chi, and Chen, Wen-Hwa, "Role of Plastic Behaviors of Ni3Sn4 Intermetallic Compound on Solder Joint Reliability," IEEE Transactions on Device and Materials Reliability , vol. 18 no. 1, pp. 18-26, Mar. 2018.

Cheng, Hsien-Chie, Yu, Ching-Feng, and Chen, Wen-Hwa, "Strain- and strain-rate-dependent mechanical properties and behaviors of Cu3Sn compound using molecular dynamics simulation," Journal of Materials Science, vol. 47 no. 7, pp. 3103-3114, Apr. 2012.

Cheng, Hsien-Chie, Ho, Hsiang-Chung, and Lu, Su-Tsai, "Theoretical and Experimental Characterization of Process-induced Thermal-mechanical Behaviors of an Ultra-Thin Chip-on-Film Assembly," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 318-321.

Cheng, Jing, Chen, Samuel, Vianco, Paul, and Li, James C. M., "A New Mechanism for Hillock Formation over Electrodeposited Thin Tin Film," 2008 Proceedings 58th Electronic Components & Technology Conference , Lake Buena Vista, FL, May 27-30, 2008, pp. 472-477.

Cheng, Jing, Vianco, Paul T., Subjeck, Joeseph, and Li, James C. M., "An assessment of Sn whiskers and depleted area formation in thin Sn films using quantitative image analysis," Journal of Materials Science, vol. 46 no. 1, pp. 263-274, Jan. 2011.

Cheng, Jing, Vianco, Paul T., and Li, James C. M., "Hollow tin/chromium whiskers," Applied Physics Letters, vol. 96 no. 18, pp. 184102-1-184102-3, May 3, 2010.

Cheng, Jing, and Vianco, Paul T., "In-Place Tracking for Tin Whiskers and Tin Depleted Areas at Different Stress Status," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 612-618.

Cheng, Jing, Vianco, Paul T., Zhang, Bei, and Li, James C. M., "Nucleation and growth of tin whiskers," Applied Physics Letters, vol. 98 no. 24, pp. 241910-1-241910-3, June 13, 2011.

Cheng, Jing, Yang, Fuqian, Vianco, Paul T., Zhang, Bei, and Li, James C. M., "Optimum Thickness of Sn Film for Whisker Growth," Journal of Electronic Materials, vol. 40 no. 10, pp. 2069-2075, Oct. 2011.

Cheng, Jing, Chen, Samuel, Vianco, Paul T., and Li, James C. M., "Quantitative analysis for hillocks grown from electroplated Sn film," Journal of Applied Physics, vol. 107 no. 7, pp. 074902-1-074902-4, Apr. 2010.

Cheng, Jinxuan, Hu, Xiaowu, Zhang, Zhe, and Li, Qinglin, "Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn-58Bi/Ni(P)/Cu solder joints," Journal of Materials Science: Materials in Electronics, vol. 31 no. 14, pp. 11470-11481, July 2020.

Cheng, Jinxuan, Hu, Xiaowu, and Li, Shuang, "Effects of the surface roughness on wetting properties and interfacial reactions between SAC305 solder and Cu substrate with Ni-W-P coating," Journal of Materials Science: Materials in Electronics, vol. 31 no. 18, pp. 15086-15096, Sept. 2020.

Cheng, Jinxuan, Hu, Xiaowu, and Li, Qinglin, "Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material," Journal of Materials Science: Materials in Electronics, vol. 30 no. 15, pp. 14791-14804, Aug. 2019.

Cheng, Junhua, Zhang, Jian, and Wen, Dijiang, "Comparison of Leaching Characteristics of Lead in Waste CRTs," Advanced Materials Research, vol. 177, pp. 470-474, 2011.

Cheng, L. X., Liu, M. R., Wang, X. Q., Yan, B. H., and Li, G. Y., "Effects of active element Ti on interfacial microstructure and bonding strength of SiO2/ SiO2 joints soldered using Sn3.5Ag4Ti(Ce,Ga) alloy filler," Materials Science and Engineering: A, vol. 680, pp. 317-323, Jan. 5, 2017.

Cheng, L. X., Li, G. Y., Li, Z. L., Wu, Z. Z., and Zhou, B., "Effects of titanium on active bonding between Sn3.5Ag4Ti(Ce,Ga) alloy filler and alumina," Journal of Materials Science: Materials in Electronics , vol. 26 no. 8, pp. 6004-6012, Aug. 2015.

Cheng, L. X., Li, G. Y., Wang, X. Q., Li, Z. L., and Wu, Z. Z., "Influence of active element Ti on interfacial reaction and soldering strength between Sn3.5Ag4Ti(Ce,Ga) alloy filler and Si substrate," Materials Science and Engineering: A, vol. 658, pp. 42-49, Mar. 21, 2016. https://doi.org/10.1016/j.msea.2016.01.100

Cheng, M. D., Chang, S. Y., Yen, S. F., and Chuang, T. H., "Erratum," Journal of Electronic Materials, vol. 33 no. 7, pp. L18, July 2004.

Cheng, M. D., Yen, S. F., Yen, S. F., and Chuang, T. H., "Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu SolderBall Grid Array Packages," Journal of Electronic Materials, vol. 33 no. 3, pp. 171-180, Mar. 2004.

Cheng, M. D., Wang, S. S., and Chuang, T. H., "Soldering Reactions between In49Sn and Ag Thick Films," Journal of Electronic Materials, vol. 31 no. 3, pp. 171-177, Mar. 2002.

Cheng, Rong, Jiang, Kewei, and Li, Xinxin, "Enhanced solder joint bonding strength of electronic packaging with electrowetting effect," Microelectronic Engineering, vol. 88 no. 11, pp. 3244-3248, Nov. 2011.

Cheng, S. L., Lo, C. H., Chuang, C. F., and Lee, S. W., "Site-controlled fabrication of dimension-tunable Si nanowire arrays on patterned (001)Si substrates," Thin Solid Films, vol. 520 no. 8, pp. 3309-3313, Feb. 1, 2012.

Cheng, S. L., Kuo, Z. H., and Chung, C. H., "Structural and Electrical Properties of Ni and Ni-Co Nanowires Synthesized by Electrodeposition in Anodic Alumina Templates," 2011 IEEE 4th International Nanoelectronics Conference, Tao-Yuan, Taiwan, June 21-24, 2011, pp. xx-xx.

Cheng, S. L., Wei, Y. P., and Chung, C. H., "Synthesis of Cobalt Metal Nanowire Arrays and the Interfacial Reactions of Cobalt Nanowires on (001)Si," 2011 IEEE 4th International Nanoelectronics Conference, Tao-Yuan, Taiwan, June 21-24, 2011, pp. xx-xx.

Cheng, Shou Chang, and Lin, Kwang Lung, "Interfacial evolution between Cu and Pb-free Sn-Zn-Ag-Al solders upon aging at 150 °C," Journal of Materials Research, vol. 18 no. 8, pp. 1795-1803, Aug. 2003.

Cheng, Shou Chang, and Lin, Kwang Lung, "The Thermal Property of Lead-Free Sn-8.55Zn-1Ag-XAl Solder Alloys and Their Wetting Interaction with Cu," Journal of Electronic Materials , vol. 31 no. 9, pp. 940-945, Sept. 2002.

Cheng, Shunfeng, Huang, Chien-Ming, and Pecht, Michael, "A review of lead-free solders for electronics applications," Microelectronics Reliability, vol. 75, pp. 77-95, Aug. 2017.

Cheng, T. H., Tsao, L. C., Wang, F. S., and Kuo, W. Y., "Effect of Al2O3 Addition in Sn-Ag-Cu Solder Balls on the Microstructure and Shearing Strength of BGA Packages with Immersion Sn Surface Finish," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 374-378.

Cheng, W. M., and Wu, H. Y., "Lessons learnt from Lead-free Soldering Implementation - Real Example," Proceedings of 2005 International Conference on Asian Green Electronics , Shang Hai, China, Mar. 15-18, 2005, pp. 42-50.

Cheng, W. T., Chih, Y. W., and Lin, C. W., "Formulation and characterization of UV-light-curable electrically conductive pastes," Journal of Adhesion Science and Technology, vol. 19 no. 7, pp. 511-523, 2005.

Cheng, Wen-Tung, Chih, Yu-Wen, and Yeh, Wei-Ting, "In situ fabrication of photocurable conductive adhesives with silver nano-particles in the absence of capping agent," International Journal of Adhesion and Adhesives, vol. xx no. xx, pp. xx-xx, xxxx.

Cheng, X., Liu, C., and Silberschmidt, V. V., "Intermetallics Formation and Evolution in Pure Indium Joint for Cryogenic Application," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 562-566.

Cheng, X., Liu, C., and Silberschmidt, V. V., "Mechanical Response of Indium Micro-joints to Low Temperature Cycling," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1792-1795.

Cheng, X., Liu, C., and Silberschmidt, V. V., "Numerical Analysis of Response of Indium Micro-Joint to Low-Temperature Cycling," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 290-293.

Cheng, Xiaohong, Li, Yongliang, Liu, Haoyan, Zan, Ying, Lu, Yihong, Zhang, Qingzhu, Li, Junjie, Du, Anyan, Wu, Zhenhua, Luo, Jun, and Wang, Wenwu, "Selective wet etching in fabricating SiGe nanowires with TMAH solution for gate-all-around MOSFETs," Journal of Materials Science: Materials in Electronics, vol. 31 no. 24, pp. 22478-22486, Dec. 2020. https://doi-org.ezproxy.uky.edu/10.1007/s10854-020-04748-y

Cheng, Ya-Chi, Wang, Yu-Ting, Hsu, Feng-Chih, Lu, Fang-Ching, Wu, Chung-Lin, and Lin, Ming-Tzer, "Effect of Loading Stress on the Growth of Cn/Sn Intermetallic Compounds at High Temperatures," Journal of Electronic Materials, vol. 44 no. 1, pp. 604-611, Jan. 2015.

Cheng, Yan, Yu, Gang, Tang, Lili, Zhou, Yibo, and Zhang, Gaixiu, "Self-assembled dendritic nanowires of Au-Pt alloy through electrodeposition from solution under AC fields," Journal of Crystal Growth, vol. 334 no. 1, pp. 181-188, Nov. 1, 2011.

Cheng, Yang-Tse, Weiner, Anita M., Wong, Curtis A., Balogh, Michael P., and Lukitsch, Michael J., "Stress-induced growth of bismuth nanowires," Applied Physics Letters , vol. 81 no. 17, pp. 3248-3250, Oct. 21, 2002.

Cheng, Yi-Lung, Chiu, Tai-Jung, Wei, Bor-Jou, Wang, Huan-Jung, Wu, Jiung, and Wang, Ying-Lang, "Effect of copper barrier dielectric deposition process on characterization of copper interconnect," Journal of Vacuum Science & Technology B , vol. 28 no. 3, pp. 567-572, May/June 2010.

Cheng, Yi-Wen, and Siewert, Thomas A., "Predicting Tensile Properties of the Bulk 96.5Sn-3.5Ag Lead-Free Solder," Journal of Electronic Materials, vol. 32 no. 6, pp. 535-540, June 2003.

Cheng, Yung Neng, Lee, Shyong, and Lee, Jye, "Finite Element Analysis of Anisotropic Conductive Film for Chip on Glass Process," Materials and Manufacturing Processes, vol. 17 no. 6, pp. 765-781, Nov. 2002.

Cheng, Yung Neng, Lee, Shyong, and Huang, Fuang Yuan, "Thermomechanical Response of Anisotropically Conductive Film," The International Journal of Microcircuits and Electronic Packaging, vol. 24 no. 4, pp. 379-387, Fourth Quarter 2001.

Cheng, Zhaonian, Cao, Liqiang, Sun, Peng, and Liu, Johan, "Residual Stress in Flip Chip Joining Using Anisotropic Conductive Adhesive," 7th IEEE CPMT International Conference on High Density Microsystem Design, Packaging and Failure Analysis, Shanghai, June 28, 2005, pp. xx-xx.

Chennagiri, Gurudutt, Iyer, Satyanarayan "Satya", and Srihari, Krishnaswami "Hari", "Rework of Lead-Free Area Array Packages Assembled on Ultrathin Flexible Substrates," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 4, pp. 611-621, Apr. 2001.

Chennagiri, Gurudutt, Iyer, Satyanarayan "Satya", Akhbar, Abd Aziz Ali, Hu, Clement, and Faun, Henry, "Solder Voiding in Assemblies Using Via-In-Pad Ball Grid Array Design," South East Asia Technical Training Conference on Electronics Assembly Technologies 2013 Proceedings, Penang, Malaysia, Apr. 17-19, 2013, pp. xx-xx.

Cheong, Hahn-Gil, Song, Dae-Wook, and Park, Jin-Woo, "Transparent film heaters with highly enhanced thermal efficiency using silver nanowires and metal/metal-oxide blankets," Microelectronic Engineering , vol. 146, pp. 11-18, Oct. 1, 2015.

Cheong, Kuan Yew, Ng, Mei Chan, Ismail, Ahmad Badri, and Hussain, Luay Bakir, "Effects of Sb on SnAgCu Lead-free Solder," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Cheong, W. G., Chew, H. B., Guo, T. F., and Cheng, L., "Thermomechanical Analysis of Plastic Ball Grid Arrays With Vapor Pressure Effects," IEEE Transactions on Components and Packaging Technologies , vol. 32 no. 1, pp. 12-19, Mar. 2009.

Cherepanov, Genady P., "On the theory of thermal stresses in a thin film on a ceramic substrate," Journal of Applied Physics, vol. 75 no. 2, pp. 844-849, Jan. 15, 1994.

Cherry, Christopher R., and Gottesfeld, Perry, "Plans to distribute the next billion computers by 2015 creates lead pollution risk," Journal of Cleaner Production, vol. 17 no. 18, pp. 1620-1628, Dec. 2009.

Cheung, Annette Teng, and Xu, Yijin, "Gases Evolved during Cure and Solder Reflow of Encapsulants and Underfills," 2001 Proceedings 51st Electronic Components & Technology Conference , Orlando, FL, May 29-June 1, 2001, pp. 1315-1320.

Chevalier, Pierre-Yves, "A Thermodynamic Evaluation of the Bi-In System," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 12 no. 4, pp. 383-391, Oct.-Dec. 1988.

Chew, C. S., Haseeb, A. S. M. A., and Johan, Mohd.Rafie, "Interfacial Reactions between Sn-3.8 Ag-0.7Cu Solder and Ni-W Alloy Films," 2012 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Nov. 6-8, 2012, pp. xx-xx.

Chew, C. S., Durairaj, R., Haseeb, A. S. M. A., and Beake, B., "Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. % W barrier film by nanoindentation," Soldering & Surface Mount Technology, vol. 27 no. 2, pp. 90-94, 2015.

Chew, C. S., Haseeb, A. S. M. A., and Johan, M. R., "Wetting Behaviour of Lead Free Solder on Electroplated Ni and Ni-W Alloy Barrier Film," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 795-798.

Chew, C. S., Haseeb, A. S. M. A., and Johan, M. R., "Wetting Behaviour of Lead Free Solder on Electroplated Ni and Ni-W Alloy Barrier Film," 2010 IEEE 3rd International Nanoelectronics Conference , Hong Kong, China, Jan. 3-8, 2010, pp. 267-268.

Chew, KaiHwa, Kho, Vincent, and Hwang, Jennie S. "Comparative Wetting Ability of Lead-Free Alloys," Electronic Packaging & Production, vol. xx no. xx, pp. xx, Mar. 2003.

Chew, Kai Hwa, and Pang, John H. L., "Impact of Drop-In Lead Free Solders on Microelectronics Packaging," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2 , Singapore, Dec. 7-9, 2005, pp. 451-454.

Chheda, Bankeem V., Sakthivelan, Sathishkumar, Ramkumar, S. Manian, and Ghaffarian, Reza, "Thermal Shock and Drop Test Behavior of Area Array Packages in Forward and Backward Compatible Assemblies," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 309-316.

Chheda, Bankeem, Ramkumar, S. Manian, and Ghaffarian, Reza, "Thermal Shock and Drop Test Performance of Lead-Free Assemblies with No-Underfill and Corner-Underfill," SMTA International Conference , San Diego, CA, Oct. 4-8, 2009, pp. 48-54.

Chheda, Bankeem V., Ramkumar, S. Manian, and Ghaffarian, Reza, "Thermal Shock and Drop Test Performance of Lead-Free Assemblies with No-Underfill, Corner-Underfill and Full-Underfill," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 935-942.

Chi, C. C., Tsao, L. C., Tsao, C. W., and Chuang, T. H., "Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads," Journal of Materials Engineering and Performance, vol. 17 no. 1, pp. 134-140, Feb. 2008.

Chi, Chih-Chien, and Chuang, Tung-Han, "Intermetallic Reactions in Sn-3.5Ag Solder Ball Grid Array Packages with Ag/Cu and Au/Ni/Cu Pads," Journal of Electronic Materials, vol. 35 no. 3, pp. 471-478, Mar. 2006.

Chi, Chin-Su, Chang, Hen-So, Hsieh, Ker-Chang, and Chung, C. L., "Interfacial Microstructure of Pb-Free and Pb-Sn Solder Balls in the Ball-Grid Array Package," Journal of Electronic Materials, vol. 31 no. 11, pp. 1203-1207, Nov. 2002.

Chi, Shang-Wei, Lee, Hsuan, and Chen, Chih-Ming, "Effects of Cu Plating Formulas on the Solder Joint Reactions," 2017 International Conference on Electronics Packaging, Yamagata, Japan, Apr. 19-22, 2017, pp. 220-222.

Chia, Julian Yan Hon, Cotterell, Brian, and Chai, Tai Chong, "The mechanics of the solder ball shear test and the effect of shear rate," Materials Science and Engineering A, vol. 417 no. 1-2, pp. 259-274, Feb. 15, 2006.

Chia, Julian Yan Hon, Cotterell, Brian, and Cheong, Augustine Yew Heng, "The specific work of fracture in ball shear test and the integrity of solder balls," Materials Science and Engineering: A, vol. 428 no. 1-2, pp. 67-72, July 25, 2006.

Chia, Kar Lin, Choo, Ban Leong, Lee, Sooi Jin, Luang, Cynthia Tan Sok, Tan, Ming Siew, and Truman, Thomas, "Robotic Soldering of Lead Free Alloys," Pan Pacific Symposium 2018 Proceedings, Kamuela, HI, Feb. 5-8, 2018, pp. xx-xx.

Chia, Pay Ying, and Haseeb, A. S. Md Abdul, "Interfacial reactions between electroplated Ni-Zn alloy films and lead-free solders," Journal of Materials Science: Materials in Electronics, vol. 24 no. 9, pp. 3423-3429, Sept. 2013.

Chia, Pay Ying, and Haseeb, A. S. M. A., "Interfacial Reactions between Ni-Zn Alloy Films and Lead-free Solders," 2012 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Nov. 6-8, 2012, pp. xx-xx.

Chia, Pay Ying, and Haseeb, A. S. M. A., "Intermixing reactions in electrodeposited Cu/Sn and Cu/Ni/Sn multilayer interconnects during room temperature and high temperature aging," Journal of Materials Science: Materials in Electronics, vol. 26 no. 1, pp. 294-299, Jan. 2015.

Chiang, Huann-Wu, Chen, Jun-Yuan, Lee, Jeffrey C. B., and Li, S. M., "Interfacial Reaction Study on a Solder Joint with Sn-4Ag-0.5Cu Solder Ball and Sn-7Zn-Al (30 ppm) Solder Paste in a Lead-Free Wafer Level Chip Scale Package," Journal of Electronic Materials, vol. 33 no. 12, pp. 1550-1556, Dec. 2004.

Chiang, Huann-Wu, Chung, Cho-Liang, Chen, Liu-Chin, Li, Yi, Wong, C. P., and Fu, Shen-Li, "Processing and shape effects on silver paste electrically conductive adhesives (ECAs)," Journal of Adhesion Science and Technology, vol. 19 no. 7, pp. 565-578, 2005.

Chiang, Huann-Wu, Chen Jun-Yuan, Chane, Ming-Chuan, Lee, Jeffrey C. B., and Shiau, Gary, "Reliability Testing of WLCSP Lead-Free Solder Joints," Journal of Electronic Materials, vol. 35 no. 5, pp. 1032-1040, May 2006.

Chiang, Huann-Wu, Chang, Kenndy, and Chen, Jun-Yuan, "The Effect of Ag Content on the Formation of Ag3Sn Plates in Sn-Ag-Cu Lead-Free Solder," Journal of Electronic Materials, vol. 35 no. 12, pp. 2074-2080, Dec. 2006.

Chiang, K. N., Chang, C. W., and Lin, J. D., "Analysis of ACA/ACF Package Using Equivalent Spring Method," Proceedings of 3rd Electronics Packaging Technology Conference, Singapore, Dec. 5-7, 2000, pp. 110-116.

Chiang, K. N, Chang, C. W, and Lin, C. T., "Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages," Journal of Electronic Packaging, Transactions of the ASME , vol. 123 no. 4, pp. 331-337, Dec. 2001.

Chiang, Kuo Ning, Lee, Chien Chen, Leen, Chang Chun, and Chen, Kuo Ming, "Current crowding-induced electromigration in SnAg3.0Cu0.5 microbumps," Applied Physics Letters, vol. 88 no. 7, pp. 072102-1-072102-3, Feb. 13, 2006.

Chiang, M. J., and Chuang, T. H., "Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate," Zeitschrift fur Metallkunde, vol. 93 no. 11, pp. 1194-1198, Nov. 2002.

Chiang, M. J., Chang, S. Y., and Chuang, T. H., "Reflow and Burn-in of a Sn-20In-0.8Cu Ball Grid Array Package with a Au/Ni/Cu Pad," Journal of Electronic Materials, vol. 33 no. 1, pp. 34-39, Jan. 2004.

Chiang, P. J., Wu, J. Y., Yu, H. Y., and Kao, C. R., "Creep Behaviors Along Characteristic Crystal Orientations of Sn and Sn-1.8Ag by Using Nanoindentation," JOM, vol. 71 no. 9, pp. 2998-3011, Sept. 2019.

Chiang, P. J., Wu, J. Y., Liao, Y. C., and Kao, C. R., "Creep mechanism in characteristic orientation of Sn and Sn-1.8Ag by nanoindentation," 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Nagasaki, Japan, Apr. 17-21, 2018, pp. 222-225.

Chiang, Shih-Yuan, Wei, Chiu-Chi, Chiang, Te-Hsuan, and Chen, Wei-Lin, "How can electronics industries become green manufacturers in Taiwan and Japan," Clean Technologies and Environmental Policy, vol. 12 no. 6, pp. xx-xx, Dec. 2010.

Chiang, Shih-Yuan, Wei, Chiu-Chi, Chiang, Te-Hsuan, and Chen, Wei-Lin, "How can electronics industries become green manufacturers in Taiwan and Japan," Clean Technologies and Environmental Policy, vol. 13 no. 1, pp. 37-47, Feb. 2011.

Chiang, Shih-Yuan, Wei, Chiu-Chi, Chiang, Te-Hsuan, and Chen, Wei-Lin, "The Key Indicators of Lead-Free Manufacturing in Electronics Industry in Taiwan and Japan," International Conference on Management and Service Science, Beijing, China, Sept. 20-22, 2009, pp. xx-xx.

Chiang, W. K., Chan, Y. C., Ralph, Brian, and Holland, Andew, "Adhesive strength of flip chip packages," International Journal of Adhesion and Adhesives, vol. 28 no. 3, pp. 109-119, Apr. 2008.

Chiang, W. K., and Chan, Y. C., "Reliability of ACF Joint Using Bumpless Chip after Reflow Process," Proceedings of 2004 International IEEE Conference on the Asian Green Electronics, Hong Kong, China, Jan 5-9, 2004, pp. 235-239.

Chiang, W. K., and Chan, Y. C., "Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip - Influence of Reflow Soldering and Environmental Testing," Journal of Electronic Packaging, Transactions of the ASME, vol. 127 no. 2, pp. 113-119, June 2005.

Chiang, Yu-Yan, Cheng, Robbin, and Wu, Albert T., "Effects on Undercooling and Interfacial Reactions with Cu Substrates of Adding Bi and In to Sn-3Ag Solder," Journal of Electronic Materials , vol. 39 no. 11, pp. 2397-2402, Nov. 2010.

Chiavari, C., Martini, C., Poli, G., and Prandstraller, D., "Deterioration of tin-rich organ pipes," Journal of Materials Science , vol. 41 no. 6, pp. 1819-1826, Mar. 2006.

Chiavone, Ken, and Poh, H. T., "HnP Defects by Emulating the Gap between BGA and PCB During Reflow," South East Asia Technical Training Conference on Electronics Assembly Technologies 2016 Proceedings, Penang, Malaysia, Apr, 12-14, 2016, pp. xx-xx.

Chiavone, Ken, "Two surfaces are better than one," Global SMT and Packaging, vol. 13 no. 4, pp. 8-14,16, Apr. 2013.

Chiba, A., Kojima, T., and Wu, W. C., "Sonoelectroplating of Sn - Bi Solder Film from EDTA Bath," Advanced Materials Research, vol. 29-30, pp. 99-102, 2007.

Chibisov, A. N., and Chibisova, M. A., "First-principle calculations of the structural and elastic properties of titanium nanowires," Materials Letters, vol. 141, pp. 333-335, Feb. 15, 2015.

Chibisova, M. A., Chibisov, A. N., and Karpovich, N. F., "Effect of bond population on the elasticity of tungsten nanowires: Ab initio calculation," Computational Materials Science, vol. 114, pp. 99-101, Mar. 2016.

Chicot, D., Tilkin, K., Jankowski, K., and Wymyslowski, A., "Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique," Microelectronics Reliability, vol. 53 no. 5, pp. 761-766, May 2013.

Chidambaram, Devicharan, Vasquez, M. Jaime, Halada, Gary P., and Clayton, Clive R., "Studies on the repassivation behavior of aluminum and aluminum alloy exposed to chromate solutions," Surface and Interface Analysis, vol. 35 no. 2, pp. 226-230, Feb. 2003.

Chidambaram, Devicharan, Clayton, Clive R., and Halada, Gary P., "The role of hexafluorozirconate in the formation of chromate conversion coatings on aluminum alloys," Electrochimica Acta, vol. 51 no. 14, pp. 2862-2871, Mar. 15, 2006.

Chidambaram, Vivek, Hald, John, Ambat, Rajan, and Hattel, Jesper, "A Corrosion Investigation of Solder Candidates for High-temperature Applications," JOM, vol. 61 no. 6, pp. 59-65, June 2009.

Chidambaram, Vivek, Hald, John, and Hattel, Jesper, "Development of Au-Ge based candidate alloys as an alternative to high-lead content solders," Journal of Alloys and Compounds, vol. 490 no. 1-2, pp. 170-179, Feb. 4, 2010.

Chidambaram, Vivek, Hald, John, and Hattel, Jesper, "Development of gold based solder candidates for flip chip assembly," Microelectronics Reliability, vol. 49 no. 3, pp. 323-330, Mar. 2009.

Chidambaram, Vivek, Yeung, Ho Beng, and Shan, Gao, "High Reliability Gold based Solder Alloys for Micro-electronics Packaging for High Temperature Applications," 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 2-6, 2012, pp. xx-xx.

Chidambaram, Vivek, Hattel, Jesper, and Hald, John, "High-temperature lead-free solder alternatives," Microelectronic Engineering, vol. 88 no. 6, pp. 981-989, June 2011.

Chidambaram, Vivek, Rong, Eric Phua Jian, Lip, Gan Chee, and Rhee, Min Woo Daniel, "Performance Enhancement of Au-Ge Eutectic Alloys for High-Temperature Electronics," 2013 IEEE 15th Electronics Packaging Technology Conference , Singapore, Dec. 11-13, 2013, pp. 202-207.

Chidambaram, Vivek, Yeung, Ho Beng, and Shan, Gao, "Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics," Journal of Electronic Materials, vol. 41 no. 8, pp. 2107-2117, Aug. 2012.

Chien, C. W., Liu, C. L., Chen, F. J., Lin, K. H., and Lin, C. S., "Microstructure and properties of carbon-sulfur-containing chromium deposits electroplated in trivalent chromium baths with thiosalicylic acid," Electrochimica Acta, vol. 72, pp. 74-80, June 30, 2012.

Chien, P. Y., Yeh, C. H., Hsu, H. H., and Wu, Albert T., "Polarity Effect in a Sn3Ag0.5Cu/Bismuth Telluride Thermoelectric System," Journal of Electronic Materials, vol. 43 no. 1, pp. 284-289, Jan. 2014.

Chieng-Hong, Lee, Hui-Chuan, Tsai, and Meng-Chieh, Liao, "The Study of The Interfacial Reaction Between Sn/Ni/Cu Substrates of PTH Components and Sn-xAg-xCu Solder Pastes after Performing Wave-Soldering Process," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Chih, Pan Wei, Mesa, Baquiran Joseph Aaron, Hong, Xie, and Hao, Goh Min, "Application and High Temperature Storage Test on Zn-Al-Ge High Temperature Solder for Die Attach," 2014 IEEE 16th Electronics Packaging Technology Conference, Singapore, Dec. 3-5, 2014, pp. 463-468.

Chih, Pan Wei, and Mesa, Baquiran Joseph Aaron, "Process Optimization of Zinc Based High Temperature Lead Free Solder for Die Attach Application," 2016 IEEE 18th Electronics Packaging Technology Conference, Singapore, Nov. 30-Dec. 3, 2016, pp. 394-404.

Chih, Pan Wei, Saludsod Jr., Hamlet, Jay, Roger, Bath, Jasbir, and Chou, Tzu-Chein, "Use of EDXRF for RoHS Compliance Screening in PCBA Manufacturing," IPC Review, vol. 49 no. 3, pp. 9, Mar./Apr. 2007.

Chikaura, Y., Tomimatsu, M., and Nagakura, S., "Growth and Structure of Nickel Crystals from Nickel Bromide by Reduction," Journal of Crystal Growth, vol. 24-25, pp. 334-337, Oct. 1974.

Chikaura, Yoshinori, and Nagakura, Sigemaro, "X-Ray Topographic Study on the Lattice Distortion around Whisker Edges," Japanese Journal of Applied Physics, vol. 11 no. 2, pp. 158-162, Feb. 1972.

Child, Jeff, "Military Market Struggles with RoHS," COTS Journal, pp. xx-xx, July 2009.

Chin, Ian, Wong, Shaw Fong, Malatkar, Pramod, and Canham, Rick, "A Mechanical Fatigue Assessment Methodology to Study Solder Joint Reliability," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Chin, J. W. C., Kok, C. K., Rajmohan, M. M., Yeo, V. S. H., and Said, M. R., "Investigating the Effects of Lead Forming Parameters on Intermetallic Layer Crack Using the Finite-Element Method," Journal of Electronic Materials , vol. 41 no. 4, pp. 774-781, Apr. 2012.

Chin, Jason, Mavoori, Hareesh, Fine, Morris, Moran, Brian, and Keer, Leon M., "Mechanical Properties Database and Fatigue Lifetime Prediction for Solders," Proceedings of the Technical Program NEPCON West '97, Volume 1, Anaheim, CA, Feb. 23-27, 1997, pp. 15-23.

Chin, L. T., Hing, P., Tan, K. S., and Olofinjana, A. O., "Overview and Functional Characterization of Pb-Free Solders," Defect and Diffusion Forum, vol. 297-301, pp. 169-179, 2010.

Chin, Melida, and Hu, S. Jack, "A Multiple Particle Model for the Prediction of Electrical Contact Resistance in Anisotropic Conductive Adhesive Assemblies," IEEE Transactions on Components and Packaging Technologies, vol. 30 no. 4, pp. 745-753, Dec. 2007.

Chin, Melida, Hu, S. Jack, and Barber, James R., "Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging," Journal of Electronic Packaging, vol. 130 no. 2, pp. 021006-1-021006-3, June 2008.

Chin, Melida, Barber, James R., and Hu, S. Jack, "Effect of Elastic Recovery on the Electrical Contact Resistance in Anisotropic Conductive Adhesive Assemblies," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 1., pp. 137-144, Mar. 2006.

Chin, Melida, Iyer, Kaushik A., and Hu, S. Jack, "Prediction of Electrical Contact Resistance for Anisotropic Conductive Adhesive assemblies," IEEE Transactions on Components and Packaging Technologies, vol. 27 no. 2, pp. 317-326, June 2004.

Chin, Spencer, "Agere adopts tin-nickel-copper for lead-free packages," Green SupplyLine, Sept. 20, 2004.

Chin, Spencer, "Agere uncovers tin-nickel-copper for lead-free packages," EE Times , Sept. 20, 2004.

Chin, Spencer, "Lead-free compliance still lagging, says study," EE Times Europe , Nov. 3, 2004.

Chin, Spencer, "Lead-free compliance still lagging, says study," EE Times, Nov. 3, 2004.

Chin, Spencer, "Lead-free compliance still lagging, says study," Green SupplyLine , Nov. 3, 2004.

Chin, Spencer, "Manufacturers starting to get the lead out," EE Times, Jan. 16, 2003.

Chin, Spencer, "Market, legislative forces driving lead-free conversion, says report," EE Times, Aug. 24, 2004.

Chin, Spencer, "Market, legislative forces driving lead-free conversion, says report," Green SupplyLine, Aug. 24, 2004.

Chin, W. K., Chu, H. T., Harn, S. L., and Lee, T. Y., "Conductive Epoxy-Acrylate Film Adhesives," Proceedings of the Technical Program NEPCON East '95, Boston, MA, June 12-15, 1995, pp. 405-414.

Chin, Wei Wei, Chong, Ching Ching, Ng, Lian Huat, and Tay, Cheng Siew, "Air Reflow of Lead-Free Soldering for Fine Pitch BGA," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 100-106.

Chin, Y. T., Lam, P. K., Yow, H. K., and Tou, T. Y., "Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package," Microelectronics Reliability, vol. 48 no. 7, pp. 1079-1086, July 2008.

Chin, Y. T., Lam, P. K., Yow, H. K., and Tou, T. Y., "Transmission electron microscopy studies of interfacial reactions and void formation in lead-free solders with minor elements," Journal of Materials Research, vol. 25 no. 7, pp. 1304-1311, July 2010.

Chinen, Sean M., and Siniawski, Matthew T., "Overview of Fatigue Failure of Pb-Free Solder Joints in CSP/BGA/Flip-Chip Applications," Journal of Microelectronics and Electronic Packaging , vol. 6, pp. 149-153, 2009.

Chinery, Paul, "RoHS2 is coming - will it work better than RoHS?," Electronics Weekly, Jan. 8, 2009.

Chinery, Paul, "The realities of RoHS compliance," Electronics Weekly, Apr. 14, 2005.

Chinn, Jeff, "IST Super-Hydrophobic ALD Coatings," Tin Whisker Group teleconference, June 6, 2012.

Chinnabhandar, Anil, Murthy, H. N. Narasimha, and Krishna, M., "Effect of Dispersing Nano - Materials into Structural Adhesive on the Electrical and Mechanical Properties," Progress in Biomedical Optics and Imaging (Proceedings of SPIE, vol. 6799, BioMEMS and Nanotechnology III) , Canberra, ACT, Australia, Dec. 5, 2007, pp. 67991H-1-67991H-8.

Chinniah, Karuna, Amundan, Kalai Selvan, Kee, Tan Suan, Gill, Diesh, and Raj, Sundra, "Studies on a Newly Discovered White Whiskers Causing Battery Leakage," South East Asia Technical Conference on Electronics Assembly Technologies 2011 , Penang, Malaysia, May 19-20, 2011, pp. xx-xx.

Chintawar, Prashant S., "Electroplating Innovations from Honeywell," Tin Whisker Group Teleconference, March 21, 2018.

Chiotellis, Stylianos, Kernbaum, Sebastian, and Seliger, Gunther, "Remanufacturing process planning for IT equipment," 2008 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 19-21, 2008, pp. xx-xx.

Chiou, Yung-Chuan, Jen, Yi-Ming, and Huang, Shih-Hsiang, "Finite element based fatigue life estimation of the solder joints with effect of intermetallic compound growth," Microelectronics Reliability, vol. 51 no. 12, pp. 2319-2329, Dec. 2011.

Chipara, Mircea, Skomski, Ralph, Kirby, Roger, and Sellmyer, David J., "Ferromagnetic resonance on Ni nanowire arrays," Journal of Materials Research, vol. 26 no. 17, pp. 2169-2174, Sept. 14, 2011.

Chirafisi, A., Boguslavsky, I., Toben, M., Leung, M., and Wong, C., "Belt & Re-work Strippers for Lead-free Solders," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 320-325.

Chiriac, Victor Adrian, and Lee, Tien-Yu Tom, "Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process," Proceedings of the ASME Manufacturing Engineering Division, MED-Vol. 11, Orlando, FL, Nov. 5-10, 2000, pp. 453-459.

Chiriac, Victor Adrian, and Lee, Tien-Yu Tom, "Transient Thermal Analysis of an ACF Package Assembly Process," IEEE Transactions on Components and Packaging Technologies, vol. 24 no. 4, pp. 673-681, Dec. 2001.

Chiu, Chen-nan, Wang. Chao-hong, and Chen, Sinn-wen, "Interfacial Reactions in the Sn-Bi/Te Couples," Journal of Electronic Materials, vol. 37 no. 1, pp. 40-44, Jan. 2008.

Chiu, Chen-nan, Huang, Yu-chih, Zi, An-ren, and Chen, Sinn-wen, "Isoplethal Sections of the Liquidus Projection and the 250°C Phase Equilibria of the Sn-Ag-Cu-Ni Quaternary System at the Sn-Rich Corner," Materials Transactions, vol. 46 no. 11, pp. 2426-2430, 2005.

Chiu, Chen-nan, Hsu, Chia-ming, Chen, Sinn-wen, and Wu, Hsin-jay, "Phase Equilibria of the Sn-Bi-Te Ternary System," Journal of Electronic Materials, vol. 41 no. 1, pp. 22-31, Jan. 2012.

Chiu, Chien-Chia, Wu, Chung-Jung, Peng, Chih-Tang, Chiang, Kuo-Ning, Ku, Terry, and Cheng, Kenny, "Failure Life Prediction and Factorial Design of Lead-Free Flip Chip Package," Journal of the Chinese Institute of Engineers, vol. 30 no. 3, pp. 481-490, May 2007.

Chiu, Chien-Chia, Wu, Chung-Jung, Peng, Chih-Tang, Chiang, Kuo-Ning, Ku, Terry, and Cheng, Kenny, "Lead-Free Flip Chip Package Reliability and the Finite Element-Factorial Design Methodology," International Microsystems, Packaging, Assembly Conference Taiwan, Taipei, Taiwan, Oct. 18-20, 2006, pp. xx-xx.

Chiu, Chien-Chia, Wu, Chung-Jung, Peng, Chih-Tang, Chou, Chan-Yen, Chiang, Kuo-Ning, Ku, Terry, and Cheng, Kenny, "The Reliability Impact of Highly Temperature-Dependent Underfill Material to the Lead-Free Flip Chip Package," 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Como, Italy, Apr. 24-26, 2006, pp. xx-xx.

Chiu, Hsien-Tang, and Cheng, Ming-Feng, "Study of Comparative Tracking Index on Brominated Epoxy and Its Application in Copper Clad Laminates," Journal of Applied Polymer Science, vol. 101 no. 5, pp. 2814-2818, Sept. 5, 2006.

Chiu, M. Y., Chang, S. Y., Tseng, Y. H., Chan, Y. C., and Chuang, T. H., "Characterization of intermetallic compounds formed during the interfacial reactions of liquid Sn and Sn-58Bi solders with Ni substrates," Zeitschrift fur Metallkunde, vol. 93 no. 3, pp. 248-252, Mar. 2002.

Chiu, M. Y., Wang, S. S., and Chuang, T. H., "Intermetallic Compounds Formed during Interfacial Reactions between Liquid Sn-8Zn-3Bi Solders and Ni Substrates," Journal of Electronic Materials , vol. 31 no. 5, pp. 494-499, May 2002.

Chiu, S. H., Shao, T. L., Chen, Chih, Yao, D. J., and Hsu, C. Y., "Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration," Applied Physics Letters, vol. 88 no. 2, pp. 022110-1-022110-3, Jan. 9, 2006.

Chiu, Tsung-Chieh, Chiu, Ying-Ta, and Lin, Kwang-Lung, "Electro-dissolution of the Bi second phase in Sn5Bi solder alloy," Materials Letters, vol. 160, pp. 309-313, Dec. 1, 2015.

Chiu, Tsung-Chieh, and Lin, Kwang-Lung, "Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination," Journal of Materials Research, vol. 23 no. 1, pp. 264-273, Jan. 2008.

Chiu, Tsung-Chieh, and Lin, Kwang-Lung, "The difference in the types of intermetallic compound formed between the cathode and anode of an Sn-Ag-Cu solder joint under current stressing," Intermetallics, vol. 17 no. 12, pp. 1105-1114, Dec. 2009.

Chiu, Tsung-Chieh, and Lin, Kwang-Lung, "The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint," Scripta Materialia, vol. 60 no. 12, pp. 1121-1124, June 2009.

Chiu, Tz-Cheng, Lin, Jyun-Ji, Gupta, Vikas, Edwards, Darvin, and Ahmad, Mudasir, "Board Level Solder Joint Reliability Model for Flip-Chip Ball Grid Array Packages under Compressive Loads," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 646-651.

Chiu, Tz-Cheng, Zeng, Kejun, Stierman, Roger, Edwards, Darvin, and Ano, Kazuaki, "Effect of Thermal Aging on Board Level Drop Reliability for Pb-free BGA Packages," 54th Electronic Components & Technology Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1256-1262.

Chiu, Tz-Cheng, Lin, Jyun-Ji, Yang, Hung-Chun, and Gupta, Vikas, "Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load," Microelectronics Reliability, vol. 50 no. 12, pp. 2037-2050, Dec. 2010.

Chiu, Wei-Lan, Liu, Chien-Min, Haung, Yi-Sa, and Chen, Chih, "Formation of plate-like channels in Cu6Sn5 and Cu3Sn intermetallic compounds during transient liquid reaction of Cu/Sn/Cu structures," Materials Letters, vol. 164, pp. 5-8, Feb. 1, 2016.

Chiu, Y. S., and Kao, C. Robert, "Microstructure evolution of Cu/In/Cu joints after solid-liquid interdiffusion," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 890-895.

Chiu, Y. W., Chan, Y. C., and Lui, S. M., "Electric Field Effects on Short-Circuiting between Adjacent Joints in Fine Pitch Anisotropically Conductive Adhesive Interconnections," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1135-1139.

Chiu, Y. W., Chan, Y. C., and Lui, S. M., "Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects," Microelectronics Reliability, vol. 42, pp. 1945-1951, 2002.

Chiu, Yi-Hsin, Minutillo, Nicholas G., Williams, Robert E. A., Smith, Greg J., McComb, David W., Carlin, John A., Johnston-Halperin, Ezekiel, and Yang, Fengyuan, "Photoluminescence evolution in GaAs/AlGaAs core/shell nanowires grown by MOCVD: Effects of core growth temperature and substrate orientation," Journal of Crystal Growth, vol. 429, pp. 1-5, Nov. 1, 2015.

Chiu, Ying-Ta, Shao, Yu-Hsiu, and Yang, Ping-Feng, "The effects of Ag content in the solder on electromigration behavior," 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference, Kyoto, Japan, Apr. 14-17, 2015, pp. 804-808.

Chizhik, Alexander, Stupakiewicz, Andrzej, Zhukov, Arcady, Maziewski, Andrzej, and Gonzalez, Julian, "Transformation of magnetic domain structure in Co- and Fe-rich amorphous microwires," Journal of Alloys and Compounds, vol. 615 supplement 1, pp. S304-S307, Dec. 5, 2014.

Chizhik, S. A., Matvienko, A. A., Sidelnikov, A. A., and Proost, J., "Modeling electromigration-induced stress evolution and drift kinetics with a stress-dependent diffusivity," Journal of Applied Physics, vol. 88 no. 6, pp. 3301-3309, Sept. 15, 2000.

Cho, Daehwan, and Jeong, Youngjin, "Facile fabrication of porous silicon nanowires using water-based polyvinyl alcohol/silicon tetraacetate solution," Materials Letters, vol. 160, pp. 503-506, Dec. 1, 2015.

Cho, Eou Sik, Ahn, Min Hyung, and Kwon, Sang Jik, "Application of Anisotropic Conductive Film to Fabrication of Molybdenum Field Emitter Arrays Using Transfer Mold Technique," Japanese Journal of Applied Physics, vol. 47 no. 8 Part 1, pp. 6452-6455, Aug. 8, 2008.

Cho, Hae-Young, Kim, Tae-Jin, Kim, Young Min, Kim, Sun-Chul, Park, Jin-Young, and Kim, Young-Ho, "A New Ni-Zn Under Bump Metallurgy for Pb-Free Solder Bump Flip Chip Application," 2010 Proceedings 60th Electronic Components and Technology Conference , Las Vegas, NV, June 1-4, 2010, pp. 151-155.

Cho, Han Seo, Cho, Sukhyeon, Jo, Jihong, Seo, Haenam, Kim, Byongmoon, and Yoo, Jegwang, "Highly reliable processes for embedding discrete passive components into organic substrates," Microelectronics Reliability, vol. 48 no. 5, pp. 739-743, May 2008.

Cho, Hoon, Jo, Hyung-Ho, Kwon, Hyouk-Chon, Lee, Kyung-Whoan, Lee, Sang-Gon, Kim, Byung-Min, and Kim, Young-Jig, "Effect of the reduction ratio and inclusion size of wirebreaks on Cu fine wiredrawing," Wire Journal International, vol. 36 no. 2, pp. 48-52, Feb. 2003.

Cho, Hoon, Jo, Hyung-Ho, and Kim, Byung-Min, "Prediction of wire breaks during fine Cu wiredrawing," Wire Journal International, vol. 35 no. 12, pp. 59-63, Dec. 2002.

Cho, Il-Je, Chae, Kyu-Sang, Kim, Soon-Tae, Wittier, Olaf, and Shin, Young-Eui, "Reliability Assessment of Lead Free Soldered PWBs," Materials Science Forum, vol. 580-582, pp. 259-262, 2008.

Cho, Ilje, Ahn, Jee-Hyuk, Yoon, Jeong-Won, Shin, Young-Eui, and Jung, Seung-Boo, "Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test," Journal of Materials Science: Materials in Electronics, vol. 23 no. 8, pp. 1515-1520, Aug. 2012.

Cho, Junghyun, Meschter, Stephan J., Maganty, Suraj, Starkey, Dale, Gomez, Mario, Edwards, David G., Ekin, Abdullah, Elsken, Kevin, Keeping, Jason, Snugovsky, Polina, and Kennedy, Jeff, "Characterization of Hybrid Conformal Coatings Used for Mitigating Tin Whisker Growth," International Conference on Soldering & Reliability 2013 Proceedings, Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.

Cho, Junghyun, Mallampati, Sandeep, Schoeller, Harry, Yin, Liang, and Shaddock, David, "Developments of Bi-Sb-Cu Alloys as a High-Temperature Pb-Free Solder," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1251-1256.

Cho, Junghyun, Mallampati, Sandeep, Tobias, Russell, Schoeller, Harry, Yin, Liang, and Shaddock, David, "Exploring Bismuth as a New Pb-Free Alternative for High Temperature Electronics," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 432-438.

Cho, Junghyun, Maganty, Suraj, and Meschter, Stephan J., "Innovating the Microstructure of Polyurethane Conformal Coatings for Tin Whisker Mitigation," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 718-725.

Cho, Junghyun, Meschter, Stephan J., Maganty, Suraj, Starkey, Dale, Gomez, Mario, Edwards, David G., Ekin, Abdullah, Elsken, Kevin, Keeping, Jason, Snugovsky, Polina, Kennedy, Jeff, and Romansky, Marianne, "Polyurethane Conformal Coatings Filled with Hard Nanoparticles for Tin Whisker Mitigation," International Conference on Soldering & Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.

Cho, Junghyun, Meschter, Stephan J., Maganty, Suraj, Starkey, Dale, Gomez, Mario, Edwards, David G., Ekin, Abdullah, Elsken, Kevin, Keeping, Jason, Snugovsky, Polina, Kennedy, Jeff, and Romansky, Marianne, "Polyurethane Conformal Coatings Filled with Hard Nanoparticles for Tin Whisker Mitigation," SMTAnews & Journal of Surface Mount Technology , vol. 27 no. 3, pp. 15-21, July-Sept. 2014.

Cho, KeunWoo, Rao, V. Shankar, and Kwon, HyukSang, "Microstructure and electrochemical characterization of trivalent chromium based conversion coating on zinc," Electrochimica Acta, vol. 52 no. 13, pp. 4449-4456, Mar. 20, 2007.

Cho, Moon Gi, Park, Yong Sung, Seo, Sun-Kyoung, Paik, Kyung-Wook, and Lee, Hyuck Mo, "Effect of Ag Addition on the Ripening Growth of Grains at the Interface of Sn-xAg-0.5Cu/Cu During a Reflow," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 12, pp. 1939-1946, Dec. 2011.

Cho, Moon Gi, Park, Yong Sung, Seo, Sun-Kyoung, Paik, Kyung-Wook, and Lee, Hyuck Mo, "Effect of Ag on Ripening Growth of Cu6Sn5 Grains Formed between Molten Sn-xAg-0.5Cu Solders and Cu," 2010 Proceedings 60th Electronic Components and Technology Conference , Las Vegas, NV, June 1-4, 2010, pp. 170-175.

Cho, Moon Gi, Kang, Sung K., Shih, Da-Yuan, and Lee, Hyuck Mo, "Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging," Journal of Electronic Materials, vol. 36 no. 11, pp. 1501-1509, Nov. 2007.

Cho, Moon Gi, Kang, Sung K., Seo, Sun-Kyoung, Shih, Da-Yuan, and Lee, Hyuck Mo, "Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders," Journal of Materials Research, vol. 24 no. 2, pp. 534-543, Feb. 2009.

Cho, Moon Gi, Paik, Kyung Wook, Lee, Hyuck Mo, Booh, Seong Woon, and Kim, Tae-Gyu, "Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion Au Under Bump Metallurgy during Aging," Journal of Electronic Materials , vol. 35 no. 1, pp. 35-40, Jan. 2006.

Cho, Moon Gi, Kang, Sung K., Seo, Sun-Kyoung, Shih, Da-Yuan, and Lee, Hyuck Mo, "Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging," Journal of Electronic Materials, vol. 38 no. 11, pp. 2242-2250, Nov. 2009.

Cho, Moon Gi, Kang, Sung K., and Lee, Hyuck Mo, "Undercooling and microhardness of Pb-free solders on various under bump metallurgies," Journal of Materials Research, vol. 23 no. 4, pp. 1147-1154, Apr. 2008.

Cho, Moon Gi, Seo, Sun-Kyoung, and Lee, Hyuck Mo, "Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies," Materials Transactions, vol. 50 no. 9, pp. 2291-2296, 2009.

Cho, Moon Gi, Seo, Sun-Kyoung, and Lee, Hyuck Mo, "Wettability and interfacial reactions of Sn-based Pb-free solders with Cu-xZn alloy under bump metallurgies," Journal of Alloys and Compounds, vol. xx no. x, pp. xx-xx, xxxx.

Cho, Sang Wan, Han, Kyul, Yi, Yeonjin, Kang, Seong Jun, Yoo, Kyung-Hwa, Jeong, Kwangho, and Whang, Chung-Nam, "Thermal Oxidation Study on Lead-free Solders of Sn-Ag-Cu and Sn-Ag-Cu-Ge," Advanced Engineering Materials, vol. 8 no. 1-2, pp. 111-114, Feb. 2006.

Cho, Steve, Amir, Dudi, and Reichman, Aaron, "Validation of Warpage Limit for Successful Component Surface Mount (SMT)," 2008 Proceedings 58th Electronic Components & Technology Conference , Lake Buena Vista, FL, May 27-30, 2008, pp. 899-906.

Cho, Sungil, Yu, Jin, Kang, Sung K., and Shih, Da-Yuan, "Oxidation Study of Pure Tin and its Alloys via Electrochemical Reduction Analysis," Journal of Electronic Materials, vol. 34 no. 5, pp. 635-642, May 2005.

Cho, Sungil, Yu, Jin, Kang, Sung K., and Shih, Da-Yuan, "The Oxidation of Lead-Free Sn Alloys by Electrochemical Reduction Analysis," JOM, vol. 57 no. 6, pp. 50-52, June 2005.

Cho, Sun-Yun, Lee, Young-Woo, Kim, Kyoo-Seok, Moon, Young-Jun, Lee, Ji-Won, Han, Hyun-Joo, Kim, Mi-Jin, and Jung, Jae-Pil, "Reliability of Sn-8 mass%Zn-3 mass%Bi Lead-Free Solder and Zn Behavior," Materials Transactions, vol. 46 no. 11, pp. 2322-2328, 2005.

Cho, Tae-je, Lee, Kyu-jin, Lee, Min-ho, Ahn, Seung-ho, and Oh, Se-yong, "An Improvement in Reflow Performance of Plastic Packages," 1996 Proceedings 46th Electronic Components & Technology Conference, Orlando, FL, May 28-31, 1996, pp. 931-935.

Cho, Youngjin, and Kim, Jae-Jung, "Lifetime Estimation of an ACF in Navigation (March 2010)," IEEE Transactions on Device and Materials Reliability, vol. 11 no. 1, pp. 106-111, Feb. 2011.

Chockalingam, K., Tonks, M. R., Hales, J. D., Gaston, D. R., Millett, P. C., and Zhang, Liangzhe, "Crystal plasticity with Jacobian-Free Newton-Krylov," Computational Mechanics, vol. 51 no. 5, pp. 617-627, May 2013.

Chockla, Aaron M., Klavetter, Kyle C., Mullins, C. Buddie, and Korgel, Brian A., "Tin-Seeded Silicon Nanowires for High Capacity Li-Ion Batteries," Chemistry of Materials, vol. 24 no. 19, pp. 3738-3745, Oct. 9, 2012.

Choe, Selah, Chuang, Ricky, and Lee, Chin C., "Fluxless Sn-Bi-Au Bonding Process Using Multilayer Design," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 486-488.

Choi, Alan, Roggeman, Brian, and Schwartz, Mark, "Demonstrated Process and Reliability of 0.35 mm Pitch BGA Devices for Mobile Environment" SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 91-97.

Choi, Byung-Chul, Shin, Hang-Sik, Lee, Su-Yol, and Hur, Tak, "Life Cycle Assessment of a Personal Computer and its Effective Recycling Rate," International Journal of Life Cycle Assessment, vol. 11 no. 2, pp. 122-128, Mar. 2006.

Choi, C., and Dasgupta, A., "Effect of Temperature on Vibration Durability of SAC305 Printed Wiring Assemblies," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 745-752.

Choi, C., Al-Bassyiouni, M., Dasgupta, A., de Vries, J. W. C., Balemans, Will, and van Driel, W., "Vibration Durability of Pb-free HVQFN Assemblies," 2010 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, Bordeaux, France, Apr. 26-28, 2010, pp. xx-xx.

Choi, Chung-Seog, Shong, Kil-Mok, Kim, Dong-Ook, Kim, Dong-Woo, and Kim, Young-Seok, "Analysis of Dispersive Characteristics and Structures of Copper Wire Melted by Overcurrent," IEEJ Transactions on Power and Energy, vol. 125 no. 12, pp. 1327-1331, 2005.

Choi, E. K., Lee, K. Y., and Oh, T. S., "Fabrication of multiwalled carbon nanotubes-reinforced Sn nanocomposites for lead-free solder by an electrodeposition process," Journal of Physics and Chemistry of Solids, vol. 69 no. 5-6, pp. 1403-1406, May-June 2008.

Choi, Hyelim, Kaplan, Wayne D., and Choe, Heeman, "Effect of Yttrium on the Fracture Strength of the Sn-1.0Ag-0.5Cu Solder Joints," Journal of Electronic Materials, vol. 45 no. 7, pp. 3259-3262, July 2016.

Choi, Hyung Ouk, Kim, Dae Woo, Kim, Seon Joon, Yang, Seung Bo, and Jung, Hee-Tae, "Role of 1D Metallic Nanowires in Polydomain Graphene for Highly Transparent Conducting Films," Advanced Materials, vol. 26 no. 26, pp. 4575-4581, July 9, 2014.

Choi, Jae-Hoon, Lee, Kwang-Yong, Jun, Sung-Woo, Kim, Young-Ho, and Oh, Tae-Sung, "Contact Resistance of the Chip-on-Glass Bonded 48Sn-52In Solder Joint," Materials Transactions, vol. 46 no. 5, pp. 1042-1046, 2005.

Choi, Jai-Kyoung, Park, Jai-Hyun, and Ahn, Yong-Sik, "Standardization of a shear test method for lead-free solder paste chip joints," Journal of Materials Science, vol. 42 no. 17, pp. 7451-7456, Sept. 2007.

Choi, Jin Hyung, Han, Jin-Woo, Yu, Chong Gun, and Park, Jong Tae, "Hot carrier and PBTI induced degradation in silicon nanowire gate-all-around SONOS MOSFETs," Microelectronics Reliability, vol. xx no. x, pp. xx-xx, xxxx.

Choi, Jin Hyung, Yu, Chong Gun, and Park, Jong Tae, "Nanowire width dependence of data retention and endurance characteristics in nanowire SONOS flash memory," Microelectronics Reliability, vol. 64, pp. 215-219, Sept. 2016.

Choi, Jin-Won, Cha, Ho-Seob, and Oh, Tae-Sung, "Mechanical Properties and Shear Strength of Sn-3.5Ag-Bi Solder Alloys," Materials Transactions, vol. 43 no. 8, pp. 1864-1867, Aug. 2002.

Choi, Jinyong, Cho, Kyoungah, and Kim, Sangsig, "Thermoelectric characteristics of Si nanowires transferred onto plastics in air," Microelectronic Engineering, vol. 111, pp. 126-129, Nov. 2013.

Choi, Jong-Hyeok, Kim, Hyun-Kyung, Jin, En-Mei, Seo, Myung Won, Cho, Jung Sang, Kumar, R. Vasant, and Jeong, Sang Mun, "Facile and scalable synthesis of silicon nanowires from waste rice husk silica by the molten salt process," Journal of Hazardous Materials , vol. 399, pp. 122949-1-122949-8, Nov. 15, 2020.

Choi, Joon Young, Kang, In Soo, Park, Byung Jin, Park, Yun Mook, and Jung, Gi Jo, "Study on Inter-Metallic Compound (IMC) at Interface of Pb-Free Solder and Nickel UBM for Mobile Application," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1802-1808.

Choi, Jun-Ki, and Fthenakis, Vasilis, "Economic Feasibility of Recycling Photovoltaic Modules," Journal of Industrial Ecology, vol. 14 no. 6, pp. 947-964, Dec. 2010.

Choi, Jungwook, and Kim, Jongbaeg, "Suspended Nanowire Bridge Fabricated by Focused Ion Beam as a Hydrogen Sensor," 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Sanya, China, Jan. 6-9, 2008, pp. 927-931.

Choi, Jung-Yeol, and Oh, Tae Sung, "Contact Resistance Comparison of Flip-Chip Joints Produced with Anisotropic Conductive Adhesive and Nonconductive Adhesive for Smart Textile Applications," Materials Transactions, JIM, vol. 56 no. 10, pp. 1711-1718, 2015.

Choi, Kwang-Seong, Sung, Ki-Jun, Bae, Hyun-Cheol, Moon, Jong-Tae, and Eom, Yong-Sung, "Bumping and Stacking Processes for 3D IC using Fluxfree Polymer," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1746-1751.

Choi, Kwang-Seong, Sung, Ki-Jun, Lim, Byeong-Ok, Bae, Hyun-Cheol, Jung, Sunghae, Moon, Jong Tae, and Eom, Yong Sung, "Novel Bumping Material for Stacking Silicon Chips," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 579-583.

Choi, Kwang-Seong, Bae, Ho-Eun, Jeon, Su-Jeong, Bae, Hyun-Cheol, and Eom, Yong-Sung, "Novel Low-Volume Solder-on-Pad (SoP) Material and Process for Flip Chip Bonding using Au Stud Bumps," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 1919-1924.

Choi, Kwang-Seong, Choo, Sun-Woo, Lee, Jong-Jin, Sung, Ki-Jun, Bae, Hyun-Chel, Lim, Byeong-Ok, Moon, Jong-Tae, and Eom, Yong-Sung, "Novel Solder-on-Pad (SoP) Technology for Fine-Pitch Flip Chip Bonding," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 805-809.

Choi, Kyeonggon, Yu, Dong-Youl, Ahn, Sungdo, Kim, Kyoung-Ho, Bang, Jung-Hwan, and Ko, Yong-Ho, "Joint reliability of various Pb-free solders under harsh vibration conditions for automotive electronics," Microelectronics Reliability, vol. 86, pp. 66-71, July 2018.

Choi, Min Young, Choi, Y., Choe, J. I., Kim, M., and Kwon, S. C., "Effect of Solution Chemistry and Electroplating Conditions on the Deposition Rate and Wear Resistance of Eco-friendly Trivalent Chromium Layers," Materials Science Forum, vol. 475-479 part 5, pp. 4005-4008, 2005.

Choi, S., Bieler, T. R., Lucas, J. P., and Subramanian, K. N., "Characterization of the Growth of Intermetallic Interfacial Layers of Sn-Ag and Sn-Pb Eutectic Solders and Their Composite Solders on Cu Substrate During Isothermal Long-Term Aging," Journal of Electronic Materials, vol. 28 no. 11, pp. 1209-1215, Nov. 1999.

Choi, S., Lee, J. G., Guo, F., Bieler, T. R., Subramanian, K. N., and Lucas, J. P., "Creep Properties of Sn-Ag Solder Joints Containing Intermetallic Particles," JOM, vol. 53 no. 6, pp. 22-26, June 2001.

Choi, S., Bieler, T. R., Subramanian, K. N., and Lucas, J. P., "Effects of Pb contamination on the eutectic Sn-Ag solder joint," Soldering & Surface Mount Technology, vol. 13 no. 2, pp. 26-29, 2001.

Choi, S., Lucas, J. P., Subramanian, K. N., and Bieler, T. R., "Formation and growth of interfacial intermetallic layers in eutectic Sn-Ag solder and its composite solder joints," Journal of Materials Science: Materials in Electronics, vol. 11 no. 6, pp. 497-502, Aug. 2000.

Choi, S. L., Gibson, A. W., McDougall, J. L., Bieler, T. R., and Subramanian, K. N., "Mechanical Properties of Sn-Ag Composite Solder Joints Containing Copper-Based Intermetallics," Design & Reliability of Solders and Solder Interconnections, Orlando, FL, Feb. 10-13, 1997, pp. 241-245.

Choi, S., Lee, J. G., Subramanian, K. N., Lucas, J. P., and Bieler, T. R., "Microstructural Characterization of Damage in Thermomechanically Fatigued Sn-Ag Based Solder Joints," Journal of Electronic Materials, vol. 31 no. 4, pp. 292-297, Apr. 2002.

Choi, S., Hwang, S. Y., and Oh, W. S., "Statistical Characterization of Open Failures in the Fine-Pitch COG Interconnection," Journal of Electronic Materials, vol. 37 no. 12, pp. 1851-1857, Dec. 2008.

Choi, S., Subramanian, K., N., Lucas, J. P., and Bieler, T. R., "Thermomechanical Fatigue Behavior of Sn-Ag Solder Joints," Journal of Electronic Materials, vol. 29 no. 10, pp. 1249-1257, Oct. 2000.

Choi, W. J., Yeh, E. C. C., and Tu, K. N., "Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization," Journal of Applied Physics, vol. 94 no. 9, pp. 5665-5671, Nov. 1, 2003.

Choi, W. J., Lee, T. Y., Tu, K. N., Tamura, N., Celestre, R. S., MacDowell, A. A., Bong, Y. Y., Nguyen, L., and Sheng, George T. T., "Structure and Kinetics of Sn Whisker Growth on Pb-Free Solder Finish," 2002 Proceedings 52nd Electronic Components & Technology Conference , San Diego, CA, May 28-31, 2002, pp. 628-633.

Choi, W. J., Lee, T. Y., Tu, K. N., Tamura, N., Celestre, R. S., MacDowell, A. A., Bong, Y. Y., and Nguyen, Luu, "Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction," Acta Materialia, vol. 51 no. 20, pp. 6253-6261, 2003.

Choi, W. K., Kang, S. K., and Shih, D.-Y., "A Study of the Effects of Solder Volume on the Interfacial Reactions in Solder Joints Using the Differential Scanning Calorimetry Technique," Journal of Electronic Materials, vol. 31 no. 11, pp. 1283-1291, Nov. 2002.

Choi, Wanuk, Lee, Jeong Yong, Jung, Bok Hwan, and Lim, Hong Sup, "Microstructure and electrochemical properties of a nanometer-scale tin anode for lithium secondary batteries," Journal of Power Sources, vol. 136 no. 1, pp. 154-159, Sept. 10, 2004.

Choi, Won Kyoung, Yu, Daquan, Lee, Chengkuo, Yan, Liling, Yu, Aibin, Yoon, Seung Wook, Lau, John H., Cho, Moon Gi, Jo, Yoon Hwan, and Lee, Hyuck Mo, "Development of Low Temperature Bonding Using In-Based Solders," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1294-1299.

Choi, Won Kyoung, Premachandran, C. S., Chiew, Ong Siong, Ling, Xie, Ebin, Liao, Khairyanto, Ahmad, Ratmin, Bin, Sheng, Kelvin Chen Wei, Thaw, Phyo Phyo, and Lau, John H., "Development of Novel Intermetallic Joints using Thin Film Indium Based Solder by Low Temperature Bonding Technology for 3D IC Stacking," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 333-338.

Choi, Won Kyoung, Yoon, Seung Wook, and Lee, Hyuck Mo, "Effect of In Addition on Sn-3.5Ag Solder and Joint with Cu Substrate," Materials Transactions, vol. 42 no. 5, pp. 783-789, May 2001.

Choi, Won Kyoung, and Lee, Hyuck Mo, "Effect of Ni Layer Thickness and Soldering Time on Intermetallic Compound Formation at the Interface Between Molten Sn-3.5Ag and Ni/Cu Substrate," Journal of Electronic Materials, vol. 28 no. 11, pp. 1251-1255, Nov. 1999.

Choi, Won Kyoung, and Lee, Hyuck Mo, "Effect of Soldering and Aging Time on Interfacial Microstructure and Growth of Intermetallic Compounds Between Sn-3.5Ag Solder Alloy and Cu Substrate," Journal of Electronic Materials, vol. 29 no. 10, pp. 1207-1213, Oct. 2000.

Choi, Won Kyoung, Jang, Se-Young, Kim, Jong Hoon, Paik, Kyung-Wook, and Lee, Hyuck Mo, "Grain morphology of intermetallic compounds at solder joints," Journal of Materials Research, vol. 17 no. 3, pp. 597-599, Mar. 2002.

Choi, Won Kyoung, Kim, Jong Hoon, Jeong, Sang Won, and Lee, Hyuck Mo, "Interfacial microstructure and joint strength of Sn-3.5 Ag-X (X = Cu, In, Ni) solder joint," Journal of Materials Research, vol. 17 no. 1, pp. 43-51, Jan. 2002.

Choi, Won Kyoung, Kang, Sung K., Sohn, Yoon Chul, and Shih, Da-Yuan, "Study of IMC Morphologies and Phase Characteristics Affected by the Reactions of Ni and Cu Metallurgies with Pb-Free Solder Joints," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1190-1196.

Choi, Yeok In, and Lee, Sangmin, "Comparative study on drain current conduction mechanisms of (100)- and (111)-silicon nanowire using a quantitative current model," Microsystem Technologies, vol. 25 no. 5, pp. 2059-2066, May 2019.

Choi, Yongwon, Shin, Jiwon, Kim, Young Soon, Suk, Kyung-lim, Kim, Il, and Paik, Kyung-Wook, "A Study on the Fine Pitch Chip Interconnection Using Cu/SnAg Bumps and B-stage Non-conductive Films (NCFs) for 3D-TSV Vertical Interconnection," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 1661-1666.

Chonan, Yasunori, Komiyama, Takao, Onuki, Jin, Urao, Ryoichi, Kimura, Takashi, and Nagano, Takahiro, "Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film," Materials Transactions, vol. 43 no. 8, pp. 1887-1890, Aug. 2002.

Chonan, Yasunori, Komiyama, Takao, Onuki, Jin, Urao, Ryoichi, Kimura, Takashi, and Nagano, Takahiro, "Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film," Materials Transactions, vol. 43 no. 8, pp. 1840-1846, Aug. 2002.

Chonan, Yasunori, Komiyama, Takao, and Onuki, Jin, "Reliability and Interfacial Structures of Solder Joint Between Lead Free Solder and Electroless Plated Ni-P Alloy Film," Hyomen Gijutsu (Journal of the Surface Finishing Society of Japan), vol. 54 no. 2, pp. 124-128, Feb. 2003.

Chong, David, Dunn, Clyde, Lewis, Terril, and LeBlanc, Joel, "Moisture Sensitivity of Surface Mount Plastic Packages," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume I, San Jose, CA, Sept. 1-3, 1992, pp. 421-426.

Chong, Desmond Y. R., Ng, Kellin, Tan, Jane Y. N., Low, Patrick T. H., Pang, John H. L., Che, F. X., Xiong, B. S., and Xu, Luhua, "Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 622-629.

Chong, Desmond Y. R., Che, F. X., Pang, John H. L., Ng, Kellin, Tan, Jane Y. N., and Low, Patrick T. H., "Drop impact reliability testing for lead-free and lead-based soldered IC packages," Microelectronics Reliability, vol. 46 no. 7, pp. 1160-1171, 2006.

Chong, Desmond Y. R., Ng, Kellin, Tan, Jane Y. N., Low, Patrick T. H., Pang, John H. L., and Che, F. X., "Drop Test Reliability Assessment of Leaded & lead-Free Solder Joints for IC Packages," 2004 6th International Conference on Electronic Packaging Technology, Singapore, Dec. 8-10, 2004, pp. 210-217.

Chong, Desmond Y. R., Che, F. X., Pang, John H. L., Xu, Luhua, Xiong, B. S., Toh, H. J., and Lim, B. K., "Evaluation on Influencing Factors of Board-Level Drop Reliability for Chip Scale Packages (Fine-Pitch Ball Grid Array)," IEEE Transactions on Advanced Packaging, vol. 31 no. 1, pp. 66-75, Feb. 2008.

Chong, Ser Choong, Tan, Yeow Meng, Chai, Tai Chong, Lim, Samuel, Hnin, Wai Yin, and Cheng, Chek Kweng, "Assembly Challenges of High Density Large Fine Pitch Lead-Free, Flip-Chip Package," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 10-15.

Chong, Su Kong, Goh, Boon Tong, Aspanut, Zarina, Muhamad, Muhamad Rasat, Dee, Chang Fu, and Rahman, Saadah Abdul, "Effect of rf power on the growth of silicon nanowires by hot-wire assisted plasma enhanced chemical vapor deposition (HW-PECVD) technique," Thin Solid Films, vol. 519 no. 15, pp. 4933-4939, May 31, 2011.

Chong, Su Kong, Goh, Boon Tong, Aspanut, Zarina, Muhamad, Muhamad Rasat, Dee, Chang Fu, and Rahman, Saadah Abdul, "Synthesis of indium-catalyzed Si nanowires by hot-wire chemical vapor deposition," Materials Letters, vol. 65 no. 15-16, pp. 2452-2454, Aug. 2011.

Choong, Looh Tchuin, Yi, Peng, and Rutledge, Gregory C., "Three-dimensional imaging of electrospun fiber mats using confocal laser scanning microscopy and digital image analysis," Journal of Materials Science, vol. 50 no. 8, pp. 3014-3030, Apr. 2015.

Chopin, Sheila, and Su, Peng, "Mitigating Whisker Growth on Electroplated Tin Finishes," Surface Mount Technology (SMT), vol. 20 no. 6, pp. xx-xx, June 2006.

Choquette, S. M., and Anderson, I. E., "Advances in the Research of a Sn/Cu-Ni Composite Solder Paste for High Temperature Use," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 369-374.

Choquette, S. M., and Anderson, I. E., "Continued Advances in the Research of a Cu-Ni/Sn High Temperature Pb-Free Composite Solder Paste," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 432-437.

Chorbadjiev, K. G., and Kotzev, D. L., "The effect of fillers upon the properties of electroconductive cyanoacrylate adhesives," International Journal of Adhesion and Adhesives, vol. 8 no. 3, pp. 143-146, July 1988.

Choquette, Stephanie, and Anderson, Iver, "Intermetallic Formation of Sn Solder on Cu-xNi for a Harsh Environment Composite Solder Paste," Pan Pacific Symposium 2018 Proceedings, Kamuela, HI, Feb. 5-8, 2018, pp. xx-xx.

Chotchakornpant, Sirarat, Tippayamontri, Jinusda, and Kongsubto, Prong, "Behavior of Lead Free Solder Joint after Thermal Treatment," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 541-545.

Chou, Chan-Yen, Hung, Tuan-Yu, Yang, Shin-Yueh, Yew, Ming-Chih, Yang, Wen-Kun, and Chiang, Kuo-Ning, "Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact," Microelectronics Reliability, vol. 48 no. 8-9, pp. 1149-1154, Aug.-Sept. 2008.

Chou, Chin-yi, Chen, Sinn-wen, and Chang, Yee-shyi, "Interfacial reactions in the Sn-9Zn-(xCu)/Cu and Sn-9Zn-(xCu)/Ni couples," Journal of Materials Research, vol. 21 no. 7, pp. 1849-1856, July 2006.

Chou, Chin-yi, and Chen, Sinn-wen, "Phase equilibria of the Sn-Zn-Cu ternary system," Acta Materialia , vol. 54 no. 9, pp. 2393-2400, May 2006.

Chou, Fang-Cheng, "Fundamental insights to topological quantum materials: A real-space view of 13 cases by supersymmetry of valence bonds approach," Applied Physics Reviews, vol. 6 no. 1, pp. 011304-1-011304-21, Mar. 2019. https://doi.org/10.1063/1.5066031

Chou, George J. S., and Hilty, Robert D., "Effects of Lead-Free Surface Finishes on Press-Fit Connections," Proceedings of IPC Annual Meeting 2003: Exotic Interconnections and Advanced Process Capability, Minneapolis, MN, Sept. 28-Oct. 2, 2003, pp. S07-2-1 to S07-2-10.

Chou, George J. S., "Evaluation of Plated-Through-Hole Deformation in Lead-Free Press-Fit Connections," Tyco Electronics Publication 503-2, Nov. 16, 2004.

Chou, George J. S., "Microstructure Evolution of SnPb and AnAg/Cu Solder Joints during Thermal Aging," 8th International Symposium on Advanced Packaging Materials , Atlanta, GA, Mar. 3-6, 2002, pp. 39-46.

Chou, George J. S., and Hilty, Robert D., "Solder-Joint Reliability of Lead Free Connector Components," IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies, Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.

Chou, George J. S., "Testing confirms reliable solder joints for lead-free connectors," Green SupplyLine, Mar. 17, 2006.

Chou, George J. S., "Testing confirms reliable solder joints for lead-free connectors," Industrial Control Design Line, Mar. 17, 2006.

Chou, George, "Testing solder joints for Pb-free connectors," EE Times - Asia , vol. xx no. xx, pp. xx-xx, July 1, 2006.

Chou, George J. S., and Hilty, Robert D., "Tin Reflow for Tin Whisker Mitigation," 4th International Symposium on Tin Whiskers, College Park, MD, June 23-24, 2010, pp. xx-xx.

Chou, George J. S., and Hilty, Robert D., "Toward Lead-Free Compliant Pin Connections," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 104-119.

Chou, Sheng-Hung, Sjoberg, Jonas Sigfrid, Lim, Sze Pei, Durham, Maria, Fang, Te-Hua, and Hsiao, Yu-Jen, "SiP Package Defect Case Study- Tombstone and HiP," South East Asia Technical Training Conference on Electronics Assembly Technologies 2017 Proceedings, Penang, Malaysia, Mar. 28-30, 2017, pp. xx-xx.

Chou, Sheng-Hung, Liu, Yan, Durham, Maria, Lim, Sze Pei, Fang, Te-Hua, and Hsiao, Yu-Jen, "Test Method to Evaluate a Robust Ball Grid Array (BGA) Ball Mount Flux," 2016 IEEE 18th Electronics Packaging Technology Conference, Singapore, Nov. 30-Dec. 3, 2016, pp. 623-628.

Chou, Tzu-Ting, Song, Rui-Wen, Chen, Wei-Yu, and Duh, Jenq-Gong, "Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy," Materials Letters, vol. 235, pp. 180-183, Jan. 15, 2019.

Chou, Tzu-Ting, Fleshman, Collin Jordon, Chen, Hao, and Duh, Jenq-Gong, "Improving thermal shock response of interfacial IMCs in Sn-Ag-Cu joints by using ultrathin-Ni/Pd/Au metallization in 3D-IC packages," Journal of Materials Science: Materials in Electronics, vol. 30 no. 3, pp. 2342-2350, Feb. 2019.

Chou, Tzu-Ting, Song, Rui-Wen, Chen, Hao, and Duh, Jenq-Gong, "Low thermal budget bonding for 3D-package by collapse-free hybrid solder," Materials Chemistry and Physics, vol. 238, pp. 121887-1-121887-5, Dec. 1, 2019.

Chou, Tzu-Ting, Chen, Wei-Yu, Fleshman, Collin Jordon, and Duh, Jenq-Gong, "Refinement of the b-Sn Grains in Ni-Doped Sn-3.0Ag-0.5Cu Solder Joints with Cu-Based and Ni-Based Substrates," Journal of Electronic Materials , vol. 47 no. 5, pp. 2911-2919, May 2018.

Chouaibi, B., Radaoui, M., Nafie, N., Fredj, A. Ben, Romdhane, S., and Bouchriha, H., "Study of magnetoconductance effect in silicon nanowires formed by chemical etching in HF/AgNO3 solution: Effect of etching time," Journal of Crystal Growth, vol. 463, pp. 54-58, Apr. 1, 2017.

Choubey, A., Menschow, D., Ganesan, S., and Pecht, M., "Effect of Aging on Pull Strength of SnPb, SnAgCu, and Mixed Solder Joints in Peripheral Surface Mount Components," SMTAnews & Journal of Surface Mount Technology, vol. 19 no. 2, pp. 33-37, Apr.-June 2006.

Choubey, Anupam, and Ghaffarian, Reza, "FEA and Analysis for BGA/CGA Assemblies Under Thermal Cycling," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 509-517.

Choubey, Anupam, Yu, Hao, Osterman, Michael, Pecht, Michael, Yun, Fu, Yonghong, Li, and Ming, Xu, "Intermetallics Characterization of Lead-Free Solder Joints under Isothermal Aging," Journal of Electronic Materials, vol. 37 no. 8, pp. 1130-1138, Aug. 2008.

Choubey, Anupam, Osterman, Michael, and Pecht, Michael, "Microstructure and Intermetallic Formation in SnAgCu BGA Components Attached With SnPb Solder Under Isothermal Aging," IEEE Transactions on Device and Materials Reliability, vol. 8 no. 1, pp. 160-167, Mar. 2008.

Choudhury, Pritha, Ribas, Morgana, Pandher, Ranjit, Kumar, Anil, Mukherjee, Sutapa, Sarkar, Siuli, and Singh, Bawa, "Development of Lead-Free Alloys with Ultra-High Thermomechanical Reliability," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 128-133.

Choudhury, Pritha, Telu, Suresh, Kumar, Anil, Ribas, Morgana, and Sarkar, Siuli, "High Reliability Lead-free Alloys for Performance-Critical Applications," 2018 7th Electronic System-Integration Technology Conference, Dresden, Germany, Sept. 18-21, 2018, pp. xx-xx.

Choudhury, Pritha, Ribas, Morgana, Rangaraju, Raghu Raj, and Sarkar, Siuli, "High Reliability Low Temperature Solder Alloys," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 526-531.

Choudhury, Pritha, Ribas, Morgana, Rangaraju, Raghu Raj, and Sarkar, Siuli, "High-reliability, Low-temperature Solder Alloys," Surface Mount Technology (SMT), pp. 24,26-28,30-32, May 2020.

Choudhury, Pritha, Ribas, Morgana, and Sarkar, Siuli, "High Reliability Mid-Temperature Pb-Free Alloy for Multi-Step Soldering," 2017 IEEE 19th Electronics Packaging Technology Conference, Singapore, Dec. 6-9, 2017, pp. xx-xx.

Choudhury, Pritha, Ribas, Morgana, Kumar, Anil, Mukherjee, Sutapa, Sarkar, Siuli, Pandher, Ranjit, Raut, Rahul, Singh, Bawa, and Bhatkal, Ravi, "New Lead-Free Alloy for High Reliabilty, High Operating Temperature Applications," International Conference on Soldering & Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.

Choudhury, Soud Farhan, and Ladani, Leila, "Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study," Journal of Electronic Packaging, vol. 137 no. 4, pp. 041003-1-041003-10, Dec. 2015.

Choudhury, Soud Farhan, and Ladani, Leila, "Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu6Sn5 Intermetallic," Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 1, Burlingame, CA, July 16-18, 2013, pp. V001T07A020-1-V001T07A020-6.

Choudhury, Soud Farhan, and Ladani, Leila, "Grain Growth Orientation and Anisotropy in Cu6Sn5 Intermetallic: Nanoindentation and Electron Backscatter Diffraction Analysis," Journal of Electronic Materials, vol. 43 no. 4, pp. 996-1004, Apr. 2014.

Choudhury, Soud Farhan, and Ladani, Leila, "Local shear stress-strain response of Sn-3.5Ag/Cu solder joint with high fraction of intermetallic compounds: Experimental analysis," Journal of Alloys and Compounds, vol. 680, pp. 665-676, Sept. 25, 2016.

Choudhury, Soud Farhan, and Ladani, Leila, "Miniaturization of Micro-Solder Bumps and Effect of IMC on Stress Distribution," Journal of Electronic Materials, vol. 45 no. 7, pp. 3683-3694, July 2016.

Choudhury, Soud Farhan, and Ladani, Leila, "Single Crystal Plasticity Finite Element Analysis of Cu6Sn5 Intermetallic," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 46 no. 3, pp. 1108-1118, Mar. 2015.

Chouta, Prashant, Santos, Daryl, Srihari, Hari, Sammakia, Bahgat, Andros, Frank. DiPietro, Mike, "A Shear Strength Study of Lead-Free Solder Spheres for BGA Applications on Different Pad Finishes," 2001 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Feb. 13-15, 2001, pp. xx-xx.

Chow, Jimmy, McMahon, John, McCormick, Heather, Brush, Russell, Thambipillai, Vejeyathaas, Khoo, Kok Wei, Kelly, Matt, and Cole, Marie, "Lead-Free SMT Connector Process Exposure, Reliability, Quality, and Yield Assessment for High Thermal Mass Assemblies," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 658-667.

Chow, Jimmy, McCormick, Heather, Brush, Russell, Hamilton, Craig, Suthakaran, Subramaniam, and Berry, Mike, "Reliability Testing of Leading Edge Components for Handheld Portable Devices," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 357-362.

Chow, Linda L. W., Li, J., and Yuen, Matthew M. F., "Development of Low Temperature Processing Thermoplastic Intrinsically Conductive Polymer," 2002 8th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 3-6, 2002, pp. 127-131.

Chow, Seng Guan, Choi, Won Kyoung, Emigh, Roger, and Ouyang, Eric, "Board Level Solder Joint Reliability Modeling Of Embedded Wafer Level BGA (eWLB) Packages under Temperature Cycling Test Conditions," 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 7-9, 2011, pp. 674-680.

Chowdhury, Emdadul Haque, Rahman, Md. Habibur, Jayan, Rahul, and Islam, Md Mahbubul, "Atomistic investigation on the mechanical properties and failure behavior of zinc-blende cadmium selenide (CdSe) nanowire," Computational Materials Science, vol. 186, pp. 110001-1-110001-9, Jan. 2021. https://doi.org/10.1016/j.commatsci.2020.110001

Chowdhury, Mahmudur R., Ahmed, Sudan, Fahim, Abdullah, Suhling, Jeffrey C., and Lall, Pradeep, "Mechanical Characterization of Doped SAC Solder Materials at High Temperature," 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 31-June 3, 2016, pp. 1202-1208.

Chowdhury, Md Mahmudur R., Hoque, Mohd Aminul, Fu, Nianjun, Suhling, Jeffrey C., Hamasha, Sa'd, and Lall, Pradeep, "Characterization of Material Damage and Microstructural Evolution Occurring in Lead Free Solders Subjected to Cyclic Loading," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 865-874.

Chowdhury, Md Mahmudur R., Hoque, Mohd Aminul, Suhling, Jeffrey C., Hamasha, Sa'd, and Lall, Pradeep, "Effects of Aging on the Damage Accumulation in SAC305 Lead Free Solders Subjected to Cyclic Loading," 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 28-31, 2019, pp. 724-733.

Chowdhury, Md Mahmudur, Hoque, Mohd Aminul, Ahmed, Sudan, Suhling, Jeffrey C., Hamasha, Sa'd, and Lall, Pradeep, "Effects of Mechanical Cycling on the Microstructure of SAC305 Lead Free Solder," 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29-June 1, 2018, pp. 1324-1332.

Chowdhury, Md Mahmudur R., Fu, Nianjun, Suhling, Jeffrey C., and Lall, Pradeep, "Evolution of the Cyclic Stress-Strain Behavior of Doped SAC Solder Materials Subjected to Isothermal Aging," 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 30-June 2, 2017, pp. 1369-1379.

Chowhan. Kishan Singh, "A Study of Lead-Free Soldering and Assembly for RoHS Compliance," TechOnLine.

Chriastelova, J., Trnkova, L. Rizekova, Dimova, K. Pociskova, and Ozvold, M., "Reaction of Liquid Sn-Ag-Cu-Ce Solders with Solid Copper," Journal of Electronic Materials, vol. 40 no. 9, pp. 1956-1961, Sept. 2011.

Chriastelova, Janka, and Ozvold, Milan, "Properties of solders with low melting point." Journal of Alloys and Compounds, vol. 457 no. 1-2, pp. 323-328, June 12, 2008.

Christensen, Frans M., and Olsen, Stig I., "The Potential Role of Life Cycle Assessment in Regulation of Chemicals in the European Union," International Journal of Life Cycle Assessment, vol. 9 no. 5, pp. 327-332, Sept. 2004.

Christian, B., Williams, Graeme, and Michael, Andrew, "Attempts to Consistently Form Voids," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Christian, B., Turner, David, and Romanov, Alexandre, "Leaching of Lead and Other Elements from Portable Electronics," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Christian, B., Smith, Brandon, Lui, Jordan, and Baik, Gyubok, "Studies in the Interaction of Moisture and PCBs, Part 2," International Conference on Soldering & Reliability 2011 Proceedings, Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

Christian, Bev, Eltom, Ahmed, and Ramjattan, Deepchand, "Application of the Flowers of Sulfur Test to the Turbini Corrosion Coupon," International Conference on Soldering & Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.

Christian, Bev, Romanov, Alexandre, and Turner, David, "End-of-Life Leaching of Lead and Other Elements ," Advanced Packaging, vol. 14 no. 10, pp. 28-29, Oct. 2005.

Christian, Bev, "Environmental Legislation that Export Oriented Canadian Electronics Manufacturers Should Take into Consideration," International Conference on Soldering & Reliability 2010 Proceedings, Toronto, Ontario, Canada, May 17-20, 2010, pp. xx-xx.

Christian, Bev, Obaid, Numaira, and Westwood, Adam, "Evaluating Solderability of Surface Finishes," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 16-18, 2012, pp. xx-xx.

Christian, Bev, and Romanov, Alexandre, "Leaching of Lead and Other Elements from Portable Electronics, Part II," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S09-01-1-S09-01-13.

Christian, Bev, and Fry, Michael, "RoHS War Stories," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Christian, Bev, and Fry, Michael, "RoHS war stories," Global SMT and Packaging, vol. 9 no. 6, pp. 10-13, June 2009.

Christian, Bev, and Baik, Gyubok, "Studies in the Interaction of Moisture and PCBs, Part 1," International Conference on Soldering & Reliability 2011 Proceedings, Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

Christian, Bev, and Culver, Aaron, "Tin Pest Disease," International Conference on Lead-free Soldering , Toronto, Canada, May 24-26, 2005, pp. xx-xx.

Christian, Bev, Zgrablic, Leonard, and Turner, David, "Wetting Balance Measurements for Various Component Terminations and Solders," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Christian, Beverley, Romanov, Alexandre, Romanova, Irina, and Turbini, Laura J., "Elemental Compositions of Over 80 Cell Phones," Journal of Electronic Materials, vol. 43 no. 11, pp. 4199-4213, Nov. 2014.

Christen, Kris, "EU e-waste rules drive change in United States," Environmental Science & Technology, vol. 37 no. 1, pp. 13A, Jan. 1, 2003.

Christopher, J. E., Isin, Acar, and Coleman, R. V., "Galvanomagnetic Properties of Single-Crystal Iron Films and Whiskers," Journal of Applied Physics, vol. 38 no. 3, pp. 1322-1324, 1967.

Christuk, Christopher, "Electrically conductive adhesives get smaller," Adhesives & Sealants Industry, vol. 9 no. 2, pp. 40,42, Mar. 2002.

Chromik, R. R., Vinci, R. P., Allen, S. L., and Notis, M. R., "Investigation of the Mechanical Properties of Pb-Free Solder Joints by Nanoindentation," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Chromik, R. R., Vinci, R. P., Allen, S. I., and Notis, M. R., "Measuring the Mechanical Properties of Pb-Free Solder and Sn-Based Intermetallics by Nanoindentation," JOM, vol. 55 no. 6, pp. 66-69, June 2003.

Chromik, R. R., Wang, D-N., Shugar, A., Limata, L., Notis, M. R., and Vinci, R. P., "Mechanical properties of intermetallic compounds in the Au-Sn system," Journal of Materials Research, vol. 20 no. 8, pp. 2161-2172, Aug. 2005.

Chromik, R. R., Vinci, R. P., Allen, S. L., and Notis, M. R., "Nanoindentation measurements on Cu-Sn and Ag-Sn intermetallics formed in Pb-free solder joints," Journal of Materials Research, vol. 18 no. 9, pp. 2251-2261, Sept. 2003.

Chu, Hoang Manh, Nguyen, Minh Van, Vu, Hung Ngoc, and Hane, Kazuhiro, "Fabrication of single-crystal silicon nanowires based on surface wet adhesion," Materials Letters, vol. 152, pp. 94-97, Aug. 1, 2015.

Chu, Huabin, An, Bing, Wu, Fengshun, and Wu, Yiping, "RFID Tag Packaging with Anisotropically Conductive Adhesive," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Chu, Kun-Mo, Lee, Jung-Sub, Cho, Han Seo, Park, Hyo-Hoon, and Jeon, Duk Young, "A Fluxless Flip-Chip Bonding for VCSEL Arrays Using Silver-Coated Indium Solder Bumps," IEEE Transactions on Electronics Packaging Manufacturing , vol. 27 no. 4, pp. 246-253, Oct. 2004.

Chu, Kun-Mo, Choi, Won-Kyoung, Ko, Young-Chul, Lee, Jin-Ho, Park, Hyo-Hoon, and Jeon, Duk Young, "Flip-Chip Bonding of MEMS Scanner for Laser Display Using Electroplated AuSn Solder Bump," IEEE Transactions on Advanced Packaging, vol. 30 no. 1, pp. 27-33, Feb. 2007.

Chu, Kun-Mo, Choi, Jung-Hwan, Lee, Jung-Sub, Cho, Han Seo, Park, Seong-Ook, Park, Hyo-Hoon, and Jeon, Duk Young, "Optoelectronic and Microwave Transmission Characteristics of Indium Solder Bumps for Low-Temperature Flip-Chip Applications," IEEE Transactions on Advanced Packaging, vol. 29 no. 3, pp. 409-414, Aug. 2006.

Chu, Kunmo, Sohn, Yoonchul, and Moon, Changyoul, "A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding," Scripta Materialia , vol. 109, pp. 113-117, Dec. 2015.

Chu, Kunmo, Park, Sunghoon, Lee, Changseung, and Sohn, Yoonchul, "Effect of multiple flip-chip assembly on the mechanical reliability of eutectic Au-Sn solder joint," Journal of Materials Science: Materials in Electronics, vol. 27 no. 9, pp. 9941-9946, Sept. 2016.

Chu, Kunmo, Lee, Changseung, Park, Sung-Hoon, and Sohn, Yoonchul, "Effects of Ag addition and Ag3Sn formation on the mechanical reliability of Ni/Sn solder joints," Microelectronics Reliability, vol. 75, pp. 53-58, Aug. 2017.

Chu, Ming-Hui, Liang, S. W., Chen, Chih, and Huang, Annie T., "Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish," Journal of Electronic Materials, vol. 41 no. 9, pp. 2502-2507, Sept. 2012.

Chu, Quyen, "Lead to Lead-free Manufacturing: Issues and Challenges," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 23-24, 2003, pp. 101-106.

Chu, Robert, "Performance implications for non-solder materials used in the lead-free process (Part 2)," emsnow, Apr. 21, 2005.

Chu, S. N. G., and Li, J. C. M., "Impression creep; a new creep test," Journal of Materials Science , vol. 12 no. 11, pp. 2200-2208, Nov. 1977.

Chu, S. N. G., and Li, J. C. M., "Localized Stress Relaxation by Impression Testing," Materials Science and Engineering, vol. 45 no. 2, pp. 167-171, Sept. 1980.

Chu, Yi-Cheng, Zhan, Chau-Jie, Lin, Han-Wen, Huang, Yu-Wei, and Chen, Chih, "Electromigration in microbumps with Cu-Sn intermetallic compounds," 2016 International Conference on Electronics Packaging, Hokkaido, Japan, Apr. 20-22, 2016, pp. 252-255.

Chuan, Kenny Chiong Kung, Huat, Tan Seak, Liew, Ricky, and Chuan, Tan How, "Package On Package (PoP) Process Characterization And Capability Study," South East Asia Technical Training Conference on Electronics Assembly Technologies 2014 Proceedings, Penang, Malaysia, Apr. 8-10, 2014, pp. xx-xx.

Chuang, C. L., and Tsao, L. C., "Effects of nanoparticles on the thermal, microstructural and mechanical properties of novel Sn3.5Ag0.5Zn composite solders," Journal of Materials Science: Materials in Electronics, vol. 29 no. 5, pp. 4096-4105, Mar. 2018.

Chuang, C. L., Tsao, L. C., Lin, H. K., and Feng, L. P., "Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder," Materials Science and Engineering: A , vol. 558, pp. 478-484, Dec. 15, 2012.

Chuang, C. M., Lui, T. S., and Chen, L. H., "The Characteristics of Vibration Fracture of Pb-Sn and Lead-Free Sn-Zn Eutectic Solders," Journal of Electronic Materials, vol. 30 no. 9, pp. 1232-1240, Sept. 2001.

Chuang, Chiang-Ming, and Lin, Kwang-Lung, "Effect of Microelements Addition on the Interfacial Reaction between Sn-Ag-Cu Solders and the Cu Substrate," Journal of Electronic Materials, vol. 32 no. 12, pp. 1426-1431, Dec. 2003.

Chuang, Chiang-Ming, Shih, Po-Cheng, and Lin, Kwang-Lung, "Mechanical Strength of Sn-3.5Ag-Based Solders and Related Bondings," Journal of Electronic Materials, vol. 33 no. 1, pp. 1-6, Jan. 2004.

Chuang, Chiang-Ming, Hung, Hui-Tzu, Liu, Pei-Chi, and Lin, Kwang-Lung, "The Interfacial Reaction between Sn-Zn-Ag-Ga-Al Solders and Metallized Cu Substrates," Journal of Electronic Materials, vol. 33 no. 1, pp. 7-13, Jan. 2004.

Chuang, Chuang-Ming, Lui, Truan-Sheng, Chen, Li-Hui, and Yin, Tsuey-Mei, "Vibration-Fracture Resistance of Sn-Pb and Sn-Ag Eutectic Solders," Materials Transactions, vol. 42 no. 10, pp. 2064-2070, Oct. 2001.

Chuang, H. Y., Chen, W. M., Shih, W. L., Lai, Y. S., and Kao, C. R., "Critical New Issues Relating to Interfacial Reactions Arising from Low Solder Volume in 3D IC Packaging," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1723-1728.

Chuang, H. Y., Yu, J. J., Kuo, M. S., Tong, H. M., and Kao, C. R., "Elimination of voids in reactions between Ni and Sn: A novel effect of silver," Scripta Materialia, vol. xx no. x, pp. xx-xx, xxxx.

Chuang, Linus C., Moewe, Michael, Ng, Kar Wei, Tran, Thai-Truong D., Crankshaw, Shanna, Chen, Roger, Ko, Wai Son, and Chang-Hasnain, Connie, "GaAs nanoneedles grown on sapphire," Applied Physics Letters, vol. 98, pp. 123101-1-123101-3, 2011.

Chuang, Ricky W., Kim, Dongwook, Park, Jeong, and Lee, Chin C., "A Fluxless Au-Sn Bonding Process of Tin-Rich Compositions Achieved in Ambient Air," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 134-137.

Chuang, Ricky W., Choe, Selah, and Lee, Chin C., "A Fluxless Sn-In Bonding Process Achieving High Re-Melting Temperature," 2001 Proceedings 51st Electronic Components & Technology Conference , Orlando, FL, May 29-June 1, 2001, pp. 671-674.

Chuang, T. H., Huang, Y. T., and Tsao, L. C., "AgIn2/Ag2In Transformations in an In-49Sn/Ag Soldered Joint Under Thermal Aging," Journal of Electronic Materials, vol. 30 no. 8, pp. 945-950, Aug. 2001.

Chuang, T. H., Chi, C. C., and Lin, H. J., "Formation of Whiskers and Hillocks on the Surface of Sn-6.6RE Alloys," Metallurgical and Materials Transactions A, vol. 39 no. 3, pp. 604-612, Mar. 2008. https://doi.org/10.1007/s11661-007-9426-9

Chuang, T. H., Chang, S. Y., Tsao, L. C., Weng, W. P., and Wu, H. M., "Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid Array Packages," Journal of Electronic Materials, vol. 32 no. 3, pp. 195-200, Mar. 2003.

Chuang, T. H., Jain, C. C., and Wang, S. S., "Intermetallic Compounds Formed in In-3Ag Solder BGA Packages with ENIG and ImAg Surface Finishes," Journal of Materials Engineering and Performance , vol. 18 no. 8, pp. 1133-1139, Nov. 2009.

Chuang, T. H., Jain, C. C., and Wu, H. M., "Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish," Journal of Electronic Materials, vol. 37 no. 11, pp. 1734-1741, Nov. 2008.

Chuang, T. H., Yen, S. F., and Cheng, M. D., "Intermetallic Reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni Surface Finishes," Journal of Electronic Materials , vol. 35 no. 2, pp. 302-309, Feb. 2006.

Chuang, T. H., Wu, H. M., Cheng, M. D., Chang, S. Y., and Yen, S.F., "Mechanisms for Interfacial Reactions between Liquid Sn-3.5Ag Solders and Cu Substrates," Journal of Electronic Materials, vol. 33 no. 1, pp. 22-27, Jan. 2004.

Chuang, T. H., Huang, K. W., and Lin, W. H., "Mechanisms for the Intermetallic Formation during the Sn-20In-2.8Ag/Ni Soldering Reactions," Journal of Electronic Materials, vol. 33 no. 4, pp. 374-381, Apr. 2004.

Chuang, T. H., Yu, C. L., Chang, S. Y., and Wang, S. S., "Phase Identification and Growth Kinetics of the Intermetallic Compounds Formed during In-49Sn/Cu Soldering Reactions," Journal of Electronic Materials, vol. 31 no. 6, pp. 640-645, June 2002.

Chuang, T. H., Lin, H. J., and Chi, C. C., "Rapid growth of tin whiskers on the surface of Sn-6.6Lu alloy," Scripta Materialia, vol. 56 no. 1, pp. 45-48, Jan. 2007.

Chuang, T. H., and Lin, H. J., "Size Effect of Rare-Earth Intermetallics in Sn-9Zn-0.5Ce and Sn-3Ag-0.5Cu-0.5Ce Solders on the Growth of Tin Whiskers," Metallurgical and Materials Transactions A, vol. 39 no. 12, pp. 2862-2866, Dec. 2008. https://doi.org/10.1007/s11661-008-9632-0

Chuang, T. H., Wu, M. W., Chang, S. Y., Ping, S. F., and Tsao, L. C., "Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder," Journal of Materials Science: Materials in Electronics, vol. 22 no. 8, pp. 1021-1027, Aug. 2011.

Chuang, Tung-Han, and Yen, Shiu-Fang, "Abnormal Growth of Tin Whiskers in a Sn3Ag0.5Cu0.5Ce Solder Ball Grid Array Package," Journal of Electronic Materials, vol. 35 no. 8, pp. 1621-1627, Aug. 2006.

Chuang, Tung-Han, and Yen, Shiu-Fang, "Abnormal Tin Whisker Growth in Rare Earth Element-Doped Sn3Ag0.5CuXCe Solder Joints," Materials Science Forum, vol. 539-543 part 4, pp. 4019-4024, Mar. 2007.

Chuang, Tung-Han, and Chi, Chih-Chien, "Effect of adding Ge on rapid whisker growth of Sn-3Ag-0.5Cu-0.5Ce alloy," Journal of Alloys and Compounds, vol. 480 no. 2, pp. 974-980, July 8, 2009.

Chuang, Tung-Han, and Wu, Hsing-Fei, "Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder Joints," Journal of Electronic Materials, vol. 40 no. 1, pp. 71-77, Jan. 2011.

Chuang, Tung-Han, Cheng, Chih-Yuan, and Chang, Tao-Chih, "Evaluations of Whisker Growth and Fatigue Reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce Solder Ball Grid Array Packages," Journal of Electronic Materials, vol. 38 no. 12, pp. 2762-2769, Dec. 2009.

Chuang, Tung-Han, and Lin, Hsiu-Jen, "Inhibition of Whisker Growth on the Surface of Sn-3Ag-0.5Cu-0.5Ce Solder Alloyed with Zn," Journal of Electronic Materials, vol. 38 no. 3, pp. 420-424, Mar. 2009.

Chuang, Tung-Han, Lin, Hsiu-Jen, and Tsao, Cheng-Wen, "Intermetallic Compounds Formed During Diffusion Soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In Interlayer," Journal of Electronic Materials, vol. 35 no. 7, pp. 1566-1570, July 2006.

Chuang, Tung-Han, Yen, Shiu-Fang, and Wu, Hui-Min, "Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Immersion Ag Surface Finish," Journal of Electronic Materials, vol. 35 no. 2, pp. 310-318, Feb. 2006.

Chuang, Tung-Han, and Jain, Chao-Chi, "Morphology of the Tin Whiskers on the Surface of a Sn-3Ag-0.5Cu-0.5Nd Alloy," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 42 no. 3, pp. 684-691, Mar. 2011. https://doi.org/10.1007/s11661-010-0454-5

Chuang, Tung-Han, Lin, Hsiu-Jen, and Chi, Chih-Chien, "Oxidation-Induced Whisker Growth on the Surface of Sn-6.6(La, Ce) Alloy," Journal of Electronic Materials, vol. 36 no. 12, pp. 1697-1702, Dec. 2007.

Chuang, Tung-Han, "Rapid whisker growth on the surface of Sn-3Ag-0.5Cu-1.0Ce solder joints," Scripta Materialia, vol. 55 no. 11, pp. 983-986, Dec. 2006.

Chuang, Tung-Han, "Temperature Effects on the Whiskers in Rare-Earth Doped Sn-3Ag-0.5Cu-0.5Ce Solder Joints," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 38A no. 5, pp. 1048-1055, May 2007. https://doi.org/10.1007/s11661-007-9126-5

Chudnovsky, Bella H., Swindler, David L., and Thompson, John R., "A Touch of Gray: SILVER CORROSION and WHISKER GROWTH on power contacts in the industrial atmosphers," IEEE Industry Applications Magazine, vol. 8 no. 5, pp. 45-52, Sept.-Oct. 2002.

Chudnovsky, Bella H., "Degradation of Power Contacts in Industrial Atmosphere: Silver Corrosion and Whiskers." Proceedings of the 48th Holm Conference on Electrical Contacts, 2002, pp. 140-150.

Chudnovsky, Bella H., "Protecting Power Equipment from Corrosion in an Industrial Atmosphere," Square D.

Chudnovsky, Bella H., Swindler, David L., and Thompson, John R., "Silver Corrosion and Whiskers Growth on Power Contacts in Industrial Atmosphere of Pulp and Paper Plants," 2001 Conference Record of Pulp and Paper Industry Technical Conference, Portland, OR, June 18-22, 2001, pp. 155-162.

Chudnovsky, Bella H., Swindler, Dave L., and Thompson, John R., "Silver Whiskers Growth on Power Contacts in Corrosive Industrial Atmospheres," IEEE Industry Applications Society 48th Annual Petroleum and Chemical Industry Conference, Sept. 24-26, 2001. pp. 199-207.

Chue, Ching-Hwei, Chen, Teng-Hui, and Lee, Hwa-Teng, "Effect of Stiffness and Thickness Ratios on Popcorn Cracking in IC Packages," IEEE Transactions on Components and Packaging Technologies, vol. 26 no. 2, pp. 340-348, June 2003.

Chukka, Rami N., Telu, Suresh, NRMR, Bhargava, and Chen, Lang, "A novel method of reducing melting temperatures in SnAg and SnCu solder alloys," Journal of Materials Science: Materials in Electronics, vol. 22 no. 3, pp. 281-285, Mar. 2011.

Chun, Hyun-Suk, Yoon Jeong-Won, and Jung, Seung-Boo, "Solid-state interfacial reactions between Sn-3.5Ag-0.7Cu solder and electroless Ni-immersion Au substrate during high temperature storage test," Journal of Alloys and Compounds, vol. 439 no. 1-2, pp. 91-96, July 31, 2007.

Chung, Bo-Mook, Baek, Yong-Ho, Choi, Jaeho, and Huh, Joo-Youl, "Effects of Pd(P) Thickness on the Microstructural Evolution Between Sn-3Ag-0.5Cu and Ni(P)/Pd(P)/Au Surface Finish During the Reflow Process." Journal of Electronic Materials, vol. 41 no. 12, pp. 3348-3358, Dec. 2012.

Chung, Bo-Mook, Choi, Jaeho, and Huh, Joo-Youl, "Fast Concurrent Growth of Ni3Sn4 and Voids During Solid-State Reaction Between Sn-Rich Solder and Ni Substrates," Journal of Electronic Materials, vol. 41 no. 1, pp. 44-52, Jan. 2012.

Chung, C. K., Yang, C. Y., Liao, M. W., and Li, S. L., "Fabrication of Copper Nanowires by Eelectrodeposition Uusing Anodic Aluminum Oxide Template," 2013 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Suzhou, China, Apr. 7-10, 2013, pp. 1072-1075.

Chung, C.-K., Yang, C. Y., Liao, M. W., and Li, S. L., "Fabrication of copper nanowires using overpotential electrodeposition and anodic aluminium oxide template," IET Micro & Nano Letters, vol. 8 no. 10, pp. 579-581, Oct. 2013.

Chung, C. K., Yu, J. J., Yang, T. L., and Kao, C. R., "Grain Refinement of Solder Materials by Minor Element Addition," 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 22-25, 2013, pp. 124-127.

Chung, C. Key, Mustapha, Faizul, Hua, Fay, and Aspandiar, Raiyo, "An Assessment of Lead Free Solder (Sn3.7Ag0.8Cu) Wettability," Proceedings of 4th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2002, pp. 1-5.

Chung, C. Key, Duh, Jenq-Gong, and Kao, C. R., "Direct evidence for a Cu-enriched region at the boundary between Cu6Sn5 and Cu3Sn during Cu/Sn reaction," Scripta Materialia, vol. 63 no. 2, pp. 258-260, July 2010.

Chung, C. Key, and Tai, Siew Fong, "Evolution of Ag3Sn During Reflow Soldering," The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 116-120.

Chung, C. Key, Chen, Y. J., Yang, T. L., and Kao, C. R., "Reactions of Sn-4.0Ag-0.5Cu on Cu and Electroless Ni Substrate in Premelting Soldering Process," Journal of Electronic Materials, vol. 42 no. 6, pp. 1254-1259, June 2013.

Chung, C. Key, Huang, T. C., Shia, R., Yang, T. L., and Kao, C. R., "Roles of phosphorous in Sn4Ag0.5Cu solder reaction with electrolytic Ni-Au," Journal of Alloys and Compounds, vol. 539, pp. 57-62, Oct. 25, 2012.

Chung, C. Key, Leong, K. F., and Sim, K. S., "Solder Imprint Technology: A reverse growth of Intermetallic Compound at the interface to fix the brittle interfacial fracture of BGA package soldered on Ni/Au plating," Proceedings of 4th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2002, pp. 45-49.

Chung, C. Key, Chen, Y. J., Li, C. C., and Kao, C. R., "The critical oxide thickness for Pb-free reflow soldering on Cu substrate," Thin Solid Films, vol. 520 no. 16, pp. 5346-5352, June 1, 2012.

Chung, C. Key, Aspandiar, Raiyo, Leong, K. Foo, and Tay, Cheng Siew, "The Interactions of Lead (Pb) in Lead Free Solder (Sn/Ag/Cu) System," 2002 Proceedings 52nd Electronic Components & Technology Conference , San Diego, CA, May 28-31, 2002, pp. 168-175.

Chung, C. Key, Zhu, Z. X., and Kao, C. R., "Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflow," Journal of Electronic Materials, vol. 44 no. 2, pp. 744-750, Feb. 2015.

Chung, Chang-Kyu, Sim, Gi-Dong, Lee, Soon-Bok, and Paik, Kyung-Wook, "Effects of Conductive Particles on the Electrical Stability and Reliability of Anisotropic Conductive Film Chip-on-Board Interconnections," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 2 no. 3, pp. 359-366, Mar. 2012.

Chung, Chang-Kyu, and Paik, Kyung-Wook, "Effects of the Degree of Cure on the Electrical and Mechanical Behavior of Anisotropic Conductive Films," Journal of Electronic Materials, vol. 39 no. 4, pp. 410-418, Apr. 2010.

Chung, Chang-Kyu, Kim, Jae-Han, Lee, Jong-Won, Seo, Kyoung-Won, and Paik, Kyung-Wook, "Enhancement of electrical stability of anisotropic conductive film (ACF) interconnections with viscosity-controlled and high Tg ACFs in fine-pitch chip-on-glass applications," Microelectronics Reliability, vol. 52 no. 1, pp. 217-224, Jan. 2012.

Chung, Chang-Kyu, and Paik, Kyung-Wook, "The Effects of the Degree of Cure of Anisotropic Conductive Films (ACFs) on the Contraction Stress Build-up of ACFs and ACF joints stability for ACF Flip-Chip interconnection," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 20-24.

Chung, Chang-Kyu, and Paik, Kyung-Wook, "The Effects of the Degree of Cure of Anisotropic Conductive Films (ACFs) on the Contraction Stress Build-up of ACFs and ACF Joints Stability for Chip-On-Flex (COF) Applications," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 161-167.

Chung, Chang-Kyu, Kwon, Yong-Min, Kim, Il, Son, Ho-Young, Choo, Kyo-Sung, Kim, Sung-Jin, and Paik, Kyung-Wook, "Theoretical Prediction and Experimental Measurement of the Degree-of-Cure of Anisotropic Conductive Film (ACF) for Chip-On-Flex (COF) Applications," 9th International Conference on Electronic Materials and Packaging, Daejon, Korea, Nov. 19-22, 2007, pp. xx-xx.

Chung, Chang-Kyu, Kwon, Yong-Min, Kim, Il, Son, Ho-Young, Choo, Kyo-Sung, Kim, Sung-Jin, and Paik, Kyung-Wook, "Theoretical Prediction and Experimental Measurement of the Degree of Cure of Anisotropic Conductive Films (ACFs) for Chip-On-Flex (COF) Applcations," Journal of Electronic Materials, vol. 37 no. 10, pp. 1580-1590, Oct. 2008.

Chung, Cho-Liang, Moon, Kyoung-sik, and Wong, C. P., "Influence of Flux on Wetting Behavior of Lead-Free Solder Balls during the Infrared-Reflow Process," Journal of Electronic Materials, vol. 34 no. 7, pp. 994-1001, July 2005.

Chung, Cho-Liang, Lu, Liang-Tien, and Lee, Yao-Jung, "Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package)," Microelectronics Reliability, vol. 45 no. 12, pp. 1916-1923, Dec. 2005.

Chung, Chun-Jen, and Wee, Hui-Ming, "Ecological product design value and remanufacturing for green short life-cycle product with warranty-dependent demand in supply chain," International Conference on Management and Service Science, Beijing, China, Sept. 20-22, 2009, pp. xx-xx.

Chung, Hsang-mou, Chen, Chih-ming, Lin, Chi-pu, and Chen, Chia-ju, "Microstructural evolution of the Au-20 wt.% Sn solder on the Cu substrate during reflow," Journal of Alloys and Compounds, vol. 485 no. 1-2, pp. 219-224, Oct. 19, 2009.

Chung, Kevin, Dreier, Garrett, Boyle, Andrew, Fitzgerald, Pat, Sager, Jeffrey, and Lin, Martin, "MCM Die Attachment Using Low-Stree, Thermally-Conductive Epoxies," Surface Mount Technology (SMT), vol. 5 no. 5, pp. 42-45, May 1991.

Chung, Kevin, "New Approaches to Reliable Flexible Interconnections for CSPs," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Dec. 1999.

Chung, Kevin, Dreier, Garret, Fitzgerald, Patricia, Boyle, Andrew, Lin, Martin, and Sager, Jeffrey, "Z-Axis Conductive Adhesive for TAB and Fine Pitch Interconnects," 1991 Proceedings 41st Electronic Components & Technology Conference, Atlanta, GA, May 11-16, 1991, pp. 345-354.

Chung, Kevin, Devereaux, Thomas, Monti, Claire, Yan, Min, and Mescia, Nicholas, "Z-Axis Conductive Adhesives as Solder Replacement," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume 1, San Jose, CA, Aug. 31-Sept. 2, 1993, pp. 554-560.

Chung, Kevin, Fleishman, Robert, Bendorovich, David, and Yan, Min, "Z-Poxy as Solder Replacement for Surface Mounting Applications," Proceedings of the 1992 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 1847), San Francisco, CA, Oct. 19-21, 1992, pp. 518-522.

Chung, Kuan-Jung, Yang, Liyu, Wang, Bing-Yu, and Wu, Chia-Che, "The Investigation of Modified Norris-Landzberg Acceleration Models for Reliability Assessment of Ball Grid Array Packages," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Chung, Kuan-Jung, Tseng, Chih-Hao, and Yang, LiYu, "The Solder Joint Reliability Assessment of a Wafer Level CSP Package," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 370-372.

Chung, Qwan-Ho, and Byun, Kwang-Yoo, "Joule Heating Effect on the Electromigration Lifetimes and Failure Mechanisms of Sn-3.5Ag Solder Bump," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1436-1441.

Chung, Seung-Min, and Kim, Young-Ho, "Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability," Materials Transactions, vol. 48 no. 1, pp. 37-43, Jan. 2007.

Chung, Soonwan, Tang, Zhenming, and Park, Seungbae, "Effects of Phase Change of Pb-Free Flip-Chip Solders During Board-Level Interconnect Reflow," IEEE Transactions on Advanced Packaging, vol. 30 no. 1, pp. 38-43, Feb. 2007.

Chung, Soonwan, Kwak, Jae, Oh, Seunghee, and Kang, Changsun, "Failure Modeling of BGA Package for Reliability Evaluation of Handheld Products under Drop Event," 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Lisbon, Portugal, Apr. 16-18, 2012, pp. xx-xx.

Chung, Soon-Wan, and Kim, Mi-Jin, "Investigation of Pb-Free Solder Interconnect under Drop Impact by Ball Pull and Shear Tests," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 916-921.

Chung, Soonwan, Tang, Zhengming, and Park, Seungbae, "Investigation of Phase Change of Flip Chip Solders During the Second Level Interconnect Reflow," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 894-900.

Chung, Soonwan, and Park, S. B., "Numerical Investigation of Underfill Failure Due to Phase Change of Pb-Free Flip Chip Solders During Board-Level Reflow," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 3, pp. 661-669, Sept. 2008.

Chung, T. J., Moon, W. H., Park, Y. G., Kim, M. C., and Choi, C. K., "First-principle study on substitution of Cu or P into Ni-Sn intermetallic compounds," Intermetallics, vol. 18 no. 6, pp. 1228-1234, June 2010.

Chunyue, Huang, "Thermal Fatigue Life Analysis and Forecast of PBGA Solder Joints on the Flexible PCB Based on Finite Element Analysis," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Churchman-Davies, Jonathan, "Just a WEEE problem...," IEE Review, vol. 48 no. 6, pp. 38-40, Nov. 2002.

Chynoweth, A. G., "Electronic Materials: Functional Substitutions," Science, New Series , vol. 191 no. 4228, pp. 725-732, Feb. 1976.

Ciarcia, Steve, "It's All In The Whiskers," Circuit Cellar, no. 215, pp. 96, June 2008.

Ciejka, Joe, "The Clear Alternative to Traditional Yellow Hex Films," Products Finishing, vol. 70 no. 7, pp. 38-42, Apr. 2006.

Cieslak, Michael J., "2004 research briefs :Materials and Process Sciences Center," Sandia Report SAND2004-0151 (pages 122-123).

Cimalore, Chuck, "Commentary: Confine the RoHS compliance chaos," Electronic Business , Feb. 28, 2006.

Cinar, Yusuf, Jang, Jinwoo, Jang, Gunhee, Kim, Seonsik, and Jang, Jaeseok, "Effect of solder pads on the fatigue life of FBGA memory modules under harmonic excitation by using a global-local modeling technique," Microelectronics Reliability, vol. 53 no. 12, pp. 2043-2051, Dec. 2013.

Cinque, Tom, and Gilleo, Ken, "Implementing SMT with Conductive Adghesives," 1995 Surface Mount International Conference Proceedings of the Technical Program, San Jose, CA, Aug. 29-31, 1995, pp. 553-561.

Ciocci, Richard C., "Handling the Migration to Lead Free," IEEE Transactions on Components and Packaging Technologies , vol. 24 no. 3, pp. 536-538, Sept. 2001.

Ciocci, Richard, and Pecht, Michael, "Impact of environmental regulations on green electronics manufacture," Microelectronics International, vol. 23 no. 2, pp. 45-50, 2006.

Ciocci, Richard, "Lead-free Solder Replacement: Beyond the Material Substitution," Environmentally Conscious Manufacturing II (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4569), Newton, USA, Oct. 28-29, 2001, pp. 100-108.

Ciocci, Richard, and Pecht, Michael, "Learning from the migration to lead-free solder," Soldering & Surface Mount Technology, vol. 18 no. 3, pp. 14-18, 2006.

Ciocci, Richard, and Pecht, Michael, "Questions concerning the migration to lead-free solder," Circuit World , vol. 30 no. 2, pp. 34-40, 2004.

Ciocci, Richard, "US Research Institution Roadmap for the Migration to Lead-free Electronics," 1st European Union/United States Lead-free Solder Interface Meeting , Mar. 27, 2002.

Cirimele, Ray, "10 Things to Know about Soldering Iron Tip Maintenance," Printed Circuit Design and Fab/ Circuits Assembly, vol. 31 no. 1, pp. 28-32, Jan. 2014.

Cirimele, Ray, "BGA Reballing Reliability," Circuits Assembly, vol. 20 no. 6, pp. 27-29, June 2009.

Cirimele, Ray, "Contamination control in lead-free hand soldering," Global SMT & Packaging, vol. 6 no.1, pp. 10, 12-13, Dec. 2005-Jan. 2006.

Cirimele, Ray, "Control of Contamination in Lead-Free Hand Soldering: A review of the hand soldering process and the feasibility of using the same equipment for both tin/lead and lead-free hand soldering," BEST.

Cirimele, Ray, and Wettermann, Bob, "Hand Soldering in a Mixed-alloy Environment," Surface Mount Technology (SMT), vol. 20 no. 4, pp. xx-xx, Apr. 2006.

Cirimele, Ray, "Lead-Free BGA Pad Design: A Comparitive Study of the Affect of Pad Dimensions on the Attachment of Area Array Packages Utilizing Lead-Free Solder Processes and Various Paste Print Methods," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Cirimele, Ray, "Lead-Free BGA Rework," Assembly, vol. xx no. xx, pp. xx-xx, Oct. 2006.

Cirimele, Ray, "Lead Free BGA Rework: A comparison of the effect on reliability of reworked BGAs that have been processed with solder paste printing or flux only attachment," IPC Printed Circuits Expo, APEX and the Designer Summit , Anaheim, CA, Feb. 8-10, 2006, pp. S03-02-1-S03-02-4.

Ciufo, Chris A., "RoHS and tin whiskers: The industry’s next 10-year problem," VMEbus Systems, vol. no. , pp. , Aug. 2005.

Clancy, Sean, "Ask the EMPF Helpline!: Reworking ALD Coatings," empfasis, pp. 2,7, Dec. 2010.

Clancy, Tracy, "New Course at the EMPF Addresses Lead Free Soldering in the Production Environment," empfasis, pp. 3, 11, Jan. 2005.

Clark, Brett M., Weiser, Martin W., and Rasiah, Ignatius J., "Alpha radiation sources in low alpha materials and implications for low alpha materials refinement," Thin Solid Films, vol. 462-463, pp. 384-386, 2004.

Clark, Charles, "Parts are parts," EDN, vol. xx no. xx, pp. xx-xx, Nov. 10, 2005.

Clark, Peter, "AeA publishes guide to Europe's environmental rules," Green SupplyLine, Apr. 29, 2003.

Clark, Stephen, "Detecting Brittle Fracture Failures," Advanced Packaging, vol. 16 no. 8, pp. 34, 36, 38, Nov./Dec. 2007.

Clark, W. A., and Pelosi, W., "Area Distributed Soldering of Flexible and Rigid Printed Circuit Boards," IEEE Transactions on Components, Hybrids, and Manufacturing Technology , vol. 13 no. 4, pp. 698-703, Dec. 1990.

Clarke, Andrew, and O'Neill, Brian, "Solder Selection for Photonic Packaging." Integration of Photonics into the Manufacturing Process, Birmingham, United Kingdom, Nov. 20, 2003.

Clarke, M., Elbourne, R. G., and MacKay, C. A., "An Electrodeposited Bright Tin-Cobalt Intermetallic Compound, CoSn," Transactions of the Institute of Metal Finishing, vol. 50, pp. 160-163, 1972.

Clarke, Peter, "AeA publishes guide to Europe's environmental rules," Green SupplyLine, Apr. 29, 2003.

Clarke, Peter, "Consultancy sets up web-based WEEE collection management," EE Times Europe, Nov. 27, 2006.

Clarke, Peter, "Europe opens chemicals agency headquarters in Helsinki," EE Times Europe, June 12, 2008.

Clarke, Peter, "Greenpeace blasts Apple as laggard in green rankings," EE Times Europe, Aug. 29, 2006.

Clarke, Peter, "Indium adds surcharge on silver- and tin-bearing solder pastes," EE Times Europe, vol. xx no. xx, pp. xx-xx, Apr. 3, 2007.

Clarke, Peter, "Lead-free rules hit yields, European packagers, says analyst," EE Times, Aug. 21, 2005.

Clarke, Peter, "Lead-free rules hit yields, European packagers, says analyst," EE Times Europe, Sept. 21, 2005.

Clarke, Peter, "Lead-free rules hit yields, European packagers, says analyst," Green SupplyLine, Sept. 21, 2005.

Clarke, Peter, "Lead-free rules hit yields, European packagers, says analys," Industrial Control Design Line, Sept. 21, 2005.

Clarke, Peter, "Microsoft, Ericsson, Philips join UN global recycling scheme," Green SupplyLine, Mar. 5, 2007.

Clark, Charles, "Parts are parts," EDN, vol. 50 no. 23, pp. xx-xx, Nov. 10, 2005.

Clarke, Peter, "SEMI issues "alert" over China RoHS March deadline," EE Times Europe, Nov. 9, 2006.

Clarke, Peter, "SEMI issues alert over China RoHS March deadline," Green SupplyLine , Nov. 9, 2006.

Clarke, Peter, "U.S., others oppose European chemical laws," EE Times Europe , July 24, 2006.

Clavaguera-Mora, M. T., Comas, C., and Clavaguera, N., "Calculations of the Tin-Tellurium System," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 18 no. 2, pp. 141-155, Apr.-June 1994.

Clawson, Jamie, Mixon, Dave, and Runyon, Gary, "Solving the Mystery of Failed Components," Surface Mount Technology (SMT), vol. 20 no. 7, pp. xx-xx, July 2006.

Clayton, James E., "Adhesive Interconnect Flip Chip Assembly," Advanced Packaging , vol. 14 no. 3, pp. 10, Mar. 2005.

Clayton, James E., "Conductive Polymer Assembly of High Pin Count Flip Chip," flipchips.com, Sept. 2003.

Clayton, James E., "Very High Pin Count Flip Chip Assembly Using Conductive Polymer Adhesives," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 275-281.

Cleaveland, Peter, "New Technologies Secure Fasteners' Future," Product Design & Development, pp. 8-9, Apr. 2006.

Clech, Jean-Paul, "A Pseudo-Stress, Pseudo-Strain Methodology to Predict Lead-free Solder Joint Reliability," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 293-309.

Clech, Jean-Paul, "Acceleration Factors and Thermal Cycling Test Efficiency for Lead-Free Sn-Ag-Cu Assemblies," 2005 SMTA International Conference Proceedings , Chicago, IL, Sept. 25-29, 2005, pp. 902-918.

Clech, Jean-Paul, "An Extension of the Omega Method to Primary and Tertiary Creep of Lead-Free Solders," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 1261-1271.

Clech, Jean-Paul, "An Obstacle-Controlled Creep Model for Sn-Pb and Sn-Based Lead-Free Solders," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 776-802.

Clech, Jean-Paul, "Board, Package and Die Thickness Effects under Thermal Cycling Conditions," Proceedings of SMTA International, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 40-50.

Clech, Jean-Paul, Henshall, Gregory, and Miremadi, Jian, "Closed-Form, Strain-Energy Based Acceleration Factors for Thermal Cycling of Lead-Free Assemblies," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 393-408.

Clech, Jean-Paul, "Comparative Analysis of Creep Data for Sn-Ag-Cu Solder Joints in Shear," Micromaterials and Nanomaterials, issue 3, pp. 144-155, 2004.

Clech, Jean-Paul, "Filling in the Gaps in Lead-Free Reliability Modeling and Testing," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S05_01-1-S05_01-23.

Clech, Jean-Paul, "Flip-Chip / CSP Assembly Reliability and Solder Volume Effects," Proceedings, Surface Mount International Conference, San Jose, CA, Aug. 23-27, 1998, pp. 315-324.

Clech, Jean-Paul, "Lead-Free and Mixed Assembly Solder Joint Reliability Trends," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S28-3-1-S28-3-14.

Clech, Jean-Paul, "Lead-Free Solder Joint Reliability: The State of the Art (Tutorial T7)," SMTA International Conference, Chicago, IL, Sept. 24-28, 2006.

Clech, Jean-Paul M., Coyle, Richard J., and Arfaei, Babak, "Pb-Free Solder Joint Thermo-Mechanical Modeling: State of the Art and Challenges," JOM, vol. 71 no. 1, pp. 143-157, Jan. 2019.

Clech, Jean-Paul, "Solder Joint Reliability of CSP versus BGA Assemblies," Proceedings, SMT ESS Hybrid 2000 Conference, Nuremberg, Germany, June 27-29, 2000, pp. 19-28.

Clech, Jean-Paul, "The Combined Effect of Assembly Pitch and Distance to Neutral Point on Solder Joint Thermal Cycling Life," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 88-98.

Cleevely, Sarah Thomas, "Reducing the mobile phone mountain," Materials World, vol. 10 no. 11, pp. 13-14, Nov. 2002.

Clelland, Ian W., and Price, Rick A., "Lead-Free Solder Study," ITW Paktron, Sept. 20, 2005.

Clements, Vic, "Business needs to know about WEEE," Electronics Weekly, Feb. 8, 2007.

Clements, Vic, "Demonstrating compliance with the RoHS Directive," Electronics Weekly, Nov 25, 2005.

Clements, Vic, "Doing Business with the EU - Waste management regulations: implications to electrical and electronic industries in Thailand," European Organization for Conformity Assessment (EOTC), Jan 29, 2004.

Clements, Vic, "Enforcing RoHS on firms outside the EU," Electronics Weekly, Oct. 18, 2005.

Clements, Vic, "How EU members will work together to meet WEEE," Electronic Product Design, vol. xx no. xx, pp. xx-xx, Jan. 1, 2008.

Clements, Vic, "RoHS: Distance selling loophole explained," Electronics Weekly , June 16, 2006.

Clements, Vic, "The EU's Energy Using Products (EuP Directive," Conformity, vol. 11 no. 12, pp. 12, 14-16, Dec. 2006.

Clements, Vic, "The EU's WEEE Directive," Conformity, pp. 171-173, Conformity 2005: The Annual Guide.

Clift, Roland, and France, Chris, "Extended Producer Responsibility in the EU: A Visible March of Folly," Journal of Industrial Ecology, vol. 10 no. 4, pp. 5-7, Fall 2006.

Clore, Nicholas, "Identification and Counting Procedure for Tin Whiskers, Hillocks, and Other Surface Defects," Tin Whisker Group teleconference, Oct. 26, 2011.

Clum, J., Cotts, E., and Jiang, N., "Summary of Recent Studies on the Effect of Processing on Microstructures of Some Solder Alloys," Design & Reliability of Solders and Solder Interconnections, Orlando, FL, Feb. 10-13, 1997, pp. 137-143.

Coada, Dan, "Vapor phase vs. convection reflow in RoHS-compliant assembly," Global SMT and Packaging, vol. 9 no. 4, pp. 20-22,36, Apr. 2009.

Coada, Don, "PoP (package on package) and vapor phase technology," Global SMT and Packaging, vol. 9 no. 9, pp. 10,12-13, Sept. 2009.

Coady, Ed, "Lead-free exemptions may be overlooked," electronicsweekly.com , Feb. 18, 2004.

Coady, Edmund, "RoHS-compliant or not, when does it matter?," Electronics Weekly , Sept. 18, 2006.

Coan, Rich, and Hedrick, Jason, "In Search of a Thorough RoHS-compliant Approach," Surface Mount Technology (SMT), vol. 21 no. 4, pp. 36, Apr. 2007.

Coates, Gareth, and Rahimifard, Shahin, "Assessing the economics of pre-fragmentation material recovery within the UK," Resources, Conservation and Recycling, vol. 52 no. 2, pp. 286-302, Dec. 2007.

Coates, Laura, "Get the Lead Out," Advanced Manufacturing Technology (AMT), vol. 16 no. 6, pp. 30-31, Dec. 2003/Jan. 2004.

Cobas-Flores, E., Hendrickson, C. T., Lave, L. B., and McMichael, F. C., "Life Cycle Analysis of Batteries Using Economic Input-Output Analysis," IEEE International Symposium on Electronics and the Environment, Dallas, TX, May 6-8, 1996, pp. 130-134.

Cobb, Howard L., "Cadmium Whiskers," The Monthly Review American Electroplaters Society , vol. 33 no. 1, pp. 28-30, Jan. 1946.

Coble, R. L., "A Model for Boundary Diffusion Controlled Creep in Polycrystalline Materials," Journal of Applied Physics, vol. 34 no. 6, pp. 1679-1682, June 1963.

Cochardt, A. W., and Wiedersich, H., "Growth of Iron Whiskers," Naturwissenschaften, vol. 42 no. 11, pp. 342, Jan. 1955.

Codreanu, N. D., Plotog, I., Svasta, P., Turcu, C., Varzaru, G., Pitica, D., Gavan, M.. Bara, A., Farcas, C., Marin, Al, and Cucu, T. C., "Implementation of Ecological Technologies in Electronics Industry based on RESPLATEPE Research Project," 30th International Spring Seminar on Electronics Technology, Cluj-Napoca, Romania, May 9-13, 2007, pp. 263-268.

Codreanu, N. D., Svasta, P., Plotog, I., Oancea, I., Varzaru, G., and Cucu, T. C., "Lead-Free Electronic System Integrated in a Vapour Phase Soldering Equipment Prototype," 32nd International Spring Seminar on Electronics Technology , Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.

Codreanu, N. D., Turcu, C., Cucu, T. C., Plotog, I., Svasta, P., Stan, A., Jianu, S., and Marin, Al., "SAC Alloys Implementation in Electronic Products Manufacturing," 29th International Spring Seminar on Electronics Technology, St. Marienthal, Germany, May 10-14, 2006, pp. 444-449.

Coffee, Peter, "'Greener' Computing on the Horizon," eWEEK, vol. xx no. xx, pp, xx-xx, Apr. 19, 2004.

Coffey, Valerie, "A RoSE by any other name: you say RoSS, I say RoHS," Connector Specifier, Oct. 19, 2005.

Coffey, Valerie, "Are your connectors exempt from RoHS?," Connector Specifier, Aug. 16, 2005.

Coffey, Valerie, "Comments on lead-free "cops"," Connector Specifier, Jan. 4, 2006.

Coffey, Valerie, "Environmental issues still hot and heavy," Connector Specifier , vol. 20 no. 11, pp. xx-xx, Nov. 2004.

Coffey, Valerie, ""Faster, better, cheaper" not just for spacecraft," Connector Specifier , vol. 21 no. 11, pp. 3, Nov. 2005.

Coffey, Valerie, "Green Materials to reach billions by 2010," Connector Specifier , Nov. 30, 2005.

Coffey, Valerie, "Groups publish materials declaration standard," Connector Specifier , vol. 22 no. 3, pp. 1, 6, Mar. 2006.

Coffey, Valerie, "If the lead is out, what's in?," Connector Specifier, vol. 20 no. 6, pp. xx-xx, June 2004.

Coffey, Valerie, "RoHS puts distributors in a pressure pot," Connector Specifier , Aug. , 2005.

Coffey, Valerie, "The whites of their eyes," Connector Specifier, vol. 21 no. 2, pp. xx-xx, Feb. 2005.

Coffey, Valerie, "What's the latest? Get the lead out!," Connector Specifier, vol. 20 no. 5, pp. xx-xx, May 2004.

Coffey, Valerie, "Who will be the lead-free police?," Connector Specifier, Dec. 14, 2005.

Cognetti, Carlo, "Elimination of Lead in First Level Semiconductor Packaging," Proceedings of 3rd Electronics Packaging Technology Conference, Singapore, Dec. 5-7, 2000, pp. 452-456.

Cognetti, Carlo, Petit, Luc, and Crema, Paolo, "Elimination of Lead in Semiconductor Packaging," Future Fab International, vol. 11, pp. xx-xx, June 29, 2001.

Cohen, Bennie, "A Study of Cadmium-Tin and Zinc-Tin Alloy Electrodeposits," Plating , vol. 44 no. 9, pp. 963-968, Sept. 1957.

Cohen, Ernst, "Anmerkung zu Obiger Mitteilung uber die Forcierkrankheit," Zeitschrift fur Elektrochemie, vol. 19 no. 1, pp. 23, Jan. 1, 1913. https://doi.org/10.1002/bbpc.19130190105

Cohen, Ernst, and Olie Jr., J., "Das Atomvolumen allotroper Modifikationen bei sehr tiefen Temperaturen. I," Zeitschrift fur physikalische Chemie, vol. 71 no. 4, pp. 385-400, 1910.

Cohen, Ernst, and Inouye, Katsuji, "De Metastabiliteit onzer Metaalwereld," Chemisch Weekblad, vol. 6 no. 45, pp. 881-892, Nov. 6, 1909.

Cohen, Ernst, "De Tinpest in Nederland," Chemisch Weekblad, vol. 2 no. 29, pp. 450-452, July 22, 1905.

Cohen, Ernst, Cohen-de Meester, W. A. T., and van Lieshout, A. K. W. A., "Der Einfluss mechanischer Deformation auf die Umwandlungsgeschwindigkeit polymorpher Metalle," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 38 no. 4, pp. 377-387, 1935.

Cohen, Ernst, and van Lieshout, A. K. W. A., "Der Einfluss mechanischer Deformation auf die Umwandlungsgeschwindigkeit polymorpher Metalle II," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 39 no. 3, pp. 352-358, 1936.

Cohen, Ernst, and van Lieshout, A. K. W. A., "Der Einfluss mechanischer Deformation auf die Umwandlungsgeschwindigkeit polymorpher Metalle III," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 39 no. 10, pp. 1174-1179, 1936.

Cohen, Ernst, Cohen-de Meester, W. A. T., and Landsman, J., "Die akute Zinnpest," Zeitschrift fur physikalische Chemie, vol. 181 no. 2, pp. 124-132, 1937.

Cohen, Ernst, Cohen-de Meester, W. A. T., and Landsman, J., "Die akute Zinnpest," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 40 no. 9, pp. 746-752, 1937.

Cohen, Ernst, and Cohen-de Meester, W. A. T., "Die akute Zinnpest. II," Zeitschrift fur physikalische Chemie, vol. 182 no. 2, pp. 103-109, 1938.

Cohen, Ernst, and Cohen-de Meester, W. A. T., "Die akute Zinnpest II," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 41 no. 5, pp. 462-467, 1938.

Cohen, Ernst, and Cohen-de Meester, W. A. T., "Die akute Zinnpest. III," Zeitschrift fur physikalische Chemie, vol. 183 no. 3, pp. 190-198, 1939.

Cohen, Ernst, and Cohen-de Meester, W. A. T., "Die akute Zinnpest III," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 41 no. 8, pp. 860-866, 1938.

Cohen, Ernst, and van Lieshout, A. K. W. A., "Die Geshwindigkeit polymorpher Umwandlungen. Neue Untersuchungen uber die Zinnpest," Zeitschrift fur physikalische Chemie, vol. A173 no. 1, pp. 1-31, 1935.

Cohen, Ernst, and van Lieshout, A. K. W. A., "Die Geshwindigkeit polymorpher Umwandlungen. II," Zeitschrift fur physikalische Chemie, vol. A173 no. 1, pp. 67-70, 1935.

Cohen, Ernst, Cohen-de Meester, W. A. T., and van Lieshout, A. K. W. A., "Die Geshwindigkeit polymorpher Umwandlungen. III," Zeitschrift fur physikalische Chemie, vol. A173 no. 3, pp. 169-177, 1935.

Cohen, Ernst, and van Lieshout, A. K. W. A., "Die Geshwindigkeit polymorpher Umwandlungen. IV," Zeitschrift fur physikalische Chemie, vol. A177 no. 5, pp. 331-336, 1936.

Cohen, Ernst, and van Lieshout, A. K. W. A., "Die Geshwindigkeit polymorpher Umwandlungen. V," Zeitschrift fur physikalische Chemie, vol. A178 no. 3, pp. 221-226, 1936.

Cohen, Ernst, and Moesveld, A. L. Th., "Die Metastabilitat der Elemente und Verbindungen als Folge von Enantiotropie oder Monotropie. I," Zeitschrift fur physikalische Chemie, vol. 94 no. 3-4, pp. 450-464, 1917?.

Cohen, Ernst, and Moesveld, A. L. Th., "Die Metastabilitat der Elemente und Verbindungen als Folge von Enantiotropie oder Monotropie. IX," Zeitschrift fur physikalische Chemie, vol. 115 no. 1-2, pp. 151-159, 1925.

Cohen, Ernst, and Dekker, K. Douwes, "Die Metastabilitat der Elemente und Verbindungen als Folge von Enantiotropie oder Monotropie. X," Zeitschrift fur physikalische Chemie, vol. 127 no. 3-4, pp. 183-217, 1927.

Cohen, Ernst, "Een nieuwe besmettelijke ziekte van het Tin: de Forceerziekte," Chemisch Weekblad, vol. 6 no. 33, pp. 625-640, Aug. 14, 1909.

Cohen, Ernst, and van Lieshout, A. K. W. A., "Ein elektrisches Druckdilatometer," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 39 no. 5, pp. 596-603, 1936.

Cohen, Ernst, "Eine neue Art Umwandlungselemente (sechste Art)," Zeitschrift fur physikalische Chemie, vol. 30 no. 4, pp. 623-627, 1899.

Cohen, Ernst, "Infected tin or the "tin-pest"," Journal of the Franklin Institute , vol. 173 no. 5, pp. 531, May 1912.

Cohen, Ernst, "Neues uber die Forcierkrankheit," Zeitschrift fur Elektrochemie, vol. 18 no. 14, pp. 616-617, July 15, 1912. https://doi.org/10.1002/bbpc.19120181406

Cohen, Ernst, and van Eyk, C., "On the Enantiotropy of Tin," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 2 no. x, pp. 77-80, 1899.

Cohen, Ernst, and van Eyk, C., "On the Enantiotropy of Tin (II)," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 2 no. x, pp. 149-153, 1899.

Cohen, Ernst, "On the Enantiotropy of Tin (V)," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 3 no. xx, pp. 93-98, 1900.

Cohen, Ernst. and Dekker, K. Douwes, "Physico-Chemical Studies on Tin. IX. - The Transformation Temperature Grey Tin <--> White Tin," Journal of the Institute of Metals, vol. 38 no. 2, pp. 383, 1927.

Cohen, Ernst, and van Eijk, C., "Physikalisch-chemische Studien am Zinn," Zeitschrift fur physikalische Chemie, vol. 30 no. 4, pp. 601-622, 1899.

Cohen, Ernst, "Physikalisch-chemische Studien am Zinn," Zeitschrift fur physikalische Chemie, vol. 33 no. 1, pp. 57-62, 1900.

Cohen, Ernst, "Physikalisch-chemische Studien am Zinn," Zeitschrift fur Physikalische Chemie, vol. 35 no. 5, pp. 588-597, 1900.

Cohen, Ernst, "Physikalisch-chemische Studien am Zinn," Zeitschrift fur physikalische Chemie, vol. 36 no. 5, pp. 513-516, 1901.

Cohen, Ernst, "Physikalisch-chemische Studien am Zinn. V," Zeitschrift fur physikalische Chemie, vol. 48 no. 2, pp. 243-245, 1904.

Cohen, Ernst, and Goldschmidt, "Physikalisch-chemische Studien am Zinn. VI," Zeitschrift fur physikalische Chemie, vol. 50 no. 2, pp. 225-237, 1905.

Cohen, Ernst, "Physikalisch-chemische Studien am Zinn. VII," Zeitschrift fur physikalische Chemie, vol. 63 no. 5, pp. 625-635, 1908.

Cohen, Ernst, "Physikalisch-chemische Studien am Zinn. VIII," Zeitschrift fur physikalische Chemie, vol. 68 no. 2, pp. 214-231, 1909.

Cohen, Ernst, and Dekker, K. Douwes, "Physikalisch-chemische Studien am Zinn. IX. Die Umwandlungstemperatur graues Zinn <==> weisses Zinn," Zeitschrift fur physikalische Chemie , vol. 127 no. 3-4, pp. 178-182, 1927.

Cohen, Ernst, and van Lieshout, A. K. W. A., "Physikalisch-chemische Studien am Zinn. X. Die Umwandlungstemperatur graues Zinn <==> weisses Zinn," Zeitschrift fur physikalische Chemie , vol. A173 no. 1, pp. 32-34, 1935.

Cohen, Ernst, "The Allotropy of Metals," Transactions of the Faraday Society, vol. 7, pp. 122-135, 1911.

Cohen, Ernst, "The Enantiotropy of Tin (III)," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 2 no. x, pp. 281-286, 1899.

Cohen, Ernst, "The enantiotrophy of Tin (IV)," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 2 no. x, pp. 464-467, 1900.

Cohen, Ernst, "The Enantiotropy of Tin (VI)," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 3 no. xx, pp. 469-472, 1901.

Cohen, Ernst, "The Physical Chemist in Search of Purity in an Impure World," Journal of the Society of Chemical Industry, New series vol. 48 no. 7, pp. 162-169, Feb. 15, 1929. https://doi.org/10.1002/jctb.5000480702

Cohen, Ernst, "Tinpest en Meseumziekte," De Ingenieur, vol. 23 no. 30, pp. 529-539, 1908.

Cohen, Ernst, "Tinpest en Museumziekte in Nederland," Chemisch Weekblad, vol. 24 nr. 32, pp. 402-403, Aug. 6, 1927.

Cohen, Marvin L., "Electronic Charge Densities in Semiconductors," Science, New Series, vol. 179 no. 4079, pp. 1189-1195, Mar. 23, 1973.

Cohn, Charles, and Kimbara, Hidenori, "Via to Via Isolation vs. Quality of Via Formation in Organic Substrates," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 86-93.

Cojocaru, P., Magagnin, L., Gomez, E., and Valles, E., "Using deep eutectic solvents to electrodeposit CoSm films and nanowires," Materials Letters, vol. 65 no. 23-24, pp. 3597-3600, Dec. 2011.

Colby, Kris, and Fertal, David, "Ten steps to a green supply chain," Electronics Supply & Manufacturing, Oct. 2007.

Cole, Christopher J., "HexChrome and You," Welding Design and Fabrication, vol. 82 no. 4, pp. 24-25, Apr. 2009.

Cole, Marie, Adams, Jacklin, Bushnell, Steve, Galyon, George, Grosskopf, Curtis, Hoffmeyer, Mark, and Wilcox, Jim, "European Union RoHS Exemption Review Case Study," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 592-600.

Cole, Marie, and Puttlitz, Karl, "IBM and the industry's pursuit of lead (Pb) elimination / reduction from microelectronic packaging," Power Architecture Community Newsletter , Mar. 15, 2005.

Cole, Marie, Interante, Mario, Chapman, Brian, De Sousa, Isabel, Goldsmith, Chuck, Jozwiak, Janet, Lopez, Tasha, Ma, Wai, Martin, Gregory, Ndiaye, Cheikhou, Ostrander, Steve, Ranadive, Nandum and Sablinski, William, "Lead-Free Card Assembly and Rework for Column Grid Arrays," Journal of SMT, vol. 17 no. 1, pp. 33-40, Jan. 2004.

Cole, Marie, Lewis, Theron, Bielick, Jim, Pu, P. K., Hugo, Stephen, Isaacs, Phil, Kobeda, Eddie, Kelly, Matt, Bing, Su, Chen, Alex, Huang, James, Liu, Kevin, McMahon, John, and Standing, Brian, "Overcoming Head-in-Pillow Defects in Hybrid LGA Socket Assembly," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 674-683.

Cole, Marie, Bixenman, Mike, Geiger, David, Grosskopf, Curtis, Lam, Michelle, Lauri, Michael, Rubin, Holly-Dee, Sack, Thilo, Schultz, Laurence, and Wilcox, James, "Process Sensitive Components Guideline - a Primer for the Industry," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 429-435.

Cole, Marie, and Dietrich, Jay, "Product Material Considerations - Customer and Industry Issues," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 626-633.

Cole, Marie, Kelly, Matthew, Interrante, Mario, Martin, Gregory, Bergeron, Christian, Farooq, Mukta, Hoffmeyer, Mark, Bagheri, Simin, Snugovsky, Polina, Bagheri, Zohreh, and Romansky, Marianne, "Reliability Study and Solder Joint Microstructure of Various SnAgCu Ceramic Ball Grid Array (CBGA) Geometries and Alloys," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 283-292.

Cole, Marie, Kelly, Matthew, Interrante, Mario, Martin, Gregory, Bergeron, Christian, Farooq, Mukta, Hoffmeyer, Mark, Bagheri, Simin, Snugovsky, Polina, Bagheri, Zohreh, and Romansky, Marianne, "Reliability Study and Solder Joint Microstructure of Various SnAgCu Ceramic Ball Grid Array (CBGA) Geometries and Alloys," Journal of Surface Mount Technology, vol. 19 no. 4, pp. 18-27, Oct.-Dec. 2006.

Coleman, R. V., and Sears, G. W., "Elasticity of Zinc Whiskers," Acta Metallurgica, vol. 4 no. 2, pp. 214-215, Mar. 1956.

Coleman, R. V., and Sears, G. W., "Growth of Zinc Whiskers," Acta Metallurgica, vol. 5 no. 3, pp. 131-136, Mar. 1957.

Coleman, R. V., and Scott, G. G., "Magnetic Domain Patterns on Iron Whiskers," Journal of Applied Physics , vol. 29 no. 3, pp. 526-527, Mar. 1958.

Coleman, R. V., and Isin, A., "Magnetoresistance in Iron Single Crystals," Journal of Applied Physics , vol. 37 no. 3, pp. 1028-1029, Mar. 1, 1966.

Coleman, R. V., "Observations of Dislocations in Iron Whiskers," Journal of Applied Physics, vol. 29 no. 10, pp. 1487-1492, Oct. 1958.

Coleman, R. V., Price, B., and Cabrera, N., "Slip of Zinc and Cadmium Whiskers," Journal of Applied Physics, vol. 28 no. 11, pp. 1360-1361, Nov. 1957.

Coleman, R. V., "The Growth and Properties of Whiskers," Metallurgical Reviews, vol. 9 no. 1, pp. 261-304, 1964. https://doi.org/10.1179/mtlr.1964.9.1.261

Coleman, R. V., and Cabrera, N., "Zinc and Cadmium Whiskers," Journal of Applied Physics, vol. 28 no. 11, pp. 1360, Nov. 1957.

Coleman, William E., and Oxx, George, "Intrusive Reflow of Lead-free Solder Paste," Surface Mount Technology (SMT), vol. 21 no. 11, pp. 18-19, 23, Nov. 2007.

Coleman, William E., and Oxx, George, "Intrusive Reflow of Lead-free Solder Paste, Part II," Surface Mount Technology (SMT), vol. 21 no. 12, pp. 22-23, Dec. 2007.

Colin, J., Grilhe, J., and Junqua, N., "Surface instabilities of a stressed cylindrical whisker," Philosophical Magazine A: Physics of Condensed Matter, Structure, Defects and Mechanical Properties, vol. 76 no. 4, pp. 793-805, Oct. 1997. https://doi.org/10.1080/01418619708214211

Colinet, Catherine, Tedenac, Jean-Claude, and Fries, Suzana G., "Structural stability of intermetallic phases in the Sn-Ti system," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 33 no. 1, pp. 250-259, Mar. 2009.

Collet, Maeva, Salomon, Sven, Klein, Naiara Yohanna, Seichepine, Florent, Vieu, Christophe, Nicu, Liviu, and Larrieu, Guilhem, "Large-Scale Assembly of Single Nanowires through Capillary-Assisted Dielectrophoresis," Advanced Materials, vol. 27 no. 7, pp. 1268-1273, Feb. 18, 2015.

Collier, Peter, Sunappan, Vasudivan, and Periannan, Arulvanan, "Lead-free solder process implementation for PCB assembly," Soldering & Surface Mount Technology, vol. 14 no. 3, pp. 12-18, 2002.

Collier, Terence, "Improved ENIG Pad Deposition," flipchips.com Tutorial 115, Summer 2011.

Collier, Terence Q., "Lead vs Lead-free: Packaging and Wafer Level CSP Influences," Wafer-Level Congress and Exhibition Conference Proceedings, San Jose, CA, Oct. 10-12, 2004, pp. xx-xx.

Collier, Terence Q., "Pb-free Manufacturability and Test Control," Circuits Assembly , vol. 15 no. 12, pp. 20-23, Dec. 2004.

Collier, Terence Q., "Probe testing differences in lead-free bumps" flipchips.com, June 2005.

Collier, Terence, "Qualifying Packages at 260øC," Semiconductor International, vol. xx no. xx, pp. xx, Dec. 1, 2003.

Collier, Terence, "Solder Ball Endurance," Advanced Packaging, vol. xx no. xx, pp. xx-xx, Feb. 2003.

Collier, Terence, "Solder Ball Endurance," Advanced Packaging, vol. xx no. xx, pp. xx-xx, Sept. 2003.

Collier, Terence, "Solder Ball Joints: Voiding, Qualification And Mechanical Issues" Fifth International Conference on Electronic Packaging Technology Proceedings , Shanghai, China, Oct. 28-30, 2003, pp. 427-429.

Collins, Andrew, "Impact of Material Properties and Assembly Geometry on Bond-line Stress When Bonding PCBs to Heat Sinks with an Isotropic Conductive Adhesive - Part II," 2005 Proceedings 55th Electronic Components & Technology Conference , Orlando, FL, May 31-June 3, 2005, pp. 1455-1461.

Collins, Maurice N., Jackson, Gavin J., Dalton, Eric, Steen, Hector, Liu, Puwei, Holloway, Matthew, and Punch, Jeff, "Accelerated Temperature Cycling and Microstructural Analysis of SnZn Solder in Surface Mount Assemblies," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 16-18, 2012, pp. xx-xx.

Collins, Maurice N., Aguanno, Mauro V., Reid, Michael, Ryan, Claire, and Punch, Jeff, "Analysis of Failure Mechanisms of Lead Free Alloys Under Continuous Monitoring," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 538-543.

Collins, Maurice N., Dalton, Eric, and Punch, Jeff, "Microstructural influences on thermomechanical fatigue behaviour of third generation high Ag content Pb-Free solder alloys," Journal of Alloys and Compounds, vol. 688 Part B, pp. 164-170, Dec. 15, 2016.

Collins, Maurice N., Punch, Jeff, and Coyle, Richard, "Surface finish effect on reliability of SAC 305 soldered chip resistors," Soldering & Surface Mount Technology, vol. 24 no. 4, pp. 240-248, 2012.

Collins, Maurice N., Punch, Jeff, Coyle, Richard, Reid, Michael, Popowich, Richard, Read, Peter, and Fleming, Debra, "Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys With Minor Pb Additions," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 10, pp. 1594-1600, Oct. 2011.

Colwell, L. V., Hemmye, J. H., and Quackenbush, L. J., Study of Ulstrasonics in Wire Drawing, U. S. Steel Corporation, ORA Project 04579, Cleveland, OH, Oct. 1962.

Comerford, Richard, "That's not 'green," dammit!," Electronic Products, vol. 51 no. 11, pp. 7, May 2009.

Compton, K. G., Mendizza, A., and Arnold, S. M., "Filamentary Growths on Metal Surfaces - "Whiskers"," Corrosion , vol. 7 no. 10, pp. 327-334, Oct. 1951.

Condra, Lloyd, "Aerospace Industry Response to the Restrictions on Hazardous Substances (RoHS) Directive on Military and Aerospace Systems," DoD Diminishing Manufacturing Sources and Material Shortages Conference, Charlotte, NC, July 11. 2006, pp. xx-xx.

Condra, Lloyd, "Aerospace Lead-free Reliability," IPC Printed Circuits Expo, APEX and the Designers Summit, Los Angeles, CA, Feb. 20-22, 2007, pp. xx-xx.

Condra, Lloyd W., Meschter, Stephan J., Pinsky, David A., and Rafanelli, Anthony J., "The Challenge of Lead-free Electronics for Aerospace Electronic Systems ," IEEE Custom Integrated Circuits Conference, San Jose, CA, Sept. 20-23, 2009, pp. 355-361.

Condrea, E., and Gilewski, A., "Quantum oscillations of resistivity in bismuth nanowires," Low Temperature Physics, vol. 36 no. 3, pp. 250-253, Mar. 2010.

Cong, Ridong, Wang, Qiushi, Zhang, Jian, Wang, Jingshu, Xu, Yongsheng, Jin, Yunxia, and Cui, Qiliang, "Plasma-assisted synthesis of zinc nanowires," Materials Chemistry and Physics, vol. 129 no. 1-2, pp. 611- 613, Sept. 15, 2011.

Cong, S., Han, Y. N., Dong, Y., Yang, J., and Zhang, W. W., "Failure analysis on SAC305 large-size BGA components attached with SnPb solder," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1258-1261.

Connell, David, and Christian, Bev, "Comparison of Types III, IV and V Solder Pastes," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S23-02-1-S23-02-7.

Connell, Glen, Zenner, Robert L. D., and Gerber, Joel A., "Conductive Adhesive Flip-Chip Bonding for Bumped and Unbumped die," 1997 Electronic Components and Technology Conference, San Jose, CA, May 18-21, 1997, pp. 274-278.

Conner, Margery, "Beyond ROHS: the greening of global markets," EDN, vol. 51 no. 15, pp. 38, 40, 42, 44, July 20, 2006.

Connolly, Christine, "Adhesives in electronic and electrical assembly," Assembly Automation , vol. 28 no. 4, pp.289-294, 2008.

Conrad, Dick, "Creating a green supply chain," Green SupplyLine, June 1, 2004.

Conrad, Dick, "Creating a green supply chain," Electronics Supply & Manufacturing, June 2004.

Conrad, H., Guo, Z., Fahmy, Y., and Yang, Di, "Influence of Microstructure Size on the Plastic Deformation Kinetics, Fatigue Crack Growth Rate and Low-Cycle Fatigue of Solder Joints," Journal of Electronic Materials, vol. 28 no. 9, pp. 1062-1070, Sept. 1999.

Conrad, H., Guo, Z., and Pao, Yi-Hsin, "Rate-controlling Mechanism During Plastic Deformation of 95.5Sn4Cu0.5Ag Solder Joints at High Homologous Temperatures," Advances in Electronic Packaging 1997, Volume 2, Kohala Coast, Hawaii, June 15-19, 1997, pp. 1551-1557.

Conrad, L. R., Pike-Biegunski, M. J., and Freed, R. L., "Creep Corrosion over Gold, Palladium, and Tin-Lead Electroplate," Fifteenth Annual Connectors and Interconnection Technology Symposium Proceedings, Philadelphia, PA, Nov. 1-2, 1982, pp. 402-414.

Conroy, Gary, "New Alternatives for Environmentally Friendly Heat Stabilizers," Plastics Technology, vol. xx no. xx, pp. xx-xx, Mar. 1999.

Conseil, Helene, Verdingovas, Vadimas, Jellesen, Morten S., and Ambat, Rajan, "Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics," Journal of Materials Science: Materials in Electronics, vol. 27 no. 1, pp. 23-32, Jan. 2016.

Conseil-Gudla, Helene, Gudla, Visweswara C., Borgaonkar, Shruti, Jellesen, Morten S., and Ambat, Rajan, "Investigation of moisture uptake into printed circuit board laminate and solder mask materials," Journal of Materials Science: Materials in Electronics, vol. 28 no. 8, pp. 6138-6151, Apr. 2017.

Conseil-Gudla, Helene, Jellesen, Morten S., and Ambat, Rajan, "Printed Circuit Board Surface Finish and Effects of Chloride Contamination, Electric Field, and Humidity on Corrosion Reliability," Journal of Electronic Materials, vol. 46 no. 2, pp. 817-825, Feb. 2017.

Constable, J. H., "Analysis of ACF Contact Resistance," Advances in Electronic Packaging 2003, Volume 1, Maui, Hawaii, July 6-11, 2003, pp. 123-130.

Constable, J. H., Kache, Thomas, Teichmann, Heiko, Muhle, Sven, and Gaynes, Michael A., "Continuous Electrical Resistance Monitoring, Pull Strength, and Fatigue Life of Isotropically Conductive Adhesive Joints," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 76-83.

Constable, James H., "Analysis of the Constriction Resistance in an ACF Bond," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 3, pp. 494-501, Sept. 2006.

Constable, James H., Kache, Thomas, Teichmann, Heiko, Muhle, Sven, and Gaynes, Michael A., "Continuous Electrical Resistance Monitoring, Pull Strength, and Fatigue Life of Isotropically Conductive Adhesive Joints," IEEE Transactions on Components and Packaging Technologies, vol. 22 no. 2, pp. 191-199, June 1999.

Convertino, Annalisa, Cuscuna, Massimo, Nicotra, Giuseppe, Spinella, Corrado, Felisari, Laura, Fortunato, Guglielmo, and Martelli, Faustino, "Low-temperature growth of In-assisted silicon nanowires," Journal of Crystal Growth, vol. 335 no. 1, pp. 10-16, Nov. 15, 2011.

Conway, Paul P., "An Environmental Comparison of Solder and Conductive Adhesives for SMT Interconnect," Fifteenth IEEE/CHMT International Electronic Manufacturing Technology Symposium, Santa Clara, CA, Oct. 4-6, 1993, pp. 171-176.

Conway, Paul P., and Huang, Zhiheng, "Impacts of Pb-free legislation on European HDP," 7th IEEE CPMT International Conference on High Density Microsystem Design, Packaging and Failure Analysis, Shanghai, June 28, 2005, pp. xx-xx.

Conway, Paul P., "Solderability testing of alternate component termination materials with lead free solder alloys," Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, Oct. 2-4, 1995, pp. 245-251.

Conzatti, F., Pala, M. G., Esseni, D., Bano, E., and Selmi, L., "Strain-Induced Performance Improvements in InAs Nanowire Tunnel FETs," IEEE Transactions on Electron Devices, vol. 59 no. 8, pp. 2085-2092, Aug. 2012.

Cook, B. A., Anderson, I. E., Harringa, J. L., and Terpstra. R. L., "Effect of Heat Treatment on the Electrical Resistivity of Near-Eutectic Sn-Ag-Cu Pb-Free Solder Alloys," Journal of Electronic Materials, vol. 31 no. 11, pp. 1190-1194, Nov. 2002.

Cook, B. A., Anderson, I. E., Harringa, J. L., and Kang, S. K., "Isothermal Aging of Near-Eutectic Sn-Ag-Cu Solder Alloys and Its Effect on Electrical Resistivity," Journal of Electronic Materials, vol. 32 no. 12, pp. 1384-1391, Dec. 2003.

Cook, B. A., Anderson, I. E., Harringa, J. L., Terpstra, R. L., Foley, J. C., Unal, O., and Laabs, F. C., "Shear Deformation in Sn-3.5Ag and Sn-3.6 Ag-1.0Cu Solder Joints Subjected to Asymmetric Four Point Bend Tests," Journal of Electronic Materials , vol. 30 no. 9, pp. 1214-1221, Sept. 2001.

Cook, Ben, "Hazard Warning," Supply Management, pp. xx-xx, Mar. 2, 2006.

Cook, David, "Data Mining for Creep Corrosion on Desktop Computers," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 940-942.

Cook Jr., J. W., Davis, W. T., Chandler, J. H., and Skove, M. J., "Effect of stress on the superconducting transition temperature in indium, indium-alloy, tin, and tin-alloy whisker samples," Physical Review B , vol. 15 no. 3, pp. 1357-1369, Feb. 1, 1977.

Cook, Steve, "Effects of Lead-Free Soldering on Solvent Cleaning, Desoldering Braid, and Temporary Solder Mask," Tech Spray.

Cooke, Mike, "Shaving the whiskers for lead-free production," European Semiconductor, vol. xx no. xx, pp. xx-xx, Nov. 2004.

Cooke, Robert W., "Re: Lead Free is not Free, is Costly," Nov. 19, 2004.

Coombs, Verner D., "Fatigue Properties of Pure-Metal Solders," Proceedings of the 1976 International Microelectronics Symposium, Vancouver, B. C., Canada, Oct. 11-13, 1976, pp. 67-72.

Cooper, Casey, "Part, Material, and Process Requirements Impact on Reliability," Pan Pacific Symposium 2016 Proceedings, Waimea, HI, Jan. 25-28, 2016, pp. xx-xx.

Cooper, Cyril, "In-Circuit Test Probe Contact on Lead-Free Printed Circuit Board Assemblies," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S40-01-1-S40-01-15.

Cooper, Emanuel I., Goldsmith, Charles C., Mojica, Carmen, Kilpatrick, Stephen J., Nye III, Henry A., and Alley, Robert J., "Immersion Plating of Bismuth on Tin-Based Alloys to Stabilize Lead-Free Solders," IBM Research Report RC 23508, Jan. 28, 2005.

Cooper, Joyce, and Fava, Jim, "The Life Cycle Assessment Practitioners Survey: Assessment Methods for Evolutionary and Revolutionary Electronic Products," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 1-5.

Cooper, Mark S., "Commercial Parts Technology Qualification Processes," Jet Propulsion Laboratory Publication 13-6 2/13, March 1, 2013.

Copon, Sonny M., "Whisker Test Report," Amkor Technology Whisker Test Report #20060623 Rev. 00, Jan. 15, 2007.

Coppens, Dave, "Thermal Reliability of Printed Wiring Boards: What's Coming From the OEM?," IPC Printed Circuits Expo 2002, pp. S12-2-1 to S12-2-5.

Copple, Andrew, Ralston, Nathaniel, and Peng, Xihong, "Engineering direct-indirect band gap transition in wurtzite GaAs nanowires through size and uniaxial strain," Applied Physics Letters, vol. 100 no. 19, pp. 193108-1-193108-4, 2012.

Corash, Michele B., "Proposition 65: How Far Will It Go?," Printed Circuit Fabrication , vol. 12 no. 5, pp. 50,52-54, May 1989.

Corathers, Lisa, A., "Silicon," Minerals Yearbook: Volume I. -- Metals and Minerals , 2003.

Corbett, Steve, and Domiano, Martin J., "Printing Polymer Solders," Proceedings of the Technical Program NEPCON West '97, Volume 2, Anaheim, CA, Feb. 23-27, 1997, pp. 635-646.

Corbett, Steve, and Domiano, Martin J., "Processing with Polymer Solders," Surface Mount Technology (SMT) , vol. 11 no. 6, pp. 48, 50-51, June 1997.

Corbett, Steven, "Letters to the Editor," Global SMT & Packaging, vol. 5 no. 1, pp. 5, Jan. 2005.

Corbid, L., "Constraints on the Use of Tin Plate in Miniature Electronic Packages," 3rd International SAMPE Electronics Conference, Volume 3, Los Angeles, CA, June 20-22, 1989, pp. 773-779.

Corbin, S. F., "High-Temperature Variable Melting Point Sn-Sb Lead-Free Solder Pastes Using Transient Liquid-Phase Powder Processing," Journal of Electronic Materials, vol. 34 no. 7, pp. 1016-1025, July 2005.

Cordes, Franz, and Huemoeller, Ron, "Electroless Nickel-Gold: Is There a Future? Electroless Ni/Au Plating Capability Study of BGA Packages," Amkor Technology.

Cordoba, R., Han, D.-S., and Koopmans, B., "Manipulating the switching in modulated iron nanowires grown by focused electron beam induced deposition," Microelectronic Engineering, vol. 153, pp. 60-65, Mar. 5, 2016.

Corish, J., and O'Briain, C. D., "Electrochemically Controlled Growth and Dissolution of Silver Whiskers," Journal of Materials Science, vol. 6 no. 3, pp. 252-259, Mar. 1971.

Corish, J., and O'Briain, C. D., "The Growth and Dissolution of Silver Whiskers," Journal of Crystal Growth, vol. 13/14, pp. 62-67, May 1972.

Cork, Alan, "Not all black and white," Polymers Paint Colour Journal, vol. 194 no. 4481, pp, 14-16, Nov. 2004.

Corman, Ned, "Fretting Performance of Lead Free Surface Finishes," Tyco Electronics Publication 503-1002, Nov. 10, 2004.

Corman, Ned, Myers, Marjorie, and Copper, Charles, "Friction Behavior of Press-Fit Applications: Test Apparatus and Methodology," Proceedings of the 49th IEEE Holm Conference on Electrical Contacts , Sept. 2003, pp. xx-xx.

Cornelious, Sean E., and Araque, Juan D., "Historical Perspective and New Developments Regarding Conversion Coatings and Seals for Zinc Deposits," Metal Finishing, vol. 107 no. 4, pp. 20,22-25, 2009.

Cornelius, Ben, Treivish, Shay, Rosenthal, Yair, and Pecht, Michael, "The phenomenon of tin pest: A review," Microelectronics Reliability , vol. 79, pp. 175-192, Dec. 2017.

Corral, Tino, "Die design and wiredrawing - understanding the relationship between die specifications and wiredrawing," Wire Journal International, vol. 35 no. 1, pp. 91-93, Jan. 2002.

Correia, Adriana Nunes, Facanha, Marcello Xavier, and Lima-Neto, Pedro de, "Cu-Sn coatings obtained from pyrophosphate-based electrolytes," Surface and Coatings Technology, vol. 201 no. 16-17, pp. 7216-7221, May 21, 2007.

Cort, Adam, "Coatings and Plating Lend a Hand," Assembly, vol. xx no. xx, pp. xx-xx, May 7, 2003.

Corte-Leon, P., Zhukova, V., Ipatov, M., Blanco, J. M., Gonzalez, J., and Zhukov, A., "Engineering of magnetic properties of Co-rich microwires by joule heating," Intermetallics, vol. 105, pp. 92-98, Feb. 2019. https://doi.org/10.1016/j.intermet.2018.11.013

Corte-Leon, P., Zhukova, V., Ipatov, M., Blanco, J. M., Gonzalez, J., Churyukanova, M., Taskaev, S., and Zhukov, A., "The effect of annealing on magnetic properties of "Thick" microwires," Journal of Alloys and Compounds, vol. 831, pp. 150992-1-150992-8, Aug. 5, 2020.

Corte-Leon, Paula, Zhukova, Valentina, Ipatov, Mihail, Blanco, Juan Maria, Gonzalez, Julian, and Zhukov, Arcady, "Optimization of GMI Effect and Magnetic Properties of Co-Rich Microwires by Joule Heating," IEEE Transactions on Magnetics, vol. 55 no. 2 part 1, pp. 2000404, Feb. 2019.

Corzine, Bill, "Is Hexavalent Chromium Being Misrepresented?," Plating & Surface Finishing, vol. 91 no. 1, pp. 7-8, Jan. 2004.

Cosentino, Faust, and Clasper, Ian, "Waste from Electrical and Electronic Equipment: a review of proposed EU legislation," Measurement and Control, vol. 32 no. 10, pp. 305-307, Dec. 1999.

Costic, Mia, Sullivan, John, Bryant, Barry, and Shangguan, Dongkai, "LCI for Automotive Electronic Systems: Substitution Assessment of Ag-Sn for Pb-Sn Solder at Ford Motor Company," Proceedings of the 1996 IEEE International Symposium on Electronics and the Environment, Dallas, TX, May 6-8, 1996, pp. 58-63.

Costlow, Terry, "Get The Lead Out, Say New Solder Regs," Design News, vol. vol. 60 no. 10, pp. 31, July 19, 2004.

Costlow, Terry, "Get the lead out, solder," Electronic Engineering Times, no. 1077, pp. 1-2, Sept. 6, 1999.

Costlow, Terry, "Lead-free's ongoing challenge," Industrial Control Design Line , Sept. 5, 2005.

Costlow, Terry, "NEMI backs lead-free solder alloy for standard," EE Times, Jan. 24, 2000.

Costlow, Terry, "Rising to the Challenge of Pad Cratering," IPC, Mar. 28, 2011.

Coston, C., and Nachtrieb, N. H., "Self-Diffusion in Tin at High Pressure," Journal of Physical Chemistry , vol. 68 no. 4, pp. 2219-2229, Aug. 1964.

Cote, Debbie, "China clarifies RoHS law," EE Times Europe, Dec. 1, 2006.

Cote, Debbie, and Kerr, Craig, "China clarifies RoHS law," Green SupplyLine, Dec. 1, 2006.

Cote, Debbie, and Miller, Allan, "Five RoHS exemptions are one step closer to approval," Green SupplyLine, Mar. 7, 2006.

Cote, Debbie, and Miller, Allan, "Five RoHS exemptions are one step closer to approval," Green SupplyLine, Mar. 7, 2006.

Cote, Debbie, and Chinn, Robert, "Six steps to sustainable environmental compliance," Green SupplyLine, Jan. 24, 2006.

Cotts, Eric, and Arfaei, Babak, "Emerging Interconnects and Pb-free Materials for Advanced Electronic Packaging," JOM, vol. 67 no. 10, pp. 2381-2382, Oct. 2015.

Coughlan, F. M., and Lewis , H. J., "A Study of Electrically Conductive Adhesives as a Manufacturing Solder Alternative," Journal of Electronic Materials, vol. 35 no. 5, pp. 912-921, May 2006.

Coulter, Eddie, "Make your products EU compliant," Electronics Weekly, Dec. 10, 2004.

Courey, Karim, Wright, Clara, Asfour, Shihab, Bayliss, Jon, and Ludwig, Larry, "An Empirical Model for Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part I," NASA, Dec. 3, 2008.

Courey, Karim, Wright, Clara, Asfour, Shihab, Onar, Arzu, Bayliss, Jon, and Ludwig, Larry, "An Empirical Model for Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part II," NASA, Sept. 29, 2009.

Courey, Karim J., "An Investigation of the Electrical Short Circuit Characteristics of Tin Whiskers," NASA, Jan. 1, 2008.

Courey, Karim J., Asfour, Shihab S., Onar, Arzu, Bayliss, Jon A., Ludwig, Larry L., and Wright, Maria C., "Developing an Empirical Model for Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part II," 3rd International Symposium on Tin Whiskers, Lyngby, Denmark, June 23-24, 2009, pp. xx-xx.

Courey, Karim, Asfour, Shihab, Bayliss, Jon, Ludwig, Larry, and Wright, Clara, "Estimating the Probability of Electrical Short Circuits from Tin Whiskers," NASA-DoD Lead-Free Electronics Project Consortium, Dec. 3, 2008.

Courey, Karim, Asfour, Shihab, Bayliss, Jon, Ludwig, Larry, and Wright, Clara, "Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part I," NASA-DoD Lead-Free Electronics Project Consortium, December 16, 2008, pp. xx-xx.

Courey, Karim, "Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part I," Tin Whisker Group teleconference, Jan. 28, 2009.

Courey, Karim J., Asfour, Shihab S., Onar, Arzu, Bayliss, Jon A., Ludwig, Larry L., and Wright, Maria C., "Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part II," 3rd International Symposium on Tin Whiskers, Lyngby, Denmark, June 23-24, 2009, pp. xx-xx.

Courey, Karim J., Asfour, Shihab S., Onar, Arzu, Bayliss, Jon A., Ludwig, Larry L., and Wright, Maria C., "Estimating the Probability of Electrical Short Circuits from Tin Whiskers - Part II," 2010 Aircraft Airworthiness & Sustainment Conference , Austin, TX, May 10-13, 2010, pp. xx-xx.

Courey, Karim J., Asfour, Shihab S., Bayliss, Jon A., Ludwig, Lawrence L., and Zapata, Maria C., "Tin Whisker Electrical Short Circuit Characteristics - Part I," IEEE Transactions on Electronics Packaging Manufacturing, vol. 31 no 1, pp. 32-40, Jan. 2008.

Courey, Karim J., Asfour, Shihab S., Onar, Arzu, Bayliss, Jon A., Ludwig, Lawrence L., and Wright, Maria C., "Tin Whisker Electrical Short Circuit Characteristics - Part II," IEEE Transactions on Electronics Packaging Manufacturing, vol. 32 no. 1, pp. 41-48, Jan. 2009.

Court, Richard, "What are the typical values of surface energy for materials and adhesives?," TWI, 2004.

Courtemanche, Meredith, "7/1/2006: Gone But Not Forgotten," SMT Web Exclusive Article.

Courtemanche, Meredith, "E-waste Management: Coping with End-of-life," SMT Web Exclusive Article.

Courtemanche, Meredith, "Industry Takes Pulse on Lead-free Medical Electronics," SMT Web Exclusive Article.

Courtemanche, Meredith, "iNEMI Pub Offers RoHS Sub-assembly Guidelines," SMT Web Exclusive Article.

Courtemanche, Meredith, "Lead-free Alchemy," Surface Mount Technology (SMT), vol. 21 no. 9, pp. 22, 26, Sept. 2007.

Courtemanche, Meredith, "Lead-free Alchemy The Full Story," SMT Web Exclusive Article.

Courtemanche, Meredith, "Making Solderless Supply Chains Work," SMT Web Exclusive Article.

Courtemanche, Meredith, "Protecting Honest Industry," SMT Web Exclusive Article.

Courtemanche, Meredith, "Regarding RoHS: Two Years In," SMT Web Exclusive Article.

Courtemanche, Meredith, "Saying Goodbye: An eWaste Story," SMT Web Exclusive Article.

Courtemanche, Meredith, "Saying Goodbye: An eWaste Story, Part II," SMT Web Exclusive Article.

Courtemanche, Meredith, "The Lead-free Dilemma," SMT Web Exclusive Article.

Courtney, Welby G., "Crystal Growth of Silver Metal. Mechanism and Kinetics," Journal of Chemical Physics, vol. 27 no. 5, pp. 1349-1356, Dec. 1957.

Cova, P., Delmonte, N., and Chiozzi, D., "Numerical analysis and experimental tests for solder joints power cycling optimization," Microelectronics Reliability, vol. 55 no. 9-10, pp. 2036-2040, Aug.-Sept. 2015.

Covault, Craig, "Lightning, Workmanship Eyed In New Hughes 601 Problems," Aviation Week & Space Technology, vol. 149 no. 7, pp. 31, Aug. 17, 1998.

Cowieson, David R., Warwick, Malcolm E., and Davis, Paul E., "The Corrosion Resistance of Tin/Zinc Alloy Coatings and the Development of Passivation treatments," The 72nd AES Annual Technical Conference Proceedings, Detroit, MI, July 1985, session O-1 pp. 1-11.

Cox, Dave, and Sweatman, Andrew, "Management of Restricted Substances in Consumer Products," EcoDesign'99 Proceedings: First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Feb. 1-3, 1999, pp. 533-538.

Coya, B., Maranon, E., and Sastre, H., "Ecotoxicity assessment of slag generated in the process of recycling lead from waste batteries," Resources, Conservation, and Recycling, vol. 29 no. 4, pp. 291-300, June 2000.

Coyle, Richard, Parker, Richard, Howell, Keith, Hillman, Dave, Smetana, Joe, Thomas, Glen, Longgood, Stuart, Osterman, Michael, Lundeen, Eric, Snugovsky, Polina, Silk, Julie, Kleyner, Andre, Sweatman, Keith, Padilla, Rafael, Yoshikawa, Tomoyasu, Bath, Jasbir, Holtzer, Mitch, Zhang, Hongwen, Noiray, Jerome, Duondel, Frederic, Aspandiar, Raiyo, and Wilcox, Jim, "A Collaborative Industrial Consortia Program for Characterizing Thermal Fatigue Reliability of Third Generation Pb-Free Alloys," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 188-196.

Coyle, Richard, Read, Peter, Kummerl, Steven, Fleming, Debra, Popowich, Richard, and Chatterji, Indraneel, "A Comprehensive Analysis of the Thermal Fatigue Reliability of SnPb and Pb Free Plastic Ball Grid Arrays (PBGA) Using Backward and Forward Compatible Assembly Processes," SMTAnews & Journal of Surface Mount Technology , vol. 21 no. 4, pp. 33-47, Oct.-Dec. 2008.

Coyle, Richard, Read, Peter, Popowich, Richard, Fleming, Debra, Kummerl, Steven, and Chatterji, Indraneel, "A Comprehensive Solder Joint Reliability Study of SnPb and Pb Free Plastic Ball Grid Arrays (PBGA) Using Backward and Forward Compatible Assembly Processes," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 195-210.

Coyle, Richard, McCormick, Heather, Read, Peter, Popowich, Richard, Fleming, Debra, and Osenbach, John, "A Reliability Comparison of SAC305 and SAC105 Plastic Ball Grid Arrays Assembled with Backward Compatible Soldering Processes," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 68-75.

Coyle, Richard, and Arfaei, Babak, "Advanced Characterization of Pb-Free Interconnects," JOM, vol. 68 no. 11, pp. 2869-2870, Nov. 2016.

Coyle, Richard, Hillman, Dave, Johnson, Charmaine, Parker, Richard, Osterman, Michael, Sandy-Smith, Brook, Arfaei, Babak, Zhang, Hongwen, Geng, Jie, Howell, Keith, Smetana, Joe, Longgood, Stuart, Kleyner, Andre, Delhaise, Andre, Bath, Jasbir, Silk, Julie, Pandher, Ranjit, Lundeen, Eric, Aspandiar, Raiyo, and Noiray, Jerome, "Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Coyle, Richard, Vasudevan, Vasu, Aspandiar, Raiyo, Muntele, Iulia, Tisdale, Steve, Read, Peter, Popowich, Richard, and Fleming, Debra, "Assessing Backward Compatible Solder Joint Reliability under Standard and Mildly Accelerated Test Conditions," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 321-331.

Coyle, Richard, Osenbach, John, Read, Peter, McCormick, Heather, Fleming, Debra, Popowich, Richard, Reid, Michael, Punch, Jeff, Collins, Maurice, Kinyanjui, Robert, and Kummerl, Steven, "Dwell Time, Microstructural Dependencies, and the Interpretation of Thermal Fatigue Test Data of SnPb and Pb-Free Solders," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 384-392.

Coyle, Richard, Johnson, Charmaine, Hillman, Dave, Pearson, Tim, Osterman, Michael, Smetana, Joe, Howell, Keith, Zhang, Hongwen, Silk, Julie, Geng, Jie, Daily, Derek, Arfaei, Babak, Pandher, Ranjit, Delhaise, Andre, Longgood, Stuart, and Kleyner, Andre, "Enhancing Thermal Fatigue Reliability of Pb-Free Solder Alloys with Additions of Bismuth and Antimony," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 339-354.

Coyle, Richard J., Sweatman, Keith, and Arfaei, Babak, "Erratum to: Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends," JOM, vol. 69 no. 7, pp. 1244, July 2017.

Coyle, Richard, Parker, Richard, Henshall, Gregory, Osterman, Michael, Smetana, Joe, Benedetto, Elizabeth, Moore, Donald, Chang, Graver, Arnold, Joelle, and Lee, Tae-Kyu, "iNEMI Pb-Free Alloy Characterization Project Report: Part IV - Effect of Isothermal Preconditioning on Thermal Fatigue Life," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 376-389.

Coyle, Richard, Parker, Richard, Osterman, Michael, Longgood, Stuart, Sweatman, Keith, Benedetto, Elizabeth, Allen, Aileen, George, Elviz, Smetana, Joseph, Howell, Keith, and Arnold, Joelle, "iNEMI Pb-free Alloy Characterization Project Report: Part V - The Effect of Dwell Time on Thermal Fatigue Reliability," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 470-489.

Coyle, Richard, Parker, Richard, Arfaei, Babak, Sweatman, Keith, Howell, Keith, Longgood, Stuart, and Benedetto, Elizabeth, "iNEMI Pb-free Alloy Characterization Project Report: Part VI - The Effect of Component Surface Finish and Solder Paste Composition on Thermal Fatigue of Sn100C Solder Balls," SMTA International 2013 Conference Proceedings , Fort Worth, TX, Oct. 13-17, 2013, pp. 490-503.

Coyle, Richard, Parker, Richard, Benedetto, Elizabeth, Howell, Keith, Sweatman, Keith, Longgood, Stuart, Smetana, Joseph, Allen, Aileen, Reed, Peter, Arfaei, Babak, and Mutuku, Francis, "iNEMI Pb-Free Alloy Characterization Project Report: Part VIII - Thermal Fatigue Results for High-Ag Alloys at Extended Dwell Times," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 547-560.

Coyle, Richard, Parker, Richard, Smetana, Joe, Benedetto, Elizabeth, Howell, Keith, Sweatman, Keith, Liu, Weiping, Osterman, Michael, Silk, Julie, Allen, Aileen, Holtzer, Mitch, Padilla, Rafael, and Yoshikawa, Tomoyasu, "iNEMI Pb-Free Alloy Characterization Project Report: Part IX - Summary of the Effect of Isothermal Preconditioning on Thermal Fatigue Life," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 743-755.

Coyle, Richard, Meilunas, Michael, Popowich, Richard, Anselm, Martin, Read, Peter, Oswald, Mike, and Fleming, Debra, "Interconnection Reliability of Interposer and Reballing Options for Ball Grid Array Backward Compatibility," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 894-902.

Coyle, Richard, McCormick, Heather, Osenbach, John, Read, Peter, Popowich, Richard, Fleming, Debra, and Manock, John, "Pb-free Alloy Silver Content and Thermal Fatigue Reliability of a Large Plastic Ball Grid Array (PBGA) Package," SMTA Journal, vol. 24 no. 1, pp. 27-33, 2011.

Coyle, Richard, Osenbach, John, Collins, Maurice N., McCormick, Heather, Read, Peter, Fleming, Debra, Popowich, Richard, Punch, Jeff, Reid, Michael, and Kummer, Steven, "Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 10, pp. 1583-1593, Oct. 2011.

Coyle, Richard, Kinyanjui, Robert, Read, Peter, Shirey, Jonathon, Fleming, Debra, Abtew, Mulugeta, Popowich, Richard, Muntele, Iulia, and Manock, John, "Solder Joint Reliability of Pb-free Tin-Silver-Copper Ceramic Ball Grid Array (CBGA) Packages as a Function of Cooling Rate and Silver Content," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 548-558.

Coyle, Richard, Kotlowitz, Robert, Read, Peter, Popowich, Richard, Fleming, Debra, Quigley, Robert, and O'Neill, Robert, "Surface Mount Attachment Life Testing of a RF Circulator Component Assembled with Pb-free or SnPb Solder," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 382-392.

Coyle, Richard, McCormick, Heather, Read, Peter, Popowich, Richard, and Fleming, Debra, "Temperature Cycling Performance of a Quad Flat No Lead (QFN) Package Assembled with Multiple Pb-Free Solders," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 5-11.

Coyle, Richard, Hillman, Dave, Parker, Richard, Johnson, Charmaine, Osterman, Michael, Smetana, Joe, Arfaei, Babak, Delhaise, Andre, Howell, Keith, Longgood, Stuart, Kleyner, Andre, Bath, Jasbir, Zhang, Hongwen, and Geng, Jie, "The Effect of Bismuth, Antimony, or Indium on the Thermal Fatigue of High Reliability Pb-Free Solder Alloys," SMTA International 2018 Proceedings , Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Coyle, Richard, Wilcox, Jim, McClure, Peter, Meilunas, Michael, Popowich, Richard, and Johnson, Charmaine, "The Effect of Die Size on the Thermal Fatigue Reliability and Failure Mode of a Chip Array BGA," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 512-521.

Coyle, Richard J., Popps, Diane E. Hodges, Mawer, Andrew, Cullen, Donald P., Wenger, George M., and Solan, Patrick P., "The Effect of Modifications to the Nickel/Gold Surface Finish on Assembly Quality and Attachment Reliability of a Plastic Ball Grid Array (Peer Review Version)," IEEE Transactions on Components and Packaging Technologies , vol. 24 no. 4, pp. 724-732, Dec. 2003.

Coyle, Richard, Parker, Richard, Arfaei, Babak, Mutuku, Francis, Sweatman, Keith, Howell, Keith, Longgood, Stuart, and Benedetto, Elizabeth, "The Effect of Nickel Microalloying on Thermal Fatigue Reliability and Microstructure of SAC105 and SAC205 Solders," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 425-440.

Coyle, Richard, Aspandiar, Raiyo, Vasudevan, Vasu, Tisdale, Steve, Muntele, Iulia, Popowich, Richard, Fleming, Debra, and Read, Peter, "The Effect of Pb Mixing Levels on Solder Joint Reliability and Failure Mode of Backward Compatible, High Density Ball Grid Array Assemblies," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 403-414.

Coyle, Richard, McCormick, Heather, Osenbach, John, Read, Peter, Popowich, Richard, Fleming, Debra, and Manock, John, "The Effect of Silver Content on the Solder Joint Reliability of a Pb-free PBGA Package," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 613-619.

Coyle, Richard, Hillman, Dave, Barnes, Michael, Heller, David, Johnson, Charmaine, Popowich, Richard, Parker, Richard, Howell, Keith, Trodler, Joerg, and Murling, Adam, "The Effect of Vacuum Reflow Processing on Solder Joint Voiding and Thermal Fatigue Reliability," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 108-116.

Coyle, Richard, Read, Peter, McCormick, Heather, Popowich, Richard, and Fleming, Debra, "The Influence of Alloy Composition and Temperature Cycling Dwell Time on the Reliability of a Quad Flat No Lead (QFN) Package," SMTA Journal, vol. 25 no. 1, pp. 28-34, 2012.

Coyle, Richard, Ihms, David, Hubble, Neil, Johnson, Charmaine, deWitt, Jesse, Radhakrishnan, Jagadeesh, Lee, Jeffrey, Wu, Greg, Aranda, Ranilo, and O'Malley, Grace, "The Influence of Printed Circuit Board Thickness on the Thermal Fatigue Reliability of Quad Flat No-Lead Packages," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Coyle, Richard, McCormick, Heather, Read, Peter, Popowich, Richard, and Osenbach, John, "The Influence of Solder Void Location on BGA Thermal Fatigue Life," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 132-140.

Coyle, Richard J., and Solan, Patrick P., "The Influence of Test Parameters and Package Design Features on Ball Shear Test Requirements," Twenty-Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium, Santa Clara, CA, Oct. 2-3, 2000, pp. 168-177.

Coyle, Richard, Reid, Michael, Ryan, Claire, Popowich, Richard, Read, Peter, Fleming, Debra, Collins, Maurice, Punch, Jeff, and Chatterji, Indraneel, "The Influence of the Pb-free Solder Alloy Composition and Processing Parameters on Thermal Fatigue Performance of a Ceramic Chip Resistor," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 423-430.

Coyle, Richard, Aspandiar, Raiyo, Osterman, Michael, Johnson, Charmaine, Popowich, Richard, Parker, Richard, and Hillman, Dave, "Thermal Cycle Reliability of a Low Silver Ball Grid Array Assembled with Tin Bismuth Solder Paste," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 72-83.

Coyle, Richard, Johnson, Charmaine, Hillman, Dave, Parker, Richard, Osterman, Michael, Smetana, Joe, Pearson, Tim, Arfaei, Babak, Howell, Keith, Longgood, Stuart, Kleyner, Andre, Silk, Julie, Delhaise, Andre, Zhang, Hongwen, Geng, Jie, Pandher, Ranjit, and Lundeen, Eric, "Thermal Cycling Reliability and Failure Mode of Two Ball Grid Array Packages with High Reliability Pb-Free Solder Alloys," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 439-456.

Coyle, Richard J., Sweatman, Keith, and Arfaei, Babak, "Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends," JOM, vol. 67 no. 10, pp. 2394-2415, Oct. 2015.

Coyle, Richard, McCormick, Heather, Read, Peter, Popowich, Richard, and Fleming, Debra, "Thermal Fatigue Performance of a Quad Flat No Lead (QFN) Package Assembled with Sn-Ag-Cu (SAC) and SnPb Solders," SMTA International Conference , San Diego, CA, Oct. 4-8, 2009, pp. 137-143.

Coyle, Richard, Aspandiar, Raiyo, Vasudevan, Vasu, Tisdale, Steve, Muntele, Iulia, Popowich, Richard, Read, Peter, and Fleming, Debra, "Thermal Fatigue Reliability and Microstructural Characterization of a Large, High Density Ball Grid Array with Backward Compatible Assembly," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 886-893.

Coyle, Richard, Hillman, Dave, Johnson, Charmaine, Howell, Keith, Popowich, Richard, Heller, David, Parker, Richard, Trodler, Jorg, and Murling, Adam, "Using Vacuum Reflow Processing to Eliminate Solder Joint Voiding and Optimize Thermal Fatigue Reliability," SMTA Journal, vol. 32 no. 1, pp. 9-18, 2019.

Coyle, Richard, Johnson, Charmaine, Pearson, Tim, Hillman, Dave, Meilunas, Michael, Dimock, Fred, Popowich, Richard, Bouchard, Bob, Parker, Richard, Howell, Keith, Trodler, Jorg, Karthikeyan, Arvind, and Barr, Elizabeth, "Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 567-576.

Cramer, J. M., and Stevels, A. L. N., "A model for the take-back of discarded consumer electronics products," Engineering Science and Education Journal, vol. 5 no. 4, pp. 165-169, Aug. 1996.

Crandall, E. R., Flowers, G. T., Dean, R. N., and Bozack, M. J., "Growth of Sn Whiskers on Semiconductor and Insulator Surfaces," 2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts, Charleston, SC, Oct. 4-7, 2010, pp. xx-xx.

Crandall, E. R., Flowers, G. T., Jackson, R., Lall, P., and Bozack, M. J., "Growth of Sn Whiskers Under Net Compressive and Tensile Stress States," 2011 IEEE 57th Holm Conference on Electrical Contacts, Minneapolis, MN, Sept. 11-14, 2011, pp. xx-xx.

Crandall, E. R., Flowers, G. T., Dean, R. N., and Bozack, M. J., "Oxidation-Induced Growth of Sn Whiskers in a Pure Oxygen Gas Environment," 2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts , Charleston, SC, Oct. 4-7, 2010, pp. xx-xx.

Crandall, E. R., Flowers, G. T., Lall, P., Snipes, E. K., and Bozack, M. J., "The Influence of Surface Oxides on Whiskering," 2012 IEEE 58th Holm Conference on Electrical Contacts, Portland, OR, Sept. 23-26, 2012, pp. xx-xx.

Crandall, E. R., Flowers, G. T., Lall, P., and Bozack, M. J., "Whisker Growth From Sn Solder Alloys," 2012 IEEE 14th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 5-7, 2012, pp. 671-675.

Crandall, E. R., Flowers, G. T., Lall, P., and Bozack, M. J., "Whisker Growth Under Controlled Humidity Exposure," 2011 IEEE 57th Holm Conference on Electrical Contacts, Minneapolis, MN, Sept. 11-14, 2011, pp. xx-xx.

Crandall, E. R., Flowers, G. T., Lall, P., and Bozack, M. J., "Whisker Prevention Using Hard Metal Cap Layers," 2012 IEEE 58th Holm Conference on Electrical Contacts, Portland, OR, Sept. 23-26, 2012, pp. xx-xx.

Crandall, Erika, "Metal Whisker Mitigation Strategies for Press-Fit Pin Connections," 10th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Villepinte, France, May 15-16, 2019, pp. xx-xx.

Crane, Lauren, "Europe's REACH Regulation - Busting the 1 Tonne Myth, with a Focus on Articles," 2008 IEEE Symposium on Product Compliance Engineering, Austin, TX, Oct. 20-22, 2008, pp. xx-xx.

Crane, Lauren, "Europe's REACH Regulation - Busting the 1 Tonne Myth, with a Focus on Articles (presentation)," 2008 IEEE Symposium on Product Compliance Engineering, Austin, TX, Oct. 20-22, 2008, pp. xx-xx.

Crary, Michael, "Uses & Properties of Multilayer Nickel Systems & Alternative Finishes in the Aluminum Wheel Market," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 380-384.

Craw-Ivanco, Marjory, "Here today, back tomorrow," Green SupplyLine, June 1, 2006.

Craw-Ivanco, Marjory, "Here today, back tomorrow," Electronics Supply & Manufacturing , June 2006.

Craw-Ivanco, Marjory, "No Finish Line for Environmental Compliance," Lead-Free Magazine .

Craw-Ivanco, Marjory, and Dreyer, Andrew, "The Evolution of Environmentally Conscious Material Management," SMT Web Exclusive Article.

Crawford, Jack, "One Step Closer to Lead-Free Standards," Circuits Assembly, vol. 15 no. 7, pp. 18, July 2004.

Crawford, Jack, "Thermal and Process Sensitivity Beyond ICs," Surface Mount Technology (SMT), vol. 23 no. 2, pp. 7, Mar.-Apr. 2009.

Crawford, Michael, "Zinc whiskers found in War Memorial," Computerworld, vol. xx no. xx, pp. xx, Aug. 12, 2004.

Crawford, Michael, "'Zinc Whiskers' Vex Aussie Data Centers," Computerworld, vol. 38 no. 50, pp, 12, Dec. 13, 2004.

Craw-Ivanco, Marjory, "No Finish Line for Environmental Compliance," Lead-Free Magazine , vol. 7, Nov. 2006.

Crea, John J., and Hogerton, Peter B., "Development of a Z-Axis Adhesive Film for Flex Circuit Interconnects and TAB Outer Lead Bonding," Proceedings of the Technical Program NEPCON West '91, Volume I, Anaheim, CA, Feb. 24-28, 1991, pp. 251-259.

Critchlow, G. W., "Alternatives to Hexavalent Chromium Processes to Enhance the Durability of Bonded Aluminum Joints," Transactions of the Institute of Metal Finishing, vol. 76 no. 1, pp. B6-B10, Jan. 1998.

Crocker, David, "Hazardous Material Replacements In the Brush Plating Industry," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. 417-421.

Cronin, Eanna, Hickey, Stewart, and Fitzpatrick, Colin, "A Method for Extracting Historical Thermal Data from Used PCs to Foster Reuse," 2010 IEEE International Symposium on Sustainable Systems and Technology, Arlington, VA, May 17-19, 2010, pp. xx-xx.

Cronin, Jim, "Halogen Free: What, Why and How," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Cronin, Thomas M., Mabbett, Arthur N., "Lead-Free WEEE and RoHS Issues to Consider," Surface Mount Technology (SMT), vol. 19 no. 1, pp. 50, Jan. 2005.

Crosbie, Paul, and Lee, Yeong J., "Multiple impact characterization of wafer level packaging (WLP)," Microelectronics Reliability, vol. xx no. x, pp. xx-xx, xxxx.

Crosley, David, "Chrome-Free Pretreatment Rinse," Products Finishing, vol. xx no. x, pp. xx-xx, Dec. 1999.

Crosley, Grant, Hua, Frank, Lembach, Kyle, and Muller, Chris, "RoHS Solved One Problem, Created Others: Reliability Reports from the Field," 2009 AIMS Harsh Environments Electronics Symposium, San Diego, CA, Oct. 5-6, 2009, pp. 887-898.

Cross, B. J., Wherry, D. C., and Briggs, T. H., "New Methods for High-Performance X-Ray Fluorescence Thickness Measurements," Plating & Surface Finishing, vol. 75 no. 8, pp. 68-74, Aug. 1988.

Crotty, David, and Du, Jerry, "Investigations of alternate acids for use in acid tin plating," Wire Journal International, vol. 36 no. 4, pp. 117-122, Apr. 2003.

Crotty, David, and Griffin, Robert, "Performance Characteristics of Zinc Alloys," Plating & Surface Finishing, vol. 84 no. 4, pp. 57-61, Apr. 1997.

Crotty, David, "The Measurement of Internal Stress of Electroplated Deposits," Plating & Surface Finishing, vol. 91 no. 10, pp. 56-59, Oct. 2004.

Crotty, David E., "Trivalent Chromium Conversion Coatings," American Electroplaters' Society SUR/FIN '82 69th Annual Technical Conference, San Francisco, CA, June 20-24, 1982, session B-2 pp. 1-11.

Crotty, Krista Botsford, "EU RoHS Recast - Are You Ready?," 2011 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, Kamuela, HI, Jan. 18-20, 2011, pp. xx-xx.

Crotty, Krista, "EU RoHS Recast - Are You Ready?," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 223-224.

Crotty, Krista, "RoHS Recast Update: Medical Devices are in Scope," Medical Electronics Symposium 2012 Proceedings, Tempe, AZ, Sept. 26-27, 2012, pp. xx-xx.

Crouse, Ken, and Cullen, Don, "A Key Failure Mode Resulting in INTERFACIAL FRACTURE of Soldered ENIG Surfaces," Printed Circuit Fabrication, vol. 25 no. 2, pp. 22-24,26,28,30,32, Feb. 2002.

Crowther, J. C., and Renton, S., "Recent Developments in Trivalent Chromium Plating," Electroplating and Metal Finishing, vol. 28 no. 5, pp. 6, 8-, 12-14, May 1975.

Crum, Susan, "How Lead-Free Solder Affects PCB Manufacturability," Electronic Packaging & Production, vol. xx no. xx, pp. xx, June 2000.

Cruz, Yanil, and Thompson, Ken, "Reliability Impact of Simulated Board Reflow Ramp Rate on Various Surface Mount IC Packages," 2008 SMTA International Conference Proceedings , Orlando, FL, Aug. 17-21, 2008, pp. 512-518.

Cucu, T. C., Plotog, I., and Branzei, M., "Mechanical Tests Regarding Low-Temperature Lead-Free Solder Pastes Application in Automotive Electronics," 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging, Bucharest, Romania, Oct. 23-26, 2014, pp. 63-68.

Cucu, Traian C., Plotog, Ioan, Svasta, Paul, and Branzei, Mihai, "Low Silver, Lead Free Solder Paste, New Alloy Developments," 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging , Pitesti, Romania, Sept. 23-26, 2010, pp. 39-42.

Cucu, Traian C., Plotog, Ioan, and Branzei, Mihai, "Low Temperature Solder Paste Process Advantages," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 545-549.

Cucu, Traian C., Bilgrien, Carl, Lifton, Anna, and Lazovskaya, Irina, "The Impact of Alloy Composition on Shear Strength for Low Temperature Lead Free Alloys," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Cuddalorepanal, Gayatri, Dasgupta, Abhijit, Sealing, Scott, Moyer, Jerome, Tolliver, Todd, and Loman, James, "Durability of Pb-Free Solder Connection Between Copper Interconect Wire and Crystalline Silicon Solar Cells," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , San Diego, CA, May 30-June 2, 2006, pp. 1232-1239.

Cuddalorepatta, Gayatri, Dasgupta, Abhijit, Sealing, Scott, Moyer, Jerome, Tolliver, Todd, and Loman, James, "Durability of Pb-Free Solder Connection between Copper Interconnect Wire and Crystalline Silicon Solar Cells - Experimental Approach," 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 16-21.

Cuddalorepatta, Gayatri, and Dasgupta, Abhijit, "Effect of Cyclic Fatigue Damage Accumulation on the Elastic-Plastic Properties of SAC305 Solders," 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, Delft, Netherlands, Apr. 26-29, 2009, pp. xx-xx.

Cuddalorepatta, Gayatri, and Dasgupta, Abhijit, "Effect of Primary Creep Behavior on Fatigue Damage Accumulation Rates in Accelerated Thermal Cycling of Sn3.0Ag0.5Cu Pb-Free Interconnects," International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, Freiburg, Germany, Apr. 20-23, 2008, pp. xx-xx.

Cuddalorepatta, Gayatri, and Dasgupta, Abhijit, "Multi-scale Viscoplastic Modeling of Pb-free Sn3.0Ag0.5Cu Solder Interconnects," 2010 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, Bordeaux, France, Apr. 26-28, 2010, pp. xx-xx.

Cuddalorepatta, Gayatri, Herkommer, Dominik, and Dasgupta, Abhijit, "Stress Relaxation Characterization of Hypoeutectic Sn3.0Ag0.5Cu Pb-free Solder: Experiment and Modeling," Proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, London, England, Apr. 15-18, 2007, pp. xx-xx.

Cuddalorepatta, Gayatri, and Dasgupta, Abhijit, "Viscoplastic Behavior of Hypo-Eutectic Sn3.0Ag0.5Cu Pb-Free Alloy Under Creep Loading Conditions," 2007 ASME International Mechanical Engineering Conference and Exposition, Volume 5, Seattle, WA, Nov. 11-15, 2007, pp. 159-166.

Cuddalorepatta, Gayatri, Williams, Maureen, and Dasgupta, Abhijit, "Viscoplastic Creep Response and Microstructure of As-Fabricated Microscale Sn-3.0Ag-0.5Cu Solder Interconnects," Journal of Electronic Materials , vol. 39 no. 10, pp. 2292-2309, Oct. 2010.

Cuevas, Ana, Dalchiele, Enrique Ariel, Marotti, Ricardo, Leinen, Dietmar, Ramos-Barrado, Jose Ramon, and Martin, Francisco, "Mechanical properties of vertically aligned single-crystalline silicon nanowire arrays," Journal of Materials Research, vol. 26 no. 9, pp. 1091-1099, May 14, 2011.

Cugnoni, J., Botsis, J., Sivasubramaniam, V., and Janczak-Rusch, J., "Experimental and numerical studies on size and constraining effects in lead-free solder joints," Fatigue and Fracture of Engineering Materials and Structures, vol. 30 no. 5, pp. 387-399, May 2007.

Cugnoni, Joel, Botsis, John, and Janczak-Rusch, Jolanta, "Size and Constraining Effects in Lead-Free Solder Joints," Advanced Engineering Materials, vol. 8 no. 3, pp. 184-191, Mar. 2006.

Cui, Ajuan, Yao, Yuan, Li, Wuxia, Gu, Changzhi, Shen, Xi, Wang, Yanguo, and Yu, Richeng, "In situ observation and thermal alloying induced shape manipulation of FIB-grown Pt composite nanowires," Materials Letters, vol. 179, pp. 78-81, Sept. 15, 2016.

Cui, C. X., Wang, B. L., Yang, W., and Sun, J. B., "Effect of deposition voltage and Co2+ concentration on the texture and magnetic properties of Co nanowire arrays," Journal of Crystal Growth , vol. 324 no. 1, pp. 168-171, June 1, 2011.

Cui, Hui-Wang, Li, Dong-Sheng, Fan, Qiong, and Lai, Hua-Xiang, "Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging," International Journal of Adhesion & Adhesives, vol. 44, pp. 232-236, July 2013.

Cui, Hui-Wang, Jiu, Jin-Ting, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki, and Uchida, Hiroshi, "Using Ozawa method to study the curing kinetics of electrically conductive adhesives," Journal of Thermal Analysis and Calorimetry, vol. 117 no. 3, pp. 1365-1373, Sept. 2014.

Cui, Hui-Wang, Jiu, Jin-Ting, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki, Uchida, Hiroshi, and Schroder, Kurt A., "Using the Friedman method to study the thermal degradation kinetics of photonically cured electrically conductive adhesives," Journal of Thermal Analysis and Calorimetry, vol. 119 no. 1, pp. 425-433, Jan. 2015.

Cui, Jinzi, Johnson, R. Wayne, and Hamilton, Michael C., "Reliability of Die Attach on DBC Substrates With Different Ni Surface Finishes Using BiAgX Solder," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 7 no. 12, pp. 1940-1950, Dec. 2017.

Cui, Jirang, and Forssberg, Eric, "Mechanical recycling of waste electric and electronic equipment: a review," Journal of Hazardous Materials, vol. 99 no. 3, pp. 243-263, May 30, 2003.

Cui, Tong, Syed, Ahmer, Keser, Beth, Alvarado, Rey, Xu, Steven, and Schwarz, Mark, "Interconnect Reliability Prediction for Wafer Level Packages (WLP) for Temperature Cycle and Drop Load Conditions," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 100-107.

Cui, Wen, "The Effect of Current Density on Zinc Whisker Grwoth," Advanced Materials Research, vol. 562-564, pp. 129-133, Aug. 2012.

Cui, Wen, and Qi, Shaojun, "The effect of surface finish on zinc whisker growth," Advanced Materials Research, vol. 472-475, pp. 2756-2759, Feb. 2012.

Cui, Xiaoya, Yang, Cheng, Zhang, Zhexu, Wu, Haoyi, Chiang, Sumwai, Su, Zijin, Liu, Jingping, and Kang, Feiyu, "Scalable Synthesis of the Mono-dispersed Silver Micro-dendrites and Their Applications in the Ultralow Cost Printed Electrically Conductive Adhesives," 2013 14th International Conference on Electronic Packaging Technology , Dalian, China, Aug. 11-14, 2013, pp. 273-279.

Cui, Y., Liu, X. J., Ohnuma, I., Kainuma, R., Ohtani, H., and Ishida, K., "Thermodynamic calculation of the In-Sn-Zn ternary system," Journal of Alloys and Compounds, vol. 320 no. 2, pp. 234-241, May 24, 2001.

Cui, Yi, and Lieber, Charles M., "Functional Nanoscale Electronic Devices Assembled Using Silicon Nanowire Building Blocks," Science, vol. 291 no. 5505, pp.851-853, Feb. 2, 2001.

Cui, Yipeng, and Huang, Mingliang, "Comparative Study of Interfacial Reactions of High-Sn Lead-free Solders on Single Crystal Cu and on Polycrystalline Cu," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 593-596.

Cui, Yuwen, Ishihara, Satoru, Liu, Xing Jun, Ohnuma, Ikuo, Kainuma, Ryosuke, Ohtani, Hiroshi, and Ishida, Kiyohito, "Thermodynamic Calculation of Phase Diagram in the Bi-In-Sb Ternary System," Materials Transactions, vol. 43 no. 8, pp. 1879-1886, Aug. 2002.

Cullen, Don, "Back to Basics," Printed Circuit Design and Fab, vol 25 no. 10, pp. 20, Oct. 2008.

Cullen, Don, "Going Beneath the Surface of Surface Finishes," CircuiTree, vol. 15 no. 11, pp. xx, Nov. 2002.

Cullen, Don, "Immersion invasion!," Printed Circuit Fabrication, vol. 22 no. 3, pp. 46,48,50,52,54-55, Mar. 1999.

Cullen, Don, "IPC Metal Finishes Group Issues OEM Call to Action on PCB Assembly Corrosion," CircuiTree, vol. 20 no. 12, pp. xx-xx, Dec. 2007.

Cullen. Don, "Planar Final Finishes," Circuits Assembly, vol. 9 no. 11, pp. 62,64-67, Nov. 1998.

Cullen, Don, "The Atomic Energy of Surface Finishes," Printed Circuit Design and Fab, vol. 26 no. 1, pp. 19, Jan. 2009.

Cullen, Don, "The Path to Robust Electronics - Preventing Corrosion of PCB Assemblies," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S35:02.

Cullen, Donald P., "Characterization, Reproduction, and Resolution of Solderjoint Microvoiding," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Cullen, Donald, Paw, Witold, Swanson, John, and Toscano, Lenora, "Eliminating Microvoid Risk via an Optimized Surface Finish Process," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Cullen, Donald, and Loscano, Lenora, "Immersion Metal PWB Surface Finishes: A Direct Comparison of Selected Fabrication, Assembly and Reliability Characteristics," HKPCA Journal no. 10, pp. 1/9 to 9/9.

Cullen, Donald P., and O'Brien, Gerard, "Implementation of Immersion Silver PCB Fininsh in Compliance With Underwriters Laboratories," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S10-5-1-S10-5-10.

Cullen, Donald P., "New Generation Metallic Solderability Preservatives: Immersion Silver Performance Results," 1999 SMTA International Conference Proceedings , San Jose, CA, Sept. 12-16, 1999, pp. xx-xx.

Cullen, Donald P., "Surface Tarnish and Creeping Corrosion on Pb-Free Circuit Board Surface Finishes," IPC Review, vol. 47 no. 1, pp. 7, Jan. 2006.

Cullen, Donald P., "The Effects of Immersion Silver Circuit Board Surface Finish On Electrochemical Migration," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 497-507.

Cullen, Donald, and O'Brien, Gerard, "Underwriters Labs Compliance of Immersion Silver PCB Finish," OnBoard Technology, vol. xx no. xx, pp. 8-12, Oct. 2004.

Cummings, Lauren, and Dobriyal, Priyanka, "Rework and Reball Challenges for Wafer-Level Packages," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 796-803.

Cunningham, Justin, "Countdown to the lead-free law," Professional Engineering, vol. 19 no. 7, pp. 35, Apr. 12, 2006.

Cunningham, Kathleen M., and Donahue, Michael P., "Tin Whiskers: Mechanism of Growth and Prevention," 4th International SAMPE Electronics Conference, Volume 4, Albuquerque, NM, June 12-14, 1990. pp. 569-575.

Curcio, Joe, "Hand soldering with lead free alloys," Global SMT & Packaging , vol. 5 no. 1, pp. 34-38, Jan. 2005.

Curran, Kevin, "Making the Choice," Adhesives & Sealants Industry, vol xx no. x, pp. xx-xx, Apr. 1, 2005.

Curran, Kevin, "RoHS Compliance and Pb-Free Capability: One and the Same?," Adhesives & Sealants Industry, vol. 14 no. 7, pp. 40, July 2007.

Curreli, Marco, Zhang, Rui, Ishikawa, Fumiaki N., Chang, Hsiao-Kang, Cote, Richard J., Zhou, Chongwu, and Thompson, Mark E., "Real-Time, Label-Free Detection of Biological Entities Using Nanowire-Based FETs," IEEE Transactions on Nanotechnology, vol. 7 no. 6, pp. 651-667, Nov. 2008.

Currie, Mark, "Lead-Free Solder Joint Voiding: The Causes are Starting to Surface," Circuitnet.

Curry, Michael L., Crews, Kristy, Warke, Vishal, Bakker, Martin Gerard, Hong, Kunlun, Mays, Jimmy, Britt, Phillip, Li, Xuefa, and Wang, Jin, "Electrodeposition of cobalt nanowires on H-terminated conductive Si(111) surfaces using coblock polymer templating," Journal of Vacuum Science & Technology A: Vacuum Surfaces, and Films, vol. 29 no. 3, pp. 031401-1-031401-5, May 2011.

Curtin, Benjamin M., Fang, Eugene W., and Bowers, John E., "Highly Ordered Vertical Silicon Nanowire Array Composite Thin Films for Thermoelectric Devices," Journal of Electronic Materials, vol. 41 no. 5, pp. 887-894, May 2012.

Curtin, Mark J., "Stencil Printing with Lead-Free Solder Paste," 2005 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Curtis, Jon, "Anyone got an opinion on RoHS?," Conformity, vol. 10 no. 9, pp. 6, Sept. 2005.

Cusack, Paul, "Analytical Test Protocols for Ensuring Compliance with the EU RoHS Directive," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Cusack, Paul, "Analytical Test Protocols for Ensuring Compliance with the RoHS Directive," SMART Group 8th Annual Lead-Free Seminar + 'Question Time' & Table-Top Exhibition, High Wycombe, United Kingdom, Feb. 16, 2006.

Cusack, Paul, and Perrett, Tom, "The EU RoHS Directive and its implications for the plastics industry," Plastics, Additives and Compounding, vol. 8 no. 3, pp. 46-49, May-June 2006.

Cusack, Paul, "The Future of Flame Retardants in the Electronics Industry," soldertec global.

Custer, Kevin, "Help... My MASTR II has lost receiver sensitivity."

Custer, Kevin, "Help... My Receiver has lost Sensitivity!", March 2001.

Cuthbertson, J. W., "Electro-depositing Tin-Zinc ," Tin and its Uses, no. 17, pp. 13, Oct. 1946.

Cuthbertson, J. W., "Tin-Zinc Plating," Tin and its Uses, no. 20, pp. 5-6, Mar. 1949.

Cutler, George, "Assuring Reliability in Electronic Products Utilizing Lead-Free Non-Hazardous Materials in Soldering," Transistor Devices, Mar. 23, 2006.

Cyganowski, Anna, Brusse, Jay, and Leidecker, Henning, "Nickel Cadmium Batteries: A Medium for the Study of Metal Whiskers and Dendrites," Oct. 20, 2006.

Cyganowski, Anna, Leidecker, Henning, and Brusse, Jay, "Nickel Cadmium Batteries: A Mediium for the Study of Metal Whiskers and Dendrittes," Tin Whisker Group teleconference, Dec. 6, 2006.

Cygon, Manfred, Hein, Marc, and Choate, Marty, "Halogen Free Base Materials for PWB Applications," IPC Printed Circuits Expo 2000, San Diego, CA, Apr. 2-6, 2000, pp. S16-2-1 to S16-2-4.

Cygon, Manfred, "Industry Response to Oko-Institut Recommendations," IPC Brussels , Brussels, Belgium, June 18, 2008, pp. xx-xx.

Cymbalski, Olek, "Lead-free ICs and Device Programming," Surface Mount Technology (SMT) , vol. 20 no. 5, pp. 64, May 2006.

Czaja, Jim, "Practical Aspects of the Electroless Nickel/Immersion Gold Process," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. 21-25.

Czaplicki, Brian, "Advanced Through-Hole Rework of Thermally Challenging Components/Assemblies: An Evolutionary Process, Part 1," Surface Mount Technology (SMT), vol. 28 no. 6, pp. 34,36-38,40-42,44-45, July 2013.

Czarnowski, John M., Reynolds, Mark E. S., and Mawer, Andrew J., "Area Bonding Conductive Adhesives for Grid Array Chip Carrier Attach," Proceedings of the Technical Program NEPCON East '96, Boston, MA, June 11-13, 1996, pp. 63-71.

Czarnowski, John M., Reynolds, Mark E. S., Hayes, Mather T., Ellis, Charles D., Johnson, R. Wayne, and Palmer, Michael J., "Evaluation of Area Bonding Conductive Adhesives for Flip Chip Attach of Area Bonded Die," Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, Oct. 14-16, 1996, pp. 476-481.

Czerwinski, A., Skwarek, A., Pluska, M., Ratajczak, J., and Witek, K., "Whisker Growth in Tin Alloys on Glass-Epoxy Laminate," Surface Mount Technology (SMT), vol. 29 no. 7, pp. 30,32,34-36,38-39, July 2014.

Czerwinski, Andrzej, Skwarek, Agata, Pluska, Mariusz, Ratajczak, Jacek, and Witek, Krzysztof, "Tin pest versus tin oxidation on tin-rich lead-free alloys investigated by electron microscopy methods," Solid State Phenomena, vol. 186, pp. 275-278, Mar. 2012.

DDDD

Daddona, Patricia, "Reactor Shutdown: Dominion Learns Big Lesson From A Tiny `tin Whisker'," The Day, July 4, 2005.

Dagan, Roi, Dubey, Brajesh, Bitton, Gabriel, and Townsend, Timothy, "Aquatic Toxicity of Leachates Generated from Electronic Devices," Archives of Environmental Contamination and Toxicology, vol. 53 no. 2, pp. 168-173, Aug. 2007.

Daghfal, John P., and Shang, J. K., "Current-Induced Phase Partitioning in Eutectic Indium-Tin Pb-Free Solder Interconnect," Journal of Electronic Materials, vol. 36 no. 10, pp. 1372-1377, Oct. 2007.

Daghfal, John P., Shang, P. J., Liu, Z. Q., and Shang, J. K., "Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings," Journal of Electronic Materials, vol. 38 no. 12, pp. 2506-2515, Dec. 2009.

D'Agostino, Carm, de Krom, Adrian, and Kluk, David, "RoHS Testing: Lead-free Is Not Trouble-free," Surface Mount Technology (SMT), vol. 20 no. 8, pp. 32, 34-35, Aug. 2006.

D'agostino, Carm, Kluk, David, and de Krom, Adrian, "The Challenges of RoHS Compliance and Testing," COTS Journal , pp. xx-xx, Feb. 2007.

D'Agostino, Saverio, and Evans, Ken, "Tin Whiskers: 1 What Are They?," Electronic Parts Engineering .

D'Agostino, Saverio, and Evans, Ken, "Tin Whiskers: 2 MER Whiskers: The Problem & Solution," Electronic Parts Engineering.

D'Agostino, Saverio, and Evans, Ken, "Tin Whiskers: 3 Other Data," Electronic Parts Engineering.

Dahan, Y., Makov, G., and Shneck, R. Z., "Nanometric size dependent phase diagram of Bi-Sn," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 53, pp. 136-145, June 2016.

Dahle, Bjorn, "Define, Measure, Improve," Lead-Free Connection, vol. 1 no. 1, pp. 11, July 2004.

Dahle, Bjorn, "Managing the Lead-Free Thermal Process," Lead-Free Connection , vol. 2 no. 2, pp. 6, June 2005.

Dahle, Bjorn, "REFLOW Solutions to the Lead-Free Challenge," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, Feb. 2000.

Dahle, Bjorn, "Thermal Process," Lead-Free Magazine.

Dahlgren, E., Sun, J., O'Keefe, T. J., and O'Keefe, M. J., "Spontaneous Electrochemical Deposition of Gold Coatings from Organic Solutions," Plating and Surface Finishing, vol. 92 no. 1, pp. 36-41, Jan. 2005.

Dahmus, Jeffrey B., and Gutowski, Timothy G., "Material Recycling at Product End-of-Life," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 206-211.

Dai, Fengwei, Yu, Daquan, Yin, Wen, Zhao, Ning, Wan, Lixi, Yu, Han, Wang, Su, and Sun, Jiangyan, "Newly Developed In-situ Formation of SnAg and SnAgCu Solder on copper Pillar Bump," 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 7-9, 2011, pp. 175-179.

Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin, and Johnson, Christopher Mark, "Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling," IEEE Transactions on Device and Materials Reliability, vol. 18 no. 2, pp. 256-265, June 2018.

Dai, Kai, Zhu, Guangping, Lu, Luhua, and Dawson, Graham, "Easy and Large Scale Synthesis Silver Nanodendrites: Highly Effective Filler for Isotropic Conductive Adhesives," Journal of Materials Engineering and Performance, vol. xx no. x, pp. xx-xx, xxxx.

Dai, R., Zhang, S. G., and Li, J. G., "One-Step Fabrication of Al/Sn-Bi Core-Shell Spheres via Phase Separation," Journal of Electronic Materials, vol. 40 no. 12, pp. 2458-2464, Dec. 2011.

Daily, Derek, "LTS - A Path Forward," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. xx-xx.

Daito, Tomoya, Nishikawa, Hiroshi, Takemoto, Tadashi, and Matsunami, Takashi, "Explanation of impact load curve in ball impact test in relation to thermal aging," Microelectronics Reliability, vol. xx no. x pp. xx-xx, xxxx.

Daito, Tomoya, Nishikawa, Hiroshi, Takemoto, Tadashi, and Matsunami, Takashi, "Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder/Co-P Plating and Ni-Co-P Plating," Quarterly Journal of the Japan Welding Society, vol. 29 no. 3, pp. 142s-146s, 2011.

Dalderup, Marc, Barbibi, Denis, and Diepstraten, Gerjan, "Selective Soldering with Lead-Free Alloys," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 31-34.

Dale, E. Brock, and Calvert, James W., "Procedure for Mounting and Electroding Semiconductor Whiskers for Conductivity Measurements," Review of Scientific Instruments, vol. 35, pp. 1719, 1964.

Dalich, George M., "A Comparison of Immersion and Electrolytic Gold as a Final Finish for PCBs," 2000 SMTA International Conference Proceedings, Chicago, IL, Sept. 24-28, 2000, pp. xx-xx.

Dalili, Neda, He, Anqiang, Liu, Qi, and Ivey, Douglas G., "A Cryo-XPS Study of Triammonium Citrate-KAuCl4-Na2SO3 Electroplating Solutions for Pb-Free Solder Packaging," journal of Electronic Materials , vol. 39 no. 9, pp. 1554-1561, Sept. 2010.

Dalpino, Nicolette, and Egan, Calleene, "E-Waste and the Standard That Loves It," Quality Digest, vol. 29 no. 4, pp. 8, Apr. 2009.

Dalrymple, I., Wright, N., Kellner, R., Bains, N., Geraghty, K., Goosey, M., and Lightfoot, L., "An integrated approcah to electronic waste (WEEE) recycling," Circuit World, vol. 33 no. 2, pp. 52-58, 2007.

Damasceni, A., Dei, L., and Guasti, F., "Thermal Behaviour of Silver-Filled Epoxy Adhesives. Technological implications in microelectronics," Journal of Thermal Analysis and Calorimetry, vol. 66 no. 1, pp. 223-232, 2001.

Damaschke, B., and Tidecks, R., "Inverse AC-Josephson effect in superconducting In and Pb-whiskers," Zeitschrift fur Physik B Condensed Matter, vol. 77 no. 1, pp. 17-23, Feb. 1989. https://doi.org/10.1007/BF01313614

Dan, Huang, Jian, Zhou, and Pei, Li Pei, "Corrosion Performance of Pb-free Sn-Zn Solders in Salt Spray," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Dance, Brian, "European Producers Call For Lead-Free World Standard," Semiconductor International, vol. 24 no. 10, pp. 50, Sept. 2001.

Dandu, P., Fan, X. J., Liu, Y., and Diao, C., "Finite element modeling on electromigration of solder joints in wafer level packages," Microelectronics Reliability, vol. 50 no. 4, pp. 547-555, Apr. 2010.

Dang, B., Wright, S. L., Andry, P. S., Tsang, C. K., Patel, C., Polastre, R., Horton, R., Sakuma, K., Webb, B. C., Sprogis, E., Zhang, G., Sharma, A., and Knickerbocker, J. U., "Assembly, Characterization, and Reworkability of Pb-free Ultra-Fine Pitch C4s for System-on-Package," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 42-48.

Dang, Bing, Shih, Da-Yuan, Buchwalter, Stephen, Tsang, Cornelia, Patel, Chirag, Knickerbocker, John, Gruber, Peter, Knickerbocker, Sarah, Garant, John, Semkow, Krystyna, Ruhmer, Klaus, and Hughlett, Emmett, "50um Pitch Pb-Free Micro-bumps by C4NP Technology," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1505-1510.

Daniel, Helene, Leturmy, Marc, Lazure, Sylvie, Vukelic, Thomas, and Muller, Daniel, "Impact of Inerting on Wetting and Solderability," Circuits Assembly , vol. 16 no. 6, pp. 40, June 2005.

Daniel, Helene, Leturmy, Marc, Lazure, Sylvie, and Vukelic, Thomas, "Lead Free Reflow Soldering: Impact of Inerting on Wetting and Contamination," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Daniel, Stavros E., and Pappis, Costas P., "Application of LCIA and comparison of different EOL scenarios: The case of used lead-acid batteries," Resources, Conservation, and Recycling , vol. 52 no. 6, pp. 883-895, Apr. 2008.

Daniel, Stavros E., Pappis, Costas P., and Voutsinas, Theodore G., "Applying life cycle inventory to reverse supply chains: a case study of lead recovery from batteries," Resources, Conservation, and Recycling, vol. 37 no. 4, pp. 251-281, Mar. 2003.

Daniels, Ron, "18 and Counting," Circuitnet, Feb. 26, 2005.

Daniels, Ron, "437, 436, 435...," Circuitnet, Apr. 19, 2005.

Daniels, Ron, "A Word About Lead-Free," Circuitnet, Mar. 2, 2004.

Daniels, Ron, "Ain't Nothing Like It! - Wrapping your hands around the lead-free process...," Circuitnet, June 2, 2004.

Daniels, Ron, "Another word on Lead-Free," Circuitnet, Mar. 16, 2004.

Daniels, Ron, "E-Waste Management," Circuitnet, Nov. 25, 2003.

Daniels, Ron, "Get with it!," Circuitnet, May 13, 2003.

Daniels, Ron, "Kirkendall Voids, Cracks, Mortality...," Circuitnet, Sept. 21, 2004.

Daniels, Ron, "Lead-Free in Europe," Circuitnet, Dec. 7, 2004. 2005.

Daniels, Ron, "Lead Free - The Other 90 Percent," Circuitnet, Mar. 11, 2003.

Daniels, Ron, "Making an Informed Decision: Alloy Selection, Opus 1," Circuitnet , Apr. 27, 2004.

Daniels, Ron, "Preparation is Key," Circuitnet, Mar. 14, 2005.

Daniels, Ron, "Snap, Crackle, Pop Not the Kellogg characters... your components," Circuitnet, Sept. 17, 2002.

Daniels, Ron, "Still Ticking...," Circuitnet, Oct. 28, 2003.

Daniels, Ron, "The Vicious (Decision) Circle," Circuitnet, Sept. 3, 2002.

Daniels, Ron, "Tick... Tick... Tick...," Circuitnet, Mar. 4, 2003.

Daniels, Ron, "Will this be a problem in my lead-free application?," Circuitnet , Nov. 2, 2004. 2005.

Danielsson, Hans, "Lead-Free Soldering Causes Reliability Risks for Systems with Harsh Environments," Advancing Microelectronics, vol. 29 no. 3, pp. xx-xx, May/June 2002.

Danielsson, Hans, "Packaging Technologies for Automotive Electronics in the Lead-Free Era," Proceedings 2002 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4931), Denver, CO, Sept. 4-6, 2002, pp. 518-523.

Dao, Khac An, Nguyen, Tien Dai, Phan, Anh Tuan, and Do, Hung Manh, "On the formation of voids, etched holes, and GaO particles configuration during the nanowires growth by VLS method on GaAs substrate," Journal of Materials Science: Materials in Electronics, vol. 24 no. 7, pp. 2513-2520, July 2013.

Dao, Khac An, Dao, D. Khang, Nguyen, T. Dai, Phan, A. Tuan, and Do, Hung Manh, "The effects of Au surface diffusion to formation of Au droplets/clusters and nanowire growth on GaAs substrate using VLS method," Journal of Materials Science: Materials in Electronics, vol. 23 no. 11, pp. 2065-2074, Nov. 2012.

Daojun, Luo, Guanghui, He, and Weidong, Zhu, "A Reliability Qualification of Lead Free Solder Joints with Different Alloy/ PCB Combination," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Daojun, Luo, Yabin, Zou, and Guanghui, He, "Investigation on Pad Crater Failure of BGA Solder Joints," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 75-79.

Daoud, H. M., Reichelt, S., and Loidolt, A., "Preform-based diffusion soldering for use under conventional soldering process parameters," 2017 21st European Microelectronics and Packaging Conference & Exhibition, Warsaw, Poland, Sept. 10-13, 2017, pp. xx-xx.

Daquan, Yu, Lilei, Duan, Jie, Zhao, and Lai, Wang, "The Formation And Growth Of Intermetallic Compounds Between Sn-3.5Ag Lead-Free Solder And Cu Substrate," Fifth International Conference on Electronic Packaging Technology Proceedings, Shanghai, China, Oct. 28-30, 2003, pp. 327-329.

Darbandi, P., Bieler, T. R., Pourboghrat, F., and Lee, Tae-kyu, "Crystal Plasticity Finite-Element Analysis of Deformation Behavior in Multiple-Grained Lead-Free Solder Joints." Journal of Electronic Materials, vol. 42 no. 2, pp. 201-214, Feb. 2013.

Darbandi, Payam, Lee, Tae-kyu, Bieler, Thomas R., and Pourboghrat, Farhang, "Crystal plasticity finite element study of deformation behavior in commonly observed microstructures in lead free solder joints," Computational Materials Science, vol. 85, pp. 236-243, Apr. 1, 2014.

Darbandi, Payam, Bieler, Thomas R., Pourboghrat, Farhang, and Lee, Tae-Kyu, "The Effect of Cooling Rate on Grain Orientation and Misorientation Microstructure of SAC105 Solder Joints Before and After Impact Drop Tests," Journal of Electronic Materials, vol. 43 no. 7, pp. 2521-2529, July 2014.

Darby, Lauren, and Obara, Louise, "Household recycling behaviour and attitudes towards the disposal of small electrical and electronic equipment," Resources, Conservation and Recycling, vol. 44 no. 1, pp. 17-35, Apr. 2005.

Dargis, Raymond G., "Co-Deposited Alloys of Zinc-Iron and Zinc Nickel vs. Cadmium Characteristics and Corrosion Resistance Comparisons," Proceedings of The International Technical Conference of AESF SUR/FIN, Anaheim, CA, June 21-24, 1993, pp. 1093-1108.

Dariavach, N., Callahan, P., Liang, J., and Fournelle, R., "Intermetallic Growth Kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu Lead-Free Solders on Cu, Ni, and Fe-42Ni Substrates," Journal of Electronic Materials, vol. 35 no. 7, pp. 1581-1592, July 2006.

Darveaux, Robert, Reichman, Corey, Enayet, Sabira, Hsu, Wen-Sung, and Swe, Win Thandar, "Board Level Reliability Comparison of Lead Free Alloys," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 35-47.

Darveaux, Robert, and Banerji, Kingshuk, "Constitutive Relations for Tin-Based-Solder Joints," 1992 Proceedings 42nd Electronic Components & Technology Conference, San Diego, CA, May 18-20, 1992, pp. 538-551.

Darveaux, Robert, Enayet, Sabira, Reichman, Corey, Berry, Christopher J., and Zafar, Nabeel, "Crack Initiation and Growth in WLCSP Solder Joints," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 940-953.

Darveaux, Robert, Reichman, Corey, Berry, C. J., Hsu, Wen-Sung, Syed, Ahmer, Kim, Chang Woo, Ri, Jung Hun, and Kim, Tae Seong, "Effect of Joint Size and Pad Metallization on Solder Mechanical Properties," 2008 Proceedings 58th Electronic Components & Technology Conference , Lake Buena Vista, FL, May 27-30, 2008, pp. 113-122.

Darveaux, Robert, Hoang, Jimmy-Ding V,, and Vijayakumar, Bhuvaneshwaran, "Electromigration Performance of WLCSP Solder Joints," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 27-35.

Darveaux, Robert, Reichman, Corey, and Islam, Nokibul, "Interface Failure in Lead Free Solder Joints," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 906-917.

Darveaux, Robert, and Reichman, Corey, "Mechanical Properties of Lead-Free Solders," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 695-706.

Darveaux, Robert, "Mechanical Testing of Solder Joint Arrays versus Bulk Solder Specimens," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 897-907.

Darveaux, Robert, "Mechanical Testing of Solder Joint Arrays versus Bulk Solder Specimens," SMTAnews & Journal of Surface Mount Technology, vol. 20 no. 1, pp. 11-21, Jan.-Mar. 2007.

Darveaux, Robert, and Turlik, Iwona, "Shear Deformation of Indium Solder Joints," Intersociety Conference on Thermal Phenomena in Electronic Systems, Las Vegas, NV, May 23-25, 1990, pp. 40-52.

Darveaux, Robert, "Shear Deformation of Lead Free Solder Joints," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 882-893.

Darveaux, Robert, and Reichman, Corey, "Solder Alloy Creep Constants for Use in Thermal Stress Analysis," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 584-593.

Darveaux, Robert, and Reichman, Corey, "Solder Alloy Creep Constants for Use in Thermal Stress Analysis," SMTAnews & Journal of Surface Mount Technology, vol. 26 no. 2, pp. 11-20, Apr.-June 2013.

Darveaux, Robert, Reichman, Corey, and Agrawal, Parul, "Solidification Behavior of Lead Free and Tin Lead Solder Bumps," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1442-1447.

Darveaux, Robert, "Thermal Cycle Fatigue Life Models for WLCSP Solder Joints," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 144-155.

Das, A., Vidyadhar, A., and Mehrotra, S. P., "A novel flowsheet for the recovery of metal values from waste printed circuit boards," Resources, Conservation and Recycling, vol. 53 no. 8, pp. 464-469, June 2009.

Das, Kaustuv, Samanta, Sudeshna, Kumar, Prashant, Narayan, K. S., and Raychaudhuri, Arup Kumar, "Fabrication of Single Si Nanowire Metal-Semiconductor-Metal Device for Photodetection," IEEE Transactions on Electron Devices, vol. 61 no. 5, pp. 1444-1450, May 2014.

Das, Rabindra N., Lauffer, John M., and Egitto, Frank D., "Electrical Conductivity and Reliability of Nano-and Micro-Filled Conducting Adhesives for Z-Axis Interconnections," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 112-118.

Das, Rabindra N., Egitto, Frank D., Lauffer, John M., Poliks, Mark D., and Markovich, Voya R., "Influence Of Carbon, Metal-Coated Polymer, and Nano Powders On Sintering and Electrical Performance of Nano-Micro-Filled Conducting Adhesives For Z-Axis Interconnections," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 180-187.

Das, Rabindra N., Papathomas, Konstantinos I., Lauffer, John M., and Egitto, Frank D., "Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 74-81.

Das, Rabindra N., Lauffer, John, Egitto, Frank D., and Markovich, Voya, "Nano- and Micro-Filled Conducting Adhesives for Z-axis Interconnection," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S27:02.

Das, Rabindra N., Egitto, Frank D., and Markovich, Voya R., "Nano- and micro-filled conducting adhesives for z-axis interconnections: new direction for high-speed, high-density, organic microelectronics packaging," Circuit World, vol. 34 no. 1, pp. 3-12, 2008.

Das, Rabindra N., Lauffer, John M., Knadle, Kevin, Vincent, Michael, Poliks, Mark D., and Markovich, Voya R., "Nano and Micro Materials in a Pb-Free World," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1228-1233.

Das, Rabindra N., Lauffer, John M., Poliks, Mark D., Egitto, Frank D., and Markovich, Voya R., "Nano-Micro Filled Conductive Adhesive Based 3D Micro Arrays for Z-Axis Interconnections," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1970-1977.

Das, Rabindra N., Lin, How, Lauffer, John M., Rowlands, Michael, Card, Norman, and Markovich, Voya R., "Printable Nanocomposites for Electronic Packaging," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S34:03.

Das, S. K., Sharif, A., Chan, Y. C., Wong, N. B., and Yung, W. K. C., "Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn-9Zn binary eutectic solder alloy," Journal of Alloys and Compounds, vol. 481 no. 1-2, pp. 167-172, July 29, 2009.

Das, Sazol Kumar, and Sharif, Ahmed, "A Study of Ag Micro-particle Reinforced Sn-Zn Matrix Composite Solder," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Das, Sourav, Bradley, Paul, and Haldar, Arunansu, "Medium carbon fully pearlitic steel: microstructures and properties after wire drawing," Materials Science and Technology, vol. 35 no. 5, pp. 585-595, Mar. 2019.

Dasgupta, Arnab, Huang, Benlih, and Lee, Ning-Cheng, "Effect of Lead-Free Alloys on Voiding at Microvias," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S29-1-1-S29-1-8.

Dasgupta, Arnab, Huang, Benlih, and Lee, Ning-Cheng, "Effect of Lead-Free Solder Composition on Voiding at Microvia," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 841-846.

Dasgupta, Arnab, Zhou, Fengying, LaBarbera, Christine, Liu, Weiping, Bachorik, Paul, and Lee, Ning-Cheng, "Reliability of PCB Solder Joints Assembled with SACM(TM) Solder Paste," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 732-738.

Dasgupta, Neil P., Sun, Jianwei, Liu, Chong, Brittman, Sarah, Andrews, Sean C., Lim, Jongwoo, Gao, Hanwei, Yan, Ruoxue, and Yang, Peidong, "25th Anniversary Article: Semiconductor Nanowires - Synthesis, Characterization, and Applications," Advanced Materials, vol. 26 no. 14, pp. 2137-2184, Apr. 9, 2014.

da Silveira, Alessandro F., de Castro, Walman B., Luciano, Benedito A., and Kiminami, Claudio S., "Microstructure of under-cooled Sn-Bi and Al-Si alloys," Materials Science and Engineering: A, Structural Materials, vol. 375-377, pp. 473-478, July 2004. https://doi.org/10.1016/j.msea.2003.10.017

Date, H., Hozumi, Y., Tokuhira, H., Usui, M., Horikoshi, E., and Sato, T., "Anisotropic Conductive Adhesive for Fine Pitch Connections," Proceedings of the 1994 International Symposium on Microelectronics, Boston, MA, Nov. 15-17, 1994, pp. 570-575.

Date, M., Tu, K. N., Shoji, T., Fujiyoshi, M., and Sato, K., "Interfacial reactions and impact reliability of Sn-Zn solder joints on Cu or electroless Au/Ni(P) bond-pads," Journal of Materials Research, vol. 19 no. 10, pp. 2887-2896, Oct. 2004.

Datian, Cui, Zhifa, Wang, Huabo, Wu, and Jinwen, Liu, "Preparation and Property of Novel-Type Au-19.25Ag-12.80Ge Solder Alloy," Rare Metal Materials and Engineering, vol. 37 no. 4, pp. 690-693, Apr. 2008.

Datta, Aditi, Duan, Zhiyao, and Wang, Guofeng, "Influence of surface segregation on the elastic property of Pt-Ni alloy nanowires," Computational Materials Science, vol. 55, pp. 81-84, Apr. 2012.

Datta, Madhav, "Electrochemical processing technologies in chip fabrication: challenges and opportunities," Electrochimica Acta, vol. 48 no. 20-22, pp. 2975-2985, 2003.

Datta, Samali, Keller, Kristen, Schulz, Douglas L., and Webster, Dean C., "Conductive Adhesives From Low-VOC Silver Inks for Advanced Microelectronics Applications," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 1, pp. 69-75, Jan. 2011.

Dauksher, Walter, and Lau, John, "A Finite-Element-Based Solder-Joint Fatigue-Life Prediction Methodology for Sn-Ag-Cu Ball-Grid-Array Packages," IEEE Transactions on Device and Materials Reliability, vol. 9 no. 2, pp. 231-236, June 2009.

Dauksher, Walter, "A Second-Level SAC Solder-Joint Fatigue-Life Prediction Methodology," IEEE Transactions on Device and Materials Reliability, vol. 8 no. 1, pp. 168-173, Mar. 2008.

David, Thomas, Roussel, Luc, Neisius, Thomas, Cabie, Martiane, Gailhanou, Marc, and Alfonso, Claude, "Gold coverage and faceting of MBE grown silicon nanowires," Journal of Crystal Growth, vol. 383, pp. 151-157, Nov. 15, 2013.

Davies, Jason, "Maximizing PbFree Reflow Performance," RoHS Compliance & LEADOUT Seminar, Dublin, Ireland, Sept. 22, 2005.

Davies, Matt, Chute, Susan, Sanders, John R., Soma, Jay, and Fouts, Christine, "A Comparison of Lead Free Solder Assembly Defluxing Processes," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S08-03-1-S08-03-6.

Davignon, John J., and Reed, Randy, "Effects of NEMI Alloy Assembly Reflow on PTHs," Printed Circuit Fabrication, vol. 23 no. 9, pp. 28-30,32,34,36,38, Sept. 2000.

Davignon, John J., and Reed, Randy, "Effects of NEMI Sn/Ag/Cu Alloy Assembly Reflow on Plated Through Hole Performance," 2000 Lead-Free Symposium Conference Proceedings , Boston, MA, June 13-14, 2000, pp.xx-xx.

Davignon, John J., and Reed, Randy, "Effects of NEMI Sn/Ag/Cu Alloy Assembly Reflow on Plated Through Hole Performance," Journal of SMT, vol. 13 no. 4, pp. 23-30, Oct. 2000.

Davignon, John, Hall, Stephen, Senk, David, and Tisdale, Stephen, "iNEMI HFR-Free Leadership Project Report," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Davignon, John, Chiavone, Ken, Pan, Jiahui, Henzi, James, Mendez, David, and Kulterman, Ron, "PCB Dynamic Coplanarity at Lead-Free SMT Temperatures," 2012 Pan Pacific Microelectronics Symposium, Kauai, HI, Feb. 14-16, 2012, pp. xx-xx.

Davignon, John, Chiavone, Ken, Pan, Jiahui, Henzi, James, Mendez, David, and Kulterman, Ron, "PCB Dynamic Coplanarity at Lead-Free SMT Temperatures," SMTA Journal , vol. 25 no. 2, pp. 20-29, 2012.

Davila, Diana, Tarancon, Albert, Calaza, Carlos, Salleras, Marc, Fernandez-Regulez, Marta, Paulo, Alvaro San, and Fonseca, Luis, "Improved Thermal Behavior of Multiple Linked Arrays of Silicon Nanowires Integrated into Planar Thermoelectric Microgenerators," Journal of Electronic Materials, vol. 42 no. 7, pp. 1918-1925, July 2013.

Davis, G., and Herat, S., "Electronic waste: The local government perspective in Queensland, Australia," Resources, Conservation, and Recycling, vol. 52 no. 8-9, pp. 1031-1039, July 2008.

Davis, J. A., Bozack, M. J., and Evans, J. L., "Effect of (Au, Ni)Sn4 Evolution on Sn-37Pb/ENIG Solder Joint Reliability Under Isothermal and Temperature-Cycled Conditions," IEEE Transactions on Components and Packaging Technologies, vol. 30 no. 1, pp. 32-41, Mar. 2007.

Davis, J. H., "Growth of Thallium Whiskers," Journal of Applied Physics, vol. 39, pp. 5811, 1968.

Davis, J. H., Lal, R. B., Walter, H. U., and Castle Jr., J. G., "Investigation of Crystal Growth in Zero Gravity Environment and Investigation of Metallic Whiskers," NASA Contractor Report , Dec. 1, 1972.

Davis, Jack H., "Investigation of the Effect of Gravity on the Growth of Crystal Whiskers, Interim report No. 1 Part A," NASA, June 1970.

Davis, Jessica, "New RoHS Exemptions Proposals More Narrow Than Ever," Electronic News, Jan. 11, 2006.

Davis, Jessica, "Proactive Approach to RoHS Rewards Companies," Electronic News , July 13, 2006.

Davis, Jessica, "RoHS and WEEE: Determining the Risk," Electronic News, Nov. 10, 2005.

Davis, Jessica, "RoHS: Coming to a State Near You," Electronic News, Feb. 8, 2006.

Davis, Jessica, "Small Businesses Lagging in RoHS Efforts," Electronic News, Jan. 26, 2006.

Davis, Jessica, "U.K. Issues Final RoHS Guidelines," Electronic News, Dec. 22, 2005.

Davis, Jessica, "UK's RoHS Directive 'business-friendly'," Electronics Weekly , Dec. 23, 2005.

Davis, Paul E., Warwick, Malcolm E., and Muckett, Stephen J., "Intermetallic Compound Growth and Solderability Of Reflowed Tin and Tin-Lead Coatings," Plating and Surface Finishing, vol. 70 no. 8, pp. 49-53, Aug. 1983.

Davis, Paul E., "Tin and Tin Alloy Coatings: Yesterday, Today and Tomorrow," Plating and Surface Finishing, vol. 72 no. 12, pp. 26-29, Dec. 1985.

Davis, Peter, "Plastics - the growing burden of regulation," Plastics Engineering EUROPE, vol. 1 no. 1, pp. 16-18, May 2003.

Davis, Willie, Pu, P. K., Kang, Wang Yong, Chen, Alex, Tan, Daniel, and Lee, Wai Mun, "Lead-Free PTH Rework Process Challenges And Solutions For A Complex Server PCBA," SMTA Journal, vol. 23 no. 3, pp. 24-30, 2010.

Davisson, Mike, "A Transition Strategy for High-Reliability Applications to Pb-Free Technology," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 770-776.

Davitt, Elaine, Stam, Frank A., and Barrett, John, "The Effect of Power Cycling on the Reliability of Lead-Free Surface Mount Assemblies," IEEE Transactions on Components and Packaging Technologies , vol. 24 no. 2, pp. 241-249, June 2001.

Davoodi, J., Fallahi, M. T., and Rafii-Tabar, H., "Nano-Scale Modelling of the Mechanical Properties of Pb-Free Solder Alloys," Journal of Computational and Theoretical Nanoscience, vol. 5 no. 3, pp. 359-365, Mar. 2008.

Davy, Gordon, "Can Method 1018 Test Results Indicate Corrosion Risk?," Tin Whisker Group teleconference, Nov. 17, 2010.

Davy, Gordon, "Extrusion and Wire Drawing," Oct. 8, 2009.

Davy, Gordon, "Interfacial Layer Growth Kinetics," Tin Whisker Group teleconference, Feb. 18, 2009.

Davy, Gordon, "Irresistible Force Meets Immovable Object - A Lead Free Essay," PCB007, May 1, 2006.

Davy, Gordon, "OEMs' Pb-free and Tin Whisker Options - Prevention vs. "Mitigation"," Tin Whisker Group teleconference, Aug. 18, 2010.

Davy, Gordon, "Relay Failure Caused by Tin Whiskers," Northrop Grumman Electronic Systems, Oct. 2002.

Davy, Gordon, "Tin-Whisker-Impenetrable Metal Cap Process for Electronic Assemblies: An Analysis of Cap TW Penetrability and Prevention vs. Mitigation," Tin Whisker Group teleconferences, Oct. 19, 2011, Nov. 2, 2011, Nov. 9, 2011, Nov. 16, 2011, Dec. 7, 2011, Dec. 21, 2011, and Jan. 25, 2012.

Davydenko, A. V., Pustovalov, E. V., Ognev, A. V., and Chebotkevich, L. A., "Magnetization Reversal in the Single Epitaxial Co(111) Nanowires With Step-Induced Anisotropy," IEEE Transactions on Magnetics, vol. 48 no. 11, pp. 3128-3131, Nov. 2012.

Davydov, Albert, "Semiconductor Nanowires: Opportunities & Challenges," NIST Workshop on WWW.

Dawson, Eric, "Metallurgy and Soldering," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, May 29, 2007.

Dawson, Raymond B., and Landry, Susan D., "Brominated Flame Retardants: Issues Surrounding Their Use in Electrical and Electronic Equipment," 2003 IEEE International Symposium on Electronics and the Environment, Boston, MA, May 19-22, 2003, pp. 1-6.

Dawson, Raymond B., and Landry, Susan D., "Electrical & Electronic Equipment: Flame Retardant Regulatory Issues," Proceedings of the 2007 IEEE International Symposium on Electronics & the Environment, Orlando, FL, May 7-10, 2007, pp. 73-78.

Dawson, Raymond B., Landry, Susan D., Ranken, Paul F., and Yamada, Hiroaki, "Electrical and Electronic Equipment: End-of-Life, Safety, and Regulatory Issues For Plastics Containing Brominated Flame Retardants," Proceedings of EcoDesign2003: Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 8-11, 2003, pp. 792-798.

Dawson, Raymond B., and Landry, Susan D., "End-of-Life and Regulatory Issues for Flame Retardant Plastics Used in Electrical and Electronic Equipment Applications," 2004 IEEE International Symposium on Electronics & the Environment Conference Record , Scottsdale, AZ, May 10-13, 2004, pp. 46-50.

Dawson, Raymond B., and Landry, Susan D., "Environmental Issues Associated With Flame Retarded Electrical and Electronic Equipment," 47th International SAMPE Symposium and Exhibition, Book 2 , Long Beach, CA, May 12-16, 2002, pp. 989-1000.

Dawson, Raymond B., and Landry, Susan D., "Fire Safety, Regulatory, and End-Of-Life Issues Associated With Flame Retardant Electrical and Electronic Equipment," 34th International SAMPE Technical Conference, Baltimore, MD, Nov. 4-7, 2002. pp. 1130-1141.

Dawson, Raymond B., and Landry, Susan D., "Preparation The Sustainable Use of Flame Retardants in the Electronics Industry," 2008 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 19-21, 2008, pp. xx-xx.

Dawson, Raymond B., and Landry, Susan D., "Recyclability of Flame Retardant HIPS, PC/ABS, and PPO/HIPS used in Electrical and Electronic Equipment," Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, New Orleans, LA, May 16-19, 2005, pp. 77-82.

Dawson, Raymond B., and Landry, Susan D., "Regulatory Developments & Issues for Flame Retardants Used in Electrical & Electronic Equipment," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 363.

Day, Andrew J., Whyle, Adrian S. C., and van Ooij, Wim J., "Complete Chrome-Free Pretreatment Process for Aluminum," 1999 Aerospace/Airline Plating & Metal Finishing Forum, Jacksonville, FL, Apr. 20-22, 1999, pp. 11-17.

Daya, Andrew, and Ramkumar, S. Manian, "Effect of Mixed Alloy BGA Re-Balling on Board Level Drop Test Reliability," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 859-865.

Daya, Andrew, and Ramkumar, S. Manian, "Effect of Thermal Shock on Lead Free Alloy Combinations in Package on Package Assemblies," Conference Proceedings of SMTA International , Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 79-84.

Daya, Andrew, and Ramkumar, S. Manian, "Influence of Alloy Combination and PCB Location on Package on Package (PoP) Component Assembly Drop Test," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 88-93.

Dayeh, Shadi A., Mack, Nathan H., Huang, Jian Yu, and Picraux, S. T., "Advanced core/multishell germanium/silicon nanowire heterostructures: The Au-diffusion bottleneck," Applied Physics Letters, vol. 99 no. 2, pp. 023102-1-023102-3, July 11, 2011.

Dayeh, Shadi A., Chen, Renjie, Ro, Yun Goo, and Sim, Joonseop, "Progress in doping semiconductor nanowires during growth," Materials Science in Semiconductor Processing, vol. 62, pp. 135-155, May 2017.

Deane, P. A., Erich, J. S., and Marinis, T. F., "The Mechanical Strength of Reflowed Solder Connections," Proceedings of the 1987 International Symposium on Microelectronics, Minneapolis, MN, Sept. 28-30, 1987, pp. 457-471.

DeAntoni, John, "Industry Forum: Replacing Chromium," Paint & Powder, June 14, 2004.

de Araujo, Mishene Christie Pinheiro Bezerra, Chaves, Arthur Pinto, Espinosa, Denise Crocce Romano, and Tenorio, Jorge Alberto Soares, "Electronic scraps - Recovering of valuable materials from parallel wire cables," Waste Management, vol. 28 no. 11, pp. 2177-2182, Nov. 2008.

Dearnaley, Geoff, and Badger, Philip, "A Nonchromate Method for Refurbishment of Worn Metallic Components," Advances in Coatings Technologies for Corrosion and Wear Resistant Coatings , Las Vegas, NV, Feb. 12-16, 1995, pp. 311-315.

Deaves, Matthew, "Lead-Free Moves in Lead Boots," IEE Review, vol. 49 no. 7, pp. 16, July 2003.

Deaves, Matthew, "Taking the Lead," Manufacturing Engineer, vol. 83 no. 2, pp. 12-13, Apr./May 2004.

Deaves, Matthew, "Taking the WEEE," Manufacturing Engineer, vol. 82 no. 6, pp. 38-41, Dec. 2003/Jan. 2004.

Debeasi, Ryan, "Get up to scratch on metal whiskers," Network World, vol. 24 no. 34, pp. 24, Sept. 3, 2007.

DeBeasi, Ryan, "How to keep metal whiskers from wrecking your data center," Network World, Aug. 27, 2007.

DeBeasi, Ryan, "How worried should you be about metal whiskers?," Network World , Aug. 27, 2007.

DeBeasi, Ryan, "Metal whiskers photo gallery," Network World, Aug. 27, 2007.

DeBiase, Joseph, "No More HASL," Circuits Assembly, vol. 4 no. 10, pp. 48,50-53, Oct. 1993.

DeBiase, Joseph D., "Organic Solderability Preservatives: Benzotriazoles and Substituted Benzimidazoles," Surface Mount International Proceedings of the Technical Program, Volume II, San Jose, CA, Sept. 10-12, 1996, pp. 763-776.

DeBlis, J., "Implementing solid solder deposits (SSDs) in PCB manufacture," Circuit World, vol. 28 no. 1, pp. 10-13, 2001.

DeBlis, Joanne, "Implementing Solid Solder Deposits in a Manufacturing Environment," 2000 SMTA International Conference Proceedings, Chicago, IL, Sept. 24-28, 2000, pp. xx-xx.

De Blois, R. W., "Ferromagnetic Nucleation Sources on Iron Whiskers," Journal of Applied Physics, vol. 32 no. 8, pp. 1561-1563, Aug. 1961.

DeBlois, R. W., and Graham Jr., C. D., "Domain Observations on Iron Whiskers," Journal of Applied Physics , vol. 29 no. 6, pp. 931-939, June 1958.

DeBlois, R. W., and Bean, C. P., "Nucleation of Ferromagnetic Domains in Iron Whiskers," Journal of Applied Physics, vol. 30 no. 4, pp. 225S-226S, Apr. 1959.

De Boysere, Jerome, and Beard, Adrian, "Halogen-free laminates: worldwide trends, driving forces and current status," Circuit World, vol. 32 no. 2, pp. 8-11, 2006.

Debski, A., Gasior, W., Moser, Z., and Major, R., "Enthalpy of formation of Au-Sn intermetallic phases. Part II," Journal of Alloys and Compounds, vol. 509 no. 21, pp. 6131-6134, May 26, 2011.

Debski, A., Gasior, W., Moser, Z., and Major, R., "Enthalpy of formation of intermetallic phases from the Au-Sn system," Journal of Alloys and Compounds, vol. 491 no. 1-2, pp. 173-177, Feb. 18, 2010.

DeCollibus, Steve, "Joe Fjelstad Founder and President Verdant Electronics discusses the Occam "Evolution"," Circuitnet, Aug. 6, 2007.

DeCollibus, Steve, "Joe Fjelstad update on solder less technology," Circuitnet, Sept. 23, 2008.

DeCollibus, Steve, "Lead Free Implementation an Insider's View," Circuitnet, Feb. 7, 2008.

de Debiaggi, S. Ramos, Toro, C. Deluque, Cabeza, G. F., and Guillermet, A. Fernandez, "Ab initio comparative study of the Cu-In and Cu-Sn intermetallic phases in Cu-In-Sn alloys," Journal of Alloys and Compounds, vol. 542, pp. 280-292, Nov. 25, 2012.

de Debiaggi, S. Ramos, Cabeza, G. F., Toro, C. Deluque, Monti, A. M., Sommadossi, S., and Guillermet, A. Fernandez, "Ab initio study of the structural, thermodynamic and electronic properties of the Cu10In7 intermetallic phase," Journal of Alloys and Compounds , vol. 509 no. 7, pp. 3238-3245, Feb. 17, 2011.

Dedi, , Hermida, I Dewa Putu, Primadona, Indah, and Chen, Yang-Yuan, "Enhanced Power Factor of Single Crystalline Lead Telluride Nanowire," Materials Science Forum, vol. 901, pp. 50-54, July 2017.

Deeds, Michael, and Sandborn, Peter, "Indium Soldering for a MOEMS Based Safety and Arming Device," 2004 Pan Pacific Symposium Conference Proceedings, Kahuku, Oahu, Hawaii, Feb. 10-12, 2004, pp. xx-xx.

Deep, A., Malik, P., Gupta, B., and Tandon, S. N., "Efficient Trivalent Bath for the Recovery of Chromium," Plating & Surface Finishing, vol. 88 no. 3, pp. 76-77, Mar. 2001.

Deffree, Suzanne, "Apple iPhone contains hazardous substances - Greenpeace," Electronics Weekly, Oct. 17, 2007.

Deffree, Suzanne, "BSEF turns tables on Greenpeace over BFRs in iPhone," Electronics Weekly, Dec. 6, 2007.

Deffree, Suzanne, "California vetoes ROHS-expansion bill," EDN, vol. 53 no. 1, pp. 74, Jan. 10, 2008.

Deffree, Suzanne, "Changes to ROHS coming," EDN, vol. 54 no. 3, pp. 52, Feb. 5, 2009.

Deffree, Suzanne, "China RoHS: Ready or not, it's here," Electronic News, Feb. 27, 2007.

Deffree, Suzanne, "City Council Overrides Mayor's Efforts to Trash New York E-Waste Bill," EDN, vol. 53 no. 15, pp. 62, July 24, 2008.

Deffree, Suzanne, "Consumer Segment Most Aggressive on Lead-Free, NEMI Says," Electronic News, Mar. 2, 2004.

Deffree, Suzanne, "Double the Inventory Is Not Double the Fun," Electronic News , Sept. 22, 2005.

Deffree, Suzanne, "ECHA opens REACH consultation on authorization list," EDN, vol. 54 no. 5, pp. 54, Mar. 5, 2009.

Deffree, Suzanne, "EU ROHS exemption, definition changes to impact restricted substances, design requirements," EDN, vol. 53 no.7, pp. 68, Feb. 7, 2008.

Deffree, Suzanne, "European Union, other organizations propose 15 "substances of very high concern"," EDN, vol. 54 no. 19, pp. 54, Oct. 8, 2009.

Deffree, Suzanne, "Five regulations to watch in 2012," EE Times, no. 1614, pp. S21-S23, Jan. 23, 2012.

Deffree, Suzanne, "Five regulations to watch in 2012," Design News, vol. 67 no. 2, pp. S21-S23, Feb. 2012.

Deffree, Suzanne, "Group turns tables on Greenpeace, questions comments on BFRs in electronics, iPhone," Electronic News, Dec. 5, 2007.

Deffree, Suzanne, "Hands Off the Panic Button," Electronic News, Dec. 23, 2005.

Deffree, Suzanne, "Industry groups fight New York e-waste regulation," EDN, vol. 54 no. 17, pp. 54, Sept. 3, 2009.

Deffree, Suzanne, "Industry not prepared for REACH," EDN, vol. 53 no. 18, pp. 62, Sept. 18. 2008.

Deffree, Suzanne, "IPC Brussels meeting reveals ROHS-revisions concerns," EDN, vol. 53 no. 17, pp. 60, Aug. 21, 2008.

Deffree, Suzanne, "IPC fired up about possible TBBPA ROHS inclusion," EDN, vol. 53 no. 25, pp. 62, Dec. 5, 2008.

Deffree, Suzanne, "Korea ROHS combines EU ROHS, WEEE, ELV," EDN, vol. 52 no. 21, pp. 86, Oct. 11, 2007.

Deffree, Suzanne, "MIIT proposes China ROHS catalog," EDN, vol. 54 no. 21, pp. 56, Nov. 12, 2009.

Deffree, Suzanne, "More possible changes to ROHS," EDN, vol. 55 no. 1, pp. 54, Jan. 7, 2010.

Deffree, Suzanne, "OEMs responding to expanded Greenpeace regulations," Electronic News, Sept. 17, 2008.

Deffree, Suzanne, "Ontario begins WEEE directive compliance," EDN, vol. 53 no. 6, pp. 72, Mar. 6, 2008.

Deffree, Suzanne, "Patchwork of state e-waste laws keeps expanding," EDN, vol. 55 no. 21, pp. 50, Nov. 4, 2010.

Deffree, Suzanne, "Possible changes to Toxic Substances Control Act echo RoHS," EDN , vol. 54 no. 15, pp. 54, Aug. 6, 2009.

Deffree, Suzanne, "Premier Farnell targets unregulated e-waste recycling in developing countries," EDN, vol. 54 no. 1, pp. 58, Jan. 8, 2009.

Deffree, Suzanne, "Reaching for RoHS recast," EDN, vol. 55 no. 22, pp. 16, Nov. 18, 2010.

Deffree, Suzanne, "ROHS: It ain't over," Electronic News, Dec. 18, 2007.

Deffree, Suzanne, "RoHS rumbles on as US pushes legislation," Electronics Weekly , Dec. 22, 2006.

Deffree, Suzanne, "SEMI Warns of China RoHS," Electronic News, Nov. 10, 2006.

Deffree, Suzzane, "Supply chain braces for China RoHS in 2007," Electronics Weekly , Dec. 20, 2006.

Deffree, Suzanne, "Supply chain challenges and opportunities abound in Asia-Pacific," Electronic News, May 22, 2007.

Deffree, Suzanne, "Supply Chain Outlook 2007: Bracing for China RoHS," Electronic News , Dec. 20, 2006.

Deffree, Suzanne, "The Cost of Compliance," Electronic News, Aug. 23, 2005.

Deffree, Suzanne, "The Heat Is On," Electronic News, July 28, 2005.

Deffree, Suzanne, "The Mess WEEE Made," Electronic News, Aug. 10, 2005.

Deffree, Suzanne, "The New Black is Green," Electronic News, Nov. 9, 2005.

Deffree, Suzanne, "United Nations turns up heat on mercury," EDN, vol. 54 no. 7, pp. 66, Apr. 9, 2009.

Deffree, Suzanne, "Warning as China's RoHS differs from EU," Electronics Weekly , Nov. 13, 2006.

Degani, Y., and Dudderar, T. D., "AT&T Lead-Free Solder Paste for the Cost Effective Manufacture of Flip-Chip Silicon-On-Silicon MCMs," Sixteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, La Jolla, CA, Sept. 12-14, 1994, pp. 20-24.

Degens, P. N., "Zinn-Bleilegierungen," Zeitschrift fur Anorganische Chemie, vol. 63 no. 3, pp. 207-224, 1909.

Deguchi, Yasushi, Matsuda, Sumio, Aoki, Jiro, Tamura, Takashi, Iwai, Yasunobu, and Kikui, Shigeki, "Failure Analysis of a Transistor Lead," Proceedings of the 26th International Symposium for Testing and Failure Analysis, Bellevue, WA, Nov. 12-16, 2000, pp. 443-448.

De Guzman, Nathaniel, Mechilina, Aurelia, and Balela, Mary Donnabelle, "Electroless Deposition of Silver Nanoparticles and Nanowires in Ethylene Glycol," Advanced Materials Research, vol. 1043, pp. 109-113, Oct. 2014.

De Guzman, Nathaniel, and Balela, Mary Donnabelle L., "Electroless Deposition of Silver Nanowires Using Waste Ethylene Glycol for Highly Transparent Flexible Conducting Electrodes," Key Engineering Materials, vol. 775, pp. 254-259, Aug. 2018.

de Hass, W. J., Sizoo, G. J., and Voogd, J., "Research about the question whether grey tin becomes supraconductive or not," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 31 no. 3. pp. 350-352, 1928.

Dehoyos, Ramon, "Why EU Not Busting for RoHS Violations Yet," Nov. 15, 2006.

Deighan III, R. A., "Surface Tension of Solder Alloys," Proceedings of the 1982 International Microelectronics Symposium, Reno, NV, Nov. 15-17, 1982, pp. 307-313.

de Jesus, M. C., Weiss, R. A, and Hahn, S. F., "Synthesis of Conductive Nanocomposites by Selective In Situ Polymerization of Pyrrole within the Lamellar Microdomains of a Block Copolymer," Macromolecules, vol. 31 no. 7, pp. 2230-2235, Apr. 7, 1998.

de Kluizenaar, E. E., "Reliability of Soldered Joints: A Description of the State of the Art: Part 1," Soldering & Surface Mount Technology, vol. 2 no. 1, pp. 27-38, 1990.

de Kluizenaar, E. E., "Reliability of Soldered Joints: A Description of the State of the Art: Part 2," Soldering & Surface Mount Technology, vol. 2 no. 2, pp. 56-66, 1990.

de Kluizenaar, E. E., "Reliability of Soldered Joints: A Description of the State of the Art: Part 3," Soldering & Surface Mount Technology, vol. 2 no. 3, pp. 18-27, 1990.

Delaney, Drew, and White, Jerry, "Flip Chip Assembly Utilizing Anisotropic Conductive Films: A Feasibility Study," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 641-645.

Dele-Afolabi, T. T., Hanim, M. A. Azmah, Norkhairunnisa, M., Yusoff, H. M., and Suraya, M. T., "Growth kinetics of intermetallic layer in lead-free Sn-5Sb solder reinforced with multi-walled carbon nanotubes," Journal of Materials Science: Materials in Electronics, vol. 26 no. 10, pp. 8249-8259, Oct. 2015.

Dele-Afolabi, T. T., Hanim, M. A. Azmah, Norkhairunnisa, M., Yusoff, H. M., and Suraya, M. T., "Investigating the effect of isothermal aging on the morphology and shear strength of Sn-5Sb solder reinforced with carbon nanotubes," Journal of Alloys and Compounds, vol. 649, pp. 368-374, Nov. 15, 2015.

Delhaise, Andre M., Hillman, David, Snugovsky, Polina, Kennedy, Jeff, Wilcoxon, Ross, Adams, David, Meschter, Stephan, Juarez, Joseph, Kammer, Milea, Straznicky, Ivan, and Perovic, Doug D., "Effect of Thermal Treatment on the Microstructure, Properties, and Reliability of Lead-Free Bismuth Containing Solder Alloys," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 576-585.

Delhaise, Andre M., Hillman, David, Snugovsky, Polina, Kennedy, Jeff, Wilcoxon, Ross, Adams, David, Meschter, Stephan, Juarez, Joseph, Kammer, Milea, Straznicky, Ivan, and Perovic, Doug D., "Effect of Thermal Treatment on the Microstructure, Properties, and Reliability of Lead-Free Bismuth Containing Solder Alloys," SMTA Journal, vol. 32 no. 1, pp. 19-29, 2019.

Delhaise, Andre M., Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, and Bagheri, Zohreh, "Evaluation of Tin Whisker Formation in Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage," International Conference for Electronics Enabling Technologies 2018 Proceedings, Markham, Ontario, Canada, June 5-7, 2018, pp. xx-xx.

Delhaise, Andre M., Meschter, Stephan, Bagheri, Zohreh, Snugovsky, Polina, and Kennedy, Jeff, "Evaluation of Tin Whisker Formation on SOT and Discrete Components Assembled with Bismuth-Containing Lead-Free Solder Alloys After Short-Term High Temperature, High Humidity Storage," Proceedings of SMTA International , Rosemont, IL, Sept. 22-26, 2019, pp. 323-343.

Delhaise, Andre, Snugovsky, Leonid, Perovic, Doug, Snugovsky, Polina, and Kosiba, Eva, "Microstructure and Hardness of Bi-Containing Solder Alloys After Solidification and Ageing," International Conference on Soldering & Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.

Delhaise, Andre, Snugovsky, Leonid, Perovic, Doug, Snugovsky, Polina, and Kosiba, Eva, "Microstructure and Hardness of Bi-Containing Solder Alloys after Solidification and Ageing," SMTAnews & Journal of Surface Mount Technology, vol. 27 no. 3, pp. 22-27, July-Sept. 2014.

Delhaise, Andre M., Brillantes, Mikaella, Tan, Ivan, Snugovsky, Polina, Kennedy, Jeff, Hillman, David, Meschter, Stephan, Adams, David, Kammer, Milea, Straznicky, Ivan, and Perovic, Doug D., "Restoration of Microstructure and Mechanical Properties of Lead-Free Bismuth Containing Solder Joints after Accelerated Reliability Testing Using a Thermal Treatment," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Delhaise, Andre M., Chen, Zhangqi, and Perovic, Doug D., "Solid-State Diffusion of Bi in Sn: Effects of Anisotropy, Temperature, and High Diffusivity Pathways," JOM, vol. 71 no. 1, pp. 133-142, Jan. 2019.

Delhaise, Andre M., Chen, Zhangqi, and Perovic, Doug D., "Solid-State Diffusion of Bi in Sn: Effects of b-Sn Grain Orientation," Journal of Electronic Materials, vol. 48 no. 1, pp. 32-43, Jan. 2019.

Delhaise, Andre M., Perovic, Doug, and Snugovsky, Polina, "The Effects of Aging on the Microstructure and Mechanical Properties of Bi-Containing Sn-Rich Alloys," SMTA Journal, vol. 30 no. 2, pp. 21-27, 2017.

Delhaise, Andre, Perovic, Doug, and Snugovsky, Polina, "The Effects of Bi and Aging on the Microstructure and Mechanical Properties of Sn-Rich Alloys," International Conference on Soldering & Reliability 2015 Proceedings, Toronto, Ontario, Canada, May 19-21, 2015, pp. xx-xx.

Delhaise, Andre M., Perovic, Doug, and Snugovsky, Polina, "The Effects of Bi and Aging on the Microstructure and Mechanical Properties of Sn-Rich Alloys - Part 2," International Conference on Soldering & Reliability 2016 Proceedings, Toronto, Ontario, Canada, May 9-11, 2016, pp. xx-xx.

Delhaise, Andre M., Snugovsky, Polina, Kennedy, Jeff, Hillman, David, Matijevic, Ivan, Meschter, Stephan, Adams, David, Kammer, Milea, Romansky, Marianne, Juarez, Joseph, Straznicky, Ivan, Snugovsky, Leonid, Wilcoxon, Ross, and Perovic, Doug D., "Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys," Journal of Electronic Materials, vol. 49 no. 1, pp. 116-127, Jan. 2020.

Delhaise, Andre M., "Thermal Preconditioning and Restoration of Bi-Containing Solder Alloys for High Reliability Applications," 10th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Villepinte, France, May 15-16, 2019, pp. xx-xx.

Delhaise, Andre M., Snugovsky, Polina, Matijevic, Ivan, Kennedy, Jeff, Romansky, Marianne, Hillman, David, Adams, David, Meschter, Stephan, Juarez, Joseph, Kammer, Milea, Straznicky, Ivan, Snugovsky, Leonid, and Perovic, Doug D., "Thermal Preconditioning, Microstructure Restoration and Property Improvement in Bi-Containing Solder Alloys," International Conference on Soldering & Reliability 2017 Proceedings, Toronto, Ontario, Canada, June 6-8, 2017, pp. xx-xx.

Delhaise, Andre M., Snugovsky, Polina, Matijevic, Ivan, Kennedy, Jeff, Romansky, Marianne, Hillman, David, Adams, David, Meschter, Stephan, Juarez, Joseph, Kammer, Milea, Straznicky, Ivan, Snugovsky, Leonid, and Perovic, Doug D., "Thermal Preconditioning, Microstructure Restoration and Property Improvement in Bi-Containing Solder Alloys," SMTA Journal, vol. 31 no. 1, pp. 33-42, 2018.

Delhaise, Andre M., Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, and Bagheri, Zohreh, "Tin Whisker Formation in Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage, Part I: Whisker Inspection Results," SMTA Journal, vol. 32 no. 2, pp. 14-26, 2019.

Dellas, N. S., Schuh, C. J., and Mohney, S. E., "Silicide formation in contacts to Si nanowires," Journal of Materials Science, vol. 47 no. 17, pp. 6189-6205, Sept. 2012.

Dellas, Nicholas S., Abraham, Michael, Minassian, Sharis, Kendrick, Chito, and Mohney, Suzanne E., "Kinetics of reactions of Ni contact pads with Si nanowires," Journal of Materials Research, vol. 26 no. 17, pp. 2282-2285, Sept. 14, 2011.

Delmas, Mathieu, and Vahlas, Constantin, "Microstructure of Metallorganic Chemical Vapor Deposited Aluminum Coatings on Ti6242 Titanium Alloy," Journal of The Electrochemical Society, vol. 154 no. 10, pp. D538-D542, 2007.

Delmonte, N., Giuliani, F., and Cova, P., "Finite element modeling and characterization of lead-free solder joints fatigue life during power cycling of surface mounting power devices," Microelectronics Reliability, vol. 53 no. 9-11 pp. 1611-1616, Sept.-Nov. 2013.

Delsante, S., Novakovic, R., and Borzone, G., "Synthesis, characterization and thermal stability of SnAg and SnAgCu nanoparticles," Journal of Alloys and Compounds, vol. 747, pp. 385-393, May 30, 2018.

Delserro, Gary, "Lead-Free Reliability Issues and Test Methods," Evaluation Engineering, vol. 45 no. 6, pp. 48-50, 52, June 2006.

De Marchi, Michele, Sacchetto, Davide, Zhang, Jian, Frache, Stefano, Gaillardon, Pierre-Emmanuel, Leblebici, Yusuf, and De Micheli, Giovanni, "Top-Down Fabrication of Gate-All-Around Vertically Stacked Silicon Nanowire FETs With Controllable Polarity," IEEE Transactions on Nanotechnology , vol. 13 no. 6, pp. 1029-1038, Nov. 2014.

Demaree, Robert, "Higher Thermal Stability with Bromine-Free Substrates," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Demaree, Robert, "Thermal Stability of Halogen-Free Laminating Materials," CircuiTree , vol. 14 no. 10, pp. xx, Oct. 2001.

Demir, Eyup Can, Torunbalci, M. Mert, Donmez, Inci, Kalay, Y. Eren, and Akin, Tayfun, "Fabrication and Characterization of Gold-Tin Eutectic Bonding for Hermetic Packaging of MEMS Devices," 2014 IEEE 16th Electronics Packaging Technology Conference, Singapore, Dec. 3-5, 2014, pp. 241-245.

Demmin, Jeffrey C., "Reliability Requirements for Portable Electronics," Advanced Packaging, vol. xx no. xx, pp. xx-xx, Oct. 2003.

De Monlevade, Eduardo Franco, and Peng, Weiqun, "Failure Mechanisms and Crack Propagation Paths in Thermally Aged Pb-Free Solder Interconnects," Journal of Electronic Materials, vol. 36 no. 7, pp. 783-797, July 2007.

de Morais, L. Dantas, Chevalliez, S., and Mouleres, S., "Low temperature FIB cross section: Application to indium micro bumps," Microelectronics Reliability, vol. xx no. x, pp. xx-xx, xxxx.

Dempsey, Paul, "Lead-free but not problem free," EDA Tech Forum, vol. 3 no. 3, pp. 6-7, Sept. 2006.

Dempsey, Paul, "Only a WEEE beginning," Electronic Engineering Times, no. 1385, pp. 8-9, Aug 22, 2005.

Dempsey, Paul, "Pb free pcb problems?," CITE>New Electronics, vol. xx no. x, pp. 12, May 23, 2006.

Denda, Sei-ichi, "Lower Temp Lead Free Solder Needed," Advancing Microelectronics , pp. 35, Nov./Dec. 2003.

Deng, Rui, and Dunham, Scott, "Analysis of Surface Roughness Scattering and Its Contribution to Conductivity Degradation in Nanoscale Interconnects," Proceedings of the IEEE 2005 International Interconnect Technology Conference, Burlingame, CA, June 6-8, 2005, pp. 147-149.

Deng, W. J., Lin, K. L., Chiu, Y. T., and Lai, Y. S., "Electromigration-Induced Accelerated Consumption of Cu Pad in Flip Chip Sn2.6Ag Solder Joints," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 114-117.

Deng, X., Chawla, N., Chawla, K. K., and Koopman, M., "Deformation behavior of (Cu, Ag)-Sn intermetallics by nanoindentation," Acta Materialia, vol. 52 no. 14, pp. 4291-4303, Aug. 16, 2004.

Deng, X., Piotrowski, G., Williams, J. J., and Chawla, N., "Influence of Initial Morphology and Thickness of Cu6Sn5 and Cu3Sn Intermetallics on Growth and Evolution During Thermal Aging of Sn-Ag Solder/Cu Joints," Mar. 2003.

Deng, X., Piotrowski, G., Williams, J. J., and Chawla, N., "Influence of Initial Morphology and Thickness of Cu6Sn5 and Cu3Sn Intermetallics on Growth and Evolution during Thermal Aging of Sn-Ag Solder/Cu Joints," Journal of Electronic Materials, vol. 32 no. 12, pp. 1403-1413, Dec. 2003.

Deng, X., Sidhu, R. S., Johnson, P., and Chawla, N., "Influence of Reflow and Thermal Aging on the Shear Strength and Fracture Behavior of Sn-3.5Ag Solder/Cu Joints," Metallurgical and Materials Transactions A, vol. 36 no. 1, pp. 55-64, Jan. 2005.

Deng, Xin, Wang, Yan, Yang, Yi, Zhu, Chuangmin, and Wang, Fuliang, "Preparation of Silicon Nanowires by Metal-assisted Chemical Etching with Ethylene Glycol Additive," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Deng, Yinping, Wang, Ning, Ling, Huiqin, and Li, Ming, "Synthesis of Copper Nanowires on the Substrates in Aqueous Solution," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 148-151.

Deng, Yuliang, Pecht, Michael, and Rogers, Keith, "Analysis of Phosphorus Flame Retardant Induced Leakage Currents in IC Packages Using SQUID Microscopy," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 4, pp. 804-808, Dec. 2006.

Deng, Yuliang, and Pecht, Michael, "Failures in Semiconductor Device Encapsulated with Red Phosphorus Flame Retardant," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Deng, Yuliang, and Pecht, Michael, "The Story Behind the Red Phosphorus Mold Compound Device Failures," 2005 International Symposium on Electronics Materials and Packaging, Tokyo, Japan, Dec. 11-14, 2005, pp. 1-5.

Deng, Yuliang, and Pecht, Michael, "The Story Behind the Red Phosphorus Mold Compound Device Failures," Journal of the Reliability Information Analysis Center, pp. 6-7, 3rd Quarter 2006.

den Hertog, M., Elouneg-Jamroz, M., Bellet-Amalric, E., Bounouar, S., Bougerol, C., Andre, R., Genuist, Y., Poizat, J. P., Kheng, K., and Tatarenko, S., "Insertion of CdSe quantum dots in ZnSe nanowires: MBE growth and microstructure analysis," Journal of Crystal Growth, vol. 323 no. 1, pp. 330-333, May 15, 2011.

Denison, D. R., and Hartsough, L. D., "Copper distribution in sputtered Al/Cu films," Journal of Vacuum Science and Technology, vol. 17 no. 6, pp. 1326-1331, Nov,/Dec. 1980.

Dennehy, Charley, "Crime Scene Investigations: Sea Stories," Circuitnet, Sept. 20, 2005.

Dennehy, Charley, "Lead-free Rework Basics Organization and Management," circuitnet , June 15, 2005.

Dennehy, Charley, "Lead-free: Soldering at the End of the Line," Surface Mount Technology (SMT), vol. 19 no. 5, pp. 62-63, May 2005.

Dennehy, Charles, "TechTips Toolbox," Surface Mount Technology (SMT), vol. 19 no. 10, pp. xx-xx, Oct. 2005.

Denria, Jyotirmoy, Rajmane, Pavan, and Agonafer, Dereje, "Board Level Solder Joint Reliability Assessment Study of Megtron 6 Vs FR-4 Under Power Cycling and Thermal Cycling," 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , San Diego, CA, May 29-June 1, 2018, pp. 1289-1295.

Deodhar, Sarang, Shanmuganathan, Kadhiravan, Fan, Qinguo, Wilkie, Charles A., Costache, Maurius C., Dembsey, Nicholas A., and Patra, Prabir K., "Calcium Carbonate and Ammonium Polyphosphate-Based Flame Retardant Composition for Polypropylene," Journal of Applied Polymer Science , vol. 120 no. 3, pp. 1866-1873, May 5, 2011.

Depiver, Joshua Adeniyi, Mallik. Sabuj, and Amalu, Emeka H., "Comparing and Benchmarking Fatigue Behaviours of Various SAC Solders under Thermo-Mechanical Loading," 2020 IEEE 8th Electronics System-Integration Technology Conference, Tonsberg, Norway, Sept. 15-18, 2020, pp. xx-xx.

Depiver, Joshua A., Mallik, Sabuj, Harmanto, Dani, and Amalu, Emeka H., "Creep Damage of BGA Solder Interconnects Subjected to Thermal Cycling and Isothermal Ageing," 2019 IEEE 21st Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 4-6, 2019, pp. 143-153.

Depiver, Joshua A., Mallik, Sabuj, and Amalu, Emeka H., "Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB)," Journal of Electronic Materials, vol. 50 no. 1, pp. 263-282, Jan. 2021. https://doi-org.ezproxy.uky.edu/10.1007/s11664-020-08525-9

Deplanque, S., Nuchter, W., Wunderle, B., Schacht, R., and Michel, B., "Lifetime Prediction of SnPb and SnAgCu Solder Joints of Chips on Copper Substrate Based on Crack Propagation FE-Analysis," 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Como, Italy, Apr. 24-26, 2006, pp. xx-xx.

Deplanque, S., Nuchter, W., Spraul, M., Wunderle, B., Dudek, R., and Michel, B. , "Relevance of primary creep in thermo-mechanical cycling for life-time prediction in Sn-based solders," Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, Apr. 18-20, 2005, pp. 71-78.

Deppisch, Carl, Fitzgerald, Thomas, Raman, Arun, Hua, Fay, Zhang, Charles, Liu, Pilin, and Miller, Mikel, "The Material Optimization and Reliability Characterization of an Indium-Solder Thermal Interface Material for CPU Packaging," JOM, vol. 58 no. 6, pp. 67-74, June 2006.

DerMarderosian, Aaron, "The Electrochemical Migration of Metals," Proceedings of the 1978 International Microelectronics Symposium, Minneapolis, MN, Sept. 25-27, 1978, pp. 134-141.

Dermody, Geraint, "X-Ray Inspection in a Lead Free Environment," SMART Group Lead-Free Seminar, Shannon, Ireland, May 19, 2005.

Dernevik, Markus, Sihlbom, Rolf, Axelsson, Klas, Lai, Zonghe, Liu, Johan, and Starski, Piotr, "Electrically Conductive Adhesives at Microwave Frequencies," 1998 Proceedings 48th Electronic Components & Technology Conference, Seattle, WA, May 25-28, 1998, pp. 1026-1030.

Dernevik, Markus, Sihlbom, Rolf, Lai, Zonghe, Starski, Piotr, and Liu, Hohan, "High-frequency Measurements and Modelling of Anisotropic Electrically Conductive Adhesive Flip-Chip Joint," Advances in Electronic Packaging 1997, Volume 1, Kohala Coast, Hawaii, June 15-19, 1997, pp. 177-184.

De Rose, Angela, Kraft, Achim, Eitner, Ulrich, and Nowottnick, Mathias, "Solder Joint Analysis on Coated Aluminum for Silicon Solar Cell Interconnection," 2018 41st International Spring Seminar on Electronics Technology, Zlatibor, Serbia, May 16-20, 2018, pp. xx-xx.

Dertli, Elcin, Coskun, Sahin, and Esenturk, Emren Nalbant, "Gold nanowires with high aspect ratio and morphological purity: Synthesis, characterization, and evaluation of parameters," Journal of Materials Research, vol. 28 no. 2, pp. 250-260, Jan. 28, 2013.

Descours, P., Voytovych, R., Garnier, A., Greco, F., and Hodaj, F., "Interfacial Interactions Between WxN Substrates and a Gold-Tin Alloy," Journal of Materials Engineering and Performance, vol. 21 no. 5, pp. 590-594, May 2012.

des Etangs-Levallois, A. Lecavelier, Grivon, A., Baudet, D., Maia, W. C., and Brizoux, M., "Reliability Analysis of Electronic Assemblies using Electrically Conductive Adhesive for High-Reliability and Harsh Environment Applications," 2014 Electronics System-Integration Technology Conference, Helsinki, Finland, Sept. 16-18, 2014, pp. xx-xx.

Deshmukh, Rajan, "GEIA Program Manager's Handbook," empfasis, pp. xx-xx, Mar. 2006.

Deshmukh, Rajan, and Whiteman, Lee, "Salt Atmosphere, Temperature Humidity, Mechanical Shock Environmental Stress Testing Results, and FMA of the JG-PP / JCAA Lead Free Soldering Program," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S25-02-1-S25-02-10.

Deshmukh, Rajan, "Tin Whiskers and the Impending RoHS Conversion to Lead-Free," empfasis, pp. 1-2, July 2005.

Deshpande, Abhishek, Jiang, Qian, and Dasgupta, Abhijit, "A Joint-Scale Test Specimen for Tensile Properties of Solder Alloys," 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29-June 1, 2018, pp. 1309-1313.

Deshpande, Abhishek, Jiang, Qian, and Dasgupta, Abhijit, "Effect of Microscale Heterogeneities and Stress State on the Mechanical Behavior of Solder Joints," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 1024-1028.

Deshpande, Abhishek, Kaeser, Hannah, and Dasgupta, Abhijit, "Effect of Stress State on Fatigue Characterization of SAC305 Solder Joints," 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Hanover, Germany, March 24-27, 2019, pp. xx-xx.

Deshpande, Abhishek, Jiang, Qian, Dasgupta, Abhijit, and Becker, Ulrich, "Fatigue Life of Joint-Scale SAC305 Solder Specimens in Tensile and Shear Mode," 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 28-31, 2019, pp. 1026-1029.

Deshpande, V. T., and Sirdeshmukh, D. B., "Thermal Expansion of Tetragonal Tin," Acta Crystallographica, vol. 14 no. 4, pp. 355-356, Apr. 1961.

Desmarest, S. Godard, "Reliability of Pb-free solders for harsh environment electronic assemblies," Materials Science and Technology, vol. 28 no. 3, pp. 257-273, Mar. 2012.

de Sousa, Isabel, Henderson, Donald W., Patry, Luc, and Martel, Robert, "Implementation of Increased Cu Levels (1%) in SAC Alloys for PBGA Applications," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 435-443.

de Sousa, Isabel, McCormick, Heather, Lu, Hua, Martel, Robert, and Ouimet, Sylvain, "Module Camber Effect on Card Assembly and Reliability for Large Flip Chip BGA Organic Packages," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 397-405.

de Sousa, Isabel, Gorrell, Robin, Henderson, Donald W., and Patry, Luc, "The Influence of Copper Plating on the Thermal Evolution of Lead Free Solder Joints," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

de Sousa, Isabel, Henderson, Donald W., Patry, Luc, Kang, Sung K, and Shih, D.-Y., "The Influence of Low Level Doping on the Thermal Evolution of SAC Alloy Solder Joints with Cu Pad Structures," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1454-1461.

Destefani, Jim, "Awesome Alloy," Products Finishing, vol. 71 no. 4, pp. xx-xx, Jan. 2007.

Detert, M., and Herzog, Th., "ICA's for Automotive Applications in Higher Temperature Ranges," 1999 Proceedings 49th Electronic Components & Technology Conference, San Diego, CA, June 1-4, 1999, pp. 338-341.

Detert, M., Herzog, Th., Wolter, K.-J., and Zerna, Th., "Screen Printing, Placement and Joining Technologies with Lead-Free Joining Materials," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 125-128.

Detert, M., Herzog, Th., Wolter, K.-J., and Zerna, Th., "SMT GOES GREEN: Investigations on and Optimization of Lead-free Solder Pastes using Wetting Tests, Solder Balling Tests and Screen Printing Tests with Simulated Process Breaks," CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. 65-70.

Detert, Markus, Herzog, Thomas, Wolter, Klaus-Jurgen, and Zerna, Thomas, "SMT GOES GREEN: Investigations on an Optimization of Lead-Free Solder Pastes using Wetting Tests, Solder Balling Tests, and Screen Printing Tests with Simulated Process Breaks," 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, Vienna, Austria, May 19-20, 2005, pp. 167-172.

Dettmer, Roger, "Cutting out waste: recycling end-of-life electronic equipment," IEE Review, vol. 40 no. 3, pp. 127-130, May 1994.

Detz, H., Klang, P., Andrews, A. M., Lugstein, A., Steinmair, M., Hyun, Y. J., Bertagnolli, E., Schrenk, W., and Strasser, G., "Growth of one-dimensional III-V structures on Si nanowires and pre-treated planar Si surfaces," Journal of Crystal Growth, vol. 311 no. 7, pp. 1859-1862, Mar. 15, 2009.

Deubzer, O., Griese, H., and Suga, T., "Lead-free Soldering - Future Aspects of Toxicity, Energy and Resource Consumption," Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 11-15, 2001, pp. 952-957.

Deubzer, O., Hamano, H., Suga, T., and Griese, H., "Lead-Free Soldering - Toxicity, Energy and Resource Consumption," IEEE International Symposium on Electronics and the Environment, Denver, CA, May 7-9, 2001, pp. 290-295.

Deubzer, Otmar, Meysel, Frederik, and Munoz, Jesus Reyes, "Modelling the Solder and Resource Consumption in Lead-Free Soldering," Proceedings of EcoDesign2003: Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 8-11, 2003, pp. 714-720.

Deubzer, Otmar, Nissen, Nils F., and Lang, Klaus-Dieter, "Overview of RoHS 2.0 and Status of Exemptions," Electronics Goes Green 2012+, Berlin, Germany, Sept. 9-12, 2012, pp. xx-xx.

Deubzer, Otmar, Griese, Hansjorg, Andrae, Anders S. G., Zangl, Stephanie, and Reichl, H., "Status and Impacts of RoHS-like Regulations - The Role of Material Bans in Sustainable Development," Proceedings of EcoDesign 2007, Tokyo, Japan, Dec. 10-13, 2007, pp. xx-xx.

Deubzer, Otmar, Baron, Yifaat, Nissen, Nils, and Lang, Klaus-Dieter, "Status of the RoHS Directive and Exemptions," 2016 Electronics Goes Green 2016+, Berlin, Germany, Sept. 6-9, 2016, pp. xx-xx.

Deubzer, Otmar, Meysel, Frederik, Reichl, Herbert, and Griese, Hansjorg, "The Substitution of Lead in Solders - Better Alignment of Material Selection, Resource Situation and Industrial Infrastructure," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies , Frankfurt, Germany, Oct. 20-22, 2004.

Devlin, Mark, "Technically Revisited: Elminiating Tin Whiskers," Finishing World , pp. 23,26, Feb. 2013.

DeVore, John A., "Practical Quantitative Solderability Testing," Proceedings of the IEEE 1989 National Aerospace and Electronics Conference, Volume 4, Dayton, OH, May 22-26, 1989, pp. 2027-2034.

de Vries, Hans, van Delft, Jan, and Slob, Kees, "SMT-Compatibility of Adhesive Flip Chip on Foil Interconnections With 40-um Pitch," IEEE Transactions on Components and Packaging Technologies , vol. 28 no. 3, pp. 499-505, Sept. 2005.

De Vries, J., van Delft, J., and Slob, C., "100 um Pitch flip chip on foil assemblies with adhesive interconnections," Microelectronics Reliability, vol. 45 no. 3-4, pp. 527-534, Mar./Apr. 2005.

de Vries, J. (Hans), "Failure Mechanism of Anisotropic Conductive Adhesive Interconnections in Flip Chip ICs on Flexible Substrates," IEEE Transactions on Components and Packaging Technologies, vol. 27 no. 1, pp. 161-166, Mar. 2004.

de Vries, J. (Hans), and Janssen, Esther, "Humidity and Reflow Resistance of Flip Chip on Foil Assemblies with Conductive Adhesive Joints," IEEE Transactions on Components and Packaging Technologies, vol. 26 no. 3, pp. 563-568, Sept. 2003.

de Vries, J. W. C., Jansen, M. Y., and van Driel, W. D., "On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections," Microelectronics Reliability, vol. 47 no. 2-3, pp. 444-449, Feb.-Mar. 2007.

de Vries, J., Jansen, M., and van Driel, W., "Solder-joint reliability of HVQFN-packages subjected to thermal cycling," Microelectronics Reliability, vol. 49 no. 3, pp. 331-339, Mar. 2009.

Dewald, W., Borschel, C., Stichtenoth, D., Niermann, T., and Ronning, C., "Phase diagram of Si nanowire growth by disproportionation of SiO," Journal of Crystal Growth, vol. 312 no. 10, pp. 1751-1754, 1 May 2010.

Dey, Sujit Kumar, Ari, Vidyadhar, and Das, Avimanyu, "Processing of electronic waste in a counter current teeter-bed separator," Journal of Environmental Management, vol. 107, pp. 45-51, Sept. 30, 2012.

Dhanasekaran, Rangaraj, Gadepalli, Harish, and Ramkumar, S. Manian, "Analysis of the Influence of Reflow Profile Parameters on Package on Package (PoP) Component Assembly," SMTA International 2010 Conference (Presentations), Orlando, FL, Oct. 24-28, 2010.

Dhanasekaran, Rangaraj, Gadepalli. Harish, Ramkumar, S. Manian, Jensen, Tim, and Briggs, Ed, "Characterizing and Minimizing Voids in Quad Flat No-Lead Pack (QFN) Device Assembly using Pb-Free Solder Alloys," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 39-47.

Dhandarphale, Sameer, Chauhan, Tushar, Chowdhury, A. S. M. Raufur, and Agonafer, Dereje, "Impact of Single-Phase Immersion Cooling on Coefficient of Thermal Expansion of PCBs and Impact of Change in Themo-mechanical Properties on Reliability of Second Level Solder Joint of BGA Package," SMTA International 2020 , virtual conference, Sept. 28-Oct. 23, 2020, pp. 408-412.

Dharma, I Gusti Bagus Budi, Shukor, Mohd Hamdi Abd, and Ariga, Tadashi, "Wettability of Low Silver Content Lead-Free Solder Alloy," Materials Transactions, vol. 50 no. 5, pp. 1135-1138, 2009.

Dhawan, Punit Kumar, Upadhyay, Sanjay, Verma, S. K., Wan, Meher, Yadav, R. R., and Joshi, B., "Size and temperature dependent ultrasonic properties of thermoelectric nanowires," Materials Letters, vol. 114, pp. 15-18, Jan. 1, 2014.

Dheeraj, D. L., Munshi, A. M., Christoffersen, O. M., Kim, D. C., Signorello, G., Riel, H., van Helvoort, A. T. J., Weman, H., and Fimland, B. O., "Comparison of Be-doped GaAs nanowires grown by Au- and Ga-assisted molecular beam epitaxy," Journal of Crystal Growth, vol. 378, pp. 532-536, Sept. 1, 2013.

Dhillon, Shweta, Goswami, Neha, and Kant, Rama, "Theory for local EIS at rough electrode under diffusion controlled charge transfer: Onset of whiskers and dendrites," Journal of Electroanalytical Chemistry, vol. 840, pp. 193-207, May 1, 2019. https://doi.org/10.1016/j.jelechem.2019.03.019

Dhiman, Harpreet S., Fan, Xuejun, and Zhou, Tiao, "JEDEC Board Drop Test Simulation for Wafer Level Packages (WLPs)," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 556-564.

Diamond, Alan, "RoHS and WEEE Compliance Are Changing the Way We Work," Printed Circuit Design and Manufacture, vol. 23 no. 3, pp. 22, 26, 28, Mar. 2006.

Dias, Marcelino, Costa, Thiago A., Silva, Bismarck L., Spinelli, Jose E., Cheung, Noe, and Garcia, Amauri, "A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys," Microelectronics Reliability, vol. 81, pp. 150-158, Feb. 2018.

Dias, Marcelino, Costa, Thiago A., Soares, Thiago, Silva, Bismarck L., Cheung, Noe, Spinelli, Jose E., and Garcia, Amauri, "Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys," Journal of Electronic Materials, vol. 47 no. 2, pp. 1647-1657, Feb. 2018.

Dias Lopes, E. M., Pinto, Margarida, Assuncao, Eurico, and Coutinho, Luisa, "Trends and Challenges in Lead Free Soldering," 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Lisbon, Portugal, Apr. 16-18, 2012, pp. xx-xx.

Diaz, Alfredo J., Ma, David, Zinn, Alfred, and Quintero, Pedro O., "Tin Nanoparticle-Based Solder Paste for Low Temperature Processing," Journal of Microelectronics and Electronic Packaging, vol. 10 no. 4, pp. 129-137, Oct. 2013.

Dibiase, Tony, "Product environmental regulatory compliance: the current status worldwide," Interference Technology EMC Directory & Design Guide 2007 , pp. 76-79,84, 2007.

DiBugnara, Ray, "Mitigating tin whisker risks," Green SupplyLine, Feb. 28, 2006.

Dick, Kimberly A., Deppert, Knut, Samuelson, Lars, and Seifert, Werner, "InAs nanowires grown by MOVPE," Journal of Crystal Growth, vol. 298, pp. 631-634, Jan. 2007.

Dick, Kimberly A., Deppert, Knut, Samuelson, Lars, and Seifert, Werner, "Optimization of Au-assisted InAs nanowires grown by MOVPE," Journal of Crystal Growth, vol. 297 no. 2, pp. 326-333, Dec. 29, 2006.

Dieckhoff, S., van Eys-Schafer, H., Kaune, M., Kowalik, T., Kubel, Ch., Seiler, A., Beneke, M., Fangmeier, A., and Kock, E., "Characterisation of Chromate-Free Surface Protection Systems for Aircraft Application," Corrosion Reviews, vol. 25 no. 5-6, pp. 523-531, 2007.

Diehl, R. P, and Cifaldi, N. A., "Eliminate Whisker Growth on Contacts by Using a Tin Alloy Plate," Insulation/Circuits, vol. 22 no. 4, pp. 37-39, Apr. 1976.

Diehl, Robert P., "Significant Characteristics of Tin and Tin-Lead Contact Electrodeposits for Electronic Connectors," Metal Finishing, vol. 91 no. 4, pp. 37-42, Apr. 1993.

Diehm, Rolf, Nowottnick, Mathias, and Pape, Uwe, "A New Approach to Void-Free Reflow Soldering," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 911-917.

Dienes, G. J., "On the Volume Diffusion of Metals," Journal of Applied Physics, vol. 22 no. 6, pp. 848-849, June 1951.

Diepstraten, Gerjan, "5 Steps to success in lead-free soldering," Electronic Production , vol. 31 no. 5, pp. 8-11, Aug. 2002.

Diepstraten, Gerjan, "5 Steps to success in lead-free soldering," Electronic Production , vol. 31 no. 6, pp. 9-12, Sept. 2002.

Diepstraten, Gerjan, "5 Steps to success in lead-free soldering," Electronic Production , vol. 31 no. 7, pp. 7-11, Oct. 2002.

Diepstraten, Gerjan, "A Stirring Solution," Circuits Assembly, vol. 16 no. 8, pp. 38, Aug. 2005.

Diepstraten, Gerjan, "Analyzing Lead-Free Soldering Defects in Wave Soldering Using Taguchi Methods," APEX 2000, Long Beach, CA, Mar. 14-16, 2000, pp. P-SM4/1-1-P-SM4/1-5.

Diepstraten, Gerjan, "Analysing lead-free soldering defects in wave soldering using Taguchi methods," Dataweek, vol. xx no. xx, pp. xx-xx, Feb. 23, 2005.

Diepstraten, Gerjan, "Analyzing Lead-free Wavesoldering Defects," Surface Mount Technology (SMT), vol. 14 no. 10, pp. 48-52, Oct. 2000.

Diepstraten, Gerjan, "Dull-Finish Joints After Lead-free Wave Soldering: Not a Defect," Circuitnet, July 10, 2005.

Diepstraten, Gerjan, "Introducing the '5 steps to successful lead-free soldering'," Dataweek, vol. xx no. xx, pp. xx-xx, Apr. 7, 2004.

Diepstraten, Gerjan, "Low Melting Solder Affects Selective Soldering Settings and Materials," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 559-565.

Diepstraten, Gerjan, "Matte-finish Solder Joints after Lead-free Wave Soldering," Surface Mount Technology (SMT), vol. 20 no. 3, pp. xx-xx, Mar. 2006.

Diepstraten, Gerjan, "Mixing Alloys on a Single Line," Circuits Assembly, vol. 18 no. 1, pp. 54, Jan. 2007.

Diepstraten, Gerjan, "Pb-Free Defects and Mitigation," Circuits Assembly, vol. 17 no. 2, pp. xx-xx, Feb. 2006.

Diepstraten, Gerjan, "Reflow Soldering with a SnCu Eutectic Pb-Free Alloy," Circuits Assembly, vol. 19 no. 9, pp. 34,37,50, Sept. 2008.

Diepstraten, Gerjan, "Selective Solder Defects and How to Prevent Them," Vitronics Soltec BV.

Diepstraten, Gerjan, "Should Pallets Still be Used in Wave Soldering?," Circuits Assembly , vol. 17 no. 6, pp. 40-41, June 2006.

Diepstraten, Gerjan, "The Range and Causes of Lead Free Soldering Defects," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies , San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Diepstraten, Gerjan, "The Role of Eutectics in Solder Joint Appearance," Circuits Assembly, vol. 17 no. 11, pp. 42, Nov. 2006.

Diepstraten, Gerjan, Trip, Harry, van Tiggelen-Aarden, Ineke, and Wu, Di, "The Silver Debate: Sn/Cu-based Solder Explained," Surface Mount Technology (SMT), vol. 22 no. 11, pp. 8,10-12, Nov. 2008.

Diepstraten, Gerjan, "Wave Soldering 0603s," Circuits Assembly, vol. 18 no. 7, pp. 54, July 2007.

Diepstraten, Gerjan, "Why Dull or Frosty Pb-Free Solder Joints Are Not Defective," Circuits Assembly, vol. 17 no. 1, pp. 60, Jan. 2006.

Dietrich, Jay M., "Business Approaches to Environmental Policies," Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, New Orleans, LA, May 16-19, 2005, pp. 60-65.

Dietsche, Carsten, Mehlich, Frank P., and Herrmann, Ilona, "Substances of Very High Concern (SVHCs): Chemical Breakdown and Dismantling Data for E-Waste," 2016 Electronics Goes Green 2016+, Berlin, Germany, Sept. 6-9, 2016, pp. xx-xx.

Dietz, Karl, "Tech Talk: Fine Lines in High Yield (Part LXVIII): Imaging for Selective Nickel/Gold Plating," CircuiTree, vol. 14 no. 5, pp. xx, May 2001.

Dietz, R., and Peck, D., "An Innovation in Thermoplastic, Reworkable Adhesive Pastes," Microelectronics International, vol. 13 no. 1, pp. xx-xx, 1996.

Di Giacomo, Guilio, Granato, Karen L., Shaukatullah, Hussain, Casullo, Frank, and Guarnieri, Richard, "Oxidation Kinetics of Bi-Sn Eutectic Films and Thermal Contact Resistance," Proceedings of the 1987 International Symposium on Microelectronics , Minneapolis, MN, Sept. 28-30, 1987, pp. 587-593.

Dills, Jim, and Harris, Rebecca, "A Product Environmental Compliance Case Study - Establishing a RoHS Disclosure Audit Trail for an Electronics Manufacturing Services Company," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 59-67.

Dills, Jim, "China RoHS Phase 2: Hard Data Reveals a Red Flag," emsnow, Feb. 15, 2007.

Dills, Jim, and Stone, Harvey, "Environmentally Conscious Technologies: Does Green Equal Competitive Advantage?," Surface Mount Technology (SMT), vol. 21 no. 6, pp. 14-16, 18-19, June 2007.

Dills, Jim, and Rowland, Robert, "Lead-free: China RoHS Requirements," Surface Mount Technology (SMT) , vol. 21 no. 1, pp. 30, 33-35, Jan. 2007.

Dills, Jim, "Process Control - Eco Lifecycle Assessment and Improvement," SMT Web Exclusive Article.

Dills, Jim, "REACH Exposed: Stressing Environmental Compliance," Surface Mount Technology (SMT), vol. 22 no. 5, pp. 24-25, May 2008.

Di Maio, D., Hunt, C. P., and Willis, B., "Good Practice Guide to Reduce Copper Dissolution in Lead-Free Assembly," Measurement Good Practice Guide No. 110, December 2008.

Di Maio, D., Hunt, C. P., and Willis, B., "Good Practice Guide to Reduce Copper Dissolution in Lead-Free Assembly," Global SMT and Packaging, vol. 15 no. 3, pp. 8-13. Mar. 2015.

Di Maio, D., and Hunt, C., "High-Frequency Vibration Tests of Sn-Pb and Lead-Free Solder Joints," NPL Report MAT 2, Aug. 2007.

Di Maio, D., and Hunt, C. P., "High-Frequency Vibration Tests of Sn-Pb and Lead-Free Solder Joints," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 819-823.

Di Maio, D., and Hunt, C., "Investigation Methods of the b to a Tin Allotropic Transformation," NPL Report MAT 21, July 2008.

Di Maio, D., Willis, B., and Hunt, C., "Measurements of Copper Dissolution in Lead-Free Solder Alloys," NPL Report MAT 26, Nov. 2008.

Di Maio, D., and Hunt, C., "Measuring the effect of the allotropic transformation in tin and lead free solder alloys and their implications for industry," NPL Report MAT 35, Oct. 2009.

Di Maio, D., and Hunt, C. P., "Monitoring the Growth of the a Phase in Tin Alloys by Electrical Resistance Measurements," Journal of Electronic Materials, vol. 38 no. 9, pp. 1874-1880, Sept. 2009.

Di Maio, D., Thomas, O., Dusek, M., and Hunt, C., "Novel Testing Instrument for Lead-Free Solder Characterization," IEEE Transactions on Instrumentation and Measurement, vol. 60 no. 10, pp. 3444-3450, Oct. 2011.

Di Maio, D., and Hunt, C., "On the absence of the b to a Sn allotropic transformation in solder joints made from paste and metal powder," Microelectronic Engineering, vol. 88 no. 1, pp. 117-120, Jan. 2011. https://doi.org/10.1016/j.mee.2010.09.011

Di Maio, D., and Hunt, C. P., "On the factors affecting the dissolution of copper in molten lead-free solders and development of a method to assess the soldering parameters," Soldering & Surface Mount Technology, vol. 21 no. 4, pp. 24-31, 2009.

Di Maio, Davide, "Pad Cratering," Printed Circuit Design and Fab/ Circuits Assembly , vol 28 no. 4, pp. 55, Apr. 2011.

Di Maio, D., Hunt, C. P., and Willis, B., "Reducing copper dissolution in lead-free assembly," Global SMT and Packaging, vol. 9 no. 11, pp. 14-17, Nov. 2009.

Di Maio, D., Murdoch, C., Thomas, O., and Hunt, C., "The Degradation of Solder Joints under High Current Density and Low-Cycle Fatigue," 2010 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, Bordeaux, France, Apr. 26-28, 2010, pp. xx-xx.

Di Maio, D., and Hunt, C., "Time-lapse photography of the b-Sn/a-Sn allotropic transformation," Journal of Materials Science: Materials in Electronics, vol. 20 no. 4, pp. 386-391, Apr. 2009.

Di Maio, Davide, "Broken Lines," Circuits Assembly, vol. 20 no. 5, pp. 26, May 2009.

Di Maio, Davide, "Copper Dissolution in Lead-free Alloys," Microelectronics News , no. 24, pp. 2, Winter 2007.

Di Maio, Davide, "Defect Detection Goes Online," Circuits Assembly, vol. 19 no. 11, pp. 43, Nov. 2008.

Di Maio, Davide, "Defects Database," Microelectronics News, no. 24, pp. 2, Winter 2007.

Di Maio, Davide, "High Frequency Testing of Joints," Microelectronics News, no. 24, pp. 6, Winter 2007.

Di Maio, Davide, "Keep 'Em Together," Printed Circuit Design and Fab, vol. 26 no. 2, pp. 21, Feb. 2009.

Di Maio, Davide, "Optical Inspection of Black Pad," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 2, pp. 51, Feb. 2010.

Di Maio, Davide, "Secondary Helpings," Circuits Assembly, vol. 20 no. 4, pp. 41, Apr. 2009.

Di Maio, Davide, "White Residue Rings," Circuits Assembly, vol. 19 no. 12, pp. 39, Dec. 2008.

DiMase, Dan, "ERAI and a Risk Mitigation Strategy to Address Today's Complex Global Marketplace," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. FF-05.

DiMatteo, Rob, "Step 7: Soldering", Surface Mount Technology (SMT), vol. 18 no. 8, pp. 46-48, Aug. 2004.

DiMatteo, Rob, and Dimock, Fred, "STEP 7: Soldering," Surface Mount Technology (SMT), vol. 21 no. 8, pp. 18, 20, Oct. 2007.

Dimcic, Biljana, Labie, Riet, Zhang, Wenqi, De Wolf, Ingrid, and Verlinden, Bert, "Influence of the Processing Method on the Amount and Development of Voids in Miniaturized Interconnections," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Dimitrakakis, Emmanouil, Janz, Alexander, Bilitewski, Bernd, and Gidarakos, Evangelos, "Determination of heavy metals and halogens in plastics from electric and electronic waste," Waste Management, vol. 29 no. 10, pp. 2700-2706, Oct. 2009.

Dimitrakakis, Emmanouil, Janz, Alexander, Bilitewski, Bernd, and Gidarakos, Evangelos, "Small WEEE: Determining recyclables and hazardous substances in plastics," Journal of Hazardous Materials, vol. 161 no. 2-3, pp. 913-919, Jan. 30, 2009.

Dimitrovska, Aleksandra, and Kovacevic, Radovan, "Environmental Influence on Sn Whisker Growth," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 3, pp. 193-197, July 2010.

Dimitrovska, Aleksandra, and Kovacevic, Radovan, "Mitigation of Sn Whisker Growth by Composite Ni/Sn Plating," Journal of Electronic Materials, vol. 38 no. 12, pp. 2516-2524, Dec. 2009.

Dimitrovska, Aleksandra, and Kovacevic, Radovan, "The Effect of Micro-Alloying of Sn Plating on Mitigation of Sn Whisker Growth," Journal of Electronic Materials, vol. 38 no. 12, pp. 2726-2734, Dec. 2009.

Dimock, Fred, "Effect of High-Temperature Requirements for Lead-Free Solder," Circuits Assembly, vol. 15 no. 7, pp. 20-22, July 2004.

Dimock, Fred, and Mattson, Kristen, "Lead-free Solder Wafer Bumping," Advanced Packaging, vol. 13 no. 9, pp. 36-38, Sept. 2004.

Dimock, Fred, and Mattson, Kristen, "Lead-Free Solder Wafer Bumping," Lead-Free Magazine.

Dimock, Fred, and DiMatteo, Rob, "Obtaining and controlling reflow oven cooling rates," Global SMT and Packaging, vol. 7 no. 8, pp. 16-17, Aug. 2007.

Dimock, Fred, "Oven Adjustment Effects on a Solder Reflow Profile," Circuits Assembly, vol. 20 no. 8, pp. 20-21, Aug. 2009.

Dimock, Fred, and DiMatteo, Rob, "Oven Selection and Lead-Free Solder," Lead-Free Connection, vol. 2 no. 2, pp. 7-8, June 2005.

Dimock, Fred, "Practical Thermal Profile Expectations in a Dual-Lane, Dual-Speed Reflow Oven," Printed Circuit Design and Fab/ Circuits Assembly, vol 28 no. 3, pp. 36,38,40,42, Mar. 2011.

Dindarian, A., Gibson, A. A. P., and Quariguasi-Frota-Neto, J., "Electronic product returns and potential reuse opportunities: a microwave case study in the United Kingdom," Journal of Cleaner Production, vol. 32, pp. 22-31, Sept. 2012.

Dindarian, Azadeh, and Gibson, Andrew A. P., "Reuse of EEE/WEEE in UK: Review on Functionality of EEE/WEEE at the Point of Disposal," 2011 IEEE International Symposium on Sustainable Systems and Technology, Chicago, IL, May 16-18, 2011, pp. xx-xx.

Ding, Chao, Liu, Tian-Han, Lei, Chu-Yi, Qin, Wei, Qin, Hong-Bo, and Hou, Bin, "Study on the volume effect of mechanical behavior of Cu/Sn/Cu microscale solder joints considering crystal anisotropy," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Ding, Guo-Hua, Qi, Xuan, Liu, Shu-Long, Li, Ming, and Hu, Jing, "Effect of liquid structural transition on the dissolution of solid copper in liquid eutectic tin-bismuth," Journal of Materials Research, vol. 31 no. 8, pp. 1145-1152, Apr. 28, 2016.

Ding, Huanyou, Ma, Limin, zuo, yong, and Guo, Fu, "Effects of magnetic field on microstructure and mechanical properties of lead-free solder joint," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 737-740.

Ding, Lan, Tao, Yuan, and Wu, Yiping, "Thermomigration in Sn58Bi Solder Joints at Low Ambient Temperature," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 944-948.

Ding, Mian Zhi, Aw, Jie Li, Lim, Li Shiah, Wai, Leong Ching, and Rao, Vempati Srinivasa, "Direct Eutectic AuSn Solder Bumping on Al Bond Pad Surface Using Laser Solder Ball Jetting," 2013 IEEE 15th Electronics Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp. 224-229.

Ding, Mian Zhi, Wai, Leong Ching, Zhang, Shiyun, and Rao, Vempati Srinivasa, "Evaluation of Laser Solder Ball Jetting for Solder Ball Attachment Process," 2012 IEEE 14th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 5-7, 2012, pp. 23-29.

Ding, Min, Wang, Guotao, Chao, Brook, Ho, Paul S., Su, Peng, Uehling, Trent, and Wontor, David, "A study of electromigration failure in Pb-free solder joints," Proceedings of the International Reliability Physics Symposium, San Jose, CA, Apr. 17-21, 2005, pp. 518-523.

Ding, Min, and Porras, Adriana, "Aging Effects on Dynamic Bend Test Performance of Pb-Free Solder Joints on Ni/Au Finish," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 103-109.

Ding, Min, and Porras, Adriana, "Aging Effects on Dynamic Bend Test Performance of Pb-Free Solder Joints on Ni/Au Finish," Journal of Surface Mount Technology, vol. 19 no. 4, pp. 11-17, Oct.-Dec. 2006.

Ding, Min, Wang, Guotao, Chao, Brook, Ho, Paul S., Su, Peng, and Uehling, Trent, "Effect of contact metallization on electromigration reliability of Pb-free solder joints," Journal of Applied Physics, vol. 99 no. 9, pp. 094906-1-094906-6, May 1, 2006.

Ding, Min, Su, Peng, and Chopin, S., "Effects of Trim and Form on the Microstructure and Whisker Growth Propensity of Sn Finish," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 452-456.

Ding, Qiulin, Ma, Xiaosong, Liu, Zhixue, and Zhang. G. Q., "Fast Analysis and Implementation of Microelectronic Packaging MSL with Equal Moisture Distribution Method," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 356-360.

Ding, Ruifang, Pan, Xuemin, and Wei, Guangling, "Viscosity of Sn-Cu Solders Investigated by Molecular Dynamics," Materials Science Forum, vol. 675-677, pp. 1011-1014, 2011.

Ding, Su, Tian, Yanhong, Jiang, Zhi, and Wang, Chunqing, "Joining of Silver Nanowires by Femtosecond Laser Irradiation Method," Materials Transactions, JIM, vol. 56 no. 7, pp. 981-983, 2015.

Ding, Xiaojun, Wang, Dongliang, Zhang, Lu, Chen, LiHua, and Zhang, Wenji, "Kirkendall Voids Evolution in Sn-Ag-In Solder Bumps and Its Effect on Reliability," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 1151-1154.

Ding, Yaping, Qi, Fangjuan, Xu, Changling, and Dong, Hulin, "The Effect of Reflow Time on Intermetallic Compound in Lead-Free Micro-Joining Joint," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Ding, Ying, Tian, Ruyu, Wang, Xiuli, Hang, Chunjin, Yu, Fang, Zhou, Ling, Meng, Xiangang, and Tian, Yanhong, "Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints," Microelectronics Reliability, vol. 55 no. 11, pp. 2396-2402, Nov. 2015.

Ding, Ying, Wang, Chunqing, Li, Mingyu, and Wang, Weiqiang, "In situ TEM observation of microcrack nucleation and propagation in pure tin solder," Materials Science and Engineering B: Solid-State Materials for Advanced Technology, vol. 127 no. 1, pp. 62-69, Feb. 15, 2006.

Ding, Ying, Wang, Chunqing, Tian, Yanhong, and Li, Mingyu, "Influence of aging treatment on deformation behavior of 96.5Sn3.5Ag lead-free solder alloy during in situ tensile tests," Journal of Alloys and Compounds, vol. 428 no. 1-2, pp. 274-285, Jan. 31, 2007.

Ding, Ying, Wang, Chunqing, and Li, Mingyu, "Scanning Electron Microscope In-Situ Investigation of Fracture Behavior in 95.6Sn3.5Ag Lead-Free Solder," Journal of Electronic Materials, vol. 34 no. 10, pp. 1324-1335, Oct. 2005.

Dingwerth, Bjorn, "Trivalent Passivates Need Trivalent Post-Dips," Metal Finishing, vol. 107 no. 4, pp. 31,33-40, 2009.

Dinh, Toan, Phan, Hoang-Phuong, Kozeki, Takahiro, Qamar, Afzaal, Fujii, Tatsuya, Namazu, Takahiro, Nguyen, Nam.-Trung., and Dao, Dzung Viet, "High thermosensitivity of silicon nanowires induced by amorphization," Materials Letters, vol. 177, pp. 80-84, Aug. 15, 2016.

Dini, J. W., "Electrodeposition - Some Present Activities and Future Prospects," SAMPE Journal, vol. 31 no. 6, pp. 19-23, Nov.-Dec. 1995.

Dini, Jack W., "Chromium: Is It Really Bad for Us?," Plating & Surface Finishing , vol. 90 no. 3, pp. 30-31, Mar. 2003.

Dini, Jack W., "Chromium: Is It Really Bad for Us?," Plating & Surface Finishing , vol. 90 no. 3, pp. 30-31, Mar. 2003.

Dini, Jack W., "Mercury," Plating & Surface Finishing, vol. 94 no. 1, pp. 22-23, Jan. 2007.

Dini, Jack W., "The Precautionary Principle," Plating & Surface Finishing, vol. 89 no. 7, pp. 36-37, July 2002.

Dion, J., Borgesen, P., Yost, B., Lilienfeld, D. A., and Li, C.-Y., "Material and Reliability Considerations for Anisotropically Conductive Adhesive Based Interconnects," Materials Research Society Symposia Proceedings Volume 323, Boston, MA, Nov. 29-Dec. 3, 1993, pp. 27-32.

Diop, Mamadou Diobet, Radji, Moufid, Hamoui, Anas A., Blaquiere, Yves, and Izquierdo, Ricardo, "Evaluation of Anisotropic Conductive Films Based on Vertical Fibers for Post-CMOS Wafer-Level Packaging," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 4, pp. 581-591, Apr. 2013.

DiPaola. Dave, "Robust Process Solutions for MEMS Flip-Chip Applications With Medium Density Lead-Free Solder Interconnects," Chip Scale Review, vol. 17 no. 1, pp. 15-16,18, Jan./Feb. 2013.

Dittes, M., Oberndorff, P., Crema, P., and Su, P., "Tin Whisker Formation - A Stress Relieve Phenomenon," AIP Conference Proceedings, vol. 817, pp. 348-359, 2006. https://doi.org/10.1063/1.2173568

Dittes, M., Obendorff, P., and Petit, L., "Tin Whisker Formation - Results, Test Methods and Countermeasures," 2003 Proceedings 53rd Electronic Components & Technology Conference , New Orleans, LA, May 27-30, 2003, pp. 822-826.

Dittes, M., Oberndorff, P., and Crema, P., "Whisker Root Cause and Respective Test Conditions."

Dittes, Marc, Oberndorff, Pascal, Crema, Paolo, and Chopin, Sheila, "A Two Step Approach for the Release of Lead Free Component Finishes with Respect to Whisker Risk," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Dittes, Marc, and Haubner, Gerhard, "Accelerated Ageing and Solderability Test of Tin Plated Components," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 79-85.

Dittes, Marc, and Walter, Hermann, "Advanced Alloy for Lead-Free Solder Balls." Soldering & Surface Mount Technology, vol. 15 no. 1, pp. xx-xx, 2003.

Dittes, Marc, "Green Packages - Requirements, Materials, Results," Proceedings of 3rd Electronics Packaging Technology Conference, Singapore, Dec. 5-7, 2000, pp. 1-5.

Dittes, Marc, "Lead-free Electroplated Layers as Solderable Finish for Semiconductor Devices."

Dittes, Marc, "Lead-free Post-Mold Plating for Semiconductor Devices," EFIP 03 , track T2-10.

Dittes, Marc, "Leadframe Packages with Matt Pure Tin Electroplated Surface Finish," Infineon Technology Technical Note, May 2003.

Dittes, Marc, Oberndorff, Pascal, Crema, Paolo, and Schroeder, Valeska, "The Effect of Temperature Cycling on Tin Whisker Formation."

Dittes, Marc, Oberndorff, Pascal, Crema, Paolo, and Schroeder, Valeska, "Tin Whisker Formation in Thermal Cycling Conditions," 2003 Electronics Packaging Technology Conference, Dec. 10-12, 2003, pp. 183-188.

Dittmar, Werner, and Kohler, Armin, "Das dickenwachstum von kalium-whisker im gebiet der kritischen ubersattigung," Journal of Crystal Growth, vol. 2 no. 5, pp. 271-278, Oct. 1968.

Ditz, M. J., "Determination of the Moisture Threshold for Silver Migration," Proceedings of the 20th International Symposium on Testing and Failure Analysis, Los Angeles, CA, Nov. 13-18, 1994, pp. 181-187.

Divigalpitiya, Ranjith, and Hogerton, Peter, "Contact Resistance of Anisotropic Conductive Adhesives," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 471-476.

Divigalpitiya, Ranjith, and Hogerton, Peter, "Contact Resistance of Anisotropic Conductive Adhesives," Journal of Microelectronics and Electronic Packaging, vol. 1 no. 3, pp. 194-199, Third Quarter 2004.

Divigalpitiya, Ranjith, "Effect of Insulative Debris on the Contact Resistance of Anisotropic Conductive Film (ACF) Adhesives: A Comparison Between a Solid Conducting Particle and a Coated Insulative Particle," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 1, pp. 222-228, Mar. 2008.

Divigalpitiya, Ranjith, "Electrical Characteristics of Contacts Made With Anisotropic Conductive Adhesives: Current Density Distributions at the Contact," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 1, pp. 216-221, Mar. 2008.

Divigalpitiya, Ranjith, "Operating Temperature of Anisotropic Conducting Film Adhesives," Journal of Adhesion Science and Technology, vol. 22 no. 8-9, pp. 915-926, 2008.

DiVita, Philip, Steele, David, Kanavel, John, and Shea, Chrys, "Can RoHS Conversion Actually Reduce Product Cost?," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 214-218.

Divita, Philip, Steele, David, Kanavel, John, and Shea, Chrys, "Can RoHS CONVERSION Actually Reduce Product Cost? ," Printed Circuit Design and Fab/ Circuits Assembly, vol. 30 no. 1, pp. 36,38-40, Jan. 2013.

Diwe, Parag, Macias, Miguel, LoGiudice, Deneil, and Chu, Quyen, "RoHS/Lead Free Implementation: An EMS Provider's View," IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies , Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.

Dixon, Doug, "Tweak or change?," emsnow, Sept. 28, 2005.

Dixon, Leon, "Lead free - are you compliant, or merely capable?," evertiq, Feb. 27, 2006.

Dixon, Leon, "LEAD free - are you compliant, or merely capable?," Electronics Manufacture and Test, pp. xx-xx, Mar. 2006.

Diyatmika, Wahyu, Chu, J. P., and Yen, Y. W., "Effects of Annealing on Sn Whisker Formation: Role of Cu Alloy Seed Layer," 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 22-25, 2013, pp. 319-322.

Diyatmika, Wahyu, Chu, Jinn P., Yen, Y. W., and Hsueh, C. H., "Sn whisker mitigation by a thin metallic-glass underlayer in Cu-Sn," Applied Physics Letters, vol. 103, pp. 241912-1-241912-4, 2013.

Diyatmika, Wahyu, Chu, J. P., Yen, Y. W., Chang, W. Z., and Hsueh, C. H., "Thin film metallic glass as an underlayer for tin whisker mitigation: A room-temperature evaluation," Thin Solid Films, vol. 561, pp. 93-97, June 30, 2014.

Djokic, Stojan S., "Chemical Oxidation of Aluminum in Chromic Acid Solutions," Plating and Surface Finishing, vol. 92 no. 5, pp. 45-49, May 2005.

Djokic, Stojan, "Electroless Deposition of Silver onto Copper Particles," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. 225-232.

Djurfors, B., and Ivey, D. G., "Microstructural characterization of pulsed electrodeposited Au/Sn alloy thin films," Materials Science and Engineering B: Solid-State Materials for Advanced Technology, vol. 90 no. 3, pp. 309-320, Mar. 29, 2002.

Djurfors, B., and Ivey, D. G., "Pulsed Electrodeposition of the Eutectic Au/Sn Solder for Optoelectronic Packaging," Journal of Electronic Materials, vol. 30 no. 9, pp. 1249-1254, Sept. 2001.

D'Mellow, Bob, Thomas, David J., Joyce, Malcolm J., Kolkowski, Peter, Roberts, Neil J., and Monk, Stephen D., "The replacement of cadmium as a thermal neutron filter," Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, vol. 577 no. 3, pp. 690-695, July 11, 2007.

Doctori-Blass, Vered, and Geyer, Roland, "The Role and Value of Information for Supply Loop Management: Framework and Application for the End-Of-Life Cell Phone Industry," 2008 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 19-21, 2008, pp. xx-xx.

Doerner, M. F., Gardner, D. S., and Nix, W. D., "Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques," Journal of Materials Research, vol. 1 no. 6, pp. 845-851, Dec. 1986.

Doesburg, J., and Ivey, D. G., "Co-deposition of Gold-Tin Alloys From a Non-Cyanide Solution," Plating & Surface Finishing, vol. 88 no. 4, pp. 78-83, Apr 2001.

Doesburg, J, and Ivey, D. G, "Microstructure and preferred orientation of Au-Sn alloy plated deposits," Materials Science and Engineering: B, vol. 78 no. 1, pp. 44-52, Oct. 31, 2000. https://doi.org/10.1016/S0921-5107(00)00515-8

Dogra, Kamaljeet Singh, "A Bismuth Tin Alloy for Hermetic Seals," Proceedings of the Fourth Annual International Electronics Packaging Conference, Baltimore, MD, Oct. 19-31, 1984, pp. 631-636.

Dohle, Rainer, Gorywoda, Marek, Wirth, Andreas, and Gosler, Jorg, "Investigation of electromigration behaviour in lead-free flip-chip solders connections," 2014 Electronics System-Integration Technology Conference , Helsinki, Finland, Sept. 16-18, 2014, pp. xx-xx.

Dohle, Rainer, "Reliability of Ultra Fine-Pitch Flip Chip Assemblies Using Lead-free Alloys," flipchips.com Tutorial 122, Mar. 2013.

Doi, K., Ono, S., Ohtani, H., and Hasebe, M., "Thermodynamic Study of the Phase Equilibria in the Sn-Ti-Zn Ternary System," Journal of Phase Equilibria and Diffusion, vol. 27 no. 1, pp. 63-74, Feb. 2006.

Dolbow, Mike, "Re: [RoHS] Demo units - RoHS compliant?," July 28, 2006.

Doler, Kathleen, "Be lean, mean...and green," Electronic Business, Sept. 1, 2000.

Domblesky, Joseph, Jones, Doug, and Gebaur, Klaus, "Elevated temperature and strain rate constitutive data for process simulation," Wire Journal International, vol. 38 no. 4, pp. 124-127, Apr. 2005.

Domenech-Gil, Guillem, Pardo, Antonio, Romano-Rodriguez, Albert, Hrachowina, Lukas, Seifner, Michael S., Barth, Sven, Gracia, Isabel, and Cane, Carles, "Different nanowire materials localized growth and in-situ integration for electronic nose applications," 2018 Spanish Conference on Electron Devices, Salamanca, Spain, Nov. 14-16, 2018, pp. xx-xx.

Dompierre, B., Aubin, V., Charkaluk, E., Maia Filho, W. C., and Brizoux, M., "Influence of Thermal Ageing on Long Term Reliability of SnAgCu Solder Joints," 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems , Delft, Netherlands, Apr. 26-29, 2009, pp. xx-xx.

Dompierre, B., Filho, W. C. Maia, Brizoux, M., Aubin, V., and Charkaluk, E., "Thermal ageing induces drastic changes on mechanical and damage behavior of Sn3.0Ag0.5Cu alloy," Microelectronics Reliability, vol. 50 no. 9-11, pp. 1661-1665, Sept.-Nov. 2010.

Dompierre, Benoit, Barriere, Ludovic, Francois, Arnaud, and Wyart, Eric, "Surrogate model based mechanical characterization of lead-free soldered joint material exhibiting ratcheting behavior: an advanced methodology," 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Budapest, Hungary, Apr. 19-22, 2015, pp. xx-xx.

Donahoe, Daniel, and Poliskie, Michelle, "The Chemistry of Halogen-Free Electronics," Advancing Microelectronics, vol. 36 no. 4, pp. 22-24, July/Aug. 2009.

Donakowski, W. A., and Morgan, J. R., "Zinc/Graphite - A Potential Substitute for Anti-Galling Cadmium," Plating and Surface Finishing, vol. 70 no. 11, pp. 48-51, Nov. 1983.

Donaldson, Alan, Aspandiar, Raiyo, and Doss, Kantesh, "Comparison Of Copper Erosion at Plated Through-Hole Knees in Motherboards Using SAC305 and an SnCuNiGe Alternative Alloy for Wave Soldering and Mini-Pot Rework," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S33:02.

Donaldson, Alan, "Hand Solder Rework of Lead-Free Through Hole Components & Leaded Surface Mount Packages," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 127-132.

Donaldson, Alan, "Hand Solder Rework of Pb-Free PTH and SMT Packages," Circuits Assembly, vol. 17 no. 1, pp. 56-57, Jan. 2006.

Donaldson, Alan, and Aspandiar, Raiyo, "Hot Air Lead-Free Rework of BGA Packages & Sockets," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 198-206.

Donaldson, Alan, and Aspandiar, Raiyo, "Hot Air Lead-Free Rework of BGA Packages & Sockets," SMTA Journal , vol. 18 no. 1, pp. 19-26, Jan. 2005.

Donaldson, Alan, "The Effect of Critical to Function Parameters of the Lead-Free Mini-pot Through-hole Connector Rework Process on the Final Barrel Copper Thickness," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 320-332.

Donaldson, J. D., Francis, D. P., Snowdon, K. G., and Spiller, D. O., "The life cycle assessment of a telecommunications semiconductor laser," Engineering Science and Education Journal, vol. 5 no. 4, pp. 147-152, Aug. 1996.

Dong, C. Christine, Schwarz, Alexander, and Roth, Dean V., "Effects of Atmosphere Composition on Soldering Performance of Lead-free Alternatives," Proceedings of the Technical Program NEPCON West '97, Volume 1, Anaheim, CA, Feb. 23-27, 1997, pp. 211-221.

Dong, C. Christine, Ross, Brenda F., and Schwarz, Alexander, "N2 Inerting for Reflow of Lead-free Solders," Advanced Packaging , vol. 12 no. 11, pp. 29-31, Nov. 2003.

Dong, Chong, Wu, Shaocheng, Ma, Haoran, Wang, Yunpeng, and Ma, Haitao, "The study of edge effects in Sn-0.5Cu/(001)Cu during soldering cooling stage," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Dong, Gaqiang, Tan, Shihai, Han, Jing, Wang, Yishu, Guo, Fu, and Ma, Limin, "Study on Slip Behavior of Lead-free Solder Joints under Uniaxial Stress," 2017 18th International Conference on Electronic Packaging Technology , Harbin, China, Aug. 16-19, 2017, pp. 1043-1045.

Dong, H. J., Li, Z. L., Song, X. G., Zhao, H. Y., Tian, H., Liu, J. H., and Yan, J. C., "Grain morphology evolution and mechanical strength change of intermetallic joints formed in Ni/Sn/Cu system with variety of transient liquid phase soldering temperatures," Materials Science and Engineering: A, vol. 705, pp. 360-365, Sept. 29, 2017.

Dong, H. Q., Vuorinen, V., Liu, X. W., Laurila, T., Li, J., and Paulasto-Krockel, M., "Microstructural Evolution and Mechanical Properties of Au-20wt.%Sn|Ni Interconnection," Journal of Electronic Materials, vol. xx no. xx, pp. xx-xx, xxxx.

Dong, H. Q., Jin, S., Zhang, L. G., Wang, J. S., Tao, X. M., Liu, H. S., and Jin, Z. P., "Thermodynamic Assessment of the Au-Co-Sn Ternary System," Journal of Electronic Materials, vol. 38 no. 10, pp. 2158-2169, Oct. 2009.

Dong, H. Q., Vuorinen, V., Tao, X. M., Laurila, T., and Paulasto-Krockel, M., "Thermodynamic reassessment of Au-Cu-Sn ternary system," Journal of Alloys and Compounds, vol. 588, pp. 449-460, Mar. 5, 2014.

Dong, H. Q., Vuorinen, V., Laurila, T., and Paulasto-Krockel, M., "Thermodynamic reassessment of Au-Ni-Sn ternary system," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 43, pp. 61-70, Dec. 2013.

Dong, Hai, Fan, Lianhua, Moon, Kyoung-sik, Wong, C. P., and Baskes, M. I., "MEAM molecular dynamics study of lead free solder for electronic packaging applications," Modelling and Simulation in Materials Science and Engineering, vol. 13 no. 8, pp. 1279-1290, 2005.

Dong, Hai, Fan, Lianhua, Moon, Kyoung-sik, Wong, C. P., and Baskes, M. I., "Molecular Dynamics Simulation of Lead Free Solder for Low Temperature Reflow Applications," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 983-987.

Dong, Hai, Zhang, Zhuqing, and Wong, C. P., "Molecular dynamics study of a nano-particle joint for potential lead-free anisotropic conductive adhesives applications," Journal of Adhesion Science and Technology, vol. 19 no. 2, pp. 87-94, 2005.

Dong, Hai, Moon, Kyoung-Sik, and Wong, C. P., "Molecular Dynamics Study of Nanosilver Particles for Low-Temperature Lead-Free Interconnect Applications," Journal of Electronic Materials , vol. 34 no. 1, pp. 40-45, Jan. 2005.

Dong, Hai, Moon, Kyoung-sik, and Wong, C. P., "Molecular Dynamics Study on Coalescence of Silver (Ag) Nanoparticles and Their Deposition on Gold (Au) Substrates," 2004 9th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 24-26, 2004, pp. 152-157.

Dong, Hai, Moon, Kyoung-sik, Jiang, Hongjin, Wong, C. P., and Hua, Fay, "Simulation study of nanoparticle melting behavior for lead free nano solder application," 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 107.

Dong, Hongqun, Vuorinen, Vesa, and Laurila, Tomi, and Paulasto-Krockel, Mervi, "Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnections," Journal of Electronic Materials, vol. 45 no. 10, pp. 5478-5486, Oct. 2016.

Dong, Mingzhi, Wang, Yuming, Cai, Jian, Feng, Tao, and Pu, Yuanyuan, "Effects of Nitrogen on Wettability and Reliability of Lead-free Solder in Reflow Soldering," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 147-151.

Dong, Mingzhi, Wang, Qian, Cai, Jian, Li, Jinrui, and Wang, Shuidi, "Reliability of Lead-free Fine Pitch BGA under Thermal and Mechanical Impact," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 67-70.

Dong, Wenxing, Shi, Yaowu, Lei, Yongping, Xia, Zhidong, and Guo, Fu, "Effects of small amounts of Ni/P/Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy," Journal of Materials Science: Materials in Electronics, vol. 20 no. 10, pp. 1008-1017, Oct. 2009.

Dong, Wenxing, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, and Guo, Fu, "Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy," Journal of Electronic Materials , vol. 37 no. 7, pp. 982-991, July 2008.

Dong, Wenxing, Shi, Yaowu, Lei, Yongping, Xia, Zhidong, and Guo, Fu, "Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints," Journal of Electronic Materials, vol. 38 no. 9, pp. 1906-1912, Sept. 2009.

Dongchu, Chen, Guixiang, Wu, Wenfang, Li, Wenhui, Gong, and Yiqing, Liang, "Preparing an Environment-benignly Rare-earth Based Chemical Conversion Coatings on 6063 Aluminium Alloy," Key Engineering Materials, vol. 373-374, pp. 224-227, 2008.

Donmez, S., and Aksut, A. A., "The Modification Effect of Different Compounds for Protection of Magnesium against Corrosion," Protection of Metals and Physical Chemistry of Surfaces, vol. 47 no. 1, pp. 121-127, Jan. 2011.

Donnan, F. G., "Ernst Julius Cohen. 1869-1944," Obituary Notices of Fellows of the Royal Society, vol. 5 no. 16, pp. 666-687, May, 1948.

Donnelly, Fergal, "Lead-Free Wave Solder Conversion Project 2004/5 Xerox Electronics Business Centre, Dundalk," SMART Group Ireland Lead-Free Wave Soldering Workshop , Dublin, Ireland, Feb. 24, 2005.

Donnelly, Tom, "Design for Reliability Guidelines," Tin Whisker Group teleconference, Feb. 12, 2014.

Doppke, Thomas S., "Fasteners and Finishes," Products Finishing, vol. 63 no. 3, pp. 92-93, Dec. 1998.

Doppke, Thomas S., "Fasteners and Finishes," Products Finishing, vol. xx no. x, pp. xx-xx, Feb. 1999.

Doppke, Thomas S., "Fasteners and Finishes," Products Finishing, vol. xx no. x, pp. xx-xx, July 1999.

Dorais, Mark, "It's Time To Get The Lead Out Of Our Designs," Electronic Design, vol. 48 no. 25, pp. 56, Dec. 4, 2000.

Doraiswarni, Ravi, Sankarawaman, Sandeep, Kim, Woopoung, Li, Jing, Zhang, Zhuqing, Gupta, Piyush, Nakanishi, Kensuke, Borkar, Manish, Madhavan, Raghav, Govind, Vinu, Choi, Suna, Aggarwal, Ankur O., Sun, Y., Fan, Lianhua Fan, Sundaram, Venky, Swaminathan, Madhavan, Wong, C. P., and Tummala, Rao R., "Advances in Fine Pitch Lead Free Assembly Process," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 834-839.

Doraiswami, Ravi, and Tummala, Rao, "Nano-Composite Lead-Free Interconnect and Reliability," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 871-873.

Doraiswami, Ravi, "Nano Nickel-Tin Interconnects and Electrodes for Next Generation 15 Micron Pitch Embedded Bio Fluidic Sensors in FR4 Substrates," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1323-1325.

Doria, Rodrigo Trevisoli, Trevisoli, Renan, de Souza, Michelly, Barraud, Sylvain, Vinet, Maud, Faynot, Olivier, and Pavanello, Marcelo Antonio, "Analysis of the substrate bias effect on the interface trapped charges in junctionless nanowire transistors through low-frequency noise characterization," Microelectronic Engineering, vol. 178, pp. 17-20, June 25, 2017.

Dorrance, R. H., Schoenberg, K. E., and Streif, T. A., "Unique very low temperature plasma-enhanced chemical-vapor deposition glass process for hot and cold wall commercial reactors," Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol. 5 no. 6, pp. 1564-1568, Nov./Dec. 1987.

Doss, Kantesh, Donaldson, Alan, Tong, Andrew, and Aspandiar, Raiyo, "Studies on the Removal of Copper during Minipot Rework with Different Lead-Free Alloys," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 816-824.

Doss, Saad K., "Plating of 60/40 Tin/Lead Solder for Head Termination Metallurgy," Plating & Surface Finishing, vol. 84 no. 1, pp. 38-40, Jan. 1997.

Dosseul, Franck, Le Coq, Cedric, Forster, Stephane, Barreau, Laurent, Serre, Christophe, and Tougui, Abdellah, "WLCSP: Challenges, Performances and Trends: Key Parameters Influencing the Board Level Reliability of WLCSP," SMTA International Wafer-Level Packaging Conference, San Jose, CA, Oct. 13-16, 2008, pp. xx-xx.

Dou, G. B., Chan, Y. C., and Liu, Johan, "Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles," Journal of Electronic Packaging, Transactions of the ASME , vol. 125 no. 4, pp. 609-616, Dec. 2003.

Dou, G. B., Chan, Y. C., Morris, Jame E., and Yeung, N. H., "RLC Effects in Fine Pitch Anisotropic Conductive Film Connections," 2003 Proceedings 53rd Electronic Components & Technology Conference , New Orleans, LA, May 27-30, 2003, pp. 1559-1564.

Dou, G., Chan, Y. C., Morris, J. E., and Whalley, D. C., "RLC effects in fine pitch anisotropic conductive film connections," Soldering & Surface Mount Technology, vol. 18 no. 1, pp. 3-10, 2006.

Dou, Guangbin, Whalley, David C., Liu, Changqing, and Chan, Y. C., "An experimental methodology for the study of co-planarity variation effects in anisotropic conductive adhesive assemblies," Soldering & Surface Mount Technology, vol. 22 no. 1, pp. 47-55, 2010.

Dou, Guangbin, Whalley, David., and Liu, Changqing, "Deformation Property Measurement for Single Anisotropic Conductive Adhesive Particles," 1st Electronics Systemintegration Technology Conference, Volume 2, Dresden, Germany, Sept. 5-7, 2006, pp. 840-847.

Dou, Guangbin, Whalley, David C., and Liu, Changqing, "Electrical Conductive Characteristics of ACA Bonding: A Review of the Literature, Current Challenges and Future Prospects," Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, China, June 30-July 3, 2004, pp. 264-276.

Dou, Guangbin, Whalley, David C., and Liu, Changqing, "Electrical Conduction Characteristics of Solid Metal Anisotropic Conductive Adhesive Particles," 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, Portland, OR, Sept. 12-15, 2004, pp. 132-136.

Dou, Guangbin, Whalley, David, and Liu, Changqing, "Mechanical and Electrical Characterisation of Individual ACA Conductor Particles," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Dou, Guangbin, Whalley, David C., and Liu, Changqing, "The Effect of Co-planarity Variation on Anisotropic Conductive Adhesive Assemblies," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 932-938.

Doudrick, Kyle, Chinn, Jeff, Williams, Jason, Chawla, Nikhilesh, and Rykaczewski, Konrad, "Rapid method for testing efficacy of nano-engineered coatings for mitigating tin whisker growth," Microelectronics Reliability, vol. 55 no. 5, pp. 832-837, Apr. 2015.

Douglas, Bob, "Component Traceability Issues," Surface Mount Technology (SMT) , vol. 21 no. 9, pp. 16-17, Sept. 2007.

Douglas, Stuart T., Al-Bassyiouni, Moustafa, and Dasgupta, Abhijit, "Experiment and Simulation of Board Level Drop Tests With Intentional Board Slap at High Impact Accelerations," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 4 no. 4, pp. 569-580, Apr. 2014.

Douthit, David A., "CRISIS!! COTS parts in service will wear out in three to seven years," Military & Aerospace Electronics, vol. 14 no. 2, pp. 32-33, Feb. 2003.

Dow, Stephen J., "The Future of SMT Soldering," Surface Mount Technology (SMT), vol. 5 no. 1, pp. 54-57, Jan. 1991.

Dowdell, D. C., Adda, S., Noel, R., Laurent, D., Glazebrook, B., Kirkpatrick, N., Richardson, L., Doyle, E., Smith, D., and Thurley, A., "An Integrated Life Cycle Assessment and Cost Analysis of the Implications of Implementing the Proposed Waste from Electrical and Electronic Equipment (WEEE) Directive," Proceedings of the 2000 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-10, 2000, pp. 1-10.

Dowds, Steve, "Assessing Solder Joint Reliability in Pb-Free Assemblies," Circuits Assembly, vol. 15 no. 12, pp. 28-31, Dec. 2004.

Dowds, Steve, "Assessing the reliability of soldered joints in lead-free electronic assemblies," evertiq, Oct. 6, 2005.

Dowds, Steve, "Current Trends in Lead-free Solder," Surface Mount Technology (SMT), vol. 18 no. 1, pp. 50, Jan. 2004.

Dowds, Steve, "Implementing Pb-free Soldering in Production," Indium Corporation of America.

Dowds, Steve, "Legitimate Legislation? From Lead to Halogen," Surface Mount Technology (SMT), vol. 22 no. 10, pp. 15-16,18, Oct. 2008.

Dowds, Steve, "Look after your components!," emsnow, Dec. 1, 2004.

Dowds, Steve, "Pb-free Manufacturing Process Development & Implementation," SMART Group/NPL Lead Free Seminar 2003, Feb. 23, 2003.

Dowds, Steve, "Tackling the Pb-Free Basics," Adhesives & Sealants Industry, vol. 12 no. 4, pp. 49-51, Apr. 2005.

Dowds, Steve, "Tackling the Pb-free basics," evertiq, Mar. 2, 2005.

Dowds, Steve, "The case for exemption," emsnow, Jan. 25, 2005.

Dowds, Steve, "The Impact of REACH," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. xx-xx.

Downs, Jay R., Spear, Downs, Judin, Dallas, and Francis, R. Michael, "The Phenomenon of Zinc Whisker Growth and the Rotary Switch (or, How the Switch Industry Captured the Abominable Snowman)," Metal Finishing , vol. xx no. xx, pp. 23-25, Aug. 1994.

Doyama, M., and Yamamoto, R., "Computer Simulation of the Deformation of Small Crystals," Materials Science Forum, vol. 37, pp. 77-86, 1989.

Dr. RoHS, "Dr RoHS: Alternatives to copper loaded solders," Electronics Weekly , Jan. 30, 2006.

Dr. RoHS, "Dr RoHS answers your questions," Electronics Weekly, June 8, 2006.

Dr. RoHS, "Dr RoHS: Are cable assembly parts exempt?," Electronics Weekly , Mar. 3, 2006.

Dr. RoHS, "Dr RoHS: Are sub-assemblies in scope?," Electronics Weekly, May 22, 2006.

Dr. RoHS, "Dr RoHS: BGA solder balls and tin whiskers," Electronics Weekly , Apr. 19, 2006.

Dr. RoHS, "Dr RoHS: Chromium platings and showing compliance," Electronics Weekly, Mar. 23, 2006.

Dr. RoHS, "Dr RoHS: Exemptions for end-of-life parts," Electronics Weekly , Apr. 5, 2006.

Dr. RoHS, "Dr RoHS: Fixed installations and possible exemptions," Electronics Weekly, Mar. 8, 2006.

Dr. RoHS, "Dr RoHS: High melting point solders are exempt," Electronics Weekly , Feb. 7, 2006.

Dr. RoHS, "Dr RoHS: High voltage exemptions," Electronics Weekly, May 3, 2006.

Dr. RoHS, "Dr RoHS: Informing customers of non-compliance," Electronics Weekly , Jan. 23, 2006.

Dr. RoHS, "Dr RoHS: July too early to bring Category 9," Electronics Weekly , May 26, 2006.

Dr. RoHS, "Dr RoHS: Large scale tools and fixed installations," Electronics Weekly, Feb. 21, 2006.

Dr. RoHS, "Dr RoHS: Marine equipment exemption," Electronics Weekly, Apr. 12, 2006.

Dr. RoHS, "Dr RoHS: Monitoring and control exemptions," Electronics Weekly , May 11, 2006.

Dr. RoHS, "Dr RoHS: No leeway for professional equipment," Electronics Weekly , Feb. 14, 2006.

Dr. RoHS, "Dr RoHS: Penalties for non-compliance," Electronics Weekly, Mar. 31, 2006.

Dr. RoHS, "Dr RoHS: Repairing leaded boards with lead-free solder," Electronics Weekly, Mar. 16, 2006.

Dr. RoHS, "Dr RoHS: Trouble with RoHS and fixed installations," Electronics Weekly, June 8, 2006.

Dr. RoHS, "Dr RoHS: Vehicles and the End of Life Directive," Electronics Weekly, May 19, 2006.

Dragsdorf, R. Dean, and Johnson Jr., R. T., "Parallel Dislocations in Cobalt Whiskers," Journal of Applied Physics , vol. 33 no. 2, pp. 724-728, Feb. 1962.

Drapala, J., Kubicek, P., Vrestal, J., and Losertova, M., "Study of Reaction Diffusivity in the Copper-Indium-Tin Ternary System," Diffusion and Defect Data. Pt A Defect and Diffusion Forum, vol. 263, pp. 231-236, 2007.

Drapala, Jaromir, Struharova, Alena, Petlak, Daniel, Vodarek, Vlastimil, and Kubicek, Petr, "Reactive Diffusion at the Cylindrical Dissolving of Copper in the Solder Melt," Defect and Diffusion Forum, vol. 312-315, pp. 387-392, 2011.

Drapala, Jaromir, Jopek, Pavel, Petlak, Daniel, Harcuba, Petr, and Kubicek, Petr, "Reactive Diffusion upon Planar Dissolving Copper in Solder Melts," Defect and Diffusion Forum, vol. 309-310, pp. 127-134, 2011.

Drapala, Jaromir, and Kubicek, Petr, "Study of the Reactive Diffusion in the Presence of Dissolution of Copper in the Solder Melts," Defect and Diffusion Forum, vol. 297-301, pp. 8-14, 2010.

Drechsel, Christopher, "Mechanical Processes for Recycling Waste Electric and Electronic Equipment with the Rotorshredder and Rotor Impact Mill," Aufbereitungs-Technik/ Mineral Processing, vol. 47 no. 3, pp. 4-14, Mar. 2006.

Dreezen, G., Theunissen, L., Luyckx, G., Dooling, P., and Borak, A., "High Temperature Performance of Low Stress Electrically Conductive Adhesives in Electronic Applications," 2nd IEEE International Interdisciplinary Conference on Portable Information Devices, 2008 and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Garmisch-Partenkirchen, Germany, Aug, 17-20, 2008, pp. xx-xx.

Dreezen, G., and Luyckx, G., "Lead Free Assembly: conductive adhesives offer a real alternative," Global SMT & Packaging, vol. 3 no. 7, pp. 15-18, Oct. 2003.

Dreezen, G., Deckx, E., and Luyckx, G., "Lead Free Assembly: Novel Electrically Conductive Adhesives Compatible With 100 % Sn Metallisations," CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. 81-85.

Dreezen, G., Deckx, E., Furusho, R., Watanabe, B., Hartenstein, Rudy, and Luyckx, G., "New High Adhesion, 100% Sn compatible Electrically Conductive Adhesives," CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept. 25-28, 2006, pp. xx-xx.

Dreher, Jurgen, Brosius, Nadja, and Birkner, Klaus, "Higher reliability achieved with use of 'lead-free' solder joints," Dataweek, vol. xx no. xx, pp. xx-xx, Feb. 22, 2006.

Drensler, Stefanie, Milenkovic, Srdjan, and Hassel, Achim Walter, "Microvials with tungsten nanowire arrays," Journal of Solid State Electrochemistry, vol. 18 no. 11, pp. 2955-2961, Nov. 2014.

Drewien, C. A., Yost, F. G., Sackinger, S., Kern, J., and Weiser, M. W., "Progress Report: High Temperature Solder Alloys for Underhood Applications," Sandia Report SAND95-0196, Feb. 1995.

Drexler, E. S., and Berger, J. R., "Mechanical Deformation in Conductive Adhesives as Measured With Electron-Beam Moire," Journal of Electronic Packaging, vol. 121 no. 2, pp. 69-74, June 1999.

Dreybrodt, J., and Dupraz, Y., "Study of the UBM to copper interface robustness of solder bumps in flip chip packages," Microelectronics Reliability, vol. 54 no. 9-10, pp. 1969-1971, Sept.-Oct. 2014.

Dreyer, Gary A., Koudounaris, A. and Pratt, I. H., "The Reliability of Soldered or Epoxy Bonded Chip Capacitor Interconnections on Hybrids," IEEE Transactions on Parts, Hybrids, and Packaging, vol. PHP-13 no. 3, pp. 218-224, Sept. 1977.

Dreyer, Wolfgang, and Muller, Wolfgang H., "Toward Quantitative Modeling of Morphology Changes in Solids with Phase Field Theories: Atomistic Arguments for the Determination of Higher Gradient Coefficients," Key Engineering Materials, vol. 240-242, pp. 901-914, May 2003. https://doi.org/10.4028/www.scientific.net/KEM.240-242.901

Drienovsky, Marian, Trnkova, Lydia Rizekova, Martinkovic, Maros, Ozvold, Milan, Cernickova, Ivona, Palcut, Marian, and Janovec, Jozef, "Influence of cerium addition on microstructure and properties of Sn-Cu-(Ag) solder alloys," Materials Science and Engineering: A, vol. 623, pp. 83-91, Jan. 19, 2015.

Drienovsky, Marian, Trnkova, Lydia Rizekova, Ozvold, Milan, Cernickova, Ivona, Palcut, Marian, and Janovec, Jozef, "Melting behavior and oxidation resistance of Ce-Sn alloy designed for lead-free solder manufacturing," Journal of Thermal Analysis and Calorimetry, vol. 125 no. 3, pp. 1009-1015, Sept. 2016.

Drinek, Vladislav, Klementova, Mariana, Fajgar, Radek, and Dytrych, Pavel, "Silicon nanowires grown on metal substrates via self-catalyst mechanism," Materials Letters, vol. 160, pp. 109-112, Dec. 1, 2015.

Drohmann, Dieter, Landry, Susan, Steukers, Veronique, and Tange, Lein, "Tetrabromobisphenol A: Flame Retardant of Choice for Printed Wiring Board," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. P-04.

Drott, J., "Growth of Silver Sulphide Whiskers," Acta Metallurgica, vol. 8 no. 1, pp. 19-22, Jan. 1960.

Drozd, Z., Szwech, M., and Kisiel, R., "Thermal and Mechanical Reliability Tests of Lead - free soldered SMT Joints," 30th International Spring Seminar on Electronics Technology, Cluj-Napoca, Romania, May 9-13, 2007, pp. 177-182.

Drozd, Zdzislaw, Bronowski, Jaroslaw, Drozd, Jaroslaw, and Szwech, Marcin, "Accelerated Life - Test Methodology for Lead Free Electronic Products," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Drozd, Zdzislaw, Drozd, Jaroslaw, Bronowski, Jaroslaw, and Szwech, Marcin, "Mechanical Cycling in Accelerated Life-Time Tests of Lead-Free Soldered Joints," 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, Vienna, Austria, May 19-20, 2005, pp. 118-121.

Druce, Chris, "EU approves directive to recycle electrical waste," electronicsweekly.com, Apr. 16, 2002.

Druce, Chris, "UK consumers to be hit by recycling scheme, says EEF," electronicsweekly.com, Apr. 11, 2002.

Drumm, Steve, "Maintaining Quality Lead-free," Manufacturing Engineer, vol. 82 no. 4, pp. 26-37, Aug./Sept. 2003.

Druzhinin, A., Bolshakova, I., Ostrovskii, I., Khoverko, Yu., and Liakh-Kaguy, N., "Low temperature magnetoresistance of InSb whiskers," Materials Science in Semiconductor Processing, vol. 40, pp. 550-555, Dec. 2015.

Druzhinin, A., Ostrovskii, I., Khoverko, Y., and Liakh-Kaguy, N., "Spin-orbit coupling in strained Ge whiskers," Low Temperature Physics , vol. 45 no. 11, pp. 1182-1186. Nov. 2019. https://doi.org/10.1063/10.0000124

Druzhinin, A. A., Ostrovskii, I. P., Khoverko, Yu. M., Liakh-Kaguj, N. S., and Kogut, Iu. R., "Strain effect on magnetoresistance of SiGe solid solution whiskers at low temperatures," Materials Science in Semiconductor Processing, vol. 14 no. 1, pp. 18-22, Mar. 2011.

Druzhinin, A., Ostrovskii, I., Khoverko, Y., and Koretskii, R., "Strain-induced effects in p-type Si whiskers at low temperatures," Materials Science in Semiconductor Processing, vol. 40, pp. 766-771, Dec. 2015.

Druzhinin, A., Lavitska, E., Maryamova, I., Oszwaldowski, M., Berus, T., and Kunert, H. W., "Studies of Piezoresistance and Piezomagnetoresistance in Si Whiskers at Cryogenic Temperatures," Crystal Research and Technology, vol. 37 no. 2-3, pp. 243-257, 2002.

Druzhinin, Anatolij, Ostrovskii, Igor, and Kogut, Iurii, "Thermoelectric properties of Si-Ge whiskers," Materials Science in Semiconductor Processing, vol. 9 no. 4-5, pp. 853-857, Aug.-Oct. 2006.

Drysdale, Chelsey, "China Label Law a Sticky Situation," Circuits Assembly, vol. 17 no. 12, pp. 20, Dec. 2006.

Drysdale, Chelsey, "EU Chemicals Law Will 'Stretch' Industry's Resources," PCB Update , Oct. 27, 2006.

Drysdale, Chelsey, "EUP Draft Sent to EU," Circuits Assembly, vol. 19 no. 9, pp. 12,14, Sept. 2008.

Drysdale, Chelsey, "iNEMI Defines 'Low Halogen' in Electronics," Circuits Assembly, vol. 20 no. 8, pp. 10, Aug. 2009.

Drysdale, Chelsey, "IPC Criticizes TBBPA Inclusion in RoHS Draft," Circuits Assembly , vol. 19 no. 12, pp. 10, Dec. 2008.

Drysdale, Chelsey, "IPC: Industry Not Ready for REACH," Circuits Assembly, vol. 19 no. 9, pp. 8, Sept. 2008.

Drysdale, Chelsey, "REACH Costs `Horrifically Expensive'," Circuits Assembly, vol. 19 no. 10, pp. 16, Oct. 2008.

Drysdale, Chelsey, "Right Recipe Can Cut Pb-Free PCB Costs," Circuits Assembly, vol. 19 no. 8, pp. 8, Aug. 2008.

Du, Bin, Wu, Fengshun, Wang, Bo, Liu, Hui, An, Bing, and Wu, Yiping, "Effect of Stand-off Height on Microstructure and Tensile Strength of Cu/Sn-8Zn-3Bi/Cu and Cu/Sn-9Zn/Cu Solder Joints," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1044-1048.

Du, Bin, Cai, Xionghui, Hu, Jiaqi, Wang, Ling, Wang, Hongqin, Deng, Meiling, He, Lijiao, and Wan, Chao, "The effect of two different latent curing agents on the performance of anisotropic conductive adhesives," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 450-455.

Du, Bo, Zong, Ruilong, Zhou, Ji, and Li, Longtu, "The Preparation of Anodic Aluminum Oxide Ceramic Template and the Fabrication of Silver Nanowires," Key Engineering Materials, vol. 280-283, pp. 573-576, Feb. 2007.

Du, Changhua, Zhao, Jing, Du, Yunfei, Chen, Fang, and Zhao, Haijian, "Acting Capability of Flux for Pb-free Interconnection in Electronics Assembly," 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 6-10, 2009, pp. 790-793.

Du, Changhua, Zhao, Haijian, Yin, Limeng, and Chen, Fang, "Formation and Evolution of Intermetallic Compounds in Solder Joint for Electronic Interconnect," Materials Science Forum, vol. 687, pp. 80-84, 2011.

Du, Changhua, Yin, Limeng, Luo, Yi, Chen, Fang, and Zhao, Haijian, "Growing Behaviors of Oxidation Film on the Surface of Liquid Sn-0.68Cu-0.3Ag-X Solder," Materials Science Forum, vol. 687, pp. 85-89, 2011.

Du, Changhua, Luo, Yi, Su, Jian, Yin, Limeng, Li, Zhenkang, and Liu, Bin, "Microstructure and Mechanical Property of (Sn-9Zn0.05Ce)xBi Solder," Advanced Materials Research, vol. 189-193, pp. 3326-3330, Feb. 2011.

Du, Changhua, Li, Zhenkang, Liu, Bin, and Li, Chuntian, "The Frontier Analysis of RCS for Micro-Nano Particle," Advanced Materials Research, vol. 337, pp. 526-531, 2011.

Du, Chengchao, Wang, Xue, and Tian, Shuang, "Effect of bonding time on the microstructure and mechanical properties of Co/Sn/Cu joint," Journal of Materials Science: Materials in Electronics , vol. 29 no. 1, pp. 455-466, Jan. 2018.

Du, Chengchao, Wang, Xue, and Lai, Zhongmin, "Generation of near eutectic phase layer in Sn-15Bi solder joint during electro-migration," Materials Letters, vol. 191, pp. 193-195, Mar. 15, 2017.

Du, Fei, Yang, Donghua, Ran, Teng, Zhai, Xiang, Gan, Guisheng, and Tian, Jiang, "Effects of temperature gradients on the growth kinetics of CoSn3 at Co-P/Sn/Co-P interface," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Du, Jun, Liu, Jiao, Fu, Huaqiang, Li, Buhui, and Wu, Qi, "Recent Progress in Titanium Silicide Nanowires: Properties, Preparations and Applications," Applied Mechanics and Materials, vol. 446-447, pp. 50-54, Nov. 2013.

Du, Jun, Du, Piyi, Hao, Peng, Huang, Yanfei, Ren, Zhaodi, Weng, Wenjian, Han, Gaorong, and Zhao, Gaoling, "Self-induced preparation of TiSi nanopins by chemical vapor deposition," Nanotechnology, vol. 18 no. 34, pp. 345605-1-345605-4, Aug. 29, 2007.

Du, Li, Shi, Tielin, Su, Lei, Tang, Zirong, and Liao, Guanglan, "Hydrogen thermal reductive Cu nanowires in low temperature Cu-Cu bonding," Journal of Micromechanics and Microengineering, vol. 27 no. 7, pp. xx-xx, July 2017.

Du, Ning, Zhang, Hui, Fan, Xing, Yu, Jingxue, and Yang, Deren, "Large-scale synthesis of silicon arrays of nanowire on titanium substrate as high-performance anode of Li-ion batteries," CITE>Journal of Alloys and Compounds, vol. 526, pp. 53-58, June 15, 2012.

Du, Wen-Na, Yang, Xiao-Guang, Wang, Xiao-Ye, Pan, Hua-Yong, Ji, Hai-Ming, Luo, Shuai, Yang, Tao, and Wang, Zhan-Guo, "The self-seeded growth of InAsSb nanowires on silicon by metal-organic vapor phase epitaxy," Journal of Crystal Growth, vol. 396, pp. 33-37, June 15, 2014.

Du, Wenhui, Fu, Chune, Chen, Si, Cui, Huiwang, Liu, Xiaohua, Chen, Tianan, and Liu, Johan, "New Fast Curing Isotropic Conductive Adhesive for Electronic Packaging Application," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 199-201.

Du, Wenhui, Cui, Huiwang, Chen, Si, Yuan, Zhichao, Ye, Lilei, and Liu, Johan, "Study into High Temperature Reliability of Isotropic Conductive Adhesive," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 1053-1055.

Du, X. N., Guo, J. D., and Shang, J. K., "Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints," Journal of Electronic Materials, vol. 38 no. 11, pp. 2398-2404, Nov. 2009.

Du, Xue, Tian, Yanhong, and Zhao, Xin, "Mechanical Properties and Microstructure of Sn-Based Solder Joints at Cryogenic Temperature," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 888-892.

Du, Yi, Zhang, Qiang, Zhuo, Kai, Ji, Jianlong, Yuan, Zhongyun, Ji, Chao, Zhang, Wendong, and Sang, Shengbo, "Study on the performance of temperature-stabilised flexible strain sensors based on silver nanowires," IET Micro & Nano Letters, vol. 14 no. 2, pp. 168-172, Feb. 6, 2019.

Du, Yunfei, Li, Chuntian, Huang, Bin, Tang, Ming, and Du, Changhua, "Research and Prospect of Binary High-Temperature Pb-free Solders," Soldering & Surface Mount Technology, vol. 27 no. 1, pp. xx-xx, 2015.

Duan, Ani, Luu, Thi-Thuy, Wang, Kaiying, Aasmundtveit, Knut, and Hoivik, Nils, "Wafer-level Cu-Sn micro-joints with high mechanical strength and low Sn overflow," Journal of Micromechanics and Microengineering, vol. 25 no. 9, pp. 097001-1-097001-5, Sept. 2015.

Duan, Huabo, Li, Jinhui, Liu, Yicheng, Yamazaki, Norimasa, and Jiang, Wei, "Characterization and Inventory of PCDD/Fs and PBDD/Fs Emissions from the Incineration of Waste Printed Circuit Board," Environmental Science & Technology, vol. 45 no. 15, pp. 6322-6328, Aug. 1, 2011.

Duan, Huabo, Hou, Kun, Li, Jinhui, and Zhu, Xiaodong, "Examining the technology acceptance for dismantling of waste printed circuit boards in light of recycling and environmental concerns," Journal of Environmental Management, vol. 92 no. 3, pp. 392-399, Mar. 2011.

Duan, L. L., Yu, D. Q., Han, S. Q., Zhao, J., and Wang, L., "Microstructure and interface reaction between Sn-3.5Ag solder and electroplated Ni layer on Cu substrate during high temperature exposure," 2004 International Conference on Business of Electronic Product Reliability and Liability, Shanghai, China, Apr. 27-30, 2004, pp. 35-41.

Duan, L. L., Yu, D. Q., Han, S. Q., Ma, H. T., and Wang, L., "Microstructural evolution of Sn-9Zn-3Bi solder/Cu joint during long-term aging at 170 °C," Journal of Alloys and Compounds, vol. 381, no. 1-2, pp. 202-207, Nov. 3, 2004.

Duan, S., Li, H., Zhang, X., Sun, G., and Dash, J., "Hard Chromium Plating from a Trivalent Plating Bath," Plating & Surface Finishing, vol. 82 no. 6, pp. 84-86, June 1995.

Dubiel, Karen M., and MacLeod, Scott C., "Determining Compliance to the RoHS Directive for Wire and Cable Products," Proceedings of the 54th International Wire and Cable Symposium , Providence, RI, Nov. 13-16, 2005, pp. 492-496.

Dubpernell, George, "A History of Chromium Plating," Plating and Surface Finishing, vol. 71 No. 6, pp. 84-91, June 1984.

Dubrovskii, V. G., and Hervieu, Yu. Yu., "Diffusion-induced growth of nanowires: Generalized boundary conditions and self-consistent kinetic equation," Journal of Crystal Growth, vol. 401, pp. 431-440, Sept. 1, 2014.

Dubrovskii, V. G., and Sibirev, N. V., "General form of the dependences of nanowire growth rate on the nanowire radius," Journal of Crystal Growth, vol. 304 no. 2, pp. 504-513, June 15, 2007.

Dubrovskii, V. G., Sibirev, N. V., Harmand, J. C., and Glas, F., "Growth kinetics and crystal structure of semiconductor nanowires," Physical Review B, vol. 78 no. 23, pp. 235301-1-235301-10, 2008.

Dubrovskii, V. G., Soshnikov, I. P., Sibirev, N. V., Cirlin, G. E., and Ustinov, V. M., "Growth of GaAs nanoscale whiskers by magnetron sputtering deposition," Journal of Crystal Growth, vol. 289 no. 1, pp. 31-36, Mar. 15, 2006.

Dubrovskii, V. G., Borie, S., Dagnet, T., Reynes, L., Andre, Y., and Gil, E., "Nucleation and initial radius of self-catalyzed III-V nanowires," Journal of Crystal Growth, vol. 459, pp. 194-197, Feb. 1, 2017.

Dubrovskii, Vladimir G., "Group V sensitive vapor-liquid-solid growth of Au-catalyzed and self-catalyzed III-V nanowires," Journal of Crystal Growth, vol. 440, pp. 62-68, Apr. 15, 2016.

Dubrovskii, Vladimir G., Nazarenko, Maxim V., Chuang, Linus C., Ko, Wai Son, Ng, Kar Wei, and Chang-Hasnain, Connie, "Growth kinetics of GaAs nanoneedles on silicon and sapphire substrates," Applied Physics Letters, vol. 98, pp. 153113-1-153113-3, 2011.

Dubrovskii, Vladimir G., "Length distributions of nanowires: Effects of surface diffusion versus nucleation delay," Journal of Crystal Growth, vol. 463, pp. 139-144, Apr. 1, 2017.

Duchi, Patrick J., Cetier, Jonathan, Levasseur, Laurent, Coquio, Jaquemine, and Aguilar, Rodrigo, "Optimization of Chemistry for a Vapour Phase Process to Deflux No Clean Lead Free Materials on PCBs," 2017 IEEE 19th Electronics Packaging Technology Conference, Singapore, Dec. 6-9, 2017, pp. xx-xx.

Duck, Allen, and Zabel, Claus, "Vapour Phase Reflow - Profiling For Lead Free Alloys," International Conference on Soldering & Reliability 2010 Proceedings, Toronto, Ontario, Canada, May 17-20, 2010, pp. xx-xx.

Duck, Allen "Vapor Phase Reflow Rebounds," Circuitnet, Dec. 13, 2007.

Duck, Allen W., "Vapor Phase Technology and Its Application," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 361-363.

Duclos, Danielle, "Technologies for Chromium Replacement," Advanced Materials & Processes, vol. 159 no. 2, pp. 49-50, Feb. 2001.

Ducoulombier, Aurelie, and Guene, Emmanuelle, "Development of a Low Voiding Lead-Free Solder Paste for High Reliability Applications," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 271-277.

Dudek, M. A., and Chawla, N., "Effect of Rare-Earth (La, Ce, and Y) Additions on the Microstructure and Mechanical Behavior of Sn-3.9Ag-0.7Cu Solder Alloy," Metallurgical and Materials Transactions A, vol. 41 no. 3, pp. 610-620, Mar. 2010.

Dudek, M. A., and Chawla, N., "Mechanisms for Sn whisker growth in rare earth-containing Pb-free solders," Acta Materialia, vol. 57 no. 15, pp. 4588-4599, Sept. 2009.

Dudek, M. A., Sidhu, R. S., Chawla, N., and Renavikar, M., "Microstructure and Mechanical Behavior of Novel Rare Earth-Containing Pb-Free Solders," Journal of Electronic Materials, vol. 35 no. 12, pp. 2088-2097, Dec. 2006.

Dudek, M. A., and Chawla, N., "Nanoindentation of rare earth-Sn intermetallics in Pb-free solders," Intermetallics, vol. 18 no. 5, pp. 1016-1020, May 2010.

Dudek, M. A., Sidhu, R. S., and Chawla, N., "Novel Rare-Earth-Containing Lead-Free Solders with Enhanced Ductility," JOM, vol. 58 no. 6, pp. 57-62, June 2006.

Dudek, M. A., and Chawla, N., "Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders," Journal of Electronic Materials, vol. 38 no. 2, pp. 210-220, Feb. 2009.

Dudek, R., Hildebrand, M., Rzepka, S., Fries, T., Doring, R., Seiler, B., and Ortmann, R. W., "Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue," Microelectronics Reliability, vol. 83, pp. 162-172, Apr. 2018.

Dudek, R., Schubert, A., Meinel, S., Michel, B., Dorfmuller, L., Knoll, P. M., and Baumbach, J., "Flow Characteristics and Thermo-Mechanical Response of Anisotropic Conductive Film," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 68-75.

Dudek, Rainer, Faust, Wolfgang, Gollhard, Astrid, and Michel, Bernd, "A FE-Study of Solder Fatigue Compared to Microstructural Damage Evaluation by In-SITU Laser Scanning and FIB Microscopy," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 2, 2006, pp. 1031-1037.

Dudek, Rainer, Kreyssig, Kerstin, Rzepka, Sven, Novak, Michael, Gruebl, Wolfgang, Fruehauf, Peter, and Weigert, Andreas, "Comparisons of Solder Joints Fatigue Life Predictions and Several Long-Term Testing Results," 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 28-31, 2019, pp. 709-716.

Dudek, Rainer, Rzepka, Sven, Dobritz, Stephan, Doring, Ralf, Keybig, Kerstin, Wiese, Steffen, and Michel, Bernd, "Fatigue Life Prediction and Analysis of Wafer Level Packages with SnAgCu Solder Balls," 1st Electronics Systemintegration Technology Conference, Volume 2, Dresden, Germany, Sept. 5-7, 2006, pp. 903-911.

Dudek, Rainer, Kaulfersch, Eberhard, Rzepka, Sven, Rollig, Mike, and Michel, Bernd, "FEA Based Reliability Prediction for Different Sn-Based Solders Subjected to Fast Shear and Fatigue Loadings," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Dudek, Rainer, Meinel, Stefan, Schubert, Andreas, Michel, Bernd, Dorfmuller, Lutz, Knoll, Peter M., and Baumbach, Jorg, "Flow Characterization and Thermo-Mechanical Response of Anisotropic Conductive Films," IEEE Transactions on Components and Packaging Technologies,, vol. 22 no. 2, pp. 177-185, June 1999.

Dudek, Rainer, Doring, Ralf, Michel, Bernd, Petzold, Gunnar, Albrecht, Juergen, Wieand, Christian, and Kuhn, Stefan, "Investigations on the Reliability of Lead-free CSP Subjected to Harsh Environments," The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 121-130.

Dudek, Rainer, Hildebrandt, M., Kreysig, K., Rzepka, S., Novak, M., Grubl, W., and Schuck, B., "Long-Term Thermal Fatigue Testing of Solder Joints and Related Fatigue Life Predictions," 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Toulouse, France, Apr. 15-18, 2018, pp. xx-xx.

Dudek, Rainer, Faust, Wolfgang, Wiese, Steffen, Rollig, Mike, and Michel, Bernd, "Low-cycle Fatigue of Ag-Based Solders Dependent on Alloying Composition and Thermal Cycle Conditions," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 14-20.

Dudek, Rainer, Sommer, Peter, Fix, Andreas, Trodler, Joerg, Rzepka, Sven, and Michel, Bernd, "Reliability investigations for high temperature interconnects," Soldering & Surface Mount Technology, vol. 26 no. 1, pp. 27-36, 2014.

Dudek, Rainer, Berek, Harry, Fritsch, Thomas, and Michel, Bernd, "Reliability Investigations on Conductive Adhesive Joints with Emphasis on the Mechanics of the Conduction Mechanism," IEEE Transactions on Components and Packaging Technologies, vol. 23 no. 3, pp. 462-469, Sept. 2000.

Dudek, Rainer, Doering, Ralf, Bombach, Christine, and Michel, Bernd, "Simulation based analysis of secondary effects on solder fatigue," Microelectronics Reliability, vol. 49 no. 8, pp. 839-845, Aug. 2009.

Dudek, Rainer, Hildebrandt, M., Doering, R., Rzepka, S., Trageser, H., Kohl, R.. and Wang, C. K., "Solder Fatigue Acceleration Prediction and Testing Results for Different Thermal Test- and Field Cycling Environments," 2014 Electronics System-Integration Technology Conference, Helsinki, Finland, Sept. 16-18, 2014, pp. xx-xx.

Dudek, Ranier, Walter, Hans, Michel, Bernd, Alpern, Peter, Schmidt, Roland, and Tilgner, Ranier, "Studies on Parameters for Popcorn Cracking," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, Germany, Oct. 21-24, 2001, pp. 140-148.

Dudek, Rainer, Faust, Wolfgang, Ratchev, Roumen, Roellig, Mike, Albrecht, Hans-J., and Michel, Bernd, "Thermal Test- and Field Cycling Induced Degradation and Its FE-based Prediction for Different SAC Solders," 11th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 28-31, 2008, pp. 668-675.

Dudek, Rainer, Doring, Ralf, Michel, Bernd, Picault, Alain, and Autissier, Jean-Francois, "Thermo-Mechanical Reliability Analyses on Solder Joints of Ceramic Components," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Dudek, Russell, Kuhn, John, and Goldman, Patricia, "Opening Eyes on Fiber Weave and CAF," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Dudek, Russell, Kuhn, John, and Goldman, Patricia, "Opening Eyes on Fiber Weave and CAF," Printed Circuit Design and Fab, vol. 26 no. 4, pp. xx-xx, Apr. 2009.

Duffus, John H., "Toxicology of Metals - Science Confused by Poor Use of Terminology," Archives of Environmental Health, vol. 58 no. 5, pp. 263-266, May 2003,

Duffy, Noel, "The challenges of the RoHS & WEEE Directives," SMART Ireland Lead-Free Materials + Legislation Seminar, Dublin, Ireland, Sept. 23, 2004.

Duh, Jenq-Gong, and Chen, Wei-Yu, "Improving the Impact Reliability of the Ni-doped Solder Joint by Applying Cu-Zn Under Bump Metallization," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 130-134.

Dumitru, Georgiana, Tudor, Andrei, Cananau, Sorin, Plotog, Ioan, and Varzaru, Gaudentiu, "Mechanical test for Vapor Phase Solder Joint," 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging , Alba Iulia, Romania, Oct. 25-28, 2012, pp. 321-324.

Dunford, Steve, Canumalla, Sridhar, and Viswanadham, Puligandla, "Intermetallic Morphology and Damage Evolution Under Thermomechanical Fatigue of Lead (Pb)-Free Solder Interconnections,", Nokia, Apr. 3, 2004.

Dunford, Steven, Canumalla, Sridhar, and Viswanadham, Puligandla, "Intermetallic Morphology and Damage Evolution Under Thermomechanical Fatigue of Lead (Pb)-Free Solder Interconnections," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 726-736.

Dunford, Steven O., Viswanadham, Puligandla, Leitel, Peter, and Rautila, Pekka, "Metallurgical and Reliability Aspects of Lead-Free Mixed Technology Electronic Assembly for Mobile Communication Products," IPC Works, Sept. 9-14, 2000, pp. xx-xx.

Dunford, Steven O., Viswanadham, Puligandla, Leitel, Peter, and Rautila, Pekka, "Metallurgical and Reliability Aspects of Lead-free Mixed Technology Electronic Assembly for Mobile Communication Products," 2000 Emerging Technologies Conference Proceedings, 2000, pp. xx-xx.

Dungan, Larry, "Working With Your Supply Chain To Incorporate Safer Alternatives," Flame Retardants and Fire Safety, Nov. 4, 2004, pp. xx-xx.

Dunkerley, F. J., and Mills, G. J., "Application of Electromotive Force Measurements to Phase Equilibria," Thermodynamics in Physical Metallurgy, Cleveland, OH, Oct. 15-21, 1949, pp. 47-84.

Dunkerton, S. B., and Goward, J. M., "A review of ball grid arrays for electronic assembly," The 1998 International Conference on Advances in Welding Technology, Columbus, OH, Sept. 30-Oct. 2, 1998, pp. xx-xx.

Dunn, B. D., "A Laboratory Study of Tin Whisker Growth," European Space Agency (ESA) STR-223, Sept. 1987.

Dunn, B. D., "Guidelines for Creating a Lead-Free Control Plan," European Space Agency STM-281, Oct. 2012.

Dunn, B. D., "Mechanical and Electrical Characteristics of Tin Whiskers with Special Reference to Spacecraft Systems," European Space Agency (ESA) Journal, vol. 12, pp. 1-17, Jan. 14, 1988.

Dunn, B. D., "Metallurgy and reliability in spacecraft electronics," Metals and Materials, vol. xx no. xx, pp. 34-38, Mar. 1975.

Dunn, B. D., "The Fusing of Tin-lead Plating on High Quality Printed-Circuit Boards," Transactions of the Institute of Metal Finishing, vol. 58, pg. 26-28, 1980.

Dunn, B. D., "Whisker Formation on Electronic Materials," ESA Scientific and Technical Review, vol. 2 no. 1, pp. 1-22, 1976.

Dunn, B. D., "Whisker Formation on Electronic Materials," Circuit World, vol. 2 no. 4, pp. 32-40, July 1976.

Dunn, Barrie, "15-1/2 Years of Tin Whisker Growth - Results of SEM Inspections Made on Tin Electroplated C-Ring Specimens," ESTEC Materials Report 4562, Mar. 22, 2006.

Dunn, Barrie, Turner, Ian, and Barnes, Cathy, "A study into the re-processing of pure tin termination finishes into tin-lead," Soldering & Surface Mount Technology, vol. 25 no. 4, pp. xx-xx, 2013.

Dunn, Barrie, "Conformal Coatings - the importance of mechanical properties with respect to tin whisker mitigation," 3rd Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Genova, Italy, Mar. 21, 2012.

Dunn, Barrie D., "European Space Agency Position Summary," Lead Free Soldering Summit , Philadelphia, PA, July 13-14, 2005.

Dunn, Barrie D., and Mozdzen, Grazyna, "Tin Oxide Coverage on Tin Whisker surfaces, Measurements and Implications for Electronic Circuits," Soldering & Surface Mount Technology, vol. 26 no. 3, pp. xx-xx, 2014.

Dunn, Barrie D., "Workmanship standards and their application on ESA projects," Soldering & Surface Mount Technology, vol. 20 no. 4, pp. 37-44, 2008.

Duong, Ngoc Binh, Ariga, Tadashi, Hussain, Luay Bakir, and Ismail, Amad Badri, "Wettability of Lead-Free Solders on Gold-Plated Copper Substrates," Materials Transactions, vol. 49 no. 6, pp. 1462-1466, June 2008.

Duong, Thanh-Hung, Tran, Nguyen-Hung, and Kim, Hyun-Chul, "Low cost fabrication of flexible transparent electrodes using copper nanowires," Thin Solid Films, vol. 622, pp. 17-22, Jan. 31, 2017.

Dupak, Jan, and Ustohal, Vladimir, "Soldering with Ductile Active Solders," Materials and Manufacturing Processes, vol. 16 no. 6, pp. 855-861, 2001.

du Plessis, M., and Jouber, T.-H., "Silicon nanowire hot carrier electroluminescence," Thin Solid Films , vol. 613, pp. 48-54, Aug. 31, 2016.

Duprat, Jean-Jacques, "Umweltschutzanforderungen in der franzosischen automobilindustrie," Galvanotechnik, vol. 93 no. 10, pp, 2700-2704, Oct. 2002.

Dupre, Ludovic, Buttard, Denis, Leclere, Cedric, Renevier, Hubert, and Gentile, Pascal, "Gold Contamination in VLS-Grown Si Nanowires: Multiwavelength Anomalous Diffraction Investigations," Chemistry of Materials, vol. 24 no. 23, pp. 4511-4516, Dec. 11, 2012.

Durairaj, R., and Man, Lam Wai, "Effect of epoxy and filler concentrations on curing behaviour of isotropic conductive adhesives," Journal of Thermal Analysis and Calorimetry , vol. 103 no. 3, pp. xx-xx, Mar. 2011.

Durairaj, R., and Man, Lam Wai, "Effect of epoxy and filler concentrations on curing behaviour of isotropic conductive adhesives," Journal of Thermal Analysis and Calorimetry , vol. 105 no. 1, pp. 151-155, July 2011.

Durairaj, R., Sean, Chew Chee, Chiun, Tan Chia, and Ping, Liew Jian, "Investigation of Dynamic and Mechanical Thermal Behavior of Isotropic Conductive Adhesives," 2013 IEEE 15th Electronics Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp. 461-465.

Durairaj, R., Man, Lam Wai, Ramesh, S., Wea, Lim Chia, Leng, Eu Poh, Ekere, N. N., Mallik, S., and Seman, A., "Investigation of Wall-slip Behavior in Lead-free Solder Pastes and Isotropic Conductive Adhesives," 11th Electronics Packaging Technology Conference , Singapore, Dec. 9-11, 2009, pp. 422-426.

Durairaj, R., Mallik, S., Seman, A., Marks, A., and Ekere, N. N., "Investigation of Wall-slip Effect on Paste Release Characteristic in Flip chip Stencil Printing Process," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1328-1333.

Durairaj, R., Leong, Kau Chee, Wea, Lim Chia, and Chu, Wong Mee, "Oscillatory and Creep Recovery Test on Nano-Composite Lead-Free Solder Pastes (Nickel and Platinum Powder)," Key Engineering Materials, vol. 471-472, pp. 257-262, 2011.

Durairaj, R., Mallik, S., Marks, A., Winter, M., Bauer, R., and Ekere, N. N., "Rheological Characterisation of New Lead-Free Solder Paste Formulations for Flip-Chip Assembly," 1st Electronics Systemintegration Technology Conference, Volume 2, Dresden, Germany, Sept. 5-7, 2006, pp. 995-1000.

Durairaj, R., Mallik, S., Seman, A., Marks, A., and Ekere, N. N., "Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly," Journal of Materials Processing Technology, vol. 209 no. 8, pp. 3923-3930, Apr. 21, 2009.

Durairaj, R., Ekere, N. N., and Salam, B., "Thixotropy flow behaviour of solder and conductive adhesive pastes," Journal of Materials Science: Materials in Electronics, vol. 15 no. 10, pp. 677-683, 2004.

Durairaj, R., Mallik, S., Seman, A., Marks, A., and Ekere, N. N., "Viscoelastic properties of solder pastes and isotropic conductive adhesives used for flip-chip assembly," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Duraj, Ales, and Mach, Pavel, "Analysis and Prediction of Electrical Contact Resistance for Anisotropic Conductive Adhesives," 31st International Spring Seminar on Electronics Technology, Budapest, Hungary, May 7-11, 2008, pp. 358-362.

Duraj, Ales, Mach, Pavel, Samal, David, Friese, Marcus, and Busek, David, "Correlation among Mechanical and Electrical Properties of Conductive Adhesive Joints," 29th International Spring Seminar on Electronics Technology , St. Marienthal, Germany, May 10-14, 2006, pp. 287-290.

Duraj, Ales, and Mach, Pavel, "Diagnostic Tools for Evaluation of the Quality of the Anisotropic Conductive Adhesive Joints," 29th International Spring Seminar on Electronics Technology, St. Marienthal, Germany, May 10-14, 2006, pp. 132-136.

Duraj, Ales, Mach, Pavel, Radev, Radoslav, and Matejec, Jan, "Influence of High Current Load on Electrical Properties of Adhesive Conductive Joints," 1st Electronics Systemintegration Technology Conference, Volume 2, Dresden, Germany, Sept. 5-7, 2006, pp. 1323-1329.

Duraj, Ales, Busek, David, and Mlich, Andrej, "Measurement of Nonlinearity as a Diagnostic Tool for Quality Determination of Lead-free Solder Joints," 30th International Spring Seminar on Electronics Technology, Cluj-Napoca, Romania, May 9-13, 2007, pp. 134-138.

Duraj, Ales, and Mach, Pavel, "Stability of Electrical Resistance of Isotropic Conductive Adhesives within Mechanical Stress," International Conference on Applied Electronics , Pilsen, Czech Republic, Sept. 6-7, 2006, pp. 35-38.

Durand, C., Klingler, M., Bigerelle, M., and Coutellier, D., "Solder fatigue failures in a new designed power module under Power Cycling," Microelectronics Reliability, vol. 66, pp. 122-133, Nov. 2016.

Durga, A., Wollants, P., and Moelans, N., "Phase-field study of IMC growth in Sn-Cu/Cu solder joints including elastoplastic effects," Acta Materialia, vol. 188, pp. 241-258, Apr. 15, 2020.

Durgaprasad, A., Giri, S., Lenka, S., Sarkar, Sudip Kumar, Biswas, Aniruddha, Kundu, S., Mishra, S., Chandra, S., Doherty, R. D., and Samajdar, I., "Delamination of Pearlitic Steel Wires: The Defining Role of Prior-Drawing Microstructure," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 49 no. 6, pp. 2037-2047, June 2018.

Durisin, Juraj, Pietrikova, Alena, and Livovsky, L'ubomir, "Optimization of Testing Methods for Investigation of Joints Quality Based on Vapour Phase Lead-free Soldering," 30th International Spring Seminar on Electronics Technology, Cluj-Napoca, Romania, May 9-13, 2007, pp. 258-262.

Durisin, Martin, Pietrikova, Alena, Durisin, Juraj, and Saksl, Karel, "Structure and thermal behavior of lead-free solders prepared by rapid solidification of their melt," Soldering & Surface Mount Technology , vol. 29 no. 1, pp. 49-53, 2017.

Durney, Larry, "PF finishing clinic," Products Finishing, vol. 55 no. 6, pp. 18, 20, Mar. 1991.

Dusek, K., Busek, D., Beran, T., and Rudajevova, A., "Comparison of Shear Strength of Soldered SMD Resistors for Various Solder Alloys," 2015 38th International Spring Seminar on Electronics Technology, Eger, Hungary, May 6-10, 2015, pp. 237-240.

Dusek, K., Vavra, J., and Rudajevova, A., "Effect of Reflow Technology and Surface Finishes of PCB on Solder Spreading," 2013 36th International Spring Seminar on Electronics Technology, Alba Iulia, Romania, May 8-12, 2013, pp. 136-139.

Dusek, K., Rudajevova, A., and Placek, M., "Influence of latent heat released from solder joints on the reflow temperature profile," Journal of Materials Science: Materials in Electronics, vol. 27 no. 1, pp. 543-549, Jan. 2016.

Dusek, Karel, and Urbanek, Michal, "Comparison of Dynamic and Static Mechanical Stress Applied on Soldered Joints," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 204-207.

Dusek, Karel, Busek, David, Petrac, Adam, Placek, Martin, Kozak, Martin, Molhanec, Martin, and Pelikanova, Ivana Beshajova, "Comparison of Mechanical Resistance of SnCu and SnBi of Solder Joints," 2017 40th International Spring Seminar on Electronics Technology, Sofia, Bulgaria, May 10-14, 2017, pp. xx-xx.

Dusek, Karel, Stancu, Cristina, Notingher, Petru V., Mach, Pavel, and Placek, Martin, "Experimental and Numerical Analysis of Melting and Solidification of SnAgCu Joints," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 6 no. 9, pp. 1445-1455, Sept. 2016.

Dusek, Karel, Vesely, Petr, Simek, Miroslav, and Rudajevova, Alexandra, "Experimental Study of the Influence of the Temperature Profile on the BGA Soldering," 2016 39th International Spring Seminar on Electronics Technology, Pilsen, Czech Republic, May 18-22, 2016, pp. 210-213.

Dusek, Karel, and Martinek, Jan, "Image Analysis of Solder Spread Factor on Different Material Types," 32nd International Spring Seminar on Electronics Technology, Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.

Dusek, Karel, Novak, Michal, and Rudajevova, Alexandra, "Influence of Different Surface Finishes of PCB on the Solder Spread," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 192-195.

Dusek, Karel, Placek, Martin, Busek, David, and Rudajevova, Alexandra, "Influence of Latent Heat on the Shape of Temperature Profile for Different Types of Solder Alloys," 2016 39th International Spring Seminar on Electronics Technology, Pilsen, Czech Republic, May 18-22, 2016, pp. 214-217.

Dusek, Karel, and Rudajevova, Alexandra, "Influence of latent heat released from solder joints II: PCB deformation during reflow and pad cratering defects," Journal of Materials Science: Materials in Electronics, vol. 28 no. 1, pp. 1070-1077, Jan. 2017.

Dusek, Karel, and Urbanek, Jan, "Influence of the reduced oxygen concentration on the wetting force," 29th International Spring Seminar on Electronics Technology, St. Marienthal, Germany, May 10-14, 2006, pp. 193-196.

Dusek, Karel, Novak, Michal, and Mach, Pavel, "Solderability Measurement of Copper with Different Surface Finishes," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 113-116.

Dusek, Karel, Placek, Martin, Busek, David, Dvorakova, Klara, and Rudajevova, Alexandra, "Study of Influence of Thermal Capacity and Flux Activity on the Solderability," Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, Dresden, Germany, May 7-11, 2014, pp. 185-188.

Dusek, Karel, and Urbanek, Jan, "Surface tension measurement of the solders by non-wetting specimen," 31st International Spring Seminar on Electronics Technology, Budapest, Hungary, May 7-11, 2008, pp. 354-357.

Dusek, Karel, Placek, Martin, Cepek, Martin, Molhanec, Martin, and Pelikanova, Ivana Beshajova, "Ultrasonic Soldering, Mechanical Properties of Solder Joints," 2017 40th International Spring Seminar on Electronics Technology, Sofia, Bulgaria, May 10-14, 2017, pp. xx-xx.

Dusek, Karel, Urbanek, Jan, Mach, Pavel, and Drapala, Jaromir, "Wetting Force Measurement of the Different Types of Solders and Testing Materials," 30th International Spring Seminar on Electronics Technology , Cluj-Napoca, Romania, May 9-13, 2007, pp. 167-170.

Dusek, M., Jonck, R., Subotic, B., Nottay, J., and Tomlins, P. E., "Conductive Adhesives Versus Lead Based Solders : A Comparison of Performance," NPL Report CMMT(A)297, Nov. 2000.

Dusek, M., Wickham, M., and Hunt, C., "Effect of PCB Finish, Processing and Microstructure on Lead-free Solder Joint Reliability," NPL Report DEPC MPR 028, Sept. 2005.

Dusek, M., and Hunt, C. P., "Low Cycle Isothermal Fatigue Properties of Lead-free Solders," NPL Report DEPC-MPR058, Jan. 2007 .

Dusek, M., and Hunt, C. P., "Statistical Analysis of the Effect of PCB Finish and Processing of Solder Joint on Integrity," NPL Report DEPC-MPR 047, Mar. 2006.

Dusek, M., and Hunt, C. P., "Test Approach to Isothermal Fatigue Measurements for Lead-free Solders," NPL Report DEPC-MPR 048, Mar. 2006.

Dusek, Milos, Nottay, Jaspal, and Hunt, Christopher, "A Test Methodology for Assessing Pb-free Solder Joint Reliability," NPL Report CMMT(A)273, July 2000.

Dusek, Milos, and Hunt, Christopher, "A Test Procedure for Measuremet of Solder Volume Effect on Reliability," NPL Report MATC(A) 128, Sept. 2002.

Dusek, Milos, and Hunt, Chris, "An Experimental Method to Investigate True Stress During the Fatigue of Lead-Free Solders," 2006 SMTA International Conference Proceedings , Rosemont, IL, Sept. 24-28, 2006, pp. 908-912.

Dusek, Milos, Nottay, Jaspal, Hunt, Christopher, Lu, Hua, and Bailey, Christopher, "An Experimental Validation of Modelling for Pb-free Solder Joint Reliability," NPL Report MATC(A)11, Oct. 2001.

Dusek, Milos, and Hunt, Christopher, "Best Practice Guide for Thermocycling and Reliability Assessment of Solder Joints," NPL Report CMMT(A)274, July 2000.

Dusek, Milos, Nottay, Jaspal, and Hunt, Christopher, "Compatibility of Lead-free Alloys with Current PCB materials," Proceedings 2002 International Conference on Advanced Packaging and Systems (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4828), Reno, NV, Mar. 10-13, 2002, pp. 110-115.

Dusek, Milos, Nottay, Jaspal, and Hunt, Christopher, "Compatibility of Lead-free Solders with PCB Materials," NPL Report MATC(A)89, Aug. 2001.

Dusek, Milos, and Hunt, Christopher, "Crack Detection Methods for Lead-free Solder Joints," NPL Report MATC(A)164, Mar. 2004.

Dusek, Milos, "Credible Lead-free Materials Data at Last.," Microelectronics News , no. 17, pp. 4, June 2003.

Dusek, Milos, and Hunt, Christopher, "Creep Rates and Stress Relaxation for Micro-sized Lead-free Solder Joints," NPL DEPC-MN 021, May 2005.

Dusek, Milos, and Hunt, Christopher, "Effect of PCB Finish, Processing and Microstructure on Lead Free Solder Joint Reliability," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Dusek, Milos, and Hunt, Chris, "Effects of Microstructure, PCB Finish and Processing on Lead-Free Reliability," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 591-600.

Dusek, Milos, Okoro, Chukwudi, and Hunt, Christopher, "Establishing the Stress / Strain Behaviour of Solder Alloys under Multiple Constant Strain Cycles with Isothermal Conditions," 1st Electronics Systemintegration Technology Conference, Volume 2, Dresden, Germany, Sept. 5-7, 2006, pp. 942-946.

Dusek, Milos, and Hunt, Chris, "Fatigue Damage Prediction during Thermo-Mechanical Cycling for Lead-Free Solders," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 777-780.

Dusek, Milos, and Hunt, Christopher, "Fatigue Damage Prediction During Thermo-mechanical Cycling for Lead-free Solders," 2nd Electronics Systemintegration Technology Conference , Greenwich, London, UK, Sept. 1-4, 2008, pp. 763-766.

Dusek, Milos, "Low Cycle Isothermal Fatigue of Lead-free Solders," Microelectronics News, no. 24, pp. 4, Winter 2007.

Dusek, Milos, and Hunt, Christopher, "Low cycle isothermal fatigue properties of lead-free solders," Soldering & Surface Mount Technology, vol. 19 no. 4, pp. 25-32, 2007.

Dusek, Milos, and Hunt, Christopher, "Low Cycle Isothermal Fatigue Properties of Lead-free Solders," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 760-763.

Dusek, Milos, and Hunt, Christopher, "Measurement Note - Crack Detection Methods For Lead-free Solder Joints," NPL DEPC-MN 001, Apr. 2004.

Dusek, Milos, Wickham, Martin, and Hunt, Christopher, "Measurement Note - Shear Strength of Lead-free Solder Joints," NPL Report MATC(MN)57, Mar. 2004.

Dusek, Milos, and Hunt, Christopher, "Measurement of Materials Properties of Lead-Free Solders for Modelling Requirements," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 753-757.

Dusek, Milos, "Modelling Provides an Insight," Microelectronics News, no. 19, pp. 3, July 2004.

Dusek, Milos, "NPL Helps Lead-free Transition for Industry," Microelectronics News , no. 18, pp. 2-3, Dec. 2003.

Dusek, Milos, and Hunt, Christopher, "Reliability Comparison of Lead-free Solder Joints Formed on Different PCB Finishes," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 23-24, 2003, pp. 205-217.

Dusek, Milos, Brewin, Alan, and Hunt, Christopher, "Reliability of Mixed Pb-free and Pb-alloys in a Rework Scenario," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 23-24, 2003, pp. 191-202.

Dusek, Milos, Zou, Ling, and Hunt, Christopher, "Rheology Testing of Solder Pastes and Conductive Adhesives - A Guide," NPL Report MATC(A)109, May 2002.

Dusek, Milos, and Hunt, Christopher, "Test Methods for Evaluating the Reliability of PCB Finishes using Lead-Free Alloys - A Guide," NPL Report MATC(A)107, Apr. 2002.

Dusek, Milos, and Hunt, Christopher, "The Analytical Model for Thermal Cycling," NPL Report MATC(A)163, Mar. 2004.

Dusek, Milos, and Hunt, Christopher, "The Analytical Model II for Predicting Solder Joint Shape and Volume Impact on Life-time," NPL Report DEPC-MPR 039, Nov. 2005.

Dusek, Milos, Wickham, Martin, and Hunt, Christopher, "The Impact of Thermal Cycle Regime on the Shear Strength of Lead-free Solder Joints," NPL Report MATC(A)156, Nov. 2003.

Dusek, Milos, Wickham, Martin, and Hunt, Christopher, "The Impact of Thermal Cycling Regime on the Shear Strength of Lead-Free Solder Joints," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 803-809.

Dusek, Milos, Wickham, Martin, and Hunt, Christopher, "The impact of thermal cycling regime on the shear strength of lead-free solder joints," Soldering & Surface Mount Technology, vol. 17 no. 2, pp. 22-31, 2005.

Dusek, Milos, and Hunt, Chris, "The Measurement of Creep Rates and Stress Relaxation for Micro Sized Lead-free Solder Joints," NPL Report DEPC MPR 021, Apr. 2005.

Dusek, Milos, Nottay, Jaspal, and Hunt, Christopher, "The Use of Shear Testing and Thermal Cycling for Assessment of Solder Joint Reliability," NPL Report CMMT(A)268, June 2000.

Dusek, Milos, "Thermal Cycling - The Way Forward," Microelectronics News, no. 17, pp. 3, June 2003.

Dusharme, Dirk, "The Downside of the Low Cost of Quality," Quality Digest, vol. xx no. xx, pp. 4, Feb. 2005.

Dutcher, J. R., Cochran, J. F., Heinrich, B., and Arrott, A. S., "Brillouin light scattering studies on an iron whisker," Journal of Applied Physics, vol. 64 no. 10, pp. 6095-6097, Nov. 15, 1988.

Dutt, Gyan, Liu, Yayun, Xiao, Allison, He, George, and Francis, Mark, "Novel Lead-free Wafer-level Underfill Materials for Chipscale Packaging," Wafer-Level Congress and Exhibition Conference Proceedings, San Jose, CA, Oct. 10-12, 2004, pp. xx-xx.

Dutta, I., "A Constitutive Model for Creep of Lead-Free Solders Undergoing Strain-Enhanced Microstructural Coarsening: A First Report," Journal of Electronic Materials, vol. 32 no. 4, pp. 201-207, Apr. 2003.

Dutta, I., Burkhard, M., Kuwano, S., Fujita, T., and Chen, M. W., "Correlation between surface whisker growth and interfacial precipitation in aluminum thin films on silicon substrates," Journal of Materials Science , vol. 45 no. 12 pp. 3367-3374, June 2010.

Dutta, I., Park, C., and Choi, S., "Creep and Microstructural Evolution in Lead=Free Microelectronic Solder Joints," Advances in Electronic Packaging 2003, Volume 1, Maui, Hawaii, July 6-11, 2003, pp. 417-422.

Dutta, I., Pan, D., Jadhav, S., and Mahajan, R., "Creep Behavior of Lead Free Solder Interconnects in Microelectronic Packages: Impression Creep Testing and Constitutive Modeling," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B, San Francisco, CA, July 17-22, 2005, pp. 1299-1306.

Dutta, I., Majumdar, B. S., Pan, D., Horton, W. S., Wright, W., and Wang, Z. X., "Development of a Novel Adaptive Lead-Free Solder Containing Reinforcements Displaying the Shape-Memory Effect," Journal of Electronic Materials , vol. 33 no. 4, pp. 258-270, Apr. 2004.

Dutta, I., Pan, D., and Jadhav, S., "Impression Creep Testing and Microstructurally Adaptive Creep Modeling of Lead Free Solder Interconnects," Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, Apr. 18-20, 2005, pp. 641-647.

Dutta, I., Raj, R., Kumar, P., Chen, T., Nagaraj, C. M., Liu, J., Renavikar, M., and Wakharkar, V., "Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications," Journal of Electronic Materials, vol. 38 no. 12, pp. 2735-2745, Dec. 2009.

Dutta, I., Kumar, P., and Subbarayan, G., "Microstructural Coarsening in Sn-Ag-based Solders and Its Effects on Mechanical Properties," JOM, vol. 61 no. 6, pp. 29-38, June 2009.

Dutta, I., Raj, R., Suh, D., and Wakharkar, V., "Novel Liquid Phase Sintered Sn-In Solders with Tailorable Properties for Thermal Interface Material and Interconnect Applications," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 365-369.

Dutta, I., Pan, D., Ma, S., Majumdar, B. S., and Harris, S., "Role of Shape-memory Alloy Reinforcements on Strain Evolution in Lead-free Solder Joints," Journal of Electronic Materials, vol. 35 no. 10, pp. 1902-1913, Oct. 2006.

Dutta, Indranath, Majumdar, Bhaskar S., Chen, Tiandan, Chung, Koh Choon, and Ye, Bing, "Smart Lead-Free Solders via Shape-Memory Alloy Reinforcement," Advanced Electronic Packaging (Materials Research Society Symposium Proceedings Volume 968), Boston, MA, Nov. 27-30, 2006, pp. 57-62.

Dutta, P., Eberhard, J. W., and Horn, P. M., "1/f Noise in Copper Whiskers," Solid State Communications, vol. 21 no. 7, pp. 679-681, Feb. 1977.

Duzgun, B., Ekinci, A. E., Karaman, I., and Ucar, N., "Investigation of Dislocation Movements and Deformation Characteristics in b-Sn Single Crystals," Journal of the Mechanical Behavior of Materials , vol. 10 no. 3, pp. 187-203, 1999.

Dwivedy, Maheshwar, and Mittal, R. K., "An investigation into e-waste flows in India," Journal of Cleaner Production, vol. 37 no. x, pp. 229-242, 2012.

Dwuletzki, Heinz, "Copper wiredrawing lubricants - tribology, chemistry and technology," Wire Journal International, vol. 37 no. 11, pp. 67-71, Nov. 2004.

Dybkov, V. I., Khoruzha, V. G., Sidorko, V. R., Meleshevich, K. A., Samelyuk, A. V., Berry, D. C., and Barmak, K., "Interfacial interaction of solid cobalt with liquid Pb-free Sn-Bi-In-Zn-Sb soldering alloys," Journal of Materials Science, vol. 44 no. 22, pp. 5960-5979, Nov. 2009.

Dybkov, V. I., Khoruzha, V. G., Sidorko, V. R., Meleshevich, K. A., Samelyuk, A. V., Berry, D. C., and Barmak, K., "Interfacial interaction of solid nickel with liquid Pb-free Sn-Bi-In-Zn-Sb soldering alloys," Journal of Alloys and Compounds, vol. 460 no. 1-2, pp. 337-352, July 28, 2008.

Dybkov, V. I., "The Growth Kinetics of Intermetallic Layers at the Interface of a Solid Metal and a Liquid Solder," JOM, vol. 61 no. 1, pp. 76-79, Jan. 2009.

Dyson, B. F., Anthony, T. R., and Turnbull, D., "Interstitial Diffusion of Copper in Tin," Journal of Applied Physics , vol. 38 no. 8, pp. 3408, July 1, 1967.

Dziedzic, Asdrzej, and Graczyk, Izabela, "Lead-Free Solders and Isotropically Conductive Adhesives in Assembling of Silicon Solar Cells - Preliminary Results," 26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials, The High Tatras, Slovak Republic, May 8-11, 2003, pp. 127-132.

Dziurdzia, Barbara, Sobolewski, Maciej, and Mikolajek, Janusz, "Convection vs vapour phase reflow in LED and BGA assembly," Soldering & Surface Mount Technology, vol. 30 no. 2, pp. 87-99, 2018.

EEEE

Easow, Jeena Susan, and Selvaraju, T., "Unzipped catalytic activity of copper in realizing bimetallic Ag@Cu nanowires as a better amperometric H2O2 sensor," Electrochimica Acta, vol. 112, pp. 648-654, Dec. 1, 2013.

Eastman, L. F., Stall, R., Woodard, D., Dandekar, N., Wood, C. E. C., Shur, M. S., and Board, K., "Ballistic Electron Motion in GaAs at Room Temperature," IET Electronics Letters, vol. 16 no. 13, pp. 524-525, June 1980.

Eba, H., and Sakurai, Kenji, Pattern transition in Cu-Zn binary electrochemical deposition," Journal of Electroanalytical Chemistry, vol. 571 no. 2, pp. 149-158, Oct 1, 2004.

Ebersberger, Bernd, and Lee, Charles, "Cu Pillar Bumps as a Lead-Free Drop-in Replacement for Solder-Bumped, Flip-Chip Interconnects," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 59-66.

Ebersberger, Bernd, Bauer, Robert, and Alexa, Lars, "Qualification of SnAg Solder Bumps for Lead-Free Flip Chip Applications," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 683-691.

Ebersberger, Bernd, Bauer, Robert, and Alexa, Lars, "Reliability of Electroplated Lead-Free SnAg Bumps for Flip Chip Applications," Future Fab International, vol. 17, pp. xx-xx, June 21, 2004.

Ebersberger, Bernd, Bauer, Robert, and Alexa, Lars, "Reliability of Lead-Free SnAg Solder Bumps: Influence of Electromigration and Temperature," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 1407-1415.

Ebner, Karen, Demeo, Robert, Villiers, Janet, Goossens, Andrew, Mantoni, Daniel, and McCarthy, Lenna, "An Automated TIN WHISKER RISK ASSESSMENT Process Resulting in Significant Cost Savings," Printed Circuit Design and Fab/ Circuits Assembly , vol. 37 no. 2, pp. 46-49, Feb. 2020.

Eckermann, J., Mehmood, S., Davies, H. M., Lavery, N. P., Brown, S. G. R., Sienz, J., Jones, A., and Sommerfeld, P., "Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys," 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Wroclaw, Poland, Apr. 14-17, 2013, pp. xx-xx.

Echeverria, Guillermo, Santos, Daryl, Chouta, Prashant, and Shea, Chrys, "Effect of Lead-Free Assembly Processing on Solder Joint Voiding."

Eckermann, J., Mehmood, S., Davies, H. M., Lavery, N. P., Brown, S. G. R., Sienz, J., Jones, A., and Sommerfeld, P., "Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys," 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Wroclaw, Poland, Apr. 14-17, 2013, pp. xx-xx.

Eckermann, J., Mehmood, S., Davies, H. M., Lavery, N. P., Brown, S. G. R., Sienz, J., Jones, A., and Sommerfeld, P., "Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys," Microelectronics Reliability, vol. 54 no. 6-7, pp. 1235-1242, June-July 2014.

Eckert, A., "Organ pipes and tin pest," Materials and Corrosion, vol. 59 no. 3, pp. 254-260, Mar. 2008.

Eckert, Tilman, Kruger, Michael, Muller, Wolfgang H., Nissen, Nils F., and Reichl, Herbert, "Investigation of the Solder Joint Fatigue Life in Combined Vibration and Thermal Cycling Tests," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1209-1216.

Eckert, Tilman, Muller, Wolfgang H., Nissen, Nils F., and Reichl, Herbert, "Modeling Solder Joint Fatigue in Combined Environmental Reliability Tests with Concurrent Vibration and Thermal Cycling," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 712-718.

Eckert, Tilman, Tetzner, Kornelius, Bochow-Ness, Olaf, Muller, Wolfgang H., and Reichl, Herbert, "Sensitivity Analysis of Technological Fabrication Tolerances on the Lifetime of Flip-Chip Solder Joints," 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, Delft, Netherlands, Apr. 26-29, 2009, pp. xx-xx.

Eckert, Werner, "The traceability imperative in electronics manufacturing," Global SMT & Packaging, vol. 4 no. 10, pp. 10-14, Nov./Dec. 2004.

Eckles, William, and Frischauf, Rob, "Alternatives to the Hexavalent Chromates: An Evolution of Trivalent Chromate Technologies," Plating & Surface Finishing, vol. 94 no. 1, pp. 24-26, Jan. 2007.

Eckold, P., Niewa, R., and Hugel, W., "Texture of electrodeposited tin layers and its influence on their corrosion behavior," Microelectronics Reliability, vol. 54 no. 11, pp. 2578-2585, Nov. 2014.

Eckold, P., Sellers, M. S., Niewa, R., and Hugel, W., "The surface energies of b-Sn - A new concept for corrosion and whisker mitigation," Microelectronics Reliability, vol. 55 no. 12 pt. B, pp. 2799-2807, Dec. 2015.

Economou, Manthos, Banaynal, Ephigenie, and Skillman, Peter, "Journey from Environmental Compliance to Stewardship," Proceedings of the 2007 IEEE International Symposium on Electronics & the Environment , Orlando, FL, May 7-10, 2007, pp. 67-72.

Ecroignard, Lene, "E-waste legislation in South Africa," EngineerIT, pp. 47-49, Oct. 2006.

Eda, Kazuo, "Advanced Packaging and Substrate Technology Using Conductive Adhesives," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 144-151.

Edelson, Roger, "Au Update on RoHS," Conformity, vol. 12 no. 12, pp. 20-24, Dec. 2012.

Edelstein, Daniel L., "Copper," Minerals Yearbook: Volume I. -- Metals and Minerals , 2002.

Edenburn, David L., "The F40 Regulatory Database," Standardization News, vol. 34 no. 7, pp. 28-29, July 2006.

Edgar, Richard, "Immersion White Tin," Printed Circuit Fabrication, vol. 21 no. 12, pp. 38-41, Dec. 1998.

Edgar, Richard, "Immersion White Tin the Ideal Solderable Finish," 1998 Surface Mount International Conference Proceedings, San Jose, CA, Aug. 23-27, 1998, pp. 632-638.

Edgar, Richard, "New Applications & Production Usages of Immersion White Tin In the Fabrication of Printed Wiring Boards," Proceedings of AESF SUR/FIN , Minneapolis, MN, June 22-25, 1998, pp. 29-39.

Edson, Larry, "Lead-Free Solder and the Automobile," Hobbs Engineering, Nov. 2004.

Edstrom, Adam, and Wallin, Lars, "Swedish Electronics Industry Furious Over WEEE Environmental Fees," IPC Review, vol. 48 no. 9, pp. 12, Oct./Nov. 2007.

Edwards, P. L., and Svager, A., "Spiral Copper Whiskers," Journal of Applied Physics, vol. 35 no. 2, pp. 421-423, Feb. 1964.

Egashira, M., Yoshida, Y., and Kawasumi, S., "Gas Sensing Characteristics of Tin Oxide Whiskers," Sensors and Actuators, vol. 9 no. 2, pp. 147-155, April 1986.

Egedy, Attila, Fogarasi, Szabolcs, Varga, Tamas, Imre-Lucaci, Arpad, and Chovan, Tibor, "CFD models in the development of electrical waste recycling technologies," Clean Technologies and Environmental Policy, vol. 16 no. 7, pp. 1255-1263, Oct. 2014.

Egelkraut, S., Frey, L., Knoerr, M., and Schletz, A., "Evolution of Shear Strength and Microstructure of Die Bonding Technologies for High Temperature Applications during Thermal Aging," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 660-667.

Egli, Andre, and Stuetz, Andy, "Bleifreies Glanzzinn fur Trommel- und Gestellapplikationen," Oberflachen Polysurfaces, vol. 45 no. 3, pp. 6-10, June 2004.

Egli, Andre, Zhang, Wan, and Schwager, Felix, "New Approaches to Whisker Free Tin Deposits," 2003 5th Conference on Electronics Packaging Technology, Dec 10-12, 2003, pp. 55-58.

Egloff, E. Ralph, "Solving Some Sticky Problems with PTF Conductive Adhesives," Proceedings of the Technical Program NEPCON West '96, Volume 2, Anaheim, CA, Feb. 25-29, 1996, pp. 805-812.

Eguchi, Toyoaki, Nakamura, Jun, and Osaka, Toshiaki, "Structure and Electronic States of the a-Sn(111)-(2x2) Surface," Journal of the Physical Society of Japan, vol. 67 no 2, pp. 381-384, Feb. 1998.

Ehlert, Michael R., Barnwell, Peter, Schmidt, Ronald H., and Therriault, Phillip C., "Secure Attachment in Pulsed Power Applications," Advancing Microelectronics, vol. 35 no. 2, pp. 10-12, Mar./Apr. 2008.

Ehrhardt, Christian, Hutter, Matthias, Oppermann, Hermann, and Lang, Klaus-Dieter, "A Lead Free Joining Technology for High Temperature Interconnects Using Transient Liquid Phase Soldering (TLPS)," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 1321-1327.

Ehrler, Sylvia, "Compatibility of Epoxy-based PCBs to Lead-Free Assembly," CircuiTree, vol. 18 no. 6, pp. 30-42, June 2005.

Ehrler, Sylvia, "Properties of new printed circuit board base materials," Circuit World , vol. 28 no. 4, pp. 38-45, 2002.

Ehrler, Sylvia, "The compatibility of epoxy-based printed circuit boards with lead-free assembly," Circuit World, vol. 31 no. 4, p. 3-13, 2005.

Eichfeld, Sarah M., Shen, Haoting, Eichfeld, Chad M., Mohney, Suzanne E., Dickey, Elizabeth C., and Redwing, Joan M., "Gas phase equilibrium limitations on the vapor-liquid-solid growth of epitaxial silicon nanowires using SiCl4," Journal of Materials Research , vol. 26 no. 17, pp. 2207-2214, Sept. 14, 2011.

Eichinger, Eric, Osborne, Joseph, and Van Cleave, Thomas, "Hexavalent Chromium Elimination: An Aerospace Industry Progress Report," Metal Finishing, vol. 95 no. 3, pp. 36, 38, 40-41, Mar. 1997.

Eid, E. A., Fouda, A. N., and Duraia, El-Shazly M., "Effect of adding 0.5 wt% ZnO nanoparticles, temperature and strain rate on tensile properties of Sn-5.0 wt% Sb-0.5 wt% Cu (SSC505) lead free solder alloy," Materials Science and Engineering: A, vol. 657, pp. 104-114, Mar. 7, 2016.

Eid, E. A., Deghady, A. M., and Fouda, A. N., "Enhanced Microstructural, Thermal and Tensile Characteristics of Heat Treated Sn-5.0Sb-0.3Cu (SSC-503) Pb-free Solder Alloy under High Pressure," Materials Science and Engineering: A, Structural Materials, vol. 743, pp. 726-732, Jan. 16, 2019.

Eid, E. A., El-Khawas, E. H., and Abd-Elrahman, Ashraf S., "Impact of Sb additives on solidification performance, microstructure enhancement and tensile characteristics of Sn-6.5Zn-0.3Cu Pb-free solder alloy," Journal of Materials Science: Materials in Electronics, vol. 30 no. 7, pp. 6507-6518, Apr. 2019.

Eid, E. A., El-Basaty, A. B., Deghady, A. M., Kaytbay, Saleh, and Nassar, Abbass, "Influence of nano-metric Al2O3 particles addition on thermal behavior, microstructural and tensile characteristics of hypoeutectic Sn-5.0Zn-0.3Cu Pb-free solder alloy," Journal of Materials Science: Materials in Electronics, vol. 30 no. 4, pp. 4326-4335, Feb. 2019.

Eikelboom, D. W. K., Bultman, J. H., Schonecker, A., Meuwissen, M. H. H., van den Nieuwenhof, M. A. J. C., and Meier, D. L., "Conductive Adhesives for Low-Stress Interconnection of Thin Back-Contact Solar Cells," IEEE Conference Record of the Twenty-Ninth Photovoltaic Specialists Conference, May 19-24, 2002, pp. 403-406.

Eiselstein, L. E., Proctor, D. M., and Flowers, T. C., "Trivalent and Hexavalent Chromium Issues in Medical Implants," Materials Science Forum, vol. 539-543 part 1, pp. 698-703, 2007.

Eiselt, Primoz, Ziger, Peter, Rogelj, Igor, and Hauer, Willy, "Dry, chemical-free surface treatment in continuous copper-alloy production," Wire Journal International, vol. 43 no. 8, pp. 80-84, Aug. 2010.

Eisenbarth, M., and Feldmann, K., "Pressfit Technology for 3-D Molded Interconnect Devices (MID) -A Lead-free Alternative to Solder Joints -Challenges and Solutions Concepts," Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium, San Jose, CA, July 17-18, 2002, pp. 238-244.

Eisenberg, Bart, "Planning the End of Product Life," Product Design & Development , pp. 16-17, Oct. 2005.

Eisner, R. L., "Tensile Tests on Silicon Whiskers," Acta Metallurgica, vol. 3 no. 4, pp. 414-415, July 1955.

Ejiri, Yoshinori, Sakurai, Takehisa, Hatakeyama, Shuuichi, Arike, Shigeharu, and Hasegawa, Kiyoshi, "Electroless Ni-P/Pd/Au Plating for High Density Semiconductor Package Substrates," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 704-709.

Ejiri, Yoshinori, Sakurai, Takehisa, Hatakeyama, Shuuichi, Arike, Shigeharu, and Hasegawa, Kiyoshi, "Electroless Ni/Pd/Au Plating for Package Substrates with Fine Pitch Wiring," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 879-886.

Ejiri, Yoshinori, Sakurai, Takehisa, Hatakeyama, Shuuichi, Arike, Shigeharu, and Hasegawa, Kiyoshi, "Electroless Ni/Pd/Au Plating for Package Substrates with Fine Pitch Wiring," SMTAnews & Journal of Surface Mount Technology, vol. 22 no. 4, pp. 22-28, Oct.-Dec. 2009.

Ejiri, Yoshinori, Sakurai, Takehisa, Arayama, Yoshinori, Tsubomatsu, Yoshiaki, and Hasegawa, Kiyoshi, "Influence of Electroless Pd Plating Film Thickness on Solder Ball Joint Reliability," Pan Pacific Symposium 2018 Proceedings, Kamuela, HI, Feb. 5-8, 2018, pp. xx-xx.

Ejiri, Yoshinori, Sakurai, Takehisa, Arayama, Yoshinori, Tsubomatsu, Yoshiaki, and Hasegawa, Kiyoshi, "Influence of Electroless Pd Plating Film Thickness on Solder Joint Relibility of ENEPIG," SMTA Journal, vol. 31 no. 1, pp. 25-32, 2018.

Ejiri, Yoshinori, Noudou, Takaaki, Sakurai, Takehisa, Arayama, Yoshinori, Tsubomatsu, Yoshiaki, and Hasegawa, Kiyoshi, "Influence of Surface Finishes and Solder Alloys on Solder Ball Joint Reliability," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 957-971.

Ejiri, Yoshinori, Sakurai, Takehisa, Arayama, Yoshinori, Tsubomatsu, Yoshiaki, Akai, Kunihiko, Nakagawa, Masashi, and Hasegawa, Kiyoshi, "Pb Free Solder Joint Reliability of Various Surface Finishes," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 1005-1013.

Ejiri, Yoshinori, Sakurai, Takehisa, Kunihiko, Akai, Sugimoto, Yasushi, Arayama, Yoshinori, Tsubomatsu, Yoshiaki, and Hasegawa, Kiyoshi, "Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating -Influence of Electroless Pd Deposition Reaction Process and Electroless Pd Film Thickness," SMTA Journal, vol. 30 no. 3, pp. 20-27, 2017.

Ejiri, Yoshinori, Sakurai, Takehisa, Arayama, Yoshinori, Tsubomatsu, Yoshiaki, and Hasegawa, Kiyoshi, "Solder Ball Joint Reliability with Electroless Ni/Pd/Au Planting- Influence of Electroless Pd Plating Film Thinkness," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 911-921.

Ejiri, Yoshinori, Sakurai, Takehisa, Arayama, Yoshinori, Tsubomatsu, Yoshiaki, and Hasegawa, Kiyoshi, "Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating- Influence of Electroless Pd Plating Film Thickness," Surface Mount Technology (SMT) , vol. 32 no. 1, pp. 54,56-63, Jan. 2017.

Ejiri, Yoshinori, Akai, Kunihiko, Sugimoto, Yasushi, and Hasegawa, Kiyoshi, "Solder Ball Joint Reliability With Electronics Ni/Pd/Au Plating-Influence Of Electroless Pd Deposition Reaction Process And Electroless PD Film Thickness," Pan Pacific Symposium 2017 Proceedings, Koloa, HI, Feb. 6-9, 2017, pp. xx-xx.

Ejiri, Yoshinori, Sakurai, Takehisa, Arayama, Yoshinori, Tsubomatsu, Yoshiaki, and Hasegawa, Kiyoshi, "Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating -Influence of Phosphorus Content and Thickness of Electroless Pd Plating Film," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 952-964.

Ekener-Petersen, Elisabeth, and Finnveden, Goran, "Potential hotspots identified by social LCA - part 1: a case study of a laptop computer," International Journal of Life Cycle Assessment, vol. xx no. xx, pp. xx-xx, xxxx.

Ekere, Ndy, "Lead-Free Soldering Research at EMERG, University of Greenwich," TMS, Nov. 5, 2007.

Eklin, Lauri, Kocabalkanli, Hudai, and Bodington, Juan Carlos, "Improving the 'rod to wire' chain - the UPCAST rod," Wire Journal International, vol. 37 no. 11, pp. 58-62, Nov. 2004.

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I., Mallik, Sabuj, and Otiaba, Kenny, "Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics," Microelectronics Reliability , vol. 54 no. 1, pp. 239-244, Jan. 2014.

Ekvall, Tomas, and Andrae, Anders S. G., "Attributional and Consequential Environmental Assessment of the Shift to Lead-Free Solders," International Journal of Life Cycle Assessment , vol. 11 no. 5, pp. 344-353, 2006.

El Amrani, A., Paradis, E., Danovitch, D., and Drouin, D., "Investigation of a Low-Cost Sequential Plating Based Process for Pb-free Bumping," 2018 7th Electronic System-Integration Technology Conference , Dresden, Germany, Sept. 18-21, 2018, pp. xx-xx.

El-Ashram, Tarek, and Shalaby, R. M., "Effect of Rapid Solidification and Small Additions of Zn and Bi on the Structure and Properties of Sn-Cu Eutectic Alloy," Journal of Electronic Materials, vol. 32 no. 2, pp. 212-215, Feb. 2002. (check this reference)

El-Ashram, Tarek, and Shalaby, R. M., "Effect of Rapid Solidification and Small Additions of Zn and Bi on the Structure and Properties of Sn-Cu Eutectic Alloy," Journal of Electronic Materials, vol. 34 no. 2, pp. 212-215, Feb. 2005.

El-Ashram, Tarek, and El-Said, A. S., "Modifications induced by swift heavy ions in rapidly solidified Sn-8.5Sb-5.5Cu alloy," Radiation Effects and Defects in Solids, vol. 166 no. 4, pp. 272-281, Apr. 2011.

El-Bahay, M. M., Mossalamy, M. E. El, Mahdy, M., and Bahgat, A. A., "Some mechanical properties of Sn-3.5 Ag eutectic alloy at different temperatures," Journal of Materials Science: Materials in Electronics , vol. 15 no. 8, pp. 519-526, Aug. 2004.

EL-Bahay, M. M., EL Mossalamy, M. E., Mahdy, M., and Bahgat, A. A., "Study of the mechanical and thermal properties of Sn-5 wt% Sb solder alloy at two annealing temperatures," Physica Status Solidi (a), vol. 198 no. 1, pp. 76-90, 2003. https://doi-org.ezproxy.uky.edu/10.1002/pssa.200306592

El Basaty, A. B., Deghady, A. M., and Eid, E. A., "Influence of small addition of antimony (Sb) on thermal behavior, microstructural and tensile properties of Sn-9.0Zn-0.5Al Pb-free solder alloy," Materials Science and Engineering: A, vol. 701, pp. 245-253, July 31, 2017.

Elbasiony, A. M. R., Zein El Abedin, S., and Endres, F., "Electrochemical synthesis of freestanding tin nanowires from ionic liquids," Journal of Solid State Electrochemistry, vol. 18 no. 4, pp. 951-957, Apr. 2014.

Elbaz, Maxime, "RoHS Compliance Strategies," Printed Circuit Design and Manufacture , vol. 22 no. 11, pp. 34, 36, Nov. 2005.

El-Bediwi, A. B., El-Bahay, M. M., and Kamal, M., "Correlation Study of Structural, Electrical and Mechanical Properties of Quenched Tin-Zinc-Cadmium Solder Alloys," Radiation Effects & Defects in Solids, vol. 159 no. 8-9, pp. 491-496, Aug./Sept. 2004.

El-Bediwi, A., Lashin, A. R., ; Mossa, M., and Kamal, M., "Indentation creep and mechanical properties of quaternary Sn-Sb based alloys," Materials Science and Engineering: A, vol. 528 no. 10/11, pp. 3568-3572, Apr. 2011.

El-Bediwi, Abu Bakr, and El-Bahay, M. M., "Influence of Silver on Structural, Electrical, Mechanical and Soldering Properties of Tin-Indium Based Alloys," Radiation Effects & Defects in Solids, vol. 159 no. 2, pp. 133-140, Feb. 2004.

Elbert, Jochen, "Is Nitrogen Necessary for Lead-Free?," Proceedings of the Technical Program NEPCON West 2000, Volume 2, Anaheim, CA, Feb. 29-Mar. 2, 2000, pp. 1149-1155.

El-Daly, A. A., and Ibrahiem, A. A., "Assessment of room-temperature short-term stress relaxation and strain relaxation with recovery in Sn-Bi lead-free solders solidified under rotating magnetic field," Journal of Alloys and Compounds, vol. 730, pp. 47-56, Jan. 5, 2018.

El-Daly, A. A., Mohamad, A. Z., Fawzy, A., and El-Taher, A. M., "Creep behavior of near-peritectic Sn-5Sb solders containing small amount of Ag and Cu," Materials Science and Engineering: A, vol. 528 no. 3, pp. 1055-1062, Jan. 25, 2011.

El-Daly, A. A., Swilem, Y., and Hammad, A. E., "Creep properties of Sn-Sb based lead-free solder alloys," Journal of Alloys and Compounds, vol. 471 no. 1-2, pp. 98-104, Mar. 5, 2009.

El-Daly, A. A., Radwan, N., El-Eizz, H. M. Abo, and Hamza, B. A., "Development and characterization of Sn-1.3Ag-0.7Cu solder bearing Zn for electronic packaging," Journal of Materials Science: Materials in Electronics, vol. 26 no. 11, pp. 8807-8818, Nov. 2015.

El-Daly, A. A., and Hammad, A. E., "Development of high strength Sn-0.7Cu solders with the addition of small amount of Ag and In," Journal of Alloys and Compounds, vol. xxx no. xx, pp. xx-xx, xxxx.

El-Daly, A. A., El-Taher, A. M., and Gouda, S., "Development of new multicomponent Sn-Ag-Cu-Bi lead-free solders for low-cost commercial electronic assembly," Journal of Alloys and Compounds, vol. 627, pp. 268-275, Apr. 5, 2015.

El-Daly, A. A., and Hammad, A. E., "Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn-9Zn lead-free solders," Materials Science and Engineering: A, vol. xx no. x pp. xx-xx, xxxx.

El-Daly, A. A., and Hammad, A. E., "Elastic properties and thermal behavior of Sn-Zn based lead-free solder alloys," Journal of Alloys and Compounds, vol. 505 no. 2, pp. 793-800, Sept. 3, 2010.

El-Daly, A. A., El-Taher, A. M., and Dalloul, T. R., "Improved creep resistance and thermal behavior of Ni-doped Sn-3.0Ag-0.5Cu lead-free solder," Journal of Alloys and Compounds, vol. 587, pp. 32-39, Feb. 25, 2014.

El-Daly, A., Eladly, S. A., Mohamed, Amal, Elmosalami, T. A., and Dawood, Mahmoud S., "Improvement of strength-ductility trade-off in a Sn-0.7Cu-0.2Ni lead-free solder alloys through Al-microalloying," Journal of Materials Science: Materials in Electronics, vol. 31 no. 11, pp. 8649-8661, June 2020.

El-Daly, A. A., and Ibrahiem, A. A., "Influence of rotating magnetic field on solidification microstructure and tensile properties of Sn-Bi lead-free solders," Microelectronics Reliability, vol. 81, pp. 352-361, Feb. 2018.

El-Daly, A. A., Hammad, A. E., Al-Ganainy, G. S., and Ragab, M., "Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn-Ag-Cu lead-free solders," Materials Science and Engineering: A, vol. 608, pp. 130-138, July 1, 2014.

El-Daly, A. A., Swilem, Y., and Hammad, A. E., "Influences of Ag and Au Additions on Structure and Tensile Strength of Sn-5Sb Lead Free Solder Alloy," Journal of Materials Science and Technology , vol. 24 no. 6, pp. 921-925, 2008.

El-Daly, A. A., Hammad, A. E., Al-Ganainy, G. S., and Ragab, M., "Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn-Ag-Cu lead-free solders," Materials Science and Engineering: A, vol. 608, pp. 130-138, July 1, 2014.

El-Daly, A. A., Zohdy, K. M., Abdo, M. A., and Eid, N. A. M., "Leveraging prior strain rates effect during stress relaxation of Sn-1.7Ag-0.7Cu lead-free alloys with microalloying of Te and Co for microelectronics applications," Journal of Materials Science: Materials in Electronics, vol. 30 no. 14, pp. 13757-13767, July 2019.

El-Daly, A. A., Fawzy, A., Mohamad, A. Z., and El-Taher, A. M., "Microstructural evolution and tensile properties of Sn-5Sb solder alloy containing small amount of Ag and Cu," Journal of Alloys and Compounds , vol. 509 no. 13, pp. 4574-4582, Mar. 31, 2011.

El-Daly, A. A., El-Hosainy, H., Elmosalami, T. A., and Desoky, W. M., "Microstructural modifications and properties of low-Ag-content Sn-Ag-Cu solder joints induced by Zn alloying," Journal of Alloys and Compounds , vol. 653, pp. 402-410, Dec. 25, 2015.

El-Daly, A. A., Fawzy, A., Mansour, S. F., and Younis, M. J., "Novel SiC nanoparticles-containing Sn-1.0Ag-0.5Cu solder with good drop impact performance," Materials Science and Engineering: A, vol. 578, pp. 62-71, Aug. 20, 2013.

El-Daly, A. A., Hammad, A. E., Al-Ganainy, G. S., and Ragab, M., "Properties enhancement of low Ag-content Sn-Ag-Cu lead-free solders containing small amount of Zn," Journal of Alloys and Compounds, vol. 614, pp. 20-28, Nov. 25, 2014.

El-Daly, A. A., Hashem, H. A., Radwan, N., El-Tantawy, F., Dalloul, T. R., Mansour, N. A., Abd-Elmoniem, H. M., and Lotfy, E. H., "Robust effects of Bi doping on microstructure development and mechanical properties of hypoeutectic Sn-6.5Zn solder alloy," Journal of Materials Science: Materials in Electronics, vol. 27 no. 3, pp. 2950-2962, Mar. 2016.

El-Daly, A. A., El-Tantawy, Farid, Hammad, A. E., Gaafar, M. S., El-Mossalamy, E. H., and Al-Ghamdi, A. A., "Structural and elastic properties of eutectic Sn-Cu lead-free solder alloy containing small amount of Ag and In," Journal of Alloys and Compounds , vol. 509 no. 26, pp. 7238-7246, June 30, 2011.

El-Daly, A. A., Elmosalami, T. A., Desoky, W. M., El-Shaarawy, M. G., and Abdraboh, A. M., "Tensile deformation behavior and melting property of nano-sized ZnO particles reinforced Sn-3.0Ag-0.5Cu lead-free solder," Materials Science and Engineering: A, vol. 618, pp. 389-397, Nov. 17, 2014.

El-Daly, A. A., and Ibrahiem, A. A., "The role of delayed elasticity and stress relaxation in Sn-Bi-Cu lead-free solders solidified under permanent magnet stirring," Journal of Alloys and Compounds, vol. 740, pp. 801-809, Apr. 5, 2018.

El-Daly, A. A., Fawzy, A., Mansour, S. F., and Younis, M. J., "Thermal analysis and mechanical properties of Sn-1.0Ag-0.5Cu solder alloy after modification with SiC nano-sized particles," Journal of Materials Science: Materials in Electronics, vol. 24 no. 8, pp. 2976-2988, Aug. 2013.

El-Daly, A. A., Swilem, Y., Makled, M. H., El-Shaarawy, M. G., and Abdraboh, A. M., "Thermal and mechanical properties of Sn-Zn-Bi lead-free solder alloys," Journal of Alloys and Compounds, vol. 484 no. 1-2, pp. 134-142, Sept. 18, 2009.

El-Daly, A. A., Ibrahiem, A. A., Abdo, M. A., and Eid, N. A. M., "Viscoplastic characterization and mechanical strength of novel Sn-1.7Ag-0.7Cu lead-free solder alloys with microalloying of Te and Co," Journal of Materials Science: Materials in Electronics, vol. 30 no. 14, pp. 12937-12949, July 2019.

Elduque, Daniel, Javierre, Carlos, Pina, Carmelo, Martinez, Eduardo, and Jimenez, Emilio, "Life cycle assessment of a domestic induction hob: electronic boards," Journal of Cleaner Production, vol. 76, pp. 74-84, Aug. 1, 2014.

Elenius, Peter, "Flex on Cap - Solder Paste Bumping," 1997 Proceedings 47th Electronic Components & Technology Conference, San Jose, CA, May 18-21, 1997, pp. 248-253.

Elenius, Peter, Leal, Jim, Ney, Joe, Stepniak, Dave, and Yeh, Shing, "Recent Advances in Flip Chip Wafer Bumping using Solder Paste Technology," 1999 Proceedings 49th Electronic Components & Technology Conference , San Diego, CA, June 1-4, 1999, pp. 260-265.

Elger, Gordon, Kandaswamy, Shri Vishnu, Liu, E., Hanss, Alexander, Schmid, Maximilian, Derix, Robert, and Conti, Fosca, "Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations," Microelectronics Journal, vol. 46 no. 12 part A, pp. 1230-1238, Dec. 2015.

Elger, Gordon, Lauterbach, Reinhard, Dankwart, Kurt, and Zilkens, Christopher, "Inline Thermal Transient Testing of High Power LED Modules for Solder Joint Quality Control," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1649-1656.

El-Hindi, Lawrence, "Efficient filtration for nonferrous wire annealing and quench solution," Wire Journal International, vol. 38 no. 5, pp. 55-59, May 2005.

Eliason, Pam, "Making the Switch from Hex to Tri," Products Finishing, vol. 78 no. 8, pp. 16-20,22, May 2014.

Elkington, John, and Lee, Mark, "WEEE Are the World," grist, Sept. 20, 2005.

Elliott, Louise, "Getting the Lead Out, Part 1," Desktop Engineering, vol. 11 no. 5, pp. 30-33, Jan. 2006.

Elliott, Louise, "Getting the Lead Out, Part 2," Desktop Engineering, vol. 11 no. 6, pp. 14, 17-18, 27, Feb. 2006.

Elliott, Mick, "Even spares are affected by RoHS," Electronics Weekly, Sept. 5, 2005.

Elliott, Mick, "RoHS rules will hit supply of non-compliant components," Electronics Weekly, May 12, 2006.

Elliott, Tom, "Free advice on WEEE and RoHS from Envirowise," ElectronicsWeekly.com, Aug. 17, 2005.

Ellis, Andre S., Johnson, Thomas M., and Bullen, Thomas D., "Chromium Isotopes and the Fate of Hexavalent Chromium in the Environment," Science, vol. 295 no. 5562, pp. 2060-2062, Mar. 15, 2002.

Ellis, Brian, "And, in the last analysis, he is on the side of those with plenty of money," Soldering & Surface Mount Technology, vol. 18 no. 2, pp. xx-xx, 2006.

Ellis, Brian, "Environmental issues in electronics manufacturing: a review," Circuit World, vol. 26 no. 2, pp. 17-21, 2000.

Ellis, Brian, "If the law supposes that, the law is a ass - a idiot," Soldering & Surface Mount Technology, vol. 17 no. 4, pp. xx-xx, 2005.

Ellis, Brian, "Imagineless metal, too costly for cost?," Soldering & Surface Mount Technology, vol. 12 no. 2, pp. xx, 2000.

Ellis, Brian, "Internet commentary," Microelectronics International, vol. 23 no. 2, pp. xx-xx, 2006.

Ellis, Brian, "Internet commentary," Circuit World, vol. 32 no. 4, pp. xx-xx, 2006.

Ellis, Dirk, and Bixenman, Mike, "Applied Research for Optimizing Process: Parameters for Cleaning Pb-Free Flux Residue," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S08-02-1-S08-02-9.

Ellis, Dirk, "Hybrid Drying Technology for In-line Aqueous Cleaning of Lead-Free Assemblies," Speedline Technologies.

Ellis, Mark, "Driving sustainability," Materials World, vol. 16 no. 3, pp. 30-32, Mar. 2008.

Ellis, Tim, "Tin Whiskers," National Electronics Manufacturing Center of Excellence, Sept. 2003.

Ellis, Tim, "Tin Whiskers Part II," National Electronics Manufacturing Center of Excellence, Oct. 2003.

Ellis, Timothy W., "The Future of Gold in Electronics," Gold Bulletin, vol. 37 no. 1-2, pp. 68-71, June 2004.

Ellis, W. C., Gibbons, D. F., and Treuting, R. G., "Growth of Metal Whiskers from the Solid," Growth and Perfection of Crystals, Cooperstown, NY, Aug. 27-29, 1958, pp. 102-120. (Edited by Doremus, R. H., Roberts, B. W., and Turnbull, David.)

Ellis, W. C., "Morphology of Whisker Crystals of Tin, Zinc, and Cadmium Grown Spontaneously from the Solid," Transactions of the Metallurgical Society of AIME , vol. 236 no. xx, pp. 872-875, June 1966.

Ellis, W. C., "Whisker Crystals Grown from Solder Terminations in an Electrotransport Process," Journal of Crystal Growth, vol. 1 no. 4, pp. 204-206, Oct. 1967.

Ellison, Thomas, and Szabo, James, "RoHS Implementation Challenges," IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies, Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.

Ellison, Thomas, "Selecting RoHS-Compliant Components," Conformity, vol. 11 no. 11, pp. 52, 54-57, Nov. 2006.

Ellman, Brett, Zaluska, Alicja, and Taillefer, Louis, "Structural modulations in UPt3 single crystal whiskers," Physica. B: Condensed Matter , vol. 205 no. 3-4, pp. 346-348, Mar. 2, 1995.

Elmahfoudi, A., Furtauer, S., Sabbar, A., and Flandorfer, H., "Enthalpy of mixing of liquid systems for lead free soldering: Ni-Sb-Sn system," Thermochimica Acta, vol. 534, pp. 33-40, Apr. 20, 2012.

Elmer, J. W., and Mulay, R. P., "Superplastic creep of AuSn eutectic solder alloy," Scripta Materialia , vol. 120, pp. 14-18, July 15, 2016.

Elmer, John W., and Specht, Eliot D., "Measurement of Sn and In Solidification Undercooling and Lattice Expansion Using In Situ X-Ray Diffraction," Journal of Electronic Materials , vol. 40 no. 2, pp. 201-212, Feb. 2011.

Elmer, John W., Specht, Eliot D., and Kumar, Mukul, "Microstructure and In Situ Observations of Undercooling for Nucleation of b-Sn Relevant to Lead-Free Solder Alloys," Journal of Electronic Materials, vol. 39 no. 3, pp. 273-282, Mar. 2010.

Elmgren, Pete, Hilty, Robert, Moyer, Thomas, and Nitsche, Axel, "Lead-free Connector Collaboration Team."

Elmgrem, Pete, "Lead-Free Connectors -- An Overview," Molex, Aug. 15, 2003.

Elmgren, Pete, Dixon, Dan, Hilty, Robert, Moyer, Thomas, Lal, Sudarshan, Nitsche, Axel, and Teuber, Franz, "Pure Tin - The Finish of Choice for Connectors."

Elmgren, Pete, "Tin Whisker Formation on Lead-Free Coatings," Molex, Oct. 2002.

Elnyakov, Dmitry, Kalmykov, Konstantin, Tarelkin, Sergey, and Dunaev, Sergey, "Isothermal sections of Tm-Ag-Sn and Lu-Ag-Sn ternary systems at 873 K," Journal of Alloys and Compounds, vol. 688 pt. B, pp. 828-839, Dec. 15, 2016.

Elrefaey, A., Janczak-Rusch, J., and Koebel, M. M., "Direct glass-to-metal joining by simultaneous anodic bonding and soldering with activated liquid tin solder," Journal of Materials Processing Technology, vol. 214 no. 11, pp. 2716-2722, Nov. 2014.

El-Rehim, A. F. Abd, and Zahran, H. Y., "Effect of aging treatment on microstructure and creep behaviour of Sn-Ag and Sn-Ag-Bi solder alloys," Materials Science and Technology, vol. 30 no. 4, pp. 434-438, Apr. 2014.

El-Rehim, A.F. Abd, "Effect of structure transformation on the creep characteristics of Sn-3 wt% Bi alloy," Journal of Alloys and Compounds, vol. 440 no. 1-2, pp. 127-131, Aug. 16, 2007.

El-Rehim, A. F. Abd, and Zahran, H. Y., "Investigation of microstructure and mechanical properties of Sn-xCu solder alloys," Journal of Alloys and Compounds, vol. 695, pp. 3666-3673, Feb. 25, 2017.

El-Rehim, A. F. Abd, Zahran, H. Y., and Yassin, A. M., "Microstructure evolution and tensile creep behavior of Sn-0.7Cu lead-free solder reinforced with ZnO nanoparticles," Journal of Materials Science: Materials in Electronics, vol. 30 no. 3, pp. 2213-2223, Feb. 2019.

El Rehim. S. S. Abd, Sayyah, S. M., and El Deeb, M. M., "Electroplating of Tin From Acidic Gluconate Baths," Plating & Surface Finishing, vol. 87 no. 9, pp. 93-98, Sept. 2000.

El Rehim, Sayed S. Abd, Ibrahim, Magdy A. M., and Dankeria, Marwan M., "Thin Films of Chromium Electrodeposition from Trivalent Chromium Electrolyte," Transactions of the Institute of Metal Finishing, vol. 80 no. 1, pp. 29-33, Jan. 2002.

El-Salam, F. Abd, Nada, R. H., El-Khalek, A. M. Abd, Nagy, M. R., and El-Hasaab, R. Abd, "Effect of alloying on the structural properties of Sn-based alloys," Materials Science and Engineering: A, vol. 527 no. 12 pp. 2962-2968, May 15, 2010.

El-Salam, F. Abd, Nada, R. H., and El-Khalek, A. M. Abd, "Effect of Cu additions on the structural and mechanical properties of Sn-Zn alloy," Materials Science and Engineering: A, vol. 448 no. 1-2, pp. 171-176, Mar. 15, 2007.

El-Salam, F. Abd, El-Khalek, A. M. Abd, and Nada, R. H., "Study of the structural and mechanical properties of Sn-8.6 wt.% Zn alloys using creep measurements," Materials Science and Engineering: A, vol. 460-461, pp. 14-19, July 15, 2007.

El-Salam, F. Abd, El-Khalek, A. M. Abd, Nada, R. H., Nagy, M. R., and El-Haseeb, R. Abd, "Thermally induced variations in structural and mechanical properties of rapid solidified Tin-based alloys," Materials Science and Engineering: A , vol. 506 no. 1-2, pp. 135-140, Apr. 25, 2009.

El-Sayed, Abdel-Rahman, Shaker, Ali M., and El-Lateef, Hany M. Abd, "Corrosion inhibition of tin, indium and tin-indium alloys by adenine or adenosine in hydrochloric acid solution," Corrosion Science, vol. 52 no. 1, pp. 72-81, Jan. 2010.

El-Sharif, M., Ma, S., Chisholm, C. U., and Watson, A., "Effect of Agitation on Electrodeposition of Chromium from Chromium(III) Based Electrolyte," Proceedings of The International Technical Conference of AESF SUR/FIN, Anaheim, CA, June 21-24, 1993, pp. 451-460.

El-Sharif, M., McDougall, J., and Chisholm, C. U., "Electrodeposition of Thick Chromium Coatings from an Environmentally Acceptable Chromium (III)-Glycine Complex," Transactions of the Institute of Metal Finishing, vol. 77 no. 4, pp. 139-144, July 1999.

El-Sharif, M., "Environmental Gains in High Speed Chromium Plating from Chromium (III) Electrolytes Using Advanced Process Technology," 18th AESF/EPA Pollution Prevention and Control Conference, Orlando, FL, Jan. 27-29, 1997, pp. 143-150.

El-Sharif, M., Ma, S., and Chisholm, C. U., "Environmentally Acceptable Process for Electrodeposition of Hard Chromium From Chromium (III) Electrolyte," Transactions of the Institute of Metal Finishing, vol. 73 no. 1, pp. 19-25, Feb. 1995.

El-Sharif, M., "Environmentally Friendly Conversion Treatment for Electrodeposited Zinc Coatings," 18th AESF/EPA Pollution Prevention and Control Conference , Orlando, FL, Jan. 27-29, 1997, pp. 151-159.

El-Sharif, M., "Replacing Hexavalent Chromium in Electroplating," Transactions of the Institute of Metal Finishing, vol. 75 no. 6, pp. B143-B146, Nov. 1997.

Elshkaki, Ayman, Van der Voet, Ester, Van Holderbeke, Mirja, and Timmermans, Veerle, "The environmental and economic consequences of the developments of lead stocks in the Dutch economic system," Resources, Conservation, and Recycling, vol. 42 no. 2, pp. 133-154, Sept. 2004.

El-Taher, A. M., Azeem, S. E. Abd El, and Ibrahiem, A. A., "Influence of permanent magnet stirring on dendrite morphological and elastic properties of a novel Sn-Ag-Cu-Sb-Al solder alloy by ultrasonic pulse echo method," Journal of Materials Science: Materials in Electronics, vol. 31 no. 12, pp. 9630-9640, June 2020.

El-Taher, A. M., Ibrahiem, A. A., and Razzk, A. F., "Viscoplastic characterization of novel (Fe, Co, Te)/Bi containing Sn-3.0Ag-0.7Cu lead-free solder alloy," Journal of Materials Science: Materials in Electronics, vol. 31 no. 7, pp. 5521-5532, Apr. 2020.

Ema, Tomiyo, "Joint Technology of FPC and FPC Which Uses ACF," 2004 Pan Pacific Symposium Conference Proceedings, Kahuku, Oahu, Hawaii, Feb. 10-12, 2004, pp. xx-xx.

Emenheiser, Matthew S., "BGA Connectors offer benefits in midplane and backplane applications," Connector Specifier, vol. 19 no. 5, pp. xx-xx, May 2003.

Emira, H. S., and Abdel-Mohsen, F. F., "The dependence of the corrosion protection of water-borne paints on the concentration of the anticorrosive pigment," Pigment & Resin Technology, vol. 32 no. 4, pp. 259-265, 2003.

Endicott, Duane W., and Kisner, Kim T., "A Proposed Mechanism for Metallic Whisker Growth," Proceedings of the 71st American Electroplaters Society SUR/FIN '84, New York, NY, July 16-19, 1984, Session J - Electronics I, pp. 1-20.

Endicott, Duane W., and Kisner, Kim T., "A Proposed Mechanish for Metallic Whisker Growth," The 71st AES Annual Technical Conference Proceedings, New York, NY, July 1984, session J-5 pp. 1-20.

Endicott, Duane W., "The Challenge of a Lead-Free Finish for Semiconductor Pins," Metal Finishing, vol. 95 no. 1, pp. 50-54, Jan. 1997.

Endo, M, Higuchi, S., Tokuda, Y., and Sakabe, Y., "Elimination of Whisker Growth on Tin Plated Electrodes", Proceedings of the 23rd International symposium for Testing and Failure Analysis, Santa Clara, CA, Oct. 27-31, 1997, pp. 305-311.

Endres, Frank, "Freestanding metal nanowires and macroporous materials from ionic liquids for battery applications," MRS Bulletin, vol. 38 no. 7, pp. 567-571, July 2013.

Eng, G., Gutierrez, D. A., Hoskinson, C. T., Tueling, M. B., and Stupian, G. W., "Review of Aerospace pre- and post-Project 1998 Tin Whisker Work," The Aerospace Corporation, Apr. 30, 2003.

Engel, Josh, Ernst, Larry, Goeppinger. Jim, Seeley, Todd, and Monsen, Monrad, "WEEE/RoHS Directives and Impacts on EMC Compliance," Mar. 14, 2006.

Engelhaupt, Darell, and Ramsey, Brian, "Electrodeposition of High Quality Nickel Phosphorous Alloys for Pollution Reduction and Energy Conservation," Proceedings 2004 AESF/EPA Conference for Environmental & Process Excellence, Orlando, FL, Jan. 26-29, 2004, pp. 200-215.

Engelmaier, Werner, "Achieving solder joint reliability in a lead-free world, part 1," Global SMT and Packaging, vol. 7 no. 6, pp. 40-42, June 2007.

Engelmaier, Werner, "Achieving solder joint reliability in a lead-free world, part 2," Global SMT and Packaging, vol. 7 no. 8, pp. 44-46, Aug. 2007.

Engelmaier, Werner, "Adequacy/correctness of accelerated reliability test databases for Pb-free solders," Global SMT and Packaging, vol. 11 no. 1, pp. 38,40, Jan. 2011.

Engelmaier, Werner, "Assuring Long-term Reliability of Surface Mount Solder Joints for Military Avionics (AVIP) Applicationa," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume I, San Jose, CA, Aug. 31-Sept. 2, 1993, pp. 376-384.

Engelmaier, Werner, "Creep-fatigue model for SAC405/305 solder joint reliability estimation - a proposal," Global SMT and Packaging, vol. 8 no. 12, pp. 46-48, Dec. 2008.

Engelmaier, Werner, "Enhancing the solder joint reliability of ceramic components for harsh conditions," Global SMT and Packaging, vol. 11 no. 5 pp. 44-46, May 2011.

Engelmaier, Werner, "Establishing Models for Reliability," Overcoming the Reliability Challenge: An IPC Summit, Andover, MA, Apr. 15, 2008, pp. xx-xx.

Engelmaier, Werner, "Fatigue and creep wearout failures in electronics-a historical retrospective," Global SMT and Packaging, vol. 9 no. 9, pp. 38-40, Sept. 2009.

Engelmaier, Werner, "Finite element analysis is a wonderful tool for complex situations, but ... Caveat!," Global SMT and Packaging, vol. 7 no. 5, pp. 52-53, May 2007.

Engelmaier, Werner, "Forum on reliability for Pb-free electronics," Global SMT and Packaging, vol. 8 no. 9, pp. 44-45,56, Sept. 2008.

Engelmaier, Werner, "Fundamentals of fatigue," Global SMT and Packaging, vol. 10 no. 8, pp. 36,38, Aug. 2010.

Engelmaier, Werner, "How to assure solder joint reliability with accelerated testing," Global SMT and Packaging, vol. 7 no. 11, pp. 62, 64-65, Nov. 2007.

Engelmaier, Werner, "How to estimate solder joint reliability, part 1," Global SMT and Packaging, vol. 7 no. 9, pp. 60, 62-64, Sept. 2007.

Engelmaier, Werner, "How to estimate solder joint reliability, part 2," Global SMT and Packaging, vol. 7 no. 10, pp. 64-66, Oct. 2007.

Engelmaier, Werner, "How to Specify PCBs to Reliably Survive RoHS-mandated Lead Free Soldering Processes," IPC Review, vol. 48 no. 7, pp. 17,22, Aug. 2007.

Engelmaier, Werner, "How to specify reliable PCBs for lead-free solder assembly," Global SMT and Packaging, vol. 6 no. 8, pp. 54-56, Sept. 2006.

Engelmaier, Werner, "How to specify reliable PCBs for lead-free solder assembly, part 2," Global SMT and Packaging, vol. 7 no. 1, pp. 64, 66, Jan. 2007.

Engelmaier, Werner, "Inadequate peak reflow temperatures: A real reliability issue with lead-free solders," Global SMT and Packaging, vol. 8 no. 6, pp. 38,40-41, June 2008.

Engelmaier, Werner, "Lead-free (LF) wave-soldering: Can (should) it be eliminated?," Global SMT & Packaging, vol. 5 no. 9, pp. 46-48, 50, Oct. 2005.

Engelmaier, Warner, "Nonfunctional lands: keep them vs. remove them," Global SMT and Packaging, vol. 6 no. 6, pp. 48, 50, June/July 2006.

Engelmaier, Werner, "On lead compliancy-how it works and how it does not work," Global SMT and Packaging, vol. 10 no. 3, pp. 36,38-39, Mar, 2010.

Engelmaier, Werner, "`Pad cratering' & `trace buckling'-new failure modes created by Pb-free soldering," Global SMT and Packaging, vol. 10 no. 4, pp. 36,38, Apr. 2010.

Engelmaier, Werner, "Pb-free solder creep-fatigue reliability models updated and extended," Global SMT and Packaging, vol. 9 no. 10, pp. 36,38-39, Oct. 2009.

Engelmaier, Werner, "Printed Circuit Board Reliability Issues," Route, Nov. 2005.

Engelmaier, Werner, "Printed circuit board reliability: Loss of life during soldering," Global SMT and Packaging, vol. 6 no. 9, pp. 46-47, Oct. 2006.

Engelmaier, Werner, "Printed circuit board reliability: Needed PCB design changes for lead-free soldering," Global SMT and Packaging, vol. 5 no. 8, pp. 41-42, 44, Sept. 2005.

Engelmaier, Werner, "Reliability of lead-free (LF) solder joints," Global SMT & Packaging, vol. 3 no. 3, pp. 36, 38, Apr. 2003.

Engelmaier, Werner, "Reliability of lead-free (LF) solder joints revisited," Global SMT & Packaging, vol. 3 no. 8, pp. 34-35, Nov. 2003.

Engelmaier, Werner, "Reliability Validation Through Accelerated Testing," Overcoming the Reliability Challenge: An IPC Summit, Andover, MA, Apr. 15, 2008, pp. xx-xx.

Engelmaier, Werner, "Solder Creep-Fatigue Model Parameters for SAC & SnAg Lead-Free Solder Joint Reliability Estimation," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S05_02-1-S05_02-8.

Engelmaier, Werner, "Solder Creep-Fatigue Model Parameters for SAC and SnAg Lead-Free Solder Joint Reliability Estimation," Journal of the Reliability Information Analysis Center, vol. 19 no. 2, pp. 18-19,22-25, July 2011.

Engelmaier, Werner, "Solder joint accelerated test reliability requirements - a bad example," Global SMT and Packaging, vol. 11 no. 4, pp. 72-74, Apr. 2011.

Engelmaier, Werner, "Solder joint embrittlement-it's not just gold," Global SMT and Packaging, vol. 11 no. 2 pp. 58-59,61, Feb. 2011.

Engelmaier, Werner, "Solder joint reliability: acceleration transforms and acceleration factors," Global SMT and Packaging, vol. 9 no. 8, pp. 42-43, Aug. 2009.

Engelmaier, Werner, "Solder joint reliability prediction for chip components, MELFs, TSOPs, SOTs, etc.," Global SMT and Packaging, vol. 9 no. 7, pp. 3032, July 2009.

Engelmaier, Werner, "Solder Joints in Electronics: Design for Reliability," Design & Reliability of Solders and Solder Interconnections, Orlando, FL, Feb. 10-13, 1997, pp. 9-19.

Engelmaier, W., "Surface Mount Solder Joint Long-term Reliability: Design, Testing, Prediction," Soldering & Surface Mount Technology, vol. 1 no. 1, pp. 14-22, 1989.

Engelmaier, Werner, "The case against ENIG," Global SMT and Packaging, vol. 7 no. 3, pp. 46-47, Mar. 2007.

Engelmaier, Werner, "The Fundamentals of Solder Joint Reliability," IPC Review, vol. 47 no. 11, pp. 18-19, Dec. 2006.

Engelmaier, Werner, "The Impact of Assembly, Rework and Repair on the Reliability of PCB Interconnect Structures," IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics, Raleigh, NC, Mar. 11-12, 2008, pp. xx-xx.

Engelmaier, Werner, "The Survival and Long-Term Reliability of Lead-Free PCBs," Printed Circuit Design and Fab, vol. 25 no. 1, pp. 22-26, Jan. 2008.

Engelmaier, Werner, "Thermal shock and solder joint reliability," Global SMT and Packaging, vol. 11 no. 3, pp. 66-67, Mar. 2011.

Engelmaier, Werner, "Update on lead-free solder joint reliability," Global SMT and Packaging, vol. 8 no. 8, pp. 46-49, Aug. 2008.

Engelmaier, Werner, "Voids in solder joint - reliability," Global SMT and Packaging , vol. 6 no. 5, pp. 44-45, May 2006.

Engelmaier, Werner, "White Paper: FAB Notes Recommendations for RoHS-Compliant Lead-Free-Capable PCBs," PCB007, May 25, 2006.

Enger, Helmut, "Finishing aluminium Plating on Aluminium," Finishing Industries, vol. 3 no. 11, pp. 28,30,32, Nov. 1979.

England, Luke, "A Comparison of Electroless and Electroplated Ni/Au UBM Structures for Board Level Reliability of WLCSP Devices," SMTA International Conference , San Diego, CA, Oct. 4-8, 2009, pp. 192-199.

England, Luke, Liu, Yong, Qian, Richard, and Kim, Ji-Hwan, "Solder Joint Reliability Analysis and Testing of a Dual Row QFN Package," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 130-136.

England, Luke, Liu, Yong, Qian, Richard, and Kim, Ji-Hwan, "Solder Joint Reliability Analysis and Testing of a Dual Row QFN Package," SMTAnews & Journal of Surface Mount Technology, vol. 23 no. 1, pp. 27-33, Jan.-Mar. 2010.

England, Luke, "Solder Joint Reliability Performance of Electroplated SnAg Mini-Bumps for WLCSP Applications," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 599-604.

Engleheart, G. H., Read, Charles H., and Gowland, William, "On some Buildings of the Romano-British Period discovered at Clanville, near Andover, and on a deposit of Pewter Vessels of the same period found at Appleshaw, Hants," Archaeologia: Or Miscellaneous Tracts Relating to Antiquity, vol. 56, pp. 1-20, 1899.

Engstrom, Daniel S., and Soh, Yeong-Ah, "Controlling the silicon nanowire tapering angle in dense arrays of silicon nanowires using deep reactive ion etching," Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol. 31 no. 2, pp. 021806-021806-4, Mar. 2013.

Enomoto, Takao, and Tsunoda, Mutsuharu, "The Ideal Solderable Copper Protective Silver Coating for PCB," 1st 1997 IEMT/IMC Symposium, Tokyo, Japan, Apr. 16-18, 1997, pp. 254-257.

Ensslen, Charlotte, Brandl, Christian, Richter, Gunther, Schwaiger, Ruth, and Kraft, Oliver, "Notch insensitive strength and ductility in gold nanowires," Acta Materialia, vol. 108, pp. 317-324, Apr. 15, 2016.

Eom, Yong-Sung, Baek, Ji-Won, Moon, Jong-Tae, Nam, Jae-Do, and Kim, Jong-Min, "Characterization of polymer matrix and low melting point solder for anisotropic conductive film," Microelectronic Engineering, vol. 85 no. 2, pp. 327-331, Feb. 2008.

Eom, Yong-Sung, Jang, Keonsoo, Moon, Jong-Tae, Nam, Jae-Do, and Kim, Jong-Min, "Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder," Microelectronic Engineering , vol. 85 no. 11, pp. 2202-2206, Nov. 2008.

Eom, Yong-Sung, Lee, Hak-Son, Bae, Hyun-Cheol, Choi, Kwang-Seong, and Lee, Jin-Ho, "Isotropic Conductive Paste based on Epoxy with Ag coated Cu and SAC305 Solder," 2015 European Microelectronics Packaging Conference, Friedrichshafen, Germany, Sept. 14-16, 2015, pp. xx-xx.

Eppensteiner, Fred W., and Jenkins, Melvin R., "Chromate Conversion Coatings," Metal Finishing, vol. 73 no. 9, pp. 29-34, 54, Sept. 1975.

Eppensteiner, Fred W., "Chromate Conversion Coatings," Metal Finishing, vol. 103 no. 6A, pp. 367-368, 370, 372-379, Summer 2005.

Eppensteiner, Fred W., and Jennkind, Melvin R., "Chromate Conversion Coatings," Metal Finishing, vol. 105 no. 10, pp. 413-424, Oct. 2007.

Erdmann, O. L., "Ueber eine merkwurdige Structurveranderung bleihaltigen Zinnes," Journal fur Praktische Chemie, vol. 52 no. 7, pp. 428-431, 1851. https://doi.org/10.1002/prac.18510520153

Erdogan, Ibrahim Y., and Demir, Umit, "Orentation-controlled synthesis and characterization of Bi2Te3 nanofilms, and nanowires via electrochemical co-deposition," Electrochimica Acta , vol. 56 no. 5, pp. 2385-2393, Feb. 1, 2011.

Erenturk, Burcin, Gurbuz, Serkan, Corbett, Rachel E., Claiborne, Sarah-Ann M., Krizan, Jason, Venkataraman, Dhandapani, and Carter, Kenneth R., "Formation of Crystalline Cadmium Selenide Nanowires," Chemistry of Materials, vol. 23 no. 14, pp. 3371-3376, July 26, 2011.

Erer, Ahmet Mustafa, and Oguz, Serkan, "Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systems," Soldering & Surface Mount Technology, vol. 32 no. 1, pp. 19-23, 2020.

Erickson, Curt, and Popelar, Scott, "Lead-free WLCSP Qualification," Advanced Packaging, vol. 14 no. 11, pp. 26-27, Nov. 2005.

Erickson, Curt, and Popelar, Scott, "Qualifying lead-free WLCSPs in a cell phone application," Green SupplyLine, Nov. 1, 2005.

Erickson, K. L., Hopkins, P. L., and Vianco, P. T., "Solid State Intermetallic Compound Growth Between Copper and High Temperature, Tin-Rich Solders- Part II: Modeling," Journal of Electronic Materials, vol. 23 no. 8, pp. 729-734, Aug. 1994.

Erickson, Kris, Donndelinger, Vince, and Ostrowski, Mitchell, "Building a "Reasonable Steps" Defense: Laboratory Testing," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 641-644.

Erickson, Kris, Donndelinger, Vince, and Ostrowski, Mitchell, "Building a 'Reasonable Steps' Defense: Laboratory Testing," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment , San Francisco, CA, May 8-11, 2006, pp. 331-335.

Ericson, Fredric, Kristensen, Nils, Schweitz, Jan-Ake, and Smith, Ulf, "A transmission electron microscopy study of hillocks in thin aluminum films," Journal of Vacuum Science & Technology B, vol. 9 no. 1, pp. 58-63, Jan./Feb. 1991.

Eriguchi, Fuyuki, Maeda, Masako, Asai, Fumiteru, and Hotta, Yuji, "Development of 0.025mm Pitch Anisotropic Conductive Film," Proceedings 1998 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 3582), San Diego, CA, Nov. 1-4, 1998, pp. 219-223.

Eriguchi, Fuyuki, Maeda, Masako, Asai, Fumiteru, Hotta, Yuji "Development of 0.025 mm pitch anisotropic conductive film International Journal of Microcircuits and Electronic Packaging, vol. 22 no. 1, First Quarter, 1999, pp. 38-42.

Eriksson, Bo, and Trankell, Richard, "Lead-free soldering of telecommunication network infrastructure products," IEEE International Symposium on Sustainable Systems and Technology , Phoenix, AZ, May 18-20, 2009, pp. xx-xx.

Erinc, M., Schreurs, P. J. G., and Geers, M. G. D., "A coupled numerical and experimental study on thermo-mechanical fatigue failure in SnAgCu solder joints," Proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, London, England, Apr. 15-18, 2007, pp. xx-xx.

Erinc, M., Schreurs, P. J., Zhang, G. Q., and Geers, M. G. D., "Characterization and fatigue damage simulation in SAC solder joints," Microelectronics Reliability, vol. 44, no. 9-11, pp. 1287-1292, Sept.-Nov. 2004.

Erinc, M., Assman, T. M., Schreurs, P. J. G., and Geers, M. G. D., "Fatigue fracture of SnAgCu solder joints by microstructural modeling," International Journal of Fracture, vol. 152 no. 1, pp. 37-49, July 2008.

Erinc, M., Schreurs, P. J. G., and Geers, M. G. D., "Impact of miniaturisation on solder joint reliability," International Journal of Materials and Structural Integrity, vol. 2 no. 1-2, pp. 35-46, June 2008. DOI: 10.1504/IJMSI.2008.018899

Erinc, M., Schreurs, P. J. G., and Geers, M. G. D., "Integrated numerical-experimental analysis of interfacial fatigue fracture in SnAgCu solder joints," International Journal of Solids & Structures , vol. 44 no. 17, pp. 5680-5694, Aug. 15, 2007.

Erinc, M., Schreurs, P. J. G., and Geers, M. G. D., "Intergranular thermal fatigue damage evolution in SnAgCu lead-free solder," Mechanics of Materials, vol. 40 no. 10, pp. 780-791, Oct. 2008.

Erinc, M., Schreurs, P. J. G., Zhang, G. Q., van Driel, W. D.,and Geers, M. G. D., "Microstructural and Mechanical Characterization of 95.5Sn-4Ag-0.5Cu Solder Balls by Nano-Indentation," Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, Brussels, Belgium, May 9-12, 2004, pp. 443-448.

Erinc, M., Schreurs, P. J. G., Zhang, G. Q., and Geers, M. G. D., "Microstructural damage analysis of SnAgCu solder joints and an assessment on indentation procedures," Journal of Materials Science: Materials in Electronics, vol. 16 no. 10, pp. 693-700, Oct. 2005.

Erinc, M., van Dijk, M., and Kouznetsova, V. G., "Multiscale modeling of residual stresses in isotropic conductive adhesives with nano-particles," Computational Materials Science, vol. 66, pp. 50-64, Jan. 2013.

Erinc, M., Schreurs, P. J. G., Zhang, G. Q., and Geers, M. G. D., "Reliability of SnAgCu Solder Balls in Packaging," Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, Apr. 18-20, 2005, pp. 656-660.

Erinc, M., van Dijk, M., and Kouznetsova, V. G., "Residual stresses in isotropic conductive adhesives with nano-Ag particles," 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Lisbon, Portugal, Apr. 16-18, 2012, pp. xx-xx.

Ernst, L. J., Xiao, A., Wunderle, B., Jansen, K. M. B., and Pape, H., "Interface Characterization and Failure Modeling for Semiconductor Packages," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 808-815.

Erts, D., Polyakov, B., Saks, E., Olin, H., Ryen, L., Ziegler, K., and Holmes, J. D., "Semiconducting Nanowires: Properties and Architectures," Solid State Phenomena, vol. 99-100, pp. 109-116, July 2004.

Ervina, Efzan M. N., and Singh, Amares, "Characterization of Mechanical Testing on Lead Free Solder on Electronic Application," 2012 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Nov. 6-8, 2012, pp. xx-xx.

Ervina Efzan, M. N., and Al Bakri Abdullah, Mohd Mustafa, "Effect of Thermal Aging on the Interfacial of Sn-Zn and Sn-Zn-Bi Solders Joint on Cu Substrate," Key Engineering Materials, vol. 700, pp. 113-122, July 2016.

Ervina Efzan, M. N., and Tan, S. Y., "Wettability of molten Sn-Zn-Bi solder on Cu Substrate Ervina Efzan," Applied Mechanics and Materials, vol. 315, pp. 675-680, Apr. 2013.

Esaka, H., Machida, J., Takamatsu, Y., and Shinozuka, K., "Relation between the Solidification Condition and Volume Fraction of Rod-Like Eutectic Cu6Sn5 Phase in the Eutectic Structure in Sn-Cu Alloys," Materials Transactions, vol. 56 no. 5, pp. 707-714, 2015.

Esaka, Hisao, Shinozuka, Kei, and Tamura, Manabu, "Evolution of Structure Unidirectionally Solidified Sn-Ag3Sn Eutectic Alloy," Materials Transactions, vol. 46 no. 5, pp. 916-921, May 2005.

Eschenberg, Axel, "AOI/AXI in the lead-free era," SMART Group Lead-Free Seminar, Shannon, Ireland, May 19, 2005.

Esfahani, M. Nasr, Yilmaz, Mustafa, Wollschlager, Nicole, Rangelow, Ivo W., Leblebici, Yusuf, and Alaca, B. Erdem, "Monolithic technology for silicon nanowires in high-topography architectures," Microelectronic Engineering, vol. 183-184, pp. 42-47, Nov. 5, 2017.

Esfahani, Mohammad Nasr, and Alaca, Burhanettin Erdem, "A Review on Size-Dependent Mechanical Properties of Nanowires," Advanced Engineering Materials, vol. 21 no. 8, pp. 1900192-1-1900192-23, Aug. 2019.

Esfahani, Mohammad Nasr, and Alaca, B. Erdem, "Surface Stress Effect on Silicon Nanowire Mechanical Behavior: Size and Orientation Dependence," Mechanics of Materials, vol. 127, pp. 112-123, Dec. 2018.

Eshelby, J. D., "A Tentative Theory of Metallic Whisker Growth," Physical Review, vol. 91 no. 3, pp. 755-776, Aug. 1, 1953. https://doi.org/10.1103/PhysRev.91.755.2

Eshelby, J. D., "Screw Dislocations in Thin Rods," Journal of Applied Physics, vol. 24 no. 2, pp. 176-179, Feb. 1953.

Eskin, S., Berkh, O., Rogalsky, G., and Zahavi, J., "Co-W Alloys for Replacement Of Conventional Hard Chromium," Plating & Surface Finishing, vol. 85 no. 4, pp. 79-84, Apr. 1998.

Essouda, Y., Fitouri, H., Boussaha, R., Elayech, N., Rebey, A., and El Jani, B., "Bismuth catalyzed growth of GaAsBi nanowires by metalorganic vapor phase epitaxy," Materials Letters, vol. 152, pp. 298-301, Aug. 1, 2015.

Estes, Richard H., "Polymer Flip Chip PfC(R) A Technology Assessment of Solderless Bump Processes and Reliability," Proceedings of the Technical Program NEPCON East '96 , Boston, MA, June 11-13, 1996, pp. 383-422.

Estes, Richard H., "Process and Reliability Characteristics of Polymer Flip Chip Assemblies Utilizing Stencil Printed Thermosets & Thermoplastics," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 229-239.

Estes, Richard S., "Solderless Flip Chip Bump Process Technology," 1995 Surface Mount International Conference Proceedings of the Technical Program, San Jose, CA, Aug. 29-31, 1995, pp. 156-.

Estes, Timothy A., "The Effect of Lead-Free Reflow Profiles on Through Via Reliability," IPC APEX/EXPO 2005, Anaheim, CA, Feb. 22-24, 2005, pp. xx-xx.

Estrada-Ayub, Jesus. A., and Kahhat, Ramzy, "Decision factors for e-waste in Northern Mexico: To waste or trade," Resources, Conservation and Recycling, vol. 86, pp. 93-106, May 2014.

Etienne, A., Cadel, E., Lina, A., Cretinon, L., and Pareige, P., "Micro- and Nanostructure of Zn Whiskers and Their Coating." Journal of Electronic Materials, vol. 42 no. 2, pp. 272-279, Feb. 2013.

Etienne, Auriane, Cadel, Emmanuel, Lina, Agnes, Cretinon, Laurent, and Pareige, Philippe, "Crystallographic Characterization of an Electroplated Zinc Coating Prone to Whiskers," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 11, pp. 1928-1932, Nov. 2012.

Etzion, M., Blech, I. A., and Komem, Y., "Study of conductive gold film lifetime under high current densities," Journal of Applied Physics, vol. 46 no. 4, pp. 1455-1458, Apr. 1975.

Eu, Poh-Leng, Ding, Min, Hoh, Huey-Jiun, Rayos, Joachim, Su, Peng, Lindsay, Wayne, Chopin, Sheila, and Ahmad, Ibrahim, "A Comparative Study of Sn3.5Ag and Sn3.8Ag0.7Cu for BGA Spheres on Ni/Au Finish," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1819-1824.

European Commission, Directorate General, Environment, "The EU's RoHS and WEEE Directives: Update to Frequently Asked Questions," Conformity, vol. 12 no. 3, pp. 28, 30-34, 36, 38-40, Mar. 2007.

Evans, C. J., "Developments in Tin-Lead Plating," ," Tin and its Uses, no. 92, pp. 8-11, 1972.

Evans, C. J., "Fusible Alloys for Industry," Tin and its Uses, no. 133, pp. 10-14, 1982.

Evans, C. J., "Tin-Nickel Plating of Electrical Instruments," Tin and its Uses, no. 95, pp. 12-14, 1973.

Evans, Colin J., "Automotive Parts," Tin and its Uses, no. 150, pp. 4-6, 1986.

Evans, Colin J., "Tin and Tin Alloy Coatings Today," Tin and its Uses, no. 142, pp. 13-16, 1984.

Evans, Colin J., "Tin-Rich Alloys as Capillary Plumbing Solders," Tin and its Uses , no. 148, pp. 12-15, 1986.

Evans, Dain Stedman, and Prince, Alan, "The Reaction of 80 wt.% Au - 20 wt.% Sn Solder Alloy with Gallium," Zeitschrift fur Metallkunde, vol. 87 no. 8, pp. 626-628, 1996.

Evans, David, "Getting the Lead Out," Aviation Today, vol. xx no. xx, pp. xx-xx.

Evans, Holly, and Johnson, Joe, "10 Steps Toward RoHS Directive Compliance," Circuits Assembly , vol. 16 no. 2, pp. 68-70, Feb. 2005.

Evans, Holly A., and Gordon, Pamela J., "Beyond the precautionary principle," Manufacturing Business Technology, vol. xx no. xx, pp. xx-xx, Jan. 2006.

Evans, Holly, "Building a "Due Diligence" Approach to Conflict Minerals Compliance: Can RoHS Provide a Model?," Surface Mount Technology (SMT), vol. 26 no. 3, pp. 30-32,34-35, Mar. 2011.

Evans, Holly, "Development of a "Systems Based" Compliance Approach to the European Union's RoHS Directive," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 634-637.

Evans, Holly, "Development of a "Systems Based" Compliance Approach to the European Union's RoHS Directive," SMTA Journal, vol. 19 no. 1, pp. 17-20, Jan.-Mar. 2006.

Evans, Holly, and Gedney, Ron, "Environmentally Conscious Electronics," Advanced Packaging, vol. xx no. xx, pp. xx-xx, Apr. 2001.

Evans, Holly, "Japanese switch to lead-free solders," Printed Circuit Fabrication , vol. 21 no. 8, pp. 58, Aug. 1998.

Evans, Holly, "The RoHS Recast: Are You Ready?," Surface Mount Technology (SMT) , vol. 27 no. 10, pp. 16-18,20,22,24-25, Oct. 2012.

Evans, Holly, "US Product-Related Environmental Restrictions for Electronic Products," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. xx-xx.

Evans, John L., Davis, Jared A., Crain, Elliott, Thompson, James R., and Seto, Ping, "Component Reliability on Metal-Backed Substrates for Harsh Automotive Environments," SMTA Journal, vol. 17 no. 4, pp. 24-33, Oct. 2004.

Evans, John L., Xie, Fei, Pai, Hung-chun, Vijayakumar, Namo, Cobb, Jeffery, Skamser, Dan, Hill, Allen, and Harry, Scott, "Impact of Component Termination on Conductive Adhesive Reliability for Harsh Environment Electronics," 2008 SMTA International Conference Proceedings , Orlando, FL, Aug. 17-21, 2008, pp. 832-838.

Evans, John L., "Impact of Long Term Aging of SAC Solder for Harsh Environment Applications," SMTA International 2010 Conference (Presentations), Orlando, FL, Oct. 24-28, 2010.

Evans, John L., Johnson, R. Wayne, Suhling, Jeff, Thompson, James R., and Seto, Ping, "Reliability of Next Generation Components and Substrates for Under-the-Hood Automotive Electronics," 2002 SMTA International Conference Proceedings , Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Evans, John L., Mitchell, Charles, Bozack, Michael, Payton, Lewis N., McQueeney, Michael R., and Thompson, James R., "Reliability of SAC BGA Using SnPb Paste for Harsh Environment Electronics," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 365-370.

Evans, John., McBride, Elliot, Mitchell, Charles, Bozack, Michael, and Du, Haibin H., "Reliability Testing of 9x9 QFN Packages with Internal Power for Harsh Environment Electronics," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Evans, Keenan, "ON Semiconductor and Halide Free Mold Compounds," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Evans, P. S. A., Harrey, P. M., Ramsey, B. J., and Harrison, D. J., "Component Attachment in Lithographic Film Circuits," 1999 IEEE/CPMT International Electronics Manufacturing Technology Symposium, Oct. 1-19, 1999, pp. 282-286.

Evans, Rich, "Analysis of the Effects of Tin Whiskers at High Frequencies," IEEE Transactions on Electronics Packaging Manufacturing, vol. 29 no. 4, pp. 274-279, Oct. 2006.

Eveloy, Valerie, Ganesan, Sanka, Fukuda, Yuki, Wu, Ji, and Pecht, Michael G., "Are You Ready for Lead-Free Electronics?," IEEE Transactions on Components and Packaging Technologies, vol. 28 no. 4, pp. 884-894, Dec. 2005.

Eveloy, Valerie, Ganesan, Sanka, Fukuda, Yuki, Wu, Ji, and Pecht, Michael G., "WEEE, RoHS, And What You Must Do To Get Ready For Lead-free Electronics," 2005 6th International Conference on Electronic Packaging Technology , Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Everaerts, J., Verlinden, B., and Wevers, M., "Internal fatigue crack initiation in drawn Ti-6Al-4V wires," Materials Science and Technology, vol. 32 no. 16, pp. 1639-1645, Nov. 2016.

Everett, Brian, "Ease REACH Compliance," Chemical Processing, Sept. 2010.

Evgenia, Povolotskaya, and Pavel, Mach, "Fuzzy Risk Analysis Approach Test-Case: Lead-Free Soldering Process," 2012 35th International Spring Seminar on Electronics Technology, Bad Aussee, Austria, May 9-13, 2012, pp. 260-265.

Evgeny, Gershman, and Sergey, Zhevnenko, "Grain Boundary Surface Tension, Segregation and Diffusion in Cu-Sn System," Diffusion and Defect Data. Pt A Defect and Diffusion Forum, vol. 264, pp. 39-46, 207.

Ewald, A. W., "Effect of Impurities on the Conductivity of Gray Tin," Physical Review, Second Series, vol. 94 no. 4, pp. 1428, May 15, 1954.

Ewald, A. W., and Tufte, O. N., "Electronic Properties of Gray Tin Single Crystals," Journal of Physics and Chemistry of Solids, vol. 8, pp. 523-525, Jan. 1959.

Ewald, A. W., "Germanium-Stabilized Gray Tin," Journal of Applied Physics, vol. 25 no. 11, pp. 1436-1437, Nov. 1954.

Ewald, A. W., and Tufte, O. N., "Gray Tin Single Crystals," Journal of Applied Physics, vol. 29 no. 7, pp. 1007-1009, July 1958.

Ewald, A. W., and Kohnke, E. E., "Measurements of Electrical Conductivity and Magnetoresistance of Gray Tin Filaments," Physical Review, Second Series, vol. 97 no. 3, pp. 607-613, Feb. 1, 1955.

Ewald, A. W., "Preparation of Gray Tin Filaments," Physical Review, Second Series , vol. 91 no. 1, pp. 244, July 1, 1953.

Ewald, Thomas D., Holle, Norbert, and Wolter, Klaus-Jurgen, "Void Formation During Reflow Soldering," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 1677-1683.

Ewald, Thomas D., Holle, Norbert, and Wolter, Klaus-Jurgen, "Void Formation on PCB Surface Finish During Reflow Soldering," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 153-161.

Ewalt, Ann B., "Comparison of Tin and Tin/Lead Solderability for SMT," Proceedings of the Technical Program NEPCON West '87, Volume 1, Anaheim, CA, Feb. 24-26, 1987, pp. 342-354.

Ewell, G. J., and Moore, F., "Tin Whiskers and Passive Components: A Review of the Concerns," 18th Capacitor and Resistor Technology Symposium, Huntington Beach, CA, Mar. 9-13, 1998, pp. 222-228.

Ewell, Gary J., and Roth, James A., "Metallurgical Criteria for Selection of Solders for Microelectronic Uses," Proceedings of the 1976 International Microelectronics Symposium, Vancouver, B. C., Canada, Oct. 11-13, 1976, pp. 239-248.

Ewing, J. A., Rosenhain, W., Turner, T., Hinchley, J. W., Holloway, G. T., Bousfield, W. R., Borns, H., Feilmann, E., Cohen, E., and Chairman, The, "Discussion," Transactions of the Faraday Society, vol. 7 no. , pp. 133-135, 1911.

Ezaki, H., Nambu, T., Ninomiya, R., Nakahara, Y., Wang, C. Q., and Morinaga, M., "Estimation of liquidus temperature of Sn-based alloys and its application to the design of Pb-free solder," Journal of Materials Science: Materials in Electronics, vol. 13 no. 5, pp. 269-272, May 2002.

Ezawa, Hirokazu, Higuchi, Kazuhito, Seto, Msaharu, Togasaki, Takashi, Takeda, Sachiko, and Kiumi, Rei, "Ag Plating and Its Impact on Void-Free Ag/Sn Bumping," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 107-112.

Ezawa, Hirokazu, Higuchi, Kazuhito, Seto, Masaharu, Uchida, Masayuki, and Togasaki, Takashi, "Dilute Cu Alloying for Sn-Cu Bumping by Annealing Electroplated Cu/Sn Stacks on Ti/Ni/Pd UBM," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 550-555.

Ezawa, Hirokazu, Miyata, Masahiro, Honma, Soichi, Inoue, Hiroaki, Tokuoka, Tsuyoshi, Yoshioka, Junichiro, and Tsujimura, Manabu, "Eutectic Sn-Ag Solder Bump Process for ULSI Flip Chip Technology," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 1095-1100.

Ezawa, Hirokazu, Miyata, Masahiro, Honma, Soichi, Inoue, Hiroaki, Tokuoka, Tsuyoshi, Yoshioka, Junichiro, and Tsujimura, Manabu, "Eutectic Sn-Ag Solder Bump Process for ULSI Flip Chip Technology," IEEE Transactions on Electronics Packaging Manufacturing, vol. 24 no. 4, pp. 275-281, Oct. 2001.

Ezawa, Hirokazu, Uchida, Masayuki, Miura, Masayuki, Togasaki, Takashi, Iijima, Tsunetoshi, Migita, Tatsuo, Iijima, Tadashi, and Higuhci, Kazuhito, "Flip Chip Interconnects Qualified for Advanced Low-k Chips with SnCu Bumps By Alloying Cu/Sn Plated Stack," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 719-724.

Ezawa, Hirokazu, Miyata, Masahiro, Seto, Masaharu, and Honma, Soichi, "Pb-Free Bumping by Alloying Electroplated Metal Stacks," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 664-667.

Ezawa, Hirokazu, Seto, Msaharu, Katsumata, Hiroshi, "Pb-Free Bumping for High-Performance SoCs," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 655-660.

FFFF

Facchini, D., McCrea, J. L, Gonzalez, F., Tomantschger, K., and Palumbo, G., "Small Crystals, Big Benefits," Products Finishing, vol. 73 no. 7, pp. 14-18, Apr. 2009.

Fadil, Nor Akmal, Yusof, Siti Zahira, Ourdjini, Ali, and Bakar, Tuty Asma Abu, "Effect of the Formation of CuO flowers and SnO2 on the Growth of Tin Whiskers on Immersion Tin Surface Finish," Applied Mechanics and Materials , vol. 695, pp. 301-305, Nov. 2014.

Fagas, Giorgos, Nolan, Michael, Georgiev, Yordan M., Yu, Ran, Lotty, Olan, Petkov, Nikolay, Holmes, Justin D., Jia, Guobin, Eisenhawer, Bjorn, Gawlik, Annett, Falk, Fritz, Khosropour, Naser, Buitrago, Elizabeth, Badia, Montserrat Fernandez-Bolanos, Krummenacher, Francois, Ionescu, Adrian M., Kayal, Maher, Nightingale, Adrian M., de Mello, John C., Puik, Erik, van der Bent, Franc, Lafeber, Rik, Ramaneti, Rajesh, Tong, Hien Duy, and van Rijn, Cees, "Component design and testing for a miniaturised autonomous sensor based on a nanowire materials platform," Microsystem Technologies, vol. 20 no. 4-5, pp. 971-988, Apr. 2014.

Fahad, Shah, Yu, Haojie, Wang, Li, Zain-ul-Abdin, Haroon, Muhammad, Ullah, Raja Summe, Nazir, Ahsan, Naveed, Kaleem-ur-Rahman, Elshaarani, Tarig, and Khan, Amin, "Recent progress in the synthesis of silver nanowires and their role as conducting materials," Journal of Materials Science, vol. 54 no. 2, pp. 997-1035, Jan. 2019.

Fahad, Shah, Yu, Haojie, Wang, Li, Nazir, Ahsan, Ullah, Raja Summe, Naveed, Kaleem-ur-Rahman, Elshaarani, Tarig, Amin, Bilal Ul, Khan, Amin, and Mehmood, Sahid, "Synthesis of silver nanowires with controlled diameter and their conductive thin films," Journal of Materials Science: Materials in Electronics , vol. 30 no. 14, pp. 12876-12887, July 2019.

Fahim, Abdullah, Ahmed, Sudan, Chowdhury, Mahmudur R., Suhling, Jeffrey C., and Lall, Pradeep, "High Temperature Creep Response of Lead Free Solders," 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 31-June 3, 2016, pp. 1218-1224.

Fahim, Abdullah, Hasan, S. M. Kamrul, Suhling, Jeffrey C., and Lall, Pradeep, "Investigation on the Mechanical Behavior Evolution Occurring in Lead Free Solder Joints Exposed to Thermal Cycling," 2020 IEEE 70th Electronic Components and Technology Conference, Lake Buena Vista, AL, May 26-29, 2020, pp. 1486-1495.

Fahim, Abdullah, Hasan, Kamrul, Ahmed, Sudan, Suhling, Jeffrey C., and Lall, Pradeep, "Mechanical Behavior Evolution of SAC305 Lead Free Solder Joints under Thermal Cycling," 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 28-31, 2019, pp. 734-744.

Fahim, Abdullah, Ahmed, Sudan, Suhling, Jeffrey C., and Lall, Pradeep, "Mechanical Characterization of Intermetallic Compounds in SAC Solder Joints at Elevated Temperatures," 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29-June 1, 2018, pp. 1081-1090.

Fahim, Abdullah, Ahmed, Sudan, Suhling, Jeffrey C., and Lall, Pradeep, "Nanomechanical Characterization of IMCs Formed in SAC Solder Joints Subjected to Isothermal Aging," 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 30-June 2, 2017, pp. 1398-1408.

Fahim, Abdullah, Ahmed, Sudan, Suhling, Jeffrey C., and Lall, Pradeep, "Nanomechanical Characterization of Intermetallic Compounds in Lead Free Solder Joints," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 2359.

Faith, T. J., and Wu, C. P., "Elimination of hillocks on Al-Si metallization by fast-heat-pulse alloying," Applied Physics Letters, vol. 45 no. 4, pp. 470-472, Aug. 15, 1984.

Faith, T. J., "Hillock-free integrated-circuit metallizations by Al/Al-O layering," Journal of Applied Physics, vol. 52 no. 7, pp. 4630-4639, July 1981.

Faizan, Mohammad, "Dissolution kinetics of copper in lead-free liquid solders," Soldering & Surface Mount Technology, vol. 27 no. 2, pp. 84-89, 2015.

Faizan, Mohammad, "Dissolution of Copper and Formation of IMC in Bulk Lead-Free Solders," Materials and Manufacturing Processes, vol. 30 no. 2, pp. 169-174, 2015.

Faizan, Mohammad, and Wang, Guo-Xiang, "Effect of Thermal Processing on the Dissolution of Micro/Nano-Size Metal Particles in Lead-Free Composite Solders," 2007 ASME International Mechanical Engineering Conference and Exposition, Volume 5, Seattle, WA, Nov. 11-15, 2007, pp. 263-268.

Faizan, Mohammad, and Wang, Guo-Xiang, "Modelling of Micro/Nano-Particle Dissolution During Reflow of Lead-Free Composite Solders," Proceedings of the ASME InterPack Conference, Volume 2, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 121-127.

Fakpan, Kittichai, Otsuka, Yuichi, Mutoh, Yoshiharu, Inoue, Shunsuke, Nagata, Kohsoku, and Kodani, Kazuya, "Creep-Fatigue Crack Growth Behavior of Pb-Containing and Pb-Free Solders at Room and Elevated Temperatures," Journal of Electronic Materials, vol. 41 no. 9, pp. 2463-2469, Sept. 2012.

Fakpan, Kittichai, Otsuka, Yuichi, Mutoh, Yoshiharu, and Nagata, Kohsoku, "Effect of Hold Time on Crack Growth Behavior of Pb-Containing and Pb-Free Solders," Journal of Electronic Materials, vol. 41 no. 11, pp. 3196-3204, Nov. 2012.

Fakpan, Kittichai, Otsuka, Yuichi, Miyashita, Yukio, Mutoh, Yoshiharu, and Nagata, Kohsoku, "Transient Crack Growth Behavior Under Cycle/Time-Dependent Step Loading for Pb-Containing and Pb-Free Solders," Journal of Electronic Materials , vol. 42 no. 12, pp. 3593-3608, Dec. 2013.

Falat, Tomasz, Platek, Bartosz, Matkowski, Przemyslaw, Felba, Jan, Zanden, Carl, Ye, Li-lei, and Liu, Johan, "Experimental Results Versus Numerical Simulations of In/Cu Intermetallic Compounds Growth," 2014 IEEE 16th Electronics Packaging Technology Conference, Singapore, Dec. 3-5, 2014, pp. 797-800.

Falcao, B. P., Leitao, J. P., Gonzalez, J. C., Correia, M. R., Zayas-Bazan, K. G., Matinaga, F. M., Moreira, M. B., Leite, C. F., and de Oliveira, A. G., "Photoluminescence study of GaAs thin films and nanowires grown on Si(111)," Journal of Materials Science, vol. 48 no. 4, pp. 1794-1798, Feb. 2013.

Falcon, Javier A., Flom, Walter, and Newton, Thomas, "Round Robin Testing in Support of IPC J-STD-709: Combustion Sample Preparation Methods for Ion Chromatography Analysis of Br and Cl," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S26_02-1-S26_02-16.

Falcone, Joe, and Tanabe, Goji, "Minimizing Tin Whiskering in Microminiature Connector Design," ECN Electronic Component News (Supplement), vol. 52 no. 5, pp. 10-11, May 2008.

Falinski, Wojciech, Hackiewicz, Halina, Koziol, Grazyna, and Borecki, Janusz, "Problems and preliminary trials in lead free soldering," 27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, Volume 1, Sofia, Bulgaria, May 13-16, 2004, pp. 74-78.

Fallahi, H., Nurulakmal, M. S., Arezodar, A. Fallahi, and Abdullah, Jamaluddin, "Effect of iron and indium on IMC formation and mechanical properties of lead-free solder," Materials Science and Engineering: A, vol. 553, pp. 22-31, Sept. 15, 2012.

Fallahi, H., Nurulakmal, M. S., Fallahi, A., and Abdullah, Jamaluddin, "Modifying the mechanical properties of lead-free solder by adding iron and indium and using a lap joint test," Journal of Materials Science: Materials in Electronics, vol. 23 no. 9, pp. 1739-1749, Sept. 2012.

Fan, C., Smith, B., Xu, C., Dullaghan, C. A., and Abys, J. A., "Approaches to Porosity Reduction in Connector Surface Finish," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. 573-576.

Fan, C., Kadija, I. V., Abys, J. A., and Maisano, J. J., "Ductile Nickel/Palladium Multilayer Surface Finishes Designed for Leadframe Packaging," Technical Conference Proceedings AESF SUR/FIN, Detroit, MI, June 23-26, 1997, pp. 277-282.

Fan, C., Xu. C., Abys, J. A., Blair, A., and Chinchankar, V., "Gold Wire Bonding To Nickel/Palladium Plated Leadframes," Plating & Surface Finishing, vol. 88 no. 7, pp. 54-58, July 2001.

Fan, C., Blair, A., and Abys, J. A., "Nickel / Palladium Surface Finish for Semiconductor Packaging Applications," 2000 Surface Finishes Forum Conference Proceedings, May 4, 2000, pp. xx-xx.

Fan, C., Zhang, Y., and Abys, J. A., "Solderability of Lead-Free Finishes Using Lead-Free Solders," 2001 SMTA International Conference Proceedings, Chicago, IL, Sept. 30-Oct. 4, 2001, pp. xx-xx.

Fan, C., Xu, C., Kudrak, E. J., and Abys, J. A., "Ultra-thin PdCo/Au Surface Finishes For Electronic Packaging," Plating & Surface Finishing, vol. 91 no. 4, pp. 44-47, Apr. 2004.

Fan, Cheng-Han, Chang, Yao-Jen, Chou, Yi-Chia, and Chen, Kuan-Neng, "Interdiffusion of Cu-Sn System with Ni Ultra-thin Buffer Layer and Material Analysis of IMC Growth Mechanism," 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 22-24, 2014, pp. 37-40.

Fan, Chonglun, Xu, Chen, and Abys, Joseph A., "Ultra-thin PdCo/Au Surface Finishes for Electronic Packaging," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 430-436.

Fan, Jiajie, Yung, K. C., and Pecht, Michael, "Failure Modes, Mechanisms, and Effects Analysis for LED Backlight Systems used in LCD TVs," 2011 Prognostics and System Health Management Conference, Shenzhen, China, May 24-25, 2011, pp. xx-xx.

Fan, Jianglei, Zhai, Hengtao, Liu, Zhanyun, Wang, Xiao, Zhou, Xiangkui, Wang, Yan, Li, Ying, Gao, Hongxia, and Liu, Jianxiu, "Microstructure Evolution, Thermal and Mechanical Property of Co Alloyed Sn-0.7Cu Lead-Free Solder," Journal of Electronic Materials, vol. 49 no. 4, pp. 2660-2668, Apr. 2020.

Fan, Jing, Ackerman, Art, Katze, Doug, Shah, Jayesh, Eveline, Matthew, Andra, Nishitha, and Blazej, Daniel, "Effects of Environmental Exposure on the Performance of Electrically Conductive Film Adhesives for RF Grounding Applications," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Fan, Jinhu, Shi, Tielin, Tang, Zirong, Gong, Bo, Li, Junjie, Huang, Jie, and Li, Tianxiang, "Low-Temperature Cu-Cu Bonding Process Based on the Sn-Cu Multilayer and Self-Propagating Reaction Joining," Journal of Electronic Materials , vol. 48 no. 2, pp. 1310-1317, Feb. 2019.

Fan, Jinhu, Shi, Tielin, Tao, XiangXu, Zhou, Tengyuan, Li, Junjie, Tang, Zirong, Liao, Guanglan, and Yu, Xing, "The Cu-Cu self-propagating reaction joining with different thickness of tin," Journal of Alloys and Compounds, vol. 735, pp. 1189-1194, Feb. 25, 2018.

Fan, Jun, Smith, Norm, Knighten, Jim, Andresakis, John, Fukawa, Yoshi, and Harvey, Mark, "Utilization of Buried CapacitanceTM: A Case Study," DesignCon 2008 , Santa Clara, CA, Feb. 4-7, 2008, pp. xx-xx.

Fan, Lianhua, Tison, Christopher, and Wong, C. P., "Adhesion of Underfills toward Tin/Lead and Lead-Free Solders," 8th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 3-6, 2002, pp. 291-296.

Fan, Lianhua, Su, Bin, Qu, Jianmin, and Wong, C. P., "Effects of Nano-Sized Particles on Electrical and Thermal Conductivities of Polymer Composites," 2004 9th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 24-26, 2004, pp. 193-199.

Fan, Lianhua, Su, Bin, Qu, Jianmin, and Wong, C. P., "Electrical and Thermal Conductivities of Polymer Composites Containing Nano-Sized Particles," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 148-154.

Fan, Lianhua, Tison, C., and Wong, C. P., "Fundamental Understanding of Conductivity Establishment for Electrically Conductive Adhesives," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1154-1157.

Fan, Lianhua, Tison, Christpher K., and Wong, C. P., "Study on Underfill/Solder Adhesion in Flip-Chip Encapsulation," IEEE Transactions on Advanced Packaging, vol. 25 no. 4, pp. 473-480, Nov. 2002.

Fan, Lianhua, Tison, C., and Wong, C. P., "Understanding of Electrically Conductive Adhesives: Formulation, Curing and Conductivity," 2002 8th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 3-6, 2002, pp. 184-187.

Fan, M., Huang, M. L., and Zhao, N., "Cross-solder interaction on interfacial reactions in Ni/Sn-3.0Ag-0.5Cu/Cu solder interconnects," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 542-545.

Fan, Qiong, Cui, Huiwang, Li, Dongsheng, Hu, Zhili, Yuan, Zhichao, Ye, Lilei, and Liu, Johan, "The Effect of Functionalized Silver on Properties of Conductive Adhesives," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 423-425.

Fan, S. H., and Chan, Y. C., "Current-Carrying Capacity of Anisotropic-Conductive Film Joints for the Flip Chip on Flex Applications," Journal of Electronic Materials, vol. 32 no. 2, pp. 101-108, Feb. 2003.

Fan, S. H., and Chan, Y. C., "Effect of Misalignment on the Electrical Characteristics of Anisotropic Conductive Adhesive Joints," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1605-1612.

Fan, S. H., and Chan, Y. C., "Effect of misalignment on electrical characteristics of ACF joints for flip chip on flex applications," Microelectronics Reliability, vol. 42 no. 7, pp. 1081-1090, July 2002.

Fan, X. J., Varia, B., and Han, Q., "Design and optimization of thermo-mechanical reliability in wafer level packaging," Microelectronics Reliability, vol. xx no. x, pp. xx-xx, xxxx.

Fan, Xuejun, Pei, Min, and Bhatti, Pardeep K., "Effect of Finite Element Modeling Techniques on Solder Joint Fatigue Life Prediction of Flip-Chip BGA Packages," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 972-980.

Fan, Xuejun, Rasier, George, and Vasudevan, Vasu S., "Effects of Dwell Time and Ramp Rate on Lead-Free Solder Joints in FCBGA Packages," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 901-906.

Fan, Xuejun, Zhou, Jiang, and Chandra, Abhijit, "Package Structural Integrity Analysis Considering Moisture," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1054-1066.

Fan, Yaohui, Wu, Yifan, Dale, Travis F., Achar, Sukshitha, Badwe, Nilesh U., Aspandiar, Raiyo F., Blendell, John E., Subbarayan-Shastri, Ganesh, and Handwerker, Carol A., "Intermetallic Compound Growth and Gold Embrittlement Effect in Tin-Bismuth Low Temperature Solders Elecreoless Nickel Emersion Gold (ENIG) Surface Finish," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 392-400.

Fan, Zhi-gang, Ma, Hai-tao, and Wang, Lai, "Effect of Cu on electrochemical corrosion behavior of lead-free Sn-9Zn-xCu solder," Zhongguo Youse Jinshu Xuebao/ Chinese Journal of Nonferrous Metals, vol. 17 no. 8, pp. 1302-1306, Aug. 2007.

Fang, Chunxia, Zhang, Shengyi, Zuo, Pengfei, Wei, Wei, Jin, Baokang, Wu, Jieying, and Tian, Yupeng, "Nanotube-nanotube transformation synthesis and electrochemistry of crystalline CuAgSe nanotubes," Journal of Crystal Growth, vol. 311 no. 8, pp. 2345-2351, Apr. 1, 2009.

Fang, Da-jing, Mao, Xu-hui, Zhang, Ye-ming, Chen, Zhi-liang, Liu, Min, and Gan, Fu-xing, "Preparation of non-chromium polymer films on zinc for corrosion protection due to a compound effect between silane and cerium salt," Anti-Corrosion Methods and Materials, vol. 56 no. 4, pp. 226-231, 2009.

Fang, Feng, Wang, Liping, Zhou, Lichu, Min, Xuegang, and Jiang, Jianqing, "Application of texture inheritance on manufacturing ultra-high strength pearlitic steel wire," Materials Science and Technology, vol. 34 no. 7, pp. 766-771, May 2018.

Fang, Feng, Hu, Xian-jun, Chen, Shao-hui, Xie, Zong-han, and Jiang, Jian-qing, "Revealing microstructural and mechanical characteristics of cold-drawn pearlitic steel wires undergoing simulated galvanization treatment," Materials Science and Engineering: A, vol. 547, pp. 51-54, June 15, 2012.

Fang, Gu, and Chen, Chih-Chi, "Phase Equilibria of the Sn-Ni-Si Ternary System and Interfacial Reactions in Sn-(Cu)/Ni-Si Couples," Journal of Electronic Materials, vol. 44 no. 7, pp. 2422-2431, July 2015.

Fang, Haiyu, Yang, Haoran, and Wu, Yue, "Thermoelectric Properties of Silver Telluride-Bismuth Telluride Nanowire Heterostructure Synthesized by Site-Selective Conversion," Chemistry of Materials, vol. 26 no. 10, pp. 3322-3327, May 27, 2014.

Fang, J. L., "Bondability & Solderability of Neutral Electroless Gold," Plating & Surface Finishing, vol. 88 no. 7, pp. 44-47, July 2001.

Fang, Jing Li, and Chan, Daniel K. "The advantages of mildly alkaline immersion silver as a final finish for solderability," Circuit World, vol. 33 no. 2, pp. 43-51, 2007.

Fang, Lee Seen, Haseeb, A. S. M. A., and Yingxin, Goh, "Formation of Sn-Bi Alloys through Sequential Electrodeposition," 2012 4th Asia Symposium on Quality Electronic Design, Kuala Lumpur, Malaysia, July 10-11, 2012, pp. 160-163.

Fang, Sheng, Wang, Han, Yang, Juanyu, Lu, Shigang, Yu, Bing, Wang, Jiantao, and Zhao, Chunrong, "Electrochemical preparation of silicon nanowires from porous NiO/SiO2 blocks in molten CaCl2," Materials Letters, vol. 160, pp. 1-4, Dec. 1, 2015.

Fang, Tong, Mathew, Sony, Osterman, Michael, and Pecht, Michael, "Assessing Tin Whisker Risk in Electronic Products," Surface Mount Technology (SMT), vol. 20 no. 5, pp. 24-25, May 2006.

Fang, Tong, Mathew, Sony, Osterman, Michael, and Pecht, Michael, "Assessment of risk resulting from unattached tin whisker bridging," Circuit World, vol. 33 no. 1, pp. 5-8, 2007.

Fang, Tong, Osterman. Michael, and Pecht, Michael, "Statistical analysis of tin whisker growth," Microelectronics Reliability, vol. 46 no. 5-6, pp. 846-849, May-June 2006.

Fang, Tong, Osterman, Michael, Mathew, Sony, and Pecht, Michael, "Tin whisker risk assessment," Circuit World, vol. 32 no. 3, pp. 25-29, 2006.

Fang, Tony, Matthew, Sony, Osterman, Michael, and Pecht, Michael, "Tin Whisker Risk Assessment for Electronic Products," Journal of the Reliability Information Analysis Center, pp. 10-11, 2nd Quarter 2006.

Fang, Zhiqiang, Mao, Xu, Yang, Jinling, and Yang, Fuhua, "A wafer-level Sn-rich Au-Sn intermediate bonding technique with high strength," Journal of Micromechanics and Microengineering, vol. 23 no. 9, pp. 095008-1-095008-7, Sept. 2013.

Fangkangwanwong, Juthathip, Jintana, Jareerat, Ketui, Jarinee, and Ng, Teng Hoon, "A Study of Soldering Tip Life on Lead-Free Alloys," 2008 Pan Pacific Microelectronics Symposium & Exhibit, Kauai, HI, Jan. 22-24, 2008, pp. xx-xx.

Fangkangwanwong, Juthathip, Phuhattsuan, Mongkhol, and Ng, Teng Hoon, "Lead-Free Wave Soldering for Process and Product Design Improvement in SnCu Alloys," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 651-657.

Fangkangwanwong, Juthathip, Puhattsuan, Mongkhol, and Ng, Teng Hoon, "Pb-free Wave Soldering for Process and Product Design Improvement in SnCu Alloys," SMTA International 2010 Conference (Presentations), Orlando, FL, Oct. 24-28, 2010.

Farahani, A. F. Askari, Al-Bassyiouni, M., and Dasgupta, A., "Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results," Journal of Electronic Packaging, vol. 133 no. 4, pp. 041010-1-041010-10, Dec. 2011.

Farahani, A. F. Askari, Al-Bassyiouni, M., and Dasgupta, A., "Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results," Journal of Electronic Packaging, vol. 133 no. 4, pp. 041012-1-041012-12, Dec. 2011.

Fardella, Nick, "Ask the EMPF Helpline!," empfasis, pp. xx-xx, Jan. 2008.

Fardella, Nick, "Lead-Free RoHS Compliance Screening," empfasis, pp. 2, July 2010.

Fardella, Nick, "Tech Tips... X-Ray Fluorescence," empfasis, pp. xx-xx, June 2008.

Farina, Silvia, and Morando, Carina, "Comparative corrosion behaviour of different Sn-based solder alloys," Journal of Materials Science: Materials in Electronics, vol. 26 no. 1, pp. 464-471, Jan. 2015.

Farish, Mike, "Resourceful thinking," Engineering, vol. 247 no. 8, pp. 22-23, Sept. 2006.

Farley, D., Dasgupta, A., and Caers, J. F. J., "Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part II: Effect of Bump Coplanarity on Manufacturability and Durability of Non-Conducting Adhesive Assemblies," Journal of Adhesion Science and Technology, vol. 22 no. 14, pp. 1757-1780, 2008.

Farmer, John G., Thomas, Rhodri P., Graham, Margaret C., Geelhoed, Jeanine S., Lumsdon, David G., and Paterson, Edward, "Chromium speciation and fractionation in ground and surface waters in the vicinity of chromite ore processing residue disposal sites," Journal of Environmental Monitoring, vol. 4 no. 2, pp. 235-243, Mar. 26, 2002.

Farnell, G. C., and Judd, F. S., "The formation of silver whiskers by exposure of silver bromide microcrystals," British Journal of Applied Physics, vol. 16 no. xx, pp. 1413-1416,

Faro, Maria Jose Lo, Leonardi, Antonio Alessio, D'Andrea, Cristiano, Morganti, Dario, Musumeci, Paolo, Vasi, Cirino, Priolo, Francesco, Fazio, Barbara, and Irrera, Alessia, "Low cost synthesis of silicon nanowires for photonic applications," Journal of Materials Science: Materials in Electronics, vol. 31 no. 1, pp. 34-40, Jan. 2020.

Farooq, Mukta, Melville, Ian, Muzzy, Christopher, McLaughlin, Paul V., Harmon, Robert, Ferguson, Craig, Dubuque, Rachel, Sauter, Wolfgang, Muncy, Jennifer, Questad, David, Carey, Charles, Cullinan-Scholl, Mary, McGahay, Vincent, Angyal, Matthew, Nye, Henry, Lane, Michael, Liu, Xiao Hu, Shaw, Thomas, and Murray, Conal, "Chip Package Interaction Results & Modeling for 65nm CMOS BEOL with C4 interconnections," Advanced Metallization Conference 2007, Tokyo, Japan, Oct. 22-24, 2007, pp. 631-637.

Farooq, Mukta, Ray, Sudipta, Sarkhel, Amit, and Goldsmith, Charles, "Evaluation of Lead(Pb)-free Ceramic Ball Grid Array (CBGA): Wettability, Microstructure and Reliability," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 978-986.

Farooq, Mukta, Goldsmith, Charles, Jackson. Ray, and Martin, Gregory, "Lead-Free Ceramic Ball Grid Array: Thermomechanical Fatigue Reliability," Journal of Electronic Materials, vol. 32 no. 12, pp. 1421-1425, Dec. 2003.

Farooq, Mukta, Goldmann, Lewis, Martin, Gregory, Goldsmith, Charles, and Bergeron, Christian, "Thermo-Mechanical Fatigue Reliability of Pb-Free Ceramic Ball Grid Arrays: Experimental Data and Lifetime Prediction Modeling," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 827-833.

Farooqi, Mahmood, "Cadmium Plating Alternatives," Finishing Today, vol. 84 no. 7, pp. 28-31, July 2008.

Farrell, Robert, Mazur, Scott, Morose, Greg, and Russo, Richard R., "A Successful Transition to Lead-free," Surface Mount Technology (SMT), vol. 20 no. 8, pp. 38, 40-41, Aug. 2006.

Farrell, Robert, Beck, Steve, Garnick, Richard, Wang, Paul P. E., Reynolds, Heidi, and Kochi, Ken, "Lead Free Assembly-Process and Product Development," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies , San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Farrell, Robert, Beck, Steve, Garnick, Richard, Wang, Paul P. E., Graveling, Keith, Reynolds, Heidi, and Kochi, Ken, "Lead-Free Process Transition-Phase II: Paste Performance Assessment by Surface Finish and Mechanical Strength Correlation," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 619-631.

Farrell, Robert, Beck, Steve, Garnick, Richard, Wang, Paul P. E., and Kochi, Ken, "Lead Free Process Transition Solder Paste Characteristic Assessment," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S40-3-1-S40-3-10.

Farrell, Robert, Bodmer, Paul, Tostevin, Bruce, Russo Richard, and Morose, Gregory, "Pb-free PTH Rework on a Thick, Heavy Assembly," Circuits Assembly , vol. 18 no. 8, pp. 22, 24-25, 27, 29, 44, Aug. 2007.

Farrell, Sinead T., and Breslin, Carmel B., "Reduction of Cr(VI) at a Polyaniline Film: Influence of Film Thickness and Oxidation State," Environmental Science & Technology, vol. 38 no. 17, pp. 4671-4676, 2004.

Farrens, Shari, "Metal-based wafer level packaging," Global SMT and Packaging, vol. 9 no. 7, pp. 10-14,16, July 2009.

Farris, Andrew, Pan, Jianbiao, Liddicoat, Albert, Krist, Michael, Vickers, Nicholas, Toleno, Brian J., Maslyk, Dan, Shangguan, Dongkai, Bath, Jasbir, Willie, Dennis, and Geiger, David A., "Drop impact reliability of edge-bonded lead-free chip scale packages," Microelectronics Reliability, vol. 49 no. 7, pp. 761-770, July 2009.

Farris, Andrew, Pan, Jianbiao, Liddicoat, Albert, Toleno, Brian J., Maslyk, Dan, Shangguan, Dongkai, Bath, Jasbir, Willie, Dennis, and Geiger, David A., "Drop Test Reliability of Lead-free Chip Scale Packages," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1173-1180.

Farup, P., "Om Tinpest," Teknisk Ugeblads Afdeling for Kemi og Bergvaesen, vol. 55, pp. 19, May 29, 1908.

Fasoli, A., and Milne, W. I., "Overview and status of bottom-up silicon nanowire electronics," Materials Science in Semiconductor Processing, vol. 15 no. 6, pp. 601-614, Dec. 2012.

Fath, Andreas, "Kunststoffmetallisierung mit annahernd chrom(VI)freier Beizlosung," Galvanotechnik, vol. xx, no. x, pp. 2914-2923, Dec. 2008.

Fathi, Zak, Wander, Joe, and Ahmad, Iftikhar, "Microwave Curing," Appliance Design, vol xx no. x, pp. xx-xx, Oct. 26, 2001.

Faure, Christiane, Coudere, Jean-Francois, Zanon, Gilbert, Hyland, Kim, and Willie, Dennis, "Lead Free Assembly: Process Considerations," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Fauser, Suzanne N., Miles, Barry, and Ramirez, Cindy, "PBGA Susceptibility to IR Reflow-Induced Damage as a Function of Moisture Content," Proceedings of the 1994 International Electronics Packaging Conference, Atlanta, GA, Sept. 25-28, 1994, pp. 573-587.

Faust Jr., J. W., John, H. F., and Pritchard, C., "Influence of Solvent and Impurities on Habit and Morphology of Semiconductor Crystals," Journal of Crystal Growth, vol. 3-4, pp. 321-326, 1968.

Faust, Nicholas, Messler Jr., Robert W., and Khatri, Subhash, "Alternatives for Joining of Si Wafers to Strain-Accommodating Cu for High-power Electronics," Journal of Electronic Materials, vol. 30 no. 10, pp. 1276-1286, Oct. 2001.

Fauty, Joseph, Cada, Leonorina G., and Stana, Michal, "Effect of 260°C Reflow on the Ability of Mold Compounds to meet Moisture Sensitivity Level One (MSL1)," IEEE Transactions on Components and Packaging Technologies, vol. 28 no. 4, pp. 841-851, Dec. 2005.

Fauty, Joseph, Knapp, James, and Yoder, Jay, "Mold Compound Adhesion to Bare Copper Lead Frames - Effect of Laser Texturing," The International Journal of Microcircuits and Electronic Packaging, vol. 25 no. 1, pp. 51-79, First Quarter 2002.

Favier, J. J., Lehmann, P., Garandet, J. P., Drevet, B., and Herbillon, F., "On the Measurements of Thermophysical Properties During Planar Front Solidification of an Sn-Bi Alloy in Microgravity: Results of the Mephisto-USMP1 Experiments," Acta Materialia, vol. 44 no. 12, pp. 4899-4907, Dec. 1996.

Fawzy, A., Habib, N., Sobhy, M., Nassr, E., and Saad, G., "Effect of Zn addition on steady state creep characteristics of Sn-3.3Ag solder alloy," Materials Science and Technology, vol. 24 no. 4, pp. 488-494, Apr. 2008.

Fawzy, A., Fayek, S. A., Sobhy, M., Nassr, E., Mousa, M. M., and Saad, G., "Effect of ZnO nanoparticles addition on thermal, microstructure and tensile properties of Sn-3.5 Ag-0.5 Cu (SAC355) solder alloy," Journal of Materials Science: Materials in Electronics, vol. 24 no. 9, pp. 3210-3218, Sept. 2013.

Fawzy, A., Fayek, S. A., Sobhy, M., Nassr, E., Mousa, M. M., and Saad, G., "Tensile creep characteristics of Sn-3.5Ag-0.5Cu (SAC355) solder reinforced with nano-metric ZnO particles," Materials Science and Engineering: A , vol. 603, pp. 1-10, May 6, 2014.

Fayeka, M., Fazal, M. A., and Haseeb, A. S. M. A., "Effect of aluminum addition on the electrochemical corrosion behavior of Sn-3Ag-0.5Cu solder alloy in 3.5 wt% NaCl solution," Journal of Materials Science: Materials in Electronics, vol. 27 no. 11, pp. 12193-12200, Nov. 2016.

Federman, George A., and Hradil, George, "A New Neutral pH Tin Electroplating Process for Acid Sensitive Electronic Components," Proceedings of the 25th Symposium for Passive Components, Palm Springs, CA, Mar. 21-24, 2005, pp. 30-37.

Fei, Huiyang, Yazzie, Kyle, Chawla, Nikhilesh, and Jiang, Hanqing, "Modeling Fracture of Sn-Rich (Pb-Free) Solder Joints Under Mechanical Shock Conditions," Journal of Electronic Materials, vol. 41 no. 8, pp. 2089-2099, Aug. 2012.

Fei, Huiyang, Yazzie, Kyle, Chawla, Nikhilesh, and Jiang, Hanqing, "The Effect of Random Voids in the Modified Gurson Model," Journal of Electronic Materials, vol. 41 no. 2, pp. 177-183, Feb. 2012.

Fei, Jingyin, Liang, Guozheng, and Xin, Wenli, "Composition and Morphology of Zn-Co Alloy Coatings Deposited by Means of Pulse Plating Containing Reverse Current," Journal of Wuhan University of Technology-- Materials Science, vol. 22 no. 3, pp. 417-421, Sept. 2007.

Fei, Jingyin, Liang, Guozheng, Xin, Wenli, and Liu, Jianghong, "Corrosion Performance of Zinc and Zinc-cobalt Alloy Compositionally Modulated Multilayer (CMM) Coatings," Journal of Wuhan University of Technology-- Materials Science, vol. 21 no. 4, pp. 40-44, Dec. 2006.

Fei, Qin, Tong, An, and Na, Chen, "Dynamic Behavior Tests of Lead-free Solders at High Strain Rates by the SHPB Technique," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Fei, Qin, Tong, An, and Na, Chen, "Strain rate effect and Johnson-Cook models of lead-free solder alloys," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Feigelson, R. S., "Opportunities for Research on Single-crystal Fibers," Materials Science and Engineering: B, vol. 1 no. 1, pp. 67-75, Aug. 1988. https://doi.org/10.1016/0921-5107(88)90031-1

Feil, D., Herberholz, T., Guyenot, M., and Nowottnick, M., "Highly variable Sn-Cu diffusion soldering process for high performance power electronics," Microelectronics Reliability, vol. 76-77, pp. 455-459, Sept. 2017.

Feil, Michael, Konig, Martin, and Bock, Karlheinz, "A New Method of Flip Chip Assembly Using a Light Silver Filled Glue," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 540-543.

Feinberg, Daniel (Baer), and Severin, Erik, "A Unique Process That Eliminates Solder Dross," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S11-02-1-S11-02-4.

Feinberg, Daniel (Baer), "A Unique Process that Eliminates Solder Dross," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 117-120.

Feinberg, Daniel (Baer), and Severin, Erik, "A Unique Process that Totally Eliminates Solder Dross While Potentially Providing Improved Quality, all while Significantly Reducing Costs," IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies, Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.

Feinberg, Dan, "Fein-Lines," CircuiTree, vol. 19 no. 3, pp. xx-xx, Mar. 2006.

Felba, J., Friedel, K. P., and Moscicki, A., "Characterization and Performance of Electrically Conductive Adhesives for Microwave Applications," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 232-239.

Felba, Jan, Moscicki, Andrzej, and Bereski, Marcin, "Anisotropic Effect when Using Isotropic Conductive Adhesives," 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, Portland, OR, Sept. 12-15, 2004, pp. 33-37.

Felba, Jan, and Friedel, Kazimierz P., "Electrical Conduction of Adhesive Joints in Microwave Applications," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, Germany, Oct. 21-24, 2001, pp. 71-78.

Felba, Jan, Friedel, Kazimierz, Guenther, Bernd, Moscicki, Andrzej, and Schafer, Helmut, "The Influence of Filler Particle Shapes on Adhesive Joints in Microwave Applications," 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Zalaegerszeg, Hungary, June 23-26, 2002, pp. 1-6.

Felberbaum, M., Ventura, T., Rappaz, M., and Dahle, A. K., "Microstructure Formation in Sn-Cu-Ni Solder Alloys," JOM, vol. 63 no. 10, pp. 52-55, Oct. 2011.

Feldmann, Klaus, and Luchs, Ralf, "Assessment of Electrically Conductive Adhesives for SMT," 1997 Surface Mount International Conference Proceedings, San Jose, CA, Sept. 7-11, 1997, pp. 517-523.

Feldmann, Klaus, and Reichenberger, Marcus, "Assessment of Lead-free Solders for SMT," IPC SMEMA Council APEX 2000, Long Beach, CA, Mar. 12-16, 2000, pp. 2-1 to 2-13.

Feldmann, Klaus, and Luchs, Ralf, "Electrically Conductive Adhesives: An Assessment," Surface Mount Technology (SMT), vol. 12 no. 5, pp. 74, 76, 78, May. 1998.

Feldmann, Klaus, Feuerstein, Robert, and Götz, Knuth, "Influences of storage conditions on component cracking," Soldering & Surface Mount Technology, vol. 10 no. 3, pp. 6-11, 1998.

Feldstein, Michael D., "The Current State of Composite Electroless Coatings," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. 233-239.

Feldstein, Michael D.. "Wearing Well," Products Finishing, vol. 70 no. 10, pp. 36-40, July 2006.

Feller, L., Hartmann, S., and Schneider, D., "Lifetime analysis of solder joints in high power IGBT modules for increasing the reliability for operation at 150 °C," Microelectronics Reliability , vol. 48 no. 8-9, pp. 1161-1166, Aug.-Sept. 2008.

Fellman, Jack, "A study of the lead-free hot air solder levelling process," Circuit World, vol. 31 no. 2, pp. 3-9, 2003.

Fellman, Jack, "Effects of Lead Free Soldering on "Plating" Vias," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Fellman, Jack, "Effects of Lead Free Soldering on `Plating' Vias," Circuitree , vol. 19 no. 8, pp. xx-xx, Aug. 2006.

Fellman, Jack, and Lee, Simon, "No Hassle Lead-Free HASL," Printed Circuit Design and Manufacture , vol. 22 no. 10, pp. 26-30, Oct. 2005.

Fellman, Jack, "Plating With Tin and Tin-Lead Alloys," Printed Circuit Fabrication , vol. 15 no. 3, pp. 48,50-51,63, Mar. 1992.

Fellman, Jack D., "The Case for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) as a Surface Finish," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 661-666.

Fellman, Jack, "The Lead Free HASL Process," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Felps, Bruce, "'Whiskers' Caused Satellite Failure: Galaxy IV Outage Blamed On Interstellar Phenomenon," Wireless Week, vol. xx no. xx, pp. xx-xx, May 17, 1999.

Felton, L. E., Rajan, K., Ficalora, P. J., and Singh, P., "n-Cu6Sn5 Precipitates in Cu/Pb-Sn Solder Joints," Scripta Metallurgica et Materialia, vol. 25 no. 10, pp. 2329-2333, Oct. 1991.

Felton, L. E., Raeder, C. H., Havasy, C. K., and Knorr, D. B., "Pb-free Soldering Alternatives For Fine Pitched Electronics Packaging," Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium, Baltimore, MD, Sept. 28-30, 1992, pp. 300-304.

Felton, Lawrence E., Raeder, Christopher H., and Knorr, David B., "The Properties of Tin-Bismuth Alloy Solders," JOM, vol. 45 no. 7, pp. 28-32, July 1993.

Feng, Jiayun, Liu, Baolei, Tian, Yanhong, and Zhang, Baoyou, "Influence of Electric Current on the Grain Orientation of Cu-Sn Intermetallic Compounds in Cu/Molten Sn/Cu Interconnection System," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 348-351.

Feng, Jiayun, Xu, Di Erick, Tian, Yanhong, and Mayer, Michael, "SAC305 Solder Reflow: Identification of Melting and Solidification Using In-Process Resistance Monitoring," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 9 no. 8, pp. 1623-1631, Aug. 2019.

Feng, Jinyang, Ma, Xiao, Mao, Haibo, Liu, Baoshun, and Zhao, Xiujian, "Ag/epoxy nanocomposite film with aligned Ag nanowires and their polarization property," Journal of Materials Research, vol. 26 no. 21, pp. 2691-2700, Nov. 14, 2011.

Feng, Jinyang, Xia, Huida, You, Fangfang, Mao, Haibo, Ma, Xiao, Tao, Haizheng, Zhao, Xiujian, and Wang, Moo-Chin, "Alignment of Ag nanowires on glass sheet by dip-coating technique," Journal of Alloys and Compounds, vol. 735, pp. 607-612, Feb. 25, 2018.

Feng, L. P., Chang, S. Y., Tsao, L. C., and Wang, F. S., "Influence of Nano-TiO2 Reinforcements on the Wettability and Interfacial Reactions of Novel Lead-Free Sn3.5AgO.5Zn Composite Solder/Cu Solder Joints," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 260-263.

Feng, S. Q., Yu, D. P., Zhang, H. Z., Bai, Z. G., and Ding, Y., "The growth mechanism of silicon nanowires and their quantum confinement effect," Journal of Crystal Growth, vol. 209 no. 2-3, pp. 513-517, Feb. 2000.

Feng, Wufeng, Wang, Chunqing, and Morinaga, M., "Electronic Structure Mechanism for the Wettability of Sn-Based Solder Alloys," Journal of Electronic Materials, vol. 31 no. 3, pp. 185-190, Mar. 2002.

Feng, Wufeng, Wang, Chunqing, and Morinaga, M., "Quantum Computational Approach to Design Sn-Based Pb-Free Solder Alloys in Microelectronic Mounting and Packaging," Advances in Electronic Packaging 2001, Volume 1, Kauai, Hawaii, July 8-13, 2001, pp. 291-298.

Feng, Yankun, Liu, Yulan, and Wang, Biao, "Finite element analysis of resonant properties of silicon nanowires with consideration of surface effects," Acta Mechanica, vol. 217 no. 1-2, pp. 149-155, Feb. 2011.

Feng, Yefei, Zhang, Shichao, Xing, Yalan, and Liu, Wenbo, "Preparation and characterization of nanoporous Cu6Sn5/Cu composite by chemical dealloying of Al-Cu-Sn ternary alloy," Journal of Materials Science, vol. 47 no. 16, pp. 5911-5917, Aug. 2012.

Feng, Zhen (Jane), Toledo, Eduardo, Cheung, Dason, Newbrough, Jeff, and Kurwa, Murad, "Analysis of AXI Test on Fine Pitch Components between Lead Free and Tin/Lead Assembly," IPC Printed Circuits Expo, APEX and the Designer Summit , Anaheim, CA, Feb. 8-10, 2006, pp. S30-02-1-S30-02-5.

Feng, Zhen (Jane), Toledo, Eduardo, Cheung, Dason, Newbrough, Jeff, and Kurwa, Murad, "AXI Test on Fine-Pitch Components Using Pb-Free and SnPb Solder," Circuits Assembly, vol. 17 no. 5, pp. 38-41, May 2006.

Feng, Zhen (Jane), Basani, Jayapaul, Kurwa, Murad, Bernard, David, and Krastev, Evstatin, "Modern 2D X-ray tackles BGA defects," Surface Mount Technology (SMT), vol. 22 no. 7, pp. 22-24, July 2008.

Fengfu, Yin, Zhenyu, Liu, Zhengang, Liu, Xuefeng, Wen, and Jinhui, Li, "The Strategy of Haier's Environmental Development," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 364.

Fengjiang, Wang, Xin, Ma, and Yiyu, Qian, "Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu Pb-Free Ball Grid Array (BGA) Solder Joint," Materials Science Forum, vol. 502, pp. 399-404, 2005.

Fenglian, Sun, Yang, Liu, and Yang, Liu, "A New Low-Ag Lead Free Solder Alloy and the Reliability," 2014 9th International Forum on Strategic Technology, Cox's Bazar, Bangladesh, Oct. 21-23, 2014, pp. 440-443.

Fengshun, Wu, Li, Chen, Boyi, Wu, and Yiping, Wu, "Effects of heating factors on the geometry size of unrestricted lead-free joints," Proceedings of 2004 International IEEE Conference on the Asian Green Electronics, Hong Kong, China, Jan 5-9, 2004, pp. 81-85.

Fengshun, Wu, Yanxiang, Hu, Yiping, Wu, Bing, An, and Jinsong, Zhang, "The Growth Behavior of Intermetallic Compound Layer at Solder/Cu Joint Interface During Soldering," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Fenner, M., Mackie, A., and Wilson, G., "New developments in high performance solder products for power die assemblies," European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Fenner, Mike, "How to choose and implement a Solder Paste for Pb-free," SMART Ireland Lead-Free Materials + Legislation Seminar, Dublin, Ireland, Sept. 23, 2004.

Fenner, Mike, "Solder paste: Winning the Pb-Free Challenge," SMART Group 6th Annual Lead-Free Seminar and Table-top Exhibition, High Wycombe, United Kingdom, Feb. 3, 2004.

Fenner, Mike, "Tutorial: Soldering Flip Chip and BGA Packages," Chip Scale Review , vol. xx no. xx, pp. xx-xx, Oct. 2001.

Fenner, Mike, "Understanding the impact of PB-free on solder paste," EPP Europe , Sept./Oct. 2003.

Fenner, Mike, "Wave Solder Fluxes," LEADOUT Hands On Lead-Free Workshop, Manchester, United Kingdom, June 21, 2006.

Fenton, Michael D., "Iron and Steel," Minerals Yearbook: Volume I. -- Metals and Minerals, 2003.

Ferdinandi, Frank, "Introduction of a New PCB Surface Finish for the Electronics Industry," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 841-846.

Ferdous, Sheikh F., and Adnan, Ashfaq, "Role of a single surface vacancy on the tensile stress-strain relations of single crystal Ni nanowire," Computational Materials Science, vol. 90, pp. 221-231, July 2014.

Ferguson, David, and Battelle, Bruce Monzyk, "Non-Polluting Metal Surface Finishing Pretreatment & Pretreatment/Conversion Coating," Plating & Surface Finishing , vol. 90 no. 4, pp. 66-75, Apr. 2003.

Ferguson, K. J., Telang, A., Lee, J. G., and Subramanian, K. N., "Microstructural effects on the behavior of Sn-Ag solder joints under repeated reverse stressing," Journal of Materials Science: Materials in Electronics, vol. 14 no. 3, pp. 157-164, Mar. 2003.

Ferguson, Patrick, and Newton, Paul G., "Cost-Effective SMT Assembly on Flexible Circuits Using Polymer Solder," Surface Mount International Conference & Exposition Proceedings of the Technical Program, San Jose, CA, Aug. 28-Sept. 1, 1994, pp. 326-330.

Fernandez, Francisco, Tang, Eddie, and Lu, Feng, "Selective Soldering Technology Selection," SMTA International Conference 2010, Orlando, FL, Oct. 24-28, 2010, pp. 977-985.

Fernandez, Jean Carla M., "Chemical and Physical Characterization Techniques in Highlighting Intermetallic Compound (IMC) Formation," 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 7-11, 2008, pp. xx-xx.

Fernandez, Raynier E., and Anselm, Martin K., "Thermal Reliability of Mixing Bismuth-Containing Solder Paste with SAC BGAs at Low Reflow Temperatures - Part 1," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 457-467.

Ferraguti, Lorenzo, "Achieving isothermal extrusion using billet mapping," Aluminium International Today, vol. 24 no. 2, pp. 38,40, Mar./Apr. 2012.

Ferrandon, C., de Crecy, F., Moreau, S., Yap, D., and Simon, G., "Solder Joint Fatigue Model for Large Silicon Interposers," 2013 European Microelectronics Packaging Conference, Grenoble, France, Sept. 9-12, 2013, pp. xx-xx.

Ferrao, Paulo, and Amaral, Jose, "Assessing the economics of auto recycling activities in relation to European Union Directive on end of life vehicles," Technological Forecasting and Social Change, vol. 73 no. 3, pp. 277-289, Mar. 2006.

Ferrari, Gary, "IPC-2221, Keeping pace with the times," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S22_04-1-S22_04-41.

Ferrer, Ernesto, Benedetto, Elizabeth, Freedman, Gary, Billaut, Francois, Holder, Helen, and Gonzalez, David, "Reliability of Partially Filled SAC305 Through-Hole Joints," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S29-02-1-S29-02-11.

Ferri, M., Suriano, F., Roncaglia, A., Solmi, S., Cerofolini, G. F., Romano, E., and Narducci, D., "Ultradense silicon nanowire arrays produced via top-down planar technology," Microelectronic Engineering, vol. 88 no. 6, pp. 877-881, June 2011.

Ferris, Richard (Tad), and Zhang, Hongjun, "China's Evolving RoHS Legal Regime," Circuits Assembly, vol. 17 no. 5, pp. 58-60, May 2006.

Ferris, Richard (Tad), and Zhang, Hongjun, "China's Evolving RoHS Legal Regime," Surface Mount Technology , vol. 20 no. 5, pp. 16, 18-19, May 2006.

Ferry, Allen, "Ready?," IEE Communications Engineer, vol. 3 no. 4, pp. 8, Aug./Sept. 2005.

Ferry, Allen, "Ready for RoHS?," the emc journal, no. 59, pp. 26-29, July 2005.

Feszty, Katalin, Murchison, Colin, Baird, Jim, and Jamnejad, Gholam, "Assessment of the quantities of Waste Electrical and Electronic Equipment (WEEE) in Scotland," Waste Management & Research, vol. 21 no. 3, pp. 207-217, June 2003.

Feszty, Katalin, and Calder, James, "E-waste legislation grows in Canada," EE Times Europe, Feb. 19, 2007.

Feszty, Katalin, and Calder, James, "E-waste legislation grows in Canada," Green SupplyLine, Feb. 19, 2007.

Feutelais, Y., Legendre, B., and Fries, S. G., "Thermodynamic evaluation of the system Germanium - Tin," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 20 no. 1, pp. 109-123, Mar. 1996.

Fickling, M., "Factors affecting availability of electronic metals," Transactions of the Institution of Mining & Metallurgy, Section C, vol. 97, pp. C42-C44, Mar. 1987.

Fiedler, B., Fine, M., Kao, K., and Keer, L., "Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance," Journal of Electronic Packaging , vol. 134 no. 3, pp. 031006-1-031006-7, Sept. 2012.

Fiedler, R., and Lang, A. R., "Dislocation Generation at Surfaces of Tin Single Crystals," Journal of Materials Science, vol. 7 no. 5, pp. 531-542, May 1972.

Fiedler, R., and Vagera, I., "On the Burgers Vectors in b-Sn Single Crystals," Physica status solidi. A, vol. 32 no. 2, pp. 419-424, Dec. 16, 1975.

Fiedler, T., and Ochsner, A., "On the anisotropy of adhesively bonded metallic hollow sphere structures," Scripta Materialia, vol. 58 no. 8, pp. 695-698, Apr. 2008.

Field, Karen, "A Dog's RF Tag Fails - Is RoHS the Culprit?," Electronics Weekly , Nov. 5, 2007.

Field, Karen, "Did Tin Pest Cause Napoleon to Experience a Wardrobe Malfunction??," Electronics Weekly, Nov. 8, 2007.

Field, Karen, "RoHS Poses an Ethical Dilemma for Some Engineers," Electronics Weekly, May 20, 2008.

Fields, Julie, "Jumping Off the Lead-free Cliff," Surface Mount Technology (SMT) , vol. 17 no. 1, pp. 116, Jan. 2003.

Fields, Julie, "Process & Equipment Change Considerations for Lead-Free Wave Soldering," Lead-Free Connection, vol. 3 no. 1, pp. 9-11, May 2006.

Fields, Julie, "The New Era of Wave Soldering," Surface Mount Technology (SMT) , vol. 17 no. 4, pp. 26-28, Apr. 2003.

Fields, R. J., Low III, S. R., and Lucey Jr., G. K., "Physical and Mechanical Properties of Intermetallic Compounds Commonly Found in Solder Joints," The Metal Science of Joining, Cincinnati, OH, Oct. 20-24, 1991, pp. 165-173.

Filho, W.C. Maia, Brizoux, M., Fremont, H., and Danto, Y., "Torsion test applied for reballing and solder paste volume evaluation," Microelectronics Reliability, vol. 47 no. 9-11, pp. 1663-1667, Sept.-Nov. 2007.

Fili, John, "Compliant terminals wield a solution for lead-free PCB assembly," Connector Specifier, vol. 22 no. 3, pp. 11-12, Mar. 2006.

Filimonov, Sergey N., and Hervieu, Yuri Yu., "Model of step propagation and step bunching at the sidewalls of nanowires," Journal of Crystal Growth, vol. 427, pp. 60-66, Oct. 1, 2015.

Filippov, V. V., "A Procedure for Determining Components of the Specific Electrical Conductivity Tensor of Anisotropic Semiconductor Films," Instruments and Experimental Techniques, vol. 51 no. 4, pp. 630-633, July 2008.

Fillion, Ray, Zhang, Tan, and Woychik, Charles, "Elimination of Flip Chip Electromigration Failures using Embedded Chip Build-Up Technology," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 7-14.

Filz, Susan, "Proving You Can Do It: One Compaby's Lead Free Journey," IPC Review , vol. 48 no. 8, pp. 12-14, Sept. 2007.

Fima, Przemyslaw, Nowak, Rafal, and Sobczak, Natalia, "Effect of metal purity and testing procedure on surface tension measurements of liquid tin," Journal of Materials Science, vol. 45 no. 8, pp. 2009-2014, Apr. 2010.

Fima, Przemyslaw, and Kucharski, Marian, "The surface tension and density of Ag-Bi-Sn alloys," International Journal of Materials Research, vol. 99 no. 2, pp. 159-160, Feb. 2008.

Fima, Przemyslaw, Wiater, Katarzyna, and Kucharski, Marian, "The surface tension and density of the Cu-Ag-In alloys," Surface Science, vol. 601 no. 16, pp. 3481-3487, Aug. 15, 2007.

Fima, Przemyslaw, Gancarz, Tomasz, Pstrus, Janusz, Bukat, Krystyna, and Sitek, Janusz, "Thermophysical properties and wetting behavior on Cu of selected SAC alloys," Soldering & Surface Mount Technology, vol. 24 no. 2, pp. xx-xx, 2012.

Fima, Przemyslaw, Berent, Katarzyna, Pstrus, Janusz, and Gancarz, Tomasz, "Wetting of Al pads by Sn-8.8Zn and Sn-8.7Zn-1.5(Ag, In) alloys," Journal of Materials Science, vol. 47 no. 24, pp. 8472-8476, Dec. 2012.

Fima, Przemyslaw, Gasior, Wladyslaw, Sypien, Anna, and Moser, Zbigniew, "Wetting of Cu by Bi-Ag based alloys with Sn and Zn additions," Journal of Materials Science, vol. xx no. x, pp. xx-xx, xxxx.

Fima, Przemyslaw, Gancarz, Tomasz, Pstrus, Janusz, and Sypien, Anna, "Wetting of Sn-Zn-xIn (x = 0.5, 1.0, 1.5 wt%) Alloys on Cu and Ni Subrates, Journal of Materials Engineering and Performance, vol. 21 no. 5, pp. 595-598, May 2012.

Finet, Etienne, "RoHS - WEEE - REACH: Has this world gone crazy?," Sept. 25, 2006.

Fink, Ed, "REACH: The Shot (to be) Heard Around the World," Power Electronics Technology, vol. 34 no. 11, pp. 48, Nov. 2008.

Fink, Herman J., Haley, Stephen B., Giuraniuc, Claudiu V., Kozhevnikov, Vladimir F., and Indekeu, Joseph O., "Boundary conditions, dimensionality, topology and size dependence of the superconducting transition temperature," Molecular Physics, vol. 103 no. 21, pp. 2969-2978, 2005.

Finley, D. W., Ray, U., Artaki, I., Vianco, P., Shah, S., Reyes, A., and Haq, M., "Assessment of Nickel-Palladium Finished Components for Surface Mount Assembly Applications," Surface Mount International Proceedings of the Technical Program, San Jose, CA, Aug. 29-31, 1995, pp. 941-953.

Finley, D. W., Ray, U., Artaki, I., Vianco, P., Shah, S., Reyes, A., and Haq, M., "Assessment of NiPd Finished Components for Surface Mount Assembly Applications," Sandia Report SAND-95-1639C, Aug. 1995.

Finn, Alan, "Playing safe: Changing the rules on electronics waste," Engineering Technology, vol. 6 no. 10, pp. 24-25, Dec. 2003/Jan. 2004.

Finstad, Mark, "Finish Options: Just the Pads, Ma'am, and a RoHS Gold Rush," CircuiTree, vol. 21 no. 3, pp. xx-xx, Mar. 2008.

Firdaus, W., Soegijono, B., Sudarmadji, A., and Trisnadi, A. D., "Characterization of Bismuth in Sn-based as Safe Environment Solder Material," AIP Conference Proceedings, vol. 2242, pp. 020011-1-020011-6, 2020. https://doi.org/10.1063/5.0007974

Firmstone, M. G., Bartholomew, P. M., Paterson, G., Dietz, R., and Robinson, P., "Benefits of Thermoplastic Conductive Adhesive in Advanced Electronics Packaging Applications," Microelectronics International, vol. 14 no. 2, pp. xx-xx, 1997.

Fischer, Gerd, and Esser, Bob, "Tin Whiskers," 2004-2007.

Fischer, John, Lusk, Loretta, Hinkley, Doug, Dowd, Mike, Boske, Greg, Plott, Mike, and Moffitt, James, "Reliability Assessment of Antimony Removal from Tin-Lead Solders," Proceedings of the Technical Program NEPCON West '92, Volume II, Anaheim, CA, Feb. 23-27, 1992, pp. 1056-1069.

Fischer, Terry, Takeda, Yoshiyuki, Desai, Nitin, and Zollo, James, "Characterization of Environment-Friendly Halogen-Free Materials for Radio Frequency Electronics Use," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Fisenko, S. P., and Borovik, F. N., "Nucleation in a Catalytic Nanodroplet and Growth of Nanowires," Journal of Technical Physics (USSR), vol. 54 no. 2, pp. 246-252, Feb. 2009. https://doi.org/10.1134/S1063784209020145

Fishburn, Jim, "Advances in Lead-free Soldering and Automatic Inspection," Surface Mount Technology (SMT), vol. 16 no. 11, pp. xx-xx, Nov. 2002.

Fishburn, Jim, "Advances in lead-free soldering and automatic inspection," Dataweek , vol. xx no. xx, pp. xx-xx, July 25, 2007.

Fisher, Jack, "The Impact of Non-Brominated Flame Retardants on PWB Manufacturing," IPC Review, vol. xx no. x, pp. 16, May 2000.

Fisher, John, "What do the Roadmaps Say? A Look at the IPC International Roadmap for Interconnection Technology and the NEMI Technology Roadmap," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Fisher, Larry, "Environmental and Mechanical Stress Testing of Pb-Free and SnPb Solder," Circuits Assembly, vol. 17 no. 9, pp. 54-57, Sept. 2006.

Fisher, Michael M., "Feedstock Recycling Technologies in the Sustainable Recycling of Plastics from End-of-Life Electrical and Electronic Products," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 292-297.

Fisher, Michael M., "Standards Development for Reporting of Declarable Substances," Standardization News, vol. 33 no. 6, pp. 30-33, June 2005.

Fisher, R. M., Darken, L. S., and Carroll, K. G., "Accelerated Growth of Tin Whiskers," Acta Metallurgica, vol. 2 no. 3, pp. 368-369,371-373, May 1954.

Fister, Julius C., and Zarlingo, S. Paul, "Solderability Performance of Tin Coated Copper Alloy Strip for Connector Components," 1991 Proceedings 41st Electronic Components Conference , Atlanta, GA, May 11-16, 1991, pp. 229-233.

Fitzgerald, Kelsey, Marshall, Jay, Ryno, Teneil, Kelley, Andrew, and Voyles, Clay, "Effects of Aging on the Secondary Intermetallic Layer (Cu3Sn1) for SAC305 Solder," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 372-381.

Fitzka, Michael, Catoor, Dhiraj, Irrasch, Daniel, Reiterer, Markus, and Mayer, Herwig, "Fatigue testing of thin CoNiCr wire up to 10^10 cycles," International Journal of Fatigue, vol. 98, pp. 92-100, May 2017. https://doi.org/10.1016/j.ijfatigue.2017.01.027

Fitzpatrick, Colin, Walsh, Joseph, and Grout, Ian, "Environmentally Superior Implementation of Electronic Hardware Through Modular Programmable Logic Devices & Eco Design," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 228-232.

Fitzpatrick, Colin, Hickey, Stewart, Schischke, Karsten, and Maher, Paul, "Sustainable life cycle engineering of an integrated desktop PC; a small to medium enterprise perspective," Journal of Cleaner Production, vol. 74, pp. 155-160, July 1, 2014.

Fix, Andreas R., Nuchter, Wolfgang, and Wilde, Jurgen, "Microstructural changes of lead-free solder joints during long-term ageing, thermal cycling and vibration fatigue," Soldering & Surface Mount Technology, vol. 20 no. 1, pp. 13-21, 2008.

Fix, Andreas R., Lopez, Gabriel A., Brauer, Ingo, Nuchter, Wolfgang, and Mittemeijer, Eric J., "Microstructural Development of Sn-Ag-Cu Solder Joints," Journal of Electronic Materials, vol. 34 no. 2, pp. 137-142, Feb. 2005.

Fjelstad, Joe, "Component selection for SAFE designs," Global SMT and Packaging , vol. 14 no. 6, pp. 4-5, June 2014.

Fjelstad, Joe, "Electronic Assembly with Solder: an Unblinking Look at "The Devil We Know"," Surface Mount Technology (SMT), vol. 29 no. 7, pp. 8,10-12,14-15, July 2014.

Fjelstad, Joe, "Electronic Interconnections No. 8 - Lead-free - An Exercise in "Green Washing"," PCB007, Feb. 22, 2006.

Fjelstad, Joe, "Hot Topics: Solving an Industry Dilemma with Emerging Technologies," SMT Web Exclusive Article.

Fjelstad, Joe, "Impact of Lead-Free on PCB Design," SiliconPipe.

Fjelstad, Joe, "Lead-Free Lesson...Definitely Not Free," PCB007, July 7, 2008.

Fjelstad, Joe, "Occam update," Global SMT and Packaging, vol. 7 no. 11, pp. 4, Nov. 2007.

Fjelstad, Joe, "REACH for the sky...," Global SMT and Packaging, vol. 8 no. 4, pp. 4, Apr. 2008.

Fjelstad, Joe, "Reasoning with RoHS - an argument for exempting lead used in electronic solders," Global SMT and Packaging, vol. 6 no. 6, pp. 6, June/July 2006.

Fjelstad, Joe, "RoHS + 5 = What?," Global SMT and Packaging, vol. 11 no. 7 pp. 4-5, July 2011.

Fjelstad, Joe, "Solder alloy free electronics (SAFE) assembly - Gaining interest and building some momentum," Global SMT and Packaging, vol. 12 no. 11, pp. 4-5, Nov. 2012.

Fjelstad, Joe, "Solder assembly - A steely-eyed look at "the devil we know"," Global SMT and Packaging, vol. 14 no. 1, pp. 33-35, Jan. 2014.

Fjelstad, Joe, "The unaccounted costs of the lead free mandate," Global SMT & Packaging, vol. 6 no. 4, pp. 5-6, Apr. 2006.

Fjelstad, Joe, "Tin Whiskers = a lead-free 'time bomb'?," Global SMT & Packaging, vol. 5 no. 6, pp. 4, June/July 2005.

Fjelstad, Joe, "Whiskers - a coming of age event in the life of electronics too?," Global SMT and Packaging, vol. 11 no. 11, pp. 88-89, Nov. 2011.

Fjelstad, Joseph, "An Alternative Process for Assembling Electronic Products without Solder," Advancing Microelectronics, vol. 36 no. 4, pp. 18-21, July/Aug. 2009.

Fjelstad, Joseph, "Commentary: Note to European Union-Repeal RoHS!," Electronic Business, July 25, 2006.

Fjelstad, Joseph, "Doing more with less - The Occam Process," EMasia, Sept. 2007.

Fjelstad, Joseph, "Environmentally friendly assembly of robust electronics without solder," Circuit World, vol. 34 no. 2, pp. 27-33, 2008.

Fjelstad, Joseph, "Finishing Touches for Flexible Circuits," CircuiTree, vol. 17 no. 6, pp. 50, June 2004.

Fjelstad, Joseph, "Flexible Thinking," Circuitree, vol. 19 no. 6, pp. xx-xx, June 2006.

Fjelstad, Joseph, "Flexible Thinking: Flexible Circuit Assembly a la Occam," CircuiTree, vol. 21 no. 2, pp. xx-xx, Feb. 2008.

Fjelstad, Joseph, "Flexible Thinking -- Joe Fjelstad: The Death of Common Sense," CircuiTree, vol. 15 no. 7, pp. xx, July 2002.

Fjelstad, Joseph, "Flexible Thinking: Monolithic Molded Flex Assembly," CircuiTree , vol. 21 no. 4, pp. xx-xx, Apr. 2008.

Fjelstad, Joseph, "Interconnection strategies for high-density printed circuits - an overview," Circuit World, vol. 28 no. 1, pp. 6-9, 2001.

Fjelstad, Joseph, "Is Leadfree Solder The Answer To Our Environmental Problems?," Electronic Design, vol. 49 no. 15, pp. 42, July 23, 2001.

Fjelstad, Joseph, "Method for the Manufacture of an Aluminum Substrate PCB and its Advantages," IPC APEX Expo 2014, Las Vegas, NV, Mar. 25-27, 2014, pp. xx-xx.

Fjelstad, Joseph, "OCCAM results in simplicity without solder," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Apr. 14, 2008.

Fjelstad, Joseph, "Solder-free assembly - A more environmentally friendly alternative to lead-free," Global SMT and Packaging, vol. 7 no. 9, pp. 18, 20, 22, Sept. 2007.

Fjelstad, Joseph, "Solderless Assembly and Interconnection of Electronic Packages," 2008 Pan Pacific Microelectronics Symposium & Exhibit, Kauai, HI, Jan. 22-24, 2008, pp. xx-xx.

Fjelstad, Joseph, "Solderless Assembly of Electronic Products - A More Reliable and More Cost Effective Approach to Electronics Manufacturing?," IEEE Vehicle Power and Propulsion Conference, Dearborn, MI, Sept. 7-10, 2009, pp. 11-16.

Fjelstad, Joseph, "The Occam Process: A Package-first Approach to Electronics Assembly," Advanced Packaging, vol. 16 no. 7, pp. 16, Oct. 2007.

Fjelstad, Joseph, "The Occam Process: A New Paradigm of Promise for Printed Circuit Manufacturing," CircuiTree, vol. 20 no. 11, pp. xx-xx, Nov. 2007.

Flanders, D. R., Jacobs, E. G., and Pinizzotto, R. F., "Activation Energies of Intermetallic Growth of Sn-Ag Eutectic Solder on Copper Substrates," Journal of Electronic Materials, vol. 26 no. 7, pp. 883-887, July 1997.

Flandorfer, H., Saeed, U., Luef, C., Sabbar, A., and Ipser, H., "Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag-Sn, Cu-Sn and Ni-Sn intermetallic compounds," Thermochimica Acta, vol. 459 no. 1-2, pp. 34-39, July 1, 2007.

Flandorfer, Hans, Sabbar, Abdelaziz, Luef, Christoph, Rechchach, Meryem, and Ipser, Herbert, "Enthalpies of mixing of liquid Bi-Cu and Bi-Cu-Sn alloys relevant for lead-free soldering," Thermochimica Acta, vol. 472 no. 1-2, pp. 1-10, June 10, 2008.

Flandorfer, Hans, Luef, Christoph, and Saeed, Usman, "On the temperature dependence of the enthalpies of mixing in liquid binary (Ag, Cu, Ni)-Sn alloys," Journal of Non-Crystalline Solids, vol. 354 no. 26, pp. 2953-2972, May 15, 2008.

Flaskerud, Paul, and Mann, Rick, ""Silver Plated Lead Frames" for Large Molded Packages," 12th Annual Reliability Physics Symposium, Las Vegas, NV, Apr. 2-4, 1974, pp. 211-222.

Flechtmann, Andreas, and Thumm, Andreas, "High Quality Reflow Soldering with Vapor Phase: The New Approach of Vapor Phase Technology," International Conference on Soldering and Reliability , Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

Fleeman, Jerome, and Dienes, G. J., "Effect of Reactor Irradiation on the White-to-Grey Tin Transformation," Journal of Applied Physics, vol. 26 no. 6, pp. 652-654, June 1955.

Fleshman, Collin, Song, Rui-wen, and Duh, Jenq-Gong, "Improving shear test performance of SAC305/OSP Cu solder joints by modifying microstructure with minor Ni doping before and after aging," Materials Chemistry and Physics, vol. 245, pp. 122761-1-122761-5, Apr. 15, 2020.

Fleshman, Collin, Chen, Wei-Yu, Chou, Tzu-Ting, Huang, Jia-Hong, and Duh, Jenq-Gong, "The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/OSP Cu solder joint," Materials Chemistry and Physics , vol. 189, pp. 76-79, Mar. 1, 2017.

Fleshman, Collin, and Duh, Jenq-Gong, "The Variation of Microstructure and the Improvement of Shear Strength in SAC1205-xNi/OSP Cu Solder Joints Before and After Aging," Journal of Electronic Materials, vol. 49 no. 1, pp. 196-201, Jan. 2020.

Fletcher, Adam, "Caveat Emptor!," Components in Electronics, vol. xx no. xx, pp. xx-xx, Nov. 2006.

Fletcher, Austin, "Hard Chromium Plating," Metal Finishing, vol. 40. no. 7, pp. 355-358, July 1942.

Flinders, Randy, "Halogen-Free Electronics An Overview (presentation)," 2008 IEEE Symposium on Product Compliance Engineering, Austin, TX, Oct. 20-22, 2008, pp. xx-xx.

Floro, Jerrold A., Chason, Eric, Cammarata, Robert C., and Srolovitz, David J., "Physical Origins of Intrinsic Stresses in Volmer-Weber Thin Films," MRS Bulletin, vol. 27 no. 1, pp. 19-25, Jan. 2002.

Flotgen, C., Pawlak, M., Pabo, E., van de Wiel, H. J., Hayes, G. R., and Dragol, V., "Wafer bonding using Cu-Sn intermetallic bonding layers," Microsystem Technologies, vol. 20 no. 4-5, pp. 653-662, Apr. 2014.

Flower, Gail, "2005 Industry Vision Forecast," Surface Mount Technology (SMT) , vol. 19 no. 1, pp. 32-35, Jan. 2005.

Flower, Gail, "2006 Industry Vision Forecast," Surface Mount Technology (SMT) , vol. 19 no. 12, pp. 14-16, 18, 20, Dec. 2005.

Flower, Gail, "2007 Industry Vision Forecast," Surface Mount Technology (SMT) , vol. 20 no. 12, pp. 20-27, Dec. 2006.

Flower, Gail, "A Breath of Fresh Air," Advanced Packaging, Sept. 2005, pp. 7.

Flower, Gail, "Greening Up," SMT Web Exclusive Article.

Flower, Gail, "Inside Reflow," Surface Mount Technology (SMT), vol. 22 no. 1, pp. 10-14, Jan. 2008.

Flower, Gail, "It's Getting Easier to Be Green," Surface Mount Technology (SMT) , vol. 20 no. 1, pp. xx-xx, Jan. 2006.

Flower, Gail, "Lead-free: Ready or Not," Surface Mount Technology (SMT), vol. 19 no. 2, pp. xx-xx, Feb. 2005.

Flower, Gail, "Lead-free Reliability: The Big Picture," Surface Mount Technology (SMT), vol. 21 no. 6, pp. 6, June 2007.

Flower, Gail, "Movement Toward Lead-free," Surface Mount Technology (SMT) vol. 17 no. 6, pp. 4, June 2003.

Flower, Gail, "Sockets Meet Future Technology Challenges: Part I," Advanced Packaging, vol. 16 no. 2, pp. 20-21, 23, 25-26, Mar. 2007.

Flower, Gail, "Solder Paste Basics: A Round-up," Surface Mount Technology (SMT) , vol. 23 no. 1, pp. 12,14,24, Jan.-Feb. 2009.

Flower, Gail, "The Best Way to Spend a Summer," Surface Mount Technology (SMT) , vol. 22 no. 9, pp. 6, Sept. 2008.

Flower, Gail, "WEEE Gets Six-month Extension, But Will That Suffice?," Surface Mount Technology (SMT), vol. 19 no. 5, pp. xx-xx, May 2005.

Flower, Gail, "Who Will Regulate Lead-free Compliance?," Advanced Packaging , vol. 13 no. 7, pp. 7, July 2004.

Flower, Gail, "Willingness to Take on Big Challenges: REACH and SIN," SMT Web Exclusive Article.

Fluhmann, W., Puippe, J. Cl., Saxer, W., and Chauvy, J. D., "Properties and Applications of Electrodeposited Cu-Zn-Sn and Ag-Sn Alloys," American Electroplaters' Society SUR/FIN '82 69th Annual Technical Conference, San Francisco, CA, June 20-24, 1982, session P-1 pp. xx-xx.

Fobelets, K., Ding, P., Kiasari, N. Mohseni, and Durrani, Z., "Electrical Transport in Polymer-Covered Silicon Nanowires," IEEE Transactions on Nanotechnology, vol. 11 no. 4, pp. 661-665, July 2012.

Fobelets, K., Meghani, M., and Li, C., "Influence of Minority Carrier Gas Donors on Low-Frequency Noise in Silicon Nanowires," IEEE Transactions on Nanotechnology, vol. 13 no. 6, pp. 1176-1180, Nov. 2014.

Fockenberger, Harald, Ho, Terence, Pfennich, Gerhard, Shangguan, Dongkai, and Tat, Leow Ching, "Pb-free Design and Process Optimization for PIH," Advanced Packaging, vol. 14 no. 10, pp. 32-34, Oct. 2005.

Fockenberger, Harald, Ho, Terence, Pfennich, Gerhard, Shangguan, Dongkai, and Tat, Leow Ching, "Pb-free Design and Process Optimization for PIH," Surface Mount Technology (SMT), vol. 19 no. 10, pp. xx-xx, Oct. 2005.

Foerster, J., Schuderer, B., Haeuser, M., Kallensee, O., and Gross, Th., "Hillock Formation, Metal Lifting and Voiding of an AlCu Metallization due to Temperature Treatment," AIP Conference Proceedings, vol. 741, pp. 39-44, 2004.

Fogarasi, Szabolcs, Imre-Lucaci, Florica, Imre-Lucaci, Arpad, and Ilea, Petru, "Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation," Journal of Hazardous Materials , vol. 273, pp. 215-221, May 30, 2014.

Fogarasi, Szabolcs, Imre-Lucaci, Florica, Ilea, Petru, and Imre-Lucaci, Arpad, "The environmental assessment of two new copper recovery processes from Waste Printed Circuit Boards," Journal of Cleaner Production, vol. 54, pp. 264-269, Sept. 1, 2013.

Fohtung, E., Kim, J. W., Chan, Keith T., Harder, Ross, Fullerton, Eric E., and Shpyrko, O. G., "Probing the three-dimensional strain inhomogeneity and equilibrium elastic properties of single crystal Ni nanowires," Applied Physics Letters , vol. 101 no. 3, pp. 033107-1-033107-4, 2012.

Foley, J. C., Gickler, A., Leprevost, F. H., and Brown, D., "Analysis of Ring and Plug Shear Strengths for Comparison of Lead-Free Solders," Journal of Electronic Materials, vol. 29 no. 10, pp. 1258-1263, Oct. 2000.

Fontana, Pietro, "SEM Images of a 27 Year Old Sample Containing Tin Whiskers in Comparison to Salt (NaCl) Whiskers," June 2008.

Fontanella, Ethel L., and DeBlois, R. W., "Techniques for Handling Metallic Whiskers," Review of Scientific Instruments, vol. 30 no. 11, pp. 982, Nov. 1959.

Fontenay, Frank, Moller, Per, and Andersen, Lasse B., "Corrosion Resistance and Microstructure of Electrolytic Zinc Composite Coatings," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Fontenay, Frank, "Electrodeposited Zinc and Zinc Alloy Coatings and their Corrosion Resistance: Part 1," Galvanotechnik, vol. xx no. xx, pp. 2534-2541, Oct. 2002.

Foo, Raymond, "Environmental science or politics?," EMasia, Mar. 2008.

Foo, S. P., Siow, K.,S., and Jalar, A., "Synthesizing SnAgCu Nanoparticles by Electrodeposition of Reverse Microemulsion Electrolyte," 2014 IEEE International Conference on Semiconductor Electronics, Kuala Lumpur, Malaysia, Aug, 27-29, 2014, pp. 513-516.

Forbes, David, Hubbard, Seth, Raffaelle, Ryne, and McNatt, Jeremiah S., "Au-catalyst-free epitaxy of InAs nanowires," Journal of Crystal Growth , vol. 312 no. 8, pp. 1391-1395, Apr. 1, 2010.

Forg, Eric, "Don't Be Afraid of Lead-free," Surface Mount Technology (SMT) , vol. 18 no. 10, pp. 20, Oct. 2004.

Forg, Eric, "Wave Soldering Lead-Free Magazine, vol. 2.

Forman, Robert S., "New Process and Cost Reduction Developments in Tin Silver Electroplating of Wafers," 2011 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, Kamuela, HI, Jan. 18-20, 2011, pp. xx-xx.

Forman, Robert S., and Minogue, Gerard, "The Basics of Wafer-Level AuSn Soldering," Chip Scale Review , vol. xx no. xx, pp. xx-xx, Oct. 2004.

Fornes, Timothy D., and Hough, Paul W., "Highly Conductive Adhesives via Novel Heterogeneous Structures," European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Forno, Richard, "Tin Whiskers: The Next Y2K Problem?," Inforwarrior, Jan. 20, 2005.

Forsberg, Birgitta, "Component compliance: Manufacturers start phasing out solder containing lead," San Francisco Chronicle, pp. E-1, Feb. 27, 2005.

Forsten, Atso, Steen, Hector, Wilding, Ian, and Friedrich, Jurgen, "Development and validation of lead-free wave soldering process," Soldering & Surface Mount Technology, vol. 12 no. 3, pp. 29-34, 2000.

Forsten, Atso, "Development and Validation of Leadfree Wave Soldering Process," Lead-Free Soldering Seminar 2001, High Wycombe, United Kingdom, Feb. 15, 2001.

Forster, Fritz, and Scheil, Erich, "Untersuchung des zeitlichen Ablaufes von Umklappvorgangen in Metallen," Zeitschrift fur Metallkunde, vol. 32 no. 6, pp. 165-173, June 1940.

Forsyth, P. J. E., "Slip-Band Damage and Extrusion," Proceedings of the Royal Society of London, Series A, Mathematical and Physical Sciences, vol. 242 no. 1229, pp. 198-202, Oct. 29, 1957.

Forsythe, Thomas M., "Cleaning Implications of Lead-Free Assembly and Packaging," 2005 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Forsythe, Thomas N., "Cleaning implications of lead-free assembly and packaging - part 1," Global SMT and Packaging, vol. 5 no. 2, pp. 38-40, Feb. 2005.

Forsythe, Thomas M., "Cleaning implications of lead-free assembly and packaging - part 2," Global SMT and Packaging, vol. 5 no. 3, pp. 17-20, Mar. 2005.

Forsythe, Thomas M., "Cleaning Issues Associated with Lead Free Soldering Materials Phase II," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Forsythe, Thomas M., "Cleaning Issues Associated with Lead Free Soldering Materials Phase II," Lead-Free Magazine, vol. 6, May 2006.

Forsythe, Thomas M., "How to clean lead-free materials," Global SMT and Packaging, vol. 6 no. 8, pp. 10-12, 14-15, Sept. 2006.

Forsythe, Tom, "Challenges and Laws of Lead-free Cleaning," Surface Mount Technology (SMT), vol. 20 no. 6, pp. xx-xx, June 2006.

Forsythe, Tom, "Challenges in Lead-Free Cleaning," Lead-Free Magazine, vol. 7, Nov. 2006.

Forsythe, Tom, "Commonly Asked Lead-free Cleaning Questions," Advanced Packaging , vol. 15 no. 3,, pp. 18, Mar. 2006.

Forsythe, Tom, "No lead - more cleaning," emsnow, Aug. 26, 2004.

Fort, D., Pecharsky, V. K., and Gschneidner Jr., K. A., "Solid state electrotransport purification of dysprosium," Journal of Alloys and Compounds, vol. 226 no. 1-2, pp. 190-196, Aug. 1, 1995.

Fortier, Aleksandra, and Pecht, Michael G., "A perspective of the IPC report on lead-free electronics in military/aerospace applications," Microelectronics Reliability, vol. 69, pp. 66-70, Feb. 2017.

Fortier, Aleksandra, and Pecht, Michael G., "Comparative Study of Metal Films and Their Affinity for Metal Whisker Growth," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 5, pp. 739-747, May 2012.

Fortier, Aleksandra, Kong, Fanrong, and Kovacevic, Radovan, "Fundamental FEM Modeling Approach of Residual Stress Propagation in Sn-Based Electroplated Films Prone to Sn Whiskers Growth," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 6 no. 5, pp. 805-813, May 2016.

Fortier, Aleksandra, and Kovacevic, Radovan, "Internal Microstructure Investigation of Tin Whisker Growth Using FIB Technology," Journal of Electronic Materials, vol. 41 no. 8, pp. 2029-2034, Aug. 2012.

Forton, O. T., Harder, M. K., and Moles, N. R., "Value from shredder waste: Ongoing limitations in the UK," Resources, Conservation and Recycling, vol. 46 no. 1, pp. 104-113, Jan. 2006.

Forton, Osric T., McGrady, Lucas, Singh, M. M., Taylor, E. R. M., Moles, Norman R., and Harder, Marie K., "Characterisation of rotary kiln residues from the pyrolysis of shredder residues: Issues with lead," Journal of Analytical and Applied Pyrolysis , vol. 79 no. 1-2, pp. 395-402, May 2007.

Fossum, A. F., Vianco, P. T., Neilsen, M. K., and Pierce, D. M., "A Practical Viscoplastic Damage Model for Lead-Free Solder," Journal of Electronic Packaging, vol. 128 no. x, pp. 71-81, Mar. 2006.

Foster, Dan, "IPC Lead-Free Acceptability Requirements for Electronics Assemblies," IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics, Raleigh, NC, Mar. 11-12, 2008, pp. xx-xx.

Fothergill, Jay, "Scrap Mining: An Overview of Metal Recycling in Canada," Canary Institute, Oct. 2004.

Fouassier, O., Heintz, J.-M., Chazelas, J., Geffroy, P.-M., and Silvain, J.-F., "Microstructural evolution and mechanical properties of SnAgCu alloys," Journal of Applied Physics, vol. 100 no. 4, pp. 043519-1-043519-8, Aug. 15, 2006.

Fouassier, Olivier, Chazelas, Jean, and Silvain, Jean-Francois, "Conception of a consumable copper reaction zone for a NiTi/SnAgCu composite material," Composites Part A: Applied Science and Manufacturing, vol. 33 no. 10, pp. 1391-1395, Oct. 2002.

Fouda, A. N., and Eid, E. A., "Influence of ZnO nano-particles addition on thermal analysis, microstructure evolution and tensile behavior of Sn-5.0 wt% Sb-0.5 wt% Cu lead-free solder alloy," Materials Science and Engineering: A, vol. 632, pp. 82-87, Apr. 24, 2015.

Foullon, Heinrich Baron V., "Ueber krystallisirtes Zinn," Jahrbuch der Kaiserlich-Koniglichen Geologischen Reichsanstalt, vol. 34 no. 2, pp. 367-384, 1884.

Fournelle, Raymond A., "Lead-Free Solders and Processing Issues in Microelectronics," JOM , vol. 55 no. 6, pp. 49, June 2003.

Fournelle, Raymond A., "Lead-Free Solders and Processing Issues Relevant to Microelectronics Packaging," JOM, vol. 56 no. 6, pp. 33, June 2004.

Fournier, Steve, and Tebay, Jamie, "Lead-free: Upgrading Thermoplastics for RoHS," Surface Mount Technology (SMT), vol. 20 no. 12, pp. 36-37, Dec. 2006.

Foust, Jeff, "Mexican Satellite Failure: Possible Link to Past Problem," Space.com, Aug. 30, 2000.

Fouzder, Tama, Gain, Asit Kumar, Chan, Y. C., Sharif, A., and Yung, Winco K. C., "Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads," Microelectronics Reliability, vol. 50 no. 12, pp. 2051-2058, Dec. 2010.

Fouzder, Tama, Chan, Y. C., and Chan, Daniel K., "Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin-silver-copper (Sn-Ag-Cu) solders on silver (Ag) surface-finished copper (Cu) substrates," Journal of Materials Science: Materials in Electronics, vol. 25 no. 12, pp. 5375-5387, Dec. 2014.

Fouzder, Tama, Shafiq, Ismathullakhan, Chan, Y. C., Sharif, A., and Yung, Winco K. C., "Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads," Journal of Alloys and Compounds, vol. 509 no. 5, pp. 1885-1892, Feb. 3, 2011.

Fouzder, Tama, Li, Qingqian, Chan, Y. C., and Chan, Daniel K., "Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin-silver-copper (Sn-Ag-Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates," Journal of Materials Science: Materials in Electronics , vol. 25 no. 9, pp. 4012-4023, Sept. 2014.

Fouzder, Tama, Chan, Y. C., and Chan, Daniel K., "Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Based Composite Solders on Cu and Au/Ni Metallized Cu Substrates," 2014 IEEE 16th Electronics Packaging Technology Conference, Singapore, Dec. 3-5, 2014, pp. 69-74.

Fouzder, Tama, Li, Qingqian, Chan, Y. C., and Chan, Daniel K., "Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin-zinc-bismuth (Sn-8Zn-3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates," Journal of Materials Science: Materials in Electronics, vol. 25 no. 6, pp. 2529-2539, June 2014.

Fouzder, Tama, Chan, Y. C., and Chan, Daniel K., "Microstructure and Plating Thickness Analysis of Different Surface Finished Plated Printed Circuit Boards," 2012 IEEE 14th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 5-7, 2012, pp. 1-3.

Fowler Jr., C. A., Fryer, E. M., and Treves, D., "Domain Structures in Iron Whiskers as Observed by the Kerr Method," Journal of Applied Physics, vol. 32 no. 3, pp. 296S-297S, Mar. 1961.

Fowler Jr., C. A., Fryer, E. M., and Treves, David, "Observation of Domains in Iron Whiskers Under High Fields," Journal of Applied Physics, vol. 31 no. 12, pp. 2267-2272, Dec. 1960.

Fowler, H. A., Marton, L., Simpson, J. Arol, and Suddeth, J. A., "Electron Interferometer Studies of Iron Whiskers," Journal of Applied Physics, vol. 32 no. 6, pp. 1153-1155, June 1961.

Fox, John, "REACH for Electronics Manufacturers: A Systematic Approach to Managing Product and Supply Chain Risks," 2008 IPC Midwest Show Proceedings , Schaumburg, IL, Sept. 23-24, 2008, pp. xx-xx.

Fox, John, "The cost of noncompliance: Nine ways RoHS can impact your company's bottom line," Green SupplyLine, Aug. 28, 2006.

Fox, W., Gumpert, B., and Woody, L., "Development of Processing Parameters for Soldering Lead-Free Ball Grid Arrays Using Tin-Lead Solder," SMTA International 2012 Conference Proceedings , Orlando, FL, Oct. 14-18, 2012, pp. 878-885.

Fox, William, and Woody, Linda, "Conformal Coatings for Tin Whisker Risk Management," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S11_01-1-S11_01-12.

Frank, F. C., "On Tin Whiskers," The Philosophical Magazine, vol. 44 Seventh Series no. 355, pp. 854-860, Aug. 1953. https://doi.org/10.1080/14786440808520351

Frank, Udo E., "Lead-Free Solder and X-ray Inspection," Lead-Free Connection , vol. 1 no. 2, pp. 7-9, Nov. 2004.

Franke, Jorg, Dohle, Rainer, Schusler, Florian, Oppert, Thomas, Friedrich, Thomas, and Harter, Stefan, "Processing and Reliability Analysis of Flip-Chips with Solder Bumps Down to 30 um Diameter," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 893-900.

Frankel, Gerald S., and McCreery, Richard L., "Inhibition of Al Alloy Corrosion by Chromates," Electrochemical Society Interface, vol. 10 no. 4, pp. 34-38, Winter 2001.

Frankfurth, Mark, and Row, Rick, "The Role of Voluntary Industry Programs & Trade Associations in Addressing Environmental Initiatives (WEEE, RoHS, EuP)," 2006 IEEE Symposium on Product Safety & Compliance Engineering, Irvine, CA, Oct. 23-24, 2006, pp. xx-xx.

Franklin, Ray, "A Collision of Values," PCB007, May 21, 2006.

Franklin, Ray, "Calls to Throw Out RoHS Unnecessary," PCB007, May 15, 2006.

Franklin, Ray, "RoHS Exemptions: Winners, Losers and Why," PCB007, Sept. 25, 2006.

Franklin, Ray, "RoHS - Reduce Testing With Third Party Certification," PCB007 , Feb. 3, 2006.

Franklin, Ray, "So You Want a RoHS Exemption?," CircuiTree, vol. 19 no. 1, pp. xx-xx, Jan. 2006.

Franklin, Ray, "So You Want a RoHS Exemption," PCB007, Feb. 3, 2006.

Franklin, Ray, "Third Party Certification, How It Works," PCB007, Mar. 22, 2006.

Franklin, Ray, "When Removing Hazardous Substances from Electronic Components Makes Sense Technically and Economically," PCB007, Nov. 9, 2006.

Franklin, Ray, "Why RoHS and REACH," PCB007, Dec. 25, 2006.

Franks, J., "Growth of Whiskers in the Solid Phase," Acta Metallurgica, vol. 6 no. 2, pp. 103-109, Feb. 1958.

Franks, J., "Metal Whiskers," Nature, vol. 177 no. 4517, pp. 984, May 26, 1956.

Frant, Samuel, and Kleeman, Irving, "Cadmium "Food Poisoning"," Metal Finishing, vol. 40. no. 3, pp. 131-134, Mar. 1942.

Frantz, C., Stein, N., Zhang, Y., Bouzy, E., Picht, O., Toimil-Molares, M. E., and Boulanger, C., "Electrodeposition of bismuth telluride nanowires with controlled composition in polycarbonate membranes," Electrochimica Acta, vol. 69, pp. 30-37, May 1, 2012.

Franz, Manuela, "Life Cycle Aspects of the Environmental Impact of Electrical and Electronic Equipment from the European Point of View," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 439-442.

Franz, Roger, "Calling for Help," Recycling Today, vol. 42 no. 6, pp. 86-90, June 2004.

Franz, Roger L., "Case Studies in RoHS Compliance: Eight Ways to Reach the Goal," IPC/JEDEC 11th International Conference on Lead Free Electronic Components and Assemblies, Boston, MA, Dec. 6-8, 2005, pp. xx-xx.

Franz, Roger L., "Optimizing Portable Product Recycling Through Reverse Supply Chain Technology," 2002 IEEE International Symposium on Electronics & the Environment, San Francisco, CA, May 6-9, 2002, pp. 274-279.

Franz, Roger, "Remove RoHS Colored Glasses," Electronic Packaging & Production , vol. xx no. xx, pp. xx-xx, Apr. 2003.

Fraone, Gina, "North America won't lead on lead-free," Electronic Business, Feb. 1, 2000.

Fraser, Malcolm J., "A Source of Natural Tin Whiskers," Nature, vol. 183, pp. 670, Mar. 7, 1959. https://doi-org.ezproxy.uky.edu/10.1038/183670a0

Fraser, Steve, and Munroe, Chris, "Lead-free: Using Vapor Phase Reflow in Lead-free Processing," Surface Mount Technology (SMT), vol. 19 no. 4, pp. 48-49, Apr. 2005.

Fray, Derek J., "The Cambridge Method of Recycling PC Boards Spares the Landfills," Chip Scale Review, vol. xx no. xx, pp. xx-xx, July 2002.

Frazier, Greg, "Free impact," EDN, vol. xx no. xx, pp. xx-xx, Nov. 1, 2004.

Frear, D. R., Ramanathan, L. N., Jang, J.-W., and Owens, N. L., "Emerging Reliability Challenges in Electronic Packaging," 46th Annual IEEE International Reliability Physics Symposium Proceedings, Phoenix, AZ, Apr. 27-May 1, 2008, pp. 450-454.

Frear, D. R., and Vianco, P. T., "Intermetallic Growth and Mechanical Behavior of Low and High Melting Temperature Solder Alloys," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 25 no. 7, pp. 1509-1523, July 1994.

Frear, D. R., "Issues related to the implementation of Pb-free electronic solders in consumer electronics," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 319-330, Mar. 2007.

Frear, D. R., "Microstructural Evolution During Thermomechanical Fatigue of 62Sn-36Pb-2Ag and 60Sn-40Pb solder joints," 1990 Proceedings 40th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, May 20-23, 1990, pp. 518-524.

Frear, D. R., "Microstructural Evolution During the Thermomechanical Fatigue of Solder Joints," The Metal Science of Joining, Cincinnati, OH, Oct. 20-24, 1991, pp. 191-200.

Frear. D. R., Jang, J. W., Lin, J. K., and Zhang, C., "Pb-Free Solders for Flip-Chip Interconnects," JOM, vol. 53 no. 6, pp. 28-32, June 2001.

Frear, D. R., "The Mechanical Behavior of Interconnect Materials for Electronic Packaging," JOM, vol. 48 no. 5, pp. 49-53, May 1996.

Frear, Darrel, "The Lead-Free Solder Challenge," Semiconductor International, vol. 26 no. 11, pp. SP-20, Oct. 2003.

Frear, Darrell R., "Materials Issues in Area-Array Microelectronic Packaging," JOM , vol. 51 no. 3, pp. 22-27, Mar. 1999.

Freda, Michael, and Barker, Donald, "Predicting Plated Through Hole Life at Assembly and in the Field from Thermal Stress Data," IPC Printed Circuits Expo, APEX and the Designer Summit , Anaheim, CA, Feb. 8-10, 2006, pp. S36-01-1-S36-01-37.

Freda, Michael, and Barker, Donald, "Predicting Plated Through Hole Life at Assembly and in the Field from Thermal Stress Data," Route, Mar. 2006.

Freda, Michael, and Reid, Paul, "Thermal Cycle Testing of PWBs - Methodology," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

Freda, Michael, "Via Life vs. Temperature Stress Analysis of Interconnect Stress Test," CircuiTree, vol. 18 no. 3, pp. 10-20, Mar. 2005.

Freda, Mike, and Reid, Paul, "Thermal Cycle Testing of PWBs - Methodology," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Frederick, Julian R., An Investigation of the Effects of Superimposed Ultrasonic Vibrations on the Drawing of Aluminum Wire, Aluminum Company of America, UMRI Project 2729, New Kensington, PA, Dec. 1959.

Frederickson, Michael D., "The Worldwide Lead (Pb)-Free Electronics Mandate and Impeding Reliability, Maintainability and Sustainability (RMS) Consequences," Journal of the Reliability Information Analysis Center, pp. 6-7, 2nd Quarter 2006.

Fredholm, Susan A., Gregory, Jeremy R., and Kirchain, Randolph E., "Characterizing Architectural Options for Electronic Waste Recycling Systems," 2008 IEEE International Symposium on Electronics and the Environment , San Francisco, CA, May 19-21, 2008, pp. xx-xx.

Fredrickson, Gerald, "Performance Improvements for Conductive Adhesives," Circuits Assembly , vol. 11 no. 12, pp. 50,52,54, Dec. 2000.

Fredrickson, Gerald, "Solder Alternative: Contact Resistance Improvements for SMCAs," Proceedings of the Technical Program NEPCON West 2000, Volume 1, Anaheim, CA, Feb. 27-Mar. 2, 2000, pp. 257-267.

Fredrickson, Gerald, and Cheng, Chih-Min, "Solder Alternative: Contact Resistance Improvements for SMCAs II," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 576-579.

Fredriksz, W., "Microstructures and Degradation of Heat Sink Very-Thin Quad Flat Package No-Leads Pb-Free Sn-Ag-Cu Solder Joints after Thermal Aging," Journal of Electronic Materials, vol. 34 no. 9, pp. 1230-1241, Sept. 2005.

Freedman, Marty, "What does Lead-Free mean?," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 23-24, 2003, pp. 1-4.

Freeman, C., and Condit, K., "The New OSHA Regulations for Hexavalent Chromium" 16th AESF/EPA Pollution Prevention and Control Conference, Orlando, FL, Feb. 13-15, 1995, pp. 15-22,

Freeman, G. B., Livesay, B. R., Bradley, J., Xi, Yi, and O'Neil, E. G., "Intermetallic Embrittlement of Thin Unsupported Tin/Copper Specimens," Journal of Electronic Materials, vol. 23 no. 9, pp. 919-924, Sept. 1994.

Freer, J. L., and Morris Jr., J. W., "Microstructure and Creep of Eutectic Indium/Tin on Copper and Nickel Substrates," Journal of Electronic Materials, vol. 21 no. 6, pp. 647-652, June 1992.

Freitas, Emmanuelle S., Osorio, Wislei R., Spinelli, Jose E., and Garcia, Amauri, "Mechanical and corrosion resistances of a Sn-0.7 wt.%Cu lead-free solder alloy," Microelectronics Reliability, vol. 54 no. 6-7, pp. 1392-1400, June-July 2014.

Fremd, Eric, Gopakumar, Sunil, Chen, Wyeman, and Lin, Chu, "DOE Optimization of SAC 305 Lead-Free Wave Soldering and Spray Fluxer Using Selective Soldering Pallet," 2007 Pan Pacific Microelectronics Symposium & Exhibit, Maui, HI, Jan. 30-Feb. 1, 2007, pp. xx-xx.

Fremont, H., Mura, M., Plano, B., Horaud, W., and Danto, Y., "Impact of the PCB design on the crack risk of CSP assemblies subjected to temperature cycling and drop tests," 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 3-7, 2006, pp. 229-234.

French, Craig, "Economic Impact of RoHS on the Electronic Wire and Cable Sector,"Wire & Cable Technology International, vol. 34 no. 4, pp. 24, July/Aug. 2006.

Fretz, E. R., and Green, J., "New Flame Retardant for Epoxy Glass Laminates," Printed Circuit Fabrication, vol. 6 no. 5, pp. 55-59,61-62, May 1983.

Frey, Sibylle D., Harrison, David J., and Billett, Eric H., "Ecological Footprint Analysis Applied to Mobile Phones," Journal of Industrial Ecology, vol. 10 no. 1/2, pp. 199-216, Winter/Spring 2006.

Friedel, Kazimierz P., "Design for Reuse and Recycling of Electronic Circuits," REWAS'04 - Global Symposium on Recycling, Waste Treatment and Clean Technology, Volume III, Madrid, Spain, Sept. 26-29, 2004, pp. 2843-2844.

Friedman, Ken, "Manufacturer's Corner: Fischerscope X-Ray Fluorescence," empfasis , pp. 10-11, July 2007.

Friege, Henning, Oberdorfer, Michael, and Gunther, Marko, "Optimising waste from electric and electronic equipment collection systems: A comparison of approaches in European countries," Waste Management and Research, vol. 33 no. 3, pp. 223-231, Mar. 2015.

Friege, Henning, "Review of material recovery from used electric and electronic equipment - alternative options for resource conservation," Waste Management and Research, vol. 30 no. 9 Supplement, pp. 3-16, Sept. 2012.

Friend, Gil, "Getting ahead of green goals," Electronic Business Online, Mar. 1, 2005.

Friesen, C., Seel, S. C., and Thompson, C. V., "Reversible stress changes at all stages of Volmer-Weber film growth," Journal of Applied Physics, vol. 95 no. 3, pp. 1011-1020, Feb. 1, 2004.

Friesen, C., and Thompson, C. V., "Reversible Stress Relaxation during Precoalescence Interruptions of Volmer-Weber Thin Film Growth," Physical Review Letters, vol. 89 no. 12, pp. 126103-1-126103-4, Sept. 16, 2002.

Frimann, Mark, "RoHS Substance Thresholds: Facts and Friction," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S09-02-1-S09-02-15.

Frischa, M. W., and Lin, Kwang-Lung, "Synthesis and Characterization of Sn Coating on MWCNT Using DBA as a Capping Agent," Journal of Electronic Materials, vol. 45 no. 1, pp. 79-87, Jan. 2016.

Frischauf, Rob, "Zinc-Nickel Alloy Plating Utilizing Boxed Anode Technology," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 544-547.

Frisk, L., Jarvinen, J., and Ristolainen, R., "Chip on flex attachment with thermoplastic ACF for RFID applications," Microelectronics Reliability, vol. 42 no. 9-11, pp. 1559-1562, Sept.-Nov. 2002.

Frisk, L., Seppala, A., and Ristolainen, E., "Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates," Microelectronics Reliability, vol. 44, no. 9-11, pp. 1305-1310, Sept.-Nov. 2004.

Frisk, L., and Ristolainen, E., "Flip chip attachment on flexible LCP substrate using an ACF," Microelectronics Reliability, vol. 45 no. 3-4, pp. 583-588, Mar./Apr. 2005.

Frisk, Laura, and Cumini, Anne, "Effect of substrate material and thickness on reliability of ACA bonded flip chip joints," Soldering & Surface Mount Technology, vol. 21 no. 3, pp. 16-23, 2009.

Frisk, Laura, and Cumini, Anne, "Reliability of ACA bonded flip chip joints on LCP and PI substrates," Soldering & Surface Mount Technology, vol. 18 no. 4, pp. 12-20, 2006.

Frisk, Laura, Saarinen, Kirsi, and Kokko, Kati, "Reliability of ACA joined thinned chips on rigid substrates under humid conditions," 2011 18th European Microelectronics and Packaging Conference, Brighton, United Kingdom, Sept. 12-15, 2011, pp. xx-xx.

Frisk, Laura, Saarinen, Kirsi, and Cumini, Anne, "Reliability of ACF Interconnections on FR-4 Substrates," IEEE Transactions on Components and Packaging Technologies, vol. 33 no. 1, pp. 138-147, Mar. 2010.

Frisk, Laura, Lahokallio, Sanna, Mostofizadeh, Milad, Kiilunen, Janne, and Saarinen, Kirsi, "Reliability of Isotropic Electrically Conductive Adhesives under Condensing Humidity Testing," 2012 IEEE 14th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 5-7, 2012, pp. 174-179.

Frisk, Laura, Lahokallio, Sanna, Mostofizadeh, Milad, Kiilunen, Janne, and Saarinen, Kirsi, "Reliability Study of Isotropic Electrically Conductive Adhesives under Thermal Cycling Testing," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 1794-1799.

Frisk, Laura, and Kokko, Kati, "The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints," Soldering & Surface Mount Technology, vol. 18 no. 4, pp. 28-37, 2006.

Fritsche, J., "Ueber eigenthumlich modificirtes Zinn," Berichte der Deutschen Chemischen Gesellschaft, vol. 2, pp. 112-113, 1869.

Fritzsche, T., "On the Production of a Columnar Structure in Metallic Tin," The London, Edinburgh and Dublin Philosophical Magazine and Journal of Science , ser. 4 vol. 35 no. 254, pp. 207, Sept. 1869. https://doi.org/10.1080/14786446908640211

Frolov, Sergey M., Plissard, Sebastien R., Nadj-Perge, Stevan, Kouwenhoven, Leo P., and Bakkers, Erik P. A. M., "Quantum computing based on semiconductor nanowires," MRS Bulletin , vol. 38 no. 10, pp. 809-815, Oct. 2013.

Frolov, T., Boettinger, W. J., and Mishin, Y., "Atomistic simulation of hillock growth," Acta Materialia, vol. 58 no. 16, pp. 5471-5480, Sept. 2010.

Fromberg, W., and Donaldson, Sandy, "A Reverse Pulse Process for Electrodeposition of Aluminum," Proceedings AESF SUR/FIN '96, Cleveland, OH, June 10-13, 1996, pp. 843-849.

Frongia, F., Pilloni, M., Scano, A., Ardu, A., Cannas, C., Musinu, A., Borzone, G., Delsante, S., Novakovic, R., and Ennas, G., "Synthesis and melting behaviour of Bi, Sn and Sn-Bi nanostructured alloy," Journal of Alloys and Compounds, vol. 623, pp. 7-14, Feb. 25, 2015.

Frosch, Ronald, Mayr, Guenther, and Riedler, Manfred, "Mechanical Reliability: A New Method to Forecast Drop Shock Performance," Surface Mount Technology (SMT), vol. 29 no. 5, pp. 30,32-40,42,44, May 2014.

Fruh, Christiane, Gunther, Michael, Rittner, Martin, Fix, Andreas, and Nowottnick, Mathias, "Characterisation of silver particles used for the Low Temperature Joining Technology," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Frye, Asa, Galyon, George T., and Palmer, Larry, "Crystallographic Texture and Whiskers in Electrodeposited Tin Films," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 1, pp. 2-10, Jan. 2007.

Fryer, Tim, "$32bn bill for a talking point," Electronics Manufacture and Test , vol. xx no. xx, pp. xx-xx, July 14, 2008.

Fryer, Tim, "Breathing space for RoHS running out," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Jan. 28, 2008.

Fryer, Tim, "Do WEEE understand?," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, June 22, 2007.

Fryer, Tim, "Greens should not be so certain," Electronics Manufacture and Test , vol. xx no. xx, pp. xx-xx, June 30, 2008.

Fryer, Tim, "KISS goodbye to the long tyranny of solder?," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Apr. 14, 2008.

Fryer, Tim, "LEAD-FREE solutions at your fingertips," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, May 2002.

Fryer, Tim, "Letter to the Editor," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, July 21, 2008.

Fryer, Tim, "Proposals for the possible dawning of the lead-free age," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, May 1999.

Fryer, Tim, "REACH out for what?," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Aug. 11, 2008.

Fryer, Tim, "RoHS rumbles on ... on Super Tuesday," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Feb. 10, 2008.

Fryer, Tim, "SOUND planning leads the way for Pb-free," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Jan. 2005.

Fryer, Tim, "The smell of a burning motor. Again.," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, June 4, 2007.

Fryer, Tim, "When is safe not safe?," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, July 3, 2007.

Fthenakis, Vasilis, and Gonsiorawski, Ronald, "Lead-free Solder Technology Transfer from ASE Americas," Brookhaven National Laboratory, 1999.

Fthenakis, Vasilis, "Regulations on Photovoltaic Module Disposal and Recycling," Brookhaven National Laboratory Informal Report BNL-68142, Jan. 29, 2001.

Fu, Bing, Chen, Na, Xie, Yiqun, and Ye, Xiang, "Size and orientation dependent melting properties and behavior of wurtzite CdSe nanowires," Computational Materials Science, vol. 84, pp. 293-300, Mar. 2014.

Fu, C. Y., and Van Duzer, T., "Hillock growth on lead films upon cycling to cryogenic temperatures," Journal of Vacuum Science and Technology, vol. 17 no. 3, pp. 752-754, May/June 1980.

Fu, Chia-Yu, and Huang, Rong-Fong, "BGA Reliability of Multilayer Ceramic Integrated Circuit (MCIC) Devices," Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 40-45.

Fu, Chia-Yu, and Huang, Rong-Fong, "BGA Reliability of Multilayer Ceramic Integrated Circuit (MCIC) Devices," The International Journal of Microcircuits and Electronic Packaging , vol. 23 no. 4, pp. 393-399, Fourth Quarter 2000.

Fu, Chun Hsien, Hung, Liang Yi, Jiang, Don Son, Wang, Yu Po, and Hsiao, C. S., "Investigation of IMC Growth and Solder Joint Reliability on New Surface Finish-ENEPIG," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 331-334.

Fu, Chune, Chen, Si, Berggren, Par, Fan, Qiong, Du, Wenhui, Ganesh, Balan, and Liu, Johan, "Optimization of stiffness for isotropic conductive adhesives," International Symposium on Advanced Packaging Materials, Cambridge, England, Feb. 28-Mar. 2, 2010, pp. 29-33.

Fu, Haley, Lee, Dem, Lee, Jeffrey, Tong, Geoffrey, Lee, Simon, Singh, Prabjit, Kazi, Aamir, Nailos, Mary, Ables, Wallace, Guo, Karlos, and Jiang, GuoDong, "Creep Corrosion Failure Analysis on ENIG Printed Circuit Boards," 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2015, pp. 124-129.

Fu, Haley, Tisdale, Stephen, Rausch, Martin, Davignon, John, Hall, Stephen H., and Pfahl, Robert C., "iNEMI HFR-free Program Report," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 627-632.

Fu, Haley, Aspandiar, Raiyo, Chen, Jimmy, Cheng, Shunfeng, Chen, Qin, Coyle, Richard, Feng, Sophia, Hardin, Bill, Krmpotich, Mark, Mokler, Scott, Radhakrishnan, Jagadeesh, Ribas, Morgana, Sandy-Smith, Brook, Tang, Kok Kwan, Wu, Greg, Zhang, Anny, and Zhen, Wilson, "INEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes - Part II: Characterization of Mixed Alloy BGA Solder Joints," Pan Pacific Symposium 2018 Proceedings, Kamuela, HI, Feb. 5-8, 2018, pp. xx-xx.

Fu, Haley, Radhakrishnan, Jagadeesh, Ribas, Morgana, Aspandiar, Raiyo, Byrd, Kevin, Chen, Jimmy, Cheng, Shunfeng, Chen, Qin, Coyle, Richard, Feng, Sophia, Krmpotich, Mark, Mokler, Scott, Sandy-Smith, Brook, Tang, Kok Kwan, Wu, Greg, Zhang, Anny, and Zhen, Wilson, "iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes: Part III: Mechanical Shock Tests on POP BGA Assemblies," 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Nagasaki, Japan, Apr. 17-21, 2018, pp. 13-18.

Fu, Haley, Radhakrishnan, Jagadeesh, Goonetilleke, Pubudu, Murayama, Kei, Aspandiar, Raiyo, Arfaei, Babak, Byrd, Kevin, Caputo, Antonio, Chen, Jimmy, Chen, Qin, Coyle, Richard, Daily, Derek, Feng, Sophia, Handwerker, Carol, Lauwaert, Ralph, Mutuku, Francis, Ribas, Morgana, Sarangapani, Murali, Tang, Kok Kwan, Troxel, Kris, Vasudevan, Vasu, Werkhoven, Daniel, Wu, Greg, Zhang, Hongwen, and Wilson Zhen, "iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes - Part VII: Mechanical Shock Test and Failure Analysis on Mixed SnAgCu-BiSn Solder Joints of FCBGA Components," SMTA International 2020 , virtual conference, Sept. 28-Oct. 23, 2020, pp. 373-386.

Fu, Haley, Aspandiar, Raiyo, Chen, Jimmy, Cheng, Shunfeng, Chen, Qin, Coyle, Richard, Feng, Sophia, Krmpotich, Mark, Lasky, Ronald C., Mokler, Scott, Radhakrishnan, Jagadeesh, Ribas, Morgana, Sandy-Smith, Brook, Tang, Kok Kwan, Wu, Greg, Zhang, Anny, and Zhen, Wilson, "INEMI Project on Process Development of Bi-Sn-Based Low Temperature Solder Pastes," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 207-220.

Fu, Haley, Radhakrishnan, Jagadeesh, Ribas, Morgana, Aspandiar, Raiyo, Arfaei, Babak, Byrd, Kevin, Chen, Jimmy, Cheng, Shunfeng, Chen, Qin, Coyle, Richard, Daily, Derek, Feng, Sophia, Krmpotich, Mark, Mokler, Scott, Sandy-Smith, Brook, Tang, Kok Kwan, Wu, Greg, Zhang, Anny, and Zhen, Wilson, "iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes - Part IV: Comprehensive Mechanical Shock Tests on PoP Components Having Mixed BGA BiSn-SAC Solder Joints," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Fu, Haley, Radhakrishnan, Jagadeesh, Ribas, Morgana, Aspandiar, Raiyo, Arfaei, Babak, Byrd, Kevin, Caputo, Antonio, Chen, Jimmy, Chen, Qin, Coyle, Richard, Daily, Derek, Feng, Sophia, Goonetilleke, Pubudu, Lauwaert, Ralph, Mutuku, Francis, Sarangapani, Murali, Tang, Kok Kwan, Troxel, Kris, Werkhoven, Daniel, Wu, Greg, Zhang, Hongwen, and Zhen, Wilson, "iNEMI Project On Process Development of BiSn-Based Low Temperature Solder Pastes - Part VI: Mechanical Shock Results on Resin Reinforced Mixed SnAgCu-BiSn Solder Joints Of FCBGA Components," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 513-525.

Fu, Haley, "Investigation of Factors That Influence Creep Corrosion - iNEMI Project Report," 2012 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Nov. 6-8, 2012, pp. xx-xx.

Fu, Haley, Chen, Cherie, Singh, Prabjit, Zhang, Jing, Kurella, Anil, Chen, Xu, Jiang, Xiaodong, Burlingame, Jennifer, and Lee, Simon, "Investigation of Factors that Influence Creep Corrosion on Printed Circuit Boards," 2012 Pan Pacific Microelectronics Symposium, Kauai, HI, Feb. 14-16, 2012, pp. xx-xx.

Fu, Haley, Chen, Cherie, Singh, Prabjit, Zhang, Jing, Kurella, Anil, Chen, Xu, Jiang, Xiaodong, Burlingame, Jennifer, and Lee, Simon, "Investigation of Factors that Influence Creep Corrosion on Printed Circuit Boards," SMTA Journal, vol. 25 no. 2, pp. 11-19, 2012.

Fu, Haley, Chen, Cherie, Singh, Prabjit, Zhang, Jing, Kurella, Anil, Chen, Xu, Jiang, Xiaodong, Burlingame, Jennifer, and Lee, Simon, "Investigation of Factors that Influence Creep Corrosion on Printed Circuit Boards - Part 2," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 292-299.

Fu, Hongzhi, Li, Huanyong, Jie, Wanqi, and Yang, Lan, "The growth and characterization of ZnSe nanoneedles by a simple chemical vapor deposition method," Journal of Crystal Growth, vol. 289 no. 2, pp. 440-444, Apr. 1, 2006.

Fu, Jianjie, Zhang, Aiqian, Wang, Thanh, Qu, Guangbo, Shao, Junjuan, Yuan, Bo, Wang, Yawei, and Jiang, Guibin, "Influence of E-Waste Dismantling and Its Regulations: Temporal Trend, Spatial Distribution of Heavy Metals in Rice Grains, and Its Potential Health Risk," Environmental Science & Technology, vol. 47 no. 13, pp. 7437-7445, July 2, 2013.

Fu, Jie, Aldrete, Manuel, Shah, Milind, Noveski, Vladimir, and Hsu, Marcus, "Thermal Compression Bonding for Fine Pitch Solder Interconnects," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 7-11.

Fu, Junli, Shi, Jinan, Zhu, Min, Liang, Yujie, Zhang, Guling, Shi, Honglong, Li, Hua, Zou, Bin, Qu, Zhen, Jia, Ying, and Wang, Wenzhong, "Large-scale synthesis and characterisation of Ag/Bi2Te3 superlattice nanowires via pulse electrodeposition," IET Micro & Nano Letters, vol. 8 no. 4, pp. 188-190, Apr. 2013.

Fu, Junli, Shen, Jinbo, Shi, Honglong, Liang, Yujie, Qu, Zhen, and Wang, Wenzhong, "Preparation and characterisation of single-crystalline structure Sb/Bi2Te3 superlattice nanowires," IET Micro & Nano Letters, vol. 11 no. 11, pp. 738-740, Nov. 2016.

Fu, Lei, Su, Michael, Anand, Ashok, Goh, Edwin, and Kuechenmeister, Frank, "Chip Package Interaction (CPI) Reliability of Low-k/ULK Interconnect with Lead Free Technology," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1613-1617.

Fu, Nianjun, Suhling, Jeffrey C., Mustafa, Muhannad, and Lall, Pradeep, "Aging Induced Evolution of the Cyclic Stress-Strain Behavior of Lead Free Solders," 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 31-June 3, 2016, pp. 737-745.

Fu, Nianjun, Suhling, Jeffrey C., and Lall, Pradeep, "Cyclic Stress-Strain Behavior of SAC305 Lead Free Solder: Effects of Aging, Temperature, Strain Rate, and Plastic Strain Range," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 1119-1127.

Fu. Nianjun, Suhling. Jeffrey C., Hamasha, Sa'd, and Lall, Pradeep, "Evolution of the Cyclic Stress-Strain and Constitutive Behaviors of SAC305 Lead Free Solder During Fatigue Testing," 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , Orlando, FL, May 30-June 2, 2017, pp. 1353-1360.

Fu, Nianjun, Suhling, Jeffrey C., Hamasha, Sa'd, and Lall, Pradeep, "Long Term Isothermal Aging Effects on the Cyclic Stress-Strain Behavior of Sn-Ag-Cu Solders," 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 30-June 2, 2017, pp. 1337-1345.

Fu, Nianjun, Ahmed, Sudan, Suhling, Jeffrey C., and Lall, Pradeep, "Visualization of Microstructural Evolution in Lead Free Solders during Isothermal Aging Using Time-Lapse Imagery," 2017 IEEE 67th Electronic Components and Technology Conference, Orlando, FL, May 30-June 2, 2017, pp. 429-440.

Fu, Shancan, Mei, Yunhui, Li, Xin, Ning, Puqi, and Lu, Guo-Quan, "Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (ò100 mm2) Power Chips at Low Temperatures for Electronic Packaging," Journal of Electronic Materials, vol. xx no. x, pp. xx-xx, xxxx.

Fu, Shao-Wei, Yu, Chi-Yang, Lee, Tae-Kyu, Liu, Kuo-Chuan, and Duh, Jenq-Gong, "Impact crack propagation through the dual-phased (Cu,Ni)6Sn5 layer in Sn-Ag-Cu/Ni solder joints," Materials Letters, vol. 80, pp. 103-105, Aug. 1, 2012.

Fu, Shen-Li, Hsu, Hsiang-Chen, Wan, Yue-Min, and Haung, Chi-Hau, "Reliability and Bondability Study on Interfacial Behavior between SnAgCu Solder and Cu-Ni-Au OSP Pads," Key Engineering Materials, vol. 573, pp. 1-7, Sept. 2013.

Fu, Xing, Chen, Si, Huang, Yun, Yao, Bin, Yao, Ruohe, and Zhou, Bin, "Effect of Cryogenic Temperature on Mechanical Fracture mechanism of Cu/Sn3.0Ag0.5Cu-Solder/Cu Joint," 2019 IEEE 21st Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 4-6, 2019, pp. 129-132.

Fu, Xing, Chen, Hongtao, Zhou, Bin, Chen, Si, Yao, Ruohe, and He, Xiaoqi, "Effect of Crystal Boundary Character and Crystal Orientation on Electromigration in Lead-free Solder Interconnects with Cyclic Twinning Structure," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 701-703.

Fu, Xing, Zhou, Bin, Yao, Ruohe, En, Yunfei, and Chen, Si, "Effect of Grain Orientation and Microstructure Evolution on Electromigration in Flip-Chip Solder Joint," 2019 IEEE 69th Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2019, pp. 1324-1327.

Fu, Y., Willander, M., and Liu, J., "Cluster effects on electrical conductance of isotropically conductive adhesive," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 188-193.

Fu, Y., Liu, J., and Willander, M., "Conduction modelling of a conductive adhesive with bimodal distribution of conducting element," International Journal of Adhesion and Adhesives , vol. 19 no. 4, pp. 281-286, Aug. 1999.

Fu, Y., Willander, M., and Liu, J., "Spatial Distribution of Metal Fillers in Isotropically Conductive Adhesives," Journal of Electronic Materials, vol. 30 no. 7, pp. 866-871, July 2001.

Fu, Yiming M., Zhou, Haiqiang Q., and Zhang, Pu, "Nonlinear free vibration of nanowires including size effects," IET Micro & Nano Letters, vol. 7 no. 4, pp. 348-352, Apr. 2012.

Fu, Ying, Wang, Yanli, Wang, Xitao, Liu, Johan, Lai, Zonghe, Chen, Guoliang, and Willander, Magnus, "Experimental and Theoretical Characterization of Electrical Contact in Anisotropically Conductive Adhesive," IEEE Transactions on Advanced Packaging, vol. 23 no. 1, pp. 15-21, Feb. 2000.

Fu, Ying, Wang, T., and Liu, Johan, "Microwave-Transmission, Heat and Temperature Properties of Electrically Conductive Adhesive," IEEE Transactions on Components and Packaging Technologies, vol. 26 no. 1, pp. 193-198, Mar. 2003.

Fu, Ying, Willander, Magnus, and Liu, Johan, "Statistics of Electric Conductance Through Anisotropically Conductive Adhesive," IEEE Transactions on Components and Packaging Technologies , vol. 24 no. 2, pp. 250-255, June 2001.

Fu, Yun, Zhang, Qi, Sun, Feng, and Bai, Haoyu, "Effect of isothermal aging on the growth and morphology of the intermetallic compounds formed at the Solder/Cu interface of the lead - free solder joint," Materials Science Forum, vol. 561-565 part 3, pp. 2115-2118, 2007.

Fu, Z. W., Zhou, B., Yao, R. H., Liu, Y. R., and Li, X. P., "Electromigration Effect on Kinetics of Cu-Sn Intermetallic Compound Growth in Lead-Free Solder Joint," IEEE Transactions on Device and Materials Reliability, vol. 17 no. 4, pp. 773-779, Dec. 2017.

Fuchs, Christopher, Schreck, Timo, and Kaloudis, Michael, "Interfacial reactions between Sn-57Bi-1Ag solder and electroless Ni-P/immersion Au under solid-state aging," Journal of Materials Science , vol. 47 no. 9, pp. 4036-4041, May 2012.

Fuchs, P. F., Pinter, G., and Major, Z., "PCB drop test lifetime assessment based on simulations and cyclic bend tests," Microelectronics Reliability, vol. 53 no. 5, pp. 774-781, May 2013.

Fuertes, J. F., and Tejedor, M., "Different types of domain structures in <110> iron whiskers," Journal of Applied Physics, vol. 63 no. 5, pp. 1670-1677, Mar. 1, 1988.

Fuji, Yoichi, "Capillary Balls: Causes and Countermeasures," Lead-free Electronics , Nov. 2004.

Fujii, M., Iwanaga, H., and Shibata, N., "Morphology and Polarity of GaAs Needles," Journal of Crystal Growth , vol. 99 no. 1-4, pp. 179-182, Jan. 1990.

Fujiki, Tatsuhiro, Tanaka, Fumio, Homma, Yoshinobu, Yoshii, Haruyuki, and Kotaka, Kiyoshi, "Prevention of Voids During the Underfill Process," Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, China, June 30-July 3, 2004, pp. 221-223.

Fujimori, Hiroyuki, Fujisawa, Hiroyuki, Hirano, Yumiko, and Okabe, Toshio, "The morphology of grown-in defects in nitrogen-doped silicon crystals," Journal of Crystal Growth, vol. 237-239 pt. 1, pp. 338-344, Apr. 2002.

Fujimori, Takashi, Takigami, Hidetaka, Agusa, Tetsuro, Eguchi, Akifumi, Bekki, Kanae, Yoshida, Aya, Terazono, Atsushi, and Ballesteros Jr., Florencio C., "Impact of metals in surface matrices from formal and informal electronic-waste recycling around Metro Manila, the Philippines, and intra-Asian comparison," Journal of Hazardous Materials, vol. 221-222, pp. 139-146, June 30, 2012.

Fujimoto, Kazuhisa, Kawashima, Katsuhiko, Nishitsuji, Mitsuru, Nobori, Kazuhiro, Nagata, Haruto, and Ishikawa, Osamu, "0.4-8 GHz Broadband MMICs in Novel RF Chip Size Package for Optical Video Distribution System," 2000 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, Digest of Papers, June 11-13, 2000, pp. 161-164.

Fujimura, Issei, "Outer Leadframe Plating," Journal of the Surface Finishing Society of Japan, vol. 60 no. 4, pp. 248-252, 2009.

Fujimura, Issei, Vardaman, E. Jan, and Lenihan, Timothy G., "Tin Whisker Prevention with SnBi Plating," InterPACK '09, July 22, 2009.

Fujino, Masahisa, and Suga, Tadatomo, "Evaluation of energy consumption of lead-free soldering process," 2003 3rd International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 8-11, 2003, pp. 831-835.

Fujino, Takayoshi, Miyamoto, Masaki, and Noguchi, Hayao, "Formation of chemical conversion coatings with high corrosion-resistance on aluminum in strontium hydroxide by secondary dipping treatment," Journal of Japan Institute of Light Metals, vol. 50 no. 10, pp. 486-490, Oct. 2000.

Fujisaki, Akihiko, Suzuki, Masahiro, and Yamamoto, Haruhiko, "Packaging Technology for High Performance CMOS Server Fujitsu GS8900," 2000 Proceedings 50th Electronic Components & Technology Conference , Las Vegas, NV, May 21-24, 2000, pp. 920-924.

Fujita, H., and Fujita, N., "Heterogeneous Deformation and Mechanical Strength of Materials," Radiation Effects and Defects in Solids, vol. 157 no. 1-2, pp. 85-100, 2002. https://doi.org/10.1080/10420150211411

Fujiwara, K., Ohtani, M., Isu, T., Nango, S., Kawanaka, R., and Shimizu, K., "Interfacial Reaction in Bimetallic Sn/Cu Thin Films," Thin Solid Films , vol. 70 no. 1, pp. 153-161, July 15, 1980.

Fujiwara, Kenzo, and Kawananka, Ryusuke, "Observation of the tin whisker by micro-Auger electron spectroscopy," Journal of Applied Physics, vol. 51 no. 12, pp. 6231-6237, Dec. 1980.

Fujiwara, Shinichi, Harada, Masahide, Fujita, Yuji, Hachiya, Toshihiro, and Muramatsu, Morio, "Deterioration Mechanism of Flip Chip Attachment Using an Anisotropic Conductive Film and Design Technology for High Reliability," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1124-1129.

Fujiwara, Y., Enomoto, H., Nagao, T., and Hoshika, H., "Composite plating of Sn-Ag alloys for Pb-free soldering," Surface and Coatings Technology, vol. 169-170 no. xx, pp. 100-103, June 2, 2003.

Fujiwara, Yutaka, "Tin/Silver-nanoparticle Composite Plating for Lead-free Soldering," Journal of the Surface Finishing Society of Japan, vol. 57 no. 7, pp. 479-483, 2006.

Fujiwara, Yutaka, and Kobayashi, Yasuyuki, "Trivalent Chromium Conversion Coatings for Galvanized Steel," Journal of the Surface Finishing Society of Japan, vol. 57 no. 12, pp. 855-859, 2006.

Fukaya, Masashi, Matsuo, Tomoku, Nishigaki, Susumu, and Higuchi, Chiaki, "Highly Reliable and Lead (Pb) Free Thick Film Resistor Paste System for Low Thermal Expansion LTCC Application," Proceedings 1997 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 3235), Philadelpia, PA, Oct. 14-16, 1997, pp. 65-71.

Fukaya, Masashi, and Higuchi, Chiaki, "Pb-Free Resistor for Pb-Free LTCC System," Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 636-641.

Fukishima, Makoto, Yamamoto, Tetsuya, Rakuma, Tsuyoshi, Takaoka, Daizo, and Takizawa, Kikuo, "Effect of Shrinkage Cavities on Reliability of Solder Joint Using Sn-Ag-Cu Lead-Free Solder," Hyomen Gijutsu (Journal of the Surface Finishing Society of Japan), vol. 54 no. 11, pp. 812-817 Nov. 2003.

Fukuda, Hiroyuki, "Organic Solderability Preservative for Lead-free Soldering," Journal of the Surface Finishing Society of Japan, vol. 59 no. 9, pp. 597-601, 2008.

Fukuda, Mitsunobu, Imayoshi, Kohei, and Matsumoto, Yasumichi, "Effect of adsorption of polyoxyethylene laurylether on electrodeposition of Pb-free Sn alloys," Surface and Coatings Technology, vol. 169-170, pp. 128-131, June 2, 2003.

Fukuda, Mitsunobu, Imayoshi, Kohei, and Matsumoto, Yasumichi, "Effect of polyoxyethylenelaurylether on electrodeposition of Pb-free Sn-Bi alloy," Electrochimica Acta, vol. 47 no. 3, pp. 459-464, Oct. 31, 2001. https://doi.org/10.1016/S0013-4686(01)00741-1

Fukuda, Yuki, Fang, Tong, Pecht, Michael, and Osterman, Michael, "Effect of Heat Treatment on Tin Whisker Growth," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 717-723.

Fukuda, Yuki, Casey, Paul, and Pecht, Michael, "Evaluation of Selected Japanese Lead-Free Consumer Electronics," IEEE Transactions on Electronics Packaging Manufacturing , vol. 26 no. 4, pp. 305-312, Oct. 2003.

Fukuda, Yuki, Osterman, Michael, and Pecht, Michael, "Lead-free: Electrical Influence on Tin Whisker Growth," Surface Mount Technology (SMT), vol. 20 no. 9, pp. 41-42, Sept. 2006.

Fukuda, Yuki, Pecht, Michael G., Fukuda, Kota, and Fukuda, Shuichi, "Lead-Free Soldering in the Japanese Electronics Industry," IEEE Transactions on Components and Packaging Technologies , vol. 26 no. 3, pp. 616-624, Sept. 2003.

Fukuda, Yuki, Osterman, Michael, and Pecht, Michael, "Length Distribution Analysis for Tin Whisker Growth," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 1, pp. 36-40, Jan. 2007.

Fukuda, Yuki, Osterman, Michael, and Pecht, Michael, "The Effect of Annealing on Tin Whisker Growth," IEEE Transactions on Electronics Packaging Manufacturing, vol. 29 no. 4, pp. 252-258, Oct. 2006.

Fukuda, Yuki, Osterman, Michael, and Pecht, Michael, "The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth," Microelectronics Reliability, vol. 47 no. 1, pp. 88-92, Jan. 2007. https://doi.org/10.1016/j.microrel.2006.04.011

Fukuda, Yuki, and Osterman, Michael, "Tin Whiskers: What's the Risk?," Lead-free Electronics, July 2005.

Fukumoto, Shinji, Inoue, Shu, Wakimoto, Ryoichi, Yamamoto, Yuto, Matsushima, Michiya, and Fujimoto, Kozo, "Surface Mounting Process Using Hybrid Resin Sheet Including Self-Organizable Solder Particles," Materials Transactions, vol. 54 no. 6, pp. 899-904, 2013.

Fuller, Joe, Abraham, Amit, and Munukutla, Aravind, "BGA Pad Cratering and Peeling During SMT Reflow," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Fullerton, Jason, and Colindres, Chris, "Comparing the Performance of Engineered Tin/Copper Alloys in Selective Soldering," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 695-702.

Fullerton, Jason, and Colindres, Chris, "Comparing The Performance of Engineered Tin/Copper Alloys In Selective Soldering," SMTA China South 2017 Proceedings, Shenzhen, China, Aug. 28-31, 2017, pp. xx-xx.

Fullerton, Jason, "Customized Training: Failure Analysis," empfasis, pp. xx-xx, Jan. 2008.

Fullerton, Jason, "Fluxes and head-in-pillow defects tech sessions to be featured at IPC APEX EXPO," Chip Scale Review, vol. 19 no. 1, pp. 15, Jan.-Feb. 2015.

Fullerton, Jason, "Head on Pillow Defects on BGA Assemblies," empfasis, pp. xx-xx, Mar. 2008.

Fullerton, Jason, "Lead Free Manufacturing (Training)," empfasis, pp. 6, Apr. 2009.

Fullerton, Jason, "Lead Free Risk Mitigation - A Case Study," empfasis, pp. 3,8, May 2010.

Fullerton, Jason, "Tech Tips: Reflow Experiment," empfasis, pp. 7, Sept. 2008.

Fullerton, Jason, "The War on Soldering Defects under Area Array Packages: Head-in-Pillow and Non-Wet Open," Surface Mount Technology (SMT), pp. 12,14-16,18,20-21, Aug. 2015.

Fullerton, John G., "Determination of Current Capacity of Small Dimension Wires and Bars," Sixth Annual Reliability Physics Symposium, Los Angeles, CA, Nov. 6-8, 1967, pp. 256.

Fulton, J. A., Chang, D. D., Nis, J. R., and Schmidt, M. B., "An Overview of Elastomeric Conductive Polymer Interconnection Materials and Their Use in MCM Technology," 1992 Proceedings 42nd Electronic Components & Technology Conference, San Diego, CA, May 18-20, 1992, pp. 473-480.

Fulton, J. A., Moore, R. C., and Sekutowski, "Use of Anisotropically Conductive Polymers in Electronic Applications," 3rd International SAMPE Electronics Conference, Volume 3, Los Angeles, CA, June 20-22, 1989, pp. 578-589.

Furtauer, S., Li, D., Cupid, D., and Flandorfer, H., "The Cu-Sn phase diagram, Part I: New experimental results," Intermetallics, vol. 34, pp. 142-147, Mar, 2013.

Furusawa, Akio, Akiyama, Shinnosuke, Sakai, Kazuki, Hayashi, Yamato, and Takizawa, Hirotsugu, "Synthesis of Lead-Free Solder Particles Using High-Speed Centrifugal Atomization," Materials Transactions, vol. 58 no. 10, pp. 1458-1462, 2017.

Furuta, Kiyoto, "Management of Chemical Substances Contained in Products and its Future Direction in Japan," Canon, June 19, 2006.

Furuta, Noboru, "Growing Process of Kinked Tin Whiskers" Japanese Journal of Applied Physics, vol. 4 no. 2, pp. 155-156, Feb. 15, 1965.

Furuta, Noboru, and Hamamura, Kenji, "Growth Mechanism of Proper Tin-Whisker," Japanese Journal of Applied Physics, vol. 8 no. 12, pp. 1404-1410, Dec. 1969.

Furuta, Noboru, Ohasi, Yosio, Itinose, Hideki, and Igarashi, Yoshinaga, "Kinetics of Vapor-Grown Tellurium Whiskers," Japanese Journal of Applied Physics, vol. 14 no. 7, pp. 929-934, July 1975.

Furuta, Noboru, Itinose, Hideki, Maruyama, Nobuyuki, and Ohasi, Yosio, "Morphology and Dislocation Structure of Tellurium Whiskers Grown from the Vapor," Japanese Journal of Applied Physics, vol. 11 no. 8, pp. 1113-1118, Aug. 1972.

Furuta, Noboru, and Wada, Norio, "Tellurium and Thallium-Telluride Whiskers Grown by the Vapor-Liquid-Solid (VLS) Process," Japanese Journal of Applied Physics, vol. 11 no. x, pp. 1753-1754, 1972.

Futornick, Kathi, "Implementation of Sustainable Manufacturing Standards," NIST Workshop, Gaithersburg, MD, Oct. 13-15, 2009, pp. xx-xx.

GGGG

Gabe, D. R,, and Bijimi, D., "Passivation of Tin Using Chromates, Molybdates and Tungstates," Passivity of Metals and Semiconductors, Bombannes, France, May 30-June 3, 1983, pp. 713-718.

Gabe, D. R., "Whisker growth on tin electrodeposits," Transactions of the Institute of Metal Finishing, vol. 65 no. 3, pp. 115, Aug. 1987. https://doi.org/10.1080/00202967.1987.11870783

Gabe, David R., "Alternatives to Cadmium," SUR/FIN '94 Technical Conference Proceedings , Indianapolis, IN, June 20-23, 1994, pp. 521-532.

Gabel, James, "Mitigating PCB RoHS concerns for high-reliability electronics," Green SupplyLine, Oct. 9, 2006.

Gabel, James, "Mitigating PCB RoHS concerns for high-reliability electronics," Industrial Control Design Line, Oct. 9, 2006.

Gabor, Thomas, and Blocher Jr., John M., "In Situ Electron-Microscopic Study of the Growth of Iron Whiskers by Chemical Vapor Deposition," Journal of Applied Physics, vol. 40 no. 7, pp. 2696-2704, June 1969.

Gabrielson, L., and Folkes, M. J., "Manufacture of colloidal polymer ellipsoids for anisotropic conducting nano-composites," Journal of Materials Science, vol. 36 no. 1, pp. 1-6, Jan. 2001.

Gadepalli, Harish, Dhanasekaran, Rangaraj, Ramkumar, S. Manian, Jensen, Tim, and Briggs, Ed, "Influence of Reflow Profile and Pb-Free Solder Paste in Minimizing Voids for Quad Flat Pack No-Lead (QFN) Assembly," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 2016-2024.

Gaffney, Kevin, Poarch, Justin, and Delaney, Drew, "Lead-Free Flip Chip Process Development," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 129-133.

Gagliano, R. A., Ghosh, G., and Fine, M. E., "Nucleation Kinetics of Cu6Sn5 by Reaction of Molten Tin with a Copper Substrate," Journal of Electronic Materials, vol. 31 no. 11, pp. 1195-1202, Nov. 2002.

Gagliano, Robert A. and Fine, Morris E., "Growth of n-Phase Scallops and Whiskers in Liquid Tin-Solid Copper Reaction Couples," JOM, vol. 53 no. 6, pp. 33-38, June 2001.

Gagliano, Robert A., and Fine, Morris E., "Thickening Kinetics of Interfacial Cu6Sn5 and Cu3Sn Layers during Reaction of Liquid Tin with Solid Copper," Journal of Electronic Materials, vol. 32 no. 12, pp. 1441-1447, Dec. 2003.

Gagne, Andre, and Meringer, Dan, "Lead Free Material and Process Re-qualification for a Rugged Handheld Terminal," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Gagnon, D., and Braunovic, M., "Effect of Fretting in Lead-Free Systems," Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts, Brussels, Belgium, Oct. 4-5, 2004, pp. 248-254.

Gai, Wei, Xu, Gaowei, and Luo, Le, "Reliability Evalution of Low-cost Bumping by Laser Jetting Sn-Ag-Cu Solder on Electroless Ni/Au UBM," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 156-159.

Gaidukov, Yu. P., and Kadlecova, J., "Effect of Dimensions on Temperature Dependence of Resistance in Cadmium Whiskers," Physica Status Solidi (a), vol. 2 no. 2, pp. 407-413, 1970. https://doi-org.ezproxy.uky.edu/10.1002/pssa.19700020228

Gaidukov, Yu. P., "Electronic properties of whiskers," Soviet Physics Uspekhi, vol. 27 no. 4, pp. 256-272, Apr. 1984.

Gaidukov, Yu. P., and Kadlecova, I., "Size Effect in Zinc Whiskers," Physik der kondensierten Materie , vol. 9 no. , pp. 192-194, 1969. https://doi.org/10.1007/BF02422552

Gaillard, Olivier, "State of the Art of HiTCE Ceramic Packages," ESTEC - NOORDWIJK , Apr. 27, 2005.

Gain, Asit Kumar, Chan, Y. C., and Yung, Winco K. C., "Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads," Microelectronics Reliability, vol. 51 no. 12, pp. 2306-2313, Dec. 2011.

Gain, Asit Kumar, and Zhang, Liangchi, "Effect of Ag nanoparticles on microstructure, damping property and hardness of low melting point eutectic tin-bismuth solder," Journal of Materials Science: Materials in Electronics, vol. 28 no. 20, pp. 15718-15730, Oct. 2017.

Gain, Asit Kumar, and Zhang, Liangchi, "Effect of isothermal aging on microstructure, electrical resistivity and damping properties of Sn-Ag-Cu solder," Journal of Materials Science: Materials in Electronics, vol. 28 no. 13, pp. 9363-9370, July 2017.

Gain, Asit Kumar, Chan, Y. C., and Yung, Winco K. C., "Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au/Ni/Cu ball grid array packages," Materials Science and Engineering B: Solid-State Materials for Advanced Technology , vol. 162 no. 2, pp. 92-98, May 25, 2009.

Gain, Asit Kumar, Chan, Y. C., Yung, K. C., Sharif, Ahmed, and Ali, Lafir, "Effect of Nano Ni Additions on the Structure and Properties of Sn-9Zn and Sn-8Sn-3Bi Solder in Ball Grid Array Packages," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 1291-1294.

Gain, Asit Kumar, Chan, Y. C., Sharif, Ahmed, and Yung, Winco K. C., "Effect of Small Sn-Ag-Cu Additions on Structure and Properties of Sn-Zn-Bi Solder/BGA during as-Soldered and as-Aged Conditions," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1021-1026.

Gain, Asit Kumar, and Zhang, Liangchi, "Effect of thin gold/nickel coating on the microstructure, wettability and hardness of lead-free tin-bismuth-silver solder," Journal of Materials Science: Materials in Electronics, vol. 28 no. 6, pp. 4885-4896, Mar. 2017.

Gain, Asit Kumar, and Zhang, Liangchi, "Growth mechanism of intermetallic compound and mechanical properties of nickel (Ni) nanoparticle doped low melting temperature tin-bismuth (Sn-Bi) solder," Journal of Materials Science: Materials in Electronics, vol. xx no. xx, pp. xx-xx, xxxx.

Gain, Asit Kumar, and Chan, Y. C., "Growth mechanism of intermetallic compounds and damping properties of Sn-Ag-Cu-1wt% nano-ZrO2 composite solders," Microelectronics Reliability , vol. 54 no. 5, pp. 945-955, May 2014.

Gain, Asit Kumar, and Zhang, Liangchi, "Growth nature of in-situ Cu6Sn5-phase and their influence on creep and damping characteristics of Sn-Cu material under high-temperature and humidity," Microelectronics Reliability, vol. 87, pp. 278-285, Aug. 2018.

Gain, Asit Kumar, and Zhang, Liangchi, "Harsh service environment effects on the microstructure and mechanical properties of Sn-Ag-Cu-1 wt% nano-Al solder alloy," Journal of Materials Science: Materials in Electronics, vol. 27 no. 11, pp. 11273-11283, Nov. 2016.

Gain, Asit Kumar, and Zha, Liangchi, "High-temperature and humidity change the microstructure and degrade the material properties of tin-silver interconnect material," Microelectronics Reliability, vol. 83, pp. 101-110, Apr. 2018.

Gain, Asit Kumar, Chan, Y. C., Sharif, Ahmed, Wong, N. B., and Yung, Winco K. C., "Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages," Microelectronics Reliability , vol. 49 no. 7, pp. 746-753, July 2009.

Gain, Asit Kumar, and Zhang, Liangchi, "Interfacial microstructure, wettability and material properties of nickel (Ni) nanoparticle doped tin-bismuth-silver (Sn-Bi-Ag) solder on copper (Cu) substrate," Journal of Materials Science: Materials in Electronics , vol. 27 no. 4, pp. 3982-3994, Apr. 2016.

Gain, Asit Kumar, Fouzder, Tama, Chan, Y. C., Sharif, Ahmed, and Yung, Winco K. C., "Investigation of small Sn-3.5Ag-0.5Cu additions on the microstructure and properties of Sn-8Zn-3Bi solder on Au/Ni/Cu pads," Journal of Alloys and Compounds, vol. 489 no. 2, pp. 678-684, Jan. 21, 2010.

Gain, Asit Kumar, Zhang, Liangchi, and Chan, Y. C., "Microstructure, elastic modulus and shear strength of alumina (Al2O3) nanoparticles-doped tin-silver-copper (Sn-Ag-Cu) solders on copper (Cu) and gold/nickel (Au/Ni)-plated Cu substrates," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Gain, Asit Kumar, Fouzder, Tama, Chan, Y. C., and Yung, Winco K. C., "Microstructure, kinetic analysis and hardness of Sn-Ag-Cu-1 wt% nano-ZrO2 composite solder on OSP-Cu pads," Journal of Alloys and Compounds , vol. 509 no. 7, pp. 3319-3325, Feb. 17, 2011.

Gain, Asit Kumar, and Zhang, Liangchi, "Microstructure, mechanical and electrical performances of zirconia nanoparticles-doped tin-silver-copper solder alloys," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Gain, Asit Kumar, and Zhang, Liangchi, "Microstructure, thermal analysis and damping properties of Ag and Ni nano-particles doped Sn-8Zn-3Bi solder on OSP-Cu substrate," Journal of Alloys and Compounds, vol. 617, pp. 779-786, Dec. 25, 2014.

Gain, Asit Kumar, Chan, Y. C., and Yung, Winco K. C., "Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO2 composite solder on flexible ball grid array substrates," Microelectronics Reliability, vol. 51 no. 5, pp. 975-984, May 2011.

Gain, Asit Kumar, and Zhang, Liangchi, "Temperature and humidity effects on microstructure and mechanical properties of an environmentally friendly Sn-Ag-Cu material," Journal of Materials Science, vol. 54 no. 19, pp. 12863-12874, Oct. 2019.

Gain, Asit Kumar, and Chan, Y. C., "The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn-Ag-Cu solder on OSP-Cu pads," Intermetallics, vol. 29, pp. 48-55, 2012.

Gain, Asit Kumar, Fouzder, Tama, Chan, Y. C., Sharif, A., Wong, N. B., and Yung, Winco K. C., "The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn-Ag-Cu solder on Au/Ni metallized Cu pads," Journal of Alloys and Compounds, vol. 506 no. 1, pp. 216-223, Sept. 10, 2010.

Gain, Asit Kumar, and Zhang, Liangchi, "Thermal aging effects on microstructure, elastic property and damping characteristic of a eutectic Sn-3.5Ag solder," Journal of Materials Science: Materials in Electronics, vol. 29 no. 17, pp. 14519-14527, Sept. 2018.

Gakkestad, Jakob, Li, Zhuo, Helland, Tore, and Wong, C. P., "Thermo-Mechanical Properties of Isotropic Conductive Adhesive Filled with Metallized Polymer Spheres," 2013 IEEE 15th Electronics Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp. 213-218.

Galbiati, Enrico, "Reliability evaluation of solder joints in electronics assemblies," 2017 21st European Microelectronics and Packaging Conference & Exhibition , Warsaw, Poland, Sept. 10-13, 2017, pp. xx-xx.

Galbraith, Trevor, "Are the chickens coming home to roost for lead-free?," Global SMT and Packaging, vol. 10 no. 3, pp. 2, Mar, 2010.

Galbraith, Trevor, "Bjorn Dahle Interview," Global SMT & Packaging, vol. 5 no. 4, pp. 24-25, Apr. 2005.

Galbraith, Trevor, "European Perspectives on Lead-free Solder Conversion," Lead-Free Magazine, vol. 1.

Galbraith, Trevor, "Interview - Jack Paster, RMD," Global SMT and Packaging, vol. 7 no. 8, pp. 26-27, Aug. 2007.

Galbraith, Trevor, "Interview - Jennie S. Hwang, PhD., D.Sc.," Global SMT and Packaging , vol. 7 no. 9, pp. 36-38, Sept. 2007.

Galbraith, Trevor, "Kyle Doyel, KYZEN Corporation," Global SMT and Packaging, vol. 9 no. 1, pp. 36-37, Jan. 2009.

Galimidi, Gary, "New Perspective of Lead-Free," Aviation Today, Oct. 2004.

Galbraith, Trevor, "RoHS 2, the sequel, looms," Global SMT and Packaging, vol. 13 no. 1, pp. 2, Jan. 2013.

Galbraith, Trevor, "RoHS Is Here, but Is It Working?," Lead-Free Magazine, vol. 7, Nov. 2006.

Galib, Roisul Hasan, Hasan, Rahat Al, and Sharif, Ahmed, "Erratum to: Study of off-eutectic Zn-xMg high temperature solder alloys," Journal of Materials Science: Materials in Electronics, vol. 27 no. 9, pp. 9981, Sept. 2016.

Galib, Roisul Hasan, Hasan, Rahat Al, and Sharif, Ahmed, "Study of off-eutectic Zn-xMg high temperature solder alloys," Journal of Materials Science: Materials in Electronics, vol. 27 no. 8, pp. 8734-8744, Aug. 2016.

Gallagher, Catherine, Matijasevic, Goran, and Shearer, Bryan, "Transient Liquid Phase Sintering Conductive Adhesives for Use in Surface Mount and Area Array Applications," 1997 Surface Mount International Conference Proceedings, San Jose, CA, Sept. 7-11, 1997, pp. 524-534.

Gallagher, Catherine, Matijasevic, Goran, and Capote, M. Albert, "Transient Liquid Phase Sintering Conductive Adhesives," 1995 Surface Mount International Conference Proceedings of the Technical Program, San Jose, CA, Aug. 29-31, 1995, pp. 568-573.

Gallagher, Catherine, Matijasevic, Goran, and Maguire, James F., "Transient Liquid Phase Sintering Conductive Adhesives as Solder Replacements," 1997 Electronic Components and Technology Conference , San Jose, CA, May 18-21, 1997, pp. 554-560.

Gallagher, Phil, "Executive Commentary: Collaboration Required," Avnet Advantage , Oct. 2004.

Gallerani, Peter, and Klink, Kevin L., "Transforming Aerospace Metal Finishing Processes," Products Finishing, vol. xx no. xx, pp. xx-xx, Nov. 21, 2005.

Gallerneault, W. M. T., Vnuk, F., and Smith, R. W., "Silicon-stabilized grey tin," Journal of Applied Physics, vol. 54 no. 7, pp. 4200-4201, July 1983.

Gallo, Anthony A., and Tubbs, Tara R., "High Solder-Reflow Crack Resistant Molding Compound," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 18 no. 1, pp. 646-649, Mar. 1995.

Galloway, Jesse E., and Miles, Barry M., "Moisture Absorption and Desorption Predictions For Plastic Ball Grid Array Packages," InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V, Orlando, FL, May 29-June 1, 1996, pp. 180-186.

Galyon, G. T., and Gedney, Ron, "Avoiding Tin Whisker Reliability Problems," Circuits Assembly, vol. 15 no. 8, pp. 26-31, Aug. 2004.

Galyon, G. T., Xu, C., Lal, S., Notohardjono, B., and Palmer, L., "The Integrated Theory of Whisker Formation - A Stress Analysis," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 421-428.

Galyon, George T., "A History of Tin Whisker Theory: 1946 to 2004." 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 696-706.

Galyon, George T., and Palmer, L., "An Integrated Theory of Whisker Formation: The Physical Metallurgy of Whisker Formation and the Role of Internal Stress," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 17-40, Jan. 2005.

"Annotated Tin Whisker Bibliography," July 2003.

Galyon, George T., "Annotated Tin Whisker Bibliography and Anthology," Nov. 2003.

Galyon, George T., "Annotated Tin Whisker Bibliography and Anthology," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 94-122, Jan. 2005.

Galyon, George, Smetana, Joe, and Vo, Nick, "Cause of Tin Whiskers Remains Elusive," Lead-free Electronics , vol. xx no. xx, pp. xx-xx, Nov. 2004.

Galyon, George, Smetana, Joe, and Vo, Nick, "Cause of Tin Whiskers Remains Elusive," Advanced Packaging, vol. 13 no. Nov2004 Supplement, pp. 16-18, Nov. 2004.

Galyon, George, Sellers, Glenn, and Gedney, Ron, "Is the Supply Chain Ready for RoHS?," Printed Circuit Design and Manufacture, vol. 22 no. 8, pp. 18, Aug. 2005.

Galyon, George, Sellers, Glenn, and Gedney, Ron, "Is the Supply Chain Ready for RoHS?," Circuits Assembly, vol. 16 no. 8, pp. 36, Aug. 2005.

Galyon, George T., "NEMI Tin Whisker Modeling Project Interim Report," NEMI, July 21, 2003.

Galyon, George, Cole, Marie, Adams, Jacklin, Quick, John, White, Fabio, Ferretti, Lou, and Lau, Sophia, "RoHS - Changing Products to Conform to the New European Union RoHS Regulations," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 601-606.

Galyon, George, Palmer, Larry, and Gedney, Ron, "Theory closes in on causes of tin whiskers," Global SMT & Packaging, vol. 5 no. 9, pp. 10, 12-14, Oct. 2005.

Galyon, George T., Plamer, Larry, "Tin Whisker Microstructural Analysis," IBM eSG.

Galyon, George T., "Tin Whisker to Dos-2010."

Galyon, George, "Whisker Formation Concepts - The End Game," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 7, pp. 1098-1109, July 2011.

Gamberini, Rita, Gebennini, Elisa, Grassi, Andrea, Mora, Cristina, and Rimini, Bianca, "An innovative model for WEEE recovery network management in accordance with the EU directives," International Journal of Environmental Technology and Management, vol. 8 no. 4, pp. 348-368, Mar. 2008. DOI: 10.1504/IJETM.2008.017507

Gamo, Hironori, and Tomioka, Katsuhiro, "Selective-area growth of pulse-doped InAs nanowires on Si and vertical transistor application," Journal of Crystal Growth, vol. 500, pp. 58-62, Oct. 15, 2018.

Gan, Gui-Sheng, Gan, Lin-Qiao, Guo, Ji-Zhao, Xia, Da-Quan, Zhang, Chunhong, Yang, Donghua, Wu, Yiping, and Liu, Cong, "Ultrasonic-Assisted Soldering of Low-Ag SAC Lead-Free Solder Paste at Low-Temperature," Materials Transactions, vol. 59 no. 3, pp. 359-366, 2018.

Gan, Guisheng, Du, Changhua, and Li, Chuntian, "Design of lead-free solders and pollution control of lead," Advanced Materials Research, vol. 881-883, pp. 1435-1438, Jan. 2014.

Gan, Guisheng, Chen, Bida, Wu, Yiping, Yang, Donghua, Chi, Luxin, and Liao, Yingchun, "Effect of Trace Cu on Microstructure, Spreadability and Oxidation Resistance Property of Sn-xCu Solders," Materials Transactions, JIM, vol. 58 no. 4, pp. 549-553, 2017.

Gan, H., and Tu, K. N., "Effect of Electromigration on Intermetallic Compound Formation in Pb-free Solder-Cu Interfaces," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1206-1212.

Gan, H., Choi, W. J., Xu, G., and Tu, K. N., "Electromigration in Solder Joints and Solder Lines," JOM, vol. 54 no. 6, pp. 34-37, June 2002.

Gan, H., Wright, S. L., Polastre, R., Buchwalter, L. P., Horton, R., Andry, P. S., Patel, C., Tsang, C., Knickerbocker, J., Sprogis, E., Pavlova, A., Kang, S. K., and Lee, K. W., "Pb-free Micro-joints (50 um pitch) for the Next Generation Micro-systems: the Fabrication, Assembly and Characterization," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1210-1215.

Gan, H., and Tu, K. N., "Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples," Journal of Applied Physics, vol. 97 no. 6, pp. 063514-1-063514-10, 2005.

Gan, Yong X., Gan, Bo J., and Zhang, Lihua, "Electrochemical deposition of iron nanoneedles on titanium oxide nanotubes," Materials Letters, vol. 65 no. 19-20, pp. 2992-2994, Oct. 2011.

Gancarz, Tomasz, Moser, Zbigniew, Gasior, Wladyslaw, Pstrus, Janusz, and Henein, Hani, "A Comparison of Surface Tension, Viscosity, and Density of Sn and Sn-Ag Alloys Using Different Measurement Techniques," International Journal of Thermophysics, vol. 32 no. 6, pp. 1210-1233, June 2011.

Gancarz, Tomasz, and Gasior, Wladyslaw, "EMF Study of the Liquid Sb-Sn-Zn Alloys," Journal of Phase Equilibria and Diffusion, vol. xx no. x, pp. xx-xx, xxxx.

Gancarz, Tomasz, Pstrus, Janusz, and Berent, Katarzyna, "Interfacial reactions of Sn-Zn-Ag-Cu alloy on soldered Al/Cu and Al/Al joints," Science & Technology of Welding and Joining, vol. 23 no. 7, pp. 558-567, Oct. 2018.

Gancarz, Tomasz, "Physical, Thermal, Mechanical Properties, and Microstructural Characterization of Sn-9Zn-XGa Alloys," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 47 no. 1, pp. 326-333, Jan. 2016.

Gancarz, Tomasz, Gasior, Wladyslaw, and Henein, Hani, "Physicochemical Properties of Sb, Sn, Zn, and Sb-Sn System," International Journal of Thermophysics, vol. 34 no. 2, pp. 250-266, Feb. 2013.

Gancarz, Tomasz, "Physicochemical Properties of Sb-Sn-Zn Alloys," Journal of Electronic Materials, vol. 43 no. 12, pp. 4374-4385, Dec. 2014.

Gancarz, Tomasz, Pstrus, Janusz, Gasior, Wladyslaw, and Henein, Hani, "Physicochemical Properties of Sn-Zn and SAC + Bi Alloys." Journal of Electronic Materials, vol. 42 no. 2, pp. 288-293, Feb. 2013.

Gancarz, Tomasz, "The effect of aging temperature on the phenomena occurring at the interface of solder SnZn with Na on Cu substrate," Materials Letters, vol. 171, pp. 187-190, May 15, 2016.

Gancarz, Tomasz, Pstrus, Janusz, Fima, Przemyslaw, and Mosinska, Sylwia, "Thermal Properties and Wetting Behavior of High Temperature Zn-Al-In Solders," Journal of Materials Engineering and Performance, vol. 21 no. 5, pp. 599-605, May 2012.

Gancarz, Tomasz, Bobrowski, Piotr, Pawlak, Sylwia, Schell, Norbert, Chulist, Robert, and Janik, Katarzyna, "Wetting of Sn-Zn-Ga and Sn-Zn-Na Alloys on Al and Ni Substrate," Journal of Electronic Materials, vol. 47 no. 1, pp. 49-60, Jan. 2018.

Gandhi, M. S., McHardy, J., Robbins, R. E., and Hill, K. S., "Measles and CAF in Printed Wiring Assemblies," Circuit World, vol. 18 no. 4, pp. 23-25, 1992.

Gandova, V. D., Broz, P., Bursik, J., and Vassilev, G. P., "Thermochemical and phase diagram studies of the Sn-Zn-Ni system," Thermochimica Acta, vol. 524 no. 1-2, pp. 47-55, Sept. 20, 2011.

Gandova, V., and Vassilev, G. P., "Thermodynamic optimization and phase equilibria in the ternary system Ni-Sn-Zn," Journal of Alloys and Compounds, vol. 609, pp. 1-6, Oct. 5, 2014.

Gandova, Vania, Soares, Delfim, Lilova, Kristina, Tedenae, Jean-Claude, and Vassilev, Gueorgui P., "Phase equilibria in the Sn-Zn-Ni system," Journal of Materials Research , vol. 102 no. 3, pp. 257-268, Mar 2011.

Ganesan, Prabhu, Kumaraguru, Swaminatha P., and Popov, Branko N., "Nanostructured Zn-Ni Alloys by Pulse Electrodeposition," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 1064-1093.

Ganesan, Sanka, Wu, Ji, Pecht, Michael, Lee, Ricky, Lo, Jeffrey, Fu, Yun, Li, Yonghong, and Xu, Ming, "Assessment of Long-term Reliability in Lead-free Assemblies," Proceedings of 2005 International Conference on Asian Green Electronics , Shang Hai, China, Mar. 15-18, 2005, pp. 140-155.

Ganesan, Sanka, Kim, Geunwoo, Wu, Ji, Pecht, Michael, and Felba, Jan, "Lead-free Assembly Defects in Plastic Ball Grid Array Packages," 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, Oct. 23-26, 2005, pp. 219-223.

Ganesan, Sanka, Wu, Ji, and Pecht, Michael, "Long-Term Reliability of Pb-Free Electronics," Circuitnet, Mar. 8, 2005.

Ganesan, Sanka, and Pecht, Michael, "Open trace defects in FR4 printed circuit boards," Circuit World , vol. 32 no. 1, pp. 3-7, 2006.

Gang, Jin Hyuk, An, Dawn, Joo, Jin Won, and Choi, Joo Ho, "Uncertainty analysis of solder alloy material parameters estimation based on model calibration method," Microelectronics Reliability, vol. 52 no. 6, pp. 1128-1137, June 2012.

Gannamani, Ranjit, and Munamarty, Ramesh, "A Crack-Qualification Procedure for SMDs," Surface Mount Technology (SMT), vol. 10 no. 4, pp. 52, 54, Apr. 1996.

Gannamani, Ranjit, and Pecht, Michael, "An Experimental Study of Popcorning in Plastic Encapsulated Microcircuits," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 19 no. 2, pp. 194-201, June 1996.

Ganster, Andy, "NASA-DoD Lead-Free Electronics Project," IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics, Raleigh, NC, Mar. 11-12, 2008, pp. xx-xx.

Gao, Anran, Lu, Na, Dai, Pengfei, Wang, Yuelin, and Li, Tie, "Design and Optimization of CMOS-Compatible Silicon Nanowires Based Biosensor," Proceedings of SMTA Pan Pacific Symposium, Kauai, HI, Feb. 2-5, 2015, pp. xx-xx.

Gao, Anran, Dai, Pengfei, Lu, Na, Li, Tie, and Wang, Yuelin, "Optimization of Silicon Nanowire based Field-effect pH Sensor with Back Gate Control," 2013 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Suzhou, China, Apr. 7-10, 2013, pp. 116-119.

Gao, Chao, Huang, Chunyue, Fu, Yuxiang, and Liang, Ying, "Stress-strain analysis of micro-scale CSP solder joint under torsional vibration combined loading," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Gao, Chao, Huang, Chunyue, Fu, Yuxiang, and Liang, Ying, "Study on chip component no-fillet solder joint stress and strain under three point bending," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Gao, F., Takemoto, T., "Additives effects on growth pattern modification of Cu6Sn5-based intermetallic compounds during reflow process," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Gao, F., and Takemoto, T., "Effects of addition participation in the interfacial reaction on the growth patterns of Cu6Sn5-based IMCs during reflow process," Journal of Alloys and Compounds, vol. 421 no. 1, pp. 283-288, Sept. 14, 2006.

Gao, F., Wang, C. P., Li, Y. Y., Liu, X. J., Takaku, Y., Ohnuma, I., and Ishida, K., "Experimental Investigation and Thermodynamic Assessment of Phase Equilibria in the Ag-Au-Sn System," Journal of Electronic Materials, vol. 38 no. 10, pp. 2096-2105, Oct. 2009.

Gao, F., Takemoto, T., and Nishikawa, H., "Effects of Co and Ni addition on reactive diffusion between Sn-3.5Ag solder and Cu during soldering and annealing," Materials Science and Engineering A, vol. 420 no. 1-2, pp. 39-46, Mar. 25, 2006.

Gao, F., and Takemoto, T., "Mechanical properties evolution of Sn-3.5Ag based lead-free solders by nanoindentation," Materials Letters, vol. 60 no. 19, pp. 2315-2318, Aug. 2006.

Gao, F., Takemoto, T., Nishikawa, H., and Komatsu, A., "Microstructure and Mechanical Properties Evolution of Intermetallics between Cu and Sn-3.5Ag Solder Doped by Ni-Co Additives," Journal of Electronic Materials, vol. 35 no. 5, pp. 905-911, May 2006.

Gao, F., Nishikawa, H., and Takemoto, T., "Phase Stability Assessment and Microstructure Modification at Lead-free Solder Joint," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Gao, F., and Takemoto, T., "The correlation between the intermetallic compounds growth pattern and the addition in the solder matrix," 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Como, Italy, Apr. 24-26, 2006, pp. xx-xx.

Gao, F., and Takemoto, T., "The Evolution of Plastic Deformation of Sn3.5Ag-Based Lead-Free Solders," Proceedings 56th Electronic Components & Technology Conference , San Diego, CA, May 30-June 2, 2006, pp. 269-274.

Gao, F., Wang, C. P., Liu, X. J., and Ishida, K., "Thermodynamic Assessment of Phase Equilibria in the Sn-Ag-Ni System with Key Experimental Verification," Journal of Electronic Materials, vol. 37 no. 3, pp. 279-287, Mar. 2008.

Gao, F., Wang, S. L., Wang, C. P., and Liu, X. J., "Thermodynamic assessments of the In-Eu and In-Yb systems," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 35 no. 1, pp. 1-5, 2011.

Gao, F., Wang, C. P., Liu, X. J., and Ishida, K., "Thermodynamic Calculation of Phase Equilibria and Its Applications in the Sn-Ag-Cu-Ni-Au System," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Gao, F., Takamoto, T., Nishikawa, H., and Komatsu, A., "Topological Modification of IMC between Cu substrate and Sn-3.5Ag Solder with Addition Co participation," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Gao, Fan, Yin, Qiyue, Wang, Jirui, Zhou, Guangwen, and Gu, Zhiyong, "Synthesis and Characterization of One-Dimensional Cu-Sn Nanowire Diffusion Couples for Nanowire Assembly and Interconnection," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 2329-2334.

Gao, Fei, Wang, Jian-Huan, Watzinger, Hannes, Hu, Hao, Rancic, Marko J., Zhang, Jie-Yin, Wang, Ting, Yao, Yuan, Wang, Gui-Lei, Kukucka, Josip, Vukusic, Lada, Kloeffel, Christoph, Loss, Daniel, Liu, Feng, Katsaros, Georgios, and Zhang, Jian-Jun, "Site-Controlled Uniform Ge/Si Hut Wires with Electrically Tunable Spin-Orbit Coupling," Advanced Materials, vol. 32 no. 16, pp. 1906523-1-1906523-9, Apr. 23, 2020. https://doi-org.ezproxy.uky.edu/10.1002/adma.201906523

Gao, Feng, Nishikawa, Hiroshi, and Takemoto, Tadashi, "Additive Effect of Kirkendall Void Formation in Sn-3.5Ag Solder Joints on Common Substrates," Journal of Electronic Materials, vol. 37 no. 1, pp. 45-50, Jan. 2008.

Gao, Feng, Qu, Jianmin, and Takemoto, Tadashi, "Additive Occupancy in the Cu6Sn5-Based Intermetallic Compound Between Sn-3.5Ag Solder and Cu Studied Using a First-Principles Approach," Journal of Electronic Materials, vol. 39 no. 4, pp. 426-432, Apr. 2010.

Gao, Feng, Qu, Jianmin, and Takemoto, Tadashi, "Additives Participation in Cu6Sn5 Phase Formed between Sn-3.5Ag Solder and Cu by First-Principle Approach," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1014-1020.

Gao, Feng, and Qu, Jianmin, "Calculating the diffusivity of Cu and Sn in Cu3Sn intermetallic by molecular dynamics simulations," Materials Letters, vol. 73, pp. 92-94, Apr. 15, 2012.

Gao, Feng, Cheng, Fangjie, Nishikawa, Hiroshi, and Takemoto, Tadashi, "Characterization of Co-Sn intermetallic compounds in Sn-3.0Ag-0.5Cu-0.5Co lead-free solder alloy," Materials Letters, vol. 62 no. 15, pp. 2257-2259, May 31, 2008.

Gao, Feng, Jing, Jianping, Liang, Frank Z., Williams, Richard L., and Qu, Jianmin, "Cohesive Zone Simulation on Dynamic Fracture at the Interfaces of a Single Solder Joint," 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems , Delft, Netherlands, Apr. 26-29, 2009, pp. xx-xx.

Gao, Feng, and Qu, Jianmin, "Elastic Moduli of (Ni,Cu)3Sn4 Ternary Alloys from First-Principles Calculations," Journal of Electronic Materials, vol. 39 no. 11, pp. 2429-2434, Nov. 2010.

Gao, Feng, Qu, Jianmin, Liang, Frank Z., and Williams, Richard L., "Interfacial Failure Simulation of Single Solder Joint Using a Multiscale Approach," 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June 2-5, 2010, pp. xx-xx.

Gao, Feng, Nishikawa, Hiroshi, and Takemoto, Tadashi, "Intermetallics Evolution in Sn-3.5Ag Based Lead-Free Solder Matrix on an OSP Cu Finish," Journal of Electronic Materials, vol. 36 no. 12, pp. 1630-1634, Dec. 2007.

Gao, Feng, Jing, Jianping, Johnson, Janine, Liang, Frank Z., Williams, Richard L., and Qu, Jianmin, "Loading Direction Versus Crack Propagation Path in a Lead-Free Single Solder Joint Sample," 2008 ASME International Mechanical Engineering Congress and Exposition, Volume 6, Boston, MA, Oct. 31-Nov. 6, 2008, pp. 145-152.

Gao, Feng, Nishikawa, Hiroshi, Takemoto, Tadashi, and Qu, Jianmin, "Mechanical properties versus temperature relation of individual phases in Sn-3.0Ag-0.5Cu lead-free solder alloy," Microelectronics Reliability , vol. 49 no. 3, pp. 296-302, Mar. 2009.

Gao, Feng, Nishikawa, Hiroshi, and Takemoto, Tadashi, "Micromechanical responses of Sn-3.5Ag-xCo lead-free solders by nanoindentation," Materials Science Forum, vol. 580-582, pp. 209-212, 2008.

Gao, Feng, Takemoto, Tadashi, and Nishikawa, Hiroshi, "Morphology and Growth Pattern Transition of Intermetallic Compounds between Cu and Sn-3.5Ag Containing a Small Amount of Additives," Journal of Electronic Materials, vol. 35 no. 12, pp. 2081-2087, Dec. 2006.

Gao, Feng, Nishikawa, Hiroshi, and Takemoto, Tadashi, "Nano-Scale Mechanical Responses of Sn-Ag Based Lead-free Solders," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 205-210.

Gao, Feng, Nishikawa, Hiroshi, Takemoto, Tadashi, and Qu, Jianmin, "Temperature Dependence of Mechanical Properties of Individual Phases in Sn-3.0Ag-0.5Cu Lead-free Solder Alloy," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 466-471.

Gao, Guilian, Roitman, Daniel B., Vijayakumar, Vandana, Honer, Ken, Sun, Xiaobo, Ramesh, Palanisamy, and Haddon, Robert C., "Evaluation of Epoxide Conductive Adhesives Containing Graphite Nano Platelets Fillers," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 1-9.

Gao, He, Wei, Fuxiang, Sui, Yanwei, Qi, Jiqiu, He, Yezeng, and Meng, Qingkun, "Effect of nickel (Ni) on the growth rate of Cu6Sn5 intermetallic compounds between Sn-Cu-Bi solder and Cu substrate," Journal of Materials Science: Materials in Electronics, vol. 30 no. 3, pp. 2186-2191, Feb. 2019.

Gao, Hong, Ma, Jian, Gao, Lilan, Zhang, Dong, and Zhao, Jin, "A Study on the Fatigue Behavior of Anisotropic Conductive Adhesive Film," IEEE Transactions on Device and Materials Reliability, vol. 14 no. 2, pp. 681-688, June 2014.

Gao, Hong, and Chen, Xu, "Effect of axial ratcheting deformation on torsional low cycle fatigue life of lead-free solder Sn-3.5Ag," International Journal of Fatigue, vol. 31 no. 2, pp. 276-283, Feb. 2009.

Gao, Hong, Liu, Lan, Liu, Konghua, Luo, Yuanfang, Jia, Demin, and Lu, Jiasheng, "Preparation of highly conductive adhesives by in situ generated and sintered silver nanoparticles during curing process," Journal of Materials Science: Materials in Electronics, vol. 23 no. 1, pp. 22-30, Jan. 2012.

Gao, Hong, Ma, Jianhua, Gao, Lilan, Yu, Dunji, and Sun, Jinsheng, "Thermal cycling aging effects on the ratcheting behavior of anisotropic conductive film," Soldering & Surface Mount Technology, vol. 27 no. 4, pp. 185-194, 2015.

Gao, Jin Gang, Wu, Yi Ping, Ding, Han, and Wan, Nian Hong, "Thermal profiling: a reflow process based on the heating factor," Soldering & Surface Mount Technology, vol. 20 no. 4, pp. 20-27, 2008.

Gao, JinGang, Wu, YiPing, and Ding, Han, "Optimization of a reflow soldering process based on the heating factor," Soldering & Surface Mount Technology, vol. 19 no. 1, pp. 28-33, 2007.

Gao, Li-Lan, Chen, Xu, Gao, Hong, and Zhang, Shu-Bao, "Description of Nonlinear Viscoelastic Behavior and Creep Rupture Time of Anisotropic Conductive Film," Materials Science and Engineering: A , vol. xx no. x pp. xx-xx, xxxx.

Gao, Li-Lan, Wang, Lei, Gao, Hong, Chen, Gang, and Chen, Xu, "Fatigue life evaluation of anisotropic conductive adhesive film joints under mechanical and hygrothermal loads," Microelectronics Reliability, vol. 51 no. 8, pp. 1393-1397, Aug. 2011.

Gao, Li-Lan, Chen, Xu, and Gao, Hong, "Mechanical Properties of Anisotropic Conductive Adhesive Film Under Hygrothermal Aging and Thermal Cycling," Journal of Electronic Materials , vol. 41 no. 7, pp. 2001-2009, July 2012.

Gao, Li-Lan, Chen, Xu, Zhang, Shu-Bao, and Gao, Hong, "Mechanical Properties of Anisotropic Conductive Film with Strain Rate and Temperature," Materials Science and Engineering: A, vol xxx no. x, pp. xx-xx, xxxx.

Gao, Li li, Xue, Song-bai, and Zhu, Hong, "The Effect of Praseodymium (Pr) Additions on Shear Strength and Microstructure of SnAgCu Joints during the Aging Process," Soldering & Surface Mount Technology, vol. 24 no. 3, pp. xx-xx, 2012.

Gao, Li-Yin, and Liu, Zhi-Quan, "Clarification of Cu rich phase in SAC/FeNi solder joint," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 715-718.

Gao, Li-Yin, Cui, Xian-Wei, Tian, Fei-Fei, and Liu, Zhi-Quan, "Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure," Journal of Electronic Materials, vol. 49 no. 10, pp. 6223-6231, Oct. 2020.

Gao, Li-Yin, Liu, Zhi-Quan, and Li, Cai-Fu, "Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling," Journal of Electronic Materials, vol. 46 no. 8, pp. 5338-5348, Aug. 2017.

Gao, Lijiao, Wang, Jun, Lin, Tiesong, He, Peng, and Lu, Fengjiao, "Improvement of microstructure and mechanical properties of Sn-58Bi alloy with La2O3," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 193-195.

Gao, LiLan, Chen, Xu, and Gao, Hong, "Interfacial thermal stresses in ACF bonding assembly," Microelectronics Reliability, vol. 55 no. 7, pp. 1089-1096, June 2015.

Gao, Lilan, Gao, Hong, and Chen, Xu, "Recent advances in mechanical properties of anisotropic conductive adhesive film for microelectronic packaging," Soldering & Surface Mount Technology, vol. 27 no. 4, pp. 164-177, 2015.

Gao, Lili, Xue, Songbai, Zhang, Liang, Sheng, Zhong, Ji, Feng, Dai, Wei, Yu, Sheng-lin, and Zeng, Guang, "Effect of alloying elements on properties and microstructures of SnAgCu solders," Microelectronic Engineering, vol. 87 no. 11, pp. 2025-2034, Nov. 2010.

Gao, Lili, Xue, Songbai, Zhang, Liang, Xiao, Zhengxiang, Dai, Wei, Ji, Feng, Ye, Huan, and Zeng, Guang, "Effect of praseodymium on the microstructure and properties of Sn3.8Ag0.7Cu solder," Journal of Materials Science: Materials in Electronics, vol. 21 no. 9, pp. 910-916, Sept. 2010.

Gao, Lili, Xue, Songbai, Zhang, Liang, Sheng, Zhong, Zeng, Guang, and Ji, Feng, "Effects of trace rare earth Nd addition on microstructure and properties of SnAgCu solder," Journal of Materials Science: Materials in Electronics , vol. 21 no. 7, pp. 643-648, July 2010.

Gao, Peng, Lin, Jian, Lei, Yongping, and Wen, Guichen, "Drop performance research of silver content on the SnAgCu based lead-free solder of joint level," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 809-813.

Gao, Ruiting, Li, Xiaoyan, and Zhu, Yongxin, "Investigation on the effect of Sn grain number and orientation on the low cycle fatigue deformation behavior of SnAgCu/Cu solder joints," Journal of Materials Science: Materials in Electronics, vol. 26 no. 4, pp. 2175-2180, Apr. 2015.

Gao, Shubo, and Jacobson, David M., "Suitable choices for lead-free hand soldering," Global SMT and Packaging, vol. 8 no. 6, pp. 16-18,20-21, June 2008.

Gao, Shuyan, Zhang, Hongjie, Wang, Xiaomei, Mai, Wenpeng, Peng, Chunyun, and Ge, Liaohai, "Palladium nanowires stabilized by thiol-functionalized ionic liquid: seed-mediated synthesis and heterogeneous catalyst for Sonogashira coupling reaction," Nanotechnology, vol. 16 no. 8, pp. 1234-1237, Aug. 2005.

Gao, Xuesen, Wang, Yining, Li, Wen, Li, Fei, Arandiyan, Hamidreza, Sun, Hongyu, and Chen, Yan, "Free-standing Ni-Co alloy nanowire arrays: Efficient and robust catalysts toward urea electro-oxidation," Electrochimica Acta, vol. 283, pp. 1277-1283, Sept. 1, 2018.

Gao, Xueyun, Zhao, Yanbao, and Xiao, Gaofeng, "Synthesis and characterization of Bi-Pb-Sn alloy nanocrystals and their tribological performances," Journal of Alloys and Compounds, vol. 474 no. 1-2, pp. 73-75, Apr. 17, 2009.

Gao, Y. L., Zhuravlev, E., Zou, C. D., Yang, B., Zhai, Q. J., and Schick, C., "Calorimetric measurements of undercooling in single micron sized SnAgCu particles in a wide range of cooling rates," Thermochimica Acta, vol. 482 no. 1-2, pp. 1-7, Jan. 15, 2009.

Gao, Y. F., Larson, B. C., Lee, J. H., Nicola, L., Tischler, J. Z., and Pharr, G. M., "Lattice Rotation Patterns and Strain Gradient Effects in Face-Centered-Cubic Single Crystals Under Spherical Indentation," Journal of Applied Mechanics, vol. 82 no. 6, pp. 061007-1-061007-10, June 2015. https://doi.org/10.1115/1.4030403

Gao, Y., Song, L., Jiang, P., Liu, L. F., Yan, X. Q., Zhou, Z. P., Liu, D. F., Wang, J. X., Yuan, H. J., Zhang, Z. X., Zhao, X. W., Dou, X. Y., Zhou, W. Y., Wang, G., Xie, S. S., Chen, H. Y., and Li, J. Q., "Silver nanowires with five-fold symmetric cross-section," Journal of Crystal Growth, vol. 276 no. 3-4, pp. 606-612, Apr. 1, 2005.

Gao, Yajun, Fu, Yingqiang, Sun, Wei, Sun, Yinlu, Wang, Hongbo, Wang, Fengyin, and Zhao, Jianwei, "Investigation on the mechanical behavior of fivefold twinned silver nanowires," Computational Materials Science, vol. 55, pp. 322-328, Apr. 2012.

Gao, Yanfang, Cheng, Congqian, Huang, Mingliang, Wang, Lihua, and Zhao, Jie, "Corrosion of Sn-0.75Cu Solder and Sn-0.75Cu/Cu Joint in Salt Solutions," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 916-919.

Gao, Yang, Wang, Fuwei, Ding, Shaohu, Yang, Bin, Liu, Lin, and Salmani, Mohammad, "Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies," Soldering & Surface Mount Technology , vol. 33 no. 1, pp. 1-7, 2021.

Gao, Yan-jun, Luo, Zhong-bing, Zhao, Jie, and Wang, Lai, "Study on the Microstructure and the Shear Strength of Sn-0.7Cu-xZn," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 890-893.

Gao, Yulai, Zou, Changdong, Yang, Bin, Zhai, Qijie, Liu, Johan, Zhuravlev, Evgeny, and Schick, Christoph, "Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy," Journal of Alloys and Compounds , vol. 484 no. 1-2, pp. 777-781, Sept. 18, 2009.

Garami, Tamas, and Krammer, Oliver, "Effect of Solder Joint Volume on its Shear Fracture Mode," 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging , Brasov, Romania, Oct. 22-25, 2015, pp. 89-93.

Garami, Tamas, and Krammer, Oliver, "Investigating Micro-Alloyed Solder Joints with Electrochemical Etching," 2013 36th International Spring Seminar on Electronics Technology , Alba Iulia, Romania, May 8-12, 2013, pp. 161-166.

Garami, Tamas, and Krammer, Oliver, "Investigating Micro-alloyed Solders with Thermal Shock Tests," 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging, Alba Iulia, Romania, Oct. 25-28, 2012, pp. 129-132.

Garami, Tamas, and Krammer, Oliver, "Investigating the Mechanical Effect of the Solder Joint Thickness with Simulation," 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging, Galati, Romania, Oct. 24-27, 2013, pp. 259-262.

Garami, Tamas, Krammer, Oliver, Harsanyi, Gabor, and Martinek, Peter, "Method for validating CT length measurement of cracks inside solder joints," Soldering & Surface Mount Technology, vol. 28 no. 1, pp. xx-xx, 2015.

Garami, Tamas, and Krammer, Oliver, "Quantitative analyses of Ag3Sn intermetallic compound formation in SnAgCu solder alloys," Journal of Materials Science: Materials in Electronics , vol. 26 no. 11, pp. 8540-8547, Nov. 2015.

Garami, Tamas, and Krammer, Oliver, "Quantitative analysis of Ag3Sn particle size in Sn3.5Ag solder alloy," 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging, Bucharest, Romania, Oct. 23-26, 2014, pp. 247-251.

Garcia, Alfredo, Vazquez, Domingo, Macias, Ricardo, Ibarra, Rodrigo, Smetana, Joe, Abtew, Mulugeta, and Muntele, Iulia, "Practical Verification of Void Reduction Method for BTC Using Exposed Via-in-pad," Surface Mount Technology (SMT), vol. 34 no. 11, pp. 80,82-86,88,90-92,94-96, Nov. 2019.

Garcia, Arturo Gavilan, Roman-Moguel, Guillermo, Meraz-Cabrera, Laura, and Acevedo, Joaquin, "Policy options for the management of end of life computers in Mexico," Clean Technologies and Environmental Policy, vol. 14 no. 4, pp. 657-667, Aug. 2012.

Garcia, Cynthia, "NASA-DoD Combined Environments Testing Results," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 467-479.

Garcia, J. M., Asenjo, A., Vazquez, M., Aranda, P., and Ruiz-Hitzky, E., "Characterization of Cobalt Nanowires by Means of Force Microscopy," IEEE Transactions on Magnetics, vol. 36 no. 5 pt.1, pp. 2981-2983, Sept. 2000.

Garcia, Leonardo R., Osorio, Wislei R., Peixoto, Leandro C., and Garcia, Amauri, "Mechanical properties of Sn-Zn lead-free solder alloys based on the microstructure array," Materials Characterization, vol. 61 no. x, pp. 212-220, 2010.

Garcia, Leonardo R., Osorio, Wislei R., Peixoto, Leandro C., and Garcia, Amauri, "Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys," Journal of Electronic Materials, vol. 38 no. 11, pp. 2405-2414, Nov. 2009.

Garcia-Torres, Jose, Gomez, Elvira, and Valles, Elisa, "Electrochemical synthesis of Co-Ag/Ag multilayered nanowires for GMR applications," Materials Letters, vol. 111, pp. 101-103, Nov. 15, 2013. https://doi.org/10.1016/j.matlet.2013.07.132

Gardiner, R. B., and Myhra, S., "Radiation-induced doping effects in a-tin," Journal of Applied Physics , vol. 44 no. 9, pp. 4238-4239, Sept. 1, 1973.

Gardner, A., and Scharf, J., "Trivalent passivation of plated zinc and zinc alloys - alternatives to hexavalent based systems," Transactions of the Institute of Metal Finishing, vol. 81 no. 6, pp. B107-B111, Nov. 2003.

Gardner, Alan, "Decorative Trivalent Chromium Plating - The Challenges of Change Facing the Industry," Plating & Surface Finishing, vol. 94 no. 1, pp. 32-37, Jan. 2007.

Gardner, Alan, "Decorative Trivalent Chromium Plating," Metal Finishing, vol. 104 no. 11, pp. 41-45, Nov. 2006.

Gardner, Alan, and Scharf, John, "High Performance Alternative to Hexavalent Chromium Passivation of Plated Zinc and Zinc Alloys," Society of Automotive Engineers, 2001.

Gardner, R. N., "Controlled Growth of a-Fe Single Crystal Whiskers," Journal of Crystal Growth, vol. 43 no. 4, pp. 425-432, May 1978.

Garich, H., McCrabb, H., Taylor, E. J., and Inman, M., "Controlling Whisker Formation in Tin-Based Solders Using Electrically Mediated Electrodeposition," ECS Transactions, vol. 6 no. 8, pp. 153-163, 2007.

Garich, H., Taylor, E. J., Sun, J., Panashchenko, L., Mathew, S., Osterman, M., and Pecht, M., "Evaluation of Faradayic Plating Method for Controlling Tin Whisker Growth," Proceedings of CALCE International Symposium on Tin Whiskers , College Park, MD, Apr. 24-25, 2007, pp. xx-xx.

Garipcan, Bora, Odabas, Sedat, Demirel, Gokhan, Burger, Joan, Nonnenmann, Stephen S., Coster, Michael T., Gallo, Eric M., Nabet, Bahram, Spanier, Jonathan E., and Piskin, Erhan, "In Vitro Biocompatibility of n-Type and Undoped Silicon Nanowires," Advanced Engineering Materials, vol. 13 no. 1-2, pp. B3-B9, Feb. 2011.

Garner, C. Michael, Gupta, Vivek, Bissessur, Vivek, Kumar, Achut, and Aspandiar, Raiyo, "Challenges in Converting to Lead-free Electronics," Proceedings of 3rd Electronics Packaging Technology Conference, Singapore, Dec. 5-7, 2000, pp. 6-9.

Garner, Luke, Sane, Sandeep, Suh, Daewoong, Byrne, Tiffany, Dani, Ashay, Martin, Ted, Mello, Michael, Patel, Mitesh, and Williams, Richard, "Finding Solutions to the Challenges in Package Interconnect Reliability," Intel Technology Journal, vol. 9 no. 4, pp. 297-308, Nov. 2005.

Garnier, A., Lagoutte, E., Baillin, X., Gillot, C., and Sillon, N., "Gold-Tin Bonding for 200mm Wafer Level Hermetic MEMS Packaging," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1610-1615.

Garnier, Arnaud, Baillin, Xavier, and Hodaj, Fiqiri, "Interfacial reactions and diffusion path in gold-tin-nickel system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging," Journal of Materials Science: Materials in Electronics , vol. xx no. x, pp. xx-xx, xxxx.

Garramone, Tony, "Lead-free: Making the Adjustments," Surface Mount Technology (SMT) , vol. 19 no. 10, pp. 40, 42, Oct. 2005.

Garretson, Mark, Drummond, Al, and Sofer, Nate, "Serving today's non-lead, PVC needs of the wire and cable industry," Wire Journal International, vol. 37 no. 7, pp. 75-77, July 2004.

Garrou, Phil, and Gedney, Ron, "Tin Whiskers: An Industry Perspective," Advanced Packaging, vol. 13 no. 12, pp. 14, Dec. 2004.

Garshasb, Masoud, "Analysis of tin- and nickel-plated copper wire failures for quality improvement," Wire Journal International, vol. 35 no. 9, pp. 86-90, Sept. 2002.

Garshasb, Masoud, "Metallurgical and wiredrawing performance comparison of ETP and oxygen-free copper," Wire Journal International, vol. 40 no. 9, pp. 84-88, Sept. 2007.

Garshasb, Masoud, and Day, Timothy J., "Quality enhancement of ultrafine magnet wire utilizing failure analysis," Wire Journal International, vol. 35 no. 7, pp. 84-89, July 2002.

Garza-Garcia, Rene, Solis-Rodriguez, Javier, and Pena-Rojas, Sergio, "Application of microscope techniques in the magnet wire industry," Wire Journal International, vol. 38 no. 6, pp. 48-51, June 2005.

Garzel, G., and Zabdyr, L. A., "Electromotive Force Study of the Liquid Silver-Bismuth-Tin Alloys," Journal of Phase Equilibria and Diffusion, vol. 27 no. 2, pp. 140-144, Apr. 2006.

Gasior, W., Moser, Z., Debski, A., and Siewert, T., "Integration of the NIST and SURDAT Databases on Physical Properties of Lead-Free Solder Alloys," International Journal of Thermophysics, vol. 31 no. 3, pp. 502-512, Mar. 2010.

Gasior, W., Moser, Z., Pstrus, J., Bukat, K., Kisiel, R., and Sitek, J., "(Sn-Ag)eut + Cu Soldering Materials, Part I: Wettability Studies," Journal of Phase Equilibria and Diffusion, vol. 25 no. 2, pp. 115-121, 2004.

Gasior, W., Moser, Z., and Debski, A., "SURDAT - database of the physical properties of liquid lead-free solders," Archives of Metallurgy and Materials, vol. 49 no. 3, pp. 575-583, 2004.

Gasse, A., Rossat, C., Souriau, J. C., Gillot, C., Glasser, F., and Clemens, J. C., "Assessment of advanced Anisotropic Conductive Films for Flip-Chip Interconnection based on Z axis conductors," 2003 IEEE Nuclear Science Symposium Conference Record, Volume 1, Oct. 19-25, 2003, pp. 237-241.

Gast, Maren, Kontges, Marc, and Brendel, Rolf, "Lead-free On-Laminate Laser Soldering: A New Module Assembling Concept," Progress in Photovoltaics: Research and Applications, vol. 16 no. 2, pp. 151-157, Mar. 2008.

Gatemala, Harnchana, Tongsakul, Duangta, Naranaruemol, Suchapa, Panchompoo, Janjira, Ekgasit, Sanong, and Wongravee, Kanet, "Synthesis of silver microfibers with ultrahigh aspect ratio by galvanic replacement reaction," Materials Chemistry and Physics, vol. 237, pp. 121872-1-121872-9, Nov. 1, 2019.

Gates, Daphne, Wilcoxon, Ross, Hillman, David, and Silk, Julie, "An Investigation on the Influence of Copper and Nickel Solderable Surfaces on Solder Joint Degradation Due to Gold Embrittlement," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 103-110.

Gattuso, Dana Joel, "Mandated Recycling of Electronics: A Lose-Lose-Lose Proposition," Competitive Enterprise Institute, Feb. 1, 2005.

Gatza, Ward, and Evans, Tom, "Thermal Cycle Reliability Study: Vapor Phase BGA Solder Joints," Surface Mount Technology (SMT), vol. 27 no. 6, pp. 24-26,28,30,32,34,36, June 2012.

Gauci, Joseph, Borg, Adrian-Michael, Caruana, Robert, Whitlaw, Keith, and Crosby, Jeff, "The Qualification of a Pure Tin Plating Process as a Lead Free Finish for I.C. Packaging," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Gaudin, Sharon, "Gartner: World is going 'green,' so should PC makers," EE Times , Nov. 29, 2006.

Gaudin, Sharon, "Gartner: World is going 'green,' so should PC makers," EE Times Europe, Nov. 29, 2006.

Gaudin, Sharon, "HP's 2006 recyclables weigh as much as 600 jumbo jets," Green SupplyLine, Jan. 23, 2007.

Gaudin, Sharon, "PC makers need to align with 'green' regulations, warns Gartner," EE Times - Asia, vol. xx no. xx, pp. xx-xx, Dec. 4, 2006.

Gaudin, Sharon, "The world is going 'green' and so should PC makers, says Gartner," Green SupplyLine, Nov. 29, 2006.

Gaugel, Tobias, Bechtel, Sascha, and Neumann-Rodekirch, Jens, "Advanced Micro-Dispensing System for Conductive Adhesives," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, Germany, Oct. 21-24, 2001, pp. 40-45.

Gaul, Jeffrey, "WEEE/RoHS - A Historical Look," Surface Mount Technology (SMT) , vol. 19 no. 4, pp. xx-xx, Apr. 2005.

Gautam, Rajni, Saxena, Manoj, Gupta, R. S., and Gupta, Mridula, "Gate-All-Around Nanowire MOSFET With Catalytic Metal Gate For Gas Sensing Applications," IEEE Transactions on Nanotechnology, vol. 12 no. 6, pp. 939-944, Nov. 2013.

Gawel, Richard, "Getting The Lead Out," Electronic Design, vol. 52 no. 10, pp. 10, May 10, 2004.

Gay, Paul, "Watching the waste line," Engineer, vol. 293 no. 7684, pp. 41-42, Sept. 19, 2005.

Gayle, Frank, "Fatigue resistant, high temperature solder," Advanced Materials & Processes, vol. 159 no. 4, pp. 43-44, Apr. 2001.

Gayle, Frank W., Becka, Gary, Badgett, Jerry, Whitten, Gordon, Pan, Tsung-Yu, Grusd, Angela, Bauer, Brian, Lathrop, Rick, Slattery, Jim, Anderson, Iver, Foley, Jim, Gickler, Alan, Napp, Duane, Mather, John, and Olson, Chris, "High Temperature Lead-Free Solder for Microelectronics," JOM, vol. 53 no. 6, pp. 17-21, June 2001.

Gaynes, Martin A., Lewis, Russell H., Saraf, Ravi F., and Roldan, Judith M., "Evaluation of Contact Resistance for Isotropic Electrically Conductive Adhesives," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, vol. 18 no. 2, pp. 299-304, May 1995.

Gaynes, Michael A., Matienzo, Luis J., Zimmerman, Jeffrey A., and Vanhart, Daniel, "Analysis and Characterization of Electrically Conductive Adhesives," Materials Research Society Symposium Proceedings Volume 445, Boston, MA, Dec. 2-5, 1996, pp. 139-151.

Gaynes, Michael, Kodnani, Ramesh, Pierson, Mark, Hoontrakul, Patricia, and Paquette, Matthew, "Flip Chip Attach with Thermoplastic Electrically Conductive Adhesive," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 244-251.

Ge, Jun, Saarinen, Ilkka, and Savolainen, Petri, "Evaluation of Interposers in the ACF Bonding Process," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1499-1503.

Ge, Yun, Cook, Jeffrey, Pei, Min, Vujosevic, Milena, Zhou, Bite, and Nad, Suddhasattwa, "Solder Joint Height Impact on Temperature Cycle Reliability of BGA Components with Thermal Enabling Load," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 684-689.

Geaney, Hugh, Dickinson, Calum, Barrett, Christopher A., and Ryan, Kevin M., "High Density Germanium Nanowire Growth Directly from Copper Foil by Self-Induced Solid Seeding," Chemistry of Materials, vol. 23 no. 21, pp. 4838-4843, Nov. 8, 2011.

Geaney, Hugh, Kennedy, Tadhg, Dickinson, Calum, Mullane, Emma, Singh, Ajay, Laffir, Fathima, and Ryan, Kevin M., "High Density Growth of Indium seeded Silicon Nanowires in the Vapor phase of a High Boiling Point Solvent," Chemistry of Materials, vol. 24 no. 11, pp. 2204-2210, June 12, 2012.

Geczy, A., Tersztyanszky, L., Illes, B., Kemler, A., and Szabo, A., "Reducing Lead-free Soldering Failures Caused by Printed Circuit Board Shrinkage," 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging, Galati, Romania, Oct. 24-27, 2013, pp. 65-68.

Geczy, Attila, Illes, Balazs, Peter, Zsolt, and Illyefalvi-Vitez, Zsolt, "Characterization of vapour phase soldering process zone with pressure measurements," Soldering & Surface Mount Technology, vol. 25 no. 2, pp. 99-106, 2013.

Geczy, Attila, Straubinger, Daniel, Kovacs, Andras, Krammer, Oliver, Mach, Pavel, and Harsanyi, Gabor, "Effects of high current density on lead-free solder joints of chip-size passive SMD components," Soldering & Surface Mount Technology , vol. 30 no. 2, pp. 74-80, 2018.

Geczy, Attila, Batorfi, Reka, Gal, Laszlo, Illyefalvi-Vitez, Zsolt, and Szoke, Peter, "Evaluating Vapor Phase Soldering for Fine Pitch BGA," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 482-487.

Geczy, Attila, Fejos, Marta, and Tersztyanszky, Laszlo, "Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering," Soldering & Surface Mount Technology, vol. 27 no. 2, pp. 61-68, 2015.

Geczy, Attila, Straubinger, Daniel, Hurtony, Tamas, Krammer, Oliver, and Kovacs, Andras, "Investigating current density in the lead free solder joints of surface mounted resistors with experimental approach," 2017 40th International Spring Seminar on Electronics Technology, Sofia, Bulgaria, May 10-14, 2017, pp. xx-xx.

Geczy, Attila, Lener, Vilmos, Hajdu, Istvan, and Illyefalvi-Vitez, Zsolt, "Low temperature soldering on biopolymer (PLA) Printed Wiring Board substrate," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 57-62.

Geczy, Attila, Gal, Laszlo, Hajdu, Istvan, Kovacs, Balint, Nagy, Daniel, and Ruszinko, Miklos, "Optimizing Solder Joints on Biodegradable PCBs with Vapour Phase Soldering," Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, Dresden, Germany, May 7-11, 2014, pp. 33-38.

Geczy, Attila, Szoke, Peter, Illyefalvi-Vitez, Zsolt, Ruszinko, Miklos, and Bunea, Radu, "Soldering Profile Optimization for Vapour Phase Reflow Technology," 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging, Timisoara, Romania, Oct. 20-23, 2011, pp. 149-152.

Gedney, Ronald W., "Foreward Special Section on Tin Whiskers," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 30 no. 1, pp. xx-xx, Jan. 2007.

Gedney, Ron, Smetana, Joe, Vo, Nhat, and Galyon, George, "NEMI Tin Whisker Projects." Second International Conference on Lead Free Electronics, Amsterdam, Netherlands, June 21-23, 2004, pp. xx-xx.

Gee, Stephen, Kelkar, Nikhil, Huang, Joanne, and Tu, King-Ning, "Lead-Free and SnPb Bump Electromigration Testing," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B, San Francisco, CA, July 17-22, 2005, pp. 1313-1321.

Gee, Stephen, Nguyen, Luu, Huang, Joanne, and Tu, King-Ning, "Mean Time to Failure in Wafer Level-CSP Packages with SnPb and SnAgCu Solder Bumps," Second International Wafer-Level Packaging Congress, San Jose, CA, Nov. 3-4, 2005, pp. 159-167.

Geering, Warren, "Soldering," Materials Australia, vol. 37 no. 3, pp. 15-16, May/June 2004.

Geers, M. G. D., Ubachs, R. L. J. M., Erinc, M., Matin, M. A., Schreurs, P. J. G., and Vellinga, W. P., "Multiscale Analysis of Microstructural Evolution and Degradation in Solder Alloys," International Journal for Multiscale Computational Engineering , vol. 5 no. 2, pp. 93-103, 2007.

Geers, M. G. D., Erinc, M., and Matin, M. A., "Multi-scale analysis of solder interconnects in micro-electronics," 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, Delft, Netherlands, Apr. 26-29, 2009, pp. xx-xx.

Geers, M. G. D., Ubachs, R. L. J. M., Erinc, M., and Matin, M. A., "Multi-scale numerical-experimental analysis of failure in solder alloys," Materials Science Forum, vol. 539-543 part 1, pp. 66-73, 2007.

Gehlawat, Devender, and Chauhan, R. P., "Swift heavy ions induced variation in the electronic transport through Cu nanowires," Materials Chemistry and Physics, vol. 145 no. 1-2, pp. 60-67, May 15, 2014.

Geibig, Jack, "Current Activities of a Life-Cycle Environmental Impact Evaluation of Tin-Lead and Lead Free Solder," University of Tennessee, Nov. 14, 2002.

Geibig, Jack R., and Socolof, Maria Leet, "Solders in Electronics: A Life-Cycle Assessment," United States Environmental Protection Agency, EPA-744-R-05-001, Aug. 2005.

Geibig, Jack, and Socolof, Maria, "Summary of Activities for a Life-Cycle Environmental Impact Evaluation of Tin-Lead and Lead Free Solder," SPVC meeting, Apr. 1, 2003.

Geibig, Jack, "Why Industry Needs a Life-Cycle Environmental Impact Evaluation of Tin-Lead and Lead-Free Solder," IPC SMEMA Council's APEX 2002, San Diego, CA, Jan. 19-24, 2002.

Geiger, David A., Yu, Jin, and Shangguan, Dongkai, "Assembly & rework processes for large and complex PCBs using lead-free solder," Global SMT & Packaging, vol. 4 no. 4, pp. 16-19, Apr. 2004.

Geiger, David A., Yu, Jin, and Shangguan, Dongkai, "Development of Assembly and Rework Processes for Large and Complex PCBs Using Lead-Free Solder," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S29-3-1-S29-3-7.

Geiger, David A., Liu, Yueli, and Shangguan, Dongkai, "Evaluation of OSP Surface Finishes for Lead-Free Soldering," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 563-567.

Geiger, David, Chang, Pamela, Lewis, Alington, Ward, Charles, Yi, Sammy, and Arra, Minna, "Investigation of Anisotropic Conductive Adhesive Interconnect Assembly Process onto an Organic Substrate," 2001 SMTA International Conference Proceedings, Chicago, IL, Sept. 30-Oct. 4, 2001, pp. xx-xx.

Geiger, David A., Shangguan, Dongkai, and Rooney, Dan, "Investigation of Solder Ball Attachment Processes," IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, San Jose, CA, July 16-18, 2003, pp. 443-445.

Geiger, David, Phanavong, Damone, Castello, Todd, and Shangguan, Dongkai, "Large Area Array Package Lead-Free Rework Study," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 268-271.

Geiger, David, Osgood, Howard, and Shangguan, Dongkai, "Low Temperature Solder Experience," Proceedings of SMTA International , Rosemont, IL, Sept. 22-26, 2019, pp. xx-xx.

Geiger, David, Mattsson, Fredrik, Shangguan, Dongkai, Ong, M. T., Wong, Patrick, Wang, Mei, Castello, Todd, amd Yi, Sammy, "Process Characterization of PCB Assembly Using 0201 Packages with Lead-Free Solder," 2002 NEPCON West - Fiberoptic Expo Conference Proceedings , 2002, pp. 240-244.

Geiger, David, Mattsson, Fredrik, Shangguan, Dongkai, Ong, M. T., Wong, Patrick, Wang, Mei, Castello, Todd, amd Yi, Sammy, "Process characterization of PCB assembly using 0201 packages with lead-free solder," Soldering & Surface Mount Technology, vol. 15 no. 2, pp. 22-27, 2003.

Geiger, David, Wang, Mei, Shangguan, Dongkai, Castello, Todd, and Mattsson, Fredrik, "Reliability Study of Solder Joints for 0201 Components," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 27-30.

Geiger, David, Shangguan, Dongkai, and Yi, Sammy, "Thermal Study of Lead-Free Reflow Solder Processes," IPC and JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 23-24, 2003, pp. 95-98.

Geipel, Torsten, and Eitner, Ulrich, "Cure Kinetics of Electrically Conductive Adhesives for Solar Cell Interconnection," IEEE Journal of Photovoltaics, vol. 3 no. 4, pp. 1208-1214, Oct. 2013.

Geisler, Karl J. L., "Solder Fatigue Impacts of Conformal Coating for Tin Whisker Mitigation on Chip-Scale Thin Small Outline Packages," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 915-920.

Gela, Theodore, "Chemical Reactions with White and Gray Tin," Journal of Chemical Physics, vol. 24 no. 5, pp. 1009-1011, May 1, 1956.

Gelbstein, M., Froumine, N., and Frage, N., "The effect of an interfacial tantalum oxide layer on interactions in the Ta/Sn system," Journal of Materials Science, vol. 45 no. 8, pp. 2133-2139, Apr. 2010.

Geldien, Gail Stribling, and Fullen, W. John, "Troubleshooting Chromium Conversion Coatings on Aluminum," Products Finishing, vol 84 no. 3, pp. 24-25, Dec. 2019.

Genanu, Mohammed, Wilcox, Jim, Cotts, Eric, Choi, Jae Joon, and Kim, Ki Seok, "Effect of Process Thermal History on the Microstructure of Copper Pillar SnAg Solder Joints," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 522-530.

Genanu, Mohammed, Mutuku, Francis, Cotts, Eric J., Wilcox, James, Arfaei, Babak, and Perfecto, Eric, "Effect of Processing Variables on the Mechanical Reliability of Copper Pillar SnAg Solder Joints," 2017 IEEE 67th Electronic Components and Technology Conference, Orlando, FL, May 30-June 2, 2017, pp. 423-428.

Genanu, Mohammed, Arfaei, Babak, Wilcox, James, Perfecto, Eric, and Cotts, Eric J., "Effect of Processing Variables on the Mechanical Reliability of Free Solder Joints," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 568-575.

Genanu, Mohammed, Arfaei, Babak, Cotts, Eric J., Mutuku, Francis, Perfecto, Eric, Pollard, Scott, and Shorey, Aric, "Microstructure and Performance of Micro Cu Pillars Solder Caps and Assemblies," SMTA Journal, vol. 30 no. 4, pp. 13-21, 2017.

Genanu, Mohammed, Arfaei, Babak, Cotts, Eric J., Mutuku, Francis, Perfecto, Eric, Pollard, Scott, and Shorey, Aric, "Microstructure and Reliability of Tin-Silver Micro-Copper Pillar Assemblies," Electronic Device Failure Analysis, vol. 20 no. 1, pp. 20-27,30-31, Feb. 2018.

Genanu, Mohammed, Hadian, Faramarz, Owen, Randy, and Cotts, Eric J., "The Effect of Thermal History on the Microstructure of SnAgCu/SnBiAg Mixed Assemblies," Journal of Electronic Materials, vol. 50 no. 1, pp. 209-216, Jan. 2021. https://doi-org.ezproxy.uky.edu/10.1007/s11664-020-08474-3

Geng, Jie, Zhang, Hongwen, Mutuku, Francis, and Lee, Ning-Cheng, "Novel Solder Ally with Wide Service Temperature Capability for Automotive Applications," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1700-1707.

Geng, Jie, Zhang, Hongwen, Mutuku, Francis, and Lee, Ning-Cheng, "Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 300-307.

Geng, Jie, Zhang, Hongwen, Mutuku, Francis, and Lee, Ning-Cheng, "Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 2336-2344.

Geng, Phil, Aspandiar, Raiyo, Byrne, Tiffany, Pon, Florence, Suh, Daewoong, McAllister, Alan, Nazario, Arnaldo, Paulraj, Prawin, Armendariz, Norman, Martin, Ted, and Worley, Tom, "Alternative Lead-free Solder Joint Integrity Under Room Temperature Mechanical Load," The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 304-309.

Geng, Xiaohua, Navarrete, Eric, Liang, Wentao, and Podlaha, Elizabeth J., "Electrodeposited Fe-Mo-Ni nanowires and Cu-Mo-Fe-Ni alloy nanowire segments," Materials Letters, vol. 211, pp. 9-12, Jan. 15, 2018.

Genin, F. Y., "Effect of stress on grain boundary motion in thin films," Journal of Applied Physics, vol. 77 no. 10, pp. 5130-5137, May 15, 1995.

Genin, F. Y., and Siekhaus, W. J., "Experimental study to validate a model of hillock's formation in aluminum thin films," Journal of Applied Physics, vol. 79 no. 7, pp. 3560-3566, Apr. 1, 1996.

Gensch, Carl-Otto, Zangl, Stephanie, Moller, Martin, Lohse, Joachim, Muller, Jutta, Schischke, Karsten, and Deubzer, Otmar, "Adaptation to scientific and technical progress under Directive 2002/95/EC - Final Report, Annex 1," Oko-Institute, July 28, 2006.

Gensch, Carl-Otto, Zangl, Stephanie, Moller, Martin, Lohse, Joachim, Muller, Jutta, Schischke, Karsten, and Deubzer, Otmar, "Adaptation to scientific and technical progress under Directive 2002/95/EC - Final Report, Annex 2" Oko-Institute, July 28, 2006.

Gensch, Carl-Otto, Zangl, Stephanie, Moller, Martin, Lohse, Joachim, Muller, Jutta, Schischke, Karsten, and Deubzer, Otmar, "Adaptation to scientific and technical progress under Directive 2002/95/EC - Final Report, Annex 3" Oko-Institute, July 28, 2006.

Gensch, Carl-Otto, Zangl, Stephanie, Moller, Martin, Lohse, Joachim, Muller, Jutta, Schischke, Karsten, and Deubzer, Otmar, "Adaptation to scientific and technical progress under Directive 2002/95/EC - Final Report," Oko-Institute, July 28, 2006.

Gensch, Carl-Otto, Moller, Martin, Zangl, Stephanie, Lohse, Joachim, Deubzer, Otmar, Schischke, Karsten, and Muller, Jutta, "Adaptation to scientific and technical progress under Directive 2002/95/EC - Interim Report," Oko-Institute, Oct. 28, 2005.

Genut, M., Li, Z., Bauer, C. L., Mahajan, S., Tang, P. F., and Milnes, A. G., "Characterization of the early stages of electromigration at grain boundary triple junctions," Applied Physics Letters, vol. 58 no. 21, pp. 2354-2356, May 27, 1991.

George, Allen Jose, Zipprich, Juergen, Klingler, Markus, Breitenbach, Marlies, and Nowottnick, Mathias, "Study on the Interdependence of Soldering Profile, Ageing Conditions and Intermetallic Layer Thickness in Large Area Solder Joints and its Influence on Reliability," 2017 40th International Spring Seminar on Electronics Technology , Sofia, Bulgaria, May 10-14, 2017, pp. xx-xx.

George, Elviz, Osterman, Michael, and Pecht, Michael, "An evaluation of dwell time and mean cyclic temperature parameters in the Engelmaier model," Microelectronics Reliability, vol. 55 no. 3-4, pp. 582-587, Feb.-Mar. 2015.

George, Elviz, Das, Diganta, Osterman, Michael, and Pecht, Michael, "Reliability of SAC305 and Sn3.5Ag Solders Under High Temperature Thermal Cycling," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

George, Elviz, and Pecht, Michael, "RoHS compliance in safety and reliability critical electronics," Microelectronics Reliability, vol. 65, pp. 1-7, Oct. 2016.

George, Elviz, Osterman, Michael, Pecht, Michael, Coyle, Richard, Parker, Richard, and Benedetto, Elizabeth, "Thermal Cycling Reliability of Alternative Low-Silver Tin-Based Solders," Journal of Microelectronics and Electronic Packaging, vol. 11 no. 4, pp. 137-145, Oct. 2014.

George, Elviz, Das, Diganta, Osterman, Michael, and Pecht, Michael, "Thermal Cycling Reliability of Lead-Free Solders (SAC305 and Sn3.5Ag) for High-Temperature Applications," IEEE Transactions on Device and Materials Reliability, vol. 11 no. 2, pp. 328-338, June 2011.

George, Elviz, and Pecht, Michael, "Tin whisker analysis of an automotive engine control unit," Microelectronics Reliability, vol. 54 no. 1, pp. 214-219, Jan. 2014.

George, Micheal W., "Bismuth," Minerals Yearbook: Volume I. -- Metals and Minerals , 2003.

George, Micheal W., "Germanium," Minerals Yearbook: Volume I. -- Metals and Minerals, 2003.

George, Micheal W., "Indium," Minerals Yearbook: Volume I. -- Metals and Minerals, 2003.

Georgiadis, Patroklos, and Besiou, Maria, "Sustainability in electrical and electronic equipment closed-loop supply chains: A System Dynamics approach," Journal of Cleaner Production , vol. 16 no. 15, pp. 1665-1678, Oct. 2008.

Georgiev, Vihar P., Mirza, Muhammad M., Dochioiu, Alexandru-Iustin, Adamu-Lema, Fikru, Amoroso, Salvatore M., Towie, Ewan, Riddet, Craig, MacLaren, Donald A., Asenov, Asen, and Paul, Douglas J., "Experimental and Simulation Study of Silicon Nanowire Transistors Using Heavily Doped Channels," IEEE Transactions on Nanotechnology, vol. 16 no. 5, pp. 727-735, Sept. 2017.

Georgiev, Yordan M., Petkov, Nikolay, McCarthy, Brendan, Yu, Ran, Djara, Vladimir, O'Connell, Dan, Lotty, Olan, Nightingale, Adrian M., Thamsumet, Nuchutha, deMello, John C., Blake, Alan, Das, Samaresh, and Holmes, Justin D., "Fully CMOS-compatible top-down fabrication of sub-50nm silicon nanowire sensing devices," Microelectronic Engineering, vol. 118, pp. 47-53, Apr. 25, 2014.

Georgiou, E. P., Van der Donck, T., and Celis, J.-P., "Electrodeposition and structural characteristics of intermetallic nickel-tin based coatings," Transactions of the IMF, vol. 97 no. 6, pp. 301-307, 2017. https://doi.org/10.1080/00202967.2017.1352125

Gera, Gunter, Welzel, Udo, Jizhe, Yin, and Feufel, Harald, "Qualitative Model Describing Hot Tear Above VIPPO and Numerous Other Design Elements," Proceedings of SMTA International, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Geraghty, Kate, "An update on the WEEE and RoHS directives," Circuit World, vol. 29 no. 4, pp. 51-52, 2003.

Geraghty, Kate, "REACH: implications of Europe's new chemicals policy for PCB fabricators," Circuit World, vol. 34 no. 4, pp. 14-18, 2008.

Geranmayeh, A. R., Mahmudi, R., and Kangooie, M., "High-temperature shear strength of lead-free Sn-Sb-Ag/Al2O3 composite solder," Materials Science and Engineering: A, vol. 528 no. 12, pp. 3967-3972, May 2011.

Geranmayeh, A. R., Mahmudi, R., Khalatbari, F., Kashi, N., and Nayyeri, G., "Indentation Creep of Lead-Free Sn-5Sb Solder Alloy with 1.5 wt% Ag and Bi Additions," Journal of Electronic Materials, vol. 43 no. 3, pp. 717-723, Mar. 2014.

Geranmayeh, A. R., Nayyeri, G., and Mahmudi, R., "Microstructure and impression creep behavior of lead-free Sn-5Sb solder alloy containing Bi and Ag," Materials Science and Engineering: A, vol. 547, pp. 110-119, June 15, 2012.

Geranmayeh, A. R., and Mahmudi, R., "Power law indentation creep of Sn-5% Sb solder alloy," Journal of Materials Science, vol. 40 no. 13, pp. 3361-3366, July 2005.

Geranmayeh, A. R., and Mahmudi, R., "Room-Temperature Indentation Creep of Lead-Free Sn-5%Sb Solder Alloy," Journal of Electronic Materials, vol. 34 no. 7, pp. 1002-1009, July 2005.

Gerber, Mark, Thompson, Trent, and O'Connor, Shawn, "Evaluation of Advanced Materials to Satisfy Higher Reflow and Solder Joint Life Requirements on MAP BGA," 2001 Advanced Packaging Technology Conference Proceedings, 2001, pp. xx-xx.

Gerber, Mark, Thompson, Trent, and O'Connor, Shawn, "Evaluation of Advanced Materials to Satisfy Higher Reflow and Solder Joint Life Requirements on MAP BGA," Proceedings 2001 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4587), Baltimore, MD, Oct. 9-11, 2001, pp. 32-36.

Geren, David, "Reduction of Hazardous Substances (RoHS)," CineMag Application Note AN-105, Mar. 29, 2006.

Gerlat, Allan, "Physician, heal thyself: More look to producers for waste solutions," Waste News, vol. xx no. x, pp. xx-xx, Mar. 28, 2005.

Gerrard, Jason, and Kandlikar, Milind, "Is European end-of-life vehicle legislation living up to expectations? Assessing the impact of the ELV Directive on 'green' innovation and vehicle recovery," Journal of Cleaner Production, vol. 15 no. 1, pp. 17-27, 2007.

Gerrer, L., Georgiev, V., Amoroso, S. M., Towie, E., and Asenov, A., "Comparison of Si < 100 > and < 110 > crystal orientation nanowire transistor reliability using Poisson-Schrodinger and classical simulations," Microelectronics Reliability, vol. 55 no. 9-10, pp. 1307-1312, Aug.-Sept. 2015.

Getten, J. R., and Senger, R. C., "Immersion Wave Soldering Process," IBM Journal of Research and Development, vol. 26 no. 3, pp. 379-382, 1982.

Geyczy, Attila, Krammer, Oliver, Kovacs, Andras, and Sipos, Andras, "Analysing Current Density in the Solder Joints of Chip-Size Surface Mounted Resistors," 2015 38th International Spring Seminar on Electronics Technology, Eger, Hungary, May 6-10, 2015, pp. 376-380.

Geyer, R., Oliver, J., Amirtarajah, R., Akella, V., and Chong, F. T., "Microchip Reuse: Environmental Rationale and Design Implications," 2008 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 19-21, 2008, pp. xx-xx.

Ghaffarian, R., "Visual and X-ray Inspection Characteristics of Eutectic and Lead Free Assemblies," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 549-559.

Ghaffarian, Reza, "Assembly Reliability of BGAs and Effects of Board Finish," Proceedings of the Technical Program NEPCON West '99, Volume 3, Anaheim, CA, Feb. 23-25, 1999, pp. 1661-1669.

Ghaffarian, Reza, "Assembly Reliability of FPBG/FCBGA on HASL/ENEPIG," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 944-951.

Ghaffarian, Reza, "CCGA packages for space applications," Microelectronics Reliability , vol. 46 no. 12, pp. 2006-2024, Dec. 2006.

Ghaffarian, Reza, and Meilunas, Michael, "Characterization of SiP Assembly and Reliability Under Thermal Cycles," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Ghaffarian, Reza, "Effect of Area Array Package Types on Assembly Reliability and omments on IPC-9701A," IPC Printed Circuits Expo, APEX and the Designer Summit , Anaheim, CA, Feb. 8-10, 2006, pp. S15-01-1-S15-01-24.

Ghaffarian, Reza, "Effect of Thermal Cycling on Subsequent Drop Behavior of CGA1272 Assemblies," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 105-116.

Ghaffarian, Reza, "IPC 6-10 Product Reliability Pb-Free Activities," IPC/iNEMI Reliability Summit, Los Angeles, CA, Feb. 23, 2007, pp. xx-xx.

Ghaffarian, Reza, "IPC-97xx Assembly Reliability Specification and Test Data," Overcoming the Reliability Challenge: An IPC Summit, Andover, MA, Apr. 15, 2008, pp. xx-xx.

Ghaffararian, Reza, Ramkumar, S. Manian, and Varanasi, Arun, "Lead Free 0201 Assembly and Thermal Cycle/Aging Reliability," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S01-01-1-S01-01-20.

Ghaffarian, Reza, "Lead-Free vs Tin-Lead Reliability of Advanced Electronic Assemblies,", Microelectronics Reliability and Qualification Workshop, Manhattan Beach, CA, Dec. 2005, pp. xx-xx.

Ghaffarian, Reza, "Reliability of ENEPIG by Sequential Thermal Cycling and Aging," 2017?

Ghaffarian, Reza, "Reliability of PWB microvias for high density package assembly," International Journal of Materials and Structural Integrity, vol. 2 no. 1-2, pp. 47-63, June 2008. DOI: 10.1504/IJMSI.2008.018900

Ghaffarian, Reza, Ramkumar, S. Manian, and Varanasi, Arun, "Thermal Cycle/Aging Reliability of Lead Free 0201 Assemblies," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1940-1956.

Ghanbari, Zahra, Susan, Donald F., Pillars, Jamin, Dickens, Sara, and McKenzie, Bonnie, "Investigation of Cadmium Plating Microstructure and Whisker Growth Conditions," Sandia Report SAND2018-11370C, 2018.

Ghani, Noor Asikin Ab, Yahya, Iziana, Salleh, Mohd Arif Anuar Mohd, Shamsuddin, Saidatulakmar, Ahmad, Zainal Ariffin, and Mayappan, Ramani, "Solder Microstructure and Intermetallic Interface Evaluation Between Sn-3.5Ag-1.0Cu-xNi Lead Free Solder Under Long Time Thermal Aging (x: 0, 0.05, 0.2, 0.5)," 2012 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Nov. 6-8, 2012, pp. xx-xx.

Gharaibeh, Mohammad, "Experimental and numerical fatigue life assessment of SAC305 solders subjected to combined temperature and harmonic vibration loadings," Soldering & Surface Mount Technology, vol. 32 no. 3, pp. 181-187, 2020.

Gharaibeh, Mohammad, Stewart, Aaron J., Su, Quang T., and Pitarresi, James M., "Experimental and numerical investigations of the vibration reliability of BGA and LGA solder configurations and SAC105 and 63Sn37Pb solder alloys," Soldering & Surface Mount Technology, vol. 31 no. 2, pp. 77-84, 2019.

Ghariban, Nasser, and Petsche, Arnold E., "Temperature distribution over components with non-uniform current density," Wire Journal International, vol. 38 no. 2, pp. 67-70, Feb. 2005.

Ghasemi, Masoomeh, Selleby, Malin, and Johansson, Jonas, "Thermodynamic assessment and binary nucleation modeling of Sn-seeded InGaAs nanowires," Journal of Crystal Growth, vol. 478, pp. 152-158, Nov. 15, 2017.

Ghildyal, Anupam, and Glasgow, Curtis, "Replacing Chromium Plating with Environmentally Friendly Composite Coatings," Advanced Materials & Processes, vol. 169 no. 5, pp. 62-63, May 2011.

Ghorbani, Hamid R., and Spelt, Jan K., "An Analytical Elasto-Creep Model of Solder Joints in Leadless Chip Resistors: Part 2- Applications in Fatigue Reliability Predictions for SnPb and Lead-Free Solders," IEEE Transactions on Advanced Packaging, vol. 30 no. 4, pp. 695-704, Nov. 2007.

Ghosh, B., Ghosh, M. K., Parhi, P., Mukherjee, P. S., and Mishra, B. K., "Waste Printed Circuit Boards recycling: an extensive assessment of current status," Journal of Cleaner Production, vol. 94, pp. 5-19, May 1, 2015.

Ghosh, C., "Interdiffusion study in binary gold-tin system," Intermetallics, vol. 18 no. 11, pp. 2178-2182, Nov. 2010.

Ghosh, C., "Study on important diffusion parameters of binary Ni3Sn4 phase," Journal of Materials Science: Materials in Electronics, vol. 24 no. 7, pp. 2558-2561, July 2013.

Ghosh, G., "A Comparative Study of the Kinetics of Interfacial Reaction between Eutectic Solders and Cu/Ni/Pd Metallization," Journal of Electronic Materials , vol. 29 no. 10, pp. 1182-1193, Oct. 2000.

Ghosh, G., Loomans, M., and Fine, M. E., "An Investigation of Phase Equilibria of the Bi-Sb-Sn System," Journal of Electronic Materials, vol. 23 no. 7, pp. 619-623, July 1994.

Ghosh, G., "First-Principles Calculation of Phase Stability and Cohesive Properties of Ni-Sn Intermetallics," Metallurgical and Materials Transactions A , vol. 40 no. 1, pp. 4-23, Jan. 2009 .

Ghosh, G., "Interfacial Reaction between Multicomponent Lead-Free Solders and Ag, Cu, Ni, and Pd Substrates," Journal of Electronic Materials, vol. 33 no. 10, pp. 1080-1091, Oct. 2004.

Ghosh, G., and Pfeifer, M. J., "Interfacial Reactions Between a Pb-Free Solder and Die Backside Metallizations," Journal of Electronic Materials, vol. 30 no. 9, pp. 1145-1151, Sept. 2001.

Ghosh, G., "Phase stability and cohesive properties of Au-Sn intermetallics: A first-principles study," Journal of Materials Research, vol. 23 no. 5, pp. 1398-1416, May 2008.

Ghosh, G., and Asta, M., "Phase stability, phase transformations, and elastic properties of Cu6Sn5: Ab initio calculations and experimental results," Journal of Materials Research, vol. 20 no. 11, pp. 3102-3117, Nov. 2005.

Ghosh, G., "Reactive Interdiffusion between a Lead-Free Solder and Ti/Ni/Ag Thin-Film Metallizations," Journal of Electronic Materials, vol. 33 no. 3, pp. 229-240, Mar. 2004.

Ghosh, Kalyan, McCabe, Mark, and Tian, Guoyun, "Advances in Flip Chip Underfill Technology for Lead-free Component Packaging," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 2, Orlando, FL, May 31-June 3, 2005, pp. 1480-1485.

Ghosh, Kalyan, and Tian, Guoyun, "Characterization and Reliability Performance of an Advanced Underfill Encapsulant for Lead-Free Flip Chip Interconnection," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 360-364.

Ghosh, M., Kar, Abhijit, Das, S. K., and Ray, A. K., "Aging Characteristics of Sn-Ag Eutectic Solder Alloy with the Addition of Cu, In, and Mn," Metallurgical and Materials Transactions A, vol. 40 no. 10, pp. 2369-2376, Oct. 2009.

Ghosh, M., Gunjan, M. K., Das, S.,K., Kar, A., Ghosh, R. N., and Ray, A. K., "Effect of Mn on Sn-Ag-Cu ternary lead free solder alloy-Cu assembly: a comparative study," Materials Science and Technology, vol. 26 no. 5, pp. 610-614, May 2010.

Ghosh, P., Mezbahul-Islam, M., and Medraj, M., "Critical assessment and thermodynamic modeling of Mg-Zn, Mg-Sn, Sn-Zn and Mg-Sn-Zn systems," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 36, pp. 28-43, Mar. 2012.

Ghosh, Rituparna, Kanjilal, Anwesha, and Kumar, Praveen, "Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints," Microelectronics Reliability, vol. 74, pp. 44-51, July 2017.

Ghosh, S. K., Haseeb, A. S. M. A., and Afifi, Amalina, "Effects of metallic nanoparticle doped flux on interfacial intermetallic compounds between Sn-3.0Ag-0.5Cu and copper substrate," 2013 IEEE 15th Electronics Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp. 21-26.

Ghosh, Sadhan Kumar, Debnath, Biswajit, Baidya, Rahul, De, Debashree, Li, Jinhui, Ghosh, Sannidhya Kumar, Zheng, Lixia, Awasthi, Abhishek Kumar, Liubarskaia, Maria A., Ogola, Jason S., and Tavares, Andre Neiva, "Waste electrical and electronic equipment management and Basel Convention compliance in Brazil, Russia, India, China and South Africa (BRICS) nations," Waste Management and Research, vol. 34 no. 8, pp. 693-707, Aug. 2016.

Ghoshal, Tandra, Senthamaraikannan, Ramsankar, Shaw, Matthew T., Holmes, Justin D., and Morris, Michael A., "Fabrication of Ordered, Large Scale, Horizontally-Aligned Si Nanowire Arrays Based on an In Situ Hard Mask Block Copolymer Approach," Advanced Materials, vol. 26 no. 8, pp. 1207-1216, Feb. 26, 2014.

Gialanella, S., Deflorian, F., Girardi, F., Lonardelli, I., and Rossi, S., "Kinetics and microstructural aspects of the allotropic transition in tin," Journal of Alloys and Compounds, vol. 474 no. 1-2, pp. 134-139, Apr. 17, 2009.

Giamis, Andrew, Wenger, George, and Solan, Patrick, "Mixed Alloy Solder Joint Reliability 'Sanity Check'," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Gianelos, L., "Production Experience With Trivalent Chromium Plating Solutions," Plating & Surface Finishing, vol. 66 no. 5, pp. 56-60, May 1979.

Gianelos, Louis, "Decorative Trivalent Chromium Plating," The 72nd AES Annual Technical Conference Proceedings, Detroit, MI, July 1985, session D-5 pp. xx-xx.

Giants, T. W., "Aging effects on the electrical preoperties of silver-filled epoxy adhesives," Journal of Adhesion Science and Technology, vol. 12 no. 6, pp. 593-613, 1998.

Gibb, Herman J., "Epidemiologic Study Of Chromate Production Workers: A Summary," Plating & Surface Finishing, vol. 86 no. 4, pp. 19, Apr. 1999.

Gibbon, Donald L., "Vulnerability, failure and protection of printed circuit boards in aircraft," Aircraft Engineering and Aerospace Technology, vol. 76 no. 5, pp. 523-526, 2004.

Gibbs, P. J., Imhoff, S. D., Morris, C. L., Merrill, F. E., Wilde, C. H., Nedrow, P., Mariam, F. G., Fezzaa, K., Lee, W.-K., and Clarke, A. J., "Multiscale X-ray and Proton Imaging of Bismuth-Tin Solidification," JOM , vol. 66 no. 8, pp. 1485-1492, Aug. 2014.

Gibbs, Roger, "A Guide to Infrared (IR) Rework on BGAs," Surface Mount Technology (SMT), vol. 23 no. 3, pp. 20, May/June 2009.

Gibbs, Roger, "FOCUS provides BGA rework solutions," Electronics Manufacture and Test, pp. xx-xx, Feb. 2006.

Gibson, A. W., Choi, S., Bieler, T. R., and Subramanian, K. N., "Environmental Concerns and Materials Issues in Manufactured Solder Joints," IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 5-7, 1997, pp. 246-251.

Gickler, Alan, Willi, Craig, and Loomans, Michael, "Contamination of Lead-Free Solders with Copper and Lead," 1997 Surface Mount International Conference Proceedings, San Jose, CA, Sept. 7-11, 1997, pp. 476-484.

Gickler, Alan, Willi, Craig, and Loomans, Michael, "Contamination of Lead-free Solders," Surface Mount Technology (SMT) , vol. 11 no. 11, pp. 44-48, Nov. 1997.

Gierlotka, W., Chen, Y. H., Haque, M. A., and Rahman, M. A., "Atomic Mobilities in the Ag-Cu-Sn Face-Centered Cubic Lattice," Journal of Electronic Materials, vol. 41 no. 12, pp. 3359-3367, Dec. 2012.

Gierlotka, Wojciech, "On the binary Sb-Sn system: ab initio calculation and thermodynamic remodeling," Journal of Materials Science, vol. 55 no. 1, pp. 347-357, Jan. 2020.

Gierlotka, Wojcieh, Huang, Yu-Chih, and Chen, Sinn-Wen, "Phase Equilibria of Sn-Sb-Ag Ternary System (II): Calculation," Metallurgical and Materials Transactions A, vol. 39 no. 13, pp. 3199-3209, Dec. 2008.

Gierlotka, Wojcieh, Chen, Sinn-wen, and Lin, Shih-kang, "Thermodynamic description of the Cu-Sn system," Journal of Materials Research, vol. 22 no. 11, pp. 3158-3165, Nov. 2007.

Gierlotka, Wojciech, "Thermodynamic Description of the Quaternary Ag-Cu-In-Sn System," Journal of Electronic Materials, vol. 41 no. 1, pp. 86-108, Jan. 2012.

Gierlotka, Wojciech, "Thermodynamic Description of the Ternary Sb-Sn-Zn System," Journal of Electronic Materials, vol. xx no. x, pp. xx-xx, xxxx.

Gierth, Paul, Zieschank, Michael, and Rebenklau, Lars, "Evaluation of Long Time Stability of Solder Joints on Ag Thick Film Conductors on Al2O3," Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, Dresden, Germany, May 7-11, 2014, pp. 137-142.

Gierth, Paul, Rebenklau, Lars, and Michaelis, Alexander, "Evaluation of Soldering Processes for High Efficiency Solar Cells," 2012 35th International Spring Seminar on Electronics Technology, Bad Aussee, Austria, May 9-13, 2012, pp. 133-137.

Gilbert, Alorie, "Lawmakers tackle national e-waste problem," ZDNet News, May 24, 2005.

Gilbert, Bob, "Development of Lead Free Paste for Small Reflow Ovens," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S11-01-1-S11-01-7.

Gilbert, Bob, "Flux Systems for Lead Free Solder Pastes," Proceedings of the Technical Program NEPCON West 2000, Volume 1, Anaheim, CA, Feb. 27-Mar. 2, 2000, pp. 432-439.

Gilbert, Bob, "Lead-Free Soldering: What Are the Options?," Surface Mount Technology (SMT), vol. 11 no. 3, pp. 66-67, Mar. 1997.

Gilbert, Bob, "Optimizing the Reflow Process Utilizing a Tin/Copper Alloy" 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 193-196.

Gilbert, Bob, "STEP BY STEP SMT SOLDERING: Reducing Soldering Defects," Loctite, Aug. 2001.

Gilbert, Bob, "Step 7 - Soldering," Surface Mount Technology (SMT), vol. 15 no. 8, pp. 50, 52, 54, 57-58, Aug. 2001.

Gilbert, Dave, "Toyota Sudden Unintended Acceleration," Tin Whisker Group teleconference, June 22, 2011.

Gilbert, Jeff, "Tech Tips... BGA Repair for Mixed Assemblies," empfasis, pp. xx-xx, Mar. 2006.

Gill, Paramjeet Singh, and Chin, Yoong Ta, "Defining Package Warpage Criteria to Mitigate Head and Pillow Defects," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 838-843.

Gilleo, K., "Advances in Packaging and Assembly Polymers," Microelectronics International, vol. 13 no. 3, pp. xx-xx, 1996.

Gilleo, K., and Socoloski, N., "Are "Polymer Solders" Real?," Proceedings of the Technical Program NEPCON West '94, Volume 2, Anaheim, CA, Feb. 27-Mar. 4, 1994, pp. .

Gilleo, K., "Assembly with Conductive Adhesives," Soldering & Surface Mount Technology, vol. 7 no. 1, pp. 12-17, 1995.

Gilleo, K., Chu, A-L, and Vieau, D., ""High Stability Solderless Junctions Using Advanced Conductive Adhesives," Proceedings of the Technical Program NEPCON West '91, Volume I, Anaheim, CA, Feb. 24-28, 1991, pp. 193-212.

Gilleo, Ken, "Adhesives/Epoxies & Dispensing," Surface Mount Technology (SMT) , vol. 8 no. 4, pp. 54, 56, 58, 60, Apr. 1994.

Gilleo, Ken, "Adhesives/Epoxies & Dispensing," Surface Mount Technology (Supplement, SMT), vol. 11 no. 7, pp. 18-20, July 1997.

Gilleo, Ken, "Are Polymer Solders the Answer to Lead-free Assembly?," Surface Mount Technology (SMT), vol. 9 no. 1, pp. 39, 42-45, Jan. 1995.

Gilleo, Ken, "Assembly with Conductive Adhesives," Surface Mount International Conference & Exposition Proceedings of the Technical Program, San Jose, CA, Aug. 28-Sept. 1, 1994, pp. 279-288.

Gilleo, Ken, "Direct Chip Interconnect Using Polymer Bonding," 1989 Proceedings 39th Electronic Components Conference, Houson, TX, May 22-24, 1989, pp. 37-44.

Gilleo, Ken, "Direct Chip Interconnect Using Polymer Bonding," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 13 no. 1, pp. 229-234, Mar. 1990.

Gilleo, Ken "Evaluating Polymer Solders for Lead-Free Assembly, Part I," Circuits Assembly, vol. 5 no. 1, pp. 52-54,56, Jan. 1994.

Gilleo, Ken "Evaluating Polymer Solders for Lead-Free Assembly, Part II," Circuits Assembly, vol. 5 no. 2, pp. 50-52, Feb. 1994.

Gilleo, Ken, "Flip Chip Assembly with Conductive Adhesives," Proceedings 2000 HD International Conference on High-Density Interconnect and Systems Packaging (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4217), Denver, CO, Apr. 25-28, 2000, pp. 256-260.

Gilleo, Ken, Boyes, Bob, Corbett, Steve, Larson, Gary, and Price, Dave, "High volume, low cost flip chip assembly on polyester flex," Circuit World, vol. 25 no. 2, pp. 11-17, 1999.

Gilleo, Ken, "Interposer Multilayer Circuitry," Circuitree, vol 15 no. 11, pp. xx-xx, Nov. 2002.

Gilleo, Ken, "Intrinsically Clean Polymer Bonding: What Are the Trade-offs?," Surface Mount International Conference & Exposition Proceedings of the Technical Program, San Jose, CA, Aug. 31-Sept. 2, 1993, pp. 655-660.

Gilleo, Ken, "Polymer Solders: The Cool Lead-free Alternative?," 2000 Lead Free Symposium Conference Proceedings, 2000, pp. xx-xx.

Gilleo, Ken, and Ongley, Peter, "Pros and cons of thermoplastic and thermoset polymer adhesives in microelectronic assembly applications," Microelectronics International , vol. 16 no. 2, pp. 34-38, 1999.

Gilleo, Ken, "The 7,000 Year Cycle," Circuits Assembly, vol. 16 no. 6, pp. 20, June 2005.

Gilleo, Ken, "The Real History of Chip on Flex," Circuitree, vol xx no. x, pp. xx-xx, July 2002.

Gilleo, Ken, "When are Conductive Adhesives an Alternative to Solders?," 2001 Advanced Packaging Technology Conference Proceedings, 2001, pp. xx-xx.

Gilleo, Ken, "When are Conductive Adhesives an Alternative to Solder?," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference , Anaheim, CA, Feb. 24-26, 2004, pp. S03-2-1-S03-2-9.

Gilles, Andrew T., "The Feds Take On Electronic Trash," Forbes, Aug. 11, 2005.

Gillespie, Bryan, "Black Pad on ENIG PCBs," Circuits Assembly, vol. 18 no. 7, pp. 28, July 2007.

Gilroy, D., Eddowes, P. J., Dalrymple, I. M., Azkarate, I., Madina, V., Seco, F., del Barrio, A., Parkes, J., Byrne, M., Byrne, R., Almeida, E. M., Maia, A., Pereira, D., and Bentes, F. L., "Techniques for Assessing the Protective Properties of Chromated Conversion Coatings - Part I: Aluminum," Metal Finishing, vol. 94 no. 10, pp. 26-30, Oct. 1996.

Girard, Kim, "Crippled satellite is down for the count," Computerworld, vol. xx no. xx, pp. xx-xx, May 26, 1998.

Girard, Kim, "High pager backup costs not worth it to users," Computerworld , vol. xx no. xx, pp. xx-xx, June 1, 1998.

Giri, Ajay P., Perfecto, Eric D., Longworth, Hai P., Semkow, Krystyna W., and Knickerbocker, Sarah H., "Development and Implementation of C4NP Technology for 300 mm Wafers," 2007 Proceedings 57th Electronic Components & Technology Conference , Reno, NV, May 29-June 1, 2007, pp. 878-884.

Gitachari, Sudarsanam, "Getting the Lead Out," CircuiTree, vol. 19 no. 2, pp. xx-xx, Feb. 2006.

Giuranno, Donatella, Delsante, Simona, Borzone, Gabriella, and Novakovic, Rada, "Effects of Sb addition on the properties of Sn-Ag-Cu/(Cu, Ni) solder systems," Journal of Alloys and Compounds, vol. 689, pp. 918-930, Dec. 25, 2016.

Giuranno, Donatella, and Novakovic, Rada, "Surface and transport properties of liquid Bi-Sn alloys," Journal of Materials Science: Materials in Electronics, vol. 31 no. 7, pp. 5533-5545, Apr. 2020.

Givargizov, E. I., "Controlled Growth of Filamentary Crystals and Fabrication of Single-Crystal Whisker Probes," Crystallography Reports, vol. 51 no. 5, pp. 888-894, Sept. 2006. DOI: 10.1134/S1063774506050208

Givargizov, E. I., and Sheftal, N. N., "Morphology of Germanium Whiskers," Kristall und Technik, vol. 7 no. 1-3, pp. 37-41, 1972.

Givargizov, E. I., and Sheftal', N. N., "Morphology of Silicon Whiskers Grown by the VLS-Technique," Journal of Crystal Growth, vol. 9, pp. 326-329, May 1971.

Givargizov, E. I., "Oriented Growth of Whiskers of AIIIBV Compounds by VLS-Mechanism," Kristall und Technik, vol. 10 no. 5, pp. 473-484, 1975.

Givargizov, E. I., "Periodic Instability in Whisker Growth," Journal of Crystal Growth , vol. 20 no. 3, pp. 217-226, Oct. 1973.

Givargizov, E. I., "Specialized Whisker Probes for Nanodiagnostics," Crystallography Reports, vol. 54 no. 4, pp. 625-630, July 2009. DOI: 10.1134/S1063774509040142

Gjesvoid, Jason, "Is it really "Black Pad"?."

Gladkikh, A., Lereah, Y., Glickman, E., Karpovski, M., Palevski, A., and Schubert, J., "Hillock formation during electromigration in Cu and Al thin films: Three-dimensional grain growth," Applied Physics Letters, vol. 66 no. 10, pp. 1214-1215, Mar. 6, 1995.

Gladkov, Alex, and Bar-Cohen, Avram, "Parametric Dependence of Fatigue of Electronic Adhesives," IEEE Transactions on Components and Packaging Technologies, vol. 22 no. 2, pp. 200-208, June 1999.

Glass, Steve, " Lead-Free Testing," Lead-Free Magazine.

Glazer, J., "Metallurgy of low-temperature Pb-free solders for electronic assembly," International Materials Reviews, vol. 40 no. 2, pp. 65-93, 1995. https://doi.org/10.1179/imr.1995.40.2.65

Glazer, Judith, "Microstructure and Mechanical Properties of Pb-Free Solder Alloys for Low-Cost Electronic Assembly: A Review," Journal of Electronic Materials, vol. 23 no. 8, pp. , Aug. 1994.

Glazunova, V. K., "A Study of the Influence of Certain Factors on the Growth of Filamentary Tin Crystals," Soviet Physics - Crystallography, vol. 7, no. 5, pp. 616-618, Mar.-Apr. 1962.

Glazunova, V. K., and Kudryavtsev, N. T., "An Investigation of the Conditions of Spontaneous Growth of Filiform Crystals on Electrolytic Coatings," Zhurnal Prikladnoi Khimii, vol. 36 no. 3, pp. 543-550, Mar. 1963.

Glazunova, V. K., and Gorbunova, K. M., "Spontaneous Growth of Whiskers from Electrodeposited Coatings," Journal of Crystal Growth, vol. 10 no. 1, pp. 85-90, June 1971.

Gleason, Jerry, Reynolds, Charlie, Bath, Jasbir, Chu, Quyen, Kelly, Matthew, Lyjak, Ken, and Roubaud, Patrick, "Pb-free Assembly, Rework, and Reliability Analysis of IPC Class 2 Assemblies," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 959-969.

Glickman, E., Osipov, N., Ivanov, A., and Nathan, M., "Diffusional creep as a stress relaxation mechanism in electromigration," Journal of Applied Physics, vol. 83 no. 1, pp. 100-107, Jan. 1, 1998.

Glinski, G. P., and Bailey, C., "Microwave Cure of Conductive Adhesives for Flip-Chip & Microsystems Applications," The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May 30-June 1, 2002, pp. 848-853.

Gluck, P., "On Current Carrying Superconducting Tin Whiskers," Physics Letters A , vol. 66 no. 5, pp. 425-426, June 12, 1978.

Gnani, E., Visciarelli, M., Gnudi, A., Reggiani, S., and Baccarani, G., "Impact of strain and interface traps on the performance of III-V nanowire TFETs," 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, Hangzhou, China, Oct. 25-28, 2016, pp. 275-278.

Gnani, Elena, Gnudi, Antonio, Reggiani, Susanna, Luisier, Mathieu, and Baccarani, Giorgio, "Band Effects on the Transport Characteristics of Ultrascaled SNW-FETs," IEEE Transactions on Nanotechnology, vol. 7 no. 6, pp. 700-709, Nov. 2008.

Gnecco, F., Ricci, E., Amore, S., Giuranno, D., Borzone, G. Zanicchi, G., and Novakovic, R., "Wetting behaviour and reactivity of lead free Au-In-Sn and Bi-In-Sn alloys on copper substrates," International Journal of Adhesion and Adhesives , vol. 27 no. 5, pp. 409-416, July 2007.

Gobbato, Livio, Scandurra, Antonino, and Teee, Tong Yan, "Silver Glues and Lead-free Alloys in Die Attach of Power Devices," Proceedings of 7th Electronic Packaging Technology Conference, Volume 1 , Singapore, Dec. 7-9, 2005, pp. 363-366.

Godbole, Gaurav, Roggeman, Brian, Borgesen, Peter, and Srihari, Krishnaswamy, "On the Nature of Pad Cratering," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 100-108.

Goddenhenrich, T., Lemke, H., Hartmann, U., and Heiden, C., "Magnetic force microscopy of domain wall stray fields on single-crystal iron whiskers," Applied Physics Letters, vol. 56 no. 25, pp. 2578-2580, June 18, 1990.

Goenka, Lakhi, and Achari, Achyuta, "Void Formation in Flip-Chip Solder Bumps - Part I," Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, Oct. 2-4, 1995, pp. 14-19.

Goh, C. F., Gan, Z. H., Mhaisalkar, S. G., Boey, F. Y. C., Gusak, A. M., and Teo, P. S., "Modeling of smoothening effect on morphologies of annealed submicron nickel particles used for electrically conductive adhesives," Journal of Applied Physics, vol. 100 no. 8, pp. 084302-1-084302-5, 2006.

Goh, C. F., Yu, H., Yong, S. S., Mhaisalkar, S. G., Boey, F. Y. C., and Teo, P. S., "Synthesis and cure kinetics of isotropic conductive adhesives comprising sub-micrometer sized nickel particles," Materials Science and Engineering B: Solid-State Materials for Advanced Technology, vol. 117 no. 2, pp. 153-158, Mar. 15, 2005.

Goh, C. F., Yu, H., Yong, S. S., Mhaisalkar, S. G., Boey, F. Y. C., and Teo, P. S., "The effect of annealing on the morphologies and conductivities of sub-micrometer sized nickel particles used for electrically conductive adhesive," Thin Solid Films, vol. 504 no. 1-2, pp. 416-420, May 10, 2006.

Goh, Soon-Lock, Lee, Swee-Kah, Neoh, Din-Ghee, and Kok, Sia-Wing, "Alternative Robust Reliability Solution For Silver Finishing," 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium , Melaka, Malaysia, Nov. 30-Dec. 2, 2010, pp. xx-xx.

Goh, Yingxin, Haseeb, A. S. M. A., Liew, Haw Ling, and Sabri, Mohd Faizul Mohd, "Deformation and fracture behaviour of electroplated Sn-Bi/Cu solder joints," Journal of Materials Science, vol. 50 no. 12, pp. 4258-4269, June 2015.

Goh, Yingxin, Haseeb, A. S. M. A., and Sabri, Mohd Faizul Mohd, "Effects of hydroquinone and gelatin on the electrodeposition of Sn-Bi low temperature Pb-free solder," Electrochimica Acta, vol. 90, pp. 265-273, Feb. 15, 2013.

Goh, Yingxin, Haseeb, A. S. M. A., and Sabri, Mohd Faizul Mohd, "Electrodeposition of lead-free solder alloys," Soldering & Surface Mount Technology, vol. 25 no. 2, pp. 76-90, 2013.

Goh, Yingxin, Lee, Seen Fang, and Haseeb, A. S. Md., "Formation of Sn-Bi solder alloys by sequential electrodeposition and reflow," Journal of Materials Science: Materials in Electronics, vol. 24 no. 6, pp. 2052-2057, June 2013.

Goh, Yingxin, and Haseeb, A. S. M. A., "Studies on electrodeposition behavior of Sn-Bi alloys in plating baths modified by hydroquinone and gelatin," Journal of Materials Science , vol. 51 no. 12, pp. 5823-5833, June 2016.

Goland, A. N., "Neutron Irradiation of Gray Tin," Journal of Physics and Chemistry of Solids, vol. 16 no. 1-2, pp. 46-52, Nov. 1960.

Goland, A. N., and Ewald, A. W., "Thermoelectric Power in Gray Tin Filaments," Bulletin of the American Physical Society, Series II, vol. 1 no. 4, pp. 226, Apr. 26, 1956.

Gold, Steve, "China RoHS: The New Definition of 'March Madness'," PCB007, Jan. 2, 2007.

Gold, Steve, "Stop the Lead-Free Witch Hunt!," PCB007, Apr. 10, 2007.

Gold, Steve, "The Gold Record: Halogen-Free Letters from Terry Fischer, Doug Sober," PCB007, June 11, 2008.

Gold, Steve, "The Way We See It -- Steve Gold," CircuiTree, vol. 18 no. 10, pp. xx-xx, Oct. 2005.

Goldberg, Gary, "Diode Laser Soldering Technology: The Next Generation in Non-Contact Soldering," Surface Mount Technology (SMT), vol. 18 no. 9, pp. xx-xx, Sept. 2004.

Goldberg, Gary, "Lead-free Selective Soldering: Soft Cost Considerations," Surface Mount Technology (SMT), vol. 19 no. 6, pp. xx-xx, June 2005.

Golden, J. L., "External Surface Changes Observed on the International Space Station (ISS) Through 2010," 10th International Space Conference on Protection of Materials and Structures from the Space Environment, Okinawa, Japan, June 12-17, 2011, pp. xx-xx.

Golden, J. L., "External Surface Changes Observed on the International Space Station (ISS) Through 2012," 12th International Symposium on Materials in the Space Environment, Noordwijk, The Netherlands, Sept. 24-28, 2012, pp. xx-xx.

Golden, Johnny L., "Non-Chromate Conversion Coatings," 20th International SAMPE Technical Conference, Minneapolis, MN, Sept. 27-29, 1988, pp. 309-314.

Goldsmith, Steven, "Agere Confirms Mitigation of Tin Whiskers by Nickel," EMU, vol. 18 no. 11, pp. 6-8, Dec. 2004.

Goldstein, J. L. F., Mei, Z., and Morris Jr., J. W., "Research into the Microstructure and Mechanical Behavior of Eutectic Bi-Sn and In-Sn," ASM International Electronic Materials and Processes Conference, San Jose, CA, Aug. 30-Sept. 2, 1993, pp. xx-xx, Lawrence Berkeley Laboratory Report LBL-34793.

Goldstein, J. L. Freer, and Morris Jr., J. W., "The Effect of Substrate on the Microstructure and Mechanical Behavior of Eutectic Indium-Tin," Materials Research Society Symposia Proceedings Volume 323, Boston, MA, Nov. 29-Dec. 3, 1993, pp. 159-164.

Golis, Bogdan, Dyja, Henryk, Pilarczyk, Jan W., and Blazejowski, Zbigniew, "Some experiences in manufacturing of tin plated brass square wires with a size 1.2 mm," Wire Journal International, vol. 39 no. 5, pp. 48-52, May 2006.

Gollas, Bernhard, Albering, Jorg H., Schmut, Katharina, Pointner, Volker, Herber, Ralph, and Etzkorn, Johannes, "Thin layer in situ XRD of electrodeposited Ag/Sn and Ag/In for low-temperature isothermal diffusion soldering," Intermetallics, vol. 16 no. 8, pp. 962-968, Aug. 2008.

Gomatam, Rajesh R., and Sancaktar, Erol, "A comprehensive fatigue life predictive model for electronically conductive adhesive joints under constant-cycle loading," Journal of Adhesion Science and Technology, vol. 20 no. 1, pp. 87-104, 2006.

Gomatam, Rajesh R., and Sancaktar, Erol, "A novel cumulative fatigue damage model for electronically-conductive adhesive joints under variable loading," Journal of Adhesion Science and Technology, vol. 20 no. 1, pp. 69-86, 2006.

Gomatam, Rajesh, Sancaktar, Erol, Boismier, Dennis, Schue, Daniel, and Malik, Irfan, "Behavior of Electronically Conductive Filled Adhesive Joints Under Cyclic Loading Part I: Experimental Approach," 2001 International Symposium on Advanced Packaging Materials, Braselton, GA, Mar. 11-14, 2001, pp. 6-12.

Gomatam, Rajesh R., and Sancaktar, Erol, "Dynamic fatigue and failure behavior of silver-filled electronically conductive adhesive joints at ambient environmental conditions," Journal of Adhesion Science and Technology, vol. 18 no. 7, pp. 731-750, July 2004.

Gomatam, Rajesh R., and Sancaktar, Erol, "Effects of various adherend surface treatments on fatigue behavior of joints bonded with a silver-filled electronically conductive adhesive," Journal of Adhesion Science and Technology, vol. 19 no. 8, pp. 659-678, 2005.

Gomatam, Rajesh R., and Sancaktar, Erol, "Fatigue and failure behavior of silver-filled electronically-conductive adhesive joints subjected to elevated temperatures," Journal of Adhesion Science and Technology, vol. 18 no. 8, pp. 849-881, Aug. 1, 2004.

Gomatam, Rajesh R., and Sancaktar, Erol, "Modeling Fatigue Behavior of Electronically Conductive Filled Adhesive Joints Under Cyclic Loading - A Novel Modeling Approach for Integrated Joint Life Prediction," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 745-750.

Gomatam, Rajesh R., and Sancaktar, Erol, "Modeling Fatigue Behavior of Electronically Conductive Adhesive Joints Under Elevated Temperature and Humidity Conditions," 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, Portland, OR, Sept. 12-15, 2004, pp. 14-26.

Gomatam, Rajesh R., and Sancaktar, Erol, "The effects of stress state, loading frequency and cyclic waveforms on the fatigue behavior of silver-filled electronically-conductive adhesive joints," Journal of Adhesion Science and Technology, vol. 20 no. 1, pp. 53-68, 2006.

Gomatam, Rajesh R., and Sancaktar, Erol, "The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part I: the effects of adhesive thickness," Journal of Adhesion Science and Technology, vol. 18 no. 11, pp. 1225-1243, Oct. 2004.

Gomatam, Rajesh R., and Sancaktar, Erol, "The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part II: the effects of bonding pressure," Journal of Adhesion Science and Technology, vol. 18 no. 11, pp. 1245-1261, Oct. 2004.

Gomer, Robert, "Comments on "Growth of Crystal Whiskers" by Blakely and Jackson," Journal of Chemical Physics, vol. 38, pp. 273-274, 1963.

Gomer, Robert, "Field Emission from Mercury Whiskers," Journal of Chemical Physics , vol. 26 no. 5, pp. 1333-1334, May 1957.

Gomer, Robert, "Field Emission from Mercury Whiskers," Journal of Chemical Physics , vol. 28 no. 3, pp. 457-464, Mar. 1958.

Gomez, Priscilla, Swanson, Tayler, and Anselm, Martin K., "A Study on the Minimum and Maximum Temperatures of the Reflow Process in SMT Assembly on Paste Containing Bismuth Alloys Combined with Lead-Free Solder Spheres," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Goncalves, C., Leitao, H., Lau, C. S., Teixeira, J. C., Ribas, L., Teixeira, S., Cerqueira, M. F., Macedo, F., and Soares, D., "Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmosphere," Journal of Materials Science: Materials in Electronics, vol. 26 no. 7, pp. 5106-5112, July 2015.

Gong, J., Liu, C., Conway, P. P., and Silberschmidt, V. V., "Analysis of Stress Distribution in SnAgCu Solder Joint," Applied Mechanics and Materials, vol. 5-6, pp. 359-366, Oct. 2006.

Gong, Jicheng, Liu, Changqing, Conway, Paul P., and Silberschmidt, Vadim V., "Crystallographic Structure and Mechanical Behaviour of SnAgCu Solder Interconnects under a Constant Loading Rate," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 677-683.

Gong, Jicheng, Liu, Changqing, Conway, Paul P., and Silberschmidt, Vadim V., "Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate," Acta Materialia, vol. 56 no. 16, pp. 4291-4297, Sept. 2008.

Gong, Jicheng, Liu, Changqing, Conway, Paul P., and Silberschmidt, Vadim V., "Formation of Ag3Sn plates in SnAgCu solder bumps," Materials Science and Engineering: A, vol. 527 no. 10-11 pp. 2588-2591, Apr. 25, 2010.

Gong, Jicheng, Liu, Changqing, Conway, Paul P., and Silberschmidt, Vadim V., "Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder," Scripta Materialia, vol. 61 no. 7, pp. 682-685, Oct. 2009.

Gong, Jicheng, Liu, Changqing, Conway, Paul P., and Silberschmidt, Vadim V., "Grain Features of SnAgCu Solder and their Effect on Mechanical Behavior of Micro-Joints," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 250-257.

Gong, Jicheng, Conway, Paul P., Liu, Changqing, and Silberschmidt, Vadim V., "Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu Alloy," Journal of Electronic Materials, vol. 38 no. 12, pp. 2429-2435, Dec. 2009.

Gong, Jicheng, Liu, Changqing, Conway, Paul P., and Silberschmidt, Vadim V., "Initial formation of CuSn intermetallic compounds between molten SnAgCu solder and Cu substrate," Scripta Materialia, vol. 60 no. 5, pp. 333-335, Mar. 2009.

Gong, Jicheng, Liu, Changqing, Conway, Paul P., and Silberschmidt, Vadim V., "Mechanical Behaviour of Grains in SnAgCu Solder Joints," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Gong, Jicheng, Liu, Changqing, Conway, Paul P., and Silberschmidt, Vadim V., "Modelling of Ag3Sn coarsening and its effect on creep of Sn-Ag eutectics," Materials Science and Engineering A, vol. 427 no. 1-2, pp. 60-68, July 15, 2006.

Gong, Jicheng, Liu, Changqing, Conway, Paul P., and Silberschmidt, Vadim V., "Mesomechanical modelling of SnAgCu solder joints in flip chip," Computational Materials Science, vol. 43 no. 1, pp. 199-211, July 2008.

Gong, Jicheng, Liu, Changqing, Conway, Paul P., and Silberschmidt, Vadim V., "Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation," Computational Materials Science, vol. 39 no. 1, pp. 187-197, Mar. 2007.

Gong, Jie, and Ume, I. Charles, "Detection of Poor Wetting of Lead-free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique," Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, Volume 1, Portland, OR, July 6-8, 2011, pp. 95-103.

Gong, Jie, Ume, Charles, Akinade, Kola, Rogers, Bryan, Guirguis, Cherif, Chan, David, and Escobar, Cesar, "Non-destructive Evaluation of Solder Ball Quality under Mechanical Bending Using Laser Ultrasonic Technique," SMTAnews & Journal of Surface Mount Technology, vol. 28 no. 3, pp. 15-25, July-Sept. 2015.

Gong, Jie, and Ume, I. Charles, "Nondestructive Evaluation of Poor-Wetted Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound and Interferometric Technique," IEEE Transactions on Components, Packaging, and Manufacturing Technology , vol. 3 no. 8, pp. 1301-1309, Aug. 2013.

Gong, Jing-Feng, Chan, Philip C. H., Xiao, Guo-Wei, Lee, Ricky S. W., and Yuen, Matthew M. F., "A Reliability Comparison of Electroplated and Stencil Printed Flip-Chip Solder Bumps Based on UBM Related Intermetallic Compound Growth Properties," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 1, pp. 164-172, Mar. 2006.

Gong, Mengqi, Shen, Jun, Nee, Ping, and Hu, Dan, "Preparation of Sn-58Bi solder powder by shearing liquids into complex particles," Journal of Materials Science: Materials in Electronics , vol. 31 no. 7, pp. 5647-5652, Apr. 2020.

Gong, Xiaofeng, Zhao, Rui, and Yu, Xiaomei, "A 3-D-Silicon Nanowire FET Biosensor Based on a Novel Hybrid Process," IEEE/ASME Journal of Microelectromechanical Systems, vol. 27 no. 2, pp. 164-170, Apr. 2018.

Gonsalves, Antone, "Apple at bottom of 'green ranking'," EE Times, vol. xx no. xx, pp. xx-xx, Apr. 4, 2007.

Gonzalez, Geraldo L., Liu, Yanqing, and Maganti, Srikangth S., "Physical Properties of Low Temperature Solders and Die Attach Materials," Conference Record Southcon/95, Fort Lauderdale, FL, Mar. 7-9, 1995, pp. 340-344.

Gonzalez, J. Eduardo, Sanchez, Vicenta, and Wang, Chumin, "Improving Thermoelectric Properties of Nanowires Through Inhomogeneity," Journal of Electronic Materials, vol. 46 no. 5, pp. 2724-2736, May 2017.

Gonzalez, King, Uppalapati, Ramgopal, Vasudevan, Vasu, Aravamudhan, Srinivasa, and Parupalli, Satish, "A Case Study on Pb-Free Process and Material Challenges in the Assembly of Large Fine-Pitch BGA Components," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 579-587.

Gonzalez, M., Vandevelde, B., and Beyne, E., "Thermo-mechanical Analysis of a Chip Scale Package (CSP) Using Lead Free and Lead Containing Solder Materials," European Microelectronics and Packaging Symposium, Prague, Czech Republic, June 16-18, 2004, pp. 247-252.

Gonzalez, Mario, Vandevelde, Bart, and Limaye, Paresh, "FEM simulation of lead free solder joints and adhesives under temperature cycling," Leuven, Feb. 6, 2004.

Gonzalez, Mario, and Snoeckx, Koen, "Lead-free solder modeling: Simulated time will tell," Green SupplyLine, Aug. 17, 2005.

Gonzalez-Legarreta, L., Corte-Leon, P., Zhukova, V., Ipatov, M., Blanco, J. M., Churyukanova, M., Taskaev, S., and Zhukov, A., "Route of magnetoimpedance and domain walls dynamics optimization in Co-based microwires," Journal of Alloys and Compounds, vol. 830, pp. 154576-1-154576-9, July 25, 2020.

Goodman, C. H. L., "Direct-gap group IV semiconductors based on tin," IEE Proceedings I - Solid-State and Electron Devices, vol. 129 no. 5, pp. 189-192, Oct. 1982.

Goodman, C. H. L., "Erratum: Direct-gap group IV semiconductors based on tin," IEE Proceedings I - Solid-State and Electron Devices, vol. 130 no. 1, pp. 46, Feb. 1983.

Goodman, P., Robertson, C., Skipper, R., and Allen, J., "Possible Compliance Approaches for Directive 2002/95/EC (The RoHS Directive)," ERA Technology, ERA Report 2004-0134, Apr. 2004.

Goodman, P. D., "The European Union Directive on the Restriction of Hazardous Substances (RoHS) - Alternative Materials," Advancing Microelectronics, vol. 29 no. 3, pp. xx-xx, May/June 2002.

Goodman, Paul, "Review of Directive 2002/95/EC (RoHS) Categories 8 and 9 - Final Report," ERA Report 2006-0383, July 2006 amended Sept. 19, 2006.

Goodman, Paul, "Review of Directive 2002/95/EC (RoHS) Categories 8 and 9 - Interim Report," ERA Report 2006-0134, Mar. 2006.

Goodman, Paul, Strudwick, Philip, and Skipper, Robert, "Technical adaptation under Directive 2002/95/EC (RoHS) - Investigation of exemptions," ERA Technology, Dec. 2004.

Goodman, Paul, "WEEE & RoHS Directives - Effect of distributors -," ERA Technology.

Goodman, Paul, "What Can Go Wrong with Lead-free Soldering," Surface Mount Technology (SMT), vol. 18 no. 8, pp. 45, Aug. 2004.

Goodship, V., and Pharaoh, M. W., "An information breakdown and discussion of opportunities from the WEEE directive," International Journal of Manufacturing Technology and Management, vol. 6 no. 1-2, pp. 1-8, 2004.

Goodship, V., Cain, R. L., Reynolds, N., and Pharaoh, M. W., "The WEEE Directive: Information and Opportunities for Plastics Recycling," Progress in Rubber, Plastics & Recycling Technology, vol. 18 no. 3, pp. 161-172, 2002.

Goodyer, Michael, "Case story: Microtronix' first lead-free production run," Dataweek , vol. xx no. xx, pp. xx-xx, July 26, 2006.

Goonetilleke, Pubudu, Byrd, Kevin, Badwe, Nilesh, and Truong, Michelle, "Wetting Characteristics of SnBi Low Temperature Solder on Different Surface Finishes," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 468-473.

Goosey, Emma, "Brominated flame retardants: their potential impacts and routes into the environment," Circuit World, vol. 32 no. 4, pp. 32-35, 2006.

Goosey, Martin, "An overview of the current status of lead-free assembly and related issues," Circuit World, vol. 29 no. 4, pp. 23-27, 2003.

Goosey, Martin, "Eco-electronics," Materials World, vol. 17 no. 3, pp. 21-28, Mar. 2009.

Goosey, Martin, "Ecolife 2 - Lead-free assembly," Mar. 6, 2003.

Goosey, Martin, "Electronics Goes Green 2004+," Circuit World, vol. 31 no. 2, pp. xx-xx, 2005.

Goosey, Martin, "End-of-life electronics legislation - an industry perspective," Circuit World, vol. 30 no. 2, pp. 41-45, 2004.

Goosey, Martin, "Environmentally Speaking," CircuiTree, vol. 13 no. 4, pp. xx-xx, Apr. 2000.

Goosey, Martin, "Environmentally Speaking: Don't Bury It; Recycle It!," CircuiTree , vol. 14 no. 12, pp. xx, Dec. 2001.

Goosey, Martin, "Environmentally Speaking -- Martin Goosey," CircuiTree, vol. 15 no. 9, pp. xx-xx, Aug. 31, 2002.

Goosey, Martin, "Environmentally Speaking: Palladium and Its Effect on Our Environment," CircuiTree, vol. 14 no. 4, pp. xx, Apr. 2001.

Goosey, Martin, "Environmentally Speaking: The Question is Not 'If' but 'When' Lead Will be Banned," CircuiTree, vol. 14 no. 8, pp. xx, Aug. 2001.

Goosey, Martin, "Environmentally Speaking: WEEE Directive," CircuiTree, vol. 13 no. 8, pp. xx, Aug. 2000.

Goosey, Martin, "Factors influencing the formation of "black pad" in electroless nickel- immersion gold solderable finishes-- a processing perspective," Circuit World, vol. 28 no. 3, pp. 36-39, 2002.

Goosey, Martin, "Implementation of the RoHS directive and compliance impliactions for the PCB sector," Circuit World, vol. 33 no. 1, pp. 47-50, 2007.

Goosey, Martin, "REACH: What Is the Impact on Europe?," Plastics Engineering, vol. 63 no. 3, pp. 20-23, Mar. 2007.

Goosey, Martin, and Kellner, Rod, "Recycling technologies for the treatment of end of life printed circuit boards (PCBs)," Circuit World, vol. 29 no. 3, pp. 33-37, 2003.

Goosey, Martin, "Soldering considerations for lead-free printed circuit board assembly - an Envirowise Guide," Circuit World, vol. 31 no. 3, pp, 40-44, 2005.

Goosey, Martin, "Toward Greener Printed Circuit Board Production," CircuiTree , vol. 20 no. 6, pp. xx-xx, June 2007.

Gopakumar, Sunil, Borgesen, Peter, and Srihari, K., "Assembly issues with Sn/Ag/Cu bumped flip chips," Soldering & Surface Mount Technology, vol. 19 no. 4, pp. 3-10, 2007.

Gopakumar, Sunil, Billaut, Francois, Fremd, Eric, Tsai, K. Y., Lin, Chu, and Bath, Jasbir, "Challenges and Development for Lead-Free Wave Rework Soldering," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 598-605.

Gopakumar, Sunil, Billaut, Francois, Fremd, Eric, Chu, Chris, Tsai, K. Y., Lin, Chu, Lee, Toyma, and Bath, Jasbir, "Challenges in Lead-Free Wave Soldering," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 658-665.

Gopakumar, Sunil, Billaut, Francois, Fremd, Eric, and Economou, Manthos, "Pb-Free Process Development for a High-End Storage Area Network Application," Proceedings of the ASME InterPack Conference, Volume 1, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 937-943.

Gopakumar, Sunil, Fremd, Eric, Economou, Manthos, Chen, Wyeman, and Lin, Chu, "Pb-Free Wave Soldering Process Optimization," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 219-224.

Gopalakrishnan, Lavanya, Hu, Mason, and Brillhart, Mark, "Conductive Anodic Filament Formation - Effect of Feature Sizes on Product Reliability," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 429-437.

Gopalakrishnan, Vijay, Venkataraman, Vivek, Murcko, Robert, Shrihari, Krishnaswami, and Anson, Scott, "Moisture and Reflow Sensitivity Evaluations of SMT Packages as a Function of Reflow Profile at Eutectic and Lead Free Temperatures," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference , Anaheim, CA, Feb. 24-26, 2004, pp. S19-3-1-S19-3-16.

Gopee, Vimal, "UV Inspection and Thickness Measurement of Conformal Coatings," NPL Webinar, May 9, 2017.

Gorbunova, K. M., and Glazunova, V. K., Present State of the Problem of Spontaneous Growth of Whisker Crystals on Electrolytic Coatings," Protection of Metals (English translation of Zaschita Metallov), vol. 20 no. 3, pp. 269-282, May-June 1984.

Gordon, Pamela, "Environmental differentiation," Electronic Business, June 1, 2005.

Gordon, Pamela J., "From Lead-Free Myopia to a 10-Point Strategic Perspective," Avnet Advantage, June 2004.

Gordon, Pamela J., "From Lead-Free Myopia to a 10-Point Strategic Perspective," emsnow , July 6, 2004.

Gordon, Pamela, "Get Ahead of Environmental Compliance," Circuits Assembly, vol. 15 no. 6, pp. 36, June 2004.

Gordon, Pamela J. "Meaningful Standards for Part Numbering in LIght of Substance-Restriction Requirements," Avnet and TFI, Summer 2004.

Gordon, Pamela J., "Now that the RoHS directive's deadline is upon us - best 7 options for getting economic value from non-compliant parts," emsnow, July 13, 2006.

Gordon, Pamela, "Strategic Considerations for Meeting Substance-Restriction Requirements -- in the Electronics Industry --," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Gordon, Pamela J., "What many miss about meeting WEEE," emsnow, Oct. 5, 2005.

Gordon, Peter, and Hurtony, Tamas, "Investigation of the Wetting Properties of Cu6Sn5 Intermetallic Compound," 2015 38th International Spring Seminar on Electronics Technology, Eger, Hungary, May 6-10, 2015, pp. 315-319.

Gordon, Robert, Marr, Susan, and Shangguan, Dongkai, "Evauation of Immersion Silver Finish for Automotive Electronics," 2000 SMTA International Conference Proceedings, Chicago, IL, Sept. 24-28, 2000, pp. 583-591.

Gordon, Seth, Sanders, Thomas, Raj, Anto, Evans, Christy J., Devall, Tom, Harris, Gregory, and Evans, John L., "Degradation of Leadfree Solder Materials Subjected to Isothermal Aging With Use of the CABGA208 Package," Pan Pacific Symposium 2020, Honolulu, HI, Feb. 10-13, 2020, pp. xx-xx.

Gordon, Seth, Thirugnanasambandam, Sivasubramanian, Sanders, Thomas, Raj, Anto, Sridhar, Sharath, Evans, John, Johnson, Wayne, and Hamasha, Sa'd, "Reliability of Doped Ball Grid Array Components in Thermal Cycling after Long-Term Isothermal Aging," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 438-442.

Gordon, Seth, Raj, Anto, Sridhar, Sharath, Sanders, Thomas, Thirugnanasambandam, Sivasubramanian, Evans, John, Megahed, Fadel, Bozack, Michael, Johnson, Wayne, and Carpenter, Mark, "Thermal Shock and Mechanical Reliability Testing of Isothermally Aged, Doped Lead Free Solder Paste Alloys," SMTA International 2016 Proceedings , Rosemont, IL, Sept. 25-29, 2016, pp. 426-431.

Gordon, Stephanie, "Europe agrees final lead ban date," EE Times, Nov. 7, 2002.

Gordon, Stephanie, "SMEs get help building greener products," EE Times Europe, Jan. 10, 2003.

Gordon, Stephanie, "SMEs get help building greener products," Green SupplyLine, Jan 10, 2003.

Gordon, Stephanie, "U.S. tech firms trail the world in efforts to make industry greener," Green SupplyLine, Jan. 13, 2003.

Gordon, Stephanie, "Waste Directive to cost businesses 10m a year," Green SupplyLine , Apr. 8, 2003.

Gordon, Stephanie, "Waste Directive to cost businesses €10m a year," EE Times Europe , Apr. 8, 2003.

Gore, Damian B., Heiden, Erika S., and Field, Russell J., "Preparation of Electrotechnical Products for Reduction of Hazardous Substances Compliance Testing," Environmental Science & Technology , vol. 42 no. 11, pp. 4088-4092, 2008.

Gorecki, George, and Affinito, John, "Improved Corrosion Resistance Using Chromium-Free Final Rinses," Metal Finishing, vol. 92 no. 7, pp. 42-45, July 1994.

Gorecki, Krzysztof, Dziurdzia, Barbara, and Ptak, Przemyslaw, "The influence of a soldering manner on thermal properties of LED modules," Soldering & Surface Mount Technology, vol. 30 no. 2, pp. 81-86, 2018.

Gorlich, Jens, Baither, Dietmar, and Schmitz, Guido, "Reaction kinetics of Ni/Sn soldering reaction," Acta Materialia, vol. 58 no. 9, pp. 3187-3197, May 2010.

Gorrepati, Krishna, "Leverage EU RoHS data to meet China RoHS requirements," Green SupplyLine, Apr. 2, 2007.

Gorsuch, Paul D., "On the Crystal Perfection of Iron Whiskers," Journal of Applied Physics , vol. 30 no. 6, pp. 837-842, June 1959.

Gortler, Erich, "Heat impact during lead free soldering for passive and active electronic components," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Goryunova, N. A., "(russian)," Doklady Akademii nauk SSSR, vol. 75 no. 1, pp. 51-54, 1950.

Gorywoda, Marek, Dohle, Rainer, Wirth, Andreas, Burger, Bernd, and Gossler, Jorg, "On the Failure Mechanism in Lead-free Flip-chip Interconnects Comprising ENIG Finish during Electromigration," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 2030-2035.

Gotoh, Yasushi, and Watanabe, Itsuo, "Novel Anisotropic Conductive Films with Area-Arrayed Conducting Particles," Advances in Electronic Packaging 1997, Volume 1, Kohala Coast, Hawaii, June 15-19, 1997, pp. 161-165.

Gotoh, Yoshihiko, "An evidence of glide motion up to upper yield point on copper whiskers," Journal of Applied Physics, vol. 44 no. 3, pp. 1382-1383, Mar. 1973.

Gotoh, Yoshihiko, "On the Growth of Copper Whiskers by Halide Reduction and Their Perfection," Japanese Journal of Applied Physics, vol. 11 no. 10 , pp. 1403-1412, Oct. 1972.

Gottberg, Annika, Morris, Joe, Pollard, Simon, Mark-Herbert, Cecilia, and Cook, Matthew, "Producer responsibility, waste minimisation and the WEEE Directive: Case studies in eco-design from the European lighting sector," CITE>Science of the Total Environment, vol. 359 no. 1-3, pp. 38-56, Apr. 15, 2006.

Gottschalk, Steven F., and Gilchrist Jr., M. Lane, "Satellite Command and Control Training for the 21st Century," Air & Space Power Chronicles, vol. xx no. xx, pp. xx-xx, Aug. 2002.

Gottstein, G., "Dynamic recrystallization of Cu single crystals during tensile deformation in creep," Metal Science, vol. 17 no. 10, pp. 497-502, 1983. https://doi.org/10.1179/030634583790420565

Gouda, Abdelaziz M., Elsayed, Mohamed, Allam, Nageh K., and Swillam, Mohamed A., "Black Silicon Based on Simple Fabrication of Mesoporous Silicon Nanowires for Solar Energy Harvesting," 2017 IEEE 44th Photovoltaic Specialist Conference, Washington, DC, June 25-30, 2017, pp. xx-xx.

Goudarzi, Vahid, and Freeman, Grahame, "Making the 'Centigrade'," Circuits Assembly, vol. 16 no. 2, pp. 34-37, Feb. 2005.

Goudarzi, Vahid, "Pb free Challenges," 2006 Lead-Free Technology Workshop, San Antonio, TX, Mar. 12, 2006, pp. xx-xx.

Goudarzi, Vahid, "Pb-Free Manufacturing Process Development & Implementation," Pb-Free Workshop, Plantation, FL, June 25-26, 2003.

Goudarzi, Vahid, Brown, Matthew, Liu, Weiping, Lee, Ning-Cheng, and Lee, Jeffrey ChangBing, "Shock Resistant and Thermally Reliable Low Ag SAC Solder Doped With Mn," 2013 14th International Conference on Electronic Packaging Technology , Dalian, China, Aug. 11-14, 2013, pp. 182-192.

Goudarzi, Vahid, Brown, Matthew, Liu, Weiping, Lee, Ning-Cheng, and Lee, Jeffrey ChangBing, "The Second Generation Shock Resistant and Thermally-Reliable Low Ag SAC Solder Doped With Mn," SMTA International 2013 Conference Proceedings , Fort Worth, TX, Oct. 13-17, 2013, pp. 644-654.

Goudarzi, Vahid, Brown, Matthew, Liu, Weiping, Lee, Ning-Cheng, and Lee, Jeffrey ChangBing, "The Second Generation Shock Resistant and Thermally Reliable Low Ag SAC Solder Doped with Mn," South East Asia Technical Training Conference on Electronics Assembly Technologies 2014 Proceedings, Penang, Malaysia, Apr. 8-10, 2014, pp. xx-xx.

Goudarzi, Vahid, Brown, Matthew, Liu, Weiping, Lee, Ning-Cheng, and Lee, ChangBing Jeffrey, "The Second Generation Shock Resistant And Thermally Reliable Low Ag SAC Solder Doped With Mn," SMTA China East 2014 Proceedings, Shanghai, China, Apr. 23-25, 2014, pp. xx-xx.

Gouldsmith, Michael, and Lee, Zen, "Failures and Reliability in Soldering," Surface Mount Technology (SMT) , vol. 34 no. 7, pp. 88,90-94, July 2019.

Gouldsmith, Michael, "The Importance of Curie Point Temperature Control in Providing Solder Joint Reliability in Lead Free Robotic and Hand Soldering Operations," International Conference on Soldering & Reliability 2016 Proceedings , Toronto, Ontario, Canada, May 9-11, 2016, pp. xx-xx.

Gourlay, C. M., Nogita, K., McDonald, S. D., Nishimura, T., Sweatman, K., and Dahle, A. K., "A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu," Scripta Materialia, vol. 54 no. 9, pp.1557-1562, May 2006.

Gourlay, C. M., Nogita, K., Dahle, A. K., Yamamoto, Y., Uesugi, K., Nagira, T., Yoshiya, M., and Yasuda, H., "In situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni," Acta Materialia, vol. xx no. xx, pp. xx-xx, xxxx.

Gourlay, C. M., Nogita, K., Read, J., and Dahle, A. K., "Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys," Journal of Electronic Materials, vol. 39 no. 1, pp. 56-69, Jan. 2010.

Gourlay, C. M., Belyakov, S. A., Ma, Z. L., and Xian, J. W., "Nucleation and Growth of Tin in Pb-Free Solder Joints," JOM, vol. 67 no. 10, pp. 2383-2393, Oct. 2015.

Gourlay, C. M., Ma, Z. L., Xian, J. W., Belyakov, S. A., Salleh, M. A. A. Mohd, Zeng, G., Yasuda, H., and Nogita, K., "Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni solders," Materials Science Forum, vol. 857, pp. 44-48, May 2016.

Gourlay, C. M., Read, J., Nogita, K., and Dahle, A. K., "The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys," Journal of Electronic Materials, vol. 37 no. 1, pp. 51-60, Jan. 2008.

Govaerts, Jonathan, Vandecasteele, Bjorn, and Vanfleteren, Jan, "Interconnecting drivers to flexible displays," Journal of the Society for Information Display, vol. 16 no. 7, pp. 765-775, July 2008.

Goward, J. M., Whalley, D. C., and Williams, D. J., "Understanding Anisotropic Conducting Adhesive Behaviour," Microelectronics International, vol. 12 no. 3, pp. 55-59, 1995.

Goward, John M., Williams, David J., and Whalley, David C., "Properties of anisotropic conductive adhesive pastes for fine-pitch surface mount technology," Journal of Electronics Manufacturing, vol. 3 no. x, pp. 179-190, 1993.

Goward, John, Williams, David, and Whalley, David, "Understanding Anisotropic Conducting Adhesives Behavior," Surface Mount International Conference & Exposition Proceedings of the Technical Program , San Jose, CA, Aug. 28-Sept. 1, 1994, pp. 303-312.

Gowda, Arun, Primavera, Anthony, and Srihari, K., "Challenges in Lead-Free Rework," 2002 Pan Pacific Symposium Conference Proceedings, Maui, Hawaii, Feb. 5-7, 2002, pp. xx-xx.

Gowda, Arun, Srihari, K., and Primavera, Anthony, "Lead-Free Rework Process for Chip Scale Packages." Universal Instruments, July 20, 2004.

Gowda, Arun, Primavera, Anthony, and Srihari, K., "Process and Reliability Issues with Lead-Free CSP Rework," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 133-143.

Gowda, Arun, Primavera, Anthony, and Srihari, Krishnaswami, "Process and Reliability Issues with Lead-free CSP Rework," SMTA Journal , vol. 19 no. 1, pp. 27-36, Jan.-Mar. 2006.

Goyal, Deepak, "Failure Analysis of Microelectronic Packages - Current and Future," Workshop on Devices, Interconnects, and Packaging for Next Generation Computing and Communication Applications, Tempe, AZ, Nov. 20, 2003, pp. xx-xx.

Goyal, Deepak, Lane, Tim, Kinzie, Patrick, Panichas, Chris, Chong, Kam Meng, and Villalobos, Oscar, "Failure Mechanism of Brittle Solder Joint Fracture in the Presence of Electroless Nickel Immersion Gold (ENIG) Interface," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 732-739.

Goyal, Vinay, "RoHS & WEEE Requirements, Implementation & Challenges," 2006 IEEE Symposium on Product Safety & Compliance Engineering, Irvine, CA, Oct. 23-24, 2006, pp. xx-xx.

Grabbe, Dimitry G., "Multilayer Board Plated-Thru-Hole Failure Mechanisms," 10th Annual Reliability Physics Symposium, Las Vegas, NV, Apr. 5-7, 1972, pp. 188-192.

Grabey, Steven, "Low-Temperature Thick Film Pastes Permit Lead-Free Soldering," Surface Mount Technology (SMT), vol. 30 no. 12, pp. 74,76-81, Dec. 2015.

Grady, J. O., "An Alternative to Chromium Plating," Finishing Industries, vol. 2 no. 7, pp. 31, July 1978.

Grady, Jim, "Raising Your Zinc Whisker IQ."

Graedel, T. E., Dong, J., and Jiansu, Mao, "Technological Use Histories for Solder Metals," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 201-205.

Graf, L., and Weser, W., "Uber die entstehung nadelformiger kristalle (whiskers) bei der elektrokristallisation von silber," Electrochimica Acta, vol. 2 no. 1-3, pp. 145-148,IN20,149-154,IN21-IN23,155-163, Feb. 1960. https://doi.org/10.1016/0013-4686(60)87012-0

Graham, A. H., Teeter Jr., R. S., and Ficca Jr., J. F., "Determination of Composition for Electroplated Pd-Ni Alloy Coatings," Plating & Surface Finishing, vol. 83 no. 2, pp. 67-71, Feb. 1996.

Graham, Glen H., "The Road to a Cyanide Free Plating Shop," 2002 AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 28-30, 2002, pp. xx-xx.

Grandfond, A., Gautier, B., Militaru, L., Albertini, D., and Descamps-Mandine, A., "Spurious phenomena occurring during current measurement on ultra-thin dielectric layers: From electro-thermal effects to surface damage," Journal of Applied Physics, vol. 115, pp. 134103-1-134103-7, 2014.

Grano, Frank, and Bruno, Felix, "Intrusive Reflow Using a Lead-Free Process," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 763-768.

Grano, Frank, "New Lead-free Processes Require Industry Collaboration," Advanced Packaging, vol. 13 no. 6, pp. 22, June 2004.

Granzner, Ralf, Polyakov, Vladimir M., Schippel, Christian, and Schwierz, Frank, "EmpiricaL Model for the Effective Electron Mobility in Silicon Nanowires," IEEE Transactions on Electron Devices, vol. 61 no. 11, pp. 3601-3607, Nov. 2014.

Grayson, Ian, and Fordham, Anthony, "Cyber junk's second life," The Australian, June 26, 2005.

Graves, Beverly A., "Alternatives to Hexavalent Chromium and Chromium Plating," Products Finishing, vol. xx no. xx, pp. xx-xx, Winter 2000.

Graves, Beverly A., "Chrome-Like Appearance for Automotive Components," Products Finishing, vol. xx no. xx, pp. xx-xx, June 9, 2003.

Graves, Beverly A., "Hexavalent Chromium and the End-of-Life Directive - Visteon Automotive Systems - Brief Article," Automotive Finishing, vol. xx no. xx. pp. xx-xx, Spring 2001.

Graves, Beverly A., "Meeting the Customer's Needs With Zinc-Alloy Plating," Products Finishing, vol. xx no. x, pp. 56-60, May 1995.

Graves, Beverly A., "Putting The Brakes On Lead and Cadmium," Products Finishing, vol. 68 no. 10, pp. 46-50, July 2004.

Graves, Beverly A., "What to do about Hard Chromium," Products Finishing, vol. 69 no. 5, pp. 56-59, Feb. 2005.

Graves, Danny R., "Lead-Free IP," Lead-Free Magazine.

Graves, Danny R., "Pb-Free Soldering and Materials IP," Circuits Assembly, vol. 18 no. 4, pp. 48-50, Apr. 2007.

Gray, Brian, and McMahon, John, "Material Testing and Mitigation Techniques for Pad-Crater Defects," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 606-611.

Gray, Brian, and McMahon, John, "Material Testing and Mitigation Techniques for Pad-Crater Defects," SMTA Journal, vol. 24 no. 4, pp. 33-38, 2011.

Gray, Brian, and McMahon, John, "Mechanical Failures in Pb-Free Processing: Selected Mitigation Techniques for Pad Crater Defects," SMTA International 2010 Conference Proceedings , Orlando, FL, Oct. 24-28, 2010, pp. 530-534.

Graziosi, Giovanni, Doriol, Patrice Joubert, Villavicencio, Yamarita, Forzan, Cristiano, Rotigni, Mario, and Pandini, Davide, "Advanced Modeling Techniques for System-level Power Integrity and EMC Analysis," European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Greasley, A., "Rapid assessment of steady-state creep rates and stress dip effects in solder alloys," Journal of Materials Science: Materials in Electronics, vol. 13 no. 1, pp. 43-47, Jan. 2002.

Greaves, John, "An Evaluation of Alternative Surface Finishes by the Circuit Card Assembly and Materials Task Force," Proceedings of the Technical Program NEPCON West '97, Volume 3, Anaheim, CA, Feb. 23-27, 1997, pp. 1559-1568.

Greaves Jr., John B., "Manufacturing with Conductive Adhesives," Proceedings of the Technical Program NEPCON West '94, Volume 1, Anaheim, CA, Feb. 27-Mar. 4, 1994, pp. 587-590.

Greczyn, Mary, "Europeans Consider Car-Recycling Measure: Union Members May Set Goals to Reuse or Recover as Much as 85 Percent of Autos' Weight," Waste News , vol. xx no. x, pp. xx-xx, Aug. 4, 1997.

Greek, Dinah, "Heaving the lead," Professional Engineering, vol. 12 no. 10, pp. 39, May 26, 1999.

Green, Simon, Lea, Deborah, and Hunt, Christopher, "Solderability Measurements with Lead-Free Alloys," NPL Report CMMT(A)213, Aug. 1999.

Greene, Brian, "Ideas for Joint Lead-Free Follow-On Projects," NASA.

Greene, Brian, Kessel, Kurt, "JCAA/JG-PP Lead Free Solder Testing for High-Reliability Applications," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Greene, Brian, "JCAA/JG-PP Lead-Free Solder Testing for High-Reliability Applications," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.

Greene, Brian E., "Joint Group on Pollution Prevention Lead-Free Solder Project," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 679-685.

Greene, Christopher M., and Srihari, Krishnaswami, "A procedure for determining the high-speed stencil printing performance of solder pastes in an electronic service provider's environment," Soldering & Surface Mount Technology, vol. 20 no. 3, pp. 26-33, 2008.

Greene, Christopher M., "Using Regression Analysis in the Stencil Printing Process," Proceedings of the 2007 Industrial Engineering Research Conference, Nashville, TN, May 19-23, 2007, pp. 572-577.

Greene, Stephen, "REACH and the electronics supply chain: Are you ready?," EE Times Europe, May 29, 2008.

Greenhalgh, Darr, "To the rescue," Electronics Supply & Manufacturing, Apr. 27, 2006.

Greenhaugh, Darr, "To the rescue," Green SupplyLine, Apr. 27, 2006.

Gregg, Paul, "Solders of fortune...," Electronics Weekly, Mar. 18, 1998.

Gregg, Paul, "Sticky problems," Electronics Weekly, Mar. 19, 1997.

Gregorich, Tom, and Holmes, Pat, "Peel Test: A Novel Method for Evaluating Lead Free CSP Joint Reliability," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Gregory, Bob, "Rolls-Royce and `Lead-free'," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.

Gregory, Jeremy R., and Kirchain, Randolph E., "A Comparison of North American Electronics Recycling Systems." Proceedings of the 2007 IEEE International Symposium on Electronics & the Environment, Orlando, FL, May 7-10, 2007, pp. 227-232.

Gregory, Jeremy, Atlee, Jennifer, and Kirchain, Randolph, "A Process-Based Model of End-of-Life Electronics Recycling: Driving Eco-Efficiency-Informed Decisions," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 138-143.

Gregory, Jeremy, Fredholm, Susan, and Kirchain, Randolph, "Is Economic Value an Effective Proxy for Embodied Energy and Environmental Impact in Material Systems?," IEEE International Symposium on Sustainable Systems and Technology, Phoenix, AZ, May 18-20, 2009, pp. xx-xx.

Gregory, Mary, "Vapour Phase Returns for Lead-Free Soldering," SMART Group 6th Annual Lead-Free Seminar and Table-top Exhibition, High Wycombe, United Kingdom, Feb. 3, 2004.

Greiner, Tim, Veleva, Vesela, Harriman, Elizabeth, and MacFadden, Todd, "International Material Restrictions and Metal Finishing," Proceedings 2004 AESF/EPA Conference for Environmental & Process Excellence, Orlando, FL, Jan. 26-29, 2004, pp. 141-153.

Greve, Hannes, and McCluskey, Patrick, "Reliability of Sn based LT-TLPS Joints for High Temperature Electronic Systems," 2014 8th International Conference on Integrated Power Systems , Nuremberg, Germany, Feb. 25-27, 2014, pp. xx-xx.

Griese, H., Muller, J., Reichl, H., Somi, G., Stevels, Ab, and Zuber, K. H., "Environmental Assessment of Lead Free Interconnection Systems," 2000 Lead Free Symposium Conference Proceedings, 2000, pp. xx-xx.

Griese, Hansjoerg, Stobbe, Lutz, Middendorf, Andreas, and Reichl, Herbert, "Environmental Compatibility of Electronics - A key towards local and global sustainable development," Proceedings of 2004 International IEEE Conference on the Asian Green Electronics, Hong Kong, China, Jan 5-9, 2004, pp. 158-163.

Griese, Hansjoerg, Poetter, Harald, Schischke, Karsten, Ness, Olaf, and Reichl, Herbert, "Reuse and Lifetime Extension Strategies in the Context of Technology Innovations, Global Markets, and Environmental Legislation," 2004 IEEE International Symposium on Electronics & the Environment Conference Record , Scottsdale, AZ, May 10-13, 2004, pp. 173-178.

Griese, Hansjoerg, Schischke, Karsten, Reichl, Herbert, and Stobbe, Lutz, "Sustainable Development of Microelectronic Technology Processes Integration of EcoDesign," Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis , Shanghai, China, June 30-July 3, 2004, pp. 154-159.

Grieu, Marc, Massiot, Gregor, Maire, Olivier, Munier, Catherine, Bienvenu, Yves, and Renard, Jacques, "Modelling of Sn3.0Ag0.5Cu Thermo-Mechanical Behaviour by a Continuum Damage Approach," 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems , Delft, Netherlands, Apr. 26-29, 2009, pp. xx-xx.

Gremillard, Laurent, "Reactive spreading of a lead-free solder on alumina," Lawrence Berkeley National Laboratory, 2005.

Gremillard, Laurent, Saiz, Eduardo, Radmilovic, Velimir R., and Tomsia, Antoni P., "Role of titanium on the reactive spreading of lead-free solders on alumina," Journal of Materials Research, vol. 21 no. 12, pp. 3222-3233, Dec. 2006.

Griese, Hansjoerg, Stobbe, Lutz, Mueller, Jutta, Deubzer, Otmar, and Middendorf, Andreas, "Global Sustainable Development and Technological Innovations - Experiences from Lead-free Transition," Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 12-14, 2005, pp. 752-759.

Griffiths, Gary, and Borrman, Jeff, "Lead - A WEEE Recycling Problem?," SMART Group Lead-Free Seminar 1999 , High Wycombe, UK, Feb. 10, 1999.

Grimes, Ed, "Growing Repair Complexities," Surface Mount Technology (SMT) , vol. 21 no. 1, pp. 36-37, Jan. 2007.

Grimmer, Hans, "The Distribution of Disorientation Angles if All Relative Orientations of Neighbouring Grains Are Equally Probable," Scripta Metallurgica, vol. 13 no. 2, pp. 161-164, Feb. 1979.

Grini, Gunnar, "European Parliament slams Commission on hazardous substances," Bellona, Apr. 13, 2004.

Grivas, Dennis, Frear, Darrel, Quan, Lenora, and Morris Jr., J. W., "The Formation of Cu3Sn Intermetallic on the Reaction of Cu with 95Pb-5Sn Solder," Journal of Electronic Materials, vol. 15 no. 6, pp. 355-359, Nov. 1986.

Grivon, Arnaud, Baudet, Damien, Brizoux, Michel, Lecavelier, Aurelien, and Maia, Wilson, "Solder Joint Fatigue Characterization of DDR3 SDRAMS and Other Advanced BGA Packaging Memory Types," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 362-368.

Grobelny, M., and Sobczak, N., "Effect of pH of Sulfate Solution on Electrochemical Behavior of Pb-Free Solder Candidates of SnZn and SnZnCu Systems," Journal of Materials Engineering and Performance, vol. 21 no. 5, pp. 614-619, May 2012.

Grobin, Allen W., "Hydrogen Embrittlement Revisited: Part II," Plating & Surface Finishing, vol. 82 no. 10, pp. 51-52, Oct. 1995.

Groen, L. J., "Discussion of "Effect of Germanium on the Transformation of White to Gray Tin, at comparatively Low Temparature" [R. R. Rogers and J. F. Fydell (pp. 161-164)]," Journal of the Electrochemical Society, vol. 100 no. 12, pp. 589, Dec. 1953.

Groen, L. J., and Burgers, W. G., "Formation of Compact Pieces of Gray Tin," Koninklijke Nederlandse Akadamie van Wetenschappen, Proceedings of the Section of Sciences, Series B: Physical Sciences, vol. 57, pp. 79-80, 1954.

Groen, L. J., "Formation of Compact Pieces of Grey Tin," Nature, vol. 174 no. 4435, pp. 836, Oct. 30, 1954.

Groen, L. J., "On the Accelerating Influence of Tin-ions on the Transition of White into Gray Tin," Koninklijke Nederlandse Akadamie van Wetenschappen, Proceedings of the Section of Sciences, Series B: Physical Sciences, vol. 57, pp. 122-124, 1954.

Grohman, A., and Krylow, J., "On the nature of whiskers," British Journal of Applied Physics, vol. 11 no. 10, pp. 477-478, Oct. 1960.

Grolier, Vincent, and Schmid-Fetzer, Rainer, "Diffusion-Reaction in the Au-Rich Ternary Au-Pt-Sn System as a Basis for Ternary Diffusion Soldering," Journal of Electronic Materials, vol. 37 no. 6, pp. 815-828, June 2008.

Grolier, Vincent, and Schmid-Fetzer, Rainer, "Experimental Study of Au-Pt-Sn Phase Equilibria and Thermodynamic Assessment of the Au-Pt and Au-Pt-Sn Systems," Journal of Electronic Materials , vol. 37 no. 3, pp. 264-278, Mar. 2008.

Grolier, Vincent, and Schmid-Fetzer, Rainer, "Thermodynamic evaluation of the Au-Sn system," International Journal of Materials Research, vol. 98 no. 9, pp. 797-806, Sept. 2007.

Gromala, Przemyslaw, Reichelt, Jan, and Rzepka, Sven, "Accurate Thermal Cycle Lifetime Estimation for BGA Memory Components with Lead-free Solder Joints," 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, Delft, Netherlands, Apr. 26-29, 2009, pp. xx-xx.

Gronau, Amanda, "Lead free or recycle?," emsnow, Dec. 19, 2002.

Gronau, Amanda, "Nothing solders like solder ... ... or does it?," Printed Circuit Europe, pp. 30-34, 1st Quarter 2002.

Groome. Paul R., "Lead-free: PCB Test and Inspection," Surface Mount Technology (SMT) , vol. 19 no. 11, pp. 36, 38-39, Nov. 2005.

Groover, Richard, "What Defines An 'Environmentally Friendly' Package?," Lead-free Electronics, Nov. 2004.

Groshart, Earl, "New World of Finishing: The Hazards of Chromium Compounds," Metal Finishing, vol. 86 no. 9, pp. 63-65, Sept. 1988.

Gross, Andreas, and Sitte, Norbert, "Nickel-free Final Finishes in the Electronics Industry," 2015 European Microelectronics Packaging Conference, Friedrichshafen, Germany, Sept. 14-16, 2015, pp. xx-xx.

Gross, Grant, "Senators want tax breaks for computer disposal: Legislation would give incentives for nationwide recycling program," InfoWorld, Mar. 3, 2005.

Grosskopf, Curtis, Krystek, Paul, Catucci, Giacomo, Lauri, Michael, Ang, Ai Kiar, Low, Wen Wei, and Kelly, Matt, "Device Sensitivity to Post Solder Attach Processes," International Conference on Soldering & Reliability 2011 Proceedings, Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

Grosskopf, Curtis, Cole, Marie S., Lembke, Pam, Lagler, Jeff, and Van der Herten, Kurt, "European Union RoHS Leaded Solder Exemption Update," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 567-580.

Grossmann, Gunter, "Bleifreies Loten: Technik ist bereit," Bulletin SEV/AES, vol. xx no. xx, pp. 10-14.

Grossmann, Gunter, and Nicoletti, Giovanni, "Lead Free BGAs Soldered with SnPb36Ag2 Solder," Materials Transactions, JIM, vol. 56 no. 7, pp. 988-991, 2015.

Grossmann, Gunter, Tharian, Joy, Jud, Pascal, and Sennhauser, Urs, "Microstructural investigation of lead-free BGAs soldered with tin-lead solder," Soldering & Surface Mount Technology, vol. 17 no. 2, pp. 10-21, 2005.

Grossmann, Gunter, "Reliability of Lead Free Solders for Space Applications Phase 1," 9th Electronic Materials and Assembly Processes for Space (EMPS) Workshop , Yverdon-les-Bains, Switzerland, Apr. 25-26, 2018, pp. xx-xx.

Grossmann, Gunter, Nicoletti, Giovanni, and Soler, Ursin, "Results of Comparative Reliability Tests on Lead-free Solder Alloys," 2002 Proceedings 52nd Electronic Components & Technology Conference , San Diego, CA, May 28-31, 2002, pp. 1232-1237.

Grossman, Richard F., "PVC wire covering stabilization with basic lead compounds," Wire Journal International, vol. 38 no. 7, pp. 112-114, July 2005.

Grote, C. A., Jones, R. M., Blount, G. N., Goodyer, J., and Shayler, M., "An approach to the EuP Directive and the application of the economic eco-design for complex products," International Journal of Production Research, vol. 45 no. 18-19, pp. 4099-4117, Sept. 2007.

Groves, S. H., Pidgeon, C. R., Ewald, A. W., and Wagner, R. J., "Interband magnetoreflection of a-Sn," Journal of Physics and Chemistry of Solids, vol. 31 no. 9, pp. 2031-2049, Sept. 1970.

Gruber, P. A., Shih, D. Y., Belanger, L., Brouillette, G., Danovitch, D., Oberson, V., Turgeon, M., and Kimura, H., "Injection Molded Solder Technology for Pb-free Wafer Bumping," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 650-654.

Gruber, P. A., Belanger, L., Broullette, G. P., Danovitch, D. H., Landreville, J.-L., Naugle, D. T., Oberson, V. A., Shih, D.-Y., Tessler, C. L., and Turgeon, M. R., "Low-cost wafer bumping," IBM Journal of Research & Development , vol. 49 no. 4/5, pp. 621-639, July/Aug. 2005.

Gruber, Peter A., Jalloh, Minkailu A., Takacs, Mark A., "Injection Molded Solder IMS for Fluxless Lead-free Solder Bumping of Decoupling Capacitor Package," Advances in Electronic Packaging 2001, Volume 3, Kauai, Hawaii, July 8-13, 2001, pp. 1935-1940.

Grundy, Peter, "A Pb-Free Time Bomb?," Circuits Assembly, vol. 18 no. 3, pp. 26-28, Mar. 2007.

Grundy, Peter, "Design for Dismantling," Circuits Assembly, vol. 16 no. 9, pp. 24, Sept. 2005.

Grundy, Peter, "Low Cost Lead-Free Soldering Technology to Improve Competitiveness of European SME," SMART Group Lead-Free Seminar, Shannon, Ireland, May 19, 2005.

Grundy, Peter, "The Economies (or Not) of Packaging," Circuits Assembly, vol. 18 no. 1, pp. 26-27, Jan. 2007.

Grundy, Peter, "Waste Opportunities," Circuits Assembly, vol. 17 no. 9, pp. 34-35, Sept. 2006.

Grundy, Peter, "Whither Analytical X-Ray," Circuits Assembly, vol. 17 no. 5, pp. 28-29, May 2006.

Grunor, Jerry A., "Unbaked boards," Global SMT and Packaging, vol. 7 no. 4, pp. 62, Apr. 2007.

Grupen-Shemansky, Melissa, "Overcoming Tin Whisker Problems on Lead-free Packaging," Advanced Packaging, vol. 13 no. 6, pp. 24, June 2004.

Grusd. Angela, "Connecting to Lead-Free Solders," Circuits Assembly, vol. 10 no. 8, pp. 32,34,36,38, Aug. 1999.

Grusd, Angela, "Integrity of Solder Joints from Lead-free Solder Paste." Proceedings of the Technical Program NEPCON West '99, Volume 1, Anaheim, CA, Feb. 21-25, 1999, pp. 212-221.

Grusd, Angela, "Lead Free Solders in Electronics." 1998 Surface Mount International Conference Proceedings, San Jose, CA, Aug. 23-27, 1998, pp. xx-xx.

Gschohsmann, W., Smetana, W., and Fleischer, W., "Pore Formation in Lead-Free Solders on Cu- and Ag-Metallization," 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, Vienna, Austria, May 19-20, 2005, pp. 265-271.

Gu, Fang, Zhang, Jiahong, Li, Min, Liu, Linyan, and Su, Jing, "Influence of Defects on the Young's Modulus of [110] Silicon Nanowires with Different Cross Sections," Key Engineering Materials, vol. 645-646, pp. 151-156, May 2015.

Gu, Fang, Zhang, Jia-Hong, Xu, Lin-Hua, Liu, Qing-Quan, and Li, Min, "Influence of Surface Effects on the Elastic Properties of Silicon Nanowires with Different Cross Sections," Chinese Physics Letters, vol. 28 no. 10, pp. 106102-1-106102-4, 2011.

Gu, Jian, Lei, YongPing, Lin, Jian, Fu, HanGuang, and Wu, Zhongwei, "A Novel Conditional Probability Density Distribution Surface for the Analysis of the Drop Life of Solder Joints Under Board Level Drop Impact," Journal of Electronic Materials, vol. 45 no. 1, pp. 145-153, Jan. 2016.

Gu, Jian, Lin, Jian, Lei, Yongping, and Fu, Hanguang, "Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling," Microelectronics Reliability, vol. 80, pp. 29-36, Jan. 2018.

Gu, Jian, Lei, Yongping, Lin, Jian, Fu, Hanguang, and Wu, Zhongwei, "The Failure Models of Lead Free Sn-3.0Ag-0.5Cu Solder Joint Reliability Under Low-G and High-G Drop Impact," Journal of Electronic Materials, vol. 46 no. 2, pp. 1396-1404, Feb. 2017.

Gu, Jian, Lei, Yongping, Lin, Jian, Fu, Hanguang, Xie, Xiaowen, and Wu, Zhongwei, "The study of Sn-0.3Ag-0.7Cu and Sn-1.0Ag-0.5Cu solder joint reliability under board level drop impact," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 491-496.

Gu, Liyu, Qu, Lin, Ma, Haitao, Luo, Zhongbing, and Wang, Lai, "Effects of Soldering Temperature and Cooling Rate on the as-Soldered Microstructures of Intermetallic Compounds in Sn-Ag/Cu Joint," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 342-345.

Gu, Penghao, Han, Jing, and Guo, Fu, "Effects of nano-structured reinforcements on the recrystallization and damage mode of of Sn-3.0Ag-0.5Cu solder joints," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 304-309.

Gu, Tianhong, Gourlay, Christopher M., and Britton, T. Ben, "Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder," Journal of Electronic Materials, vol. 48 no. 1, pp. 107-121, Jan. 2019.

Gu, Tianhong, Xu, Yilun, Gourlay, Christopher M., and Britton, T. Ben, "In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint," Scripta Materialia, vol. 175, pp. 55-60, Jan. 15, 2020.

Gu, Tianhong, Tong, Vivian S., Gourlay, Christopher M., and Britton, T. Ben, "In-situ study of creep in Sn-3Ag-0.5Cu solder," Acta Materialia, vol. 196, pp. 31-43, Sept. 1, 2020.

Gu, X., Chan, Y. C., Wu, B. Y., and Yang, D., "Effect of Carbon Inclusion in the Ni-P Coating on Shearing Behavior of Sn4Ag0.5Cu Ball Grid Array Solder Joints," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Gu, X., Yang, D., Chan, Y. C., and Wu, B. Y., "Effects of electromigration on the growth of intermetallic compounds in Cu/SnBi/Cu solder joints," Journal of Materials Research, vol. 23 no. 10, pp. 2591-2596, Oct. 2008.

Gu, X., and Chan, Y. C., "Electromigration in Line-Type Cu/Sn-Bi/Cu Solder Joints," Journal of Electronic Materials, vol. 37 no. 11, pp. 1721-1726, Nov. 2008.

Gu, X., and Chan, Y. C., "Microstructural Evolution by Electromigration in Line-type Cu/SnBi/Cu Solder Joint," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 885-890.

Gu, X., Chan, Y. C., Yang, D., and Wu, B. Y., "The shearing behavior and microstructure of Sn-4Ag-0.5Cu solder joints on a Ni-P-carbon nanotubes composite coating," Journal of Alloys and Compounds, vol. 468 no. 1-2, pp. 553-557, Jan. 22, 2009.

Gu, X., Yung, K. C., and Chan, Y. C., "Thermomigration and electromigration in Sn58Bi ball grid array solder joints," Journal of Materials Science: Materials in Electronics, vol. 21 no. 10, pp. 1090-1098, Oct. 2010.

Gu, X., Yung, K. C., Chan, Y. C., and Yang, D., "Thermomigration and electromigration in Sn8Zn3Bi solder joints," Journal of Materials Science: Materials in Electronics, vol. 22 no. 3, pp. 217-222, Mar. 2011.

Gu, Xin, Ding, Kunpeng, Cai, Jian, and Kong, Lingwen, "Electromigration and Thermomigration in Sn3Ag0.5Cu Solder Joints," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 1273-1279.

Gu, Xin, Huang, Liangsong, and Wang, Guohui, "Investigation of ENEPIG/Sn-10Sb solder joint," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 731-733.

Gu, Xin, and Chan, Y. C., "Thermomigration and electromigration in Sn58Bi solder joints," Journal of Applied Physics, vol. 105 no. 9, pp. 093537-1-093537-5, 2009.

Gu, Yan, Shen, Ping, Yang, Nan-Nan, and Cao, Kang-Zhan, "Effects of direct current on the wetting behavior and interfacial morphology between molten Sn and Cu substrate," Journal of Alloys and Compounds , vol. xxx, pp. xx-xx, xxxx.

Gu, Yue, Zhao, Xiuchen, Li, Yi, Liu, Ying, Wang, Yong, and Li, Zhenyu, "Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn-Ag-Cu solders on Cu substrates," Journal of Alloys and Compounds, vol. 627, pp. 39-47, Apr. 5, 2015.

Gu, Zhiyong, Gao, Fan, and Mukherjee, Subhadeep, "Nanoscale Lead-free Solders ("Nano-Solders"): Synthesis, Characterization, and Reflow Properties," Toxics Use Reduction Institute Technical Report No. 61, 2008.

Guan, Lim Teck, and Faxing, Che, "Substrate Opening to Increase Solder Joint Reliability and Circuit Integration," 2015 IEEE 17th Electronics Packaging and Technology Conference, Singapore, Dec. 2-4, 2015, pp. xx-xx.

Guan, Wanbing, Verma, Suresh Chand, Gao, Yulai, Andersson, Cristina, Zhai, Qijie, and Liu, Johan, "Characterization of Nanoparticles of Lead Free Solder Alloys," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 7-12.

Guan, Youliang, Chen, Xu, Li, Fengqin, and Gao, Hong, "Study on the curing process and shearing tests of die attachment by Ag-epoxy electrically conductive adhesive," International Journal of Adhesion and Adhesives, vol. 30 no. 2, pp. 80-88, March 2010.

Guan, Zhuo-Ming, Liu, Guo-Xun, and Liu, Tao, "Kinetics of Interface Reaction in 40Sn-Bi/Cu and 40Sn-Bi-2Ag/Cu Systems During Aging In Solid State," IEEE Transactions on Advanced Packaging , vol. 23 no. 4, pp. 737-742, Nov. 2000.

Gubeno, Jackie, "Proven Metal," Recycling Today, vol. 44 no. 3, pp. 118-124, Mar. 2006.

Gudeczauskas, Don, Gruenwald, Albin, and Milad, George, "Study of Immersion Gold Processes That May Be Used for Both ENIG and ENEPIG," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 906-910.

Gudeczauskas, Don, and Milad, George, "The Mechanism of Nickel Corrosion in ENIG Deposits and How to Mitigate It," Printed Circuit Design and Fab/ Circuits Assembly, vol. 36 no. 2, pp. 40,42-44,46 , Feb. 2019.

Gudeczauskas, Donald, Milad, George, Gruenwald, Albin, and Kiso, Masayuki, "The Effect of the Immersion Gold Reaction on Oxidation of the Electroless Nickel Deposit in ENIG Plating," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 699-703.

Guder, Vildan, and Sengul, Sedat, "Tensile strength and failure mechanism of hcp zirconium nanowires: Effect of diameter, temperature and strain rate," Computational Materials Science , vol. 177, pp. 109551-1-109551-8, May 2020.

Guduru, Sai, Singh, Vijay P., Rajaputra, Suresh, and Mangu, Raghu, "Fabrication and Characterization of N-type Cadmium Telluride Nanowires for Thin-Film Solar Cell Applications," 2011 37th IEEE Photovoltaic Specialists Conference, Seattle, WA, June 19-24, 2011, pp. 2709-2714.

Guedon, Alexandrine, Woirgard, Eric, and Zardini, Christian, "Evaluation of lead-free soldering for automotive applications," Microelectronics Reliability, vol. 42 no. 9-11, pp. 1555-1558, Sept.-Nov. 2002.

Guedon-Gracia, A., Woirgard, E., and Zardini, C., "Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability," Microelectronics Reliability , vol. 45 no. 9-11, pp. 1652-1657, Sept.-Nov. 2005.

Guedon-Gracia, A., Woirgard, E., and Zardini, C., "Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability," Microelectronics Reliability , vol. 45 no. 12, pp. 1652-1657, Dec. 2005.

Guedon-Gracia, A., Fremont, H., Deletage, J.-Y., and Weide-Zaage, K., "Corrosion Study on BGA Assemblies," Pan Pacific Symposium 2016 Proceedings, Waimea, HI, Jan. 25-28, 2016, pp. xx-xx.

Guedon-Gracia, A., Fremont, H., Plano, B., Deletage, J.-Y., and Weide-Zaage, K., "Effects of salt spray test on lead-free solder alloy," Microelectronics Reliability, vol. 64, pp. 242-247, Sept. 2016.

Guedon-Gracia, Alexandrine, Roux, Pascal, Woirgard, Eric, and Zardini, Christian, "Reliability Analysis of Lead-Free BGA Assemblies Linking FE Simulations and Experimental Results," Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, Apr. 18-20, 2005, pp. 259-262.

Guedon-Gracia, Alexandrine, Woirgard, Eric, and Zardini, Christian, "Reliability of Lead-Free BGA Assembly: Correlation Between Accelerated Ageing Tests and FE Simulations," IEEE Transactions on Device and Materials Reliability, vol. 8 no. 3, pp. 449-454, Sept. 2008.

Guene, Emmanuelle, and Puechagut, Celine, "Case Study: Development of a Low Temperature Tin-Bismuth-Silver Solder Paste," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 625-632.

Guene, Emmanuelle, and Puechagut, Celine, "Case Study: Development of a Low Temperature Tin-Bismuth-Silver Solder Paste," South East Asia Technical Training Conference on Electronics Assembly Technologies 2013 Proceedings, Penang, Malaysia, Apr. 17-19, 2013, pp. xx-xx.

Guene, Emmanuelle, "Development and Characterization of Solder Pastes Based on Two Alternative Alloys: Bismuth-Tin-Silver (BiSn42Ag0.4-1%) for Low Temperature and Tin-Antimony (SnSb5-8.5) for High Temperature," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 184-190.

Guene, Emmanuelle, and Puechagut, Celine, "Development of a Suitable Flux Medium for Cleanable And No-Clean Solder Pastes Based on Tin-Bismuth-Silver Alloy," International Conference on Soldering & Reliability 2013 Proceedings, Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.

Guene, Emmanuelle, Verdier, Marie, Laugt, Anne-Marie, and Ducoulombier, Aurelie, "Reliability and Cleanability of Solder Paste Residue: Vapor Phase vs. Convection," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 888-896.

Guene, Emmanuelle, and Teh, Steven, "Reliability Assessment of No-Clean & Water-Soluble Solder Pastes, Part I," Surface Mount Technology (SMT), vol. 29 no. 3, pp. 74,76-78,80-89, Mar. 2014.

Guene, Emmanuelle, and Teh, Steven, "Reliability Assessment of No-clean and Water-soluble Solder Pastes, Part II," Surface Mount Technology (SMT), vol. 30 no. 4, pp. 26,28-30,32-34,36-40, Apr. 2015.

Guene, Emmanuelle, and Ducoulombier, Aurelie, "Reliability Study of No Clean Chemistries for Lead Free Solder Paste in Vapour Phase Reflow," 2016 IEEE 18th Electronics Packaging Technology Conference, Singapore, Nov. 30-Dec. 3, 2016, pp. 157-164.

Guene, Emmanuelle, and Ducoulombier, Aurelie, "Reliability Study of No Clean Chemistries for Lead-Free Solder Paste in Vapour Phase Reflow," South East Asia Technical Training Conference on Electronics Assembly Technologies 2017, Penang, Malasia, Mar. 28-30, 2017. pp. xx-xx.

Guene, Emmanuelle, "Solderability and Reliability Evolution of No Clean Solder Fluxes for Selective Soldering," 2017 21st European Microelectronics and Packaging Conference & Exhibition, Warsaw, Poland, Sept. 10-13, 2017, pp. xx-xx.

Guene, Emmanuelle, and Puechagut, Celine, "Tools to assure compatibility of conformal coatings and no-clean lead-free solder pastes," Global SMT and Packaging, vol. 13 no. 10, pp. 20-22,24,26,28-29, Oct. 2013.

Guenole, J., Godet, J., and Brochard, S., "Investigation of plasticity in silicon nanowires by molecular dynamics simulations," Key Engineering Materials, vol. 465, pp. 89-92, Jan. 2011.

Guernsey, V. E., and Mandich, N. V., "The Burn that STILL Burns, Part 3," Products Finishing, vol. 68 no. 10, pp. 36-39, July 2004.

Guerra, D. B., Muller, S., Oliveira, M. P., Fichtner, P. F. P., and Papaleo, R. M., "Bi nanowires modified by 400 keV and 1 MeV Au ions," AIP Advances , vol. 8 no. 12, pp. 125103-1-125103-11, Dec. 2018.

Guevara-Garc¡a, Jose Antonio, and Montiel-Corona, Virginia, "USED battery collection in central Mexico: Metal content, legislative/management situation and statistical analysis," Journal of Environmental Management, vol. xx no. x, pp. xx-xx, xxxx.

Gui, Jun, Li, Xing-Min, Li, Wang-Yun, Yan, Hai-Dong, Qin, Hong-Bo, Huang, Jia-Qiang, and Yang, Dao-Guo, "Shear performance of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints after deep cryogenic treatment with different time," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Gui, Xulong, Zhang, Zongyang, Xu, Ling, and Liu, Sheng, "Investigation of Reflow Soldering under Nitrogen Atmosphere," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 861-865.

Gui, Xulong, Zhang, Zongyang, Xu, Ling, and Liu, Sheng, "On Reflow Soldering Process and Reflow Profile," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 866-871.

Guiles, Chet, and Najjar, Ousama, "The Search for an Ideal Lead-Free Laminate," Printed Circuit Design and Manufacture, vol. 22 no. 7, pp. 26, 28, 30, July 2005.

Guinet, J., Lambert, X., and Bono, D., "Study of the Corrosivity of Solder Pastes," Soldering & Surface Mount Technology, vol. 6 no. 1, pp. 11-14, 1994.

Guliants, Elena A., Ji, Chunhai, and Anderson, Wayne A., "Self-assembly of spatially separated silicon structures by Si heteroepitaxy on Ni disilicide," Journal of Applied Physics, vol. 91 no. 9, pp. 6077-6080, May 1, 2002.

Gumaan, Mohammed S., Shalaby, Rizk Mostafa, Ali, Esmail Abdo Mohammed, and Kamal, Mustafa, "Copper effects in mechanical, thermal and electrical properties of rapidly solidified eutectic Sn-Ag alloy," Journal of Materials Science: Materials in Electronics, vol. 29 no. 11, pp. 8886-8894, June 2018.

Gumaan, Mohammed S., Shalaby, Rizk Mostafa, Yousef, Mustafa Kamal Mohammed, Ali, Esmail A. M., and Abdel-Hady, E. E., "Nickel effects on the structural and some physical properties of the eutectic Sn-Ag lead-free solder alloy," Soldering & Surface Mount Technology , vol. 31 no. 1, pp. 40-51, 2019.

Gumfekar, Sarang P., Chen, Alex, and Zhao, Boxin, "Silver-Polyaniline-Epoxy Electrical Conductive Adhesives - A Percolation Threshold Analysis," 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 7-9, 2011, pp. 180-184.

Gumpert, Ben, Fox, William, and Dupriest, C. Don, "Evaluation of the Use of ENEPIG in Small Solder Joints," Surface Mount Technology (SMT), vol. 32 no. 1, pp. 12,14-16,18-21, Jan. 2017.

Gumpert, Ben, Fox, William, and Dupriest, C. Don, "Evaluation of the Use of ENEPIG in Small Solder Joints in Thermal Cycling," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 965-971.

Gungor, Salih, "Strain Measurements on Solder Joints (Optical Methods)," Structural Integrity & Reliability in Lead-Free, United Kingdom, Mar. 25, 2004.

Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Zhao, Ning, Chen, Jun, Wang, Yunpeng, and Ma, Haitao, "Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal reflow stage," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1087-1091.

Guo, Bingfeng, Huang, Ru, Yao, Jinye, Qi, Xiao, Kunwar, Anil, Wang, Yunpeng, and Ma, Haitao, "Effect of soldering temperature on cross-interaction at L-S interface of linear Cu/SAC305/Ni solder joints," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 445-449.

Guo, Bingfeng, Kunwar, Anil, Ma, Haoran, Liu, Jiahui, Li, Shuang, Sun, Junhao, Zhao, Ning, and Ma, Haiao, "Effects of Soldering Temperature and Cooling Rate on the as-Soldered Microstructures of Intermetallic Compounds in Sn-0.7Cu/Cu Joint," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 249-252.

Guo, Bingfeng, Ma, Haitao, Jiang, Chengrong, Wang, Yunpeng, Kunwar, Anil, Zhao, Ning, and Huang, Mingliang, "Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid-solid interface during soldering cooling stage," Journal of Materials Science: Materials in Electronics , vol. 28 no. 7, pp. 5398-5406, Apr. 2017.

Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Zhao, Ning, and Ma, Haitao, "In situ study of real-time growth behavior of IMC morphology evolution during the Sn/Cu soldering cooling stage," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 395-399.

Guo, Bingfeng, Sun, Yuena, and Chu, Xinhong, "In-situ study the effect of IMC thickness on tensile behavior of the Cu/Sn0.7Cu/Ni interconnects," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Chen, Jun, Zhao, Ning, Wang, Yunpeng, and Ma, Haitao, "In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage," 2017 18th International Conference on Electronic Packaging Technology , Harbin, China, Aug. 16-19, 2017, pp. 974-979.

Guo, Bingfeng, "In-situ study the morphology, growth kinetics and mechanism of Cu6Sn5 at the SnAgCu/Cu soldering interfaces during the cooling stage," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Guo, Bingfeng, Kunwar, Anil, Jiang, Chengrong, Zhao, Ning, Sun, Junhao, Chen, Jun, Wang, Yunpeng, Huang, Mingliang, and Ma, Haitao, "Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni substrates during the heat preservation stage," Journal of Materials Science: Materials in Electronics, vol. 29 no. 1, pp. 589-601, Jan. 2018.

Guo, Dengji, Kometani, Reo, Warisawa, Shin'ichi, and Ishihara, Sunao, "Growth of ultra-long free-space-nanowire by the real-time feedback control of the scanning speed on focused-ion-beam chemical vapor deposition," Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol. 31 no. 6, pp. 061601-061601-5, Nov. 2013.

Guo, F., Lucas, J. P., and Subramanian, K. N., "Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5Ag and Sn-4.0Ag-0.5Cu non-composite solder joints," Journal of Materials Science: Materials in Electronics, vol. 12 no. 1, pp. 27-35, Jan. 2001.

Guo, F., Lee, J., and Subramanian, K. N., "Creep behaviour of composite lead-free electronic solder joints," Soldering & Surface Mount Technology, vol. 15 no. 1, pp. 39-42, 2003.

Guo, F., Lee, J., Lucas, J. P., Subramanian, K. N., and Bieler, T. R., "Creep Properties of Eutectic Sn-3.5Ag Solder Joints Reinforced with Mechanically Incorporated Ni Particles," Journal of Electronic Materials , vol. 30 no. 9, pp. 1222-1227, Sept. 2001.

Guo, F., Choi, S., Lucas, J. P., and Subramanian, K. N., "Effects of Solder Reflow on Wettability, Microstructure, and Mechanical Properties," Journal of Electronic Materials, vol. 29 no. 10, pp. 1241-1248, Oct. 2000.

Guo, F., Lee, J. G., Hogan, T., and Subramanian, K. N., "Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock," Journal of Materials Research , vol. 20 no. 2, pp. 364-374, Feb. 2005.

Guo, F., Choi, S., Subramanian, K. N., Bieler, T. R., Lucas, J. P., Achari, A., and Paruchuri, M., "Evaluation of creep behavior of near-eutectic Sn-Ag solders containing small amount of alloy additions," Materials Science and Engineering A , vol. 351 no. 1-2, pp. 190-199, June 25, 2003.

Guo, F., Choi, S., Lucas, J. P., and Subramanian, K. N., "Microstructural characterisation of reflowed and isothermally-aged Cu and Ag particulate reinforced Sn-3.5Ag composite solders," Soldering & Surface Mount Technology, vol 13 no. 1, pp. 7-18, 2001.

Guo, F., Subramanian, K. N., "Solders strengthened with copper and silver particles," Advanced Materials & Processes, vol. 160 no. 12, pp. 41-43, Dec. 2002.

Guo, F., Lee, J., and Subramanian, K. N., "Solders strengthened with nickel particles," Advanced Materials & Processes, vol. 162 no. 8, pp. 81-82, Aug. 2004.

Guo, F., Lee, J., Choi, S., Lucas, J. P., Bieler, T. R., and Subramanian, K. N., "Processing and Aging Characteristics of Eutectic Sn-3.5Ag Solder Reinforced with Mechanically Incorporated Ni Particles," Journal of Electronic Materials, vol. 30 no. 9, pp. 1073-1082, Sept. 2001.

Guo, Fayao, Ling, Huiqin, Yin, Yihao, Li, Ming, Zhang, Wenqi, and Cao, Liqiang, "Effect of Ag on IMC Growth and Shear Strength of Sn-3.5Ag/Cu microbumps," 2019 20th International Conference on Electronic Packaging Technology , Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Guo, Fu, "Composite lead-free electronic solders," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 129-145, Mar. 2007.

Guo, Fu, Liu, Qian, Ma, Limin, and Zuo, Yong, "Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration," Journal of Materials Research, vol 31 no. 12, pp. 1793-1800, June 2016.

Guo, Fu, Xu, Guangchen, He, Hongwen, Zhao, Mengke, Sun, Jia, and Wang, C. Henry, "Effect of Electromigration and Isothermal Aging on the Formation of Metal Whiskers and Hillocks in Eutectic Sn-Bi Solder Joints and Reaction Films," Journal of Electronic Materials, vol. 38 no. 12, pp. 2647-2658, Dec. 2009.

Guo, Fu, Xu, Guangchen, and He, Hongwen, "Electromigration behaviors in Sb particle-reinforced composite eutectic SnAgCu solder joints," Journal of Materials Science, vol. 44 no. 20, pp. 5595-5601, Oct. 2009.

Guo, Fu, Zhao, Mengke, Xia, Zhidong, Lei, Yongping, Li, Xiaoyan, and Shi, Yaowu, "Lead-free Solders with Rare Earth Additions," JOM, vol. 61 no. 6, pp. 39-44, June 2009.

Guo, Fu, Xu, Guangchen, Sun, Jia, Xia, Zhidong, Lei, Yongping, Shi, Yaowu, and Li, Xiaoyan, "Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration," Journal of Electronic Materials, vol. 38 no. 12, pp. 2756-2761, Dec. 2009.

Guo, H. Y., Guo, J. D., and Shang, J. K., "Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces," Journal of Electronic Materials, vol. 38 no. 12, pp. 2470-2478, Dec. 2009.

Guo, Jianjun, Zhang, Lei, Xian, Aiping, and Shang, J. K., "Solderability of Electrodeposited Fe-Ni Alloys with Eutectic SnAgCu Solder," Journal of Materials Science and Technology, vol. 23 no. 6, pp. 811-816, Nov. 2007.

Guo, Jie, Zhang, Ran, and Xu, Zhenming, "PBDEs Emission from Waste Printed Wiring Boards during Thermal Process," Environmental Science & Technology, vol. 49 no. 5, pp. 2716-2723, Mar. 3, 2015.

Guo, Jingwei, Huang, Hui, Ding, Yizheng, Ji, Zhuoyu, Liu, Ming, Ren, Xiaomin, Zhang, Xia, and Huang, Yongqing, "Growth of zinc blende GaAs/AlGaAs heterostructure nanowires on Si substrate by using AlGaAs buffer layers," Journal of Crystal Growth, vol. 359, pp. 30-34, Nov. 15, 2012.

Guo, Jiuyong, Guo, Jie, and Xu, Zhenming, "Recycling of non-metallic fractions from waste printed circuit boards: A review," Journal of Hazardous Materials, vol. 168 no. 2-3, pp. 567-590, Sept. 15, 2009.

Guo, Liang, Li, Ming, and Zhang, Li, "Effects of Current Density and Concentration of Sn2+ on Solder Voids," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 1089-1091.

Guo, Mengjiao, Sun, F., and Yin, Zuozhu, "Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding," Soldering & Surface Mount Technology , vol. 31 no. 4, pp. 227-232, 2019.

Guo, Ming-Yung, Lin, C. K., Chen, Chih, and Tu, K. N., "Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints," Intermetallics , vol. 29, pp. 155-158, 2012.

Guo, Nan, Hu, Weida, Liao, Lei, Yip, SenPo, Ho, Johnny C., Miao, Jinshui, Zhang, Zhi, Zou, Jin, Jiang, Tao, Wu, Shiwei, Chen, Xiaoshuang, and Lu, Wei, "Anomalous and Highly Efficient InAs Nanowire Phototransistors Based on Majority Carrier Transport at Room Temperature," Advanced Materials , vol. 26 no. 49, pp. 8203-8209, Dec. 23, 2014.

Guo, Ning, Song, Bo, Wang, Bing-Shu, and Liu, Qing, "Influence of Torsion Deformation on Textures of Cold Drawing Pearlitic Steel Wires," Acta Metallurgica Sinica, vol. 28 no. 6, pp. 707-714, June 2015.

Guo, Qiang, Yu, Fuwen, Chen, Hongtao, and Li, Mingyu, "Microstructure evolution during reflow and thermal aging in a Ag@Sn TLP bondline for high-temperature power devices," Journal of Materials Science: Materials in Electronics, vol. 29 no. 4, pp. 3014-3024, Feb. 2018.

Guo, Qing, Wang, Tao, Sheng, Kuang, and Yu, Bin, "Optimization of Bosch etch process for vertically stacked Si nanowires," Journal of Materials Science: Materials in Electronics, vol. 23 no. 1, pp. 334-342, Jan. 2012.

Guo, Qinhan, Zhao, Zhenjiang, and Shen, Chunlong, "Comparison study on microstructure and mechanical properties of Sn-10Bi and Sn-Ag-Cu solder alloys and joints," Microelectronics Reliability, vol. 78, pp. 72-79, Nov. 2017.

Guo, Siao-Wei, Huang, Yu-Wen, and Liao, Hsueh-Kuo, "High Reliability Lead Free Solder Evaluations in Power Module Application," 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 25-27, 2017, pp. 295-298.

Guo, Song, He, Yuming, Lei, Jian, Li, Zhenkun, and Liu, Dabiao, "Individual strain gradient effect on torsional strength of electropolished microscale copper wires," Scripta Materialia, vol. 130, pp. 124-127, Mar. 15, 2017.

Guo, Song, He, Yuming, Liu, Dabiao, Lei, Jian, Li, Zhenkun, and Ding, Huaming, "Torsional stress relaxation behavior of microscale copper wire," Materials Science and Engineering: A, vol. 698, pp. 277-281, June 20, 2017.

Guo, Wei-Ting, Liang, Chien-Lung, and Lin, Kwang-Lung, "The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0-1.0 wt%) high temperature Pb-free solders," Materials Science and Engineering: A, Structural Materials, vol. 750, pp. 117-124, Mar. 18, 2019.

Guo, Weibing, Ma, Xinran, Gao, Mingze, and Yan, Jiuchun, "Direct soldering of screen-printed Al-paste layer on back-side of silicon solar cell using SnAg solder," Materials Letters, vol. 231, pp. 146-149, Nov. 15, 2018.

Guo, Xingdong, and Zhang, Keke, "Study on Fracture Mechanism of the Aged Sn2.5Ag0.7Cu0.1RE/Cu Soldering Joint with External Energy," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1212-1214.

Guo, Yifan, Lin, Jong-Kai, and De Silva, Anada, "Reliability Evaluations of Chip Interconnect in Lead-Free Solder Systems," 2002 Proceedings 52nd Electronic Components & Technology Conference , San Diego, CA, May 28-31, 2002, pp. 1275-1280.

Guo, Z., Pao, Yi-Hsin, and Conrad, H., "Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints," Journal of Electronic Packaging, vol. 117 no. 2, pp. 100-104. June 1995.

Guo, Zhanli, Saunders, Nigel, Miodownik, Peter, and Schille, Jean-Philippe, "Modeling Material Properties of Lead-Free Solder Alloys," Journal of Electronic Materials, vol. 37 no. 1, pp. 23-31, Jan. 2008.

Guo, Zhanli, Saunders, Nigel, Miodownik, Peter, and Schille, Jean-Philippe, "Modelling of Thermodynamic, Thermophysical and Physical Properties of Lead-Free Solder Alloys," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Guo, Zhongnan, Hindler, Michael, Yuan, Wenxia, and Mikul, Adolf, "Thermodynamic properties of liquid Au-Cu-Sn alloys determined from electromotive force measurements," Thermochimica Acta, vol. 525 no. 1-2, pp. 183-189, Oct. 20, 2011.

Guoguang, Lu, Yun, Huang, and Yunfei, En, "Reliability of Indium Solder Die Bonding of High Power cm-Bars," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 968-972.

Guohai, Chen, Ma, Jusheng, and Geng, Zhiting, "Fabrication and Properties of Lead-free Sn-Ag-Cu-Ga Solder Alloy," Materials Science Forum, vol. 475-479 part 3, pp. 1747-1750, 2005

Guojun, Hu, and Tay, Andrew A. O., "A Numerical Study of the Effects of Temperature, Moisture and Vapour Pressure on Delamination in a PQFP During Solder Reflow," 2004 6th International Conference on Electronic Packaging Technology, Singapore, Dec. 8-10, 2004, pp. 98-104.

Guojun, Hu Hu, Tay, Andrew A. O., Yongwei, Zhang, and Chew, Spencer, "A Study of the Effect of Viscoelasticity on Delamination in a Plastic IC Package Undergoing Leadfree Solder Reflow," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 686-692.

Guojun, Hu, and Tay, Andrew A. O., "Application of Modified Virtual Crack Closure Method on Delamination Analysis in a Plastic IC Package during Lead-Free Solder Reflow," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2, Singapore, Dec. 7-9, 2005, pp. 555-560.

Guojun, Hu, Tay, Andrew A. O., Yongwei, Zhang, and Chew, Spencer, "Experimental and Numerical Study of the Effect of Viscoelasticity on Delamination in a Plastic IC Package," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1062-1068.

Guojun, Hu, and Tay, Andrew A. O., "On the Relative Contribution of Temperature, Moisture and Vapor Pressure to Delamination in a Plastic IC Package during Lead-Free Solder Reflow," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 1, Orlando, FL, May 31-June 3, 2005, pp. 172-178.

Guo-kui, Ju, Xi-cheng, Wei, Peng, Sun, and Liu, Johan, "Tensile Fracture Behavior of Sn-3.0Ag-0.5Cu Solder Joints on Copper," International Symposium on High Density Packaging and Microsystem Integration , Shanghai, China, June 26-28, 2007, pp. xx-xx.

Guo-kui, Ju, Xi-cheng, Wei, Peng, Sun, and Johan, Liu, "The comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu)/Cu joints during isothermal aging and their tensile strengths," Soldering & Surface Mount Technology, vol. 20 no. 3, pp. 4-10, 2008.

Guozheng, Yuan, Zhigang, Li, and Xuefeng, Shu, "Mechanical Characterization of the IMC Layer by Using Nano-Indentation Tests," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 1077-1079.

Gupta, Abhishek, "Don't Let Tin Whiskers Destroy Your Design," Electronic Design, vol. 61 no. 13, pp. 63-66, Nov. 7, 2013.

Gupta, Abhishek, "Hard-Won Knowledge Mitigates Effects Of Tin Whiskers," Electronic Design, vol. 62 no. 7, pp. 35-38, July 2014.

Gupta, D., "Diffusion in Metallic Thin Films," Defect and Diffusion Forum, vol. 59, pp. 137-150, 1988.

Gupta, D., "Diffusion in The Lattice and Interfaces of Real Engineering Materials: A Unified Approach," Defect and Diffusion Forum, vol. 279, pp. 1-12, pp. 2008.

Gupta, Debabrata 'Dev", "A Novel Active Area Bumped Flip Chip Technology for Convergent Heat Transfer from Gallium Arsenide Power Devices," 1994 Proceedings 44th Electronic Components & Technology Conference, Washington, D. C, May 1-4, 1994, pp. 917-921.

Gupta, Debabrata 'Dev', "Evaluation of Alternative Processes for Au-Sn-Au Flip Chip Bonding of Power Devices," Proceedings 1995 International Symposium on Microelectronics , Los Angeles, CA, Oct. 24-26, 1995, pp. 371-377.

Gupta, K. P., "The Co-Ni-Sn (Cobalt-Nickel-Tin) System," Journal of Phase Equilibria and Diffusion, vol. 30 no. 6, pp. 646-650, Dec. 2009.

Gupta, K. P., "The Co-Sn-Zr (Cobalt-Tin-Zircoium) System," Journal of Phase Equilibria and Diffusion, vol. xx no. x, pp. xx-xx, xxxx.

Gupta, K. P., "The Ga-Ni-Sn (Gallium-Nickel-Tin) System," Journal of Phase Equilibria and Diffusion, vol. xx, no. x, pp. xx-xx, xxxx.

Gupta, M., and Wong, W. L. E., "Enhancing overall mechanical performance of metallic materials using two-directional microwave assisted rapid sintering," Scripta Materialia , vol. 52 no. 6, pp. 479-483, Mar. 2005.

Gupta, Piyush, Doraiswami, Ravi, and Tummala, Rao, "Effect of Intermetallic Compounds on Reliability of Sn-Ag-Cu Flip Chip Solder Interconnects for Different Substrate Pad Finishes and Ni/Cu UBM," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 68-74.

Gupta, Richa, and Vaid, Rakesh, "TCAD performance analysis of high-K dielectrics for gate all around InAs nanowire transistor considering scaling of gate dielectric thickness," Microelectronic Engineering, vol. 160, pp. 22-26, July 1, 2016.

Gupta, S., Hydro, R. M., and Pearson, R. A., "Fracture Behaviour of Isotropically Conductive Adhesives," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 38-43.

Gupta, S. P., and Rathor, D., "Kinetics of growth of intermetallics in the Cu-Sn system," Zeitschrift fur Metallkunde, vol. 93 no. 6, pp. 516-522, June 2002.

Gupta, Sandeep, Hydro, Ryan M., and Pearson, Raymond A., "Fracture Behavior of Isotropically Conductive Adhesives," IEEE Transactions on Components and Packaging Technologies, vol. 22 no. 2, pp. 209-214, June 1999.

Gupta, Vivek, and McCullen, Jack, "Correlation of Proposed Sn-Whisker Test Standards to Market Segment Use Conditions," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Gupta, Vivek, "Lead-free Component and Board Identification Standard," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies , San Jose, CA, Apr. 23-24, 2003, pp. 68-73.

Gupta, Vivek, and Chin, Y. T., "Lead-Free Second Level Interconnect On Flip-Chip Packages," Future Fab International, vol. 18, pp. xx-xx, Jan. 12, 2005.

Gupta, Vivek, Clemons, Greg, Kumar, G. Achut, and Mah, Victoria, "Material Technology Solutions for Lead-free," Future Fab International, vol. 13, pp. xx-xx, July 8, 2002.

Gupta, Vivek, "Role of HDPUG in Lead-Free Transition," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 676-678.

Gupte, Omkar, Murtagian, Gregorio, Tummala, Rao, and Smet, Vanessa, "Effect of Solder Paste Volume and Reflow Parameters on Solder Paste Wicking and Joint Shear Strength of Ni-Au-Coated Cu Spheres," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 10 no. 5, pp. 828-835, May 2020.

Gupte, Omkar, Murtagian, Gregorio, Tummala, Rao, and Smet, Vanessa, "Thermal Aging Reliability of Socketable BGA Packages With Ni-Au-Coated SAC305 Spheres," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 10 no. 12, pp. 2118-2124, Dec. 2020.

Gupte, Omkar, Murtagian, Gregorio, Tummala, Rao, and Smet, Vanessa, "Thermal aging reliability of socketable, surface-modified solder BGAs with and without polymer collars," 2020 IEEE 70th Electronic Components and Technology Conference, Lake Buena Vista, AL, May 26-29, 2020, pp. 512-517.

Gurav, Abhijit, and Stacy, Bruce, "Whiskering Evaluation of Capacitors Mounted with Lead Free Solders," IPC/JEDEC 5th International Conference on Lead Free Electronic Components and Assemblies, Mar. 2004.

Gurnett, Keith, and Adams, Tom, "Achieving reliability with lead-free solders," Military & Aerospace Electronics, Jan. 2008.

Gurnett, Keith, and Adams, Tom, "Achieving reliability with lead-free solders," Military & Aerospace Electronics, Mar. 2008.

Gurnett, Keith, and Adams, Tom, "Are Buried Components the Future?," Electronics World, vol. 114 no. 1866, pp. 12-13, June 2008.

Gurnett, Keith, and Adams, Tom, "Can ISO standards smooth the lead-free transition?," Military & Aerospace Electronics, vol. 16 no. 10, pp. 1, 13-14, 16, Oct.2005.

Gurnett, Keith, and Adams, Tom, "CAUTION: lead-free reflow may cause damage," Electronics World, vol. 111 no. 1834, pp. 12-13. Oct. 2005.

Gurnett, Keith, and Adams, Tom, "Hybrid board bonding uncertainties," Connector Specifier, vol. 24 no. 2, pp. 8-11, Mar. 2008.

Gurnett, Keith, and Adams, Tom, "Lead-free movement complicates electronics parts traceability," Military & Aerospace Electronics, vol. 15 no. 12, pp. 1, 11, Dec. 2004.

Gurnett, Keith, and Adams, Tom, "Lead-free processing involves several board issues," Military & Aerospace Electronics, vol. 16 no. 7, pp. 1, 10, 12, July 2005.

Gurnett, Keith, and Adams, Tom, "Pb free - or not Pb free? ,,, asks the US military," Electronics World , vol. 111 no. 1829, pp. 18-19, May 2005.

Gurnett, Keith, and Adams, Tom, "RoHS one year later: supplies of leaded solder drying up," Military & Aerospace Electronics, vol. 18 no. 7, pp. xx-xx, July 2007.

Gurnett, Keith, and Adams, Tom, "Steering Clear of Hybrid-Technology Boards," Electronics World, vol. 114 no. 1862, pp. 11-12, Feb. 2008.

Gurnett, Keith, and Adams, Tom, "STEP 6: Component Placement," Surface Mount Technology (SMT) , vol. 22 no. 7, pp. 19-21, July 2008.

Gurnett, Keith, and Adams, Tom, "The case of the Vanishing ICs," Electronics World, vol. 112 no. 1837, pp. 12-14, Jan. 2006.

Gurnett, Keith, and Adams, Tom, "The danger of hybrid-solder boards," Military & Aerospace Electronics, vol. 18 no. 10, pp. xx-xx, Oct. 2007.

Gurnett, Keith, and Adams, Tom, "The move to lead-free solders has its own challenges and hidden problems," Military & Aerospace Electronics, vol. 15 no. 10, pp. 17, 42-43, Oct. 2004.

Guruprasad, Pradosh, and Pitarresi, James, "Comparison of Joint Level Impact Fatigue Resistance and Board Level Drop Test," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1708-1713.

Guruprasad, Pradosh, and Pitarresi, James, "Effect of Temperature on Transition in Failure Modes for High Speed Impact Test of Solder Joint and Comparison with Board Level Drop Test," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 908-915.

Gusak, A. M., Tu, K. N., and Chen, Chih, "Extremely rapid grain growth in scallop-type Cu6Sn5 during solid-liquid interdiffusion reactions in micro-bump solder joints," Scripta Materialia, vol. 179, pp. 45-48, 2020.

Gustafsson, Katrin, Mannan, Samjid, Liu, Johan, Lai, Zonghe, Whalley, David, and Williams, David, "The Effect of Temperature Ramp Rate on Flip-chip Joint Quality and Reliability Using Anisotropically Conductive Adhesive on FR-4 Substrate," 1997 Electronic Components and Technology Conference, San Jose, CA, May 18-21, 1997, pp. 561-566.

Gutierrez, Ester, Adenso-Diaz, Belarmino, Lozano, Sebastian, and Gonzalez-Torre, Pilar, "Lifetime of household appliances: empirical evidence of users behaviour," Waste Management and Research, vol. 29 no. 6, pp. 622-633, June 2011.

Gutierrez, Floria Roa, "Costa Rica advances towards a sustainable management of e-waste," Proceedings of the 2007 IEEE International Symposium on Electronics & the Environment, Orlando, FL, May 7-10, 2007, pp. 31-33.

Gutsche, C., Lysov, A., Regolin, I., Munstermann, B., and Prost, W., "Scalable Electrical Properties of Axial GaAs Nanowire pn-Diodes," Journal of Electronic Materials, vol. 41 no. 5, pp. 809-812, May 2012.

Guttenplan, Jack D., and Violette, Daniel R., "Corrosion-Related Problems Affecting Electonic Circuitry: Case histories," Materials Performance, vol. 29 no. 4, pp. 76-81, Apr. 1990.

Guven, Ibrahim, "A Fundamental Computational Study of 3-D Non-Planar Fracture in Solder Joints," 2015 IEEE 65th Electronic Components and Technology Conference , San Diego, CA, May 26-29, 2015, pp. 1017-1022.

Guy, John, "Dealing with the Issues of Lead Solder Replacements," Electronics Manufacturing Productivity Facility PP0011, May 1995.

Guy, John, "Dealing with the Issues of Lead Solder Replacements," Proceedings of the Technical Program NEPCON West '95, Volume 2, Anaheim, CA, Feb. 26-Mar. 2, 1995, pp. 1066-1076.

Guy, John, "Manufacturing 25 Mil Pitch Surface Mount Assemblies Using Conductive Adhesive," Proceedings of the Technical Program NEPCON East '94, Boston, MA, June 13-16, 1994, pp. 374-380.

Guy, John, "Solder Joint Reliability Impact of Using Emersion Metallic Coatings," Proceedings of the Technical Program NEPCON West '97, Volume 3, Anaheim, CA, Feb. 23-27, 1997, pp. 1540-1550.

Guy, Sandra, "Critical Junctures," Telephony, vol. 234 no. 21, pp. 5, May 25, 1998.

Guyenot, M., and Fix, A., "Analytical stress model for tin based solder material," 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Ghent, Belgium, Apr. 7-9, 2014, pp. xx-xx.

Guzek, Philip T., "Selecting a Chromate Conversion Coating For Zinc and Cadmium Surfaces," Plating and Surface Finishing, vol. 68 no. 7, pp. 20-21, July 1981.

Gyemant, Tony, "Cost Effective Lead-Free Wave Soldering Conversion," Lead-Free Connection, vol. 2 no. 4, pp. 8-9, Dec. 2005.

Gyemant, Tony, "Lead-free Wave Soldering: A Cost-effective Alternative," Surface Mount Technology (SMT), vol. 17 no. 12, pp. 46-48, Dec. 2003.

Gyorki, John, "RoHS and WEEE directives overview," Design World , vol. 3 no. 7, pp. xx, July 2008.

HHHH

Ha, Chang-Wan, Kim, Kyung-Rok, Kim, Kyung-Soo, and Kim, Soohyun, "Sliding Mechanism of Lateral Thermosonic Process With Anisotropic Conductive Film for High Productivity and High Reliability," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 2, pp. 205-212, Feb. 2013.

Ha, Jonghwan, Pan, Ke, Wang, Huayan, Won, D. H., and Park, S. B., "The Effect of Misaligned Passive Component on Fatigue Life of Solder Joints and Solder Shape," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 1029-1034.

Ha, Jun Seok, Kang, Choon Sik, Park, Jae Yong, and Jung, Jae Pil, "Microstructure and Mechanical Properties of Partial Melted Joint Using off Eutectic Lead-Free Solders," Materials Transactions, vol. 42 no. 5, pp. 814-819, May 2001.

Ha, Nguyen Thi Hoang, Sakakibara, Masayuki, Sano, Sakae, and Nhuan, Mai Trong, "Uptake of metals and metalloids by plants growing in a lead-zinc mine area, Northern Vietnam," Journal of Hazardous Materials, vol. 186 no. 2-3, pp. 1384-1391, Feb. 28, 2011.

Ha, S.-S., Kim, J.-W., Ha, S.-O., and Jung, S.-B., "Shear test parameters for brittle fracture of flip chip solder joint," Materials Science and Technology, vol. 27 no. 3, pp. 696-701, Mar. 2011.

Ha, S. W., Carson, F., Kim, Y. C., and Kim, G. S., "The Effects of Solder Composition on Ball Fatigue Strength of Chip Scale Packages," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 910-915.

Ha, Sang Su, Kang, Hanbyul, Kim, Gun Rae, Pae, Sangwoo, and Lee, Haebum, "Effect of Corrosion on Mechanical Reliability of Sn-Ag Flip-Chip Solder Joint," Materials Transactions, JIM, vol. 57 no. 12, pp. 1966-1971, 2016.

Ha, Sang-Su, Jang, Jin-Kyu, Ha, Sang-Ok, Yoon, Jeong-Won, Lee, Hoo-Jeong, Joo, Jin-Ho, Kim, Young-Ho, and Jung, Seung-Boo, "Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package," Microelectronic Engineering, vol. 87 no. 3, pp. 517-521, Mar. 2010.

Ha, Sang-Su, Park, Jongwoo, and Jung, Seung-Boo, "Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint," Materials Transactions, vol. 52 no. 8, pp. 1553-1559, 2011.

Ha, Sang-Su, Kim, Jong-Woong, Yoon, Jeong-Won, Ha, Sang-Ok, and Jung, Seung-Boo, "Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density," Journal of Electronic Materials , vol. 38 no. 1, pp. 70-77, Jan. 2009.

Ha, Sang-Su, Sung, Ji-Yoon, Yoon, Jeong-Won, and Jung, Seung-Boo, "Influence of current density on mechanical reliability of Sn-3.5Ag BGA solder joint," Microelectronic Engineering, vol. 88 no. 5, pp. 709-714, May 2011.

Ha, Sang-Su, Kim, Dae-Gon, Kim, Jong-Woong, Yoon, Jeong-Won, Joo, Jin-Ho, Shin, Young-Eui, and Jung, Seung-Boo, "Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method," Microelectronic Engineering, vol. 84 no. 11, pp. 2640-2645, Nov. 2007.

Ha, Sang-Su, Jang, Jin-Kyu, Ha, Sang-Ok, Kim, Jong-Woong, Yoon, Jeong-Won, Kim, Byung-Woo, Park, Sun-Kyu, and Jung, Seung-Boo, "Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High-Speed Ball Shear Test," Journal of Electronic Materials, vol. 38 no. 12, pp. 2489-2495, Dec. 2009.

Ha, Yong-Seok, Park, Hong-Gyu, and Seo, Dae-Shik, "Conductive Polyaniline for Potential Application in Anisotropic Conductive Films," Journal of Electronic Materials, vol. 44 no. 4, pp. 1200-1205, Apr. 2015.

Haapamaki, C. M., Baugh, J., and LaPierre, R. R., "Facilitating growth of InAs-InP core-shell nanowires through the introduction of Al," Journal of Crystal Growth, vol. 345 no. 1, pp. 11-15, Apr. 15, 2012.

Haase, J., Farley, D., Iyer, P., Baumgartner, P., Dasgupta, A., and Caers, J. F. J., "Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects," Journal of Adhesion Science and Technology, vol. 22 no. 14, pp. 1733-1756, 2008.

Haberkorn, N., Condo, A. M., Sirena, M., Soldera, F., and Lovey, F. C., "Single crystalline b phase Cu-Zn nanowires: Synthesis and martensitic transformation," Materials Letters, vol. 124, pp. 256-260, June 1, 2014.

Haberland, Julian, Pahl, Barbara, Schmitz, Stefan, Kallmayer, Christine, Aschenbrenner, Rolf, and Reichl, Herbert, "Current Loadability of ICA for Flip Chip Applications," Proceedings of 4th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2002, pp. 144-149.

Haberland, Julian, Kallmayer, Christine, Aschenbrenner, Rolf, and Reichl, Herbert, "Fundamental Studies of Isotropic Conductive Adhesives Focused on the Current Loadability of ICA for Flip Chip Applications," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, Germany, Oct. 21-24, 2001, pp. 185-195.

Habib, Ashfaque Hussain, Ondeck, Matthew G., Miller, Kelsey J., Swaminathan, Raja, and McHenry, Michael E., "Novel Solder-Magnetic Particle Composites and Their Reflow Using AC Magnetic Fields," IEEE Transactions on Magnetics, vol. 46 no. 6, pp. 2187-2190, June 2010.

Habicht, S., Zhao, Q. T., Feste, S. F., Knoll, L., Trellenkamp, S., Bourdelle, K. K., and Mantl, S., "NiSi Nano-contacts to Strained and Unstrained Silicon Nanowires," 2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization, Dresden, Germany, May 8-12, 2011, pp. xx-xx.

Habicht, Stefan, Feste, Sebastian, Zhao, Qing-Tai, Buca, Dan, and Mantl, Siegfried, "Electrical characterization of omega-gated uniaxial tensile strained Si nanowire-array metal-oxide-semiconductor field effect transistors with <100>- and <110> channel orientations," Thin Solid Films, vol. 520 no. 8, pp. 3332-3336, Feb. 1, 2012.

Habu, Kazutaka, Takeda, Naoko, Watanabe, Haruo, Ooki, Hiroshi, Abe, Jiro, Saito, Takashi, Taniguchi, Yoshikuni, and Takayama, Kinjiro, "Development of Lead-free solder Alloys of the Ge doped Sn-Ag-Bi System," Proceedings of the First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Feb. 1-3, 1999, pp. 606-609.

Habu, Kazutaka, Takeda, Naoko, Watanabe, Haruo, Ooki, Hiroshi, Abe, Jiro, Saito, Takashi, Taniguchi, Yoshikuni, and Takayama, Kinjiro, "Development of New Pb-free Solder Alloy of Sn-Ab-Bi System," IEEE International Symposium on Electronics and the Environment, Danvers, MA, May 11-13, 1999, pp. 21-24.

Habu, Kazutaka, Takeda, Naoko, Watanabe, Haruo, Ooki, Hiroshi, Abe, Jiro, Saito, Takashi, Taniguchi, Yoshikuni, and Takayama, Kinjiro, "Pb-Free Solder Alloy of Sn-Ag-Bi System with a Small Amount of Ge," Advances in Electronic Packaging 1999, Volume 1, Maui, Hawaii, June 13-19, 1999, pp. 565-567.

Hackett, Nigel, and Loskot, Dan, "Encapsulation and Modern Molding," Advanced Packaging, vol. 14 no. 10, pp. 24-26, Oct. 2005.

Hada, Yoshikatsu, Marikawa, Osamu, and Togami, Hideki, "Study of Tin Whiskers on Electromagnetic Relay Parts," Proceedings 26th Relay Conference, Stillwater, OK, Apr. 25-25, 1978, pp. 9-1 to 9-5.

Haddi, A., Imad, A., and Vega, G., "The influence of the drawing parameters and temperature rise on the prediction of chevron crack formation in wire drawing," International Journal of Fracture, vol. 176 no. 2, pp. 171-180, Aug. 2012.

Hadi, Pejman, Xu, Meng, Lin, Carol S. K., Hui, Chi-Wai, and McKay, Gordon, "Waste printed circuit board recycling techniques and product utilization," Journal of Hazardous Materials, vol. 283, pp. 234-243, Jan. 2015.

Hadian, Faramarz, Genanu, Mohammed, Owen, Randy, Flores, Javier, and Cotts, Eric J., "Basic Parameters Controlling Current Stressing Lifetime of SAC305/Sn57Bi1Ag Mixed Solder Joints," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 319-325.

Hadian, Faramarz, Schoeller, Harry, and Cotts, Eric, "Correlation Between the Growth of Voids and Ni3Sn4 Intermetallic Compounds at SnAg/Ni and SnAgCuBiSbNi/Ni Interfaces at Temperatures up to 200°C," Journal of Electronic Materials, vol. 49 no. 1, pp. 226-240, Jan. 2020.

Hadian, Faramarz, Genanu, Mohammed, and Cotts, Eric, "Electromigration Behavior of SAC(305)/SnBiAg Mixed Solder Alloy Assemblies," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 542-547.

Hadian, Faramarz, Genanu, Mohammed, Owen, Randy, and Cotts, Eric J., "The Dependence of the Microstructure of SnAgCu/SnBiAg Mixed Assemblies on Reflow Temperature," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 326-332.

Hadley, J. S., "Replacements for Cadmium," Transactions of the Institute of Metal Finishing, vol. 69 no. 2, pp. 10-12, May 1991.

Hadley, J. S., "Replacements for Cadmium."

Haehnel, V., Fahler, S., Schaaf, P., Miglierini, M., Mickel, C., Schultz, L., and Schlorb, H., "Towards smooth and pure iron nanowires grown by electrodeposition in self-organized alumina membranes," Acta Materialia, vol. 58 no. 7, pp. 2330-2337, Apr. 2010.

Hageluken, Christian, "Improving metal returns and eco-efficiency in electronics recycling - a holistic approach for interface optimisation between pre-processing and integrated metals smelting and refining," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 218-223.

Hageluken, Christian, "Recycling of Electronic Scrap at Umicore's Integrated Metals Smelter and Refinery," Erzmetall/World of Metallurgy, vol. 59 no. 3, pp. 152-161, May/June 2006.

Hagihara, Taizo, Takeuchi, Tatsuya, and Ohno, Yasuhide, "Fluxless Flip-Chip Bonding Process Using Hydrogen Radical," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 595-600.

Hagiwara, K., Watanabe, J., and Honma, H., "Preparation of Anisotropic Conductive Particles By Electroless Plating," Plating & Surface Finishing, vol. 84 no. 4, pp. 74-76, Apr. 1997.

Hahladakis, John N., Stylianos, Michailakis, and Gidarakos, Evangelos, "Assessment of released heavy metals from electrical and electronic equipment (EEE) existing in shipwrecks through laboratory-scale simulation reactor," Journal of Hazardous Materials, vol. 250-251, pp. 256-264, Apr. 15, 2013.

Hai, Liu, Li, Jin, Liqun, Gu, Juanjuan, Li, Ying, Li, Qiang, Chen, Maouha, Du, Jianwei, Zhou, and TaeSub, Chang, "Solder Joint Reliability with Various Silver Finish on PCB," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 396-400.

Hai, Zhou, Zhang, Jiawei, Shen, Chaobo, Evans, John L., and Bozack, M. J., "Long-term Aging Effects on Reliability Performance of Lead-free Solder Joints," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. xx-xx.

Hai, Zhou, Zhang, Jiawei, Shen, Chaobo, Evans, John L., Bozack, Michael J., Basit, Munshi M., and Suhling, Jeffrey C., "Reliability Comparison of Aged SAC Fine-Pitch Ball Grid Array Packages Versus Surface Finishes," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 5 no. 6, pp. 828-837, June 2015.

Hai, Zhou, Zhang, Jiawei, Shen, Chaobo, Snipes, E. K., Suhling, J. C., Bozack, M. J., and Evans, J. L., "Reliability Degradation of SAC105 and SAC305 BGA Packages under Long-Term, High Temperature Aging," SMTAnews & Journal of Surface Mount Technology, vol. 27 no. 2, pp. 11-18, Apr.-June 2014.

Haidong, Zhang, Shohji, Ikuo, Shimoda, Masayoshi, and Watanabe, Hirohiko, "Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder," Materials Transactions, JIM, vol. 57 no. 6, pp. 873-880, 2016.

Hailong, Bai, Zan, Long, Junyu, Chen, Xing, Gu, Jinmei, Lv, Lingyan, Zhao, Dongdong, Chen, and Jikang, Yan, "Influence of Ag content on the formation and growth of intermetallic compounds in Sn-Ag-Cu solder," Journal of Materials Science: Materials in Electronics, vol. 31 no. 13, pp. 10105-10112, July 2020.

Haimovich, Joseph, "Cu-Sn Intermetallic Compound Growth in Hot-Air-Leveled Tin at and below 100°C," AMP Journal of Technology, vol. 3, pp. 46-54, Nov. 1993.

Haimovich, Joseph, "Hot Air Leveled Tin: Solderability and Some Related Properties," Proceedings of the 39th Electronic Components Conference, Houston, TX, May 22-24, 1989, pp. 107-112.

Hainey Jr., Mel, Eichfeld, Sarah M., Shen, Haoting, Yim, Joanne, Black, Marcie R., and Redwing, Joan M., "Aluminum-Catalyzed Growth of <110> Silicon Nanowires," Journal of Electronic Materials, vol. 44 no. 5, pp. 1332-1337, May 2015.

Hainey, Mel F., and Redwing, Joan M., "Aluminum-catalyzed silicon nanowires: Growth methods, properties, and applications," Applied Physics Reviews, vol. 3 no. 4, pp. 040806-1-040806-10, Dec. 2016. https://doi.org/10.1063/1.4954398

Hainley, Christopher, "Epitaxial Growth of Germanium and Silicon Nanowires by Chemical Vapor Deposition," 2007 REU Research Accomplishments, pp. 24-25.

Hajdu, I., Kincses, Zs., and Krammer, O., "Noise study method of soldering joints," 29th International Spring Seminar on Electronics Technology, St. Marienthal, Germany, May 10-14, 2006, pp. 296-298.

Hajra, J. P., Ray, T., and Acharya, S., "Thermodynamics and Adsorption Behavior of the Nano Phases in the Bi-Sn System," Journal of Computational and Theoretical Nanoscience, vol. 2 no. 2, pp. 319-317, June 2005.

Haken, Brian, "Environment=confusion; sensible approach to lead-free needed," PCB007, Mar. 18, 2002.

Haken, Brian, "PCIF's Haken responds to European Commission proposal to bring WEEE Directive implementation dates forward," PCB007, Jan. 16, 2001.

Haken, Brian R., "Proposed EC Lead Ban is Premature," SMART Group Lead-Free Seminar 1999 , High Wycombe, UK, Feb. 10, 1999.

Hakes, Jahn K., "Stringency of Workplace Air Contaminant Exposure Limits: A Case Study of OSHA Risk Management," Risk Analysis, vol. 19 no. 6, pp. 1113-1125, Dec. 1999.

Hakonen, P. J., and Nunes Jr., G. "Electrical transport in bismuth whiskers at millikelvin temperatures," Journal of Physics: Condensed Matter, vol. 3 no. 37, pp. 7153-7160, Sept. 16, 1991.

Halimi, R., Chpilevski, E. M., Gorbatchevski, D. A., and Yazitchenko, C. A., "Formation de "Whiskers" et de "Hillocks" sur la Surface des Couches Minces de Cu/Sn," Thin Solid Films, vol. 150 no. 2/3, pp. 357-368, July 6, 1987.

Hall, D. E., "Electrodeposited Zinc-Nickel Alloy Coatings - A Review," Plating and Surface Finishing, vol. 70 no. 11, pp. 59-65, Nov. 1983.

Hall, E. O., "The --> Transformation in Pure Tin and Its Dilute Alloys," The Mechanism of Phase Transformations in Metals, London, U. K., Nov. 9, 1955, pp. 87-92.

Hall Jr., E. Thomas, "NTF - Soldering Technology Development for Cryogenics," Welding, Bonding, and Fastening 1984, Hampton, VA, Oct. 23-25, 1984, pp. 35-54.

Hall, Jim, "Conscious Manufacturing," SMTA Ohio Valley Chapter Meeting, Independence, OH, Dec. 5, 2008.

Hall, Jim, "The Maturing of Lead-free Assembly," SMT Web Exclusive Article.

Hall, Jim, and Zarrow, Phil, "Vapor Phase (Re)Visited," Circuits Assembly, vol. 20 no. 4, pp. 18,20-21, Apr. 2009.

Hall, Ken, "Lead-free revolution hits defence R&D," Electronics Weekly , Nov. 22, 2006.

Hall, W. James, "Evolving Profile Requirements," Surface Mount Technology (SMT) , vol. 19 no. 2, pp. xx-xx, Feb. 2005.

Hall, W. James, and Zarrow, Phil, "Material Logistics for Lead-Free," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 183-186.

Hall, William J., and Williams, Paul T., "Fast Pyrolysis of Halogenated Plastics Recovered from Waste Computers," Energy & Fuels, vol. 20 no. 4, pp. 1536-1549, 2006.

Hall, William J., and Williams, Paul T., "Processing waste printed circuit boards for material recovery," Circuit World, vol. 33 no. 4, pp. 43-50, 2007.

Hall, William J., and Williams, Paul T., "Separation and recovery of materials from scrap printed circuit boards," Resources, Conservation, and Recycling, vol. 52 no. 3, pp. 691-709, Sept. 2007.

Hallberg, Robert T., Lehmann, Sebastian, Messing, Maria E., and Dick, Kimberly A., "Palladium seeded GaAs nanowires," Journal of Materials Research, vol. 31 no. 2, pp. 175-185, Jan. 28, 2016.

Haller, Michael, "SnPb Solder Analysis by X-ray fluorescence Spectroscopy," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.

Halvorson, Todd, "NASA Plans Partial Fix for Discovery Orbiter to Reduce ISS Risk," Florida Today, Apr. 27, 2006.

Ham, Jinhee, Shim, Wooyoung, Kim, Do Hyun, Lee, Seunghyun, Roh, Jongwook, Sohn, Sung Woo, Oh, Kyu Hwan, Voorhees, Peter W., and Lee, Wooyoung, "Direct Growth of Compound Semiconductor Nanowires by On-Film Formation of Nanowires: Bismuth Telluride," Nano letters, vol. 9 no. 8, pp. 2867-2872, 2009. DOI: 10.1021/nl9010518

Ham, Jinhee, Shim, Wooyoung, Kim, Do Hyun, Oh, Kyu Hwan, Voorhees, Peter W., and Lee, Wooyoung, "Watching bismuth nanowires grow," Applied Physics Letters, vol. 98 no. 4, pp. 043102-1-043102-3, Jan. 24, 2011.

Ham, Suk-Jin, Kwon, Woon-Seong, Paik, Kyung-Wook, and Lee, Soon-Bok, "In-situ Moire Measurement of Adhesive Flip-Chip Bonded Assembly Under Thermal Cycling Condition," 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Zalaegerszeg, Hungary, June 23-26, 2002, pp. 63-67.

Hamada, Naoyuki, Hamada, Masakazu, Uesugi, Tokuteru, Takigawa, Yorinobu, and Higashi, Kenji, "Effect of Small Addition of Zinc on Creep Behavior of Tin," Materials Transactions, vol. 51 no. 10, pp. 1747-1752, 2010.

Hamada, Naoyuki, Uesugi, Tokuteru, Takigawa, Yorinobu, and Higashi, Kenji, "Effects of Zn addition and aging treatment on tensile properties of Sn-Ag-Cu alloys," CITE>Journal of Alloys and Compounds, vol. 527, pp. 226-232, June 25, 2012.

Hamamura, K., and Takenouchi, K., "Growth and Morphology of Copper-Nickel Alloy Crystals by Hydrogen Reduction of a CuI-NiBr2 Mixture," Journal of Crystal Growth, vol. 46 no. 6, pp. 804-806, June 1979.

Hamand, Matthew, "Lead Free Performance of FA-18 Electronics Through Manufacture," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 869-888.

Hamano, Hideyuki, Suga, Tadatomo, Okamoto, Masahide, and Otmar, Deubzer, "Environmental Impact Evaluation for the Full Life Cycle of Products using Pb-free Solders," Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 11-15, 2001, pp. 1079-1083.

Hamano, Toshio, "Keep the Reliability, Dump the Lead: Japanese Companies Accelerate Lead-Free Packaging," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Nov.-Dec. 2001.

Hamano, Toshio, and Papalexis, Alex, "Wafer Bumping Solutions Consumer to advanced applications," Advanced Packaging, vol. xx no. xx, pp. xx-xx, Oct. 2002.

Hamasaki, Hiroshi, Shinbata, Kazuhiro, and Yoshida, Fusahito, "Identification of Viscoelastic Properties of Individual Phases in Lead-Free Solder Alloy by Depth-Sensing Microindentation," Materials Transactions , vol. 46 no. 12, pp. 3073-3076, 2005.

Hamasaki, Hiroshi, Shinbata, Kazuhiro, and Yoshida, Fusahito, "Viscoplastic Parameter Identification for Lead-Free Solder Alloy by Micro-Indentation, FE Simulation and Optimization," Materials Transactions, vol. 49 no. 3, pp. 532-537, Mar. 2008.

Hamasha, Sa'd, Jaradat, Younis, Qasaimeh, Awni, Obaidat, Mazin, and Borgesen, Peter, "Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions," Journal of Electronic Materials, vol. 43 no. 12, pp. 4472-4484, Dec. 2014.

Hamasha, Sa'd, Qasaimeh, Awni, Jaradat, Younis, and Borgesen, Peter, "Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 5 no. 9, pp. 1292-1299, Sept. 2015.

Hamasha, Sa'd, Akkara, Francy, Su, Sinan, Ali, Haneen, and Borgesen, Peter, "Effect of Cycling Amplitude Variations on SnAgCu Solder Joint Fatigue Life," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 8 no. 11, pp. 1896-1904, Nov. 2018.

Hamasha, Sa'd, Akkara, Francy, Abueed, Mohammed, Rababah, Mumen, Su, Sianan, Zhao, Cong, Suhling, Jeffery, and Evans, John, "Effect of Surface Finish and High Bi solder Alloy on Component Reliability in Thermal Cycling," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 2032-2040.

Hamasha, Sa'd, and Borgesen, Peter, "Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling," Journal of Electronic Packaging, vol. 138 no. 2, pp. 021002-1-021002-9, June 2016.

Hamasha, Sa'd, Evans, John L., Bozack, Michael, and Johnson, Wayne, "Long-Term Isothermally Aged Concerns for SAC Lead-Free Solder in Harsh Environment Applications," Pan Pacific Symposium 2018 Proceedings , Kamuela, HI, Feb. 5-8, 2018, pp. xx-xx.

Hamasha, Sa'd, Su, Sinan, Akkara, Francy, Dawahdeh, Ahmad, Borgesen, Peter, and Qasaimeh, Awni, "Solder Joint Reliability in Isothermal Varying Load Cycling," 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 30-June 2, 2017, pp. 1331-1336.

Hamasha, Sa'd, Wentlent, Luke, and Borgesen, Peter, "Statistical Variations of Solder Joint Fatigue Life Under Realistic Service Conditions," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 5 no. 9, pp. 1284-1291, Sept. 2015.

Hamburg. Lisa, "EC Trade Department Seeks WEEE Comments," Circuits Assembly, vol. 11 no. 10, pp. 14, Oct. 2000.

Hamdana, Gerry, Sudkamp, Tobias, Descoins, Marion, Mangelinck, Dominique, Caccamo, Lorenzo, Bertke, Maik, Wasisto, Hutomo Suryo, Bracht, Hartmut, and Peiner, Erwin, "Towards fabrication of 3D isotopically modulated vertical silicon nanowires in selective areas by nanosphere lithography," Microelectronic Engineering, vol. 179, pp. 74-82, July 5, 2017.

Hamdi, Abderrahmane, Amri, Chohdi, Ouertani, Rachid, and Ezzaouia, Hatem, "Effect of etching time on morphological, optical and structural properties of silicon nanowire arrays etched on multi-crystalline silicon wafer," Journal of Materials Science: Materials in Electronics, vol. 28 no. 6, pp. 4807-4813, Mar. 2017.

Hamdou, Bacel, Kimling, Johannes, Dorn, August, Pippel, Eckhard, Rostek, Raimar, Woias Peter, and Nielsch, Kornelius, "Thermoelectric Characterization of Bismuth Telluride Nanowires, Synthesized Via Catalytic Growth and Post-Annealing," Advanced Materials, vol. 25 no. 2, pp. 239-244, Jan. 11, 2013.

Hamid, Mohd Foad Abdul, and Basaran, Cemal, "Low Temperature Electromigration and Thermomigration in Lead-Free Solder Joints," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Hamidinezhad, Habib, Wahab, Yussof, Othaman, Zulkafli, and Ismail, Abd Khamim, "Influence of growth time on morphology and structural properties of silicon nanowires grown by VHF-PECVD," Journal of Crystal Growth, vol. 332 no. 1, pp. 7-11, Oct. 1, 2011.

Hamidinezhad, Habib, Wahab, Yussof, and Othaman, Zulkafli, "Ultra-sharp pointed tip Si nanowires produced by very high frequency plasma enhanced chemical vapor deposition via VLS mechanism," Journal of Materials Science, vol. 46 no. 15, pp. 5085-5089, Aug. 2011.

Hamidinezhad, Habib, Ashkarran, Ali Akbar, and Abdul-Malek, Zulkurnain, "Vertically-tapered silicon nanowire arrays prepared by plasma enhanced chemical vapor deposition: Synthesis, structural characterization and photoluminescence," Materials Science in Semiconductor Processing , vol. 27, pp. 26-32, Nov. 2014.

Hamilton, Craig, Moreno, Mario, Mendez, Ramon, Soto, German, Herrera, Jessica, Ng, Teng Hoon, Fangkangwanwong, Juthathip, Kelly, Matthew, and Bielick, Jim, "A Study of Alternative Lead Free Wave Alloys: From Process Yield to Reliability," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S33:01.

Hamilton, Craig, Moreno, Mario, Mendez, Ramon, Soto, German, Herrera, Jessica, Ng, Teng Hoon, Fangkangwanwong, Juthathip, Kelly, Matthew, and Bielick, Jim, "A Study of Alternative Lead Free Wave Alloys: From Process Yield to Reliability," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. xx-xx.

Hamilton, Craig, "A Study of Copper Dissolution during Pb-free PTH Rework," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Hamilton, Craig, Snugovsky, Polina, and Kelly, Matthew, "A Study of Copper Dissolution During Lead Free PTH Rework Using a Thermally Massive Test Vehicle," 2006 SMTA International Conference Proceedings , Rosemont, IL, Sept. 24-28, 2006, pp. 177-182.

Hamilton, Craig, Kelly, Matthew, and Snugovsky, Polina, "A Study of Copper Dissolution During Pb-Free PTH Rework Using a Thermally Massive Test Vehicle," Circuits Assembly, vol. 18 no. 5, pp. 24, 26-29, 39, May 2007.

Hamilton, Craig, and Kelly, Matthew, "A Study of the Process Performance of Alternative Lead Free Wave Alloys," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Hamilton, Craig, Snugovsky, Polina, Moreno, Mario, Ng, Teng Hoon, Fangkangwanwong, Juthathip, Kelly, Matthew, and Cole, Marie, "Does Copper Dissolution Impact Through-Hole Solder Joint Reliability?," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 515-525.

Hamilton, Craig, Kelly, Matthew, and Snugovsky, Polina, "Effects of SAC Alloy Copper Dissolution Rates on PTH Processes," Circuits Assembly, vol. 18 no. 6, pp. 34, 37, 49-51, June 2007.

Hamilton, Craig, Snugovsky, Polina, and Kelly, Matthew, "Have High Cu Dissolution Rates of SAC305/405 Alloys Forced a Change in the Lead Free Alloy Used During PTH Processes?," 2007 Pan Pacific Microelectronics Symposium & Exhibit, Maui, HI, Jan. 30-Feb. 1, 2007, pp. xx-xx.

Hamilton, Craig, Snugovsky, Polina, and Kelly, Matthew, "Have High Cu Dissolution Rates of SAC305/405 Alloys Forced a Change in the Lead Free Alloy Used During PTH Processes?," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Hamilton, Craig, Snugovsky, Polina, and Kelly, Mathew, "Have High Cu Dissolution Rates of SAC 305/405 Alloys Forced a Change in the Lead Free Alloy Used During PTH Processes?," Lead-Free Magazine .

Hamilton, Craig, McMahon, John, Traya, Jose, Kang, Wang Yong, Wei, Khoo Kok, Kelly, Matthew, and Cole, Marie, "High Complexity Lead-Free Wave and Rework: The Effects of Material, Process and Board Design on Barrel Fill," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 535-547.

Hamilton, Craig, Snugovsky, Polina, Ng, Teng Hoon, Fangkangwanwong, Juthathip, Moreno, Mario, Kelly, Matthew, and Bielick, Jim, "Reliability Assessment of Alternative Lead-Free Alloys Used During Wave and Rework," Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb. 10-12, 2009, pp. 236-247.

Hamilton, Craig, Snugovsky, Polina, Ng, Teng Hoon, Fangkangwanwong, Juthathip, Moreno, Mario, Kelly, Matthew, and Bielick, Jim, "Reliability Assessment of Alternative Lead-Free Alloys Used during Wave and Rework," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

Hamilton, Phil, and Holmes, Andrew, "LEAD-FREE flip chip bumping," Electronics Manufacture and Test , vol. xx no. xx, pp. xx-xx, Feb. 1999.

Hamlaoui, Y., Tifouti, L., and Pedraza, F., "Corrosion behaviour of molybdate-phosphate-silicate coatings on galvanized steel," Corrosion Science, vol. xx no. x, pp. xx-xx, xxxx.

Hammad, A. E., and Ragab, M., "Advancement solidification microstructure and mechanical properties of Sn-2.0Ag-0.5Cu alloy by applying a rotary magnetic field," Journal of Materials Science: Materials in Electronics, vol. 30 no. 20, pp. 18838-18847, Oct. 2019.

Hammad, A. E., "Enhancing the ductility and mechanical behavior of Sn-1.0Ag-0.5Cu leadfree solder by adding trace amount of elements Ni and Sb," Microelectronics Reliability, vol. 87, pp. 133-141, Aug. 2018.

Hammad, A. E., and Ibrahiem, A. A., "Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles," Microelectronics Reliability, vol. 75, pp. 187-194, Aug. 2017.

Hammad, A. E., and El-Taher, A. M., "Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni," Journal of Electronic Materials, vol. 43 no. 11, pp. 4146-4157, Nov. 2014.

Hammerschmidt, Christoph, "Competition essential for recycling cost control," EE Times Europe , July 20, 2006.

Hammerschmidt, Christoph, "Component costs curb potential power savings," EE Times Europe , vol. xx no. xx, pp. xx-xx, June 4, 2007.

Hammerschmidt, Christoph, "UN report complains of low electronics recycling rates," EE Times Europe, vol. xx no. xx, pp. xx-xx, Nov. 21, 2007.

Hammerschmidt, Christoph, "UN seeks to set limits on electronics waste," EE Times Europe , vol. xx no. xx, pp. xx-xx, Mar. 20, 2007.

Hammerschmidt, Christoph, "UN study: EU falls behind e-waste recycling targets," EE Times - Asia, vol. xx no. xx, pp. xx-xx, Nov. 26, 2007.

Hammond, David, and Beullens, Patrick, "Closed-loop supply chain network equilibrium under legislation," European Journal of Operational Research, vol. 183 no. 2, pp. 895-908, Dec. 1, 2007.

Hampshire, Bill, and Hymes. Les, "Shaving Tin Whiskers," Circuits Assembly, vol. 11 no. 9, pp. 50,52,54, Sept. 2000.

Hampshire, W. B., "Some Problems in Switching to Lead-free Solders," Soldering & Surface Mount Technology, vol. 9 no. 1, pp. 11-12, 1997.

Hampshire, W. B., "The Search for Lead-free Solders," Soldering & Surface Mount Technology, vol. 5 no. 2, pp. 49-52, 1993.

Hampshire, William B., "Some Problems in Switching to Lead-Free Solders," Proceedings of the Technical Program NEPCON West '96, Volume 1, Anaheim, CA, Feb. 25-29, 1996, pp. 167-173.

Hampshire, William B., "The Search for Lead-free Solders," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume II , San Jose, CA, Sept. 1-3, 1992, pp. 729-736.

Han, Bangyao, Sun, Fenglian, Li, Tianhui, and Liu, Yang, "Microstructure evolution of Au/SnSb-CuNiAg/(Au)Ni during high temperature aging," Soldering & Surface Mount Technology, vol. 32 no. 2, pp. 57-64, 2020.

Han, Bangyao, Sun, Fenglian, Li, Tianhui, and Liu, Yang, "Shear strength, fracture mechanism and plastic performance of Cu/Sn5Sb-xCuNiAg/Cu solder joints during thermal aging," Journal of Materials Science: Materials in Electronics, vol. 30 no. 20, pp. 18342-18349, Oct. 2019.

Han, Beibei, Yoon, Yong-Jin, Hamidullah, Muhammad, Tsu-Hui Angel, Lin, and Park, Woo-Tae, "Silicon nanowire-based ring-shaped tri-axial force sensor for smart integration on guidewire," Journal of Micromechanics and Microengineering, vol. 24 no. 6, pp. 065002-1-065002-12, June 2014.

Han, Changwoon, and Song, Byeongsuk, "Development of Life Prediction Model for Lead-free Solder at Chip Resistor," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 781-786.

Han, Changwoon, Oh, Chul-Min, and Hong, Won-Sik, "Prognostics Model Development of BGA Assembly Under Vibration Environment," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 8, pp. 1329-1334, Aug. 2012.

Han, Choi, Eunteak, Jung, Sojung, Lee, Junghwan, Bang, and Junki, Kim, "Solder Joint Structure and Reliability of Board Level BGA Package Using No-Clean Curable Solder Paste," 2013 IEEE 15th Electronics Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp. 193-196.

Han, Chunfen, Liu, Qi, and Ivey, Douglas G., "Electrochemical composite deposition of Sn-Ag-Cu alloys," Materials Science and Engineering B: Solid-State Materials for Advanced Technology , vol. 164 no. 3, pp. 172-179, Oct. 25, 2009.

Han, Chunfen, Liu, Qi, and Ivey, Douglas G., "Electrodeposition of Sn-0.7 wt% Cu Eutectic Alloys from Chloride-Citrate Solutions," Plating and Surface Finishing, vol. 95 no. 8, pp. 21-29, Aug. 2008.

Han, Chunfen, Liu, Qi, and Ivey, Douglas G., "Interfacial Reactions Between Electrodeposited Sn-Cu, Sn-Ag-Cu Solders and Cu, Ni Substrates," Journal of Microelectronics and Electronic Packaging , vol. 7, pp. 48-57, 2010.

Han, Chunfen, Liu, Qi, and Ivey, Douglas G., "Kinetics of Sn electrodeposition from Sn(II)-citrate solutions," Electrochimica Acta, vol. 53 no. 28, pp. 8332-8340, Nov. 30, 2008.

Han, Chunfen, Liu, Qi, and Ivey, Douglas G., "Nucleation of Sn and Sn-Cu alloys on Pt during electrodeposition from Sn-citrate and Sn-Cu-citrate solutions," Electrochimica Acta, vol. 54 no. 12, pp. 3419-3427, Apr. 30, 2009.

Han, Duy Le, Shen, Yu-An, Jin, Sanghun, and Nishikawa, Hiroshi, "Microstructure and mechanical properties of the In-48Sn-xAg low-temperature alloy," Journal of Materials Science, vol. 55 no. 24, pp. 10824-10832, Aug. 2020.

Han, H., Sohn, Y. C., and Yu, Jin, "Interfacial Reactions between CuxNiyAlloy Underbump Metallurgy and Sn-Ag-zCu Solders," Journal of Electronic Materials, vol. 36 no. 5, pp. 578-586, May 2007.

Han, J., Guo, F., and Liu, J. P., "Early stages of localized recrystallization in Pb-free BGA solder joints subjected to thermomechanical stress," Journal of Alloys and Compounds , vol. 704, pp. 574-584, May 15, 2017.

Han, J., Guo, F., and Liu, J. P., "Recrystallization induced by subgrain rotation in Pb-free BGA solder joints under thermomechanical stress," Journal of Alloys and Compounds, vol. 698, pp. 706-713, Mar. 25, 2017.

Han, Jang Won, Kim, Nam-Seog, Kim, Min-Il, and Lee, Wang-Jae, "Pb-Free Memory Module with Sn-Bi Lead Finish and Sn-Ag-Cu solder Paste," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Han, Jing, Sun, Jian, Wen, Tingyu, and Guo, Fu, "Analysis of continuous recrystallization (sub)grain rotation behavior in Pb-free solder bumps under a 0.1 um/s shear rate," Journal of Materials Science: Materials in Electronics, vol. 29 no. 13, pp. 10992-10999, July 2018.

Han, Jing, Guo, Fu, and Liu, Jianping, "Effects of anisotropy of tin on grain orientation evolution in Pb-free solder joints under thermomechanical stress," Journal of Materials Science: Materials in Electronics, vol. 28 no. 9, pp. 6572-6582, May 2017.

Han, Jing, Wang, Yan, Tan, Shihai, and Guo, Fu, "Effects of Grain Orientation on Cu6Sn5 Growth Behavior in Cu6Sn5-Reinforced Composite Solder Joints During Electromigration," Journal of Electronic Materials, vol. 47 no. 2, pp. 1705-1712, Feb. 2018.

Han, Jing, and Guo, Fu, "Effects of impurities on double twinning nucleation and grain refinement of Sn-based solder joints," Journal of Materials Science: Materials in Electronics, vol. 29 no. 10, pp. 8031-8038, May 2018.

Han, Jing, and Guo, Fu, "Nucleation and electromigration-induced grain rotation in an SABI333 solder joint," Journal of Materials Science, vol. 53 no. 8, pp. 6230-6238, Apr. 2018.

Han, Jing, Gu, Penghao, Ma, Limin, Guo, Fu, and Liu, Jianping, "Recrystallization Behavior in SAC305 and SAC305 + 3.0POSS Solder Joints Under Thermal Shock," Journal of Electronic Materials, vol. 47 no. 4, pp. 2479-2487, Apr. 2018.

Han, Jing, Sun, Jian, and Guo, Fu, "Recrystallized grain rotation behavior in a Pb-free BGA solder joint under electron current stress," Journal of Materials Science: Materials in Electronics, vol. 29 no. 8, pp. 6266-6273, Apr. 2018.

Han, Jing, Chen, Hongtao, Li, Mingyu, and Wang, Chunqing, "Shear Deformation Behaviors of Sn3.5Ag Lead-free Solder Samples," Journal of Materials Science and Technology, vol. 29 no. 5, pp. 471-479, May 2013.

Han, Jing, Tan, Shihai, and Guo, Fu, "Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint During Thermal Shock," Journal of Electronic Materials, vol. 45 no. 12, pp. 6086-6094, Dec. 2016.

Han, Jing, Tan, Shihai, and Guo, Fu, "Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock," Journal of Electronic Materials, vol. 47 no. 1, pp. 124-132, Jan. 2018.

Han, Li-shuai, Huang, Chun-yue, Yin, Rui, Ying, Liang, Huang, Gen-xin, and Li, Tian-ming, "Finite element analysis of micro-scale CSP solder joint in 3D packaging under random vibration," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 632-638.

Han, S. W., Chang, K. H., Han, J. G., Cho, I. J., Kim, J. M., Choi, M. G., Kim, Y. T., and Shin, Y. E., "Reliability evaluation of QFP solder joint using Sn-8Zn-3Bi solder paste during the thermal shock test," Materials Science Forum, vol. 580-582, pp. 247-250, 2008.

Han, Sheng, Chen, Hong-Ying, Chen, Chiu-Chieh, Yuan, Ta-Nien, and Shih, Han C., "Characterization of Ni nanowires after annealing," Materials Letters , vol. 61 no. 4-5, pp. 1105-1108, Feb. 2007.

Han, Sungwon, Osterman, Michael, and Pecht, Michael G., "Electrical Shorting Propensity of Tin Whiskers," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 3, pp. 205-211, July 2010.

Han, Sungwon, Osterman, Michael, Meschter, Stephan, and Pecht, Michael, "Evaluation of Effectiveness of Conformal Coatings as Tin Whisker Mitigation," Journal of Electronic Materials, vol. 41 no. 9, pp. 2508-2518, Sept. 2012.

Han, Sungwon, Osterman, Michael, and Pecht, Michael, "Likelihood of Metal Vapor Arc by Tin Whiskers," Surface Mount Technology (SMT), vol. 27 no. 8, pp. 48-50,52,54,56, Aug. 2012.

Han, Sung-Won, Kim, Kyung-Seob, Yu, Chung-Hee, Osterman, Michael, and Pecht, Michael, "Observations of the Spontaneous Growth of Tin Whiskers in Various Reliability Conditions," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1484-1490.

Han, Xiang-Lei, Larrieu, Guilhem, Fazzini, Pier-Francesco, and Dubois, Emmanuel, "Realization of ultra dense arrays of vertical silicon nanowires with defect free surface and perfect anisotropy using a top-down approach," Microelectronic Engineering, vol. 88 no. 8, pp. 2622-2624, Aug. 2011.

Han, Xiaodong, Zheng, Kun, Zhang, YueFei, Zhang, Xiaona, Zhang, Ze, and Wang, Zhong Lin, "Low-Temperature In Situ Large-Strain Plasticity of Silicon Nanowires," Advanced Materials, vol. 19 no. 16, pp. 2112-2118, Aug. 2007.

Han, Xu, Li, Xiaoyan, Yao, Peng, and Chen, Dalong, "Interfacial Microstructure Evolution for Cu/Cu3Sn/Cu Solder Joints during Ultrasonic-Assisted TLP Soldering Process," 2019 IEEE 21st Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 4-6, 2019, pp. 355-359.

Han, Y. D., Jing, H. Y., Nai, S. M. L., Tan, C. M., Wei, J., Xu, L. Y., and Zhang, S. R., "A New Creep Model for SnAgCu Lead-Free Composite Solders: Incorporating Back Stress," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 689-695.

Han, Y. D., Jing, H. Y., Nai, S. M. L., Xu, L. Y., Tan, C. M., and Wei, J., "Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes," Journal of Materials Science: Materials in Electronics, vol. 23 no. 5, pp. 1108-1115, May 2012.

Han, Y. D., Nai, S. M. L., Jing, H. Y., Xu, L. Y., Tan, C. M., and Wei, J., "Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes," Journal of Materials Science: Materials in Electronics, vol. 22 no. 3, pp. 315-322, Mar. 2011.

Han, Y. D., Jing, H. Y., Nai, S. M. L., Xu, L. Y., Tan, C. M., and Wei, J., "Effect of Ni-Coated Carbon Nanotubes on Interfacial Intermetallic Layer Growth," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 292-295.

Han, Y. D., Jing, H. Y., Nai, S. M. L., Xu, L. Y., Tan, C. M., and Wei, J., "Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints," Journal of Electronic Materials , vol. 41 no. 9, pp. 2478-2486, Sept. 2012.

Han, Y. D., Chen, L., Jing, H. Y., Nai, S. M. L., Wei, J., and Xu, L. Y., "Effect of Ni-Coated Carbon Nanotubes on the Corrosion Behavior of Sn-Ag-Cu Solder," Journal of Electronic Materials, vol. 42 no. 12, pp. 3559-3566, Dec. 2013.

Han, Y. D., Tan, C. M., Nai, S. M. L., Xu, L. Y., Jing, H. Y., and Wei, J., "Effect of Ni-Coated Carbon Nanotubes on the Microstructure and Properties of a Sn-Ag-Cu Solder," 2010 Proceedings 60th Electronic Components and Technology Conference , Las Vegas, NV, June 1-4, 2010, pp. 979-984.

Han, Y. D., Jing, H. Y., Nai, S. M. L., Xu, L. Y., Tan, C. M., and Wei, J., "Indentation Creep and Hardness of a Sn-Ag-Cu Solder Reinforced with Ni-Coated Carbon Nanotubes," 2010 IEEE 3rd International Nanoelectronics Conference, Hong Kong, China, Jan. 3-8, 2010, pp. 219-221.

Han, Y. D., Jing, H. Y., Nai, S. M. L., Xu, L. Y., Tan, C. M., and Wei, J., "Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn-Ag-Cu solder joints during thermal cycling," Intermetallics, vol. 31, pp. 72-78, Dec. 2012.

Han, Y. D., Gao, Y., Zhang, S. T., Jing, H. Y., Wei, J., Zhao, L., and Xu, L. Y., "Study of mechanical properties of Ag nanoparticle-modified graphene/Sn-Ag-Cu solders by nanoindentation," Materials Science and Engineering: A, Structural Materials, vol. 761, pp. 138051-1-138051-13, Aug. 5, 2019. https://doi.org/10.1016/j.msea.2019.138051

Han, Y. D., Jing, H. Y., Nai, S. M. L., Xu, L. Y., Tan, C. M., and Wei, J., "Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder," Journal of Electronic Materials, vol. 39 no. 2, pp. 223-229, Feb. 2010.

Han, Yankang, Zhang, Baotan, Zhu, Pengli, Liu, Qianqian, Hu, Yougen, Sun, Rong, and Wong, Chingping, "Preparation of highly conductive adhesives by insitu incorporation of silver nanoparticles," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 434-438.

Han, Yilong, Xue, Songbai, Yang, Jinlong, Long, Weimin, and Zhang, Qingke, "Effects of trace amount praseodymium and neodymium on microstructure and mechanical properties of Sn-0.3Ag-0.7Cu-0.5Ga solder," Journal of Materials Science: Materials in Electronics, vol. xx no. xx, pp. xx-xx, xxxx.

Han, Yongdian, Jing, Hongyang, Xu, Lianyong, and Wei, Jun, "Optimal Design of SnAgCu-CNT Solder Lap-shear Specimen under Thermal Cycles with FEM," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Han, Yongjiu, Lin, Fei, Ju, Guokui, and Wei, Xicheng, "Effect of 3.0wt. %Bi and 0.05wt. %Cr Additions on the Microstructure and Tensile Strength of the Sn3Ag0.5Cu/Cu Solder Joint," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 208-212.

Han, Zong-jie, Xue, Song-bai, Wang, Jian-xin, Zhang, Xin, Zhang, Liang, Yu, Sheng-lin, and Wang, Hui, "Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology," Transactions of Nonferrous Metals Society of China, vol. 18 no. 4, pp. 814-818, Aug. 2008.

Han, Zongjie, Xue, Songbai, Wang, Jianxin, Zhang, Xin, Yu, Shenglin, and Zhang, Liang, "Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders," Journal of Electronic Packaging, vol. 131 no. 2, pp. 021004-1-021004-5, June 2009.

Hanabe, Murali, Canumalla, Sridhar, and Kujala, Ami, "Enhancing Drop Test Efficacy for Product Quality Improvement through Interconnection Shear Tests," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 72-77.

Hanazaki, Kenichi, Tokutomi, Jun-ichiro, Yanagimoto, Jun, and Tsuji, Nobuhiro, "Significant change in mechanical properties of deep drawn ultrafine grained copper wire by additional deformation," Materials Science and Engineering: A, vol. 533, pp. 720-723, Jan. 30, 2012.

Handwerker, C. A., Pedigo, A. E., Sarabol, P., Blendell, J. E., and Su, Peng, "Tin Whisker and Surface Defect Formation on Electroplated Films and Reflowed Joints."

Handwerker, Carol A., Noctor, Donna, and Whitten, Gordon, "Current Assessment of the Reliability of Lead-free Solders," 2000 Lead Free Symposium Conference Proceedings, 2000, pp. xx-xx.

Handwerker, Carol A., "iNEMI Tin Whisker Project: Overview," CARE Innovation 2010, Vienna, Austria, Nov. 8-11, 2010, pp. xx-xx.

Handwerker, Carol, Moon, Kilwon, Kattner, Ursula, Boettinger, Bill, and Williams, Maureen, "Manufacturing and Reliability of SnAgCu: Issues of "Backward" and "Forward" Compatibility," 2006 Lead-Free Technology Workshop, San Antonio, TX, Mar. 12, 2006, pp. xx-xx.

Handwerker, Carol, "Metallurgical Aspect of Reliability," Overcoming the Reliability Challenge: An IPC Summit, Andover, MA, Apr. 15, 2008, pp. xx-xx.

Handwerker, Carol, Bath, Jasbir, Benedetto, Elizabeth, Bradley, Edwin, Gedney, Ron, Siewert, Tom, Snugovsky, Polina, and Sohn, John, "NEMI Lead-Free Assembly Project: Comparison Between PbSn and SnAgCu Reliability and Microstructures," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 664-669.

Handwerker, Carol, "NEMI Pb-Free Solder Projects: Progress and Results," IPC-Frankfurt, Oct. 20, 2003.

Handwerker, Carol, Blendell, John, Wang, Ying, Chen, Wei-Hsun, Sarobol, Pylin, Koppes, John, Pedigo, Aaron, Yoo, Byung-Gil, Phillipi, Bastian, Kraft, Oliver, Dehm, Gerhard, Williams, Maureen, Chatain, Dominique, and Curriotto, Stephano, "Stress Relaxation in Tin Films: Whisker Nucleation and Growth," The Latest Findings on Tin Whiskers in Electronics Webinar, Oct. 29, 2015, pp. xx-xx.

Handwerker, Carol, "Technology Assessment of Lead-Free Electronics," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.

Handwerker, Carol, "Tin Whisker Formation: A Predictive Model Based on Local Microstructure and Grain Boundary Properties," Tin Whisker Group teleconference, Jan. 30, 2013.

Handwerker, Carol, "Transitioning to Pb-Free Assemblies," Circuits Assembly, vol. 16 no. 3, pp. 39, Mar. 2005.

Handwerker, Carol, Pedigo, Aaron, Blendell, John, Williams, Maureen, Moon, Kil-Won, Stafford, Gery, Boettinger, Bill, Munson, Terry, Fritz, Denny, Latta, Gary, and Ganster, Andy, "Whisker to Hillock Transition: Stress Relaxation Mechanisms in Sn, Sn-Cu, and Sn-Pb Films," iNEMI Tin Whisker Workshop, Reno, NV, pp. xx-xx, May 29, 2007.

Handy, S. L., Oduoza, C. F., and Pearson, T., "Theoretical aspects of electrodeposition of decorative chromium from trivalent electrolytes and corrosion rate study of different nickel/chromium coatings," Transactions of the Institute of Metal Finishing, vol. 84 no. 6, pp. 300-308, Nov. 2006.

Hang, Chunjin, Tian, Yanhong, Zhang, Rui, and Yang, Dongsheng, "Phase transformation and grain orientation of Cu-Sn intermetallic compounds during low temperature bonding process," Journal of Materials Science: Materials in Electronics, vol. 24 no. 10, pp. 3905-3913, Oct. 2013.

Hanham, S. D., Heinrich, B., and Arrott, A. S., "Domain structure and the approach to saturation in [111] oriented iron whiskers," Journal of Applied Physics, vol. 50 no. 3, pp. 2146-2148, Mar. 1979.

Hanham, S. D., Heinrich, B., and Arrott, A. S., "Magnetization dependence and temperature dependence of the magnetic anisotropy in iron whiskers near Tc," Journal of Applied Physics, vol. 50 no. 11, pp. 7704-7706, Nov. 1979.

Hani, J. Nashrah, Fadzil, J. Mohd, Farazila, Y., Tadashi, A., Yukio, M., and Hamdi, A. S. Mohd, "The effect of temperature on the formation behavior of reaction layer in Sn-3.0Ag-0.5Cu solder joint with the addition of porous Copper interlayer," Materialwissenschaft und Werkstofftechnik, vol. 48 no. 3-4, pp. 283-289, Apr. 2017.

Hanim, M. A. Azmah, Kamil, N. Muhamad, Wei, Chuan Khang, Dele-Afolabi, T. T., and Azlina, O. Saliza, "Microstructural and shear strength properties of RHA-reinforced Sn-0.7Cu composite solder joints on bare Cu and ENIAg surface finish," Journal of Materials Science: Materials in Electronics, vol. 31 no. 11, pp. 8316-8328, June 2020.

Hanisch, J., Klimm, C., and Rappich, J., "Electropolishing and passivation of silicon nanowires towards hybrid interfaces," Electrochimica Acta, vol. 226, pp. 46-52, Feb. 1, 2017.

Hannapel, Jeff, and Richter, Christian, "Is EPA Playing Dirty With Chromium Data?," Products Finishing, vol. 76 no. 8, pp. 12-15, May 2012.

Hannigan, K., Reid, M., Collins, M. N., Dalton, E., Xu, C., Wright, B., Demirkan, K., Opila, R. L., Reents Jr., W. D., Franey, J. P., Fleming, D. A., and Punch, J., "Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments," Journal of Electronic Materials, vol. 41 no. 3, pp. 611-623, Mar. 2012.

Hannon, David, "EU ruling could cost chemical industry," Purchasing, vol. xx no. xx, pp. xx-xx, Nov. 2, 2006.

Hansal, W. E. G., Halmdienst, M., Hansal, S., Boussaboua, I., and Darchen, A., "Influence of pulse plating parameters on morphology and hardness of pure tin deposit," Transactions of the Institute of Metal Finishing, vol. 86 no. 2, pp. 115-121, Mar. 2008.

Hansen, Mark D., "HexChrom," Professional Safety, vol. 48 no. 1, pp, 40-41, Jan. 2003.

Hanson, A. C., and Inman, G. O., "Limitations of Tin as a Packing Material," Industrial and Engineering Chemistry, vol 31 no. 6, pp. 662-663, 1939.

Hanss, Alexander, and Elger, Gordon, "Residual Free Solder Process for Fluxless Solder Pastes," 2017 21st European Microelectronics and Packaging Conference & Exhibition, Warsaw, Poland, Sept. 10-13, 2017, pp. xx-xx.

Hanss, Alexander, and Elger, Gordon, "Residual free solder process for fluxless solder pastes," Soldering & Surface Mount Technology, vol. 30 no. 2, pp. 118-128, 2018.

Hanss, Alexander, Hutter, Matthias, Trodler, Joerg, and Elger, Gordon, "Solder process for fluxless solder paste applications," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 447-454.

Hanss, Alexander, Liu, E., Schmid, Maximilian, and Elger, Gordon, "The Influence of Voids in Solder Joints on Thermal Performance and Reliability Investigated with Transient Thermal Analysis," 2015 21st International Workshop on Thermal Investigations of ICs and Systems, Paris, France, Sept. 30-Oct. 2, 2015, pp. xx-xx.

Hanyu, Takaaki, x "Optical Constants of Gray Tin Single Crystals from 1.18 to 4.95 eV," Journal of the Physical Society of Japan, vol. 31 no 6, pp. 1738-1747, Dec. 1971.

Hao, H., Tian, J., Shi, Y. W., Lei, Y. P., and Xia, Z. D., "Properties of Sn3.8Ag0.7Cu Solder Alloy with Trace Rare Earth Element Y Additions," Journal of Electronic Materials, vol. 36 no. 7, pp. 766-774, July 2007.

Hao, Hu, Xu, Guangchen, Song, Yonglun, Shi, Yaowu, and Guo, Fu, "A Model for Rapid Tin Whisker Growth on the Surface of ErSn3 Phase," Journal of Electronic Materials, vol. 41 no. 2, pp. 184-189, Feb. 2012.

Hao, Hu, Tian, Jun, Xu, Guangchen, Guo, Fu, Song, Yonglun, and Shi, Yaowu, "Irregular Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0RE Solder Joints," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 793-796.

Hao, Hu, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, and Guo, Fu, "Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging," Journal of Electronic Materials, vol. 37 no. 1, pp. 2-8, Jan. 2008.

Hao, Hu, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, and Guo, Fu, "Oxidization-Induced Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0Er Alloy," Metallurgical and Materials Transactions A, vol. 40 no. 8, pp. 2016-2021, Aug. 2009. https://doi.org/10.1007/s11661-009-9871-8

Hao, Hu, He, Hongwen, and Lu, Yuan, "Study of Tin Whisker Growth Accelerated by Rare Earth Phase and the Mechanism of Tin Whisker Growth," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1120-1126.

Hao, W. N., Chai, G. Z., and Zhou, J., "Damage Constitutive Model and Failure Mechanism of Lead-Free Solder in CBGA Package," Advanced Materials Research, vol. 44-46, pp. 77-84, 2008.

Hao, Zhifeng, Wu, Qingqing, Sun, Ming, Yu, Jian, Guo, Yipeng, and Rao, Yao, "Preparation of water-based no-clean flux for high temperature lead-free solder," Advanced Materials Research, vol. 314-316, pp. 1112-1116, 2011.

Haohuan, Lou, Xin, Qu, Zhaoyi, Chen, Jiaji, Wang, Lee, Taekoo, and Wang, Hui, "Lifetime Assessment of Solder Joints of BGA Package in Board Level Drop Test," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Happonen, Tuomas, Voutilainen, Juha-Veikko, and Fabritius, Tapio, "Reliability Study on Adhesive Interconnections in Flex-to-Flex Printed Electronics Applications Under Environmental Stresses," IEEE Transactions on Device and Materials Reliability, vol. 14 no. 4, pp. 1005-1012, Dec. 2014.

Haque, A., Lim, B. H., Haseeb, A. S. M. A., and Masjuki, H. H., "Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frame," Journal of Materials Science: Materials in Electronics, vol. 23 no. 1, pp. 115-123, Jan. 2012.

Haque, A., Won, Y. S., Lim, B. H., Haseeb, A. S. M. A., and Masjuki, H. H., "Effect of Ni Metallization on Interfacial Reactions and Die Attach Properties of Zn-Al-Mg-Ga High Temperature Lead-free Solder," 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Melaka, Malaysia, Nov. 30-Dec. 2, 2010, pp. xx-xx.

Haque, Shatil, Ng, Mooi Guan, Abrahamse, Gilles, Wall, Frank, Rudaz, Serge, and Martin, Paul S., "Packaging of High-Power LEDs Using Au Studbump Interconnects," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 34-39.

Hara, Masaaki, Matsuda, Kenji, Yamauchi, Wataru, Sakaguchi, Masaaki, Yoshikata, Toshiyuki, Takigawa, Yorinobu, and Higashi, Kenji, "Environmentally Friendly Composite Film of Anodizing and Electrodeposition Coating Having a High Corrosion Resistance on Magnesium Alloy AZ91D," Materials Transactions, vol. 48 no. 12, pp. 3118-3125, Dec. 2007.

Hara, Yoshiko, "Agreement will eliminate lead from solder by '05," EE Times, Dec. 20, 2002.

Hara, Yoshiko, "Multi-region consensus builds on solder without lead," EE Times Europe, Dec. 20, 2002.

Harada, Masahide, Satoh, Ryoohei, Yamada, Osamu, Yabushita, Akira, Itoh, Mitsuko, Netsu, Toshitada, and Terouchi, Toshiro, "A New Ni-W Thin Film Metallization for Solder Interconnections and Design Method of Metallization Thickness," 1997 Proceedings 47th Electronic Components & Technology Conference, San Jose, CA, May 18-21, 1997, pp. 866-874.

Harada, Masahide, and Satch, Ryoohei, "Mechanical Characteristics of 96.5Sn/3.5Ag Solder in Micro-Bonding," 1990 Proceedings 40th Electronic Components & Technology Conference , Las Vegas, NV, May 20-23, 1990, pp. 510-517.

Harada, Takashi, Ogawa, Masashi, Kusumoto, Manabu, and Wabuka, Hiroshi, "Power Integrity Estimation by Use of LSI Power-pin Model Applying Chip-Package-Board Co-design," Electrical Design of Advanced Packaging and Systems Symposium, Seoul, Korea, Dec. 10-12, 2008, pp. 5-8.

Haraguchi, K., Hiruma, K., Hosomi, K., Shirai, M., and Katsuyama, T., "Growth mechanism of planar-type GaAs nanowhiskers," Journal of Vacuum Science & Technology B: Nanotechnology and Microelectronics: Materials, Processing, Measurement and Phenomena, vol. 15 no. 5, pp. 1685-1687, Sept./Oct. 1997.

Haraguchi, K., Katsuyama, T., and Hiruma, K., "Polarization dependence of light emitted from GaAs p-n junctions in quantum wire crystals," Journal of Applied Physics, vol. 75 no. 8, pp. 4220-4225, Apr. 15, 1994.

Harako, S., Kouno, K., Komuro, S., Ohata, A., and Zhao, X., "Synthesis of very long ErSi2 nanowires on Si substrates," Journal of Crystal Growth, vol. 275 no. 1-2, pp. e2263-e2267, Feb. 15, 2005.

Harant, Petr, and Steiner, Frantisek, "Double-sided Preheating Influence on Solderability," 31st International Spring Seminar on Electronics Technology, Budapest, Hungary, May 7-11, 2008, pp. 379-384.

Harant, Petr, Steiner, Frantisek, Stary, Jiri, and Stejskal, Petr, "Influence of special cleaning compounds on PCBs solderability," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 117-120.

Harant, Petr, and Steiner, Frantisek, "Solderability of lead-free surface finished PCB," 30th International Spring Seminar on Electronics Technology, Cluj-Napoca, Romania, May 9-13, 2007, pp. 388-392.

Harbert, Tam, "China flexes environmental muscles," Electronic Business, Sept. 1, 2006.

Harbert, Tam, "Obama and the environment: new policies could produce more electronics regulation, opportunity," Electronic Business, Jan. 26, 2009.

Harbert, Tam, "Unwanted Electronics," Electronic Business, Apr. 1, 2006.

Harcuba, Petr, Janecek, Milos, and Slamova, Margarita, "Intermetallic compounds at the interface between Sn-Cu-(-Ni) solders and Cu interface," International Journal of Materials Research, vol. 100 no. 6, pp. 814-817, June 2009.

Harcuba, Petr, and Janecek, Milos, "Microstructure Changes and Physical Properties of the Intermetallic Compounds Formed at the Interface Between Sn-Cu Solders and a Cu Substrate Due to a Minor Addition of Ni," Journal of Electronic Materials, vol. 39 no. 12, pp. 2553-2557, Dec. 2010.

Hardin, Winn, "RoHS, Machine Vision, and Lessons Learned," Machine Vision Online, Jan. 3, 2008.

Hardin, Winn, "RoHS Part II: Lighten Up on Heavy Metals," Machine Vision Online, Mar. 27, 2007.

Hardinnawirda, K., Akhtar, A. M. Zetty, Aisha, I. Siti Rabiatull, and Mahadzir, I., "Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish," Advanced Materials Research, vol. 1133, pp. 391-395, Jan. 2016.

Hardy, Marcia, "Regulatory Status of the Flame Retardant Tetrabromobisphenol A," Printed Circuits Expo 2000, San Diego, CA, Apr. 2-6, 2000, pp. S16-1-1-S16-1-6.

Hardy, Stephen, "EU to industry: Get the lead out," Lightwave, vol. 22 no. 4, pp. 1, 31-32, APR. 2005.

Hare, Ed, "Failure Analysis of BGAs," SEM Lab, Feb. 21, 2007.

Hare, E. W., Corwin, R., and Riemer, E. K., "Structure and Property Changes During Room Temperature Aging of Bismuth Solders," Proceedings of ASM's 2nd Electronic Packaging: Materials and Processes Conference, Bloomington, MN, Oct. 29-31, 1985, pp. 109-115.

Harif, M. Najib, and Ahmad, Ibrahim, "Mechanical Properties Study of Lead Free Solder Joint Material Used in Semiconductor Packaging Subjected To Thermal Condition ," 2010 International Conference on Electronic Devices, Systems and Applications, Kuala Lumpur, Malaysia, Apr. 11-13, 2010, pp. 331-334.

Harif, Muhammad Najib, Ahmad, Ibraham, and Zaharim, Azami, "The Effects of High Temperature Storage on Lead Free Solder Joint Material Strength Using Pull Test Method," IEEE International Conference on Semiconductor Electronics, Kuala Lumpur, Malasia, Nov. 29-Dec. 1, 2006, pp. 685-689.

Hariharan, Deepak. "Energizing Product Designs with Electrically Conductive Adhesives," Adhesives & Sealants Industry, vol. 16 no. 6, pp. 26-27, June 2009.

Harmand, J. C., Tchernycheva, M., Patriarche, G., Travers, L., Glas, F., and Cirlin, G., "GaAs nanowires formed by Au-assisted molecular beam epitaxy: Effect of growth temperature," Journal of Crystal Growth, vol. 301-302, pp. 853-856, Apr. 2007.

Harpaintner, Alfons, "Whisker Growth and Mitigation," Wurth Elektronik White Paper WPP001, 2016.

Harput, Selcuk, "Fields of application of nickel-plated copper conductor," Wire Journal International, vol. 39 no. 12, pp. 65-68, Dec. 2006.

Harriman, Liz, "PBTs in Products International Materials Restrictions and Progress on Alternatives," NEWMOA Web Conference, Feb. 11, 2003.

Harris, Jonathan, and Matthews, Michael, "Selecting Die Attach Technology for High-Power Applications," Power Electronics Technology, vol. 35 no. 11, pp. 18-20,22-23, Nov. 2009.

Harris, Jonathan, "The Impact of Plated Layer Contamination on Semiconductor Assembly: A Failure Analysis Perspective," Tin Whisker Group teleconference, Oct. 12, 2016.

Harris, Jonathan H., and Rubel, Erich, "The Role of Interfacial Compound Formation on Package Reliability," Advancing Microelectronics, vol. 35, no. 4, pp. 20-27, July/Aug. 2008.

Harris, Jovelle, "Ask the EMPF Helpline!," empfasis, pp. xx-xx, Apr. 2006.

Harris, P. G., and Whitmore, M. A., "Alternative Solders for Electronics Assemblies," Circuit World, vol. 19 no. 2, pp. 25-27, 1993.

Harris, P. G., "Conductive Adhesives: A Critical Review of Progress to Date," Soldering & Surface Mount Technology, vol. 7 no. 2, pp. 19-26, 1995.

Harris, P. G., Whitmore, M. A., Fairweather, B., and Dunn, B. D., "Stripping and Replacement of Damaged Solderable Coatings," Soldering & Surface Mount Technology, vol. 4 no. 3, pp. 21-26, 1992.

Harris, Paul G., Whitmore, M. A., and Hampshire, William B., "An Introduction to the Metallurgy of Soldered Joints," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume I, San Jose, CA, Sept. 1-3, 1992, pp. 445-452.

Harris, Paul, "Interfacial reactions of tin-zinc-bismuth alloys," Soldering & Surface Mount Technology, vol. 11 no. 3, pp. 46-52, 1999.

Harris, Paul G., and Chaggar, Kaldev S., "The role of intermetallic compounds in lead-free soldering," Soldering & Surface Mount Technology, vol. 10 no. 3, pp. 38-52, 1998.

Harris, Todd, Byrd, Kevin, and Badwe, Nilesh, "Root Cause and Solution to Mitigate the Hot Tear Defect Mode in Hybrid SAC-Low Temperature Solder Joints," Proceedings of SMTA International , Rosemont, IL, Sept. 22-26, 2019, pp. 169-174.

Harrison, Jim, "Lead free and RoHS: Do we need to be concerned?," Electronic Products, vol. 48 no. 1, pp. 7, June 2005.

Harrison, M. R., Vincent, J. H., and Steen, H. A. H., "Lead-free reflow soldering for electronics assembly," Soldering & Surface Mount Technology, vol. 13 no. 3, pp. 21-38, 2001.

Harrison, Martin R., and Vincent, James H., "Improved Design Life and Environmentally Aware Manufacturing of Electronics Assemblies by Lead-Free Soldering," IDEALS.

Harscoet, Erwan, and Froelich, Daniel, "Use of LCA to evaluate the environmental benefits of substituting chromic acid anodizing (CAA)," Journal of Cleaner Production, vol. 16 no. 12, pp. 1294-1305, Aug. 2008.

Hart, Dan, Ganjei, John, and Kapadia, Nilesh, "Enabling MSL-1 Capability For QFN And Other Design Leadframe Packages - Part II," 2011 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, Kamuela, HI, Jan. 18-20, 2011, pp. xx-xx.

Hart, Dan, Ganjei, John, and Kapadia, Nilesh, "Enabling MSL-1 Capability for QFN and Other Design Leadframe Packages," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Hart, Dan, Lee, Bruce, and Ganjei, John, "Increasing IC Leadframe Package Reliability," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1209-1213.

Hart, Jeffrey A., Lenway, Stefanie Ann, and Murtha, Thomas, "A History of Field Emission Displays," Sept. 1999.

Hart, Martin, "CCGA - Solder Column Attachment for Absorbing Large CTE Mismatch," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. xx-xx.

Hart, Kathy, Singh, Dipti, Geibig, Jack, Swanson, Mary, and Abrams, Fern, "DfE Study Gives Alternative Finishes the Green Light," Printed Circuit Fabrication, vol. 23 no. 10, pp. 32-34,36, Oct. 2000.

Harter, Stefan, Dohle, Rainer, Reinhardt, Andreas, Gosler, Jorg, and Franke, Jorg, "Reliability Study of Lead-Free Flip-Chips with Solder Bumps Down to 30 um Diameter," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 583-589.

Hartler, C., Moreau, S., Chery, E., Charbonnier, J., Siegert, J., Plihon, A., Assous, M., Mitsche, S., Simic, S., Schrank, F., and Grogger, W., "Intermetallic Compound and Void Kinetics Extraction From Resistance Evolution in Copper Pillars During Electromigration Stress Tests," IEEE Transactions on Device and Materials Reliability, vol. 18 no. 2, pp. 313-320, June 2018.

Hartmann, O., Harris, I. R., Fort, D., King, P. J. C., and Cox, S. F. J., "uSR studies of grey and white tin, a- and b-Sn," Physica B: Condensed Matter, vol. 404 no. 5-7, pp. 884-887, Apr. 15, 2009. https://doi.org/10.1016/j.physb.2008.11.145

Hartmann, U., and Mende, H. H., "Observation of Bloch wall fine structures on iron whiskers by a high-resolution interference contrast technique," Journal of Physics D: Applied Physics, vol. 18 no. 11, pp. 2285-2291, Nov. 14, 1985.

Hartmann, U., and Mende, H. H., "Observation of subdivided 180° Bloch wall configurations on iron whiskers," Journal of Applied Physics, vol. 59 no. 12, pp. 4123-4128, June 15, 1986.

Hartshorne, N. H., "The Linear Velocity of Polymorthic Transformations," Discussions of the Faraday Society, vol. 5, pp. 149-158, 1949.

Harvilchuck, Laurence A., Roggeman, Brian, Aspandiar, Raiyo F., Wade, James M., and Godbole, Gaurav, "Impact of PCB Pad Site Dress Methods on Pad Array Damage," Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb. 10-12, 2009, pp. 204-209.

Harvilchuck, Laurence, Austen, Paul, and Wood, Paul, "Improve Solder Scavenging of Large Area-array Sites," Surface Mount Technology (SMT), vol. 22 no. 8, pp. 21-23, Aug. 2008.

Harvilchuck, Lawrence A., Presunka, Paul I., and Constable, James H., "Laser Ablation of Anisotropic Conductive Adhesive," IEEE Transactions on Electronics Packaging Manufacturing, vol. 23 no. 4, pp. 277-283, Oct. 2000.

Hasan, Ishrat, "Testing and Implementing Lead Free Assembly in Contract Manufacturer Facility," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Hasan, M. M., Sharif, A., and Gafur, M. A., "Effect of Minor Addition of Ni on the Microstructure and Properties of Zn-Based High-Temperature Solder," Journal of Electronic Materials , vol. 49 no. 6, pp. 3990-4001, June 2020.

Hasan, Maksudul, Jamal, Mamun, and Razeeb, Kafil M., "Coaxial NiO/Ni nanowire arrays for high performance pseudocapacitor applications," Electrochimica Acta, vol. 60, pp. 193-200, Jan. 15, 2012.

Hasan, Mohammad Mehedi, Sharif, Ahmed, and Gafur, M. Abdul, "Characteristics of eutectic and near-eutectic Zn-Al alloys as high-temperature lead-free solders," Journal of Materials Science: Materials in Electronics, vol. 31 no. 2, pp. 1691-1702, Jan. 2020.

Hasan, S. M. Kamrul, Fahim, Abdullah, Suhling, Jeffrey C., Hamasha, Sa'd, and Lall, Pradeep, "Evolution of the Mechanical Behavior of Lead Free Solders Exposed to Thermal Cycling," 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 28-31, 2019, pp. 1332-1341.

Hasan, S. M. Kamrul, Fahim, Abdullah, Suhling, Jeffrey C., Hamasha, Sa'd, and Lall, Pradeep, "Mechanical Behavior Evolution of SAC+Bi Lead Free Solder Exposed to Thermal Cycling," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 1180-1190.

Haseeb, A. S. M. A., and Leng, Tay See, "Effects of Co nanoparticle addition to Sn-3.8Ag-0.7Cu solder on interfacial structure after reflow and ageing," Intermetallics, vol. 19 no. 5, pp. 707-712, May 2011.

Haseeb, A. S. M. A., Arafat, M. M., Tay, S. L., and Leong, Y. M., "Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging," Journal of Electronic Materials, vol. 46 no. 10, pp. 5503-5518, Oct. 2017.

Haseeb, A. S. M. A., Leong, Y. M., and Arafat, M. M., "In-situ alloying of Sn-3.5Ag solder during reflow through Zn nanoparticle addition and its effects on interfacial intermetallic layers," Intermetallics, vol. 54, pp. 86-94, Nov. 2014.

Haseeb, A. S. M. A., Chew, C. S., and Johan, Mohd Rafie, "Interfacial reactions between Sn-3.5 Ag solder and Ni-W alloy films," Journal of Materials Science: Materials in Electronics, vol. 22 no. 9, pp. 1372-1377, Sept. 2011.

Hasegawa, Hiroshi, Rahman, Ismail M. M., Egawa, Yuji, Sawai, Hikaru, Begum, Zinnat A., Maki, Teruya, and Mizutani, Satoshi, "Chelant-induced reclamation of indium from the spent liquid crystal display panels with the aid of microwave irradiation," Journal of Hazardous Materials, vol. 254-255, pp. 10-17, June 15, 2013.

Hasegawa, Kiyoshi, Ejiri, Yoshinori, Sakurai, Takehisa, and Tsubomatsu, Yosiaki, "Electroless Ni/Electroless Pd/Immersion Au/Electroless Au (ENEPIGEG) Plating Process for Gold Wire Bonding on Organic Package Substrates," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 854-860.

Hasegawa, Kiyoshi, Takahashi, Akio, Noudou, Takaaki, and Nakaso, Akishi, "Electroless Ni/Pd/Au Plating for Semiconductor Package Substrate," Journal of the Surface Finishing Society of Japan, vol. 57 no. 9, pp. 616-621, 2006.

Hasegawa, Kiyoshi, Takahashi, Akio, Noudou, Takaaki, Nakajima, Sumiko, Takahashi, Akiko, Nomoto, Masahiro, and Nakaso, Akishi, "Electroless Ni-P/Pd/Au Plating for Semiconductor Package Substrate," 2000 SMTA International Conference Proceedings, Chicago, IL, Sept. 24-28, 2000, pp. xx-xx.

Hasegawa, Kiyoshi, Takahashi, Akio, Noudou, Takaaki, and Nakaso, Akishi, "Electroless Ni-P/Pd/Au Plating for Semiconductor Package Substrates," Plating & Surface Finishing, vol. 91 no. 11, pp. 20-25, No. 2004.

Hasegawa, Kiyoshi, Noudou, Takaaki, Takahashi, Akio, and Nakaso, Akishi, "Thermal Aging Reliability of Solder Ball Joint for Semiconductor Package Substrate," 2002 Pan Pacific Symposium Conference Proceedings, Maui, Hawaii, Feb. 5-7, 2002, pp. xx-xx.

Hasegawa, T., and Saka, M., "Diagram of Electromigration Pattern in Eutectic Pb-Sn and Pb-free solders," Key Engineering Materials, vol. 297-300, pp. 837-843, 2005.

Hasegawa, Yasuhiro, Nakamura. Daiki, Murata, Masayuki, Yamamoto, Hiroya, Komine, Takashi, Taguchi, Takashi, and Nakamura, Shinichiro, "Crystal Orientation and Transport Properties of a 633-nm-Diameter Bismuth Nanowire," Journal of Electronic Materials, vol. 40 no. 5, pp. 1005-1009, May 2011.

Hashiba, M., Shinmei, W., and Kajihara, M., "Kinetics of Reactive Diffusion in the (Pd-Cu)/Sn System at Solid-State Temperatures," Journal of Electronic Materials, vol. 43 no. 1, pp. 247-258, Jan. 2014.

Hashiba, M., Shinmei, W., and Kajihara, M., "Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System," Journal of Electronic Materials, vol. 41 no. 1, pp. 32-43, Jan. 2012.

Hashim, Aimi Noorliyana, Salleh, Mohd Arif Anuar Mohd, and Mokhtar, Noor Zaimah Mohd, "Morphology Analysis of Spontaneous Tin (Sn) Whisker Growth on Lead-Free Solder," Materials Science and Engineering, vol. 551, pp. 012095-1-012095-6, 2019.

Hashim, Aimi Noorliyana, and Salleh, Mohd Arif Anuar Mohd, "Spontaneous Tin (Sn) Whisker Growth from Electroplated Tin and Lead-Free Tin Alloys Coatings: A Short Review," Solid State Phenomena, vol. 280, pp. 151-156, Aug. 2018.

Hashim, Aimi Noorliyana, Salleh, Mohd Arif Anuar Mohd, Mokhtar, Noor Zaimah Mohd, and Idris, Shahida, "Tin (Sn) whisker growth from electroplated Sn finished," Materials Science and Engineering, vol. 701, pp. 012005-1-012005-6, 2019.

Hasiguti, R. R., "A Tentative Explanation of the Accelerated Growth of Tin Whiskers," Acta Metallurgica, vol. 3, no. 2, pp. 200-201, Mar. 1955.

Hasiguti, R. R., Yagi, E., Nishiike, U., and Sakai, T., "An Axial Dislocation in Copper Whiskers," Journal of Crystal Growth , vol. 7 no. 1, pp. 117-119, July-Aug. 1970.

Hashimoto, Kaoru, Akiyama, Yutaka, and Otsuka, Kanji, "Transmission Characteristics in GHz Region at the Conductive Adhesive Joints," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 2067-2072.

Hashimoto, Shigeo, Tanabe, Katsuhisa, Kiso, Masayuki, Kitajima, Kota, Someya, Tatsushi, Gudeczaukas, Don, and Milad, George, "Characteristics of EPIG Deposits for Fine Line Applications," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 1052-1057.

Hashimoto, Shigeo, Uchida, Hiroki, Yoshikawa, Kazuki, Shibata, Toshiaki, Nozu, Masahiro, Gudeczauskas, Don, and Orduz, Mario, "CMOS Compatible Electroless Plating Process for Under Bump Metallization," SMTA International Wafer-Level Packaging Conference, San Jose, CA, Oct. 13-16, 2008, pp. xx-xx.

Hashimoto, Shigeo, Kiso, Masayuki, Oda, Yukinori, Otake, Horoshi, Milad, George, and Gudaczauskas, Don, "Direct immersion gold (DIG) as a final finish," Circuit World, vol. 32 no. 1, pp. 16-22, 2006.

Hashimoto, Shigeo, Kiso, Masayuki, and Gudeczauskas, Donald, "Final Surface Treatment for Pkgs and PWBs for Lead Free Soldering," 2000 Surface Finishes Forum Conference Proceedings, May 4, 2000, pp. xx-xx.

Hashimoto, Shigeo, Tanabe, Katsuhisa, Kiso, Masayuki, Hashimoto, Daisake, Gudeczauskas, Don, and Milad, George, "Study of the Deposit Characteristics of Electroless (Autocatalytic) Silver as a Final Finish for LED Package," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 975-979.

Hasiguti, R. R., "A Tentative Explanation of the Accelerated Growth of Tin Whiskers," Acta Metallurgica, vol. 3 no. 2, pp. 200-201, Mar. 1955.

Haslinda, M. S., Abas, Aizat, Ani, F. Che, Jalar, A., Saad, A. A., and Abdullah, M. Z., "Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO2 nano-reinforced lead free solder at different weighted percentages," Microelectronics Reliability, vol. 79, pp. 336-351, Dec. 2017.

Hasn, S., Vavrik, D., Dusek, K., and Pichotka, M., "u-CT investigation of tin whisker growth mechanisms," 21st International Workshop on Radiation Imaging Detectors, Crete, Greece, July 7-12, 2019, pp. xx-xx.

Hasnine, M., Tolla, B., and Karasawa, M., "Effect of Ge addition on wettability, copper dissolution, microstructural and mechanical behavior of SnCu-Ge solder alloy," Journal of Materials Science: Materials in Electronics, vol. 28 no. 21, pp. 16106-16119, Nov. 2017.

Hasnine, M., and Bozack, M. J., "Effects of Ga Additives on the Thermal and Wetting Performance of Sn-0.7Cu Solder," Journal of Electronic Materials, vol. 48 no. 6, pp. 3970-3978, June 2019.

Hasnine, M., and Vahora, N., "Microstructural and mechanical behavior of SnCu-Ge solder alloy subjected to high temperature storage," Journal of Materials Science: Materials in Electronics, vol. 29 no. 11, pp. 8904-8913, June 2018.

Hasnine, M., Tolla, B., and Vahora, N., "Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging," Journal of Electronic Materials, vol. 47 no. 4, pp. 2488-2498, Apr. 2018.

Hasnine, Md, Suhling, Jeffrey C., and Bozack, Michael J., "Effects of high temperature aging on the microstructural evolution and mechanical behavior of SAC305 solder joints using synchrotron X-ray microdiffraction and nanoindentation," Journal of Materials Science: Materials in Electronics, vol. 28 no. 18, pp. 13496-13506, Sept. 2017.

Hasnine, Md, "Effects of In and Sb addition on the thermal and wetting behavior of Sn-3.5Ag solder," Soldering & Surface Mount Technology, vol. 30 no. 4, pp. 233-240, 2018.

Hasnine, Md, Suhling, Jeffrey C., Prorok, Barton C., Bozack, Michael J., and Lall, Pradeep, "Nanomechanical Characterization of SAC Solder Joints - Reduction of Aging Effects using Microalloy Additions," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1574-1585.

Hasnine, Md, Suhling, Jeffrey C., Prorok, Barton C., Bozack, Michael J., and Lall, Pradeep, "Nanomechanical Characterization of SAC305 Solder Joints - Effects of Aging," 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 27-30, 2014, pp. 152-162.

Hasnine, Md, and Wei, Xiang, "New High Reliability Lead-Free Solder Alloy for Electronic Application in Extreme Environment," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 202-210.

Hasnine, Mohammad, Mustafa, Muhannad, Suhling, Jeffrey C., Prorok, Barton C., Bozack, Michael J., and Lall, Pradeep, "Characterization of Aging Effects in Lead Free Solder Joints Using Nanoindentation," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 166-178.

Hasnine, Mohammad, Suhling, Jeffrey C., Prorok, Barton C., Bozack, Michael J., and Lall, Pradeep, "Exploration of Aging Induced Evolution of Solder Joints Using Nanoindentation and Microdiffraction," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 379-394.

Hasnine, Mohammad, Mustafa, Muhannad, Zou, Jing, Suhling, Jeffrey C., Prorok, Barton C., Bozack, Michael J., and Lall, Pradeep, "Nanomechanical Characterization of Aging Effects in Solder Joints in Microelectronic Packaging," Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 1, Burlingame, CA, July 16-18, 2013, pp. V001T07A015-1-V001T07A015-14.

Haspel, D. M., Ashworth, M. A., Wilcox, G. D., Bao, X., and Mortimer, R. J., "The effect of different post-electroplating surface modification treatments on tin whisker growth," Transactions of the IMF, vol. 97 no. 3, pp. 129-139, 2019. https://doi.org/10.1080/00202967.2019.1587263

Haspel, D. M., Ashworth, M. A., Wilcox, G. D., and Bao, X., "The Use of Post-Electroplating Surface Modification Treatments to Mitigate Tin Whisker Growth," 8th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Noordwijk, the Netherlands, May 10-12, 2017, pp. xx-xx.

Haspel, D. M., Ashworth, M. A., Wu, L., Wilcox, G. D., and Mortimer, R. J., "Tin whisker mitigation by means of a post-electroplating electrochemical oxidation treatment," Transactions of the IMF, vol. 93 no. 6, pp. 332-341, 2015. https://doi.org/10.1080/00202967.2015.1117258

Haspel, Dan, Ashworth, Mark, Wilcox, Geoff, and Mortimer, Roger, "The Development of Post-Electroplating Surface Modification Treatments to Mitigate Tin Whisker Growth," 7th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Portsmouth, United Kingdom, Apr. 13-14, 2016, pp. xx-xx.

Hassan, K. M. Rafidh, Alam, Mohammad S., Basit, Munshi, Suhling, Jeffrey C., and Lall, Pradeep, "Experimental Characterization of the Dependence of the Poisson's Ratio of Lead Free Solder on Temperature, Strain Rate, Solidification Profile, and Isothermal Aging," 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 28-31, 2019, pp. 1342-1353.

Hassan, K. M. Rafidh, Alam, Mohammad S., Suhling, Jeffrey C., and Lall, Pradeep, "The Poisson's Ratio of Lead Free Solder - The Often Forgotten but Important Material Property," 2019 IEEE 69th Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2019, pp. 1958-1969.

Hassam, Sherazade, Gambino, Michele, and Bros, Jean Pierre, "Enthalpy of Formation of Liquid Ag-Bi and Ag-Bi-Sn Alloys," Zeitschrift fur Metallkunde, vol. 85 no. 7, pp. 460-471, July 1994.

Hassan, K. M. Rafidh, Alam, Mohammad S., Wu, Jing, Suhling, Jeffrey C., and Lall, Pradeep, "Isothermal Aging Dependent Anand Parameters of SAC305 Lead Free Solder at Extreme High Temperatures," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 1191-1200.

Hassan, K. M. Rafidh, Alam, Mohammad S., Wu, Jing, Suhling, Jeffrey C., and Lall, Pradeep, "Microstructural Evolution of SAC305 BGA Joints during Extreme High Temperature Aging," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 1201-1210.

Hassan, K. M. Rafidh, Alam, Mohammad S., Basit, Munshi, Suhling, Jeffrey C., and Lall, Pradeep, "The Influence of Poisson;s Ratio on the Reliability of SAC Lead Free Solder Joints," 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29-June 1, 2018, pp. 1207-1216.

Hassan, K. M. Rafidh, Alam, Mohammad S., Wu, Jing, Suhling, Jeffrey C., and Lall, Pradeep, "Visualization and Modeling of Microstructural Evolution in SAC305 BGA Joints during Extreme High Temperature Aging," 2020 IEEE 70th Electronic Components and Technology Conference, Lake Buena Vista, AL, May 26-29, 2020, pp. 1894-1903.

Hasslinger, R. v., "Uber eine neue Form von Zinnpest," Monatshefte fur Chemie und verwandte Teile anderer Wissenschaften, vol. 29, pp. 787-790, 1908.

Hata, Hanae, Maruya, Yuuki, and Shohji, Ikuo, "Interfacial Reactions in Sn-57Bi-1Ag Solder Joints with Cu and Au Metallization," Materials Transactions, JIM, vol. 57 no. 6, pp. 887-891, 2016.

Hatakeyama, Tomoyuki, Ishizuka, Masaru, and Nakagawa, Shinji, "Estimation of Maximum Temperature in 3D-Integrated Package by Thermal Network Method," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 68-71.

Hatanaka, Hideji, "Packaging Processes using Flip Chip Bonder and Future Directions of Technology Development," Proceedings of 4th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2002, pp. 434-439.

Hatcher, Brian, "Cleaning the supply chain for RoHS," Electronics Weekly, Nov. 18, 2005.

Hathaway, Matt, "Increasing drawing fluid longevity in copper wiredrawing applications," Wire Journal International, vol. 39 no. 2, pp. 117-121, Feb. 2006.

Haubner, Gerhard, "General recommendations for board assembly of lead-free BGA," Infineon Technologies Technical Note, May 2003.

Hauck, Torsten, and Schmadlak, Ilko, "Vibration Durability of Board Mounted BallGridArrays," 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Wroclaw, Poland, Apr. 14-17, 2013, pp. xx-xx.

Haug, Ralf, Behner, Ulrich, Czaya, Claus-Peter, Jiang, Hongquan, Kotthaus, Stefan, Schuetz, Reiner, and Treutler, Christoph P. O., "Low-Cost Direct Chip Attach: Comparison of SMD Compatible FC Soldering with Anisotropically Conductive Adhesive FC Bonding," IEEE Transactions on Electronics Packaging Manufacturing, vol. 23 no. 1, pp. 12-18, Jan. 2000.

Haun, Maria, "Why Choose Chrome Free Pretreatments?," Appliance Design, vol. 62 no. 2, pp. 16-17, Feb. 2014.

Hauner, F., Jeannot, D., McNeilly, K., and Pinard, J., "Advanced AgSnO2 Contact Materials for the Replacement of AgCdO in High Current Contactors," Proceedings of the Forty-Sixth IEEE Holm Conference on Electrical Contacts, Chicago, IL, Sept. 25-27, 2000, pp. 225-230.

Hau-Riege, Christine, Yau, You-Wen, and Yu, Nick, "Electromigration Characterization of Lead-Free Flip-Chip Bumps for 45nm Technology Node," 2011 IEEE International Reliability Physics Symposium , Monterey, CA, Apr. 10-14, 2011, pp. 5F.3.1-5F.3.4.

Hau-Riege, Christine, and Yau, YouWen, "Electromigration Reliability of Solder Balls," 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 16-19, 2018, pp. xx-xx.

Hau-Riege, Christine, Zang, Ricky, Yau, You-Wen, Yadav, Praveen, Keser, Beth, and Lin, Jong-Kai, "Electromigration Studies of Lead-Free Solder Balls used for Wafer-Level Packaging," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 717-721.

Hau-Riege, Christine, Keser, Beth, Alvarado, Rey, Syed, Ahmer, Yau, YouWen, Bezuk, Steve, and Caffey, Kevin, "The Impact of Different Under Bump Metallurgies and Redistribution Layers on the Electromigration of Solder Balls for Wafer-Level Packaging," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 1173-1178.

Havener, Michael, and Farrell, Robert, "Lead-Free Solder Paste Evaluation," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 740-746.

Havener, Michael, "Lead-Free Wave Solder Flux Evaluation," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 229-233.

Havia, Elina, Montonen, Henri, Bernhardt, Elmar, and Alatalo, Matti, "Comparing SAC and SnCiNi Solders in Lead-Free Wave Soldering Process," 2005.

Havia, Elina, Bernhardt, Elmar, Mikkonen, Timo, Montonen, Henri, and Alatalo, Matti, "Implementation of Lead-Free Wave Soldering Process," 2005.

Havlik, T., Orac, D., Petranikova, M., Miskufova, A., Kukurugya, F., and Takacova, Z., "Leaching of copper and tin from used printed circuit boards after thermal treatment," Journal of Hazardous Materials, vol. 183 no. 1-3, pp. 866-873, Nov. 15, 2010.

Hawke, David, and Albright, D. L., "A Phosphate-Permanganate Conversion Coating for Magnesium," Metal Finishing, vol. 93 no. 10, pp. 34, 36-38, Oct. 1995.

Hawkins, Simon, "Getting Started in Hand Soldering," Nikkei Electronics Asia, pp. xx-xx, Sept. 2001.

Hawkinson, Chad, "A roadmap to environmental regulatory compliance, part II," Green SupplyLine, Dec. 5, 2005.

Hawkinson, Chad, "Roadmap to environmental regulatory compliance," Green SupplyLine , Sept. 19, 2005.

Hawley, John, and Economou, Manthos, "Proposed Curriculum for Environmental Engineers in Electronics," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 81-89.

Hayakawa, K., Sorimachi, M., Tagami, M., and Komuro, H., "Development of eco-friendly electric wires in accordance to the RoHS directive," Proceedings of 2005 International Symposium on Electrical Insulating Materials, Volume 3, Kitakyushu, Japan. June 5-9, 2005, pp. 788-791.

Hayashi, Eiji, Baba, Shinji, Idaka, Shiori, Maeda, Akira, Satoh, Mitsuru, and Kimura, Michitaka, "Realization of Pb-Free FC-BGA Technology on Low-k Device," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 9-13.

Hayashi, Hidetaka, "The Role of the Surfactant during Composite Plating Process," Journal of the Surface Finishing Society of Japan, vol. 60 no. 12, pp. 766-770, 2009.

Hayashi, Tadao, and Ishihama, Akira, "Electrodeposition of Chromium-Iron Alloys from Trivalent Chromium Baths," American Electroplaters' Society 66th Annual Technical Conference, Part 2, Atlanta, GA, June 24-28, 1979, session M-5 pp. xx-xx.

Hayashi, Tadeo, "Research & Developments in Lead-free Solder Plating in Japan," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. 499-515.

Hayashi, Tadao, "Trends in Alloy Plating in Japan," Proceedings of AESF SUR/FIN '99 , Cincinnati, OH, June 21-24, 1999, pp. 727-736.

Hayashi, Tadao, "Trends in Dispersion Coatings in Japan," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 732-751.

Hayashi, Yamato, Inoue, Masahiro, Niihara, Koichi, and Suganuma, Katsuaki, "Eco-fabrications and applications of noble metal nano-particles by ultrasound," 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, Portland, OR, Sept. 12-15, 2004, pp. 63-66.

Hayashi, Yawara, Shohji, Ikuo, Nakata, Yusuke, and Hashimoto, Tomihito, "Development of high reliability lead-free solder joint dispersed IMC pillar," 2015 IEEE 17th Electronics Packaging and Technology Conference, Singapore, Dec. 2-4, 2015, pp. xx-xx.

Hayashi, Yujiro, Setoyama, Daigo, and Seno, Yoshiki, "Scanning Three-Dimensional X-Ray Diffraction Microscopy with a High-Energy Microbeam at SPring-8," Materials Science Forum, vol. 905, pp. 157-164, Aug. 2017.

Hayashida, Yoshitou, Takahashi, Yoshiyuki, Ohno, Takao, and Shohji, Ikuo, "Whisker-Free Pb-Free Solder through Alloying," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 70 no. 3, pp. 220-225, Mar. 2006.

Hayes, Caroline, "Is it a hazard that RoHS is a toothless tiger?," Electronic Product Design, vol. xx no. xx, pp. xx-xx, Feb. 20, 2008.

Hayes, David, "Senju Japan - Lead free solder market overview," TIN World, Apex Special Issue, pp. 8-10, Feb. 2005.

Hayes, S. M., Chawla, N., and Frear, D. R., "Interfacial fracture toughness of Pb-free solders," Microelectronics Reliability, vol. 49 no. 3, pp. 269-287, Mar. 2009.

Hayhurst, Tracy, "'Smart paint' cuts corrosion, hazardous waste," Waste News, vol. xx no. x, pp. xx-xx, Sept. 27, 2004.

Haynes, Richard, "Formulation of Accelerated Stress Tests for Corrosion Failure," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. 589-600.

Haynoski, Chester H., and Troup-Jones, Sue, "To Fuse or Not to Fuse - That is the Question."

Hayward, James, Mui, Y. C., and Gannamani, Ranjit, "Lead Free Project Phase 1: Package Evaluation Plan," AMD.

Hayward, James, "Lead (Pb)-Free Packaging Strategy 2000-2003," AMD, Dec. 2001.

Hazama, Katsuki, Nakamura, Yoshio, and Nittono, Osamu, "Growth of Aluminum Whiskers below the Melting Point of Aluminum," Japanese Journal of Applied Physics, vol. 27 no. 7, pp. 1142-1144, July 1988.

Hazan, Joseph, Coddet, Christian, and Keddam, Michel, "Study of Chromate Coatings on Zinc by means of DC, AC and Gravimetric Methods in Alkaline Electrolyte - Correlation to Humid-Storage Test and to Cr VI Content of the Conversion Film," Corrosion Science, Part 1, vol. 31, pp. 313-318, 1990.

Hazen, Christopher, and Leung, Polly, "Asia-Pacific electronics manufacturers lag in green practices," EE Times Europe, Dec. 18, 2008.

He, A., Liu, Q., and Ivey, D. G., "Development of stable, non-cyanide solutions for electroplating Au-Sn alloy films," Journal of Materials Science: Materials in Electronics, vol. 17, no. xx, pp. 63-70, 2006.

He, A., and Ivey, D. G., "Electrodeposition of Au-Sn Alloys for Lead-free Solders: Au-rich Eutectic and Sn-rich Eutectic Compositions," 2013 IEEE International Symposium on Advanced Packaging Materials, Irvine, CA, Feb. 27-Mar. 1, 2013, pp. 52-68.

He, A., and Ivey, D. G., "Electrodeposition of Sn and Au-Sn alloys from a single non-cyanide electrolyte," Journal of Materials Science: Materials in Electronics , vol. 23 no. 12, pp. 2186-2193, Dec. 2012.

He, A., Liu, Liu, and Ivey, D. G., "Investigation on the Stability of a Au-Sn Electroplating Solution," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 254-267.

He, A., Liu, Q., and Ivey, D. G., "Investigation on the Stability of a Au-Sn Electroplating Solution," Plating and Surface Finishing, vol. 92 no. 2, pp. 30-36, Feb. 2005.

He, A., and Ivey, D. G., "Microstructural study of Sn films electrodeposited on Cu substrates: Sn whiskers and Cu6Sn5 precipitates," Journal of Materials Science, vol. 50 no. 7, pp. 2944-2959, Apr. 2015.

He, Anqiang, Liu, Qi, and Ivey, Douglas G., "Electrodeposition of tin: a simple approach," Journal of Materials Science: Materials in Electronics, vol. 19 no. 6, pp. 553-562, June 2008.

He, Anqiang, Djurfors, Barbara, Akhlaghi, Siamak, and Ivey, Douglas G., "Pulse Plating of Gold-Tin Alloys for Microelectronic and Optoelectronic Applications," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 954-966.

He, Anqiang, Djurfors, Barbara, Akhlaghi, Siamak, and Ivey, Douglas G., "Pulse Plating of Gold-Tin Alloys For Microelectronic & Optoelectronic Applications," Plating & Surface Finishing, vol. 89 no. 11, pp. 48-52, Nov. 2002.

He, Anqiang, Djurfors, Barbara, Aklaghi, Siamak, and Ivey, Douglas G., "Pulse Plating of Gold-Tin Alloys for Microelectronic and Optoelectronic Applications," Lead-Free Magazine, vol. 3, Feb. 2005.

He, Caiying, Liu, Zuyao, Wang, Hongxia, Wang, Lei, Lu, Feng, and Ran, Hongfeng, "Thermo-mechanical Simulation and Optimization Analysis for Warpage-Induced PBGA Solder Joint Failures," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 83-92.

He, David, Xiang, Yu, Chung, D. F., Wang, Paul, Hu, Livia, Dayal, Bobby, Sauter, Karl, Norman, Tim, and Martinez-Vargas, Jorge, "Compliant Pin Interconnect Challenging and Relibaility after January/1/2012 RoHS Exemption," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 650-657.

He, David, Xiang, Yu, Chung, D. F., Wang, Paul, Hu, Livia, Dayal, Bobby, Sauter, Karl, Norman, Tim, and Martinez-Vargas, Jorge, "Compliant Pin Interconnect Challenging and Reliability after RoHS Exemption," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 914-921.

He, Dongming, Roggeman, Brian, Zhou, Eric, Zheng, Jiantao, and Holmes, Pat, "Design and Assembly Process Effects on Lead Free Solder Joint Reliability of Bare Die and Lidded Flip Chip Ball Grid Array Packages," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 83-91.

He, Dongming, Srinivasan, Sriram, Agraharam, Sairam, Chandran, Biju, Mello, Mike, Sinha, Pankaj, and Atluri, Vasu, "Test Vehicle to Characterize Silicon to Organic Flip Chip Package Thermomechanical Interactions," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 712-717.

He, Flora, Fung, Alex, Li, Crystal, Chan, Dennis, Yip, Derek, Yee, Dennis, Cao, Shuzhao, and Cao, Xi, "Studies of Tin Whisker Growth under High External Pressure," 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 25-27, 2017, pp. 102-106.

He, Hongwen, Xu, Guangchen, and Guo, Fu, "Abnormal phase segregation induced by void formation in Cu/Sn-58Bi/Cu solder joint during current stressing," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1407-1410.

He, Hongwen, Zhao, Haiyan, Guo, Fu, and Xu, Guangchen, "Bi Layer Formation at the Anode Interface in Cu/Sn-58Bi/Cu Solder Joints with High Current Density," Journal of Materials Science and Technology , vol. 28 no. 1, pp. 46-52, Jan. 2012.

He, Hongwen, Xu, Guangchen, and Guo, Fu, "Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple," Journal of Materials Science, vol. 44 no. 9, pp. 2089-2096, Apr. 2009.

He, Hongwen, Xu, Guangchen, and Guo, Fu, "Electromigration-enhanced intermetallic growth and phase evolution in Cu/Sn-58Bi/Cu solder joints," Journal of Materials Science, vol. 45 no. 4, pp. 929-935, Feb. 2010.

He, Hongwen, Xu, Guangchen, Hao, Hu, and Guo, Fu, "Electromigration in Lead-Free Sn3.8Ag0.7Cu Solder Reaction Couple," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

He, Hongwen, Xu, Guangchen, and Guo, Fu, "Electromigration-induced Bi-rich whisker growth in Cu/Sn-58Bi/Cu solder joints," Journal of Materials Science, vol. 45 no. 2, pp. 334-340, Jan. 2010.

He, Hongwen, Zhao, Haiyan, Ma, Limin, Xu, Guangchen, and Guo, Fu, "In Situ Measurement of Stress Evolution in Sn-Based Solder Joint under Electromigration Based on X-ray Diffraction Technique," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 768-771.

He, Hongwen, Cao, Liqiang, Zhang, Wenqi, Chen, Mikai, and Zhao, Haiyan, "Numerical simulation of the atomic migration and diffusion during current stressing in the Cu/Sn-58Bi/Cu solder joints," 2013 IEEE 15th Electronics Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp. 452-454.

He, Hongwen, Cao, Liqiang, Hao, Hu, Xu, Guangchen, Ma, Limin, and Guo, Fu, "Thermoelectric coupling effect on the interfacial IMC growth in lead-free solder joint," 2013 IEEE International Symposium on Advanced Packaging Materials, Irvine, CA, Feb. 27-Mar. 1, 2013, pp. 223-229.

He, Hongwen, Cao, Liqiang, Hao, Hu, Ma, Limin, and Guo, Fu, "Whisker growth in the crack region of the cathode interface during current stressing process in lead-free solder joints," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1491-1494.

He, Huang, Huang, Shangyu, Ye, Yongchao, Xiao, Yong, Zhang, Zhihao, Li, Mingyu, and Goodall, Russell, "Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam," Journal of Alloys and Compounds, vol. 845, pp. 156240-1-156240-9, Dec. 10, 2020. https://doi.org/10.1016/j.jallcom.2020.156240

He, Huang, Huang, Shangyu, and Xiao, Yong, "Microstructure evolution and mechanical properties of Cu interconnects bonded with Ni-foam reinforced pure Sn solder," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

He, Jian-Yang, Lin, Kwang-Lung, and Wu, Albert T., "The diminishing of crystal structure of Sn9Zn alloy due to electrical current stressing," Journal of Alloys and Compounds, vol. 619, pp. 372-377, Jan. 15, 2015.

He, Jing, Wang, Rui-xiang, and Liu, Wei, "Recovery of indium and lead from lead bullion," Journal of Central South University of Technology, vol. 15 no. 6, pp. 835-839, Dec. 2008.

He, Jingfeng, He, Yaqun, Ge, WenSheng, Duan, Chenlong, and Wu, Xiaobing, "Research on the Recycling of Valuable Metals from Waste Printed Circuit Boards by Eddy Current Separation," Advanced Materials Research, vol. 113-116, 2010, pp. 367-371.

He, Jun, Morris, W. L., Shaw, M. C., Sridhar, N., and Mather, J. C., "Reliability in Large Area Solder Joint Assemblies and Effects of Thermal Expansion Mismatch and Die Size," Proceedings 1998 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 3582), San Diego, CA, Nov. 1-4, 1998, pp. 583-590.

He, Lifang, Ai, Chengying, Wang, Wenbao, Gao, Ning, Yao, Xiaolin, Tian, Chao, and Zhang, Kui, "An effective three-dimensional surface-enhanced Raman scattering substrate based on oblique Si nanowire arrays decorated with Ag nanoparticles," Journal of Materials Science, vol. 51 no. 8, pp. 3854-3860, Apr. 2016.

He, Liping, Zhu, Fulong, Duan, Ke, Tang, Kai, Liu, Sheng, and Chen, Yanming, "Mechanical response of copper nanowires under torsion," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 318-322.

He, Lunwen, Pan, Shaohui, Wang, L. K., and Zhang, David Wei, "Heel Crack and Lead-Free Soldering Issues Affecting Power Electronics Packages," 2006 IEEE Region 10 Conference, Hong Kong, China, Nov. 14-17, 2006, pp. xx-xx.

He, M., and Acoff, V. L., "Effect of Bi on the Interfacial Reaction between Sn-3.7Ag-xBi Solders and Cu," Journal of Electronic Materials, vol. 37 no. 3, pp. 288-299, Mar. 2008.

He, M., De Leon, N., and Acoff, V. L., "Effect of Bi on the microstructure and tensile behavior of Sn-3.7Ag solders," Soldering & Surface Mount Technology, vol. 22 no. 3, pp. 4-9, 2010.

He, M., and Acoff, V. L., "Effect of Reflow and Thermal Aging on the Microstructure and Microhardness of Sn-3.7Ag-xBi Solder Alloys," Journal of Electronic Materials, vol. 35 no. 12, pp. 2098-2106, Dec. 2006.

He, M., Kumar, A., Yeo, P. T., Qi, G. J., and Chen, Z., "Interfacial reaction between Sn-rich solders and Ni-based metallization," Thin Solid Films, vol. 462-463, pp. 387-394, 2004.

He, M., Chen, Z., and Qi, G. J., "Mechanical Strength of Thermally Aged Sn-3.5Ag/Ni-P Solder Joints," Metallurgical and Materials Transactions, vol. 36A no. 1, pp. 65-75, Jan. 2005.

He, Man, Chen, Shijie, Xia, Weisheng, and Wang, Bo, "Nano-mechanical properties of Sn micro-bumps," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 1054-1057.

He, Man, Wang, Bo, Xia, Weisheng, Chen, Shijie, and Zhu, Jinzhuan, "Research on microstructure and mechanical behaviour of smaller microbumps for high density solder interconnects," Soldering & Surface Mount Technology, vol. 29 no. 3, pp. 156-163, 2017.

He, Maoqi, Fahmi, M. M. E., Mohammad, S. Noor, Jacobs, Randolph N., Salamanca-Riba, Lourdes, Felt, Frederick, Jah, Muzar, Sharma, Ashok, and Lakins, Darryl, "InAs nanowires and whiskers grown by reaction of indium with GaAs," Applied Physics Letters, vol. 82 no. 21, pp. 3749-3751, May 26, 2003.

He, Maoqi, and Mohammad, S. Noor, "Novel chemical-vapor deposition technique for the synthesis of high-quality single-crystal nanowires and nanotubes," Journal of Chemical Physics , vol. 124, pp. 064714-1-064714-7, 2006.

He, Min, Lau, Wee Hua, Qi, Guojun, and Chen, Zhong, "Intermetallic compound formation between Sn-3.5Ag solder and Ni-based metallization during liquid state reaction," Thin Solid Films, vol. 462-463, pp. 376-383, Sept. 2004.

He, Min, Ekpenuma, Sylvester N., and Acoff, Viola L., "Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints," Journal of Electronic Materials, vol. 37 no. 3, pp. 300-306, Mar. 2008.

He, Min, Chen, Zhong, and Qi, Guojun, "Solid state interfacial reaction of Sn-37Pb and Sn-3.5Ag solders with Ni-P under bump metallization," Acta Materialia, vol. 52 no. 7, pp. 2047-2056, Apr. 19, 2004.

He, Ming-jing, Luo, Xiao-jun, Yu, Le-huan, Liu, Juan, Zhang, Xiu-lan, Chen, She-jun, Chen, Da, and Mai, Bi-xian, "Tetrabromobisphenol-A and Hexabromocyclododecane in Birds from an E-Waste Region in South China: Influence of Diet on Diastereoisomer- and Enantiomer-Specific Distribution and Trophodynamics," Environmental Science & Technology, vol. 44 no. 15, pp. 5748-5754, Aug. 1, 2010.

He, Peng, Zhao, Zhi-Li, Qian, Yi-Yu, and Li, Zhong-Suo, "Fillet-lifting mechanism for Sn-Bi-Ag-Cu solder joint in lead-free wave soldering," Zhongguo Youse Jinshu Xuebao/The Chinese Journal of Nonferrous Metals, vol. 16 no. 2, pp. 315-321, Feb. 2006.

He, Shijiang, Murtagian, Gregorio, and Hua, Fay, "Monte Carlo Simulation for Surface Mount Assembly Head and Pillow Defect Prediction," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 144-151.

He, Siliang, and Nishikawa, Hiroshi, "Effect of substrate metallization on the impact strength of Sn-Ag-Cu solder bumps fabricated in a formic acid atmosphere," 2017 International Conference on Electronics Packaging, Yamagata, Japan, Apr. 19-22, 2017, pp. 381-385.

He, Siliang, Gao, Runhua, Li, Jiahui, Shen, Yu-An, and Nishikawa, Hiroshi, "In-situ observation of fluxless soldering of Sn-3.0Ag-0.5Cu/Cu under a formic acid atmosphere," Materials Chemistry and Physics, vol. 239, pp. 122309-1-122309-8, Jan. 1, 2020.

He, Siliang, Gao, Runhua, Shen, Yu-An, Li, Jiahui, and Nishikawa, Hiroshi, "Wettability, interfacial reactions, and impact strength of Sn-3.0Ag-0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere," Journal of Materials Science, vol. 55 no. 7, pp. 3107-3117, Mar. 2020.

He, Sten, Van Houtte, Paul, Pilarczyk, Jan W., and Markowski, Jaroslaw, "FEM aided study on hydrostatic stress in drawing of high carbon steel wires," Wire Journal International, vol. 40 no. 5, pp. 57-61, May 2007.

He, Wenzhi, Li, Guangming, Ma, Xingfa, Wang, Hua, Huang, Juwen, Xu, Min, and Huang, Chunjie, "WEEE recovery strategies and the WEEE treatment status in China," Journal of Hazardous Materials, v 136 no. 3, pp. 502-512, Aug. 25, 2006.

He, Xiao, Li, Shaoyuan, Ma, Wenhui, Ding, Zhao, Yu, Jie, Qin, Bo, Yang, Jia, Zou, YuXin, and Qiu, Jiajia, "A simple and low-cost chemical etching method for controllable fabrication of large-scale kinked silicon nanowires," Materials Letters, vol. 196, pp. 269-272, June 1, 2017.

He, Xiao, Zhou, Liang, and Shen, Jianghua, "A Study for a Typical Leakage Failure of PCBA with No-cleaning Process," 2016 17th International Conference on Electronic Packaging Technology , Wuhan, China, Aug. 16-19, 2016, pp. 53-56.

He, Xiao, Li, Yong, Zhu, Gang, Zhou, Bo, Chen, ZeJian, and Shen, Jianghua, "A Study for Corrosion and False Soldering Failures of Printed Circuit Board Connectors," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

He, Xiao, Qiu, Baojun, and Luo, Daojun, "Comprehensive Study of Various Short Failures on Printed Circuited Board," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 937-943.

He, Xiaofei, Azarian, Michael H., and Pecht, Michael G., "Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

He, Xiaofei, Azarian, Michael H., and Pecht, Michael G., "Effects of Solder Mask on Electrochemical Migration of Tin-Lead and Lead-Free Boards," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S17_02-1-S17_02-14.

He, Xiaofei, Azarian, Michael H., and Pecht, Michael G., "Evaluation of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solder," Journal of Electronic Materials, vol. 40 no. 9, pp. 1921-1936, Sept. 2011.

He, Xu, Yao, Yao, and Keer, Leon M., "A rate and temperature dependent unified creep-plasticity model for high strength steel and solder alloys," Mechanics of Materials. vol. 106, pp. 35-43, Mar. 2017.

He, Xu, and Yao, Yao, "An Advanced Constitutive Model for SnPb and SnAg Solder Materials," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 378-383.

He, Yang, Jiang, Chengyu, Yin, Hengxu, Chenjun, , and Yuan, Weizheng, "Effect of wet etching parameter on the diameter and length of silicon nanowires," Key Engineering Materials, vol. 483, pp. 584-588, June 2011.

He, Ying, Chen, Xu, and Bai, Ning, "Simulation of Sn-0.7Cu Solder with Bodner-Partom Constitutive Model," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 2, 2006, pp. 984-989.

He, Zhao-cheng, Wang, Xue-wei, Kang, Yao-ren, and Yuan, Zhi-hao, "Melting and recrystallizing behaviors of Bi nanowires in the pores of anodic aluminum oxide template by Joule heating," Materials Chemistry and Physics, vol. 166, pp. 31-36, Sept. 15, 2015.

He, Zhenhui, Roth, Holger, and Neuber, Dirk, "High resolution Lead-Free Solder Inspection by X-Ray," NEPCON Shanghai 2007, Shanghai, China, Apr. 24-27, 2007, pp. xx-xx.

Heakal, F. El-Taib, Fekry, A. M., and Ghoneim, A. A., "Corrosion characterization of new tin-silver binary alloys in nitric acid solutions," Corrosion Science, vol. 50 no. 6, pp. 1618-1626, June 2008.

Heaslip, Greg, Punch, Jeff, Rodgers, Bryan, Ryan, Claire, and Reid, Michael, "A Simulated and Experimental Comparison of Lead-free and Tin-lead Solder Interconnect Failure Under Impact Stimuli," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B, San Francisco, CA, July 17-22, 2005, pp. 1283-1291.

Heaslip, Greg M., Punch, Jeff M., Rodgers, Bryan A., Ryan, Claire, and Reid, Michael, "A Stress-Life Methodology for Ball Grid Array Lead-Free and Tin-Lead Solder Interconnects Under Impact Conditions," Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, Apr. 18-20, 2005, pp. 277-284.

Heaton, Christopher E., and McCarthy, Shaun L., "High Cycle Fretting Corrosion Studies on Tin-Coated Contact Materials," Proceedings of the Forty-Seventh IEEE Holm Conference on Electrical Contacts, Montreal, Canada, Sept. 10-12, 2001, pp. 209-214.

Heber, Jochen, and Gaethke, Thomas, "High-speed NiP Process for Connector Applications," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 437-449.

Hedemalm, Per, Eklund, Andreas, Bloom, Robert, and Haggstrom, Joachim, "Brominated Flame Retardants - An Overview of Toxicology and Industrial Aspects," 2000 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, Oct. 8-10, 2000, pp. 203-208.

Hedges, E. S., and Higgs, J. Y., "Preparation of Grey Tin," Nature, vol. 169 no. 4302, pp. 621-622, Apr. 12, 1952. https://doi.org/10.1038/169621b0

Heffer, P., and Lee, B., "Assessing the weathering performance of chromate-free coil coatings," Steel Times International, vol. 29 no. 1, pp. 18-20, Jan. 2005.

Heffer, Paul, and Lee, Bill, "Braving the Elements," Metal Finishing, vol. 103 no. 7/8, pp. 33-34, 60, July/Aug. 2005.

Heffner, Tracy, "ECB Publishes Environmental Part of TBBPA EU Risk Assessment," Printed Circuit Design and Manufacture, vol. 24 no. 2, pp. 10, Feb. 2007.

Heffner, Tracy, "iNEMI Tin Whisker User Group Publishes Updated Set of Recommendations," Printed Circuit Design and Manufacture, vol. 24 no. 2, pp. 10, Feb. 2007.

Heffner, Tracy, "Old Computers Aren't Trash," PCB Update, July 7, 2006.

Hefner, Rebecca E., and Palmer, Mark A., "Experimental Variables Effecting Chain Growth in Conductive Adhesives," Materials Research Society Symposium Proceedings Volume 445, Boston, MA, Dec. 2-5, 1996, pp. 159-165.

Hegarty, John, "The RoHS Directive, Practical Effects of Implementation," RoHS Compliance & LEADOUT Seminar, Dublin, Ireland, Sept. 22, 2005.

Hegde, Pradeep, Whalley, David, and Silberschmidt, Vadim V., "3D Study of Thermal Stresses in Lead-Free Surface Mount Devices," Journal of Thermal Stresses, vol. 31 no. 11, pp. 1039-1055, Nov. 2008.

Hegde, Pradeep, Whalley, David, and Silberschmidt, Vadim V., "Creep Analysis of a Lead-free Surface Mount Device," Proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, London, England, Apr. 15-18, 2007, pp. xx-xx.

Hegde, Pradeep, Whalley, David C., and Silberschmidt, Vadim V., "Creep damage study at powercycling of lead-free surface mount device," Computational Materials Science, vol. 45 no. 3, pp. 638-645, May 2009.

Hegde, Pradeep, Ochana, Andrew R., Whalley, David. C., and Silberschmidt, Vadim. V., "Finite element analysis of lead-free surface mount devices," Computational Materials Science, vol. 43 no. 1, pp. 212-220, July 2008.

Hegde, Pradeep, Whalley, David C., and Silberschmidt, Vadim V., "Size and Microstructure Effects on the Stress-Strain Behaviour of Lead-Free Solder Joints," European Microelectronics and Packaging Conference , Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Hegde, Pradeep, Whalley, David C., and Silberschmidt, Vadim V., "Thermo-mechanical Damage Accumulation during Power Cycling of Lead-Free Surface Mount Solder Joints," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 1081-1089.

Hegde, Rama, Burnette, Terry, and Mawer, Andrew, "Solderability and Oxide Thickness Measurement to Determine Long Term Storage of BGA and QFP," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 169-175.

Heimann, Nancy, "A Cathodically-Deposited Mineral Coating for Replacement of Cr(VI) and CR(III) Treatments of Zinc," 22nd AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 29-Feb. 1, 2001, pp. xx-xx.

Heimsch, Richard, "Lead-free: Screen Printing - Where to from Here?," Surface Mount Technology (SMT), vol. 19 no. 12, pp. 30, 32-33, Dec. 2005.

Heimsch, Richard, "Mass Imaging Responds to Wafer-Scale Packaging Advances," Advanced Packaging, vol. 14 no. 5, pp. 20-23, May 2005.

Heimsch, Richard, "MSD Handling: Desiccants and Nitrogen, Myths and Opportunities," Circuitnet, Aug. 27, 2008.

Heine, Lauren, "Electronics Sustainability: Creating Positive Environmental Impacts," It's Not Easy Being Green, San Jose, CA, Feb. 4-5, 2009, pp. xx-xx.

Heinrich, B., and Arrott, A. S., "Critical Phenomena in the A.C. Susceptibility of Iron Whiskers," Magnetism and Magnetic Materials, AIP Conference Proceedings 24, pp. 287-289, 1974.

Heinrich, B., and Arrott, A. S., "Effects of critical fluctuations on Gilbert damping in iron near Tc," Journal of Applied Physics, vol. 55 no. 6, pp. 2455-2457, Mar. 15, 1984.

Heinrich, B., and Arrott, A. S., "Interactions of Mobile Impurities with a Single Domain Wall in Iron Whiskers," AIP Conference Proceedings, vol. 34, pp. 119-121, 1976.

Heinrich, B., Urquhart, K. B., Dutcher, J. R., Purcell, S. T., Cochran, J. F., Arrott, A. S., Steigerwald, D. A., and Egelhoff Jr., W. F., "Large surface anisotropies in ultrathin films of bcc and fcc Fe(001)," Journal of Applied Physics, vol. 63 no. 8, pp. 3863-3868, Apr. 15, 1988.

Heinrich, B., and Arrott, A. S., "Logarithmic Frequency Dependence of the Phase in the A.C. Susceptibility of Iron Whiskers within Millidegrees of the Critical Temperature," AIP Conference Proceedings, vol. 29, pp. 469-471, 1976.

Heinrich, B., and Arrott, A. S., "Logarithmic Frequency Dependence of the Phase in the A.C. Susceptibility of Iron Whiskers within Millidegrees of the Critical Temperature," AIP Conference Proceedings, vol. 29, pp. 469-471, 1976.

Heinrich, B., Arrott, A. S., and Noakes, J. E., "Size Effects in Critical Phenomena in Iron Whiskers," Journal of Applied Physics, vol. 49 no. 3, pp. 1395-1397, Mar. 1978.

Heinrich, B., Hanham, S. D., and Arrott, A. S., "The magnetic aftereffect in 180 degree magnetically bowed Bloch walls," Journal of Applied Physics, vol. 50 no. 3, pp. 2134-2136, Mar. 1979.

Heinrich, B., and Arrott, A. S., "The Magnetic Memory Function of Iron Whiskers at the Critical Temperature," Magnetism and Magnetic Materials, Pittsburgh, PA, June 15-18, 1976, pp. 378-380,

Heinrich, B., and Arrott, A. S., "The Magnetic Memory Function of Iron Whiskers at the Critical Temperature," AIP Conference Proceedings, vol. 34, pp. 378-380, 1976.

Heitmann, Kerstin, "REACH Requirements for Adhesives Manufacturers and Users," Adhesives & Sealants Industry, vol. 13 no. 11, pp. 30-33, Nov. 1, 2006.

Heitsch, Andrew T., Akhavan, Vahid A., and Korgel, Brian A., "Rapid SFLS Synthesis of Si Nanowires Using Trisilane with In situ Alkyl-Amine Passivation," Chemistry of Materials, vol. 23 no. 11, pp. 2697-2699, June 14, 2011.

Hektor, Johan, Ristinmaa, Matti, Hallberg, Hakan, Hall, Stephen A., and Iyengar, Srinivasan, "Coupled diffusion-deformation multiphase field model for elastoplastic materials applied to the growth of Cu6Sn5," Acta Materialia, vol. 108, pp. 98-109, Apr. 15, 2016.

Hektor, Johan, Marijon, Jean-Baptiste, Ristinmaa, Matti, Hall, Stephen A., Hallberg, Hakan, Iyengar, Srinivasan, Micha, Jean-Sebastien, Robach, Odile, Grennerat, Fanny, and Castelnau, Olivier, "Evidence of 3D strain gradients associated with tin whisker growth," Scripta Materialia, vol. 144, pp. 1-4, Feb. 2018.

Hektor, Johan, Micha, Jean-Sebastien, Hall, Stephen A., Iyengar, Srinivasan, and Ristinmaa, Matti, "Long term evolution of microstructure and stress around tin whiskers investigated using scanning Laue microdiffraction," Acta Materialia , vol. 168, pp. 210-221, Apr. 15, 2019.

Hektor, Johan, Hall, Stephen A., Henningsson, N. Axel, Engqvist, Jonas, Ristinmaa, Matti, Lenrick, Filip, and Wright, Jonathan P., "Scanning 3DXRD Measurement of Grain Growth, Stress, and Formation of Cu6Sn5 around a Tin Whisker during Heat Treatment," Materials, vol. 12 no. 3, pp. 446-1-446-16, Feb. 2019.

Heller, David, and Raby, Jim, "A Practical Investigation Into the Use of No Lead Solders for SMT Reflow," Heller Industries, Jan. 3, 2001.

Helling, D. E., "Lead Whisker Formation in the Gold-Lead System," Journal of Materials Engineering and Performance, vol. 28 no. x, pp. 1936-1941, 2019. https://doi.org/10.1007/s11665-019-03948-w

Helmetag, Katherine, Carlone, Ronald, and Kirsch, Gabriel, "Thermal behavior in solid wiredrawing lubricants," Wire Journal International, vol. 39 no. 1, pp. 67-69, Jan. 2006.

Helmold, N., Iyer, P., and Hillman, C., "Determining the Lifetime of Silver-filled Isotropic Conductive Adhesive (ICA)/Solder-plated Interconnections," IMAPS Advanced Technology Workshop on Optoelectronics Device Packaging and Materials, Bethlehem, PA, Oct. 2003, pp. xx-xx.

Helneder, Johann, Hoyer, Charlotte, Schneegans, Manfred, and Torwesten, Holger, "Evaluation of lead-free SnAg solder ball deposition and reflow processes for flip chip application," Microelectronic Engineering, vol. 82 no. 3-4, pp. 581-586, Dec. 2005.

Helton, Larry, "A New Tin Electroplating Bath for KEMET Multilayer Ceramic Capacitors," Kemet TechTopics, vol. 5 no. 5, pp. 1-2, Nov. 1995.

Helwig, Christopher J., "An On-site Process to Repair IVD Aluminum Coatings," 1999 Aerospace/Airline Plating & Metal Finishing Forum, Jacksonville, FL, Apr. 20-22, 1999, pp. 45-53.

Helwig, Christopher, "Zinc-Tin: A Choice for Replacement of Cadmium For Brush Plating Applications," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. 409-416.

Hemesath, E. R., Lensch-Falk, J. L., and Lauhon, L. J., "Texture analysis of manganese-germanide/germanium nanowire heterostructures by high resolution electron microscopy and diffraction," Journal of Materials Research, vol. 26 no. 17, pp. 2299-2304, Sept. 14, 2011.

Hemmila, Samu, Gao, Anran, Lu, Na, Li, Tie, Wang, Yuelin, and Kallio, Pasi, "Integration of microfluidic sample delivery system on silicon nanowire-based biosensor," Microsystem Technologies, vol. 21 no. 3, pp. 571-580, Mar. 2015.

Hemsley, J. D. C., and Roper, M. E., "Tin-Cobalt Alloy Plating from a Sulphate Electrolyte," Transactions of the Institute of Metal Finishing, vol. 57, pp. 77-80, 1979.

Hemsley, Stewart J., Loh, Samantha, and Hervieux, Brigitte, "Ammonia-free Palladium Nickel Plating Technology," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. 471-478.

Hemsley, Stewart J., and Shiokawa, K., "Application, Process Control and Requirements of Electroless Nickel Immersion Gold (ENIG) in PCB, High Density Microelectronics and Wafer," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Henderson, Donald W., Gosselin, Timothy, Sarkhel, Amit, Kang, Sung K., Choi, Won-Kyoung, Shih, Da-Yuan, Goldsmith, Charles, and Puttlitz, Karl J., "Ag3Sn plate formation in the solidification of near ternary eutectic Sn-Ag-Cu alloys," Journal of Materials Research, vol. 17 no. 11, pp. 2775-2778, Nov. 2002.

Henderson, Donald W., Woods, James J., Gosselin, Timothy A., Bartelo, Jay, King, David E., Korhonen, T. M., Korhonen, M. A., Lehman, L. P., Cotts, E. J., Kang, Sung K., Lauro, Paul, Shih, Da-Yuan, Goldsmith, Charles, and Puttlitz, Karl J., "The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue," Journal of Materials Research , vol. 19 no. 6, pp. 1608-1612, June 2004.

Henderson, Donald W., Borgesen, Peter, Kondos, Pericles, De Sousa, Isabel, Patry, Luc, and Yin, Liang, "What The Electronics Industry Missed For 80 Years ... ... Interfacial Void Formation In Solder Joints With Cu Pad Structures During Thermal Aging," 2006 Lead-Free Technology Workshop, San Antonio, TX, Mar. 12, 2006, pp. xx-xx.

Hendriksen, M. W., Frimpong, F. K., and Ekere, N. N., "Interconnect solutions for advanced area array packaging," Microelectronics International, vol. 16 no. 2, pp. 49-54, 1999.

Henehan, Burke, "Maximizing EOS and ESD immunity in high-performance serial buses," EDN, vol. 52 no. 3, pp. 77-78,80, 82, Feb.1, 2007.

Henning, Carolin, Schumann, Rico, and Bauer, Reinhard, "Influences of SMD Sample Preparation and Examination Conditions on Shear Test Results," 2017 40th International Spring Seminar on Electronics Technology, Sofia, Bulgaria, May 10-14, 2017, pp. xx-xx.

Henshall, Gregory, Healey, Robert, Pandher, Ranjit S., Sweatman, Keith, Howell, Keith, Coyle, Richard, Sack, Thilo, Snugovsky, Polina, Tisdale, Stephen, Hua, Fay, and Fu, Haley, "Addressing Industry Knowledge Gaps Regarding New Pb-Free Solder Alloy Alternatives," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Henshall, Gregory, Healey, Robert, Pandher, Ranjit S., Sweatman, Keith, Howell, Keith, Coyle, Richard, Sack, Thilo, Snugovsky, Polina, Tisdale, Stephen, Hua, Fay, and O'Malley, Grace, "Addressing Opportunities and Risks of Pb-Free Solder Alloy Alternatives," European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Henshall, Gregory, Bath, Jasbir, Sethuraman, Sundar, Geiger, David, Syed, Ahmer, Lee, M. J., Newman, Keith, Hu, Livia, Kim, Dong Hyun, Xie, Weidong, Eagar, Wade, and Waldvogel, Jack, "Comparison of Thermal Fatigue Performance of SAC105 (Sn-1.0Ag-0.5Cu), Sn-3.5Ag, and SAC305 (Sn-3.0Ag-0.5Cu) BGA Components with SAC305 Solder Paste," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Henshall, Gregory, Roubaud, Patrick, Chew, Geary, Prasad, Swaminath, Carson, Flynn, O'Keeffe, Eamon, and Bulwith, Ronald, "Impact of Component Terminal Finish on the Reliability of Pb-Free Solder Joints." 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Henshall, Gregory, Roubaud, Patrick, Chew, Geary, Prasad, Swaminath, Carson, Flynn, Bulwith, Ronald, and O'Keeffe, Eamon, "Impact of Component Terminal Finish on the Reliability of Pb-Free Solder Joints," Journal of SMT, vol. 15 no. 4, pp. 30-39, Oct. 2002.

Henshall, Greg, "Impact of second-level board assembly on tin whisker growth," Green SupplyLine, July 21, 2006.

Henshall, Gregory, Sweatman, Keith, Howell, Keith, Smetana, Joe, Coyle, Richard, Parker, Richard, Tisdale, Stephen, Hua, Fay, Liu, Weiping, Healey, Robert, Pandher, Ranjit S., Daily, Derek, Currie, Mark, and Nguyen, Jennifer, "iNEMI Lead-Free Alloy Alternatives Project Report: Thermal Fatigue Experiments and Alloy Test Requirements," SMTA International Conference , San Diego, CA, Oct. 4-8, 2009, pp. 317-324.

Henshall, Gregory, Healey, Robert, Pandher, Ranjit S., Sweatman, Keith, Howell, Keith, Coyle, Richard, Sack, Thilo, Snugovsky, Polina, Tisdale, Stephen, and Hua, Fay, "iNEMI Pb-Free Alloy Alternatives Project Report: State of the Industry," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 109-122.

Henshall, Gregory, Healy, Robert, Pandher, Ranjit S., Sweatman, Keith, Howell, Keith, Coyle, Richard, Sack, Thilo, Snugovsky, Polina, Tisdale, Stephen, and Hua, Fay, "iNEMI Pb-Free Alloy Alternatives Project Report: State of the Industry," SMTAnews & Journal of Surface Mount Technology, vol. 21 no. 4, pp. 11-23, Oct.-Dec. 2008.

Henshall, Gregory, Miremadi, Jian, Parker, Richard, Coyle, Richard, Smetana, Joe, Nguyen, Jennifer, Liu, Weiping, Sweatman, Keith, Howell, Keith, Pandher, Ranjit S., Daily, Derek, Currie, Mark, Lee, Tae-Kyu, Silk, Julie, Jones, Bill, Tisdale, Stephen, Hua, Fay, Osterman, Michael, Barthel, Bill, Sack, Thilo, Snugovsky, Polina, Syed, Ahmer, Allen, Aileen, Arnold, Joelle, Moore, Donald, Chang, Graver, and Benedetto, Elizabeth, "iNEMI Pb-Free Alloy Characterization Project Report: Part I - Program Goals, Experimental Structure, Alloy Characterization, and Test Protocols for Accelerated Thermal Cycling," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 335-347.

Henshall, Gregory, Sweatman, Keith, Howell, Keith, de Tino, Ursula Marquez, Miremadi, Jian, Parker, Richard, Coyle, Richard, Smetana, Joe, Nguyen, Jennifer, Liu, Weiping, Pandher, Ranjit S., Daily, Derek, Currie, Mark, Lee, Tae-Kyu, Silk, Julie, Jones, Bill, Tisdale, Stephen, Hua, Fay, Osterman, Michael, Sack, Thilo, Snugovsky, Polina, Syed, Ahmer, Allen, Aileen, Arnold, Joelle, Moore, Donald, Chang, Graver, and Benedetto, Elizabeth, "iNEMI Pb-free Alloy Characterization Project Report: Thermal Fatigue Results for Low and No-Ag Alloys," 2012 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Nov. 6-8, 2012, pp. xx-xx.

Henshall, Greg, Tisdale, Stephen, and Sack, Thilo, "iNEMI Pb-Free Alloy Proliferation Project," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Henshall, Gregory, Fehrenbach, Michael, Shea, Chrys, Chu, Quyen, Wable, Girish, Pandher, Ranjit, Hubbard, Ken, Ramakrishna, Gnyaneshwar, and Syed, Ahmer, "Low-Silver BGA Assembly Phase II - Reliability Assessment Fifth Report: Preliminary Thermal Cycling Results," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S23_03-1-S23_03-9.

Henshall, Gregory, Fehrenbach, Michael, Shea, Chrys, Chu, Quyen, Wable, Girish, Pandher, Ranjit, Hubbard, Ken, Ramakrishna, Gnyaneshwar, and Syed, Ahmer, "Low-Silver BGA Assembly, Phase II- Reliability Assessment, Sixth Report: Thermal Cycling Results for Unmixed Joints," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 595-606.

Henshall, Gregory, Fehrenbach, Michael, Shea, Chrys, Chu, Quyen, Wable, Girish, Pandher, Ranjit, Hubbard, Ken, and Syed, Ahmer, "Low-Silver BGA Assembly Phase II - Reliability Assessment Sixth Report: Thermal Cycling Results for Unmixed Joints," South East Asia Technical Training Conference on Electronics Assembly Technologies 2011 Proceedings , Penang, Malaysia, May 19-20, 2011, pp. xx-xx.

Henshall, Gregory, Allen, Aileen, Benedetto, Elizabeth, Holder, Helen, Miremadi, Jian, and Troxel, Kris, "Progress in Developing Industry Standard Test Requirements for Pb-Free Solder Alloys," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S35_01-1-S35_01-35.

Henshall, Gregory A., and Lindsley, Lisa W., "The Development of Lead-Free Printed Circuit Assembly Technology in Hewlett- Packard: Our Strategy and Experience," Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment, Denver, CO, May 7-9, 2001, pp. 296-302.

Heong, Chiew Ying, Haseeb, A. S. M. A., Yingxin, Goh, and Fang, Lee Seen, "Effects of Sn Concentration and Current Density on Sn-Bi Electrodeposition in Additive Free Plating Bath," 2012 4th Asia Symposium on Quality Electronic Design, Kuala Lumpur, Malaysia, July 10-11, 2012, pp. 286-290.

Her, Shiuh-Chuan, Lan, Shien-Chin, Liu, Chun-Yen, and Yao, Bo-Ren, "Numerical Simulation and Experimental Measurement of a Printed Circuit Board Subjected to Drop Test," Key Engineering Materials, vol. 419-420, pp. 37-40, 2010.

Herat, Sunil, "Contamination of Solid Waste from Toxic Materials in Electronics Waste (E-waste)," Journal of Solid Waste Technology and Management, vol. 34 no. 4, pp. 198-203, Nov. 2008.

Herat, Sunil, and Agamuthu, P., "E-waste: a problem or an opportunity? Review of issues, challenges and solutions in Asian countries," Waste Management and Research, vol. no. 11, pp. 1113-1129, Nov. 2012.

Herberholz, Timo, Prihodovsky, Andrey, and Nowottnick, Mathias, "Influence of a New Abnormal (CuNi)6Sn5 / (NiCu)3Sn4 Layer Growth at Temperatures Above 175°C in Tin Silver Based Lead-Free Solder Joints," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 344-353.

Herbert, Fritz, and Dorn, H. C., "Improved Long-Term Stability of Solder Joints Through Rapid Reflowing," Proceedings 2002 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4931), Denver, CO, Sept. 4-6, 2002, pp. 704-707.

Heringhaus, F., and Painter, T. A., "Magnetoresistance of selected Sn- and Pb-based solders at 4.2 K," Materials Letters, vol. 57 no. 4, pp. 787-793, Dec. 2002.

Herkommer, Dominik, Reid, Michael, and Punch, Jeff, "A Comprehensive Shear-Testing Facility for Joint-Scale Solder Samples," International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, Freiburg, Germany, Apr. 20-23, 2008, pp. xx-xx.

Herkommer, Dominik, Reid, Michael, and Punch, Jeff, "A Comprehensive Shear-Testing Facility for Joint-Scale Solder Samples," IEEE Transactions on Components and Packaging Technologies, vol. 32 no. 4, pp. 800-807, Dec. 2009.

Herkommer, Dominik, Punch, Jeff, and Reid, Michael, "A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions," Microelectronics Reliability, vol. 50 no. 1, pp. 116-126, Jan. 2010.

Herkommer, Dominik, Punch, Jeff, and Reid, Michael, "Constitutive Modeling of Joint-Scale SAC305 Solder Shear Samples," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 2, pp. 275-281, Feb. 2013.

Herkommer, Dominik, Reid, Michael, and Punch, Jeff, "In-Situ Creep Observation of Joint-Scale SAC Solder Samples Under Shear Load," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 554-562.

Herkommer, Dominik, Reid, Michael, and Punch, Jeff, "In-Situ Observation of SAC305 Degradation during Isothermal Mechanical Cycling of Joint-Scale Samples," 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, Delft, Netherlands, Apr. 26-29, 2009, pp. xx-xx.

Herkommer, Dominik, Reid, Michael, and Punch, Jeff, "In-Situ Optical Creep Observation and Constitutive Modelling of Joint-Scale SAC Solder Shear Samples," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 506-515.

Herkommer, Dominik, Reid, Michael, and Punch, Jeff, "In Situ Optical Creep Observation of Joint-Scale Tin-Silver-Copper Solder Shear Samples," Journal of Electronic Materials, vol. 38 no. 10, pp. 2085-2095, Oct. 2009.

Herley, P. J., Greer, A. L., and Jones, W., "Hillock formation on copper at room temperature by cleaning in ammonia vapor," Applied Physics Letters, vol. 79 no. 17, pp. 2725-2727, Oct. 22, 2001.

Herman, D. S., Schuster, M. A., and Gerber, R. M., "Hillock Growth on Vacuum Deposited Aluminum Films," Journal of Vacuum Science and Technology, vol. 9 no. 1, pp. 515-519, 1972.

Hermans, M. J. M., and Biglari, M. H., "Void formation by Kirkendall effect in solder joints, Version 1.1," Dec. 2006.

Hernandez, Cynthia L., Hosking, F. Michael, and Vianco, Paul T., "Development of a Hybrid Microcircuit Test Vehicle for Surface Mount Applications," Sandia Report SAND97-0553C, 1997.

Hernandez, Cynthia L., Vianco, Paul T., and Rejent, Jerome A., "Effect of Interface Microstructure on the Mechanical Properties of Pb-Free Hybrid Microcircuit Solder Joints," Sandia Report SAND-98-1438C, Aug. 1, 1998.

Hernandez, Cynthia L., Vianco, Paul T., Rejent, Jerome A., and Hosking, F. Michael, "Mechanical Properties of Pb-Free Solder Alloys on Thick Film Hybrid Microcircuits," Sandia Report SAND97-2578C, CONF-980422--.

Hernandez, Cynthia, "Mechanical Properties of Pb-Free Solder Alloys on Thick Film Hybrid Microcircuits," IPC Printed Circuits Expo 1998, Long Beach, CA, Apr. 26-30, 1998, pp. S15-5-1-S15-5-6.

Hernandez, Hector Rene Marin, Alva, Refugio Vicente Escobedo, Feng, Zhen (Jane), Ofenboeck, Joao, and Kurwa, Murad, "X-Ray Fluorescence Equipment and Materials Characterization for RoHS Compliances," IPC Review, vol. 48 no. 6, pp. 6, July 2007.

Hernandez, Hector Rene Marin, Alva, RefugioVicente Escobedo, Feng, Zhen, Ofenboeck, Joao, and Kurwa, Murad, "XRF Equipment and Materials Characterization for RoHS Compliance," Circuits Assembly, vol. 18 no. 9, pp. 34, Sept. 2007.

Hernandez, L. A., Hernandez, L. S., Miranda, J. M., and Dominguez, O., "Hexavalent Chromium-Free Pre-Treatment For Galvanized Steel," ECS Transactions, vol. 3, no. 43, pp. 37-47, 2008.

Hernandez-Ramirez, F., Casals, O., Rodriguez, J., Vila, A., Romano-Rodriguez, A., Morante, J. R., Valizadeh, S., Hjort, K., and Abid, M., "Electrical characterisation of nanowires and nanoparticles contacted using a FIB," 2005 Spanish Conference on Electron Devices, Barcelona, Spain, Feb. 2-4, 2005, pp. 197-200.

Herrick, Nicholas, Patel, Amit, Dutt, Gyan, and Pandher, Ranjit, "High Performance Electronic Interconnect Materials Characterization - Techniques & Challenges," SMTA International 2017 Proceedings , Rosemont, IL, Sept. 17-21, 2017, pp. 48-55.

Herring, Conyers, "Diffusional Viscosity of a Polycrystalline Solid," Journal of Applied Physics, vol. 21 no. 5, pp. 437-445, May 1950.

Herring, Conyers, and Galt, J. K., "Elastic and Plastic Properties of Very Small Metal Specimens," Physical Review, vol. 85 no. 6, pp. 1060-1061, Mar. 15, 1952. https://doi.org/10.1103/PhysRev.85.1060.2

Herring, Conyers, and Nichols, M. H., "Thermionic Emission," Reviews of Modern Physics, vol. 21 no. 2, pp. 185-271, Apr. 1949.

Herrmann, C., Luger, T., Spengler, T., Schmid, E., and Walther, G., "Design and Control of material flow networks for the recycling of WEEE," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 340-345.

Herrmann, C., Eyerer, P., and Gediga, J., "Economic and Ecological Material Index for End-of-Life and Design of Electronic Products," IEEE Transactions on Electronics Packaging Manufacturing, vol. 27 no. 1, pp. 2-8, Jan. 2004.

Herrmann, Christoph, Frad, Adel, Luger, Tobias, Krause, Frank-Lothar, and Ragan, Zbigniew, "Integrating End-of-Life Evaluation in Conceptual Design," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment , San Francisco, CA, May 8-11, 2006, pp. 245-250.

Herron, Derrick, Liu, Yan, and Lee, Ning-Cheng, "The Effect of Thermal Pad Patterning on QFN Voiding," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 773-778.

Herron, Derrick, Liu, Yan, and Lee, Ning-Cheng, "Voiding Control at QFN Assembly," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. xx-xx.

Hervieu, Yuri Yu, "Effective diffusion length and elementary surface processes in the concurrent growth of nanowires and 2D layers," Journal of Crystal Growth, vol. 493, pp. 1-7, July 1, 2018.

Herzog, Th., Kohler, M., and Wolter, K.-J., "Improvement of the Adhesion of New Memory Packages by Surface Engineering," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 1136-1141.

Herzog, T., Wolter, K.-J., Canchi Purushothama, K., and Manokaran, V., "Investigation and Optimization of Residue-Free Plasma-Assisted Reflow Soldering of SnAgCu by DoE," 1st Electronics Systemintegration Technology Conference, Volume 2, Dresden, Germany, Sept. 5-7, 2006, pp. 1071-1081.

Herzog, Th., and Wolter, K.-J., "Investigations of the Microstructure of Lead-Free Solder Joints and Reliability Behavior by the Example of Chip Resistance Components," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 769-775.

Herzog, Th., Wolter, K.-J., and Poetzsch, F., "Investigations of Void forming and Shear Strength of Sn42Bi58 Solder Joints for Low Cost Applications," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1738-1745.

Herzog, Th., Rudolph, S., and Wolter, K.-J., "Process Capability, Wetting Behavior and Temperature Dependent Shear Strength of Alternative Lead Free Solder Joints," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Herzog, Th., Wolter, K.-J., and Zerna, Th., "Reliability of Lead Free Solder Joints on Manufacturing Conditions," 2000 SMTA International Conference Proceedings, Chicago, IL, Sept. 24-28, 2000, pp. xx-xx.

Herzog, Th., Wolter, K.-J., and Zerna, Th., "Reliability of Lead Free Solder Joints on Manufacturing Conditions," 2001 SMTA International Conference Proceedings, Chicago, IL, Sept. 30-Oct. 4, 2001, pp. xx-xx.

Herzog, Thomas, "Reliability of lead free solders joints and manufacturability during the SMT process," 27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, Volume 3, Sofia, Bulgaria, May 13-16, 2004, pp. 580-586.

Heschke, John, and Oakdale, Ray, "Conductive Adhesives Snap to It," Surface Mount Technology (SMT) , vol. 9 no. 10, pp. 88-89, Oct. 1995.

Hess, John, "HAPS- and Lead-Free Electrocoat for Automotive Applications," Products Finishing, vol. xx no. x, pp. xx-xx, Apr. 1996.

Hesselbach, Jurgen, Ohlendorf, Martin, and Herrmann, Christoph, "Configuration of Recycling Networks for Enhanced WEEE Recycling," Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 11-15, 2001, pp. 516-519.

Hession-Kunz, Drew, "RoHS in the HI-REL MARKET," Printed Circuit Design and Manufacture , vol. 23 no. 10, pp. 34-37, Oct. 2006.

Hester, Thomas, and Pinsky, David, "Tin Whisker Self-Mitigation in Surface Mount Components Attached with Leaded Solder Alloys," Surface Mount Technology (SMT), pp. 70,72-74,76-78,80 Sept. 2015.

Hester, Tom, "Tin Whisker Self-Mitigation in Surface Mount Components," Tin Whisker Group teleconference, May 11, 2011.

Hetschel, Thomas, Wolter, Klaus-Jurgen, and Phillipp, Fritz, "Reflow ageing influences and wettability effects of immersion tin final finishes with lead-free solder," Circuit World, vol. 35 no. 2, pp. 37-44, 2009.

Hetschel, Thomas, Wolter, Klaus-Jurgen, and Phillipp, Fritz, "Wettability Effects of Immersion Tin Final Finishes with Lead Free Solder," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 561-566.

Heuck, Nicolas, Langer, Armin, Stranz, Andrej, Palm, Gerhard, Sittig, Roland, Bakin, Andrey, and Waag, Andreas, "Analysis and Modeling of Thermomechanically Improved Silver-Sintered Die-Attach Layers Modified by Additives," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 11, pp. 1846-1855, Nov. 2011.

Heuer, Henning, Kohler, Bernd, Kruger, Peter, Meyendorf, Norbert, Oppermann, Martin, and Wolter, Klaus-Jurgen, "The Center for Non-Destructive Nano Evaluation of Electronic Packaging (nanoEVA), a New Research Facility in Dresden," 30th International Spring Seminar on Electronics Technology, Cluj-Napoca, Romania, May 9-13, 2007, pp. 273-277.

Heuschkel, Mark D., and Morris, James E., "Electric Field Effects in the Production of ICA Joints," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 212-215.

Hevel, Elliot, and Qu, Jianmin, "PWB Deflection vs. Vibration-Induced Solder Joint Deformation," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 762-764.

Heyen, Johann, and Jacob, Arne F., "Anisotropic Conductive Adhesives for Millimeter-wave Flipchip Interconnections," Conference Proceedings 34th European Microwave Conference, Volume 1, Amsterdam, The Netherlands, Oct. 11-15, 2004, pp. 85-88.

Hickey, Katherine M. M., and Lasky, Ronald C., "WEEE Registration Logistics," Surface Mount Technology (SMT) , vol. 19 no. 10, pp. xx-xx, Oct. 2005.

Hickman, Cheryl, "Conversion Coatings," Products Finishing, vol. xx no. xx, pp. xx-xx, June 6, 2003.

Hicks, C., Dietmar, R., and Eugster, M., "The recycling and disposal of electrical and electronic waste in China - Legislative and market responses," Environmental Impact Assessment Review, vol. 25 no. 5, pp. 459-471, July 2005.

Hicks, Lloyd, "Exploring Options for Individual Producer Responsibility for waste from private households for the Waste Electrical and Electronic Equipment Directive," Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, New Orleans, LA, May 16-19, 2005, pp. 49-53.

Hida, Masahiro, and Kajihara, Masanori, "Observation on Isothermal Reactive Diffusion between Solid Fe and Liquid Sn," Materials Transactions, vol.53 no.7, pp. 1240-1246, 2012.

Hidaka, N., Watanabe, H., and Yoshiba, M., "Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys," Journal of Electronic Materials, vol. 38 no. 5, pp. 670-677, May 2009.

Hidaka, Noboru, Nagano, Megumi, Shimoda, Masayoshi, Watanabe, Hirohiko, and Ono, Masahiro, "Creep Properties and Microstructure of the Sn-Ag-Cu-Ni-Ge Lead-free Solder Alloy," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part C, San Francisco, CA, July 17-22, 2005, pp. 1805-1810.

Hieronymi, Klaus, "Implementing the WEEE Directive," 2001 IEEE International Symposium on Electronics & the Environment, Denver, CO, May 7-9, 2001, pp. 217-222.

Higgins, George, "In-Situ Pretreatment of Aluminium Surfaces for Repainting," Aircraft Engineering, vol. 58 no. 1, pp. 5-6, Jan. 1988.

Higgins, Leo, "Component Technology," Lead-Free Magazine, vol. 3, Feb. 2005.

Higgins III, Leo M., "Components," Lead-Free Magazine.

Higgins III, Leo M., "The Move To Lead-free Manufacturing," Printed Circuit Design, vol. 19 no. 12, pp. 20-22, 27, Dec. 2002.

Higgins III, Leo M., "The `Other' Tin Issue: Tin Pest," Advanced Packaging, vol. 14 no. 4. pp. 12, Apr. 2005.

High, M. Dean, "Update On Chromium and Nickel Regulations In California," Proceedings of the 20th AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 25-29, 1999, pp. 317-322.

Highley, D. E., Slater, D., Chapman, G. R., "Geological occurence of elements consumed in the electronics industry," Transactions of the Institution of Mining & Metallurgy, Section C , vol. 97, pp. C34-C42, Mar. 1987.

Higurashi, Eiji, Chino, Daisuke, and Suga, Tadatomo, "Residue-Free Solder Bumping Using Small AuSn Particles by Hydrogen Radicals," IEICE Transactions on Electronics, vol. E92.C no. 2, pp. 247-251, 2009.

Hilburn, Rocky, Wang, Jiangtao, Clouser, Sid, and Bergstresser, Tad, "The STATE of COPPER," Printed Circuit Design and Manufacture , vol. 22 no. 5, pp. 24-29, May 2005.

Hill, Julie-Anne, Markley, Tracey, Forsyth, Maria, Howlett, Patrick C., and Hinton, Bruce R. W., "Corrosion inhibition of 7000 series aluminium alloys with cerium diphenyl phosphate," Journal of Alloys and Compounds, vol. 509 no. 5, pp. 1683-1690, Feb. 3, 2011.

Hill, Lisa, "SEM Imaging of Tin Whiskers," 1997.

Hill, Mike, "Bored Reliability," Overcoming the Reliability Challenge: An IPC Summit , Andover, MA, Apr. 15, 2008, pp. xx-xx.

Hill, R. W., and Parkinson, D. H., "The Specific Heats of Germanium and Grey Tin at Low Temperatures," Philosophical Magazine, 7th series, vol. 43 no. 338, pp. 309-316, Mar. 1952. https://doi.org/10.1080/14786440308520161

Hill, Rich, "Are Your Whiskers Going To Crash Your Computer?," Disaster-Resource.com.

Hill, Rich, "Zinc Whiskers, What Nobofy's Telling You (Webinar)," Data Clean.

Hill, Rich, "Zinc Whiskers - What You Should Know Now!."

Hill, Richard F., and Li, Yuqin, "Thermally Conductive Free-Standing Dielectric Materials for Printed Circuit Boards without Halogens or Phosphorous," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S17-03-1-S17-03-6.

Hill, Robert, "JG-PP Lead-Free Solder Project Technical Meeting Minutes November 14-15, 2001," Joint Group on Pollution Prevention, Nov. 30, 2001.

Hiller, Bernhard, and Singh, Gurinder P., "Mechanism for Formation of Whiskers on a Flying Magnetic Recording Slider," IEEE Transactions on Magnetics, vol. 30 no. 4, pp. 1499-1503, July 1994.

Hilliard, Henry E., "Platinum-Group Metals," Minerals Yearbook: Volume I. -- Metals and Minerals, 2003.

Hilliard, Henry E., "Silver," Minerals Yearbook: Volume I. -- Metals and Minerals, 2003.

Hillman, C., "Lead Free: Predicting and Ensuring Reliability in Military Avionics," Defense Manufacturing Conference, Nashville, TN, November 27-30, 2006.

Hillman, Craig, "Anyone for a drink?," Global SMT and Packaging, vol. 13 no. 6, pp. 22-23, June 2013.

Hillman, Craig, "Assessment of Pb-Free Norris-Landzberg Model to JG-PP Test Data," DfR Solutions, Feb. 21, 2006.

Hillman, Craig, and Binfield, Seth, "Bromide-Free Options for Printed Circuit Boards," Circuitnet .

Hillman, Craig, and Binfield, Seth, "Bromide-Free Options for Printed Circuit Boards," DfR Soultions.

Hillman, Craig, "Copper is moving inside your printed circuit board," Global SMT and Packaging, vol. 12 no. 11, pp. 18-19, Nov. 2012.

Hillman, Craig, Blattau, Nathan, Dodd, Ed, and Arnold, Joelle, "Epidemiological Study on SnAgCu Solder: Benchmarking Results from Accelerated Life Testing," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 946-953.

Hillman, Craig, Esser, Robert, and McLeish, Jim, "Failure Mechanisms in High Voltage Printed Circuit Boards," Circuitnet.

Hillman, Craig, Blattau, Nathan, Arnold, Joelle, Johnston, Thomas, Gulbrandsen, Stephanie, Silk, Julie, and Chiu, Alex, "Gold Embrittlement in Lead-free Solder," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 504-518.

Hillman, Craig, Blattau, Nathan, Arnold, Joelle, Johnston, Thomas, Gulbrandsen, Stephani, Silk, Julie, Chiu, Alex, and Chan, Yew-Hoong, "Gold Embrittlement in Leadfree Solder," SMTAnews & Journal of Surface Mount Technology, vol. 26 no. 4, pp. 23-34, Oct.-Dec. 2013.

Hillman, Craig, Blattau, Nathan, Arnold, Joelle, Johnston, Thomas, Gulbrandsen, Stephanie, Silk, Julie, and Chiu, Alex, "Gold Embrittlement in Lead-Free Solder," South East Asia Technical Training Conference on Electronics Assembly Technologies 2014 Proceedings , Penang, Malaysia, Apr. 8-10, 2014, pp. xx-xx.

Hillman, Craig, "How is the commercial world responding to RoHS?," DoD DMSMS Conference, Charlotte, NC, July 11, 2006, pp. xx-xx.

Hillman, Craig, "IPC Members Help Needed to Stop RoHS Expansion," May 14, 2008,

Hillman, Craig, "Long-term reliability of Pb-free electronics ," Electronic Products , vol. 48 no. 4, pp. 69-71, Sept. 2005.

Hillman, Craig, "Modification of Existing NEBS Requirements for Pb-Free Electronics," Circuitnet.

Hillman, Craig, Arnold, Joelle, Binfield, Seth, and Seppi, Jeremy, "Silver and Sulfur: Case Studies, Physics and Possible Solutions," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 621-633.

Hillman, Craig, "The Tin Myth: How the Hi-Rel Industry Won," Circuitnet.

Hillman, Craig, Fischer, Gerd, and Esser, Robert, "Tin Whisker Risk Assessment Case Study," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Hillman, Craig, "What I Don't Know That I Don't Know: Things to Worry About with the Pb-Free Transition," Lead-Free Connection, vol. 3 no. 1, pp. 6-9, May 2006.

Hillman, Craig, "What's the secret to tin whiskers?," Global SMT and Packaging , vol. 13 no. 4, pp. 38-39,41, Apr. 2013.

Hillman, D. D., and Chumbley, L. S., "Characterization of tin oxidation products using sequential electrochemical reduction analysis (SERA)," Soldering & Surface Mount Technology , vol. 18 no. 3, pp. 31-41, 2006.

Hillman, Dave, Wilcoxon, Ross, Lower, Nate, and Grossman, Dan, "Alkali Silicate Glass Coatings for Mitigating the Risks of Tin Whiskers," Journal of Electronic Materials, vol. 44 no. 12, pp. 4864-4883, Dec. 2015.

Hillman, Dave, "An Investigation into the Tin Pest Phenomena: 3 Years and Counting," Tin Whisker Group teleconference, Nov. 20, 2013.

Hillman, Dave, Pearson, Tim, and Lesniewski, Thomas, "An Investigation of Whisker Growth on Tin Coated Wire and Braid," IPC APEX Expo 2012, San Diego, CA, Feb. 28-Mar. 1, 2012, pp. xx-xx.

Hillman, Dave, and Lesniewski, Tom, "An Investigation of Whisker Growth on Tin Coated Wire and Braid," Tin Whisker Group teleconference, Mar. 6, 2013.

Hillman, Dave, and Wilcoxon, Ross, "BGA Solder Joint Integrity: A Case Study," International Conference on Soldering & Reliability 2015 Proceedings, Toronto, Ontario, Canada, May 19-21, 2015, pp. xx-xx.

Hillman, Dave, Adams, Dave, Pearson, Tim, and Wilcoxon, Ross, "BGA Thermal Cycle Solder Joint Integrity Using a Nonconcentric Microvia in Pad Structure," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 40-46.

Hillman, Dave, Wilcoxon, Ross, Pearson, Tim, and McKenna, Paul, "Dissolution Rate of Electronics Packaging Surface Finish Elements in Sn3.0Ag0.5Cu Solder," Journal of Electronic Materials, vol. 48 no. 8, pp. 5241-5256, Aug. 2019.

Hillman, Dave, "GEIA-HB-0005-3 Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems," SMTA International 2012 Conference Proceedings , Orlando, FL, Oct. 14-18, 2012, pp. xx-xx.

Hillman, Dave, "Impact of the Oko-Institut Recommandations on an Avionics OEM," IPC Brussels, Brussels, Belgium, June 18, 2008, pp. xx-xx.

Hillman, Dave, and Wilcoxon, Ross, "Impact of Underfill and Solder Joint Alloy Selection on Flip Chip Solder Joint Reliability," 2004 SMTA International Conference Proceedings , Chicago, IL, Sept. 26-30, 2004, pp. 330-338.

Hillman, Dave, and Hamand, Matt, "Lead-Free (PbFree) Feasibility Program: Assembly and Testing of a Functional IPC Class 3 Avionics Data Unit," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 787-797.

Hillman, Dave, and Anderson, Iver, "Micro-Alloying Effects on Joint Microstructures in Sn-Ag-Cu Solder Joints for High Reliability in Thermal Cycling," International Conference on Soldering & Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.

Hillman, Dave, and Anderson, Iver, "Micro-alloying Effects on Joint Microstructures in Sn-Ag-Cu Solder Joints for High Reliability in Thermal Cycling," SMTAnews & Journal of Surface Mount Technology, vol. 27 no. 3, pp. 28-33, July-Sept. 2014.

Hillman, Dave, Pearson, Tim, and Wilcoxon, Ross, "NASA DoD -55°C to +125°C Thermal Cycle Test Results," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 512-518.

Hillman, Dave, Wilcoxon, Ross, and Pearson, Tim, "NASA DoD Consortia: -55°C to+125°C Thermal Cycle Test Results," SMTA International 2010 Conference (Presentations), Orlando, FL, Oct. 24-28, 2010.

Hillman, Dave, Soole, Jon, Anderson, Iver, Bancroft, Mark, Hess, Chris, and Lopez, Dave, "Solder Joint Integrity Impact of 98%Tin/2%Bismuth Component Surface Finishes," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 597-606.

Hillman, Dave, Wells, Matt, and Cho, Kim, "The Impact of Reflowing a Pbfree Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Hillman, Dave, Wilcoxon, Ross, Lower, Nate, and Grossman, Dan, "Tin Whisker Inorganic Coating Evaluation (TWICE)," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 476-488.

Hillman, Dave, and Hamand, Matt, "Tin Whiskers: A 2011 State of the Industry Assessment (Tutorial T6)," SMTA International 2011 Conference, Fort Worth, TX, Oct. 16-20, 2011.

Hillman, Dave, "Tin Whiskers: A 2012 State of the Industry Assessment," IPC Webinar, Apr. 5, 2012.

Hillman, David, and Pauls, Doug, "A Summary of Tin Whisker Research References," IPC-WP-009, Mar. 2008.

Hillman, David, "An Investigation into the Tin Pest Phenomena: 3 Years and Counting," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 733-738.

Hillman, David, Wilcoxon, Ross, Pearson, Tim, and Cho, Kim, "Bottom Terminated Component (BTC) Void Concerns: Real and Imagined," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 465-477.

Hillman, David, "Characterization of the Capability of Conformal Coating to Inhibit Tin Whisker Growth," International Conference on Soldering & Reliability 2017 Proceedings, Toronto, Ontario, Canada, June 6-8, 2017, pp. xx-xx.

Hillman, David, Wilcoxon, Ross, Pearson, Tim, and McKenna, Paul, "Dissolution Rate of Specific Elements in SAC305 Solder," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Hillman, David, Pearson, Tim, and Faust, Jody, "Evaluation of Tin Copper (SnCu) Modified Lead-Free Solder Alloys for Wave Solder Processes," International Conference on Soldering & Reliability 2011 Proceedings, Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

Hillman, David, "False Tin Whiskers: Masquerading Tin Copper Intermetallics," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 607-611.

Hillman, David, and Cullen, Don, "Impact of Inert Atmosphere Quality on Wettability of Printed Wiring Board (PWB) Finishes for Surface Mount Soldering Applications," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Hillman, David, and Wilcoxon, Ross, "JCAA/JG-PP Lead-Free Solder Testing for High Reliability Applications: -55°C to +125°C Thermal Cycle Testing," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 836-860.

Hillman, David, and Wilcoxon, Ross, "JCAA/JG-PP Lead-Free Solder Testing for High Reliability Applications: -55°C to +125°C Thermal Cycle Testing," SMTAnews & Journal of Surface Mount Technology, vol. 20 no. 1, pp. 22-41, Jan.-Mar. 2007.

Hillman, David D., "JCAA/JG-PP No-Lead Solder Project: -20°C to +80°C and -55°C to +125°C Thermal Cycle Testing," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 846-850.

Hillman, David, and Olson, Sarah, "JCAA/JG-PP No-Lead Solder Project: -55° to +125°C Thermal Cycle Testing Status Report," IPC Printed Circuits Expo, APEX and the Designer Summit , Anaheim, CA, Feb. 8-10, 2006, pp. S20-02-1-S20-02-12.

Hillman, David, and Hamand, Matthew, "Lead Free Assembly of Functional Military Avionics," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. xx-xx.

Hillman, David, and Hamand, Matt, "Pb Free Feasibility Program: Assembly and Testing of a Functional Military Avionics Unit," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 141-149.

Hillman, David, Soole, Jon, and Wilcoxon, Ross, "Solder Joint Integrity Impact of Immersion Silver Surface Finish Thickness for Tin/Lead and Lead-free Solder Processes," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Hillman, David, Kramer, Jennet, and James, Bryan, "Solder Joint Reliability Qualification of Various Component Mounting Modification Configurations Using Thermal Cycle Testing," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference , Anaheim, CA, Feb. 24-26, 2004, pp. S32-1-1-S32-1-16.

Hillman, David, "Surface Mount Solder Joint Integrity Issues for Lead-free Soldering Concerning Lead and Bismuth Interactions," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Hillman, David, Wilcoxon, Ross, Pauls, Doug, Hillman, Craig, and Serebreni, Maxim, "The Impact of Improper Conformal Coating Processes on Lead-Free BGA Solder Joint Integrity," SMTA-IPC High-Reliability Cleaning and Conformal Coating Conference 2016, Rosemont, IL, Oct. 25-27, 2016, pp. xx-xx.

Hillman, David, Wells, Matt, and Cho, Kim, "The Impact of Reflowing a Pbfree Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity."

Hillman, David, Wells, Matt, and Cho, Kim, "The Impact of Reflowing A Pbfree Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.

Hillman, David, Adams, Dave, Pearson, Tim, Williams, Brad, Petrick, Brittany, Wilcoxon, Ross, Bernard, David, Travis, John, Krastev, Evstatin, and Bastin, Vineeth, "The Last Will and Testament of the BGA Void," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 163-177.

Hillman, David, Adams, David, Pearson, Tim, Wilcoxon, Ross, Christian, Bev, Smith, Brandon, and Scalzo, Mario, "The Last Will and Testament of the Lead-Free BGA Void," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 16-18, 2012, pp. xx-xx.

Hillman, David, Adams, David, Pearson, Tim, Wilcoxon, Ross, Christian, Bev, Smith, Brandon, and Scalzo, Mario, "The Last Will and Testament of The Lead-Free BGA Void," SMTA Journal , vol. 25 no. 3, pp. 29-41, 2012.

Hillman, David, Margheim, Sue, and Straw, Eric, "The Use of Tin/Bismuth Plating for Tin Whisker Mitigation on Fabricated Mechanical Parts," 1st International Symposium on Tin Whiskers, College Park, MD, Apr. 24-25, 2007, pp. xx-xx.

Hillman, David, Margheim, Sue, and Straw, Eric, "The Use of Tin/Bismuth Plating for Tin Whisker Mitigation on Fabricated Mechanical Parts," Symposium on Reprocessing Tin Whisker Mitigation, and Assembly Rework, College Park, MD, Nov. 11-12, 2008, pp. xx-xx.

Hillman, David, Schmidt, Mike, and Christian, Bev, "Tin Pest Phenomena: A Real World Test Scenario," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 660-665.

Hillman, David, and Wilcoxon, Ross, "Tin Whisker Risk Assessment of a Tin Surface Finished Connector," Surface Mount Technology (SMT), vol. 30 no. 2, pp. 68,70-72,74-76,78-79, Feb. 2015.

Hillman, David, "Using Lead-Free BGAs in a Tin/Lead Soldering Process," Surface Mount Technology (SMT), vol. 32 no. 7, pp. 94,96-98,100-102, July 2017.

Hillman, David, Bratin, Peter, and Pavlov, Michael, "Wirebondability and Solderability of Various Metallic Finishes for Use in Printed Circuit Assembly," Surface Mount International Proceedings of the Technical Program, Volume II, San Jose, CA, Sept. 10-12, 1996, pp. 687-701.

Hilse, M., Takagaki, Y., Ramsteiner, M., Herfort, J., Breuer, S., Geelhaar, L., and Riechert, H., "Strain in GaAs-MnAs core-shell nanowires grown by molecular beam epitaxy," Journal of Crystal Growth, vol. 323 no. 1, pp. 307-310, May 15, 2011.

Hilty, Lorenz M., "Electronic waste - an emerging risk?," Environmental Impact Assessment Review, vol. 25 no. 5, pp. 431-435, July 2005.

Hilty, Robert D., "Achieving Lead Free Connectors and Processes," Tyco Electronics.

Hilty, Robert D., and Corman, Ned, "An Electrical Characterization of Tin Whisker Shorting," Materials Research Society Spring Meeting, San Francisco, CA, Apr. 9-13, 2007, pp. xx-xx.

Hilty, Robert D., "Backward Compatibility of RoHS Compliant Products," ECN Supplement , pp. 7-8, Nov. 2005.

Hilty, Robert, and Amodeo, Phillip, "Crimp and Separable Interface Qualification Testing: Tin vs. Tin/Lead," Tyco Electronics Test Report - Crimp and Separable Interface Qualification Testing, May 2003.

Hilty, Robert, Everidge, Jackie, and Kaat, Derek, "Crimp Qualification Testing: Tin vs. Tin/Lead," Tyco Electronics Test Report - Crimp Qualification Testing, Apr. 2003.

Hilty, Robert D., Corman, Ned, and Herrmann, Hank, "Electrostatic Fields and Current-Flow Impact on Whisker Growth," IEEE Transactions on Electronics Packaging Manufacturing, vol. 28 no. 1, pp. 75-84, Jan. 2005.

Hilty, Robert D., "Lead Free Components in Automotive Applications," IPC/JEDEC 4th International Conference on Lead-Free Electronic Components and Assemblies , Oct. 2003, pp. xx-xx.

Hilty, Robert D., "Lead-free Platings for Connector Contacts," Connector Specifier , vol. 17 no. 11, pp. xx-xx, Nov. 2001.

Hilty, Robert D., and Myers, Marjorie, "Solderability of Lead-Free Electrodeposits," Tyco Electronics Technical Report 503-1, Aug. 23, 2004.

Hilty, Robert D., and Myers, Marjorie K., "Solderability of Lead Free Electrodeposits in Tin/Lead Solder," Tyco Electronics Publication 503-1001, Nov. 10, 2004.

Hilty, Robert D., and Corman, Ned, "Tin Whisker Reliability Assessment by Monte Carlo Simulation," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Hilty, Robert D., "Tin Whiskers in Electronics Components," Tyco Electronics.

Hilvers, Tony, Lotosky, Paul, Munie, Greg, Seelig, Karl, Vivari, John, and Wenger, George, "To Void or Not to Void?," Surface Mount Technology (SMT), vol. 20 no. 1, pp. xx-xx, Jan. 2006.

Hindin, Barry S., "Mixed Flowing Gas Test Procedures for Creep Corrosion and How To Minimize Its Occurrence," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 919-925.

Hindler, M., Knott, S., and Mikula, A., "Thermodynamic Properties of Liquid Ag-Au-Sn Alloys," Journal of Electronic Materials, vol. 39 no. 10, pp. 2310-2315, Oct. 2010.

Hindler, Michael, and Mikula, Adolf, "Calorimetric investigations of liquid gold-antimony-tin alloys," International Journal of Materials Research, vol. 103 no. 7, pp. 858-865, July 2012.

Hino, Makoto, Murakami, Koji, Mitooka, Yutaka, Muraoka, Ken, and Takamizawa, Masao, "Effect of Corrosion Atmosphere Using Environmental Test Chamber on Whisker Growth of Tin Electroplating," Journal of The Surface Finishing Society of Japan, vol. 62 no. 1, pp. 41-46, 2011.

Hino, Makoto, Murakami, Koji, and Hiramatsu, Minoru, "Hybrid Treatment of Zinc Based-SiO2 Nanoparticles Composite Coating to Replace Chromating," Journal of the Surface Finishing Society of Japan , vol. 57 no. 12, pp. 860-865, 2006.

Hino, Makoto, Murakami, Koji, Mitooka, Yutaka, Takamizawa, Masao, Naka, Toshihide, and Nakai, Kiyomichi, "Lead Transfer to the Surface into Electrodeposited Tin Film and the Whisker Growth," Journal of the Surface Finishing Society of Japan, vol. 59 no. 12, pp. 925-930, 2008.

Hino, Makoto, Murakami, Koji, Mitooka, Yutaka, Takamizawa, Masao, Naka, Toshihide, and Nakai, Kiyomichi, "Mechanism of Whisker Growth Suppression by Lead Co-deposition on Electroplated Tin Film," Materials Science Forum, vol. 638-642, pp. 835-840, Jan. 2010.

Hino, Makoto, Mitooka, Yutaka, Murakami, Koji, Takamizawa, Masao, and Nishimura, Nobuyuki, "Melting Treatment of Tin Electroplating by Laser Irradiation," Journal of The Surface Finishing Society of Japan, vol. 60 no. 2, pp. 134-136, 2009.

Hinode, Kenji, Furusawa, Takeshi, and Homma, Yoshio, "Dependence of electromigration damage on current density," Journal of Applied Physics, vol. 74 no. 1, pp. 201-206, July 1, 1993.

Hinode, Kenji, Furusawa, Takeshi, and Homma, Yoshio, "Role of Evolved Stress in Electromigration Degradation," AIP Conference Proceedings, vol. 305, pp. 220-230, 1994.

Hinode, Kenji, Homma, Yoshio, and Sasaki, Yasushi, "Whisker Growth on Aluminum Thin Films During Heat Treatment," AIP Conference Proceedings, vol. 418, pp. 359-370, 1998.

Hinode, Kenji, "Whiskers formed on aluminum electrodes and conductors in electronic devices," Journal of Japan Institute of Light Metals, vol. 48 no. 12, pp. 635-640, Dec. 1998. https://doi.org/10.2464/jilm.48.635

Hinode, Kenji, Homma, Yoshio, and Sasaki, Yasushi, "Whiskers grown on aluminum thin films during heat treatments," Journal of Vacuum Science & Technology A: Vacuum Surfaces, and Films, vol. 14 no. 4, pp. 2570-2576, July/Aug. 1996.

Hinton, Phillip E., "Tin Plating, Tin-Nickel Electroplate and Tin Plating Over Nickel as Final Finishes on Copper," Surface Mount International Proceedings of the Technical Program, Volume II, San Jose, CA, Sept. 10-12, 1996, pp. 806-810.

Hirabayashi, Kanji, "Intrinsic Surface States in Semiconductors. I. Diamond-Type Crystals," Journal of the Physical Society of Japan, vol. 27 no 6, pp. 1475-1484, Dec. 1969.

Hirai, Keiko, Mabee, Judson, Smith, Doug, and Small, Mark, "Sony's Green Partner program," Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, New Orleans, LA, May 16-19, 2005, pp. 54-59.

Hiramori, Tomoyuki, Ito, Mototaka, Tanii, Yoshiharu, Hirose, Akio, and Kobayashi, Kojiro F., "Sn-Ag Based Solders Bonded to Ni-P/Au Plating: Effects of Interfacial Structure on Joint Strength," Materials Transactions, vol. 44 no. 11, pp. 2375-2383, Nov. 2003.

Hirano, T., Fukuda, K., Ito, K., Kiga, T., and Taniguchi, Y., "Reliability of Lead Free Solder Joint by Using Chip Size Package," IEEE International Symposium on Electronics and the Environment, Denver, CA, May 7-9, 2001, pp. 285-289.

Hiraoka, Koichi, Kusumoto, Yusuke, Ikezoe, Ikuya, Kajii, Hirotake, and Ohmori, Yutaka, "Properties of polymer light-emitting transistors with Ag-nanowire source/drain electrodes fabricated on polymer substrate," Thin Solid Films, vol. 554, pp. 184-188, Mar. 3, 2014.

Hirata, Akihiro, Shohji, Ikuo, Tsuchida, Tetsuyuki, and Ookubo, Toshikazu, "Effect of Electrode Material on Joint Strength of Soldered Joints with Sn-Bi and Sn-Bi-Sb Lead-free Solder Balls," Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 1, Burlingame, CA, July 16-18, 2013, pp. V001T07A011-1-V001T07A011-6.

Hirceaga, Adrian, and Hasan, Ishrat, "Process Control and Reliability of Reworked BGA Solder Joint," International Conference on Soldering & Reliability 2013 Proceedings , Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.

Hirman, Martin, and Steiner, Frantisek, "A Comparison of the Shear Strength of Conductive Adhesives and Soldering Alloys," 2015 38th International Spring Seminar on Electronics Technology, Eger, Hungary, May 6-10, 2015, pp. 167-172.

Hirman, Martin, Steiner, Frantisek, Navratil, Jiri, and Hamacek, Ales, "Comparison of QFN Chips Glued by ACA and NCA Adhesives on the Flexible Substrate," 2019 22nd European Microelectronics and Packaging Conference & Exhibition, Pisa, Italy, Sept. 16-19, 2019. pp. xx-xx.

Hirman, Martin, and Steiner, Frantisek, "Influence of electrically conductive adhesive amount on shear strength of glued joints," 2015 International Conference on Applied Electronics , Pilsen, Czech Republic, Sept. 8-9, 2015, pp. 53-56.

Hirman, Martin, Rendl, Karel, Steiner, Frantisek, and Wirth, Vaclav, "Influence of Reflow Soldering Profiles on Creation of IMC at the Interface of SnBi/Cu," Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, Dresden, Germany, May 7-11, 2014, pp. 147-151.

Hirose, Akio, Hojo, Takashi, Sogo, Yosuke, Miwa, Ryoko, Kobayashi, Kojiro F., Yamaguchi, Atsushi, Furusawa, Akio, and Nishida, Kazuto, "Effects of Interfacial Microstructure on Strength of Solder Joint Using Sn-Ag-Bi-In Solder," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B, San Francisco, CA, July 17-22, 2005, pp. 893-898.

Hirose, Akio, Fujii, Toshio, Imamura, Takeshi, and Kobayashi, Kojiro F., "Influence of Interfacial Reaction on Reliability of QFP Joints with Sn-Ag Based Pb Free Solders," Materials Transactions, vol. 42 no. 5, pp. 794-802, May 2001.

Hirose, Akio, Hiramori, Tomoyuki, Ito, Mototaka, Tanii, Yoshiharu, and Kobayashi, Kojiro F., "Interfacial Microstructure and Joint Strength of Sn-Ag and Sn-Ag-Cu Lead Free Solders Reflowed on Cu/Ni-P/Au Metallization," Materials Science Forum , vol. 512, pp. 355-360, 2006.

Hirsch, Peter B., "X-ray Experiments on Tin Whiskers," Dislocations and Mechanical Properties of Crystals, Lake Placid, Sept. 6-8, 1956, pp. 545-547.

Hirsch, Soeren, Majcherek, Soeren, and Schmidt, Bertram, "Characterizing mechanical stress - caused by packaging processes," Global SMT and Packaging, vol. 7 no. 1, pp. 20-23, Jan. 2007.

Hirsch, Soeren, Majcherek, Soeren, and Schmidt, Bertram, "Characterization methods for mechanical stress caused by packaging processes," Global SMT and Packaging, vol. 7 no. 3, pp. 10-13, Mar. 2007.

Hirsch, Stanley, "Tin, Lead, and Tin-Lead Plating," Metal Finishing, vol. 103 no. 6A, pp. 240, 244, 246-254, Summer 2005.

Hirsch, Stanley, and Rosenstein, Charles, "Tin, Lead, and Tin-Lead Plating," Metal Finishing, vol. 105 no. 10, pp. 260-271, Oct. 2007.

Hiruma, K., Yazawa, M., Katsuyama, T., Ogawa, K., Haraguchi, K., Koguchi, M., and Kakibayashi, H., "Growth and optical properties of nanometer-scale GaAs and InAs whiskers," Journal of Applied Physics, vol. 77 no. 2, pp. 447-462, Jan. 15, 1995.

Hiruma, Kenji, Yazawa, Masamitsu, Haraguchi, Keiichi, Ogawa, Kensuke, Katsuyama, Toshio, Koguchi, Masanari, and Kakibayashi, Hiroshi, "GaAs free-standing quantum-size wires," Journal of Applied Physics , vol. 74 no. 5, pp. 3162-3171, Sept. 1, 1993.

Hisada, Takashi, Shohji, Ikuo, Yamada, Yasuharu, Toriyama, Kazushige, and Ueno, Mamoru, "Mechanical Properties of Sn-58Bi, In-3Ag and SAC305 Solders Measured with Fine Diameter Specimens," 2013 IEEE 3rd CPMT Symposium Japan, Kyoto, Japan, Nov. 11-13, 2013, pp. xx-xx.

Hischier, R., Wager, P., and Gauglhofer, J., "Does WEEE recycling make sense from an environmental perspective?: The environmental impacts of the Swiss take-back and recycling systems for waste electrical and electronic equipment (WEEE)," Environmental Impact Assessment Review, vol. 25 no. 5, pp. 525-539, July 2005.

Hischier, Roland, and Baudin, Isabelle, "LCA study of a plasma television device," International Journal of Life Cycle Assessment, vol. xx no. x, pp. xx-xx, xxxx.

Hischier, Roland, "Life cycle assessment study of a field emission display television device," International Journal of Life Cycle Assessment, vol. 20 no. 1, pp. 61-73, Jan. 2015.

Hisert, Jim, and Wathne, Sigurd R., "Mastering Material Sets," Advanced Packaging, vol. 17 no. 10, pp. 20-21, Oct. 2008.

Hisert, Jim, "Shock Reliability of BGAs Using Underfill," Surface Mount Technology (SMT), vol. 21 no. 1, pp. 24, 26, 28, Jan. 2007.

Hisert, Jim, and Mackie, Andy C., "The Evolution Revolution in Flux," Advanced Packaging, vol. 16 no. 5, pp. 28, 30, 32, July 2007.

Hitchens, Lee, Hunt, Christopher, and Wickham, Martin, "Ageing Properties of Organic Solderable Preservatives," NPL Report CMMT(A)41, Oct. 1996.

Hiyoshi, Noritake, Itoh, Takamoto, and Sakane, Masao, "Development of Thermal Mechanical Fatigue Testing Machine for Solders," Journal of the Society of Materials Science, vol. 58 no. 2, pp. 162-167, 2009.

Hiyoshi, Noritake, Yamashita, Mitsuo, and Hokazono, Hiroaki, "Effect of Additive Elements on Crack Propagation Behavior for Sn-Bi Solders at High Temperatures," 2014 IEEE 16th Electronics Packaging Technology Conference, Singapore, Dec. 3-5, 2014, pp. 57-60.

Hiyoshi, Noritake, Katoh, Akihisa, Sakane, Masao, and Tsukada, Yutaka, "Low Cycle Fatigue Lives of Sn-37Pb and Sn-3.5Ag Solders at Low Temperatures," Journal of the Society of Materials Science, vol. 58 no. 2, pp. 155-161, 2009.

Hiyoshi, Noritake, Itoh, Takamoto, and Sakane, Masao, "Thermo-Mechanical Fatigue Life Evaluation for Sn-Pb and Sn-Ag Solders," 2011 18th European Microelectronics and Packaging Conference, Brighton, United Kingdom, Sept. 12-15, 2011, pp. xx-xx.

Hlinka, Jozsef, Berczeli, Miklos, Buza, Gabor, and Weltsch, Zoltan, "Wetting properties of Nd:YAG laser treated copper by SAC solders," Soldering & Surface Mount Technology, vol. 29 no. 2, pp. 69-74, 2017.

Hnetinka, Chrissy, and Niksa, Marilyn, "Effect of Various Electrocatalytic Anodes on Hexavalent and Trivalent Chrome Plating Solutions," Metal Finishing, vol. 109 no. 7, pp. 21-24, Oct. 2011.

Ho, Alfred, and Ly, Hien, "Case Study - BGA Connector Assembly Process Characterization," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 350-355.

Ho, C. E., Lee, A., and Subramanian, K. N., "Design of solder joints for fundamental studies on the effects of electromigration," Journal of Materials Science: Materials in Electronics, vol. 18 no. 6, pp. 569-574, June 2007.

Ho, C. E., Kuo, T. T., Gierlotka, W., and Ma, F. M., "Development and Evaluation of Direct Deposition of Au/Pd(P) Bilayers over Cu Pads in Soldering Applications," Journal of Electronic Materials, vol. xx no. x, pp. xx-xx, xxxx.

Ho, C. E., Lee, A., Subramanian, K. N., and Liu, W. "Early stage of material movements in eutectic SnPb solder joint undergoing current stressing at 150 °C," Applied Physics Letters, vol. 91 no. 2, pp. 021906-1-021906-3, July 9, 2007.

Ho, C. E., Tsai, R. Y., Lin, Y. L., and Kao, C. R., "Effect of Cu Concentration on the Reactions between Sn-Ag-Cu Solders and Ni," Journal of Electronic Materials, vol. 31 no. 6, pp. 584-590, June 2002.

Ho, C. E., Hsu, L. H., Yang, C. H., Yeh, T. C., and Lee, P. T., "Effect of Pd(P) thickness on the soldering reaction between Sn-3Ag-0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad," Thin Solid Films, vol. 584, pp. 257-264, June 1, 2015.

Ho, C. E. Lin, Y. W., Yang, S. C., Kao, C. R., and Jiang, D. S., "Effects of Limited Cu Supply on Soldering Reactions Between SnAgCu and Ni," Journal of Electronic Materials, vol. 35 no. 5, pp. 1017-1024, May 2006.

Ho, C. E., Wang, C. C., Rahman, M. A., and Lin, Y. C., "Field-emission transmission electron microscopy study of the reaction sequence between Sn-Ag-Cu alloy and an amorphous Pd(P) thin film in microelectronic packaging," Thin Solid Films, vol. 529, pp. 369-373, Feb. 1, 2013.

Ho, C. E., Hsu, L. H., Lin, S. W., and Rahman, M. A., "Influence of Pd Concentration on the Interfacial Reaction and Mechanical Reliability of the Ni/Sn-Ag-Cu-xPd System," Journal of Electronic Materials, vol. 41 no. 1, pp. 2-10, Jan. 2012.

Ho, C. E., Hsieh, W. Z., Yang, C. H., Yeh, T. C., and Kuo, T. T., "Interfacial Reaction and Mechanical Characterization of Sn-Ag-Cu/Au/Pd(P)/Cu Solder Joints: Thick Pd(P) Deposition," Journal of Electronic Materials , vol. 44 no. 1, pp. 568-580, Jan. 2015.

Ho, C. E., Yang, S. C., and Kao, C. R., "Interfacial reaction issues for lead-free electronic solders," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 155-174, Mar. 2007.

Ho, C. E., Wang, S. J., Fan, C. W., and Wu, W. H., "Optimization of the Ni(P) Thickness for an Ultrathin Ni(P)-Based Surface Finish in Soldering Applications," Journal of Electronic Materials , vol. 43 no. 1, pp. 16-25, Jan. 2014.

Ho, C. E., Fan, C. W., Wu, W. H., and Kuo, T. T., "Reliability evaluation on a submicron Ni(P) thin film for lead-free soldering," Thin Solid Films, vol. 529, pp. 364-368, Feb. 1, 2013.

Ho, C. E., Wu, W. H., Hsu, L. H., and Lin, C. S., "Solid-Solid Reaction Between Sn-3Ag-0.5Cu Alloy and Au/Pd(P)/Ni(P) Metallization Pad with Various Pd(P) Thicknesses," Journal of Electronic Materials, vol. 41 no. 1, pp. 11-21, Jan. 2012.

Ho, C. E., Lin, Y. L., and Kao, C. R., "Strong Effect of Cu Concentration on the Reaction between Lead-Free Microelectronic Solders and Ni," Chemistry of Materials, vol. 14 no. 3, pp. 949-951, Mar. 2002.

Ho, C. E., Lu, M. K., Lee, P. T., Huang, Y. H., and Chou, W. L., "TEM investigation of interfacial microstructure and fracture mode of the Sn-Ag-Cu/Ni joint system," Materials Science and Engineering: A, vol. 706, pp. 269-278, Oct. 26, 2017.

Ho, C. E., Hsieh, W. Z., Liu, C. S., and Yang, C. H., "Theoretical and experimental determination of Cu diffusivity in eutectic Sn-Ag system at 235-280 °C," Thin Solid Films, vol. 572, pp. 238-244, Dec. 1, 2014.

Ho, C. E., Lin, Y. W., Yang, S. C., and Kao, C. R., "Volume Effect on the Soldering Reaction between SnAgCu Solders and Ni," IEEE/CPMT International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, CA, Mar. 16-18, 2005, pp. 39-44.

Ho, Cheng-En, Lin, Sheng-Wei, and Lin, Yen-Chen, "Effects of Pd concentration on the interfacial reaction and mechanical reliability of the Sn-Pd/Ni system," Journal of Alloys and Compounds , vol. 509 no. 29, pp. 7749-7757, July 21, 2011.

Ho, Cheng-En, Lee, Pei-Tzu, Chen, Chih-Nan, and Yang, Cheng-Hsien, "Electromigration in 3D-IC scale Cu/Sn/Cu solder joints," Journal of Alloys and Compounds, vol. 676, pp. 361-368, Aug. 15, 2016.

Ho, Cheng-En, Yang, Cheng-Hsien, Lee, Pei-Tzu, and Chen, Chih-Tsung, "Real-time X-ray microscopy study of electromigration in microelectronic solder joints," Scripta Materialia, vol. 114, pp. 79-83, Mar. 15, 2016.

Ho, Cheng En, Gierlotka, Wojciech, and Lin, Sheng Wei, "Strong effect of Pd concentration on the soldering reaction between Ni and Sn-Pd alloys," Journal of Materials Research, vol. 25 no. 11, pp. 2078-2081, Nov. 2010.

Ho, Cheng-Ying, Tsai, Meng-Ting, Duh, Jenq-Gong, and Lee, Jyh-Wei, "Bump height confinement governed solder alloy hardening in Cu/SnAg/Ni and Cu/SnAgCu/Ni joint assemblies," Journal of Alloys and Compounds, vol. 600, pp. 199-203, July 5, 2014.

Ho, Cheng-Ying, Duh, Jenq-Gong, Lin, Chih-Wei, Lin, Chun-Jen, Wu, Yu-Hui, Hong, Huei-Cheng, and Wang, Te-Hui, "Microstructural variation and high-speed impact responses of Sn-3.0Ag-0.5Cu/ENEPIG solder joints with ultra-thin Ni-P deposit," Journal of Materials Science, vol. 48 no. 6, pp. 2724-2732, Mar. 2013.

Ho, Cheng-Ying, and Duh, Jenq-Gong, "Optimal Ni(P) thickness design in ultrathin-ENEPIG metallization for soldering application concerning electrical impedance and mechanical bonding strength," Materials Science and Engineering: A, vol. 611, pp. 162-169, Aug. 12, 2014.

Ho, Cheng-Ying, and Duh, Jenq-Gong, "Quantifying the dependence of Ni(P) thickness in ultrathin-ENEPIG metallization on the growth of Cu-Sn intermetallic compounds in soldering reaction," Materials Chemistry and Physics, vol. 148 no. 1-2, pp. 21-27, Nov. 14, 2014.

Ho, Cheng-Ying, and Duh, Jenq-Gong, "Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn-3.0Ag0.5Cu solder," Materials Letters, vol. 92, pp. 278-280, Feb. 1, 2013.

Ho, Jessie, and Kretz, Connie, "Green electronics take root," Taipei Times, June 20, 2005.

Ho, L.-N., Nishikawa, H., Takemoto, T., Kashiwagi, Y., Yamamoto, M., and Nakamoto, M., "Characteristics of Electrically Conductive Adhesives filled with Copper nanoparticles with Organic Layer," European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Ho, Li-Ngee, and Nishikawa, Hiroshi, "Copper Filled Polyurethane Based Electrically Conductive Adhesive with Improved Mechanical Strength," 2013 European Microelectronics Packaging Conference, Grenoble, France, Sept. 9-12, 2013, pp. xx-xx.

Ho, Li-Ngee, Nishikawa, Hiroshi, and Takemoto, Tadashi, "Effect of different copper fillers on the electrical resistivity of conductive adhesives," Journal of Materials Science: Materials in Electronics, vol. 22 no. 5, pp. 538-544, May 2011.

Ho, Li-Ngee, and Nishikawa, Hiroshi, "Effect of porous copper on the properties of electrically conductive adhesives," Journal of Materials Science: Materials in Electronics , vol. 26 no. 10, pp. 7771-7779, Oct. 2015.

Ho, Li-Ngee, Nishikawa, Hiroshi, Natsume, Naohide, Takemoto, Tadashi, Miyake, Koichi, Fujita, Masakazu, and Ota, Koyu, "Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives," Journal of Electronic Materials, vol. 39 no. 1, pp. 115-123, Jan. 2010.

Ho, Li-Ngee, Wu, Teng Fei, Nishikawa, Hiroshi, Takemoto, Tadashi, Miyake, Koichi, Fujita, Masakazu, and Ota, Koyu, "Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives," Journal of Materials Science: Materials in Electronics, vol. 22 no. 7, pp. 735-740, July 2011.

Ho, Li-Ngee, and Nishikawa, Hiroshi, "Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives," Journal of Materials Science: Materials in Electronics, vol. 24 no. 6, pp. 2077-2081, June 2013.

Ho, Li-Ngee, and Nishikawa, Hiroshi, "Properties of Porous Copper Filled Electrically Conductive Adhesives," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 221-224.

Ho, Li-Ngee, and Nishikawa, Hiroshi, "Surfactant-Free Synthesis of Copper Particles for Electrically Conductive Adhesive Applications," Journal of Electronic Materials, vol. 41 no. 9, pp. 2527-2532, Sept. 2012.

Ho, Vu, Brown, Sue, Haythornthwaite, Ray, and Scansen, Don, "Get Ready to Get the Lead Out," Fabless Forum, vol. 11 no. 3.

Ho, Yun Peng, Luo, Jen Tsung, Hsu, Keven, and Chen, Arthur, "Reliability test and IMC investigation of lead and lead free solder joints on different surface finish processes," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 637-640.

Hoang, Ha-My, Duong, Thanh-Hung, Seo, Hyunwoong, Kim, Jae Won, Kim, Jin Young, and Kim, Hyun Chul, "Synthesis of brass nanowires and their use for organic photovoltaics," Materials Chemistry and Physics, vol. 246, pp. 122852-1-122852-9, May 1, 2020.

Hoare, James P., "On the Role of Additives in a Trivalent Chromium Plating Bath," The 72nd AES Annual Technical Conference Proceedings, Detroit, MI, July 1985, session D-4 pp. xx-xx.

Hoare, K., "What the new EU REACH regulation means for your business," Transactions of the Institute of Metal Finishing, vol. 87 no. 4, pp. 170-172, July 2009.

Hobbs, H. H., "Metal Whiskers: A Convection Connection," Materials Science Forum , vol. 50, pp. 39-43, 1991.

Hobbs, Herman H., "Effect of electric fields on growth of copper whiskers by chemical reduction," Journal of Applied Physics, vol. 53 no. 5, pp. 3903-3905, May 1982.

Hobbs, Herman H., and Stillwell, E. P., "Effective Method for Securing Electrical Contacts to Metal Whiskers," Review of Scientific Instruments, vol. 29, pp. 653-654, 1958.

Hobbs, Herman H., "Growth of Long Cobalt Whiskers by Chemical Reduction of Cobaltous Bromide," Journal of Crystal Growth, vol. 69 no. 2-3, pp. 377-378, Nov. 2, 1984.

Hobbs, Richard G., Petkov, Nikolay, and Holmes, Justin D., "Semiconductor Nanowire Fabrication by Bottom-Up and Top-Down Paradigms," Chemistry of Materials, vol. 24 no. 11, pp. 1975-1991, June 12, 2012.

Hoch, Michael, "Application of the Hoch-Arpshofen Model to the Thermodynamics of the Cu-Ni-Sn, Cu-Fe-Ni, Cu-Mg-Al, and Cu-Mg-Zn Systems," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 11 no. 3, pp. 237-246, July-Aug. 1987.

Hochst, H., Engelhardt, M. A., Bowman Jr., R. C., and Adams, P. M., "Characterisation of MBE-grown a-Sn films and a-Sn1-xGex alloys," Semiconductor Science and Technology, vol. 5 no. 3S, pp. S240-S244, Mar. 1990.

Hock, Friedemann, and Neumann, Kurt, "Die Verdampfungs- und Kondensationgeschwindigkeit des festen Kaliums," Zeitschrift fur Physikalische Chemie, vol. 2 no. 5&6, pp. 241-255, Dec. 1954.

Hodaj, F., Liashenko, O., Gusak, A., and Lyashenko, Y., "Heterogeneous nucleation and depletion effect in nanowire growth," Philosophical Magazine, vol. 91 no. 33, pp. 4200-4217, 2011. https://doi.org/10.1080/14786435.2011.607142

Hodaj, Fiqiri, Petit, Luc, Baggetto, Loic, Boisier, Olivier, and Verneyre, Lionel, "Undercooling of Sn-Ag-Cu alloys: solder balls and solder joints solidification," International Journal of Materials Research, vol. 104 no. 9, pp. 874-878, 2013.

Hodak, Michel, and Kusmic, Dubravka, "Solder Joint and Solder Fillet Optimization for Surface Mounted Terminal Blocks," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 314-319.

Hodges, S. LeAnn, and Lumpp, Janet K., "Evaluation of Lead-Free Solder and No-Clean Flux for Attachment of Packaged High Power Components to Direct Bond Copper," Proceedings 1996 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 2920), Minneapolis, MN, Oct. 8-10, 1996, pp. 308-313.

Hodges, Steve A., Uphues, Wendy M., and Tran, Mai T., "1 + 2 > 3 non-toxic corrosion inhibitor synergisms," Pigment and Resin Technology, vol. 27 no. 3, pp. 150-156, 1998.

Hodgin, Michael J., "Epoxies for OptoElectronic Packaging: Applications and Material Properties," Journal of Microelectronics and Electronic Packaging, vol. 1 no. 2, pp. 108-116, Second Quarter 2004.

Hodson, Timothy L., "Solder Paste - The Building Block For SMT Success," Electronic Packaging and Production, vol. 35 no. 6, pp. 49-52, 56, June 1995.

Hodulova, Erika, Palcut, Marian, Lechovic, Emil, Simekova, Beata, and Ulrich, Koloman, "Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X (X = Bi, In) solders with Cu substrate," Journal of Alloys and Compounds , vol. 509 no. 25, pp. 7052-7059, June 23, 2011.

Hodulova, Erika, Simekova, Beata, and Kovarikova, Ingrid, "Structural Changes of the IMC in Lead Free Solder Joints," Materials Transactions, JIM, vol. 56 no. 7, pp. 1043-1046, 2015.

Hoevel, Bernd, Valette, Ludovic, and Gan, Joseph, "New epoxy resins for printed wiring board applications," Circuit World , vol. 33 no. 2, pp. 17-27, 2007.

Hoffman, E. N., Barsoum, M. W., Wang, W., Doherty, R. D., and Zavaliangos, A., "On the Spontaneous Growth of Soft Metallic Whiskers," Proceedings of the Fifty-First IEEE Holm Conference on Electrical Contacts, Chicago, IL, Sept. 26-28, 2005, pp. 121-126.

Hoffman, George A., "Materials for Space Flight," IAS-ARS Space Exploration Meeting , San Diego, CA, Jug. 5-6, 1958, pp. xx-xx.

Hoffman, George A., "Whiskers," Journal of Metals, vol. 10 no. 9, pp. 591-595, Sept. 1958.

Hoffman, Jean M., "Hex-chrome-free process turns the screws on corrosion," Machine Design , vol. 74 no. 23, pp. 98-99, Dec. 12, 2002.

Hoffman, John, "Automotive coatings raise innovation bar," Chemical Market Reporter , vol. 267 no. 17, pp. 20, Apr. 25, 2005.

Hoffman, P., Kleiner, T., Phan, H., and Parthasarathi, A., "Characteristics of Tin Plated TAB Tape," Proceedings of the Ninth Annual International Electronics Packaging Conference, San Diego, CA, Sept. 11-13, 1989, pp. 1307-1319.

Hoffman, R. E., and Turnbull, D., "Lattice and Grain Boundary Self-Diffusion in Silver," Journal of Applied Physics, vol. 22 no. 5, pp. 634-639, May 1951.

Hoffmann, T., Mazur, J., Nikliborc, J., and Rafalowicz, J., "Influence of the electric field on the silver and iron whiskers growth," British Journal of Applied Physics, vol. 12 no. 11, pp. 635-636, Nov. 1961.

Hoffman III, William F., "Materials Reporting and Test Methods at Motorola Labs," Standardization News, vol. 33 no. 6, pp. 34-37, June 2005.

Hofman, T., Mazur, J., Nikliborc, J., and Rafalowicz, J., "The influence of an electric field on the growth of copper whiskers," British Journal of Applied Physics, vol. 12 no. 7, pp. 342-343, July 1961.

Hoge, Carl E., "Electrically Conductive "No-Cure" Die Bond Adhesive Formulations for Microelectronic Assembly," Proceedings of the Technical Program NEPCON West '99, Volume 1, Anaheim, CA, Feb. 23-25, 1999, pp. 384-394.

Hogerton, Peter B., "Development goals and present status of 3M's adhesive interconnection technology," Journal of Electronics Manufacturing, vol. 3 no. x, pp. 191-197, 1993.

Hoiboom, Frank, "Chemical tin surface with twelve months` solderability," evertiq , Sept. 21, 2005.

Hokka, J., Mattila, T. T., and Paulasto-Krockel, M., "Effects of Shock Impact Repetition Frequency on the Reliability of Component Boards," 2011 IEEE 61st Electronic Components and Technology Conference , Lake Buena Vista, FL, May 31-June 3, 2011, pp. 447-453.

Hokka, J., Caers, J. F. J. M., Zhao, X. J., De Jong, M., Peels, W., Sykes, B., Zhang, G. Q., and Paulasto-Krockel, M., "High-Speed Mechanical Impact Reliability of Solder Interconnections in High-Power LEDs," 2010 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, Bordeaux, France, Apr. 26-28, 2010, pp. xx-xx.

Hokka, Jussi, Mattila, Toni T., Li, Jue, Teeri, Jarmo, and Kivilahti, Jorma. K., "A novel impact test system for more efficient reliability testing," Microelectronics Reliability, vol. xx no. x, pp. xx-xx, xxxx.

Hokka, Jussi, Li, Jue, Mattila, Toni T., and Paulasto-Krockel, Mervi, "The reliability of component boards studied with different shock impact repetition frequencies," Microelectronics Reliability, vol. 52 no. 7, pp. 1445-1453, July 2012.

Hokka, Jussi, Mattila, Toni. T., Xu, Hongbo, and Paulasto-Krockel, Mervi, "Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections. Part 1: Effects of Test Parameters," Journal of Electronic Materials, vol. 42 no. 6, pp. 1171-1183, June 2013.

Hokka, Jussi, Mattila, Toni T., Xu, Hongbo, and Paulasto-Krockel, Mervi, "Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections - Part 2: Failure Mechanisms," Journal of Electronic Materials, vol. 42 no. 6, pp. 963-972, June 2013.

Hokka, Jussi, "Thermal Cycling Reliability of SnAgCu Solder Interconnections," 4th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Aalborg, Denmark, May 29, 2013.

Holanda, J., Campos, C. L. A. V., Franca, C. A., and Padron-Hernandez, E., "Effective surface anisotropy in polycrystalline ferromagnetic nanowires," Journal of Alloys and Compounds, vol. 617, pp. 639-641, Dec. 25, 2014.

Holden, Happy, "Lowering Layers w/HDI for RoHS Robustness," IPC Printed Circuits Expo, Los Angeles, Feb. 20-22, 2007, pp. xx-xx.

Holder, Helen, "BFR & PVC Update," It's Not Easy Being Green, San Jose, CA, Feb. 4-5, 2009, pp. xx-xx.

Holder, Helen, and Roesch, Michael, "Brominated Flame Retardant (BFR) and Polyvinyl Chloride (PVC) Free Material Evaluation Requirements," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Holder, Helen, "HP Halogen-Free PCB Qualification Protocol," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Holder, Helen, Henshall, Gregory, Maloney, Aileen, Benedetto, Elizabeth, Troxel, Kris, Oviedo, Guillermo, Miremadi, Jian, and Roesch, Michael, "Test Data Requirements for Assessment of Alternative Pb-Free Solder Alloys," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 150-161.

Holder, Helen, Henshall, Gregory, Maloney, Aileen, et al, "Test data requirements for assessment of alternative Pb-free solder alloys," Global SMT and Packaging, vol. 8 no. 11, pp. 12-16,18, Nov. 2008.

Holdermann, Ken, Cuddalorepatta, Gayatri, and Dasgupta, Abhijit, "Dynamic Recrystallization of Sn3.0Ag0.5Cu Pb-Free Solder Alloy," 2008 ASME International Mechanical Engineering Congress and Exposition, Volume 6 , Boston, MA, Oct. 31-Nov. 6, 2008, pp. 163-169.

Holdway, Rob, "Body of Evidence," Engineering, vol. 246 no. 4, pp. 34-36, Apr. 2005.

Holladay, A. M., "All-tantalum wet-slug capacitor overcomes catastrophic failure," Electronics, vol. 51 no. 4, pp. 105-108, Feb. 16, 1978.

Holland, Barry, "RESPONSIBLE actions now an obligation," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Sept. 2003.

Holland, Colin, "Anglia aims to cut RoHS confusion," EE Times Europe, May 20, 2005.

Holland, Colin, "Anglia aims to cut RoHS confusion," Green SupplyLine, May 20, 2005.

Holland, Colin, "Arrow provides WEEE guide for manufacturers," EE Times Europe , Aug. 22, 2005.

Holland, Colin, "Arrow provides WEEE guide for manufacturers," Green SupplyLine , Aug. 22, 2005.

Holland, Colin, "Auto agency gets WEEE responsibility for U.K.," EE Times Europe , vol. xx no. xx, pp. xx-xx, May 21, 2007.

Holland, Colin, "BOM RoHS conversion free from Farnell InOne," Green SupplyLine , Nov. 30, 2005.

Holland, Colin, "BoM RoHS conversion free from Farnell InOne," EE Times Europe , Nov. 30, 2005.

Holland, Colin, "COG booklet tackles RoHS," EE Times Europe, Nov. 22, 2005.

Holland, Colin, "COG booklet tackles RoHS," Green SupplyLine, Nov. 22, 2005.

Holland, Colin, "Companies urged to take up free advice on WEEE," Green SupplyLine , Aug. 17, 2005.

Holland, Colin, "Companies urged to take up free advice on WEEE," EE Times Europe , Aug. 17, 2005.

Holland, Colin, "Component obsolescence comes under scrutiny," EE Times Europe , May 5, 2005.

Holland, Colin, "Component obsolescence comes under scrutiny," Green SupplyLine , May 5, 2005.

Holland, Colin, "Densitron Displays signs up to help on WEEE," EE Times Europe , vol. xx no. xx, pp. xx-xx, May 18, 2007.

Holland, Colin, "DTI confirms WEEE implementation delayed to June 2006," Green SupplyLine, Aug. 11, 2005.

Holland, Colin, "DTI confirms WEEE implementation delayed to June 2006," EE Times Europe, Aug. 11, 2005.

Holland, Colin, "EC conducts study to simplify RoHS/WEEE directives," EE Times - Asia, vol. xx no. xx, pp. xx-xx, Aug. 3, 2007.

Holland, Colin, "ELFNET seeks cooperation on RoHS," Green SupplyLine, Oct. 11, 2005.

Holland, Colin, "Environmental alerts to help small businesses," EE Times Europe , Jan. 31, 2006.

Holland, Colin, "Environmental alerts to help small businesses," Green SupplyLine , Jan. 31, 2006.

Holland, Colin, "Environmental footprints need cutting to meet energy goals," EE Times Europe, July 21, 2006.

Holland, Colin, "Environmental footprints need cutting to meet energy goals," Green SupplyLine, July 21, 2006.

Holland, Colin, "Executives urged to prepare for recycling and hazardous substance legislation," EE Times Europe, Nov. 14, 2003.

Holland, Colin, "Executives urged to prepare for recycling and hazardous substance legislation," Green SupplyLine, Nov. 14, 2003.

Holland, Colin, "Experts provide lead-free advice," EE Times Europe, July 12, 2006.

Holland, Colin, "Flame retardants ban being overlooked in U.K.," EE Times Europe , Sept. 13, 2004.

Holland, Colin, "Flame retardants ban being overlooked in U.K.," Green SupplyLine , Sept. 13, 2004.

Holland, Colin, "Free report provides lead-free assistance," EE Times Europe, July 11, 2006.

Holland, Colin, "Free report provides lead-free assistance," Green SupplyLine , July 11, 2006.

Holland, Colin, "GAMBICA WEEE initiative gains European recognition," EE Times Europe, June 6, 2005.

Holland, Colin, "Input sought for European Commission study on RoHS/WEEE," EE Times Europe, vol. xx no. xx, pp. xx-xx, Aug. 1, 2007.

Holland, Colin, "Lead ban likely to accelerate obsolescence problems," EE Times Europe, Oct. 21, 2004.

Holland, Colin, "Lead ban likely to accelerate obsolescence problems," Green SupplyLine, Oct. 25, 2004.

Holland, Colin, "Lead ban likely to accelerate obsolescence problems," Green SupplyLine, Oct. 25, 2004.

Holland, Colin, "Lead-free seminar attendees to miss deadline," Green SupplyLine , Mar. 3, 2006.

Holland, Colin, "Mix of services to provide RoHS help," Green SupplyLine, July 18, 2005.

Holland, Colin, "Mix of services to provide RoHS help," EE Times Europe, Sept. 18, 2005.

Holland, Colin, "NWML gets responsibility for enforcing RoHS in U.K.," EE Times Europe, July 21, 2005.

Holland, Colin, "NWML gets responsibility for enforcing RoHS in U.K.," Green SupplyLine, July 21, 2005.

Holland, Colin, "PC recycling comes under scrutiny," Green SupplyLine, Mar. 8, 2004.

Holland, Colin, "PC recycling comes under scrutiny," EE Times Europe, Mar. 8, 2004.

Holland, Colin, "Recycling service provides alternatives," Green SupplyLine, Nov. 16, 2004.

Holland, Colin, "RoHS report comes under scrutiny in Brussels," EE Times Europe , June 26, 2008.

Holland, Colin, "RTEL to run WEEE settlement centre," EE Times Europe, vol. xx no. xx, pp. xx-xx, July 12, 2007.

Holland, Colin, "Supply chain initiative to help on WEEE and RoHS," EE Times Europe , Aug. 17, 2004.

Holland, Colin, "U.K. confirms WEEE legal delay to June 2006," EE Times, Aug. 11, 2005.

Holland, Colin, "UK slow to take lead-free seriously," EE Times Europe, Aug. 8, 2003.

Holland, Colin, "UK slow to take lead-free seriously," Green SupplyLine, Aug. 8, 2003.

Holland, Colin, "WEEE consultation starts, timetable made public," EE Times Europe , July 26, 2006.

Holland, Colin, "WEEE implementation faces further delay," EE Times Europe, Dec. 15, 2005.

Holland, Colin, "WEEE implementation faces further delay," Green SupplyLine, Dec. 15, 2005.

Holland, Colin, "WEEE raises IT issues," Green SupplyLine, Dec. 8, 2005.

Holland, Colin, "WEEE schemes work together to find contractors," EE Times Europe , June 29, 2005.

Holland, Colin, "WEEE schemes work together to find contractors," Green SupplyLine , June 29, 2005.

Holland, Colin, "WEEE the present and the future," EE Times Europe, Dec. 8, 2005.

Hollenbeck, Al, "Flexible Polymer Circuits," Appliance Design, vol xx no. x, pp. xx-xx, June 28, 2000.

Holliday, Richard, and Goodman, Paul, "Going for Gold," IEE Review, vol. 48 no. 3, pp. 15-19, May 2002.

Holloway, Matthew, Konarski, Mark, and Ward, Mary, "Accelerated Aging of Electrically Conductive Adhesives," Proceedings of the Technical Program NEPCON West '96, Volume 2, Anaheim, CA, Feb. 25-29, 1996, pp. 785-787.

Holloway, Matthew, Ward, Mary, and Scully, Luana, "Anisotropically Conducting Adhesives for Direct Chip Attach," Proceedings of the Technical Program NEPCON West '99, Volume 1, Anaheim, CA, Feb. 23-25, 1999, pp. 375-383.

Holloway, Matthew, and Ward, Mary, "Novel ACF for flip-chip attach," Electronics Engineer, vol. xx no. xx, pp. xx-xx, June 2000.

Holloway, Matthew J., Ward, Mary B., and Scully, Luana V., "Novel Anisotropically Conductive Film for Area Array Packaging," Advances in Electronic Packaging 1999, Volume 2 (EEP-Vol. 26-2), Maui, Hawaii, June 13-19, 1999, pp. 1699-1704.

Holm, Elizabeth, Neilsen, Michael, and Vianco, Paul, "Modeling the aging and reliability of solder joints," Sandia Report SAND2009-4752C, 2009.

Holman, Eric, and Smith, Terry, "Laminate Materials for No-Lead Solder Applications," IPC Printed Circuits Expo 2001, Anaheim, CA, Apr. 1-5, 2001, pp. S15-4-1 to S15-4-4.

Holmberg, Mika, Lenkkeri, Jaakko, Lahti, Markku, and Wiik, Bengt, "Reliability of adhesive joints in dual interface smart cards," 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Zalaegerszeg, Hungary, June 23-26, 2002, pp. 49-53.

Holmberg, Vincent C., Patel, Reken N., and Korgel, Brian A., "Electrostatic charging and manipulation of semiconductor nanowires," Journal of Materials Research, vol. 26 no. 17, pp. 2305-2310, Sept. 14, 2011.

Holmbom, G., Abys, J. A., Straschil, H. K., and Svensson, M., "Electrodeposition, Growth Morphology & Melting Characteristics of Gold-Tin Eutectic Alloys," Plating & Surface Finishing, vol. 85 no. 4, pp. 66-73, Apr. 1998.

Holmbom, Goran, Humiec, F., Abys, J. A., Kudrak, E. J., Breck, G. F., and Boguslavsky, I., "Materials Properties of Palladium Alloy Electrodeposits," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. 491-497.

Holmbom, Goran, Humiec, F., Abys, J. A., Kudrak, E. J., Breck, G. F., and Hayashi, Tadeo, "Research & Developments in Lead-free Solder Plating in Japan," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. 499-515.

Holmes, E. L., and Winegard, W. C., "Grain Growth in Zone-Refined Tin," Acta Metallurgica, vol. 7 no. 6, pp. 411-414, June 1959.

Holtzer, Mitch, and Mok, Tuck Weng, "Eliminating Wave Soldering with Low Melting Point Solder Paste," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 889-894.

Holtzer, Mitch, and Liberatore, Michael, "Halogens in Lead Free Solder Paste," SMTA International Conference , San Diego, CA, Oct. 4-8, 2009, pp. 814-815.

Holtzer, Mitch, "Minimizing the Risk of Tin Whisker Formation in Lead-Free Assemblies," Surface Mount Technology (SMT), vol. 30 no. 2, pp. 80,82, Feb. 2015.

Holzmann, Matthew, "An Open Letter to IPC," Circuitree, vol. 19 no. 9, pp. xx-xx, Sept. 2006.

Holzmann, Rudiger, "Basic Study on the Use of Lead-Free Solder Materials in the Rework Process," Lead-Free Magazine, vol. 5, 2005.

Hom, Bance, and Winkler, Sandra, "History repeats itself in the form of matte tin," Advanced Packaging, vol. xx no. xx, pp. xx-xx, ??.

Homer, C. E., and Watkins, H. C., "Transformation of Tin at Low Temperatures," The Metal Industry, vol. 60 no. 22, pp. 364-366. May 29, 1942.

Homer, Seth, and Lasky, Ronald C., "Flux Impact on Void Reduction in Bottom Terminated Components," Printed Circuit Design and Fab/ Circuits Assembly, vol. 31 no. 3, pp. 52,54,56,58, Mar. 2014.

Hon, Min-Hsiung, Chang, Tao-Chih, and Wang, Moo-Chin, "Phase transformation and morphology of the intermetallic compounds formed at the Sn-9Zn-3.5Ag/Cu interface in aging," Journal of Alloys and Compounds , vol. 458 no. 1-2, pp. 189-199, June 30, 2008.

Honbo, Ryoichi, Wakabayashi, Hiroyuki, Murakami, Youichi, Inayoshi, Naruhiko, Inukai, Kyoji, Shimoyama, Takeshi, Sawa, Koichiro, and Morita, Naoki, "Development of The Lead-Free Brush Material for The High-Load Starter," Proceedings of the Fifty-First IEEE Holm Conference on Electrical Contacts, Chicago, IL, Sept. 26-28, 2005, pp. 298-303.

Honda, Nobuyuki, "Environmental Friendly Materials and Lead -Free," Printed Circuits Expo 2000, San Diego, CA, Apr. 2-6, 2000, pp. S16-3-1-S16-3-5.

Hong, Bor Zen, and Ray, Sudipta K., "Ceramic Column Grid Array Technology with Coated Solder Columns," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 1347-1353.

Hong, Bor Zen, "Thermal Fatigue Analysis of a CBGA Package with Lead-free Solder Fillets," 6th InterSociety Conference on Thermomechanical Phenomena in Electronic Systems, ITherm '98, Seattle, WA, May 27-30, 1998, pp. 205-211.

Hong, G., Siow, K. S., Zhiqiang, G., and Hsieh, A. K., "Hard Chromium Plating From Trivalent Chromium Solution," Plating & Surface Finishing, vol. 88 no. 3, pp. 69-75, Mar. 2001.

Hong, Gu, Siow, Kok Siong, Zhiqiang, Gao, and Hsieh, An Kong, "A Novel Chromium Plating from Trivalent Chromium Solution," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Hong, I-Hsuan, and Ke, Jhih-Sian, "Determining advanced recycling fees and subsidies in "E-scrap" reverse supply chains," Journal of Environmental Management, vol. 92 no. 6, pp. 1495-1502, June 2011.

Hong, Jauwhei, and Chason, Marc, "X-ray Diffraction Study of Copper-Tin Intermetallic Compounds on Solder-Coated PC Boards," Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium, Lake Buena Vista, FL, Oct. 10-12, 1988, pp. 149-154.

Hong, K. K., Ryu, J. B., Park, C. Y., and Huh, J. Y., "Effect of Cross-Interaction between Ni and Cu on Growth Kinetics of Intermetallic Compounds in Ni/Sn/Cu Diffusion Couples during Aging," Journal of Electronic Materials, vol. 37 no. 1, pp. 61-72, Jan. 2008.

Hong, K. K., and Huh, J. Y., "Phase Field Simulations of Morphological Evolution and Growth Kinetics of Solder Reaction Products," Journal of Electronic Materials, vol. 35 no. 1, pp. 56-64, Jan. 2006.

Hong, RongHua, and Wang, Jun, "Effect of Thermal Shock Profile on solder joint of WLCSP," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 641-646.

Hong, Ruei-You, Cheng, Hsien-Chie, Hu, Hsuan-Chi, and Chen, Wen-Hwa, "Characterization of Elastic-Plastic Properties of Intermetallic Compounds," 2016 International Conference on Electronics Packaging, Hokkaido, Japan, Apr. 20-22, 2016, pp. 282-285.

Hong, S. J., Park, B-H., Seo, D. S., and Ryu, C.-R., "Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique," Surface Engineering, vol. 24 no. 5, pp. 337-340, Sept. 2008. https://doi.org/10.1179/174329408X281821

Hong, Seongik, and Kim, Namsoo, "Synthesis of 3D Printable Cu-Ag Core-Shell Materials: Kinetics of CuO Film Removal," Journal of Electronic Materials, vol. 44 no. 3, pp. 823-830, Mar. 2015.

Hong, Soon-Min, Kang, Choon-Sik, and Jung, Jae-Pil, "Flux-Free Direct Chip Attachment of Solder-Bump Flip Chip by Ar + H2 Plasma Treatment," Journal of Electronic Materials, vol. 31 no. 10, pp. 1104-1111, Oct. 2002.

Hong, Soon-Min, Park, Jae-Yong, Jung, Jae-Pil, and Kang, Choon-Sik, "Fluxless Wetting Properties of Top Surface Metallurgy in Different Pb-Free Solders," Materials Transactions, vol. 42 no. 7, pp. 1423-1427, July 2001.

Hong, Soon-Min, Kang, Choon-Sik, and Jung, Jae-Pil, "Plasma Reflow Bumping of Sn-3.5 Ag Solder for Flux-Free Flip Chip Package Application," IEEE Transactions on Advanced Packaging, vol. 27 no. 1, pp. 90-96, Feb. 2004.

Hong, Sung Chul, Jung, Do Hyun, Lee, Wang Gu, Kim, Wonjoong, and Jung, Jae Pil, "Non-PR Sn-3.5Ag Bumping on a Fast Filled Cu-Plug by PPR Current," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 4, pp. 574-580, Apr. 2013.

Hong, Won Sik, Oh, Chulmin, Kim, Mi-Song, Lee, Young Woo, Kim, Hui Joong, Hong, Sung Jae, and Moon, Jeong Tak, "Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics," Journal of Electronic Materials, vol. 45 no. 12, pp. 6150-6162, Dec. 2016.

Hong, Won Sik, Yu, Jinju, and Oh, Chulmin, "Effect of Component Density on Sn-3.0Ag-0.5Cu Solder Joint Reliability Under Harsh Environment," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Hong, Won Sik, Oh, Chul Min, and Kim, Do Seop, "Mitigation and Verification Methods for Sn Whisker Growth in Pb-Free Automotive Electronics." Journal of Electronic Materials, vol. 42 no. 2, pp. 332-347, Feb. 2013.

Hong, Won Sik, and Kim, A Young, "Shear Strength Degradation of Pb-Free Solder Joint with Mounted Location in Automobile," Materials Transactions, JIM, vol. 56 no. 7, pp. 1002-1006, 2015.

Hong, Xiao, and Lai, Ping, "The Popcorn Effect of Lead and Lead-free Mixed Assembly Process in High Density Plastic Packages," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 176-179.

Hongtao, Chen, Chunqing, Wang, and Mingyua, Li, "Mechanical Shock Modeling and Testing of lead-free solder joint in Hard Disk Drive Head Assembly," Proceedings of 2005 International Conference on Asian Green Electronics, Shang Hai, China, Mar. 15-18, 2005, pp. 192-196.

Hongwu, Zhang, Tianhao, Zhao, Yang, Liu, and Fenglian, Sun, "Effect of temperature on failure mode of solder joint under vibration loading condition," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 853-856.

Honore, J. P., Rubin, H. D., and Zierold, M. K., "Reliability Testing of Conductive Adhesives," Proceedings of the Technical Program NEPCON West '92, Volume III, Anaheim, CA, Feb. 23-27, 1992, pp. 1372-1380.

Honselmann, Jennifer, Mankel, Eric, and Volk, Peter, "Formation of Trivalent Chromium Passivation Layers," Products Finishing , vol. 82 no. 6, pp. 18-22, Mar. 2018.

Hoo, Nick, "RoHS screening: Your questions answered," evertiq, July 4, 2005.

Hooper, R. J., Adams, D. P., Hirschfeld, D., and Manuel, M. V., "The Effect of Substrate Microstructure on the Heat-Affected Zone Size in Sn-Zn Alloys Due to Adjoining Ni-Al Reactive Multilayer Foil Reaction," Journal of Electronic Materials, vol. 45 no. 1, pp. 1-11, Jan. 2016.

Hoornstra, Jaap, Schubert, Gunnar, Broek, Kees, Granek, Filip, and LePrince, Cecile, "Lead Free Metallisation Paste for Crystalline Silicon Solar Cells: From Model to Results," Conference Record of the Thirty-first IEEE Photovoltaic Specialists Conference, Orlando, FL, Jan. 3-7, 2005, pp. 1293-1296.

Hopkins, Steve, "RoHS-compliant products pose inventory management challenges," Green SupplyLine, June 20, 2005.

Hopper, Ann, "Controlled Modification of Surfaces at the nanoscale," Transactions of the IMF, vol. 92 no. 3, pp. 123-124, 2014. https://doi.org/10.1179/0020296714Z.000000000181

Hoque, Mohd Aminul, Haq, Mohammad Ashraful, Chowdhury, Md Mahmudur, Suhling, Jeffrey C., and Lall, Pradeep, "Cyclic Stress-Strain and Constitutive Behaviors of SAC-Bi-Ni-Sb Solder Alloys During Fatigue Testing," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 1211-1220.

Hoque, Mohd Aminul, Chowdhury, Md Mahmudur, Fu, Nianjun, Suhling, Jeffrey C., Hamasha, Sa'd, and Lall, Pradeep, "Evolution of the Cyclic Stress-Strain and Constitutive Behaviors of Doped Lead Free Solder During Fatigue Testing," 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , San Diego, CA, May 29-June 1, 2018, pp. 1387-1395.

Hoque, Mohd Aminul, Chowdhury, Md Mahmudur, Hamasha, Sa'd, Suhling, Jeffrey C., and Lall, Pradeep, "Evolution of the Mechanical Properties of Lead Free Solder Joints Subjected to Mechanical Cycling," 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 28-31, 2019, pp. 295-302.

Hoque, Mohd Aminul, Haq, Mohammad Ashraful, Chowdhury, Md Mahmudur, Suhling, Jeffrey C., and Lall, Pradeep, "Evolution of the Properties of SAC-Bi-Ni-Sb Lead Free Solder During Mechanical Cycling," 2020 IEEE 70th Electronic Components and Technology Conference, Lake Buena Vista, AL, May 26-29, 2020, pp. 2048-2057.

Horaud, Walter, Leroux, Sylvain, Fremont, Helene, and Navarro, Dominique, "PCB Materials Behaviours towards Humidity and Impact of the Design, Finishes, Baking and Assembly Processes on Assembly Quality and Solder Joint Reliability," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S07-2-1-S07-2-39.

Hormadaly, J., "New Lead-Free Thick Film Resistors," Proceedings 2002 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4931), Denver, CO, Sept. 4-6, 2002, pp. 543-547.

Horn, Debbie, "Compliance Requirements for the European Union Directive on the Restriction of the Use of Hazardous Substances (RoHS) in Electrical and Electronic Equipment for IBM Products," IBM Engineering Specification 97P3864, Aug. 19, 2004.

Horn, Debbie, "Compliance Requirements for European Union Directive on the Restriction of the Use of Certain Hazardous Substances (RoHS) in Electrical and Electronic Equipment for IBM Server and Storage Products," IBM Engineering Specification 53P6233, Aug. 19, 2004.

Horn, Debra A., "EU RoHS Recast - New Requirements and Impacts for the Information and Communications Technology Industry," 2012 IEEE International Symposium on Sustainable Systems and Technology, Boston, MA, May 16-18, 2012, pp. xx-xx.

Horn, Richard E., "An Overview of Tin and Tin Alloy Plating Particularly as Applied to the Electronics Industry," 1992 Proceedings 12th Capacitor and Resistor Technology Symposium, Tucson, AZ, Mar. 16-19, 1992, pp. 66-75.

Horsley, R. M., Ekere, N. N., and Salam, B., "Effect of Lead-free BGA Rework on Joint Microstructure and Intermetallic Compound Formation," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1497-1501.

Horsley, Robert, "Pb-Free Processing in Japan," NEPCON UK, Birmingham, United Kingdom, Apr. 3-5, 2001.

Horvath, Barbara, Shinohara, Tadashi, and Illes, Balazs, "Corrosion properties of tin-copper alloy coatings in aspect of tin whisker growth," Journal of Alloys and Compounds, vol. 577, pp. 439-444, Nov. 15, 2013.

Horvath, Barbara, Illes, Balazs, Shinohara, Tadashi, and Harsanyi, Gabor, "Effects of Humidity on Tin Whisker Growth - Investigated on Ni and Ag Underplated Layer Construction," Thin Solid Films, vol. 520 no. 1, pp. 384-390, Oct. 31, 2011.

Horvath, Barbara, "Influence of copper diffusion on the shape of whiskers grown on bright tin layers," Microelectronics Reliability, vol. 53 no. 7, pp. 1009-1020, July 2013.

Horvath, Barbara, Illes, Balazs, and Harsanyi, Gabor, "Investigation of Tin Whisker Growth: The Effects of Ni and Ag Underplates," 32nd International Spring Seminar on Electronics Technology, Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.

Horvath, Barbara, and Harsanyi, Gabor, "Mechanical Stress Induced Whiskers," 2009 15th International Symposium for Design and Technology of Electronics Packages, Gyula, Hungary, Sept. 17-20, 2009, pp. 389-393.

Horvath, Barbara, "The directive on RoHS, and the examination of the restricted materials with XRF machine," 31st International Spring Seminar on Electronics Technology, Budapest, Hungary, May 7-11, 2008, pp. 130-133.

Horvath, Barbara, Illes, Balazs, Shinohara, Tadashi, and Harsanyi, Gabor, "Whisker growth on annealed and recrystallized tin platings," Thin Solid Films, vol. 520 no. 17, pp. 5733-5740, June 30, 2012.

Hoshino, Shigeo, "Development of Chromium Plating and Environmental Problems," Hyomen Gijutsu (Journal of the Surface Finishing Society of Japan), vol. 56 no. 6, pp. 302-307, June 2005.

Hoshino, Toshiharu, and Suzuki, Katsuhisa, "Localized Orbital Approach to Electronic Structure of Covalent Semiconductors. I. Energy Bands of Diamond-Type Crystals," Journal of the Physical Society of Japan, vol. 47 no 4, pp. 1141-1151, Oct. 1979.

Hoshino, Yoshiaki, "Critical Control Point for Material Composition of Products," Journal of the Surface Finishing Society of Japan, vol. 57 no. 12, pp. 823-830, 2006.

Hoske, Mark T., "Lifecycle Environmentalism," Control Engineering, vol. 51 no. 1, pp. 36-40, Jan. 2004.

Hoske, Mark T., "Talk to suppliers about RoHS compliance," Control Engineering , vol. xx no. xx, pp. xx-xx, Mar. 3, 2005.

Hosking, F. Michael, Vianco, Paul T., Frear, Darrell, R., and Robinson, David G., "Development of Lead-free Solders for Hybrid Microcircuits," Sandia Report SAND96-0062C.

Hosking, F. Michael, Vianco, Paul T., Rejent, Jerome A., and Hernandez, Cynthia L., "Environmentally Compatible Solder Materials for Thick Film Hybrid Assemblies," Sandia Report SAND97-0109C, CONF-970616--3.

Hosking, F. Michael, Vianco, Paul T., Hernandez, Cynthia L, and Rejent, Jerome A., "Wetting Behavior of Alternate Solder Alloys," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume I, San Jose, CA, Aug. 31-Sept. 2, 1993, pp. 476-483.

Hosoda, Kazuki, Asakawa, Motoo, Kajino, Satoshi, and Maeda, Y., "Effect of die semi-angle and multi-pass drawing on additional shear strain layer," Wire Journal International, vol. 41 no. 11, pp. 68-73, Nov. 2008.

Hossain, Mohammad M., Aravamudhan, Srinivasa R., Nowakowski, Marilyn, Ma, Xiaoqing, Walwadkar, Satyajit S., Kulkarni, Vijay, and Muthukumar, Sriram, "Board Level Solder Joint Assembly and Reliability for Ultra Thin BGA Packages," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 43-48.

Hossain, Mohammad M., Reinikainen, Tommi, Viswanadham, Puligandia, Agonafer, Dereje, and Lakhkar, Nikhil, "Characterization of Sn-Ag-Cu Solder Under Tensile and Shear Loading," SMTAnews & Journal of Surface Mount Technology, vol. 20 no. 4, pp. 30-41, Oct.-Dec. 2007.

Hossain, Mohammad M., Zahedi, Fahad, Agonafer, Dereje, Viswanadham, Puligandla, and Dunford, Steven O.. "Reliability of Lead (Pb) Free SAC Solder Interconnects with Different PWB Surface Finishes under Mechanical Loading," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 2, 2006, pp. 1038-1048.

Hossain, Mohammad M., Zahedi, Fahad, Lakhakar, Nikhil, Viswanadham, Puligandla, Dunford, Steven O., and Agonafer, Dereje, "Reliability of Tin-Silver-Copper Lead-Free Solder Interconnects Under Mechanical Loading With Different PWB Surface Finishes," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 724-732.

Hossain, Mohammad M., Agonafer, Dereje, Viswanadham, Puligandia, and Reinikainen, Tommi, "Strain Based Approach for Predicting the Solder Joint Fatigue Life with the Addition of Intermetallic Compound Using Finite Element Modeling," The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 358-367.

Hossain, Mohammad, Lakhkar, Nikhil, Viswanadham, Puligandla, and Agonafer, Dereje, "The Influence of Final Finish on Lead-Free Assembly Reliability," Printed Circuit Design and Fab, vol 25 no. 11, pp. 36-39, Nov. 2008.

Hotta, Yuji, Maeda, Masako, Asai, Fumiteru, and Eriguchi, Fuyuki, "Development of 0.025mm pitch Anisotropic Conductive Film," 1998 Proceedings 48th Electronic Components & Technology Conference, Seattle, WA, May 25-28, 1998, pp. 1042-1046.

Hou, Eric, Chung, D. F., and Wang, Paul, "Silver Nitric-An Innovative Process Indicator for Oxidation of PCB with OSP Finish," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 703-707.

Hou, J. P., Wang, Q., Yang, H. J., Wu, X. M., Li, C. H., Li, X. W., and Zhang, Z. F., "Microstructure evolution and strengthening mechanisms of cold-drawn commercially pure aluminum wire," Materials Science and Engineering: A , vol. 639, pp. 103-106, July 15, 2015.

Hou, Lin, Derakhshandeh, Jaber, Beyne, Eric, and De Wolf, Ingrid, "A Novel Resistance Measurement Methodology for In Situ UBM/Solder Interfacial Reaction Monitoring," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 10 no. 1, pp. 30-38, Jan. 2020.

Hou, N., Belyakov, S. A., Pay, L., Sugiyama, A., Yasuda, H., and Gourlay, C. M., "Competition between stable and metastable eutectic growth in Sn-Ni alloys," Acta Materialia, vol. 149, May 1, 2018, pp. 119-131.

Hou, Ru Z., Wu, Aiying, and Vilarinho, Paula M., "Low-Temperature Hydrothermal Deposition of (BaxSr1-x)TiO3 Thin Films on Flexible Polymeric Substrates for Embedded Applications," Chemistry of Materials, vol. 21 no. 7, pp. 1214-1220, Apr. 14, 2009.

Hou, S. Y., Shih, C. W., Wu, W. C., Hsieh, C. H., Su, A. J., Tung, C. H., Jeng, S. P., Li, M. J., and Yu, Doug. C. H., "Lead-Free Flip Chip Solution for 40 nm Extreme Low-k Interconnect System," 2010 International Interconnect Technology Conference, San Francisco, CA, June 6-9, 2010, pp. xx-xx.

Hou, Shibing, Wu, Jiang, Qin, Yufei, and Xu, Zhenming, "Electrostatic Separation for Recycling Waste Printed Circuit Board: A Study on External Factor and a Robust Design for Optimization," Environmental Science & Technology, vol. 44 no. 13, pp. 5177-5181, July 1, 2010.

Hou, Wei-Fun, Kam, Tai-Yan, Hsieh, Adam, Chen, Jian-Cheng, and Chang, Shyh-Ming, "Mismatch analysis of TAB-on-glass Connection with ACF," Proceedings of SPIE - The International Society for Optical Engineering, Volume 4079, Taipei, Taiwan, 2000, pp. 221-227.

Hou, Yuqun, Mo, Lixin, Zhai, Qingbin, and Li, Luhai, "Synthesis of Silver Nanowires and Its Application on Stretchable Conductor," Applied Mechanics and Materials, vol. 731, pp. 593-596, Jan. 2015.

Hou, Zhenwei, Hatcher, Casey, Johnson, R. Wayne, Yaeger, Erin, Konarski, Mark, and Crane, Larry, "Assembly & Reliability of Flip Chip-on-Laminate with Lead Free Solder," 2001 HD International Conference on High-Density Interconnect and Systems Packaging (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4428), Santa Clara, CA, Apr. 17-20, 2001, pp. 323-330.

Hou, Zhenwei, Tian, Guoyun, Hatcher, Casey, Johnson, R. Wayne, Yaeger, Erin, Konarski, Mark, and Crane, Larry, "Assembly & Reliability of Flip Chip-on-Laminate with Lead Free Solder," Advancing Microelectronics, vol. 29 no. 2, pp. xx-xx, Mar./ Apr. 2002.

Hou, Zhenwei, Tian, Guoyun, Hatcher, Casey, Johnson, R. Wayne, Yaeger, Erin K., Konarski, Mark M., and Crane, Lawrence, "Lead-Free Solder Flip Chip-on-Laminate Assembly and Reliability," IEEE Transactions on Electronics Packaging Manufacturing, vol. 24 no. 4, pp. 282-292, Oct. 2001.

Hou, Zhuangzhuang, Niu, Te, Zhao, Xiuchen, Liu, Ying, and Yang, Tianqi, "Intermetallic compounds formation and joints properties of electroplated Sn-Zn solder bumps with Cu substrates," Journal of Materials Science: Materials in Electronics, vol. 30 no. 22, pp. 20276-20284, Nov. 2019.

Houghtaling, Pamela, "Putting a `Whisker-Free' Face on Electronic Parts," NIST Tech Beat , vol. xx no. xx, pp. xx-xx, Mar./Apr. 2001.

Houghton, Bruce, "Updated Results of BGA Tensile Testing with Alternative PCB Finishes," Printed Circuit Fabrication, vol. 24 no. 10, pp. 16,18,20,22,24, Oct. 2001.

Houghton, Bruce, "Updated Results of BGA Tensile Testing with Alternative PCB Finishes," Printed Circuit Fabrication, vol. 24 no. 11, pp. 30,32,34,36, Nov. 2001.

Houghton, F. D. Bruce, "ITRI Project on Electroless Nickel / Immersion Gold Joint Cracking," IPC Printed Circuits Expo 1999, Long Beach, CA, Mar. 14-18, 1999, pp. S18-4-1-S18-4-9.

Houghton, F. D. Bruce, "ITRI project on electroless nickel/immersion gold joint cracking," Circuit World, vol. 26 no. 2, pp. 10-16, 2000.

Houghton, F. D. Bruce, "Solving the ENIG Black Pad Problem: An ITRI Report on Round 2," IPC Works '99, Minneapolis, MN, Oct. 23-28, 1999, pp. xx-xx.

Houlahan, Todd, Anderson, Tom, and Allen, Bree, "Using Portable X-Ray Fluorescence Analyzers for On-Site Quality Control of Prohibited Materials," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Hoult, A. P., and Ong, R. S., "Diode Laser Soldering of Metallized Fibers using Gold-Tin Pre-forms," 2002 International Conference on Advanced Packaging and Systems, Reno, NV, Mar. 10-13, 2002, pp. 98-103.

Hourlier, D., and Perrot, P., "Au-Si and Au-Ge phases diagrams for nanosytems," Materials Science Forum, vol. 653, pp. 77-85, 2010.

House, D. G., and Vernon, E. V., "Determination of the elastic moduli of tin single crystals, and their variation with temperature," British Journal of Applied Physics, vol. 11 no. 6, pp. 254-259, June 1960.

Houston, Paul N., Lewis, Brian, J., Baldwin, Daniel F., and Kazmierowicz, Philip, "Taking the Pain out of Pb-free Reflow," IPC SMEMA Council APEX 2003 , Anaheim, CA, Mar. 31-Apr. 2, 2003, pp. xx-xx.

Hovel, Bernd, and Verbrugge, Tom, "Base material selection for reliable lead-free processing," Circuit World, vol. 34 no. 2, pp. 3-7, 2008.

Howard, A. M., and Rogers, L. R., "The Electroplating of Tin Alloy Solderable Coatings on Ferrous and Non-ferrous Basis Metals," Plating, vol. 46 no. 5, pp. 484-478, May 1959.

Howard, Courtney E., "Electronics designers grapple with lead-free solder guidelines," Military & Aerospace Electronics, vol. 17 no. 8, pp. xx-xx, Aug. 2006.

Howard, Courtney E., "Industry wants unique part numbers for lead-free BGAs," Military & Aerospace Electronics, vol. 18 no. 8, pp. xx-xx, Aug. 2007.

Howard, Courtney E., "Lead-free issues continue to plague mil-aero market, says DMEA engineer," Military & Aerospace Electronics, Apr. 2008.

Howard, Courtney E., "The cost of compliance: A RoHS retrospective," Military & Aerospace Electronics, vol. 18 no. 8, pp. xx-xx, Aug. 2007.

Howard, H. P., Cheng, J., Vianco, P. T., and Li, J. C. M., "Interface flow mechanism for tin whisker growth," Acta Materialia , vol. 59 no. 5, pp. 1957-1963, Mar. 2011.

Howard, J. K., and Ross, R. F., "Morphology of Void-Hillock Formation at Transverse Scratches in Aluminum Thin Film," Journal of Applied Physics, vol. 42 no. 7, pp. 2996-2998, June 1971.

Howe, Lori, "Will China and Japan Lead Photonics Lead-free?," Laser Focus World , vol. 41 no. 6, pp. 110-114, 116-117, June 2005.

Howell, J., Telang, A., Lee, J. G., Choi, S., and Subramanian, K. N., "Surface damage accumulation in Sn-Ag solder joints under large reversed strains," Journal of Materials Science: Materials in Electronics, vol. 13 no. 6, pp. 335-344, June 2002.

Howell, Keith, Nishimura, Takatoshi, Sweatman, Keith, Nishimura, Tetsuro, and Komatsu, Teruo, "A Case Study of First-Level Die Attach with Nano-Ag Paste," International Conference on Soldering & Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.

Howell, Keith, Sweatman, Keith, Nozu, Takashi, and Nishimura, Tetsuro, "Assessment of Microalloyed Sn-Zn as a Solder for Electronics Assembly," International Conference on Soldering & Reliability 2011 Proceedings , Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

Howell, Keith, Koshi, Masuo, Masuda, Junya, Nishimura, Tetsuro, Nozu, Takashi, and Sweatman, Keith, "Effect of Soldering Method and Flux Type on Whisker Growth in SAC305," International Conference on Soldering & Reliability 2010 Proceedings , Toronto, Ontario, Canada, May 17-20, 2010, pp. xx-xx.

Howell, Keith, and Sweatman, Keith, "Hot Air Solder Levelling - A Solution to Lead-Free Solderability Problems," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

Howell, Keith, Sweatman, Keith, Miyaoka, Motonori, Nishimura, Takatoshi, Tran, Xuan Quy, McDonald, Stuart, and Nogita, Kazuhiro, "Microalloyed Sn-Cu Pb-Free Solder for High Temperature Applications," International Conference on Soldering & Reliability 2013 Proceedings , Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.

Howell, Rod, "RoHS: Y2K for OEMs?," Surface Mount Technology (SMT), vol. 19 no. 10, pp. xx-xx, Oct. 2005.

Howey, J. H., "The Noncubic Growth of Single Crystals of Silver by Condensation from Vapor," Physical Review, vol. 55 no. 6, pp. 578-581, Mar. 15, 1939.

Howlett, Jason, "Where is cadmium used in thick-films?," TWI, 2004.

Hradil, George, "A Practical Electrolyte for the Electrodeposition of Eutectic Gold-Tin Alloy," Second International Wafer-Level Packaging Congress, San Jose, CA, Nov. 3-4, 2005, pp. 1-4.

Hradil, George, "A Practical Electrolyte for the Electrodeposition of Eutectic Gold/Tin Alloy," 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 45-50.

Hsi, Chi-Shiung, Lin, Ching-Tsung, Chang, Tao-Chih, Wang, Moo-Chin, and Liang, Ming-Kann, "Interfacial Reactions, Microstructure, and Strength of Sn-8Zn-3Bi and Sn-9Zn-Al Solder on Cu and Au/Ni (P) Pads," Metallurgical and Materials Transactions A, vol. 41 no. 2, pp. 275-284, Feb. 2010.

Hsiao, Andy, Lee, Tae-Kyu, Lee, Imbok, Lee, Young-Woo, Ibe, Edward, and Loh, Karl, "Low Melting Temperature Interconnect Thermal Cycling Performance Enhancement Using Elemental Tuning and Edgebond Adhesive," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Hsiao, C. H., Chang, S. J., Hung, S. C., Cheng, Y. C., Huang, B. R., Wang, S. B., Lan, B. W., and Chih, S. H., "ZnSe/ZnCdSe heterostructure nanowires," Journal of Crystal Growth , vol. 312 no. 10, pp. 1670-1675, May 1, 2010.

Hsiao, H.-Y., Hu, C.-C., Guo, M.-Y., Chen, C., and Tu, N. K., "Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu," Scripta Materialia, vol. 65 no. 10, pp. 907-910, Nov. 2011.

Hsiao, Hsiang-Yao, Liang, S. W., Ku, Min-Feng, Chen, Chih, and Yao, Da-Jeng, "Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy," Journal of Applied Physics , vol. 104 no. 3, pp. 033708-1-033708-6, 2008.

Hsiao, Hsiang-Yao, Trigg, Alistair David, and Chai, Tai Chong, "Failure Mechanism for Fine Pitch Microbump in Cu/Sn/Cu System During Current Stressing," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 5 no. 3, pp. 314-319, Mar. 2015.

Hsiao, Hsiang Yao, Chen, Chih, and Yao, D. J., "Investigation of Joule Heating Effect in Various Stages of Electromigration in Flip-Chip Solder Joints by Infrared Microscopy," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 922-925.

Hsiao, Hsiang Yao, Chen, Chih, and Yao, D. J., "Investigation of Joule heating effect in various stages of failure in flip-chip solder joints under accelerated electromigration," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 162-165.

Hsiao, Hsiang-Yao, and Chen, Chih, "Measurement of Temperature Distribution in SnAg3.5 Flip-Chip Solder Joints during Current Stressing Using Infrared Microscopy," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 281-284.

Hsiao, Hsiang-Yao, and Chen, Chih, "Measurement of Temperature Distribution in SnAg3.5 Flip-Chip Solder Joints during Current Stressing Using Infrared Microscopy," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 639-643.

Hsiao, Hsiang-Yao, Huang, Yi-Sa, and Chen, Chih, "Study of Interaction between Cu-SnAg and Ni-SnAg Interfacial Reactions by Low Solder Volume in 3D IC packaging," 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 7-9, 2011, pp. 474-479.

Hsiao, Hsiang-Yao, and Chen, Chih, "Thermomigration in Pb-free SnAg solder joint under alternating current stressing," Applied Physics Letters, vol. 94 no. 9, pp. 092107-1-092107-3, 2009.

Hsiao, Li-Yin, Kao, Szu-Tsung, and Duh, Jenq-Gong, "Characterizing Metallurgical Reaction of Sn3.0Ag0.5Cu Composite Solder by Mechanical Alloying with Electroless Ni-P/Cu under-Bump Metallization after Various Reflow Cycles," Journal of Electronic Materials, vol. 35 no. 1, pp. 81-88, Jan. 2006.

Hsiao, Li-Yin, Jang, Guh-Yaw, Wang, Kai-Jheng, and Duh, Jenq-Gong, "Inhibiting AuSn4 Formation by Controlling the Interfacial Reaction in Solder Joints," Journal of Electronic Materials, vol. 36 no. 11, pp. 1476-1482, Nov. 2007.

Hsiao, Li-Yin, and Duh, Jenq-Gong, "Revealing the Nucleation and Growth Mechanism of a Novel Solder Developed from Sn-3.5Ag-0.5Cu Nanoparticles by a Chemical Reduction Method," Journal of Electronic Materials, vol. 35 no. 9, pp. 1755-1760, Sept. 2006.

Hsiao, Li-Yin, Chiou, Guo-Jyun, Duh, Jenq-Gong, and Tsai, Su-Yueh, "Synthesis and Application of Novel Lead-Free Solders Derived from Sn-based Nanopowders," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Hsiao, Li-Yin, and Duh, Jenq-Gong, "Synthesis and Characterization of Lead-Free Solders with Sn-3.5Ag-xCu (x = 0.2, 0.5, 1.0) Alloy Nanoparticles by the Chemical Reduction Method," Journal of the Electrochemical Society, vol. 152 no. 9, pp. J105-J109, 2005.

Hsiao, Y. H., Tseng, H. W., and Liu, C. Y., "Electromigration-Induced Failure of Ni/Cu Bilayer Bond Pads Joined with Sn(Cu) Solders," Journal of Electronic Materials, vol. 38 no. 12, pp. 2573-2578, Dec. 2009.

Hsiao, Yu-Hsiang, and Lin, Kwang-Lung, "The formation and conversion of intermetallic compounds in the Cu pillar Sn-Ag micro-bump with ENEPIG Cu substrate under current stressing," Journal of Materials Science: Materials in Electronics, vol. 27 no. 3, pp. 2201-2205, Mar. 2016.

Hsieh, A. K., "Determination of Trivalent And Hexavalent Chromium Ions and Impurities in Trivalent Chromium Baths By Differential Pulse Polarography," Plating & Surface Finishing, vol. 77 no. 10, pp. 58-61, Oct. 1990.

Hsieh, An-Kong, Chen, Keng-Nam, and Chung, Mui-Fatt, "Analyses of Chromium Deposit as Criteria for the Selection of Trivalent Chromium Plating Baths," Metal Finishing, vol. 91 no. 2, pp. 45-47, Feb. 1993.

Hsieh, Ju-Cheng, Hu, Chi-Chang, and Lee, Tai-Chou, "The Synergistic Effects of Additives on Improving the Electroplating of Zinc under High Current Densities," Journal of the Electrochemical Society , vol. 155 no. 10, pp. D675-D681, 2008.

Hsieh, L.-Y., Yang, H.-C., and Chiu, T.-C., "Ratcheting and Creep Responses of SAC Solder Joints under Cyclic Loading," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 96-99.

Hsieh, Ming-Che, "Modeling Correlation for Solder Joint Fatigue Life Estimation in Wafer-Level Chip Scale Packages," 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2015, pp. 65-68.

Hsieh, Ming-Che, and Tzeng, Su-Lan, "Solder Joint Fatigue Life Prediction in Large Size and Low Cost Wafer-Level Chip Scale Packages," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 496-501.

Hsieh, Peishan, and Lin, Kwang-Lung, "The Wetting Interaction between Electroless NiP deposit/Cu Substrate and SnAg Solder," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 29-32.

Hsieh, Yi-Ting, Lai, Mei-Chun, Huang, Hsin-Liang, and Sun, I.-Wen, "Speciation of cobalt-chloride-based ionic liquids and electrodeposition of Co wires," Electrochimica Acta, vol. 117, pp. 217-223, Jan. 20, 2014.

Hsin, Cheng-Lun, Tsai, Yue-Yun, and Wang, Shang-Ming, "The Discovery of Plasmon Resonance in Germanide Nanowires Grown on Cu Foil," IEEE Transactions on Nanotechnology, vol. 14 no. 4, pp. 608-611, July 2015.

Hsing, A. W., Kearney, A. V., Li, L., Xue, J., Brillhart, M., and Dauskardt, R. H., "Micromechanics and Damage Processes in Interconnect Structures," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1303-1308.

Hsiung, C. K., Chang, C. A., Lai, J. J., Tzeng, Z. H., Ho, C. S., and Chien, F. L., "Solder Bump Oxidation Prevention by Fabricating Thermal Oxidation Barrier Layer of Wafer Level Process," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 327-330.

Hsiung, C. K., Chang, C. A., Tzeng, Z. H., Ho, C. S., and Chien, F. L., "Study on Sn-2.3Ag Electroplated Solder Bump Properties Fabricated by Different Plating and Reflow Conditions," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 719-724.

Hsu, Alan, Liao, Eric, and Chen, Albert, "Halogen Free Material Being in Your Life," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 275-279.

Hsu, C. Y., Yao, D. J., Liang, S. W., Chen, Chih, and Yeh, Everett C. C., "Temperature and Current-Density Distributions in Flip-Chip solder Joints with Cu Traces," Journal of Electronic Materials, vol. 35 no. 5, pp. 947-953, May 2006.

Hsu, Chia-ming, and Chen, Sinn-wen, "Interfacial reactions with and without current stressing at Sn-Co/Ag and Sn-Co/Cu solder joints," Journal of Materials Science, vol. xx no. xx, pp. xx-xx, xxxx.

Hsu, Chia-Wei, Hu, Allen H., and Wu, Wei-Cheng, "Using FMEA and FAHP to Risk Evaluation of Green Components," 2008 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 19-21, 2008, pp. xx-xx.

Hsu, Feng-Chih, Cheng, Ya-Chi, Wang, Yu-Ting, Lin, Ming-Tzer, and Chen, Chih-Ming, "Planar copper-tin inter-metallic film formation on strained substrates," Microelectronics Reliability, vol. 54 no. 6-7, pp. 1378-1383, June-July 2014.

Hsu, Grace F., "Zinc-Nickel Alloy Plating: An Alternative to Cadmium," Plating and Surface Finishing, vol. 71 no. 4, pp. 52-55, Apr. 1984.

Hsu, H. H., Huang, Y. T., Huang, S. Y., Chang, T. C., and Wu, Albert T., "Evolution of the Intermetallic Compounds in Ni/Sn-2.5Ag/Ni Microbumps for Three-Dimensional Integrated Circuits," Journal of Electronic Materials , vol. 44 no. 10, pp. 3888-3895, Oct. 2015.

Hsu, Hana, Peng, Jerry, Lin, C. J., Chien, Anching, Wang, Jackal, Chen, Leimo, Tyan, Chun-Gang, Chang, Tao-Chih, Chang, Chiao-Yun, Yu, Shan-Pu, Wang, Paul P. E., Huang, Gary, and Kochi, Ken, "Lead-Free Product and Process Conversion Phase III - Reflow Process Optimization," 2005 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Hsu, Hana, Peng, Jerry, Chien, Anching, Chen, Leimo, Chen, B. S., and Tyan, Chun-Gang, "Lead-free Product and Process Conversion Phase III. Wave Soldering Process Optimization and PCB Thermal Management," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Hsu, Hana, Weng, Jackal, and Wang, Paul P. E., "Mechanical Stress Control and Management in the Assembly Processes for Sn-Pb and Pb-Free System Phase I - A Methodology for Process Risk Prevention and Understanding of Residue Stress on the Reliability Scale," 2004 Pan Pacific Symposium Conference Proceedings, Kahuku, Oahu, Hawaii, Feb. 10-12, 2004, pp. xx-xx.

Hsu, Hao, Lin, Tzu-Yang, and Ouyang, Fan-Yi, "Evaluation of Electromigration Behaviors of Pb-Free Microbumps in Three-Dimensional Integrated Circuit Packaging," Journal of Electronic Materials, vol. 43 no. 1, pp. 236-246, Jan. 2014.

Hsu, Hou-Jun, Huang, Jung-Tang, Lee, Kuo-Yu, Wu, Rung-Gen, Chao, Pen-Shan, and Lin, Jean, "Fabrication of High Density and High Conplanarity Lead-Free Solder Bump by a Novel Process for Advanced Wafer Level Packaging," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 224-227.

Hsu, Hou jun, Huang, Jung Tang, chao, Pe shan, and Shih, Hsiung, "Surface modification on plating-based Cu/Sn/0.7Cu lead-free copper pillars by using polishing" Microelectronic Engineering, vol. 85 no. 7, pp. 1595-1601, July 2008.

Hsu, Hsiang-Chen, Hsu, Yu-Chia, Lee, Hui-Yu,Fu, Shen-Li, Chung, Mark C. L., and Wang, Kung-Hao, "A Study of Reliability Drop Test Effects for SnAgCu Solder Bump in System-in-Package and Board Level Package," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Hsu, Hsiang-Chen, Wan, Yu-Ming, Haung, Chi-Hau, and Fu, Shen-Li, "An investigation of temperature influence on the SAC305 soldering on Cu-Ni-Au substrate," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 173-176.

Hsu, Hsiang-Chen, Wu, Shih-Jeh, Hsu, Feng-Jui, Weng, Meng-Chieh, and Fu, Shen-Li, "Electrochemical Migration Failure on FR-4 PCB by Hygro-Thermo-Vapor Pressure Coupled Analysis," 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 22-25, 2013, pp. 166-169.

Hsu, Hsiang-Chen, Ju, Shen-Wen, Lu, Jie-Rong, and Wan, Yue-Min, "Electromigration Analysis and Electro-Thermo-Mechanical Design for Package-on-Package (POP)," Advanced Materials Research, vol. 126-128, pp. 929-934, 2010.

Hsu, Hsiang-Chen, Hsu, Yu-Chia, Lee, Hui-Yu, Yeh, Chang-Lin, Lai, Yi-Shao, and Fu, Shen-Li, "Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Hsu, Hsiang-Chen, Hsu, Yu-Chia, Yeh, Chan-Lin, and Lai, Yi-Shao, "Finite Element Prediction of Stack-Die Packages under Board Level Drop Test," Materials Science Forum, vol. 594, pp. 169-174, 2008.

Hsu, Hsiang-Chen, Lu, Jie-Rong, Wan, Yue-Min, and Fu, Shen-Li, "Reliability Analysis on Electromigration and Electro-Thermo-Mechanical for Sn4.0Ag0.5Cu Solder Ball," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 724-729.

Hsu, Hsiang-Chen, Lee, Hui-Yu, and Shieh, Wen-Lo, "Reliability of SnAgCu Alloys for CMOS Image Sensor QFN Package under Thermal Cycling Loading," Materials Science Forum, vol. 594, pp. 175-180, 2008.

Hsu, Hsiang-Chen, and Hung, Wei-Mao, "Reliability Prediction for 95.5Sn3.9Ag0.6Cu Solder Bump and Thermal Design for Lead Free System In Package with Polymer-Based Material," Materials Science Forum, vol. 505-507, pp. 289-294, 2006.

Hsu, Hsiu-feng, and Chen, Sinn-wen, "Phase equilibria of the Sn-Ag-Ni ternary system and interfacial reactions at the Sn-Ag/Ni joints," Acta Materialia, vol. 52 no. 9, pp. 2541-2547, May 17, 2004.

Hsu, Hsuan-Ling, Lee, Hsuan, Wang, Chi-Wei, Liang, Chenju, and Chen, Chih-Ming, "Impurity evaporation and void formation in Sn/Cu solder joints," Materials Chemistry and Physics, vol. 225, pp. 153-158, Mar. 1, 2019.

Hsu, Min-Hsuan, and Chiang, Kuo-Ning, "Investigation of Thermal Cycling Maximum Temperature Effect on Fatigue Life of WLCSP," 2016 International Conference on Electronics Packaging , Hokkaido, Japan, Apr. 20-22, 2016, pp. 9-14.

Hsu, S. C., Wang, S. J., and Liu, C. Y., "Effect of Cu Content on Interfacial Reactions between Sn(Cu) Alloys and NiTi Thin-Film Metallization," Journal of Electronic Materials, vol. 32 no. 11, pp. 1214-1221, Nov. 2003.

Hsu, Shou-Jen, Sha, Chu-Hsuan, and Lee, Chin C., "Fluxless bonding of Si chips to aluminum boards using electroplated Sn solder," Journal of Materials Science: Materials in Electronics, vol. 25 no. 8, pp. 3276-3284, Aug. 2014.

Hsu, Shou-Jen, and Lee, Chin C., "Fluxless Tin Bonding of Silicon Chips to Iron," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 2276-2279.

Hsu, Shou-Jen, and Lee, Chin C., "Fluxless Tin Bonding Process With Suppressed Intermetallic Growth," IEEE Transactions on Components, Packaging, and Manufacturing Technology , vol. 4 no. 4, pp. 551-559, Apr. 2014.

Hsu, Shou-Jen, and Lee, Chin C., "Growth Kinetics of Intermetallic Compounds between Sn and Fe Liquid-Solid Reaction Couples," Journal of Electronic Packaging, vol. 138 no. 4, pp. 041006-1-041006-5, Dec. 2016.

Hsu, Tzu-Yu, Chang, Jing-Yao, Chang, Hsiao-Min, and Ouyang, Fan-Yi, "Electromigration induced spontaneous Ag whisker growth in fine Ag-alloy bonding interconnects: Novel polarity effect," Materials Letters, vol. 182, pp. 55-58, Nov. 1, 2016.

Hsu, Wei-Neng, and Ouyang, Fan-Yi, "Effect of Ag3Sn: Effective suppression of thermomigration-induced Cu dissolution in micro-scale Pb-free interconnects," Materials Chemistry and Physics, vol. 165, pp. 66-71, Sept. 1, 2015.

Hsu, Wei-Neng, and Ouyang, Fan-Yi, "Effects of anisotropic b-Sn alloys on Cu diffusion under a temperature gradient," Acta Materialia, vol. 81, pp. 141-150, Dec. 2014.

Hsu, Yao, Kong, Wei-Kuo, Su, Chih-Yen, Wu, Wen-Fang, and Liu, Ming-Wei, "Vibration Induced Fatigue Reliability of BGA Packages," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 305-308.

Hsu, Ying-Chao, Chou, Chung-Kwuang, Liu, P. C., Chen, Chih, Yao, D. J., Chou, T., and Tu, K. N., "Electromigration in Pb-free SnAg3.8Cu0.7 solder stripes," Journal of Applied Physics, vol. 98 no. 3, pp. 033523-1-033523-6, 2005.

Hsu, Ying-Chao, Shao, Tung-Liang, Yang, Ching-Jung, and Chen, Chih, "Electromigration Study in SnAg3.8Cu0.7 Solder Joints on Ti/Cr-Cu/Cu Under-Bump Metallization," Journal of Electronic Materials, vol. 32 no. 11, pp. 1222-1227, Nov. 2003.

Hsu, Ying-Chao, Huang, Yuan-Ming, Chen, Chih, and Wang, Henry, "Interfacial reaction and shear strength of Pb-free SnAg2.5Cu0.8Sb0.5 and SnAg3.0Cu0.5Sb0.2 solder bumps on Au/Ni(P) metallization," Journal of Alloys and Compounds, vol. 417 no. 1-2, pp. 180-186, June 29, 2006.

Hsu, Ying-Chao, Chen, De-Chung, Liu, P. C., and Chen, Chih, "Measurement of electromigration parameters of lead-free SnAg3.5 solder using U-groove lines," Journal of Materials Research, vol. 20 no. 10, pp. 2831-2837, Oct. 2005.

Hsu, Yuchen, Zeng, G., Xian, J. W., Belyakov, S. A., and Gourlay, C. M., "Tailoring the Cu6Sn5 layer texture with Ni additions in Sn-Ag-Cu based solder joints," 2018 7th Electronic System-Integration Technology Conference , Dresden, Germany, Sept. 18-21, 2018, pp. xx-xx.

Hsu, Yung-Yu, and Chiang, Kuo-Ning, "Double-Layers Wafer Level Chip Scale Package (DL-WLCSP) Solder Joint Shape Prediction, Reliability and Parametric Study," The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 310-316.

Hsuan, Teng-Chun, and Lin, Kwang-Lung, "Effects of aging treatment on mechanical properties and microstructure of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga Solder," Materials Science and Engineering: A, vol. 456 no. 1-2, pp. 202-209, May 15, 2007. https://doi.org/10.1016/j.msea.2006.11.144

Hsuan, Teng-Chun, and Lin, Kwang-Lung, "Microstructural evolution of e-AgZn3 and n-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder during aging treatment," Journal of Alloys and Compounds, vol. 469 no. 1-2, pp. 350-356, Feb. 5, 2009.

Hu, C.-K., Kelly, J., Chen, J. H-C, Huang, H., Ostrovski, Y., Patlolla, R., Peethala, B., Adusumilli, P., Spooner, T., Gignac, L. M., Bruley, J., Breslin, C., Cohen, S. A., Lian, G., Ali, M., Long Jr., R., Hornicek, G., Kane, T., Kamineni, V., Zhang, X., Mont, F., and Siddiqui, S., "Electromigration and resistivity in on-chip Cu, Co and Ru damascene nanowires," 2017 IEEE International Interconnect Technology Conference , HsinChu, Taiwan, May 16-18, 2017, pp. xx-xx.

Hu, C.-K., Gignac, L. G., Ohm, J., Breslin, C. M., Huang, E., Bonilla, G., Liniger, E., Rosenberg, R., Choi, S., and Simon, A. H., "Microstructure, impurity and metal cap effects on Cu electromigration," AIP Conference Proceedings, vol. 1601, pp. 67-78, 2014.

Hu, Chaohui, "Study on the Factors which Affecting the Conductive Anodic Filament Reliability for Packing Substrate," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 916-919.

Hu, Chi-Chang, Tsai, Yi-Da, Lin, Chi-Cheng, Lee, Gen-Lan, Chen, Sinn-Wen, Lee, Tai-Chou, and Wen, Ten-Chin, "Anomalous growth of whisker-like bismuth-tin extrusions from tin-enriched tin-Bi deposits," Journal of Alloys and Compounds, vol. 472 no. 1-2, pp. 121-126, Mar. 20, 2009.

Hu, Chi-Chang, Wang, Chun-Kou, and Lee, Gen-Lan, "Composition control of tin-zinc deposits using experimental strategies," Electrochimica Acta, vol. 51 no. 18, pp. 3692-3698, May 5, 2006.

Hu, Chi-Chang, and Wang, Chun-Kou, "Effects of composition and reflowing on the corrosion behavior of Sn-Zn deposits in brine media," Electrochimica Acta, vol. 51 no. 20, pp. 4125-4134, May 25, 2006.

Hu, Chih-Chia, Haw, Khew Woei, Wu, Chun-Yi, and Chen, Chih, "Necking of low-bump-height solder induced by reactive wetting of solder on Au finishes in print circuit board," 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 22-25, 2013, pp. 136-139.

Hu, Chih-Chia, Hsiao, Hsiang-Yao, Guo, Ming-Yung, Chen, Chih, and Tu, K. N., "To Inhibit the Consumption of Cu During Multiple Reflows of Pb-free on Cu," 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 7-9, 2011, pp. 503-506.

Hu, F. Q., Zhang, Q. K., Jiang, J. J., and Song, Z. L., "Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction," Materials Letters, vol. 214, pp. 142-145, Mar. 1, 2018.

Hu, Fengtian, Yang, Shan, Kang, Un byoung, Hu, Anmin, and Li, Ming, "The effect of Cu substrate texture on the intermetallic compounds (IMCs) growth at a Sn3.5Ag-Cu interface," Journal of Materials Science: Materials in Electronics, vol. 27 no. 4, pp. 3854-3859, Apr. 2016.

Hu, Hanmei, Yang, Baojun, Li, Qiaowei, Liu, Xinyuan, Yu, Weichao, and Qian, Yitai, "Solvothermal synthesis of antimony nanowire bundles, tube-groove-like nanostructures and dendrites," Journal of Crystal Growth, vol. 261 no. 4, pp. 485-489, Feb. 1, 2004.

Hu, Huili, Li, Ning, Cheng, Jinning, and Chen, Lijiao, "Corrosion behavior of chromium-free dacromet coating in seawater," Journal of Alloys and Compounds, vol. 472 no. 1-2, pp. 219-224, Mar. 20, 2009.

Hu, Jia Ning, Tanaka, Hiroyuki, and Narita, Toshio, "Aging Behavior of a Sn-Bi Eutectic Solder at Temperatures between 233 and 373 K," Materials Transactions, vol. 42 no. 5, pp. 769-775, May 2001.

Hu, Jing, Hu, Anmin, Li, Ming, and Mao, Dali, "Electrochemical Corrosion Behaviour of Sn-8Zn-3Bi-XCr Solder in 3.5% NaCl," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 701-707.

Hu, Jing, Luo, Tingbi, Hu, Anmin, Li, Ming, and Mao, Dali, "Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi-xCr Solder in 3.5% NaCl Solution," Journal of Electronic Materials, vol. 40 no. 7, pp. 1556-1562, July 2011.

Hu, Jing, Chen, Xi, Hu, Anmin, Li, Ming, and Mao, Dali, "Microstructural Evolution of Sn-9Zn-3Bi and Sn-9Zn-3Bi-0.3Cr Solder Under High-temperature and High-humidity Conditions," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging , Xi'an, China, Aug. 16-19, 2010, pp. 413-417.

Hu, Jing, Hu, Anmin, Li, Ming, and Mao, Dali, "Oxidation Behavior of Sn-9Zn-3Bi-xCr Solders under High-Temperature Exposure," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 851-854.

Hu, Jun, Zhang, Feng, Wang, Jing, and Xiao, John Q., "Synthesis of single-crystalline Fe nanowires using catalyst-assisted chemical vapor deposition," Materials Letters, vol. 160, pp. 529-532, Dec. 1, 2015.

Hu, Kai X., Yeh, Chao-Pin, and Wyatt, Karl W., "Electro-Thermo-Mechanical Responses of Conductive Adhesive Materials," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 20 no. 4, pp. 470-477, Dec. 1997.

Hu, Lifang, Xue, Yongzhi, and Wang, Hao, "Glass-Cu joining by anodic bonding and soldering with eutectic Sn-9Zn solder," Journal of Alloys and Compounds, vol. 789, pp. 558-566, June 15, 2019.

Hu, Mason, "Performance Based Reliability Requirements of Printed Circuit Board," Overcoming the Reliability Challenge: An IPC Summit, Andover, MA, Apr. 15, 2008, pp. xx-xx.

Hu, Ming, Kresge, Lee, and Lee, Ning-Cheng, "Low-Cost High-Reliability Assembly of Thermally Warped PoP with Novel Epoxy Flux on Solder Paste," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 173-181.

Hu, Qiang, Leem, Zhong-suo, Zhao, Zhi-li, and Lee, Da-le, "Study of Cooling Rate on Lead-free Soldering Microstructure of Sn-3.0Ag-0.5Cu Solder," Proceedings of 2005 International Conference on Asian Green Electronics, Shang Hai, China, Mar. 15-18, 2005, pp. 156-160.

Hu, Quanli, Li, Guoqing, Suzuki, Hiroshi, Araki, Hiroshi, Ishikawa, Nobuhiro, Yang, Wen, and Noda, Tetsuji, "A new phenomenon in the floating-zone (FZ) growth of Si nanowires," Journal of Crystal Growth, vol. 246 no. , pp. 64-68, 2002.

Hu, Sicong, Zhou, Zheng, Liu, Hui, Zhu, Wenbo, and Wu, Fengshun, "Study on the microstructure of Si/solder/Si joint based on Al/Ni self-propagating exothermic reaction," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 955-959.

Hu, Tianwei, Li, Yi, Chan, Yan-Cheong, and Wu, Fengshun, "Effect of nano Al2O3 particles doping on electromigration and mechanical properties of Sn-58Bi solder joints," Microelectronics Reliability , vol. 55 no. 8, pp. 1226-1233, July 2015.

Hu, Tien-Chen, Hsu, Feng-chih, Huang, An-Wen, and Lin, Ming-Tzer, "Influence of External Strain on the Growth of Interfacial Intermetallic Compounds Between Sn and Cu Substrates," Journal of Electronic Materials , vol. 41 no. 12, pp. 3309-3319, Dec. 2012.

Hu, Xiao, Chan, Y. C., Zhang, Kaili, and Yung, K. C., "Effect of graphene doping on microstructural and mechanical properties of Sn-8Zn-3Bi solder joints together with electromigration analysis," Journal of Alloys and Compounds, vol. 580, pp. 162-171, Dec. 15, 2013.

Hu, Xiao, Xu, Sha, Yang, Ying, Chen, Zhong, and Chan, Y. C., "Effect of TiO2 nanoparticle addition on electroless Ni-P under bump metallization for lead-free solder interconnection," Materials Science and Engineering: A, vol. 600, pp. 67-75, Apr. 10, 2014.

Hu, Xiao, and Chan, Y. C., "Electroless Ni-P-ZrO2 metallization for lead-free solder interconnection," 2014 15th International Conference on Electronic Packaging Technology , Chengdu, China, Aug. 12-15, 2014, pp. 820-824.

Hu, Xiao, and Chan, Y. C., "Reinforced solder joint performance by incorporation of ZrO2 nanoparticles in electroless Ni-P composite layer," Journal of Materials Research, vol. 29 no. 22, pp. 2657-2666, Nov. 28, 2014.

Hu, Xiaowu, Huang, Qiang, Li, Yulong, Liu, Yi, and Min, Zgixian, "A study on the interfacial reaction of Sn58Bi/Cu soldered joints under various cooling and aging conditions," Journal of Materials Science: Materials in Electronics, vol. 26 no. 7, pp. 5140-5151, July 2015.

Hu, Xiaowu, Li, Yulong, Li, Ke, and Min, Zhixian, "Effect of Bi Segregation on the Asymmetrical Growth of Cu-Sn Intermetallic Compounds in Cu/Sn-58Bi/Cu Sandwich Solder Joints During Isothermal Aging," Journal of Electronic Materials, vol. 42 no. 12, pp. 3567-3572, Dec. 2013.

Hu, Xiaowu, Qiu, Yu, Jiang, Xiongxin, and Li, Yulong, "Effect of Cu6Sn5 nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3.0Ag0.5Cu solder alloys," Journal of Materials Science: Materials in Electronics, vol. 29 no. 18, pp. 15983-15993, Sept. 2018.

Hu, Xiaowu, Qiu, Hongyu, and Jiang, Xiongxin, "Effect of Ni addition into the Cu substrate on the interfacial IMC growth during the liquid-state reaction with Sn-58Bi solder," Journal of Materials Science: Materials in Electronics, vol. 30 no. 2, pp. 1907-1918, Jan. 2019.

Hu, Xiaowu, Yu, Xiao, Li, Yulong, Huang, Qiang, Liu, Yi, and Min, Zhixian, "Effect of strain rate on interfacial fracture behaviors of Sn-58Bi/Cu solder joints," Journal of Materials Science: Materials in Electronics, vol. 25 no. 1, pp. 57-64, Jan. 2014.

Hu, Xiaowu, Lai, Yanqing, Jiang, Xiongxin, and Li, Yulong, "Effects of In addition on the wettability, interfacial characterization and properties of ternary Sn-Cu-Ni solders," Journal of Materials Science: Materials in Electronics, vol. 29 no. 21, pp. 18840-18851, Nov. 2018.

Hu, Xiaowu, and Ke, Zunrong, "Growth behavior of interfacial Cu-Sn intermetallic compounds of Sn/Cu reaction couples during dip soldering and aging," Journal of Materials Science: Materials in Electronics, vol. 25 no. 2, pp. 936-945, Feb. 2014.

Hu, Xiaowu, Li, Yulong, and Min, Zhixian, "Interfacial reaction and growth behavior of IMCs layer between Sn-58Bi solders and a Cu substrate," Journal of Materials Science: Materials in Electronics, vol. 24 no. 6, pp. 2027-2034, June 2013.

Hu, Xiaowu, Xu, Tao, Jiang, Xiongxin, and Li, Yulong, "Interfacial reaction and IMCs growth behavior of Sn3Ag0.5Cu/Ni solder bump during aging at various temperatures," Journal of Materials Science: Materials in Electronics, vol. 27 no. 5, pp. 4245-4252, May 2016.

Hu, Xiaowu, Chen, Wenjing, and Wu, Bin, "Microstructure and tensile properties of Sn-1Cu lead-free solder alloy produced by directional solidification," Materials Science and Engineering: A, vol. 556, pp. 816-823, Oct. 30, 2012.

Hu, Xiaowu, Li, Ke, and Min, Zhixian, "Microstructure evolution and mechanical properties of Sn0.7Cu0.7Bi lead-free solders produced by directional solidification," Journal of Alloys and Compounds, vol. 566, pp. 239-245, July 25, 2013.

Hu, Xiaowu, Xu, Tao, Keer, Leon M., Li, Yulong, and Jiang, Xiongxin, "Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints," Materials Science and Engineering: A, vol. 673, pp. 167-177, Sept. 15, 2016.

Hu, Xiaowu, and Yan, Hong, "Microstructure Formation during Unidirectionally Solidified Pb-Bi-Sn Tenary Quasi-Peritectic Alloy," Advanced Materials Research, vol. 189-193, pp. 3799-3803, 2011.

Hu, Xiaowu, Xu, Tao, Keer, Leon M., Li, Yulong, and Jiang, Xiongxin, "Shear strength and fracture behavior of reflowed Sn3.0Ag0.5Cu/Cu solder joints under various strain rates," Journal of Alloys and Compounds , vol. 690, pp. 720-729, Jan. 5, 2017.

Hu, Xiaowu, Bao, Nifa, and Min, Zhixian, "Synergetic effect of strain rate and electroplated Cu film for shear strength of solder/Kovar joints," Journal of Materials Science: Materials in Electronics, vol. 30 no. 2, pp. 1434-1449, Jan. 2019.

Hu, Xinglei, Liang, Yingchun, Chen, Jiaxuan, and Pen, Hongmin, "Quasicontinuum Simulation of Uniaxial Tension of Single Crystal Copper Nanowire," Materials Science Forum, vol. 694, pp. 200-204, July 2011.

Hu, Y. J., Hsu, Y. C., Huang, T. S., Lu, C. T., Wu, Albert T., and Liu, C. Y., "Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints," Journal of Electronic Materials , vol. 43 no. 1, pp. 170-175, Jan. 2014.

Hu, Y. J., Hsu, Y. C., Lu, C. T., Huang, T. S., Chen, C. Y., Chuang, W. N., Hsiao, C. Y., Lin, C. P., and Liu, C. Y., "Interfacial Reactions Between Columnar or Layered Ni(P) Layers and Sn-Ag-Cu Solder," Journal of Electronic Materials, vol. 43 no. 1, pp. 277-283, Jan. 2014.

Hu, Yangduanrui, Ma, Limin, and Guo, Fu, "Influence of nano-particles on creep behaviors of Cu/Sn-0.3Ag-0.7Cu-xPOSS/Cu composite solder joints," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 142-146.

Hu, Yating, An, Bing, Zhang, Yi, and Wu, Yiping, "Investigation on Reliability of Low-Ag Lead-free Solder Alloy," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 334-337.

Hu, Yating, An, Bing, Chen, Rong, Lv, Weiwen, and Wu, Yiping, "Research on Reliability of Sn-1.0Ag-0.5Cu Low-Ag Lead-free Solder Alloy," 2014 15th International Conference on Electronic Packaging Technology , Chengdu, China, Aug. 12-15, 2014, pp. 401-404.

Hu, Ying-Yan, Wang, Jun-Feng, Li, Can, and Li, Jian-Qiang, "Characterization of Cooling Rate and Microstructure of Rapidly Solidified Spherical Mono-Sized Sn-1.0Ag-0.5Cu Particles," Materials Science Forum , vol. 960, pp. 274-283, June 2019.

Hu, Yongjun, Li, Yong, He, Jiannan, Cheng, Xiaoling, Lin, Feng, Xiao, Xiaoting, He, Yuanchuan, Zhong, Binqiang, Zheng, Chunchun, Zheng, Yu chuan, and Wu, Yuchi, "The Influence of stirring time on mechanical properties of Sn-58Bi Alloy treated in the semi-solid state by mechanical stirring process," Key Engineering Materials, vol. 480-481, pp. 1521-1524, 2011.

Hu, Yu-hua, Xue, Song-bai, Wang, Hui, Ye, Huan, Xiao, Zheng-xiang, and Gao, Li-li, "Effects of rare earth element Nd on the solderability and microstructure of Sn-Zn lead-free solder," Journal of Materials Science: Materials in Electronics, vol. 22 no. 5, pp. 481-487, May 2011.

Hu, Yushi, Perello, David, Mushtaq, Usman, and Yun, Minhee, "A Single Palladium Nanowire Via Electrophoresis Deposition Used as a Ultrasensitive Hydrogen Sensor," IEEE Transactions on Nanotechnology , vol. 7 no. 6, pp. 693-699, Nov. 2008.

Hu, Zhangqi, Wang, Qian, Guo, Han, Chen, Yu, Cui, C. Q., Wang, Jian, Wang, Fengwei, and Cai, Jian, "Ultra-Thin chip on Flex by Solder-on-pad (SoP) Technology," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 645-650.

Hu, Zhili, Du, Wenhui, Yue, Cong, Ye, Lilei, Yuan, Zhichao, and Liu, Johan, "Influence of Substrate on Electrical Conductivity of Isotropic Conductive Adhesive," 2011 International Symposium on Advanced Packaging Materials , Xiamen, China, Oct. 25-28, 2012, pp. 330-335.

Hua, Fay, "Densification in Electronics Packaging and Assembly," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Hua, Fay, Mei, Zequn, and Glazer, Judy, "Eutectic Sn-Bi as an Alternative to Pb-Free Solders," 1998 Proceedings 48th Electronic Components & Technology Conference, Seattle, WA, May 25-28, 1998, pp. 277-283.

Hua, Fay, Mei, Zequn, Glazer, Judy, and Lavagnino, Ayn, "Eutectic Sn-Bi as an Alternative Pb-Free Solder," IPC Works '99 , Minneapolis, MN, Oct. 23-28, 1999, pp. xx-xx.

Hua, Fay, Deppisch, Carl, and Fitzgerald, Tom, "Indium as Thermal Interface Material for High Power Devices," Advancing Microelectronics, vol. 33 no. 4, pp. 16-17, July/Aug. 2006.

Hua, Fay, Deppisch, Carl, and Fitzgerald, Tom, "Indium as Thermal Interface Material for High Power Devices," Advancing Microelectronics, vol. 33 no. 5, pp. 30-32, Sept./Oct. 2006.

Hua, Fay, and Glazer, Judith, "Lead-Free Solders for Electronic Assembly," Design & Reliability of Solders and Solder Interconnections, Orlando, FL, Feb. 10-13, 1997, pp. 65-73.

Hua, Fay, "Pb-free Solder Challenges in Electronic Packaging and Assembly," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 58-63.

Hua, Fay, and Deppisch, Carl, "Solder as Thermal Interface Material for High Power Devices," SMTA Journal, vol. 19 no. 1, pp. 21-26, Jan.-Mar. 2006.

Hua, Fay, Aspandiar, Raiyo, Anderson, Cameron, Clemons, Greg, Chung, Chee-key, and Faizul, Mustapha, "Solder Joint Reliability Assesment of Sn-Ag-Cu BGA Components Attached with Eutectic Pb-Sn Solder," 2003 SMTA International Conference Proceedings , Chicago, IL, Sept. 21-25, 2003, pp. 246-252.

Hua, Fay, Aspandiar, Raiyo, Rothman, Tim, Anderson, Cameron, Clemons, Greg, and Klier, Mimi, "Solder Joint Reliability of Sn-Ag-Cu BGA Components Attached with Eutectic Pb-Sn Solder Paste," 2002 SMTA International Conference Proceedings , Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Hua, Fay, Aspandiar, Raiyo, Rothman, Tim, Anderson, Cameron, Clemons, Greg, and Klier, Mimi, "Solder Joint Reliability of Sn-Ag-Cu BGA Components Attached with Eutectic Pb-Sn Solder Paste," Journal of SMT, vol. 16 no. 1, pp. 34-42, Jan. 2003.

Hua, Jianwei, Huang, Chunyue, Liang, Ying, Li, Tian-ming, and Zhang, Long, "Analysis of solder joint shape parameters on the stress and strain of the solder joint in the random vibration condition," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 455-460.

Hua, L., Chan, Y. C., Wu, Y. P., Wu, B. Y., Karabi, S., and Tan, S. C., "A highly selective technique to determine hexavalent chromium in electronic and electrical products for RoHS compliance," 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Odaiba, Japan, Jan. 16-18, 2007, pp. 133-138.

Hua, L., and Zhang, J. S., "Corrosion Behavior of 64Sn-35Bi-1Ag Solder Doped with Zn in NaCl Solution and its Electrochemical Migration Characteristics in High Humid Thermal Condition for Electronic Packaging," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 1034-1039.

Hua, L., and Yang, C., "Corrosion behavior, whisker growth, and electrochemical migration of Sn-3.0Ag-0.5Cu solder doping with In and Zn in NaCl solution," Microelectronics Reliability, vol. 51 no. 12, pp. 2274-2283, Dec. 2011. https://doi.org/10.1016/j.microrel.2011.06.023

Hua, L., and Zhang, L., "Effect of In, Bi, Zn Binary-Metal Dopings in Sn-0.7Cu Solder on its Electrochemical Corrosion Charateristics in 3 wt.% NaCl Solution," Advanced Materials Research, vol. 548, pp. 286-292, July 2012.

Hua, L., Yang, G. K., and Zhang, H. Q., "Effects of Ge Doping on Electrochemical Migration, Corrosion Behavior and Oxidation Characteristics of Lead-free Sn-3.0Ag-0.5Cu Solder for Electronic Packaging," Advanced Materials Research, vol. 146-147, no. xx, pp. 953-961, Oct. 2011.

Hua, L., Yang, G. K., and Zhang, H. Q., "Effects of Ge Doping on Electrochemical Migration, Corrosion Behavior and Oxidation Characteristics of Lead-free Sn-3.0Ag-0.5Cu Solder for Electronic Packaging," Advanced Materials Research, vol. 146-147, pp. 953-961, Oct. 2010.

Hua, L., Hou, H. N., Zhang, H. Q., Wu, T., and Deng, Y. H., "Effects of Zn, Ge Doping on Electrochemical Migration, Oxidation Characteristics and Corrosion Behavior of Lead-Free Sn-3.0Ag-0.5Cu Solder for Electronic Packaging," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 1151-1157.

Hua, L., and Hou, H. N., "Electrochemical corrosion and electrochemical migration of 64Sn-35Bi-1Ag solder doping with xGe on printed circuit boards," Microelectronics Reliability, vol. 75, pp. 27-36, Aug. 2017.

Hua, L., Dai, W., Duan, L. S., and Zhong, C. Y., "Electrochemical Migration and Electrochemical Corrosion Behaviors in 3wt.% NaCl Solution of 64Sn-35Bi-1Ag Solder with In doping for Micro-nanoelectronic Packagings," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1372-1376.

Hua, L., Su, M. W., Zhang, W. J., and Hu, Q. L., "Electrochemical migration and rapid whisker growth of Zn and Bi dopings in Sn-3.0Ag-0.5Cu Solder in 3wt.% NaCl Solution," Advanced Materials Research, vol. 239-242, pp. 1751-1760, 2011.

Hua, L., Wu, Y. P., An, B., and Wu, F. S., "Lead Determination by Microwave-Assisted Inductively Coupled Plasma Optical Emission Spectrometry for RoHS Compliance," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Hua, L., Wu, Y. P., An, B., Chan, Y. C., Wu, B. Y., and Wu, F. S., "The Determinations of Pb, Cd, Hg, Cr6+, PBBs/PBDEs to Comply with RoHS Directive," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Huakang, Li, Yong, Zhang, Peng, Yang, Mingjiang, Ji, and Guanjun, Liu, "Mechanism of Solder Joint Intermittent Faults and Its Detection," 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 16-19, 2018, pp. xx-xx.

Huakang, Li, Kehong, Lyu, Yong, Zhang, Qiu, Jing, and Liu, Guanjun, "Study of Solder Joint Intermittent Fault Diagnosis Based on Dynamic Analysis," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 9 no. 9, pp. 1748-1758, Sept. 2019.

Huang, Anderson, Su, Kuo Liang, Liang, Peter, and Lin, Jack, "The Development Trend of Halogen-free Substrate Cores," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 244-246.

Huang, Benlih, Hwang, Hong-Sik, and Lee, Ning-Cheng, "A Compliant and Creep Resistant SAC-Al(Ni) Alloy," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 184-191.

Huang, Benlih, Hwang, Hong-Sik, and Lee, Ning-Cheng, "A Compliant and Creep Resistant SAC-Al(Ni) Alloy," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 730-739.

Huang, Benlih, Hwang, Hong-Sik, and Lee, Ning-Cheng, "A Compliant and Creep Resistant SAC-Al(Ni) Alloy," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 693-702.

Huang, Benlih, Wang, Hong-Sik, and Lee, Ning-Cheng, "A Compliant and Creep Resistant SAC-Al(Ni) Alloy," SMTAnews & Journal of Surface Mount Technology, vol. 21 no. 1, pp. 11-20, Jan.-Mar. 2008.

Huang, Benlih, Hwang, Hong-Sik, and Lee, Ning-Cheng, "A Compliant And Creep Resistant SAC-Al (Ni) Alloy," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S26:01.

Huang, Benlih, Hwang, Hong-Sik, and Lee, Ning-Cheng, "A Compliant and Creep Resistant SAC-Al(Ni) Alloy," NEPCON Shanghai 2008 , Shanghai, China, Apr. 8-11, 2008, pp. xx-xx.

Huang, Benlih, Hwang, Hong-Sik, and Lee, Ning-Cheng, "A Compliant and Creep Resistant SAC-Al(Ni) Alloy," SMTA China East Technical Conference 2008, Shanghai, China, Apr. 8-10, 2008, pp. xx-xx.

Huang, Benlih, and Lee, Ning-Cheng, "Compatibility of Lead-Free Solders with Reflow Process," APEX 2000 , Long Beach, CA, Mar. 14-16, 2000, pp. P-MT3/4-1-P-MT3/4-11.

Huang, Benlih, and Lee, Ning-Cheng, "Conquer Tombstoning in Lead-Free Soldering," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S27-1-1-S27-1-8.

Huang, Benlih, and Lee, Ning-Cheng, "Effect of Lead-Free Alloy Composition on Tombstoning," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 219-225.

Huang, Benlih, and Lee, Ning-Cheng, "Effect of lead-free alloy composition on tombstoning," Global SMT & Packaging, vol. 4 no. 9, pp. 4-9, 14, Oct. 2004.

Huang, Benlih, Dasgupta, Arnab, and Lee, Ning-Cheng, "Effect of SAC Composition on Soldering Performance," Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium , San Jose, CA, July 14-16, 2004, pp. 45-55.

Huang, Benlih, Dasgupta, Arnab, and Lee, Ning-Cheng, "Effect of SnAgCu composition on soldering performance," Soldering and Surface Mount Technology, vol. 17 no. 3, pp. 9-19, 2005.

Huang, Benlih, and Lee, Ning-Cheng, "Lead-free: Controlling Tombstoning Behavior," Surface Mount Technology (SMT), vol. 19 no. 7, pp. 44, 46-47, July 2005.

Huang, Benlih, and Lee, Ning-Cheng, "Prospect of Lead Free Alternatives for Reflow Soldering," 1999 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 3906), Chicago, IL, Oct. 26-28, 1999, pp. 711-721.

Huang, Bomin, Chen, Guang, Wu, Fengshun, Xia, Weisheng, Mo, Liping, and Liu, Hui, "Preparation, microstructure and properties of Sn-Ag-Cu solder reinforced with Al2O3 nanoparticles," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 243-246.

Huang, C. H., Chen, Chin-Hsin, Chang, S. Y., Tsao, L. C., and Chen, R. S., "Effect of TiO2 nanoparticle addition and cooling rate on microstructure and mechanical properties of novel Sn1.5Sb0.7Cu solders," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Huang, Chang Pin, Chen, Chih, Liu, C. Y., Lin, S. S., and Chen, K. H., "Metallurgical reactions of Sn-3.5Ag solder with various thickness of electroplated Ni/Cu under bump metallization," Journal of Materials Research, vol. 20 no. 10, pp. 2772-2779, Oct. 2005.

Huang, Chao, Yang, Daoguo, Wu, Boyi, Liang, Lili, and Yang, Yu, "Failure mode of SAC305 lead-free solder joint under thermal stress," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1395-1398.

Huang, Chao, Rao, Li, Ling, Huiqin, Hu, Anmin, and Li, Ming, "Research on the corrosion resistance of SAC305 solder added with Ag3Sn and Cu3Sn nanoparticles," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 712-715.

Huang, Chao, Rao, Li, Sun, Menglong, Hu, Anmin, and Li, Ming, "Superior Reliability of SAC105 Solder on BGA Package Pad with NiPdAu Coating," Journal of Electronic Materials, vol. 48 no. 1, pp. 1-8, Jan. 2019.

Huang, Chia-Wei, and Lin, Kwang-Lung, "Interfacial reactions of lead-free Sn-Zn based solders on Cu and Cu plated electroless Ni-P/Au layer under aging at 150 °C," Journal of Materials Research, vol. 19 no. 12, pp. 3560-3568, Dec. 2004.

Huang, Chia-Wei, and Lin, Kwang-Lung, "Microstructures and mechanical properties of Sn-8.55Zn-0.45Al-XAg solders," Journal of Materials Research, vol. 18 no. 7, pp. 1528-1534, July 2003.

Huang, Chia-Wei, and Lin, Kwang-Lung, "Morphology of Intermetallic Compounds Formed between Lead-Free Sn-Zn Based Solders and Cu Substrates," Journal of Electronic Materials, vol. 35 no. 12, pp. 2135-2141, Dec. 2006.

Huang, Chia-Wei, and Lin, Kwang-Lung, "Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer," Materials Transactions, vol. 45 no. 2, pp. 588-594, Feb. 2004.

Huang, Chien-Ming, Nunez, Daniel, Coburn, James, and Pecht, Michael, "Risk of tin whiskers in the nuclear industry," Microelectronics Reliability, vol. 81, pp. 22-30, Feb. 2018.

Huang, Chien-Sheng, Duh, Jenq-Gong, and Chen, Yen-Ming, "Metallurgical Reaction of the Sn-3.5Ag Solder and Sn-37Pb Solder with Ni/Cu Under-Bump Metallization in a Flip-Chip Package," Journal of Electronic Materials, vol. 32 no. 12, pp. 1509-1514, Dec. 2003.

Huang, Chien-Sheng, Yeh, Jih-Hung, Young, Bi-Lian, and Duh, Jenq-Gong, "Phenomena of Electroless Ni-P and Intermetallic-Compound Stripping and Dissolving in Sn-Bi and Sn-Pb Solder Joints with Au/EN/Cu Metallization," Journal of Electronic Materials, vol. 31 no. 11, pp. 1230-1237, Nov. 2002.

Huang, Chien-Yi, Ku, Chen-Liang, Hsieh, Hao-Chun, Chien, Tzu-Min, and Huang, Hui-Hua, "Reliability Assessment for Printed Circuit Board in Lead-Free Process," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 293-299.

Huang, Chien-Yi, Huang, Hui-Hua, and Ying, Kuo-Ching, "Sn-Cu-Ni Soldering Process Optimization Using Multivariate Analysis," IEEE Transactions on Components, Packaging and Manufacturing Technology , vol. 2 no. 3, pp. 527-535, Mar. 2012.

Huang, Chih-Kai, Lin, Keh-Wen, Huang, Yu-Ming, Caparanga, Alvin R., Leron, Rhoda B., and Li, Meng-Hui, "Effect of Thickness and Phosphorus Content on Au/Pd/Ni(P) Metal Finish of Printed Circuit Board," Journal of Electronic Materials, vol. 42 no. 8, pp. 2648-2657, Aug. 2013.

Huang, Ching An, Liu, Yu Wei, and Chuang, Ching Hao, "The hardening mechanism of a chromium-carbon deposit electroplated from a trivalent chromium-based bath," Thin Solid Films, vol. 517 no. 17, pp. 4902-4904, July 1, 2009.

Huang, Ching-Yu, and Chen, Sinn-Wen, "Interfacial Reactions in In-Sn/Ni Couples and Phase Equilibria of the In-Sn-Ni System," Journal of Electronic Materials, vol. 31 no. 2, pp. 152-160, Feb. 2002.

Huang, Chun-Hao, Tsai, Yi-Ling, Chang, Yu Ting, and Wu, Albert T., "Massive Spalling in Pb-Free Solder on Co-Based Surface Finishes," 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference, Kyoto, Japan, Apr. 14-17, 2015, pp. 586-589.

Huang, Fuxiang, Yin, Ping, Li, Chuntian, and Li, Jichao, "Formation and Growth of Intermetallic Compound Layers at Interface of Solder/Copper Alloys for Lead Frame," Advanced Materials Research , vol. 189-193, pp. 3383-3390, Feb. 2011.

Huang, Gaofei, Jian, Jikang, Lei, Renbo, and Cao, Binglei, "Single-crystalline Bi2Se3 nanowires grown by catalyst-free ambient pressure chemical vapor deposition," Materials Letters, vol. 179, pp. 198-201, Sept. 15, 2016.

Huang, H. L., Tian, J., and Zhang, G. A., "Atmospheric Corrosion Behavior of Tin Under an Alternating Current Electric Field," Journal of Electronic Materials, vol. 46 no. 7, pp. 4359-4372, July 2017.

Huang, H. Z., Wei, X. Q., Zhou, L., Liu, X. D., and Guo, G. L., "Effects of Zn Concentration on Wettability of Sn-Zn Alloy on Cu and on the Interfacial Microstructure Between Sn-Zn alloy and Cu," Acta Metallurgica Sinica, vol. 19 no. 4, pp. 251-257, Aug. 2006.

Huang, H., Wu, Y. Q., Wang, S. L., He, Y. H., Zou, J., Huang, B. Y., and Liu, C. T., "Mechanical properties of single crystal tungsten microwhiskers characterized by nanoindentation," Materials Science and Engineering: A, vol. 523 no. 1-2, pp. 193-198, Oct. 15, 2009.

Huang, Hao-Ting, Ger, Tzong-Rong, Chiang, Jia-Wei, Huang, Zhen-Yu, and Lai, Mei-Feng, "Thermoelectric Property of Nickel Nanowires Enhanced by Resistance," IEEE Transactions on Magnetics, vol. 50 no. 1 pt. 1, pp. xx-xx, Jan. 2014.

Huang, Huaqing, and Liu, Feng, "Tensile strained gray tin: Dirac semimetal for observing negative magnetoresistance with Shubnikov-de Haas oscillations," Physical Review B, vol. 95 no. 20, pp. 201101-1-201101-5, 2017.

Huang, Huizhen, Shuai, Gewang, Wei, Xiuqin, and Yin, Chuanqiang, "Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder," Microelectronics Reliability, vol. 74, pp. 15-21, July 2017.

Huang, Huizhen, Wei, Xiuqin, and Zhou, Lang, "Growth Kinetics of Intermetallic Compounds at the Interface of Liquid Sn-9Zn/Cu," Advanced Materials Research, vol. 233-235, pp. 2323-2327, 2011.

Huang, Huizhen, Wei, Xiuqin, Liao, Fuping, and Zhou, Lang, "Preparation and Properties of Particle Reinforced Sn-Zn-based Composite Solder," Journal of Wuhan University of Technology-- Materials Science , vol. 24 no. 2, pp. 206-209, Apr. 2009.

Huang, J. Q., Zhou, M. B., Liang, S. B., and Zhang, X. P., "Size effects on the interfacial reaction and microstructural evolution of Sn-ball/Sn3.0Ag0.5Cu-paste/Cu joints in board-level hybrid BGA interconnection at critical reflowing temperature," Journal of Materials Science: Materials in Electronics, vol. 29 no. 9, pp. 7651-7660, May 2018.

Huang, J. Q., Zhou, M. B., and Zhang, X. P., "The Melting Characteristics and Interfacial Reactions of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu Joints During Reflow Soldering," Journal of Electronic Materials, vol. 46 no. 3, pp. 1504-1515, Mar. 2017.

Huang, J. R., Tsai, C. M., Lin, Y. W., and Kao, C. R., "Pronounced electromigration of Cu in molten Sn-based solders," Journal of Materials Research, vol. 23 no. 1, pp. 250-257, Jan. 2008.

Huang, Jia-Qiang, Zhou, Min-Bo, and Zhang, Xin-Ping, "Effect of electromigration on the microstructural evolution and shear fracture behavior of mixed assembled Cu/Sn-3.0Ag-0.5Cu-ball/Sn-58Bi-paste/Cu joints in board-level packaging," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 531-535.

Huang, Jia-Qiang, Zhou, Min-Bo, Li, Wang-Yun, and Zhang, Xin-Ping, "Interfacial reactions and formation of intermetallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 307-311.

Huang, Jia-Qiang, Zhou, Min-Bo, and Zhang, Xin-Ping, "Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging," 2016 17th International Conference on Electronic Packaging Technology , Wuhan, China, Aug. 16-19, 2016, pp. 968-973.

Huang, Jia-Qiang, Zhou, Min-Bo, Zhao, Xing-Fei, and Zhang, Xin-Ping, "Microstructures and shear properties of mixed assembly BGA structure SnAgCu/SnBi(Ag)/Cu joints in board-level packaging," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1649-1654.

Huang, Jia-Qiang, Zhou, Min-Bo, Li, Chang-Zheng, Ma, Xiao, and Zhang, Xin-Ping, "Processing Performance and Microstructure of Sn-Zn Based Solders Modified by Bi and Mixed Rare Earth Elements," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 352-355.

Huang, Jia-Qiang, Zhou, Min-Bo, Li, Wang-Yun, and Zhang, Xin-Ping, "Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on BGA packaging," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 1010-1014.

Huang, Jianlin, Chen, Quayle, Xu, Leon, and Zhang, G. Q., "Prediction of Drop Impact Reliability of BGA Solder Joints on FPC," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 663-667.

Huang, Jung-Tang, Chao, Pen-Shan, Hsu, Hou-Jun, and Shih, Sheng-Hsiung, "A novel bumping process for fine pitch Sn-Cu lead-free plating-based flip chip solder bumps," Materials Science in Semiconductor Processing , vol. 10 no. 4-5, pp. 133-142, Aug.-Oct. 2007.

Huang, Jung-Tang, Chao, Pen-Shan, Hsu, Hou-Jun, and Shih, Sheng-Hsiung, "Combination of Fine Pitch and High Uniformity of Lead-Free Plating-Based Flip Chip Solder Bumps," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Huang, K. C., Shieu, F. S., Huang, T. S., Lu, C. T., Chen, C. W., Tseng, H. W., Cheng, S. L., and Liu, C. Y., "Study of Interfacial Reactions Between Sn(Cu) Solders and Ni-Co Alloy Layers," Journal of Electronic Materials, vol. 39 no. 11, pp. 2403-2411, Nov. 2010.

Huang, K. T., Chiu, C. T., Cohen, R. M., and Stringfellow, G. B., "InAsBi alloys grown by organometallic vapor phase epitaxy," Journal of Crystal Growth, vol. 134 no. 1-2, pp. 29-34, Nov. 1993.

Huang, Kuan-Chieh, Chen, Jing-Yu, Tsai, Ho-Cheng, Lai, Chien-Lung, and Wu, Pu-Wei, "Electroplating of Sn-2.5Ag Solders as 20 um Pitch Micro-bumps," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Huang, Kuan-Chih, Shieu, Fuh-Sheng, Hsiao, Y. H., and Liu, C. Y., "Ni Interdiffusion Coefficient and Activation Energy in Cu6Sn5," Journal of Electronic Materials, vol. 41 no. 1, pp. 172-175, Jan. 2012.

Huang, Kui, Guo, Jie, and Xu, Zhenming, "Recycling of waste printed circuit boards: A review of current technologies and treatment status in China," Journal of Hazardous Materials, vol. 164 no. 2-3, pp. 399-408, May 30, 2009.

Huang, L., Ling, G., Zhang, C., and Li, J., "Electroless Plating of Silver Nanoparticles On Silica Spheres," Plating & Surface Finishing, vol. 91 no. 3, pp. 46-50, Mar. 2004.

Huang, Lin, Lin, Xuenian, Chen, Renwu, and Wang, Jiangyong, "Sn whisker growth in Cu(top)-Sn(bottom) bilayer system upon room temperature aging," Advanced Materials Research, vol. 785-786, pp. 918-923, Sept. 2013.

Huang, Lin, Jian, Wei, Lin, Bing, Wen, Yuren, Gu, Lin, and Wang, Jiangyong, "Thermodynamic understanding of Sn whisker growth on the Cu surface in Cu(top)-Sn(bottom) bilayer system upon room temperature aging," Journal of Applied Physics, vol. 117 no. 21, pp. 215308-1-215308-8, June 7, 2015.

Huang, M. L., Zhang, Z. J., Zhao, N., and Zhou, Q., "A synchrotron radiation real-time in situ imaging study on the reverse polarity effect in Cu/Sn-9Zn/Cu interconnect during liquid-solid electromigration," Scripta Materialia, vol. 68 no. 11, pp. 853-856, June 2013.

Huang, M. L., Zhou, Q., Zhao, N., and Zhang, Z. J., "Abnormal Diffusion Behavior of Zn in Cu/Sn-9 wt.%Zn/Cu Interconnects During Liquid-Solid Electromigration," Journal of Electronic Materials, vol. 42 no. 10, pp. 2975-2982, Oct. 2013.

Huang, M. L., Huang, F. F., and Yang, Y. C., "Composition design of Sn-rich Sn-Au-Ag solders using cluster-plus-glue-atom model," Journal of Materials Science: Materials in Electronics, vol. 28 no. 15, pp. 11192-11201, Aug. 2017.

Huang, M. L., Wang, L., and Wu, C. M. L., "Creep behavior of eutectic Sn-Ag lead-free solder alloy," Journal of Materials Research, vol. 17 no. 11, pp. 2897-2903, Nov. 2002.

Huang. M. L., Wu, C. M. L., and Wang, L., "Creep Resistance of Tin-Based Lead-Free Solder Alloys," Journal of Electronic Materials, vol. 34 no. 11, pp. 1373-1377, Nov. 2005.

Huang, M. L., Ye, S., and Zhao, N., "Current-induced interfacial reactions in Ni/Sn-3Ag-0.5Cu/Au/Pd(P)/Ni-P flip chip interconnect," Journal of Materials Research, vol. 26 no. 24, pp. 3009-3019, Dec. 28, 2011.

Huang, M. L., Zhao, J. F., Zhang, Z. J., and Zhao, N., "Dominant effect of high anisotropy in b-Sn grain on electromigration-induced failure mechanism in Sn-3.0Ag-0.5Cu interconnect," Journal of Alloys and Compounds, vol. 678, pp. 370-374, Sept. 5, 2016.

Huang, M. L., and Zhao, N., "Effect of Electromigration on the Type of Drop Failure of Sn-3.0Ag-0.5Cu Solder Joints in PBGA Packages," Journal of Electronic Materials, vol. 44 no. 10, pp. 3927-3933, Oct. 2015.

Huang, M. L., and Wang, L., "Effects of Cu, Bi, and In on Microstructure and Tensile Properties of Sn-Ag-X (Cu, Bi, In) Solders," Metallurgical and Materials Transactions, vol. 36A no. 6, pp. 1439-1446, June 2005.

Huang, M. L., Kuang, J. M., and Sun, H. Y., "Electromigration-Induced b-Sn grain rotation in lead-free flip chip solder bumps," 2019 IEEE 69th Electronic Components and Technology Conference , Las Vegas, NV, May 28-31, 2019, pp. 2036-2041.

Huang, M. L., Zhou, S. M., and Chen, L. D., "Electromigration-Induced Interfacial Reactions in Cu/Sn/Electroless Ni-P Solder Interconnects," Journal of Electronic Materials, vol. 41 no. 4, pp. 730-740, Apr. 2012.

Huang, M. L., Yang, F., Zhao, N., and Zhang, Z. J., "In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction," Materials Letters, vol. 139, pp. 42-45, Jan. 15, 2015.

Huang, M. L., Zhou, Q., Zhao, N., and Chen, L. D., "Interfacial microstructure and mechanical properties of In-Bi-Sn lead-free solder," Journal of Materials Science: Materials in Electronics, vol. 24 no. 7, pp. 2624-2629, July 2013.

Huang, M. L., Liu, Y., and Gao, J. X., Huang, M. L., Liu, Y., and Gao, J. X., "Interfacial reaction between Au and Sn films electroplated for LED bumps," Journal of Materials Science: Materials in Electronics, vol. 22 no. 2, pp. 193-199, Feb. 2011.

Huang, M. L., Pan, J. L., Ma, H. T., and Zhao, N., "Interfacial reactions of sequentially electroplated Au/Sn/Au films on Si chips," Materials Science and Technology, vol. 28 no. 7, pp. 837-843, July 2012.

Huang, M. L., Wu, C. M. L., Lai, J. K. L., Wang, L., and Wang, F. G., "Lead free solder alloys Sn-Zn and Sn-Sb prepared by mechanical alloying," Journal of Materials Science: Materials in Electronics, vol. 11, no. 1, pp. 57-65, Feb. 2000.

Huang, M. L., Huang, Y. Z., Ma, H. T., and Zhao, J., "Mechanical Properties and Electrochemical Corrosion Behavior of Al/Sn-9Zn-xAg/Cu Joints," Journal of Electronic Materials, vol. 40 no. 3, pp. 315-323, Mar. 2011.

Huang, M. L., Wu, C. M. L., Lai, J. K. L. and Chan, Y. C., "Microstructural Evolution of a Lead-Free Solder Alloy Sn-Bi-Ag-Cu Prepared by Mechanical Alloying during Thermal Shock and Aging," Journal of Electronic Materials, vol. 29 no. 8, pp. 1021-1026, Aug. 2000.

Huang, M. L., Hou, X. L., Kang, N., and Yang, Y. C., "Microstructure and interfacial reaction of Sn-Zn-x(Al,Ag) near-eutectic solders on Al and Cu substrates," Journal of Materials Science: Materials in Electronics, vol. 25 no. 5, pp. 2311-2319, May 2014.

Huang, M. L., Yang, Y. C., Chen, Y., and Dong, C., "Microstructure and mechanical properties of Sn-rich Au-Sn solders designed using cluster-plus-glue-atom model," Materials Science and Engineering: A, vol. 664, pp. 221-226, May 10, 2016.

Huang, M. L., Loeher, T., Manessis, D., Boettcher, L., Ostmann, A., and Reichl, H., "Morphology and Growth Kinetics of Intermetallic Compounds in Solid-State Interfacial Reaction of Electroless Ni-P with Sn-Based Lead-Free Solders," Journal of Electronic Materials, vol. 35 no. 1, pp. 181-188, Jan. 2006.

Huang, M. L., Zhao, J. F., Zhang, Z. J., and Zhao, N., "Role of diffusion anisotropy in b-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration," Acta Materialia, vol. 100, pp. 98-106, Nov. 2015.

Huang, M. L., and Yang, F., "Size effect on interfacial reactions of Sn-3.0Ag-0.5Cu solder balls on Cu and Ni-P pads," Journal of Materials Science: Materials in Electronics , vol. 26 no. 2, pp. 933-942, Feb. 2015.

Huang, M. L., Zhang, F., Yang, F., and Zhao, N., "Size effect on tensile properties of Cu/Sn-9Zn/Cu solder interconnects under aging and current stressing," Journal of Materials Science: Materials in Electronics, vol. 26 no. 4, pp. 2278-2285, Apr. 2015.

Huang, M. L., Yang, F., Zhao, N., and Yang, Y. C., "Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in sub-50 um Sn-Ag-Cu solder bumps," Journal of Alloys and Compounds, vol. 602, pp. 281-284, July 25, 2014.

Huang, Mark, Yeow, Ong Gee, Poo, Chia Yong, and Jiang, Tom, "A Study on Copper Pillar Interconnect in Flip-Chip-On-Module Packaging," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 325-330.

Huang, Mark, Yeow, Ong Gee, Poo, Chia Yong, and Jiang, Tom, "Intermetallic Formation of Copper Pillar With Sn-Ag-Cu for Flip-Chip-On-Module Packaging," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 4, pp. 767-775, Dec. 2008.

Huang, Meng-Kuang, and Lee, Chiapyng, "Board level reliability of lead-free designs of BGAs, CSPs, QFPs and TSOPs," Soldering & Surface Mount Technology, vol. 20 no. 3, pp. 18-25, 2008.

Huang, Meng-Kuang, Lee, Chiapyng, Wu, Pei-Lin, and Tzan, Shyh-Rong, "The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints," Soldering & Surface Mount Technology, vol. 17 no. 3, pp. 3-8, 2005.

Huang, Ming-liang, Wang, Lai, and Wang, Fu-gang, "Lead-free solder alloy Sn-5Sb prepared by mechanical alloying," Journal of Dalian University of Technology, vol. 43 no. 4, pp. 447-451, 2003.

Huang, Mingliang, Yang, Fan, Zhao, Ning, and Zhang, Fei, "Dissolution and Precipitation of Ag3Sn Plates in Ultra Fine Solder Joints Using Synchrotron Radiation Real-time Imaging Technology," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 822-825.

Huang, Mingliang, Liu, Shuang, Zhao, Ning, Long, Haohui, Li, Jianhui, and Hong, Weiqiang, "Drop Failure Modes of A Wafer-Level Chip-Scale Packaging," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 1094-1098.

Huang, Mingliang, Zhang, Fei, Yang, Fan, and Zhao, Ning, "Effect of electromigration on the tensile strength of Cu/Sn-9Zn/Cu solder interconnects," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1190-1193.

Huang, Mingliang, Zhou, Qiang, Ma, Haitao, and Zhao, Jie, "Effect of Liquid-solid Electromigration on Interfacial Reaction in Cu/Sn-9Zn/Cu Solder Joint," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 1090-1093.

Huang, Mingliang, Chen, Leida, Zhou, Shaoming, and Ye, Song, "Effect of surface finish (OSP and ENEPIG) on failure mechanism induced by electromigration in Sn-3.0Ag-0.5Cu flip chip solder interconnect," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 297-301.

Huang, Mingliang, Hou, Xianlin, Ma, Haitao, Zhao, Jie, and Yang, Yaochun, "Interfacial Reaction and Mechanical Properties of Al/Sn-Zn-Ni/Cu Solder Joints," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 879-882.

Huang, Mingliang, Liu, Ting, Zhao, Ning, and Hao, Hua, "Interfacial Reaction in Cu/Sn/Cu Fine Pitch Interconnect during Soldering," 2013 14th International Conference on Electronic Packaging Technology , Dalian, China, Aug. 11-14, 2013, pp. 382-385.

Huang, Mingling, Zhang, Tongxin, Zhao, Ning, and Jiao, Tingting, "Interfacial Reactions of Co-electrodeposited Eutectic Au-Sn Solder Bumps on Ni and Cu Substrates," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 225-228.

Huang, Mingliang, Zhang, Zhijie, Zhao, Ning, and Yang, Fan, "Migration behavior of indium atoms in Cu/Sn-52In/Cu interconnects during electromigration," Journal of Materials Research, vol. 30 no. 21, pp. 3316-3323, Nov. 13, 2015.

Huang, Mingliang, Zhang, Zhijie, Zhao, Ning, and Feng, Xiaofei, "Reverse Polarity Effect in Cu/Sn-9Zn/Ni Interconnect under High Current Density at High Temperature," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 433-436.

Huang, Mingliang, "Shear Failure Analysis of Sub-50 um Flip Chip Lead-free Solder Bumps," International Symposium on High Density Packaging and Microsystem Integration , Shanghai, China, June 26-28, 2007, pp. xx-xx.

Huang, Mingliang, Zhang, Zhijie, Zhou, Shaoming, and Chen, Leida, "Stress relaxation and failure behavior of Sn-3.0Ag-0.5Cu flip-chip solder bumps undergoing electromigration," Journal of Materials Research , vol. 29 no. 21, pp. 2556-2564, Nov. 14, 2014.

Huang, Mingliang, Yang, Fan, Zhao, Ning, Liu, Xiaohua, and Wang, Jingyun, "Study on size effect and cross-interaction in Cu/Sn/Ni-P interconnects," 2014 15th International Conference on Electronic Packaging Technology , Chengdu, China, Aug. 12-15, 2014, pp. 429-432.

Huang, Na, Hu, Anmin, and Li, Ming, "Growth of Cu-Sn intermetallic compounds during isothermal aging processing in electroplated Cu/Sn/Cu system," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 781-783.

Huang, Na, Hu, Anmin, Li, Ming, and Mao, Dali, "Influence of Cr alloying on the oxidation resistance of Sn-8Zn-3Bi solders," Journal of Materials Science: Materials in Electronics, vol. 24 no. 8, pp. 2812-2817, Aug. 2013.

Huang, Na, Hu, Anmin, and Li, Ming, "Influence of texture of Cu on the growth of Cu-Sn intermetallic compounds," Materials Letters, vol. 109, pp. 8-11, Oct. 15, 2013.

Huang, Po-Chun, and Duh, Jenq-Gong, "Effects of Different Surfactant Additions and Treatments on the Characteristics of Tin Nanosolder by Chemical Reduction Method," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 431-435.

Huang, Qiaojian, Lilley, Carmen M., Divan, Ralu, and Bode, Matthias, "Electrical Failure Analysis of Au Nanowires," IEEE Transactions on Nanotechnology, vol. 7 no. 6, pp. 688-692, Nov. 2008.

Huang, Ru, Xia, Mengrou, Yao, Jinye, Wang, Boyin, Qi, Xiao, Qiao, Junshan, and Ma, Haitao, "Size Effect of Interfacial Reaction in Sn-0.7Cu/Cu solder under Multiple Reflow," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 391-395.

Huang, Ru, Ma, Haoran, Shang, Shengyan, Kunwar, Anil, Wang, Yunpeng, and Ma, Haitao, "Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows," Journal of Materials Science: Materials in Electronics, vol. 30 no. 5, pp. 4359-4369, Mar. 2019.

Huang, Shin-Yi, Zhan, Chau-Jie, Chung, Su-Ching, Fan, Chia-Wen, Chen, Su-Mei, Chang, Tao-Chih, and Chen, Tai-Hong, "Bonding and reliability assessment of 30 um pitch solder micro bump interconnection with various UBM structure for 3D chip stacking," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 454-457.

Huang, Shin-Yi, Zhan, Chau-Jie, Huang, Yu-Wei, Lin, Yu-Min, Fan, Chia-Wen, Chung, Su-Ching, Kao, Kuo-Shu, Chang, Jing-Yao, Wu, Mei-Lun, Yang, Tsung-Fu, Lau, John H., and Chen, Tai-Hung, "Effects of UBM Structure/material on the Reliability Performance of 3D Chip Stacking with 30um-pitch Solder Micro Bump Interconnections," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 1287-1292.

Huang, Shin-Yi, Chang, Tao-Chih, Cheng, Ren-Shin, Chang, Jing-Yao, Fan, Chia-Wen, Zhan, Chau-Jie, Lau, John H., Chen, Tai-Hong, Lo, Wei-Chung, and Kao, Ming-Jer, "Failure Mechanism of 20 um Pitch Microjoint within a Chip Stacking Architecture," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 886-892.

Huang, Shu-Chen, Li, Hsun-Tien, Chen, Kai-Chi, and Lee, Tzong-Ming "New Surface Functional Metal Powders for Anisotropic Conductive Film Materials in Electronic Package Application Materials Research Society Symposium Proceedings Volume 734, Boston, MA, Dec. 2-6, 2002, pp. B9-13-B9.14.

Huang, T. C., Yang, T. L., Ke, J. H., Hsueh, C. H., and Kao, C. R., "Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressing," Scripta Materialia, vol. 80, pp. 37-40, June 2014.

Huang, T. S., Tseng, H. W., Lu, C. T., Hsiao, Y. H., Chuang, Y. C., and Liu, C. Y., "Growth Mechanism of a Ternary (Cu,Ni)6Sn5 Compound at the Sn(Cu)/Ni(P) Interface," Journal of Electronic Materials, vol. 39 no. 11, pp. 2382-2386, Nov. 2010.

Huang, Ting-Chia, Smet, Vanessa, Raj, Pulugurtha Markondeya, Tummala, Rao R., Ramos, Gustavo, Kilian, Arnd, Taylor, Robin, and Nichols, Rick, "Demonstration of Next-generation Au-Pd Surface Finish with Solder-capped Cu Pillars for Ultra-fine Pitch Applications," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 2553-2560.

Huang, Wan Yu, Chen, Eason, Lai, Jeng Yuan, and Wang, Yu Po, "Stress Evaluations in Micro Bump Structures of FCBGA," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Huang, Wei-Chih, and Lin, Kwang-Lung, "Effect of Ti Addition on Early-Stage Wetting Behavior Between Zn-25Sn-xTi Solder and Cu," Journal of Electronic Materials, vol. 45 no. 12, pp. 6137-6142, Dec. 2016.

Huang, Wei, "Failure Probability Evaluation Due to Tin Whiskers Caused Leads Bridging on Compressive Contact Connectors," IEEE Transactions on Reliability , vol. 57 no. 3, pp. 426-430, Sept. 2008.

Huang, Wei, Loman, James M., and Sener, Bulent, "Study of the effect of reflow time and temperature on Cu–Sn intermetallic compound layer reliability," Microelectronics Reliability, vol. 42 no. 8, pp. 1229-1234, Aug. 2002.

Huang, Xiao-guang, and Han, Zhong-ying, "Interface singular field analysis and thermal fatigue failure of solder joint in a stacked electronic modules," Journal of Materials Science: Materials in Electronics, vol. 27 no. 8, pp. 8299-8311, Aug. 2016.

Huang, Xing Jia, Lee, Shi-Wei Ricky, and Tse, Wan Sze, "Experimental Characterization for the Shear Strength of Pb-Free Solder Balls on a PZT Substrate with Pd/Ag Pads," Proceedings of 3rd Electronics Packaging Technology Conference, Singapore, Dec. 5-7, 2000, pp. 86-90.

Huang, Xingjia, Lee, S.W. Ricky, Li, Ming, and Chen, William T., "Effect of High Temperature Storage on Reliability of Sn-Ag-Cu Flip Chip Solder Bumps," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Huang, Y. L., Lin, K. L., and Liu, D. S., "Effect of Impact Rate on the Strength of Lead-free Solder Joints," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1369-1374.

Huang, Y. L., Lin, K. L., and Liu, D. S., "Microstructure evolution and microimpact performance of Sn-Ag-Cu solder joints under thermal cycle test," Journal of Materials Research, vol. 25 no. 7, pp. 1312-1320, July 2010.

Huang, Y. L., Lin, K. L., and Liu, D. S., "The micro-impact fracture behavior of lead-free solder ball joints," Journal of Materials Research, vol. 23 no. 4, pp. 1057-1063, Apr. 2008.

Huang, Y. S., Hsiao, H. Y., Chen, Chih, and Tu, K. N., "The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering," Scripta Materialia, vol. 66 no. 10, pp. 741-744, May 2012.

Huang, Y. T., Chen, C. H., Lee, B. H., Chen, H. C., Wang, C. M., and Wu, Albert T., "In Situ Electromigration in Cu-Sn and Ni-Sn Critical Solder Length for Three-Dimensional Integrated Circuits," Journal of Electronic Materials , vol. 45 no. 12, pp. 6163-6170, Dec. 2016.

Huang, Y. T., and Chuang, T. H., "Interfacial Reactions between Liquid In-49Sn Solders and Ag Substrates," Zeitschrift fur Metallkunde, vol. 91 no. 12, pp. 1002-1005, Dec. 2000.

Huang, Yi, Hang, Tao, Hu, Anmin, Chen, Zhuo, Lu, Qin, and Li, Ming, "Solid state diffusion between Sn and Cu microcones on Cu microcones," Journal of Alloys and Compounds, vol. 582, pp. 408-413, Jan. 5, 2014.

Huang, Yilei, Gong, Xun, Bruemmer, Tim, Khanna, S. Kumar, and Chappell, William J., "Magnetically Aligned Anisotropic Conductive Adhesive for High-Frequency Interconnects," 2005 IEEE MTT-S International Microwave Symposium Digest, Long Beach, CA, June 12-17, 2005, pp. 861-864.

Huang, Yilong, Xiu, Ziyang, Wu, Gaohui, Tian, Yanhong, He, Peng, Gu, Xiaolong, and Long, Weimin, "Improving shear strength of Sn-3.0Ag-0.5Cu/Cu joints and suppressing intermetallic compounds layer growth by adding graphene nanosheets," Materials Letters, vol. 169, pp. 262-264, Apr. 15, 2016.

Huang, Yilong, Xiu, Ziyang, Wu, Gaohui, Tian, Yanhong, and He, Peng, "Sn-3.0Ag-0.5Cu nanocomposite solders reinforced by graphene nanosheets," Journal of Materials Science: Materials in Electronics, vol. 27 no. 7, pp. 6809-6815, July 2016.

Huang, Yingzhuo, Huang, Mingliang, and Kang, Ning, "Mechanical Property and Electrochemical Corrosion Behavior of Al/Sn-9Zn-XNi/Cu Joints," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 422-428.

Huang, Yizhe Elisa, Hagen, Debbie, Dody, Glenn, and Burnette, Terry, "Effect of Solder Reflow Temperature Profile On Plastic Package Delamination," Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, Oct. 19-21, 1998, pp. 105-111.

Huang, Yu-chih, and Chen, Sinn-wen, "Co alloying and size effects on solidification and interfacial reactions in the Sn-Zn-(Co)/Cu couples ," Journal of Materials Research, vol. 25 no. 12, pp. 2430-2438, Dec. 2010.

Huang, Yu-chih, Chen, Sinn-wen, Gierlotka, Wojcieh, Chang, Chia-hua, and Wu, Jen-chin, "Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders," Journal of Materials Research, vol. 22 no. 10, pp. 2924-2929, Oct. 2007.

Huang, Yu-chih, and Chen, Sinn-wen, "Effects of Co Alloying and Size on Solidification and Interfacial Reactions in Sn-57 wt.%Bi-(Co)/Cu Couples," Journal of Electronic Materials , vol. 40 no. 1, pp. 62-70, Jan. 2011.

Huang, Yu-chih, Chen, Sinn-wen, Chou, Chin-yi, and Gierlotka, Wojciech, "Liquidus projection and thermodynamic modeling of Sn-Zn-Cu ternary system," Journal of Alloys and Compounds, vol. 477 no. 1-2, pp. 283-290, May 27, 2009.

Huang, Yu-chih, Wu, Kuang-siang, and Chen, Sinn-wen, "Size and substrate effects upon undercooling of Pb-free solders," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 662-665.

Huang, Yu-chih, Chen, Sinn-wen, and Wu, Kuang-siang, "Size and Substrate Effects upon Undercooling of Pb-Free Solders," Journal of Electronic Materials, vol. 39 no. 1, pp. 109-114, Jan. 2010.

Huang, Yu-Chih, Gierlotka, Wojciech, and Chen, Sinn-Wen, "Sn-Bi-Fe thermodynamic modeling and Sn-Bi/Fe interfacial reactions," Intermetallics, vol. 18 no. 5, pp. 984-991, May 2010.

Huang, Yu-Wei, Zhan, Chau-Jie, Juang, Jing-Ye, Yu-Mn, Lin, Huang, Shin-Yi, Chen, Su-Mei, Fan, Chia-Wen, Cheng, Ren-Shin, Chao, Shu-Han, Hsieh, Wan-Lin, Chen, Chih, and Lau, John H., "Effect of Joint Shape Controlled by Thermocompression Bonding on the Reliability Performance of 60um-pitch Solder Micro Bump Interconnections," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 1908-1914.

Huang, Yu-Wei, Lu, Su-Tsai, Peng, Jon-Shiou, Fan, Chia-Wen, Chung, Su-Ching, Chen, Su-Mei, Lu, Yu-Lan, Chang, Pai-Cheng, and Zhan, Chau-Jie, "Evaluation of Fine-Pitch Chip-to-Chip Interconnects Using ACF material with Arrayed Particles," 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 24-26, 2012, pp. 171-174.

Huang, Yufeng, Liu, Wensheng, Ma, Yunzhu, Tang, Siwei, and Chen, Baishan, "Effect of annealing treatment on the microstructure and mechanical properties of hot compression Au80Sn20 alloy," Materials Science and Engineering: A, vol. 722, pp. 69-75, Apr. 11, 2018.

Huang, Yufeng, Liu, Wensheng, Ma, Yunzhu, Wang, Yikai, and Tang, Siwei, "Effects of cooling rate and magnetic field on solidification characteristics of Au80Sn20 eutectic solder," Journal of Materials Science: Materials in Electronics, vol. 29 no. 1, pp. 436-445, Jan. 2018.

Huang, Yufeng, Chen, Xun, Xue, Feng, Wu, Tong, Liu, Wensheng, Ma, Yunzhu, and Tang, Siwei, "Effects of isothermal aging on interfacial microstructure evolution and shear behavior of Au-12Ge/Ni(P)/Kovar Solder Joints," Intermetallics, vol. 124, pp. 106865-1-106865-11, Sept. 2020.

Huang, Z., Kumar, P., Dutta, I., Sidhu, R., Renavikar, M., and Mahajan, R., "Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish," Journal of Electronic Materials , vol. 43 no. 12, pp. 4485-4496, Dec. 2014.

Huang, Z., Dutta, I., and Subbarayan, G. S., "Fracture Behaviors of Simulated Sn-Ag-Cu Solder Microbumps: Effects of Joint Scale and Aging," Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 1, Burlingame, CA, July 16-18, 2013, pp. V001T07A003-1-V001T07A003-7.

Huang, Z., Kumar, P., Dutta, I., Pang, J. H. L., Sidhu, R., Renavikar, M., and Mahajan, R., "Fracture Mechanism Map for the Fracture of Microelectronic Pb-free Solder Joints under Dynamic Loading Conditions," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 298-303.

Huang, Z., Kumar, P., Dutta, I., Pang, J. H. L., Sidhu, R., Renavikar, M., and Mahajan, R., "Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions," Journal of Electronic Materials, vol. 41 no. 2, pp. 375-389, Feb. 2012.

Huang, Z., Kumar, P., Dutta, I., Pang, J. H. L., Sidhu, R., Renavikar, M., and Mahajan, R., "High Strain Rate Fracture Behavior of Sn-Ag-Cu Solder Joints on Cu Substrates," Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, Volume 2, Portland, OR, July 6-8, 2011, pp. 763-771.

Huang, Z., Kumar, P., Dutta, I., Sidhu, R., Renavikar, M., and Mahajan, R., "Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints," Journal of Electronic Materials, vol. 43 no. 1, pp. 88-95, Jan. 2014.

Huang, Zhiheng, Liu, Changqing, Conway, Paul, and Thomson, Rachel, "Characterisation of Intermetallics and Mechanical Behaviour in the Reaction between SnAgCu and Sn-Pb Solder Alloys," Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, China, June 30-July 3, 2004, pp. 52-59.

Huang, Zhiheng, Conway, Paul P., Liu, Changqing, and Thomson, Rachel C., "Inter-Dependence of Processing and Alloy Composition on the Reliability of Sn-Based Lead Free Solders in Fine Pitch FCOB Interconnection," IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, San Jose, CA, July 16-18, 2003, pp. 99-105.

Huang, Zhiheng, Conway, Paul P., and Thomson, Rachel C., "Microstructural Considerations for Ultrafine Lead Free Solder Joints," 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Como, Italy, Apr. 24-26, 2006, pp. xx-xx.

Huang, Zhiheng, Conway, Paul P., and Thomson, Rachel C., "Microstructural considerations for ultrafine lead free solder joints," Microelectronics Reliability, vol. 47 no. 12, pp. 1997-2006, Dec. 2007.

Huang, Zhiheng, Conway, Paul P., and Qin, Rongshan, "Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections," Microsystem Technologies , vol. 15 no. 1, pp. 101-107, Jan. 2009.

Huang, Zhiheng, Conway, Paul P., Liu, Changqing, and Thomson, Rachel C., "Modeling the Interdependence of Processing and Alloy Composition on the Evolution of Microstructure in Sn-Based Lead-Free Solders in Fine Pitch Flip Chip," IEEE Transactions on Components and Packaging Technologies , vol. 29 no. 1., pp. 98-104, Mar. 2006.

Huang, Zhiheng, Conway, Paul P., Jung, Erik, Thomson, Rachel C., Liu, Changqing, Loeher, Thomas, and Minkus, Mathias, "Reliability Issues in Pb-Free Solder Joint Miniaturization," Journal of Electronic Materials, vol. 35 no. 9, pp. 1761-1772, Sept. 2006.

Huang, Zhiheng, Conway, Paul P., Liu, Changqing, and Thomson, Rachel C., "The Effect of Microstructural and Geometrical Features on the Reliability of Ultrafine Flip Chip Microsolder Joints," Journal of Electronic Materials , vol. 33 no. 10, pp. 1227-1235, Oct. 2004.

Huang, Zhihong, Chatterjee, Ritwik, Justison, Patrick, Hernandez, Richard, Pozder, Scott, Jain, Ankur, Acosta, Eddie, Gajewski, Donald A., Mathew, Varughese, and Jones, Robert E., "Electromigration of Cu-Sn-Cu micropads in 3D interconnect," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 12-17.

Huang, Zhihong, Jones, Robert E., and Jain, Ankur, "Experimental investigation of electromigration failure in Cu-Sn-Cu micropads in 3D integrated circuits," Microelectronic Engineering, vol. 122, pp. 46-51, June 25, 2014.

Huang, Zhongyuan, Zhou, Haihui, Chen, Zhongxue, Zeng, Fanyan, Chen, Liang, Luo, Wucheng, and Kuang, Yafei, "Facile synthesis of porous Pt botryoidal nanowires and their electrochemical properties," Electrochimica Acta, vol. 147, pp. 643-649, Nov. 20, 2014.

Hubalek, Jaromir, "Nanowires Electroforming of Nanoporous Electrodes," 2005 Spanish Conference on Electron Devices, Barcelona, Spain, Feb. 2-4, 2005, pp. 217-220.

Hubbard, Ken, "A Comparative Analysis of PTH Holefill Performance Between SnPb and Pb-Free Using Design of Experiments on Complex PCBAs," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 233-254.

Hubble, Neil, "High Temperature Component Warpage as a Function of Moisture Sensitivity (MSL) Rating," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 25-32.

Huckle, J. R., Davis, J. H., Lal, R. B., and Nicolas, D. P., "Growth and Morphology of InBi Whisker Crystals," Journal of Crystal Growth, vol. 16 no. 1, pp. 43-44, Oct. 1972.

Huckle, J. R., Davis, J. H., and Lal, R. B., "Growth of In2Bi Whiskers," Applied Physics Letters, vol. 19 no. 7, pp. 220-221, Oct. 1, 1971.

Huckle, Keith, "Preparing for REACH: The first step is to understand its implications," Green SupplyLine, Aug. 11, 2006.

Huckle, Keith, "Preparing for the environmental challenges of the future," European Semiconductor, vol. xx no. xx, pp. xx-xx, Nov. 2004.

Huckle, Keith, "Will REACH really be like RoHS on steroids?," EE Times Europe , Aug. 4, 2006.

Huckle, Keith, "Will REACH really be like RoHS on steroids?," Green SupplyLine , Aug. 4, 2006.

Hudson, J. B., and Sears, G. W., "Evaporation of Zinc Whiskers," Journal of Chemical Physics, vol. 35 no. x, pp. 1509-1510, 1961.

Hueners, Bruce, "Flip Chip Attach Alternatives," Advanced Packaging, vol. 14 no. 5, pp. 29-32, May 2005.

Huff, D., Katsis, D., Stinson-Bagby, K., Thacker, T., Lu, G.-Q., and Van Wyk, J. D., "Thermal Performance and Microstructure of Lead-free Solder Die Attach Interface in Power Device Packages," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 322-326.

Huffman, Alan, Lueck, Matthew, Bower, Christopher, and Temple, Dorota, "Effects of Assembly Process Parameters on the Structure and Thermal Stability of Sn-Capped Cu Bump Bonds," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1589-1596.

Huffman, Alan, Gregory, Christopher, Lueck, Matthew, Reed, Jason, Temple, Dorota, and Stapleton, Russ, "Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration Using a Fluxing Adhesive," Journal of Microelectronics and Electronic Packaging , vol. 7, pp. 143-145, 2010.

Hugel, W., Kirchner, V., Keller, R., Schimitzek, R., Krinke, J., Guber, M., Welzel, U., and Mittemeijer, E. J., "Results from Detailed Investigations of the Propensity of Whisker Growth Under Different Conditions," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Hughes, Alan, Prowse, Kevin, Whicker, Karen, Watt, Nick, and Breu, Reiner, "Management of RoHS compliance within Bookham," EuroAsia Semiconductor, vol. xx no. xx, pp. xx-xx, Sept. 2006.

Hughes, Andy, "Case Study: Exception PCB Gears Up for RoHS Compliance," CircuiTree , vol. 19 no. 4, pp. xx-xx, Apr. 2006.

Hughes, Andy, "Get back to basics with ROHS Compliance," European Semiconductor , vol. 28 no. 1, pp. G14-G15, Feb. 10, 2006.

Hughes, Andy, "RoHS: More than just ticking a box," Electronics Weekly, Nov. 29, 2005.

Hughes, Andy, "Viewpoint - Devil in the Detail," Engineering and Technology, vol. 1 no. 3, pp. 37, June 2006.

Hughes, Anthony E., Ho, Daniel, Forsyth, Maria, and Hinton, Bruce R. W., "Towards Replacement of Chromate Inhibitors by Rare Earth Systems," Corrosion Reviews, vol. 25 no. 5-6, pp. 591-603, 2007.

Hughes, D. A., and Hansen, N., "High Angle Boundaries Formed by Grain Subdivision Mechanisms," Acta Materialia, vol. 45 no. 9, pp. 3871-3886, Sept. 1997.

Huguley, Jeff, "When Do Thick-film Hybrids Make Sense?," Surface Mount Technology (SMT), vol. 20 no. 12, pp. 44, Dec. 2006.

Huh, J. Y., Hong, K. K., Kim, Y. B., and Kim, K. T., "Phase Field Simulations of Intermetallic Compound Growth during Soldering Reactions," Journal of Electronic Materials, vol. 33 no. 10, pp. 1161-1170, Oct. 2004.

Huh, Seok-Hwan, Kim, Keun-Soo, and Suganuma, Katsuaki, "Effect of Ag Addition on the Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder," Materials Transactions, vol. 42 no. 5, pp. 739-744, May 2001.

Huh, Seok-Hwan, Kim, Keun-Soo, and Suganuma, Katsuaki, "Effect of Au addition on Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder," Materials Transactions, vol. 43 no. 2, pp. 239-245, Feb. 2002.

Hui, Ho Yee, de la Mata, Maria, Arbiol, Jordi, and Filler, Michael A., "Low-Temperature Growth of Axial Si/Ge Nanowire Heterostructures Enabled by Trisilane," Chemistry of Materials, vol. 29 no. 8, pp. 3397-3402, Apr. 25, 2017.

Hui, Ma, Xueqing, Wang, Peng, Chang, and Lin, Jiang, "Establishing the Recycled Supply Chain Network of Waste Electrical and Electronic Equipment," International Conference on Management and Service Science, Beijing, China, Sept. 20-22, 2009, pp. xx-xx.

Hui, Wenhua, "A New Ni-Fe-Co Alloy Substitute for Chromium Plating," 21st AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 17-19, 2000, pp. 75-82.

Hui, Wenhua, Meng, Fanjuan, Ji, Kaiyuan, and Li, Lei, "A Study of Wear Resistance of a New Cr Replacement: An Electrodeposited Ni-Co-X Alloy," 2002 AESF/EPA Conference for Environmental Excellence , Orlando, FL, Jan. 28-30, 2002, pp. xx-xx.

Hui, Wenhua, and Richardson, Rick, "A Study on Friction and Wear Characteristics of NANON-9, A Chrome-Alternative Electrodeposited Nanocrystalline Coating Plated on High-Strength Steel," Proceedings 2004 AESF/EPA Conference for Environmental & Process Excellence, Orlando, FL, Jan. 26-29, 2004, pp. 80-84.

Hui, Wenhua, Gu, Yanhong, Liu, Jiajun, Meng, Fanjuan, Zhang, Zhijun, Li, Yuliang, Li, Zhanping, Cao, Lili, and Zhang, Xiaohan, "Nano-crystalline Sn-Co-X Alloy Alternative to Decorative Chromium Plating," Metal Finishing, vol. 111 no. 2, pp. 14-17, Mar.-Apr. 2013.

Hui, Wenhua, and Chen, Phil Hanqiu, "The Study on Microstructure and Wear-resistance Mechanism of a Chromium Replacement Coating," 22nd AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 29-Feb. 1, 2001, pp. xx-xx.

Hui-Chuan, Tsai, Meng-Chieh, Liao, and Chieng-Hong, Lee, "Formation and Growth of Intermetallics Evolution at the SAC305 and SAC0307 Solder Joints after Wave Soldering," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Huisman, J., Stevels, A. L. N., and Stobbe, I., "Eco-Efficiency Considerations on the End-of-Life of Consumer Electronic Products," IEEE Transactions on Electronics Packaging Manufacturing , vol. 27 no. 1, pp. 9-25, Jan. 2004.

Huisman, J., Boks, C. B., and Stevels, A. L. N., "Quotes for environmentally weighted recyclability (QWERTY): concept of describing product recyclability in terms of environmental value," International Journal of Production Research, vol. 41 no. 16, pp. 3649-3665, Nov. 10, 2003.

Huisman, Jaco, and Stevels, Ab L. N., "Eco-Efficiency of Take-Back and Recycling, a Comprehensive Approach," IEEE Transactions on Electronics Packaging Manufacturing, vol. 29 no. 2, pp. 83-90, Apr. 2006.

Huisman, Jaco, and Stevels, Ab, "Eco-Efficient Implementation of Electronic Waste Policies in Practice," 2004 IEEE International Symposium on Electronics & the Environment Conference Record, Scottsdale, AZ, May 10-13, 2004, pp. 243-248.

Huisman, Jaco, and Stevels, Ab, "Existing and Future Avenues for Eco-Efficient E-scrap Recycling," Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, New Orleans, LA, May 16-19, 2005, pp. 231-236.

Huisman, Jaco, and Magalini, Federico, "Where are WEEE now? Lessons from WEEE: Will EPR work for the US?," Proceedings of the 2007 IEEE International Symposium on Electronics & the Environment, Orlando, FL, May 7-10, 2007, pp. 149-154.

Huisman, Jaco, Stevels, Ab, Marinelli, Thomas, and Magalini, Federico, "Where did WEEE go wrong in Europe? Practical and academic lessons for the US," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 83-88.

Huiwen, Zhang, Wei, Cui, Jingshan, He, Jiuchun, Yan, and Shiqin, Yang, "Formation and evolution of intermetallic compounds at interfaces of Cu/Al joints by ultrasonic-assisted soldering," Journal of Materials Processing Technology, vol. 223, pp. 1-7, Sept. 2015.

Hula, Aaron, Jalali, Kiumars, Hamza, Karim, Skerlos, Steven J., and Saitou, Kazuhiro, "Multi-Criteria Decision-Making for Optimization of Product Disassembly under Multiple Situations," Environmental Science & Technology, vol. 37 no. 23, pp. 5303-5313, 2003.

Hulser, P., "Chromitierung, chrom(VI)-freier Passivierungsuntergrund fur Deltacoll auf Zink- und Zinklegierungen," Sur Tec GmbH.

Hulser, Peter, "Chromitition(R), Passivation sans chrome(VI): Base pour Deltacoll(R) et DELTA-PROTEKT(R) sur Zinc et alliages de zinc," Sur Tec GmbH, Oct. 21, 2002.

Hulser, Peter, "Replacement of Hexavalent Chrome Passivations on Galvanized Steel," Sur Tec GmbH, Mar. 19, 2002.

Hulsken, G., Wynn, H. P., Bucchianico, A. Di, Bogaard, J. A. van den, Mushkudiani, N. A., and Shangguan, D., "Functional Signature Analysis for Product End-of-Life Management," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 23-24, 2003, pp. 232-238.

Hult, Robert, "Get the Lead Out," ConnectorSupplier.com.

Hume, A., Grimes, S., and Boyce, J., "Environmental product attributes in end-of-life management in the UK. Part I: An end-of-life eco-declaration for waste IT and office equipment," International Journal of Environment and Pollution, vol. 18 no. 2, pp. 109-125, 2002.

Hume, A., Grimes, S., and Boyce, J., "Environmental product attributes in end-of-life management in the UK. Part II: Problems encountered with informational systems for the management of end-of-life IT and office equipment," International Journal of Environment and Pollution, vol. 18 no. 2, pp. 126-137, 2002.

Hume, Anthony, Grimes, Susan, Jackson, Tim, and Boyce, Joy, "Implementing Producer Responsibility: Managing End-of-Life Consumables in an IT-Service Industry," 2002 IEEE International Symposium on Electronics & the Environment, San Francisco, CA, May 6-9, 2002, pp. 144-149.

Hume-Rothery, William, "The crystal structures of the elements of the B sub-groups and their connexion with the periodic table and atomic structures," Philosophical Magazine, Series 7 vol. 9 no. 55, pp. 65-80, 1930. https://doi.org/10.1080/14786443008564982

Hume-Rothery, William, "The Lattice Constants of the Elements," Philosophical Magazine, Series 7 vol. 10 no. 63, pp. 217-244, Aug. 1930. https://doi.org/10.1080/14786443009461570

Humpston, Giles, "Cobalt: a universal barrier metal for solderable under bump metallisations," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Hundt, Michael, "Controlling tin whiskers in Pb-free assemblies," Electronic Products, vol. 49 no. 2, pp. 81-82, July 2006.

Hundt, Paul, and Gupta, Vikas, "Development Status of High Speed Ball Pull for Pb-Free BGA Characterization," 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium, San Jose, CA, Oct. 3-5, 2007, pp. 233-237.

Hung, Fei-Yi, Lin, Hung-Mao, Chen, Puo-Sheng, Lui, Truan-Sheng, and Chen, Li-Hui, "A study of the thin film on the surface of Sn-3.5Ag/Sn-3.5Ag-2.0Cu lead-free alloy," Journal of Alloys and Compounds, vol. 415 no. 1-2, pp. 85-92, May 18, 2006.

Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, and Chan, Cheng-Wei, "Deformation Fracture Characteristics of Microelectronic Sn-3.0Ag-0.5Cu-xNi Solders," Materials Transactions, vol. 48 no. 11, pp. 3014-3020, Nov. 2007.

Hung, Fei-Yi, Wang, Chih-Jung, Lui, Truan-Sheng, and Chen, Li-Hui, "Electrical Current Phase Transformation of Sn-9Zn-1Ag Alloy," Materials Transactions, vol. 46 no. 8, pp. 1820-1824, 2005.

Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, and Chen, Ping-Hui, "Influence of Ga addition on Microstructure, Tensile Properties and Surface Oxide Film Characteristics of Microelectronic Sn-9Zn-xGa Solders," Materials Transactions, vol. 49 no. 7, pp. 1496-1502, July 2008.

Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, and Lan, Kung-An, "Microstructures and Fusing Electrical Current of Microelectronic Sn-9Zn-(0.25RE) Solders," Materials Transactions, vol. 49 no. 7, pp. 1491-1495, July 2008.

Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, and Chen, Ping-Hui, "Microstructures and Mechanical Properties of Sn-9Zn-xGa Alloy," Key Engineering Materials, vol. 345-356, pp. 85-88, 2007.

Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, and He, Nien-Ting, "Resonant characteristics of the microelectronic Sn-Cu solder," Journal of Alloys and Compounds, vol. 457 no. 1-2, pp. 171-176, June 12, 2008.

Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, and You, Ji-Ge, "The Effect of Electrical Current on Tensile Properties and Vibration Characteristics of Sn-9Zn-1Cu Lead-Free Solder," Materials Transactions , vol. 47 no. 12, pp. 2935-2941, Dec. 2006.

Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, and Gu, Zhi-Feng, "The Recrystallization of Microelectronic Lead-Free Solders," Materials Transactions, vol. 49 no. 10, pp. 2298-2302, Oct. 2008.

Hung, Fei-Yi, Wang, Chih-Jung, Huang, Sung-Min, Chen, Li-Hui, and Lui, Truan-Sheng, "Thermoelectric characteristics and tensile properties of Sn-9Zn-xAg lead-free solders," Journal of Alloys and Compounds, vol. 420 no. x, pp. 193-196, 2006.

Hung, Fei-Yi, Chen, Puo-Sheng, Lui, Truan-Sheng, and Chen, Li-Hui, "Thin Film Characteristics of Sn-3.5Ag-(2.0Cu) Alloy," Materials Transactions, vol. 46 no. 12, pp. 3020-3025, 2005.

Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, and You, Ji-Ge, "Vibration fracture behavior of Sn-9Zn-xCu lead-free solders," Journal of Materials Science, vol. 42 no. 11, pp. 3865-3873, June 2007.

Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, and He, Nien-Ting, "Vibration Fracture Behavior of Sn-xCu Lead-Free Solders," Key Engineering Materials, vol. 345-356, pp. 477-480, 2007.

Hung, Kuo-Kang, and Wu, Mei-Ling, "Microstructural Analysis of Lead-free Solder Joint under Thermo-mechanical Loading," 2012 14th International Conference on Electronic Materials and Packaging, Hong Kong, Dec. 13-16, 2012, pp. xx-xx.

Hung, Tuan-Yu, Huang, Chao-Jen, Lee, Chang-Chun, Wang, Chin-Chun, Lu, Keng-Cheng, and Chiang, Kuo-Ning, "Investigation of solder crack behavior and fatigue life of the power module on different thermal cycling period," Microelectronic Engineering , vol. 107, pp. 125-129, July 2013.

Hung, Yu-Min, and Chen, Chih-Ming, "Electromigration of Sn-9wt.%Zn Solder," Journal of Electronic Materials , vol. 37 no. 6, pp. 887-893, June 2008.

Hunger, Thomas, and Bayerer, Reinhold, "Extended Reliability of Substrate Solder Joints in Power Modules," 13th European Conference on Power Electronics and Applications, Barcelona, Spain, Sept. 8-10, 2009, pp. xx-xx.

Hunsicker, H. Y., and Kempf, L. W., "Aluminum Alloys for Bearings," SAE Quarterly Transactions, vol. 1 no. 1, pp. 6-26, Jan. 1947. *** earliest paper on tin whiskers ***

Hunt, C. P., Thomas, O., Di Maio, D., Kamara, E., and Lu, H., "Low Cycle Fatigue Behaviour of Multi-joint Sample in Mechanical Testing," IPC APEX Expo 2012, San Diego, CA, Feb. 28-Mar. 1, 2012, pp. xx-xx.

Hunt, Chris, Wickham, Martin, Zou, Ling, Thomas, Owen, and Zhang, Bufa, "Assessment of Reterminated RoHS Components for SnPb Applications," IPC APEX Expo 2013, San Diego, CA, Feb. 17-21, 2013, pp. xx-xx.

Hunt, Chris, "Dross or Oxide Short Defects," Printed Circuit Design and Fab/ Circuits Assembly, vol. 30 no. 12, pp. 36, Dec. 2013.

Hunt, Chris, "Editorial - Transitioning to RoHS compliance," Global SMT & Packaging, vol. 5 no. 7, pp. 2, Aug. 2005.

Hunt, Chris, "Focuses on Lead-free Soldering Technology," Microelectronics News , no. 21, pp. 2, Spring 2005.

Hunt, Chris, "FREQUENT failures as the filaments form!," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, June 2004.

Hunt, Chris, Wickham, Martin, Pittson, Robin, and Lewison, John, "Improving Electronics Sustainability With a Novel Reusable, Unzippable, Sustainable Electronics (ReUSE) Interconnect System," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 237-244.

Hunt, Chris, "Lead-free Component Stability," Microelectronics News, no. 17, pp. 3, June 2003.

Hunt, Chris, "Lead-free soldering again the focus of SSTC meeting," Microelectronics News, no. 23, pp. 3, Winter 2006.

Hunt, Chris, "Lead-free Systems & Electrochemical Migration," Microelectronics News, no. 24, pp. 1, Winter 2007.

Hunt, Chris, "Lead-Free Technologies: Where are the Reliability Issues," SMART Group "All You Ever Wanted to Know About Lead-Free" Seminar, High Wycombe, United Kingdom, Nov. 1, 2005.

Hunt, Chris, "LF Reliability," Lead-Free Soldering Seminar 2001, High Wycombe, United Kingdom, Feb. 15, 2001.

Hunt, Chris, "New Legislation Looms," Microelectronics News, no. 18, pp. 3, Dec. 2003.

Hunt, Chris, "Predicting Tin Whisker Growth," Microelectronics News, no. 21, pp. 3, Spring 2005.

Hunt, Chris, "Solder Fillet Lifting or Pad Lift," Printed Circuit Design and Fab/ Circuits Assembly, vol. 33 no. 8, pp. 42, Aug. 2016.

Hunt, Chris, "Solder Tip Damage," Printed Circuit Design and Fab/ Circuits Assembly , vol. 29 no. 4, pp. 55, Apr. 2012.

Hunt, Chris, "Susceptibility of Glass-Reinforced Epoxy Laminates to Conductive Anodic Filamentation," CircuiTree, vol. 20 no. 3, pp. xx-xx, Mar. 2007.

Hunt, Chris, "Transitioning to RoHS compliance," Global SMT and Packaging, vol. 5 no. 7, pp. 2, Aug. 2005.

Hunt, Chris, and Brewin, Alan, "WEEE/ROHS Legislation Update," Microelectronics News, no. 19, pp. 4, July 2004.

Hunt, Chris, "XRF tools help ROHS compliance," Microelectronics News, no. 23, pp. 1, Winter 2006.

Hunt, Christopher, "A Model for Solderability Degradation," Surface Mount International Proceedings of the Technical Program, Volume II, San Jose, CA, Sept. 10-12, 1996, pp. 650-655.

Hunt, Christopher, and Di Maio, Davide, "A Test Methodology for Copper Dissolution in Lead-Free Alloys," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings , Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Hunt, Christopher, "An Assessment of Lead-Free Palladium-Finished Components: The Impact on Assembly Yields with Conventional Tin/Lead Solder," IPC Works '99 , Minneapolis, MN, Oct. 23-28, 1999, pp. xx-xx.

Hunt, Christopher, "An Overview of NPL studies related to Spacecraft electronics'," 3rd Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Genova, Italy, Mar. 21, 2012.

Hunt, Christopher, Di Maio, Davide, Murdock, Charles, and Thomas, Owen, "Combinatorial Effects of Electromigration and Low Cycle Fatigue," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 565-569.

Hunt, Christopher, Lea, Deborah, and Adams, Sean, "Evaluation of the Comparative Solderability of Lead-Free Solders in Nitrogen - Part II," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Hunt, Christopher, and Wickham, Martin, "Impact of Lead Contamination on Reliability of Lead Free Alloys," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S39-01-1-S39-01-11.

Hunt, Christopher, and Wickham, Martin, "Impact of Lead Contamination on Reliability of Lead Free Alloys," Route, May 2006.

Hunt, Christopher, and Wickham, Martin, "Impact of Lead Contamination on Reliability of Lead Free Alloys," IPC Review, pp. 7, Apr. 2006.

Hunt, Christopher, "Implementation and Reliability Issues with Lead-Free Solders," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 295-307.

Hunt, Christopher, "Implications of Soldering Lead-Free in Nitrogen," SMART Group Lead-Free Seminar 2000, High Wycombe, UK, Feb. 10, 2000.

Hunt, Christopher, Lea, Deborah, Adams, Sean M., and Stratton, Paul F., "INERT research for lead-free soldering," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, Aug. 2002.

Hunt, Christopher, and Wickham, Martin, "Lead Contamination Effects on Reliability of Lead Free Alloys," IPC Review, vol. 47 no. 6, pp. 8, July 2006.

Hunt, Christopher, and Wickham, Martin, "Lead Contamination Effects on Reliability of Lead Free Alloys," Route, July 2006.

Hunt, Christopher, Dusek, Milos, and Brewin, Alan, "Lead-free Component Issues," SMART Group/NPL Lead Free Seminar 2003 , Feb. 23, 2003.

Hunt, Christopher, and Dusek, Milos, "Lead-free Solders and PCB Finish Effects on Solder Joint Reliability," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 169-179.

Hunt, Christopher, "Measuring Tin Whisker Propensity."

Hunt, Christopher, and Wickham, Martin, "Mitigation of Tin Whiskers With Polymer Coatings," International Symposium on Advanced Packaging Materials, Cambridge, England, Feb. 28-Mar. 2, 2010, pp. 78-87.

Hunt, Christopher, "Pitfalls on the Path to Lead-Free," SMART Group 6th Annual Lead-Free Seminar and Table-top Exhibition, High Wycombe, United Kingdom, Feb. 3, 2004.

Hunt, Christopher, Nottay, Jaspal, Brewin, Alan, and Dinsdale, Alan, "Predicting Microstructure of Mixed Solder Alloy Systems," NPL Report MATC(A)83, Apr. 2002.

Hunt, Christopher, and Wickham, Martin, "Reliability Issues with Lead-Free," Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Portsmouth, England, Feb. 17, 2010.

Hunt, Christopher, "Reliability issues with lead-free," 2nd Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Paris, France, May 4, 2011.

Hunt, Christopher, and Lea, Deborah, "Solderability of Lead-Free Alloys," IPC SMEMA Council APEX 2000 , Long Beach, CA, Mar. 12-16, 2000, pp. 3-1 to 3-4.

Hunt, Christopher, "Soldering Issues with Palladium-Finished Components," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, Feb. 2000.

Hunt, Christopher, "Technology Mission to Assess the Status of Lead-free Soldering in Japan," NPL Report MATC(A)12, Mar. 2001.

Hunt, Christopher, Wickham, Martin, Birch, Bill, and Furlong, Jason, "The effect of Functional Pads and Pitch on Via Reliability using Thermal Cycling and Interconnect Stress Testing," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Hunt, Christopher, and Dusek, Milos, "Thermal cycling for Lead-free Solder," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Hunt, Christopher, Wickham, Martin, and Zou, Ling, "Thermoplastic Substrates: Performance of Materials to Meet WEEE," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S34:02.

Hunt, Christopher, Wickham, Martin, and Zou, Ling, "Thermoplastic Substrates: Performance of Materials to Meet WEEE," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. xx-xx.

Hunt, Christopher, and Di Maio, Davide, "Tin Allotropic Transformation - Tin Pest," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S13:02.

Hunt, Christopher, Wickham, Martin, and Dusek, Milos, "Transitioning to Lead-free: the Effect on Low Cycle Fatigue of Contaminating Solder Alloys," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 448-456.

Hunter, Craig, and Reynolds, Chris, "Avoiding tin whiskers in Sn-Cu-plated connectors," Connector Specifier, vol. 22 no. 5, pp. 30, June/July 2006.

Hunter, Craig, "Green Giant - Green China," SMT Web Exclusive Article.

Hunter, Craig, "Lead-free Component Soldering," Surface Mount Technology (SMT) , vol. 16 no. 6, pp. xx-xx, June 2002.

Hunter, Craig, "RoHS: A Weapon of Mass Disruption," Surface Mount Technology (SMT) , vol. 19 no. 3, pp. 18, Mar. 2005.

Hunter, Craig, "Selling to Military Markets After RoHS," Surface Mount Technology (SMT), vol. 19 no. 11, pp. 12, Nov. 2005.

Hunter, Craig, "The Impact of RoHS on Military and Aerospace Applications," Surface Mount Technology (SMT), vol. 20 no. 3, pp. xx-xx, Mar. 2006.

Hunter, Craig, "Three Issues in the Miniature Capacitor Market," Surface Mount Technology (SMT), vol. 20 no. 9, pp. 12, Sept. 2006.

Hunter, Craig, "Two challenges facing passives manufacturers," Electronics Weekly , Dec. 14, 2005.

Huo, Fupeng, Zhang, Keke, Zhang, Meng, and Wang, Huigai, "The Interfacial Intermetallic and Shear Strength of Ni Nanoparticle-Decorated Reduced Graphene Oxide Reinforced Sn2.5Ag0.5Cu Lead-Free Composite Soldering Joints," Advanced Engineering Materials, vol. 20 no. 10, pp. 1800147-1-1800147-8, Oct. 2018.

Hurkmans, T., Kubinski, J., Trinh, T., Fleischer, W., and van der Kolk, G. J., "Perspective for Replacement of Hard Chrome by PVD," 1999 Aerospace/Airline Plating & Metal Finishing Forum, Jacksonville, FL, Apr. 20-22, 1999, pp. xx-xx.

Hurley, Michael, Lovie, John, and Miscioscio, Kathleen, "Process Control in Tin and Tin-Lead Plating of Contacts," Electronic Manufacturing, vol. 36 no. 1, pp. 12-15, Jan. 1990.

Hurrell, Jeff, and Helwig, Chris, "Brush Plating and Environmental Concerns," SUR/FIN '94 Technical Conference Proceedings, Indianapolis, IN, June 20-23, 1994, pp. 851-855.

Hurtony, Tamas, Sinkovics, Balint, and Gordon, Peter, "Characterization of microstructure of lead free solder by different image processing algorithms," 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging, Timisoara, Romania, Oct. 20-23, 2011, pp. 327-331.

Hurtony, Tamas, Szakal, Alex, Almasy, Laszlo, Len, Adel, Kugler, Sandor, Bonyar, Attila, and Gordon, Peter, "Characterization of the microstructure of tin-silver lead free solder," Journal of Alloys and Compounds, vol. 672, pp. 13-19, July 5, 2016.

Hurtony, Tamas, Bonyar, Attila, Luniak, Marco, and Muller, Maik, "Determination of the Sn/IMC ratio in solder joints combining electrochemistry and confocal microscopy," 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging, Alba Iulia, Romania, Oct. 25-28, 2012, pp. 81-84.

Hurtony, Tamas, Bonyar, Attila, and Gordon, Peter, "Electrochemical impedance spectroscopy as a prospective tool for the characterization of the intermetallic microstructure of lead free solder," Materials Science Forum, vol. 812, pp. 333-338, Feb. 2015.

Hurtony, Tamas, Bonyar, Attila, Gordon, Peter, and Harsanyi, Gabor, "Investigation of intermetallic compounds (IMCs) in electrochemically stripped solder joints with SEM," Microelectronics Reliability, vol. 52 no. 6, pp. 1138-1142, June 2012.

Hurtony, Tamas, Krammer, Oliver, Illes, Balazs, and Gordon, Peter, "Investigation of the Microstructure of Mn-doped Tin-Silver-Copper Solder Alloys Solidified with Different Cooling Rates," 2019 22nd European Microelectronics and Packaging Conference & Exhibition, Pisa, Italy, Sept. 16-19, 2019. pp. xx-xx.

Hurtony, Tamas, and Gordon, Peter, "The Correlation Between the Mechanical and Electrochemical Properties of Solder Joints," 2015 38th International Spring Seminar on Electronics Technology, Eger, Hungary, May 6-10, 2015, pp. 70-74.

Hussain, J. Z., Khoo, S. A., Breach, C. D., and Hawkins, A., "Effects of Tacky Flux Formulation on Solder Ball Attach to a Cu-OSP Surface Finish in Air and N2," 2012 IEEE 14th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 5-7, 2012, pp. 685-690.

Hussain, J. Z., Khoo, S. A., Bondarowicz, J., Breach, C. D., and Hawkins, A., "The Influence of Solder Paste Formulation on Control and Elimination of Defects in SMT Assembly," South East Asia Technical Training Conference on Electronics Assembly Technologies 2012 Proceedings, Penang, Malaysia, Apr. 18-20, 2012, pp. xx-xx.

Hussain, Jainullabdeen Zahir, Khoo, Soon Aik, Breach, Christopher, and Hawkins, James Adrian, "Solder Ball Attach With Water Soluble Air Reflowable Tacky Fluxes," IEEE Transactions on Components, Packaging, and Manufacturing Technology , vol. 5 no. 5, pp. 697-703, May 2015.

Hutagalung, Sabar D., Yaacob, Khatijah A., and Tan, Ruo Y., "Morphology of Silicon Nanowires Grown on Si(100) Substrate," 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems , Bangkok, Thailand, Jan. 16-19, 2007, pp. 215-218.

Hutchins, Charles L., "Myths of SMT," Surface Mount Technology (SMT), vol. 11 no. 2, pp. 18, 20, Feb. 1997.

Hutchins, Charles L., "Temperature Boundary Conditions," Surface Mount Technology (SMT) , vol. 11 no. 7, pp. 20, 22. July 1997.

Hutchinson, Beldon, "Brush Electroplating Chromium," Proceedings of The International Technical Conference of SUR/FIN, Baltimore, MD, June 26-29, 1995, pp. 121-123.

Hutchinson, Bevis, Oliver, James, Nylen, Margareta, and Hagstrom, Joacim, "Whisker Growth from Tin Coatings," Materials Science Forum, vol. 467-470, pp. 465-470, Oct. 2004.

Hutchinson, Beldon, "Brush Electroplating Trivalent Chromium," Proceedings AESF SUR/FIN '96 , Cleveland, OH, June 10-13, 1996, pp. 429-431.

Hutheesing, Nikhil, "Think Fail-Safe," Forbes, vol. 162 no. 1, pp, 164-xx, July 6, 1998.

Hutt, David A., Rhodes, Daniel G., Conway, Paul P., Mannan, Samjid H., Whalley, David C., and Holmes, Andrew S., "Investigation of a solder bumping technique for flip-chip interconnection," Soldering & Surface Mount Technology, vol. 12 no. 1, pp. 7-14, 2000.

Hutter, M., Oppermann, H., Engelmann, G., Wolf, J., Ehrmann, O., Aschenbrenner, R., and Reichl, H., "Calculation of Shape and Experimental Creation of AuSn Solder Bumps for Flip Chip Applications," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 282-288.

Hutter, M., Oppermann, H., Engelmann, G., Dietrich, L., and Reichl, H., "Precise Flip Chip Assembly Using Electroplated AuSn20 and SnAg3.5 Solder," Proceedings 56th Electronic Components & Technology Conference , San Diego, CA, May 30-June 2, 2006, pp. 1087-1094.

Hutter, Matthias, Schmidt, Ralf, Zerrer, Patrick, Rauschenbach, Steffen, Wittke, Klaus, Scheel, Wolfgang, and Reichl, Herbert, "Effects of Additional Elements (Fe, Co, Al) on SnAgCu Solder Joints," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 54-60.

Hutzler, Aaron, Tokarski, Adam, Kraft, Silke, Zischler, Sigrid, and Schletz, Andreas, "Increasing the Lifetime of Electronic Packaging by Higher Temperatures: Solders vs. Silver Sintering," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 1700-1706.

Huynh, Q. T., Liu, C. Y., Chen, Chih, and Tu, K. N., "Electromigration in eutectic SnPb solder lines," Journal of Applied Physics, vol. 89 no. 8, pp. 4332-4335, Apr. 15, 2001.

Hvims, H. L., "Solder Replacement," Soldering & Surface Mount Technology, vol. 6 no. 2, pp. 12-19, 1994.

Hvims, Henrik L., "Conductive Adhesives as a Solder Replacement for Surface Mount Technology," Surface Mount International Conference & Exposition Proceedings of the Technical Program, San Jose, CA, Aug. 28-Sept. 1, 1994, pp. 313-325.

Hvims, Henrik L., "Conductive Adhesives for SMT and Potential Applications," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B , vol. 18 no. 2, pp. 284-291, May 1995.

Hvims, Henrik L., "Solder Replacement," Fifteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium, Santa Clara, CA, Oct. 4-6, 1993, pp. 128-135.

Hwang, Byungil, Seol, Jin Gyeong, An, Chee-Hong, and Kim, Sung Hee, "Bending fatigue behavior of silver nanowire networks with different densities," Thin Solid Films, vol. 625, pp. 1-5, Mar. 1, 2017.

Hwang, Chi-Won, and Suganuma, Katsuaki, "Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni," Materials Transactions, vol. 45 no. 3, pp. 714-720, Mar. 2004.

Hwang, Chi-Won, Suganuma, Katsuaki, Kiso, Masayuki, and Hashimoto, Shigeo, "Influence of Cu Addition to Interface Microstructure betweem Sn-Ag Solder and Au/Ni-6P Plating," Journal of Electronic Materials, vol. 33 no. 10, pp. 1200-1209, Oct. 2004.

Hwang, Chi-Won, Suganuma, K., Lee, Jung-Goo, and Mori, H., "Interface microstructure between Fe-42Ni alloy and pure Sn," Journal of Materials Research, vol. 18 no. 5, pp. 1202-1210, May 2003.

Hwang, Chi-Won, Suganuma, Katsuaki, Kiso, Masayuki, and Hashimoto, Shigeo, "Interface microstructures between Ni-P alloy plating and Sn-Ag-(Cu) lead-free solders," Journal of Materials Research, vol. 18 no. 11, pp. 2540-2543, Nov. 2003.

Hwang, Chi-Won, Kim, Keun-Soo, and Suganuma, Katsuaki, "Interfaces in Lead-Free Soldering," Journal of Electronic Materials , vol. 32 no. 11, pp. 1249-1256, Nov. 2003.

Hwang, Chi-Won, Lee, Jung-Goo, Suganuma, Katsuaki, and Mori, Hirotaro, "Interfacial Microstructure between Sn-3Ag-xBi Alloy and Cu Substrate with or without Electrolytic Ni Plating," Journal of Electronic Materials , vol. 32 no. 2, pp. 52-62, Feb. 2003.

Hwang, Chi-Won, and Suganuma, Katsuaki, "Joint reliability and high temperature stability of Sn-Ag-Bi lead-free solder with Cu and Sn-Pb/Ni/Cu substrates," Materials Science and Engineering A, vol. 373 no. 1-2, pp. 187-194, May 25, 2004.

Hwang, Hyeon, Hong, Soon-Min, Jung, Jae-Pil, and Kang, Choon-Sik, "Pb-free solder bumping for flip chip package by electroplating," Soldering & Surface Mount Technology, vol. 15 no. 2, pp. 10-16, 2003.

Hwang, J. S., Yim, M. J., and Paik, K. W., "Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application," Microelectronics Reliability, vol. 48 no. 2, pp. 293-299, Feb. 2008.

Hwang, J. S., Yim, M. J., and Paik K. W., "Effects of Epoxy Functionality on the Properties and Reliabilities of the Anisotropic Conductive Films for Flip Chip on Organic Substrate Application," Journal of Electronic Materials, vol. 35 no. 9, pp. 1722-1727, Sept. 2006.

Hwang, J. S., "Filler size and content effects on the composite properties of anisotropic conductive films (ACFs) and reliability of flip chip assembly using ACFs," Microelectronics Reliability, vol. 48 no. 4, pp. 645-651, Apr. 2008.

Hwang, J. S., and Guo, Z., "Lead-free Solders for Electronic Packaging and Assembly," Circuit World , vol. 19-25, 1994.

Hwang, J. S., and Vargas, R. M., "Solder Joint Reliability - Can Solder Creep?," Soldering & Surface Mount Technology, vol. 2 no. 2, pp. 38-45, 1990.

Hwang, J. W., Yim, M. J., and Paik, K. W., "Effects of Thermoplastic Resin Content of Anisotropic Conductive Films on the Pressure Cooker Test Reliability of Anisotropic Conductive Film Flip-Chip Assembly," Journal of Electronic Materials, vol. 34 no. 11, pp. 1455-1462, Nov. 2005.

Hwang, Jennie S., "100 Points on Lead-Free Performance and Reliability, Part 1," Surface Mount Technology (SMT), vol. 27 no. 6, pp. 14,16-17, June 2012.

Hwang, Jennie S., "100 Points on Lead-Free Performance and Reliability, Part 2," Surface Mount Technology (SMT), vol. 27 no. 7, pp. 12,14-15, July 2012.

Hwang, Jennie S., "2005: A Lead-free Banner Year," Surface Mount Technology (SMT) , vol. 19 no. 1, pp. 14, Jan. 2005.

Hwang, Jennie S., "A Fatigue-resistant Lead-free Candidate: the Sn/Ag/Cu/In System," Surface Mount Technology (SMT), vol. 14 no. 10, pp. 18, Oct. 2000.

Hwang, Jennie S., Guo, Zhenfeng, and Koenigsmann, Holger, "A high-performance lead-free solder - the effects of In on 99.3Sn/0.7Cu," Soldering & Surface Mount Technology, vol. 13 no. 2, pp. 7-13, 2001.

Hwang, Jennie S., "A Look at the Theory behind Tin Whisker Phenomena, Part 3," Surface Mount Technology (SMT), vol. 30 no. 11, pp. 12,14-15, Nov. 2015.

Hwang, Jennie S., "A Strong Lead-free Candidate: the Sn/Ag/Cu/Bi System," Surface Mount Technology (SMT), vol. 14 no. 8, pp. 20-21, Aug. 2000.

Hwang, Jennie S., "Anatomy of Sn/Ag/Cu in SMT Applications," Surface Mount Technology (SMT), vol. 16 no. 8, pp. 14, Aug. 2002.

Hwang, Jennie S., "Another Strong Lead-free Candidate: the Sn/Ag/Bi/In System," Surface Mount Technology (SMT), vol. 14 no. 9, pp. 20, Sept. 2000.

Hwang, Jennie S., "Bismuth in Lead-free Systems - Not to Fear," Surface Mount Technology (SMT), vol. 19 no. 6, pp. 14, June 2005.

Hwang, Jennie S., "Can Microstructure Indicate a Good Solder Joint? Part I," Surface Mount Technology (SMT), vol. 27 no. 8, pp. 14,16, Aug. 2012.

Hwang, Jennie S., "Can Microstructure Indicate a Good Solder Joint? Part II," Surface Mount Technology (SMT), vol. 27 no. 9, pp. 14,16-17, Sept. 2012.

Hwang, Jennie S., "Can Microstructure Indicate a Good Solder Joint? Part III," Surface Mount Technology (SMT), vol. 27 no. 10, pp. 12,14, Oct. 2012.

Hwang, Jennie S., "Can Microstructure Indicate a Good Solder Joint? Part IV," Surface Mount Technology (SMT), vol. 27 no. 11, pp. 14,16-17, Nov. 2012.

Hwang, Jennie S., "Can We Have Lead-Free Solders? Part I," Circuits Assembly, vol. 4 no. 10, pp. 32-35,37,39, Oct. 1993.

Hwang, Jennie S., "Can We Have Lead-Free Solders? Part II," Circuits Assembly, vol. 4 no. 11, pp. 30-31, Nov. 1993.

Hwang, Jennie S., "Can We Have Lead-Free Solders? Part III," Circuits Assembly, vol. 4 no. 12, pp. 30-32, Dec. 1993.

Hwang, Jennie S., "Changing the Factory to Lead-free," Surface Mount Technology (SMT) , vol. 18 no. 6, pp. 56, June 2004.

Hwang, Jennie S., "Cost Considerations for Lead-free," Surface Mount Technology (SMT) , vol. 19 no. 3, pp. 14, Mar. 2005.

Hwang, Jennie S., "Defects and Failure Phenomena of Solder Joints," Proceedings of the 1988 International Symposium on Microelectronics, Seattle, WA, Oct. 17-19, 1988, pp. 54-67.

Hwang, Jennie S., "Dispel the Notions About Lead-free," Surface Mount Technology (SMT), vol. 18 no. 9, pp. 14, Sept. 2004.

Hwang, Jennie S., "Dr. Jennie Hwang on Solder," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Sept. 1998.

Hwang, Jennie S., "Effects of a Reflow Temperature Profile," Surface Mount Technology (SMT), vol. 10 no. 6, pp. 20, 89, June 1996.

Hwang, Jennie S., "Effects of Bi Contamination on Sn/Pb Eutectic Solder," Surface Mount Technology (SMT), vol. 14 no. 9, pp. 91-92, 94, Sept. 2000.

Hwang, Jennie S., and Guo, Zhenfeng, "Effects of Pb Contamination on the Material Properties of Lead-free Sn/Ag/Cu/Sb Solder," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Apr. 2001.

Hwang, Jennie S., and Guo, Zhenfeng, "Effects of Pb Contamination on the Material Properties of Sn/Ag/Cu Solder," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Jan.-Feb. 2001.

Hwang, Jennie S., "Environmentally Sound Manufacturing," Surface Mount Technology (SMT), vol. 10 no. 4, pp. 20, 22, Apr. 1996.

Hwang, Jennie S., "Evolution of Lead-free Electronics in the International Landscape," Surface Mount Technology (SMT), vol. 17 no. 6, pp. 14, June 2003.

Hwang, Jennie S., "Futuristic Solders: Utopia or Ultimate Performance?," Surface Mount Technology (SMT), vol. 5 no. 9, pp. 40, 42-43, Sept. 1991.

Hwang, Jennie S., "Grid Array Solder Joint Reliability, Part III," Surface Mount Technology (SMT), vol. 27 no. 2, pp. 14,16, Feb. 2012.

Hwang, Jennie S., "Grid Array Solder Joint Reliability, Part IV," Surface Mount Technology (SMT), vol. 27 no. 3, pp. 12,14-15, Mar. 2012.

Hwang, Jennie S., "Grid Array Solder Joint Reliability, Part V," Surface Mount Technology (SMT), vol. 27 no. 4, pp. 12,14-15, Apr. 2012.

Hwang, Jennie S., "Grid Array Solder Joint Reliability, Part VI," Surface Mount Technology (SMT), vol. 27 no. 5, pp. 12,14, May 2012.

Hwang, Jennie S., Guo, Zhenfeng, and Koenigsmann, Holger, "High-strength and High-fatigue-resistant Lead-free Solder," Surface Mount Technology (SMT), vol. 14 no. 3, pp. 55-60, Mar. 2000.

Hwang, Jennie S., Guo, Zhenfeng, and Koenigsmann, Holger, "High-strength and High-fatigue-resistant Lead-free Solder," Surface Mount Technology (Special Supplement, SMT), vol. 14 no. 6, pp. 13-16, June 2000.

Hwang, Jennie S., and Guo, Zhenfeng, "How Trace Amounts of Lead May Impact a Lead-Free Composition of Sn/Ag/Bi/In Solder," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Aug.- Sep. 2001.

Hwang, Jennie S., "Lead-free Assembly Cost of Ownership," Surface Mount Technology (SMT), vol. 19 no. 11, pp. 8, Nov. 2005.

Hwang, Jennie S., "Lead-Free Facts and Myths," FlipChips.com

Hwang, Jennie S., Chew, Kaihwa, and Kho, Vincent, "Lead-free Implementation: Drop-In Manufacturing," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S40-2-1-S40-2-13.

Hwang, Jennie, "Lead Free Interconnection - Technology, Selection and Applications," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 23-24, 2003, W-01.

Hwang, Jennie, "Lead Free PCB Surface Finish & Component Coating," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies , San Jose, CA, Apr. 23-24, 2003, W-02.

Hwang, Jennie S., "Lead-free production success requires an open mind," emsnow, Dec. 30, 2004.

Hwang, Jennie, "Lead-free Reliability," Surface Mount Technology (SMT), vol. 18 no. 12, pp. 14, Dec. 2004.

Hwang, Jennie S., "Lead-free Reliability for Harsh-environment Electronics," Surface Mount Technology (SMT), vol. 21 no. 3, pp. 9, Mar. 2007.

Hwang, Jennie S., "Lead Free Reliability - More or Less than SnPb?," IPC Review, vol. 48 no. 1, pp. 16-17, Jan. 2007.

Hwang, Jennie S., "Lead-Free Solder Interconnections for SMT Manufacturing," 2002 NEPCON West - Fiberoptic Expo Conference Proceedings, 2002, pp. 270-276.

Hwang, Jennie S., "Lead-free Solder: Sb Effect on Sn/Ag," Surface Mount Technology (SMT), vol. 14 no. 11, pp. 20, Nov. 2000.

Hwang, Jennie S., "Lead-free Solder: the Sn/Ag/Bi System," Surface Mount Technology (SMT), vol. 14 no. 6, pp. 20-22, June 2000.

Hwang, Jennie S., "Lead-free Solder: the Sn/Ag/Cu System," Surface Mount Technology (SMT), vol. 14 no. 7, pp. 18-21, July 2000.

Hwang, Jennie S., and Guo, Zhenfeng, "Lead-free Solders for Electronic Packaging and Assembly," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume II, San Jose, CA, Aug. 31-Sept. 2, 1993, pp. 732-747.

Hwang, Jennie S., "Lead-free Solders: Technology," Surface Mount Technology (SMT) , vol. 13 no. 8, pp. 16-17, Aug. 1999.

Hwang, Jennie S., "Lead-free Solders: Year 2000 & Beyond," Surface Mount Technology (SMT), vol. 13 no. 7, pp. xx-xx, July 1999.

Hwang, Jennie S., "Lead-free Symposium at APEX," Surface Mount Technology (SMT) , vol. 16 no. 4, pp. 14, Apr. 2002.

Hwang, Jennie, "Lead-Free System Performance & Reliability - Present & Future (Tutorial 13)," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009.

Hwang, Jennie S., "Lead-Free Technology and Applications," The International Journal of Microcircuits and Electronic Packaging, vol. 24 no. 4, pp. ii-v, Fourth Quarter 2001.

Hwang, Jennie S., "New Lead-Free Solders for Electronics Packaging and Assembly," 1997 Surface Mount International Conference Proceedings, San Jose, CA, Sept. 7-11, 1997, pp. 485-496.

Hwang, Jennie S., "Part 1: Lead-free Implementation - Two Approaches," Surface Mount Technology (SMT), vol. 17 no. 11, pp. 14, Nov. 2003.

Hwang, Jennie S., "Part 10: Lead-free System Reliability - Power of Metallurgy," SMT Web Exclusive Article.

Hwang, Jennie S., "Part 11: Lead-free System Reliability - Power of Metallurgy Continued," Surface Mount Technology (SMT), vol. 24 no. 1, pp. 19, Jan./Feb. 2010.

Hwang, Jennie S., "Part 12: Lead-free Reliability -- Enticing and Intriguing Status," Surface Mount Technology (SMT), vol. 24 no. 2, pp. 26, Mar./Apr. 2010.

Hwang, Jennie S., "Part 2: Bismuth in Lead-free Systems Nothing to Fear," Surface Mount Technology (SMT), vol. 19 no. 9, pp. 8, Sept. 2005.

Hwang, Jennie S., "Part 2: Lead-free Implementation Alloys for Two Approaches," Surface Mount Technology (SMT), vol. 17 no. 12, pp. 14, Dec. 2003.

Hwang, Jennie, "Part 2: Testing and Assessing Lead-free Reliability," Surface Mount Technology (SMT), vol. 20 no. 7, pp. 8, July 2006.

Hwang, Jennie S., "Part 3: Lead-free Implementation: No Need for Higher Temperature," Surface Mount Technology (SMT), vol. 18 no. 1, pp. 14, Jan. 2004.

Hwang, Jennie, "Part 3: Testing and Assessing Lead-free Reliability," Surface Mount Technology (SMT), vol. 20 no. 8, pp. 8, Aug. 2006.

Hwang, Jennie S., "Part 4: How to Test and Assess Lead-free Reliability," Surface Mount Technology (SMT), vol. 20 no. 12, pp. 8, Dec. 2006.

Hwang, Jennie S., "Part 4: Lead-free Implementation - Critical Production Considerations," Surface Mount Technology (SMT), vol. 18 no. 3, pp. 14, Mar. 2004.

Hwang, Jennie S., "Part 6: Lead-free Reliability for Harsh-environment Electronics," Surface Mount Technology (SMT), vol. 21 no. 5, pp. 8, May 2007.

Hwang, Jennie S., "Part 7: Lead-free Reliability for Harsh-environment Electronics," Surface Mount Technology (SMT), vol. 21 no. 9, pp. 8, Sept. 2007.

Hwang, Jennie S., "Part 8: Lead-free Reliability for Harsh Environment Electronics," SMT Web Exclusive Article.

Hwang, Jennie S., "Part 9: Lead-free System Reliability - Avoid Likely Failures," Surface Mount Technology (SMT), vol. 23 no. 1, pp. 23, Jan.-Feb. 2009.

Hwang, Jennie S., "Pb, Ag, Bi and Sb-free Solder System," Surface Mount Technology (SMT), vol. 14 no. 4, pp. 18-21, Apr. 2000.

Hwang, Jennie S., "PCB Surface Finish," Surface Mount Technology (SMT), vol. 9 no. 10, pp. 20, 22, Oct. 1995.

Hwang, Jennie S., "Practical Considerations to Minimize PBGA Cracks," Surface Mount Technology (SMT), vol. 10 no. 8, pp. 22, 24, Aug. 1996.

Hwang, Jennie S., "Promising Lead-free Solder Alloys," Surface Mount Technology (SMT), vol. 13 no. 10, pp. 18-20, Oct. 1999.

Hwang, Jennie S., "Reliability of a Lead-Free System: Grid Array Solder Joint Reliability, Part III," Surface Mount Technology (SMT), vol. 27 no. 2, pp. 14-16, Feb. 2012.

Hwang, Jennie S., "Reliability of the Lead-Free System: A Prelude," Surface Mount Technology (SMT), vol. 26 no. 7, pp. 12-14, July 2011.

Hwang, Jennie S., "Reliability of the Lead-Free System Part 2: The Role of Creep," Surface Mount Technology (SMT), vol. 26 no. 9, pp. 12,14, Sept. 2011.

Hwang, Jennie S., "Reliability of the Lead-Free System Part 3: Grid Array Solder Joint Reliability," Surface Mount Technology (SMT), vol. 26 no. 10, pp. 12,14, Oct. 2011.

Hwang, Jennie S., "Reliability of the Lead-Free System Part 3: Grid Array Solder Joint Reliability, Part II," Surface Mount Technology (SMT), vol. 26 no. 11, pp. 12-16, Nov. 2011.

Hwang, Jennie S., "Revisiting Solder Paste," Surface Mount Technology (SMT), vol. 17 no. 8, pp. 14, Aug. 2003.

Hwang, Jennie S., "SAC System: A Revisit," Surface Mount Technology (SMT), vol. 28 no. 2, pp. 12,14-15, Feb. 2013.

Hwang, Jennie S., "Selection Criteria for Lead-free Compositions," Surface Mount Technology (SMT), vol. 15 no. 7, pp. 18, 20, July 2001.

Hwang, Jennie S., "Solder Joint Reliability in Electronics - The Role of Fatigue - Part 2," Global SMT and Packaging, vol. 20 no. 7, pp. 8-10, July 2020.

Hwang, Jennie S., "Solder Materials," Surface Mount Technology (SMT), vol. 9 no. 3, pp. 66, 68-69, Mar. 1995.

Hwang, Jennie S., "Solder Materials," Surface Mount Technology (SMT), vol. 13 no. 3, pp. 68, 70-71, Mar. 1999.

Hwang, Jennie S., "Solder Materials," Surface Mount Technology (SMT), vol. 14 no. 3, pp. xx-xx, Mar. 2000.

Hwang, Jennie S., "Solder Materials," SMT Supplement, vol. 15 no. 7, pp. 11-17, July 2001.

Hwang, Jennie S., "Solder Materials: Important Physical Properties," Surface Mount Technology (SMT), vol. 8 no. 2, pp. 18, 20, Feb. 1994.

Hwang, Jennie S., "STEP 3: Holistic Lead-free Reliability," Surface Mount Technology (SMT), vol. 22 no. 3, pp. 20,22,24,26,28,30,33-34, Mar. 2008.

Hwang, Jennie S., "Step 3 - Solder Materials," Surface Mount Technology (SMT), vol. 15 no. 3, pp. xx-xx, Mar. 2001.

Hwang, Jennie S., "Step 3: Solder Materials," SMT Supplement, vol. 16 no. 7, pp. 10, 12-14, 16, July 2002.

Hwang, Jennie S., "Step 3: Solder Materials," Surface Mount Technology (SMT), vol. 17 no. 3, pp. 74, 76, 78, Mar. 2003.

Hwang, Jennie S., "Step 3: Solder Materials," Surface Mount Technology (SMT), vol. 18 no. 3, pp. 52-56, Mar. 2004.

Hwang, Jennie S., "Step 3: Soldering Materials," Surface Mount Technology (SMT) , vol. 16 no. 3, pp. 56, 60, 62, 64, Mar. 2002.

Hwang, Jennie S., and Lucey, George, "Strengthened Solder Materials for Electronic Packaging," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume II, San Jose, CA, Aug. 31-Sept. 2, 1993, pp. 662-676.

Hwang, Jennie S., "Surface Mount Component Leads," Surface Mount Technology (SMT), vol. 9 no. 9, pp. 20, Sept. 1995.

Hwang, Jennie S., and Guo, Zhenfeng, "Tech Forum: Effects of Pb Contamination on Lead-Free Sn/Ag/Cu/Bi/In and Sn/Cu/In/Ga Systems," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Oct. 2001.

Hwang, Jennie S., and Guo, Zhenfeng, "Technical Forum: Effects of Pb Contamination on Lead-Free Sn/Ag/Bi Solder," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Mar. 2001.

Hwang, Jennie, "Testing and Assessing Lead-free Reliability: Part 1," Surface Mount Technology (SMT), vol. 20 no. 4, pp. 8, Apr. 2006.

Hwang, Jennie S., "The Bi Myth in Solder," Surface Mount Technology (SMT), vol. 14 no. 12, pp. 20, 23, Dec. 2000.

Hwang, Jennie S., and Guo, Zhenfeng, "The Effects of Pb Contamination on Lead-Free Sn/Ag/Cu/In Solder," Chip Scale Review, vol. xx no. xx, pp. xx-xx, July 2001.

Hwang, Jennie S., and Guo, Zhenfeng, "The Effects of Pb Contamination on the Material Properties of Sn/Ag/Cu/Bi Solder," Chip Scale Review, vol. xx no. xx, pp. xx-xx, May- June 2001.

Hwang, Jennie, "The Electronics Industry Going Forward," Surface Mount Technology (SMT), vol. 20 no. 1, pp. xx-xx, Jan. 2006.

Hwang, Jennie S., "The Electronics Industry Going Forward," Surface Mount Technology (SMT), vol. 22 no. 1, pp. 24, Jan. 2008.

Hwang, Jennie S., "The Role of Bismuth (Bi) in Electronics: A Prelude," Surface Mount Technology (SMT), vol. 32 no. 8, pp. 12-15, Aug. 2017.

Hwang, Jennie S., "The Role of Bismuth (Bi) in Electronics, Part 3," Surface Mount Technology (SMT), vol. 36 no. 7, pp. 12,14-15, July 2018.

Hwang, Jennie S., "The Role of Bismuth (Bi) in Electronics, Part 4," Surface Mount Technology (SMT), vol. 33 no. 5, pp. 12,14-15, May 2018.

Hwang, Jennie S., "The Role of Bismuth (Bi) in Electronics, Part 5," Surface Mount Technology (SMT), vol. 34 no. 2, pp. 12,14-16, Feb. 2019.

Hwang, Jennie S., "The Role of Bismuth (Bi) in Electronics, Part 6," Surface Mount Technology (SMT), vol. 34 no. 5, pp. 10,12-13, May 2019.

Hwang, Jennie S., "The Role of Intermetallics in Solder Interconnections," Surface Mount Technology (SMT), vol. 8 no. 11, pp. 14, 16, Nov. 1994.

Hwang, Jennie S., Chew, Kai Hwa, and Kho, Vincent, "The Role of Wetting Ability of Lead-Free Alloys," The International Journal of Microcircuits and Electronic Packaging, vol. 24 no. 4, pp. 316-327, 4th Quarter 2001.

Hwang, Jennie, "The Theory Behind Tin Whisker Phenomena, Part 1," Surface Mount Technology (SMT), vol. 30 no. 5, pp. 8,10-11, May 2015.

Hwang, Jennie S., "The Theory Behind Tin Whisker Phenomena, Part 2," Surface Mount Technology, vol. 30 no. 7, pp. 8,10-11, July 2015.

Hwang, Jennie S., "The Theory Behind Tin Whisker Phenomena, Part 4," Surface Mount Technology (SMT), vol. 31 no. 9, pp. 12,14,16, Sept. 2016.

Hwang, Jennie S., "The Theory Behind Tin Whisker Phenomena, Part 5," Surface Mount Technology (SMT), vol. 31 no. 11, pp. 12,14, Nov. 2016.

Hwang, Jennie S., "The Top Two Parameters in Selecting a Lead-free Alloy," Surface Mount Technology (SMT), vol. 16 no. 6, pp. xx-xx, June 2002.

Hwang, Jennie S., "Tin Whiskers: Capsulization," Surface Mount Technology (SMT) , vol. 29 no. 7, pp. 16,18-22,24-26,28-29, July 2014.

Hwang, Jennie S., "Tin Whiskers: Clarity First," Surface Mount Technology (SMT), vol. 28 no. 5, pp. 12,14,16, May 2013.

Hwang, Jennie S., "Tin Whiskers: Concerns and Potential Impact," Surface Mount Technology (SMT), vol. 28 no. 11, pp. 12,14-15, Nov. 2013.

Hwang, Jennie S., "Tin Whiskers, Part 4: Causes and Contributing Factors," Surface Mount Technology (SMT), vol. 29 no. 3, pp. 12-16, Mar. 2014.

Hwang, Jennie S., "Tin Whiskers, Part 5: Impact of Testing Conditions," Surface Mount Technology (SMT), vol. 29 no. 5, pp. 12,14-15, May 2014.

Hwang, Jennie S., "Tin Whiskers, Part 6: Preventive and Mitigating Measures - Strategy and Tactics," Surface Mount Technology (SMT), vol. 29 no. 9, pp. 12,14-15, Sept. 2014.

Hwang, Jennie S., "Tin Whiskers: Phenomena and Observations," Surface Mount Technology (SMT), vol. 28 no. 9, pp. 12-13, Sept. 2013.

Hwang, Jennie S., "Viable Lead-free Compositions," Surface Mount Technology (SMT) , vol. 15 no. 6, pp. 18, 20, June 2001.

Hwang, Jennie S., "What Are Drop-in Lead-free Alloys?," Surface Mount Technology (SMT) , vol. 16 no. 9, pp. 16, Sept. 2002.

Hwang, Jennie S., "What to Expect in 2001 - Part IV ," Surface Mount Technology (SMT) , vol. 15 no. 5, pp. 18, 21, May 2001.

Hwang, Jennie S., "Why Lead-Free Solder?," Surface Mount Technology (SMT), vol. 11 no. 9, pp. 20, Sept. 1997.

Hwang, Ji Hwan, Kim, Young Min, Kim, Tae Jin, Kim, Young-Ho, and Lee, Won Jong, "Intermetallic compound formation in the interface between SAC305 solder and Cu-xZn-yNi substrates," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 426-429.

Hwang, Jihwan, Kim, Jongyeon, Kwon, Woonseong, Kang, Unbyoung, Cho, Taeje, and Kang, Sayoon, "Fine Pitch Chip Interconnection Technology for 3D Integration," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1399-1403.

Hwang, Jin-Yih, "Trivalent Chromium Electroplating For Baths Containing Hypophosphite Ions," Plating & Surface Finishing, vol. 78 no. 5, pp. 118-120, 122, 124-125, May 1991.

Hwang, Joong-Ki, Yi, Il-Cheol, Son, Il-Heon, Yoo, Jang-Yong, Kim, Byoungkoo, Zargaran, A., and Kim, Nack J., "Microstructural evolution and deformation behavior of twinning-induced plasticity (TWIP) steel during wire drawing," Materials Science and Engineering: A, vol. 644, pp. 41-52, Sept. 17, 2015.

Hwang, Joong-Ki, "The microstructure dependence of drawability in ferritic, pearlitic, and TWIP steels during wire drawing," Journal of Materials Science, vol. 54 no. 11, pp. 8743-8759, June 2019. https://doi.org/10.1007/s10853-019-03499-4

Hwang, Nong M., Cheong, Woo S., Yoon, Duk Y., and Kim, Doh-Y, "Growth of silicon nanowires by chemical vapor deposition: approach by charged cluster model," Journal of Crystal Growth, vol. 218 no. 1, pp. 33-39, 2000.

Hwang, Seong-Yong, Lee, Joo-Won, and Lee, Zin-Hyoung, "Microstructure of a Lead-Free Composite Solder Produced by an In-Situ Process," Journal of Electronic Materials, vol. 31 no. 11, pp. 1304-1308, Nov. 2002.

Hwang, Seunghyun E., Swaminathan, Madhavan, and Venkatakrishnan, Venkatesan, "Extraction of Material Properties for Low-K and Low-Loss Dielectrics Using Cavity Resonator and Efficient Finite Difference Solver up to 40GHz," Electrical Design of Advanced Packaging and Systems Symposium, Seoul, Korea, Dec. 10-12, 2008, pp. 53-56.

Hwang, Sungwoo, Baik, Chan-Wook, and Whang, Dongmok. "Synthesized Aluminum Nanowires for Future Interconnects," IEEE Nanotechnology Magazine, vol. 6 no. 3, pp. 24-26, Sept. 2012.

Hwang, Tae-Kyung, Ham, Suk-Jin, and Lee, Soon-Bok, "A Study on the Thermal Deformation of ACF Assemblies using Moire Interferometry and FEM," International Symposium on Electronic Materials and Packaging, Hong Kong, China, Nov. 30-Dec. 2, 2000, pp. 358-363.

Hwang, Tae Kyung, and Lee, Soon Bok, "Effects of Microstructure on Material Behaviors of Solder Alloys," Key Engineering Materials, vol. 297-300 part 2, pp. 825-830, Nov. 2005.

Hwang, Tae-Kyung, Lee, Soon-Bok, Nah, Jae-Woong, and Paik, Kyung-Wook, "Numerical Simulation of the Formation of Coined Solder Bump," Proceedings of the 3rd International Symposium on Electronics Materials and Packaging, Cheju, Korea, Nov. 19-22, 2001, pp. 388-392.

Hwang, Yuchul, Jeon, Hwan-Ki, Ryu, Young-Gyun, and Kang, Juseong, "Knowledge-based Reliability Qualification and an Acceleration Model for Lead-free Solder Joint," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1291-1295.

Hyland, Kim, "Development and Deployment of Lead-Free Assembly Process World-Wide," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 187-192.

Hymes. Les, "What Will Eliminating Lead from Electronics Accomplish?," Circuits Assembly, vol. 10 no. 10, pp. 58, Oct. 1999.

Hyner, Jacob, "Tin-Based, Chromium-Like Finishes," Plating and Surface Finishing, vol. 64 no. 2, pp. 32-36, Feb. 1977.

IIII

Iakovou, E., Moussiopoulos, N., Xanthopoulos, A., Achillas, Ch., Michailidis, N., Chatzipanagioti, M., Koroneos, C., Bouzakis, K.-D., and Kikis, V., "A methodological framework for end-of-life management of electronic products," Resources, Conservation, and Recycling, vol. 53 no. 6, pp. 329-339, Apr. 2009.

Ibitayo, Dimeji, Everhart, Lauren, Morgenstern, Mark, Geil, Bruce R., and Mitchell, James W., "Reliability Assessment of Lead-Free Universal Solder for Direct Bonding in Power Electronics Packaging," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1364-1368.

Ibrahiem, A. A., El-Khawas, E. H., and El-Daly, A. A., "Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn-0.5Cu solders for microelectronic applications," Journal of Materials Science: Materials in Electronics, vol. 28 no. 1, pp. 1060-1069, Jan. 2017.

Ibrahim, A., and Berndt, C. C., "Fatigue and Deformations of HVOF Sprayed WC-Co Coatings vs. Hard Chrome Plating," Proceedings of the 2003 International Thermal Spray Conference , Orlando, FL, May 5-8, 2003, pp. 377-380.

Ibrahim, A., and Berndt, C. C., "Fatigue and deformation of HVOF sprayed WC-Co coatings and hard chrome plating," Materials Science and Engineering: A, vol. 456 no. 1-2, pp. 114-119, May 15, 2007.

Ibrahim, S. K., Gawne, D. T., and Watson, A., "Corrosion and Wear Resistance of Thick Chromium Deposits from Accelerated Cr(III) Electrolytes," Transactions of the Institute of Metal Finishing , vol. 76 no. 4, pp. 156-161, July 1998.

Ice, G. E., Larson, B. C., Yang, W., Budai, J. D., Tischler, J. Z., Pang, J. W. L., Barabash, R. I., and Liu, W., "Polychromatic X-ray microdiffraction studies of mesoscale structure and dynamics," Journal of Synchrotron Radiation, vol. 12 no. 2, pp. 155-162, 2005.

Ice, G. E., Larson, B. C., Tischler, J. Z., Liu, W., and Yang, W., "X-ray microbeam measurements of subgrain stress distributions in polycrystalline materials," Materials Science and Engineering: A, Structural Materials, vol. 399 no. 1-2, pp. 43-48, 15 June 2005. https://doi.org/10.1016/j.msea.2005.02.035

Ice, Gene E., "The Future of Spatially-Resolved Polychromatic Neutron and X-Ray Microdiffraction," Metallurgical Transactions A, vol. 39 no. 13, pp. 3058-3064, Dec. 2008. https://doi.org/10.1007/s11661-008-9570-x

Ice, Gene E., and Pang, Judy W. L., "Tutorial on x-ray microLaue diffraction," Materials Characterization , vol. 60 no. 11, pp. 1191-1201, Nov. 2009.

Ichige, Yuki, Matsumoto, Tsuyoshi, Komine, Takashi, Sugita, Ryuji, Aono, Tomosuke, Murata, Masayuki, Nakamura, Daiki, and Hasegawa, Yasuhiro, "Numerical Study of Effects of Scattering Processes on Transport Properties of Bi Nanowires," Journal of Electronic Materials, vol. 40 no. 5, pp. 523-528, May 2011.

Ichikawa, Takaaki, Aoyama, Seigi, and Komori, Tsutomu, "Properties of Thin Conductor with Lead-free Solder Plating for Flexible Flat Cables," Journal of Japan Research Institute for Advanced Copper-Base Materials and Technologies, vol. 41, pp. 228-232, 2002.

Ichiki, M., Akedo, J., Mori, K., and Ishikawa, Y., "Microstructure of nickel whiskers produced by the gas deposition method," Journal of Materials Science Letters, vol. 16 no. 7, pp. 531-533, Apr. 1997.

Ichitsubo, Tetsu, Matsubara, Eiichiro, Fujiwara, Kozo, Yamaguchi, Masahiko, Irie, Hisao, Kumamoto, Seishi, and Anada, Takaaki, "Control of compound forming reaction at the interface between SnZn solder and Cu substrate," Journal of Alloys and Compounds, vol. 392 no. 1-2, pp. 200-205, Apr. 19, 2005.

Idbenali, Mohamed, and Servant, Colette, "Thermodynamic optimization of the Yb-Sn system," Journal of Thermal Analysis and Calorimetry, vol. 103 no. 1, pp. 131-135, 2011.

Iddaoudi, A., Selhaoui, N., Kardellass, S., Amar, M. Ait, Mahdouk, K., Najih, H., and Bouirden, L., "Thermodynamic optimization of the Ho-Sn system," Journal of Thermal Analysis and Calorimetry, vol. 115 no. 1, pp. 941-945, Jan. 2014.

Ide, Eiichi, Hirose, Akio, and Kobayashi, Kojiro F., "Influence of Bonding Condition on Bonding Process Using Ag Metallo-Organic Nanoparticles for High Temperature Lead-Free Packaging," Materials Transactions, vol. 47 no. 1, pp. 211-217, 2006.

Idnani, Chandru, "Impact of New Materials and Processes on Manufacturing: Green (Pb and halide free), RoHS experience," 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium, San Jose, CA, Oct. 3-5, 2007, pp. 332-334.

Ignatenko, O., van Schaik, A., and Reuter, M. A., "Recycling system flexibility: the fundamental solution to achieve high energy and material recovery quotas," Journal of Cleaner Production, vol. 16 no. 4, pp. 432-449, Mar. 2008.

Igoshev, V. I., Kleiman, J. I., Shangguan, D., Wong, S., and Michon, U., "Correction to: Fracture of Sn-3.5%Ag Solder Alloy Under Creep," Journal of Electronic Materials, vol. 47 no. 11, pp. 6944, Nov. 2018.

Igoshev, V. I., and Kleiman, J. I., "Creep Phenomena in Lead-Free Solders," Journal of Electronic Materials , vol. 29 no. 2, pp. 244-250, Feb. 2000.

Igoshev, V. I., Kleiman, J. I., Shangguan, D., Wong, S., and Michon, U., "Fracture in Sn-3.5%Ag Solder Alloy Under Creep," Journal of Electronic Materials, vol. 29 no. 12, pp. 1356-1361, Dec. 2000.

Igoshev, V., and Christian, Bev, "Lead and Brittle Fracture of Solder Joints," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Igoshev, V., Haiser, E., Ryzynski, A., and Howell, B., "Microstructure Changes in a SAC305 Type of Solder Alloy," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Igoshev, V. I, Kleiman, J. I., Shangguan, D., Lock, C., Wong, S., and Wiseman, M., "Microstructural Changes in Sn-3.5Ag Solder Alloy during Creep," Journal of Electronic Materials, vol. 27 no. 12, pp. 1367-1371, Dec. 1998.

Igoshev, Vladimir, "Case Histories in Failure Analysis of Electronics Assemblies," International Conference on Soldering & Reliability 2011 Proceedings , Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

Ihm, J., and Cohen, Marvin L., "Equilibrium properties and the phase transition of grey and white tin," Physical Review B, vol. 23 no. 4, pp. 1576-1579, Feb. 15, 1981.

Ihn, Soo-Ghang, Song, Jong-In, Kim, Young-Hun, Lee, Jeong Yong, and Ahn, Il-Ho, "Growth of GaAs Nanowires on Si Substrates Using a Molecular Beam Epitaxy," IEEE Transactions on Nanotechnology, vol. 6 no. 3, pp. 384-389, May 2007.

Iida, Shinya, and Sugita, Yoshimitsu, "GaAs-Whisker Crystals Containing Germanium Core," Applied Physics Letters, vol. 8 no. 4, pp. 77-78, Feb. 15, 1966.

Iji, M., Serizawa, S., and Kiuchi, Y., "New Environmentally Conscious Flame-Retarding Plastics for Electronics Products," First International Symposium On Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Feb. 1-4, 1999, pp. 245-249.

Ikeda, Akihiro, Kimiya, Yashuhiro, Fukunaga, Yoshiaki, Ogi, Hiroshi, Hattori, Reiji, Kuriyaki, Hisao, Ohno, Yashuhide, and Kuroki, Yukinori, "Effects of Electroless Ni/Sn Bump Formation using Hydrogen-Plasma Reflow on the Electrical Characteristics of MOSFETs," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 926-930.

Ikeda, Hiroaki, Sekine, Shigenobu, Kimura, Ryuji, Shimokawa, Koichi, Okada, Keiji, Shindo, Hiroaki, Ooi, Tatsuya, Tamaki, Rei, and Nagata, Makoto, "Cu-Sn based joint material having IMC forming control capabilities," 2017 International Conference on Electronics Packaging, Yamagata, Japan, Apr. 19-22, 2017, pp. 171-176.

Ikeda, Kenichi, Ishihara, Hideki, Watanabe, Hirohiko, Asai, Tatsuhiko, Hokazono, Hiroaki, and Shohji, Ikuo, "New Lead Free Solder Composition and Physical Properties of Printed Wiring Board Laminate Material To Suppress Lift-Off and Improve Reliability," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S39-02-1-S39-02-9.

Ikeda, Osamu, Watanabe, Yoshio, and Itoh, Fuminari, "Corrosion Measurement of a Conductive Paste and Anisotropic Conductive Adhesive Films," 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Odaiba, Japan, Jan. 16-18, 2007, pp. 77-80.

Ikeda, Toru, Kim, Won-Keun, and Miyazaki, Noriyuki, "Evaluation of the Delamination in a Flip Chip Using Anisotropic Conductive Adhesive Films Under Moisture/Reflow Sensitivity Test," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 3, pp. 551-559, Sept. 2006.

Ikeda, Yoshinari, Iizuka, Yuji, Asai, Tatsuhiko, Goto, Tomoaki, and Takahashi, Yoshikazu, "A study on the reliability of the chip surface solder joint," Proceedings of the 20th International Symposium on Power Semiconductor Devices & IC's, orlando, FL, May 18-22, 2008, pp. 189-192.

Ikedo, A., Ishida, M., and Kawano, T., "Temperature Sensitive Microwire Arrays for Artificial Whisker Electronics," 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, Cancun, Mexico, Jan. 23-27, 2011, pp. 129-132.

Ikedo, Akihito, Ishida, Makoto, and Kawano, Takeshi, "Out-of-plane high-density piezoresistive silicon microwire/p-n diode array for force- and temperature-sensitive artificial whisker sensors," Journal of Micromechanics and Microengineering, vol. 21 no. 3, pp. 035007-1-035007-7, Mar. 2011.

Ikejiri, Keitaro, Noborisaka, Jinichiro, Hara, Shinjiroh, Motohisa, Junichi, and Fukui, Takashi, "Mechanism of catalyst-free growth of GaAs nanowires by selective area MOVPE," Journal of Crystal Growth, vol. 298, pp. 616-619, Jan. 2007.

Ikemoto, Sherman, and Bornoff, Robin, "Simulating Pb-Free Reflow," Circuits Assembly, vol. 17 no. 10, pp. 30, 32, 34, 36, 39, Oct. 2006.

Ikemura, Kazuhiro, Akada, Yuzo, Ito, Satoshi, Sano, Minoru, and Nishioka, Tsutomu, "Multi Layer Film Adhesive for IC Packaging Applications," 1995 Proceedings 45th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 1995, pp. 688-691.

Iliev, M., Sinyukov, M., and Cardona, M., "Resonant first- and second-order Raman scattering in gray tin," Physical Review B, vol. 16 no. 12, pp. 5350-5355, Dec. 15, 1977.

Illes, Balazs, Skwarek, Agata, Hurtony, Tamas, Krammer, Oliver, Harsanyi, Gabor, and Witek, Krzysztof, "Characterization of Tin Pest Phenomenon in a Low Ag Content SAC Solder Alloy," 2019 22nd European Microelectronics and Packaging Conference & Exhibition, Pisa, Italy, Sept. 16-19, 2019. pp. xx-xx.

Illes, Balazs, Krammer, Oliver, Geczy, Attila, and Garami, Tamas, "Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes," Soldering & Surface Mount Technology, vol. 28 no. 1, pp. xx-xx, 2015.

Illes, Balazs, and Horvath, Barbara, "Comparing the IMC Layer Growth in Sn-Cu, Sn-Ag-Cu and Sn-Ni-Cu Layer Systems," 2013 36th International Spring Seminar on Electronics Technology, Alba Iulia, Romania, May 8-12, 2013, pp. 103-108.

Illes, Balazs, Horvath, Barbara, Geczy, Attila, Krammer, Oliver, and Dusek, Karel, "Corrosion-induced tin whisker growth in electronic devices: a review," Soldering & Surface Mount Technology, vol. 29 no. 1, pp. 59-68, 2017.

Illes, Balazs, Hurtony, Tamas, Krammer, Oliver, Batorfi, Reka, Medgyes, Balint, and Harsanyi, Gabor, "Early Stage Whisker Development from Sn Thin Film on Cu Substrate," 2019 42nd International Spring Seminar on Electronics Technology, Wroclaw, Poland, May 15-19, 2019, pp. xx-xx.

Illes, Balazs, Hurtony, Tamas, Krammer, Oliver, Medgyes, Balint, Dusek, Karel, and Busek, David, "Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films," Materials, vol. 12 no. 21, pp. 3609-1-3609-11, Nov. 1, 2019.

Illes, Balazs, Hurtony, Tamas, and Medgyes, Balint, "Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys," Corrosion Science, vol. 99, pp. 313-319, Oct. 2015.

Illes, Balazs, Horvath, Barbara, and Harsanyi, Gabor, "Effect of strongly oxidizing environment on whisker growth form tin coating," Surface and Coatings Technology, vol. 205 no. 7, pp. 2262-2266, Dec. 25, 2010. https://doi.org/10.1016/j.surfcoat.2010.09.012

Illes, Balazs, Skwarek, Agata, Geczy, Attila, Jakab, Laszlo, Busek, David, and Dusek, Karel, "Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system," Soldering & Surface Mount Technology, vol. 30 no. 2, pp. 66-73, 2018.

Illes, Balazs, Medgyes, Balint, and Horvath, Andars, "Electrochemical Migration Behaviour of Surface Finishes after Vapour Phase Reflow Soldering," 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging, Bucharest, Romania, Oct. 23-26, 2014, pp. 253-257.

Illes, Balazs, Horvath, Barbara, and Lipak, Balazs, "Investigating Whisker Growth on Annealed and Recrystallized Tin Platings," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 141-146.

Illes, Balazs, Horvath, Barbara, Lipak, Balazs, and Geczy, Attila, "Investigating Whisker Growth on Immersion Tin Surface Finishing," 2012 35th International Spring Seminar on Electronics Technology, Bad Aussee, Austria, May 9-13, 2012, pp. 242-247.

Illes, Balazs, Krammer, Oliver, Hurtony, Tamas, Dusek, Karel, Busek, David, and Skwarek, Agata, "Kinetics of Sn whisker growth from Sn thin-films on Cu substrate," Journal of Materials Science: Materials in Electronics, vol. 31 no. 19, pp. 16314-16323, Oct. 2020. https://doi.org/10.1007/s10854-020-04180-2

Illes, Balazs, and Fehervari, Norbert, "Relation Between Tin Whiskering Ability Sn/Ag/Cu Solder Alloys and Current Load," 2015 38th International Spring Seminar on Electronics Technology , Eger, Hungary, May 6-10, 2015, pp. 173-178.

Illes, Balazs, Geczy, Attila, Krammer, Oliver, Skwarek, Agata, and Witek, Krzysztof, "Soldering problems of large size SMD PET capacitors during vapour phase soldering process," 2018 41st International Spring Seminar on Electronics Technology, Zlatibor, Serbia, May 16-20, 2018, pp. xx-xx.

Illes, Balazs, Skwarek, Agata, Ratajczak, Jacek, Dusek, Karel, and Busek, David, "The influence of the crystallographic structure of the intermetallic grains on tin whisker growth," Journal of Alloys and Compounds, vol. 785, pp. 774-780, May 15, 2019.

Illes, Balazs, and Horvath, Barbara, "Tin Whisker Growth from Low Ag Content Micro-Alloyed SAC Solders," Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, Dresden, Germany, May 7-11, 2014, pp. 152-157.

Illes, Balazs, and Horvath, Barbara, "Tin whisker growth from micro-alloyed SAC solders in corrosive climate," Journal of Alloys and Compounds, vol. 616, pp. 116-121, Dec. 15, 2014.

Illes, Balazs, Horvath, Barbara, Shinohara, Tadashi, and Harsanyi, Gabor, "Tin Whisker Growth from Sn-Cu (0.5 wt%) Surface Finishes," 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging , Timisoara, Romania, Oct. 20-23, 2011, pp. 49-54.

Illes, Balazs, Skwarek, Agata, Krammer, Oliver, Medgyes, Balint, Horvath, Barbara, and Batorfi, Reka, "Tin Whisker Growth from Tin Thin Film," 2016 39th International Spring Seminar on Electronics Technology, Pilsen, Czech Republic, May 18-22, 2016, pp. 173-178.

Illes, Balazs, Batorfi, Reka, Hurtony, Tamas, Krammer, Oliver, Harsanyi, Gabor, Pietrikova, Alena, Skwarek, Agata, and Witek, Krzysztof, "Whisker Development from SAC0307-Mn07 Solder Alloy," 2020 43rd International Spring Seminar on Electronics Technology, Liptovsky Mikulas, Slovakia, May 14-15, 2020, pp. xx-xx.

Illes, Balazs, Skwarek, Agata, Batorfi, Reka, Ratajczak, Jacek, Czerwinski, Andrzej, Krammer, Oliver, Medgyes, Balint, Horvath, Barbara, and Hurtony, Tamas, "Whisker growth from vacuum evaporated submicron Sn thin films," Surface and Coatings Technology, vol. 311, pp. 216-222, Feb. 15, 2017 https://doi.org/10.1016/j.surfcoat.2017.01.011

Illes, Balazs, and Horvath, Barbara, "Whiskering behaviour of immersion tin surface coating," Microelectronics Reliability, vol. 53 no. 5, pp. 755-760, May 2013.

Illyefalvi-Vitez, Zs., Pinkola, J., Harsanyi, G., Dominkovics, Cs., Illes, B., Tersztyanszky, L., "Present Status of Transition to Pb-free Soldering," 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, Vienna, Austria, May 19-20, 2005, pp. 88-93.

Illyefalvi-Vitez, Zsolt, Geczy, Attila, Batorfi, Reka, and Szoke, Peter, "Analysis of Vapor Phase Soldering in Comparison with Conventional Soldering Technologies," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Illyefalvi-Vitez, Zsolt, Balogh, Balint, Baranyay, Zsolt, Farmer, Graham, Harvey, Tom, Kirkpatrik, Damien, Kotora, Gyorgy, and Ruzsics, Norbert, "Laser Soldering for Lead-free Assembly," 30th International Spring Seminar on Electronics Technology, Cluj-Napoca, Romania, May 9-13, 2007, pp. 471-476.

Illyefalvi-Vitez, Zsolt, Mason, Simon, and Freitas, Marta, "LEADOUT Training Course on Pb-free Soldering," 29th International Spring Seminar on Electronics Technology, St. Marienthal, Germany, May 10-14, 2006, pp. 434-439.

Illyefalvi-Vitez, Zsolt, Balogh, Balint, Farmer, Graham, Girulska, Anna, and Kirkpatrick, Damien, "Life-time Tests of Lead-free Solder Joints on Flexible Printed Circuits," 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Odaiba, Japan, Jan. 16-18, 2007, pp. 234-239.

Illyefalvi-Vitez, Zsolt, Krammer, Oliver, and Pinkola, Janos, "Testing the Impact of Pb-free Soldering on Reliability," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 468-473.

Ilyn, M., Zhukova, V., Garcia, C., delVal, J. J., Ipatov, M., Granovsky, A., and Zhukov, A., "Kondo Effect and Magnetotransport Properties in Co-Cu Microwires," IEEE Transactions on Magnetics, vol. 48 no. 11, pp. 3532-3535, Nov. 2012.

Imai, Takeretu, Hamm, Stephan, and Rothenbacher, Klaus P., "Comparison of the Recyclability of Flame-Retarded Plastics," Environmental Science & Technology, vol. 37 no. 3, pp. 652-656, 2003.

Imenes, K., Nguyen, H.-V., Lifjeld, A., Eggen, T., Baumgartner, C.E., and Aasmundtveit, K. E., "Flex to Flex Bonding using Anisotropic Conductive Film for Imaging Systems," 2013 European Microelectronics Packaging Conference, Grenoble, France, Sept. 9-12, 2013, pp. xx-xx.

Inada, Masanori, and Kibe, Masaki, "Eutectic Alloys in the Sn-Zn-Mg-Al System with Eutectic Temperature of 454 K," Materials Transactions, vol. 45 no. 3, pp. 790-792, Mar. 2004.

Inada, Teiichi, and Wong, C. P., "Fundamental Study on Adhesive Strength of Electrical Conductive Adhesives (ECAs)," 1998 4th International Symposium on Advanced Packaging Materials, Brazelton, GA, Mar. 15-18, 1998, pp. 268-271.

Inada, Teiichi, and Wong, C. P., "Fundamental Study on Adhesive Strength of Electrical Conductive Adhesives (ECAs)," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 156-159.

Inasawa, Susumu, "In-situ observation of the growth of individual silicon wires in the zinc reduction reaction of SiCl4," Journal of Crystal Growth, vol. 412, pp. 109-115, Feb. 15, 2015.

Ingole, Sarang, Manandhar, Pradeep, Chikkannanavar, Satishkumar B., Akhadov, Elshan A., and Picraux, S. Tom, "Charge Transport Characteristics in Boron-Doped Silicon Nanowires," IEEE Transactions on Electron Devices, vol. 55 no. 11, pp. 2931-2938, Nov. 2008.

Inoue, M., Miyamoto, T., and Suganuma, K., "Analysis of Influential Factors in Determining Adhesive Strength of ACF Joints," 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, Portland, OR, Sept. 12-15, 2004, pp. 148-152.

Inoue, Masafumi, "Technology for Mounting 0201" Chips Using Lead-Free Solder."

Inoue, Masahiro, Muta, Hiroaki, Yamanaka, Shinsuke, and Liu, Johan, "Anisotropic Thermal Conductivity in Electrically Conductive Adhesives with Single- and Bimodal Filler-size Distributions Containing Ag Flakes and Micro-particles," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Inoue, Masahiro, Notsuke, Takashi, Sakaniwa, Yoshiaki, and Tada, Yasunori, "Effect of Binder Chemistry on the Electrical Conductivity of Air-cured Epoxy-based Electrically Conductive Adhesives containing Copper Filler," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 146-150.

Inoue, Masahiro, and Suganuma, Katsuaki, "Effect of curing conditions on the interconnect properties of isotropic conductive adhesives composed of an epoxy-based binder," 7th IEEE CPMT International Conference on High Density Microsystem Design, Packaging and Failure Analysis, Shanghai, June 28, 2005, pp. xx-xx.

Inoue, Masahiro, and Suganuma, Katsuaki, "Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder," Soldering & Surface Mount Technology, vol. 18 no. 2, pp. 40-45, 2006.

Inoue, Masahiro, and Liu, Johan, "Electrical and Thermal Properties of Electrically Conductive Adhesives Using a Heat-resistant Epoxy Binder," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 1147-1151.

Inoue, Masahiro, Muta, Hiroaki, Yamanaka, Shinsuke, and Suganuma, Katsuaki, "Electrical Properties of Isotropic Conductive Adhesives Composed of Silicone-Based Elastomer Binders Containing Ag Particles," Journal of Electronic Materials, vol. 38 no. 9, pp. 2013-2022, Sept. 2009.

Inoue, Masahiro, Sakaniwa, Yoshiaki, and Tada, Yasunori, "In-situ Analysis of Electrical Conductivity Evolution in Epoxy-based Conductive Adhesives with Ag Loading during Curing Process," 2014 IEEE CPMT Symposium Japan, Kyoto, Japan, Nov. 4-6, 2014, pp. 190-193.

Inoue, Masahiro, and Suganuma, Katsuaki, "Influential factors in determining the adhesive strength of ACF joints," Journal of Materials Science: Materials in Electronics, vol. 20 no. 12, pp. 1247-1254, Dec. 2009.

Inoue, Masahiro, Tada, Yasunori, Muta, Hiroaki, and Yamanaka, Shinsuke, "Microstructural Control of Electrically Conductive Adhesives with Ag micro-fillers by Binder Chemistry," 2013 IEEE 3rd CPMT Symposium Japan , Kyoto, Japan, Nov. 11-13, 2013, pp. xx-xx.

Inoue, Masahiro, Muta, Hiroaki, Maekawa, Takuji, Yamanaka, Shinsuke, and Suganuma, Katsuaki, "Physical Factors Determining Thermal Conductivities of Isotropic Conductive Adhesives," Journal of Electronic Materials, vol. 38 no. 3, pp. 430-437, Mar. 2009.

Inoue, Masahiro, Miyamoto, Tokuji, and Suganuma, Katsuaki, "Relationship Between Curing Conditions and Interconnect Properties of Flexible Printed Circuit/Glass Substrate Joints Using Anisotropic Conductive Films," Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, China, June 30-July 3, 2004, pp. 248-253.

Inoue, Masahiro, Muta, Hiroaki, Maekawa, Takuji, Yamanaka, Shinsuke, and Suganuma, Katsuaki, "Temperature Dependence of Electrical and Thermal Conductivities of an Epoxy-Based Isotropic Conductive Adhesive," Journal of Electronic Materials, vol. 37 no. 4, pp. 462-468, Apr. 2008.

Inoue, Masahiro, and Suganuma, Katsuaki, "Test speed dependency of peel strength of ACF joints," 7th IEEE CPMT International Conference on High Density Microsystem Design, Packaging and Failure Analysis, Shanghai, June 28, 2005, pp. xx-xx.

Inoue, Masahiro, Muta, Hiroaki, Maekawa, Takuji, Yamanaka, Shinsuke, and Suganuma, Katsuaki, "Thermal Conductivity of Isotropic Conductive Adhesives Composed of an Epoxy-Based Binder," Proceedings of the 2006 IEEE CPMT Conference on High Density Microsystem Design, Packaging and Component Failure Analysis , Shanghai, June 27-28, 2006, pp. 236-241.

Inoue, Michinobu, and Koyanagawa, Takashi, "Thermal Simulation for Predicting Substrate Temperature during Reflow Soldering Process," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 1, Orlando, FL, May 31-June 3, 2005, pp. 1021-1026.

Inoue, Yumi, Nakazawa, Tsutomu, Sawada, Kanako, and Sudo, Toshio, "Development of Crack-free Plastic Package: Evaluation of High Reliability of CSS (Chip Side Support) Structure," Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium, Omiya, Japan, Dec. 4-6, 1995, pp. 407-410.

Interante, Mario, Chapman, Brian, Cole, Marie, De Sousa, Isabel, Goldsmith, Chuck, Jozwiak, Janet, Lopez, Tasha, Ma, Wai, Martin, Gregory, Ndiaye, Cheikhou, Ostrander, Steve, Ranadive, Nandu, and Sablinski, William, "Lead-Free Card Assembly and Rework for Column Grid Arrays," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 160-167.

Interrante, Mario, Coffin, Jeffrey, Cole, Marie, Sousa, Isabel De, Farooq, Mukta, Goldmann, Lewis, Goldsmith, Charles, Jozwiak, Janet, Lopez, Tasha, Martin, Gregory, Truong, Van Thanh, and Welsh, David, "Lead-Free Package Interconnections for Ceramic Grid Arrays," IEEE/SEMI STS: International Electronics Manufacturing Technology.

Interrante, Mario, Coffin, Jeffrey, Cole, Marie, De Sousa, Isabel, Farooq, Mukta, Goldmann, Lewis, Goldsmith, Charles, Jozwiak, Janet, Lopez, Tasha, Martin, Gregory, Troung, Van Thanhm and Welsh, David, "Lead-Free Package Interconnections for Ceramic Grid Arrays," IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, San Jose, CA, July 16-18, 2003, pp. 85-92.

Ionescu, Ciprian, Codreanu, Norocel-Dragos, and Varzaru, Gaudentiu, "Electrical and thermal investigations on printed conductive paste used in Solderless Assembly for Electronics Technology," 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging , Constanta, Romania, Oct. 26-29, 2017, pp. 50-54.

Ionescu, Ciprian, Golumbeanu, Virgil, and Davidescu, Mircea, "Influence of the Conductive Adhesives Joints to Decoupling Impedance," 26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials, The High Tatras, Slovak Republic, May 8-11, 2003, pp. 255-259.

Ionescu, Daniela, and Ciobanu, Brandusa, "Thermal Shift in Electrical Behavior of Substrate Materials with Improved Flame Resistance," 30th International Spring Seminar on Electronics Technology, Cluj-Napoca, Romania, May 9-13, 2007, pp. 346-351.

Ipser, H., Flandorfer, H., Luef, Ch., Schmetterer C., and Saeed, U., "Thermodynamics and phase diagrams of lead-free solder materials," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 3-17, Mar. 2007.

Irfan, Muhammad, Khan, U., Li, Wenjing, Kong, Wenjie, Javed, K., and Han, X. F., "Structural and magnetic properties of Fe3Ga alloy nanowires: Effect of post annealing treatment," Journal of Alloys and Compounds, vol. 691, pp. 1-7, Jan. 15, 2017.

Irino, Tetsuro, "Hitachi Halogen-Free Materials for Advanced Substrate & Printed Circuit Board," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Irisawa, Atushi, "Lead-free: Reduce Joint Cracks in Automotive Electronics," Surface Mount Technology (SMT), vol. 20 no. 6, pp. xx-xx, June 2006.

Irving, Joan, "Consolidation, Legislation, Glocalisation," Components in Electronics, vol. xx no. xx, pp. xx-xx, Oct. 2006.

Irving, Joan, "Non-compliant RoHS components are getting scarce," Electronics Weekly, Sept. 18, 2006.

Irwin, Roy J., "Environmental Contaminants Encyclopedia: Chromium (in General) Entry," National Park Service, July 1, 1997.

Isaac, John, "Design for Compliance: The Impact of RoHS," SMT Web Exclusive Article.

Isaacs, Phil, Kobeda, Eddie, and Zhang, Jing, "No-Clean Pb-Free Flux: A Chemical View of Reliability," 2014 Pan Pacific Microelectronics Symposium, Kohala Coast, HI, Feb. 11-13, 2014, pp. xx-xx.

Isaacs, Phil, Kobeda, Eddie, and Zhang, Jing, "Pb-Free Flux: A Chemical View of Reliability," SMTA Journal, vol. 28 no. 1, pp. 30-39, 2015.

Isaacs, Phil, and Kobeda, Eddie, "Pb-Free Thermal Cycle Acceleration Factors," 2011 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, Kamuela, HI, Jan. 18-20, 2011, pp. xx-xx.

Isaacs, Phil, and Kobeda, Eddie, "Pb-Free Thermal Cycle Acceleration Factors," SMTA Journal, vol. 24 no. 2, pp. 26-32, 2011.

Isaacs, Phil, Chia, Kar Lin, Poh, Huat Ing, and Truman, Tom, "Process Considerations For Lead Free Assemblies," Pan Pacific Symposium 2017 Proceedings, Koloa, HI, Feb. 6-9, 2017, pp. xx-xx.

Isaak, Harlan, and Uka, Pete, "Development of Flex Stackable Carriers," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 378-384.

Iscoff, Ron, "Challenges of Soldering in a Pb-Free World," Chip Scale Review, pp. 55-59, Aug./Sept. 2006.

Iscoff, Ron, "Going Green and Lead-Free: The Race Is On!," Chip Scale Review , vol. xx no. xx, pp. xx-xx, Aug.-Sept. 2005.

Iscoff, Ron, "Judging the Early Impact of RoHS on a Scale of 1 to 10: To Date, The Reviews Are Mixed," Chip Scale Review, pp. 36-37, 39, 41-43, July 2006.

Iscoff, Ron, "RoHS a Year After: Too Little, Too Late; Too Much, Too Soon--or Just Right?," Chip Scale Review,vol. 14 no. 5, pp. xx-xx, July 2007.

Iscoff, Ron, "The Bandwagon Starts to Roll for Lead-Free Electronics," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Mar./Apr. 2000.

Ishibashi, Kazuo, and Kimura, Jun, "A New Anisotropic Conductive Film with Arrayed Conductive Particles," IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B: Advanced Packaging, vol. 19 no. 4, pp. 752-757, Nov. 1996.

Ishibashi, Masahiro, Fujimoto, Kensuke, Ikeda, Ken-ichi, Hata, Satoshi, and Nakashima, Hideharu, "High Temperature Deformation Behavior of Sn-Based Solder Alloys under Low Stress Conditions by a Helical Spring Creep Testing Method," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 73 no. 5, pp. 373-380, May 2009.

Ishida, Hiroya, and Matsushita, Kiyoto, "Characteristics of Ceramic BGA using Polymer Core Solder Balls," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 404-410.

Ishida, Hiroya, "New ideas for package designs using plastic core solder balls," 2013 IEEE International Symposium on Advanced Packaging Materials, Irvine, CA, Feb. 27-Mar. 1, 2013, pp. 299.

Ishida, Y., Suzuki, K., and Ichihara, M., "Production of whisker crystal by straining Zn-Al eutectoid alloy at elevated temperatures," Scripta Metallurgica, vol. 12 no. , pp. 999-1002, Nov. 1978.

Ishihara, Masatou, Yumoto, Hisami, Akashi, Kazuo, and Kamei, Kazuto, "Zinc-nickel alloy whiskers electrodeposited from a sulfate bath," Materials Science and Engineering: B, vol. 38 no. 1-2, pp. 150-155, Mar. 1996. https://doi.org/10.1016/0921-5107(95)01429-2

Ishihara, Satoru, Ohtani, Hiroshi, Saito, Takashi, and Ishida, Kiyohito, "Thermodynamic Analysis of the Sn-In-Sb Ternary Phase Diagram," Journal of Japan Institute of Metals, vol. 63 no. 11, pp. 695-701, June 1999.

Ishii, Takao, Aoyama, Shinji, and Tokumitsu, Masami, "Fabrication of 0.95Sn-0.05Au Solder Micro-Bumps for Flip-Chip Bonding," Journal of Electronic Materials, vol. 30 no. 6, pp. L25-L27, June 2001.

Ishii, Takao, and Aoyama, Shinji, "Novel Micro-Bump Fabrication for Flip-Chip Bonding," Journal of Electronic Materials, vol. 33 no. 11, pp. L21-L23, Nov. 2004.

Ishikawa, Haruji, "On the Transformation of Tin at Low Temperature," Journal of the Physical Society of Japan, vol. 6 no. 6, pp. 531-532, Nov.-Dec. 1951.

Ishikawa, Masayuki, Sasaki, Hayato, Ogawa, Satoko, Kohinata, Masayoshi, Mishima, Akifumi, and Yoshida, Hideaki, "Application of Gold-Tin Solder Paste for Fine Parts and Devices," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 701-709.

Ishikawa, Nobuhiro, Kimura, Takashi, Nishida, Kenji, Aoyagi, Takeshi, Furuya, Kazuo, and Sugizaki, Takashi, "Three-Dimensional Analysis of the Interface Between an Sn-8wt.%Zn-3wt.%Bi Solder and a Substrate by Using an Angle-Lapping Method," Journal of Electronic Materials, vol. 35 no. 7, pp. 1537-1543, July 2006.

Ishikawa, Shinji, Hashino, Eiji, Kono, Taro, and Tatsumi, Kohei, "IMC Growth of Solid State Reaction between Ni UBM and Sn-3Ag-0.5Cu and Sn-3.5Ag Solder Bump Using Ball Place Bumping Method during Aging," Materials Transactions, vol. 46 no. 11, pp. 2351-2358, 2005.

Ishikawa, Shinji, Uchiyama, Tomoyuki, Hashino, Eiji, Kohno, Taro, Tanaka, Masamoto, and Tatsumi, Kohei, "Lead-Free Solder Micro-Ball Bumps for the Next Generation of Flip Chip Interconnection: Micro-Ball Materials, Bump Formation Process and Reliability," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 872-877.

Ishikawa, Shoho, Tohmyoh, Hironori, Saka, Masumi, Watanabe, Satoshi, Kuroha, Motohisa, and Nakano, Yoshikatsu, "Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-free Solder Bump," Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, Volume 1, Portland, OR, July 6-8, 2011, pp. 207-211.

Ishikawa, Shoho, Tohmyoh, Hironori, Watanabe, Satoshi, Nishimura, Tomonori, and Nakano, Yoshikatsu, "Extending the fatigue life of Pb-free SAC solder joints under thermal cycling," Microelectronics Reliability, vol. 53 no. 5, pp. 741-747, May 2013.

Ishimatsu, Tomoyuki, and Kojima, Ryoji, "Recent Development of Anisotropic Conductive Film for Fine Pitch COF Connection," 2008 SID International Symposium Digest of Technical Papers, Volume 39 Book III, Los Angeles, CA, May 20-21, 2008, pp. 1442-1445.

Ishiyama, Akiyoshi, Shohji, Ikuo, Ganbe, Tatsuya, and Watanabe, Hirohiko, "Impact Properties of Sn-3Ag-0.5Cu Solder Ball Joint with Epoxy-Based Flux," 2014 International Conference on Electronics Packaging, Toyoma, Japan, Apr. 23-25, 2014, pp. 766-769.

Ishizaki, Toshitaka, and Watanabe, Ryota, "Pressureless Bonding by Use of Cu and Sn Mixed Nanoparticles," Journal of Electronic Materials, vol. 43 no. 12, pp. 4413-4420, Dec. 2014.

Islam, M. N., Chan, Y. C., Alam, M. O., and Sharif, A., "Comparative Study of the Dissolution Kinetics of Electrolytic Ni and Electroless NiP Layers by Molten Sn3.5Ag Solder Alloy," Journal of Electronic Packaging, vol. 127 no. 4, pp. 365-369, Dec. 2005.

Islam, M. N., Chan, Y. C., Sharif, A., and Alam, M. O., "Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy," Microelectronics Reliability, vol. 43 no. 12, pp. 2031-2037, Dec. 2003.

Islam, M. N., Chan, Y. C., Alam, M. O., and Sharif, A., "Comparative Study of the Dissolution Kinetics of Electrolytic Ni and Electroless NiP Layers by Molten Sn3.5Ag Solder Alloy," Journal of Electronic Packaging, vol. 127 no. 4, pp. 365-369, Dec. 2005.

Islam, M. N., Chan, Y. C., Sharif, A., and Rizvi, M. J., "Effect of 9 wt.% in addition to Sn3.5Ag0.5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu pads," Journal of Alloys and Compounds, vol. 396 no. 1-2, pp. 217-223, June 21, 2005.

Islam, M. N., Sharif, Ahmed, and Chan, Y. C., "Effect of Volume in Interfacial Reaction between Eutectic Sn-3.5%Ag-0.5%Cu Solder and Cu Metallization in Microelectronic Packaging," Journal of Electronic Materials, vol. 34 no. 2, pp. 143-149, Feb. 2005.

Islam, M. N., Chan, Y. C., and Alam, M. O., "Effects of intermetallic compounds on properties of Sn-Cu lead-free soldered joints," Proceedings of 2005 International Conference on Asian Green Electronics, Shang Hai, China, Mar. 15-18, 2005, pp. 185-191.

Islam, M. N., and Chan, Y. C., "Influence of elements in lead-free solder with electrolytic Ni and electroless NiP layers during extended time reflow on ball grid array packages," Microelectronics Reliability, vol. ?? no. ??, pp. ??-??, 2005. (in press)

Islam, M. N., and Chan, Y. C., "Interfacial Reactions of Cu-Containing Lead-Free Solders with Au/NiP Metallization," Journal of Electronic Materials, vol. 34 no. 5, pp. 662-669, May 2005.

Islam, M. N., Chan, Y. C., and Sharif, A., "Interfacial reactions of Sn-Cu and Sn-Pb-Ag solder with Au/Ni during extended time reflow in ball grid array packages," Journal of Materials Research , vol. 19 no. 10, pp. 2897-2904, Oct. 2004.

Islam, M. N., and Chan, Y. C., "Interfacial reactions of Sn-Cu solder with Ni/Au surface finish on Cu pad during reflow and aging in ball grid array packages," Materials Science and Engineering B: Solid-State Materials for Advanced Technology, vol. 117 no. 3, pp. 246-253, Mar. 25, 2005.

Islam, M. N., Chan, Y. C., Rizvi, M. J., and Jillek, W., "Investigations of interfacial reactions of Sn-Zn based and Sn-Ag-Cu lead-free solder alloys as replacement for Sn-Pb solder," Journal of Alloys and Compounds, vol. 400 no. 1-2, pp. 136-144, Sept. 1, 2005.

Islam, M. N., and Chan, Y. C., "Wetting and interfacial reactions of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder," Proceedings of 2005 International Conference on Asian Green Electronics, Shang Hai, China, Mar. 15-18, 2005, pp. 178-184.

Islam, Nokibul, Jimarez, Miguel, Syed, Ahmer, Hwang, TaeKyeong, Gim, Jae Yun, and Kang, WonJoon, "Lead Free Flip Chip Reliability for Various Package Types," Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, Volume 1, Portland, OR, July 6-8, 2011, pp. 609-615.

Islam, R. A., and Chan, Y. C., "Effect of microwave preheating on the bonding performance of flip chip on flex joint," Microelectronics Reliability, vol. 44 no. 5, pp. 815-821, May 2004.

Islam, R. A., Yu, B. Y., Alam, M. O., Chan, Y. C., and Jillek, W., "Investigations on microhardness of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder," Journal of Alloys and Compounds, vol. 392 no. 1-2, pp. 149-158, Apr. 19, 2005.

Islam, Rashed Adnan, and Chan, Y. C., "Behavior of Anisotropic Conductive Film (ACF) Joint Under Mechanical Shock," Journal of Electronic Packaging, vol. 127 no. 4, pp. 375-380, Dec. 2005.

Islam, Rashed Adnan, Chan, Y. C., Jillek, W., and Islam, Samia, "Comparative study of wetting behaviour and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders," Microelectronics Journal , vol. 37 no. 8, pp. 705-713, Aug. 2006.

Islam, Rashed Adnan, Chan, Y. C., and Ralph, B., "Effect of drop impact energy on contact resistance of anisotropic conductive adhesive film joints," Journal of Materials Research, vol. 19 no. 6, pp. 1662-1668, June 2004.

Islam, Rashed Adnan, and Chan, Y. C., "Microwave Preheating of Anisotropic Conductive Adhesive Film for High-Speed Flip Chip on Flex Bonding," Journal of Electronic Materials, vol. 35 no. 1, pp. 123-131, Jan. 2006.

Ismail, Norhazlina, and Yoo, Jong, "Determination of Lead (Pb) Concentration Level in Solder Finished Product Using Laser Induced Breakdown Spectroscopy (LIBS)," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 456-461.

Ismail, Norliza, Ismail, Roslina, Jalar, Azman, Omar, Ghazali, Salleh, Emee Marina, Kamil, Norinsan, and Rahman, Irman Abdul, "Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability," Journal of Materials Science: Materials in Electronics, vol. 29 no. 15, pp. 12910-12916, Aug. 2018.

Ismail, Norliza, Jalar, Azman, Bakar, Maria Abu, Ismail, Roslina, and Ibrahim, Najib Saedi, "Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu," Soldering & Surface Mount Technology, vol. 32 no. 3, pp. 157-164, 2020.

Ismail, Norliza, Jalar, Azman, Bakar, Maria Abu, Safee, Nur Shafiqa, Yusoff, Wan Yusmawati Wan, and Ismail, Ariffin, "Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition," Soldering & Surface Mount Technology, vol. 33 no. 1, pp. 47-56, 2021.

Israeloff, N. E., Weissman, M. B., Mozurkewich, G., and Jacobsen, R. L., "Are Copper Whiskers Noisy?," Solid State Communications, vol. 66 no. 8, pp. 805-808, May 1988.

Israelsohn, Joshua, "Packaging solves "the last centimeter",", EDN, vol. 46 no. 12, pp. 73-82, May 24, 2001.

Itagaki, Minehiro, Hase, Nobuhiro, Yuhaku, Satoru, Bessho, Yoshihiro, and Eda, Kazuo, "A Cofired Bump Bonding Technique for Chip Scale Package Fabrication Using Zero X-Y Shrinkage Low Temperature Cofired Ceramic Substrate," The International Journal of Microcircuits and Electronic Packaging, vol. 21 no. 1, pp. 46-51, First Quarter 1998.

Itaya, Kingo, Sugawara, Shizuo, and Higaki, Katsutoshi, "In Situ Scanning Tunneling Microscopy for Platinum Surfaces in Aqueous Solutions," Journal of Physical Chemistry B, vol. 92 no. 23, pp. 6714-6718, Nov. 1988.

Ito, Edson, "High-Performance Polymers for Environmentally Friendly Electronic Components," SMT Web Exclusive Article.

Ito, Sadanori, "Present Status of the Trivalent Chromium(Cr3+) Type and Its Related Issue," Journal of the Surface Finishing Society of Japan, vol. 57 no. 12, pp. 850-854, 2006.

Itoh, Hirotaka, "Issues Remain with Pb-Free Solder in Stacked Capacitors," Nikkei Electronics Asia, pp. xx-xx, Feb. 2006.

Itoh, Taiki, and Tanokura, Yasuo, "New Sn-Zn Solder Bonds at Under 200 celsius," Nikkei Electronics Asia, pp. xx-xx, Nov. 2002.

Itoh, Takamoto, Yamamoto, Takaci, Sakane, Masao, and Tsukada, Yutaka, "Creep-Fatigue Life of Sn-8Zn-3Bi Solder Under Multiaxial Loading," 1st Electronics Systemintegration Technology Conference, Volume 2, Dresden, Germany, Sept. 5-7, 2006, pp. 1012-1019.

Itou, Hirotaka, "Pb-Free Solder Demands New Soldering Iron Methods," Nikkei Electronics Asia, pp. xx-xx, Dec. 2004.

Itsubo, Norihiro, Kubo, Ttshiaki, Noh, Jaesung, and Inaba, Atsushi, "An Estimate of the Transaction of Environmental Impacts as a Result of Switching to Pb-free Solder," Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 12-14, 2005, pp. 559-560.

Itsubo, Norihiro, Noh, Jaesung, Hayashi, Kentaro, and Inaba, Atsushi, "Damage Assessment of Human Health for Lead-free Solder Based on Endpoint-type LCIA Methodology," Proceedings of EcoDesign2003: Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 8-11, 2003, pp. 836-837.

Itsubo, Norihiro, Noh, Jaesung, and Inaba, Atsushi, "Life Cycle Impact Assessment of Lead-free Solder Considering the Trade-off Relationship between Toxic Impact and Other Impact Categories," Materials Transactions, vol. 45 no. 11, pp. 3194-3200, Nov. 2004.

Ivanov, Vitalii, and Wolter, Klaus-Juergen, "Environmental Ageing Effects on the Electrical Resistance of Silver-Epoxy Electrically Conductive Adhesive Joints to a Molybdenum Electrode," 2013 IEEE 15th Electronics Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp. 44-47.

Ivanov, Vitalii, Boehme, Bjoern, and Wolter, Klaus-Juergen, "Resistance of Conductive Adhesive Joints on Non-Noble Surface Finishes," 2012 35th International Spring Seminar on Electronics Technology, Bad Aussee, Austria, May 9-13, 2012, pp. 254-259.

Ivanova, V., Raichevski, G., Krastev, V., and Vitkova, S., "Anodic Behavior of Electrodeposited Zn-Sn Alloys," Transactions of the Institute of Metal Finishing, vol. 76 no. 6, pp. 219-223, Nov. 1998.

Iverson, Wes, "Getting a Handle on RoHS," Automation World, vol. 3 no. 8, pp. 42-44, Aug. 2005.

Iwamoto, Hiroyuki, Munekata, Osamu, and Tsuruta, Kaichi, "Study on the Mitigation Solder of the External Stress Type Whisker," 2016 International Conference on Electronics Packaging, Hokkaido, Japan, Apr. 20-22, 2016, pp. 333-336.

Iwamura, E., Ohnishi, T., Yoshikawa, K., and Itayama, K., "In situ scanning electron microscope observation of hillock and whisker growth on Al-Ta alloy films for interconnections of thin film transistor-liquid crystal displays," Journal of Vacuum Science & Technology A: Vacuum Surfaces, and Films, vol. 12 no. 5, pp. 2922-2924, Sept./Oct. 1994.

Iwamura, Eiji, Takagi, Katsutoshi, and Ohnishi, Takashi, "Hillock morphology and density in AlTa and AlCu alloy films encapsulated with aluminum oxide layers," AIP Conference Proceedings, vol. 418, pp. 401-406, 1998.

Iwanaga, H., Yoshiie, T., Yamaguchi, T., and Shibata, N., "Growth Mechanism of Hollow CdSe and CdS Crystals," Journal of Crystal Growth, vol. 51 no. 3, pp. 438-442, Mar. 1981.

Iwane, Y., Morizono, Y., Ohno, Y., and Kuwano, N., "Behavior of Whisker Growth on Tin Plated Fe-42%Ni Substrates," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 150-153.

Iwanishi, H., Hirose, A., Imamura, T., Tateyama, K., Mori, I., and Kobayashi, K. F., "Properties of Quad Flat Package Joints Using Sn-Zn-Bi Solder with Varying Lead-Plating Materials," Journal of Electronic Materials, vol. 32 no. 12, pp. 1540-1546, Dec. 2003.

Iwasaki, Masaya, Yamauchi, Akira, and Kurose, Masashi, "Influence of intermetallic compounds on tensile strength of lead-free solder," 2014 International Conference on Electronics Packaging, Toyoma, Japan, Apr. 23-25, 2014, pp. 770-773.

Iwasaki, Tomohiro, Kim, Jeong Hwan, Mizuhashi, Shohei, and Satoh, Munetake, "Encapsulation of Lead-Free Sn/Zn/Bi Solder Alloy Particles by Coating with Wax Powder for Improving Oxidation Resistance," Journal of Electronic Materials, vol. 34 no. 5, pp. 647-654, May 2005.

Iwasaki, Toshihiro, Watanabe, Masaki, Baba, Shinji, Hatanaka, Yasumichi, Idaka, Shiori, Yokoyama, Yoshinori, and Kimura, Michitaka, "Development of 30 micron Pitch Bump Interconnections for COC-FCBGA," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1216-1222.

Iwata, Hirokazu, and Ishii, Osamu, "Conductive Adhesive-Free Surface Mount Type High Frequency Fundamental Crystal Resonators by Gold Bump Bonding," Proceedings of the 1999 Joint Meeting of the European Frequency and Time Forum and the IEEE International Frequency Control Symposium, Volume 1, Apr. 13-16, 1999, pp. 461-464.

Iyengar, Ananth S., Liang, Dong, Gao, Xuan P. A., and Abramson, Alexis R., "Densification effects on the electrical behavior of uniaxially compacted bismuth nanowires," Acta Materialia, vol. 60 no. 5, pp. 2369-2378, Mar. 2012.

Iyer, Ganesh, Ouyang, Eric, Kittidacha, Witoon, Tantideeravit, Soratos, and Suresh, L. K., "Pb-free Solder: SAC105 vs SAC305 Drop-Test Reliability Data Comparison," 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium, San Jose, CA, Oct. 3-5, 2007, pp. 251-255.

Iyer, Satyanarayan, Sajjala, Sandeep, Damodaran, Purushothaman, and Srihari, Krishnaswarni, "Implementing 0201s On High-Density Lead-Free Memory Modules," IEEE Transactions on Electronics Packaging Manufacturing, vol. 31 no 1, pp. 41-50, Jan. 2008.

Iyer, Satyanarayan, and Srihari, Krishnaswami, "Reflow Profile Evaluation for Lead-Free Stacked CSP Components Subjected to Mutiple Reflow Cycles," SMTAnews & Journal of Surface Mount Technology, vol. 22 no. 3, pp. 37-42, July-Sept. 2009.

Iyer, Satyanarayan, Baqui, Shaon, and Ismail, Zaidy, "Reflow Profile Optimization for Minimizing Fatigue Failures on Lead-Free Assemblies Using Alloy 42 Based Lead-Free TSOP Packages," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Iyer, Satyanarayan, and Srihari, Krishnaswami, "Reliable Lead-Free Rework Process for Stacked CSP Components," IEEE Transactions on Electronics Packaging Manufacturing, vol. 32 no. 4, pp. 214-220, Oct. 2009.

Izaki, M., Enomoto, H., and Omi, T., "Tensile Fracture of Nickel-Tin Electrodeposits From a Pyrophosphate Plating Bath," Plating and Surface Finishing, vol. 74 no. 6, pp. 84-88, June 1987.

Izard, Catherine F., and Muller, Daniel B., "Tracking the devil's metal: Historical global and contemporary U.S. tin cycles," Resources, Conservation and Recycling, vol. 54 no. 12, pp. 1436-1441, Oct. 2010.

Izuta, Goro, and Tanabe, Tsuyoshi, "Dissolution of copper on Sn-Ag-Cu system lead free solder," Soldering & Surface Mount Technology, vol. 19 no. 2, pp. 4-11, 2007.

Izuta, Goro, Tanabe, Tsuyoshi, Murai, Junichi, Murakami, Masaaki, and Suganuma, Katsuaki, "IC Fillet-lifting Mechanism on Wave Soldering after Reflow Soldering," Proceedings of the 2006 IEEE CPMT Conference on High Density Microsystem Design, Packaging and Component Failure Analysis, Shanghai, June 27-28, 2006, pp. 182-187.

JJJJ

Jaafar, Norhanani Binte, and Choong, Chong Ser, "Comprehensive Study of Tin-Silver-Copper Lead-Free Alloys on Various Bond Pad Metallisation," 2019 IEEE 21st Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 4-6, 2019, pp. 658-662.

Jachim, Jenny A., Freeman, Garth B., and Turbini, Laura J., "Use of Surface Insulation Resistance and Contact Angle Measurements to Characterize the Interactions of Three Water Soluble Fluxes with FR-4 Substrates," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, vol. 20 no. 4, pp. 443-451, Nov. 1997.

Jacke, S., Plaza, J. L., Wilcoxon, J. P., Palmer, R. E., Beecher, P., De Marzi, G., Redmond, G., Quinn, A. J., and Chen, Y., "Charge transport in nanocrystal wires created by direct electron beam writing," IET Micro & Nano Letters, vol. 5 no. 5, pp. 274-277, Oct. 2010.

Jackson, David, "Legislating Lead," Surface Mount Technology (SMT), vol. 13 no. 7, pp. xx-xx, July 1999.

Jackson, G. J., Hedges, P., and Toleno, B. J., "Assessing Solder Paste Design and Process Factors on Voiding Levels in 0.5mm Pitch Pb-Free BGA Solder Joints," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Jackson, G. J., Durairaj, R., and Ekere, N. N., "Characterisation of Lead-Free Solder Pastes for Low Cost Flip-Chip Bumping," Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium, San Jose, CA, July 17-18, 2002, pp. 223-228.

Jackson, G. J., Hendriksen, M. W., Durairaj, R. K., Ekere, N. N., Desmulliez, M. P. Y., and Kay, R. W., "Differences in the Sub-Processes of Ultra Fine Pitch Stencil Printing due to Type-6 and Type-7 Pb-free Solder Pastes used for Flip Chip," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 536-543.

Jackson, G. J., Hendriksen, M. W., Horsley, R., Hoo, N., Salam, B., and Ekere, N. N., "Establishing Control Factors of Intermetallic Formation within Pb-free Solder Bumps at Flip Chip Gometries," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1472-1479.

Jackson, G. J., Hendriksen, M. W., Lu, H., and Ekere, N. N., "Experimental and Computational Modelling Characterisation of Fine Particle Pb-Free Solder Paste Volumes for Flip Chip Assembly Applications," Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium, San Jose, CA, July 17-18, 2002, pp. 304-309.

Jackson, Gavin J., and Steen, H. A. H., "Factors Affecting Voiding in Pb-free Solder Joints," Circuits Assembly, vol. 18 no. 2, pp. 58, 60, 62-63, Feb. 2007.

Jackson, Gavin J., Lu, Hua, Durairaj, Raj, Hoo, Nick, Bailey, Chris, Ekere, Ndy N., and Wright, Jon, "Intermetallic Phase Detection in Lead-Free Solders Using Synchrotron X-ray Diffraction," Journal of Electronic Materials, vol. 33 no. 12, pp. 1524-1529, Dec. 2004.

Jackson, Gavin J., Wilding, Ian J., Boyle, Richard, Collins, Maurice N., Dalton, Eric, Punch, Jeff, Liu, Puwei, and Holloway, Matthew, "SnZn Solder Alternative for Low Cost Pb-Free Surface Mount Assemblies," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 605-612.

Jackson, Gavin, and Toleno, Brian, "STEP 7: Soldering," Surface Mount Technology (SMT), vol. 20 no. 8, pp. 36-37, Aug. 2006.

Jackson, Joab, "NASA on the trail of metal shavings,"Government Computer News , pp. 6, Sept. 24, 2007.

Jackson, K. A., and Wagner, R. S., "Extinction Contours in Whiskers," Journal of Applied Physics, vol. 36 no. 7, pp. 2132-2137, July 1965.

Jackson, Robert L., and Crandall, Erika R., "A Multiphysics Coupled Electro-thermo-mechanical Model of Whisker Shorting," 2018 IEEE Holm Conference on Electrical Contacts, Albuquerque, NM, Oct. 14-18, 2018, pp. 48-55.

Jackson, Robert L., and Kogut, Lior, "Electrical Contact Resistance Theory for Anisotropic Conductive Films Considering Electron Tunneling and Particle Flattening," IEEE Transactions on Components and Packaging Technologies, vol. 30 no. 1, pp. 59-66, Mar. 2007.

Jacobs, M. H. G., and Spencer, P. J., "A Thermodynamic Evaluation of the System Si-Sn," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 20 no. 1, pp. 89-91, Mar. 1996.

Jacobson, D. M., and Humpston, G., "Diffusion Soldering," Soldering & Surface Mount Technology, vol. 4 no. 1, pp. 27-32, 1992.

Jacobson, D. M., and Humpston, G., "Fluxless soldering," International Materials Reviews, vol. 51 no. 5 , pp. 313-328, Oct. 2006.

Jacobson, D. M., and Harrison, M. R., "Lead-Free Soldering: A Progress Report," The GEC Journal of Technology , vol. 14 no. 2, pp. 98-109, 1997.

Jadhav, Nitin, Williams, Maureen, Pei, Fei, Stafford, Gery, and Chason, Eric, "Altering the Mechanical Properties of Sn Films by Alloying with Bi: Mimicking the Effect of Pb to Suppress Whiskers," Journal of Electronic Materials , vol. 42 no. 2, pp. 312-318, Feb. 2013.

Jadhav, Nitin, Buchovecky, Eric, Chason, Eric, and Bower, Allan, "Real-time SEM/FIB Studies of Whisker Growth and Surface Modification," JOM, vol. 62 no. 7, pp. 30-37, July 2010.

Jadhav, Nitin, Wasserman, Jacob, Pei, Fei, and Chason, Eric, "Stress Relaxation in Sn-Based Films: Effects of Pb Alloying, Grain Size, and Microstructure," Journal of Electronic Materials, vol. 41 no. 3, pp. 588-595, Mar. 2012.

Jadhav, Nitin, Buchovecky, Eric J., Reinbold, Lucine, Kumar, Sharvan, Bower, Allan F., and Chason, Eric, "Understanding the Correlation Between Intermetallic Growth, Stress Evolution, and Sn Whisker Nucleation," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 3, pp. 183-192, July 2010.

Jadhav, S. G., Bieler, T. R., Subramanian, K. N., and Lucas, J. P., "Stress Relaxation Behavior of Composite and Eutectic Sn-Ag Solder Joints," Journal of Electronic Materials, vol. 30 no. 9, pp. 1197-1205, Sept. 2001.

Jaeschke, Johannes, Kleff, Jessica, Muller, Wolfgang H., Nissen, Nils F., and Reichl, Herbert, "Evaluating the Effects of Electromigration by Using Adjustable Solder Joints of Concave Shape," 11th Electronics Packaging Technology Conference , Singapore, Dec. 9-11, 2009, pp. 395-400.

Jafari, Maryam, Salavati-Niasari, Masoud, and Sobhani, Azam, "Silver selenide nanoparticles: synthesis, characterisation and effect of preparation conditions under ultrasound radiation," IET Micro & Nano Letters, vol. 8 no. 9, pp. 508-511, Sept. 2013.

Jafari-Khamse, E., Kashi, M. Almasi, and Ramazani, A., "Angular dependence of interactions in polycrystalline Co nanowire arrays," Materials Chemistry and Physics, vol. 159, pp. 128-138, June 1, 2015.

Jaffee, R. I., Minarcik, E. J., and Gonser, B. W., "Low-Temperature Properties of Lead-Base Solders and Soldered Joints," Metal Progress, vol. 54 no. 6, pp. 843-845, Dec. 1948.

Jafri, A., "Fighting Whisker Growth in the Communication Industry," Plating, vol. 60 no. 4, pp. 358-361, Apr. 1973.

Jager, Ralph, "RoHS Compliance Process: EICTA's view," EICTA.

Jager, Walter, "How to Cope with the Next Wave in Substance Regulations," International Conference on Soldering & Reliability 2011 Proceedings, Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

Jager, Walter, Langton, Joe, and Norlem, Torben, "Identifying and Managing Substances of Concern in Electronics," Electronics Goes Green 2012+, Berlin, Germany, Sept. 9-12, 2012, pp. xx-xx.

Jager, Walter, "IEC Environmental Standards: A Framework for Environmental Compliance," 2009 IEEE Symposium on Product Compliance Engineering Proceedings , Toronto, Ontario, Oct. 26-28, 2009, pp. xx-xx.

Jager, Walter, "RoHS2 and REACH: The Next Steps for Restricted Substances," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

Jager, Walter, "Where are REACH SVHC in Electronic Products and Parts?," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S26_01-1-S26_01-8.

Jagminas, A., Valsiunas, I., Veronese, G. P., Juskenas, R., and Rutavicius, A., "Alumina template-assisted growth of bismuth selenide nanowire arrays," Journal of Crystal Growth, vol. 310 no. 2, pp. 428-433, Jan. 15, 2008.

Jagminas, A., Valsiunas, I., Simkunaite, B., and Vaitkus, R., "Peculiarities of Bi0 nanowire arrays growth within the alumina template pores by ac electrolysis," Journal of Crystal Growth, vol. 310 no. 19, pp. 4351-4357, Sept. 15, 2008.

Jagt, J. C., Beris, P. J. M., and Lijten, G. F. C. M., "Electrically Conductive Adhesives: A Prospective Alternative for SMD Soldering?," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, vol. 18 no. 2, pp. 292-298, May 1995.

Jagt, James C., "Reliability of Electrically Conductive Adhesive Joints for Surface Mount Applications: A Summary of the State of the Art," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 21 no. 2, pp. 215-225, June 1998.

Jagtap, Piyush, Sethuraman, Vijay A., and Kumar, Praveen, "Critical Evaluation of Relative Importance of Stress and Stress Gradient in Whisker Growth in Sn Coatings," Journal of Electronic Materials, vol. 47 no. 9, pp. 5229-5242, Sept. 2018.

Jagtap, Piyush, Narayan, P. Ramesh, and Kumar, Praveen, "Effect of Substrate Composition on Whisker Growth in Sn Coatings," Journal of Electronic Materials, vol. 47 no. 7, pp. 4177-4189, July 2018.

Jagtap, Piyush, Chakraborty, Aritra, Eisenlohr, Philip, and Kumar, Praveen, "Identification of whisker grain in Sn coatings by analyzing crystallographic micro-texture using electron back-scatter diffraction," Acta Materialia , vol. 134, pp. 346-359, Aug. 1, 2017.

Jagtap, Piyush, and Kumar, Praveen, "Macro and Micro-Texture Study for Understanding Whisker Growth in Sn Coatings," 2016 IEEE 18th Electronics Packaging Technology Conference , Singapore, Nov. 30-Dec. 3, 2016, pp. 165-170.

Jagtap, Piyush, and Kumar, Praveen, "Manipulating Crystallographic Texture of Sn Coatings by Optimization of Electrodeposition Process Conditions to Suppress Growth of Whiskers," Journal of Electronic Materials, vol. 44 no. 4, pp. 1206-1219, Apr. 2015.

Jagtap, Piyush, Jain, Nupur, and Chason, Eric, "Whisker growth under a controlled driving force: Pressure induced whisker nucleation and growth," Scripta Materialia, vol. 182, pp. 43-47, June 2020.

Jahangir, S., Cheng, Xuan, Huang, H. H., Ihlefeld, J., and Nagarajan, V., "In-situ investigation of thermal instabilities and solid state dewetting in polycrystalline platinum thin films via confocal laser microscopy," Journal of Applied Physics, vol. 116 no. 16, pp. 163511-1-163511-8, 2014.

Jahedi, Mohammad, Ardeljan, Milan, Beyerlein, Irene J., Paydar, Mohammad Hossein, and Knezevic, Marko, "Enhancement of orientation gradients during simple shear deformation by application of simple compression," Journal of Applied Physics, vol. 117 no. 21, pp. 214309-1-214309-11, June 7, 2015.

Jain, Amit, "Application of WEEE / E-waste inventorization methodology using tracer tracking along material flow in EEE lifecycle in developing country," 2008 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 19-21, 2008, pp. xx-xx.

Jain, Amit, "E-waste Business Model, Policies and Regulations in India," 2010 IEEE International Symposium on Sustainable Systems and Technology, Arlington, VA, May 17-19, 2010, pp. xx-xx.

Jain, C. C., Wang, S. S., Huang, K. W., and Chuang, T. H., "Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads," Journal of Materials Engineering and Performance, vol. 18 no. 2, pp. 211-215, Mar. 2009.

Jain, C. C., Chen, C. L., Lai, H. J., and Chuang, T. H., "The Inhibition of Tin Whiskers on the Surface of Sn-8Zn-3Bi-0.5Ce Solders," Journal of Materials Engineering and Performance, vol. 20 no. 6, pp. 1042-1048, Aug. 2011.

Jain, Chao-Chi, Wang, Shiuan-Sheng, Wu, Hui-Min, and Chuang, Tung-Hao, "Intermetalic Reactions in a Sn-51In Solder BGA Package with Immersion Ag Surface Finish," Journal of the Chinese Institute of Engineers, vol. 32 no. 2, pp. xx-xx, 2009.

Jain, S., Whalley, D. C., Cottrill, M., Kristiansen, H., Redford, K., Nilsen, C. B., Helland, T., and Liu, C., "Electrical Properties of an Isotropic Conductive Adhesive Filled with Silver Coated Polymer Spheres," 2011 18th European Microelectronics and Packaging Conference, Brighton, United Kingdom, Sept. 12-15, 2011, pp. xx-xx.

Jain, S., Whalley, D. C., Cottrill, M., Kristiansen, H., Redford, K., Helland, S., Helland, T., Kalland, Erik, and Liu, C., "Factors Affecting Conduction in Novel Isotropic Conductive Adhesives Filled with Silver Coated Polymer Spheres," 2013 European Microelectronics Packaging Conference, Grenoble, France, Sept. 9-12, 2013, pp. xx-xx.

Jain, Shiwani, Whalley, David C., and Redford, Keith, "Characterisation of Curing Shrinkage for Isotropic Conductive Adhesives Containing Silver Coated Polymer Spheres," 2016 6th Electronic System-Integration Technology Conference, Grenoble, France, Sept. 13-15, 2016, pp. xx-xx.

Jakubka, Lubos, Novotny, Marek, Hladik, Jiri, and Szendiuch, Ivan, "Reliability of solar cell's solder joints," 29th International Spring Seminar on Electronics Technology, St. Marienthal, Germany, May 10-14, 2006, pp. 188-192.

Jakubowska, Malgorzata, Bukat, Krystyna, Koscielski, Marek, Mlozniak, Anna, Niedzwiedz, Wojciech, Sloma, Marcin, and Sitek, Janusz, "Investigation of properties of the SAC solder paste with the silver nanoparticle and carbon nanotube additives and the nano solder joints," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Jalar, Azman, Bakar, Maria Abu, and Ismail, Roslina, "Temperature Dependence of Elastic-Plastic Properties of Fine-Pitch SAC 0307 Solder Joint Using Nanoindentation Approach," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 51 no. 3, pp. 1221-1228, Mar. 2020.

Jamaa, M. Haykel Ben, Cerofolini, Gianfranco, De Micheli, Giovanni, and Leblebici, Yusuf, "Polysilicon Nanowire Transistors and Arrays Fabricated With the Multispacer Technique," IEEE Transactions on Nanotechnology, vol. 10 no. 4, pp. 891-899, July 2011.

Jamadon, Nashrah Hani, Yusof, Farazila, Shukor, Mohd Hamdi Abd, Ariga, Tadashi, and Miyashita, Yukio, "Addition of porous Cu interlayer to Sn-3.0Ag-0.5Cu lead-free solder joint for high temperature application," 2014 IEEE 36th International Electronics Manufacturing Technology Conference, Johor, Malaysia , Nov. 11-13, 2014, pp. xx-xx.

Jamadon, Nashrah Hani, Yusof, Farazila, Shukor, Mohd Hamdi Abd, and Ariga, Tadashi, "Effect of Adding Porous Cu on the Microstructure and Mechanical Properties of Pb-Free Solder Joint," 2012 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Nov. 6-8, 2012, pp. xx-xx.

James, D. W. F., and Lewis, C., "Silicon whisker growth and epitaxy by the vapour-liquid-solid mechanism," British Journal of Applied Physics, vol. 16 no. xx, pp. 1089-1096, 1965.

James, Geoffrey, "How green is the valley?," Electronic Business, June 1, 2005.

James, Geoffrey, "PLM: the missing link?," Electronic Business, Oct. 1, 2006.

James, Paul, "Do you have a WEEE problem?," Electronics Manufacture and Test , vol. xx no. xx, pp. xx-xx, Mar. 7, 2007.

Jamieson, John C., "Crystal Structures at High Pressures of Metallic Modifications of Compounds of Indium, Gallium, and Aluminum," Science, New Series, vol. 139 no. 3557, pp. 845-847, Mar. 1, 1963. DOI: 10.1126/science.139.3557.845

Jamieson, John C., "Crystal Structures at High Pressures of Metallic Modifications of Silicon and Germanium," Science, New Series, vol. 139 no. 3556, pp. 762-764, Feb. 22, 1963. DOI: 10.1126/science.139.3556.762

Jamoneau, Aurelie, Schmitt, Jean-Hubert, and Solas, Denis, "Measurement of Texture Gradient in Heavily Cold-Drawn Pearlitic Wires," Advanced Engineering Materials, vol. 20 no. 4, pp. 1700279, Apr. 2018.

Jan, Felba, Kazimierz, Friedel, and Ryszard, Kisiel, "The Future Alternatives of Tin-Lead in PCB Assembly."

Janata, Jiri, "The Chalkboard: Work Function in Electrochemistry," Electrochemical Society Interface, vol. 25 no. 4, pp. 56-58, Winter 2016.

Jandel, Lothar, "Chrome-free coil coating primers: It's time to switch," Finishing , vol. 28 no. 1, pp. 30, 32, Jan. 2004.

Janecke, Ernst, "Die Umwandlungen der Metalle Zinn, Zink, Wismut, Kadmium, Kupfer, Silber, Blei und Antimon, bestimmt mit dem neuen elektrisch heizbaren Druckapparat," Zeitschrift fur physikalische Chemie, vol. 90 no. 3, pp. 313-339, 1915.

Janecke, Ernst, "Uber einen elektrisch heizbaren Druckapparat zur Untersuchung der Schmelz- und Umwandlungserscheinungen von Salzen, Salzgemischen, Metallem und Legierungen," Zeitschrift fur physikalische Chemie, vol. 90 no. 3, pp. 257-264, 1915.

Jang, Changsoo, Han, Bongtae, and Yoon, Samson, "Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds over Solder Reflow Process Temperature," IEEE Transactions on Components and Packaging Technologies, vol. 33 no. 4, pp. 809-818, Dec. 2010.

Jang, Changsoo, Park, Seungbae, Infantolino, Bill, Lehman, Lawrence, Morgan, Ryan, and Sengupta, Dipak, "Failure analysis of contact probe pins for SnPb and Sn applications," Microelectronics Reliability, vol. 48 no. 6, pp. 942-947, June 2008.

Jang, Changsoo, Han, Seongyoung, Ryu, Jaychul, Cho, Seungmin, and Kim, Hangyu, "Issues in Assembly Process of Next-Generation Fine-Pitch Chip-On-Flex Packages for LCD Applications," IEEE Transactions on Advanced Packaging , vol. 30 no. 1, pp. 2-10, Feb. 2007.

Jang, D. M., Yu, Jin, "Effect of alloying W in Ni(5P) metallization of solder joints," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 141-144.

Jang, Dong Min, and Yu, Jin, "Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy," Journal of Materials Research, vol. 26 no. 24, pp. 3032-3037, Dec. 28, 2011.

Jang, Dong Min, and Yu, Jin, "Tungsten alloying of the Ni(P) films and the reliability of Sn-3.5Ag/NiWP solder joints," Journal of Materials Research, vol. 26 no. 7, pp. 889-895, Apr. 14, 2011.

Jang, Guh-Yaw, and Duh, Jenq-Gong, "Elemental Redistribution and Interfacial Reaction Mechanism for the Flip Chip Sn-3.0Ag-(0.5 or 1.5)Cu Solder Bump with Al/Ni(V)/Cu Under-Bump Metallization During Aging," Journal of Electronic Materials, vol. 35 no. 11, pp. 2061-2070, Nov. 2006.

Jang, Guh-Yaw, Duh, Jenq-Gong, Takahashi, Hideyuki, Lu, Szu-Wei, and Chen, Jen-Chuan, "Influence of Cu Content on Compound Formation near the Chip Side for the Flip-Chip Sn-30.Ag-(0.5 or 1.5)Cu Solder Bump during Aging," Journal of Electronic Materials, vol. 35 no. 9, pp. 1745-1754, Sept. 2006.

Jang, Guh-Yaw, Duh, Jenq-Gong, Tsai, Su-Yueh, and Lee, Chi-Rung, "Role of Cu Contents in the Isothermal Metallurgical Reaction for the Flip Chip Sn-3.0Ag-(0.5 or 1.5)Cu Joints with Cu/Electroless Ni-P/Immersion Au Bonding Pad during Aging," Proceedings of the 2006 IEEE CPMT Conference on High Density Microsystem Design, Packaging and Component Failure Analysis , Shanghai, June 27-28, 2006, pp. 260-264.

Jang, Guh-Yaw, and Duh, Jenq-Gong, "The Effect of Intermetallic Compound Morphology on Cu Diffusion in Sn-Ag and Sn-Pb Solder Bump on the Ni/Cu Under-Bump Metallization," Journal of Electronic Materials, vol. 34 no. 1, pp. 68-79, Jan. 2005.

Jang, Guh-Yaw, Lee, Jyh-Wei, and Duh, Jenq-Gong, "The Nanoindentation Characteristics of Cu6Sn5, Cu3Sn and Ni3Sn4 Intermetallic Compounds in the Solder Bump," Journal of Electronic Materials, vol. 33 no. 10, pp. 1103-1110, Oct. 2004.

Jang, Hae-Won, Hwang, Bu-Yeon, Lee, Ki-Wook, Kim, Yoon-Mi, and Kim, Jin-Yeol, "Controlling the size of silver nanowires produced by a tetrabutylammonium dichlorobromide salt-based polyol process: Kinetics of silver crystal growth," AIP Advances, vol. 8 no. 2, pp. 025303-1-025303-, Feb. 2018.

Jang, J. W., De Silva, A. P., Lee, T. Y., Lin, J. K., and Frear, D. R., "Direct correlation between microstructure and mechanical tensile properties in Pb-free solders and eutectic SnPb solder for flip chip technology," Applied Physics Letters, vol. 79 no. 4, pp. 482-484, July 23, 2001.

Jang, J. W., Ramanathan, L. N., and Frear, D. R., "Electromigration behavior of lead-free solder flip chip bumps on NiP/Cu metallization," Journal of Applied Physics, vol. 103 no. 12, pp. 123506-1-123506-4, 2008.

Jang, J. W., Lin, J. K., and Frear, D. R., "Failure Morphology after the Drop Impact Test of the Ball Grid Array Package with Lead-Free Sn-3.8Ag-0.7Cu on Cu and Ni Under-Bump Metallurgies," Journal of Electronic Materials, vol. 36 no. 3, pp. 207-213, Mar. 2007.

Jang, J. W., Kim, P. G., Tu, K. N., and Lee, Michael, "High-temperature lead-free SnSb solders: Wetting reactions on Cu foils and phased-in Cu-Cr thin films," Journal of Materials Research, vol. 14 no. 10, pp. 3895-3900, Oct. 1999.

Jang, J. W., Frear, D. R., Lee, T. Y., and Tu, K. N., "Morphology of interfacial reaction between lead-free solders and electroless Ni-P under bump metallization," Journal of Applied Physics, vol. 88 no. 11, pp. 6359-6363, Dec. 1, 2000.

Jang, J. W., Yoo, S. J., Hwang, H. I., Yuk, S. Y., Kim, C. K., Kim, S. J., Han, J. S., and An, S. H., "New Failure Mode of Flip-Chip Solder Joints Related to the Metallization of an Organic Substrate," Journal of Electronic Materials, vol. 44 no. 10, pp. 3957-3961, Oct. 2015.

Jang, J. W., Lin, J. K., Frear, D. R., Lee, T. Y., and Tu, K. N., "Ripening-assisted void formation in the matrix of lead-free solder joints during solid-state aging," Journal of Materials Research, vol. 22 no. 4, pp. 826-830, Apr. 2007.

Jang, J. W., Ramanathan, L. N., Tang, J., and Frear, D. R., "Secondary Current Crowding Effect during Electromigration of Flip-Chip Solder Joints," Journal of Electronic Materials, vol. 37 no. 2, pp. 185-188, Feb. 2008.

Jang, Jae-Won, Suk, Kyoung-Lim, Park, Jin-Hyoung, Paik, Kyung-Wook, and Lee, Soon-Bok, "Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 4 no. 7, pp. 1144-1151, July 2014.

Jang, Jin-Wook, De Silva, Ananda P., Drye, James E., Post, Steve L., Owens, Norman L., Lin, Jong-Kai, and Frear, Darrel R., "Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Sn-3.8Ag-0.7Cu and Eutectic SnPb Solders," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 1, pp. 49-53, Jan. 2007.

Jang, Jin-Wook, Hayes, Scott, Lin, Jong-Kai, and Frear, Darrel R., "Interfacial reaction of eutectic AuSi solder with Si (100) and Si (111) surfaces," Journal of Applied Physics, vol. 95 no. 11, pp. 6077-6081, June 1, 2004.

Jang, Jin-Wook, De Silva, Ananda, Lin, Jong-Kai, and Frear, Darrel, "Mechanical Tensile Fracture Behaviors of Solid-State-Annealed Eutectic SnPb and Lead-Free Solder Flip Chip Bumps," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 680-684.

Jang, Jin-Wook, De Silva, Ananda P., Lin, Jong-Kai, and Frear, Darrel R., "Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps," Journal of Materials Research, vol. 19 no. 6, pp. 1826-1834, June 2004.

Jang, Jinwoo, Jang, Gunhee, Lee, Juyub, Cho, Yeungjung, and Cinar, Yusuf, "Fatigue life estimations of solid-state drives with dummy solder balls under vibration," International Journal of Fatigue, vol. 88, pp. 42-48, July 2016.

Jang, Joong-Soon, Kim, Kitae, Yoo, Kihoon, Kim, Kang-Dong, Kim, Jong-Min, Lee, Hyong-Rok, and Lee, Sang-Won, "Assessment of The Reliability of The Solder Joints of The Ultra-Fine-Pitch FCBGA," 2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, Chengdu, China, June 15-18, 2012, pp. 798-801.

Jang, Kyung-Woon, Park, Jin-Hyoung, Lee, Soon-Bok, and Paik, Kyung-Wook, "A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages," Microelectronics Reliability, vol. 52 no. 6, pp. 1174-1181, June 2012.

Jang, Kyung-Woon, and Paik, Kyung-Wook, "Effects of Anisotropic Conductive Film (ACF) Viscosity on ACF Fillet and Moisture-Related Reliability for Flip-Chip-On-Board (FCOB) Packages," 9th International Conference on Electronic Materials and Packaging, Daejon, Korea, Nov. 19-22, 2007, pp. xx-xx.

Jang, Kyung-Woon, and Paik, Kyung-Wook, "Effects of Anisotropic Conductive Film Viscosity on ACF Fillet Formation and Chip-On-Board Packages," IEEE Transactions on Electronics Packaging Manufacturing, vol. 32 no. 2, pp. 74-80, Apr. 2009.

Jang, Kyung-Woon, and Paik, Kyung-Wook, "Effects of Heating Rate During ACFs Curing Process on Material Properties and Thermal Cycling Reliability of Flip Chip Assembly," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1725-1730.

Jang, Kyung-Woon, and Paik, Kyung-Wook, "Effects of Heating Rate on Material Properties of Anisotropic Conductive Film (ACF) and Thermal Cycling Reliability of ACF Flip Chip Assembly," IEEE Transactions on Components and Packaging Technologies, vol. 32 no. 2, pp. 339-346, June 2009.

Jang, Kyung-Woon, Chung, Chang-Kyu, Jang, Jiyoung, Hong, Soon-Min, Park, Min-Young, Moon, Youngjun, and Park, Seungbae, "Green Manufacturing Process for Solder-less PCB Assembly using Uniform Pressure Surface Interconnector and Anisotropic Conductive Film," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1691-1696.

Jang, Kyung-Woon, Chung, Chang-Kyu, Lee, Woong-Sun, and Paik, Kyung-Wook, "Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications," Microelectronics Reliability, vol. 48 no. 7, pp. 1052-1061, July 2008.

Jang, S.-Y., Wolf, J., Ehrmann, O., Reichl, H., and Paik, K.-W., "Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study," Microsystem Technologies, vol. 7 no. 5-6, pp. 269-272. Jan. 2002.

Jang, Se-Young, and Paik, Kyung Wook, "Comparison of Electroplated Eutectic Sn/Bi and Pb/Sn Solder Bumps on Various UBM Systems," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 64-68.

Jang, Se-Young, and Paik, Kyung Wook, "Comparison of Electroplated Eutectic Bi/Sn and Pb/Sn Solder Bumps on Various UBM Systems," IEEE Transactions on Electronics Packaging Manufacturing , vol. 24 no. 4, pp. 269-274, Oct. 2001.

Jang, Se-Young, Wolf, Juergen, Ehrmann, Oswin, Gloor, Heinz, Reichl, Herbert, and Paik, Kyung-Wook, "Investigation of UBM Systems for Electroplated Sn/37Pb and Sn/3.5Ag Solder," 2001 Proceedings 51st Electronic Components & Technology Conference , Orlando, FL, May 29-June 1, 2001, pp. 950-956.

Jang, Se-Young, Wolf, Juergen, Ehrmann, Oswin, Gloor, Heinz, Reichl, Herbert, and Paik, Kyung-Wook, "Pb-Free Sn/3.5Ag Electroplating Bumping Process and Under Bump Metallization (UBM)," IEEE Transactions on Electronics Packaging Manufacturing, vol. 25 no. 3, pp. 193-202, July 2002.

Jang, Se-Young, Wolf, Juergen, Kwon, Woon-Seong, and Paik, Kyung-Wook, "UBM (Under Bump Metallization) Study for Pb-Free Electroplating Bumping: Interface Reaction and Electromigration," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1213-1220.

Jang, Se-Young, Wolf, Juergen, and Paik, Kyung-Wook, "Under Bump Metallurgy Study for Pb-Free Bumping," Journal of Electronic Materials, vol. 31 no. 5, pp. 478-487, May 2002.

Jang, Tae-Young, Yun, Won-Su, Kim, Soo-Hyun, and Kim, Kyung-Soo, "Using Ultrasonic Energy for Reducing ACF Bonding Process Time," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium , Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Jang, Wei-Luen, Wang, Tai-Siang, Lai, Yen-Fen, Lin, Kwang-Lung, and Lai, Yi-Shao, "The performance and fracture mechanism of solder joints under mechanical reliability test," Microelectronics Reliability, vol. xx no. x, pp. xx-xx, xxxx.

Jang, Yong-Chul, Townsend, Timothy, and Yoon, Hyunmyung, "Evaluation of Metal Leaching from End-of-Life Laptop Computers Using the TCLP and Other Standard Leaching Tests," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 309-314.

Jang, Yong-Chul, and Townsend, Timothy G., "Leaching of Lead from Computer Printed Wire Boards and Cathode Ray Tubes by Municipal Solid Waste Landfill Leachates," Environmental Science & Technology, vol. 37 no. 20, pp. 4778-4784, Oct. 15, 2003.

Jang, Yong-Chul, and Kim, Mincheol, "Management of used & end-of-life mobile phones in Korea: A review," Resources, Conservation and Recycling, vol. 55 no. 1, pp. 11-19, Nov. 2010.

Janik, E., Dluzewski, P., Kret, S., Presz, A., Kirmse, H., Neumann, W., Zaleszczyk, W., Baczewski, L. T., Petroutchik, A., Dynowska, E., Sadowski, J., Caliebe, W., Karczewski, G., and Wojtowicz, T., "Catalytic growth of ZnTe nanowires by molecular beam epitaxy: structural studies," Nanotechnology, vol. 18 no. 47, pp. 475606-1-475606-8, Nov. 28, 2007.

Janin, Marion, Ghilane, Jalal, and Lacroix, Jean-Christophe, "Scanning electrochemical microscopy for the fabrication of copper nanowires: Atomic contacts with quantized conductance, and molecular adsorption effect," Electrochimica Acta, vol. 83, pp. 7-12, Nov, 30, 2012.

Jankowski, K., and Wymyslowski, A., "Creep and Fatigue as Main Degradation Phenomena in Reliability of Solder Joints," 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Ghent, Belgium, Apr. 7-9, 2014, pp. xx-xx.

Jankowski, K., Swierczynski, R., Urbanski, K., Wymyslowski, A., Chicot, D., and Dudek, R., "Maintenance Of Solder Joints On The Strength Of Simultaneously Acting Creep And Fatigue Phenomena By Using Microindentation Technique," 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Wroclaw, Poland, Apr. 14-17, 2013, pp. xx-xx.

Jankowski, Krystian, and Wymyslowski, Artur, "Acceleration of Life Prediction of Solder Joints Using Multi-Failure Criteria," Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, Dresden, Germany, May 7-11, 2014, pp. 273-277.

Jankowski, Krystian, Wymyslowski, Artur, and Chicot, Didier, "Combined loading and failure analysis of lead-free solder joints due to creep and fatigue phenomena," Soldering & Surface Mount Technology, vol. 26 no. 1, pp. 22-26, 2014.

Jankowski, Krystian, Wymyslowski, Artur, and Chicot, Didier, "Experimental System for Analysing The Combined Loading And Failure Modes Of Solder Joints In Electronic Packaging," 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Lisbon, Portugal, Apr. 16-18, 2012, pp. xx-xx.

Jannoun, Mayssam, Aoues, Younes, Pagnacco, Emmanuel, Pougnet, Philippe, and El-Ham, Abdelkhalak, "Probabilistic fatigue damage estimation of embedded electronic solder joints under random vibration," Microelectronics Reliability, vol. 78, pp. 249-257, Nov. 2017.

Jano, Rajmond, and Fodor, Alexandra, "Soldering Profile Optimization for Through-Hole and Surface Mounted Ceramic Capacitors," Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, Dresden, Germany, May 7-11, 2014, pp. 170-175.

Janoczki, Mihaly, and Jakab, Laszlo, "X-ray solder alloy volume measurement (XSVM) in pin-in-paste technology (PIP)," Soldering & Surface Mount Technology, vol. 22 no. 1, pp. 26-40, 2010.

Jansen, K. M. B., Qian, C., Ernst, L. J., Bohm, C., Kessler, A., Preu, H., and Stecher, M., "Characterization and modeling of molding compound properties during cure," International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, Freiburg, Germany, Apr. 20-23, 2008, pp. xx-xx.

Jansen, Leigh, "Cleaning Up after Pb-Free," Circuits Assembly, vol. 17 no. 3, pp. 30-31, 33-34, Mar. 2006.

Jansson, Kristofer, Lind, Erik, and Wernersson, Lars-Erik, "Performance Evaluation of III-V Nanowire Transistors," IEEE Transactions on Electron Devices, vol. 59 no. 9, pp. 2375-2382, Sept. 2012.

Jantzen, T., and Spencer, P. J., "Thermodynamic assessments of the Cu-Pb-Zn and Cu-Sn-Zn systems," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 22 no. 3, pp. 417-434, Sept. 1998.

Jao, Chien-Chung, Yen, Yee-Wen, Lin, Chung-Yung, and Lee, Chiapyng, "Phase equilibria of the Sn-Zn-Ag system and interfacial reactions in Sn-Zn/Ag couples," Intermetallics, vol. 16 no. 3, pp. 463-469, Mar. 2008.

Jao, Chien-Chung, Yen, Yee-Wen, Zhang, Shu-Hao, Lin, Chung-Yung, and Lee, Chiapyng, "Study of interfacial reactions between Sn-Ag-Cu alloys and Au substrate," International Journal of Materials Research, vol. 98 no. 6, pp. 496-500, June 2007.

Jaradat, Y., Chen, J., Owens, J. E., Yin, L., Qasaimeh, A., Wentlent, L., Arfaei, B., and Borgesen, P., "Effects of Variable Amplitude Loading on Lead-Free Solder Joint Propoerties and Damage Accumulation," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 740-744.

Jaradat, Y., Owens, J. E., Qasaimeh, A., Arfaei, B., Lin, L., Anselm, M., and Borgesen, P., "On the Fatigue Life of Microelectronic Interconnects in Cycling With Varying Amplitudes," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 22-28.

Jaradat, Younis, Qasaimeh, Awni, Kondos, Pericles, Arfaei, Babak, and Borgesen, Peter, "On the Evolution of the Properties and Microstructure of Backward Compatible Solder Joints during Cycling and Aging," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 722-730.

Jardine, P. M., Fendorf, S. E., Mayes, M. A., Larsen, I. L., Brooks, S. C., and Bailey, W. B., "Fate and Transport of Hexavalent Chromium in Undisturbed Heterogeneous Soil," Environmental Science & Technology, vol. 33 no. 17, pp. 2939-2944, Sept. 1, 1999.

Jariwala, Bhakti, and Shah, Dimple V., "Structural defects and microindentation analysis of zone melted Bi2Te3-xSex whiskers," Journal of Crystal Growth, vol. 352 no. 1, pp. 143-146, Aug. 1, 2012.

Jarl, Magnus, and Overstam, Henrik, "Simulation of temperatures in the wiredrawing process," Wire Journal International, vol. 41 no. 2, pp. 150-155, Feb. 2008.

Jaros, M., and Vinsome, P. K. W., "Covalency in silicon, germanium and grey tin," Journal of Physics C: Solid State Physics, ser. 2 vol. 2, pp. 2373-2379, 1969.

Jaros, M., and Kostecky, P., "Pseudopotential Impurity Theory and Covalent Bonding in Semiconductors," Journal of Physics and Chemistry of Solids, vol. 30 no. 3, pp. 497-502, Mar. 1969.

Jasli, Nor Aishah, Hamid, Hamidi Abd, and Mayappan, Ramani, "Effect of Ag Addition on the Intermetallic Compound and Joint Strength between Sn-Zn-Bi Lead Free Solder and Copper Substrate," 2012 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Nov. 6-8, 2012, pp. xx-xx.

Jay, Roger, and Kwong, Alfred, "Dealing with the "Black Pad Defect" - A Failure Analyst's Perspective," 2001 SMTA International Conference Proceedings, Chicago, IL, Sept. 30-Oct. 4, 2001, pp. xx-xx.

Jayaganthan, R., Mohankumar, K., Sekhar, V. N., Tay, A. A. O., and Kripesh, V., "Fractal analysis of intermetallic compounds in Sn-Ag, Sn-Ag-Bi, and Sn-Ag-Cu diffusion couples," Materials Letters, vol. 60 no. 8, pp. 1089-1094, Apr. 2006.

Jayaraman, A., Klement Jr., W., and Kennedy, G. C., "Melting and Polymorphism at High Pressures in Some Group IV Elements and III-V Compounds with the Diamond/Zincblende Structure," Physical Review, Series 2, vol. 130 no. 2, pp. 540-547, Apr. 15, 1963.

Jayaraman, A., Newton, R. C., and Kennedy, G. C., "Melting and Polymorphism of Indium Antimonide at High Pressure," Nature , vol. 191 no. 4795, pp. 1288-1290, Sept. 23, 1961. https://doi.org/10.1038/1911288a0

Jedras, Jeff, "Canadian OEMs get the lead out," itbusiness.ca, Mar. 7, 2005.

Jedynak, Leo, "Whisker Growth in High-Voltage High-Vacuum Gaps," Journal of Applied Physics, vol. 36, pp. 2587-2589, 1965.

Jee, Y. K., Sohn, Y. C., Yu, Jin, Lee, Taek-Yeong, Seo, Ho-Seong, Kim, Ki-Hyun, Ahn, June-Hyeon, and Lee, Young-Min, "A comparative study of ENIG and Cu OSP surface finishes on the mechanical reliability of Sn-3.0Ag-0.5Cu and Sn-36.8Pb-0.4Ag Solders," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Jee, Y. K., Ko, Y. H., Yu, Jin, Lee, T. Y., Cho, M. K., and Lee, H. M., "Comparative Study of Drop Reliability between Cu and Ni(P)/Au UBM with Sn-3.5Ag-xZn Solders," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 957-961.

Jee, Y. K., Ko, Y. H., and Yu, Jin, "Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad," Journal of Materials Research, vol. 22 no. 7, pp. 1879-1887, July 2007.

Jee, Y. K., Yu, Jin, and Ko, Y. H., "Effects of Zn addition on the drop reliability of Sn-3.5Ag-xZn/Ni(P) solder joints," Journal of Materials Research, vol. 22 no. 10, pp. 2776-2784, Oct. 2007.

Jee, Y. K., and Yu, Jin, "Interfacial Reactions and Joint Strengths of Sn-xZn Solders with Immersion Ag UBM," Journal of Electronic Materials, vol. 39 no. 10, pp. 2286-2291, Oct. 2010.

Jee, Y. K., Yu, J., Park, K. W., and Oh, T. S., "Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package," Journal of Electronic Materials, vol. 38 no. 5, pp. 685-690, May 2009.

Jee, Young-Kun, Xia, Yang-hua, Yu, Jin, Kang, Hyun-Woo, and Lee, Taek-Young, "Effect of Al Addition in Sn-Ag Solder on the Interfacial Reactions with Cu and ENIG Metallizations," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 491-494.

Jee, Young Kun, Kim, Jong Yeon, Yu, Jin, and Lee, Taek Yeong, "Interfacial reactions and drop reliabilities of lead-free solder joints with electrolytic Cu metallizations.," 9th International Conference on Electronic Materials and Packaging, Daejon, Korea, Nov. 19-22, 2007, pp. xx-xx.

Jeffcoate, Carol S., Isaacs, Hugh S., Aldykiewicz Jr., Antonio J., and Ryan, Mary P., "Chromate in Conversion Coatings: A XANES Study of Its Concentration and Mobility," Journal of the Electrochemical Society, vol. 147 no. 2, pp. 540-547, Feb. 2000.

Jeffers, Basil S., "Capacitor Tin Whisker White Paper - Is It Tinned Yet?," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies , San Jose, CA, Apr. 23-24, 2003, pp. 220-229.

Jelinek, Len, "RoHS laws forcing companies to get the lead out," emsnow, Feb. 1, 2007.

Jellesen, Morten S., and Moller, Per, "The Electrochemical Deposition of Tin-Nickel Alloys and the Corrosion Properties of the Coating," Plating and Surface Finishing, vol. 92 no. 10, pp. 36-41, Oct. 2005.

Jellison, J. L., Johnson, D. R., and Hosking, F. M., "Statistical Interpretation of Meniscograph Solderability Tests," 1975 International Microelectronic Symposium, Orlando, FL, Oct. 27-29, 1975, pp. 184-192.

Jen, Ming-Hwa R., Liu, Lee-Cheng, and Lai, Yi-Shao, "Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints," Microelectronics Reliability, vol. 49 no. 7, pp. 734-745, July 2009.

Jen, Ming-Hwa R., Liu, Lee-Cheng, and Lai, Yi-Shao, "Electromigration Test on Void Formation and Failure Mechanism of FCBGA Lead-Free Solder Joints," IEEE Transactions on Components and Packaging Technologies, vol. 32 no. 1, pp. 79-88, Mar. 2009.

Jen, Ming-Hwa R., Liu, Lee-Cheng, and Wu, Jenq-Dah, "Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test," Journal of Electronic Packaging, vol. 127 no. 4, pp. 446-451, Dec. 2005.

Jendrzejczyk-Handzlik, Dominika, Rechchach, Meryem, Gierlotka, Wojciech, Ipser, Herbert, and Flandorfer, Hans, "Enthalpies of mixing of liquid systems for lead-free soldering: Cu-Sb-Sn system," Thermochimica Acta, vol. 512 no. 1-2, pp. 217-224, Jan. 10, 2011.

Jendrzejczyk-Handzlik, Dominika, Gierlotka, Wojciech, and Fitzner, Krzysztof, "Thermodynamic properties of liquid copper-antimony-tin alloys determined from e.m.f. measurements," International Journal of Materials Research , vol. 103 no. 8, pp. 1007-1014, Aug. 2012.

Jendrzejczyk-Handzlik, Dominika, Gierlotka, Wojciech, and Fitzner, Krzysztof, "Thermodynamic properties of liquid silver-indium-tin alloys determined from emf measurements," International Journal of Materials Research, vol. 99 no. 11, pp. 1213-1221, Nov. 2008.

Jenichen, B., Hilse, M., Herfort, J., and Trampert, A., "Facetted growth of Fe3Si shells around GaAs nanowires on Si(111)," Journal of Crystal Growth, vol. 427, pp. 21-23, Oct. 1, 2015.

Jenichen, B., Hilse, M., Herfort, J., and Trampert, A., "Real structure of lattice matched GaAs-Fe3Si core-shell nanowires," Journal of Crystal Growth, vol. 410, pp. 1-6, Jan. 15, 2015.

Jennings, Jeffrey M., Smith, Carlyn, and Kreuzpaintner, Joe, "Component and Printed Wiring Board Finish Effects on QFN Solder Joint Formation," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 753-760.

Jenq, S. T., Chang, Hsuan-Hu, Lai, Yi-Shao, and Tsai, Tsung-Yueh, "High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys," Microelectronics Reliability , vol. 49 no. 3, pp. 310-317, Mar. 2009.

Jenq, Syh-Tsang, Chiu, Yuen-Sheng, Lin, Ren-Jey, and Lai, Yi-Shao, "The stress-strain relationship of Sn63Pb37 and SAC305 solder materials at elevated temperature condition," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Jensen, David, "Lead-Free Avionics?," Aviation Today, vol. xx no. xx, pp. xx-xx.

Jensen, Tim, Neoh, Sunny, and Murling, Adam, "Reinforced Solder Preforms For High-Reliability And Low Voiding," Pan Pacific Symposium 2017 Proceedings, Koloa, HI, Feb. 6-9, 2017, pp. xx-xx.

Jensen, Tim, "Solder Trends Affecting Medical Electronics Assembly," Medical Electronics Symposium 2009 Proceedings, Tempe, AZ, Sept. 16-17, 2009, pp. xx-xx.

Jensen, Tim, "The Graping Phenomenon: Improving Pb-Free Solder Coalescence through Process Optimization and Materials," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S02:02.

Jensen, Timothy, and Briggs, Edward, "Alloy and Process Optimization for Low Ag Solders," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 882-888.

Jensen, Timothy, Lasky, Ronald, and Samiappan, Sehar, "Alternate Alloys to SAC305 for Pb-Free SMT Assembly," South East Asia Technical Training Conference on Electronics Assembly Technologies 2012 Proceedings, Penang, Malaysia, Apr. 18-20, 2012, pp. xx-xx.

Jensen, Timothy, and Lasky, Ron, "Challenges toward Implementing a Halogen-Free PCB Assembly Process," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Jensen, Timothy, and Lasky, Ron, "Challenges toward implementing a halogen free PCB assembly process," EMasia, May 2009.

Jensen, Timothy, and Lasky, Ron, "Challenges toward Implementing a Halogen-Free PCB Assembly Process," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S31_01-1-S31_01-5.

Jensen, Timothy, Hartnett, Amanda, and Lasky, Ronald C., "Implementation Challenges for Halogen-free Solder," Surface Mount Technology (SMT), vol. 23 no. 1, pp. 7-8,10, Jan.-Feb. 2009.

Jensen, Timothy, and Hartnett, Amanda, "Halogen Free Solder Pastes and Fluxes: Implementation Challenges," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 508-511.

Jensen, Timothy, Lasky, Ronald, and Samiappan, Sehar, "Material and Process Optimization for HiP Defect Elimination," South East Asia Technical Training Conference on Electronics Assembly Technologies 2012 Proceedings, Penang, Malaysia, Apr. 18-20, 2012, pp. xx-xx.

Jensen, Timothy, Lasky, Ronald, and Samiappan, Sehar, "Material and Process Optimization for HIP Defect Elimination," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 668-673.

Jensen, Timothy, Lasky, Ronald, and Samiappan, Sehar, "Material and process optimization for HIP defect elimination," Global SMT and Packaging, vol. 13 no. 2, pp. 10-15, Feb. 2013.

Jensen, Timothy, "Solder Paste Evaluation Techniques to Simplify the Transition to Pb-Free," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 735-739.

Jensen, Timothy, Lasky, Ronald, and Hartnett, Amanda, "Soldering Challenges in a Halogen-Free PCB Assembly Process," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

Jensen, Timothy, and Lasky, Ronald C., "STEP 3: Solder Materials," Surface Mount Technology (SMT), vol. 20 no. 3, pp. xx-xx, Mar. 2006.

Jeon, Ae-Jeong, Kim, Seong-Jun, Lee, Sang-Hoon, and Kang, Chung-Yun, "Effect of Indium Content on the Melting Point, Dross, and Oxidation Characteristics of Sn-2Ag-3Bi-xIn Solders," Journal of Electronic Packaging, vol. 135 no. 2, pp. 021006-1-021006-5, June 2013.

Jeon, Sang Ho, Yang, Yeong Gyeong, Kim, Sun Young, Ahn, Kyu Yul, Bae, Sang Jun, and Chu, Yong Chul, "Materials For High Performances Solder Joint Reliability," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 16-18, 2012, pp. xx-xx.

Jeon, Tae-In, Kim, Keun-Ju, Kang, Chul, Maeng, In Hee, Son, Joo-Hiuk, An, Kay Hyeok, Lee, Ji Yeong, and Lee, Young Hee, "Optical and electrical properties of preferentially anisotropic single-walled carbon-nanotube films in terahertz region," Journal of Applied Physics , vol. 95 no. 10, pp. 5736-5740, May 15, 2004.

Jeon, Tae-In, Kim, Keun-Ju, Kang, Chul, Oh, Seung-Jae, Son, Joo-Hiuk, An, Kay Hyeok, Bae, Dong Jae, and Lee, Young Hee, "Terahertz conductivity of anisotropic single walled carbon nanotube films," Applied Physics Letters, vol. 80 no. 18, pp. 3403-3405, May 6, 2002.

Jeon, Young-Doo, Nieland, Sabine, Ostmann, Andreas, Reichl, Herbert, and Paik, Kyung-Wook, "A Study on Interfacial Reactions between Electroless Ni-P Under Bump Metallization and 95.5Sn-4.0Ag-0.5Cu Alloy," Journal of Electronic Materials, vol. 32 no. 6, pp. 548-557, June 2003.

Jeon, Young-Doo, Ostmann, Andreas, Reichl, Herbert, and Paik, Kyung-Wook, "Comparison of Interfacial Reactions and Reliabilifies of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu Solder Bumps on Electroless Ni-P UBMs," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1203-1208.

Jeon, Young-doo, Paik, Kyung-Wook, Ostmann, Adreas, and Reichl, Herbert, "Effects of Cu Contents in Pb-Free Solder Alloys on Interfacial Reactions and Bump Reliability of Pb-Free Solder Bumps on Electroless Ni-P Under-Bump Metallurgy," Journal of Electronic Materials, vol. 34 no. 1, pp. 80-90, Jan. 2005.

Jeon, Young-Doo, Paik, Kyung-Wook, Bok, Kyung-Soon, Choi, Woo-Suk, and Cho, Chul-Lae, "Studies of Electroless Nickel Under Bump Metallurgy_Solder Interfacial Reactions and Their Effects on Flip Chip Solder Joint Reliability," Journal of Electronic Materials, vol. 31 no. 5, pp. 520-528, May 2002.

Jeon, Young-Doo, Paik, Kyung-Wook, Bok, Kyoung-Soon, Choi, Woo-Suk, and Cho, Chul-Lae, "Studies on Ni-Sn Intermetallic Compound and P-rich Ni Layer at the Electroless Nickel UBM-Solder Interface and Their Effects on Flip Chip Solder Joint Reliability," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 1326-1332.

Jeon, Young-Doo, Nieland, Sabine, Ostmann, Adreas, Reichl, Herbert, and Paik, Kyung-Wook, "Studies on the Interfacial Reactions between Electroless Ni UBM and 95.5Sn-4.0Ag-0.5Cu Alloy," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 740-746.

Jeon, Young-Doo, Lee, Yong-Bin, and Choi, Young-Sik, "Thin Electroless Cu/OSP on Electroless Ni as a Novel Surface Finish for Flip Chip Solder Joints," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 119-124.

Jeong, Da-Bok, Lim, Jae-Hong, Lee, Joun, Park, Hosik, Zhang, Miluo, Lee, Young-In, Choa, Yong-Ho, and Myung, Nosang V., "Template-free synthesis of vertically oriented tellurium nanowires via a galvanic displacement reaction," Electrochimica Acta, vol. 111, pp. 200-205, Nov. 30, 2013, https://doi.org/10.1016/j.electacta.2013.07.228

Jeong, Haksan, Lee, Choong-Jae, Min, Kyung Deuk, Son, Jae-Yeol, and Jung, Seung-Boo, "Mechanical Properties of Cu-Core Solder Balls with ENEPIG Surface Finish," Journal of Electronic Materials, vol. 49 no. 10, pp. 6073-6079, Oct. 2020.

Jeong, Hyeonho, Lee, Junghyung, Bok, Cheolkyu, Lee, Seok-Hee, and Yoo, Seunghyup, "Fabrication of Vertical Silicon Nanotube Array Using Spacer Patterning Technique and Metal-Assisted Chemical Etching," IEEE Transactions on Nanotechnology, vol. 16 no. 1, pp. 130-134, Jan. 2017.

Jeong, Jin Hwan, Park, Si Jung, An, Su Bin, and Choi, Doo Jin, "Vapor-solid growth of Te-rich SbTe nanowires on a template of nano-size trenches," Journal of Crystal Growth, vol. 410, pp. 47-52, Jan. 15, 2015.

Jeong, Jin Sik, Yim, Byung-Seung, Oh, Seung Hoon, Song, Hojin, Lee, Byung Hun, and Kim, Jong-Min, "Properties Investigation on Chip-on-Film (COF) Thermosonic Bonding Using Anisotropic Conductive Films (ACFs)," Materials Transactions, vol. 53 no. 12, pp. 2097-2103, 2012.

Jeong, Myeong-Hyeok, Kim, Jae-Won, Kwak, Byung-Hyun, and Park, Young-Bae, "Effects of annealing and current stressing on the intermetallic compounds growth kinetics of Cu/thin Sn/Cu bump," Microelectronic Engineering , vol. xx no. xx, pp. xx-xx, xxxx.

Jeong, Myeong-Hyeok, Lim, Gi-Tae, Kim, Byoung-Joon, Lee, Ki-Wook, Kim, Jae-Dong, Joo, Young-Chang, and Park, Young-Bae, "Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps," Journal of Electronic Materials, vol. 39 no. 11, pp. 2368-2374, Nov. 2010.

Jeong, S. W., Kim, J. H., and Lee, H. M., "Thermodynamic Issues of Lead-Free Soldering in Electronic Packaging," Materials Science Forum, vol. 426-432 part 5, pp. 4081-4086. 2003.

Jeong, Sang Won, Kim, Jong Hoon, and Lee, Hyuck Mo, "Effect of Cooling Rate on Growth of the Intermetallic Compound and Fracture Mode of Near-Eutectic Sn-Ag-Cu/Cu Pad: Before and After Aging," Journal of Electronic Materials, vol. 33 no. 12, pp. 1530-1544, Dec. 2004.

Jeong, Seokwon, Jang, Jin-Wook, Yoo, Sejin, Park, Jinduck, Cho, Sungil, Han, Junsoo, and An, Sangho, "Metallurgical behaviors of lead-free solder alloys with respect to Ag content in a ball grid array package around melting temperatures," Journal of Materials Science: Materials in Electronics, vol. 28 no. 22, pp. 17038-17043, Nov. 2017.

Jeong, Seongcheol, Sato, Yuki, and Miura, Hideo, "Mechanical properties of intermetallic compounds formed at the interface between a tin bump and an electroplated copper thin film," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 149-152.

Jeong, Seyoung, Lee, Sung-Ki, Kim, Namseog, Yoshikuni, Nakadaira, Choi, Heekook, and Oh, Seyong, "Mitigation of Whisker hy Reflow in Matte Sn Finished Alloy42 Lead Frame Package," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Jeong, So-Eun, Jung, Seung-Boo, and Yoon, Jeong-Won, "A Study of the Growth Rate of Cu-Sn Intermetallic Compounds for Transient Liquid Phase Bonding during Isothermal Aging," 2018 IEEE 20th Electronics Packaging Technology Conference, Singapore, Dec. 4-7, 2018, pp. 225-228.

Jeong, So-Eun, Jung, Seung-Boo, and Yoon, Jeong-Won, "Fast formation of Cu-Sn intermetallic joints using pre-annealed Sn/Cu/Sn composite preform for high-temperature bonding applications," Thin Solid Films, vol. 698, pp. 137873-1-137873-8, Mar. 31, 2020.

Jeong, So-Eun, Jung, Seung-Boo, and Yoon, Jeong-Won, "Fast formation of Ni-Sn intermetallic joints using Ni-Sn paste for high-temperature bonding applications," Journal of Materials Science: Materials in Electronics, vol. 31 no. 18, pp. 15048-15060, Sept. 2020.

Jeong, Woo-Ju, Nishikawa, Hiroshi, Gotoh, Hideyuki, and Takemoto, Tadashi, "Effect of Solvent Evaporation and Shrink on Conductivity of Conductive Adhesive," Materials Transactions, vol. 46 no. 3, pp. 704-708, Mar. 2005.

Jeong, Woo-Ju, Nishikawa, Hiroshi, Itou, Daisuke, and Takemoto, Tadashi, "Electrical Characteristics of a New Class of Conductive Adhesive," Materials Transactions, vol. 46 no. 10, pp. 2276-2281, 2005.

Jeppsson, Mattias, Dick, Kimberly A., Nilsson, Henrik A., Skold, Niklas, Wagner, Jakob B., Caroff, Philippe, and Wernersson, Lars-Erik, "Characterization of GaSb nanowires grown by MOVPE," Journal of Crystal Growth, vol. 310 no. 23, pp. 5119-5122, Nov. 15, 2008.

Jeppsson, Mattias, Dick, Kimberly A., Wagner, Jakob B., Caroff, Philippe, Deppert, Knut, Samuelson, Lars, and Wernersson, Lars-Erik, "GaAs/GaSb nanowire heterostructures grown by MOVPE," Journal of Crystal Growth, vol. 310 no. 18, pp. 4115-4121, Aug. 15, 2008.

Jessen, Jeremy, "Lead Free Solder and Potential Effect on X-ray Immaging," Proceedings of the Technical Program NEPCON West 2000, Volume 2, Anaheim, CA, Feb. 27-Mar. 2, 2000, pp. 1094-1098.

Jesudoss, Pio, Chen, Wenbin, Mathewson, Alan, Wright, William M. D., McCarthy, Kevin G., and Stam, Frank, "Electrical Characterization of Anisotropic Conductive Adhesive Based Flip Chip for a Direct Access Sensor," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 369-374.

Jesudoss, Pio, Mathewson, Alan, Wright, William, and Stam, Frank, "Evaluation of Chip-to-Board Interconnection Using Variable Aspect Ratio Contact Pad Areas," Proceedings of 2008 26th International Conference on Microelectronics, Nis, Serbia, May 11-14, 2008, pp. 565-568.

Jha, Manis K., Lee, Jae-chun, Kumari, Archana, Choubey, Pankaj K., Kumar, Vinay, and Jeong, Jinki, "Pressure Leaching of Metals from Waste Printed Circuit Boards using Sulfuric Acid," JOM, vol. 63 no. 8, pp. 29-32, Aug. 2011.

Ji, Hongjun, Ma, Yuyou, Li, Mingyu, and Wang, Chunqing, "Effect of the Silver Content of SnAgCu Solder on the Interfacial Reaction and on the Reliability of Angle Joints Fabricated by Laser-Jet Soldering," Journal of Electronic Materials, vol. 44 no. 2, pp. 733-743, Feb. 2015.

Ji, Hongjun, Wang, Qiang, Li, Mingyu, and Wang, Chunqing, "Effects of ultrasonic irradiation and cooling rate on the solidification microstructure of Sn-3.0Ag-0.5Cu alloy," Journal of Materials Processing Technology, vol. 214 no. 1, pp. 13-20, Jan. 2014.

Ji, Hongjun, Wang, Qiang, and Li, Mingyu, "Effects of Ultrasonic Vibration on Undercooling and Microstructures of SAC305 Alloy," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 285-288.

Ji, Hongjun, Wang, Qiang, and Li, Mingyu, "Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering," Journal of Electronic Materials, vol. 45 no. 1, pp. 88-97, Jan. 2016.

Ji, Hongjun, Wang, Jiao, and Li, Mingyu, "Microstructure and reliability of hybrid interconnects by Au stud bump with Sn-0.7Cu solder for flip chip power device packaging," Microelectronics Reliability, vol. 66, pp. 134-142, Nov. 2016.

Ji, Hongjun, Qiao, Yunfei, and Li, Mingyu, "Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn-0.7Cu solder for high temperature packaging application," Scripta Materialia, vol. 110, pp. 19-23, Jan. 1, 2016.

Ji, Hongjun, Wang, Qiang, Li, Mingyu, and Wang, Chunqing, "Ultrafine-Grain and Isotropic Cu/SAC305/Cu Solder Interconnects Fabricated by High-Intensity Ultrasound-Assisted Solidification," Journal of Electronic Materials, vol. 43 no. 7, pp. 2467-2478, July 2014.

Ji, Hongjun, Qiao, Yunfei, and Li, Mingyu, "Ultrasonic-assisted soldering of Sn-based alloys during die bonding for high-temperature application," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 564-567.

Ji, Hongjun, Li, Mingyu, and Qiao, Yunfei, "Ultrasonic-assisted Soldering of Sn-based Solder Alloys to Form Intermetallic Interconnects for High Temperature Application," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 1222-1227.

Ji, Hongjun, Li, Minggang, and Li, Mingyu, "Ultrasonic-assisted soldering of Sn/Ni composite solder during die bonding for high-temperature application," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 295-300.

Ji, Qing, Zhao, Renzhe, Huang, Qiaohong, and Zhu, Pukun, "Underfills for Lead-Free and Low-K Flip Chip Packages," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1830-1835.

Ji, Xiaoliang, An, Rong, Ma, Fei, Hu, Jiawei, and Wang, Chunqing, "Unique buoyancy-force-based kinetics determination of beta to alpha phase transformation in bulk tin plates," Materials & Design, vol. 190, 108550-1-108550-8, May 2020, https://doi.org/10.1016/j.matdes.2020.108550

Jia, Changchao, Yang, Ping, and Zhang, Aiyu, "Glycerol and ethylene glycol co-mediated synthesis of uniform multiple crystalline silver nanowires," Materials Chemistry and Physics, vol. 143 no. 2, pp. 794-800, Jan. 15, 2014.

Jia, Chong, Zhang, Bei, Liu, Weifeng, Jin, Chuangui, Yao, Lianzeng, Cai, Weili, and Li, Xiaoguang, "Single crystal Ag7Te4 nanowire arrays prepared by DC electrodeposition from aqueous solution," Journal of Crystal Growth, vol. 285 no. 4, pp. 527-533, Dec. 15, 2005.

Jia, Guobin, Gawlik, Annett, Bergmann, Joachim, Eisenhawer, Bjorn, Schonherr, Sven, Andra, Gudrun, and Falk, Fritz, "Silicon Nanowire Solar Cells With Radial p-n Heterojunction on Crystalline Silicon Thin Films: Light Trapping Properties," IEEE Journal of Photovoltaics, vol. 4 no. 1, pp. 28-32, Jan. 2014.

Jia, Keming, and Wang, Lifeng, "Effect of Assembly Sequence on Shear Behavior of Solder Joints in BGA under Board-level Structure," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 98-102.

Jia, Keming, Wang, Lifeng, Liu, Yingjie, Dang, Guangyue, and Liu, Haitao, "The Effect of Rare Earth Elements on the Shear Behavior of BGA Solder Joints under Board-level," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 679-682.

Jia, Lei, Ding, Han, Sheng, Xinjun, and Xie, Bin, "Evaluation of A Double-Layer Anisotropic Conductive film (ACF) for Fine Pitch Chip-on-Glass (COG) Interconnection," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Jian, Minghong, Wei, Xin, Hamasha, Sa'd, Suhling, Jeff, and Lall, Pradeep, "Effect of Varying Amplitude Cycling on SAC-Bi Solder Joint Fatigue," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 1017-1023.

Jian-guang, Yang, Jie, Lei, Si-yao, Peng, Yuan-lu, Lv, and Wei-qiang, Shi, "A new membrane electro-deposition based process for tin recovery from waste printed circuit boards," Journal of Hazardous Materials, vol. 304, pp. 409-416, Mar. 5, 2016.

Jianfeng, Zhou, Min, Han, Minda, Liu, Fengqi, Song, Jianguo, Wan, Yanfeng, Chen, and Guanghou, Wang, "A growth mechanism of Si nanowires synthesized by gas condensation of SiO without any catalyst," Journal of Crystal Growth, vol. 269 no. 2-4, pp. 207-212, Sept. 1, 2004.

Jiang, B., and Xian, A.-P., "Discontinuous growth of tin whiskers," Philosophical Magazine Letters , vol. 86 no. 8, pp. 521-527, Aug. 1, 2006.

Jiang, B., and Xian, A.-P., "Spontaneous growth of tin whiskers on tin-rare-earth alloys," Philosophical Magazine Letters, vol. 87 no. 9, pp. 657-662, Sept. 2007.

Jiang, Bo, and Xian, Ai-Ping, "Observations of ribbon-like whiskers on tin finish surface," Journal of Materials Science: Materials in Electronics, vol. 18 no. 5, pp. 513-518, May 2007.

Jiang, Bo, and Xian, Ai-Ping, "Tin Whisker Growth under Cycling Current Pulse," Proceedings of the 2006 IEEE CPMT Conference on High Density Microsystem Design, Packaging and Component Failure Analysis, Shanghai, June 27-28, 2006, pp. 280-284.

Jiang, Bo, and Xian, Ai-Ping, "Whisker growth on tin finishes of different electrolytes," Microelectronics Reliability, vol. 48 no. 1, pp. 105-110, Jan. 2008. https://doi.org/10.1016/j.microrel.2007.02.002

Jiang, Chengrong, Guo, Bingfeng, Ma, Haoran, Kunwar, Anil, Meng, Zhixian, and Ma, Haitao, "The Study of the Growth Behavior of Cu6Sn5 at the Sn/Cu Interface during the Heating Preservation Stage," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 327-330.

Jiang, D. P., Yao, Z. X., Yin, L. M., Wang, G., Li, D., and Tian, X. K., "Effect of minor Ag and Cu additions on melting characteristics, wettability and microstructures of Sn58Bi solder," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1098-1101.

Jiang, Don-Son, Tzeng, Yuan Lin, Wang, Yu-Po, and Hsiao, C.S., "Board Level Drop Test and Simulation of CSP for Handheld Application," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Jiang, Don-Son, Hung, Joe, Wang, Yu-Po, and Hsiao, C. S., "Effect of Solder Composition and Substrate Surface Finish on Board Level Drop Test Reliability," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B, San Francisco, CA, July 17-22, 2005, pp. 1109-1113.

Jiang, Han, Robertson, Stuart, Zhou, Zhaoxia, and Liu, Changqing, "Cu-Cu Bonding with Cu Nanowire Arrays for Electronics Integration," 2020 IEEE 8th Electronics System-Integration Technology Conference, Tonsberg, Norway, Sept. 15-18, 2020, pp. xx-xx.

Jiang, Hongjin, Moon, Kyoung-Sik, Lu, Jiongxin, and Wong, C. P., "Conductivity Enhancement of Nano Silver-Filled Conductive Adhesives by Particle Surface Functionalizaiton," Journal of Electronic Materials , vol. 34 no. 11, pp. 1432-1439, Nov. 2005.

Jiang, Hongjin, Moon, Kyoung-sik, Zhang, Rongwei, and Wong, C. P., "In-situ Reduced Silver Nanoparticles for Highly Conductive Anisotropic Conductive Films Applications," 2nd IEEE International Interdisciplinary Conference on Portable Information Devices, 2008 and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Garmisch-Partenkirchen, Germany, Aug, 17-20, 2008, pp. xx-xx.

Jiang, Hongjin, and Wong, C. P., "Low Processing Temperature of Lead-Free Solder Interconnects," IEEE Nanotechnology Magazine, vol. 4 no. 2, pp. 20,22-23, June 2010.

Jiang, Hongjin, Moon, Kyoung-sik, and Wong, C. P., "Recent advances of nanolead-free solder material for low processing temperature interconnect applications," Microelectronics Reliability , vol. 53 no. 12, pp. 1968-1978, Dec. 2013.

Jiang, Hongjin, Moon, Kyoung-Sik, Hua, Fay, and Wong, C. P., "Synthesis and thermal and wetting properties of tin/silver alloy nanoparticles for low melting point lead-free solders," Chemistry of Materials, vol. 19 no. 18, pp. 4482-4485, Sept. 4, 2007.

Jiang, Hongjin, Moon, Kyoung-sik, and Wong, C. P., "Synthesis of Ag-Cu Alloy Nanoparticles for Lead-Free Interconnect Materials," 2005 IEEE/CPMT 10th International Symposium on Advanced Packaging Materials, Irvine, CA, Mar. 16-18, 2005, pp. 173-177.

Jiang, Hongjin, Moon, Kyoung-sik, Hua, Fay, and Wong, C. P., "Thermal Properties of Tin/Silver Alloy Nanoparticles for Low Temperature Lead-free Interconnect Technology," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 54-58.

Jiang, Hongjin, Moon, Kyoung-sik, Hua, Fay, and Wong, C. P., "Tin/Silver Alloy Nanoparticles for Low Temperature Lead-free Interconnect Applications," 12th International Symposium on Advanced Packaging Materials, San Jose, CA, Oct. 3-5, 2007, pp. 321-324.

Jiang, Hongjin, Moon, Kyoung-sik, and Wong, C. P., "Tin/Silver/Copper Alloy Nanoparticle Pastes for Low Temperature Lead-free Interconnect Applications," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1400-1404.

Jiang, Hongjin, Moon, Kyoung-sik, Li, Yi, and Wong, C. P., "Ultra High Conductivity of Isotropic Conductive Adhesives," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 485-490.

Jiang, Hongjin, Moon, Kyoung-sik, Li, Yi, and Wong, C. P., "Ultra Highly Conductive Polymer Composites for Lead-free Interconnect," 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 71-72.

Jiang, Junxiang, Lee, Jae-Ean, Kim, Keun-Soo, and Suganuma, Katsuaki, "Oxidation behavior of Sn-Zn solders under high-temperature and high-humidity conditions," Journal of Alloys and Compounds, vol. 462 no. 1-2, pp. 244-251, Aug. 25, 2008.

Jiang, L., Muthegowda, N., Bhatia, M. A., Migliori, A., Solanki, K. N., and Chawla, N., "Full elastic constants of Cu6Sn5 intermetallic by Resonant Ultrasound Spectroscopy (RUS) and ab initio calculations," Scripta Materialia , vol. 107, pp. 26-29, Oct. 2015.

Jiang, L., and Chawla, N., "Mechanical properties of Cu6Sn5 intermetallic by micropillar compression testing," Scripta Materialia, vol. 63 no. 5, pp. 480-483, Sept. 2010.

Jiang, Li, Yang, Keling, Zhou, Jiemin, Xiang, Ke, and Wang, Wenjie, "Quantification of creep strain in small lead-free solder joints with the in-situ micro electronic-resistance measurement," Proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, London, England, Apr. 15-18, 2007, pp. xx-xx.

Jiang, Li, Yang, Keling, Zhou, Jiemin, Xiang, Ke, and Wang, Wenjie, "Quantification of creep strain in small lead-free solder joints with the in situ micro electronic-resistance measurement," Microelectronics Reliability, vol. 48 no. 3, pp. 438-444, Mar. 2008.

Jiang, Li, Zhang, Guiying, and Zhou, Jieming, "Size effects of lead-free solder joint thickness under shear creep based on micro-electrical-resistance strain," Journal of Physics D: Applied Physics, vol. 41 no. 16, pp. 165412, Aug. 21, 2008.

Jiang, Ling, Jiang, Hanqing, and Chawla, Nikhilesh, "The Effect of Crystallographic Orientation on the Mechanical Behavior of Cu6Sn5 by Micropillar Compression Testing," Journal of Electronic Materials, vol. 41 no. 8, pp. 2083-2088, Aug. 2012.

Jiang, Liulu, Zhu, Wenhui, and He, Hu, "Comparison of Darveaux Model and Coffin-Manson Model for Fatigue Life Prediction of BGA Solder Joints," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1474-1477.

Jiang, Maogong, Fu, Guicui, Wan, Bo, Xue, Peng, Qiu, Yao, and Li, Yanruoyue, "Failure analysis of solder layer in power transistor," Soldering & Surface Mount Technology, vol. 30 no. 1, pp. 49-56, 2018.

Jiang, N., Yang, M., Novak, J., Igor, P., and Osterman, M., "Sn whiskers removed by energy photo flashing," Applied Surface Science , vol. 258 no. 24, pp. 9599-9603, Oct. 1, 2012.

Jiang, Nan, Zhang, Liang, Liu, Zhi-quan, Sun, Lei, Xiong, Ming-yue, Zhao, Meng, and Xu, Kai-kai, "Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder," Journal of Materials Science: Materials in Electronics , vol. 30 no. 19, pp. 17583-17590, Oct. 2019.

Jiang, Peng, Liu, Yongchang, Wei, Chen, Wan, Jingbo, Xu, Ronglei, and Gao, Zhiming, "Effect of high-temperature annealing on the microstructural formation of Sn-3.7Ag-0.9Zn-xAl lead-free solder," Journal of Materials Science: Materials in Electronics, vol. 20 no. 2, pp. 139-143, Feb. 2009.

Jiang, Q., Mukherjee, S., Dasgupta, A., Shaddock, D., and Yin, L., "Mechanical Constitutive Properties of a Bi-rich High Temperature Solder Alloy," 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 31-June 3, 2016, pp. 1236-1239.

Jiang, S. D., Eggers, T., Thiabgoh, O., Xing, D. W., Fang, W. B., Sun, J. F., Srikanth, H., and Phan, M. H., "Enhancement of Giant Magneto-Impedance in Series Co-Rich Microwires for Low-Field Sensing Applications," Journal of Electronic Materials, vol. 47 no. 5, pp. 2667-2672, May 2018.

Jiang, Shou-li, Zhong, Jian-feng, LI, Jia-yuan, Wang, Ri-chu, Peng, Chao-qun, and Cai, Zhi-yong, "Influence of cobalt content on microstructure and corrosion performance of extruded Sn-9Zn solder alloys," Journal of Central South University , vol. 27 no. 3, pp. 711-720, Mar. 2020.

Jiang, Ting-Biao, Nong, Hong-Mi, and Du, Chao, "Study of Interface Reliability in QFN Device under Hygro-Thermal Environment," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Jiang, Tong, Zhengjian, Xu, Lee, S. W. Ricky, Song, Fubin, Lo, Jeffery C. C., and Yang, Chaoran, "Computational Parametric Study on the Strain Hardening Effect of Lead-free Solder Joints in Board Level Mechanical Drop Tests," 2011 18th European Microelectronics and Packaging Conference, Brighton, United Kingdom, Sept. 12-15, 2011, pp. xx-xx.

Jiang, Wu, Jia, Li, and Zhen-ming, Xu, "A new two-roll electrostatic separator for recycling of metals and nonmetals from waste printed circuit board," Journal of Hazardous Materials , vol. 161 no. 1, pp. 257-262, Jan. 15, 2009.

Jiang, Yiming, Li, Hailong, Chen, Gang, Mei, Yunhui, and Wang, Meiyu, "Electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu ball grid array solder joints," Journal of Materials Science: Materials in Electronics, vol. 30 no. 6, pp. 6224-6233, Mar. 2019.

Jiang, Yurong, Qin, Ruiping, Li, Meng, Wang, Guangna, Ma, Heng, and Chang, Fanggao, "Effect of alkali treatment on the spectral response of silicon-nanowire solar cells," Materials Science in Semiconductor Processing, vol. 17, pp. 81-86, Jan. 2014. https://doi.org/10.1016/j.mssp.2013.08.011

Jiangang, Zhang, Jihua, Huang, Lihua, Qi, Ye, Wang, and Hua, Zhang, "Research on Interfacial Intermetallics Growth Behavior of SnAgCu/Cu Solder Joints under Thermal-shearing Cycling," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Jian-Min, Xia, Xun-Ping, Li, Xiao, Ma, and Xin-Ping, Zhang, "FE Simulation of Joint Volume Effect on Fracture Behavior of BGA Structure Cu/Sn3.0Ag0.5Cu/Cu Interconnects under Lap-shear Loading," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 476-481.

Jianrui, Liu, Guo, Yina, and Weidong, Huang, "Study on the corrosion resistance of phytic acid conversion coating for magnesium alloys," Surface and Coatings Technology, vol. 201 no. 3-4, pp. 1536-1541, Oct. 5, 2006.

Jiao, Chuan-Mei, and Chen, Xi-Lei, "Influence of Fumed Silica on the Flame-Retardant Properties of Ethylene Vinyl Acetate/Aluminum Hydroxide Composites," Journal of Applied Polymer Science, vol. 120 no. 3, pp. 1285-1289, May 5, 2011.

Jie, Guan, Min, Xu, Shengwen, Chen, Zhou, My, and Li, Su, "The Compounds Study of Waste PC Main-Board pyrolysis," Advanced Materials Research, vol. 113-116, 2010, pp. 887-891.

Jie, Wu, Songbai, Xue, Jingwen, Wang, Jianxin, Wang, and Deng, Yangbao, "Enhancement on the high-temperature joint reliability and corrosion resistance of Sn-0.3Ag-0.7Cu low-Ag solder contributed by Al2O3 Nanoparticles (0.12 wt%)," Journal of Materials Science: Materials in Electronics , vol. 29 no. 23, pp. 19663-19677, Dec. 2018.

Jie-Bao, , Cao, Lihua, Chen, Chunhuan, and Liu, Zhi-Quan, "Effect of reflux time and aging treatment on the interfacial reaction of SnAgCuSbBiNi/Cu solder joint," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 469-472.

Jien, Christina, and Chang, Johnson, "A Novel Halogen-Free, Phosphorus-Free Material for PCB Applications," Printed Circuit Design and Fab/ Circuits Assembly, vol. 28 no. 12, pp. 25-27, Dec. 2011.

Jih, E., Pao, Y.-H., Song, X., and Larner, C., "Determination of Fracture Toughness of Thermally Conductive Adhesives," Journal of Electronic Packaging, vol. 119 no. 3, pp. 204-207, Sept. 1997.

Jimenez, Humberto, Gil, Linda, Staia, Mariana H., and Puchi-Cabrera, Eli Saul, "Effect of deposition parameters on adhesion, hardness and wear resistance of Sn-Ni electrolytic coatings," Surface and Coatings Technology, vol. 202 no. 10, pp. 2072-2079, Feb. 15, 2008.

Jin, Guohui, Wu, Pengwei, Xu, Yangjian, Liang, Lihua, Wang, Xiaogui, and Liu, Yong, "Determination of Solder/Cu Interfacial Cohesive Zone Model Parameters by Inverse Analysis," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 610-614.

Jin, Jae Chul, Yu, Qiang, Shibutani, Tadahiro, Abe, Hirokazu, and Shiratori, Masaki, "The Assessment of Influence of the Design Factors on the Reliability of BGA Solder Joints," Key Engineering Materials, vol. 297-300, pp. 1822-1827, 2005.

Jin, S., Sherwood, R. C., Mottine, J. J., Tiefel, T. H., Opila, R. L., and Fulton, J. A., "New, Z-direction anisotropically conductive composites," Journal of Applied Physics, vol. 64 no. 10, pp. 6008-6010, Nov. 15, 1988.

Jin, Sanghun, Kim, Min-Su, Kanayama, Shutetsu, and Nishikawa, Hiroshi, "Microstructure and mechanical properties of indium-bismuth alloys for low melting-temperature solder," Journal of Materials Science: Materials in Electronics, vol. 29 no. 19, pp. 16460-16468, Oct. 2018.

Jin, Sungho, Tiefel, Thomas H., Chen, Li-Han, and Dahringer, Donald W., "Anisotropically Conductive Polymer Films with a Uniform Dispersion of Particles," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 16 no. 8, pp. 972-977, Dec. 1993.

Jin, Sungho, "Developing Lead-Free Solders: A Challenge and Opportunity," JOM, vol. 45 no. 7, pp. 13, July 1993.

Jin, Sungho, "Rare-Earth-Enabled Universal Solders for Microelectromechanical Systems and Optical Packaging," Journal of Electronic Materials, vol. 32 no. 12, pp. 1366-1370, Dec. 2003.

Jin, Y. G., Meng, J., Chen, X. F., and Wang, T. C., "Investigation of Sn/Cu/Ni Ternary Alloying in Lead Free Solder Bump Applications," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Jin, Y. J., Zhang, D. H., Liu, H. F., and Tang, X. H., "Self-nucleation growth of InSb nanowires based on indium droplets under the assistance of Au nano-particles by MOCVD," Materials Letters, vol. 185, pp. 77-80, Dec. 15, 2016.

Jin, Yunxia, Yang, Jun, Cheng, Yuanrong, and Xiao, Fei, "Fabrication of interconnected silver flakes for conductive adhesives through dopamine-induced surface functionalization," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging , Guilin, China, Aug. 13-16, 2012, pp. 200-202.

Jin, Yunxia, Hu, Jun, and Lu, Daniel, "Investigation of the Fundamental Interactions among the Ingredients of Flux by the Group Contribution Method," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 894-899.

Jin, Zheming, Kato, Hiroshi, and Kageyama, Kensuke, "Ultrasonic evaluation of fatigue damaging process of Cu plates joined with Sn-3.8wt%Ag-1.2wt%Cu alloy solder," Key Engineering Materials, vol. 270-273 part 2, pp. 1189-1195, 2004.

Jinduo, Lu, Xin, Feng, GaoJing, and Weihua, Yu, "From EU RoHS to China RoHS," 8th International Conference on Electronic Measurement and Instruments, Xi'An, China, Aug. 16-18, 2007, pp. 2-472-2-474.

Jing, H. Y., Guo, H. J., Wang, L. X., Wei, J., Xu, L. Y., and Han, Y. D., "Influence of Ag-modified graphene nanosheets addition into Sn-Ag-Cu solders on the formation and growth of intermetallic compound layers," Journal of Alloys and Compounds, vol. 702, pp. 669-678, Apr. 25, 2017.

Jing, H. Y., Zhang, Y. Y., Xu, L. Y., Zhang, G. S., Han, Y. D., and Wei, J., "Low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy," International Journal of Fatigue, vol. 75, pp. 100-107, June 2015.

Jing, Jianping, Gao, Feng, Johnson, Janine, Liang, Frank Z., Williams, Richard L., and Qu, Jianmin, "Brittle Versus Ductile Failure of a Lead-Free Single Solder Joint Specimen Under Intermediate Strain Rate," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 9, pp. 1456-1464, Sept. 2011.

Jing, Yanxia, Sheng, Guangmin, Huang, Zhenhua, and Zhao, Guoji, "Effects of 0.1 wt% Ni addition and rapid solidification process on Sn-9Zn solder," Journal of Materials Science: Materials in Electronics, vol. 24 no. 12, pp. 4868-4872, Dec. 2013.

Jing, Yanxia, Sheng, Guangmin, and Zhao, Guoji, "Influence of rapid solidification on microstructure, thermodynamic characteristic and the mechanical properties of solder/Cu joints of Sn-9Zn alloy," Materials and Design, vol. 52, pp. 92-97, Dec. 2013.

Jingqiang, He, Feng, Gao, Yunhua, Tu, and Sang, Liu, "PCB Creep Corrosion and Board Design Considerations," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 926-930.

Jinsong, Zhang, Fengshun, Wu, Lei, Wang, and Yiping, Wu, "Effect of current density and geometry structure on Pb-free solder joints electromigration," Proceedings of 2004 International IEEE Conference on the Asian Green Electronics, Hong Kong, China, Jan 5-9, 2004, pp. 77-80.

Jinsong, Zhang, Yiping, Wu, Fengshun, Wu, and Bing, An, "Electromigration in Pb-free bumps with different UBM thickness," Proceedings of 2005 International Conference on Asian Green Electronics , Shang Hai, China, Mar. 15-18, 2005, pp. 91-95.

Jiri, Podzemsky, Martin, Copjan, Jan, URbanek, and Karel, Dusek, "Evaluation of Tin Whisker Growth," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 179-182.

Jirsa, Jan, and Dusek, Karel, "Risk Management of Technology of Lead Free Soldering," 32nd International Spring Seminar on Electronics Technology, Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.

Jiu, Jinting, and Suganuma, Katsuaki, "Metallic Nanowires and Their Application," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 6 no. 12, pp. 1733-1751, Dec. 2016.

Jiu, Jinting, Tokuno, Takehiro, Nogi, Masaya, and Suganuma, Katsuaki, "Preparation and application rod-shaped and spherical silver nanoparticles," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 221-223.

Jiu, Jinting, Zhang, Hao, Koga, Shunsuke, Nagao, Shijo, Izumi, Yasuha, and Suganuma, Katsuaki, "Simultaneous synthesis of nano and micro-Ag particles and their application as a die-attachment material," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Jiun, Hoh Huey, Leng, Eu Poh, Ding, Min, and Ahmad, Ibrahim, "A Study on Lead Free SnAgCu Solder System," 31st International Conference on Electronics Manufacturing and Technology, Kuala Lumpur, Malasia, Nov. 8-10, 2007, pp. 450-455.

Jo, Hyoryoon, Nieman, Benjamin E., and Lee, Ning-Cheng, "Voiding of Lead-Free Soldering at Microvia," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Jo, Jung-Lae, Kim, Keun-Soo, Sugahara, Tohru, Nagao, Shijo, Hamasaki, Kyoko, Tsujimoto, Masanobu, and Suganuma, Katsuaki, "Least lead addition to mitigate tin whisker for ambient storage," Journal of Materials Science: Materials in Electronics, vol. 24 no. 8, pp. 3108-3115, Aug. 2013.

Jo, Jung-Lae, Nagao, Shijo, Hamasaki, Kyoko, Tsujimoto, Masanobu, Sugahara, Tohru, and Suganuma, Katsuaki, "Mitigation of Sn Whisker Growth by Small Bi Additions," Journal of Electronic Materials, vol. 43 no. 1, pp. 1-8, Jan. 2014.

Jo, Jung-Lae, Nagao, Shijo, Sugahara, Tohru, Tsujimoto, Masanobu, and Suganuma, Katsuaki, "Thermal stress driven Sn whisker growth: in air and in vacuum," Journal of Materials Science: Materials in Electronics, vol. 24 no. 10, pp. 3897-3904, Oct. 2013.

Jo, Seung jae, Lee, Ah ruem, and Kang, Chung Yun, "Improvement of the Solder Joint Strength in a SAC 305 Solder Ball to a ENIG Substrate Using LF Hydrogen Radical Treatment," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1752-1756.

Jo, Yun-Hwan, Lee, Joo Won, Seo, Sun-Kyoung, Lee, Hyuck Mo, Han, Hun, and Lee, Dong Chun, "Demonstration and Characterization of Sn-3.0Ag-0.5Cu/Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging," Journal of Electronic Materials , vol. 37 no. 1, pp. 110-117, Jan. 2008.

Jobb, Dean, "Nickel-coating Solves Electrical Problem: Nickel offers a solution to trimming 'tin whiskers'," Nickel, vol. 20 no. 2, pp. xx-xx, Mar. 2005.

Jobs, Steve, "A Greener Apple, Steve Jobs responds to criticism from environmentalists," emsnow, June 1, 2007.

Johal, Kuldip, "Are You in Control of Your Electroless Nickel/Immersion Gold Process?," 2001 SMTA International Conference Proceedings, Chicago, IL, Sept. 30-Oct. 4, 2001, pp. xx-xx.

Johal, Kuldip, Roberts, Hugh, and Lamprecht, Sven, "Electroless Nickel / Electroless Palladium / Immersion Gold Process for Multi-purpose Assembly Technology," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 508-515.

Johal, Kuldip, Roberts, Hugh, Beck, Thomas, Lamprecht, Sven, Schreier, Hans-Juergen, and Sebald, Christian, "Evaluation of Pb-Free BGA Solder Joint Reliability on Ni-Based Surface Finishes Using Alternative Shear and Pull Metrologies," 2007 Pan Pacific Microelectronics Symposium & Exhibit, Maui, HI, Jan. 30-Feb. 1, 2007, pp. xx-xx.

Johal, Kuldip, Lamprecht, Sven, Schreier, Hans-Jurgen, and Roberts, Hugh, "Impacts of Bulk Phosphorous Content of Electroless Nickel Layers to Solder Joint Integrity and Their Use as Gold- and Aluminum-Wire Bond Surfaces," 2004 Pan Pacific Symposium Conference Proceedings, Kahuku, Oahu, Hawaii, Feb. 10-12, 2004, pp. xx-xx.

Johal, Kuldip, Roberts, Hugh, Lamprecht, Sven, and Schreier, Hans-Jurgen, "Impacts of Bulk Phosphorous Content of Electroless Nickel Layers to Solder Joint Integrity and Their Use as Gold- and Aluminum-Wire Bond Surfaces," Journal of SMT, vol. 17 no. 2, pp. 18-28, Apr. 2004.

Johal, Kuldip, and Schreier, Hans-Juergen, "Novel Immersion Tin Finish for Multiple Soldering of Surface Mount Packages," Printed Circuits Expo 2000, San Diego, CA, Apr. 2-6, 2000, pp. S03-2-1-S03-2-9.

Johal, Kuldip, Roberts, Hugh, Desai, Kishor, Low, Q. H., and Huermoeller, Ron, "Performance and Reliability Evaluation of Alternative Surface Finishes for Wire Bond and Flip Chip BGA Applications," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Johal, Kuldip, and Schreier, Hans-Juergen, "Tin Finishes Drum Up Support," Printed Circuit Fabrication, vol. 23 no. 8, pp. 40,42-44, Aug. 2000.

Johander, Per, Tegehall, Per-Erik, Osman, Abelrahim Ahmed, Wetter, Goran, and Andersson, Dag, "Printed circuit boards for lead-free soldering: materials and failure mechanisms," Circuit World, vol. 33 no. 2, pp. 10-16, 2007.

Johannes, William R., Vianco, Paul T., Rejent, Jerome A., and McKenzie, Bonnie B., "Long Term Reliability of Eutectic Sn-Pb and Pb-Free Solder Joints Made to the ENEPIG Surface Finish (presentation)," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 980-988.

Johannsen, Sven, "Influence of Lead-Free Materials on PCB Assembly Reliability," 8th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Noordwijk, the Netherlands, May 10-12, 2017, pp. xx-xx.

Johansson, A., Janting, J., Schultz, P., Hoppe, K., Hansen, I.N., and Boisen, A., "SU-8 cantilever chip interconnection," Journal of Micromechanics and Microengineering, vol. 16 no. 2, pp. 314-319, Feb. 1, 2006.

Johansson, Jan, and Luttropp, Conrad, "Material hygiene: improving recycling of WEEE demonstrated on dishwashers," Journal of Cleaner Production, vol. 17 no. 1, pp. 26-35, Jan. 2009.

Johansson, Jan G., and Bjorklund. Anna E., "Reducing Life Cycle Environmental Impacts of Waste Electrical and Electronic Equipment Recycling: Case Study on Dishwashers," Journal of Industrial Ecology, vol. 14 no. 2, pp. 258-269, Mar./Apr. 2010.

Johansson, Jonas, Belov, Ilja, Johnson, Erland, and Leisner, Peter, "An approach to life consumption monitoring of solder joints in operating temperature environment," 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Lisbon, Portugal, Apr. 16-18, 2012, pp. xx-xx.

Johansson, Jonas, Belov, Ilja, Johnson, Erland, Dudek, Rainer, and Leisner, Peter, "Investigation on thermal fatigue of SnAgCu, Sn100C, and SnPbAg solder joints in varying temperature environments," Microelectronics Reliability , vol. 54 no. 11, pp. 2523-2535, Nov. 2014.

Johansson, Sofia, Egard, Mikael, Ghalamestani, Sepideh Gorji, Borg, B. Mattias, Berg, Martin, Wernersson, Lars-Erik, and Lind, Erik, "RF Characterization of Vertical InAs Nanowire Wrap-Gate Transistors Integrated on Si Substrates," IEEE Transactions on Microwave Theory and Techniques, vol. 59 no. 10 part II, Oct. 2011.

Johler, Werner, "High Temperature Resistant Gold Alloys for Switching Signal Relay Contacts," Proceedings of the 54th IEEE Holm Conference on Electrical Contacts , Orlando, F:, Oct. 27-29, 2008, pp. 35-40.

Johler, Werner, "Impact of lead-free soldering on the reliability of relays," Appliance , vol. 61 no. 12, pp. 28-32, Dec. 2004

Johler, Werner, "Impact of Lead-free Soldering Processes on the Performance of Signal Relay Contacts." Proceedings of the Forty-Eighth IEEE Holm Conference on Electrical Contacts, Orlando, FL, Oct. 12-23, 2002, pp. 43-55.

Johler, Werner, "Impact of Lead-Free Soldering Processes on the Performance of Signal Relay Contacts," IEEE Transactions on Components and Packaging Technologies , vol. 27 no. 1, pp. 30-41, Mar. 2004.

Johler, Werner, "Impact of Lead Free Soldering Processes on the Reliability of Electromechanical Switching Devices," IEICE Transactions on Electronics , vol. E87-C no. 8, pp. 1225-1234, Aug. 2004.

Johler, Werner, "Signal Relays for Lead-Free Solder Processes," 50th International Relay Conference, Newport Beach, CA, Apr. 15-17, 2002.

john@usa.com "Welcome to Push back blog: The truth about lead-free soldering," May 18, 2006.

John, Zhiyuan Yang, "Performance Evaluation for Electrical Plate Lead-free Solder Bumping on Sapphire Wafers," 9th Electronics Packaging Technology Conference , Singapore, Dec. 10-12, 2007, pp. 246-251.

John, Zhiyuan Yang, "Sapphire Wafer Bumping by Lead-free Solder Paste Printing Process," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 902-905.

Johns Jr., Alfred A., and Miller, Eugene S., "Dip-soldered Printed Circuit Joint Characteristics," Symposium on Solder (ASTM Special Technical Publication No. 189), Atlantic City, NJ, June 19-20, 1956, pp. 115-128.

Johnson, Alan, "PC Board Pallets for Lead-Free Soldering Must "Like It Hot."," U. S. Tech, vol. 21 no. 9, pp. 57, 61, Sept. 2006.

Johnson Sr., Brian, "REACH How it affects PSA tapes," Adhesives & Sealants Industry , vol. 15 no. 8, pp. 24-28, Aug. 2008.

Johnson, Charmaine, Coyle, Richard, Anselm, Martin, Clark, Lenora, Popowich, Richard, Parihar, Ajitesh Singh, Swanson, Tayler, Fullerton, Jason, and Xu, Chen, "Attachment Quality and Thermal Fatigue Reliability of a Surface Mount Chip Resistor Assembled with a Low Temperature Solder," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 457-464.

Johnson, George Robert, "ACCESSION #: 9907150121," Foxboro, July 9, 1999.

Johnson, George Robert, "ACCESSION #: 9907290189," Foxboro, July 15, 1999.

Johnson, George Robert, "ACCESSION #: 9909170178," Foxboro, Sept. 13, 1999.

Johnson, Howard, "Roll back the lead-free initiative: 12 ROHS myths," EDN, vol. xx no. xx, pp. xx-xx, Sept. 13, 2007.

Johnson, Howard, "Rollback the Lead-Free Initiative," High-Speed Digital Design Online Newsletter, vol. 10 no. 1, pp. xx-xx, 2007.

Johnson, Jill Kauffman, "Transforming the Chemical Supply Chain," Printed Circuit Design and Manufacture, vol. 24 no. 4, pp. 34, 36-37, Apr. 2007.

Johnson, Joe, "Elimination of RoHS Substances in Electronic Products," NEMI RoHS/ Pb-Free Summit, Oct. 18-20, 2004.

Johnson, Joe, and Pfahl, Bob, "What's Next on the Environmental Front," Circuits Assembly, vol. 17 no. 7, pp. 59, July 2006.

Johnson, Joe, and Pfahl, Bob, "What's Next on the Environmental Front," Printed Circuit Design and Manufacture, vol. 23 no. 7, pp. 16, 18, July 2006.

Johnson, Michael E., Lu, Henry Y., Lawhead, David, Tessier, Ted, Scott, Doug, and Curtis, Anthony, "Using High Speed Shear and Cold Ball Pull to Characterize Lead Free Solder Alloys and Predict Board Level Drop Test Performance," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 536-542.

Johnson, Nikki, "EU RoHS and Upcoming Legislation," SMTA International Conference , Orlando, FL, Oct. 7-11, 2007, pp. 68-73.

Johnson, R. Colin, "IBM gets the lead out of its chip packages," EE Times Europe , vol. xx no. xx, pp. xx-xx, July 19, 2007.

Johnson, R. Colin, "Low-temperature adhesives putting heat on solder," Electronic Engineering Times, issue 1376, pp. 41, June 20, 2005.

Johnson, R. Colin, "Materials change yields fast transparent circuits," Green SupplyLine, Mar. 27, 2006.

Johnson, R. Colin, "SILICON ENGINEERING: Low-temperature adhesives putting heat on solder," Green SupplyLine, June 20, 2005.

Johnson, R. Colin, "SILICON ENGINEERING: Low-temperature adhesives putting heat on solder," EE Times, June 20, 2005.

Johnson Jr., R. T., and Dragsdorf, R. D., "The Martensitic Transformation in Cobalt," Journal of Applied Physics , vol. 38 no. 2, pp. 618-626, Feb. 1967.

Johnson, R. Wayne, Liu, Yueli, Tian, Guoyun, Gale, Shyam, and Lall, Pradeep, "Assembly and Drop Test Reliability of Lead Free Chip Scale Packages," 2004 IEEE Microelectronics Reliability and Qualification Workshop , 2003, pp. xx-xx.

Johnson, R. Wayne, "ELEC 6740 Electronics Manufacturing Chapter 8: Adhesives and Its Application."

Johnson, R. Wayne, "Extreme Environment Advancements," Advanced Packaging, vol. 16 no. 4, pp. 48, May/June 2007.

Johnson, R. Wayne, Evans, John L., Jacobsen, Peter, and Thompson, Rick, "High Temperature Automotive Electronics," Proceedings 2002 International Conference on Advanced Packaging and Systems (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4828), Reno, NV, Mar. 10-13, 2002, pp. 69-79.

Johnson, R. Wayne, "Lead Free Legislation and Issues," Auburn University.

Johnson, R. Wayne, Palmer, Michael, Wang, Cai, and Liu, Yi, "Packaging Materials and Approaches for High Temperature SiC Power Devices," Advancing Microelectronics, vol. 31 no. 1, pp. 8-11, Jan.-Feb. 2004.

Johnson, R. Wayne, Evans, John L., Jacobsen, Peter, Thompson, James R. (Rick), and Christopher, Mark, "The Changing Automotive Environment: High-Temperature Electronics," IEEE Transactions on Electronics Packaging Manufacturing, vol. 27 no. 3, pp. 164-176, July 2004.

Johnson, Robert D., and Choi, Jun Seok, "Recent Advances in the Technology of Contaminant Analysis Using Energy Dispersive X-Ray Fluorescence," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 568-572.

Johnson, Roger N., "Alternative Coatings for Wear and Corrosion: The Electrospark Deposition Process," 2002 AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 28-30, 2002, pp. xx-xx.

Johnson, Sally Cole, "Electronics: Going 'Green'," Lead-free Electronics, Nov. 2004.

Johnson, Sally Cole, "Manufacturers must take RoHS Directive seriously," Electronics Weekly, June 14, 2006.

Johnson, Sally Cole, "RoHS and non-compliance: Expect to see penalties," Electronic Business, June 13, 2006.

Johnson, Sally Cole, "Technology transforms non-compliant RoHS parts into compliant ones," Electronic Business, June 13, 2006.

Johnson, Wayne, Lugo, Roger, Sattiraju, Seshu V, and Jones, Greg, "Improving Lead-Free Thermal Process Control," Nikkei Electronics Asia, pp. xx-xx, July 2002.

Johnston, Sean, Shi, Zhiming, Dargusch, Matthew S., and Atrens, Andrej, "Influence of surface condition on the corrosion of ultra-high-purity Mg alloy wire," Corrosion Science, vol. 108, pp. 66-75, July 2016.

Microelectronics Reliability, vol. 42 no. 12, pp. 1913-1920, Dec. 2002.

Jokinen, Erja, and Ristolainen, Eero, "Flip Chip Joining of Thin Chips on Flexible PEN Substrate," Proceedings 2001 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4587), Baltimore, MD, Oct. 9-11, 2001, pp. 600-604.

Jollimore, Dave, "WEEE Comes Full Circle," Surface Mount Technology (SMT), vol. 21 no. 6, pp. 28-29, June 2007.

Jolly, Nick, "WEEE Directive Update," SMART Group Lead-Free Seminar 2000, High Wycombe, UK, Feb. 10, 2000.

Jolly, R., and Rhin, C., "The recycling of lead-acid batteries: production of lead and polypropylene," Resources, Conservation and Recycling, vol. 10 no. 1-2, pp. 137-143, Apr. 1994.

Jones, Allen R., and Snyder, Donald, "Decorative and Hard Chromium Electroplating," Products Finishing , vol. xx no. xx, pp. xx-xx, Nov. 9, 2004.

Jones, Greg, "A Period of Adjustment," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Mar.-Apr. 2000.

Jones, Greg, "Are You Ready for Lead-free Assembly?," Surface Mount Technology (SMT), vol. 14 no. 6, pp. 60-62, June 2000.

Jones, K. C., "EU call for 'E-Waste' restrictions to echo globally," EE Times , vol. xx no. xx, pp. xx-xx, Jan. 5, 2007.

Jones, K. C., "EU call for 'E-waste' restrictions to echo globally," EE Times Europe, Jan. 5, 2007.

Jones, Matthew, Goas-Fernandez, Tamara, and Wenham, Barry, "The Influence of Aspects of Solder Paste Formulation and Soldering Process Factors on Voiding under Large QFN Devices," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Jones, Mike, and Tattersall, Tom, "Alternatives Replace Older Cleaners," Surface Mount Technology (SMT), vol. 22 no. 5, pp. 12,14-16, May 2008.

Jones Jr., W. Kinzy, "A Novel Technique for Modeling Solder Joint Failure During System Level Drop Simulations," 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 15.

Jones, W. K., Liu, Y. Q., and Shah, M., "Mechanical Properties of Sn-In and Pb-In Solders at Low Temperature," Proceedings 3rd International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Braselton, GA, Mar. 9-12, 1997, pp. 64-67.

Jones, W. Kinzy, Liu, Yanqing, Shah, Milind, and Clarke, Robert, "Mechanical properties of Pb/Sn Pb/In and Sn-In solders," Soldering & Surface Mount Technology, vol. 10 no. 1, pp. 37-41, 1998.

Jones, W. K., Liu, Y. Q., and Shah, M., "Mechanical Properties of Sn-In and Pb-In Solders at Low Temperature," Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, Braselton, GA, Mar. 9-12, 1997, pp. 64-67.

Jong, W. R., and Peng, S. H., "A Study for the New-Type ACF Applications of FCOF Assembly," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 31-34.

Jong, W. R., and Peng, S. H., "A Study of the Effect on Deformations for ACF Applications," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 71-74.

Jong, W. R., Tsai, H. C., and Lau, C. C., "Designs of Temperature Loads on the Fatigue Life Analysis of Lead-Free Solder in IC Packages," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 423-426.

Jong, W. R., Tsai, H. C., and Huang, C. T., "Fatigue Life Predictions of Solder Joint under Thermal Cyclic Loading," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 293-296.

Jong, W. R., Tsai, H. C., and Huang, G. Z., "The influences of temperature cycling parameters on the reliability of the solder joints in the high-density package assemblies by Taguchi Method," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 27-30.

Jong, Wen-Ren, Tsai, Hsin-Chun, and Huang, Ching-Tzu, "Effects of Element Partition on the Fatigue Life Predictions of Lead-Free Solder Joints," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Jong, Wen-Ren, Tsai, Hsin-Chun, Chang, Hsiu-Tao, and Peng, Shu-Hui, "The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method," Journal of Electronic Packaging, vol. 130 no. 1, pp. 011001-1-011001-10, Mar. 2008.

Jong, Wen-Ren, and Peng, Shu-Hui, "The Influences of ACF with Bonding Processes on COF under Thermal Cyclic Loading," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Jongkind, J. C., "Alkaline Tin and Tin-Bismuth Plating with Insoluble Anodes," Plating , vol. 55 no. 7, pp. 722-726, July 1968.

Jonkers, Niels, Krop, Hildo, van Ewijk, Harry, and Leonards, Pim. E. G., "Life cycle assessment of flame retardants in an electronics application," International Journal of Life Cycle Assessment, vol. 21 no. 2, pp. 146-161, Feb. 2016.

Jonnalagadda, Krishna, Patel, Mahesh, and Skipor, Andrew, "Mechanical Bend Fatigue Reliability of Lead-free PBGA Assemblies," Eight InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2002, San Diego, CA, May 30-June 1, 2002, pp. 915-918.

Jonnalagadda, Krishna, Qi, Fangjuan, and Liu, Jim, "Mechanical Bend Fatigue Reliability of Lead-Free and Halogen-Free PBGA Assemblies," IEEE Transactions on Components and Packaging Technologies , vol. 28 no. 3, pp. 430-434, Sept. 2005.

Jonnalagadda, Krishna, Qi, Fangjuan, and Liu, Jim, "Mechanical Fatigue reliability of PBGA Assemblies with Lead-free Solder and Halogen-free PCBs," The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 165-170.

Jonnalagadda, Krishna, Bai, Tao, and Olson, Bill, "Thermal and Bending Fatigue of PBGA Assemblies with Lead-Free Solder Pastes," Proceedings 2001 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4587), Baltimore, MD, Oct. 9-11, 2001, pp. 553-558.

Jonsson, B., and Agren, J., "Thermodynamic assessment of Sb-Sn system," Materials Science and Technology, vol. 2 no. 9, pp. 913-916, 1986. https://doi.org/10.1179/mst.1986.2.9.913

Joo, D. K., Yu, Jin, and Shin, S. W., "Creep Rupture of Lead-Free Sn-3.5Ag-Cu Solders," Journal of Electronic Materials, vol. 32 no. 6, pp. 541-547, June 2003.

Joo, D. K., and Yu, Jin, "Effects of Microstructure on the Creep Properties of the Lead-free Sn-3.5Ag-Cu Solders," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1221-1225.

Joo, Sung Chul, Baldwin, Daniel F., and Nam, Weon Woo, "Stencil Based Evaluation of a 01005 Component Based on a Statistical Approach," SMTAnews & Journal of Surface Mount Technology, vol. 21 no. 4, pp. 24-32, Oct.-Dec. 2008.

Joo, Sungchul, and Baldwin, Daniel F., "Performance of Silver Nano Particles as an Electronics Packaging Interconnects Material," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 219-226.

Joo, Sungchul, and Baldwin, Daniel F., "Reliable Electronics Package Prototyping with Nano-Particle Metal Interconnection," 2006 Pan Pacific Symposium Conference Proceedings , Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Joo, Y.-C., Thompson, C. V., Baker, S. P., and Arzt, E., "Electromigration proximity effects of two neighboring fast-diffusion segments in single-crystal aluminum lines," Journal of Applied Physics, vol. 85 no. 4, pp. 2108-2113, Feb. 15, 1999.

Joo, Young-Chang, and Hwang, Soo-Jung, "Effect of film thickness and annealing temperature in stress-induced damage in metal films," Materials Science Forum, vol. 539-543, pp. 3520-3524, 2007.

Jordan, Jerry, "Gold Stud Bump In Flip-Chip Applications," Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium , San Jose, CA, July 17-18, 2002, pp. 110-114.

Jordan, Manfred, "Bleiverbot in Bezug auf die Auswirkungen in der Automobilindustrie," Galvanotechnik, vol. 97 no. 2, pp. 314-317, Feb. 2006.

Jordan, Manfred, "Electroplated lead-free tin alloys for electronics. Results from Field Tests," Transactions of the Institute of Metal Finishing, vol. 80 no. 3, pp. 97-100, May 2002. https://doi.org/10.1080/00202967.2002.11871442

Jordan, Manfred, and Lawson, Roger, "Lead-Free Solderable Coatings," Transactions of the Institute of Metal Finishing, vol. 78 no. 6, pp. B82-B87, Nov. 2000.

Jordan, Manfred, "Lead-free Tin Alloys as Substitutes for Tin-lead Alloy Plating," Transactions of the Institute of Metal Finishing, vol. 75 no. 4, pp. 149-153, July 1997. https://doi.org/10.1080/00202967.1997.11871162

Jordan, Manfred, "Lead-Free Tin Alloys-Laboratory Curiosities or Capable Processes?," Metal Finishing, vol, 101 no. 1, pp. 8,10-12,14,16, Jan. 2003.

Jorgensen, Barbara, "Celestica CEO Delaney: Nothing in the Supply Chain Untouched by RoHS," Electronic Business, Feb. 10, 2006.

Jorgensen, Barbara, "Getting the lead out," Electronic Business, Nov. 1, 2000.

Jorgensen, Barbara, "Global sourcing: getting there from here," Electronic Business , Oct. 1, 2005.

Jorgensen, Barbara, "Hazardous-waste edict may accelerate component obsolescence," Electronic Business Online, Feb. 1, 2005.

Jorgensen, Barbara, "India's ROHS turns up the heat," EDN, vol. 56 no. 13, pp. 48, July 14, 2011.

Jorgensen, Barbara, "It's tough to be green," Electronic Business, Mar. 1, 2006.

Jorgensen, Barbara, "Lead-free logistics," Electronic Business, Nov. 1, 2003.

Jorgensen, Barbara, "Medical to Fall Under RoHS Scope in 2014," EDN, vol. 57 no. 13, pp. 52, July 2012.

Jorgensen, Barbara, "Peer into technology's future," Electronic Business, Apr. 1, 2006.

Jorgensen, Barbara, "Ring in the new rules," Electronic Business, Jan. 1, 2008.

Jorgensen, Barbara, "RoHS, the Coherent way," Electronic Business, June 27, 2006.

Jorgensen, Barbara, "Terms for lead-free ID," Electronic Business, July 1, 2004.

Jorgensen, Barbara, "The electronics industry's compliance blues," Electronic Business , Apr. 17, 2007.

Jorgensen, Barbara, "The end is near," Electronic Business, vol. 31 no. 2, pp. 33-34, Feb. 1, 2005.

Jorgensen, Barbara, "The "greening" of the supply chain," Supply Chain Management Review , June 1, 2005.

Jorgensen, Barbara, "The "greening" of the supply chain," Electronic Business, June 2005.

Jorgensen, Barbara, "There oughta be a (single) law," Electronic Business, July 1, 2006.

Jorgensen, Barbara, "Wall Street mixed on RoHS risks, rewards," Electronic Business , Aug. 1, 2006.

Jorgensen, Chris, "Can You Paint a Rosy Picture with Green Paint?," Printed Circuit Fabrication, vol. 23 no. 10, pp. 38,40,42,44, Oct. 2000.

Jorgensen, Chris, "Dodging the Bromine Bullet," Printed Circuit Fabrication, vol. 23 no. 8, pp. 56,58, Aug. 2000.

Jorgensen, Chris, "Halogen-Free Advocates: Just Blowing Smoke?," Printed Circuit Fabrication, vol. 24 no. 3, pp. 98,100, Mar. 2001.

Jorgenson, Chris, "IPC Technical Review: Is There a Market for Bromine-Free Flame-Retardants?: The U.S. Industry's Burning Question," CircuiTree, vol. 13 no. 11, pp. xx, Nov. 2000.

Jorgensen, Chris, "Lead-Free Electronics Full Steam Ahead," Surface Mount Technology (SMT), vol. 14 no. 5, pp. 66-68, May 2000.

Jorgensen, Chris, "Lead-Free Electronics: They're Here To Stay," Lead-Free Electronics: Positioning Massachusetts Companies as Industry Leaders, North Andover, MA, Apr. 13, 2000.

Jorgensen. Chris, "Regular or Unleaded? That is the Question...," Circuits Assembly , vol. 11 no. 4, pp. 88, Apr. 2000.

Jorgensen, Chris, "U.S. RoHS Next?," Circuitree, vol. 20 no. 2, pp. 3, Feb. 2007.

Jorgensen. Chris, "Working out the Lead-Free June Bugs," Circuits Assembly, vol. 11 no. 9, pp. 30-31, Sept. 2000.

Joseph, Shany, and Phatak, Girish J., "Effect of surfactant on the bath stability and electrodeposition of Sn-Ag-Cu films," Surface and Coatings Technology, vol. 202 no. 13, pp. 3023-3028, Mar. 25, 2008.

Joseph, Shany, Phatak, Girish J., Gurunathan, K., Seth, Tanay, Amalnerkar, D. P., and Kutty, T. R. N., "Electrochemical co-deposition of ternary Sn-Bi-Cu films for solder bumping applications," Journal of Applied Electrochemistry, vol. 36 no. 8, pp. 907-912, Aug. 2006,

Joseph, Shany, Phatak, G. J., Seth, Tanay, Gurunathan, K., Amalnerkar, D. P., and Kutty, T. R. N., "Lead-free Solder Bumping by the Electroplating Process for Electronic Packaging," IEEE Region 10 Conference on Convergent Technologies for the Asia-Pacific, Volume 4, Bangalore, Oct. 15-17, 2003, pp. 1367-1371.

Joshi, A., Hu, H. S., Yaney, D. L., Gardner, D., and Saraswat, K., "Fundamental factors governing improved performance of Al-Si/Ti multilayer metallization for very large scale integration," Journal of Vacuum Science & Technology A: Vacuum Surfaces, and Films, vol. 7 no. 3, pp. 1497-1503, May/June 1989.

Joshi, Mukul, and Chaware, Raghunandan, "On Aging Effect of Flip Chip Solder Bumps," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 469-474.

Joshi, R., Manatad, R., and Tangpuz, C., "Flip Chip in Leaded Molded Package (FLMP)," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 1009-1012.

Joshi, R., Rios, M., Tangpuz, C., and Cruz, E. Victor, "Implementation of Pb-Free Bumping in Power Packaging," IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, San Jose, CA, July 16-18, 2003, pp. 81-84.

Joshi, R., Wu, Chung-Lin, and Narayanan, M., "Optocoupler BGA Package," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1680-1682.

Joshi, S., Arfaei, B., Singh, A., Gharaibeh, M., Obaidat, M., Alazzam, A., Meilunas, M., Yin, L., Anselm, M., and Borgesen, P., "LGAs vs. BGAs - Lower Profile and Better Reliability," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 47-57.

Joshi, Shantanu, Bath, Jasbir, Mori, Kimiaki, Yukikata, Kazuhiro, Garcia, Roberto, and Shirai, Takeshi, "An Investigation into Lead-Free Low Silver Cored Solder Wire for Electronics Manufacturing Applications," IPC ?

Ju, Guo-kui, Wei, Xi-cheng, Sun, Peng, and Liu, Johan, "Effects of interfacial IMC on tensile fracture behavior of Sn-3.0Ag-0.5Cu solder joints on copper substrates," Zhongguo Youse Jinshu Xuebao/ Chinese Journal of Nonferrous Metals, vol. 17 no. 12, pp. 1936-1942, Dec. 2007.

Ju, Guokui, Lin, Fei, Bi, Wenzhen, Han, Yongjiu, Wang, Junjie, and Wei, Xicheng, "Study of IMC at interfaces of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu joints during thermal aging," Soldering & Surface Mount Technology, vol. 26 no. 4, pp. xx-xx, 2014.

Ju, Guokui, Bi, Wenzhen, Lin, Fei, Han, Yongjiu, and Wei, Xicheng, "The comparative study on interfacial IMCs growth of three Cu/SnAgCu/Cu solder joints with Bi and Cr additions during thermal aging," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 194-199.

Ju, Hyun, Park, Dabin, and Kim, Jooheon, "Organic acid-assisted chemical transformation of SnSe bulk crystals into Se nanowires and the influence on thermoelectric behaviors," Journal of Alloys and Compounds, vol. 732, pp. 436-442, Jan. 25, 2018.

Ju, Yang, Tasaka, Takafumi, Yamauchi, Hayato, and Nakagawa, Tomoki, "Synthesis of Sn nanoparticles and its size effect on melting point," 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS , Barcelona, Spain, Apr. 16-18, 2013, pp. xx-xx.

Ju, Yang, Tasaka, Takafumi, Yamauchi, Hayato, and Nakagawa, Tomoki, "Synthesis of Sn nanoparticles and their size effect on the melting point," Microsystem Technologies, vol. xx no. x, pp. xx-xx, xxxx.

Juang, Jing-Ye, Lu, Su-Tsai, Zhan, Chau-Jie, Chung, Su-Ching, Fan, Chia-Wen, Peng, Jong-Shiou, and Chen, Tai-Hong, "Development of 30 um pitch Cu/Ni/SnAg micro-bump-bonded chip-on-chip (COC) interconnects," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Juanjuan, Li, Zhenqing, Zhao, and Lee, Jaisung, "Wire Bonding Performance and Solder Joint Reliability Investigation on ENEPIG Finish Substrate," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 240-245.

Juarez Jr., Joseph M., "Avionics Vibration Durability Between Tin-Lead and Lead-Free Solder Interconnects," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 369-374.

Juarez Jr., Joseph M., Borror, Connie M., and Redman, David, "Characterizing Airplane Environments in Commercial Airplanes Using On-Board Test Vehicles to Evaluate State-Of-The-Art Lead-Free Alloys," International Conference on Soldering & Reliability 2015 Proceedings , Toronto, Ontario, Canada, May 19-21, 2015, pp. xx-xx.

Juarez Jr., Joseph M., Snugovsky, Polina, Kosiba, Eva, Bagheri, Zohreh, Suthakaran, Subramaniam, Robinson, Michael, Heebink, Joel, Kennedy, Jeffrey, and Romansky, Marianne, "Manufacturability and Reliability Screening of Lower Melting Point, Pb-Free Alloys Containing Bismuth," Journal of Microelectronics and Electronic Packaging, vol. 12 no. 1, pp. 1-28, Jan. 2015.

Juaraz Jr., Joseph M., Robinson, Michael, Heebink, Joel, Snugovsky, Polina, Kosiba, Eva, Kennedy, Jeffrey, Bagheri, Zohreh, Suthakaran, Subramaniam, and Romansky, Marianne, "Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi," APEX Expo 2014, Las Vegas, NV, Mar. 25-27, 2014, pp. xx-xx.

Jud, Pascal P., "An Overview of Lead-Free Reliability Testing," SMART Group Lead-Free Seminar, Shannon, Ireland, May 19, 2005.

Jud, Pascal P., Grossmann, Guenter, and Sennhauser, Urs, "Local Creep in Lead Free SnAg3.8Cu0.7 Solder," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Jud, Pascal P., Grossmann, Guenter, Sennhauser, Urs, and Uggowitzer, Peter J., "Local Creep in SnAg3.8Cu0.7 Lead-Free Solder," Journal of Electronic Materials, vol. 34 no. 9, pp. 1206-1214, Sept. 2005.

Jud, Pascal P., Grossmann, Guenter, Sennhauser, Urs, and Uggowitzer, Peter J., "Local Fatigue in Lead-Free SnAg3.8Cu0.7 Solder," Advanced Engineering Materials, vol. 8 no. 3, pp. 179-183, Mar. 2006.

Judd, Mike, "Counterfeit Components: UKEA Launch Their Position," Circuitnet , July 30, 2008.

Judd, Mike, "RoHS PCB Specification - What Has to Change?," Electronics Weekly , Dec. 19, 2006.

Jujun, Ruan, Yiming, Qian, and Zhenming, Xu, "Environment-friendly technology for recovering nonferrous metals from e-waste: Eddy current separation," Resources, Conservation and Recycling , vol. 87, pp. 109-116, June 2014.

Jules, Samuel, Ryckelynck, David, Duhamel, Cecilie, Bienvenu, Yves, Bisson, Jean-Francois, and Leon, Renan, "Micro-Mechanical Characterization of Lead-Free Solder Joints in Power Electronics," 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 27-30, 2014, pp. 107-111.

Jumali, Nordarina, Mohamad, Ahmad Azmin, and Mohd Nazeri, Muhammad Firdaus, "Corrosion Properties of Sn-9Zn Solder in Acidic Solution," Materials Science Forum, vol. 888, pp. 365-372, Mar. 2017.

Jun, Hoin, Kim, Yiseol, Lee, Sangjun, Kang, Namhyun, Kim, Kyoung-Bo, Kim, Moojin, Kim, Soo Hyung, and Lee, Dongyun, "Anomalous multiple pop-in behavior in Cu-Sn-based intermetallic compounds during nanoindentation," Materials Science and Engineering: A, vol. 612, pp. 192-196, Aug. 26, 2014.

Jun, Jiheon, Lee, Wanggu, Jung, Jae Pil, and Zhou, Y. Norman, "Characteristics of electroplated Sn bumps fabricated without a PR mould on a Si chip for 3D packaging," Microelectronic Engineering, vol. 93, pp. 85-90, May 2012.

Jun, Jiheon, Kim, Inrak, Lee, Younggon, Jung, Jae Pil, Hong, Sungjun, and Zhou, Y. Norman, "Electroplate Bumping without Photoresist and Si Dice Stacking with TSV for 3D Packaging," International Conference on Soldering and Reliability , Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

Jun, Zhou, GuoZhong, Chai, Yong, Liu, LiHua, Liang, and WeiNa, Hao, "Mechanical Characterization and Viscoplastic-Damage Constitutive Model of SnAgCu Solder," Proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, London, England, Apr. 15-18, 2007, pp. xx-xx.

Jun-hui, Zhang, and Hang, Min, "Eco-toxicity and metal contamination of paddy soil in an e-wastes recycling area," Journal of Hazardous Materials, vol. 165 no. 1-3, pp. 744-750, June 15, 2009.

Jung, Boo Yang, Gim, Jae Yun, Yoo, Min, Kim, Jae Dong, Lee, Choon Heung, Jimarez, Miguel, Islam, Nokibul, and Darveaux, Robert, "New Flip Chip BGA with Low CTE Core Substrate," Wafer & Device Packaging and Interconnect, vol. 1 no. 1, pp. 18-22, July/Aug. 2009.

Jung, Do-hyun, Sharma, Ashutosh, Lim, Dong-uk, Yun, Jong-hyun, and Jung, Jae-pil, "Effects of AlN Nanoparticles on the Microstructure, Solderability, and Mechanical Properties of Sn-Ag-Cu Solder," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 48 no. 9, pp. 4372-4384, Sept. 2017.

Jung, Do Hyun, Agarwal, Shalu, Kumar, Santosh, and Jung, Jae Pil, "High Shear Speed Characteristics of Sub-100 um Low Alpha SAC105 Solder Bump Directly Fabricated on Cu Filled Through Si Via for 3D Integration," Journal of Microelectronics and Electronic Packaging, vol. 12 no. 3, pp. 161-169, July 2015.

Jung, Do-Hyun, Sharma, Ashutosh, and Jung, Jae-Pil, "Influence of dual ceramic nanomaterials on the solderability and interfacial reactions between lead-free Sn-Ag-Cu and a Cu conductor," Journal of Alloys and Compounds, vol. 743, pp. 300-313, Apr. 30, 2018.

Jung, Dohyun, Roh, Myung Hoon, Lee, Jun Hyeong, Lee, Soonjae, and Jung, Jae Pil, "Electroplating of Cu in TSV and Characteristics of Low Alpha Solder Bump," International Conference on Soldering & Reliability 2013 Proceedings , Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.

Jung, E., Aschenbrenner, R., Kallmayer, Ch., Coskina, P., and Reichl, H., "Lead Free Alloys for Flip Chip Bumping," Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces , Braselton, GA, Mar. 11-14, 2001, pp. 119-122.

Jung, E., Kloeser, J., Kallmayer, Ch., Coskina, P., Aschenbrenner, R., and Reichl, H., "Lead Free Solders for Area Array Packaging," Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 551-557.

Jung, Erik, Heinricht, Katrin, Kloeser, Joachim, Aschenbrenner, Rolf, and Reichl, Herbert, "Alternative Solders for Flip Chip Applications in the Automotive Environment," Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium, Berlin, Germany, Apr. 27-29, 1998, pp. 82-91.

Jung, Hoe-Rok, Kim, Hyuk-Hwan, and Lee, Won-Jong, "Characterization of Small-Sized Eutectic Sn-Bi Solder Bumps Fabricated using Electroplating," Journal of Electronic Materials, vol. 35 no. 5, pp. 1067-1073, May 2006.

Jung, Inyu, Cho, Moon Gi, and Lee, Hyuck Mo, "Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-Bearing Pb-Free Solders on a Copper Substrate," Journal of Electronic Materials, vol. 38 no. 11, pp. 2301-2307, Nov. 2009.

Jung, Ja-Young, Lee, Shin-Bok, Joo, Young-Chang, Lee, Ho-Young, and Park, Young-Bae, "Anodic dissolution characteristics and electrochemical migration lifetimes of Sn solder in NaCl and Na2SO4 solutions," Microelectronic Engineering , vol. 85 no. 7, pp. 1597-1602, July 2008.

Jung, Ja-Young, Lee, Shin-Bok, Lee, Ho-Young, Joo, Young-Chang, and Park, Young-Bae, "Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions," Journal of Electronic Materials, vol. 37 no. 8, pp. 1111-1118, Aug. 2008.

Jung, Jae Pil, Lee, Young Woo, Cho, Sun Youn, Kim, Mi Jin, and Zhou, Y. Norman, "Various phases formation and reliability of Sn-8Zn-3Bi solder," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Jung, Leah B., and Bartel, Thomas J., "Computer Take-back and Recycling: An Economic Analysis for Used Consumer Equipment," Journal of Electronics Manufacturing, vol. 9 no. 1, pp. 67-77, Mar. 1999.

Jung, Seok Won, Jung, Jae Pil, and Zhou, Y. (Norman), "Characteristics of Sn-Cu Solder Bump Formed by Electroplating for Flip Chip," IEEE Transactions on Electronics Packaging Manufacturing, vol. 29 no. 1, pp. 10-16, Jan. 2006.

Jung, Seung-Yoon, Hong, Hye-Eun, and Paik, Kyung-Wook, "A Study on Flex-on-Fabric Interconnection Using Anisotropic Conductive Films and Ultrasonic Bonding Method," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 7 no. 8, pp. 1265-1271, Aug. 2017.

Jung, Seung-Yoon, Hong, Hye Eun, and Paik, Kyung-Wook, "A Study on the Cu-rod Anisotropic Conductive Films (ACFs) for Flex-on-Fabric (FOF) Interconnections using an Ultrasonic Bonding Method," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 2245-2250.

Jung, Seung-Yoon, and Paik, Kyung-Wook, "A Study on the Dynamic Bending Reliability of Chip-In-Fabrics(CIF) Packages Using Anisotropic Conductive Films (ACFs) Materials for Flexible Electronic Applications," Pan Pacific Symposium 2020, Honolulu, HI, Feb. 10-13, 2020, pp. xx-xx.

Jung, Won Woong, Choi, Si Kyung, Kweon, Soon Yong, and Yeom, Seung Jin, "Platinum(100) hillock growth in a Pt/Ti electrode stack for ferroelectric random access memory," Applied Physics Letters, vol. 83 no. 11, pp. 2160-2162, Sept. 15, 2003.

Jung, Yeonwoong, Vacic, Aleksandar, Perea, Daniel E., Picraux, Samuel T., and Reed, Mark A., "Minority Carrier Lifetimes and Surface Effects in VLS-Grown Axial p-n Junction Silicon Nanowires," Advanced Materials, vol. 23 no. 37, pp. 4306-4311, Oct. 4, 2011.

Junghaenel, M., and Scheuermann, U., "Impact of load pulse duration on power cycling lifetime of chip interconnection solder joints," Microelectronics Reliability, vol. 76-77, pp. 480-484, Sept. 2017.

Junhua, Cui, Jiping, Zhang, Yan, Song, and Lixin, Zhang, "Fatigue life predicting of lead-free soldered joints of QFP device," 2012 International Conference on Computer Science & Service System, Nanjing, China, Aug. 11-13, 2012, pp. 316-319.

Jurenka, Claudia, Kim, Jon Yeon, Wolf, M. Jurgen, Engelmann, Gunter, Ehrmann, Oswin, Yu, Jin, and Reichl, Herbert, "Effect of the Cu Thickness on the Stability of a Ni/Cu Bilayer UBM of Lead Free Microbumps During Liquid and Solid State Aging," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 89-93.

Juskey, Frank, "Improvements in Lead-Free IC Packaging Technology," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies , San Jose, CA, Apr. 23-24, 2003, pp. 183-188.

Jusko, Jill, "Ready For RoHs," Industry Week, vol. x, no. x, pp. xx-xx, Nov. 2006.

Juvera, Carlos, and Shaherwalla, Sharafali, "Solderball(TM) Interconnects Facilitate SMT Reflow & Eliminate Co-planarity Issues for Sub-assemblies and Power Modules," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 98-103.

Juvera, Carlos, "SolderballTM Pin Technology Provides SMT Reflow Solution to Co-planarity Interconnection Issues for PCB-based Sub-assemblies," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

KKKK

Kaabi, Abderrahmen, Bienvenu, Yves, Ryckelynck, David, and Pierre, Bertrand, "Architectured Materials to Improve the Reliability of Power Electronics Modules: Substrate and Lead-Free Solder," Journal of Electronic Materials, vol. 43 no. 3, pp. 648-657, Mar. 2014.

Kabakchiev, A., Metais, B., Ratchev, R., Guyenot, M., Buhl, P., Hossfeld, M., Schuler, X., Metasch, R., and Roellig, M., "Description of the thermo-mechanical properties of a Sn-based solder alloy by a unified viscoplastic material model for Finite Element calculations," 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Ghent, Belgium, Apr. 7-9, 2014, pp. xx-xx.

Kabamoto, Kyohei, Kodaira, Ryutaro, and Hara, Shinjiro, "Magnetization in vertical MnAs/InAs heterojunction nanowires," Journal of Crystal Growth, vol. 464, pp. 80-85, Apr. 15, 2017.

Kaban, I., Khalouk, K., Kohler, M., Hoyer, W., and Gasser, J.-G., "Physical Properties of Sn96.5Ag3.5-Based Solders with Additions of Bi, Ge, and In," Journal of Electronic Materials, vol. 39 no. 1, pp. 70-76, Jan. 2010.

Kaban, I., Gruner, S., and Hoyer, W., "Surface tension and density in liquid Ag-Cu-Sn alloys," Journal of Non-Crystalline Solids, vol. 353 no. 32-40, pp. 3717-3721.

Kadamus, Chris, "Sustainability in Medical Device Design," Medical Device & Diagnostic Industry, vol. 30 no. 9, pp. 42,44-47, Sept. 2008.

Kadesch, Jong S., and Leidecker, Henning, "Effects of Conformal Coat on Tin Whisker Growth," Proceedings of IMAPS Nordic, Sept. 10-13, 2000, pp. 108-116.

Kadesch, Jong S., "Effects of Conformal Coat on Tin Whisker Growth," EEE Links, vol. 6 no. 1, pp. 20-22.

Kadesch, Jong S., and Brusse, Jay, "Electromagnetic Relay Manufacturer Survey," Dec. 1998.

Kadesch, Jong, Bonner, Kirk, Stricland, Mark, and Johnson, Wayne, "Technical Readiness Overview Pb-Free Solder Alloy Investigation,"

Kadesch, Jong S., and Brusse, Jay, "The Continuing Dangers of Tin Whiskers and Attempts to Control Them with Conformal Coating." EEE Links, vol. xx no. xx, pp. xx-xx, July 2001.

Kadhim, N. J., and Mukherjee, D., "Investigation of whisker defects on molecular beam epitaxy grown GaAs layers," Journal of Materials Science Letters, vol. 15 no. 15, pp. 1330-1331, Aug. 1996.

Kadija, I., Abys, J., Fan, C., Stacy, B., Humiec, F., and Boguslavsky, I., "Application-Specific Surface Finishing Techniques for Leadframes," Proceedings AESF SUR/FIN '96, Cleveland, OH, June 10-13, 1996, pp. 459-470.

Kadija, I. V., and Abys, J. A., "Surface Finish for Electronic Packaging with Lead-Free Solders," Proceedings of The International Technical Conference of SUR/FIN, Baltimore, MD, June 26-29, 1995, pp. 553-565.

Kadija, I. V., and Abys, J. A., "Thin Multilayer Coatings for Advanced Processing of Electronic Packages," Proceedings of The International Technical Conference of SUR/FIN, Baltimore, MD, June 26-29, 1995, pp. 157-165.

Kadija, I. V., Abys, J. A., Maisano, J. J., Kudrak, E. J., and Shimada, S., "Thin Multilayer Palladium Coatings For Semiconductor Packaging Applications Part I: Solderability," Plating & Surface Finishing, vol. 82 no. 2, pp. 56-62, Feb. 1995.

Kadiwala, Divyakant, "Surface Treatment Enabling Low-temperature Soldering to Aluminum," Surface Mount Technology (SMT), vol. 34 no. 7, pp. 76,78-83, July 2019.

Kadoguchi, Takuya, Gotou, Keisuke, Yamanaka, Kimihiro, Nagao, Shijo, and Suganuma, Katsuaki, "Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density," Microelectronics Reliability, vol. 55 no. 12 pt. A, pp. 2554-2559, Dec. 2015.

Kadoguchi, Takuya, Take, Naoya, Yamanaka, Kimihiro, Nagao, Shijo, and Suganuma, Katsuaki, "Highly thermostable joint of a Cu/Ni-P plating/Sn-0.7Cu solder added with Cu balls," Journal of Materials Science, vol. 52 no. 6, pp. 3244-3254, Mar. 2017.

Kago, Keitaro, Suetsugu, Kenichiro, Hibino, Shunji, Ikaru, Takashi, Furusawa, Akio, Takano, Hiroaki, Horiuchi, Toshihisa, Ishida, Kenji, Sakaguchi, Takuma, Kikuchi, Shiomi, and Matsushige, Kazumi, "Novel Ultrasonic Soldering Technique for Lead-Free Solders," Materials Transactions, vol. 45 no. 3, pp. 703-709, Mar. 2004.

Kahar, Hardinnawirda, Malek, Zetty Akhtar Abd, Idris, Siti Rabiatull Aisha, and Ishak, Mahadzir, "Intermetallic growth and shear strength of SAC305/EN-Boron," Soldering & Surface Mount Technology, vol. 28 no. 3, pp. 141-148, 2016.

Kahen, K. B., Goldthorpe, Irene A., and Minter, John, "Low temperature II-VI nanowire growth using Au-Sn catalysts," Journal of Crystal Growth, vol. 322 no. 1, pp. 57-62, May 1, 2011.

Kahhat, Ramzy F., and Williams, Eric D., "Adoption and disposition of new and used computers in Lima, Peru," Resources, Conservation and Recycling, vol. 54 no. 8, pp. 501-505, June 2010.

Kahhat, Ramzy, Kim, Junbeum, Xu, Ming, Allenby, Braden, Williams, Eric, and Zhang, Peng, "Exploring e-waste management systems in the United States," Resources, Conservation, and Recycling, vol. 52 no. 7, pp. 955-964, May 2008.

Kahhat, Ramzy F., and Kavazanjian Jr., Edward, "Preliminary Feasibility Study on the Use of Mono-disposal Landfills for E-waste as Temporary Storage for Future Mining," 2010 IEEE International Symposium on Sustainable Systems and Technology, Arlington, VA, May 17-19, 2010, pp. xx-xx.

Kahhat, Ramzy, Kim, Junbeum, Xu, Ming, Allenby, Braden, and Williams, Eric, "Proposal For An e-waste Management System For The United States," 2008 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 19-21, 2008, pp. xx-xx.

Kahng, Sungtek, "Characteristics of the Resonance and Impedance of Power-Bus Structure with the Embedded Metamaterial Substrate," Electrical Design of Advanced Packaging and Systems Symposium, Seoul, Korea, Dec. 10-12, 2008, pp. 16-19.

Kai-Lin, Pan, Bin, Zhou, and Yi-Lin, Yan, "Drop Dynamic Responses and Modal Analysis for Board Level TFBGA," International Symposium on High Density Packaging and Microsystem Integration , Shanghai, China, June 26-28, 2007, pp. xx-xx.

Kai-lin, Pan, Tsai, Bruce, and Yan-peng, Feng, "Experiments on Microstructure, Joint Strength of Sn3Ag0.5Cu, Sn8Zn3Bi versus 63Sn37Pb in High Density Assembly Application," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Kaira, C. Shashank, Singh, Sudhanshu S., Kirubanandham, Antony, and Chawla, Nikhilesh, "Microscale deformation behavior of bicrystal boundaries in pure tin (Sn) using micropillar compression," Acta Materialia, vol. 120, pp. 56-67, Nov. 2016.

Kaiser, A. B., "Metallic behaviour in highly conducting polymers," Synthetic Metals , vol. 45 no. 2, pp. 183-196, Nov. 1991.

Kaja, S., Pickering, H. W., and Bitler, W. R., "Interdiffusion of Electrodeposits with Copper Substrates," American Electroplaters' Society SUR/FIN '82 69th Annual Technical Conference, San Francisco, CA, June 20-24, 1982, session C-4 pp. 1-2.

Kajino, Satoshi, and Asakawa, Motoo, "Effect of additional shear strain layer on microstructure and tensile strength of fine drawn wire," Wire Journal International, vol. 41 no. 1, pp. 58-63, Jan. 2008.

Kajino, Satoshi, and Asakawa, Motoo, "Effect of additional shear strain layer on tensile strength and ductility of fine drawn wire," Wire Journal International, vol. 39 no. 9, pp. 64-68, Sept. 2006.

Kakeshita, Tomoyuki, Shimizu, Ken'ichi, Kawanaka, Ryusuke, and Hasegawa, Tomoharu, "Grain size effect of electro-plated tin coatings on whisker growth," Journal of Materials Science, vol. 17 no. 9, pp. 2560-2566, Sept. 1982.

Kakkerla, Ramesh Kumar, Hsiao, Chih-Jen, Anandan, Deepak, Singh, Sankalp Kumar, Chang, Sheng-Po, Pande, Krishna P., and Chang, Edward Yi, "Growth and Crystal Structure Investigation of InAs/GaSb Heterostructure Nanowires on Si Substrate," IEEE Transactions on Nanotechnology, vol. 17 no. 6, pp. 1151-1158, Nov. 2018.

Kakkerla, Ramesh Kumar, Anandan, Deepak, Hsiao, Chih-Jen, Yu, Hung Wei, Singh, Sankalp Kumar, and Chang, Edward Yi, "Temperature effect on the growth of Au-free InAs and InAs/GaSb heterostructure nanowires on Si substrate by MOCVD," Journal of Crystal Growth, vol. 490, pp. 19-24, May 15, 2018.

Kalantary, M. R., Wilcox, G. D., and Gabe, D. R., "The Production of Compositionally Modulated Alloys by Simulated High Speed Electrodeposition from a Single Solution," Electrochimica Acta, vol. 40 no. 11, pp. 1609-1616, Aug. 1995.

Kalantary, Majid R., "Zinc Alloy Electrodeposition for Corrosion Protection," Plating & Surface Finishing, vol. 81 no. 6, pp. 80-88, June 1994.

Kalhori, H., Irajizad, A., Azarian, A., and Ashiri, R., "Synthesis and characterization of electrochemically grown CdSe nanowires with enhanced photoconductivity," Journal of Materials Science: Materials in Electronics, vol. 26 no. 3, pp. 1395-1402, Mar. 2015.

Kalish, H. S., and Dunkerley, F. J., "The Low-Temperature Properties of Tin and Tin-Lead Alloys," Transactions of the American Institute of Mining and Metallurgical Engineers , vol. 180, pp. 637-656, 1949.

Kallender, Paul, "Lead a Heavy Problem at Industry Meeting," Printed Circuit Fabrication , vol. 24 no. 7, pp. 18, July 2001.

Kallendar, Paul, "Lead is a heavy problem at semi industry meeting," EE Times, May 21, 2001.

Kallender, Paul, "New lead restrictions weigh heavily on industry," Electronic Engineering Times, no. 1168, pp. 22, May 28, 2001.

Kallmayer, Christine, Lin, David, Kloeser, Joachim, Oppermann, Hermann, Zakel, Elke, and Reichl, Herbert, "Fluxless Flip-Chip Attachment Techniques Using the Au/Sn Metallurgy," Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, Oct. 2-4, 1995, pp. 20-28.

Kallmayer, Christine, Oppermann, Hermann, Engelmann, Gunter, Zakel, Elke, and Reichl, Herbert, "Self-Aligning Flip-Chip Assembly Using Eutectic Gold/Tin Solder in Different Atmospheres," Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, Oct. 14-16, 1996, pp. 18-25.

Kalnoskas, Aimee, "The Alpha and Omega of Eco-Design," ECN, vol. xx no. xx, pp. xx-xx, Nov. 15, 2004.

Kalnoskas, Aimee, "The Steps to RoHS Compliance," ECN Supplement, pp. 18, Nov. 2005.

Kam, Pascal, Coppage, Aaron, Kam, Calvin, Shafian, Sharin, Chun, Bong (Steven), and Rhee, Jinny, "Lead-Free, Fluxless Solder Joints to Synthetic Diamond," 2008 ASME International Mechanical Engineering Congress and Exposition, Volume 10 , Boston, MA, Oct. 31-Nov. 6, 2008, pp. 1515-1522.

Kamadziev, Petko R., "The Temperature Dependence of the Thermal EMF of Grey Tin Alloyed with Cadmium," Czechoslovak Journal of Physics, vol. 6 no. 5, pp. 457, Oct. 1956.

Kamal, M., Mikhail, M. S., Bediwi, A. B., and Gouda, El Said, "Decomposition behavior and properties of Sn-9Zn-1Bi lead-free solder alloy with copper contents," Radiation Effects and Defects in Solids, vol. 161 no. 12, pp. 715-721, Dec. 2006.

Kamal, M., Mazen, S. A., and El-Naggar, M. G., "Effect of copper addition on some properties of rapidly solidified lead-free Sn-10 wt% Zn alloys," Radiation Effects and Defects in Solids, vol. 159 no. 5, pp. 335-344, May 2004.

Kamal, Mustafa, and Gouda, El Said, "Decomposition behavior and properties for tin-antimony alloy with bismuth content," Radiation Effects and Defects in Solids, vol. 161 no. 7, pp. 427-431, 2006.

Kamal, Mustafa, and Gouda, El-Said, "Effect of Rapid Solidification on Structure and Properties of Some Lead-Free Solder Alloys," Materials and Manufacturing Processes, vol. 21 no. 8, pp. 736-740, 2006.

Kamal, Mustafa, and Gouda, El Said, "Effect of zinc additions on structure and properties of Sn-Ag eutectic lead-free solder alloy," Journal of Materials Science: Materials in Electronics, vol. 19 no. 1, pp. 81-84, Jan. 2008.

Kamal, Mustafa, and El-Ashram, Tarek, "Microcreep of rapidly solidified Sn–0.7 wt.% Cu-In solder alloys," Materials Science and Engineering: A, vol. 456 no. 1-2, pp. 1-4, May 15, 2007.

Kamal, Mustafa, Mazen, Said, El-Bediwi, Abu Bakr, and Kashita, Eman, "Microstructure, electrical, mechanical and thermal properties of melt-spun bismuth-tin eutectic alloy," Radiation Effects and Defects in Solids , vol. 161 no. 2, pp. 143-148, Feb. 2006.

Kamal, Mustafa, Meikhail, M. S., El-Bediwi, Abu Bakr, and Gouda, El-Said, "New lead-free solder alloy," Radiation Effects and Defects in Solids , vol. 160 no. 7, pp. 301-312, July 2005.

Kamal, Mustafa, Meikhail, M. S., El-Bediwi, Abu Bakr, and Gouda, El-Said, "Structure, electrical, mechanical and wettability of quenched lead-free solder alloys," Radiation Effects and Defects in Solids, vol. 160 no. 1-2, pp. 37-44, Jan.-Feb. 2005.

Kamal, Mustafa, Meikhail, M. S., El-Bediwi, Abu Bakr, and Gouda, El-Said, "Study of structural changes and properties for Sn-Zn9 lead-free solder alloy with addition of different alloying elements," Radiation Effects and Defects in Solids, vol. 160 no. 1-2, pp. 45-52, Jan.-Feb. 2005.

Kamal, Mustafa, and El-Ashram, Tarek, "Zero and negative temperature coefficients of resistivity of rapidly solidified Bi-Sn alloys using melt-spinning technique," Journal of Materials Science: Materials in Electronics, vol. 19 no. 1, pp. 91-96, Jan. 2008.

Kaman, Judit, Bonyar, Attila, Hurtony, Tamas, and Harsanyi, Gabor, "Investigation of Surface Mechanical Properties of the Copper-Solder Interface by Atomic Force Microscopy," 2015 38th International Spring Seminar on Electronics Technology, Eger, Hungary, May 6-10, 2015, pp. 425-430.

Kamara, E., Lua, H., Bailey, C., Hunt, C., Di Maio, D., and Thomas, O., "A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects," Microelectronics Reliability, vol. 50 no. 9-11, pp. 1706-1710, Sept.-Nov. 2010.

Kamara, E., Lu, H., Bailey, C., Thomas, O., Di Maio, D., Hunt, C., and Fulton, I., "Inverse Analysis of Solder Joint Creep Properties," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 275-279.

Kamara, E., Lu, H., Thomas, O., Di Maio, D., Hunt, C., and Fulton, I., "Modelling and Experimental Measurement of Multiple Joint Lead Free Solder Interconnects Subjected to Low Cycle Mechanical Fatigue," 2011 18th European Microelectronics and Packaging Conference, Brighton, United Kingdom, Sept. 12-15, 2011, pp. xx-xx.

Kamara, Elisha, Lu, Hua, Bailey, Chris, Hunt, Chris, Di Maio, Davide, and Thomas, Owen, "Computer Simulation and Design of a Solder Joint Vibration Test Machine," 2010 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems , Bordeaux, France, Apr. 26-28, 2010, pp. xx-xx.

Kamel, R., Mahmoud, S. A., Farid, Z., and El Naquib, N., "Structural relaxation by interphase boundary migration in pure tin," Journal of Materials Science Letters, vol. 2 no. 11, pp. 653-656, Nov. 1983. https://doi.org/10.1007/BF00720389

Kamins, Theodore I., "Integration of Self-Assembled Metal-Catalyzed Semiconductor Nanowires for Sensors and Large-Area Electronics," IEEE Transactions on Electron Devices, vol. 55 no. 11, pp. 3096-3106, Nov. 2008.

Kamitani, M., Koga, T., and Tsuji, H., "Electrodeposition of Bright Zinc-Nickel Alloys," The 72nd AES Annual Technical Conference Proceedings, Detroit, MI, July 1985, session D-2 pp. 1-13.

Kampfert, Marco, and Campbell Jr., Wayne, "The Inspection Connection 2," Advanced Packaging, vol. 14 no. 12, pp. 10-13, Dec. 2005.

Kanagavel, Senthil, Painaik, Mandar, Hurley, James M., and Dhoble, Avin, "Improving Solder Joint Reliability in Pb-free Flip Chips with Advanced Underfill Adhesives," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 2, Orlando, FL, May 31-June 3, 2005, pp. 1475-1479.

Kanani, Nasser, Riedel, Wolfgang, and Rolff, Rolf, "Vergleichende Messungen der Eigenspannungen in chemisch abgeschiedenen Nickeluberzugen," Metalloberflache, vol. 41 no. 6, pp. 255-258, June 1987.

Kanani, Nasser, "Zink-Whisker," Metalloberflache, vol. 52 no. 10, pp. 782-790, Oct. 1998.

Kanayama, Hideyuki, Konishi, Yutaka, Ogawa, Fumio, Itoh, Takamoto, Sakane, Masao, Yamashita, Mitsuo, and Hokazono, Hiroaki, "Effect of additional elements on the low-cycle-fatigue characteristics of Sn-1.0Ag-0.7Cu solder obtained using a miniature-sized specimen," International Journal of Fatigue, vol. 116, pp. 180-191, Nov. 2018.

Kanchanomai, C., Miyashita, Y., and Mutoh, Y. "C*-parameter Approach to Low Cycle Fatigue Crack Growth of Solders," Proceedings of 4th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2002, pp. 385-390.

Kanchanomai, C., and Mutoh, Y., "Effect of temperature on isothermal low cycle fatigue properties of Sn-Ag eutectic solder," Materials Science and Engineering, vol. A381, pp. 113-120, 2004.

Kanchanomai, C., and Mutoh, Y., "Fatigue crack initiation and growth in solder alloys," Fatigue and Fracture of Engineering Materials and Structures, vol. 30 no. 5, pp. 443-457, May 2007.

Kanchanomai, C., Miyashita, Y., Mutoh, Y., and Mannan, S. L., "Influence of frequency on low cycle fatigue behavior of Pb-free solder 96.5Sn-3.5Ag," Materials Science and Engineering, vol. A345, pp. 90-98, 2003.

Kanchanomai, C., Miyashita, Y., Mutoh, Y., and Mannan, S. L., "Low cycle fatigue and fatigue crack growth behaviour of Sn-Ag eutectic solder," Soldering & Surface Mount Technology, vol. 14 no. 3, pp. 30-36, 2002.

Kanchanomai, C., and Mutoh, Y., "Low-Cycle Fatigue Prediction Model for Pb-Free Solder 96.5Sn-3.5Ag," Journal of Electronic Materials, vol. 33 no. 4, pp. 329-333, Apr. 2004.

Kanchanomai, C., Yamamoto, S., Miyashita, Y., Mutoh, Y., and McEvily, A. J., "Low cycle fatigue test for solders using non-contact digital image measurement system," International Journal of Fatigue, vol. 24, pp. 57-67, 2002. https://doi.org/10.1016/S0142-1123(01)00052-4

Kanchanomai, Chaosuan, Miyashita, Yukio, and Mutoh, Yoshiharu, "Low-Cycle Fatigue Behavior and Mechanisms of a Lead-Free Solder 96.5Sn/3.5Ag," Journal of Electronic Materials, vol. 31 no. 2, pp. 142-151, Feb. 2002.

Kanchanomai, Chaosuan, Miyashita, Yukio, and Mutoh, Yoshiharu, "Low-Cycle Fatigue Behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi Lead-Free Solders," Journal of Electronic Materials, vol. 31 no. 5, pp. 456-465, May 2002.

Kanda, Yoshihiko, Oto, Yuji, Shiigi, Yusuke, and Kariya, Yoshiharu, "Effect of Cyclic Strain Hardening Exponent on Fatigue Ductility Exponent for Sn Based Alloy," Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, Volume 2, Portland, OR, July 6-8, 2011, pp. 713-718.

Kanda, Yoshihiko, Kariya, Yoshiharu, and Mochizuki, Yusuke, "Effect of Hold Time on Low Cycle Fatigue Life of Micro Solder Joint," Materials Transactions, vol. 49 no. 7, pp. 1524-1530, July 2008.

Kanda, Yoshihiko, Kariya, Yoshiharu, and Tasaka, Takeshi, "Effect of Strain-Enhanced Microstructural Coarsening on the Cyclic Strain-Hardening Exponent of Sn-Ag-Cu Joints," Materials Transactions , vol. 53 no. 12, pp. 2072-2077, 2012.

Kanda, Yoshihiko, and Kariya, Yoshiharu, "Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test," Microelectronics Reliability , vol. 52 no. 7, pp. 1435-1440, July 2012.

Kanda, Yoshihiko, and Kariya, Yoshiharu, "Influence of Asymmetrical Waveform on Low-Cycle Fatigue Life of Micro Solder Joint," Journal of Electronic Materials, vol. 39 no. 2, pp. 238-245, Feb. 2010.

Kanda, Yoshihiko, Kariya, Yoshiharu, and Oto, Yuji, "Influence of Cyclic Strain-Hardening Exponent on Fatigue Ductility Exponent for a Sn-Ag-Cu Micro-Solder Joint," Journal of Electronic Materials , vol. 41 no. 3, pp. 580-587, Mar. 2012.

Kanda, Yoshihiko, Zama, Kunihiro, Kariya, Yoshiharu, Oota, Hironori, Kikuchi, Shunichi, Yamabe, Hideki, and Nakamura, Kazuhiko, "Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing," 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June 2-5, 2010, pp. xx-xx.

Kane, Amol, Griffen, Eric, and Santos, D. L., "Material Analysis for Lead-Free Manufacturing in a Contract Electronics Manufacturing Environment," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Kane, Amol, Santos, D. L., and Shah, Vatsal, "Pb-Free BGA Solder Ball Attach Assembly Research: A Retrospective of 5 Years of Study," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Kane, Amol, Santos, D. L., and Shah, Vatsal, "Pb-Free BGA Solder Ball Attach Assembly Research: A Retrospective of 5 Years of Study," Lead-Free Magazine, vol. 6, May 2006.

Kane, Amol S., Griffen, Eric P., and Santos, D. L., "RoHS Implementation in a Contract Electronics Manufacturing Environment," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 802-806.

Kane, Sean, Liberman, Ellen, DiViesti, Tony, Click, Felix, and MacDonald, Melanie, "An Examination of the National Highway Traffic Safety Administration and the National Aeronautics and Space Administration Engineering Safety Center Assessment and Technical Evaluation of Toyota Electronic Throttle Control (ETC) Systems and Unintended Acceleration," May 23, 2011.

Kaneko, Daisuke, Inoue, Hirotsugu, Kishimoto, Kikuo, Omiya, Masaki, and Amagai, Masazumi, "Study on Fatigue Strength Characteristics for Solder Joints," 9th International Conference on Electronic Materials and Packaging, Daejon, Korea, Nov. 19-22, 2007, pp. xx-xx.

Kaneko, Hisashi, Kawanoue, Takashi, Hasunuma, Masahiko, and Miyauchi, Masami, "Reliability of Single-Crystal Aluminum Lines and Its Limitation," AIP Conference Proceedings, vol. 305, pp. 179-194, 1994.

Kaneko, Kenji, Usui, Shinya, and Enomoto, Kazuki, "Study on Elastic-Viscoplastic Deformation Behavior of Sn-Pb and Sn-Ag-Cu Solder Alloys," Transactions of the Japan Society of Mechanical Engineers, Part A/Nihon Kikai Gakkai Ronbunshu, A Hen, vol. 73 no. 8, pp. 897-904, Aug. 2007.

Kaneko, Tsutomu, and Kittaka, Shigeyoshi, "Effect of Added Carbon Black on Iron Whisker Growth," Journal of Crystal Growth, vol. 42, pp. 171-174, Dec. 1977.

Kaneko, Tsutomu, "Growth Rate of Iron Whiskers," Journal of Crystal Growth, vol. 44 no. 1, pp. 14-22, Aug. 1978.

Kaneko, Tsutomu, "Growth Rates of Vapor Grown Filaments," Journal of Crystal Growth , vol. 69 no. 1, pp. 1-9, Nov. 1, 1984.

Kaneko, Tsutomu, "In Situ Observations of Iron Whisker Growth Rates," Journal of Crystal Growth, vol. 63 no. 2, pp. 239-243, Oct. 1, 1983.

Kanematsu, Hideyuki, Kobayashi, Tatsumasa, Wada, Noriyuki, and Oki, Takeo, "Alloying Behavior of Tin-Zinc from Stacked Single Layers," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 524-530.

Kanematsu, Hideyuki, Kobayashi, Tatsumasa, Wada, Noriyuki, and Oki, Takeo, "Corrosion Characteristics of Alloy Films Produced By HSSL Process," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 673-682.

Kanematsu, Hideyuki, Kobayashi, Tatsumasa, Wada, Noriyuki, and Oki, Takeo. "The Characteristics of Tin-Nickel Alloy Films Produced from Stacked Single Layers by Heat Treatment," Plating & Surface Finishing, vol. 89 no. 11, pp. 56-60, Nov. 2002.

Kanematsu, Hideyuki, Kobayashi, Tatsumasa, Suzuka, E., and Oki, Takeo, "Thermal Alloying of Tin/Nickel Films as Substitutes for Chromium Plating," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Kanematsu, Hideyuki, Kobayashi, Tatsumasa, Wada, Noriyuki, and Oki, Takeo, "Tin-Nickel Alloy Films Produced from Stacked Single Layers by Heating & Their Characteristics," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 627-636.

Kaneto, Masayuki, Asai, Fumiteru, Eriguchi, Fuyuki, Yamaguchi, Miho, and Hotta, Yuji, "Bare Die Probing with Novel Anisotropic Conductive Film (ACF)," 1999 Proceedings 49th Electronic Components & Technology Conference, San Diego, CA, June 1-4, 1999, pp. 1171-1174.

Kang, Hai-Yong, Ogunseitan, Oladele, Shapiro, Andrew A., and Schoenung, Julie M., "A Comparative Hierarchical Decision Framework on Toxics Use Reduction Effectiveness for Electronic and Electrical Industries," Environmental Science & Technology, vol. 41 no. 2, pp. 373-379, 2007.

Kang, Hai-Yong, and Schoenung, Julie M., "Economic Analysis of Electronic Waste Recycling: Modeling the Cost and Revenue of a Materials Recovery Facility in California," Environmental Science & Technology, vol. 40 no. 5, pp. 1672-1680, 2006.

Kang, Hai-Yong, and Schoenung, Julie M., "Electronic waste recycling: A review of U.S. infrastructure and technology options," Resources, Conservation, and Recycling, vol. 45 no. 4, pp. 368-400, Dec. 2005.

Kang, Hai-Yong, and Schoenung, Julie M., "End-of-Life Personal Computer Systems in California: Analysis of Emissions and Infrastructure Needed to Recycle in the Future," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 321-325.

Kang, Han-Byul, Bae, Jee-Hwan, Lee, Jae-Wook, Park, Min-Ho, Yoon, Jeong-Won, Jung, Seung-Boo, and Yang, Cheol-Woong, "Characterization of Interfacial Reaction Layers Formed Between Sn-3.5Ag Solder and Electroless Ni-Immersion Au-Plated Cu Substrates," Journal of Electronic Materials, vol. 37 no. 1, pp. 84-89, Jan. 2008.

Kang, Han-Byul, Bae, Jee-Hwan, Lee, Jae-Wook, Park, Min-Ho, Lee, Young-Chul, Yoon, Jeong-Won, Jung, Seung-Boo, and Yang, Cheol-Woong, "Control of interfacial reaction layers formed in Sn-3.5Ag-0.7Cu/electroless Ni-P solder joints," Scripta Materialia, vol. 60 no. 4, pp. 257-260, Feb. 2009.

Kang, Han-Byul, Bae, Jee-Hwan, Yoon, Jeong-Won, Jung, Seung-Boo, Park, Jongwoo, and Yang, Cheol-Woong, "In situ TEM characterization of interfacial reaction in Sn-3.5Ag/electroless Ni(P) solder joint," Scripta Materialia, vol. 64 no. 7, pp. 597-600, Apr. 2011.

Kang, Han-Byul, Lee, Jae-Wook, Bae, Jee-Hwan, Park, Min-Ho, Yoon, Jeong-Won, Jung, Seung-Boo, Ju, Jae-Seon, and Yang, Cheol-Woong, "Initial interfacial reaction layers formed in Sn-3.5Ag solder/electroless Ni-P plated Cu substrate system," Journal of Materials Research, vol. 23 no. 8, pp. 2195-2201, Aug. 2008.

Kang, Han-Byul, Bae, Jee-Hwan, Yoon, Jeong-Won, Jung, Seung-Boo, Park, Jongwoo, and Yang, Cheol-Woong, "Microstructure of interfacial reaction layer in Sn-Ag-Cu/electroless Ni (P) solder joint," Journal of Materials Science: Materials in Electronics , vol. 22 no. 9, pp. 1308-1312, Sept. 2011.

Kang, Hanbyul, Lee, Miji, Park, Sangkwon, Ha, Sangsu, Kim, Gunrae, Shin, Sangchul, and Pae, Sangwoo, "Characterization of plate-like Ni-Sn intermetallic compounds in Sn-Ag solder bump," 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits, Chengdu, China, July 4-7, 2017, pp. xx-xx.

Kang, Hanbyul, Lee, Miji, Sun, Dongyoon, Pae, Sangwoo, and Park, Jongwoo, "Formation of octahedral corrosion products in Sn?Ag flip chip solder bump," Scripta Materialia, vol. 108, pp. 126-129, Nov. 2015.

Kang, Hee-do, Kim, Hyun, and Yook, Jong-Gwan, "Analysis of Signal Integrity/Power Integrity in Multilayer Printed Circuit Board and Two Improving Methods," Electrical Design of Advanced Packaging and Systems Symposium, Seoul, Korea, Dec. 10-12, 2008, pp. 210-213.

Kang, In-Byeong, Haskard, Malcolm R., and Ju, Byeong-Kwon, "An assembly and interconnection technology for micromechanical structures using a anisotropic conductive film," Proceedings of SPIE - The International Society for Optical Engineering, Volume 2879, Austin, TX, Oct. 14, 1996, pp. 280-287.

Kang, In-Byeong, Haskard, Malcolm R., and Samaan, Noel D., "The application of anisotropic conductive films for realisation of interconnects in micromechanical structures," Proceedings of SPIE - The International Society for Optical Engineering, Volume 3321, Bangalore, India, Dec. 11-14, 1996, pp. 233-238.

Kang, In-Soo, Lee, Jun-Kyu, Jung, Gi-Jo, Park, Yun-Mook, and Kim, Byeung-Gee, "Development of Wafer Level Package of Normal and High Pin Count Devices for Mobile Applications," Chip Scale Review, vol. 14 no. 1, pp. 10-11,30-32, Jan.-Feb. 2010.

Kang, J. R., Song X. G., Hu, S. P., Liu, D., Guo, W. J., Fu, W., and Cao, J., "Wetting and Brazing of Alumina by Sn0.3Ag0.7Cu-Ti Alloy," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science , vol. 48 no. 12, pp. 5870-5878, Dec. 2017.

Kang, J. S., Gagliano, R. A., Ghosh, G., and Fine, W. E., "Isothermal Solidification of Cu/Sn Diffusion Couples to Form Thin-Solder Joints," Journal of Electronic Materials, vol. 31 no. 11, pp. 1238-1243, Nov. 2002.

Kang, K., and Cai, W., "Brittle and ductile fracture of semiconductor nanowires - molecular dynamics simulations," Philosophical Magazine, vol. 87 no. 14-15. pp. 2169-2189, May 11, 2007.

Kang, K. I., Jung, J. P., Bang, W. H., Park, J. H., and Oh, K. H., "Bending Fatigue Characteristic of Sn-3.5Ag solder bump on Ni-UBM," Materials Science Forum, vol. 580-582, pp. 177-182, 2008.

Kang, Namhyun, Na, Hye Sung, Kim, Seong Jun, and Kang, Chung Yun, "Alloy design of Zn-Al-Cu solder for ultra high temperatures," Journal of Alloys and Compounds, vol. 467 no. 1-2, pp. 246-250, Jan. 7, 2009.

Kang, Ning, Huang, Mingliang, Zhou, Qiang, and Ma, Haitao, "Mechanical Properties and Electrochemical Corrosion Behavior of Al-Cu Solder Joint with Sn-Zn Based Solder," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 333-337.

Kang, S. K., Buchwalter, S., and Tsang, C., "Characterization of Electroplated Bismuth-Tin Alloys for Electrically Conducting Materials," Journal of Electronic Materials, vol. 29 no. 10, pp. 1278-1283, Oct. 2000.

Kang, S. K., Buchwalter, S., LaBianca, N., Gelorme, J., Purushothaman, S., Papathomas, K., and Poliks, M., "Development of Conductive Adhesive Materials for Via Fill Applications," 2000 Proceedings 50th Electronic Components & Technology Conference , Las Vegas, NV, May 21-24, 2000, pp. 887-891.

Kang, S. K., Rai, R., and Purushothaman, S., "Development of High Conductivity Lead (Pb)-Free Conducting Adhesives," 1996 Proceedings 46th Electronic Components & Technology Conference , Orlando, FL, May 28-31, 1996, pp. 565-570.

Kang, S. K., Shih, D. Y., Fogel, K., Lauro, P., Yim, M. J., Advocate, G., Griffin, M., Goldsmith, C., Henderson, D. W., Gosselin, T., King, D., Konrad, J., Sarkhel, A., and Puttlitz, K.J., "Interfacial Reaction Studies on Lead (Pb)-Free Solder Alloys," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 448-454.

Kang, S. K., Rai, R. S., and Purushothaman, S., "Interfacial Reactions During Soldering with Lead-Tin Eutectic and Lead (Pb)-Free, Tin-Rich Solders," Journal of Electronic Materials, vol. 25 no. 7, pp. 1113-1120, July 1996.

Kang, S. K., Choi, W. K., Shih, D. Y., Lauro, P., Henderson, D. W., Gosselin, T., and Leonard, D. N., "Interfacial Reactions, Microstructure and Mechanical Properties of Pb-free Solder Joints in PBGA Laminates," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 146-153.

Kang, S. K., Lauro, P. A., Shih, D.-Y., Henderson, D. W., and Puttlitz, K. J., "Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications," IBM Journal of Research and Development, vol. 49 no. 4/5, pp. 607-620, July/Sept. 2005.

Kang, S. K., Graham, T., Purushothaman, S., Roldan, J., and Saraf, R., "New High Conductivity Lead (Pb)-Free Conducting Adhesives," Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment , Orlando, FL, May 1-3, 1995, pp. 177-181.

Kang, S. K., Horkans, J., Andricacos, P. C., Carruthers, R. A., Cotte, J., Datta, M., Gruber, P., Harper, J. M. E., Kwietniak, K., Sambucetti, C., Shi, L., Brouillette, G., and Danovitch, D., "Pb-Free Solder Alloys for Flip Chip Applications," 1999 Proceedings 49th Electronic Components & Technology Conference, San Diego, CA, June 1-4, 1999, pp. 283-288.

Kang, S. K., Choi, W. K., Yim, M. J., and Shih, D. Y., "Studies of the Mechanical and Electrical Properties of Lead-Free Solder Joints," Journal of Electronic Materials, vol. 31 no. 11, pp. 1292-1303, Nov. 2002.

Kang, S. K., and Purushothaman, S., "Study of Interfacial Reactions Between Tin and Copper by Differential Scanning Calorimetry," Journal of Electronic Materials, vol. 27 no. 11, pp. 1199-1204, Nov. 1998.

Kang, Suk Chae, Kim, Chunho, Muncy, Jennifer, Schmidt, Michael, and Baldwin, Daniel, "Experimental Wetting Dynamics Study Of Eutectic And Lead-Free Solders Varying Flux, Temperature and Surface Finish Metallization," IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium, San Jose, CA, July 14-16, 2004, pp. 56-63.

Kang, Suk Chae, Kim, Chunho, Muncy, Jennifer, and Baldwin, Daniel F., "Experimental Wetting Dynamics Study of Eutectic and Lead-Free Solders With Various Fluxes, Isothermal Conditions, and Bond Pad Metallizations," IEEE Transactions on Advanced Packaging, vol. 28 no. 3, pp. 465-474, Aug. 2005.

Kang, Suk Chae, Kim, Chunho, Muncy, Jennifer, Schmidt, Michael, Lee, Sangil, and Baldwin, Daniel, "Wetting Dynamics of Eutectic and Lead-Free Solders with Various Reflow Conditions and Surface Finish Metallizations," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 832-842.

Kang, Sung K., Choi, Won Kyoung, Shih, Da-Yuan, Henderson, Donald W., Gosselin, Timothy, Sarkhel, Amit, Goldsmith, Charles, and Puttlitz, Karl J., "Ag3Sn Plate Formation in the Solidification of Near-Ternary Eutectic Sn-Ag-Cu," JOM, vol. 55 no. 6, pp. 61-65, June 2003.

Kang, Sung K., Gruber, Peter, and Shih, Da-Yuan, "An Overview of Pb-free, Flip-Chip Wafer-Bumping Technologies," JOM , vol. 60 no. 6, pp. 66-70, June 2008.

Kang, Sung K., Shih, Da-Yuan, Leonard, Donovan, Henderson, Donald W., Gosselin, Timothy, Cho, Sung-Il, Yu, Jin, and Choi, Won K., "Controlling Ag3Sn Plate Formation in Near-Ternary-Eutectic Sn-Ag-Cu Solder by Minor Zn Alloying," JOM, vol. 56 no. 6, pp. 34-38, June 2004.

Kang, Sung K., Cho, Moon Gi, Shih, Da-Yuan, Seo, Sun-Kyoung, and Lee, Hyuck Mo, "Controlling the Interfacial Reactions in Pb-free Interconnections by Adding Minor Alloying Elements to Sn-rich Solders," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 478-484.

Kang, Sung K., Cho, Moon Gi, Lauro, Paul, and Shih, Da-Yuan, "Critical Factors Affecting the Undercooling of Pb-free, Flip-Chip Solder Bumps and In-situ Observation of Solidification Process," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1597-1603.

Kang, Sung K., and Purushothaman, S., "Development of Conducting Adhesive Materials for Microelectronic Applications," Journal of Electronic Materials, vol. 28 no. 11, pp. 1314-1318, Nov. 1999.

Kang, Sung K., Buchwalter, Stephen L., LaBianca, Nancy C., Gelorme, J., Purushothaman, Sampath, Papathomas, K., and Poliks, M., "Development of Conductive Adhesive Materials for via Fill Applications," IEEE Transactions on Components and Packaging Technologies, vol. 24 no. 3, pp. 431-435, Sept. 2001.

Kang, Sung K., Rai, Rajinder S., and Purushothaman, Sampath, "Development of High Conductivity Lead (Pb)-Free Conducting Adhesives," IEEE Transactions on Components, Packaging, and Manufacturing Technology-- Part A, vol. 21 no. 1, pp. 18-22, Mar. 1998.

Kang, Sung K., and Purushothaman, S., "Development of Low Cost, Low Temperature Conductive Adhesives," 1998 Proceedings 48th Electronic Components & Technology Conference, Seattle, WA, May 25-28, 1998, pp. 1031-1035.

Kang, Sung K., and Purushothaman, S., "Development of Low Cost, Low Temperature Conductive Adhesives," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 287.

Kang, Sung K., "Developments in Lead-Free Solders and Soldering Technology," JOM , vol. 54 no. 6, pp. 25, June 2002.

Kang, Sung K., Lauro, Paul, Shih, Da-Yuan, Henderson, Donald W., Gosselin, Timothy, Bartelo, Jay, Cain, Steve R., Goldsmith, Charles, Puttlitz, Karl J., and Hwang, Tae-Kyung, "Evaluation of Thermal Fatigue Life and Failure Mechanisms of Sn-Ag-Cu Solder Joints with Reduced Ag Contents," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 661-667.

Kang, Sung K., Choi, Won Kyoung, Shih, Da-Yuan, Henderson, Donald W., Gossefin, Timothy, Sarkhel, Amit, Goldsmith, Charles, and Puttlitz, Karl J., "Formation of Ag3Sn Plates in Sn-Ag-Cu Alloys and Optimization of their Alloy Composition," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 64-70.

Kang, Sung K., Shih, D. Y., Fogel, K., Lauro, P., Yim, Myung-Jin, Advocate Jr., Gerald G., Griffin, M., Goldsmith, C., Henderson, Donald W., Gosselin, Timothy A., King, David E., Konrad, John J., Sarkhel, Amit, and Puttlitz, Karl J., "Interfacial Reaction Studies on Lead (Pb)-Free Solder Alloys," IEEE Transactions on Electronics Packaging Manufacturing, vol. 25 no. 3, pp. 155-161, July 2002.

Kang, Sung K., Leonard, Donovan, Shih, Da-Yuanm and Gignac, Lynne, "Interfacial Reactions of Sn-Ag-Cu Solders Modified by Minor Zn Alloying Addition," IBM Research Report RC 23558, Mar. 9, 2005.

Kang, Sung K., Leonard, Donovan, Shih, Da-Yuan, Gignac, Lynne, Henderson, D. W., Cho, Sungil, and Yu, Jin, "Interfacial Reactions of Sn-Ag-Cu Solders Modified by Minor Zn Alloying Addition," Journal of Electronic Materials, vol. 35 no. 3, pp. 479-485, Mar. 2006.

Kang, Sung K., and Sarkhel, Amit K., "Lead (Pb)-Free Solders for Electronic Packaging," Journal of Electronic Materials, vol. 23 no. 8, pp. 701-707, Aug. 1994.

Kang, Sung K., Chang, Jaewon, Lee, Jae-Ho, Kim, Keun-Soo, and Lee, Hyuck Mo, "Plastic Deformation Effect on Sn Whisker Growth in Electroplated Sn and Sn-Ag Solders," 2013 IEEE 63rd Electronic Components and Technology Conference , Las Vegas, NV, May 28-31, 2013, pp. 1018-1023.

Kang, Sung K., "Recent Progress in Lead (Pb)-Free Solders and Soldering Technology," IBM.

Kang, Sung K., "Recent Progress in Pb-Free Solders and Soldering Technologies," JOM , vol. 53 no. 6, pp. 16, June 2001.

Kang, Sung K., Cho, M. G., Lauro, P., and Shih, Da-Yuan, "Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process," Journal of Materials Research , vol. 22 no. 3, pp. 557-560, Mar. 2007.

Kang, Sung K., Lauro, Paul, Shih, Da-Yuan, Henderson, Donald W., Bartelo, Jay, Gosselin, Timothy, Cain, Steve R., Goldsmith, Charles, Puttlitz, Karl, Hwang, Tae K., and Choi, Won K., "The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints," Materials Transactions, vol. 45 no. 3, pp. 695-702, Mar. 2004.

Kang, T. Y., Xiu, Y. Y., Liu, C. Z., Hui, L., Wang, J. J., and Tong, W. P., "Bismuth segregation enhances intermetallic compound growth in SnBi/Cu microelectronic interconnect," Journal of Alloys and Compounds, vol. 509 no. 5, pp. 1785-1789, Feb. 3, 2011.

Kang, T. Y., Xiu, Y. Y., Hui, L., Wang, J. J., Tong, W. P., and Liu, C. Z., "Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect," Journal of Materials Science and Technology, vol. 27 no. 8, pp. 741-745, Aug. 2011.

Kang, Tianyou, Xiu, Yuyan, Xu, Bo, Liu, Chunzhong, and Tong, Weiping, "Effect of Ni addition on the formation and growth of intermetallic compound at eutectic SnBi/Cu interface," Advanced Materials Research, vol. 160-162, pp. 709-714, 2011.

Kang, Un-Byoung, and Kim, Young-Ho, "A New COG Technique Using Low Temperature Solder Bumps for LCD Driver IC Packaging Applications," IEEE Transactions on Components and Packaging Technologies, vol. 27 no. 2, pp. 253-258, June 2004.

Kang, Un-Byoung, and Kim, Young-Ho, "The Microstructure Characterization of Ultrasmall Eutectic Bi-Sn Solder Bumps on Au/Cu/Ti and Au/Ni/Ti Under-Bump Metallization," Journal of Electronic Materials, vol. 33 no. 1, pp. 61-69, Jan. 2004.

Kang, Xuejing, Li, Yujun, Yang, D. G., and Qin, L. C., "Study on the Board Level Reliability of Lead-free PBGA Packages," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Kang, Yongmin, and Vaddiraju, Sreeram, "Solid-State Phase Transformation as a Route for the Simultaneous Synthesis and Welding of Single-Crystalline Mg2Si Nanowires," Chemistry of Materials, vol. 26 no. 9, pp. 2814-2819, May 13, 2014.

Kang, Youn-Bae, and Pelton, Arthur D., "Modeling short-range ordering in liquids: The Mg-Al-Sn system," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. xx no. x, pp. xx-xx, xxxx.

Kangasvieri, T., Nousiainen, O., Putaala, J., Rautioaho, R., and Vahakangas, J., "Reliability and RF performance of BGA solder joints with plastic-core solder balls in TLCC/PWB assemblies," Microelectronics Reliability, vol. xx no. xx, pp. xx-xx, 2005.

Kangooie, M., Mahmudi, R., and Geranmayeh, A. R., "Impression Creep of a Lead-Free Sn-1.7Sb-1.5Ag Solder Reinforced by Submicron-Size Al2O3 Particles," Journal of Electronic Materials, vol. 39 no. 2, pp. 215-222, Feb. 2010.

Kanjanupathum, Theeraphong, Piriyapanyaporn, Siriwat, Leeluckarenon, Pacharin, Chanwiboon, Dussanee, and Ng, Teng Hoon, "Lead Free Discrete Test Vehicle Reliability," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 411-416.

Kanjanupathum, Theeraphong, Ng, Teng Hoon, and Stanczak, Adam, "New Solder Attach in Area Array Connector: Assessing the Reliability of Solder Charge SMT Assembly," South East Asia Technical Training Conference on Electronics Assembly Technologies 2011 Proceedings, Penang, Malaysia, May 19-20, 2011, pp. xx-xx.

Kanjilal, Anwesha, and Kumar, Praveen, "Growth of Interfacial Intermetallic Compound Layer in Diffusion-Bonded SAC-Cu Solder Joints During Different Types of Thermomechanical Excursion," Journal of Electronic Materials, vol. 47 no. 1, pp. 457-469, Jan. 2018.

Kanjilal, Anwesha, and Kumar, Praveen, "Insights into Growth Behavior of Intermetallic Compounds in Sn-Ag-Cu Solder Joints during Mechanical and Thermo-Mechanical Deformation Processes," 2019 IEEE 21st Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 4-6, 2019, pp. 48-52.

Kanlayasiri, Kannachai, "Effects of In Addition on Solidus and Liquidus Temperatures, Microhardness, and Wettability of Sn-0.3Ag-0.7Cu Solder Alloy," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Kanlayasiri, Kannachai, and Sukpimai, Kamtorn, "Effects of indium on the intermetallic layer between low-Ag SAC0307-xIn lead-free solders and Cu substrate," Journal of Alloys and Compounds , vol. 668, pp. 169-175, May 25, 2016.

Kanlayasiri, Kannachai, Mongkolwongrojn, Mongkol, and Ariga, Tadashi, "Influence of indium addition on characteristics of Sn-0.3Ag-0.7Cu solder alloy," Journal of Alloys and Compounds, vol. 485 no. 1-2, pp. 225-230, Oct. 19, 2009.

Kanlayasiri, Kannachai, and Ariga, Tadashi, "Influence of thermal aging on microhardness and microstructure of Sn-0.3Ag-0.7Cu-xIn lead-free solders," Journal of Alloys and Compounds , vol. 504 no. 1, pp. L5-L9, Aug. 13, 2010.

Kannabiran, Anand, Pannerselvam, Elavarasan T., and Ramkumar, S. Manian, "Forward and Backward Compatibility of Solder Alloys With Component and Board Finishes," IEEE Transactions on Electronics Packaging Manufacturing , vol. 30 no. 2, pp. 138-146, Apr. 2007.

Kannabiran, Anand, P, Elavarasan T., Penmatsa, Sreekanth Varma, Ramkumar, S. Manian, and Anson, Scott, "Investigating the Applicability of Auto-focus Option for Optimal Oven Recipe Selection for Pb-Free Reflow Soldering," Lead-Free Magazine, vol. 7, Nov. 2006.

Kannabiran, Anand, Pannerselvam, Elavarasan T., and Ramkumar, S. Manian, "Investigation of the Forward and Backward Compatibility of Solder Alloys with Component Finishes for HASL and OSP PCB Finish," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 566-570.

Kannojia, Harindra Kumar, and Dixit, Pradeep, "Experimental investigations in the intermetallic and microvoid formation in sub-200 °C Cu-Sn bonding," Journal of Materials Science: Materials in Electronics, vol. 30 no. 17, pp. 16427-16438, Sept. 2019.

Kano, Takahiro, Shohji, Ikuo, Tsuchida, Tetsuyuki, and Ookubo, Toshikazu, "Effect of Thickness of Pd Plating Layer on Shear Strength of Lead-free Solder Ball Joint with Electroless Ni/Pd/Au Plated Electrode," Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, Volume 2, Portland, OR, July 6-8, 2011, pp. 663-666.

Kantarcioglu, A., and Kalay, Y. E., "Effects of Al and Fe additions on microstructure and mechanical properties of SnAgCu eutectic lead-free solders," Materials Science and Engineering: A , vol. 593, pp. 79-84, Jan. 21, 2014.

Kante, I., Andreazza, P., Andreazza, C., Devers, T., Allam, L., and Fleury, V., "Structure and atoms mixing in electrodeposited Sn(Au) nanoaggregates," Journal of Crystal Growth, vol. 277 no. 1-4, pp. 599-607, Apr. 15, 2005.

Kantola, K., and Tenno, R., "Machine vision in detection of corrosion products on SO2 exposed ENIG surface and an in situ analysis of the corrosion factors," Journal of Materials Processing Technology, vol. 209 no. 5, pp. 2707-2714, Mar. 1, 2009.

Kanzawa, Osamu, and Takahashi, Makoto, "Establishment of Global Recycle Network," Fujitsu Scientific and Technical Journal, vol. 41 no. 2, pp. 242-250, July 2005.

Kao, Bill, Oezkoek, Mustafa, and Roberts, Hugh, "Pure Palladium in ENEPIG Surface Finishes - Physical properties of the Pd deposition and their influence on soldering and wire bonding," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Kao, C. R., Chuang, H. Y., Chen, W. M., Yang, T. L., Kuo, M. S., Chen, Y. J., Yu, J. J., and Li, C. C., "Soldering Reactions under Space Confinement for 3D IC Applications," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 724-728.

Kao, C. Robert, "Cross-Interaction Between Cu and Ni in Lead-Free Solder Joints," 2006 Lead-Free Technology Workshop, San Antonio, TX, Mar. 12, 2006, pp. xx-xx.

Kao, C. Robert, "Lead-Free and Lead-Bearing Electronic Solders: Implementation, Reliability, and New Technology," JOM, vol. 60 no. 6, pp. 60, June 2008.

Kao, Chin-Li, and Chen, Tei-Chen, "Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes," Microelectronics Reliability, vol. 82, pp. 204-212, Mar. 2018.

Kao, Frank, Tseng, Zhi Hao, Ho, Chun Sheng, Chen, Stan, Lan, Chang-Yi, and Chien, Feng Lung, "A Study of Board Level Reliability Test with Bump Structure of WLCSP Lead-Free Solder Joints," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 323-326.

Kao, H. J., Wu, W. C., Tsai, S. T., and Liu, C. Y., "Effect of Cu Additives on Sn Whisker Formation of Sn(Cu) Finishes," Journal of Electronic Materials, vol. 35 no. 10, pp. 1885-1891, Oct. 2006.

Kao, Ming Tsung, and Lin, Jen Fin, "Effects of deposition conditions of the Al film in Al/glass specimens and annealing conditions on internal stresses and hillock formations," Thin Solid Films, vol. 520 no. 16, pp. 5353-5360, June 1, 2012.

Kao, Nicholas, Hu, Yen-Chang, Tseng, Yuan-Lin, Chen, Eason, Lai, Jeng-Yuan, and Wang, Yu-Po, "Cu Pillar Bump FCBGA Package Design and Reliability Assessments," 2008 ASME International Mechanical Engineering Congress and Exposition, Volume 6 , Boston, MA, Oct. 31-Nov. 6, 2008, pp. 177-182.

Kao, Szu-Tsung, Lin, Yung-Chi, and Duh, Jenq-Gong, "Controlling Intermetallic Compound Growth in SnAgCu/Ni-P Solder Joints by Nanosized Cu6Sn5 Addition," Journal of Electronic Materials, vol. 35 no. 3, pp. 486-493, Mar. 2006.

Kao, Szu-Tsung, and Duh, Jenq-Gong, "Effect of Cu Concentration on Morphology of Sn-Ag-Cu Solders by Mechanical Alloying," Journal of Electronic Materials, vol. 33 no. 12, pp. 1445-1451, Dec. 2004.

Kao, Szu-Tsung, and Duh, Jenq-Gong, "Interfacial Reactions and Compound Formation of Sn-Ag-Cu Solders by Mechanical Alloying on Electroless Ni-P/Cu Under Bump Metallization," Journal of Electronic Materials, vol. 34 no. 8, pp. 1129-1134, Aug. 2005.

Kapadia, Naim, "JJS Electronics LTD Process in Control for RoHS Compliant Product," SMART/LEADOUT Lead-Free Implementation Seminar, Leicestershire, United Kingdom, May 23, 2006.

Kaprinidis, Nikolas, and Fuchs, Sabine, "Halogen Free Flame Retardant Systems for Printed Circuit Boards," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. P-06.

Kaprinidis, Nikolas, and Fuchs, Sabine, "Halogen Free Flame Retardant Systems for Printed Circuit Boards," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Kapudia, Naim, "TOWARDS a RoHSy future - the final furlong," Electronics Manufacture and Test, vol. xx no. x, pp. xx-xx, June 2006.

Kar, A., Ghosh, M., Majumdar, B. S., Ghosh, R. N., and Ray, A. K., "Interfacial microstructure, shear strength and electrical conductivity of Sn-3.5Ag-0.5In/Cu lead free soldered joints," Materials Technology , vol. 22 no. 3, pp. 161-165, Sept. 2007.

Kar, Abhijit, Ghosh, Mainak, Ray, Ajoy Kumar, and Ghosh, Rabindra Nath, "Effect of copper addition on the microstructure and mechanical properties of lead free solder alloy," Materials Science and Engineering: A, vol. 459 no. 1-2, pp. 69-74, June 25, 2007.

Kar, Abhijit, Ghosh, Mainak, Ghosh, Rabindra N., Majumdar, Bhaskar S., and Ray, Ajoy K., "Evolution of mechanical and electrical properties of tin-lead and lead free solder to copper joint interface," Materials Letters, vol. 62 no. 1, pp. 151-154, Jan. 15, 2008.

Kar, Yap Boon, Hui, Tan Cai, Agileswari, Ramasamy, and Lo, Calvin, "Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests," Microelectronics Reliability, vol. 53 no. 1, pp. 164-173, Jan. 2013.

Kar, Yap Boon, Talik, Noor Azrina, Sauli, Zaliman, Fei, Jean Siow, and Retnasamy, Vithyacharan, "Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS," Microelectronics International, vol. 30 no. 1, pp. 14-18, 2013.

Kar, Yap Boon, Hui, Tan Cai, Agileswari, , and Lo, Calvin, "Reliability Study on the Polymer Core Solder Balls under Multiple Reflow and HTS Stress Tests," South East Asia Technical Training Conference on Electronics Assembly Technologies 2012 Proceedings, Penang, Malaysia, Apr. 18-20, 2012, pp. xx-xx.

Kar, Yap Boon, Hui, Tan Cai, Agileswari, , and Lo, Calvin, "Solder Ball Robustness Study on Polymer Core Solder Balls for BGA Packages," 2012 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Nov. 6-8, 2012, pp. xx-xx.

Karaboga, Firat, Ulgen, Asaf Tolga, Yetis, Hakan, Akdogan, Mustafa, Pakdil, Murat, and Belenli, Ibrahim, "Mechanical properties and uniformity of Fe-MgB2 wires upon various wire drawing steps," Materials Science and Engineering: A, vol. 721, pp. 89-95, Apr. 4, 2018.

Karagiannidis, Avraam, Perkoulidis, George, Papadopoulos, Agis, Moussiopoulos, Nicolas, and Tsatsarelis, Thomas, "Characteristics of wastes from electric and electronic equipment in Greece: results of a field survey," Waste Management and Research, vol. 23 no. 4, pp. 381-388, Aug. 2005.

Karajgikar, Saket, Nagaraj, Vishal, Agonafer, Dereje, and Pekin, Senol, "Flip Chip Back End Design Parameters to Reduce Bump Electromigration," 2008 Proceedings 58th Electronic Components & Technology Conference , Lake Buena Vista, FL, May 27-30, 2008, pp. 347-353.

Karakose, Ercan, Kilicaslan, M. Fatih, and Colak, Hakan, "Formation of novel rice-like intermetallic phases and changes in the mechanical, microstructural and electrical properties of Sn-5Sb alloys with addition Ag and Bi," Journal of Alloys and Compounds, vol. 655, pp. 378-388, Jan. 15, 2015.

Karalias, George, "Anti-Counterfeiting Protective Measures," Surface Mount Technology (SMT), vol. 25 no. 3, pp. 14,16-17, May/June 2010.

Karavakis, Konstantine (Gus), and Bertling, Silvio, "Conductive Anodic Filament (CAF): The Threat to Miniaturization of the Electronics Industry," CircuiTree, vol. 17 no. 12, pp. xx-xx, Dec. 2004.

Karbassian, F., Mousavi, B. Kheyraddini, Rajabali, S., Talei, R., Mohajerzadeh, S., and Asl-Soleimani, E., "Formation of Luminescent Silicon Nanowires and Porous Silicon by Metal-Assisted Electroless Etching," Journal of Electronic Materials , vol. 43 no. 4, pp. 1271-1279, Apr. 2014.

Kardos, Slavomir, Pietrikova, Alena, and Somora, Milos, "Utilization of Anisotropic Adhesive Joints as an Alternative to Standard SnPb Solder Joints," 29th International Spring Seminar on Electronics Technology, St. Marienthal, Germany, May 10-14, 2006, pp. 465-468.

Karim, Zaheed S., and Schetty, Rob, "Lead-Free Bump Interconnections for Flip-Chip Applications," Twenty-Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium, Santa Clara, CA, Oct. 2-3, 2000, pp. 274-278.

Karim, Zaheed S., and Martin, Jim, "Lead-Free Solder Bump Technologies for Flip-Chip Packaging Applications," 2001 Advanced Packaging Technology Conference Proceedings, 2001, pp. xx-xx.

Karim, Zaheed S., and Martin, Jim, "Lead-Free Solder Bump Technologies for Flip-Chip Packaging Applications," Proceedings 2001 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4587), Baltimore, MD, Oct. 9-11, 2001, pp. 581-587.

Kariya, Yoshiharu, Morihata, Tomoo, Hazawa, Eisaku, and Otsuka, Masahisa, "Assessment of Low-Cycle Fatigue Life of Sn-3.5mass%Ag-X (X=Bi or Cu) Alloy by Strain Range Partitioning Approach," Journal of Electronic Materials , vol. 30 no. 9, pp. 1184-1189, Sept. 2001.

Kariya, Yoshiharu, and Otsuka, Mashahisa, "Current Soldering Technology and Reliability Issue in Lead-Free Solder for Electronic Assembly," Yosetsu Gakkai Shi/Journal of the Japan Welding Society, vol. 69 no. 2, pp. 14-18, Mar. 2000.

Kariya, Yoshiharu, Hirata, Yasunori, Warashina, Kenji, and Otsuka, Masahisa, "Effect of Additional Element (Bi and Cu) on the Thermal Fatigue Strength of QFP/Sn-3.5Ag Solder Joint," Advances in Electronic Packaging 1999, Volume 1, Maui, Hawaii, June 13-19, 1999, pp. 173-180.

Kariya, Yoshiharu, and Otsuka, Masahisa, "Effect of Bismuth on the Isothermal Fatigue Properties of Sn-3.5mass%Ag Solder Alloy," Journal of Electronic Materials, vol. 27 no. 7, pp. 866-870, July 1998.

Kariya, Yoshiharu, Sato, Kana, Asari, Shota, and Kanda, Yoshihiko, "Effect of Joint Size on Low-cycle Fatigue Properties of Sn-Ag-Cu Solder Joint," 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June 2-5, 2010, pp. xx-xx.

Kariya, Yoshiharu, Hosoi, Takuya, Terashima, Shinichi, Tanaka, Masamoto, and Otsuka, Masahisa, "Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects," Journal of Electronic Materials, vol. 33 no. 4, pp. 321-328, Apr. 2004.

Kariya, Yoshiharu, Hirata, Yasunori, and Otsuka, Masahisa, "Effect of Thermal Cycles on the Mechanical Strength of Quad Flat Pack Leads/Sn-3.5Ag-X (X = Bi and Cu) Solder Joints," Journal of Electronic Materials, vol. 28 no. 11, pp. 1263-1269, Nov. 1999.

Kariya, Yoshiharu, Hosoi, Takuya, Kimura, Takashi, Terashima, Shinichi, Tanaka, Masamoto, and Suga, Tadatomo "Fatigue Life Enhancement of Low Silver Content Sn-Ag-Cu Flip-Chip Interconnects by Ni Addition," The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 103-108.

Kariya, Yoshiharu, Tajima, Sho, and Yamada, Saori, "Influence of Crystallographic Orientation on Fatigue Reliability of b-Sn and b-Sn Micro-Joint," Materials Transactions, vol. 53 no. 10, pp. 2067-2071, 2012.

Kariya, Yoshiharu, Kanda, Yoshihiko, Iguchi, Keitaro, and Furusawa, Hiromitsu, "Influence of Temperature and Dwelling Time on Low-Cycle Fatigue Characteristic of Isotropic Conductive Adhesive Joint," Materials Transactions, vol. 51 no. 10, pp. 1779-1784, 2010.

Kariya, Yoshiharu, Niimi, Tomokazu, Suga, Tadatomo, and Otsuka, Masahisa, "Isothermal Fatigue Properties of Sn-Ag-Cu Alloy Evaluated by Micro Size Specimen," Materials Transactions, vol. 46 no. 11, pp. 2309-2315, 2005.

Kariya, Yoshiharu, Hosoi, Takuya, Terashima, Shinichi, Tanaka, Masamoto, and Otsuka, Masahisa, "Isothermal Shear Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects," Advances in Electronic Packaging 2003, Volume 1, Maui, Hawaii, July 6-11, 2003, pp. 155-160.

Kariya, Yoshiharu, and Suga, Tadatomo, "Low-cycle fatigue properties of eutectic solders at high temperatures," Fatigue and Fracture of Engineering Materials and Structures, vol. 30 no. 5, pp. 413-419, May 2007.

Kariya, Yoshiharu, Hosoi, Takuya, Kimura, Takashi, Terashima, Shinichi, and Tanaka, Masamoto, "Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects," Materials Transactions, vol. 45 no. 3, pp. 689-694, Mar. 2004.

Kariya, Yoshiharu, Suga, Tadatomo, Niimi, Tomokazu, and Otsuka, Masahisa, "Low Cycle Fatigue Properties of Solder Alloys Evaluated by Micro Bulk Specimen," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part C, San Francisco, CA, July 17-22, 2005, pp. 1827-1832.

Kariya, Yoshiharu, and Otsuka, Masahisa, "Mechanical Fatigue Characteristics of Sn-3.5Ag-X (X = Bi, Cu, Zn and In) Solder Alloys," Journal of Electronic Materials, vol. 27 no. 11, pp. 1229-1235, Nov. 1998.

Kariya, Yoshiharu, Asai, Tsuyoshi, Suga, Tadatomo, and Otsuka, Masahisa, "Mechanical Properties of Lead Free Solder Alloys Evaluated by Miniature Size Specimen," TMS Letters, vol. 1 no. 8, pp. 169-170. 2004.

Kariya, Yoshiharu, Otsuka, Masahisa, and Plumbridge, William J., "The Constitutive Creep Equation for a Eutectic Sn-Ag Alloy Using the Modified Theta-Projection Concept," Journal of Electronic Materials, vol. 32 no. 12, pp. 1398-1402, Dec. 2003.

Kariya, Yoshiharu, "Tin Pest in Lead-Free Solder Alloys," Netsu Shori/Journal of the Japan Society for Heat Treatment, vol. 44 no. 3, pp. 133-134, June 2004.

Kariya, Yoshiharu, Gagg, Colin, and Plumbridge, William, "Tin pest in lead-free solders," Soldering & Surface Mount Technology, vol. 13 no. 1, pp. 39-40, 2000.

Kariya, Yoshijaru, Williams, Naomi, Gagg, Colin, and Plumbridge, William, "Tin Pest in Sn-0.5 wt.% Cu Lead-Free Solder," JOM, vol. 53 no. 6, pp. 39-41, June 2001.

Karjalainen, Ilpo, Sandelin, Teemu, Uusitalo, Jani, and Tuokko, Reijo, "Robotic assembly and joining of miniature and MEMS components using adhesive films - test environment and experiences," Assembly Automation, vol. 24 no. 1, pp. 58-62, 2004.

Karlhuber, S., Peng, M., and Mikula, A., "Thermodynamic properties of ternary liquid zinc-alloys," Journal of Non-Crystalline Solids, vol. 205-207, pt. 1, pp. 421-424, Oct. 1996.

Karma, Alain, and Plapp, Mathis, "New Insights into the Morphological Stability of Eutectic and Peritectic Coupled Growth," JOM, vol. 56 no. 4, pp. 29-32, Apr. 2004.

Karofsky, Eric, O'Marah, Kevin, and Hagerty, John, "RoHS and WEEE: It's an Executive Problem," AMR Research, Jan. 14, 2005.

Karofsky, Eric, and Jacobson, Simon, "The Ghoulish Problem of Content Collection: A Compliance Nightmare," AMR Research, Oct. 26, 2005.

Karpel, Steve, "A New Tin-Nickel Decorative Finish," Tin and its Uses, no. 164, pp. 11, 1991.

Karpov, V. G., "Electrostatic Mechanism of Nucleation and Growth of Metal Whiskers," Surface Mount Technology (SMT), vol. 30 no. 2, pp. 28,30-32,34-36,38-40,42-45, Feb. 2015.

Karpov, V. G., "Electrostatic Theory of Metal Whiskers," Physical Review Applied , vol. 1 no. 4, pp. 044001-1-0044001-13, May 2014.

Karpov, V. G., "Understanding the movements of metal whiskers," Journal of Applied Physics, vol. 117 no. 23, pp. 235303-1-235303-11, June 21, 2015.

Karpov, V. G., "Understanding the movements of metal whiskers (paper)," Tin Whisker Group teleconference, Apr. 8 & 15, 2015.

Karpov, V. G., "Understanding the movements of metal whiskers (presentation)," Tin Whisker Group teleconference, Apr. 8 & 15, 2015.

Karpov, Victor, "Electrostatic Theory of Metal Whiskers," Tin Whisker Group teleconference, Aug. 27 and Sept. 3, 2014.

Karpov, Victor, "The stochastic growth of metal whiskers (presentation)," Tin Whisker Group teleconference, June 7, 2017.

Karpov, Victor, "Verifying the electrostatic theory of whiskers," Tin Whisker Group teleconference, Nov. 11, 2015.

Karppinen, J., Laurila, T., and Kivilahti, J. K., "A Comparative Study of Power Cycling and Thermal Shock Tests," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 187-194.

Karppinen, J., Li, J., Pakarinen, J., Mattila, T. T., and Paulasto-Krockel, M., "Shock impact reliability characterization of a handheld product in accelerated tests and use environment," Microelectronics Reliability , vol. 52 no. 1, pp. 190-198, Jan. 2012.

Karppinen, J. S., Laurila, T., Mattila, T. T., and Paulasto-Krockel, M., "The Combined Effect of Shock Impacts and Operational Power Cycles on the Reliability of Handheld Device Component Board Interconnections," Journal of Electronic Materials, vol. 41 no. 11, pp. 3232-3246, Nov. 2012.

Karppinen, J. S., Li, J., and Paulasto-Krockel, M., "The Effects of Concurrent Power and Vibration Loads on the Reliability of Board-Level Interconnections in Power Electronic Assemblies," IEEE Transactions on Device and Materials Reliability, vol. 3 no. 1, pp. 167-176, Mar. 2013.

Karthikeyan, Arvind Srinivasan, Hamasha, Sa'd, Meilunas, Michael, and Dimock, Fred, "Effect of Vacuum Reflow on Solder Joint Voiding in Bumped Components," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 577-584.

Kasahara, J., Kajiwara, K., and Yamada, T., "GaAs Whiskers Grown by a Thermal Decomposition Method," Journal of Crystal Growth, vol. 38 no. 1, pp. 23-28, Apr. 1977.

Kasanaboina, Pavan Kumar, Ojha, Sai Krishna, Sami, Shifat Us, Reynolds Jr., C. Lewis, Liu, Yang, and Iyer, Shanthi, "Effect of Growth Parameters and Substrate Surface Preparation for High-Density Vertical GaAs/GaAsSb Core-Shell Nanowires on Silicon with Photoluminescence Emission at 1.3 um," Journal of Electronic Materials , vol. 45 no. 4, pp. 2108-2114, Apr. 2016.

Kashchiev, Dimo, "Nanowire growth from the viewpoint of the thin film polylayer growth theory," Journal of Crystal Growth, vol. 485, pp. 49-53, Mar. 1, 2018.

Kashi, M. Almasi, Ramazani, A., and Fallah, Z., "Magnetic properties improvement through off time between pulses and annealing in pulse electrodeposited CoZn nanowires," Journal of Alloys and Compounds, vol. 509 no. 35, pp. 8845-8849, Sept. 1, 2011.

Kasper, Angela C., Bernardes, Andrea M., and Veit, Hugo M., "Characterization and recovery of polymers from mobile phone scrap," Waste Management and Research, vol. 29 no. 7, pp. 714-726, July 2011.

Kasprzak, Lucian, Sawant, Milind, Adams, Gerry, Lewis, Brian, Houston, Paul N., Baldwin, Daniel, and Nahorniak, Mike, "A Mixed Technology Reliability Assessment," Circuits Assembly , vol. 18 no. 2, pp. 64, 66, 68, 70-71, Feb. 2007.

Kasprzak, Lucian, Sawant, Milind, Adams, Gerry, Lewis, Brian, Houston, Paul N., Baldwin, Daniel, and Nahorniak, Mike, "Reliability Assessment of Mixed Technology Driven by Availability of Lead Free Components," 2006 Medical Electronics Symposium Conference Proceedings, Minneapolis, MN, May 15-17, 2006, pp. xx-xx.

Kasprzak, Lucian, Sawant, Milind, Adams, Gerry, Lewis, Brian, Houston, Paul N., Baldwin, Daniel, and Nahorniak, Mike, "Reliability Assessment of Mixed Technology Driven by Availability of Lead Free Components," SMTANews & Journal of Surface Mount Technology , vol. 19 no. 3, pp. 23-28, July-Sept. 2006.

Kass, Steffen, Fritzsche, Sebastian, Schmitt, Wolfgang, and Trodler, Jorg, "New Interconennection for High Temperature Application: HotPowCon (HPC)," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Kataria, Mitesh, and Larsen, Karin, "Effects of social marketing on battery collection," Resources, Conservation and Recycling, vol. 53 no. 8, pp. 429-433, June 2009.

Katayama, Iwao, Tanaka, Toshihiro, Akai, Shin-ichi, Yamazaki, Kisao, and Iida, Takamichi, "Activity Measurement of Liquid Sn-Ag-Bi Alloys by Fused Salt EMF Method," Materials Science Forum, vol. 502, pp. 129-138, 2005.

Katayama, Iwao, Zivkovic, Dragana, Novakovic, Rada, and Yamashita, Hiromi, "Experimemtal study on gallium activity in the liquid Ga-Bi-Sn alloys using the EMF method with zirconia solid electrolyte," International Journal of Materials Research, vol. 99 no. 12, pp. 1330-1335, Dec. 2008.

Katkar, Rajesh, Huynh, Michael, and Mirkarimi, Laura, "Reliability of Cu Pillar on Substrate Interconnects in High Performance Flip Chip Packages," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 965-970.

Kato, H., Matsubara, K., and Kageyama, K., "Decrease in fatigue life of Sn-3.8 wt-%Ag-1.2 wt-%Cu alloy solder joints due to thermal cycling," Materials Science & Technology, vol. 19 no. 10, pp. 1403-1410, Oct. 1, 2003.

Kato, Hiroaki, Sakita, Shinya, and Hara, Shinjiro, "Selective-area growth and magnetic characterization of lateral MnAs nanowires," Journal of Crystal Growth, vol. 414, pp. 151-155, Mar. 15, 2015.

Kato, Hiroshi, "A Simple Method for Characterizing the Bondability of Metallization Surfaces," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-10 no. 2, pp. 232-235, June 1987.

Kato, Hiroshi, and Kobayashi, Hirotsugu, "Acoustic Microscopy of Interfacial Crack in Sn-Ag-Cu Alloy Solder Joints under Shear Fatigue Testing," Materials Transactions, vol. 49 no. 9, pp. 2068-2075, Sept. 2008.

Kato, Takahiko, Akahoshi, Haruo, Nakamura, Masato, Terasaki, Takeshi, Iwasaki, Tomio, Hashimoto, Tomoaki, and Nishimura, Asao, "Correlation Between Whisker Initiation and Compressive Stress in Electrodeposited Tin-Copper Coating on Copper Leadframes," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 3, pp. 165-176, July 2010.

Kato, Takahiko, Akahoshi, Haruo, Nakamura, Masato; Hashimoto, Tomoaki, and Nishimura, Asao, "Effects of Minor Elements in Cu Leadframe on Whisker Initiation From Electrodeposited Sn/Cu Coating," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 4, pp. 258-269, Oct. 2007.

Kato, Takahiko, Akahoshi, Haruo, Nakamura, Masato, Hashimoto, Tomoaki, and Nishimura, Asao, "Stress Measurement by X-Ray Diffraction Method for Electrodeposited SnCu Coating on Alloy 42 Substrate," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1491-1497.

Kato, Takahiko, Akahoshi, Haruo, Terasaki, Takeshi, Iwasaki, Tomio, Nakamura, Masato, Hashimoto, Tomoaki, and Nishimura, Asao, "Whisker Initiation Behavior from Electrodeposited Sn/Cu Coating on Cu Leadframe," Materials Science Forum, vol. 561-565 part 3, pp. 1685-1688, Oct. 2007.

Kattner, Ursula R., and Handwerker, Carol A., "Calculation of Phase Equilibria in Candidate Solder Alloys," Zeitschrift fur Metallkunde, vol. 92 no. 7, pp. 740-746, July 2001.

Kattner, U. R., "Efficient Phase Diagram Information and Computational Thermodynamics," Journal of Phase Equilibria and Diffusion, vol. 27 no. 2, pp. 126-132, Apr. 2006.

Kattner, Ursula R., and Boettinger, William J., "On the Sn-Bi-Ag Ternary Phase Diagram," Journal of Electronic Materials, vol. 23 no. 7, pp. 603-610, July 1994.

Kattner, Ursala R., "Phase Diagrams for Lead-Free Solder Alloys," JOM, vol. 54 no. 12, pp. 45-51, Dec. 2002.

Katz, Anne, "Going green: choosing a supplier," Electronics Supply & Manufacturing, Dec. 2005.

Katz, Anne, "Going green: choosing a supplier," Green SupplyLine, Dec. 1, 2005.

Katz, Anne, "Going green gets easier with help from IC suppliers," EE Times , Mar. 17, 2006.

Katz, Anne, "Going green gets easier with help from IC suppliers," Green SupplyLine, Mar. 17, 2006.

Katz, Anne, "Green IC packaging addresses environmental concerns," EE Times - Asia, vol. xx no. xx, pp. xx-xx, July 17, 2006.

Katz, Anne, "RoHS compliance: What products are affected?," Electronic Products , vol. 48 no. 3, pp. 49, Aug. 2005.

Katzenmeyer, A. M., Leonard, F., Talin, A. A., Toimil-Molares, M. E., Cederberg, J. G., Huang, J. Y., and Lensch-Falk, J. L., "Observation of Space-Charge-Limited Transport in InAs Nanowires," IEEE Transactions on Nanotechnology, vol. 10 no. 1, pp. 92-95, Jan. 2011.

Katzman, H. A., Malouf, G. M., Bauer, R., and Stupian, G. W., "Corrosion-Protective Chromate Coatings on Aluminum," Applications of Surface Science, vol. 2 no. 3, pp. 416-432, Mar. 1979.

Kauffmann, A., Freudenberger, J., Klaus, H., Schillinger, W., Sarma, V. Subramanya, and Schultz, L., "Efficiency of the refinement by deformation twinning in wire drawn single phase copper alloys," Materials Science and Engineering: A, vol. 624, pp. 71-78, Jan. 29, 2015.

Kauffmann, A., Freudenberger, J., Klauss, H., Klemm, V., Schillinger, W., Sarma, V. Subramanya, and Schultz, L., "Properties of cryo-drawn copper with severely twinned microstructure," Materials Science and Engineering: A, vol. 588, pp. 132-141, Dec. 20, 2013.

Kaufman, Alberto, Kopeliovich, Baruch, and Mann, Yaron, "Long Range Reliability Tests on SnZnMn Soldering Alloy," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Kaulfersch, Eberhard, Rzepka, Sven, Ganeshan, Vijay, Muller, Axel, and Michel, Bernd, "Dynamic mechanical behavior of SnAgCu BGA solder joints determined by fast shear tests and FEM simulations," Proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, London, England, Apr. 15-18, 2007, pp. xx-xx.

Kaur, Jaskiran, Kaur, Harmanmeet, Singh, Surinder, Kanjilal, Dinakar, and Chakarvarti, Shiv Kumar, "Nano-/micro Metallic Wire Synthesis on Si Substrate and Their Characterization," AIP Conference Proceedings, vol. 1591, pp. 1364-1366, 2014.

Kaushal, Rajendra Kumar, and Nema, Arvind K., "An analysis of preferences for hazardous substances free products: manufacturing, use and end of life of mobile phones," Waste Management and Research, vol. no. 11, pp. 1169-1177, Nov. 2012.

Kaushik, Raj K., Batra, Uma, and Sharma, J. D., "Aging induced structural and electrochemical corrosion behaviour of Sn-1.0Ag-0.5Cu and Sn-3.8Ag-0.7Cu solder alloys," Journal of Alloys and Compounds, vol. 745, pp. 446-454, May 15, 2018.

Kawafune, Isao, and Yoshikawa, Shuichi, "Effects of Additives in the Bath on the Formation of Chemical Conversion Coatings Using Tungstate As a Substitute for Chromate and Composition Analyses of the Coatings," Journal of the Surface Finishing Society of Japan , vol. 59 no. 2, pp. 126-132, 2008.

Kawahito, A., Yanase, T., Endo, T., Nagahama, T., and Shimada, T., "Fabrication of Fe nanowires on yittrium-stabilized zirconia single crystal substrates by thermal CVD methods," Journal of Applied Physics, vol. 117, pp. 17D506-1-17D506-4, 2015.

Kawai, Kazuo, "Inspection to Improve Lead-Free Solder Technologies," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 553-559.

Kawai, Motonobu, "New Analysis Technique Advances RoHS Targets," Nikkei Electronics Asia, pp. xx-xx, June 2004.

Kawakita, Testuo, and Hatada, Kenzo, "Surface Improvement Method for Controlling Oxidation of Low Melting Point Metal -Surface Improvement By Ge Implantation Into In Surface," 1st 1997 IEMT/IMC Symposium, Tokyo, Japan, Apr. 16-18, 1997, pp. 240-243.

Kawamori, Makoto, Yagi, Shunsuke, and Matsubara, Eiichiro, "Formation of Nickel Nanowires Via Electroless Deposition Under a Magnetic Field," Journal of The Electrochemical Society, vol. 158 no. 8, pp. E79-E83, 2011, doi 10.1149/1.3596703

Kawamori, Makoto, Yagi, Shunsuke, and Matsubara, Eiichiro, "Nickel Alloying Effect on Formation of Cobalt Nanoparticles and Nanowires via Electroless Deposition under a Magnetic Field," Journal of the Electrochemical Society, vol. 159 no. 2, pp. E37-E44, 2011. doi 10.1149/2.062202jes

Kawamoto, N., Murakami, Y., and Shindo, D., "Local conductivity and electric field analysis of Ag-based conductive adhesive by transmission electron microscopy," Journal of Applied Physics, vol. 107 no. 4, pp. 044309-1-1044309-6, Feb. 15, 2010.

Kawamoto, N., Murakami, Y., Shindo, D., and Suganuma, K., "Microstructure and conductivity analysis of silver-based conductive adhesive by TEM with double-probe piezodriving holder," 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Odaiba, Japan, Jan. 16-18, 2007, pp. 101-104.

Kawamoto, Naoyuki, Murakami, Yasukazu, Shindo, Daisuke, Kim, Keunsoo, and Suganuma, Katsuaki, "Advanced Transmission Electron Microscopy on Silver-Based Conductive Adhesive," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 70 no. 4, pp. 384-388, Apr. 2006.

Kawamoto, Naoyuki, Murakami, Yasukazu, Shindo, Daisuke, Hayasaka, Yuichiro, Kan, Takeshi, and Suganuma, Katsuaki, "Transmission Electron Microscopy Study on Microstructure of Ag-Based Conductive Adhesives," Materials Transactions, vol. 51 no. 10, pp. 1773-1778, 2010.

Kawamoto, Satomi, Matsumura, Kaori, and Abe, Yukinari, "The Development of Anisotropic Conductive Paste (ACP) to Make Solder Metal Connection," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 2051-2055.

Kawanaka, Ryusuke, Fujiwara, Kenzo, Nango, Shigeyuki, and Hasegawa, Tomoharu, "Influence of Impurities on the Growth of Tin Whiskers," Japanese Journal of Applied Physics, vol. 22 no. 6, pp. 917-922, June 1983.

Kawano, Shunsuke, and Tomomori, Tatsuo, "About the Characteristic and Whisker of Pre-coated Aluminum Sheet for Solder," Journal of the Surface Finishing Society of Japan, vol. 59 no. 4, pp. 232-236, 2008.

Kawanobe, T., Miyamoto, K., and Hirano, M., "Tape Automated Bonding Process for High Lead Count LSI," 33rd Electronic Components Conference, Orlando, FL, May 16-18, 1983, pp. 221-225.

Kawashima, Satoshi, "Electroless nickel/Immersion gold process on Aluminum alloy electrodes," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 381-384.

Kawashiro, Fumiyoshi, Ujiie, Masato, Shibuya, Koujirou, Kurita, Yoichiro, Soejima, Koji, and Kawano, Masaya, "Reliability Studies of Sn-Ag-Cu BGA Solder Joints on Ni/Cu/Au Surface Finish for SMAFTI Packaging Technology," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 283-289.

Kay, P. J., and Mackay, C. A., "The Growth of Intermetallic Compounds on Common Basis Materials Coated with Tin and Tin-Lead Alloys," Transactions of the Institute of Metal Finishing, vol. 54, pp. 68-74, 1976.

Kay, R. W., de Gourcuff, E., Desmulliez, M. P. Y., Jackson, G. J., Steen, H. A. H., Liu, C., and Conway, P. P., "Stencil Printing Technology for Wafer Level Bumping at sub-100 Micron Pitch using Pb-Free Alloys," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 1, Orlando, FL, May 31-June 3, 2005, pp. 848-854.

Kaya, H., Cadirli, E., and Gunduz, M., "Effect of Growth Rates and Temperature Gradients on the Spacing and Undercooling in the Broken-Lamellar Eutectic Growth (Sn-Zn Eutectic System)," Journal of Materials Engineering and Performance, vol. 12 no. 4, pp. 456-469, Aug. 2003.

Kaygisiz, Y., Ocak, Y., Aksoz, S., Keslioglu, K., and Marasli, N., "Thermal conductivity and interfacial energies of solid Sn3Sb2 in the Sn-Sb peritectic system," Thermochimica Acta, vol. 520 no. 1-2, pp. 25-32, June 10, 2011.

Kayser, David, "http://www.agingaircraftconference.org/all_files/28/28b/28b-ppt.pdf"> "Lead-free Solder & Tin Whiskers Situation Summary," 9th Joint FAA/DoD/NASA Aging Aircraft Conference, Atlanta, GA, Mar. 6-9, 2006.

Kayukawa, Kimihani, and Tanahashi, Akira, "A role of Ti-Sn diffusion layer formed at the interface between Pb free solder and TiNiAu multilayer," 2005 International Symposium on Electronics Materials and Packaging, Tokyo, Japan, Dec. 11-14, 2005, pp. 50-54.

Kazimierczak, Honorata, Ozga, Piotr, Slupska, Monika, Swiatek, Zbigniew, and Berent, Katarzyna, "Electrodeposition of Sn-Mn Layers from Aqueous Citrate Electrolytes," Journal of the Electrochemical Society, vol. 161 no. 6, pp. D309-D320, 2014.

Kazmierowicz, Philip C., "Lead-Free New Problems -- New Solutions," Advanced Packaging, vol. 14 no. 9, pp. 43, Sept. 2005.

Kaznica, Piotr, "The Effect on Energy Use from an Optimized Reflow Oven Recipe In Lead-Free Applications," Lead-Free Connection, vol. 4 no. 1, pp. 10-11, Feb. 2007

Ke, Hang, and Mastorakos, Ioannis, "Deformation behavior of core-shell nanowire structures with coherent and semi-coherent interfaces," Journal of Materials Research, vol. 34 no. 7, pp. 1093-1102, Apr. 15, 2019.

Ke, J. H., Yang, T. L., Lai, Y. S., and Kao, C. R., "Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing," Acta Materialia, vol. 59 no. 6, pp. 2462-2468, Apr. 2011.

Ke, J. H., Chuang, H. Y., Shih, W. L., and Kao, C. R., "Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing," Acta Materialia, vol. 60 no. 5, pp. 2082-2090, Mar. 2012.

Ke, J. H., Gao, Y., Kao, C. R., and Wang, Y., "Pattern formation during interfacial reaction in-between liquid Sn and Cu substrates - A simulation study," Acta Materialia, vol. 113, pp. 245-258, July 2016.

Ke, Jia-Hong, and Kao, C. Robert, "Temperature Effects on Electromigration Behavior of Solder Joints," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Kee, Joanne B. N., and Yip, Jonathan T. S., "Towards a Halogen-Free package - GREEN Molding Compound," IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, San Jose, CA, July 16-18, 2003, pp. 107-115.

Kee, See Bee, Hussain, Luay B., Nair, Kesavan, Khong, Y. L. , and Kumar, Dennis Chandran Prem, "Effects of gold on the properties of tin-antimony solder in flip-chip-pin-grid-array (FCGPA) packages," Journal of Microelectronics and Electronic Packaging, vol. 2 no. 4, pp. 281-286, Fourth Quarter 2005.

Keene Jr., Samuel J., "Fuses for Spaceflight Applications," Sixth Annual Reliability Physics Symposium, Los Angeles, CA, Nov. 6-8, 1967, pp. 234-242.

Keep, Gerald, Breeding, Kenneth, Cliffton, Michael, Basconi, Edward, and Wilson, David, "Thermoplastic Connector Housings in a Lead-Free Wave Soldering Environment," 2001 SMTA International Conference Proceedings, Chicago, IL, Sept. 30-Oct. 4, 2001, pp. xx-xx.

Keeping, Jason, "Critical Considerations for Conformal Coating," International Conference on Soldering & Reliability 2011 Proceedings, Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

Keeping, Steven, "Taking the heat out of lead-free," ferret.com.au.

Keesom, W. H., and Kok, J. A., "On the change of the specific heat of tin when becoming supraconductive," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 32 no. 6, pp. 743-748, 1932.

Keesom, W. H., and van den Ende, J. N., "The specific heat of solids at temperatures obtainable with liquid helium. IV," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 35 no. 2, pp. 143-155, 1932.

Kehoe, L., and Crean, G. M., "Thermal Conductivity and Specific Heat Determinations of a Set of Lead-Free Solder Alloys," Proceedings 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, Mar. 15-18, 1998, pp. 203-208.

Kehrer, H.-P., and Zaminer, Christian, "Crystal Growth - Growth of Tin Whiskers in the Scanning Electron Microscope," 1972.

Kehrer, H.-P., and Kadereit, H. G., "Tracer Experiments on the Growth of Tin Whiskers," Applied Physics Letters, vol. 16 no. 11, pp. 411-412, June 1, 1970.

Keil, M., Bjarnason, B., Wickstrom, B., and Olsson, L., "isotropic conductive adhesive joints," Advanced Packaging, vol. xx no. x, pp. xx-xx, Sept. 2001.

Keim, Simon, Tetzlaff, Ulrich, and Elger, Gordon, "The influence of different-sized Ni micro- and nanopowders on the processing and microstructural properties of Sn-Ag-Cu-solder with low Ag content," 2020 IEEE 70th Electronic Components and Technology Conference, Lake Buena Vista, AL, May 26-29, 2020, pp. 2005-2012.

Keimasi, Mohammadreza, Azarian, Michael H., and Pecht, Michael, "Comparison of Flex Cracking of Multilayer Ceramic Capacitors Assembled with Lead-Free and Eutectic Tin-Lead Solders," 2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.

Keimasi, Mohammadreza, Azarian, Michael H., and Pecht, Michael G., "Flex Cracking of Multilayer Ceramic Capacitors Assembled With Pb-Free and Tin-Lead Solders," IEEE Transactions on Device and Materials Reliability , vol. 8 no. 1, pp. 182-192, Mar. 2008.

Keimasi, Mohammadreza, Azarian, Michael H., and Pecht, Michael, "Isothermal aging effects on flex cracking of multilayer ceramic capacitors with standard and flexible terminations," Microelectronics Reliability , vol. 47 no. 12, pp. 2215-2225, Dec. 2007.

Keke, Zhang, Guanghui, Cheng, Yangchun, Yu, Yanfu, Yan, and Hua, Man, "Effect of Rare Earths on Microstructure and Properties of Sn2.0Ag0.7CuRE Solder Alloy," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Kell, John, "The end-of-life vehicle: position in the EU," Connect, 2007.

Keller, J., Baither, D., Wilke, U., and Schmitz, G., "Mechanical properties of Pb-free SnAg solder joints," Acta Materialia , vol. 59 no. 7, pp. 2731-2741, Apr. 2011.

Keller, J., Faust, W., Gollhardt, A., Vogel, D., and Michel, B., "NanoDAC - A New Technique for Micro- and Nanomechanical Reliability Analysis of Lead-Free Solder Interconnects," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Keller, John "Could RoHS mean the end of COTS as we know it?," Military & Aerospace Electronics, vol. 17 no. 7, pp. xx-xx, July 2006.

Keller, John, "GEIA lead-free-solder guidelines to be released by early 2008," Military & Aerospace Electronics, vol. 18 no. 5, pp. xx-xx, May 2007.

Keller, John, "Industry and government prepare counter-attacks against electronic parts counterfeiting," Military & Aerospace Electronics, vol. 21 no. 4, pp. 20-24, Apr. 2010.

Keller, John, "Lead-free solder: A train wreck in the making," Military & Aerospace Electronics, vol. 16 no. 10, pp. 1, 10, Oct. 2005.

Keller, John, "Revenge of COTS procurement: counterfeit parts," Military & Aerospace Electronics, vol. 21 no. 4, pp. 4, Apr. 2010.

Kelley, Ed, and Bergum, Erik, "Laminate Material Selection for RoHS Assembly, Part 1," Printed Circuit Design and Manufacture, vol. 23 no. 11, pp. 30-34, Nov. 2006.

Kelley, Ed, Bergum, Erik, Humby, David, Hornsby, Ron, and Varnell, William, "Lead Free Assembly: Identifying Compatible Base Materials for Your Application," IPC Printed Circuits Expo, APEX and the Designer Summit , Anaheim, CA, Feb. 8-10, 2006, pp. S10-01-1-S10-01-17.

Kelley, Ed, and Bergum, Erik, "Laminate Material Selection for RoHS ASSEMBLY, Part 2," Printed Circuit Design and Manufacture, vol. 23 no. 12, pp. 30-37, Dec. 2006.

Kelley, Edward, "An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S16-2-1-S16-2-10.

Kelley, Edward, "An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability," IPC-Soldertec 2004 Lead-Free Conference , Amsterdam, June 2004, pp. xx-xx.

Kelley, Edward, "Selecting Laminate Materials for Lead-Free Assembly Applications," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Kellner, Rod, "Alternative surface finishes -- options and environmental considerations," Circuit World, vol. 30 no. 2, pp. 30-33, 2004.

Kelly, Joe, "Tech Tips... Lead Free Rework and Repair of Ball Grid Arrays (BGAs)," empfasis, pp. 7, Jan. 2005.

Kelly, Marion Branch, Maity, Tapabrata, Sakib, A. R. Nazmus, Frear, D. R., and Chawla, Nikhilesh, "Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability," Journal of Electronic Materials, vol. 49 no. 7, pp. 4466-4467, July 2020.

Kelly, Marion Branch, Niverty, Sridhar, and Chawla, Nikhilesh, "Electromigration in Bi-crystal pure Sn solder joints: Elucidating the role of grain orientation," Journal of Alloys and Compounds, vol. 818, pp. 152918-1-152918-17, Mar. 25, 2020.

Kelly, Marion Branch, Niverty, Sridhar, and Chawla, Nikhilesh, "Four dimensional (4D) microstructural evolution of Cu6Sn5 intermetallic and voids under electromigration in bi-crystal pure Sn solder joints," Acta Materialia, vol. 189, pp. 118-128, May 1, 2020.

Kelly, Marion Branch, Maity, Tapabrata, Sakib, A. R. Nazmus, Frear, D. R., and Chawla, Nikhilesh, "Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability," Journal of Electronic Materials, vol. 49 no. 5, pp. 3251-3258, May 2020.

Kelly, Matt, and Hoffmeyer, Mark, "Lead-Free Assembly Design For Manufacturability Considerations," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 16-18, 2012, pp. xx-xx.

Kelly, Matt, and Hoffmeyer, Mark, "Lead-Free Assembly Design For Manufacturability Considerations," Printed Circuit Design and Fab/ Circuits Assembly, vol. 30 no. 2, pp. 30,32-34,36-39, Feb. 2013.

Kelly, Matt, Cole, Marie, Pymento, Larry, Zippetelli, Celeste, and Davis, Willie, "Lead-Free Supply Chain Management Systems: Printed Circuit Board Assembly &smp; Test Audit and Technology Qualification," International Conference on Soldering & Reliability 2011 Proceedings, Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

Kelly, Matt, Chu, Quyen, and Bath, Jasbir, "Pb-Free Reflow and Rework," Circuits Assembly, vol. 15 no. 11, pp. 32-35, Nov. 2004.

Kelly, Matt, Ferrill, Mitchell, Ma, Wai, Ranadive, Nandu, Ndiaye, Cheikhou, Bagheri, Simin, and Kapadia, Prakash, "Water-Soluble Lead-Free Process Chemistry for High Voltage and High Reliability Hardware Requirements," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 860-869.

Kelly, Matthew, Colnago, Duilio, Sirtori, Vittorio, Bath, Jasbir, Tan, Suan Kee, Teo, Lai Hook, Grosskopf, Curtis, Lyjak, Ken, Ravenelle, Charles, and Kobeda, Eddie, "Component Temperature Study on Tin-Lead and Lead-Free Assemblies," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Kelly, Matthew, Colnago, Duilio, Sirtori, Vittorio, Grosskopf, Curtis, Lyjak, Ken, Ravenelle, Charles, Kobeda, Eddie, Bath, Jasbir, Tan, Suan Kee, and Teo, Lai Hook, "Component Temperature Study on Tin-Lead and Lead-Free Assemblies," Journal of SMT, vol. 15 no. 4, pp. 11-22, Oct. 2002.

Kelly, Matthew, Truman, Tom, Samat, Adzahar, Goh, Eric, Tan, S. H., Villanueva, Ali, Tan, M. S., and Lee, S. J., "Lead-Free Assembly and Qualification of a Storage Class PCBA," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 348-353.

Kelly, Matthew, Cole, Marie, Wilcox, Jim, and Braun, David, "Lead-Free Assembly of Server Class PCBAs: Qualification Trial Results," Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb. 10-12, 2009, pp. 280-287.

Kelly, Matthew, Cole, Marie, Wilcox, Jim, and Braun, David, "Lead-Free Assembly of Server Class PCBAs: Qualification Trial Results," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

Kelly, Matthew, Cole, Marie, Wilcox, Jim, and Braun, David, "Lead-Free Assembly of Server Class PCBAs: Qualification Trial Results," SMTAnews & Journal of Surface Mount Technology, vol. 22 no. 2, pp. 21-29, Apr.-June 2009.

Kelly, Matthew, Cole, Marie, Wilcox, Jim, Bagheri, Simin, Hamilton, Craig, McCormick, Heather, and Sterian, Irene, "Lead-Free Card Assembly Advances and Challenges for Server PCBAs," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 172-181.

Kelly, Matthew, Taylor, Jeffrey, Krull, Brett, Cole, Marie, and Truman, Tom, "Lead-Free HASL: Balancing Benefits and Risks for High Complexity High Reliability Server and Storage Hardware," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 519-529.

Kelly, Matthew, Grosskopf, Curtis, Krystek, Paul, Littell, Brian, Hamilton, Craig, Traya, Jose, and Trivedi, Rupen, "PTH Connector Temperature Mass Study: Plastic Housing Survival after Elevated Lead-Free Process Temperature Exposures," International Conference on Soldering & Reliability 2010 Proceedings, Toronto, Ontario, Canada, May 17-20, 2010, pp. xx-xx.

Kelly, Matthew, Cole, Marie, Wilcox, Jim, Bielick, Jim, Younger, Timothy, and Braun, David, "Qualification of a Lead-Free Card Assembly and Test Process for a Server Complexity PCBA," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 806-815.

Kelly, Matthew, Cole, Marie, Wilcox, Jim, Bielick, Jim, Younger, Timothy, and Braun, David, "Qualification of a Lead-Free Card Assembly and Test Process for a Server Complexity PCBA," SMTAnews & Journal of Surface Mount Technology , vol. 21 no. 1, pp. , Jan.-Mar. 2008.

Kelly, Matthew, Ferrill, Mitchell, Snugovsky, Polina, Trivedi, Rupen, Dinca, Gaby, Achong, Chris, and Bagheri, Zohreh, "Rework Process Window and Microstructural Analysis for Lead-Free Mirrored Bga Design Points," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Kelly, Padraig, "The Impact Of The WEEE and RoHS directives on Irish EEE Industry," SMART Ireland Lead-Free Materials + Legislation Seminar, Dublin, Ireland, Sept. 23, 2004.

Kempf, B., Graff, M., Hutin, O., and Rettenmayr, M., "Lead-Free Ball-Grid Array Balls: Production Method and Properties," Journal of Electronic Materials, vol. 31 no. 11, pp. 1270-1275, Nov. 2002.

Kench, Stan, "Large Format Rework for Eutectic and Lead-Free Applications," Circuits Assembly, vol. 15 no. 11, pp. 36-39, Nov. 2004.

Kendall, J. T., "Electrical Conductivity of Gray Tin," Proceedings of the Physical Society, vol. 63 part 1 no. 361B, pp. 821-822. Jan. 1, 1950.

Kendall, J. T., "Electronic Conduction in Grey Tin," Philosophical Magazine, 7th series, vol. 45 no. 361, pp. 141-157, Feb. 1954. https://doi.org/10.1080/14786440208520433

Kendig, M., Jeanjaquet, S., Addison, R., and Waldrop, J., "Role of hexavalent chromium in the inhibition of corrosion of aluminum alloys," Surface and Coatings Technology, vol. 140 no. 1, pp. 58-66, May 22, 2001.

Kendig, Martin W., "Mechanism of Corrosion Protection of Aluminum Alloys by Chromate," 33rd International SAMPE Technical Conference, Seattle, WA, Nov. 5-8, 2001, pp. 938-947.

Kendrick, Chito E., and Redwing, Joan M., "The effect of pattern density and wire diameter on the growth rate of micron diameter silicon wires," Journal of Crystal Growth, vol. 337 no. 1, pp. 1-6, Dec. 15, 2011.

Kennedy, Jeff, Hillman, Dave, and Wilcoxon, Ross, "NASA DoD Phase 2: SAC305 and Sn100C Copper Dissolution Testing," International Conference on Soldering & Reliability 2013 Proceedings, Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.

Kennedy, Jeff, and Hilman, David, "NASA-DOD Phase 3 Consortium Testing Plan for Alternate Alloys for Use on High-Reliability Products," Pan Pacific Symposium 2017 Proceedings , Koloa, HI, Feb. 6-9, 2017, pp. xx-xx.

Kennedy, Michael, "Which lead-free component packages are seeing a significant growth in demand?," Lead-Free Magazine.

Kenny, Jim, Wengenroth, Karl, Abys, Joe, Mui, Marco, and Wynschenk, Jo, "Considerations for the Long Term Reliability of PCBs in Harsh Environmental Conditions," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Kenny, Jim, Wengenroth, Karl, Fudala, John, Rischka, Melanie, and Yau, Yung Herng, "Entek OM, an OSP Alternative High Performance Final Finish," South East Asia Technical Training Conference on Electronics Assembly Technologies 2012 Proceedings, Penang, Malaysia, Apr. 18-20, 2012, pp. xx-xx.

Kenny, Jim, "HASL Basics," Printed Circuit Design and Fab, vol. 25 no. 8, pp. 23, Aug. 2008.

Kenny, Jim, Fudula, John, Bo, Zheng, Farrell, Bob, Sun, ShenLiang, Wang, Xingping, Wengenroth, Karl, and Abys, Joseph, "High Temperature OSP Process Recent Advances," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 296-300.

Kenny, Jim, Wessling, B., Wengenroth, Karl, Abys, Joe, Fudala, John, and Farrell, Robert, "Nanotechnology for Lead-Free PWB Final Finishes with Organic Metal," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S06_01-1-S06_01-7.

Kenny, Jim, "Organic Metals Take the Stage," Printed Circuit Design and Fab , vol. 26 no. 3, pp. xx-xx, Mar. 2009.

Kenny, Jim, Wengenroth, Karl, Antonellis, Ted, Sun, ShenLiang, Wang, Cai, Kudrak, Edward, and Abys, Joseph, "PWB Creeping Corrosion Mechanism and Mitigation Strategy," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 846-850.

Kenny, Jim, "Selecting the Right Final Finish," Printed Circuit Design and Fab , vol. 26 no. 10, pp. 12-13, Oct. 2009.

Kenny, Jim B., "Short Circuiting OSP / ENIG Galvanic Etch," Printed Circuit Design and Fab, vol. 26 no. 5, pp. xx-xx, May 2009.

Kenny, Jim B., "The Final Finish - Copper Erosion with Lead-Free Solders," PCB007 , Mar. 21, 2008.

Kenny, Jim, Wengenroth, Karl, and Antonellis, Ted, "The Final Finish: The Progression of Immersion Silver," PCB007 , Aug. 27, 2008.

Kenny, Jim, Wengenroth, Karl, Antonellis, Ted, Kawashima, Satoshi, and Nagakura, Masayuki, "The Progression of Immersion Silver as a Final Finish for Circuit Boards," Journal of the Surface Finishing Society of Japan, vol. 59 no. 9, pp. 589-592, 2008.

Kenny, Jim, Arendt, Nils, Wessling, Bernhard, and Wengenroth, Karl, "Thin Immersion Tin Using Organic Metals," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 836-840.

Kenny, Stephen, Roelfs, Bernd, Matejat, Kai, Magaya, Tafadzwa, and Massey, Roger, "Electrolytic Solder Deposit for Next Generation Flip Chip Solder Bumping," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Kent, M. S., Corbett, M. L., and Glavin, M., "Characterization and Analysis of Airborne Metal Exposures Among Electronic Scrap Valuation Workers - Shredding," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 224-227.

Kenyon, William G., "Change the Solder Alloys and Laminate," Surface Mount Technology , vol. 14 no. 1, pp. xx-xx, Jan. 2000.

Kenyon, William G., "Do New Solders Mean New Cleaners?," Surface Mount Technology , vol. 13 no. 7, pp. xx-xx, July 1999.

Kenyon, William G., "Lead-free Cleaning Studies Abound," Surface Mount Technology (SMT) , vol. 19 no. 7, pp. 14, July 2005.

Kenyon, William G., "Lead-free Residue Cleaning & Regulatory Updates," Surface Mount Technology (SMT), vol. 15 no. 2, pp. xx-xx, Feb. 2001.

Kenyon, William G., "Lead-free Solder to Bring Back Vapor Phase Soldering?," Surface Mount Technology (SMT), vol. 17 no. 10, pp. 16, Oct. 2003.

Kenyon, William G., "Regulations - Innovation Drivers or Hindrances?," Surface Mount Technology (SMT), vol. 19 no. 4, pp. xx-xx, Apr. 2005.

Kenyon, William G., "The Year in Review: The Good, Bad and Ugly," Surface Mount Technology (SMT), vol. 19 no. 12, pp. 8, Dec. 2005.

Kenyon, William G., "Wiping Up the Remaining Challenges," Surface Mount Technology , vol. 14 no. 8, pp. xx-xx, Aug. 2000.

Kepler, K. D., Vaughey, J. T., and Thackeray, M. M., "Copper-tin anodes for rechargeable lithium batteries: an example of the matrix effect in an intermetallic system," Journal of Power Sources , vol. 81-82, pp. 383-387, Sept. 1999.

Kern, J. A., Weiser, M. W., Drewien, C. A., Yost, F. G., and Sackinger, S., "Final Report: High Temperature Solder Alloys for Underhood Applications," Sandia Report SAND-96-1431, June 1996.

Kerns, Jeff, "Toxic E-Waste," Machine Design, vol. 87 no. 6, pp. 26-30, June 2015.

Kerr, Andy, "The dual supply approach to non-compliant components," Electronics Weekly, Dec. 15, 2005.

Kerr, John, "Lead-free, tin/lead don't mix," Connector Specifier, vol. 20 no. 6, pp. xx-xx, June 2004.

Kerr, M., and Chawla, N., "Creep Deformation Behavior of Sn-3.5Ag Solder at Small Length Scales," JOM, vol. 56 no. 6, pp. 50-54, June 2004.

Kerr, M., and Chawla, N., "Creep deformation behavior of Sn-3.5Ag solder/Cu couple at small length scales," Acta Materialia, vol. 52 no. 15, pp. 4527-4535, Sept. 2004.

Keskinen, Marika, and Valkama, Jani, "End-of-Life Challenges of Printed Electronics," IEEE International Symposium on Sustainable Systems and Technology, Phoenix, AZ, May 18-20, 2009, pp. xx-xx.

Kessel, Kurt, "JCAA/JG-PP Lead-Free Solder Testing for High-Reliability Applications," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Kessel, Kurt, "JG-PP/JCAA Lead-Free Solder Project Overview," 9th Joint FAA/DoD/NASA Aging Aircraft Conference, Atlanta, GA, Mar. 6-9, 2006.

Kessel, Kurt, "Lead-Free Soldering for Space Applications Lead-Free Solder Body of Knowledge," and Appendices,", ITB, May 2005.

Kessel, Kurt, "NASA-DoD Lead-Free Electronics Project," Tin Whisker Group teleconference, June 24, 2009.

Kessel, Kurt, "NASA-DoD Lead-Free Electronics Project," 2011 International Workshop on Environment and Alternative Energy, Noordwijk, The Netherlands, Nov. 15-18, 2011, pp. xx-xx.

Kessel, Kurt, "NASA-DoD Lead-Free Electronics Project - Joint Test Report," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 450-580.

Kessel, Kurt, "NASA-DoD Lead-Free Electronics Project: Overview," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 419-425.

Kessel, Kurt R., "NASA-DoD Lower Process Temperature Lead-Free Solder Project Overview," Aircraft Airworthiness and Sustainment Conference, Baltimore, MD, Apr. 14, 2014, pp. xx-xx.

Kessel, Kurt R., and Rothgeb, Matthew, "NASA TEERM Hexavalent Chrome Alternatives Projects," Aerospace Industries Association Engineering Management Committee, Arlington, VA, Apr. 26, 2011.

Kessel, Kurt, "Space Shuttle Program - Tin Whisker Mitigation: Labor Hour Rough Order of Magnitude (ROM) Estimate," NASA, May 20, 2009.

Kessel, Stephen L., "UV-Stabilized Natural and Colored Halogen-Free Flame-Retardants," Proceedings of the 56th International Wire and Cable Symposium, Orlando, FL, Nov. 11-14, 2007, pp. 495-502.

Kessler, Lawrence W., and Sharpe, Thomas, "New Techniques to ID Counterfeit ICs," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 6, pp. 64-67, June 2010.

Kessler, Lawrence W., "New tools help gauge reliability of plastic-packaged components," Military & Aerospace Electronics, vol. 14 no. 2, pp. xx-xx, Feb. 2003.

Kessling, O. S., Schussler, F., Feldmann, K., and Lueth, T. C., "A New process for Flip-chip Interconnections with Variable Stand-offs," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 620-625.

Kettle, Peter, "Is tin heading for a crisis? (part 2)," Global SMT and Packaging , vol. 7 no. 6, pp. 26-29, June 2007.

Keusseyan, Roupen L., and Dilday, John L., "Electric Contact Phenomena in Conductive Adhesive Connections," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume 1, San Jose, CA, Aug. 31-Sept. 2, 1993, pp. 567-571.

Keusseyan, Roupen L., and Dilday, John L., "Electric Contact Phenomena in Conductive Adhesive Interconnections," Proceedings 1993 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 2105), Dallas, TX, Nov. 9-11, 1993, pp. 44-49.

Keusseyan, Roupen L., Dilday, John L., and Speck, Brian S., "Electric Contact Phenomena in Conductive Adhesive Interconnections," The International Journal of Microcircuits and Electronic Packaging, vol. 17 no. 3, pp. 236-242, Third Quarter 1994.

Key, P. L., "Surface Morphology of Whisker Crystals of Tin, Zinc and Cadmium," Proceedings - 1970 20th Electronic Components Conference, Washington, D. C., May 13-15, 1970, pp. 155-160.

Key, William S., and Davis, Jack Hayne, "Effect of elastic uniaxial strain on the electrical resistance of In2Bi single-crystal whiskers," Journal of Applied Physics, vol. 46 no. 6, pp. 2806-2807, June 1975.

Keyserlingk, Tom, "Preparing Supply Chains for the Disruption of Green Transitions," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings , Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Khalil, Abdullah, Lalia, Boor Singh, Hashaikeh, Raed, and Khraisheh, Marwan, "Electrospun metallic nanowires: Synthesis, characterization, and applications," Journal of Applied Physics, vol. 114, pp. 171301-1-171301-16, 2013.

Khalil, Abdullah, Hashaikeh, Raed, and Jouiad, Mustapha, "Synthesis and morphology analysis of electrospun copper nanowires," Journal of Materials Science, vol. 49 no. 8, pp. 3052-3065, Apr. 2014.

Khan, Arshad, Lam, Rex, and Houghton, Bruce, "Printed Circuit Board Reliability In High Temperature Lead(Pb)-Free Processes," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S40-1-1-S40-1-12.

Khan, Babar Shahzad, Mehmood, Tahir, Mukhtar, Aiman, and Tan, Ming, "Effect of workfunction on the growth of electrodeposited Cu, Ni and Co nanowires," Materials Letters, vol. 136, pp. 13-16, Dec. 1, 2014.

Khan, Babar Shahzad, Mehmood, Tahir, Mukhtar, Aiman, and Tan, Ming, "Effect of workfunction on the growth of electrodeposited Cu, Ni and Co nanowires," Materials Letters, vol. 137, pp. 13-16, Dec, 15, 2014.

Khan, Mueed, "Characteristics of a Third-Level PCB Assembly," Printed Circuit Design and Fab/ Circuits Assembly, vol. 31 no. 7, pp. 30-32, July 2014.

Khan, Navas, Wee, David Ho Soon, Chiew, Ong Siong, Sharmani, Cheryl, Lim, Li Shiah, Li, Hong Yu, and Vasarala, Shekar, "Three Chips Stacking with Low Volume Solder Using Single Re-Flow Process," 2010 Proceedings 60th Electronic Components and Technology Conference , Las Vegas, NV, June 1-4, 2010, pp. 884-888.

Khan, Zulki, "`Checking Up' on Medical Electronics," Circuits Assembly, vol. 19 no. 10, pp. 24-27, Oct. 2008.

Khan, Zulki, "Designing to Improve PTH Reliability," Printed Circuit Design and Fab, vol. 25 no. 1, pp. 16-18, Jan. 2008.

Khan, Zulki, "LEAD-FREE DFM Demands New Tricks," Printed Circuit Design and Manufacture, vol. 23 no. 8, pp. 26-29, Aug. 2006.

Khan, Zulki, "Medical devices must go lead-free," Electronic Engineering Times , no. 1549, pp. 31-32, Nov. 10, 2008.

Khan, Zulki, "Medical Electronics OEMs: Prepare for Lead-free," Surface Mount Technology (SMT), vol. 23 no. 1, pp. 15, Jan.-Feb. 2009.

Khan, Zulki, "Pb-Free Rework Differences and Practices," Circuits Assembly , vol. 16 no. 3, pp. 34, Oct. 2005.

Khan, Zulki, "RoHS: One Year Later." ECN, vol. xx no. xx, pp. xx-xx, Aug. 2007.

Khan, Zulki, "The Impact of Lead-Free on DESIGN AND FABRICATION," Printed Circuit Design and Manufacture, vol. 22 no. 8, pp. 34-36, Aug. 2005.

Khan, Zulki, "Tracking the Flow of Solder Defects," SMT Web Exclusive Article.

Khan, Zulki, "Transitioning The OEM To Lead-Free PCBs," Lead-Free Connection , vol. 3 no. 2, pp. 6-8, Aug. 2006.

Khanna, Vijay D., and Sri-Jayantha, Sri M., "Impact of Organic Substrate Warp on C4 Non-Wets," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 12, pp. 1947-1956, Dec. 2011.

Khanna, Vijay D., and Sri-Jayantha, Sri M., "Methodology for Predicting C4 Non-Wets During the Chip Attach Process," 2010 Proceedings 60th Electronic Components and Technology Conference , Las Vegas, NV, June 1-4, 2010, pp. 1117-1124.

Khantha, M., Pope, D. P., and Vitek, V., "Mechanism of yielding in dislocation-free crystals at finite temperatures - Part II. Applications to the deformation of whiskers and the brittle-to-ductile transition," Acta Materialia, vol. 45 no. 11, 4687-4694, Nov. 1997.

Khaselev, O., Zararine, I. S., Vysotskaya, A., Fan, C., Zhang, Y., and Abys, J., "Electroplating and Properties of SnBi and SnCu for Lead-Free Finishes," Transactions of the Institute of Metal Finishing, vol. 80 no. 6, pp. 200-204, Nov. 2002.

Khatibi, G., Wroczewski, W., Weiss, B., and Ipser, H., "A novel accelerated test technique for assessment of mechanical reliability of solder interconnects," Microelectronics Reliability, vol. 49 no. 9-11, pp. 1283-1287, Sept.-Nov. 2009.

Khatibi, G., Lederer, M., Byrne, E., Kotas, A. Betzwar, Weiss, B., and Ipser, H., "Characterization of Stress-Strain Response of Lead-Free Solder Joints Using a Digital Image Correlation Technique and Finite-Element Modeling," Journal of Electronic Materials, vol. 42 no. 2, pp. 294-303, Feb. 2013.

Kheng, Lee Teck, Leng, Ser Bok, Ling, Chong Wee, Tun, Khin Sandar, and Qiang, Yan Guo, "Comparison of SLICF with C4 for Flip Chip bonding with Au, Cu, Pd and Ag Studs with SAC solder," 2013 IEEE 15th Electronics Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp. 178-182.

Khetriwal, Deepali Sinha, Widmer, Rolf, Kuehr, Ruediger, and Huisman, Jaco, "One WEEE, many species: lessons from the European experience," Waste Management and Research, vol. 29 no. 9, pp. 954-962, Sept. 2011.

Khetriwal, Deepali Sinha, Kraeuchi, Philipp, and Widmer, Rolf, "Producer responsibility for e-waste management: Key issues for consideration - Learning from the Swiss experience," Journal of Environmental Management, vol. 90 no. 1, pp. 153-165, Jan. 2009.

Khmissi, H., Naji, K., Alouane, M. H. Hadj, Chauvin, N., Bru-Chevallier, C., Ilahi, B., Patriarche, G., and Gendry, M., "InAs/InP nanowires grown by catalyst assisted molecular beam epitaxy on silicon substrates," Journal of Crystal Growth, vol. 344 no. 1, pp. 45-50, Apr. 1, 2012.

Khodabakhshi, F., Sayyadi, R., and Javid, N. Shahamat, "Lead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical alloying: Microstructural evolution and mechanical durability," Materials Science and Engineering: A, vol. 702, pp. 371-385, Aug. 15, 2017.

Khokhar, Wasim, "Effective training for RoHS compliance," Connector Specifier , vol. 23 no. 4, pp. 12-14, Sept./Oct. 2007.

Khong, Chee Houe, Yu, Aibin, Zhang, Xiaowu, Kripesh, V., Pinjala, D., Kwong, Dim-Lee, Chen, Scott, Chan, Chien-Feng, Chao, Chun-Chieh, Chiu, Chi-Hsin, Huang, Chih-Ming, and Chen, Carl, "Sub-modeling Technique for Thermo-Mechanical Simulation of Solder Microbumps Assembly in 3D Chip Stacking," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 591-595.

Kiatkittipong, Worapon, Wongsuchoto, Porntip, Meevasana, Khanidtha, and Pavasant, Prasert, "When to buy new electrical/electronic products?," Journal of Cleaner Production, vol. 16 no. 13, pp. 1339-1345, Sept. 2008.

Kickham, Victoria Fraza. "ROHS 2 Creeps Up on the Industry," Electronic Design, vol. 61 no. 2, pp. 41-44, Feb. 7, 2013.

Kickham, Victoria Fraza, "RoHS Recast, Dodd-Frank Act Top Distributors' Legislative Concerns," Electronic Design, vol. 59 no. 9, pp. 59-60,62, July 7, 2011.

Kiddee, Peeranart, Naidu, Ravi, and Wong, Ming H., "Electronic waste management approaches: An overview," Waste Management , vol. 33 no. 5, pp. 1237-1250, May 2013.

Kielbasinski, Konrad, Jakubowska, Malgorzata, Mlozniak, Anna, Hrovat, Marko, Holc, Janez, and Belavic, Darko, "Electrical and Microstructure Evolution of Thick Film Lead-free Resistors after Various Temperature Treatments," 32nd International Spring Seminar on Electronics Technology, Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.

Kielbasinski, Konrad, Jakubowska, Malgorzata, Mlozniak, Anna, Hrovat, Marko, Holc, Janez, and Belavic, Darko, "Investigation on electrical and microstructural properties of Thick Film Lead-Free resistor series under various firing conditions," Journal of Materials Science: Materials in Electronics, vol. 21 no. 10, pp. 1099-1105, Oct. 2010.

Kiew, Kelvin, "The Mystery Behind MSL 1, 2, 3," High Frequency Electronics, vol. 15 no. 3, pp. 34,36,38-39, Mar. 2016.

Kiga, Tomoya, Asai, Tadashi, Mizuguchi, Yukiko, Murakami, Yosuke, Tanaka, Shinji, and Tomiya, Shigetaka, "Test Method and Mechanism Analysis for Tin Whisker Growth by Mechanical Stress," Journal of the Surface Finishing Society of Japan, vol. 59 no. 4, pp. 223-227, 2008.

Kiilunen, Janne, and Frisk, Laura, "Hygrothermal Aging of an ACA Attached PET Flex-on-Board Assembly," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 4 no. 2, pp. 181-189, Feb. 2014.

Kiilunen, Janne, and Frisk, Laura, "Reliability analysis of an ACA attached flex-on-board assembly for industrial application," Soldering & Surface Mount Technology, vol. 26 no. 2, pp. 62-70, 2014.

Kiilunen, Janne, Frisk, Laura, and Hoikkanen, Maija, "The Effect of Bonding Temperature and Curing Time on Peel Strength of Anisotropically Conductive Film Flex-On-Board Samples," IEEE Transactions on Device and Materials Reliability, vol. 12 no. 2, pp. 455-461, June 2012.

Kiilunen, Janne, Lahokallio, Sanna, and Frisk, Laura, "Thermal Cycling Reliability Analysis of an Anisotropic Conductive Adhesive Attached Large-Area Chip with Area Array Configuration," 2015 IEEE 17th Electronics Packaging and Technology Conference, Singapore, Dec. 2-4, 2015, pp. xx-xx.

Kikkawa, Takeo, Ideda, Renya, Matsuda, Takahiro, and Watanabe, Takashi, "Development of 3-dimensional Memory Module Using Anisotropic Conductive Adhesive Films," Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium, Berlin, Germany, Apr. 27-29, 1998, pp. 31-37.

Kikuchi, S., Nishimura, M., Suetsugu, K., Ikari, T., and Matsushige, K., "Strength of bonding interface in lead-free Sn alloy solders," Materials Science and Engineering A, vol. 319-321, pp. 475-479, Dec. 2001.

Kikuchi, Shunichi, Higashi, Osamu, Yamada, Mitsuaki, and Ozaki, Noritsugu, "Considerations on Printed Wiring Board design for Fatigue Reliability of Pb-free soldered leadless packages," Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 12-14, 2005, pp. 567-568.

Kikuchi, Takashi, Ramakrishna, Gnyaneshwar, Chu, Quyen, Ly, Hien, Sethuraman, Sundar, Shea, Chrys, and Clech, Jean-Paul, "Long-Term Reliability Assessment of a New Lead-Free Area Array Connector System," South East Asia Technical Training Conference on Electronics Assembly Technologies 2011 Proceedings, Penang, Malaysia, May 19-20, 2011, pp. xx-xx.

Kilian, Arnd, Schreier, Petra, Bruder, Maren, Oezkoek, Mustafa, and Ramos, Gustavo, "Soldering Evaluations on the New Direct Palladium Gold Finish (EPAG)," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 981-985.

Killefer, Morgan, Borra, Vamsi, Al-Bayati, Ahmed, Georgiev, Daniel G., Karpov, Victor G., Parsai, E. Ishmael, and Shvydka, Diana, "Whisker growth on Sn thin film accelerated under gamma-ray induced electric field," Journal of Physics D: Applied Physics, vol. 50 no. 40, pp. 405302-1-405302-7, Oct. 11, 2017.

Kim, Bae-Kyun, Lee, Seong-Jae, Kim, Jong-Yun, Ji, Kum-Young, Yoon, Yeo-Joo, Kim, Mi-Yang, Park, Song-Hae, and Yoo, Jong-Soo, "Origin of Surface Defects in PCB Final Finishes by the Electroless Nickel Immersion Gold Process," Journal of Electronic Materials, vol. 37 no. 4, pp. 527-534, Apr. 2008.

Kim, Beomjun, Lee, Chang-Woo, Lee, Dongyun, and Kang, Namhyun, "Effect of Sb addition on Bi-2.6Ag-0.1Cu solders for high-temperature applications," Journal of Alloys and Compounds, vol. 592, pp. 207-212, Apr. 15, 2014.

Kim, Bioh, Sharbono, Charles, Ritzdorf, Tom, and Schmauch, Dan, "Comparison of Near-Eutectic SnPb and SnAg Solder Plating for WLP Applications," 2006 Pan Pacific Symposium Conference Proceedings , Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Kim, Bioh, Sharbono, Charles, Ritzdorf, Tom, and Schmauch, Dan, "Comparison of Near-Eutectic SnPb and SnAg Solder Plating for WLP Applications," SMTANews & Journal of Surface Mount Technology , vol. 19 no. 3, pp. 43-49, July-Sept. 2006.

Kim, Bioh, Ritzdorf, Tom, Schmauch, Dan, and Siblerud, Paul, "Through-Mask Electrodeposition of Leadfree Solders for Wafer-Level Packaging Applications," Wafer-Level Congress and Exhibition Conference Proceedings, San Jose, CA, Oct. 10-12, 2004, pp. xx-xx.

Kim, Byeong Geun, Kim, Byung-Sung, Jeong, Seong-Min, Choi, Soon-Mok, Whang, Dongmok, and Lee, Hong-Lim, "Catalyst-free growth of Sb2Te3 nanowires," Materials Letters, vol. 65 no. 5, pp. 812-814, Mar. 15, 2011.

Kim, Byung-Su, Lee, Jae-chun, Jeong, Jinki, Kang, Seongwon, and Lee, Kwang-Ho, "A High Temperature Process for Extracting Valuable Metals from Waste Electric and Electronic Scraps (WEES)," Materials Transactions, vol. 50 no. 6, pp. 1558-1562, 2009.

Kim, Byung-Su, Lee, Jae-chun, and Kim, Soo-Kyung, "A Novel Cyclic Process Involving Zinc for Separating Silver from Lead-Free Solder Residue," Materials Transactions, vol. 51 no. 7, pp. 1350-1353, 2010.

Kim, Choong-Un, Bang, Woong-Ho, Xu, Huili, and Lee, Tae-Kyu, "Characterization of Solder Joint Reliability Using Cyclic Mechanical Fatigue Testing," JOM, vol. 65 no. 10, pp. 1362-1373, Oct. 2013.

Kim, Chunho, Kang, Suk Chae, and Baldwin, Daniel F., "Experimental evaluation of wetting dynamics models for Sn63Pb37 and SnAg4.0Cu0.5 solder materials," Journal of Applied Physics, vol. 104 no. 3, pp. 033537-1-033537-13, 2008.

Kim, D.-G., Jang, H.-S., and Jung, S.-B., "Kinetics of intermetallic compound layer growth and interfacial reactions between Sn-8Zn-5In solder and bare copper substrate," Materials Science and Technology, vol. 21 no. 3, pp. 381-385, Mar. 2005.

Kim, Dae-Gon, Jang, Hyung-Sun, Kim, Jong-Woong, and Jung, Seung-Boo, "Correlation between the interfacial reaction and mechanical joint strength of the flip chip solder bump during isothermal aging," Journal of Materials Science: Materials in Electronics, vol. 16 no. 9, pp. 603-609, Sept. 2005.

Kim, Dae-Gon, Kim, Jong-Woong, and Jung, Seung-Boo, "Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM," Materials Science and Engineering B: Solid-State Materials for Advanced Technology, vol. 121 no. 3, pp. 204-210, Aug. 15, 2005.

Kim, Dae-Gon, Kim, Jong-Woong, Ha, Sang-Su, Noh, Bo-In, Koo, Ja-Myeong, Park, Dong-Woon, Ko, Myung-Wan, and Jung, Seung-Boo, "Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints," Journal of Alloys and Compounds, vol. 458 no. 1-2, pp. 253-260, June 30, 2008.

Kim, Dae-Gon, Kim, Jong-Woong, and Jung, Seung-Boo, "Evaluation of solder joint reliability in flip chip package under thermal shock test," Thin Solid Films, vol. 504 no. 1-2, pp. 426-430, May 10, 2006.

Kim, Dae-Gon, Jang, Hyung-Sun, Kim, Young-Jig, and Jung, Seung-Boo, "Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-free Flip Chip Solder Bump during Solid State Isothermal Aging," Materials Science Forum, vol. 486-487, pp. 273-276, 2005.

Kim, Dae-Gon, Lee, Chang-Youl, and Jung, Seung-Boo, "Interfacial reactions and intermetallic compound growth between indium and copper," Journal of Materials Science: Materials in Electronics, vol. 15 no. 2, pp. 95-98, Feb. 2004.

Kim, Dae-Gon, and Jung, Seung-Boo, "Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn-3.0Ag-0.5Cu Solder and Ni-P under Bump Metallurgy," Materials Transactions, vol. 46 no. 6, pp. 1295-1300, 2005.

Kim, Dae Gon, Jang, Hyung Sun, Kim, Jong Woong, and Jung, Seung Boo, "Investigations of Interfacial Reaction and Shear Strength between Pb-free Flip Chip Solder and Electroplated Cu UBM," Key Engineering Materials , vol. 297-300, pp. 863-868, 2005.

Kim, Dae-Gon, and Jung, Seung-Boo, "Microstructure and Mechanical Properties of Sn-0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method," Materials Transactions, vol. 46 no. 11, pp. 2366-2371, 2005.

Kim, Dae-Gon, Kim, Jong-Woong, Ha, Sang-Su, Koo, Ja-Myeong, Noh, Bo-In, and Jung, Seung-Boo, "Reliability evaluation of underfill encapsulated Pb- free flip chip package under thermal shock test," Materials Science Forum, vol. 544-545, pp. 621-624, 2007.

Kim, Dae-Gon, Jang, Hyung-Sun, and Jung, Seung-Boo, "Solid state intermetallic compound layer growth between Sn-8Zn-3Bi solder and bare copper substrate," Journal of Materials Science: Materials in Electronics, vol. 16 no. 8, pp. 523-528, Aug. 2005.

Kim, Dae-Gon, and Jung, Seung-Boo, "The Effect of Isothermal Aging on the Thickness of Intermetallic Compound Layer Growth between Low Melting Point Solders and Ni-Plated Cu Substrate," Journal of Electronic Materials, vol. 33 no. 12, pp. 1561-1566, Dec. 2004.

Kim, Daeik, Quinlan, Michael, and Yen, Teh Fu, "Encapsulation of lead from hazardous CRT glass wastes using biopolymer cross-linked concrete systems," Waste Management, vol. 29 no. 1, pp. 321-328, Jan. 2009.

Kim, Deok-Hoon, and Elenius, Peter, "Deformation and Crack Growth Characteristics of SnAgCu vs 63Sn/Pb Solder Joints on a WLP in Thermal Cycle Testing," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 681-686.

Kim, Deok-Hoon, Elenius, Peter, and Barrett, Scott, "Solder-Joint Reliability and Characteristics of Deformation and Crack Growth of Sn-Ag-Cu Versus Eutectic Sn-Pb on a WLP in a Thermal Cycling Test," IEEE Transactions on Electronics Packaging Manufacturing, vol. 25 no. 2, pp. 84-90, Apr. 2002.

Kim, Deok-kee, "Effect of SiO2 passivation overlayers on hillock formation in Al thin films," Thin Solid Films, vol. 520 no. 21, pp. 6571-6575, Aug. 2012.

Kim, Deok-kee, Nix, William D., Vinci, Richard P., Deal, Michael D., and Plummer, James D., "Study of the effect of grain boundary migration on hillock formation in Al thin films," Journal of Applied Physics, vol. 90 no. 2, pp. 781-788, July 15, 2001.

Kim, Do-Seop, Yu, Qiang, Shibutani, Tadahiro, Sadakata, Nobuyuki, and Inoue, Toshiaki, "Effect of Void Formation on Thermal Fatigue Reliability of Lead-Free Solder Joints," The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 325-329.

Kim, Do-Seop, Yu, Qiang, Shibutani, Tadahiro, and Shiratori, Masaki, "Nonlinear Behavior Study on Effect of Hardening Rule of Lead Free Solder Joint," Advances in Electronic Packaging 2003, Volume 1, Maui, Hawaii, July 6-11, 2003, pp. 837-843.

Kim, Dong Hoon, Cho, Moon Gi, Seo, Sun-Kyoung, and Lee, Hyuck Mo, "Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM," Journal of Electronic Materials, vol. 38 no. 1, pp. 39-45, Jan. 2009.

Kim, Dong Hyun, Ahmad, Mudasir, and Teng, Sue, "Reliability Study and AF Modeling for SnAgCu Solder Joints and SnPb Solder Joints in QFN Packages," SMTAnews & Journal of Surface Mount Technology, vol. 23 no. 1, pp. 11-17, Jan.-Mar. 2010.

Kim, Dong Hyun, Lee, Tae-Kyu, Kim, Sang Ha, Park, Han G., and Liu, Kuo-Chuan, "Study on Dynamic Shock Performance of SAC305 Solder Joint after Different Aging Conditions," 2008 SMTA International Conference Proceedings , Orlando, FL, Aug. 17-21, 2008, pp. 182-186.

Kim, Dongchoul, "Evolution of micro solder joints under electromigration and elastic field," Journal of Mechanical Science and Technology, vol. 23 no. 2, pp. 489-497, Feb. 2009.

Kim, Donghyun, Filho, Jose Marcio Dias, Park, Changyoung, Mawer, Andrew, Moon, Tess J., and Masada, Glenn Y., "Crack Length Analysis of SnPb and SnAg Solder Joints in Plastic Ball Grid Array Packages from Dye Penetration Studies," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1746-1753.

Kim, Donghyun, Hubbard, Ken, Nandagopal, Bala, Hu, Mason, Teng, Sue, and Nouri, Ali, "Effect of Voiding on Solder Joint Shock and Thermal Cycle Reliability," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S31-03-1-S31-03-10.

Kim, Donghyun, Mawer, Andrew, Moon, Tess J., and Masada, Glenn Y., "Life Prediction of SnPb and SnAg Solder Joints in PBGA Packages Using a Severity Metruc," Advances in Electronic Packaging 2003, Volume 1 , Maui, Hawaii, July 6-11, 2003, pp. 885-895.

Kim, Donghyun, Ahmad, Mudasir, and Teng, Sue, "Reliability Study of Lead-Free SnAgCu Solder Joints vs. SnPb Solder Joints in QFN Packages," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 783-788.

Kim, Dongwook, Bhimaraj, Praveen, Watts, Nick, Isao, Yamada, Kumar, Chetan, and Xu, Youren, "Evaluation of DIG (Direct Immersion Gold) as a New Surface Finish for Mobile Applications," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 258-262.

Kim, Dongwook, Suh, Daewoong, Millard, Thomas, Kim, Hyunchul, Kumar, Chetan, Zhu, Mark, and Xu, Youren, "Evaluation of High Compliant Low Ag Solder Alloys on OSP as a Drop Solution for the 2nd Level Pb-Free Interconnection," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1614-1619.

Kim, Dongwook, Lee, Chin C., and Sokolowski, Witold M., "Fluxless Flip Chip Technique with Sn-Rich Au/Sn Solder Bumps," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 840-843.

Kim, Dongwook, and Lee, Chin C., "New Fluxless Bonding Process in Air Using Sn-Bi with Au Cap," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 668-672.

Kim, Dongwook, Kim, Jongsung, Wang, Gow L., and Lee, Chin C., "Nucleation and growth of intermetallics and gold clusters on thick tin layers in electroplating process," Materials Science and Engineering A, vol. 393 no. 1-2, pp. 315-319, Feb. 25, 2005.

Kim, Doosoo, Chang, Jong-hyeon, Park, Jungil, and Pak, James Jungho, "Formation and behavior of Kirkendall voids within intermetallic layers of solder joints," Journal of Materials Science: Materials in Electronics , vol. 22 no. 7, pp. 703-716, July 2011.

Kim, Doosoo, and Pak, James Jungho, "Micro void growth in NiSnP layer between (Cu,Ni)6Sn5 intermetallic compound and Ni3P by higher reflow temperature and multiple reflow," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Kim, Doosoo, and Pak, James Jungho, "Micro void growth in NiSnP layer between (Cu,Ni)6Sn5 intermetallic compound and Ni3P by higher reflow temperature and multiple reflow," Journal of Materials Science: Materials in Electronics, vol. 21 no. 11, pp. 1337-1345, Nov. 2010.

Kim, Doseop, Yu, Qiang, Kobayashi, Yusuke, and Shibutani, Tadahiro, "Effect of Voids on Thermal Fatigue Reliability of Lead Free Solder Joint," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part C, San Francisco, CA, July 17-22, 2005, pp. 1643-1648.

Kim, DukSoo, Jung, YoungChai, Park, MiYoung, Kim, ByungSung, Hong, SuHeon, Choi, MinSu, Kang, MyungGil, Yu, YunSeop, Whang, Dongmok, and Hwang, SungWoo, "Electrical Characteristics of the Backgated Bottom-Up Silicon Nanowire FETs," IEEE Transactions on Nanotechnology, vol. 7 no. 6, pp. 683-687, Nov. 2008.

Kim, G. S., "Halogen Free Challenges and Readiness on 3D Packaging," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Kim, Geun Sik, and Kim, Dong Sik, "0.4 mm Solder Ball Pitch Chip Scale Packaging and Drop Test Performance," SMTAnews & Journal of Surface Mount Technology, vol. 20 no. 4, pp. 21-29, Oct.-Dec. 2007.

Kim, Geun Sik, Bathan, Henry, Kim, Dong Sik, and Kim, Sung Soo, "Application of Ni/Pd/Au Surface Finished Substrate for Chip-Scale Packaging and Its Drop Test Performance," SMTA International Wafer-Level Packaging Conference, San Jose, CA, Oct. 13-16, 2008, pp. xx-xx.

Kim, Gye Hyun, and Thompson, Carl V., "Effect of surface energy anisotropy on Rayleigh-like solid-state dewetting and nanowire stability," Acta Materialia, vol. 84, pp. 190-201, Feb. 1, 2015.

Kim, H. K., and Shi, F. G., "Electrical reliability of electrically conductive adhesive joints: dependence on curing condition and current density," Microelectronics Journal , vol. 32 no. 4, pp. 315-321, Apr. 2001.

Kim, H. K., Liou, H. K., and Tu, K. N., "Morphology of instability of the wetting tips of eutectic SnBi, eutectic SnPb, and pure Sn on Cu," Journal of Materials Research, vol. 10 no. 3, pp. 497-504, Mar. 1995.

Kim, Hansoo, Li, Li, Lizzul, Christine, Sacolick, Isaac, and Morris, J. E., "Processing, Structural and Electrical Properties of Electrically Conductive Adhesives," 1993 Proceedings 43rd Electronic Components & Technology Conference, Orlando, FL, June 1-4, 1993, pp. 311-319.

Kim, Hee-Soo, Won, Yong Sun, and Kwak, Young Hoon, "Growth kinetics and size distribution of intermetallic compound grains in soldering reaction based on separate measurements of grain radius and height," Scripta Materialia, vol. 62 no. 1, pp. 29-32, Jan. 2010.

Kim, Hong-Kyu, Kim, Sung-Hoon, Ahn, Jae-Pyoung, and Lee, Jae-Chul, "Deformation criterion for face-centered-cubic metal nanowires," Materials Science and Engineering: A, vol. 736, pp. 431-437, Oct. 24, 2018.

Kim, Hong-Sik, Patel, Malkeshkumar, Kim, Hyunki, Kim, Ja-Yeon, Kwon, Min-Ki, and Kim, Joondong, "Solution-processed transparent conducting Ag nanowires layer for photoelectric device applications," Materials Letters, vol. 160, pp. 305-308, Dec. 1, 2015.

Kim, Hyoung II, Tian, Jun, and Gupta, Vijay. "In-situ measurement of solder joint strength in board-mounted chip-scale packages using a quantitative laser spallation technique," Journal of Adhesion Science and Technology, vol. 27 no. 7, pp. 719-730, Apr. 2013.

Kim, Hyoung-Joon, and Paik, Kyung-Wook, "Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1707-1713.

Kim, Hyoung-Joon, and Paik, Kyung-Wook, "Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish," Journal of Electronic Materials, vol. 37 no. 7, pp. 1003-1011, July 2008.

Kim, Hyoung-Joon, Hong, Soon-Min, Jang, Se-Young, Moon, Young-Joon, and Paik, Kyung-Wook, "Bubbles Formation in Rigid-Flexible Substrates Bonding using Anisotropic Conductive Films (ACFs) and Their Effects on ACFs Joints Reliability," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2 , Singapore, Dec. 7-9, 2005, pp. 734-739.

Kim, Hyoung-Joon, and Paik, Kyung-Wook, "Effects of Metal Surface Finish on the Anisotropic Conductive Adhesives (ACAs) Joints," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 143-149.

Kim, Hyoung-Joon, Chung, Chang-Kyu, Kwon, Yong-Min, Yim, Myung-Jin, Hong, Soon-Min,, Jang, Se-Young, Moon, Young-Joon, and Paik, Kyung-Wook, "Study of the Formation of Bubbles in Rigid Substrate-Flexible Substrate Bonding Using Anisotropic Conductive Films and the Bubble Effects on Anisotropic Conductive Film Joint Reliability," Journal of Electronic Materials, vol. 36 no. 1, pp. 56-64, Jan. 2007.

Kim, Hyoung-Joon, Chung, Chang-Kyu, Yim, Myung-Jin, Hong, Soon-Min, Jang, Se-Young, Moon, Young-Joon, and Paik, Kyung-Wook, "Study on Bubble Formation in Rigid-Flexible Substrates Bonding using Anisotropic Conductive Films (ACFs) and Their Effects on the ACF Joint Reliability," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 952-958.

Kim, Hyoung-Joon, Chung, Chang-Kyu, Kwon, Yong-Min, Yim, Myung-Jin, Hong, Soon-Min, Jang, Se-Young, Moon, Young-Joon, and Paik, Kyung-Wook, "Study of the Formation of Bubbles in Rigid Substrate-Flexible Substrate Bonding Using Anisotropic Conductive Films and the Bubble Effects on Anisotropic Conductive Film Joint Reliability," Journal of Electronic Materials, vol. 36 no. 1, pp. 56-64, Jan. 2007.

Kim, Hyun Jin, Jang, Seok Pil, Lee, Jong-Hyun, and Park, Yong-Jun, "Transformation of SAC (Sn3.0Ag0.5Cu) nanoparticles into bulk material during melting process with large melting-point depression," IET Micro & Nano Letters, vol. 11 no. 12, pp. 840-843, Dec. 2016.

Kim, Hyunchul, Zhang, Mu, Kumar, Chetan M., Suh, Daewoong, Liu, Pilin, Kim, Dongwook, Xie, Mayue, and Wang, Zhiyong, "Improved Drop Reliability Performance with Lead Free Solders of Low Ag Content and Their Failure Modes," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 962-967.

Kim, Hyung Jin, Roh, Yonghan, and Hong, Byungyou, "Selective Alignment of Gold Nanowires Synthesized With DNA as Template by Surface-Patterning Technique," IEEE Transactions on Nanotechnology , vol. 9 no. 2, pp. 254-257, Mar. 2010.

Kim, Hyungkun, Kim, Yu-Sik, Lee, Jeong Wook, Yoon, Sukho, Cho, Jaehee, Kim, Hyunsoo, Sone, Cheolsoo, and Park, Yongjo, "The Effect of Packaging Material and Process on Device Performance of Light Emitting Diode," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 348-353.

Kim, Il, and Paik, Kyung-Wook, "Low Temperature Curable Anisotropic Conductive Films (ACFs) with Photo-active Curing Agent (PA-ACFs)," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 412-415.

Kim, Il, and Paik, Kyung-Wook, "Low-Temperature Curable Photo-Active Anisotropic Conductive Films (PA-ACFs)," Journal of Electronic Materials, vol. xx no. x, pp. xx-xx, xxxx.

Kim, Il, Kim, Hyoung-Joon, and Paik, Kyung-Wook, "Thermal Stability at the Anisotropic Conductive Films (ACFs)/ Organic Solderability Preservatives (OSPs) Interface," 9th International Conference on Electronic Materials and Packaging, Daejon, Korea, Nov. 19-22, 2007, pp. xx-xx.

Kim, Il, and Paik, Kyung-Wook, "Ultra low temperature curable Anisotropic Conductive Films (ACFs) with photo latent curing behavior (PLC-ACFs)," 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 7-9, 2011, pp. 185-189.

Kim, Il, Jang, Kyung-Woon, Son, Ho-Young, Kim, Jae-Han, and Paik, Kyung-Wook, "Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 5, pp. 792-797, May 2011.

Kim, Il, Jang, Kyung-Woon, Son, Ho-Young, Kim, Jae-Han, and Paik, Kyung-Wook, "Wafer Level Packages (WLPs) using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 219-224.

Kim, Ilho, Park, Tae-Sang, and Lee, Soon-Bok, "A Comparative Study of The Fatigue Behavior of SnAgCu and SnPb Solder Joints," Key Engineering Materials, vol. 297-300, pp. 831-836, Nov. 2005.

Kim, Ilho, and Lee, Soon-Bok, "A Comparative Study on Thermal and Mechanical Fatigue Behavior for Lead-Free Solder Joints," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Kim, Ilho, and Lee, Soon-Bok, "Development of a Novel Microimpact-Fatigue Tester and Its Application to Impact Reliability of Lead-Free Solder Joints," IEEE Transactions on Components and Packaging Technologies, vol. 32 no. 3, pp. 542-549, Sept. 2009.

Kim, Ilho, and Lee, Soon-Bok, "Fatigue Life Evaluation of Lead-free Solder under Thermal and Mechanical Loads," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 95-104.

Kim, Ilho, and Lee, Soon-Bok, "Reliability and Failure Analysis of Lead-Free Solder Joints for PBGA Package Under a Cyclic Bending Load," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 2, pp. 478-484, June 2008.

Kim, Ilho, and Lee, Soon-Bok, "Reliability Assessments of BGA Solder Joints under Cyclic Bending Loads," 2005 International Symposium on Electronics Materials and Packaging , Tokyo, Japan, Dec. 11-14, 2005, pp. 27-32.

Kim, Ilho, Yoon, Ji Young, and Lee, Soon-Bok, "The measurement of residual deformation in PBGA package after reflow process using a newly developed laser profiler," Key Engineering Materials , vol. 326-328, pp. 513-516, Sept. 2006.

Kim, Inkoo, Kang, Man Il, Kim, Sok Won, Jung, Eun, and Lee, Sang Hyun, "Thermal diffusivity of Sn-Ag-Cu-based, Pb-free, micro- and nano-sized solder balls," Thermochimica Acta, vol. 542, pp. 42-45, Aug. 20, 2012.

Kim, J.-D., Baek, Y.-H., Choi, W.-S., and Bok, K.-S., "Iron-42 wt pct Nickel Lead Frame with Palladium-Electroplated Multi-layer for Semiconductor Packages," Plating & Surface Finishing, vol. 86 no. 6, pp. 113-116, June 1999.

Kim, J.-D., Choi, W.-S., Park, K.-S., Kim, E.-H., Lee, S.-B., and Kim, H.-G., "PPF (Pre-Plated Frame) Technology Using Sn-Bi and Pure Sn Electro Deposition on Alloy 42 Lead Frame for Semiconductor Package Corresponding to Lead Free Movement," 2004 IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium, July 14-16, 2004, pp. 40-44.

Kim, J.-D., Choi, W.-S., Park, K.-S., Kim, E.-H., Lee, S.-B., and Kim, H.-G., "Tin-Bismuth Pre-Plating Technology for Alloy 42 LeadFrames," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 268-279.

Kim, J. H., and Yu, Jin, "Black Pad Susceptibility of the Electroless Ni Films on the Cu UBM," Journal of Electronic Materials, vol. 43 no. 11, pp. 4335-4343, Nov. 2014.

Kim, J. M., Yang, K. C., Lee, S. B., Lee, S. H., Shin, Y. E., Chang, K. H., Han, J. G., Eom, Y. S., Moon, J. T., Baek, J. W., and Nam, J. D., "An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs)," Materials Science Forum , vol. 580-582, pp. 217-220, 2008.

Kim, J.-W., Joo, J., Quesnel, D. J., and Jung, S.-B., "Correlation between displacement rate and shear force in shear test of Sn-Pb and lead free solder joints," Materials Science and Technology, vol. 21 no. 3, pp. 373-380, Mar. 2005.

Kim, J. Y., Sohn, Y. C., and Yu, Jin, "Effect of Cu content on the mechanical reliability of Ni/Sn-3.5Ag system," Journal of Materials Research, vol. 22 no. 3, pp. 770-776, Mar. 2007.

Kim, J. Y., and Yu, Jin, "Effects of residual impurities in electroplated Cu on the Kirkendall void formation during soldering," Applied Physics Letters, vol. 92 no. 9, pp. 092109-1-092109-3, Mar. 3, 2008.

Kim, J. Y., Yu, J., Lee, J. H., and Lee, T. Y., "The Effects of Electroplating Parameters on the Composition and Morphology of Sn-Ag Solder," Journal of Electronic Materials, vol. 33 no. 12, pp. 1459-1464, Dec. 2004.

Kim, Jae-Ha, Lee, Young-Chul, Lee, Sang-Min, and Jung, Seung-Boo, "Effect of surface finishes on electromigration reliability in eutectic Sn-58Bi solder joints," Microelectronic Engineering, vol. 120, pp. 77-84, May 25, 2014.

Kim, Jae-Myeong, Jeong, Myeong-Hyeok, Kwon, Sang-Hyun, Yoo, Sehoon, and Park, Young-Bae, "Comparisons of Mechanical Reliabilities of Sn-3.0Ag-0.5Cu solder between ENIG and immersion Sn Pad Finishes," 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Incheon, South Korea, July 4-7, 2011, pp. xx-xx.

Kim, Jae-Myeong, Kwak, Byung-Hyun, Jeong, Myeong-Hyeok, Yoo, Sehoon, and Park, Young-Bae, "Effects of Surface Finish Conditions on Interfacial Reaction Characteristics and Mechanical Reliability of Novel Sn-1.2Ag-0.7Cu-0.4In Solder Bump," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 1272-1277.

Kim, Jae-Myeong, Jeong, Myeong-Hyeok, Yoo, Sehoon, and Park, Young-Bae, "Effects of Surface Finishes and Current Stressing on Interfacial Reaction Characteristics of Sn-3.0Ag-0.5Cu Solder Bumps," Journal of Electronic Materials, vol. 41 no. 4, pp. 791-799, Apr. 2012.

Kim, Jae-Myeong, Jeong, Myeong-Hyeok, Yoo, Sehoon, Lee, Chang-Woo, and Park, Young-Bae, "Effects of surface finishes and loading speeds on shear strength of Sn-3.0Ag-0.5Cu solder joints," Microelectronic Engineering, vol. 89, pp. 55-57, Jan. 2012.

Kim, Jaemin, Shim, Jongjoo, Pak, Jun So, and Kim, Joungho, "Modeling of Chip-Package-PCB Hierarchical Power Distribution Network based on Segmentation Method," Electrical Design of Advanced Packaging and Systems Symposium, Seoul, Korea, Dec. 10-12, 2008, pp. 85-88.

Kim, Jang-Jung, Kim, Sook-Hyun, Suh, Seung-Wook, Choe, Dong-Uk, Park, Byung-Ki, Lee, Jae-Rock, and Lee, Young-Seak, "Hydrothermal synthesis of Bi2Te3 nanowires through the solid-state interdiffusion of Bi and Te atoms on the surface of Te nanowires," Journal of Crystal Growth, vol. 312 no. 22, pp. 3410-3415, Nov. 1, 2010.

Kim, Jemin, Jo, Yunseong, and Lee, Kwanhun, "Comparison with reliability of low Ag solder ball by thermal shock and cycling tests," 2016 6th Electronic System-Integration Technology Conference, Grenoble, France, Sept. 13-15, 2016, pp. xx-xx.

Kim, Jeng O., Jung, Jae Pil, Lee, Jae Hoon, Suh, Jeong, and Kang, Hee Shin, "Effect of Laser Parameter on the Bond Characteristics of Sn-3.5%Ag Solder Ball," Materials Science Forum, vol. 580-582, pp. 191-196, June 2008.

Kim, Jeong-Han, Suh, Min-Suk, and Kwon, Hyuk-Sang, "The formation of Cu-Sn intermetallic compound and its effect on the fracture behavior of 80Sn-20Pb electrodeposits on Cu-based Leadframe alloy," Surface and Coatings Technology, vol. 82 no. 1-2, pp. 23-28, July 1996.

Kim, Ji-Hye, Lee, Tae-Ik, Shin, Ji-Won, Kim, Taek-Soo, and Paik, Kyung-Wook, "Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 6 no. 2, pp. 208-215, Feb. 2016.

Kim, Ji-Hye, Lee, Tae-Ik, Kim, Taek-Soo, and Paik, Kyung-Wook, "Effects of ACFs adhesion on the bending reliability of Chip-in-Flex Packages for Wearable Electronics Applications," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 2461-2467.

Kim, Ji-Hye, Lee, Tae-Ik, Kim, Taek-Soo, and Paik, Kyung-Wook, "Effects of ACFs Modulus and Adhesion Strength on the Bending Reliability of CIF (Chip-in-Flex) Packages at Humid Environment," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 2319-2325.

Kim, Ji-Hye, Lee, Tae-Ik, Yoon, Dal-Jin, Kim, Taek-Soo, and Paik, Kyung-Wook, "Effects of Anisotropic Conductive Films (ACFs) Gap Heights on the Bending Reliability of Chip-In-Flex (CIF) Packages for Wearable Electronics Applications," 2017 IEEE 67th Electronic Components and Technology Conference, Orlando, FL, May 30-June 2, 2017, pp. 2161-2167.

Kim, Ji-Hye, Lee, Tae-Ik, Kim, Taek-Soo, and Paik, Kyung-Wook, "The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 7 no. 10, pp. 1583-1591, Oct. 2017.

Kim, Ji-Hye, Lee, Tae-Ik, Shin, Ji-Won, Kim, Taek-Soo, and Paik, Kyung-Wook, "Ultra-Thin Chip-in-Flex (CIF) technology using Anisotropic Conductive Films (ACFs) for Wearable Electronics Applications," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 714-718.

Kim, Jin-Yeol, Kwon, Sijoong, and Ihm, DaeWoo, "Reliability and thermodynamic studies of an anisotropic conductive adhesive film (ACAF) prepared from epoxy/rubber resins," Journal of Materials Processing Technology, vol. 152 no. 3, pp. 357-362, Oct 30, 2004.

Kim, Jiwon, Yim, Byung-seung, Kim, Jong-min, and Kim, Jooheon, "The effects of functionalized graphene nanosheets on the thermal and mechanical properties of epoxy composites for anisotropic conductive adhesives (ACAs)," Microelectronics Reliability, vol. 52 no. 3, pp. 595-602, Mar. 2012.

Kim, Jong-heon, Kang, In-soo, Oh, Sung-O, Kim, Hak-Nam, and Baek, Esdy, "Flip-chip packaging solution for CMOS image sensor device," Proceedings 2002 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4931), Denver, CO, Sept. 4-6, 2002, pp. 738-743.

Kim, Jong-Heon, Kang, In-Soo, Song, Chi-Jung, Hur, Young-Jik, Kim, Hak-Nam, Baek, Esdy, and Seo, Tae-Jun, "Flip-chip packaging solution for CMOS image sensor device," Microelectronics Reliability, vol. 44 no. 1, pp. 155-161, Jan. 2004.

Kim, Jong Hoon, Jeong, Sang Won, and Lee, Hyuck Mo, "A Thermodynamic Study of Phase Equilibria in the Au-Sb-Sn Solder System," Journal of Electronic Materials, vol. 31 no. 6, pp. 557-563, June 2002.

Kim, Jong Hoon, Jeong, Sang Won, and Lee, Hyuck Mo, "Abnormal Grain Growth of Ni3Sn4 at Sn-3.5Ag/Ni Interface," Materials Transactions, vol. 45 no. 3, pp. 710-713, Mar. 2004.

Kim, Jong Hoon, Jeong, Sang Won, Kim, Hyun Deuk, and Lee, Hyuck Mo, "Morphological Transition of Interfacial Ni3Sn4 Grains at the Sn-3.5Ag/Ni Joint," Journal of Electronic Materials, vol. 32 no. 11, pp. 1228-1234, Nov. 2003.

Kim, Jong Hoon, Jeong, Sang Won, and Lee, Hyuck Mo, "Thermodynamics-Aided Alloy Design and Evaluation of Pb-Free Solders for High-Temperature Applications," Materials Transactions, vol. 43 no. 8, pp. 1873-1878, Aug. 2002.

Kim, Jong-Min, Song, Yong, Cho, Minhaeng, Lee, Seong Hyuk, and Shin, Young-Eui, "Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding," Materials Transactions, vol. 51 no. 10, pp. 1790-1795, 2010.

Kim, Jong-Min, Woo, Seung-Wan, Chang, Yoon-Suk, Kim, Young-Jin, Choi, Jae-Boong, and Ji, Kum-Young, "Impact reliability estimation of lead free solder joint with IMC layer," Thin Solid Films, vol. 517 no. 14, pp. 4255-4259, May 29, 2009.

Kim, Jong-Min, Yasuda, Kiyokazu, Rito, Masahiro, and Fujimoto, Kozo, "New Electrically Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers," Materials Transactions, vol. 45 no. 1, pp. 157-160, Jan. 2004.

Kim, Jong-Min, Yasuda, Kiyokazu, and Fujimoto, Kozo, "Novel Interconnection Method Using Electrically Conductive Paste with Fusible Filler," Journal of Electronic Materials, vol. 34 no. 5, pp. 600-604, May 2005.

Kim, Jong-Min, Yasuda, Kiyokazu, Yasuda, Masahiro, and Fujimoto, Kozo, "The Effect of Reduction Capability of Resin Material on the Solder Wettability for Electrically Conductive Adhesives (ECAs) Assembly," Materials Transactions, vol. 45 no. 3, pp. 793-798, 2004.

Kim, Jong S., Wang, Pin J., and Lee, Chin C., "Fluxless Bonding of Si Chips to Ag-Copper Using Electroplated Indium and Silver Structure," 12th International Symposium on Advanced Packaging Materials, San Jose, CA, Oct. 3-5, 2007, pp. 199-204.

Kim, Jong S., Yokozuka, Takehide, and Lee, Chin C., "Fluxless bonding of silicon to Ag-cladded copper using Sn-based alloys," Materials Science and Engineering: A, vol. 458 no. 1-2, pp. 116-122, June 15, 2007.

Kim, Jong S., Wang, Pin J., and Lee, Chin C., "Fluxless Bonding of Silicon to Ag-Copper Using In-Ag With Two UBM Designs," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 4, pp. 776-781, Dec. 2008.

Kim, Jong S., Choi, Won S., Kim, Dongwook, Shkel, Andrei, and Lee, Chin C., "Fluxless Bonding of Silicon to Alumina Substrate Using Electroplated Eutectic Au-Sn Solder," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1860-1864.

Kim, Jong S., Yokozuka, Takehide, and Lee, Chin C., "Fluxless Bonding of Silicon to Copper with High-temperature Ag-Sn Joint Made at Low Temperature," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1706-1711.

Kim, Jong S., Wang, Pin J., and Lee, Chin C., "Fluxless Hermetic Lid Sealing Using Electroplated Sn-Rich Solder," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 3, pp. 719-725, Sept. 2008.

Kim, Jong S., Choi, Won S., Kim, Dongwook, Shkel, Andrei, and Lee, Chin C., "Fluxless silicon-to-alumina bonding using electroplated Au-Sn-Au structure at eutectic composition," Materials Science and Engineering: A, vol. 458 no. 1-2, pp. 101-107, June 15, 2007. https://doi.org/10.1016/j.msea.2006.12.106

Kim, Jong S., Yokozuka, Takehide, and Lee, Chin C., "Fluxless Sn-Ag Solder Joints Between Silicon and Ag-Cladded Copper with Reliability Evaluations -- MEJ," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S26-01-1-S26-01-7.

Kim, Jong Sung, Wang, Pin J., and Lee, Chin C. "Ag-Copper Structure for Bonding Large Semiconductor Chips," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 4, pp. 875-879, Dec. 2008.

Kim, Jong Sung, Wang, Pin J., and Lee, Chin C., "Very High-Temperature Joints Between Si and Ag-Copper Substrate Made at Low Temperature Using InAg System," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 4, pp. 782-789, Dec. 2008.

Kim, Jong-Woong, Kim, Dae-Gon., Lee, Young-Chul, and Jung, Seung-Boo, "Analysis of Failure Mechanism in Anisotropic Conductive and Non-Conductive Film Interconnections," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 1, pp. 65-73, Mar. 2008.

Kim, Jong Woong, Park, Sun Kyu, and Jung, Seung Boo, "Analysis of the Test Parameters in the Shear Test of BGA Solder Joints," Key Engineering Materials, vol. 297-300, pp. 851-856, 2005.

Kim, Jong-Woong, and Jung, Seung-Boo, "Behavior of Anisotropic Conductive Film Joints Bonded with Various Forces under Temperature Fluctuation," Journal of Electronic Materials, vol. 36 no. 9, pp. 1199-1205, Sept. 2007.

Kim, Jong-Woong, Chun, Hyun-Suk, Ha, Sang-Su, Chae, Jong-Hyuck, Joo, Jinho, Shin, Young-Eui, and Jung, Seung-Boo, "Board-level reliability of Pb-free surface mounted assemblies during thermal shock testing," Advanced Materials Research, vol. 15-17, pp. 633-638, Feb. 2006.

Kim, Jong-Woong, Chun, Hyun-Suk, Ha, Sang-Su, Chae, Jong-Hyuck, Joo, Jinho, Shin, Young-Eui, and Jung, Seung-Boo, "Board-level reliability of Pb-free surface mounted assemblies during thermal shock testing," Advanced Materials Research, vol. 15-17, pp. 633-638, 2007.

Kim, Jong-Woong, Kim, Dae-Gon, Koo, Ja-Myeong, Yoon, Jeong-Won, Choi, Sunglak, Kim, Kyung-Sik, Nam, Jae-Do, Lee, Hoo-Jeong, Joo, Jinho, and Jung, Seung-Boo, "Characterization of Failure Behaviors in Anisotropic Conductive Interconnection," Materials Transactions, vol. 48 no. 5, pp. 1070-1078, May 2007.

Kim, Jong-Woong, and Jung, Seung-Boo, "Design of Solder Joint Structure for Flip Chip Package with an Optimized Shear Test Method," Journal of Electronic Materials, vol. 36 no. 6, pp. 690-696, June 2007.

Kim, Jong-Woong, and Jung, Seung-Boo, "Effect of bonding force on the reliability of the flip chip packages employing anisotropic conductive film with reflow process," Materials Science and Engineering: A, vol. 452-453, pp. 267-272, Apr. 15, 2007.

Kim, Jong-Woong, Jang, Jin-Kyu, Ha, Sang-Ok, Ha, Sang-Su, Kim, Dae-Gon, and Jung, Seung-Boo, "Effect of high-speed loading conditions on the fracture mode of the BGA solder joint," Microelectronics Reliability, vol. 48 no. 11-12, pp. 1882-1889, Nov.-Dec. 2008.

Kim, Jong-Woong, Lee, Hoo-Jeong, and Jung, Seung-Boo, "Effect of surface treatment on the high-speed drop reliability of Pb-free solder interconnect," Thin Solid Films, vol. 547, pp. 120-124, Nov. 29, 2013.

Kim, Jong-Woong, Moon, Won-Chul, and Jung, Seung-Boo, "Effects of bonding pressure on the thermo-mechanical reliability of ACF interconnection," Microelectronic Engineering, vol. 83 no. 11-12, pp. 2335-2340, Nov.-Dec. 2006.

Kim, Jong-Woong, and Jung, Seung-Boo, "Effects of Void Formation within the Pb-Free BGA Solder Balls on the Mechanical Joint Strength," Materials Science Forum, vol. 510-511, pp. 546-549, 2006.

Kim, Jong-Woong, Lee, Young-Chul, Ha, Sang-Su, Koo, Ja-Myeong, Ko, Jae-Hoon, Nah, Wansoo, and Jung, Seung-Boo, "Electrical characterization of adhesive flip chip interconnects for microwave application," Journal of Micro/Nanolithography, MEMS, and MOEMS, vol. 7 no. 2, pp. 023007-1-023007-9, 2008.

Kim, Jong-Woong, Kim, Dae-Gon, and Jung, Seung-Boo, "Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application," Microelectronics Reliability, vol. 46 no. 2-4, pp. 535-542, Feb.-Apr. 2006.

Kim, Jong-Woong, Kim, Dae-Gon, Hong, Won Sik, and Jung, Seung-Boo, "Evaluation of Solder Joint Reliability in Flip-Chip Packages during Accelerated Testing," Journal of Electronic Materials, vol. 34 no. 12, pp. 1550-1557, Dec. 2005.

Kim, Jong-Woong, Lee, Young-Chul, Ha, Sang-Su, and Jung, Seung-Boo, "Failure behaviors of BGA solder joints under various loading conditions of high-speed shear test," Journal of Materials Science: Materials in Electronics, vol. 20 no. 1, pp. 17-24, Jan. 2009.

Kim, Jong-Woong, Yoon, Jeong-Won, and Jung, Seung-Boo, "Influence of Shear Speed on the Shear Force of Eutectic Sn-Pb and Pb-Free BGA Solder Joints," Materials Science Forum, vol. 449-452, pp. 897-900, 2004.

Kim, Jong-Woong, Lee, Young-Chul, Ko, Jae-Hoon, Nah, Wansoo, Jeong, Myung Yung, Kwon, Hyuk-Chon, and Jung, Seung-Boo, "Microwave Performance of Flip Chip Interconnects With Anisotropic and Non-conductive Films," Journal of Adhesion Science and Technology , vol. 22 no. 13, pp. 1339-1354, 2008.

Kim, Jong-Woong, and Jung, Seung-Boo, "Optimization of shear test for flip chip solder bump using 3-dimensional computer simulation", Microelectronic Engineering, vol. 82 no. 3-4, pp. 554-560, Dec. 2005.

Kim, Jong-Woong, Park, Sun-Kyu, and Jung, Seung-Boo, "Optimum Shear Height for Evaluation of Pb-Free Solder Ball Shear Strength," Materials Science Forum, vol. 486-487, pp. 269-272, 205.

Kim, Jong-Woong, and Jung, Seung-Boo, "Reexamination of the solder ball shear test for evaluation of the mechanical joint strength," International Journal of Solids and Structures, vol. 43 no. 7-8, pp. 1928-1945, Apr. 2006

Kim, Jong-Woong, Lee, Young-Chul, Kim, Dae-Gon, and Jung, Seung-Boo, "Reliability of adhesive interconnections for application in display module," Microelectronic Engineering, vol. 84 no. 11, pp. 2691-2696, Nov. 2007.

Kim, Jong-Woong, Lee, Young-Chul, and Jung, Seung-Boo, "Reliability of Conductive Adhesives as a Pb-free Alternative in Flip-Chip Applications," Journal of Electronic Materials, vol. 37 no. 1, pp. 9-16, Jan. 2008.

Kim, Jong-Woong, and Jung, Seung-Boo, "Thermal and hygroscopic reliability of flip-chip packages with an anisotropic conductive film," Journal of Adhesion Science and Technology, vol. 21 no. 11, pp. 1071-1087, 2007.

Kim, Jong-Woong, Koo, Ja-Myeong, Lee, Chang-Yong, Noh, Bo-In, Yoon, Jeong-Won, Kim, Dae-Gon, Park, Sun-Kyu, and Jung, Seung-Boo, "Thermal degradation of anisotropic conductive film joints under temperature fluctuation," International Journal of Adhesion and Adhesives, vol. 28 no. 6, pp. 314-320, Sept. 2008.

Kim, Jong-Woong, Lee, Young-Chul, Ko, Jae-Hoon, Nah, Wansoo, and Jung, Seung-Boo, "Transmission property of adhesive interconnect for high frequency applications," 9th International Conference on Electronic Materials and Packaging, Daejon, Korea, Nov. 19-22, 2007, pp. xx-xx.

Kim, Jong Yeon, Yu, Jin, and Lee, Taek Young, "Effect of Electrodeposition Conditions on Kirkendall Void Formation between Electrodeposited Cu Film and Sn-3.5Ag Solder," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1620-1625.

Kim, Jongman, Schoeller, Harry, Cho, Junghyun, and Park, Seungbae, "Effect of Oxidation on Indium Solderability," Journal of Electronic Materials, vol. 37 no. 4, pp. 483-489, Apr. 2008.

Kim, Jongsung, Kim, Dongwook, and Lee, Chin C., "Fluxless Flip-Chip Solder Joint Fabrication Using Electroplated Sn-Rich Sn-Au Structures," IEEE Transactions on Advanced Packaging, vol. 29 no. 3, pp. 473-482, Aug. 2006.

Kim, Jongsung, and Lee, Chin C., "Fluxless Sn-Ag bonding in vacuum using electroplated layers," Materials Science and Engineering: A, vol. 448 no. 1-2, pp. 345-350, Mar. 15, 2007.

Kim, Junbeum, Allenby, Braden R., Park, Heeil, Kim, Kyouhyung, Yeon, Sungmo, and Choi, Kwanglim, "Improvement Plan of Recycling rate of the Electronic & Electrical Equipment with Considering of Economics; Case study of Vacuum Cleaner," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 336-339.

Kim, Jung-Mo, Jung, Jae-Pil, Zhou, Y. Norman, and Kim, Jong-Young, "Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag," Journal of Electronic Materials, vol. 37 no. 3, pp. 324-330, Mar. 2008.

Kim, Jung-Mo, Jung, Jae-Pil, Zhou, Y. Norman, and Kim, Jong-Hyeong, "Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag (Erratum)," Journal of Electronic Materials, vol. 37 no. 8, pp. 1163, Aug. 2008.

Kim, Junghwan, Thibodeau, Eric, Tetley-Gerard, Kim, and Jung, In-Ho, "Critical evaluation and thermodynamic optimization of the Sn-RE systems: Part I. Sn-RE system (RE=La, Ce, Pr, Nd and Sm)," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 55 pt. 2, pp. 113-133, Dec. 2016.

Kim, Junghwan, and Jung, In-Ho, "Critical evaluation and thermodynamic optimization of the Sn-RE systems: Part II. Sn-RE system (RE=Gd, Tb, Dy, Ho, Er, Tm, Lu and Y)," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 55 pt. 2, pp. 134-156, Dec. 2016.

Kim, Jungsoo, Jung, Seung-Boo, and Yoon, Jeong-Won, "Effects of a phosphorous-containing Pd layer in a thin-ENEPIG surface finish on the interfacial reactions and mechanical strength of a Sn-58Bi solder joint," Journal of Alloys and Compounds, vol. 820, pp. 153396-1-153396-9, Apr. 15, 2020.

Kim, Jungsoo, Myung, Woo-Ram, and Jung, Seung-Boo, "Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB," Journal of Electronic Materials, vol. 45 no. 11, pp. 5895-5903, Nov. 2016.

Kim, Jungsoo, Back, Jong-Hoon, Jung, Seung-Boo, and Yoon, Jeong-Won, "Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0Ag-0.5Cu solder joints during aging," Journal of Materials Science: Materials in Electronics , vol. 30 no. 14, pp. 12911-12923, July 2019.

Kim, Jungsoo, Jung, Kwang-Ho, Kim, Jae-Ha, Lee, Choong-Jae, and Jung, Seung-Boo, "Electromigration behaviors of Sn58%Bi solder containing Ag-coated MWCNTs with OSP surface finished PCB," Journal of Alloys and Compounds, vol. 775, pp. 581-588, Feb. 15, 2019.

Kim, Jungsoo, Jung, Seung-Boo, and Yoon, Jeong-Won, "Optimal Ni(P) thickness and reliability evaluation of thin-Au/Pd(P)/Ni(P) surface-finish with Sn-3.0Ag-0.5Cu solder joints," Journal of Alloys and Compounds, vol. 805, pp. 1013-1024, Oct. 15, 2019.

Kim, K. H., Yu, Jin, and Kim, J. H., "A corrosion couple experiment reproducing the black pad phenomenon found after the electroless nickel immersion gold process," Scripta Materialia , vol. xx no. x, pp. xx-xx, xxxx.

Kim, K. M., Kim, J. O., Kim, S. G., Lee, K. H., Chen, A. S., Ahmad, N., Dugbartey, N., Karnezos, M., Tam, S., Kweon, Y.D., and Pendse, R., "The Viability of Anisotropic Conductive Film (ACF) as a Flip Chip Interconnection Technology," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 1122-1132.

Kim, K. S., Suganuma, K., Shimozaki, T., and Lee, C. G., "Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints," Materials Science Forum, vol. 439, pp. 7-11, 2003.

Kim, K. S., Huh, S. H., and Suganuma, K., "Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu," Microelectronics Reliability , vol. 43 no. 2, pp. 259-267, Feb. 2003.

Kim, K. S., Huh, S. H., and Suganuma, K., "Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints," Journal of Alloys and Compounds, vol. 352, pp. 226-236, 2003.

Kim, K. S., Yu, C. H., Han, S. W., Yang, K. C., and Kim, J. H., "Investigation of relation between intermetallic and tin whisker growths under ambient condition," Microelectronics Reliability, vol. 48 no. 1, pp. 111-118, Jan. 2008. https://doi.org/10.1016/j.microrel.2007.01.088

Kim, K. S., Ryu, K. W., Yu, C. H., and Kim, J. M., "The formation and growth of intermetallic compounds and shear strength at Sn-Zn solder/Au-Ni-Cu interfaces," Microelectronics Reliability, vol. 45 no. 3-4, pp. 647-655, Mar./Apr. 2005.

Kim, K. S., Yu, C. H., and Yang, J. M., "Tin whisker formation of lead-free plated leadframes," Microelectronics Reliability, vol. 46 no. 7, pp. 1080-1086, July 2006. https://doi.org/10.1016/j.microrel.2005.08.007

Kim, Keun-Soo, and Suganuma, Katsuaki, "Development of new Sn-Ag-Cu lead-free solders containing fourth elements," Proceedings of EcoDesign2003: Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 8-11, 2003, pp. 414-415.

Kim, Keun-Soo, Matsuura, Toshinori, and Suganuma, Katsuaki, "Effects of Bi and Pb on oxidation in humidity for low-temperature lead-free solder systems," Journal of Electronic Materials, vol. 35 no. 1, pp. 41-47, Jan. 2006.

Kim, Keun-Soo, Haga, Motoharu, and Suganuma, Katsuaki, "In-Situ Observation and Simulation of the Solidification Process in Soldering a Small Outline Package with the Sn-Ag-Cu Lead-Free Alloy," Journal of Electronic Materials, vol. 32 no. 12, pp. 1483-1489, Dec. 2003.

Kim, Keun-Soo, Kim, Sun-Sik, Kim, Seong-Jun, Suganuma, Katsuaki, Tsujimoto, Masanobu, and Yanada, Isamu, "Prevention of Sn whisker formation by surface treatment of Sn plating Part II," 2010.

Kim, Keun-Soo, Imanishi, Takayuki, Suganuma, Katsuaki, Ueshima, Mimoru, and Kato, Rikiya, "Properties of low temperature Sn-Ag-Bi-In solder systems," Microelectronics Reliability, vol. 47 no. 7, pp. 1113-1119, July 2007.

Kim, Keun-Soo, Kim, Sun-Sik, Yorikado, Yuuhi, Suganuma, Katsuaki, Tsujimoto, Masanobu, and Yanada, Isamu, "Sn whisker growth on Sn plating with or without surface treatment during the room temperature exposure," Journal of Alloys and Compounds, vol. 558, pp. 125-130, May 5, 2013.

Kim, Keun-Soo, Suganuma, Katsuaki, Kim, Jong-Min, and Hwang, Chi-Won, "The Observation and Simulation of Sn-Ag-Cu Solder Solidification in Chip-Scale Packaging," JOM, vol. 56 no. 6, pp. 39-43, June 2004.

Kim, Kwang-Seok, Park, Bum-Geun, Jung, Kwang-Ho, Jung, Seung-Boo, and Kim, Jong-Woong, "The critical role of Ag nanowires in the improvement of conductivity and flexibility of circuits fabricated with hybrid Ag nanopaste," Journal of Materials Science: Materials in Electronics, vol. 26 no. 11, pp. 8644-8651, Nov. 2015.

Kim, Kyoo-Seok, Jung, Jae-Pil, and Zhou Y. Norman, "Ultrasonic bonding of flexible PCB to rigid PCB using an Sn interlayer," Soldering & Surface Mount Technology, vol. 21 no. 1, pp. 4-10, 2009.

Kim, Kyoung H., and Kang, S. Y., "Flip Chip Bonding on Printed Circuit Board Using Anisotropically Conductive Adhesive Film," 1997 Surface Mount International Conference Proceedings , San Jose, CA, Sept. 7-11, 1997, pp. 314-319.

Kim, Kyoung-Ho, Koike, Junichi, Yoon, Jeong-Won, and Yoo, Sehoon, "Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints," Journal of Electronic Materials, vol. 45 no. 12, pp. 6184-6191, Dec. 2016.

Kim, Kyoung-Ho, Yoo, Sehoon, Yoon, Jonghyuk, Yim, Songhee, Baek, Bum-Gyu, Yoon, Jong Hyun, Jung, Dohyun, and Jung, Jae Pil, "Joint properties and thermomechanical reliability of nanoparticle-added Sn-Ag-Cu solder paste," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 1822-1826.

Kim, Kyu Dong, and Chung. D. D. L., "Effect of Heating on the Electrical Resistivity of Conductive Adhesive and Soldered Joints," Journal of Electronic Materials, vol. 31 no. 9, pp. 933-939, Sept. 2002.

Kim, Kyu Dong, and Chung, D. D. L., "Electrically conductive adhesive and soldered joints under compression," Journal of Adhesion Science and Technology, vol. 19 no. 11, pp. 1003-1023, 2005.

Kim, Kyung-Rok, Ha, Chang-Wan, Kim, Kyung-Soo, and Yun, Won-Soo, "Using Intaglio-Shaped Bumps for Increasing the Conductive Particle Density in Lateral Thermosonic Process With Anisotropic Conductive Film," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 4 no. 3, pp. 371-376, Mar. 2014.

Kim, Kyung-Seob, Yang, Jun-Mo, Yu, Chong-Hee, Jung, In-Ok, and Kim, Heon-Hee, "Analysis on interfacial reactions between Sn-Zn solders and the Au/Ni electrolytic-plated Cu pad," Journal of Alloys and Compounds, vol. 379 no. 1-2, pp. 314-318, Oct. 6, 2004.

Kim, Kyung-Seob, Yu, Chung-Hee, and Yang, Jun-Mo, "Behavior of tin whisker formation and growth on lead-free solder finish," Thin Solid Films, vol. 504 no. 1-2, pp. 350-354, May 10, 2006.

Kim, Kyung-Seob, Kim, Nam-Kyu, Yu, Chung-Hee, Kim, Joong-Jung, and Chang, Eui-Goo, "Microstructure and Strength of Bump Joints in Photodiode Packages," Journal of Electronic Materials, vol. 33 no. 1, pp. 70-75, Jan. 2004.

Kim, Kyung-Seob, Yang, Jun-Mo, Yu, Chong-Hee, and Jeon, Hyo-Joeng, "Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBM," Materials Transactions, vol. 45 no. 3, pp. 721-726, Mar. 2004.

Kim, Kyung-Seob, Yang, Jun-Mo, and Ahn, Jae-Pyoung, "The effect of electric current and surface oxidization on the growth of Sn whiskers," Applied Surface Science, vol. 256 no. 23, pp. 7166-7174, Sept. 15, 2010.

Kim, Kyung-Seob, Kim, Jin-Hyeok, and Han, Sung-Won, "The effect of postbake treatment on whisker growth under high temperature and humidity conditions on tin-plated Cu substrates," Materials Letters , vol. 62 no. 12-13, pp. 1867-1870, Apr. 30, 2008. https://doi.org/10.1016/j.matlet.2007.10.027

Kim, Kyung-Seob, Han, Wan-Ok, and Han, Sung-Won, "Whisker Growth on Surface Treatment in the Pure Tin Plating," Journal of Electronic Materials, vol. 34 no. 12, pp. 1579-1585, Dec. 2005.

Kim, M., Park, S. U., Kim, D. Y., Kwon, S. C., and Choi, Y., "Characterization of Chromium-Carbon Layer Fabricated by Electrodeposition in Trivalent Chromium Bath," Materials Science Forum, vol. 475-479 part 5, pp. 3823-3826, 2005.

Kim, M. J., Lee, J., Zhou, Y., Jung, J. P., and Kim, S. H., "Lower Temperature Soldering of Sn-3.5%Ag by Sn-Bi Coating," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Kim, Mi Jin, Zhou, Y. (Norman), and Jung, Jae Pil, "Reduced temperature soldering of capacitors using Sn-Bi plated Sn-3.5%Ag," Soldering & Surface Mount Technology, vol. 19 no. 3, pp. 3-8, 2007.

Kim, Mi-Song, Kang, Myoung-Seok, Bang, Jung-Hwan, Lee, Chang-Woo, Kim, Mok-Soon, and Yoo, Sehoon, "Interfacial reactions of fine-pitch Cu/Sn-3.5Ag pillar joints on Cu/Zn and Cu/Ni under bump metallurgies," Journal of Alloys and Compounds, vol. 616, pp. 394-400, Dec. 15, 2014.

Kim, Min-Seok, and Sung, Yun-Mo, "Successive Solution-Liquid-Solid (SLS) Growth of Heterogeneous Nanowires," Chemistry of Materials, vol. 25 no. 21, pp. 4156-4164, Nov. 12, 2013.

Kim, Min-Su, Ko, Yong-Ho, Yoo, Sehoon, and Lee, Chang-Woo, "Joint Properties of Micro Sn-58Bi Solder Bumps on Flexible Substrate," 2012 14th International Conference on Electronic Materials and Packaging , Hong Kong, Dec. 13-16, 2012, pp. xx-xx.

Kim, Min-Young, Chen, Liang-Shan, Chae, Seung-Hyun, and Kim, Choong-Un, "Mechanism of Void Formation in Cu Post Solder Joint under Electromigration," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 135-141.

Kim, Moon-Il, Moon, Joon-Kwon, and Jung, Jae-Pil, "Shear Strength and Interfacial Compound of Sn-Ag-Bi-In Alloy," Materials Transactions, vol. 43 no. 8, pp. 1791-1796, Aug. 2002.

Kim, Myung Jun, Alvarez, Samuel, Yan, Tianyu, Tadepalli, Vaibhav, Fichthorn, Kristen A., and Wiley, Benjamin J., "Modulating the Growth Rate, Aspect Ratio, and Yield of Copper Nanowires with Alkylamines," Chemistry of Materials, vol. 30 no. 8, pp. 2809-2818, Apr. 24, 2018.

Kim, N. S., Jung, S. Y., and Oh, S. Y., "Reliability of the Pb-free Solder Bump on Electroless Ni Under Bump Metallurgies," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 77-82.

Kim, Nam-Seog, Kim, Min-Il, and Oh, Se-Yong, "Wire Heel Crack Mechanism of Pd PPF Package," 2000 Lead Free Symposium Conference Proceedings, 2000, pp. xx-xx.

Kim, P. G., and Tu, K. N., "Fast dissolution and soldering reactions on Au foils," Materials Chemistry and Physics, vol. 53 no. 2, pp. 165-171, May 1998.

Kim, S., Sridharan, S., Khadilkar, C., and Shaikh, A., "Aluminum Pastes (lead-free/low-bow) for Thin Wafers," Conference Record of the Thirty-first IEEE Photovoltaic Specialists Conference, Orlando, FL, Jan. 3-7, 2005, pp. 1100-1102.

Kim, S., and Johnson, D. C., "Control of Ni-Sn interfacial reactions through reactant design," Journal of Alloys and Compounds, vol. 392 no. 1-2, pp. 105-111, Apr. 19, 2005.

Kim, S. B., and Yu, Jin, "Effects of Solder Ball Geometry on Lap Shear Creep Rate," Journal of Electronic Materials, vol. 39 no. 3, pp. 326-332, Mar. 2010.

Kim, S. H., and Yu, Jin, "Fe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation," Scripta Materialia, vol. 69 no. 3, pp. 254-257, Aug. 2013.

Kim, S. H., and Yu, Jin, "Heat-treatment to suppress the formation of Kirkendall voids in Sn-3.5Ag/Cu solder joints," Materials Letters, vol. 106, pp. 75-78, Sept. 1, 2013.

Kim, S.-H., Kim, J.-Y., Yu, J., and Lee, T. Y., "Residual Stress and Interfacial Reaction of the Electroplate Ni-Cu Alloy Under Bump Metallurgy in the Flip-Chip Solder Joint," Journal of Electronic Materials, vol. 33 no. 9, pp. 948-957, Sept. 2004.

Kim, S. H., and Yu, Jin, "Secondary IMC formation induced by Kirkendall voiding in Cu/Sn-3.5Ag solder joints," Journal of Materials Research, vol. 25 no. 9, pp. 1854-1858, Sept. 2010.

Kim, S. H., Erb, U., Gonzalez, F., and Palumbo, G., "The Corrosion Behaviour of Nanocrystalline Electrodeposits," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 714-720.

Kim, S. H., and Yu, Jin, "Wafer to Wafer Bonding Using Electroplated Co-Sn Solder Layer," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 313-316.

Kim, Sang Ha, Tabuchi, Hiroshi, Kakegawa, Chika, and Park, Han, "IMC Growth Mechanisms of SAC305 Lead-Free Solder on Different Surface Finishes and Their Effects on Solder Joint Reliability of FCBGA Packages," Journal of Microelectronics and Electronic Packaging, vol. 6, pp. 119-124, 2009.

Kim, Sang Hoon, Hui, Kwun Nam, Kim, Yong-Jin, Lim, Tae-Soo, Yang, Dong-Yeol, Kim, Ki Bong, Kim, Young Ja, and Yang, Sangsun, "Oxidation resistant effects of Ag2S in Sn-Ag-Al solder: A mechanism for higher electrical conductivity and less whisker growth," Corrosion Science, vol. 105, pp. 25-35, Apr. 2016.

Kim, Sang Hoon, Kim, Yong-Jin, Lim, Tae-Soo, Yang, Dong-Yeol, and Yang, Sangsun, "Reduced Electrical Resistivity of Ternary Solder Alloy of Tin-Copper-Sulfur: An Anti-Oxidative Role of Sulfur in Binary Solder Alloy of Tin-Copper," Materials Transactions, vol. 55 no. 9, pp. 1513-1516, 2014.

Kim, Sang-Won, Yoon, Jeong-Won, and Jung, Seung-Boo, "Interfacial Reactions and Shear Strengths between Sn-Ag based Pb-Free Solder Balls and Au/EN/Cu Metallization," Journal of Electronic Materials , vol. 33 no. 10, pp. 1182-1189, Oct. 2004.

Kim, Seong-Jun, Kim, Keun-Soo, Kim, Sun-Sik, Kang, Chung-Yun, and Suganuma, Katsuaki, "Characteristics of Zn-Al-Cu Alloys for High Temperature Solder Application," Materials Transactions, vol. 49 no. 7, pp. 1531-1536, July 2008.

Kim, Seongjun, Kim, Keun-Soo, Kim, Sun-Sik, Suganuma, Katsuaki, and Izuta, Goro, "Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier," Journal of Electronic Materials, vol. 38 no. 12, pp. 2668-2675, Dec. 2009.

Kim, Seongjun, Kim, Keun-Soo, Kim, Sun-Sik, and Suganuma, Katsuaki, "Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders," Journal of Electronic Materials, vol. 38 no. 2, pp. 266-272, Feb. 2009.

Kim, Seongjun, Kim, Keun-Soo, Suganuma, Katsuaki, and Izuta, Goro, "Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates," Journal of Electronic Materials, vol. 38 no. 6, pp. 873-883, June 2009.

Kim, Seongjun, Kim, Keun-Soo, Izuta, Goro, and Suganuma, Katsuaki, "Reliability of die attached AlN-DBC module using Zn-Sn high temperature lead-free solders," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 411-416.

Kim, Seung-Ho, Choi, Yongwon, Kim, Yoo-Sun, and Paik, Kyung-Wook, "Effect of Flux Activators on the Solder Wettability of Solder Anisotropic Conductive Films," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 5 no. 1, pp. 3-8, Jan. 2015.

Kim, Seung-Ho, Choi, Yongwon, Kim, Yoosun, and Paik, Kyung-Wook, "Flux Function added Solder Anisotropic Conductive Films (ACFs) for High Power and Fine Pitch Assemblies," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 1713-1716.

Kim, Seung-Ho, Choi, Yongwon, Kim, Yoosun, and Paik, Kyung-Wook, "The Effects of Self-Fluxing Additives in Solder Anisotropic Conductive Films (ACFs) on Solder Wettability and Joint Reliability of Flex-On-Board (FOB) Assemblies," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 2241-2244.

Kim, Seungdo, Hwang, Taeyeon, and Overcash, Michael, "Life Cycle Assessment Study of Color Computer Monitor," International Journal of Life Cycle Assessment, vol. 6 no. 1, pp. 35-43, Jan. 2001.

Kim, Seung-Ho, Kim, Young-Jae, Park, Ho Joon, and Paik, Kyung-Wook, "High Productivity and Damage-free Ultrasonic Anisotropic Conductive Film (ACF) Bonding for Touch Screen Panel (TSP) Assemblies," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 1770-1773.

Kim, Seung-Ho, Lee, Kiwon, and Paik, Kyung-Wook, "High Speed Touch Screen Panels (TSPs) Assembly using Anisotropic Conductive Adhesives (ACAs) Vertical Ultrasonic Bonding Method," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1964-1967.

Kim, Si-Jung, and Bae, Kyoo-Sik, "Interdiffusion Between Cu and Sn-rich Solder: Dominant Diffusion Species," Proceedings of 3rd Electronics Packaging Technology Conference, Singapore, Dec. 5-7, 2000, pp. 81-85.

Kim, Sok Won, Lee, Jaeran, Jeon, Bo-Min, Jung, Eun, Lee, Sang Hyun, Kang, Kweon Ho, and Lim, Kwon Taek, "Thermophysical Properties of Sn-Ag-Cu Based Pb-Free Solders," International Journal of Thermophysics, vol. 30 no. 4, pp. 1234-1241, Aug. 2009.

Kim, Sok Won, Lee, Jaeran, Jeon, Bo-Min, Jung, Eun, Lee, Sang Hyun, Kang, Kweon Ho, and Lim, Kwon Taek, "Thermophysical Properties of Sn-Ag-Cu Based Pb-Free Solders," International Journal of Thermophysics, vol. xx no. x, pp. xx-xx, xxxx.

Kim, Sok Won, Lee, Jaeran, Jeon, Bo-Min, Jung, Eun, Lee, Sang Hyun, Kang, Kweon Ho, and Lim, Kwon Taek, "Thermophysical Properties of Sn-Ag-Cu Based Pb-Free Solders," International Journal of Thermophysics, vol. xx no. x, pp. xx-xx, xxxx.

Kim, Sookyung, Lee, Jae-chun, Lee, Kwang-sek, Yoo, Kyoungkeun, and Alorro, Richard Diaz, "Separation of Tin, Silver and Copper from Waste Pb-free Solder Using Hydrochloric Acid Leaching with Hydrogen Peroxide," Materials Transactions, vol. 55 no. 12, pp. 1885-1889, 2014.

Kim, Soon-Tae, and Huh, Joo-Youl, "Enhanced Growth Kinetics of Intermetallic Compounds between Bi-containing Sn-3.5Ag Solders and Cu Substrate during Aging," Materials Science Forum , vol. 475-479 part 4, pp. 2627-2630, 2005.

Kim, Soyoung, Oguchi, Masahiro, Yoshida, Aya, and Terazono, Atsushi, "Estimating the amount of WEEE generated in South Korea by using the population balance model," Waste Management, vol. 33 no. 2, pp. 474-483, Feb. 2013.

Kim, Su-Hyeon, Kim, Jong Yeon, and Yu, Jin, "Investigation of Electroplated Ni and Ni-Cu alloy UBM (Under Bump Metallurgy) with Lead-Free Solders for Flip Chip Packages," Proceedings 2002 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4931), Denver, CO, Sept. 4-6, 2002, pp. 251-255.

Kim, Sun-Chul, Lee, Ja Yeon, Park, Jae-Yong, Lee, Tae-Young, and Kim, Young-Ho, "The effect of solder wetting on nonconductive adhesive (NCA) trapping in NCA applied flip-chip bonding," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Kim, Sun Sik, Kim, Keun Soo, Suganuma, Katsuaki, and Tanaka, Hirokazu, "Degradation Mechanism of Ag-Epoxy Conductive Adhesive Joints by Heat and Humidity Exposure," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 903-907.

Kim, Sun-Sik, Kim, Keun-Soo, Lee, KiJu, Kim, Seongjun, Suganuma, Katsuaki, and Tanaka, Hirokazu, "Electrical Resistance and Microstructural Changes of Silver-Epoxy Isotropic Conductive Adhesive Joints Under High Humidity and Heat," Journal of Electronic Materials, vol. 40 no. 2, pp. 232-238, Feb. 2011.

Kim, Sun Sik, Kim, Keun Soo, Kim, Seong Jun, and Suganuma, Katsuaki, "Microstructural Changes of the Ag-Epoxy ICA/Sn Interface in a High-Humidity Environment," Journal of Electronic Materials, vol. 38 no. 6, pp. 896-901, June 2009.

Kim, Sung Bum, Yu, Jin, and Lee, Won Jong, "Effects of Microstructure on Creep Deformation of Sn-3.5Ag Alloys," 2011 18th European Microelectronics and Packaging Conference, Brighton, United Kingdom, Sept. 12-15, 2011, pp. xx-xx.

Kim, Sung-Hoon, Kim, Hong-Kyu, Seo, Jong-Hyun, Whang, Dong-Mok, Ahn, Jae-Pyoung, and Lee, Jae-Chul, "Deformation twinning of ultrahigh strength aluminum nanowire," Acta Materialia, vol. 160, pp. 14-21, Nov. 2018.

Kim, Sung-Hyuk, Park, Jong-Jin, Kim, Jae-Myeong, Yoo, Sehoon, and Park, Young-Bae, "Comparisons of the Electrical and Mechanical Reliabilities between Sn-3.5Ag and Sn-0.7Cu Pb-free Solder Bumps," 2012 IEEE 14th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 5-7, 2012, pp. 719-722.

Kim, Sung Soo, Kim, Jong Hoon, Booh, Seong Woon, Kim, Tae-Gyu, and Lee, Hyuck Mo, "Microstructural Evolution of Joint Interface between Eutectic 80Au-20Sn Solder and UBM," Materials Transactions, vol. 46 no. 11, pp. 2400-2405, 2005.

Kim, Tae Hyun, and Kim, Young-Ho, "Sn-Ag-Cu and Sn-Cu Solders: Interfacial Reactions with Platinum," JOM , vol. 56 no. 6, pp. 45-49, June 2004.

Kim, Tae Jin, Kim, Young Min, and Kim, Young-Ho, "Sputtered Ni-Zn under bump metallurgy (UBM) for Sn-Ag-Cu solders," Journal of Alloys and Compounds, vol. 535, pp. 33-38, Sept. 15, 2012.

Kim, Tae-Wan, Lee, Sang-Hoon, and Paik, Kyung-Wook, "Effect of Aligned Nanofiber in Nanofiber Solder Anisotropic Conductive Films (ACFs) on the solder Ball Movement For Flex-on-Flex (FOF) Assembly," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 271-278.

Kim, Tae-Wan, Lee, Tae-Ik, Pan, Yan, Kim, Wansun, Zhang, Shuye, Kim, Taek-Soo, and Paik, Kyung-Wook, "Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly," IEEE Transactions on Components, Packaging, and Manufacturing Technology , vol. 6 no. 9, pp. 1317-1329, Sept. 2016.

Kim, Taeyoung, Lee, Joonho, Kim, Yunkyum, Kim, Jong-Min, and Yuan, Zhangfu, "Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys on Ni(P)/Au Coated Cu Substrates," Materials Transactions, vol. 50 no. 11, pp. 2695-2698, 2009.

Kim, Whan Gun, "Cure Properties of Self-Extinguishing Epoxy Resin Systems with Microencapsulated Latent Catalysts for Halogen-Free Semiconductor Packaging Materials," Journal of Applied Polymer Science, vol. 113 no. 1, pp. 408-417, July 5, 2009.

Kim, Won-Chul, Lee, Kiwon, Saarinen, Ilkka J., Pykari, Lasse, and Paik, Kyung-Wook, "Ultrasonic Bonding of Anisotropic Conductive Films Containing Ultrafine Solder Balls for High-Power and High-Reliability Flex-On-Board Assembly," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 5, pp. 884-889, May 2012.

Kim, Won-Keun, Ikeda, Toru, and Miyazaki, Noriyuki, "Reliability Evaluation of Flip Chip Using Stress Intensity Factors of an Interface Crack," Advances in Electronic Packaging 2003, Volume 1 , Maui, Hawaii, July 6-11, 2003, pp. 741-747.

Kim, Yang Ho, Ma, Sung Woo, and Kim, Young-Ho, "Chip to Chip Bonding Using Cu Bumps Capped with Thin Sn Layers and the Effect of Microstructure on the Shear Strength of Joints," Journal of Electronic Materials, vol. xx no. x, pp. xx-xx, xxxx.

Kim, Yi Ram, Osmanson, Allison T., Madanipou, Hossein, Kim, Choong-Un, Thompson, Patrick F., and Chen, Qiao, "Study of Electromigration Failure in Solder Interconnects under Low Frequency Pulsed Direct Current Condition," 2020 IEEE 70th Electronic Components and Technology Conference, Lake Buena Vista, AL, May 26-29, 2020, pp. 723-728.

Kim, Yoonjoong, Jeon, Youngin, and Kim, Sangsig, "Flexible silicon nanowire low-power ring oscillator featuring one-volt operation," Microelectronic Engineering, vol. 145, pp. 120-123, Sept. 1, 2015.

Kim, Yoo-Sun, Lee, Kiwon, and Paik, Kyung-Wook, "Effects of ACF Bonding Parameters on ACF Joint Characteristics for High-Speed Bonding Using Ultrasonic Bonding Method," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 1, pp. 177-182, Jan. 2013.

Kim, Yoo-Sun, Lee, Kiwon, Kim, Won-Chul, and Paik, Kyung-Wook, "Effects of Bonding Parameters and ACF Material Properties on the ACF Joint Morphology in Ultrasonic Bonding," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1917-1921.

Kim, Yoo-Sun, Kim, Seung-Ho, Shin, Ji-Won, and Paik, Kyung-Wook, "Effects of Bonding Pressures and Bonding Temperatures on Solder Joint Morphology and Reliability of Solder ACF Bonding," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 5 no. 9, pp. 1350-1357, Sept. 2015.

Kim, Yoo-Sun, Kim, Seung-Ho, Shin, Jiwon, and Paik, Kyung-Wook, "Reliability Improvement Methods of Solder Anisotropic Conductive Film (ACF) Joints Using Morphology Control of Solder ACF Joints," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 841-845.

Kim, Yoo-Sun, Kim, Seung-Ho, Shin, Jiwon, and Paik, Kyung-Wook, "Reliability Improvement of Solder Anisotropic Conductive Film (ACF) Joints by Controlling ACF Polymer Resin Properties," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1813-1817.

Kim, Yoo-Sun, Lee, Kiwon, and Paik, Kyung-Wook, "Ultrasonic-Assisted Thermo-Compression Bonding Method for High-Performance Solder Anisotropic Conductive Film (ACF) Joints," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 465-468.

Kim, Yoo-Sun, Kim, Seung-Ho, Lee, Kiwon, and Paik, Kyung-Wook, "Ultrasonic-Assisted Thermocompression Bonding Method of Solder Anisotropic Conductive Film Joints for Reliable Camera Module Packaging." IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 12, pp. 2156-2163, Dec. 2013.

Kim, Young-Bae, Noguchi, Hiroshi, and Amagai, Masazumi, "Fatigue Characteristics of Solder Joints in BGA-IC Package due to Vibration," Transactions of the Japan Society of Mechanical Engineers, Part A/ Nippon Kikai Gakkai Ronbunshu, A Hen, vol. 70 no. 12, pp. 1725-1732, Dec. 2004.

Kim, Young-Bae, Noguchi, Hiroshi, and Amagai, Masazumi, "Vibration Fatigue Reliability of BGA-IC Package with Pb-free Solder and Pb-Sn Solder," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 891-897.

Kim, Young-Lyong, Lee, Tae-Ik, Kim, Ji-Hye, Kim, Wonsik, Kim, Taek-Soo, and Paik, Kyung-Wook, "Effects of the Mechanical Properties of Polymer Resin and the Conductive Ball Types of Anisotropic Conductive Films on the Bending Properties of Chip-in-Flex Package," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 6 no. 2, pp. 200-207, Feb. 2016.

Kim, Young Min, Oh, Chang-Yul, Roh, Hee-Ra, and Kim, Young-Ho, "A New Cu-Zn Solder Wetting Layer for Improved Impact Reliability," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1008-1013.

Kim, Young Min, Kim, Sun-Chul, and Kim, Young-Ho, "An Eco-friendly Cu-Zn Wetting Layer for Highly Reliable Solder Joints," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 755-760.

Kim, Young Min, and Kim, Young-Ho, "Drop impact reliability of Cu-Zn/Sn-Ag-Cu/Cu-Zn solder joints," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 236-238.

Kim, Young Min, Park, Jin-Young, and Kim, Young-Ho, "Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish," Journal of Electronic Materials, vol. 41 no. 4, pp. 763-773, Apr. 2012.

Kim, Young Min, Roh, Hee-Ra, Kim, Sungtae, and Kim, Young-Ho, "Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates," Journal of Electronic Materials, vol. 39 no. 12, pp. 2504-2512, Dec. 2010.

Kim, Young-Sun, Kim, Keun-Soo, Hwang, Chi-Won, and Suganuma, Katsuaki, "Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys," Journal of Alloys and Compounds, vol. 352 no. 1-2, pp. 237-245, Mar. 24, 2003.

Kim, YoungBae, Noguchi, Hiroshi, and Amagai, Masazumi, "Evalution of Drop Strength due to Thermal Degradation for BGA-IC Package," Transactions of the Japan Society of Mechanical Engineers, Part A/ Nihon Kikai Gakkai Ronbunshu, A Hen, vol. 72 no. 2, pp. 186-191, Feb. 2006.

Kim, Youngbae, Noguchi, Hiroshi, and Amagai, Masazumi, "Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder," Microelectronics Reliability, vol. 46 no. 2-4, pp. 459-466, Feb.-Apr. 2006.

Kim, Youngseok, Sugahara, Toru, Nagao, Shijo, Suganuma, Katsuaki, Ueshima, Minoru, Albrecht, Hans-Juergen, Wilke, Klaus, and Strogies, Joerg, "Effects of additional Ni and Co on microstructural evolution in Sn-Ag-Bi-In solder under current stressing," 2012 2nd IEEE CPMT Symposium Japan , Kyoto, Japan, Dec. 10-12, 2012, pp. xx-xx.

Kim, Youngseok, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki, Ueshima, Minoru, Albrecht, Hans-Juergen, Wilke, Klaus, and Strogies, Joerg, "Enhanced reliability of Sn-Ag-Bi-In joint under electric current stress by adding Co/Ni elements," Journal of Materials Science: Materials in Electronics, vol. 25 no. 7, pp. 3090-3095, July 2014.

Kim, Youngseok, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki, Ueshima, Minoru, Albrecht, Hans-Juergen, Wilke, Klaus, and Strogies, Joerg, "Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current," Journal of Electronic Materials, vol. 43 no. 12, pp. 4428-4434, Dec. 2014.

Kim, Youngsoon, Shin, Ji-Won, Choi, Young won, and Paik, Kyung-Wook, "Effects of Pad Surface Finish on Interfacial Reliabilities of Cu-Pillar/Sn-Ag Bumps of 2.5D TSV-Enterposer on PCB Applications," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 1765-1768.

Kim, Youngsoon, Lee, Seyong, Shin, Ji-won, and Paik, Kyung-Wook, "Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly," Journal of Electronic Materials, vol. 45 no. 6, pp. 3208-3219, June 2016.

Kim, Youngsoon, Yoon, Taeshik, Kim, Tae-Wan, Kim, Taek-Soo, and Paik, Kyung-Wook, "Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 7 no. 3, pp. 371-378, Mar. 2017.

Kim, Yunsung, Choi, Hyelim, Lee, Hyoungjoo, Shin, Dongjun, Moon, Jeongtak, and Choe, Heeman, "Fracture behavior of Cu-cored solder joints," Journal of Materials Science, vol. 46 no. 21, pp. 6897-6903, 2011.

Kim, Yunsung, Choi, Hyelim, Lee, Hyoungjoo, Shin, Dongjun, Cho, Jinhan, and Choe, Heeman, "Improved reliability of copper-cored solder joints under a harsh thermal cycling condition," Microelectronics Reliability, vol. 52 no. 7, pp. 1441-1444, July 2012.

Kimata, M., Suzuki, T., Saino, K., Kawamura, K., and Hobbs, A., "Stabilized a-Sn grown at high temperature by molecular beam epitaxy," Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, vol. 12 no. 2, pp. 1184-1185, Mar. 1994. https://doi-org.ezproxy.uky.edu/10.1116/1.587038

Kimberley, William, "The end of life but it's really confusing," Automotive Engineer, vol. 28 no. 5, pp. 3, May 2003.

Kimura, H., Ohizumi, S., Nishioka, T., Nakao, M., and Harada, M., "New Analytical Study for Popcorn Phenomenon," 1992 Proceedings 42nd Electronic Components & Technology Conference, San Diego, CA, May 18-20, 1992, pp. 1035-1041.

Kimura, Hideto, Yoshida, Tsukasa, Ohizumi, Shin'ichi, Nishioka, Tsutomu, Nakao, Minoru, and Harada, Masatomi, "New Analytical Study for Popcorn Phenomenon," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 15 no. 6, pp. 1117-1122, Dec. 1992.

Kimura, Tadashi, Nakai, Tsukasa, Ishikawa, Haruo, Ooyama, Chizuko, Oosawa, Keiichi, and Kohinata, Shigeru, "Thermal Conductivity and RF Signal Transmission Properties of Ag-Filled Epoxy Resin," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1383-1390.

Kimura, Yasuhiro, "Irregular bending growth of free-standing Al microwire by electromigration," Acta Materialia, vol. 157, pp. 276-287, Sept. 15, 2018.

Kimura, Yasuhiro, and Saka, Masumi, "Simplified processes using conductive passivation film for the fabrication of Al micro-wires by electromigration," Materials Letters, vol. 116, pp. 278-281, Feb. 1, 2014.

King, Jim, "Reaching round Europe," Materials World, vol. 16 no. 8, pp. 36-38, Aug. 2008.

King, Racheal, "Lead-Free: Shooting at a moving target," EMasia, May 2005.

King, Rachael, "Shooting at a moving target," Electronic Business Online, Dec. 1, 2004.

King, W. Michael, "RoHS Compatabilities," Design News, vol. 61 no. 10, pp. xx-xx, July 17, 2006.

Kinner, Phil, "Maximize Your Investment: Re-qualify for Lead-free," Surface Mount Technology (SMT), vol. 20 no. 7, pp. xx-xx, July 2006.

Kinney, Chris, Linares, Xioranny, and Lee, Kyu-Oh, "The Effect of Sn Orientation on Intermetallic Compound Growth in Idealized Sn-Cu-Ag Interconnects," Journal of Electronic Materials, vol. 42 no. 4, pp. 607-615, Apr. 2013.

Kinney, Christopher, Morris Jr., J. W., Lee, Tae-Kyu, Liu, Kuo-Chuan, Xue, Jie, and Towne, Dave, "The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder," Journal of Electronic Materials, vol. 38 no. 2, pp. 221-226, Feb. 2009.

Kinney, Christopher, Lee, Tae-Kyu, Liu, Kuo-Chuan, and Morris, J. W., "The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects," Journal of Electronic Materials, vol. 38 no. 12, pp. 2585-2591, Dec. 2009.

Kinol, Vincent B., "Technology Challenges: a Solder Material Supplier's Perspective," Chip Scale Review, vol. 12 no. 6, pp. 46-48,50, Sept. 2008.

Kinoshita, Y., Matsushima, H., and Ohno, N., "Predicting active slip systems in b-Sn from ideal shear resistance," Modelling and Simulation in Materials Science and Engineering, vol. 20 no. 3, pp. 035003-1-035003-9, Apr. 2012.

Kinyanjui, R., Abtew, M., and Sprinkle, K., "Cooling Rate Optimization and Reliability of Pb-free Sn-Ag-Cu Stacked BGA Modules," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 327-337.

Kinyanjui, R., Lehman, L. P., and Cotts, E. J., "Effect of Ball Size on Undercooling of Sn-Ag-Cu Solder Joints," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 359-364.

Kinyanjui, R., Lehman, L. P., Zavalij, L., and Cotts, E., "Effect of sample size on the solidification temperature and microstructure of SnAgCu near eutectic alloys," Journal of Materials Research, vol. 20 no. 11, pp. 2914-2918, Nov. 2005.

Kinyanjui, Robert, Aspandiar, Raiyo, Coyle, Richard, Vasudevan, Vasu, Tisdale, Stephen, Arellano, Jorge, and Parupalli, Satish, "Challenges in Reflow Profiling Large and High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S35_03-1-S35_03-17.

Kinyanjui, Robert K., Zribi, Ania, and Cotts, Eric J., "Effects of Reflow Conditions on the Formation of Au-Ni-Sn Compounds at the Interface of Au-Pb-Sn and Au-Sn Solder Joints with Ni Substrate," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 161-167.

Kinyanjui, Robert, Chu, Quyen, Snugovsky, Polina, and Coyle, Richard, "Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in SnPb Assembly Process," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S15:02.

Kinyanjui, Robert, and Chu, Quyen, "The Pb-Free SnAgCu Ball Grid Array (BGA) Components in SnPb Assembly Process: Process Characterization and Solder Joint Reliability," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 760-769.

Kirby, Ken, "Flux Application for Lead-Free Wave Soldering," IPC Review, vol. 48 no. 9, pp. 9, Oct./Nov. 2007.

Kirby, Ken, "Flux Application for Lead-Free Wave Soldering," Speedline Technologies.

Kirby, Ken, "Lead-free Soldering Nozzle Considerations," Speedline Technologies, Feb. 17, 2004.

Kiritsis, Dimitris, Bufardi, Ahmed, and Xirouchakis, Paul, "Multi-criteria decision aid for product end of life options selection," Proceedings of the 2003 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 19-22, 2003, pp. 48-53.

Kirshner, Michael, "Ahead of regulations," Green SupplyLine, Nov. 1, 2006.

Kirshner, Michael, "Ahead of regulations," Electronics Supply & Manufacturing , Nov. 2006.

Kirschner, Michael, "China releases its RoHS law," Green SupplyLine, Mar. 7, 2006.

Kirschner, Michael, and Stanvick, Kenneth, "China RoHS calls for more stringent restrictions," Green SupplyLine , Oct. 11, 2005.

Kirschner, Michael, "China RoHS scope clarified," Green SupplyLine, Mar. 27, 2006.

Kirschner, Michael, and Stanvick, Kenneth, "First look at Korea RoHS legislation," Green SupplyLine, Apr. 14, 2006.

Kirschner, Michael, "Full Disclosure," Circuits Assembly, vol. 17 no. 2, pp. 40, 42-43, Feb. 2006.

Kirschner, Michael, "Get ready now for China RoHS," Electronics Supply & Manufacturing, Apr. 2006.

Kirschner, Michael, "Getting ahead of 'green' regulations," EE Times - Asia, vol. xx no. xx, pp. xx-xx, Jan. 1, 2007.

Kirschner, Michael, "Getting ahead of "green" regulations," Embedded.com, Jan. 8, 2007.

Kirschner, Michael, "Materially deficient," Electronic Business, Aug. 1, 2004.

Kirschner, Michael, and Stanwick, Kenneth, "Now S. Korea issues environmental controls," Electronics Supply & Manufacturing, May 2006.

Kirschner, Michael, "Pending environmental legislation in California may impact the electronics industry," Green SupplyLine, Apr. 9, 2007.

Kirschner, Michael, "REACH - An Introduction & Status," It's Not Easy Being Green , San Jose, CA, Feb. 4-5, 2009, pp. xx-xx.

Kirschner, Michael, "REACH Compliance for Non-EU Article Manufacturers," Conformity , 2009 Engineers' Reference Guide, pp. 185-189, 2009.

Kirschner, Michael, "RoHS in China," Conformity, 2007 Engineers' Reference Guide, pp. 212-216, 2007.

Kirshner, Michael, "RoHS in China - An Introduction," Conformity, vol. 11 no. 10, pp. 12-17, Oct. 2006.

Kirschner, Michael, "RoHS parts numbering could endanger your mental health," emsnow , Oct. 1, 2007.

Kirschner, Michael, "RoHS parts numbering could endanger your mental health," evertiq , Oct. 1, 2007.

Kirschner, Michael, "Substance Regulations, more law!," EuroAsia Semiconductor, vol. xx no. xx, pp. xx-xx, Oct. 2006.

Kirschner, Michael, "The Environmental Juggernaut: EU Trajectory and ROW RoHS Overview," IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies, Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.

Kirschner, Michael, "WEEE prep lags RoHS," Green SupplyLine, July 12, 2005.

Kirubanandham, A., Lujan-Regalado, I., Vallabhaneni, R., and Chawla, N., "Three Dimensional Characterization of Tin Crystallography and Cu6Sn5 Intermetallics in Solder Joints by Multiscale Tomography," JOM, vol. 68 no. 11, pp. 2879-2887, Nov. 2016.

Kiryukhina, K., Courtade, F., Dareys, S., Le Trong, H., Tailhades, P., Lacaze, J., Vendier, O., and Raynaud, L., "Solder paste for highly dissipative power electronic assemblies," 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Barcelona, Spain, Apr. 16-18, 2013, pp. xx-xx.

Kishi, Kiyoshi, "The Effect of Halide Impurities on the Mass Production of Metal Whiskers by Reduction," Japanese Journal of Applied Physics, vol. 12 no. 7, pp. 962-967, July 1973.

Kishimoto, Yasukazu, and Hanamura, Kenichiro, "Anisotropic Conductive Paste Available for Flip Chip," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 137-143.

Kisiel, R., and Szczepansski, Z., "Die-attachment solutions for SiC power devices," Microelectronics Reliability, vol. xx no. x, pp. xx-xx, xxxx.

Kisiel, R., Bukat, K., Drozd, Z., Szwech, M., Syryczyk, P., and Girulska, A., "Quality Management in Electronics Manufacturing after Implementation of RoHS Directive," 30th International Spring Seminar on Electronics Technology , Cluj-Napoca, Romania, May 9-13, 2007, pp. 34-39.

Kisiel, R., Gasior, W., Moser, Z., Pstrus, J., Bukat, K., and Sitek, J., "(Sn-Ag)eut + Cu Soldering Materials, Part II: Electrical and Mechanical Studies," Journal of Phase Equilibria and Diffusion, vol. 25 no. 2, pp. 122-124, 2004.

Kisiel, R., Bukat K., Sitek, J., Gasior, W., Moser, Z., and Pstrus, J., "SnAgCuBi and SnAgCuBiSb solder joint properties investigations," Global SMT and Packaging, vol. 7 no. 11, pp. 34, 36, 38, 40, 42-43, Nov. 2007.

Kisiel, Ryszard, "An overview of materials and technologies for "green" electronics products," Proceedings of SPIE - The International Society for Optical Engineering, Volume 6159, Feb. 2006, pp. 61591S-1-61591S-12.

Kisiel, Ryszard, Markowski, Artur, and Lubiak, Marcin, "Conductive Adhesive Fillets for Double Sided PCBs," 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics , Zalaegerszeg, Hungary, June 23-26, 2002, pp. 13-16.

Kisiel, Ryszard, "Electrically Conductive Adhesive Formulations for SMT Applications," Journal of Electronic Packaging, Transactions of the ASME, vol. 124 no. 4, pp. 367-370, Dec. 2002.

Kisiel, Ryszard, "Ions Impurities and Their Influence on Exploitation Parameters of Conductive Adhesive Joints," 24th International Spring Seminar on Electronics Technology: Concurrent Engineering in Electronic Packaging, Calimanesti-Caciulata, Romania, May 5-9, 2001, pp. 47-50.

Kisiel, Ryszard, and Kalenik, Jerzy, "Lead Free Solder Joint Properties in High Temperature Applications," IMAPS Poland Conference 2000.

Kisiel, Ryszard, "Lead-free technologies for electronic equipment assembly," Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5125), Wilga, Poland, May 23-26, 2002, pp. 348-352.

Kisiel, Ryszard, and Pekala, Marek, "Low temperature electrical properties of some Pb-free solders," Proceedings of SPIE - The International Society for Optical Engineering, Volume 6159, Feb. 2006, pp. 61591T-1-61591T-5.

Kisiel, Ryszard, and Mysliwiec, Marcin, "Solder Joints for Flexible Connection Working at Low Temperatures," 2015 38th International Spring Seminar on Electronics Technology, Eger, Hungary, May 6-10, 2015, pp. 157-160.

Kisiel, Ryszard, and Mysliwiec, Marcin, "Solid-Liquid Interdiffusion Bonding Based on Au-Sn Intermetallic for High Temperature Applications," 2018 41st International Spring Seminar on Electronics Technology, Zlatibor, Serbia, May 16-20, 2018, pp. xx-xx.

Kisiel, Ryszard, Borecki, Janusz, Felba, Jan, and Moscicki, Andrzej, "Technological aspects of applying conductive adhesives for inner connections in PCB," 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, Portland, OR, Sept. 12-15, 2004, pp. 121-125.

Kisiel, Ryszard, "The Influence of Adhesive Composition on Mechanical and Electrical Properties of Joints between SMDs and PCBs," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 240-242.

Kissling, Ramon, Fitzpatrick, Colin, Boeni, Heinz, Luepschen, Claudia, Andrew, Stefan, and Dickenson, John, "Definition of generic re-use operating models for electrical and electronic equipment," Resources, Conservation and Recycling, vol. 65, pp. 85-99, Aug. 2012.

Kissling, Ramon, Coughlan, Damian, Fitzpatrick, Colin, Boeni, Heinz, Luepschen, Claudia, Andrew, Stefan, and Dickenson, John, "Success factors and barriers in re-use of electrical and electronic equipment," Resources, Conservation and Recycling, vol. 80, pp. 21-31, Nov. 2013.

Kitada, Tomofumi, Maruo, Hiroki, Seki, Yoshihito, Unami, Yoshiharu, and Nukina, Masato, "Board-to-board Interconnection with Solder Bump," Fujikura Technical Review, no. 34, pp. 41-44, Jan. 2005.

Kitagawa, Hideki, Kido, Youichiro, Maeda, Kouichi, Umeda, Yoshikatsu, Sano, Hiroyuki, and Hasegawa, Shinichi, "The Study of Plastic Package Cracking Induced by the Moisture/Solder Reflow Process," 1989 Proceedings 39th Electronic Components Conference, Houston, TX, May 22-24, 1989, pp. 445-449.

Kitajima, Masayuki, and Shono, Tadaaki, "Development of Sn-Zn-Al Lead-Free Solder Alloys," Fujitsu Scientific and Technical Journal, vol. 41 no. 2, pp. 225-235, July 2005.

Kitajima, Masayuki, and Shono, Tadaaki, "Reliability study of new SnZnAl lead-free solders used in CSP packages," Microelectronics Reliability, vol. 45 no. 7-8, pp. 1208-1214, July-Aug. 2005.

Kitajima, Masayuki, Shono, Tadaaki, and Masuda, Satoshi, "SnZnAl Lead-free Solder with High Packaging Reliability," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 762-767.

Kitano, Y., Komura, Y., Iwanari, T., and Kurashige, R., "Growth of Co-Fe Alloy Whiskers," Journal of Crystal Growth, vol. 24-25, pp. 354-356, Oct. 1974.

Kitazawa, Sin-iti, Naito, Akira, Lin, Chuan, and Naramoto, Hiroshi, "Growth of Ni-In alloy nanowhiskers," Journal of Crystal Growth, vol. 267 no. 1-2, pp. 336-339, June 15, 2004.

Kittaka, Shigeyoshi, and Kaneko, Tsutomu, "Growth of a Large Number of Iron Whiskers by the Reduction of Halides," Japanese Journal of Applied Physics, vol. 8 no. 7, pp. 860-869, July 1969.

Kittaka, Shigeyoshi, and Kishi, Kiyoshi, "Growth of Copper Whiskers from Cupric Oxide," Japanese Journal of Applied Physics, vol. 4 no. 9, pp. 661-666, Sept. 1965.

Kittaka, Shigeyoshi, Kishi, Kiyoshi, and Kaneko, Tsutomu, "Growth of Iron-Nickel Whiskers," Journal of Crystal Growth, vol. 11 no. 3, pp. 197-200, Dec. 1971.

Kittaka, Shigeyoshi, and Kishi, Kiyoshi, "The Role of Cuprous Oxide Globules in the Growth of Copper Whiskers in Large Quantity," Journal of Crystal Growth, vol. 3-4, pp. 171, 1968.

Kitterman, J. H., and Winder, D. R., "Growth of Cadmium Whiskers in Various Atmospheres," Journal of Crystal Growth, vol. 13-14, pp. 198-201, May 1972.

Kittidacha, Witoon, Kanjanavikat, Adirom, and Vattananiyom, Kamtida, "Effect of SAC Alloy Composition on Drop and Temp cycle Reliability of BGA with NiAu Pad Finish," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1074-1079.

Kiuchi, Yukihiro, and Iji, Masatoshi, "Development of Environmentally Friendly Epoxy-Resin Compounds without Toxic Flame Retardants and Their Application to Electronic Parts," Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 11-15, 2001, pp. 1020-1025.

Kiuchi, Yukihiro, Iji, Masatoshi, Nagashima, Hiroaki, and Miwa, Takashi, "Increase in Flame Retardance of Glass-Epoxy Laminates without Halogen or Phosphorous Compounds by Simultaneous Use of Incombustible-Gas Generator and Charring Promoter," Journal of Applied Polymer Science, vol. 101 no. 5, pp. 3367-3375, Sept. 5, 2006.

Kiumi, R., Takeda, S., Yoshioka, J., Kuriyama, F., and Saito, N., "Composition Control for Lead-Free Alloy Electroplating on Flip Chip Bumping," 2005 Proceedings 55th Electronic Components & Technology Conference , Orlando, FL, May 31-June 3, 2005, pp. 120-126.

Kiumi, R., Yoshioka, J., Kuriyama, F., Saito, N., Takeda, S., and Saijo, Y. "Effective Factors of Lead-free Alloy Electroplating for Flip Chip Packaging Applications," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Kiumi, R., Yoshioka, J., Kuriyama, F., Saito, N., and Takeda, S., "Electroplating Process for Lead-free Bumps in Flip Chip Packaging," Advanced Metallization Conference 2003, Montreal, Canada, Oct. 21-23, 2003, pp. 669-674.

Kiumi, R., Kuriyama, F., and Saito N., "Formation of Lead-Free Microbumps by Electroplating for Flip-Chip and WLP Applications," 3rd International Wafer Level Packaging Congress, San Jose, CA, Nov. 1-3, 2006, pp. xx-xx.

Kiumi, R., Yoshioka, J., Kuriyama, F., Saito, N., and Shimoyama, M., "Process Development of Electroplate Bumping for ULSI Flip Chip Technology," 2002 Proceedings 52nd Electronic Components & Technology Conference , San Diego, CA, May 28-31, 2002, pp. 711-716.

Kiumi, R., Yoshioka, J., Kuriyama, F., Saito, N., and Shimoyama, M., "Processing, Properties, and Reliability of Electroplated Lead-free Solder Bumps," Eight InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2002, San Diego, CA, May 30-June 1, 2002, pp. 99-914.

Kivilahti, J., and Savolainen, P., "Anisotropic Adhesives for Flip-Chip Bonding," Journal of Electronics Manufacturing, vol. 5 no. 4, pp. 245-252, Dec. 1995.

Kivilahti, J. K., "The Chemical Modeling of Electronic Materials and Interconnections," JOM, vol. 54 no. 12, pp. 52-57, Dec. 2002.

Kivilahti, Jorma K., "Modeling Joining Materials for Microelectronics Packaging," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B , vol. 18 no. 2, pp. 326-333, May 1995.

Klais, Hans Gerd, "Zinn, Blei und ihre Gemenge bei Orgelpfeifen," Acta Organologica , vol. 27, pp. 187-204, 2001.

Klang, Lars-Gunnar, "Tombstoning - What is the Reason and What is the Cure?," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Klasik, A., Sobczak, N., Pietrzak, K., Makowska, K., Wojciechowski, A., Kudyba, A., and Sienicki, E., "Relationship Between Mechanical Properties of Lead-Free Solders and Their Heat Treatment Parameters," Journal of Materials Engineering and Performance, vol. 21 no. 5, pp. 620-628, May 2012.

Klaus, M., Denks, I. A., and Genzel, Ch., "X-Ray Diffraction Analysis of Nonuniform Residual Stress Fields sii(t) under Difficult Conditions," Materials Science Forum, vol. 524-525, pp. 601-606, Sept. 2006.

Klausner, Markus, Grimm, Wolfgang M., and Hendrickson, Chris, "Reuse of Electric Motors in Consumer Products: Design and Analysis of an Electronic Data Log," Journal of Industrial Ecology, vol. 2 no. 2, pp. 89-102, Apr. 1998.

Klein, M., Hutter, M., Oppermann, H., Fritzsch, T., Engelmann, G., Dietrich, L., Wolf, J., Bramer, B., Dudek, R., and Reichl, H., "Development and Evaluation of Lead Free Reflow Soldering Techniques for the Flip Chip Bonding of Large GaAs Pixel Detectors on Si Readout Chip," 2008 Proceedings 58th Electronic Components & Technology Conference , Lake Buena Vista, FL, May 27-30, 2008, pp. 1893-1899.

Klemm, Alexander, Oppermann, Martin, and Zerna, Thomas, "Analysis of Soldering Processes Using In-Situ X-Ray Observations," 2015 European Microelectronics Packaging Conference, Friedrichshafen, Germany, Sept. 14-16, 2015, pp. xx-xx.

Klenke, Bob, "Lead-Free Selective Soldering: The Wave of the Future," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Kleppa, O. J., "A Calorimetric Investigation of the System Silver-Tin at 450°C," Acta Metallurgica, vol. 3 no. 3, pp. 255-259, May 1955.

Klerk, Jacob, "Sn Plating and Whiskers," March 9, 2005.

Klima, S., Villain, J., Corradi, U., Weippert, Chr., and Svetly, A., "Characterization of mechanical and physical parameters of IMCs in solder materials using nano hardness tests and EBSD measurements," 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging , Timisoara, Romania, Oct. 20-23, 2011, pp. 35-38.

Kline Jr., Steven R., "Zinc Plater Finds New Market," Products Finishing, vol. xx no. x, pp. xx-xx, May 1998.

Klingenberg, M. L., Pavlik, M. A. B., and Brooman, E. W., "Alloy Deposition of Alternatives to Chromium and Cadmium," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. 771-779.

Klingenberg, M., Manty, B., and Schario, D., "Chromium Alternatives Update," Proceedings of the 20th AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 25-29, 1999, pp. 223-229.

Klingenberg, M. L., Brooman, E. W., and Naguy, T. A., "Evaluation of Nano-Composite Coatings as Environmentally Acceptable Alternatives to Hard Chromium Plating," 2004 AESF/EPA Conference for Environmental & Process Excellence, Orlando, FL, Jan 26-29, 2004, pp. 107-120.

Klingenberg, M. L., Brooman, E. W., and Naguy, T. A., "Nano-particle Composite Plating as an Alternative to Hard Chromium and Nickel Coatings," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 684-696.

Klingenberg, M. L., Brooman, E. W., and Naguy, T. A., "Nano-particle Composite Plating as an Alternative to Hard Chromium and Nickel Coatings," Plating and Surface Finishing, vol. 92 no. 4, pp. 42-48, Apr. 2005.

Klingenberg, M., Manty, B., and Schario, D., "Recent Chromium Alternatives Activities," 1999 Aerospace/Airline Plating & Metal Finishing Forum, Jacksonville, FL, Apr. 20-22, 1999, pp. 19-25.

Klinger, Leonid, Kraft, Oliver, and Rabkin, Eugen, "A model of Kirkendall hollowing of core-shell nanowires and nanoparticles controlled by short-circuit diffusion," Acta Materialia, vol. 83, pp. 180-186, Jan. 15, 2015.

Klinger, Leonid, and Rabkin, Eugen, "Thermal and Mechanical Stability of Polycrystalline Nanowires," Defect and Diffusion Forum, vol. 264, pp. 133-140, Apr. 2007.

Klink, Gerhard, Feil, Michael, Ansorge, Frank, Aschenbrenner, Rolf, and Reichl, Herbert, "Innovative Packaging Concepts for Ultra Thin Integrated Circuits," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 1034-1039.

Kloeser, J., Kallmayer, Ch., Jung, E., Coskina, P., Aschenbrenner, R., and Reichl, H., "Lead Free Solders for Area Array Packaging," 2000 Lead Free Symposium Conference Proceedings, 2000, pp. xx-xx.

Kloeser, Joachim, Heinricht, Katrin, Kutner, Kai, Jung, Erik, Ostmann, Andreas, Zakel, Elke, and Reichl, Herbert, "Fine Pitch Stencil Printing of Sn/Pb and Lead Free Solders for Flip Chip Technology," 1997 Proceedings 47th Electronic Components & Technology Conference, San Jose, CA, May 18-21, 1997, pp. 254-264.

Kloeser, Joachim, Heinricht, Katrin, Kutzner, Kai, Jung, Erik, Ostmann, Andreas, and Reichl, Herbert, "Fine Pitch Stencil Printing of Sn/Pb and Lead Free Solders for Flip Chip Technology," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C, vol. 21 no. 1, pp. 41-50, Jan. 1998.

Kloeser, Joachim, Ostmann, Andreas, Gwiasda, Jorg, Bechtold, Franz, Zakel, Elke, and Reichl, Herbert, "Low Cost Flip Chip Technologies Based on Chemical Nickel Bumping and Solder Printing," Proceedings 1996 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 2920), Minneapolis, MN, Oct. 8-10, 1996, pp. 93-102.

Klos, Klaus Peter, "Clear Chromates: Theory and Practice," Products Finishing, vol. 52 no. 9, pp. 71-78, June 1988.

Klosterman, Don, and Li, Li, "Conduction and Microstructure Development if Ag-Filled Epoxies," Journal of Electronics Manufacturing, vol. 5 no. 4, pp. 277-287, Dec. 1995.

Klosterman, Don, Li, Li, and Morris, J. E., "Materials Characterization, Conduction Development, and Curing Effects on Reliability of Isotropically Conductive Adhesives," 1996 Proceedings 46th Electronic Components & Technology Conference, Orlando, FL, May 28-31, 1996, pp. 571-577.

Klosterman, Don, Li, Li, and Morris, James E., "Materials Characterization, Conduction Development, and Curing Effects on Reliability of Isotropically Conductive Adhesives," IEEE Transactions on Components, Packaging, and Manufacturing Technology-- Part A, vol. 21 no. 1, pp. 23-31, Mar. 1998.

Klubochkin, A. V., Budueva, V. G., and Sakulin, B. M., "Special Features of Nucleation and Growth of Tin Crystals in the Temperature Range of Its Polymorphic Transformation," Metal Science and Heat Treatment, vol. 44 no. 11-12, pp. 505-509, Nov. 2002. https://doi-org.ezproxy.uky.edu/10.1023/A:1022508906571

Kluk, David, and de Krom, Adrian, "A Rose is a Ross is a RoHS," Advanced Materials & Processes, vol. 164 no. 1, pp. 56-59, Jan. 2006.

Klykov, V. I., and Sheftal, N. N., "Diataxial Growth of Silicon and Germanium," Journal of Crystal Growth , vol. 52 pt. 2, pp. 687-691, Apr. 1981.

Knadle, Kevin, "Failure Mechanisms in Lead-Free Laminates," Printed Circuit Design and Fab, vol. 26 no. 11, pp. 24-27, Nov. 2009.

Knadle, Kevin, "Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Knights, Mikell, "Keep Molds Running Longer," Plastics Technology, vol. 52 no. 2, pp. 50-53, 55, Feb. 2006.

Knivett, Vanessa, "Are you exempt?," New Electronics, vol. xx no. x, pp. 27-28, Oct. 25, 2005.

Knivett, Vanessa, "Are you plugged in?," New Electronics, vol. xx no. x, pp. 31-32, Sept. 26, 2006.

Knivett, Vanessa, "Bringing boards to life," New Electronics, vol. 39 no. 7, pp. 32-33, Apr 11, 2006.

Knivett, Vanessa, "Keeping the faith," New Electronics, vol. xx no. x, pp. 31-32, Feb. 28, 2006.

Knivett, Vanessa, "Living with WEEE." New Electronics, vol. 38 no. 7, pp. 21-22, Apr. 12, 2005.

Knivett, Vanessa, "Substance abuse," New Electronics, vol. xx no. x, pp. 21-22, Oct. 11, 2006.

Knivett, Vanessa, "Time is running out," New Electronics, vol. 36 no. 19, pp. 18-20, Nov. 11, 2003.

Knivett, Vanessa, "WEEE on ice," New Electronics, vol. xx no. x, pp. 14, Jan. 10, 2006.

Knoerr, Matthias, Kraft, Silke, and Schletz, Andreas, "Reliability Assessment of Sintered Nano-Silver Die Attachment for Power Semiconductors," 2010 12th Electronics Packaging Technology Conference , Singapore, Dec. 8-10, 2010, pp. 56-61.

Knorr, D. B., and Rodbell, K. P., "Texture and Grain Structure Effects on the Reliability of Microelectronic Interconnects," Materials Science Forum, vol. 157-162, pp. 1435-1442, 1994.

Knoth, R., Kopacek, B., and Kopacek, P., "Case Study: Multi Life Cycle Center for Electr(on)ic Products," Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, New Orleans, LA, May 16-19, 2005, pp. 194-198.

Knoth, R., Hoffmann, M., Kopacek, B., and Kopacek, P., "Intelligent Disassembly of Electr(on)ic Equipment," Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 11-15, 2001, pp. 557-561.

Knoth, R., Hoffmann, M., Kopacek, B., and Kopacek, P., "Re-use of End-of-life Electronic Equipment and Components - Logistic Aspects," Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 11-15, 2001, pp. 692-695.

Knott, S., and Terzieff, P., "Calculation of the viscosity of the liquid ternary Ag-Au-Sn system," International Journal of Materials Research, vol. 101 no. 7, pp. 834-838, July 2010.

Knott, Sabine, Flandorfer, Hans, and Mikula, Adolf, "Calorimetric investigations of the two ternary systems Al-Sn-Zn and Ag-Sn-Zn," Zeitschrift fur Metallkunde, vol. 96 no. 1, pp. 38-44, Jan. 2005.

Knott, Sabine, and Mikula, Adolf, "Comparison of thermodynamic data of the ternary Cu-Sn-Zn system, measured with the EMF and with the calorimetric method," International Journal of Materials Research, vol. 97 no. 4, pp. 434-439, Apr. 2006.

Knott, Sabine, and Mikula, Adolf, "Thermodynamic Properties of Liquid Al-Sn-Zn alloys: A Possible New Lead-Free Solder Material," Materials Transactions, vol. 43 no. 8, pp. 1868-1872, Aug. 2002.

Knyazeva, Maria V., and Shwartz, Nataliya L., "Examination of Catalytic GaAs Nanowire Growth by Monte Carlo Simulation," 2014 15th International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, Novosibirsk, Russia, June 30-July 4, 2014, pp. 54-56.

Knyazeva, Maria V., and Shwartz, Nataliya L., "Influence of Catalyst Drop Properties on GaAs Nanowhisker Growth," 2012 IEEE 13th International Conference and Seminar of Young Specialists on Micro/Nanotechnologies and Electron Devices, Novosibirsk, Russia, July 2-6, 2012, pp. 20-22.

Knyazeva, Maria V., and Shwartz, Nataliya L., "Influence of Temperature and Catalyst Drop Diameter on GaAs Nanowire growth," 2013 14th International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices, ?, ?, July 1-5, 2013, pp. 19-21.

Knyazeva, Maria V., Nastovjak, Alla G., and Shwartz, Nataliya L., "Monte Carlo Model of GaAs Nanowhisker Growth," 2011 International Conference and Seminar of Young Specialists on Micro/Nanotechnologies and Electron Devices, Novosibirsk, Russia, June 30, 2011-July 4, 2011, pp. 111-113.

Knych, Tadeus, Marnala, Andrzej, Smyrak, Beata, and Walkowicz, Monika, "Research on the influence of the structural state of Cu-ETP wire rod on the annealing susceptibility of wires," Wire Journal International, vol. 44 no. 10, pp. 60-67, Oct. 2011.

Ko, C. H., Chang, C. C., Chen, L. C., and Lee, T. S., "A Comparison of Cadmium Electroplate And Some Alternatives," Plating & Surface Finishing, vol. 78 no. 10, pp. 46-49, Oct. 1991.

Ko, Chang-Yen, and Wu, Albert T., "Evaluation of Diffusion Barrier Between Pure Sn and Te." Journal of Electronic Materials, vol. 41 no. 12, pp. 3320-3324, Dec. 2012.

Ko, Cheng-Ta, Chang, Tao-Chih, Chiang, Chia-Wen, Kuo, Tzu-Ying, Shih, Ying-Ching, and Chen, Yu-Hua, "Next Standard Packaging Method for DRAM - Chip-in-Substrate Package," International Microsystems, Packaging, Assembly Conference Taiwan, Taipei, Taiwan, Oct. 18-20, 2006, pp. xx-xx.

Ko, Myung-Dong, Rim, Tai-Uk, Baek, Chang-Ki, Kim, Dae Mann, and Jeong, Yoon-Ha, "Characterization of Silicon Nanowire Biosensors and Solar Cells," 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology, X'an, China, Oct. 29-Nov. 1, 2012, pp. xx-xx.

Ko, P. L., and Robertson, M. F., "Wear characteristics of electrolytic hard chrome and thermal sprayed WC-10 Co-4 Cr coatings sliding against Al-Ni-bronze in air at 21 °C and at -40 °C," Wear, vol. 252 no. 11-12, pp. 880-893, 2002.

Ko, Yong-Ho, Son, Kirak, Kim, Gahui, Park, Young-Bae, Yu, Dong-Yurl, Bang, Junghwan, and Kim, Taek-Soo, "Effects of graphene oxide on the electromigration lifetime of lead-free solder joints," Journal of Materials Science: Materials in Electronics , vol. 30 no. 3, pp. 2334-2341, Feb. 2019.

Ko, Yong-Ho, Kim, Min-Su, Bang, Junghwan, Kim, Taek-Soo, and Lee, Chang-Woo, "Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate," Journal of Electronic Materials, vol. 44 no. 7, pp. 2458-2466, July 2015.

Ko, Yong-Ho, Lee, Young-Kyu, Yoo, Sehoon, and Lee, Chang-Woo, "Reliability of Various Pb-free Solders under Vibration and Elevated Temperature Environments," 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 7-9, 2011, pp. 626-630.

Ko, Young-Ki, Fujii, Hiromichi T., Sato, Yutaka S., Lee, Chang-Woo, and Yoo, Sehoon, "Advanced Solder TSV Filling Technology Developed with Vacuum and Wave Soldering," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 2091-2095.

Ko, Young-Ki, Kwon, Sang-Hyun, Lee, Young-Kyu, Kim, Jun-Ki, Lee, Chang-Woo, and Yoo, Sehoon, "Fabrication and interfacial reaction of carbon nanotube-embedded Sn-3.5Ag solder balls for ball grid arrays," Journal of Alloys and Compounds , vol. 583, pp. 155-161, Jan. 15, 2014.

Ko, Young-Ki, Fujii, Hiromichi T., Sato, Yutaka S., Lee, Chang-Woo, and Yoo, Sehoon, "High-speed TSV filling with molten solder," Microelectronic Engineering , vol. xx no. xx, pp. xx-xx, xxxx.

Kobayashi, Akiko, Aoki, Yuichi, and Toi, Keiko, "Evaluating the CAF (conductive anodic filament) resistance of multi-layered PWBs," ESPEC Technology Report, no. 24, pp. 1-17, May 1, 2007.

Kobayashi, Hideaki, "On the present situation of recycling processes for the end-of-life vehicles," Journal of Japan Institute of Light Metals, vol. 59 no. 11, pp. 606-611, 2009.

Kobayashi, Kyosuke, Shohji, Ikuo, and Yamashita, Mitsuo, "Effect of third element addition on joint strength of low-Ag lead-free solder," 2015 IEEE 17th Electronics Packaging and Technology Conference , Singapore, Dec. 2-4, 2015, pp. xx-xx.

Kobayashi, T., Sasaki, K., Ohguchi, K., and Narita, Y., "Experimental and Theoretical Investigation of Viscoplastic Deformation of Solder Alloys for Electronic Packaging," Key Engineering Materials , vol. 345-356 I, pp. 97-100, 2007.

Kobayashi, Takayuki, Kariya, Yoshiharu, Sasaki, Tsutomu, Tanaka, Masamoto, and Tatsumi, Kohei, "Effect of Ni Addition on Bending Properties of Sn-Ag-Cu Lead-Free Solder Joints," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 684-688.

Kobayashi, Takayuki, Terashima, Shinichi, and Tanaka, Masamoto, "Effect of thermomechanical fatigue on drop impact properties of Sn-Ag-Cu Lead-Free Solder Joints," 2012 IEEE 14th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 5-7, 2012, pp. 215-218.

Kobayashi, Takayuki, Lee, Andre, and Subramanian, K. N., "Impact Behavior of Thermomechanically Fatigued Sn-Based Solder Joints," Journal of Electronic Materials, vol. 38 no. 12, pp. 2659-2667, Dec. 2009.

Kobayashi, Takuji, and Sasaki, Katsuhiko, "Experiments and simulations of uniaxial ratchetting deformation of Sn-3Ag-0.5Cu and Sn-37Pb solder alloys," Journal of Materials Science: Materials in Electronics, vol. 20 no. 4, pp. 343-353, Apr. 2009.

Kobayashi, Takuji, Sasaki, Katsuhiko, Ohguchi, Ken-Ichi, and Narita, Yoshihiro, "Ratchetting and Creep Deformation of Solder Alloys," Key Engineering Materials, vol. 340-341 II, pp. 859-864, 2007.

Kobayashi, Tatsuya, Yokoi, Masaki, Kobayashi, Kyosuke, Mitsui, Kohei, and Shohji, Ikuo, "Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size Specimens," Solid State Phenomena, vol. 273, pp. 83-90, Apr. 2018.

Kobayashi, Tsukasa, Kitahara, Hiroaki, and Hosokawa, Naokichi, "Substrate temperature dependence of hillock, grain, and crystal orientation in sputtered Al-alloy films," Journal of Vacuum Science & Technology A: Vacuum Surfaces, and Films, vol. 5 no. 4, pp. 2088-2091, July/Aug. 1987.

Kobler, Aaron, Beuth, Thorsten, Kloffel, Tobias, Prang, Robby, Moosmann, Markus, Scherer, Torsten, Walheim, Stefan, Hahn, Horst, Kubel, Christian, Meyer, Bernd, Schimmel, Thomas, and Bitzek, Erik, "Nanotwinned silver nanowires: Structure and mechanical properties," Acta Materialia, vol. 92, pp. 299-308, June 15, 2015.

Kochilla, John R., Bishop, Craig V., Tyler, Jim, and Wynn, Paul C., "Delivering High Performance Automotive Corrosion Coatings Through The ELVD Conduit," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 495-500.

Kodek, Breda, "Quality of Soldering Joints on Different Printed Boards for the Lead Free Time in Electronic Industry," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Koep, Paul, "Component-level Thermal Management," Surface Mount Technology (SMT) , vol. 20 no. 7, pp. xx-xx, July 2006.

Koguchi, Hideo, Attaporn, Wisessint, and Nishida, Kazuto, "Reliability Analysis of ACF Interconnection Assembly Process using FEM," Key Engineering Materials, vol. 297-300 part 3, pp. 1828-1833, Nov. 2005.

Koguchi, Masanari, Kakibayashi, Hiroshi, Yazawa, Masamitsu, Hiruma, Kenji, and Katsuyama, Toshio, "Crystal Structure Change of GaAs and InAs Whiskers from Zinc-Blende to Wurtzite Type," Japanese Journal of Applied Physics, vol. 31 pt. 1 no. 7, pp. 2061-2065, July 1992.

Koh, Sau, Tummala, Rao, Saxena, Ashok, and Selvam, P., "A Numerical Analysis of Crack Growth and Morphology Evolution in Chip-to-Packages Nano-Interconnections," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1625-1629.

Koh, Wayne, "Progress in Low Temperature Lead-free Solder for SMT Assembly," SMTA China East 2017 Proceedings, Shanghai, China, Apr. 25-27, 2017, pp. xx-xx.

Koh, Wei, Baldwin, Evelyn, Meischke, Steve, and Sims, Jennifer, "Materials and Processes for Memory Cards," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Kohashi, Yoshinori, Sato, Takuya, Ikejiri, Keitaro, Tomioka, Katsuhiro, Hara, Shinjiroh, and Motohisa, Junichi, "Influence of growth temperature on growth of InGaAs nanowires in selective-area metal-organic vapor-phase epitaxy," Journal of Crystal Growth, vol. 338 no. 1, pp. 47-51, Jan. 1, 2012.

Kohinata, Shigeru, Sekihara, Shyu, and Fujimura, Kenji, "Investigation on Void Formation in Die Attach Adhesives and Its Influence on Chip Reliability," Proceedings of the 1990 International Symposium on Microelectronics, Chicago, IL, Oct. 15-17, 1990, pp. 53-60.

Kohler, Achim, and Dullenkopf, Peter, "A novel approach for hybrid optoelectronic circuits: thick-film on glass (TOG)," Microelectronics International, vol. 17 no. 3, pp. 7-10, 2000.

Kohler, Andreas R., Hilty, Lorenz M., and Bakker, Conny, "Prospective Impacts of Electronic Textiles on Recycling and Disposal," Journal of Industrial Ecology, vol. 15 no. 4, pp. 496-511, Aug. 2011.

Kohler, F., Germond, L., Wagniere, J.-D., and Rappaz, M., "Peritectic solidification of Cu-Sn alloys: Microstructural competition at low speed," Acta Materialia, vol. 57 no. 1, pp. 56-68, Jan. 2009.

Kohler, Rainer, "Bleifreie SMD-Montage," Feinwerktechnik, Mikrotechnik, Messtechnik , vol. 106 no. 12, pp. 913-915, Dec. 1998.

Kohlscheen, J., Stock, H.-R., and Mayr, P., "Corrosion protection of aluminum alloys by magnetron sputtering and ion implantation," 2001 Aerospace/Airline Plating & Metal Finishing Forum, Portland, OR, Mar. 27-29, 2001, pp. 133-140.

Kohlschutter, H. W., "Uber den Mechanismus der Haarsilberbildung auf Silbersulfid," Zeitschrift fur Elektrochemie und Angewandte Physikalische Chemie, vol. 38 no. 6, pp. , June 1932.

Kohnke, E. E., and Ewald, A. W., "Hall Effect in Gray Tin Filaments," Physical Review, series 2, vol. 102 no. 6, pp. 1481-1486, June 15, 1956.

Koide, Masateru, Fukuzono, Kenji, Watanabe, Manabu, Yamamoto, Tsuyoshi, and Sakuyama, Seiki, "Full Low Temperature Solder BGA Development for Large size BGA Package," 2020 IEEE 70th Electronic Components and Technology Conference, Lake Buena Vista, AL, May 26-29, 2020, pp. 1265-1269.

Koide, Masateru, "Full LTS BGA Application for Large size BGA Package," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. xx-xx.

Koike, J., Sekiguchi, A., Wada, M., and Maruyama, K., "A Relationship between Film Texture and Stress-Voiding Tendency in Copper Thin Films," AIP Conference Proceedings, vol. 612, pp. 169-176, 2002.

Kojima, Shinichi, Nakanishi, Hiroshi, Yoda, Kazuo, and Sora, Hiroshi, "Traceability System for Manufacturer Accountability," Hitachi Review, vol. 53 no. 5, pp. 250-255, Dec. 2004.

Kojima, Toshiyuki, Tomura, Yoshihiro, Shiraishi, Tsukasa, Itagaki, Minehiro, and Tsukamoto, Masahide, "Development of Shortening Process Time in SBB," 2002 Pan Pacific Symposium Conference Proceedings, Maui, Hawaii, Feb. 5-7, 2002, pp. xx-xx.

Kok, Chee Kuang, Ng, Wen Jie, Ooi, Chin Chin, and Liew, Kia Wai, "Ball-grid-array solder joint model for assembly-level impact reliability prediction," Microelectronics Reliability, vol. 65, pp. 184-191, Oct. 2016.

Kok, Kok Ying, Ng, I. K., Choo, Tan Foo, Saidin, N. B., and Abdullah, Yusof, "Electrochemical Synthesis and Characterisation of BiTe-based Nanowire Arrays as Thermoelectric Nanogenerators," Materials Science Forum, vol. 840, pp. 271-275, Jan. 2016.

Kokas, J., DeSantis, C., Wenger, George, Reed, Jim, Fey, Ed, Gaudiello, John, Yost, Fred, Hosking, Michael, Sorenson, Rob, Stevenson, Joel, Janus, Alan, and Evans, Ron, "NCMS PWB Surface Finishes Team Project Summary," Sandia Report SAND96-0898C, CONF-9603116--2.

Kokko, Kati, Harjunpaa, Hanna, Heino, Pekka, and Kellomaki, Minna, "Composite coating structure in an implantable electronic device," Soldering & Surface Mount Technology, vol. 21 no. 3, pp. 24-29, 2009.

Kokko, Kati, Parviainen, Anniina, and Frisk, Laura, "Corrosion protection of anisotropically conductive adhesive joined flip chips," Microelectronics Reliability, vol. 50 no. 8, pp. 1152-1158, Aug. 2010.

Kokko, Kati, Harjunpaa, Hanna, Haltia, Anna-Maija, Heino, Pekka, and Kellomaki, Minna, "Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspective," Soldering & Surface Mount Technology, vol. 21 no. 4, pp. 4-11, 2009.

Kokko, Kati, Harjunpaa, Hanna, Heino, Pekka, and Kellomaki, Minna, "Hydrolysis Testing of ACF Joined Flip Chip Components with Conformal Coating," European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Kokko, Kati, Harjunpaa, Hanna, Heino, Pekka, and Kellomaki, Minna, "Influence of medical sterilization on ACA flip chip joints using conformal coating," Microelectronics Reliability, vol. 49 no. 1, pp. 92-98, Jan. 2009.

Kokko, Kati, Frisk, Laura, and Heino, Pekka, "Thermal cycling of flip chips on FR-4 and PI substrates with parylene C coating," Soldering & Surface Mount Technology, vol. 22 no. 3, pp. 42-48, 2010.

Kokogawa, Toru, Morishita, Hitoshi, Adachi, Kohei, Otsuki, Hideaki, Takasago, Hayato, and Yamazaki, Teruhiko, "Effective Evaluation of Anisotropic Conductive Film," Conference Record of the 1991 International Display Research Conference, 1991, pp. 45-48.

Kolasinski, Kurt W., "Catalytic growth of nanowires: Vapor-liquid-solid, vapor-solid-solid, solution-liquid-solid and solid-liquid-solid growth," Current Opinion in Solid State and Materials Science, vol. 10 no. 3-4, pp. 182-191, June-Aug. 2006 https://doi.org/10.1016/j.cossms.2007.03.002

Kolb, Matthias, and Richter, Gunther, "Growth Of Single Crystalline Copper Nanowhiskers," AIP Conference Proceedings, vol. 1300, pp. 98-105, 2010.

Kolbe, Jana, Arp, Andreas, Calderone, Francesco, Meyer, Edouard Marc, Meyer, Wilhelm, Schaefer, Helmut, and Stuve, Manuela, "Inkjettable conductive adhesive for use in microelectronics and microsystems technology," 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, Oct. 23-26, 2005, pp. 160-163.

Kolbe, Jana, Arp, Andreas, Calderone, Francesco, Meyer, Edouard Marc, Meyer, Wilhelm, Schaefer, Helmut, and Stuve, Manuela, "Inkjettable conductive adhesive for use in microelectronics and microsystems technology," Microelectronics Reliability, vol. 47 no. 2-3, pp. 331-334, Feb.-Mar. 2007.

Kolenak, R., and Zubor, P., "Soldering of Ceramic Materials Using Ultrasonic Energy," Welding in the World, vol. 49 no. 9, pp. 546-553, July 2005.

Kolenak, Roman, and Chachula, Michal, "Characteristics and properties of Bi-11Ag solder," Soldering & Surface Mount Technology, vol. 25 no. 2, pp. 68-75, 2013.

Kolenak, Roman, Kostolny, Igor, and Kusy, Martin, "Characterization of soldering alloy type Zn-In-Mg and the study of direct soldering of silicon and copper," Materials Science and Engineering: A , vol. 712, pp. 302-312, Jan. 17, 2018.

Kolenak, Roman, Augustin, Robert, Martinkovic, Maros, and Chachula, Michal, "Comparison study of SAC405 and SAC405+0.1%Al lead free solders," Soldering & Surface Mount Technology, vol. 25 no. 3, pp. 175-183, 2013.

Kolenak, Roman, Kostolny, Igor, and Sahul, Martin, "Direct bonding of silicon with solders type Sn-Ag-Ti," Soldering & Surface Mount Technology, vol. 28 no. 3, pp. 149-158, 2016.

Kolenak, Roman, Kostolny, Igor, Drapala, Jaromir, Kusy, Martin, and Pasak, Matej, "Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder," Soldering & Surface Mount Technology, vol. 31 no. 2, pp. 93-101, 2019.

Kolsters, J. W. M., de Kluizenaar, E. E., Winters, H. H. A., and Evers, P. C. J., "Consequences of Changing to Lead-Free Solder for Board Assembly." IPC and Soldertec Global Conference on Lead Free Electronics, Brussels, Belgium, June 11-12, 2003, pp. xx-xx.

Komagata, Michinori, Toida, Go, Hocchi, Toyokazu, and Suzuki, Kenichi, "Conductive Adhesive for Plated Sn or Sn/Pb Electrode," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 216-220.

Komagata, Michinori, Yokoyama, Kiminori, Tanaka, Yokoyama, and Suzuki, Kenichi, "Nickel Filled Adhesives," Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium, Omiya, Japan, Dec. 4-6, 1995, pp. 429-432.

Komar, A., and Lasarew, B., "On the Linear Velocity of Transformation of White Tin into Grey," Physikalische Zeitschrift der Sowjetunion, vol. 7 no. 4, pp. 468-473, 1935.

Komatsu, E., Higuchi, Y., and Niina, T., "A p-n Junction in Silicon Whiskers Grown by VLS Methods," Applied Physics Letters, vol. 10 no. 2, pp. 42-43, Jan. 15, 1967.

Komine, Takashi, Aono, Tomosuke, Nabatame, Yuta, Murata, Masayuki, and Hasegawa, Yasuhiro, "Enhancement of Seebeck Coefficient in Bi Nanowires by Electric Field Effect," Journal of Electronic Materials, vol. 45 no. 3, pp. 1555-1560, Mar. 2016.

Komitsky Jr., Frank, and Lasky, Ronald, "Die Attach in Lead Frame Packages: Step 4," Advanced Packaging , vol. xx no. xx, pp. xx-xx, Apr. 2004.

Komukai, Takao, Miyazaki, Mitsuaki, and Samejima, Yuki, "An Approach to the Anisotropic Conductive Adhesives for Micro-interconnection Technology," 1996 Surface Mount International Conference Proceedings , San Jose, CA, Sept. 10-12, 1996, pp. 402-407.

Kondo, Kazuo, "Crystal Growth and Morphology of Electrodeposits," Journal of the Surface Finishing Society of Japan, vol. 60 no. 12, pp. 754-760, 2009.

Kondo, Satoshi, Yu, Qiang, Shibutani, Tadahiro, and Shiratori, Masaki, "New Reliability Assessment Method for Solder Joints in BGA Package by Considering the Interaction between Design Factors," Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, Budapest, Hungary, Sept. 17-19, 2007, pp. 26-31.

Kondo, T., Obata, K., Takeuchi, T., and Masaki, S., "Bright Tin-Silver Alloy Electrodeposition from an Organic Sulfonate Bath Containing Pyrophosphate, Iodide & Triethanolamine as Chelating Agents," Plating & Surface Finishing, vol. 85 no. 2, pp. 51-55, Feb. 1998.

Kondo, Yasushi, and Nakamura, Shinichiro, "Evaluating Alternative Life-Cycle Strategies for Electrical Appliances by the Waste Input-Output Model," International Journal of Life Cycle Assessment, vol. 9 no. 4, pp. 236-246, July 2004.

Kondos, Pericles A., Meilunas, Michael, and Borgesen, Peter, "Pb-Free Assembly with Low-Ag Solders for High Yield and Solder Joint Performance," International Conference on Soldering & Reliability 2011 Proceedings, Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

Kondos, Pericles A., Meilunas, Michael, and Borgesen, Peter, "Quick Assessment of the Minimum Peak Reflow Temperature Required in Low-Ag Solder Assembly," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 84-91.

Kondrachova, Lilia, Aravamudhan, Srini, Sidhu, Rajen, Amir, Dudi, and Aspandiar, Raiyo, "Fundamentals of the Non-Wet Open BGA Solder Joint Defect Formation," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 16-18, 2012, pp. xx-xx.

Kong, Deli, Sun, Shiduo, Xin, Tianjiao, Xiao, Lirong, Sha, Xuechao, Lu, Yan, Mao, Shengcheng, Zou, Jin, Wang, Lihua, and Han, Xiaodong, "Reveal the size effect on the plasticity of ultra-small sized Ag nanowires with in situ atomic-scale microscopy," Journal of Alloys and Compounds , vol. 676, pp. 377-382, Aug. 15, 2016.

Kong, Gang, Lu, Jintang, and Wu, Haijiang, "Post treatment of silane and cerium salt as chromate replacers on galvanized steel," Journal of Rare Earths, vol. 27 no. 1, pp. 164-168, Feb. 2009.

Kong, Xiangxia, Sun, F., Yang, Miaosen, and Liu, Yang, "High temperature creep properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints by nanoindentation method," Soldering & Surface Mount Technology, vol. 28 no. 3, pp. 167-174, 2016.

Kong, Xiangxia, Sun, Fenglian, and Yang, Miaosen, "The indentation size effect in SnAgCu lead-free BGA solder joints at elevated temperatures," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 1207-1210.

Kong, Ying Ying, Pang, Suh Cem, and Chin, Suk Fun, "Facile synthesis of nickel nanowires with controllable morphology," Materials Letters, vol. 142, pp. 1-3, Mar. 1, 2015.

Kong, Yong, Shao, Jianqun, Wang, Wenchang, Liu, Qifa, and Chen, Zhidong, "Electroless Sn-Ni alloy plating with high Sn content free of activation pretreatment," Journal of Alloys and Compounds, vol. 477 no. 1-2, pp. 328-332, May 27, 2009.

Kongtongnok, Nopphadal, and Anuntapong, Suntra, "Studying of Fracture Joint Failure Mechanism on Board Level Reliability Test Process Comparing Between SnPb and Sn Lead Finished ICs," Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 7-11, 2003, pp. 108-112.

Konig, Martin, Klink, Gerhard, and Feil, Michael, "Fast Flip Chip Assembly for Reel-to-Reel Manufacturing," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, Germany, Oct. 21-24, 2001, pp. 319-323

Kono, Eiichi, "Pb-Free Soldering," Hyomen Gijutsu (Journal of the Surface Finishing Society of Japan), vol. 55 no. 12, pp. 846-85, Dec. 2004.

Konoza, Anthony, Sandborn, Peter A., and Chaloupka, Andrew C., "Analysis of the Electronic Assembly Repair Process for Lead-Free Parts Under Combined Loading Conditions," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 9, pp. 1558-1567, Sept. 2012.

Konrad, Michael T., "Alternative technologies for lead-free de-fluxing," Global SMT and Packaging, vol. 6 no. 8, pp. 26, 28-29, Sept. 2006.

Konrad, P., Bacca, C., Scheer, E., Brenner, P., Mayer-Gindner, A., and v. Lohneysen, H., "Stable single-atom contacts of zinc whiskers," Applied Physics Letters , vol. 86, pp. 213115-1-213115-3, 2005.

Kontani, Hiroyuki, Kariya, Yoshiharu, and Fumikura, Tomoya, "Microstructural Analysis of Low-cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint," Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 1, Burlingame, CA, July 16-18, 2013, pp. V001T07A013-1-V001T07A013-7.

Koo, Ja-Myeong, and Jung, Seung-Boo, "Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging," Microelectronics Reliability , vol. 47 no. 12, pp. 2169-2178, Dec. 2007.

Koo, Ja-Myeong, and Jung, Seung-Boo, "Effect of substrate metallization on mechanical properties of Sn-3.5Ag BGA solder joints with multiple reflows," Microelectronic Engineering , vol. 82 no. 3-4, pp. 569-574, Dec. 2005.

Koo, Ja-Myeong, and Jung, Seung-Boo, "Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package," Microsystem Technologies , vol. 13 no. 11-12, pp. 1567-1573, July 2007.

Koo, Ja-Myeong, Yoon, Jeong-Won, and Jung, Seung-Boo, "Interfacial reactions and mechanical properties of In-48Sn solder joint with electroplated Au/Ni ball grid array (BGA) substrate after multiple reflows," Journal of Materials Research, vol. 23 no. 6, pp. 1631-1641, June 2008.

Koo, Ja-Myeong, Vu, Bui Quoc, Kim, Yu-Na, Lee, Jong-Bum, Kim, Jong-Woong, Kim, Dae-Up, Moon, Jeong-Hoon, and Jung, Seung-Boo, "Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows," Journal of Electronic Materials , vol. 37 no. 1, pp. 118-124, Jan. 2008.

Koo, Ja Myeong, Lee, Young Ho, Kim, Sun Kyu, Jeong, Myung Yong, and Jung, Seung Boo, "Mechanical and Electrical Properties of Sn-3.5Ag Solder/Cu BGA Packages during Multiple Reflows," Key Engineering Materials, vol. 297-300, pp. 801-806, pp. 2005.

Koo, Ja-Myeong, and Jung, Seung-Boo, "Reliability of In-48Sn Solder/Au/Ni/Cu BGA Packages during Reflow Process," Journal of Electronic Materials, vol. 34 no. 12, pp. 1565-1572, Dec. 2005.

Koo, Ja-Myeong, Kim, Yu-Na, Yoon, Jeong-Won, Ha, Sang-Su, and Jung, Seung-Boo, "Reliability of nickel flip chip bumps with a tin-silver encapsulation on a copper/tin-silver substrate during the bonding process," Microelectronic Engineering, vol. 84 no. 11, pp. 2686-2690, Nov. 2007.

Koo, Jahyun, Lee, Changsoo, Hong, Sung Jea, Kim, Keun-Soo, and Lee, Hyuck Mo, "Microstructural discovery of Al addition on Sn-0.5Cu-based Pb-free solder design," Journal of Alloys and Compounds, vol. 650, pp. 106-115, Nov. 25, 2015.

Koo, Jahyun, Chang, Jaewon, Lee, Young Woo, Hong, Sung Jea, Kim, Keun-Soo, and Lee, Hyuck Mo, "New Sn-0.7Cu-based solder alloys with minor alloying additions of Pd, Cr and Ca," Journal of Alloys and Compounds, vol. 608, pp. 126-132, Sept. 25, 2014.

Koohpayeh, Seyed Mojtaba, and Taheri, A. Karimi, "Effect of strain hardening exponent on the occurrence of central burst in the aluminum wiredrawing process," Wire Journal International, vol. 39 no. 1, pp. 63-66, Jan. 2006.

Koon, Ooi Wan, Razai, Mohd Jaffri, Pin, Chan Boon, and Sharif, Nurul Akmal Mohd, "Study on IMC Morphology and Impact to Solder Joint Performance for Different Halogen Free (HF) Flux in Semiconductor Application," 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Melaka, Malaysia, Nov. 30-Dec. 2, 2010, pp. xx-xx.

Koonce, S. Eloise, and Arnold, S. M., "Growth of Metal Whiskers," Journal of Applied Physics, vol. 24 no. 3, pp. 365-366, Mar. 1953.

Koonce, S. Eloise, and Arnold, S. M., "Metal Whiskers," Journal of Applied Physics, vol. 25 no. 1, pp. 134-135, Jan. 1954.

Koorithodi, Liyakathali, "Thermal Profiling: A Practical Approach to Reflow Profiling ," SMT Web Exclusive Article.

Kopacek, P., and Kopacek, B., "Intelligent, flexible disassembly," International Journal of Advanced Manufacturing Technology, vol. 30 no. 5-6, pp, 554-560, Sept. 2006.

Kopyto, Marek, Onderka, Boguslaw, and Zabdyr, Leszek A., "Thermodynamic properties of the liquid Ag-Cu-Sn lead-free solder alloys," Materials Chemistry and Physics, vol. 122 no. 2-3, pp. 480-484, Aug. 1, 2010.

Korhonen, T. M., Su, P., Hong, S. J., Korhonen, M. A., and Li, C.-Y., "Reactions of Lead-Free Solders with CuNi Metallizations," Journal of Electronic Materials, vol. 29 no. 10, pp. 1194-1199, Oct. 2000.

Korhonen, T. M., Hong, S. J., Su, P., and Korhonen, M. A., "Solder/Substrate Interactions Between Lead-Free Solders and CuNi Alloys," 2000 SMTA International Conference Proceedings, Chicago, IL, Sept. 24-28, 2000, pp. xx-xx.

Korhonen, T.-M., and Kivilahti, J. K., "Thermodynamics of the Sn-In-Ag Solder System," Journal of Electronic Materials, vol. 27 no. 3, pp. 149-158, Mar. 1998.

Korhonen, T. M., Su, P., Hong, S. J., Korhonen, M. A., and Li, C.-Y., "Under Bump Metallizations for Lead Free Solders," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 1106-1110.

Korhonen, Tia-Marje, Vuorinen, Vesa, and Kivilahti, Jorma K., "Interconnections Based on Bi-Coated SnAg Solder Balls," IEEE Transactions on Advanced Packaging, vol. 24 no. 4, pp. 515-520, Nov. 2001.

Korhonen, Tia-Marje K., Lehman, Lawrence P., Korhonen, Matt A., and Henderson, Donald W., "Isothermal Fatigue Behavior of the Near-Eutectice Sn-Ag-Cu Alloy between -25°C and 125°C,"Journal of Electronic Materials, vol. 36 no. 2, pp. 173-178, Feb. 2007.

Korhonen, Tia-Marje K., Turpeinen, Pekka, Lehman, Lawrence P., Bowman, Brian, Thiel, George H., Parkes, Raymond C., Korhonen, Matt A., Henderson, Donald W., and Puttlitz, Karl J., "Mechanical Properties of Near-Eutectic Sn-Ag-Cu Alloy over a Wide Range of Temperatures and Strain Rates," Journal of Electronic Materials, vol. 33 no. 12, pp. 1581-1588, Dec. 2004.

Korkmaz, S. D., and Korkmaz, S., "Structure and electrical resistivity of liquid In-Sn alloy," Computational Materials Science, vol. 48 no. 3, pp. 466-470, May 2010.

Kornain, Zainudin, Amin, Nowshad, Jalar, Azman, Cheah, Ang Ye, and Ahmad, Ibrahim, "Effect of Treated Silver Nanoparticles to Electrical Conductivity Improvement of Electrically Conductive Adhesive (ECA)," IEEE International Conference on Semiconductor Electronics, Johor Bahru, Malasia, Nov. 25-27, 2008, pp. 549-553.

Korpinarov, N., Marinov, M., Dimova-Malinovska, D., Nichev, H., Konstantinova, M., and Vasilev, D., "Silicon nanowires and whiskers obtained by arc discharge," Journal of Physics: Conference Series, vol. 113, pp. , 2008.

Korsunsky, Alexander M., Hofmann, Felix, Abbey, Brian, Song, Xu, Belnoue, Jonathan P., Mocuta, Cristian, and Dolbnya, Igor, "Analysis of the internal structure and lattice (mis)orientation in individual grains of deformed CP nickel polycrystals by synchrotron X-ray micro-diffraction and microscopy," International Journal of Fatigue , vol. 42, pp. 1-13, Sept. 2012. https://doi.org/10.1016/j.ijfatigue.2011.03.003

Korte, Kylee, "Rapid Synthesis of Silver Nanowires," 2007 REU Research Accomplishments, pp. 28-29.

Koschmieder, Thomas, Rayos, Joachim, Carpenter, Burt, and Westerman, Gary, "Comparing Electronic Component Package Materials and Substrate Vendors for Solder-Joint Reliability Improvements," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 92-100.

Koschmieder, Thomas, Leoni, Michael, and Phou, Jesse, "Environmental Packaging Solutions with No-Pb Materials and LGA Options," 2001 Advanced Packaging Technology Conference Proceedings, 2001, pp. xx-xx.

Koschmieder, Thomas, "Experiences with Monotonic Bend Test of Electronic Packages," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 405-411.

Koschmieder, Thomas, and Martin, Fonzell, "Pb Free / High Temperature Reflow MSL Package Assessment of a LGA Package Alternative for Portable Products," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 700-704.

Koscielski, Marek, Bukat, Krystyna, Jakubowska, Malgorzata, and Mlozniak, Anna, "Application of Silver Nanoparticles to Improve Wettability of SnAgCu Solder Paste," 2010 33rd International Spring Seminar on Electronics Technology , Warsaw, Poland, May 12-16, 2010, pp. 473-477.

Koscielski, Marek, and Sitek, Janusz, "Influence of Soldering Condition on Structure and Reliability of Solder Joints Made in Package-on-Package technology," 2016 6th Electronic System-Integration Technology Conference, Grenoble, France, Sept. 13-15, 2016, pp. xx-xx.

Koscielski, Marek, and Sitek, Janusz, "Influence of the fluxes properties on quality and the microstructure of lead-free solder joints executed by selective soldering," Soldering & Surface Mount Technology, vol. 26 no. 1, pp. 2-7, 2014.

Koscielski, Marek, Sitek, Janusz, Steplewski, Wojciech, Koziol, Grazyna, Ciszewski, Piotr, and Krzaczek, Tomasz, "Materials and soldering challenges in lead-free Package-on-Package (PoP) technology," Soldering & Surface Mount Technology, vol. 27 no. 3, pp. 103-107, 2015.

Koscielski, Marek, Bukat, Krystyna, Sitek, Janusz, Jakubowska, Malgorzata, Niedzwiedz, Wojciech, and Mlozniak, Anna, "Sac 305 Solder Paste With Silver Nanopowder and Carbon Nanotubes Addition - Basic Properties of Pastes and Solder Joints," 2012 35th International Spring Seminar on Electronics Technology, Bad Aussee, Austria, May 9-13, 2012, pp. 363-366.

Kosiba, Eva, Bagheri, Simin, Bagheri, Zohreh, Snugovsky, Polina, and Perovic, Doug, "Assembly Feasibility and Property Evaluation of Low Ag, Bi-Containing Solder Alloys," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 16-18, 2012, pp. xx-xx.

Kosiba, Eva, Snugovsky, Polina, and Perovic, Doug, "Microstructural Evaluation of Low and No-Ag, Bi-Containing Pb-Free Solders," International Conference on Soldering & Reliability 2015 Proceedings, Toronto, Ontario, Canada, May 19-21, 2015, pp. xx-xx.

Kosiba, Eva, Snugovsky, Polina, McMahon, John, and Perovic, Doug, "Microstructural Improvements of SAC Alloys with Bi Additions During Accelerated Thermal Cycling," International Conference on Soldering & Reliability 2016 Proceedings, Toronto, Ontario, Canada, May 9-11, 2016, pp. xx-xx.

Kosiba, Eva, Bagheri, Simin, Snugovsky, Polina, and Perovic, Doug, "Microstructure and Reliability of Low Ag, Bi-Containing Solder Alloys," International Conference on Soldering & Reliability 2013 Proceedings , Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.

Kosinova, Anna, Wang, Dong, Schaaf, Peter, Sharma, Amit, Klinger, Leonid, and Rabkin, Eugen, "Whiskers growth in thin passivated Au films," Acta Materialia, vol. 149, pp. 154-163, May 1, 2018.

Koskela, Kevin, "XRF Testing Offers Cost-Effectiveness When Accurately Implemented," ECN , pp. 36-37, Dec. 2006.

Kossives, Dean, "Conductive Anodic Filament Formation," empfasis, pp. 5-6, Jan. 2007.

Kossowsky, Ram, Pearson, R. C., and Christovich, L. T., "Corrosion of In-Base Solders," 16th Annual Reliability Physics Symposium, San Diego, CA, Apr. 18-20, 1978, pp. 200-206.

Kostic, Andrew D., "Current Understanding of the Quality and Reliability of Lead-free Tin," Microelectronics Reliability & Qualification Workshop, Manhattan Beach, CA, Dec. 2005, pp. xx-xx.

Kostic, Andrew D., "Lead-free Electronics Reliability - An Update," Tin Whisker Group teleconferences, Aug. 24, 2011 and Aug. 31, 2011.

Kostic, Andrew D., "The Aerospace Corporation Lead-Free Working Group (LFWG)," Tin Whisker Group teleconference, May 16, 2012.

Kostic, Andrew D., "Tin Plague," Jan. 1, 2005.

Kostov, Ana, Gomidzelovic, Lidija, Milosavljevic, Aleksandra, and Simsic, Zdenka Stanojevic, "Thermodynamic characterization of solder Au-Ga alloys," Materials Chemistry and Physics, vol. 241, pp. 122278-1-122278-6, Feb. 1, 2020.

"Tin Whiskers - A "New" Problem," Feb. 25, 2004.

Kosuga, Tadashi, "LTS Vision and Progress," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. xx-xx.

Kotadia, H. R., Das, A., Doernberg, E., and Schmid-Fetzer, R., "A comparative study of ternary Al-Sn-Cu immiscible alloys prepared by conventional casting and casting under high-intensity ultrasonic irradiation," Materials Chemistry and Physics, vol. 131 no. 1-2, pp. 241-249, Dec. 15, 2011.

Kotadia, H. R., Mokhtari, O., Bottrill, M., Clode, M. P., Green, M. A., and Mannan, S. H., "Effect of Al and Zn alloying elements on Sn-3.8Ag-0.7Cu and Sn-3.6Ag solder reaction with Cu and Ni(P) substrate," International Symposium on Advanced Packaging Materials, Cambridge, England, Feb. 28-Mar. 2, 2010, pp. 17-21.

Kotadia, H. R., Mannan, S. H., and Das, A., "Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys," Journal of Electronic Materials, vol. 48 no. 5, pp. 2731-2736, May 2019.

Kotadia, H. R., Mokhtari, O., Clode, M. P., Green, M. A., and Mannan, S. H., "Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substrates," Journal of Alloys and Compounds, vol. 511 no. 1, pp. 176-188, Jan. 15, 2012.

Kotadia, H. R., Mokhtari, O., Bottrill, M., Clode, M. P., Green, M. A., and Mannan, S. H., "Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates," Journal of Electronic Materials, vol. 39 no. 12, pp. 2720-2731, Dec. 2010.

Kotadia, Hiren R., Howes, Philip D., and Mannan, Samjid H., "A review: On the development of low melting temperature Pb-free solders," Microelectronics Reliability, vol. 54 no. 6-7, pp. 1253-1273, June-July 2014.

Kotadia, Hiren R., Panneerselvam, Arunkumar, Sugden, Mark W., Steen, Hector, Green, Mark, and Mannan, Samjid H., "Electronics Assembly and High Temperature Reliability Using Sn-3.8Ag-0.7Cu Solder Paste With Zn Additives," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 10, pp. 1786-1793, Oct. 2013.

Kotas, A. Betzwar, and Khatibi, G., "Isothermal bending fatigue response of solder joints in high power semiconductor test structures," Microelectronics Reliability, vol. 76-77, pp. 357-361, Sept. 2017.

Koto, Makoto, Watanabe, Masatoshi, Sugawa, Etsuko, Shimizu, Tomohiro, and Shingubara, Shoso, "Diffusion suppression in vapor-liquid-solid Si nanowire growth by a barrier layer between the Au catalyst and substrate," Journal of Crystal Growth , vol. 404, pp. 192-198, Oct. 15, 2014.

Koto, Makoto, "Growth mechanisms of vapor-liquid-solid grown nanowires: A detailed analysis of irregular nanowire formation," Journal of Crystal Growth, vol. 391, pp. 72-77, Apr. 1, 2014.

Koto, Makoto, Shimizu, Tomohiro, and Shingubara, Shoso, "Improved control of silicon nanowire growth by the vapor-liquid-solid method using a diffusion barrier layer between catalyst and substrate," Journal of Crystal Growth, vol. 369, pp. 1-7, Apr. 15, 2013.

Koto, Makoto, "Thermodynamics and kinetics of the growth mechanism of vapor-liquid-solid grown nanowires," Journal of Crystal Growth, vol. 424, pp. 49-54, Aug. 15, 2015.

Kotthaus, S., Haug, R., Schafer, H., and Hennemann, O.-D., "Current-Induced Degradation of Isotropically Conductive Adhesives," The First IEEE International Symposium on Polymeric Electronics Packaging , Oct. 26-30, 1997, pp. 64-69.

Kotthaus, Stefan, Haug, Ralf, Schafer, Helmut, and Hennemann, Otto-Diedrich, "Current-Induced Degradation of Isotropically Conductive Adhesives," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 21 no. 2, pp. 259-265, June 1998.

Kotthaus, Stefan, Gunther, Bernd H., Haug, Ralf, and Schafer, Helmut, "Study of Isotropically Conductive Bondings Filled with Aggregates of Nano-Sized Ag-Particles," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 20 no. 1, pp. 15-20, Mar. 1997.

Kou, Siwang, Yu, Shuhui, Sun, Rong, and Wong, Ching Ping, "High-dielectric-constant graphite oxide-polyimide composites as embedded dielectrics," 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 24-26, 2012, pp. 86-89.

Kou, Xiaoming, Fan, Xin, Dumas, Randy K., Lu, Qi, Zhang, Yaping, Zhu, Hao, Zhang, Xiaokai, Liu, Kai, and Xiao, John Q., "Memory Effect in Magnetic Nanowire Arrays," Advanced Materials, vol. 23 no. 11, pp. 1393-1397, Mar. 18, 2011.

Koukaras, Emmanuel N., Niaz, Shanawer, Zdetsis, Dimitrios A., and Zdetsis, Aristides D., "Theoretical study of the elasticity of ultra-thin finite silicon nanowires. I. Semiempirical model considerations," Microelectronic Engineering , vol. 90, pp. 88-91, Feb. 2012.

Koundinya, Lakshman, "Keep them handy-the rise of handheld XRF instruments," Test & Measurement World, vol. 27 no. 7, pp. xx-xx, Aug. 2007.

Kovac, Z., and Tu, K. N., "Immersion tin: Its chemistry, metallurgy, and application in electronic packaging technology," IBM Journal of Research and Development, vol. 28 no. 6, pp. 726-734, 1984.

Kovacs, William L., "An Alternate Wear Treatment to Replace Chrome Plating," Proceedings of the 20th AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 25-29, 1999, pp. 249-262.

Kovtyukhova, Nina I, and Mallouk, Thomas E., "Ultrathin Anisotropic Films Assembled from Individual Single-Walled Carbon Nanotubes and Amine Polymers," Journal of Physical Chemistry B, vol. 109 no. 7, pp. 2540-2545, Feb. 24, 2005.

Koyama, Shinji, Aoki, Yukinari, and Shohji, Ikuo, "Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and Copper," Materials Transactions, vol. 51 no. 10, pp. 1759-1763, 2010.

Koyama, Y., and Suzuki, H., "The simple hexagonal to b-Sn martensitic transition in Sn-(7.0-9.5) at.% In alloys," Acta Metallurgica, vol. 37 no. 2, pp. 597-602, Feb. 1989.

Koyano, H., Kato, M., and Uchida, M., "Electroless Tin Plating through Disproportionation," Plating & Surface Finishing, vol. 78 no. 7, pp. 68-70, 73-74, July 1991.

Koyano, Hidekatsu, "Current Situation of Lead-Free Solder Plating and Prevention of Tin Whisker," Hyomen Gijutsu (Journal of the Surface Finishing Society of Japan) , vol. 55 no. 9, pp. 586-589, Sept. 2004.

Kozak, Martin, and Vesely, Petr, "Study of Voids Inside Solder Joints Based on SAC305 Solder Paste with Different Properties," 2020 43rd International Spring Seminar on Electronics Technology, Liptovsky Mikulas, Slovakia, May 14-15, 2020, pp. xx-xx.

Koziol, Grazyna, Bukat, Krystyna, Sitek, Janusz, and Borecki, Janusz, "Performance of Immersion Tin Finish in Production of Lead Free Soldered Printed Circuit Assemblies - Some Experimental Data," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Koziol, Grazyna, and Gromek, Jozef, "Some Problems in Lead-free Assembly Process of the Miniature and Large Components on PCB," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Kpobie, W., Bonfoh, N., Dreistadt, C., Fendler, M., and Lipinski, P., "Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies," Journal of Electronic Materials , vol. 43 no. 3, pp. 671-684, Mar. 2014.

Kraemer, Frank, Wiese, Steffen, Rzepka, Sven, Faust, Wolfgang, and Lienig, Jens, "A Detailed Investigation of the Failure Formation of Copper Trace Cracks During Drop Tests," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Kraemer, Frank, Wiese, Steffen, Rzepka, Sven, and Lienig, Jens, "BGA Lifetime Prediction in JEDEC Drop Tests Accounting for Copper Trace Routing Effects," 2010 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, Bordeaux, France, Apr. 26-28, 2010, pp. xx-xx.

Kraemer, Frank, Rzepka, Sven, Wiese, Steffen, and Lienig, Jens, "The Effect of Copper Trace Routing on the Drop Test Reliability of BGA Modules," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1217-1225.

Kraeuter, Chris, and Malone, Robert, "Halt! No Lead Allowed," Forbes, vol. x no. x, pp. xx-xx, Aug. 14, 2006.

Kraft, O., Bauer, M., and Arzt, E., "Electromigration-Induced Voiding Mechanisms in Metallizations," AIP Conference Proceedings, vol. 373, pp. 131-142, 1996.

Kramer, Deborah A., "Gallium," Minerals Yearbook: Volume I. -- Metals and Minerals, 2003.

Kramer, Deborah A., "Magnesium," Minerals Yearbook: Volume I. -- Metals and Minerals, 2003.

Kramer, Frank, Rzepka, Sven, and Lienig, Jens, "Lifetime Modeling for JEDEC Drop Tests," 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, Delft, Netherlands, Apr. 26-29, 2009, pp. xx-xx.

Kramer, Ken, Nelson, Corey, and Sharan, Alok, "Microstructure and Reliability Studies of Mixed Sn-Pb and Pb-free BGA Soldering," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 892-897.

Kramer, Ken, "Microstructure and Reliability Studies of Mixed SnPb and Pb-free BGA Soldering," Medical Electronics Symposium 2014 Proceedings, Portland, OR, Sept. 18-19, 2014, pp. xx-xx.

Krammer, O., and Sinkovics, B., "Improved method for determining the shear strength of chip component solder joints," Microelectronics Reliability, vol. 50 no. 2, pp. 235-241, Feb. 2010.

Krammer, Oliver, Illes, Balazs, Batorfi, Reka, and Dusek, Karel, "Automatic characterisation method for statistical evaluation of tin whisker growth," Microelectronics Reliability, vol. 73, pp. 14-21, June 2017.

Krammer, Oliver, and Garami, Tamas, "Comparing the Intermetallic Layer Formation of Infrared and Vapour Phase Soldering," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 196-201.

Krammer, Oliver, "Comparing the reliability and intermetallic layer of solder joints prepared with infrared and vapour phase soldering," Soldering & Surface Mount Technology, vol. 26 no. 4, pp. xx-xx, 2014.

Krammer, Oliver, Hurtony, Tamas, and Hadarits, Aron, "Investigating Intermetallic Layer Growth in Innolot Solder Alloy," 2017 40th International Spring Seminar on Electronics Technology, Sofia, Bulgaria, May 10-14, 2017, pp. xx-xx.

Krammer, Oliver, Hurtony, Tamas, and Hadarits, Aron, "Investigating the Activation Energy of Intermetallic Layer Growth in SAC305 and Innolot Alloys," 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging, Constanta, Romania, Oct. 26-29, 2017, pp. 73-77.

Krammer, Oliver, and Puskas, Laszlo, "Investigating the Effect of Nitrogen Atmosphere on Lead-free Solder Wetting Angle," 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging, Timisoara, Romania, Oct. 20-23, 2011, pp. 159-162.

Krammer, Oliver, and Hurtony, Tamas, "Investigating the Fine Microstructure of Mn-doped SnAgCu Solder Alloys by Selective Electrochemical Etching," 2018 7th Electronic System-Integration Technology Conference, Dresden, Germany, Sept. 18-21, 2018, pp. xx-xx.

Krammer, Oliver, Garami, Tamas, Horvath, Barbara, Hurtony, Tamas, Medgyes, Balint, and Jakab, Laszlo, "Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders," Journal of Alloys and Compounds, vol. 634, pp. 156-162, June 15, 2015.

Krammer, Oliver, and Illes, Balazs, "Lead-Free Soldering Technology Review - Evaluating Solder Pastes and Stencils," 29th International Spring Seminar on Electronics Technology , St. Marienthal, Germany, May 10-14, 2006, pp. 86-91.

Krammer, Oliver, Sinkovics, Balint, and Illes, Balazs, "Predicting Component Self-Alignment in Lead-Free Reflow Soldering Technology by Virtue of Force Model," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 617-623.

Krammer, Oliver, and Garami, Tamas, "Reliability Investigation of Low Silver Content Micro-Alloyed SAC Solders," 2012 35th International Spring Seminar on Electronics Technology, Bad Aussee, Austria, May 9-13, 2012, pp. 149-154.

Krammer, Oliver, Sinkovics, Balint, and Illes, Balazs, "Studying the Dynamic Behaviour of Chip Components during Reflow Soldering," 30th International Spring Seminar on Electronics Technology, Cluj-Napoca, Romania, May 9-13, 2007, pp. 18-23.

Krammer, Oliver, Garami, Tamas, and Nagy, Adam, "The Effect of Cooling Rate on the Thermo-mechanical Properties of Micro-alloyed Solders," 2016 39th International Spring Seminar on Electronics Technology, Pilsen, Czech Republic, May 18-22, 2016, pp. 204-209.

Krammer, Oliver, "The Effect of Lead Free Soldering on Formation of Black Pad Failure," 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, Vienna, Austria, May 19-20, 2005, pp. 191-195.

Krastev, Evstatin, Mayes, Ian Christopher, Myat, Chan, Struwe, Armin, Zingg, Rene P., and Geelhaar, Ricardo, "Bond tester study of CSP reliability through bump analysis," Chip Scale Review, vol. 19 no. 5, pp. , Sept.-Oct. 2015.

Krastev, Evstatin, and Bernard, David, "Head-in-pillow: Identifying and highlighting suspect solder joints," Global SMT and Packaging, vol. 10 no. 3, pp. 14-16, Mar, 2010.

Krastev, Evstatin, and Bernard, David, "Real Life X-Ray Inspection for BGAs, QFNs, Counterfeit Components and 3D Packages," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 720-726.

Krastev, Evstatin, "X-Ray Imaging of Pb-Free Solder Joints," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 1, pp. 42,44,46, Jan. 2010.

Krause, Ernst, "Rundschau," Prometheus, vol. 11, pp. 701-702, 1900.

Krause, M., Marz, B., Bennemann, S., and Petzold, M., "High Resolution Analysis of Intermetallic Compounds in Microelectronic Interconnects Using Electron Backscatter Diffraction and Transmission Electron Microscopy," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 591-598.

Krause, M., Muller, M., Petzold, M., Wiese, S., and Wolter, K.-J., "Scaling Effects on Grain Size and Texture of Lead Free Interconnects - Investigations by Electron Backscatter Diffraction and Nanoindentation," 2008 Proceedings 58th Electronic Components & Technology Conference , Lake Buena Vista, FL, May 27-30, 2008, pp. 75-81.

Kraytsberg, Alexander, Seizin, Nina, and Ein-Eli, Yair, "This electrode is best served cold - a reversible electrochemical lithiation of a gray cubic tin," Journal of Solid State Electrochemistry, vol. 22 no. 10, pp. 3303-3310, Oct. 2018.

Kregting, Rene, Erinc, Muge, Kloosterman, Jan, and van Driel, Willem, "Modeling lead free solder reliability in SSL applications towards virtual design," 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Lisbon, Portugal, Apr. 16-18, 2012, pp. xx-xx.

Kriebel, F., Maizer, K., Meusel, E., and Seidowski, Th., "Electrical and Mechanical Properties of Flip Chip Connect Using Isotropic Conductive Adhesive," Proceedings of the Technical Program NEPCON West '97, Volume 2, Anaheim, CA, Feb. 23-27, 1997, pp. 618-634.

Kriebel, F., and Seidowski, Th., "Smart Labels - High Volume Applications Using Adhesive Flip-Chip-Technologies," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, Germany, Oct. 21-24, 2001, pp. 304-308.

Krikke, Jan, "Recycling e-Waste: The Sky Is the Limit," IT Professional, vol. 10 no. 1, pp. 50-55, Jan-Feb. 2008.

Kripesh, Vaidyanathan, teo, Poi-Siong, Tai, Chai Tai, Vishwanadam, Gautham, and Mui, Yew Cheong, "Development of a Lead Free Chip Scale Package for Wireless Applications," 2001 Proceedings 51st Electronic Components & Technology Conference , Orlando, FL, May 29-June 1, 2001, pp. 665-670.

Krishnan, R. Gopala, Ke, Xu, Kumar, S. Arun, Tok, Eng Soon, Raaj, G. Yaadhav, Srayes, G., and Pecht, Michael, "Investigation of Ni Magnetic Micro-Seed in SAC 305 Solder for Inductive Heating Applicability," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 2196-2202.

Krishan, R. Gopala, Ke, Xu, Kumar, S. Arun, Tok, Eng Soon, Raaj, G. Yaadhav, and Srayes, G., "Investigations on Magnetic Ni-SAC305 Solder Material System for Inductive Melt Applications," International Conference on Soldering & Reliability 2015 Proceedings, Toronto, Ontario, Canada, May 19-21, 2015, pp. xx-xx.

Krishnan, Shutesh, Wang, S. W., and Muhamad, Muhamad Rasat, "Leadframe Material, Design and Surface Treatment for MSL 1 260°C Package Robustness," 31st International Conference on Electronics Manufacturing and Technology, Kuala Lumpur, Malasia, Nov. 8-10, 2007, pp. 236-247.

Kristiansen, H., Zhang, Z. L., and Liu, J., "Characterization of Mechanical Properties of Metal-coated Polymer Spheres for Anisotropic Conductive Adhesive," IEEE/CPMT International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, CA, Mar. 16-18, 2005, pp. 209-213.

Kristiansen, H., Gronlund, T. O., and Liu, J., "Characterisation of Metal-coated Polymer Spheres and its use in Anisotropic Conductive Adhesive," Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis , Shanghai, China, June 30-July 3, 2004, pp. 259-263.

Kristiansen, Helge, Shen, Yuanliang, and Liu, Johan, "Characterisation of Mechanical Properties of Metal-coated Polymer Spheres for Anisotropic Conductive Adhesive," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, Germany, Oct. 21-24, 2001, pp. 344-348.

Kristiansen, Helge, Taklo, Maaike M. V., Bakke, Thor, Gakkestad, Jakob, Dalsjo, Per, Johannessen, Rolf, Oldervoll, Froydis, and Nguyen, Vu Hoang, "Development of Low Modulus Conductive Adhesives for MEMs Interconnects," Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb. 10-12, 2009, pp. 306-310.

Kristiansen, Helge, Redford, Keith, and Taklo, Maaike M. V., "Low Modulus Conductive Adhesives Based on Metallized Polymer Spheres," Advancing Microelectronics, vol. 36 no. 3, pp. 8-11, May/June 2009.

Kristiansen, Helge, and Liu, Johan, "Overview of Conductive Adhesive Interconnection Technologies for LCD's," The First IEEE International Symposium on Polymeric Electronics Packaging, Oct. 26-30, 1997, pp. 223-232.

Kristiansen, Helge, and Liu, Johan, "Overview of Conductive Adhesive Interconnection Technologies for LCDs," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 21 no. 2, pp. 208-214, June 1998.

Krnac, Jan, Kruzel, Robert, Pilarczyk, Jan W., and Golis, Bogdan, "Criteria of central bursting - experimental verification," Wire Journal International, vol. 39 no. 12, pp. 59-64, Dec. 2006.

Kronsbein, John, and Smart, Alan, "Electro-Plating on Wire," Transactions of the IMF, vol. 20 no. 1, pp. 31-38, 1944. https://doi.org/10.1080/00202967.1944.11869428

Kroupa, A., Dinsdale, A. T., Watson, A., Vrestal, J., V¡zdal, J., and Zemanova, A., "The Development of the COST 531 Lead-Free Solders Thermodynamic Database," JOM, vol. 59 no. 7, pp. 20-25, July 2007.

Kroupa, A., and Vizdal, J., "The Thermodynamic Database for the Development of Modern Lead-Free Solders," Diffusion and Defect Data. Pt A Defect and Diffusion Forum, vol. 263, pp. 99-104, 2007.

Kroupa, Ales, Andersson, Dag, Hoo, Nick, Pearce, Jeremy, Watson, Andrew, Dinsdale, Alan, and Mucklejohn, Stuart, "Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering," Journal of Materials Engineering and Performance, vol. 21 no. 5, pp. 629-637, May 2012.

Kroupa, Ales, Mishra, Ratikanta, Rajamohan, Divakar, Flandorfer, Hans, Watson, Andrew, and Ipser, Herbert, "Phase equilibria in the ternary Ni-Sb-Sn system: Experiments and calculations," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 45, pp. 151-166, June 2014.

Kroushi, Paul, "Non-lead PVC stabilizers for U.S. wire and cable applications," Wire Journal International, vol. 38 no. 8, pp. 77-80, Aug. 2005.

Krueger, Kristopher A., "Implications of Lead Free Products on High Reliability Systems," 9th Joint FAA/DoD/NASA Aging Aircraft Conference, Atlanta, GA, Mar. 6-9, 2006.

Kruglikov, Sergey S., Kudryavtsev, Vladimir N., Turaev, Dmitri Yu, and Kuznetsov, Vitali V., "Automatic Control of the Solution in Trivalent Chromium Plating Process," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 530-534.

Kruger, Michael, Nils, F. Nissen, and Reichl, Herbert, "Intermodulation Distortion as Indicator for Interconnect Degradation," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 477-483.

Kruger, O., Kalbe, U., Berger, W., Simon, F.-G., and Meza, S. Lopez, "Leaching experiments on the release of heavy metals and PAH from soil and waste materials," Journal of Hazardous Materials, vol. xx no. x, pp. xx-xx, xxxx.

Kruglikov, Sergey S., Kharlamov, Valery I., and Serov, Alex H., "Duplex Zinc + Zinc-Tin Alloy Coating with High Corrosion Resistance," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 676-682.

Kruglikov, Sergei S., and Kharlamov, Valeri I., "Non-uniform Microdistribution of Zinc-Nickel Alloy Electrodeposits & Its Effect on the Protective Properties of the Coatings," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 220-227.

Kruglikov, Sergei S., Kudryavtsev, Vladimir N., Turaev, Dmitri. Yu., and Kuznetsov, Vitali V., "Recent Developments in Trivalent Chromium Plating Process," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 560-566.

Kruglikov, Sergei S., Yu, Dmitri, Turaev, S. S., Kudryavtsev, Vladimir, Yarlykov, Mikhail M., and Schachameyer, Steven R., "Stabilizing of Trivalent Chromium Plating Bath by Means of Membrane Electrolysis," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. 781-787.

Krumbein, Simeon J., "Electromigration of Metallic Coatings in Electronics," Proceedings AESF SUR/FIN '96, Cleveland, OH, June 10-13, 1996, pp. 285-298.

Krumbein, Simeon J., "Metallic Electromigration Phenomena," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 11 no. 1, pp. 5-15, Mar. 1988.

Krystek, P., "IBM Environmental and Lead-Free Solder System Requirements for Purchased Electronic Components (including Restriction on Hazardous Substances RoHS)," IBM Engineering Specification 26P0381, Oct. 28, 2004.

Krystek, P. "IBM Server & Storage System's Environmental Requirements for Purchased Electronic Components, (including Restriction on Hazardous Substances RoHS)," IBM Engineering Specification 77P0594, Apr. 19, 2004.

Krystek, Paul, "Classification of Non-IC Electronic Components for Assembly Processes - J-STD-075," CARTS USA 2009 Proceedings, Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp. xx-xx.

Ksiezarek, Stanistaw, Besztak, Bronistaw, Smieszek, Zbigniew, Durst, Krzysztof, Przybysz, Andrzej, Dziemianko, Janusz, and Fryda, Stefan, "Wires from silver, silver alloys and copper alloys obtained by continuous casting," Wire Journal International, vol. 34 no. 2, pp. 82-87, Feb. 2001.

Ku, Anna, Ogunseitan, Oladele, Saphores, Jean-Daniel, Shapiro, Andrew, and Schoenung, Julie M., "Lead-Free Solders: Issues of Toxicity, Availability and Impacts of Extraction," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 47-53.

Kuan, Wei-Chih, Liang, S. W., and Chen, Chih, "Effect of bump size on current density and temperature distributions in flip-chip solder joints," Microelectronics Reliability, vol. 49 no. 5, pp. 544-550, May 2009.

Kuang, Jao-Hwa, Hsu, Chao-Ming, and Chiu, Wen-Chun, "The Variation of Shear Strength of the Lead Free Sn/3.0Ag/0.5Cu Solder Balls," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 910-913.

Kuang, Jiameng, Yang, Fan, and Huang, Mingliang, "Effect of intermetallic compound thickness on tensile behavior of Cu/Sn/Cu micro interconnects," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1286-1290.

Kuanr, Bijoy K., Veerakumar, V., Marson, R., Mishra, S. R., Kuanr, Alka V., Camley, R. E., and Celinski, Z., "Nickel Nano-Wires Filled Alumina Templates for Microwave Electronics," IEEE Transactions on Magnetics, vol. 45 no. 10, pp. 4052-4055, Oct. 2009.

Kubin, Richard, "A Common Solution for Materials Declaration," Circuits Assembly , vol. 17 no. 4, pp. 41-43, Apr. 2006.

Kubin, Richard, "A Common Solution for Materials Declaration," Printed Circuit Design and Manufacture, vol. 23 no. 4, pp. 18-19, Apr. 2006.

Kubin, Richard, "Electronic Data Exchange Standards and Technology Developments to Support Eco-Compliance," Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, New Orleans, LA, May 16-19, 2005, pp. 163-166.

Kubin, Richard, "IPC approves materials declaration standard," Green SupplyLine , Jan. 23, 2006.

Kubin, Richard, "Roadmap to compliance: The role of electronic data exchange in supporting the European union RoHS and WEEE directives," Global SMT & Packaging , vol. 5 no. 5, pp. 14-18, May 2005.

Kubin, Richard, "The Role of Electronic Data Exchange in Supporting the RoHS and WEEE Directives," Circuitnet, Feb. 20, 2005.

Kubin, Richard, and Bolinger, Nancy, "Tracking Material Composition Data," Circuits Assembly, vol. 16 no. 6, pp. 42, June 2005.

Kubin, Richard, and Bolinger, Nancy, "Tracking Material Composition Data," Printed Circuit Design and Manufacture, vol. 22 no. 6, pp. 17-18, June 2005.

Kubin, Richard, "Unstoppable," Electronics Supply & Manufacturing, May 2007.

Kubinski, J. A., Hurkmans, T., Trinh, T., Fleischer, W., and van der Kolk, G. J., "Perspective for Replacement of Hard Chromium by PVD," Plating & Surface Finishing, vol. 86 no. 10, pp. 20-25, Oct. 1999.

Kubota, Takahiro, Yoshimi, Naoto, Ando, Satoru, Matsuzaki, Akira, Yamashita, Masaaki, and Sagiyama, Masaru, "Newly Developed Chromium-free Organic-inorganic Composite Coated Steel Sheet with Excellent Corrosion Resistance," Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 11-15, 2001, pp. 397-406.

Kubota, Yuto, Shohji, Ikuo, Tsuchida, Tetsuyuki, and Nakamura, Kiyotomo, "Tensile Properties of Low-melting Point Sn-Bi-Sb Solder," 2014 IEEE 16th Electronics Packaging Technology Conference, Singapore, Dec. 3-5, 2014, pp. 788-792.

Kucera, M., "A Comparison of Electrodeposited Tin and Tin/Lead Coatings on Nickel Barrier Terminated, Multilayer Ceramic Chip Capacitors," Microelectronics International, vol. 6 no. 3, pp. 9-13, 1989.

Kuck, Peter H., "Nickel," Minerals Yearbook: Volume I. -- Metals and Minerals , 2002.

Kuckhermann, V., Thummes, G., and Mende, H. H., "On the T2 dependence of surface-induced deviations from Mathiessen's rule in copper single crystals," Journal of Physics F: Metal Physics, vol. 15 no. 6, pp. L153-L159, June 1985.

Kuczynska, M., Maniar, Y., Schafet, N., Becker, U., and Weihe, S., "Numerical Prediction of Failure in SnAgCu solder under shear and tensile-dominant cyclic loading," 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Hanover, Germany, March 24-27, 2019, pp. xx-xx.

Kuczynska, M., Schafet, N., Becker, U., Metais, B., Kabakchiev, A., Buhl, P., and Weihe, S., "The Role of Stress State and Stress Triaxiality in Lifetime Prediction of Solder Joints in Different Packages Utilized in Automotive Electronics," 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Montpelier, France, Apr. 18-20, 2016, pp. xx-xx.

Kuczynska, M., Schafet, N., Becker, U., Metais, B., Kabakchiev, A., Buhl, P., and Weihe, S., "The role of stress state and stress triaxiality in lifetime prediction of solder joints in different packages utilized in automotive electronics," Microelectronics Reliability, vol. 74, pp. 155-164, July 2017.

Kuczynska, M., Schafet, N., Becker, U., Metasch, R., Roellig, M., Kabakchiev, A., and Weihe, S., "Validation of Different SAC305 Material Models Calibrated on Isothermal Tests Using In-Situ TMF Measurement of Thermally Induced Shear Load," 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Dresden, Germany, Apr. 3-5, 2017, pp. xx-xx.

Kudo, Hidetoshi, and Fujihira, Masamichi, "DNA-Templated Copper Nanowire Fabrication by a Two-Step Process Involving Electroless Metallization," IEEE Transactions on Nanotechnology, vol. 5 no. 2, pp. 90-92, Mar. 2006.

Kudou, Takashi, and Ichimura, Makoto, "Fujitsu Group's Activities for Global and Domestic Product Recycling (PDF)," Fujitsu Scientific and Technical Journal, vol. 45 no. 1, 2009, pp. 33-40.

Kudrak, E. J., Abys, J. A., and Humiec, F., "The Impact of Substrate Roughness on Porosity: A Comparison of Electroplated Palladium, Palladium-Nickel & Cobalt Hard Gold," Plating & Surface Finishing, vol. 84 no. 1, pp. 32, 34-37, Jan. 1997.

Kudryavtsev, V. N., Tyutina, K. M., Popov, A. N., Maksimenko, S. A., and Zonin, V. A., "Electrodeposition of Tin-Based Alloys As Functional Coatings," Plating & Surface Finishing, vol. 79 no. 7, pp. 57-61, July 1992.

Kudryavtsev, V. N., Vinokurov, E. G., Schahameyer, R. R., Azarko, O. E., and Kuznetsov, V. V., "Engineering Properties of Hard Chromium Coatings Electrodeposited from Cr(III) Bath," Proceedings AESF SUR/FIN '96, Cleveland, OH, June 10-13, 1996, pp. 433-438.

Kudryavtsev, V. N., Yinokurov, E. G., and Schachameyer, S. R., "Non-Hexavalent Chromium Plating Solutions: A Russian Viewpoint," SUR/FIN '94 Technical Conference Proceedings, Indianapolis, IN, June 20-23, 1994, pp. 589-592.

Kudryavtsev, V. N., Kuznetsov, V. W., Vinokurov, E. G., Khachaturov, M. A., and Schachameyer, Steve, "Thick Chromium Electroplating from Cr(III) Bath," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. 215-224.

Kudtarkar, Santosh Anil, and Morris, James E., "Reliability of Electrically Conductive Adhesives," 2002 8th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 3-6, 2002, pp. 144-150.

Kuechenmeister, Frank, and Meusel, Ekkehard, "Polypyrrole as an Interlayer for Bonding Conductive Adhesives to Activated Aluminum Bond Pads," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 20 no. 1, pp. 9-14, Mar. 1997.

Kuehl, Reiner W., "Forward and Backward Compatibility of Lead(Pb)-Free Components," 2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.

Kuehl, Reiner W., "Pb-free components - how to design and qualify reliable products," CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. 71-80.

Kuhl, Reiner, and Mills, Sherrye, "Assuring Whisker-free Components," Surface Mount Technology (SMT) , vol. 9 no. 6, pp. 48-49, June 1995.

Kuhlkamp, Peter "Bleifreie galvanische Beschichtung von elektronischen Bauteilen unter Vermeidung der Whiskerbildung," Galvanotechnik, vol. 95 no. 9, pp. 2119-2132, Sept. 2004.

Kuhlkamp, Peter, "Lead(Pb)-Free Plating for Electronics and Avoidance of Whisker Formation," Atotech.

Kuhmann, Jochem F., Preuss, Andrea, Adolphi, Barbara, Maly, Karsten, Wirth, Thomas, Oesterle, Werner, Pittroff, Wolfgang, Weyer, Gerd, and Fanciulli, Marco, "Oxidation and Reduction Kinetics of Eutectic SnPb, InSn, and AuSn: A Knowledge Base for Fluxless Solder Bonding Applications," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C , vol. 21 no. 2, pp. 134-141, Apr. 1998.

Kuhn, A,, Chevy, A., and Lendvay, E., "Growth of GaSe Single Crystals from the Vapor Phase," Journal of Crystal Growth, vol. 13/14, pp. 380-384, May 1972.

Kujala, A., Peltola, A., Akkanen, S., and Halkola, V., "Land Grid Array Packaging Technology in Portable Electronics," Journal of SMT, vol. 15 no. 1, pp. 11-17, Apr. 2002.

Kujala, A., Reinikainen, T., and Ren, W., "Transition to Pb-free Manufacturing using Land Grid Array Packaging Technology," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 359-364.

Kukelhan, Jeff, "Copper Tin Intermetallic Crystals' Role in Formation of Microbridges Between Leads, Part I," Surface Mount Technology (SMT), vol. 25 no. 7, pp. 26-28,30,32,34,36,38-40,42, Nov. 2010.

Kukelhan, Jeff, "Copper Tin Intermetallic Crystals' Role in Formation of Microbridges Between Leads, Part II," Surface Mount Technology (SMT), vol. 25 no. 8, pp. 24-26,28,30-32,34-35, Dec. 2010.

Kulesza, Frank W., and Saunders, Thomas F., "The Significance of Glass Transition Temperature on Electrically Conductive Epoxy Resins in Hybrid Microelectronics," Proceedings of the 1979 International Microelectronics Symposium, Los Angeles, CA, Nov. 13-15, 1979, pp. 360-363.

Kulkarni, A. S., and Kulkarni, J. S., "Life extension of trivalent chromium passivation baths and enhanced product performance," Transactions of the IMF, vol. 91 no. 6, pp. 306-309, 2013. https://doi.org/10.1179/0020296713Z.000000000149

Kulojarvi, K., and Kivilahti, J. K., "A Low Temperature Interconnection Method for Electronics Assembly," The First IEEE International Symposium on Polymeric Electronics Packaging , Oct. 26-30, 1997, pp. 70-75.

Kulojarvi, Kari, and Kivilahti, Jorma K., "A Low Temperature Interconnection Method for Electronics Assembly," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 21 no. 2, pp. 288-291, June 1998.

Kulojarvi, Kari, Vuorinen, Vesa, and Kivilahti, Jorma, "Effect of dissolution and intermetallic formation on the reliability of FC joints," Microelectronics International, vol. 15 no. 2, pp. 20-24, 1998.

Kumamoto, Seishi, Sakurai, Hitoshi, Kukimoto, Youichi, and Suganuma, Katsuaki, "Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound," Journal of Electronic Materials, vol. 37 no. 6, pp. 806-814, June 2008.

Kumamoto, Seishi, Sakurai, Hitoshi, Ikeda, Kazuki, and Suganuma, Katsuaki, "Joints Soldered on Electroless Ni-Au Surfaces Using Cu-Containing Flux: Strength, Microstructure and Mechanism of Improvement," Materials Transactions, vol. 46 no. 11, pp. 2380-2385, 2005.

Kumar, A., Welzel, U., and Mittemeijer, E. J., "A method for the non-destructive analysis of gradients of mechanical stresses by X-ray diffraction measurements at fixed penetration/information depths," Journal of Applied Crystallography, vol. 39 no. 5, pp. 633-646, Oct. 2006.

Kumar, A., He, M., Chen, Z., and Teo, P. S., "Effect of electromigration on interfacial reactions between electroless Ni-P and Sn-3.5% Ag solder," Thin Solid Films, vol. 462-463, pp. 413-418, 2004.

Kumar, Aditya, Chen, Zhong, Wong, C. C., Mhaisalkar, S. G., and Kripesh, Vaidhyanathan, "Effect of Electric Current on the Mechanical Properties and Interfacial Microstructure of Ni-P/Sn-3.5Ag and Ni/Sn-3.5Ag Solder Joints," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 203-210.

Kumar, Aditya, Yang, Ying, Wong, Chee C., Kripesh, Vaidhyanathan, and Chen, Zhong, "Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations," Journal of Electronic Materials , vol. 38 no. 1, pp. 78-87, Jan. 2009.

Kumar, Aditya, and Chen, Zhong, "Effect of Ni-P Thickness on the Tensile Strength of Cu/Electroless Ni-P/Sn-3.5Ag Solder Joint," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2, Singapore, Dec. 7-9, 2005, pp. 873-878.

Kumar, Aditya, and Chen, Zhong, "Effect of Ni-P Thickness on the Tensile Strength of Cu/Electroless Ni-P/Sn-3.5Ag Solder Joint," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 4, pp. 886-892, Dec. 2006.

Kumar, Aditya, Chen, Zhong, Mhaisalkar, S. G., Wong, C. C., Teo, Poi Siong, and Kripesh, Vaidhyanathan, "Effect of Ni-P thickness on solid-state interfacial reactions between Sn-3.5Ag solder and electroless Ni-P metallization on Cu substrate," Thin Solid Films, vol. 504 no. 1-2, pp. 410-415, May 10, 2006.

Kumar, Aditya, Chen, Zhong, Wong, C. C., Mhaisalkar, S. G., and Kripesh, Vaidhyanathan, "Electric Current Induced Brittle Failure of Eutectic Lead and Lead-free Solder Joints with Electroless Ni-P Metallization," Advanced Electronic Packaging (Materials Research Society Symposium Proceedings Volume 968) , Boston, MA, Nov. 27-30, 2006, pp. xx-xx.

Kumar, Aditya, Chen, Zhong, Wong, C. C., Mhaisalkar, S. G., and Kripesh, Vaidhyanathan, "Factors Affecting the Mechanical Properties of Cu/Electroless Ni-P/Sn-3.5Ag Solder Joints," Advanced Electronic Packaging (Materials Research Society Symposium Proceedings Volume 968), Boston, MA, Nov. 27-30, 2006, pp. 117-123.

Kumar, Aditya, and Chen, Zhong, "Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint," Materials Science and Engineering: A, vol. 423 no. 1-2, pp. 175-179, May 15, 2006.

Kumar, Aditya, and Chen, Zhong, "Interdependent Intermetallic Compound Growth in an Electroless Ni-P/Sn-3.5Ag Reaction Couple," Journal of Electronic Materials, vol. 40 no. 2, pp. 213-223, Feb. 2011.

Kumar, Arvind, Karadan, Prajith, and Barshilia, Harish C., "Synthesis of silver nanowires towards the development the ultrasensitive AgNWs/SiNPLs hybrid photodetector and flexible transparent conductor," Materials Science in Semiconductor Processing, vol. 75, pp. 239-246, Mar. 1, 2018.

Kumar, B. Senthil, Danila, Bayaras Abito, Joanne, Chong Mei Hoe, Fen, Zhang Rui, Rath, Santosh Kumar, Li-San, Chan, and Jason, Wong Chin Yeung, "Enabling Cu Pillar Flip Chip Assembly with Water Soluble Lead-free Solder Paste," 2019 IEEE 21st Electronics Packaging Technology Conference , Singapore, Singapore, Dec. 4-6, 2019, pp. 733-737.

Kumar, Bharat, "The inside story," Business Line, Aug. 29, 2005.

Kumar, Duguta Suresh, Suri, Nikhil, and Khanna, P. K., "Stable interconnections for LTCC micro-heater using isothermal solidification technique," Soldering & Surface Mount Technology, vol. 30 no. 1, pp. 35-41, 2018.

Kumar, Jatinder, Sung, Won Yun, and Krishnan, Shutesh, "Effect of Product Design and Materials on Large Leadless Package Reliability," 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium, San Jose, CA, Oct. 3-5, 2007, pp. 53-57.

Kumar, K. Mohan, Kripesh, V., Shen, Lu, Zeng, Kaiyang, and Tay, Andrew A. O., "Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications," Materials Science and Engineering A, vol. 423 no. 1-2, pp. 57-63, May 15, 2006.

Kumar, K. S., Reinbold, L., Bower, A. F., and Chason, E., "Plastic deformation processes in Cu/Sn bimetallic films," Journal of Materials Research, vol. 23 no. 11, pp. 2916-2934, Nov. 2008.

Kumar, K. Mohan, Kripesh, V., and Tay, Andrew A. O., "Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders," Journal of Alloys and Compounds, vol. 450 no. n 1-2, pp. 229-237, Feb. 14, 2008.

Kumar, K. Mohan, Kripesh, V., and Tay, Andrew A. O., "Sn-Ag-Cu Lead-Free Composite Solders for Ultra-Fine-Pitch Wafer-Level Packaging," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 237-243.

Kumar, K. C. Hari, Wollants, P., and Delaey, L., "Thermodynamic Evaluation of Fe-Sn Phase Diagram," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 20 no. 2, pp. 139-149, June 1996.

Kumar, M. R., Mohan, S., and Behera, C. K., "Measurement of Activity of Indium in Liquid Bi-In-Sn Alloys by EMF Method," Journal of Electronic Materials, vol. 45 no. 8, pp. 4314-4323, Aug. 2016.

Kumar, M. R., Behera, C. K., and Mohan, S., "Measurement of Electrical Properties of Sn-Bi-In Alloys," Journal of Electronic Materials, vol. 48 no. 10, pp. 6561-6569, Oct. 2019.

Kumar, M. R., Mohan, S., and Behera, C. K., "Measurements of Mixing Enthalpy for a Lead-Free Solder Bi-In-Sn System," Journal of Electronic Materials, vol. 48 no. 12, pp. 8096-8106, Dec. 2019.

Kumar, Narinder, Kumar, Rajesh, Kumar, Sushil, and Chakarvarti, S. K., "Microstructural, optical and electrical investigations of large scale selenium nanowires prepared by template electrodeposition," Journal of Materials Science: Materials in Electronics, vol. 25 no. 8, pp. 3537-3542, Aug. 2014.

Kumar, Narinder, Kumar, Rajesh, Kumar, Sushil, and Chakarvarti, S. K., "Optical and Electrical Studies of Vertically Oriented Tellurium Nanowire Arrays Produced by Template Electrodeposition," Journal of Electronic Materials, vol. 44 no. 8, pp. 2939-2945, Aug. 2015.

Kumar, P., Huang, Z., Dutta, I., Sidhu, R., and Renavikar, M., "Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates. II: Fracture Mechanism Map," Journal of Electronic Materials, vol. 41 no. 2, pp. 412-424, Feb. 2012.

Kumar, P., Cornejo, O., Dutta, I., Subbarayan, G., and Gupta, V., "Joint Scale Dependence of Aging Kinetics in Sn-Ag-Cu Solders," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 903-909.

Kumar, P., Talenbanpour, B., Sahaym, U., Wen, C. H., and Dutta, I., "Microstructural Evolution and Some Unusual Effects During Thermo-Mechanical Cycling of Sn-Ag-Cu Alloys," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 880-887.

Kumar, P., Huang, Z., Dutta, I., Mahajan, R., Renavikar, M., and Sidhu, R., "Roles of Process and Microstructural Parameters on Mixed Mode Fracture of Sn-Ag-Cu Solder Joints under Dynamic Loading Conditions," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 389-396.

Kumar, Praveen, Dutta, I., Sarihan, V., Frear, D. R., and Renavikar, M., "Effects of Strain Rate and Aging on Deformation and Fracture of Sn-Ag-Cu Solder Joints," 11th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 28-31, 2008, pp. 660-667.

Kumar, Praveen, Huang, Zhe, Chavali, Sri Chaitra, Chan, Dennis K., Dutta, Indranath, Subbarayan, Ganesh, and Gupta, Vikas, "Microstructurally Adaptive Model for Primary and Secondary Creep of Sn-Ag-Based Solders," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 2 no. 2, pp. 256-265, Feb. 2012.

Kumar, Praveen, Pfeffer, Michael, Peranio, Nicola, Eibl, Oliver, Basler, Svenja, Reith, Heiko, and Nielsch, Kornelius, "Ternary, single-crystalline Bi2 (Te, Se)3 nanowires grown by electrodeposition," Acta Materialia, vol. 125, Feb. 15, 2017, pp. 238-245.

Kumar, R. Rakesh, Rao, K. Narasimha, and Phani, A. R., "Bismuth catalyzed growth of silicon nanowires by electron beam evaporation," Materials Letters, vol. 82, pp. 163-166, Sept. 1, 2012.

Kumar, R. Rakesh, Rao, K. Narasimha, and Phani, A. R., "Growth of silicon nanowires by electron beam evaporation using indium catalyst," Materials Letters, vol. 66 no. 1, pp. 110-112, Jan. 1, 2012.

Kumar, Sameer, and Fullenkamp, Julie, "Analysis of European Union environmental directives and producer responsibility requirements," International Journal of Services and Standards, vol. 1 no. 3, pp. 379-398, 2005.

Kumar, Sameer, and Yamaoka, Teruyuki, "Closed loop supply chains - A study of US and Japanese car industries," Human Systems Management, vol. 25 no. 1, pp. 51-70, 2006.

Kumar, Sanjeev, "Large scale synthesis of uniform Au-Co alloy and multilayer nanowires using electrochemical deposition and their characterization," Journal of Materials Science: Materials in Electronics, vol. 28 no. 5, pp. 4530-4535, Mar. 2017.

Kumar, Sanjeev, and Saini, Deepak, "Structural and magnetic characterization of electrochemically deposited Co-Cu multilayer nanowires," Journal of Materials Science: Materials in Electronics, vol. 24 no. 4, pp. 1086-1089, Apr. 2013.

Kumar, Santosh, Jung, Dohyun, and Jung, Jaepil, "High-Speed Shear Test for Low Alpha Sn-1.0%Ag-0.5%Cu (SAC-105) Solder Ball of Sub-100-um Dimension for Wafer Level Packaging," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 3, pp. 441-451, Mar. 2013.

Kumar, Santosh, Handwerker, Carol A., and Dayananda, Mysore A., "Intrinsic and Interdiffusion in Cu-Sn System," Journal of Phase Equilibria and Diffusion, vol. xx no. x, pp. xx-xx, xxxx.

Kumar, Santosh, Handwerker, Carol A., Nie, Xu, Smetana, Joseph, Love, David, Watkowski, James, Martinez, Rosa, and Parker, Richard, "Microvoid Formation at Electrodeposited Copper-Solder Interfaces During Annealing: A Systematic Study of the Root Cause," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 544-553.

Kumar, Santosh, Smetana, Joseph, Love, David, Watkowski, James, Parker, Richard, and Handwerker, Carol A., "Microvoid Formation at Solder-Copper Interfaces During Annealing: a Systematic Study of the Root Cause," Journal of Electronic Materials , vol. 40 no. 12, pp. 2415-2424, Dec. 2011.

Kumar, Santosh, Jung, Dohyun, and Jung, JaePil, "Wetting behavior and elastic properties of low alpha SAC105 and pure Sn solder," Journal of Materials Science: Materials in Electronics, vol. 24 no. 6, pp. 1748-1757, June 2013.

Kumar, Sathish, Herrick, Nicholas, Pandher, Ranjit, Ribas, Morgana, Patel, Amit, Dutt, Gyan, and Bhatkal, Ravi, "Novel Mid-Temperature Alloy for Enabling Solder Processing Temperature Hierarchy in SMT Assembly," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 827-832.

Kumar, Sathish, Kuzichkin, Oleg R., Siddiqi, Ahmed Faisal, Pustokhina, Inna, and Krasnopevtsev, Aleksandr Yu, "Reliability assessment of ball grid array joints under combined application of thermal and power cycling: solder geometry effect," Soldering & Surface Mount Technology, vol. 33 no. 1, pp. 27-33, 2021.

Kumar, Sunil, Kang, T. W., Khan, P. Yousaf, Kumar, Sanjeev, Goyal, Manju, and Choubey, Ravi Kant, "Study of electroless template synthesized ZnSe nanowires and its characterization," Journal of Materials Science: Materials in Electronics, vol. 25 no. 2, pp. 957-961, Feb. 2014.

Kumar, Suresh, Vohra, Anil, and Chakarvarti, S. K., "Erratum to: Optical studies of electrodeposited ZnCuTe ternary nanowire arrays," Journal of Materials Science: Materials in Electronics, vol. 23 no. 10, pp. 1798, Oct. 2012.

Kumar, Suresh, Vohra, Anil, and Chakarvarti, S. K., "Optical studies of electrodeposited ZnCuTe ternary nanowire arrays," Journal of Materials Science: Materials in Electronics, vol. 23 no. 10, pp. 1793-1797, Oct. 2012.

Kumar, Suresh, Kundu, Virender, Vohra, Anil, and Chakarvarti, S. K., "Synthesis and characterization of copper telluride nanowires via template-assisted dc electrodeposition route," Journal of Materials Science: Materials in Electronics, vol. 22 no. 8, pp. 995-999, Aug. 2011.

Kumar, Suresh, Vohra, Anil, and Chakarvarti, S. K., "Synthesis and morphological studies of ZnCuTe ternary nanowires via template-assisted electrodeposition technique," Journal of Materials Science: Materials in Electronics, vol. 23 no. 8, pp. 1485-1491, Aug. 2012.

Kumar, Suresh, Vohra, Anil, and Chakarvarti, S. K., "Transport properties of electrodeposited copper telluride (Cu2Te) nanowires embedded in polycarbonate track-etch membrane," Journal of Materials Science: Materials in Electronics, vol. 24 no. 2, pp. 711-719, Feb. 2013.

Kumar, Vineet, Fang, Zhigang Zak, Liang, Jin, and Dariavach Nader, "Microstructural Analysis of Lead-Free Solder Alloys," Metallurgical and Materials Transactions A, vol. 37A no. 8, pp. 2505-2514, Aug. 2006.

Kumaraguru, Swaminatha P., Ganesan, Prabhu, and Popov, Branko N., "Development of a Plating Process for Deposition of Zn-Ni-X (X=Cu, Cd, P) Alloys as a Replacement for Cadmium Coatings," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 12-23.

Kumaraguru, Swaminatha P., Veeraraghavan, Basker, Haran, Bala S., and Popov, Branko N., "Nanostructured Zn-Ni Alloys as a Replacement for Cadmium Coatings," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 543-554.

Kumaraguru, Swaminatha P., Veeraraghavan, Basker, Haran, Bala S., and Popov, Branko N., "Non-Anomalous Ni-Zn Coatings for the Corrosion Protection of Steel - As a Replacement for Cadmium Coatings," Proceedings 2003 AESF/EPA Conference for Environmental & Process Excellence, Daytona, FL, Feb. 3-7, 2003, pp. 292-303.

Kumaraguru, Swaminatha P., Veeraraghavan, Basker, Haran, Bala, Popov, Branko N., and Heimann, Bob, "Novel Non-Chrome Process for Protection of Zinc Coatings," Proceedings 2003 AESF/EPA Conference for Environmental & Process Excellence, Daytona, FL, Feb. 3-7, 2003, pp. 281-291.

Kumaraguru, Swaminatha P., and Popov, Branko N., "Novel Non Chrome Process for the Protection of Zinc Coatings," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 35-45.

Kumari, M. G. C. M., Perera, C. S., Dassanayake, B. S., Dissanayake, M. A. K. L., and Senadeera, G. K. R., "Highly efficient plasmonic dye-sensitized solar cells with silver nanowires and TiO2 nanofibres incorporated multi-layered photoanode," Electrochimica Acta, vol. 298, pp. 330-338, Mar. 1, 2019.

Kumazawa, T., and Kaminishi, K., "Deformation Evaluation of Solder Ball Joints by Electromotive Force," Applied Mechanics and Materials, vol. 13-14, pp. 233-238, July 2008.

Kumbhat, Nitesh, Choudhury, Abhishek, Raine, Melanie, Mehrotra, Gaurav, Raj, P. Markondeya, Zhang, Rongwei, Moon, Kyoung S., Chatterjee, Ritwik, Sundaram, Venky, Meyer-Berg, Georg, Wong, C. P., and Tummala, Rao R., "Highly-Reliable, 30um Pitch Copper Interconnects Using Nano-ACF/NCF," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1479-1485.

Kums, G., Duan, N., Scheer, J., van Kleef, M., Wijers, J., and Bielen, J., "Investigation of a Lead-Free Flip Chip Assembly Process," IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, San Jose, CA, July 16-18, 2003, pp. 93-98.

Kundert, Heinz, "SEMI seeks RoHS exclusion for Chip & PV Manufacturing Equipment," evertiq, Feb. 5, 2010.

Kunieda Naohiro, "Hexavealent Chrome Alternative Treatment Technology Trend on Automobile," Hyomen Gijutsu (Journal of the Surface Finishing Society of Japan) , vol. 54 no. 8, pp. 512-514, Aug. 2003.

Kunimune, Teppei, Kuramoto, Masafumi, Ogawa, Satoru, Niwa, Miki, Nogi, Masaya, and Suganuma, Katsuaki, "High-Conductivity Adhesive for Light-Emitting Diode Die-Attachment by Low-Temperature Sintering of Micrometer-Sized Ag Particles," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 6, pp. 909-915, June 2012.

Kunjomana, A. G., and Mathai, Elizabeth, "Growth and Dislocation Density of Te1-xSex Whiskers," Journal of Crystal Growth, vol. 92 no. 3-4, pp. 666-670, Oct. 2, 1988.

Kunnari, Esa, Valkama, Jani, Keskinen, Marika, and Mansikkamaki, Pauliina, "Environmental evaluation of new technology: printed electronics case study," Journal of Cleaner Production, vol. 17 no. 9, pp. 791-799, June 2009.

Kunwar, Anil, Ma, Haitao, Sun, Junhao, Qu, Lin, Li, Shuang, and Liu, Jiahui, "A Numerical Model for Diffusion Driven Gas Bubble Growth in Molten Sn-based Solder," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 602-605.

Kunwar, Anil, Shang, Shengyan, Raback, Peter, Wang, Yunpeng, Givernaud, Julien, Chen, Jun, Ma, Haitao, Song, Xueguan, and Zhao, Ning, "Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints," Microelectronics Reliability, vol. 80, pp. 55-67, Jan. 2018.

Kunwar, Anil, Givernaud, Julien, Ma, Haoran, Meng, Zhixian, Shang, Shengyan, Wang, Yunpeng, and Ma, Haitao, "Modelling the Melting of Sn0.7Cu Solder Using the Enthalpy Method," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 166-169.

Kunwar, Anil, Ma, Haoran, Ma, Haitao, Sun, Junhao, Zhao, Ning, and Huang, Mingliang, "On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient," Materials Letters , vol. 172, pp. 211-215, June 1, 2016.

Kunwar, Anil, Ma, Haoran, Ma, Haitao, Guo, Bingfeng, Meng, Zhixian, Zhao, Ning, and Huang, Mingliang, "On the thickness of Cu6Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Kunwar, Anil, Ma, Haoran, Qi, Meng, Sun, Junhao, Qu, Lin, Guo, Bingfeng, Zhao, Ning, Wang, Yunpeng, and Ma, Haitao, "Positive Feedback on Imposed Thermal Gradient by Interfacial Bubbles in Cu/liquid Sn-3.5Ag/Cu Joints," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 608-611.

Kunwar, Anil, Guo, Bingfeng, Shang, Shengyan, Raback, Peter, Wang, Yunpeng, Chen, Jun, Ma, Haitao, Song, Xueguan, and Zhao, Ning, "Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling," Intermetallics, vol. 93, pp. 186-196, Feb. 2018.

Kuo, C. Y., and Gau, C., "Vapor-solid-solid growth of crystalline silicon nanowires using anodic aluminum oxide template," Thin Solid Films, vol. 519 no. 11, pp. 3603-3607, Mar. 31, 2011.

Kuo, Chin-Hung, Hua, Hsin-Hui, Chan, Ho-Yang, Yang, Tsung-Hsun, Lin, Kuen-Song, and Ho, Cheng-En, "Interfacial reaction and mechanical reliability of PTH solder joints with different solder/surface finish combinations," Microelectronics Reliability, vol. 53 no. 12, pp. 2012-2017, Dec. 2013.

Kuo, Jian-Long, and Kuo, Chun-Cheng, "Control Factor Selection and Solder Residue Problem Study in Flip Chip Process," Advanced Materials Research, vol. 154-155, pp. 1804-1812, 2011.

Kuo, Kehsin, and Burgers, W. G., "An X-Ray Investigation of the White to Grey Transformation of Tin," Koninklijke Nederlandse Akademie van Wetenschappen, vol. B59 no. 4, pp. 288-297, 1956.

Kuo, Kuei Hsiao, Lee, Jason, Chen, Stan, Chien, F. L., Lee, Rick, and Lau, John, "Electromigration Performance of Printed Sn0.7Cu Bumps with Immersion Tin Surface Finishing for Flip Chip Applications," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 698-702.

Kuo, Shih-Ming, and Lin, Kwang-Lung, "Electromigration-Induced Void Formation at the Cu5Zn8/Solder Interface in a Cu/Sn-9Zn/Cu Sandwich," Journal of Electronic Materials, vol. 37 no. 10, pp. 1611-1617, Oct. 2008.

Kuo, Shih-Ming, and Lin, Kwang-Lung, "Microstructure evolution during electromigration between Sn-9Zn solder and Cu," Journal of Materials Research, vol. 22 no. 5, pp. 1240-1249, May 2007.

Kuo, Shih-Ming, and Lin, Kwang-Lung, "Polarity effect of electromigration on intermetallic compound formation in a Cu/Sn-9Zn/Cu sandwich," Journal of Materials Research, vol. 23 no. 4, pp. 1087-1094, Apr. 2008.

Kuo, Shih-Ming, and Lin, Kwang-Lung, "The Hillock Formation in a Cu/Sn-9Zn/Cu Lamella upon Current Stressing," Journal of Electronic Materials, vol. 36 no. 10, pp. 1378-1382, Oct. 2007.

Kuo, Yao-Ling, and Lin, Kwang-Lung, "The Kinetics of Interfacial Interaction between Eutectic Sn9Zn Solder and Nickel Plating," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 193-198.

Kuper, Christian, Peng, Weiqun, Pisch, Alexander, Goesmann, Fred, and Schmid-Fetzer, Rainer, "Phase Formation and Reaction Kinetics in the System Ti-Sn," Zeitschrift fur Metallkunde, vol. 89 no. 12, pp. 855-862, Dec. 1998.

Kupers, Hanno, Bastiman, Faebian, Luna, Esperanza, Somaschini, Claudio, and Geelhaar, Lutz, "Ga predeposition for the Ga-assisted growth of GaAs nanowire ensembles with low number density and homogeneous length," Journal of Crystal Growth , vol. 459, pp. 43-49, Feb. 1, 2017.

Kupers, Hanno, Lewis, Ryan B., and Geelhaar, Lutz, "Predictive model for the temporal evolution of the shape of GaAs nanowires," Journal of Crystal Growth, vol. 531, pp. 125320-1-125320-4, Feb. 1, 2020.

Kuramoto, Masafumi, Kunimune, Teppei, Ogawa, Satoru, Niwa, Miki, Kim, Keun-Soo, and Suganuma, Katsuaki, "Low-Temperature and Pressureless Ag-Ag Direct Bonding for Light Emitting Diode Die-Attachment," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 4, pp. 548-552, Apr. 2012.

Kurella, Anil, Pathangey, Balu, Wang, Zhiyong, and Ciarkowski, Tim, "Analysis of Corrosion Films in Printed Circuit Board Assemblies," SMTA Journal, vol. 25 no. 1, pp. 20-27, 2012.

Kurella, Anil, Munukutla, Aravind, and Lewis, J. S., "PCB related field failures with ImAg surface finishes," Proceedings of the 33rd International Symposium for Testing and Failure Analysis, San Jose, CA, Nov. 4-8, 2007, pp. 293-297.

Kurella, Anil, and Pathangey, Balu, "Study of Sulfide Films Grown on Printed Circuit Boards," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 943-947.

Kurella, Anil, and Pathangey, Balu, "Study of Sulfide Films Grown on Printed Circuit Boards," SMTA Journal , vol. 25 no. 4, pp. 32-35, 2012.

Kurnaz, Seher, and Ahrens, Thomas, "Process Window Study on Lead Free Hand Soldering of THT Joints," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics , Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Kurnoskin, G. A., Ivashkin, E. G., and Flerov, V. N., "A Citrate Electrolyte for Deposition of Tin-Bismuth Coatings," Protection of Metals (English translation of Zaschita Metallov), vol. 25 no. 4, pp. 532-533, Mar. 1990.

Kurosu, Keita, Kawamoto, Naoyuki, Murakami, Yasukazu, and Shindo, Daisuke, "TEM Study of Local Conduction Mechanisms in Model Specimens of Ag-Based Conductive Adhesive," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 2 no. 2, pp. 294-299, Feb. 2012.

Kurtz, Olaf, Kuhlkamp, Peter, Barthelmes, Jurgen, Ruther, Robert, and Neoh, D. G., "Anti-corrosion solution for reduction and prevention of corrosion whiskers," Tin World, no. 23, pp. 8-12, Summer 2008.

Kurtz, Olaf, Barthelmes, Jurgen, Kuhlkamp, Peter, Ruther, Robert, and Neoh, Ding-Ghee, "Anti-corrosion solution for reduction and prevention of corrosion whiskers," Tin World, no. 28, pp. 10-15, Autumn 2009.

Kurtz, Olaf, Barthelmes, Juergen, and Martin, Kevin, "Anti-Corrosion Solution for Reduction and Prevention of Corrosion Whiskers," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 739-744.

Kurtz, Olaf, Barthelmes, Jurgen, Kuhlkamp, Peter, Ruther, Robert, and Neoh, Ding-Ghee, "Big Grain and Flat Morphology - A New Tin Electrolyte for Minimal Whiskering and Excellent Solderability," Metal Finishing, vol. 108 no. 3, pp. 22-28, Mar. 2010. https://doi.org/10.1016/S0026-0576(10)00015-2

Kurtz, Olaf, Kuhlkamp, Peter, Barthelmes, Jurgen, and Ruther, Robert, "Reducing and Preventing Tin Corrosion Whiskers," SMT Web Exclusive Article.

Kurtz, Olaf, Wunderlich, Christian, Ruther, Robert, Neoh, Din-Ghee, and Barthelmes, Jurgen, "The Ultimate Adhesion Enhancement Process for MSL Improvement," Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb. 10-12, 2009, pp. 115-121.

Kushner, Arthur S.. "Plating Clinic," Products Finishing, vol. 66 no. 8, pp. 24-27, May 2002.

Kushner, Arthur S., "plating clinic," Products Finishing, vol. 68 no. 11, pp. 22,24-26, Aug. 2004.

Kushner, Arthur S., "Plating Clinic," Products Finishing, vol. 69 no. 11, pp. 24,26-28, Aug. 2005.

Kushner, Arthur S., "Plating Clinic," Products Finishing, vol. 71 no. 14, pp. 61-63, Nov. 2007.

Kushner, Arthur S., "Plating Clinic: Another Visit to RoHS," Products Finishing, vol. xx no. xx, pp. xx-xx, June 2005.

Kushner, Arthur S., "Plating Clinic: Cadmium and Chromium Substitutes," Products Finishing, vol. xx no. xx, pp. xx-xx, .

Kushner, Arthur S., "Plating Clinic: Tin Whiskers Again," Products Finishing, vol. 68 no. 11, pp. 22-26, Aug. 2004.

Kushner, Arthur S., "Plating Clinic: Tin Whiskers all over the Place," Products Finishing , vol. 67 no. 7, pp. p. 16-18, Apr. 2003.

Kushner, Arthur S., "Plating Clinic: Tin Whiskers Revisited," Products Finishing, vol. 71 no. 14, pp. 61-63, Nov. 2007.

Kustra, Piotr, Milenin, Andrij, Byrska-Wojcik, Dorota, Grydin, Olexandr, and Schaper, Mirko, "The process of ultra-fine wire drawing for magnesium alloy with the guaranteed restoration of ductility between passes," Journal of Materials Processing Technology, vol. 247, pp. 234-242, Sept. 2017.

Kusumastuti, R. D., Piplani, R., and Lim, G. H., "An Approach to Design Reverse Logistics Networks for Product Recovery," 2004 IEEE International Engineering Management Conference, Volume 3 , Singapore, Oct. 18-21, 2004, pp. 1239-1243.

Kutilainen, Terho, Pudas, Marko, Ashworth, Mark A., Wilcox, Geoffrey D., and Hokka, Jussi, "ALD Coatings to Mitigate Against Tin Whiskers and Upgrade the Environmental Durability of Electronic Circuit Boards," 2019 22nd European Microelectronics and Packaging Conference & Exhibition, Pisa, Italy, Sept. 16-19, 2019. pp. xx-xx.

Kutilainen, Terho, Pudas, Marko, Ashworth, Mark A., Lehto, Tero, Wu, Liang, Wilcox, Geoffrey D., Wang, Jing, Collander, Paul, and Hokka, Jussi, "Atomic Layer Deposition (ALD) to Mitigate Tin Whisker Growth and Corrosion Issues on Printed Circuit Board Assemblies," Journal of Electronic Materials, vol. 48 no. 11, pp. 7573-7584, Nov. 2019.

Kutyrev, A. E., and Andreev, Yu. Ya., "Thermodynamic Calculation of the Critical Potentials of the Selective Dissolution of Ag-Au and Cu-Au Alloys," Protection of Metals, vol. 43 no. 2, pp. 141-148, Mar. 2007.

Kuusiluoma, S., and Kiilunen, J., "The Reliability of Isotropically Conductive Adhesive as Solder Replacement - a Case Study Using LCP Substrate," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2, Singapore, Dec. 7-9, 2005, pp. 774-779.

Kuwano, Noriyuki, Jinnouchi, Atsushi, Horikami, Sadanori, Hirokado, Naruyoshi, and Sosiati, Harini, "Effects of Post-Plating Reflow on Changes in Crystal Grain Size of Sn-2 mass%Bi Alloy Plating with Thermal Cycling Treatment," Materials Transactions, vol. 51 no. 10, pp. 1741-1746, 2010.

Kuwano, Noriyuki, Horikami, Sadanori, and Linas, Marina, "Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers," Materials Science Forum, vol. 827, pp. 341-346, Aug. 2015.

Kuwano, Noriyuki, Lias, Marina binti, Nordin, Nur Azmah binti, Soejima, Youhei, and Nayan, Ahmad Rafiqan bin, "Preliminary Study on Deformation and Recrystallization Behavior of Pure Tin for Mitigation of Whisker Growth," Solid State Phenomena, vol. 273, pp. 107-111, Apr. 2018.

Kuwano, Noriyuki, Horikami, Sadanori, Maeda, Masanori, and Sosiati, Harini, "TEM and SEM Analysis for Formation Mechanism of Tin Whiskers," Advanced Materials Research, vol. 545, pp. 16-20, July 2012.

Kuzjmar, I., Lanin, V., Pasj, N., and Chmylj, A., "Galvanische Dispersionsbeschichtung elektronischer Bauteile auf Silberbasis," Galvanotechnik, vol. xx no. xx, pp. 1108-1114, May 2008.

Kuznetsov, V. I., and Tulin, V. A., "Synchronization of high-frequency vibrations of slipping phase centers in a tin whisker under microwave radiation," Journal of Experimental and Theoretical Physics, vol. 86 no. 4, pp. 745-750, Apr. 1998. doi 10.1134/1.558535

Kwak, Byung-Hyun, Jeong, Myeong-Hyeok, Kim, Jae-Won, Lee, Byunghoon, Lee, Hoo-Jeong, and Park, Young-Bae, "Correlations between interfacial reactions and bonding strengths of Cu/Sn/Cu pillar bump," Microelectronic Engineering, vol. 89, pp. 65-69, Jan. 2012.

Kwak, Byung-Hyun, Kim, Sung-Hyuk, and Park, Young-Bae, "Current Stressing Effect on Interfacial Reaction Characteristics of Cu Pillar/Sn-3.5Ag Microbumps for 3D Integration," 2011 IEEE International 3D Systems Integration Conference, Osaka, Japan, Jan. 31-Feb. 2, 2012, pp. xx-xx.

Kwak, Byung-Hyun, Kim, Jae-Myeong, Jeong, Myeong-Hyeok, Lee, Kiwook, Kim, Jaedong, and Park, Young-Bae, "Interfacial Microstructure and Mechanical Reliability of Cu Pillar/Sn-3.5Ag Bump for 3D packages," 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 7-9, 2011, pp. 49-52.

Kwak, Dongwook, Kim, Daehoon, Cho, Hoonyoung, and Yang, Woochul, "Morphological Evolution of Silicon Nanowires Grown by chemical vapor deposition," Solid State Phenomena, vol. 124-126, pp. 1201-1204, June 2007.

Kwak, Jae B., and Chung, Soonwan, "The Effects of Underfill on the Thermal Fatigue Reliability of Solder Joints in Newly Developed Flip Chip on Module," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , San Diego, CA, May 30-June 1, 2012, pp. 628-631.

Kwan, Tang Kok, DongWang, Chen, Balasubramanian, Anupama, Byrd, Kevin, PeiWang, Chen, and Sidhu, Rajen, "Feasibility Study of Low Temperature Soldering With SnBi Based Solder for a Server Product," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 550-558.

Kwan, Tang Kok, Aspandiar, Raiyo F., Chang, Wu Jin, Wang, Colin, and Xin, Wang, "Impact of Low Ag SAC Solder Pastes on BGA Solder Joint Quality," South East Asia Technical Training Conference on Electronics Assembly Technologies 2014 Proceedings, Penang, Malaysia, Apr. 8-10, 2014, pp. xx-xx.

Kwan, Tang Kok, Aspandiar, Raiyo F., Mokler, Scott, Chen, Olivia, and Jiang. Art, "SMT Soldering with Low Temperature Solder Paste," South East Asia Technical Training Conference on Electronics Assembly Technologies 2015 Proceedings, Penang, Malaysia, Apr. 14-16, 2015, pp. xx-xx.

Kwoen, Jinkwan, Watanabe, Katsuyuki, Iwamoto, Satoshi, and Arakawa, Yasuhiko, "Non-VLS growth of GaAs nanowires on silicon by a gallium pre-deposition technique," Journal of Crystal Growth, vol. 378, pp. 562-565, Sept. 1, 2013.

Kwok, R. W. M., Chan, K. C. M., and Bayes, M. W., "Development of an electroless nickel immersion gold process for PCB final finishes," Circuit World, vol. 30 no. 3, pp. 37-42, 2004.

Kwoka, Mark A., and Foster, Dawn M., "Lead Finish Comparison of Lead-Free Solders versus Eutectic Solder," Surface Mount International Conference & Exposition Proceedings of the Technical Program, San Jose, CA, Aug. 28-Sept. 1, 1994, pp. 433-436.

Kwoka, Mark A., and Foster, Dawn M., "Lead Finish Comparison of Three Lead Free Solders vs Eutectic Solder," Design & Reliability of Solders and Solder Interconnections, Orlando, FL, Feb. 10-13, 1997, pp. 117-120.

Kwon, Daeil, Azarian, Michael H., and Pecht, Michael, "Detection of Solder Joint Failure Precursors on Tin-Lead and Lead-Free Assemblies using RF Impedance Analysis," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 663-667.

Kwon, Jong Hwa, Sim, Dong Uk, Kwak, Sang Il, Yun, Jae Hoon, and Yook, Jong Gwan, "Partial EBG Placement on PDN to Effectively Suppress Simultaneous Switching Noise," Electrical Design of Advanced Packaging and Systems Symposium , Seoul, Korea, Dec. 10-12, 2008, pp. 89-92.

Kwon, Namyong, Kim, Namkyu, Sung, Sihyun, Kang, Byungyun, and Chung, Ilsub, "Characterization of vertical Si nanowire p-n diodes fabricated by metal-assisted etching and AAO templates," Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol. 30 no. 4, pp. 041810-1-041810-8, July 2012.

Kwon, S. C., Kim, M., Park, S. U., Kim, D. Y., Nam, K. S., and Choi, Y., "Characterization of intermediate Cr-C layer fabricated by electrodeposition in hexavalent and trivalent chromium baths," Surface and Coatings Technology, vol. 183 no. x, pp. 151-156, 2004.

Kwon, Sang-Hyun, Kim, Kang-Dong, Lee, Tae-Ho, Han, Deok-Gon, Sung, Tae-Hyun, Lee, Chang-Woo, and Yoo, Sehoon, "Brittle Fracture Behavior and Interfacial Reaction of Sn-Ag-Cu solders on ENIG and ENEPIG Surface Finish," 2012 IEEE 14th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 5-7, 2012, pp. 206-210.

Kwon, Sang-Hyun, Kim, Kang-Dong, Han, Deok-Gon, Sung, Tae-Hyun, Lee, Chang-Woo, and Yoo, Sehoon, "Effect of Interfacial Reaction Layer on the Brittle Fracture of the SAC305 Solder Joint on ENIG and ENEPIG Surface Finish," 2012 14th International Conference on Electronic Materials and Packaging, Hong Kong, Dec. 13-16, 2012, pp. xx-xx.

Kwon, Sang-Hyun, Kim, Kyoung-Ho, Seo, Won-Il, Park, Nam-Sun, Park, Young-Bae, Lee, Chang-Woo, and Yoo, Sehoon, "Solder Joint Properties of Sn-Ag-Cu Solders on Environmental-friendly Plasma Surface Finish," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 481-485.

Kwon, Sik-Chol, Lee, Hak-Jun, Kim, Jong-Kuk, Byon, Eungsun, Collins, George, and Short, Ken, "Plasma processing for surface modification of trivalent chromium as alternative to hexavalent chromium layer," Surface and Coatings Technology, vol. 201 no. 15, pp. 6601-6605, Apr. 23, 2007.

Kwon, Soonyong, Lee, Hoo-Jeong, and Yoo, Sehoon, "Effects of flux formulation temperature on printing and wetting properties of Sn-3.0Ag-0.5Cu solder," Journal of Materials Science: Materials in Electronics, vol. 30 no. 9, pp. 8493-8501, May 2019.

Kwon, Woon-Seong, and Paik, Kyung-Wook, "Contraction Stress Build-Up of Anisotropic Conductive Films (ACFs) for Flip-Chip Interconnection: Effect of Thermal and Mechanical Properties of ACFs," Journal of Applied Polymer Science, vol. 93 no. 6, pp. 2634-2641, Sept. 15, 2004.

Kwon, Woon-Seong, Yang, Se-Young, Lee, Soon-Bok, and Paik, Kyung-Wook, "Contraction Stresses Development of Anisotropic Conductive Films (ACFs) Flip Chip Interconnection: Prediction and Measurement," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 3, pp. 688-695, Sept. 2006.

Kwon, Woon-Seong, Ham, Suk-Jin, and Paik, Kyung-Wook, "Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study," Microelectronics Reliability, vol. 46 no. 2-4, pp. 589-599, Feb.-Apr. 2006.

Kwon, Woon-Seong, and Paik, Kyung-Wook, "Experimental Analysis of Compressive Stresses in ACF Flip Chip Joint and Its Influence on ACF Joint Reliability," Advances in Electronic Packaging 2003, Volume 1, Maui, Hawaii, July 6-11, 2003, pp. 131-136.

Kwon, Woon-Seong, and Paik, Kyung-Wook, "Experimental Analysis of Mechanical and Electrical Characteristics of Metal-Coated Conductive Spheres for Anisotropic Conductive Adhesives (ACAs) Interconnection," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 3, pp. 528-534, Sept. 2006.

Kwon, Woon-Seong, and Paik, Kyung-Wook, "Fundamental understanding of ACF conduction establishment with emphasis on the thermal and mechanical analysis," International Journal of Adhesion and Adhesives, vol. 24 no. 2 pp. 135-142, Apr. 2004.

Kwon, Woon-Seong, and Paik, Kyung-Wook, "High Current Induced Failure of ACAs Flip Chip Joint," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1130-1134.

Kwon, Woon-Seong, Kim, Hyoung-Joon, Paik, Kyung-Wook, Jang, Se-Young, and Hong, Soon-Min, "Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (CycloteneTM) Bumping Dielectrics Under Temperature Cycling," Journal of Electronic Packaging, Transactions of the ASME, vol. 126 no. 2, pp. 202-207, June 2004.

Kwon, Woon-Seong, Yang, Se-Young, Lee, Soon-Bok, and Paik, Kyung-Wook, "The Experimental and Theoretical Approaches of Contraction Stress Build-Up of Anisotropic Conductive Adhesives for Flip Chip Interconnection," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 1468-1474.

Kwon, Woon-Seong, Yim, Myung-Jin, Paik, Kyung-Wook, Ham, Suk-Jin, and Lee, Soon-Bok, "Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation," Journal of Electronic Packaging, Transactions of the ASME, vol. 127 no. 2, pp. 86-90, June 2005.

Kwon, Y. W., Luteran, A. M., Didoszak, J. M., and Kwon, A. S., "Study of Solder/Copper Interface Behavior Under Varying Strain Rates," Journal of Electronic Packaging, vol. 134 no. 3, pp. 031003-1-031003-7, Sept. 2012.

Kwon, Yong-Hyuk, Bang, Hee-Seon, and Bang, Han-Sur, "Viscoplasticity Behavior of a Solder Joint on a Drilled Cu Pillar Bump Under Thermal Cycling Using FEA," Journal of Electronic Materials, vol. 46 no. 2, pp. 833-840, Feb. 2017.

Kwon, YongHyuk, Bang, HeeSeon, Joo, SungMin, and Bang, HanSur, "Numerical analysis of thermo-mechanical characteristics of solder joint depending on change in solder junction structure of MCP," Microelectronics Reliability, vol. 55 no. 2, pp. 442-447, Feb. 2015.

Kwon, Yong-Min, Jeon, Young-Doo, Paik, Kyung-Wook, Kim, Jung-Do, and Lee, Jin-woo, "Assembly Yield Enhancement of Electroless Ni-P UBM/Pb-free Solder Joints," Proceedings of 7th Electronic Packaging Technology Conference, Volume 1, Singapore, Dec. 7-9, 2005, pp. 287-291.

Kwon, Yong-Min, and Paik, Kyung-Wook, "Effect of electoless Ni/Au UBM thickness on mechanical and electromigration relibility of Pb-free solder joints," 9th International Conference on Electronic Materials and Packaging, Daejon, Korea, Nov. 19-22, 2007, pp. xx-xx.

Kwon, Yong-min, and Paik, Kyung-Wook, "Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM," 8th International Conference on Electronic Materials and Packaging , Hong Kong, China, Dec. 11-14, 2006, pp. .

Kwon, Yong-Min, and Paik, Kyung-Wook, "Electromigration of Pb-Free Solder Flip Chip Using Electroless Ni-P/Au UBM," 2007 Proceedings 57th Electronic Components & Technology Conference , Reno, NV, May 29-June 1, 2007, pp. 1472-1477.

Kwon, Yumi, Yim, Byung-seung, Kim, Jong-min, and Kim, Jooheon, "Dispersion, hybrid interconnection and heat dissipation properties of functionalized carbon nanotubes in epoxy composites for electrically conductive adhesives (ECAs)," Microelectronics Reliability, vol. 51 no. 4, pp. 812-818, Apr. 2011.

Kyaw, Tin Tin, Tunthawiroon, Phacharaphon, Kanlayasiri, Kannachai, Yamanaka, Kenta, and Chiba, Akihiko, "A study on wettability and formation of intermetallic phase between Co-Cr-Mo alloy and Sn-Solder used as a potential under bump metallization for flip-chip packages," Intermetallics, vol. 125, pp. 106875-1-106875-10, Oct. 2020.

Kylner, Carina, and Mattsson, Lars, "An optical instrument for overall stress and local stress relaxation analysis in thin metal films," Review of Scientific Instruments, vol. 68 no. 1, pp. 143-149, Jan. 1997.

Kymin, Mark, "Reduction of Hazardous Substances Directive," About.

Kyosuke, Kobayashi, Ikuo, Shohji, and Hiroaki, Hokazono, "Tensile and Fatigue Properties of Miniature Size Specimens of Sn-5Sb Lead-Free Solder," Materials Science Forum, vol. 879, pp. 2377-2382, Nov. 2016.

LLLL

LaBennett, Richard, and Yeh, Shing, "Wafer Bumping: Fine-Pitch and Lead-Free Solder," Semiconductor International, vol. 28 no. 4, pp. 83-88, Apr. 2005.

LaBennett, Richard, and Yeh, Shing, "Wafer Bumping: Fine-Pitch and Lead-Free Solder," Semiconductor Packaging, vol. 28 no. 4, pp. SP11-12, SP14, SP16-18, Apr. 2005.

Labie, R., Limaye, P., Lee, K. W., Berry, C. J., Beyne, E., and De Wolf, I., "Reliability testing of Cu-Sn intermetallic micro-bump interconnections for 3D-device stacking," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Labie, Riet, Webers, Tomas, Beyne, Eric, Mertens, Robert P., and Humbeeck, Jan Van, "A Modified Electromigration Test Structure for Flip Chip Interconnections," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 3, pp. 508-511, Sept. 2006.

Labie, Riet, Duflos, Frederic, Vandevelde, Bart, Allaert, Bart, Lauwaert, Ralph, and Willems, Geert, "Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration," 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Toulouse, France, Apr. 15-18, 2018, pp. xx-xx.

Labie, Riet, Ratchev, Petar, and Beyne, Eric, "Comparison of a Cu-UBM versus Co-UBM for Sn Flip Chip Bumps," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 1 , Orlando, FL, May 31-June 3, 2005, pp. 449-451.

Labie, Riet, Webers, Tomas, Swinnen, Bart, and Beyne, Eric, "Electro-migration behavior of Pb-free Flip Chip Bumps," Journal of Microelectronics and Electronic Packaging, vol. 3 no. 1, pp. 32-36, 1st Quarter 2006.

Labie, Riet, Ruythooren, Wouter, and Van Humbeeck, Jan, "Solid state diffusion in Cu-Sn and Ni-Sn diffusion couples with flip-chip scale dimensions," Intermetallics, vol. 15 no. 3, pp. 396-403, Mar. 2007.

Lachapelle, Peter, "IHS addresses global environmental compliance," Green SupplyLine , Sept. 25, 2006.

Lacombe, Paul, and Berghezan, Aurel, "Relations d'orientation entre monocristaux metalliques de recristallisation et petits cristaux inclus," Metaux & Corrosion, vol. 24 no. 281, pp. 1-6, Jan. 1949.

Ladanyi, Gabor, and Gonda, Viktor, "Peridynamic Modelling of Crack Initiation and Propagation in Thermo-Mechanically Loaded Electronic Devices," 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Toulouse, France, Apr. 15-18, 2018, pp. xx-xx.

Ladani, Leila Jannesari, and Dasgupta, Abhijit, "Damage Initiation and Propagation in Voided Joints: Modeling and Experiment," Journal of Electronic Packaging, vol. 130 no. 1, pp. 011008-1-011008-11, Mar. 2008.

Ladani, Leila J., Dasgupta, Abhijit, Cardoso, Idelcio, and Monlevade, Eduardo, "Effect of Selected Process Parameters on Durability and Defects in Surface-Mount Assemblies for Portable Electronics," IEEE Transactions on Electronics Packaging Manufacturing, vol. 31 no 1, pp. 51-60, Jan. 2008.

Ladani, Leila Jannesari, and Dasgupta, Abhijit, "Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation," Journal of Electronic Packaging, vol. 129 no. 3, pp. 273-277, Sept. 2007.

Ladani, Leila J., "Failure site transition in Pb-free solder joints caused by manufacturing variabilities in BGA and MLF components in low cycle fatigue analysis," International Journal of Materials and Product Technology, vol. 37 no. 3-4, pp. 312-327, 2010.

Ladani, Leila J., and Razmi, Jafar, "IMC Growth in Solid-Liquid Interdifussion Bonds," 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June 2-5, 2010, pp. xx-xx.

Ladani, Leila J., and Razmi, Jafar, "Interaction Effect of Voids and Standoff Height on Thermomechanical Durability of BGA Solder Joints," IEEE Transactions on Device and Materials Reliability, vol. 9 no. 3, pp. 348-355, Sept. 2009.

Ladani, Leila, and Razmi, Jafar, "Mechanical Strength and Failure Characterization of Sn-Ag-Cu Intermetallic Compound Joints at the Microscale," Journal of Electronic Materials , vol. 41 no. 3, pp. 573-579, Mar. 2012.

Ladani, Leila J., and Dasgupta, A., "Partitioned Cyclic Fatigue Damage Evolution Model for Pb-Free Solder Materials," Proceedings of the ASME Pressure Vessels and Piping Conference, Volume 9, San Antonio, TX, July 22-26, 2007, pp. 119-125.

Ladani, Leila J., and Razmi, Jafar, "Probabilistic Design Approach for Cyclic Fatigue Life Prediction of Microelectronic Interconnects," IEEE Transactions on Advanced Packaging , vol. 33 no. 2, pp. 559-568, May 2010.

Ladani, Leila J., "Reliability Estimation for Large-Area Solder Joints Using Explicit Modeling of Damage," IEEE Transactions on Device and Materials Reliability , vol. 8 no. 2, pp. 375-386, June 2008.

Ladani, Leila, and Abdelhadi, Ousama, "Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation," Journal of Electronic Packaging, vol. 137 no. 1, pp. 014501-1-014501-6, Mar. 2015.

Ladani, Leila Jannesari, and Dasgupta, Abhijit, "The Successive-Initiation Modeling Strategy for Modeling Damage Progression: Application to Voided Solder Interconnects," 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Como, Italy, Apr. 24-26, 2006, pp. xx-xx.

Ladanyi, Richard, and Miklosi, Peter, "Functionality Test of End-of-Life TFT LCD Panels," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 351-355.

Laentzsch, Michael, "Theory and Practical Experience of Micro-Alloyed SnCu0.7NiGe (SN100C)," 1st Electronics Systemintegration Technology Conference, Volume 1 , Dresden, Germany, Sept. 5-7, 2006, pp. 383-386.

La Ferrara, Vera, Alfano, Brigida, Fiorentino, Giuseppe, Polichetti, Tiziana, Massera, Ettore, and Di Francia, Girolamo, "Nanopatterned platinum electrodes by focused ion beam in single palladium nanowire based devices," Microelectronic Engineering, vol. 88 no. 11, pp. 3261-3266, Nov. 2011.

La Ferrara, Vera, Alfano, Brigida, Massera, Ettore, and Di Francia, Girolamo, "Palladium Nanowires Assembly by Dielectrophoresis Investigated as Hydrogen Sensors," IEEE Transactions on Nanotechnology, vol. 7 no. 6, pp. 776-781, Nov. 2008.

Laffont, L., Lonjon, A., Dantras, E., Demont, P., and Lacabanne, C., "Optical properties of metallic nanowires by valence electron energy loss spectroscopy," Materials Letters, vol. 65 no. 23-24, pp. 3411-3414, Dec. 2011.

LaFleur, Ray, "Getting Ready to Rework Lead-free," Surface Mount Technology , vol. 18 no. 5, pp. xx-xx, May 2004.

LaFond, Anita, "RoHS Is Here - And Manufacturers Aren't Ready," Manufacturing.net, July 31, 2006.

LaFond, Anita, "RoHS Redux: What's Next?," Manufacturing.net, Nov. 20, 2006.

LaFond, Anita, "The New Order In Manufacturing: RoHS, And Beyond," Manufacturing.net, Aug. 11, 2006.

Lagsa, Earl Vincent B., "Moisture Sensitivity of Non-Hermetic Optoelectronic Surface Mount Devices," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 310-315.

Lahiri, S. K., "Absence of hillock formation in epitaxial lead films," Journal of Applied Physics, vol. 46 no. 6, pp. 2791-2793, June 1975.

Lahiri, S. K., and Wells, O. C., "Errata: Reversible Hillock Growth in Thin Films," Applied Physics Letters, vol. 16 no. 4, pp. 188, Feb. 15, 1970.

Lahiri, S. K., and Wells, O. C., "Reversible Hillock Growth in Thin Films," Applied Physics Letters , vol. 15 no. 7, pp. 234-235, Oct. 1, 1969.

Lahiri, S. K., "Stress Relief and Hillock Formation in Thin Lead Films," Journal of Applied Physics, vol. 41 no. 7, pp. 3172-3176, June 1970.

Lahtinen, Reima, and Gustafsson, Tom E., "The Driving Force Behind Whisker Growth: An investigation on what triggers this phenomenon in hot-dip galvanized zinc coating," Metal Finishing , vol. 103 no. 11, pp. 25-29, Nov. 2005.

Lahokallio, Sanna, Kiilunen, Janne, and Frisk, Laura, "Electrically Conductive Adhesives for Demanding Temperature Cycling Environment with Water Immersions," 2015 IEEE 17th Electronics Packaging and Technology Conference, Singapore, Dec. 2-4, 2015, pp. xx-xx.

Lahokallio, Sanna, and Frisk, Laura, "Performance of Electrically Conductive Adhesive Attached Sensors in High Temperature Cycling," 2014 IEEE 16th Electronics Packaging Technology Conference, Singapore, Dec. 3-5, 2014, pp. 698-703.

Lahokallio, Sanna, Parviainen, Anniina, and Frisk, Laura, "Thermal Cycling of Anisotropically Conductive Adhesive Interconnections in Demanding Sensor Applications," 2013 European Microelectronics Packaging Conference, Grenoble, France, Sept. 9-12, 2013, pp. xx-xx.

Lahokallio, Sanna, and Frisk, Laura, "Usability of ECA Materials in High Temperature Sensor Applications," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 423-429.

Lahtinen, Reima, and Gustafsson, Tom E., "SEM Investigation of Zinc Whiskers on Hot-Dip Galvanized Coatings and Bright Electroplated Coatings," Journal of Applied Surface Finishing, vol. 2 no. 1, pp. 15-19, 2007.

Lahtinen, Reima, and Gustafsson, Tom E., "The Driving Force Behind WHisker Growth," Metal Finishing, vol. 103 no. 11, pp. 25-29, Nov. 2005. https://doi.org/10.1016/S0026-0576(05)80817-7

Lahtinen, Reima, and Gustafsson, Tom E., "The Driving Force Behind Whisker Growth," Metal Finishing, vol. 103 no. 12, pp. 33-36, Dec. 2005. https://doi.org/10.1016/S0026-0576(05)80847-5

Lai, H. L., and Duh, J. G., "Lead-Free Sn-Ag and Sn-Ag-Bi Solder Powders Prepared by Mechanical Alloying," Journal of Electronic Materials, vol. 32 no. 4, pp. 215-220, Apr. 2003.

Lai, Han, "Recycle of Materials of Waste Mobile Phones," Advanced Materials Research, vol. 529, pp. 497-501, June 2012.

Lai, Huaxiang, Lu, Xiuzhen, Chen, Si, Fu, Chune, and Liu, Johan, "A Novel Isotropic Conductive Adhesive with Ag Flakes, BN and SiC Nanoparticles," International Symposium on Advanced Packaging Materials , Cambridge, England, Feb. 28-Mar. 2, 2010, pp. 49-53.

Lai, Huaxiang, Lu, Xiuzhen, Cui, Huiwang, Liu, Xiaohua, Chen, Si, Chen, Huiwang, Chen, Tianan, and Liu, Johan, "Effects of BN and SiC Nanoparticles on Properties of Conductive Adhesive," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 235-239.

Lai, Ken, Chen, Edward, Prymak, John, and Prevallet, Mike, "Impact of Lead Free Solders on MLC Flex Capabilities," Proceedings CARTS Asia 2005, Taipei, Taiwan, Oct. 11-13, 2005, pp. 171-178.

Lai, Ming-Shen, "China Cracks Down on Illegal E-waste Market," IPC Review, vol. 48 no. 7, pp. 10, Aug. 2007.

Lai, Qingquan, Zhang, Lei, Chen, Cai, and Shang, J. K., "Tunable Reactive Wetting of Sn on Microporous Cu Layer," Journal of Materials Science and Technology, vol. 28 no. 4, pp. 379-384, Apr. 2012.

Lai, R. S., Lin, K. L., and Salam, B., "Effect of Ag content on wetting properties and solidus temperature of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free solders," Soldering & Surface Mount Technology, vol. 20 no. 1, pp. 22-26, 2008.

Lai, R. S., Lin, K. L., and Salam, B., "Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints," Journal of Electronic Materials, vol. 38 no. 1, pp. 88-92, Jan. 2009.

Lai, Wei-Han, Shen, Han-Ting, and Wang, Chao-Hong, "Interactions between Sn and Cu substrate with various surface finishes," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Lai, Willetta, Wong, P. S., Hsu, K. L., Chan, C. M., Chan, C. Y., Bayes, M. W., and Yee, K. W., "Development of Novel Electroless Nickel for Selective Electroless Nickel Immersion Gold Applications," 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 24-26, 2012, pp. 80-85.

Lai, Y. T., and Liu, C. Y., "Study of Wetting Reaction between Eutectic AuSn and Au Foil," Journal of Electronic Materials, vol. 35 no. 1, pp. 28-34, Jan. 2006.

Lai, Y. T., and Liu, C. Y., "Study of Wetting Reaction Between Eutectic AuSn and Au Foil," Journal of Electronic Materials, vol. 35 no. 2, pp. 353-359, Feb. 2006.

Lai, Yanqing, Hu, Xiaowu, Li, Yulong, and Jiang, Xiongxin, "Interfacial microstructure evolution and shear strength of Sn0.7Cu-xNi/Cu solder joints," Journal of Materials Science: Materials in Electronics , vol. 29 no. 13, pp. 11314-11324, July 2018.

Lai, Yi-Shao, Song, Jenn-Ming, Chang, Hsiao-Chuan, and Chiu, Ying-Ta, "Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints," Journal of Electronic Materials, vol. 37 no. 2, pp. 201-209, Feb. 2008.

Lai, Yi-Shao, Chang, Hsiao-Chuan, Chiu, Ying-Ta, Yeh, Chang-Lin, and Song, Jenn-Ming, "Ball Impact Responses of Sn-Ag-Cu Solder Joints Doped with Ni or Ge," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 197-201.

Lai, Yi-Shao, Chang, Hsiao-Chuan, and Yeh, Chang-Lin, "Ball Impact Responses of Wafer-level Chip-scale Packages," International Microsystems, Packaging, Assembly Conference Taiwan, Taipei, Taiwan, Oct. 18-20, 2006, pp. xx-xx.

Lai, Yi-Shao, Song, Jenn-Ming, Chang, Hsiao-Chuan, and Chiu, Ying-Ta, "Characterizations of Ball Impact Responses of Tin-Silver-Copper Solder Joints Doped with Nickel or Germanium," 2007 ASME International Mechanical Engineering Conference and Exposition, Volume 5, Seattle, WA, Nov. 11-15, 2007, pp. 305-311.

Lai, Yi-Shao, Kao, C. R., Chang, Hsiao-Chuan, and Kao, Chin-Li, "Effect of multiple reflow cycles on ball impact responses of Sn-Ag-Cu solder joints," Soldering & Surface Mount Technology, vol. 21 no. 3, pp. 4-9, 2009.

Lai, Yi-Shao, Lee, Chiu-Wen, and Kao, Chin-Li, "Effect of Test Conditions on Electromigration Reliability of Sn-Ag-Cu Flip-Chip Solder Interconnects," Journal of Electronic Packaging, vol. 129 no. 1, pp. 56-62, Mar. 2007.

Lai, Yi-Shao, Yang, Po-Chuan, and Yeh, Chang-Lin, "Effects of different drop test conditions on board-level reliability of chip-scale packages," Microelectronics Reliability, vol. 48 no. 2, pp. 274-281, Feb. 2008.

Lai, Yi-Shao, Lee, Chiu-Wen, Chiu, Ying-Ta, and Shao, Yu-Hsiu, "Electromigration of 96.5Sn-3Ag-0.5Cu Flip-chip Solder Bumps Bonded on Substrate Pads of Au/Ni/Cu or Cu Metallization," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 641-645.

Lai, Yi-Shao, Chen, Kuo-Ming, Kao, Chin-Li, Lee, Chiu-Wen, and Chiu, Ying-Ta, "Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy," Microelectronics Reliability, vol. 47 no. 8, pp. 1273-1279, Aug. 2007.

Lai, Yi-Shao, Chiu, Ying-Ta, Lee, Chiu-Wen, Shao, Yu-Hsiu, and Chen, Jiunn, "Electromigration Reliability and Morphologies of Cu Pillar Flip-chip Solder Joints," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 330-335.

Lai, Yi-Shao, Chiu, Ying-Ta, and Chen, Jiunn, "Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization," Journal of Electronic Materials, vol. 37 no. 10, pp. 1624-1630, Oct. 2008.

Lai, Yi-Shao, Chiu, Ying-Ta, and Lee, Chiu-Wen, "Electromigration Reliability of 96.5Sn-3Ag-0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad Metallization," Journal of Electronic Packaging, vol. 131 no. 2, pp. 021002-1-021002-5, June 2009.

Lai, Yi-Shao, Chen, Kuo-Ming, Lee, Chiu-Wen, Kaoi, Chin-Li, and Shao, Yu-Hsiu, "Electromigration Reliability of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu Composite Flip-chip Solder Bumps with Ti/Ni(V)/Cu Under Bump Metallurgy," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2, Singapore, Dec. 7-9, 2005, pp. 786-791.

Lai, Yi-Shao, and Song, Jenn-Ming, "Electromigration Reliability with Respect to Cu Content in Solder Joint System," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1160-1163.

Lai, Yi-Shao, and Chiu, Ying-Ta, "Electromigration Reliability With Respect to Cu Weight Contents of Sn-Ag-Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing," Journal of Electronic Packaging, vol. 130 no. 4, pp. 041001-1-041001-5, Dec. 2008.

Lai, Yi-Shao, Chang, Hsiao-Chuan, and Yeh, Chang-Lin, "Evaluation of solder joint strengths under ball impact test," Microelectronics Reliability, vol. 47 no. 12, pp. 2179-2187, Dec. 2007.

Lai, Yi-Shao, Yang, Ping-Feng, and Yeh, Chang-Lin, "Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition," Microelectronics Reliability , vol. 46 no. 2-4, pp. 645-650, Feb.-Apr. 2006.

Lai, Yi-Shao, and Chiu, Ying-Ta, "Failure Mechanism of Sn-Ag-Cu Flip-chip Solder Joints with Different Cu Weight Contents Under Comparatively Low Current Stressing," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1462-1466.

Lai, Yi-Shao, Yang, Ping-Feng, and Jian, Sheng-Rui, "Identifications of Nanomechanical Properties of Cu-Sn Crystalline Phases," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 105-108.

Lai, Yi-Shao, Tong, Ho-Ming, and Tu, King-Ning, "Recent research advances in Pb-free solders," Microelectronics Reliability, vol. 49 no. 3, pp. 221-222, Mar. 2009.

Lai, Yi-Shao, Chen, P. C., Yeh, Chang-Lin, and Lee, Jeffrey C. B., "The Effect of IMC Microstructure of Solder Joint on the Mechanical Drop Performance in SnxAgCu and SnAgCuX CSP Package," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1935-1939.

Lai, Zhongmin, Kong, Xinda, You, Qingrong, and Ca, Xiubin, "Microstructure and mechanical properties of Co/Sn-10Bi couple and Co/Sn-10Bi/Co joint," Microelectronics Reliability, vol. 68, pp. 69-76, Jan. 2017.

Lai, Zhongmin, and Ye, Dan, "Microstructure and Properties of Sn-10Bi-xCu Solder Alloy/Joint," Journal of Electronic Materials, vol. 45 no. 7, pp. 3702-3711, July 2016.

Lai, Zonghe, and Liu, Johan, "Anisotropically Conductive Adhesive Flip-Chip Bonding on Rigid and Flexible Printed Circuit Substrates," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, vol. 19 no. 3, pp. 644-660, Aug. 1996.

Lai, Zonghe, Lai, Ruoyin, Persson, Katrin, and Liu, Johan, "Effect of Bump Height on the Reliability of ACA Flip Chip Joining with FR4 Rigid and Polyimide Flexible Substrate," Journal of Electronics Manufacturing, vol. 8 no. 3&4, pp. 217-224, Dec. 1998.

Lai, Zhongmin, and Ye, Dan, "Effect of Al on the microstructure and properties of Sn-0.7Cu solder alloy," Journal of Materials Science: Materials in Electronics, vol. 27 no. 2, pp. 1177-1183, Feb. 2016.

Lai, Zhongmin, and Ye, Dan, "Effect of cooling method and aging treatment on the microstructure and mechanical properties of Sn-10Bi solder alloy," Journal of Materials Science: Materials in Electronics, vol. 27 no. 2, pp. 1398-1407, Feb. 2016.

Lai, Zhongmin, Kong, Xinda, and You, Qingrong, "Effect of electron flow on the microstructure and mechanical property of Cu/Sn-30Bi/Cu solder joint," Journal of Materials Science: Materials in Electronics, vol. 28 no. 5, pp. 4506-4512, Mar. 2017.

Lai, Zhongmin, and Ye, Dan, "Microstructure and fracture behavior of non eutectic Sn-Bi solder alloys," Journal of Materials Science: Materials in Electronics, vol. 27 no. 4, pp. 3182-3192, Apr. 2016.

Laik, Barbara, Eude, Laurent, Pereira-Ramos, Jean-Pierre, Cojocaru, Costel Sorin, Pribat, Didier, and Rouviere, Emmanuelle, "Silicon nanowires as negative electrode for lithium-ion microbatteries," Electrochimica Acta, vol. 53 no. 17, pp. 5528-5532, July 1, 2008. https://doi.org/10.1016/j.electacta.2008.02.114

Laine, Eric, Ruhmer, Klaus, Perfecto, Eric, Longworth, Hai, and Hawken, David, "C4NP as a High-Volume Manufacturing Method for Fine-Pitch and Lead-Free FlipChip Solder Bumping," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 518-524.

Laine, Eric, Ruhmer, Klaus, Belanger, Luc, Turgeon, Michel, Perfecto, Eric, Longworth, Hai, and Hawken, David, "C4NP - Lead Free Flip Chip Solder Bumping Manufacturing and Reliability Data," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Laine, Eric, Perfecto, Eric, Campbell, Barrie, Wood, James, Busby, James, Garant, John, and Guerin, Luc, "C4NP Technology for Lead Free Solder Bumping," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1320-1325.

Laine, Eric, and Ruhmer, Klaus, "Cost, production, and logistics implications of C4NP solder bumping," Solid State Technology, vol. 50 no. 1, pp. 28,30, Jan. 2007.

Laine, Eric, Ruhmer, Klaus, Perfecto, Eric, Longworth, Hai, and Hawken, David, "Lead Free Solder Bump manufacturing with IBM's C4NP process," Proceedings of the 2006 IEEE CPMT Conference on High Density Microsystem Design, Packaging and Component Failure Analysis, Shanghai, June 27-28, 2006, pp. 292-297.

Laine-Ylijoki, Tommi, Steen, Hector, and Forsten, Atso, "Development and Validation of a Lead-Free Alloy for Solder Paste Applications," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C, vol. 20 no. 3, pp. 194-198, July 1997.

Lajoie, Hank, and Trainor, James, "Immersion Gold: Why More Is Not Better," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 918-923.

Lajoie, Hank, "The Development and Implementation of an Improved Immersion Tin Plating Process Tin-Lead and Lead-Free Soldering," SMTA International Conference , San Diego, CA, Oct. 4-8, 2009, pp. 847-853.

Lajvardi, M., Eshghi, H., Ghazi, M. E., Izadifard, M., and Goodarzi, A., "Structural and optical properties of silicon nanowires synthesized by Ag-assisted chemical etching," Materials Science in Semiconductor Processing, vol. 40, pp. 556-563, Dec. 2015.

Lakhkar, Nikhil, Viswanadham, Puligandia, and Agonafer, Dereje, "Effect of Structural Design Parameters on Wafer Level CSP Ball Shear Strength and Their Influence on Accelerated Thermal Cycling Reliability," Proceedings of the ASME International Mechanical Engineering Congress & Exposition, Volume 5: Electronics and Photonics, Lake Buena Vista, FL, Nov. 13-19, 2009, pp. 239-249.

Lakhkar, Nikhil, and Agonafer, Dereje, "Effect of Structural Design Parameters on Wafer Level CSP Ball Shear Strength: Experimental and Computational," SMTA International Conference , San Diego, CA, Oct. 4-8, 2009, pp. 74-82.

Lakhkar, Nikhil, Hossain, Mohammad M., Viswanadham, Puligandia, and Agonater, Dereje, "Mechanical Characterization of Sn-Ag-Cu Solder with Gold Addition Under Tensile Loading," Proceedings of the ASME InterPack Conference, Volume 1 , Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 557-562.

Lakin, Margo, "What's in a Name?," Printed Circuit Design and Fab, vol. 25 no. 12, pp. 38-39, Dec. 2008.

Lal, Anand, Bradley, Edwin, and Sharda, Jignesh, "Effect of Reflow Profiles on the Board Level Drop Reliability of Pb-Free (SnAgCu) BGA Assemblies," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 945-953.

Lal, Anand, and Bradley, Edwin, "Relationship of Tensile Interfacial Strength to Lead-free BGA Impact Performance," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1628-1633.

Lal, K., Peneva, S. K., and Verma, A. R., "A Systematic Study of Lattice Imperfections in Metal Whiskers by Laue Method," Physica Status Solidi (a), vol. 3 no. 3, pp. 617-628, 1970. https://doi-org.ezproxy.uky.edu/10.1002/pssa.19700030307

Lal, Sudarshan, "Corrosion Behavior of Electroless Nickel Coatings in Concentrated Salt Solutions," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Lal, Sudarshan, "Corrosion Studies of Metallic Finishes in Electronics," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. 549-560.

Lal, Sudarshan, "Lead-free Coatings in High Speed Electronic Connectors," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 326-341.

Lal, Sudarshan, Kopec, James A., and Angeli, Stephen R., "Lead-free Coatings in High Speed Electronic Connectors," Plating & Surface Finishing, vol, 90 no. 9, pp. 43-51, Sept. 2003.

Lal, Sudarshan, and Moyer, Thomas D., "Making the Lead-free Transition: The Enigma of Tin Whiskers in Connector Applications," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 234-253.

Lal, Sudarshan, and Moyer, Thomas D., "Role of Intrinsic Stresses in the Phenomena of Tin Whiskers in Electrical Connectors," IEEE Transactions on Electronics Packaging Manufacturing," ,vol. 28 no. 1, pp. 63-74, Jan. 2005.

Lal, Sudarshan, "Tin Whiskers: Their Appearance & Minimization In Electronic Connectors," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 267-288.

Lalena, J. N., Weiser, M. W., and Dean, "Calculation of phase diagrams for lead-free power IC die attach," Advanced Packaging, vol. xx no. xx, pp. xx-xx, Feb. 2002.

Lalena, John N., Dean, Nancy F., and Weiser, Martin W., "Experimental Investigation of Ge-Doped Bi-11Ag as a New Pb-Free Solder Alloy for Power Die Attachment," Journal of Electronic Materials, vol. 31 no. 11, pp. 1244-1249, Nov. 2002.

Lall, Pradeep, and Limaye, Geeta, "A Methodology for High Cycle Fatigue Characterization of Lead-free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration," Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 1, Burlingame, CA, July 16-18, 2013, pp. V001T04A017-1-V001T04A017-17.

Lall, Pradeep, Mirza, Kazi, and Suhling, Jeff, "A Study on the Effect of Aging on Thermal Cycling Reliability of Sn-Ag-Cu Interconnects Using Digital Image Correlation," 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 31-June 3, 2016, pp. 519-529.

Lall, Pradeep, Hande, Madhura, Bhat, Chandan, More, Vikrant, Vaidya, Rahul, and Suhling, Jeff, "Algorithms for Prognostication of Prior Damage and Residual Life in Lead-Free Electronics Subjected to Thermo-mechanical Loads," 11th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , Orlando, FL, May 28-31, 2008, pp. 638-651.

Lall, Pradeep, Yadav, Vikas, Suhling, Jeff, and Locker, David, "Anand Parameters for Modeling Prolonged Storage on High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder at High Operating Temperature," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 448-459.

Lall, Pradeep, Vaidya, Rahul, More, Vikrant, and Goebel, Kai, "Assessment of Accrued Damage and Remaining Useful Life in Leadfree Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 4, pp. 634-649, Apr. 2012.

Lall, Pradeep, Vaidya, Rahul, More, Vikrant, Suhling, Jeff, and Goebel, Kai, "Assessment of Accrued Thermo-mechanical Damage in Leadfree Parts During Field-Exposure to Multiple Environments," 2009 AIMS Harsh Environments Electronics Symposium, San Diego, CA, Oct. 5-6, 2009, pp. 907-919.

Lall, Pradeep, Vaidya, Rahul, More, Vikrant, and Goebel, Kai, "Assessment of Accrued Thermo-Mechanical Damage in Leadfree Parts During Field-Exposure to Multiple Environments," SMTA Journal, vol. 23 no. 2, pp. 11-24, 2010.

Lall, Pradeep, Vaidya, Rahul, More, Vikrant, Goebel, Kai, and Suhling, Jeff, "Assessment of Residual Damage in Leadfree Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 206-218.

Lall, Pradeep, and Mirza, Kazi, "Assessment of the Effect of Mean Temperature on Thermal Cycling Reliability of SAC Solder Joints Using Leading Indicators of Failure," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 373-387.

Lall, Pradeep, and Mirza, Kazi, "Assessment of the Effect of Mean Temperature on Thermal Cycling Reliability of SAC Solder Joints using Leading Indicators of Failure," SMTAnews & Journal of Surface Mount Technology, vol. 28 no. 4, pp. 28-42, Oct.-Dec. 2015.

Lall, Pradeep, Shantaram, Sandeep, Kulkarni, Mandar, Limaye, Geeta, and Suhling, Jeff, "Constitutive Behavior of SAC Leadfree Alloys at High Strain Rates," Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, Volume 1, Portland, OR, July 6-8, 2011, pp. 519-536.

Lall, Pradeep, Shantaram, Sandeep, Angral, Arjun, Kulkarni, Mandar, and Suhling, Jeff, "Damage Accumulation and Life-Prediction Models for SnAgCe Leadfree Electronics under Shock-Impact," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 887-901.

Lall, Pradeep, Mirza, Kazi, Harsha, Mahendra, Suhling, Jeff, and Goebel, Kai, "Damage Pre-Cursor Based Assessment of Impact of High Temperature Storage on Reliability of Leadfree Electronics," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 817-826.

Lall, Pradeep, Mirza, Kazi, and Suhling, Jeff, "Damage Pre-Cursor Based Life Prediction of the Effect of Mean Temperature of Thermal Cycle on the SnAgCu Solder Joint Reliability," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 990-1003.

Lall, Pradeep, Singh, Naveen, Strickland, Mark, Blanche, Jim, and Suhling, Jeff, "Decision-Support Models for Thermo-Mechanical Reliability of Leadfree Flip-Chip Electronics in Extreme Environments," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 127-136.

Lall, Pradeep, Iyengar, Deepti, Shantaram, Sandeep, Pandher, Ranjit, Panchagade, Dhananjay, and Suhling, Jeff, "Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Leadfree Packaging Architectures under Shock and Vibration," 2008 Proceedings 58th Electronic Components & Technology Conference , Lake Buena Vista, FL, May 27-30, 2008, pp. 1036-1047.

Lall, Pradeep, Iyengar, Deepti, Shantaram, Sandeep, Pandher, Ranjit, and Panchagade, Dhananjay, "Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Lead-free Packaging Architectures Under Shock and Vibration," IEEE Transactions on Electronics Packaging Manufacturing, vol. 32 no. 4, pp. 311-324, Oct. 2009.

Lall, Pradeep, Iyengar, Deepti, Shantaram, Sandeep, Panchagade, Dhananjay, and Suhling, Jeff, "Development of Survivability Envelopes for SnAg Leadfree Packaging Architecures under Shock and Vibration," 11th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 28-31, 2008, pp. 822-835.

Lall, Pradeep, Kulkarni, Mandar, Angral, Arjun, Panchagade, Dhananjay, and Suhling, Jeff, "Digital-Image Correlation and XFEM Based Shock-Reliability Models for Leadfree and Advanced Interconnects," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 91-105.

Lall, Pradeep, Mehta, Vishal, Suhling, Jeff, and Blecker, Ken, "Effect of 100°C Aging for Periods of up to 120-days on High Strain Rate Properties of SAC305 Alloys," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 1051-1064.

Lall, Pradeep, Shantaram, Sandeep, Suhling, Jeff, and Locker, Dave, "Effect of Aging on the High Strain Rate Mechanical Properties of SAC105 and SAC305 Leadfree Alloys," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 1277-1293.

Lall, Pradeep, Yadav, Vikas, Zhang, Di, Kinyanjui, Robert, Palmer, Brad, and Jangula, Jesse, "Effect of Alloy Composition and Aging On the Survivability of Leadfree Solders In High Temperature Vibration in Automotive Environments," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 438-452.

Lall, Pradeep, Mehta, Vishal, Suhling, Jeff, and Blecker, Ken, "Effect of Elevated Storage Temperature on the High Strain Rate Mechanical Properties of SAC305 Solder," 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 28-31, 2019, pp. 595-606.

Lall, Pradeep, Shantaram, Sandeep, Suhling, Jeff, and Locker, Dave, "Effect of High Strain-Rate on Mechanical Properties of SAC105 and SAC305 Leadfree Alloys," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 1312-1326.

Lall, Pradeep, Limaye, Geeta, Shantaram, Sandeep, and Suhling, Jeff, "Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot," Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 1, Burlingame, CA, July 16-18, 2013, pp. V001T05A012-1-V001T05A012-13.

Lall, Pradeep, Mirza, Kazi, Suhling, Jeff, and Locker, David, "Effect of Mean Temperature on the Evolution of Strain-Amplitude in SAC Ball-Grid Arrays During Operation Under Thermal Aging and Temperature Excursions," 2017 IEEE 67th Electronic Components and Technology Conference, Orlando, FL, May 30-June 2, 2017, pp. 1027-1038.

Lall, Pradeep, Yadav, Vikas, Suhling, Jeff, and Locker, David, "Effect of Prolonged Storage on High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder at High Operating Temperature," 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29-June 1, 2018, pp. 1296-1308.

Lall, Pradeep, Yadav, Vikas, Suhling, Jeff, and Locker, David, "Effect of Prolonged Storage up to 1-year on Anand Parameters for SAC105 Leadfree Alloys," 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 28-31, 2019, pp. 303-318.

Lall, Pradeep, Zhang, Di, Yadav, Vikas, Suhling, Jeff, and Locker, David, "Effect of Prolonged Storage up to 1-year on the High Strain Rate Properties of SAC Leadfree Alloys at Operating Temperatures up to 200°C," 2017 IEEE 67th Electronic Components and Technology Conference, Orlando, FL, May 30-June 2, 2017, pp. 1219-1230.

Lall, Pradeep, Yadav, Vikas, Suhling, Jeff, and Locker, David, "Effect of Storage on High Strain Rate Mechanical Properties of SAC105 at Operating Temperature up to 200°C," 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , Orlando, FL, May 30-June 2, 2017, pp. 1433-1446.

Lall, Pradeep, Zhang, Di, Yadav, Vikas, Suhling, Jeff, and Locker, David, "Effect of Temperature on the High Strain Rate Properties of SAC Leadfree Alloys at Temperatures up to 200°C," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 1924-1932.

Lall, Pradeep, Yadav, Vikas, Suhling, Jeff, and Locker, David, "Effect of Thermal Aging on the Evolution of Anand Parameters for SAC105 Leadfree Alloys Operating at Cold Temperatures down to -55 °C," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 1106-1120.

Lall, Pradeep, and Kothari, Nakul, "Effect of Voids on Thermo-Mechanical Reliability of QFN Solder Joints," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 1255-1263.

Lall, Pradeep, Yadav, Vikas, Suhling, Jeff, and Locker, David, "Evolution of Anand Parameters for SAC-Q Solder Alloy after Prolonged Storage up to 1-Year at High Strain Rate at Very High Operating Temperature," 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 28-31, 2019, pp. 607-620.

Lall, Pradeep, Saha, Mrinmoy, Suhling, Jeff, and Blecker, Ken, "Evolution of High Strain Rate Mechanical Properties of SAC-R with High Temperature Storage at 50°C with High and Low Operating-Temperatures," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 993-1000.

Lall, Pradeep, Shantaram, Sandeep, Angral, Arjun, and Kulkarni, Mandar, "Explicit Submodeling and Digital Image Correlation Based Life-Prediction of Leadfree Electronics under Shock-Impact," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 542-555.

Lall, Pradeep, Yadav, Vikas, Mehta, Vishal, Suhling, Jeff, and Blecker, Ken, "Extreme Cold-Temperature High-Strain Rate Properties of SAC Solder Alloys," 2020 IEEE 70th Electronic Components and Technology Conference, Lake Buena Vista, AL, May 26-29, 2020, pp. 782-792.

Lall, Pradeep, Panchagade, Dhananjay R., Choudhary, Prakriri, Gupte, Sameep, and Suhling, Jeffrey C., "Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 1, pp. 104-113, Mar. 2008.

Lall, Pradeep, Hande, Madhura, Bhat, Chandan, Islam, Nokibul, Suhling, Jeff, and Lee, Jay, "Feature Extraction and Damage-Precursors for Prognostication of Lead-Free Electronics," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 718-727.

Lall, Pradeep, Hande, Madhura, Bhat, Chandan, Islam, Nokibul, Suhling, Jeff, and Lee, Jay, "Feature extraction and damage-precursors for prognostication of lead-free electronics," Microelectronics Reliability, vol. 47 no. 12, pp. 1907-1920, Dec. 2007.

Lall, Pradeep, Thomas, Tony, and Suhling, Jeff, "Feature Extraction and RUL Prediction of SAC Solder Alloy Packages by Different Statistical and Time-frequency Analysis Techniques under Simultaneous Temperature-Vibration Loads," 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , San Diego, CA, May 29-June 1, 2018, pp. 1270-1279.

Lall, Pradeep, Thomas, Tony, and Blecker, Ken, "Health Monitoring and Feature Vector Identification of Failure for SAC305 Solder PCB's under Shock Loads up to 10,000g," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 932-944.

Lall, Pradeep, Lowe, Ryan, and Goebel, Kai, "Health Monitoring of Leadfree Electronics under Mechanical Shock and Vibration with Particle Filter Based Resistance Spectroscopy," SMTA Journal, vol. 24 no. 4, pp. 19-32, 2011.

Lall, Pradeep, Panchagade, Dhananjay, Iyengar, Deepti, Shantaram, Sandeep, Suhling, Jeff, and Schrier, Hubert, "High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 924-939.

Lall, Pradeep, Panchagade, Dhananjay R., Iyengar, Deepti, Shantaram, Sandeep, and Schrier, Hubert, "High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics," IEEE Transactions on Components and Packaging Technologies , vol. 32 no. 2, pp. 378-395, June 2009.

Lall, Pradeep, Zhang, Di, Yadav, Vikas, and Locker, David, "High Strain-Rate Constitutive Behavior of SAC105 and SAC305 Leadfree Solder During Operation at High Temperature," 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Budapest, Hungary, Apr. 19-22, 2015, pp. xx-xx.

Lall, Pradeep, Zhang, Di, Yadav, Vikas, and Locker, David, "High strain rate constitutive behavior of SAC105 and SAC305 leadfree solder during operation at high temperature," Microelectronics Reliability , vol. 62, pp. 4-17, July 2016.

Lall, Pradeep, Yadav, Vikas, Suhling, Jeff, and Locker, David, "High Strain Rate Mechanical Behavior of SAC-Q Solder," 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 30-June 2, 2017, pp. 1447-1455.

Lall, Pradeep, Yadav, Vikas, Zhang, Di, Suhling, Jeff, and Shantaram, Sandeep, "High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures," 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 27-30, 2014, pp. 161-169.

Lall, Pradeep, Shantaram, Sandeep, Kulkarni, Mandar, Limaye, Geeta, and Suhling, Jeff, "High Strain-Rate Mechanical Properties of SnAgCu Leadfree Alloys," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 684-700.

Lall, Pradeep, Mehta, Vishal, Suhling, Jeff, and Blecker, Ken, "High Strain-Rate Properties for SAC305 at Cold Operating Temperatures down to -65°C," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 1073-1083.

Lall, Pradeep, Shantaram, Sandeep, and Locker, David, "High Strain Rate Properties of SAC105 and SAC305 Lead-free Alloys after Extended High Temperature Storage," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 363-377.

Lall, Pradeep, Shantaram, Sandeep, and Locker, David, "High Strain Rate Properties of SAC105 and SAC305 Leadfree Alloys After Extended High Temperature Storage," SMTAnews & Journal of Surface Mount Technology, vol. 27 no. 1, pp. 13-27, Mar. 2014.

Lall, Pradeep, Zhang, Di, and Suhling, Jeff, "High Strain Rate Properties of SAC305 Leadfree Solder at High Operating Temperature after Long-term Storage," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 640-651.

Lall, Pradeep, Yadav, Vikas, Suhling, Jeff, and Locker, David, "High Strain Rate Stress-Strain Measurement of SAC105 Leadfree Alloy at Temperatures up to 200°C," 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 31-June 3, 2016, pp. 1225-1235.

Lall, Pradeep, Harsha, Mahendra, Kumar, Krishan, Goebel, Kai, Jones, Jim, and Suhling, Jeff, "Interrogation of Accrued Damage and Remaining Life in Field-Deployed Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 775-789.

Lall, Pradeep, Vaidya, Rahul, More, Vikrant, and Goebel, Kai, "Interrogation of Damage-State in Lead-Free Electronics Under Sequential Exposure to Thermal Aging and Thermal Cycling," 2010 AIMS/ Harsh Environments Symposium, Orlando, FL, Oct. 25, 2010, pp. 405-418.

Lall, Pradeep, Vaidya, Rahul, More, Vikrant, and Goebel, Kai, "Interrogation of Damage-State in Leadfree Electronics Under Sequential Exposure to Thermal Aging and Thermal Cycling," 2011 33rd Electrical Overstress/Electrostatic Discharge Symposium, Anaheim, CA, Sept. 11-16, 2011, pp. xx-xx.

Lall, Pradeep, Bhat, Chandan, Hande, Madhura, More, Vikrant, Vaidya, Rahul, Pandher, Ranjit, Suhling, Jeff, and Goebel, Kai, "Interrogation of System State for Damage Assessment in Lead-free Electronics Subjected to Thermo-Mechanical Loads," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 918-929.

Lall, Pradeep, Bhat, Chandan, Hande, Madhura, More, Vikrant, Vaidya, Rahul, Suhling, Jeff, Goebel, Kai, and Pandher, Ranjit, "Interrogation of System State of Aerospace Electronic Systems Subjected to Thermo-Mechanical Loads," 2008 SMTA International Conference Proceedings , Orlando, FL, Aug. 17-21, 2008, pp. 857-869.

Lall, Pradeep, Bhat, Chandan, Hande, Madhura, More, Vikrant, Vaidya, Rahul, Pandher, Ranjit, Suhling, Jeff, and Goebel, Kai, "Latent Damage Assessment and Prognostication of Residual Life in Airborne Lead-free Electronics Under Thermo-Mechanical Loads," International Conference on Prognostics and Health Management, Denver, CO, Oct. 6-9, 2008, pp. xx-xx.

Lall, Pradeep, Vaidya, Rahul, More, Vikrant, Suhling, Jeff, and Goebel, Kai, "Leading Indicators of Damage for Prognostication of Leadfree Electronics Subjected to Multiple Thermo-Mechanical Environments," Proceedings of the ASME International Mechanical Engineering Congress & Exposition, Volume 5: Electronics and Photonics, Lake Buena Vista, FL, Nov. 13-19, 2009, pp. 291-303.

Lall, Pradeep, Islam, Nokibul, Choudhary, Prakriti, and Suhling, Jeff, "Leading Indicators of Failure for Prognostication of Leaded and Lead-free Electronics in Harsh Environments," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B , San Francisco, CA, July 17-22, 2005, pp. 1535-1543.

Lall, Pradeep, Islam, Nokibul, Choudhary, Prakriti, and Suhling, Jeffrey C., "Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments," IEEE Transactions on Components and Packaging Technologies, vol. 32 no. 1, pp. 135-144, Mar. 2009.

Lall, Pradeep, Panchagade, Dhananjay, Iyengar, Deepti, and Suhling, Jeff, "Life Prediction and Damage Equivalency for Shock Survivability of Electronic Components," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 361-375.

Lall, Pradeep, and Limaye, Geeta, "Life Prediction of Lead-free Electronics Under Simultaneous Automotive Environments of High Temperature and Vibration," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 310-325.

Lall, Pradeep, Yadav, Vikas, Suhling, Jeff, and Locker, David, "Low Temperature High Strain Rate Material Properties for SAC-Q Leadfree Alloys," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 1084-1099.

Lall, Pradeep, Yadav, Vikas, Mehta, Vishal, and Blecker, Ken, "Material Behavior of Aged SAC Solder Alloys under Sustained Operation at Extreme Cold Temperatures and High-Strain Rates," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 262-273.

Lall, Pradeep, Zhang, Di, Yadav, Vikas, Suhling, Jeff, and Shantaram, Sandeep, "Material Behavior of SAC305 under High Strain Rate at High Temperature," 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 27-30, 2014, pp. 1261-1269.

Lall, Pradeep, Zhang, Di, Yadav, Vikas, and Locker, David, "Measurement of the High Strain Rate Mechanical Behavior of SAC305 Alloy at Product Operating Temperature and Derivation of Anand Viscoplasticity Constants," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 284-292.

Lall, Pradeep, Shantaram, Sandeep, Suhling, Jeff, and Locker David, "Mechanical Deformation Behavior of SAC305 at High Strain Rates," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 1037-1051.

Lall, Pradeep, Mirza, Kazi, Harsha, Mahendra, Suhling, Jeff, and Goebel, Kai, "Method for Assessment of Prolonged and Intermittent Storage on Reliability of Leadfree Electronics using Leading Indicators," Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 1, Burlingame, CA, July 16-18, 2013, pp. V001T04A025-1-V001T04A025-11.

Lall, Pradeep, Harsha, Mahendra, and Goebel, Kai, "Method for Determination of Accrued Damage and Remaining Life During Field-Usage in Lead-Free Electronics," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 58-72.

Lall, Pradeep, Hande, Madhura, Bhat, Chandan, and Suhling, Jeff, "Methodologies for System-State Interrogation for Prognostication of Electronics Under Thermo-Mechanical Loads," 2007 ASME International Mechanical Engineering Conference and Exposition, Volume 5, Seattle, WA, Nov. 11-15, 2007, pp. 359-374.

Lall, Pradeep, Mirza, Kazi Mahmud, Harsha, Mahendra, and Goebel, Kai, "Microstructural Indicators for Assessment of Effect of Prolonged and Intermittent Storage on Reliability of Lead-free Electronics," IEEE Transactions on Device and Materials Reliability, vol. 16 no. 3, pp. 304-317, Sept. 2016.

Lall, Pradeep, Shirgaokar, Aniket, and Suhling, Jeff, "Models for Component Selection and Thermo-mechanical Reliability Trade-Offs to Address Component Obsolescence in Military Electronics," 2008 ASME International Mechanical Engineering Congress and Exposition, Volume 6, Boston, MA, Oct. 31-Nov. 6, 2008, pp. 245-261.

Lall, Pradeep, Shantaram, Sandeep, Angral, Arjun, Kulkarni, Mandar, and Suhling, Jeff, "Models for Prediction of Shock Reliability for Leadfree Area-Array Components in Portable Electronics," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 55-69.

Lall, Pradeep, Panchagade, Dhananjay R., Liu, Yueli, Johnson, R. Wayne, and Suhling, Jeffrey C., "Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact," IEEE Transactions on Components and Packaging Technologies , vol. 29 no. 3, pp. 464-474, Sept. 2006.

Lall, Pradeep, Panchagade, Dhananjay, Choudhary, Prakriti, Suhling, Jeff, and Gupte, Sameep, "Models for Shock and Vibration Survivability of Electronic and MEMS Packaging," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B, San Francisco, CA, July 17-22, 2005, pp. 1545-1556.

Lall, Pradeep, Singh, Naveen, Hariharan, Ganesh, Tian, Guoyun, Strickland, Mark, Blanche. Jim, and Suhling, Jeff, "Models for Thermo-Mechanical Reliability Trade-Offs for Leaded and Leadfree Flip-Chip Electronics in Extreme Environments," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 500-511.

Lall, Pradeep, Islam, Saiful, Tian, Guoyun, and Suhling, Jeffrey C., "Nano-Underfills for High-Reliability Applications in Extreme Environments," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 1, pp. 114-125, Mar. 2008.

Lall, Pradeep, Deshpande, Shantanu, Wei, Junchao, and Suhling, Jeff, "Non-Destructive Crack and Defect Detection in SAC Solder Interconnects Using Cross-Sectioning and X-Ray Micro-CT," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 1449-1456.

Lall, Pradeep, Shirgaokar, Aniket, and Arunachalam, Dinesh, "Norris-Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics," Journal of Electronic Packaging, vol. 134 no. 3, pp. 031008-1-031008-12, Sept. 2012.

Lall, Pradeep, Lowe, Ryan, and Goebel, Kai, "Particle Filter Models and Phase Sensitive Detection for Prognostication and Health Monitoring of Leadfree Electronics under Shock and Vibration," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1097-1109.

Lall, Pradeep, Shirgaokar, Aniket, Arunachalam, Dineshkumar, Suhling, Jeff, Strickland, Mark, and Blanche, Jim, "PCR for Derivation of Parameter Dependencies, Thermo-Mechanical Norris-Landzberg Acceleration Factors, Goldmann Fatigue Constants for Leadfree Electronics," Proceedings of the ASME 2009 InterPack Conference, Volume 2, San Francisco, CA, July 19-23, 2009, pp. 159-170.

Lall, Pradeep, Shirgaokar, Aniket, and Arunachalam, Dinesh, "Principal Component Analysis Based Development of Norris-Landzberg Acceleration Factors and Goldmann Constants for Leadfree Electronics," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 251-261.

Lall, Pradeep, Duraisamy, Sree Mitun, Suhling, Jeff, and Evans, John, "Principal Components Regression Model for Prediction of Life-Reduction in SAC Leadfree Interconnects During Long-Term High Temperature Storage," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 2040-2047.

Lall, Pradeep, Islam, Nokibul, and Suhling, Jeff, "Prognostication and Health Monitoring of Leaded and Lead-Free Electronic and MEMs Packages in Harsh Environments," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 1305-1313.

Lall, Pradeep, Thomas, Tony, Suhling, Jeff, and Blecker, Ken, "Prognostication of Accrued Damage and Impending Failure Under Temperature-Vibration in Leadfree Electronics," 2019 IEEE 69th Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2019, pp. 505-514.

Lall, Pradeep, More, Vikrant, Vaidya, Rahul, and Goebel, Kai, "Prognostication of Latent Damage and Residual Life in Leadfree Electronics Subjected to Multiple Thermal-Environments," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1381-1392.

Lall, Pradeep, Bhat, Chandan, Hande, Madhura, More, Vikrant, Vaidya, Rahul, and Goebel, Kai, "Prognostication of Residual Life and Latent Damage Assessment in Lead-Free Electronics Under Thermomechanical Loads," IEEE Transactions on Industrial Electronics, vol. 58 no. 7, pp. 2605-2616, July 2004.

Lall, Pradeep, Dornala, Kalyan, Wei, Junchao, Lowe, Ryan, and Foley, Jason, "Prognostication of Solder-Joint Reliability of 0.4mm and 0.5mm pitch BGAs Subjected to Mechanical shocks up to 10,000G," 2015 IEEE Conference on Prognostics and Health Management, Austin, TX, June 22-25, 2015, pp. xx-xx.

Lall, Pradeep, Hande, Madhura, Bhat, Chandan, More, Vikrant, Vaidya, Rahul, and Suhling, Jeff, "Prognostication of System-State in Lead-Free Electronics Equipment under Cyclic and Steady-State Thermo-Mechanical Loads," International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, Freiburg, Germany, Apr. 20-23, 2008, pp. xx-xx.

Lall, Pradeep, Hande, Madhura, Bhat, Chandan, More, Vikrant, and Vaidya, Rahul, "Prognostication of system-state in lead-free electronics equipment under cyclic and steady-state thermo-mechanical loads," Microelectronics Reliability, vol. 49 no. 8, pp. 825-838, Aug. 2009.

Lall, Pradeep, and Mirza, Kazi, "Prognostication of the Effect of Mean Temperature of Thermal Cycle on SAC305 Leadfree Reliability Using Damage Pre-Cursors," 2014 IEEE Conference on Prognostics and Health Management, Cheney, WA, June 22-25, 2014, pp. xx-xx.

Lall, Pradeep, Lowe, Ryan, and Goebel, Kai, "Prognostics and Health Monitoring of Electronic Systems," 2011 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Linz, Austria, Apr. 18-20, 2011, pp. xx-xx.

Lall, Pradeep, Hande, Madhura, Bhat, Chandan, and Lee, Jay, "Prognostics Health Monitoring (PHM) for Prior Damage Assessment in Electronics Equipment Under Thermo-Mechanical Loads," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 11, pp. 1774-1789, Nov. 2011.

Lall, Pradeep, Shantaram, Sandeep, and Locker, David, "Reliability Modeling of Electronic Systems Subjected to High Strain Rates," 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Lisbon, Portugal, Apr. 16-18, 2012, pp. xx-xx.

Lall, Pradeep, Limaye, Geeta, Suhling, Jeff, Murtuza, Masood, Palmer, Brad, and Cooper, Will, "Reliability of Lead-free SAC Electronics Under Simultaneous Exposure to High Temperature and Vibration," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 753-761.

Lall, Pradeep, Yadav, Vikas, Suhling, Jeff, and Locker, David, "Reliability of Leadfree Solders in High Temperature Vibration in Automotive Environments," 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 28-31, 2019, pp. 566-585.

Lall, Pradeep, Yadav, Vikas, Zhang, Di, and Suhling, Jeff, "Reliability of SAC Leadfree Solders in Automotive Underhood Temperature-Vibration," 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29-June 1, 2018, pp. 1255-1269.

Lall, Pradeep, Vaidya, Rahul, More, Vikrant, Suhling, Jeff, and Goebel, Kai, "Remaining Useful-Life Based on Damage Pre-cursors for Leadfree Electronics Subjected to Multiple Thermal-Environments," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 873-885.

Lall, Pradeep, and Lowe, Ryan, "Residual-Life Estimation of Lead-Free Electronics in Shock and Vibration Using Kalman Filter Models," SMTA International 2010 Conference (Presentations), Orlando, FL, Oct. 24-28, 2010.

Lall, Pradeep, Lowe, Ryan, and Goebel, Kai, "Resistance Spectroscopy-based Condition Monitoring for Prognostication of High Reliability Electronics Under Shock-Impact," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1245-1255.

Lall, Pradeep, Arunachalam, Dinesh, and Suhling, Jeff, "Ridge Regression Based Development of Norris-Landzberg Acceleration Factors and Goldmann Constants for Leadfree Electronics," Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, Volume 1, Portland, OR, July 6-8, 2011, pp. 537-547.

Lall, Pradeep, Thomas, Tony, and Blecker, Ken, "RUL Estimations of SAC305 Solder PCB's under Different Conditions of Temperature and Vibration Loads," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 1340-1349.

Lall, Pradeep, Gupta, Prashant, and Panchagade, Dhananjay, "Self-Organized Mapping of Failure Modes in Portable Electronics Subjected to Drop and Shock," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1195-1208.

Lall, Pradeep, Kulkarni, Mandar, Shantaram, Sandeep, and Suhling, Jeff, "SIF Evaluation using XFEM and Line Spring Models under High Strain Rate Environment for Leadfree Alloys," Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, Volume 1, Portland, OR, July 6-8, 2011, pp. 281-297.

Lall, Pradeep, and Limaye, Geeta, "SnAgCu Lead-Free Electronics Reliability under Combined Temperature and Vibration Environments," SMTA Journal, vol. 26 no. 1, pp. 11-19, 2013.

Lall, Pradeep, Panchagade, Dhahanjay, Liu, Yueli, Johnson, Wayne, and Suhling, Jeff, "Shock-Induced Failure Prediction Model for Fine-Pitch BGAs and CSPs," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 472-481.

Lall, Pradeep, Panchagade, Dhananjay, Liu, Yueli, Johnson, Wayne, and Suhling, Jeff, "Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages," Journal of Electronic Packaging, vol. 129 no. 4, pp. 373-381, Dec. 2007.

Lall, Pradeep, and Limaye, Geeta, "SnAgCu Lead-Free Electronics Reliability Under Combined Temperature and Vibration Environments," SMTA International 2012 Conference Proceedings , Orlando, FL, Oct. 14-18, 2012, pp. 575-583.

Lall, Pradeep, Shantaram, Sandeep, Suhling, Jeff, and Locker, David, "Stress-Strain Behavior of SAC305 at High Strain Rates," Journal of Electronic Packaging, vol. 137 no. 1, pp. 011010-1-011010-16, Mar. 2015.

Lall, Pradeep, Shantaram, Sandeep, Kulkarni, Mandar, Limaye, Geeta, and Suhling, Jeff, "Stress-Strain Behavior of SnAgCu Lead-Free Alloys at High Strain Rates Typical of Mechanical Shock," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 617-633.

Lall, Pradeep, Kulkarni, Mandar, and Angral, Arjun, "Survivability Assessment of Advanced Interconnects and Lead-Free Electronics Subjected to Shock and Vibration with XFEM and CZM," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 163-176.

Lall, Pradeep, Iyengar, Deepti, Shantaram, Sandeep, Panchagade, Dhananjay, and Suhling, Jeff, "Survivability Assessment of SAC Leadfree Packaging Under Shock and Vibration Using Optical High-Speed Imaging," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 519-531.

Lall, Pradeep, Harsha, Mahendra, Suhling, Jeff, and Goebel, Kai, "Sustained Damage and Remaining Useful Life Assessment in Leadfree Electronics Subjected to Sequential Multiple Thermal Environments," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 1695-1708.

Lall, Pradeep, and Yadav, Vikas, "Sustained High-Temperature Vibration Reliability of Thermally Aged Leadfree Assemblies in Automotive Environments," Pan Pacific Symposium 2020 , Honolulu, HI, Feb. 10-13, 2020, pp. xx-xx.

Lall, Pradeep, Shah, Milan, Drake, Luke, Moore, Timothy, and Suhling, Jeff, "Thermo-Mechanical Reliability Management Models for Area-Array Packages on Cu-Core and No-Core Assemblies," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 582-596.

Lall, Pradeep, Shah, Milan, Drake, Luke, Moore, Timothy, and Suhling, Jeff, "Thermo-Mechanical Reliability Management Models for Area-Array Packages on Cu-Core and No-Core Assemblies," SMTAnews & Journal of Surface Mount Technology, vol. 21 no. 3, pp. 20-35, July-Sept. 2008.

Lall, Pradeep, Hinshaw, Robert, Pandher, Ranjit, Harsha, Mahendra, and Suhling, Jeff, "Thermo-mechanical Reliability of SAC Leadfree Alloys," 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June 2-5, 2010, pp. xx-xx.

Lall, Pradeep, Kasturi, Madhu, Kothari, Nakul, and Locker, David, "X-Ray Micro-Computed Tomography Based FE-Models to Capture Realistic Manufacturing Variability in Cu-Al Wirebonds and Solder-Joints in QFNs," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 33-45.

LaLonde, A., Emelander, D., Jeannette, J., Larson, C., Rietz, W., Swenson, D., and Henderson, D. W., "Quantitative Metallography of ?-Sn Dendrites in Sn-3.8Ag-0.7Cu Ball Grid Array Solder Balls via Electron Backscatter Diffraction and Polarized Light Microscopy," Journal of Electronic Materials, vol. 33 no. 12, pp. 1545-1549, Dec. 2004.

Lam, Carl W., Lim, Seong-Rin, and Schoenung, Julie M., "Environmental and risk screening for prioritizing pollution prevention opportunities in the U.S. printed wiring board manufacturing industry," Journal of Hazardous Materials, vol. 189 no. 1-2, pp. 315-322, May 15, 2011.

Lam, D. C. C., and Wang, J., "Hygrothermal Delaminations in Lead-Free Solder Reflow of Electronic Packages," Journal of Electronic Materials, vol. 36 no. 3, pp. 226-231, Mar. 2007.

Lam, D. C. C, Shen, C., Xie, J. F., Karim, Z., and Tong, P., "Structural Reliability of Direct-Chip-Attaches Bonded with Anisotropic Conductive Film," Materials Research Society Symposium Proceedings Volume 445, Boston, MA, Dec. 2-5, 1996, pp. 297-306.

Lam, David C. C., Yang, Fan, and Tong, Pin, "Chemical Kinetic Model of Interfacial Degradation of Adhesive Joints," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 44-48.

Lam, David C. C., Wang, Jun, and Yang, Fan, "Hygrothermal Failures From Small Defects in Lead-Free Solder Reflowed Electronic Packages," IEEE Transactions on Advanced Packaging, vol. 30 no. 4, pp. 636-640, Nov. 2007.

Lam, David C. C., Chong, I. T., and Tong, Pin, "Parametric Analysis of Steam Driven Delamination in Electronics Packages," IEEE Transactions on Electronics Packaging Manufacturing, vol. 23 no. 3, pp. 208-213, July 2000.

Lam, Liza, Swingler, Jonathan, and McBride, John, "The Contact Resistance Force Relationship of an Intrinsically Conducting Polymer Interface," Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts, Brussels, Belgium, Oct. 4-5, 2004, pp. 304-311.

Lambert, Leo, "Lead-Free Audits: Preparation, Questions, and Answers," IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics, Raleigh, NC, Mar. 11-12, 2008, pp. xx-xx.

Lambert, Leo, "Technical Challenges of RoHS Compliance," (presentation) Implementing Lead-Free Electronics Workshop, Westborough, MA, Feb. 28, 2006, pp. xx-xx.

Lambert, Leo, "There's More Than One Way to Assemble Lead-Free: Status Report on Lead Free Processes," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. xx-xx.

Lambert, W. R., Mitchell, J. P., Suchin, J. A., and Fulton, J. A., "Use of Anisotropically Conductive Elastomers in High Density Separable Connectors," 1989 Proceedings 39th Electronic Components Conference , Houston, TX, May 22-24, 1989, pp. 99-106.

Lambrinou, Konstantina, Maurissen, Wout, Limaye, Paresh, Vandevelde, Bart, Verlinden, Bert, and De Wolf, Ingrid, "A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints," Journal of Electronic Materials , vol. 38 no. 9, pp. 1881-1895, Sept. 2009.

Lamontagne, A., Massardier, V., Kleber, X., Sauvage, X., and Mari, D., "Comparative study and quantification of cementite decomposition in heavily drawn pearlitic steel wires," Materials Science and Engineering: A , vol. 644, pp. 105-113, Sept. 17, 2015.

Lamprecht, Sven, Schreier, Hans-Jurgen, and Vogel, Roland, "Ageing Characteristics of Immersion Tin Surface Finishes," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Lamprecht, Sven, "An investigation of the recommended immersion tin thickness for lead-free soldering," Circuit World, vol. 31 no. 2, pp, 15-21, 2005.

Lamprecht, Sven, and Johal, Kuldip, "Evaluation of Surface Finishes for Pb-Free Assembly Based on Examination of Solder Wetting Characteristics and Performance," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 558-565.

Lamprecht, Sven, Heinz, Gunter, Patton, Neil, Kenny, Stephen, and Brooks, Patrick, ""Green" PCB production processes," Circuit World, vol. 34 no. 1, pp. 13-24, 2008.

Lamprecht, Sven, Schreier, Hans-Jurgen, and Vogel, Roland, "Immersion Sn Solderability," Printed Circuit Fabrication, vol. 24 no. 4, pp. 102,104,106,108,110,112,114, Apr. 2001.

Lamprecht. Sven, Johal, Kuldip, Schreier, H.-J., and Roberts, Hugh, "Impacts of the bulk Phosphorus content of electroless nickel layers to Solder Joint Integrity," HKPCA Journal, no. 14, pp. 1-11.

Lamprecht, Sven, Schreier, Hans-Jurgen, Johal, Kuldip, and Roberts, Hugh, "Keeping Solder Joints Whole," Circuitree, vol. xx no. xx, pp. 38-40, 42, 44, Sept. 2004.

Lamprecht, Sven, Roberts, Hugh, Nishida, Shozo, Aiki, Fumio, Roelfs, Bernd, Kenny, Steven, and Matejat, Kai-Jens, "The Smaller the Better - Simultaneous Electrolytic Solder Deposition on Both Sides of a Fine-Pitch Package Substrate," SMTA International Conference , San Diego, CA, Oct. 4-8, 2009, pp. 872-878.

Lamvik, T., Myklebust, O., and Miljeteig, G., "The AEOLOS Methodology," 2002 IEEE International Symposium on Electronics & the Environment, San Francisco, CA, May 6-9, 2002, pp. 318-323.

Lan, Gong-An, Lui, Truan-Sheng, and Chen, Li-Hui, "Effect of Alloying Elements on the Electrification-Fusion Phenomenon in Sn-Based Eutectic Alloys," Journal of Electronic Materials, vol. 42 no. 2, pp. 249-255, Feb. 2013.

Lan, Gong-An, Yang, Chung-Wei, Lui, Truan-Sheng, and Chen, Li-Hui, "The Weibull statistical analysis for evaluating microstructural effects on electrification-fusion phenomenon of Sn-xZn alloys," Journal of Alloys and Compounds, vol. 475 no. 1-2, pp. 294-299, May 5, 2009.

Lan, Jia-Shen, and Wu, Mei-Ling, "Life Expectancies of Ni-doped SAC Solder Alloy Subjected to Drop Test Loading," 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29-June 1, 2018, pp. 1249-1254.

Lan, Jia-Shen, and Wu, Mei-Ling, "Stress Analysis of Multilayered Printed Circuit Board under Mechanical Loading," SMTA Journal, vol. 25 no. 2, pp. 30-36, 2012.

Lancaster, Suzanne, Kriz, Martin, Schinnerl, Markus, MacFarland, Donald, Zederbauer, Tobias, Andrews, Aaron Maxwell, Schrenk, Werner, Strasser, Gottfried, and Detz, Hermann, "Focused ion beam implantation for the nucleation of self-catalyzed III-V nanowires," Microelectronic Engineering, vol. 177, pp. 93-97, June 5, 2017.

Landau, Uwe, "Oberflachen designen Galvanische Zinn- und Zinnlegierungsschichten," Metalloberflache, vol. 57 no. 11, pp. 39-44. Nov. 2003.

Landers, Leslie, and Virutchapunt, Tanit, "The DC Design Squeeze," Printed Circuit Design and Fab, vol. 26 no. 2, pp. 34-37, Feb. 2009.

Landman, Bob, Davy, Gordon, and Fritz, Dennis, "Preventing Tin Whisker Growth Risk," Tin Whisker Group teleconference, June 15, 2016.

Landman, Bob, Davy, Gordon, and Fritz, Denny, "Whisker-Impenetrable Selective Metal Cap Process for Electronic Assemblies," Tin Whisker Group teleconference, Sept. 8, 2010.

Landman, Robert J., "Tin Whiskers - A Long Term RoHS Reliability Problem."

Landman, Robert J., Davy, Gordon, and Fritz, Dennis D., "Whisker-Impenetrable Metal Cap Process for Electronic Assemblies," International Conference on Soldering & Reliability 2011 Proceedings , Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

Lando, D. J., Mitchell, J. P., and Welsher, T. L., "Conductive Anodic Filaments in Reinforced Polymeric Dielectrics: Formation and Prevention," 17th Annual Reliability Physics Symposium, San Francisco, CA, Apr. 24-26, 1979, pp. 51-63.

Landolt, D., "Fundamental Aspects of Alloy Plating," Plating & Surface Finishing , vol. 88 no. 9, pp. 70-79, Sept. 2001.

Landry, Susan D., Scherrer, Steve, and Tenney, Joe, "Excellent Product Stewardship and Sustainable Use of Plastics Additives in the Electronics Industry," IEEE International Symposium on Sustainable Systems and Technology, Phoenix, AZ, May 18-20, 2009, pp. xx-xx.

Landry, Susan D., "Halogen Free Update - Environmental Regulation and Review," It's Not Easy Being Green, San Jose, CA, Feb. 4-5, 2009, pp. xx-xx.

Landry, Susan D., and Dawson, Raymond B., "Life-Cycle Environmental Impact of Flame Retarded Electrical and Electronic Equipment," 2002 IEEE International Symposium on Electronics & the Environment, San Francisco, CA, May 6-9, 2002, pp. 163-168.

Landry, Susan D., "Sustainable Developments for flame retardants," 2010 IEEE International Symposium on Sustainable Systems and Technology, Arlington, VA, May 17-19, 2010, pp. xx-xx.

Landry, Susan D., "Tetrabromobisphenol A, The Flame Retardant of Choice for Printed Wiring Boards," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Lang, Arne, and Jeitschko, Wolfgang, "Two New Phases in the System Cobalt-Tin: The Crystal Structures of a- and b-CoSn3," Zeitschrift fur Metallkunde, vol. 87 no. 10, pp. 759-764, 1996.

Lang, Dennis, "The Thermal Properties of MLCSP Solder Attach," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Lang, Fengqun, Nakagawa, Hiroshi, Aoyagi, Masahiro, Ohashi, Hiromichi, and Yamaguchi, Hiroshi, "Impact of joint materials on the reliability of double-side packaged SiC power devices during high temperature aging," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Lang, Fengqun, Yamaguchi, Hiroshi, Ohashi, Hiromichi, and Sato, Hiroshi, "Improvement in Joint Reliability of SiC Power Devices by a Diffusion Barrier Between Au-Ge Solder and Cu/Ni(P)-Metalized Ceramic Substrates," Journal of Electronic Materials, vol. 40 no. 7, pp. 1563-1571, July 2011.

Lang, Fengqun, Tanaka, Hiroyuki, Munegata, Osamu, Taguchi, Toshihiko, and Narita, Toshio, "The effect of strain rate and temperature on the tensile properties of Sn-3.5Ag solder," Materials Characterization, vol. 54 no. 3, pp. 223-229, Mar. 2005.

Langan, James P., "A Lead-Free PC Fabrication Industry," Plating & Surface Finishing , vol. 80 no. 9, pp. 69, Sept. 1993.

Langan, James P., "Alternatives to Hot Air Solder Leveling," Proceedings of the Technical Program NEPCON West '95, Volume 2, Anaheim, CA, Feb. 26-Mar. 2, 1995, pp. 691-696.

Langan, James P., "Chemical Plating of Tin/Lead," Plating & Surface Finishing, vol. 79 no. 9, pp. 53, Sept. 1992.

Langan, James P., "Electroless Nickel/Gold PCBs," Plating & Surface Finishing, vol. 80 no. 10, pp. 58, Oct. 1993.

Langan, James P., "Electroplating SMT Components," Plating & Surface Finishing, vol. 78 no. 9, pp. 64, 90, Sept. 1991.

Langan, James P., "Eliminating Lead From the Component Industry," Plating & Surface Finishing, vol. 80 no. 8, pp. 22-23, Aug. 1993.

Langan, James P., "Feasibility of Restricting Lead From Electronic Products," Plating & Surface Finishing, vol. 87 no. 5, pp. 108-109, May 2000.

Langan, James P., "High-density Interconnection Surface Finish Issues," Plating & Surface Finishing, vol. 87 no. 3, pp. 52-53, Mar. 2000.

Langan, James P., "Pd Grows Stronger as a Substitute for Gold," Plating & Surface Finishing, vol. 83 no. 3, pp. 42-43, Mar. 1996.

Langan, James P., "Reliability of Contact Surface Finishes," Plating & Surface Finishing, vol. 85 no. 4, pp. 49-50, Apr. 1998.

Langan, James P., "Solder Alternatives to HASL," Proceedings AESF SUR/FIN '96, Cleveland, OH, June 10-13, 1996, pp. 219-222.

Langan, James P., "The Feasibility for Eliminating Tin Lead Plating of Electronic Components," Proceedings of The International Technical Conference of AESF SUR/FIN , Anaheim, CA, June 21-24, 1993, pp. 689-691.

Langan, James P., "The U.S. In the Global Marketplace: Can a Lead-Free Electronics Industry Compete," Plating & Surface Finishing, vol. 79 no. 7, pp. 42, 48, July 1992.

Lange, Fritz, "Untersuchungen uber die spezifische Warme bei tiefen Temperaturen," Zeitschrift fur physikalische Chemie, vol. 110 no. xx, pp. 343-362, 1924.

Lange, P., Herenz, A., Laker, O., Schall, E., and Seubert, T., "Status of Leadfree Automotive Electronics," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 161-168.

Lange, W., and Bergner, D., "Messung der Korngrenzenselbstdiffusion in Polykristallinem Zinn," Physica Status Solidi, vol. 2 no. 10, pp. 1410-1414, 1962. https://doi.org/10.1002/pssb.19620021020

Langsner, Heather, and Eid, Noran, "Cross Cutting Effects of Chemical Liability from Products," Greenbiz.com.

Lansdell, P. A. W., and Farr, J. P. G., "A Comparison of the Surface Chemistries of Chromium Electroplated Finishes," Transactions of the Institute of Metal Finishing, vol. 82 no. 3-4, pp. 105-113, May-July 2004.

Lansdell, P. A. W., and Farr, J. P. G., "The Colour of Chromium Electroplate," Transactions of the Institute of Metal Finishing, vol. 80 no. 2, pp. 60-63, Mar. 2002.

Lansdell, Paul, "European Committee for Surface Treatment (CETS)," Transactions of the Institute of Metal Finishing, vol. 84 no. 1, pp. 6-7, Jan. 2006.

Lansdell, Paul, and Farr, J. P. G., "The Corrosion Resistance of Chromium Electroplated from Trivalent and Hexavalent Chromium Plating Solutions," Transactions of the Institute of Metal Finishing, vol. 75 no. 6, pp. 219-223, Nov. 1997.

Lansky, Deborah, "IVD: Eliminating Tank Electroplating Solutions For Cadmium," Plating & Surface Finishing, vol. 80 no. 1, pp. 20-21, Jan. 1993.

Lanzano, T., Bertram, M., De Palo, M., Wagner, C., Zyla, K., and Graedel, T. E., "The contemporary European silver cycle," Resources, Conservation, and Recycling, vol. 46 no. 1, pp. 27-43, Jan. 2006.

LaPedus, Mark, "Cisco declares 'design-for-environment' era," EE Times, Oct. 24, 2005.

Lapsa, J., Onderka, B., Schmetterer, C., Ipser, H., Yuan, Y., and Borzone, G., "Liquidus determination in the Cu-Sb-Sn ternary system," Thermochimica Acta, vol. 519 no. 1-2, pp. 55-58, May 20, 2011.

Lapsa, Joanna, and Onderka, Boguslaw, "Thermodynamic Properties of Liquid Silver-Antimony-Tin Alloys Determined from Electrochemical and Calorimetric Measurements," Journal of Electronic Materials, vol. 45 no. 8, pp. 4441-4452, Aug. 2016.

Larcher, Dominique, Beattie, Shane, Morcrette, Mathieu, Edstrom, Kristina, Jumas, Jean-Claude, and Tarascon, Jean-Marie, "Recent findings and prospects in the field of pure metals as negative electrodes for Li-ion batteries," Journal of Materials Chemistry , vol. 17 no. 36 pp. 3759-3772, 2007.

Larikov, L. N., and Brick, V. B., "Mechanism of Nucleation and Growth of Crystals under a->b Transformation of Tin," Kristall und Technik, vol. 12 no. 10, pp. 1087-1098, 1977. https://doi-org.ezproxy.uky.edu/10.1002/crat.19770121014

Larrabee, Lance, "Lead-free: Component Compatibility Takes Center Stage," Surface Mount Technology (SMT), vol. 19 no. 3, pp. 46-48, Mar. 2005.

Larrabee, Lance, van Tiggelen-Aarden, Ineke, and Westerlaken, Eli, "Solder materials for lead-free technology," EMasia, Nov. 2005.

Larsen, C. A., Li, S. H., Buchan, N. I., Stringfellow, G. B., and Brown, D. W., "Kinetics of the Reaction between Trimethylgallium and Arsine," Journal of Crystal Growth, vol. 102 no. 1-2, pp. 126-136, Apr. 2, 1990.

Larson, B. C., Yang, Wenge, Ice, G. E., Budai, J. D., and Tischler, J. Z., "Three-dimensional X-ray structural microscopy with submicrometre resolution," Nature, vol. 415 no. 6874, pp. 887-890, Feb. 21, 2002.

Larson, Clive, "Replacement of Hexavalent Chromium," Transactions of the Institute of Metal Finishing, vol. 75 no. 4, pp. B91-B92, July 1997.

Larson, Clive, "Schloetter achieves 144 hours salt spray with new Chrome(III) passivation," Transactions of the Institute of Metal Finishing, vol. 79 no. 5, pp. B92, Sept. 2001.

Larson, Kent, "Greener PCB COATINGS," Printed Circuit Design and Fab, vol. 25 no. 7, pp. 36-38, July 2008.

Larson, Kent, "Increasing Electronics Reliability With Conformal Coatings," Design News, vol. 68 no. 3, pp. 36-38, Mar. 2013.

Larsson, Andreas, Tollefsen, Torleif A., Lovvik, Ole Martin, and Aasmundtveit, Knut E., "A Review of Eutectic Au-Ge Solder Joints," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 50 no. 10, pp. 4632-4641, Oct. 2019.

Larsson, Andreas, and Aamundtveit, Knut E., "On the Microstructure of Off-Eutectic Au-Ge Joints: A High-Temperature Joint," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 51 no. 2, pp. 740-749, Feb. 2020.

Lasance, Clemens J. M., "thermal conductivity of liquid metals," Electronics Cooling, vol. 14 no. 2, pp. 5, May 2008.

Lashmore, D., and Melmed, A. J., "Field ion microscopy of polycrystalline iron whiskers," Journal of Applied Physics, vol. 49 no. 8, pp. 4586-4587, Aug. 1978.

Lashmore, D. S., Jesser, W. A., Schladitz, D. M., Schladitz, H. J., and Wilsdorf, H. G. F., "Microstructural investigation of polycrystalline iron whiskers," Journal of Applied Physics, vol. 48 no. 2, pp. 478-480, Feb. 1977.

Lashmore, D. S., Swartzendruber, L. J., and Bennett, L. H., "Mossbauer spectroscopy of polycrystalline steel fibers," Applied Physics Letters, vol. 36 no. 1, pp. 39-40, Jan. 1980.

Lasky, Ron, "Analysis for RoHS Compliance," Surface Mount Technology (SMT) , vol. 19 no. 10, pp. xx-xx, Oct. 2005.

Lasky, Ron, and Jensen, Timothy, "Best Practices in Implementing Pb-Free Assembly: An Overview of a Successful Implementation." Indium Corporation of America.

Lasky, Ron, "Environmental Impact of Pb-free Manufacturing," Surface Mount Technology (SMT), vol. 18 no. 2, pp. 74, Feb. 2004.

Lasky, Ron, "Hoping for WEEE and RoHS Exemptions," Surface Mount Technology (SMT), vol. 19 no. 7, pp. xx-xx, July 2005.

Lasky, Ron, "Lead-free Readiness Assessment," Surface Mount Technology (SMT) , vol. 18 no. 8, pp. xx-xx, Aug. 2004.

Lasky, Ron, "Lead-free Reliability: Equal or Better?," Surface Mount Technology (SMT), vol. 19 no. 4, pp. xx-xx, Apr. 2005.

Lasky, Ron, "Motorola/Indium Lead-free Efforts & Best Practices for Lead-free Assembly," TURI, Dec. 16, 2004.

Lasky, Ron, "Napoleon's Buttons and Lead-free Soldering," Lead-free Electronics , Nov. 2004.

Lasky, Ron, "Napoleon's Buttons and Lead-free Soldering," Advanced Packaging, vol. 13 Nov204 supplement, pp. 10, Nov. 2004.

Lasky, Ron, ""Repeal RoHS" Movement Emerges," PCB007, Oct. 4, 2006.

Lasky, Ron, "RoHS Tear Down Analysis Approaches," SMART Group "All You Ever Wanted to Know About Lead-Free" Seminar, High Wycombe, United Kingdom, Nov. 1, 2005.

Lasky, Ron, "RoHS: The Fine Print," Surface Mount Technology (SMT), vol. 19 no. 2, pp. xx-xx, Feb. 2005.

Lasky, Ron, "The Twelve Questions of WEEE/RoHS," Surface Mount Technology (SMT) , vol. 20 no. 2, pp. xx-xx, Feb. 2006.

Lasky, Ron, "The Twin Miracles of Copper and Solder," Surface Mount Technology (SMT), vol. 21 no. 6, pp. 8, June 2007.

Lasky, Ronald C., "A Comprehensive Strategy to Achieve Timely RoHS Compliance," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies , Frankfurt, Germany, Oct. 20-22, 2004.

Lasky, Ronald C., and Hickey, Katherine, "A Protocol for RoHS and WEEE Compliance," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 638-640.

Lasky, Ronald C., "A step-by-step plan for rapid environmental compliance," Green SupplyLine, Nov. 9, 2006.

Lasky, Ronald C., "A step-by-step plan for rapid environmental compliance," Industrial Control Design Line, Nov. 9, 2006.

Lasky, Ronald, and Jensen, Timothy, "An Overview of a Successful Pb-Free Implementation." Indium Corporation of America.

Lasky, Ronald C., "Copper-Tin Intermetallics: Their Importance, Growth Rate, and Nature," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Lasky, Ronald C., and Jensen, Timothy, "Implementing Pb-Free Assembly at Your Factory," Indium Corporation, Feb. 2004.

Lasky, Ronald C., Santos, Daryl, and Bhave, Aniket A., "Leaded and Lead-Free Solder Paste Evaluation Screening Procedure," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 12-15.

Lasky, Ronald, "Napoleon's Buttons and Lead-free Soldering," Surface Mount Technology (SMT), vol. 18 no. 10, pp. 18, Oct. 2004.

Lasky, Ronald, ""Repeal RoHS" Movement Emerges," Surface Mount Technology (SMT) , vol. 20 no. 9, pp. 8, Sept. 2006.

Lasky, Ronald, "Risk and Mitigation for Tin Whiskers and Tin Pest," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 444-448.

Lasky, Ronald C., "Risk and Mitigation for Tin Whiskers and Tin Pest," Surface Mount Technology (SMT), vol. 30 no. 2, pp. 18,20-22,24,26-27, Feb. 2015.

Lasky, Ronald, "RoHS: Eighteen Months Later," Surface Mount Technology (SMT), vol. xx no. xx, pp. xx-xx, xxxx.

Lasky, Ronald C., Nash, Christopher, Hall, W. James, and Zarrow, Phil, "RoHS: How Has it Gone Eleven Years Later," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 833-842.

Lasky, Ronald C., Santos, Daryl, Bhave, Aniket A., and Ming, Wang, "Six Sigma(R) Techniques for Solder Paste Selection."

Lasky, Ronald C., "The Procrastinator's Guide to WEEE and RoHS Compliance," IPC Review , vol. 47 no. 7, pp. 8, Aug. 2006.

Lasky, Ronald C., "The Procrastinators Guide to WEEE and RoHS Compliance," Route , Aug. 2006.

Lasky, Ronald C., "Tin Pest: A Forgotten Issue in Lead-free Soldering?." 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 838-840.

Lasky, Ronald C., "Tin Pest: Elusive Threat in Lead-Free Soldering?," Journal of Failure Analysis and Prevention, vol. 10 no. 6, pp. 437-443, Dec. 2010.

Lasky, Ronald C., "Tin Pest: Still a Forgotten Concern in Lead Free Assembly," Dr. Lasky's Blog, Aug. 17, 2005.

Lasky, Ronald C., "Tin Whiskers 101," Medical Electronics Symposium 2013 Proceedings , Milpitas, CA, Nov. 12-13, 2013, pp. xx-xx.

Lasky, Ronald C., and Balch, Annaka, "Tin Whiskers 101: 2019," Pan Pacific Symposium 2019 Proceedings, Kauai, HI, Feb. 11-14, 2019, pp. xx-xx.

Lasky, Ronald C., "Using Weibul Analysis to Interpret Failure Data in Electronics Assembly Stress Testing," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 421-430.

Lasky, Ronald, "WEEE/RoHS Final Q&A," Surface Mount Technology (SMT), vol. 20 no. 5, pp. 8, May 2006.

Las Marias, Stephen, "The Complex World of Soldering," Surface Mount Technology (SMT), vol. 32 no. 4, pp. 12-18, Apr. 2017.

Lathrop, Richard, "Achieving Sn/Pb Void Performance Utilizing Lead Free Solder Pastes," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S13-02-1-S13-02-8.

Lathrop, Richard, "Maximizing Lead-free Wetting," Surface Mount Technology (SMT) , vol. 19 no. 1, pp. 44, Jan. 2005.

Lathrop, Richard, "New Generation Lead Free Solder Paste Void Performance," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Lathrop, Rick, "BGA Coplanarity Reduction During the Ball Attach Process," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Lathrop, Rick, Sy, Hansen, Schultze, Juergen, Ratner, Steve, Lopez, Martin, McConnell, Bill, McMaster, John, Murch, Frank, and Skrzat, Mike, "Dippable Solder Paste: Boosting Yields in BGA Asembly," Chip Scale Review, pp. 12-15, Aug./Sept. 2009.

Lathrop, Rick, "Semiconductor Packaging Solutions Utilizing Fine Powder Solder Paste," SMTA International Wafer-Level Packaging Conference, San Jose, CA, Oct. 13-16, 2008, pp. xx-xx.

Latif, A., Rafiq, M. S., Bhatti, K. A., and Mahmood, N., "Surface and structural investigations on laser irradiated P-type silicon," Radiation Effects and Defects in Solids, vol. 169 no. 6, pp. 506-512, 2014. https://doi.org/10.1080/10420150.2013.879138

Lau, Chun-Sean, Abdullah, Mohd Zulkifly, and Ani, Fakhrozi Che, "Effect of Solder Joint Arrangements on BGA Lead-Free Reliability During Cooling Stage of Reflow Soldering Process," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 12, pp. 2098-2107, Dec. 2012.

Lau, Chun-Sean, Abdullah, M. Z., and Ani, F. Che, "Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method," Microelectronics Reliability, vol. 52 no. 6, pp. 1143-1152, June 2012.

Lau, Chun-Sean, Abdullah, M. Z., and Khor, C. Y., "Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey-based Taguchi method," Microelectronics International, vol. 30 no. 3, pp. 151-168, 2013.

Lau, Chun Sean, Khor, C. Y., Soares, D., Teixeira, J. C., and Abdullah, M. Z., "Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review," Soldering & Surface Mount Technology , vol. 28 no. 2, pp. 41-62, 2016.

Lau, David, Turbini, Laura J., Liu, Julie, and Zhou, Y. Norman, "Evaluation of Halogen-Free Laminates Used in Handheld Electronics," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 867-871.

Lau, David, Zhou, Y. Norman, Liu, Julie, Cooray, Madusha, and Turbini, Laura J., "Experimental Techniques for Characterizing the Thermal and Mechanical Properties of Halogen-Free Laminates," International Conference on Soldering & Reliability 2010 Proceedings, Toronto, Ontario, Canada, May 17-20, 2010, pp. xx-xx.

Lau, F. L., Made, Riko I., Putra, W. N., Lim, J. Z., Nachiappan, V. C., Aw, J. L., and Gan, C. L., "Electrical behavior of Au-Ge eutectic solder under aging for solder bump application in high temperature Electronics," Microelectronics Reliability, vol. 53 no. 9-11 pp. 1581-1586, Sept.-Nov. 2013.

Lau, J., Chu, J., Chen, W., Khaw, R., Cheng, M., and Lee, J., "3D X-ray Tests and Analyses of Lead-Free PBGA (Plastic Ball Grid Array) Package Solder Joints," 2004 SMTA International Conference Proceedings , Chicago, IL, Sept. 26-30, 2004, pp. 593-605.

Lau, J., Mei, Z., Pang, S., Amsden, C., Rayner, J., and Pan, S., "Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch," Journal of Electronic Packaging, Transactions of the ASME, vol. 124 no. 4, pp. 403-410, Dec. 2002.

Lau, J. H., "Creep of 96.5Sn3.5Ag Solder Interconnects," Soldering & Surface Mount Technology, vol. 5 no. 3, pp. 45-52, 1993.

Lau, J. H., "Electronics Packaging Technology Update: BGA, CSP, DCA and Flip Chip," Circuit World, vol. 23 no. 4, pp. xx-xx, 1997.

Lau, John H., Pan, Stephen H., and Xu, Chen, "3D Large Deformation and Nonlinear Stress Analyses of Tin Whisker Initiation and Growth on Lead-Free Components," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 692-697.

Lau, John H., and Pan, Stephen H., "3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components," 2002 NEPCON West - Fiberoptic Expo Conference Proceedings , 2002, pp. 293-297.

Lau, John H., and Pan, Stephen H., "3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components," Journal of Electronic Packaging, vol. 125 no. 4, pp. 621-624, Dec. 2003. https://doi.org/10.1115/1.1604805

Lau, John, Lee, Ricky, Dauksher, Walter, Shangguan, Dongkai, Song, Fubin, and Lau, Dennis, "A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B, San Francisco, CA, July 17-22, 2005, pp. 1021-1029.

Lau, John, Dauksher, Walter, and Vianco, Paul, "Acceleration Models, Constitutive Equations, and Reliability of Lead-Free Solders and Joints," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 229-236.

Lau, John H., "Bending and Twisting of 96.5Sn3.5Ag and 97.5Pb2.5Sn Solder Interconnects with Creep," 1994 Proceedings 44th Electronic Components & Technology Conference, Washington, D.C., May 1-4, 1994, pp. 1108-1114.

Lau, John H., and Lee, S-W. Ricky, "Computational Analysis on the Effects of Double-Layer Build-Up Printed Circuit Board on the Wafer Level Chip Scale Package (WLCSP) Assembly with Pb-Free Solder Joints," The International Journal of Microcircuits and Electronic Packaging, vol. 24 no. 2, pp. 89-104, Second Quarter 2001.

Lau, John H., Pan, Stephen H., and Chang, Chris, "Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board," Journal of Electronic Packaging, Transactions of the ASME , vol. 124 no. 2, pp. 69-76, June 2002.

Lau, John H., and Pan, Stephen H., "Creep Behaviors of Flip Chip on Board With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints." Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 866-873.

Lau, John H., and Pan, Stephen H., "Creep Behaviors of Flip Chip on Board With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints." The International Journal of Microcircuits and Electronic Packaging, vol. 24 no. 1, pp. 11-18, 1st Quarter 2001.

Lau, John, and Dauksher, Walter, "Creep of Sn-(3.5-3.9)wt%Ag-(0.5-0.8)wt%Cu Lead-Free Solder Alloys and Their Solder Joint Reliability," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S16-1-1-S16-1-10.

Lau, John H., "Critical Issues of Wafer Level Chip Scale Package (WLCSP) with Emphasis on Cost Analysis and Solder Joint Reliability," Twenty-Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium, Santa Clara, CA, Oct. 2-3, 2000, pp. 33-46.

Lau, John H., "Critical Issues of Wafer Level Chip Scale Package (WLCSP) With Emphasis on Cost Analysis and Solder Joint Reliability," IEEE Transactions on Electronics Packaging Manufacturing, vol. 25 no. 1, pp. 42-50, Jan. 2002.

Lau, John, Dauksher, Walter, Smetana, Joe, Horsley, Rob, Shangguan, Dongkai, Castello, Todd, Menis, Irv, Love, Dave, and Sullivan, Bob, "Design for lead-free solder joint reliability of high-density packages," Soldering & Surface Mount Technology, vol. 16 no. 1, pp. 12-26, 2004.

Lau, John, Gleason, Jerry, Schroeder, Valeska, Henshall, Gregory, Dauksher, Walter, and Sullivan, Bob, "Design, materials, and assembly process of high-density packages with a low-temperature lead-free solder (SnBiAg)," Soldering & Surface Mount Technology, vol. 20 no. 2, pp. 11-20, 2008.

Lau, John, Lo, Jeffrey, Lam, Jimmy, Soon, Eng-Leong, Chow, Woai-Sheng, and Lee, Ricky, "Effects of Aging and Underfills on Mechanical-Drop Tests of SnAgCu PBGA (Plastic Ball Grid Array) Packages on ImAg PCB (Printed Circuit Board)," 9th International Conference on Electronic Materials and Packaging , Daejon, Korea, Nov. 19-22, 2007, pp. xx-xx.

Lau, John, and Dauksher, Walter, "Effects of Ramp-Time on the Thermal-Fatigue Life of SnAgCu Lead-Free Solder Joints," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 1292-1298.

Lau, John, Lo, Jeffrey, Lam, Jimmy, Soon, Eng-Leong, Chow, Woai-Sheng, and Lee, Ricky, "Effects of Underfills on the Thermal-Cycling Tests of SnAgCu PBGA (Plastic Ball Grid Array) Packages on ImAg PCB (Printed Circuit Board)," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 785-790.

Lau, John H., "Elastic, elastic-plastic and creep analyses of wafer level chip scale package solder joints on microvia build-up printed circuit boards," Circuit World, vol. 27 no. 1, pp. 20-31, 2000.

Lau, John, Shangguan, Dongkai, Castello, Todd, Horsley, Rob, Smetana, Joe, Hoo, Nick, Dauksher, Walter, Love, Dave, Menis, Irv, and Sullivan, Bob, "Failure analysis of lead-free solder joints for high-density packages," Soldering & Surface Mount Technology, vol. 16 no. 2, pp. 69-76, 2004.

Lau, John, Castello, Todd, Shangguan, Dongkai, Dauksher, Walter, Smetana, Joe, Horsley, Rob, Love, Dave, Menis, Irv, and Sullivan, Bob, "Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) Package," Journal of Microelectronics and Electronic Packaging, Vol. 4 no. 3, pp. 112-120, Third Quarter 2007.

Lau, John H., "Flip Chip on PCBs with Anisotropic Conductive Film," Advanced Packaging , vol. 7 no. 6, Jul-Aug. 1998, pp. 44,46-48.

Lau, John H., and Liu, Katrina, "Global Trends in Lead-free Soldering, Part I," Advanced Packaging , vol. 13 no. 2, pp. 25-28, Feb. 2004.

Lau, John H., and Liu, Katrina, "Global Trends in Lead-free Soldering, Part II," Advanced Packaging , vol. 13 no. 2, pp. xx-xx, Feb. 2004.

Lau, John, Dauksher, Walter, Smetana, Joe, Horsley, Rob, Shangguan, Dongkai, Castello, Todd, Menis, Irv, Love, Dave, and Sullivan, Bob, "HDPUG's Design for Lead-Free Solder Joint Reliability of High-Density Packages," IPC SMEMA Council APEX 2003, Anaheim, CA, Mar. 31- Apr. 2, 2003, pp. xx-xx.

Lau, John, Shangguan, Don Castello, Todd, Horsley, Rob, Smetana, Joe, Hoo, Nick, Dauksher, Walter, Love, Dave, Menis, Irv, and Sullivan, Bob, "HDPUG's Failure Analysis of High-Density Packages' Lead-Free Solder Joints," IPC SMEMA Council APEX 2003, IPC SMEMA Council APEX 2003, Anaheim, CA, Mar. 31-Apr. 2, 2003, pp. S43-4-1 to S42-4-11.

Lau, John H., "Impacts of RoHS (e.g., Pb) on Electronics Products."

Lau, John, Lee, S. W. Ricky, Song, Fubin, Lau, Dennis, and Shangguan, Dongkai, "Isothermal Fatigue Tests Of Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints At 60°C," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1476-1483.

Lau, John H., "Key differences between EU RoHS and China RoHS (As of August 7, 2006)," Global SMT and Packaging, vol. 6 no. 9, pp. 10-13, Oct. 2006.

Lau, John, Shangguan, Dongkai, Dauksher, Walter, Khoo, David, Fan, Gladys, Loong-Fee, Wong, and Sanciaume, Maurice, "Lead-Free Wave Soldering and Reliability of Light-Emitting Diode (LED) Display Assemblies." IPC and Soldertec Global Conference on Lead Free Electronics, Brussels, Belgium, June 11-12, 2003, pp. xx-xx.

Lau, John H., Pang, John H. L., Lee, Ning-Cheng, and Xu, Luhua, "Material Properties and Intermetallic Compounds of Sn3wt%Ag0.5wt%Cu0.019wt%Ce (SACC)," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 211-218.

Lau, John H., and Lee, S.-W. Ricky, "Modeling and Analysis of 96.5Sn-3.5Ag Lead-Free Solder Joints of Wafer Level Chip Scale Package on Buildup Microvia Printed Circuit Board, IEEE Transactions on Electronics Packaging Manufacturing, vol. 25 no. 2, pp. 51-58, Apr. 2002.

Lau, John, Liu, Sang, Shangguan, Dongkai, Song, Zhi Wei, and Geiger, David, "Process Development and Solder Joint Reliability of a New Lead-Free Solder: Sn3wt%Ag0.5wt%Cu0.019wt%Ce (SACC)," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 546-552.

Lau, John, Chen, Ray, and Chang, Chris, "Real-Time Popcorn Analysis of Plastic Ball Grid Array Packages During Solder Reflow," Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, Oct. 19-21, 1998, pp. 455-463.

Lau, John H., "Recent Advances and New Trends in Flip Chip Technology," Journal of Electronic Packaging, vol. 138 no. 3, pp. 030802-1-030802-23, Sept. 2016.

Lau, John H., and Lee, S. W. Ricky, "Reliability of 96.5Sn-3.5Ag Lead-Free Solder-Bumped Wafer Level Chip Scale Package (WLCSP) on Build-Up Microvia Printed Circuit Board," 2001 HD International Conference on High-Density Interconnect and Systems Packaging (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4428), Santa Clara, CA, Apr. 17-20, 2001, pp. 314-322.

Lau, John, and Dauksher, Walter, "Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5Sn3.9Ag0.6Cu Lead-Free Solder Paste on PCBS (Printed Circuit Boards)," Journal of Electronic Packaging, Transactions of the ASME, vol. 127 no. 2, pp. 96-105, June 2005.

Lau, John H., "Reliability of Lead-Free Solder Joints," Journal of Electronic Packaging, vol. 128 no. 3, pp. 297-301, Sept. 2006.

Lau, John H., Tse, Po, Richard, Edward, Dauksher, Walter, Shangguan, Dongkai, and Pang, John H. L., "Reliability of Sn3wt%Ag0.5wt%Cu0.019wt%Ce (SACC) Solder Joints," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 415-422.

Lau, John H., and Lee, S. W. Ricky, "Reliability of Wafer Level Chip Scale Package (WLCSP) with 96.5Sn-3.5Ag Lead-Free Solder Joints on Build-Up Microvia Printed Circuit Board," International Symposium on Electronic Materials and Packaging, Hong Kong, China, Nov. 30-Dec. 2, 2000, pp. 55-63.

Lau, John, Gleason, Jerry, Schroeder, Valeska, Henshall, Gregory, Dauksher, Walter, and Sullivan, Bob, "Reliability test and failure analysis of high-density packages assembled with a low-temperature lead-free solder (SnBiAg)," Soldering & Surface Mount Technology, vol. 20 no. 2, pp. 21-29, 2008.

Lau, John, Dauksher, Walter, Ott, Ed, Shangguan, Dongkai, Smetana, Joe, Horsley, Rob, Castello, Todd, Love, Dave, Menis, Irv, and Sullivan, Bob, "Reliability Testing and Data Analysis of an 1657CCGA (Ceramic Column Grid Array) Package with Lead-Free Solder Paste on Lead-Free PCBs (Printed Circuit Boards)," Proceedings of 2004 Electronic Components and Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 718-725.

Lau, John, Hoo, Nick, Horsley, Rob, Smetana, Joe, Shangguan, Dongkai, Dauksher, Walter, Love, Dave, Menis, Irv, and Sullivan, Bob, "Reliability Testing and Data Analysis of High-Density Packages' Lead-Free Solder Joints," IPC SMEMA Council APEX 2003, IPC SMEMA Council APEX 2003, Anaheim, CA, Mar. 31-Apr. 2, 2003, pp. S42-3-1 to S42-3-24.

Lau, John H., "Reliability testing and data analysis of lead-free solder joints," Chip Scale Review, vol. 24 no. 5, pp. 43-50, Sept.-Oct, 2020.

Lau, John, Hoo, Nick, Horsley, Rob, Smetana, Joe, Shangguan, Dongkai, Dauksher, Walter, Love, Dave, Menis, Irv, and Sullivan, Bob, "Reliability testing and data analysis of lead-free solder joints for high-density packages," Soldering & Surface Mount Technology, vol. 16 no. 2, pp. 46-68, 2004.

Lau, John H., "Reliability Tests of Lead Free Solder Joints," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S40-03-1-S40-03-11.

Lau, John H., "Status of EU RoHS exemptions," emsnow, June 29, 2006.

Lau, John H., and Lee, S. W. Ricky, "Temperature-Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics Method," Journal of Electronic Packaging, Transactions of the ASME, vol. 122 no. 1, pp. 34-41, Mar. 2000.

Lau, John, Song, Fubin, Lau, Dennis C., Lee, S. W. Ricky, Shangguan, Dongkai, and Dauksher, Walter, "Thermal-Fatigue Life Prediction Equation for Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B , San Francisco, CA, July 17-22, 2005, pp. 1013-1019.

Lau, John H., Shangguan, Dongkai, Lau, Dennis C. Y., Kung, Terry T. W., and Lee, S. W. Ricky, "Thermal-Fatigue Life Prediction Equation for Wafer-Level Chip Scale Package (WLCSP) Lead-Free Solder Joints on Lead-Free Printed Circuit Board (PCB)," Proceedings of 2004 Electronic Components and Technology Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1563-1569.

Lau, John, and Dauksher, Walter, "Thermal Stress Analysis Of A Flip-Chip Parallel VCSEL (Vertical-Cavity Surface-Emitting Laser) Package With Low-Temperature Lead-Free (48Sn-52In) Solder Joints," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1009-1017.

Lau, John H., and Chang, Chris, "TMA, DMA, DSC, and TGA of Lead Free Solders," 1998 Proceedings 48th Electronic Components & Technology Conference, Seattle, WA, May 25-28, 1998, pp. 1339-1344.

Lau, John H., and Chang, Chris, "TMA, DMA, DSC and TGA of lead free solders," Soldering & Surface Mount Technology, vol. 11 no. 2, pp, 17-24, 1999.

Lau, John H., "Update of EU RoHS exemptions (as of July 7, 2006)," Global SMT and Packaging, vol. 6 no. 7, pp. 10-12, 14-15, Aug. 2006.

Lau, John, and Liu, Katrina, "Update of Global Trends in Lead-Free Soldering," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 810-830.

Lau, K. J., Tang, C. Y., Tse, P. C., Chow, C. L., Ng, S. P., Tsui, C. P., and Rao, B., "Microscopic experimental investigation on shear failure of solder joints," International Journal of Fracture, vol. 130 no. 3, pp. 617-634, Dec. 2004.

Lau, Winifred Ka-Yan, Chung, Shan-Shan, and Zhang, Chan, "A material flow analysis on current electrical and electronic waste disposal from Hong Kong households," Waste Management, vol. 33 no. 3, pp. 714-721, Mar. 2013.

Laugt, Anne-Marie, Evers, P. C. J., Caban, D., Wilczek, P., and Spilka, G., "Optimization of lead free solder paste for robust process and reliable solder joint," 7th IEEE CPMT International Conference on High Density Microsystem Design, Packaging and Failure Analysis, Shanghai, June 28, 2005, pp. xx-xx.

Laukonis, J. V., and Coleman, R. V., "High-Temperature Oxidation of Iron Whiskers," Journal of Applied Physics, vol. 30 no. 9, pp. 1364-1368, Sept. 1959.

Laukonis, J. V., and Coleman, R. V., "Iron Whisker Surface Rearrangements Resulting from the Hydrogen Reduction of Oxides and from Thermal Etching," Journal of Applied Physics, vol. 32 no. 2, pp. 242-247, Feb. 1961.

Laurilla, T., Vuorinen, V., Mattila, T., and Kivilahti, J. K., "Analysis of the Redeposition of AuSn4 on Ni/Au Contact Pads when Using SnPbAg, SnAg, and SnAgCu Solders," Journal of Electronic Materials , vol. 34 no. 1, pp. 103-111, Jan. 2005.

Laurila, T., Hurtig, J., Vuorinen, V., and Kivilahti, J. K., "Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layers," Microelectronics Reliability, vol. 49 no. 3, pp. 242-247, Mar. 2009.

Laurila, T., Karppinen, J., Vuorinen, V., Paul, A., and Paulasto-Krockel, M., "Effect of Constant and Cyclic Current Stressing on the Evolution of Intermetallic Compound Layers," Journal of Electronic Materials, vol. 40 no. 7, pp. 1517-1526, July 2011.

Laurila, T., Karppinen, J., Vuorinen, V., Li, J., Paul, A., and Paulasto-Krockel, M., "Effect of Isothermal Aging and Electromigration on the Microstructural Evolution of Solder Interconnections During Thermomechanical Loading," Journal of Electronic Materials, vol. 41 no. 11, pp. 3179-3195, Nov. 2012.

Laurila, T., Karppinen, J., Li, J., Vuorinen, V., and Paulasto-Krockel, M., "Effect of isothermal annealing and electromigration pre-treatments on the reliability of solder interconnections under vibration loading," Journal of Materials Science: Materials in Electronics, vol. 24 no. 2, pp. 644-653, Feb. 2013.

Laurila, T., Mattila, T., Vuorinen, V., Karppinen, J., Li, J., Sippola, M., and Kivilahti, J. K., "Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests," Microelectronics Reliability, vol. 47 no. 7, pp. 1135-1144, July 2007.

Laurila, T., Vuorinen, V., and Kivilahti, J. K., "Interfacial reactions between lead-free solders and common base materials," Materials Science and Engineering R: Reports, vol. 49 no. 1-2, pp. 1-60, Mar. 24, 2005. https://doi.org/10.1016/j.mser.2005.03.001

Laurila, T., Hongqun, D., and Vuorinen, V., "Interfacial reactions between SnAg1.0Ti and Ni metallization," Journal of Materials Science: Materials in Electronics, vol. 23 no. 11, pp. 2030-2034, Nov. 2012.

Laurila, Tomi, and Paul, Aloke, "Understanding the Effect of Electromigration on the Growth of Interfacial Reaction Layers in Cu-Sn and Cu-Ni-Sn Systems," 2014 Electronics System-Integration Technology Conference, Helsinki, Finland, Sept. 16-18, 2014, pp. xx-xx.

Laurin, Lisa, Goedkoop, Mark, and Norris, Gregory, "Automated LCA -- a practical solution for electronics manufacturers?," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 6-8.

Laurin, Lise, Prox, Martina, Moeller, Andreas, and Schmidt, Mario, "How production-theory can support the analysis of recycling systems in the electronic waste sector," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 272-275.

Lauro, Paul, Kang, Sung K., Choi, Won Kyoung, and Shih, Da-Yuan, "Effects of Mechanical Deformation and Annealing on the Microstructure and Hardness of Pb-Free Solders," Journal of Electronic Materials, vol. 32 no. 12, pp. 1432-1440, Dec. 2003.

Lausmann, G. A., "Current industrial practices Electrolytically deposited hardchrome," Surface and Coatings Technology, vol. 86-87 no. 1-3 part 2, pp. 814-820, Dec 15, 1996.

Lavery, Patrick, "Strategies to Mitigate the Tin Whisker Phenomenon, Rev. 1.1" Vicor Corp., Feb. 2006.

Lavery, Patrick, "Tin whiskers and RoHS: a perspective," Electronic Products, vol. 49 no. 4, pp. 93, Sept. 2006.

Lavine, Charles F., and Ewald, A. W., "Two-Band Galvanomagnetic Effects in Gray Tin," Journal of Physics and Chemistry of Solids, vol. 32 no. 6, pp. 1121-1140, 1971.

Lavoie, Helene, Paquet, Marie-Claude, Sylvestre, Julien, Ouimet, Sylvain, Duchesne, Eric, Barbeau, Stephane, Gauvin, Marco, and Oberson, Valerie, "From Leaded to Lead Free Assembly and New Packaging Technology Challenges," 2007 Proceedings 57th Electronic Components & Technology Conference , Reno, NV, May 29-June 1, 2007, pp. 1333-1339.

Lavoie, Ron, and McMordie, Bruce G., "Measuring Surface Finish of Compressor Airfoils Protected by Environmentally Resistant Coatings," 30th Aerospace/Airline Plating & Metal Finishing Forum, 1994, pp. xx-xx.

Law, C. M. T., Wu, C. M. L., Yu, D. Q., Li, M., and Chi, D. Z., "Interfacial Microstructure and Strength of Lead-Free Sn-Zn-RE BGA Solder Bumps," IEEE Transactions on Advanced Packaging, vol. 28 no. 2, pp. 252-258, May 2005.

Law, C. M. T., and Wu, C. M. L., "Microstructure Evolution and Shear Strength of Sn-3.5Ag-RE Lead-free BGA Solder Balls," Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis , Shanghai, China, June 30-July 3, 2004, pp. 60-65.

Law, C. M. T., Wu, C. M. L., Yu, D. Q., Wang, L., and Lai. J. K. L., "Microstructure, Solderability, and Growth of Intermetallic Compounds of Sn-Ag-Cu RE Lead-Free Solder Alloys," Journal of Electronic Materials , vol. 35 no. 1, pp. 89-93, Jan. 2006.

Law, Matt, Goldberger, Joshua, and Yang, Peidong, "Semiconductor Nanowires and Nanotubes," Annual Review of Materials Research 2004, vol. 34 no. 1, pp. 83-122, 2004.

Lawrence, Brigitte, and Eichhorst, Timothy, "Getting the Lead Out of Hot Air Soldering," CircuiTree, vol. 17 no. 10, pp. xx, Oct. 2004.

Lawrence, Tim, Soderstrom, Stanley, and Wilding, Ian, "Lead-free: VOC-free Flux Deposition Reduces Defects," Surface Mount Technology (SMT), vol. 20 no. 2, pp. 52-53, Feb. 2006.

Lawrence, Tim, Wilding, Ian, and Chowdhary, Balvinder, "The Solvent of Choice," Multicore Solders.

Lay, Douglas E., "Decorative Tin-Nickel: An Attractive Alternative," Plating & Surface Finishing, vol. 75 no. 7, pp. 26-28, July 1988.

Lay, Douglas E., and Eckles, Willaim E., "The Fundamentals of Zinc/Cobalt," Plating & Surface Finishing , vol. 77 no. 10, pp. 10-14, Oct. 1990.

Layton, D. N., "Alternatives to Cadmium Plate," Transactions of the Institute of Metal Finishing, vol. 43, pp. 153-160, 1965.

Lazzarini, Laura, and Rotunno, Enzo, "Crystal structure assessment of Ge-Sb-Te nanowires," Materials Science in Semiconductor Processing, vol. 65, pp. 77-87, July 2017.

Le, Huang, Qian, Wang, and Jusheng, Ma, "The Study on the Novel Lead-Free Solder Alloy," International Symposium on Electronic Materials and Packaging, Hong Kong, China, Nov. 30-Dec. 2, 2000, pp. 191-193.

Le, Van Nhat, Benabou, Lahouari, Etgens, Victor, and Tao, Quang Bang, "Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling," Microelectronics Reliability, vol. 65, pp. 243-254, Oct. 2016.

Le, Van-Nhat, Benabou, Lahouari, Tao, Quang-Bang, and Etgens, Victor, "Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module," International Journal of Solids & Structures, vol. 106-107, pp. 1-12, Feb. 2017.

Le, W. K., Ning, X., Ke, C. B., Zhou, M. B., and Zhang, X. P., "Current density dependent shear performance and fracture behavior of micro-scale BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints under coupled electromechanical loads," Journal of Materials Science: Materials in Electronics, vol. 30 no. 16, pp. 15184-15197, Aug. 2019.

Le, W. K., Zhou, J. Y., Ke, C. B., Zhou, M. B., and Zhang, X. P., "Study of accelerated shear creep behavior and fracture process of micro-scale ball grid array (BGA) structure Cu/Sn-3.0Ag-0.5Cu/Cu joints under coupled electro-thermo-mechanical loads," Journal of Materials Science: Materials in Electronics, vol. 31 no. 18, pp. 15575-15588, Sept. 2020.

Le, Wen-Kai, Ning, Xiang, Huang, Jia-Qiang, Zhou, Min-Bo, and Zhang, Xin-Ping, "Effect of electric current stressing on the shear strength and fracture behavior of micro-scale BGA structured Cu/Sn-3.0Ag-0.5Cu/Cu joints," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 610-614.

Le, Wen-Kai, Sun, Tao, Zhou, Jie-Ying, Zhou, Min-Bo, and Zhang, Xin-Ping, "Effect of loading rate on the shear performance and fracture behavior of micro-scale BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints under coupled electromechanical loads," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Le, Wen-Kai, Zhu, Zhi-Wei, Cao, Shanshan, and Zhang, Xin-Ping, "Shear creep and fracture behavior of micro-scale BGA structured Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads," 2018 19th International Conference on Electronic Packaging Technology , Shanghai, China, Aug. 8-11, 2018, pp. 620-624.

Lea, C., and Tilbrook, D., "Moisture Induced Failure in Plastic Surface Mount Packages," Soldering & Surface Mount Technology, vol. 1 no. 3, pp. 30-34, 1989.

Lea, Colin, "A PAST event; a present situation; a future opportunity," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, Sept. 2003.

Lea, Colin, "Solderability and its measurement," Engineering Science and Education Journal, vol. 2 no. 2, pp. 77-84, Apr, 1993.

Lea, Deborah, Dusek, Milos, Jonck, Fredirikus, and Hunt, Christopher, "Solderability of Electrical Components and Copper using Lead-Free Alloys," NPL Report CMMT(A)284, Sept. 2000.

LeBret, J. B., and Norton, M. G., "Electron microscopy study of tin whisker growth," Journal of Materials Research, vol. 18 no. 3, pp. 585-593, Mar. 2003.

Lee, Andre, Subramanian, K. N., and Lee, Jong-Gi, "Development of Nanocomposite Lead-Free Electronic Solders," IEEE/CPMT International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, CA, Mar. 16-18, 2005, pp. 276-281.

Lee, Andre, and Subramanian, K. N., "Development of Nano-Composite Lead-Free Electronic Solders," Journal of Electronic Materials, vol. 34 no. 11, pp. 1399-1407, Nov. 2005.

Lee, B.-Z., and Lee, D. N., "Spontaneous growth mechanism of tin whiskers," Acta Materialia, vol. 46 no. 10, pp. 3701-3714. June 12, 1998.

Lee, BabHui, "Implementing a Simple Corrosion Test Methodology for Early Detection of "Black Pad" Phenomenon in Electroless Nickel/Immersion Gold Plating," ," HKPCA Journal, no. 9, pp. 1-10.

Lee, BabHui, "Implementing a Simple Corrosion Test Method to Detect "Black Pad" Phenomenon in Electroless Nickel/Immersion Gold Plating," CircuiTree, vol. 16 no. 11, pp. xx, Nov. 2003.

Lee, Boon-Ho, Chang, Chun-Yu, Li, Chih-Hsiang, Lin, Kuo-Shu, Yueh, Shih-Lo, and Kobayashi, Seiji, "New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly," SMTA ?

Lee, Brent, "PVD Chrome as a Replacement of Hexavalent Chrome," Proceedings AESF SUR/FIN '96, Cleveland, OH, June 10-13, 1996, pp. 615-620.

Lee, Brent, "PVD Chromium As a Replacement For Hexavalent Chromium," Plating & Surface Finishing, vol. 84 no. 3, pp. 16-19, Mar. 1997.

Lee, Byeong-Joo, and Lee, Hyuck Mo, "Alloy Design of Sn-Ag-In-Bi-Sb Solder System Using Thermodynamic Calculations," Design & Reliability of Solders and Solder Interconnections, Orlando, FL, Feb. 10-13, 1997, pp. 129-136.

Lee, Byeong-Joo, "Thermodynamic Assessments of the Sn-Zn and In-Zn Binary Systems," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 20 no. 4, pp. 471-480, Dec. 1996.

Lee, Byung-Suk, and Yoon, Jeong-Won, "Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications," Journal of Electronic Materials, vol. 47 no. 1, pp. 430-435, Jan. 2018.

Lee, Byung-Suk, Ko, Yong-Ho, Bang, Jung-Hwan, Lee, Chang-Woo, Yoo, Sehoon, Kim, Jun-Ki, and Yoo, Jeong-Won, "Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications," Microelectronics Reliability, vol. 71, pp. 119-125, Apr. 2017.

Lee, Byunghoon, Jeon, Haseok, Jeon, Seong-Jae, Kwon, Kee-Won, and Lee, Hoo-Jeong, "A Study on the Breakdown Mechanism of an Electroless-Plated Ni(P) Diffusion Barrier for Cu/Sn/Cu 3D Interconnect Bonding Structures," Journal of Electronic Materials, vol. 41 no. 1, pp. 109-114, Jan. 2012.

Lee, Byunghoon, Park, Jongseo, Song, Junghyun, Kwon, Kee-won, and Lee, Hoo-jeong, "Effects of Bonding Temperature and Pressure on the Electrical Resistance of Cu/Sn/Cu Joints for 3D Integration Applications," Journal of Electronic Materials, vol. 40 no. 3, pp. 324-329, Mar. 2011.

Lee, Byunghoon, Lip, Gan Chee, and Lee, Hoo-Jeong, "Evaluation of Mechanical Property of Sn-Ag Bonding Layer Adopting Ni(P)/Cu Bi-layer Diffusion Barrier for 3D integration," 2013 IEEE 15th Electronics Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp. 489-492.

Lee, Byunghoon, and Lee, Hoo-jeong, "Microstructure Evolution of Cu/Sn/Cu Bonding Stacks Impacts on their Mechanical Properties," 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Incheon, South Korea, July 4-7, 2011, pp. xx-xx.

Lee, C. B., and Yu, Danny, "RoHS and Green Compliance in IC Packages," IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies, Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.

Lee, C. C., Chuang, H. Y., Chung, C. K., and Kao, C. Robert, "Oxidation behavior of ENIG and ENEPIG surface finish," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Lee, C. S., and Shieu, F. S., "Growth of Intermetallic Compounds in the Sn-9Zn/Cu Joint," Journal of Electronic Materials, vol. 35 no. 8, pp. 1660-1664, Aug. 2006.

Lee, C. W., Shin, Y. S., and Yoo, S. H., "Effect of SiC Nanoparticles Dispersion on the Microstructure and Mechanical Properties of Electroplated Sn-Bi Solder Alloy," Journal of Nano Research, vol. 11, pp. 113-118, May 2010.

Lee, C.-W., Shin, Y.-S., and Kim, J.-H., "Precise Quantitative Evaluation of Nano-Ordered Intermetallic Compounds in Sn-3.0Ag-0.5Cu Lead-Free Solder Bump by Using TEM," Advanced Materials Research, vol. 47-50, pp. 907-911, 2008.

Lee, Chang-Bae, Jung, Seung-Boo, Shin, Young-Eui, and Shur, Chang-Chae, "Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder," Materials Transactions, vol. 43 no. 8, pp. 1858-1863, Aug. 2002.

Lee, Chang-Bae, Yoon, Jeong-Won, Suh, Su-Jeong, Jung, Seung-Boo, Yang, Cheol-Woong, Shur, Chang-Chae, and Shin, Young-Eui, "Intermetallic compound layer formation between Sn-3.5 mass %Ag BGA solder ball and (Cu, immersion Au/electroless Ni-P/Cu) substrate," Journal of Materials Science: Materials in Electronics, vol. 14 no. 8, pp. 487-493, Aug. 2003.

Lee, Chang-Bae, Jung, Seung-Boo, Shin, Young-Eui, and Shur, Chang-Chae, "The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders," Materials Transactions, vol. 42 no. 5, pp. 751-755, May 2001.

Lee, Chang-Chun, Yang, Tsung-Fu, Kao, Kuo-Shu, Cheng, Ren-Chin, and Zhan, Chau-Jie, "Assembly Analysis of Cu/Ni/SnAg Microbump for Stacking Thin Chips in a Fine Pitch Package Using a Wafer-level Underfill," 2012 14th International Conference on Electronic Materials and Packaging, Hong Kong, Dec. 13-16, 2012, pp. xx-xx.

Lee, Chang-Chun, Yang, Tsung-Fu, Kao, Kuo-Shu, Cheng, Ren-Chin, Zhan, Chau-Jie, and Chen, Tai-Hong, "Development of Cu/Ni/SnAg Microbump Bonding Processes for Thin Chip-on-Chip Packages Via Wafer-Level Underfill Film ," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 9, pp. 1412-1419, Sept. 2012.

Lee, Chang-Chun, Yang, Tsung-Fu, Kao, Kuo-Shu, Cheng, Ren-Chin, Zhan, Chau-Jie, and Chen, Tai-Hong, "Evaluation of Cu/Ni/SnAg Microbump Bonding Processes for Thin-chip-on-chip Package using a Wafer-Level Underfill Film," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , San Diego, CA, May 30-June 1, 2012, pp. 385-391.

Lee, Chang-Chun, Chang, Kuo-Chin, and Yang, Ya-Wen, "Lead-free solder joint reliability estimation of flip chip package using FEM-based sensitivity analysis," Soldering & Surface Mount Technology, vol. 21 no. 1, pp. 31-41, 2009.

Lee, Chang-Chun, and Lin, Po Ting, "Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps," Journal of Electronic Packaging, vol. 136 no. 3, pp. 031006-1-031006-9, Sept. 2014.

Lee, Chang Hoon, and Loh, Karl I., "Fine Pitch COG Interconnections Using Anisotropically Conductive Adhesives," 1995 Proceedings 45th Electronic Components & Technology Conference , Las Vegas, NV, May 21-24, 1995, pp. 121-125.

Lee, Chang Hoon, and Loh, Karl I., "Fine Pitch COG Interconnections Using Anisotropically Conductive Adhesives," Proceedings of the Technical Program NEPCON West '96, Volume 2, Anaheim, CA, Feb. 25-29, 1996, pp. 956-967.

Lee, Chang-Woo, Ko, Young-Ki, Bang, Jung-Hwan, and Yoo, Sehoon, "Joint Properties of Sn-3.5Ag Solder Balls with Surface Embedded Carbon Nanotube," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 331-334.

Lee, Chang-Yong, Yoon, Jeong-Won, Kim, Young-Jig, and Jung, Seung-Boo, "Interfacial reactions and joint reliability of Sn-9Zn solder on Cu or electrolytic Au/Ni/Cu BGA substrate," Microelectronic Engineering , vol. 82 no. 3-4, pp. 561-568, Dec. 2005.

Lee, Charles, Wong, Teck Chin, and Pape, Heinz, "A New Leadframe Design Solution for Improved Popcorn Cracking Performance," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 21 no. 1, pp. 3-12, Mar. 1998.

Lee, Charles, Hoesler, Wolfgang, Cerva, Hans, von Criegern, Rolf, and Parthasarathi, Arvind, "A Novel High Performance Adhesion Enhancing Zn-Cr Leadframe Coating for Popcorn Prevention," IEEE Transactions on Advanced Packaging, vol. 22 no. 3, pp. 398-406, Aug. 1998.

Lee, Charles, Hosler, Wolfgang, Cerva, Hans, von Criegern, Rolf, and Parthasarathi, Arvind, "An Analytical Characterization and Reliability Testing of an Adhesion Enhancing Zn-Cr Leadframe Coating for Popcorn Prevention," 1998 Proceedings 48th Electronic Components & Technology Conference, Seattle, WA, May 25-28, 1998, pp. 1154-1161.

Lee, Charles, and Yeo, Alfred, "Resistance Characterization of Flip Chip Joint formed Using Au Bumps and Anisotropic Conductive Adhesives," 2003 5th Conference on Electronics Packaging Technology, Dec 10-12, 2003, pp. 369-375.

Lee, Chee Kan, Rebsom, Derek, Loh, Wei Keat, Ng, Hui Ping, and Lau, Kam Wah, "The Next Generation of Quick Turn Method for Interfacial Strength Testing: High Speed Ball Shear," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Lee, Chengkuo, Yu, Daquan, Yu, Aibin, Yan, Liling, Wang, Haitao, and Lau, John H., "Bonding Interface Materials Evolution of Intermediate In/Ag Layers for Low Temperature Fluxless Solder Based MEMS Wafer Level Packaging," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 216-219.

Lee, Chia-ho, Chen, Pi-cheng, and Ma, Hwong-wen, "Direct and indirect lead-containing waste discharge in the electrical and electronic supply chain," Resources, Conservation and Recycling, vol. 68, pp. 29-35, Nov. 2012.

Lee, Chiapyng, Lin, Chung-Yung, and Yen, Yee-Wen, The 260 °C phase equilibria of the Sn-Sb-Cu ternary system and interfacial reactions at the Sn-Sb/Cu joints," Intermetallics, vol. 15 no. 8, pp. 1027-1037, Aug. 2007.

Lee, Chiapyng, Lin, Chung-Yung, and Yen, Yee-Wen, "The 260 °C phase equilibria of the Sn-Sb-Ag ternary system and interfacial reactions at the Sn-Sb/Ag joints," Journal of Alloys and Compounds , vol. 458 no. 1-2, pp. 436-445, June 30, 2008.

Lee, Chieh-Ju, and Reynolds, Heidi, "Tin Whisker Accelerated Test Project," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Lee, Chien Chen, Lee, Chang Chun, Chiu, Chien Chia, Chen, Kuo Ming, Kuo, Frank, and Chiang, Kuo Ning, "Electromigration Characteristic of SnAg3.0Cu0.5 Flip Chip Interconnection," Proceedings 56th Electronic Components & Technology Conference , San Diego, CA, May 30-June 2, 2006, pp. 1164-1169.

Lee, Chien-Chen, Lee, Chang-Chun, and Chiang, Kuo-Ning, "Electromigration Characteristic of SnAg3.0Cu0.5 Flip Chip Interconnection," IEEE Transactions on Advanced Packaging, vol 33 no. 1, pp. 189-195, Feb. 2010.

Lee, Chien Chen, Chiang, Kou Ning, Chen, Kuo Ming, and Kuo, Frank, "Thermo-electromigration Study of Lead-free Solder Bumps," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Lee, Chin C., Wang, Pin J., and Kim, Jong S., "Are Intermetallics in Solder Joints Really Brittle?," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 648-652.

Lee, Chin C., Wang, Chen Y., and Matijasevic, Goran, "Au-In Bonding Below the Eutectic Temperature," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 16 no. 3, pp. 311-316, May 1993.

Lee, Chin C, and Choe, Selah, "Fluxless In-Sn bonding process at 140°C," Materials Science and Engineering: A, Structural Materials, vol. 333 no. 1-2, pp. 45-50, Aug. 2002. https://doi.org/10.1016/S0921-5093(01)01815-9

Lee, Chin C., and Chuang, Ricky W., "Fluxless Non-Eutectic Joints Fabricated Using Gold-Tin Multilayer Composite," IEEE Transactions on Components and Packaging Technologies, vol. 26 no. 2, pp. 416-422, June 2003.

Lee, Chin C., Hsu, Shou-Jen, and Wu, Yuan-Yun, "Fluxless Tin and Silver-Indium Bonding Processes for Silicon onto Aluminum," Journal of Electronic Materials, vol. 43 no. 1, pp. 9-15, Jan. 2014.

Lee, Ching-Hua, Chen, Wen-Tai, and Liao, Chien-Neng, "Effect of antimony on vigorous interfacial reaction of Sn-Sb/Te couples," Journal of Alloys and Compounds, vol. 509 no. 16, pp. 5142-5146, Apr. 21, 2011.

Lee, Ching-Hwa, Tang, Li-Wen, and Popuri, Srinivasa R., "A study on the recycling of scrap integrated circuits by leaching," Waste Management and Research, vol. 29 no. 7, pp. 677-685, July 2011.

Lee, Ching-Kuan, Chang, Tao-Chih, Huang, Yu-Jiau, Fu, Huan-Chun, Huang, Jui-Hsiung, Hsiao, Zhi-Cheng, Lau, John H., Ko, Cheng-Ta, Cheng, Ren-Shin, Chang, Pei-Chen, Kao, Kuo-Shu, Lu, Yu-Lan, Lo, Robert, and Kao, M. J., "Characterization and Reliability Assessment of Solder Microbumps and Assembly for 3D IC Integration," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1468-1474.

Lee, Ching-Kuan, Zhan, Chau-Jie, Lau, John H., Huang, Yu-Jiau, Fu, Huan-Chun, Huang, Jui-Hsiung, Hsiao, Zhi-Cheng, Chen, Shang-Wei, Huang, Shin-Yi, Fan, Chia-Wen, Lin, Yu-Min, Kao, Kuo-Shu, Ko, Cheng-Ta, Chen, Tai-Hung, Lo, Robert, and Kao, M. J., "Wafer Bumping, Assembly, and Reliability Assessment of ubumps with 5um Pads on 10um Pitch for 3D IC Integration," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 636-640.

Lee, Ching-Kuan, Chang, Tao-Chih, Lau, John H., Huang, Yu-Jiau, Fu, Huan-Chun, Huang, Jui-Hsiung, Hsiao, Zhi-Cheng, Ko, Cheng-Ta, Cheng, Ren-Shin, Chang, Pei-Chen, Kao, Kuo-Shu, Lu, Yu-Lan, Lo, Robert, and Kao, Ming-Jer, "Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 8, pp. 1229-1238, Aug. 2012.

Lee, Chiu-Wen, Kuo, Shih-Ming, and Lin, Kwang-Lung, "Interfacial Behavior between Copper Foil and Tin upon Thermal Aging," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 37-40.

Lee, Choong-Jae, Myung, Woo-Ram, Park, Bum-Geun, and Jung, Seung-Boo, "Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package," Journal of Materials Science: Materials in Electronics, vol. 31 no. 13, pp. 10170-10176, July 2020.

Lee, Choong-Jae, Bang, Jae-Oh, and Jung, Seung-Boo, "Effect of black residue on the mechanical properties of Sn-58Bi epoxy solder joints," Microelectronic Engineering, vol. 216, pp. 111055-1-111055-8, Aug. 15, 2019.

Lee, Choong-Jae, Min, Kyung Deuk, Park, Hyun Joon, and Jung, Seung-Boo, "Mechanical properties of Sn-58 wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests," Journal of Alloys and Compounds, vol. 820, pp. 153077-1-153077-5, Apr. 15, 2020.

Lee, Choong-Jae, Min, Kyung Deuk, Jeong, Haksan, Hwang, Byeong-Uk, and Jung, Seung-Boo, "The Fabrication of Ni-MWCNT Composite Solder and Its Reliability Under High Relative Humidity and Temperature," Journal of Electronic Materials , vol. 49 no. 11, pp. 6746-6753, Nov. 2020.

Lee, Christine Jill, Chen, Wei-Yu, Chou, Tzu-Ting, Lee, Tae-Kyu, Wu, Yew-Chung, Chang, Tao-Chih, and Duh, Jenq-Gong, "The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test," Journal of Materials Science: Materials in Electronics , vol. 26 no. 12, pp. 10055-10061, Dec. 2015.

Lee, Chun, Flenniken, Cindy, Koryabina, Melissa, Brown, Karl, Hundley, Mick, and Goudelock, Joel, "Evaluation of Novel Thermoplastic Polyolefin in Model Non-Halogenated Flame Retardant Compounds," Proceedings of the 57th International Wire and Cable Symposium, Providence, RI, Nov. 9-12, 2008, pp. 119-124.

Lee, D., Eybel, R., and Evans, R., "Development and Implementation of HVOF WC/Co/Cr Coatings as Alternative to Electrolytic Hard Chrome Plate in Landing Gear Applications Using Natural Gas as Fuel," Proceedings of the 2003 International Thermal Spray Conference , Orlando, FL, May 5-8, 2003, pp. 371-376.

Lee, Dale, Kennedy, Jeff, and Sherman, "Effects of No-Lead PCB Finishes on Disk Drive Assembly Process," 2001 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Feb. 13-15, 2001, pp. xx-xx.

Lee, Dale, and Jean, Denis, "Pb-Free Wave Solder Design Guidelines," Circuits Assembly, vol. 18 no. 2, pp. 82-85, Feb. 2007.

Lee, Dale, "Printed Circuit Board Considerations for Lead Free Assembly," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 556-562.

Lee, David M., and Pinol, Lesly A., "Effects of Tin and Copper Nanotexturization on Tin Whisker Formation," IPC APEX Expo 2012, San Diego, CA, Feb. 28-Mar. 1, 2012, pp. xx-xx.

Lee, David M., and Pinol, Lesly A., "Effects of Tin and Copper Nanotexturization on Tin Whisker Formation," Surface Mount Technology (SMT), vol. 27 no. 8, pp. 18-20,22-24,26,28,30, Aug. 2012.

Lee, David M., and Pinol, Lesly A., "Effects of Tin Whisker Formation on Nanocrystalline Copper," IPC APEX Expo Technical Conference 2011, Las Vegas, NV, April 12-14, 2011, pp. xx-xx.

Lee, Doh Jae, Baek, Dae Hwa, Lee, Kyung Ku, Lee, Kwang Min, and Seo, Youn Jong, "The mechanical properties of a joint of Sn-3.5Ag-1Zn solder and Cu substrate with aging treatment," Zeitschrift fur Metallkunde, vol. 96 no. 2, pp. 148-154, Feb. 2005.

Lee, Dong Nyung, "Spontaneous growth mechanism of tin whiskers," Seoul National University.

Lee, Dong-Jun, and Lee, Hyo S., "Major factors to the solder joint strength of ENIG layer in FC BGA package," Microelectronics Reliability, vol. 46 no. xx, pp. 1119-1127, 2006.

Lee, E. C., Ahn, J. G., and Ma, C. I., "Electrodeposition of Gradient Zinc Alloys," Plating & Surface Finishing, vol. 88 no. 5, pp. 124-126, May 2001.

Lee, Ee Lynn, Goh, Yingxin, and Haseeb, A. S. M. A., "Growth and mechanical properties of intermetallic compound between solid cobalt and molten tin," Journal of Materials Science: Materials in Electronics, vol. 31 no. 6, pp. 4554-4562, Mar. 2020.

Lee, Fen-Yi, "Halogen Free Materials Manufacturing and Supply Chain Challenges," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Lee, G. Fred, and Jones-Lee, Anne, "Importance of Considering Soil-Lead in Property Site Assessments," National Ground Water Association Conference, Orlando, FL, Aug. 1992, pp. xx-xx.

Lee, Geunhee, Woo, Yun Sung, Yang, Jee-Eun, Kim, Gil-Sung, Lee, Donghun, Kang, Kibum, Kim, Cheol-Joo, and Jo, Moon-Ho, "Vectorial nanowire growth by local kinetic manipulation," Journal of Crystal Growth, vol. 345 no. 1, pp. 56-60, Apr. 15, 2012.

Lee, Gwo-Wei, Song, Jenn-Ming, Lai, Yi-Shao, Chiu, Ying-Ta, and Su, Chien-Wei, "Size and substrate effects on microstructure and shear properties of solder joints," International Conference on Electronic Materials and Packaging , Taipei, Taiwan, Oct. 22-24, 2008, pp. 187-190.

Lee, Gyuhyon, Kim, Ju-Young, Burek, Michael J., Greer, Julia R., and Tsui, Ting Y., "Plastic deformation of indium nanostructures," Materials Science and Engineering: A, vol. 528 no. 19-20, pp. 6112-6120, July 25, 2011.

Lee, H. S., Xing, Z. X., Gui, D., Hao, M., Shao, J. J., Khoo, B. S., Shen, Y. Q., and Li, X. M., "Composition Distribution Studies of Sn/Ag/Cu Solder Material using TOF-SIMS, XPS and EDX," 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Suzhou, China, July 15-19, 2013, pp. 158-161.

Lee, H. T., and Lee, Y. H., "Adhesive strength and tensile fracture of Ni particle enhanced Sn-Ag composite solder joints," Materials Science and Engineering A, vol. 419 no. 1-2, pp. 172-180, Mar. 15, 2006.

Lee, H. T., Yang, C. L., Chen, M. H., and Li, C. S., "Effect of Sb Addition on Microstructure and Shear Strength of Sn-Ag Solder Joints," Key Engineering Materials, vol. 261-263, pp. 501-506, 2004.

Lee, H. T., and Lee, Y. H., "Effects of in situ nickel particle addition on the microstructure and microhardness of Sn-Ag solder," Science and Technology of Welding and Joining, vol. 10 no. 3, pp. 353-360, June 2005.

Lee, H.-T., Chen, M.-H., and Jao, H.-M., "Influence of copper addition on adhesive strength of Sn-3Ag-1.5Sb solder joints," Science and Technology of Welding and Joining, vol. 9 no. 6, pp. 555-559, Dec. 2004.

Lee, H. T., Huang, W. Y., and Chen, Y. F., "Influence of Cu addition on intermetallic compound formation and microstructure of Sn-3Ag-1,5Sb-xCu solder joints," Science and Technology of Welding and Joining, vol. 13 no. 8, pp. 781-790, Nov. 2008.

Lee, Ho Hyung, and Kwak, Jae B., "Realistic Creep Characterization for Sn3.0Ag0.5Cu Solder Joints in Flip Chip BGA Package," Journal of Electronic Materials, vol. 48 no. 10, pp. 6857-6865, Oct. 2019.

Lee, Ho Seok, Kim, Yeon Won, Kim, Jong Eun, Yoon, Sung Woon, Kim, Tae Young, Noh, Jin-Seo, and Suh, Kwang S., "Synthesis of dimension-controlled silver nanowires for highly conductive and transparent nanowire films," Acta Materialia, vol. 83, pp. 84-90, Jan. 15, 2015.

Lee, Hosung, Baeg, Sanghyeon, Hua, Nelson, and Wen, ShiJie, "Temporal and frequency characteristic analysis of margin-related failures caused by an intermittent nano-scale fracture of the solder ball in a BGA package device," Microelectronics Reliability, vol. 69, pp. 88-99, Feb. 2017.

Lee, Hsiang-Yi, and Duh, Jenq-Gong, "Influence of Ni Concentration and NI3Sn4 Nanoparticles on Morphology of Sn-Ag-Ni Solders by Mechanical Alloying," Journal of Electronic Materials, vol. 35 no. 3, pp. 494-503, Mar. 2006.

Lee, Hsien-Hsuen, Chou, Kan-Sen, and Shih, Zong-Whie, "Effect of nano-sized silver particles on the resistivity of polymeric conductive adhesives," International Journal of Adhesion and Adhesives , vol. 25 no. 5, pp. 437-441, Oct. 2005.

Lee, Hsuan, Dow, Wei-Ping, and Chen, Chih-Ming, "Effects of additive formula and plating current density on the interfacial reactions between Sn and Cu electroplated layer," 2016 International Conference on Electronics Packaging, Hokkaido, Japan, Apr. 20-22, 2016, pp. 627-630.

Lee, Hua-Xing, Chan, Kah-Yoong, and Shakur, Mohd Hamdi Abdul, "Effects of Annealing on Sn Whisker Formation Under Temperature Cycling and Isothermal Storage Conditions," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 7, pp. 1110-1115, July 2011.

Lee, Hui Mien, and Sundin, Erik, "The Swedish WEEE System - Challenges and Recommendations," 2012 IEEE International Symposium on Sustainable Systems and Technology, Boston, MA, May 16-18, 2012, pp. xx-xx.

Lee, Hwa-Teng, Chen, Ming-Hung, Jao, Huei-Mei, and Hsu, Chin-Jui, "Effect of Adding Sb on Microstructure and Adhesive Strength of Sn-Ag Solder Joints," Journal of Electronic Materials, vol. 33 no. 9, pp. 1048-1054, Sept. 2004.

Lee, Hwa-Teng, Chen, Yin-Fa, Hong, Ting-Fu, and Shih, Ku-Ta, "Effect of Cooling Rate on Ag3Sn Formation in Sn-Ag Based Lead-Free Solder," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 875-878.

Lee, Hwa-Teng, Lee, Fok-Foo, Hong, Ting-Fu, and Chen, Hsiao-Wei, "Effect of In addition on Sn-Ag-Sb lead-free solder system," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 191-194.

Lee, Hwa-Teng, Chen, Yin-Fa, Schwedt, Alexander, and Mayer, Joachim, "Effect of La addition on adhesive strength and fracture behavior of Sn-3.5Ag solder joints," Materials Science and Engineering: A, vol. 528 no. 10/11, pp. 3630-3638, Apr. 2011.

Lee, Hwa-Teng, and Huang, Kuo-Chen, "Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn-xAg-0.7Cu," Journal of Electronic Materials, vol. 45 no. 12, pp. 6102-6112, Dec. 2016.

Lee, Hwa-Teng, and Huang, Kuo-Chen, "Effects of Cooling Rate on the Microstructure and Morphology of Sn-3.0Ag-0.5Cu Solder," Journal of Electronic Materials, vol. 45 no. 1, pp. 182-190, Jan. 2016.

Lee, Hwa-Teng, Chen, Yin-Fa, Hong, Ting-Fu, and Shih, Ku-Ta, "Evolution of Ag3Sn Compounds in Solidification of Eutectic Sn-3.5Ag Solder," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 646-649.

Lee, Hwa-Teng, and Che, Yin-Fa, "Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn-3.5Ag solder," Journal of Alloys and Compounds, vol. 509 no. 5, pp. 2510-2517, Feb. 3, 2011.

Lee, Hwa-Teng, Chen, Ming-Hung, Jao, Huei-Mei, and Liao, Tain-Long, "Influence of interfacial intermetallic compound on fracture behavior of solder joints," Materials Science and Engineering A, vol. 358 no. 1-2, pp. 134-141, Oct. 15, 2003.

Lee, Hwa-Teng, Chen, Yin-Fa, Hong, Ting-Fu, and Huang, Yu-Jing, "Influence of Lanthanum Addition on Microstructure and Properties of Sn-3.5Ag Solder System," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 183-186.

Lee, Hwa-Teng, and Chen, Yin-Fa, "Influence of Lanthanum Additions on the Microstructure and Microhardness of Sn-3.5Ag Solder," Journal of Electronic Materials, vol. 38 no. 10, pp. 2148-2157, Oct. 2009.

Lee, Hwa-Teng, Chen, Yin-Fa, Hong, Ting-Fu, Shih, Ku-Ta, and Hsu, Che-wei, "Microstructural Evolution of Sn-3.5Ag Solder with Lanthanum Addition," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 617-622.

Lee, Hwa-Teng, Lee, Choo-Yeow, Lee, Fok-Foo, Chen, Yin-Fa, and Lee, Yang-Hsien, "Microstructural Evolution of Sn-Ag-Sb Solder with Indium Additions," Journal of Electronic Materials, vol. 38 no. 10, pp. 2112-2121, Oct. 2009.

Lee, Hwa-Teng, Hu, Shuen-Yuan, Hong, Ting-Fu, and Chen, Yin-Fa, "The Shear Strength and Fracture Behavior of Sn-Ag-xSb Solder Joints with Au/Ni-P/Cu UBM," Journal of Electronic Materials, vol. 37 no. 6, pp. 867-873, June 2008.

Lee, Hyeong Gi, Shin, Ji-Won, Choi, Yong-Won, and Paik, Kyung-Wook, "Effects of Thermocompression Bonding Parameters on Cu Pillar/Sn-Ag Microbump Solder Joint Morphology Using Nonconductive Films," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 7 no. 3, pp. 450-455, Mar. 2017.

Lee, Hyuck Mo, Yoon, Seung Wook, and Lee, Byeong-Joo, "Thermodynamic Prediction of Interface Phases at Cu/Solder Joints," Journal of Electronic Materials, vol. 27 no. 11, pp. 1161-1166, Nov. 1998.

Lee, Hyunju, Kim, Cheolmin, Heo, Cheolho, Kim, Chiho, Lee, Jae-Ho, and Kim, Yangdo, "Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn-Ag-Cu solder," Microelectronics Reliability, vol. 87, pp. 75-80, Aug. 2018.

Lee, HyunJung, Yu, YeonSeop, Kim, HyoJung, Kim, Hee-Soo, Kim, Bae-Kyun, and Seo, MooHong, "Investigation of IMC Growth in Tin Surface Finish and Its Effect on Solderability in FC-CSP Packaging," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 693-698.

Lee, HyunJung, Yu, YeonSeop, Kim, HyoJung, Kim, Hee-Soo, Kim, Bae-Kyun, and Seo, MooHong, "Investigation of IMC Growth in Tin Surface Finish and Its Effect on Solderability in FC-CSP Packaging," SMTAnews & Journal of Surface Mount Technology, vol. 22 no. 1, pp. 29-33, Jan.-Mar. 2009.

Lee, Imbok, Lee, Young-Woo, Valliappan, Aakash, and Lee, Tae-Kyu, "Crack Propagation Mechanism Study on Bismuth Contained Sn Base Lead Free Solder Under Thermo-Mechanical Stress," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Lee, J. G., and Subramanian, K. N., "Effect of Dwell Times on Thermomechanical Fatigue Behavior of Sn-Ag Based Solder Joints," Journal of Electronic Materials, vol. 32 no. 6, pp. 523-530, June 2003.

Lee, J. G., and Subramanian, K. N., "Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn-Ag based solder joints," Microelectronics Reliability , vol. 47 no. 1, pp. 118-131, Jan. 2007.

Lee, J., Cho, C. S., and Morris, J. E., "Electrical and reliability properties of isotropic conductive adhesives on immersion silver printed-circuit boards," Microsystem Technologies , vol. 15 no. 1, pp. 145-149, Jan. 2009.

Lee, J. G., Chen, K. C., and Subramanian, K. N., "Formation and Growth of Intermetallics around Metallic Particles in Eutectic Sn-Ag Solder," Journal of Electronic Materials, vol. 32 no. 11, pp. 1240-1248, Nov. 2003.

Lee, J. G., Guo, F., Subramanian, K. N., and Lucas, J. P., "Intermetallic morphology around Ni particles in Sn-3.5Ag solder," Soldering & Surface Mount Technology, vol. 14 no. 2, pp. 11-17, 2002.

Lee, J.-G., Govorkov, S. A., and Arrott, A. S., "Iron whisker domain patterns imaged by garnet films," Journal of Applied Physics, vol. 79 no. 8, pp. 6051-6053, Apr. 15, 1996.

Lee, J. G., and Subramanian, K. N., "Microstructural features contributing to enhanced behaviour of Sn-Ag based solder joints," Soldering & Surface Mount Technology vol. 17 no. 1, pp. 33-39, 2005.

Lee, J. G., Telang, A., Subramanian, K. N., and Bieler, T. R., "Modeling Thermomechanical Fatigue Behavior of Sn-Ag Solder Joints," Journal of Electronic Materials, vol. 31 no. 11, pp. 1152-1159, Nov. 2002.

Lee, J. G., Guo, F., Choi, S., Subramanian, K. N., Bieler, T. R., and Lucas, J. P., "Residual-Mechanical Behavior of Thermomechanically Fatigued Sn-Ag Based Solder Joints," Journal of Electronic Materials, vol. 31 no. 9, pp. 946-952, Sept. 2002.

Lee, J.-G., and Arrott, A. S., "Susceptibility of current-carrying iron whiskers," Journal of Applied Physics, vol. 75 no. 10, pp. 7006-7008, May 15, 1994.

Lee, J. H., and Jeong, H.-Y., "Fatigue Life Prediction of Solder Joints with Consideration of Frequency, Temperature and Cracking Energy Density," International Journal of Fatigue, vol. 61, pp. 264-270, Apr. 2014.

Lee, J. S., Bang, W. H., Jung, J. P., and Oh, K. H., "Application of TLP (Transient Liquid Phase) Bonding Method to the High Tm Lead-Free Solder," Materials Science Forum, vol. 475-479 part 3, pp. 1869-1872, 2005

Lee, J. W., Kang, M. G., Kim, B.-S., Hong, B. H., Whang, D., and Hwang, S. W., "Single crystalline aluminum nanowires with ideal resistivity," Scripta Materialia, vol. 63 no. 10, pp. 1009-1012, Nov. 2010.

Lee, Jae-chun, Song, Hyo Teak, and Yoo, Jae-Min, "Present status of the recycling of waste electrical and electronic equipment in Korea," Resources, Conservation and Recycling, vol. 50 no. 4, pp. 380-397, June 2007.

Lee, Jae-Ean, Kim, Keun-Soo, Inoue, Masahiro, Jiang, Junxiang, and Suganuma, Katsuaki, "Effects of Ag and Cu addition on microstructural properties and oxidation resistance of Sn-Zn eutectic alloy," Journal of Alloys and Compounds , vol. 454 no. 1-2, pp. 310-320, Apr. 24, 2008.

Lee, Jae-Ean, Kim, Keun-Soo, Suganuma, Katsuaki, Takenaka, Junichi, and Hagio, Koichi, "Interfacial Properties of Zn-Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate," Materials Transactions, vol. 46 no. 11, pp. 2413-2418, 2005.

Lee, Jae-Ean, Kim, Keun-Soo, Suganuma, Katsuaki, Inoue, Masahiro, and Izuta, Goro, "Thermal Properties and Phase Stability of Zn-SN and Zn-In Alloys as High Temperature Lead-Free Solder," Materials Transactions, vol. 48 no. 3, pp. 584-593, Mar. 2007.

Lee, Jae Hong, Kumar, Santosh, Kim, Hui Joong, Lee, Young Woo, and Moon, Jeong Tak, "High Thermo-Mechanical Fatigue and Drop Impact Resistant Ni-Bi Doped Lead Free Solder," 2014 IEEE 64th Electronic Components and Technology Conference , Orlando, FL, May 27-30, 2014, pp. 712-716.

Lee, Jae Hoon, Han, Jin-Woo, Yu, Chong Gun, and Park, Jong Tae, "Effect of source and drain asymmetry on hot carrier degradation in vertical nanowire MOSFETs," Microelectronics Reliability, vol. 55 no. 9-10, pp. 1456-1459, Aug.-Sept. 2015.

Lee, Jaeryeong, Kim, Youngjin, and Lee, Jae-chun, "Disassembly and physical separation of electric/electronic components layered in printed circuit boards (PCB)," Journal of Hazardous Materials, vol. 241-242, pp. 387-394, Nov. 30, 2012.

Lee, Jaesik, Jung, Jae-Pil, Cheon, Chu-Seon, Zhou, Yunhong, and Mayer, Michael, "Flip Chip Bump Formation of Sn-1.8Bi-0.8Cu-0.6In Solder by Stencil Printing," Materials Transactions, vol. 46 no. 11, pp. 2359-2365, 2005.

Lee, Jaesik, Bang, Woongho, Jung, Jaepil, and Oh, Kyuhwan, "Microstructure and Strength of Sn-Bi Coated Sn-3.5 mass%Ag Solder Alloy," Materials Transactions, vol. 45 no. 3, pp. 783-789, Mar. 2004.

Lee, Jang-Hee, and Park, Young-Bae, "Abnormal Failure Behavior of Sn-3.5Ag Solder Bumps Under Excessive Electric Current Stressing Conditions," Journal of Electronic Materials, vol. 38 no. 10, pp. 2194-2200, Oct. 2009.

Lee, Jang-Hee, Lim, Gi-Tae, Park, Young-Bae, Yang, Seung-Taek, Suh, Min-Suk, Chung, Qwan-Ho, and Byun, Kwang-Yoo, "Size Effect on Electromigration Reliability of Pb-free Flip Chip Solder Bump," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 2030-2034.

Lee, Jeahuck, Cho, C. S., and Morris, J. E., "Electrical and Reliability Properties of Isotropic Conductive Adhesives (ICAs) on Immersion Silver Printed Wiring Boards (PWBs)," 9th International Conference on Electronic Materials and Packaging, Daejon, Korea, Nov. 19-22, 2007, pp. xx-xx.

Lee, Jeffrey Chang-Bing, Yao, Yung-Ling, Chiang, Fang-Yi, Zheng, P. J., Liao, C. C., and Chou, Y. S., "Characterization Study of Lead-free Sn-Cu Plated Packages," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1238-1245.

Lee, Jeffrey ChangBing, Chen, Cheng-Chih, Lin, Alice, and Lee, Dem, "Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material," IPC APEX Expo 2017, San Diego, CA, Feb. 12-16, 2017, pp. xx-xx.

Lee, Jeffrey C. B., Wu, Sting, Chou, H. L., and Lai, Yi-Shao, "Development of Lead-Free Flip Chip Package and Its Reliability," Advances in Electronic Packaging 2003, Volume 1, Maui, Hawaii, July 6-11, 2003, pp. 115-121.

Lee, Jeffrey C. B., "Green Certification for IC BGA Package," International Microsystems, Packaging, Assembly Conference Taiwan, Taipei, Taiwan, Oct. 18-20, 2006, pp. xx-xx.

Lee, Jeffrey C. B., "Green IC Packages Certification," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Lee, Jeffrey C. B., and Li, Simon S. M., "Investigation of Lead-free Package Reliability," Advanced Packaging , vol. 13 no. 8, pp. xx-xx, Aug. 2004.

Lee, Jeffrey ChangBing, "Ni Underlayer Efficiency Investigation for Whisker Mitigation in IC Packaging," 2nd Electronics Systemintegration Technology Conference , Greenwich, London, UK, Sept. 1-4, 2008, pp. 453-458.

Lee, Jeffery ChangBing, "RoHS and Green Compliance in IC Packaging," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S12:01.

Lee, Jeffrey C. B., Su, Y. S., Jaw, S. M., Huang, C. C., Kuo, S. M., and Chen, K. L., "ROHS Compliance Possibility based in IC component," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies , Frankfurt, Germany, Oct. 20-22, 2004.

Lee, Jeffrey C. B., Chen, P. C, and Lai, Yi-Shao, "The Effect of SnxAgCu and SnAgCuX on the Mechanical Drop Performance in Lead Free CSP Package," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Lee, Jeffrey C. B., Chen, P. C, Hsu, Hana, and Tyan, C. G, "The Effect of Surface Mounting Process on the Board Level Whisker Growth," IPC Review, vol. 47 no. 8, pp. 9, Sept. 2006.

Lee, Jeffrey C. B., Chen, P. C., Hsu, Hana, and Tyan, C. G., "The Effect of Surface Mounting Process on the Board Level Whisker Growth," Route, Sept. 2006.

Lee, Jeffrey C. B., and Tyan, C. G., "The Effect of Surface Mounting Process on Whisker Growth in IC Package," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 666-673.

Lee, Jeffrey ChangBing, Chen, Cheng-Chih, Lee, Dem, and Lin, Alice, "The Failure Mechanism Investigation of the Polymer Ball Interconnected CBGA under Board Level Thermal Mechanical Stress," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 915-918.

Lee, Jeffrey ChangBing, Li, Li, and Smith, Brian, "The Green Material Effect on the Board Level Reliability Qualification of QFN Packages," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 915-920.

Lee, Jeffrey C. B., Chiang, C. M., Cruz, Alejandro R., and Li, Simon, "The investigation of lead-free package reliability," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 212-217.

Lee, Jeffrey C. B., Chen, P. C., and Tyan, C. G., "The Sn Whisker Growth Evolution of IC Packaging on the PC Board Assembly," 2007 Proceedings 57th Electronic Components & Technology Conference , Reno, NV, May 29-June 1, 2007, pp. 1964-1970.

Lee, Jeffrey C. B., "The SnAgCu Solder Joint Failure of BGA Type Package in 2nd Level Application," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 781-786.

Lee, Jeffrey C. B., Chung, Chi-sheng, Liu, Chin-Chiang, and Tong, Ho-Ming, "The SnAgCu solder joint integrity in WLCSP for green conversion," IEEE/CPMT International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, CA, Mar. 16-18, 2005, pp. 115-120.

Lee, Jeffrey C. B., Chung, Chi-Sheng, Liu, Chin-Chiang, Chen, Pei-Chun, Su, Yen-Shou, and Feng, Yao-Hsin, "The SnAgCu Solder Joint Integrity of Green WLCSP in Lead Free SMT," 2005 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Lee, Jeffrey C. B., Chen, Jun-Yuan Chen, Chen, Pel Chun, and Li, S. W., "The Solder Joint Characterization in Green WLCSP," 54th Electronic Components & Technology Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1914-1920.

Lee, Jeffrey ChangBing, "The Whisker Mitigation Efficiency of Ni Underlayer for IC Packaging on Board," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1060-1065.

Lee, Jenson, Sjoberg, Jonas, Rooney, Daniel T., Geiger, David A., and Shangguan, Dongkai, "Process Development and Reliability Evaluation of Electrically Conductive Adhesives (ECA) for Low Temperature SMT Assembly," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Lee, Jenson, Sjoberg, Jonas, Rooney, Daniel T., Geiger, David A., and Shangguan, Dongkai, "Process Development and Reliability Evaluation of Electrically Conductive Adhesives (ECA) For Low Temperature SMT Assembly," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1295-1300.

Lee, Jenson, Geiger, David, and Shangguan, Dongkai, "Process Development and Reliability Study with Anisotropic Conductive Film Bonding with Multiple Types of PCB Surface Finishes," South East Asia Technical Conference on Electronics Assembly Technologies 2011, Penang, Malaysia, May 19-20, 2011, pp. xx-xx.

Lee, Jenson, Geiger, David, and Shangguan, Dongkai, "Process Development and Reliability Study with Anisotropic Conductive Film Bonding on Multiple Types of PCB Surface Finishes," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1758-1763.

Lee, Jenson, Geiger, David, and Shangguan, Dongkai, "Process Development and Reliability Study with Anistropic Conductive Film Bonding with Multiple Types of PCB Surface Finishes," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 94-100.

Lee, Jenson, Geiger, David, and Shangguan, Dongkai, "Process Development and Reliability Study with Anisotropic Conductive Film Bonding with Multiple Types of PCB Surface Finishes," South East Asia Technical Training Conference on Electronics Assembly Technologies 2011 Proceedings, Penang, Malaysia, May 19-20, 2011, pp. xx-xx.

Lee, Jeong Hwan, Ma, Sung Woo, Kim, Young Min, Lee, Jin Su, Kim, Ki Bum, Kim, Jae Myun, Oh, Jae Sung, Kim Namseog, and Kim, Young-Ho, "The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn-3.5Ag solders on Cu substrates in fluxless soldering," Journal of Materials Science: Materials in Electronics , vol. 24 no. 9, pp. 3255-3261, Sept. 2013.

Lee, Jeong Il, Yim, Byung-Seung, Shin, Dongjun, and Kim, Jong-Min, "Three-dimensional multi-layer through-hole filling properties of solderable polymer composites with low-melting-point alloy fillers," Journal of Materials Science: Materials in Electronics, vol. 27 no. 6, pp. 6223-6231, June 2016.

Lee, Jeong Il, Yim, Byung-Seung, Yun, Mu Seong, and Kim, Jong-Min, "Through-hole filling characteristics of solderable polymer composites with low melting point alloy fillers," Journal of Materials Science: Materials in Electronics, vol. 27 no. 1, pp. 982-991, Jan. 2016.

Lee, Ji Hyun, Kim, Young Min, Hwang, Ji Hwan, and Kim, Young-Ho, "Wetting characteristics of Cu-xZn layers for Sn-3.0Ag-0.5Cu solders," Journal of Alloys and Compounds, vol. 567, pp. 10-14, Aug. 5, 2013.

Lee, Ji-Soo, Kim, Ji-Hye, and Paik, Kyung-Wook, "Effects of Flux Activator Addition in Nanofiber/Solder Anisotropic Conductive Films (ACFs) on the Solder Wettability of Flex-on-Flex (FOF) Assembly," IEEE Transactions on Components, Packaging, and Manufacturing Technology , vol. 8 no. 7, pp. 1316-1322, July 2018.

Lee, Jihye, Kim, Jung H., and Yoo, Choong D., "Thermosonic Bonding of Lead-Free Solder with Metal Bump for Flip-Chip Bonding," Journal of Electronic Materials, vol. 34 no. 1, pp. 96-102, Jan. 2005.

Lee, Jihye, and Yoo, Choong D., "Thermosonic soldering of cross-aligned strip solder bumps for easy alignment and low-temperature bonding," Journal of Micromechanics and Microengineering, vol. 18 no. 1, pp. 125002-1-125002-8, Dec. 2008.

Lee, Jin Soo, Byun, Kwang Yoo, Chung, Qwan Ho, Suh, Min Suk, Kim, Seong Cheol, and Kim, Young-Ho, "Chip to Chip Bonding using micro-Cu Bumps with Sn Capping Layers," European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Lee, Jin-Young, Shin, Dongkyun, and Park, Jongwoon, "Fabrication of silver nanowire-based stretchable electrodes using spray coating," Thin Solid Films, vol. 608, pp. 34-43, June 1, 2016.

Lee, Jong-Bum, Hwang, How-Yuan, and Rhee, Min-Woo, "Reliability Investigation of Cu/In TLP Bonding," Journal of Electronic Materials, vol. 44 no. 1, pp. 435-441, Jan. 2015.

Lee, Jong Gi, Woo, Hyun Jong, Hong, Ji Seok, Kim, Pyoung Wan, and Song, Young Hee, "Effect of PCB Pad Structure and PWB Build-up Layer on Solder Joint Life under Thermal Cycling and Drop Condition," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 471-475.

Lee, Jong Ho, and Lee, Dong Nyung, "Use of Thermodynamic Data to Calculate Surface Tension and Viscosity of Sn-Based Soldering Alloy Systems," Journal of Electronic Materials , vol. 30 no. 9, pp. 1112-1119, Sept. 2001.

Lee, Jong-Hyun, Park, Jong-Hwan, Shin, Dong-Hyuk, Lee, Yong-Ho, and Kim, Yong-Seog, "Kinetics of Au-containing Ternary Intermetallic Redeposition at Solder/UBM Interface," Journal of Electronic Materials, vol. 30 no. 9, pp. 1138-1144, Sept. 2001.

Lee, Jong-Hyun, Park, Jong-Whan, Shin, Dong Hyuk, and Kim, Yong-Seog, "Kinetics of the Au-Ni-Sn Ternary Intermetallic Layer Redeposition at the Solder/Under-Bump Metallurgy Interface during Aging Treatment," Journal of Electronic Materials, vol. 33 no. 1, pp. 28-33, Jan. 2004.

Lee, Jong-Hyun, Kim, Ju-Hyung, and Hyun, Chang-Yong, "Pot Life Improvement of Low Temperature and High-speed Curable Anisotropic Conductive Adhesive (ACA)," European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Lee, Jong-Hyun, Park, Jong-Hwan, Lee, Yong-Ho, Kim, Yong-Seog, and Shin, Dong Hyuk, "Stability of channels at a scalloplike Cu6Sn5 layer in solder interconnections," Journal of Materials Research, vol. 16 no. 5. pp. 1227-1230, May 2001.

Lee, Joonho, Tanaka, Toshihiro, Yamamoto, Masaya, and Hara, Shigeta, "Effect of Oxygen on Surface Tension of Liquid Ag-Sn Alloys," Materials Transactions, vol. 45 no. 3, pp. 625-629, Mar. 2004.

Lee, Joonho, Shimoda, Wataru, and Tanaka, Toshihiro, "Temperature dependence of surface tension of liquid Sn-Ag, In-Ag and In-Cu alloys," Measurement Science and Technology, vol. 16 no. 2, pp. 438-442, Feb. 2005.

Lee, Joo Won, Lee, Zin Hyoung, and Lee, Hyuck Mo, "Formation of Intermetallic Compounds in the Ni Bearing Lead Free Composite Solders," Materials Transactions, vol. 46 no. 11, pp. 2344-2350, 2005.

Lee, Jou-I, Chen, Sinn-Wen,Chang, Hsiu-Yu, and Chen, Chih-Ming, "Reactive Wetting between Molten Sn-Bi and Ni Substrate," Journal of Electronic Materials, vol. 32 no. 3, pp. 117-122, Mar. 2003.

Lee, Jung-Sub, Chu, Kun-Mo, Patzelt, Rainer, Manessis, Dioysios, Ostmann, Andreas, and Jeon, Duk Young, "Effects of Co Addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development," Microelectronic Engineering, vol. 85 no. 7, pp. 1577-1583, July 2008.

Lee, Jung-Sub, Chu, Kun-Mo, Jeon, Duk Young, Patzelt, Rainier, Manessis, Dionysios, and Ostmann, Andreas, "Formation and Characterization of Cobalt-Reinforced Sn-3.5Ag Solder," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 244-249.

Lee, Jung-Sub, Chu, Kun-Mo, and Jeon, Duk Young, "Shear strength of Sn-3.5Ag solder bumps formed on Ni/Au and organic solderability preservative surface-finished bond pads after multiple reflow steps," Journal of Materials Research, vol. 20 no. 11, pp. 3088-3093, Nov. 2005.

Lee, Jun-Kyu, Park, Yun-Mook, Kang, In-Soo, Kwon, Yong-Min, and Paik, Kyung-Wook, "Improvement of Drop Shock and TC Reliability for Large Die Wafer Level Packages in Mobile Application," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 673-678.

Lee, K. C., Vythilingam, A., and Alpern, P., "A simple moisture diffusion model for the prediction of optimal baking schedules for plastic SMD packages," Microelectronics Reliability , vol. 45 no. 9-11, pp. 1668-1671, Sept.-Nov. 2005.

Lee, K. C., Vythilingam, A., and Alpern, P., "A simple moisture diffusion model for the prediction of optimal baking schedules for plastic SMD packages," Microelectronics Reliability , vol. 45 no. 12, pp. 1668-1671, Dec. 2005.

Lee, K. C., and Alpern, P., "On the Physics of Failure in the Case of Moisture Induced Delamination in Plastic Encapsulated Microelectronic Devices," Proceedings 45th Annual IEEE International Reliability Physics Symposium, Phoenix, AZ, Apr. 15-19, 2007, pp. 102-106.

Lee, K. K., Ng, K. T., Tan, C. W., Chan, Y. C., and Cheng, L. M., "Fabrication of Smart Card using UV Curable Anisotropic Conductive Adhesive (ACA.) Part I: Optimization of the curing conditions," 2004 International Conference on Business of Electronic Product Reliability and Liability, Shanghai, China, Apr. 27-30, 2004, pp. 134-139.

Lee, K. K., Tan, S. C., and Chan, Y. C., "Investigation of Conductive Adhesive Bonding Using UV Curable Anisotropic Conductive Adhesives at Different Curing Conditions," Journal of Electronic Packaging, Transactions of the ASME, vol. 127 no. 1, pp. 52-58, Mar. 2005.

Lee, K. K., Yeung, N. H., and Chan, Y. C., "Modelling the effect of voids in anisotropic conductive adhesive joints," Soldering & Surface Mount Technology, vol. 17 no. 1, pp. 4-12, 2005.

Lee, K. O., Yu, Jin, Park, T. S., and Lee, S. B., "Effects of pad metallization on the low cycle fatigue characteristics of Sn-based solder joints," International Journal of Fatigue, vol. 48, pp. 1-8, Mar. 2013.

Lee, K.-O., Morris Jr., J. W., and Hua, F., "Influence of the Substrate on the Creep of SN Solder Joints," Metallurgical and Materials Transactions A, vol. 41 no. 7, pp. 1805-1814, July 2010.

Lee, K. O., Yu, Jin, Park, T. S., and Lee, S. B., "Low-Cycle Fatigue Characteristics of Sn-Based Solder Joints," Journal of Electronic Materials, vol. 33 no. 4, pp. 249-258, Apr. 2004.

Lee, K.-O., Morris Jr., J. W., and Hua, Fay, "Martensitic Transformation in Sn-Rich SnIn Solder Joints," Journal of Electronic Materials, vol. 41 no. 2, pp. 336-351, Feb. 2012.

Lee, K. -O., Morris Jr., J. W., and Hua, Fay, "Mechanisms of Creep Deformation in Pure Sn Solder Joints," Journal of Electronic Materials, vol. 42 no. 3, pp. 516-526, Mar. 2013.

Lee, K.-O., Morris Jr., J. W., and Hua, Fay, "Transformation-Induced Plasticity in Sn-In Solder Joints." Journal of Electronic Materials, vol. 42 no. 1, pp. 168-178, Jan. 2013.

Lee, K. Y., and Li, M., "Formation of Intermetallic Compounds in SnPbAg, SnAg, and SnAgCu Solders on Ni/Au Metallization," Metallurgical and Materials Transactions A, vol. 32 no. 10, pp. 2666-2668, Oct. 2001.

Lee, K. Y., Li, M., and Tu, K. N., "Growth and ripening of (Au,Ni)Sn4 phase in Pb-free and Pb-containing solders on Ni/Au metallization," Journal of Materials Research, vol. 18 no. 11, pp. 2562-2570, Nov. 2003.

Lee, K. Y., and Li, M., "Interfacial Microstructure Evolution in Pb-Free Solder Systems," Journal of Electronic Materials, vol. 32 no. 8, pp. 906-912, Aug. 2003.

Lee, Ka Yau, Li, Ming, Olsen, Dennis R., Chen, William T., Tan, Ben T.C., and Mhaisalkar, Subodh, "Microstructure, Joint Strength and Failure Mechanism of Sn-Ag, Sn-Ag-Cu versus Sn-Pb-Ag Solders in BGA Packages," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 478-485.

Lee, Ki Won, Kim, Hyoung Joon, Yim, Myung Jin, and Paik, Kyung Wook, "Curing and Bonding Behaviors of Anisotropic Conductive Films (ACFs) by Ultrasonic Vibration for Flip Chip Interconnection," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 918-923.

Lee, Kiju, Suganuma, Katsuaki, Kim, Keun-Soo, Ueshima, Minoru, Albrecht, Hans-Juergen, Wilke, Klaus, and Strogies, Joerg, "Effects of additional Co atoms on microstructural evolution in Sn-Ag-Bi-In solder under current stressing," 2011 18th European Microelectronics and Packaging Conference, Brighton, United Kingdom, Sept. 12-15, 2011, pp. xx-xx.

Lee, Kiju, Kim, Keun-Soo, Yamanaka, Kimihiro, Tsukada, Yutaka, Kuritani, Soichi, Ueshima, Mimoru, and Suganuma, Katsuaki, "Effects of the crystallographic orientation of Sn grain during electromigration test," 2010 IEEE CPMT Symposium Japan, Tokyo, Japan, Aug. 24-26, 2010, pp. xx-xx.

Lee, Kiju, Kim, Keun-Soo, Tsukada, Yutaka, Suganuma, Katsuaki, Yamanaka, Kimihiro, Kuritani, Soichi, and Ueshima, Minoru, "Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn-Ag-Cu/Cu ball joints," Journal of Materials Research, vol. 26 no. 3, pp. 467-474, Feb. 2011.

Lee, Kiju, Kim, Keun-Soo, Tsukada, Yutaka, Suganuma, Katsuaki, Yamanaka, Kimihiro, Kuritani, Soichi, and Ueshima, Minoru, "Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint," Microelectronics Reliability, vol. 51 no. 12, pp. 2290-2297, Dec. 2011.

Lee, Kiju, Kim, Keun-Soo, and Suganuma, Katsuaki, "Influence of indium addition on electromigration behavior of solder joint," Journal of Materials Research, vol. 26 no. 20, pp. 2624-2631, Oct. 28, 2011.

Lee, Kiwon, Kim, Hyoung-Joon, and Paik, Kyung-Wook, "A Novel Anisotropic Conductive Film (ACF) Bonding Method Using Vertical Ultrasonic Vibration," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1311-1315.

Lee, Kiwon, and Paik, Kyung Wook, "High Power and Fine Pitch Assembly Using Solder Anisotropic Conductive Films (ACFs) Combined with Ultrasonic Bonding Technique," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 421-426.

Lee, Kiwon, Saarinen, Ilkka J., Pykari, Lasse, and Paik, Kyung Wook, "High Power and High Reliability Flex-On-Board Assembly Using Solder Anisotropic Conductive Films Combined With Ultrasonic Bonding Technique," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 12, pp. 1901-1907, Dec. 2011.

Lee, Kiwon, Oh, Sangmin, Saarinen, Ilkka J., Pykari, Lasse, and Paik, Kyung-Wook, "High-speed Flex-On-Board Assembly Method using Anisotropic Conductive Films (ACFs) Combined with Room Temperature Ultrasonic (US) Bonding for High-density Module Interconnection in Mobile Phones," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 530-536.

Lee, Kiwon, Saarinen, Ilkka J., Pykari, Lasse, and Paik, Kyung-Wook, "Micro-solder/Adhesive Hybrid Joints for High-density, High-power, High-reliability, and Reworkable Module Interconnection in Mobile Phones," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 251-257.

Lee, Kiwon, Kim, Hyoung-Joon, and Paik, Kyung-Wook, "Room Temperature ACF Bonding Process using Ultrasonic Vibration for Chip-On-Board and Flex-On-Board Applications," 9th International Conference on Electronic Materials and Packaging, Daejon, Korea, Nov. 19-22, 2007, pp. xx-xx.

Lee, Kiwon, Kim, Hyoung Joon, Kim, Il, and Paik, Kyung Wook, "Ultrasonic Anisotropic Conductive Films (ACFs) Bonding of Flexible Substrates on Organic Rigid Boards at Room Temperature," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 480-486.

Lee, Kiwon, Kim, Hyoung-Joon, Yim, Myung-Jin, and Paik, Kyung-Wook, "Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection," IEEE Transactions on Electronics Packaging Manufacturing, vol. 32 no. 4, pp. 241-247, Oct. 2009.

Lee, Kong Hui, and Broome, Todd, "Failure Analysis of "Black Pad" Defect and Its Prevention," South East Asia Technical Training Conference on Electronics Assembly Technologies 2011 Proceedings, Penang, Malaysia, May 19-20, 2011, pp. xx-xx.

Lee, Kong Hui, Oxx, George, and Bixenman, Mike, "Lead-Free Misprint Board Cleaning Studies," South East Asia Technical Training Conference on Electronics Assembly Technologies 2011 Proceedings , Penang, Malaysia, May 19-20, 2011, pp. xx-xx.

Lee, Kyung Ku, Kang, Chang Seog, and Lee, Doh Jae, "Mechanical Properties of Sn-Bi-Zn Solder/Cu Joints," Journal of Japan Institute of Metals, vol. 65 no. 12, pp. 1091-1095, Dec. 2001.

Lee, Kyu-Oh, Morris Jr., J. W., and Hua, Fay, "Substrate Effects on The Creep Properties of Pure Sn Solder Joints," 2005 IEEE/CPMT 10th International Symposium on Advanced Packaging Materials , Irvine, CA, Mar. 16-18, 2005, pp. 17-20.

Lee, Liu Mei, Nazeri, Muhammad Firdaus Mohd, Haliman, Habsah, and Mohamad, Ahmad Azmin, "Corrosion of Sn-3.0Ag-0.5Cu thin films on Cu substrates in alkaline solution," Soldering & Surface Mount Technology, vol. 26 no. 2, pp. 79-86, 2014.

Lee, Liu Mei, Haliman, Habsah, and Mohamad, Ahmad Azmin, "Interfacial reaction of a Sn-3.0Ag-0.5Cu thin film during solder reflow," Soldering & Surface Mount Technology, vol. 25 no. 1, pp. 15-23, 2013.

Lee, M. S., Liu, C. M., and Kao, C. R., "Interfacial Reactions between Ni Substrate and the Component Bi in Solders," Journal of Electronic Materials, vol. 28 no. 1, pp. 57-62, Jan. 1999.

Lee, M., Hwang, Y., Pecht, M., Park, J., Kim, Y., and Liu, W., "Study of Intermetallic Growth on PWBs Soldered with Sn3.0Ag0.5Cu," 54th Electronic Components & Technology Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1338-1346.

Lee, Miky, Hillman, Craig, and Kim, Duksoo, "How to predict failure mechanisms in LED and laser diodes," Military & Aerospace Electronics, vol. xx no. x, pp. xx-xx, June 2005.

Lee, Miky, Hillman, Craig, and Kim, Duksoo, "Industry News: How to predict failure mechanisms in LED and laser diodes," Military & Aerospace Electronics, vol. 16 no. 6, pp. xx-xx, June 2005.

Lee, Min-Hyun, Kim, Hyun-Mi, Lee, Hyo-Sung, Nam, Sung-Wook, Park, Wanjun, and Kim, Ki-Bum, "Electrical Properties of Silicon Nanowire Fabricated by Patterning and Oxidation Process," IEEE Transactions on Nanotechnology, vol. 11 no. 3, pp. 565-569, May 2012.

Lee, N.-C., "Getting Ready for Lead Free Solders," Soldering & Surface Mount Technology, vol. 9 no. 2, pp. 65-69, 1997.

Lee, N. T. S., Tan, V. B. C., and Lim, K. M., ""First-principles calculations of structural and mechanical properties of Cu6Sn5," Applied Physics Letters, vol. 88 no. 3, pp. 031913-1-031913-3, 200.

Lee, Ning-Cheng, Slattery, James A., Sovinsky, John R., Artaki, Iris, and Vianco, Paul T., "A Drop-in Lead-Free Solder Replacement," Proceedings of the Technical Program NEPCON West '95, Volume 2, Anaheim, CA, Feb. 26-Mar. 2, 1995, pp. 1077-1086.

Lee, Ning-Cheng, Slattery, James A., Sovinsky, John R., Artaki, Iris, and Vianco, Paul T., "A Novel Lead-Free Solder Replacement," Surface Mount International Conference & Exposition Proceedings of the Technical Program, San Jose, CA, Aug. 28-Sept. 1, 1994, pp. 463-472.

Lee. Ning-Cheng, "A Thorough Look at Lead-Free Solder Alternatives," Circuits Assembly , vol. 9 no. 4, pp. 64,66,68,70-71, Apr. 1998.

Lee, Ning-Cheng, Liu, Weiping, Lasky, Ronald C., and Jensen, Timothy, "Achieving High Reliability Low-Cost Lead-Free SAC Solder Joints Via Mn Doping," South East Asia Technical Training Conference on Electronics Assembly Technologies 2013 Proceedings, Penang, Malaysia, Apr. 17-19, 2013, pp. xx-xx.

Lee, Ning-Cheng, "An Expert Looks at the Issues," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Sept.-Oct. 2000.

Lee, Ning-Cheng, "Application of The Second Generation of SACM in Both Solder Sphere and Solder Paste," Medical Electronics Symposium 2014 Proceedings, Portland, OR, Sept. 18-19, 2014, pp. xx-xx.

Lee, Ning-Cheng, "Dr. Ning-Cheng Lee on Solder and Lead-Free Substitutes," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Sept.-Oct. 2000.

Lee, Ning-Cheng, and Bixenman, Mike, "Flux Technology For Lead-Free Alloys & Its Impact On Cleaning," 2001 Advanced Packaging Technology Conference Proceedings, 2001, pp. xx-xx.

Lee, Ning-Cheng, and Bixenman, Mike, "Flux Technology for Lead-Free Alloys & Its Impact on Cleaning," 2002 Proceedings 52nd Electronic Components & Technology Conference , San Diego, CA, May 28-31, 2002, pp. 1484-1490.

Lee, Ning-Cheng, and Bixenman, Mike, "Flux Technology for Lead-Free Alloys and Its Impact On Cleaning," Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium, San Jose, CA, July 17-18, 2002, pp. 316-322.

Lee, Ning-Cheng, "Future Lead-Free Solder Alloys and Fluxes - Meeting Challenges of Miniaturization," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. xx-xx.

Lee, Ning-Cheng, "Future Lead-Free Solder Alloys and Fluxes - Meeting Challenges of Miniaturization," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S18:02.

Lee, Ning-Cheng, "Future Lead-Free Solder Alloys and Fluxes - Meeting Challenges of Miniaturization," NEPCON Shanghai 2008, Shanghai, China, Apr. 8-11, 2008, pp. xx-xx.

Lee, Ning-Cheng, "Future Lead-Free Solder Alloys and Fluxes - Meeting Challenges of Miniaturization," SMTA China East Technical Conference 2008, Shanghai, China, Apr. 8-10, 2008, pp. xx-xx.

Lee, Ning-Cheng, "Future Lead-Free Solder Alloys and Fluxes - Meeting Challenges of Miniaturization," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. xx-xx.

Lee, Ning-Cheng, "Future lead free solder alloys and fluxes - Meeting challenges of miniaturization," EMasia, Nov. 2008.

Lee, Ning-Cheng, "Future Lead-Free Solder Alloys and Fluxes - Meeting Challenges of Miniaturization," 2008 10th Electronics Packaging Technology Conference , Singapore, Dec. 9-12, 2008, pp. 864-872.

Lee, Ning-Chen, "How to Control Voiding in Reflow Soldering," Chip Scale Review , vol. xx no. xx, pp. xx-xx, Aug.-Sept. 2005.

Lee, Ning-Cheng, "Is it Really Impossible? Combining Superior Anti-Oxidation and Superior Print," NEPCON Shanghai 2008, Shanghai, China, Apr. 8-11, 2008, pp. xx-xx.

Lee, Ning-Cheng, "Is it Really Impossible? Combining Superior Anti-Oxidation and Superior Print," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 571-574.

Lee, Ning-Chen, "Lead - Free Chip-Scale Soldering of Packages," Chip Scale Review , vol. xx no. xx, pp. xx-xx, Mar.-Apr. 2000.

Lee, Ning-Cheng, "Lead-Free Flux Technology and Influence on Cleaning," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 674-680.

Lee, Ning-Cheng, "Lead-Free Flux Technology and Influence on Cleaning," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 76-81.

Lee, Ning-Cheng, "Lead-Free Flux Technology and Influence on Cleaning," 2010 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, Koloa, HI, Jan. 26-28, 2010, pp. xx-xx.

Lee, Ning-Cheng, "Lead-Free Flux Technology and Influence on Cleaning," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S02__01-1-S02_01-8.

Lee, Ning-Cheng, "Lead-Free Flux Technology and Influence on Cleaning," SMTA Journal , vol. 23 no. 2, pp. 31-36, 2010.

Lee, Ning-Cheng, "Lead-Free Soldering and Low Alpha Solders for Wafer Level Interconnects," Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 541-549.

Lee, Ning-Cheng, "Lead-Free Soldering of Chip-Scale Packages," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Mar./Apr. 2000.

Lee, Ning-Cheng, "Lead-Free Soldering - Where the World Is Going," Indium Corporation of America.

Lee, Ning-Cheng, "Meeting green challenges in miniaturisation," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, May 12, 2008.

Lee, Ning-Cheng, "Reflow Soldering: Meeting the SMT Challenge," Advancing Microelectronics, vol. 23 no. 1, pp. 19-21, Jan.-Feb. 1996.

Lee, Ning-Cheng, "Shock Resistant and Thermally Reliable Low Ag SAC Solder Doped with Mn," Medical Electronics Symposium 2013 Proceedings, Milpitas, CA, Nov. 12-13, 2013, pp. xx-xx.

Lee, Ning-Cheng, and Casey, William, "Soldering Technology for Area Array Packages," Proceedings of the Technical Program NEPCON West 2000, Volume 1, Anaheim, CA, Feb. 29-Mar. 2, 2000, pp. 521-535.

Lee, Ning-Cheng, "The Mutual Impact of Lead-free Soldering and Fluxing Technology," 2006 Lead-Free Technology Workshop, San Antonio, TX, Mar. 12, 2006, pp. xx-xx.

Lee, Ning-Cheng, "The Next Generation of Solders for Electronics," Chip Scale Review , vol. xx no. xx pp. xx-xx, Sept. 2004.

Lee, Ning-Cheng, "The Relationship of Components, Alloys and Fluxes, Part 1," Circuits Assembly, vol. 16 no. 3, pp. 40-41, Oct. 2005.

Lee, Ning-Cheng, "The Relationship of Components, Alloys and Fluxes, Part 1," Printed Circuit Design and Manufacture, vol. 22 no. 10, pp. 13, Oct. 2005.

Lee, Ning-Chen, "The Relationship of Components, Alloys and Fluxes, Part 2," Circuits Assembly, vol. 16 no. 11, pp. 58-59, Nov. 2005.

Lee, Ning-Chen, "The Relationship of Components, Alloys and Fluxes, Part 2," Printed Circuit Design and Manufacture, vol. 22 no. 11, pp. 14-15, Nov. 2005.

Lee, Ning-Cheng, "Wafer Level Interconnects with Lead-Free and Low Alpha Solders," 2000 SMTA International Conference Proceedings, Chicago, IL, Sept. 24-28, 2000, pp. xx-xx.

Lee, Ouk Sub, Hur, Man Jae, Park, Yeon Chang, and Kim, Dong Hyeok, "Comparison of Reliability of Solder Joints by FORM and SORM," Key Engineering Materials, vol. 353-358, pp. 2593-2596, 2007.

Lee, Ouk Sub, Hur, Man Jae, Park, Yeon Chang, and Kim, Dong Hyeok, "Vibration fatigue reliability of Lead and Lead-Free Solder Joint by FORM/SORM," Key Engineering Materials, vol. 345-356 I, pp. 1393-1396, 2007.

Lee, Redwood, Sin, Wha Soo, Jeon, Jong Keun, and Kim, Heui Seog, "Sn2.5Ag0.5Cu Lead Free Solder Balls with "Ge" and "Ni"," IEEE/CPMT International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, CA, Mar. 16-18, 2005, pp. 121-125.

Lee, Rikki, "Opinion: Galaxy IV Postmortem," Wireless Week, vol. xx no. xx, pp. xx-xx, June 8, 1998.

Lee, S.-W. Ricky, and Lau, John H., "Analysis and comparison of WLCSP-on-build-up PCB assemblies with various solders and microvia configurations," Circuit World, vol. 28 no. 2, pp. 32-38, 2002.

Lee, S. W. Ricky, and Huang, Xingjia, "Analysis on solder ball shear testing conditions with a simple computational model," Soldering & Surface Mount Technology, vol. 14 no. 1, pp. 45-48, 2002.

Lee, S. W. Ricky, and Song, Fubin, "Impact of IMC Thickness on Lead-free Solder Joint Reliability under Thermal Aging: Ball Shear Tests vs. Cold Bump Pull Tests," International Microsystems, Packaging, Assembly Conference Taiwan, Taipei, Taiwan, Oct. 18-20, 2006, pp. xx-xx.

Lee, S., Jung, S. W., Park, S., Ahn, J., Hong, S. J., Yoo, H. J., Lee, M. H., and Cho, D.-I., "Ultra-high Responsivity, Silicon Nanowire Photodetectors for Retinal Prosthesis," 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, Paris, France, Jan. 29-Feb. 2, 2012, pp. 1364-1367.

Lee, Sang Hoon, Kim, Tae Wan, and Paik, Kyung-Wook, "A Study on Nanofiber Anisotropic Conductive Films (ACFs) for Fine Pitch Chip-on-Glass (COG) Interconnections," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 1060-1063.

Lee, Sang-Hoon, and Paik, Kyung-Wook, "A Study on the Nanofiber-Sheet Anisotropic Conductive Films (NS-ACFs) for Ultra-Fine-Pitch Interconnection Applications," Journal of Electronic Materials, vol. 46 no. 1, pp. 167-174, Jan. 2017.

Lee, Sang Hoon, Suk, Kyung Lim, and Paik, Kyung-Wook, "Fine Pitch Flex-on-Flex (FOF) Assembly using Nanofiber Solder Anisotropic Conductive Films (ACFs) and Ultrasonic Bonding Method," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 1709-1712.

Lee, Sang-Hoon, Kim, Tae-Wan, Suk, Kyung-Lim, and Paik, Kyung-Wook, "Nanofiber Anisotropic Conductive Films (ACF) for Ultra-Fine-Pitch Chip-on-Glass (COG) Interconnections," Journal of Electronic Materials , vol. 44 no. 11, pp. 4628-4636, Nov. 2015.

Lee, Sang-Hoon, Suk, Kyung-Lim, Lee, Kiwon, and Paik, Kyung-Wook, "Study on Fine Pitch Flex-on-Flex Assembly Using Nanofiber/Solder Anisotropic Conductive Film and Ultrasonic Bonding Method," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 12, pp. 2108-2114, Dec. 2012.

Lee, Sang Hoon, Kim, Tae Wan, and Paik, Kyung-Wook, "Plasma-etched Nanofiber Anisotropic Conductive Films (ACFs) for Ultra Fine Pitch Interconnection," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 142-145.

Lee, Sang-Min, Yoon, Jeong-Won, and Jung, Seung-Boo, "Board Level Drop Reliability of Epoxy-Containing Sn-58 mass% Bi Solder Joints with Various Surface Finishes," Materials Transactions, JIM, vol. 57 no. 3, pp. 466-471, 2016.

Lee, Sang-Min, Yoon, Jeong-Won, and Jung, Seung-Boo, "Electromigration effect on Sn-58 % Bi solder joints with various substrate metallizations under current stress," Journal of Materials Science: Materials in Electronics, vol. 27 no. 2, pp. 1105-1112, Feb. 2016.

Lee, Sangmin, and Cho, Dong-il "Dan", "Flexible field-effect transistors using top-down fabrication of (111)-silicon nanowires and wafer-level transfer process for neural prostheses," Microelectronic Engineering, vol. 175, pp. 23-29, May 5, 2017.

Lee, Sang-Min, Yoon, Jeong-Won, and Jung, Seung-Boo, "Interfacial reaction and mechanical properties between low melting temperature Sn-58Bi solder and various surface finishes during reflow reactions," Journal of Materials Science: Materials in Electronics , vol. 26 no. 3, pp. 1649-1660, Mar. 2015.

Lee, Sangmin, "Top-down fabrication of silicon-nanowire arrays for large-scale integration on a flexible substrate for achieving high-resolution neural microelectrodes," Microsystem Technologies, vol. 23 no. 2, pp. 491-498, Feb. 2017.

Lee, Seen Fang, Goh, Yingxin, and Haseeb, A. S. M. A., "Effects of Stacking Sequence of Electrodeposited Sn and Bi Layers on reflowed Sn-Bi Solder Alloys," 2012 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Nov. 6-8, 2012, pp. xx-xx.

Lee, Seong Hyuk, Lee, Junghee, Lee, Jin Woon, and Kim, Jong Min, "Coalescence Characteristics of Fusible Particles in Solderable Isotropic Conductive Adhesives (ICAs)," Materials Science Forum, vol. 580-582, pp. 213-216, 2008.

Lee, Seonhee, Bae, Changdeuck, Lee, Jubok, Lee, Subin, Oh, Sang Ho, Kim, Jeongyong, Park, Gyeong-Su, Jung, Hyun Suk, and Shin, Hyunjung, "Fabrication of a Stable New Polymorph Gold Nanowire with Sixfold Rotational Symmetry," Advanced Materials, vol. 30 no. 16, pp. 1706261-1-1706261-8, Apr. 19, 2018. DOI: 10.1002/adma.201706261

Lee, Seung-Hyun, Roh, Hee-Ra, Chen, Zhi Gang, and Kim, Young-Ho, "Contact Resistance and Shear Strength of the Solder Joints Formed Using Cu Bumps Capped with Sn or Ag/Sn Layer," Journal of Electronic Materials , vol. 34 no. 11, pp. 1446-1454, Nov. 2005.

Lee, Seung-Jin, Noon, Michael, and Cooper, Joyce, "Combining Regional Flow Analysis and Life Cycle Assessment: A LCD monitor recycling case study," Life Cycle Assessment VIII, Seattle, WA, Sept. 30-Oct. 2, 2008, pp. xx-xx.

Lee, Seung Hyun, and Kim, Young Ho, "Shear Strength of Fluxless Solder Joints between Sn and In Bumps," Key Engineering Materials, vol. 297-300, pp. 857-862, 2005.

Lee, Seung-Yong, Kim, Gil-Sung, Lim, Jongwoo, Han, Seungwoo, Li, Baowen, Thong, John T. L., Yoon, Young-Gui, and Lee, Sang-Kwon, "Control of surface morphology and crystal structure of silicon nanowires and their coherent phonon transport characteristics," Acta Materialia , vol. 64, pp. 62-71, Feb. 2014.

Lee, SeYong, Lee, HanMin, Shin, SangMyung, Jang, MinGu, Choi, TaeJin, and Paik, Kyung-Wook, "The Effect of Double-Layer Nonconductive Films on the Solder Sidewall Wetting and the Reliability of 40-um Cu-Pillar/SnAg Microbumps for Chip-on-Chip Interconnection," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 9 no. 6, pp. 1167-1175, June 2019.

Lee, SeYong, Lee. HanMin, Park. JongHo, Shin. SangMyung, Kim, WooJeong, Choi, TaeJin, and Paik, Kyung-Wook, "The Effect of the SnAg Solder Joint Morphology on the Thermal Cycle Reliability of 40 um Fine-pitch Cu-pillar/SnAg Micro Bump Interconnection," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 649-655.

Lee, Shang-Hua, and Chen, Chih-Ming, "Electromigration in a Sn-3 wt.%Ag-0.5 wt.%Cu-3 wt.%Bi Solder Stripe Between Two Cu Electrodes Under Current Stressing," Journal of Electronic Materials, vol. 40 no. 9, pp. 1943-1949, Sept. 2011.

Lee, Shi-Wei Ricky, and Hon, Ronald, "Multi-Stacked Flip Chips with Copper Plated Through Silicon Vias and Re-Distribution for 3D System-in-Package Integration," Materials Research Society Symposium Proceedings Volume 970, Enabling Technologies for 3-D Integration, Boston, MA, Nov. 27-29, 2006, pp. 179-190.

Lee, Shin-Bok, Yoo, Young-Ran, Jung, Ja-Young, Park, Young-Bae, Kim, Young-Sik, and Joo, Young-Chang, "Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board," Thin Solid Films, vol. 504 no. 1-2, pp. 294-297, May 10, 2006.

Lee, Shi-Wei Ricky, Lui, Ben Hoi Wai, Kong, Y. H., Baylon, Bernard, Leung, Timothy, Umali, Pompeo, and Agtarap, Hector, "Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders," Soldering & Surface Mount Technology, vol. 14 no. 3, pp. 46-50, 2002.

Lee, Shi-Wei Ricky, Lui, Ben Hoi Wai, Kong, Y. H., Baylon, Bernard, Leung, Timothy, Umali, Pompeo, and Agtarap, Hector, "Evaluation of Board Level Reliability of Pb-free PBGA Solder Joints," 2002 8th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 3-6, 2002, pp. 82-89.

Lee, Shi-Wei Ricky, and Zhang, Xiaowu, "Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading," Circuit World, vol. 24 no. 3, pp, 26-31, 1998.

Lee, Siew Kee, How, You Chye, and Khoo, Y. S., "Lead Free Antimony-Based Alloy Characterization," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 678-684.

Lee, Soon-Bok, and Kim, Ilho, "Fatigue and Fracture Assessment for Reliability of Electronic Packaging," International Conference of Fracture, Moscow, Russia, July 7-12, 2007, pp. xx-xx.

Lee, Soon-Bok, Kim, Ilho, and Park, Tae-Sang, "Fatigue and fracture assessment for reliability in electronics packaging," International Journal of Fracture, vol. 150 no. 1-2, pp. 91-104, Mar. 2008.

Lee, Soon-Bok, and Kim, Ilho, "Reliability Assessment of Electronic Packaging with Hybrid Approach of Experimental and Computational Mechanics," Third Asian-Pacific Congress on Computational Mechanics and Eleventh International Conference on the Enhancement and Promotion of Computational Methods in Engineering and Science, Kyoto, Japan, Dec. 3-6, 2007, pp. xx-xx.

Lee, Sung Bo, and Kim, Young-Min, "Signature of surface-energy dependence of partial dislocation slip in a gold nanometer-sized protrusion," Scripta Materialia, vol. 64 no. 12, pp. 1125-1128, June 2011.

Lee, T. Y., Tu, K. N., and Frear, D. R., "Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization," Journal of Applied Physics, vol. 90 no. 9, pp. 4502-4508, Nov. 1, 2001.

Lee, T. Y., Tu, K. N., Kuo, S. M., and Frear, D. R., "Electromigration of eutectic SnPb solder interconnects for flip chip technology," Journal of Applied Physics, vol. 89 no. 6, pp. 3189-3194, Mar. 15, 2001.

Lee, T. Y., Choi, W. J., Tu, K. N., Jang, J. W., Kuo, S. M., Lin, J. K., Frear, D. R., Zeng, K., and Kivilahti, J. K., "Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn-3.5 Ag, Sn-3.8Ag-0.7 Cu and Sn-0.7 Cu) on Cu," Journal of Materials Research, vol. 17 no. 2, pp. 291-301, Feb. 2002.

Lee, Tae-Kyu, and Ma, Hongtao, "Aging Impact on the Accelerated Thermal Cycling Performance of Lead-Free BGA Solder Joints in Various Stress Conditions," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 477-482.

Lee, Tae-Kyu, Liu, Bo, Zhou, Bite, Bieler, Thomas, and Liu, Kuo-Chuan, "Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects," Journal of Electronic Materials, vol. 40 no. 9, pp. 1895-1902, Sept. 2011.

Lee, Tae-Kyu, and Xie, Weidong, "Effect of Board Thickness on Sn-Ag-Cu Joint Interconnect Mechanical Shock Performance," Journal of Electronic Materials, vol. 43 no. 12, pp. 4522-4531, Dec. 2014.

Lee, Tae-Kyu, Xie, Weidong, and Guirguis, Cherif, "Effect of Elevated Testing Temperature on Sn-Ag-Cu Interconnect High and Low G Board Level Mechanical Shock Performance," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1560-1565.

Lee, Tae-Kyu, and Duh, Jeng-Gong, "Effect of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Sn-Ag-Cu and Sn-Ag Solder Interconnects With and Without Board-Side Ni Surface Finish," Journal of Electronic Materials, vol. 43 no. 11, pp. 4126-4133, Nov. 2014.

Lee, Tae-Kyu, Chen, Zhiqiang, Baty, Greg, Bieler, Thomas R., and Kim, Choong-Un, "Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance," Journal of Electronic Materials, vol. 45 no. 12, pp. 6177-6183, Dec. 2016.

Lee, Tae-Kyu, Bieler, Thomas R., and Kim, Choong-Un, "Impact of Cooling Rate-Induced Recrystallization on High G Mechanical Shock and Thermal Cycling in Sn-Ag-Cu Solder Interconnects," Journal of Electronic Materials, vol. 45 no. 1, pp. 172-181, Jan. 2016.

Lee, Tae-Kyu, "Impact of Electrical Current on the Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects," Journal of Electronic Materials, vol. 42 no. 8, pp. 599-606, Apr. 2013.

Lee, Tae-Kyu, Zhou, Bite, and Bieler, Thomas R., "Impact of Isothermal Aging and Sn Grain Orientation on the Long-Term Reliability of Wafer-Level Chip-Scale Package Sn-Ag-Cu Solder Interconnects," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 2 no. 3, pp. 496-501, Mar. 2012.

Lee, Tae-kyu, Chen, Zhiqiang, Guirguis, Cherif, and Akinade, Kola, "Impact of Isothermal Aging and Testing Temperature on Large Flip-Chip BGA Interconnect Mechanical Shock Performance," Journal of Electronic Materials, vol. 46 no. 10, pp. 6224-6233, Oct. 2017.

Lee, Tae-Kyu, Xie, Weidong, Zhou, Bite, Bieler, Thomas, and Liu, Kuo-Chuan, "Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects," Journal of Electronic Materials, vol. 40 no. 9, pp. 1967-1976, Sept. 2011.

Lee, Tae-Kyu, Ma, Hongtao, Liu, Kuo-Chuan, and Xue, Jie, "Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects," Journal of Electronic Materials, vol. 39 no. 12, pp. 2564-2573, Dec. 2010.

Lee, Tae-Kyu, Xie, Weidong, and Liu, Kuo-Chuan, "Impact of Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board Level High G Mechanical Shock Performance," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 547-552.

Lee, Tae-Kyu, Zhou, Bite, Bieler, Thomas, and Liu, Kuo-Chuan, "Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation," Journal of Electronic Materials, vol. 41 no. 2, pp. 273-282, Feb. 2012.

Lee, Tae-Kyu, Xie, Weidong, Tsai, Michael, and Sheikh, Mohamed D., "Impact of Microstructure Evolution on the Long-Term Reliability of Wafer-Level Chip-Scale Package Sn-Ag-Cu Solder Interconnects," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 10 no. 10, pp. 1594-1603, Oct. 2020.

Lee, Tae-Kyu, Kim, Choong-Un, and Bieler, Thomas R., "Influence of High-G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects," Journal of Electronic Materials, vol. 43 no. 1, pp. 69-79, Jan. 2014.

Lee, Tae-Kyu, Rogan, Carly, Waduge, Gihan Dodanduwa, Lee, Young-Woo, Ibe, Edward, and Loh, Karl, "Low Melting Temperature Solder Interconnect Behavior and Thermal Cycling Performance Enhancement using Edgebond," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 401-407.

Lee, Tae-Kyu, Liu, Kuo-Chuan, and Bieler, Thomas R., "Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints," Journal of Electronic Materials, vol. 38 no. 12, pp. 2685-2693, Dec. 2009.

Lee, Tae-Kyu, Zhou, Bite, Blair, Lauren, Liu, Kuo-Chuan, and Bieler, Thomas R., "Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy," Journal of Electronic Materials, vol. 39 no. 12, pp. 2588-2597, Dec. 2010.

Lee, Tae-Kyu, Xie, Weidong, Bieler, Thomas R., and Kim, Choong-Un, "The Impact of Microstructure Evolution, Localized Recrystallization and Board Thickness on Sn-Ag-Cu Interconnect Board Level Shock Performance," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 697-702.

Lee, Tae-Kyu, Zhou, Bite, Blair, Lauren, Liu, Kuo-Chuan, Xue, Jie, and Bieler, Thomas R., "The Interaction between Grain Orientation Evolution and Thermal Cycling as a Function of Position in Ball Grid Arrays Using Orientation Image Microscopy," 2010 Proceedings 60th Electronic Components and Technology Conference , Las Vegas, NV, June 1-4, 2010, pp. 1591-1595.

Lee, Tae-Kyu, Zhou, Bite, Bieler, Thomas R., Tseng, Chien-Fu, and Duh, Jeng-Gong, "The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance." Journal of Electronic Materials, vol. 42 no. 2, pp. 215-223, Feb. 2013.

Lee, Taik-Min, Kang, Tae Goo, Yang, Jeong Soon, Jo, Jeongdai, Kim, Kwang-Young, Choi, Byung-Oh, and Kim, Dong-Soo, "Gap Adjustable Molten Metal DoD Inkjet System With Cone-Shaped Piston Head," Journal of Manufacturing Science and Engineering, vol. 130 no. 3, pp. 031113-1-031113-6, June 2008.

Lee, Teck Kheng, Zhang, Sam, Wong, C. C., and Tan, A. C., "Assessment of Fluxless Solid Liquid Interdiffusion Bonding by Compressive Force of Au-PbSn and Au-SAC for Flip Chip Packaging," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1701-1706.

Lee, Teck Kheng, Zhang, Sam, Wong, Chee C., and Tan, A. C., "Assessment of Fluxless Solid Liquid Interdiffusion Bonding by Compressive Force of Au-PbSn and Au-SAC for Flip Chip Packaging," IEEE Transactions on Advanced Packaging, vol. 32 no. 1, pp. 116-122, Feb. 2009.

Lee, Teck Kheng, Zhang, Sam, Wong, C. C., and Tan, A. C., "Fine Pitch Au-SnAgCu Joint-in-via Flip-Chip Packaging," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 1-7.

Lee, Teck Kheng, Zhang, Sam, Wong, C. C., Tan, A. C., and Hadikusuma, Davin, "Interfacial microstructures and kinetics of Au/SnAgCu," Thin Solid Films, vol. 504 no. 1-2, pp. 441-445, May 10, 2006.

Lee, W. H., Jiang, D. S., Wang, Y. P., and Hsiao, C. S., "Underfill Selection Strategy for low k, High lead/Lead-free Flip Chip Application," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 338-341.

Lee, Woo Young, Lee, Ki Ju, Zhou, Y. Norman, and Jung, Jae Pil, "Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatings," Microelectronics Reliability, vol. xx no. x, pp. xx-xx, xxxx.

Lee, Woong Sun, Park, Myoung Geun, Cho, Il Whan, Kim, Sung Chul, Kim, Ki Young, Chung, Qwan Ho, and Byun, Kwang Yoo, "Reliability Issues on the High Speed DRAM Flip-chip Package Using Gold Stud Bump, Lead Free Solder, and Underfill," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1776-1781.

Lee, Y. D., Kim, O. H., Park, Young-Bae, Yoon, M. S., Kim, B. N., and Joo, Young-Chang, "In-situ Study on the Effects of Temperature and Size on the Electromigration Characteristics of Eutectic SnPb and Pb-free Solder Alloys," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Lee, Y. G., and Duh, J. G., "Interfacial morphology and concentration profile in the unleaded solder/Cu joint assembly," Journal of Materials Science: Materials in Electronics , vol. 10, pp. 33-43, 1999.

Lee, Y. C., and Williams, P. M., "Solderless Connection Technologies," Manufacturing Aspects in Electronic Packaging 1993, PED-Vol. 65, EEP-Vol. 5, New Orleans, LA, Nov. 28-Dec. 3, 1993, pp. 71-79.

Lee, Y. K., Fujimura, N., Ito, T., and Nishida, N., "Annealing behavior of Al-Y alloy film for interconnection conductor in microelectronic devices," Journal of Vacuum Science & Technology B , vol. 9 no. 5, pp. 2542-2547, Sept./Oct. 1991.

Lee, Y. W., Kim, I. H., Kim, E. S., Lee, J. H., and Moon, J. T., "Improvement of Wettability and Drop Impact Reliability by Al Addition in SnAgCu Solder," 2010 12th Electronics Packaging Technology Conference , Singapore, Dec. 8-10, 2010, pp. 429-432.

Lee, Y. W., Lee, J. H., Moon, J. T., Park, Y. S., and Paik, K. W., "Study of Drop-performance Improved Lead-free Solder by PCB Pad Finish," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 668-672.

Lee, Y. Y., Tseng, H. W., Hsiao, Y. H., and Liu, C. Y., "Surface Oxidation of Molten Sn(Ag, Ni, In, Cu) Alloys," JOM, vol. 61 no. 6, pp. 52-58, June 2009.

Lee, Yang-Hsien, "Microstructure and mechanical properties of Sn-Ag-xNi composite solder," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 175-178.

Lee, Yang-Hsien, and Lee, Hwa-Teng, "Shear strength and interfacial microstructure of Sn-Ag-xNi/Cu single shear lap solder joints," Materials Science and Engineering: A, vol. 444 no. 1-2, pp. 75-83, Jan. 25, 2007.

Lee, Yong-Won, Kim, Keun-Soo, Suganuma, Katsuaki, and Kim, Jong-Hoon, "Developing the Stencil Printing Process for 01005 Lead-Free Assemblies," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Lee, Yong-Won, Hong, Soon-Min, and Moon, Young-Joon, "Gapless Rework and Reliability of Lead-Free BGA Assemblies," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 1259-1264.

Lee, Yongchang, and Basaran, Cemal, "A Creep Model for Solder Alloys," Journal of Electronic Packaging , vol. 133 no. 4, pp. 044501-1-044501-6, Dec. 2011.

Lee, Young-Kyu, Ko, Yong-Ho, Yoo, Sehoon, and Lee, Chang-Woo, "Joint Properties of Au Stud Bumps Joined with Sn-3.5Ag Solder by Flip Chip Bonding," 2011 IEEE 13th Electronics Packaging Technology Conference , Singapore, Singapore, Dec. 7-9, 2011, pp. 218-222.

Lee, Young Woo, Lee, Ki Ju, Zhou, Y. Norman, and Jung, Jae Pil, "Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatings," Microelectronics Reliability, vol. 48 no. 4, pp. 631-637, Apr. 2008.

Lee, Youngtak, and Link, Doug, "Practical Application and Analysis of Lead-Free Solder for Hearing Aids," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 631-637.

Lee, Yung Hsiang, Ong, Kang Eu, Loh, Wei Keat, Wong, Shaw Fong, Gill, Paramjeet S, and Tan, Kah Kee, "The Correlation of Package Coplanarity and Reflow Warpage to SMT," 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium , Melaka, Malaysia, Nov. 30-Dec. 2, 2010, pp. xx-xx.

Leech Jr., Charles S., "An Alternative Drying Process for MSDs," Circuits Assembly, vol. 18 no. 11, pp. 42, 44-45, Nov. 2007.

Leech Jr., Charles S., "Moisture Sensitive Package Delamination - Menaces and Myths," Sept. 16, 2008.

Leech Jr., Charles S., "The Coming "Fourth Moisture-Sensitive Package Dry-Baking Process"," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 633-638.

Leemann, C., Skove, M. J., and Stillwell, E. P., "Excess "1/Ÿ" Noise in Bismuth Whiskers," Solid State Communications , vol. 35 no. 2, pp. 97-100, July 1980.

Lefeuvre, E., Kim, K. H., He, Z. B., Maurice, J.-L., Chatelet, M., Pribat, D., and Cojocaru, C. S., "Optimization of organized silicon nanowires growth inside porous anodic alumina template using hot wire chemical vapor deposition process," Thin Solid Films, vol. 519 no. 14, pp. 4603-4608, May 2, 2011.

Le Fevre, Patrick J. F., "Environmental Issues in Power Electronics (Lead Free)," Proceedings of 2002 IEEE Applied Power Electronics Conference, Dallas, TX, Mar. 10-14, 2002, pp. 121-125.

Le Fevre, Patrick, "Ericsson takes the lead in removing lead," Power Management DesignLine, Mar. 30, 2005.

Lefevre, Patrick, "Taking the lead in removing lead," Electronic Product Design , vol. 27 no. 6, pp. 17-18, June 2006.

Lefranc, G., Licht, T., and Mitic, G., "Properties of solders and their fatigue in power modules," Microelectronics Reliability, vol. 42 no. 9-11, pp. 1641-1646, Sept.-Nov. 2002.

Legarth, J. B., Alting, L., Danzer, B., Tartler, D., Brodersen, K., Scheller, H., and Feldmann, K., "A New Strategy in the Recycling of Printed Circuit Boards," Circuit World, vol. 21 no. 3, pp. 10-15, 1995.

Legaspi Jr., Severino, Chung, Chaowen, Thavarajah, Manickam, and Mihelcic, Stan, "Development and Qualification of Lead Free Enhanced Plastic Ball Grid Array Package," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 23-24, 2003.

Legendre, B., Dichi, E., and Vassiliev, V., "The Phase Diagram of the In-Sb-Sn System," Zeitschrift fur Metallkunde , vol. 92 no. 4, pp. 328-335, Apr. 2001.

Legg, Gary, "The Greening of Electronics: Designing for Recycling," TechOnline , Oct. 6, 2005.

Legg, K. O., Graham, M. E., and Bernecki, T., "Applications for Chrome Plating Alternatives: Repair Technology and OEM Coatings," 18th AESF/EPA Pollution Prevention and Control Conference , Orlando, FL, Jan. 27-29, 1997, pp. 137-141.

Legg, Keith, "Alternative Technologies for Corrosion Prevention - An Analytical Toolkit," Corrosion Reviews, vol. 25 no. 3-4, pp. 337-353, 2007.

Legg, Keith O., and Sartwell, Bruce, "Alternatives to Functional Hexavalent Chromium Coatings: HVOF Thermal Spray," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 338-350.

Legg, Keith O., "Chrome-free: aircraft finishing: high-velocity oxygen-fuel and other finishing technologies are providing high-performance alternatives to engineered hard chrome in the aerospace industry," Finishing Today , vol. 84 no. 3, pp. 22, Mar. 2008.

Legg, Keith O., "Economically Viable Hard Chrome Alternatives," Plating & Surface Finishing, vol. 83 no. 7, pp. 12-14, July 1996.

Legg, Keith, and Sartwell, Bruce, "Hard Chromium Alternatives Team Update - Improving Performance While Reducing Cost."

Legge, Graham, "Ion Vapor Deposited Coatings for Improved Corrosion Protection," Products Finishing, vol. xx no. x, pp. 59-64, Oct. 1995.

Legnani, Andrea, "The Standardization of EcoDesign in EU: The work of CENELEC TC 111X "Environment" and the program of standardisation work in the field of eco-design of Energy-using Products (EuP)," Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing , Tokyo, Japan, Dec. 12-14, 2005, pp. 23-26.

Legrain, Fleur, and Manzhos, Sergei, "Understanding the difference in cohesive energies between alpha and beta tin in DFT calculations," AIP Advances, vol. 6 no. 4, pp. 045116-1-045116-11, Apr. 2016. https://doi.org/10.1063/1.4948434

Lehman, L. P., Xing, Y., Bieler, T. R., and Cotts, E. J., "Cyclic twin nucleation in tin-based solder alloys," Acta Materialia , vol. 58 no. 10, pp. 3546-3556, June 2010.

Lehman, L. P., Kinyanjui, R. K., Zavalij, L., Zribi, A., and Cotts, E. J., "Growth and Selection of Intermetallic Species in Sn-Ag-Cu No-Pb Solder Systems Based on Pad Metallurgies and Thermal Histories," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1215-1221.

Lehman, L. P., Athavale, S. N., Fullem, T. Z., Giamis, A. C., Kinyanjui, R. K., Lowenstein, M., Mather, K., Patel, R., Rae, D., Wang, J., Xing, Y., Zavalij, L., Borgesen, P., and Cotts, E. J., "Growth of Sn and Intermetallic Compounds in Sn-Ag-Cu Solder," Journal of Electronic Materials, vol. 33 no. 12, pp. 1429-1439, Dec. 2004.

Lehman, L. P., Kinyanjui, R. K., Wang, J., Xing, Y., Zavalij, L., Borgesen, P., and Cotts, E. J. "Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 674-681.

Lei, J. P., Dong, X. L., Zhu, X. G., Lei, M. K., Huang, H., Zhang, X. F., Lu, B., Park, W. J., and Chung, H. S., "Formation and characterization of intermetallic Fe-Sn nanoparticles synthesized by an arc discharge method," Intermetallics, vol. 15 no. 12, pp. 1589-1594, Dec. 2007.

Lei, M., Fu, X. L., Yang, H. J., Wang, Y. G., Li, P. G., Hu, Q. R., and Tang, W. H., "Ga-catalyzed growth of ZnSe nanowires and the cathodoluminescence and electric transport properties of individual nanowire," Materials Chemistry and Physics, vol. 133 no. 2-3, pp. 823-828, Apr. 16, 2012.

Lei, Thomas Guangyin, Calata, Jesus Noel, Lu, Guo-Quan, Chen, Xu, and Luo, Shufang, "Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area (>100 mm2) Chips," IEEE Transactions on Components and Packaging Technologies, vol. 33 no. 1, pp. 98-104, Mar. 2010.

Lei, Thomas G., Calata, Jesus, Luo, Shufang, Lu, Guo-Quan, and Chen, Xu, "Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules," Key Engineering Materials, vol. 353-358 Part 4, pp. 2948-2953, 2007.

Lei, Wang, Fengshun, Wu, Jinsong, Zhang, Bing, An, and Yiping, Wu, "Effects of electromigration on IMC evolution in Pb-free solder joints," 2004 International Conference on Business of Electronic Product Reliability and Liability, Shanghai, China, Apr. 27-30, 2004, pp. 47-49.

Lei, Wang, Fengshun, Wu, Yiping, Wu, and Jinsong, Zhang, "The Effect of Current Crowding on Electromigration in Lead-free Flip Chip Bump Interconnect," Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis , Shanghai, China, June 30-July 3, 2004, pp. 224-226.

Leicht, Helmut, and Thumm, Andreas, "Today's Vapor Phase Soldering: An Optimized Reflow Technology for Lead Free Soldering," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 356-360.

Leidecker, Henning, Panashchenko, Lyudmyla, and Brusse, Jay, "Electrical Failure of an Accelerator Pedal Position Sensor Caused by a Tin Whisker and Discussion of Investigative Techniques Used for Whisker Detection," 5th International Tin Whisker Symposium, College Park, MD, Sept. 14-15, 2011, pp. xx-xx.

Leidecker, Henning, Brusse, Jay, and Panashchenko, Lyudmyla, "Metal Vapor Sparking and Arcing," 4th International Symposium on Tin Whiskers, College Park, MD, June 23-24, 2010, pp. xx-xx.

Leidecker, Henning, "Metal Vapor Sparking and Arcing," Tin Whisker Group teleconference, Dec. 22, 2010.

Leidecker, Henning, and Brusse, Jay, "Metal Whiskering: Tin, Zinc, and Cadmium," Proceedings of CALCE International Symposium on Tin Whiskers, College Park, MD, Apr. 24-25, 2007, pp. xx-xx.

Leidecker, Henning, and Brusse, Jay, "Tin Whiskers: A History of Documented Electrical System Failures," NASA, Apr. 2006.

Leidecker, Henning, Greenwell, Chris, and Brusse, Jay, "Whiskers of Tin-Lead (Sn-Pb) on REFLOWED Die Attach Solder Used in the Manufacture of a Laser Diode Array," NASA, Dec. 2003.

Leinbach, Greg, and Oresjo, Stig, "An Experimental Methodology for Process Optimization," Circuits Assembly, vol. 16 no. 7, pp. 42, July 2005.

Leinenbach, C., Valenza, F., Giuranno, D., Elsener, H. R., Jin, S., and Novakovic, R., "Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates," Journal of Electronic Materials, vol. 40 no. 7, pp. 1533-1541, July 2011.

Leineweber, A., Wieser, C., and Hugel, W., "Cu6Sn5 intermetallic: Reconciling composition and crystal structure," Scripta Materialia, vol. 183, pp. 66-70, July 1, 2020.

Leinert, S., Martin, N., Breuer, D., and Werner, W., "Comparison of the Phase Morphology for Several Sn-Ag Based Solder Ball Alloys in FBGA Packages," 1st Electronics Systemintegration Technology Conference, Volume 2, Dresden, Germany, Sept. 5-7, 2006, pp. 1182-1186.

Leitner, Jindrich, Mikulec, Jan, Vonka, Petr, Stejskal, Josef, Hladina, Rudolf, and Klima, Premysl, "Thermodynamic analysis of the deposition of GaAs epitaxial layers prepared by the MOCVD method," Journal of Crystal Growth, vol. 112 no. 2-3, pp. 437-444, June 1991.

Lejuste, Charles, Hodaj, Fiqiri, and Petit, Luc, "Solid state interaction between a Sn-Ag-Cu-In solder alloy and Cu substrate," Intermetallics, vol. 36, pp. 102-108, May 2013.

Lemkey, F. D., and Kraft, R. W., "Tensile Testing Technique for Submicron Specimens," Review of Scientific Instruments, vol. 33 no. 8, pp. 846-849, Aug. 1962.

Lemon, Sumner, "Cost of Intel's lead-free move hits $100M, and counting," InfoWorld, Mar. 16, 2005.

Lempinen, J., and Tuominen, A., "Evaluation of Reflow Ovens for Lead-Free Soldering," Proceedings of 2006 25th International Conference on Microelectronics, Belgrade, Serbia and Montenegro, May 14-17, 2006, pp. 609-612.

Lenarthova, J., Kohutekova, V., and Lesko, A., "Methods of Tinplate Imperfection Analyses," Materials Science Forum , vol. 539-543, pp. 4289-4294, Mar. 2007.

Leng, Eu Poh, Ding, Min, Ling, Wong Tzu, Amin, Nowshad, Ahmad, Ibrahim, Lee, Mok Yong, and Haseeb, A. S. M. A., "A Comparison Study on SnAgNiCo and Sn3.8Ag0.7Cu C5 Lead Free Solder System," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Leng, Eu Poh, Ling, Wong Tzu, Amin, Nowshad, and Ahmad, Ibrahim, "A Study of Lead-Free BGA Backward Compatibility Through Solderability Testing at Component Level," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Leng, Eu Poh, Ling, Wong Tzu, Amin, Nowshad, and Ahmad, Ibrahim, "A Study of Lead-Free BGA Backward Compatibility Through Solderability Testing at Component Level," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 463-469.

Leng, Eu Poh, Ding, Min, Ling, Wong Tzu, Amin, Nowshad, Ahmad, Ibrahim, Lee, Mok Yong, and Haseeb, A. S. M. A., "A Study of SnAgNiCo vs Sn3.8AgO. 7Cu C5 Lead Free Solder Alloy on Mechanical Strength of BGA Solder Joint," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 588-594.

Leng, Eu Poh, Ding, Min, Jiun, Hoh Huey, Ahmad, Ibrahim, and Hazlinda, Kamarudin, "Advantages & Challenges of Cold Ball Pull Test vs Conventional Ball Shear Test in the Assessment of Lead-free Solder Joint Performance," 31st International Conference on Electronics Manufacturing and Technology , Kuala Lumpur, Malasia, Nov. 8-10, 2007, pp. 534-540.

Leng, Eu Poh, Ling, Wong Tzu, Amin, Nowshad, Ahmad, Ibrahim, Han, Tay Yee, Chiao, Chin Wen, and Haseeb, A. S. M. A., "BGA Lead-free C5 Solder System Improvement by Germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu Solder Alloy," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 82-91.

Leng, Eu Poh, Ling, Wong Tzu, Amin, Nowshad, and Ahmad, Ibrahim, "FCPBGA with SOP Pad Finishing A Study of Lead-Free Solder Ball Attach Improvement," 2008 10th Electronics Packaging Technology Conference , Singapore, Dec. 9-12, 2008, pp. 1040-1045.

Leng, Eu Poh, Ding, Min, Ahmad, Ibrahim, Jiun, Hoh Huey, and Hazlinda, Kamarudin, "Lead-free Flux Effect in Lead-free Solder Joint Improvement," 31st International Conference on Electronics Manufacturing and Technology, Kuala Lumpur, Malasia, Nov. 8-10, 2007, pp. 541-548.

Leng, Eu Poh, Ding, Min, Lindsay, Wayne, Chopin, Sheila, Ahmad, Ibrahim, and Jalar, Azman, "Pb-free BGA Solder Joint Reliability Improvement with Sn3.5Ag Solder Alloy on Ni/Au Finish," 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium, San Jose, CA, Oct. 3-5, 2007, pp. 243-250.

Leng, Eu Poh, Ding, Min, Rayos, Joah, Ahmad, Ibrahim, Jalar, Azman, and Qiang, Cui Cheng, "The Effect of Ni Thickness on Mechanical Strength of Pb-free BGA Spheres on Selectively Plated Ni/Au Finish," 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium, San Jose, CA, Oct. 3-5, 2007, pp. 225-232.

Lenkkeri, Jaakko, and Rusanen, Outi, "Conductive adhesives as die-bonding materials for power electric modules," Journal of Electronics Manufacturing, vol. 3 no. x, pp. 199-204, 1993.

Lenkkeri, Jaakko, and Vahakangas, Jouko, "Reliability Testing and Stress Strain Estimations of Flip-Chip Joints made by Stud-Bump-Bonding Technique," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 305-311.

Lenton, Dominic, "Is Europe ready to go lead free?," IEE Review, vol. 48 no. 6, pp. 41-42, Nov. 2002.

Lenton, Dominic, "RoHS Directive Makes Low-Key Debut," Engineering and Technology, vol. 1 no. 5, pp. 25, Aug. 2006.

Lentz, Tony, "Fill the Void III," Printed Circuit Design and Fab/ Circuits Assembly, vol. 35 no. 3, pp. 38-45, Mar. 2018.

Lentz, Tony, "Fill The Void III," SMTA Journal, vol. 31 no. 2, pp. 13-20, 2018.

Lentz, Tony, Scimeca, Tom, and Sikorcin, Glenn, "HASL and Flow: A Lead-Free Alternative," CircuiTree, vol. 21 no. 2, pp. xx-xx, Feb. 2008.

Lentz, Tony, Bath, Jasbir, and Pavithiran, N., "How Does Printed Solder Paste Volume Affect Solder Joint Reliability?," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Lentz, Tony, "How Does Surface Finish Affect Solder Paste Performance?," Proceedings of SMTA International, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx,

Lentz. Tony, "The Effects of Surface Finish on Solder Paste Performance - The Sequel," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 742-752.

Leo, Lisa, "Are You Ready for RoHS-Compliance?," Manufacturing.net, Feb, 21, 2006.

Leo, Lisa, "Getting Ready for RoHS-Compliance," Microwave Product Digest, pp. 22-23, 66-69, June 2005.

Leo, Lisa, "Ready for RoHS?," Circuits Assembly, vol. 16 no. 4, pp. 38, Apr. 2005.

Leodolter-Dworak, Monika, Steffan, Ilse, Plumbridge, William J., and Ipser, Herbert, "Tin Pest in Sn-0.5Cu Lead-Free Solder Alloys: A Chemical Analysis of Trace Elements," Journal of Electronic Materials, vol. 39 no. 1, pp. 105-108, Jan. 2010.

Leonardi, Nicholas, "Bridging Supply Chain Gap for Exempt High-Reliability OEM's Tin Whisker Mitigation and Counterfeit Detection," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 179-184.

Leong, J. C., Tsao, L. C., Fang, C. J., and Chu, C. P., "Effect of nano-TiO2 addition on the microstructure and bonding strengths of Sn3.5Ag0.5Cu composite solder BGA packages with immersion Sn surface finish," Journal of Materials Science: Materials in Electronics, vol. 22 no. 9, pp. 1443-1449, Sept. 2011.

Leong, Y. M., Haseeb, A. S. M. A., Nishikawa, Hiroshi, and Mokhtari, Omid, "Microstructure and mechanical properties of Sn-1.0Ag-0.5Cu solder with minor Zn additions," Journal of Materials Science: Materials in Electronics , vol. 30 no. 13, pp. 11914-11922, July 2019.

Leong, Yee Mei, and Haseeb, A. S. M. A., "Soldering and interfacial characteristics of Sn-3.5Ag solder containing zinc nanoparticles," 2012 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Nov. 6-8, 2012, pp. xx-xx.

Leopold, Eileen, "Adoption of RoHS directives globally - how ready are South Africa?," EngineerIT, pp. xx-xx, Nov. 2006.

Leopold, Eileen, "Ready or not - here comes RoHS!," Elektron, vol. xx no. xx, pp. xx-xx, Feb. 2006.

LePree, Joy, "Time to Get Plugged into RoHS," Product Design & Development , vol. 60 no. 11, pp. 14-15, Nov. 2005.

Leslie, D., Heid, T., and Dasgupta, A., "Effect of Temperature on Vibration Fatigue of SAC105 Solder Material after Extended Room Temperature Aging," 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Toulouse, France, Apr. 15-18, 2018, pp. xx-xx.

Lesniewski, Thomas, and Hillman, Dave, "An Investigation of Whisker Growth on Tin-Coated Wire and Braid," Surface Mount Technology (SMT), vol. 27 no. 8, pp. 32-34,36,38-40,42-43, Aug. 2012.

Lesniewski, Thomas, "Assessment of Whisker Growth from Tin Coated Wire and Cable," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 619-627.

Lesniewski, Tom, "Effects of Tin Mitigation Processes on Whisker Growth and Solder Joint Reliability for Chip and Small-Outline Package Components," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S13:01.

Letterer, Michael, "Whisker-Reducing Immersion Tin Technology," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Le Toux, Thomas, Dusek, Milos, and Hunt, Christopher, "The Effect of Temperature on Microstructure of Lead-free Solder Joints," NPL Report MATC(A)157, Nov. 2003.

Leung, Anna O. W., Zheng, Jinshu, Yu, Chik Kin, Liu, Wing Keung, Wong, Chris K. C., Cai, Zongwei, and Wong, Ming H., "Polybrominated Diphenyl Ethers and Polychlorinated Dibenzo-p-dioxins and Dibenzofurans in Surface Dust at an E-Waste Processing Site in Southeast China," Environmental Science & Technology, vol. 45 no. 13, pp. 5775-5782, July 1, 2011.

Leung, Anna O. W., Luksemburg, William J., Wong, Anthony S., and Wong, Ming H., "Spatial Distribution of Polybrominated Diphenyl Ethers and Polychlorinated Dibenzo-p-dioxins and Dibenzofurans in Soil and Combusted Residue at Guiyu, an Electronic Waste Recycling Site in Southeast China," Environmental Science & Technology, vol. 41 no. 8, pp. 2730-2737, 2007.

Leung, Lam, "Why Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)?," PCB007, Sept. 17, 2008.

Leung, Y. P., Liu, Z., and Hark, S. K., "Changes in morphology and growth rate of quasi-one-dimensional ZnSe nanowires on GaAs (1 0 0) substrates by metalorganic chemical vapor deposition," Journal of Crystal Growth, vol. 279 no. 3-4, pp. 248-257, June 1, 2005.

Levchik, S., "New Phosphorus-Based Curing Agent for Copper Clad Laminates," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S07-03-1-S07-03-7.

Levi, George, Clarke, David R., and Kaplan, Wayne D., "Free Surface and Interface Thermodynamics of Liquid Nickel in Contact with Alumina," Interface Science, vol. 12 no. 1, pp. 73-83, Jan. 2004.

Levine, Bernard, "Facing a Lead-Free Future," Semimfg.com, pp 31-54, Sept. 2003.

Levine, Bernard, "Industry Seeks Lead-Free Alloys," Electronic News, Dec. 6, 1999.

Levine, Bernard, "Lead-Free Debate Rages On," Electronic News, vol. 48 no. 4, pp. 4, Jan. 21, 2002.

Levine, Bernard, "Lead-Free Electronics Under Scrutiny at APEX," Electronic News , vol. 47 no. 4, pp. 49, Jan. 22, 2001.

Levine, Bernard, "Leaders to Meet to Lead-Free the World," Electronic News, vol. 46 no. 37, pp. 1, 66, Sept. 11, 2000.

Levine, Bernard, "NEMI Picks Alloy to Get Lead Out," Electronic News, vol. 46 no. 4, pp. 40, Jan 24, 2000.

Levine, Bernard, "NEMI Targets Lead-Free Alloy," Electronic News, vol. 45 no. 44, pp. 46, Nov. 1, 1999.

Levine, Bernard, "The Case for Lead," Electronic News, vol. 46 no. 14, pp, 50, Apr. 3, 2000.

Levine, Bernard, "The Heat is on Lead-Free," Electronic News, vol. 46 no. 14, pp. 50, Apr. 3, 2000.

Levine, Bernard, "The How-To of Lead-Free," Electronic News, vol. 46 no. 13, pp. 1-2, Mar. 20, 2000.

Levine, Bernard, "TI Joins Lead-Free Project," Electronic News, vol. 46 no. 36, pp. 56, Sept. 4, 2000.

Levine, Bernard, "Will 'Tin Whiskers' Grow When You Get the Lead Out?," Electronic News, Mar. 25, 2002.

Levinson, Tzvi, Dror, Gil, and Lietzmann, Julia, "EU RoHS under review," EE Times Europe, Feb. 12, 2008.

Levinson, Tzvi, Lietzmann, Julia, and Dror, Gil, "Norway to prohibit 18 hazardous substances," EE Times Europe , vol. xx no. xx, pp. xx-xx, Nov. 12, 2007.

Levinson, Tzvi, Lietzmann, Julia, and Dror, Gil, "Norway to prohibit 18 hazardous substances," Electronics Supply & Manufacturing, Nov. 2007.

Levis, Kim-Marie, and Mawer, Andrew, "Assembly and Solder Joint Reliability of Plastic Ball Grid Array with Lead-Free Versus Lead-Tin Interconnect," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 1198-1204.

Levittt, Joshua, "Cash from waste," Green SupplyLine, Mar. 1, 2007.

Levittt, Joshua, "Cash from waste," Electronics Supply & Manufacturing, Mar. 2007.

Levoguer, Carl, "An Analysis of the Current Status of Lead-Free Soldering: Awareness and Implementation," SMART Group Lead-Free Seminar 1999, High Wycombe, UK, Feb. 10, 1999.

Levy, Paul W., and Kammerer, Otto F., ""Spiral Polygon" Tin Whiskers," Journal of Applied Physics, vol. 26 no. 9, pp. 1182-1183, Sept. 1955.

Lew, Kok-Keong, and Redwing, Joan M., "Growth characteristics of silicon nanowires synthesized by vapor-liquid-solid growth in nanoporous alumina templates," Journal of Crystal Growth , vol. 254 no. 1-2, pp. 14-22, June 2003.

Lewis, Alan, "Formulation Considerations for Automated Dispensing of Lead Free Solder Paste," Asymtek.

Lewis, B., "The growth of crystals at low supersaturation: II. Comparison with experiment," Journal of Crystal Growth, vol. 21 no. 1, pp. 40-50, January 1974.

Lewis, Brian J., Houston, Paul N., and Baldwin, Daniel F., "Flip Chip Processing for SIP Applications," Assembly, vol xx no. x, pp. xx-xx, Feb. 2004.

Lewis, Brian, Chouta, Prashant, Singer, Adam, and Rae, Alan, "Processing Heat-Sensitive Components in Lead-Free and Other Conditions," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 747-750.

Lewis, Daniel, Allen, Sarah, Notis, Michael, and Scotch, Adam, "Determination of the Eutectic Structure in the Ag-Cu-Sn System," Journal of Electronic Materials, vol. 31 no. 2, pp. 161-167, Feb. 2002.

Lewis, H. J., and Coughlan, F. M., "An Overview of the Use of Electrically Conductive Adhesives (ECAs) as a Solder Replacement," Journal of Adhesion Science and Technology, vol. 22 no. 8-9, pp. 801-813, 2008.

Lewis, H. J., and Ryan, A., "Using Electrically Conductive Inks and Adhesives as a Means to Satisfy European PCB Manufacturing Directives," Journal of Adhesion Science and Technology, vol. 22 no. 8-9, pp. 893-913, 2008.

Lewis, T. L., Ndiaye, C. O., and Wilcox, J. R., "Inclusion Voiding in Gull Wing Solder Joints," IPC APEX EXPO Proceedings, San Diego, CA, Feb. 28-Mar. 1, 2012, pp. 747-765.

Lewis, Theron, Wilcox, Jim, and Ndiaye, Cheikhou O., "Inclusion Voiding in Gull Wing Solder Joints," Surface Mount Technology (SMT), vol. 28 no. 5, pp. 40,42-44,46-48,50-52,54, May 2013.

Leys, Douglas, and Schaefer, Stephen P. "PWB Dielectric Substrates for Lead-Free Electronics Manufacturing," CircuiTree, vol. 16 no. 8, pp. xx, Aug. 2003.

Li, An-Ping, Kim, Tae-Hwan, Zhang, X.-G., Nicholson, Don M., Evans, B. M., Kulkarni, N. S., Kenik, E. A., Meyer, H. M., and Radhakrishnan, B., "Direct Measurement of Grain Boundary Resistance in Copper Nanowires," 2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization, Dresden, Germany, May 8-12, 2011, pp. xx-xx.

Li, B., Zhang, X. P., Yang, Y., Yin, L. M., and Pecht, M. G., "Size and constraint effects on interfacial fracture behavior of microscale solder interconnects," Microelectronics Reliability, vol. 53 no. 1, pp. 154-163, Jan. 2013.

Li, B. S., and Lin, A., "Study of Hard Chromium Plating from Trivalent Chromium Electrolyte," Key Engineering Materials, vol. 373-374, pp. 200-203, 2008.

Li, Bin, Zhao, Zhenqing, Li, Mingyu, Wang, Tao, and Li, Hui, "Effects of Multiple Reflow Cycles on the Reliability of Sn-Sb Solders for Power Electronics Packaging," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 557-560.

Li, Bin, Yin, Limeng, Yang, Yan, and Zhang, Xinping, "FE Simulation of Size Effects on Interface Fracture Characteristics of Microscale Lead-Free Solder Interconnects," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 242-247.

Li, Bin, Zhao, Zhenqing, Li, Mingyu, Wang, Tao, and Li, Hui, "Reliability Evaluation of Sintered Silver and Sn-3Ag-0.5Cu Solder Joints Using a Thermal Cycling Test," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 565-568.

Li, Bo, Shi, Yaowu, Lei, Yongping, Guo, Fu, Xia, Zhidong, and Zong, Bin, "Effect of Rare Earth Element Addition on the Microstructure of Sn-Ag-Cu solder Joint," Journal of Electronic Materials, vol. 34 no. 3, pp. 217-224, Mar. 2005.

Li, C. B., Usami, K., Mizuta, H., and Oda, S., "Growth of Ge-Si nanowire heterostructures via chemical vapor deposition," Thin Solid Films, vol. 519 no. 13, pp. 4174-4176, Apr. 2011.

Li, C. B., Fobelets, K., and Durrani, Z. A. K., "Study of Two-step Electroless Etched Si Nanowire Arrays," Applied Mechanics and Materials, vol. 110-116, pp. 3284-3288, Oct. 2011.

Li, C. C., Ke, J. H., Yang, C. A., and Kao, C. R., "Mechanism of volume shrinkage during reaction between Ni and Ag-doped Sn," Materials Letters, vol. 156, pp. 150-152, Oct. 1, 2015.

Li, C. C., Chung, C. K., Shih, W. L., and Kao, C. R., "Volume Shrinkage Induced by Interfacial Reaction in Micro-Ni/Sn/Ni Joints," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 45 no. 5, pp. 2343-2346, May 2014.

Li, C. F., Liu, Z. Q., Shang, P. J., and Shang, J. K., "In situ investigation on the oxidation behavior of a RESn3 film by transmission electron microscopy," Scripta Materialia, vol. 65 no. 12, pp. 1049-1052, Dec. 2011.

Li, Cai-Fu, and Liu, Zhi-Quan, "Microstructure and growth mechanism of tin whiskers on RESn3 compounds," Acta Materialia, vol. 61 no. 2, pp. 589-601, Jan. 2013.

Li, Cai-Fu, Liu, Zhi-Quan, and Shang, Jian-Ku, "The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy," Journal of Alloys and Compounds, vol. 550, pp. 231-238, Feb. 15, 2013.

Li, Cai-Fu, Liu, Zhi-Quan, and Shang, Jian-Ku, "Transmission Electron Microscopy Investigations on the Growth of Tin Whiskers from CeSn3 Substrate," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 903-906.

Li, Cao, Wang, Xuefang, Song, Shao, and Liu, Sheng, "21-Layer 3-D Chip Stacking Based on Cu-Sn Bump Bonding," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 5 no. 5, pp. 627-635, May 2015.

Li, Cao, Wang, Xuefang, Chen, Mingxiang, Zhou, Shengjun, Lv, Yaping, and Liu, Sheng, "Novel Design and Reliability Assessment of a 3D DRAM Stacking Based on Cu-Sn Micro-Bump Bonding and TSV Interconnection Technology," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 1861-1865.

Li, Chang-Zheng, Yan, Mo-Yang, Zhou, Min-Bo, Ma, Xiao, Zhang, Xin-Ping, Zhang, Hui, Ye, Qiao-Sheng, and Huang, Yi-Rong, "Effect of Activators and Surfactants in Halogen-free Fluxes on Wettability of Sn-0.7Cu-0.05Ni Solder on Cu Substrate," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 321-324.

Li, Chia-Ying, Chiou, Guo-Jyun, and Duh, Jenq-Gong, "Phase Distribution and Phase Analysis in Cu6Sn5, Ni3Sn4, and the Sn-Rich Corner in ther Ternary Sn-Cu-Ni Isotherm at 240øC," Journal of Electronic Materials, vol. 35 no. 2, pp. 343-352, Feb. 2006.

Li, Chia-Ying, and Duh, Jenq-Gong, "Phase equilibria in the Sn-rich corner of the Sn-Cu-Ni ternary alloy system at 240°C," Journal of Materials Research, vol. 20 no. 11, pp. 3118-3124, Nov. 2005.

Li, Chuanbo, Fobelets, Kristel, Jalal, S. N. Syed, Ng, Wei A., and Durrani, Zahid A. K., "Influence of chemical modification on the electrical properties of Si nanowire arrays," Advanced Materials Research, vol. 160-162, pp. 1331-1335, 2011.

Li, Chun-quan, and Wu, Zhao-hua, "SPC System Analysis and Design of Reflow Soldering Process," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Li, Chunyuan, Wang, Xitao, and Yuan, Wenxia, "Properties of two new medium temperature solders," Soldering & Surface Mount Technology, vol. 21 no. 2, pp. 4-8, 2009.

Li, Cui, Lei, Yongping, Lin, Jian, and Tian, Ye, "Analysis of lead-free solder paste based on performance degradation," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 375-379.

Li, Cuiling, Malgras, Victor, Alshehri, Saad M., Kim, Jung Ho, and Yamauchi, Yusuke, "Electrochemical Synthesis of Mesoporous Pt Nanowires with Highly Electrocatalytic Activity toward Methanol Oxidation Reaction," Electrochimica Acta, vol. 183, pp. 107-111, Nov. 20, 2015.

Li, D., Yin, L. M., Yao, Z. X., Wang, G., Zhang, L. P., and Wang, C. X., "Microstructures and properties of Bi-11Ag solder doped with small amounts of Sn," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 510-512.

Li, D., Delsante, S., Gong,, W., and Borzone, G., "Partial and integral enthalpies of mixing of Ag-Ga-Sn liquid alloys," Thermochimica Acta, vol. 523 no. 1-2, pp. 51-62, Aug. 20, 2011.

Li, D., Yin, L. M., Yao, Z. X., Wang, G., Zhang, L. P., and Wang, C. X., "Tensile strength and interfacial reaction of Cu-cored SAC305 solder joint," 2017 18th International Conference on Electronic Packaging Technology , Harbin, China, Aug. 16-19, 2017, pp. 513-515.

Li, D., Delsante, S., Watson, A., and Borzone, G., "The Effect of Sb Addition on Sn-Based Alloys for High-Temperature Lead-Free Solders: an Investigation of the Ag-Sb-Sn System," Journal of Electronic Materials, vol. 41 no. 1, pp. 67-85, Jan. 2012.

Li, Dezhi, Liu, Changqing, and Conway, Paul P., "Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn-Ag-Cu flip-chip solder interconnects," Materials Science and Engineering A, vol. 391 no. 1-2, pp. 95-103, Jan. 25, 2005.

Li, Dezhi, Conway, Paul P., and Liu, Changqing, "Corrosion characterization of tin-lead and lead free solders in 3.5 wt.% NaCl solution," Corrosion Science, vol. 50 no. 4, pp. 995-1004, Apr. 2008.

Li, Dezhi, Liu, Changqing, and Conway, Paul P., "Interfacial Reactions between Pb-free Solders and Metallised Substrate Surfaces," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Li, Dezhi, Liu, Changqing, and Conway, Paul, "Micromechanical Characterisation of Sn-Ag-Cu Solder FCOB Interconnects at Ambient and Elevated Temperatures," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 128-133.

Li, Dezhi, Liu, Changqing, and Conway, Paul P., "Microstructure and Shear Strength Evolution of Sn-Ag-Cu Solder Bumps during Aging at Different Temperatures," Journal of Electronic Materials , vol. 35 no. 3, pp. 388-398, Mar. 2006.

Li, Dezhi, Liu, Changqing, and Conway, Paul P., "Reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder joints with different connection pads," Proceedings of the 2006 IEEE CPMT Conference on High Density Microsystem Design, Packaging and Component Failure Analysis , Shanghai, June 27-28, 2006, pp. 108-114.

Li, Dezhi, Liu, Changqing, and Conway, Paul P., "Reliability of Fine Pitch Sn-3.8Ag-0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB," Journal of Electronic Packaging , vol. 130 no. 1, pp. 011005-1-011005-7, Mar. 2008.

Li, Dezhi, Liu, Changqing, and Conway, Paul P., "Solderability of electroless deposited Ni-P coatings with Sn-3.8Ag-0.7Cu and Sn-3.5Ag lead-free solder alloys," Circuit World, vol. 31 no. 3, pp. 32-39, 2005.

Li, Dongsheng, Cui, Huiwang, Fan, Qiong, Duan, Yajun, Yuan, Zhichao, Ye, Lilei, and Liu, Johan, "Study into the Application of Single-Wall Carbon Nanotubes in Isotropic Conductive Adhesives," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 430-435.

Li, Edward, "Lead-Free - Dilemma for High Reliability," CARTS-Europe 2004 , Nice, France, Oct. 18-21, 2004, pp. 97-103.

Li, Fagen, Li, Le, and Wang, Jun, "Magnetic properties and Mossbauer spectroscopy of iron nanowire arrays prepared by electroless deposition in a magnetic field," IET Micro & Nano Letters, vol. 10 no. 1, pp. 54-57, Jan. 2015.

Li, Fei, Liu, Chunshong, Xian, Aiping, and Shang, Jianku, "Interfacial Reaction Between Eutectic Sn-58Bi Lead-Free Solder and Electroless Ni-P Plating," Acta Metallurgica Sinica, vol. 40 no. 8, pp. 815-821, Aug. 2004.

Li, Feng, Verdingovas, Vadimas, Medgyes, Balint, and Ambat, Rajan, "Corrosion Reliability of Lead-free Solder Systems Used in Electronics," 2017 40th International Spring Seminar on Electronics Technology, Sofia, Bulgaria, May 10-14, 2017, pp. xx-xx.

Li, Feng, Verdingovas, Vadimas, Dirscherl, Kai, Harsanyi, Gabor, Medgyes, Balint, and Ambat, Rajan, "Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn-Ag-Cu solder alloys," Journal of Materials Science: Materials in Electronics, vol. 31 no. 18, pp. 15308-15321, Sept. 2020.

Li, Feng, Hu, Yongjun, Cheng, Xiaoling, and Xiao, Xiaoting, "Microstructure and mechanical properties of Sn-Bi Alloy treated in the semi-solid state by mechanical stirring process," Advanced Materials Research, vol. 150-151, pp. 1768-1771, 2011.

Li, Feng Ji, Zhang, Sam, Lee, Jyh-Wei, Guo, Jun, White, Timothy John, Li, Bo, and Zhao, Dongliang, "Orientation of silicon nanowires grown from nickel-coated silicon wafers," Journal of Crystal Growth, vol. 404, pp. 26-33, Oct. 15, 2014. https://doi.org/10.1016/j.jcrysgro.2014.06.033

Li, Feng Ji, Zhang, Sam, and Lee, Jyh-Wei, "Rethinking of the silicon nanowire growth mechanism during thermal evaporation of Si-containing powders," Thin Solid Films, vol. 558, pp. 75-85, May 2, 2014.

Li, Feng Ji, Zhang, Sam, Lee, Jyh-Wei, and Zhao, Dongliang, "Wire or no wire-- Depends on the catalyst layer thickness," Journal of Crystal Growth, vol. 381, pp. 87-92, Oct. 15, 2013.

Li, Fengji, Huang, Yuehua, Wang, Shu, and Zhang, Sam, "Structure-sensitive principle in silicon nanowire growth," Thin Solid Films, vol. 697, pp. 137814-1-137814-6, Mar. 1, 2020.

Li, Fu-Quan, and Wang, Chun-Qing, "Influence of interfacial reaction between molten SnAgCu solder droplet and Au/Ni/Cu pad on IMC evolution," Transactions of Nonferrous Metals Society of China, vol. 16 no. 1, pp. 18-22, Feb. 2006.

Li, G. Y., "Effect of Dopant on Microstructure and Mechanical Properties of Pb-Free Solder Joints," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Li, G. Y., Chen, B. L., Shi, X. Q., Wong, Stephen C. K., and Wang, Z. F., "Effects of Sb addition on tensile strength of Sn-3.5Ag-0.7Cu solder alloy and joint," Thin Solid Films, vol. 504 no. 1-2, pp. 421-425, May 10, 2006.

Li, G. Y., and Chen, B. L., "Formation and Growth Kinetics of Interfacial Intermetallics in Pb-Free Solder Joint," IEEE Transactions on Components and Packaging Technologies, vol. 26 no. 3, pp. 651-658, Sept. 2003.

Li, G. Y., Bi, X. D., Chen, Q., and Shi, X. Q., "Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints," Journal of Electronic Materials, vol. 40 no. 2, pp. 165-175, Feb. 2011.

Li, G. Y., Jiang, X. B., Li, B., Chen, P., and Liao, R., "Influence of Dopant on IMC Growth and Mechanical Properties of Sn-3.5Ag-0.7Cu Solder Joints," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Li, G. Y., Chen, B. L., and Tey, J. N., "Reaction of Sn-3.5Ag-0.7Cu-xSb Solder With Cu Metallization During Reflow Soldering," IEEE Transactions on Electronics Packaging Manufacturing , vol. 27 no. 1, pp. 77-85, Jan. 2004.

Li, Grace Yi, and Wong, C. P., "Nano-Ag Filled Anisotropic Conductive Adhesives (ACA) with Self-Assembled Monolayer and Sintering Behavior for High Performance Fine Pitch Interconnect," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 1147-1154.

Li, Guangdong, Shi, Yaowu, Hao, Hu, Xia, Zhidong, Lei, Yongping, Guo, Fu, and Li, Xiaoyan, "Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints," Journal of Materials Science: Materials in Electronics, vol. 20 no. 2, pp. 186-192, Feb. 2009.

Li, Guangxu, and Gurrum, Siva P., "An Improved Peel Stress-Based Correlation to Predict Solder Joint Reliability of Lidded Flip Chip Ball Grid Array Packages," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1883-1887.

Li, Guo-Yuan, and Shi, Xun-Qing, "Effects of bismuth on growth of intermetallic compounds in Sn-Ag-Cu Pb-free solder joints," Transactions of Nonferrous Metals Society of China , vol. 16 no. Supplement 2, pp. s739-s743, June 2006.

Li, Guodong, Li, Yao, Chen, Gang, Zhang, Qingjie, Liu, Lisheng, and Zhai, Pengcheng, "Molecular Dynamics Study of Mechanical Properties of b-Zn4Sb3 Nanowires: Temperature, Strain Rate, and Size Effect," Journal of Electronic Materials, vol. 43 no. 6, pp. 1533-1538, June 2014.

Li, Guoyuan, Tang, Chuan, Yan, Xueyou, and Xie, Xinpeng, "Effects of Surface Finishes on the Intermetallic Growth and Micro-structure Evolution of the Sn3.5Ag0.7Cu Lead-free Solder Joints," International Conference on Electronic Packaging Technology & High Density Packaging , Beijing, China, Aug. 10-13, 2009, pp. 807-811.

Li, Hailong, An, Rong, Wang, Chunqing, Tian, Yanhong, and Jiang, Zhi, "Effect of Cu grain size on the voiding propensity at the interface of SnAgCu/Cu solder joints," Materials Letters, vol. 144, pp. 97-99, Apr. 1, 2015.

Li, Hailong, An, Rong, Fu, Mingliang, Wang, Chunqing, Zhu, Mei, and Zhang, Rui, "Effect of High Temperature Thermal Aging on Microstructural Evolution of Sn3Ag0.5Cu/Cu Solder Joints," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 772-776.

Li, Hailong, An, Rong, Wang, Chunqing, and Jiang, Zhi, "In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging," Journal of Alloys and Compounds, vol. 634, pp. 94-98, June 15, 2015.

Li, Hailong, An, Rong, Wang, Chunqing, and Li, Bin, "Suppression of void nucleation in Sn3.0Ag0.5Cu/CU solder joint by rapid thermal processing," Materials Letters, vol. 158, pp. 252-254, Nov. 1, 2015.

Li, Haiying, and Wong, C. P., "A New Approach in the Development of No-Flow Underfill Materials for Both Eutectic and Lead-Free Solders with High Melting Temperature," 7th International Symposium on Advanced Packaging Materials, Braselton, GA, Mar. 11-14, 2001, pp. 261-267.

Li, Haiying, Moon, Kyoung-Sik, and Wong, C. P., "A Novel Approach to Stabilize Contact Resistance of Electrically Conductive Adhesives on Lead-Free Alloy Surfaces," Journal of Electronic Materials , vol. 33 no. 2, pp. 106-113, Feb. 2004.

Li, Haiying, and Wong, C. P., "A Reworkable Epoxy Resin for Isotropically Conductive Adhesive," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1391-1397.

Li, Haiying, and Wong, C. P., "A Reworkable Epoxy Resin for Isotropically Conductive Adhesive," IEEE Transactions on Advanced Packaging, vol. 27 no. 1, pp. 165-172, Feb. 2004.

Li, Haiying, and Wong, C. P., "Development of New No-Flow Underfill Materials for Both Eutectic Solder and a High Temperature Melting Lead-Free Solder," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 298-303.

Li, Haiying, Johnson, Ashanti, and Wong, C. P., "Development of New No-Flow Underfill Materials for Both Eutectic Sn-Pb Solder and a High Temperature Melting Lead-Free Solder," IEEE Transactions on Components and Packaging Technologies, vol. 26 no. 2, pp, 466-472, June 2003.

Li, Haiying, Moon, Kyoung-Sik, and Wong, C. P., "Effect of Sacrificial Anodic Fillers on Contact Resistance Stability of Electrically Conductive Adhesives onto Lead-Free Alloy Surfaces," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1373-1377.

Li, Haiying, Moon, Kyoung-Sik, Li, Yi, Fan, Lianhua, Xu, Jianwen, and Wong, C. P., "Physical Properties and Thermocycling Performance of Electrically Conductive Adhesives (ECAs) Modified By Flexible Molecules," 2004 9th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 24-26, 2004, pp. 45-50.

Li, Haiying, Moon, Kyoung-Sik, Li, Yi, Fan, Lianhua, Xu, Jianwen, and Wong, C. P., "Reliability Enhancement of Electrically Conductive Adhesives in Thermal Shock Environment," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 165-169.

Li, Haolin, Tang, Jilong, Kang, Yubin, Zhao, Haixia, Fang, Dan, Fang, Xuan, Chen, Rui, and Wei, Zhipeng, "Optical properties of quasi-type-II structure in GaAs/GaAsSb/GaAs coaxial single quantum-well nanowires," Applied Physics Letters, vol. 113 no. 23, pp. 233104-1-233104-5, 2018.

Li, Helena, "Designing with Conductive Materials, Part 1," Printed Circuit Design and Fab, vol. 26 no. 2, pp. 40-42, Feb. 2009.

Li, Hongjuan, Ding, Zhimin, Tan, Fengliang, and Liu, Baogang, "Microstructural Evolution and Mechanism of Grain Refinement During Annealing of Cold-Drawn Copper Clad Steel Wires," JOM, vol. 72 no. 6, pp. 2134-2138, June 2020.

Li, Hua, Qu, Lin, Zhao, Huijing, Zhao, Ning, and Ma, Haitao, "Mechanism of Cu6Sn5 layer act as a diffusion barrier layer," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 1086-1089.

Li, Hui, and Lu, Bin, "Effect of Adding Er on Interfacial Reactions between Sn-3.0Ag-0.5Cu Solder and Cu Substrate," Advanced Materials Research, vol. 136, pp. 28-32, 2010.

Li, J. F., Agyakwa, P. A., and Johnson, C. M., "A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds," Intermetallics, vol. 40, pp. 50-59, Sept. 2013.

Li, J., Poranki, S., Gallardo, R., Abtew, M., Kinyanjui, R., and Srihari, K., "Design and Process Development for the Assembly of 01005 Passive Components," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. xx-xx.

Li, J. F., Mannan, S. H., Clode, M. P., Johnston, C., and Crossley, A., "Dissolution and interfacial reaction of Nb in contact with the molten 52In-48Sn solder," Acta Materialia, vol. 55 no. 15, pp. 5057-5071, Sept. 2007.

Li, J. F., Agyakwa, P. A., and Johnson, C. M., "Effect of trace Al on growth rates of intermetallic compound layers between Sn-based solders and Cu substrate," Journal of Alloys and Compounds , vol. 545, pp. 70-79, Dec. 25, 2012.

Li, J. F., Mannan, S. H., Clode, M. P., Lobato, H. M., Liu, C., Whalley, D. C., Lawrence, F. T., Jackson, G., and Steen, H., "Interactions Between Liquid Sn-Bi Based Solders and Contact Metals for High Temperature Applications," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 441-448.

Li, J. F., Agyakwa, P. A., and Johnson, C. M., "Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process," Acta Materialia, vol. 59 no. 3, pp. 1198-1211, Feb. 2011.

Li, J. F., Mannan, S. H., Clode, M. P., Whalley, D. C., and Hutt, D. A., "Interfacial reactions between molten Sn-Bi-X solders and Cu substrates for liquid solder interconnects." Acta Materialia, vol. 54 no. 11, pp. 2907-2922, June 2006.

Li, J. F., Agyakwa, P. A., and Johnson, C. M., "Kinetics of Ag3Sn growth in Ag-Sn-Ag system during transient liquid phase soldering process," Acta Materialia, vol. 58 no. 9, pp. 3429-3443, May 2010.

Li, J. F., Mannan, S. H., and Clode, M. P., "Lifetime of solid metals in contact with liquid solders for high-temperature liquid solder assemblies," Scripta Materialia, vol. 54 no. 10, pp. 1773-1778, May 2006.

Li, J., Mattila, T. T., and Kivilahti, J. K., "Multiscale Simulation of Microstructural Changes in Solder Interconnections During Thermal Cycling," Journal of Electronic Materials, vol. 39 no. 1, pp. 77-84, Jan. 2010.

Li, J., Poranki, S., Abtew, M., Kinyanjui, R., and Srihari, K., "Reliability Assessment of Reballed BGAs," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 93-97.

Li, J. F., Agyakwa, P. A., and Johnson, C. M., "Response to comments on "A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds"," Intermetallics, vol. 69, pp. 128-130, Feb. 2016.

Li, J., Xu, H., Mattila, T. T., Kivilahti, J. K., Laurila, T., and Paulasto-Krockel, M., "Simulation of dynamic recrystallization in solder interconnections during thermal cycling," Computational Materials Science, vol. 50 no. 2, pp. 690-697, 2010.

Li, J. F., Agyakwa, P. A., and Johnson, C. M., "Suitable Thicknesses of Base Metal and Interlayer, and Evolution of Phases for Ag/Sn/Ag Transient liquid-phase Joints Used for Power Die Attachment," Journal of Electronic Materials, vol. 43 no. 4, pp. 983-995, Apr. 2014.

Li, Jia, and Xu, Zhenming, "Environmental Friendly Automatic Line for Recovering Metal from Waste Printed Circuit Boards," Environmental Science & Technology, vol. 44 no. 4, pp. 1418-1423, Feb. 15, 2010.

Li, Jia, Zhou, Quan, and Xu, Zhenming, "Real-time monitoring system for improving corona electrostatic separation in the process of recovering waste printed circuit boards," Waste Management and Research, vol. 32 no. 12, pp. 1227-1234, Dec. 2014.

Li, Jia, Lu, Hongzhou, Guo, Jie, Xu, Zhenming, and Zhou, Yaohe, "Recycle Technology for Recovering Resources and Products from Waste Printed Circuit Boards," Environmental Science & Technology, vol. 41 no. 6, pp. 1995-2000, 2007.

Li, Jian, Yan, Long, and Liu, HuiJin, "Synthesis and Characterization of SnSe Nanowires by Solvothermal Method," Applied Mechanics and Materials, vol. 713-715, pp. 2924-2927, Jan. 2015.

Li, Jian-Min, "Extracting Superconducting Single-Crystal Nb Mesowires Out of NbSe2 by a Crystal-Lattice Collapse Method," Nano Letters, vol. 8 no. 5, pp. 1382-1385, May 2008.

Li, Jianfeng, Dai, Jingru, and Johnson, Christopher Mark, "Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints," Microelectronics Reliability, vol. 84, pp. 55-65, May 2018.

Li, Jianfeng, Yaqub, Imran, Corfield, Martin, and Johnson, Christopher Mark, "Interconnect Materials Enabling IGBT Modules to Achieve Stable Short-Circuit Failure Behavior," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 7 no. 5, pp. 734-744, May 2017.

Li, Jianfeng, Mannan, Samjid H., Clode, Mike P., Liu, Chongqing, Chen, Keming, Whalley, David C., Hutt, David A., and Conway, Paul P., "Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 3, pp. 574-585, Sept. 2008.

Li, Jianxing, Fon, Bih Wen, Krishnan, Shutesh, and Knight, Brian, "Advanced Materials for Drop in Solution to Pb in High Temp Solders: The Next Generation of Zinc Based Solder Alloy," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 1628-1633.

Li, Jianzhong, Tian, Yanwen, Li, Ying, and Wang, Yucheng, "Effect of black plate on growth action and corrosion resistance of Sn-Fe alloy film," Applied Mechanics and Materials, vol. 121-126, pp. 100-104, Oct. 2011.

Li, Jin-Gang, Ma, Xiao, Zhou, Min-Bo, Ning, Xiang, and Zhang, Xin-Ping, "Effects of Sb addition on the microstructure and mechanical performance of Sn58Bi based alloys and the solder joints," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 457-461.

Li, Jing, Lumpp, Janet K., Andrews, Rodney, and Jacques, David, "Aspect Ratio and Loading Effects of Multiwall Carbon Nanotubes in Epoxy for Electrically Conductive Adhesives," Journal of Adhesion Science and Technology, vol. 22 no. 14, pp. 1659-1671, 2008.

Li, Jing, Lumpp, Janet K., and Grulke, Eric, "Carbon Nanotube Filled Conductive Aahesive," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 35-38.

Li, Jing, and Lumpp, Janet K., "Electrical and Mechanical Characterization of Carbon Nanotube Filled Conductive Adhesive," 2006 IEEE Aerospace Conference, Big Sky, MT, Mar. 4-11, 2006, pp. xx-xx.

Li, Jing, Tsai, Pei-Fang Jennifer, Srihari, Krishnaswami, Abarquez, Layang-Junell, Yong, Jianyeou, Chew, Chongchit, Abtew, Mulugeta, and Kinyanjui, Robert, "Improving Hole-Fill in Lead-Free Soldering of Thick Printed Circuit Boards with OSP Finish," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 123-129.

Li, Jinhua, Yao, Chenlan, Liu, Yanbiao, Li, Di, Zhou, Baoxue, and Cai, Weimin, "The hazardous hexavalent chromium formed on trivalent chromium conversion coating: The origin, influence factors and control measures," Journal of Hazardous Materials, vol. 221-222, pp. 56-61, June 30, 2012.

Li, Jinhui, Duan, Huabo, Yu, Keli, Liu, Lili, and Wang, Siting, "Characteristic of low-temperature pyrolysis of printed circuit boards subjected to various atmosphere," Resources, Conservation and Recycling , vol. 54 no. 11, pp. 810-815, Aug. 2010.

Li, Jinhui, Duan, Huabo, and Shi, Pixing, "Heavy metal contamination of surface soil in electronic waste dismantling area: site investigation and source-apportionment analysis," Waste Management and Research, vol. 29 no. 7, pp. 727-738, July 2011.

Li, Jinhui, Lopez N., Brenda N., Liu, Lili, Zhao, Nana, Yu, Keli, and Zheng, Lixia, "Regional or global WEEE recycling. Where to go?," Waste Management , vol. 33 no. 4, pp. 923-934, Apr. 2013.

Li, Ju, "The Mechanics and Physics of Defect Nucleation," MRS Bulletin, vol. 32 no. 2, pp. 151-159, Feb. 2007.

Li, Juan, Tao, Xiaoma, Dong, Sisi, Yang, Feng, Liu, Huashan, Jin, Zhanpeng, and Zheng, Feng, "Thermodynamic assessment of Sn-Cu-Ce system," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 43, pp. 124-132, Dec. 2013.

Li, Juchuan, Yang, Fuqian, Ye, Jia, and Cheng, Yang-Tse, "Whisker formation on a thin film tin lithium-ion battery anode," Journal of Power Sources, vol. 196 no. 3, pp. 1474-1477, Feb. 1, 2011.

Li, Jue, Myllykoski, Pirkka, Huang, Cong, Hussa, Esa, Hu, Dongmin, and Kou, Dahe, "Board level drop reliability study and orthotropic PCB material property test methodology," 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Toulouse, France, Apr. 15-18, 2018, pp. xx-xx.

Li, Jue, Mattila, Toni T., and Kivilahti, Jorma K., "Computational Assessment of the Effects of Temperature on Wafer-Level Component Boards in Drop Tests," IEEE Transactions on Components and Packaging Technologies, vol. 32 no. 1, pp. 38-43, Mar. 2009.

Li, Jue, Xu, Hongbo, Hokka, Jussi, Mattila, Toni T., Chen, Hongtao, and Paulasto-Krockel, Mervi, "Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests," Soldering & Surface Mount Technology, vol. 23 no. 3, pp. 161-167, 2011.

Li, Jue, Karppinen, Juha, Laurila, Tomi, and Kivilahti, Jorma Kalevi, "Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling Tests," IEEE Transactions on Components and Packaging Technologies , vol. 32 no. 2, pp. 302-308, June 2009.

Li, Junhui, and Dasgupta, Abhijit, "Failure Mechanism Models for Material Aging due to Interdiffusion," IEEE Transactions on Reliability, vol. 43 no. 1, pp. 2-10, Mar. 1994.

Li, Kan, Xing, Yingjie, and Xu, H. Q., "Generic technique to grow III-V semiconductor nanowires in a closed glass vessel," AIP Advances, vol. 6 no. 6, pp. 065311-1-065311-7, June 2016.

Li, Kangning, Lei, Yongping, Lin, Jian, Liu, Baoquan, Bai, Hailong, and Qin, Junhu, "Development of Sn-Bi systems lead-free solder paste," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 160-162.

Li, Kun, Xiang, Dong, and Liu, Xueping, "Study of Relations between Several Factors in Immersion Silver Technique and Galvanic Attack Problem," Proceedings of the 2007 IEEE International Symposium on Electronics & the Environment, Orlando, FL, May 7-10, 2007, pp. 202-205.

Li, L., and Chung, D. D. L., "Z-Axis Anisotropic Electrically Conducting Polymer-Matrix Composite Film," Journal of Electronic Packaging, Transactions of the ASME, vol. 119 no. 4, pp. 255-259, Dec. 1997.

Li, Lei, Lei, ShuangYing, Wang, RuoYu, Yu, Hong, and Huang, QingAn, "First-Principles Study on The Electro-Mechanical Coupling of The Si/Ge Core-Shell Nanowires," 2013 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Suzhou, China, Apr. 7-10, 2013, pp. 833-836.

Li, Li, and Fang, Treliant, "Anisotropic Conductive Adhesive Films for Flip Chip on Flex Packages," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 129-135.

Li, Li, and Morris, James E., "Electrical Conduction Models for Isotropically Conductive Adhesive Joints," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 20 no. 1, pp. 3-8, Mar. 1997.

Li, Li, and Morris, J. E., "Electrical Conduction Models for Isotropically Conductive Adhesives," Journal of Electronics Manufacturing, vol. 5 no. 4, pp. 289-296, Dec. 1995.

Li, Li, Lizzul, Christine, Kim, Hansoo, Sacolick, Isaac, and Morris, James E., "Electrical, Structural and Processing Properties of Electrically Conductive Adhesives," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 16 no. 8, pp. 843-851, Dec. 1993.

Li, Li, Liu, Yongchang, Gao, Huixia, and Gao, Zhiming, "Phase formation sequence of high-temperature Zn-4Al-3Mg solder," Journal of Materials Science: Materials in Electronics, vol. 24 no. 1, pp. 336-344, Jan. 2013.

Li, Li, Morris, J. E., Liu, Johan, Lai, Zonghe, Ljungkrona, Lars, and Li, Changhai, "Reliability and Failure Mechanism of Isotropically Conductive Adhesives Joints," 1995 Proceedings 45th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 1995, pp. 114-120.

Li, Li, Jang, Jin-Wook, and Allmen, Becky, "Shear Property and Microstructure Evaluation of Pb-free Solder Bumps under Room Temperature and Multiple Reflow/High Temperature Aging," Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, Braselton, GA, Mar. 11-14, 2001, pp. 347-353.

Li, Li, and Morris, J. E., "Structure and Selection Models for Anisotropic Conductive Adhesive Films," Journal of Electronics Manufacturing, vol. 5 no. 1, pp. 9-17, Mar. 1995.

Li, Liangfeng, Qiu, Tai, Yang, Jian, and Feng, Yongbao, "Synthesis of Ag-Cu-Sn Nanocrystalline Alloys as Intermediate Temperature Solder by High Energy Ball Milling," Advanced Materials Research, vol. 79-82, pp. 449-452, 2009.

Li, Liming, Zhang, Tailiang, Liu, Yu, and Zhu, Chunhua, "Flexible conductor fabrication via silver nanowire deposition on a polydopamine-modified pre-strained substrate," Journal of Materials Science: Materials in Electronics, vol. 27 no. 4, pp. 3193-3201, Apr. 2016.

Li, Lin, and Chung, D. D. L., "Z-axis Anisotropic Electrically Conducting Polymer-Matrix Composite Film," Materials Research Society Symposia Proceedings Volume 323, Boston, MA, Nov. 29-Dec. 3, 1993, pp. 21-26.

Li, M. Y., Yang, H. F., Zhang, Z. H., Gu, J. H., and Yang, S. H., "Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention," Scientific Reports, vol. 6, pp. 27522-1-27522-10, 2016. https://doi-org.ezproxy.uky.edu/10.1038/srep27522

Li, M., Zhang, F., Chen, W. T., Zeng, K., Tu, K. N., Balkan, H., and Elenius, P., "Interfacial microstructure evolution between eutectic SnAgCu solder and Al/Ni(V)/Cu thin films," Journal of Materials Research, vol. 17 no. 7, pp. 1612-1621, July 2002.

Li, Mei, Du, Zhenmin, Guo, Cuiping, and Li, Changrong, "Thermodynamic optimization of the Cu-Sn and Cu-Nb-Sn systems," Journal of Alloys and Compounds, vol. xxx no. x-x, pp. xxx-xxx, xxxx.

Li, Men Shian, Luo, Jen Tsung, Lin, Wei Cheng, and Yang, Yun Min, "IMC investigation on fracture surface between solder joints and different surface finish processes," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Li, Mengyuan, Han, Jing, Guo, Fu, Ma, Limin, Wang, Yishu, and Zhou, Wei, "Electromigration Behavior of Low-Silver Sn-0.3Ag-0.7Cu-1.6Bi-0.2In Solder Joints," Journal of Electronic Materials, vol. 49 no. 7, pp. 4237-4248, July 2020.

Li, Ming, Wang, Jingyun, Li, Kan, Xing, Yingjie, and Xu, H. Q., "Growth of InAs nanowires with the morphology and crystal structure controlled by carrier gas flow rate," Journal of Crystal Growth, vol. 430, pp. 87-92, Nov. 15, 2015.

Li, Ming, Lee, K. Y., Olsen, D. R., Chen, William T., Tan, Ben Tin Chong, and Mhaisalkar, Subodh, "Microstructure, Joint Strength and Failure Mechanisms of SnPb and Pb-Free Solders in BGA Packages," IEEE Transactions on Electronics Packaging Manufacturing, vol. 25 no. 3, pp. 185-192, July 2002.

Li, Ming, Xie, Kenan, Wu, Yizheng, Yang, Qiuxia, and Liao, Li, "Synthesis of cobalt nanowires by template-free method," Materials Letters, vol. 111, pp. 185-187, Nov. 15, 2013.

Li, Mingjun, and Kuribayashi, Kazuhiko, "Nucleation-Controlled Microstructures and Anomalous Eutectic Formation in Undercooled Co-Sn and Ni-Si Eutectic Melts," Metallurgical and Materials Transactions A, vol. 34 no. 12, pp. 2999-3008, Dec. 2003.

Li, Mingyu, Xu, Hongbo, Lee, Shi-Wei Ricky, Kim, Jongmyung, and Kim, Daewon, "Eddy Current Induced Heating for the Solder Reflow of Area Array Packages," IEEE Transactions on Advanced Packaging, vol. 31 no. 2, pp. 399-403, May 2008.

Li, Mingyu, Xu, Hongbo, Kim, Jongmyung, and Kim, Hongbae, "Failure Modes of Lead Free Solder Bumps Formed by Induction Spontaneous Heating Reflow," Journal of Materials Science and Technology, vol. 23 no. 1, pp. 61-67, Jan. 2007.

Li, Mingyu, Xu, Hongbo, Wang, Chunqing, Bang, Han Sur, and Bang, Hee Seon, "IMC Evolution and Reliability of Lead-free Solder Bump Formed by Induction Self Heat Reflow," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Li, Mingyu, Yang, Ming, and Kim, Jongmyung, "Textured growth of Cu6Sn5 grains formed at a Sn3.5Ag/Cu interface," Materials Letters, vol. 66 no. 1, pp. 135-137, Jan. 1, 2012. https://doi.org/10.1016/j.matlet.2011.08.014

Li, Nanbo, Cai, Miao, Zheng, Jianna, Han, Shunfeng, Deng, Riyang, Wu, Boyi, Xie, Dongji, and Yang, Daoguo, "A novel pin-pull tester and its application on PCB pad cratering assessment," 2015 16th International Conference on Electronic Packaging Technology , Changsha, China, Aug. 11-14, 2015, pp. 1198-1202.

Li, Ning, Zhao, Bao, Zhou, Shaomin, Lou, Shiyun, and Wang, Yongqiang, "Electrical properties of individual Ag2Te nanowires synthesized by a facile hydrothermal approach," Materials Letters, vol. 81, pp. 212-214, Aug. 15, 2012.

Li, Peng, Han, Jing, Wang, Yan, Guo, Fu, Ma, Limin, and Wang, Yishu, "Microstructure and Intermetallic Compounds in Sn-3Ag-3Bi-3In solder joints on Cu matrix," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 655-659.

Li, Peng-tao, Yang, Yan-qing, Luo, Xian, Jin, Na, Liu, Gang, and Gao, Yong, "Structural evolution of copper-silver bimetallic nanowires with core-shell structure revealed by molecular dynamics simulations," Computational Materials Science, vol. 137, pp. 289-296, Sept. 2017.

li, Qi, Gao, Haitao, Xiong, Min, Yi, Yaoyong, and Liu, FengMei, "Effect of Ni-CNTs on microstructure, thermodynamic characteristic and mechanical properties of Sn58Bi-0.1Er based lead-free solder," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Li, Qi, Hu, Anmin, Li, Ming, and Mao, Dali, "Preparation and Properties of Sn-9Zn-3Bi-Cr Based Lead-free Solder," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Li, Qian, Liu, Xufei, and Lu, Shouxiang, "Corrosion behavior assessment of tin-lead and lead free solders exposed to fire smoke generated by burning polyvinyl chloride," Materials Chemistry and Physics, vol. 212, pp. 298-307, June 15, 2018.

Li, Qian, Liu, Xufei, Li, Changhai, Chen, Xiao, and Lu, Shouxiang, "Corrosion behavior of Sn-3.0Ag-0.5Cu solder under different fire smoke atmospheres generated by burning polyvinyl chloride and polyethylene," Materials and Corrosion, vol. 69 no. 6, pp. 793-803, June 2018.

Li, Qian, Lin, Jin, Li, Changhai, Lu, Shouxiang, and Chen, Xiao, "Effect of polyvinyl chloride fire smoke on the long-term corrosion kinetics and surface microstructure of tin-lead and lead-free solders," Journal of Materials Science: Materials in Electronics, vol. 30 no. 17, pp. 16395-16406, Sept. 2019.

Li, Qian, Lin, Jin, Li, Changhai, Lu, Shouxiang, and Chen, Xiao, "Effect of relative humidity on corrosion behavior of SAC305 and Sn-37Pb solders under polyvinyl chloride fire smoke atmosphere," Journal of Materials Science: Materials in Electronics, vol. 31 no. 22, pp. 19920-19930, Nov. 2020. https://doi-org.ezproxy.uky.edu/10.1007/s10854-020-04515-z

Li, Qiliang, Koo, Sang-Mo, Richter, Curt A., Edelstein, Monica D., Bonevich, John E., Kopanski, Joseph J., Suehle, John S., and Vogel, Eric M., "Precise Alignment of Single Nanowires and Fabrication of Nanoelectromechanical Switch and Other Test Structures," IEEE Transactions on Nanotechnology, vol. 6 no. 2, pp. 256-262, Mar. 2007.

Li, Qin, Ma, Ninshu, Lei, YongPing, Lin, Jian, Fu, HanGuang, and Gu, Jian, "Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders," Journal of Electronic Materials, vol. 45 no. 11, pp. 5800-5810, Nov. 2016.

Li, Qin, Lei, Yongping, Lin, Jian, and Yang, Sai, "Design and properties of Sn-Bi-In low-temperature solders," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 497-500.

Li, Qinghua, and Zhang, Jianhua, "Effects of Nano Fillers on the Conductivity, Adhesion Strength and Reliability of Isotropic Conductive Adhesives (ICAs)," Key Engineering Materials, vol. 353-358, pp. 2879-2882, 2007.

Li, Qingqian, Chan, Y. C., and Ismathullakhan, Shafiq, "Growth Characteristic Study of Intermetallic Compounds Growth in Nanoscale-thickness Cu/Sn/Cu Sandwich Structure," 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 7-9, 2011, pp. 289-293.

Li, Qingqian, and Chan, Y. C., "Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn-Cu binary and Cu-Sn-Cu sandwich structures," Journal of Alloys and Compounds, vol. 567, pp. 47-53, Aug. 5, 2013.

Li, Qingqian, Chan, Y. C., Zhang, Kaili, and Yung, K. C., "Study of microstructure evolution in novel Sn-Zn/Cu bi-layer and Cu/Sn-Zn/Cu sandwich structures with nanoscale thickness for 3D packaging interconnection," Microelectronic Engineering, vol. 122, pp. 52-58, June 25, 2014.

Li, Qingqian, Chan, Y. C., and Chen, Zhong, "Tin whiskers growth of SnAgIn solder on Kovar substrate with Au/Ni plating," Journal of Materials Science: Materials in Electronics, vol. 25 no. 3, pp. 1222-1227, Mar. 2014.

Li, Qiuying, Liu, Shouchao, Li, Shourui, Guo, Weihong, and Wu, Chifei, "Preparation of micro-size flake silver powder by planetary ball mill," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Li, Ruo-Zhou, Zhang, Tong, Hu, Anming, and Bridges, Denzel, "Ag Nanowire and Nanoplate Composite Paste for Low Temperature Bonding," Materials Transactions, JIM, vol. 56 no. 7, pp. 984-987, 2015.

Li, Ruying, Zhang, Yong, and Sun, Xueliang, "Self-assembly synthesis and mechanism investigation of branched core-shell hybrids of tin nanowires and carbon nanotubes," Journal of Materials Research, vol. 28 no. 7, pp. 969-975, Apr. 14, 2013.

Li, Saipeng, Wei, Mingzhen, Hao, Jian, Tian, Shuang, Wang, Dapeng, Zhou, Jian, and Xue, Feng, "Rheological characterization and jet printing performance of Sn-58Bi solder pastes," Journal of Materials Science: Materials in Electronics, vol. 29 no. 6, pp. 4575-4582, Mar. 2018.

Li, Shanying, Li, Xiaoyan, and Zhao, Haipeng, "Synthesis and electrical properties of p-type CdTe nanowires," IET Micro & Nano Letters, vol. 8 no. 6, pp. 308-310, June 2013.

Li, Shanying, Jiang, Yang, Wang, Binbin, Wu, Di, Li, Junwei, Zhang, Yugang, Yang, Ben, Ding, Xianan, Zhou, Hongyang, and Zhong, Honghai, "Synthesis of p-type ZnSe nanowires by atmosphere compensating technique," IET Micro & Nano Letters, vol. 6 no. 6, pp. 459-462, June 2011.

Li, Shanying, Su, Qing, Zhao, Haipeng, and Tian, Damin, "Ternary semiconductor ZnSe0.7Te0.3 nanowires," IET Micro & Nano Letters , vol. 8 no. 8, pp. 436-439, Aug. 2013.

Li, Shaojie, Cheng, Daojian, Qiu, Xiangguo, and Cao, Dapeng, "Synthesis of Cu@Pd core-shell nanowires with enhanced activity and stability for formic acid oxidation," Electrochimica Acta, vol. 143, pp. 44-48, Oct. 10, 2014.

Li, Shen, Stein, Nicolas, Lacroix, David, and Termentzidis, Konstantinos, "Thermal Conductivity of Bi2Te3 Nanowires and Nanotubes," 2015 21st International Workshop on Thermal Investigations of ICs and Systems, Paris, France, Sept. 30-Oct. 2, 2015, pp. xx-xx.

Li, Shenzhen, Geng, Xuchen, Chen, Cong, and Niu, Xiaoyan, "Dynamic mechanical properties of lead-free solder at microscale," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Li, Shi-Bo, Bei, Guo-Ping, Zhai, Hong-Xiang, Zhang, Zhi-Li, Zhou, Yang, and Li, Cui-Wei, "The origin of driving force for the formation of Sn whiskers at room temperature," Journal of Materials Research, vol. 22 no. 11, pp. 3226-3232, Nov. 2007.

Li, Shidong, and Basaran, Cemal, "Effective diffusivity of lead free solder alloys," Computational Materials Science, vol. 47 no. 1, pp. 71-78, Nov. 2009.

Li, Shidong, "Thermomigration induced strain field simulation for microelectronics lead free solder joints," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Li, Shuai, Wang, Xingxing, Liu, Zhongying, Jiu, Yongtao, Zhang, Shuye, Geng, Jinfeng, Chen, Xiaoming, Wu, Shengjin, He, Peng, and Long, Weimin, "Corrosion behavior of Sn-based lead-free solder alloys: a review," Journal of Materials Science: Materials in Electronics, vol. 31 no. 12, pp. 9076-9090, June 2020.

Li, Shuai, Yan, Yan-fu, Jiu, Yong-tao, and Wang, Hong-na, "Effect of adding micro amount rare earth element Er on mechanical property of Bi5Sb8Sn solder alloy," Advanced Materials Research, vol. 738, pp. 30-33, Aug. 2013.

Li, Shuai, Yan, Yanfu, Feng, LiFang, and Wang, HongNa, "Effect of the Er on resistivity and spreading properties of Bi5Sb8Sn solder alloy," Applied Mechanics and Materials, vol. 327, pp. 147-150, June 2013.

Li, Shuai, and Yan, Yan-fu, "Intermetallic growth study at Sn-3.0Ag-0.5Cu/Cu solder joint interface during different thermal conditions," Journal of Materials Science: Materials in Electronics, vol. 26 no. 12, pp. 9470-9477, Dec. 2015.

Li, Shuang, Du, Yao, Qu, Lin, Kunwar, Anil, Sun, Junhao, Liu, Jiahui, Zhao, Ning, Huang, Mingliang, and Ma, Haitao, "The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 937-939.

Li, Suzhi, Salje, Ekhard K. H., Jun, Sun, and Ding, Xiangdong, "Large recovery of six-fold twinned nanowires of a-Fe," Acta Materialia , vol. 125, Feb. 15, 2017, pp. 296-302.

Li, T. P., Tan, J. Y. R., Khoo, S. A., Breach, C. D., and Hawkins, A., "The Effects Of Formulation On Reflow Solderability Of Water Soluble Solder Paste In Air And Nitrogen," South East Asia Technical Training Conference on Electronics Assembly Technologies 2013 Proceedings, Penang, Malaysia, Apr. 17-19, 2013, pp. xx-xx.

Li, Tianpeng, Tan, Jorcelyn Ying Ru, Khoo, Soon Aik, Breach, Christopher D., and Hawkins, J. Adrian, "Thermal and Wetting Properties of Water-Soluble Fluxes and Solder Pastes," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 4 no. 11, pp. 1871-1878, Nov. 2014.

Li, Ting, Ding, Dongyan, Tao, Yeqing, Guo, Jason, He, Ting, and Yu, Yunhong, "Effect of Ar Reflow Atmosphere on the SAC305 Solder Joint Reliability," 2014 15th International Conference on Electronic Packaging Technology , Chengdu, China, Aug. 12-15, 2014, pp. 945-948.

Li, Tingting, Wang, Nana, Cheng, Haifei, Wu, Weizu, and Li, Yun, "The Electrochemical Deposition of Fe Nanowires and the Influence of Current Density on the Deposition Rate," Key Engineering Materials, vol. 726, pp. 323-327, Jan. 2017.

Li, W. B., and Warren, R., "A Model for Nano-indentation Creep," Acta Metallurgica et Materialia , vol. 41 no. 10, pp. 3065-3069, Oct. 1993.

Li, W. Y., Jin, H., Yue, W., Tan, M. Y., and Zhang, X. P., "Creep behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads," Journal of Materials Science: Materials in Electronics, vol. 27 no. 12, pp. 13022-13033, Dec. 2016.

Li, W. Y., Zhang, X. P., Qin, H. B., and Mai, Y.-W., "Joule heating dominated fracture behavior change in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads," Microelectronics Reliability, vol. 82, pp. 224-227, Mar. 2018.

Li, Wang-Long, Chen, Ying-Ru, Chang, Kuo-Ming, Liu, Chih-Yao, Hon, Min-Hsiung, and Wang, Moo-Chin, "Microstructure and adhesion strength of Sn-9Zn-1.5Ag-xBi (x = 0 wt% and 2 wt%)/Cu after electrochemical polarization in a 3.5 wt% NaCl solution," Journal of Alloys and Compounds, vol. 461 no. 1-2, pp. 160-165, Aug. 11, 2008.

Li, Wang-Yun, Zhou, Min-Bo, and Zhang, Xin-Ping, "Abnormal creep behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints with different joint thicknesses under electro-thermo-mechanical coupled loads," 2017 18th International Conference on Electronic Packaging Technology , Harbin, China, Aug. 16-19, 2017, pp. 1642-1648.

Li, Wang-Yun, Zhou, Min-Bo, and Zhang, Xin-Ping, "Creep behavior of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under tensile stress coupled with DC current stressing," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 187-192.

Li, Wang-Yun, and Zhang, Xin-Ping, "Low and cryogenic temperature mechanical performance and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints with the decreasing dimension," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 324-328.

Li, Wang-Yun, Peng, Guan-Qiang, Cheng, Tian-Xiang, Qin, Hong-Bo, Huang, Jia-Qiang, and Yang, Dao-Guo, "Shear performance of microscale BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints with shrinking volume at low and cryogenic temperatures," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Li, Wang-Yun, Qin, Hong-Bo, Zhou, Min-Bo, and Zhang, Xin-Ping, "The influence of imposed electric current on the tensile fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1030-1034.

Li, Wei, Zhou, Min-Bo, Qin, Hong-Bo, Ma, Xiao, and Zhang, Xin-Ping, "Experimental and Numerical Study of the Size Effect on Microstructure and Mechanical Behavior of Cu/Sn0.7Cu0.05Ni/Cu Joints with Very Small Solder Volume," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 749-754.

Li, Wei, and Feng, Rong-Chang, "Highly Accelerated Life Test for the Reliability Assessment of the Lead-Free SMT Mainboard," International Microsystems, Packaging, Assembly Conference Taiwan, Taipei, Taiwan, Oct. 18-20, 2006, pp. xx-xx.

Li, Wen-Hua, Lin, Pei-Syuan, Chen, Chen-Ni, Dong, Teng-Yuan, Tsai, Chi-Hang, Kung, Wan-Ting, Song, Jenn-Ming, Chiu, Ying-Ta, and Yang, Ping-Feng, "Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid," Materials Science and Engineering: A, vol. 613, pp. 372-378, Sept. 8, 2014.

Li, Wang-Yun, Cao, Shan-Shan, and Zhang, Xin-Ping, "Creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 988-993.

Li, Wang-Yun, Cao, Shan-Shan, and Zhang, Xin-Ping, "Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 860-864.

Li, Wu-Hu, Low, Jeffrey Khai Huat, Sax, Harry, Cabral, Raymond Solis, De Castro Salazar, Esperidion, and Low, Pauline Min Wee, "Comparative Study of NiNiP Leadframes from Different Processes," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 255-259.

Li, Wu-Hu, "Shelf-Life Study of Ag/NiNiP-Plated Cu Leadframes Without Anti-Tarnish Coating," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 4, pp. 622-629, Apr. 2001.

Li, Wuxia, Fenton, J. C., Gu, Changzhi, and Warburton, P. A., "Superconductivity of ultra-fine tungsten nanowires grown by focused-ion-beam direct-writing," Microelectronic Engineering, vol. 88 no. 8, pp. 2636-2638, Aug. 2011.

Li, X., Guo, H., Yin, Z., Shi, T., Wen, L., Zhao, Z., Liu, M., Ma, W., and Wang, Y., "Morphology and crystal structure control of GaAs nanowires grown by Au-assisted MBE with solid As4 source," Journal of Crystal Growth , vol. 324 no. 1, pp. 82-87, June 1, 2011.

Li, X. P., Xia, J. M., Zhou, M. B., Ma, X., and Zhang, X. P., "Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects," Journal of Electronic Materials, vol. 40 no. 12, pp. 2425-2435, Dec. 2011.

Li, Xianfen, Zhang, Fei, Zu, Fangqiu, Lv, Xue, Zhao, Zhenxing, and Yang, Dongdong, "Effect of liquid-liquid structure transition on solidification and wettability of Sn-0.7Cu solder," Journal of Alloys and Compounds, vol. 505 no. 2, pp. 472-475, Sept. 3, 2010.

Li, Xianfen, Zu, Fangqiu, Liu, Lanjun, Li, Jigang, Chen, Jie, and Hu, Chengming, "Effect of Sn on reversibility of liquid-liquid transition in Bi-Sb-Sn alloys," Journal of Alloys and Compounds, vol. 453 no. 1-2, pp. 508-512, Apr. 3, 2008.

Li, Xian-Fen, Hu, Cheng-Ming, Zu, Fang-Qiu, Huang, Zhong-Yue, and Liu, Ming-Quan, "Temperature-Induced Reversible Change of Electrical Resistivity in Sn-Bi Melts," International Journal of Thermophysics, vol. 30 no. 3, pp. 1040-1047, June 2009.

Li, Xiao, and Yao, Yao, "Effect of Cryogenic Treatment on Mechanical Properties and Microstructure of Solder Joint," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1327-1330.

Li, Xiao, Lin, Lin, and Wang, Jun, "The microstructure and shear behaviors of the solder joints with decreasing diameter in WLCSP," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 991-993.

Li, XiaoGang, Cai, Jian, Sohn, YoonChul, Wang, Qian, Kim, Woonbae, and Wang, ShuiDi, "Microstructure of Ag-Sn Bonding for MEMS Packaging," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Li, Xiaopeng, Guo, Zhongyi, Xiao, Yanjun, Um, Han-Don, and Lee, Jung-Ho, "Electrochemically etched pores and wires on smooth and textured GaAs surfaces," Electrochimica Acta, vol. 56 no. 14, pp. 5071-5079, May 30, 2011.

Li, Xiaoqian, "A Study on Shield Cover Fall-off Failure of ENIG Surface Finish Pads," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 135-138.

Li, Xiaoqing, Wang, Yuchuan, Zhou, Jianwei, and Chang, Tae Sub, "Fine Pitch BGA Device Solder Bridging Mechanism Investigation Through Solder Shape Modeling," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 796-800.

Li, Xiaoqing, Fu, Xingming, Lou, Minyi, Zhou, Jianwei, Du, Maohua, and Chung, Myungkee, "Solder Constitutive Models and Failure Criteria Selection in Board Level Cyclic Bending Simulation," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 788-793.

Li, Xiao-yan, Yan, Yong-chang, and Liu, Na, "Study of Plasticity Damage Mechanics Constitutive Model for SnAgCu Solder Joint," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Li, Xiao-yan, Wu, Ben-sheng, and Yang, Xiao-hua, "The Formation and Evolution of IMC and its Effect on the Solder Joint Properties," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Li, Xiaoyan, Li, Fenghui, Guo, Fu, and Shi, Yaowu, "Effect of Isothermal Aging and Thermal Cycling on Interfacial IMC Growth and Fracture Behavior of SnAgCu/Cu Joints," Journal of Electronic Materials , vol. 40 no. 1, pp. 51-61, Jan. 2011.

Li, Xiaoyan, Yang, Xiaohua, and Li, Fenghui, "Effect of Isothermal Aging on Interfacial IMC Growth and Fracture Behavior of SnAgCu/Cu Soldered Joints," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Li, Xiaoyan, and Li, Fenghui, "Effect of Thermal Cycling on Interfacial IMCs Growth and Fracture Behavior of SnAgCu/Cu joints," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1144-1148.

Li, Xiaoyan, Yang, Xiaohua, Dui, Weizhen, and Wu, Bensheng, "Isothermal Aging Effects on the Microstructure, IMC and Strength of SnAgCu/Cu Solder Joint," Key Engineering Materials, vol. 353-358, pp. 2928-2931, Sept. 2007.

Li, Xiaoyan, Wang, Ling, Fu, Yonggao, and Zeng, Lu, "Roadmap of Reliability: Methodology and Application in Guangdong's Lead-Free Technology," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Li, Xiaoyan, and Wang, Zhisheng, "Thermo-fatigue life evaluation of SnAgCu solder joints in flip chip assemblies," Journal of Materials Processing Technology, vol. 183 no. 1, pp. 6-12, Mar. 5, 2007.

Li, Xiaoyun, Zu, Fangqiu, Huang, Zhongyue, Wang, Chong, and Zhang, Wenjin, "Correlation of intermetallic compound growth behavior and melt state of Sn-3.5Ag-3.5Bi/Cu joint during soldering and isothermal aging," Journal of Materials Science: Materials in Electronics, vol. 24 no. 4, pp. 1231-1237, Apr. 2013.

Li, Xin, Chen, Gang, Wang, Lei, Mei, Yun-Hui, Chen, Xu, and Lu, Guo-Quan, "Creep properties of low-temperature sintered nano-silver lap shear joints," Materials Science and Engineering: A, vol. 579, pp. 108-113, Sept. 1, 2013.

Li, Xin, Chen, Gang, Chen, Xu, Lu, Guo-Quan, Wang, Lei, and Mei, Yunhui, "Mechanical Property Evaluation of Nano-Silver Paste Sintered Joint Using Lap-Shear Test," Soldering & Surface Mount Technology, vol. 24 no. 2, pp. xx-xx, 2012.

Li, Xing-Min, Gui, Jun, Li, Wang-Yun, Yan, Hai-Dong, Qin, Hong-Bo, Huang, Jia-Qiang, and Yang, Dao-Guo, "Tensile performance of line-type microscale Cu/Sn-58Bi/Cu joints under electro-thermo-mechanical coupled loads," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Li, Xingxing, Jiang, Meiping, and Su, Jiangbin, "Controllable synthesis of CuNWs in high yield and their potential applications in SPR based fields," Applied Mechanics and Materials , vol. 117-119, pp. 936-939, Oct. 2011.

Li, Xinzhong, Peng, Peng, Liu, Dongmei, Su, Yanqing, Guo, Jingjie, and Fu, Hengzhi, "Dendrite coarsening in directionally solidified Sn-36 at.%Ni peritectic alloy in the presence of the migration of secondary dendrite arms," Materials Chemistry and Physics, vol. 145 no. 1-2, pp. 203-212, May 15, 2014.

Li, Xuemei, Sun, Fenglian, Liu, Yang, Zhang, Hao, and Xin, Tong, "Geometrical size effect on the interface diffusion of micro solder joint in electro-thermal coupling aging," Journal of Materials Science: Materials in Electronics, vol. 25 no. 9, pp. 3742-3746, Sept. 2014.

Li, Xueqian, Wu, Qinmin, Li, Jin, and Zhu, Daoli, "A Coordination Mechanism in E-Waste Reverse Logistics," 2010 International Conference on Management and Service Science, Wuhan, China, Aug. 24-26, 2010, pp. xx-xx.

Li, Xuezheng, Ma, Yong, Zhou, Wei, and Wu, Ping, "Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys," Materials Science and Engineering: A , vol. 684, pp. 328-334, Jan. 27, 2017.

Li, Xun-Ping, Qin, Hong-Bo, En, Yun-Fei, Xia, Jian-Min, and Zhang, Xin-Ping, "Loading Rate and Size Effect on the Fracture Behavior of BGA Structure Cu/Sn-3.0Ag-0.5Cu/Cu Interconnects," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1298-1302.

Li, Xun-Ping, Xia, Jian-Min, Qin, Hong-Bo, He, Xiao-Qi, and Zhang, Xin-Ping, "Study of Critical Factors Influencing the Solidification Undercooling Behavior of Sn-3.0Ag-0.5Cu (SAC) Lead-free Solder and SAC/Cu Joints," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 356-360.

Li, Xun-Ping, Xia, Jian-Min, Zhou, Min-Bo, Ma, Xiao, and Zhang, Xin-Ping, "The Influence of Standoff Height and Pad Size on the Shear Fracture Behavior of BGA Structured Cu/Sn3.0Ag0.5Cu/Cu Interconnects," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 1118-1123.

Li, Xun-Ping, Xia, Jian-Min, and Zhang, Xin-Ping, "The Solder Volume Effect on the Creep Behavior of BGA Structure Cu/Sn-3.0Ag-0.5Cu/Cu Joints," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 867-873.

Li, Yi, Chan, Y. C., and Wu, Fengshun, "A comparison study of electromigration in In-48Sn solder interconnects with Cu and Au/Ni/Cu pads," 2016 International Conference on Electronics Packaging, Hokkaido, Japan, Apr. 20-22, 2016, pp. 689-692.

Li, Y., Buddharaju, K., Singh, N., and Lee, S. J., "Erratum to: Top-Down Silicon Nanowire-Based Thermoelectric Generator: Design and Characterization," Journal of Electronic Materials, vol. 41 no. 6, pp. 1858, June 2012.

Li, Y., Buddharaju, K., Singh, N., and Lee, S. J., "Top-Down Silicon Nanowire-Based Thermoelectric Generator: Design and Characterization," Journal of Electronic Materials, vol. 41 no. 6, pp. 989-992, June 2012.

Li, Ya, Rao, Li, Ling, Huiqin, Hu, Anmin, and Li, Ming, "Influence of solder cap thickness on the interfacial reaction in Cu/Sn/Ni copper pillar bump," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 639-643.

Li, Yadong, Richardson, Jay B., Bricka, R. Mark, Niu, Xiaojun, Yang, Hongbin, Li, Lin, and Jimenez, Arturo, "Leaching of heavy metals from E-waste in simulated landfill columns," Waste Management, vol. 29 no. 7, pp. 2147-2150, July 2009.

Li, Yan, Moore, J. S., Pathangey, Balu, Dias, Rajen C., and Goyal, Deepak, "Lead-Free Solder Joint Void Evolution During Multiple Subsequent High-Temperature Reflows," IEEE Transactions on Device and Materials Reliability, vol. 12 no. 2, pp. 494-500, June 2012.

Li, Yan, Hatch, Olen, Liu, Pilin, and Goyal, Deepak, "Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows," Journal of Electronic Materials, vol. 46 no. 3, pp. 1674-1682, Mar. 2017.

Li, Yanli, Liang, Peipei, Yang, Xu, Cai, Hua, You, Qinghu, Sun, Jian, Xu, Ning, and Wu, Jiada, "Fabrication and short-wavelength light emission of Si nanowires grown via quasi solid-liquid-solid mechanism," Materials Letters, vol. 134, pp. 5-8, Nov. 1, 2014.

Li, Yanping, Chen, Jerry, Yang, Lisa, and Fu, Jianming, "Magnetron Sputtering of Nickel Silicon Alloy as Thin Film UBM for Pb-free Flip-Chip Packaging," Advanced Metallization Conference 2005, Colorado Springs, CO, Sept. 27-29, 2005, pp. 185-189.

Li, Yanqiu, Chen, Zheng, Li, Liangliang, and Cai, James, "20 Gigahertz noise suppressor based on ferromagnetic nanowire arrays," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 94-98.

Li, Yi, Xiao, Fei, Moon, Kyoung-sik, and Wong, C. P., "A Novel Environmentally Friendly and Biocompatible Curing Agent for Lead-free Electronics," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1639-1644.

Li, Yi, and Wong, C. P., "A Novel Non-migration nano-Ag Conductive Adhesive with Enhanced Electrical and Thermal Properties via Self-Assembled Monolayers Modification," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 924-931.

Li, Yi, Moon, Kyoung-Sik, and Wong, C. P., "Adherence of Self-Assembled Monolayers on Gold and Their Effects for High-Performance Anisotropic Conductive Adhesives," Journal of Electronic Materials, vol. 34 no. 3, pp. 266-271, Mar. 2005.

Li, Yi, Moon, Kyoung-sik, Li, Haiying, and Wong, C. P., "Conductivity Improvement of Isotropically Conductive Adhesives," Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, China, June 30-July 3, 2004, pp. 236-241.

Li, Yi, Moon, Kyoung-sik, Li, Haiying, and Wong, C. P., "Conductivity Improvement of Isotropic Conductive Adhesives with Short-Chain Dicarboxylic Acids," 54th Electronic Components & Technology Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1959-1964.

Li, Yi, Moon, Kyoung-sik, and Wong, C. P., "Development of Conductive Adhesives with Novel Corrosion Inhibitors for Stabilizing Contact Resistance on Non-Noble Lead-Free Finishes," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 1462-1467.

Li, Yi, Moon, Kyoung-sik, Li, Haiying, and Wong, C. P., "Development of Isotropic Conductive Adhesives with Improved Conductivity," 2004 9th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 24-26, 2004, pp. 1-6.

Li, Yi, Yim, M. J., Moon, K., Zhang, R. W., and Wong, C. P., "Development of Novel, Flexible, Electrically Conductive Adhesives for Next-Generation Microelectronics Interconnect Applications," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1272-1276.

Li, Yi, and Chan, Y. C., "Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi-Ag composite solders," Journal of Alloys and Compounds, vol. 645, pp. 566-576, Oct. 5, 2015.

Li, Yi, Zhao, XiuChen, Liu, Ying, Wang, Yuan, and Wang, Yong, "Effect of TiO2 addition concentration on the wettability and intermetallic compounds growth of Sn3.0Ag0.5Cu-xTiO2 nano-composite solders," Journal of Materials Science: Materials in Electronics, vol. 25 no. 9, pp. 3816-3827, Sept. 2014.

Li, Yi, Moon, Kyoung-sik, and Wong, C. P., "Effects of Reducing Agents on the Electrical Properties of Electrically Conductive Adhesives," 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 132.

Li, Yi, Moon, Kyoung-sik, and Wong, C. P., "Effects of Reducing Agents on the Electrical Properties of Electrically Conductive Adhesives," 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 179-183.

Li, Yi, Moon, Kyoung-Sik, and Wong, C. P., "Electrical Property Improvement of Electrically Conductive Adhesives Through In-Situ Replacement by Short-Chain Difunctional Acids," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 1., pp. 173-178, Mar. 2006.

Li, Yi, Moon, Kyoung-sik, and Wong, C. P., "Electrical Property of Anisotropically Conductive Adhesive Joints Modified by Self-Assembled Monolayer (SAM)," 54th Electronic Components & Technology Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1968-1974.

Li, Yi, Moon, Kyoung-sik, and Wong, C. P., "Electrochemical migration control of silver-paste conductive adhesives," 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 70.

Li, Yi, Wu, Fengshun, and Chan, Y. C., "Electromigration in eutectic In-48Sn ball grid array (BGA) solder interconnections with Au/Ni/Cu pads," Journal of Materials Science: Materials in Electronics, vol. 26 no. 11, pp. 8522-8533, Nov. 2015.

Li, Yi, Moon, Kyoung-Sik, and Wong, C. P., "Enhancement of Electrical Properties of Anisotropically Conductive Adhesive Joints via Low Temperature Sintering," Journal of Applied Polymer Science, vol. 99 no. 4, pp. 1665-1673, Feb. 15, 2006.

Li, Yi, Moon, Kyoung-Sik, Whitman, Andrew, and Wong, C. P., "Enhancement of Electrical Properties of Electrically Conductive Adhesives (ECAs) by Using Novel Aldehydes," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 4, pp. 758-763, Dec. 2006.

Li, Yi, Moon, Kyoung-sik, and Wong, C. P., "Formation of Self Assembled Monolayer (SAM) on Metal Surfaces for High Performance Anisotropically Conductive Adhesives," 2004 9th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 24-26, 2004, pp. 139-144.

Li, Yi, and Wong, C. P., "High Performance Anistropic Conductive Adhesives for Lead-free Interconnects," 7th IEEE CPMT International Conference on High Density Microsystem Design, Packaging and Failure Analysis, Shanghai, June 28, 2005, pp. xx-xx.

Li, Yi, and Wong, C. P., "High performance anisotropic conductive adhesives for lead-free interconnects," Soldering & Surface Mount Technology, vol. 18 no. 2, pp. 33-39, 2006.

Li, Yi, and Wong, ChingPing, "High Performance Conductive Adhesives for Lead-Free Interconnects," Advanced Electronic Packaging (Materials Research Society Symposium Proceedings Volume 968), Boston, MA, Nov. 27-30, 2006, pp. xx-xx.

Li, Yi, and Wong, C. P., "High Performance Conductive Adhesives Modified with Molecular Wires," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2 , Singapore, Dec. 7-9, 2005, pp. 832-837.

Li, Yi, Whitman, Andrew, Moon, Kyoung-sik, and Wong, C. P., "High Performance Electrically Conductive Adhesives (ECAs) Modified with Novel Aldehydes," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 1648-1652.

Li, Yi, Yim, M. J., Moon, K. S., and Wong, C. P., "High Performance Nano-scale Conductive Films with Low Temperature Sintering for Fine Pitch Electronic Interconnect," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Li, Yi, Moon, Kyoung-sik, and Wong, C. P., "Improvement of Electrical Performance of Anisotropically Conductive Adhesives," IEEE/CPMT International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, CA, Mar. 16-18, 2005, pp. 221-226.

Li, Yi, Luo, Kaiming, Lim, Adeline B. Y., Chen, Zhong, Wu, Fengshun, and Chan, Y. C., "Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement," Materials Science and Engineering: A, vol. 669, pp. 291-303, July 4, 2016.

Li, Yi, Moon, Hyoung-Sik, and Wong, C. P., "Monolayer-Protected Silver Nano-Particle-Based Anisotropic Conductive Adhesives: Enhancement of Electrical and Thermal Properties," Journal of Electronic Materials, vol. 34 no. 12, pp. 1573-1578, Dec. 2005.

Li, Yi, Yim, Myung Jin, Moon, Kyung Sik, and Wong, C. P., "Nano-Scale Conductive Films with Low Temperature Sintering for High Performance Fine Pitch Interconnect," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1350-1355.

Li, Yi, Xiao, Fei, Moon, Kyoung-Sik, and Wong, C. P., "Novel Curing Agent for Lead-Free Electronics: Amino Acid," Journal of Polymer Science, Part A: Polymer Chemistry, vol. 44 no. 2, pp. 1020-1027, Jan 15, 2006.

Li, Yi, Moon, Kyoung-sik, and Wong, C. P., "Novel Lead Free Nano-scale Non-Conductive Adhesive (NCA) for Ultra-Fine Pitch Interconnect Applications," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1239-1245.

Li, Yi, Yim, Myung Jin, Moon, Kyoung Sik, and Wong, C. P., "Novel Nano-Scale Conductive Films With Enhanced Electrical Performance and Reliability for High Performance Fine Pitch Interconnect," IEEE Transactions on Advanced Packaging, vol. 32 no. 1, pp. 123-129, Feb. 2009.

Li, Yi, Moon, Kyoung-sik, and Wong, C. P., "Novel Nanotechnology for Environmentally Friendly Interconnect Materials in Microelectronic Packaging Applications," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 32-37.

Li, Yi, Lim, Adeline B. Y., Luo, Kaiming, Chen, Zhong, Wu, Fengshun, and Chan, Y. C., "Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In-48Sn/Cu solder interconnects under current stressing," Journal of Alloys and Compounds, vol. 673, pp. 372-382, July 15, 2016.

Li, Yi, and Wong, C. P., "Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications," Materials Science and Engineering R: Reports, vol. 51 no. 1-3, pp. 1-35, Jan 30, 2006.

Li, Yi, and Wong, C. P., "Recent Advances on Electrical Conductive Adhesives (ECAs)," 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, Portland, OR, Sept. 12-15, 2004, pp. 1-7.

Li, Yi, Moon, Kyoung-Sik, and Wong, C. P., "Reliability improvement of conductive adhesives on tin (Sn) surfaces," Journal of Adhesion Science & Technology, vol. 19 no. 16, pp. 1427-1444, 2005.

Li, Yi, and Wong, C. P., "Silver migration control in Electrically Conductive Adhesives," Proceedings of the 2006 IEEE CPMT Conference on High Density Microsystem Design, Packaging and Component Failure Analysis, Shanghai, June 27-28, 2006, pp. 206-212.

Li, Yi, Moon, Kyoung-sik, and Wong, C. P., "Stabilizing Contact Resistance of Conductive Adhesives on Sn Surface by Novel Corrosion Inhibitors," 2005 IEEE/CPMT 10th International Symposium on Advanced Packaging Materials, Irvine, CA, Mar. 16-18, 2005, pp. 85-89.

Li, Yi-Kang, Guo, Lei, Liang, Zheng-Chao, Qin, Hong-Bo, Luan, Xing-He, and Hou, Bin, "The influence of microstructure characteristic on the electromigration behaviour of line-type Sn58Bi solder joints," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 1488-1491.

Li, Ying, Zhao, Wen-yu, Mu, Xin, Liu, Xing, He, Dan-qi, Zhu, Wan-Ting, and Zhang, Qing-Jie, "Synthesis and Characterization of High-Purity Tellurium Nanowires via Self-seed-Assisted Growth Approach," Journal of Electronic Materials , vol. 45 no. 3, pp. 1661-1668, Mar. 2016.

Li, Yiqun, Wang, Youqing, Chen, Lulu, Li, Xiulei, Han, Weihua, and Xie, Erqing, "Controlled Synthesis on Ag Nanowires for Conductive Transparent Electrodes," Materials and Manufacturing Processes, vol. 30 no. 1, pp. 30-33, 2015.

Li, Yu-Jin, and Chen, Chih, "Growth of Cu6Sn5 and Cu3Sn Intermetallic compounds on (111)-, (100)-, and randomly-oriented copper films," 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 26-28, 2016, pp. 42-44.

Li, Yuan, "An Experimental Study On Organic Solderability Preservative," Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium , Austin, TX, Oct. 13-15, 1997, pp. 56-61.

Li, Yuanshan, Lei, Xiaojuan, and Chen, Zhenhua, "A Novel Low Melting Point Pb-Free Solder," Circuits Assembly , vol. 18 no. 2, pp. 54, 56-57, Feb. 2007.

Li, Yuanshan, Chen, Xu, and Luo, Yufeng, "A Replaceable Lead-free Solder for Sn-37Pb," Applied Mechanics and Materials, vol. 80-81, pp. 108-112, 2011.

Li, Yuanshan, Luo, Yufeng, and Chen, Xu, "Effect of Microelements on Sn-20Bi Solder," Advanced Materials Research , vol. 335-336, pp. 207-211, 2011.

Li, Yuan-shan, Chen, Zhen-hua, and Lei, Xiao-juan, "Influence of rapid cooling and diffusion annealing on Sn-Bi-X solder," Zhongguo Youse Jinshu Xuebao/ Chinese Journal of Nonferrous Metals , vol. 17 no. 8, pp. 1319-1323, Aug. 2007.

Li, Yulong, Wang, Zhiliang, Li, Xuewen, and Lei, Min, "Effect of temperature and substrate surface roughness on wetting behavior and interfacial structure between Sn-35Bi-1Ag solder and Cu substrate," Journal of Materials Science: Materials in Electronics, vol. 31 no. 5, pp. 4224-4236, Mar. 2020.

Li, Yulong, Wang, Zhiliang, Li, Xuewen, Hu, Xiaowu, and Lei, Min, "Growth behavior of IMCs layer of the Sn-35Bi-1Ag on Cu, Ni-P/Cu and Ni-Co-P/Cu substrates during aging," Journal of Materials Science: Materials in Electronics, vol. 30 no. 2, pp. 1519-1530, Jan. 2019.

Li, Yulong, Wang, Zhiliang, Long, Weifeng, Lei, Min, and Hu, Xiaowu, "Wetting kinetics and spreading phenomena of Sn-35Bi-1Ag solder on different substrates," Journal of Materials Science: Materials in Electronics , vol. 29 no. 16, pp. 13914-13924, Aug. 2018.

Li, Yung-Ta, Xu, Yuan-Hung, Ji, Jiao-Dong, Lin, Chang-Fu, and Chung, C. Key, "Formation behavior of intermetallic compound in solder joint assembly within fluxless bonding," 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 24-26, 2018, pp. 248-251.

Li, Yuquan, Johnson, R. Wayne, Thompson, Patrick, Hooghan, Tejpal, and Libres, Jeremias, "Reliability of Flip Chip Packages with High Thermal Conductivity Heat Spreader Attach," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 2011-2017.

Li, Yuxiu, Yuan, Ximin, Yang, Hongwei, Chao, Yunxiu, Guo, Shuailong, and Wang, Chuan, "Solvothermal synthesis of ultra-fine silver nanowires with a diameter about 20 nm and an aspect ratio approximately 2000 for highly conductive flexible transparent film," Journal of Materials Science: Materials in Electronics, vol. 30 no. 9, pp. 8883-8891, May 2019.

Li, Z., Dallegri, M., and Knott, S., "Calorimetric measurements of the ternary Ag-Au-Sn system," Journal of Alloys and Compounds, vol. 453 no. 1-2, pp. 442-447, Apr. 3, 2008.

Li, Z., Bauer, C. L., Mahajan, S., and Milnes, A. G., "Degradation and subsequent healing by electromigration in Al-1 wt % Si thin films," Journal of Applied Physics, vol. 72 no. 5, pp. 1821-1832, Sept. 1, 1992.

Li, Z. L., Li, G. Y., Cheng, L. X., and Huang, J. H., "Effect of nano-TiO2 addition on microstructural evolution of small solder joints," Journal of Materials Science: Materials in Electronics, vol. 27 no. 6, pp. 6076-6087, June 2016.

Li, Z. H., Tang, Y., Guo, Q. W., and Li, G. Y., "A diffusion model and growth kinetics of interfacial intermetallic compounds in Sn-0.3Ag-0.7Cu and Sn-0.3Ag-0.7Cu-0.5CeO2 solder joints," Journal of Alloys and Compounds, vol. 818, pp. 152893-1-152893-13, Mar. 25, 2020.

Li, Z. H., Tang, Y., Guo, Q. W., and Li, G. Y., "Effects of CeO2 nanoparticles addition on shear properties of low-silver Sn-0.3Ag-0.7Cu-xCeO2 solder alloys," Journal of Alloys and Compounds , vol. 789, pp. 150-162, June 15, 2019.

Li, Z. L., Cheng, L. X., Li, G. Y., Huang, J. H., and Tang, Y., "Effects of joint size and isothermal aging on interfacial IMC growth in Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints," Journal of Alloys and Compounds , vol. 697, pp. 104-113, Mar. 15, 2017.

Li, Z. L., Li, G. Y., Li, B., Cheng, L. X., Huang, J. H., and Tang, Y., "Size effect on IMC growth in micro-scale Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints in reflow process," Journal of Alloys and Compounds, vol. 685, pp. 983-991, Nov. 15, 2016.

Li, Z. Q., Belyakov, S. A., Xian, J. W., and Gourlay, C. M., "The Influence of Primary Cu6Sn5 Size on the Shear Impact Properties of Sn-Cu/Cu BGA Joints," Journal of Electronic Materials, vol. 47 no. 1, pp. 84-95, Jan. 2018.

Li, Zezheng, Zhou, Bin, Chen, Si, An, Tong, Qin, Fei, and Liang, Chen, "Finite element analysis of the fabrication process of CCGA package," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Li, Zhaozhi, Lee, Sangil, Evans, John L., and Baldwin, Daniel F., "Comprehensive Study of Lead-Free Reflow Process for a 3-D Flip Chip on Silicon Package," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 11, pp. 1856-1863, Nov. 2011.

Li, Zhaozhi, Lee, Sangil, Lewis, Brian J., Houston, Paul N., Baldwin, Daniel F., Stout, Gene, Tessier, Ted, and Evans, John L., "Pb-Free Reflow Profile Process Study for High Yield, High Reliability Flip Chip on Silicon Substrate Assembly," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 207-214.

Li, Zhaozhi, Lee, Sangil, Lewis, Brian J., Houston, Paul N., Baldwin, Daniel F., Stout, Gene, Tessier, Ted, and Evans, John L., "Sensitivity Analysis of Pb Free Reflow Profile Parameters Toward Flip Chip on Silicon Assembly Yield, Reliability and Intermetallic Compound Characteristics," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1132-1138.

Li, Zhe, Bian, Haidong, Lee, Christopher M., Chen, Xiaobo, and Li, Yang Yang, "Nickel nanotube array via electroplating and dealloying," Thin Solid Films, vol. 658, pp. 1-6, July 31, 2018.

Li, Zhi, Zhang, Cheng-ping, Zhao, Mei-rong, and Jin, Hai-jun, "Analysis of interface Stress of Sn3.5Ag0.75Cu solder under Temperature cycle QFP device," Applied Mechanics and Materials, vol. 55-57, pp. 1468-1472, 2011.

Li, Zhong Chun, Shang, Tong Ming, Zhou, Quan Fa, and Feng, Ke, "Sodium chloride assisted synthesis of silver nanowires," IET Micro & Nano Letters, vol. 6 no. 2, pp. 90-93, Feb. 2011.

Li, Zhong Xiang, and Gupta, Manoj, "High Strength Lead-Free Composite Solder Materials using Nano-Al2O3 as Reinforcement," Advanced Engineering Materials, vol. 7 no. 11, pp. 1049-1054, Nov. 2005.

Li, Zhuo, Hansen, Kristen, Moon, Kyoung-sik, and Wong, C. P., "Shape Engineering of the Fillers in Stretchable, Electrically Conductive Adhesives: Its Effect on Percolation and Conductivity Change during Stretching," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 2196-2200.

Li, Zijing, Jiang, Yan, Feng, Shaoping, Sun, Lida, and Zhou, Bo, "Preparation of Gold Nanowires by Photochemical Glucose Reduction," Key Engineering Materials, vol. 807, pp. 11-17, June 2019.

Li, Zuoan, Knott, Sabine, Qiao, Zhiyu, and Mikula, Adolf, "Calorimetric Investigations of Liquid Cu-In-Sn Alloys," Materials Transactions, vol. 47 no. 8, pp. 2-25-2032, Aug. 2006.

Li, Zuoan, Knott, Sabine, and Mikula, Adolf, "Thermodynamic description of the ternary Pd-Sn-Zn system," International Journal of Materials Research, vol. 99 no. 2, pp. 145-149, Feb. 2008.

Li, Zuoan, Cao, Zhanmin, Knott, Sabine, Mikula, Adolf, Du, Yong, and Qiao, Zhiyu, "Thermodynamic investigation of the Ag-Bi-Sn ternary system," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 32 no. 1, pp. 152-163, Mar. 2008.

Li, Zuoan, Knott, Sabine, and Mikula, Adolf, "Thermodynamic Properties of Liquid Ag-Bi-Sn Alloys," Journal of Electronic Materials, vol. 36 no. 1, pp. 40-44, Jan. 2007.

Lian, Jie, Chun, Steven Jan Wo, Goorsky, Mark S., and Wang, Junlan, "Mechanical behavior of Au-In intermetallics for low temperature solder diffusion bonding," Journal of Materials Science, vol. 44 no. 22, pp. 6155-6161, Nov. 2009.

Liang, Cai, Mathison, Leslie, and Prorok, Barton C., "Mechanical Property Measurement of Interconnect Materials by Magnetostrictive Sensors," Advanced Electronic Packaging (Materials Research Society Symposium Proceedings Volume 968), Boston, MA, Nov. 27-30, 2006, pp. 133-138.

Liang, Chien-Lung, and Lin, Kwang-Lung, "Athermal recrystallization behavior of (Sn) solid-solution at an intermetallic-free Cu/Sn interface induced by room temperature electromigration," Materials Letters, vol. 236, pp. 607-610, Feb. 1, 2019.

Liang, Chien-Lung, Lin, Kwang-Lung, and Peng, Jr-Wei, "Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints," Journal of Electronic Materials, vol. 45 no. 1, pp. 51-56, Jan. 2016.

Liang, Chien-Lung, and Lin, Kwang-Lung, "The amorphous interphase formed in an intermetallic-free Cu/Sn couple during early stage electromigration," Scripta Materialia, vol. 155, pp. 58-62, Oct. 2018.

Liang, Chien-Lung, Lin, Kwang-Lung, and Cheng, Po-Jen, "The dissolution and reprecipitation behavior of the AuSn4 intermetallic compound in a solder joint during liquid-state and solid-state reactions," Journal of Materials Science, vol. 52 no. 19, pp. 11659-11667, Oct. 2017.

Liang, Chien-Lung, Lin, Kwang-Lung, and Cheng, Po-Jen, "The interfacial bilayer Cu6Sn5 formed in a Sn-Ag-Cu flip-chip solder joint incorporating Au/Pd metallization during solid-state aging," Journal of Materials Science: Materials in Electronics, vol. 29 no. 17, pp. 15233-15240, Sept. 2018.

Liang, J., Dariavach, N., Kelly, V., Callahan, P., Barr, G., and Shangguan, D., "A Study on Copper Dissolution in Liquid Lead Free Solders under Static and Dynamic Conditions," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Liang, J., Lee, P. S., Gollhardt, N., Schroeder, S., and Morris, W., "Creep Study for Fatigue Life Assessment of Two Lead-free High Temperature Solder Alloys," Materials Research Society Symposium Proceedings Volume 445, Boston, MA, Dec. 2-5, 1996, pp. 307-312.

Liang, J., Dariavach, N., Callahan, P., Shangguan, D., and Li, X., "Deformation and Fatigue Fracture of Solder Alloys Under Complicated Load Conditions," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B, San Francisco, CA, July 17-22, 2005, pp. 927-938.

Liang, J., Downes, S., Dariavach, N., Shangguan, D., and Heinrich, S. M., "Effects of Load and Thermal Conditions on Pb-Free Solder Joint Reliability," Journal of Electronic Materials, vol. 33 no. 12, pp. 1507-1515, Dec. 2004.

Liang, J., Dariavach, N., Barr, G., and Fang, Z., "Effects of Strain Rates and Biaxial Stress Conditions on Plastic Yielding and Flow Stress of Solder Alloys," Journal of Electronic Materials, vol. 35 no. 2, pp. 372-379, Feb. 2006.

Liang, J., Dariavach, N., Callahan, P., and Shangguan, D., "Effects of thermal history on the intermetallic growth and mechanical strength of Pb-free and Sn-Pb BGA solder balls 4-14, 2007.

Liang, J., Dariavach, N., Callahan, P., and Shangguan, D., "Inelastic Deformation and Fatigue of Solder Alloys Under Complicated Load Conditions," Journal of Electronic Packaging, vol. 129 no. 2, pp. 195-204, June 2007.

Liang, J., Li, X., Xu, Z., and Shangguan, D., "Nano-indentation Study on Whisker Formation on Tin Plated Component Leads," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Liang, J. L., Du, Yong, Tang, Y. Y., Liao, C. Z., Meng, J. L., and Xu, H. H., "Phase Equilibria of the Ag-Gd-Sn Ternary System at 400°C," Journal of Alloys and Compounds, vol. 481 no. 1-2, pp. 264-269, July 29, 2009.

Liang, J., Dariavach, N., and Shangguan, D., "Solidification Condition Effects on Microstructures and Creep Resistance of Sn-3.8Ag-0.7Cu Lead-Free Solder," Metallurgical and Materials Transactions A, vol. 38 no. 7, pp. 1530-1538, July 2007.

Liang, J., Morand, G., Dariavach, N., and Shangguan, D., "Tin Whisker Formation Kinetics on Sn-Pb HASL Coating Layer Inside Plated Through Holes With Press-Fit Complaint Pins," 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 41.

Liang, J., Dariavach, N., and Shangguan, D., "Tin Whisker Nucleation and Growth on Sn-Pb Eutectic Coating Layer Inside Plated Through Holes With Press-Fit Pins," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 1, pp. 152-158, Mar. 2008.

Liang, Jianlie, Liao, Changzhong, Tang, Yiyuan, Yin, Cailiu, Han, Yanmei, Nong, Liangqin, and Xie, Shibiao, "Interaction of the components in the Ag-Er-Sn system at 400 °C," Journal of Alloys and Compounds, vol. xxx no. x, pp. xx-xx, xxxx.

Liang, Jian-lie, Du, Yong, Tang, Yi-yuan, Xie, Shi-biao, Xu, Hong-hui, Zeng, Ling-min, Liu, Yong, Zhu, Qi-ming, and Nong, Liang-qin, "Phase Equilibria in the Ni-Sn-Zn System at 500°C," Journal of Electronic Materials, vol. 40 no. 11, pp. 2290-2299, Nov. 2011.

Liang, Jianlie, Liao, Changzhong, Du, Yong, Tang, Yiyuan, Han, Yanmei, He, Yuehui, and Liu, Shuhong, "The isothermal section of the Ag-La-Sn ternary system at 400 °C," Journal of Alloys and Compounds, vol. 493 no. 1-2, pp. 122-127, Mar. 18, 2010.

Liang, Jiaxing, Luo, Tingbi, Hu, Anmin, and Li, Ming, "Formation and growth of interfacial intermetallic layers of Sn-8Zn-3Bi-0.3Cr on Cu, Ni and Ni-W substrates," Microelectronics Reliability, vol. 54 no. 1, pp. 245-251, Jan. 2014.

Liang, Jiaxing, Luo, Tingbi, Hu, Anmin, and Li, Ming, "Formation and growth of interfacial intermetallic layers of Sn-8Zn-3Bi-0.3Cr on Cu, Ni and Ni-W substrates," Microelectronics Reliability, vol. xx no. x pp. xx-xx, xxxx.

Liang, Jiaxing, Wang, Haozhe, Hu, Anmin, and Li, Ming, "IMC Growth at the Interface of Sn-2.0Ag-2.5Zn Solder Joints with Cu, Ni, and Ni-W Substrates," Journal of Electronic Materials, vol. 43 no. 11, pp. 4119-4125, Nov. 2014.

Liang, Jin, Dariavach, Nader, and Shangguan, Dongkai, "Deformation Behavior of Solder Alloys under Variable Strain Rate Shearing & Creep Conditions," 2005 IEEE/CPMT 10th International Symposium on Advanced Packaging Materials, Irvine, CA, Mar. 16-18, 2005, pp. 21-26.

Liang, Jin, Li, Xiaodong, Xu, Zhi-Hui, and Shangguan, Dongkai, "Indentation Induced Tin Whisker Formation on Tin Plated Component Leads," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B, San Francisco, CA, July 17-22, 2005, pp. 1199-1205.

Liang, Jin, Dariavach, Nader, Callahan, Paul, and Shangguan, Dongkai, "Metallurgy and Kinetics of Liquid-Solid Interfacial Reaction during Lead-Free Soldering," Materials Transactions, vol. 47 no. 2, pp. 317-325, 2006.

Liang, Jin, Xu, Zhi-Hui, and Li, Xiaodong, "Whisker nucleation in indentation residual stress field on tin plated component leads," Journal of Materials Science: Materials in Electronics , vol. 18 no. 6, pp. 599-604, June 2007.

Liang, Kun, Tang, Xianzhong, Yu, Lijing, Wang, Ni, and Hu, Wencheng, "Investigation of preparation and characteristics of Sn-Bi eutectic powders derived from a high shear mechanical approach," Journal of Alloys and Compounds, vol. 509 no. 41, pp. 9836-9841, Oct. 13, 2011.

Liang, Le, Wang, Qian, and Zhao, Zhenqing, "Effect of Cerium Addition on Board Level Reliability of Sn-Ag-Cu Solder Joint," 8th International Conference on Electronic Packaging Technology , Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Liang, Li, and Sharp, Alice, "Development of an analytical method for quantitative comparison of the e-waste management systems in Thailand, Laos, and China," Waste Management and Research, vol. 34 no. 11, pp. 1184-1191, Nov. 2016.

Liang, Lihua, Zhang, Yuanxiang, and Liu, Yong, "Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis," Journal of Electronic Packaging, vol. 133 no. 3, pp. 031002-1-031002-12, Sept. 2011.

Liang, Lunwei, Xiang, Liang, Wang, Yunjiang, Chen, Yan, Wang, Haiying, and Dai, Lanhong, "Ratchetting in Cold-Drawn Pearlitic Steel Wires," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 50 no. 10, pp. 4561-4568, Oct. 2019.

Liang, S. B., Ke, C. B., Ma, W. J., Zhou, M. B., and Zhang, X. P., "Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects," Microelectronics Reliability, vol. 71, pp. 71-81, Apr. 2017.

Liang, S. W., Chen, Chih, Han, J. K., Xu, Luhua, Tu, K. N., and Lai, Yi-Shao, "Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration," Journal of Applied Physics, vol. 107 no. 9, pp. 093715-1-093715-4, 2010.

Liang, S. W., Hsiao, H. Y., and Chen, Chih, "Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints," Journal of Electronic Materials, vol. 39 no. 10, pp. 2316-2323, Oct. 2010.

Liang, S. W., Chang, Y. W., Chen, Chih, Preciado, Jackie, and Tu, K. N., "Effect of Migration and Condensation of Pre-existing Voids on Increase in Bump Resistance of Flip Chips on Flexible Substrates during Electromigration," Journal of Electronic Materials, vol. 37 no. 7, pp. 962-967, July 2008.

Liang, S. W., Hsiao, Hsiang-Yao, Chen, Chih, Xu, Luhua, Tu, K. N., and Lai, Yi-Shao, "Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints," Journal of Electronic Materials, vol. 38 no. 12, pp. 2443-2448, Dec. 2009.

Liang, S., Islam, R., Smith, David J., and Bennett, P. A., "Phase transformation in FeSi2 nanowires," Journal of Crystal Growth , vol. 295 no. 2, pp. 166-171, Oct. 1, 2006.

Liang, S. W., Chang, Y. W., and Chen, Chih, "Three-Dimensional Thermoelectrical Simulation in Flip-Chip Solder Joints with Thick Underbump Metallizations during Accelerated Electromigration Testing," Journal of Electronic Materials, vol. 36 no. 2, pp. 159-167, Feb. 2007.

Liang, Shui-Bao, Ke, Chang-Bo, Zhou, Min-Bo, and Zhang, Xin-Ping, "Coupled phase field and finite element modeling of void evolution and physical property change of micro flip-chip solder joints under electromigration and elastic stress field," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1631-1636.

Liang, Shui-Bao, Zhang, Xin-Ping, Wei, Cheng, Ke, Chang-Bo, and Liu, Changqing, "Interaction effects between the preferred growth of b-Sn grains and thermo-mechanical response in microbump interconnects under thermal cycling," 2018 7th Electronic System-Integration Technology Conference, Dresden, Germany, Sept. 18-21, 2018, pp. xx-xx.

Liang, Shui-bao, Ke, Chang-Bo, Zhou, Min-Bo, and Zhang, Xin-Ping, "Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulation," 2015 16th International Conference on Electronic Packaging Technology , Changsha, China, Aug. 11-14, 2015, pp. 260-265.

Liang, Shui-Bao, Ke, Chang-Bo, Ma, Wen-Jing, Zhou, Min-Bo, and Zhang, Xin-Ping, "Phase field simulation of Kirkendall voids at the interface of microscale Sn/Cu system lead-free interconnects," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 641-645.

Liang, Shui-Bao, Ke, Chang-Bo, Ma, Wen-Jing, Zhou, Min-Bo, and Zhang, Xin-Ping, "Phase Field Simulation of Segregation of the Bi-riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 264-270.

Liang, Shui-Bao, Ke, Chang-Bo, Tan, Meng-Ying, Zhou, Min-Bo, and Zhang, Xin-Ping, "Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interconnects," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 836-840.

Liang, Shui-Bao, Ke, Chang-Bo, Wei, Cheng, Zhou, Min-Bo, and Zhang, Xin-Ping, "Phase field study of the combined effects of electromigration and thermomigration on phase segregation and physical properties of Sn58Bi solder joints under electric current stressing coupled with temperature gradient," 2018 19th International Conference on Electronic Packaging Technology , Shanghai, China, Aug. 8-11, 2018, pp. 376-382.

Liang, Steve Xin, and Meehan, Kevin, "Lead-Free Soldering Solution for Overmolded Hybrid MCM-L Packages," 2000 Pan Pacific Symposium Conference Proceedings, Jan. 2000, pp. xx-xx.

Liang, Tianshou, Shi, Pengpeng, Su, Sanqing, Zhang, Xiaolong, and Dai, Xuanjun, "Near-perfect healing natures of silver five-fold twinned nanowire," Computational Materials Science, vol. 183, pp. 109796-1-109796-5, Oct. 2020.

Liang, Ting, Liang, Yongfeng, Fang, Jiaye, Chen, Gang, and Chen, Xu, "Torsional fatigue with axial constant stress for Sn-3Ag-0.5Cu lead-free solder," International Journal of Fatigue, vol. 67, pp. 203-211, Oct. 2014.

Liang, Y. C., Tsao, W. A., Yao, Da-Jeng, Lai, Yi-Shao, and Chen, Chih, "Influence of Cu Columns on Current Crowding Effect in Electromigration in Flip-Chip Solder Joints," 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 7-9, 2011, pp. 789-793.

Liang, Y. C., Chen, C., and Tu, K. N., "Side Wall Wetting Induced Void Formation Due to Small Solder Volume in Microbumps of Ni/SnAg/Ni Upon Reflow," 18th Annual Pan Pacific Microelectronics Symposium, Wailea-Makena, HI, Jan. 22-24, 2013, pp. xx-xx.

Liang, Ying, Huang, Chunyue, Gao, Chao, and Fu, Yuxiang, "Stress and Strain Analysis of QFN Solder Joint under Torsional Loading," 2019 20th International Conference on Electronic Packaging Technology , Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Liang, Ying, Sun, Fenglian, Wang, Lifeng, and Yang, Miaosen, "Thermodynamic calculation-aided design Pb-free solders and related experimental research," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Liang, Yong (Hill), Mao, Hank, Yan, YongGang, and Lee, Jindong (King), "Study on Solder Joint Reliability of Fine Pitch CSP," IPC APEX Expo 2014, Las Vegas, NV, Mar. 25-27, 2014, pp. xx-xx.

Liang, Yu-Chun, and Chen, Chih, "Microstructure Evolution in a Sandwich Structure of Ni/SnAg/Ni Microbump during Reflow," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 423-426.

Liang, Zhang, Songbai, Xue, Lili, Gao, Guang, Zeng, Shenglin, Yu, and Zhong, Sheng, "Thermal Fatigue Behavior of SnAgCu Soldered Joints in Fine Pitch Devices," Rare Metal Materials and Engineering, vol. 39 no. 3, pp. 382-387, Mar. 2010.

Liangjie, Zhou, Lin, Huang, Fengshun, Wu, Hui, Liu, Weisheng, Xia, Hongzhi, Fu, Shiyu, Wang, and Zhe, Liu, "Effect of Reflow Conditions on the Die Shear Strength in Flip Chip on Board with SAC305 Solder Joints," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 109-113.

Liao, Bokai, Cen, Hongyu, Chen, Zhenyu, and Guo, Xingpeng, "Corrosion behavior of Sn-3.0Ag-0.5Cu alloy under chlorine-containing thin electrolyte layers," Corrosion Science, vol. 143, pp. 347-361, Oct. 2018.

Liao, Bokai, Li, Zhen, Cai, Yu, and Guo. Xingpeng, "Electrochemical migration behavior of Sn-3.0Ag-0.5Cu solder alloy under SO2 polluted thin electrolyte layers," Journal of Materials Science: Materials in Electronics, vol. 30 no. 6, pp. 5652-5661, Mar. 2019.

Liao, Bokai, Wang, Hong, Xiao, Weiping, Cai, Yu, and Guo, Xingpeng, "Recent advances in method of suppressing dendrite formation of tin-based solder alloys," Journal of Materials Science: Materials in Electronics , vol. 31 no. 16, pp. 13001_13010, Aug. 2020.

Liao, C. N., and Wei, C. T., "An isochronal kinetic study of intermetallic compound growth in Sn/Cu thin film couples," Thin Solid Films, vol. xx no. xx, pp. xx-xx, 2006.

Liao, C. N., and Wei, C. T., "Effect of Intermetallic Compound Formation on Electrical Properties of Cu/Sn Interface during Thermal Treatment," Journal of Electronic Materials , vol. 33 no. 10, pp. 1137-1143, Oct. 2004.

Liao, C. N., Chen, K. C., Wu, W. W., Chen, L. J., and Tu, K. N., "In-situ TEM Study of Electromigration in Cu lines," AIP Conference Proceedings, vol. 1143, pp. 12-18, 2009.

Liao, Chien-Neng, and Huang, Yen-Chun, "Effect of Ag addition in Sn on growth of SnTe compound during reaction between molten solder and tellurium," Journal of Materials Research , vol. 25 no. 2, pp. 391-395, Feb. 2, 2010.

Liao, Chien-Neng, and Lee, Ching-Hua, "Suppression of vigorous liquid Sn/Te reactions by Sn-Cu solder alloys," Journal of Materials Research, vol. 23 no. 12, pp. 3303-3308, Dec. 2008.

Liao, Daokun, Su, Dan, Liu, Sheng, Li, Xiaotian, and Zhang, Honghai, "Effects of drive air pressure, exhaust pipe length and deposition height on the morphology of Sn99.3Cu0.7 solder ball," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 1508-1511.

Liao, Fan, Wang, Tao, and Shao, Mingwang, "Silicon nanowires: applications in catalysis with distinctive surface property," Journal of Materials Science: Materials in Electronics , vol. 26 no. 7, pp. 4722-4729, July 2015.

Liao, Jerry, Bachman, Mark, and Osenbach, John, "Large Die Size Lead Free Flip Chip Ball Grid Array Packaging Considerations for 28nm Fab Technology," 2012 IEEE 14th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 5-7, 2012, pp. 412-414.

Liao, P. L., and Liu, C. Y, "Current Density Dependence of EM (Electromigration)-Induced Flip-Chip Cu Pad Consumption," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Liao, Wen-Kai, Chen, Chih-Ming, Lin, Ming-Tzer, and Wang, Chao-Hong, "Enhanced growth of the Ni3Sn4 phase at the Sn/Ni interface subjected to strains," Scripta Materialia, vol. xx no. x, pp. xx-xx, xxxx.

Liao, William, "The 14th First General Convention of Taiwan Industrial Fastener Institute," Fastener World, pp. 112-114, 117-118, 121-122, Jan./Feb. 2006.

Liashenko, O. Y., and Hodaj, F., "Initial stage of isothermal wetting of bulk Cu6Sn5, Cu3Sn and Cu substrates by liquid Sn," Journal of Materials Science: Materials in Electronics , vol. 30 no. 2, pp. 1838-1849, Jan. 2019.

Liashenko, O. Y., Lay, S., and Hodaj, F., "On the initial stages of phase formation at the solid Cu/liquid Sn-based solder interface," Acta Materialia, vol. 117, pp. 216-227, Sept. 15, 2016.

Liashenko, O. Y., and Hodaj, F., "Wetting and spreading kinetics of liquid Sn on Ag and Ag3Sn substrates," Scripta Materialia, vol. 127, pp. 24-28, Jan. 15, 2017.

Liashenko, O. Yu, and Hodaj, F., "Differences in the interfacial reaction between Cu substrate and metastable supercooled liquid Sn-Cu solder or solid Sn-Cu solder at 222 °C: Experimental results versus theoretical model calculations," Acta Materialia, vol. 99, pp. 106-118, Oct. 15, 2015.

Liashenko, Oleksii, Gusak, Andriy M., and Hodaj, Fiqiri, "Phase growth competition in solid/liquid reactions between copper or Cu3Sn compound and liquid tin-based solder," Journal of Materials Science: Materials in Electronics, vol. 25 no. 10, pp. 4664-4672, Oct. 2014.

Liaw, H. M., and Faust Jr., J. W., "The Habit of Copper Dendrites Grown in Molten Thallium Solutions," Journal of Crystal Growth, vol. 10 no. 4, pp. 302-308, Sept. 1971.

Libot, J.-B., Alexis, J., Dalverny, O., Arnaud, L., Milesi, P., and Dulondel, F., "Experimental SAC305 Shear Stress-Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements," Journal of Electronic Packaging, vol. 141 no. 2, pp. 021002-1-021002-15, June 2019.

Libot, J.-B., Dulondel, F., Milesi, P., Alexis, J., Arnaud, L., and Dalverny, O., "Experimental strain energy density dissipated in SAC305 solder joints during different thermal cycling conditions using strain gages measurements," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 748-755.

Libot, J. B., Arnaud, L., Dalverny, O., Alexis, J., Milesi, P., and Dulondel, F., "Mechanical fatigue assessment of SAC305 solder joints under harmonic and random vibrations," 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Montpelier, France, Apr. 18-20, 2016, pp. xx-xx.

Libot, J. B., Arnaud, L., Dalverny, O., Alexis, J., Milesi, P., and Dulondel, F., "Mechanical fatigue assessment of SAC305 solder joints under harmonic vibrations," 2016 International Conference on Electronics Packaging , Hokkaido, Japan, Apr. 20-22, 2016, pp. 231-236.

Libot, J. B., Alexis, J., Dalverny, O., Arnaud, L., Milesi, P., and Dulondel, F., "Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling," Microelectronics Reliability, vol. 83, pp. 64-76, Apr. 2018.

Libres, Jeremias, and Robinson, Karen, "Challenges in the Assembly of Large Die, High Bump Density Pb-Free Flip Chip Packages," 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium, San Jose, CA, Oct. 3-5, 2007, pp. 346-351.

Libres, Jeremias, and Arroyo, J. Carlos, "Investigation of Bump Crack and Deformation on Pb-Free Flip Chip Packages," 2010 Proceedings 60th Electronic Components and Technology Conference , Las Vegas, NV, June 1-4, 2010, pp. 1536-1540.

Lichau, Daniel, "Image Processing, Quantification and Model Reconstructions in SEM/FIB," Club Image 3D, Le Bourget du Lac, France, Oct. 20, 2010, pp. xx-xx.

Lichau, Daniel, "Image Processing, Quantification and Model Reconstructions in SEM/FIB: Case studies," European Focused Ion Beam Users Group Meeting, Gatea, Italy, Oct. 11, 2010, pp. xx-xx.

Lieber, Charles M., "Semiconductor nanowires: A platform for nanoscience and nanotechnology," MRS Bulletin, vol. 36 no. 12, pp. 1052-1063, Dec. 2011.

Lienert, U., Li, S. F., Hefferan, C. M., Lind, J., Suter, R. M., Bernier, J. V., Barton, N. R., Brandes, M. C., Mills, M. J., Miller, M. P., Jakobsen, B., and Pantleon, W., "High-Energy Diffraction Microscopy at the Advanced Photon Source," JOM , vol. 63 no. 7, pp. 70-77, July 2011.

Liew, Eric, Zaman, Fadzol, and Thanupillai, Sivakumar, "Outsourcing RoHS-Compliant Production at a Distance," Circuits Assembly, vol. 17 no. 2, pp. 56, 58-59, Feb. 2006.

Liew, Mui Chee, Ahmad, Ibrahym, Lee, Liu Mei, Nazeri, Muhammad Firdaus Mohd, Haliman, Habsah, and Mohamad, Ahmad Azmin, "Corrosion Behavior of Sn-3.0Ag-0.5Cu Lead-Free Solder in Potassium Hydroxide Electrolyte," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 43 no. 10, pp. 3742-3747, Oct. 2012.

Lifeng, Wang, Bing, He, and Yangyang, Yu, "The Simulation Analysis for the Correlation between Failure of BGA Solder Joints and the Loading Modes," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 933-936.

Lifset, Reid, and Lindhqvist, Thomas, "Producer Responsibility at a Turning Point?," Journal of Industrial Ecology, vol. 12 no. 2, pp. 144-147, Spring 2008.

Lifton, Anna, Bent, Westin, Lazovskaya, Irina, Salerno, Paul, and Andres, Frank, "Reliability of the Soler Joints: Is a Shear Force a Good Indicator?," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 852-857.

Lifton, Anna, Bulwith, Ronald A., and Picchione, Louis M., "Wetting Characteristics of Pb-Free Alloys of Interest," Circuits Assembly, vol. 16 no. 7, pp. 30, July 2005.

Light, David N., Jimarez, Lisa J., Egitto, Frank D., Matienzo, Luis J., Logan, Paul E., and Seman, Andrew M., "Aluminum Thick-Metal-Backed Circuits: Conductive Adhesive Technology," 1996 Proceedings 46th Electronic Components & Technology Conference , Orlando, FL, May 28-31, 1996, pp. 588-598.

Lihl, F., "On the Cause of Tin Decay in the Sarcophagi of the "Kapuzinergruft"," Studies in Conservation, vol. 7 no. 3, pp. 88-106, Aug. 1962.

Lihua, Liang, Xuefan, Chen, Qiang, Wang, Fei, Liu, Liu, Yong, Irving, Scott, and Luk, Timwah, "Characterization of Dynamic Behavior of Pb-Free Material 95.7Sn3.8Ag0.5Cu and Its Determination of Dynamic Constitutive Model Parameters," International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, Freiburg, Germany, Apr. 20-23, 2008, pp. xx-xx.

Lijten, G. F. C. M., Van Noort, H. M., and Beris, P. J. M., "Durability of Anisotropically Conductive Adhesive Joints in Surface Mount Applications and in Flexible to Rigid Board Interconnection," Journal of Electronics Manufacturing, vol. 5 no. 4, pp. 253-261, Dec. 1995.

Lili, Ma, and Hang, Chen, "Effect of Resin Content on PCB Warpage and Anti-shock Performance of BGA Solder Joint," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 683-685.

Lilley, Roger, "Solving the Plumbum (Pb) conundrum," EngineerIT, pp. 53-54, July 2006.

Lillie, Edwin, Sandborn, Peter, and Humphrey, David, "Assessing the value of a lead-free solder control plan using cost-based FMEA," Microelectronics Reliability, vol. 55 no. 6, pp. 969-979, May 2015.

Lim, B. K., Poh, Francis K. S., Chong, Desmond Y. R., and Koh, S. W., "Improving the Reliability of Quad Flat No-Lead Packages through Test & Structural Optimization," 2004 6th International Conference on Electronic Packaging Technology, Singapore, Dec. 8-10, 2004, pp. 197-204.

Lim, Crosby, Ping, Zhan, and Ming, Xue, "Failure Characterization of BGA Solder Joint Fracture during Field Application," 2010 12th Electronics Packaging Technology Conference , Singapore, Dec. 8-10, 2010, pp. 556-559.

Lim, Gi-Tae, Kim, Byoung-Joon, Lee, Kiwook, Kim, Jaedong, Joo, Young-Chang, and Park, Young-Bae, "Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps," Journal of Electronic Materials, vol. 38 no. 11, pp. 2228-2233, Nov. 2009.

Lim, Hooi Peng, Ourdjini, Ali, Bakar, Tuty Asma Abu, and Tesfamichael, Tuquabo, "The effects of humidity on tin whisker growth by immersion tin plating and tin solder dipping surface finishes," Procedia Manufacturing, vol. 2, pp. 275-279, 2015. https://doi.org/10.1016/j.promfg.2015.07.048

Lim, Hooi Peng, Ourdjini, Ali, and Bakar, Tuty Asma Abu, "The Effects of Nickel Underlayer and Solder Dipping as Tin Whisker Mitigations in Tin Surface Finishes," Applied Mechanics and Materials , vol. 554, pp. 47-51, June 2014.

Lim, Hyung, "RoHS-compliant IC manufacturing reliability challenges industry," Electronic Products, vol. 48 no. 10, pp. 123-124, Mar. 2006.

Lim, J. H., Lee, K. W., Park, S. S., and Earmme, Y. Y., "Vapor Pressure Analysis Of Popcorn Cracking In Plastic IC Packages By Fracture Mechanics," Proceedings of 2nd Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 1998, pp. 36-42.

Lim, J. K., Russo, J. S., and Antonier, E., "Electroplated Palladium Coating As a Nickel Migration (Thermal) Barrier," Plating & Surface Finishing, vol. 83 no. 3, pp. 64-67, Mar. 1996.

Lim, Jongmin, and Lee, Chongmu, "The rf-power dependences of the deposition rate, the hardness and the corrosion-resistance of the chromium nitride film deposited by using a dual ion beam sputtering system," Materials Chemistry and Physics, vol. 95 no. 1, pp. 164-168, Jan. 10, 2006.

Lim, Seong-Rin, Kang, Daniel, Ogunseitan, Oladele A., and Schoenung, Julie M., "Potential Environmental Impacts from the Metals in Incandescent, Compact Fluorescent Lamp (CFL), and Light-Emitting Diode (LED) Bulbs," Environmental Science & Technology, vol. 47 no. 2, pp. 1040-1047, Jan. 15, 2013.

Lim, Seong-Rin, and Schoenung, Julie M., "Toxicity potentials from waste cellular phones, and a waste management policy integrating consumer, corporate, and government responsibilities," Waste Management, vol. 30 no. 8-9, pp. 1653-1660, Aug.-Sept. 2010.

Lim, Sharon Pei-Siang, Rao, Vempati Srinivasa, Hnin, Wai Yin, Ching, Wai Leong, Kripesh, Vaidyanathan, Lee, Charles, Lau, John, Milla, Juan, and Fenner, Andy, "Process Development and Reliability of Microbumps," IEEE Transactions on Components and Packaging Technologies, vol. 33 no. 4, pp. 747-753, Dec. 2010.

Lim, Shu Lee, and Dobriyal, Priyanka, "Board Level Failure Analysis and Demount Challenges for Package on Package," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. xx-xx.

Lim, Shu Min, Chen, Zhong, Ng, Hun Shen, Tee, Tong Yan, Khoo, Choong Peng, Chng, Vincent, Liu, Fu Lin, and Tsai, Kuo Tsing, "Development of High Speed Board Level Bend Tester for Drop Impact Applications," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 244-248.

Lim, Sze-Pei, "Challenges in Material Selection for SiP Applications," Pan Pacific Symposium 2018 Proceedings, Kamuela, HI, Feb. 5-8, 2018, pp. xx-xx.

Lim, Teck Siang, Cheong, C. H., and Tan, S. H., "Solder Extrusion Solution and Mold Adhesion to Die Surface Improvement with PI Isolation Design for FCOL Exposed Die Technology," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 472-476.

Lim, W. K. Patrick, Mariatti, M, Chow, W. S., and Mar, K. T., "Halogen Free Flame Retardants for Epoxy Substrate in Electronic Applications," 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Melaka, Malaysia, Nov. 30-Dec. 2, 2010, pp. xx-xx.

Lima, M. S. F., Riva, R., Destro, M. G., Santo, A. M. E., Silva Jr., R. A., and Guimaraes, S. M., "Characterization of a laser-soldered avionic component using lead-free paste," Optics and Laser Technology, vol. 41 no. 2, pp. 159-164, Mar. 2009.

Limaye, Paresh, Lambrinou, Konstantina, Vandevelde, Bart, Vandepitte, Dirk, Verlinden, Bert, Allaert Bart, and Hillaert, Joost, "Crack Growth Analysis of Lead Free Passive Component Assemblies," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 774-782.

Limaye, Paresh, Vandevelde, Bart, Vandepitte, Dirk, and Verlinden, Bert, "An Integrated Creep, Crack Growth and Thermo-mechanical Fatigue Model for WLCSP Assemblies Soldered with SAC 405," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 704-712.

Limaye, Paresh, Vandevelde, Bart, Vandepitte, Dirk, and Verlinden, Bert, "Crack Growth Rate Measurement and Analysis for WLCSP Sn-Ag-Cu Solder Joints," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 371-377.

Limaye, Paresh, Vandevelde, Bart, Vandepitte, Dick, and Verlinden, Bert, "Crack Growth Rate Measurement and Analysis for WLCSP SnAgCu Solder Joints," Circuits Assembly, vol. 17 no. 2, pp. 68-74, Feb. 2006.

Limaye, Paresh, Labie, Riet, Vandevelde, Bart, Vandepitte, Dirk, and Verlinden, Bart, "Creep Behavior of Mixed SAC 405/SnPb Soldered Assemblies in Shear Loading," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 703-712.

Limaye, Paresh, Vandevelde, Bart, Labie, Riet, Vandepitte, Dirk, and Verlinden, Bert, "Influence of Intermetallic Properties on Reliability of Lead-Free Flip-Chip Solder Joints," IEEE Transactions on Advanced Packaging, vol. 31 no. 1, pp. 51-57, Feb. 2008.

Limaye, Paresh, Maurissen, Wout, Lambrinou, Konstantina, Duflos, Frederic, Vandevelde, Bart, Allaert, Bart, Hillaert, Joost, Vandepitte, Dirk, and Verlinden, Bert, "Low-Temperature Embrittlement of Lead-Free Solders in Joint Level Impact Testing," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 140-151.

Limaye, Paresh, Vandevelde, Bart, Van de Peer, Joost, Donders, Stijn, and Darveaux, Robert, "Probabilistic Design Approach for Package Design and Solder Joint Reliability Optimization for a Lead Free BGA Package," Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, Apr. 18-20, 2005, pp. 531-537.

Limborco, H., Salome, P. M. P., Stroppa, D., Andrade, R-Ribeiro, Teixeira, J. P., Nicoara, N., Abderrafi, K., Leitao, J. P., Gonzalez, J. C., and Sadewasser, S., "Growth of CuInSe2 nanowires without external catalyst by molecular beam epitaxy," 2016 IEEE 43rd Photovoltaic Specialists Conference, Portland, OR, June 5-10, 2016, pp. 2803-2806.

Limborco, H., Salome, P. M. P., Stroppa, D., Andrade, R-Ribeiro, Teixeira, J. P., Nicoara, N., Abderrafi, K., Leitao, J. P., Gonzalez, J. C., and Sadewasser, S., "Growth of CuInSe2 nanowires without external catalyst by molecular beam epitaxy," 2017 IEEE 44th Photovoltaic Specialist Conference, Washington, DC, June 25-30, 2017, pp. xx-xx.

Lin, Benson, and Gregorich, Tom, "Design and Characterization of a Copper-Pillar Flip Chip Test Vehicle for Small Form-Factor Packages Using 28nm ELK Die and Bump-On-Trace (BOT)," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 218-221.

Lin, C. H., Yeh, C. Y., and Yen, Y. W., "Interfacial Reactions between Sn and Au-xCu Alloys," 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Nagasaki, Japan, Apr. 17-21, 2018, pp. 59-64.

Lin, C. K., Chen, Chih, Chang, Shyh-Ming, An, Chao-Chyun, Lee, Hsiao Ting, Kao, Kuo-Shu, Tsang, Jimmy, and Yang, Sheng-Shu, "Electrical characterization of fine-pitch compliant bumps," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 608-612.

Lin, C. K., Liu, Chien-Ming, and Chen, Chih, "Formation of Sn-rich phases via the decomposition of Cu6Sn5 compounds during current stressing," Materials Letters, vol. 124, pp. 261-263, June 1, 2014.

Lin, C. Y., Chen, Y. R., Shen, G. S., Liu, D. S., Kuo, C. Y., and Hsu, C. L., "Failure Mode Analysis of Lead-free Solder Joints under Differential Reflow Profiles by High Speed Impact Testing," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Lin, C. Y., Mohanty, U. S., and Chou, J. H., "High temperature synthesis of Sn-3.5Ag-0.5Zn alloy nanoparticles by chemical reduction method," Journal of Alloys and Compounds, vol. 501 no. 2, pp. 204-210, July 9, 2010.

Lin, C. Y., Chen, Y. R., Shen, G. S., Liu, D. S., Kuo, C. Y., and Hsu, C. L., "Mechanical Behavior of Lead-Free Solder Joints under High Speed Shear Test at Different Pad Metallization Substrate," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 120-123.

Lin, C. Y., Chou, J. H., Lee, Y. G., and Mohanty, U. S., "Preparation of Sn-3.5Ag nano-solder by supernatant process," Journal of Alloys and Compounds, vol. 470 no. 1-2, pp. 328-331, Feb. 20, 2009.

Lin, C. Y., Mohanty, U. S., and Chou, J. H., "Synthesis and characterization of Sn-3.5Ag-XZn alloy nanoparticles by the chemical reduction method," Journal of Alloys and Compounds, vol. 472 no. 1-2, pp. 281-285, Mar. 20, 2009.

Lin, Chao-Ming, Chang, Win-Jin, and Fang, Te-Hua, "Analysis of New Anisotropic Conductive Film (ACF)," IEEE Transactions on Device and Materials Reliability, vol. 5 no. 4, pp. 694-700, Dec. 2005.

Lin, Chao-Ming, "Effects of Pad Array Dimensions and Misalignment Offsets on Optimal Fraction of Conductive Particles in Anisotropic Conductive Film Packages," IEEE Transactions on Device and Materials Reliability, vol. 3 no. 1, pp. 301-309, Mar. 2013.

Lin, Chao-Ming, "Effects of Systematic and Stochastic Errors on Estimated Failure Probability of Anisotropic Conductive Film," IEEE Transactions on Device and Materials Reliability, vol. 7 no. 3, pp. 387-398, Sept. 2007.

Lin, Chao-Ming, Lin, Tzu-Chao, and Liu, Yen-Chun, "Electric conduction failure of ACF packages based on pad array aspect ratio consideration," Microsystem Technologies, vol. 22 no. 12, pp. 2883-2891, Dec. 2016.

Lin, Chao-Ming, "Estimation of ACF packaging failure probability for IC/substrate assemblies with different pad array dimensions," Journal of Materials Science: Materials in Electronics, vol. 25 no. 2, pp. 618-626, Feb. 2014.

Lin, Chao-Ming, Tan, Chung-Ming, Tsai, Tsung-Hsun, and Liu, Yen-Chun, "Failure Analysis of Anisotropic Conductive Film Packages With Misalignment Offsets," IEEE Transactions on Device and Materials Reliability, vol. 10 no. 1, pp. 9-17, Mar. 2010.

Lin, Chao-Ming, Lin, Tzu-Chao, Fang, Te-Hua, and Chao, Kuo-Sheng, "Failure analysis of pad-height effects in the fine-pitch interconnection of the anisotropic conductive films," Microelectronics Reliability, vol. 48 no. 7, pp. 1087-1092, July 2008.

Lin, Chao-Ming, Lin, Tzu-Chao, Fang, Te-Hua, and Liu, Yen-Chun, "Failure Probability Estimation of Anisotropic Conductive Film Packages With Asymmetric Upper-to-Lower Pad Size and Misalignment Offsets," IEEE Transactions on Device and Materials Reliability, vol. 11 no. 3, pp. 368-377, Sept. 2011.

Lin, Chao-Ming, Chen, Yung-Lung, and Chu, Hsaio-Ming, "Modeling of real-time reliability prediction system for anisotropic conductive film (ACF) processing," Materials Science and Engineering: A , vol. 432 no. 1-2, pp. 239-244, Sept. 25, 2006.

Lin, Chao-Ming, Chi, Mao-Chieh, and Liu, Yen-Chun, "Random dispersion effects of conductive particles on anisotropic conductive film’s (ACF's) bonding yield," Microsystem Technologies, vol. 24 no. 1, pp. 49-53, Jan. 2018.

Lin, Chao-Ming, Chang, Win-Jin, and Fang, Te-Hua, "Reliability analysis of the fine pitch connection using anisotropic conductive film (ACF)," Microelectronics Journal, vol. 37 no. 7, pp, 565-568, July 2006.

Lin, Chao-Ming, Su, Ming-Horng, and Chang, Win-Jin, "The Prediction of Failure Probability in Anisotropic Conductive Adhesive (ACA)," IEEE Transactions on Device and Materials Reliability, vol. 5 no. 2, pp. 255-261, June 2005.

Lin, Chi-Pu, Chen, Chih-Ming, and Yen, Yee-Wen, "Enhanced growth of the Cu6Sn5 phase in the Sn/Ag/Cu and Sn/Cu multilayers subjected to applied strain," Journal of Alloys and Compounds, vol. xx, pp. xx-xx, xxxx.

Lin, Chi-Pu, Chen, Chih-Ming, Lin, Ching-Hsuan, and Su, Wen-Chiung, "Interfacial reactions of Sn/Ag/Cu tri-layer on a deformed polyimide substrate," Journal of Alloys and Compounds, vol. xxx no. x, pp. xx-xx, xxxx.

Lin, Chi-pu, and Chen, Chih-ming, "Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board," Journal of Electronic Materials, vol. 38 no. 6, pp. 908-914, June 2009.

Lin, Chi-Pu, and Chen, Chih-Ming, "Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations," Microelectronics Reliability, vol. 52 no. 2, pp. 385-390, Feb. 2012.

Lin, Chi-Pu, and Chen, Chih-Ming, "The cross-interactions in the Ni/Sn/Cu diffusion couples with an electroless palladium surface finish," Journal of Alloys and Compounds, vol. 547, pp. 37-42, Jan. 15, 2013.

Lin, Chien-Tai, and Lin, Kwang-Lung, "Contact angle of 63Sn-37Pb and Pb-free solder on Cu plating," Applied Surface Science, vol. 214 no. 1-4, pp. 243-258, May 31, 2003.

Lin, Chih-Fan, Lee, Shang-Hua, and Chen, Chih-Ming, "Effect of Sn Grain Orientation on the Cu6Sn5 Formation in a Sn-Based Solder Under Current Stressing," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 43 no. 8, pp. 2571-2573, Aug. 2012.

Lin, Chih-Fan, Hau, Nga Yu, Huang, Yu-Ting, Chang, Ya-Huei, Feng, Shien-Ping, and Chen, Chih-Ming, "Synergetic effect of Bi2Te3 alloys and electrodeposition of Ni for interfacial reactions at solder/Ni/Bi2Te3 joints," Journal of Alloys and Compounds, vol. 708, pp. 220-230, June 25, 2017.

Lin, Chih-Hao, Chen, Sinn-Wen, and Wang, Chao-Hong, "Phase Equilibria and Solidification Properties of Sn-Cu-Ni Alloys," Journal of Electronic Materials, vol. 31 no. 9, pp. 907-915, Sept. 2002.

Lin, Chih-Kuang, and Teng, Hsuan-Yu, "Creep properties of Sn-3.5Ag-0.5Cu lead-free solder under step-loading," Journal of Materials Science: Materials in Electronics, vol. 17 no. 8, pp. 577-586, Aug. 2006.

Lin, Chih-Kuang, and Chu, De-You, "Creep rupture of lead-free Sn-3.5Ag and Sn-3.5Ag-0.5Cu solders," Journal of Materials Science: Materials in Electronics, vol. 16 no. 6, pp. 355-365, June 2005.

Lin, Chih-Kuang, and Lin, Tung-Hsien, "Effects of continuously applied stress on tin whisker growth," Microelectronics Reliability, vol. 48 no. 10, pp. 1737-1740, Oct. 2008.

Lin, Chih-Kuang, and Huang, Chun-Ming, "Effects of Strain Ratio and Tensile Hold Time on Low-Cycle Fatigue of Lead-Free Sn-3.5Ag-0.5Cu Solder," Journal of Electronic Materials , vol. 35 no. 2, pp. 292-301, Feb. 2006.

Lin, Ching-Chieh, Juo, Tsang-Jin, Chen, Ying-Jie, Chiou, Chwei-Huann, Wang, Hong-Wen, and Liu, Ying-Ling, "Enhanced cyclic voltammetry using 1-D gold nanorods synthesized via AAO template electrochemical deposition," Desalination, vol. 233 no. 1-3, pp. 113-119, Dec. 15, 2008.

Lin, Ching-Tsung, Hsi, Chi-Shiung, Wang, Moo-Chin, Chang, Tao-Chih, and Liang, Ming-Kann, "Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards," Journal of Alloys and Compounds, vol. 459 no. 1-2, pp. 225-231, July 14, 2008.

Lin, Ching-Tsung, Hsi, Chi-Shiung, Chang, Tao-Chih, and Liang, Ming-Kann, "Solder joint strengths and interfacial reactions in various Pb-free solder joints," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 58-61.

Lin, Chung-Yung, Lee, Chiapyng, Liu, Xingjun, and Yen, Yee-Wen, "Phase equilibria of the Sn-Sb-Ag ternary system and interfacial reactions at the Sn-Sb/Ag joints at 400 °C and 150 °C," Intermetallics, vol. 16 no. 2, pp. 230-238, Feb. 2008.

Lin, Chung-Yung, Jao, Chien-Chung, Lee, Chiapyng, and Yen, Yee-Wen, "The effect of non-reactive alloying elements on the growth kinetics of the intermetallic compound between liquid Sn-based eutectic solders and Ni substrates," Journal of Alloys and Compounds, vol. 440 no. 1-2, pp. 333-340, Aug. 16, 2007.

Lin, D. C., Kovacevic, R., Srivatsan, T. S., and Wang, G. X., "A study aimed at characterizing the interfacial structure in a tin-silver solder on nickel-coated copper plate during aging," Sadhana - Academy Proceedings in Engineering Sciences, vol. 33 no. 3, pp. 251-259, June 2008.

Lin, D. C., Srivatsan, T. S., Wang, G-X., and Kovacevic, R., "Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder," Journal of Materials Engineering and Performance, vol. 16 no. 5, pp. 647-654, Oct. 2007.

Lin, D. C., Kuo, C. Y., Srivatsan, T. S., Petraroli, M., and Wang, G. X., "Synthesis and Characterization of Nano-Composite Lead-Free Solder," Journal of Metastable and Nanocrystalline Materials, vol. 23, pp. 145-150, 2005.

Lin, Deqiang, and Qiu, Keqiang, "Recycling of waste lead storage battery by vacuum methods," Waste Management, vol. 31 no. 7, pp. 1547-1552, July 2011.

Lin, Elaine, Jiang, Qian, and Dasgupta, Abhijit, "Effect of Isothermal Aging on Harmonic Vibration Durability of SAC305 Interconnects," 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 31-June 3, 2016, pp. 761-765.

Lin, Eric, "Anti-CAF "Conductive Anodic Filament" CCL Material," Nan Ya Plastics.

Lin, Fei, Bi, Wenzhen, Ju, Guokui, Wang, Wurong, and Wei, Xicheng, "Evolution of Ag3Sn at Sn-3.0Ag-0.3Cu-0.05Cr/Cu joint interfaces during thermal aging," Journal of Alloys and Compounds, vol. 509 no. 23, pp. 6666-6672, June 9, 2011.

Lin, Fei, Bi, Wenzhen, Ju, Guokui, Xie, Shifang, and Wei, Xicheng, "Microstructure and mechanical properties of Sn3Ag0.5Cu3Bi0.05Cr/Cu joints," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 395-399.

Lin, Grace, "Compliance guidelines for China RoHS," Interference Technology EMC Directory & Design Guide 2007, pp. 80-84, 2007.

Lin, Han-wen, Chen, Chih, Kuo, J. C., and Chen, C. C., "Effects of electromigration on grain rotation behavior of SnAg solders," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 166-168.

Lin, Han-wen, Lu, Jia-ling, Liu, Chien-min, Chen, Chih, Tu, King-ning, Chen, Delphic, and Kuo, Jui-Chao, "Microstructure Control of Uni-directional Growth of n-Cu6Sn5 in Microbumps on (111) Oriented and Nanotwinned Cu," 18th Annual Pan Pacific Microelectronics Symposium, Wailea-Makena, HI, Jan. 22-24, 2013, pp. xx-xx.

Lin, Han-wen, Lu, Jia-ling, Liu, Chen-min, Chen, Chih, Tu, King-ning, Chen, Delphic, and Kuo, Jui-Chao, "The preferential growth of n-Cu6Sn5 on (111) uni-directional Cu pads," 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 24-26, 2012, pp. 90-93.

Lin, Heng-Cheng, Kung, Chieh, Chen, Rong-Sheng, and Liang, Gin-Tiao, "An Optimization Analysis of UBM Thicknesses and Solder Geometry on A Wafer Level Chip Scale Package Using Robust Methods," Computers, Materials and Continua, vol. 3 no. 2, pp. 55-64, 2006.

Lin, Heng Cheng, Kung, Chieh, and Chen, Rong Shen, "Taguchi Robust Analysis of Fatigue of Lead-Free Sn3.5ag Solders," Proceedings of the ASME InterPack Conference, Volume 1, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 581-590.

Lin, Horng-Chih, and Su, Chun-Jung, "High-Performance Poly-Si Nanowire NMOS Transistors," IEEE Transactions on Nanotechnology, vol. 6 no. 2, pp. 206-212, Mar. 2007.

Lin, Horng-Chih, Liu, Ta-Wei, Hsu, Hsing-Hui, Lin, Chuan-Ding, and Huang, Tiao-Yuan, "Trigated Poly-Si Nanowire SONOS Devices for Flat-Panel Applications," IEEE Transactions on Nanotechnology, vol. 9 no. 3, pp. 386-391, May 2010.

Lin, Hsin-fu, and Chen, Chih-chi, "Formation of a Metastable Phase at the Interface Between Sn and Ag-Pd Substrates During Liquid-State Reaction," Journal of Electronic Materials, vol. 43 no. 11, pp. 4275-4281, Nov. 2014.

Lin, Hsin-fu, Chang, Ya-chun, and Chen, Chih-chi, "Sn-Zn/Ni-Co Interfacial Reactions at 250°C," Journal of Electronic Materials, vol. 43 no. 9, pp. 3333-3340, Sept. 2014.

Lin, Hsiu-Jen, and Chuang, Tung-Han, "Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints," Journal of Electronic Materials , vol. 39 no. 2, pp. 200-208, Feb. 2010.

Lin, Hsiu-Jen, and Chuang, Tung-Han, "Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn-3Ag-0.5Cu solder joints," Journal of Alloys and Compounds, vol. 500 no. 2, pp. 167-174, June 25, 2010.

Lin, Hsiu-Jen, Lin, Jian-Shian, and Chuang, Tung-Han, "Electromigration of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads," Journal of Alloys and Compounds , vol. 487 no. 1-2, pp. 458-465, Nov. 13, 2009.

Lin, Hsiu-Jen, and Chuang, Tung-Han, "Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish," Microelectronics Reliability, vol. 51 no. x, pp. 445-452, 2011.

Lin, Hsiu-Jen, and Chuang, Tung-Han, "Intermetallic Reactions in Reflowed and Aged Sn-9Zn Solder Ball Grid Array Packages with Au/Ni/Cu and Ag/Cu Pads," Journal of Electronic Materials , vol. 35 no. 1, pp. 154-164, Jan. 2006.

Lin, Hsiu-Jen, and Chuang, Tung-Han, "The effect of 0.5 wt.% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads," Materials Letters , vol. 64 no. 4, pp. 506-509, Feb. 28, 2010.

Lin, Hsiu-Min, Duh, Jenq-Gong, and Tsai, Su-Yueh, "Employment of Sputtered Ni-Zn Films for Under Bump Metallization with Sn-3.0Ag-0.5Cu Solder Attached during Liquid Reactions," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 361-365.

Lin, Hsiu-Min, Ho, Cheng-Ying, Chen, Wen-Lin, Wu, Yi-Hsin, Wang, De-Hui, Lin, Jun-Ren, Wu, Yu-Hui, Hong, Huei-Cheng, Lin, Zhi-Wei, and Duh, Jenq-Gong, "Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test," Microelectronics Reliability, vol. 55 no. 1, pp. 231-237, Jan. 2015.

Lin, Huang, Liangjie, Zhou, Hui, Liu, Fengshun, Wu, Weisheng, Xia, Hongzhi, Fu, Shiyu, Wang, and Zhe, Liu, "Mechanical Property and Reliability of Anisotropic Conductive Adhesive in surface mount applications," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 839-842.

Lin, Huang-Kai, Tzeng, Yu-Fen, Wang, Chia-Hsin, Tai, Nyan-Hwa, Lin, I-Nan, Lee, Chi-Young, and Chiu, Hsin-Tien, "Ti5Si3 Nanowire and Its Field Emission Property," Chemistry of Materials, vol. 20 no. 7, pp. 2429-2431, Apr. 1, 2008.

Lin, Hung Tse, Lin, Ching Hsuan, and Hu, Yu Ming, "An Approach to Develop High-Tg Epoxy Resins for Halogen-Free Copper Clad Laminates," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Lin, Jeng-Chi, Liang, Chien-Lung, and Lin, Kwang-Lung, "Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders," Materials Science and Engineering: A, Structural Materials, vol.765, pp. 138323-1-138323-12, Sept. 23, 2019. https://doi.org/10.1016/j.msea.2019.138323

Lin, Jian, Lei, Yongping, Wu, Zhongwei, and Yin, LanLi, "Comparison Investigation of Thermal Fatigue and Mechanical Fatigue Behavior of Board Level Solder Joint," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 1179-1182.

Lin, Jian, Lei, Yongping, Fu, Hanguang, and Guo, Fu, "Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints," Journal of Electronic Materials, vol. 47 no. 3, pp. 2073-2081, Mar. 2018.

Lin, Jian, Gao, Peng, Lei, Yongping, and Wang, Lan, "Inelastic Strain Evolution in Solder Joint under Thermal-mechanical Coupled Fatigue Loading," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 937-940.

Lin, Jian, Lei, Yongping, Zhao, Haiyan, Wu, Zhongwei, and Lu, Li, "Investigation on Failure Behaviour of Solder Joint during Thermal Fatigue," 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 6-10, 2009, pp. 455-459.

Lin, Jian-Yang, Hsueh, Yu-Lee, Huang, Jung-Jie, and Wu, Jia-Rung, "Effect of silver nitrate concentration of silver nanowires synthesized using a polyol method and their application as transparent conductive films," Thin Solid Films, vol. 584, pp. 243-247, June 1, 2015.

Lin, Jong-Kai, De Silva, Ananda, Frear, Darrel, Guo, Yifan, Jang, Jin-Wook, Li, Li, Mitchell, Diane, Yeung, Betty, and Zhang, Charles, "Characterization of Lead-Free Solders and Under Bump Metallurgies for Flip-Chip Package," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 455-462.

Lin, Jong-Kai, De Silva, Ananda, Frear, Darrel, Guo, Yifan, Hayes, Scott, Jang, Jin-Wook, Li, Li, Mitchell, Dianne, Yeung, Betty, and Zhang, Charles, "Characterization of Lead-Free Solders and Under Bump Metallurgies for Flip-Chip Package," IEEE Transactions on Electronics Packaging Manufacturing, vol. 25 no. 4, pp. 300-307, Oct. 2002.

Lin, Jong-Kai, Drye, James, Lytle, William, Scharr, Thomas, Subrahmanyan, Ravi, and Sharma, Ravi, "Conductive Polymer Bump Interconnects," 1996 Proceedings 46th Electronic Components & Technology Conference, Orlando, FL, May 28-31, 1996, pp. 1059-1068.

Lin, Jong-Kai, Jang, Jin-Wook, Hayes, Scott, and Frear, Darrel, "Lead-free Flip Chip Interconnect Reliability for DCA and FC-PBGA Packages," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 642-649.

Lin, Jui-Ching, Qin, Yi, and Woertink, Julia, "Investigation of the Growth of Intermetallic Compounds Between Cu Pillars and Solder Caps," Journal of Electronic Materials, vol. 43 no. 11, pp. 4134-4145, Nov. 2014.

Lin, K. S., Huang, H. Y., and Chou, C. P., "Interfacial reaction between Sn-1Ag-0.5Cu(-Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction," Journal of Alloys and Compounds, vol. xxx no. xxx, pp. xx-xx, xxxx.

Lin, K. S., Huang, H. Y., and Chou, C. P., "Interfacial Reactions and Bonding Strength of Sn-xAg-0.5Cu/Ni BGA Solder Joints," Journal of Materials Engineering and Performance, vol. 18 no. 2, pp. 182-189, Mar. 2009.

Lin, Kae-Long, "The effect of heating temperature of thin film transistor-liquid crystal display (TFT-LCD) optical waste glass as a partial substitute partial for clay in eco-brick," Journal of Cleaner Production, vol. 15 no. 18, pp. 1755-1759, Dec. 2007.

Lin, Keh Wen, "The features comparison for various measurement of Organic Solderability Preservatives (OSP) thickness and discussion for copper roughness effect caused by various type micro-etching solutions," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 229-233.

Lin, Kung-Liang, Chang, Edward-Yi, and Shih, Lin-Chi, "Evaluation of Cu-bumps with lead-free solders for flip-chip package applications," Microelectronic Engineering, vol. 86 no. 12, pp. 2392-2395, Dec. 2009.

Lin, Kwang-Lung, Chen, Kang-I, and Shi, Po-Cheng, "A Potential Drop-In Replacement for Eutectic Sn-Pb Solder? The Sn-Zn-Ag-Al-Ga Solder," Journal of Electronic Materials, vol. 32 no. 12, pp. 1490-1495, Dec. 2003.

Lin, Kwang-Lung, Chen, Wei-Liang, and Hwang, Charles, "Bonding and Failure Behaviors of ACA Flip Chip Bumps," The International Journal of Microcircuits and Electronic Packaging, vol. 25 no. 1, pp. 119-127, First Quarter 2002.

Lin, Kwang-Lung, and Sun, Li-Min, "Electrodeposition of eutectic Sn-Zn alloy by pulse plating," Journal of Materials Research, vol. 18 no. 9, pp. 2203-2207, Sept. 2003.

Lin, Kwang-Lung, and Fang, Yen-Hsiang, "Electromigration of Sn-9Zn Solder in Contact with Cu," Proceedings 9th International Symposium on Advanced Packaging Materials, 2004, pp. 17-20.

Lin, Kwang-Lung, and Shih, Po-Cheng, "IMC formation on BGA package with Sn-Ag-Cu and Sn-Ag-Cu-Ni-Ge solder balls," Journal of Alloys and Compounds, vol. 452 no. 2, pp. 291-297, Mar. 20, 2008.

Lin, Kwang-Lung, Chen, Kang-I Chen, Hsu, Hui-Min Hsu, and Shi, Chia-Ling, "Improvement in the Properties of Sn-Zn Eutectic Based Pb-free Solder," 2003 Proceedings 53rd Electronic Components & Technology Conference , New Orleans, LA, May 27-30, 2003, pp. 658-663.

Lin, Kwang-Lung, and Hsu, Hui-Min, "Materials Interaction between Inherent Barrier Pb-free Sn-Zn-Al Solder and Cu Contact," International Symposium on Electronic Materials and Packaging , Hong Kong, China, Nov. 30-Dec. 2, 2000, pp. 378-382.

Lin, Kwang-Lung, Hsiao, Chih-Chun, and Chen, Kaug-I, "Microstructural evolution of Sn-Ag-Cu-Al solder with respect to Al content and heat treatment," Journal of Materials Research, vol. 17 no. 9, pp. 2386-2393, Sept. 2002.

Lin, Kwang-Lung, and Shih, Chia-Ling, "Microstructure and Thermal Behavior of Sn-Zn-Ag Solders," Journal of Electronic Materials, vol. 32 no. 12, pp. 1496-1500, Dec. 2003.

Lin, Kwang-Lung, and Hsu, Hui-Min, "Sn-Zn-Al-Pb-free Solder--An Inherent Barrier Solder for Cu Contact," Journal of Electronic Materials, vol. 30 no. 9, pp. 1068-1072, Sept. 2001.

Lin, Kwang-Lung, and Chiu, Ying-Ta, "The Bonding of Sn-Zn-Ag-Al-Ga Lead-Free Solder Balls on Cu/Ni-P/Au BGA Substrate," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 692-695.

Lin, Kwang-Lung, and Chen, Chun-Jen, "The Effect of Flux on the Wetting of Autocatalytic Ni-Cu-P by In-Sn Solder," The International Journal of Microcircuits and Electronic Packaging , vol. 22 no. 2, pp. 115-120, Second Quarter 1999.

Lin, Kwang-Lung, and Liu, Tzy-Pin, "The electrochemical corrosion behaviour of Pb-free Al-Zn-Sn solders in NaCl solution," Materials Chemistry and Physics, vol. 56 no. 2, pp. 171-176, Oct. 1998.

Lin, Kwang-Lung, and Kuo, Shi-Ming, "The Electromigration and Thermomigration Behaviors of Pb-Free, Flip-Chip Sn-3Ag-0.5Cu Solder Bumps," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 667-672.

Lin, Kwang-Lung, and Lin, Ger-Pin, "The Electromigration Investigation on the Newly Developed Pb-free Sn-Zn-Ag-Al-Ga Solder Ball Interconnect," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1467-1471.

Lin, Kwang-Lung, Chen, Wei-Liang, Hou, Chen-Chi, Chow, Hubert K., and Tu, Chun-Te, "The Interaction of Sn-Ag and Sn-Ag-Cu Solder Balls with BGA Bond Pad," 2000 Lead Free Symposium Conference Proceedings, 2000, pp. xx-xx.

Lin, Kwang-Lung, Lin, Yu-Wei, and Yu, Chang-Ho, "The Interphases Formed During the Very Early Stage Liquid Solder/Metal Substrate Interaction of the Soldering Process," JOM, vol. 64 no. 10, pp. 1184-1189, Oct. 2012.

Lin, Kwang-Lung, Wen, Li-Hsiang, and Liu, Tzy-Pin, "The Microstructures of the Sn-Zn-Al Solder Alloys," Journal of Electronic Materials, vol. 27 no. 3, pp. 97-105, Mar. 1998.

Lin, Kwang-Lung, Chung, Fu-Chih, and Liu, Tzy-Pin, "The potentiodynamic polarization behavior of Pb-free XIn-9(5Al-Zn)-YSn solders," Materials Chemistry and Physics, vol. 53 no. 1 , pp. 55-59, Apr. 1998.

Lin, Kwang-Lung, and Wen, Li-Hsiang, "The wetting of copper by Al-Zn-Sn solders," Journal of Materials Science: Materials in Electronics, vol. 9 no. 1, pp. 5-8, Feb. 1998.

Lin, Kwang-Lung, and Shih, Chia-Ling, "Wetting Interaction between Sn-Zn-Ag Solders and Cu," Journal of Electronic Materials, vol. 32 no. 2, pp. 95-100, Feb. 2003.

Lin, Kwang Lung, Liu, Pei Chi, and Song, Jenn Ming, "Wetting Interaction between Pb-free Sn-Zn Series Solders and Cu, Ag Substrates," 54th Electronic Components & Technology Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1310-1313.

Lin, Kwang-Lung, and Wang, Yu-Chien, "Wetting Interaction of Pb-Free Sn-Zn-Al Solders on Metal Plated Substrate," Journal of Electronic Materials, vol. 27 no. 11, pp. 1205-1210, Nov. 1998.

Lin, Larry, Tsai, Yu-Ling, Chou, Tulip, Su, Ray, Lu, Gary, Wu, Max K. C., Pan, H. Y., Pu, H. P., Hsieh, Roger, and Wu, Kenneth, "Second-Level Interconnects Reliability for Large-die Flip Chip Lead-Free BGA Package in Power Cycling and Thermal Cycling Tests," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 921-926.

Lin, Li-Wei, Song, Jenn-Ming, Lai, Yi-Shao, Chiu, Ying-Ta, and Lee, Ning-Cheng, "Alloying Design of Sn-Ag-Cu Solders for the Improvement in Drop Test Performance," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 33-36.

Lin, Li-Wei, Song, Jenn-Ming, Lai, Yi-Shao, Chiu, Ying-Ta, Lee, Ning-Cheng, and Uan, Jun-Yen, "Alloying modification of Sn-Ag-Cu solders by manganese and titanium," Microelectronics Reliability, vol. 49 no. 3, pp. 235-241, Mar. 2009.

Lin, Neal, "Restricted Substance Management," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Lin, Qi, Jie, Zhao, Lai, Wang, Shuangqi, Han, "Effect of Bi on The Microstructure Evolution Of Sn-3Ag-0.5Cu/Cu Solder Joint," Fifth International Conference on Electronic Packaging Technology Proceedings, Shanghai, China, Oct. 28-30, 2003, pp. 265-269.

Lin, Qiaoli, Li, Fuxiang, and Wang, Jianbin, "Wetting of Sn/Cu and Sn/Cu-Sn IMCs at 623-723K," Journal of Alloys and Compounds, vol. 767, pp. 877-882, Oct. 30, 2018.

Lin, Ren-Jen, Hsu, Yung-Yu, Fan, Rong-Chang, Chen, Yu-Chih, Cheng, Syh-Yuh, Huang, Chao-Ta, and Uang, Ruoh-Huey, "Design of Nanowire Anisotropic Conductive Film for Ultra-fine Pitch Flip Chip Interconnection," 2004 6th International Conference on Electronic Packaging Technology, Singapore, Dec. 8-10, 2004, pp. 120-125.

Lin, Ren-Jen, Hsu, Yung-Yu, Chen, Yu-Chih, Cheng, Syh-Yuh, and Uang, Ruoh-Huey, "Fabrication of Nanowire Anisotropic Conductive Film for Ultra-fine Pitch Flip Chip Interconnection," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 1, Orlando, FL, May 31-June 3, 2005, pp. 66-70.

Lin, Shih-Hsun, and Ouyang, Fan-Yi, "Enhanced Electromigration Resistance of Pb-Free Solders by Using Cu/Sn Composite Structure," JOM, vol. 66 no. 11, pp. 2334-2339, Nov. 2014.

Lin, Shih-kang, Chung, Ting-ying, Chen, Sinn-wen, and Chang, Chih-horng, "250 °C isothermal section of ternary Sn-In-Cu phase equilibria," Journal of Materials Research, vol. 24 no. 8, pp. 2628-2637, Aug. 2009.

Lin, Shih-kang, Chen, Kuen-da, Chen, Hao, Liou, Wei-kai, and Yen, Yee-wen, "Abnormal spalling phenomena in the Sn-0.7Cu/Au/Ni/SUS304 interfacial reactions," Journal of Materials Research, vol. 25 no. 12, pp. 2278-2286, Dec. 2010.

Lin, Shih-kang, "Advanced Electronic Interconnection," JOM, vol. 71 no. 9, pp. 2996-2997, Sept. 2019.

Lin, Shih-kang, Nguyen, Trong Lan, Wu, Shu-chang, and Wang, Yu-hsiang, "Effective suppression of interfacial intermetallic compound growth between Sn-58 wt.% Bi solders and Cu substrates by minor Ga addition," Journal of Alloys and Compounds, vol. xxx, pp. xx-xx, xxxx.

Lin, Shih-Kang, Chang, Ru-Bo, Chen, Sinn-Wen, Tsai, Ming-Yueh, and Hsu, Chia-Ming, "Effects of zinc on the interfacial reactions of tin-indium solder joints with copper," Journal of Materials Science, vol. 49 no. 10, pp. 3805-3815, May 2014.

Lin, Shih-kang, Hsu, Che-wei, Chen, Sinn-wen, and Hsu, Chia-ming, "Interfacial reactions in Sn-20In-2.8Ag/Cu couples," Materials Chemistry and Physics, vol. 142 no. 1, pp. 268-275, Oct. 15, 2013.

Lin, Shih-Kang, and Chen, Sinn-Wen, "Interfacial reactions in the Sn-20 at. % In/Cu and Sn-20 at. % In/Ni couples at 160 °C," Journal of Materials Research, vol. 21 no. 7, pp. 1712-1717, July 2006.

Lin, Shih-Kang, Yang, Ching-Feng, Wu, Shyr-Harn, and Chen, Sinn-Wen, "Liquidus Projection and Solidification of the Sn-In-Cu Ternary Alloys," Journal of Electronic Materials, vol. 37 no. 4, pp. 498-506, Apr. 2008.

Lin, Shih-kang, Yorikado, Yuhi, Jiang, Junxiang, Kim, Keun-Soo, Suganuma, Katsuaki, Chen, Sinn-wen, Tsujimoto, Masanobu, and Yanada, Isamu, "Mechanical deformation-induced Sn whiskers growth on electroplated films in the advanced flexible electronic packaging," Journal of Materials Research, vol. 22 no. 7, pp. 1975-1986, July 2007.

Lin, Shih-Kang, Yorikado, Yuhi, Jiang, Junxiang, Kim, Keun-Soo, Suganuma, Katsuaki, Chen, Sinn-Wen, Tsujimoto, Masanobu, and Yanada, Isamu, "Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers," Journal of Electronic Materials, vol. 36 no. 12, pp. 1732-1734, Dec. 2007.

Lin, Shih-kang, Chang, Ru-Bo, Chen, Sinn-wen, Tsai, Ming-yueh, and Hsu, Chia-ming, "Solid-state reactions between Sn-20.0 wt.%In-x wt.%Zn solders and Ag and Ni substrates," Materials Chemistry and Physics, vol. 154, pp. 60-65, Mar. 15, 2015.

Lin, Shih-kang, Wang, Yu-hsiang, and Kuo, Hui-chin, "Strong coupling effects during Cu/In/Ni interfacial reactions at 280 °C," Intermetallics, vol. 58, pp. 91-97, Mar. 2015.

Lin, T. C., Kung, H. Y., Lee, S. H., Chen, M. H., Chiu, Y. T., and Lin, K. L., "The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests," 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Nagasaki, Japan, Apr. 17-21, 2018, pp. 226-229.

Lin, T. Y., "Bottlenecks and Strategies of Green Mold Compounds," IEEE Transactions on Components and Packaging Technologies, vol. 26 no. 2, pp. 492-494, June 2003.

Lin, T. Y., Liao, C. N., and Wu, Albert T., "Evaluation of Diffusion Barrier Between Lead-Free Solder Systems and Thermoelectric Materials," Journal of Electronic Materials, vol. 41 no. 1, pp. 153-158, Jan. 2012.

Lin, T. Y., Pecht, Michael G., Das, Diganta, and Teo, Kiat Choon, "The Influence of Substrate Enhancement on Moisture Sensitivity Level (MSL) Performance for Green PBGA Packages," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 3, pp. 522-527, Sept. 2006.

Lin, W. H., Wu, Albert T., Lin, S. Z., Chuang, T. H., and Tu, K. N., "Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads," Journal of Electronic Materials, vol. 36 no. 7, pp. 753-759, July 2007.

Lin, W. H., and Chuang, T. H., "Interfacial Reactions Between Liquid Sn-8Zn-3Bi Solders and Cu Substrates," Journal of Materials Engineering and Performance, vol. 12 no. 4, pp. 452-455, Aug. 2003.

Lin, Wan-Hsuan, Chao, Shu-Han, Zhan, Chau-Jie, Huang, Yu-wei, and Chen, Chih, "Failure mechanism of Cu/SnAg/Ni microbumps in three-dimensional integral circuits under electromigration," 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 22-24, 2014, pp. 174-176.

Lin, Wei, Pham, Quan, Baloglu, Bora, and Johnson, Michael, "SACQ Solder Board Level Reliability Evaluation and Life Prediction Model for Wafer Level Packages," 2017 IEEE 67th Electronic Components and Technology Conference, Orlando, FL, May 30-June 2, 2017, pp. 1058-1064.

Lin, Weicheng, "The Void-free Reflow Soldering of BGA with Vacuum," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Lin, Wen-Chih, Tseng, Tsan-Hsien, Liu, Wei, Huang, Kuo-Shuo, Chen, Hao, Lee, Hsin-Yi, Ku, Ching-Shun, and Wu, Albert T., "Effect of Sn Film Grain Size and Thickness on Kinetics of Spontaneous Sn Whisker Growth," JOM, vol. 71 no. 9, pp. 3041-3048, Sept. 2019.

Lin, Wen-Chih, Li, Ying-Sih, and Wu, Albert T., "Study of Diffusion Barrier for Solder/n-Type Bi2Te3 and Bonding Strength for p- and n-Type Thermoelectric Modules," Journal of Electronic Materials , vol. 47 no. 1, pp. 148-154, Jan. 2018.

Lin, Wen P., Sha, Chu-Hsuan, and Lee, Chin C., "40 um Flip-Chip Process Using Ag-In Transient Liquid Phase Reaction," IEEE Transactions on Components, Packaging, and Manufacturing Technology , vol. 2 no. 6, pp. 903-908, June 2012.

Lin, Wen P., Sha, Chu-Hsuan, and Lee, Chin C., "40um Ag-AgIn Flip-chip Interconnect Process at 180°C," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 603-607.

Lin, Wen P., and Lee, Chin C., "Bonding of Bi2Te3 Chips to Alumina using Ag-In System for High Temperature Applications," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 118-124.

Lin, Wen P., Sha, Chu-Hsuan, Wang, Pin J., and Lee, Chin C., "Microstructures of Silver Films Plated on Different Substrates and Annealed at Different Conditions," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1782-1786.

Lin, Williams, Lin, David, Hsu, Keven, Chang, K. S., and Chu, Charley, "The Use of Modified Oxide Process for Lead-Free Application," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 234-237.

Lin, Xiaoqin, Zhu, Dapeng, Xu, Gaowei, and Luo, Le, "Lead Free SnAg Solder Bumping with Size sub 100 Microns," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Lin, Xiaoqin, and Luo, Le, "Sub-100 um SnAg Solder Bumping Technology and the Bump Reliability," Journal of Electronic Packaging, vol. 131 no. 1, pp. 011014-1-011014-6, Mar. 2009.

Lin, Xiaoqin, and Luo, Le, "The Growth and Influencing Factors of Voids in SnAg Solder Bump and their Impact on Interfacial Bond Strength," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Lin, Xiaoqin, and Luo, Le, "The Reliability Study of Sub 100 Microns SnAg Flip Chip Solder Bump on FR4 Substrate under Thermal Cycling," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Lin, Xiaoqin, and Luo, Le, "Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-reflow and Aging and its Effects on Bonding Reliability," Journal of Electronic Materials, vol. 37 no. 3, pp. 307-313, Mar. 2008.

Lin, Xiuzhen, Chen, Shuming, Yu, Jianning, Wang, Kai, Luo, Dan, Sun, Xiaowei, and Zhang, Xinhai, "Enhanced conductivity of transparent and flexible silver nanowire electrodes fabricated by a solution-processed method at room temperature," Thin Solid Films, vol. 624, pp. 54-60, Feb. 28, 2017.

Lin, Y. C., and Zhong, Jue, "A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications," Journal of Materials Science, vol. xx no. x, pp. xx-xx, xxxx.

Lin, Y. C., Chen, Xu, and Wang, Z. P., "A Study of Degradation of ACF Joints in Chip-On-Glass Assenblies," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 2, 2006, pp. 826-832.

Lin, Y. C., Chen, Xu, and Wang, Z. P., "An Experimental Study of Degradation of Anisotropic Conductive Adhesive Joints," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 2, 2006, pp. 946-952.

Lin, Y. C., and Xia, Yu-Chi, "Application of Finite Element Method in Optimal Design of Flip-Chip Package," Advanced Materials Research, vol. 264-265, pp. 1660-1665, 2011.

Lin, Y. C., Chen, Xu, and Zhang, Jun, "Behavior of Anisotropic Conductive Joints under Hygrothermal Conditions," Key Engineering Materials, vol. 353-358, pp. 2936-2939, 2007.

Lin, Y. C., Chen, Xu, Zhang, H. J., and Wang, Z. P., "Effects of hygrothermal aging on epoxy-based anisotropic conductive film," Materials Letters, vol. 60 no. 24, pp. 2958-2963, Oct. 2006.

Lin, Y. C., Jin, Hao, Fang, Xiaonan, and Zhang, Jun, "Effects of Ultrasonic Power on Bonding Strength of Anisotropic Conductive Film Joint in Chip-on-Glass Assembly," Advanced Materials Research , vol. 189-193, pp. 3466-3469, 2011.

Lin, Y. C., Wang, K.,J., and Duh, J. G., "Phase Evalution in the Phosphorous-rich Layer Formation for SnAgCu/Ni-P Join," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Lin, Y. C., and Chen, X., "Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications," Journal of Adhesion Science and Technology, vol. 22 no. 14, pp. 1631-1657, 2008.

Lin, Y. H., Kuo, Frank, Chen, Y. F., Ho, C. S., Lai, J. Y., Chen, Stan, Chien, F. L., Lee, Rick, and Lau, John, "Low-Cost and Fine-Pitch Micro-Ball Mounting Technology for WLCSP," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 953-958.

Lin, Y. W., and Kao, C. Robert, "Tin Whisker Growth Induced by High Electron Current Density," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 62-65.

Lin, Y. W., Lai, Yi-Shao, Lin, Y. L., Tu, Chun-Te, and Kao, C. R., "Tin Whisker Growth Induced by High Electron Current Density," Journal of Electronic Materials, vol. 37 no. 1, pp. 17-22, Jan. 2008.

Lin, Yang, Yin, Luqiao, and Wei, Xicheng, "Recent Progress in The Studies of Low Melting Sn-Based Pb-Free Solders," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 338-341.

Lin, Yao-Sheng, Yang, Tsung-Fu, Chen, Wen-Chi, Chen, Tai-Hung, Cheng, Chun-Cheng, and Yeh, Yung-Hui, "Fine Pitch Compliant Bump Interconnection for Flip chip on Flexible Display Packaging by Anisotropic Conductive Film," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 501-506.

Lin, Yiteng, Ke, Xu, Yong, Justin Zhou, TOK, Eng Soon, Krishnan, R. Gopala, Raaj, G. Yaadhav, and Srayes, G., "Properties and Structure of Magnetically Responsive Fe - SAC305 Solder," South East Asia Technical Training Conference on Electronics Assembly Technologies 2014 Proceedings, Penang, Malaysia, Apr. 8-10, 2014, pp. xx-xx.

Lin, Yu-Hsiang, Chou, Jonathan, Lu, Yi-Chang, Wu, Tzong-Lin, and Chen, Hsin-Shu, "Chip-Package-Board Co-design - a DDR3 System Design Example from Circuit Designers' Perspective," Electrical Design of Advanced Packaging and Systems Symposium, Seoul, Korea, Dec. 10-12, 2008, pp. 27-30.

Lin, Yu-Hsin, Deng, Wei-Jaw, Shie, Jie-Ren, and Yang, Yung-Kuang, "Optimization of reflow soldering process for BGA packages by artificial neural network," Microelectronics International, vol. 24 no. 2, pp. 64-70, 2007.

Lin, Yu-Min, Zhan, Chau-Jie, Juang, Jing-Ye, Lau, John H., Chen, Tai-Hong, Lo, Robert, Kao, M., Tian, Tian, and Tu, King-Ning, "Electromigration in Ni/Sn Intermetallic Micro Bump Joint for 3D IC Chip Stacking," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 351-357.

Lin, Yu-Min, Lu, Su-Tsai, Kao, Hsuan-ling, and Chen, M. T., "The Contact Characteristics and NMOS Performance of ACF-Bonded Ultra-Thin Chip-on-Flex (UTCOF) Interconnects for Bendable Electronics," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Lin, Yu-ren, Pan, Kai-wen, Wu, Hsin-jay, and Chen, Sinn-wen, "Interfacial reaction at 250°C in the Sn/Ni-7wt.%V couple," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Lin, Yu-Wei, and Lin, Kwang-Lung, "Nucleation behaviors of the intermetallic compounds at the initial interfacial reaction between the liquid Sn3.0Ag0.5Cu solder and Ni substrate during reflow," Intermetallics, vol. 32, pp. 6-11, Jan. 2013.

Lin, Yuan-Jiang, Zhou, Min-Bo, Ma, Xiao, and Zhang, Xin-Ping, "Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al solder joints in packages of LED lighting components and structures," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 1028-1032.

Lin, Yung-Chi, Wang, Kai-Jheng, and Duh, Jenq-Gong, "Detailed Phase Evolution of a Phosphorous-Rich Layer and Formation of the Ni-Sn-P Compound in Sn-Ag-Cu/Electroplated Ni-P Solder Joints," Journal of Electronic Materials, vol. 39 no. 3, pp. 283-294, Mar. 2010.

Lin, Yung-Chi, Shih, Toung-Yi, Tien, Shih-Kang, and Duh, Jenq-Gong, "Morphological and Microstructural Evolution of Phosphorous-Rich Layer in SnAgCu/Ni-P UBM Solder Joint," Journal of Electronic Materials, vol. 36 no. 11, pp. 1469-1475, Nov. 2007.

Lin, Yung-Chi, and Duh, Jenq-Gong, "Optimal Phosphorous Content Selection for the Soldering Reaction of Ni-P Under Bump Metallication with Sn-Ag-Cu Solder," Journal of Electronic Materials, vol. 35 no. 8, pp. 1665-1671, Aug. 2006.

Lin, Yung-Chi, and Duh, Jenq-Gong, "Phase transformation of the phosphorus-rich layer in SnAgCu/Ni-P solder joints," Scripta Materialia, vol. 54 no. 9, pp. 1661-1665, May 2006.

Lin, Yung-Chi, Shih, Toung-Yi, Tien, Shih-Kang, and Duh, Jenq-Gong, "Suppressing Ni-Sn-P growth in SnAgCu/Ni-P solder joints," Scripta Materialia, vol. 56 no. 1, pp. 49-52, Jan. 2007.

Lin, Yung-Chi, Duh, Jenq-Gong, and Chiou, Bi-Shiou, "Wettability of Electroplated Ni-P in Under Bump Metallurgy with Sn-Ag-Cu Solder," Journal of Electronic Materials, vol. 35 no. 1, pp. 7-14, Jan. 2006.

Lin, Yung-Sen, and Chiu, Sheng-Shiang, "Effects of Oxidation and Particle Shape on Critical Volume Fractions of Silver-Coated Copper Powders in Conductive Adhesives for Microelectronic Applications," Polymer Engineering and Science, vol. 44 no. 11, pp. 2075-2082, Nov. 2004

Lin, Yung-Sen, and Chiu, Sheng-Shiang, "Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles," Journal of Adhesion Science and Technology, vol. 22 no. 14, pp. 1673-1697, 2008.

Lin, Yung-Sen, Xu, Jian-Zhi, Tien, Shih-Wei, Hung, Shih-Chan, Yuan, Wei-Li, Chung, Tsair-Wang, and Huang, Char-Ming, "Enhanced anisotropic conductive film (ACF) void-free bonding for Chip-On-Glass (COG) packages by means of low temperature plasmas," Microelectronics Reliability, vol. 52 no. 11, pp. 2756-2762, Nov. 2012.

Lin, Yung-Sen, Lai, Jin-Chu, and Tsai, Tzung-Han, "Enhanced lead-free solder wettability of oxidized-nickel by Ar-H2 plasmas for flip chip bumping," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Lin, Yung-Sen, Lin, Wei-Jhih, and Chiu, Lu-Yan, "Enhanced solder wettability of oxidized-copper with lead-free solder via Ar-H2 plasmas for flip-chip bumping: the effects of H2 flow rates," Soldering & Surface Mount Technology, vol. 24 no. 3, pp. xx-xx, 2012.

Lin, Yung-Sen, Chang, Chun-Hao, and Lin, Wei-Jhih, "Enhanced Wettability of Oxidized Copper with Lead-Free Solder by Ar-H2 Plasmas for Flip-Chip Bumping," Journal of Electronic Materials, vol. 36 no. 11, pp. 1483-1488, Nov. 2007.

Lin, Yung-Sen, Lin, Shiau-Min, Li, Jian-Yi, and Liao, Min-Chih, "Lead-free solder wettability of oxidized-aluminum enhanced by Ar-H2 plasmas for flip-chip bumping," Soldering & Surface Mount Technology, vol. 30 no. 1, pp. 42-48, 2018.

Lin, Yutao, Li, Hailong, and Chen, Gang, "Effect of nickel metallization thickness on microstructure evolution and mechanical properties in Sn3.0Ag0.5Cu/Au/Ni/Cu solder joints," Journal of Materials Science: Materials in Electronics, vol. 31 no. 14, pp. 11569-11580, July 2020.

Linares, Xioranny, Kinney, Chris, Lee, Kyu-oh, and Morris Jr., J. W., "The Influence of Sn Orientation on Intermetallic Compound Evolution in Idealized Sn-Ag-Cu 305 Interconnects: an Electron Backscatter Diffraction Study of Electromigration," Journal of Electronic Materials, vol. 43 no. 1, pp. 43-51, Jan. 2014.

Lincoln, John D, Ogunseitan, Oladele A, Saphores, Jean-Daniel M, Schoenung, Julie M, Nixon, Hilary, and Shapiro, Andrew A., "Environmentally Benign Materials for Electronics: A Review of Current Developments and Emerging Technologies," 2005 IEEE/CPMT 10th International Symposium on Advanced Packaging Materials, Irvine, CA, Mar. 16-18, 2005, pp. 139-143.

Lincoln, John D., Ogunseitan, Oladele A., Shapiro, Andrew A., and Saphores, Jean-Daniel M., "Leaching Assessments of Hazardous Materials in Cellular Telephones," Environmental Science & Technology, vol. 41 no. 7, pp. 2572-2578, 2007.

Lincoln, John D., Ogunseitan, Oladele A., and Shapiro, Andrew A., "Meta-analysis of Hazard Criteria Designation for Electronic Waste," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 89-94.

Lincoln, John D., Shapiro, Andrew A., Saphores, Jean-Daniel M., and Ogunseitan, Oladele A., "Moisture Absorption Phenomena in Green Composite Printed Circuit Board Prototypes," 2008 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 19-21, 2008, pp. xx-xx.

Lindborg, U., "A Model for the Spontaneous Growth of Zinc, Cadmium, and Tin Whiskers," Acta Metallurgica, vol. 24 no. 2, pp. 181-186, Feb. 1976.

Lindborg, U., "Observations on the Growth of Whisker Crystals from Zinc Electroplate," Metallurgical Transactions A, vol. 6A no. 8, pp. pp. 1581-1586, Aug. 1975. https://doi.org/10.1007/BF02641971

Lindborg, Ulf, Asthner, Bengt, Lind, Lena, and Revay, Laszlo B., "Intermetallic Growth and Contact Resistance of Tin Contacts After Aging," IEEE Transactions on Parts, Hybrids, and Packaging, vol. PHP-12 no. 1, pp. 33-39, Mar. 1976.

Lindner, Karl, and Reinders, Ton, "Pulse heat bonding, a method for interconnections with Anisotropic Conductive Adhesive Foil (ACAF) and Heat Seal Connectors (HSC)," Adhesives in Electronics "94", Berlin, Germany, Nov. 1994, pp. xx-xx.

Lindhqvist, Thomas, and Lifset, Reid, "Can We Take the Concept of Individual Producer Responsibility from Theory to Practice?," Journal of Industrial Ecology, vol. 7 no. 2, pp. 3-6, Summer 2003.

Lindhqvist, Thomas, "Policies for Waste Batteries," Journal of Industrial Ecology, vol. 14 no. 4, pp. 537-540, Aug. 2010.

Lindsay, James H., "Canadian Company is Engineering Innovative Materials For the Future Of Metal Finishing," Plating & Surface Finishing, vol. 91 no. 7, pp. 7-9, July 2004.

Lindsay, James H., "European Union ELV Directive: How will It Impact the Automotive & Metal Finishing Industries?," Plating & Surface Finishing, vol. 89 no. 6, pp. 16-17, June 2002.

Lindsay, James H., "MFSA Conference Examines Science & Impact of OSHA's Proposed Chromium PEL," Plating and Surface Finishing, vol. 92 no. 9, pp. 14-15, Sept. 2005.

Lindsay, James H., "Special Conference Comes to Grips With Hexavalent Chromium," Plating & Surface Finishing, vol. 82 no. 2, pp. 19-23, Feb. 1995.

Lindsay, James H., "Special Conference Deals With Cadmium Alternatives," Plating & Surface Finishing, vol. 82 no. 10, pp. 18-22, Oct. 1995.

Lindsay, James H., "Valuable Work at Stevens Institute & University of South Carolina," Plating & Surface Finishing, vol. 83 no. 9, pp. 65-66, Sept. 1996.

Lindsay Jr., James H., "Decorative and Hard Chromium Plating," Plating & Surface Finishing , vol. 82 no. 8, pp. 51-52, Aug. 1995.

Lindsay Jr., James H., "Decorative and Hard Chromium Plating," Plating & Surface Finishing , vol. 84 no. 8, pp. 50-51, Aug. 1997.

Lindsay Jr., James H., "Decorative & Hard Chromium Plating," Plating & Surface Finishing, vol. 85 no. 11, pp. 46-48, Nov. 1998.

Lindsay Jr., James H., "Decorative & Hard Chromium Plating," Plating & Surface Finishing, vol. 87 no. 8, pp. 38-40, Aug. 2000.

Lindsay Jr., James H., "Decorative & Hard Chromium Plating," Plating & Surface Finishing, vol. 88 no. 8, pp. 32-33, Aug. 2001.

Lindsay Jr., James H., "Decorative & Hard Chromium Plating," Plating & Surface Finishing, vol. 89 no. 8, pp. 27-29, Aug. 2002.

Lindsay Jr., James H., "Decorative & Hard Chromium Plating," Plating & Surface Finishing, vol. 90 no. 8, pp. 22-24, Aug. 2003.

Lindsay Jr, James H., "Decorative & Hard Chromium Plating," Plating & Surface Finishing, vol. 91 no. 8, pp. 16-17, Aug. 2004.

Lindsay Jr., James H., "Decorative & Hard Chromium Plating," Plating & Surface Finishing, vol. 94 no. 11, pp. 19-20, 26, Nov. 2006.

Lindsay, Jim, "Advanced Techniques for Replacing Chromium: Third Information Exchange," Plating & Surface Finishing, vol. 84 no. 2, pp. 24-25, Feb. 1997.

Lindstedt, John, Tinder, John, and An, Wenzhong, "Differential Potentiometric Analysis of Chloride in Bright Acid Tin Solutions," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. 249-254.

Lindstrom, David, Hedberg, Yolanda, and Wallinder, Inger Odnevall, "Chromium(III) and Chromium(VI) Surface Treated Galvanized Steel for Outdoor Constructions: Environmental Aspects," Environmental Science & Technology, vol. 44 no. 11, pp. 4322-4327, June 1, 2010.

Linehan, Thom, "Get the Lead Out," Quality Digest, vol. 28 no. 3, pp. 34-37, Mar. 2008.

Ling, Hiew Pang, and Stratton, Paul, "Improving Lead-free Joint Quality with Nitrogen," Surface Mount Technology (SMT), vol. 20 no. 10, pp. 36, 38, Oct. 2006.

Ling, Hiew Pang, and Stratton, Paul, "Increasing Value in Lead-Free Soldering with Nitrogen," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Ling, Jamin, Wang, Tie, Ying, Ming, Tessier, Ted, and Shim, I. K., "Effect of Underfill Materials on Pb-Free Flip Chip Package Reliability," IEEE/CPMT International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, CA, Mar. 16-18, 2005, pp. 282-286.

Ling, John, "Report from the EIPC Winter Conference," evertiq, Jan. 31, 2006.

Ling, John, "SMART Group 6th Annual Lead-Free Seminar and Table-top Exhibition: Tuesday 3rd February 2004 High Wycombe."

Ling, Joseph, Chitle, Kos, and Patterson, Tim, "Lead-free Soldering on Flexible Circuits," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies , San Jose, CA, Apr. 23-24, 2003, pp. 137-145.

Ling, Law Wai, Erfe, Eric, Vaquilar, Aldrin, Khor, Lily, Thong, K. C., Yong, Nicole, Nam, Ng Peng, Winster, Tony, Hong, Xuan, and Israel, Jonathan, "Wafer Backside Coating of Electrically Conductive Die Attach Adhesives for Small IC Packaging," 11th Electronics Packaging Technology Conference , Singapore, Dec. 9-11, 2009, pp. 750-753.

Ling, Wong Tzu, Leng, Eu Poh, Amin, Nowshad, and Ahmad, Ibrahim, "Lead-Free Solder Ball Attach Improvement on FCPBGA with SOP Pad Finishing," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Ling, Zhang, Ching, Ng Seow, Zheng, Li, Nong, Fang Shu, Nguty, Tennyson, de Bruin, Emiel, Xiao, An, and Thoonen, Henk, "Development of Advanced AuSn Alloy Plating Technology for Semiconductor Application," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 113-116.

Lingg, Cynthia L., "Surface Mount Solder Joint Issues Impacting Avionic Integrity," Proceedings of the IEEE 1990 National Aerospace and Electronics Conference, Volume 3, Dayton, OH, May 21-25, 1990, pp. 1369-1378.

Linman, Dale L., "High Temperature Reflow Soldering with Lead Free Solder," Proceedings of the Technical Program NEPCON West '94, Volume 1, Anaheim, CA, Feb. 27-Mar. 4, 1994, pp. 714-722.

Linnell, Jason, "Practical Implications of Electronics Recycling Laws for Consumer Electronics Manufacturers," 2010 Digest of Technical Papers International Conference on Consumer Electronics, Las Vegas, NV, Jan. 9-13, 2010, pp. 33-34.

Linnell, Jason, Alcorn, Walter, Linger, Terri, and Smith, Stephanie, "Understanding and Examining the Impacts of Orphan Products and 'White Box' Products on Emerging Electronics Recycling Systems," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 144-149.

Linton, Jonathan, "Electronic Products at Their End-of-Life: Options and Obstacles," Journal of Electronics Manufacturing, vol. 9 no. 1, pp. 29-40, Mar. 1999.

Linton, Jonathan D., Yeomans, J. Scott, and Yoogalingam, Reena, "Recovery and reclamation of durable goods: a study of television CRTs," Resources, Conservation, and Recycling, vol. 43 no. 4, pp. 337-352, Mar. 2005.

Linton. Jonathan D., "The European Union's New Environment Directives," Circuits Assembly , vol. 11 no. 9, pp. 32,34-40, Sept. 2000.

Linton. Jonathan, "The Future of Electronics and the Environment in Europe," Circuits Assembly, vol. 10 no. 6, pp. 22,24, June 1999.

Linton. Jonathan, "The State of the Environment- Europe and Asia," Circuits Assembly , vol. 10 no. 5, pp. 24,26, May 1999.

Liong, S., Wong, C. P., and Burgoyne Jr., W. F., "Adhesion Improvement of Thermoplastic Isotropically Conductive Adhesive," 2002 8th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 3-6, 2002, pp. 260-270.

Liong, S., Wong, C. P., and Burgoyne Jr., W. F., "Adhesion Improvement of Thermoplastic Isotropically Conductive Adhesive," 2002 Proceedings 52nd Electronic Components & Technology Conference , San Diego, CA, May 28-31, 2002, pp. 1631-1639.

Liong, S., Wong, C. P., and Burgoyne Jr., W. F., "Conductivity Improvement of Thermoplastic Isotropically Conductive Adhesive," 2002 Proceedings 52nd Electronic Components & Technology Conference , San Diego, CA, May 28-31, 2002, pp. 1140-1146.

Liong, Silvia, Wong, C. P., and Burgoyne Jr., William F., "Adhesion Improvement of Thermoplastic Isotropically Conductive Adhesive," IEEE Transactions on Components and Packaging Technologies, vol. 28 no. 2, pp. 327-336, June 2005.

Liong, Silvia, and Wong, C. P., "An Alternative to Epoxy Resin for Application in Isotropically Conductive Adhesive," 2001 International Symposium on Advanced Packaging Materials , Braselton, GA, Mar. 11-14, 2001, pp. 13-18.

Liong, Silvia, and Wong, C. P., "Development of Thermoplastic Isotropically Conductive Adhesive," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 586-592.

Liong, Silvia, Zhang, Zhuqing, and Wong, C. P., "High Frequency Measurement of Isotropically Conductive Adhesives," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 1250-1254.

Liotine Jr., Frank, "Conductive adhesives and nanotechnology - alternatives for lead-free soldering," Global SMT and Packaging, vol. 6 no. 6, pp. 34, 36, 38, 40, June/July 2006.

Liotine Jr., Frank, "Lead-Free Soldering for SMT Components: A Review of Processing and Reliability Issues," SMTA Journal, vol. 17 no. 4, pp. 17-23, Oct. 2004.

Liotine Jr., Frank, "Pb-Free Solder Processing and Reliability," Circuits Assembly , vol. 16 no. 6, pp. 34, 37, June 2005.

Liotine, Frank, "Reliability of Electrically Conductive Adhesives as a Substitute for Lead Based Solder in Military, Automotive, and High Stress Environments," Journal of SMT, vol. 14 no. 4, pp. 1-10, Oct. 2001.

Liotine, Jr., Frank, "Solder Reliability Model for BGA and LCC Joints Given Lead-Free Rework Concerns," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 333-340.

Liotine Jr., Frank, "Surface Mount Solderless Attachment Using Electrically Conductive Polymer Adhesive Technology," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume 1, San Jose, CA, Aug. 31-Sept. 2, 1993, pp. 571-583.

Liou, Wei-Kai, Yen, Yee-Wen, and Jao, Chien-Chung, "Aging Effects on Interfacial Reactions between Cu Addition into the Sn-9Zn Lead-Free Solder and Au Substrate," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 271-273.

Liou, Wei-kai, Yen, Yee-wen, and Chen, Kuen-da, "Interfacial Reactions between Sn-9Zn + Cu Lead-free Solders and the Au Substrate," Journal of Alloys and Compounds, vol. 479 no. 1-2, pp. 225-229, June 24, 2009.

Liou, Wei-kai, and Yen, Yee-wen, "Interfacial Reactions between Sn-9Zn+Cu Lead-free Solders and the Au Substrate," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 220-223.

Liou, Wei-kai, Yen, Yee-Wen, and Jao, Chien-Chung, "Interfacial Reactions of Sn-9Zn-xCu (x = 1, 4, 7, 10) Solders with Ni Substrates," Journal of Electronic Materials, vol. 38 no. 11, pp. 2222-2227, Nov. 2009.

Liou, Wei-kai, and Yen, Yee-Wen, "Phase equilibria of the Au-Sn-Zn ternary system and interfacial reactions in Sn-Zn/Au couples," Intermetallics, vol. 17 no. 1-2, pp. 72-78, Jan.Feb. 2009.

Lipcsei, Laura, Murray, Alison, Smith, Reginald, and Savas, Mahmut, "An Examination of Deterioration Products Found on Tin Ingots Excavated from the 14th Century B.C., Late Bronze Age Shipwreck, The Ulu Burun, Near Kas, Turkey," Materials Issues in Art and Archaeology VI (Materials Research Society Symposium Proceedings Volume 712), Boston, MA, Nov. 26-30, 2001, pp. 451-459. doi:10.1557/PROC-712-II6.4

Lipfert, Frederick W., and Saroff, Lawrence, "Methylmercury Risk Assessment Issues," Proceedings of the 31st Intersociety Energy Conversion Engineering Conference, Volume 3, Washington, D.C., Aug. 11-16, 1996, pp. 2159-2164.

Lipp, Jochen, "How Can Vapor Phase Technology Support EMS RoHS Challenges," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 219-222.

Lipp, Jochen, "How VPS Resolves Voids and Popcorning," Printed Circuit Design and Fab/ Circuits Assembly, vol. 29 no. 12, pp. 38,42, Dec. 2012.

Lipp, Jochen, "The Virtues of Vapor," Printed Circuit Design and Fab/ Circuits Assembly, vol. 29 no. 2, pp. 60, Feb. 2012.

Lis, Adrian, Kenel, Christoph, and Leinenbach, Christian, "Characteristics of Reactive Ni3Sn4 Formation and Growth in Ni-Sn Interlayer Systems," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 47 no. 6, pp. 2596-2608, June 2016.

Lis, Adrian, Park, Min Soo, Arroyave, Raymundo, and Leinenbach, Christian, "Early stage growth characteristics of Ag3Sn intermetallic compounds during solid-solid and solid-liquid reactions in the Ag-Sn interlayer system: Experiments and simulations," Journal of Alloys and Compounds, vol. 617, pp. 763-773, Dec. 25, 2014.

Lis, Adrian, Nakanishi, Kohei, Matsuda, Tomoki, Sano, Tomokazu, Minagawa, Madoka, Okamoto, Masahide, and Hirose, Akio, "Finite Element-Assisted Assessment of the Thermo-cyclic Characteristics of Leads Soldered with SnAgCu(+Bi,In) Alloys," Journal of Electronic Materials, vol. 46 no. 7, pp. 4326-4343, July 2017.

Lis, Adrian, Tatsumi, Hiroaki, Matsuda, Tomoki, Sano, Tomokazu, Kashiba, Yoshihiro, and Hirose, Akio, "Reliability and Temperature Resistance of Solder-Metallic Mesh Composite Joints," Journal of Electronic Materials, vol. 48 no. 6, pp. 3699-3712, June 2019.

Lita, Adriana E., and Sanchez Jr., John E., "Characterization of surface structure in sputtered Al films: Correlation to microstructure evolution," Journal of Applied Physics, vol. 85 no. 2, pp. 876-882, Jan. 15, 1999.

Litchfield, Corinne, "Corporate changes and regulations on hazardous materials affect how EMS firms do business," Medical Product Manufacturing News, pp. 28-29, Apr. 2006.

Litchfield, Corinne, "Electronics Outsourcing: Getting Down to the Wires," Medical Product Manufacturing News, pp. 28-29, Apr. 2006.

Litchfield, Corinne, "The Race to Compliance," European Medical Device Manufacturer , vol. xx no. xx, pp. xx-xx, Sept. 2005.

Little, Matthew J., "Chrome Comes Under Fire...Again," Products Finishing, vol. 69 no. 3, pp. 42-45, Dec. 2004.

Litwin, Barry, "Green Inside and Out," EDN, vol. 53 no. 21, pp. S14-S15, Oct, 2008.

Liu, Ado, and Chen, Jeng-I, "Reliability of High Tg Copper Clad Laminate for Lead-free Assembly," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 284-287.

Liu, B., Tao, J. Y., Chen, X., Zhang, Y. A., Jiang, Yu, and Qian, Y., "Numerical investigation of the effects of phosphorus on the mechanical responses of [1 1 0]-oriented silicon nano-wires," Microelectronics Reliability, vol. 64, pp. 225-229, Sept. 2016.

Liu, Baolei, Tian, Yanhong, Qin, Jingkai, An, Rong, Zhang, Rui, and Wang, Chenxi, "Degradation behaviors of micro ball grid array (uBGA) solder joints under the coupled effects of electromigration and thermal stress," Journal of Materials Science: Materials in Electronics, vol. 27 no. 11, pp. 11583-11592, Nov. 2016.

Liu, Baolei, Tian, Yanhong, Wang, Shang, Zhang, Rui, Zhao, Xin, Dong, Chenglong, and Wang, Chunqing, "Rapid Formation of Cu-Sn Intermetallic Compounds by Strong Electric Current," 2014 15th International Conference on Electronic Packaging Technology , Chengdu, China, Aug. 12-15, 2014, pp. 489-492.

Liu, Baolei, Tian, Yanhong, Liu, Wei, Wu, Weiwei, and Wang, Chunqing, "TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows," Materials Letters , vol. 163, pp. 254-257, Jan. 15, 2016.

Liu, Baolei, Tian, Yanhong, Wang, Chenxi, An, Rong, and Wang, Chunqing, "Ultrafast formation of unidirectional and reliable Cu3Sn-based intermetallic joints assisted by electric current," Intermetallics, vol. 80, pp. 26-32, Jan. 2017.

Liu, Bi Tao, Ge, Liang-sheng, Xu, Jia-fu, Jin, Rong, Yang, Liu, and Tu, Ming-jing, "Research Development in Synthesis Methods of Silver Nanowires," Materials Science Forum, vol. 852, pp. 551-555, Apr. 2016.

Liu, Bo, Lee, Tae-Kyu, and Liu, Kuo-Chuan, "Impact of 5% NaCl Salt Spray Pretreatment on the Long-Term Reliability of Wafer-Level Packages with Sn-Pb and Sn-Ag-Cu Solder Interconnects," Journal of Electronic Materials, vol. 40 no. 10, pp. 2111-2118, Oct. 2011.

Liu, C. H., Lin, Sue J., and Lewis, C., "Life cycle assessment of DRAM in Taiwan's semiconductor industry," Journal of Cleaner Production, vol. 18 no. 5, pp. 419-425, Mar. 2010.

Liu, C. M., Ho, C. E., Chen, W. T., and Kao, C. R., "Reflow Soldering and Isothermal Solid-State Aging of Sn-Ag Eutectic Solder on Au/Ni Surface Finish," Journal of Electronic Materials, vol. 30 no. 9, pp. 1152-1156, Sept. 2001.

Liu, C. S., and Ho, C. E., "Role of Ni and Cu Metallization Dissolution in Various Ni/Solder/Cu Jointing Sequences," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Liu, C. Y., and Wang, S. J., "An effective Cu-Sn barrier layer for Au bump used in optoelectronic devices," Journal of Materials Research, vol. 19 no. 9, pp. 2536-2540, Sept. 2004.

Liu, C. Y., Chen, Chih, and Tu, K. N., "Electromigration in Sn-Pb solder strips as a function of alloy composition," Journal of Applied Physics, vol. 88 no. 10, pp. 5703-5709, Nov. 15, 2000.

Liu, C. Y., Chen, J. T., Chuang, Y. C., Ke, Lin, and Wang, S. J., "Electromigration-induced Kirkendall voids at the Cu/Cu3Sn interface in flip-chip Cu/Sn/Cu joints," Applied Physics Letters, vol. 90 no. 11, pp. 112114-1-112114-3, Mar. 12, 2007.

Liu, C. Y., Chen, Chih, Liao, C. N., and Tu, K. N., "Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes," Applied Physics Letters, vol. 75 no. 1, pp. 58-60, July 5, 1999.

Liu, C. Y., and Wang, S. J., "Prevention of Spalling by the Self-Formed Reaction Barrier Layer on Controlled Collapse Chip Connections Under Bump Metallization," Journal of Electronic Materials, vol. 32 no. 1, pp. L1-L3, Jan. 2003.

Liu, C. Y., Wei, Y. S., Lin, E. J., Hsu, Y. C., and Tang, Y. K., "Study of Sn and SnAgCu Solders Wetting Reaction on Ni/Pd/Au Substrates," Journal of Electronic Materials, vol. 45 no. 12, pp. 6079-6085, Dec. 2016.

Liu, C. Y., Li, Jian, Vandentop, G. J., Choi, W. J., and Tu, K. N., "Wetting Reaction of Sn-Ag Based Solder Systems on Cu Substrates Plated with Au and/or Pd Layer," Journal of Electronic Materials, vol. 30 no. 5, pp. 521-526, May 2001.

Liu, C. Z., and Zhang, W., "Bismuth redistribution induced by intermetallic compound growth in SnBi/Cu microelectronic interconnect," Journal of Materials Science, vol. 44 no. 1, pp. 149-153, Jan. 2009.

Liu, C. Z., Kang, T. Y., Wei, W., Zheng, K., Fu, L., Hui, L., Wang, J. J., and Tong, W. P., "Effect of high intensity magnetic field on intermetallic compounds growth in SnBi/Cu microelectronic interconnect," Journal of Alloys and Compounds , vol. 509 no. 33, pp. 8475-8477, Aug. 18, 2011.

Liu, C. Z., Wang, J. J., Zhu, M. W., Liu, X. M., Lu, T. N., and Yang, J. R., "Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects," Journal of Electronic Materials, vol. 50 no. 1, pp. 258-262, Jan. 2021. https://doi-org.ezproxy.uky.edu/10.1007/s11664-020-08562-4

Liu, C. Z., and Chen, J., "Nanoindentation of lead-free solders in microelectronic packaging," Materials Science and Engineering: A, vol. 448 no. 1-2, pp. 340-344, Mar. 15, 2007.

Liu, Caiping, Duan, Qingquan, and Mao, Lingtao, "Ductile Damage Evolution Analysis of Lead-Free Sn-Zn Solder Based on Meso Topography," Advanced Materials Research, vol. 152-153, pp. 1004-1008, Oct. 2011.

Liu, Changqing, Conway, Paul, Li, Dezhi, and Hendriksen, Michael, "Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints," Advances in Electronic Packaging 2003, Volume 1 , Maui, Hawaii, July 6-11, 2003, pp. 147-153.

Liu, Changqing, Conway, Paul, Li, Dezhi, and Hendriksen, Michael, "Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints," Journal of Electronic Packaging, Transactions of the ASME, vol. 126 no. 3, pp. 359-366, Sept. 2004.

Liu, Changqing, Hutt, David A., Li, Dezhi, and Conway, Paul P., "Effect of Microstructural Characteristics of Electroless Nickel Metallisation on Solderability to Pb-free Solder Alloys," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part C, San Francisco, CA, July 17-22, 2005, pp. 1819-1825.

Liu, Changqing, Huang, Zhiheng, Conway, Paul, and Thomson, Rachel, "Materials Behaviour and Intermetallics Characteristics in the Reaction Between SnAgCu and Sn-Pb Solder Alloys," 54th Electronic Components & Technology Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1347-1353.

Liu, Changqing, Huang, Zhiheng, Conway, Paul P., and Thomson, Rachel C., "Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn-Pb solder alloys," Journal of Materials Science , vol. 42 no. 11, pp. 4076-4086, June 2007.

Liu, Changqing, and Hutt, David A., "Novel Surface Coatings to Enable Fluxless Soldering of Copper Surfaces," 2002 Proceedings 52nd Electronic Components & Technology Conference , San Diego, CA, May 28-31, 2002, pp. 138-145.

Liu, Changqing, and Hutt, David A., "Surface coatings for fluxless soldering of copper," Circuit World , vol. 29 no. 1, pp. 19-23, 2003.

Liu, Chao Sheng, Ho, Cheng En, Peng, Cheng Sam, and Kao, C. Robert, "Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints," Journal of Electronic Materials, vol. 40 no. 9, pp. 1912-1920, Sept. 2011.

Liu, Chen, Lai, Xinquan, Xiao, Yuanming, Shi, Lingfeng, and Jiang, Jianguo, "Analysis of POP Solder Ball Thermal Cycling Fatigue Life Based on Stress Strain," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1258-1261.

Liu, Chia-Yu, Kuo, Po-Cheng, Chen, Chih-Ming, Dai, Jia-Ying, Yen, Yee-Wen, and Pasana, Alberto S., "Effect of Multiple Reflowing Processes on Interfacial Reactions and Mechanical Properties between Sn-9.0 wt.%Zn, Sn-3.0 wt.%Ag-0.5 wt.%Cu Solders and Ag Substrate," Journal of Electronic Materials, vol. 49 no. 1, pp. 257-267, Jan. 2020.

Liu, Chih-Yao, Chen, Ying-Ru, Li, Wang-Long, Hon, Min-Hsiung, and Wang, Moo-Chin, "Effect of Thermal Treatment on the Intermetallic Compounds Formed at Sn-9Zn-1.5Ag-xBi (x = 0 and 1) Lead-Free Solder/Cu Interface," Materials Transactions, vol. 48 no. 8, pp. 2133-2138, Aug. 2007.

Liu, Chih-Yao, Hon, Min-Hsiung, Wang, Moo-Chin, Chen, Ying-Ru, Chang, Kuo-Ming, and Li, Wang-Long, "Effects of aging time on the mechanical properties of Sn-9Zn-1.5Ag-xBi lead-free solder alloys," Journal of Alloys and Compounds, vol. 582, pp. 229-235, Jan. 5, 2014.

Liu, Chih-Yao, Chen, Ying-Ru, Li, Wang-Long, Hon, Min-Hsiung, and Wang, Moo-Chin, "Electrochemical Properties of Joints Formed Between Sn-9Zn-1.5Ag-1Bi Alloys and Cu Substrates in a 3.5 wt.% NaCl Solution," Journal of Electronic Materials, vol. 36 no. 11, pp. 1531-1535, Nov. 2007.

Liu, Chih-Yao, Wang, Moo-Chin, and Hon, Min-Hsiung, "Intermetallic Compounds and Adhesion Strength between the Sn-9Zn-1.5Ag-0.5Bi Lead-Free Solder and Unfluxed Cu Substrate," Journal of Electronic Materials, vol. 33 no. 12, pp. 1557-1560, Dec. 2004.

Liu, Chih-Yao, Wang, Moo-Chin, and Hon, Min-Hsiung, "Reliability of Adhesion Strength of the Sn-9Zn-1.5Ag-0.5Bi/Cu during Isothermal Aging," Journal of Electronic Materials, vol. 35 no. 5, pp. 966-971, May 2006.

Liu, Chih-Yao, Lai, Chien-Hong, Wang, Moo-Chin, and Hon, Min-Hsiung, "Thermal behavior and microstructure of the intermetallic compounds formed at the Sn-3Ag-0.5Cu/Cu interface after soldering and isothermal aging," Journal of Crystal Growth, vol. 290 no. 1, pp. 103-110, Apr. 15, 2006.

Liu, Chin-Hung, Kim, Young Jin, Chun, Dong Won, Kim, Gunwoo, Chen, Renkun, Yu, Anthony W., and Jin, Sungho, "Universal solders for direct bonding and packaging of optical devices," Materials Letters, vol. 152, pp. 232-236, Aug. 1, 2015.

Liu, Chin-Wei, and Lin, Kwang-Lung, "Effect of Cr Addition on Wetting Behavior Between Cu and High-Temperature Zn-25Sn-0.15Al-0.1Ga-xCr Pb-Free Solder," Journal of Electronic Materials, vol. 43 no. 12, pp. 4502-4509, Dec. 2014.

Liu, Chong, Dasgupta, Neil P., and Yang, Peidong, "Semiconductor Nanowires for Artificial Photosynthesis," Chemistry of Materials, vol. 26 no. 1, pp. 415-422, Jan. 14, 2014.

Liu, Chunzhong, Chen, Ji, Liu, P. L., and Shang, Jianku, "Investigation on Aging-induced Softening of Eutectic Microstructurein SnBi/Cu Interconnect by Nanoindentation," Journal of Materials Science and Technology, vol. 22 no. 1, pp. 130-134, Jan. 2006.

Liu, D. S., Hsu, C. L., Kuo, C. Y., Huang, Y. L., Lin, K. L., and Shen, G. S., "Effect of Low Temperature on the Micro-impact Fracture Behavior of Sn-Ag-Cu Solder Joint," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Liu, D. S., Hsu, C. L., Kuo, C. Y., Lin, C. Y., Chen, Y. R., and Shen, G. S., "Effect of Solder Pad Opening Size and Various Pad Metallization Substrates on Sn-Ag-Cu Solder Joint under High Speed Shear Test," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 525-528.

Liu, Dabiao, He, Yuming, Tang, Xutao, Ding, Huaming, Hu, Peng, and Cao, Peng, "Size effects in the torsion of microscale copper wires: Experiment and analysis," Scripta Materialia, vol. 66 no. 6, pp. 406-409, Mar. 2012.

Liu, De-Shin, Hsu, Chang-Lin, Kuo, Chia-Yuan, Huang, Ya-Ling, Lin, Kwang-Lung, and Shen, Geng-Shin, "A Novel High Speed Impact Testing Method for Evaluating the Low Temperature Effects of Eutectic and Lead-free Solder Joints," Soldering & Surface Mount Technology, vol. 24 no. 1, pp. 22-29, 2012.

Liu, De-Shin, Yeh, Shu-Shen, Kao, Chun-Teh, Huang, Pay-Yau, Tsai, Chia-I, Liu, An-Hong, and Ho, Shu-Ching, "An experimental and numerical investigation into the effects of the chip-on-film (COF) processing parameters on the Au-Sn bonding temperature," Soldering & Surface Mount Technology, vol. 22 no. 4, pp. 31-41, 2010.

Liu, De-Shin, Yeh, Shu-Shen, Tsai, Chia-I, Liu, An-Hong, and Ho, Shu-Ching, "Effect of Bonding Temperature on Eutectic Interconnections in Chip-On-Film Packages," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 102-105.

Liu, De-Shin, Kuo, Chia-Yuan, Hsu, Chang-Lin, Shen, Geng-Shin, Chen, Yu-Ren, and Lo, Kuo-Cheng, "Failure mode analysis of lead-free solder joints under high speed impact testing," Materials Science and Engineering: A, vol. 494 no. 1-2, pp. 196-202, Oct. 25, 2008.

Liu, E., Zahner, Thomas, Besold, Sebastian, Wunderle, Bernhard, and Elger, Gordon, "Location resolved transient thermal analysis to investigate crack growth in solder joints," Microelectronics Reliability, vol. 79, pp. 533-546, Dec. 2017.

Liu, En-Shao, Jain, Nitesh, Varahramyan, Kamran M., Nah, Junghyo, Banerjee, Sanjay K., and Tutuc, Emanuel, "Role of Metal-Semiconductor Contact in Nanowire Field-Effect Transistors," IEEE Transactions on Nanotechnology, vol. 9 no. 2, pp. 237-242, Mar. 2010.

Liu, Fang, Meng, Guang, and Zhao, Junfeng, "An alternative JEDEC test board design and analysis," Soldering & Surface Mount Technology, vol. 25 no. 3, pp. 155-163, 2013.

Liu, Fang, Meng, Guang, Zhao, Mei, and Zhao, Jun feng, "Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact," Microelectronics Reliability, vol. 49 no. 1, pp. 79-85, Jan. 2009.

Liu, Fang, Meng, Guang, and Zhao, Mei, "Experimental investigation on the failure of lead-free solder joints under drop impact," Soldering & Surface Mount Technology, vol. 22 no. 3, pp. 36-41, 2010.

Liu, Fang, and Meng, Guang, "Modeling and Simulation of PCB Assembly under Board-Level Drop Impact," Applied Mechanics and Materials, vol. 34-35, pp. 451-455, Oct. 2010.

Liu, Fang, Lu, Ye, Wang, Zhen, and Zhang, Zhiming, "Numerical simulation and fatigue life estimation of BGA packages under random vibration loading," Microelectronics Reliability, vol. 55 no. 12 pt. B, pp. 2777-2785, Dec. 2015.

Liu, Fang, and Meng, Guang, "Random vibration reliability of BGA lead-free solder joint," Microelectronics Reliability, vol. 54 no. 1, pp. 226-232, Jan. 2014.

Liu, Fang, Zhou, Jiacheng, and Yan, Nu, "Thermal cycling effect on the drop reliability of BGA lead-free solder joints," Soldering & Surface Mount Technology, vol. 29 no. 4, pp. 199-202, 2017.

Liu, Fei, Liang, Lihua, and Liu, Yong, "An Improved Substructure Method for Prediction of Solder Joint Reliability in Thermal Cycle," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 311-316.

Liu, Fenny, Yao, C. T, Jiang, Don Son, Wang, Yu Po, and Hsiao, C. S., "Halogen-Free Mold Compound Development for Ultra-Thin Packages," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1051-1055.

Liu, Guangyu, Song, Min, Liu, Xinli, Ni, Song, Wang, Shiliang, He, Yuehui, and Liu, Yong, "An investigation of the mechanical behaviors of micro-sized tungsten whiskers using nanoindentation," Materials Science and Engineering: A, vol. 594, pp. 278-286, Jan. 31, 2014.

Liu, Guangyu, Song, Min, Liu, Xinli, and He, Yuehui, "Factors affecting the growth of micro/nano-sized tungsten whiskers synthesised by vapour deposition," Philosophical Magazine, vol. 93 no. 6, pp. 584-597, 2013. https://doi.org/10.1080/14786435.2012.725952

Liu, H., Wang, K., Aasmundtveit, K. E., and Hoivik, N., "Intermetallic Compound Formation Mechanisms for Cu-Sn Solid-Liquid Interdiffusion Bonding," Journal of Electronic Materials, vol. 41 no. 9, pp. 2453-2462, Sept. 2012.

Liu, H., Wang, K., Aasmundtveit, K., and Hoivik, N., "Intermetallic Cu3Sn as Oxidation Barrier for Fluxless Cu-Sn Bonding," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 853-857.

Liu, H. S., Liu, C. L., Wang, C., Jin, Z. P., and Ishida, K., "Thermodynamic Modeling of the Au-In-Sb Ternary System," Journal of Electronic Materials, vol. 32 no. 2, pp. 81-88, Feb. 2003.

Liu, H. S., Liu, C. L., Ishida, K., and Jin, Z. P., "Thermodynamic Modeling of the Au-In-Sn System," Journal of Electronic Materials, vol. 32 no. 11, pp. 1290-1296, Nov. 2003.

Liu, H. S., Wang, J., and Jin, Z. P., "Thermodynamic optimization of the Ni-Sn binary system," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 28 no. 4, pp. 363-370, Dec. 2004.

Liu, H. X., Wang, C. P., Yu, Y., Liu, X. J., Takaku, Y., Ohnuma, I., Kainuma, R., and Ishida, K., "Experimental Investigation and Thermodynamic Calculation of the Phase Equilibria in the Al-Bi-Sn Ternary System," Journal of Phase Equilibria and Diffusion, vol. 33 no. 1, pp. 9-19, Feb. 2012.

Liu, H. Y., Zhu, Q. S., Wang, Z. G., and Shang, J. K., "Effect of the Microstructure Orientation on Tensile Properties of Sn-Ag-Cu Solder," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 464-466.

Liu, H. Y., Zhu, Q. S., Wang, Z. G., Guo, J. D., and Shang, J. K., "Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect," Journal of Materials Science: Materials in Electronics , vol. 24 no. 1, pp. 211-216, Jan. 2013.

Liu, H. Y., Zhu, Q. S., Wang, Z. G., and Shang, J. K., "Stress relaxation behavior of Cu/Sn/Cu micro-connect after electrical current," Materials Science and Engineering: A, vol. 528 no. 3, pp. 1467-1471, Jan. 25, 2011.

Liu, Hai, Zhang, Jing, Chen, Song, Du, Maohua, Feng, Nufeng, Wang, Qian, and Lee, Taekoo, "Board Level Thermal Cycle Reliability of BGA for a New Type of Pad Structure with OSP Surface Finish," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Liu, Hai-ming, Meng, Gong-ge, and Kang, Min, "Study of Melting Point, Solderability and Interface Microstructure of SnAgCu-XSm/Cu," 2014 9th International Forum on Strategic Technology , Cox's Bazar, Bangladesh, Oct. 21-23, 2014, pp. 444-447.

Liu, Hailong, and Yang, Shaohua, "Thermo-mechanical Reliability Analysis of Package-on-Package Assembly," 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, Xi'an, China, June 17-19, 2011, pp. 203-207.

Liu, Haiyan, Xu, Cheng, Liu, Xiaoyang, Yu, Daquan, Dai, Fengwei, Lu, Yuan, and Shangguan, Dongkai, "Effect of IMC Growth on thermal cycling reliability of micro solder bumps," 2013 IEEE 15th Electronics Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp. 836-839.

Liu, Haiyan, Zhu, Qingsheng, Zhang, Li, Wang, Zhongguang, and Shang, Jian Ku, "Enhanced stress relaxation of Sn-3.8Ag-0.7Cu solder by electrical current," Journal of Materials Research, vol. 25 no. 6, pp. 1172-1178, June 2010.

Liu, Han, Xue, Songbai, Tao, Yu, Long, Weimin, and Zhong, Sujuan, "Design and solderability characterization of novel Au-30Ga solder for high-temperature packaging," Journal of Materials Science: Materials in Electronics, vol. 31 no. 3, pp. 2514-2522, Feb. 2020.

Liu, Hao, Li, Jinhui, Wen, Xuefeng, and Zhou, Xiaohua, "Investigation on Collection Mode of Domestic E-waste in Urban China: the Case of Beijing," Proceedings of the 2007 IEEE International Symposium on Electronics & the Environment, Orlando, FL, May 7-10, 2007, pp. 257-261.

Liu, Hongxi, and Zhou, Jianqiu, "Plasticity in nanotwinned polycrystalline Ni nanowires under uniaxial compression," Materials Letters, vol. 163, pp. 179-182, Jan. 15, 2016.

Liu, Huan, Huang, Mingliang, Ma, Haitao, and Cui, Yipeng, "Comparative Study of Interfacial Reactions of High-Sn Pb-free Solders on (001) Ni Single Crystal and on Polycrystalline Ni," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 293-298.

Liu, Huan, Xue, Feng, and Zhou, Jian, "Study of Flux on Wetting Behavior of Sn-Zn Lead-Free Solders," Advanced Materials Research, vol. 189-193, pp. 3230-3237, 2011.

Liu, Huashan, Zhu, WenJun, and Jin, ZhanPeng, "Prediction of IMC Formation during Interfacial Reactions: Application of CALPHAD Approach to Electronic Package," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1130-1137.

Liu, Hui, Zhou, Longzao, Li, Jun, Wu, Fengshun, and Wu, Yiping, "Effect of Stand-off Height on the Reliability of Cu/Sn-4.8Bi-2Ag/Cu Solder Joint," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1094-1096.

Liu, Hui, Wu, Fengshun, He, Mingmin, Zhang, Jinsong, Yu, Yang, Wu, Yiping, and An, Bing, "The Study on the Interaction of Interfacial Reactions between UBM/Solder and Solder/Pad in Miniature Joints," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Liu, J., Boustedt, K., and Lai, Z., "Development of Flip-chip Joining Technology on Flexible Circuitry Using Anistropically Conductive Adhesives and Eutectic Solder," Circuit World , vol. 22 no. 2, pp. xx-xx, 1996.

Liu, J. L., Cai, S. J., Jin, G. L., Thomas, S. G., and Wang, K. L., "Growth of Si whiskers on Au/Si(1 1 1) substrate by gas source molecular beam epitaxy (MBE)," Journal of Crystal Growth, vol. 200 no. 1-2, pp. 106-111, Apr. 1, 1999.

Liu, J., Sahaym, U., Dutta, I., Raj, R., Renavikar, M., Sidhu, R. S., and Mahajan, R., "Interfacially engineered liquid-phase-sintered Cu-In composite solders for thermal interface material applications," Journal of Materials Science , vol. 49 no. 22. pp. 7844-7854, Nov. 2014.

Liu, J., Kumar, P., Dutta, I., Raj, R., Sidhu, R., Renavikar, M., and Mahajan, R., "Liquid phase sintered Cu-In composite solders for thermal interface material and interconnect applications," Journal of Materials Science, vol. 46 no. 21, pp. 7012-7025, 2011.

Liu, J., Kumar, P., Dutta, I., Raj, R., and Renavikar, M., "Next Generation Solder-Systems for Thermal Interface and Interconnect Applications via Liquid Phase Sintering," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 385-387.

Liu, J., "On the failure mechanism of anisotropically conductive adhesive joints on copper metallisation," International Journal of Adhesion and Adhesives , vol. 16 no. 4, pp. 285-287, 1996.

Liu, J., "Recent advances in conductive adhesives for direct chip attach applications," Microsystem Technologies, vol. 5 no. 2, pp. 72-80, 1998.

Liu, J., "Reliability of Surface-mounted Anisotropically Conductive Adhesive Joints," Circuit World, vol. 19 no. 4, pp. 4-11, 1993.

Liu, J. H., Zhao, H. Y., Li, Z. L., Song, X. G., Dong, H. J., Zhao, Y. X., and Feng, J. C., "Study on the microstructure and mechanical properties of Cu-Sn intermetallic joints rapidly formed by ultrasonic-assisted transient liquid phase soldering," Journal of Alloys and Compounds, vol. 692, pp. 552-557, Jan. 25, 2017.

Liu, J.-C., Wang, Z.-H., Xie, J.-Y., Ma, J.-S., Zhang, G., and Suganuma, K., "Understanding corrosion mechanism of Sn-Zn alloys in NaCl solution via corrosion products characterization," Materials and Corrosion, vol. 67 no. 5, pp. 522-530, May 2016.

Liu, Jiahui, Ma, Haitao, Li, Shuang, Sun, Junhao, Kunwar, Anil, Miao, Wang, Hao, Jianjie, and Bao, Yanpeng, x "The study of interficial reaction during rapidly solidified lead-free solder Sn3.5Ag0.7Cu/Cu laser soldering," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 949-952.

Liu, Jian, Huang, Shi-Hua, Chen, Li-Ping, and He, Lv, "Tin catalyzed silicon nanowires prepared by magnetron sputtering," Materials Letters, vol. 151, pp. 122-125, July 15, 2015.

Liu, Jian-Chun, Xiao, Long, Yue, Zhi-Jun, and Zhang, Gong, "Atomic diffusion of Zn in Sn-Zn based solder joints subjected to high temperature aging," 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, Haining, China, Dec. 14-16, 2017, pp. xx-xx.

Liu, Jian-Chun, Yu, Hong-Jiao, Zhang, Gong, Wang, Zheng-Hong, and Ma, Ju-Sheng, "Constitutive behavior and Anand model of novel lead-free solder Sn-Zn-Bi-In-P," 2014 International Conference on Electronics Packaging , Toyoma, Japan, Apr. 23-25, 2014, pp. 156-161.

Liu, Jian-Chun, and Zhang, Gong, "Effect of trace Mn modification on the microstructure and corrosion behavior of Sn-9Zn solder alloy," Materials and Corrosion, vol. 69 no. 6, pp. 781-792, June 2018.

Liu, Jian-Chun, Wang, Zheng-Hong, Xie, Jing-Yang, Ma, Ju-Sheng, Shi, Qing-Yu, Zhang, Gong, and Suganuma, Katsuaki, "Effects of intermetallic-forming element additions on microstructure and corrosion behavior of Sn-Zn solder alloys," Corrosion Science, vol. 112, pp. 150-159, Nov. 2016.

Liu, Jian-Chun, Zhang, Gong, Wang, Zheng-Hong, Xie, Jing-Yang, Ma, Ju-Sheng, and Suganuma, Katsuaki, "Electrochemical behavior of Sn-xZn lead-free solders in aerated NaCl solution," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 68-73.

Liu, Jian-Chun, Park, SungWon, Nagao, Shijo, Nogi, Masaya, Koga, Hirotaka, Ma, Ju-Sheng, Zhang, Gong, and Suganuma, Katsuaki, "The role of Zn precipitates and Cl- anions in pitting corrosion of Sn-Zn solder alloys," Corrosion Science, vol. 92, pp. 263-271, Mar. 2015.

Liu, Jian-Chun, Zhang, Gong, Ma, Ju-Sheng, and Suganuma, Katsuaki, "Ti addition to enhance corrosion resistance of Sn-Zn solder alloy by tailoring microstructure," Journal of Alloys and Compounds, vol. 644, pp. 113-118, Sept. 25, 2015.

Liu, Jiaxi, Huang, Mingliang, Zhao, Ning, and Zhang, Liwen, "Microstructure and Mechanical Properties of Al/Sn-Zn-X/Cu Solder Joints," 2015 16th International Conference on Electronic Packaging Technology , Changsha, China, Aug. 11-14, 2015, pp. 1267-1270.

Liu, Jibin, Zhou, Wei, Liu, Lijuan, and Wu, Ping, "Cu5Zn8 Growth Reversion in Cu/Sn-8Zn-3Bi/Cu During Discontinuous Electromigration," Journal of Electronic Materials, vol. 41 no. 8, pp. 2045-2050, Aug. 2012.

Liu, Jihou, Zhao, Hongyun, Li, ZhouLin, and Song, Xiaoguo, "The Study of the Growth Behavior of Cu6Sn5 Intermetallic Compound in Cu/Sn/Cu Interconnection System during The Ultrasonic-assisted Transient Liquid Phase Soldering," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 10-13.

Liu, Jinhui, Wang, Haidong, Hu, Yudong, Ma, Weigang, and Zhang, Xing, "Laser flash-Raman spectroscopy method for the measurement of the thermal properties of micro/nano wires," Review of Scientific Instruments , vol. 86, pp. 014901-1-014901-4, 2015.

Liu, Jinming, Guo, Cuiping, Li, Changrong, and Du, Zhenmin, "Thermodynamic optimization of the Ge-Sb and Ge-Sb-Sn systems," Thermochimica Acta, vol. 520 no. 1-2, pp. 38-47, June 10, 2011.

Liu, Johan, Cao, Liqiang, Xie, Min, Goh, Thong-Ngee, and Tang, Yong, "A General Weibull Model For Reliability Analysis Under Different Failure Criteria - Application on Anisotropic conductive adhesive joining technology," 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, Portland, OR, Sept. 12-15, 2004, pp. 191-197.

Liu, Johan, Cao, Liqiang, Xie, Min, Goh, Thong-Ngee, and Tang, Yong, "A General Weibull Model for Reliability Analysis Under Different Failure Criteria- Application on Anisotropic Conductive Adhesive Joining Technology," IEEE Transactions on Electronics Packaging Manufacturing, vol. 28 no. 4 pp. 322-327, Oct. 2005.

Liu, Johan, Tolvgard, Arne, Malmodin, Jens, and Lai, Zonghe, "A Reliable and Environmentally Friendly Packaging Technology - Flip-Chip Joining Using Anisotropically Conductive Adhesive," IEEE Transactions on Components and Packaging Technologies, vol. 22 no. 2, pp. 186-190, June 1999.

Liu, Johan, "ACA Bonding Technology for Low Cost Electronics Packaging Applications - Current Status and Remaining Challenges," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing , Espoo, Finland, June 18-21, 2000, pp. 1-15.

Liu, Johan, "ACA bonding technology for low cost electronics packaging applications - current status and remaining challenges," Soldering & Surface Mount Technology, vol. 13 no. 3, pp. 39-57, 2001.

Liu, Johan, and Morris, James E., "An Internet Course on Conductive Adhesives for Electronics Packaging," 2000 Proceedings 50th Electronic Components & Technology Conference , Las Vegas, NV, May 21-24, 2000, pp. 1016-1020.

Liu, Johan, Lundstrom, Pontus, Gustafsson, Katrin, and Lai, Zonghe, "Conductive Adhesive Joint Reliability Under "Full-cure" Conditions," Advances in Electronic Packaging 1997, Volume 1, Kohala Coast, Hawaii, June 15-19, 1997, pp. 193-199.

Liu, Johan, and Andersson, Christina, "Development of a Web-based Course on Lead Free Solders for Electronics Packaging," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 739-742.

Liu, Johan, Wang, Xitao, and Morris, James E., "Development of an Internet Course on Electrically Conductive Adhesives with Experiments," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 1270-1275.

Liu, Johan. Ljungkrona, Lars, and Lai, Zonghe, "Development of Conductive Adhesive Joining for Surface-Mounting Electronics Manufacturing," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, vol. 18 no. 2, pp. 313-319, May 1995.

Liu, Johan, Boustedt, Katarina, and Lai, Zonghe, "Development of Flip-Chip Joining Technology on Flexible Circuitry Using Anisotropically Conductive Adhesives and Eutectic Solder," 1995 Surface Mount International Conference Proceedings of the Technical Program, San Jose, CA, Aug. 29-31, 1995, pp. 102-109.

Liu, Johan, Wang, Yu, Morris, James, and Kristiansen, Helge, "Development of ontology for the anisotropic conductive adhesive interconnect technology in electronics applications," 2005 IEEE/CPMT 10th International Symposium on Advanced Packaging Materials, Irvine, CA, Mar. 16-18, 2005, pp. 193-208.

Liu, Johan, Rorgren, Roger, and Ljungkrona, Lars, "High Volume Electronics Manufacturing Using Conductive Adhesives for Surface Mounting," Surface Mount International Conference & Exposition Proceedings of the Technical Program, San Jose, CA, Aug. 28-Sept. 1, 1994, pp. 291-302.

Liu, Johan, Cao, Liqiang, Wang, Xitao, and Morris, James E., "Implementation of the Internet Course on Conductive Adhesives for Electronics Packaging," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1502-1506.

Liu, Johan, and Rorgren, Roger, "Joining of displays using thermosetting anisotropically conductive adhesives," Journal of Electronics Manufacturing, vol. 3 no. x, pp. 205-214, 1993.

Liu, Johan, "Life Time Prediction of Anisotropic Conductive Adhesive Joints During Temperature Cycling for Electronics Interconnect," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics , Potsdam, Germany, Oct. 21-24, 2001, pp. 209-212

Liu, Johan, Wang, Yu, Morris, James, and Kristiansen, Helge, "Ontology for the anisotropic conductive adhesive interconnect technology for electronics packaging applications," 7th IEEE CPMT International Conference on High Density Microsystem Design, Packaging and Failure Analysis , Shanghai, June 28, 2005, pp. xx-xx.

Liu, Johan, Lai, Zonghe, Kristiansen, Helge, and Khoo, Cynthia, "Overview of Conductive Adhesive Joining Technology in Electronics Packaging Applications," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 1-18.

Liu, Johan, "Recent Advances in Conductive Adhesives for Direct Chip Attach Applications," The First IEEE International Symposium on Polymeric Electronics Packaging, Oct. 26-30, 1997, pp. 107-122.

Liu, Johan, Andersson, Cristina, Gao, Yulai, and Zhai, Qijie, "Recent Development of Nano-solder Paste for Electronics Interconnect Applications," 2008 10th Electronics Packaging Technology Conference , Singapore, Dec. 9-12, 2008, pp. 84-93.

Liu, Johan, and Lai, Zonghe, "Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 Substrate," Journal of Electronic Packaging, Transactions of the ASME , vol. 124 no. 3, pp. 240-245, Sept. 2002,

Liu, Johan, and Lai, Zonghe, "Reliability of Flip-Chip Anisotropically Conductive Adhesive Joints on an FR-4 Substrate," Advances in Electronic Packaging 1999, Volume 2 (EEP-Vol. 26-2), Maui, Hawaii, June 13-19, 1999, pp. 1691-1696.

Liu, Johan, Gustafsson, Katrin, Lai, Zonghe, and Li, Changhai, "Surface Characteristics, Reliability, and Failure Mechanisms of Tin/Lead, Copper, and Gold Metallizations," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 20 no. 1, pp. 21-30, Mar. 1997.

Liu, Junpeng, Redei, Richard, Qi, Siyuan, Hutt, David A., and Whalley, David, "Electrical Performance of Isotropic Conductive Adhesives with Copper and Copper Coated Iron Fillers," 2014 IEEE 16th Electronics Packaging Technology Conference, Singapore, Dec. 3-5, 2014, pp. 531-535.

Liu, Ken, "RoHS Brings Glee to Some and Gloom to Others in Taiwan Electronics Parts Sector," CENS.com, Jan. 5, 2007.

Liu, L., Li, J. F., Zhao, S., and Zhou, Y. H., "Redetermination of the Eutectic Composition of the Co-Sn Binary Alloy," Journal of Phase Equilibria and Diffusion, vol. xx no. x, pp. xx-xx, xxxx.

Liu, Lei, Shen, Daozhi, Zou, Guisheng, Peng, Peng, and Zhou, Y., "Cold welding of Ag nanowires by large plastic deformation," Scripta Materialia, vol. 114, pp. 112-116, Mar. 15, 2016.

Liu, Li, Zhou, Longzao, and Liu, Changqing, "Electroless Ni-W-P Alloy as a Barrier Layer between Zn-based High Temperature Solders and Cu Substrates," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 1348-1353.

Liu, Li, Zhang, Han, Zheng, Hao, Peng, Juan, Gong, Pan, Wang, Xuanguo, Chen, Zhiwen, and Cao, Xueqiang, "Influence of crystalline structure on diffusion barrier property of electroless Ni-Fe-P coatings in Zn-Al solder interconnects," Journal of Alloys and Compounds, vol. 804, pp. 42-48, Oct. 5, 2019.

Liu, Li, Wang, Jing, Liu, Changqing, Cui, Jinzi, Zhou, Zhaoxia, and Johnson, R. Wayne, "Interfacial Reaction and Microstructural Evolution between Au-Ge Solder and Electroless Ni-W-P Metallization in High Temperature Electronics Interconnects," 2017 IEEE 67th Electronic Components and Technology Conference, Orlando, FL, May 30-June 2, 2017, pp. 417-422.

Liu, Li, Mirgkizoudi, Maria, Zhang, Peng, Zhou, Longzao, and Liu, Changqing, "Mechanical and Interfacial Characteristics of Zn-Al Solder Joints under Elevated Temperature and Vibration Conditions," 2014 Electronics System-Integration Technology Conference, Helsinki, Finland, Sept. 16-18, 2014, pp. xx-xx.

Liu, Li, Chen, Zhiwen, Liu, Changqing, Wu, Yiping, and An, Bing, "Micro-mechanical and fracture characteristics of Cu6Sn5 and Cu3Sn intermetallic compounds under micro-cantilever bending," Intermetallics , vol. 76, pp. 10-17, Sept. 2016.

Liu, Liangbin, Lu, Kailing, Wang, Tao, Liao, Fan, Peng, Mingfa, and Shao, Mingwang, "Flexible piezoelectric nanogenerators based on silicon nanowire/a-quartz composites for mechanical energy harvesting," Materials Letters, vol. 160, pp. 222-226, Dec. 1, 2015.

Liu, Libin, Andersson, Cristina, and Liu, Johan, "Thermodynamic Assessment of the Sn-Co Lead-Free Solder System," Journal of Electronic Materials, vol. 33 no. 9, pp. 935-939, Sept. 2004.

Liu, Libin, Andersson, Cristina, Liu, Johan, and Chan, Y. C., "Thermodynamic Assessment of Sn-Co-Cu Lead-Free Solder Alloy," Advances in Electronic Packaging 2003, Volume 1, Maui, Hawaii, July 6-11, 2003, pp. 141-145.

Liu, Lifeng, and Bao, Xiao-Qing, "Silicon nanowires fabricated by porous gold thin film assisted chemical etching and their photoelectrochemical properties," Materials Letters , vol. 125, pp. 28-31, June 15, 2014.

Liu, Lijuan, Wu, Ping, and Zhou, Wei, "Effects of Cu on the interfacial reactions between Sn-8Zn-3Bi-xCu solders and Cu substrate," Microelectronics Reliability, vol. 54 no. 1, pp. 259-264, Jan. 2014.

Liu, Lijuan, Zhou, Wei, Zhang, Hongbo, Li, Baoling, and Wu, Ping, "Electromigration behavior in Cu/Sn-8Zn-3Bi/Cu solder joint," Microelectronics Reliability, vol. 50 no. 2, pp. 251-257, Feb. 2010.

Liu, Lijuan, Zhou, Wei, Li, Baoling, and Wu, Ping, "Interfacial Reactions between Sn-8Zn-3Bi-xAg Lead-free Solders and Cu Substrate," Materials Chemistry and Physics, vol. 123 no. 2-3, pp. 629-633, Oct. 1, 2010.

Liu, Lijuan, Zhou, Wei, Mu, Wenkai, and Wu, Ping, "Interfacial Reactions of Sn-3.5Ag-xZn Solders and Cu Substrate During Liquid-State Aging," Journal of Electronic Materials, vol. 40 no. 3, pp. 306-314, Mar. 2011.

Liu, Lilin, Fu, Ran, Liu, Deming, and Zhang, Tongyi, "A Novel PPF Technique--Sn-PPF: Effects of In-Situ Formation Cu-Sn-Ni Intermetallic Nano-Layer on Electronic Packaging Performances," Advanced Electronic Packaging (Materials Research Society Symposium Proceedings Volume 968), Boston, MA, Nov. 27-30, 2006, pp. xx-xx.

Liu, Lilin, Huang, Haiyou, Fu, Ran, Liu, Deming, and Zhang, Tong-Yi, "Cu diffusion kinetics in (Cu, Ni)3Sn intermetallic compound nanolayers investigated by an Energy-Dispersive-X-ray-based permeation test," Thin Solid Films, vol. 518 no. 1, pp. 201-205, Nov. 2, 2009.

Liu, Lilin, Huang, Haiyou, Fu, Ran, Liu, Deming, and Zhang, Tong-Yi, "DO22-(Cu,Ni)3Sn intermetallic compound nanolayer formed in Cu/Sn-nanolayer/Ni structures," Journal of Alloys and Compounds, vol. 486 no. 1-2, pp. 207-211, Nov. 3, 2009.

Liu, Lilin, Liu, Deming, Fu, Ran, Kwan, Yiu Fai, Yau, Chun Ho, and Zhang, Tong-Ti, "Epitaxy-Like Protective Layers for High-Performance Low-Cost Au/Pd/Ni Preplated Cu Alloy Leadframes," IEEE Transactions on Advanced Packaging , vol. 29 no. 4, pp. 683-689, Nov. 2006.

Liu, Lijuan, Zhou, Wei, Li, Baoling, and Wu, Ping, "Interfacial Reactions between Sn-8Zn-3Bi-xAg Lead-free Solders and Cu Substrate," Journal of Alloys and Compounds, vol. xxx no. xxx, pp. xx-xx, xxxx.

Liu, Lijun, Zhao, Xiuchen, Chen, Ping, Liu, Ying, Wang, Yong, Chen, Weiwei, and Wu, Jiaqi, "Effects of a-Fe2O3 Additions on Assembly Reliability of Electroplated Sn-Based Solder Cap on Cu Pillar Bump During Thermal Cycling," Journal of Electronic Materials, vol. 48 no. 2, pp. 1079-1090, Feb. 2019.

Liu, Lok Lok, Chan, Chun Man, Chan, Chit Yiu, and Yee, Kwok Wai, "Palladium Deactivation Pretreatment Process for Electroless Nickel Immersion Gold Process (ENIG): Elimination of Metal Plating at Non-Plated Through Holes (NPTH)," 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 22-24, 2014, pp. 263-266.

Liu, Lu, and Yao, Yao, "Micromechanical modeling of the cyclic behavior of Sn-0.7Cu solder based on micromechanical polycrystalline approach," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 197-202.

Liu, Lu-Min, Lindauer, Greg, Alexander, W. Brock, and Holloway, Paul H., "Surface preparation of ZnSe by chemical methods," Journal of Vacuum Science & Technology B: Nanotechnology and Microelectronics: Materials, Processing, Measurement and Phenomena, vol. 13 no. 6, pp. 2238-2244, Nov./Dec. 1995.

Liu, Luwei, and Huang, Mingliang, "Effect of Solder Volume on Interfacial Reactions between Sn3.5Ag0.75Cu Solder Balls and Cu Pad," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 299-304.

Liu, Luwei, Huang, Mingliang, Yang, Fan, and Liu, Ting, "Effect of Solder Volume on Interfacial Reaction between Sn-3Ag-0.5Cu Solder Ball and Cu Pad after Multiple Reflows," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging , Shanghai, China, Aug. 8-11, 2011, pp. 327-332.

Liu, Mary, and Yin, Wusheng, "Solder Joint Encapsulate Adhesive-PoP TMV High Reliability and Low Cost Assembly Solution," SMTA International 2013 Conference Proceedings , Fort Worth, TX, Oct. 13-17, 2013, pp. 933-938.

Liu, Meng, and Xian, Ai-Ping, "Spontaneous growth of whiskers on RE-bearing intermetallic compounds of Sn-RE, In-RE, and Pb-RE," Journal of Alloys and Compounds, vol. 486 no. 1-2, pp. 590-596, Nov. 3, 2009.

Liu, Meng, and Xian, AiPing, "TEM observation of tin whisker," Science China Technological Sciences , vol. 54 no. 6, pp. 1546-1550, 2011.

Liu, Meng, and Xian, Ai-Ping, "Tin whisker growth on bulk Sn-Pb eutectic doping with Nd," Microelectronics Reliability, vol. 49 no. 6, pp. 667-672, June 2009. https://doi.org/10.1016/j.microrel.2009.03.012

Liu, Meng, and Xian, Ai-Ping, "Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition," Journal of Electronic Materials, vol. 38 no. 11, pp. 2353-2361, Nov. 2009.

Liu, Ming, Ma, Limin, Guo, Fu, Wang, Yishu, and Han, Jing, "Hetero-connecting materials effect on the electromigration and thermalmigration of SnBi solder joints," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 109-111.

Liu, Moumiao, Yang, Wenchao, Ma, Yueyuan, Tang, Chenghuang, Tang, Hongqun, and Zhan, Yongzhong, "The electrochemical corrosion behavior of Pb-free Sn-8.5Zn-XCr solders in 3.5 wt.% NaCl solution," Materials Chemistry and Physics, vol. 168, pp. 27-34, Nov. 15, 2015.

Liu, Nai-Shuo, and Lin, Kwang-Lung, "Evolution of interfacial morphology of Sn-8.5Zn-0.5Ag-0.1Al-xGa/Cu system during isothermal aging," Journal of Alloys and Compounds, vol. 456 no. 1-2, pp. 466-473, May 29, 2008.

Liu, Nai-Shuo, and Lin, Kwang-Lung, "The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu," Scripta Materialia, vol. 54 no. 2, pp. 219-224, Jan. 2006.

Liu, P. L., and Shang, J. K., "Fracture of SnBi/Ni(P) interfaces," Journal of Materials Research , vol. 20 no. 4, pp. 818-826, Apr. 2005.

Liu, P., Cheng, L., and Zhang, Y.-W., "Interface Delamination in Plastic IC Packages Induced by Thermal Loading and Vapor Pressure - A Micromechanics Model," IEEE Transactions on Advanced Packaging, vol. 26 no. 1, pp. 1-9, Feb. 2003.

Liu, P. L., and Shang, J. K., "Interfacial embrittlement by bismuth segregation in copper/tin-bismuth Pb-free solder interconnect," Journal of Materials Research, vol. 16 no. 6, pp. 1651-1659, June 2001.

Liu, P. L., and Shang, J. K., "Segregant-induced cavitation of Sn/Cu reactive interface," Scripta Materialia, vol. 53 no. 6, pp. 631-634, Sept. 2005.

Liu, Peisheng, and Huang, Jinxin, "The fatigue life analysis of conductive adhesive," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 804-808.

Liu, Peng, Gao, Yuan, Cao, Qian, Xia, Zhidong, Lei, Yongping, and Guo, Fu, "Effect of Ramp Rate on Microstructure and Properties of Thermomechanically-Fatigued Sn-3.5Ag Based Composite Solder Joints," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Liu, Peng, and Guo, Fu, "Effects of Ni Particle Addition on Microstructure and Properties of SnAg Based Composite Solders," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 717-721.

Liu, Pi Lin, and Shang, Jian Ku, "Influence of Microstructure on Fatigue Crack Growth Behavior of Sn-Ag Solder Interfaces," Journal of Electronic Materials, vol. 29 no. 5, pp. 622-627, May 2000.

Liu, Pilin, Overson, Alan, and Goyal, Deepak, "A comparison study of Cu dissolution mechanism and kinetics in solder joints under electromigration and extended reflow," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 440-447.

Liu, Pilin, Overson, Alan, and Goyal, Deepak, "Electromigration induced interfacial microstructure evolution of solder joints in electronic packaging," 2020 IEEE 70th Electronic Components and Technology Conference, Lake Buena Vista, AL, May 26-29, 2020, pp. 473-478.

Liu, Pilin, Chavali, Chaitra, Overson, Alan, and Goyal, Deepak, "Failure Mechanism and Kinetics Studies of Electroless Ni-P Dissolution in Pb-Free Solder Joints under Electromigration," 2017 IEEE 67th Electronic Components and Technology Conference, Orlando, FL, May 30-June 2, 2017, pp. 441-447.

Liu, Pilin, Overson, Alan, and Goyal, Deepak, "Key Parameters for Fast Ni Dissolution during Electromigration of Sn0.7Cu Solder Joint," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 99-105.

Liu, Pilin, Lin, Cyber, Pathangey, Balu, and Goyal, Deepak, "The mechanism of dense interfacial voids and its impact on solder joint reliability," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 1128-1134.

Liu, Ping, Yao, Pei, and Liu, Jim, "Effect of SiC Nanoparticle Additions on Microstructure and Microhardness of Sn-Ag-Cu Solder Alloy," Journal of Electronic Materials, vol. 37 no. 6, pp. 874-879, June 2008.

Liu, Ping, Yao, Pei, and Liu, Jim, "Effects of multiple reflows on interfacial reaction and shear strength of SnAgCu and SnPb solder joints with different PCB surface finishes," Journal of Alloys and Compounds, vol. 470 no. 1-2, pp. 188-194, Feb. 20, 2009.

Liu, Ping, Yao, Pei, and Liu, Jim, "Evolutions of the interface and shear strength between SnAgCu-xNi solder and Cu substrate during isothermal aging at 150 °C," Journal of Alloys and Compounds, vol. 486 no. 1-2, pp. 474-479, Nov. 3, 2009.

Liu, Ping, Gu, Xiaolong, Fu, Haifeng, and Liu, Yang, "The Effects of Cu Nanoparticles addition in Sn-3.0Ag-0.5Cu Solder Paste on the Microstructure and Shear Strength of the Solder Joints," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 852-855.

Liu, Qian, Shu, Yutian, Ma, Limin, and Guo, Fu, "Study of microstructure evolution and temperature distribution in eutectic SnBi solder joints under high current density," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 907-911.

Liu, Qunfeng, Wang, Liang, and She, Shengping, "Effect of surface roughness on elastic limit of silicon nanowires," Computational Materials Science, vol. 101, pp. 267-274, Apr. 15, 2015.

Liu, Rongxue, Jia, Peng, Li, Mingyang, Geng, Haoran, and Leng, Jinfeng, "Structure transition of Sn57Bi43 melt and its thermodynamic and kinetic characteristics," Materials Letters, vol. 145, pp. 108-110, Apr. 15, 2015.

Liu, S., and Mei, Y. H., "Effects of Voids and Their Interactions on SMT Solder Joint Reliability," Soldering & Surface Mount Technology, vol. 6 no. 3, pp. 21-32, 1994.

Liu, S. H., Chen, Chih, Liu, P. C., and Chou, T., "Tin whisker growth driven by electrical currents," Journal of Applied Physics, vol. 95 no. 12, pp. 7742-7747, June 15, 2004. https://doi.org/10.1063/1.1712019

Liu, Sheng, Zhang, Wen-Hua, and Li, Can, "Colloidal synthesis and characterization of CdSe/CdTe core/shell nanowire heterostructures," Journal of Crystal Growth, vol. 336 no. 1, pp. 94-100, Dec. 1, 2011.

Liu, Sheng, and Dai, Jiabin, "On the Popcorning Mechanics of Plastic Packages," Advances in Electronic Packaging 1999, Volume 2, Maui, Hawaii, June 13-19, 1999, pp. 2023-2030.

Liu, Shengfa, Song, Tianjie, Xiong, Wenyong, Liu, Li, Liu, Zhangyang, and Huang, Shangyu, "Effects of Ag on the microstructure and shear strength of rapidly solidified Sn-58Bi solder," Journal of Materials Science: Materials in Electronics , vol. 30 no. 7, pp. 6701-6707, Apr. 2019.

Liu, Shengfa, Hu, Zhebing, Xiong, Jieran, Tan, Guanghua, Xiong, Wenyong, Chen, Chen, and Huang, Shangyu, "Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints," Journal of Electronic Materials, vol. 46 no. 11, pp. 6373-6380, Nov. 2017.

Liu, Shengfa, Liu, Zhangyang, Liu, Li, Song, Tianjie, Liu, Wei, Tan, Yingzhen, San, Zhanyi, and Huang, Shangyu, "Electromigration behavior of Cu/Sn-58Bi-1Ag/Cu solder joints by ultrasonic soldering process," Journal of Materials Science: Materials in Electronics, vol. 31 no. 15, pp. 11997-12003, Aug. 2020.

Liu, Shengfa, Hu, Zhebing, Xiong, Jieran, Tan, Guanghua, Xiong, Wenyong, Chen, Chen, and Huang, Shangyu, "Erratum to: Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints," Journal of Electronic Materials, vol. 46 no. 11, pp. 6737, Nov. 2017.

Liu, Shengfa, Zhang, Dongxiao, Xiong, Jieran, Chen, Chen, Song, Tianjie, Liu, Li, and Huang, Shangyu, "Microstructure evolution and properties of rapidly solidified Au-20Sn eutectic solder prepared by single-roll technology," Journal of Alloys and Compounds, vol. 781, pp. 873-882, Apr. 15, 2019.

Liu, Shengfa, Xiong, Wenyong, Xiong, Jieran, Tan, Guanghua, Hu, Zhebing, Chen, Chen, and Huang, Shangyu, "Refinement Mechanism of Bi Addition on the Microstructure of Rapidly Solidified Sn-3.5Ag Eutectic Solder for Microelectronic Packaging," Journal of Electronic Materials, vol. 47 no. 9, pp. 5588-5594, Sept. 2018.

Liu, Shiqian, McDonald, Stuart, Sweatman, Keith, and Nogita, Kazuhiro, "The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: Review," Microelectronics Reliability, vol. 84, pp. 170-180, May 2018.

Liu, Shoufu, Huang, Chunyue, Wei, Wei, Xie, Jun, and Laing, Ying, "Finite element analysis and optimization of stress and strain of QFN solder joints under three-point bending," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Liu, Shuang, Hu, Bingkun, Hu, Yang, Wang, Qian, Li, Liangliang, "Dependence of shear strength of Sn-3.8Ag-0.7Cu/Co-P solder joints on the P content of Co-P metallization," Journal of Materials Science: Materials in Electronics, vol. 30 no. 5, pp. 5249-5256, Mar. 2019.

Liu, Shuang, Xue, Song-bai, Xue, Peng, and Luo, Dong-xue, "Present status of Sn-Zn lead-free solders bearing alloying elements," Journal of Materials Science: Materials in Electronics, vol. 26 no. 7, pp. 4389-4411, July 2015.

Liu, Shuang, Xue, Song-bai, Zhong, Su-juan, Pei, Ying-ying, and Sun, Hua-wei, "Properties and microstructure of Sn-0.7Cu-0.05Ni lead-free solders with rare earth Nd addition," Journal of Materials Science: Materials in Electronics, vol. 30 no. 2, pp. 1400-1410, Jan. 2019.

Liu, Shuang, and Xue, Song-bai, "Reliability study of lead-free solders under specific conditions," Journal of Materials Science: Materials in Electronics, vol. 26 no. 12, pp. 9424-9442, Dec. 2015.

Liu, Sihan, Liu, Fang, Li, Zhe, Xu, Guangchen, and Guo, Fu, "Effects of Joule Heating on the Impact Behavior of Lead-free Sn-based Solder Joints," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 652-656.

Liu, Sihan, Ma, Limin, Shu, Yutian, Zuo, Yong, and Guo, Fu, "Effects of POSS-Silanol Addition on the Whisker Formation in Sn3.0Ag0.5Cu Pb-Free Solder," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 765-768.

Liu, Sihan, Ma, Limin, Shu, Yutian, Subramanian, K. N., Lee, Andre, and Guo, Fu, "Effects of POSS-Silanol Addition on Whisker Formation in Sn-Based Pb-Free Electronic Solders," Journal of Electronic Materials, vol. 43 no. 1, pp. 26-32, Jan. 2014.

Liu, Sihan, Xu, Guangchen, and Guo, Fu, "Phase Segregation under Reversed Current Stressing in Eutectic Sn-based Solder Joints," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 815-818.

Liu, T. S., "Aspects of Gold-Tin Bump-Lead Interconnection Metallurgy," Proceedings of the 1977 International Microelectronics Symposium, Baltimore, MD, Oct. 24-26, 1977, pp. 120-126.

Liu, Tao-Chi, Liu, Chien-Min, Huang, Yi-Sa, Chen, Chih, and Tu, King-Ning, "Eliminate Kirkendall voids in solder reactions on nanotwinned copper," Scripta Materialia, vol. xx no. xx, pp. xx-xx, xxxx.

Liu, Tian-Han, Liu, Zhi-Gao, Qin, Hong-Bo, and Chen, Zhong, "Determining the stress-strain relation of eutectic Sn58Bi alloy by nanoindentation combined with reverse analysis," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Liu, Tianxiang, Liu, Geng, Xie, Qin, and Wang, Q. Jane, "An EFG-FE Coupling Method for Microscale Adhesive Contacts," Journal of Tribology, vol. 128 no. 1, pp. 40-48, Jan. 2006.

Liu, Ting, Ding, Dongyan, Hu, Yu, and Gong, Yihua, "Effect of Interfacial Reaction on Tin Whisker Formation of Sn/Ni Films Deposited on Copper Lead-frame," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1005-1009.

Liu, Ting, Huang, Mingliang, and Zhao, Ning, "Interfacial Reactions between Cu Single Crystals and Lead-free Solders during Solid-State Aging," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 494-498.

Liu, Ting, Ding, Dongyan, Galuschki, Klaus-Peter, Hu, Yu, Gong, Yihua, and Shen, Ming, "Ni Barrier-Induced Cracks in Matte Sn Films," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 5, pp. 731-738, May 2012.

Liu, Ting, Ding, Dongyan, Wang, Yiqing, Hu, Yu, Gong, Yihua, and Galuschki, Klaus-Peter, "Ni Barrier for Tin Whisker Mitigation," 2012 2nd IEEE CPMT Symposium Japan, Kyoto, Japan, Dec. 10-12, 2012, pp. xx-xx.

Liu, Ting, Wang, Yiqing, Ding, Dongyan, Galuschki, Klaus-Peter, Hu, Yu, Gong, Yihua, Li, Ming, and Mao, Dali, "Tin Whisker Formation on Electroless Tin Films Deposited on Lead-frame Alloys," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 810-814.

Liu, Ting, Ding, Dongyan, Wang, Yiqing, Hu, Yu, Gong, Yihua, and Galuschki, Klaus-Peter, "Tin Whisker Growth on Bright Sn Films Supported by Lead-frame Alloy Substrates," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1145-1149.

Liu, Ting, Ding, Dongyan, Hu, Yu, and Gong, Yihua, "Tin whisker growth on electroplated Sn multilayers," Journal of Materials Science: Materials in Electronics, vol. 26 no. 9, pp. 6411-6418, Sept. 2015.

Liu, Ting, Ding, Dongyan, Hu, Yu, and Gong, Yihua, "Tin Whisker Growth on Electroplating Sn Bilayer," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 931-936.

Liu, Van, Keck, Joanna, Page, Erin, and Lee, Ning-Cheng, "Voiding and Reliability of BGA Assemblies with SAC and 57Bi42Sn1Ag Alloys," SMTA China East 2014 Proceedings, Shanghai, China, Apr. 23-25, 2014, pp. xx-xx.

Liu, W., Liou, J. J., Jiang, Y., Singh, N., Lo, G. Q., Chung, J., and Jeong, Y. H., "Investigation of Sub-10-nm Diameter, Gate-All-Around Nanowire Field-Effect Transistors for Electrostatic Discharge Applications," IEEE Transactions on Nanotechnology, vol. 9 no. 3, pp. 352-354, May 2010.

Liu, W., Zhang, M., Lin, Q. P., Gao, Y. C., Zhang, Z. Y., Zhang, T. Z., Zi, C. F., and Guo, L. C., "Research on SnSbNi solder joints between light emitting diode chip and heat sink," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1188-1191.

Liu, W., Qian, X. X., and Lin, J. T., "Study on the SnAgCu solder joint between LED chip and heat sink," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 1174-1177.

Liu, W., Zschack, P., Tischler, J., Ice, G., and Larson, B., "X-ray Laue Diffraction Microscopy in 3D at the Advanced Photon Source," AIP Conference Proceedings, vol. 1365, pp. 108-111, 2011. https://doi.org/10.1063/1.3625316

Liu, Wei, An, Rong, Wang, Chunqing, and Tian, Yanhong, "Effect of Au-Sn IMCs' Formation and Morphologies on Shear Properties of Laser Reflowed Micro-solder Joints," Soldering & Surface Mount Technology , vol. 27 no. 1, pp. xx-xx, 2015.

Liu, Wei, Wang, Chunqing, Li, Mingyu, and Ling, Li, "Comparison of AuSnx IMCs's Morphology, Distribution in Lead-free Solder Joints Fabricated by Laser and Hot Air Reflow Process," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Liu, Wei, Wang, Yiping, Wang, Chunqing, and Tian, Yanhong, "Copper-tin Reaction and Preparation of Microsolder Joints under High Frequency Alternating Magnetic Field," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1592-1594.

Liu, Wei, Wang, Chunqing, Sun, Lining, Tian, Yanhong, and Chen, Yarong, "Effect of Cu Addition in Sn-containing Solder Joints on Interfacial Reactions with Au Foils," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 642-645.

Liu, Wei, Wang, Chunqing, Li, Mingyu Li, and Ling, Li, "Effect of Laser Input Energy on Wetting Areas of Solder and Formation of Intermetallic Compounds at Sn-3.5Ag-0.75Cu/Au Right-angled Joint Interface," Proceedings of 2005 International Conference on Asian Green Electronics , Shang Hai, China, Mar. 15-18, 2005, pp. 197-201.

Liu, Wei, Nie, Yuzhuo, Wang, Chunqing, and Tian, Yanhong, "Effect of Multilayer Films and Current on IMC Formation in Solder Joints," 2017 18th International Conference on Electronic Packaging Technology , Harbin, China, Aug. 16-19, 2017, pp. 1561-1563.

Liu, Wei, Wang, Chunqing, Sun, Lining, and Tian, Yanhong, "Effect of Protection Atmosphere's Temperature on Morphology of Au-Sn IMCs in Laser Reflowed Micro-solder Joints," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 442-445.

Liu, Wei, Wang, Chun-qing, Tian, Yan-hong, and Chen, Ya-rong, "Effect of Zn addition in Sn-rich alloys on interfacial reaction with Au foils," Transactions of Nonferrous Metals Society of China, vol. 18 no. 3, pp. 617-622, June 2008.

Liu, Wei-Wei, Weng, Berdy, Li, Jerry, and Yeh, Cing-Kun, "FCCSP IMC Growth under Reliability Stress Following Automotive Standards," Journal of Microelectronics and Electronic Packaging, vol. 16 no. 1, pp. 21-27, Jan. 2019.

Liu, Wei, Tian, Yanhong, Wang, Chunqing, and Sun, Lining, "Formation of AuSnx IMCs in Sn3.5Ag0.75Cu micro-solder joints fabricated by laser and hot air reflow processes," Journal of Materials Science: Materials in Electronics, vol. 24 no. 1, pp. 217-223, Jan. 2013.

Liu, Wei De, Li, Ze Ming, Ling, Song Wen, Zhang, Wen Jie, and Wu, Chi kwan, "Introduction to Conductive Adhesive Film Technology," 2010 Asia-Pacific Symposium on Electromagnetic Compatibility, Beijing, China, Apr. 12-16, 2010, pp. 1664-1667.

Liu, Wei, Tian, Yanhong, Wang, Chunqing, Wang, Xuelin, and Liu, Ruiyang, "Morphologies and grain orientations of Cu-Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints," Materials Letters, vol. 86, pp. 157-160, Nov. 1, 2012.

Liu, Wei, Tian, Yanhong, Yang, Lei, Wang, Chunqing, and Sun, Lining, "Oxidation and Au-Sn reaction of laser reflowed micro-solder joints protected by N2 or exposed to air atmosphere," Soldering & Surface Mount Technology, vol. 24 no. 3, pp. xx-xx, 2012.

Liu, Wei, Wang, Chunqing, Tian, Yanhong, and Kong, Lingchao, "Sagging Phenomenon of Micro-Solder Joints Fabricated by Laser Reflow Process," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Liu, Wei, Wang, Chunqing, Li, Mingyu, Tian, Yanhong, and Guan, Jingwei, "The Effects of Laser Reflow Conditions on the Formation of Intermetallic Compounds at Sn3.0Ag0.5Cu Solder/Cu Jjoint Interface," Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, China, June 30-July 3, 2004, pp. 70-73.

Liu, Weifeng, Pecht, Michael G., and Xie, Jingsong, "Fundamental Reliability Issues Associated with a Commercial Particle-in- Elastomer Interconnection System," IEEE Transactions on Components and Packaging Technologies, vol. 24 no. 3, pp. 520-525, Sept. 2001.

Liu, Weiping, Lee, Ning-Cheng, Porras, Adriana, Ding, Min, Gallagher, Anthony, Huang, Austin, Chen, Scott, and Lee, Jeffrey ChangBing, "Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn or Ce Doping," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 994-1007.

Liu, Weiping, Lee, Ning-Cheng, Porras, Adriana, Ding, Min, Gallagher, Anthony, Huang, Austin, Chen, Scott, and Lee, Jeffrey ChangBing, "Achieving High Reliability Low Cost Lead-Free SAC Solder Joints via Mn or Ce Doping," 2009 AIMS Harsh Environments Electronics Symposium, San Diego, CA, Oct. 5-6, 2009, pp. 920-934.

Liu, Weiping, Lee, Ning-Cheng, Porras, Adriana, Ding, Min, Gallagher, Anthony, Huang, Austin, Chen, Scott, and Lee, Jeffrey ChangBing, "Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn or Ce Doping," SMTAnews & Journal of Surface Mount Technology, vol. 22 no. 4, pp. 29-40, Oct.-Dec. 2009.

Liu, Weiping, Lee, Ning-Cheng, Porras, Adriana, Ding, Min, Gallagher, Anthony, Huang, Austin, Chen, Scott, and Lee, Jeffrey ChangBing, "Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S23_02-1-S23_02-23.

Liu, Weiping, Lee, Ning-Cheng, Bagheri, Simin, Snugovesky, Polina, Bragg, Jason, Brush, Russell, and Harper, Blake, "Drop Test Performance of Bga Assembly Using Sac105ti Solder Spheres," IPC APEX Expo 2012, San Diego, CA, Feb. 28-Mar. 1, 2012, pp. xx-xx.

Liu, Weiping, Lee, Ning-Cheng, Bagheri, Simin, Snugovesky, Polina, Bragg, Jason, Brush, Russell, and Harper, Blake, "Drop test performance of BGA assembly using SAC105Ti solder sphere," Global SMT and Packaging, vol. 12 no. 7, pp. 12-17, July 2012.

Liu, Weiping, Lee, Ning-Cheng, Bagheri, Simin, Snugovsky, Polina, Bragg, Jason, Brush, Russell, and Harper, Blake, "Drop Test Performance of BGA Assembly Using SAC105Ti Solder Spheres," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 142-146.

Liu, Weiping, Lee, Ning-Cheng, Bachorik, Paul, and LaBarbera, Christine, "Effects of Solder Alloy Compositions on Microstructure and Reliability of Die-Attach Solder Joints for Automotive Applications," 2015 IEEE 17th Electronics Packaging and Technology Conference, Singapore, Dec. 2-4, 2015, pp. xx-xx.

Liu, Weiping, and Lee, Ning-Cheng, "Novel Lead-Free Solder Alloys Development for Automotive Applications," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 435-439.

Liu, Weiping, and Lee, Ning-Cheng, "Novel Lead-Free Solder Alloys Development for Automotive Applications," South East Asia Technical Training Conference on Electronics Assembly Technologies 2016 Proceedings, Penang, Malaysia, Apr, 12-14, 2016, pp. xx-xx.

Liu, Weiping, and Lee, Ning-Cheng, "Novel SACX Solders with Superior Drop Test Performance," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 134-147.

Liu, Weiping, Lee, Ning-Cheng, Porras, Adriana, Ding, Min, Gallagher, Anthony, Huang, Austin, Chen, Scott, and Lee, Jeffrey ChangBing, "Shock Resistant and Thermally Reliable Low Ag SAC Solders Doped with Mn Or Ce," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 49-63.

Liu, Weiping, Lee, Ning-Cheng, Bagheri, Simin, Snugovesky, Polina, Bragg, Jason, Brush, Russell, and Harper, Blake, "Superior Drop Test Performance of BGA Assembly Using SAC105Ti Solder Spheres - Virtual fracture analysis," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 405-409.

Liu, Weiping, and Lee, Ning-Cheng, "The Effects of Additives to SnAgCu Alloys on Microstructure and Drop Impact Reliability of Solder Joints," JOM, vol. 59 no. 7, pp. 26-31, July 2007.

Liu, Weiping, Bachorik, Paul, and Lee, Ning-Cheng, "The Superior Drop Test Performance of SAC-Ti Solders and Its Mechanism," 2008 Proceedings 58th Electronic Components & Technology Conference , Lake Buena Vista, FL, May 27-30, 2008, pp. 452-458.

Liu, Weiping, Bachorik, Paul, and Lee, Ning-Cheng, "The Superior Drop Test Performance of SAC-Ti Solders and Its' Mechanism," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 627-635.

Liu, Weiping, Bachorik, Paul, and Lee, Ning-Cheng, "The Superior Drop Test Performance of SAC-Ti Solders and Its Mechanism," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Liu, Weiping, Bachorik, Paul, and Lee, Ning-Cheng, "The Superior Drop Test Performance of SAC-Ti Solders and Its Mechanism," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1046-1053.

Liu, Wen Dar, Lee, Yi Chia, Sekiguchi, Ryo, Yoshida, Yukifumi, Komori, Kana, Wostyn, Kurt, Sebaai, Farid, and Holsteyns, Frank, "Selective Wet Etching in Fabricating SiGe and Ge Nanowires for Gate-all-Around MOSFETs," Solid State Phenomena, vol. 282, pp. 101-106, Aug. 2018.

Liu, Wenning, and Shi, Frank G., "Effect of the Viscoelastic Behavior of Molding Compounds on Crack Propagation in IC packages," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 854-858.

Liu, Wensheng, Wang, Yikai, Ma, Yunzhu, Yu, Qiang, and Huang, Yufeng, "Interfacial microstructure evolution and shear behavior of Au-20Sn/(Sn)Cu solder joints bonded at 250 øC," Materials Science and Engineering: A , vol. 651, pp. 626-635, Jan. 10, 2016.

Liu, Wensheng, Wang, Yikai, Ma, Yunzhu, Huang, Yufeng, and Yu, Qiang, "Interfacial reaction mechanism and kinetics between Au-20Sn and Sn," Journal of Materials Science: Materials in Electronics, vol. 27 no. 6, pp. 5982-5991, June 2016.

Liu, Wensheng, Wang, Yikai, Ma, Yunzhu, Yu, Qiang, and Huang, Yufeng, "Nanoindentation study on micromechanical behaviors of Au-Ni-Sn intermetallic layers in Au-20Sn/Ni solder joints," Materials Science and Engineering: A, vol. 653, pp. 13-22, Jan. 20, 2016.

Liu, X. D., Han, Y. D., Jing, H. Y., Wei, J., and Xu, L. Y., "Effect of graphene nanosheets reinforcement on the performance of SnAgCu lead-free solder," Materials Science and Engineering: A, vol. 562, pp. 25-32, Feb. 1, 2013.

Liu, X. J., Inohana, Y., Takaku, Y., Ohnuma, I., Kainuma, R., Ishida, K., Moser, Z., Gasior, W., and Pstrus, J., "Experimental Determination and Thermodynamic Calculation of the Phase Equilibria and Surface Tension in the Sn-Ag-In System," Journal of Electronic Materials, vol. 31 no. 11, pp. 1139-1151, Nov. 2002.

Liu, X. J., Liu, H. S., Ohnuma, I., Kainuma, R., Ishida, K., Itabashi, S., Kameda, K., and Yamaguchi, K., "Experimental Determination and Thermodynamic Calculation of the Phase Equilibria in the Cu-In-Sn System," Journal of Electronic Materials , vol. 30 no. 9, pp. 1093-1103, Sept. 2001.

Liu, X. J., Wang, C. P., Ohnuma, I., Kainuma, R., and Ishida, K., "Experimental Investigation and Thermodynamic Calculation of the Phase Equilibria in the Cu-Sn and Cu-Sn-Mn Systems," Metallurgical and Materials Transactions A, vol. 35 no. 6, pp. 1641-1654, June 2004.

Liu, X. J., Kinaka, M., Takaku, Y., Ohnuma, I., Kainuma, R., and Ishida, K., "Experimental Investigation and Thermodynamic Calculation of Phase Equilibria in the Sn-Au-Ni System," Journal of Electronic Materials, vol. 34 no. 5, pp. 670-679, May 2005.

Liu, X. J., Wang, C. P., Gao, F., Ohnuma, I., and Ishida, K., "Thermodynamic Calculation of Phase Equilibria in the Sn-Ag-Cu-Ni-Au System," Journal of Electronic Materials, vol. 36 no. 11, pp. 1429-1441, Nov. 2007.

Liu, X. J., Ohnuma, I., Wang, C. P., Jiang, M., Kainuma, R., Ishida, K., Ode, M., Koyama, T., Onodera, H., and Suzuki, T., "Thermodynamic Database on Microsolders and Copper-based Alloy Systems," Journal of Electronic Materials, vol. 32 no. 11, pp. 1265-1272, Nov. 2003.

Liu X. W., and Plumbridge, W. J., "Damage Produced in Solder Alloys during Thermal Cycling," Journal of Electronic Materials, vol. 36 no. 9, pp. 1111-1120, Sept. 2007.

Liu, Xianbing, Tanaka, Masaru, and Matsui, Yasuhiro, "Economic evaluation of optional recycling processes for waste electronic home appliances," Journal of Cleaner Production, vol. 17 no. 1, pp. 53-60, Jan. 2009.

Liu, Xianbing, Tanaka, Masaru, and Matsui, Yasuhiro, "Electrical and electronic waste management in China: progress and the barriers to overcome," Waste Management and Research, vol. 24 no. 1, pp. 92-101, Feb. 2006.

Liu, Xianbing, Tanaka, Masaru, and Matsui, Yasuhiro, "Generation amount prediction and material flow analysis of electronic waste: a case study in Beijing, China," Waste Management and Research, vol. 24 no. 5, pp. 434-445, Oct. 2006.

Liu, Xiangdong, He, Siliang, and Nishikawa, Hiroshi, "Thermally stable Cu3Sn/Cu composite joint for high-temperature power device," Scripta Materialia, vol. 110, pp. 101-104, Jan. 1, 2016.

Liu, Xiao-ying, Ma, Hai-tao, Zhao, Jie, and Wng, Lai, "The Evaluation of Sn-58Bi Composite Solder Mixed with Y2O3," 7th IEEE CPMT International Conference on High Density Microsystem Design, Packaging and Failure Analysis, Shanghai, June 28, 2005, pp. xx-xx.

Liu, Xiaodong, Shang, Jing, Hao, Jianxia, Hu, Anmin, Gao, Liming, and Li, Ming, "Impact of tensile strength on thermal fatigue properties and failure modes of Sn-Ag-Cu-Ni solder joints," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 984-987.

Liu, Xiaojian, and Wang, Ling, "Optimization of Lead-free Wave Soldering Process for Inverter Air-conditioner Motherboard by DOE," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 917-922.

Liu, Xiaoying, Huang, Mingliang, and Zhao, Ning, "Effect of Cu6Sn5 particles on microstructure formation and mechanical properties of Sn-58Bi solder," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 423-425.

Liu, Xiaoying, Huang, Mingliang, Zhao, Ning, and Wang, Lai, "Effect of Fe addition to Sn-3Ag-0.5Cu solder on interfacial reactions during aging," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 400-402.

Liu, Xiaoying, Huang, Mingliang, Wu, C. M. L., and Wang, Lai, "Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder," Journal of Materials Science: Materials in Electronics , vol. 21 no. 10, pp. 1046-1054, Oct. 2010.

Liu, Xiaoying, Huang, Mingliang, Wu, C. M. L., and Wang, Lai, "Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder," Journal of Materials Science: Materials in Electronics , vol. xx no. x, pp. xx-xx, xxxx.

Liu, Xiaoying, Huang, Mingliang, Zhao, Ning, and Wang, Lai, "Liquid-state and solid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu substrate," Journal of Materials Science: Materials in Electronics, vol. 25 no. 1, pp. 328-337, Jan. 2014.

Liu, Xiaoying, Zhao, Yanhui, Huang, Mingliang, Wu, C. M. L., and Wang, Lai, "Liquid-state Interfacial Reactions between Sn-Ag-Cu-Fe Composite Solders and Cu Substrate," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 687-690.

Liu, Xiaoying, Huang, Mingliang, Zhao, Yanhui, Wu, C. M. L., and Wang, Lai, "The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu during soldering," Journal of Alloys and Compounds , vol. 492 no. 1-2, pp. 433-438, Mar. 4, 2010.

Liu, Xing Jun, Yamaki, Tokuro, Ohnuma, Ikuo, Kainuma, Ryosuke, and Ishida, Kiyohito, "Thermodynamic Calculations of Phase Equilibria, Surface Tension and Viscosity in the In-Ag-X (X=Bi, Sb) System," Materials Transactions, vol. 45 no. 3, pp. 637-645, Mar. 2004.

Liu, XingBo, and Huang, Mingliang, "Effect of Sn grain orientation on Ni substrate dissolution and intermetallic compounds precipitation in Cu/Sn/Ni interconnect undergoing electromigration," 2017 18th International Conference on Electronic Packaging Technology , Harbin, China, Aug. 16-19, 2017, pp. 1291-1295.

Liu, Xingsheng, Davis, Ronald W., Hughes, Lawrence C., Rasmussen, Michael H., Bhat, Rajaram, Zah, Chung-En, and Stradling, Jim, "A study on the reliability of indium solder die bonding of high power semiconductor lasers," Journal of Applied Physics, vol. 100 no. 1, pp. 013104-1-013104-11, July 1, 2006.

Liu, Xingsheng, Jing, Xiukuan, and Lu, Guo-Quan, "Chip-Scale Packaging of Power Devices and Its Application in Integrated Power Electronics Modules," IEEE Transactions on Advanced Packaging, vol. 24 no. 2, pp. 206-215, May 2001.

Liu, Xue, Wang, Lifeng, Wang, Jia, and Lv, Ye, "Effects of Ce Addition on Properties of Sn-0.3Ag-0.7Cu Low-Ag Lead-free Solder," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 176-180.

Liu, Xuehua, Tang, Dian, and Wen, Shixue, "Study of Immersion Tin Plating on Copper by Galvanic Couple Current Method," Advanced Materials Research, vol. 154-155, pp. 1053-1058, 2010.

Liu, Y., Singh, R., Poole, K., Diefendorf, R. J., Harriss, J., and Cannon, K., "Characterization of AL-Y alloy thin films deposited by direct current magnetron sputtering," Journal of Vacuum Science & Technology B , vol. 15 no. 6, pp. 1990-1994, Nov./Dec. 1997.

Liu, Y., Sun, F. L., Yan, T. L., and Hu, W. G., x "Effects of Bi and Ni Addition on Wettability and Melting Point of Sn-0.3Ag-0.7Cu Low-Ag Pb-free Solder," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Liu, Y., Sun, F. L., Zhang, H. W., Wang, J., and Zhou, Z., "Evaluating board level solder interconnects reliability using vibration test methods," Microelectronics Reliability, vol. 54 no. 9-10, pp. 2053-2057, Sept.-Oct. 2014.

Liu, Y., and Wang, X. B., "Lead Free Solder Paste Containing SnAgBiIn Alloy: a Preliminary Study," Proceedings of 2004 International IEEE Conference on the Asian Green Electronics, Hong Kong, China, Jan 5-9, 2004, pp. 123-126.

Liu, Y., Zhang, P., Zhang, Y. M., Ding, J., Shi, J. J., and Sun, Z. M., "Spontaneous growth of Sn whiskers and a new formation mechanism," Materials Letters, vol. 178, pp. 111-114, Sept. 1, 2016.

Liu, Y., Zhang, P., Ling, C., Ding, J., Tian, W. B., Zhang, Y. M., and Sun, Z. M., "Spontaneous Sn whisker formation on Ti2SnC," Journal of Materials Science: Materials in Electronics, vol. 28 no. 8, pp. 5788-5795, Apr. 2017.

Liu, Y. C., Teo, J. W. R., Tung, S. K., and Lam, K. H., "High-temperature creep and hardness of eutectic 80Au/20Sn solder," Journal of Alloys and Compounds, vol. 448 no. 1-2, pp. 340-343, Jan. 10, 2008.

Liu, Y., Wang, J., Yin, L., Kondos, P., Parks, C., Borgesen, P., Henderson, D. W., Bliznakov, S., Cotts, E. J., and Dimitrov, N., "Improving Copper Electrodeposition in the Microelectronics Industry," 2008 Proceedings 58th Electronic Components & Technology Conference , Lake Buena Vista, FL, May 27-30, 2008, pp. 2105-2110.

Liu, Y. C., Wan, J. B., and Gao, Z. M., "Intermediate decomposition of metastable Cu5Zn8 phase in the soldered Sn-Ag-Zn/Cu interface," Journal of Alloys and Compounds, vol. 465 no. 1-2, pp. 205-209, Oct. 6, 2008.

Liu, Y. M., and Chuang, T. H., "Interfacial Reactions Between In10Ag Solders and Ag Substrates," Journal of Electronic Materials, vol. 29 no. 11, pp. 1328-1332, Nov. 2000.

Liu, Y. M., and Chuang, T. H., "Interfacial Reactions between Liquid Indium and Au-Deposited Substrates," Journal of Electronic Materials, vol. 29 no. 4, pp. 405-410, Apr. 2000.

Liu, Y. M., Chen, Y. L., and Chuang, T. H., "Interfacial Reactions between Liquid Indium and Silver Substrates," Journal of Electronic Materials, vol. 29 no. 8, pp. 1047-1051, Aug. 2000.

Liu, Y. Q., Jones, W. K., and Shah, M., "Mechanical Properties of Pb/Sn Pb/In and Sn-In Solders," Proceedings of the Technical Program NEPCON West '97, Volume 2, Anaheim, CA, Feb. 23-27, 1997, pp. 719-726,

Liu, Yajun, Wang, Jiang, Du, Yong, Sheng, Guang, Zhang, Lijun, and Liang, Dong, "Study of diffusion and atomic mobilities for fcc Ag-Cd and Ag-Sn solder alloys," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 35 no. 2, pp. 224-230, 2011.

Liu, Yajun, Liang, Dong, and Zhang, Lijun, "Thermodynamic Descriptions for the Sn-Te and Pb-Sn-Te Systems," Journal of Electronic Materials, vol. 39 no. 2, pp. 246-25, Feb. 2010.

Liu, Yan, Manning, William, Huang, Benlih, and Lee, Ning-Cheng, "A Kinetic Approach of Profiling for Voiding Control at Lead Free Reflow Soldering," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Liu, Yan, Bachorik, Paul, Beckwith, Geoffrey, Kresge, Lee, Long, Matthew, Manning, William, Mao, Runsheng, Nieman, Benjamin, and Lee, Ning-Cheng, "China Alloy SnAgCuCe in Reflow Applications," NEPCON Shanghai 2007 , Shanghai, China, Apr. 24-27, 2007, pp. xx-xx.

Liu, Yan, Peng, Yan, Guo, Jingwei, La, Dongsheng, Xu, Zhaopeng, and Wang, Haiyan, "Effect of doped substrates on the growth of GaAs nanowires via metal organic chemical vapor deposition," AIP Advances, vol. 7 no. 8, pp. 085104-1-085104-5, Aug. 2017.

Liu, Yan, Keck, Joanna, Page, Erin, and Lee, Ning-Cheng, "Reliability of BGA Assembled with Lead-Free Low Melting and Medium Melting Mixed Solder Alloys," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1083-1095.

Liu, Yan, Mao, Runsheng, Dasgupta, Arnab, and Lee, Ning-Cheng, "Sealing the Gap of Solder Paste Technology in Lead-Free Halogen-Free Era," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 816-824.

Liu, Yan, Fiacco, Pamela, and Lee, Ning-Cheng, "Testing and Prevention of Head-In-Pillow," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 451-455.

Liu, Yan, Fiacco, Pamela, and Lee, Ning-Cheng, "Testing and Prevention of Head-In-Pillow," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Liu, Yan, Fiacco, Pamela, and Lee, Ning-Cheng, "Testing and Prevention of Head-In-Pillow," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 681-685.

Liu, Yan, Keck, Joanna, Page, Erin, and Lee, Ning-Cheng, "Voiding and Drop Test Performance of Lead-Free Low Melting and Medium Melting Mixed Alloy BGA Assembly," IPC APEX Expo 2014, Las Vegas, NV, Mar. 25-27, 2014, pp. xx-xx.

Liu, Yan, Keck, Joanna, Page, Erin, and Lee, Ning-Cheng, "Voiding and Reliability of BGA Assemblies with SAC and 57Bi42Sn1Ag Alloys," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 604-615.

Liu, Yan, Keck, Joanna, Page, Erin, and Lee, Ning-Cheng, "Voiding and Reliability of BGA Assemblies with SAC and 57Bi42Sn1Ag Alloys," South East Asia Technical Training Conference on Electronics Assembly Technologies 2014 Proceedings, Penang, Malaysia, Apr. 8-10, 2014, pp. xx-xx.

Liu, Yan, Herron, Derrick, Keck, Joanna, and Lee, Ning-Cheng, "Voiding Behavior in Mixed Solder Alloy System," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 870-877.

Liu, Yan, Herron, Derrick, Keck, Joanna, and Lee, Ning-Cheng, "Voiding Mechanism And Control in BGA Joints with Mixed Solder Alloy System," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 1606-1612.

Liu, Yanfen, Zhang, Xuexi, Xing, Dawei, Shen, Hongxian, Qian, Mingfang, Liu, Jingshun, Chen, Dongming, and Sun, Jianfei, "Martensite transformation and superelasticity in polycrystalline Ni-Mn-Ga-Fe microwires prepared by melt-extraction technique," Materials Science and Engineering: A, vol. 636, pp. 157-163, June 11, 2015.

Liu, Yang, Sun, Fenglian, and Liu, Yang, "Characterization of interfacial IMCs in low-Ag Sn-Ag-xCu-Bi-Ni solder joints," Journal of Materials Science: Materials in Electronics, vol. 24 no. 1, pp. 290-294, Jan. 2013.

Liu, Yang, Zhao, Jia, Yuan, Cadmus Chang-Ann, Zhang, Guoqi Q., and Sun, Fenglian, "Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 4 no. 11, pp. 1754-1759, Nov. 2014.

Liu, Yang, Sun, Fenglian, Liu, Yang, and Li, Xuemei, "Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC-Bi-Ni/Cu solder joints," Journal of Materials Science: Materials in Electronics, vol. 25 no. 6, pp. 2627-2633, June 2014.

Liu, Yang, Sun, Fenglian, Zhang, Hao, Xin, Tong, and Zhang, Guoqi, "Failure Mode Analysis for the Solder Joints for the Flip-chip Light Emitting Diodes," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 1018-1021.

Liu, Yang, Meerwijk, Joost, Luo, Liangliang, Zhang, Honglin, Sun, Fenglian, Yuan, Cadmus A., and Zhang, Guoqi, "Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging," Journal of Materials Science: Materials in Electronics, vol. 25 no. 11, pp. 4954-4959, Nov. 2014.

Liu, Yang, Sun, Fenglian, and Liu, Xiaojing, "Improving Sn-0.3Ag-0.7Cu Low-Ag Lead-free Solder Performance by Adding Bi Element," 2010 International Forum on Strategic Technology, Ulsan, South Korea, Oct. 13-15, 2010, pp. 343-346.

Liu, Yang, Sun, Fenglian, Zhang, Hao, Xin, Tong, Yuan, Cadmus A., and Zhang, Guoqi, "Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes," Microelectronics Reliability, vol. 55 no. 8, pp. 1234-1240, July 2015.

Liu, Yang, Li, Shengli, Zhang, Hao, Cai, Hongming, Sun, Fenglian, and Zhang, Guoqi, "Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates," Journal of Materials Science: Materials in Electronics , vol. 29 no. 15, pp. 13167-13175, Aug. 2018.

Liu, Yang, Fu, Haifeng, Sun, Fenglian, Zhang, Hao, Kong, Xiangxia, and Xin, Tong, "Microstructure and mechanical properties of as-reflowed Sn58Bi composite solder pastes," Journal of Materials Processing Technology, vol. 238, pp. 290-296, Dec. 2016.

Liu, Yang, Xu, Ruisheng, Zhang, Hao, and Sun, Fenglian, "Microstructure and shear behavior of solder joint with Sn58Bi/Sn3.0Ag0.5Cu/Cu superposition structure," Journal of Materials Science: Materials in Electronics, vol. 30 no. 15, pp. 14077-14084, Aug. 2019.

Liu, Yang, Sun, Fenglian, Luo, Liangliang, Yuan, Cadmus A., and Zhang, Guoqi, "Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate," Journal of Electronic Materials , vol. 44 no. 7, pp. 2450-2457, July 2015.

Liu, Yang, Sun, Fenglian, Wang, Guojun, and Zou, Pengfei, "Nanoindentation Properties of As-soldered Low-Ag SAC-Bi-Ni/Cu," 2012 7th International Forum on Strategic Technology, Tomsk, Russia, Sept. 18-21, 2012, pp. xx-xx.

Liu, Yang, Sun, Fenglian, and Yang, Miaosen, "Shear Strength and Brittle Failure of low-Ag SAC-Bi-Ni Solder Joints during Ball Shear Test," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 750-753.

Liu, Yang, Sun, Fenglian, and Zou, Pengfei, "Shear Strength and Interfacial Microstructures of Low-Ag SAC/Cu and SAC-Bi-Ni/Cu Solder Joints," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 186-189.

Liu, Yang, Sun, Fenglian, Zhang, Hongwu, and Zou, Pengfei, "Solderability, IMC evolution, and shear behavior of low-Ag Sn0.7Ag0.5Cu-BiNi/Cu solder joint," Journal of Materials Science: Materials in Electronics, vol. 23 no. 9, pp. 1705-1710, Sept. 2012.

Liu, Yang, Zhang, Hao, and Sun, Fenglian, "Solderability of SnBi-nano Cu solder pastes and microstructure of the solder joints," Journal of Materials Science: Materials in Electronics, vol. 27 no. 3, pp. 2235-2241, Mar. 2016.

Liu, Yangming, Yang, Bo, Huang, Shenghua, Ye, Ning, Bhagath, Shrikar, and Shukla, Rama, "Board Level Reliability Enhancement with Considerations of Solder Ball, Substrate and PCB," 2020 IEEE 70th Electronic Components and Technology Conference, Lake Buena Vista, AL, May 26-29, 2020, pp. 249-256.

Liu, Yanli, and Zhang, Jian, "Effect of Etching Temperature on the Growth of Silicon Nanowires," Applied Mechanics and Materials, vol. 138-139, pp. 1082-1088, Nov. 2011.

Liu, Yao-Ren, Song, Jenn-Ming, Lai, Yi-Shao, and Chiu, Ying-Ta, "Effect of minor alloying additions on the BIT reliability of SnAgCu solder joints," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 501-504.

Liu, Yao-Ren, Song, Jenn-Ming, Lai, Yi-Shao, Chiu, Ying-Ta, and Chen, Wei-Ting, "Effect of transition metals on the interfacial reactions in electroless Ni(P)-solder interconnections," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 277-280.

Liu, Yaoping, Wang, Wei, Zhang, Haixia Alice, Wu, Wengang, and Li, Zhihong, "A Facile Nanowire fabrication Approach Based on Edge Lithography," 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Kyoto, Japan, Mar. 5-8, 2012, pp. 49-52.

Liu, Yawei, Huang, Mingliang, Huang, Feifei, and Zhao, Ning, "Effects of Stirring Speed on Composition and Morphology of Non-cyanide Co-electroplating Au-Sn Thin Films," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 1283-1286.

Liu, Ying-Ling, Chang, Gung-Pei, and Wu, Chuan-Shao, "Halogen-Free Flame Retardant Epoxy Resins from Hybrids of Phosphorus- or Silicon-Containing Epoxies with an Amine Resin," Journal of Applied Polymer Science, vol. 102 no. 2, pp. 1071-1077, Oct. 15, 2006.

Liu, Yingxia, Tamura, Nobumichi, Kim, Dong Wook, Gu, Sam, and Tu, K. N., "Effect of Au/Pd Surface Finishing on Metastable Sn Phase Formation in Microbumps," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 810-815.

Liu, Yingxia, Chu, Ying-Ching, and Tu, K. N., "Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 um diameter," Acta Materialia, vol. 117, pp. 146-152, Sept. 15, 2016.

Liu, Yong, Liang, Lihua, Irving, Scott, and Luk, Timwah, "3D Modeling of electromigration combined with thermal-mechanical effect for IC device and package," Microelectronics Reliability, vol. 48 no. 6, pp. 811-824, June 2008.

Liu, Yong, Wang, Qiang, Liang, Lihua, Chen, Xuefan, Irving, Scott, and Luk, Timwah, "A New Prediction Methodology for Electromigration-Induced Solder Degradation in a WL-CSP System," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 269-276.

Liu, Yong, Qian, Qiuxiao, Kim, Jihwan, and Martin, Stephen, "Board Level Drop Impact Simulation and Test for Development of Wafer Level Chip Scale Package," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1186-1194.

Liu, Yong, Martin, Stephen, and England, Luke, "Drop Test Reliability and Design of Wafer-Level Chip-Scale Packages," Chip Scale Review, vol. 14 no. 5, pp. 22-25, Sept./Oct. 2010.

Liu, Yong, Zhang, Yuanxing, and Liang, Lihua, "Prediction of Electromigration Induced Voids and Time to Failure for Solder Joint of a Wafer Level Chip Scale Package," IEEE Transactions on Components and Packaging Technologies, vol. 33 no. 3, pp. 544-552, Sept. 2010.

Liu, You-nian, Wang, Chun-jiang, Shu, Wan-gen, Zeng, Dong-ming, and Chen, Qi-yuan, "Synthesis and Thermal Stability of Antimony Tris (Thioethyl Stearate) for PVC," Journal of Central South University of Technology, vol. 7 no. 3, pp. 146-148, Sept. 2000.

Liu, Yu-chen, Yu, Yung-si, Lin, Shih-kang, and Chiu, Shang-Jui, "Electromigration effect upon single- and two-phase Ag-Cu alloy strips: An in situ study," Scripta Materialia, vol. 173, pp. 134-138, Dec. 2019.

Liu, Yu-Chih, Lin, Wei-Hong, Lin, Hsiu-Jen, and Chuang, Tung-Han, "Intermetallic Reactions in Sn-8Zn-20In Solder Ball Grid Array Packages with Au/Ni/Cu and Ag/Cu Pads," Journal of Electronic Materials, vol. 35 no. 1, pp. 147-153, Jan. 2006.

Liu, Yu-jie, Zhang, Ke-ke, Zhang, Xiao-jiao, Zhao, Kai, Qiu, Ran-feng, and Shi, Hong-xin, "Microstructure and Properties of Sn2.5Ag0.7Cu0.1RE Lead-Free Soldering Joints with Ultrasonic Assisted," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1233-1236.

Liu, Yucheng, Luo, Tingbi, Hu, Anmin, Li, Shangyuan, Wang, Weizhen, and Li, Ming, "Formation and growth of intermetallic compounds of Sn-2Ag-2.5Zn on Cu and Ni substrates," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1240-1243.

Liu, Yucheng, Hu, Anmin, Luo, Tingbi, and Li, Ming, "Interfacial reaction of Sn-2.0Ag-2.5Zn solder on Cu and Ni-W substrates," Journal of Materials Science: Materials in Electronics, vol. 24 no. 3, pp. 1037-1044, Mar. 2013.

Liu, Yueli, Geiger, David A., and Shangguan, Dongkai, "Component Candidacy of Second Side Reflow with Lead-Free Solder," Materials Transactions, vol. 47 no. 6, pp. 1577-1583, 2006.

Liu, Yueli, Geiger, David A., and Shangguan, Dongkai, "Determination of Components Candidacy for Second Side Reflow with Lead-Free Solder," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 1, Orlando, FL, May 31-June 3, 2005, pp. 970-976.

Liu, Yueli, Gale, Shyam, Burts, Tameika, and Johnson, R. Wayne, "Effect of Surface Finish, Reflow Profile and High Temperature Aging on Drop Test Reliability of Lead Free CSPs," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S34-01-1-S34-01-8.

Liu, Yueli, Gale, Shyam, Burts, Tameika, and Johnson, R. Wayne, "High Temperature Aging Affects on Lead Free CSPs Drop Test Reliability," IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies, Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.

Liu, Yueli, Gale, Shyam, and Johnson, R. Wayne, "Investigation of the Role of Void Formation at the Cu-to-Intermetallic Interface on Aged Drop Test Performance," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 1, pp. 63-73, Jan. 2007.

Liu, Yueli, Tian, Guoyun, Gale, Shyam, Johnson, R. Wayne, Lall, Pradeep, and Crane, Larry, "Lead Free Assembly of Chip Scale Packages," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S34-1-1-S34-1-12.

Liu, Yueli, Tian, Guoyun, Gale, Shyam, Johnson, R. Wayne, and Crane, Lawrence, "Lead-Free Chip Scale Packages: Assembly and Drop Test Reliability," IEEE Transactions on Electronics Packaging Manufacturing, vol. 29 no. 1, pp. 1-9, Jan. 2006.

Liu, Yueli, and Johnson, R. Wayne, "Optimization of lead free solder 01005 component assembly," Soldering & Surface Mount Technology, vol. 19 no. 1, pp. 15-27, 2007.

Liu, Yueli, Rodgers, Shaunte, and Johnson, R. Wayne, "PCB Design and Assembly Process Development of 01005 Components with Lead Free Solder," IPC Printed Circuits Expo, APEX and the Designer Summit , Anaheim, CA, Feb. 8-10, 2006, pp. S01-02-1-S01-02-15.

Liu, Yumin, Almagro, Erwin Ian, Liu, Yong, Jeon, O. S., and Teysseyre, Jerome, "Board-Level Reliability Performance of Discrete Power Packages," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 257-263.

Liu, Yumin, Sun, Weiwei, Jiang, Yun, and Zhao, Xing-Zhong, "Fabrication of bifacial wafer-scale silicon nanowire arrays with ultra-high aspect ratio through controllable metal-assisted chemical etching," Materials Letters, vol. 139, pp. 437-442, Jan. 15, 2015.

Liu, Yun, Yu, Weiyuan, Sun, Xuemin, and Wang, Fengfeng, "Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint," Soldering & Surface Mount Technology, vol. 32 no. 2, pp. 73-81, 2020.

Liu, Yushuang, Lu, Chengjie, Zhang, Peigen, Yu, Jin, Zhang, Yamei, and Sun, Zheng Ming, "Mechanisms behind the spontaneous growth of Tin whiskers on the Ti2SnC ceramics," Acta Materialia, vol. 185, pp. 433-440, Feb. 15, 2020.

Liu, Z. Q., Shang, P. J., Li, D. X., and Shang, J. K., "Growth Kinetics and Microstructural Evolution of Cu-Sn Intermetallic Compounds on Different Cu Substrates during Thermal Aging," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 569-571.

Liu, Zhi-Quan, Gao, Li-Yin, and Li, Cai-Fu, "Identification of IMCs at SAC/Fe-Ni interface during solid-state aging at 125°C," 2016 6th Electronic System-Integration Technology Conference , Grenoble, France, Sept. 13-15, 2016, pp. xx-xx.

Liu, Zhi-Quan, Shang, Pan-Ju, Pang, Xue-Yong, and Shang, Jian-Ku, "Microstructural Investigation on the Interfacial Evolution of SnBi/Cu Interconnect during Reflow and Solid-State Aging," International Conference on Electronic Packaging Technology & High Density Packaging , Shanghai, China, July 28-31, 2008, pp. xx-xx.

Liu, Zhi-Quan, Zhang, Hao, Zhang, Li, Guo, Hongyan, and Lai, Chi-Ming, "Phase evolution at the interface of SnAgCu/FeNi solder joint during solid state aging," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 260-263.

Liu, Zhi-Quan, and Li, Cai-Fu, "Spontaneous tin whisker growth from rare-earth tin alloys," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 373-375.

Liu, Zhi-Quan, and Tian, Fei-Fei, "The reversible transformation between Cu2(In, Sn) and Cu(In, Sn)2 compounds during solid-state aging," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 425-428.

Liu, Zhikun, Wang, Yuefeng, Liao, Yiliang, and Cheng, Gary J., "Direction-tunable nanotwins in copper nanowires by laser-assisted electrochemical deposition," Nanotechnology, vol. 23 no. 12, pp. 125602-1-125602-7, June 13, 2012.

Liu, Zhilin, Zhang, Zhi, Jiang, Ripeng, Li, Xiaoqian, Zhang, Mingxing, and Qiu, Dong, "Crystallography of phase transformation in the self-inclined InAs nanowires grown on GaAs{111}," Scripta Materialia, vol. 121, pp. 79-83, Aug. 2016.

Liu, Zhixue, Ma, Xiaosong, Ding, Qiulin, and Zhang, G. Q., "Fast MSL Analysis of Microelectronic Packages by using Equal Weight Increasing Method," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 391-394.

Liu, Zhiyuan, Ma, Haoran, Shang, Shengyan, Wang, Yunpeng, Li, Xiaogan, and Ma, Haitao, "Effects of TiO2 nanoparticles addition on physical and soldering properties of Sn-xTiO2 composite solder," Journal of Materials Science: Materials in Electronics, vol. 30 no. 20, pp. 18828-18837, Oct. 2019.

Liu, Zhuhao, Pan, Hongfa, Wang, Yibo, Xu, Ling, Lu, Jicun, Wu, Daike, Wu, Jian, Li, Ming, and Gao, Liming, "Effect of Indium, Bismuth and Copper Doping on Microstructure and Mechanical Properties of Sn5Sb and Sn3.5Ag Lead free Solder Alloys," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 1400-1405.

Liu, Ziyu, Cai, Jian, Wang, Qian, He, Xi, and Chen, Yu, "Interfacial Reaction Between Sn3.0Ag0.5Cu Solder and ENEPIG for Fine Pitch BGA by Stencil Printing," Journal of Electronic Materials, vol. 43 no. 9, pp. 3341-3350, Sept. 2014.

Liukkonen, Timo, Nummenpaa, Pekka, and Tuominen, Aulis, "The effect of lead-free solder paste on component placement accuracy and self-alignment during reflow," Soldering & Surface Mount Technology , vol. 16 no. 1, pp. 44-47, 2004.

Livingston, Henry, "GEB-0002: Reducing the Risk of Tin Whisker-Induced Failures in Electronic Equipment," BAE Systems, Dec. 1, 2003.

Liyana, N. K., Fazal, M. A., Haseeb, A. S. M. A., and Rubaiee, Saeed, "Effect of Zn incorporation on the electrochemical corrosion properties of SAC105 solder alloys," Journal of Materials Science: Materials in Electronics, vol. 30 no. 8, pp. 7415-7422, Apr. 2019.

Lloyd, J. R., "Electromigration induced resistance decrease in Sn conductors," Journal of Applied Physics, vol. 94 no. 10, pp. 6483-6486, Nov. 15, 2003.

Lloyd, John R., Zhang, Chao, Tan, H. Leong, Shangguan, Dongkai, and Achari, Achyuta, "Measurements of Thermal Conductivity and Specific Heat of Lead Free Solder," Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, Oct. 2-4, 1995, pp. 252-262.

Lo, C. T., Chou, Kan-Sen, and Chin, Wei-Kuo, "Effects of mixing procedures on the volume fraction of silver particles in conductive adhesives," Journal of Adhesion Science and Technology , vol. 15 no. 7, pp. 783-792, 2001.

Lo, Jeffery C. C., Jia, B. F., Liu, Z., Zhu, J., and Lee, S. W. Ricky, "Reliability study of surface mount printed circuit board assemblies with lead-free solder joints," Soldering & Surface Mount Technology , vol. 20 no. 2, pp. 30-38, 2008.

Lo, Jeffrey C. C., Lee, S. W. Ricky, Lam, Jimmy K. S., and Wong, Wallace K. H., "Wetting Characteristics of Solder Reflow on Copper Traces without Solder Mask," 1st Electronics Systemintegration Technology Conference, Volume 1 , Dresden, Germany, Sept. 5-7, 2006, pp. 438-443.

Lo, Shao-cheng, Hsieh, Yu-Ping, and Yen, Yee-wen, "Interfacial Reactions and Mechanism Properties between SAC 405 and SACNG Lead-free Solders with Au/Ni(P)/Cu Substrates Reflowed by CO2 Laser," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 224-226.

Loar, Gary W., "Recent Developments in Zinc/Nickel Alloy Plating," 30th Aerospace/Airline Plating & Metal Finishing Forum, 1994, pp. xx-xx.

Lober, David, Williamson, John M., and Bixenman, Mike, "Quality control methods used to ensure the production of reliable assemblies," Global SMT and Packaging, vol. 12 no. 9, pp. 12-18, Sept. 2012.

Locharoenrat, Kitsakorn, "Copper Nanowires on NaCl (110) Template," Applied Mechanics and Materials, vol. 313-314, pp. 198-201, Mar. 2013.

Lockwood, Doug, "RoHS directive: Understanding "put on the market" impacts inventory decisions," Green SupplyLine, June 18, 2006.

Lo Faro, M. J., D'Andrea, C., Messina, E., Fazio, B., Musumeci, P., Franzo, G., Gucciardi, P. G., Vasi, C., Priolo, F., Iacona, F., and Irrera, A., "A room temperature light source based on silicon nanowires," Thin Solid Films, vol. 613, pp. 59-63, Aug. 31, 2016.

Logterman, Mark, and Gopalakrishnan, Lavanya, "A Product Feasibility Study of Assembling Pb-free BGAs in a eutectic Sn/Pb Process," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 742-751.

Loh, Lynn, Canonico, Scott, Degher, Alexandra, and Moore, Russell, "Integrating Environmental Product Sesign into HP Inkjet Printing Supplies," Proceedings of 2004 International IEEE Conference on the Asian Green Electronics, Hong Kong, China, Jan 5-9, 2004, pp. 86-91.

Loher, Thomas, Seckel, Manuel, Vieroth, Rene, Dils, Christian, Kallmayer, Christine, Ostmann, Andreas, Aschenbrenner, Rolf, and Reichl, Herbert, "Stretchable Electronic Systems: Realization and Applications," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 893-898.

Lohokare, Saurabh K., Lu, Zhaolin, Schuetz, Christopher A., and Prather, Dennis W., "Electrical Characterization of Flip-Chip Interconnects Formed Using a Novel Conductive-Adhesive-Based Process," IEEE Transactions on Advanced Packaging, vol. 29 no. 3, pp. 542-547, Aug. 2006.

Lok, S. K., Chan, S. K., Wong, G. K. L., and Sou, I. K., "MBE-grown Fe nanowires on a ZnS(1 0 0) surface," Journal of Crystal Growth, vol. 311 no. 7, pp. 2208-2211, Mar. 15, 2009.

Loman, David, "How Do Zinc Whiskers Affect Today's Data Centers?," EC&M , Jan. 1, 2001.

Loman, David, "Zinc Whisker Contamination," HP Services.

Lomas, Pete, "Creating components for confusion?," European Electronics Engineer , vol. xx no. x, pp. xx-xx, Dec. 25, 2006.

Lomax, Paul, "Getting Ready for RoHS," Metal Finishing, vol. 104 no. 1, pp. 28-31, Jan. 2006.

Lomax, Paul, "Selecting the Appropriate X-Ray Fluorescence Instrument for RoHS/WEEE Screening," Lead-Free Connection, vol. 4 no. 1, pp. 5-8, Feb. 2007.

Lomax, Paul, "X-Ray Fluorescence Measurement Solutions for Mandatory Compliance," Lead-Free Connection, vol. 2 no. 3, pp. 9-11, Sept. 2005.

Lomax, Paul, "X-Ray Fluorescence Measurement Solutions for the Mandatory Compliance with the European Union Directives 2002/95/EC & 2002/96/EC, RoHS and WEEE," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

London, S., Fricano, D., Dasgupta, A., Reinikaininen, T., Freitas, G., and Pagliosa, C., "Probabilistic Effects in Thermal Cycling Failures of High-I/O BGA Assemblies," 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems , Delft, Netherlands, Apr. 26-29, 2009, pp. xx-xx.

Long, B., Verni, G. Alessio, O'Connell, J., Shayesteh, M., Gangnaik, A., Georgiev, Y. M., Carolan, P., O'Connell, D., Kuhn, K. J., Clendenning, S. B., Nagle, R., Duffy, R., and Holmes, J. D., "Doping top-down e-beam fabricated germanium nanowires using molecular monolayers," Materials Science in Semiconductor Processing, vol. 62, pp. 196-200, May 2017.

Long, Bill, Prevallet, Mike, and Prymak, John, "Effects of Lead-Free Solder on Flex Performance," Proceedings of the 25th Symposium for Passive Components, Palm Springs, CA, Mar. 21-24, 2005, pp. 97-101.

Long, Ernest, and Toscano, Lenora, "A New Surface Finish for the Electronics Industry," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 965-971.

Long, Ernest, and Toscano, Lenora, "A Study of Surface Finishes for IC Substrates and Wire Bond Applications," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 971-975.

Long, Ernest, Swanson, John, and Toscano, Lenora, "An Immersion Silver PWB Surface Finish to Combat Harsh Environments," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 829-836.

Long, Ernest, and Toscano, Lenora, "Electroless Nickel/Immersion Silver - A New Surface Finish for PCB Applications," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 933-939.

Long, Lau Fu, Riko, I Made, Putra, Wahyuaji Narotyama, Rong, Eric Phua Jian, Zhang, Lim Jun, Dy, Lim Ju, Cheong, Wong Chee, Zhong, Chen, Nachiappan, Vivek Chidambaram, and Lip, Gan Chee, "Study of electrical property of Au-Ge eutectic solder alloys for high temperature electronics," 2012 IEEE 14th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 5-7, 2012, pp. 30-33.

Long, Lee Tsung, Meng-Chieh, Liao, Te-Chun, Huang, and Tzeng-Cherng, Luo, "Plating coated Component creep corrosion test at sulfur vapor atmosphere," 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 22-24, 2014, pp. 77-80.

Long, Mark, "Adopting a Hardened Approach to Space-based System Designs," e-inSITE, Feb. 5, 2003.

Long, Mark, "Processor Problem Continues To Dog Boeing Satellites," e-inSITE, May 14, 2002.

Long, X., Dutta, I., Guduru, R., Prasanna, R., and Pacheco, M., "A Highly Accelerated Thermal Cycling (HATC) Test for Solder Joint Reliability Assessment in BGA Packages," Proceedings of the ASME InterPack Conference, Volume 1, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 539-546.

Long, Xiaoping, and Li, Ming, "Effect of Cu and Ni micro-nanocones interlayer on the growth of tin whisker," 2019 20th International Conference on Electronic Packaging Technology , Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Long, Xin, Dutta, Indranath, Sarihan, Vijay, and Frear, Darrel R., "Deformation Behavior of Sn-3.8Ag-0.7Cu Solder at Intermediate Strain Rates: Effect of Microstructure and Test Conditions," Journal of Electronic Materials, vol. 37 no. 2, pp. 189-200, Feb. 2008.

Long, Xu, Wang, Shaobin, Feng, Yihui, Yao, Yao, and Keer, Leon M., "Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments," Materials Science and Engineering: A, vol. 696, pp. 90-95, June 1, 2017.

Long, Xu, Tang, Wenbin, Wang, Shaobin, He, Xu, and Yao, Yao, "Annealing effect to constitutive behavior of Sn-3.0Ag-0.5Cu solder," Journal of Materials Science: Materials in Electronics, vol. 29 no. 9, pp. 7177-7187, May 2018.

Long, Xu, Chen, Zubin, and Shi, Hongbin, "Constitutive model and parameter identification for lead-free SAC305 solder," 2020 21st International Conference on Electronic Packaging Technology , Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Long, Xu, Yao, Yao, Wu, Yanpei, Xia, Weijuan, and Ren, Lianfeng, "Effect of Thermal Cycling on Tensile Behaviour of SAC305 Solder," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 63-68.

Long, Xu, Tang, Wenbin, Xu, Mengfei, Keer, Leon M., and Yao, Yao, "Electric current-assisted creep behaviour of Sn-3.0Ag-0.5Cu solder," Journal of Materials Science, vol. 53 no. 8, pp. 6219-6229, Apr. 2018.

Long, Xu, Liu, Yongchao, Jia, Fengrui, Wu, Yanpei, Fu, Yonghui, and Zhou, Cheng, "Thermal fatigue life of Sn-3.0Ag-0.5Cu solder joint under temperature cycling coupled with electric current," Journal of Materials Science: Materials in Electronics, vol. 30 no. 8, pp. 7654-7664, Apr. 2019.

Long, Xu, Chen, Bingjie, and Yao, Yao, "Thermo-visco-plastic constitutive model for lead-containing and lead-free solders subjected to monotonic and cyclic loadings," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 31-36.

Long, Zhaohui, Yin, Fucheng, Liu, Yajun, Wang, Jiang, Liu, Huashan, and Jin, Zhanpeng, "Thermodynamic Description of the Ru-(Si,Ge)-Sn Ternary Systems," Journal of Phase Equilibria and Diffusion, vol. 33 no. 2, pp. 97-105, Apr. 2012.

Longford, Andy, "Lead (Pb)-free Electronics... The Component Issues," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies , Frankfurt, Germany, Oct. 20-22, 2004.

Longo, Frank N., "Plasma-Sprayed Coatings: An Alternative to Hard Chromium?," Plating and Surface Finishing, vol. 72 no. 7, pp. 28-32, July 1985.

Longo, M., Wiemer, C., Salicio, O., Fanciulli, M., Lazzarini, L., and Rotunno, E., "Au-catalyzed self assembly of GeTe nanowires by MOCVD," Journal of Crystal Growth, vol. 315 no. 1, pp. 152-156, Jan. 15, 2011.

Longo, M., Stoycheva, T., Fallica, R., Wiemer, C., Lazzarini, L., and Rotunno, E., "Au-catalyzed synthesis and characterisation of phase change Ge-doped Sb-Te nanowires by MOCVD," Journal of Crystal Growth, vol. 370, pp. 323-327, May 1, 2013.

Longobardo, V., "Comparazione fra Leghe Saldanti SAC e SnCuNi," March 14-17, 2006.

Loomans, M. E., Vaynman, S., Ghosh, G., and Fine, M. E., "Investigation of Multi-Component Lead-Free Solders," Journal of Electronic Materials, vol. 23 no. 8, pp. 741-746, Aug. 1994.

Loomans, M. E., and Fine, M. E., "Tin-Silver-Copper Eutectic Temperature and Composition," Metallurgical and Materials Transactions A, vol. 31 no. 4, pp. 1155-1162, Apr. 2000.

Loper Jr., C. R., Rasmussen, D. H., and Koelling, H. A., "The Effect of Temperature and Saturation Ratio on Vapor Grown Cadmium Crystals," Journal of Crystal Growth, vol. 9, pp. 217-227, May 1971.

Lopez, Eddie, Vianco, Paul, Lucero, Sam, and Buttry, Wayne, "Comparison of the Solderability Performances of Inhibitor Containing and Inhibitor-Free Immersion Silver Coatings," Pan Pacific Conference , Maui, HI, Jan. 30-Feb. 1, 2007, pp. xx-xx. (Sandia Report SAND2007-0394C)

Lopez, Eddie, Vianco, Paul, Rejent, Jerry, George, Carly, and Kilgo, Alice, "Compression Stress-Strain Behavior of Sn-Ag-Cu Solders," International Brazing & Soldering Conference, Orlando, FL, Apr. 26-29, 2009, pp. xx-xx. (Sandia Report SAND2009-2812C)

Lopez, Eddie, Vianco, Paul, Lucero, Sam, and George, Carly, "Effects of Storage Environments On The Solderability Of a Nickel-Palladium-Gold Finish With Pb-Based And Pb-Free Solders," Pan Pacific Microelectronics Symposium, Kauai, HI, Jan. 22-24, 2008, pp. xx-xx. (Sandia Report SAND2008-0406C)

Lopez, Edwin P., Vianco, Paul T., Rejent, Jerome A., George, Carly, and Kilgo, Alice, "Compression Stress-Strain Behavior of Sn-Ag-Cu Solders," Journal of Electronic Materials, vol. 39 no. 1, pp. 97-104, Jan. 2010.

Lopez, Edwin, Vianco, Paul, Buttry, R. Wayne, Lucero, Samuel, and Rejent, Jerome, "Effects of Storage Environments on the Solderability of Immersion Silver Board Finishes with Pb-Based and Pb-Free Solders," 2005 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Lopez, Edwin, Vianco, Paul, Buttry, R. Wayne, Lucero, Samuel, and Rejent, Jerome, "Effects of Storage Environments on the Solderability of Immersion Silver Board Finishes with Pb-Based and Pb-Free Solders," SMTA Journal, vol. 18 no. 4, pp. 19-28, Oct. 2005.

Lopez, Edwin, Vianco, Paul, Lucero, Samuel, and George, Carly, "Effects of Storage Environments on the Solderability of Nickel-Palladium-Gold Finish with Pb-Based and Pb-Free Solders," Sandia Report SAND2007-7763C, 2007.

Lopez, Edwin, Vianco, Paul, Lucero, Samuel, and George, Carly, "Effects of Storage Environments on the Solderability of Nickel-Palladium-Gold Finish with Pb-Based and Pb-Free Solders," 2008 Pan Pacific Microelectronics Symposium & Exhibit, Kauai, HI, Jan. 22-24, 2008, pp. xx-xx.

Lopez, Edwin, Vianco, Paul, Lucero, Samuel, and George, Carly, "Effects of Storage Environments on the Solderability of Nickel-Palladium-Gold Finish with Pb-Based and Pb-Free Solders," SMTAnews & Journal of Surface Mount Technology, vol. 21 no. 2, pp. 28-37, Apr.-June 2008.

Lopez, Edwin P., Vianco, Paul T., and Rejent, Jerome A., "Solderability Testing of 95.5Sn-3.9Ag-0.6Cu Solder on Oxygen-Free High-Conductivity Copper and Au-Ni Plated Kovar," Journal of Electronic Materials, vol. 32 no. 4, pp. 254-260, Apr. 2003.

Lopez, Edwin P., Vianco, Paul T., and Rejent, Jerome A., "Solderability Testing of Sn-Ag-XCu Pb-Free Solders on Copper and Au-Ni-Plated Kovar Substrates," Journal of Electronic Materials, vol. 34 no. 3, pp. 299-310, Mar. 2005.

Lord, P. C., Witt, M. C., Bilham, R., Edwards, T., and King, C., "Thermal Fatigue Properties of Some BGA Alloys," Proceedings of the Technical Program NEPCON East '96, Boston, MA, June 10-13, 1996, pp. 153-177.

Lordi, G. A., "Electroless Plating for Electronic Applications," Plating, vol. 54 no. 4, pp. 382-384, Apr. 1967.

Lotfian, S., Molina-Aldareguia, J. M., Yazzie, K. E., Llorca, J., and Chawla, N., "Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation," Journal of Electronic Materials , vol. 42 no. 6, pp. 1085-1091, June 2013.

Lothe, Jens, "Theory of Dislocation Climb in Metals," Journal of Applied Physics , vol. 31 no. 6, pp. 1077-1087, June 1960.

Lotty, Olan, Hobbs, Richard, O'Regan, Colm, Hlina, Johann, Marschner, Christoph, O'Dwyer, Colm, Petkov, Nikolay, and Holmes, Justin D., "Self-Seeded Growth of Germanium Nanowires: Coalescence and Ostwald Ripening," Chemistry of Materials, vol. 25 no. 2, pp. 215-222, Jan. 22, 2013.

Lou, Minyi, Wen, Long, Chen, Zhengrong, Zhou, Jianwei, Wang, Qian, and Lee, Jaisung, "Study of Isothermal Bending Fatigue Test," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1246-1255.

Lovberg, Andreas, Tegehall, Per-Erik, Akbari, Saeed, and Andersson, Dag, "On the formation and propagation of laminate cracks and their influence on the fatigue lives of solder joints," 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Toulouse, France, Apr. 15-18, 2018, pp. xx-xx.

Lovberg, Andreas, Tegehall, Per-Erik, Wetter, Goran, Brinkfeldt, Klas, and Andersson, Dag, "Simulations of the impact of single-grained lead-free solder joints on the reliability of ball Grid Array components," 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Dresden, Germany, Apr. 3-5, 2017, pp. xx-xx.

Lovberg, Andreas, and Tegehall, Per-Erik, "The Stress State of BGA Solder Joints Influenced by the Grain Orientations of Neighboring Joints," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 882-889.

Lovberg, Andreas, and Tegehall, Per-Erik, "Transgranular Crack Propagation in Thermal Cycling of SnAgCu Solder Joints," 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Hanover, Germany, March 24-27, 2019, pp. xx-xx.

Low, C. T. J., Kerr, C., Barker, B. Des, Smith, J. R., Campbell, S. A., and Walsh, F. C., "Electrochemistry of tin deposition from mixed sulphate and methanesulphonate electrolyte," Transactions of the Institute of Metal Finishing, vol. 86 no. 3, pp. 148-152, May 2008. https://doi.org/10.1179/174591908X304216

Low, C. T. J., and Walsh, F. C., "Normal and anomalous electrodeposition of tin-copper alloys from methanesulphonic acid bath containing perfluorinated cationic surfactant," Transactions of the Institute of Metal Finishing, vol. 86 no. 6, pp. 315-325, Nov. 2008.

Low, M. K., Williams, D. J., and Dixon, A. C., "Design practices for improving the end-of-life disposal of telecommunications equipment," Engineering Science and Education Journal, vol. 5 no. 4, pp. 153-158, Aug. 1996.

Low, Ming K., and Williams, David J., "European environmental legislation in electronics and its potential impact on Far Eastern suppliers," Proceedings of 2nd Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 1998, pp. 206-213.

Low, Ming Kaan, Williams, David J., and Dixon, Colin, "Manufacturing Products with End-of-Life Considerations: An Economic Assessment to the Routes of Revenue Generation From Mature Products," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C, vol. 21 no. 1, pp. 4-10, Jan. 1998.

Low, Norbert, and Muehlbauer, Andreas, "Cleaning," Surface Mount Technology (SMT), vol. 15 no. 9, pp. xx-xx, Sept. 2001.

Low, Richard, Miessner, Ralf, Pustan, David, and Wilde, Jurgen, "Evaluation of Stress in Electrically-Conductive Adhesives Used in Automotive Applications," Advancing Microelectronics, vol. 35, no. 1, pp. 20-24, Jan./Feb. 2008.

Lowenheim, Frederick A., "Tin-Alloy Plating: An American Experience," Transactions of the Institute of Metal Finishing, vol. 31, 1955, pp. 386-400. https://doi.org/10.1080/00202967.1954.11869652

Loyaux-Lawniczak, Stephanie, Lecomte, Paul, and Ehrhardt, Jean-Jacques, "Behavior of Hexavalent Chromium in a Polluted Groundwater: Redox Processes and Immobilization in Soils," Environmental Science & Technology , vol. 35 no. 7, pp. 1350-1357, 2001.

Lozano-Morales, A., Renz, R. P., Fortman, J. J., and Taylor, E. J., "Electrically Mediated Process for Functinal and Decorative Trivalent Chromium Electroplating: An Alternative to Hexavalent Chromium," ECS Transactions, vol. 6 no. 9, pp. 51-61, 2007.

Lu, Bin, Wang, Juan-hui, Li, Hui, Zhu, Hua-wei, and Jiao, Xian-he, "Effect of 0.10% Ce on intermetallic compounds at Sn-0.7Cu-0.5Ni/Cu interface," Zhongguo Youse Jinshu Xuebao/ Chinese Journal of Nonferrous Metals, vol. 17 no. 3, pp. 390-395, Mar. 2007.

Lu, Bin, Li, Hui, Wang, Juan-hui, Zhu, Hua-wei, and Jiao, Xian-he, "Effect of adding Ce on interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu substrate," Journal of Central South University of Technology , vol. 15 no. 3, pp. 313-317, June 2008.

Lu, Bin, Li, Hui, Wang, Juan-hui, Zhu, Hua-wei, and Jiao, Xian-he, "Effect of Er on microstructure and properties of Sn-3.0Ag-0.5Cu lead-free solder alloy," Zhongguo Youse Jinshu Xuebao/ Chinese Journal of Nonferrous Metals, vol. 17 no. 4, pp. 518-524, Apr. 2007.

Lu, Bin, Liu, Jingru, Yang, Jianxin, and Li, Bo, "The environmental impact of technology innovation on WEEE management by Multi-Life Cycle Assessment," Journal of Cleaner Production, vol. 89, pp. 148-158, Feb. 15, 2015.

Lu, C.C., Wang, S. J., and Liu, C. Y., "Electromigration Studies on Sn(Cu) Alloy Lines," Journal of Electronic Materials, vol. 32 no. 12, pp. 1515-1522, Dec. 2003.

Lu, C. T., Huang, T. S., Cheng, C. H., Tseng, H. W., and Liu, C. Y., "Cross-Interaction Study of Cu/Sn/Pd and Ni/Sn/Pd Sandwich Solder Joint Structures," Journal of Electronic Materials, vol. 41 no. 1, pp. 130-137, Jan. 2012.

Lu, Chengxiang, Wang, Jun, Chen, Lei, Fu, Qiang, and Cai, Xufu, "The Effect of Adjuvant on the Halogen-Free Intumescent Flame Retardant ABS/PA6/SMA/APP Blend," Journal of Applied Polymer Science, vol. 118 no. 3, pp. 1552-1560, Nov. 5, 2010.

Lu, D., and Wong, C. P., "Characterization of Silver Flake Lubricants," Journal of Thermal Analysis and Calorimetry, vol. 59 no. 3, pp. 729-740, 2000.

Lu, Daoqiang, Wong, C. P., and Tong, Quinn K., "A Fundamental Study on Silver Flakes for Conductive Adhesives," 4th International Symposium on Advanced Packaging Materials, Brazelton, GA, Mar. 15-18, 1998, pp. 256-260.

Lu, Daoqiang, and Wong, C. P., "A Study of Contact Resistance of Conductive Adhesives Based on Anhydride- Cured Epoxy Systems," IEEE Transactions on Components and Packaging Technologies, vol. 23 no. 3, pp. 440-446, Sept. 2000.

Lu, Daoqiang, Tong, Quinn K., and Wong, C. P., "A Study of Lubricants on Silver Flakes for Microelectronics Conductive Adhesives," IEEE Transactions on Components and Packaging Technologies , vol. 22 no. 3, pp. 365-371, Sept. 1999.

Lu, Daoqiang, and Wong, C. P., "Conductive Adhesives for Solder Replacement in Electronics Packaging," 2000 International Symposium on Advanced Packaging Materials, Braselton, GA, Mar. 6-8, 2000, pp. 24-31.

Lu, Daoqiang, Tong, Quinn K., and Wong, C. P., "Conductivity Mechanisms of Isotropic Conductive Adhesives (ICAs)," 1999 International Symposium on Advanced Packaging Materials, Braselton, GA, Mar. 14-17, 1999, pp. 2-10.

Lu, Daoqiang, Tong, Quinn K., and Wong, C. P., "Conductivity Mechanisms of Isotropic Conductive Adhesives (ICA's)," IEEE Transactions on Electronics Packaging Manufacturing, vol. 22 no. 3, pp. 223-227, July 1999.

Lu, Daoqiang, and Wong, C. P., "Development of Conductive Adhesives Filled with Low-melting-point Alloy Fillers," 2000 International Symposium on Advanced Packaging Materials , Braselton, GA, Mar. 6-8, 2000, pp. 7-13.

Lu, Daoqiang, and Wong, C. P., "Development of Conductive Adhesives for Solder Replacement," IEEE Transactions on Components and Packaging Technologies, vol. 23 no. 4, pp. 620-626, Dec. 2000.

Lu, Daoqiang, Wong, C. P., Tong, Quinn K., and Zhang, Eric, "Development of High Performance Surface Mount Conductive Adhesives," 2000 Proceedings 50th Electronic Components & Technology Conference , Las Vegas, NV, May 21-24, 2000, pp. 892-898.

Lu, Daoqiang, and Wong, C. P., "Development of Solder Replacement Conductive Adhesives with Stable Resistance and Superior Impact Performance," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 110-116.

Lu, Daoqiang, Wong, David, and Wong, C. P., "Effects of Curing Agents on the Properties of Conductive Adhesives," 2000 International Symposium on Advanced Packaging Materials, Mar. 6-8, 2000, pp. 311-318.

Lu, Daoqiang, and Wong, C. P., "Effects of Shrinkage on Conductivity of Isotropic Conductive Adhesives," 1999 International Symposium on Advanced Packaging Materials, Braselton, GA, Mar. 14-17, 1999, pp. 295-301.

Lu, Daoqiang, and Wong, C. P., "Effects of shrinkage on conductivity of isotropic conductive adhesives," International Journal of Adhesion and Adhesives, vol. 20 no. 3, pp. 189-193, 2000.

Lu, Daoqiang, and Wong, C. P., "High Performance Conductive Adhesives," IEEE Transactions on Electronics Packaging Manufacturing, vol. 22 no. 4, pp. 324-330, Oct. 1999.

Lu, Daoqiang, and Wong, C. P., "Isotropic Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers," IEEE Transactions on Electronics Packaging Manufacturing, vol. 23 no. 3, pp. 185-190, July 2000.

Lu, Daoqiang, Wong, C. P., and Tong, Quinn K., "Mechanisms Underlying the Unstable Contact Resistance of Conductive Adhesives," 1999 Proceedings 49th Electronic Components & Technology Conference, San Diego, CA, June 1-4, 1999, pp. 342-346.

Lu, Daoqiang, Tong, Quinn K., and Wong, C. P., "Mechanisms Underlying the Unstable Contact Resistance of Conductive Adhesives," IEEE Transactions on Electronics Packaging Manufacturing , vol. 22 no. 3, pp. 228-232, July 1999.

Lu, Daoqiang, and Wong, C. P., "Novel Conductive Adhesives for Surface Mount Applications," 1999 International Symposium on Advanced Packaging Materials, Braselton, GA, Mar. 14-17, 1999, pp. 288-294.

Lu, Daoqiang, and Wong, C. P., "Novel conductive adhesives for surface mount applications," Journal of Applied Polymer Science, vol. 74 no. 2, pp, 399-406, Oct. 10, 1999.

Lu, Daoqiang Danial, and Wong, C. P., "Overview of Recent Advances on Isotropic Conductive Adhesives," Proceedings of the 2006 IEEE CPMT Conference on High Density Microsystem Design, Packaging and Component Failure Analysis, Shanghai, June 27-28, 2006, pp. 218-227.

Lu, Daoqiang, and Wong, C. P., "Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems," Journal of Electronics Manufacturing, vol. 9 no. 3, pp. 223-232, Sept. 1999.

Lu, Daoqiang, Wong, David, and Wong, C. P., "Properties of Conductive Adhesives Based on Different Curing Agents," Journal of Electronics Manufacturing, vol. 9 no. 4, pp. 241-248, Dec. 1999.

Lu, Daoqiang Daniel, and Wong, C. P., "Recent Advances in Developing High Performance Isotropic Conductive Adhesives," Journal of Adhesion Science and Technology, vol. 22 no. 8-9, pp. 835-851, 2008.

Lu, Guo-Quan, Calata, Jesus Noel, Zhang, Zhiye, and Bai, John G., "A Lead-free, Low-temperature Sintering Die-attach Technique for High-performance and High-temperature Packaging," Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, China, June 30-July 3, 2004, pp. 42-46.

Lu, Guo-Quan, Yang, Wen, Mei, Yunhui, Li, Xin, Chen, Gang, and Chen, Xu, "Effects of DC bias and spacing on migration of sintered nanosilver at high temperatures for power electronic packaging," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 925-930.

Lu, Guo-Quan, Calata, Jesus N., Lei, Guangyin, and Chen, Xu, "Low-temperature and Pressureless Sintering Technology for High-performance and High-temperature Interconnection of Semiconductor Devices," Proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems , London, England, Apr. 15-18, 2007, pp. xx-xx.

Lu, Guo-Quan, Liu, Xingsheng, Wen, Sihua, Calata, Jesus Noel, and Bai, John G., "Strategies for improving the reliability of solder joints on power semiconductor devices," Soldering & Surface Mount Technology, vol. 16 no. 2, pp. 27-40, 2004.

Lu, H., Shi, H. G., and Zhou, M., x "Experimental evaluation of creep and fatigue behaviour for microscale solder interconnect," Fatigue and Fracture of Engineering Materials and Structures, vol. 30 no. 2, pp. 87-94, Feb. 2007.

Lu, Hao, Yu, Chun, Li, Peilin, and Chen, Junmei, "Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints," Journal of Electronic Packaging, vol. 130 no. 3, pp. 031008-1-031008-5, Sept. 2008.

Lu, Henry Y, Balkan, Haluk, and Ng, K. Y. Simon, "Effect of Ag content on the microstructure development of Sn-Ag-Cu interconnects," Journal of Materials Science: Materials in Electronics , vol. 17 no. x, pp. 171-188, 2006.

Lu, Henry Y., Balkan, Haluk, Vrtis, Joan, and Ng, K. Y. Simon, "Impact of Cu Content on the Sn-Ag-Cu Interconnects," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 113-119.

Lu, Henry Y., Balkan, Haluk, and Ng, K. Y. Simon, "Microstructure evolution of the Sn-Ag-y%Cu interconnect," Microelectronics Reliability, vol. 46 no. xx, pp. 1058-1070, 2006.

Lu, Henry Y., Balkan, Haluk, and Ng, K. Y. Simon, "Solid-Liquid Reactions: The Effect of Cu Content on Sn-Ag-Cu Interconnects," JOM, vol. 57 no. 6, pp. 30-35, June 2005.

Lu, Hua, and Bailey, Chris, "Approximate Methods for IGBT Solder Joint Stress and Fatigue Prediction," 2016 6th Electronic System-Integration Technology Conference, Grenoble, France, Sept. 13-15, 2016, pp. xx-xx.

Lu, Hua, Ridout, Steve, Bailey, Chris, Loh, Wei Sun, Pearl, Agyakwa, and Johnson, Mark, "Computer Simulation of Crack Propagation in Power Electronics Module Solder Joints," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Lu, Hua, Bailey, Chris, and Mills, Liam, "Impact of Uneven Solder Thickness on IGBT Substrate Reliability," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1888-1893.

Lu, Hua, and Bailey, Chris, "Modelling the Performance of Lead-free Solder Interconnects for Copper Bumped Flip-chip Devices," Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003, pp. xx-xx.

Lu, Hua, and Bailey, Chris, "Modelling the Performance of Lead-Free Solder Interconnects for Copper Bumped Flip-Chip Devices," Advances in Electronic Packaging 2003, Volume 1 , Maui, Hawaii, July 6-11, 2003, pp. 605-610.

Lu, Hua, and Bailey, Chris, "Reliability Prediction for IGBT Solder Joints Using Clech Algorithm," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 1059-1063.

Lu, Jing, Liu, Di, and Dai, Junfu, "Preparation of highly conductive silver nanowires for electrically conductive adhesives," Journal of Materials Science: Materials in Electronics , vol. 30 no. 16, pp. 15786-15794, Aug. 2019.

Lu, Jiongxin, Moon, Kyoung-Sik, and Wong, C. P., "Development of Novel Silver Nanoparticles/Polymer Composites as High K Polymer Matrix by In-situ Photochemical Method," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1841-1846.

Lu, Ken-Cheng, Guo, Siao-Wei, Chen, Hao-Chih, Chi, Wei-Hao, and Liao, Hsueh-Kuo, "Power Cycle Reliability of Power Module with Different Solder Systems," 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Ict. 21-23, 2020, pp. 109-111.

Lu, L. N., Huang, H. Z., Wu, B. Y., Zhou, Q., Su, X. X., and Cai, M., "Investigation of Thin Small Outline Package (TSOP) Solder Joint Crack after Accelerated Thermal Cycling Testing," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 923-926.

Lu, Li-Teh, Wernick, Iddo K., Hsiao, Teng-Yuan, Yu, Yue-Hwa, Yang, Ya-Mei, and Ma, Hwong-Wen, "Balancing the life cycle impacts of notebook computers: Taiwan's experience," Resources, Conservation, and Recycling, vol. 48 no. 1, pp. 13-25, July 2006.

Lu, Lin, Liu, Tiancheng, and Li, Xiaogang, "Composition analysis of the plating on electrolytically treated steel sheets in chromic acid solution," Surface and Coatings Technology, vol. 202 no. 8, pp. 1401-1404, Jan. 15, 2008.

Lu, Lixiang, Yu, Hongying, Sun, Dongbai, and Lu, Wanheng, "Preparation and Megnetic Performance Study of One Dimensional Co-Ni Nanomaterial," Key Engineering Materials, vol. 562-565, pp. 770-774, July 2013.

Lu, Lu, Wang, Jianbo, Zheng, He, Zhao, Dongshan, Wang, Renhui, and Gui, Jianian, "Spontaneous formation of filamentary Cd whiskers and degradation of CdMgYb icosahedral quasicrystal under ambient conditions," Journal of Materials Research, vol. 27 no. 14, pp. 1895-1904, July 28, 2012.

Lu, Min-Hsien, and Hsieh, Ker-Chang, "Sn-Cu Intermetallic Grain Morphology Related to Sn Layer Thickness," Journal of Electronic Materials, vol. 36 no. 11, pp. 1448-1454, Nov. 2007.

Lu, Minfu, Ren, Wei, Liu, Sheng, and Shangguan, Dongkai, "A Unified Multi-Axial Sub-Micron Fatigue Tester with Applications to Electronic Packaging Materials," 1997 Electronic Components and Technology Conference, San Jose, CA, May 18-21, 1997, pp. 144-148.

Lu, Minfu, Qian, Zhengfang, Ren, Wei, Liu, Sheng, and Shangguan, Dongkai, "Investigation of electronic packaging materials by using a 6-axis mini thermo-mechanical tester," International Journal of Solids and Structures, vol. 36 no. 1, pp. 65-78, 1999.

Lu, Minhua, Shih, Da-Yuan, Lauro, Paul, and Goldsmith, Charles, "Blech effect in Pb-free flip chip solder joint," Applied Physics Letters, vol. 94 no. 1, pp. 011912-1-011912-3, 2009.

Lu, Minhua, Shih, Da-Yuan, Goldsmith, Charles, and Wassick, Thomas, "Comparison of Electromigration Behaviors of SnAg and SnCu Solders," 2009 IEEE International Reliability Physics Symposium, Montreal, Canada, Apr. 26-30, 2009, pp. 149-154.

Lu, Minhua, Lauro, Paul, Shih, Da-Yuan, Polastre, Robert, Goldsmith, Charles, Henderson, Donald W., Zhang, Hongqing, and Cho, Moon Gi, "Comparison of Electromigration Performance for Pb-free Solders and Surface Finishes with Ni UBM," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 360-365.

Lu, Minhua, Goldsmith, Charles, Wassick, Thomas, Perfecto, Eric, and Arvin, Charles, "Effect of Ag and Cu content in Sn based Pb-free solder on electromigration," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 1940-1943.

Lu, Minhua, Wright, Steven L., McVicker, Gerard, and Sri-Jayantha, Sri M., "Effect of Joule Heating on Electromigration Reliability of Pb-free Interconnect," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 590-596.

Lu, Minhua, "Effect Of Microstructure On Electromigration In Pb-free Solder Interconnect," AIP Conference Proceedings, vol. 1300, pp. 229-237, 2010.

Lu, Minhua, Shih, Da-Yuan, Lauro, Paul, Goldsmith, Charles, and Henderson, Donald W., "Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders," Applied Physics Letters, vol. 92 no. 21, pp. 211909-1-211909-3, May 26, 2008.

Lu, Minhua, Wassick, Thomas, Advocate, Gerald, and Backes, Ben, "Electromigration and Thermal Migration in Pb-free Interconnects," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 2036-2039.

Lu, Minhua, Shih, Da-Yuan, and Lauro, Paul, "Electromigration in Pb-free Solders," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Lu, Minhua, and Zhang, Hongqing, "Influence of UBM Metallurgy on Sn Textures and EM Failure," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1785-1788.

Lu, Minhua, Lauro, Paul, and Goldsmith, Charles, "Study of Interfacial Reaction and Electromigration Reliability of Pb-free Solders with Nickel Iron Barrier Layer," Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, Volume 1, Portland, OR, July 6-8, 2011, pp. 453-456.

Lu, Minhua, Shih, Da-Yuan, Lauro, Paul, Kang, Sung, Goldsmith, Charles, and Seo, Sun-Kyoung, "The Effects of Ag, Cu Compositions and Zn Doping on the Electromigration Performance of Pb-Free Solders," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 922-929.

Lu, Neng-hsing, "A New Interconnection Technique Bumps and Z-Adhesive," Proceedings of the Technical Program NEPCON East '92, Boston, MA, June 15-18, 1992, pp. 309-316.

Lu, Nianduan, Yang, Donghua, and Li, Liangliang, "Interfacial reaction between Sn-Ag-Cu solder and Co-P films with various microstructures," Acta Materialia, vol. 61 no. 12, pp. 4581-4590, July 2013.

Lu, Peng-Xian, Zhang, Meng, Zou, Wen-Jun, and Kong, Chun, "Electronic structure, lattice dynamics, and thermoelectric properties of bismuth nanowire from first-principles calculation," Journal of Materials Research, vol. 32 no. 12, pp. 2405-2413, June 2017.

Lu, Peng-Xian, Zhang, Meng, Zou, Wen-Jun, and Kong, Chun, "Electronic structure, lattice dynamics, and thermoelectric properties of bismuth nanowire from first-principles calculation - CORRIGENDUM," Journal of Materials Research, vol. 32 no. 12, pp. 2446, June 2017.

Lu, Qingru, Huang, Hui, and Chen, Debing, "Analysis of the research status of tin whisker's influence on lead-free soldering," Advanced Materials Research, vol. 834-836, pp. 876-879, Oct. 2013.

Lu, Ren, Wang, Yewu, Wang, Wei, Gu, Lin, and Sha, Jian, "Epitaxial growth of silver nanoislands on the surface of silicon nanowires in ambient air," Acta Materialia, vol. 79, pp. 241-247, Oct. 15, 2014.

Lu, S. Y., and Lin, C. Y., "Simulating percolating behavior of conductive particles in anisotropically conductive composite films," Applied Physics A: Materials Science and Processing, vol. 74 no. 5, pp. 675-681, May 2002.

Lu, Sheng, Wang, Baohua, and Chen, Jing, "Evolutions in Microstructure and Property of Sn-Ag-Cu Lead-free Solders with Trace Addition of Magnesium," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 242-245.

Lu, Sheng, Wang, Baohua, Wei, Chenggang, Chen, Jing, and Wang, Weijun, "Melting Temperature and Physical Properties of Sn-Ag-Cu-Mg Lead-Free Solders Based on Uniform Design," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Lu, Sheng, Luo, Fei, Chen, Jing, and Wang, Baohua, "Microstructural and physical characteristics of Sn-Ag-Cu-Mg lead-free solders," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Lu, Sheng, Zheng, Zhixia, Chen, Jing, and Luo, Fei, "Microstructure and Solderability of Sn-3.5Ag-0.5Cu-xBi-ySb Solders," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 410-412.

Lu, Sheng, Chen, Jing, Luo, Fei, and Wang, Baohua, "Study on microstructure and properties of Sn-Ag-Cu-Mg lead-free solders," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 1193-1196.

Lu, Sheng, Luo, Fei, Chen, Jing, and Li, Kaiyue, "The Effects of Bi on Physical and Microstructural Characteristics of Sn-Ag-Cu Lead-free Solders," 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 6-10, 2009, pp. 782-784.

Lu, Shijun, Tao, Yeqing, Ding, Dongyan, and Hu, Yu, "Solderability of Eco-friendly OSP Surface Finish," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1120-1123.

Lu, Su-Tsai, Lin, Yu-Min, Chuang, Chun-Chin, Chen, Tai-Hong, and Chen, Wen-Hwa, "A Novel Compliant-Bump Structure for ACA-Bonded Chip-on-Flex (COF) Interconnects with Ultra-Fine Pitch," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1544-1551.

Lu, Su-Tsai, Lin, Yu-Min, Chuang, Chun-Chih, Chen, Tai-Hong, and Chen, Wen-Hwa, "Development of a Novel Compliant-Bump Structure for ACA-Bonded Chip-on-Flex (COF) Interconnects With Ultra-Fine Pitch," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 1, pp. 33-42, Jan. 2011.

Lu, Su-Tsai, Juang, Jing-Ye, Cheng, Hsien-Chie, Tsai, Yu-Ming, Chen, Tai-Hong, and Chen, Wen-Hwa, "Effects of Bonding Parameters on the Reliability of Fine-Pitch Cu/Ni/SnAg Micro-Bump Chip-to-Chip Interconnection for Three-Dimensional Chip Stacking," IEEE Transactions on Device and Materials Reliability, vol. 12 no. 2, pp. 296-305, June 2012.

Lu, Su-Tsai, and Chen, Wen-Hwa, "Experimental/Numerical Analysis of Thermally Induced Warpage of Ultrathin Chip-on-Flex (UTCOF) Interconnects," IEEE Transactions on Components and Packaging Technologies, vol. 33 no. 4, pp. 819-829, Dec. 2010.

Lu, Su-Tsai, Chu, Han-Min, and Chen, Wen-Hwa, "Investigation of Electrical Contact Mechanism for Anisotropic Conductive Adhesive Joints After the Thermocompression," IEEE Transactions on Device and Materials Reliability, vol. 3 no. 1, pp. 54-65, Mar. 2013.

Lu, Su-Tsai, and Chen, Wen-Hwa, "Reliability and Flexibility of Ultra-Thin Chip-on-Flex (UTCOF) Interconnects With Anisotropic Conductive Adhesive (ACA) Joints," IEEE Transactions on Advanced Packaging, vol. 33 no. 3, pp. 702-712, Aug. 2010.

Lu, Su-Tsai, and Chen, Wen-Hwa, "Reliability of Ultra-thin Chip-on-Flex (UTCOF) with Anisotropic Conductive Adhesive (ACA) Joints," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1287-1293.

Lu, Tao, Yi, Danqing, Wang, Hongxuan, Tu, Xiaoxuan, and Wang, Bin, "Microstructure, mechanical properties, and interfacial reaction with Cu substrate of Zr-modified SAC305 solder alloy," Journal of Alloys and Compounds, vol. 781, pp. 633-643, Apr. 15, 2019.

Lu, Wei, Shi, Yaowu, and Lei, Yongping, "Effect of Ag Content on Solidification Cracking Susceptibility of Sn-Ag-Cu Solder Joints," Journal of Electronic Materials, vol. 39 no. 8, pp. 1298-1302, Aug. 2010.

Lu, Wei, and Lieber, Charles M., "Semiconductor nanowires," Journal of Physics D: Applied Physics, vol. 39 no. 21, pp. R387-R406, Nov. 7, 2006.

Lu, Xiaotang, Harris, Justin T., Villarreal, Julian E., Chockla, Aaron M., and Korgel, Brian A., "Enhanced Nickel-Seeded Synthesis of Germanium Nanowires," Chemistry of Materials, vol. 25 no. 10, pp. 2172-2177, May 28, 2013.

Lu, Yang, and Lou, Jun, "Quantitative In-situ Nanomechanical Characterization of Metallic Nanowires," JOM, vol. 63 no. 9, pp. 35-42, Sept. 2011.

Lu, Yebo, Tohmyoh, Hironori, and Saka, Masumi, "Comparison of stress migration and electromigration in the fabrication of thin Al wires," Thin Solid Films, vol. 520 no. 9, pp. 3448-3452, Feb. 29, 2012.

Lu, Yebo, and Saka, Masumi, "Effect of Surface Film on the Al Whisker Fabrication by Utilizing Stress Migration," Advanced Materials Research, vol. 630, pp. 110-113, Dec. 2012.

Lu, Yebo, Li, Yuan, and Saka, Masumi, "Forming Long Ag Thin Wires by Using Stress Migration," Materials Letters, vol. 171, pp. 72-74, May 1, 2016.

Lu, Yen-Sheng, Fernades, Jayer, Liu, Hewei, and Jiang, Hongrui, "Fresnel Lens Based on Silicon Nanowires," 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems, San Francisco, CA, Jan. 26-30, 2014, pp. 1175-1178.

Lu, Yu-Dong, En, Yun-Fei, He, Xiao-Qi, Niu, Gang, Pecht, Michael, and Wang, Xin, "Ductile-to-Brittle Transition of Flip-Chip Solder Joints Influenced by Electromigration," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 824-827.

Lu, Yu-Dong, He, Xiao-Qi, En, Yun-Fei, and Wang, Xin, "Failure Mechanism of Sn3.0Ag0.5Cu Flip-Chip Solder Joints under Electric Current Stress," 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 6-10, 2009, pp. 406-409.

Lu, Yudong, En, Yunfei, Wan, Ming, He, Xiaoqi, and Wang, Xin, "Mechanical Properties of Flip-Chip Solder Joints Effected by Electromigration," Advanced Materials Research, vol. 189-193, pp. 1009-1013, 2011.

Lu, Zhaoqing, Yao, Cheng, Xie, Fan, Si, Lianmeng, Jia, Fengfeng, Huang, Jizheng, Wang, Yafang, and Ma, Qing, "Highly flexible and conductive sodium carboxymethyl cellulose/silver nanowires composite films," Journal of Materials Science: Materials in Electronics, vol. 31 no. 3, pp. 2353-2359, Feb. 2020.

Lu, Ziyang, Zhu, Jixin, Sim, Daohao, Shi, Wenhui, Tay, Yee Yan, Ma, Jan, Hng, Huey Hoon, and Yan, Qingyu, "In situ growth of Si nanowires on graphene sheets for Li-ion storage," Electrochimica Acta, vol. 74, pp. 176-181, July 15, 2012.

Luan, Jing-en, Goh, Kim-yong, and Baraton, Xavier, "A Novel Methodology for Virtual Qualification of IC Packages under Board Level Drop Test," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1212-1217.

Luan, Jing-en, and Goh, Kim-yong, "Design for Improvement of Drop Impact Performance of IC Packages," 31st International Conference on Electronics Manufacturing and Technology, Kuala Lumpur, Malasia, Nov. 8-10, 2007, pp. 129-134.

Luan, Jing-en, Tee, Tong Yan, Goh, Kim Yong, Ng, Hun Shen, Baraton, Xavier, Bronner, Robert, Sorrieul, Marika, Hussa, Esa, Reinikainen, Tommi, and Kujala, Ami, "Drop Impact Life Prediction Model for Lead-free BGA Packages and Modules," Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, Apr. 18-20, 2005, pp. 559-565.

Luan, Jing-en, Tee, Tong Yan, Zhang, Xueren, Hussa, Esa, Wang, Jason, Ford, Clive, and Jen, K. C., "Drop Impact Life Prediction Models with Solder Joint Failure Modes and Mechanisms," Proceedings of 7th Electronic Packaging Technology Conference, Volume 1, Singapore, Dec. 7-9, 2005, pp. 66-72.

Luan, Jing-en, Tee, Tong Yan, Pek, Eric, Lim, Chwee Teck, and Zhong, Zhaowei, "Dynamic responses and solder joint reliability under board level drop test," Microelectronics Reliability, vol. 47 no. 2-3, pp. 450-460, Feb.-Mar. 2007.

Luan, Jing-en, Tee, Tong Yan, Zhang, Xueren, and Hussa, Esa, "Solder Joint Failure Modes, Mechanisms, and Life Prediction Models of IC Packages under Board Level Drop Impact," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Luan, Tianmin, Guo, Weibing, Yang, Shenghua, Ma, Zhipeng, He, Jingshan, and Yan, Jiuchun, "Effect of intermetallic compounds on mechanical properties of copper joints ultrasonic-soldered with Sn-Zn alloy," Journal of Materials Processing Technology, vol. 248, pp. 123-129, Oct. 2017.

Luan, Yange, Park, Yeaji, and Noh, Jin-Seo, "The effects of a cationic surfactant on copper nanowires and their dimensions," Materials Chemistry and Physics, vol. 184, pp. 279-284, Dec. 1, 2016.

Luborsky, F. E., Koch, E. F., and Morelock, C. R., "Crystallographic Orientation and Oxidation of Submicron Whiskers of Iron, Iron-Cobalt, and Cobalt," Journal of Applied Physics, vol. 34 no. 9, pp. 2905-2909, Sept. 1963.

Luborsky, F. E., and Morelock, C. R., "Magnetization Reversal of Almost Perfect Whiskers," Journal of Applied Physics, vol. 35 no. 7, pp. 2055-2066, July 1964.

Luborsky, F. E., "Permanent Magnets in Use Today," Journal of Applied Physics, vol. 37 no. 3, pp. 1091-1094, Mar. 1, 1966.

Lubov, M. N., Kulikov, D. V., and Trushin, Yu. V., "Kinetic Model of Growth of GaAs Nanowires," Journal of Technical Physics (USSR), vol. 55 no. 1, pp. 85-91, Jan. 2010. https://doi.org/10.1134/S1063784210010147

Lubyshev, D. I., Rossi, J. C., Gusev, G. M., and Basmaji, P., "Nano-scale wires of GaAs on porous Si grown by molecular beam epitaxy," Journal of Crystal Growth, vol. 132 no. 3-4, pp. 533-537, Sept. 2, 1993.

Lucas, J. P., Guo, F., McDougall, J. Bieler, T. R., Subramanian, K. N., and Park, J. K., "Creep Deformation Behavior in Eutectic Sn-Ag Solder Joints Using a Novel Mapping Technique," Journal of Electronic Materials, vol. 28 no. 11, pp. 1270-1275, Nov. 1999.

Lucas, J. P., Rhee, H., Guo, F., and Subramanian, K. N., "Mechanical Properties of Intermetallic Compounds Associated with Pb-Free Solder Joints Using Nanoindentation," Journal of Electronic Materials , vol. 32 no. 12, pp. 1375-1383, Dec. 2003.

Lucheva, Biserka, Tsonev, Tsonio, and Iliev, Peter, "Recycling of Lead Solder Dross, Generated from PCB Manufacturing," JOM , vol. 63 no. 8, pp. 18-22, Aug. 2011.

Lucot, Damien, Jabeen, Fauzia, Ramdani, Mohammed R., Patriarche, Gilles, Faini, Giancarlo, Mailly, Dominique, and Harmand, Jean-Christophe, "Phase coherent transport in GaAs/AlGaAs core-shell nanowires," Journal of Crystal Growth, vol. 378, pp. 546-548, Sept. 1, 2013.

Ludeke, Hans-Peter, "Lead-Free DC/DC Converters," ECN, vol. xx no. xx, pp. xx, Feb. 1, 2004.

Ludwig, Richard, Lee, Ning-Chen, Fan, Chonglun, and Zhang, Yun, "Ensuring Solderability: An Evaluation of Two Novel Lead-free Finishes," Surface Mount Technology (SMT), vol. 16 no. 4, pp. 36, 38, 40, Apr. 2002.

Ludwig, Richard, Lee, Ning-Cheng, Fan, Chonglun, and Zhang, Yun, "Evaluation of Two Novel Lead-Free Surface Finishes," 2001 SMTA International Conference Proceedings, Chicago, IL, Sept. 30-Oct. 4, 2001, pp. xx-xx.

Ludwig, Richard, Lee, Ning-Cheng, Fan, Chonglun, and Zhang, Yun, "Evaluation of two novel lead-free surface finishes," Soldering & Surface Mount Technology, vol. 14 no. 3, pp. 19-24, 2002.

Ludwig, Richard, Lee, Ning-Cheng, Fan, Chonglun, and Zhang, Yun, "Evaluation of Two Novel Lead-Free Surface Finishes," Proceedings 2002 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4931), Denver, CO, Sept. 4-6, 2002, pp. 697-703.

Luedeke, Hans-Peter, "Leading lead-free," Electronic Product Design, vol. 24 no. 8, pp. 16,18, Aug. 2003.

Luef, Christoph, Paul, Aloke, Flandorfer, Hans, Kodentsov, Alexander, and Ipser, Herbert, "Enthalpies of mixing of metallic systems relevant for lead-free soldering: Ag-Pd and Ag-Pd-Sn," Journal of Alloys and Compounds, vol. 391 no. 1-2, pp. 67-76, Apr. 5, 2005.

Luef, Christoph, Flandorfer, Hans, and Ipser, Herbert, "Lead-free solder materials: experimental enthalpies of mixing in the Ag-Cu-Sn and Cu-Ni-Sn ternary systems," Zeitschrift fur Metallkunde, vol. 95 no. 3, pp. 151-163, Mar. 2004.

Luef, Christoph, Flandorfer, Hans, and Ipser, Herbert, "Lead-free solder materials: experimental enthalpies of mixing of liquid Ag-In-Pd-Sn alloys," Metallurgical and Materials Transactions A (Physical Metallurgy and Materials Science), vol. 36A no. 5, pp. 1273-1277, May 2005.

Lugani, Lorenzo, Ercolani, Daniele, Beltram, Fabio, and Sorba, Lucia, "Growth mechanism of InAs-InSb heterostructured nanowires grown by chemical beam epitaxy," Journal of Crystal Growth, vol. 323 no. 1, pp. 304-306, 2011.

Lugstein, A., Andrews, A. M., Steinmair, M., Hyun, Y. J., Bertagnolli, E., Schrambock, M., and Strasser, G., "Growth of Branched Single Crystalline GaAs Whiskers on Si Nanowire Trunks," The Society for Micro- and Nanoelectronics -- Biennial Report 2005 - 2006, pp. 97-100.

Lui, Yan, Manning, William, Huang, Benlih, and Lee, Ning-Cheng, "A Kinetic Approach of Profiling for Voiding Control at Lead-Free Reflow Soldering," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 197-205.

Luiten, G. A. (Wendy), "Solder Joint Lifetime of Rapidly Cycled LED Components," Electronics Cooling, pp. 18-19, June 2014.

Luiten, Ir. G. A. (Wendy), "Solder Joint Lifetime of Rapidly Cycled LED Components," Electronics Cooling, pp. 12-15, Apr. 2017.

Luiten, Wendy, "Solder joint Lifetime of Rapid Cycled LED Components," 2013 19th International Workshop on Thermal Investigations of ICs and Systems, Berlin, Germany, Sept. 25-27, 2013, pp. 98-103.

Lujan-Regalado, Irene, Kirubanandham, Antony, Williams, Jason J., and Chawla, Nikhilesh, "Nucleation and Growth of Tin Hillocks by In Situ Nanoindentation," Journal of Electronic Materials, vol. 48 no. 1, pp. 58-71, Jan. 2019.

Luk, C. F., Chan, Y. C., and Hung, K. C., "Application of Adhesive bonding techniques in Hard Disk Drive head assembly," Advances in Electronic Packaging 2001, Volume 1, Kauai, Hawaii, July 8-13, 2001, pp. 191-198.

Luk, C. F., Chan, Y. C., and Hung, K. C., "Application of adhesive bonding techniques in hard disk drive head assembly," Microelectronics Reliability, vol. 42 no. 4-5, pp. 767-777, Apr./May 2002.

Luk, C. F., Chan, Y. C., and Hung, K. C., "Development of Gold to Gold Interconnection Flip Chip Bonding for Chip On Suspension Assemblies," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 1040-1044.

Luks, Annika, and Sauerwein, Reiner, "Halogen Free and Flame Retardant Elastomeric Cable Compounds with Submicron Sized Fillers," Proceedings of the 57th International Wire and Cable Symposium, Providence, RI, Nov. 9-12, 2008, pp. 134-137.

Lum, Chin Wai, "Low Profile TSOP Approach for MSL 1 Delamination Free," 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Melaka, Malaysia, Nov. 30-Dec. 2, 2010, pp. xx-xx.

Lund, Alan, "RoHS & the Distributor," SMART Group 8th Annual Lead-Free Seminar + 'Question Time' & Table-Top Exhibition, High Wycombe, United Kingdom, Feb. 16, 2006.

Lungen, Sebastian, Klemm, Alexander, and Wohlrabe, Heinz, "Evaluation of the Quality of SMDs According to Vacuum Vapour Phase Soldering," 2015 38th International Spring Seminar on Electronics Technology, Eger, Hungary, May 6-10, 2015, pp. 218-222.

Luniak, Marco, Monser, Hans-Peter, Brod, Volker, and Wolter, Klaus-Jurgen, "Smart Label Uses Polymer Thick Film Technology on Low-cost Substrates," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, Germany, Oct. 21-24, 2001, pp. 314-318

Luo, Chunling, Liu, Chuanping, Wang, Yan, Liu, Xiang, Li, Fangbai, Zhang, Gan, and Li, Xiangdong, "Heavy metal contamination in soils and vegetables near an e-waste processing site, south China," Journal of Hazardous Materials, vol. 186 no. 1, pp. 481-490, Feb. 15, 2011.

Luo, Dong-xue, Xue, Song-bai, and Li, Zai-qian, "Effects of Ga addition on microstructure and properties of Sn-0.5Ag-0.7Cu solder," Journal of Materials Science: Materials in Electronics, vol. 25 no. 8, pp. 3566-3571, Aug. 2014.

Luo, Dong-xue, Xue, Song-bai, and Liu, Shuang, "Investigation on the intermetallic compound layer growth of Sn-0.5Ag-0.7Cu-xGa/Cu solder joints during isothermal aging," Journal of Materials Science: Materials in Electronics, vol. 25 no. 12, pp. 5195-5200, Dec. 2014.

Luo, Hu, Gan, Gui-sheng, Du, Yunfei, Yang, Donghua, Wang, Huaishan, and Meng, Guoqi, "Microstructure and Shear Strength of Low-Silver SAC/Cu Solder Joints during Aging," Materials Transactions, JIM, vol. 57 no. 6, pp. 833-837, 2016.

Luo, Liangliang, Sun, Fenglian, and Liu, Yang, "Geometrical size effect on interfacial reaction of Cu/SAC305/Cu during high-temperature storage aging," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 1025-1028.

Luo, Ning, Liao, Gaohua, and Xu, H. Q., "k.p theory of freestanding narrow band gap semiconductor nanowires," AIP Advances, vol. 6 no. 12, pp. 125109-1-125109-24, Dec. 2016.

Luo, Tingbi, Hu, Anmin, Hu, Jing, Li, Ming, and Mao, Dali, "Microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder," Microelectronics Reliability, vol. 52 no. 3, pp. 585-588, Mar. 2012.

Luo, Tingbi, Hu, Anmin, Li, Ming, and Mao, Dali, "Studies on Microstructure and Mechanical Properties of Sn-Zn-Bi-Cr Lead-free Solder," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 815-818.

Luo, Tingbi, Chen, Zhuo, Hu, Anmin, Li, Ming, and Li, Peng, "Study on low-Ag content Sn-Ag-Zn/Cu solder joints," Microelectronics Reliability, vol. 53 no. 12, pp. 2018-2029, Dec. 2013.

Luo, Tingbi, Chen, Zhuo, Hu, Anmin, and Li, Ming, "Study on melt properties, microstructure, tensile properties of low Ag content Sn-Ag-Zn Lead-free solders," Materials Science and Engineering: A, vol. 556, pp. 885-890, Oct. 30, 2012.

Luo, Tingbi, Chen, Xi, Hu, Jing, Hu, Anmin, and Li, Ming, "Study on Properties of Low-Ag Content Sn-Ag-Zn Lead-free Solders," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 399-404.

Luo, W. C., Ho, C. E., Tsai, J. Y., Lin, Y. L., and Kao, C. R., "Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations," Materials Science and Engineering A, vol. 396 no, 1-2, pp. 385-391, Apr. 15, 2005.

Luo, Xiaoxiong, Sundararaj, Uttandaraman, and Luo, Jing-Li, "Oxidation kinetics of copper nanowires synthesized by AC electrodeposition of copper into porous aluminum oxide templates," Journal of Materials Research, vol. 27 no. 13, pp. 1755-1762, July 14, 2012.

Luo, Xin, Du, Wenhui, Lu, Xiuzhen, Yamaguchi, Toshikazu, Gavin, Jackson, Ye, Li Lei, and Liu, Johan, "Investigation of accelerated surface oxidation of Sn-3.5Ag-0.5Cu solder particles by TEM and STEM," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 73-79.

Luo, Xin, Du, Wenhui, Lu, Xiuzhen, Yamaguchi, Toshikazu, Jackson, Gavin, Ye, Li lei, and Liu, Johan, "Surface oxide analysis of lead-free solder particles," Soldering & Surface Mount Technology, vol. 25 no. 1, pp. 39-44, 2013.

Luo, Z.-B., Zhao, J., Gao, Y.-J., and Wang, L., "Revisiting mechanisms to inhibit Ag3Sn plates in Sn-Ag-Cu solders with 1 wt.% Zn addition," Journal of Alloys and Compounds, vol. 500 no. 1, pp. 39-45, June 18, 2010.

Luo, Zhongbing, Wang, Lai, Fu, Qinqin, Cheng, Chongqian, and Zhao, Jie, "Formation of interfacial n'-Cu6Sn5 in Sn-0.7Cu/Cu solder joints during isothermal aging," Journal of Materials Research, vol. 26 no. 12, pp. 1468-1471, June 28, 2011.

Luo, Zhongbing, Wang, Lai, Fu, Qinqin, Cheng, Chongqian, and Zhao, Jie, "Formation of interfacial n'-Cu6Sn5 in Sn-0.7Cu/Cu solder joints during isothermal aging - ERRATUM," Journal of Materials Research, vol. 26 no. 14, pp. 1742, July 28, 2011.

Luo, Zhongbing, Zhao, Jie, Fu, Qinqin, and Wang, Lai, "n-n' Transformation of Interfacial Cu6Sn5 in Solder Joints," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 1097-1101.

Lurie, Peter, and Wolfe, Sidney M., "Continuing Exposure to Hexavalent Chromium, A Known Lung Carcinogen: An Analysis of OSHA Compliance Inspections, 1990-2000," American Journal of Industrial Medicine, vol. 42 no. 5, pp. 378-383, Nov. 2002.

Lutes, O. S., and Maxwell, E., "Superconducting Transitions in Tin Whiskers," Physical Review, vol. 97 no. 6, pp. 1718-1720, Mar. 15, 1955. https://doi.org/10.1103/PhysRev.97.1718

Lutfi, Maisarah, Yusof, Farazila, Ramesh, S., Ariga, T., and Hamdi, M., "Effect of Microwave Hybrid Heating on the Formation of Intermetallic Compound of Sn-Ag-Cu Solder Joints," 2014 IEEE 36th International Electronics Manufacturing Technology Conference, Johor, Malaysia , Nov. 11-13, 2014, pp. xx-xx.

Lutfi, Maisarah, Yusof, Farazila, Ariga, Tadashi, Singh, Ramesh, and Shukor, Mohd Hamdi Bin Abd, "Interfacial Reaction Analysis of Cu-Sn-Ni-P/Cu Joint using Microwave Hybrid Heating," Key Engineering Materials, vol. 701, pp. 148-153, July 2016.

Luthra, Mukul, "Metallization Options for Optimum Chip-on-Board Assembly," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 42-51.

Luttrull, David, Curtis, Anthony, and Pawlowski, Henry, "Development and Screening of Polymer Collar WLP Candidates for Lead-free Solder Sphere Technology to Enhanced Reliability," Second International Wafer-Level Packaging Congress, San Jose, CA, Nov. 3-4, 2005, pp. 154-158.

Luttrull, David K., and Hickmann III, Fred E., "New Halogen-Free PCB Materials for High-Speed Applications and Lead-Free Solder Processes," Future Circuits International, vol. xx no. xx, pp. xx-xx, Mar. 2001.

Lutz, M. A., and Cole, R. L., "High Performance Electrically Conductive Silicone Adhesives," Microelectronics International, vol. 7 no. 3, pp. 27-30, 1990.

Lutz, Michael A., and Cole, Richard L., "Flexible Silicone Adhesive with High Electrical Conductivity," 1989 Proceedings 39th Electronic Components Conference, Houston, TX, May 22-24, 1989, pp. 83-87.

Luu, Thi-Thuy, Duan, Ani, Aasmundtveit, Knut E., and Hoivik, Nils, "Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization," Journal of Electronic Materials, vol. 42 no. 12, pp. 3582-3592, Dec. 2013.

Luyima, Alex, Zhang, Lifeng, and Damoah, Lucas Nana Wiredu, "Kinetic Analysis of the Thermal Degradation of Printed Wiring Boards," JOM, vol. 63 no. 8, pp. 33-37, Aug. 2011.

Luyima, Alex, Shi, Honglan, and Zhang, Lifeng, "Leaching Studies for Metals Recovery from Waste Printed Wiring Boards," JOM, vol. 63 no. 8, pp. 38-41, Aug. 2011.

Luzhnaya, N. P., "Growth from Metal Solutions," Journal of Crystal Growth, vol. 3-4, pp. 97-107, 1968.

Lv, Chunmei, Sun, Li, Li, Qun, Wang, Xiuwen, Zhang, Tao, Cao, Yuying, Yang, Zhiqi, and Qi, Lihong, "Oleic acid-mediated synthesis of small-sized and monodisperse NiSe2 nanowires as counter electrode catalysts for triiodide reduction," Electrochimica Acta, vol. 355, pp. 136818-1-136818-9, Sept. 20, 2020. https://doi.org/10.1016/j.electacta.2020.136818

Lv, Min, Su, Shao, He, Yao, Huang, Qing, Hu, Wenbing, Li, Di, Fan, Chunhai, and Le, Shuit-Tong, "Long-Term Antimicrobial Effect of Silicon Nanowires Decorated with Silver Nanoparticles," Advanced Materials, vol. 22 no. 48, pp. 5463-5467, Dec. 21, 2010.

Lv, Shasha, Li, Zhengcao, Liao, Jiecui, Zhang, Zhengjun, and Miao, Wei, "Well-aligned NiSi/Si heterostructured nanowire arrays as field emitters," Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, vol. 33 no. 2, pp. 02B101-1-02B101-5, Mar. 2015.

Lv, Xiaochun, Lin, Tiesong, Wang, Jun, An, Jing, and He, Peng, "Morphology Characterization of Multi-Walled Carbon Nanotubes in Sn-58Bi/CNTs Composites," Materials Transactions, vol. 54 no. 7, pp. 1228-1231, 2013.

Lv, Yang, Yang, Wenchao, Mao, Jun, Li, Yitai, Zhang, Xinjiang, and Zhan, Yongzhong, "Effect of graphene nano-sheets additions on the density, hardness, conductivity, and corrosion behavior of Sn-0.7Cu solder alloy," Journal of Materials Science: Materials in Electronics, vol. 31 no. 1, pp. 202-211, Jan. 2020.

Lv, Yaping, Cai, Mingxian, Liu, Sheng, and Chen, Mingxiang, "Cu-Sn low-temperature stack bonding for 3D packaging," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 84-87.

Ly, Hien, Prosenik, Doug, and Priore, Scott, "Manufacturability and Reliability of High-Speed BGA Connectors Using SnPb, Mixed Soldering, and Lead-Free Processes," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 251-257.

Lycoudes, Nick, "JEDEC Position on Environmentally Friendly Products," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies , San Jose, CA, Apr. 23-24, 2003, pp. 40-49.

Lyons, Alan M., Hall, Elizabeth E., Wong, Yiu-Huen, and Adams, Gregory, "A New Approach to Using Anisotropically Conductive Adhesives for Flip Chip Assembly," 1995 Proceedings 45th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 1995, pp. 107-113.

Lyons, Alan M., Hall, Elizabeth, Wong, Yiu-Huen, and Adams, Gregory, "A New Approach to Using Anisotropically Conductive Adhesives for Flip-Chip Assembly," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 19 no. 1, pp. 5-11, Mar. 1996.

Lysov, A., Offer, M., Gutsche, C., Regolin, I., Topaloglu, S., Geller, M., Prost, W., and Tegude, F.-J., "Optical properties of heavily doped GaAs nanowires and electroluminescent nanowire structures," Nanotechnology, vol. 22 no. 8, pp. 085702-1-085702-8, Feb. 25, 2011.

Lytle, Bill, Fang, Treliant, Li, Li, and Zhang, Charles, "Ethylene Glycol Ether-Free Solder Paste Development," Journal of Electronic Materials, vol. 30 no. 8, pp. 1035-1041, Aug. 2001.

MMMM

Ma, Bin, Zhou, Bin, Wang, Shanlin, and Li, Xunping, "Mechanical Properties and Microstructure of Mixed SnAgCu-SnPb Solder Joints at Cryogenic Temperature," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1582-1585.

Ma, Dai Liang, and Chen, Hsuen Li, "Vapor phase growth of free-standing palladium nanorods," Journal of Crystal Growth, vol. 335 no. 1, pp. 127-132, Nov. 15, 2011.

Ma, Dongliang, and Wu, Ping, "Effects of coupled stressing and solid-state aging on the mechanical properties of graphene nanosheets reinforced Sn-58Bi-0.7Zn solder joint," Materials Science and Engineering: A, vol. 651, pp. 499-506, Jan. 10, 2016.

Ma, Dongliang, and Wu, Ping, "Effects of coupled stressing and solid-state aging on the mechanical properties of Sn-58Bi-0.7Zn solder joint," Journal of Materials Science: Materials in Electronics, vol. 26 no. 8, pp. 6285-6292, Aug. 2015.

Ma, Dongliang, and Wu, Ping, "Effects of Zn concentration on the aging reactions and IMC massive spalling phenomenon in the Sn-58Bi-xZn/Cu system," Journal of Materials Science: Materials in Electronics, vol. 26 no. 3, pp. 1338-1346, Mar. 2015.

Ma, Dongliang, and Wu, Ping, "Improved microstructure and mechanical properties for Sn58Bi0.7Zn solder joint by addition of graphene nanosheets," Journal of Alloys and Compounds, vol. 671, pp. 127-136, June 25, 2016.

Ma, G. F., Zhang, H. L., Zhang, H. F., Li, H., and Hu, Z. Q., "Wetting behavior and interfacial characteristics of In-Sn alloy on CuZr-based bulk metallic glass," Journal of Alloys and Compounds, vol. 464 no. 1-2, pp. 248-251, Sept. 22, 2008.

Ma, H. R., Kunwar, A., Shang, S. Y., Jiang, C. R., Wang, Y. P., Ma, H. T., and Zhao, N., "Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows," Intermetallics, vol. 96, pp. 1-12, May 2018.

Ma, H. R., Dong, C., Chen, J., Wang, Y. P., Li, X. G., and Ma, H. T., "Mechanism and control of preferred Cu6Sn5 growth on single crystal (001)Cu," Journal of Materials Science: Materials in Electronics, vol. 31 no. 8, pp. 5966-5974, Apr. 2020.

Ma, H. R., Li, S., Yao, M. J., Wang, Y. P, Chen, J., Zhao, N., and Ma, H. T., "The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1323-1326.

Ma, H. R., Wang, Y. P., Chen, J., Ma, H. T., and Zhao, N., "The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multiple reflows," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1402-1405.

Ma, H. T., Qu, L., Huang, M. L., Gu, L. Y., Zhao, N., and Wang, L., "In-situ study on growth behavior of Ag3Sn in Sn-3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology," Journal of Alloys and Compounds, vol. 537, pp. 286-290, Oct. 5, 2012.

Ma, H. T., Qu, L., Zhao, H. J., Wang, J., Gu, L. Y., An, L. L., and Huang, M. L., "In-situ study on the formation and evolution behavior of voids at the interface during soldering process by synchrotron radiation real-time imaging technology," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 380-384.

Ma, H. T., An, L. L., Qu, L., Wang, J., Gu, L. Y., and Huang, M. L., "Interfacial Reaction between Sn-9Zn/Sn Double Layers Solder and Cu," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 393-397.

Ma, H. T., Wang, J., Qu, L., An, L. L., Gu, L. Y., and Huang, M. L., "The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with Cu substrate," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging , Guilin, China, Aug. 13-16, 2012, pp. 361-365.

Ma, Hai-Tao, Wang, Jie, Qu, Lin, Zhao, Ning, and Kunwar, A., "A Study on the Physical Properties and Interfacial Reactions with Cu Substrate of Rapidly Solidified Sn-3.5Ag Lead-Free Solder," Journal of Electronic Materials, vol. 42 no. 8, pp. 2686-2695, Aug. 2013.

Ma, Haitao, Xie, Haiping, and Wang, Lai, x "Effect of a Trace of Bi and Ni on the Microstructure and Wetting Properties of Sn-Zn-Cu Lead-Free Solder," Journal of Materials Science and Technology, vol. 23 no. 1, pp. 81-84, Jan. 2007.

Ma, Haitao, Ma, Haoran, Kunwar, Anil, Shang, Shengyan, Wang, Yunpeng, Chen, Jun, Huang, Mingliang, and Zhao, Ning, "Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn-xCu solders during multiple reflows," Journal of Materials Science: Materials in Electronics, vol. 29 no. 1, pp. 602-613, Jan. 2018.

Ma, Haitao, Kunwar, Anil, Sun, Junhao, Guo, Bingfeng, and Ma, Haoran, "In situ study on the increase of intermetallic compound thickness at anode of molten tin due to electromigration of copper," Scripta Materialia , vol. 107, pp. 88-91, Oct. 2015.

Ma, Haoran, Yao, Jinye, Wang, Chen, Shang, Shengyan, Wang, Yunpeng, and Ma, Haitao, "Effect of Ag content on Cu6Sn5 growth behavior at Sn-Ag/Cu solder interface during multiple reflows," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 441-444.

Ma, Haoran, Dong, Chong, Chen, Shi, Shang, Shengyan, Liu, Yiling, Wang, Yunpeng, Li, Xiaogan, and Ma, Haitao, "Growth behavior of Cu6Sn5 Grains at Sn3.0Ag/(001)Cu Soldering Interface," 2019 20th International Conference on Electronic Packaging Technology , Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Ma, Haoran, Kunwar, Anil, Sun, Junhao, Zhao, Ning, Huang, Mingliang, and Ma, Haitao, "In situ aging study on the variation of Sn0.7Cu/Cu solid interface marked by bubbles," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 193-196.

Ma, Haoran, Kunwar, Anil, Liu, Zhiyuan, Chen, Jun, Wang, Yunpeng, Huang, Mingliang, Zhao, Ning, and Ma, Haitao, "Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and cooling during multiple reflows," Journal of Materials Science: Materials in Electronics, vol. 29 no. 6, pp. 4383-4390, Mar. 2018.

Ma, Haoran, Kunwar, Anil, Huang, Ru, Chen, Jun, Wang, Yunpeng, Zhao, Ning, and Ma, Haitao, "Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles during multiple reflows," Intermetallics, vol. 90, pp. 90-96, Nov. 2017.

Ma, Haoran, Kunwar, Anil, Chen, Jun, Qu, Lin, Wang, Yunpeng, Song, Xueguan, Raback, Peter, Ma, Haitao, and Zhao, Ning, "Study of electrochemical migration based transport kinetics of metal ions in Sn-9Zn alloy," Microelectronics Reliability, vol. 83, pp. 198-205, Apr. 2018.

Ma, Haoran, Kunwar, Anil, Meng, Zhixian, Guo, Bingfeng, Zhao, Ning, and Ma, Haitao, "The morphology variation of IMC on the solder/bubble interface under different cooling rates and temperatures," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 425-428.

Ma, Hongfang, Tian, Fang, Li, Dan, and Guo, Qiang, "Study on the nano-composite electroless coating of Ni-P/Ag," Journal of Alloys and Compounds, vol. 474 no. 1-2, pp. 264-267, Apr. 17, 2009.

Ma, Hongtao, and Suhling, Jeffrey C., "A review of mechanical properties of lead-free solders for electronic packaging," Journal of Materials Science, vol. 44 no. 5, pp. 1141-1158, Mar. 2009.

Ma, Hongtao, Ahmad, Mudasir, and Liu, Kuo-Chuan, "Acceleration Factor Study of Lead-Free Solder Joints under Wide Range Thermal Cycling Conditions," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1816-1822.

Ma, Hongtao, Zhang, Yifei, Cai, Zijie, Suhling, Jeffrey C., Lall, Pradeep, and Bozack, Michael J., "Aging Induced Evolution of Free Solder Material Behavior," International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, Freiburg, Germany, Apr. 20-23, 2008, pp. xx-xx.

Ma, Hongtao, "Constitutive models of creep for lead-free solders," Journal of Materials Science, vol. 44 no. 14, pp. 3841-3851, July 2009.

Ma, Hongtao, Suhling, Jeffrey C., Lall, Pradeep, and Bozack, Michael J., "Effects of Aging on the Stress-Strain and Creep Behaviors of Lead Free Solders," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 2, 2006, pp. 961-976.

Ma, Hongtao, and Lee, Tae-Kyu, "Effects of Board Design Variations on the Reliability of Lead-Free Solder Joints," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 1, pp. 71-78, Jan. 2013.

Ma, Hongtao, Xie, Weidong, Subbarayan, Guhan, and Liu, Kuo-Chuan, "Effects of Multiple Rework on the Reliability of Lead-Free Ball Grid Array Assemblies," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 979-983.

Ma, Hongtao, Xie, Weidong, and Subbarayan, Guhan, "Effects of Multiple Reworks on the Accelerated Thermal Cycling and Shock Performance of Lead-Free BGA Assemblies," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 11, pp. 1824-1831, Nov. 2012.

Ma, Hongtao, Liu, Kuo-Chuan, Lee, Tae-Kyu, and Kim, Dong Hyun, "Effects of PCB Design Variations on Bend and ATC Performance of Lead-Free Solder Joints," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1512-1517.

Ma, Hongtao, Suhling, Jeffrey C., Lall, Pradeep, and Bozack, Michael J., "Effects of Physical Aging on the Stress-Strain and Creep Behaviors of Lead Free Solders," 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 150.

Ma, Hongtao, "Effects of temperature and strain rate on the mechanical properties of lead-free solders," Journal of Materials Science, vol. 45 no. 9, pp. 2351-2358, May 2010.

Ma, Hongtao, Suhling, Jeffrey C., Zhang, Yifei, Lall, Pradeep, and Bozack, Michael J., "Evolution of Lead Free Solder Materials Behavior Under Elevated Temperature Aging," Proceedings of the ASME InterPack Conference, Volume 1, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 563-579.

Ma, Hongtao, Lee, Tae-Kyu, Kim, Dong Hyun, Kim, Sang Ha, Park, Ham G., and Liu, Kuo-Chuan, "Isothermal Aging Effects on the Dynamic Performance of lead-Free Solder Joints," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 390-397.

Ma, Hongtao, Lee, Tae-Kyu, Kim, Dong Hyun, Park, Han G., Kim, Sang Ha, and Liu, Kuo-Chuan, "Isothermal Aging Effects on the Mechanical Shock Performance of Lead-Free Solder Joints," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 5, pp. 714-721, May 2011.

Ma, Hongtao, Ahmad, Mudasir, and Liu, Kuo-Chuan, "Reliability of Lead-Free Solder Joints Under a Wide Range of Thermal Cycling Conditions," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 12, pp. 1965-1974, Dec. 2011.

Ma, Hongtao, Suhling, Jeffrey C., Lall, Pradeep, and Bozack, Michael J., "Reliability of the Aging Lead Free Solder Joint," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 849-864.

Ma, Hongtao, Suhling, Jeffrey C., Zhang, Yifei, Lall, Pradeep, and Bozack, Michael J., "The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 653-668.

Ma, Huan, Qiu, Hua, and Qi, Shuhua, "Electrically conductive adhesives based on acrylate resin filled with silver-plated graphite nanosheets and carbon nanotubes," Journal of Adhesion Science and Technology, vol 29 no. 20, pp. 2233-2244, Oct. 2015.

Ma, Junsung, Kim, Sungdong, and Kim, Sarah Eunkyung, "Characterization of flip chip bonded structure with Cu ABL power bumps," Microelectronics Reliability, vol. 54 no. 8, pp. 1598-1602, Aug. 2014.

Ma, Jusheng, and Chen, Guohai, "Lead-Free Solder Materials for Sustainable Development of Green Electronics in China," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Ma, Jusheng, "Study of Application and Reliability of Low Melting Point Sn-Zn-Bi-In-P System Lead-Free Alloys," Pan Pacific Microelectronics Symposium , Mauna Kea, HI, Feb. 10-12, 2009, pp. 264-268.

Ma, Jusheng, Chen, Guohai, Li, Xiaoyan, Tanaka, Takeshi, and Tang, Jie, "Study of New Types Lead-Free Solder Alloys of Sn-Ag-Cu-Al-Ni and Sn-Zn-Bi-In-P," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Ma, Li, Wang, Jianguang, Zhao, Jijun, and Wang, Guanghou, "Anisotropy in stability and Young's modulus of hydrogenated silicon nanowires," Chemical Physics Letters, vol. 452 no. 1-3, pp. 183-187. Feb. 4, 2008.

Ma, Lili, Sood, Bhanu, and Pecht, Michael, "Effect of Moisture on Thermal Properties of Halogen-Free and Halogenated Printed-Circuit-Board Laminates," IEEE Transactions on Device and Materials Reliability, vol. 11 no. 1, pp. 66-75, Feb. 2011.

Ma, Lili, Huang, Xinglin, and Zha, Jie, "Failure Analysis of Au-Ge Solder in Microwave Circuit Packaging," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 946-949.

Ma, Lili, Bao, Shengxiang, Peng, Jing, and Du, Zhibo, "Failure Analysis of In/Au Solder Joints," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Ma, Limin, Xu, Guangchen, Sun, Jia, Guo, Fu, and Wang, Xitao, "Effects of Co additions on electromigration behaviors in Sn-3.0 Ag-0.5 Cu-based solder joint," Journal of Materials Science, vol. xx no. xx, pp. xx-xx, xxxx.

Ma, Limin, Zuo, Yong, Guo, Fu, and Shu, Yutian, "Effects of current densities on creep behaviors of Sn-3.0Ag-0.5Cu solder joint," Journal of Materials Research, vol. 29 no. 22, pp. 2738-2747, Nov. 28, 2014.

Ma, Limin, Tai, Feng, Xu, Guangchen, Guo, Fu, and Wang, Xitao, "Effects of Processing and Amount of Co Addition on Shear Strength and Microstructual Development in the Sn-3.0Ag-0.5Cu Solder Joint," Journal of Electronic Materials, vol. 40 no. 6, pp. 1416-1421, June 2011.

Ma, Limin, Guo, Fu, Xu, Guangchen, Wang, Xitao, He, Hongwen, and Zhao, Haiyan, "Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique," Journal of Electronic Materials, vol. 41 no. 2, pp. 425-430, Feb. 2012.

Ma, Limin, Xu, Guangchen, Guo, Fu, and Wang, Xitao, "Retarding Electromigration on the Sn-Ag-Cu Solder Joints by Micro-Sized Metal-Particle Reinforcement," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 195-199.

Ma, Limin, Zuo, Yong, Liu, Sihan, Guo, Fu, and Wang, Xitao, "The failure models of Sn-based solder joints under coupling effects of electromigration and thermal cycling," Journal of Applied Physics , vol. 113 no. 4, pp. 044904-1-044904-7, 2013.

Ma, Limin, Zuo, Yong, Liu, Sihan, and Guo, Fu, "Whisker Growth Behavior of Sn58Bi Solder Coatings Under Isothermal Aging," Journal of Electronic Materials, vol. 45 no. 1, pp. 44-50, Jan. 2016.

Ma, Limin, Zuo, Yong, Liu, Sihan, Guo, Fu, Lee, Andre, and Subramanian, K. N., "Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders," Journal of Alloys and Compounds, vol. 657, pp. 400-407, Feb. 5, 2016.

Ma, Mingbiao, Ren, Siru, Wang, Jing, Hu, Anmin, and Li, Ming, "Influence of Bump Diameter on the Growth of Intermetallic Compounds in Cu/Ni/Sn Copper Pillar Bump During Aging Process," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Ma, Shu, Ji, Hongjun, Zhou, Junbo, Lu, Huajun, Liang, Meng, Li, Minggang, and Li, Mingyu, "Rapid Formation of Intermetallic Joints with Sn/Metal Composite Alloys by Ultrasonic-assisted Soldering for High-temperature Chip Attachment," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1223-1228.

Ma, Wen-Jing, Ke, Chang-Bo, Liang, Shui-bao, Zhou, Min-Bo, and Zhang, Xin-Ping, "Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic compound layer of Sn/Cu soldering system under cyclic loading," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 301-306.

Ma, Wen-Jing, Ke, Chang-Bo, Zhou, Min-Bo, and Zhang, Xin-Ping, "Phase field crystal simulation of morphological evolution and propagation of microcracks in the intermetallic compound layer of Sn/Cu solder interconnects," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 963-967.

Ma, Wen-Jing, Ke, Chang-Bo, Zhou, Min-Bo, and Zhang, Xin-Ping, "Phase Field Simulation of Solidification Behavior and Microstructure Evolution of Sn-58Bi/Cu Solder Interconnect During Reflow Soldering Process," 2013 14th International Conference on Electronic Packaging Technology , Dalian, China, Aug. 11-14, 2013, pp. 330-333.

Ma, Xiao, Zhu, Xuanmin, You, Fangfang, Feng, Jinyang, Wang, Moo-Chin, and Zhao, Xiujian, "Preparation and optical polarization of Ag/epoxy composite films with aligned Ag nanowires," Journal of Alloys and Compounds, vol. 592, pp. 57-62, Apr. 15, 2014.

Ma, Xiaochun, Yin, Jihui, and Zhang, Junjie, "Molecular dynamics study of size effect on uniaxial tension of single crystal Cu nanowires," Advanced Materials Research, vol. 160-162, pp. 682-686, 2011.

Ma, Xiaosong, Jansen, K. M. B., Zhang, G. Q., van Driel, W. D., van der, sluis, O., Ernst, L. J., Regards, C., Gautier, C., and Fremont, H., "A fast moisture sensitivity level qualification method," Microelectronics Reliability, vol. 50 no. 9-11, pp. 1654-1660, Sept.-Nov. 2010.

Ma, Xiaosong, Yang, D. G., and Zhang, G. Q., "Equivalent moisture distribution calculation for fast moisture sensitivity level analysis (MSLA)," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1382-1386.

Ma, Xin, Wang, Fengjiang, Qian, Yiyu, and Yoshida, Fusahito, "Development of Cu-Sn intermetallic compound at Pb-free solder/Cu joint interface," Materials Letters, vol. 57 no. 22-23, pp. 3361-3365, July 2003.

Ma, Xin, and Yoshida, Fusahito, "Rate-dependent indentation hardness of a power-law creep solder alloy," Applied Physics Letters, vol. 82 no. 2, pp. 188-190, Jan. 13, 2003.

Ma, Xuchu, Zhang, Zude, Wang, Xiong, Wang, Shutao, Xu, Fen, and Qian, Yitai, "Large-scale growth of wire-like Sb2Se3 microcrystallines via PEG-400 polymer chain-assisted route," Journal of Crystal Growth, vol. 263 no. 1-4, pp. 491-497, Mar. 1, 2004.

Ma, Yan, Jian, Jikang, Wu, Rong, Sun, Yanfei, and Li, Jin, "Growth of single-crystalline ultra-long cadmium telluride micron-size wires via thermal evaporation," IET Micro & Nano Letters, vol. 6 no. 8, pp. 596-598, Aug. 2011.

Ma, Yunzhu, Luo, Huiting, Liu, Wensheng, Huang, Yufeng, Yu, Qiang, and Li, Yongjun, "Effects of Bi addition on interfacial reactions and mechanical properties of In-3Ag-xBi/Cu solder joints," Journal of Materials Science: Materials in Electronics, vol. 27 no. 1, pp. 103-110, Jan. 2016.

Ma, Yunzhu, Luo, Huiting, Li, Yongjun, Liu, Wensheng, Wang, Yikai, and Huang, Boyun, "Formation and evolution of intermetallic compounds between the In-3Ag solder and Cu substrate during soldering," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Ma, Yunzhu, Wu, Tong, Liu, Wensheng, Huang, Yufeng, Tang, Siwei, and Wang, Yikai, "Interfacial microstructure evolution and shear behavior of Au-12Ge/Ni solder joints during isothermal aging," Journal of Materials Science: Materials in Electronics, vol. 28 no. 4, pp. 3685-3694, Feb. 2017.

Ma, Z. L., Belyakov, S. A., Xian, J. W., Nishimura, T., Sweatman, K., and Gourlay, C. M., "Controlling BGA joint microstructures using seed crystals," 2018 7th Electronic System-Integration Technology Conference, Dresden, Germany, Sept. 18-21, 2018, pp. xx-xx.

Ma, Z. L., Belyakov, S. A., and Gourlay, C. M., "Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu solders," Journal of Alloys and Compounds, vol. 682, pp. 326-337, Oct. 15, 2016.

Ma, Z., Belhenini, S., Joly, D., Chalon, F., Leroy, R., Ranganathan, N., Qin, F., and Doisseul, F., "Energy Density Estimation of Crack Initiation in Sn-Ag-Cu(Ni) Solder Bump by Nano-impact," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1367-1371.

Ma, Z., Chalon, F., Leroy, R., Ranganathan, N., and Beake, B. D., "Local and Global Properties of a Lead-Free Solder," Journal of Electronic Materials, vol. 43 no. 3, pp. 658-670, Mar. 2014.

Ma, Z. L., Shang, H., Daszki, A. A., Belyakov, S. A., and Gourlay, C. M., "Mechanisms of beta-Sn nucleation and microstructure evolution in Sn-Ag-Cu solders containing titanium," Journal of Alloys and Compounds, vol. 777, pp. 1357-1366, Mar. 10, 2019.

Ma, Z. L., and Gourlay, C. M., "Nucleation, grain orientations, and microstructure of Sn-3Ag-0.5Cu soldered on cobalt substrates," Journal of Alloys and Compounds, vol. 706, pp. 596-608, June 5, 2017.

Ma, Zhong, Shi, Lei, Xing, Lu, Yang, Li, and Xing, Lu, "The Benefit & Cost from Electronic Waste Recycling," International Conference on Management and Service Science, Beijing, China, Sept. 20-22, 2009, pp. xx-xx.

Maalekian, Mehran, Xu, Yuan, Nobari, Amir Hossein, and Seelig, Karl, "Comparing Mechanical and Soldering Properties of Castin, Babbitt and Alternative Lead-Free Alloys," International Conference on Soldering & Reliability 2015 Proceedings, Toronto, Ontario, Canada, May 19-21, 2015, pp. xx-xx.

Maalekian, Mehran, "Developing High Reliability Solders for Harsh Environment," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Maalekian, Mehran, Das, Aranav, Krassenburg, Ludo, van Veen, Co, Kodentsov, Alexander, and Biglari, Mo, "Development of Low Temperature Sn-Bi Based Pb-Free Solder Alloys," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 354-358.

Maalekian, Mehran, Xu, Yuan, and Seelig, Karl, "Effect of Bi Content on Properties of Low Silver SAC Solders," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 191-198.

Maalekian, Mehran, and Seelig, Karl, "Low Silver SAC-Bi Lead-Free Solder for Reliable Applications," International Conference on Soldering & Reliability 2017 Proceedings , Toronto, Ontario, Canada, June 6-8, 2017, pp. xx-xx.

Maalekian, Mehran, and Seelig, Karl, "New Pb-Free Solder Alloy for Demanding Applications," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 285-292.

Maalekian, Mehran, Seelig, Karl, and O'Neill, Timothy, "Sample Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys," IPC APEX Expo 2014, Las Vegas, NV, Mar. 25-27, 2014, pp. xx-xx.

Maattanen, Jarmo, "Contact resistance of metal-coated polymer particles used in anisotropically conductive adhesives," Soldering & Surface Mount Technology, vol., 15 no. 1, pp. 12-15, 2003.

Maattanen, Jarmo, "Contact Resistance Of Anisotropically Conductive Interconnection," Fifth International Conference on Electronic Packaging Technology Proceedings , Shanghai, China, Oct. 28-30, 2003, pp. 471-475.

Maattanen, Jarmo, Palm, Petteri, De Maquille, Yannick, and Bauduin, Nicholas, "Development of Fine Pitch (54 um) Flip Chip on Flex Interconnection Process," 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Zalaegerszeg, Hungary, June 23-26, 2002, pp. 155-159.

Maaz, K., Duan, J. L., Karim, S., Chen, Y. H., Yao, H. J., Mo, D., Sun, Y. M., and Liu, J., "Fabrication and low temperature magnetic studies of Ni-Co core-shell nanowires," Journal of Alloys and Compounds, vol. 662, pp. 296-301, Mar. 25, 2016.

Macavinta, Courtney, "The Great Galaxy 4 Satellite Pager Disaster," CNET News.com, May 20, 1998.

MacDavitt, Sean R., and Morris, James E., "Effect of Core Temperature on Impact Resistance of Conductive Adhesives," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 221-224.

MacDiarmid, Alex, Thermal Cycling Failures, Part One of Two," Journal of the Reliability Information Analysis Center, vol. 19 no. 1, pp. 2-5, Jan. 2011.

Mach, P., Busek, D., and Duraj, A., "Influence of Interconnection Surface Finishes on Quality of Adhesive Joints," 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, Vienna, Austria, May 19-20, 2005, pp. 331-335.

Mach, Pavel, and Cinert, Jakub, "Conductive Mechanisms in Electrical Conductive Adhesives with Isotropical Electrical Conductivity," 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging, Timisoara, Romania, Oct. 20-23, 2011, pp. 103-106.

Mach, Pavel, Jes, Josef, and Papez, Vaclav, "Degradation of Adhesive Bonds with Short Current Pulses," 26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials, The High Tatras, Slovak Republic, May 8-11, 2003, pp. 339-343.

Mach, Pavel, and Barto, Seba, "Effect of Resistance of Conductive Adhesive Joint on Course of Its Aging," 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging, Constanta, Romania, Oct. 26-29, 2017, pp. 94-97.

Mach, Pavel, Radev, Radoslav, and Pietrikova, Alena, "Electrically Conductive Adhesive Filled with Mixture of Silver Nano and Microparticles," 2nd Electronics Systemintegration Technology Conference , Greenwich, London, UK, Sept. 1-4, 2008, pp. 1141-1146.

Mach, Pavel, and Duraj, Ales, "Failure Mode and Effects Analysis of a Process of Reflow Lead-Free Soldering," 31st International Spring Seminar on Electronics Technology , Budapest, Hungary, May 7-11, 2008, pp. 394-398.

Mach, Pavel, and Cinert, Jakub, "Influence of Surface Finish on Resistance of Contacts Between ECA and Pad," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 131-134.

Mach, Pavel, and Busek, David, "Modification of Adhesive Joints Resistance with Current Pulses," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 143-146.

Mach, Pavel, Richter, Lukas, and Pietrikova, Alena, "Modification of Electrically Conductive Adhesives for Better Mechanical and Electrical Properties," 31st International Spring Seminar on Electronics Technology, Budapest, Hungary, May 7-11, 2008, pp. 228-233.

Mach, Pavel, and Busek, David, "Modification of Interfacial Properties between Filler Particles in Electrically Conductive Adhesives," 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging, Timisoara, Romania, Oct. 20-23, 2011, pp. 99-102.

Mach, Pavel, Zeman, Premysl, Kotrcova, Eva, and Barto, Seba, "Optimization of Lead-Free Wave Soldering Process Using Taguchi Orthogonal Arrays," 2010 3rd Electronic System-Integration Technology Conference , Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Mach, Pavel, "Preparation of Electrically Conductive Adhesives Modified with AgNO3," 32nd International Spring Seminar on Electronics Technology, Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.

Mach, Pavel, and Povolotskaya, Evgenija, "Study of Curing Process of Electrically Conductive Adhesives Using Differential Scanning Calorimetry," 2012 35th International Spring Seminar on Electronics Technology, Bad Aussee, Austria, May 9-13, 2012, pp. 248-253.

Mach, Pavel, and Busek, David, "Study of Thermomechanical Properties of One- and Two-Component Conductive Adhesives," Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, Dresden, Germany, May 7-11, 2014, pp. 105-108.

Mach, Pavel, Richter, Lukas, and Pietrikova, Alena, "Testing of Techniques for Improvement of Conductivity of Electrically Conductive Adhesives," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 305-308.

Mach, Pavel, and Busek, David, "Thermal Ageing of Electrically Conductive Micro/Nano Adhesives," 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging, Pitesti, Romania, Sept. 23-26, 2010, pp. 89-92.

Mach, Pavel, Busek, David, and Polansky, Radek, "Thermomechanical Analysis of Electrically Conductive Adhesives," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Mach, Pavel, Busek, David, and Jes, Josef, "Usability of Electrically Conductive Adhesives for Power Components Assembly," 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging, Pitesti, Romania, Sept. 23-26, 2010, pp. 301-304.

Machida, Junichi, Esaka, Hisao, Tamura, Manabu, and Shinozuka, Kei, "Characterization of Coupled-Zone in Sn-Cu Binary Eutectic Alloys Using Unidirectional Solidification," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 70 no. 1, pp. 73-79, Jan. 2006.

MacIntosh, R. M., "Tin in Cold Service," Tin and its Uses, no. 72, pp. 7-10, 1966.

MacIntosh, Robert M., "Tin in Electroplating," Plating, vol. 46 no. 6, pp. 617-620, June 1959.

MacKay, Colin A., "Method of inhibiting tin whisker growth," U. S. Patent 5,393,573, Feb. 28, 1995.

Mackay, David T., Janish, Matthew T., Sahaym, Uttara, Kotula, Paul G., Jungjohann, Katherine L., Carter, C. Barry, and Norton, M. Grant., "Template-free electrochemical synthesis of tin nanostructures," Journal of Materials Science, vol. 49 no. 4, pp. 1476-1483, Feb. 2014.

Mackie, Andy C., "Reflow Atmospheres in the Lead-Free Era," Circuits Assembly, vol. 14 no. 3, pp. 26-35, Mar. 2003.

Mackie, Andy C., and Lee, Ning-Chen, "Solder alloy trends and technologies in semiconductor packaging and assembly," Chip Scale Review, vol. 18 no. 4, pp. 14-19, July/Aug, 2014.

MacLeod, Ian, "The Decay and Conservation of Museum Objects of Tin," Studies in Conservation, vol. 50 no. 2, pp. 151-152, 2005.

MacMillan, N. H., "The Theoretical Strength of Solids," Journal of Materials Science , vol. 7 no. 2, pp. 239-254, Feb. 1972.

MacQueen, Alice, "Factors that Affect the Synthesis of Gold Nanorods," 2007 REU Research Accomplishments, pp. 32-33.

Made, Riko I., Gan, Chee Lip, Yan, Li Ling, Yu, Aibin, Yoon, Seung Wook, Lau, John H., and Lee, Chengkuo, "Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications," Journal of Electronic Materials, vol. 38 no. 2, pp. 365-371, Feb. 2009.

Madsen, Morten Hannibal, Krogstrup, Peter, Johnson, Erik, Venkatesan, Sriram, Muhlbauer, Erika, Scheu, Christina, Sorensen, Claus B., and Nygard, Jesper, "Experimental determination of adatom diffusion lengths for growth of InAs nanowires," Journal of Crystal Growth, vol. 364, pp. 16-22, Feb. 1, 2013.

Maeda, Masakatsu, Sato, Takaaki, Inoue, Naoto, Yagi, Daisuke, and Takahashi, Yasuo, "Anomalous microstructure formed at the interface between copper ribbon and tin-deposited copper plate by ultrasonic bonding," Microelectronics Reliability, vol. xx no. x, pp. xx-xx, xxxx.

Maeda, S., Akiyama, T., Nakamura, K., and Ito, T., "Orientation and size dependence on structural stability in silicon nanowires: A transferable tight-binding calculation study," Journal of Crystal Growth, vol. 301-302, pp. 871-875, Apr. 2007.

Maeda, Tsuyoshi, and Kamitamari, Tohru, "Current Situation of Immersion Silver Plating," Journal of the Surface Finishing Society of Japan, vol. 58 no. 2, pp. 101-104, 2007.

Maeda, Tsuyoshi, Wada, Shinsuke, Tanabe, Katsuhisa, Oda, Yukinori, Hashimoto, Shigeo, Gudeczauskas, Don, and Milad, George, "The Impact of P Content in Pd Deposit for Solder Joint Reliability and Wire Bonding Reliability of ENEPIG Deposits," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 982-987.

Maekawa, Mike, and Guzman, Phil de, "Speeding Up the Conversion Period for Lead-Free Products," Electronic Packaging & Production, vol. xx no. xx, pp. xx, May 2003.

Maekawa, Yasunari, Koshikawa, Hiroshi, and Yoshida, Masaru, "Anisotropically conducting films consisting of sub-micron copper wires in the ion track membranes of poly(ethylene terephthalate)," Polymer, vol. 45 no. 7, pp. 2291-2295, Mar. 2004.

Maestrelli, Licia, and Grigoletto, Eliane M., "Lead Free Implementation - A Case Study Correlating the Thermal Profile and Laboratory Analysis," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S19-01-1-S19-01-12.

Magagnin, L., Sirtori, V., Seregni, S., Origo, A., and Cavallotti, P. L., "Electroless Co-P for diffusion barrier in Pb-free soldering," Electrochimica Acta, vol. 50 no. 23, pp. 4621-4625, Aug. 25, 2005.

Magagnin, L., Ghilardi, M., Pagano, F., Lombardi, L., Sirtori, V., and Cavallotti, P. L., "Microindentation and XPS Characterization of ACD Ni-P," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 601-610.

Magalini, Federico, and Huisman, Jaco, "Compliance Key Factors of the EU WEEE Directive," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 358.

Magalini, Federico, and Huisman, Jaco, "Management of WEEE & Cost Models across the EU Could the EPR principle lead US to a better Environmental Policy?," Proceedings of the 2007 IEEE International Symposium on Electronics & the Environment, Orlando, FL, May 7-10, 2007, pp. 143-148.

Magnusson, A. W., and Baldwin Jr., W. M., "Low Temperature Brittleness," Journal of the Mechanics and Physics of Solids, vol. 5 no. 3, pp. 172-181, 1957.

Maguire, James F., "Evaluation of Alternatives To Lead Solders For Printed Wiring Assemblies," Design & Reliability of Solders and Solder Interconnections, Orlando, FL, Feb. 10-13, 1997, pp. 145-154.

Mahajan, S., and Williams, D. F., "Deformation Twinning in Metals and Alloys," International Metallurgical Reviews, vol. 18 no. 2, pp. 43-61, 1973. https://doi.org/10.1179/imtlr.1973.18.2.43

Mahalingam, Saketh, Goray, Kunal, and Joshi, Ashutosh, "Design of Underfill Materials for Lead Free Flip Chip Applications," The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 473-479.

Mahan, Kenny, Sun, Yong, Han, Bongtae, Han, Sungwon, and Osterman, Mike, "Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth," Journal of Electronic Packaging, vol. 136 no. 3, pp. 031004-1-031004-7, Sept. 2014.

Mahapatra, S. Das, Majumdar, B. S., Dutta, I., and Bhassyvasantha, S., "Eliminating Whisker Growth by Indium Addition in Electroplated Sn on Copper Substrate," Journal of Electronic Materials, vol. 46 no. 7, pp. 4062-4075, July 2017.

Mahapatra, S. Das, Majumdar, B. S., and Dutta, I., "Elimination of Tin Whisker Growth by Indium Addition to Electroplated Tin in Electronic Packages," 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 30-June 2, 2017, pp. 1425-1432.

Mahapatra, S. Das, Meinshausen, L., Bhassyvasantha, S., Yang, H., Banerjee, S., Majumdar, B. S., and Dutta, I., "Influence of Indium Addition on Whisker Growth in Electroplated Tin," Tin Whisker Group teleconference, May 11, 2016.

Mahapatra, S. Das, and Dutta, I., "Role of surface oxide in mitigating tin whisker growth: A finite element study," Materials Science and Engineering: A, vol. 706, pp. 181-191, Oct. 26, 2017. https://doi.org/10.1016/j.msea.2017.09.006

Mahdavifard, M. H., Sabri, M. F. M., Said, S. M., Shnawah, D. A., Badruddin, I. A., and Rozali, S., "Effects of Fe and Bi Minor Alloying on Mechanical, Thermal, and Microstructural Properties of Sn-0.7Cu Solder Alloy," Journal of Electronic Materials, vol. 45 no. 7, pp. 3673-3682, July 2016.

Mahdavifard, M. H., Sabri, M. F. M., Said, S. M., and Rozali, S., "High stability and aging resistance Sn-1Ag-0.5Cu solder alloy by Fe and Bi minor alloying," Microelectronic Engineering, vol. 208, pp. 29-38, Mar. 1, 2019.

Mahdavifard, M. H., Sabri, M. F. M., Shnawah, D. A., Said, S. M., Badruddin, I. A., and Rozali, S., "The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn-1Ag-0.5Cu solder alloy," Microelectronics Reliability, vol. 55 no. 9-10, pp. 1886-1890, Aug.-Sept. 2015.

Mahidhara, Rao, "A Primer on Lead-Free Solder," Chip Scale Review, vol. xx no. xx, pp. xx, Mar.-Apr. 2000.

Mahidhara, Rao K., Murty, K. Linga, and Haggag, Fahmy M., "Creep and Mechanical Properties of Sn-5%Sb Solder," Design & Reliability of Solders and Solder Interconnections, Orlando, FL, Feb. 10-13, 1997, pp. 73-83.

Mahidara, Rao K., Murty, K. Linga, and Haggag, Fahmy M., "Mechanical Property Characterization of Sn-5%Sb Solder Using Traditional (Tensile and Creep) and Ball Indentation Testing Using Stress-Strain Microprobe," Proceedings of the Technical Program NEPCON West '96, Volume 1, Anaheim, CA, Feb. 25-29, 1996, pp. 183-194.

Mahidhara, Rao, Solberg, Vern, Zohni, Wael, and Jfelstad, Joseph, "Strip Assembly Attachment of Solid Core Balls for CSPs," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Sept. 1998.

Mahieu, J., De Wit, K., De Boeck, A., and De Cooman, B. C., "The Properties of Electrodeposited Zn-Co Coatings," Journal of Materials Engineering and Performance, vol. 8 no. 5, pp. 561-570, Oct. 1999.

Mahim, Z., Ismail, N. A., Salleh, M. A. A. Mohd, and Khor, C. Y., "The Effect of Temperature on Tin Whisker Growth under Mechanical Stress," Solid State Phenomena, vol. 280, pp. 194-199, Aug. 2018.

Mahim, Z., Salleh, M. A. A., and Khor, C. Y., "The Effects of Oxidation Layer, Temperature, and Stress on Tin Whisker Growth: A Short Review," Materials Science and Engineering, vol. 318, pp. 012063-1-012063-6, 2018.

Mahmudi, R., and Geranmayeh, A. R., "A comparative study of room-temperature creep in lead-free tin-based solders," International Journal of Materials Research, vol. 101 no. 2, pp. 271-278, Feb. 2010.

Mahmudi, R., Geranmayeh, A. R., Noori, H., Khanbareh, H., and Jahangiri, N., "A comparison of impression, indentation and impression-relaxation creep of lead-free Sn-9Zn and Sn-8Zn-3Bi solders at room temperature," Journal of Materials Science: Materials in Electronics, vol. 20 no. 4, pp. 312-318, Apr. 2009.

Mahmudi, R., Geranmayeh, A. R., Noori, H., Nayyeri, G., and Pishbin, F., "Creep of dilute tin based lead free solder alloys as replacements of Sn-Pb solders," Materials Science and Technology, vol. 24 no. 7, pp. 803-808, July 2008.

Mahmudi, R., Geranmayeh, A. R., Noori, H., Jahangiri, N., and Khanbareh, H., "Effect of cooling rate on the room-temperature impression creep of lead-free Sn-9Zn and Sn-8Zn-3Bi solders," Materials Science and Engineering: A , vol. 487, no. 1-2, pp. 20-25, July 25, 2008.

Mahmudi, R., Geranmayeh, A. R., Mahmoodi, S. R., and Khalatbari, A., "Effect of cooling rate on the room-temperature indentation creep of cast lead-free Sn-Bi solder alloys," Physica Status Solidi, vol. 204 no. 7, pp. 2302-2308, July 2007.

Mahmudi, R., Geranmayeh, A. R., Allami, M., and Bakherad, M., "Effect of Homogenization on the Indentation Creep of Cast Lead-Free Sn-5%Sb Solder Alloy," Journal of Electronic Materials, vol. 36 no. 12, pp. 1703-1710, Dec. 2007.

Mahmudi, R., Geranmayeh, A. R., Noori, H., Khanbareh, H., and Jahangiri, N., "Effect of isothermal aging on room temperature impression creep of lead free Sn-9Zn and Sn-8Zn-3Bi solders," Materials Science and Technology, vol. 26 no. 8, pp. 1001-1007, Aug. 2010.

Mahmudi, R., Geranmayeh, A. R., Zahiri, B., and Marvasti, M. H., "Effect of rare earth element additions on the impression creep of Sn-9Zn solder alloy," Journal of Materials Science: Materials in Electronics , vol. 21 no. 1, pp. 58-64, Jan. 2010.

Mahmudi, R., Geranmayeh, A. R., Noori, H., and Taghaddosi, M., "Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy," Journal of Electronic Materials, vol. 38 no. 2, pp. 330-337, Feb. 2009.

Mahmudi, R., and Alibabaie, S., "Elevated-temperature shear strength and hardness of Zn-3Cu-xAl ultra-high-temperature lead-free solders," Materials Science and Engineering: A, vol. 559, pp. 421-426, Jan. 1, 2013.

Mahmudi, R., Alizadeh, R., and Geranmayeh, A. R., "Enhanced superplasticity in equal channel angularly pressed Sn-5Sb alloy," Scripta Materialia, vol. 64 no. 6, pp. 521-524, Mar. 2011.

Mahmudi, R., Geranmayeh, A. R., and Rezaee-Bazzaz, A., "Impression creep behavior of lead-free Sn-5Sb solder alloy," Materials Science and Engineering: A, vol. 448 no. 1-2, pp. 287-293, Mar. 15, 2007.

Mahmudi, R., and Farasheh, D., "Impression creep behavior of Zn-4Al-3Mg-xSn high-temperature lead-free solders," Microelectronics Reliability, vol. 55 no. 12 pt. A, pp. 2542-2548, Dec. 2015.

Mahmudi, R., and Eslami, M., "Impression Creep Behavior of Zn-Sn High-Temperature Lead-Free Solders," Journal of Electronic Materials, vol. 39 no. 11, pp. 2495-2502, Nov. 2010.

Mahmudi, R., Geranmayeh, A. R., Noori, H., and Shahab, M., "Impression creep of hypoeutectic Sn-Zn lead-free solder alloys," Materials Science and Engineering: A, vol. 491 no. 1-2, pp. 110-116, Sept. 15, 2008.

Mahmudi, R., Geranmayeh, A. R., Salehi, M., and Pirayesh, H., "Impression creep of the rare-earth doped Sn-2%Bi lead-free solder alloy," Journal of Materials Science: Materials in Electronics, vol. 21 no. 3, pp. 262-269, Mar. 2010.

Mahmudi, R., Geranmayeh, A. R., Bakherad, M., and Allami, M., "Indentation creep study of lead-free Sn-5%Sb solder alloy," Materials Science and Engineering: A, vol. 457 no. 1-2, pp. 173-179, May 25, 2007.

Mahmudi, R., Geranmayeh, A. R., Mahmoodi, S. R., and Khalatbari, A., "Indentation creep of lead-free Sn-Bi solder alloys as replacements of Sn-Pb used in microelectronic packaging," 31st International Conference on Electronics Manufacturing and Technology, Kuala Lumpur, Malasia, Nov. 8-10, 2007, pp. 443-449.

Mahmudi, R., and Farasheh, D., "Microstructure and elevated-temperature shear strength of Zn-4Al-3Mg-xSn high-temperature lead-free solders," Microelectronics Reliability , vol. 54 no. 8, pp. 1592-1597, Aug. 2014.

Mahmudi, R., Geranmayeh, A. R., Mahmoodi, S. R., and Khalatbari, A., "Room-temperature indentation creep of lead-free Sn-Bi solder alloys," Journal of Materials Science: Materials in Electronics, vol. 18 no. 10, pp. 1071-1078, Oct. 2007.

Mahmudi, R., and Eslami, M., "Shear strength of the Zn-Sn high-temperature lead-free solders," Journal of Materials Science: Materials in Electronics, vol. 22 no. 8, pp. 1168-1172, Aug. 2011.

Mahoney, Jerry, "Getting the lead out," Electronic Business, June 15, 2003.

Mair, Nick, "Our Experience With RoHS & WEEE," SMART Group "All You Ever Wanted to Know About Lead-Free" Seminar, High Wycombe, United Kingdom, Nov. 1, 2005.

Maire, Olivier, Bousquet, Sophie, Vigier, Magali, Wazad, Nadia, Dabek, Alexander, Gil, Chantal, Tran, Michele, Backes, Thomas, and Grieu, Marc, "Assessment of Sn-3.0Ag-0.5Cu Solder Joints Submitted to Different Thermal Cycling," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 634-640.

Mairen, Dimas Jesus Morilla, "Tin Whisker Growth on Surface Mount Devices: A Study Using Standarized Test Conditions," 6th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Oberpfaffenhofen, Germany, Apr. 15-16, 2015, pp. xx-xx.

Majumdar, B. S., Dutta, I., Bhassyvasantha, S., and Mahapatra, S. Das, "Recent Advances in Mitigation of Whiskers from Electroplated Tin," JOM , vol. 72 no. 2, pp. 906-917, Feb. 2020.

Makabe, Akira, Kurashima, Yohei, Shimizu, Statoshi, and Inoue, Shigeki, "The Technology of Flip Chip Bonding on an Organic Substrate for PDA," Proceedings 2001 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4587), Baltimore, MD, Oct. 9-11, 2001, pp. 287-292.

Malakhov, Dmitri V., Liu, Xing Jun, Ohnuma, Ikuo, and Ishida, Kiyohito, "Thermodynamic Calculation of Phase Equilibria of the Bi-Sn-Zn System," Journal of Phase Equilibria, vol. 21 no. 6, pp. 514-520, 2000.

Malanga. David, Tredinnick, Meg, and Zhang, Weiming, "ROHS Compliant (Lead and Cadmium free) Silver based Terminations for MLCC's and other Passive Components," CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. 86-90.

Malanga, David, Zhang, Weiming, Chang, Titan, Tredinnick, Meg, and Chang, Titan, "ROHS Compliant (Lead and Cadmium free) Silver based Terminations for MLCC's and other Passive Components," Proceedings CARTS Asia 2005, Taipei, Taiwan, Oct. 11-13, 2005, pp. 42-51.

Malatkar, Pramod, Chin, Ian, Chavarria, Jose, Kesavan, Rohini, and Wong, Shaw Fong, "On the Mechanical Fatigue Study of Second-Level Interconnects Using the E-N Curve Approach," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 930-935.

Maleki, Milad, Cugnoni, Joel, and Botsis, John, "Isothermal Ageing of SnAgCu Solder Alloys: Three-Dimensional Morphometry Analysis of Microstructural Evolution and Its Effects on Mechanical Response," Journal of Electronic Materials, vol. 43 no. 4, pp. 1026-1042, Apr. 2014.

Maleki, Milad, Cugnoni, Joel, and Botsis, John, "Microstructure-based modeling of the ageing effect on the deformation behavior of the eutectic micro-constituent in SnAgCu lead-free solder," Acta Materialia, vol. 61 no. 1, pp. 103-114, Jan. 2013.

Maleki, Milad, Cugnoni, Joel, and Botsis, John, "On the Mutual Effect of Viscoplasticity and Interfacial Damage Progression in Interfacial Fracture of Lead-Free Solder Joints," Journal of Electronic Materials, vol. 40 no. 10, pp. 2081-2092, Oct. 2011.

Maley, J. J., "Effects of Some High-Voltage Conditioning Processes on Tungsten Electrodes," Journal of Vacuum Science and Technology, vol. 8 no. 6, pp. 697-700, 1971.

Malfait, Wim J., Klemencic, Robert, Lang, Britta, Rist, Tobias, Klucka, Martin, Zajacz, Zoltan, and Koebel, Matthias M., "Optimized solder alloy for glass-to-metal joints by simultaneous soldering and anodic bonding," Journal of Materials Processing Technology, vol. 236, pp. 176-182, Oct. 2016.

Malgas, Gerald F., Adams, Daniel, Nguyen, Phucanh, Wang, Yu, Alford, T. L., and Mayer, J. W., "Investigation of the effects of different annealing ambients on Ag/Al bilayers: Electrical properties and morphology," Journal of Applied Physics, vol. 90 no. 11, pp. 5591-5598, Dec. 1, 2001.

Malhammar, Goran, Knowdon, Ken, and Bergman, Ruben, "Environmentally Compliant Electronics Framework Specification," High Density Packaging User Group International, Feb. 1, 2000.

Mallampati, Sandeep, Schoeller, Harry, Yin, Liang, Shaddock, David, and Cho, Junghyun, "Developments of High-Bi Alloys as a High Temperature Pb-Free Solder," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 1328-1334.

Mallampati, Sandeep, Yin, Liang, Shaddock, David, Schoeller, Harry, and Cho, Junghyun, "Lead-Free Alternatives for Interconnects in High-Temperature Electronics," Journal of Electronic Packaging, vol. 140 no. 1, pp. 010906-1-010906-7, Mar. 2018.

Mallet, Jeremy, Kante, Ibrahima, Fricoteaux, Patrick, Molinari, Michael, and Troyon, Michel, "Temperature and pH influences on the structural and the emission properties of electrodeposited CdSe nanowires," Journal of Solid State Electrochemistry, vol. 16 no. 3, pp. 1041-1047, Mar. 2012.

Mallik, Aditi, and Stout, Roger, "Simulation Methods for Predicting Fusing Current and Time for Encapsulated Wire Bonds," IEEE Transactions on Electronics Packaging Manufacturing , vol. 33 no. 4, pp. 255-264, Oct. 2010.

Mallik, S., Ekere, N. N., Durairaj, R., Marks, A. E., "A Study of the Rheological Properties of Lead free Solder Paste formulations used for Flip-Chip Interconnection," 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium, San Jose, CA, Oct. 3-5, 2007, pp. 165-171.

Mallik, S., Ekere, N. N., Durairaj, R., and Marks, A. E., "An investigation into the rheological properties of different lead-free solder pastes for surface mount applications," Soldering & Surface Mount Technology, vol. 20 no. 2, pp. 3-10, 2008.

Mallik, S., Schmidt, M., Bauer, R., and Ekere, N. N., "Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance," Soldering & Surface Mount Technology, vol. 22 no. 4, pp. 42-49, 2010.

Mallik, S., Ekere, N. N., Marks, A. E., Seman, A., and Durairaj, R., "Modelling of the Time-dependent Flow Behaviour of Lead-Free Solder Pastes used for Flip-Chip Assembly Applications," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 1219-1223.

Mallik, S., Ekere, N. N., Marks, A. E., Seman, A., and Durairaj, R., "Modeling the Structural Breakdown of Solder Paste Using the Structural Kinetic Model," Journal of Materials Engineering and Performance, vol. 19 no. 1, pp. 40-45, Feb. 2010.

Mallik, S., Thieme, J., Bauer, R., Ekere, N. N., Seman, A., Bhatti, R., and Durairaj, R., "Study of the Rheological behaviours of Sn-Ag-Cu Solder pastes and their Correlation with Printing Performance," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 869-874.

Mallick, Sanjoy, Kabir, Md Sharear, and Sharif, Ahmed, "Study on the properties of Zn-xNi high temperature solder alloys," Journal of Materials Science: Materials in Electronics, vol. 27 no. 4, pp. 3608-3618, Apr. 2016.

Malmhall, R., Mohri, K., Humphrey, F. B., Manabe, T., Kawamura, H., Yamasaki, J., and Ogasawara, I., "Bistable Magnetization Reversal in 50 um Diameter Annealed Cold-Drawn Amorphous Wires," IEEE Transactions on Magnetics, vol. 23 no. 5, pp. 3242-3244, Sept. 1987.

Malucci, Robert D., "Characteristics of Films Developed in Fretting Experiments on Tin Plated Contacts," Proceedings of the Forty-Fifth IEEE Holm Conference on Electrical Contacts, Pittsburgh, PA, Oct. 4-6, 1999, pp. 175-185.

Manalang, Laarni M., and dela Cruz, Marivic, "Process Parameter Modeling: A Requisite in Switching to Pb-free Plating," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Manasijevic, Dragan, Vrestal, Jan, Minic, Dusko, Kroupa, Ales, Zivkovic, Dragana, and Zivkovic, Zivan, "Experimental investigation and thermodynamic description of the In-Sb-Sn ternary system," Journal of Alloys and Compounds, vol. 450 no. 1-2, pp. 193-199, Feb. 14, 2008.

Manasijevic, Dragan, Vrestal, Jan, Minic, Dusko, Kroupa, Ales, Zivkovic, Dragana, and Zivkovic, Zivan, "Phase equilibria and thermodynamics of the Bi-Sb-Sn ternary system," Journal of Alloys and Compounds, vol. 438 no. 1-2, pp. 150-157, July 12, 2007.

Manavbasi, Alp, and Estes, Byron, "Hexavalent chromium free sealants boost hard=coated aluminium alloys," Aluminium International Today, vol. 22 no. 6, pp. 29-31, Nov./Dec. 2010.

Manchen, Ken, "Do You Know Where Your E-Waste Is Going?," Design News, vol. 64 no. 3, pp. xx, Mar. 2009.

Manchen, Ken, "Green regulations outside the European Union," Electronic Products , vol. 48 no. 7, pp. 57, Dec. 2005.

Mandal, Rathin, and Mui, Y. C., "Copper-Pillar Bump-Joint Thermo-Mechanical and Thermal Modeling for Flip-Chip Packages," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1184-1189.

Mandel, Richard, "OSHA revises standards on hexavalent chromium," Welding Design and Fabrication, vol. 80 no. 2, pp. 30,36, Feb. 2007.

Mandel, Richard, "What You Need to Know About Hexavalent Chromium," Welding Design and Fabrication, vol. 80 no. 4, pp. 22,24, Apr. 2007.

Mandich, N. V., "Chemistry & Theory of Chromium Deposition: Part I - Chemistry," Plating & Surface Finishing, vol. 84 no. 5, pp. 108-115, May 1997.

Mandich, N. V., "The Mechanisms of Chromium Plating II," Proceedings AESF SUR/FIN '96 , Cleveland, OH, June 10-13, 1996, pp. 401-426.

Mandl, Bernhard, Dey, Anil W., Stangl, Julian, Cantoro, Mirco, Wernersson, Lars-Erik, Bauer, Gunther, Samuelson, Lars, Deppert, Knut, and Thelander, Claes, "Self-seeded, position-controlled InAs nanowire growth on Si: A growth parameter study," Journal of Crystal Growth, vol. 334 no. 1, pp. 51-56, Nov. 1, 2011.

Maner, Kaoru U., Ang, Simon S., Schaper, Leonard W., and Brown, William D., "Polymeric Conductive Pastes as Solder Replacement for Flip-Chip Attachment," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, vol. 21 no. 4, pp. 382-393, Nov. 1998.

Maness Jr., Lindsey V., "Predicting Indium and Tellurium Availability," 2010 35th IEEE Photovoltaic Specialists Conference, Honolulu, HI, June 20-25, 2010, pp. 560-613.

Manessis, D., Patzelt, R., Reichl, H., Boettcher, L., Ostmann, A., Schild, B., and Aschenbrenner, R., "Qualitative Evaluation of Flip Chip Solder Bumps Produced by Stencil Printing of Solder Paste on Various Electroless Nickel/Gold Metallizations," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 461-468.

Manessis, Dionysios, Huang, Mingliang, Loeher, Thomas, Ostmann, Andreas, Aschenbrenner, Rolf, and Reichl, Herbert, "Failure Analysis of Sub-50 um Lead-free Solder Bumps on Electroless Ni-P UBM for Flip Chip Interconnects," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2, Singapore, Dec. 7-9, 2005, pp. 515-520.

Manhart, Andreas. "International Cooperation for Metal Recycling From Waste Electrical and Electronic Equipment," Journal of Industrial Ecology, vol. 15 no. 1, pp. 13-30, Feb. 2011.

Mani, Sathya, Saif, Taher, and Han, Jong H., "Effect of Annealing on the Conductivity of Electroless Deposited Ni Nanowires and Films," IEEE Transactions on Nanotechnology, vol. 5 no. 2, pp. 138-141, Mar. 2006.

Maniar, Youssef, Konstantin, Georg, Kuczynska, Marta, Kabakchiev, Alexander, and Guyenot, Michael, "Experimental investigation and numerical modelling of the High Cycle Fatigue behaviour of a SnAgCu-solder alloy including temperature and mean stress effects," 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Toulouse, France, Apr. 15-18, 2018, pp. xx-xx.

Maniar, Youssef, Konstantin, Georg, Kabakchiev, Alexander, Binkele, Peter, and Schmauder, Siegfried, "Experimental investigation of temperature and mean stress effects on high cycle fatigue behavior of SnAgCu-solder alloy," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 1651-1658.

Manjunath, Deepak, Iyer, Satyanarayan, Damodaran, Purushotharnan, and Srihari, Krishnaswami, "Developing a Repeatable and Reliable Rework Process for Lead-Free Fine-Pitch BGAs," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 4, pp. 270-278, Oct. 2007.

Manjunath, Deepak, Iyer, Satyanarayan, Eckel, Shawn, Damodaran, Purushothaman, and Srihari, Krishnaswami, "Flux Splatter Evaluation of Lead-free Solder Pastes," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies , San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Manjunath, Deepak, Iyer, Satyanarayan, Eckel, Shawn, Damodaran, Purushothaman, and Srihari, Krishnaswami, "Minimizing flux spatter during lead-free reflow assembly," Soldering & Surface Mount Technology, vol. 18 no. 3, pp. 19-23, 2006.

Mankikar, Mohan, "RoHS Inspires No Passion in Power Arena," Power Electronics Technology , vol. 31 no. 8, pp. 76, Aug. 2005.

Manko, Howard H., "Lead-Free Solder - A Status Report," Electronic Packaging & Production, vol. 35 no. 2, pp. 70-72, Feb. 1995.

Manko, Howard H., "Lead Free Solder - A Status Report," Proceedings of the Technical Program NEPCON East '95, Boston, MA, June 12-15, 1995, pp. 347-353.

Manko, Howard H., "Solder Selection for Hybrid Bonding," 1975 International Microelectronic Symposium, Orlando, FL, Oct. 27-29, 1975, pp. 178-183.

Manley, Ron, "Unearthing Opportunity in "Going Green"," ECN, pp. 8, Dec. 2005.

Mann, R. D., "The economics of equipment recycling," Engineering Science and Education Journal, vol. 5 no. 4, pp. 170-176, Aug. 1996.

Mannan, S. H., Oguibe, C. N., Whalley, D. C., and Williams, D. J., "Effects of Gap Height on Conduction Within Anisotropic Conducting Adhesive Assemblies," Journal of Electronics Manufacturing, vol. 7 no. 3, pp. 211-224, Sept. 1997.

Mannan, S. H., Williams, D. J., and Whalley, D. C., "Some optimum processing properties for anisotropic conductive adhesives for flip chip interconnection," Journal of Materials Science: Materials in Electronics, vol. 8 no. 4, pp. 223-231, Apr. 1997.

Mannan, Samjid H., Whalley, David C., Ogunjimi, Adebayo Ogunjimi, and Williams, David J., "Assembly of Planar Array Components Using Anisotropic Conducting Adhesives - A Benchmark Study: Part II - Theory," IEEE Transactions on Components, Packaging, and Manufacturing Technology Part C: Manufacturing, vol. 19 no. 4, pp. 264-269, Oct. 1996.

Mannan, Samjid, and Clode, Michael P., "Dissolution of solids in contact with liquid solder," Soldering & Surface Mount Technology, vol. 16 no. 3, pp. 31-33, 2004.

Mannan, Samjid, Ogunjimi, Adebayo O., Whalley, David C., and Williams, David J., "Electrical Contact Reliability in Anisotropic Conducting Adhesives Connections for Flip Chip Technology ," Advances in Electronic Packaging 1997, Volume 1, Kohala Coast, Hawaii, June 15-19, 1997, pp. 167-176.

Mannan, Samjid H., Whalley, David C., Ogunjimi, Yinka O., and Williams, David J., "Modelling of the Initial Stages of the Anisotropic Adhesive Joint Assembly Process," Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium, Omiya, Japan, Dec. 4-6, 1995, pp. 142-145.

Mannan, Samjid H., Clode, Mike P., and Dagher, Mohamed, "Study of Intermetallic Cyrstal Growth between Nb and Molten 52In-48Sn Solder," Journal of Electronic Materials, vol. 34 no. 2, pp. 125-131, Feb. 2005.

Manners, David, "On, off and somewhere in between," Electronics Weekly, Aug. 3, 2005.

Manners, David, "Power supply group publishes guide," electronicsweekly.com, Jan. 11, 2005.

Manock, John, Coyle, Richard, Vaccaro, Brian, McCormick, Heather, Popowich, Richard, Fleming, Debra, Read, Peter, Osenbach, John, and Gerlach, Dan, "Effect of Temperature Cycling Parameters on the Solder Joint Reliability of a Pb-Free PBGA Package," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 564-573.

Manock, John, Coyle, Richard, Vaccaro, Brian, McCormick, Heather, Popowich, Richard, Fleming, Debra, Read, Peter, Osenbach, John, and Gerlach, Dan, "Effect of Temperature Cycling Parameters on the Solder Joint Reliability of a Pb-Free PBGA Package," SMTAnews & Journal of Surface Mount Technology, vol. 21 no. 3, pp. 36-46, July-Sept. 2008.

Manomaivibool, Panate, "Extended producer responsibility in a non-OECD context: The management of waste electrical and electronic equipment in India," Resources, Conservation and Recycling, vol. 53 no. 3, pp. 136-144, Jan. 2009.

Manomaivibool, Panate, "Network management and environmental effectiveness: the management of end-of-life vehicles in the United Kingdom and in Sweden," Journal of Cleaner Production, vol. 16 no. 18, pp. 2006-2017, Dec. 2008 .

Manomaivibool, Panate, and Hong, Jong Ho, "Two decades, three WEEE systems: How far did EPR evolve in Korea's resource circulation policy?," Resources, Conservation and Recycling, vol. 83, pp. 202-212, Feb. 2014.

Manriquez, Jorge A., Molina, Oscar, Cardenas, Juan C., and Toleno, Brian J., "Reliability of Tin Terminated Components in a Lead-Free System," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 576-583.

Mans, Christian, Hanning, Stephanie, Simons, Christoph, Wegner, Anne, Jansen, Anton, and Kreyenschmidt, Martin, "Development of suitable plastic standards for X-ray fluorescence analysis," Spectrochimica Acta - Part B Atomic Spectroscopy, vol. 62 no. 2, pp. 116-122, Feb. 2007.

Mansfeld, F., Breslin, C. B., Pardo, A., and Perez, F. J., "Surface modification of stainless steels: Green technology for corrosion protection," Surface and Coatings Technology, vol. 90 no. 3, pp. 224-228, Apr 1, 1997.

Mansour, M. M., Saad, G., Wahab, L. A., and Fawzy, A., "Indentation creep behavior of thermally aged Sn-5wt%Sb-1.5wt%Ag solder integrated with ZnO nanoparticles," Journal of Materials Science: Materials in Electronics, vol. 30 no. 9, pp. 8348-8357, May 2019.

Mansour, M. M., Fawzy, A., Wahab, L. A., and Saad, G., "Tensile characteristics of Sn-5wt%Sb-1.5wt%Ag reinforced by nano-sized ZnO particles," Journal of Materials Science: Materials in Electronics , vol. 30 no. 5, pp. 4831-4841, Mar. 2019.

Mansour, S., and Zarei, M., "A multi-period reverse logistics optimisation model for end-of-life vehicles recovery based on EU Directive," International Journal of Computer Integrated Manufacturing, vol. 21 no. 7, pp. 764-777, Oct. 2008.

Mansson, Nina, Bergback, Bo, and Sorme, Louise "Phasing Out Cadmium, Lead, and Mercury," Journal of Industrial Ecology , vol. 13 no. 1, pp. 94-111, Feb. 2009.

Mantena, Keerthivarma;,Li, Jing, and Lumpp, Janet K., "Electrically Conductive Carbon Nanotube Adhesives on Lead Free Printed Circuit Board Surface Finishes," 2008 IEEE Aerospace Conference Proceedings, Big Sky, MT, Mar. 1-8, 2008, pp. xx-xx.

Manty, Brian A., Weis, Melissa L., and Cavanaugh, John H., "Advanced Techniques for Replacing Hexavalent Chrome Plating," Proceedings of The International Technical Conference of SUR/FIN, Baltimore, MD, June 26-29, 1995, pp. 459-464.

Manukova, Aneliya, Stephanov, Doychin, and Mashkov, Petko, "Environmental Tests for Automotive Electronic Devices Produced by Lead-free Technology," 32nd International Spring Seminar on Electronics Technology , Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.

Mao, Hu, Yang, Hongliang, Shi, Xiaobin, Li, Yongtao, Zhang, Junsong, and Jiang, Jiang, "Transformation and superelastic characteristics of large hysteresis TiNi matrix shape memory alloys reinforced by V nanowires," Materials Letters , vol. 228, pp. 391-394, Oct. 1, 2018.

Mao, J. S., Dong, Jaimee, and Graedel, T. E., "The multilevel cycle of anthropogenic lead: I. Methodology," Resources, Conservation, and Recycling, vol. 52 no. 8-9, pp. 1058-1064, July 2008.

Mao, J. S., Dong, Jaimee, and Graedel, T. E., "The multilevel cycle of anthropogenic lead: II. Results and discussion," Resources, Conservation, and Recycling, vol. 52 no. 8-9, pp. 1050-1057, July 2008.

Mao, Jiansu, and Graedel, T. E., "Lead In-Use Stock: A Dynamic Analysis," Journal of Industrial Ecology , vol. 13 no. 1, pp. 112-126, Feb. 2009.

Mao, Jie, Reeves, Benjamin, Lenz, Brendan, Ruscitto, Daniel, and Lewis, Dan, "Study on the Effect of Mn, Zn, and Sb on Undercooling Behavior of Sn-Ag-Cu Alloys Using Differential Thermal Analysis," Journal of Electronic Materials, vol. 46 no. 11, pp. 6319-6332, Nov. 2017.

Mao, Jiwang, Liu, Bin, Li, Ming, Wang, Yu, and Mao, Dali, "IMC Formation between Electroless Ni/Pd/Au Surface Finish and SnAgCu Solder," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Mao, Xu, Fang, Zhiqiang, Zhang, Zhe, Yan, Jinling, Qi, Zhimei, and Yang, Fuhua, "Sn-rich Au-Sn Hermetic Packaging at Wafer Level and Its Application in SPR Sensor," 2013 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Suzhou, China, Apr. 7-10, 2013, pp. 244-247.

Mao, Yongyun, Wang, Chuan, and Yang, Hongwei, "Facile synthesis of needle-like single-crystal silver clusters," Materials Letters, vol. 142, pp. 112-114, Mar. 1, 2015.

Mao, Yongyun, Wang, Chuan, and Yang, Hongwei, "Rapid and uniform synthesis of silver nanowires via rice-shaped silver nucleant," Materials Letters, vol. 142, pp. 102-105, Mar. 1, 2015.

Mapelli, C., Nicodemi, W., and Venturini, R., "Analysis and research of damage phenomena on tin based organ pipes of different ages," Surface Engineering, vol. 21 no. 5-6, pp. 373-377, 2005. https://doi.org/10.1179/174329305X64349

Mapelli, Carlo, "Description of the wiredrawing of a rod based on the crystalline-based plasticity," Wire Journal International, vol. 37 no. 10, pp. 70-75, Oct. 2004.

Mapelli, Carlo, Nicodemi, Walter, and Venurini, Roberto, "Studio dei fenomeni di degrado di canne in lega metallica appartenenti ad organi musicali italiani di diverse epoche," Politecnico, pp. 84-89, Aug. 2005.

Mapleston, Peter, "Flame Retardants: Is the Customer Always Right?," Plastics Engineering , vol. 63 no. 7, pp. 18-22, July 2007.

Maqableh, Mazin M., Tan, Liwen, Huang, Xiaobo, Cobianc, Ryan, Norby, Greg, Victora, R. H., and Stadler, Bethanie J. H., "CPP GMR Through Nanowires," IEEE Transactions on Magnetics, vol. 48 no. 5, pp. 1744-1750, May 2012.

Marauska, S., Claus, M., Lisec, T., and Wagner, B., "Low temperature transient liquid phase bonding of Au/Sn and Cu/Sn electroplated material systems for MEMS wafer-level packaging," Microsystem Technologies, vol. 19 no. 8, pp. 1119-1130, Aug. 2013.

Marcano, Manny, "RoHS Compliance Starts in the Design Phase," ECN Supplement, pp. 15-16, Nov. 2005.

Marcq, F., Demont, P., Monfraix, P., Peigney, A., Laurent, Ch., Falat, T., Courtade, F., and Jamin, T., "Carbon nanotubes and silver flakes filled epoxy resin for new hybrid conductive adhesives," Microelectronics Reliability, vol. 51 no. 7, pp. 1230-1234, July 2011.

Marczi, Michael, "Meeting the Environmental Care Challenge," Surface Mount Technology , vol. 18 no. 2, pp. xx-xx, Feb. 2004.

Mardani, Reza, Asrar, Abdorreza, and Ershadifar, Hamid, "The effect of surfactant on the structure, composition and magnetic properties of electrodeposited CoNiFe /Cu microwire," Materials Chemistry and Physics, vol. 211, pp. 160-167, June 1, 2018.

Margetson, Graham, "Dare cross the Atlantic," Electronics World, vol. 111 no. 1825, pp. 12, Jan. 2005.

Margulis, Vl. A., Piterimova, T. V., and Gaiduk. E. A., "Effects of surface scattering on the thermal-noise properties and AC conductance of whiskers," Physica B: Condensed Matter, vol. 324 no. 1-4, pp. 90-101, 2002.

Maria, J., Dang, B., Wright, S. L., Tsang, C. K., Andry, P., Polastre, R., Liu, Y., Wiggins, L., and Knickerbocker, J. U., "3D Chip Stacking with 50 um Pitch Lead-Free Micro-C4 Interconnections," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 268-273.

Marin, Alexandru, Svasta, Paul, and Simion-Zanescu, Daniel, "Theoretical and Experimental Aspects in the Depositing Process of Solder and Adhesive Pastes in Surface Mount Technology," 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Zalaegerszeg, Hungary, June 23-26, 2002, pp. 150-154.

Marin, Alexandru, Svasta, Paul, Ionescu, Ciprian, and Codreanu, Norocel-Dragos, "Using of Solderable Conductive Pastes in PCB Prototyping," 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Zalaegerszeg, Hungary, June 23-26, 2002, pp. 17-21.

Marin, Francisco Guillen, Whalley, David, Kristiansen, Helge, and Zhang, Zhiliang, "Mechanical Performance of Polymer Cored BGA Interconnects," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 316-321.

Marinis, Thomas F., and Soucy, Joseph W., "Design of Solder Connections for Self-Assembly of Optoelectronic Devices," Journal of Microelectronics and Electronic Packaging, vol. 16 no. 1, pp. 1-12, Jan. 2019.

Marjamaki, Pekka, Mattila, Toni, and Kivilahti, Jorma, "Finite Element Analysis of Lead-Free Drop Test Boards," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 1 , Orlando, FL, May 31-June 3, 2005, pp. 462-466.

Markarian, Jennifer, "Environmental concerns push wire and cable forward," Plastics Additives and Compounding, vol. 7 no. 4, pp. 24-27, July-Aug. 2005.

Marker, Cassie, Shang, ShunLi, Liu, Xuan L., Lindwall, Greta, and Liu, Zi-Kui, "First-principles calculations and thermodynamic modeling of the Sn-Ta system," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 57, pp. 46-54, June 2017.

Marker, D. L., Reichardt, J. W., and Coleman, R. V., "Magnetoresistance in Cobalt Whiskers," Journal of Applied Physics , vol. 42 no. 4, pp. 1338-1340, 1971.

Markley, Deanna L., Tong, Quinn K., Magliocca, Dorothy J., and Hahn, Thomas D., "Characterization of Silver Flakes Utilized for Isotropic Conductive Adhesives," 1999 International Symposium on Advanced Packaging Materials, Braselton, GA, Mar. 14-17, 1999, pp. 16-20.

Markley, T. A., Mardel, J. I., Hughes, A. E., Hinton, B. R. W., Glenn, A. M., and Forsyth, M., "Chromate replacement in coatings for corrosion protection of aerospace aluminium alloys," Materials and Corrosion, vol. 62 no. 9, pp. 836-840, Sept. 2011.

Markovsky, Robert, "Lead-Free Hand Soldering: Frequently Asked Questions," Lead-Free Connection, vol. 3 no. 2, pp. 10-11, Aug. 2006.

Marks, A. E., Mallik, S., Ekere, N. N., and Durairaj, R., "Effect of Abandon Time on Print Quality and Rheological Characteristics for Lead-Free Solder Pastes used for Flip-Chip Assembly," 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium, San Jose, CA, Oct. 3-5, 2007, pp. 14-19.

Marks, A. E., Ekere, N. N., Mallik, S., and Bhatti, R., "Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead-free solder pastes," Soldering & Surface Mount Technology, vol. 23 no. 2, pp. 75-84, 2011.

Marks, A. E., Mallik, S., Ekere, N. N., and Seman, A., "Effect of Temperature on Slumping Behaviour of Lead-Free Solder Paste and its Rheological Simulation," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 829-832.

Marks, Kyle, "Proper IT disposal," Electronics Supply & Manufacturing, Oct. 2006.

Marks, Robert A., Pan, Deng, Dutta, Indranath, and Jadhav, Susheel G., "Impression Creep Testing and Constitutive Modeling of Sn-based Solder Interconnects," The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 95-102.

Marlow, Stephen, "Commentary: Are you ready for RoHS?," Electronic Business, Jan. 27, 2006.

Marlow, Stephen, "Executive comment: RoHS compliance and industry standardization," Green SupplyLine, Apr. 21, 2005.

Marques, V. M. F., Johnston, C., and Grant, P. S., "Microstructural evolution at Cu/Sn-Ag-Cu/Cu and Cu/Sn-Ag-Cu/Ni-Au ball grid array interfaces during thermal ageing," Journal of Alloys and Compounds , vol. 613, pp. 387-394, Nov. 15, 2014.

Marques, V. M. F., Johnston, C., and Grant, P. S., "Nanomechanical characterization of Sn-Ag-Cu/Cu joints- Part 1: Young's modulus, hardness and deformation mechanisms as a function of temperature," Acta Materialia, vol. 61 no. 7, pp. 2460-2470, Apr. 2013.

Marques, V. M. F., Wunderle, B., Johnston, C., and Grant, P. S., "Nanomechanical characterization of Sn-Ag-Cu/Cu joints- Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature," Acta Materialia, vol. 61 no. 7, pp. 2471-2480, Apr. 2013.

Marques, V., Johnston, C., and Grant, P. S., "Two-Dimensional Mapping of the Mechanical Properties of Pb-Free Solders for Reliability Optimization," Journal of Microelectronics and Electronic Packaging, vol. 6, pp. 182-185, 2009.

Marquez, Ursala, "Lead Free Wave Soldering," NEMI RoHS/Pb-Free Summit, Oct. 18, 2003.

Marquez, Ursula, and Barbini, Denis, "Process Considerations for the Optimization of a Reflow Profile," Lead-Free Connection, vol. 2 no. 1, pp. 5-8, Jan. 2005.

Marquez, Ursula G., Barbini, Denis C., and Szymanowski, Richard A., "Selective Soldering with Sn3.9Ag0.6Cu: Process Development," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 120-130.

Marquez, Ursula, and Szymanowski, Richard, "Selective Soldering with SN/3.9AG/0.6CU Process Development," Lead-Free Connection, vol. 2 no. 3, pp. 5-7, Sept. 2005.

Marquez, Ursula, "Solderability and Joint Design," Circuits Assembly, vol. 16 no. 10, pp. xx-xx, Oct. 2005.

Marquez, Ursula, and Barbinin, Denis, "The Importance of Cooling Rate in Lead-Free Reflow Processing," Lead-Free Connection, vol. 1 no. 1, pp. 8-9, July 2004.

Marquez, Ursula, Barbini, Denis, and Diepstraten, Gerjan, "Understanding Flux Behavior of Non-Clean Lead-Free Solder Paste After Reflow Processes," Lead-Free Connection, vol. 3 no. 1, pp. 5-6, May 2006.

Marquez de Tino, Ursula, "Analyzing Pb-Free Defects Using Partial DoE," Circuits Assembly , vol. 19 no. 12, pp. 34-35, Dec. 2008.

Marquez de Tino, Ursula, "Common Wave and Selective Soldering Defects and Solutions," Circuits Assembly, vol. 19 no. 9, pp. 51, Sept. 2008.

Marquez de Tino, Ursula, and Barbini, Denis, "Degradation of Cu OSP Surface Finish," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 290-295.

Marquez de Tino, Ursula, Yang, Linlin, Barbini, Denis, Roggeman, Brian, and Meilunas, Michael, "Developing a Reflow Process for Sn/Cu/Ni Solder Paste," Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb. 10-12, 2009, pp. 331-336.

Marquez de Tino, Ursula, Barbini, Denis, and Enroth, Wesley, "Impact of Soldering Atmosphere on Solder Joint Formation," 2008 Pan Pacific Microelectronics Symposium & Exhibit, Kauai, HI, Jan. 22-24, 2008, pp. xx-xx.

Marquez de Tino, Ursula, Barbini, Denis, and Enroth, Wesley, "Impact of Soldering Atmosphere on Solder Joint Formation," Circuits Assembly, vol. 19. no. 4, pp. 32,34,36,38,41,43, Apr. 2008.

Marquez de Tino, Ursula, Barbini, Denis, and Enroth, Wesley, "Impact of Soldering Atmosphere on Solder Joint Formation," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Marquez de Tino, Ursula, "Is My Oven Pb-Free Capable?," Circuits Assembly, vol. 19 no. 10, pp. 34,47, Oct. 2008.

Marquez de Tino, Ursula, "Lead Free Wave Soldering," SMTA/IMAPS Mini-Symposium, Indianapolis, IN, Apr. 24, 2006.

Marquez de Tino, Ursula, "Nothing to Hide," Circuits Assembly, vol. 19 no. 11, pp. 39, Nov. 2008.

Marquez de Tino, Ursula, Yang, Linlin, and Barbini, Denis, "Nozzle Technology for Lead Free Selective Soldering," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 791-796.

Marquez de Tino, Ursula, "Optimizing Process Development," Circuits Assembly, vol. 20 no. 8, pp. 24-25, Aug. 2009.

Marquez de Tino, Ursula, and Roggeman, Brian, "Pad Cratering: Another Failure Mode to Worry About," Circuits Assembly , vol. 20 no. 10, pp. 30, Oct. 2009.

Marquez de Tino, Ursula, "Preventing Pb-Free Solder Pot Contamination," Circuits Assembly , vol. 19 no. 7, pp. 71, July 2008.

Marquez de Tino, Ursula, "Problems in the Mix," Circuits Assembly, vol. 19 no. 8, pp. 34, Aug. 2008.

Marquez de Tino, Ursula, "Processes for SnCuNi Solder Paste," Circuits Assembly, vol. 20 no. 4, pp. 36-37, Apr. 2009.

Marquez de Tino, Ursula, "Proper Profile Analysis, Good Bonding," Circuits Assembly, vol. 20 no. 1, pp. 40, Jan. 2009.

Marquez de Tino, Ursula, "Reflow Environment Effects on OSP Board Solderability," Circuits Assembly, vol. 20 no. 2, pp. 26, Feb. 2009.

Marquez de Tino, Ursula, "Selective Soldering with Pb-Free Alloys," Circuits Assembly, vol. 19 no. 1, pp. 40, Jan. 2008.

Marquez de Tino, Ursula, and Roggeman, Brian, "SnCuNi Solder Alloy Drop Testing," Circuits Assembly, vol. 20 no. 11, pp. 36, Nov. 2009.

Marquez de Tino, Ursula, "Soldering Atmosphere's Impact on Solder Joint Formation," Circuits Assembly, vol. 19. no. 3, pp. 62, Mar. 2008.

Marquez De Tino, Ursula, "Transitioning from SnPb to Pb-Free Solder," Printed Circuit Design and Fab, vol. 26 no. 12, pp. 53, Dec. 2009.

Marquez de Tino, Ursula, "Use of Wettable and Non-Wettable Nozzles," Circuits Assembly , vol. 20 no. 3, pp. 34.36, Mar. 2009.

Marquez de Tino, Ursula, Yang, Linlin, and Barbini, Denis, "Wettable vs. Non-wettable Nozzles for Lead Free Selective Soldering," Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb. 10-12, 2009, pp. 347-352.

Marquez de Tino, Ursula, "What Have We Learned about Copper Dissolution?," Circuits Assembly , vol. 19. no. 6, pp. 33, June 2008.

Mars, Pierre, "Pump Up the Volume!," EDN Power Technology, Part 4, vol. 52 no. 21, pp. 13-14, Oct. 11, 2007.

Marshall, J. L., Calderon, J., and Sees, J., "Microstructural and Mechanical Characterisation of 43/43/14 Tin/Lead/Bismuth," Soldering & Surface Mount Technology, vol. 3 no. 3, pp. 25-33, 1991.

Marshall, Patrick, "NOAA's chemical info makes online CAMEO,"Government Computer News , pp. 10, May 28, 2007.

Marshall, Stephen J., "RoHS Directive - PCB Compliance and Compatibility," PCB007, July 26, 2005.

Martel, Michael L., and Larrabee, Lance, "Fluxes, Materials in Lead-free Must be Able to 'Take the Heat'," circuitnet.

Martel, Mike, "5 Steps to success in lead-free soldering," Electronic Production , vol. 31 no. 4, pp. 8-12, May/June 2002.

Martel, Mike, "Focused on Tin Whiskers: Potential for Catastrophe?," Circuitnet , Oct. 17, 2005.

Martel, Mike, "Lead-Free Equipment Replacement: What Are These Guys Smokin'?," Circuitnet, Aug. 23, 2006.

Martel, Mike, "Love, Hate, and Lead ," Circuitnet, Mar. 27, 2006.

Martel, Mike, "Managing the Naughty Child," Circuitnet, June 26, 2006.

Martel, Mike, "RoHS, REACH, and the Case for Edible Circuit Boards," Circuitnet , Aug. 13, 2006.

Martell, S. R., "Case Studies in the Evaluation of Moisture Sensitive Level (MSL) and Reliability of Devices for High Reliability (High-Rel) Applications," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 70-75.

Martell, Steven R., and Bora, Mumtaz Y., "Updates on the Industry Standards for SMT Moisture/Reflow Sensitive Devices," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 126-130.

Martell, Steven R., "Will you and SMDs really be ready for Pb-Free with J-STD-033B and 020C/D? What about Passives?," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Martelli, Faustino, Rubini, Silvia, Jabeen, Fauzia, Felisari, Laura, and Grillo, Vincenzo, "On the growth of InAs nanowires by molecular beam epitaxy," Journal of Crystal Growth, vol. 323 no. 1, pp. 297-300, May 15, 2011.

Martin, Carmen, Micol, Alexandre, and Peres, Francois, "Importance of test parameters, specimen type and use configuration on the identification of Sn/Ag solder behaviour laws," Microelectronics Reliability, vol. 82, pp. 213-223, Mar. 2018.

Martin, Colin, "Think you are out of REACH? - Think again," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Aug. 11, 2008.

Martin, Fonzell, and Thompson, Trent, "Solutions to Meet Hand-Held Market's Requirement for Low Cost Advanced Reflow and Environmentally Sensitive Packaging," 2002 Telecom Hardware Solutions Conference Proceedings, Plano, TX, May 15-16, 2002, pp. xx-xx.

Martin, Gerard-Marie, Guedon, Alexandrine, Woirgard. Eric, and Zardini, Christian, "Lead Free Electronics for Automotive Applications: Specific Constraints, Failure Modes and Related Design Guidelines for Reliability." IPC and Soldertec Global Conference on Lead Free Electronics, Brussels, Belgium, June 11-12, 2003, pp. xx-xx.

Martin, Holly, "An Introduction to Tin Whiskers."

Martin, Jim, and Sackett, Don, "X-Ray Fluorescence in the Field," Advanced Materials & Processes , vol. 163 no. 11, pp. 51-53, Nov. 2005.

Martin, Mickael, Avertin, Sebastien, Chevolleau, Thierry, Dhalluin, Florian, Ollivier, Maelig, Baron, Thierry, Joubert, Olivier, and Hartmann, Jean Michel, "Fabrication of high-density Si and SixGe1-x nanowire arrays based on the single step plasma etching process," Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol. 31 no. 4, pp. 041806-041806-5, July 2013.

Martin, Richard, "An opportunity you can't afford to waste," Electronics Weekly , Apr. 13, 2006.

Martin, Richard, "Going green could pay dividends," Electronics World, vol. 112 no. 1843, pp. 15, July 2006.

Martin, Roland, Simon-Hettich, Brigitte, and Becker, Werner, "Safety of Liquid Crystals (LCs) and Recycling of Liquid Crystal Displays (LCDs) in Compliance with WEEE," Liquid Crystal Newsletter No. 19 , pp. 27-30, May 2004.

Martin-Gonzalez, Marisol, Prieto, Amy L., Gronsky, Ronald, Sands, Timothy, and Stacy, Angelica M., "High-Density 40 nm Diameter Sb-Rich Bi2-xSbxTe3 Nanowire Arrays," Advanced Materials, vol. 15 no. 12, pp. 1003-1006, June 2003.

Martindale, Guy, and Chai, H. R., "RoHS Implementation: An OEM and EMS Case Study," Circuits Assembly , vol. 17 no. 1, pp. 38, 40-42, Jan. 2006.

Martinez, Gustavo Aristides Santana, Button, Sergio Tonini, and Wright, Roger N., "A tool for wiredrawing tribology study," Wire Journal International , vol. 34 no. 11, pp. 86-89, Nov. 2001.

Martinez, R. J., Allen, C., Kerr, C., and Walker, P., "High Temperature Electrically Conductive Adhesives," 1st International SAMPE Electronics Conference, Santa Clara, CA, June 23-25, 1987, pp. 275-285.

Martinez-Castanon, G. A., Nino-Martinez, N., Loyola-Rodriguez, J. P., Patino-Marin, N., Martinez-Mendoza, J. R., and Ruiz, Facundo, "Synthesis of silver particles with different sizes and morphologies," Materials Letters, vol. 63 no. 15, pp. 1266-1268, June 15, 2009.

Martinez-Criado, Gema, Segura-Ruiz, Jaime, Alen, Benito, Eymery, Joel, Rogalev, Andrei, Tucoulou, Remi, and Homs, Alejandro, "Exploring Single Semiconductor Nanowires with a Multimodal Hard X-ray Nanoprobe," Advanced Materials, vol. 26 no. 46, pp. 7873-7879, Dec. 10, 2014.

Martino, Daniela Di, Cippo, Enrico Perelli, Kockelmann, Winfried, Scherillo, Antonella, Minniti, Triestino, Lorenzi, Roberto, Malagodi, Marco, Merlo, Curzio, Rovetta, Tommaso, Fichera, Giusj Valentina, Albano, Michela, Kasztovszky, Zsolt, Harsanyi, Ildiko, and Gorini, Giuseppe, "A multidisciplinary non-destructive study of historical pipe organ fragments," Materials Characterization, vol. 148 no. , pp. 317-322, Feb. 2019.

Martorano, K. M., Martorano, M. A., and Brandi, S. D., "Optimal conditions for the wetting balance test," Journal of Materials Processing Technology, vol. 209 no. 6, pp. 3089-3095, Mar. 19, 2009.

Maruo, Hiroki, Seki, Yoshihito, and Unami, Yoshiharu, "Ultrasonic Flip Chip Bonding," Assembly, vol. xx no. xx, pp. xx-xx, Feb. 7, 2006.

Maruya, Yuki, Hata, Hanae, Shohji, Ikuo, and Koyama, Shinji, "Fabrication of high melting point joint using Sn-57Bi-1Ag low temperature lead-free solder and gold-plated electrode," 2017 International Conference on Electronics Packaging, Yamagata, Japan, Apr. 19-22, 2017, pp. 551-554.

Maruyama, Minoru, Matsubayashi, Ryo, Iwakuro, Hiroaki, Isoda, Seiji, and Komatsu, Teruo, "Silver nanosintering: A lead-free alternative to soldering," Applied Physics A, vol. 93 no. 2, pp. 467-470, Nov. 2008.

Marx, D., Asahi, H., Liu, X. F., Okuno, Y., Inoue, K., Gonda, S., Shimomura, S., and Hiyamizu, S., "Metalorganic molecular beam epitaxy growth of GaAs on patterned GaAs substrates," Journal of Crystal Growth, vol. 136 no. 1-4, pp. 204-209, Mar. 1, 1994.

Maryamova, I., Druzhinin, A., Lavitska, E., Gortynska, I., and Yatzuk, Y., "Low-temperature semiconductor mechanical sensors," Sensors and Actuators A: Physical, vol. 85 no. 1-3, pp. 153-157, Aug. 25, 2000. https://doi.org/10.1016/S0924-4247(00)00376-9

Masanet, Eric R., "Assessing Public Exposure to Silver-Contaminated Groundwater from Lead-Free Solder: An Upper Bound, Risk-Based Approach," 2002 IEEE International Symposium on Electronics & the Environment, San Francisco, CA: May 6-9, 2002, pp. 174-179.

Masanet, Eric, and Horvath, Arpad, "Enterprise Strategies for Reducing the Life-Cycle Energy Use and Greenhouse Gas Emissions of Personal Computers," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 21-26.

Masanet, Eric R., Newton, Mark D., and Auer, Rudolf, "Practical Aspects of the Materials Declaration Process," Proceedings of the 2003 IEEE International Symposium on Electronics and the Environment , San Francisco, CA, May 19-22, 2003, pp. 42-47.

Mase, Shoichi, "Algebraic Method to obtain Irreducible Representations of Space Groups with an Application to White Tin," Journal of the Physical Society of Japan , vol. 14 no 11, pp. 1538-1550, Nov. 1959.

Mashraei, Yousof, Amara, Selma, Albu, Zahra, Ivanov, Yurii P., and Kosel, Jurgen, "Ultra-Low Power Corrosion Sensor Made of Iron Nanowires on Magnetic Tunnel Junctions," Advanced Engineering Materials, vol. 20 no. 10, pp. 1800337-1-1800337-6, Oct. 2018.

Masicat, Josephine, Kumar, Chetan, and Nuda, Mitzi, "An Efficient Certification Approach for New Sn-Ag-Cu Solder Alloy," Proceedings 45th Annual IEEE International Reliability Physics Symposium , Phoenix, AZ, Apr. 15-19, 2007, pp. 564-565.

Maslinda, K., Anasyida, A. S., and Nurulakmal, M. S., "Effect of Al addition to bulk microstructure, IMC formation, wetting and mechanical properties of low-Ag SAC solder," Journal of Materials Science: Materials in Electronics, vol. 27 no. 1, pp. 489-502, Jan. 2016.

Maslyk, Dan, Privett, Mark, and Toleno, Brian, "Using Underfill to Enhance Lead-free Drop Test Reliability," Surface Mount Technology (SMT), vol. 20 no. 5, pp. 20-23, May 2006.

Mason, C. W., and Forgeng, W. D., "Effect of Bismuth as an Impurity on the Structure and Allotropic Transformation of Tin," Metals & Alloys, vol. 6, pp. 87-90, Apr. 1935.

Mason, C. W., and Forgeng, W. D., "Effect of bismuth as an impurity on the structure and allotropic transformation of tin," British Chemical Abstracts B, pp. 595, June 21, 1935.

Mason, John, "Big Four of Europe Tackle RoHS," Electronic News, Dec. 22, 2005.

Mason, John F., "England Finally Transposes RoHS, But Still No WEEE," Electronic News, Mar. 21, 2006.

Mason, John F., "EU Invites Comments on Possible RoHS Exemptions," Electronic News , May 11, 2006.

Mason, John, "European progress to WEEE and RoHS is mixed," Electronics Weekly , Oct. 13, 2005.

Mason, John, "European Space Agency Frets Over Pure Tin," Electronic News, Nov. 10, 2005.

Mason, John, "European Space Agency frets over pure tin," Electronics Weekly , Nov. 11, 2005.

Mason, John, "Europe's Progress Mixed," Electronic News, Oct. 12, 2005.

Mason, John F., "Extending EU regulations with REACH," Electronic News, Apr. 24, 2007.

Mason, John F., "Germany Closed Mouth on RoHS, Open Book on WEEE," Electronic News , May 25, 2006.

Mason, John, "It's Not Only About Lead," Electronic News, Dec. 8, 2005.

Mason, John F., "Lead: One Problem, Many Solutions," Electronic News, Mar. 5, 2006.

Mason, John F., "Life with RoHS: How is the directive doing in Europe today?," Electronic News, Mar. 27, 2007.

Mason, John F., "Malta: How a Small Nation Deals with RoHS, WEEE," Electronic News , Apr. 27, 2006.

Mason, John, "Passing the Buck," Electronic News, Sept. 21, 2005.

Mason, John, "Passing the buck on RoHS and WEEE," Electronics Weekly, Sept. 21, 2005.

Mason, John M., "RoHS is here- with 29 exemptions, and counting," Electronic Business, Sept. 12, 2006.

Mason, John F., "RoHS, WEEE Leave Casualties," Electronic News, June 22, 2006.

Mason, John F., "Switzerland is Way Ahead of the Game," Electronic News, Apr. 12, 2006.

Mason, John F., "The `Passive' Approach to RoHS," Electronic News, July 21, 2006.

Mason, John F., "Walking the Aerospace and Defense Line," Electronic News, Feb. 21, 2006.

Mason, John F., "What's Next for Solder?," Electronic News, June 8, 2006.

Mason, M. S., and Eng, G., "Understanding tin plasmas in vacuum: A new approach to tin whisker risk assessment," Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, vol. 25 no. 6, pp. 1562-1566, Nov. 2007.

Mason, Maribeth, Eng, Genghmun, Leung, Martin, Stupian, Gary, and Yeoh, Terence, "Microanalysis for Tin Whisker Risk Assessment," 2011 IEEE International Reliability Physics Symposium, Monterey, CA, Apr. 10-14, 2011, pp. 2G.3.1-2G.3.5.

Mason, Maribeth, Eng, Genghmun, Leung, Martin, Stupian, Gary, and Yeoh, Terence, "Tin Whisker Risk Assessment for Space Systems," Electronic Device Failure Analysis, vol. 14 no. 1, pp. 14-20, Feb. 2012.

Mason, Maribeth, and Eng, Genghmun, "Understanding Tin Plasmas: A New Approach to Tin Whisker Risk Assessment (presentation)," Proceedings 45th Annual IEEE International Reliability Physics Symposium, Phoenix, AZ, Apr. 15-19, 2007, pp. 150-155.

Mason, Maribeth, and Eng, Genghmun, "Understanding Tin Plasmas: A New Approach to Tin Whisker Risk Assessment," Microelectronics Reliability and Qualification Workshop, Los Angeles, CA, Dec. 4-5, 2007, pp. xx-xx.

Mason, Maribeth, and Eng, Genghmun, "Understanding Tin Plasmas: A New Approach to Tin Whisker Risk Assessment," Proceedings 45th Annual IEEE International Reliability Physics Symposium , Phoenix, AZ, Apr. 15-19, 2007, pp. 150-155.

Mason, Rob, Neidbalson, Margo, Klingenberg, Melissa, Khabra, Parminder, and Handsy, Carl, "Update on Alternatives for Cadmium Coatings on Military Electrical Connectors," Metal Finishing, vol. 108 no. 3, pp. 12-20, Mar. 2010.

Mason, Simon, "What printed circuit board finishes are available in order to produce lead-free solder joints?," Connect, vol. xx no. xx, pp. xx-xx, 2004.

Masood, Muhammad Nasir, Carlen, Edwin T., and van den Berg, Albert, "All-(111) surface silicon nanowire field effect transistor devices: Effects of surface preparations," Materials Science in Semiconductor Processing , vol. 27, pp. 758-764, Nov. 2014.

Massachusetts Lead-Free Research Consortium, "PWB/Component Materials And Finishes: A Pb-Free Analysis," OnBoard Technology, vol. xx no. xx, pp. 14-18, Oct. 2004.

Masson, D. Bruce, and Kirkpatrick, Brian K., "Equilibrium Solidification of Sn-Ag-Sb Thermal Fatigue-Resistant Solder Alloys," Journal of Electronic Materials, vol. 15 no. 6, pp. 349-353, Nov. 1986.

Mastrangelo, Albert J., Chute, Susan, Soma, Jay, Sell, Robert, and Fouts, Christina, "A New Environmentally Benign Method for Lead-Free Solder Defluxing," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 154-159.

Masuda, Akihiro, Ishikawa, Masayuki, Kohinata, Masayoshi, Mashima, Munenori, Tsuji, Kiyotaka, and Shinkawa, Takeshi, "Development of Immersion Sn Plating Process for Low-Alpha Bump Formation," 2008 Proceedings 58th Electronic Components & Technology Conference , Lake Buena Vista, FL, May 27-30, 2008, pp. 1654-1658.

Masuda, Yasuhito, Hayashi, Fumihiro, Fujita, Taro, Uenoyama, Mayo, Idomoto, Yuichi, and Okuda, Yasuhiro, "Development of Anisotropic Conductive Film (ACF) for Semiconductor Device Testing," SEI Technical Review, no. 61, pp. 88-92, Jan. 2006.

Masui, K., and Kajihara, M., "Influence of Pd on kinetics of solid-state reactive diffusion between Sn and Ni," Journal of Alloys and Compounds, vol. 485 no. 1-2, pp. 144-149, Oct. 19, 2009.

Mathas, Carolyn, "Greenpeace v. iPhone and BSEF," Mobile Handset DesignLine, Oct. 22, 2007.

Mathe, Zoltan, "Brush Plating Hard Trivalent Chromium," Proceedings AESF SUR/FIN '96 , Cleveland, OH, June 10-13, 1996, pp. 361-368.

Mather, Lee, "Heightening Electrically Conductive Adhesives' Performance," Advanced Packaging, Apr. 2005.

Mathew, M. D., Yang, H., Movva, S., and Murty, K. L., "Creep Deformation Characteristics of Tin and Tin-Based Electronic Solder Alloys," Metallurgical and Materials Transactions A, vol. 36 no. 1, pp. 99-105, Jan. 2005.

Mathew, Sony, Wang, Weiqiang, Osterman, Michael, and Pecht, Michael, "Assessment of Solder-Dipping as a Tin Whisker Mitigation Strategy," IEEE Transactions on Components, Packaging and Manufacturing Technology , vol. 1 no. 6, pp. 957-963, June 2011.

Mathew, Sony, Osterman, Michael, and Pecht, Michael, "Evaluating Tin Whisker Mitigation Strategies: Conformal Coatings and Plating Technique," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Mathew, Sony, Osterman, Michael, Pecht, Michael, and Dunlevey, Frank, "Evaluation of pure tin plated copper alloy substrates for tin whiskers," Circuit World, vol. 35 no. 1, pp. 3-8, 2009.

Mathew, Sony, Osterman, Michael, and Pecht, Michael, "Tin Whiskers," Circuitnet, July 24, 2006.

Mathew, Sony, Osterman, Michael, Shibutani, Tadahiro, Yu, Qiang, and Pecht, Michael, "Tin Whiskers: How to Mitigate and Manage the Risks," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Mathieu, Rizzi, Eric, Woirgard, and Stephane, Azzopardi, "An assessment of the reliability of a new soldering process for automotive power module," 2006 4th International Conference on Integrated Power Systems, Naples, Italy, June 7-9, 2006, pp. xx-xx.

Matienzo, L. J., Das, R. N., and Egitto, F. D., "Electrically Conductive Adhesives for Electronic Packaging and Assembly Applications," Journal of Adhesion Science and Technology, vol. 22 no. 8-9, pp. 853-869, 2008.

Matijasevic, Goran S., and Lee, Chin C., "A Reliability Study of Au-Sn Eutectic Bonding with Ga-As Dice," 27th Annual Proceedings International Reliability Physics Symposium, Phoenix, AZ, Apr. 11-13, 1989, pp. 137-140.

Matijasecic, Goran, Chen, Yi-Chia, and Lee, Chin C., "Copper-Tin Multilayer Composite Solder," Proceedings of the 1993 International Electronics Packaging Conference, Volume 1, San Diego, CA, Sept. 12-15, 1993, pp. 264-273.

Matijasevic, Goran, Chen, Yi-Chia, and Lee, Chin C., "Copper-Tin Multilayer Composite Solder for Fluxless Processing," The International Journal of Microcircuits and Electronic Packaging, vol. 17 no. 2, pp. 108-117, Second Quarter 1994.

Matijasevic, Goran S., Wang, Chen Y., and Lee, Chin C., "Extremely Reliable Bonding of Large Silicon Dice Using Gold-Tin Alloy," 1990 Proceedings 40th Electronic Components & Technology Conference , Las Vegas, NV, May 20-23, 1990, pp. 786-790.

Matijevic, Ivan, Perovic, Doug, and Snugovsky, Polina, "Characterization of Solvus in Ternary and Quaternary Bismuth Containing Solder Alloys," International Conference on Soldering & Reliability 2016 Proceedings, Toronto, Ontario, Canada, May 9-11, 2016, pp. xx-xx.

Matin, M. A., Theeven, J. G. A., Vellinga, W. P., and Geers, M. G. D., "Correlation between localized strain and damage in shear-loaded Pb-free solders," Microelectronics Reliability, vol. 47 no. 8, pp. 1262-1272, Aug. 2007.

Matin, M. A., Coenen, E. W. C., Vellinga, W. P., and Geers, M. G. D., "Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy," Scripta Materialia, vol. 53 no. 8, pp. 927-932, Oct. 2005.

Matin, M. A., Vellinga, W. P., and Geers, M. G. D., "Microstructural stability and failure modes in eutectic Sn-Ag-Cu solder," Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems , Brussels, Belgium, May 9-12, 2004, pp. 337-340.

Matin, M. A., Vellinga, W. P., and Geers, M. G. D., "Microstructure evolution in a Pb-free solder alloy during mechanical fatigue," Materials Science and Engineering A, vol. 431 no. 1-2, pp. 166-174, Sept. 15, 2006.

Matin, M. A., Vellinga, W. P., and Geers, M. G. D., "Thermomechanical fatigue damage evolution in SAC solder joints," Materials Science and Engineering: A, vol. 445-446, pp. 73-85, Feb. 15, 2007.

Matkowski, Przemyslaw, "Acceleration factors of combined reliability tests of lead-free SnAgCu BGA interconnections," 2011 18th European Microelectronics and Packaging Conference, Brighton, United Kingdom, Sept. 12-15, 2011, pp. xx-xx.

Matkowski, Przemyslaw, Falat, Krzysztof Urbanski Tomasz, Felba, Jan, Zaluk, Zbigniew, Zwierta, Rafal, Dasgupta, Abhijit, and Pecht, Michael, "Application of FPGA units in combined temperature cycle and vibration reliability tests of lead-free interconnections," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 1375-1379.

Matkowski, Przemyslaw, and Felba, Jan, "Influence of solder joint constitution and aging process duration on reliability of lead-free solder joints under vibrations combined with thermal cycling," 2010 3rd Electronic System-Integration Technology Conference , Berlin, Germany, Sept. 13-16, 2010, pp. .

Matkowski, Przemyslaw, "Influence of the Intermetallic Compounds on the Reliability of Solder Joints," Proceedings of SPIE - The International Society for Optical Engineering, Volume 6159, Feb. 2006, pp. 61591V-1-61591V-6.

Matkowski, Przemyslaw, "Reliability of SnAgCu Solder Joints During Vibration in Various Temperature," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 341-347.

Matsuda, Kazuya, and Watanabe, Itsuo, "Interconnection Technologies of Anisotropic Conductive Films and Their Application to Flexible Electronics," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Matsuda, Kazuya, and Watanabe, Itsuo, "Recent Progress toward Anisotropic Conductive Films in Flat Panel Display and Semiconductor Packaging Applications," Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, China, June 30-July 3, 2004, pp. 8-13.

Matsuda, Kenji, Mizuhira, Manabu, and Yamamoto, Nobuo, "High-Sensitive and Nondestractive Determination of Trace Toxic Metals in Brass by Using Energy Dispersive X-ray Fluorescence Spectrometer with 3-Dimentional Polarization Optics," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 70 no. 2, pp. 107-109, Feb. 2006.

Matsugi, Kazuhiro, Iwashita, Yasuhiro, Choi, Yong-Bum, Sasaki, Gen, and Fujii, Koji, "Long Time Stability of Pb-Free Sn-9Zn Elements for AC-Low Voltage Fuse Performance," Materials Transactions, vol. 52 no. 4, pp. 753-758, 2011.

Matsumoto, Keiji, Ibaraki, Soichiro, Sakuma, Katsuyuki, and Yamada, Fumiaki, "Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack," IEEE International Conference on 3D System Integration , San Francisco, CA, Sept. 28-30, 2009, pp. xx-xx.

Matsumoto, T., and Nogi, K., "Wetting in Soldering and Microelectronics," Annual Review of Materials Research, vol. 38, pp. 251-273, Aug. 2008.

Matsumoto, Tsuyoshi, Ichige, Yuki, Komine, Takashi, Sugita, Ryuji, Aono, Tomosuke, Murata, Masayuki, Nakamura, Daiki, and Hasegawa, Yasuhiro, "Numerical Study of Effect of Surface Potential on Transport Properties of Bi Nanowires," Journal of Electronic Materials, vol. 40 no. 5, pp. 1260-1265, May 2011.

Matsushige, Kazumi, Suetsugu, Kenichiro, Ikari, Takashi, Horiuchi, Toshihisa, Kuboyama, Keiichi, Ishida, Kenji, and Kikuchi, Shiomi, "XPS and Computer Simulation Analysis on Lead-free Sn/Ag/Bi Alloys, and Significant Improvement of their Strength by Application of Ultrasonics," IPC Works '99, Minneapolis, MN, Oct. 23-28, 1999, pp. xx-xx.

Matsushita, M., Sasaki, Y., and Ikuta, Y., "Investigation of a New Sn-Cu-Ga Alloy Solder," Defect and Diffusion Forum, vol. 312-315, pp. 518-523, 2011.

Matsuura, Tetsuya, "Environmental Regulations in EU (WEEE & RoHS Directives) and USA," Hyomen Gijutsu (Journal of the Surface Finishing Society of Japan), vol. 54 no. 9, pp. 585-592, Sept. 2003.

Matsuura, Tetsuya, "Trends of Chemicals Regulation - Mainly EU REACH and Chinese RoHS," Journal of the Surface Finishing Society of Japan, vol. 58 no. 7, pp. 399-405, 2007.

Matteini, Federico, Tutuncuoglu, Gozde, Ruffer, Daniel, Alarcon-Llado, Esther, and Morral, Anna Fontcuberta i, "Ga-assisted growth of GaAs nanowires on silicon, comparison of surface SiOx of different nature," Journal of Crystal Growth, vol. 404, pp. 246-255, Oct. 15, 2014.

Matthews, Edward, "Pressure die drawing of aluminum alloys," Wire Journal International , vol. 35 no. 3, pp. 114-117, Mar. 2002.

Matthews, H. Scott, "Meeting the EuP Directive: Life Cycle Assessment Information Sharing as Opportunity for Global Compliance," Proceedings of the 2007 IEEE International Symposium on Electronics & the Environment, Orlando, FL, May 7-10, 2007, pp. 155-158.

Matthews, H. Scott, "Use versus manufacture life cycle electricity and environmental impacts for computer tape drives," Resources, Conservation, and Recycling, vol. 36 no. 3, pp. 187-196, Oct. 2002.

Matthias, Heimann,, Boehme, Bjoern, Scheffler, Sebastian, Wirts-Ruetters, Martin, and Wolter, Klaus-Juergen, "CNTs - a Comparable Study of CNT-filled Adhesives with Common Materials," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1871-1878.

Mattia, Mike, "The Hex," Recycling Today, vol. 44 no. 8, pp. 124-125, 127, Aug. 2006.

Mattila, T. T., James, R. J., Nguyen, L., and Kivilahti, J. K., "Effect of Temperature on the Drop Reliability of Wafer-Level Chip Scale Packaged Electronics Assemblies," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 940-945.

Mattila, T. T., Xu, H., Ratia, O., and Paulasto-Krockel, M., "Effects of Thermal Cycling Parameters on Lifetimes and Failure Mechanism of Solder Interconnections," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 581-590.

Mattila, T. T., Mueller, M., Paulasto-Krockel, M., and Wolter, K.-J., "Failure Mechanism of Solder Interconnections under Thermal Cycling Conditions," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. .

Mattila, T. T., and Kivilahti, J. K., "Failure Mechanisms of Lead-Free Chip Scale Package Interconnections under Fast Mechanical Loading," Journal of Electronic Materials, vol. 34 no. 7, pp. 969-976, July 2005.

Mattila, T. T., Simecek, J., and Kivilahti, J. K., "Failure Modes of Solder Interconnections under Mechanical Shock Loading at Elevated Temperatures," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 195-202.

Mattila, T. T., Vuorinen, V., and Kivilahti, J. K., "Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections," Journal of Materials Research , vol. 19 no. 11, pp. 3214-3223, Nov. 2004.

Mattila, T. T., Li, Jue, and Kivilahti, J. K., "On the effects of temperature on the drop reliability of electronic component boards," Microelectronics Reliability, vol. 52 no. 1, pp. 165-179, Jan. 2012.

Mattila, T. T., Marjamaki, P., Nguyen, L., and Kivalahti, J. K., "Reliability of Chip Scale Packages under Mechanical Shock Loading," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 584-589.

Mattila, T. T., and Kivilahti, J. K., "Reliability of Lead-Free Interconnections under Consecutive Thermal and Mechanical Loadings," Journal of Electronic Materials, vol. 35 no. 2, pp. 250-256, Feb. 2006.

Mattila, T. T., Kaloinen, E., Syed, A., and Kivilahti, J. K., "Reliability of SnAgCu Interconnections with Minor Additions of Ni or Bi under Mechanical Shock Loading at Different Temperatures," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 381-390.

Mattila, T. T., Suotula, L., and Kivilahti, J. K., "Replacement of the Drop Test with the Vibration Test - The Effect of Test Temperature on Reliability," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 629-637.

Mattila, T. T., and Paulasto-Krockel, M., "Toward Comprehensive Reliability Testing of Electronic Component Boards," 2010 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems , Bordeaux, France, Apr. 26-28, 2010, pp. xx-xx.

Mattila, Toni T., Marjamaki, Pekka, and Kivilahti, Jorma K., "Reliability of CSP Interconnections Under Mechanical Shock Loading Conditions," IEEE Transactions on Components and Packaging Technologies , vol. 29 no. 4, pp. 787-795, Dec. 2006.

Mattila, Toni T., Hokka, Jussi, and Paulasto-Krockel, Mervi, "The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading," Journal of Electronic Materials , vol. xx no. x, pp. xx-xx, xxxx.

Mattila, Toni Thomas, and Kivilahti, Jorma Kalevi, "The Role of Recrystallization in the Failure of SnAgCu Solder Interconnections Under Thermomechanical Loading," IEEE Transactions on Components and Packaging Technologies, vol. 33 no. 3, pp. 629-635, Sept. 2010.

Mattox, Donald M., "Film Formation I," Plating & Surface Finishing, vol. 81 no. 1, pp. xx-xx, Jan. 1994.

Mattox, Donald M., "PVD Processes - X-ray Fluorescence (XRF)," Plating & Surface Finishing, vol. 83 no. 3, pp. 54-55, Mar. 1996.

Mattson, Fredrik, and Shangguan, Dongkai, "Production Process Qualification for 01005 Size Passive Components," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 449-454.

Mattsson, Fredrik, Geiger, David, Shangguan, Dongkai, and Castello, Todd, "Design and Assembly of 01005 Passives Using Pb-Free Solder," Circuits Assembly, vol. 16 no. 5, pp. 22, May 2005.

Mattsson, Fredrik, Geiger, David, Shangguan, Dingkai, and Castello, Todd, "PCB Design and Assembly Process Study of 01005 Size Passive Components Using Lead-Free Solder," 2004 SMTA International Conference Proceedings , Chicago, IL, Sept. 26-30, 2004, pp. 99-105.

Matvienko, A. A., and Sidelnikov, A. A., "The influence of relaxation of stresses occurring during the b->a transformation of tin on the kinetics of the transformation," Journal of Alloys and Compounds, vol. 252 no. 1-2, pp. 172-178, May 5, 1997.

Matzdorf, Craig, "Trivalent Chromium-based Post-treatment for Sacrificial Coatings," Proceedings 2003 AESF/EPA Conference for Environmental & Process Excellence, Daytona, FL, Feb. 3-7, 2003, pp. 358-370.

Matzdorf, Graig, and Nickerson, Bill C., "Viable Chromium (VI) - Free Treatment for Aluminum," AESF SUR/FIN 2004 , Chicago, IL, June 28-July 1, 2004, pp. 644-661.

Mauldin, Scott, "Optimizing Outsourced Medical Equipment Repair Depot Support," Circuits Assembly, vol. 20 no. 3, pp. 28-30, Mar. 2009.

Maur, Friedhelm W., "Lead-Free Solder Inspection with X-ray," 2005 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Maurer, Eric, Pickering, Howard W., and Weil, Konrad, "Corrosion Behavior of Tin-Zinc Alloy Electrodeposited Coatings on Steel," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 2-11,

Maurer, Eric, Pickering, Howard W., and Weil, Konrad, "Corrosion Behavior of Electrodeposited Tin-Zinc Alloy Coatings on Steel," Plating and Surface Finishing, vol. 92 no. 6, pp. 32-36, June 2005.

Maveety, J. G., Liu, P., Vijayen, J., Hua, F., and Sanchez, E. A., "Effect of Cooling Rate on Microstructure and Shear Strength of Pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-37Pb Solders," Journal of Electronic Materials, vol. 33 no. 11, pp. 1355-1362, Nov. 2004.

Mavoori, H., Chin, J., Vaynman, S., Moran, B., Keer, L., and Fine, M., "Creep, Stress Relaxation, and Plastic Deformation in Sn-Ag and Sn-Zn Eutectic Solders," Journal of Electronic Materials, vol. 26 no. 7, pp. 783-790, July 1997.

Mavoori, Hareesh, Ramirez, Ainissa G., and Jin, Sungho, "Lead-Free Universal Solders for Optical and Electronic Devices," Journal of Electronic Materials, vol. 31 no. 11, pp. 1160-1165, Nov. 2002.

Mavoori, Hareesh, and Chin, Jason, "Reliability, Lifetime Prediction and Accelerated Testing of Prospective Alternatives to Lead Based Solders," 1995 Proceedings 45th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 1995, pp. 990-998.

Mawer, Andrew, Koschmieder, Thomas, and Mendez, David, "Assembly and Reliability of High CTE Ceramic Land Grid Array," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 418-424.

Mawer, Andrew, Koschmieder, Thomas, Galles, Paul, Anding, Randy, Skevofilax, George, and Lippe, Tim, "Assembly and Reliability of Preform Underfilmed BGAs in Drop Test and Thermal Cycling," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 128-135.

Mawer, Andrew, and Levis, Kim-Marie, "Automotive PBGA Assembly and Board-Level Reliability with Lead-Free versus Lead-Tin Interconnect," 2000 SMTA International Conference Proceedings , Chicago, IL, Sept. 24-28, 2000, pp. xx-xx.

Mawer, Andrew, and Levis, Kim-Marie, "Automotive PBGA Assembly and Board-Level Reliability with Lead-Free Versus Lead-Tin Interconnect," Journal of SMT, vol. 14 no. 1, pp. 9-16, Jan. 2001.

Maxwell, Jack, "Get the Lead Out: Standards Aid in RoHS Compliance," Standardization News, pp. 32-37, Nov.-Dec. 2014.

May, Lilia, Amir, Dudi, Aravamudhan, Srinivasa R., Cogburn, Garrett D., Kovalchick, Christopher, Sidhu, Rajen S., Nad, Suddhasattwa, and Hezeltine, Wade, "Impact of Component Bake on Solder Joint Quality," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 176-182.

Mayappan, Ramani, Salleh, Amirah, Tokiran, Nurul Atiqah, and Awang, N. A., "Activation energy for Cu-Sn intermetallic in CNT-reinforced Sn-1.0Ag-0.5Cu solder," Soldering & Surface Mount Technology, vol. 32 no. 2, pp. 65-72, 2020.

Mayappan, Ramani, and Ahmad, Zainal Arifin, "Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn-Zn lead-free solder," Intermetallics, vol. 18 no. 4, pp. 730-735, Apr. 2010.

Mayappan, Ramani, Ismail, Ahmad Badri, Ahmad, Zainal Arifin, Ariga, Tadashi, and Hussain, Luay Bakir, "Effect of sample perimeter and temperature on Sn-Zn based lead-free solders," Materials Letters, vol. 60 no. 19, pp. 2383-2389, Aug. 2006.

Mayappan, Ramani, Zaman, Rosyaini A., Abidin, Zalina Z., and Derman, Mohd N., "Growth of Cu-Zn5 and Cu5Zn8 Intermetallic Compounds in the Sn-9Zn/Cu Joint During Liquid State Aging," Advanced Materials Research, vol. 173, pp. 90-95, 2011.

Mayappan, Ramani, Yahya, Iziana, Ghani, N. A. A., and Hamid, H. A., "The effect of adding Zn into the Sn-Ag-Cu solder on the intermetallic growth rate," Journal of Materials Science: Materials in Electronics, vol. 25 no. 7, pp. 2913-2922, July 2014.

Mayappan, Ramani, Ismail, Ahmad Badri, Ahmad, Zainal Arifin, Ariga, Tadashi, and Hussain, Luay Bakir, "The effect of crosshead speed on the joint strength between Sn-Zn-Bi lead-free solders and Cu substrate," Journal of Alloys and Compounds , vol. 436 no. 1-2, pp. 112-117, June 14, 2007.

Mayer, Carl R., Lotfian, Saeid, Molina-Aldareguia, Jon, and Chawla, Nikhilesh, "High-Temperature Micropillar Compression Creep Testing of Constituent Phases in Lead-Free Solder," Advanced Engineering Materials, vol. 17 no. 8, pp. 1168-1174, Aug. 2015.

Mayer, James W., Poate, John M., and Tu, King-Ning, "Thin Films and Solid-Phase Reactions," Science, New Series, vol. 190 no. 4211, pp. 228-234, Oct. 17, 1975.

Mayer, Joachim, Giannuzzi, Lucille A., Kamino, Takeo, and Michael, Joseph, "TEM Sample Preparation and FIB-Induced Damage," MRS Bulletin, vol. 32 no. 5, pp. 400-407, May 2007.

Mayer, Kathe, "Quality Control with XRF," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. 643-647.

Mayer, Ludwig, Rickett, Robert, and Stenemann, Heinrich, "Bismuth Whisker Growth," Journal of Applied Physics, vol. 33 no. 3, pp. 982-984, Mar. 1, 1962.

Mayer, M., Nicolics, J., Hanreich, G., and Mundlein, M., "Thermal Aspects of GaAs Power FET Attachment Using Isotropically Conductive Adhesive," 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Zalaegerszeg, Hungary, June 23-26, 2002, pp. 38-43.

Mayers, C. Kieren, France, Chris M., and Cowell, Sarah J., "Extended Producer Responsibility for Waste Electronics: An Example of Printer Recycling in the United Kingdom," Journal of Industrial Ecology, vol. 9 no. 3, pp. 169-189, Summer 2005.

Mayers, Kieren, Lifset, Reid, Bodenhoefer, Karl, and Van Wassenhove, Luk N., "Implementing Individual Producer Responsibility for Waste Electrical and Electronic Equipment through Improved Financing," Journal of Industrial Ecology, vol. 17 no. 2, pp. 186-198, Apr. 2013.

Mayers, Kieren, and France, Chris, "Meeting the `Producer Responsibility' Challenge," Greener Management International, No. 25, pp. 51-66, Spring 1999.

Mayers, C. Kieren, "Strategic, Financial, and Design Implications of Extended Producer Responsibility in Europe," Journal of Industrial Ecology, vol. 11 no. 3, pp. 113-131, Summer 2007.

Mayers, Kieren, France, Chris, Cleverly, Ann, Kabouris, Eletherios, and Planas, Susanna, "The use and disposal of IT products within commercial markets." Journal of Business & Industrial Marketing, vol. 17 no. 5, pp. 357-378, 2002.

Mayhew-Smith, Alex, "Details of RoHS Directive enforcement under wraps," Electronics Weekly, Feb. 22, 2006.

Mayhew-Smith, Alex, "DTI lays out WEEE implementation intentions," Electronics Weekly , Mar. 29, 2006.

Mayhew-Smith, Alex, "Lead-free: No hiding from it," Electronics Weekly, Nov. 4, 2004.

Mayhew-Smith, Alex, "RoHS exemptions cause complications," Electronics Weekly, Mar. 1, 2005.

Mayhew-Smith, Alex, "U.K. Lays Out WEEE Implementation Intentions," Electronic News , Mar. 29, 2006.

Mays, Graham, "Don't dumb down Directives," Electronics Weekly, May 10, 2005.

Mayyas, Ahmad, Qasaimeh, Awni, Borgesen, Peter, and Meilunas, Michael, "Effects of latent damage of recrystallization on lead free solder joints," Microelectronics Reliability, vol. 54 no. 2, pp. 447-456, Feb. 2014.

Mayyas, Ahmad, Yin, Liang, and Borgesen, Peter, "Recrystallization of Lead Free Solder Joints - Confounding the Interpretation of Accelerated Thermal Cycling Results?," Proceedings of the ASME International Mechanical Engineering Congress & Exposition, Volume 5: Electronics and Photonics, Lake Buena Vista, FL, Nov. 13-19, 2009, pp. 319-326.

Mazumdar, A., Garai, A., Krishnamoorthy, H., Gupta, G., Reza, A., Thamizhavel, A., Nanal, V., Pillay, R. G., and Shrivastava, A., "Studies on b<=>a transition in Sn and Sn-rich alloys for a cryogenic tin bolometer," Materials Research Express, vol. 6 no. , pp. 076521-1-076521-8, 2019.

Mazur, J., and Rafalowicz, J., "Hypothesis on the ionic mechanism of the growth of whiskers obtained by reduction of the metal halides," British Journal of Applied Physics , vol. 12 no. 10, pp. 569-572, Oct. 1961.

Mazur, Scott, "Benchmark Electronic's Framework for RoHS Implementation," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Mazur, Scott, "Developing a COMPLIANCE SYSTEM for RoHS2," Printed Circuit Design and Fab/ Circuits Assembly, vol. 29 no. 2, pp. 50,52, Feb. 2012.

Mazur, Scott, and Mercuro, David, "Due Diligence Verification - Ensuring RoHS Compliance," Surface Mount Technology (SMT), vol. 20 no. 3, pp. xx-xx, Mar. 2006.

Mazur, Scott, "Due Diligence Verification: The Results," Surface Mount Technology (SMT), vol. 21 no. 2, pp. 49-50, Feb. 2007.

Mazur, Scott, "Process Control and Visual Management for Lead-free Hand and Wave Soldering," SMT Web Exclusive Article.

Mazur, Scott, "RoHS Material Controls and Visual Management," SMT Web Exclusive Article.

Mazzone, D., Marazza, R., Riani, P., Zanicchi, G., Cacciamani, G., Fornasini, M. L., and Manfrinetti, P., "The isothermal section at 600 °C of the ternary Pr-Au-Sn phase diagram," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 33 no. 1, pp. 31-43, Mar. 2009.

McBean Sr., Ronald V., Chiriac, Victor, and Lee, Tien-Yu Tom, "Performance Comparisons for Electrically Conductive Epoxies in Wireless Applications," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 2, 2006, pp. 281-288.

McBride, D. G., "Electroless Nickel Plating onto Nonactivated Copper," Plating, vol. 59 no. 9, pp. 858-860, Sept. 1972.

McCabe, Rodney J., and Fine, Morris E., "Creep of Tin, Sb-Solution-Strengthened Tin, and SbSn-Precipitate-Strengthened Tin," Metallurgical and Materials Transactions A, vol. 33 no. 5, pp. 1531-1539, May 2002.

McCabe, Rodney J., and Fine, Morris E., "High Creep Resistance Tin-Based Alloys for Soldering Applications," Journal of Electronic Materials, vol. 31 no. 11, pp. 1276-1282, Nov. 2002.

McCabe, Rodnay J., and Fine, Morris E., "The Creep Properties of Precipitation-Strengthened Tin-Based Alloys," JOM, vol. 52 no. 6, pp. 33-35, June 2000.

McCabe, Rodney J., and Fine, Morris E., "Unexpected Transient Creep Behavior of Tin Alloys Strengthened by High Volume Fractions of SbSn," Metallurgical and Materials Transactions A, vol. 33 no. 3, pp. 575-580, Mar. 2002. https://doi.org/10.1007/s11661-002-0119-0

McCall, Patrick, "Lead-free Solder and the Rework Process," Surface Mount Technology (SMT), vol. 20 no. 4, pp. xx-xx, Apr. 2006.

McCarron, Dave, "Rapid Rampup to Lead-free Production Stresses Supply Chain," Surface Mount Technology (SMT), vol. 18 no. 8, pp. xx-xx, Aug. 2004.

McCarten, Russell, McCarten, Kevin, and Leonard, Jack, "Preventing Damage to MSD's and Bare Boards Before and During the Assembly Process Through Proper Handling and Storage," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 628-632.

McCarthy, Shaun L., "New Test Methods for Evaluating Electrically Conductive Adhesives," 1995 Surface Mount International Conference Proceedings of the Technical Program, San Jose, CA, Aug. 29-31, 1995, pp. 562-567.

McCaskie, Jack, and Redding, Suzanne, "Successful Automotive Applications for Electroless Nickel," Metal Finishing, vol. 106 no. 4, pp. 25-27, Apr. 2008.

McClellan, Michael, and Harrison-Broninski, Keith, "Product meets process," Green SupplyLine, Feb. 1, 2006.

McClure, Robert, "Recycling of electronics encouraged," Seattle Post Intelligencer , Aug. 23, 2005.

McCluskey, F. P., Condra, L., Torri, T., and Fink, J., "Packaging Reliability for High Temperature Electronics : A Materials Focus," Microelectronics International, vol. 13 no. 3, pp. xx-xx, 1996.

McCluskey, F. P., Wang, Z., Dash, M., and Huff, D., "Reliability of High Temperature Lead-Free Solder Alternative," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 444-447.

McCluskey, F. P., Dash, M., Wang, Z., and Huff, D., "Reliability of High Temperature Solder Alternatives," Microelectronics Reliability, vol. 46 no. 9-11, pp. 1910-1914, Sept.-Nov. 2006.

McCluskey, P., Morris, J., Verneker, V. R. Pai, Kondracki, Paul, and Finello, D., "Models of electrical conduction in nanoparticle filled polymers," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 84-89.

McCluskey, P., Nagvanshi, M., Verneker, V. R. Pai, Kondracki, Paul, and Finello, D., "Nanocomposite materials offer higher conductivity and flexibility," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 282-286.

McCluskey, Patrick, "Extreme Temperature Packaging Reliability," Microelectronics Reliability and Qualification Workshop, Los Angeles, CA, Dec. 6-7, 2006, pp. xx-xx.

McClusky, Patrick, "Fatigue and Intermetallic Formation in Lead Free Solder Die Attach," Proceedings of IPACK'01 The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, Kauai, HI, July 8-13, 2001, pp. 233-239.

McCluskey, Patrick, and Quintero, Pedro O., "High Temperature Lead-Free Attach Reliability," Proceedings of the ASME InterPack Conference, Volume 2, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 93-98.

McClusky, Patrick, Das, Diganta, Jordan, Jill, Condra, Lloyd, Torri, Thomas C., and Fink, John, "Packaging of Electronics for High Temperature Environments," Proceedings of the 1996 International Electronics Packaging Conference, Austin, TX, Sept. 29-Oct. 1, 1996, pp. 143-155.

McClusky, Patrick, Munamarty, Ramesh, and Pecht, Michael, "Popcorning in PBGA Packages During IR Reflow Soldering," Proceedings of the 1996 International Electronics Packaging Conference, Austin, TX, Sept. 29-Oct. 1, 1996, pp. 271-281.

McCluskey, Paul, "Post Passivate Systems for Zinc and Zinc Alloys," Transactions of the Institute of Metal Finishing, vol. 74 no. 4, pp. 119-123, July 1996.

McCormack, M., Jin, S., and Kammlott, G. W., "Enhanced Solder Alloy Performance by Magnetic Dispersions," IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A , vol. 17 no. 3, pp. 452-457, Sept. 1994.

McCormack, M., and Jin, S., "Improved Mechanical Properties in New Pb-Free Solder Alloys," Journal of Electronic Materials, vol. 23 no. 8, pp. 715-720, Aug. 1994.

McCormack, M., Kammlott, G. W., Chen, H. S., and Jun, S., "New lead-free, Sn-Ag-Zn-Cu solder alloy with improved mechanical properties," Applied Physics Letters, vol. 65 no. 10, pp. 1233-1235, Sept. 5, 1994.

McCormack, M., Jin, S., and Chen, H. S., "New Lead-Free, Sn-Zn-In Solder Alloys," Journal of Electronic Materials, vol. 23 no. 7, pp. 687-690, July 1994.

McCormack, M., and Jin, S., "New, Lead-Free Solders," Journal of Electronic Materials, vol. 23 no. 7, pp. 635-640, July 1994.

McCormack, M., Jin, S., Kammlott, G. W., and Chen, H. S., "New Pb-free solder alloy with superior mechanical properties," Applied Physics Letters, vol. 63 no. 1, pp. 15-17, July 5, 1993.

McCormack, M., Kammlott, G. W., Chen, H. S., and Jin, S., "Significantly improved mechanical properties in Pb-free, Sn-Zn-In solder alloy by Ag doping," Applied Physics Letters, vol. 65 no. 9, pp. 1100-1102, Aug. 29, 1994.

McCormack, M., Chen, H. S., Kammlott, G. W., and Jin, S., "Significantly Improved Mechanical Properties of Bi-Sn Solder Alloys by Ag-Doping," Journal of Electronic Materials, vol. 26 no. 8, pp. 954-958, Aug. 1997.

McCormack, M., Jin, S., and Kammlott, G. W., "Suppression of microstructural coarsening and creep deformation in a lead-free solder," Applied Physics Letters, vol. 64 no. 5, pp. 580-582, Jan. 31, 1994.

McCormack, M., and Jin, S., "The Design and Properties of New, Pb-Free Solder Alloys," Sixteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, La Jolla, CA, Sept. 12-14, 1994, pp. 7-14.

McCormack, M., Jin, S., and Kammlott, G. W., "The Design of New, Pb-Free Solder Alloys with Improved Properties," Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment, Orlando, FL, May 1-3, 1995, pp. 171-176.

McCormack, M., Artaki, I., Jin, S., Jackson, A. M., Machusak, D. M., Kammlott, G. W., and Finley, D. W., "Wave Soldering with a Low Melting Point Bi-Sn Alloy: Effects of Soldering Temperatures and Circuit Board Finishes," Journal of Electronic Materials, vol. 25 no. 7, pp. 1128-1131, July 1996.

McCormack, Mark, and Jin, Sungho, "Progress in the Design of New Lead-Free Solder Alloys," JOM, vol. 45 no. 7, pp. 36-40, July 1993.

McCormack, S., and Meschter, S., "Probabilistic Assessment of Component Lead-to-Lead Tin Whisker Bridging," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

McCormack, Steve, and Meschter, Stephan, "A Probabilistic Assessment of Component Lead-to-Lead Tin Whisker Bridging," Tin Whisker Group teleconference, July 15, 2009.

McCormick, Heather, Chan, Alex, Coyle, Richard, Harper, Donald, Minich, Steve, Jelkovic, Damir, Peterman, Brent, and Gray, Mark, "Area Array Connector Reliability: Impact of Conversion to Lead Free and of Test Vehicle Design Parameters," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 302-307.

McCormick, Heather, Chan, Alex, Coyle, Richard, and Harper, Donald, "Area Array Connectors: Transition to Lead-free," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 340-349.

McCormick, Heather, Chan, Alex, Coyle, Richard, and Harper, Donald, "Area Array Connnectors: Transition to Lead-Free," Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb. 10-12, 2009, pp. 368-377.

McCormick, Heather, Smith, Lee, Chow, Jimmy, Syed, Ahmer, Reichman, Corey, and Berry, C. J., "Assembly and Reliability Assessment of Fine Pitch TMV Package on Package (PoP) Components," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 27-34.

McCormick, Heather, Chow, Jimmy, Snugovsky, Polina, Kosiba, Eva, and Meschter, Stephan, "Development of a Test Vehicle for the Study of Tin Whiskers," International Conference on Soldering & Reliability 2011 Proceedings , Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

McCormick, Heather, Chow, Jimmy, Berry, Mike, Trudell, Joel, Brush, Russell, Qian, Jie, and Cortero, Roden, "Effect of Assembly Variations on Package on Package Reliability in Thermal Cycling," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

McCormick, Heather, Chan, Alex, and Harper, Don, "Effect of Design Variables on the Reliability of Lead Free Area Array Connectors," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S31:02.

McCormick, Heather, Bagheri, Simin, Hamilton, Craig, Riccitelli, George, and Mohabir, Ramesh, "Implementing Lead Free in a Manufacturing Environment: From Test Vehicle Design to High Volume Assembly," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 807-814.

McCormick, Heather, Bagheri, Simin, Bagheri, Zohreh, Hamilton, Craig, and Snugovsky, Polina, "LGA vs. CSP: A Comparison in Various Lead Free Applications," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

McCormick, Heather, Snugovsky, Polina, Bagheri, Zohreh, Bagheri, Simin, Hamilton, Craig, Riccitelli, George, and Mohabir, Ramesh, "Mixing Metallurgy: Reliability of SAC Balled Area Array Packages Assembled Using SnPb Solder," 2006 SMTA International Conference Proceedings , Rosemont, IL, Sept. 24-28, 2006, pp. 425-432.

McCormick, Heather, Snugovsky, Polina, Bagheri, Zohreh, Bagheri, Simin, Hamilton, Craig, Riccitelli, George, and Mohabir, Ramesh, "Mixing Metallurgy: Reliability of SAC Balled Area Array Packages Assembled Using SnPb Solder," SMTAnews & Journal of Surface Mount Technology , vol. 20 no. 2, pp. 11-18, Apr.-June 2007.

McCormick, Heather, Snugovsky, Polina, Bagheri, Zohreh, and Bagheri, Simin, "Pb-free Test Vehicle, Microstructure and ATC Behaviour of SAC305 and SAC405 BGAs Assembled with Sn-Pb Solder," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

McCormick, Heather, Sterian, Irene, Chow, Jimmy, Berry, Mike, Trudell, Joel, and Cortero, Roden, "PoP: An EMS Perspective on assembly, rework and reliability," Global SMT and Packaging, vol. 9 no. 3, Mar. 2009, pp. 16-18,20,22-23.

McCormick, Heather, Sterian, Irene, Chow, Jimmy, Berry, Mike, Trudell, Joel, and Cortero, Roden, "PoP (Package on Package): An EMS Perspective on Assembly, Rework and Reliability," Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb. 10-12, 2009, pp. 178-183.

McCormick, Heather, Snugovsky, Polina, Hamilton, Craig, Bagheri, Zohreh, and Bagheri, Simin, "The Great SAC Debate: Comparing the Reliability of SAC305 and SAC405 Solders in a Variety of Applications," 2007 Pan Pacific Microelectronics Symposium & Exhibit, Maui, HI, Jan. 30-Feb. 1, 2007, pp. xx-xx.

McCormick, Heather, Snugovsky, Polina, Hamilton, Craig, Bagheri, Zohreh, and Bagheri, Simin, "The Great SAC Debate: Comparing the Reliability of SAC305 and SAC405 Solders in a Variety of Applications," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

McCrea, Jonathan L., Palumbo, Gina, Lee, Doug E., Erb, Uwe, and Psaila-Dombrowski, Maureen J., "Electrodeposited Nanocrystalline Cobalt-Phosphorus Alloys - An Advanced Alternative to Hard Chrome Plating for Non-Line of Sight Coating Applications," Proceedings 2003 AESF/EPA Conference for Environmental & Process Excellence, Daytona, FL, Feb. 3-7, 2003, pp. 186-195.

McCullen, Jack, "8.5 Tin Whisker Status", JEDEC/JEITA Joint Meeting #11, Kagoshima, Japan, Sept. 2007.

McCullen, Jack, and Gupta, Vivek, "Sn-Whisker Test Standards Correlation to Market Segment Use Conditions," Lead-Free Magazine, vol. 5, 2005.

McCullen, Jack,and Gupta, Vivek, "Sn-Whisker Test Standards Correlation to Market Segment Use Conditions," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

McCulloch, J., Niraula, D., Grice, C. R., Warrell, G., Vasko, A., Irving, R., Georgiev, D., Borra, V., Karpov, V. G., Parsai, E. I., and Shvydka, D., "Electric field stimulated growth of Zn and Sn whiskers," Tin Whisker Group teleconference, Oct. 21, 2015.

McDonald, Ian, "The Lead-free Soldering Challenges for Peelable Resists," Printed Circuit Design and Fab, vol 25 no. 11, pp. 40-41, Nov. 2008.

McDonald, Stuart, Nogita, Kazuhiro, Read, Jonathan, Ventura, Tina, and Nishimura, Tetsuro, "Influence of Composition on the Morphology of Primary Cu6Sn5 in Sn-4Cu Alloys." Journal of Electronic Materials, vol. 42 no. 2, pp. 256-262, Feb. 2013.

McDowell, Mark E., "Tin Whiskers: A Case Study," Aerospace Applications Conference , Jan. 31-Feb. 5, 1993, pp. 207-215.

McDowell, Maurice, "The issue of lead-free solder and its impact on the local electronics industry," Dataweek, vol. xx no. xx, pp. xx-xx, Feb. 25, 2004.

McElroy, J. B., and Pfahl Jr., R. C., "Environmentally Friendly Electronics for High Reliability," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

McElroy, Jim, "The Lead-Free Conundrum," Electronic Packaging & Production , vol. xx no. xx, pp. xx-xx, Sept. 2000.

McFaddin, Wade E., "Non-destructive Analysis Method for Detection of the "Black Pad Defect" on PCB Surfaces," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 395-403.

McGrady, Tim, "An Update on ASTM International Committee F40 on Declarable Substances in Materials," Standardization News, vol. 34 no. 7, pp. 24-27, July 2006.

McGrady, Tim, "New ASTM International Committee F40 on Declarable Substances," Standardization News, vol. 33 no. 6, pp. 26-29, June 2005.

McGrady, Tim, "The EU RoHS Directive: Big Issues Linger," Metal Finishing, vol. 104 no. 11, pp. 51-53, Nov. 2006.

McGrath, Bob, "Lead-free solder requires changes in PCB manufacturing," Green SupplyLine, Mar. 25, 2005.

McGrath, Bob, "The Effects of LEAD-FREE on PCB Fabrication," Printed Circuit Design and Manufacture, vol. 22 no. 2, pp. 44-47, Feb. 2005.

McGrath, Dylan, "Mentor offering tool support for RoHS compliance," Industrial Control Design Line, July 26, 2005.

McGrath, P., and Soutar, A., "Non-precious Metal Finishes for Fine Pitch Assembly," Circuit World, vol. 23 no. 2, pp. 42-45, 1997.

McGrath, Peter, and Soutar, Andrew, "Non-Precious Metal Finishes for Fine Pitch Assembly," Proceedings of the Technical Program NEPCON West '96, Volume 1, Anaheim, CA, Feb. 25-29, 1996, pp. 458-478.

McGuire, Joseph M.. "Canada Including Appliances in WEEE Program," Appliance Design, vol. 53 no. 4, pp. 56, Apr. 2005.

McGuirk, Denny, "Alligators in the Sewers and 260°C Reflow Temperatures," CircuiTree , vol. 17 no. xx, pp. 16, Sept. 2004.

McGuirk, Dennis P., "Dear President-elect Obama," IPC, Dec. 1, 2009.

McGuirk, Denny, "IPC Issues and Answers," Circuitree, vol. 19 no. 9, pp. xx-xx, Sept. 2006.

McGuirk, Denny, "IPC Issues and Answers -- Denny McGuirk," CircuiTree, vol. 18 no. 12, pp. xx-xx, Dec. 2005.

McGuirk, Dennis P., "IPC Position on Lead Free," Circuitree, vol. 19 no. 8, pp. xx-xx, Aug. 2006.

McGuirk, Denny, "Lead Free, Lead Free, Lead Free, Lead Free," IPC Review, vol. 47 no. 1, pp. 2, Jan. 2006.

McGuirk, Denny, "News from Northbrook -- Dennis McGuirk: Tick-tock! Tick-tock!," CircuiTree, vol. 15 no. 5, pp. xx, May 2002.

McGuirk, Dennis P., "Setting the Standards for Success," CircuiTree, vol. 21 no. 6, pp. xx-xx, June 2008.

McGuirk, Denny, "Taking Inventory of Lead-Free Preparation," CircuiTree, vol. 18 no. 12, pp. 77, Dec. 2005.

McGuirk, Dennis P., "The Fun Never Ends, Especially in the Summertime," CircuiTree , vol. 21 no. 9, pp. xx-xx, Sept. 2008.

McInerney, Michael F., and Bruemmer, Tim, "Formation of Conducting Columns in Adhesive Epoxy," 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 36.

McKay, Elissa Grace, and Nguyen, Jennifer, "Microstructure Study of Lead-Free Solder Joints Reflowed Using Alternative Low Silver Alloy Solder Pastes," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 718-731.

McKeown, S., Meschter, S., Snugovsky, P., Kennedy, J., Bagheri, Z., Keeping, J., Cho, J., Edwards, D., and Elsken, K., "Strategic Environmental Research and Development Program (SERDP) Nanoparticle enhanced conformal coating project: Coating modeling for tin whisker mitigation," Proceedings of SMTA International, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 695-710.

McKeown, S., Meschter, S., Snugovsky, P., Kennedy, J., Bagheri, Z., Keeping, J., Cho, J., Edwards, D., and Elsken, K., "Strategic Environmental Research and Development Program (SERDP) Nanoparticle Enhanced Conformal Coating Project: Coating Modeling For Tin Whisker Mitigation (Presentation)," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 695-710.

McKeown, S., Meschter, S., Snugovsky, P., Kennedy, J., Bagheri, Z., Keeping, J., Cho, J., Edwards, D., and Elsken, K., "Strategic Environmental Research and Development Program (SERDP) Nanoparticle enhanced conformal coating project: Coating modeling for tin whisker mitigation," Tin Whisker Group teleconference, Sept. 7, 2016.

McKeown, Stephen, and Meschter, Stephan, "Effect of hot solder dipping on part stresses," 2008 ASME International Mechanical Engineering Congress and Exposition, Boston, MA, Oct. 31-Nov. 6, 2008, pp. xx-xx.

McKeown, Stephen, and Meschter, Stephan, "Effect of hot solder dipping on part stresses (presentation)," 2008 ASME International Mechanical Engineering Congress and Exposition, Boston, MA, Oct. 31-Nov. 6, 2008, pp. xx-xx.

McKeown, Stephen A., Meschter, Stephan J., Snugovsky, Polina, and Kennedy, Jeffery, "SERDP Tin Whisker Testing and Modeling: Simplified Whisker Risk Model Development," International Conference on Soldering & Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.

McKeown, Stephen A., Meschter, Stephan J., Snugovsky, Polina, and Kennedy, Jeffery, "SERDP Tin Whisker Testing and Modeling: Simplified Whisker Risk Model Development," SMTA Journal, vol. 28 no. 1, pp. 13-29, 2015.

McKeown, Stephen, Meschter, Stephan, Snugovsky, Polina, and Kennedy, Jeffery, "SERDP Tin Whisker Testing and Modeling: Whisker Geometric Risk Model Development," Tin Whisker Group teleconference, Dec. 3, 2014.

McLaren, Jake, Wright, Lucy, Parkinson, Stuart, and Jackson, Tim, "A Dynamic Life-Cycle Energy Model of Mobile Phone Take-back and Recycling," Journal of Industrial Ecology, vol. 3 no. 1, pp. 77-91, Winter 1999.

McLaughlin, Patrick, "Distributor turns up the heat for national RoHS directive," Connector Specifier, vol. 22 no. 7, pp. 1, 4, Oct./Nov. 2006.

McLaughlin, Patrick, and Ziobron, Betsy, "RoHS enforcement a non-issue, but... China initiative looms large," Connector Specifier, vol. 23 no. 2, pp. 16-18, May 2007.

McLaughlin, Patrick, "RoHS = Really Only Half the Story," Connector Specifier, vol. 24 no. 2, pp. 7, Mar. 2008.

McLean, Colin, "Can I replace solder with conductive adhesives as an attachment material?," Connect, 2007.

McMahon, John, "Bismuth and lead: Tests show no compatibility issues," Green SupplyLine, June 16, 2006.

McMahon, John, and Gray, Brian, "Laminate Resistance To Pad Crater Defects: Comparative Spherical Bend Testing," 2011 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, Kamuela, HI, Jan. 18-20, 2011, pp. xx-xx.

McMahon, John, and Gray, Brian, "Laminate Resistance to Pad Crater Defects: Comparative Spherical Bend Testing," International Conference on Soldering & Reliability 2011 Proceedings, Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

McMahon, John, and Gray, Brian, "Laminate Resistance to Pad Crater Defects: Comparative Spherical Bend Testing," SMTA Journal, vol. 24 no. 3, pp. 17-22, 2011.

McMahon, John, and Gray, Brian, "Mechanical Failures in Pb-Free Processing: Evaluating the effect of Pad Crater Defects on Process Strain Limits for BGA Devices," 2010 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, Koloa, HI, Jan. 26-28, 2010, pp. xx-xx.

McMahon, John, and Gray, Brian, "Mechanical Failures in Pb-Free Processing: Evaluating the Effect of Pad Crater Defects on Process Strain Limits for BGA Devices," International Conference on Soldering & Reliability 2010 Proceedings, Toronto, Ontario, Canada, May 17-20, 2010, pp. xx-xx.

McMahon, John, and Gray, Brian, "Mechanical Failures in Pb-Free Processing: Evaluating The Effect of Pad Crater Defects on Process Strain Limits for BGA Devices," SMTA Journal , vol. 23 no. 2, pp. 25-30, 2010.

McMahon, John, and Standing, Brian P., "Mechanical Reliability: Updated Results from a Spherical Bend Test Program," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 16-21.

McMahon, John, Gray, Brian, and Standing, Brian P., "Safe Working Process Strain Limits for Large Area Array Packages: Observations from Spherical Bend Testing," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 49-54.

McMahon, John, Standing, Brian, Thompson, Michael, Wilcox, Jim, Robertson, Derek, and Kelly, Matt, "Strain Rate and Cyclic Dependencies of PCBA Pad Crater Susceptibility," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 60-68.

McMahon, John, Standing, Brian, Thomson, Michael, Wilcox, Jim, Robertson, Derek, and Kelly, Matt, "Strain Rate and Cyclic Dependencies of PCBA Pad Crater Susceptibility," SMTAnews & Journal of Surface Mount Technology, vol. 27 no. 1, pp. 28-36, Mar. 2014.

McMath, Ian, "Process solutions for lead-free PCB manufacturing," Engineering Technology, vol. 7 no. 6, pp. 15-16, July/Aug. 2004.

McMeen, Mark, "Accelerated Life Testing: What is the Weakest Link in the Hardware Design," IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics, Raleigh, NC, Mar. 11-12, 2008, pp. xx-xx.

McMeen, Mark T., and Gjesvold, Jason B., "Analysis of Wetting and Tensile Strength of Solder Alloys," 2003 Pan Pacific Symposium Conference Proceedings, Feb. 18-20, 2003, pp. xx-xx.

McMeen, Mark T., "Strain gage testing: the delta effect of thermal cycle testing," Global SMT and Packaging, vol. 9 no. 2, Feb. 2009, pp. 10-12,14-16,18.

McMeen, Mark T., "Strain Gage Testing: The Delta Effect of Thermal Cycle Testing," Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb. 10-12, 2009, pp. 170-177.

McMorrow, Kimberly, Kirschner, Michael, Tang, Liang, and Gottschalk, Marc, "China RoHS postponed," Electronics Supply & Manufacturing , Mar. 2006.

McMorrow, Kimberly, Tang, Liang, and Gottschalk, Marc, "China to postpone RoHS legislation," Green SupplyLine, Jan. 10, 2006.

McMullan, John J., "Minimizing Effects of Lead-free SMT Assembly on Connector Housing Resins," Surface Mount Technology (SMT), vol. 18 no. 9, pp. 48, 50, `52, 54, Sept. 2004.

McMullan, John J., "The evolution of surface-mount connectors leads to lead-free alternatives," Connector Specifier, vol. 19 no. 9, pp. xx-xx, Sept. 2003.

McNulty, John C., "Processing and Reliability Issues for Eutectic AuSn Solder Joints," 41st International Symposium on Microelectronics (IMAPS 2008) Proceedings, Providence, RI, Nov. 2-6, 2008, pp. xx-xx.

McNulty, Michael J., "Rod breakdown, wiredrawing and stranding mathematics," Wire Journal International, vol. 35 no. 7, pp. 90-95, July 2002.

McNulty, Michael, "Spotlight on Wire Harness Materials,"Wire & Cable Technology International, vol. 33 no. 3, pp. 88, May/June 2005.

McWiggin, Pat, "Temperature Profiling for Reflow Soldering," LEADOUT Hands On Lead-Free Workshop, Manchester, United Kingdom, June 21, 2006.

Meakin, J. D., and Klokholm, E., "Self-Diffusion in Tin Single Crystals," Transactions of the Metallurgical Society of AIME, vol. 218, pp. 463-466, June 1960.

Medgyes, Balint, and Illes, Balazs, "Contradictory Electrochemical Migration Behavior of Copper and Lead," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 206-211.

Medgyes, Balint, Tamasi, Patrik, Hajdu, Ferenc, Muranyi, Roland, Lakatos-Varsanyi, Magda, Gal, Laszlo, and Harsanyi, Gabor, "Corrosion Investigations on Lead-Free Micro-Alloyed Solder Alloys used in Electronics," 2015 38th International Spring Seminar on Electronics Technology, Eger, Hungary, May 6-10, 2015, pp. 296-299.

Medgyes, Balint, Kosa, Gyorgy, Tamasi, Patrik, Szabo, Bence, Illes, Balazs, Lakatos-Varsanyi, Magda, Rigler, Daniel, Gal, Laszlo, Ruszinko, Miklos, and Harsanyi, Gabor, "Corrosion Investigations on Lead-Free Solder Alloys in MgCl2 and NaCl Solutions," 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging, Constanta, Romania, Oct. 26-29, 2017, pp. 427-431.

Medgyes, Balint, Illes, Balazs, and Harsanyi, Gabor, "Electrochemical migration behaviour of Cu, Sn, Ag and Sn63/Pb37," Journal of Materials Science: Materials in Electronics, vol. 23 no. 2, pp. 551-556, Feb. 2012.

Medgyes, Balint, Roman, Emil, Bohnert, Adam, Szurdan, Szabolcs, Zhong, Xiankang, and Harsanyi, Gabor, "Electrochemical migration investigations on SAC-Bi-xMn solder alloys," 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging, Iasi, Romania, Oct. 25-28, 2018, pp. 80-83.

Medgyes, Balint, Kiss, Robert, Szurdan, Szabolcs, Rigler, Daniel, Gal, Laszlo, Berenyi, Richard, and Harsanyi, Gabor, "Electrochemical migration investigations on Sn-Sb solder alloys using 3.5 wt% NaCl solution," 2017 40th International Spring Seminar on Electronics Technology, Sofia, Bulgaria, May 10-14, 2017, pp. xx-xx.

Medgyes, Balint, Adam, Sandor, Tar, Lajos, Verdingovas, Vadimas, Ambat, Rajan, and Harsanyi, Gabor, "Electrochemical Migration of Lead-free Solder Alloys in Na2SO4 Environment," 2017 40th International Spring Seminar on Electronics Technology, Sofia, Bulgaria, May 10-14, 2017, pp. xx-xx.

Medgyes, Balint, Illes, Balazs, Berenyi, Richard, and Harsanyi, Gabor, "In situ optical inspection of electrochemical migration during THB tests," Journal of Materials Science: Materials in Electronics, vol. xx no. xx, pp. xx-xx, xxxx.

Medgyes, Balint, Rigler, Daniel, Illes, Balazs, Harsanyi, Gabor, and Gal, Laszlo, "Investigating of Electrochemical Migration on Low-Ag Lead-Free Solder Alloys," 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging, Alba Iulia, Romania, Oct. 25-28, 2012, pp. 147-150.

Medgyes, Balint, and Illes, Balazs, "Investigating SIR of Cu, OSP, iSn and HASL Surface Finishes by THB Test," 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging, Timisoara, Romania, Oct. 20-23, 2011, pp. 345-348.

Medgyes, Balint, Horvath, Barbara, Illes, Balazs, Shinohara, Tadashi, Tahara, Akira, Harsanyi, Gabor, and Krammer, Oliver, "Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics," Corrosion Science, vol. 92, pp. 43-47, Mar. 2015.

Medgyes, Balint, Tamasi, Patrik, Kosa, Gyorgy, Rigler, Daniel, and Gal, Laszlo, "Morphological and Composition Study on Lead-Free Micro-Alloyed Solders after Corrosion Test," 2016 39th International Spring Seminar on Electronics Technology, Pilsen, Czech Republic, May 18-22, 2016, pp. 245-248.

Medgyes, Balint, Gal, Laszlo, and Szivos, Daniel, "The effect of NaCl on water condensation and electrochemical migration," 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging, Bucharest, Romania, Oct. 23-26, 2014, pp. 259-262.

Meeh, Peter, "Immersion tin: a proven final finish for printed circuit boards providing reliable solderability and marginal formation of tin whiskers," Circuit World, vol. 31 no. 1, pp. 28-40, 2005.

Meesathien, Nadee, Makoto, Sawada, Ariga, Tadashi, and Kanlayasiri, Kannachai, "Influence of Indium and Zinc Oxide Nano-particles on Properties of SAC0307-xIn-yZnO Lead-Free Solder Paste," 2015 IEEE 17th Electronics Packaging and Technology Conference, Singapore, Dec. 2-4, 2015, pp. xx-xx.

Mehrabi, K., Khodabakhshi, F., Zareh, E., Shahbazkhan, A., and Simchi, A., "Effect of alumina nanoparticles on the microstructure and mechanical durability of meltspun lead-free solders based on tin alloys," Journal of Alloys and Compounds, vol. 688 Part A, pp. 143-155, Dec. 15, 2016.

Mehrmashhadi, Javad, Tang, Yuye, Zhao, Xiaoliang, Xu, Zhanping, Pan, Jianbiao John, Van Quang, Le, and Bobaru, Florin, "The Effect of Solder Joint Microstructure on the Drop Test Failure--A Peridynamic Analysis," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 9 no. 1, pp. 58-71, Jan. 2019.

Mehrotra, Mradul, Brack, Lance A., Simeus, Emmanuel J., Stegura, Stephen R., Do, Tim Q., Ladera, Kyle R., Jayne, Roger W., and Lyons, William M., "BGA Backward Compatibility Interim Temperature Cycle Test Data for Harsh Environments," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. xx-xx.

Mehta, Arjun, "RoHS Compliance Screening with Handheld EDXRF," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Mehta, Rupal, "Recycling WEEE polymers," Materials World, vol. 15 no. 6, pp. 4, June 2007.

Mei, Fanghua, Chen, Ke, Lu, B., and Meng, Wen Jin, "Bonding of Cu-based high aspect ratio microscale structures with Sn intermediate layers," Microsystem Technologies, vol. 15 no. 7, pp. 1111-1118, July 2009.

Mei, Yunhui, Chen, Xu, and Gao, Hong, "Hygrothermal Effects on the Tensile Properties of Anisotropic Conductive Films," Journal of Electronic Materials, vol. 38 no. 11, pp. 2415-2426, Nov. 2009.

Mei, Z., and Morris Jr., J. W., "Characterization of Eutectic Sn-Bi Solder Joints," Journal of Electronic Materials, vol. 21 no. 6, pp. 599-607, June 1992.

Mei, Z., Plas, H. Vander, Gleason, J., and Baker, J., "Low-Temperature Solders," Proceedings of the 20th International Symposium on Testing and Failure Analysis, Los Angeles, CA, Nov. 13-18, 1994, pp. 485-495.

Mei, Z., and Morris Jr., J. W., "Superplastic Creep of Low Melting Point Solder Joints," Journal of Electronic Materials, vol. 21 no. 4, pp. 401-407, Apr. 1992.

Mei, Zequn, "A Failure Analysis and Rework Method of Electronic Assembly on Electroless Ni / Immersion Au Surface Finish," 1999 SMTA International Conference Proceedings, San Jose, CA, Sept. 12-16, 1999, pp. xx-xx.

Mei, Zequn, and Holder, Helen, "A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints," Journal of Electronic Packaging, vol. 118 no. 1, pp. 62-66, June 1996.

Mei, Zequn, and Eslambolchi, Ali, "Evaluation of Ni/Pd/Au as an Alternative Metal Finish on PCB," 1998 Surface Mount International Conference Proceedings, San Jose, CA, Aug. 23-27, 1998, pp. 669-680.

Mei, Zequn, and Eslambolchi, Ali, "Evaluation of Ni/Pd/Au as an alternative metal finish on PCB," Circuit World, vol. 25 no. 2. pp. 18-26, 1999.

Mei, Zequn, Ahmad, Mudasir, Hu, Mason, and Ramakrishna, Gnyanesgwar, "Kirkendall Voids at Cu / Solder Interface and Their Effects on Solder Joint Reliability," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 415-420.

Mei, Zequn, Hua, Fay, Glazer, Judy, and Key, Chung Chee, "Low Temperature Soldering," Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, Oct. 13-15, 1997, pp. 463-476.

Mei, Zequn, Holder, Helen A., and Vander Plas, Hubert A., "Low-temperature solders - technically feasible for use in surface mount assembly - Technology Information," Hewlett-Packard Journal, vol. 47 no. 4, pp. 91-98, Aug. 1996.

Mei, Zequn, Teng, Sue, and Ahmad, Mudasir, "Shock, Vibration, and Wind Tunnel Tests of Electronic Components with Sn Whiskers," IPC/JEDEC 10th International Conference on Lead-free Electronic Components and Assemblies, Brussels, Belgium, Oct. 17-19, 2005, pp. xx-xx.

Mei, Zequn, Hua, Fay, and Glazer, Judy, "Sn-Bi-X Solders," 1999 SMTA International Conference Proceedings , San Jose, CA, Sept. 12-16, 1999, pp. xx-xx.

Mei, Zequn, Hua, Fay, and Glazer, Judy, "Thermal Reliability of 58Bi-42Sn Solder Joints on Pb-Containing Surfaces," Design & Reliability of Solders and Solder Interconnections, Orlando, FL, Feb. 10-13, 1997, pp. 229-239.

Mei, Zequn, Ahmad, Mudasir, Hu, Mason, and Ramakrishna, Gnyaneshwar, "Voids at Cu / Solder Interface and Their Effects on Solder Joint Reliability," Cisco Systems, Sept. 14, 2005.

Meier, K., Roellig, M., Wiese, S., and Wolter, K.-J., "Characterisation of the Mechanical Behaviour of SAC solder at High Strain Rates," 2010 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems , Bordeaux, France, Apr. 26-28, 2010, pp. xx-xx.

Meier, K., Roellig, M., Wiese, S., and Wolter, K.-J., "Combining Experimental and Simulation Methods for the Mechanical Characterisation of Lead Free Solder Alloys under High Strain Rate Loads," 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, Delft, Netherlands, Apr. 26-29, 2009, pp. xx-xx.

Meier, K., Kraemer, F., and Wolter, K.-J., "High Strain Rate Behaviour of Lead-Free Solders Depending on Alloy Composition and Thermal Aging," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 483-492.

Meier, K., Roellig, M., Wiese, S., and Wolter, K.-J., "Mechanical Behaviour of Typical Lead-Free Solders at High Strain Rate Conditions," 2010 12th Electronics Packaging Technology Conference , Singapore, Dec. 8-10, 2010, pp. 825-831.

Meier, K., Wiese, S., Roellig, M., and Wolter, K.-J., "Mechanical Characterisation of Lead Free Solder Alloys under High Strain Rate Loads," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1781-1787.

Meier, K., Roellig, M., Wiese, S., and Wolter, K.-J., "Rate Dependent Mechanical Behaviour of SAC Solder in Fast Tensile Experiments," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Meier, K., Roellig, M., Liu, Y., and Bock, K., "Solder Joint Fatigue Analysis under Combined Thermal and Vibration Loading," 2017 IEEE 19th Electronics Packaging Technology Conference, Singapore, Dec. 6-9, 2017, pp. xx-xx.

Meier, K., Roellig, M., and Wolter, K.-J., "The Effect of Cu and Ag on the Yielding Behaviour of Lead-Free Solders at High Strain Rates," 2013 IEEE 15th Electronics Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp. 298-303.

Meier, Karsten, Kraemer, Frank, Roellig, Mike, and Wolter, Klaus-Juergen, "Characterisation of Lead-free Solders at High Strain Rates Considering Microstructural Conditions," 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Lisbon, Portugal, Apr. 16-18, 2012, pp. xx-xx.

Meier, Karsten, Roellig, Mike, Wiese, Steffen, Goette, Carsten, Deml, Ulrich, and Wolter, Klaus-Juergen, "Electromigration in Large Volume Solder Joints," Proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, London, England, Apr. 15-18, 2007, pp. xx-xx.

Meier, Karsten, Winkler, Maria, Bock, Karlheinz, Leslie, David, and Dasgupta, Abhijit, "Fatigue Behaviour of Lead-Free Solder Joints Under Combined Thermal and Vibration Loads," 2019 IEEE 69th Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2019, pp. 498-504.

Meier, Karsten, Leslie, David, Storz, Tamara, Dasgupta, Abhijit, and Bock, Karlheinz, "Harmonic Vibration Durability Tests on Lead-Free Solder Joints at Different Isothermal Conditions," 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Hanover, Germany, March 24-27, 2019, pp. xx-xx.

Meier, Karsten, Roellig, Mike, Schiessl, Andreas, and Wolter, Klaus-Juergen, "Life Time Prediction for Lead-free Solder Joints under Vibration Loads," 2011 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Linz, Austria, Apr. 18-20, 2011, pp. xx-xx.

Meier, Karsten, Ochmann, Maximilian, Bock, Karlheinz, Leslie, David, and Dasgupta, Abhijit, "Low Temperature Vibration Reliability of Lead-free Solder Joints," 2020 IEEE 70th Electronic Components and Technology Conference, Lake Buena Vista, AL, May 26-29, 2020, pp. 801-806.

Meier, Karsten, Roellig, Mike, Wiese, Steffen, Goette, Carsten, Deml, Ulrich, and Wolter, Klaus-Juergen, "Mechanical Degradation, Thermal- and Electromigration in Large Volume Solder Joints," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1839-1845.

Meier, Karsten, Roellig, Mike, Schiessl, Andreas, and Wolter, Klaus-Juergen, "Reliability Study on Chip Capacitor Solder Joints under Thermo-Mechanical and Vibration Loading," 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Ghent, Belgium, Apr. 7-9, 2014, pp. xx-xx.

Meilunas, M., and Borgesen, P., "Effects of Cycling Parameters on the Thermal Fatigue Life of Mixed SnAgCu/SnPb Solder Joints," Journal of Electronic Packaging, vol. 133 no. 2, pp. 021001-1-021001-5, June 2011.

Meilunas, Michael, and Anselm, Martin, "A.R.E.A. - Low Loss Laminate Material Pad Cratering Resistance," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 401-405.

Meilunas, Michael, and Anselm, Martin, "Fine Pitch Reliability Comparisons Between Components Assembled on Motherboards Containing Filled or Unfilled Microvia-in-Pad," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 524-538.

Meilunas, Michael, Mukadam, Muffadal, Borgesen, Peter, and Srihari, Hari, "Lead-free and Tin-lead Assembly and Reliability of Fine Pitch Wafer Level CSPs," Wafer-Level Congress and Exhibition Conference Proceedings , San Jose, CA, Oct. 10-12, 2004, pp. xx-xx.

Meilunas, Michael, Mukadam, Muffadal, Borgesen, Peter, and Srihari, Hari, "Lead-free and Tin-lead Assembly and Reliability of Fine Pitch Wafer Level CSPs," Universal Instruments, Jan. 3, 2005.

Meilunas, Michael, and Wilcox, Jim, "Metallization and Surface Finish Effects on Pb-Free WLCSP Thermal Cycle Reliability," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 638-646.

Meilunas, Michael, Dunford, Steven O., and Primavera, Anthony, "Thermal Performance of Lead-free Packages," Advanced Packaging, vol. xx no. xx, pp. xx-xx, Dec. 2003.

Meinshausen, L., Weide-Zaage, K., and Petzold, M., "Electro- and Thermomigration in Micro Bump Interconnects for 3D Integration," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1444-1451.

Meinshausen, L., Fremont, H., Weide-Zaage, K., and Plano, Bernard, "Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps," Microelectronics Reliability, vol. 55 no. 1, pp. 192-200, Jan. 2015.

Meinshausen, L., Fremont, H., Weide-Zaage, K., and Plano, B., "Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads," Microelectronics Reliability, vol. 53 no. 9-11 pp. 1575-1580, Sept.-Nov. 2013.

Meinshausen, L., Weide-Zaage, K., Goldbeck, B., Moujbani, A., Kludt, J., and Fremont, H., "Electromigration Reliability of Cylindrical Cu Pillar SnAg3.0Cu0.5 Bumps," 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Ghent, Belgium, Apr. 7-9, 2014, pp. xx-xx.

Meinshausen, L., Bhassyvasantha, S., Majumdar, B. S., and Dutta, I., "Influence of Indium Addition on Whisker Mitigation in Electroplated Tin Coatings on Copper Substrates," Journal of Electronic Materials, vol. 45 no. 1, pp. 791-801, Jan. 2016.

Meinshausen, L., Fremont, H., and Weide-Zaage, K., "Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers," Microelectronics Reliability, vol. 52 no. 9-10, pp. 1827-1832, Sept.-Oct. 2012.

Meinshausen, L., Weide-Zaage, K., and Fremont, H., "Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps," Microelectronics Reliability, vol. 51 no. 9-11, pp. 1860-1864, Sept. 2011.

Mejias, Maria, Lavinger, Connie, and Bastardo, Keyla, "Comparison Study between Lead Free Solder and Low Temperature Solder for Hand Soldering Rework," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Melcioiu, Georgiana, Serban, Viorel-Aurel, Ashworth, Mark, Codrean, Cosmin, Lita, Marin, and Wilcox, Geoffrey D., "An evaluation of Sn-Cu-Ga and Sn-Cu-Ag solder alloys for applications within the electronics industry," Solid State Phenomena, vol. 216, pp. 91-96, Aug. 2014.

Melendrez, M. F., Hanks, K., Casillas, G., Deepak, Francis Leonard, Perez-Tijerina, E., and Jose-Yacaman, M., "A novel and high yield synthesis of CdSe nanowires," Journal of Materials Science, vol. 48 no. 14, pp. 4983-4988, July 2013.

Mello, Adrian, "A challenging environment," Electronic Business, June 1, 2005.

Melmed, A. J., and Gomer, R., "Erratum: Field Emission from Metal Whiskers," Journal of Chemical Physics, vol. 31, pp. 554, 1959.

Melmed, A. J., and Gomer, R., "Field Emission from Metal Whiskers," Journal of Chemical Physics , vol. 30 no. x, pp. 586-587, 1959.

Melmed, A. J., and Gomer, R., "Field Emission from Whiskers," Journal of Chemical Physics, vol. 34 no. 5, pp. 1802-1812, May 1961.

Melmed, A. J., and Hayward, D. O., "On the Occurrence of Fivefold Rotational Symmetry in Metal Whiskers," Journal of Chemical Physics, vol. 31 no. x, pp. 545-546, 1959.

Melmed, Allan J., "Electrical Measurement of Whisker Field-Emission Characteristics," Journal of Chemical Physics, vol. 36, pp. 1101, 1962.

Melmed, Allan J., "Field-Electron and Field-Ion Emission from Single Vapor-Grown Whiskers," Journal of Chemical Physics, vol. 38 no. 3, pp. 607-612, Feb. 1, 1963.

Melmed, Allan J., "Field-Emission Microscopy of Twins in Vapor-Grown fcc Whiskers," Journal of Applied Physics, vol. 34 no. 11, pp. 3325-3328, Nov. 1963.

Melton, C., "Effect of Solder Reflow Process Variables on the Solder Wettability of Lead Free Solder Alloys," Soldering & Surface Mount Technology, vol. 6 no. 2, pp. 20-29, 1994.

Melton, C., and Fuerhaupter, H., "Lead-free Tin Surface Finish for PCB Assembly," Circuit World, vol. 23 no. 2, pp. 30-31, Jan. 1997.

Melton, Cindy, "Alternatives of Lead Bearing Solder Alloys," Proceedings of the 1993 IEEE International Symposium on Electronics and the Environment, Arlington, VA, May 10-12, 1993, pp. 94-97.

Melton, Cindy, "How Good are Lead-Free Solder Joints?," Surface Mount Technology (SMT) , vol. 9 no. 6, pp. 32-36, June 1995.

Melton, Cindy, Klosterman, Don, and Mei, Yuhai, "Lead-Free Solder Fine Pitch Stencil Printing," Surface Mount International Proceedings of the Technical Program, Volume II, San Jose, CA, Sept. 10-12, 1996, pp. 730-735.

Melton, Cindy, and Fuerhaupter, Harry, "Lead-Free Tin Surface Finish for PCB Assembly," Proceedings of the Technical Program NEPCON West '96, Volume 2, Anaheim, CA, Feb. 25-29, 1996, pp. 877-881.

Melton, Cindy, "Nitrogen Atmosphere Processing in Lead Free Soldering," Proceedings of the Technical Program NEPCON West '95, Volume 2, Anaheim, CA, Feb. 26-Mar. 2, 1995, pp. 1003-1011.

Melton, Cindy, "Reflow Soldering Evaluation of Lead Free Solder Alloys," 1993 Proceedings 43rd Electronic Components & Technology Conference, Orlando, FL, June 1-4, 1993, pp. 1008-1011.

Melton, Cindy, "The Effect of Reflow Process Variables on the Wettability of Lead-Free Solders," JOM, vol. 45 no. 7, pp. 33-35, July 1993.

Meltzer, M. P., and Steffani, C. P., "Printed Wiring Board Fabrication and Lead Elimination Via Single-Bath Electrodeposition," Lawrence Livermore National Laboratory UCRL-ID-142542, Feb. 21, 2001.

Meltzer, M., "The Importance of Lead-Free Electronics Processes," DOE Pollution Prevention Conference, Albuquerque, NM, Nov. 15-18, 1999, pp. xx-xx.

Meltzer, Michael, "Pollution Prevention: Avoiding the Need to Manage Wastes," Lawrence Livermore National Laboratory UCRL-JC-115809, CONF-9309342--2.

Melville, Paul, "Moisture Sensitivity Ratings for SMT Packages," Surface Mount Technology (SMT), vol. 8 no. 9, pp. 49, 52-53, Sept. 1994.

Menad, N., "Cathode ray tube recycling," Resources, Conservation and Recycling , vol. 26 no. 3-4, pp. 143-154, June 1999.

Menad, N., Bjorkman, Bo., and Allain, Eric G., "Combustion of plastics contained in electric and electronic scrap," Resources, Conservation and Recycling, vol. 24 no. 1, pp. 65-85, Oct. 1998.

Menad, N., Guignot, S., and van Houwelingen, J. A., "New characterisation method of electrical and electronic equipment wastes (WEEE)," Waste Management, vol. 33 no. 3, pp. 706-713, Mar. 2013.

Mencinger, N. P., Carthy, M. P., and McDonald, R. C., "Use of Wetting Angle Measurements in Reliability Evaluations of Au-Si Eutectic Die Attach," 23rd Annual Reliability Physics Symposium, Orlando, FL, Mar. 25-29, 1985, pp. 173-179.

Mende, H. H., and Thummes, G., "Surface Scattering of Electrons on Copper Whiskers and Its Influence on the Electrical Resistivity at 4.2 K," Applied Physics, vol. 6 no. 1, pp. 93-97, Feb. 1975. https://doi.org/10.1007/BF00883555

Mendelson, S., "Growth Pips and Whiskers in Epitaxially Grown Silicon," Journal of Applied Physics, vol. 36 no. 8, pp. 2525-2534, Aug. 1965.

Mendez, Ramon, Roreno, Mario, Soto, German, Herrera, Jessica, and Hamilton, Craig, "Design for Manufacturability in the Lead Free Wave Solder Process," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S28:02.

Mendez, Ramon, Moreno, Mario, Soto, German, Herrera, Jessica, and Hamilton, Craig, "Design for Manufacturability in the Lead Free Wave Solder Process," IPC Review, vol. 1 no. 2, pp. 15, May/June 2008.

Mendez, Ramon, Moreno, Mario, Soto, German, and Hamilton, Craig, "Design for Manufacturability in Lead Free Wave Solder Process," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. xx-xx.

Meng, F. G., Liu, H. S., Liu, L. B., and Jin, Z. P., "Thermodynamic description of the Au-Si-Sn system," Journal of Alloys and Compounds, vol. 431 no. 1-2, pp. 292-297, Apr. 4, 2007.

Meng, Gong-ge, Takemoto, T., and Nishikawa, H., "Correlations between IMC thickness and three factors in Sn-3Ag-0.5Cu alloy system," Transactions of Nonferrous Metals Society of China, vol. 17 no. 4, pp. 686-690, Aug. 2007.

Meng, Gongge, Takemoto, Tadashi, and Nishikawa, Hiroshi, "The Contrasting and Statistics of Spreading Area Data in Soldering Wettability," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Meng, J., Stark, P., Dasgupta, A., Sillanpaa, M., Hussa, Esa, Seppanen, Jukka P., Raunio, Jouni A., and Saarinen, Ilkka J., "Effect of Strain Rate on Adhesion Strength of Anisotropic Conductive Film (ACF) Joints," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 1252-1258.

Meng, Qingfang, Wang, Fang, and Yang, Zaiming, "Effect of Cu Doping on the Conductivity of Individual ZnTe Nanowires," Applied Mechanics and Materials, vol. 174-177, pp. 641-644, May 2012.

Meng, Xiaotian, Tan, Lin, Jiang, Jing, and Wang, Qian, "A study on thermomechanical reliability of flip chip package based on MUF process," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 1338-1343.

Meng, Zhichao, Wen, Ming, and Liu, Zhi-Quan, "Interfacial microstructure of NiPt/SnIn/Cu sputtering target assembly after soldering," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Meng-Chieh, Liao, Hai, Tang, and Wang, Ricky, "Failure analysis of (DIMM hole) solder void in lead free process used OSP coated PCB," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 617-619.

Menge, Rainer, and Rettig, Stefan, "In-line annealing of round and flat wires made of copper alloys and special materials," Wire Journal International, vol. 36 no. 7, pp. 95-98, July 2003.

Menk, Alexander, and Bordas, Stephane P. A., "Crack growth calculations in solder joints based on microstructural phenomena with X-FEM," Computational Materials Science, vol. 50 no. 3, pp. 1145-1156, Jan. 2011.

Menk, Alexander, and Bordas, Stephane, "Influence of the Microstructure on the Stress State of Solder Joints during Thermal Cycling," 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, Delft, Netherlands, Apr. 26-29, 2009, pp. xx-xx.

Menk, Alexander, Pearce, Chris J., Lanier, Olivier, Simpson, Robert, and Bordas, Stephane P. A., "Lifetime Prediction for Solder Joints with the Extended Finite Element Method," 2011 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Linz, Austria, Apr. 18-20, 2011, pp. xx-xx.

Menke, Doris, Fiedler, Hiltrud, and Zwahr, Heiner, "Don't ban PVC: Incinerate and recycle it instead!," Waste Management and Research, vol. 21 no. 2, pp. 172-177, Apr. 2003.

Menke, Joseph, "Zinc Phosphate Coatings on Non-Ferrous Substrates," Products Finishing, vol. xx no. x, pp. xx-xx, Dec. 1996.

Menon, Sandeep, Osterman, Michael, and Pecht, Michael, "Evaluating the Impact of Dwell Time on Solder Interconnect Durability Under Bending Loads," Journal of Electronic Materials, vol. 44 no. 11, pp. 4549-4556, Nov. 2015.

Menon, Sandeep, George, Elviz, Osterman, Michael, and Pecht, Michael, "High lead solder (over 85 %) solder in the electronics industry: RoHS exemptions and alternatives," Journal of Materials Science: Materials in Electronics, vol. 26 no. 6, pp. 4021-4030, June 2015.

Menovsky, A., Franse, J. J. M., and Moleman, A. C., "On the Formation and Morphology of UPt3 Whiskers," Journal of Crystal Growth, vol. 67 no. 1, pp. 31-36, June 1984.

Mensah, A., and Hunt, C., "The Role of Permeability and Ion Transport in Conformal Coating Protection," NPL Report DEPC-MPR 032, Sept. 2005.

Meola, Carmine, "Lead-Free Manufacturing - Intermetallics," empfasis, pp. 3, July 2007.

Meola, Carmine, "Lead-Free Training," empfasis, pp. 3, 11, July 2006.

Meola, Carmine, "Modeling Reliability of Lead Free Assemblies," empfasis, pp. xx-xx, Apr. 2008.

Meola, Carmine, "Tech Tips... Lead Free Reworking," empfasis, pp. xx-xx, May 2008.

Mercado, Lei L., Sarihan, Vijay, White, Jerry, and Lee, Tom, "Failure Mechanism Study of Anisotropic Conductive Film (ACF) Packages," Proceedings of the ASME Manufacturing Engineering Division, MED-Vol. 13 , New Orleans, LA, Nov. 17-22, 2002, pp. 523-530.

Mercado, Lei L., White, Jerry, Sarihan, Vijay, and Lee, Tien-Yu Tom, "Failure Mechanism Study of Anisotropic Conductive Film (ACF) Packages," IEEE Transactions on Components and Packaging Technologies, vol. 26 no. 3, pp. 509-516, Sept. 2003.

Mercado, Lei L., and Chavez, Brian, "Impact of JEDEC Test Conditions on New-Generation Package Reliability," 2001 Proceedings 51st Electronic Components & Technology Conference , Orlando, FL, May 29-June 1, 2001, pp. 104-110.

Mercuro, David, and Piorek, Stan, "Compliance Screening Using a Hand-held XRF Analyzer," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Merhej, M., Ecoffey, S., Sadani, B., Lee-Sang, B., Baron, T., David, S., Drouin, D. and Salem, B., "A fabrication process for self-connected horizontal SiGe nanowires," Microelectronic Engineering, vol. 220, pp. 111150-1-111150-5, Feb. 15, 2020.

Merlow, Stephen, "Executive comment: RoHS compliance and industry standardization," EE Times, Apr. 21, 2005.

Mermigas, Diane, "Satellite Risk Is Out There," Electronic Media, vol. 17 no. 23, pp. 18, June 1, 1998.

Mertens, J. C. E., Kirubanandham, A., and Chawla, N., "Electromigration mechanisms in Sn-0.7Cu/Cu couples by four dimensional (4D) X-ray microtomography and electron backscatter diffraction (EBSD)," Acta Materialia, vol. 102, pp. 220-230, Jan. 1, 2016.

Mertens, Marc, "Electroplated Zinc Nickel," Metal Finishing, vol. 104 no. 6, pp. 24-27, June 2006.

Mertens, Robert G., and Sundaram, Kalpathy B., "Characterization of Silicon Nanowires Grown by Electroless Etching," 2012 Proceedings of IEEE Southeastcon, Orlando, FL, Mar. 15-18, 2012, pp. xx-xx.

Merzsch, S., Steib, F., Wasisto, H. S., Stranz, A., Hinze, P., Weimann, T., Peiner, E., and Waag, A., "Production of vertical nanowire resonators by cryogenic-ICP-DRIE," Microsystem Technologies, vol. 20 no. 4-5, pp. 759-767, Apr. 2014.

Meschter, S. J., McKeown, S. A., Feathers, R., and Arseneau, E., "BGA Re-Balling from Pb-Free to Sn-Pb Metallurgy," International Conference on Soldering & Reliability 2010 Proceedings, Toronto, Ontario, Canada, May 17-20, 2010, pp. xx-xx.

Meschter, S., "Lead-to-lead spacing considerations a part of a comprehensive 2B tin whisker mitigation strategy," AIA/GEIA/AMC LEAP Meeting, June 10-11, 2008, pp. xx-xx.

Meschter, S., "Lead-to-lead spacing considerations a part of a comprehensive 2B tin whisker mitigation strategy," Tin Whisker Group teleconference, May 19, 2010.

Meschter, S., Cho, J., Maganty, S., Edwards, D., Romansky, M., Keeping, J., Snugovsky, P., McMahon, J., Bagheri, Zohreh, and Kennedy, J., "Strategic Environmental Research and Development Program (SERDP) Layered Nanoparticle Enhanced Conformal Coating for Whisker Mitigation," International Conference on Soldering & Reliability 2016 Proceedings , Toronto, Ontario, Canada, May 9-11, 2016, pp. xx-xx.

Meschter, S., Cho, J., Maganty, S., Starkey, D., Gomez, M., Edwards, D., Ekin, A., Elsken, K., Keeping, J., Snugovsky, P., Kosiba, Eva, Bagheri, Zohreh, and Kennedy, J., "Strategic Environmental Research and Development Program (SERDP) Nanoparticle Enhanced Conformal Coating for Whisker Mitigation," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 489-529.

Meschter, S., Snugovsky, P., Bagheri, Z., Kosiba, E., Romansky, M., Kennedy, J., Snugovsky, L., and Perovic, D., "Whisker Formation on SAC305 Soldered Assemblies," JOM, vol. 66 no. 11, pp. 2320-2333, Nov. 2014.

Meschter, Stephan, "A Probabilistic Assessment of Component Lead-to-Lead Tin Whisker Bridging," Tin Whisker Group teleconference, July 15, 2009.

Meschter, Stephan, and McKeown, Stephen, "Effect of Hot Solder Dipping on Part Stresses," 2008 ASME International Mechanical Engineering Congress and Exposition, Volume 6, Boston, MA, Oct. 31-Nov. 6, 2008, pp. 183-190.

Meschter, Stephan, "Effect of hot solder dipping on part stresses," Tin Whisker Group teleconference, Dec. 17, 2008.

Meschter, Stephan, "Enabling Lead-free in the DoD through Risk Mitigation: Program Management and Systems Engineering Overview," Tin Whisker Group teleconference, Aug. 24, 2016.

Meschter, Stephan, "Pb-free Solder Technical Issues (Not Including Tin Whiskers)," DoD Diminishing Manufacturing Sources and Material Shortages Conference, Charlotte, NC, July 11. 2006, pp. xx-xx.

Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and Kosiba, Eva, "SERDP Tin Whisker Testing and Modeling: High Temperature/High Humidity Conditions," International Conference on Soldering & Reliability 2013 Proceedings, Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.

Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and Kosiba, Eva, "SERDP Tin Whisker Testing and Modeling: Low Stress Conditions," Tin Whisker Group Teleconference, July 25, 2012.

Meschter, Stephan, Ekstrom, Evan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and Kosiba, Eva, "Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Long Term Low Temperature High Humidity Testing," International Conference on Soldering & Reliability 2015 Proceedings , Toronto, Ontario, Canada, May 19-21, 2015, pp. xx-xx.

Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and Kosiba, Eva, "Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Thermal Cycling Testing," International Conference on Soldering & Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.

Meschter, Stephan J., Snugovsky, Polina, Kennedy, Jeffery, Bagheri, Zohreh, and Kosiba, Eva, "Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Thermal Cycling Testing," SMTA Journal, vol. 28 no. 2, pp. 15-35, June 2015.

Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and Kosiba, Eva, "Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Tin Whisker Growth on SAC305 Assemblies," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 449-475.

Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and Kosiba, Eva, "Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Tin Whisker Growth on SAC305 Assemblies and Risk Modeling," Tin Whisker Group teleconference, Nov. 12, 2014.

Meschter, Stephen, Snugovsky, Polina, Kennedy, Jeff, McKeown, Steve, Bagheri, Zohreh, and Kosiba, Eva, "Tin Whisker Testing and Modeling: Low Stress Conditions," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 16-18, 2012, pp. xx-xx.

Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, McKeown, Steve, and Kosiba, Eva, "Tin Whisker Testing and Risk Modeling Project," International Conference on Soldering & Reliability 2011 Proceedings, Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

Meschter, Stephan, McKeown, Steve, Snugovsky, Polina, Kennedy, Jeff, and Kosiba, Eva, "Tin Whisker Testing and Risk Modeling Project," SMTA Journal, vol. 24 no. 3, pp. 23-31, 2011.

Meschter, Stephan, Snugovsky, Polina, Kennedy, Jeff, Bagheri, Zohreh, and Kosiba, Eva, "Tin Whisker Testing: Low Stress Conditions," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 15-18, 2012, pp. xx-xx.

Meshgi, Mohammad Aghazadeh, Biswas, Subhajit, McNulty, David, O'Dwyer, Colm, Verni, Giuseppe Alessio, O'Connell, John, Davitt, Fionan, Letofsky-Papst, Ilse, Poelt, Peter, Holmes, Justin D., and Marschner, Christoph, "Rapid, Low-Temperature Synthesis of Germanium Nanowires from Oligosilylgermane Precursors," Chemistry of Materials, vol. 29 no. 10, pp. 4351-4360, May 23, 2017.

Meshram, Nagsen P., Kumbhar, Alka, and Dusane, R. O., "Silicon nanowire growth on glass substrates using hot wire chemical vapor deposition," Thin Solid Films, vol. 519 no. 14, pp. 4609-4612, May 2, 2011.

Messerknecht, Craig, "Highest Common Denominator," Design News, vol. 63 no. 12, pp. xx, Sept. 1, 2008.

Messina, Chris, Muennich, Arno, and Blumenthal, Robert, "Decarburization-free and soot-free batch-annealing with automated atmosphere control," Wire Journal International, vol. 37 no. 3, pp. 62-65, Mar. 2004.

Messina, John, and Simmon, Eric, "Understanding EuP and REACH," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S09:01.

Messler, Robert W., "Joining comes of age: from pragmatic process to enabling technology," Assembly Automation, vol. 23 no. 2, pp. xx-xx, 2003.

Messler Jr., Robert W., "Joining technologies for the next century: drivers and directions," Assembly Automation, vol. 17 no. 1, pp. 56-65, 1997.

Mester, A., Fraunholcz, N., van Schaik, A., and Reuter, M. A., "Characterization of the Hazardous Components in End-of-Life Notebook Display," Light Metals 2005, San Francisco, CA, Feb. 13-17. 2005, pp. 1213-1216.

Metais, B., Kabakchiev, A., Maniar, Y., Guyenot, M., Metasch, R., Roellig, M., Rettenmeier, P., Buhl, P., and Weihe, S., "A Viscoplastic-Fatigue-Creep damage model for tin-based solder alloy," 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Budapest, Hungary, Apr. 19-22, 2015, pp. xx-xx.

Metais, B., Kuezynska, M., Kabakchiev, A., Wolfangel, S., Buhl, P., and Weihe, S., "Experimental and numerical investigation of fatigue damage development under multiaxial loads in a lead-free Sn-based solder alloy," 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Montpelier, France, Apr. 18-20, 2016, pp. xx-xx.

Metasch, R., Roellig, M., and Wolter, K.-J., "A Novel Thermo-Mechanical Test Method of Fatigue Characterization of Real Solder Joints," European Microelectronics and Packaging Conference , Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Metasch, R., Roellig, M., Kuczynska, M., Schafet, N., Becker, U., Meier, K., and Panchenko, I., "Accelerated Life Time Measurement with In-situ Force and Displacement Monitoring during Thermal Cycling on Solder Joints," 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Dresden, Germany, Apr. 3-5, 2017, pp. xx-xx.

Metasch, R., Roellig, M., and Wolter, K.-J., "Combined creep and fatigue measurement method for lead-free solder alloys," 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Lisbon, Portugal, Apr. 16-18, 2012, pp. xx-xx.

Metasch, R., Roellig, M., Kabakchiev, A., Metais, B., Ratchev, R., Meier, K., amd Wolter, K.-J., "Experimental investigation of the visco-plastic mechanical properties of a Sn-based solder alloy for material modelling in Finite Element calculations of automotive electronics," 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Ghent, Belgium, Apr. 7-9, 2014, pp. xx-xx.

Metasch, R., Schwerz, R., Roellig, M., Kabakchiev, A., Metais, B., Ratchev, R., and Wolter, K.-J., "Experimental investigation on microstructural influence towards visco-plastic mechanical properties of Sn-based solder alloy for material modelling in finite element simulations," 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Budapest, Hungary, Apr. 19-22, 2015, pp. xx-xx.

Metasch, R., Roellig, M., Roehsler, A., Boehm, C., and Wolter, K.-J., "Low Cycle Fatigue Measurement Results on Real Flip Chip Solder Contacts," 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Wroclaw, Poland, Apr. 14-17, 2013, pp. xx-xx.

Metasch, R., Schwerz, R., Meier, K., and Roellig, M., "Numerical study on the influence of material models for tin-based solder alloys on reliability statements," 2019 22nd European Microelectronics and Packaging Conference & Exhibition, Pisa, Italy, Sept. 16-19, 2019. pp. xx-xx.

Metasch, R., Boareto, J. C., Roellig, M., Wiese, S. and Wolter, K.-J., "Primary and Tertiary Creep Properties of Eutectic SnAg3.8Cu0.7 in Bulk Specimens," 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems , Delft, Netherlands, Apr. 26-29, 2009, pp. xx-xx.

Metasch, R., Rodrigues, G., Roellig, M., Wendhausen, P. A. P., and Wolter, K.-J., "Study of constant rate and constant force low cycle fatigue methods for solder characterization," 2011 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Linz, Austria, Apr. 18-20, 2011, pp. xx-xx.

Metzger, Dieter, and Vogel, Roland, "Aging Characteristics of Immersion Tin Surface Finishes," Circuits Assembly, vol. 14 no. 12, pp. 20-22, Dec. 2003.

Metzger, Robert M., Konovalov, Valery V., Sun, Ming, Xu, Tao, Zangari, Giovanni, Xu, Bin, Benakli, Mourad, and Doyle, W. D., "Magnetic Nanowires in Hexagonally Ordered Pores of Alumina," IEEE Transactions on Magnetics, vol. 36 no. 1 pt. 1, pp. 30-35, Jan. 2000.

Mey, Christiaan L., Cao, Anthony, and Perovic, Doug D., "Lead-Free Solders for Use in Solar Module Manufacturing," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 666-678.

Meyer, A., Pretorius, L., and Pretorius, J. H. C., "A Model to Manage Electronic Component Obsolescence for Complex or Long Life Systems" 2004 IEEE International Engineering Management Conference, Volume 3, Singapore, Oct. 18-21, 2004, pp. 1303-1309.

Meyer, A., Pretorius, L., and Pretorius, J. H. C., "A Model using an Obsolescence Mitigation Timeline for Managing Component Obsolescence of Complex or Long Life Systems," 2004 IEEE International Engineering Management Conference, Volume 3, Singapore, Oct. 18-21, 2004, pp. 1310-1313.

Meyer, J. D., "Negative Differential Resistance in the V(I)-Characteristic of Superconducting Sn-Whiskers," Applied Physics, vol. 7 no. 2, pp. 127-130, June 1975. https://doi.org/10.1007/BF00884222

Meyer, J. D., "Spannungsstufen in den U(T)-Ubergangskurven und U(I)-Kennlinien stromtragender Zinn-Whisker," Applied Physics, vol. 2 no. 6, pp. 303-320, Dec. 1973. https://doi.org/10.1007/BF00896936

Meyer, Jorg, Upasani, Prathamesh Jayant, Bickel, Steffen, Panchenko, Iuliana, and Wolf, M. Jurgen, "Flux-induced porous structures in Cu-SnAg solid-liquid-interdiffusion microbump interconnects," 2018 7th Electronic System-Integration Technology Conference, Dresden, Germany, Sept. 18-21, 2018, pp. xx-xx.

Meyer, Sebastian, Wohlrabe, Heinz, and Wolter, Klaus-Jurgen, "Neural Network Modeling to Predict Quality and Reliability for BGA Solder Joints," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1596-1603.

Meyer, Sebastian, Metasch, Rene, Schwerz, Robert, Wohlrabe, Heinz, and Wolter, Klaus-Jurgen, "Process and Material Effects on BGA Board Level Solder Joint Reliability," 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 7-9, 2011, pp. 497-502.

Meyyappan, M., and Lee, Jeong-Soo, "The Quiet Revolution of Inorganic Nanowires," IEEE Nanotechnology Magazine, vol. 4 no. 2, pp. 4-9, June 2010.

Mhiaoui, S., Sar, F., and Gasser, J. G., "Electrical and thermal conductivities and thermal power of some lead free solders (LFS) in the liquid and solid state," Journal of Non-Crystalline Solids, vol. 353 no. 32-40, pp. 3628-3632, Oct. 15, 2007.

Mi, Jinhua, Wang, Jie, Li, Yan-Feng, Huang, Hong-Zhong, Yang, Yuan-Jian, and Peng, Weiwen, "The Life Prediction of Lead-Free Solder Joint With Type-I Interval Censored Data," 2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, Emeishan, Sichuan, China, July 15-18, 2013, pp. 904-907.

Miao, Hua, Gu, Xin, and Shi, Dong, "Wire Bonding and Soldering Study of Thin Ni-P ENEPIG Surface Finish," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Miao, Hui-Wei, Duh, Jenq-Gong, and Chiou, Bi-Shiou, "Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints," Journal of Materials Science: Materials in Electronics, vol. 11 no. 8, pp. 609-618, Nov. 2000.

Miaosen, Yang, Fenglian, Sun, and Xia, Li, "Study of Creep Performance of Sn-0.7Ag-0.5Cu-3.5Bi-0.05Ni/Cu by Nanoindentation," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 1037-1039.

Michael, A., Zhou, Y. N., and Khan, M. I., "Novel method to analyse tensile properties of ultra-fine NiTi wires with a visual extensometer," Materials Letters, vol. 182, pp. 177-180, Nov. 1, 2016.

Michael, J. R., McKenzie, B. B., and Susan, D. F., "Crystallographic Characterization of Whiskers Using EBSD," Microscopy and Microanalyses, vol. 17 no. S2, pp. 392-393, July 2011.

Michael, Joseph R., Susan, Don F., and McKenzie, Bonnie, "2D and 3D EBSD and TKD: Examples from Tin Whiskers," Sandia Report SAND2014-16904PE, 2014.

Michael, Joseph R., McKenzie, Bonnie, and Susan, Don F., "Crystallographic Characterization of Whiskers using EBSD: Examples from Tin Whiskers," Sandia Report SAND2011-5221C, 2011.

Michael, Joseph R., McKenzie, Bonnie, and Susan, Don F., "Crystallographic Characterization of Whiskers using EBSD: Examples from Tin Whiskers," Sandia Report SAND2012-0278C, 2012.

Michael, Joseph R., Rye, Michael J., Susan, Don F., and McKenzie, Bonnie, "Crystallographic Characterization of Whiskers using EBSD: Examples from Tin Whiskers," Sandia Report SAND2014-0231C, 2014.

Michael, Nancy L., and Kim, Choong-Un, "Electromigration in Cu thin films with Sn and Al cross strips," Journal of Applied Physics, vol. 90 no. 9, pp. 4370-4376, Nov. 1, 2001.

Michailov, Michail, Ranguelov, Bogdan, Giazitzidis, Paraskevas, and Argyrakis, Panos, "Thermal stability and spontaneous breakdown of free-standing metal nanowires," Journal of Crystal Growth, vol. 457, pp. 92-97, Jan. 1, 2017.

Michel, Hans-Juergen, "Going green: the OEM's challenge," Electronics Supply & Manufacturing, Dec. 2005.

Michel, Hans-Juergen, "Going green: the OEM's challenge," Green SupplyLine, Dec. 1, 2005.

Michel, Hans-Juergen, "Logistics during the Conversion to Lead-free Production of Telecommunications Network Equipment," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Michelin, P., "CrVI free primer: from corrosion findings to profile," Aircraft Engineering and Aerospace Technology, vol. 75 no. 2, pp. 130-136, 2003.

Micol, A., Zeanh, A., Lhommeau, T., Azzopardi, S., Woirgard, E., Dalverny, O., and Karama, M., "An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications," Microelectronics Reliability, vol. 49 no. 9-11, pp. 1370-1374, Sept.-Nov. 2009.

Micol, A., Martin, C., Dalverny, O., Mermet-Guyennet, M., and Karama, M., "Reliability of lead-free solder in power module with stochastic uncertainty," Microelectronics Reliability, vol. 49 no. 6, pp. 631-641, June 2009.

Micol, Alexandre, Zeanh, Adrien, Dalverny, Olivier, and Karama, Moussa, "Identification of the Sn/Ag3.5 law behavior with the scatter of the parameters. Study of aeronautical application in power module," Advanced Materials Research, vol. 112, 2010, pp. 83-92.

Miele, Angelo, Birkas, Bill, Alapa, Cliff, Hebenstreit, Wilhelm, Mansour, Said, and Edler, Eric, "A Method to Evaluate PCBA Suppliers' Pb-Free vs. Leaded Processes for Telecom Applications," IPC Printed Circuits Expo, APEX and the Designers Summit, Los Angeles, CA, Feb. 20-22, 2007, pp. xx-xx.

Miessner, R., Aschenbrenner, R., and Reichl, H., "Correlation of Thermo-mechanical Properties of Adhesives with Reliability of FC Interconnections," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 299-304.

Miessner, R., Nieland, C., Aschenbrenner, R., and Reichl, H., "Evaluation of Flip Chip Bonding Using ACA On Polyester Substrates," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 46-51.

Miessner, R., Aschenbrenner, R., and Reichl, H., "Reliability Study of Flip Chip on FR4 Interconnections with ACA," 1999 Proceedings 49th Electronic Components & Technology Conference, San Diego, CA, June 1-4, 1999, pp. 595-601.

Miessner, Ralf, Aschenbrenner, Rolf, Reichl, Herbert, Ling, Sharon, Le, Binh, Lew, Ark, Benson, Richard, and Nhan, Elbert, "Comparison of Flip Chip Technologies on Rigid Polyimide with Respect to Reliability and Manufacturing Costs," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 1133-1138.

Mihaescu, Radu, and Carstea, Horia, "Ecological Technologies for Soldering Withhout Lead in Electronic and Telecommunications - Today and Tomorrow," 26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials, The High Tatras, Slovak Republic, May 8-11, 2003, pp. 232-234.

Miki, Takahiro, Ogawa, Naotaka, Nagasaka, Tetsuya, and Hino, Mitsutaka, "Activity Measurement Of The Constituents in Molten Sn-Ag-In and Sn-Zn-Mg Ternary Lead Free Solder Alloys by Mass Spectrometry," Yazawa International Symposium: Metallurgical and Materials Processing: Principles and Techologies: Volume 1: Materials Processing Fundamentals and New Technologies, San Diego, CA, Mar. 2-6, 2003, pp. 405-415.

Miki, Takahiro, Ogawa, Naotaka, Nagasaka, Tetsuya, and Hino, Mitsutaka, "Activity Measurement of the Constituents in Molten Ag-In-Sn Ternary Alloy by Mass Spectrometry," Materials Transactions, vol. 42 no. 5, pp. 732-738, May 2001.

Miklosey, Bob, "Lead-free Process Control Management," Surface Mount Technology (SMT) , vol. 20 no. 5, pp. 31-33, May 2006.

Mikrajuddin, Shi, F. G., Okuyama, K., and Kim, H. K., "Conduction Development in Electrically Conductive Adhesives with a Bimodal Size Distributed Conducting and Inert Particles: Effect of Polydispersity," 2000 Proceedings 50th Electronic Components & Technology Conference , Las Vegas, NV, May 21-24, 2000, pp. 609-614.

Mikula, Adolf, "Zinc - A possible component in lead-free solders," Yazawa International Symposium: Metallurgical and Materials Processing: Principles and Techologies: Volume 1: Materials Processing Fundamentals and New Technologies, San Diego, CA, Mar. 2-6, 2003, pp. 395-403.

Mikulics, M., Zhang, J., Sobolewski, R., Adam, R., Juul, L., Marso, M., Winden, A., Hardtdegen, H., Grutzmacher, D., and Kordos, P., "GaAs nanowhiskers for femtosecond photodetectors and THz emitters," 2012 Ninth International Conference on Advanced Semiconductor Devices & Microsystems, Smolenice, Slovakia, Nov. 11-15, 2012, pp. 71-74.

Milad, G., Gudeczauskas, D., O'Brien, G., and Gruenwald, A., "A Study of the ENEPIG IMC for Eutectic and LF Solders," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 991-998.

Milad, G., Gudeczauskas, D., O'Brien, G., and Gruenwald, A., "A Study of the ENEPIG IMC for Eutectic and LF Solders," South East Asia Technical Training Conference on Electronics Assembly Technologies 2011 Proceedings, Penang, Malaysia, May 19-20, 2011, pp. xx-xx.

Milad, George, "Behind Black Pad," Printed Circuit Design and Fab, vol. 25 no. 9, pp. 21, Sept. 2008.

Milad, George, and Martin, Jim, "Electroless Nickel/Immersion Gold, Solderability and Solder Joint Reliability as Functions of Process Control," CircuiTree, vol. 13 no. 10, pp. xx, Oct. 2000.

Milad, George, Bengston, Jon, and Gruenwald, Albin, "Elimination of "Nickel Corrosion" in ENIG and ENEPIG by Using "Reduction Assisted Immersion Gold" in Place of "Standard Immersion Gold"," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 256-262.

Milad, George, "ENEPIG: A Final Finish That's Time Has Come," Circuitree, vol. 23 no. 5, pp. xx-xx, May 2010.

Milad, George, and Gudeczauskas, Don, "Getting the Lead Out of Surface Finishing," Metal Finishing, vol. 104 no. 1, pp. 33-36, Jan. 2006.

Milad, George, "Improving Lead-free Solder Reliability," Printed Circuit Design and Fab, vol. 25 no. 12, pp. 22, Dec. 2008.

Milad, George, and O'Brien, Gerard, "IPC Committees Immersed in Plating Finish Issues," Route, June 2005.

Milad, George, "Is "black pad" still an issue for ENIG?," Circuit World, vol. 36 no. 1, 2010, pp. 10-13.

Milad, George, "Making the Critical Connection," Printed Circuit Design and Fab , vol. 25 no. 6, pp. 20, June 2008.

Milad, George, "OSP for Lead-Free Assembly," Printed Circuit Design and Fab, vol. 26 no. 6, pp. 16, June 2009.

Milad, George, and Gudeczauskas, Don, "Soldering and Solder Joint Reliability for Selected Surface Finishes with Lead Free SAC305 Alloy," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 655-660.

Milad, George, and Gudeczauskas, Don, "Surface Finishes and RoHS Compliance: Should We Be Concerned?," IPC Review, vol. 48 no. 2, pp. 14-15, Feb. 2007.

Milad, George, and Gudeczauskas, Don, "Surface Finishes and RoHS Compliance: What You Need to Know," IPC Review, vol. 1 no. 3, pp. 5,7, July/Aug. 2008.

Milad, George, and Orduz, Mario, "Surface Finishes in a Lead-Free World," Metal Finishing, vol. 105 no. 1, pp. 25-28, Jan. 2007.

Milad, George, "Surface finishes in a lead-free world," Circuit World, vol. 34 no. 4, pp. 4-7, 2008.

Milad, George, "Surface Finishes: Metallic Coatings Over Nickel Over Copper," Surface Mount International Proceedings of the Technical Program, Volume II, San Jose, CA, Sept. 10-12, 1996, pp. 794-796.

Milad, George, "The elimination of whiskers from electroplated tin," Circuit World , vol. 37 no. 4, pp. 10-15, 2011.

Milad, George, "The Elimination of Whiskers from Electroplated Tin," Metal Finishing , vol. 110 no. 1, pp. 10-15, Jan.-Feb. 2012.

Milcheva, N., Broz, P., Bursik, J., and Vassilev, G. P., "Thermochemical and phase diagram studies of the Bi-Ni-Sn system," Thermochimica Acta, vol. 534, pp. 41-50, Apr. 20, 2012.

Milenin, Andriej, Gautham, B. R, Goyal, Sharad, Pilarczyk, Jan W., and Muskalski, Zbigniew, "FEM simulation of wire fracture phenomena during multi-pass drawing," Wire Journal International, vol. 41 no. 10, pp. 93-99, Oct. 2008.

Milenin, Andriej, Kustra, Piotr, Seitz, Jan-Marten, Bach, Friedrich-Wilhelm, and Bormann, Dirk, "Production of thin wires of magnesium alloys for surgical applications," Wire Journal International, vol. 44 no. 6, pp. 74-81, June 2011.

Milenin, Andrzej, and Byrska-Wojcik, Dorota J., "The multi-scale model of Mg alloy wire drawing process," Wire Journal International, vol. 45 no. 1, pp. 48-54, Jan. 2012.

Milenkovic, Srdjan, Nakayama, Tomonobu, Rohwerder, Michael, and Hassel, Achim Walter, "Structural characterisation of gold nanowire arrays," Journal of Crystal Growth, vol. 311 no. 1, pp. 194-199, Dec. 15, 2008.

Milhet, X., Gadaud, P., Caccuri, V., Bertheau, D., Mellier, D., and Gerland, M., "Influence of the Porous Microstructure on the Elastic Properties of Sintered Ag Paste as Replacement Material for Die Attachment," Journal of Electronic Materials, vol. xx no. x, pp. xx-xx, xxxx.

Miller, Allan G., "Get ready for new EU battery directive requirements," Green SupplyLine, Nov. 10, 2006.

Miller, Allan G., "RoHS update: Six exemptions pass TAC vote," EE Times Europe, July 28, 2006.

Miller, Allan G., "RoHS update: Six new exemptions pass TAC vote," Green SupplyLine , July 28, 2006.

Miller, Allan, and Hughes, Cian, "Unraveling WEEE directive requirements," Green SupplyLine, Nov. 17, 2006.

Miller, Chad M., Anderson, Iver E., and Smith, Jack F., "A Viable Tin-Lead Solder Substitute: Sn-Ag-Cu," Journal of Electronic Materials, vol. 23 no. 7, pp. 595-601, July 1994.

Miller, Dean, "Moving Toward Lead-Free Products," Medical Device & Diagnostic Industry, vol. xx no. xx, pp. xx-xx, May 2005.

Miller, Harvey, "9 Trillion Solder Joints--The Occam Razor Will Cut Them Away," PCB007, Sept. 10, 2007.

Miller, Harvey, "A Friendly Clarification to Ray Franklin's "Calls to Throw Out RoHS Unnecessary"," PCB007, May 15, 2006.

Miller, Harvey, "Dr. Lasky's Latest RoHS Defense-- "It's for safer recycling," July 20, 2006.

Miller, Harvey S., "E-Waste Is the New Growth Industry!," Chip Scale Review, vol. xx no. xx, pp. xx-xx, July 2002.

Miller, Harvey, "Exemption Request for the Use of Lead in Solders Has Been Accepted," Dec. 12, 2006.

Miller, Harvey, "Indiana Skunkworks Wants to Eliminate Solder," PCB007, Oct. 22, 2008.

Miller, Harvey, "It's Going to be a Two-Track World for a while anyway," PCB007 , Nov. 6, 2005.

Miller, Harvey, "It's Time to Push Back: An Open Letter by Harvey Miller," Circuitree, vol. 19 no. 7, pp. xx-xx, July 2006.

Miller, Harvey, "Lead-Free Electronic Solder,Why?," Oct. 10, 2004.

Miller, Harvey, "Lead-free electronic solders: Are they really better?," Electronic Business, Sept. 1, 2002.

Miller, Harvey, "Lead-free Solder and the Occam Factor," PCB007, Sept. 3, 2007.

Miller, Harvey S., "Lead-Free vs. Halogen-Free Electronics," Chip Scale Review, vol. xx no. xx, pp. xx-xx, July 2003.

Miller, Harvey, "Lead in Solder, Bromine in Epoxy: Guilt by Association?," Chip Scale Review, vol. xx no. xx, pp. xx-xx, July-Aug. 2000.

Miller, Harvey, "Let's Stay with Lead in Solder," Electronic News, vol. 46 no. 42, pp. 64, Oct. 16, 2000.

Miller, Harvey, "OCCAM Process: Mainstream Future or Small Module Niche?," PCB007 , Jan. 6, 2009.

Miller, Harvey, ""Pro Lead-free" vs. "Anti" people, or is it more like man vs. nature?," circuitnet, Dec. 6, 2006.

Miller, Harvey, "RoHS Revolution? Pb Push-back?," Circuitnet, June 5, 2006.

Miller, Harvey, "semi-OT: Opportunity to be heard on RoHS," May 2, 2007.

Miller, Harvey, "The Swatch Group Struggles with Lead-Free, Applies for Exemption," PCB007, May 11, 2006.

Miller. Harvey, "Why lead-free isn't all it's cracked up to be (by Harvey Miller)," PCB007, May 10, 2001.

Miller, Jean, "We Told You So," ECN, vol. 49 no. 5, pp. 62, May 2005.

Miller, Jeff, "Why There Is No Pending Ban On Electronic Lead Solder," Circuits Assembly, vol. 9 no. 2, pp. 128,126, Feb. 1998.

Miller, Larry L., Zhong, Chuanjian, and Hong, Yaoliang, "Anisotropic, conducting films from imide anion radicals and poly(vinyl alcohol) formed by casting," Synthetic Metals, vol. 62 no. 1, pp. 71-73, Jan. 15, 1994.

Miller, Robert N., "Inhibitive Sealing Compounds and Coating Systems Solve Aircraft Corrosion Problems," SAMPE Journal, vol. 6 no. 3, pp. 54-58, Apr.-May 1970.

Miller, Sarah M., Sahaym, Uttara, and Norton, M. Grant, "Effect of Substrate Composition on Sn Whisker Growth in Pure Sn Films," Metallurgical and Materials Transactions A, vol. 41 no. 13, pp. 3386-3395, Dec. 2010. https://doi.org/10.1007/s11661-010-0431-z

Milmo, Sean, "European electronic chemicals heed call for innovation," Chemical Market Reporter, vol. 268 no. 2, pp. 24-25, July 18, 2005.

Milne, Graeme, "The recycler's view," IEE Seminar on Beyond WEEE. Unsustainable Product Design and How to Avoid It, London, UK, Nov. 29, 2005, pp. 3/1-3/4.

Milosavljevic, Aleksandra, Zivkovic, Dragana, Manasijevic, Dragan, Talijan, Nadezda, Cosovic, Vladan, Grujic, Aleksandar, and Marjanovic, B., "Phase diagram investigation and characterization of ternary Sn-In-Me (Me = Ag, Cu) lead-free solder systems," International Journal of Materials and Product Technology, vol. 39 no. 1-2, pp. 95-107, 2010.

Milosavljevic, Aleksandra, Zivkovic, Dragana, Manasijevic, Dragan, Du, Yong, Talijan, Nadezda, Bu, Mengjie, and Kostov, Ana, "Phase diagram investigation of the Sn-Inx-Agy-Cuz (x:y:z = 7:2:1) section in the Ag-In-Sn-Cu system," International Journal of Materials Research , vol. 104 no. 5, pp. 452-456, 2013.

Milovantseva, Natalia, and Saphores, Jean-Daniel, "Time bomb or hidden treasure? Characteristics of junk TVs and of the US households who store them," Waste Management, vol. 33 no. 3, pp. 519-529, Mar. 2013.

Mims III, Forrest M., "Are you Ready for Lead-Free Solder?," The Citizen Scientest News , Oct. 7, 2005.

Min, Kyung Deuk, Lee, Choong-Jae, Park, Hyun-Joon, and Jung, Seung-Boo, "Microstructures and Mechanical Properties of Sn-58 wt.% Bi Solder with Ag-Decorated Multiwalled Carbon Nanotubes Under 85°C/85% Relative Humidity Environmental Conditions," Journal of Electronic Materials, vol. 49 no. 2, pp. 1527-1533, Feb. 2020.

Min, Kyung Deuk, Jung, Kwang-Ho, Lee, Choong-Jae, Jeong, Haksan, and Jung, Seung-Boo, "Pressureless transient liquid phase sintering bonding in air using Ni and Sn-58Bi for high-temperature packaging applications," Journal of Materials Science: Materials in Electronics, vol. 30 no. 20, pp. 18848-18857, Oct. 2019.

Min, Tan Ai, Lim, Sharon Pei-Siang, and Lee, Charles, "Development of Solder Replacement Flip Chip using Anisotropic Conductive Adhesives," 2003 5th Conference on Electronics Packaging Technology , Dec 10-12, 2003, pp. 390-396.

Min, Tan Ai, Lim, Sharon Pei-Siang, Yeo, Alfred, and Lee, Charles, "Influence of Bump Geometry, Adhesives and Pad Finishings on the Joint Resistance of Au Bump and A/NCA Flip Chip Interconnection," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2, Singapore, Dec. 7-9, 2005, pp. 797-801.

Min, Tan Ai, Kheng, Soh Choew, Lim, Sharon Pei-Siang, and Lee, Charles, "Process and Materials Considerations for Pb-free Flip Chip Packaging of 65nm Cu/low-k Device" 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 336-339.

Min, Yang, Xiuzhong, Liu, Xinghong, Liu, and Jiahui, Dai, "Development of Sn-Zn-Cu Lead Free Solder," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging , Xi'an, China, Aug. 16-19, 2010, pp. 784-788.

Min, Zhixian, Qiu, Yu, Hu, Xiaowu, and Wang, Haozhong, "Effect of Cu6Sn5 nanoparticles size on the properties of Sn0.3Ag0.7Cu nano-composite solders and joints," Journal of Materials Science: Materials in Electronics, vol. 30 no. 15, pp. 14726-14735, Aug. 2019.

Min, Zhixian, Hu, Xiaowu, and Qiu, Yingxia, "Effects of soldering temperature on IMCs formation between Sn-0.7Cu solder and Cu substrate," Applied Mechanics and Materials, vol. 713-715, pp. 2685-2688, Jan. 2015.

Min, Zhixian, and Qiu, Yingxia, "Interfacial reaction and IMCs formation between Sn-0.7Cu solder and Cu substrate during reflow soldering," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 1367-1370.

Minagawa, Kazumi, Liu, Yunzhong, Kakisawa, Hideki, Osawa, Yoshiaki, Takamori, Susumu, and Halada, Kohmei, "Hybrid Atomization Process Applied to Fine Lead-Free Solder Powder Production," Materials Transactions, vol. 44 no. 7, pp. 1316-1319, July 2003.

Minagawa, Kazumi, Kakisawa, Hideki, Osawa, Yoshiaki, Takamori, Susumu, and Halada, Kohmei, "Production of fine spherical lead-free solder powders by hybrid atomization," Science and Technology of Advanced Materials, vol. 6 no. 3-4, pp. 325-329, Apr.-May 2005.

Minagawa, Kazumi, Liu, Yunzhong, Kakisawa, Hideki, Takamori, Susumu, Osawa, Yoshiaki, and Halada, Kohmei, "Production of Fine Uniform Lead-Free Solder Powders by Hybrid Atomization," Materials Science Forum, vol. 426-432, pp. 3341-3346, 2003.

Min-Bo, Zhou, Xiao, Ma, and Xin-Ping, Zhang, "Size Effect on the Intermetallic Compound Coalescence in Sn-Ag-Cu Solder and Sn-Ag-Cu/Cu Solder Joints," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 248-253.

Ming, Khaw Mei, and Lee, Andrey, "Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly," IPC APEX Expo 2012, San Diego, CA, Feb. 28-Mar. 1, 2012, pp. xx-xx.

Ming, Khaw Mei, "Evaluation of Lead Free Surface Finishes," South East Asia Technical Training Conference on Electronics Assembly Technologies 2011 Proceedings , Penang, Malaysia, May 19-20, 2011, pp. xx-xx.

Mino, J., Zhukova, V., del Val, J. J., Ipatov, M., Martinezamesti, A., Varga, R., and Zhukov, A., "Engineering of the GMR Effect in CuCo Microwires with Granular Structure," Journal of Electronic Materials, vol. 45 no. 5, pp. 2401-2406, May 2016.

Minor, A. M., and Morris, J. W., "Growth of a Au-Ni-Sn Intermetallic Compound on the Solder-Substrate Interface after Aging," Metallurgical and Materials Transactions A, vol. 31 no. 3, pp. 798-800, Mar. 2000.

Minor, Manickavasagar, Sjoberg, Jonas, Lee, Jenson, and Shangguan, Dongkai, "Process Development, Repair and Reliability Study with Anisotropic Conductive Film Bonding as a Replacement for Surface Mount Connectors and Hotbar Soldering," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Minter, Adam, "Blazing the Plastic Recycling Trail," Scrap, vol. 63 no. 4, pp. 61-66, July/Aug. 2006.

Minter, Charlie, "Robotic Solder Dip - A Key Technique for Mitigating Reliability Risk Posed by Tin Whiskers," DoD Diminishing Manufacturing Sources & Material Shortages (DMSMS) Workshop, San Antonio, TX, Dec. 13-15, 2005, pp. xx-xx.

Minter, Charlie, "Tin Whiskers: A New DMSMS Issue," DMSMS COE Newsletter, vol. 3 no. 3, pp. 3-4.

Minter, Charlie, "Tin Whiskers: Reliability Risk That Adds a New Dimension to DMSMS," 2006 Diminishing Sources and Material Shortages (DMSMS) Conference , Charlotte, NC, July 10-13, 2006.

Minzari, Daniel, Jellesen, Morten S., Moller, Per, and Ambat, Rajan, "On the electrochemical migration mechanism of tin in electronics," Corrosion Science, vol. 53 no. 10, pp. 3366-3379, Oct. 2011.

Mir, Irfan, and Kumar, D., "Recent advances in isotropic conductive adhesives for electronics packaging applications," International Journal of Adhesion and Adhesives, vol. 28 no. 7, pp. 362-371, Oct. 2008.

Mirabi-semnakolaii, Ali, Daneshgar, Parandis, Moosavi-Movahedi, Ali Akbar, Rezayat, Mehdi, Norouzi, Parviz, Nemati, Ali, and Farhadi, Mohammad, "Sensitive determination of herbicide trifluralin on the surface of copper nanowire electrochemical sensor," Journal of Solid State Electrochemistry, vol. 15 no. 9, pp. 1953-1961, Sept. 2011.

Mirabito, A. Jason, and Peters, Carol, "Patent-related aspects of RoHS," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Mar. 2006.

Miragliotta, Joseph, Benson, Richard C., and Phillips, Terry E., "Measurements of Electrical Resistivity and Raman Scattering From Conductive Die Attach Adhesives," 2002 8th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 3-6, 2002, pp. 132-138.

Mirdamadi, S. Hossein, Derakhshandeh, Jaber, Cochet, Tom, Beyne, Eric, Beyer, Gerald, and Miller, Andy, "Evaluation of UBM oxidation through air exposure and heating and effectiveness of wet and plasma cleaning on solder joint formation during TCB," 2020 IEEE 8th Electronics System-Integration Technology Conference , Tonsberg, Norway, Sept. 15-18, 2020, pp. xx-xx.

Miric, Anton, "Advanced Technologies & Materials for Packaging of Power Electronic Modules," 2014 Pan Pacific Microelectronics Symposium, Kohala Coast, HI, Feb. 11-13, 2014, pp. xx-xx.

Miric, Anton Zoran, and Grusd, Angela, "Lead-free alloys." Soldering & Surface Mount Technology, vol. 10 no. 1, pp. xx-xx, 1998.

Miric, Anton-Zoran, "New Developments in High-Temperature, High-Performance Lead-Free Solder Alloys," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 559-564.

Miric, Anton-Zoran, "New Developments in High-Temperature, High-Performance Lead-Free Solder Alloys," SMTA Journal, vol. 23 no. 4, pp. 24-29, 2010.

Miric, Anton Z., "Printing and Reflow of SAC Solder Pastes," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Miric, Anton Z., "Special Process Requirements for Lead-Free Soldering," SMT/Hybrid/ Packaging 2003, Nurnberg, May 2003.

Mirkovic, D., Grobner, J., and Schmid-Fetzer, R., "Liquid demixing and microstructure formation in ternary Al-Sn-Cu alloys," Materials Science and Engineering: A, vol. 487, no. 1-2, pp. 456-467, July 25, 2008.

Mirmehdi, Sadegh, Nourani, Amir, soroosh, Farid, and Farrahi, Gholamhossein, "Fracture Behavior of Lead-Free Solder Joints under Bending as a Function of Joint Width," International Conference on Soldering & Reliability 2017 Proceedings, Toronto, Ontario, Canada, June 6-8, 2017, pp. xx-xx.

Mirmehdi, Sadegh, Farrahi, Gholam Hossein, Nourani, Amir, and Soroosh, Farid, "Predicting Crack Initiation of Solder Joints with Varying Sizes Under Bending," Journal of Electronic Materials, vol. 48 no. 5, pp. 2840-2852, May 2019.

Mirza, Fahad, Athavale, Saurabh, Vishwanathan, Krishnan, Kane, Amol, DiPietro, Mike, Cotts, Eric, Pitarresi, James, and Santos, Daryl, "Investigation of Impact Reliability of Pb-Free Solder Interconnects in Ball Grid Array Assemblies," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 397-404.

Mirza, Fahad, Parekh, Hardik, Shetty, Tejas, and Agonafer, Dereje, "Multi-Variable Multi-Objective Design Optimization of BEOL/ FBEOL Structure in a Flip Chip Package During Chip Attachment to Substrate," SMTAnews & Journal of Surface Mount Technology, vol. 27 no. 4, pp. 23-30, Oct.-Dec. 2014.

Misaki, Masahiro, Chikamatsu, Masayuki, Tanigaki, Nobutaka, Yamashita, Masafumi, Ueda, Yasukiyo, and Yase, Kiyoshi "Polymer-Supported Anisotropic Submicrometer-Patterned Electrodes for Displays," Advanced Materials, vol. 17 no. 3, pp. 297-301, Feb. 10, 2005.

Mishra, Ratikanta, Kroupa, Ales, Zemanova, Adela, and Ipser, Herbert, "Phase Equilibria in the Sn-Rich Corner of the Ni-Sb-Sn System," Journal of Electronic Materials, vol. 42 no. 4, pp. 646-653, Apr. 2013.

Mishra, Ratikanta, Zemanova, Adela, Kroupa, Ales, Flandorfer, Hans, and Ipser, Herbert, "Synthesis and characterization of Sn-rich Ni-Sb-Sn nanosolders," Journal of Alloys and Compounds, vol. 513, pp. 224-229, Feb. 5, 2012.

Mishra, Ratikant, Kroupa, Ales, Terzieff, Peter, and Ipser, Herbert, "Thermochemistry of liquid Ni-Sb-Sn alloys," Thermochimica Acta, vol. 536, pp. 68-73, May 20, 2012.

Misiuna, P. A., Dluzewski, P., Wojciechowski, T., Milinska, E., Kurowska, B., Wiater, M., Wawro, A., Wojtowicz,, T., and Baczewski, L. T., "Structural and magnetic properties of hybrid ferromagnetic metal/semiconductor (ZnTe)/Co core-shell nanowires," Journal of Crystal Growth, vol. 412, pp. 80-86, Feb. 15, 2015.

Misner, Bruce M., "Validated Solder Coverage for Tin Whisker Mitigation of 0402 Ceramic Capacitors: An Exercise in Technically Sound Cost Reduction," SMTA Journal, vol. 29 no. 3, pp. 25-29, 2016.

Misra, Soumyadeep, Yu, Linwei, Chen, Wanghua, Foldyna, Martin, and Cabarrocas, Pere Roca i, "A review on plasma-assisted VLS synthesis of silicon nanowires and radial junction solar cells," Journal of Physics D: Applied Physics, vol. 47 no. 39, pp. 393001-1-393001-21, Oct. 1, 2014.

Misri, Priyanka, and Constable, James H., "Evaluation of Anisotropic Conductive Film for a Flex to Silicon Interconnection," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 4, pp. 809-817, Dec. 2006.

Missel, L., "Functional Copper-Tin Alloy Plating," Plating & Surface Finishing , vol. 65 no. 10, pp. 36-40, Oct. 1978.

Mita, M., Miura, K., Takenaka, T., Kajihara, M., Kurokawa, N., and Sakamoto, K., "Effect of Ni on reactive diffusion between Au and Sn at solid-state temperatures," Materials Science and Engineering B: Solid-State Materials for Advanced Technology, vol. 126 no. 1, pp. 37-43, Jan. 15, 2006.

Mitani, Tsutomu, Takezawa, Hiraoki, Ishimaru, Yukihiro, Kitae, Takashi, Itagaki, Minehiro, and Bessho, Yoshihiro, "High reliability interconnection technology using conductive adhesive," Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 737-742.

Mitchell, D. R. G., and Donnelly, S. E., "A transmission electron microscopy study of the beta -> alpha-phase transformation of tin," Philosophical Magazine A, vol. 63 no. 4, pp. 747-755, Apr. 1991. https://doi.org/10.1080/01418619108213911

Mitchell, Robert L., "Toxic Legacy," Computerworld, vol. xx no. xx, pp. xx-xx, Feb. 2, 2004.

Mitlin, D., Raeder, C. H., and Messler, R. W., "Solid Solution Creep Behavior of Sn-xBi alloys," Metallurgical and Materials Transactions A, vol. 30 no. 1, pp. 115-122, Jan. 1999.

Mitooka, Yutaka, Murakami, Koji, Hino, Makoto, Takamizawa, Masao, and Takada, Jun, "Effect of Laser Irradiation on Generation and Growth of Whiskers in Tin-Electroplated Film," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 73 no. 3, pp. 226-233, Mar. 2009.

Mitooka, Yutaka, Murakami, Koji, Hino, Makoto, Takamizawa, Masao, and Takada, Jun, "Effect of Laser Irradiation on Generation and Growth of Whiskers in Tin-Electroplated Film," Materials Transactions, vol. 50 no. 9, pp. 2247-2252, 2009.

Mitrasinovic, Aleksandar, Pershin, Larry, Wen, John Z., and Mostaghimi, Javad, "Recovery of Cu and Valuable Metals from E-waste Using Thermal Plasma Treatment," JOM, vol. 63 no. 8, pp. 24-28, Aug. 2011.

Mittal, J., and Lin, K. L., "Activities during melting and reflowing behaviour of solders," Soldering & Surface Mount Technology, vol. 22 no. 1, pp. 4-10, 2010.

Mittal, J., and Lin, K. L., "Zn diffusion and reflow behaviour of Sn-9Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solders on a Ni/Cu substrate under IR reflow," Soldering & Surface Mount Technology, vol. 26 no. 2, pp. 87-95, 2014.

Mittal, Jagjiwan, and Lin, Kwang-Lung, "Atomic Flux of Cu Diffusion into Sn During Interfacial Interactions Between Cu and Sn Nanoparticles," Journal of Electronic Materials, vol. 46 no. 1, pp. 602-608, Jan. 2017.

Mittal, Jagjiwan, Kuo, Shih-Ming, Lin, Yu-Wei, and Lin, Kwang-Lung, "Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder on Ni/Cu Substrate," Journal of Electronic Materials, vol. 38 no. 12, pp. 2436-2442, Dec. 2009.

Mittal, Jagjiwan, and Lin, Kwang Lung, "Diffusion of Cu and interfacial reactions during reflow of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga alloy on Ni/Cu substrate," Journal of Materials Research, vol. 27 no. 8, pp. 1142-1148, Apr. 28, 2012.

Mittal, Jagjiwan, and Lin, Kwang-Lung, "Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate – theoretical and experimental study," Soldering & Surface Mount Technology, vol. 30 no. 3, pp. 137-144, 2018.

Miyahara, Toshio, Tanabe, Kouichi, Shimazaki, Mitsuo, Tanaka, Takuya, and Kobayashi, Takao, "New Products Developed Using Environmentally-Friendly Elastomer Rubber," Furukawa Review, no. 22, pp. 1-4, 2002.

Miyama, K., Yoshida, K., Saitou, S., and Takashima, T., "Effects of Internal Stress of Electroless Ni Plating on Solder Joining Strength," 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference, Kyoto, Japan, Apr. 14-17, 2015, pp. 800-803.

Miyamoto, Akira, Ogawa, Takeshi, and Onsawa, Tadashi, "Prediction of Mechanical Properties of Lead-free Solders Using Indentation Method," Materials Science Research International, vol. 9 no. 1, pp. 16-22, Mar. 2003.

Miyasaka, Akihiro, "Hexavalent-chromium-free Coated Steel Sheets," Yosetsu Gakkai Shi/ Journal of the Japan Welding Society, vol. 71 no. 2, pp. 12-15, Mar. 2002.

Miyasaka, Mitsutoshi, and Stoemenos, John, "Excimer laser annealing of amorphous and solid-phase-crystallized silicon films," Journal of Applied Physics, vol. 86 no. 10, pp. 5556-5565, Nov. 15, 1999.

Miyatake, Sunao, Watanabe, Hideo, Sakatsu, Tsutomu, Kadota, Yasushi, Yamashita, Masaru, and Kanehara, Ryuji, Microscopic Observation of Pb-Free Solder Joint Interface," Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 11-15, 2001, pp. 1137-1140.

Miyauchi, Hiroki, Yu, Qiang, Shibutani, Tadahiro, and Shiratori, Masaki, "A Study on Evaluation Technique for the Fatigue Life Scatter of Lead-Free Solder Joints," 2007 ASME International Mechanical Engineering Conference and Exposition, Volume 5, Seattle, WA, Nov. 11-15, 2007, pp. 325-332.

Miyauchi, Hiroki, Yu, Qiang, Shibutani, Tadahiro, and Shiratori, Masaki, "Evaluation Technique for the Failure Life Scatter of Lead-Free Solder Joints in Electronic Device," Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, Budapest, Hungary, Sept. 17-19, 2007, pp. 32-37.

Miyauchi, Kazuhiro, Yamashita, Yukihiko, Suzuki, Naoya, and Takano, Nozomu, "Self-assembly of Sn-3Ag-0.5Cu Solder in Thermoplastic Resin Containing Carboxyl Group and its Interconnection," Journal of Electronic Materials , vol. 43 no. 9, pp. 3411-3422, Sept. 2014.

Miyauchi, Yoshiko, Esaka, Hisao, and Shinozuka, Kei, "Characterization of Solidification Process in Sn-Ag Alloys Using Interrupted Tests," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 73 no. 8, pp 732-741, Aug. 2009.

Miyauchi, Yoshiko, Esaka, Hisao, Tamura, Manabu, and Shinozuka, Kei, "Characterization of Solidification Process in Sn-Cu Alloys Using an Interrupted Tests," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 72 no. 10, pp. 804-811, Oct. 2008.

Miyauchi, Yoshiko, Esaka, Hisao, Tamura, Manabu, and Shinozuka, Kei, "In-Situ Observation of Microstructure Evolutions during Solidification of Sn-Cu Alloys Using a Laser Confocal Microscope," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 72 no. 6, pp. 440-447, June 2008.

Miyazaki, Makoto, Ogata, Shigeyuki, Yoshida, Akio, Nishiyama, Yoshihiro, Tanaka, Hiroyuki, Akanuma, Masanobu, and Katayama, Naoki, "Influences of Impurities on wave soldering properties for Sn-9Zn solders," Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 12-14, 2005, pp. 561-566.

Miyazaki, Makato, Nomura, Shigeo, Takei, Toshiyasu, Katayama, Naoki, Tanaka, Hiroyuki, and Akanuma, Masanuma, "Upgrading Pb-free Soldering Technology (2) - Flow Soldering," Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 11-15, 2001, pp. 1076-1078.

Miyazaki, Makoto, Takemoto, Tadashi, Funaki, Tatsuya, and Matsunawa, Akira, "Wetting Test to Evaluate the Compatibility of Lead-Free Solders for Fine Pitch Soldering," Advances in Electronic Packaging 1997, Volume 2 , Kohala Coast, Hawaii, June 15-19, 1997, pp. 1633-1638.

Miyazaki, Takeshi, Oomiya, Masaki, Inoue, Hirotsugu, Kishimoto, Kikuo, and Amagai, Masazumi, "Evaluation of Fatigue Strength for Solder Joints after Thermal Aging," 2005 International Symposium on Electronics Materials and Packaging, Tokyo, Japan, Dec. 11-14, 2005, pp. 215-219.

Miyazaki, Toru, and Omata, Tomoya, "Electromigration degradation mechanism for Pb-free flip-chip micro solder bumps," Microelectronics Reliability, vol. 46 no. 9-11, pp. 1898-1903, Sept.-Nov. 2006.

Miyazawa, Yasuyuki, and Tadashi, Ariga, "Influences of Aging Treatment on Microstructure and Hardness of Sn-(Ag, Bi, Zn) Eutectic Solder Alloys," Materials Transactions, vol. 42 no. 5, pp. 776-782, May 2001.

Miyazawa, Yasuyuki, and Ariga, Tadashi, "Microstructural Change and Hardness of Lead Free Solder Alloys," Proceedings of the First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Feb. 1-3, 1999, pp. 616-619.

Mizuguchi, Yukiko, Murakami, Yosuke, Tomiya, Shigetaka, Asai, Tadashi, Kiga, Tomoya, and Suganuma, Katsuaki, "Effect of Crystal Orientation on Mechanically Induced Sn Whiskers on Sn-Cu Plating," Journal of Electronic Materials, vol. 41 no. 7, pp. 1859-1867, July 2012.

Mizuguchi, Yukiko, Murakami, Yosuke, Tomiya, Shigetaka, Asai, Tadashi, Kiga, Tomoya, and Suganuma, Katsuaki, "Effect of Crystal Orientation on Sn Whisker-Free Sn-Ag-Cu Plating," Materials Transactions, vol. 53 no. 12, pp. 2078-2084, 2012.

Mizuishi, Ken-ichi, Sawai, Masaaki, Todoroki, Satoru, Tsuji, Shinji, Hirao, Motohisa, and Nakamura, Michiharu, "Reliability in InGaAsP/InP buried heterostructure 1.3 æm lasers," IEEE Journal of Quantum Electronics, vol. QE-19 no. 8, pp. 1294-1301, Aug. 1983.

Mizuishi, Ken'ichi, "Some aspects of bonding-solder deterioration observed in long-lived semiconductor lasers: Solder migration and whisker growth," Journal of Applied Physics, vol.55 no.2, pp. 289-295, Jan. 15, 1984.

Mizukami, Daisuke, Matsuo, Ryuta, and Yu, Qiang, "Study on Fatigue Reliability Evaluation for Lead Free Solder Joints," 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 22-24, 2014, pp. 117-120.

Mizuno, Masuo, Saka, Masumi, and Abe, Hiroyuki, "Mechanism of Electrical Conduction Through Anisotropically Conductive Adhesive Films," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 19 no. 4, pp. 546-553, Dec. 1996.

Mo, Dan, Liu, Jie, Duan, Jinglai, Yao, Huijun, Chen, Yonghui, Sun, Youmei, and Zhai, Pengfei, "Plasmon resonance of copper nanowire arrays embedded in etched ion-track mica templates," Materials Letters, vol. 68, pp. 201-203, Feb. 1, 2012.

Mo, L., Chen, Z., Wu, F., and Liu, C., "Microstructural and mechanical analysis on Cu-Sn intermetallic micro-joints under isothermal condition," Intermetallics, vol. 66, pp. 13-21, Nov. 2015.

Mo, Liping, Wu, Fengshun, and Liu, Changqing, "Growth Kinetics of IMCs in Cu-Sn Intermetallic Joints during Isothermal Soldering Process," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1854-1858.

Mo, Liping, Zhou, Zheng, Wu, Fengshun, Liu, Shiyuan, Liu, Hui, and Liu, Changqing, "Mechanical property of Cu-Sn-Ni intermetallics in the full intermetallic micro-joints formed with transient liquid phase soldering," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1046-1050.

Mo, Liping, Wu, Fengshun, Liu, Changqing, and Xia, Weisheng, "The Size Dependency of Full IMC Solder Joint for 3D Interconnection," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 839-843.

Mo, Liping, Hu, Sicong, Zhou, Zheng, Wu, Fengshun, Liu, Shiyuan, and Liu, Hui, "Wettability and Shear Strength of SAC305 Based Composite Solder with co-doping X (Ni or Al2O3) and CNTs Reinforcements," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 1415-1420.

Mo, Zhimin, Wang, Xitao, Wang, Tiebing, Li, Shiming, Lai, Zonghe, and Liu, Johan, "Electrical Characterization of Isotropic Conductive Adhesive under Mechanical Loading," Journal of Electronic Materials, vol. 31 no. 9, pp. 916-920, Sept. 2002.

Mo, Zhimin, Lai, Zonghe, Li, Shiming, and Liu, Johan, "Thermal fatigue cracking of surface mount conductive adhesive joints," Soldering & Surface Mount Technology, vol. 16 no. 1, pp. 48-52, 2004.

Moberg, Asa, Borggren, Clara, Ambell, Christine, Finnveden, Goran, Guldbrandsson, Fredrik, Bondesson, Anna, Malmodin, Jens, and Bergmark, Pernilla, "Simplifying a life cycle assessment of a mobile phone," International Journal of Life Cycle Assessment, vol. 19 no. 5, pp. 979-993, May 2014.

Mobius, A., and Werner, C., "Lead-free Electroless Nickel by Induction Heating," AESF SUR/FIN 2004 , Chicago, IL, June 28-July 1, 2004, pp. 159-165.

Moelans, N., Blanpain, B., and Wollants, P., "Quantitative analysis of grain boundary properties in a generalized phase field model for grain growth in anisotropic systems," Physical Review B , vol. 78 no. 2, pp. 024113-1-024113-23, July 1, 2008.

Moelans, N., Kumar, K. C. Hari, and Wollants, P., "Thermodynamic optimization of the lead-free solder system Bi-In-Sn-Zn," Journal of Alloys and Compounds, vol. 360 no. 1-2, pp. 98-106, Oct. 6, 2003.

Moesveld, A. L., Th., "On fundamentally wrong methods for establishing non-existence of polymorphy," Koninklijke Akademie van Wetenschappen te Amsterdam, vol. 40 no. 2, pp. 155-164, 1937.

Moesveld, A. L. Th., "The Scientific Work of Ernst Cohen," Journal of Chemical Education , vol. 25 no. 6, pp. 308-314, 1948.

Moesveld, A. L. Th., "Uber prinzipiell fehlerhafte Verfahren zur Feststellung der Nichtexistenz von Polymorphie," Zeitschrift fur physikalische Chemie, vol. A178 no. 6, pp. 455-467, 1936.

Moghimian, Nima, Sam, Mahshid, Coelho, Jesse D., Warwick, Stephen D. W., and Bhiladvala, Rustom B., "Suppressing electroless growth allows cyanide-free electrodeposition of straight separable gold nanowires," Electrochimica Acta, vol. 114, pp. 643-648, Dec. 30, 2013.

Moh, T. S. Y., Srivastava, S. K., Milosavljevic, S., Roelse, M., Pandraud, G., Zandbergen, H. W., de Smet, L. C. P. M, van Rijn, C. J. M, Sudholter, E. J. R., Jongsma, M. A., and Sarro, P. M., "Silicon Nanowire FET Arrays for Real Time Detection of Chemical Activation of Cells," 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, Paris, France, Jan. 29-Feb. 2, 2012, pp. 1344-1347.

Mohabuth, Nusruth, and Miles, Nicholas, "The recovery of recyclable materials from Waste Electrical and Electronic Equipment (WEEE) by using vertical vibration separation," Resources, Conservation, and Recycling, vol. 45 no. 1, pp. 60-69, Sept. 2005.

Mohammad, S. Noor, "Self-catalysis: A contamination-free, substrate-free growth mechanism for single-crystal nanowire and nanotube growth by chemical vapor deposition," Journal of Chemical Physics, vol. 125, pp. 094705-1-094705-16, 2006.

Mohammadi, A., and Mahmudi, R., "Elevated-Temperature Mechanical Properties of Lead-Free Sn-0.7Cu-xSiC Nanocomposite Solders," Journal of Electronic Materials, vol. 47 no. 2, pp. 1721-1729, Feb. 2018.

Mohammadiamiri, Mostafa, Nourani, Amir, and Farrahi, Gholamhossein, "Effect of Microstructure on Fracture Load Prediction of Solder Joints," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 149-155.

Mohanty, Rita, and Shah, Vatsal, "Assembly Process Challenges for 01005 Components," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 468-475.

Mohanty, Rita, and Kirby, Ken, "Lead Free Wave Soldering at its Best," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 110-116.

Mohanty, Rita, Apell, Marc C., and Burke, Rich, "Reflow Process Control Monitoring, and Data Logging," Speedline Technologies.

Mohanty, Rita, "Surface Mount Conductive Adhesive: An Alternative to Lead-based Solder," 2002 Advanced Technology Symposium Conference Proceedings, 2002, pp. xx-xx.

Mohanty, Udit Surya, and Lin, Kwang-Lung, "Corrosion Behavior of Pb-Free Sn-1Ag-0.5Cu-XNi Solder Alloys in 3.5% NaCl Solution," Journal of Electronic Materials, vol. 42 no. 4, pp. 628-638, Apr. 2013.

Mohanty, Udit Surya, and Lin, Kwang-Lung, "Effect of Al on the electrochemical corrosion behaviour of Pb free Sn-8.5 Zn-0.5 Ag-XAl-0.5 Ga solder in 3.5% NaCl solution," Applied Surface Science, vol. 252 no. 16, pp. 5907-5916, June 15, 2006.

Mohanty, Udit Surya, and Lin, Kwang-Lung, "Electrochemical corrosion behaviour of lead-free Sn-8.5 Zn-X Ag-0.1 Al-0.5 Ga solder in 3.5% NaCl solution," Materials Science and Engineering A , vol. 406, pp. 34-42, Oct. 15, 2005.

Mohanty, Udit Surya, and Lin, Kwang-Lung, "Electrochemical corrosion behaviour of Pb-free Sn-8.5Zn-0.05Al-XGa and Sn-3Ag-0.5Cu alloys in chloride containing aqueous solution," Corrosion Science, vol. 50 no. 9, pp. 2437-2443, Sept. 2008.

Mohanty, Udit Surya, and Lin, Kwang-Lung, "Electrochemical corrosion study of Sn-XAg-0.5Cu alloys in 3.5% NaCl solution," Journal of Materials Research, vol. 22 no. 9, pp. 2573-2581, Sept. 2007.

Mohanty, Udit S., and Lin, Kwang-Lung, "The effect of alloying element gallium on the polarization characteristics of Pb-free Sn-Zn-Ag-Al-XGa solders in NaCl solution," Corrosion Science , vol. 48 no. 3, pp. 662-678, Mar. 2006.

Mohanty, Udit Surya, and Lin, Kwang-Lung, "The polarization characteristics of Pb-free Sn-8.5Zn-XAg-0.1Al-0.05Ga alloy in 3.5% NaCl solution," Corrosion Science, vol. 49 no. 7, pp. 2815-2831, July 2007.

Mohle, C., Zota, C. B., Hellenbrand, M., and Lind, E., "1/f and RTS noise in InGaAs nanowire MOSFETs," Microelectronic Engineering, vol. 178, pp. 52-55, June 25, 2017.

Mohrnheim, Anton F., "Measuring Plating Thickness and Determining Metal Content in Plating Baths by X-Ray Fluorescence," Plating, vol. 50 no. 8, pp. 725-731, Aug. 1963.

Mohseni, Parsian K., Behnam, Ashkan, Wood, Joshua D., Zhao, Xiang, Yu, Ki Jun, Wang, Ning C., Rockett, Angus, Rogers, John A., Lyding, Joseph W., Pop, Eric, and Li, Xiuling, "Monolithic III-V Nanowire Solar Cells on Graphene via Direct van der Waals Epitaxy," Advanced Materials, vol. 26 no. 22, pp. 3755-3760, June 11, 2014.

Mok, Yin-Liong, Heng, Kim-Tiang, and Loo, Fook-Meng, "Overcoming Challenges in Lead Free Soldering," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Mokhoff, Nicholas, "As lead deadline zooms, industry seeks substitute," Electronic Engineering Times, vol. xx no. xx, pp. 14, Oct. 1, 2004.

Mokhoff, Nicholas, "As lead deadline looms, industry seeks substitute," Green SupplyLine, Oct. 11, 2004.

Mokhoff, Nicholas, "As lead deadline looms, industry seeks substitute," EE Times , Oct. 11, 2004.

Mokhtar, Mohd Najib Ali, Abdullah, M. Z., Saad, Abdullah Aziz, and Cheani, Fakhrozi, "Mechanical reliability of self-aligned chip assembly after reflow soldering process," Soldering & Surface Mount Technology, vol. 33 no. 1, pp. 9-17, 2021.

Mokhtar, N. Mohd, and Salleh, M. A. A. Mohd, "Sn Whiskers Nucleation and Growth - Short Review," Solid State Phenomena, vol. 280, pp. 175-180, Aug. 2018.

Mokhtar, Noor Zaimah Mohd, Salleh, Mohd Arif Anuar Mohd, Hashim, Aimi Noorliyana, and Nazri, Sufian Firdaus, "Effects of Gallium addition on the thermal properties and whiskers growth under electrical current stressing," Materials Science and Engineering , vol. 701, pp. 012001-1-012001-7, 2019.

Mokhtar, Noor Zaimah Mohd, Salleh, Mohd Arif Anuar Mohd, and Hashim, Aimi Noorliyana, "Preliminary Study of Electrical Current Stressing on Tin Whisker Formation," Materials Science and Engineering, vol. 551, pp. 012096-1-012096-5, 2019.

Mokhtari, Omid, and Nishikawa, Hiroshi, "Coarsening of Bi phase and intermetallic layer thickness in Sn-58Bi-X (X=In and Ni) solder joint," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 250-253.

Mokhtari, Omid, Roshanghias, Ali, Ashayer, Roya, Kotadia, Hiren R., Khomamizadeh, Farzad, Kokabi, Amir H., Clode, Michael P., Miodownik, Mark, and Mannan, Samjid H., "Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders," Journal of Electronic Materials, vol. 41 no. 7, pp. 1907-1914, July 2012.

Mokhtari, Omid, Zhou, Shiqi, Chan, Y. C., and Nishikawa, Hiroshi, "Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate," Materials Transactions, JIM, vol. 57 no. 8, pp. 1272-1276, 2016.

Mokhtari, Omid, and Nishikawa, Hiroshi, "Effects of In and Ni Addition on Microstructure of Sn-58Bi Solder Joint," Journal of Electronic Materials, vol. 43 no. 11, pp. 4158-4170, Nov. 2014.

Mokhtari, Omid, and Nishikawa, Hiroshi, "Transient liquid phase bonding of Sn-Bi solder with added Cu particles," Journal of Materials Science: Materials in Electronics, vol. 27 no. 5, pp. 4232-4244, May 2016.

Mokler, Scott, Aspandiar, Raiyo, Byrd, Kevin, Chen, Olivia, Walwadkar, Satyajit, Tang, Kok Kwan, Renavikar, Mukul, and Sane, Sandeep, "The Application of Bi-Based Solders for Low Temperature Reflow to Reduce Cost While Improving SMT Yields in Client Computing Systems," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 318-326.

Molenaar, A., and de Bakker, J. W. G., "Autocatalytic Deposition of Tin," Journal of the Electrochemical Society, vol. 136 no. 2, pp. 378-382, Feb. 1989.

Molhanec, Martin, and Mach, Pavel, "The Ontology based FMEA of Lead Free Soldering Process," 32nd International Spring Seminar on Electronics Technology, Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.

Molhanec, Martin, Zhuravskaya, Olga, Povolotskaya, Evgeniya, and Tarba, Larisa, "The Ontology Based FMEA of Lead Free Soldering Process," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 267-273.

Moliere, K., and Wagner, D., "Herstellung von Einkristallen hochschmelzender Metalle durch thermische Zersetzung von Halogeniddampfen," Zeitschrift fur Elektrochemie, vol. 61 no. 1, pp. 65-69, Jan. 1957. https://doi.org/10.1002/bbpc.19570610114

Molinaro, Hope, "Non-Lead Stabilizers for Wire and Cable," Plastics Engineering, vol. 62 no. 5, pp. 6, May 2006.

Moliterni, Luca, and Padodi, Gianluca, "Metallurgy and PCB Soldering Technology," Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Portsmouth, England, Feb. 17, 2010.

Molnar, Aliz, Janovszky, Dora, Kardos, Ibolya, Molnar, Istvan, and Gacsi, Zoltan, "Effect of Ag and Pb Addition on Microstructural and Mechanical Properties of SAC 105 Solders," Journal of Electronic Materials, vol. 44 no. 10, pp. 3863-3871, Oct. 2015.

Moloznik, Bruce S., Holtzer, Mitch, Rothschild, Stan, Dixon, Doug, and Berntson, Ross, "Global impact of the accelerating cost increase of metals," Global SMT and Packaging, vol. 7 no. 5, pp. 10-11, May 2007.

Moloznik. Bruce S., Holtzer, Mitch, Rothschild, Stan, Dixon, Doug, and Berntson, Ross, "Global Impact of the Accelerating Cost Increase of Metals on the Assembly Electronics Industry," IPC Review, vol. 48 no. 4, pp. 16-17, May 2007.

Moloznik, Bruce S., Holtzer, Mitch, Rothschild, Stan, Dixon, Doug, and Berntson, Ross, "Global Impact of Rising Metals Costs," SMT Web Exclusive Article.

Mompiou, Frederic, Legros, Marc, Lartigue-Korinek, Sylvie, "Deformation mechanisms in submicron Be wires," Journal of Materials Research, vol. 32 no. 24, pp. 4616-4625, Dec. 28, 2017.

Mona, Aditya Kumar, and Chen, Zhong, "Influence of Phosphorus Content on the Interfacial Microstructure between Sn-3.5Ag Solder and Electroless Ni-P Metallization on Cu Substrate," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2 , Singapore, Dec. 7-9, 2005, pp. 503-508.

Mona, Aditya Kumar, and Chen, Zhong, "Influence of Phosphorus Content on the Interfacial Microstructure Between Sn-3.5Ag Solder and Electroless Ni-P Metallization on Cu Substrate," IEEE Transactions on Advanced Packaging, vol. 30 no. 1, pp. 68-72, Feb. 2007.

Monaca, Christine F. Della, "Indium, Motorola, Industry Work Together Toward Future of Lead-free," Surface Mount Technology (SMT), vol. 17 no. 10, pp. 4, Oct. 2003.

Monchamp, Amanda, "The Evolution of Materials Used in Personal Computers," Second OECD Workshop on Environmentally Sound Management of Wastes Destined for Recovery Operations, Vienna, Austria, Sept. 28-29, 2000, pp. xx-xx.

Monchoux, J. P., and Rabkin, E., "Microstucture evolution and interfacial properties in the Fe-Pb system," Acta Metallurgica, vol. 50, no. xx, pp. 3159-3174, 2002.

Mondal, Debabrata, Fahim, Abdullah, Suhling, Jeffrey C., and Lall, Pradeep, "Modeling Deformation Behavior of Multiple Grained SAC305 Solder Joints," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 1221-1228.

Monden, Kenji, "Creep Life Assessment of Tin Based Lead Free Solders Based on the Imaginary Initial Strain Rate," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 2, 2006, pp. 990-996.

Monden, Kenji, "Creep Life Assessment of Tin-Based Lead-Free Solders Based on Imaginary Initial Strain Rate," Journal of Electronic Materials, vol. 36 no. 12, pp. 1691-1696, Dec. 2007.

Monette, Francois, "Handling Moisture-sensitive Devices," SMT, Mar. 2001.

Monette, Francois, "Lead-Free Material Logistics," Lead-Free Connection, vol. 1 no. 2, pp. 9-10, Nov. 2004.

Monette, Francois, "Material Control for Lead-Free Manufacturing," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 178-183.

Monette, Francois, "Material Control for Lead-free Manufacturing," Surface Mount Technology (SMT), vol. 19 no. 3, pp. 32, 34, 36, 38, Mar. 2005.

Monette, Francois, "Material Control for Lead-Free Manufacturing," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Monette, Francois, "Materials Control for Lead-Free Manufacturing."

Monlevade, E. F., and Reinikainen, T., "Fracture Surface Analysis of Aged and Drop Tested Sn-Ag-Cu Solder Joints," Proceedings of the 2006 IEEE CPMT Conference on High Density Microsystem Design, Packaging and Component Failure Analysis, Shanghai, June 27-28, 2006, pp. 254-259.

Monroe, Eric M., and Pan, Rong, "Experimental Design Considerations for Accelerated Life Tests with Nonlinear Constraints and Censoring," Journal of Quality Technology, vol. 40 no. 4, pp. 355-367, Oct. 2008.

Montague, Jim, "System integration challenge: new, lead-free part numbers," Control Engineering, vol. xx no. xx, pp. xx-xx, Sept. 2, 2004.

Montemayor, Luis C., "Electrically Conductive Silicone Adhesive," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Montemayor, Luis C., "Electrically Conductive Silicone Adhesive," 2002 NEPCON West - Fiberoptic Expo Conference Proceedings, 2002, pp. 20-25.

Montesperelli, G., Rapone, M., Nanni, F., Travaglia, P., Riani, P., Marazza, R., and Gusmano, G., "Electrochemical and mechanical behaviour of Sn-2.5Ag-0.5Cu and Sn-48Bi-2Zn solders," Materials and Corrosion, vol. 59 no. 8, pp. 662-669, Aug. 2008.

Montgomery, Jeff, "AEM, Inc.," Tin Whisker Group teleconference, Apr. 24, 2013.

Monty, Greg, "IEC certification demonstrates due diligence," Green SupplyLine , June 12, 2006.

Monty, Greg, "Quality and Standards: Compliant Components," Appliance Design , vol. xx no. x, pp. xx-xx, Nov. 2006.

Mookam, Niwat, and Kanlayasiri, Kannachai, "Effect of soldering condition on formation of intermetallic phases developed between Sn-0.3Ag-0.7Cu low-silver lead-free solder and Cu substrate," Journal of Alloys and Compounds, vol. 509 no. 21, pp. 6276-6279, May 26, 2011.

Mookam, Niwat, and Kanlayasiri, Kannachai, "Effects of substrate annealing on wettability and intermetallic compound formation in Sn-3.0Cu/Cu systems," Journal of Materials Science: Materials in Electronics, vol. 30 no. 13, pp. 12087-12099, July 2019.

Mookam, Niwat, and Kanlayasiri, Kannachai, "Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging," Journal of Materials Science and Technology, vol. 28 no. 1, pp. 53-59, Jan. 2012.

Moon, Earl, "Gray-Market Electronic Parts Part 2: Serious Problems for the Customer And Distributor Concerning RoHS and Lean Manufacturing," PCB007, Feb. 24, 2006.

Moon, Joon Kwon, Zhou, Y., and Jung, Jae Pil, "Fluxless plasma bumping of lead-free solders and the reliability effects of under bump metallization thickness," Soldering & Surface Mount Technology, vol. 17 no. 2, pp. 3-9, 2005.

Moon, K., Staiculescu, D., Kim, S., Liu, Z., Chan, H., Sundaram, V., Tummala, R., and Wong, C. P., "Adhesion and RF Properties of Electrically Conductive Adhesives," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1881-1884.

Moon, K., Rockett, C., Kretz, C., Burgoyne, W. F., and Wong, C. P., "Adhesion Improvement of Thermoplastic Conductive Adhesives under Humid Environment," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1791-1799.

Moon, K.-W., and Boettinger, W. J., "Accurately Determining Eutectic Compositions: The Si-Ag-Cu Ternary Eutectic," JOM, vol. 56 no. 4, pp. 22-27, Apr. 2004.

Moon, K., Rockett, C., Kretz, C., Burgoyne, W. F., and Wong, C. P., "Adhesion Improvement of Thermoplastic Conductive Adhesives under Humid Environment," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1791-1799.

Moon, K.-W., Boettinger, W. J., Kattner, U. R., Biancaniello, F. S., and Handwerker, C. A., "Experimental and Thermodynamic Assessment of Sn-Ag-Cu Solder Alloys," Journal of Electronic Materials, vol. 29 no. 10, pp. 1122-1136, Oct. 2000.

Moon, K., Rockett, C., Kretz, C., Burgoyne, W. F., and Wong, C. P., "Improvement of adhesion and electrical properties of reworkable thermoplastic conductive adhesives," Journal of Adhesion Science and Technology , vol. 17 no. 13, pp. 1785-1799, Dec. 10, 2003.

Moon, K.-W., Johnson, C. E., Williams, M. E., Kongstein, O., Stafford, G. R. Handwerker, C. A., and Boettinger, W. J., "Observed Correlation of Sn Oxide Film to Sn Whisker Growth in Sn-Cu Electrodeposit for Pb-Free Solders," Journal of Electronic Materials , vol. 34 no. 9, pp. L31-L33, Sept. 2005.

Moon, K.-W., Williams, M. E., Johnson, C. E., Stafford, G. R., Handwerker, C. A., and Boettinger, W. J., "The Formation of Whiskers on Electroplated Tin Containing Copper," Proceedings of the Fourth Pacific Rim International Conference on Advanced Materials and Processing, Sendai, Japan, 2001, pp. 1115-1118.

Moon, K.-W., Williams, M. E., Johnson, C. E., Stafford, G. R., Handwerker, C. A., and Boettinger, W. J., "The Formation of Whiskers on Electroplated Tin Containing Copper," PCB007, Nov. 21, 2005.

Moon, K.-W., Boettinger, W. J., Kattner, U. R., Biancaniello, F. S., and Handwerker, C. A., "The Ternary Eutectic of Sn-Ag-Cu Solder Alloys," 2000 SMTA International Conference Proceedings, Chicago, IL, Sept. 24-28, 2000, pp. xx-xx.

Moon, Kil-Won, Kattner, Ursula R., and Handwerker, Carol A., "The Effect of Bi Contamination on the Solidification Behavior of Sn-Pb Solders," Journal of Electronic Materials, vol. 36 no. 6, pp. 676-681, June 2007.

Moon, Kil-Won, Boettinger, William J., Kattner, Ursula R., Handwerker, Carol A., and Lee, Doh-Jae, "The Effect of Pb Contamination on the Solidification Behavior of Sn-Bi Solders," Journal of Electronic Materials, vol. 30 no. 1, pp. 45-52, Jan. 2001.

Moon, Kil-Won, Boettinger, William J., Ma, Li, Williams, Maureen, and Morris, Dylan, "Whisker/Hillock Formation on As-electrodeposited and Indentation Stressed Sn Film," 2nd International Symposium on Tin Whiskers, Tokyo, Japan, Apr. 24-25, 2008, pp. xx-xx.

Moon, Kyoung-sik, Li, Yi, Xu, Jianwen, and Wong, C. P., "A Novel Technique for Lead-Free Soldering Process Using Variable Frequency Microwave (VFM)," 2004 9th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 24-26, 2004, pp. 118-125.

Moon, Kyoung-Sik, Rockett, Chris, and Wong, C. P., "Adhesion improvement of thermoplastic-based isotropic conductive adhesives under humid environment using self-assembled monolayer compounds," Journal of Adhesion Science and Technology, vol. 18 no. 2, pp. 153-167, Feb. 1, 2004.

Moon, Kyoung-sik, Li, Yi, and Wong, C. P., "Electrical Property of Conductive Adhesives during Temperature/Humidity Aging," 2004 9th International Symposium on Advanced Packaging Materials , Atlanta, GA, Mar. 24-26, 2004, pp. 126-131.

Moon, Kyoung-Sik, Wu, Jiali, and Wong, C. P., "Improved Stability of Contact Resistance of Low Melting Point Alloy Incorporated Isotropically Conductive Adhesives," IEEE Transactions on Components and Packaging Technologies, vol. 26 no. 2, pp. 375-381, June 2003.

Moon, Kyoung-sik, Li, Yi, Xu, Jianwen, and Wong, C. P., "Lead-Free Interconnect Technique by Using Variable Frequency Microwave," Journal of Electronic Materials, vol. 34 no. 7, pp. 1081-1088, July 2005.

Moon, Kyoung-sik, Li, Yi, Xu, Jianwen, and Wong, C. P., "Lead-free Solder Interconnect by Variable Frequency Microwave (VFM)," 54th Electronic Components & Technology Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1989-1995.

Moon, Kyoung-Sik, Liong, Silvia, li, Haiying, and Wong, C. P., "Stabilizing Contact Resistance of Isotropically Conductive Adhesives on Various Metal Surfaces by Incorporating Sacrificial Anode Materials ," Journal of Electronic Materials, vol. 33 no. 11, pp. 1381-1388, Nov. 2004.

Moon, Kyoung-sik, Wu, Jiali, and Wong, C. P., "Study on Self-Alignment Capability of Electrically Conductive Adhesives (ECAs) for Flip-Chip Application," 2001 International Symposium on Advanced Packaging Materials, Braselton, GA, Mar. 11-14, 2001, pp. 341-346.

Moon, Sungwook, and Chappell, William J., "Analysis of Failure Rate by Column Distribution in Magnetically Aligned Anisotropic Conductive Adhesive," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 5, pp. 784-791, May 2011.

Moon, Sungwook, "Effect on Radio-Frequency Characteristics of Pad-to-Pad Interconnection by Varying Vertical Interconnect Density in Magnetically-Aligned Anisotropic Conductive Adhesive," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 10, pp. 1737-1743, Oct. 2013.

Moon, Sungwook, Sigmarsson, Hjalti H., Huang, Yilei, Bruemmer, Tim, Khanna, S. Kummar, and Chappell, William J., "Magnetically Aligned Anisotropic Conductive Adhesive for Microwave Applications," IEEE Transactions on Microwave Theory and Techniques , vol. 56 no. 12 part 1, pp. 2942-2949, Dec. 2008.

Moon, Sungwook, and Chappell, William J., "Novel Self-Assembly Process Using Magnetically Aligned z-Axis Anisotropic Conductive Adhesive for High-Density Vertical Interconnection," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 5, pp. 756-763, May 2012.

Moon, Sungwook, and Chappell, William J., "Novel Three-Dimensional Packaging Approaches Using Magnetically Aligned Anisotropic Conductive Adhesive for Microwave Applications," IEEE Transactions on Microwave Theory and Techniques, vol. 58 no. 12 pt. 1, pp. 3815-3823, Dec. 2010.

Moon, Sungwook, "Reliability of Self-Assembly Vertical Interconnects in Magnetically Aligned Anisotropic Conductive Adhesive for Electronic Packaging Applications," IEEE Transactions on Device and Materials Reliability, vol. 13 no. 3, pp. 413-419, Sept. 2013.

Moore, Darren, "Study of Solder-Cu Failure Modes with Thermal Aging Stress as a Function of Plating Process Conditions," Chip Scale Review, vol. 16 no. 1, pp. 44-47, Jan./Feb. 2012.

Moore, David E., "Impact of Lead Free Solders (LFSs) on Standard Electronic Parts in the DoD Standardization Program," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.

Moore, Scott, " Hard Chrome Plating... Its Past, Present and Future," Products Finishing, vol. xx no. xx, pp. xx-xx, Dec. 8, 2002.

Moore, Stephen, "Flatscreens display domination," Modern Plastics Worldwide, vol. 83 no. 9, pp. 32,34, Sept. 2006.

Moors, Kristof, Soree, Bart, and Magnus, Wim, "Resistivity scaling in metallic thin films and nanowires due to grain boundary and surface roughness scattering," Microelectronic Engineering , vol. 167, pp. 37-41, Jan. 5, 2017.

Morabito, Joseph M., and Hartwig, C. Thomas, "Indium Gold Alloy Bonding," Proceedings of the 1976 International Microelectronics Symposium, Vancouver, B. C., Canada, Oct. 11-13, 1976, pp. 73-79.

Moran, Sean, Solberg, Vern, and Wade, Christopher P., "Micro-contact CSP," Advanced Packaging, vol. 16 no. 1, pp. 38-41, Jan./Feb. 2007.

Morando, Carina, Fornaro, Osvaldo, Garbellini, Olga, and Palacio, Hugo, "Fluidity of Sn-based eutectic solder alloys," Journal of Materials Science: Materials in Electronics, vol. 26 no. 12, pp. 9478-9483, Dec. 2015.

Morando, Carina, and Fornaro, Osvaldo, "Influence of aging on microstructure and hardness of lead-free solder alloys," Soldering & Surface Mount Technology, vol. 33 no. 1, pp. 57-64, 2021.

Morando, Carina, Fornaro, Osvaldo, Garbellini, Olga, and Palacio, Hugo, "Thermal properties of Sn-based solder alloys," Journal of Materials Science: Materials in Electronics, vol. 25 no. 8, pp. 3440-3447, Aug. 2014.

Morawska, Zofia, and Koziol, Grazyna, "Lead - Free Solderability Preservative Coatings of PCBs," Advancing Microelectronics, vol. 28 no. 3, pp. xx-xx, May/June 2001.

Morelle, Jean Michel, Tan, Ky Lim, Vivet, Laurent, Leon, Renan, Lavrentieff, Serge, and Geeds, Valeo, "Alternative lead free die attach for power module packaging," 2012 7th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany, Mar. 6-8, 2012, pp. xx-xx.

Morelock, C. R., and Sears, G. W., "Growth Mechanism of Copper Whiskers by Hydrogen Reduction of Cuprous Iodide," Journal of Chemical Physics, vol. 31 no. 4, pp. 926-928, Oct. 1959.

Morelock, C. R., and Sears, G. W., "Growth of Whiskers by Chemical Reactions," Journal of Chemical Physics , vol. 34 no. 3, pp. 1008-1009, Mar. 1961.

Morelock, C. R, "Sub-micron Whiskers by Vapor Deposition," Acta Metallurgica, vol. 10 no. 2, pp. 161-167, Feb. 1962.

Moreno, Gustavo R., Silva, Bismarck L., Bogno, Abdoul-Aziz, Henein, Hani, and Spinelli, Jose E., "Microstructure-property relations in as-atomized and as-extruded Sn-Cu (-Ag) solder alloys," Journal of Alloys and Compounds, vol. 680, pp. 259-267, Sept. 25, 2016.

Moretti, G., Guidi, F., and Tonini, R., "Alloys at Low Nickel:release: Pd-Ni Coatings on Copper," Plating & Surface Finishing, vol. 88 no. 4, pp. 70-73, Apr 2001.

Morf, Leo S., Tremp, Josef, Gloor, Rolf, Huber, Yvonne, Stengele, Markus, and Zennegg, Markus, "Brominated Flame Retardants in Waste Electrical and Electronic Equipment: Substance Flows in a Recycling Plant," Environmental Science & Technology, vol. 39 no. 22, pp. 8691-8699, 2005.

Morf, Leo S., Tremp, Josef, Gloor, Rolf, Schuppisser, Felix, Stengele, Markus, and Taverna, Ruedi, "Metals, non-metals and PCB in electrical and electronic waste - Actual levels in Switzerland," Waste Management, vol. 27 no. 10, pp. 1306-1316, 2007.

Morganelli, Paul, Shah, Jayesh, Wheelock, Brian, Mohan, Vinod, and Laffey, Matthew, "Partial Pre-Applied Underfill for Assembly and Reliability of Pb-Free CSPs," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 1, Orlando, FL, May 31-June 3, 2005, pp. 223-227.

Mori, Kenichi, Shoda, Kaoru, and Kohno, Hideo, "Core-shell SiGe whiskers with composition gradient along the axial direction: Cross-sectional analysis," Applied Physics Letters, vol. 87, pp. 083111-1-083111-3, 2005.

Mori, Masato, Miura, Kazuma, Sasaki, Takeshi, and Ohtsuka, Toshiaki, "Corrosion of tin alloys in sulfuric and nitric acids," Corrosion Science, vol. 44 no. 4, pp. 887-898, Apr. 2002.

Mori, Takao, Ejiri, Yasuhiro, Sayama, Toshihiko, Talayanagi, Takeshi, Okamoto, Yoshiyuki, and Yu, Qiang, "Influence of Temperature and Strain on Phase Growth Process in Sn-3.0Ag-0.5Cu Solder Joints," 11th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 28-31, 2008, pp. 652-659.

Morillo, Carlos, Ning, Yan, Azarian, Michael H., Silk, Julie, and Pecht, Michael, "Analysis of Laminate Material Properties for Correlation to Pad Cratering," Apex ?

Morillo, Carlos, Hay, Jennifer L., and Silk, Julie, "Mapping Mechanical Properties of Lead-Free Solder Joints," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 712-717.

Morin, Christine, Kohen, David, Tileli, Vasiliki, Faucherand, Pascal, Levis, Michel, Brioude, Arnaud, Salem, Bassem, Baron, Thierry, and Perraud, Simon, "Patterned growth of high aspect ratio silicon wire arrays at moderate temperature," Journal of Crystal Growth, vol. 321 no. 1, pp. 151-156, Apr. 15, 2011.

Morita, Masaru, Okiyama, Kouichi, Sakai, Taiji, and Imaizumi, Nobuhiro, "Formation of Solder Cap on Cu Pillar Bump using Formic Acid Reduction," 2012 IEEE 14th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 5-7, 2012, pp. 602-607.

Morita, Minoru, Kuwahara, Yutaka, and Goto, Motonobu, "Preparation and properties of siloxane polyimide films containing silver nanoparticles and microparticles as conducting adhesive films," Journal of Materials Science: Materials in Electronics, vol. 22 no. 5, pp. 531-537, May 2011.

Moriuchi, Hiroyuki, "Approach for External Stress Type Whisker Mitigation," Journal of the Surface Finishing Society of Japan, vol. 59 no. 4, pp. 218-222, 2008.

Moriuchi, Hiroyuki, Tadokoro, Yoshihiro, Sato, Masahide, Furusawa, Takeshi, and Suzuki, Noboru, "Microstructure of External Stress Whiskers and Mechanical Indentation Test Method," Journal of Electronic Materials, vol. 36 no. 3, pp. 220-225, Mar. 2007.

Moriuchi, Kiyoaki, Fujita, Taro, Nishikawa, Shinya, Shukushima, Satoshi, Hayami, Hiroshi, Keta, Kazuto, Wakamiya, Takeshi, and Yano, Tomizou, "Development of Environmentally-Friendly Electric Wires for Household and Electro-Appliances," SEI Technical Review, no. 54, pp. 80-86, June 2002.

Moriwaka, Yasushi, Takahashi, Satoru, Kohinata, Masayoshi, Uchiyama, Naoki, and Plant, Sanda, "Ultra Low Alpha Emission Lead Free Solder for Flip Chip Bumps," Proceedings 2001 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4587), Baltimore, MD, Oct. 9-11, 2001, pp. 559-564.

Moriya, Hideki, Takahashi, Katsuhiko, Sakurai, Hirofumi, Ichikawa, Masateru, and Senso, Toshimitsu, "Halogen-Free Multilayer Printed Circuit Boards," Fujikura Technical Review, no. 34, pp. 29-32, Jan. 2005.

Morkoc, H., Stamberg, R., and Krikorian, E., "Whisker Growth during Epitaxy of GaAs by Molecular Beam Epitaxy," Japanese Journal of Applied Physics, vol. 21 no. 4, pp. L230-L232, Apr. 1982.

Morose, Gregory, Shina, Sammy, Farrell, Robert, Ellenbecker, Michael, and Moure-Eraso, Rafael, "Evaluation of Lead-Free Solders, Halogen-Free Laminates, and Nanomaterial Surface Finishes for Assembly of Printed Circuit Boards for High Reliability Applications," SMTAnews & Journal of Surface Mount Technology , vol. 22 no. 4, pp. 13-21, Oct.-Dec. 2009.

Morose, Gregory, Shina, Sammy, Farrell, Bob, Bodmer, Paul, Degan, Ken, Pinsky, David, Ebner, Karen, Sarkhel, Amit, Anderson, Richard, Pasquito, Helena, Miller, Michael, Feinstein, Louis, Fragoza, Deb, Ren, Eric, Benson, Roger, and Bickford, Charlie, "Long Term Reliability Analysis of Lead Free and Halogen Free Electronic Assemblies," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Morose, Gregory, Farrell, Robert, Mazur, Scott, and Russo, Richard, "Transition to Lead Free Electronics Assembly Case Study," IPC Review , vol. 47 no. 10, pp. 8, Nov. 2006.

Morose, Gregory, Farrell, Robert, Mazur, Scott, and Russo, Richard, "Transition to Lead Free Electronics Assembly Case Study," Route , Nov. 2006.

Morose, Greg, Harriman, Liz, Shina, Sammy, Anderson, Richard, Pasquito, Helena, Wilkish, George, Bodmer, Paul, Farrell, Bob, Goulet, John, Lauzier, Philip, Brinkman, James, Longworth, Don, Boger, Wendi, Buck, Tom, Degan, Ken, Lockard, Don, Abbott, Donald, Pinsky, David, Ebner, Karen Walters, Sarkhel, Amit, Quealy, Mark, Benson, Roger, Ballas, Jack, and Lizotte, Ray, "Visual and Reliability Testing Results of Circuit Boards Assembled with Lead Free Components, Soldering Materials and Processes in a Simulated Production Environment," IPC Printed Circuits Expo, APEX and the Designer Summit , Anaheim, CA, Feb. 8-10, 2006, pp. S29-01-1-S29-01-12.

Morozov, A., Freidin, A. B., Klinkov, V. A., Semencha, A. V., Muller, W. H., and Hauck, T., "Experimental and Theoretical Studies of Cu-Sn Intermetallic Phase Growth During High-Temperature Storage of Eutectic SnAg Interconnects," Journal of Electronic Materials, vol. 49 no. 12, pp. 7194-7210, Dec. 2020.

Morozov, A., Freidin, A., Muller, W. H., Hauck, T., and Schmadlak, I., "Modeling reaction front propagation of intermetallic compounds by using isogeometric analysis," 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Toulouse, France, Apr. 15-18, 2018, pp. xx-xx.

Morozovsky , A. E., and Snarskii, A. A., "Effective properties of high anisotropic and non-linear metal/non-metal thin films," International Journal of Electronics, vol. 73 no. 5, pp. 925-927, Nov. 1992.

Morozumi, Akira, Hokazono, Hiroaki, Nishimura, Yoshitaka, Mochizuki, Eiji, and Takahashi, Yoshikazu, "Influence of Cooling Rates on Reliability of Solder Joints Using Sn-13wt.% Sb Binary Alloy for Power Semiconductor Modules," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 6 no. 8, pp. 1139-1147, Aug. 2016.

Morrell, Martin, Chilton, Neil, and Jones, Steve, "PCB Materials Technology for a Lead Free Environment - Towards a Rapid Implementation for RoHS Compliance," RoHS Compliance & LEADOUT Seminar, Dublin, Ireland, Sept. 22, 2005.

Morrell, Martin, "PCB Materials Technology for a Lead Free Environment," SMART Group "All You Ever Wanted to Know About Lead-Free" Seminar, High Wycombe, United Kingdom, Nov. 1, 2005.

Morris, Ashleigh, and Metternicht, Graciela, "Assessing effectiveness of WEEE management policy in Australia," Journal of Environmental Management, vol. 181, pp. 218-230, Oct. 1, 2016.

Morris, Ed, "AIA Lead-Free Electronics Strategy," SSTC Meeting #22, Mesa, AZ, Feb. 2, 2009, pp. xx-xx.

Morris, J. E., Niiranen, Sini, Mattila, Toni, and McCarthy, Jack, "Interpretation of ICA Mechanical Cycling Data," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging , Xi'an, China, Aug. 16-19, 2010, pp. 1162-1167.

Morris, J. E., Niiranen, Sini, and Mattila, Toni, "Mechanical Cycling of Isotropic Conductive Adhesives," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 151-155.

Morris Jr., J. W., Song, H. G., and Hua, Fay, "Creep Properties of Sn-rich Solder Joints," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 54-57.

Morris Jr., J. W., "Lead-Free Solder Issues in MIcroelectronics," 15th Workshop on Crystalline Silicon Solar Cells and Modules: Materials and Processes, Vail, CO, Aug. 7-10, 2005, pp. 129-131.

Morris Jr., J. W., Goldstein, J. L. Freer, and Mei, Z., "Microstructure and Mechanical Properties of Sn-In and Sn-Bi Solders," JOM, vol. 45 no. 7, pp. 25-27, July 1993.

Morris, James E., Lee, Jeahuck, and Liu, Johan, "An Ontology for Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications," 7th IEEE CPMT International Conference on High Density Microsystem Design, Packaging and Failure Analysis , Shanghai, June 28, 2005, pp. xx-xx.

Morris, James E., and Lee, Jeahuck, "Drop Test Performance of Isotropic Electrically Conductive Adhesives," Journal of Adhesion Science and Technology, vol. 22 no. 14, pp. 1699-1716, 2008.

Morris, James E., and Probsthain, Sebastian, "Investigation of Plasma Cleaning on the Reliability of Electrically Conductive Adhesives," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 41-45.

Morris, James E., Lee, Jeahuck, and Liu, Johan, "Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications," 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, Oct. 23-26, 2005, pp. 45-52.

Morris, James E., "Isotropic Conductive Adhesives: Future Trends, Possibilities and Risks," 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, Oct. 23-26, 2005, pp. 233-234.

Morris, James E., "Isotropic conductive adhesives: Future trends, possibilities and risks," Microelectronics Reliability, vol. 47 no. 2-3, pp. 328-330, Feb.-Mar. 2007.

Morris, James E., Anderssohn, Falk, Loos, Enrico, and Liu, Johan, "Low-Tech Studies of Isotropic Electrically Conductive Adhesives," 26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials, The High Tatras, Slovak Republic, May 8-11, 2003, pp. 90-94.

Morris, James E., Anderssohn, Falk, Kudtarkar, Santosh, and Loos, Enrico, "Reliability Studies of an Isotropic Electrically Conductive Adhesive," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, Germany, Oct. 21-24, 2001, pp. 61-69.

Morris, James E., Feng, Xuefei, Lee, Chaoli, Oakley, Elizabeth, and Youssof, Sam, "The Electrical and Mechanical Properties of Electrically Conductive Adhesives in Pin-Through-Hole Applications," Journal of Electronics Manufacturing , vol. 6 no. 3, pp. 219-230, Sept. 1996.

Morris, Jim, and Szymanowski, Richard, "Effect of Contact Time On Lead-Free Wave Soldering," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S33:03.

Morris, Jim, "Equipment Impacts of Lead Free Wave Soldering."

Morris, Jim, "Impact of lead-free wave soldering on equipment," EMasia, Nov. 2004.

Morris, Jim, O'Keefe, Matthew J., and Perez, Martin, "Liquid tin corrosion and lead free wave soldering," Global SMT and Packaging, vol. 7 no. 7, pp. 26-28, 30, 32-33, July 2007.

Morris, Jim, O'Keefe, Matthew J., and Perez, Martin, "Liquid Tin Corrosion and Lead Free Wave Soldering," Speedline Technologies.

Morris, Jim, and Szymanowski, Richard, "Overcoming challenges in lead free wave soldering," EMasia, Aug. 2008.

Morris, R. B., and Bonfield, W., "The Crystallography of Alpha-Tin Whiskers," Scripta Metallurgica , vol. 8 no. 3, pp. 231-236, Mar. 1974.

Morris, Rebecca, "Ask the EMPF Helpline!," empfasis, pp. xx-xx, Mar. 2006.

Morris, Rebecca, "Ask the EMPF Helpline!," empfasis, pp. xx-xx, Dec. 2007.

Morris, Rebecca, "Ask the EMPF Helpline!," empfasis, pp. xx-xx, May 2008.

Morris, Rebecca, "Ask the EMPF Helpline!," empfasis, pp. 2, Nov. 2008.

Morris, Rebecca, "Lead-Free Design Conversion," empfasis, pp. 1-2, Aug. 2005.

Morrison, David, "Expanded RoHS May Spell More Work for Manufacturers," Power Electronics Technology, vol. 34 no. 6, pp. 8, June 2008.

Morrison, David, "Lead-Free Solder Leads to "Greener" IC Packaging," Electronic Design, vol. 48 no, 5, pp. 30, Mar. 6, 2000.

Morrow, Hugh, "Cadmium Electroplating," Metal Finishing, vol. 103 no. 6A, pp. 159-163, Summer 2005.

Morrow, Hugh, "Cadmium Electroplating," Metal Finishing, vol. 105 no. 10, pp. 168-172, Oct. 2007.

Morten, B., Ruffi, G., Sirotti, F., Tombesi, A., Moro, L., and Akomolafe, T., "Lead-free ruthenium-based thick-film resistors: a study of model systems," Journal of Materials Science: Materials in Electronics, vol. 2 no. 1, pp. 46-53, Mar. 1991.

Mortensen, Adam W., Lee, Maria C., and Devaney, Roger M., "Characterization and Failure Analysis Techniques for Ball Grid Array Solder Joints," Global SMT and Packaging, vol. 15 no. 5, pp. 8-19. May 2015.

Morton, Kim L., Smetana, Joe, and Qin, Gordon, "The Effects of Lead Lead-Free Reflow On Conductive Anodic Filament (CAF) Performance of Materials," Tin Whisker Group Teleconference, Feb. 8, 2012.

Moscicki, Andrzej, Felba, Jan, Sobierajski, Tadeusz, and Kudzia, Jozef, "Snap-Curing Electrically Conductive Formulation for Solder Replacement Applications," Journal of Electronic Packaging, Transactions of the ASME , vol. 127 no. 2, pp. 91-95, June 2005.

Moser, Z., Gasior, W., Pstrus, J., Ohnuma, I., and Ishida, K., "Influence of Sb additions on surface tension and density of Sn-Sb, Sn-Ag-Sb and Sn-Ag-Cu-Sb alloys: Experiment vs. modeling," International Journal of Materials Research, vol. 97 no. 4, pp. 365-370, Apr. 2006.

Moser, Z., Fima, P., Bukat, K., Sitek, J., Pstrus, J., Gasior, W., Koscielski, M., and Gancarz, T., "Investigation of the effect of indium addition on wettability of Sn-Ag-Cu solders," Soldering & Surface Mount Technology, vol. 23 no. 1, pp. 22-29, 2011.

Moser, Z., Gasior, W., Bukat, K., Pstrus, J., Kisiel, R., Sitek, J., Ishida, K., and Ohnuma, I., "Pb-Free Solders: Part 1. Wettability Testing of Sn-Ag-Cu Alloys with Bi Additions," Journal of Phase Equilibria and Diffusion, vol. 27 no. 2, pp. 133-139, Apr. 2006.

Moser, Z., Gasior, W., Bukat, K., Pstrus, J., Kisiel, R., Sitek, J., Ishida, K., and Ohnuma, I., "Pb-Free Solders: Part III. Wettability Testing of Sn-Ag-Cu-Bi Alloys with Sb Additions," Journal of Phase Equilibria and Diffusion, vol. 28 no. 5, pp. 433-438, Oct. 2007.

Moser, Z., Gasior, W., Pstrus, J., Zakulsi, W., Ohnuma, I., Liu, X. J., Inohana, Y., and Ishida, K., "Studies of the Ag-In Phase Diagram and Surface Tension Measurements," Journal of Electronic Materials, vol. 30 no. 9, pp. 1120-1128, Sept. 2001.

Moser, Z., Gasior, W., and Pstrus, J., "Surface Tension Measurements of the Bi-Sn and Sn-Bi-Ag Liquid Alloys," Journal of Electronic Materials, vol. 30 no. 9, pp. 1104-1111, Sept. 2001.

Moser, Z., Gasior, W., Pstrus, J., and Ksiezarek, S., "Surface-Tension Measurements of the Eutectic Alloy (Ag-Sn 96.2 at.%) with Cu Additions," Journal of Electronic Materials, vol. 31 no. 11, pp. 1225-1229, Nov. 2002.

Moser, Z., Gasior, W., Pstrus, J., Kaban, I., and Hoyer, W., "Thermophysical Properties of Liquid In-Sn Alloys," International Journal of Thermophysics, vol. 30 no. 6, pp. 1811-1822, Dec. 2009.

Moser, Z., Gasior, W., Pstrus, J., and Debski, A., "Wettability Studies of Pb-Free Soldering Materials," International Journal of Thermophysics, vol. 29 no. 1, pp. xx-xx, Feb. 2008.

Moser, Z., Gasior, W., Pstrus, J., and Debski, A., "Wettability Studies of Pb-Free Soldering Materials," International Journal of Thermophysics, vol. 29 no. 6, pp. 1974-1986, Dec. 2008.

Moser, Zbigniew, Sebo, Pavol, Gasior, Wladyslaw, Svec, Peter, and Pstrus, Janusz, "Effect of indium on wettability of Sn-Ag-Cu solders. Experiment vs. modeling, Part I," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 33 no. 1, pp. 63-68, Mar. 2009.

Moser, Zbigniew, Gasior, Wladyslaw, Pstrus, Janusz, Ishihara, Satoru, Liu, Xing Jun, Ohnuma, Ikuo, Kainuma, Ryosuke, and Ishida, Kiyohito, "Surface Tension and Density Measurements of Sn-Ag-Sb Liquid Alloys and Phase Diagram Calculations of the Sn-Ag-Sb ternary system," Materials Transactions, vol. 45 no. 3, pp. 652-660, Mar. 2004.

Moshrefi-Torbati, M., and Swingler, J., "Reliability of printed circuit boards containing lead-free solder in aggressive environments," Journal of Materials Science: Materials in Electronics, vol. 22 no. 4, pp. 400-411, Apr. 2011.

Moskaltsova, Anastasiia, Proenca, Mariana P., Sousa, Celia T., Apolinario, Arlete, Ventura, Joao, Kakazei, Gleb N., and Araujo, Joao P., "Influence of the Electrodeposition Cathodic Potential on the Composition and Magnetic Properties of CoNi Nanowires," Solid State Phenomena, vol. 214, pp. 32-39, Feb. 2014.

Moskowitz, Michael, "Zi-Ni Alloy Selective (Brush) Plating for Spot Repairs," Proceedings of The International Technical Conference of AESF SUR/FIN, Anaheim, CA, June 21-24, 1993, pp. 1175-1179.

Moslehi, Bijan, "Pushing toward Green Manufacturing," MICRO, vol. 23 no. 2, pp. 105-106, Mar. 2005.

Mosser, Mark F., and Eddinger, Kevin B., "Environmentally Compliant Coatings for Turbine Compressor Applications," 31st Aerospace/Airline Plating & Metal Finishing Forum, 1995, pp. 47-52.

Mossholder, Nelson, "Recycling Lead-free Solder Residues," Lead-Free Connection, vol. 2 no. 1, pp. 10-11, Jan. 2005.

Most, Rainer, "Electronic Adhesives New Solutions for Short Cycled Manufacturing Process," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, Germany, Oct. 21-24, 2001, pp. 242-249

Mostofizadeh, M., and Frisk, L., "Corrosion behavior of Sn-Zn-Bi and Sn-Pb-Ag solders in a salt spray test," 2014 Electronics System-Integration Technology Conference, Helsinki, Finland, Sept. 16-18, 2014, pp. xx-xx.

Mostofizadeh, M., Najari, M., Frisk, L., Das, D., and Pecht, M., "Effect of Epoxy Flux Underfill on Thermal Cycling Reliability of Sn-8Zn-3Bi Lead-Free Solder in a Sensor Application," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 2169-2175.

Mostofizadeh, M., Pippola, J., Marttila, T., and Frisk, L., "Effect of Isothermal Aging and Salt Spray Tests on Reliability and Mechanical Strength of Eutectic Sn-Bi Lead-Free Solder Joints," 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Lisbon, Portugal, Apr. 16-18, 2012, pp. xx-xx.

Mostofizadeh,, M., Pippola,, J., and Frisk, L., "Reliability and Microstructural Evolution of Sn-Bi-Ag Solder Paste during Salt Spray Test," CARTS International 2012, Las Vegas, NV, Mar. 26-27, 2012, pp. xx-xx.

Mostofizadeh, M., Kokko, K., and Frisk, L., "Reliability and Microstructural Studies of Sn-Ag-Cu Lead-Free Solder Joints in Pulse-Heated Reflow Soldering," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 2163-2170.

Mostofizadeh, M., Pippola, J., and Frisk, L., "Reliability and Shear Strength of 42Sn-57Bi-1Ag (Wt.%) Lead-Free Solder Joints after Thermal Aging and Salt Spray Testing," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 1010-1017.

Mostofizadeh, M., Das, D., Pecht, M., and Frisk, L., "Thermal Cycling Reliability of Sn-Zn Lead-free Solders in Sensor Application," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1240-1246.

Mostofizadeh, Milad, Parviainen, Anniina, and Frisk, Laura, "Behavior of Humidity Sensors Attached With Anisotropic Electrically Conductive Adhesives in Corrosive Environment," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 5 no. 5, pp. 592-598, May 2015.

Mostofizadeh, Milad, Pippola, Juha, Marttila, Tuomas, and Frisk, Laura Katriina, "Effect of Thermal Aging and Salt Spray Testing on Reliability and Mechanical Strength of Sn-58Bi Lead-Free Solder," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 10, pp. 1778-1885, Oct. 2013.

Mostofizadeh, Milad, Pippola, Juha, and Frisk, Laura, "Shear Strength of Eutectic Sn-Bi Lead-Free Solders After Corrosion Testing and Thermal Aging," Journal of Electronic Materials, vol. 43 no. 5, pp. 1335-1346, May 2014.

Mostoller, Mark, "The Scaling of the Phonon Frequencies in the Diamond-Type Crystals," Journal of Physics and Chemistry of Solids, vol. 31 no. 2, pp. 307-313, Feb. 1970.

Motalab, Mohammad, Basit, Munshi, Suhling, Jeffrey C., and Lall, Pradeep, "A Revised Anand Constitutive Model for Lead Free Solder That Includes Aging Effects," Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 1, Burlingame, CA, July 16-18, 2013, pp. V001T05A009-1-V001T05A009-20.

Motalab, Mohammad, Mustafa, Muhannad, Suhling, Jeffrey C., Zhang, Jiawei, Evans, John, Bozack, Michael J., and Lall, Pradeep, "Correlation of Reliability Models Including Aging Effects with Thermal Cycling Reliability Data," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 986-1004.

Motalab, Mohammad, Basit, Munshi, Suhling, Jeffrey C., Bozack, Michael J., and Lall, Pradeep, "Creep Test Method for Determination of Anand Parameters for Lead Free Solders and their Variation with Aging," 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 27-30, 2014, pp. 127-141.

Motalab, Mohammad, Cai, Zijie, Suhling, Jeffrey C., and Lall, Pradeep, "Determination of Anand constants for SAC Solders using Stress-Strain or Creep Data," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 910-922.

Motalab, Mohammad, Mustafa, Muhannad, Suhling, Jeffrey C., and Lall, Pradeep, "Improved Predictions of Cyclic Stress-Strain Curves for Lead Free Solders using the Anand Viscoplastic Constitutive Model," 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 31-June 3, 2016, pp. 471-480.

Motalab, Mohammad, Cai, Zijie, Suhling, Jeffrey C., Zhang, Jiawei, Evans, John L., Bozack, Michael J., and Lall, Pradeep, "Improved Predictions of Lead Free Solder Joint Reliability that Include Aging Effects," 2012 IEEE 62nd Electronic Components and Technology Conference , San Diego, CA, May 29-June 1, 2012, pp. 513-531.

Motalab, Mohammad, Mustafa, Muhannad, Suhling, Jeffrey C., Zhang, Jiawei, Evans, John, Bozack, Michael J., and Lall, Pradeep, "Thermal Cycling Reliability Predictions for PBGA Assemblies That Include Aging Effects," Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 1, Burlingame, CA, July 16-18, 2013, pp. V001T05A008-1-V001T05A008-20.

Motohisa, J., Noborisaka, J., Takeda, J., Inari, M., and Fukui, T., "Catalyst-free selective-area MOVPE of semiconductor nanowires on (111)B oriented substrates," Journal of Crystal Growth, vol. 272 no. 1-4, pp. 180-185, Dec. 10, 2004.

Motojima, K., Asano, T., Shinmei, W., and Kajihara, M., "Kinetics of Solid-State Reactive Diffusion in the (Ni-Cr)/Sn System." Journal of Electronic Materials, vol. 41 no. 12, pp. 3292-3302, Dec. 2012.

Motoki, Kazuyuki, Oyama, Masaki, Imai, Takayuki, Ishii, Takahiro, Kimata, Masayuki, Horita, Hiroaki, Sasaki, Nobuyuki, Kobayashi, Ikuo, Yokoyama, Tomonari, Ono, Akinobu, Kodate, Satoshi, Suzuki, Shoji, Ono, Yasushi, Kurosawa, Masaru, Yoshinuma, Kuni, and Goto, Hideo, "Connecting Technology of Anisotropic Conductive Materials," Fujikura Technical Review, no. 31, pp. 26-35, Jan. 2002.

Mouas, M., Gasser, J.-G., Hellal, S., and Grosdidier, B., "Static structure and dynamic properties in liquid Sn96.2 Ag3.8 lead free solder: Structure factor, diffusion coefficients and viscosity," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 44, pp. 102-107, Mar. 2014.

Moura, Itamazeo T. L., Silva, Celina L. M., Cheung, Noe, Goulart, Pedro R., Garcia, Amauri, and Spinelli, Jose E., "Cellular to dendritic transition during transient solidification of a eutectic Sn-0.7 wt%Cu solder alloy," Materials Chemistry and Physics , vol. 132 no. 1, pp. 203-209, Jan. 16, 2012.

Moutarlier, V., Neveu, B., and Gigandet, M. P., "Evolution of corrosion protection for sol-gel coatings doped with inorganic inhibitors," Surface and Coatings Technology, vol. 202 no. 10, pp. 2052-2058, Feb. 15, 2008.

Moutarlier, V., Gigandet, M. P., Pagetti, J., and Ricq, L., "Molybdate/sulfuric acid anodising of 2024-aluminium alloy: influence of inhibitor concentration on film growth and on corrosion resistance," Surface and Coatings Technology, vol. 173 no. 1, pp. 87-95, Aug 1, 2003.

Movshovitz, D., and Wiser, N., "Electrical resistivity of thin wires at low temperatures: strained whiskers of copper," Journal of Physics: Condensed Matter, vol. 3 no. 33, pp. 6403-6413, Aug. 19, 1991.

Movshovitz, D., and Wiser, N., "Sample dependence of the electron-electron scattering resistivity of copper whiskers," Journal of Physics: Condensed Matter, vol. 4 no. 8, pp. 2027-2033, Feb. 24, 1992.

Moy, W. H., and Shen, Y.-L., "On the failure path in shear-tested solder joints," Microelectronics Reliability, vol. 47 no. 8, pp. 1300-1305, Aug. 2007.

Moyer, Thomas, and Toran, Jeff, "Cooperation Leads to RoHS Compliance," Surface Mount Technology (SMT), vol. 19 no. 12, pp. 40, Dec. 2005.

Moyer, Thomas D., "Designed Experiment to Determine the Reliability of Various Commercial Plating Baths and the Key Factors Affecting Whisker Formation," FCI.

Mozdzen, Grazyna, Jogl, Christian, and Schorn, Leopold, "Study on Tin Whiskers: Microstructure, Formation and Thickness of Tin Oxide," 3rd Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Genova, Italy, Mar. 21, 2012.

Msolli, S., Alexis, J., Dalverny, O., and Karama, M., "Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applications," Microelectronics Reliability, vol. 55 no. 1, pp. 164-171, Jan. 2015.

Msolli, Sabeur, Dalverny, Olivier, Alexis, Joel, and Karama, Moussa, "Mechanical Characterization of an Au-Ge Solder Alloy for High Temperature Electronic Devices," 2010 6th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany, Mar. 16-18, 2010, pp. xx-xx.

Mu, D., Huang, H., and Nogita, K., "Anisotropic Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5," Materials Letters, vol. 86 no. x. pp. 46-49, 2012.

Mu, Daobin, Kondo, Kazuo, and Maeda, Junpei, "Development of Cu-Core Pb-Free Solder Bumps," Journal of the Electrochemical Society, vol. 152 no. 1, pp. G68-GG72, 2005.

Mu, Dekui, Huang, Han, McDonald, Stuart D., and Nogita, Kazuhiro, "Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures." Journal of Electronic Materials, vol. 42 no. 2, pp. 304-311, Feb. 2013.

Mu, Dekui, Tsukamoto, Hideaki, Huang, Han, and Nogita, Kazuhiro, "Formation and Mechanical Properties of Intermetallic Compounds in Sn-Cu High-temperature Lead-free Solder Joints," Materials Science Forum , vol. 654-656, pp. 2450-2454, 2010.

Mu, Dekui, Yasuda, Hideyuki, Huang, Han, and Nogita, Kazuhiro, "Growth orientations and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu," Journal of Alloys and Compounds, vol. 536, pp. 38-46, Sept. 25, 2012.

Mu, Dekui, Read, Jonathan, Yang, Yafeng, and Nogita, Kazuhiro, "Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5," Journal of Materials Research, vol. 26 no. 20, pp. 2660-2664, Oct. 28, 2011.

Mu, Wenkai, Zhou, Wei, Li, Baoling, and Wu, Ping, "Abnormal accumulation and rotation of Sn in Cu-cored Sn solder joints under current stressing," Materials Chemistry and Physics, vol. 136 no. 2-3, pp. 985-989, Oct. 15, 2012.

Mu, Wenkai, Zhou, Wei, and Wu, Ping, "Electromigration behavior of Cu-core/Sn-shell solder joints," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 313-317.

Mucha. Sue, "Are You Ready To Implement Lead-Free Assembly Processes?," Circuits Assembly, vol. 10 no. 6, pp. S2, June 1999.

Mucha, Susan, "EMS Challenges in an RoHS World," Circuits Assembly, vol. 18 no. 3, pp. 16-17, Mar. 2007.

Mucha, Susan, "RoHS isn't Everyone's Cup of Tea," Electronics Manufacture and Test , vol. xx no. xx, pp. xx-xx, Nov. 19, 2007.

Muehlbauer, Andreas, Schweigart, Helmut, Tosun, Umut, and Strixner, Stefan, "Are Lead-free Assemblies Especially Endangered by Climatic Safety?," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S33-3-1-S33-3-9.

Mueller, J., Griese, H., Hageluken, M., Middendorf, A., and Reichl, H., "X-Free Mobile Electronics - Strategy for Sustainable Development," 2003 IEEE International Symposium on Electronics and the Environment, Boston, MA, May 19-22, 2003, pp. 13-18.

Mueller, Jutta, Griese, Hansjoerg, Schischke, Karsten, and Stobbe, Lutz, "Transition to Lead Free Soldering - A Great Change for a Better Understanding of Materials and Processes and Green Electronics," Proceedings of 2005 International Conference on Asian Green Electronics, Shang Hai, China, Mar. 15-18, 2005, pp. 33-36.

Mueller, M., Wiese, S., Roellig, M., and Wolter, K.-J., "Effect of Composition and Cooling Rate on the Microstructure of SnAgCu-Solder Joints," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1579-1588.

Mueller, Maik, Turke, Alexander, and Panchenko, Iuliana, "DSC Investigation of the Undercooling of SnAgCu Solder Alloys," 2016 39th International Spring Seminar on Electronics Technology, Pilsen, Czech Republic, May 18-22, 2016, pp. 53-57.

Mueller, Maik, Wiese, Steffen, and Wolter, Klaus-Juergen, "Effects of Composition and Volume on the Microstructure of SnAgCu Solder Balls," 2nd Electronics Systemintegration Technology Conference , Greenwich, London, UK, Sept. 1-4, 2008, pp. 749-756.

Mueller, Maik, Panchenko, Iuliana, Wiese, Steffen, and Wolter, Klaus-Jurgen, "Morphologies of Primary Cu6Sn5 and Ag3Sn Intermetallics in Sn-Ag-Cu Solder Balls," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 10 no. 1, pp. 18-29, Jan. 2020.

Mueller, Maik, Panchenko, Iuliana, Wiese, Steffen, and Wolter, Klaus-Jurgen, "Morphology Variations of Primary Cu6Sn5 Intermetallics in Lead-Free Solder Balls," 2018 7th Electronic System-Integration Technology Conference , Dresden, Germany, Sept. 18-21, 2018, pp. xx-xx.

Mueller, Maik, Wiese, Steffen, Roellig, Mike, and Wolter, Klaus-Juergen, "The Dependence of Composition, Cooling Rate and Size on the Solidification Behaviour of SnAgCu Solders," Proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, London, England, Apr. 15-18, 2007, pp. xx-xx.

Mueller, Maik, Wiese, Steffen, and Wolter, Klaus-Juergen, "The Twinning Phenomenon in SnAgCu Solder Balls," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1027-1036.

Mueller, Michael, "No Resist Can Mask Those Halogens," Printed Circuit Fabrication, vol. 23 no. 10, pp. 72,74, Oct. 2000.

Muhammad, R., Wahab, Y., Ibrahim, Z., Othaman, Z., Sakrani, S., and Ahamad, R., "The Effect of V/III Ratio on the Crystal Structure of Gallium Arsenide Nanowires," Advanced Materials Research, vol. 895, pp. 539-546, Feb. 2014.

Mukadam, Muffadal, Meilunas, Michael, Borgesen, Peter, and Srihari, Hari, "Assembly and Reliability Issues Associated with Leadless Chip Scale Packages," Universal Instruments, Jan. 3, 2005.

Mukadam, Muffadal, Armendariz, Norman, Aspandiar, Raiyo, Witkowski, Mike, Alvarez, Victor, Tong, Andrew, Phillips, Betty, and Long, Gary, "Planar Microvoiding in Lead-Free Second-Level Interconnect Solder Joints," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 393-405.

Mukadam, Muffadal, Meilunas, Michael, and Srihari, K., "Study of Alternate Surface Finishes for Quad Flat Packs," Proceedings of IMECE'03, Washington, D. C., Nov. 16-21, 2003.

Mukherjee, Arun B., Zevenhoven, Ron, Brodersen, Jens, Hylander, Lars D., and Bhattacharya, Prosun, "Mercury in waste in the European Union: sources, disposal methods and risks," Resources, Conservation, and Recycling, vol. 42 no. 2, pp. 155-182, Sept. 2004.

Mukherjee, S., Dasgupta, A., Silk, J., and Ong, L. L., "Effect of Gold and Copper on Microstructural Evolution and Mechanical Durability of SAC305 Solder Joints," 2014 International Conference on Electronics Packaging, Toyoma, Japan, Apr. 23-25, 2014, pp. 162-167.

Mukherjee, S., Chauhan, P., Osterman, M., Dasgupta, A., and Pecht, M., "Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints," Journal of Electronic Materials , vol. 45 no. 7, pp. 3712-3725, July 2016.

Mukherjee, S., Zhou, B., Dasgupta, A., and Bieler, T. R., "Multiscale Modeling of the Anisotropic Transient Creep Response of Heterogeneous SAC Single Crystal," 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Budapest, Hungary, Apr. 19-22, 2015, pp. xx-xx.

Mukherjee, Shantanu, Castro, Manuel, Tsai, Pei-Fang Jennifer, Srihari, Krishnaswami, and Nguyen, Van D., "Pb-Free Wave Soldering of Thick Printed Circuit Boards Using No-Clean VOC Free Flux," 2007 ASME International Mechanical Engineering Conference and Exposition, Volume 5, Seattle, WA, Nov. 11-15, 2007, pp. 143-147.

Mukherjee, Subhasis, Nuhi, Mohammed, Dasgupta, Abhijit, and Modarres, Mohammad, "Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies," Journal of Electronic Packaging, vol. 138 no. 3, pp. 030801-1-030801-13, Sept. 2016.

Mukherjee, Subhasis, Mattila, Toni T., and Dasgupta, Abhijit, "Effect of Addition of Manganese and Antimony on Viscoplastic Properties and Cyclic Mechanical Durability of Low Silver Sn-Ag-Cu Solder," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 888-895.

Mukherjee, Subhasis, Ong, Lay-Ling, Silk, Julie, and Dasgupta, Abhijit, "Effect of Gold and Copper on AuSn4 Deposition and Isothermal Durability of SAC305 Solder Joints," Conference Proceedings of SMTA International , Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 365-372.

Mukherjee, Subhasis, Morillo, Carlos, Ong, Lay-Ling, Silk, Julie, and Dasgupta, Abhijit, "Effect of Gold and Copper on AuSn4 Deposition and Isothermal Durability of SAC305 Solder Joints," SMTA Journal, vol. 29 no. 1, pp. 20-30, 2016.

Mukherjee, Subhasis, and Dasgupta, Abhijit, "Multiscale Creep Modeling of the Effect of Micro-alloying Manganese into SAC105 Solder," 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Wroclaw, Poland, Apr. 14-17, 2013, pp. xx-xx.

Mukherjee, Subhasis, Dasgupta, Abhijit, Zhou, Bite, and Bieler, Thomas R., "Multiscale Modeling of the Effect of Micro-alloying Mn and Sb on the Viscoplastic Response of SAC105 Solder," Journal of Electronic Materials , vol. 43 no. 4, pp. 1119-1130, Apr. 2014.

Mukhtar, Aiman, Mehmood, Tahir, Khan, Babar Shahzad, and Tan, Ming, "Effect of Co2+ concentration on the crystal structure of electrodeposited Co nanowires," Journal of Crystal Growth, vol. 441, pp. 26-32, May 1, 2016.

Muktepavela, F., Vasylyev, M., Czerwinski, A., and Rogulski, Z., "Investigation of hydrogen embrittlement of Sn-Al alloy during contact with water vapour," Journal of Solid State Electrochemistry, vol. 7 no. 2, pp. 83-86, Feb. 2003.

Muktepavela, Faina, and Maniks, Janis, "Structure Evolution and Diffusion During Interphase Boundary Sliding in Binary Eutectics Based on Sn," Interface Science, vol. 10 no. 1, pp. 21-26, Apr. 2002.

Mullane, Emma, Kennedy, Tadhg, Geaney, Hugh, Dickinson, Calum, and Ryan, Kevin M., "Synthesis of Tin Catalyzed Silicon and Germanium Nanowires in a Solvent-Vapor System and Optimization of the Seed/Nanowire Interface for Dual Lithium Cycling," Chemistry of Materials, vol. 25 no. 9, pp. 1816-1822, May 14, 2013.

Muller, Axel, Reichelt, Jann, and Rzepka, Sven, "Assessment of Lead-free Modules Under Forced Mechanical Vibrations by Linear Dynamic Finite Element Methods: Modeling, Result Evaluation and Calibration by Experiments," 1st Electronics Systemintegration Technology Conference, Volume 2, Dresden, Germany, Sept. 5-7, 2006, pp. 1393-1400.

Muller, C., Sarret, M., and Benballa, M., "Some peculiarities in the codeposition of zinc-nickel alloys," Electrochimica Acta, vol. 46 no. 18, pp. 2811-2817, May 21, 2001.

Muller, Carola J., Bushlya, Volodymyr, Ghasemi, Masoomeh, Lidin, Sven, Valldor, Martin, and Wang, Fei, "Ternary intermetallic compounds in Au-Sn soldering systems- structure and properties," Journal of Materials Science, vol. 50 no. 23, pp. 7808-7820, Dec. 2015.

Muller, Erwin W., "Observation of Paired Screw Dislocations in Iron Whiskers," Journal of Applied Physics, vol. 30, pp. 1843-1844, 1959.

Muller, Jutta, Griese, Hansjurg, Hageluken, Marcel, and Reichl, Herbert, "Environmental Risks of Mass Produced, Small and Cheap Products Regarding End-of-Life Scenarios," Proceedings of EcoDesign2003: Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 8-11, 2003, pp. 676-681.

Muller, Jutta, Griese, Hansjorg, and Reichl, Herbert, "Reduced Environmental Impacts by Lead Free Electronic Assemblies ?," IPC Works '99, Minneapolis, MN, Oct. 23-28, 1999, pp. xx-xx.

Muller, Maik, Wiese, Steffen, and Wolter, Klaus-Jurgen, "Influence of Cooling Rate and Composition on the Solidification of SnAgCu Solders," 1st Electronics Systemintegration Technology Conference, Volume 2, Dresden, Germany, Sept. 5-7, 2006, pp. 1303-1311.

Muller, Maik, Wiese, Steffen, and Wolter, Klaus-Jurgen, "Solidification Behavior of Lead-Free SnAgCu Alloys," 29th International Spring Seminar on Electronics Technology, St. Marienthal, Germany, May 10-14, 2006, pp. 32-37.

Muller, W. H., Worrack, H., Sterthaus, J., Wilden, J., and Villain, J., "Determination of Mechanical Material Properties of Joining Materials, in particular Microelectronic Solders," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 575-581.

Muller, W. H., Worrack, H., Sterthaus, J., Villain, J., Wilden, J., and Juritza, A., "How to extract continuum materials properties for (lead-free) solders from tensile tests and nanoindentation experiments," Microsystem Technologies , vol. 15 no. 1, pp. 45-55, Jan. 2009.

Muller, Wolfgang H., Weinberg, Kerstin, and Bohme, Thomas, "A Higher Gradient Theory of Multiphase Solid Mixtures and its Application to Lead-Free Solder Micro-Morphology," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 152-160.

Muller, Wolfgang H., Hannach, Taoufiq, and Albrecht, Hans-Jurgen, "An FE-Investigation of the State of Stress and Fracture Mechanics Properties of Intermetallic Compounds," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 575-582.

Muller, Wolfgang H., and Bohme, Thomas, "Coarsening Processes in the Lead-free Solder Alloy AgCu: Theoretical and Experimental Investigations," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2, Singapore, Dec. 7-9, 2005, pp. 613-617.

Muller, Wolfgang H., and Worrack, Holger, "Experimental Studies of the Temperature Dependence of Mechanical Solder Material Properties Using Nanoindentation," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 64-69.

Muller, Wolfgang H., Hannach, Taoufiq, and Albrecht, H.-J., "FE-Investigation of the Stress/Strain and Fracture Mechanics Properties of Intermetallic Phase Regions in Leadfree Solder Interconnects," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 114-120.

Muller, Wolfgang H., and Bohme, Thomas, "Quantitative Description of Micro-Structural Changes in lead-free Solder Alloys," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 390-397.

Muller, Wolfgang H., and Hauck, Torsten, "Simple Methods for the Durability Assessment of Microelectronic Solders," Mechanics of Advanced Materials and Structures, vol. 15 no. 6-7, pp. 485-498, Aug. 2008.

Muller, Wolfgang H., "The Importance of Residual Stresses in Microelectronic Products and Materials," Materials Science Forum, vol. 524-525, pp. 1-10, Sept. 2006.

Muller, Wolfgang H., Worrack, Holger, and Sbeiti, Mohamad, "The Influence of Creep Effects on the Determination of Local Material Parameters," 2010 12th Electronics Packaging Technology Conference , Singapore, Dec. 8-10, 2010, pp. 292-297.

Mundlein, M., Nicolics, J., Gehberger, E., and Hainzl, H., "Conductive adhesive - an alternative to solder in SMT," 24th International Spring Seminar on Electronics Technology: Concurrent Engineering in Electronic Packaging, Calimanesti-Caciulata, Romania, May 5-9, 2001, pp. 20-25.

Mundlein, M., and Nicolics, J., "Electrical Resistance Modeling of Isotropically Conductive Adhesive Joints," 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, Vienna, Austria, May 19-20, 2005, pp. 144-149.

Mundlein, Martin, and Nicolics, Johann, "Modeling of particle arrangement in an isotropically conductive adhesive joint," 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, Portland, OR, Sept. 12-15, 2004, pp. 251-256.

Mundlein, Martin, and Nicolics, Johann, "Modeling of Particle Arrangement in an Isotropically Conductive Adhesive Joint," IEEE Transactions on Components and Packaging Technologies , vol. 28 no. 4, pp. 765-770, Dec. 2005.

Mundlein, Martin, Hanreich, Gernot, and Nicolics, Johann, "Simulation of the Aging Behavior of Isotropic Conductive Adhesives," 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Zalaegerszeg, Hungary, June 23-26, 2002, pp. 68-72.

Munie, G. C., Turbibi, L., Bernier, D., Gamalski, J., and Bergman, D. W., "Environmental Issues in Electronics Assembly," 1999 SMTA International Conference Proceedings, San Jose, CA, Sept. 12-16, 1999, pp. xx-xx.

Muniesa, J., "The Growth of Whiskers on Ag Surfaces," Proceedings of International Conference on Electrical Contact Phenomena, West Berlin, Germany, June 7-11, 1982, pp. 56-59.

Muniyandi, Shantha Kumari, Sohaili, Johan, and Hassan, Azman, "Mechanical, thermal, morphological and leaching properties of nonmetallic printed circuit board waste in recycled HDPE composites," Journal of Cleaner Production, vol. xx, pp. xx-xx, xxxx.

Munoz, Ivan, Gazulla, Cristina, Bala, Alba, Puig, Rita, and Fullana, Pere, "LCA and ecodesign in the toy industry: case study of a teddy bear incorporating electric and electronic components," International Journal of Life Cycle Assessment, vol. 14 no. 1, pp. 64-72, Jan. 2009.

Munroe, Chris, "Beating the RoHS Heat," Circuits Assembly, vol. 19. no. 3, pp. 38,40,42,44,47, Mar. 2008.

Munroe, Chris, "The Advantages of Vapor Phase Processing in RoHS-Compliant Assembly," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 364-367.

Munroe, Chris, "Vapor Phase vs. Convection Reflow in RoHS-Compliant Assembly," SMTA International Wafer-Level Packaging Conference, San Jose, CA, Oct. 13-16, 2008, pp. xx-xx.

Munshi, Abdul Mazid, Dheeraj, Dasa L., Todorovic, Jelena, van Helvoort, Antonius T. J., Weman, Helge, and Fimland, Bjorn-Ove, "Crystal phase engineering in self-catalyzed GaAs and GaAs/GaAsSb nanowires grown on Si(111)," Journal of Crystal Growth, vol. 372, pp. 163-169, June 1, 2013.

Munson, Terry, "Controlling Localized Contamination on Microelectronic Assemblies with the Change to Lead Free Assembly," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Munson, Terry, "Flip-Chip BGA Fluid Entrapment and Mask Porosity Problems," Tin Whisker Group teleconference, Oct. 13, 2010.

Munson, Terry, "Is Creep Corrosion Cleanable?," Circuits Assembly, vol. 20 no. 11, pp. 39, Nov. 2009.

Munson, Terry, "Lidded FCBGA Fluid Entrapment and Mask Porosity," Tin Whisker Group teleconference, Oct. 6, 2010.

Munson, Terry, "Metal Whiskers," Foresite, Feb. 28, 2007.

Munson, Terry, and Solis, Paco, ""Metal Whiskers" Does Surface Contamination Have an Effect of Whisker Formation?," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Munson, Terry, "No Silver Lining," Circuits Assembly, vol. 17 no. 3, pp. 60, Mar. 2006.

Munson, Terry, "SAC Whiskers?," Circuits Assembly, vol. 18 no. 6, pp. 58, June 2007.

Munson, Terry, "The Reliability Impact of Localized Brush/Solvent Cleaning on Leaded/ Lead-Free Assemblies," IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics, Raleigh, NC, Mar. 11-12, 2008, pp. xx-xx.

Munson, Terry, "Tin Whiskering on PCBA Capacitors in Storage (Inside ESD Bag, Inside a Sealed Cardboard Box)," Foresite.

Munyan, Russ, "RoHS: To comply or not to comply," Electronic Products, vol. 51 no. 1, pp. 67-68, June 2008.

Munz, Volker, and Kruppa, Werner, "Lead-free - what to do? About the useful life of soldering tips," Dataweek, vol. xx no. xx, pp. xx-xx, Oct. 4, 2006.

Muonio, Joshua, and Stadem, Richard, "Solder Ball Attachment Using Laser Soldering," Circuits Assembly , vol. 19 no. 10, pp. 28-31, Oct. 2008.

Murad, Nadhrah, Aisha, SitiRabiatull, and Muhammad, Mahadzir Ishak, "Effects of sintering temperatures on microstructures and mechanical properties of Sn4.0Ag0.5Cu1.0Ni solder alloy," 2016 IEEE 37th International Electronics Manufacturing Technology & 18th Electronics Materials and Packaging Conference, Penang, Malaysia, Sept. 20-22, 2016, pp. xx-xx.

Murai, Hikari, Tadeda, Yoshiyuki, Takano, Nozomu, and Ikeda, Ken, "Halogen-free materials for PWB and advanced package substrate," 6th International Symposium on Advanced Packaging Materials, Braselton, GA, Mar. 6-8, 2000, pp. 221-226.

Murai, Hikari, Takeda, Yoshiyuki, Takano, Nozomu, and Ikeda, Ken, "New Halogen-Free Materials for PWB, HDI And Advanced Package Substrate," Printed Circuits Expo 2000, San Diego, CA, Apr. 2-6, 2000, pp. S16-4-1-S16-4-6.

Murai, Hikari, Fukuda, Tomio, and Fischer, Terry, "The Evaluation of CAF property for narrow TH pitch PCB," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S21:04.

Murakami, Kazuhito, and Shinoda, Takehiko, "Recent highlights in the progress of Japanese plated lead-wire technology," Wire Journal, vol. 11 no. 4, pp. 65-72, Apr. 1978.

Murakami, Koji, Hino, Makoto, Mitooka, Yutaka, and Kanadani, Teruto, "Formation and growth of tin whiskers on aluminum-tin alloys," Journal of Japan Institute of Light Metals, vol. 61 no. 4, pp. 142-148, 2011.

Murakami, Koji, Hino, Makoto, Mitooka, Yutaka, and Kanadani, Teruto, "Formation and Growth of Tin Whiskers on Aluminum-Tin Alloys," Materials Transactions, vol. 53 no. 1, pp. 209-216, 2012.

Murakami, Koji, Hino, Makoto, Takamizawa, Masao, and Nakai, Kiyomichi, "Mechanism of Generation and Growth of Whiskers on Tin Electroplating," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 72 no. 3, pp. 168-175, Mar. 2008.

Murakami, Koji, Okano, Masako, Hino, Makoto, Takamizawa, Masao, and Nakai, Kiyomichi, "Mechanism of Generation and Suppression of Tin Whiskers on Tin and Tin-Lead Plated Films," Materials Transactions, vol. 51 no. 1, pp. 143-151, 2010.

Murakami, M., and Kuan, T. S., "Thermal Strain in Lead Thin Films V: Strain Relaxation above Room Temperature," Thin Solid Films, vol. 66 no. 3, pp. 381-394, Mar. 17, 1980.

Murakami, S., O, M., and Kajihara, M., "Growth Behavior of Compounds during Reactive Diffusion in the Solid-Cu/Liquid-Sn System," Materials Transactions, vol. 59 no. 2, pp. 198-203, 2018.

Muraki, Taiji, Ohnishi, Chiaki, Ikedo, Kenshi, Udono, Naoyasu, Mori, Shigeru, Sugiura, Shinichi, and Watanabe, Hiromichi, "Development of lead free vehicle products," Fujitsu Ten Technical Journal, no. 26, pp. 42-48, 2006.

Muralidharan, G., Tsang, C. F., Corpuz, Victor G., and Pooh, Peter, "Microstructural Evolution Of Low Temperature Solders In Solder Joints On A Flexible Substrate," Proceedings of 2nd Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 1998, pp. 302-307.

Muralidharan, Govindarajan, Kurumaddali, Kanth, Kercher, Andrew K., Walker, Larry, and Leslie, Scott G., "An X-ray Radiography Study of the Effect of Thermal Cycling on Damage Evolution in Large-Area Sn-3.5Ag Solder Joints." Journal of Electronic Materials, vol. 42 no. 2, pp. 240-248, Feb. 2013.

Muralidharan, Govindarajan, Kurumaddali, Kanth, Kercher, Andrew K., and Leslie, Scott G., "Reliability of Sn-3.5Ag Solder Joints in High Temperature Packaging Applications," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1823-1829.

Murata, Masayuki, Yamamoto, Hiroya, Tsunemi, Fumiaki, Hasegawa, Yasuhiro, and Komine, Takashi, "Four-Wire Resistance Measurements of a Bismuth Nanowire Encased in a Quartz Template Utilizing Focused Ion Beam Processing," Journal of Electronic Materials, vol. 41 no. 6, pp. 1442-1449, June 2012.

Murata, Masayuki, Tsunemi, Fumiaki, Saito, Yusuke, Shirota, Katsuhito, Fujiwara, Keisuke, Hasegawa, Yasuhiro, and Komine, Takashi, "Temperature Coefficient of Electrical Resistivity in Individual Single-Crystal Bismuth Nanowires," Journal of Electronic Materials , vol. 42 no. 7, pp. 2143-2150, July 2013.

Murayama, Kei, Aizawa, Mitsuhiro, and Oi, Kiyoshi, "Effects of Au and Pd in pad surface finish on electro-migration of flip chip interconnection between Cu-pillar and Sn-Bi solder alloy system," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 875-881.

Murayama, Kei, Aizawa, Mitsuhiro, and Kurihara, Takashi, "Effects of the inter-metallic compounds microstructure on electro-migration of Sn-Bi solder system," 2017 IEEE 67th Electronic Components and Technology Conference, Orlando, FL, May 30-June 2, 2017, pp. 464-469.

Murayama, Kei, Aizawa, Mitsuhiro, and Kurihara, Takashi, "Electro-migration Behavior in Fine Pitch SnBi Eutectic Solder Bump Interconnections," 2014 IEEE CPMT Symposium Japan, Kyoto, Japan, Nov. 4-6, 2014, pp. 71-74.

Murayama, Kei, Higashi, Mitsutoshi, Sakai, Taiji, and Imaizumi, Nobuaki, "Electro-migration Behavior in Low Temperature Flip Chip Bonding," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 608-614.

Murayama, Kei, Aizawa, Mitsuhiro, and Kurihara, Takashi, "Study of Crystal Orientation and Microstructure in Sn-Bi and Sn-Ag-Cu Solder with Thermal Compression Bonding and Mass Reflow," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 909-916.

Murayama, Kei, Aizawa, Mitsuhiro, and Higashi, Mitsutoshi, "Study of Electro-migration Resistivity of Micro Bump Using SnBi Solder," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 1166-1172.

Murner, Christine, "Plastics, Electronics and the Environment," Plastics Technology , vol. 52 no. 10, pp. 56-57, 59, 61, Oct. 2006.

Murphy, A. J., "The Constitution of the Alloys of Silver and Tin," Journal of the Institute of Metals, vol. 35 no. 1, pp. 107-129, 1926.

Murphy, Cynthia F., and Pitts, Gregory E., "Survey of Alternatives to Tin-Lead Solder and Brominated Flame Retardants," IEEE International Symposium on Electronics and the Environment, Denver, CA, May 7-9, 2001, pp. 309-315.

Murphy, T. P., "Research on tin-based coatings for steel," Steel Times, vol. 222 no. 11, pp. 444, 446, Nov. 1994.

Murphy, Tim, "H.A.L.T. Test Vehicle for Lead Free Surface Finish and Solder Paste Selection," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 58-66.

Murphy, W. K., and Sears, G. W., "Iron Whisker Resonators," Applied Physics Letters, vol. 3 no. 4, pp. 55-57, Aug. 15, 1963.

Murray, C. T., Rudman, R. L., Sabade, M. B., and Pocius, A. V., "Conductive Adhesives for Electronic Assemblies," MRS Bulletin, vol. 28 no. 6, pp. 449-454, June 2003.

Murray, Cameron T., Hogerton, Peter B., Chheang, Theary, and Rudman, Robert L., "Reliability Studies of Anisotropic Conductive Adhesives in Flex to LCD Applications," Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 820-825.

Murray, Cameron T., Hogerton, Peter B., Chheang, Theary, Rudman, Robert L., and Egeberg, Harry, "Reliability Study of Sub 100 Micron Pitch, Flex-to-ITO/glass Interconnection, Bonded with an Anisotropic Conductive Film," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 200-204.

Murray, Jerry, "Getting the Lead Out," Printed Circuit Fabrication, vol. 16 no. 2, pp. 100, Feb. 1993.

Murty, K. Linga, Haggag, Fahmy M., and Mahidhara, Rao K., "Tensile, Creep, and ABI Tests on Sn5%Sb Solder for Mechanical Property Evaluation," Journal of Electronic Materials, vol. 26 no. 7, pp. 839-846, July 1997.

Murugesan, M., Fukushima, T., Bea, J. C., Hashimoto, H., and Koyanagi, M., "Low-Cost and Self-Formed Vertical Nanowires with Aspect Ratio >100x in Deep Si-Trenches for Future 3D-LSI/IC Applications," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 1146-1151.

Murugesan, M., Ohara, Y., Fukushima, T., Tanaka, T., and Koyanagi, M., "Low-Resistance Cu-Sn Electroplated-Evaporated Microbumps for 3D Chip Stacking," Journal of Electronic Materials, vol. 41 no. 4, pp. 720-729, Apr. 2012.

Musgrave, M. J. P., "On the Relation Between Grey and White Tin (a-Sn and b-Sn)," Proceedings of the Royal Society of London, Series A, Mathematical and Physical Sciences, vol. 272 no. 1351, pp. 503-528, Apr. 9, 1963.

Musgrave, M. J. P., and Pople, J. A., "The Stability Under Pressure of Crystals with the Diamond or Zinc-blende Structure," Journal of Physics and Chemistry of Solids, vol. 23 no. 4, pp. 321-323, Apr. 1962.

Musson, Ben, "Small firms still unsure over RoHS directive, says RS," Electronics Weekly, July 18, 2006.

Musson, Stephen E., Jang, Yong-Chul, Townsend, Timothy G., and Chung, Il-Hyun, "Characterization of Lead Leachability from Cathode Ray Tubes Using the Toxicity Characteristic Leaching Procedure," Environmental Science & Technology, vol. 34 no. 20, pp. 4376-4381, Oct. 15, 2000.

Musson, Stephen E., Vann, Kevin N., Jang, Yong-Chul, Mutha, Sarvesh, Jordan, Aaron, Pearson, Brian, and Townsend, Timothy G., "RCRA Toxicity Characterization of Discarded Electronic Devices," Environmental Science & Technology, vol. 40 no. 8, pp. 2721-2726, Apr. 15, 2006.

Mustafa, Muhannad, Cai, Zijie, Suhling, Jeffrey C., and Lall, Pradeep, "Characterization of Hysteresis Loop Evolution in Aged Lead Free Solders," Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, Volume 1, Portland, OR, July 6-8, 2011, pp. 507-518.

Mustafa, Muhannad, Roberts, Jordan C., Suhling, Jeffrey C., and Lall, Pradeep, "Effects of Aging on Shear Cyclic Stress Strain and Fatigue Behaviors of Lead Free Solder Joints," 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 27-30, 2014, pp. 142-151.

Mustafa, Muhannad, Cai, Zijie, Roberts, Jordan C., Suhling, Jeffrey C., and Lall, Pradeep, "Evolution of the Tension/Compression and Shear Cyclic Stress-Strain Behavior of Lead-Free Solder Subjected to Isothermal Aging," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 765-780.

Mustafa, Muhannad, Suhling, Jeffrey C., and Lall, Pradeep, "Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging," Microelectronics Reliability, vol. 56, pp. 136-147, Jan. 2016.

Mustafa, Muhannad, Roberts, Jordan C., Suhling, Jeffrey C., and Lall, Pradeep, "The Effects of Aging on the Cyclic Stress-Strain and Fatigue Behaviors of Lead Free Solders," Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 1, Burlingame, CA, July 16-18, 2013, pp. V001T05A011-1-V001T05A011-12.

Mustafa, Muhannad, Cai, Zijie, Suhling, Jeffrey C., and Lall, Pradeep, "The Effects of Aging on the Cyclic Stress-Strain Behavior and Hysteresis Loop Evolution of Lead Free Solders," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 927-939.

Mustafa, Muhannad, Roberts, Jordan C., Suhling, Jeffrey C., and Lall, Pradeep, "The Effects of Aging on the Fatigue Life of Lead Free Solders," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 666-683.

Mustain, Habib A., Brown, William D., and Ang, Simon S., "Transient Liquid Phase Die Attach for High-Temperature Silicon Carbide Power Devices," IEEE Transactions on Components and Packaging Technologies , vol. 33 no. 3, pp. 563-570, Sept. 2010.

Mustoe, G. G. W., Nakagawa, M., Lin, X., and Iwamoto, N., "Simulation of Particle Compaction for Conductive Adhesives Using Discrete Element Modeling," 1999 Proceedings 49th Electronic Components & Technology Conference, San Diego, CA, June 1-4, 1999, pp. 353-359.

Muthuraman, Balaji Nandhivaram, and Canete, Baltazar, "Board Level Reliability assessment of Wafer Level Chip Scale Packages for SACQ, a lead-free solder with a novel life prediction model," 2018 7th Electronic System-Integration Technology Conference, Dresden, Germany, Sept. 18-21, 2018, pp. xx-xx.

Mutoh, Y., Zhao, J., Miyashita, Y., and Kanchanomai, C., "Fatigue crack growth behaviour of lead-containing and lead-free solders," Soldering & Surface Mount Technology, vol. 14 no. 3, pp. 37-45, 2002.

Mutschler, Ann Steffora, "Corporate Recycling Programs Becoming Widespread," Electronic News , Apr. 27, 2006.

Mutschler, Ann Steffora, "EDA's Designs on Environmental Compliance," Electronic News, Aug. 9, 2005.

Mutschler, Ann Steffora, "Enterprise Software Vendors Account for RoHS," Electronic News , Jan 10, 2006.

Mutschler, Ann Steffora, "Extending a Helping Hand," Electronic News, Nov. 22, 2005.

Mutschler, Ann Steffora, "Green leaders wanted...," Electronics Weekly, Sept. 7, 2004.

Mutschler, Ann Steffora, "Looking at the Short- and Long-Term," Electronic News, Mar. 22, 2006.

Mutschler, Ann Steffora, "Managing RoHS Data from Your Desk," Electronic News, Jan. 23, 2006.

Mutschler, Ann Steffora, "No Dumping Zone," Electronic News, Feb. 23, 2006.

Mutchler, Ann Steffora, "PCB Suppliers Feel the RoHS Pain," Electronic News, Dec. 7, 2005.

Mutschler, Ann Steffora, "Prep Time," Electronic News, Oct. 27, 2005.

Mutschler, Ann Steffora, "Recycling Eases Environmental Disposal," Electronic News, Sept. 8, 2005.

Mutschler, Ann Steffora, "Tracking RoHS Compliance Quality," Electronic News, July 23, 2006.

Mutschler, Ann Steffora, "Wanted: Industry leader to spearhead green movement," electronicsweekly.com, Aug. 26, 2004.

Mutuku, Francis, Arfaei, Babak, and Cotts, Eric J., "Effect of Variation in the Reflow Profile on the Microstructure of Near Eutectic SnAgCu Alloys," SMTA International 2013 Conference Proceedings , Fort Worth, TX, Oct. 13-17, 2013, pp. 876-881.

Mutuku, Francis, Arfaei, Babak, and Cotts, Eric J., "Effect of Variation in the Reflow Profile on the Microstructure of Near Eutectic SnAgCu Alloys," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 1769-1775.

Mutuku, Francis, Cotts, Eric, Arfaei, Babak, and Anselm, Martin, "Effect of Variation in the Reflow Profiles of Pb Free Solder on Lifetimes in Room Temperature Fatigue Tests," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 685-694.

Mutuku, Francis M., Arfaei, Babak, and Cotts, Eric, "Effects of Composition and Isothermal Aging on the Microstructure and Performance of Alternate Alloy Pb-Free Solder Joints," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 545-552.

Mutuku, Francis, Geng, Jie, Zhang, Hongwen, and Lee, Ning-Cheng, "Novel High Reliability Low Temperature Solder Alloys," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Mutuku, Francis, Arfaei, Babak, and Cotts, Eric J., "The Influence of Processing on Strengthening Mechanisms in Pb-Free Solder Joints," Journal of Electronic Materials, vol. 46 no. 4, pp. 2067-2079, Apr. 2017.

Myers, Marjorie K., "Coefficient of Friction of Sn Separable Interface Applications," Tyco Electronics Test Report, May 2003.

Myers, Vernon W., "Inelastic Scattering of Cold Neutrons in Polycrystalline Gray Tin," Journal of Physics and Chemistry of Solids, vol. 28 no. 11, pp. 2207-2210, Nov. 1967.

Myhra, S., and Gardiner, R. B., "Electron-irradiation-induced damage production effects in lightly doped n- and p-type a-tin," Journal of Applied Physics, vol. 45 no. 7, pp. 2964-2970, July 1, 1974.

Myhra, S., and Gardiner, R. B., "Electron-irradiation-induced damage recovery effects in lightly doped n- and p-type a-tin," Journal of Applied Physics, vol. 46 no. 3, pp. 1043-1048, Mar. 1, 1975.

Myhra, S., and Gardiner, R. B., "Electron-Irradiation Induced Production and Thermal Annealing of Damage in a-Tin," Radiation Effects, vol. 15 no. 3-4, pp. 209-216, 1972. https://doi.org/10.1080/00337577208234695

Myles, Mark, "Data Management is critical for both small and large manufacturers," Circuitnet, Dec. 21, 2004.

Myles, Mark, "Supply Chain Data Exchange for Material Disclosure," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 645-651.

Myles, Mark, "Supply Chain Data Exchange for Material Disclosure," SMTA Journal , vol. 19 no. 1, pp. 11-16, Jan.-Mar. 2006.

Myles, Mark, "WEEE-zing into August - A report from Europe," circuitnet, July 20, 2005.

Mysliwiec, Marcin, Kisiel, Ryszard, and Falat, Tomasz, "Die attach by diffusion Sn-Ag-Sn soldering in high temperature electronics applications," 2016 39th International Spring Seminar on Electronics Technology, Pilsen, Czech Republic, May 18-22, 2016, pp. 140-143.

Mysore, K., Chan, D., Bhate, D., Subbarayan, G., Dutta, I., Gupta, V., Zhao, J., and Edwards, D., "Aging-Informed Behavior of Sn3.8Ag0.7Cu Solder Alloys," 11th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 28-31, 2008, pp. 870-875.

Mysore, K., Chavali, S., Chan, D., Subbarayn, G., Dutta, I., Gupta, V., and Edwards, D., "Mechanistic Model for Aging Influenced Steady State Flow Behavior of Sn3.8Ag0.7Cu Solder Alloys," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 443-450.

Mysore, Kaushik, Subbarayan, Ganesh, Gupta, Vikas, and Zhang, Ron, "Constitutive and Aging Behavior of Sn3.0Ag0.5Cu Solder Alloy," IEEE Transactions on Electronics Packaging Manufacturing, vol. 32 no. 4, pp. 221-232, Oct. 2009.

Myung, Woo-Ram, Kim, Yongil, Kim, Kyung-Yeol, and Jung, Seung-Boo, "Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test," Journal of Electronic Materials, vol. 45 no. 7, pp. 3651-3658, July 2016.

Myung, Woo-Ram, Ko, Min-Kwan, Kim, Yongil, and Jung, Seung-Boo, "Effects of Ag content on the reliability of LED package component with Sn-Bi-Ag solder," Journal of Materials Science: Materials in Electronics , vol. 26 no. 11, pp. 8707-8713, Nov. 2015.

Myung, Woo-Ram, Kim, Yongil, and Jung, Seung-Boo, "Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes," Journal of Electronic Materials, vol. 44 no. 11, pp. 4637-4645, Nov. 2015.

Myung, Woo-Ram, Kim, Yongil, and Jung, Seung-Boo, "Mechanical property of the epoxy-contained Sn-58Bi solder with OSP surface finish," Journal of Alloys and Compounds, vol. xx, pp. xx-xx, xxxx.

NNNN

Na, Jake (Jaeik), and Lee, Tim (Minsu), "Novel Halogen-Free Materials for Organic Packaging Substrates," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Na, SeokHo, Cha, SeWoong, Kang, WonJoon, Kim, TaeSeong, Hwang, TaeKyung, and Khim, JinYoung, "Effect of Mild Aging on Package Drop Performance for Lead Free Solders," 2010 IEEE CPMT Symposium Japan, Tokyo, Japan, Aug. 24-26, 2010, pp. xx-xx.

Na, Seong-Hun, Lee, Mi-Ri, Park, Hwa-Sun, Kim, Heung-Kyu, and Suh, Su-Jeong, "Effect of a High-Temperature Pre-Bake Treatment on Whisker Formation Under Various Thermal and Humidity Conditions for Electrodeposited Tin Films on Copper Substrates," Metals and Materials International, vol. 20 no. 2, pp. 367-373, Mar. 2014.

Naama, S., Hadjersi, T., Keffous, A., and Nezzal, G., "CO2 gas sensor based on silicon nanowires modified with metal nanoparticles," Materials Science in Semiconductor Processing, vol. 38, pp. 367-372, Oct. 2015.

Nabarro, F. R., N., and Jackson, P. J., "Growth of Crystal Whiskers," Growth and Perfection of Crystals, Cooperstown, NY, Aug. 27-29, 1958, pp. 13-101. (Edited by Doremus, R. H., Roberts, B. W., and Turnbull, David.)

Nabatame, Yuta, Matsumoto, Tsuyoshi, Ichige, Yuki, Komine, Takashi, Sugita, Ryuji, Murata, Masayuki, and Hasegawa, Yasuhiro, "Numerical Analysis of the Boundary Scattering Effect on Transport Properties in Bi-Sb Nanowires," Journal of Electronic Materials, vol. 42 no. 7, pp. 2172-2177, July 2013.

Nabatian, David, Shahbazi, Samson, Brown, Orville, and Schaller, Sandra, "Thick Film Conductors for 175°C Operation in Automotive Electronics," Proceedings 1997 International Symposium on Microelectronics, Philadelphia, PA, Oct. 14-16, 1997, pp. 522-528.

Nadgornyi, E. M., Osip'yan, Yu. A., Perkas, M. D., and Rozenberg, V. M., x "Filamentary Crystals with Almost the Theoretical Strength of Perfect Crystals," Soviet Physics Uspekhi, vol. 2 no. 2, pp. 282-304, Feb. 1959.

Nadgornyi, E. M., "The Properties of Whiskers," Soviet Physics Uspekhi, vol. 5 no. 3, pp. 462-477, Nov.-Dec. 1962.

Nadia, Aemi, and Haseeb, A. S. M. A., "Effects of addition of copper particles of different size to Sn-3.5Ag solder," Journal of Materials Science: Materials in Electronics, vol. 23 no. 1, pp. 86-93, Jan. 2012.

Nadia, Aemi, "The Fabrication of Composite Solder by Addition of Copper Nano Powder into Sn-3.5Ag Solder," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 607-610.

Nadia, Aemi, and Haseeb, A. S. M. A., "Understanding the effects of addition of copper nanoparticles to Sn-3.5 Ag solder," Soldering & Surface Mount Technology, vol. 23 no. 2, pp. 68-74, 2011.

Nadimpalli, Siva P. V., and Spelt, Jan K., "A Geometry and Size Independent Failure Criterion for Fracture Prediction in Lead-Free Solder Joints," International Conference on Soldering & Reliability 2010 Proceedings, Toronto, Ontario, Canada, May 17-20, 2010, pp. xx-xx.

Nadimpalli, Siva P. V., and Spelt, Jan K., "Characterization and Prediction of Pad-Crater Fracture in Lead-Free Compatible PCBs," International Conference on Soldering & Reliability 2011 Proceedings, Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

Nadimpalli, Siva P. V., and Spelt, Jan K., "Fracture Behavior Of A Lead-Free Solder/Cu Joint System," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Nadimpalli, Siva P. V., and Spelt, Jan K., "Predicting the Strength of Solder Joints Using Cohesive Zone Modeling," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

Nadimpalli, Siva P. V., and Spelt, Jan K., "Prediction of pad cratering fracture at the copper pad - Printed circuit board interface," Microelectronics Reliability, vol. 52 no. 7, pp. 1454-1463, July 2012.

Nadimpalli, Siva P. V., and Spelt, Jan K., "R-curve behavior of Cu-Sn3.0Ag0.5Cu solder joints: Effect of mode ratio and microstructure," Materials Science and Engineering: A, vol. 527 no. 3, pp. 724-734, Jan. 15, 2010.

Nagai, Akira, Takemura, Kenzo, Isaka, Kazuhiro, Watanabe, Osamu, Kojima, Kazuyoshi, Matsuda, Kazuya, and Watanabe, Itsuo, "Anisotropic Conductive Adhesive Films for Flip-chip Interconnection onto Organic Substrates," 1998 IEMT/IMC Proceedings, Tokyo, Japan, Apr. 15-17, 1998, pp. 353-357.

Nagai, Takeshi, Natori, Katsuhide, and Furusawa, Takashi, "Approximation for the Rate of Short Circuit in Electronic Devices Caused by Whisker Growth on Zn Electroplated Steel," Fujitsu Scientific & Technical Journal, vol. 26 no. 1, pp. 107-113, Spring 1990.

Nagai, Takeshi, Natori, Katsuhide, and Furusawa, Takashi, "Rate of Short Circuit Caused by Whisker Growth on Zn Electroplated Steels in Electronic Appliance", Journal of the Japan Institute of Metals , vol. 53 no. 3, pp. 303-307, 1989.

Nagamatsu, Tatsuo, Kakiuchi, Yuuji, and Suga, Yasuhiro, "ACF (Anisotropic Conductive Film) Batch Bonding Connection changing Flip Chip Bonding technology," 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Odaiba, Japan, Jan. 16-18, 2007, pp. 119-124.

Nagamiya, Takuya, Yamada, Mariko, and Imamura, Takashi, "Management of Chemical Substances Contained in Products," Fujitsu Scientific and Technical Journal, vol. 45 no. 1, 2009, pp. 88-94.

Nagano, Fuya, Kajihara, Masanori, Derakhshandeh, Jaber, Hou, Lin, Van De Peer, Myriam, Preter, Inge De, Sharifi, Shamin Houshmand, Rebibis, Kenneth June, Miller, Andy, Beyer, Gerald, and Beyne, Eric, "Growth rate of IMC in the binary sytems of Co/Sn and Cu/Sn," 2017 IEEE International Interconnect Technology Conference, HsinChu, Taiwan, May 16-18, 2017, pp. xx-xx.

Nagarajan, Niveditha, Kumar, Sathish, Dutt, Gyan, Pandher, Ranjit, and Bilgrien, Carl, "High-Reliability Lead-Free Solder for Low-Cost Die Attach Applications," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 111-117.

Nagarajan, Niveditha, Siebenhuhner, Matthew, Herrick, Nicholas, Pandher, Ranjit, and Bilgrien, Carl, "Thermomechanical Reliability of Low-Temperature Solder Alloys for Mid-Power LED Packages," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Nagasaka, Muneo, "Temperature Dependence of Plastic Deformation in White Tin Single Crystals," Japanese Journal of Applied Physics, vol. 28 pt. 1 no. 3, pp. 446-452, Mar. 1989.

Nagayoshi, H., Nordmark, H., Nishimura, S., Terashima, K., Marioara, C. D., Walmsley, J. C., Holmestad, R., and Ulyashin, A., "Vapor-solid-solid Si nano-whiskers growth using pure hydrogen as the source gas," Thin Solid Films, vol. 519 no. 14, pp. 4613-4616, May 2, 2011.

Nagel, Carsten, Nilsson, Jorgen, and Boks, Casper, "European End-of-Life Systems for Electrical and Electronic Equipment," First International Symposium On Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Feb. 1-4, 1999, pp. 197-202.

Nagelein, Andreas, Timm, Cornelia, Steidl, Matthias, Kleinschmidt, Peter, and Hannappel, Thomas, "Multi-Probe Electrical Characterization of Nanowires for Solar Energy Conversion," IEEE Journal of Photovoltaics, vol. 9 no. 3, pp. 673-678, May 2019.

Nagira, Tomoya, Nakatsuka, Noriaki, Yasuda, Hideyuki, Uesugi, Kentaro, Takeuchi, Akihisa, and Suzuki, Yoshio, "Impact of melt convection induced by ultrasonic wave on dendrite growth in Sn-Bi alloys," Materials Letters, vol. 150, pp. 135-138, July 1, 2015.

Naguy, T., and Kolek, J., "Air Force Efforts to Identify and Evaluate Emerging Technologies," Proceedings 2004 AESF/EPA Conference for Environmental & Process Excellence, Orlando, FL, Jan. 26-29, 2004, pp. 304-311.

Naguy, T., Klingenberg, M., Pavlik, M., and Schario, D., "Non-Line-of-Sight Hard Chromium Alternatives," 21st AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 17-19, 2000, pp. 69-74.

Naguy, T., Klingenberg, M., Neidbalson, M., Pavlik, M., and Schario, D., "Non-Line-of-Sight Hard Chromium Alternatives," 22nd AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 29-Feb. 1, 2001, pp. xx-xx.

Naguy, T., Kolek, J., Brooman, E., Pavlik, M., and Klingenberg, M., "Non-Line-of-Sight (NLOS) Hard Chromium Alternatives Status Report," Proceedings 2004 AESF/EPA Conference for Environmental & Process Excellence, Orlando, FL, Jan. 26-29, 2004, pp. 67-78.

Naguy, Thomas A., Kolek, Joseph R., and Anderl, Timothy R., "Engineers Evaluate Cold Spray Coating Processes," Air Force Research Laboratory Technology Horizons, vol. xx no. x, pp. xx-xx, Apr. 2005.

Naguy, Thomas A., Kolek, Joseph R., and Anderl, Timothy R., "Engineers Evaluate Non-Line-of-Sight Hard Chrome Alternatives," Air Force Research Laboratory Technology Horizons, vol. xx no. x, pp. xx-xx, Dec. 2004.

Nagy, Erzsebet, Gyenes, Anett, Molnar, Aliz, and Gacsi, Zoltan, "Investigation of intermetallic phases formed in lead-free solders," Materials Science Forum, vol. 812, pp. 357-362, Feb. 2015.

Nah, J. W., Ren, Fei, Tu, K. N., Venk, Sridharan, and Camara, Gabe, "Electromigration in Pb-free flip chip solder joints on flexible substrates," Journal of Applied Physics, vol. 99 no. 2, pp. 023520-1-023520-6, Jan 15, 2006.

Nah, Jae-Woong, Buchwalter, Stephen L., Gruber, Peter A., Shih, D.Y., and Furman, Bruce K., "C4NP Cu-cored Pb-free Flip Chip Interconnections," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1351-1356.

Nah, Jae-Woong, Gaynes, Michael A., Feger, Claudius, Katsurayama, Satoru, and Suzuki, Hiroshi, "Development of Wafer Level Underfill Materials and Assembly Processes for Fine Pitch Pb-free Solder Flip Chip Packaging," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1015-1022.

Nah, Jae-Woong, Suh, J. O., Tu, K. N., Yoon, Seung Wook, Rao, Vempati Srinivasa, Kripesh, Vaidyanathan, and Hua, Fay, "Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect," Journal of Applied Physics, vol. 100 no. 12, pp. 123513-1-123513-5, 2006.

Nah, Jae-Woong, Suh, J. O., Tu, K. N, Yoon, Seung Wook, Chong, Chai Tai, Kripesh, V., Su, B. R, and Chen, Chih, "Electromigration in Pb-Free Solder Bumps with Cu Column as Flip-Chip Joints," Proceedings 56th Electronic Components & Technology Conference , San Diego, CA, May 30-June 2, 2006, pp. 657-662.

Nah, Jae-Woong, Chen, Kai, Suh, J. O., and Tu, K. N., "Electromigration Study in Flip Chip Solder Joints," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1450-1455.

Nah, Jae-Woong, Martin, Yves, Kamlapurkar, Swetha, Engelmann, Sebastian, Bruce, Robert L., and Barwicz, Tymon, "Flip chip Assembly with Sub-micron 3D Re-alignment via Solder Surface Tension," 2015 IEEE 65th Electronic Components and Technology Conference , San Diego, CA, May 26-29, 2015, pp. 35-40.

Nah, Jae-Woong, and Paik, Kyung-Wook, "Investigation of Low Cost Flip Chip Under Bump Metalization (UBM) Systems on Cu Pads," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 790-795.

Nah, Jae-Woong, Gelorme, Jeffrey, Sorce, Peter, Lauro, Paul, Perfecto, Eric, McLeod, Mark, Toriyama, Kazushige, Orii, Yasumitsu, Brofman, Peter, Nauchi, Takashi, Takaguchi, Akira, Ishiguro, Kazuya, Yoshikawa, Tomoyasu, Daily, Derek, and Suzuki, Ryoichi, "Wafer IMS (Injection Molded Solder) - A New Fine Pitch Solder Bumping Technology on Wafers with Solder Alloy Composition Flexibility," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 1308-1313.

Nahavandi, M., Hanim, M. A. Azmah, Ismarrubie, Z. N., Hajalilou, A., Rohaizuan, R., and Fadzli, M. Z. Shahrul, "Effects of Silver and Antimony Content in Lead-Free High-Temperature Solders of Bi-Ag and Bi-Sb on Copper Substrate," Journal of Electronic Materials , vol. 43 no. 2, pp. 579-585, Feb. 2014.

Nai, S. M. L., Han, Y. D., Jing, H. Y., Xu, L. Y., Tan, C. M., and Wei, J., "Ageing Study of Interfacial Intermetallic Growth in a Lead-free Solder Reinforced with Ni-Coated Carbon Nanotubes," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 437-440.

Nai, S. M. L., Wei, J., and Gupta, M., "Development of lead-free solder composites containing nanosized hybrid (ZrO2 + 8 mol.% Y2O3) particulates," Solid State Phenomena, vol. 111, pp. 59-62, 2006.

Nai, S. M. L., Wei, J., and Gupta, M., "Effect of Carbon Nanotubes on the Shear Strength and Electrical Resistivity of a Lead-Free Solder," Journal of Electronic Materials, vol. 37 no. 4, pp. 515-522, Apr. 2008.

Nai, S. M. L., Wei, J., and Gupta, M., "Effect of Nano-size Oxide Based Reinforcement on the Tensile Properties of Sn-Ag-Cu Solder," 2008 ASME International Mechanical Engineering Congress and Exposition, Volume 6, Boston, MA, Oct. 31-Nov. 6, 2008, pp. 1-3.

Nai, S. M. L., Han, Y. D., Jing, H. Y., Zhang, K. L., Tan, C. M., and Wei, J., "Enhancing the Properties of a Lead-free Solder with the Addition of Ni-coated Carbon Nanotubes," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 540-543.

Nai, S. M. L., Wei, J., and Gupta, M., "Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes," Materials Science and Engineering A, vol. 423 no. 1-2, pp. 166-169, May 15, 2006.

Nai, S. M. L., Wei, J., and Gupta, M., "Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder composites," Thin Solid Films , vol. 504 no. 1-2, pp. 401-404, May 10, 2006.

Nai, S. M. L., Wei, J., and Gupta, M., "Influence of Reinforcements on the Electrical Resistivity of Novel Sn-Ag-Cu Composite Solder," 2007 ASME International Mechanical Engineering Conference and Exposition, Volume 5, Seattle, WA, Nov. 11-15, 2007, pp. 39-42.

Nai, S. M. L., Wei, J., and Gupta, M., "Interfacial intermetallic growth and shear strength of lead-free composite solder joints," Journal of Alloys and Compounds, vol. 473 no. 1-2, pp. 100-106, Apr. 3, 2009.

Nai, S. M. L., Wei, J., and Gupta, M., "Lead-Free Solder Reinforced with Multiwalled Carbon Nanotubes," Journal of Electronic Materials, vol. 35 no. 7, pp. 1518-1522, July 2006.

Nai, S. M. L., Gupta, M., and Wei, J., "Suppressing Intermetallic Compound Growth in SnAgCu Solder Joints with Addition of Carbon Nanotubes," 2nd IEEE International Nanoelectronics Conference, Shanghai, China, Mar. 24-27, 2008, pp. 15-19.

Nai, S. M. L., Wei, J., and Gupta, M., "Using carbon nanotubes to enhance creep performance of lead free solder," Materials Science and Technology, vol. 24 no. 4, pp. 443-448, Apr. 2008.

Nai, S. M. L., Kuma, J. V. M., Alam, M. E., Zhong, X. L., Babaghorbani, P., and Gupta, M., "Using Microwave-Assisted Powder Metallurgy Route and Nano-size Reinforcements to Develop High-Strength Solder Composites," Journal of Materials Engineering and Performance, vol. 19 no. 3, pp. 335-341, Apr. 2010.

Nai, S. M. L., Kuma, J. V. M., and Gupta, M., "Utilizing energy efficient microwave sintering to significantly enhance the tensile response of a lead-free solder," Journal of Physics D: Applied Physics, vol. 42 no. 1, pp. 015404-1-015404-8, Jan. 7, 2009.

Naik, J. P., Prewett, P. D., Das, K., and Raychaudhuri, A. K., "Instabilities in Focused Ion Beam-patterned Au nanowires," Microelectronic Engineering, vol. 88 no. 9, pp. 2840-2843, Sept. 2011.

Naisbitt, Graham, "Avoid Electro-chemical Failure Using SIR," Surface Mount Technology (SMT), vol. 21 no. 1, pp. 18, 20, 22, Jan. 2007.

Naisbitt, Graham, "Avoiding electro-chemical failure," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Dec. 7, 2006.

Naisbitt, Graham, "Cleanliness Testing on the Shop Floor," Surface Mount Technology (SMT), vol. 22 no. 3, pp. 36-38, Mar. 2008.

Naisbitt, Graham, "Forcing the Issue of Solderability," IPC Review, vol. 47 no. 7, pp. 16-17, Aug. 2006.

Naisbitt, Graham, "Forcing the Issue of Solderability," Route, Aug. 2006.

Naisbitt, Graham, "Lead-Free "Solderability" vs. "Soldering Ability"," U. S. Tech, vol. 21 no. 9, pp. 21-22, Sept. 2006.

Naisbitt, Graham, "Learning from the RoHS experience," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, July 2, 2007.

Naisbitt, Graham, "Learning from the RoHS experience," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, July 5, 2007.

Naisbitt, Graham, "Testing times for lead-free alloys," EMasia, Sept. 2006.

Naisbitt, Graham, "Testing times for lead-free alloys," EngineerIT, pp. 50-54, Oct. 2006

Naisbitt, Graham, "The transition to lead-free solder," Dataweek, vol. xx no. xx, pp. xx-xx, Sept. 20, 2006.

Najafi, Mojgan, Rafati, Amir Abbas, Fart, Mona Khorshidi, and Zare, Atefeh, "Effect of the pH and electrodeposition frequency on magnetic properties of binary Co1-xSnx nanowire arrays," Journal of Materials Research, vol. 29 no. 2, pp. 190-196, Jan. 28, 2014.

Najafi, Mojgan, Soltanian, Saeid, Danyali, Habibollah, Hallaj, Rahman, Salimi, Abdollah, Elahi, Seyed Mohammad, and Servati, Peyman, "Preparation of cobalt nanowires in porous aluminum oxide: Study of the effect of barrier layer," Journal of Materials Research, vol. 27 no. 18, pp. 2382-2390, Sept. 28, 2012.

Najjar, Ousama, "Halogen and Antimony-Free Epoxy Thermount Laminate for Printed Wiring Board (PWB) Fabrication," 2002 SMTA International Conference Proceedings , Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Najmzadeh, M., Tsuchiya, Y., Bouvet, D., Grabinski, W., and Ionescu, A. M., "Gate-all-around buckled dual Si nanowire nMOSFETs on bulk Si for transport enhancement and digital logic," Microelectronic Engineering, vol. 110, pp. 278-281, Oct. 2013.

Najmzadeh, M., Tsuchiya, Y., Bouvet, D., Grabinski, W., and Ionescu, A. M., "Multigate Buckled Self-Aligned Dual Si Nanowire MOSFETs on Bulk Si for High Electron Mobility," IEEE Transactions on Nanotechnology, vol. 11 no. 5, pp. 902-906, Sept. 2012.

Naka, Jiro, Hirano, Noriko, Kurokawa, Hiroshi, Kobayashi, Junji, and Kawashima, Yasuo, "Rapid Screening Method for Brominated Flame Retardants and Hexavalent Chromium by Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS)," Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 12-14, 2005, pp. 818-822.

Nakadaira, Yoshikuni, Jeong, Seyoung, Shim, Jongbo, Seo, Jaiseok, Min, Sunhee, Cho, Taeje, Kang, Sayoon, and Oh, Seyong, "Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling," Microelectronics Reliability , vol. 47 no. 12, pp. 1928-1949, Dec. 2007. https://doi.org/10.1016/j.microrel.2007.03.008

Nakadaira, Yoshikuni, Jeong, Seyoung, Shim, Jongbo, Seo, Jaiseok, Min, Sunhee, Cho, Taeje, Kang, Sayoon, and Oh, Seyong, "Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling," Microelectronics Reliability , vol. 48 no. 1, pp. 83-104, Jan. 2008. https://doi.org/10.1016/j.microrel.2007.01.091

Nakadaira, Yoshikuni, Matsuura, Tatsuo, Tsuriya, Masahiro, Nhat, D. Vo, Kangas, Ryan, Conrad, Jason, Sundram, Balachandar, Lee, Kee-Huat, and Arunasalam, Selvakumar M., "Pb-free Plating for Peripheral/Leadframe Packages," Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 11-15, 2001, pp. 213-218.

Nakagawa, Layne, "Toxic Trade: the Real Cost of Electronics Waste Exports from the United States," June 2006.

Nakagawa, Yasutada, and Yokoyama, Ryohei, "Optimization of Heating Temperature History for Anisotropic Conductive Film Interconnection," Journal of Electronic Packaging, vol. 134 no. 1, pp. 011005-1-011005-8, Mar. 2012.

Nakagawa, Yasutoshi, Aoki, Yuichi, and Nagai, Takayuki, "Evaluating joint reliability of Sn-Zn low-temperature lead-free solder," Espec Technology Report, no. 19, pp. 19-29, Apr. 2005.

Nakagiri, Akikazu, and Yamamoto, Shinya, "Three-dimensional FEM simulation of the influence of drawing in setting angle used in wiredrawing," Wire Journal International, vol. 36 no. 3, pp. 179-186, Mar. 2003.

Nakahara, Hayao, "JAPAN'S PCB Industry," Printed Circuit Design and Manufacture , vol. 23 no. 1, pp. 22-24, 26-28, 30, Jan. 2006.

Nakahara, Hayao, "Riding the Green Wave," Printed Circuit Fabrication, vol. 23 no. 9, pp. 65-70,117, Sept. 2000.

Nakahara, Yuunosuke, Hira, Kazuo, Ninomiya, Ryuuji, Tagami, Michihiro, Sugai, Mikio, and Nakata, Shinichi, "The Effect of Additional Elements on the Interfacial Structure and Strength at the Solder Joint between Sn-Ag-X Solder and Electroless Ni-P Plating," Quarterly Journal of the Japan Welding Society/ Yosetsu Gakkai Ronbunshu , vol. 21 no. 1, pp. 116-125, 2003.

Nakahigashi, K., and Higashimine, K., "The electron density distribution in a-tin from powder x-ray data by the maximum-entropy method," Journal of Physics: Condensed Matter, vol. 7 no. 34, pp. 6961-6966, 1995. https://doi-org.ezproxy.uky.edu/10.1088/0953-8984/7/34/018

Nakahira, Atsushi, Yamamoto, Shinya, and Onodera, Hiroshi, "Synthesis and Evaluation of Fe Nanowire and Nanorod by Electro-Chemical Process," Key Engineering Materials, vol. 616, pp. 237-241, June 2014.

Nakai, K., Sakamoto, T., Kobayashi, S., Takamizawa, M., Murakami, K., and Hino, M., "A model for nucleation of tin whisker through dislocation behavior," Journal of Physics: Conference Series, vol. 165, no. 012089, 2009.

Nakai, Kiyomichi, Sakamoto, Tatsuaki, Kobayashi, Sengo, Arakawa, Kazuto, Mori, Hirotaro, Takamizawa, Masao, Murakami, Koji, and Hino, Makoto, "A Model for Nucleation and Growth Processes of Tin Whisker," Materials Science Forum, vol. 638-642, pp. 2688-2693, Jan. 2010.

Nakai, Kiyomichi, Sakamoto, Tatsuaki, Miyamoto, Takeaki, and Kobayashi, Sengo, "Formation of whisker in pure Sn under tensile stress and a method of its suppression," Materials Science Forum, vol. 706-709, pp. 751-756, Jan. 2012.

Nakajima, Hideo, "The Discovery and Acceptance of the Kirkendall Effect: The Result of a Short Research Career," JOM, vol. 49 no. 6, pp. 15-19, June 1997.

Nakamoto, Masashi, Heikinheimo, Erkki, Kekkonen, Marko, Friman, Michael, and Holappa, Lauri, "Melting behavior of Sn-Bi alloy powder compacts observed using optical dilatometry," International Journal of Materials Research, vol. 100 no. 5, pp. 677-683, May 2009.

Nakamura, Hajime, Sawada, Hirotaka, Mabuchi, Toshiaki, Ishida, Katsuyoshi, Watanabe, Tomohisa, Suzuki, Jun, and Yoshino, Akira, "Multi Core Cable with Eco Materials," Fujikura Technical Review , no. 31, pp. 51-53, Jan. 2002.

Nakamura, Jun, Higuchi, Kohei, and Maenaka, Kazusuke, "Vertical Si nanowire with ultra-high-aspect-ratio by combined top-down processing technique," Microsystem Technologies, vol. 19 no. 3, pp. 433-438, Mar. 2013.

Nakamura, Kiyotomo, Shohji, Ikuo, Goto, Hiroki, and Ookubo, Toshikazu, "Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating ," Materials Transactions, vol. 46 no. 12, pp. 2730-2736, 2005.

Nakamura, Makoto, and Tanaka, Hirokazu, "Evaluating the bonding and insulation characteristics of conductive adhesives," Espec Technology Report, no. 18, pp. 1-14, Oct. 2004.

Nakamura, Shinichiro, Murakami, Shinsuke, Nakajima, Kenichi, and Nagasaka, Tetsuya, "Hybrid Input-Output Approach to Metal Production and Its Application to the Introduction of Lead-Free Solders," Environmental Science & Technology, vol. 42 no. 10, pp. 3843-3848, 2008.

Nakamura, Y., and Ono, T., "Temperature dependence of anelastic properties in Sn-Ag-Cu system and Sn-3.5Ag alloys of lead-free solders," Journal of Materials Science , vol. 40 no. 12, pp. 3267-3269, 2005.

Nakamura, Yoshikazu, Sakakibara, Yoshinori, Watanabe, Yoshihisa, and Amamoto, Yoshiki, "Microstructure of solder joints with electronic components in lead-free solders," Soldering & Surface Mount Technology, vol. 10 no. 1, pp. 10-12, 1998.

Nakane, Akihiro, Suzuki, Takao, O, Minho, and Kajihara, Masanori, "Observation on Isothermal Reactive Diffusion between Solid Ni and Liquid Sn," Materials Transactions, JIM, vol. 57 no. 6, pp. 838-845, 2016.

Nakano, Hiroaki, Oue, Satoshi, Yoshihara, Daisuke, Fukushima, Hisaaki, Saka, Yoshifumi, Sawada, Shigeru, and Hattori, Yasuhiro, "Sn-Cu Alloy Electrodeposition and Its Connecting Reliability for Automotive Connectors," Materials Transactions, vol. 52 no. 6, pp. 1237-1243, 2011.

Nakano, Hiroyuki, Ejiri, Yasuhiro, Mori, Takao, Sayama, Toshihiko, Takayanagi, Takeshi, and Okamoto, Yoshiyuki, "Phase Growth Process of Sn-3.0Ag-0.5Cu Solder Joints under Mechanical Cyclic Loading at the Same Temperature," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 833-839.

Nakano, Sho, Sakane, Masao, Hokazono, Hiroaki, and Yamashita, Mitsuo, "Effect of Additive Elements on Tensile, Creep and Low Cycle Fatigue Strength for SnBi Solders," 2012 14th International Conference on Electronic Materials and Packaging, Hong Kong, Dec. 13-16, 2012, pp. xx-xx.

Nakatsuka, Tetuya, Serizawa, Koji, Soga, Tasao, Shimokawa, Hanae, and Nishimura, Asao, "Reliability of Pb-free Solder Joints of Surface-mounted LSI Packages after Flow-Soldering," Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 308-313.

Nakatsuka, Yasuo, Tamura, Y., Okabayashi, T., Fujii, H., and Yokochi, M., "Development of Fine Pitch and High Lead Count Ceramic QFP," Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium, San Francisco, CA, Sept. 16-18, 1991, pp. 175-180.

Nakatsuma, Munehiko, Wada, Takehiro, Mori, Kimiaki, Shimokawa, Koichi, Shira, Takeshi, Irisawa, Atsushi, Garcia, Roberto, and Bath, Jasbir, "A Study of Lead-free, Low Silver Solder Alloys with Nickel Additions," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 664-677.

Nakayama, M., O, M., and Kajihara, M., "Experimental Observation of Diffusion Reaction in the (Sn-Ag)/Cu System at Solid-State Temperatures," Journal of Electronic Materials, vol. 48 no. 3, pp. 1766-1776, Mar. 2019.

Nakayama, Kazutaka, Nagai, Atsushi, and Iida, Noritaka, "Pb-Free Silver Conductive Paste with High Reliability," Materials Transactions, vol. 48 no. 3, pp. 594-599, Mar. 2007.

Nakayama, Misako, O, Minho, and Kajihara, Masanori, "Experimental Observation on Solid-State Reactive Diffusion between Sn-Ag Alloys and Ni," Materials Transactions, JIM, vol. 58 no. 4, pp. 561-566, 2017.

Nakayama, Misako, and Kajihara, Masanori, "Kinetics of Reactive Diffusion in the (Sn-Cu)/Ni System at Solid-State Temperatures," Materials Transactions, vol. 56 no. 6, pp. 798-802, 2015.

Nakayama, Misako, and Kajihara, Masanori, "Kinetics of Solid-State Reactive Diffusion in the (Sn-Ni)/Cu System," Materials Transactions, vol. 55 no. 8, pp. 1266-1273, 2014.

Nakazawa, Shiheatsu, Sunada, Minoru, Azakami, Takeshi, and Nagasaka, Tetsuya, "Activities Of Bi and In in the Bi-In Liquid Alloy Measured by Using Vacuum-Sealed Quartz Cell/Atomic Absorption Spectrophotometer Combination," Yazawa International Symposium: Metallurgical and Materials Processing: Principles and Techologies: Volume 1: Materials Processing Fundamentals and New Technologies, San Diego, CA, Mar. 2-6, 2003, pp. 425-429.

Nakazawa, T., Oshida, K., Ono, N., Ohsawa, K., Endo, M., and Bonnamy, S., "Structure and electrical resistivity of nano-carbon materials," Thin Solid Films, vol. 464-465, pp. 360-363, Oct. 2004.

Nam, Da Yeon, Kim, Su Hyo, Jeon, Yoo Sang, and Kim, Young Keun, "Microstructure and Magnetic Properties of CoFe Nanowires and Helical Nanosprings," IEEE Transactions on Magnetics, vol. 53 no. 11, pp. 2004104, Nov. 2017.

Nam, Dong Jin, Lee, Jae Hak, Lee, Jihye, and Yoo, Choong Don, "Fabrication of a flip chip solder bump using a thin mold and ultrasonic filling," Journal of Micromechanics and Microengineering, vol. 17 no. 9, pp. 1863-1869, Sept. 2007.

Nam, Gi-Jung, Seo, Meong-Hui, Ryu, Kwang-Hyun, and Kwak, No-Heung, "A New Laser Bonding Method of Anisotropic Conductive Films in Flat Panel Display and in Semiconductor Packaging," Proceedings of SPIE - The International Society for Optical Engineering, Volume 6107, Bellingham, WA, 2006, pp. 610701-1-610701-15.

Nam, HyunWook, "Thermal Fatigue Life Prediction of ACF bonding Flip Chip Packaging," Key Engineering Materials, vol. 306-308, pp, 1049-1054, 2006.

Nam, N. D., Bui, Q. V., Nhan, H. T., Phuong, D. V., and Bian, M. Z., "Effect of Pd Interlayer on Electrochemical Properties of ENIG Surface Finish in 3.5 wt.% NaCl Solution," Journal of Electronic Materials, vol. 43 no. 9, pp. 3307-3316, Sept. 2014.

Namazu, Takahiro, Isono, Yoshitada, and Tanaka, Takeshi, "Plastic Deformation of Nanometric Single Crystal Silicon Wire in AFM Bending Test at Intermediate Temperatures," Journal of Microelectromechanical Systems, vol. 11 no. 2, pp. 125-135, Apr. 2002.

Namiki, Kenji, and Ohgaki, Masataka, "Advanced Technology for Enforcement of RoHS Directive: Characterization of Lead-free Solder," Journal of the Surface Finishing Society of Japan , vol. 58 no. 8, pp. 445-449, 2007.

Nandagopal, Bala, Mei, Zequn, and Teng, Sue, "Microstructure and Thermal Fatigue Life of BGAs with Eutectic Sn-Ag-Cu Balls Assembled at 210~C with Eutectic Sn-Pb Solder Paste," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 875-883.

Nandagopal, Bala, Chiang, Diana, Teng, Sue, Thune, Peter, Anderson, Leo, Jay, Roger, and Bath, Jasbir, "Study on Assembly, Rework Process, Microstructures and Mechanical Strength of Backward Compatible Assembly," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 861-870.

Nanev, Chr., and Iwanov, D., "Growth of Zinc and Cadmium Whiskers from the Vapour Phase on a Single Crystal Substrate of the Same Material," Physica Status Solidi, vol. 23 no. 2, pp. 663-673, 1967.

Nanev, Chr., and Milchev, A., "Silver-Mercury Whiskers," Physica Status Solidi (a), vol. 12 no. 1, pp. 291-297, July 16, 1972.

Nanev, Chr., "Thermal Recovery of Kinked Zinc Whiskers," Physica Status Solidi (a) , vol. 3 no. 2, pp. 493-501, 1970. https://doi-org.ezproxy.uky.edu/10.1002/pssa.19700030224

Nangalia, S., Koopman, N., Rogers, V., Beranek, M. W., Hager, H. E., Ledbury, E. A., Loebs, V. A., Miao, E. C., Tang, C. H., Pico, C. A., Swenson, E. J., Hatzis, D., Li, P., and Luck, C., "Fluxless, No Clean Assembly of Optoelectronic Devices with PADS," 1997 Proceedings 47th Electronic Components & Technology Conference, San Jose, CA, May 18-21, 1997, pp. 755-762.

Nannichi, Yasuo, "Erratum: Formation of Silicon Whiskers on the Sublimating Surface," Applied Physics Letters, vol. 3 no. 12, pp. 217, Dec. 15, 1963.

Nannichi, Yasuo, "Formation of Silicon Whiskers on a Subliminating Surface," Applied Physics Letters, vol. 3 no. 8, pp. 139-142, Oct. 15, 1963.

Naoi, Hiroyuki, Shaw, Denis M., Naoi, Yoshiki, Sakai, Shiro, and Collins, George J., "Growth of InAs on GaAs(1 0 0) by low-pressure metalorganic chemical vapor deposition employing in situ generated arsine radicals," Journal of Crystal Growth, vol. 250 no. 3-4, pp. 290-297, Apr. 2003.

Naoki, Tashiro, Kariya, Yoshiharu, and Kanda, Yoshihiko, "Fatigue life and fracture behavior of micro size Sn-Ag-Cu solder joint," Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, Volume 2, Portland, OR, July 6-8, 2011, pp. 707-712.

Naor, Adi, Eliaz, Noam, Gileadi, Eliezer, and Taylor, S. Ray, "Properties and Applications of Rhenium and Its Alloys," The AMMTIAC Quarterly, vol. 5 no. 1, pp. 11-15, xxxx.

Naor-Pomerantz, Adi, Eliaz, Noam, and Gileadi, Eliezer, "Electrodeposition of rhenium-tin nanowires," Electrochimica Acta , vol. 56 no. 18, pp. 6361-6370, July 15, 2011. https://doi.org/10.1016/j.electacta.2011.05.022

Napolskii, Kirill S., Roslyakov, Ilya V., Eliseev, Andrey A., Petukhov, Dmitry I., Lukashin, Alexey V., Chen, Shu-Fang, Liu, Chuan-Pu, and Tsirlina, Galina A., "Tuning the microstructure and functional properties of metal nanowire arrays via deposition potential," Electrochimica Acta, vol. 56 no. 5, pp. 2378-2384, Feb. 1, 2011.

Napp, D., "Lead Free Interconnect Materials for the Electronics Industry," SAMPE Journal, vol. 32 no. 2, pp. 59-65, Mar./Apr. 1996.

Napp, Duane, "Lead Free Interconnect Materials for the Electronics Industry," Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, Oct. 2-4, 1995, pp. 238-244.

Napp, Duane, "Lead Free Interconnect Materials for the Electronics Industry," Proceedings of the 1995 International SAMPE Technical Conference, Albuquerque, NM, Oct. 9-12, 1995, pp. 340-251.

Nardone, Keith, "Combating the military's tin whisker threat: no-lead strategies for power products," Military & Aerospace Electronics, Dec. 2008.

Nargi-Toth, Kathy, "A Matter of Degrees," Printed Circuit Design and Manufacture , vol. 23 no. 9, pp. 4, Sept. 2006.

Nargi-Toth, Kathy, "Consensus Management," Printed Circuit Design and Fab, vol. 26 no. 2, pp. 4, Feb. 2009.

Nargi-Toth, Kathy, "Consensus Management," Printed Circuit Design and Fab, vol. 26 no. 3, pp. xx-xx, Mar. 2009.

Nargi-Toth, Kathy, "Defining 'Green'," Printed Circuit Design and Fab, vol. 25 no. 4, pp. 4, Apr. 2008.

Nargi-Toth, Kathy, "EU Clears Brominated Flame Retardant for Use," Printed Circuit Design and Fab, vol. 25 no. 4, pp. 12, Apr. 2008.

Nargi-Toth, Kathy, "iNEMI Task Group To Address SnPb BGAs Availability," Printed Circuit Design and Manufacture, vol. 23 no. 12, pp. 10, Dec. 2006.

Nargi-Toth, Kathy, "iNEMI to Work on Early Failure Detection for Lead-Free Products," Printed Circuit Design and Fab, vol. 25 no. 5, pp. 10, May 2008.

Nargi-Toth, Kathy, "More States Draft Legislation to Enforce Electronic Recycling," Printed Circuit Design and Fab, vol. 25 no. 5, pp. 10, May 2008.

Nargi-Toth, Kathy, "Protecting Innovation," Printed Circuit Design and Manufacture , vol. 24 no. 1, pp. 4, Jan. 2007.

Nargi-Toth, Kathy, "RoHS Follow Up 'Arbitrary and Capricious,' Claims IPC," Printed Circuit Design and Fab, vol. 25 no. 5, pp. 8, May 2008.

Nargi-Toth, Kathy, "The Real Cost of RoHS," Printed Circuit Design and Fab, vol. 25 no. 6, pp. 8, June 2008.

Nargi-Toth, Kathy, "Time for a New Tool," Printed Circuit Design and Manufacture , vol. 23 no. 11, pp. 4, Nov. 2006.

Nargi-Toth, Kathy, "Waste Not, Want Not," Printed Circuit Design and Fab, vol. 25 no. 2, pp. 4, Feb. 2008.

Nascimento Jr., H., Santos, S. C., Sales, W. F., and Palma, E. S., "Influence of Two Hexavalent Chromium-Free Coating types on Mechanical Behavior of Bolted Joints," Journal of Testing and Evaluation, vol. 33 no. 3, pp. 168-173, May 2005.

Nash, Christopher, "Void Reduction: A Methodical and Reliable Approach," Global SMT and Packaging, vol. 16 no. 12, pp. 10-13, Dec. 2016.

Nash, Kevin, "Compliant Pin Technology Streamlines the Transition to Lead-free While Enhancing Production Efficiency," Autosplice.

Nash, Kim S., "Millions of Obsolete PCs Enter Waste Stream," Computerworld, vol. xx no. xx, pp. xx-xx, Apr. 10, 2000.

Nashrudin, Muhammad Naqib, Gan, Zhong Li, Abas, Aizat, Ishak, M. H. H., and Ali, M. Yusuf Tura, "Effect of hourglass shape solder joints on underfill encapsulation process: numerical and experimental studies," Soldering & Surface Mount Technology, vol. 32 no. 3, pp. 147-156, 2020.

Nasir, Norhayanti Mohd, Saud, Norainiza, Salleh, Mohd Arif Anuar Mohd, Derman, Mochd Nazree, Ramli, Mohd Izrul Izwan, and Said, Rita Mohd, "Influence of Silicon Nitride (Si3N4) Addition on Microstructure, Mechanical and Thermal Properties of Sn-0.7Cu Lead-free Solder," Applied Mechanics and Materials, vol. 754-755, pp. 530-534, Apr. 2015.

Nastovjak, Alla G., Shwartz, Nataliya L., and Titovskaya, Yana V., "Peculiarities of Vapor-Liquid-Solid Process Realization in Monte Carlo Model of Nanowhisker Growth," 2010 International Conference and Seminar on Micro/Nanotechnologies and Electron Devices, Novosibirsk, Russia, June 30-July 4, 2020, pp. 64-67.

National Center for Manufacturing Sciences Lead-free Solder Project, "NCMS Lead-free Solder Project," Surface Mount Technology (SMT) , vol. 14 no. 2, pp. 73-80, Feb. 2000.

National Center for Manufacturing Sciences Lead-free Solder Project, "NCMS Lead-free Solder Project," Surface Mount Technology (Special Supplement, SMT), vol. 14 no. 6, pp. 3-8, June 2000.

Naugler, Don, and Wetterman, Bob, "Ultra-Fine Pitch Reballing - What Needs to Change?," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 853-858.

Navarro, Christian, and Abramowitz, Harvey, "Failure Analysis of Eutectic and Pb-Free Solder Alloys after High Stress Exposure," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S31:03.

Navarro, Clarissa, "Development of a standard test method for evaluating conductive anodic filament (CAF) growth failure in PCBs," Circuit World, vol. 28 no. 2, pp. 14-18, 2002.

Navas, Deb, "The electronics industry 2005," Supply Chain Systems Magazine , vol. 25 no. 2, pp. 12-17, Feb. 2005.

Navazo, Juan Manuel Valero, Mendez, Gara Villalba, and Peiro, Laura Talens, "Erratum to: Material flow analysis and energy requirements of mobile phone material recovery processes," International Journal of Life Cycle Assessment, vol. 19 no. 3, pp. 721, Mar. 2014.

Navazo, Juan Manuel Valero, Mendez, Gara Villalba, and Peiro, Laura Talens, "Material flow analysis and energy requirements of mobile phone material recovery processes," International Journal of Life Cycle Assessment , vol. 19 no. 3, pp. 567-579, Mar. 2014.

Naveed, Syed, Hoult, Anthony, and Trotter, Victor, "Automated Selective Soldering of Lead-Tin and Lead-Free Solders - A Comparative Study Using Diode Laser and Xenon Lamp," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 41-46.

Nawa, Kazunari, and Ohkita, Masakazu, "A new small CTE system from COPNA resin/E-glass fabrics," Circuit World , vol. 25 no. 1, pp. 47-54, 1998.

Nawghane, Chinmay, Vandevelde, Bart, Labie, Riet, Allaert, Bart, Lauwaert, Ralph, Vanhee, Filip, Pissoort, Davy, De Wolf, Ingrid, and Mehner, Jan, "Vibration Fatigue Analysis of Lead-Free CSP Assemblies on Printed Circuit Board," 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Toulouse, France, Apr. 15-18, 2018, pp. xx-xx.

Nayebi, P., Shamshirsaz, M., and Zaminpeyma, E., "Molecular Dynamics Simulation of Mechanical Properties of Gold Nanowire," 2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS , Seville, Spain, May 5-7, 2010, pp. xx-xx.

Nazeri, Muhammad Firdaus Mohd, Yahaya, Muhamad Zamri, Gursel, Ali, Cheani, Fakhrozi, Masri, Mohamad Najmi, and Mohamad, Ahmad Azmin, "Corrosion characterization of Sn-Zn solder: a review," Soldering & Surface Mount Technology, vol. 31 no. 1, pp. 52-67, 2019.

Nazeri, Muhammad Firdaus Mohd, and Mohamad, Ahmad Azmin, "Corrosion resistance of ternary Sn-9Zn-xIn solder joint in alkaline solution," Journal of Alloys and Compounds, vol. 661, pp. 516-525, Mar. 15, 2016.

Nazeri, Muhammad Firdaus Mohd, and Mohamad, Ahmad Azmin, "Effect of exposure to alkaline solution on Sn-9Zn solder joints," Journal of Materials Processing Technology, vol. 219, pp. 164-172, May 2015.

Nazeri, Muhammad Firdaus Mohd, Ismail, Ahmad Badri, and Mohamad, Ahmad Azmin, "Effect of polarizations on Sn-Zn solders alloys in alkaline electrolyte," Journal of Alloys and Compounds, vol. 606, pp. 278-287, Sept. 5, 2014.

Nazri, S. F., and Salleh, M. A. A. Mohd, "The Effects of Gallium Additions on the Microstructure of Lead-Free Solder Materials: A Short Review," Solid State Phenomena, vol. 280, pp. 187-193, Aug. 2018.

Ndieguene, Assane, Morissette, Jean-Francois, Normand, Nathalie, and Sylvestre, Julien, "In-Situ Solder Surface Tension Measurements Using Mechanical Resonances," 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Montpelier, France, Apr. 18-20, 2016, pp. xx-xx.

Ndip, Ivan, Ohnimus, Florian, Guttowski, Stephan, and Reichl, Herbert, "Minimizing Electromagnetic Interference in Power-Ground Cavities," Electrical Design of Advanced Packaging and Systems Symposium, Seoul, Korea, Dec. 10-12, 2008, pp. 128-131.

Nduwimana, Alexis, and Wang, Xiao-Qian, "Tunable electronic properties of silicon nanowires under strain and electric bias," AIP Advances, vol. 4 no. 7, pp. 077122-1-077122-7, July 2014.

Neathway, Paul, Butterfield, Andrew, Chu, Quyen, Tokotch, Nick, Haddick, Robert, Peallat, Jean-Marc, Shea, Chrys, and Chouta, Prashant, "A Study of 0201's and Tombstoning in Lead-Free Systems," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 293-301.

Neathway, Paul, Butterfield, Andrew, Chu, Quyen, Tokotch, Nick, Haddick, Robert, Peallat, Jean-Marc, Shea, Chrys, and Chouta, Prashant, "A Study of 0201's and Tombstoning in Lead-Free Systems," 2008 Pan Pacific Microelectronics Symposium & Exhibit, Kauai, HI, Jan. 22-24, 2008, pp. xx-xx.

Neathway, Paul, Butterfield, Andrew, Chu, Quyen, Tokotch, Nick, Haddick, Robert, Peallat, Jean-Marc, and Shea, Chrys, "A Study of 0201's and Tombstoning in Lead-Free Systems, Phase II Comparison of Final Finishes and Solder Past Formulations," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference , Las Vegas, NV, Apr. 1-3, 2008, pp. S07:02.

Neathway, Paul, Butterfield, Andrew, Chu, Quyen, Tokotch, Nick, Haddick, Robert, Peallat, Jean-Marc, Shea, Chrys, and Chouta, Prashant, "A Study of 0201s and Tombstoning in Pb-Free Systems," Circuits Assembly, vol. 18 no. 10, pp. 26, 28, 30, 32, Oct. 2007.

Nebol'sin, V. A., and Shchetinin, A. A., "A Mechanism of Quasi-One-Dimensional Vapor Phase Growth of Si and GaP Whiskers," Inorganic Materials, vol. 44 no. 10, pp, 1033-1040, Oct. 2008.

Nebol'sin, V. A., Shchetinin, A. A., Korneeva, A. N., Dunaev, A. I., Dolgachev, A. A., Sushko T. I., and Tatarenkov, A. F., "Development of Lateral Faces during Vapor-Liquid-Solid Growth of Silicon Whiskers," Inorganic Materials, vol. 42 no. 4, pp. 339-345, Apr. 2006.

Nebol'sin, Valery A., Dunaev, Alexander I., Tatarenkov, Alexander F., and Shmakova, Svetlana S., "Scenarios of stable Vapor-Liquid Droplet-Solid Nanowire growth," Journal of Crystal Growth, vol. 450, pp. 207-214, Sept. 15, 2016.

Negm, S. E., Mady, H., and Bahgat, A. A., "Influence of the addition of indium on the mechanical creep of Sn-3.5%Ag alloy," Journal of Alloys and Compounds, vol. 503 no. 1, pp. 65-70, July 30, 2010.

Negm, Samia E., "Influence of silver additions on electrical, mechanical and structures properties of rapidly solidified Sn-0.7%Cu alloy from melt," Journal of Materials Science: Materials in Electronics, vol. 23 no. 1, pp. 94-99, Jan. 2012.

Neher, Wolfgang, "New Accelerating Test Methods for Board Level Solder Joints and Thermal Caused Failure Mechanisms in High Temperature Electronics," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 180-186.

Neilsen, Michael K., and Vianco, Paul T., "UCPD Model for Pb-Free Solder," Journal of Electronic Packaging, vol. 136 no. 4, pp. 041006-1-041006-8, Dec. 2014.

Neilsen, Michael, and Vianco, Paul, "Unified Creep Plasticity Damage (UCPD) Model for SAC396 Solder," Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 1 , Burlingame, CA, July 16-18, 2013, pp. V001T04A004-1-V001T04A004-7.

Sandia Report SAND2013-1082C)

Neilsen, Michael, and Vianco, Paul, "Unified Creep Plasticity Damage (UCPD) Model for SAC396 Solder (presentation)," Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 1, Burlingame, CA, July 16-18, 2013, pp. xx-xx. (Sandia Report SAND2013-5400C)

Neilsen, Mike, and Vianco, Paul, "Simulating Solder Fatigue Crack Initiation and Growth in a Surface Mount Package," IPC Conference on Solder and Reliability, Costa Mesa, CA, Nov. 13-14, 2013, pp. xx-xx. (Sandia Report SAND2013-8751C)

Neizvestny, I. G., "Semiconductor Nanowire Sensors," Russian Microelectronics, vol. 38 no. 4, pp. 223-238, July 2009. https://doi.org/10.1134/S1063739709040015

Nekahi, A., Marashi, S. P. H., and Fatmesari, D. Haghshenas, "High yield polyol synthesis of round- and sharp-end silver nanowires with high aspect ratio," Materials Chemistry and Physics, vol. 184, pp. 130-137, Dec. 1, 2016.

Nelle, Sandra, Pugliesi-Garcia, Thiago, Schafsteller, Britta, and Ramos, Gustavo, "IMC Study of Mid-Phosphorous and High-Phosphorous ENIG Finishes," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 881-894.

Nelson, Brian, "Halogen Free Laminates: Evaluating Some Non-Environmental Reasons for Use in PCBs and Substrates," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Nelson, Dave, Pallavicini, Hector, Zhang, Qian, Friesen, Paul, and Dasgupta, Abhijit, "Manufacturing and Reliability of Pb-Free and Mixed System Assemblies (SnPb/Pb-Free) in Avionics Environments," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 741-749.

Nelson, Dave, Pallavicini, Hector, Zhang, Qian, Friesen, Paul, and Dasgupta, Abhijit, "Manufacturing and Reliability of Pb-Free and Mixed System Assemblies (SnPb/Pb-Free) in Avionics Environments," Journal of SMT, vol. 17 no. 1, pp. 17-24, Jan. 2004.

Nelson, J. Scott, "Guidelines for Establishing a Lead-Free Wave Soldering Process for High-Reliability Applications," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

Nelson, J. Scott, "Guidelines for establishing a lead-free wave soldering process for high-reliability," Global SMT and Packaging, vol. 10 no. 1, pp. 10-12,14-17, Jan, 2010.

Nelson, Rick, "Getting the Lead Out Goes Slowly," Test & Measurement World , vol. 20 no. 12, pp. 17-18, Oct. 2000.

Nelson, Ryan, "UBM Measurement by Microbeam X-ray Fluorescence," Advanced Packaging, vol. 15 no. 10, pp. xx-xx, Oct. 2006.

Neophytou, Neophytos, and Kosina, Hans, "On the Interplay Between Electrical Conductivity and Seebeck Coefficient in Ultra-Narrow Silicon Nanowires," Journal of Electronic Materials, vol. 41 no. 6, pp. 1305-1311, June 2012.

Neophytou, Neophytos, and Kosina, Hans, "Thermoelectric Properties of Scaled Silicon Nanowires Using the sp3d5s*-SO Atomistic Tight-Binding Model and Boltzmann Transport," Journal of Electronic Materials, vol. 40 no. 5, pp. 753-758, May 2011.

Neri, M. A., and Carreno, C., "Microstructure of a Lead-Free Solder Alloy Sn-57.5Bi-0.5Ag Prepared by Foundry and Mechanical Alloying Processes," Modeling, Control, and Optimization in Ferrous and Non-Ferrous Industry, Chicago, IL, Nov. 9-12, 2003, pp. 561-567.

Nestler, M. C., Prenzel, G., and Seitz, T., "HVOF-Spraying vs. Hard Chrome Plating- Coating Characteristics and Aircraft Applications," Proceedings of the 15th International Thermal Spray Conference, Volume 2, Nice, France, May 25-29, 1998, pp. 1073-1078.

Neto, J. Quariguasi Frota, Walther, G., Bloemhof, J., van Nunen, J. A. E. E., and T. Spengler, "From closed-loop to sustainable supply chains: the WEEE case," International Journal of Production Research, vol. 48 no. 15, pp. 4463-4481, Aug. 2010.

Neu, R. W., Scott, D. T., and Woodmansee, W. M., "Thermomechanical Behavior of 96Sn-4Ag and Castin Alloy," Journal of Electronic Packaging, Transactions of the ASME, vol. 123 no. 3, pp. 238-246, Sept. 2001.

Neu, Richard W., Whitelaw, Robert S., and Scott, Daniel T., "Deformation Behavior of Two Lead-free Solders," Advances in Electronic Packaging 1997, Volume 2, Kohala Coast, Hawaii, June 15-19, 1997, pp. 1629-1631.

Neugebauer, C. A., "Tensile Properties of Thin, Evaporated Gold Films," Journal of Applied Physics, vol. 31 no. 6, pp. 1096-1101, June 1960.

Neugebauer, Soren, and Mengel, Manfred, "Spectroscopic and Thermal Analysis of Halogen-free Printed Circuit Boards," CircuiTree, vol. 16 no. 3, pp. xx, Mar. 2003.

Neuhaus, Herbert J., and Bauer, Charles E., "Alternatives to Solder in Interconnect, Packaging, and Assembly," 18th Annual Pan Pacific Microelectronics Symposium, Wailea-Makena, HI, Jan. 22-24, 2013, pp. xx-xx.

Neuhaus, Herbert J., and Bauer, Charles E., "Alternatives to Solder in Interconnect, Packaging, and Assembly," SMTA Journal, vol. 26 no. 1, pp. 31-36, 2013.

Neumann, H.-G., "Whisker growth from thin evaporated cadmium films," Thin Solid Films , vol. 8 no. 5, pp. R55-R58, Nov. 1971.

Neves, Bob, "From the Lab - Bob Neves: Is Lead-Free Really Free?," CircuiTree , vol. 17 no. 8, pp. xx, Aug. 2004.

Neves, Bob, "From the Lab - Bob Neves: The Halogen-Free Diet," CircuiTree , vol. 17 no. 11, pp. xx, Nov. 2004.

Neves, Bob, "Gorilla Reliability," CircuiTree, vol. 21 no. 4, pp. xx-xx, Apr. 2008.

Neves, Bob, "PCB Insulation System Reliability, Electrochemical Migration & Associated Testing Methodology," Overcoming the Reliability Challenge: An IPC Summit, Andover, MA, Apr. 15, 2008, pp. xx-xx.

Neveu, B., Lallemand, F., Poupon, G., and Mekhalif, Z., "Electrodeposition of Pb-free Sn alloys in pulsed current," Applied Surface Science, vol. 252 no. 10, pp. 3561-3573, Mar. 15, 2006.

Nevison, Gary, "2008 - A Busy Year for Legislation," Electronics World, vol. 114 no. 1866, pp. 14-15, June 2008.

Nevison, Gary, "Backyard or Roadside Recycling," Electronics World, vol. 114 no. 1872, p 8, Dec. 2008.

Nevison, Gary, "Batteries Directive - Part 1," Electronics World, vol. 114 no. 1867, pp. 15, July 2008.

Nevison, Gary, "Batteries Directive - Part 2," Electronics World, vol. 114 no. 1868, pp. 14-15, Aug. 2008.

Nevison, Gary, "China," Electronics World, vol. 113 no. 1858, pp. 51, Oct. 2007.

Nevison, Gary, "China," Electronics World, vol. 113 no. 1859, pp. 51, Nov. 2007.

Nevison, Gary, "Digging Deeper," Electronics World, vol. 114 no. 1862, pp. 16-17, Feb. 2008.

Nevison, Gary, "Eco-design of Energy Using Products," Electronics World, vol. 114 no. 1865, pp. 16, May 2008.

Nevinson, Gary, "Green Takes Root in Electronics Industry," EDN, vol. 53 no. 21, pp. S6,S8,S10, Oct, 2008.

Nevison, Gary, "How compliance can complicate design," Electronic Product Design , vol. xx no. xx, pp. xx-xx, Aug. 1, 2007.

Nevison, Gary, "How far has RoHS come?," EE Times - Asia, vol. xx no. xx, pp. xx-xx, Oct. 1, 2007.

Nevison, Gary, "Impact of ROHS, REACH, EuP on electronics industry in 2009," Electronic Business, Feb. 18, 2009.

Nevison, Gary, "Impact on Design," Electronics World, vol. 113 no. 1861, pp. 17, Jan. 2008.

Nevison, Gary, "Impact on Design - the WEEE Directive / Recycling," Electronics World , vol. 114 no. 1864, pp. 16, Apr. 2008.

Nevison, Gary, "Korea RoHS Update," Electronics Weekly, Oct. 16, 2008.

Nevison, Gary, "Lighting - Environmental and Legislative Issues (Part 2)," Electronics World, vol. 114 no. 1870, p 12-13, Oct. 2008.

Nevison, Gary, "Lighting - Environmental and Legislative Issues (Part1)," Electronics World, vol. 114 no. 1869, p 14-15, Sept. 2008.

Nevison, Gary, "Living with RoHS - the big questions," Electronics World, vol. 112 no. 1843, pp. 56, July 2006.

Nevison, Gary, "Living with RoHS - the big questions," Electronics World, vol. 112 no. 1849, pp. 55, Jan. 2007.

Nevison, Gary, "Living with RoHS - the big questions," Electronics World, vol. 113 no. 1851, pp. 56, Mar. 2007.

Nevison, Gary, "Love it or Hate it, Global Environmental Legislation is Here to Stay," Wireless Design & Development, pp. 16,18, Jan.-Feb. 2010.

Nevison, Gary, "Ongoing Reviews Keep the Electronics Sector Out of the Comfort Zone," Electronics World, vol. 114 no. 1863, pp. 17, Mar. 2008.

Nevison, Gary, "REACH," Electronics World, vol. 113 no. 1855, pp. 50, July 2007.

Nevison, Gary, "REACH and ROHS restrictions merging?," Electronic Business, Jan. 21, 2009.

Nevison, Gary, "REACH versus RoHS for Substance Restriction," Electronics World, vol. 114 no. 1871, p 13, Nov. 2008.

Nevison, Gary, "Revisions to the RoHS Directive are set to clarify original questions," New Electronics, vol. xx no. x, pp. xx, Feb. 23, 2009.

Nevison, Gary, "ROHS 2: Changes ahead," Electronic Business, Dec. 22, 2008.

Nevison, Gary, "RoHS All Over the World," Electronics World, vol. 113 no. 1860, pp. 51, Dec. 2007.

Nevison, Gary, "RoHS & WEEE - Impact on distribution," SMART Group "All You Ever Wanted to Know About Lead-Free" Seminar, High Wycombe, United Kingdom, Nov. 1, 2005.

Nevison, Gary, "Rohs and WEEE Directives: What it means to distributors & their customers," Premier Farnell plc.

Nevison, Gary, "ROHS enforcement getting more forceful," Electronic Business , Aug. 12, 2008.

Nevison, Gary, "ROHS exemptions announced by EC--What goes, what stays, what's new," Electronic Business, Mar. 25, 2009.

Nevison, Gary, "RoHS Living with RoHS - the big questions," Electronics World, vol. 112 no. 1844, pp. 43, Aug. 2006.

Nevison, Gary, "RoHS Living with RoHS - the big questions," Electronics World, vol. 112 no. 1845, pp. 41, Sept. 2006.

Nevison, Gary, "RoHS Living with RoHS - the big questions," Electronics World, vol. 112 no. 1846, pp. 45, Oct. 2006.

Nevison, Gary, "RoHS Living with RoHS - the big questions," Electronics World, vol. 112 no. 1847, pp. 47, Nov. 2006.

Nevison, Gary, "RoHS Living with RoHS - the big questions," Electronics World, vol. 112 no. 1848, pp. 55, Dec. 2006.

Nevison, Gary, "RoHS Living with RoHS - the big questions," Electronics World, vol. 112 no. 1849, pp. 55, Jan. 2007.

Nevison, Gary, "RoHS Living with RoHS - the big questions," Electronics World, vol. 112 no. 1850, pp. 56, Feb. 2007.

Nevison, Gary, "RoHS Living with RoHS - the big questions," Electronics World, vol. 113 no. 1853, pp. 48, May 2007.

Nevison, Gary, "RoHS Living with RoHS - Tougher Laws on Batteries," Electronics World , vol. 113 no. 1854, pp. 44, June 2007.

Nevison, Gary, "ROHS ? More harm than good?," Electronic Business, Mar. 31, 2008.

Nevison, Gary, "RoHS Recast Guidance: Providing Coherent Advice to Design Engineers," ECN, vol. 55 no. 7, pp. 18, June 2011.

Nevison, Gary, "RoHS What's All the Fuss About?," Electronics World, vol. 112 no. 1837, pp. 38, Jan. 2006.

Nevison, Gary, "RoHS What's All the Fuss About?," Electronics World, vol. 112 no. 1838, pp. 35, Feb. 2006.

Nevison, Gary, "RoHS What's All the Fuss About?," Electronics World, vol. 112 no. 1839, pp. 49, Mar. 2006.

Nevison, Gary, "RoHS What's All the Fuss About?," Electronics World, vol. 112 no. 1840, pp. 51, Apr. 2006.

Nevison, Gary, "RoHS What's All the Fuss About?," Electronics World, vol. 112 no. 1841, pp. 50, May 2006.

Nevison, Gary, "RoHS What's All the Fuss About?," Electronics World, vol. 112 no. 1842, pp. 38, June 2006.

Nevison, Gary, "RoHS What's All the Fuss About?," Electronics World, vol. 112 no. 1843, pp. 35, July 2006.

Nevison, Gary, "RoHS2, EuP and Reach among legislation to watch 2009," Electronics Weekly, Jan. 13, 2009.

Nevison: Gary, "scoping out the Environmental Design of Electrical Equipment Act," EDN, vol. 54 no. 18, pp. 16, Sept. 17, 2009.

Nevison, Gary, "The first year in force," Electronics World, vol. 113 no. 1856, pp. 44, Aug. 2007.

Nevison, Gary, "The RoHS & WEEE Directives - A progress report," 2005.

Nevison, Gary, "WEEE - The big questions," Electronics World, vol. 113 no. 1857, pp. 56, Sept. 2007.

Nevison, Gary, "What REACH expects from a US company," Electronic Business, Mar. 2, 2009.

Newasekar, Rahul A., Ramkumar, S. Manian, and Ghaffarian, Reza, "Effect of Solder Paste and Surface Finish on 0201 Assembly Process Defects," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 106-119.

Newby, Kenneth R., "Functional Chromium Plating," Metal Finishing, vol. 103 no. 6A, pp. 164-174, Summer 2005.

Newby, Kenneth R., "Functional Chromium Plating," Metal Finishing, vol. 105 no. 10, pp. 182-191, Oct. 2007.

Newell, Cindy, "The cost of compliance," Green SupplyLine, June 1, 2006.

Newell, Cindy, "The cost of compliance," Electronics Supply & Manufacturing , June 2006.

Newkirk, Arthur E., "Hardness of Substances in the Ideal State," Science, New Series, vol. 124 no. 3213, pp. 172-173, July 1956.

Newman, Keith, "BGA Brittle Fracture - Alternative Solder Joint Integrity Test Methods," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 2, Orlando, FL, May 31-June 3, 2005, pp. 1194-1201.

Newman, Keith, "Board-Level Solder Joint Reliability of High Performance Computers under Mechanical Loading," International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems , Freiburg, Germany, Apr. 20-23, 2008, pp. xx-xx.

Newman, Keith, "WILL your bag fall off?," Electronics Manufacture and Test, pp. xx-xx, Feb. 2006.

Newton, Thomas, Bergman, David, and Crawford, Jack, "Lead free standards - An update," EMasia, Jan. 2007.

Newton, Tom, Bergman, David, and Crawford, Jack, "Lead-free Standards Update," Printed Circuit Design and Manufacture , vol. 22 no. 9, pp. 14, Sept. 2005.

Newton, Tom, Bergman, David, and Crawford, Jack, "Pb-free Standards Update," Circuits Assembly, vol. 16 no. 9, pp. 56, Sept. 2005.

Ng, Chee Weng Wayne, Marbella, Baterna Carlo, and Koh, Liang Kng Ian, "Evaluation of ENEPIG Substrate for Handheld Product Application," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 305-310.

Ng, Chee Weng Wayne, and Sweatman, Keith, "Study of Pb-free HASL PCB Surface Appearance Impact on 2nd level Interconnect Solderability," 2012 IEEE 14th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 5-7, 2012, pp. 676-680.

Ng, Eric, and Ng, K. F., "AC Power Supply Cords," 2009 IEEE Symposium on Product Compliance Engineering Proceedings, Toronto, Ontario, Oct. 26-28, 2009, pp. xx-xx.

Ng, Hun Shen, Tee, Tong Yan, Goh, Kim Yong, Luan, Jing-en, Reinikainen, Tommi, Hussa, Esa, and Kujala, Arni, "Absolute and Relative Fatigue Life Prediction Methodology for Virtual Qualification and Design Enhancement of Lead-free BGA," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 1282-1291.

Ng, Siu-Lung, Vaidya, Amit, Venkataraman, Vivek, Murcko, Bob, Srihari, K., and Rai, Raj, "Environmental Conservation Through Lead-Free Electronics Manufacturing," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 189-194.

Ng, Wayne C. W., Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Takatoshi, Sato, Michihiro, Gourlay, Christopher, and Belyakov, Sergey, "Dissolution in Service of the Copper Substrate of Solder Joints," 2016 IEEE 18th Electronics Packaging Technology Conference, Singapore, Nov. 30-Dec. 3, 2016, pp. 388-393.

Ng, Wayne, Zeng, Guang, Nishimura, Takatoshi, Sweatman, Keith, McDonald, Stuart D., and Nogita, Kazuhiro, "The Beneficial Effect of Zn Additions on the Microstructure of SnCu and SnCuNi Solder Joints to Cu Substrates," 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference, Kyoto, Japan, Apr. 14-17, 2015, pp. 809-813.

Ng, Y. S., Chin, S. K., and Rosazlan, "Finite Element Based Solder Joint Fatigue Life Predictions for MLPQ Packages," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 696-703.

Nghiem, Giang Minh, Aasmundtveit, Knut E., Kristiansen, Helge, and Bazilchuk, Molly, "Anisotropic Conductive Film (ACF) bonding: effect of interfaces on contact resistance," 2018 7th Electronic System-Integration Technology Conference, Dresden, Germany, Sept. 18-21, 2018, pp. xx-xx.

Nghiem, Giang M., Nguyen, Huyen T., Aasmundtveit, Knut, and Kristiansen, Helge, "Simulation of Adhesive Flow during ACF Bonding Process for Display Interconnect," 2016 6th Electronic System-Integration Technology Conference, Grenoble, France, Sept. 13-15, 2016, pp. xx-xx.

Ngoh, S. L., Zhou, W., and Pang, J. H. L., "Effect of Stress State on Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Cu Substrates Coated with Electroless Ni Immersion Au," Journal of Electronic Materials, vol. 37 no. 12, pp. 1843-1850, Dec. 2008.

Ngoh, S. L. Zhou, W., Pang, H. L., and Shi, X. Q., "Growth of Intermetallic Compounds during Isothermal Annealing of an Sn-Ag-Cu Lead-free Solder," Soldering & Surface Mount Technology, vol. xx no. xx, pp. xx-xx, 2004.

Ngoh, S. L., Zhou, W., Pang, H. L., Spowage, A. C., and Li, J., "Stress Effect on Growth of IMCs at Interfaces Between Sn-Ag-Cu Lead Free Solder and Cu Substrate," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2, Singapore, Dec. 7-9, 2005, pp. 455-460.

Nguena, Elodie, Danovitch, David, Sylvestre, Julien, Langlois, Richard, and Martel, Serge, "Gallium Liquid Metal Embrittlement of Tin-based Solder Alloys," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 51 no. 12, pp. 6222-6233, Dec. 2020. https://doi.org/10.1007/s11661-020-06041-3

Nguty, T. A., Salam, B., Rajkumar, D., Ekere, N. N., Currie, M. A., and Steen, H. A. H., "The Rheology and Printing Performance of Lead-Free Solder Pastes," Proceedings of the Technical Program NEPCON West 2000, Volume 1, Anaheim, CA, Feb. 27-Mar. 2, 2000, pp. 440-450.

Nguty, T. A., Budiman, S., Rajkumar, D., Solomon, R., Ekere, N. N., and Currie, M. A., "Understanding the Process Window for Printing Lead-Free Solder Pastes," 2000 Proceedings 50th Electronic Components & Technology Conference , Las Vegas, NV, May 21-24, 2000, pp. 1426-1435.

Nguty, Tennyson A., Salam, Budiman, Durairaj, Rajkumar, and Ekere, Ndy N., "Understanding the Process Window for Printing Lead-Free Solder Pastes," IEEE Transactions on Electronics Packaging Manufacturing, vol. 24 no. 4, pp. 249-254, Oct. 2001.

Nguyen, Cuong, "Via Optimization for Speed," Surface Mount Technology (SMT), vol. 22 no. 12, pp. 28,30-31, Dec. 2008.

Nguyen, Guy P., Williams, Janette R., and Gibson, Fredrick W., "Conductive Adhesives," Circuits Assembly, vol. 4 no. 1, pp. 36-38,41, Jan. 1993.

Nguyen, Guy P., Williams, Janette R., and Gibson, Fredrick W., "Conductive Adhesives: Reliable and Economical Alternatives to Solder Paste for Electrical Applications," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume 1, San Jose, CA, Aug. 30-Sept. 2, 1992, pp. 310-317.

Nguyen, Guy P., Williams, Janette R., and Gibson, Fredrick W., "Conductive Adhesives: Reliable and Economical Alternatives to Solder Paste for Electrical Applications," Proceedings of the 1992 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 1847), San Francisco, CA, Oct. 19-21, 1992, pp. 510-517.

Nguyen, Guy P., Williams, Janette R., Gibson, Fredrick W., and Winster, Tony, "Electrical Reliability of Conductive Adhesive for Surface-Mount Applications," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume 1, San Jose, CA, Aug. 31-Sept. 2, 1993, pp. 561-566.

Nguyen, Guy P., Williams, Janette R., Gibson, Fredrick W., and Winster, Tony, "Electrical Reliability of Conductive Adhesive for Surface Mount Applications," Proceedings 1993 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 2105), Dallas, TX, Nov. 9-11, 1993, pp. 50-55.

Nguyen, Hoang-Vu, Eggen, Trym, and Aasmundtveit, Knut E., "Assembly of Transducer Array Using Anisotropic Conductive Film for Medical Imaging Applications," 2015 European Microelectronics Packaging Conference, Friedrichshafen, Germany, Sept. 14-16, 2015, pp. xx-xx.

Nguyen, Hoang-Vu, Kristiansen, Helge, Imenes, Kristin, and Aasmundtveit, Knut E., "Peel Adhesion and Reworkability of Anisotropic Conductive Adhesive for Flex-to-Flex Assembly in Medical Devices," 2020 IEEE 8th Electronics System-Integration Technology Conference, Tonsberg, Norway, Sept. 15-18, 2020, pp. xx-xx.

Nguyen, Hoang-Vu, Kristiansen, Helge, Lifjeld, Anders, Imenes, Kristin, and Aasmundtveit, Knut E., "Reworkable Anisotropic Conductive Adhesive for Assembly of Medical Devices," 2019 22nd European Microelectronics and Packaging Conference & Exhibition, Pisa, Italy, Sept. 16-19, 2019. pp. xx-xx.

Nguyen, Hoang-Vu, Kristiansen, Helge, Gakkestad, Jakob, Johannessen, Rolf, Hoivik, Nils, and Aasmundtveit, Knut E., "Spherical Polymer Particles in Isotropic Conductive Adhesives A Study on Rheology and Mechanical Aspects," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Nguyen, Hoang-Vu, Kristiansen, Helge, Johannessen, Rolf, Andreassen, Erik, Larsson, Andreas, Hoivik, Nils, and Aasmundtveit, Knut E., "Temperature Dependence of Mechanical Properties of Isotropic Conductive Adhesive Filled with Metal Coated Polymer Spheres," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 639-644.

Nguyen, Jennifer, Geiger, David, Rooney, Dan, and Shangguan, Dongkai, "A study of thermo-mechanical reliability of lead-free PTH solder joints," Soldering & Surface Mount Technology, vol. 21 no. 2, pp. 39-47, 2009.

Nguyen, Jennifer, Aranda, Ranilo, Geiger, David, and Kurwa, Murad, "Assembly Process Feasibility of Low/No Silver Alloy Solder Paste Materials," IPC APEX Expo 2012, San Diego, CA, Feb. 28-Mar. 1, 2012, pp. xx-xx.

Nguyen, Jennifer, Geiger, David, Rooney, Daniel, and Shangguan, Dongkai, "Backward Compatibility Study of Lead Free Area Array Packages with Tin-Lead Soldering Process," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S34-03-1-S34-03-9.

Nguyen, Jennifer, "Evaluation of Lead Free Solder Paste Materials for PCBA," IPC APEX Expo Technical Conference 2011, Las Vegas, NV, April 12-14, 2011, pp. xx-xx.

Nguyen, Jennifer, Aranda, Ranilo, Geiger, David, and Murad Kurwa, "Feasibility of Low/No Silver Alloy Solder Paste Materials," Surface Mount Technology (SMT), vol. 29 no. 3, pp. 18,20-22,24,26-29, Mar. 2014.

Nguyen, Jennifer, Rooney, Dan, and Shangguan, Dongkai, "Impact of Hole-Fill and Voiding on PTH Solder Joint Reliability," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S21:02.

Nguyen, Jennifer, Geiger, David, Willie, Dennis, and Kurwa, Murad, "No-Clean Flux residue And Reliability - An EMS Perspective," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 837-842.

Nguyen, Jennifer, Geiger, David, and Kurwa, Murad, "Optimizing PTH Hole-Fill Using Lead-Free Wave Soldering," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 1027-1032.

Nguyen, Jennifer, Thalhamer, Robert, Geiger, David, Rooney, Dan, and Shangguan, Dongkai, "Process and Reliability Study of Lead-Free Wave Soldering for Large Thick Boards," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 136-146.

Nguyen, Jennifer, Geiger, David, Rooney, Daniel, and Shangguan, Dongkai, "Reliability of Mixed-alloy Solder Joints," Surface Mount Technology (SMT), vol. 21 no. 4, pp. 22, 24-26, Apr. 2007.

Nguyen, Jennifer, Marin, Hector, Geiger, David, Mohammed, Anwar, and Kurwa, Murad, "Reliability Study of Bottom Terminated Components," IPC APEX Expo 2014, Las Vegas, NV, Mar. 25-27, 2014, pp. xx-xx.

Nguyen, Jennifer, Geiger, David, Rooney, Daniel, and Shangguan, Dongkai, "Reliability Study of Lead-Free Area Array Packages with Tin-Lead Soldering Processes," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 433-438.

Nguyen, Jennifer, Geiger, David, and Kurwa, Murad, "Reliability Study of Low Silver Alloy Solder Pastes," apex ?

Nguyen, Jennifer, Geiger, David, Rooney, Daniel, and Shangguan, Dongkai, "Solder Joint Characteristics and Reliability of Lead-Free Area Array Packages Assembled at Various Tin-Lead Soldering Process Conditions," IEEE Transactions on Electronics Packaging Manufacturing, vol. 31 no. 3, pp. 227-239, July 2008.

Nguyen, Jennifer, Geiger, David, Rooney, Daniel, and Shangguan, Dongkai, "Solder Joint Characteristics and Reliability of Lead-Free Area Array Packages Assembled Under Various Tin-Lead Soldering Process Conditions," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1340-1349.

Nguyen, Jennifer, Geiger, David, and Kurwa, Murad, "Voiding Mitigation for Bottom Terminated Components," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 895-900.

Nguyen, Jennifer, Thalhamer, Robert, Geiger, David, Rooney, Dan, and Shangguan, Dongkai, x "Working with Large, Thick PCBs," Surface Mount Technology (SMT) , vol. 22 no. 4, pp. 26-28, Apr. 2008.

Nguyen, L., Walberg, R., Lin, Z., Koh, T., Bong, YY, Chua, MC, and Yeoh, JJ, "A Structured Approach to Lead-Free IC Assembly Transitioning," Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium, San Jose, CA, July 17-18, 2002, pp. 215-222.

Nguyen, L., Walberg, R., Zhou, L., Koh, T., "Board Level Reliability of Components with Matte Tin Lead Finish," 2003 Proceedings 53rd Electronic Components & Technology Conference , New Orleans, LA, May 27-30, 2003, pp. 346-352.

Nguyen, My N.,and Grosse, Michael B., "Low Moisture Polymer Adhesive for Hermetic Packages," 1992 Proceedings 42nd Electronic Components & Technology Conference, San Diego, CA, May 18-20, 1992, pp. 239-244.

Nguyen, My, and Brandi, Jason, "TIM1 Reliability of Polymer Solder," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , San Diego, CA, May 30-June 1, 2012, pp. 1250-1254.

Nguyen, Quang, Park, Seungbae, and Nguyen, Tung, "Characterization of Crack Growth in BGA under Drop Impact," Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 1, Burlingame, CA, July 16-18, 2013, pp. V001T05A002-1-V001T05A002-6.

Nguyen, T. T., Yu, D., and Park, S. B., "Characterizing the Mechanical Properties of Actual SAC105, SAC305, and SAC405 Solder Joints by Digital Image Correlation," Journal of Electronic Materials, vol. 40 no. 6, pp. 1409-1415, June 2011.

Nguyen, Tung T., and Park, Seungbae, "Characterization of elasto-plastic behavior of actual SAC solder joints for drop test modeling," Microelectronics Reliability, vol. 51 no. 8, pp. 1385-1392, Aug. 2011.

Nguyen, Tung T., and Park, Seungbae, "Characterization of the Mechanical Properties of Actual Solder Joints Using DIC," 2011 IEEE 61st Electronic Components and Technology Conference , Lake Buena Vista, FL, May 31-June 3, 2011, pp. 2126-2129.

Nguyen, Van Luong, Chung, Chin-Sung, and Kim, Ho-Kyung, "Comparison of the fracture toughness of Cu6Sn5 intermetallic compound as measured by nanoindentation and other methods," Materials Letters , vol. 162, pp. 185-190, Jan. 1, 2016.

Nguyen, Van Luong, and Kim, Ho-Kyung, "Effect of Thermal Aging on the Mechanical Properties of Sn3.0Ag0.5Cu/Cu Solder Joints Under High Strain Rate Conditions," Journal of Electronic Materials, vol. 44 no. 7, pp. 2414-2421, July 2015.

Nguyen, Van Luong, Chung, Chin-Sung, and Kim, Ho-Kyung, "Mechanical Behavior of Sn-3.0Ag-0.5Cu/Cu Solder Joints After Isothermal Aging," Journal of Electronic Materials, vol. 45 no. 1, pp. 125-135, Jan. 2016.

Nguyen, Van Luong, and Kim, Ho-Kyung, "Mechanical Properties of Lead-Free Solder Joints Under High-Speed Shear Impact Loading," Journal of Electronic Materials, vol. 43 no. 11, pp. 4171-4178, Nov. 2014.

Nguyen, Van Luong, Chung, Chin-Sung, and Kim, Ho-Kyung, "The tensile impact properties of aged Sn-3Ag-0.5Cu/Cu solder joints," Microelectronics Reliability, vol. 55 no. 12 pt. B, pp. 2808-2816, Dec. 2015.

Ni, Chang, Ding, Hong, and Jin, Xuejun, "Super-plasticity via secondary twinning in magnesium nanowire revealed by molecular dynamics simulations," Computational Materials Science, vol. 111, pp. 163-174, Jan. 2016.

Ni, Chaolun, Zhu, Qi, and Wang, Jiangwei, "Mechanical property of metallic nanowires: the shorter is stronger and ductile," Materials Science and Engineering: A, vol. 733, pp. 164-169, Aug. 22, 2018.

Ni, Jiamin, Maniatty, Antoinette, Liu, Yong, and Hao, Jifa, "Crystal Plasticity Finite Element Analysis of Electromigration-induced Deformation Behavior in Lead-Free Solder Joints," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1023-1028.

Ni, Jiamin, Maniatty, Antoinette, Liu, Yong, Hao, Jifa, and Ring, Matt, "Electromigration Induced Stress in Lead-Free Solder Joints," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 538-543.

Ni, Jiamin, Ring, Matt, Hao, Jifa, Liu, Yong, and Maniatty, Antoinette M., "Modeling Effect of Grain Orientation on Degradation in Tin-Based Solder-Part II: Electromigration Experiments," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 9 no. 10, pp. 1993-1999, Sept. 2019.

Ni, Jiamin, Liu, Yong, Hao, Jifa, Maniatty, Antoinette, and O'Connell, Barry, "Modeling Microstructure Effects on Electromigration in Lead-free Solder Joints," 2014 IEEE 64th Electronic Components and Technology Conference , Orlando, FL, May 27-30, 2014, pp. 1241-1246.

Ni, Kun, Lu, Yonglong, Wang, Tieyu, Shi, Yajuan, Kannan, Kurunthachalam, Xu, Li, Li, Qiushuang, and Liu, Shijie, "Polybrominated diphenyl ethers (PBDEs) in China: Policies and recommendations for sound management of plastics from electronic wastes," Journal of Environmental Management, vol. 115, pp. 114-123, Jan. 30, 2013.

Ni, X. J., and Liang, T. X., "Development of UV-curing anisotropically conductive adhesives," Surface Coatings International Part B: Coatings Transactions, vol. 86 no. B4, pp. 287-290, Dec. 2003.

Niagu, Andrei, Scarlatache, Vlad-Andrei, Ursache, Stefan, and Moraru, Georgiana Maria, "An Overview of Smart Conductive Adhesive," 2012 International Conference and Exposition on Electrical and Power Engineering, Lasi, Romania, Oct. 25-27, 2012, pp. 88-93.

Nicak, Michal, Svecova, Olga, Pulec, Jiri, Sandera, Josef, and Szendiuch, Ivan, "Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure," Key Engineering Materials, vol. 465, pp. 491-494, 2011.

Nicholas, J. F., "The Mechanisms of Self-diffusion in Tin," Acta Metallurgica, vol. 3 no. 2, pp. 178-181, Mar. 1955.

Nicholls, Lou, Darveaux, Robert, Syed, Ahmer, Loo, Shane, Tee, Tong Yan, Wassick, Thomas A., and Batchelor, Bill, "Comparative Electromigration Performance of Pb Free Flip Chip Joints with Varying Board Surface Condition," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 914-921.

Nicholls, Lou, Darveaux, Robert, Hansen, Bernt, Carey, Chuck, Aoki, Toyohiro, Akimoto, Toshiharu, and Chang, Jason, "Fine Pitch (150um) Pb-Free Flip-Chip Bumping & Packaging," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 131-138.

Nichols, Rick, Heinemann, Sandra, Spreemann, Robert, and Ramos, Gustavo, "Can a Cyanide Free Immersion Gold Bath be a Viable Option in the Existing Final Finish Production Environments?," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Nichols, Rick, and Heinemann, Sandra, "Soldering Immersion Tin," South East Asia Technical Training Conference on Electronics Assembly Technologies 2017 Proceedings, Penang, Malaysia, Mar. 28-30, 2017, pp. xx-xx.

Nichols, Rick, and Heinemann, Sandra, "Soldering Immersion Tin," SMTA China East 2017 Proceedings, Shanghai, China, Apr. 25-27, 2017, pp. xx-xx.

Nichols, Rick, and Heinemann, Sandra, "The Impact of Deposition Thickness on High Speed Shear Test Results Specifically Related to Electroless Palladium and Semi Autocatalytic Gold," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 901-910.

Nicholson, A., and Bloomfield, D., "The Use of Bismuth Alloy Systems for Reflow and Wave Soldering," Soldering & Surface Mount Technology, vol. 4 no. 1, pp. 23-26, 1992.

Nicholson, Anna L., Olivetti, Elsa A., Gregory, Jeremy R., Field, Frank R., and Kirchain, Randolph E., End-of-life LCA allocation methods: open loop recycling impacts on robustness of material selection decisions," IEEE International Symposium on Sustainable Systems and Technology, Phoenix, AZ, May 18-20, 2009, pp. xx-xx.

Nicol, Scott, and Thompson, Shirley, "Policy options to reduce consumer waste to zero: comparing product stewardship and extended producer responsibility for refrigerator waste," Waste Management and Research, vol. 25 no. 3, pp. 227-233, June 2007.

Nicolaou, Chris A., "Plastic Package Failure Modes," Surface Mount Technology (SMT), vol. 7 no. 11, pp. 45-46, 48, 50, Nov. 1993.

Nie, Lei, Cai, Jian, Peng, Xiao, Zhang, Nan, Wang, Shuidi, and Jia, Songliang, "A Study of Intermetallic Compounds in Tin Bumps during Multi-Reflows," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Nie, Lei, Osterman, Michael, and Pecht, Michael, "Assessing Reliability of Reballed Ball Grid Array Assemblies Under Temperature Cycling Test," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 98-104.

Nie, Lei, Osterman, Michael, and Pecht, Michael, "Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Nie, Lei, Osterman, Michael, and Pecht, Michael, "Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Packages in Lead-Free and Mixed Assemblies," SMTAnews & Journal of Surface Mount Technology, vol. 22 no. 2, pp. 13-20, Apr.-June 2009.

Nie, Lei, Donaldson, Alan, Aravamudhan, Srinivasa, and Aspandiar, Raiyo, "Impact of SMT Process Parameters to Control BGA Process Voids During Board Assembly," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 156-162.

Nie, Lei, Dong, Mingzhi, Cai, Jian, Osterman, Michael, and Pecht, Michael, "Interfacial Reaction of Reballed BGAs under Isothermal Aging Conditions," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 633-641.

Nie, Lei, Mueller, Maik, Osterman Michael, and Pecht, Michael, "Microstructural Analysis of Reballed Tin-Lead, Lead-Free, and Mixed Ball Grid Array Assemblies Under Temperature Cycling Test," Journal of Electronic Materials, vol. 39 no. 8, pp. 1218-1232, Aug. 2010.

Nie, Lei, Osterman, Michael, and Pecht, Michael G., "Microstructural Analysis of Reworked Ball Grid Array Assemblies Under Thermomechanical Loading Conditions," IEEE Transactions on Device and Materials Reliability, vol. 10 no. 2, pp. 276-286, June 2010.

Nie, Lei, Pecht, Michael, and Ciocci, Richard, "Regulations and market trends in lead-free and halogen-free electronics," Circuit World, vol. 33 no. 2, pp. 4-9, 2007.

Nie, Lei, Osterman, Michael, Pecht, Michael, Song, Fubin, Lo, Jeffrey, and Lee, S. W. Ricky, "Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. P-07.

Nie, Lei, Osterman, Michael, Song, Fubin, Lo, Jeffery, Lee, S. W. Ricky, and Pecht, Michael, "Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages," IEEE Transactions on Components and Packaging Technologies , vol. 32 no. 4, pp. 901-908, Dec. 2009.

Nie, Lei, Cai, Jian, Fang, Zhao, Wang, Shuidi, and Jia, Songliang, "Tin Bumping for Wafer Level Lead-free Packaging," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Nie, X., Bhate, D., Chan, D., Chen, W., Subbarayan, G., and Dutta, I., "Rate-Dependent Behavior of Sn3.8Ag0.7Cu Solder over Strain Rates of 10^-6 to 10^2 s-1," 11th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 28-31, 2008, pp. 676-682.

Niedzwiedz, Wojciech, Szwech, Marcin, Chmielewski, Jacek, and Drozd, Zdzislaw, "Economic Reliability Test Methods of New Soldering Materials," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 245-248.

Nieland, Sabine, and Bahr, Mario, "Selection Panel for Reliable Soldering Systems," 1st Electronics Systemintegration Technology Conference, Volume 2, Dresden, Germany, Sept. 5-7, 2006, pp. 1249-1251.

Nielen, Heiko, Gobel, Herbert, Eppler, Ingo, Schroeder, Herbert, and Schilling, Werner, "Stress and Plasticity in Passivated Interconnect Lines," AIP Conference Proceedings, vol. 491, pp. 277-282, 1999.

Nielsch, Kornelius, Muller, Frank, Li, An-Ping, and Gosele, Ulrich, "Uniform Nickel Deposition into Ordered Alumina Pores by Pulsed Electrodeposition," Advanced Materials, vol. 12 no. 8, pp. 582-586, Apr. 2000.

Nielsen, Claus Wurtz, Rasmussen, Anette Alsted, Ambat, Rajan, and Moller, Per, "New Trends for PWB Surface Finishes in Mobile Phone Applications," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Nielsen, Claus Wurtz, and Rasmussen, Anette Alsted, "New Trends for PWB Surface Finishes in Mobile Phone Applications," Lead-Free Magazine, vol. 6, May 2006.

Nielsen, Claus Wurtz, "The evolution of surface finishes in mobile phone applications."

Niemela, Raimo I., Rantanen, Jorma, and Kiilunen, Mirja K., "Target Levels - Tools for Prevention," Risk Analysis, vol. 18 no. 6, pp. 679-688, Dec. 1998.

Niermeyer, Thorsten, "Controlling Pb-Free Processes through AOI," Circuits Assembly, vol. 15 no. 10, pp. 40-41, Oct. 2004.

Niermeyer, Thorsten, "Quality Control for the Lead-Free Process," European Semiconductor , vol. 28 no. 2, pp. 37-39, Mar. 2006.

Niessner, M., Schuetz, G., Birzer, C., Preu, H., and Weiss, L., "Accurate Prediction of SnAgCu Solder Joint Fatigue of QFP Packages for Thermal Cycling," 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Ghent, Belgium, Apr. 7-9, 2014, pp. xx-xx.

Nieto, M. M., and Russell, A. M., "Growth of Whiskers due to Solid-to-Solid Phase Transformation in Zirconium," Journal of Applied Physics, vol. 35, pp. 461, 1964.

Nimmo, Kay, "DEADLINES set as WEEE becomes reality," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, Feb. 2003.

Nimmo, Kay, "Environmental Issues in Electronics and the Transition to Lead-Free Soldering," 1999 SMTA International Conference Proceedings, San Jose, CA, Sept. 12-16, 1999, pp. xx-xx.

Nimmo, Kay, "European and International Roadmaps for Lead-Free Technology."

Nimmo, Kay, Peters, Shellene, and Cusack, Paul, "Lead Free Materials," SMART Group Lead-Free Seminar 1999, High Wycombe, UK, Feb. 10, 1999.

Nimmo, Kay, "Lead-Free Trends and Requirements and the Need for Global Co-operation," International Journal of Microcircuits and Electronic Packaging, vol. 24 no. 4, pp. 304-315, 4th Quarter 2001.

Nimmo, Kay, "Pb free - time to prepare," Soldering & Surface Mount Technology , vol. 12 no. 9, pp. xx, 2000.

Nimmo, Kay, "Product marking for Pb-free - Industry options and guidelines," SMART Group 6th Annual Lead-Free Seminar and Table-top Exhibition, High Wycombe, United Kingdom, Feb. 3, 2004.

Nimmo, Kay, "Progress in Production and Standardisation of Lead-free in Japan," Lead-Free Soldering Seminar 2001, High Wycombe, United Kingdom, Feb. 15, 2001.

Nimmo, Kay, "Review of Current Issues in Lead-Free Soldering," 1997 Surface Mount International Conference Proceedings, San Jose, CA, Sept. 7-11, 1997, pp. 467-475.

Nimmo, Kay, "USING maps to find Pb-free path," Electronics Manufacture and Test , vol. xx no. xx, pp. xx, Apr. 2003.

Nimmo, Kay, "WEEE and RoHS Regulations and Compliance," SMART Group Scotland Seminar Supply Chain Management, Glasgow, Scotland, Mar. 3, 2005.

Ninagawa, Noriyasu, Hamatsuka, Yasuhiro, Yamamoto, Noriaki, and Hiroshige, Yuzo, "Checking the Accuracy of Environmental Data for Compliance with Environmental Rules," Proceedings of the 2007 IEEE International Symposium on Electronics & the Environment, Orlando, FL, May 7-10, 2007, pp. 79-84.

Ninagawa, Noriyasu, Yamamoto, Noriaki, Kumazawa, Takaaki, Ikuzawa, Masanori, and Hamatsuka, Yasuhiro, "Chemical Substance Management for EEE - Evaluation Method of Chemical Data Contained in Parts," Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 12-14, 2005, pp. 828-833.

Ninagawa, Noriyasu, Hamatsuka, Yasuhiro, Yamamoto, Noriaki, and Hiroshige, Yuzo, "Methodology and Application of Parts Qualification for Compliance to Environmental Rules," Proceedings of 14th CIRP International Conference on Life Cycle Engineering, Tokyo, Japan, June 11-13, 2007, pp. 429-432.

Ning, Xiang, Zhou, Min-Bo, Li, Jin-Gang, and Zhang, Xin-Ping, "Effect of some N-heterocyclic inhibitors in the soldering flux on the corrosion behavior of eutectic Sn-58Bi alloy and its solder paste," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 540-545.

Ninomiya, Ryuji, Miyake, Koichi, and Matsunaga, Junichi, "Microstructure and Mechanical Properties of New Lead-Free Solder," Advances in Electronic Packaging 1997, Volume 2, Kohala Coast, Hawaii, June 15-19, 1997, pp. 1329-1333.

Niranjani, V. L., Rao, B. S. S. Chandra, Singh, Vajinder, and Kamat, S. V., "Influence of temperature and strain rate on tensile properties of single walled carbon nanotubes reinforced Sn-Ag-Cu lead free solder alloy composites," Materials Science and Engineering: A, vol. 529 no. x, pp. 257-264, 2011.

Niranjani, V. L., Rao, B. S. S. Chandra, Sarkar, Rajdeep, and Kamat, S. V., "The influence of addition of nanosized molybdenum and nickel particles on creep behavior of Sn-Ag lead free solder alloy," Journal of Alloys and Compounds, vol. 542, pp. 136-141, Nov. 25, 2012.

Niraula, D., McCulloch, J., Warrell, G. R., Irving, R., Karpov, V. G., and Shvydka, Diana, "Electric field stimulated growth of Zn whiskers," AIP Advances, vol. 6 no. 7, pp. 075201-1-075201-10, July 2016.

Niraula, D., and Karpov, V. G., "The probabilistic distribution of metal whisker lengths," Journal of Applied Physics, vol. 118 no. 20, pp. 205301-1-205301-5, Nov. 28, 2015.

Nishi, Takayuki, Hirano, Manabu, Ohashi, Toshijiro, Ueno, Kiyoshi, and Hiroshige, Yuzo, "Study on TV recyclability," First International Symposium On Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Feb. 1-4, 1999, pp. 278-280.

Nishida, H., Sakamoto, K., Ogawa, Hideki, and Ogawa, Hiromi, "Micropitch connection using anisotropic conductive materials for driver IC attachment to a liquid crystal display," IBM Journal of Research and Development, vol. 42 no. 3-4, pp. 517-525, May-July 1998.

Nishiguchi, Masanori, Goto, Noboru, and Nishizawa, Hideaki, "Highly Reliable Au-Sn Eutectic Bonding with Back-Ground GaAs LSI Chips," Ninth IEEE/CHMT International Electronics Manufacturing Technology Symposium, Washington, DC, Oct. 1-3, 1990, pp. 216-222.

Nishikawa, H., Iwata, N., and Takemoto, T., "Effect of heating method on microstructure of Sn-3.0Ag-0.5Cu solder on Cu substrate," 2011 18th European Microelectronics and Packaging Conference , Brighton, United Kingdom, Sept. 12-15, 2011, pp. xx-xx.

Nishikawa, H., Komatsu, A., and Takemoto, T., "Microstructure of Sn-Ag-Co solder reacted with Cu substrate," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics , Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Nishikawa, Hiroshi, Miki, Kousuke, and Takemoto, Tadashi, "Effect of Aging Conditions on Impact Strength of Sn-3.5 Based Solder Joint," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 553-556.

Nishikawa, Hiroshi, Liu, Xiangdong, and He, Siliang, "Effect of bonding conditions on shear strength of joints at 200 °C using Sn-coated Cu particle," 2017 21st European Microelectronics and Packaging Conference & Exhibition, Warsaw, Poland, Sept. 10-13, 2017, pp. xx-xx.

Nishikawa, Hiroshi, Takemoto, Tadashi, Uetani, Takashi, and Sekimori, Norihisa, "Effect of Grain Size on Reaction between Pb-Free Solder and Plated Iron," Materials Science Forum, vol. 502, pp. 405-410, 2005.

Nishikawa, Hiroshi, Takemoto, Tadashi, Kifune, Kouichi, Uetani, Takashi, and Sekimori, Norihisa, "Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder," Materials Transactions, vol. 45 no. 3, pp. 741-746, Mar. 2004.

Nishikawa, Hiroshi, Komatsu, Akira, and Takemoto, Tadashi, "Effect of Ni or Co Addition to Sn-Ag Solder on Microstructure and Joint Strength at Interface," Materials Transactions, vol. 49 no. 7, pp. 1518-1523, July 2008.

Nishikawa, Hiroshi, Mikami, Saya, Miyake, Koichi, Aoki, Akira, and Takemoto, Tadashi, "Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives," Materials Transactions, vol. 51 no. 10, pp. 1785-1789, 2010.

Nishikawa, Hiroshi, Mikami, Saya, Terada, Nobuto, Miyake, Koich, Aoki, Akira, and Takemoto, Tadashi, "Electrical Property of Conductive Adhesives Using Silver-coated Copper Filler," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 825-828.

Nishikawa, Hiroshi, Hamada, Yoshihito, and Takemoto, Tadashi, "Estimation Method for Liquidus Temperature of Lead-Free Solder Using Differential Scanning Calorimetry Profiles," Journal of Electronic Materials, vol. 38 no. 12, pp. 2610-2616, Dec. 2009.

Nishikawa, Hiroshi, and Iwata, Noriya, "Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn-Ag Cu solder on a Cu Pad," Journal of Materials Processing Technology, vol. 215, pp. 6-11, Jan. 2015.

Nishikawa, Hiroshi, and Kubota, Sinya, "Impact strength of Sn-58mass%Bi/Cu joints by laser process," 2015 European Microelectronics Packaging Conference, Friedrichshafen, Germany, Sept. 14-16, 2015, pp. xx-xx.

Nishikawa, Hiroshi, and Iwata, Noriya, "Improvement of Joint Reliability of Sn-Ag-Cu Solder Bumps on Cu by a Laser Process," Materials Transactions, JIM, vol. 56 no. 7, pp. 1025-1029, 2015.

Nishikawa, Hiroshi, Piao, Jin Yu, and Takemoto, Tadashi, "Interfacial Reaction between Sn-0.7Cu (-Ni) Solder and Cu Substrates," Journal of Electronic Materials, vol. 35 no. 5, pp. 1127-1132, May 2006.

Nishikawa, Hiroshi, Komatsu, Akira, and Takemoto, Tadashi, "Interfacial Reaction between Sn-Ag-Co Solder and Metals," Materials Transactions, vol. 46 no. 11, pp. 2394-2399, 2005.

Nishikawa, Hiroshi, Alhazaa, Abdulaziz N., He, Siliang, Almajid, Abdulhakim A., and Soliman, Mahmoud S., "Interfacial reaction between Sn-Ag-Cu-Mg solder and ENIG substrate," Key Engineering Materials, vol. 701, pp. 216-219, July 2016.

Nishikawa, Hiroshi, Komatsu, Akira, and Takemoto, Tadashi, "Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder," Materials Science Forum, vol. 580-582, pp. 243-246, 2008.

Nishikawa, Hiroshi, and Matsunobu, Ryo, "Interfacial reaction of Sn-Ag-Cu-Ni solder/Cu joints by laser process," 2018 7th Electronic System-Integration Technology Conference, Dresden, Germany, Sept. 18-21, 2018, pp. xx-xx.

Nishikawa, Hiroshi, Kang, Songai, and Takemoto, Tadashi, "Measurement of erosion of stainless steel by molten lead-free solder using micro-focus X-ray CT system," Quarterly Journal of the Japan Welding Society, vol. 27 no. 2, pp. 214s-218s, 2009.

Nishikawa, Hiroshi, Piao, Jin Yu, and Takemoto, Tadashi, "Microstructure of Interface between Sn-Cu Solder with Ni and Cu Plate," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals , vol. 70 no. 5, pp. 427-433, May 2006.

Nishikawa, Hiroshi, Komatsu, Akira, and Takemoto, Tadashi, "Morphology and Pull Strength of Sn-Ag(-Co) Solder Joint with Copper Pad," Journal of Electronic Materials, vol. 36 no. 9, pp. 1137-1143, Sept. 2007.

Nishikawa, Hiroshi, WongPiromsarn, Krit, Abe, Hiroya, Takemoto, Tadashi, Fukuhara, Mikio, and Inoue, Akihisa, "Solderability of Bulk Metallic Glasses Using Lead-Free Solders," Materials Transactions, vol. 50 no. 6, pp. 1326-1329, 2009.

Nishikawa, Hiroshi, WongPiromsarn, Krit, Abe, Hiroya, Takemoto, Tadashi, Fukuhara, Mikio, Wada, Takeshi, and Inoue, Akihisa, "Wetting characteristics of Sn-Ag-Cu solder on Pd-based metallic glass," Materials Science and Engineering B: Solid-State Materials for Advanced Technology, vol. 148 no. 1-3, pp. 124-127, Feb. 25, 2008.

Nishimi, Keith, "Space Shuttle Program Tin Whisker Mitigation," Proceedings of CALCE International Symposium on Tin Whiskers, College Park, MD, Apr. 24-25, 2007, pp. xx-xx.

Nishimura, Hirokazu, and Kishimoto, Yasukazu, "Interconnection Characteristics of Anisotropic Conductive Paste," 1st 1997 IEMT/IMC Symposium, Tokyo, Japan, Apr. 16-18, 1997, pp. 352-355.

Nishimura, Takatoshi, Sweatman, Keith, Kita, Akira, and Sawada, Shuhei, "A New Method of Increasing the Reliability of Lead-Free Solder," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 736-742.

Nishimura, Takatoshi, Dekui, Mu, Sawada, Shuhei, Sweatman, Keith, Howell, Keith, Zeng, Guang, and Nogita, Kazuhiro, "The Performance of Solid Solution Strengthened No Silver Lead Free Solder," International Conference on Soldering & Reliability 2015 Proceedings, Toronto, Ontario, Canada, May 19-21, 2015, pp. xx-xx.

Nishimura, Tetsuro, "Lead-free solder Alloy," Materia Japan, vol. 43 no. 8, pp. 651-654, 2004.

Nishimura, Tetsuro, "Making the Connections in Electronic Circuitry- The Continuing Evolution of Joining Technologies," Pan Pacific Symposium 2016 Proceedings, Waimea, HI, Jan. 25-28, 2016, pp. xx-xx.

Nishimura, Tetsuro, "Pushing the Limits of Lead-Free Soldering," 2012 Pan Pacific Microelectronics Symposium, Kauai, HI, Feb. 14-16, 2012, pp. xx-xx.

Nishimura, Tetsuro, "Pushing the Limits of Lead-Free Soldering," Surface Mount Technology (SMT), vol. 28 no. 10, pp. 12,14-16,18-20,22,24,26, Oct. 2013.

Nishimura, Tetsuro, "Tetsuro Nishimura, President, Nihon Superior Co., Ltd," Circuitnet , Jan. 9, 2008.

Nishimura, Tetsuro, "Tin-Copper-Nickel-Germanium - A Case Study in Lead-Free Implementation," 2012 Pan Pacific Microelectronics Symposium, Kauai, HI, Feb. 14-16, 2012, pp. xx-xx.

Nishimura, Y., Oonishi, K., Morozumi, A., Mochizuki, E., and Takahashi, Y., "All lead free IGBT module with excellent reliability," Proceedings of the 17th International Symposium on Power Semiconductor Devices and ICs , Santa Barbara, CA, May 23-26, 2005, pp. 79-82.

Nishimura, Y., Morozumi, A., Mochizuki, E., and Takahashi, Y., "Investigations of all lead free IGBT module structure with low thermal resistance and high reliability," Proceedings of the 18th International Symposium on Power Semiconductor Devices & IC's, Naples, Italy, June 4-8, 2006, pp. xx-xx.

Nishimura, Yuji, Yu, Qiang, and Maruoka, Toshiaki, "Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Shape Dispersion," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 838-845.

Nishina, Tsutomu, and Okamoto, Kenji, "Solder Paste with Polymerizing Flux for Lead-free Solder Alloy," Proceedings 2001 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4587) , Baltimore, MD, Oct. 9-11, 2001, pp. 535-540.

Nishiura, Masataka, Nakayama, Akihiro, Sakatani, Sigeaki, Kohara, Yasuhiro, Uenishi, Keisuke, and Kobayashi, Kojiro F., "Mechanical Strength and Microstructure of BGA Joints Using Lead-Free Solders," Materials Transactions, vol. 43 no. 8, pp. 1802-1807, Aug. 2002.

Nishiyama, Tatsuya, Ogawa, Takeshi, and Sakamoto, Hiroo, "Evaluation of Mechanical Properties and Nano-Structure Analysis of Au-20Sn and Au-12Ge Solders," Journal of the Society of Materials Science , vol. 56 no. 10, pp. 913-919, Oct. 2007.

Niskala, Matti, "Soldering of SMD Film Capacitors in Practical Lead Free Processes," CARTS Europe 2007, Barcelona, Spain, Oct. 29-Nov. 1, 2007, pp. xx-xx.

Nissen, Nils F., Stobbe, Lutz, Schischke, Karsten, Muller, Jutta, and Reichl, Herbert, "European Environmental Legislation - Insights into the EuP Process," 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium , San Jose, CA, Oct. 3-5, 2007, pp. 325-331.

Nittono, O., Yamagishi, H., and Nagakura, S., "Bragg-Case Diffraction Curves from Copper Whiskers by the X-ray Triple-Crystal Diffraction Method," Journal of Applied Crystallography , vol. 12 no. x, pp. 141-146, 1979.

Nittono, O., Hasegawa, H., and Nagakura, S., "Growth Mechanism of Copper Whiskers by the Hydrogen Reduction of Cuprous Iodide," Journal of Crystal Growth, vol. 42, pp. 175-182, Dec. 1977.

Nittono, O., Totsuka, N., Hamamura, K., and Nagakura, S., "X-ray Topographic Study of a-Copper-Zinc Alloy Whiskers," Journal of Crystal Growth, vol. 36 no. 1, pp. 41-46, Nov. 1976.

Niu, Bo, Chen, Zhenyang, and Xu, Zhenming, "Application of pyrolysis to recycling organics from waste tantalum capacitors," Journal of Hazardous Materials, vol. 335, pp. 39-46, Aug. 5, 2017.

Niu, Fan-Fan, Luan, Xing-He, Feng, Chuang, Zhang, Ying-Hong, Yang, Dao-Guo, Qin, Hong-Bo, Jiang, Hong-Jie, and Liu, Feng-Mei, "The study on elastic properties of Cu3Sn under pressure via first-principle calculations," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1207-1211.

Niu, Qiang, Xiang, Dong, Liu, Xueping, Duan, Guanghong, and Shi, Chuan, "The Recycle Model of Printed Circuit Board and Its Economy Evaluation," Proceedings of the 2007 IEEE International Symposium on Electronics & the Environment, Orlando, FL, May 7-10, 2007, pp. 106-111.

Niu, Xi, and Lin, Kwang-Lung, "Effects of Al, Pr additions on the wettability and interfacial reaction of Zn-25Sn solder on Cu substrate," Journal of Materials Science: Materials in Electronics, vol. 28 no. 1, pp. 105-113, Jan. 2017.

Niu, Xi, and Lin, Kwang-Lung, "Investigations of the wetting behaviors of Zn-25Sn, Zn-25Sn-XPr and Zn-25Sn-YAl high temperature lead free solders in air and Ar ambient," Journal of Alloys and Compounds, vol. 646, pp. 852-858, Oct. 15, 2015.

Niu, Xi, and Lin, Kwang-Lung, "The microstructure and mechanical properties of Zn-25Sn-XAl (X=0-0.09 wt%) high temperature lead free solder," Materials Science and Engineering: A , vol. 677, pp. 384-392, Nov. 20, 2016.

Niu, Xiao-Yan, Li, Wei, Wang, Gui-Xiang, and Shu, Xue-Feng, "Effects of temperature and strain rate on mechanical behavior of low-silver lead-free solder under drop impact," Journal of Materials Science: Materials in Electronics, vol. 26 no. 1, pp. 601-607, Jan. 2015.

Niu, Xiaoyan, Shen, Linlin, Chen, Cong, Zhou, Jiang, and Chen, Liangbiao, "An Arrhenius-type constitutive model to predict the deformation behavior of Sn0.3Ag0.7Cu under different temperature," Journal of Materials Science: Materials in Electronics, vol. 30 no. 15, pp. 14611-14620, Aug. 2019.

Niu, Xiaoyan, Zhang, Zhanbiao, Wang, Guixiang, and Shu, Xuefeng, "Low silver lead-free solder joint reliability of VFBGA packages under board level drop test at -45°C," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 762-765.

Niu, Xiaoyan, Chen, Tong, Li, Zhigang, and Shu, Xuefeng, "Modeling Solder Joint Reliability of VFBGA Packages under Board Level Drop Test Based on Dynamic Constitutive Relation with Thermal Effect," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 365-369.

Nix, W. D., and Clemens, B. M., "Crystallite coalescence: A mechanism for intrinsic tensile stresses in thin films," Journal of Materials Research, vol. 14 no. 8, pp. 3467-3473, Aug. 1999.

Nix, William D., "Mechanical Properties of Thin Films," metallurgical Transactions A , vol. 20 no. 11, pp. 2217-2245, Nov. 1989.

Nixon, Hilary, Saphores, Jean-Daniel M., Ogunseitan, Oladele A., Lincoln, John D., and Shapiro, Andrew A., "Californian Households' Willingness to Pay for Green PCs," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment , San Francisco, CA, May 8-11, 2006, pp. 150-155.

Nixon, Hilary, Ogunseitan, Oladele A., Saphores, Jean-Daniel, and Shapiro, Andrew A., "Electronic Waste Recycling Preferences in California: The Role of Environmental Attitudes and Behaviors," Proceedings of the 2007 IEEE International Symposium on Electronics & the Environment, Orlando, FL, May 7-10, 2007, pp. 251-256.

Njoku, Jude E., Mallik, Sabuj, Bhatti, Raj, Amalu, Emeka H., and Ogunsemi, B., "Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component," 2015 European Microelectronics Packaging Conference, Friedrichshafen, Germany, Sept. 14-16, 2015, pp. xx-xx.

Nnorom, I. C., Osibanjo, O., and Ogwuegbu, M. O. C., "Global disposal strategies for waste cathode ray tubes," Resources, Conservation and Recycling, vol. 55 no. 3, pp. 275-290, Jan. 2011.

Nnorom, I. C., and Osibanjo, O., "Overview of electronic waste (e-waste) management practices and legislations, and their poor applications in the developing countries," Resources, Conservation, and Recycling, vol. 52 no. 6, pp. 843-858, Apr. 2008.

Nnorom, I. C., Ohakwe, J., and Osibanjo, O., "Survey of willingness of residents to participate in electronic waste recycling in Nigeria - A case study of mobile phone recycling," Journal of Cleaner Production, vol. 17 no. 18, pp. 1629-1637, Dec. 2009.

Nnorom, Innocent Chidi, and Osibanjo, Oladele, "Electronic waste (e-waste): Material flows and management practices in Nigeria," Waste Management, vol. 28 no. 8, pp. 1472-1479, 2008.

Nnorom, Innocent Chidi, and Osibanjo, Oladele, "Sound management of brominated flame retarded (BFR) plastics from electronic wastes: State of the art and options in Nigeria," Resources, Conservation and Recycling, vol. 52 no. 12, pp. 1362-1372, Oct. 2008.

Nobari, Amir Hossein, Maalekian, Mehran, Seelig, Karl, and Pekguleryuz, Mihriban, "Effect of Ag, Ni and Bi Additions on Solderability of Lead-Free Solders," Journal of Electronic Materials, vol. 46 no. 7, pp. 4076-4084, July 2017.

Nobari, Amir H., and St-Laurent, Sylvain, "Effect of Fine and Ultra-Fine Lead-Free Solder Powder Characteristics on the Reflow Property of Pastes," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 327-333.

Nobari, Amir Hossein, Maalekian, Mehran, Seelig, Karl, and Pekguleryuz, Mihriban, "Effect of Sb on wetting behavior of near eutectic Sn-Cu solder micro-alloyed with Ni and Ge," Soldering & Surface Mount Technology, vol. 28 no. 2, pp. 93-100, 2016.

Nobari, Amir H., St-Laurent, Sylvain, Thomas, Yannig, Bouchemit, Arslane, and L'Esperance, Gilles, "Performance of Fine and Ultra-Fine Lead-Free Powders for Solder Paste Applications," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 1942-1950.

Nobeen, Nadeesh Singh, Yan, Guangxu, Gan, Chee Lip, and Chen, Zhong, "Ag-Sn Transient Liquid Phase Bonding for High Temperature Electronic Packaging: Effect of Ag Content," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 10 no. 10, pp. 1604-1610, Oct. 2020.

Noble, Peter J. W., "Changing solder is the straightforward bit, but...," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, May 2000.

Noel, S., Lecaude, N., Correia, S., Gendre, P., and Grosjean, A., "Electrical and tribological properties of tin plated copper alloy for electrical contacts in relation to intermetallic growth," Proceedings of the 52nd Holm Conference on Electrical Contacts, Montreal, Quebec, Canada, Sept. 25-27, 2006, pp. 1-10.

Nogita, K., Gourlay, C. M., and Nishimura, T., "Cracking and Phase Stability in Reaction Layers between Sn-Cu-Ni Solders and Cu Substrates," JOM, vol. 61 no. 6, pp. 45-51, June 2009.

Nogita, K., Somidin, F., Salleh, M. A. A. Mohd, Sweatman, K., Nishimura, T., McDonald, S. D., Maeno, H., and Matsumura, S., "Effect of reflow conditions on the intermetallic layer in solder joints," 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Nagasaki, Japan, Apr. 17-21, 2018, pp. 94-96.

Nogita, K., Salleh, M. A. A. Mohd, Smith, S., Wu, Y. Q., McDonald, S. D., Razak, A. G. Ab, Akaiwa, T., and Nishimura, T., "Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects," 2017 International Conference on Electronics Packaging, Yamagata, Japan, Apr. 19-22, 2017, pp. 377-380.

Nogita, K., Gourlay, C. M., Read, J., Nishimura, T., Suenaga, S., and Dahle, A. K., "Effects of Phosphorus on Microstructure and Fluidity of Sn-0.7Cu-0.05Ni Lead-Free Solder," Materials Transactions, vol. 49 no. 3, pp. 443-448, Mar. 2008.

Nogita, K., Salleh, M. A. A. Mohd, Tanaka, E., Zeng, G., McDonald, S. D., and Matsumura, S., "In Situ TEM Observations of Cu6Sn5 Polymorphic Transformations in Reaction Layers Between Sn-0.7Cu Solders and Cu Substrates," JOM, vol. 68 no. 11, pp. 2871-2878, Nov. 2016.

Nogita, K., Gourlay, C. M., McDonald, S. D., Wu, Y. Q., Read, J., and Gu, Q. F., "Kinetics of the n-n' transformation in Cu6Sn5," Scripta Materialia , vol. 65 no. 10, pp. 922-925, Nov. 2011.

Nogita, K., Gourlay, C. M., McDonald, S. D., Suenaga, S., Read, J., Zeng, G., and Gu, Q. F., "XRD study of the kinetics of b<->a transformations in tin," Philosophical Magazine, vol. 93 no. 27, pp. 3627-3647, 2013. https://doi.org/10.1080/14786435.2013.820381

Nogita, Kazuhiro, "Industry-University Collaboration and Advances in Lead-Free Solder Technology," 2012 Pan Pacific Microelectronics Symposium, Kauai, HI, Feb. 14-16, 2012, pp. xx-xx.

Nogita, Kazuhiro, Kennedy, James, Amsler, John, Greaves, Matthew, Tuesley, Cameron, and Nishimura, Takatoshi, "Lead-free solders for solar and electric vehicles - Reflections on The Bridgestone World Solar Challenge 2013 in "Arrow1"," 2014 International Conference on Electronics Packaging, Toyoma, Japan, Apr. 23-25, 2014, pp. 10-13.

Nogita, Kazuhiro, Read, Jonathan, Nishimura, Tetsuro, Sweatman, Keith, Suenaga, Shoichi, and Dahle, Arne K., "Microstructure Control in Sn-0.7 mass%Cu Alloys," Materials Transactions, vol. 46 no. 11, pp. 2419-2425, 2005.

Nogita, Kazuhiro, and Nishimura, Tetsuro, "Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn-Cu-Ni lead-free solder alloys," Scripta Materialia, vol. 59 no. 2, pp. 191-194, July 2008.

Nogita, Kazuhiro, "Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys," Intermetallics, vol. 18 no. 1, pp. 145-149, Jan. 2010.

Nogita, Kazuhiro, Sweatman, Keith, and Nishimura, Tetsuro, "The Role of Nickel in Solder Alloys - Part 1. The Effect of Ni on the Behaviour of Sn-0.7Cu in Soldering and Coating Processes," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Nogita, Kazuhiro, Sweatman, Keith, and Nishimura, Tetsuro, "The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on the Integrity of the Interfacial Intermetallic in Sn-Based/Cu Substrate Solder Joints," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Noguchi, Kunihiro, Endou, Yuya, Shimizu, Isao, and Ohno, Yasuhide, "Shear Fracture Behavior on Ball Grid Arrayed Tin-Silver-Copper Solder/Pure Copper Pad Joint Interface," Materials Transactions, vol. 46 no. 11, pp. 2372-2379, 2005.

Noguchi, Kunihiro, Ikeda, Mayumi, Shimizu, Isao, Kawamura, Yoshito, and Ohno, Yasuhide, "Effect of Cooling Rate on Microstructure and Strength Properties of Tin-Silver-Copper Solder Ball Bonding," Materials Transactions, vol. 42 no. 5, pp. 761-768, May 2001.

Noguchi, Michiko, Ozaki, Mitsuo, and Hayashi, Nobuyuki, "A new approach for determination of hexavalent chromium weight percentage in chromate conversion coatings," Electronics Goes Green 2012+, Berlin, Germany, Sept. 9-12, 2012, pp. xx-xx.

Noguchi, Michiko, Nomura, Kenji, Narita, Kazuko, Ozaki, Mitsuo, Ueda, Osamu, and Yamagishi, Yasuo, "A novel evaluation technique for hazardous substances in electronic components and circuit board assemblies complying with the EU-RoHS directive," Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 12-14, 2005, pp. 586-587.

Nogueira, E., Fernandez, A., Florez, A., Santos, R., and Mino, E., "Accelerated life tests of lead free solder alloys in presence of distilled water," 2013 Spanish Conference on Electron Devices, Valladolid, Spain, Feb. 12-14, 2013, pp. 249-251.

Noh, Bo-In, and Jung, Seung-Boo, "Behaviour of electrochemical migration with solder alloys on printed circuit boards (PCBs)," Circuit World, vol. 34 no. 4, pp. 8-13, 2008.

Noh, Bo-In, Lee, Jong-Bum, Lee, Bo-Young, and Jung, Seung-Boo, "Characteristic of Electrochemical Migration on Flexible Printed Circuit Board," Materials Science Forum, vol. 580-582, pp. 229-232, 2008.

Noh, Bo-In, and Jung, Seung-Boo, "Characteristics of environmental factor for electrochemical migration on printed circuit board," Journal of Materials Science: Materials in Electronics, vol. 19 no. 10, pp. 952-956, Oct. 2008.

Noh, Bo-In, Lee, Jong-Bum, and Jung, Seung-Boo, "Effect of surface finish material on printed circuit board for electrochemical migration," Microelectronics Reliability, vol. 48 no. 4, pp. 652-656, Apr. 2008.

Noh, Bo-In, Park, Noh-Chang, Hong, Won-Sik, and Jung, Seung-Boo, "Effect of underfill on bending fatigue behavior of chip scale package," Journal of Materials Science: Materials in Electronics, vol. 19 no. 5, pp. 406-410, May 2008.

Noh, Bo-In, Choi, Jung-Hyun, Yoon, Jeong-Won, and Jung, Seung-Boo, "Effects of cerium content on wettability, microstructure and mechanical properties of Sn-Ag-Ce solder alloys," Journal of Alloys and Compounds , vol. 499 no. 2, pp. 154-159, June 11, 2010.

Noh, Bo-In, Yoon, Jeong-Won, Ha, Sang-Ok, and Jung, Seung-Boo, "Effects of Different Kinds of Underfills and Temperature-Humidity Treatments on Drop Reliability of Board-Level Packages," Journal of Electronic Materials, vol. 40 no. 2, pp. 224-231, Feb. 2011.

Noh, Bo-In, Yoon, Jeong-Won, Hong, Won-Sik, and Jung, Seung-Boo, "Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes," Journal of Electronic Materials , vol. 38 no. 6, pp. 902-907, June 2009.

Noh, Bo-In, and Jung, Seung-Boo, "Reliability of Sn-Ag-Cu Flip Chip Package with Underfill under Thermal Shock," Materials Science Forum, vol. 510-511, pp. 558-561, 2006.

Noh, Bo-In, Lee, Bo-Young, and Jung, Seung-Boo, "Thermal fatigue performance of Sn-Ag-Cu chip-scale package with underfill," Materials Science and Engineering: A, vol. 483-484, pp. 464-468, June 15, 2008.

Noh, Han-Na, Kim, Jae-Chan, Park, Dong-Woon, Cho, Il-Je, and Oh, Min-Jin, "The Study of the Nitrogen Effect for Wave Soldering Process," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Noh, Jaesung, Itsubo, Norihiro, and Inaba, Atsushi, "Damage Factor of Lead on Human Health for an Application in Life Cycle Impact Assessment."

Nohara, Akira, "Effect of Size on the Strength of Metal Whiskers," Japanese Journal of Applied Physics, vol. 21 no. 9 part 1, pp. 1287-1292, Sept. 20, 1982.

Nohara, Akira, Yonezawa, Noboru, and Imura, Toru, "Stress-Extension Behavior of Copper-Tin Alloy Whiskers," Japanese Journal of Applied Physics, vol. 21 pt. 1 no. 1R, pp. 194-195, Jan. 1982.

Nolte, Jorg, "Do not be afraid of lead-free soldering," Dataweek, vol. xx no. xx, pp. xx-xx, Apr. 21, 2004.

Nolte, Jorg, "Rework: quality in focus," Dataweek, vol. xx no. xx, pp. xx-xx, Nov. 19, 2003.

Nomura, Hikaru, Tachibana, Ken, Yoshikawa, Shunsaku, Daily, Derek, and Kawa, Ayano, "WLCSP CTE Failure Mitigation via Solder Sphere Alloy," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1257-1261.

Nomura, Kenji, and Awaji, Naoki, "Nondestructive Measurement of Hexavalent Chromium in Chromate Conversion Coatings Using X-ray Absorption Near Edge Structure," Japanese Journal of Applied Physics, Part 2: Letters, vol. 45 no. 10, pp. L304-L306, Mar. 10, 2006.

Nomura, Shigeo, Miyazaki, Makoto, Oki, Kenichi, Yoshida, Akio, Ogata, Shigeyuki, and Takei, Toshiyasu, "Improvement of Wave Soldering Equipment for Lead-free Solder," Proceedings 2001 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4587), Baltimore, MD, Oct. 9-11, 2001, pp. 541-546.

Noon, Michael S., Lee, Seung-Jin, and Cooper, Joyce S., "A life cycle assessment of end-of-life computer monitor management in the Seattle metropolitan region," CITE>Resources, Conservation and Recycling , vol. 57, pp. 22-29, Dec. 2011.

Noor, Ervina Efzan Mhd, Singh, Amares, and Chuan, Yap Tze, "A Review: Influence of Nano Particles Reinforced on Solder Alloy," Soldering & Surface Mount Technology, vol. 25 no. 4, pp. xx-xx, 2013.

Noor, Ervina Efzan Mhd, Nasir, Nur Faziera Mhd, and Idris, Siti Rabiatul Aisya, "A review: lead free solder and its wettability properties," Soldering & Surface Mount Technology, vol. 28 no. 3, pp. 125-132, 2016.

Noor, Ervina Efzan Mhd, Baaljinder, R., and Emerson, J., "A study on the effect of electromigration on solder alloy joint on copper with nickel surface finish," Soldering & Surface Mount Technology , vol. 30 no. 1, pp. 26-34, 2018.

Noor, Ervina Efzan Mhd, Ismail, Ahmad Badri, Sharif, Nurulakmal Mohd, Ariga, Tadashi, and Hussain, Zuhailawati, "Characteristic of Low Temperature of Bi-In-Sn Solder alloy," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Noor, Ervina Efzan Mhd, and Ogundipe, Ayodeji Samson, "Effect of fluxes on Sn-Zn-Bi solder alloys on copper substrate," Soldering & Surface Mount Technology, vol. 29 no. 4, pp. 225-234, 2017.

Noor, Ervina Efzan Mhd, Zuhailawati, H., and Radzali, Othman, "Low temperature In-Bi-Zn solder alloy on copper substrate," Journal of Materials Science: Materials in Electronics, vol. 27 no. 2, pp. 1408-1415, Feb. 2016.

Noor, Ervina Efzan Mhd, and Singh, Amares, "Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys," Soldering & Surface Mount Technology, vol. 26 no. 3, pp. xx-xx, 2014.

Noor, Ervina Efzan Mhd, Sharif, Nurulakmal Mohd, Yew, Cheong, Kuan, Ariga, Tadashi, Ismail, Ahmad Badri, and Hussain, Zuhailawati, "Wettability and strength of In-Bi-Sn lead-free solder alloy on copper Substrate," Journal of Alloys and Compounds, vol. 507 no. 1, pp. 290-296, Sept. 24, 2010.

Noori, Farzaneh, Ramazani, Abdolali, and Kashi, Mohammad Almasi, "Controlling structural and magnetic properties in CoNi and CoNiFe nanowire arrays by fine-tuning of Fe content," Journal of Alloys and Compounds , vol. 756, pp. 193-201, Aug. 5, 2018.

Nordarina, Jumali, Mohd, Hafiz Zainol, Mohamad, Ahmad Azmin, and Nazeri, Muhammad Firdaus Mohd, "Effect of Al Additions on Corrosion Performance of Sn-9Zn Solder in Acidic Solution," Solid State Phenomena, vol. 273, pp. 46-50, Apr. 2018.

Nordin, N. I. M., Said, S. M., Ramli, R., Sabri, M. F. M., Sharif, N. M., Arifin, N. A. F. N. M., and Ibrahim, N. N. S., "Microstructure of Sn-1Ag-0.5Cu solder alloy bearing Fe under salt spray test," Microelectronics Reliability, vol. 54 no. 9-10, pp. 2044-2047, Sept.-Oct. 2014.

Nordmark, H., Nagayoshi, H., Matsumoto, N., Nishimura, S., Terashima, K., Marioara, C. D., Walmsley, J. C., Holmestad, R., and Ulyashin, A., "Si substrates texturing and vapor-solid-solid Si nanowhiskers growth using pure hydrogen as source gas," Journal of Applied Physics, vol. 105, pp. 043507-1-043507-8, 2009.

Nordwall, Bruce D., "Air Force Links Radar Problems to Growth of Tin Whiskers," Aviation Week & Space Technology, vol. 124 no. 26, pp. 65, 67, 69, June 20, 1986.

Nordwall, Bruce D., , "Filter Center," Aviation Week & Space Technology, vol. 149 no. 7, pp. 47, Aug. 17, 1998.

Noren, M., Brunner, S., Hoffmann, C., Salz, W., and Aichholzer, K., "Aspects on Advanced Thermal Management for Flip Chip on LTCC," Advancing Microelectronics, vol. 35, no. 4, pp. 12-15, July/Aug. 2008.

Norlyng, Soren, "An Overview of Flip Chip Joining Technologies and the Materials Involved," Advancing Microelectronics, vol. 36 no. 3, pp. 12-18, May/June 2009.

Norlyng, Soren, "Lead-free flip chip bumping with special focus on stud bumping - a flexible and economical flip chip technology," Advancing Microelectronics , vol. 28 no. 4, pp. xx-xx, July/Aug. 2001.

Norlyng, Soren, "RoHS, WEEE - Ceramics opportunities?," Advancing Microelectronics , vol. 33 no. 2, pp. 4, Mar./Apr. 2006.

Norris, Kate J., Garrett, Matthew, Coleman, Elane, Tompa, Gary S., Zhang, Junce, and Kobayashi, Nobuhiko P., "Graphene mediated growth of polycrystalline indium phosphide nanowires and monocrystalline-core, polycrystalline-shell silicon nanowires on copper," Journal of Crystal Growth, vol. 406, pp. 41-47, Nov. 15, 2014.

Northam, Riley, "J-STD-001 and High Reliability," empfasis, pp. xx-xx, Dec. 2007.

Northeast Waste Management Officials' Association, "Identifying Industry Sectors in the Northeast That Emit or Transfer Lead or Lead Compounds."

Northeast Waste Management Officials' Association, "Potential Regional Coordination on Pollution Prevention Technologies and Resources for Industry Sectors Emitting or Transferring Lead or Lead Compounds in the Northeast."

Norvell, Robin, "A Lance for the RoHS Windmills," PCB Update, May 19, 2006.

Norvell, Robin, "Going Green? MVR Launches RoHS Website," Circuits Assembly, June 16, 2005.

Norvell, Robin, "JEDEC, iNEMI Releases Help Scratch Tin Whiskers," Circuits Assembly , vol. 16 no. 6, pp. xx-xx, May 25, 2005.

Norvell, Robin, "JEDEC Standardizes Tin Whisker Acceptance Criteria," Circuits Assembly, vol. 17 no. 5, pp. xx-xx, May 2006.

Norvell, Robin, "Lead-Free, and Hold the Lobbying," PCB Update, July 14, 2006.

Norvell, Robin, "NPL: Creep Rates Affect Pb-Free Joint Testing," Circuits Assembly , July 28, 2005.

Norvell, Robin, "Staking the Claims," Circuits Assembly, vol. 17 no. 3, pp. 22, Mar. 2006.

Norvell, Robin, "The Great Green Hype," PCB Update, Oct. 7, 2005.

Norwood, Elizabeth, and Swanson, John, "Enhancing the Tarnish Performance of Immersion Silver Finishes," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 548-552.

Noseda, Corrado, and Wright, Roger N., "The effect of drawing temperature on the properties and annealing response of copper wire," Wire Journal International, vol. 35 no. 1, pp. 74-81, Jan. 2002.

Noseda, Corrado, and Wright, Roger N., "The role of temperature in copper wiredrawing," Wire Journal International, vol. 33 no. 8, pp. 136-139, Aug, 2000.

Nottay, Jaspal, Dusek, Milos, Hunt, Christopher, Bailey, Christopher, and Lu, Hua, "Creep Properties of SnAgCu Solder in Surface Mount Assemblies," NPL Report MATC(A)51, Aug. 2001.

Nottay, Jaspal, Dusek, Milos, Wickham, Martin, and Hunt, Christopher, "Reworking Solder Alloy Mixtures of Lead-free and Tin-Lead Alloys," NPL Report MATC(A)73, Oct. 2001.

Nourani, Amir, Akbari, Saeed, and Spelt, Jan K., "BGA Solder Joint Fracture as a Function of Strain Rate and PCB Rigidity," International Conference on Soldering & Reliability 2016 Proceedings, Toronto, Ontario, Canada, May 9-11, 2016, pp. xx-xx.

Nourani, Amir, Akbari, Saeed, and Spelt, Jan K., "Crack Paths and Fracture Loads of BGA Solder Joints under Bending as a Function of Strain Rate and Mode Ratio," International Conference on Soldering & Reliability 2015 Proceedings, Toronto, Ontario, Canada, May 19-21, 2015, pp. xx-xx.

Nourani, Amir, and Spelt, Jan K., "Effect of Solder Alloy, Aging and TAL on High Strain-Rate Fracture of Lead-Free Solder Joints," Conference Proceedings of SMTA International , Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 319-324.

Nourani, Amir, Akbari, Saeed, and Spelt, Jan K., "Effect of Test Specimen on Fracture Behavior of Lead-Free Solder Joints," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 726-735.

Nourani, Amir, Akbari, Saeed, and Spelt, Jan K., "Fracture load prediction of BGA solder joints: Cohesive zone modeling and experimental verification," International Journal of Solids & Structures, vol. 90, pp. 30-44, July 2016.

Nourani, Amir, and Spelt, Jan K., "Fracture of Lead-Free Solder Joints as a Function of Strain Rate, Local End Geometry and Thickness," International Conference on Soldering & Reliability 2013 Proceedings, Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.

Nourani, Amir, and Spelt, Jan K., "Intermediate and High Strain-Rate Fracture of Lead-Free Solder Joints as a Function of Mode Ratio," International Conference on Soldering & Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.

Nourani, Amir, Mirmehdi, Sadegh, Farrahi, Gholamhossein, and Soroush, Farid, "Predicting fracture of solder joints with different constraint factors," Fatigue and Fracture of Engineering Materials and Structures, vol. 42 no. 2, pp. 425-438, Feb. 2019.

Nourreddine, Menad, "Recycling of auto shredder residue," Journal of Hazardous Materials , vol. 139 no. 3, pp. 481-490, Jan. 31, 2007.

Nousiainen, O., Kangasvieri, T., Rautioaho, R., and Vahakangas, J., "Characterization of Sn7In4.1Ag0.5Cu solder in lead-free composite solder joints of LTCC/PWB assembly," Soldering & Surface Mount Technology , vol. 20 no. 3, pp. 11-17, 2008.

Nousiainen, O., Kangasvieri, T., Kautio, K., Rautioaho, R., and Vahakangas, J., "Effect of ENIG deposition on the failure mechanisms of thermomechanically loaded lead-free 2nd level interconnections in LTCC/PWB assemblies," Soldering & Surface Mount Technology, vol. 22 no. 3, pp. 22-35, 2010.

Nousiainen, O., Salmela, O., Putaala, J., and Kangasvieri, T., "Enhanced thermal fatigue endurance and lifetime prediction of lead-free LGA joints in LTCC modules," Soldering & Surface Mount Technology , vol. 23 no. 2, pp. 104-114, 2011.

Nousiainen, O., Putaala, J., Kangasvieri, T., Rautioaho, R., and Vahakangas, J., "Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plastic Core Solder Ball Composite Joints in Low-Temperature Co-Fired Ceramic/Printed Wiring Board Assemblies," Journal of Electronic Materials, vol. 36 no. 3, pp. 232-241, Mar. 2007.

Nousiainen, O., Putaala, J., Kangasvieri, T., Rautioaho, R., and Vahakangas, J., "Metallurgical Reactions in Composite 90Pb10Sn/Lead-Free Solder Joints and Their Effect on Reliability of LTCC/PWB Assembly," Journal of Electronic Materials, vol. 35 no. 10, pp. 1857-1865, Oct. 2006.

Nousiainen, O., Lehtiniemi, L., Kangasvieri, T., Rautioaho, R., and Vahakangas, J., "Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu spheres in LTCC/PWB assemblies," Microelectronics Reliability, vol. 48 no. 4, pp. 622-630, Apr. 2008.

Nousiainen, O., Kangasvieri, T., Rautioaho, R., and Vahakangas, J., "Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2.5Ag0.8Cu0.5Sb solders in composite solder joints of LTCC/PWB assemblies," Soldering & Surface Mount Technology, vol. 23 no. 1, pp. 30-39, 2011.

Nousiainen, Olli, Kangasvieri, Tero, Ronka, Kari, Rautioaho, Risto, and Vahakangas, Jouko, "Interfacial reactions between Sn-based solders and AgPt thick film metallizations on LTCC," Soldering & Surface Mount Technology , vol. 19 no. 3, pp. 15-25, 2007.

Nousiainen, Olli, Kangasvieri, Tero, Rautioaho, Risto, and Vahakangas, Jouko, "Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of -55°C to 150°C," Journal of Electronic Materials , vol. 38 no. 6, pp. 843-851, June 2009.

Nousiainen, Olli, Urhonen, Timo, Kangasvieri, Tero, Rautioaho, Risto, and Vahakangas, Jouko, "Thermomechanically loaded lead-free LGA joints in LTCC/PWB assemblies," Soldering & Surface Mount Technology, vol 22 no. 2, pp. 21-29, 2010.

Novak, Tomas, and Steiner, Frantisek, "Influence of Intermetallic Compounds Growth on Properties of Lead-Free Solder Joints," 2012 35th International Spring Seminar on Electronics Technology, Bad Aussee, Austria, May 9-13, 2012, pp. 213-217.

Novak, Tomas, Hujer, Tomas, and Steiner, Frantisek, "Long-Term Behavior of IMCs in Lead-Free Solder Joints," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 176-181.

Novak, Tomas, and Steiner, Frantisek, "Surface Roughness Influence on Solderability," 32nd International Spring Seminar on Electronics Technology, Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.

Novak, Tomas, and Steiner, Frantisek, "The Area of Spread Solderability Test Use for Roughness Influence Assessment," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 160-165.

Novakovic, R., Lanata, T., Delsante, S., and Borzone, G., "Interfacial reactions in the Sb-Sn/(Cu, Ni) systems: Wetting experiments," Materials Chemistry and Physics, vol. 137 no. 2, pp. 458-465, Dec. 14, 2012.

Novakovic, R., Delsante, S., Lee, J., and Borzone, G., "Surface and transport properties of liquid Ag-Sn alloys and a case study of Ag-Sn eutectic solder," Journal of Materials Science: Materials in Electronics, vol. 29 no. 20, pp. 17108-17121, Oct. 2018.

Novellino, John, "Conference Sheds Light On "Takeback" Laws," Electronic Design , vol. 53 no. 3, pp. 23, Feb. 3, 2005.

Novellino, John, "UL Program Tests For RoHS Compliance," Electronic Design, vol. 53 no. 2, pp. 23, Jan. 20, 2005.

Novikov, Andrej, and Nowottnick, Mathias, "Nanoscaled solder for low-temperature assembling processes," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Novikov, Andrej, and Nowottnick, Mathias, "Potential of BiSn solders for high-temperature electronics," 2018 7th Electronic System-Integration Technology Conference, Dresden, Germany, Sept. 18-21, 2018, pp. xx-xx.

Novita, Deassy, Brist, Gary, and Long, Gary, "Impact of Lead Free Assembly on Laminate Electrical Performance for High Layer Count and High Reliability PCB," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 449-458.

Novotny, V., Skacel, J., Szendiuch, I., and Sandera, J., "The Analysis of Reliability of Solder Joints on SMD Ceramic Resistor Arrays," 2017 40th International Spring Seminar on Electronics Technology, Sofia, Bulgaria, May 10-14, 2017, pp. xx-xx.

Novotny, Vaclav, Adamek, Martin, Skacel, Josef, Sandera, Josef, and Vala, Radek, "The Mechanical Strength of Solder Joints on PCB with OSP Surface Protection," 2016 39th International Spring Seminar on Electronics Technology, Pilsen, Czech Republic, May 18-22, 2016, pp. 249-253.

Nowak, Damian, Dziedzic, Andrzej, Zaluk, Zbigniew, Roguszczak, Henryk, and Weglarski, Mariusz, "Mechanical properties of SMD interconnections on flexible and rigid substrates," Soldering & Surface Mount Technology, vol. 28 no. 1, pp. xx-xx, 2015.

Nowakowski, Piotr, "The influence of residents' behaviour on waste electrical and electronic equipment collection effectiveness," Waste Management and Research , vol. 34 no. 11, pp. 1126-1135, Nov. 2016.

Nowland, Russell, Coyle, Richard, Read, Peter, and Wenger, George, "Telecommunications Case Studies Address Head-In-Pillow (Hnp) Defects and Mitigation through Assembly Process Modifications and Control," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S15_01-1-S15_01-20.

Nowottnick, Mathias, Scheel, Wolfgang, Pape, Uwe, Diehm, Rolf, Wiese, Joachim, Kempe, Wolfgang, Mallah, Marcel, Suppa, Manfred, and Fink, Peter, "A Simultaneous and Selective Microwave Supported Soldering Technology," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 79-84.

Nowottnick, Mathias, Novikov, Andrej, Schade, Dirk, and Sykes, Bob, "Alternative Testing Methods for Electronic Assemblies," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 312-316.

Nowottnick, Mathias, Berek, Harry, Bell, Hans, Herwig, Heinz. and Moschallski, Andreas, "Condensation Heating Process for Lead-Free Soldering," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Nowottnick, Mathias, Pape, Uwe, Wittke, Klaus, and Scheel, Wolfgang, "Investigation of Lead Free Solder Processing," 2001 SMTA International Conference Proceedings, Chicago, IL, Sept. 30-Oct. 4, 2001, pp. xx-xx.

Nowottnick, Mathias, Scheel, Wolfgang, Wittke, Klaus, and Pape, Uwe, "Joining Technology with Low Melting Solders and Heat Resistant Adhesives," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 61-66.

Nowottnick, Mathias, and Novikov, Andrej, "Lead-Free Rework - Challenges for Materials and Processing," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 368-374.

Nowottnick, Mathias, Scheel, Wolfgang, Wittke, Klaus, and Pape, Uwe, "Liquid Solders for High Temperature Solder Joints," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S13-2-1-S13-2-7.

Nowottnick, Mathias, Novikov, Andrej, and Trodler, Joerg, "Possibilities and Limits of Bismuth Solders," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 195-200.

Nowottnick, Mathias, Novikov, Andrej, and Trodler, Joerg, "Processing and Reliability of Low-Silver-Alloys," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 325-330.

Nowottnick, Mathias, Pape, Uwe, Wittke, Klaus, and Scheel, Wolfgang, "Solder Joints for High Temperature Electronics," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 693-699.

Nowottnick, Mathias, Scheel, Wolfgang, Pape, Uwe, Diehm, Rolf, Wiese, Joachim, Kempe, Wolfgang, Mallah, Marcel, Suppa, Manfred, and Fink, Peter, "Solder Pastes for Microwave Application," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 415-420.

Nowottnick, Mathias, Pape, Uwe, and Diehm, Rolf, "Void Free Soldering Technology for Power Electronics," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 107-112.

Noyan, Alexey A., Leontiev, Alexey P., Yakovlev, Maxim V., Roslyakov, Ilya V., Tsirlina, Galina A., and Napolskii, Kirill S., "Electrochemical growth of nanowires in anodic alumina templates: the role of pore branching," Electrochimica Acta, vol. 226, pp. 60-68, Feb. 1, 2017.

Nozaki, Mineo, Sakane, Masao, and Tsukada, Yutaka, "Crack propagation behavior of Sn-3.5Ag solder in low cycle fatigue," International Journal of Fatigue, vol. 30 no. 10-11, pp. 1729-1736, Oct./Nov. 2008.

Nozu, Masahiro, Kuzuhara, Akira, Hayashi, Atsuko, Otake, Hiroshi, Hashimoto, Shigeo, and Gudeczauskas, Donald, "High Phosphorous Electroless Nickel Process for Mobile Phone PWBs," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S10-1-1-S10-1-9.

Nukala, Prathyusha, Sapkota, Gopal, Gali, Pradeep, and Philipose, U., "Transport properties of Sb-doped Si nanowires," Journal of Crystal Growth, vol. 353 no. 1, pp. 140-144, Aug. 15, 2012.

Nukii, Takashi, Kakimoto, Noriko, Atarashi, Hisashi, Matsubara, Hiroshi, Yamamura, Keiji, and Matsui, Hirotoshi, "LSI Chip Mounting Technology for Liquid Crystal Displays," Proceedings of the 1990 International Symposium on Microelectronics, Chicago, IL, Oct. 15-17, 1990, pp. 257-262.

Numakura, Dominique, "Green procurement by OEMs moving along in Japan," PCB007, Sept. 2, 2003.

Numakura, Dominique, "Halogen-Free Materials: Ready for Prime Time?," Printed Circuit Design and Manufacture, vol. 23 no. 8, pp. 40, Aug. 2006.

Numakura, Dominique, and Turunen, Robert, "Next Generation Interconnect Technologies for Chip on Flexible Substrates," 2005 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Numakura, Dominique, "TAB vs. Flexible Circuits: Which is the Best Solution for High Density 3-D Wiring?," Circuitree, vol xx no. x, pp. xx-xx, June 2002.

Nunes, D., Calmeiro, T. R., Nandy, S., Pinto, J. V., Pimentel, A., Barquinha, P., Carvalho, P. A., Walmsley, J. C., Fortunato, E., and Martins, R., "Charging effects and surface potential variations of Cu-based nanowires," Thin Solid Films, vol. 601, pp. 45-53, Feb. 29, 2016.

Nunez, C. Garcia, Brana, A. F., Lopez, N., and Garcia, B. J., "GaAs nanowires grown by Ga-assisted chemical beam epitaxy: Substrate preparation and growth kinetics," Journal of Crystal Growth, vol. 430, pp. 108-115, Nov. 15, 2015.

Nunez, C. Garcia, Brana, A. F., Lopez, N., and Garcia, B. J., "On the growth mechanisms of GaAs nanowires by Ga-assisted chemical beam epitaxy," 2015 10th Spanish Conference on Electron Devices, Madrid, Spain, Feb. 11-13, 2015, pp. xx-xx.

Nunez, C. Garcia, Brana, A. F., Pau, J. L., Ghita, D., Garcia, B. J., Shen, G., Wilbert, D. S., Kim, S. M., and Kung, P., "Pure zincblende GaAs nanowires grown by Ga-assisted chemical beam epitaxy," Journal of Crystal Growth, vol. 372, pp. 205-212, June 1, 2013.

Nurmi, S., Sundelin, J., Ristolainen, E., and Lepisto, T., "The effect of solder paste composition on the reliability of SnAgCu joints," Microelectronics Reliability, vol. 44 no. 3, pp. 485-494, Mar. 2004.

Nurmi, S. T., Sundelin, J. J., Ristolainen, E. O., and Lepisto, T., "The influence of multiple reflow cycles on solder joint voids for lead-free PBGAs," Soldering & Surface Mount Technology, vol. 15 no. 1, pp. 31-38, 2003.

Nurmi, Sami T., Limnell, Teijo J., Hinkka, Leena M., Ristolainen, Eero O., and Lepisto, Toivo K., "Improving the Reliability of Pb-free BGA Solder Joints by Using the Second Reflow," Advances in Electronic Packaging, vol. 2, pp. 1363-1367, 2001.

Nurmi, Sami Tapani, and Ristolainen, Eero Olavi, "Reliability of tin-lead balled BGAs soldered with lead-free solder paste," Soldering & Surface Mount Technology, vol. 14 no. 2, pp. 35-39, 2002.

Nurmi, Sami T., Sundelin, Janne J., Ristolainen, Eero O., and Lepisto, Toivo K., "The Effect of Multiple Reflow Times on Lead-Free Solder Joint Microstructure," Advances in Electronic Packaging 2003, Volume 1 , Maui, Hawaii, July 6-11, 2003, pp. 799-808.

Nurmi, Sami T., Sundelin, Janne J., Ristolainen, Eero O., and Lepisto, Toivo K., "The effect of PCB surface finish on lead-free solder joints," Soldering & Surface Mount Technology, vol. 17 no. 1, pp. 13-23, 2005.

Nurwahida, Mohd Zaini, Mohtar, Mukridz Md, Mohamad, Ahmad Azmin, and Nazeri, Muhammad Firdaus Mohd, "Microstructure and Phase Analyses on the Corrosion of SAC305 Solder in NaCl Solution," Solid State Phenomena, vol. 273, pp. 91-94, Apr. 2018.

Nuse, J. D., Somerville, D. A., and Emery, J. M., "The Latest Developments in Hard Chrome Replacement Using Coatings Applied by HVOF," 1999 Aerospace/Airline Plating & Metal Finishing Forum , Jacksonville, FL, Apr. 20-22, 1999, pp. 113-119.

Nuse, James D., Klein, Stan, and Novotny, Paul, "Case Study on the Replacement of Electrolytic Hard Chrome Plating With Tungsten Carbides Applied by HVOF on AerMet 100 Alloy* A Holistic Approach to Coating," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. 799-807.

Nussler, H. D., von Goldbeck, O., and Spencer, P. J., "A Thermodynamic Assessment of the Iron-Tin System," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 3 no. 1, pp. 19-26, 1979.

Nuttall, Rick, "Lead Free Hand Soldering and Rework," SMART Group Lead-Free Seminar , Shannon, Ireland, May 19, 2005.

Nyamannavar, S., and Prabhu, K. N., "Thermal contact at solder/substrate interfaces during solidification," Materials Science and Technology, vol. 25 no. 6, pp. 707-710, June 2009.

Nyamannavar, Shankargoud, and Prabhu, K. Narayan, "Experimental Models for Assessment of Interfacial Heat Transfer in Dip Soldering," Advanced Materials Research, vol. 83-86, pp. 1228-1235, 2010.

Nychka, John A., Li, Yan, Yang, Fuqian, and Chen, Rong, "Can Whiskers Grow on Bulk Lead-Free Solder?," Journal of Electronic Materials, vol. 37 no. 1, pp. 90-95, Jan. 2008.

Nye, Larry, "Environmentally Friendly Solutions to Meet Your Semiconductor Packaging Needs," Texas Instruments.

Nysaether, Jon B., Lai, Zonghe, and Liu, Johan, "Isotropically Conductive Adhesives and Solder Bumps for Flip Chip On Board Circuits - a Comparison of Lifetime under Thermal Cycling," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 125-131.

Nysaether, Jon B., Lai, Zonghe, and Liu, Johan, "Thermal Cycling Lifetime of Flip Chip On Board Circuits with Solder Bumps and Isotropically Conductive Adhesive Joints," IEEE Transactions on Advanced Packaging, vol. 23 no. 4, pp. 743-749, Nov. 2000.

OOOO

O, M., Suzuki, T., and Kajihara, M., "Kinetics of Isothermal Reactive Diffusion Between Solid Cu and Liquid Sn," Journal of Electronic Materials, vol. 47 no. 1, pp. 18-26, Jan. 2018.

O, Minho, Vakanas, George, Moelans, Nele, Kajihara, Masanori, and Zhang, Wenqi, "Formation of compounds and Kirkendall vacancy in the Cu-Sn system," Microelectronic Engineering, vol. 120, pp. 133-137, May 25, 2014.

Obaid, Ahmad Abu, Sloan, Jay G., Lamontia, Mark A., Paesano, Antonio, Khan, Subhotosh, and Gillespie Jr., John J., "Experimental In Situ Characterization and Creep Modeling of Tin-Based Solder Joints on Commercial Area Array Packages at -40 °C, 23 °C, and 125 °C," Journal of Electronic Packaging, vol. 127 no. 4, pp. 430-439, Dec. 2005.

Obaidat, M., Hamasha, S., Jaradat, Y., Qasaimeh, A., Arfaei, B., Anselm, M., and Borgesen, P., "Effects of Varying Amplitudes on the Fatigue Life of Lead Free Solder Joints," 2013 IEEE 63rd Electronic Components and Technology Conference , Las Vegas, NV, May 28-31, 2013, pp. 1308-1314.

Oberndorff, P. J. T. L., Dittes, M., and Petit, L., "Intermetallic Formation in Relation to Tin Whiskers."

Oberndorff, P. J. T. L., Dittes, M., Petit, L., Chen, C. C., Klerk, J., and Kluizenaar, E. E. de, "Tin Whiskers on Lead-free Platings," 2002 Semiconductor Equipment and Materials International, 2002, pp. xx-xx.

Oberndorff, P., Dittes, M., Crema, P., and Chopin, S., "Whisker Formation on Matte Sn Influencing of High Humidity," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 429-433.

Oberndorff, P., Dittes, M., and Crema, P., "Whisker Testing: Reality of Fiction?."

Oberndorff, Pascal, Dittes, Marc, Crema, Paolo, Su, Peng, and Yu, Elton, "Humidity Effects on Sn Whisker Formation," IEEE Transactions on Electronics Packaging Manufacturing, vol. 29 no. 4, pp. 239-245, Oct. 2006.

O'Boyle, John, "Tin Whiskers Are Real and Complex," maxim integrated Tutorials 5250, Dec. 13, 2011.

O'Brien, Gerard, and Hillman, Dave, "Extreme Long Term Printed Circuit Board Surface Finish Solderability Assessment," International Conference on Soldering & Reliability 2016 Proceedings, Toronto, Ontario, Canada, May 9-11, 2016, pp. xx-xx.

O'Brien, Neil, and Kentner, Scott, "Fine-Pitch QFN Rework "Triple the Challenge in a Lead Free World"," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 761-765.

O'Brien, Pamela, and Koschmieder, Thomas, "Quad Flat Pack No Lead (QFN) Board Level Reliability Study for Automotive Applications," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 203-211.

Ocak, Y., Aksoz, S., Marasli, N., and Keslioglu, K., "Experimental determination of thermal conductivity and solid-liquid interfacial energy of solid Ag3Sn intermetallic in the Sn-Ag-In ternary alloy," Intermetallics, vol. 18 no. 11, pp. 2250-2258, Nov. 2010.

Ocak, Yavuz, Aksoz, Sezen, Marasli, Necmettin, and Keslioglu, Kazim, "Thermal and electrical conductivity of Sn-Ag-In alloys," Journal of Non-Crystalline Solids, vol. 356 no. 35-36, pp. 1795-1801, Aug. 1, 2010.

Ochiai, Masayuki, Akamatsu, Toshiya, and Ueda, Hidefumi, "Reliability of Solder Joints Assembled with Lead-Free Solder," Fujitsu Scientific & Technical Journal, vol. 38 no. 1, pp. 96-101, June 2002.

Ochmann, Maximilian, Leslie, David, Meier, Karsten, Dasgupta, Abhijit, and Bock, Karlheinz, "The Effect of Low Temperature Conditions on Vibration Durability of SAC105 Interconnects," 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Krakow, Poland, Apr. 26-29, 2020, pp. xx-xx.

Ochoa, F., Williams, J. J., and Chawla, N., "Effect of Cooling Rate on the Microstructure and Mechanical Behavior of Sn-3.5Ag Solder," Journal of Electronic Materials, vol. 33 no. 12, pp. 1596-1607, Dec. 2004.

Ochoa, F., Williams, J. J., and Chawla, N., "Effects of Cooling Rate on the Microstructure and Tensile Behavior of a Sn-3.5wt.%Ag Solder," Journal of Electronic Materials, vol. 32 no. 12, pp. 1414-1420, Dec. 2003.

Ochoa, F., Williams, J. J., and Chawla, N., "The Effects of Cooling Rate on Microstructure and Mechanical Behavior of Sn-3.5Ag Solder," JOM, vol. 55 no. 6, pp. 56-60, June 2003.

Ocklenburg, Johanna, Rastjagaev, Eugen, and Wilde, Juergen, "Investigation of Modern Electrically Conductive Adhesives for Die-attachment in Power Electronics Applications," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 2189-2195.

Ocklenburg, Johanna, Rastjagaev, Eugen, Moeller, Eike, and Wilde, Juergen, "Is Conductive Adhesive Bonding Suited for the Die-Attachment of Power Devices?," 2014 8th International Conference on Integrated Power Systems , Nuremberg, Germany, Feb. 25-27, 2014, pp. xx-xx.

O'Connell, Jon, "NO HASL - WHAT'S THE HASSLE?"

O'Connell, Jon, "Study and recommendations into using lead free printed circuit board finishes at manufacturing in circuit test stage," Agilent Technologies.

O'Connell, Jon, "Using lead-free PCB finishes in circuit test," EE Times - Asia , vol. xx no. xx, pp. xx-xx, Jan. 2, 2006.

O'Connell, Jon, "Using lead-free PCB finishes in circuit test," EE Times - Asia , vol. xx no. xx, pp. xx-xx, Jan. 1, 2006.

O'Connell, Maurice, Hickey, Stewart, Besiou, Maria, Fitzpatrick, Colin, and Van Wassenhove, Luk N., "Feasibility of Using Radio Frequency Identification to Facilitate Individual Producer Responsibility for Waste Electrical and Electronic Equipment," Journal of Industrial Ecology, vol. 17 no. 2, pp. 213-223, Apr. 2013.

O'Connell, Maurice, Fitzpatrick, Colin, and Hickey, Stewart, "Investigating Reuse of B2C WEEE in Ireland," 2010 IEEE International Symposium on Sustainable Systems and Technology, Arlington, VA, May 17-19, 2010, pp. xx-xx.

O'Connell, Maurice, Fitzpatrick, Colin, and Hickey, Stewart, "WEEE Reuse Trials in Ireland," 2011 IEEE International Symposium on Sustainable Systems and Technology, Chicago, IL, May 16-18, 2011, pp. xx-xx.

O'Connell, Scott, Whitley, Allen, Brady, Todd, Ching, Steve, Fong, Arthur, Bergman, Ruben, and Burkitt, John, "Environmental Assessment of Halogen-Free Printed Circuit Boards, A Design for Environment (DfE) Project with the High Density Packaging User Group (HDPUG)," 2004 IEEE International Symposium on Electronics & the Environment Conference Record, Scottsdale, AZ, May 10-13, 2004, pp. 40-45.

O'Connell, Scott, "Halogen Free Projects Within HDP User Group," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

O'Connell, Scott, "IPC Halogen-Free Electronics Standard Task Group 4-33a: Update on Working Draft of J-709, Definition of Maximum Limits on Bromine and Chlorine Used in Materials for Low Halogen Electronic Components and Assemblies," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

O'Conor, Mark, "RoHS and WEEE," Bird & Bird, 12-05-04.

Oda, Yukinori, Kiso, Masayuki, Hashimoto, Shigeo, Milad, George, and Gudeczauskas, Donald, "IMC Growth Study on Ni-P/Pd/Au Film and Ni-P/Au Film Using Sn/Ag/Cu Lead-Free Solder," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S36-02-1-S36-02-6.

Oda, Yukinori, Fukumuro, Naoki, and Yae, Shinji, "Intermetallic Compound Growth between Electroless Nickel/Electroless Palladium/Immersion Gold Surface Finish and Sn-3.5Ag or Sn-3.0Ag-0.5Cu Solder," Journal of Electronic Materials, vol. 47 no. 4, pp. 2507-2511, Apr. 2018.

Oda, Yukinori, "Solder Joint Reliability of Lead Free Material for Electroless Nickel/Palladium/Gold Film," Journal of the Surface Finishing Society of Japan, vol. 58 no. 2, pp. 109-112, 2007.

Odashima, Noritomo, O, Minho, and Kajihara, Masanori, "Formation of Intermetallic Compounds and Microstructure Evolution due to Isothermal Reactive Diffusion at the Interface Between Solid Co and Liquid Sn," Journal of Electronic Materials, vol. 49 no. 2, pp. 1568-1576, Feb. 2020.

Ode, Machiko, Ueshima, Minoru, Abe, Taichi, Murakami, Hideyuki, and Onodera, Hidehiro, "Numerical Prediction of Fraction of Eutectic Phase in Sn-Ag-Cu Soldering Using the Phase-Field Method," Journal of Electronic Materials, vol. 35 no. 11, pp. 1969-1974, Nov. 2006.

Ode, Machiko, Koyama, Toshiyuki, Onodera, Hidehiro, and Suzuki, Toshio, "Phase-Field Modeling for Sn-Bi Soldering," Journal of Electronic Materials, vol. 32 no. 12, pp. 1534-1539, Dec. 2003.

Odenwalder, David, "Avoiding the PCB Bandwagon," Circuits Assembly, vol. 19 no. 2, pp. 8, Feb. 2008.

Oding, I. A., "New principles of increasing strength," Metal Science and Heat Treatment, vol. 38 no. 7, pp. 282-284, July 1996.

Oding, I. A., and Koptyev, I. M., "The growth mechanism of filament crystals," Metal Science and Heat Treatment of Metals, vol. 3 no. 7-8, pp. 291-294, July-Aug. 1961.

O'Donnell, Benedict, Yu, Linwei, Foldyna, Martin, and Cabarrocas, Pere Roca i, "Silicon nanowire solar cells grown by PECVD," Journal of Non-Crystalline Solids, vol. 358 no. 17, pp. 2299-2302, Sept. 1, 2012.

O'Donnell, K., Kostetsky, J., Devito, R., Bellido-Gonzalez, V., Powell, S., and Monaghan, D., "Sputtered nickel UBM for lead-free solder bumping," flipchips.com, Oct. 2003.

O'Donnell, Kathy, "UBM: Creating the Critical Interface," Advanced Packaging, vol. 17 no. 4, pp. 44, Apr. 2008.

O'Donnell, Kathy, "Under Bump Metallurgy for Lead-free Solder," Lead-free Electronics , Nov. 2004.

Oele, Michiel, "Assessing LCA data & methodology used for the Energy using Products (EuP) directive," InLCA/LCN 2006, Washington, DC, Oct. 4-6, 2006, pp. xx-xx.

Oezkoek, Mustafa, Ramos, Gustavo, Metzger, Dieter, and Roberts, Hugh, "Benefits of Pure Palladium for ENEP and ENEPIG Surface Finishes," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Oezkoek, Mustafa, Kilian, Arnd, and Roberts, Hugh, "Electroless Pure Palladium Deposition on Copper as a Cu Wire Bondable Surface Finish," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 966-970.

Oezkoek, Mustafa, Mertens, Hubertus, and Bruder, Maren, "Immersion Tin Surface Finish - Reviewing the Past and a Look to the Future," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 941-944.

Oezkoek, Mustafa, Ramos, Gustavo, Metzger, Dieter, and Roberts, Hugh, "The Benefits of ENEPIG with Pure Pd for Gold Wire Bonding," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 987-990.

Oezkoek, Mustafa, Ramos, Gustavo, Budiardjo, Rahmat, and Roberts, Hugh, "The Benefits of Pure Pd Layers in ENEP and ENEPIG Surface Finishes," South East Asia Technical Training Conference on Electronics Assembly Technologies 2011 Proceedings, Penang, Malaysia, May 19-20, 2011, pp. xx-xx.

O'Flaherty, Sean, "Non-Destructive Real-time Optical Metrology of OSP Coatings on Production PCBs," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S19:03.

O'Flaherty, Sean M., "Optical Reflectivity As a Nondestructive Measurement Technique for OSP Coating," CircuiTree, vol. 21 no. 3, pp. xx-xx, Mar. 2008.

Ofner, Gerald, Chua, Khoon Lam, Teo, Mary, and Lee, Charles, "Considerations for a Robust Moisture Performance of a Flip Chip in Package for Lead-Free Soldering," 2004 6th International Conference on Electronic Packaging Technology, Singapore, Dec. 8-10, 2004, pp. 218-223.

Ogando, Joseph, "Non-lead PVC stabilizers closing performance gap in wire," Plastics Technology, vol. xx no. xx, pp. xx-xx, July 1993.

Ogata, Shigeyuki, Kanai, Masayuki, and Takei, Toshiyasu, "Wetting Balance Evaluation by SP Tension Method for Pb Free Solder Paste," 1998 IEMT/IMC Proceedings, Tokyo, Japan, Apr. 15-17, 1998, pp. 386-391.

Ogawa, Fumio, Itoh, Takamoto, and Yamamoto, Takaei, "Evaluation of multiaxial low cycle fatigue cracks in Sn-8Zn-3Bi solder under non-proportional loading," International Journal of Fatigue, vol. 110, pp. 215-224, May 2018.

Ogawa, Fumio, Hiyoshi, Noritake, Konishi, Yutaka, and Itoh, Takamoto, "Low-Cycle Fatigue Testing Using a Small Specimen of Sn-58Bi Solder at 313 K and 353 K," Journal of Electronic Materials, vol. 48 no. 3, pp. 1777-1784, Mar. 2019.

Ogawa, Naotaka, Miki, Takahiro, Nagasaka, Tetsuya, and Hino, Mitsutaka, "Activity Measurement of the Constituents in Molten Sn-Mg-Zn Ternary Lead Free Solder Alloys by Mass Spectrometry," Materials Transactions, vol. 43 no. 12, pp. 3227-3233, Dec. 2002.

Ogawa, T., Kaga, R., and Ohsawa, T., "Microstructure and Mechanical Properties Predicted by Indentation Testing of Lead-Free Solders," Journal of Electronic Materials, vol. 34 no. 3, pp. 311-317, Mar. 2005.

Ogawa, Taiki, and Yu, Qiang, "Evaluation of variation of BGA solder joints fatigue life using finite element method," 2019 IEEE 21st Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 4-6, 2019, pp. 396-401.

Ogawa, Tatsuo, Erbil, Ahmet, and Bhattacharya, Swapan K., "Lead-free High K Dielectrics for Integral Capacitor Using MOCVD," Proceedings 2001 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4587) , Baltimore, MD, Oct. 9-11, 2001, pp. 458-463.

Ogden, Robert R., and Champaign, Robert F., "Tin Whisker Observations," Circuits Assembly, vol. 20 no. 11, pp. 26-29, Nov. 2009.

Oguchi, Masahiro, Murakami, Shinsuke, Tasaki, Tomohiro, Daigo, Ichiro, and Hashimoto, Seiji, "A database and characterization of existing lifespan information of electrical and electronic equipment," 2010 IEEE International Symposium on Sustainable Systems and Technology, Arlington, VA, May 17-19, 2010, pp. xx-xx.

Oguchi, Masahiro, Murakami, Shinsuke, Sakanakura, Hirofumi, Kida, Akiko, and Kameya, Takashi, "A preliminary categorization of end-of-life electrical and electronic equipment as secondary metal resources," Waste Management, vol. 31 no. 9-10, pp. 2150-2160, Sept.-Oct. 2011.

Oguibe, C. N., Mannan, S. H., Whalley, D. C., and Williams, D. J., "Conduction Mechanisms in Anisotropic Conducting Adhesive Assembly," The First IEEE International Symposium on Polymeric Electronics Packaging , Oct. 26-30, 1997, pp. 249-258.

Oguibe, Chuks N., Mannan, Samjid H., Whalley, David C., and Williams, David J., "Conduction Mechanisms in Anisotropic Conducting Adhesive Assembly," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 21 no. 2, pp. 235-242, June 1998.

Oguibe, Chuks N., Mannan, Samjid H., Whalley, David C., and Williams, David J., "Flip-Chip Assembly using Anisotropic Conducting Adhesives: Experimental and Modelling Results," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 27-33.

Ogunjimi, A. O., Whalley, D. C., Williams, D. J., "A Comparison of Modelling Methods for Electronic Interconnect Structures," 1993 Proceedings 43rd Electronic Components & Technology Conference , Orlando, FL, June 1-4, 1993, pp. 871-876.

Ogunjimi, A. O., Boyle, O., Whalley, D. C., and Williams, D. J., "A review of the impact of conductive adhesive technology on interconnection," Journal of Electronics Manufacturing, vol. 2 no. x, pp. 109-118, 1992.

Ogunjimi, A. O., Mannan, S. H., Whalley, D. C., and Williams, D. J., "The Assembly Process for Anisotropic Conductive Joints - Some New Experimental and Theoretical Results," Journal of Electronics Manufacturing, vol. 5 no. 4, pp. 263-271, Dec. 1995.

Ogunjimi, A. O., Whalley, D. C., and Williams, D. J., "Thermal Stress Analysis of Conductive Adhesive Joints," Proceedings of 1993 Japan International Electronic Manufacturing Technology Symposium, Kanazawa, Japan, June 9-11, 1993, pp. 349-353.

Ogunjimi, Adebayo Oluyinka, Mannan, Samjid H., Whalley, David C., and Williams, David J., "Assembly of Planar Array Components Using Anisotropic Conducting Adhesives - A Benchmark Study: Part I - Experiment," IEEE Transactions on Components, Packaging, and Manufacturing Technology Part C: Manufacturing , vol. 19 no. 4, pp. 257-263, Oct. 1996.

Ogunseitan, Dele, Schoenung, Julie, Saphores, Jean-Daniel, Shapiro, Andrew, Stein, Toni, and Bhuie, Amrit, "Biocomplex Dimensions of Industrial Ecology: An Analysis of Sectorial Trade-Offs in the Management of Toxic Substances Used in the Electronics Industry," NSF-MUSES Workshop, Jan. 30, 2003.

Ogunseitan, Dele, Schoenung, Julie, Saphores, Jean-Daniel, Shapiro, Andrew, Bhuie, Amrit, Kang, Hai-Yong, Nixon, Hilary, and Stein, Antoinette, "The devil that we know: Lead (Pb) replacement policies under conditions of scientific uncertainty," Proceedings of the Third International Symposium on Microelectronics and Packaging, Israel, June 2003.

Ogunseitan, O. A., Schoenung, J. M., Shapiro, A. A., Saphores, J-D. M., Bhuie, A. K., and Stein, A. W., "Biocomplex dimensions of industrial ecology: sectoral trade-offs on selecting alternatives to lead (Pb) in electronics," Sustainable Planning and Development, 2003.

Ogunseitan, Oladele A., "Public Health and Environmental Benefits of Adopting Lead-Free Solders," JOM, vol. 59 no. 7, pp. 12-17, July 2007.

Ogura, Hiroshi, Maruyama, Minoru, Matsubayashi, Ryo, Ogawa, Tetsuya, Nakamura, Shigeyoshi, Komatsu, Teruo, Nagasawa, Hiroshi, Ichimura, Akio, and Isoda, Seiji, "Carboxylate-Passivated Silver Nanoparticles and Their Application to Sintered Interconnection: A Replacement for High Temperature Lead-Rich Solders," Journal of Electronic Materials, vol. 39 no. 8, pp. 1233-1240, Aug. 2010.

Oh, Chang-Seok, Shim, Jae-Hyeok, Lee, Byeong-Joo, and Lee, Dong Nyung, "A thermodynamic study on the Ag-Sb-Sn system," Journal of Alloys and Compounds, vol. 238 no. 1-2, pp. 155-166, May 1, 1996.

Oh, Chang Yul, Roh, Hee-Ra, Kim, Young Min, Lee, Jin Soo, Cho, Hae Young, and Kim, Young-Ho, "A new solder wetting layer for Pb-free solders," Journal of Materials Research, vol. 24 no. 2, pp. 297-300, Feb. 2009.

Oh, Chulmin, Kim, Ayoung, Kim, Juhee, Bang, Junghwan, Ha, Jeongwon, and Hong, Won-Sik, "Bonding copper ribbons on crystalline photovoltaic modules using various lead-free solders," Journal of Materials Science: Materials in Electronics, vol. 26 no. 12, pp. 9721-9726, Dec. 2015.

Oh, Chulmin, Nagao, Shijo, and Suganuma, Katsuaki, "Diffusional Hillock Growth in Ag Stress Migration Bonding for Power Device Interconnections," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1128-1133.

Oh, Chulmin, Nagao, Shijo, Sugahara, Tohru, and Suganuma, Katsuaki, "Hillock growth dynamics for Ag stress migration bonding," Materials Letters, vol. 137, pp. 170-173, Dec. 15, 2014.

Oh, Chulmin, Nagao, Shijo, Kunimune, Teppei, and Suganuma, Katsuaki, "Pressureless wafer bonding by turning hillocks into abnormal grain growths in Ag films," Applied Physics Letters, vol. 104, pp. 161603-1-161603-4, 2014.

Oh, Harim, and Lee, Myeongkyu, "Laser-induced electrical property patterning of Ag nanowire transparent electrode," Materials Letters, vol. 176, pp. 110-113, Aug. 1, 2016.

Oh, Jin Yong, and Islam, M. Saif, "Silicon Nanowire Bridge Arrays With Dramatically Improved Yields Enabled by Gold Colloids Functionalized With HF Acid and Poly-L-Lysine," IEEE Transactions on Nanotechnology, vol. 12 no. 6, pp. 1173-1177, Nov. 2013.

Oh, Kwang W., and Ahn, Chomg H., "Flip-Chip Packaging with Micromachined Conductive Polymer Bumps," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 224-228.

Oh, Seyong, Khandros, Igor Y., and Poetzinger, Janet L., "Real-Time Investigation of Solid and Liquid State Reactions In Au-Sn/Cu System," Advanced Electronic Packaging Materials, Boston, MA, Nov. 27-29, 1989, pp. 315-319.

Oh, Sung-Yong, Hwang, Tai-Bok, and Oh, Yong-Jun, "Thermal Stability of the Interfaces between uBGA Lead-Free Solder (Sn-3.5Ag-0.7Cu) and Electro Ni and Electroless Ni-P Layers," Journal of the Korean Institute of Metals and Materials, vol. 42 no. 9, pp. 751-759, Sept. 2004

Oh, Yong-Jun, and Oh, Sung-Yong, "Inhomogeneous Consumption of the Electroless Ni-P Layer at the Solder Joint Formed with Sn-3.5Ag-0.7Cu," Journal of Electronic Materials, vol. 38 no. 12, pp. 2554-2562, Dec. 2009.

Ohachi, T., Inada, M., Asai, K., and Feng, J. M., "Arsenic pressure dependence of hillock morphology on GaAs (n 1 1)A substrates grown using MBE," Journal of Crystal Growth, vol. 227-228, pp. 67-71, July 2001.

Ohachi, T., and Taniguchi, I., "Growth of a-Ag2S and a-Ag2Se single crystals in a solid/vapour system," Journal of Crystal Growth, vol. 40 no. 1, pp. 109-117, Sept. 1977.

Ohachi, T., and Taniguchi, I., "The Growth and Morphology of Silver Whiskers," Journal of Crystal Growth, vol. 24-25 no. xx, pp. 362-366, Oct. 1974.

Ohachi, Tadashi, and Taniguchi, Ichiro, "Controlled Filamentary Growth of Silver from Silver Compounds," Journal of Crystal Growth, vol. 13/14, pp. 191-197, May 1972.

Ohama, Osamu, Sakai, Toshiaki, Yamada, Masaaki, Kimura, Atsushi, and Shibata, Masahiro, "Analysis of Thermal Desorption of Gas from Solder Plating Film in Reflow Soldering Process," SEI Technical Review, no. 58, pp. 3-6, June 2004.

O'Hara, Wanda, Cheng, Chih-Min, and Smith, Sherri L., "Cure Processing Effects of Conductive Adhesives as Solder Alternatives: Performance and Reliability," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 859-863.

Ohgai, Takeshi, Takao, Keizo, Mizumoto, Masayuki, Kagawa, Akio, Tanaka, Yoshitomo, and Sumita, Shigekazu, "Electrodeposition of Ferromagnetic Metal Nanowires," Materials Science Forum, vol. 638-642, pp. 787-792, Jan. 2010.

Ohgai, Takeshi, Fujimaru, Takafumi, Takao, Keizo, and Kagawa, Akio, "Fabrication of Numerous Ferromagnetic Metal Nanowires Using Electrodeposition Technique," Materials Science Forum, vol. 654-656, pp. 1724-1727, June 2010.

Ohgaki, Masataka, "Structural Analysis of Whisker on Lead-free Plate," Journal of the Surface Finishing Society of Japan, vol. 59 no. 4, pp. 237-241, 2008.

Ohguchi, Ken-Ichi, Sasaki, Katsuhiko, and Ishibashi, Masahiro, "A Quantitative Evaluation of Time-Indepenent and Time-Dependent Deformations of Lead-Free and Lead-Containing Solder Alloys," Journal of Electronic Materials, vol. 35 no. 1, pp. 132-139, Jan. 2006.

Ohguchi, Ken-Ichi, and Sasaki, Katsuhiko, "A Viscoplastic Constitutive Model and Estimation Method of Material Constants for Lead-free Solder Alloys," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part C , San Francisco, CA, July 17-22, 2005, pp. 1791-1796.

Ohguchi, Ken-ichi, and Kurosawa, Kengo, "An Evaluation Method for Tensile Characteristics of Cu/Sn IMCs Using Miniature Composite Solder Specimen," Journal of Electronic Materials , vol. 45 no. 6, pp. 3183-3191, June 2016.

Ohguchi, Ken-ichi, Sasaki, Katsuhiko, and Aso, Setsuo, "Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test," Proceedings of the ASME InterPack Conference, Volume 2, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 107-113.

Ohguchi, Ken-ichi, Sasaki, Katsuhiko, and Aso, Setsuo, "Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test," Journal of Electronic Packaging, vol. 131 no. 2, pp. 021003-1-021003-7, June 2009.

Ohguchi, Ken-ichi, and Sasaki, Katsuhiko, "Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves," Journal of Electronic Packaging, vol. 132 no. 4, pp. 041010-1-041010-7, Dec. 2010.

Ohguchi, Ken-ichi, and Sasaki, Katsuhiko, "Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves," Journal of Electronic Packaging, vol. 132 no. 4, pp. 041003-1-041003-7, Dec. 2010.

Ohhachi, Tadashi, and Taniguchi, Ichiro, "Growth Control of Silver Whiskers on a-Ag2S, a-Ag2Se and a-Ag2Te," Japanese Journal of Applied Physics, vol. 8 no. x, pp. 1062-1063, 1969.

Ohiienko, Oleksii, and Oh, Young-Jei, "Corrigendum to "Preparation of narrow copper nanowires with less oxidized surface for flexible and transparent electrodes under octadecylamine" [Mater. Chem. Phys. 246 (2020) 122783]," Materials Chemistry and Physics, vol. 254, pp. 123565-1, Nov. 1, 2020.

Ohiienko, Oleksii, and Oh, Young-Jei, "Preparation of narrow copper nanowires with less oxidized surface for flexible and transparent electrodes under octadecylamine," Materials Chemistry and Physics, vol. 246, pp. 122783-1-122783-11, May 1, 2020.

Ohkubo, Tadakatsu, Hirotsu, Yoshihiko, and Nikawa, Kiyoshi, "Molecular Dynamics Simulation of Electromigration under Electric Field," AIP Conference Proceedings, vol. 418, pp. 335-340, 1998.

Ohlsson, B. J., Miller, M. S., Gustafsson, A., and Pistol, M.-E., "Anisotropic GaAs island phase grown on flat GaP: A Stranski-Krastanow-formed corrugated surface," Journal of Applied Physics, vol. 89 no. 10, pp. 5726-5730, May 15, 2001.

Ohlsson, B. J., Bjork, M. T., Magnusson, M. H., Deppert, K., Samuelson, L., and Wallenberg, L. R., "Size-, shape-, and position-controlled GaAs nano-whiskers," Applied Physics Letters, vol. 79 no. 20, pp. 3335-3337, Nov. 12, 2001.

Ohmori, Kiwako, Ishii, Takahiro, Imai, Takayuki, Karasawa, Noriyuki, Haga, Sohichi, Kawakami. Hiroyuki, Ishida, Katsuyoshi, Koshihara, Masatomo, Watanabe, Hiroyuki, and Takano, Nobutoshi, "Flame Retardant Membrane Switch with Eco-friendly Materials," Fujikura Technical Review, no. 33, pp. 29-35, Jan. 2004.

Ohnishi, Tadakazu, "Mind and literacy on environment - Reform of consciousness for global environment and recycling-based society," Journal of Japan Institute of Light Metals, vol. 55 no. 4, pp. 186-197, Apr. 2005.

Ohnuma, I., Liu, X. J., Ohtani, H., Anzai. K., Kainuma, R., and Ishida, K., "Development of Thermodynamic Database for Micro-Soldering Alloys," Proceedings of 3rd Electronics Packaging Technology Conference, Singapore, Dec. 5-7, 2000, pp. 91-96.

Ohnuma, I., Saegusa, T., Takaku, Y., Wang, C. P., Liu, X. J., Kainuma, R., and Ishida, K., "Micorstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap," Journal of Electronic Materials, vol. 38 no. 1, pp. 2-9, Jan. 2009.

Ohnuma, I., Ishida, K., Moser, Z., Gasior, W., Bukat, K., Pstrus, J., Kisiel, R., and Sitek, J., "Pb-Free Solders: Part II. Application of ADAMIS Database in Modeling of Sn-Ag-Cu Alloys with Bi Additions," Journal of Phase Equilibria and Diffusion, vol. 27 no. 3, pp. 245-254, 2006.

Ohnuma, I., Miyashita, M., Anzai, K., Liu, X. J., Ohtani, H., and Ishida, K., "Phase Equilibria and the Related Properties of Sn-Ag-Cu Based Pb-Free Solder Alloys," Journal of Electronic Materials, vol. 29 no. 10, pp. 1137-1144, Oct. 2000.

Ohnuma, I., Cui, Y., Liu, X. J., Inohana, Y., Ishihara, S., Ohtani, H., Kainuma, R., and Ishida, K., "Phase Equilibria of Sn-In Based Micro-Soldering Alloys," Journal of Electronic Materials, vol. 29 no. 10, pp. 1113-1121, Oct. 2000.

Ohnuma, I., Liu, X. J., Ohtani, H., and Ishida, K., "Thermodynamic Database for Phase Diagrams in Micro-Soldering Alloys," Journal of Electronic Materials, vol. 28 no. 11, pp. 1164-1171, Nov. 1999.

Ohnuma, Ikuo, Miyashita, Masamitsu, Liu, Xing Jun, Ohtani, Hiroshi, and Ishida, Kiyohito, "Phase Equilibria and Thermodynamic Properties of Sn-Ag Based Pb-Free Solder Alloys," IEEE Transactions on Electronics Packaging Manufacturing , vol. 26 no. 1, pp. 84-89, Jan. 2003.

Ohoka, T., Nakamura, Y., and Ono, T., "Dependence of frequency on Young's modulus and internal friction in Sn-9Zn and Sn-3.5Ag eutectic lead-free solders," Journal of Materials Science , vol. 39 no. 13, pp. 4379-4381, July 2004.

Ohring, M., and Sun, P. H., "Void Marker Motion During Electromigration in Sn-In Thin Films," Thin Solid Films, vol. 8 no. x, pp. 455-464, 1971.

Ohta, Koushi, Toya, Masao, Yasuda, Kiyokazu, Matsushima, Michiya, and Fujimoto, Kozo, "Observation of Solder Fillers Coalescence in Resin for Development of Self-Organization Assembly Process," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Ohtani, H., and Ishida, K., "A Thermodynamic Study of the Phase Equilibria in the Bi-Sn-Sb System," Journal of Electronic Materials, vol. 23 no. 8, pp. 747-755, Aug 1994.

Ohtani, Hiroshi, Satoh, Isamu, Miyashita, Masamitsu, and Ishida, Kiyohito, "Thermodynamic Analysis of the Sn-Ag-Bi Ternary Phase Diagram," Materials Transactions, vol. 42 no. 5, pp. 722-731, May 2001.

Ohtani, Hiroshi, Ono, Seiichi, Doi, Kodai, and Hasebe, Mitsuhiro, "Thermodynamic Study of Phase Equilibria in the Sn-Ag-Bi-Zn Quaternary System," Materials Transactions, vol. 45 no. 3, pp. 614-624, Mar. 2004.

Ohtani, Hiroshi, Miyashita, Masamitsu, and Ishida, Kiyohito, "Thermodynamic Study of Phase Equilibria in the Sn-Ag-Zn System," Journal of Japan Institute of Metals, vol. 63 no. 11, pp. 685-694, June 1999.

Oi, Jiro, "How a Component Supplier Is Getting the Lead Out," ECN, vol. xx no. xx, pp. xx, Aug. 1, 2000.

Oien, M. A., "A Simple Model for the Thermo-Mechanical Deformations of Plated-Through-Holes in Multilayer Printed Wiring Boards," 14th Annual Reliability Physics Symposium, Las Vegas, NV, Apr. 20-22, 1976, pp. 121-128.

Oien, M. A., "Methods for Evaluating Plated-Through-Hole Reliability," 14th Annual Reliability Physics Symposium, Las Vegas, NV, Apr. 20-22, 1976, pp. 129-131.

Ojima, K., Matsumoto, H., and Taneda, Y., "Differential scanning calorimetry study of the a->b transition in tin," Journal of the Less-Common Metals, vol. 157 no. 1, pp. L15-L18, Jan. 1990.

Ojima, K., Taneda, Y., and Takasaki, A., "Direct Observation of a->b Transformation in Tin by Transmission Electron Microscopy," Physica Status Solidi (a), vol. 139 no. 1, pp. 139-144, 1993. https://doi-org.ezproxy.uky.edu/10.1002/pssa.2211390111

Ojima, K., and Taneda, Y., "Gray tin observed by high-resolution electron microscopy," Journal of Materials Science Letters, vol. 10 no. 9, pp. 529-531, Jan. 1991. https://doi.org/10.1007/BF00726927

Ojo, Bolaji, "Listen to the anti-RoHS," EE Times Europe, Sept. 1, 2006.

Ojo, Bolaji, "Listen to the anti-RoHS," Green SupplyLine, Sept. 1, 2006.

Ojo, Bolaji, "Listen to the anti-RoHS," Electronics Supply & Manufacturing , Sept. 2006.

Ojo, Bolaji, "RoHS: A done deal?," Green SupplyLine, Oct. 1, 2006.

Ojo, Bolaji, "RoHS: A done deal?," Electronics Supply & Manufacturing, Oct. 2006.

Ojo, Balaji, "Roll up your sleeves; it's a new year," Green SupplyLine, Jan. 1, 2005.

Okada, Seiichi, Higuchi, Shoichi, and Ando, Toshihiro, "Field Reliability Estimation of Tin Whiskers Generated by Thermal-Cycling Stress," Capacitor and Resistor Technology Symposium (CARTS) Europe , Oct. 2003, pp. xx-xx.

Okada, Seiichi, "View on Countermeasures for Sn Whiskers for Lead-free Soldering," Murata, Mar. 13, 2003.

Okada, Yoshio, Katahira, Takayoshi, Masuda, Naomi, Koseki, Toru, and Takai, Tadashi, "Material Characterization and In-Situ Process Monitoring for a Robust ACF Base Flip Chip Technology," IEEE Transactions on Components and Packaging Technologies, vol. 24 no. 4, pp. 713-720, Dec. 2001.

Okajima, Yoshihiko, Asai, Shin'ichiro, Terui, Yoshinori, Terasaki, Ryuichi, and Murata, Hiroshi, "Precise control of growth site of silicon vapor-liquid-solid crystals," Journal of Crystal Growth, vol. 141 no. 3-4, pp. 357-362, Aug. 2, 1994.

Okajima, Yoshihiko, Amemiya, Masaru, Kato, Kazuo, and Asai, Shin'ichiro, "VLS growth of silicon whiskers on a patterned silicon-on-insulator (SOI) wafer," Journal of Crystal Growth, vol. 165 no. 1-2, pp. 37-41, July 2, 1996.

Okamoto, H., "Au-Sn (Gold-Tin)," Journal of Phase Equilibria and Diffusion, vol. 28 no. 5, pp. 490, Oct. 2007.

Okamoto, H., "Bi-Sn (Bismuth-Tin)," Journal of Phase Equilibria and Diffusion, vol. 31 no. 2, pp. 205, Apr. 2010.

Okamoto, H., "Ni-Sn (Nickel-Tin)," Journal of Phase Equilibria and Diffusion, vol. 29 no. 3, pp. 297-298, June 2008.

Okamoto, H., "Pd-Sn (Palladium-Tin)," Journal of Phase Equilibria and Diffusion , vol. 33 no. 3, pp. 253-254, June 2012.

Okamoto, H., "Sb-Sn (Antimony-Tin)," Journal of Phase Equilibria and Diffusion, vol. 33 no. 4, pp. 347, 2012.

Okamoto, H., "Sn-Ti (Tin-Titanium)," Journal of Phase Equilibria and Diffusion , vol. 31 no. 2, pp. 202-203, Apr. 2010.

Okamoto, H., "Sn-Zr (Tin-Zirconium)," Journal of Phase Equilibria and Diffusion , vol. xx no. x, pp. xx-xx, xxxx.

Okamoto, H., "Sn-V (Tin-Vanadium)," Journal of Phase Equilibria and Diffusion, vol. 34 no. 1, pp. 78-79, Feb. 2013.

Okamoto, Kiyoshi, Cote, Debbie, and Chinn, Robert, "Are you ready for California RoHS?," Electronics Supply & Manufacturing, June 2006.

Okamoto, Kiyoshu, and Cote, Debbie, "California SB20/50: An update for business-to-business companies," Green SupplyLine, June 18, 2006.

Okamoto, Kiyoshi, Cote, Debbie, and Chinn, Robert, "Deadline January 1, 2007: Are you ready for California RoHS?," Green SupplyLine, May 8, 2006.

Okamoto, Masahide, Serizawa, Koji, Satoh, Hiroshi, Chiba, Momoko, Takamatsu, Takejiro, Itsubo, Norihiro, and Inaba, Atsushi, "Overall Technological Results of IMS-EFSOT Japanese Project -- Environmental Impact of Lead-Free Soldering --," Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 12-14, 2005, pp. 554-558.

Okamoto, Naoki, Fujii, Yuko, Kurihara, Hiroaki, and Kondo, Kazuo, "Effect of the Structures within the Substrates for Sn Whisker Formation," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals , vol. 72 no. 6, pp. 413-419, June 2008.

Okamoto, Naoki, Fujii, Yuko, Kurihara, Hiroaki, and Kondo, Kazuo, "Effects of Microstructure of Deposited Sn Films and Orientation Index of Cu Foils on Sn Whisker Formation Using Substitutionally-Deposited Sn Films," Materials Transactions, vol. 50 no. 11, pp. 2570-2577, 2009.

Okamoto, Naoki, Fujii, Yuko, Kurihara, Hiroaki, and Kondo, Kazuo, "Effects of Structures of Substrates on Sn Whisker Formation Using Substitutionally-Deposited Sn Films," Materials Transactions, vol. 50 no. 10, pp. 2403-2409, 2009.

Okamoto, Yoshiyuki, Takayanagi, Takeshi, Sayama, Toshihiko, Ejiri, Yasuhiro, Nakano, Hiroyuki, and Mori, Takao, "Application of Phase Growth Approach to Prediction of Thermal Fatigue Crack Initiation Lifetime in Sn-3.0Ag-0.5Cu Solder Joints," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 809-814.

O'Keefe, Matthew, and Colfax, Richard, "Aerospace Rework in a Lead-Free World," Assembly Magazine, vol. 48 no. 6, pp. 36-42, June 2005.

O'Keefe, Matthew J., Geng, Sujiang, and Joshi, Simon, "Cerium-Based Conversion Coatings as Alternatives to Hex Chrome," Metal Finishing, vol. 105 no. 5, pp. 25-28, May 2007.

O'Keefe, Matt, "Chromate-Free Corrosion Protection," Industrial Paint and Powder , vol. 82 no. 9, pp. 36-38, Sept. 2006.

Oksenberg, Eitan, Popovitz-Biro, Ronit, Rechav, Katya, and Joselevich, Ernesto, "Guided Growth of Horizontal ZnSe Nanowires and their Integration into High-Performance Blue-UV Photodetectors," Advanced Materials, vol. 27 no. 27, pp. 3999-4005, July 15, 2015.

Okumura, Tomohiro, Saitoh, Mitsuo, Nishikawa, Kazutaka, Furusawa, Akio, and Suetsugu, Kenichiro, "Atmospheric Pressure Plasma Treatment and Non-Flux Lead-Free-Soldering of Cu Wire and Strand," Materials Transactions, vol. 47 no. 3, pp. 941-947, 2006.

Okuyama, F., Aoyama, S., and Fujimoto, Y., "A new approach to corona needle growth based on geometrical and structural analyses," Journal of Crystal Growth, vol. 114 no. 1-2, pp. 107-117, Oct. 1991.

Okuyama, F., "Crystalline Tungsten Grown by Reducing Vapor-Deposited Tungsten Oxide," Journal of Crystal Growth, vol. 38 no. 1, pp. 103-108, Apr. 1977.

Okuyama, F., "Effect of Magnetic Field on Cathodic Needle Growth of Chromium," Journal of Crystal Growth, vol. 63 no. 1, pp. 212-214, Sept. 1983.

Okuyama, F., "Growth of metallic whisker crystals incorporated with field electron emission," Applied Physics Letters, vol. 36 no. 1, pp. 46-47, Jan. 1980.

Okuyama, F., "Needle Crystals Arising from Discharge-Induced Decomposition of Hexacarbonyltungsten Molecules," Journal of Crystal Growth, vol. 49 no. 3, pp. 531-540, July 1980.

Okuyama, F., Shibata, T., and Yasuda, N., "Tungsten needles produced by decomposition of hexacarbonyltungsten," Applied Physics Letters, vol. 35 no. 1, pp. 6-7, July 1979.

Okuyama, Satoru, Yu, Qiang, and Akutsu, Takahiro, "Reliable Evaluation Method for Solder Joints in Vehicle Electronics Devices Considering the Actual Use Conditions," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , San Diego, CA, May 30-June 1, 2012, pp. 654-658.

Olander, Eric, and Cheng, Jun, "A New Alkaline CN-free Silver Process for Electronic, Industrial & Decorative Plating Applications," Proceedings of AESF SUR/FIN '99 , Cincinnati, OH, June 21-24, 1999, pp. 543-547.

Olander, Eric, "Golden Alternative," Products Finishing, vol. xx no. x, pp. xx-xx, Feb. 2008.

Olander, Eric, "Trivalent Yellow Chromate," Plating and Surface Finishing, vol. 95 no. 1, pp. 22-24, Jan. 2008.

Oldland, Dennis, and Reynolds, Chris, "Environmental Alphabet Soup or How AVX gave up Lead and became Green," AVX, 2003.

Oliphant, Chris, Christian, Bev, Subba-Rao, Kishore, Doyle, Fintan, Turbini, Laura, Connell, David, and Han, Jack Q. L., "Head-On-Pillow Defect - A Pain in the Neck or Head-On-Pillow BGA Solder Defect," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S30_01-1-S30_01-10.

Oliveira, J. C. R. E., Braga, M. H., and Travasso, R. D. M., "Simulation of the spinodal phase separation dynamics of the Bi-Zn system," Journal of Non-Crystalline Solids, vol. 354 no. 47-51, pp. 5340-5342, Dec. 1, 2008.

Oliver, J. R., Liu, J., and Lai, Z., Effect of Thermal Ageing on the Shear Strength of Lead-Free Solder Joints," Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, Braselton, GA, Mar. 6-8, 2000, pp. 152-157.

Oliver, James, Nylen, Margareta, Rod, Olivier, and Markou, Christofer, "Fatigue Properties of Sn3.5Ag0.7Cu Solder Joints and Effects of Pb-Contamination," 2002 SMTA International Conference Proceedings , Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Oliver, James, Nylen, Margareta, Rod, Olivier, and Markou, Christofer, "Fatigue Properties of Sn3.5Ag0.7Cu Solder Joints and Effects of Pb-Contamination," Journal of SMT, vol. 15 no. 4, pp. 23-29, 2002.

Olla, Mike, and Daigle, Steven, "Surviving the "Green" Heat Wave," IPC/JEDEC 11th International Conference on Lead Free Electronic Components and Assemblies, Boston, MA, Dec. 6-8, 2005, pp. xx-xx.

Olliff, D., Qu, J., Gaynes, M., Kodnani, R., and Zubelewicz, A., "Characterizing the Failure Envelope of a Conductive Adhesive," Journal of Electronic Packaging, vol. 121 no. 1, pp. 23-30. Mar. 1999.

Olliff, Derrick, Gaynes, Michael, Kodnani, Ramesh, and Zubelewicz, Aleksander, "Characterizing The Failure Envelope of a Conductive Adhesive," Proceedings 3rd International Symposium on Advanced Packaging: Materials Processes, Properties and Interfaces, Braselton, GA, Mar. 9-12, 1997, pp. 124-127.

Olsen, Dennis, Wright, Richard, and Berg, Howard, "Effects of Intermetallics on the Reliability of Tin Coated Cu, Ag, and Ni Parts," 13th Annual Reliability Physics Symposium, Las Vegas, NV, Apr. 1-3, 1975, pp. 80-86.

Olsen, Kristian P., and Ivey, Douglas G., "Solderability of Additive-Free, Pulse-Electrodeposited Sn-Cu Films," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Olson, William, "Importance of Robust Test Methods for Achieving RoHS Compliance," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 650-654.

Olson, William L., and Hoffman III, William F., "Test Methods and Compliance with Product Substance Bans" 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 621-626.

Olsson, Jesper, "Apple had to recall products because of RoHS," evertiq, Aug. 18, 2006.

Olsson, Jesper, "CAF not necessarily a RoHS issue," evertiq, Dec. 21, 2005.

Olsson, Jesper, "Chinese and European RoHS - How do they differ?," evertiq, July 19, 2006.

Olsson, Jesper, "Denmark sues EU commission for approving deca-BDE," evertiq, Jan. 23, 2006.

Olsson. Jesper, "ELFNET publishes RoHS Enforcement Guidance Document," evertiq , June 2, 2006.

Olsson, Jesper, "Farnell In One publishes RoHS exemptions list," evertiq, Aug. 22, 2006.

Olsson, Jesper, "FR4 can't take the increased temperatures," evertiq, Nov. 23, 2005.

Olsson, Jesper, "Get used to your tin whiskers," evertiq, May 9, 2006.

Olsson, Jesper, "Increased lead times on components," evertiq, Mar. 21, 2006.

Olsson, Jesper, "Ireland's WEEE collection surpasses EU targets," evertiq, Apr. 10, 2006.

Olsson, Jesper, "Lack of confidence makes NPL to study XRF testing," evertiq, July 20, 2006.

Olsson, Jesper, "Majority in favor for Deca-BDE RoHS exemption," evertiq, Oct. 4, 2005.

Olsson, Jesper, "Manncorp said to have solution for Xbox woes," evertiq, Aug. 20, 2007.

Olsson, Jesper, "Mixed progress in RoHS compliance among European member states," evertiq, Oct. 13, 2005.

Olsson, Jesper, "New RoHS exemptions to be adopted," evertiq, Aug. 14, 2006.

Olsson, Jesper, "New tin whisker testing and reporting standard," evertiq, May 5, 2006.

Olsson, Jesper, "Risk assessment updated for TBBP-A," evertiq, Dec. 15, 2006.

Olsson, Jesper, "RoHS compliance cheaper than expected," evertiq, Sept. 5, 2005.

Olsson, Jesper, "RoHS will come into force this weekend in the UK," evertiq, June 30, 2006.

Olsson, Jesper, "TBBPA issue is not solved," evertiq, May 30, 2006.

Olsson, Jesper, "The Formation of Whiskers on Electroplated Tin Containing Copper"," evertiq, Dec. 7, 2005.

Olsson, Jesper, "Two new IPC standard versions," evertiq, Nov. 6, 2007.

Olsson, Jesper, "WEEE fully implemented in UK on July 1," evertiq, July 25, 2006.

Olsson, Kristian, Johansson, Daniel, Lil, Shiming, Ovesen, Karsten, and Liu, Johan, "Isotropically Conductive Adhesives for High Power Electronics Applications," 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Zalaegerszeg, Hungary, June 23-26, 2002, pp. 29-37.

Olsson, Par A. T., and Park, Harold S., "Atomistic study of the buckling of gold nanowires," Acta Materialia , vol. 59 no. 10, pp. 3883-3894, June 2011.

Olszewski, S., "Avogadro constant descending from the elastic data for solids," Zeitschrift fur Physik B Condensed Matter, vol. 97 no. 1, pp. 95-101, Mar. 1995. https://doi.org/10.1007/BF01317592

Olumide, Adeniyi A., Baishya, Kangkana, Zhang, Guang-Ming, Braden, Derek R., and Harvey, David M., "Non-destructive Evaluation and Life Monitoring of Solder Joints in Area Array Packaging," 2018 7th Electronic System-Integration Technology Conference , Dresden, Germany, Sept. 18-21, 2018, pp. xx-xx.

Olund, Kirk, "Are RoHS rules really necessary for the electronics industry?," Electronic Products, vol. 48 no. 11, pp. 89, Apr. 2006.

Olver, Kimberley A., "Evaporated Indium Bumps For Flip Chip Assembly," flipchips.com, Feb. 2004.

Omelchuck, Jeff, Katz, John, Salazar, Viccy, Elwood, Holly, and Rifer, Wayne, "The Implementation of EPEAT: Electronic Product Environmental Assessment Tool: The Implementation of an Environmental Rating System of Electronic Products for Governmental/Institutional Procurement," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 100-105.

Omiya, Masaki, Miyazaki, Takeshi, Inoue, Hirotsugu, Kishimoto, Kikuo, and Amagai, Masazumi, "Effect of Ni Plating Thickness on Fatigue Failure of Lead-free Solder Joints," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Omiya, Masaki, Miyazaki, Takeshi, Kishimoto, Kikuo, and Amagai, Masazumi, "Effect of Nickel Pad Metallization Thickness on Fatigue Failure of BGA Lead-Free Solder Joints," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 3, pp. 734-740, Sept. 2008.

Omiya, Masaki, Kishimoto, Kikuo, and Amagai, Masazumi, "Fatigue Crack Growth in Lead-free Solder Joints," 2005 International Symposium on Electronics Materials and Packaging, Tokyo, Japan, Dec. 11-14, 2005, pp. 232-237.

On, Shengquan, Xu, Yuhuan, Tu, K. N., Alam, M. O., and Chan, Y. C., "A Study of Impact Reliability of Lead-free BGA Balls on Au/Electrolytic Ni/Cu Bond Pad," Materials, Technology and Reliability of Advanced Interconnects - 2005 (Materials Research Society Symposium Proceedings Volume 863), San Francisco, CA, Mar. 28-Apr. 1, 2005, pp. 381-386. 2005

Onderdonk, I. M., "Short-Time Current Required to Melt Copper Conductors," Electrical World, vol. 121 no. 26, pp. 98, June 24, 1944.

O'Neil, Adam, and Watkins, James J., "Green chemistry in the microelectronics industry," Green Chemistry , vol. 6 no. 8, pp. 363-368, Sept. 13, 2004.

O'Neil, Todd, "Selective Soldering in Lead-free Assemblies," Surface Mount Technology (SMT) , vol. 20 no. 11, pp. 32, 34, Nov. 2006.

O'Neill, Brendan, "Scope of Application of RoHS Directive," RoHS Compliance & LEADOUT Seminar, Dublin, Ireland, Sept. 22, 2005.

O'Neill, Brian, and Suraski, David, "Solder Selection for Photonic Packaging," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

O'Neill, Brian, "Solder Selection for Photonic Packaging," 2002 Advanced Technology Symposium Conference Proceedings, 2002, pp. xx-xx.

O'Neill, Michael P., and Modes, Christina, "A Lead Free, Mixed Metals Low Temperature Cofire Ceramic Materials System," Proceedings 1997 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 3235), Philadelpia, PA, Oct. 14-16, 1997, pp. 512-516.

O'Neill, Michelle, "WEEE & RoHS and Trends in the Environmental Legislation in European Union," Proceedings of EcoDesign2003: Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 8-11, 2003, pp. 5-8.

O'Neill, Timothy, "Is SMT Ready for Low-Temperature Solders?," Printed Circuit Design and Fab/ Circuits Assembly, vol. 37 no. 8, pp. 43, Aug. 2020.

Ong, Bryan Y. Y., "Qualification and Optimization of Sn Based Soft Solders: A Refinement for Bi Based Lead Free Soft Solders for EFM Volume Production," IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, San Jose, CA, July 16-18, 2003, pp. 69-79.

Ong, Ming Sing, Lau, Yi Ming, and Tan, Ah Chin, "Pb-free Plating: a Process and Solder Joint Reliability Study," Proceedings of 6th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2004, pp. 162-168.

Ong, Siong Chiew, Choi, Won Kyoung, Premachandran, C. S., Liao, Ebin, and Xie, Ling, "Thin Die Stacking by Low Temperature In/ Au IMC based bonding method," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 464-468.

Ong, Xuefen, Ho, Soon Wee, Ong, Yue Ying, Wai, Leong Ching, Vaidyanathan, Kripesh, Lim, Yeow Kheng, Yeo, David, Chan, Kai Chong, Tan, Juan Boon, Sohn, Dong Kyun, Hsia, Liang Choo, and Chen, Zhong, "Underfill selection methodology for fine pitch Cu/low-k FCBGA packages," Microelectronics Reliability, vol. 49 no. 2, pp. 150-162, Feb. 2009.

Ong, Yue Ying, Vaidyanathan, Kripesh, Ho, Soon Wee, Sekhar, Vasarla Nahendra, Jong, Ming Ching, Wai, Leong Ching, Rao, Vempati Srinivasa, Sheng, Vincent Lee Wen, Ong, Jimmy, Ong, Xuefen, Zhang, Xiaowu, Seung, Yoon Uk, Lau, John, Lim, Yeow Kheng, Yeo, David, Chan, Kai Chong, Yanfeng, Zhang, Tan, Juan Boon, and Sohn, Dong Kyun, "Design, Assembly and Reliability of Large Die (21 x 21mm2) and Fine-pitch (150um) Cu/Low-K Flip Chip Package," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 613-619.

Ongkiehong, Frank, "UNDERFILLS in emerging load-free assemblies," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Mar. 2005.

Oni, A. A., Hook, D., Maria, J. P., and LeBeau, J. M., "Phase coexistence in Ti6Sn5 intermetallics," Intermetallics, vol. 51, pp. 48-52, Aug. 2014.

Onishi, Takashi, Iwamura, Eiji, and Takagi, Katsutoshi, "A study of hillock suppression in Al alloy interconnections for liquid crystal displays," AIP Conference Proceedings, vol. 418, pp. 383-394, 1998.

Onishi, Takashi, Iwamura, Eiji, Takagi, Katsutoshi, and Watanabe, Takashi, "Effects of Nd content in Al thin films on hillock formation," Journal of Vacuum Science & Technology A: Vacuum Surfaces, and Films, vol. 15 no. 4, pp. 2339-2348, July/Aug. 1997.

Onishi, Takashi, Iwamura, Eiji, Takagi, Katsutoshi, and Yoshikawa, Kazuo, "Influence of adding transition metal elements to an aluminum target on electrical resistivity and hillock resistance in sputter-deposited aluminum alloy thin films," Journal of Vacuum Science & Technology A: Vacuum Surfaces, and Films, vol. 14 no. 5, pp. 2728-2735, Sept./Oct. 1996.

Ono, M., Shiraishi, T., Bessho, Y., Eda, K., and Ishida, T., "Comparison of Stud Bump Bonding Technology and Other Flip-Chip Technologies," Proceedings 1998 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 3582), San Diego, CA, Nov. 1-4, 1998, pp. 639-644.

Ono, Masahiro, Tomura, Yoshihiro, Bessho, Yoshihiro, Shiraisbi, Tsukasa, Eda, Kazuo, and Ishida, Toru, "Bonding Resistance Of SBB Technique," 1st 1997 IEMT/IMC Symposium , Tokyo, Japan, Apr. 16-18, 1997, pp. 152-157.

Onodera, Kiyomitsu, Ishii, Takao, Aoyama, Shinji, Sugitani, Suehiro, and Tokumitsu, Masami, "Novel Flip-Chip Bonding Technology for W-Band Interconnections Using Alternate Lead-Free Solder Bumps," IEEE Microwave and Wireless Components Letters, vol. 12 no. 10, pp. 372-374, Oct. 2002.

Onuki, Hiroshi, and Shibutani, Tadahiro, "In-situ Observation of Whisker Nucleation in Air with AFM," 2012 2nd IEEE CPMT Symposium Japan, Kyoto, Japan, Dec. 10-12, 2012, pp. xx-xx.

Ooike, N., Motohisa, J., and Fukui, T., "MOVPE selectively grown GaAs nano-wires with self-aligned W side gate," Journal of Crystal Growth, vol. 272 no. 1-4, pp. 175-179, Dec. 10, 2004.

Oosterhout, Hans van, Hendrikx, Jos, Duis, Patrick, and Ocket, Tom, "Lead free manufacturing," Tyco Electronics Report Project Nr. B033353, Oct. 3, 2003.

Opdahl, Peter J., "Anisotropic Conductive Film for Flipchip Applications: An Introduction," flipchips.com, Feb. 2001.

Opdahl, Peter J., "Anisotropic Conductive Film for Flip Chip Applications: An Introduction," flipchips.com, Sept. 2009.

Opdahl, Peter J., "Reworking Anisotropic Conductive Film (ACF) Flip Chip Assemblies," flipchips.com, Oct. 2002.

Opdahl, Peter J., "Using Anisotropic Conductive Adhesives in Advanced Medical Applications," Medical Electronics Symposium 2011 Proceedings, Tempe, AZ, Sept. 27-28, 2011, pp. xx-xx.

Opila, R. L., and Sinclair, J. D., "Electrical Reliability of Silver Filled Epoxies for Die Attach," 23rd Annual Reliability Physics Symposium, Orlando, FL, Mar. 25-29, 1985, pp. 164-172.

Oppenheimer, Laura, "The cost of doing business," emsnow, Aug. 14, 2008.

Opper, Mathias, and Preikschat, Patricia, "EU-Richtlinien und Chrom(VI) in Passivierungen fur Zink and Zinklegierungen," Sur Tec GmbH, Apr. 13, 2004.

Opperman, U., Egelkraut-Holtus, M., Geissler, M., and Hesper, J., "The Determination of Heavy Metals according to the Guidelines for the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS)," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Opperman, Uwe, and Hesper, Johannes, "Determination of hazardous substances according to RoHS and WEEE," European Electronics Engineer, vol. xx no. xx, pp. xx-xx, Jan. 12, 2006.

Oppert, Thomas, Teutsch, Thorsten, Azdasht, Ghassem, Zakel, Elke, and McKee, Richard, "Micro Ball Bumping Packaging For Wafer Level & 3-D Solder Sphere Transfer And Solder Jetting," International Wafer-Level Packaging Conference 2013 Proceedings, San Jose, CA, Nov. 5-7, 2013, pp. xx-xx.

Oppert, Thomas, Teutsch, Thorsten, Zakel, Elke, and Azdashi, Ghassem, "Single and Multiple Laser Solder Ball Placement and Reflow for Wafer Level CSP," Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 21-27.

Ord, Simon, "Battery power: Driving the revolution in wireless devices," Engineering Technology, vol. 9 no. 1, pp. 41-42, Feb. 2006.

O'Regan, Colm, Biswas, Subhajit, O'Kelly, Curtis, Jung, Soon Jung, Boland, John J., Petkov, Nikolay, and Holmes, Justin D., "Engineering the Growth of Germanium Nanowires by Tuning the Supersaturation of Au/Ge Binary Alloy Catalysts," Chemistry of Materials, vol. 25 no. 15, pp. 3096-3104. Aug. 13, 2013.

Oresjo, Stig, "Overcoming Lower Wetting Forces of Pb-Free Alloys," Circuits Assembly, vol. 16 no. 3, pp. 40, Mar. 2005.

Oresjo, Stig, and Jacobsen, Chris, "Pb-Free PCB Finishes for ICT," Circuits Assembly, vol. 16 no. 9, pp. 54, Sept. 2005.

Oresjo, Stig, "Pb-Free's Impacts on Test and Inspection," Circuits Assembly , vol. 16 no. 1, pp. 50, Jan. 2005.

Oresjo, Stig, "Pb-Free's impacts on test and inspection," emsnow, Aug. 31, 2005.

Oresjo, Stig, Niermeyer, Thorsten, and Johnson, Stacy, "Putting Pb-Free to the Test," Circuits Assembly, vol. 16 no. 5, pp. 42, May 2005.

Oresjo, Stig, and Ling, Robert, "The importance of test and inspection when implementing lead-free manufacturing," Lead-Free Magazine, vol. 3, Feb. 2005.

Oresjo, Stig, "Test and Inspection as part of the lead-free manufacturing process," IPC Circuits Expo, Apex and Designer Summit 2005, Anaheim, CA, Feb. 22-24, 2005, pp. xx-xx.

Oresjo, Stig, "Test and inspection in lead-free manufacturing," EMasia, Jan. 2006.

Orgen, Salvacion B., and Balela, Mary Donnabelle L., "Characterization of the Mechanical Integrity of Cu Nanowire-Based Transparent Conducting Electrode," Key Engineering Materials, vol. 775, pp. 132-138, Aug. 2018.

Orii, Yasumitsu, Toriyama, Kazushige, Kohara, Sayuri, Noma, Hirokazu, Okamoto, Keishi, and Uenishi, Keisuke, "Effect of preformed Cu-Sn IMC layer on Electromigration Reliability of Solder Capped Cu Pillar Bump Interconnection on an organic substrate," 2012 2nd IEEE CPMT Symposium Japan, Kyoto, Japan, Dec. 10-12, 2012, pp. xx-xx.

Orii, Yasumitsu, Toriyama, Kazushige, Kohara, Sayuri, Noma, Hirokazu, Okamoto, Keishi, Toyoshima, Daisuke, and Uenishi, Keisuke, "Effect of preformed IMC layer on Electromigration of Peripheral Ultra Fine Pitch C2 Flip Chip Interconnection with Solder Capped Cu Pillar Bump," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 206-209.

Orii, Yasumitsu, Toriyama, Kazushige, Kohara, Sayuri, Noma, Hirokazu, Okamoto, Keishi, Toyoshima, Daisuke, and Uenishi, Keisuke, "Electromigration Analysis of Peripheral Ultra Fine Pitch C2 Flip Chip Interconnection with Solder Capped Cu Pillar Bump," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 340-345.

Ormerod, David H., "Immersion Tin as a High Performance Solderable Finish for Fine Pitch PWBs," 2000 Pan Pacific Symposium Conference Proceedings, Jan. 2000, pp. xx-xx.

Ormerod, David H., "Immersion Tin as a High Performance Solderable Finish for Fine Pitch PWBs," 2000 Surface Finishes Forum Conference Proceedings, May 4, 2000, pp. xx-xx.

Ormerod, David H., "Immersion Tin as a High Performance Solderable Finish for Fine Pitch PWBs," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Ormerod, David H., "Immersion tin as a high performance solderable finish for fine pitch PWBs." Circuit World, vol. 26 no. 3, pp. 11-16, 2000.

Ormerod, David, "Meeting Fine Pitch Assembly Needs with a Solderable Tin Finish," IPC Printed Circuits Expo 1999, Long Beach, CA, Mar. 14-18, 1999, pp. S13-2-1-S13-2-8.

Ormerod, David H., "Production Application of Flat Solderable Tin Finishes - Some Practical Considerations," Proceedings of the Technical Program NEPCON West 2000, Volume 2, Anaheim, CA, Feb. 27-Mar. 2, 2000, pp. 860-870.

Ormerod, David H., "Production Application of Flat Solderable Tin Finishes: Some Practical Considerations," 2000 SMTA International Conference Proceedings , Chicago, IL, Sept. 24-28, 2000, pp. xx-xx.

Ormerod, David H., "The Development and Use of a Modified Immersion Tin as a High Performance Solderable Finish," Proceedings of the Technical Program NEPCON West '98, Volume 3, Anaheim, CA, Mar. 1-5, 1998, pp. 1515-1526.

Orru, Marta, Piazza, Vincenzo, Rubini, Silvia, and Roddaro, Stefano, "Rectification and Photoconduction Mapping of Axial Metal-Semiconductor Interfaces Embedded in GaAs Nanowires," Physical Review Applied, vol. 4 no. 4, pp. 044010-1-044010-7, Oct. 2015.

Ortiz, Gregorio F., Lopez, Maria C., Alcantara, Ricardo, and Tirado, Jose L., "Electrodeposition of copper-tin nanowires on Ti foils for rechargeable lithium micro-batteries with high energy density," Journal of Alloys and Compounds, vol. 585, pp. 331-336, Feb. 5, 2014.

Osenbach, J. W., Shook, R. L., Vaccaro, B. T., Potteiger, B. D., Amin, A., and Ruengsinsub, P., "Lead Free Packaging and Sn-Whiskers," 2004 Proceedings 54th Electronic Components & Technology Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1314-1324.

Osenbach, J. W., DeLucca, J. M., Potteiger, B. D., Amin, A., Shook, R. L., and Baiocchi, F. A., "Sn Corrosion and Its Influence on Whisker Growth," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 1, pp. 23-35, Jan. 2007.

Osenbach, J. W., DeLucca, J. M., Potteiger, B. D., Amin, A., and Baiocchi, F. A., "Sn-whiskers: truths and myths," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 283-305, Mar. 2007.

Osenbach, J. W., Shook, R. L., Vaccaro, B. T., Amin, A., Potteiger, B. D., and Hooghan, K. N., "The Effects of Board Attachment Processing on Sn Whisker Formation on Electroplated Matte-Sn on Cu Alloy Lead Frames," Proceedings of IPC/JEDEC Lead Free Conference, San Jose, CA, Mar. 18, 2004, pp. xx-xx.

Osenbach, J., Bachman, M., Crouthamel, D., Amin, A., Weachock, R., Delucca, J., and Baiocchi, F., "Thermal Degradation of Sputtered Al/Ni(V)/Cu-UBM in Pb-Free Flip Chip Solder Joints Connected to Substrate with Different Surface Finishes," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 123-130.

Osenbach, J. W., Shook, R. L., Vaccaro, B. T., Amin, A., Potteiger, B. D., and Hooghan, K. N., "Tin Whisker Mitigation: Application of Post Mold Nickel Underplate on Copper Based Lead Frames and Effects of Board Assembly Reflow," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 724-734.

Osenbach, J. W., "Tin Whiskers: An Illustrated Guide to Growth Mechanisms and Morphologies," JOM, vol. 63 no. 10, pp. 57-60, Oct. 2011.

Osenbach, John, "Creep and It's Affect on Sn Whisker Growth," Tin Whisker Group teleconferences, Feb. 9, 2011 and Feb. 16, 2011.

Osenbach, John W., "Creep and its effect on Sn whisker growth," Journal of Applied Physics , vol. 106 no. 9, pp. 094903-1-094903-10, Nov. 1, 2009.

Osenbach, John, Emerich, Sue, Cate, S., Brady, D., Hwang, Seung Min, Dang, J., and Crouthamel, D., "Development Fine Pitch Area Array Cu Pillar/Lead Free Solder Bumps for Large 28nm Die in Large Organic Flip Chip Packages," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 74-80.

Osenbach, John, Amin, Ahmed, Baiocchi, Frank, and DeLucca, John, "ENIG Corrosion Induced by Second-Phase Precipitation," Journal of Electronic Materials, vol. 38 no. 12, pp. 2592-2599, Dec. 2009.

Osenbach, John, Williams, Maureen, Handwerker, Carol, and Galyon, George, "Sn Whiskers," Tin Whisker Group teleconference, Jan. 27, 2010.

Osenbach, John W., Shook, Richard L., Vaccaro, Brian T., Potteiger, Brian D., Amin, Ahmed N., Hooghan, K. N., Suratkar, P., and Ruengsinsub, P., "Sn Whiskers: Material, Design, Processing, and Post-Plate Reflow Effects and Development of an Overall Phenomenological Theory," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 36-62, Jan. 2005.

Osenbach, John, "Sn-Whiskers: Truths and Myths," 2006 Lead-Free Technology Workshop , San Antonio, TX, Mar. 12, 2006, pp. xx-xx.

Osenbach, John W., Reynolds, Heidi L., Henshall, Gregory, Parker, Richard Dixon, and Su, Peng, "Tin Whisker Test Development- Temperature and Humidity Effects Part II: Acceleration Model Development," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 1, pp. 16-24, Jan. 2010.

Osgood, Howard "Rusty", Geiger, David, Pennings, Robert, Biederman, Christian, Jie Jiang, and Bernal, Jon, "Low-temperature SMT Solder Evaluation," Surface Mount Technology (SMT) , vol. 34 no. 7, pp. 60,62-64,66-72,74, July 2019.

O'Shea, Paul, "An E-Waste Call to Arms," eeProductCenter, Feb. 19, 2004.

Osibanjo, O., and Nnorom, I. C., "The challenge of electronic waste (e-waste) management in developing countries," Waste Management and Research, vol. 25 no. 6, pp. 489-501, Dec. 2007.

Osorio, Wislei R., Freitas, Emmanuelle S., Spinelli, Jose E., and Garcia, Amauri, "Electrochemical behavior of a lead-free Sn-Cu solder alloy in NaCl solution," Corrosion Science, vol. 80, pp. 71-81, Mar. 2014.

Osorio, Wislei R., Garcia, Leonardo R., Peixoto, Leandro C., and Garcia, Amauri, "Electrochemical behavior of a lead-free SnAg solder alloy affected by the microstructure array," Materials and Design, vol. 32 no. x, pp. 4763-4772, 2011.

Osorio, Wislei R., and Garcia, Amauri, "Interrelation of wettability-microstructure-tensile strength of lead-free Sn-Ag and Sn-Bi solder alloys," Science & Technology of Welding and Joining, vol. 21 no. 6, pp. 429-437, Aug. 2016.

Osorio, Wislei R., Leiva, Daniel R., Peixoto, Leandro C., Garcia, Leonardo R., and Garcia, Amauri, "Mechanical properties of Sn-Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology," Journal of Alloys and Compounds, vol. 562, pp. 194-204, June 15, 2013.

Osorio, Wislei R., Peixoto, Leandro C., Garcia, Leonardo R., Mangelinck-Noel, Nathalie, and Garcia, Amauri, "Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn-Zn lead-free solder alloys," Journal of Alloys and Compounds, vol. 572, pp. 97-106, Sept. 25, 2013.

Osorio, Wislei R., Spinelli, Jose E., Afonso, Conrado R. M., Peixoto, Leandro C., and Garcia, Amauri, "Microstructure, corrosion behaviour and microhardness of a directionally solidified Sn-Cu solder alloy," Electrochimica Acta, vol. xx no. xx, pp. xx-xx, xxxx.

Osorio, Wislei R., Freire, Celia M., Caram, Rubens, and Garcia, Amauri, "The role of Cu-based intermetallics on the pitting corrosion behavior of Sn-Cu, Ti-Cu and Al-Cu alloys," Electrochimica Acta, vol. 77, pp. 189-197, Aug. 30, 2012.

Ossai, Chinedu I., Xu, Xuechu, Yang, Qing, and Raghavan, Nagarajan, "Uncertainty quantification in nanowire growth modeling - A precursor to quality semiconductor nanomanufacturing," Microelectronics Reliability , vol. 76-77, pp. 106-111, Sept. 2017.

Osterman, M., "Mitigation Strategies for Tin Whiskers," Aug. 28, 2002.

Osterman, Michael, Dasgupta, Abhijit, and Han, Bongtae, "A Strain Range Based Model for Life Assessment of Pb-free SAC Solder Interconnects," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 884-890.

Osterman, Michael, "Assessment of Tin Whisker Mitigation for Conformally Coated SnPb Assemblies," Tin Whisker Group teleconference, Jan. 11, 2012.

Osterman, Michael, "CALCE Research on Risk Assessment, Mitigation, and Management for Pb-free Electronics," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.

Osterman, Michael, "CALCE Whisker Research," Tin Whisker Group teleconference, July 11, 2012.

Osterman, Michael, "Effectiveness of Conformal Coat to Prevent Corrosion of Nickel-palladium-gold-finished Terminals," IPC APEX Expo 2014, Las Vegas, NV, Mar. 25-27, 2014, pp. xx-xx.

Osterman, Michael, "Introduction to the Special Issue on Tin Whiskers," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 3, pp. 157-158, July 2010.

Osterman, Michael, and Dasgupta, Abhijit, "Life expectancies of Pb-free SAC solder interconnects in electronic hardware," Journal of Materials Science: Materials in Electronics , vol. 18 no. 1-3, pp. 229-236, Mar. 2007.

Osterman, Michael, and Pecht, Michael, "Strain range fatigue life assessment of lead-free solder interconnects subject to temperature cycle loading," Soldering & Surface Mount Technology, vol. 19 no. 2, pp. 12-17, 2007.

Osterman, Michael, and Touw, Anduin, "The Effect of Medium Temperature on Pb-free Solder Fatigue Life of CLCC under Temperature Cycle Loading," IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies, Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.

Osterman, Michael, "Tin Whisker Mitigation," The Latest Findings on Tin Whiskers in Electronics Webinar, Oct. 29, 2015, pp. xx-xx.

Osterman, Michael, "Tin Whiskers Remain a Concern," Surface Mount Technology (SMT), vol. 30 no. 2, pp. 50,52-54, Feb. 2015.

Ostrander, Charles W., "Chromate Treatments," Plating, vol. 38 no. 10, pp. 1033-1035, Oct. 1951.

Ostrovskii, I. P., Gij, Ya. S., Tsmots', V. M., and Pavlovskii, Yu. P., "A Study of the Morphology and Magnetic Properties of Silicon Whiskers," Crystallography Reports, vol. 49 no. 2, pp. 202-205, Mar. 2004. DOI: 10.1134/1.1690416

Ostrowicki, Gregory T., Williamson, Jaimal, Gupta, Vikas, and Gurrum, Siva P., "Thermal Cycling Reliability of Lead Free Solder Joints on Multi-Terminal Passive Components," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 127-134.

Ostwald, W., "Studien uber die Bildung und Umwaldlung fester Korper. 1. Abhandlung: Ubersattigung und Uberkaltung," Zeitschrift fur Physikalische Chemie , vol. 22 no. 3, pp. 289-330, 1897.

O'Suilleabhain, Sean, "Legislation Relating to WEEE and RoHS," SMART Ireland Lead-Free Materials + Legislation Seminar, Dublin, Ireland, Sept. 23, 2004.

Otahal, Alexandr, Somer, Jakub, and Szendiuch, Ivan, "Influence of Heating Direction on BGA Solder Balls Structure," 2017 21st European Microelectronics and Packaging Conference & Exhibition , Warsaw, Poland, Sept. 10-13, 2017, pp. xx-xx.

Otahal, Alexandr, and Szendiuch, Ivan, "Study of Atmosphere Influence on BGA Solder Balls Process," 2013 36th International Spring Seminar on Electronics Technology, Alba Iulia, Romania, May 8-12, 2013, pp. 146-151.

Othman, R., Binh, D. N., Ismail, A. B., Long, B. D., and Ariga, T., "Effects of current density on the formation and microstructure of Sn-9Zn, Sn-8Zn-3Bi and Sn-3Ag-0.5Cu solder joints," Intermetallics, vol. 22, pp. 1-6, Mar. 2012.

O'Toole, Kerin, Esser, Bob, Binfield, Seth, Hillman, Craig, and Beers, Joe, "Pb-Free Reflow, PCB Degradation, and the Influence of Moisture Absorption," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Otsubo, Fumitaka, Era, Hidenori, Tsuru, Yutaka, and Hirano, Shigeru, "TEM analysis of whiskers formation over tin-plated films," Materials Chemistry and Physics, vol. 251, pp. 122985-1-122985-6, Sept. 1, 2020.

Otsuka, Kanji, and Akiyama, Yutaka, "The GHz region characteristic of the BGA-printed wired board interconnection by conductive adhesives," 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Odaiba, Japan, Jan. 16-18, 2007, pp. 277-279.

Ottewell, Sean, "REACH Expands Its Range," Chemical Processing, pp. xx-xx, Oct. 2009.

Ou, Shengquan, and Tu, K. N., "A Study of Electromigration in Sn3.5Ag and Sn3.8Ag0.7Cu Solder Lines," 2005 Proceedings 55th Electronic Components & Technology Conference , Orlando, FL, May 31-June 3, 2005, pp. 1445-1450.

Ou, Shengquan, Xu, Yuhuan, and Tu, K. N., "A Study of Impact Reliability of Lead-free BGA Balls on Au/Electrolytic Ni/Cu Bond Pad," Materials Research Society Symposia Proceedings Volume 863, 1994, pp. B10.5.1-B10.5.6.

Ou, Shengquan, Xu, Yuhuan, Tu, K. N., Alam, M. O., and Chen, Y. C., "Micro-Impact Test on Lead-Free BGA Balls on Au/Electrolytic Ni/Cu Bond Pad," 2005 Proceedings 55th Electronic Components & Technology Conference , Orlando, FL, May 31-June 3, 2005, pp. 467-471.

Ou, Shengquan, Xu, Gu, Xu, Yuhuan, and Tu, K. N., "The Application of Lead-Free Solder to Optical Fiber Packaging," Journal of Electronic Materials, vol. 33 no. 12, pp. 1440-1444, Dec. 2004.

Ou, Shengquan, Gan, H., and Tu, K. N., "The Polarity Effect of Electromigration in Cu/Sn3.8Ag0.7Cu/Cu and Ni/Sn3.5Ag/Ni V-Groove Lines," TMS Letters, vol. 1 no. 8, pp. 167-168. 2004.

Oudat, Osama A., Borra, Vamsi, Georgiev, Daniel G., and Karpov, Victor G., "Corrigendum: The statistics of tin whisker diameters versus the underlying film grains," Journal of Physics D: Applied Physics, vol. 52 no. 24, pp. 249501-1, June 12, 2019.

Oudat, Osama, Arora, Vidheesha, Parsai, E. Ishmael, Karpov, Victor G., and Shvydka, Diana, "Gamma- and x-ray accelerated tin whisker development," Journal of Physics D: Applied Physics, vol. 53 no. 49, pp. 495305-1-495305-9, Dec. 2020. https://doi.org/10.1088/1361-6463/abb38d

Oudat, Osama A., Borra, Vamsi, Georgiev, Daniel G., and Karpov, Victor G., "The statistics of tin whisker diameters versus the underlying film grains," Journal of Physics D: Applied Physics, vol. 52 no. 16, pp. 165305-1-165305-8, Apr. 17, 2019.

Oulfajrite, H., Sabbar, A., Boulghallat, M., Jouaiti, A., Lbibb, R., and Zrineh, A., "Electrochemical behavior of a new solder material (Sn-In-Ag)," Materials Letters, vol. 57 no. 28, pp. 4368-4371, Oct. 2003.

Ourdjini, A., Aisha, I. Siti Rabiatull, and Chin, Y. T., "Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper," 2012 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Nov. 6-8, 2012, pp. xx-xx.

Ourdjini, A., Hanim, M. A. Azmah, Koh, S. F. Joyce, Aisha, I. Siti, Tan, K. S., and Chin, Y. T., "Effect of Solder Volume on Interfacial Reactions between Eutectic Sn-Pb and Sn-Ag-Cu Solders and Ni(P)-Au Surface Finish," 31st International Conference on Electronics Manufacturing and Technology, Kuala Lumpur, Malasia, Nov. 8-10, 2007, pp. 437-442.

Ourdjini, A., Hanim, M. A. Azmah, Aisha1, I. Siti Rabiatull, and Chin, Y. T., "Effect of Surface Finish Metallurgy on Intermetallic Compounds during Soldering with Tin-Silver-Copper Solders," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Ouyang, Fan-Yi, and Jhu, Wei-Cheng, "Comparison of thermomigration behaviors between Pb-free flip chip solder joints and microbumps in three dimensional integrated circuits: Bump height effect," Journal of Applied Physics, vol. 113 no. 4, pp. 043711-1-043711-8, Jan. 28, 2013.

Ouyang, Fan-Yi, Chen, Kai, Tu, K. N., and Lai, Yi-Shao, "Effect of current crowding on whisker growth at the anode in flip chip solder joints," Applied Physics Letters, vol. 91, pp. 231919-1-231919-3, 2007.

Ouyang, Fan-Yi, Hsu, Wei-Neng, and Yang, Yi-Shan, "Effect of Sn orientation on Cu diffusion for Pb-free solders under a temperature gradient," 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference, Kyoto, Japan, Apr. 14-17, 2015, pp. 486-490.

Ouyang, Fan-Yi, Hsu, Hao, Su, Yu-Ping, and Chang, Tao-Chih, "Electromigration induced failure on lead-free micro bumps in three-dimensional integrated circuits packaging," Journal of Applied Physics, vol. 112 no. 2, pp. 023505-1-023505-5, July 15, 2012.

Ouyang, Fan-Yi, and Su, Yu-Ping, "Growth kinetic of Ag3Sn intermetallic compound in micro-scale Pb-free solder alloys under a temperature gradient," Journal of Alloys and Compounds , vol. 655, pp. 155-164, Jan. 15, 2015.

Overbeek, Ruud, and Pekay, Joel, "An Update on RoHS Regulations," Conformity, 2008 Engineers' Reference Guide, pp. 225-, 2008.

Overbeek, Ruud A., "REACH and the Supply Chain (presentation)," 2008 IEEE Symposium on Product Compliance Engineering, Austin, TX, Oct. 20-22, 2008, pp. xx-xx.

Overbeek, Ruud, and Pekay, Joel, "RoHS One Year and Counting," Conformity, vol. 12 no. 7, pp. 22-25, July 2007.

Overcash, D. R., Stillwell, E. P., Skove, M. J., and Davis, J. H., "Deformation Twinning in Zn, Sn, and Bi Single Crystal Whiskers", Philosophical Magazine, vol. 25 no. 6, pp. 1481-1488, 1972. https://doi.org/10.1080/14786437208223867

Overcash, D. R., Watlington, C. L., Skove, M. J., and Stillwell, E. P., "Temperature Dependence of the Critical Current in Tin and Indium Whiskers," Physica, vol. 55, no. xx, pp. 317-323, Oct. 1971. https://doi.org/10.1016/0031-8914(71)90269-2

Overstam, Henrick, and Jari, Magnus, "Development and validation of FEM models for wiredrawing," Wire Journal International, vol. 37 no. 5, pp. 73-76, May 2004.

Ovid'ko, I. A., "Nanoscale amorphization as a special deformation mode in nanowires," Scripta Materialia, vol. 66 no. 6, pp. 402-405, Mar. 2012.

Oya, Gin-ichiro, and Onodera, Yutaka, "Growth of Ga Whiskers from GaN/Ga Double Layered Films," Journal of Crystal Growth, vol. 49 no. 4, pp. 643-650, Aug. 1980.

Oyamada, Kimiko, and Yamamoto, Wataru, "Measurements of Internal Stresses in Electrodeposits," Journal of the Surface Finishing Society of Japan, vol. 58 no. 4, pp. 213-218, 2007.

Oyebode, Ayoade, Andersson, Cristina, Tobias, Hjertkvist, and Liu, Johan, "Assessment of Lead-Free Inert Gas Soldering Using a Novel Reflow Technology," 1st Electronics Systemintegration Technology Conference, Volume 1 , Dresden, Germany, Sept. 5-7, 2006, pp. 428-437.

Ozaki, Mitsuo, and Yamagishi, Yasuo, "Efficient and Unique System for Verifying Containment of Hazardous Substances," Fujitsu Scientific and Technical Journal, vol. 41, pp. 209-216, July 2005.

Ozaki, Shunji, and Matsumoto, Kazuya, "Growth of ZnSe Nanowires and their Photoluminescence Spectra," Key Engineering Materials, vol. 790, pp. 55-59, Nov. 2018.

Ozaltun, Sevim, and Karadeniz, Serdar, "Development of an apparatus for determining the free tin thickness on tin-plated copper wire," Wire Journal International, vol. 43 no. 11, pp. 63-67, Nov. 2010.

Ozawa, Susumu, Kitayama, Yuko, Takahashi, Wataru, Tohyama, Hiroshi, and Yamashita, Tomitsu, "Fine Pitch Bonding Technology for Chip-to-Chip Adopted Anisotropic Conductive Film," 1st 1997 IEMT/IMC Symposium, Tokyo, Japan, Apr. 16-18, 1997, pp. 51-55.

Ozden, Ayberk, Kandemir, Ali, Ay, Feridun, Perkgoz, Nihan Kosku, and Sevik, Cem, "Thermal Conductivity Suppression in Nanostructured Silicon and Germanium Nanowires," Journal of Electronic Materials, vol. 45 no. 3, pp. 1594-1600, Mar. 2016.

Ozkok, Mustafa, McGurran, Joe, Roberts, Hugh, Lee, Kenneth, and Heinz, Guenter, "Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments," IPC APEX Expo 2012, San Diego, CA, Feb. 28-Mar. 1, 2012, pp. xx-xx.

Ozkok, Mustafa, "Direct EP and Direct EPAG - Novel Surface Finishes for gold-, copper wire bonding and soldering applications," 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 24-26, 2012, pp. 178-182.

Ozkok, Mustafa, McGurran, Joe, and Lee, Kenneth, "Is a High Phosphorus Content in the Nickel Layer a Root Cause for "Black Pad" on ENIG Finishes?," SMTA International 2013 Conference Proceedings , Fort Worth, TX, Oct. 13-17, 2013, pp. 1046-1051.

Ozkok, Mustafa, McGurran, Joe, and Lee, Kenneth, "Is a High Phosphorus Content in the Nickel Layer a Root Cause for "Black Pad" on ENIG Finishes?," SMTAnews & Journal of Surface Mount Technology , vol. 26 no. 4, pp. 35-41, Oct.-Dec. 2013.

Ozkok, Mustafa, Gensicke, Mario, Heinz, Guenter, Roberts, Hugh, and McGurran, Joe, "Resistance of Common PWB Surface Finishes Against Corrosion in Harsh Environments," 2010 AIMS/ Harsh Environments Symposium, Orlando, FL, Oct. 25, 2010, pp. 362-370.

Ozturk, B., Youssef, A., Gromala, P., Silber, C., Jansen, K. M. B., and Ernst, L. J., "A Product Based Lap Shear Fatigue Testing of Electrically Conductive Adhesives," 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Ghent, Belgium, Apr. 7-9, 2014, pp. xx-xx.

Ozturk, Esra, Aksoz, Sezen, Keslioglu, Kazim, and Marashi, Necmettin, "The measurement of interfacial energies for solid Sn solution in equilibrium with the Sn-Bi-Ag liquid," Materials Chemistry and Physics, vol. 139 no. 1, pp. 153-160, Apr. 15, 2013.

Ozturk, Esra, Aksoz, Sezen, Keslioglu, Kazim, and Marasli, Necmettin, "The measurement of thermal conductivity variation with temperature for Sn-20 wt.% In based lead-free ternary solders," Thermochimica Acta, vol. 554, pp. 63-70, Feb. 20, 2013.

Ozyurek, D., Yavuzer, B., and Tuncay, T., "The effects of Cu and Al on dry sliding wear properties of eutectic Sn-9Zn lead-free solder alloy," Journal of Adhesion Science & Technology , vol. 30 no. 15, pp. 1662-1670, Aug. 2016.

PPPP

P, Ajay Kumar, and Dutta, I., "Effect of Intermetallic Content on Shear Deformation of Thin Sn-3.0Ag-0.5Cu Solder Micro-joints Between Copper Substrates," Journal of Electronic Materials, vol. 47 no. 9, pp. 5488-5497, Sept. 2018.

Paatsch, W., and Kautek, W., "Zinc-Alloy-Plating for Corrosion Protection," Proceedings of The International Technical Conference of SUR/FIN, Baltimore, MD, June 26-29, 1995, pp. 205-210.

Padilla, E., Jakkali, V., Jiang, L., and Chawla, N., "Quantifying the effect of porosity on the evolution of deformation and damage in Sn-based solder joints by X-ray microtomography and microstructure-based finite element modeling," Acta Materialia, vol. 60 no. 9, pp. 4017-4026, May 2012.

Padilla, Rafael, Akita, Satoru, Daily, Derek, Yamaki, Tokuro, Mori, Hideki, Yoshikawa, Tomoyasu, Shimamura, Massato, Takagi, Kazuyori, and Inaba, Ko, "Eliminating BTC Voiding on the Fly: In-Production Optimization Techniques," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 819-823.

Paek, Jihyun, Yamaguchi, Masahito, and Amano, Hiroshi, "MBE-VLS growth of catalyst-free III-V axial heterostructure nanowires on (1 1 1)Si substrates," Journal of Crystal Growth, vol. 323 no. 1, pp. 315-318, May 15, 2011.

Paetzelt, H., Gottschalch, V., Bauer, J., Benndorf, G., and Wagner, G., "Selective-area growth of GaAs and InAs nanowires-- homo- and heteroepitaxy using SiNx templates," Journal of Crystal Growth, vol. 310 no. 23, pp. 5093-5097, Nov. 15, 2008.

Pai, Rekha S., and Walsh, Kevin M., "The viability of anisotropic conductive film as a flip chip interconnect technology for MEMS devices," Journal of Micromechanics and Microengineering, Vol. 15 No. 6, pp. 1131-1139, June 1, 2005.

Paiano, P., Prete, P., Speiser, E., Lovergine, N., Richter, W., Tapfer, L., and Mancini, A. M., "GaAs nanowires grown by Au-catalyst-assisted MOVPE using tertiarybutylarsine as group-V precursor," Journal of Crystal Growth, vol. 298, pp. 620-624, Jan. 2007.

Paik, Kyung-Wook, Jeon, Young-Doo, Yang, Se-Young, Kwon, Yong-Min, Lee, Soon-Bok, Lee, Jin-Woo, and Kim, Jung-Do, "A Study on Reliability of Flip-Chip Solder Joints Using Pb-Free Solders and Electroless Ni-P UBMS," 2005 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Paik, Kyung-Wook, and Yoon, Dal-Jin, "A Study on the Novel Anchoring Polymer Layer (APL) Anisotropic Conductive Films (ACFs) for Ultra Fine Pitch Assembly Applications," Pan Pacific Symposium 2018 Proceedings, Kamuela, HI, Feb. 5-8, 2018, pp. xx-xx.

Paik, Kyung-Wook, and Kwon, Woon-Seong, "Conduction Mechanism of Anisotropic Conductive Adhesives (ACAs): Conductor Ball Deformation and Build-up of Contraction Stresses," IEEE/CPMT International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, CA, Mar. 16-18, 2005, pp. 214-220.

Paik, Kyung-Wook, and Kwon, Woon-Seong, "Effect of Compressive Stresses in Anisotropic Conductive Films (ACFs) on Contact Resistance of Flip Chip Joint," 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, Portland, OR, Sept. 12-15, 2004, pp. 141-147.

Paik, Kyung W., "Fabric-Based Fine Pitch Interconnect Technology Using Anisotropic Conductive Films (ACFs)," Pan Pacific Symposium 2017 Proceedings, Koloa, HI, Feb. 6-9, 2017, pp. xx-xx.

Paik, Kyung W., Kim, Ji-Hye, and Kim, Young R., "Flexibility of Anisotropic Conductive Films (ACFS) Bonded CiF(Chip In Flex) Package for Wearable Electronics Applications," Pan Pacific Symposium 2016 Proceedings, Waimea, HI, Jan. 25-28, 2016, pp. xx-xx.

Paik, Kyung-Wook, Yim, Myung-Jin, and Jeon, Young-Doo, "Flip Chip Assembly on Organic Boards Using Anisotropic Conductive Adhesives (ACAs) and Nickel/Gold Bumps," Proceedings of 3rd Electronics Packaging Technology Conference, Singapore, Dec. 5-7, 2000, pp. 378-384.

Paik, Kyung-Wook, Kim, Seung-Ho, and Lee, Kiwon, "High Speed Touch Screen Assembly Using Anisotropic Conductive Adhesives (ACAS) Vertical Ultrasonic Bonding Method," 2010 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, Koloa, HI, Jan. 26-28, 2010, pp. xx-xx.

Paik, Kyung-Wook, Jeon, Young-Doo, and Cho, Moon-Gi, "Interfacial Reactions and Bump Reliability of Various Pb-Free Solder Bumps on Electroless Ni-P UBMs," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 675-682.

Paik, Kyung-Wook, Kim, Tae-Wan, Lee, Sang-Hoon, and Suk, Kyoung-Lim, "Novel Nanofiber Anisotropic Conductive Films (ACFS) for Fine Pitch Assembly," 2014 Pan Pacific Microelectronics Symposium, Kohala Coast, HI, Feb. 11-13, 2014, pp. xx-xx.

Paik, Kyung-Wook, Kim, Il, Son, Ho-Young, and Chung, Chang-Kyu, "Novel Wafer Level Packages Using Anisotropic Conductive Adhesives (ACPs) and NCPs for Flip-Chip Assembly on Organic Substrates," 2008 Pan Pacific Microelectronics Symposium & Exhibit, Kauai, HI, Jan. 22-24, 2008, pp. xx-xx.

Paik, Kyung W., "Recent Advances in Anisotropic Conductive Adhesives (ACAs) Technology: Materials and Processing," 2012 14th International Conference on Electronic Materials and Packaging, Hong Kong, Dec. 13-16, 2012, pp. xx-xx.

Paik, Kyung-Wook, "Recent Advances in Anisotropic Conductive Adhesives (ACAs) Materials and Processing Technology," 2010 IEEE CPMT Symposium Japan, Tokyo, Japan, Aug. 24-26, 2010, pp. xx-xx.

Paik, Kyung W., "Recent Advances in Anisotropic Conductive Films (ACFs) Technology for Green Electronic Assembly ," Electronics Goes Green 2012+, Berlin, Germany, Sept. 9-12, 2012, pp. xx-xx.

Paik, Kyung W., "Recent Progress in Anisotropic Conductive Adhesives (ACAs) Technology," 2012 Pan Pacific Microelectronics Symposium, Kauai, HI, Feb. 14-16, 2012, pp. xx-xx.

Paik, Kyung-Wook, Yim, Myung Jin, and Kwon, Woonsung, "Significant Reliablity Enhancement Using New Anisotropic Conductive Adhesives for Flip Chip on Organic Substrates Applications," 2001 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Feb. 13-15, 2001, pp. xx-xx.

Paik, Kyung-Wook, Son, Ho-Young, Kim, Il, and Chung, Chang-Kyu, "Wafer Level ACA Packages and their Applications to Advanced Electronic Packaging," 2008 10th Electronics Packaging Technology Conference , Singapore, Dec. 9-12, 2008, pp. 450-456.

Paik, Kyung-Wook, Son, Ho-Young, and Chung, Chang-Kyu, "Wafer Level Package Using Pre-applied Anisotropic Conductive Films (ACFs) for Flip-Chip Assembly," 2007 Pan Pacific Microelectronics Symposium & Exhibit, Maui, HI, Jan. 30-Feb. 1, 2007, pp. xx-xx.

Paik, Kyung-Wook, Son, Ho-Young, and Chung, Chang-Kyu, "Wafer Level Packages (WLPs) using Pre-Applied Anisotropic Conductive Films (ACFs)," 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Odaiba, Japan, Jan. 16-18, 2007, pp. 153-158.

Painaik, Mandar, Santos, Daryl L., McLenaghan, A. James, Chouta, Prashant, and Johnson, Stacy Kalisz, "Effect of Flux Quantity on Sn-Pb and Pb-Free BGA Solder Shear Strength," Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium, San Jose, CA, July 17-18, 2002, pp. 229-237.

Painaik, Mandar, Santos, Daryl L., McLenaghan, A. James, Chouta, Prashant, and Johnson, Stacy Kalisz, " Effect of Flux Quantity on Sn-Pb and Pb-Free BGA Solder Shear Strength," flipchips.com.

Painter, Richard, "Field Experiences with High Corrosion Resistance Trivalent Conversion Coatings," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 756-760.

Pajonk, Joachim, and Halk, David R., "Variable Flip Chip Assembly for High-volume Production," Advanced Packaging, vol. 13 no. 6, pp. 42-45, June 2004.

Pal, Ila, and Smolentseva, Elena, "An Experimental Study of Press-Fit Interconnection on Lead Free Plating Finishes," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 235-240.

Pal, Manoj Kumar, Gergely, Greta, Koncz-Horvath, Daniel, and Gacsi, Zoltan, "Investigation of microstructure and wetting behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with additions of 1.0 wt % SiC on copper substrate," Intermetallics, vol. 128, pp. 106991-1-106991-9, Jan. 2021.

Pala, S., "RoHS Aspects on Aluminium versus NbO Capacitors for Automotive Applications," Proceedings of CARTS-Europe 2005, Prague, Czech Republic, Oct. 17-20, 2005, pp. 45-49.

Palaniappan, Sakthi Cibi Kannammal, and Anselm, Martin K., "A Study on Process, Strength and Microstructure Analysis of Low Temperature SnBi Containing Solder Pastes Mixed With Lead-Free Solder Balls," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 229-237.

Palesko, Chet A., Palesko, Amy J., Hunrath, Chris, and Parent, Ken, "A Technology to Reduce Pad Cratering Defects and the Impact on Product Cost," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 950-954.

Pallapothu, Mahesh, Lakshminarayana, Akshay, Chaudhari, Mugdha, Rahangdale, Unique, Misrak, Abel, and Agonafer, Dereje, "Solder Joint Reliability of BGA Packages on High Frequency Laminate PCBs Under Power Cycling," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 61-65.

Pallaro, M., Moretto, F. L., Panzeri, G., and Magagnin, L., "Sn-Cu codeposition from a non-aqueous solution based on ethylene glycol for wafer-bonding applications: direct and pulse electroplating," Transactions of the IMF, vol. 96 no. 5, pp. 265-268 , 2018. https://doi.org/10.1080/00202967.2018.1507329

Palm, Petteri, Maattanen, Jarmo, De Maquille, Yannick, Picault, Alain, Vanfleteren, Jan, and Vandecasteele, Bjorn, "Comparison of different flex materials in high density flip chip on flex applications," Microelectronics Reliability, vol. 43 no. 3, pp. 445-451, Mar. 2003.

Palm, Petteri, Maattanen, Jarmo, Tuominen, Aulis, and Ristolainen, Eero, "Reliability of 80um pitch flip chip attachment on flex," Microelectronics Reliability, vol. 41 no. 5, pp. 633-638, May 2001.

Palm, Petteri, Maattanen, Jarmo, De Maquille, Yannick, Picault, Alain, Vanfleteren, Jan, and Vandecasteele, Bjorn, "Reliability of Different Flex Materials in High Density Flip Chip on Flex Applications," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, Germany, Oct. 21-24, 2001, pp. 224-229.

Palm, Petteri, Jarmo Maattanen, Jarmo, Picault, Alain, and De Maquille, Yannick, "The evaluation of different base materials for high density flip chip on flex applications," Microelectronics International, vol. 18 no. 3, pp. 27-31, 2001.

Palmer, Mark A., "Alternative Processing for Forming Solder Joints with Lead-free Solder Alloys," Surface Mount Technology (SMT), vol. 14 no. 8, pp. 61-66, Aug. 2000.

Palmer, Mark A., Wainwright, Kurt, Fok, Lung C., and Jones, Benjamin, "Experiments for First-Year Engineering Students Using Tin-Bismuth Alloys," JOM, vol. 54 no. 6, pp. 41-44, June 2002.

Palmer, Mark A,, Erdman, Nicole S,, and McCall, David A., "Forming high temperature solder joints through liquid phase sintering of solder paste," Journal of Electronic Materials, vol. xx no. xx, pp. xx-xx, Nov. 1999.

Palumbo, G., Erb, U., McCrea, J. L., Hibbard, G. D., Brooks, I., Gonzalez, F., and Panagiotopoulos, K., "Electrodeposited Nanocrystalline Coatings for Hard-Facing Applications," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 679-687.

Palumbo, G., Gonzalez, F., Tomantschger, K., Erb, U., and Aust, K. T., "Nanotechnology Opportunities for Electroplating Industries," Plating & Surface Finishing, vol. 90 no. 2, pp. 36-43, Feb. 2003.

Pan, Binghua, Yeo, Chee Keng, and Chan, Su Liang, "Low Temperature Processing Conductive Adhesives for High Temperature Applications," 2012 Pan Pacific Microelectronics Symposium, Kauai, HI, Feb. 14-16, 2012, pp. xx-xx.

Pan, H., Yi, J. B., Liu, B. H., Thongmee, S., Ding, J., Feng, Y. P., and Lin, J. Y., "Magnetic properties of highly-ordered Ni, Co and their alloy nanowires in AAO templates," Solid State Phenomena, vol. 111, pp. 123-126, Apr. 2006.

Pan, Hsiao-An, Lin, Chi-Pu, and Chen, Chih-Ming, "Interfacial Reaction of Molten Sn on a Strained Cu Electroplated Layer," Journal of Electronic Materials, vol. 41 no. 9, pp. 2470-2477, Sept. 2012.

Pan, Hung-Chun, and Hsieh, Tsung-Eong, "An Investigation of Diffusion Barrier Characteristics of an Electroless Co(W,P) Layer to Lead-Free SnBi Solder," Journal of Electronic Materials , vol. 40 no. 3, pp. 330-339, Mar. 2011.

Pan, Jianbiao, Silk, Julie, Powers, Mike, and Hyland, Patrick, "Effect of Gold Content on the Reliability of SnAgCu Solder Joints," IPC APEX Expo Technical Conference 2011, Las Vegas, NV, April 12-14, 2011, pp. xx-xx.

Pan, Jianbiao, Silk, Julie, Powers, Mike, and Hyland, Patrick, "Effect of Gold Content on the Reliability of SnAgCu Solder Joints," IEEE Transactions on Components, Packaging and Manufacturing Technology , vol. 1 no. 10, pp. 1662-1669, Oct. 2011.

Pan, Jianbiao, Chou, Tzu-Chien, Dee, Wesley J., and Toleno, Brian J., "Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S39-03-1-S39-03-10.

Pan, Jianbiao, Chou, Tzu-Chien, Bath, Jasbir, Willie, Dennis, and Toleno, Brian J., "Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints," Soldering & Surface Mount Technology, vol. 21 no. 4, pp. 32-37, 2009.

Pan, Jianbiao, "Estimation of Liquidus Temperature when SnAgCu BGA/CSP Components are Soldered with SnPb Paste," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Pan, Jianbiao, Wang, Jyhwen, and Shaddock, David M., "Lead-free Solder Joint Reliability - State of the Art and Perspectives," Journal of Microelectronics and Electronic Packaging, vol. 2 no. 1, pp. 72-83, 1st Quarter 2005.

Pan, Jianbiao (John), and Bath, Jasbir, "Lead Free Soldering Backward Compatibility," IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies , Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.

Pan, Jianbiao, Toleno, Brian J., Chou, Tzu-Chien, and Dee, Wesley J., "The effect of reflow profile on SnPb and SnAgCu solder joint shear strength," Soldering & Surface Mount Technology, vol. 18 no. 4, pp. 48-56, 2006.

Pan, Jianling, and Huang, Mingliang, "Au-Sn co-electroplating solution for Flip Chip-LED Bumps," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 283-287.

Pan, Jianling, Huang, Mingliang, and Pan, Song, "Effects of Plating Parameters on the Au-Sn Co-electrodepositon for Flip Chip-LED Bumps," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 1111-1115.

Pan, Jun-qi, Liu, Zhi-feng, Liu, Guang-fu, Wang, Shu-wang, and Huang, Hai-hong, "Recycling process assessment of mechanical recycling of printed circuit board," Journal of Central South University of Technology, vol. 12 no. 2, pp. 157-161, Oct. 2005.

Pan, Kailin, Yan, Yilin, Zhou, Bin, Tsai, Bruce, and Wu, Zhiqiang, "Research on Micro Crack Induced during the Process of Assembling BGA," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Pan, Kailin, Zhou, Bin, and Yan, Yilin, "Simulating Analysis of Dynamic Responses for CSP under Board Level Drop Test," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Pan, Ling, Lew, Kok-Keong, Redwing, Joan M., and Dickey, Elizabeth C., "Effect of diborane on the microstructure of boron-doped silicon nanowires," Journal of Crystal Growth, vol. 277 no. 1-4, pp. 428-436, Apr. 15, 2005.

Pan, Ling, Lew, Kok-Keong, Redwing, Joan M., and Dickey, Elizabeth C., "Stranski-Krastanow Growth of Germanium on Silicon Nanowires," Nano Letters, vol. 5 no. 6, pp, 1081-1085, June 2005.

Pan, N., Henshall, G. A., Billaut, F., Dai, S., Strum, M. J., Lewis, R., Benedetto, E., and Rayner, J., "An Acceleration Model for Sn-Ag-Cu Solder Joint Reliability Under Various Thermal Cycle Conditions," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 876-883.

Pan, Song, Huang, Mingliang, Zhao, Ning, Zhou, Shaoming, and Zhang, Zhijie, "Dissolution of Substrates in Line-type Cu/Sn/Cu and Cu/Sn/Ni Interconnects under Current Stressing," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1399-1402.

Pan, Tsung-Yu, Blair, Howard D., Nicholson, John M., and Oh, Sung-Won, "Intermetallic Compound Formation of Sn/Pb, Sn/Ag, and Sn Solders on Ni Substrate from the Molten Stage and Its Growth During Aging," Advances in Electronic Packaging 1997, Volume 2, Kohala Coast, Hawaii, June 15-19, 1997, pp. 1347-1355.

Pan, Tsung-Yu, White, Steven C., Lutz, Edwin L., Blair, Howard D., and Nicholson, John M., "Solder Joint Reliability in Alternator Power Diode Assemblies," Journal of Electronic Materials, vol. 28 no. 11, pp. 1276-1285, Nov. 1999.

Pan, Xuemin, Zhao, Ning, Ding, Ruifang, Wei, Guanglin, and Wang, Lai, "The Correlation between the Liquid Structure and the Solidification Microstructure of Sn-Cu Lead-Free Solders," Materials Science Forum , vol. 654-656, pp. 1385-1388, 2010.

Pan, Xuemin, Zhao, Ning, Ding, Ruifang, Wei, Guanglin, and Wang, Lai, "The correlation between the liquid structure and the viscosity of Sn-Cu lead-free solders," Advanced Materials Research, vol. 97-101, pp. 679-682, 2010.

Pan, Yan, Song, Lu, Zhang, Shuye, Cai, Xionghui, and Paik, Kyung-Wook, "Effects of Polymer Conductive Particle Contents on the Electrical Performance and Reliability of 50-um Pitch Flex-on-Flex Assemblies Using Anisotropic Conductive Films," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 7 no. 11, pp. 1759-1764, Nov. 2017.

Panagiotakis, Gregory, and DuBois, Travis, "Copper rod quality and fine wire production," Wire Journal International, vol. 36 no. 7, pp. 84-87, July 2003.

Panas, Robert M., and Culpepper, Martin L., "Engineering Electrical Interfaces to Silicon via Indium Solder," IEEE Transactions on Electron Devices, vol. 62 no. 6, pp. 1977-1983, June 2015.

Panashchenko, Lyudmyla, "Evaluation of Environmental Tests for Tin Whisker Assessment," Tin Whisker Group teleconference, Jan. 20,2010.

Panashchenko, Lyudmyla, "Evaluation of Environmental Tests for Tin Whisker Assessment (presentation)," Tin Whisker Group teleconference, Jan. 20,2010.

Panashchenko, Lyudmyla, and Osterman, Michael, "Examination of Nickel Underlayer as a Tin Whisker Mitigator," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1037-1043.

Panashchenko, Lyudmyla, and Osterman, Michael, "Examination of Nickel Underlayer as a Tin Whisker Mitigator (presentation)," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1037-1043.

Panashchenko, Lyudmyla, "Fat Metal Whiskers," Tin Whisker Group teleconference, Nov. 18, 2009.

Panashchenko, Lyudmyla, "Lincoln's Beard Growing Whiskers," CALCE UMD, Nov. 20, 2009.

Panashchenko, Lyudmyla, Brusse, Jay, and Leidecker, Henning, "Long Term Investigation of Urethane Conformal Coating Against Tin Whisker Growth," IPC Tin Whiskers Conference, Chicago, IL, Dec. 6-7, 2010, pp. xx-xx.

Panashchenko, Lyudmyla, "Melting Whiskers," Center for Advanced Life Cycle Engineering, Feb. 13, 2009.

Panashchenko, Lyudmyla, "Non-Whisker Formations on Sn plating," Center for Advanced Life Cycle Engineering, Mar. 3, 2009.

Panashchenko, Lyudmyla, "Plating Dendrite Formations on Sn plating," Tin Whisker Group teleconference, Mar. 31, 2010.

Panashchenko, Lyudmyla, "The Art of Appreciating Metal Whiskers: A Practical Guide for Electronics Professionals," IPC Tin Whisker Symposium, Dallas, TX, Apr. 17, 2012, pp. xx-xx.

Panashchenko, Lyudmyla, "The Art of Metal Whisker Appreciation: A Practical Guide for Electronics Professionals," IPC International Tin Whisker Conference, Fort Worth, TX, Apr. 17-19, 2012, pp. xx-xx.

Panashchenko, Lyudmyla, "Tin Whisker Growth on Sn77.2-In20-Ag2.8 Solder," 2018 CMSE Components for Military & Space Electronics Training & Exhibition, Los Angeles, CA, May 7-10, 2018, pp. xx-xx.

Panashchenko, Lyudmyla, "Whisker Length Measurement: a Validation Study," Center for Advanced Life Cycle Engineering, 2009.

Panchal, Suresh, and Chauhan, R. P., "Nickel ion beam induced modifications in Cu-Se heterojunction nanowires," Journal of Materials Science: Materials in Electronics, vol. 31 no. 1, pp. 693-703, Jan. 2020.

Panchenko, Iuliana, Croes, Kristof, De Wolf, I., De Messemaeker, J., Beyne, Eric, and Wolter, Klaus-Juergen, "Degradation of Cu6Sn5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn microbump interconnects," Microelectronic Engineering, vol. 117, pp. 26-34, Apr. 1, 2014.

Panchenko, Iuliana, Mueller, Maik, and Wolter, Klaus-Juergen, "Metallographic Preparation of the SnAgCu Solders for Optical Microscopy and EBSD Investigations," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 18-23.

Panchenko, Iuliana, Mueller, Maik, and Wolter, Klaus-Juergen, "Microstructure Characterization Of Lead-Free Solders Depending On Alloy Composition," AIP Conference Proceedings, vol. 1300, pp. 245-254, 2010.

Panchenko, Iuliana, Grafe, Juergen, Mueller, Maik, and Wolter, Klaus-Juergen, "Microstructure Investigation of Cu/SnAg Solid-Liquid Interdiffusion Interconnects by Electron Backscatter Diffraction," 2013 IEEE 15th Electronics Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp. 318-323.

Panchenko, Iuliana, Mueller, Maik, Wiese, Steffen, Schindler, Sebastian, and Wolter, Klaus-Juergen, "Solidification Processes in the Sn-rich Part of the SnCu System," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 90-99.

Panda, Ramdayal, Jadhao, Prashant Ram, Pant, Kamal Kishore, Naik, Satya Narayan, and Bhaskar, Thallada, "Eco-friendly recovery of metals from waste mobile printed circuit boards using low temperature roasting," Journal of Hazardous Materials, vol. 395, pp. 122642-1-122642-11, Aug. 5, 2020.

Pande, Surojit, Sarkar, Achintya Kumar, Basu, Mrinmoyee, Jana, Subhra, Sinha, Arun Kumar, Sarkar, Sougata, Pradhan, Mukul, Saha, Sandip, Pal, Anjali, and Pal, Tarasankar, "Gram Level Synthesis of Lead-Free Solder in the Nanometer Length Scale Obtained from Tin and Silver Compounds Using Silicone Oil," Langmuir , vol. 24 no. 16, pp. 8991-8997, Aug. 19, 2008.

Pandey, P., Tiwary, C. S., and Chattopadhyay, K., "Effects of Cu and In Trace Elements on Microstructure and Thermal and Mechanical Properties of Sn-Zn Eutectic Alloy," Journal of Electronic Materials, vol. 48 no. 5, pp. 2660-2669, May 2019.

Pandey, P., Tiwary, C. S., and Chattopadhyay, K., "Effects of Minute Addition of Ni on Microstructure and Mechanical Properties of Sn-Zn Eutectic Alloy," Journal of Electronic Materials, vol. 45 no. 10, pp. 5468-5477, Oct. 2016.

Pandher, Ranjit, Raut, Rahul, Liberatore, Michael, Jodhan, Navendra, and Tellefsen, Karen, "A Procedure to Determine Head-in-Pillow Defect and Analysis of Contributing Factors," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 674-680.

Pandher, Ranjit S., Lewis, Brian G., Vangaveti, Raghasudha, and Singh, Bawa, "Drop Shock Reliability of Lead-Free Alloys - Effect of Micro-Additives," 2007 Proceedings 57th Electronic Components & Technology Conference , Reno, NV, May 29-June 1, 2007, pp. 669-676.

Pandher, Ranjit, and Pachamuthu, Ashok, "Effect of Multiple Reflow Cycles on Solder Joint Formation and Reliability," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 112-117.

Pandher, Ranjit, and Lawlor, Tom, "Effect of Silver in Common Lead-Free Alloys," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

Pandher, Ranjit, Jodhan, Navendra, Raut, Rahul, and Liberatore, Michael, "Head-in-Pillow Defect - Role of the Solder Ball Alloy," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 151-156.

Pandher, Ranjit, and Boureghda, Monnir, "Identification of Brittle Solder Joints using High Strain Rate Testing of BGA Solder Joints," Proceedings 45th Annual IEEE International Reliability Physics Symposium, Phoenix, AZ, Apr. 15-19, 2007, pp. 107-112.

Pandher, Ranjit S., and Shea, Chris, "Optimizing Stencil Design for Lead-Free SMT Processing," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 87-94.

Pandher, Ranjit S., and Shea, Chrys, "Optimizing Stencil Design for Pb-Free SMT," Circuits Assembly , vol. 16 no. 7, pp. 32-36, July 2005.

Pandher, Ranjit, and Athavale, Saurabh, "Reflow Profile Optimization for Lead-free (SAC) Alloys in BGA Applications," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 708-716.

Pandher, Ranjit, and Pachamuthu, Ashok, "Reliability of Mixed Alloy Ball Grid Arrays Under Thermal Fatigue and Drop Shock Test," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 364-371.

Pandher, Ranjit, Pachamuthu, Ashok, and Raut, Rahul, "Reliability of Mixed Alloy Ball Grid Arrays Using Impact Bend Test and Drop Shock Test," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 678-683.

Pandher, Ranjit, and Healey, Robert, "Reliability of Pb-Free Solder Alloys in Demanding BGA and CSP Applications," 2008 Proceedings 58th Electronic Components & Technology Conference , Lake Buena Vista, FL, May 27-30, 2008, pp. 2018-2023.

Pandher, Ranjit, "Step 3: Solder Materials Melting and Freezing Characteristics of Common Lead-free Alloys," SMT Web Exclusive Article.

Pandher, Ranjit, Raut, Rahul, and Liberatore, Mike, "Understanding Head-in-Pillow Defects - The Role of Thermal Stability in Paste," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 1020-1026.

Pandian, Guru Prasad, Ramaswami, Gopala Krishnan, Hodkiewicz, Melinda, Cripps, Edward, and Pecht, Michael, "Long-term Reliability of Lead-free Electronic Systems," 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 18-21, 2016, pp. 305-311.

Pandiarajan, Ganesh, Iyer, Satyanarayan "Satya", Chennagiri, Gurudutt, Havens, Ross, and Srihari, Krishnaswami "Hari", "Effect of Pad Design (SMD/NSMD), Via-in-Pad, and Reflow Profile Parameters on Voiding During the Lead-free Solder Bumping Process," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 1777-1782.

Pang, J. H. L., Wong, F. L., Heng, K. T., Chua, Y. S., and Long, C. E., "Combined Vibration and Thermal Cycling Fatigue Analysis for SAC305 Lead Free Solder Assemblies," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 1300-1307.

Pang, John H. L., and Xu, Luhua, "Board-Level Drop Reliability Performance Before and After Thermal Cycling Aging," Proceedings of the ASME InterPack Conference, Volume 2, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 173-178.

Pang, John H. L., Xiong, B. S., Neo, C. C., Mang, X. R., and Low, T. H., "Bulk Solder and Solder Joint Properties for Lead Free 95.5Sn-3.8Ag-0.7Cu Solder Alloy," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 673-679.

Pang, John H. L., Xiong, B. S., and Low, T. H., "Creep and Fatigue Characterization of Lead Free 95.5Sn-3.8Ag-0.7Cu Solder," 54th Electronic Components & Technology Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1333-1337.

Pang, John H. L., and Che, F. X., "Drop Impact Analysis of Sn-Ag-Cu Solder Joints using Dynamic High-Strain Rate Plastic Strain as the Impact Damage Driving Force," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 49-54.

Pang, John H. L., Xu, Luhua, Shi, X. Q., Zhou, W., and Ngoh, S.L. "Intermetallic Growth Studies on Sn-Ag-Cu Lead-Free Solder Joints," Journal of Electronic Materials, vol. 33 no. 10, pp. 1219-1226, Oct. 2004.

Pang, John H. L., Prakash, Kithva H., and Low, T. H., "Isothermal and Thermal Cycling Aging on IMC Growth rate in Pb-free and Pb-based Solder Interfaces," The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 109-115.

Pang, John H. L., and Che, Fa-Xing, "Isothermal Cyclic Bend Fatigue Test Method for Lead Free Solder Joints," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 2, 2006, pp. 1011-1017.

Pang, John H. L., and Che, F. X., "Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints," Journal of Electronic Packaging, vol. 129 no. 4, pp. 496-503, Dec. 2007.

Pang, John H. L., Yeo, Alfred, Low, T. H., and Che, F. X., "Lead-Free 96.5Sn-3.5Ag Flip Chip Solder Joint Reliability Analysis," The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 160-164.

Pang, John H. L., Low, Patrick T. H., and Xiong, B. S., "Lead-Free 95.5Sn-3.8Ag-0.7Cu Solder Joint Reliability Analysis for Micro-BGA Assembly," The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 131-136.

Pang, John H. L., Xiong, B. S., and Low, T. H., "Low cycle fatigue models for lead-free solders," Thin Solid Films , vol. 462-463, pp. 408-412, 2004.

Pang, John H. L., Xiong, B. S., and Low, T. H., "Low cycle fatigue study of lead free 99.3Sn-0.7Cu solder alloy," International Journal of Fatigue, vol. 26 no. 8, pp. 865-872, 2004.

Pang, John H. L., and Xiong, B. S., "Mechanical Properties for 95.5Sn-3.8Ag-0.7Cu Lead-Free Solder Alloy," IEEE Transactions on Components and Packaging Technologies, vol. 28 no. 4, pp. 830-840, Dec. 2005.

Pang, John H. L., Xiong, B. S., and Che, F. X., "Modeling Stress Strain Curves For Lead-Free 95.5Sn-3.8Ag-0.7Cu Solder," Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems , Brussels, Belgium, May 9-12, 2004, pp. 449-453.

Pang, John H. L., Low, T. H., Xiong, B. S., Luhua, Xu, and Neo, C. C., "Thermal cycling aging effects on Sn-Ag-Cu solder joint microstructure, IMC and strength," Thin Solid Films, vol. 462-463, pp. 370-375, Sept. 2004.

Pang, John H. L., Wong, Stephen C. K., Neo, Sai Kiat, and Tan, Kok Ee, "Thermal Cycling Fatigue Analysis of Copper Pillar-to-Solder Joint Reliability," 2nd Electronics Systemintegration Technology Conference , Greenwich, London, UK, Sept. 1-4, 2008, pp. 743-748.

Pang, Mengzhi, Kaufmann, Matt, Sze, Henry, Sharifi, Reza, Tan, Keith, Neo, Chong Wei, Ramakrishna, Ram, Karikalan, Sam, and Khan, Reza, "Mechanically Compliant Lead-Free Solder Metallurgy: The Key Element in Enabling Extreme Low-k Large-Die Flip Chip Devices," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 597-602.

Pang, Siu-kwong, and Yung, Kam-chuen, "A Green Approach to Synthesis of Nanoparticles of Sn-3.0Ag-0.5Cu Lead-Free Solder Alloy," Materials Transactions, vol. 53 no. 10, pp. 1770-1774, 2012.

Pang, X. Y., Liu, Z. Q., Wang, S. Q., and Shang, J. K., "Effects of Bi segregation on the tensile properties of Cu/Cu3Sn(1 0 0) interface," Microelectronics Reliability, vol. 51 no. 12, pp. 2330-2335, Dec. 2011.

Pang, X. Y., Liu, Z. Q., Wang, S. Q., and Shang, J. K., "First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu3Sn(010)," Journal of Materials Science and Technology, vol. 26 no. 12, pp. 1057-1062, Dec. 2010.

Pang, X. Y., Shang, P. J., Wang, S. Q., Liu, Z. Q., and Shang, J. K., "Weakening of the Cu/Cu3Sn(100) Interface by Bi Impurities," Journal of Electronic Materials, vol. 39 no. 8, pp. 1277-1282, Aug. 2010.

Pang, Xue-Yong, Liu, Zhi-Quan, Wang, Shao-Qing, and Shang, Jian-Ku, "Fundamental Influence of Segregated Bi on the Mechanical Properties of Interconnect of Bismuth-containing Solder and Copper," International Conference on Electronic Packaging Technology & High Density Packaging , Shanghai, China, July 28-31, 2008, pp. xx-xx.

Pangelina, Gary, "Flux-less / Void-free: An Environment-Friendly Soldering Process for Optoelectronics Assemblies," Journal of SMT, vol. 16 no. 2, pp. 11-15, Apr. 2003.

Pani, M., Fornasini, M. L., Manfrinetti, P., and Merlo, F., "Intermetallic compounds in the M-Cu-Sn systems with M = Eu, Sr, Ba," Intermetallics, vol. 19 no. 7, pp. 957-963, July 2011.

Paniccia, M., Flinn, P., and Reifenberger, R., "Scanning probe microscopy studies of electromigration in electroplated Au wires," Journal of Applied Physics, vol. 73 no. 12, pp. 8189-8197, June 15, 1993.

Paniccia, Mario, Reifenberger, Ron, and Flinn, Paul, "In-situ observation of electromigration in Au using atomic force microscopy," AIP Conference Proceedings, vol. 305, pp. 211-219, 1994.

Pannerselvam, Elavarasan T., and Ramkumar, S. Manian, "Pb-Free Selective Soldering Process Optimization," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 264-271.

Panossian, Z., and de Almeida, N. L., "Identification Tests for Metallic Coatings," Plating & Surface Finishing, vol. 86 no. 8, pp. 44-47, Aug. 1999.

Pant, Deepak, "E-waste projection using life-span and population statistics," International Journal of Life Cycle Assessment, vol. 18 no. 8, pp. 1465-1469, Sept. 2013.

Pantazica, Mihaela, Marghescu, Cristina, Svasta, Paul, Varzaru, Gaudentiu, Plotog, Ioan, and Tamas, Cosmin Andrei, "Comparison between Two Surface Insulation Resistance Tests regarding Different Soldering Techniques," 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging, Alba Iulia, Romania, Oct. 25-28, 2012, pp. 151-156.

Pantazica, Mihaela, Svasta, Paul, Wohlrabe, Heinz, and Wolter, Klaus-Jurgen, "Factors Influencing the Formation of Voids in Chip Component Solder Joints," 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging, Galati, Romania, Oct. 24-27, 2013, pp. 277-282.

Panteghini, Andrea, and Genna, Francesco, "Effects of the strain-hardening law in the numerical simulation of wire drawing processes," Computational Materials Science, vol. 49 no. 2, pp. 236-242, Aug. 2010.

Pao, Y.-H., Badgley, S., Govila, R., and Jih, E., "An Experimental and Modeling Study of Thermal Cyclic Behavior of Sn-Cu and Sn-Pb Solder Joints," Materials Research Society Symposia Proceedings Volume 323, Boston, MA, Nov. 29-Dec. 3, 1993, pp. 153-158.

Pao, Y.-H., Badgley, S., Jih, E., Govila, R., and Browning, J., "Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints," Journal of Electronic Packaging, vol. 115 no. 2, pp. 147-152, June 1993.

Pao, Y.-H., Badgley, S., Govila, R. R., and Jih, E., "Thermomechanical and Fatigue Behavior of Four Lead and Lead-free Solder Joints," Advances in Electronic Packaging 1993, Volume 2, Binghamton, NY, Sept. 29-Oct. 2, 1993, pp. 937-941.

Papadimitriou, I., Utton, C., and Tsakiropoulos, P., "Ab initio investigation of the intermetallics in the Nb-Sn binary system," Acta Materialia, vol. 86, pp. 23-33, Mar. 2015.

Papakyriacou, Christos, "Act now," European Semiconductor, vol. 27 no. 3, pp. 19-20, Mar. 2005.

Papakyriacou, Christos, "EU lead-free electronics legislation: its impact on SMEs," Engineering Technology, vol. 8 no. 4, pp. 16, May 2005.

Papandrew, Greg, "`Qualification Road' a Treacherous Path," Circuits Assembly, vol. 20 no. 1, pp. 20-21, Jan. 2009.

Pape, Uwe, and Schulz, Jens-Uwe, "Characteristics of Lead-Free Solders During Flow Soldering (Selective and Wave Soldering)," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 139-144.

Papish, Jacob, Brewer, F. M., and Holt, Donald A., "Germanium. XXV. Arc Spectrographic Detection and Estimation of Germanium. Occurance of Germanium in Certain Tin Minerals. Enargite as a Possible Source of Germanium," Journal of the American Chemical Society, vol. 49 no. 12, pp. 3028-3033, Dec. 1927.

Papp, John F., "Chromium," Minerals Yearbook: Volume I. -- Metals and Minerals , 2003.

Paquet, Marie-Claude, Gaynes, Michael, Duchesne, Eric, Questad, David, Belanger, Luc, and Sylvestre, Julien, "Underfill Selection Strategy for Pb-Free, Low-K and Fine Pitch Organic Flip Chip Applications," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1595-1603.

Paradee, Gary, and Christou, Aris, "Fatigue Behavior and Effect of Crack Propagation in Lead Free Solder in Microelectronic Packaging," International Semiconductor Device Research Symposium, College Park, MD, Dec. 9-11, 2009, pp. xx-xx.

Paradee, Gary, and Christou, Aris, "Stress Relaxation Behavior and Low Cycle Fatigue Behavior of Bulk SAC 305," 2011 International Semiconductor Device Research Symposium, College Park, MD, Dec. 7-9, 2011, pp. xx-xx.

Paradee, Gary, Bailey, Eric, and Christou, Aris, "Stress relaxation behavior and low cycle fatigue behavior of bulk SAC 305," Journal of Materials Science: Materials in Electronics, vol. 25 no. 9, pp. 4122-4128, Sept. 2014.

Parameswariah, Chethan, "RoHS - what is it?," IEEE Potentials, vol. 25 no. 2, pp. 29-30, Mar.-Apr. 2006.

Paramonov, V. A., and Filatova, N. G., "Passivation of Electrolytical Tin-plate in Trivalent Chromium Solutions," Zashchita Metallov/Protection of Metals, vol. 40 no. 3, pp. 295-298, 2004.

Parekh, Hardik, Mirza, Fahad, Shah, Samip, and Agonafer, Dereje, "A Multi-level Finite Element Study to Analyze the Chip-Package-Interaction for Cu/Low-k Interconnects," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 190-196.

Parenti, Dante, "Compliant Pin Technology: A Solder-free Alternative," Surface Mount Technology (SMT), vol. 19 no. 8, pp. xx-xx, Aug. 2005.

Paret, Paul, DeVoto, Douglas, Major, Joshua, and Narumanchi, Sreekant, "Parametric Design Study of a Power Electronics Package for Improving Solder Joint Reliability," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 1065-1072.

Pareuil, Priscilla, Hamdoun, Hakim, Bordas, Francois, Joussein, Emmanuel, and Bollinger, Jean-Claude, "The influence of reducing conditions on the dissolution of a Mn-rich slag from pyrometallurgical recycling of alkaline batteries," Journal of Environmental Management, vol. 92 no. 1, pp. 102-111, Jan. 2011.

Parikh, Sharad, and Creed, Larry, "Cadmium, Lead, Mercury & Hexavalent Chromium Free Color for MPFP (Melt Processable Fluoropolymers)," ANTEC 94, Volume III, San Francisco, CA, May 1-5, 1994, pp. 2542-2545.

Parise, Anthony V., Balliett, Robert W., and Avitzur, Betzalel, "Die design for fluorinated lubricants," Wire Journal International , vol. 35 no. 4, pp. 188-195, Apr. 2002.

Paritskaya, L. N., Bogdanov, V. V., Kaganovskii, Yu., and Lojkowski, W., "Kinetics of Competitive Phase Growth in Cu-Ni-Sn System," Defect and Diffusion Forum, vol. 237-240, pp. 849-854, 2005.

Paritskaya, L. N., Bogdanov, V. V., and Kaganovskii, Yu. S., "Stress Effects in Kinetics of Intermetallic Growth," Defect and Diffusion Forum, vol. 216-217, pp. 35-40, Feb. 2003.

Park, Ah-Young, Kim, Sun-Rak, Yoo, Choong D., and Kim, Taek-Soo, "Development of Inclined Conductive Bump (ICB) for Flip-Chip Interconnection," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 880-885.

Park, Bo Hyeon, Oh, Hyunsik, Hong, Seok Pyo, and Hong, Sang Jeen, "Analysis of Surface Roughness of Immersion Sn Plating Film via Micro Etch Process," Advanced Materials Research, vol. 26-28 no. xx, pp. 425-428, 2007.

Park, Chang-Bae, Hong, Soon-Min, Jung, Jae-Pil, Kang, Choon-Sik, and Shin, Yong-Eui, "A Study on the Fluxless Soldering of Si-Wafer/Glass Substrate Using Sn-3.5 mass%Ag and Sn-37 mass%Pb Solder," Materials Transactions, vol. 42 no. 5, pp. 820-824, May 2001.

Park, Changyoung, Filho, Jose Marcio Dias, Kim, Donghyun, Mawer, Glenn Y., and Moon, Tess J., "Crack Area Analysis of SnBp and SnAg Solder Joints in Plastic Ball Grid Array Packages from Dye Penetration Studies," Advances in Electronic Packaging 2003, Volume 1, Maui, Hawaii, July 6-11, 2003, pp. 701-708.

Park, DaeYoung, "REACH in Asia: A strategic approach," EMasia, Mar. 2010.

Park, DaeYoung, "Systemic Analysis of Product-Related Environmental Regulations in the EU, China, Japan & Korea: Case study of EEE," IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies , Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.

Park, Harold S., Cai, Wei, Espinosa, Horacio D., and Huang, Hanchen, "Mechanics of crystalline nanowires," MRS Bulletin, vol. 34, pp. 178-183, Mar. 2009.

Park, Hwan-Pil, Seo, Gwancheol, Kim, Sungchul, and Kim, Young-Ho, "Effects of Solder Volume and Reflow Conditions on Self-Alignment Accuracy for Fan-Out Package Applications," Journal of Electronic Materials, vol. 47 no. 1, pp. 133-141, Jan. 2018.

Park, Hwan-Pil, Seo, Gwancheol, Kim, Sungcheol, Ahn, Key-one, and Kim, Young-Ho, "Shear strength between Sn-3.0Ag-0.5Cu solders and Cu substrate after two solid-state aging processes for fan-out package process applications," Journal of Materials Science: Materials in Electronics, vol. 30 no. 11, pp. 10550-10559, June 2019.

Park, Hyun D., Prokes, S. M., Twigg, M. E., Ding, Yong, and Wang, Zhong Lin, "Growth of high quality, epitaxial InSb nanowires," Journal of Crystal Growth, vol. 304 no. 2, pp. 399-401, June 15, 2007.

Park, Hyun D., Gaillot, Anne-Claire, Prokes, S. M., and Cammarata, Robert C., "Observation of size dependent liquidus depression in the growth of InAs nanowires," Journal of Crystal Growth, vol. 296 no. 2, pp. 159-164, Nov. 2006.

Park, Hyun-Joon, Lee, Choong-Jae, Min, Kyung Deuk, and Jung, Seung-Boo, "Microstructures and Mechanical Properties of the Sn58wt.%Bi Composite Solders with Sn Decorated MWCNT Particles," Journal of Electronic Materials , vol. 48 no. 3, pp. 1746-1753, Mar. 2019.

Park, Hyun Sik, and Kim, Young Jae, "A novel process of extracting precious metals from waste printed circuit boards: Utilization of gold concentrate as a fluxing material," Journal of Hazardous Materials, vol. 365, pp. 659-664, Mar. 5, 2019.

Park, Hyun Soo, "Requirements to Preclude the Growth of Tin Whiskers," NASA Memo no. ASA Parts Project Office-Code 310, Goddard space Flight Center to QR/Director, Reliability, Maintainability, and Quality Assurance Divisin, Feb. 14, 1992.

Park, J., "Effects of test conditions on bending impact of lead free solder," European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Park, J. Y., Yang, C. W., Ha, J. S., Kim, C.-U., Kwon, E. J., Jung, S. B., and Kang, C. S., "Investigation of Interfacial Reaction Between Sn-Ag Eutectic Solder and Au/Ni/Cu/Ti Thin Film Metallization," Journal of Electronic Materials , vol. 30 no. 9, pp. 1165-1170, Sept. 2001.

Park, Jae-Hyeong, Kim, Tae-Wan, Zhang, Shuye, and Paik, Kyung-Wook, "Effects of Polymer Ball Size and Polyvinylidene Fluoride Nanofiber on the Ball Capture Rate for 100-um-Pitch Flex-on-Flex Assembly Using Anisotropic Conductive Films and Ultrasonic Bonding Method," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 6 no. 7, pp. 1129-1136, July 2016.

Park, Jae-Hyeong, and Paik, Kyung-Wook, "Piezoelectric Ceramics and Flexible Printed Circuits (FPCs) Interconnection using Anisotropic Conductive Films (ACFs) for Ultrasound Transducers Assembly," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 2484-2491.

Park, Jae-Yong, Seo, Wonil, Yoo, Sehoon, and Kim, Young-Ho, "Effect of Cu electroplating parameters on microvoid formation and high-speed shear strength in Sn-3.0Ag-0.5Cu/Cu joints," Journal of Alloys and Compounds, vol. 724, pp. 492-500, Nov. 15, 2017.

Park, Jae-Yong, Kim, Young Min, and Kim, Young-Ho, "Effect of Zn concentration on the interfacial reactions between Sn-3.0Ag-0.5Cu solder and electroplated Cu-xZn wetting layers (x = 0-43 wt%)," Journal of Materials Science: Materials in Electronics, vol. 27 no. 6, pp. 5916-5924, June 2016.

Park, Jae-Yong, Lee, Taeyoung, Seo, Wonil, Yoo, Sehoon, and Kim, Young-Ho, "Electromigration reliability of Sn-3.0Ag-0.5Cu/Cu-Zn solder joints," Journal of Materials Science: Materials in Electronics, vol. 30 no. 8, pp. 7645-7653, Apr. 2019.

Park, Jae-Yong, Kim, Young Min, and Kim, Young-Ho, "Improved drop reliability of Sn-Ag-Cu solder joints by Zn addition to a Cu wetting layer," Journal of Materials Science: Materials in Electronics , vol. 26 no. 8, pp. 5852-5862, Aug. 2015.

Park, Jae-Yong, Kabade, Rajendra, Kim, Choong-Un, Carper, Ted, Dunford, Steven, and Puligandla, Viswanadham, "Influence of Au Addition on the Phase Equilibria of Near-Eutectic Sn-3.8Ag-0.7Cu Pb-Free Solder Alloy," Journal of Electronic Materials , vol. 32 no. 12, pp. 1474-1482, Dec. 2003.

Park, Jae-Yong, Kim, Choong-Un, Carper, Ted, and Puligandla, Viswanadham, "Phase Equilibria Studies of Sn-Ag-Cu Eutectic Solder Using Differential Cooling of An-3.8Ag-0.7Cu Alloys," Journal of Electronic Materials , vol. 32 no. 11, pp. 1297-1302, Nov. 2003.

Park, Jae Yong, Ha, Jun Seol, Kang, Choon Sik, Shin, Kyu Sik, Kim, Moon Il, and Jung, Jae Pil, "Study on the Soldering in Partial Melting State (1)-Analysis of Surface Tension and Wettability," Journal of Electronic Materials, vol. 29 no. 10, pp. 1145-1152, Oct. 2000.

Park, Jae Yong, Kang, Choon Sik, and Jung, Jae Pil, "The Analysis of the Withdrawal Force Curve of the Wetting Curve Using 63Sn-37Pb and 96.5Sn-3.5Ag Eutectic Solders," Journal of Electronic Materials, vol. 28 no. 11, pp. 1256-1262, Nov. 1999.

Park, Jai-Hyun, Choi, Jai-Kyoung, and Ahn, Yong-Sik, "Effects of test conditions on shear strength of chip solder joints," CARTS Europe 2007, Barcelona, Spain, Oct. 29-Nov. 1, 2007, pp. xx-xx.

Park, Jeehye, Ok, Haemyung, Cha, Kyounghoon, and Hur, Tak, "Tackling Challenges in Measuring and Communicating Eco-efficiency," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 276-280.

Park, Jeung Hun, Gambin, Vincent, and Kodambaka, Suneel, "Effect of e-beam dose on the fractional density of Au-catalyzed GaAs nanowire growth," Thin Solid Films, vol. 607, pp. 43-49, May 31, 2016.

Park, Jin-Hyoung, Jang, Kyung-Woon, Paik, Kyung-Wook, and Lee, Soon-Bok, "A Study of Hygrothermal Behavior of ACF Flip Chip Packages With Moire Interferometry," IEEE Transactions on Components and Packaging Technologies, vol. 33 no. 1, pp. 215-221, Mar. 2010.

Park, Jin-Hyoung, Jang, Jae-Won, Jang, Kyung-Woon, Paik, Kyung-Wook, and Lee, Soon-Bok, "Fracture Toughness Assessment of ACF Flip-chip Packages under High Moisture Condition with Moire Interferometry," European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Park, Jin-Hyoung, Jang, Kyung-Woon, Paik, Kyung-Wook, and Lee, Soon-Bok, "Reliability Evaluation for Flip-Chip Electronic Packages under High Temperature and Moisture Condition using Moire," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 633-638.

Park, Jong Deck, Lim, Sooman, and Kim, Haekyoung, "Patterned silver nanowires using the gravure printing process for flexible applications," Thin Solid Films, vol. 586, pp. 70-75, July 1, 2015.

Park, Jong-Hwan, Lee, Jong-Hyun, Lee, Yong-Ho, and Kim, Yong-Seog, "Reaction Characteristics of the Au-Sn Solder with Under-Bump Metallurgy Layers in Optoelectronic Packages," Journal of Electronic Materials , vol. 31 no. 11, pp. 1175-1180, Nov. 2002.

Park, Jongwoo, Kim, Young-Hee, Wang, Seung-Woog, Lee, Seung-Woo, and Jeon, Hyungoo, "Reliability of Pb-Free Preplated Leadframe Under Atmosphere and Accelerated Aging Test," IEEE Transactions on Device and Materials Reliability , vol. 6 no. 1, pp. 33-41, Mar. 2006.

Park, Kee-Ryung, Cho, Hong-Baek, and Choa, Yong-Ho, "Synthesis of ultra-long cadmium telluride nanotubes via combinational chemical transformation," Materials Chemistry and Physics, vol. 189, pp. 64-69, Mar. 1, 2017.

Park, M. S., Gibbons, S. L., and Arroyave, R., "Computational Investigation of the Evolution of Intermetallic Compounds Affected by Microvoids During the Solid-State Aging Process in the Cu-Sn System," Journal of Electronic Materials, vol. 42 no. 6, pp. 999-1009, June 2013.

Park, M. S., and Arroyave, R., "Concurrent nucleation, formation and growth of two intermetallic compounds (Cu6Sn5 and Cu3Sn) during the early stages of lead-free soldering," Acta Materialia, vol. 60 no. 3, pp. 923-934, Feb. 2012.

Park, M. S., Gibbons, S. L., and Arroyave, R., "Confinement Effects on Evolution of Intermetallic Compounds During Metallurgical Joint Formation," Journal of Electronic Materials, vol. 43 no. 7, pp. 2510-2520, July 2014.

Park, M. S., and Arroyave, R., "Early stages of intermetallic compound formation and growth during lead-free soldering," Acta Materialia, vol. 58 no. 14, pp. 4900-4910, 2010.

Park, M. S., Stephenson, M. K., Shannon, C., Diaz, L. A. Caceres, Hudspeth, K. A., Gibbons, S. L., Munoz-Saldana, J., and Arroyave, R., "Experimental and computational study of the morphological evolution of intermetallic compound (Cu6Sn5) layers at the Cu/Sn interface under isothermal soldering conditions," Acta Materialia, vol. 60 no. 13-14, pp. 5125-5134, Aug. 2012.

Park, M. S., and Arroyave, R., "Formation and Growth of Intermetallic Compound Cu6Sn5 at Early Stages in Lead-Free Soldering," Journal of Electronic Materials, vol. 39 no. 12, pp. 2574-2582, Dec. 2010.

Park, M. S., and Arroyave, R., "Multiphase Field Simulations of Intermetallic Compound Growth During Lead-Free Soldering," Journal of Electronic Materials, vol. 38 no. 12, pp. 2525-2533, Dec. 2009.

Park, M. S., Gibbons, S. L., and Arroyave, R., "Phase-field simulations of intermetallic compound growth in Cu/Sn/Cu sandwich structure under transient liquid phase bonding conditions," Acta Materialia, vol. 60 no. 18, pp. 6278-6287, Oct. 2012.

Park, M. S., Gibbons, S. L., and Arroyave, R., "Prediction of processing maps for transient liquid phase diffusion bonding of Cu/Sn/Cu joints in microelectronics packaging," Microelectronics Reliability, vol. 54 no. 6-7, pp. 1401-1411, June-July 2014.

Park, Robert M., Bena, James F., Stayner, Leslie T., Smith, Randall J., Gibb, Herman J., and Lees, Peter S. J., "Hexavalent Chromium and Lung Cancer in the Chromate Industry: A Quantitative Risk Assessment," Risk Analysis, vol. 24 no. 5, pp. 1099-1108, Oct. 2004.

Park, S. B., Joshi, Rahul, Ahmed, Izhar, and Chung, Soonwan, "Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling," Journal of Electronic Packaging, vol. 130 no. 4, pp. 041004-1-041004-10, Dec. 2008.

Park, S. B., and Joshi, Rahul, "Comparison of thermo-mechanical behavior of lead-free copper and tin-lead column grid array packages," Microelectronics Reliability, vol. xx no. x, pp. xx-xx, xxxx.

Park, S. B., Chung, S. W., and Tang, Z., "Experimental Evidence of Underfill Voiding and Delamination during Board Level Assembly of Pb-free Solders," 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 43.

Park, S. B., Joshi, Rahul, and Goldmann, Lewis, "Reliability of Lead-Free Copper Columns in Comparison with Tin-Lead Solder Column Interconnects," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 82-89.

Park, S. W., Nagao, S., Kato, Y., Ishino, H., Sugiura, K., Tsuruta, K., and Suganuma, K., "Quasi-transient liquid-phase bonding by eutectic reaction of Sn-plated Zn on Cu substrate for high-temperature die attachment," Journal of Alloys and Compounds, vol. 637, pp. 143-148, July 15, 2015.

Park, S. W., Nagao, Shijo, Sugahara, Tohru, Kim, Keun-Soo, and Suganuma, Katsuaki, "Retarding intermetallic compounds growth of Zn high-temperature solder and Cu substrate by trace element addition," Journal of Materials Science: Materials in Electronics, vol. 24 no. 12, pp. 4704-4712, Dec. 2013.

Park, Se-Hoon, and Kim, Young-Ho, "Intermetallic Formation between Sn-Ag(-Cu) Solder Bumps and Au/Ni/Ti UBM and it's Effects on the Shear Force of the Solder Bumps," Materials Science Forum, vol. 475-479 part 3, pp. 1881-1884, 2005.

Park, Se Jun, Chung, Sung Hwan, Kim, Bong-Joong, Qi, Minghao, Xu, Xianfan, Stach, Eric A., and Yang, Chen, "Mechanism of vertical Ge nanowire nucleation on Si (111) during subeutectic annealing and growth," Journal of Materials Research, vol. 26 no. 21, pp. 2744-2748, Nov. 14, 2011.

Park, Seungbae, Dhakal, Ramji, Lehman, Lawrence, and Cotts, Eric J., "Grain Deformation and Strain in Board Level SnAgCu Solder Interconnects Under Deep Thermal Cycling," IEEE Transactions on Components and Packaging Technologies, vol. 30 no. 1, pp. 178-185, Mar. 2007.

Park, Seungbae, Dhakai, Ramji, Lehman, Lawrence, and Cotts, Eric, "Grain Formation and Intergrain Stresses in a Sn-Ag-Cu Solder Ball," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B, San Francisco, CA, July 17-22, 2005, pp. 1095-1100.

Park, Seungbae, Dhakal, Ramji, Lehman, Lawrence, and Cotts, Eric, "Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading," Acta Materialia, vol. 55 no. 9, pp. 3253-3260, May 2007.

Park, Seungbae, Tang, Zhenming, and Chung, Soonwan, "Temperature Effect of Interfacial Fracture Toughness on Underfill for Pb-Free Flip Chip Packages," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 105-109.

Park, Seungbae, Dhakal, Ramji, and Gao, Jia, "Three-Dimensional Finite Element Analysis of Multiple-Grained Lead-Free Solder Interconnects," Journal of Electronic Materials, vol. 37 no. 8, pp. 1139-1147, Aug. 2008.

Park, Sung Kyu, Han, Jeong In, Kim, Won Keun, and Kwak, Min Gi, "Chip Bonding on Non-rigid and Flexible Substrates with New Stepped Processes," Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, vol. 40 no. 1, pp. 412-418, Jan. 2001.

Park, Sungwon, Nagao, Shijo, Kato, Yoshitaka, Ishino, Hiroshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, and Suganuma, Katsuaki, "High-Temperature Die Attachment Using Sn-Plated Zn Solder for Power Electronics," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 5 no. 7, pp. 902-909, July 2015.

Park, Tae-Sang, Baek, Dong-Cheon, and Lee, Soon-Bok, "An experimental technique for the strain measurement of small structures using pattern recognition," Sensors and Actuators A, vol. 115 no.1, pp. 15-22, Apr. 2004.

Park, Tae-Sang, and Lee, Soon-Bok, "Cyclic Stress-Strain Measurement Tests of Sn3.5Ag0/75Cu Solder Joint," Proceedings of the 4th International Symposium on Electronic Materials and Packaging, Kaohsiung, Taiwan, Dec. 4-6, 2002, pp. 317-323.

Park, Tae-Sang, and Lee, Soon-Bok, "Isothermal Low Cycle Fatigue Tests of Sn/3.5Ag/0.75Cu and 63Sn/37Pb Solder Joints under Mixed-Mode Loading Cases," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp 979-984.

Park, Tae-Sang, and Lee, Soon-Bok, "Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions," Journal of Electronic Packaging, vol. 127 no. 3, pp. 237-244, Sept. 2005.

Park, Y. B., and Yu, Jin, "A Fracture Mechanics Analysis of the Popcorn Cracking in the Plastic IC Packages," Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, Oct. 13-15, 1997, pp. 12-19.

Park, Yong-Sung, Shin, Ji-Won, Choi, Yong-Won, and Paik, Kyung-Wook, "A Study on the Intermetallic Growth of Fine-pitch Cu pillar/SnAg Solder Bump for 3D-TSV Interconnection," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 2053-2056.

Park, Yong-Sung, Moon, Jeong-Tak, Lee, Young-Woo, Lee, Jae-Hong, and Paik, Kyung-Wook, "Effect of Fine Solder Ball Diameters on Intermetallic Growth of Sn-Ag-Cu Solder at Cu and Ni Pad Finish Interfaces During Thermal Aging," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1870-1877.

Park, Yong-Sung, Kwon, Yong-Min, Son, Ho-Young, Moon, Jeong-Tak, Jeong, Byung-Wook, Kang, Kyung-In, and Paik, Kyung-Wook, "Effect of Sb Addition in Sn-Ag-Cu Solder Balls on the Drop Test Reliability of BGA Packages with Electroless Nickel Immersion Gold (ENIG) Surface Finish," 9th International Conference on Electronic Materials and Packaging , Daejon, Korea, Nov. 19-22, 2007, pp. xx-xx.

Park, Yong-Sung, Kwon, Yong-Min, Moon, Jeong-Tak, Lee, Young-Woo, Lee, Jae-Hong, and Paik, Kyung-Wook, "Effects of Fine Size Lead-Free Solder Ball on the Interfacial Reactions and Joint Reliability," 11th Electronics Packaging Technology Conference , Singapore, Dec. 9-11, 2009, pp. 321-324.

Park, Yong-Sung, Kwon, Yong-Min, Moon, Jeong-Tak, Lee, Young-Woo, Lee, Jae-Hong, and Paik, Kyung-Wook, "Effects of Fine Size Lead-Free Solder Ball on the Interfacial Reactions and Joint Reliability," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1436-1441.

Park, Young-Bae, Park, Gyu-Tae, Lee, Byeong-Rok, Kim, Jun-Beom, and Son, Kirak, "Solder Volume Effect on Electromigration Failure Mechanism of Cu/Ni/Sn-Ag Microbumps," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 10 no. 10, pp. 1589-1593, Oct. 2020.

Park, Young Jun, and Fray, Derek J., "Recovery of high purity precious metals from printed circuit boards," Journal of Hazardous Materials, vol. 164 no. 2-3, pp. 1152-1158, May 30, 2009.

Parker, D. S., "Case Study: Application of HVOF Sprayed Coatings for Replacement of Chrome Plating on Navy P-3 Aircraft Hydraulic Components and Landing Gear," Proceedings of the 15th International Thermal Spray Conference, Volume 1 , Nice, France, May 25-29, 1998, pp. 243-248.

Parker, David, "The Grand Challenge of sustainability," Manufacturing Engineer, vol. 83 no. 6, pp. 8-9, Dec. 2004/Jan. 2005.

Parker Jr., J. L., and Horton, J. S., "Assembly Performance of Printed Wiring Boards Coated with an Organic Solderability Preservative," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume I, San Jose, CA, Sept. 1-3, 1992, pp. 499-502.

Parker Jr., J. L., Robinson, A. W., Jacobson, J. T., and Horton, J. S., "Performance of Printed Wiring Boards Coated with Imidazole and Assembled in No Clean Processes," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume II, San Jose, CA, Aug. 31-Sept. 2, 1993, pp. 634-637.

Parker Jr., J. L., "Shelf Life and Durability Testing of OSP Coated Printed Wiring Boards," Surface Mount International Proceedings of the Technical Program, San Jose, CA, Aug. 29-31, 1995, pp. 907-912.

Parker, J. Lee, "Introduction of the Immersion Silver Solderability Coating into Production," Proceedings of the Technical Program NEPCON West 2000, Volume 2, Anaheim, CA, Feb. 27-Mar. 2, 2000, pp. 871-874.

Parker, J. Lee, Ray, Urmi, and Lin, Li Tong, "The Flash Gold Surface Finish Technology," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S33-02-1-S33-02-4.

Parker Jr., J. Lee, "The Performance and Attributes of the Immersion Silver Solderability Finish," Proceedings of the Technical Program NEPCON West '99, Volume 1, Anaheim, CA, Feb. 23-25, 1999, pp. 444-448.

Parker Jr., J. Lee, "The Performance and Attributes of the Immersion Silver Solderability Finish," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Parker Jr., J. L., "The Performance and Characteristics of the Imidazole Coating," Surface Mount International Proceedings of the Technical Program, Volume II, San Jose, CA, Sept. 10-12, 1996, pp. 777-779.

Parker Jr., J. Lee, "Performance and Attributes of the Immersion Silver Solderability Finish," Proceedings of the Technical Program NEPCON West '99, Volume 1, Anaheim, CA, Feb. 21-25, 1999, pp. 444-448.

Parker, R. L., Anderson, R. L., and Hardy, S. C., "Growth and Evaporation Kinetics and Surface Diffusion of K and Hg Crystal Whiskers," Applied Physics Letters, vol. 3 no. 6, pp. 93-95, Sept. 15, 1963.

Parker, R. L., and Hardy, S. C., "Vapor-Phase Growth Kinetics of Potassium Whiskers by Field Emission," Journal of Chemical Physics, vol. 37 no. 8, pp. 1606-1609, Oct. 15, 1962.

Parker, Richard, Coyle, Richard, Henshall, Gregory, Smetana, Joe, and Benedetto, Elizabeth, "iNEMI Pb-Free Alloy Characterization Project Report: Part II - Thermal fatigue Results for Two Common Temperature Cycles," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 348-358.

Parker, Richard, "More Than You Needed To Know About Tin Whiskers," SMTA/IMAPS Mini-Symposium, Indianapolis, IN, Apr. 24, 2006.

Parker, Richard D., "The Next No-Lead Hurdle: The Components Supply Chain," CircuiTree , vol. 13 no. 8, pp. xx, Aug. 2000.

Parker, Robert L., and Kushner, Lawrence M., "Growth Rates of Zinc Crystals from the Vapor Phase," Journal of Chemical Physics, vol. 35 no. 4, pp. 1345-1348, Oct. 1961.

Parks, Gregory, Lu, Minhua, Perfecto, Eric, and Cotts, Eric, "Controlling the Sn Grain Morphology of SnAg C4 Solder Bumps," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 690-696.

Parks, Gregory, Arfaei, Babak, Benedict, Michael, Cotts, Eric, Lu, Minhua, and Perfecto, Eric, "The Dependence of the Sn Grain Structure of Pb-free Solder Joints on Composition and Geometry," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 703-709.

Parks, Gregory, Faucett, Austin, Fox, Craig, Smith, Jake, and Cotts, Eric, "The Nucleation of Sn in Undercooled Melts: The Effect of Metal Impurities," JOM, vol. 66 no. 11, pp. 2311-2319, Nov. 2014.

Parquet, Dan T., and Boggs, David W., "Alternatives to HASL: Users Guide for Surface Finishes,"

Parquet, Dan, "Alternatives to Hot Air Solder Leveling (HASL)," IPC Printed Circuits Expo Meeting Proceedings, Boston, MA, Apr. 24-27, 1994, pp. P13-2-1 to P13-2-7.

Parrish, Mel, "Lead Free Solder Process Compatibility," Wiring Harness News , vol. xx no. xx, pp. xx-xx, Nov./Dec. 2002.

Parry, Gareth, Cooke, Paul, Caputo, Antonio, and Turbini, Laura J., "The Effect of Manufacturing Parameters on Board Design for CAF Evaluation," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Parsa, Nitin, and Toonen, Ryan C., "Ferromagnetic Nanowires for Nonreciprocal Millimeter-Wave Applications," IEEE Nanotechnology Magazine, vol. 12 no. 4, pp. 28-35, Dec. 2018.

Parsons, David, "The Environmental Impact of Disposable Versus Re-Chargeable Batteries for Consumer Use," International Journal of Life Cycle Assessment, vol. 12 no. 3, pp. 197-203, May 2007.

Parsons, Jeremy, "Hazard warning!," Engineering Management, vol. 15 no. 2, pp. 34-35, Apr./May 2005.

Parsons, Jeremy, "WEEE'S Hidden Costs," IEE Review, vol. 51 no. 3, pp. 50, Mar. 2005.

Partee, Blaine, "Ask the EMPF Helpline!," empfasis, pp. 4, Aug. 2006.

Partee, Blaine, "Intermetallics in Electronic Soldering," empfasis, pp. xx-xx, June 2004.

Partee, Blaine, "Lead Free Analytical Services," empfasis, pp. xx-xx, Jan. 2005.

Partee, Blaine, "Lead-free Conversion: Surface Finishes," empfasis, pp. xx-xx, Mar. 2006.

Partee, Blaine, "Manufacturer's Corner: Niton XRF Analyzer," empfasis, pp. xx-xx, Mar. 2006.

Partee, Blaine L., "Microstructure Behavior of Lead-free Solder Joints," 2001 Advanced Packaging Technology Conference Proceedings, 2001, pp. xx-xx.

Partee, Blaine, "Tech Tips... Implementing a Lead-Free Evaluation or Certification Test Plan," empfasis, pp. 7, Aug. 2005.

Partee, Blaine, "X-Ray Flourescence in Electronics Manufacturing," empfasis, pp. 4, 6, Sept. 2005.

Partridge, P. G, "Slip band extrusion in fatigued close packed hexagonal metals," Acta Metallurgica, vol. 13 no. 5, pp. 517-525, May 1965.

Paruchuri, Mohan, and Achari, Achyuta, "Effects of Nickel and Copper Additions on Microstructures of Tin-Silver Eutectic Solder," IPC Works '99, Minneapolis, MN, Oct. 23-28, 1999, pp. xx-xx.

Pary, P., Bengoa, J. F., Conconi, M. S., Bruno, S., Zapponi, M., and Egli, W. A., "Influence of organic additives on the behaviour of zinc electroplating from alkaline cyanide-free electrolyte," Transactions of the IMF, vol. 95 no. 2, pp. 83-89, 2017. https://doi.org/10.1080/00202967.2016.1237711

Pascual, Daniel N., and Callender, Steve, "Flip Chip Bonding: Flexible Circuit Devices," Advanced Packaging , vol. xx no. x, pp. xx-xx, Oct. 2004.

Patel, Amit, Raut, Rahul, Pandher, Ranjit, Soydan, Ramazan, Bent, Westin, Bhatkal, Ravi, and Sweitzer, Brent, "Low Temperature Assembly of LED Packages on PET & Polyimide Flexible Substrates," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 167-172.

Patel, Bihari, "Lead-Free Surface Finishes and Assembly," Lead-Free Connection , vol. 2 no. 3, pp. 7-9, Sept. 2005.

Patel, Bihari, "Lead-Free Wave Soldering Factors," Lead-Free Connection, vol. 2 no. 4, pp. 6-7, Dec. 2005.

Patel, Bihari, "Taking Terror out of Lead Free Circuit Board Surface Finishes and Assembly (W-06)," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings, Anaheim, CA, Feb. 8-10, 2006, pp. xx-xx.

Patel, Bihari, "Taking Terror out of Lead Free Surface Finishes and Assembly," IPC/JEDEC 8th International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, W-02.

Patil, Mahesh, "RoHS - A Business Process Rejuvenation," SMTA International Conference , Orlando, FL, Oct. 7-11, 2007, pp. 74-80.

Patnam, Hanumantha Rao, Karunakaran, S., and Swaminathan, Madhavan, "Compact Electromagnetic Bandgap Structure for Noise Suppression in Power Plane," Electrical Design of Advanced Packaging and Systems Symposium , Seoul, Korea, Dec. 10-12, 2008, pp. 13-15.

Pattanaik, Ashit K., Kandan, R., Nagarajan, K., and Rao, P. R. Vasudeva, "Gibbs energies of formation of the intermetallic compounds of U-Sn system," Journal of Alloys and Compounds, vol. 551, pp. 249-254, Feb. 25, 2013.

Pattee, H. E., and Evans, R. M., "The Performance of Some Soft Solders at Elevated Temperatures and Pressures," Symposium on Solder (ASTM Special Technical Publication No. 189), Atlantic City, NJ, June 19-20, 1956, pp. 103-114.

Patterson, Doug, "Ensuring Reliability in Spite of RoHS and WEEE," COTS Journal , pp. xx-xx, July 2008.

Patterson, Doug, "Getting Ready for Round Two of RoHS," COTS Journal, pp. xx-xx, Feb. 2007.

Patterson, Timothy, "The High-Speed, Low-Cost, Lead-Free Challenge for Flip-Chips," Semiconductor International, vol. 28 no. 11, pp. SP-4-SP-8, Oct. 2005.

Patton, Neil, "Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production," IPC Printed Circuits Expo, APEX and the Designer Summit , Anaheim, CA, Feb. 8-10, 2006, pp. S32-03-1-S32-03-5.

Patton, Neil, "Lead/halogen-free laminates and their effect on desmearing and metallization," Circuit World, vol. 33 no. 2, pp. 28-35, 2007.

Patwardhan, V., Kelkar, N., and Nguyen, L., "Lead-Free Wafer Level-Chip Scale Package: Assembly and Reliability," 2002 Proceedings 52nd Electronic Components & Technology Conference , San Diego, CA, May 28-31, 2002, pp. 1355-1358.

Paul, A., and Laurila, T., "Comments on "Effects of current density on the formation and microstructure of Sn-9Zn, Sn-8Zn-3Bi and Sn-3Ag-0.5Cu solder joints"," Intermetallics , vol. 28, pp. 164-165, 2012.

Paul, A., "Comments on "Enhanced growth of the Ni3Sn4 phase at the Sn/Ni interface subjected to strains"," Scripta Materialia, vol. xx no. xx, pp. xx-xx, xxxx.

Paul, A., "Comments on "Room temperature interfacial reactions in electrodeposited Au/Sn couples"," Scripta Materialia, vol. 61 no. 6, pp. 561-563, Sept. 2009.

Paul, A., Ghosh, C., and Boettinger, W. J., "Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 42 no. 4, pp. 952-963, Apr. 2011. https://doi.org/10.1007/s11661-010-0592-9

Paul, A., "Growth mechanism of phases, Kirkendall voids, marker plane position, and indication of the relative mobilities of the species in the interdiffusion zone," Journal of Materials Science: Materials in Electronics, vol. 22 no. 7, pp. 833-837, July 2011.

Paul, Charles W., "How Thermodynamics Drives Wet-out in Adhesive Bonding: Correcting Common Misconceptions," Journal of Adhesion Science and Technology, vol. 22 no. 1, pp. 31-45, Jan. 1, 2008.

Paul, Surajit Kumar, "Effect of twist boundary angle on deformation behavior of <1 0 0> FCC copper nanowires," Computational Materials Science, vol. 150, pp. 24-32, July 2018.

Paul, W., "Brief survey of narrow gap semiconductors, with particular reference to a-Sn and a-Sn-Ge alloys," Semiconductor Science and Technology, vol. 5 no. 3S, pp. S1-S4, Mar. 1990.

Paulasto-Krockel, M., Laurila, T., and Vuorinen, V., "Understanding Materials Compatibility Issues in Electronics Packaging," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 494-499.

Paulo, Von. I. M., Neves-Araujo, J., Revoredo, F. A., and Padron-Hernandez, E., "Magnetization curves of electrodeposited Ni, Fe and Co nanotubes," Materials Letters, vol. 223, pp. 78-81, July 15, 2018.

Paulraj, Prawin, and Armendariz, Norman J., "Lead-free Limits on Reflow," Assembly, vol. 48 no. 2, pp. 70-75, Feb. 2005.

Paulraj, Prawin, and Armendariz, Norman J., "Surface Mount Challenges with Lead-Free Reflow," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 751-756.

Pauls, Douglas, "Process Qualification Using the IPC-B-52 Standard Test Assembly," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S40-02-1-S40-02-39.

Paulus, Wilfred, Abdul Rahman, Irman, Jalar, Azman, Kamil Othman, Norinsan, Ismail, Roslina, Wan Yusoff, Wan Yusmawati, and Abu Bakar, Maria, "The Relationship between XRD Peak Intensity and Mechanical Properties of Irradiated Lead-Free Solder," Materials Science Forum, vol. 888, pp. 423-427, Mar. 2017.

Pavlov, Michael, Bratin, Peter, Shalyt, Eugene, Andrae, Karsten Andrae, Lin, Chenting, and Wee, Tien Ai, "Non-invasive Solderability Tests for Lead-Free Packaging," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Paw, Witold, Nable, Jun, and Swanson, John, ""Behind the Scenes" of Effective OSP Protection in Pb-Free Processing," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S19:02.

Pawelkiewicz, Magdalena, Danielewski, Marek, and Janczak-Rusch, Jolanta, "Intermetallic Layer Growth Kinetics in Sn-Ag-Cu System using Diffusion Multiple and Reflow Techniques," Advanced Engineering Materials, vol. xx no. x, pp. xx-xx, xxxx.

Pazdan, Emilie, "Roy Metal Finishing: A Different Drive," Products Finishing, vol. xx no. x, pp. 66-71, Nov. 1995.

Pea, M., Ercolani, D., Li, A., Gemmi, M., Rossi, F., Beltram, F., and Sorba, L., "Suppression of lateral growth in InAs/InAsSb heterostructured nanowires," Journal of Crystal Growth, vol. 366, pp. 8-14, Mar. 1, 2013.

Peach, Milton O., "Mechanism of Growth of Whiskers on Cadmium," Journal of Applied Physics , vol. 23 no. 12, pp. 1401-1403, Dec. 1952.

Pearl, Adam, Osterman, Michael, and Pecht, Michael, "Evaluation of ENEPIG and Immersion Silver Surface Finishes Under Drop Loading," Journal of Electronic Materials, vol. 45 no. 1, pp. 391-402, Jan. 2016.

Pearl, Adam, and Osterman, Michael, "Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions," Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 1, Burlingame, CA, July 16-18, 2013, pp. V001T07A018-1-V001T07A018-7.

Pearlstein, Fred, and Lindsay, James H., "Selection & Application of Inorganic Finishes: Barrier Layer Protective Metal Deposits," Plating & Surface Finishing, vol. 88 no. 5, pp. 8-10, 12, May 2001.

Pearlstein, Fred, and Lindsay, James H., "Selection & Applications of Inorganic Finishes: Chromate Coatings," Plating & Surface Finishing, vol. 89 no. 12, pp. 10-13, Dec. 2002.

Pearlstein, Fred, and Lindsay, James H., "Selection & Applications of Inorganic Finishes: Metal Deposits," Plating & Surface Finishing, vol. 90 no. 2, pp. 8-12, Feb. 2003.

Pearlstein, Fred, and Lindsay, James H., "Selection & Application of Inorganic Finishes: Metal Deposits for Specialized Characteristics - Part I," Plating & Surface Finishing , vol. 88 no. 6, pp. 10-12, June 2001.

Pearlstein, Fred, and Lindsay, James H., "Selection & Application of Inorganic Finishes: Metal Deposits for Specialized Characteristics - Part II," Plating & Surface Finishing , vol. 88 no. 7, pp. 14-16, July 2001.

Pearlstein, Fred, "Selection and Application of Inorganic Finishes Part II - Chromate Coatings," Plating and Surface Finishing, vol. 66 no. 1, pp. 30-34, Jan. 1979.

Pearlstein, Fred, and Agarwala, Vinod S., "Trivalent Chromium Solutions For Applying Chemical Conversion Coatings To Aluminum Alloys or for Sealing Anodized Aluminum," Plating & Surface Finishing, vol. 81 no. 7, pp. 50-55, July 1994.

Pearson, T., and Long, E., "Electrodeposition from Trivalent Chromium Electrolytes," Transactions of the Institute of Metal Finishing, vol. 76 no. 6, pp. B83-B85, Nov. 1998.

Pearson, Tim, Hillman, David, Wilcoxon, Ross, and Valdez, Onel, "A Case Study: The Influence of QFN Package Construction on Solder Joint Durability," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 14-20.

Pearson, Tim, Hillman, David, Wilcoxon, Ross, O'Neill, Tim, and Seelig, Karl, "Solder Joint Integrity Evaluation of Bottom Terminated Component (BTC) Subjected to Thermal Cycling," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 91-102.

Pearson, Trevor, "President's Address," Transactions of the Institute of Metal Finishing , vol. 83 no. 1, pp. 2-4, Jan. 2005.

Pease, Bob, "Bob's Mailbox," Electronic Design, vol. 53 no. 18, pp. 22, Aug. 18, 2005.

Pease, Bob, "Bob's Mailbox," Electronic Design, vol. 54 no. 20, pp. 20, Sept. 14, 2006.

Pecht, Michael, Shibutani, Tadahiro, and Wu, Lifeng, "A reliability assessment guide for the transition planning to lead-free electronics for companies whose products are RoHS exempted or excluded," Microelectronics Reliability, vol. 62, pp. 113-123, July 2016.

Pecht, Michael, Hillman, Craig, and Rogers, Keith, "Conductive Filament Formation: A Potential Reliability Issue in Laminated Printed Circuit Cards with Hollow Fibers," IEEE/CPMT, vol. 22 no. 1, Jan. 1999, pp. xx-xx.

Pecht, Michael G., "Moisture Sensitivity Characterization of Build-Up Ball Grid Array Substrates," IEEE Transactions on Advanced Packaging, vol. 22 no. 3, pp. 515-523, Aug 1999.

Pecht, Michael, Fukuda, Yuki, and Rajagopal, Subramanian, "The Impact of Lead-Free Legislation Exemptions on the Electronics Industry," IEEE Transactions on Electronics Packaging Manufacturing, vol. 27 no. 4, pp. 221-232, Oct. 2004.

Pecht, Michael, "Tin Whiskers," Circuitnet, July 24, 2006.

Peck, Doug, "Lead-Free Rework: Its Implementation and Lessons Learned (Tutorial T3)," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007.

Peck, Douglas J., "Lead-free Rework: Are You Ready?," Surface Mount Technology (SMT) , vol. 20 no. 2, pp. 48-51, Feb. 2006.

Peck, Douglas J., "Lead-Free Rework: Lessons Learned," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Pecko, Darja, Rozman, Kristina Zuzek, Kostevsek, Nina, Arshad, M. Shahid, Markoli, Bostjan, Samardzija, Zoran, and Kobe, Spomenka, "Electrodeposited hard-magnetic Fe50Pd50 nanowires from an ammonium-citrate-based bath," Journal of Alloys and Compounds, vol. 605, pp. 71-79, Aug. 25, 2014.

Pecko, Darja, Sturm, Saso, Kobe, Spomenka, and Rozman, Kristina Zuzek, "Potentiostatically Electrodeposited Hard-Magnetic Fe-Pd-Based Nanowires," IEEE Transactions on Magnetics, vol. 51 no. 7, pp. 9600204, July 2015.

Pedersen, Thomas G., Fisker, Christian, and Jensen, Rasmus V. S., "Tight-binding parameterization of a-Sn quasiparticle band structure," Journal of Physics and Chemistry of Solids, vol. 71 no. 1, pp. 18-23, Jan. 2010.

Pedigo, A. E., Handwerker, C. A., and Blendell, J. E., "Whiskers, Hillocks, and Film Stress Evolution in Electroplated Sn and Sn-Cu Films," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1498-1504.

Pedigo, Aaron E., "Understanding Fundamental Tin Whisker Growth Mechanisms by Characterizing Film Properties," Tin Whisker Group teleconference, June 9, 2010.

Peel, Max, "Remembering Contact Physics," Connector Specifier, vol. 16 no. 6, pp. xx-xx, June 2000.

Peel, Max, "The World Turned Upside Down," Connector Specifier, pp. 22, Feb. 2006.

Pei, F., Briant, C. L., Kesari, H., Bower, A. F., and Chason, E., "Kinetics of Sn whisker nucleation using thermally induced stress," Scripta Materialia, vol. 93, pp. 16-19, Dec. 15, 2014.

Pei, Fei, Jadhav, Nitin, and Chason, Eric, "Correlating whisker growth and grain structure on Sn-Cu samples by real-time scanning electron microscopy and backscattering diffraction characterization ," Applied Physics Letters, vol. 100 no. 22, pp. 221902-1-221902-4, 2012.

Pei, Fei, and Chason, Eric, "Correlating Whisker/Hillock Growth with Compressive Stress in Sn during Thermal Cycling," Tin Whisker Group Teleconference, May 8, 2013.

Pei, Fei, Jadhav, Nitin, and Chason, Eric, "Correlation Between Surface Morphology Evolution and Grain Structure: Whisker/Hillock Formation in Sn-Cu," JOM, vol. 64 no. 10, pp. 1176-1183, Oct. 2012.

Pei, Fei, and Chason, Eric, "In Situ Measurement of Stress and Whisker/Hillock Density During Thermal Cycling of Sn Layers," Journal of Electronic Materials, vol. 43 no. 1, pp. 80-87, Jan. 2014.

Pei, Fei, Jadhav, Nitin, Buchovecky, Eric, Bower, Allan F., Chason, Eric, Liu, Wenjun, Tischler, Jonathan Z., Ice, Gene E., and Xu, Ruqing, "In-situ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation," Journal of Applied Physics, vol. 119 no. 10, pp. 105302-1-105302-11, Mar. 14, 2016.

Pei, Fei, Bower, Allan F., and Chason, Eric, "Quantifying the Rates of Sn Whisker Growth and Plastic Strain Relaxation Using Thermally-Induced Stress," Journal of Electronic Materials, vol. 45 no. 1, pp. 21-29, Jan. 2016.

Pei, Fei, Jadhav, Nitin, Buchovecky, Eric, Chason, Eric, Bower, Allan, and Kumar, Sharvan, "Real-Time Study of Whisker/Hillock Formation in Sn-Cu Systems by EBSD Characterization," Tin Whisker Group Teleconference, Feb. 22, 2012.

Pei, Fei, Buchovecky, Eric, Bower, Allan, and Chason, Eric, "Stress evolution and whisker growth during thermal cycling of Sn films: A comparison of analytical modeling and experiments," Acta Materialia , vol. 129, pp. 462-473, May 1, 2017.

Pei, L. Z., Tang, Y. H., Chen, Y. W., Guo, C., Zhang, W., and Zhang, Y., "Silicon nanowires grown from silicon monoxide under hydrothermal conditions," Journal of Crystal Growth, vol. 289 no. 2, pp. 423-427, Apr. 1, 2006.

Pei, Lim Sze, Pan, Binghua, Zhang, Hongwen, Ng, Wayne, Wu, Bosgum, Siow, Kim S., Sabne, Sayalee, and Tsuriya, Masahiro, "High-Temperature Pb-Free Die Attach Material Project Phase 1: Survey Result," 2017 International Conference on Electronics Packaging, Yamagata, Japan, Apr. 19-22, 2017, pp. 51-56.

Pei, M., and Qu, J., "Constitutive Modeling of Lead-Free Solders," IEEE/CPMT International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, CA, Mar. 16-18, 2005, pp. 45-49.

Pei, M., and Qu, J., "Constitutive Modeling of Lead-Free Solders," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B, San Francisco, CA, July 17-22, 2005, pp. 1307-1311.

Pei, Min, and Qu, Jianmin, "A Multiscale Modeling Method for the Creep Behavior of SnAg Solder Alloys," Proceedings of the ASME InterPack Conference, Volume 2, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 115-120.

Pei, Min, and Qu, Jianmin, "Constitutive Modeling of Sn/Ag and Sn/Ag/Cu Solder Alloys," 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 118.

Pei, Min, and Qu, Jianmin, "Creep and Fatigue Behavior of SnAg Solders With Lanthanum Doping," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 3, pp. 712-718, Sept. 2008.

Pei, Min, and Qu, Jianmin, "Effect of La Doping on SnAg Solder Microstructure Evolution," Proceedings of the ASME InterPack Conference, Volume 2, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 407-413.

Pei, Min, and Qu, Jianmin, "Effect of Lanthanum Doping on the Microstructure of Tin-Silver Solder Alloys," Journal of Electronic Materials, vol. 37 no. 3, pp. 331-338, Mar. 2008.

Pei, Min, and Qu, Jianmin, "Effect of Rare Earth Elements on Lead-Free Solder Microstructure Evolution," 2007 Proceedings 57th Electronic Components & Technology Conference , Reno, NV, May 29-June 1, 2007, pp. 198-204.

Pei, Min, Fan, Xuejun, and Bhatti, Pardeep K., "Field Condition Reliability Assessment for SnPb and SnAgCu Solder Joints in Power Cycling Including Mini Cycles," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 899-905.

Pei, Min, and Qu, Jianmin, "Hierarchical Modeling of Creep Behavior of SnAg Solder Alloys," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 273-277.

Pei, Min, and Qu, Jianmin, "Hierarchal Modeling of Creep Behavior of SnAg Solder Alloys," Journal of Electronic Packaging, vol. 130 no. 3, pp. 031004-1-031004-6, Sept. 2008.

Pei-Siang, Sharon Lim, Rao, Vempati Srinivasa, Yin, Hnin Wai, Ching, Wai Leong, Kripesh, V., Lee, Charles, Lau, John, Milla, Juan, and Fenner, Andy, "Process Development and Reliability of Microbumps," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 367-372.

Pekay, Joel, "China RoHS: One Year and Counting," Conformity, vol. 13 no. 12, pp. 24,26-27, Dec. 2008.

Pekay, Joel, "China RoHS: One Year and Counting," Conformity 2009 Engineers' Reference Guide, pp. 182-184, 2009.

Pekay, Joel, and Ma, Daniel, "Engineer's Guide: Simplifying China RoHS Compliance," Intertek.

Pelisset, Tiphaine, Karunamurthy, Balamurugan, Otremba, Ralf, and Antretter, Thomas, "Characterization and modeling of the AuCuSn thin solder joint under thermal cycling," 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Ghent, Belgium, Apr. 7-9, 2014, pp. xx-xx.

Pellerin, Cheryl, Booker, Susan M., "Reflections on Hexavalent Chromium," Environmental Health Perspectives , vol. 108 no. 9, pp. A4-2-A407, Sept. 2000.

Peluso, R. F., "Material and Design Considerations for Power Hybrid Packages," Proceedings of the 1983 International Microelectronics Symposium, Philadelphia, PA, Oct. 31-Nov. 2, 1983, pp. 302-306.

Pencea, I., Sfat, C. E., Branzei, M., and Plotog, I., "New approach for measuring the surface tension of SnAgCu305 molten alloy," 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging, Alba Iulia, Romania, Oct. 25-28, 2012, pp. 157-161.

Pendse, R., Cho, C. H., Joshi, M., Kim, K. M., Kim, P., Kim, S. H., Kim, S. S., Lee, H. T., Lee, K., Martin, R., Murphy, A., Pandey, V., and Palar, C., "Low Cost Flip Chip (LCFC): An Innovative Approach for Breakthrough Reduction in Flip Chip Package Cost," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1-9.

Pendse, Rajendra D., Kim, Kyung-Moon, and Tam, Samuel, "A New Flip Chip Packaging Technology for the Mid-Range Application Space," 2002 Proceedings 52nd Electronic Components & Technology Conference , San Diego, CA, May 28-31, 2002, pp. 100-104.

Peng, Changfei, Shen, Jun, Xie, Weidong, Chen, Jie, Wu, Cuiping, and Wang, Xiaochuan, "Influence of minor Ag nano-particles additions on the microstructure of Sn30Bi0.5Cu solder reacted with a Cu substrate," Journal of Materials Science: Materials in Electronics, vol. 22 no. 7, pp. 797-806, July 2011.

Peng, Changfei, Shen, Jun, and Yin, Henggang, "Influences of ZrO2 nano-particles on the microstructures and microhardness of Sn8Zn1Bi-xZrO2/Cu solder joints," Journal of Materials Science: Materials in Electronics, vol. 24 no. 1, pp. 203-210, Jan. 2013.

Peng, Cheng, Huang, Qiang, Wang, Liancheng, and Zhu, Wenhui, "Fatigue analysis of lead-free solder joint under temperature cycling in double-sided cooling power electronics module," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Peng, Chih-Tang, Kuo, Chia-Tai, Chiang, Kuo-Ning, Ku, Terry, and Chang, Kenny, "Experimental Characterization and Mechanical Behavior Analysis on Intermetallic Compounds of 96.5Sn-3.5Ag and 63Sn-37Pb Solder Bump with Ti-Cu-Ni UBM on Copper Chip," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 90-97.

Peng, Chih-Tang, Kuo, Chia-Tai, Chiang, Kuo-Ning, Ku, Terry, and Chang, Kenny, "Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip," Microelectronics Reliability, vol. 46 no. 2-4, pp. 523-534, Feb.-Apr. 2006.

Peng, Chih-Tang, Liu, Chang-Ming, Lin, Ji-Cheng, Cheng, Hsien-Chie, and Chiang, Kuo-Ning, "Reliability Analysis and Design for the Fine-Pitch Flip Chip BGA Packaging," IEEE Transactions on Components and Packaging Technologies, vol. 27 no. 4, pp. 684-693, Dec. 2004.

Peng, Chung-Nan, and Duh, Jenq-Gong, "Mechanical Test after Temperature Cycling on Lead-free Sn-3Ag-0.5Cu Solder Joint," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Peng, Chung-Nan, and Duh, Jenq-Gong, "Reaction Mechanism and Mechanical Properties of the Flip-Chip Sn-3.0Ag-0.5Cu Solder Bump with Cu/Ni-xCu/Ti Underbump Metallization After Various Reflows," Journal of Electronic Materials, vol. 38 no. 12, pp. 2543-2553, Dec. 2009.

Peng, Cong, Chen, Mingxiang, and Liu, Sheng, "Die Bonding of Silicon and Other Materials with Active Solder," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 275-278.

Peng, Cung-Nan, and Duh, Jenq-Gong, "Deformation Characteristics of Sn-3Ag-0.5Cu/Cu/Ni-xCu/Ti Joints after Mechanical Test," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1047-1050.

Peng, Delin, and Liu, Yanfang, "Physical Properties of the Sn-Ag-Cu-In-X (Zn,Bi) Solder alloys," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Peng, Fen, Liu, Wensheng, Huang, Yufeng, Tang, Siwei, Liang, Chaoping, and Ma, Yunzhu, "Effect of stearic acid coating on anti-oxidation property of Sn-Ag-Cu solder powder," Soldering & Surface Mount Technology, vol. 31 no. 1, pp. 68-74, 2019.

Peng, Fen, Liu, Wensheng, Ma, Yunzhu, Liang, Chaoping, Huang, Yufeng, and Tang, Siwei, "Microstructure of Sn-20In-2.8Ag solder and mechanical properties of joint with Cu," Soldering & Surface Mount Technology, vol. 31 no. 1, pp. 1-5, 2019.

Peng, G. W., and Feng, Y. P., "Anomalous strain dependent effective masses in (111) Si nanowires," Applied Physics Letters, vol. 91 no. 8, pp. 083116-1-083116-3, 2007.

Peng, H.-T., Che, C.-S., and Kong, G., "Effect of minor Cu addition on corrosion behavior of Sn-Zn-xCu touch-up solder alloys," Materials and Corrosion, vol. 68 no. 7, pp. 791-798, July 2017.

Peng, Hao, Chen, Guang, Mo, Liping, Chan, Y. C., Wu, Fengshun, and Liu, Hui, "An investigation on the ZnO retained ratio, microstructural evolution, and mechanical properties of ZnO doped Sn3.0Ag0.5Cu composite solder joints," Journal of Materials Science: Materials in Electronics, vol. 27 no. 9, pp. 9083-9093, Sept. 2016.

Peng, Hao, Huang, Bomin, Chen, Guang, Wu, Fengshun, Liu, Hui, and Chan, Y. C., "Effect of 0.8 wt% Al2O3 nanoparticles addition on the microstructures and electromigration behavior of Sn-Ag-Cu solder joint," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 1014-1017.

Peng, Hongjian, Zhou, Jiaolian, Tang, Ding, Lai, Yanqing, Liu, Fangyang, Li, Jie, and Liu, Yexiang, "Preparation and characterization of Bi2Se3 nanowires by electrodeposition," Electrochimica Acta, vol. 56 no. 14, pp. 5085-5089, May 30, 2011.

Peng, Hsin-Ying, and Chen, Chih, "Shape Effect of Passivation Opening on the Electric Behavior in Flip-chip SnAg Solder Joints under Electromigration," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 384-388.

Peng, Hsin-Ying, Chang, Y. W., Liang, Yu-Chun, Chen, Chih, Chang, T. C., Zhan, C. J., and Juang, J. Y., "The Temperature Distribution and the Thermal Behavior in Ultra Fine Pitch Micro SnAg Solder Bump under Current Stressing," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Peng, J., Wang, R. C., Wang, M., and Liu, H. S., "Interfacial Microstructure Evolution and Shear Behavior of Au-Sn/Ni-xCu Joints at 350°C," Journal of Electronic Materials, vol. 46 no. 4, pp. 2021-2029, Apr. 2017.

Peng, J., Wang, R. C., Liu, H. S., and Li, J. Y., "Mechanical reliability of transient liquid phase bonding of Au-Sn solder with Ni(Cu) substrates," Journal of Materials Science: Materials in Electronics, vol. 29 no. 1, pp. 313-322, Jan. 2018.

Peng, J., Wang, R. C., Wang, M., and Liu, H. S., "Microstructure evolution and shear behavior of Au-Sn/Ni-xCo (x=20, 40, 60, and 80 at.%) joints soldered at 350°C," Journal of Materials Science: Materials in Electronics, vol. 28 no. 10, pp. 7286-7291, May 2017.

Peng, Jian, Liu, Huashan, Fu, Liming, and Shan, Aidang, "Multi-principal-element products enhancing Au-Sn-bonded joints," Journal of Alloys and Compounds, vol. 852, pp. 157015-1-157015-12, Jan. 25, 2021. https://doi.org/10.1016/j.jallcom.2020.157015

Peng, Jin, Wu, Fengshun, Liu, Hui, Zhou, Longzao, and Pan, Qilin, "Effects of Thermal Aging on the Electrical Resistance of Sn-3.5Ag Micro SOH Solder Joints," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1023-1026.

Peng, Kui-Qing, and Le, Shuit-Tong, "Silicon Nanowires for Photovoltaic Solar Energy Conversion," Advanced Materials, vol. 23 no. 2, pp. 198-215, Jan. 11, 2011.

Peng, M., Qiao, Z., and Mikula, A., "Comparison between calculated and measured thermodynamic data of liquid (Ag, Au, Cu)-Sn-Zn alloys," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 22 no. 4, pp. 459-468, Dec. 1998.

Peng, Mingfa, Gao, Jing, Zhang, Pingping, Li, Yang, Sun, Xuhui, and Lee, Shuit-Tong, "Reductive Self-Assembling of Ag Nanoparticles on Germanium Nanowires and Their Application in Ultrasensitive Surface-Enhanced Raman Spectroscopy," Chemistry of Materials, vol. 23 no. 14, pp. 3296-3301, July 26, 2011.

Peng, Mou, Xiaoyong, Pan, Dong, Xiang, and Guanghong, Duan, "Regional E-waste Reverse Logistics System Based on PCB Recycling Unit," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 346-350.

Peng, Peng, Li, Xinzhong, Su, Yanqing, Li, Jiangong, Guo, Jingjie, and Fu, Hengzhi, "Dependence of microhardness on solidification processing parameters and dendritic spacing in directionally solidified Sn-Ni peritectic alloys," Journal of Alloys and Compounds, vol. 618, pp. 49-55, Jan. 5, 2015.

Peng, S. P., Wu, W. H., Ho, C. E., and Huang, Y. M., "Comparative study between Sn37Pb and Sn3Ag0.5Cu soldering with Au/Pd/Ni(P) tri-layer structure," Journal of Alloys and Compounds, vol. 493 no. 1-2, pp. 431-437, Mar. 18, 2010.

Peng, S. P., Lin, Dennis, and Ho, C. E., "Comparative Study of Au/Pd/Ni(P) Surface Finish in Eutectic PbSn and Sn3Ag0.5Cu Soldering Systems," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 505-508.

Peng, Tao, Wang, Xuefang, Chen, Mingxiang, Chen, Run, and Liu, Sheng, "Drop Impact Test on High Power Light Emitting Diodes Module," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 928-931.

Peng, Tianlan, and Man, Ruilin, "Rare earth and silane as chromate replacers for corrosion protection on galvanized steel," Journal of Rare Earths, vol. 27 no. 1, pp. 159-163, Feb. 2009.

Peng, Weiqun, "An investigation of Sn pest in pure Sn and Sn-based solders," Microelectronics Reliability, vol. 49 no. 1, pp. 86-91, Jan. 2009.

Peng, Weiqun, and Marques, Marco Elisio, "Effect of Thermal Aging on Drop Performance of Chip Scale Packages with SnAgCu Solder Joints on Cu Pads," Journal of Electronic Materials , vol. 36 no. 12, pp. 1679-1690, Dec. 2007.

Peng, Weiqun, Monlevade, Eduardo, and Marques, Marco E., "Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu," Microelectronics Reliability, vol. 47 no. 12, pp. 2161-2168, Dec. 2007.

Peng, Weiqun, Dunford, Steve, Viswanadham, Puligandla, and Quander, Stephen, "Microstructural and Performance Implications of Gold in Sn-Ag-Cu-Sb Interconnections." 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 809-815.

Peng, Xiao, Tan, Fatang, Wang, Wei, Qiu, Xiaolin, Sun, Fazhe, Qiao, Xueliang, and Chen, Jianguo, "Conductivity improvement of silver flakes filled electrical conductive adhesives via introducing silver-graphene nanocomposites," Journal of Materials Science: Materials in Electronics, vol. 25 no. 3, pp. 1149-1155, Mar. 2014.

Peng, Yih-Rern, Qi, Xiaolong, and Chrisafides, Christos, "The influence of curing systems on epoxide-based PCB laminate performance," Circuit World, vol. 31 no. 4, pp. 14-20, 2005.

Peng, Yong, Wang, Wangang, and Wang, Xiaoping, "Genesis Analysis of Common Defects of Reflow Soldering and Research for Solutions," Advanced Materials Research, vol. 323, pp. 79-83, Aug. 2011.

Penica, John R., and Hilty, Robert D., "Chromate and Cadmium: Use and Alternatives," Tyco Electronics.

Penmatsa, Anand Kannabiran Sreekanth Varma, Ramkumar, S. Manian, and Ghaffarian, Reza, "Effect of Forward & Backward Compatibility of Solder Paste & Component Finish on Fine-Pitch Component Assemblies Using ENIG and ImAg PWB Finishes," Proceedings of the ASME InterPack Conference, Volume 1 , Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 945-952.

Penmecha, Bharat, and Bhattacharya, Kaushik, "Parallel edge cracks due to a phase transformation," International Journal of Solids and Structures, vol. 50 no. 10, pp. 1550-1561, May 15, 2013. https://doi.org/10.1016/j.ijsolstr.2013.01.027

Pennanen, Virpi, and Rusanen, Outi, "Reliability Testing on Flip Chip Joining with Isotropically-Conductive Adhesives," Journal of Electronics Manufacturing, vol. 7 no. 4, pp. 287-292, Dec. 1997.

Pennanen, Virpi, Tammenmaa, Markku, Reinikainen, Tommi, Zhu, Jiansen, and Lin, Wei, "TBGA reliability in telecom environment," Soldering & Surface Mount Technology, vol. 12 no. 2, pp. 42-46, 2000.

Pennebaker, W. B., "Hillock Growth and Stress Relief in Sputtered Au Films," Journal of Applied Physics, vol. 40 no. 1, pp. 394-400, Jan. 1969.

Pennington, Tim, "Aerospace Drives More Calls for Non-Chrome Passivate Finishes," Products Finishing, vol. 76 no. 8, pp. 16-21, May 2012.

Pennington, Tim, "Chromium 6 stays on the market--for now," Products Finishing, vol. 74 no. 10, pp. 8, July 2010.

Pennington, Tim, "Shaving the Whisker Problem," Products Finishing, vol. 74 no. 12, pp. 30-31,33-35, Sept. 2010.

Pennington, Tim, "Slaying the Hard Chrome Dragon," Products Finishing, vol. 74 no. 12, pp. 40-41, Sept. 2010.

Penttila, Minja, and Kujala, Kauppi, "Reliability and Processability of Sn/Ag/Cu Solder Bumped Flip Chip Components On Organic High Density Substrates," The International Journal of Microcircuits and Electronic Packaging, vol. 24 no. 2, pp. 290-303, Second Quarter 2001.

Peo, Marc, and DeAngelo, Don, "Are You Ready for Lead free Reflow?," Surface Mount Technology (SMT), vol. 14 no. 5, pp. 66-70, May 2000.

Pepe, Sam, "Ask the EMPF Helpline!," empfasis, pp. xx-xx, Feb. 2006.

Pepe, Sam, "Catastrophic Failure," empfasis, pp. 4,6, Mar. 2005.

Pepe, Sam, "Cleaning Challenges for the Electronics Industry," empfasis, pp. 5-6, Mar. 2007.

Pepe, Sam, "Reduced Oxide Soldering Activation," empfasis, pp. 7-8, July 2007.

Pepe, Sam, "Solderability Testing and the Transition from Lead to Lead Free Solders," empfasis, pp. xx-xx, Apr. 2004.

Pepe, Sam, "Tech Tips... Black Pad," empfasis, pp. 7, Oct. 2007.

Peppler, Klaus, and Janek, Jurgen, "Template assisted solid state electrochemical growth of silver micro- and nanowires," Electrochimica Acta, vol. 53 no. 2, pp. 319-323, Dec. 1, 2007. https://doi.org/10.1016/j.electacta.2006.12.054

Peranio, N., Leister, E., Tollner, W., Eibl, O., and Nielsch, K., "Single-Crystalline, Stoichiometric Bi2Te3 Nanowires for Transport in the Basal Plane," Journal of Electronic Materials, vol. 41 no. 6, pp. 1509-1512, June 2012.

Perevertailo, V. M., Loginova, O. B., Kazimirov, V. P., and Roik, A. S., "The role of the structure and surface properties of Sn-Ge melts in the germanium crystallization," Materials Science and Engineering: A, vol. xx, no. x, pp. xx-xx, xxxx.

Perez, Dan "Lead Free Control Plan," empfasis, pp. 2, May 2010.

Perez, Martin G., O'Keefe, Matthew J., Colfax, Richard, Vetter, Steve, Murry, Dale, Smith, James, Kleine, David W., and Amick, Patricia, "Vibration Testing of Repaired Lead-Tin/Lead-Free Solder Joints," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1493-1498.

Perez, R. Jerlerud, Toffolon-Masclet, C., Joubert, J.-M., and Sundman, B., "The Zr-Sn binary system: New experimental results and thermodynamic assessment," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 32 no. 3, pp. 593-601, Sept. 2008.

Perez-Belis, V, Bovea, M. D., and Ibanez-Fores, V., "An in-depth literature review of the waste electrical and electronic equipment context: Trends and evolution," Waste Management and Research , vol. 33 no. 1, pp. 3-29, Jan. 2015.

Perez-Belis, V., Bovea, M. D., and Gomez, A., "Waste electric and electronic toys: Management practices and characterisation," Resources, Conservation and Recycling, vol. 77, pp. 1-12, Aug. 2013.

Perez-Bergquist, Alejandro G., Cao, Fang, Perez-Bergquist, Sara J., Lopez, Mike F., Trujillo, Carl P., Cerreta, Ellen K., and Gray III, George T., "The constitutive response of three solder materials," CITE>Journal of Alloys and Compounds, vol. 524, pp. 32-37, May 25, 2012.

Perez-Blanco, Jonathan M., and Barber, Greg D., "Ambient atmosphere bonding of titanium foil to a transparent conductive oxide and anodic growth of titanium dioxide nanotubes," Solar Energy Materials and Solar Cells, vol. 92 no. 9, pp. 997-1002, Sept. 2008.

Perfecto, Eric D., Hawken, David, Longworth, Hai P., Cox, Harry, Srivastava, Kamalesh, Oberson, Valerie, Shah, Jayshree, and Garant, John, "C4NP Technology: Manufacturability, Yields And reliability," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1641-1647.

Perfecto, Eric D., Sundlof, Brian, Srivastava, Kamalesh, and Lu, Minhua, "Chip to Carrier C4 Technology Challenges with Pb-Free Solders," IEEE Custom Integrated Circuits Conference, San Jose, CA, Sept. 21-24, 2008, pp. 81-84.

Perichaud, M. G., Deletage, J. Y., Fremont, H., Danto, Y., Faure, C., and Salagoity, M., "Evaluation of Conductive Adhesives for Industrial SMT Assemblies," Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, Oct. 19-21, 1998, pp. 377-385.

Perichaud, M. G., Deletage, J. Y., Carboni, D., Fremont, H., Danto, Y., and Faure, C., "Thermomechanical Behaviour of Adhesive Jointed SMT Components," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 55-61.

Perkins, Andy, and Sitaraman, Suresh K., "Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages," Microelectronics Reliability, vol. 47 no. 12, pp. 2260-2274, Dec. 2007.

Perng, Steve, Lee, Tae-Kyu, Guirguis, Cherif, and Ibe, Edward S., "Enhancing Mechanical Shock Performance Using Edgebond Technology," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 357-361.

Pernice, Robert F., Hannafin, John J., and Estes, Richard H., "Evaluation of Isotropic Conductive Adhesives for Solder Replacement," Proceedings of the 1994 International Symposium on Microelectronics, Boston, MA, Nov. 15-17, 1994, pp. 561-569.

Perona-Silhol, N., Gambino, M., and Bros, J. P., "Enthalpy of Formation of Liquid Cd+Ga+In+Sn, Cd+Ga+In+Zn, Ga+In+Sn+Zn and Cd+Ga+In+Sn+Zn Alloys," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 16 no. 4, pp. 363-376, Oct.-Dec. 1992.

Perovic, D. D., Snugovsky, L., Rutter, J. W., and Snugovsky, P., "Reactions in the Sn Corner of the Cu-Sn-Zn Alloy System," International Conference on Soldering & Reliability 2010 Proceedings, Toronto, Ontario, Canada, May 17-20, 2010, pp. xx-xx.

Perovic, D. D., Snugovsky, L., Snugovsky, P., and Rutter, J. W., "Reactions in Sn corner of Cu-Sn-Zn alloy system," Materials Science and Technology, vol. 28 no. 1, pp. 120-123, Jan. 2012.

Perovic, D. D., Snugovsky, L., Snugovsky, P., and Rutter, J. W., "The Interaction of Sn-Zn-Al Solder with Copper and ENIG Substrates," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Perovic, Doug, Snugovsky, Leonid, Rutter, John, Snugovsky, Polina, Bagheri, Zohreh, and Meschter, Stephan, "Microstructure and Whisker Growth of SAC Solder Alloys with Rare Earth Additions in Different Environments," International Conference on Soldering & Reliability 2011 Proceedings, Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

Perrett, Tom, "Test Strategy for RoHS Compliance," SMART/LEADOUT Lead-Free Implementation Seminar, Leicestershire, United Kingdom, May 23, 2006.

Perrett, Tom, "The Suggested Route to RoHS Compliance," LEADOUT Controlling a Lead Free Process Workshop, St Albans, United Kingdom, Sept. 7, 2006.

Perry, John, "IPC-7351 Revs Forward," Surface Mount Technology (SMT), vol. 21 no. 6, pp. 18-19, June 2007.

Perry, Tekla S., "Recycling Behind Bars," IEEE Spectrum, vol. 42 no. 6, pp. 10-12, 13, June 2005.

Persson, A. I., Ohlsson, B. J., Jeppesen, S., and Samuelson, L., "Growth mechanisms for GaAs nanowires grown in CBE," Journal of Crystal Growth, vol. 272 no. 1-4, pp. 167-174, Dec. 10, 2004.

Persson, Katrin, Lai, Zonghe, Zribi, Anis, Liu, Johan, and Willander, Magnus, "Effect of Bump Height on Flip-Chip Joint Reliability Using ACA," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 132-136.

Persson, M. P., and Xu, H. Q., "Electronic structure of nanometer-scale GaAs whiskers," Applied Physics Letters, vol. 81 no. 7, pp. 1309-1311, Aug. 12, 2002.

Perton, Marc, "Tin whisker" crisis threatens global electronic systems Jan. 20, 2005.

Petchpong, Patchariya, and Head, David I., "The Effect of Low Level Antimony on the Tin Temperature Fixed Point," International Journal of Thermophysics, vol. xx no. x, pp. xx-xx, xxxx.

Petchsang, Nattasamon, McDonald, Matthew P., Sinks, Louise E., and Kuno, Masaru, "Light Induced Nanowire Assembly: The Electrostatic Alignment of Semiconductor Nanowires into Functional Macroscopic Yarns," Advanced Materials, vol. 25 no. 4, pp. 601-605, Jan. 25, 2013.

Peter, Zsolt, Geczy, Attila, Rigler, Daniel, Ruszinko, Miklos, and Illyefalvi-Vitez, Zsolt, "Evaluation of Solder Joints Formed by Different Vapour Phase Soldering Systems," 2013 36th International Spring Seminar on Electronics Technology, Alba Iulia, Romania, May 8-12, 2013, pp. 167-171.

Peters, Edward N., Fisher, Scott M., Guo, Hua, Degonzague, Carolyn, and Howe, Robert, "Polyphenylene Ether Macromolecules. VI. Halogen Free Flame Retardant Epoxy Resins," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S31_03-1-S31_03-20.

Peters, Laura, "Lead-Free Brings Out Problem of Brittle Fracture," Semiconductor International, vol. 28 no. 11, pp. 38, Oct.2005.

Peterson, Corey, and Kennedy, Jeff, "Heavy Thermal Load Pb-Free Wave Soldering - Getting Top Hole Fillets with +3 Oz. Copper Planes," 2009 Pan Pacific Microelectronics Symposium & Exhibit, Big Island, Hawaii, Feb. 10-12, 2009, pp. 320-330.

Peterson, Michael, "Process and Design Considerations for Performing High Volume Pb Free Flip Chip on Flex Assemblies," 2005 SMTA International Conference Proceedings , Chicago, IL, Sept. 25-29, 2005, pp. 442-448.

Pethuraja, Gopal G., Efstathiadis, Harry, Rouse, Caitlin, Rane-Fondacaro, Manisha V., Sood, Ashok K., and Haldar, Pradeep, "Silicon Nanowire Development for Solar Cell Devices ," 2012 38th IEEE Photovoltaic Specialists Conference, Austin, TX, June 3-8, 2012, pp. 1911-1916.

Petrie, Edward M., "Methods for Improving Electrically and Thermally Conductive Adhesives," Metal Finishing, vol. 106 no. 3, pp. 40-45, Mar. 2008.

Petriko, Bryan, "Hexavalent Chromium: How is it Affecting You?," Industrial Paint & Powder, vol. 82 no. 8, pp. 52-53, Aug. 2006.

Petroff, P. M., Gossard, A. C., Logan, R. A., and Wiegmann, W., "Toward quantum well wires: Fabrication and optical properties", Applied Physics Letters, vol. 41 no. 7, pp. 635-638, Oct. 1, 1982.

Petter, P. M. H., Veit, H. M., and Bernardes, A. M., "Evaluation of gold and silver leaching from printed circuit board of cellphones," Waste Management, vol. 34 no. 2, pp. 475-482, Feb. 2014.

Pettersen, Sigurd R., Kristiansen, Helge, Nagao, Shijo, Helland, Susanne, Njagi, John, Suganuma, Katsuaki, Zhang, Zhiliang, and He, Jianying, "Contact Resistance and Metallurgical Connections Between Silver Coated Polymer Particles in Isotropic Conductive Adhesives," Journal of Electronic Materials, vol. 45 no. 7, pp. 3734-3743, July 2016.

Pettersen, Sigurd R., Redford, Keith, Njagi, John, Kristiansen, Helge, Helland, Susanne, Kalland, Erik, Goia, Dan V., Zhang, Zhiliang, and He, Jianying, "Room-Temperature Curing and Grain Growth at High Humidity in Conductive Adhesives with Ultra-Low Silver Content," Journal of Electronic Materials, vol. 46 no. 7, pp. 4256-4266, July 2017.

Petty-Weeks, Sande, ""Green" Dielectric Implementation in RF Modules," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 968-972.

Petzold, M., Bennemann, S., Graff, A., Krause, M., Muller, M., Wiese, S., and Wolter, K.-J., "Analytical and Mechanical Methods for Material Property Investigations of SnAgCu-Solder," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 376-382.

Pewnim, N., and Roy, S., "Electrodeposition of tin-rich Cu-Sn alloys from a methanesulfonic acid electrolyte," Electrochimica Acta, vol. 90, pp. 498-506, Feb. 15, 2013.

Pfahl, Bob, and Goldsmith, Kurt, "One Month to Go: Are We Ready?," Circuits Assembly, vol. 17 no. 6, pp. 44, June 2006.

Pfahl, Robert, "Green Has to Mean Better," Surface Mount Technology (SMT), vol. 23 no. 4, pp. 20, July/Aug. 2009.

Pfahl, Robert C., and Goldsmith, Kurt R., "One Month to Go: Are We Ready?," Printed Circuit Design and Manufacture, vol. 23 no. 6, pp. 16-17, June 2006.

Pfahl, Robert, "Pb-Free Electronics Overview of the Drivers, R&D, and Status of Implementation," NEMI.

Pfahl Jr., Robert C., "The Environmental Mandate," Circuits Assembly, vol. 16 no. 1, pp. 54-57, Jan. 2005.

Pfahl Jr., Robert C., "The Environmental Mandate," Printed Circuit Design & Manufacturing, vol. 22 no. 1, pp. 14, 16. Jan. 2005.

Pfeifer, Andrew R., and Shaw, George, "Environmentally Friendly Fastener Finishes," Products Finishing , vol. xx no. x, pp. xx-xx, May 2002.

Pfeifer, Andrew R., and Shaw, George, "Environmentally Friendly Fastener Finishes," Products Finishing , vol. 66 no. 8, pp. 58-69, May 2002.

Pfennich, Gerhard, Fockenberger, Harald, Tat, Leow Ching, Ho, Terence, and Shangguan, Dongkai, "Board Design and Process Optimization for Paste-In-Hole Using Lead-Free Solder," Proceedings of the SMTA International Conference, Chicago, IL, Sept. 2004, pp. 757-762.

Pfluke, Karl, and Short, Richard H., "Eliminate Lead-free Wave Soldering," Surface Mount Technology (SMT) , vol. 19 no. 6, pp. 26-28, 30, June 2005.

Pfluke, Karl, Bastow, Eric, and Fenner, Mike, "Pb-Free Solder Alloys and Solder Fabrications," Indium Corporation of Europe.

Pham, Alex, "Deleting Hazardous Waste," LA Times, Jan. 21, 2005.

Phaphon, Kanlaya, Wacharasindhu, Sumrit, and Petsom, Amorn, "Preparation of PEG-rosin derivative for water soluble rosin flux," Soldering & Surface Mount Technology, vol. 28 no. 4, pp. 188-200, 2016.

Phelan, Richard E., "Selective Solders in the Sealing of Automotive Electronics," 2000 International Symposium on Microelectronics, Boston, MA, Sept. 18-20, pp. 112-117.

Phelps, Jon, "Keeping Lead Away from Lead-free During Cleaning," Surface Mount Technology (SMT), vol. 20 no. 4, pp. xx-xx, Apr. 2006.

Philippi, Bastian, Matoy, Kurt, Zechner, Johannes, Kirchlechner, Christoph, and Dehm, Gerhard, "Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics," Scripta Materialia, vol. 123, pp. 38-41, Oct. 2016.

Philippi, Bastian, Matoy, Kurt, Zechner, Johannes, Kirchlechner, Christoph, and Dehm, Gerhard, "Microcantilever Fracture Testing of Intermetallic Cu3Sn in Lead-Free Solder Interconnects," Journal of Electronic Materials, vol. 46 no. 3, pp. 1607-1611, Mar. 2017.

Philippi, Bastian, Kirchlechner, Christoph, Micha, Jean Sebastien, and Dehm, Gerhard, "Size and orientation dependent mechanical behavior of body-centered tetragonal Sn at 0.6 of the melting temperature," Acta Materialia , vol. 115, pp. 76-82, Aug. 15, 2016.

Phillips, Edward H., "Inside Avionics," Aviation Week & Space Technology, vol. 158 no. 22, pp. 51, June 2, 2003.

Phillips, T. E., deHaas, N., Goodwin, P. G., and Benson, R. C., "Silver-Induced Volatile Species Generation from Conductive Die Attach Adhesives," 1992 Proceedings 42nd Electronic Components & Technology Conference, San Diego, CA, May 18-20, 1992, pp. 225-233.

Phillips, Terry E., deHaas, Newman, Goodwin, Phillip G., and Benson, Richard C., "Silver-Induced Volatile Species Generation from Conductive Die Attach Adhesives," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 15 no. 6, pp. 956-963, Dec. 1992.

Phoosekieaw, Phuthanate, and Khunkhao, Sanya, "A Study of No-Clean Pb-free Flux Behavior Weight Change as a Function of Time and Temperature," 2013 10th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology, Krabi, Thailand, May 15-17, 2013, pp. xx-xx.

Phoosekieaw, Phuthanate, and Khunkhao, Sanya, "A Study of Several Board Finish Solderability With Sn-Ag-Cu Under Different Atmospheres," 2012 9th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology, Hua Hin, Thailand, May 16-18, 2012, pp. xx-xx.

Piccoli, S., "A Comparison of Electrical Performance of Conductive Epoxy and Soldered RF Connections in Microwave Hybrid Circuits," 1975 International Microelectronic Symposium, Orlando, FL, Oct. 27-29, 1975, pp. 79-86.

Pierce, David M., Sheppard, Sheri D., and Vianco, Paul T., "A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects," Journal of Electronic Packaging, vol. 131 no. 1, pp. 011008-1-011008-11, Mar. 2009.

Pierce, David M., Sheppard, Sheri D., Fossum, Arlo F., Vianco, Paul T., and Neilsen, Mike K., "Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn-3.9Ag-0.6Cu Lead-Free Solder," Journal of Electronic Packaging, vol. 130 no. 1, pp. 011002-1-011002-10, Mar. 2008.

Pierce, David M., Sheppard, Sheri D., Vianco, Paul T., Regent, Jerome A., and Grazier, J. Mark, "Validation of a General Fatigue Life Prediction Methodology for Sn-Ag-Cu Lead-Free Solder Alloy Interconnects," Journal of Electronic Packaging , vol. 130 no. 1, pp. 011003-1-011003-12, Mar. 2008.

Pietila, Mikko, Makela, Tapio, Levon, Kalle, Kivilahti, Jorma, and Isotalo, Heikko, "Electrically conductive polyaniline adhesive," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 118-120.

Pietrikova, A., Durisin, J., Bazu, M., and Ilian, V., "Influence of Different Methods of Ageing on Microstructure of Solder Joints," Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, Dresden, Germany, May 7-11, 2014, pp. 202-205.

Pietrikova, A., Mach, P., Durisin, J., Livovsky, E., and Urbancik, J., "Microstructure Analysis and Measurement of Nonlinearity of Vapour Phase Reflowed Solder Joints," 31st International Spring Seminar on Electronics Technology, Budapest, Hungary, May 7-11, 2008, pp. 363-366.

Pietrikova, A., and Durisin, J., "Principle of X-Ray Investigation of Solder Alloy," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 170-173.

Pietrikova, Alena, Durisin, Juraj, Urbancik, Jan, and Bansky, Juraj, "Analysis of Intermetallic Compounds in Lead-free Solders," 32nd International Spring Seminar on Electronics Technology, Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.

Pietrikova, Alena, Bednarcik, Jozef, and Durisin, Juraj, "In situ investigation of SnAgCu solder alloy microstructure," Journal of Alloys and Compounds, vol. 509 no. 5, pp. 1550-1553, Feb. 3, 2011.

Pietrikova, Alena, Livovsky, L'ubomir, Urbancik, Jan, and Bucko, Radoslav, "Optimisation of Lead Free Solders Reflow Profile," 29th International Spring Seminar on Electronics Technology, St. Marienthal, Germany, May 10-14, 2006, pp. 459-464.

Pietrikova, Alena, and Durisin, Juraj, "Phase Evolution of Solder Alloys," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 299-302.

Pietrikova, Alena, and Durisin, Juraj, "VPS and Reliability of Solder Joint," 2009 15th International Symposium for Design and Technology of Electronics Packages, Gyula, Hungary, Sept. 17-20, 2009, pp. 395-398.

Pietrzak, K., Grobelny, M., Makowska, K., Sobczak, N., Rudnik, D., Wojciechowski, A., and Sienicki, E., "Structural Aspects of the Behavior of Lead-Free Solder in the Corrosive Solution," Journal of Materials Engineering and Performance, vol. 21 no. 5, pp. 648-654, May 2012.

Pigeon, Kevin, "Considerations for Printing Lead-free Solder Pastes," Surface Mount Technology (SMT), vol. 18 no. 7, pp. 55, July 2004.

Pilbath, Aranka, Felhosi, Ilona, Tolnai, Gyula, and Kalman, Erika, "Application of self-assembly for replacing chromate in corrosion protection of zinc," Journal of Solid State Electrochemistry, vol. 10 no. 9, pp. 721-729, Sept. 2006.

Pilgrim, Steve, "Relays & Environment: First Among Equals," EPN Online, Dec. 2004.

Pillars, Jamin, Susan, Don, Michael, Joseph, Limmer, Stephen, and Yelton, Graham, "Controlling the Direction of Strain Energy Driving Forces Responsible for Whisker Growth," 5th Annual Sn Whisker Symposium, College Park, MD, Sept. 2011, pp. xx-xx. (Sandia Report SAND2011-6490C)

Pillinger, Len, "REACH-Time to Sit up and Take Notice," CircuiTree, vol. 20 no. 12, pp. xx-xx, Dec. 2007.

Pilloni, Martina, Ennas, Guido, Cabras, Valentina, Denotti, Valeria, Kumar, Vijay Bhooshan, Musinu, Anna, Porat, Ze'ev, Scano, Alessandra, and Gedanken, Aharon, "Thermal and structural characterization of ultrasonicated BiSn alloy in the eutectic composition," Journal of Thermal Analysis and Calorimetry , vol. 120 no. 3, pp. 1543-1551, June 2015.

Pin, Queck Kian, Ludwig, Heitzer, and Wei, Yong Wei, "2nd Level Reliability Drop Test Robustness for Wafer Level Packages," 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Melaka, Malaysia, Nov. 30-Dec. 2, 2010, pp. xx-xx.

Pin, S., Fremont, H., and Guedon-Gracia, A., "Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations," Microelectronics Reliability , vol. 76-77, pp. 368-372, Sept. 2017.

Pin, S., Fremont, H., and Gracia, A., "Lead free solder joints characterisation using single lap shear tests," 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Dresden, Germany, Apr. 3-5, 2017, pp. xx-xx.

Pin, S., Fremont, H., and Gracia, A., "Numerical study of thermomechanical fatigue influence of intermetallic compounds in a lead free solder joint," 2016 6th Electronic System-Integration Technology Conference, Grenoble, France, Sept. 13-15, 2016, pp. xx-xx.

Pin, S., Gracia, A., Deletage, J. Y., Fouquet, J., and Fremont, H., "Robustness of BGAs: parametric study of voids' distribution in SAC solder joints," 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Toulouse, France, Apr. 15-18, 2018, pp. xx-xx.

Pinardi, K., Lai, Zonghe, Kang, Yi Lan, Liu, Johan, Liu, Sheng, and Haug, Ralf, "Bump Height Effect on the Reliability and on the Strains Variations of ACA Flip-chip Joints," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 1118-1121.

Pinardi, K., Liu, J., Haug, R., Treutler, C., and Willander, M., "Deformation study of the PCB during the flip chip assembly process by using anisotropically conductive adhesive (ACA) as a bonding agent," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 34-37.

Pinardi, Kuntjoro, Lai, Zonghe, Vogel, Dietmar, Kang, Yi Lan, Liu, Johan, Liu, Sheng, Haug, Ralf, and Willander, Magnus, "Effect of Bump Height on the Strain Variation During the Thermal Cycling Test of ACA Flip-Chip Joints," IEEE Transactions on Components and Packaging Technologies, vol. 23 no. 3, pp. 447-451, Sept. 2000.

Ping, Zhu, ZeYun, Fan, Jie, Lin, Qiang, Liu, GuangRen, Qian, and Ming, Zhou, "Enhancement of leaching copper by electro-oxidation from metal powders of waste printed circuit board," Journal of Hazardous Materials, vol. xxx no. xxx, pp. xx-xx, xxxx.

Pinol, Lesly A., Melngailis, John, Charles, Harry K., Lee, David M., Deacon, Ryan, Coles, George, and Clatterbaugh, Guy, "Influence of Tin Deposition Methods on Tin Whisker Formation," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 12, pp. 2028-2032, Dec. 2011.

Pinsky, David, "A Methodology to Evaluate Tin Whisker Risk Levels," technology today, 2005 Issue 3.

Pinsky, David A., "An updated Application-Specific Tin Whisker Risk Assessment Algorith, and its use within a process compliant to GEIS-STD-0005-2."

Pinsky, David, "Application-Specific Tin Whisker Risk Assessment Algorithm- Update 2010," Tin Whisker Group teleconference, Sept. 22, 2010.

Pinsky, David A., "Enhancements to Current Tin Whisker Risk Assessment Methods."

Pinsky, David A., "How the Aerospace Industry is Facing the Lead-Free Challenge," Aerospace Industries Association, Dec. 2, 2006.

Pinsky, David, "Lead-Free and Supply Chain Management for High Reliability Systems," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. xx-xx.

Pinsky, David, "Lead-Free and Supply Chain Manangement for High Reliability Systems," Tin Whisker Group teleconference, Feb. 13, 2013.

Pinsky, David A., "Lead-Free Reliability challenges and Solutions: Defense OEM Impact," Overcoming the Reliability Challenge: An IPC Summit, Andover, MA, Apr. 15, 2008, pp. xx-xx.

Pinsky, David, Hester, Tom, Touw, Anduin, and Hillman, Dave, "Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin," 7th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Portsmouth, United Kingdom, Apr. 13-14, 2016, pp. xx-xx.

Pinsky, David, Hester, Tom, Touw, Anduin, and Hillman, Dave, "Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow." Tin Whisker Group teleconference, May 18, 2016.

Pinsky, David, Hester, Tom, Touw, Anduin, and Hillman, Dave, "Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin," Surface Mount Technology (SMT), vol. 31 no. 9, pp. 36,38-42,44-45, Sept. 2016.

Pinsky, David, Rafanelli, Tony, and Rollins, Bill, "Partnering with Industry: Transitioning to Lead-Free Electronics," technology today, 2005 Issue 3.

Pinsky, David A., "The role of dissolved hydrogen and other trace impurities on propensity of tin deposits to grow whiskers," Microelectronics Reliability, vol. 48 no. 5, pp. 675-681, May 2008. https://doi.org/10.1016/j.microrel.2008.01.008

Pinsky, David, "Tin Whisker Application Specific Risk Assessment Algorithm," Reliability Analysis Laboratory, 2002.

Pinsky, David, "Tin Whisker Risk Management for High Reliability Systems," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. xx-xx.

Pinsky. David, and Lambert, Elizabeth, "Tin Whisker Risk Mitigation for High-Reliability Systems Integrators and Designers," Reliability Analysis Laboratory.

Pinsky, David, Osterman, Michael, and Ganesan, Sanka, "Tin Whiskering Risk Factors," IEEE Transactions on Components and Packaging Technologies, vol. 27 no. 2, pp. 427-431, June 2004.

Pinsky, David A., "Tin Whiskers: Managing Risks," Overcoming the Reliability Challenge: An IPC Summit, Andover, MA, Apr. 15, 2008, pp. xx-xx.

Piorek, Stanislaw, and Kluk, David, x "Face-off: Destructive vs. Non-destructive Testing," Surface Mount Technology (SMT), vol. 21 no. 4, pp. 27, Apr. 2007.

Piorek, Stanislaw, "Portable X-Ray Fluorescence Analyzer for the First Level Screening of Materials for Prohibited Substances," Proceedings of 2005 International Conference on Asian Green Electronics, Shang Hai, China, Mar. 15-18, 2005, pp. 7-13.

Piorek, Stanislaw, "ROHS v Rays," Assembly, vol. 50 no. 9, pp. xx-xx, Sept. 2007.

Piotrowski, W. L., Larson, D. C., and Beams, J. W., "Plastic Deformation of Spinning Iron Whiskers," Journal of Applied Physics, vol. 37 no. 8, pp. 3153-3156, July 1966.

Pitcher, Graham, "A waste of time?," New Electronics, vol. 36 no. 16, pp. 42-43, Sept. 23, 2003.

Pitcher, Graham, "Coming clean," New Electronics, vol. 40 no. 1, pp. 17-18, Jan. 9, 2007.

Pitcher, Graham, "RoHS confusion," New Electronics, vol. 36 no. 15, pp. 12, Sept. 9, 2003.

Pitcher, Graham, "RoHS efforts ramp in time for deadline," CITE>New Electronics, vol. xx no. x, pp. xx-xx, June 12, 2006.

Pitcher, Graham, "Time's Up," CITE>New Electronics, vol. xx no. x, pp. xx-xx, June 8, 2006.

Pitcher, Graham, "WEEE takes effect from July 2007," CITE>New Electronics, vol. xx no. x, pp. xx-xx, Dec. 12, 2006.

Pitt, Charles H., and Henning, Robert G., "Pressure-Induced Growth of Metal Whiskers," Journal of Applied Physics , vol. 35 no. 2, pp. 459-460, Feb. 1964.

Pitt, K., and Goldspink, G., "Simulated thermal cycling of surface components on FR4 printed wiring boards using standard tin-lead solder," Journal of Materials Science: Materials in Electronics, vol. 15 no. 4, pp. 261-264, Apr. 2004.

Pittroff, Wolfgang, Erbert, Goetz, Beister, Gert, Bugge, Frank, Klein, Achim, Knauer, Arne, Maege, Juergen, Ressel, Peter, Sebastian, Juergen, Staske, Ralf, and Traenkle, Guenther, "Mounting of High Power Laser Diodes on Boron Nitride Heat Sinks Using an Optimized Au/Sn Metallurgy," IEEE Transactions on Advanced Packaging , vol. 24 no. 4, pp. 434-441, Nov. 2001.

Pittroff, W., Erbert, G., Klein, A., Staske, R., Sumpf, B., and Traenkle, G., "Mounting of Laser Bars on Copper Heat Sinks Using Au/Sn Solder and CuW Submounts," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 276-281.

Pizzol, M., Christensen, P., Schmidt, J., and Thomsen, M., "Impacts of "metals" on human health: a comparison between nine different methodologies for Life Cycle Impact Assessment (LCIA)," Journal of Cleaner Production, vol. xx no. xx, pp. xx-xx, xxxx.

Placek, Martin, Dusek, Karel, Busek, David, and Stancu, Cristina, "Temperature Distribution During the Phase Change in the Volume of the Solder Alloy," 2016 39th International Spring Seminar on Electronics Technology , Pilsen, Czech Republic, May 18-22, 2016, pp. 222-225.

Placek, Martin, Dusek, Karel, and Urbanek, Jan, "Whiskers Growth on Thick Tin Layers and Various Types of Surfaces," Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, Dresden, Germany, May 7-11, 2014, pp. 193-197.

Plachy, Jozef, "Cadmium," Minerals Yearbook: Volume I. -- Metals and Minerals , 2003.

Plachy, Josef, "Zinc," Minerals Yearbook: Volume I. -- Metals and Minerals, 2003.

Plante, M. C., and LaPierre, R. R., "Au-assisted growth of GaAs nanowires by gas source molecular beam epitaxy: Tapering, sidewall faceting and crystal structure," Journal of Crystal Growth, vol. 310 no. 2, pp. 356-363, Jan. 15, 2008.

Plante, M. C., and LaPierre, R. R., "Growth mechanisms of GaAs nanowires by gas source molecular beam epitaxy," Journal of Crystal Growth, vol. 286 no. 2, pp. 394-399, Jan. 15, 2006.

Planting, Peter J., "An Approach for Evaluating Epoxy Adhesives for Use in Hybrid Microelectronic Assembly," IEEE Transactions on Parts, Hybrids, and Packaging, vol. PHP-11 no. 4, pp. 305-311, Dec. 1975.

Plapp, Nile, "A Vapor Phase Solution for Curing Conductive Epoxy Adhesives," SMT , vol. 7 no. 8, pp. 46, 49-50, Aug. 1993.

Platt, Sam, and Brantingham, Janice, "OSPs and Real-World Manufacturing," Printed Circuit Fabrication, vol. 21 no. 2, pp. 42-45, Feb. 1998.

Pleister, Sebastian, "Compliance: Put Success Within REACH," Chemical Processing, pp. xx-xx, Nov. 2009.

Plenderleith, H. J., and Organ, R. M., "The Decay and Conservation of Museum Objects of Tin," Studies in Conservation, vol. 1 no. 2, pp. 63-72, June 1953.

Plevachuk, Yu., Sklyarchuk, V., Yakymovych, A., Svec, P., Janickovic, D., and Illekova, E., "Electrical conductivity and viscosity of liquid Sn-Sb-Cu alloys," Journal of Materials Science: Materials in Electronics, vol. 22 no. 6, pp. 631-638, June 2011.

Plevachuk, Yu., Hoyer, W., Kaban, I., Kohler, M., and Novakovic, R., "Experimental study of density, surface tension, and contact angle of Sn-Sb-based alloys for high temperature soldering," Journal of Materials Science, vol. 45 no. 8, pp. 2051-2056, Apr. 2010.

Plevachuk, Yu., Tkach, O., Svec Sr., P., and Svec, P., "Study of Nonequilibrium Solidification Region in Sn96.5Ag3Cu0.5 Alloys with Carbon Nanotube Admixtures by Electrical Resistivity Measurements," Journal of Phase Equilibria and Diffusion, vol. 40 no. 1, pp. 86-92, Feb. 2019.

Plevachuk, Yu., Sklyarchuk, V., Yakymovych, A., Svec, P., Janickovic, D., and Illekova, E., "Thermophysical Properties of Liquid Silver-Bismuth-Tin Alloys," Journal of Materials Engineering and Performance, vol. 21 no. 5, pp. 585-589, May 2012.

Plevachuk, Yu., Sklyarchuk, V., Svec Sr., P., Svec, P., Janickovic, D., Illekova, E., and Yakymovych, A., "Thermophysical structure-sensitive properties of Tin-Zinc alloys," Journal of Materials Science: Materials in Electronics, vol. 28 no. 1, pp. 750-759, Jan. 2017.

Plevachuk, Yuriy, Sklyarchuk, Vasyl, Gerbeth, Gunter, and Eckert, Sven, "Thermophysical properties of liquid tin-bismuth alloys," International Journal of Materials Research, vol. 101 no. 7, pp. 839-844, July 2010.

Plotog, I., Svasta, P., Villain, J., Illyefalvi-Vitez, Z., Pietrikova, A., Branzei, M., Miculescu, F., Constantinescu, D., Balan, C., Cucu, T., and Varzaru, G., "HISOLD 4P Q&R, COST Project for Solder Material Innovations and Solder Joint Properties Assessment," 2009 15th International Symposium for Design and Technology of Electronics Packages, Gyula, Hungary, Sept. 17-20, 2009, pp. 87-92.

Plotog, I., Dumitru, G., Codreanu, N. D., Vasile, A., Branzei, M., Pencea, I., and Tarcolea, M., "Microstructure Comparative Analysis of the Solder Joints Based on SAC/SN100 Soldering Alloy Type Depending on the Cooling Rate," 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging , Alba Iulia, Romania, Oct. 25-28, 2012, pp. 167-172.

Plotog, I., Cucu, T., Mihailescu, B., Varzaru, G., Svasta, P., and Busu, I., "PCBs with Different Core Materials Assembling in Vapor Phase Soldering Technology," 2010 9th International Symposium on Electronics and Telecommunications, Timisoara, Romania, Nov. 11-12, 2010, pp. 421-424.

Plotog, Ioan, Codreanu, Norocel, Svasta, Paul, Cucu, Traian, Turcu, Carmen, Varzaru, Gaudentiu, Lazar, Gheorghe, and Batuca, Alexandru, "Investigations on Assembling of Electronic Packages onto Glass Substrates using Lead-free Technology," 31st International Spring Seminar on Electronics Technology, Budapest, Hungary, May 7-11, 2008, pp. 409-413.

Plotog, Ioan, Varzaru, Gaudentiu, Mihailescu, Bogdan, Branzei, Mihai, Bibis, Adrian, and Cristea, Ionut, "Lead/Lead Free Solder Joints Comparative Shear Tests Function of Working Temperature and Soldering Thermal Profile," 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging, Galati, Romania, Oct. 24-27, 2013, pp. 283-286.

Plotog, Ioan, Varzaru, Gaudentiu, and Svasta, Paul, "Mechanical Test Assessment for Electronic Modules Able to Function in Harsh Conditions," 2010 3rd International Symposium on Electrical and Electronics Engineering, Galati, Romania, Sept. 16-18, 2010, pp. 355-358.

Plotog, Ioan, Branzei, Mihai, Svasta, Paul, Miculescu, Marian, Cucu, Traian, and Thumm, A., "PCBs Thermophysical Properties in Lead-Free Assembling Process Assessment," 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging, Pitesti, Romania, Sept. 23-26, 2010, pp. 29-32.

Plotog, Ioan, Cucu, Traian, Mihailescu, Bogdan, Svasta, Paul, Branzei, Mihai, Tarcolea, Mihai, and Miculescu, Florin, "Solder Joints Properties Assessment in the Terms of 4P Soldering Model," 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging, Timisoara, Romania, Oct. 20-23, 2011, pp. 163-168.

Plotog, Ioan, Svasta, Paul, Cucu, Traian, Vasile, Alexandru, and Marin, Alexandru, "Solder Paste Shelf Life Extending Approach for Prototyping and Small Series Activities," 32nd International Spring Seminar on Electronics Technology , Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.

Plotog, Ioan, Varzaru, Gaudentiu, Turcu, Carmen, Cucu, Traian Cornel, Svasta, Paul, and Codreanu, Norocel Dragos, "VPS Solution for Lead-Free Soldering in EMS Industries," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 121-124.

Plotog, Ioan, Varzaru, Gaudentiu, and Svasta, Paul, "VPS Technology and Applications," 2010 3rd International Symposium on Electrical and Electronics Engineering, Galati, Romania, Sept. 16-18, 2010, pp. 351-354.

Plotog, Ioan, and Vladescu. Marian, "Working Temperatures Influence Over the Solder Joints Properties," Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, Dresden, Germany, May 7-11, 2014, pp. 231-236.

Plumbridge, W. J., "Defects in electronics and their significance for structural integrity," Fatigue and Fracture of Engineering Materials and Structures, vol. 30 no. 5, pp. 432-442, May 2007.

Plumbridge, W. J., and Gagg, C. R., "Effects of strain rate and temperature on the stress-strain response of solder alloys," Journal of Materials Science: Materials in Electronics , vol. 10 no. 5-6, pp. 461-468, July 1999.

Plumbridge, W. J., "Further Observations on Tin Pest Formation in Solder Alloys," Journal of Electronic Materials, vol. 39 no. 4, pp. 433-440, Apr. 2010.

Plumbridge, W. J., "Implementing lead-free solders - The performance aspects," Soldering & Surface Mount Technology, vol. 18 no. 1, pp. 11-18, 2006.

Plumbridge, W. J., "Lead-free solders in Japan (a personal impression)," Soldering & Surface Mount Technology, vol. 12 no. 1, pp. 32-34, 2000.

Plumbridge, W. J., "Long term mechanical reliability with lead-free solders," Soldering & Surface Mount Technology, vol. 16 no. 2, pp. 13-20, 2004.

Plumbridge, W. J., "Materials behaviour and the reliability in performance of solder joints," Soldering & Surface Mount Technology, vol. 11 no. 3, pp. 8-11, 1999.

Plumbridge, W. J., "Recent Observations on Tin Pest Formation in Solder Alloys," Journal of Electronic Materials, vol. 37 no. 2, pp. 218-223, Feb. 2008.

Plumbridge, Bill, "Reliability and Life Prediction (An Overview)," Structural Integrity & Reliability in Lead-Free, United Kingdom, Mar. 25, 2004.

Plumbridge, W. J., "Solders as high temperature engineering materials," Materials at High Temperatures, vol. 17 no. 3, pp. 381-387.

Plumbridge, W. J., and Kariya, Y., "Structural integrity in electronics," Fatigue and Fracture of Engineering Materials and Structures, vol. 27 no. 8, pp. 723-734, Aug. 2004.

Plumbridge, W. J., "The analysis of creep data for solder alloys," Soldering & Surface Mount Technology, vol. 15 no. 1, pp. 26-30, 2003.

Plumbridge, W. J., Gagg, C. R., and Peters, S., "The Creep of Lead-Free Solders at Elevated Temperatures," Journal of Electronic Materials, vol. 30 no. 9, pp. 1178-1183, Sept. 2001.

Plumbridge, Bill, "The Materials Perspective," Structural Integrity & Reliability in Lead-Free, United Kingdom, Mar. 25, 2004.

Plumbridge, W. J., "The Mechanical Behaviour of Solders," Soldering & Surface Mount Technology, vol. 8 no. 1, pp. 27-31, 1996.

Plumbridge, W. J., and Gagg, C. R., "The mechanical properties of lead-containing and lead-free solders - meeting the Environmental Challenge," Proceedings of the Institution of Mechanical Engineers -- Part L -- Journal of Materials: Design & Applications , vol. 214 no. 3, pp. 153-161, Aug. 21, 2000.

Plumbridge, W. J., "Tin pest in electronics?," Circuit World, vol. 33 no. 1, pp. 9-14, 2007.

Plumbridge, W. J., "Tin pest in lead-containing solders," Soldering & Surface Mount Technology, vol. 22 no. 1, pp. 56-57, 2010.

Plumbridge, W. J., "Tin pest issues in lead-free electronic solders," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 307-318, Mar. 2007. https://doi.org/10.1007/s10854-006-9025-3

Plunkert, Patricia A., "Aluminum," Minerals Yearbook: Volume I. -- Metals and Minerals , 2003.

Pocheron, Mickael, Deletage, Jean-Yves, Plano, Bernard, Guedon-Gracia, Alexandrine, and Fremont, Helene, "Assessment of Constitutive Properties of Solder Materials Used in Surface-Mount Devices for Harsh Environment Applications," IEEE Transactions on Device and Materials Reliability, vol. 15 no. 3, pp. 443-457, Sept. 2015.

Podzemsky, Jiri, Urbanek, Jan, and Dusek, Karel, "Shear Strength of Joints Made of Lead-Free Solders," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 84-88.

Podzemsky, Jiri, and Urbanek, Jan, "Test of Wettability of Lead-Free Solders," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 53-56.

Poh, Edith S. W., Zhu, W. H., Zhang, X. R., Wang, C. K., Sun, Anthony Y. S., and Tan, H. B., "Lead-free Solder Material Characterization For Thermo-Mechanical Modeling," International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, Freiburg, Germany, Apr. 20-23, 2008, pp. xx-xx.

Pohjonen, A. S., Parviainen, S., Muranaka, T., and Djurabekova, F., "Dislocation nucleation on a near surface void leading to surface protrusion growth under an external electric field," Journal of Applied Physics , vol. 114 no. x, pp.033519, 2013.

Pohlmann, W., Jacob, A. F., Schaefer, H., and Hennemann, O.-D., "Microstrip-to-Microstrip Interconnects with Conductive Adhesive Bonded Ribbons for Micro- and Millimeterwave Applications," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 101-105.

Poker, D. B., Schubert, J., and Stritzker, B., "Ion-induced Growth of Whiskers on Sn Films, Beam-Solid Interactions and Transient Processes (Materials Research Society Symposia Proceedings, Volume 74), Dec. 1-4, 1986, pp. 529-534.

Polishchuk, V. A., Tomaev, V. V., and Baranov, A. V., "Growth of Metallic Ag Whisker Single Crystals on AgI Films," Journal of Technical Physics (USSR), vol. 59 no. 10, pp. 1476-1481, Oct. 2014. https://doi.org/10.1134/S1063784214100247

Poll, Jerry, "Trends in Fastener Finishing," Products Finishing, vol. xx no. xx, pp. xx-xx, June 9, 2003.

Pollard, Kimberly D., Rector, Allison, and Wheeler, Nichelle, Cleaning: The Forgotten Challenge," Chip Scale Review, vol. 15 no. 1, pp. 22-26, Jan.-Geb. 2011.

Pollard, Kimberly D., Chan, Raymond, and Scheele, Diane, "White Ring Defect Formation in Lead-Free Wafer Level Packaging," 3rd International Wafer Level Packaging Congress, San Jose, CA, Nov. 1-3, 2006, pp. xx-xx.

Pollet, Kris, "Court says European Commission didn't follow the rules for Deca-BDE exemption," EE Times Europe, Apr. 8, 2008.

Pollet, Kris, "REACH update: ChemSec releases Substitute It Now list," Green SupplyLine, Sept. 18, 2008.

Pollock, Andrew, "Inspection of Lead-Free Solder Joints on Printed Circuit Assemblies Using Automated Inspection Techniques," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 560-568.

Polyakova, Marina A., Gulin, Aleksandr E., and Stolyarov, Alexey Yu., "Modeling of White Layer Thickness in Combined Deformational Processing by Drawing with Torsion of High-Carbon Steel Wire," Advanced Engineering Materials, vol. 22 no. 10. pp. 2000070-1-2000070-x, Oct. 2020. https://doi-org.ezproxy.uky.edu/10.1002/adem.202000070

Pommiers, Sebastien, Frayret, Jerome, Castetbon, Alain, and Potin-Gautier, Martine, "Alternative conversion coatings to chromate for the protection of magnesium alloys," Corrosion Science, vol. 84, pp. 135-146, July 2014.

Pongracz, Eva, Yla-Mella, Jenni, Keiski, Riita, Phillips, Paul S., Tanskanen, Pia, and Kaakinen, Juhani, "The Impact of the European Waste Electrical and Electronic Equipment Directive (WEEE): Development of Mobile Phone Recovery Strategies in Finland," Journal of Solid Waste Technology and Management, vol. 31 no. 2, pp. 102-111, May 2005.

Poole, Neil, Toleno, Brian J., and Curie, Mark, "Factors Impacting the Reliability of Ultralow Silver Lead Free Alloys," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 207-214.

Poole, Neil, and Toleno, Brian, "Lead-free manufacturing: the reality is clear; the information is not," eeProductCenter, July 1, 2004.

Poole, Neil, and Toleno, Brian, "Present and Future Solder Technologies," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 9, pp. 32,34,36, Sept. 2010.

Poole, Neil, "The Use of Complex Alloys to Achieve High Reliability Lead Free Solder Joints," International Conference on Soldering & Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.

Poole, Neil, "The Use of Complex Alloys to Achieve High Reliability Lead Free Solder Joints," South East Asia Technical Training Conference on Electronics Assembly Technologies 2016 Proceedings, Penang, Malaysia, Apr, 12-14, 2016, pp. xx-xx.

Poon, Christine, Long, Audrey, and Wang, James, "Halogen free debate on solder paste: IPC classification and application," EMasia, July 2008.

Poon, Christine, Long, Audrey, and Wang, James, "Halogen-Free Debate on Solderpaste: IPC Classification and Application," SMTA China East Technical Conference 2008, Shanghai, China, Apr. 8-10, 2008, pp. xx-xx.

Poon, Christine, Long, Audrey, and Wang, James, "Halogen-Free Debate on Solderpaste: IPC Classification and Application," NEPCON Shanghai 2008, Shanghai, China, Apr. 8-11, 2008, pp. xx-xx.

Poon, N. M., Wu, C. M. Lawrence, Lai, Joseph K. L., and Chan, Y. C., "Residual Shear Strength of Sn-Ag and Sn-Bi Lead-Free SMT Joints After Thermal Shock," IEEE Transactions on Advanced Packaging, vol. 23 no. 4, pp. 708-714, Nov. 2000.

Pope, D. Elaine, and Clifton, Lisa M., "Package Cracking in Plastic Surface Mount Components as a Function of Package Moisture Content and Geometry," Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium, Lake Buena Vista, FL, Oct. 10-12, 1988, pp. 89-92.

Popelar, Scott, Strandjord, Andrew, and Niemet, Bob, "A Compatibility Evaluation of Lead-Based and Lead-Free Solder Alloys in Conjunction with Electroless Nickel/Immersion Gold Flip Chip UBM," Proceedings 2001 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4587), Baltimore, MD, Oct. 9-11, 2001, pp. 575-580.

Popov, Branko N., "Electrodeposition of Alloys and Composites with Superior Corrosion and Electrocatalytic Properties," Plating & Surface Finishing, vol. 91 no. 10, pp. 40-49, Oct. 2004.

Popov, Branko N., Durairajan, A., Krishniyer, A., Haran, B. S., and White, Ralph E., "Electrodeposition of Thin Films of Zn-Ni-X (X = SiO2, P, Ce, Mo) Ternary Alloys Onto Chemically Modified Steel Alloys To Prevent Corrosion & Hydrogen Permeation," 1999 Aerospace/Airline Plating & Metal Finishing Forum, Jacksonville, FL, Apr. 20-22, 1999, pp. 129-145.

Popova, A. V., Odintsov, V. I., Menshov, S. A., Kostitsyna, E. V., Tarasov, V. P., Zhukova, V., Zhukov, A., and Gudoshnikov, S. A., "Continuous control of a resistance in Co-rich amorphous ferromagnetic microwires during DC Joule heating," Intermetallics, vol. 99, pp. 39-43, Aug. 2018.

Pops, Horace, "Processing of wire from antiquity to the future," Wire Journal International, vol. 41 no. 6, pp. 58-66, June 2008.

Porret, C., Devillers, T., Jain, A., Dujardin, R., and Barski, A., "Importance of kinetics effects in the growth of germanium nanowires by vapour-liquid-solid Molecular Beam Epitaxy," Journal of Crystal Growth , vol. 323 no. 1, pp. 334-339, May 15, 2011.

Porth, C. B., and Cahoon, J. R., "Interdiffusion of Bi in Liquid Sn," Journal of Phase Equilibria and Diffusion, vol. 31 no. 2, pp. 149-156, Apr. 2010.

Possin, G. E., "Superconductivity in Nearly One-Dimensional Tin Wires," Physica, vol. 55, pp. 339-343, Oct. 1971. https://doi.org/10.1016/0031-8914(71)90271-0

Postnikov, V. S., Ammer, S. A., Drozhzhin, A. I., and Tatarenkov, A. F., "High-Temperature Plasticity of Germanium Whiskers," Russian Physics Journal, vol. 16 no. 1, pp. 100-101, Jan. 1973.

Pott, Vincent, Moselund, Kirsten Emilie, Bouvet, Didier, De Michielis, Luca, and Ionescu, Adrian Mihai, "Fabrication and Characterization of Gate-All-Around Silicon Nanowires on Bulk Silicon," IEEE Transactions on Nanotechnology, vol. 7 no. 6, pp. 733-744, Nov. 2008.

Potter, H., Griese, H., Middendorf, A., Fotheringham, G., and Reichl, H., "Towards the Re-Use of Electronic Products - Quality Assurance for the Re-Use of Electronics," First International Symposium On Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Feb. 1-4, 1999, pp. 288-292.

Poudineh, Mahla, Sanaee, Zeinab, Gholizadeh, Azam, Soleimani, Samaneh, and Mohajerzadeh, Shamsoddin, "Formation of Highly Ordered Silicon Nanowires by a High-Speed Deep Etching," IEEE Transactions on Nanotechnology, vol. 12 no. 5, pp. 712-718, Sept. 2013.

Pourmajidian, M., Mahmudi, R., Geranmayeh, A. R., Hashemizadeh, S., and Gorgannejad, S., "Effect of Zn and Sb Additions on the Impression Creep Behavior of Lead-Free Sn-3.5Ag Solder Alloy," Journal of Electronic Materials, vol. 45 no. 1, pp. 764-770, Jan. 2016.

Povolotskaya, Evgenia, and Mach, Pavel, "Failure Analysis of Adhesive Joining in Electronics," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 247-252.

Powell, B. E., and Skove, M. J., "A combination of third-order elastic constants of aluminum," Journal of Applied Physics, vol. 53 no. 1, pp. 764-765, Jan. 1982.

Powell, B. E., and Skove, M. J., "Combinations of third-order elastic constants of lead," Journal of Applied Physics, vol. 51 no. 6, pp. 3433-3434, June 1980.

Powell, B. E., and Skove, M. J., "Combinations of Third-Order Elastic Constants of Tin," Physica Status Solidi (a), vol. 9 no. 1, pp. K11-K14, 1972. https://doi-org.ezproxy.uky.edu/10.1002/pssa.2210090150

Powell, B. E., and Skove, M. J., "Combinations of third-order elastic constants of zinc and cadmium," Journal of Applied Physics, vol. 44 no. 2, pp. 666-667, Feb. 1973.

Powell, B. E., and Skove, M. J., "Elastic Strength of Tin Whiskers in Tensile Tests," Journal of Applied Physics, vol. 36 no. 4, pp. 1495-1496, 1965.

Powell, B. E., and Skove, M. J., "Nonlinear elastic effects in bismuth whiskers," Journal of Applied Physics, vol. 54 no. 3, pp. 1636-1638, Mar. 1983.

Powell, Reinhard E., and Ume, I. Charles, "Development of Warpage Measurement System to Simulate Convective Solder Reflow Process," IEEE Transactions on Electronics Packaging Manufacturing, vol. 31 no 1, pp. 83-90, Jan. 2008.

Powell, Scott, and Thorn, William, "United Kingdom: Compliance with the Restriction of the Use of Hazardous Substances (RoHS) Directive," Aug. 2006.

Powers, Claude W. "Bubba", "A Breath of Fresh Air," Global SMT and Packaging, vol. 8 no. 9, pp. 32,34, Sept. 2008.

Powers, Mike, Pan, Jianbiao, Silk, Julie, and Hyland, Patrick, "Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging," Journal of Electronic Materials, vol. 41 no. 2, pp. 224-231, Feb. 2012.

Powers, Tamara A., Singler, T. J., and Clum, J. A., "Role of Tin Content in the Wetting of Cu and Au by Tin-Bismuth Solders," Journal of Electronic Materials, vol. 23 no. 8, pp. 773-778, Aug. 1994.

Powers, Tierney, "RoHS2 Data: A Much Needed Solution for the Medical Industry," Medical Electronics Symposium 2013 Proceedings, Milpitas, CA, Nov. 12-13, 2013, pp. xx-xx.

Pozuelo, Marta, Zhou, Hailong, Lin, Stanley, Lipman, Scott A., Goorsky, Mark S., Hicks, Robert F., and Kodambaka, Suneel, "Self-catalyzed growth of InP/InSb axial nanowire heterostructures," Journal of Crystal Growth, vol. 329 no. 1, pp. 6-11, Aug. 15, 2011.

Pozzo, R. L., Malicsi, A. S., and Iwasaki, I., "Removal of lead from printed circuit board scrap by an electrodissolution-delamination method," Resources, Conservation and Recycling, vol. 5 no. 1, pp. 21-34, Feb. 1991.

Prabhakumar, Ananth, and Constable, J. H., "Characterization of Anisotropic Conducting Adhesive Used as a Flex-to-Card Interconnection," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 580-585.

Prabhu, K. N., and Kumar, G., "Determination of Spread Activation Energy and Assessment of Wetting Behavior of Solders on Metallic Substrates," Journal of Electronic Packaging , vol. 132 no. 4, pp. 041001-1-041001-7, Dec. 2010.

Prabhu, K. N., Deshapande, Parashuram, and Satyanarayan, "Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperature," Materials Science and Engineering: A, vol. 533, pp. 64-70, Jan. 30, 2012.

Pradhan, S. C., Lam, K. Y., and Tay, T. E., "Determination of fracture parameters of laminated thermoplastic composite materials: A finite element approach," International Journal of Adhesion and Adhesives, vol. 20 no. 5, pp. 395-401, Oct. 2000.

Pradhan, Salil, Billaut, Francois, and Gopakumar, Sunil, "Assembly and Reliability Studies on Reworked and Non-reworked QFN Packages," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 321-328.

Prakash, K. H., and Sritharan, T., "Interface Reaction between Copper and Molten Tin-Lead Solders," Acta Materialia, vol. 49 no. 13, pp. 2481-2489, Aug. 1, 2001.

Prakash, K. H., and Sritharan, T., "Textured Growth of Cu/Sn Intermetallic Compounds," Journal of Electronic Materials, vol. 31 no. 11, pp. 1250-1255, Nov. 2002.

Pramanick, S., Brown, D. D., Pham, V., Besser, P., Sanchez, J., Bui, N., and Yue, J. T., "Dependence of Electromigration Failure modes on EM-induced and Thermally-induced Mechanical Stress in Interconnect Lines," AIP Conference Proceedings, vol. 373, pp. 240-247, 1996.

Prasad, K. Arun, Giridhar, P., Ravindran, Visalakshi, and Muralidharan, V. S., "Zinc-cobalt alloy: electrodeposition and characterization," Journal of Solid State Electrochemistry, vol. 6 no. 1, pp. 63-68, Dec. 2001.

Prasad, L. C., Chatterjee, S. K., and Jha, R. K., "Atomic order and interionic pair potentials in Cu-Sn liquid alloys," Journal of Alloys and Compounds, vol. 441 no. 1-2, pp. 43-51, Aug. 30, 2007.

Prasad, L. C., Xie, Y., and Mikula, A., "Lead free solder materials In-Sn-Zn system," Journal of Non-Crystalline Solids, vol. 250-252 part 1, pp. 316-320, Aug. 2, 1999.

Prasad, L. C., and Mikula, A., "Thermodynamics of liquid Al-Sn-Zn alloys and concerned binaries in the light of soldering characteristics," Physica B: Condensed Matter, vol. 373 no. 1, pp. 64-71, Mar 1, 2006.

Prasad, R. V. S., An, Boo Hyun, Shin, Youngmin, Jeon, In Tak, Suh, Jin-Yoo, Kim, Young Keun, and Choi, In-Suk, "Phase dependent magnetic properties of Ni-Au alloy nanowires," Materials Letters, vol. 116, pp. 86-90, Feb. 1, 2014.

Prasad, Ray P., "BGA Void Sources," Surface Mount Technology (SMT), vol. 17 no. 10, pp. xx-xx, Oct. 2003.

Prasad, Ray, "Design and Assembly Challenges of BTCs (Tutorial 8)," SMTA International Conference, Orlando, FL, October 14, 2012.

Prasad, Ray P., "Design and Assembly of BGAs and Voiding Requirements: IPC 7095 B," Surface Mount Technology (SMT), vol. 19 no. 5, pp. 16, May 2005.

Prasad, Ray, "Design for Manufacturing in a Lead Free World (Tutorial 5)," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009.

Prasad, Ray, "Design for Manufacturing in a Lead Free World (Tutorial T5)," SMTA International 2010 Conference, Orlando, FL, Oct. 24-28, 2010,

Prasad, Ray, "Developing a Reflow Profile," Surface Mount Technology (SMT), pp. 86,88-90, May 2020.

Prasad, Ray P., "Focus on Lead-free Defects in the IPC-7095 Revision," Surface Mount Technology (SMT), vol. 19 no. 8, pp. xx-xx, Aug. 2005.

Prasad, Ray, "IPC 7095A: No (A)voiding Its New Data for Ball Grid Arrays," Route , Mar. 2005.

Prasad, Ray, "Laser Technology in the Lead-Free Era," SMART Group Lead-Free Seminar , Shannon, Ireland, May 19, 2005.

Prasad, Ray, "Lead-Free Conundrum ," Lead-Free Magazine, vol. 6, May 2006.

Prasad, Ray P., "Lead-Free Solder," Surface Mount Technology (SMT), vol. 14 no. 1, pp. xx-xx, Jan. 2000.

Prasad, Ray P., "Lead-free Solders and Their Properties," Surface Mount Technology (SMT), vol. 14 no. 2, pp. xx-xx, Feb. 2000.

Prasad, Ray P., "Lead-free Solders and Their Properties," Surface Mount Technology (Special Supplement, SMT), vol. 14 no. 6, pp. 9-10, June 2000.

Prasad, Ray, "Moisture Sensitivity Concerns in PCBs for Lead-free Assemblies," SMT Web Exclusive Article.

Prasad, Ray P., "Part 1: BGA Ball Drop - A Concern in Lead-free Assemblies," Surface Mount Technology (SMT), vol. 19 no. 10, pp. xx-xx, Oct. 2005.

Prasad, Ray P., "Part 1: DfM in a Lead-free World," Surface Mount Technology (SMT) , vol. 20 no. 11, pp. 10, Nov. 2006.

Prasad, Ray P., "Part 1: Lead-free Reflow Profile Development," Surface Mount Technology (SMT), vol. 20 no. 2, pp. xx-xx, Feb. 2006.

Prasad, Ray P., "Part 2: DfM in a Lead-free World," Surface Mount Technology (SMT) , vol. 21 no. 1, pp. 10, Jan. 2007.

Prasad, Ray P., "Part 2: Lead-free Reflow Profile Development," Surface Mount Technology (SMT), vol. 20 no. 5, pp. 12, May 2006.

Prasad, Ray, "Part 3: DfM in a Lead-free World," Surface Mount Technology (SMT) , vol. 21 no. 8, pp. 8, Oct. 2007.

Prasad, Ray, "Selective Automated Laser Assembly," SMT Magazine, vol. xx no. xx. pp. xx-xx, Jan. 2001.

Prasad, Ray, "Some Unresolved Issues in Lead-Free -- Through-hole Soldering and Surface Finish," Lead-Free Magazine.

Prasad, Ray, "Thru-hole Lead-free Soldering and Rework Concerns," SMT Web Exclusive Article.

Prasad, Ray, "Tin/Copper Alloys for Lead-free Reflow? ," Surface Mount Technology (SMT), vol. 22 no. 8, pp. 32, Aug. 2008.

Prasad, Ray, "Troubleshooting SMT Yield Problems in a Lead-Free World (Tutorial 10)," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009.

Prasad, Ray, "Understanding Your Soldering Choices," SMT Web Exclusive Article.

Prasad, Ray, "Vapor Phase Soldering: The Comeback Kid," Surface Mount Technology (SMT), vol. 20 no. 8, pp. 11, Aug. 2006.

Prasad, S. C., and Wooster, W. A., "The Anomalous X-ray Background Scattering from B-Tin," Acta Crystallographica, vol. 9 part 1, pp. 35-37, Jan. 10, 1956.

Prasad, S. C., and Wooster, W. A., "The Study of the Elastic Constants of White Tin by Diffuse X-ray Reflexion," Acta Crystallographica, vol. 8 no. 11, pp. 682-686, Nov. 1955.

Prasad, Swaminath, Carson, Flynn, Kim, G. S., Lee, J. S., Roubaud, Patrick, Henshall, Gregory, Kamath, Sundar, Garcia, Alexander, Herber, Robert, and Bulwith, Ronald, "Board Level Reliability of Lead-Free Packages," 2000 SMTA International Conference Proceedings, Chicago, IL, Sept. 24-28, 2000, pp. xx-xx.

Prasad, Swaminath, Carson, Flynn, Kim, G. S., Lee, J. S., Park, Y. C., Kim, Y. S., and Min, K. S., "Plating Chemical Evaluations and Reliability of Lead-Free Leadframe Packages," 2001 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Feb. 13-15, 2001, pp. xx-xx.

Prasad, Swaminath, Carson, Flynn, Kim, G. S., Lee, J. S., Jeong, T. S., and Kim, Y. S., "Reliability of Lead Free BGA Packages," Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 722-726.

Prasad, Swaminath, "Sn Whiskers Standards Committee: An Overview," IPC 2002, New Orleans, LA, Nov. 7, 2002.

Prasad, Swaminath, "Sn Whiskers Standards Committee Status," Apex 2002, 2002, pp. xx-xx.

Prats, Francisco Serrano, and Kennedy, Jeff, "Implementing Pb-Free Process," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S19-02-1-S19-02-18.

Pratt, Ronald E., and Trumble, Bill, "Process and Material Characterization for Lead-Free Tin-Copper Solder Alloy," 1998 Surface Mount International Conference Proceedings, San Jose, CA, Aug. 23-27, 1998, pp. 589-602.

Pratt, Tom, "Transition to RoHS Compliance Product Reliability & Life Testing," SMART/LEADOUT Lead-Free Implementation Seminar, Leicestershire, United Kingdom, May 23, 2006.

Preece, W. H., "On the Heating Effects of Electric Currents. No. III," Proceedings of the Royal Society of London, vol. 44, pp. 109-111, Apr. 19, 1888.

Preece, William Henry, "On the Heating Effects of Electric Currents," Proceedings of the Royal Society of London, vol. 36, pp. 464-471, Apr. 3, 1884.

Preece, William Henry, "On the Heating Effects of Electric Currents. No. II," Proceedings of the Royal Society of London, vol. 43, pp. 280-295, Dec. 22, 1887.

Preische, David A., "Solar Material Science at Indium Corporation," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 76-78.

Premkumar, Jeromerajan, and Srikanth, Narasimalu, "Moisture Absorption Mechanism in Epoxy Molding Compounds Used in IC Encapsulation," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 60-62.

Premovic, Milena, Du, Yong, Minic, Dusko, Sundman, Bo, Zhang, Cong, Watson, Andy, Manasijevic, Dragan, and Djordjevic, Aleksandar, "Experimental investigation and thermodynamic calculations of the Ag-Ga-Sn phase diagram," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 56, pp. 215-223, Mar. 2017.

Press, Joseph Henry, "Storms from the Sun: The Emerging Science of Space Weather," The National Academies Press, 2002.

Pressman, Aaron, "Galaxy IV Satellite Loss Explained - Tiny Space Crystals Responsible," Aug. 12, 1998.

Preston, J., Sawyer, D., and Procter, M., "A new fire-retardant sheathing concept for UTP data cables and fire-resistant cables," Wire Journal International, vol. 35 no. 9, pp. 93-96, Sept. 2002.

Prestoy, Mike, "Tech Tips: The Reballing Process," empfasis, pp. 4,9, May 2010.

Prete, P., Marzo, F., Paiano, P., Lovergine, N., Salviati, G., Lazzarini, L., and Sekiguchi, T., "Luminescence of GaAs/AlGaAs core-shell nanowires grown by MOVPE using tertiarybutylarsine," Journal of Crystal Growth, vol. 310 no. 23, pp. 5114-5118, Nov. 15, 2008.

Preuss, Andrea, Adolphi, Barbara, and Werner, Wolfgang, "Benetzungsverhalten von eutektischem InSn-Lot," Zeitschrift fur Metallkunde, vol. 85 no. 11, pp. 796-800, Nov. 1994.

Previti, Michael A., Holtzer, Mitch, and Hunsinger, Tom, "Four Ways to Reduce Voids in BGA/CSP Package to Substrate Connections," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 901-908.

Previti, Michael A., Holtzer, Mitch, and Hunsinger, Tom, "Four ways to reduce voids in BGA/CSP package to substrate connections," Global SMT and Packaging, vol. 11 no. 8, pp. 16-18,20,22,24-25, Aug. 2011.

Priban, F., Zednicek, T., Zednicek, S., and Tomasko, J., ""Green" Environmentally Friendly Technology For Tantalum And Niobium Oxide Capacitors," CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. 91-96.

Priban, F., Zednicek, T., Zednicek, S., and Tomasko, J., ""Green" Environmentally Friendly Technology for Tantalum and Niobium Oxide Capacitors," AVX.

Price, D. L., Rowe, J. M., and Nicklow, R. M., "Lattice Dynamics of Grey Tin and Indium Antimonide," Physical Review B , vol. 3 no. 4, pp. 1268-1279, Feb. 15, 1971.

Price, David M., "High Volume Flip Chip on Flex with Conductive Adhesives," Proceedings of the Technical Program NEPCON West '99, Volume 3, Anaheim, CA, Feb. 23-25, 1999, pp. 1502-1508.

Price, J. W., "Chemical Control of Tin-Nickel Plating Solutions by E.D.T.A.," Tin and its Uses, no. 55, pp. 4-5, 1962.

Price, P. B., "Nonbasal Glide in Dislocation-Free Cadmium Crystals. I. The (1011) [1210] System," Journal of Applied Physics, vol. 32 no. 9, pp. 1746-1750, Sept. 1, 1961.

Price, P. B., "Nucleation and Growth of Twins in Dislocation-Free Zinc Crystals," Proceedings of the Royal Society of London, Series A, Mathematical and Physical Sciences, vol. 260 no. 1301, pp. 251-261, Feb. 21, 1961.

Price, P. B., "On Microcreep in Zinc Whiskers," The Philosophical Magazine: A Journal of Theoretical Experimental and Applied Physics, vol. 5 no. 52, pp. 417-419, 1960. https://doi.org/10.1080/14786436008235860

Price, P. B., Vermilyea, D. A., and Webb, M. B., "On the Growth and Properties of Electrolytic Whiskers," Acta Metallurgica, vol. 6 no. 8, pp. 524-531, Aug. 1958.

Price, P. B., "On the Growth of Cadmium Crystals from the Vapour," Philosophical Magazine, 8th Series, vol. 5, pp. 473-484, May 1960. https://doi.org/10.1080/14786436008238299

Price, P. B., "Pyramidal Glide and the Formation and Climb of Dislocation Loops in Nearly Perfect Zinc Crystals," The Philosophical Magazine: A Journal of Theoretical Experimental and Applied Physics, vol. 5 no. 57, pp. 873-886, 1960. https://doi.org/10.1080/14786436008238307

Price, Philip, "Lead-free soldering means changes," Electronics Weekly, Mar. 3, 2005.

Price, Philip, "Respond to legislation and win," Electronics Weekly, Dec. 9, 2004.

Price, Philip, "Taking back the trash," IET Electronics Systems and Software, vol. 3 no. 6, pp. 36-39, Dec. 2005-Jan. 2006.

Primavera, Anthony A., "In-process Reduction/Mitigation of Tin Whiskers by Condensing Vapor Reflow," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 873-880.

Primavera, Anthony, Roberts, Roger, and Subrahmanyan, Ravi, "Medical electronics pose unique challenges," Global SMT and Packaging, vol. 7 no. 7, pp. 10-12, 14, July 2007.

Pringle, Troy, Raghavan, Prasanna, and Malatkar, Pramod, "Solder Joint Reliability of BGA Package under End-User Handling Test Conditions," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 400-406.

Priore, Scott, Ly, Hien, and Prosenik, Doug, "SnPb, Pb-Free, and Backward Compatible Soldering Processes of High-Speed BGA Connectors," 2007 Pan Pacific Microelectronics Symposium & Exhibit , Maui, HI, Jan. 30-Feb. 1, 2007, pp. xx-xx.

Privett, Mark, Toleno, Brian J., Poole, Neil, and Steen, Hector, "Lead Contamination Risks in Lead Free Solder Joints for High Temperature Applications," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 388-393.

Proenca, Mariana P., Sousa, Celia T., Ventura, Joao, Araujo, Joao P., Escrig, Juan, and Vazquez, Manuel, "Crossover Between Magnetic Reversal Modes in Ordered Ni and Co Nanotube Arrays," SPIN, vol. 2 no. 4, pp. 1250014-1-1250014-7, 2012.

Proenca, Mariana P., Sousa, Celia T., Ventura, Joao, Garcia, Javier, Vazquez, Manuel, and Araujo, Joao P., "Identifying weakly-interacting single domain states in Ni nanowire arrays by FORC," Journal of Alloys and Compounds, vol. 699, pp. 421-429, Mar. 30, 2017.

Proost, Joris, Delaey, Luc, D'Haen, Jan, and Maex, Karen, "Plasticity of electromigration-induced hillocking and its effect on the critical length," Journal of Applied Physics, vol. 91 no. 11, pp. 9108-9115, June 1, 2002.

Prophet, Graham, "Guarding against component obsolescence," EDN, vol. 47 no. 25, pp. 63-73, Nov. 14, 2002.

Prophet, Graham, "Make and break: designing for the big crunch," EDN Europe, vol. 49 no. 1, pp. 25, Jan. 2004.

Prophet, Graham, "Resource provides information on lead-free solder technology," EDN , vol. xx no. xx, pp. xx-xx, Aug. 5, 1999.

Protsenko, Gordiienko, V. O., Danilov, F. I., and Kwon, S. C., "Thick Chromium Electrodeposition from Trivalent Chromium Bath Containing Carbamide and Formic Acid," Metal Finishing, vol. 109 no. 4-5, pp. 33-37, June 2011.

Protsenko, V. S., and Danilov, F. I., "Chromium electroplating from trivalent chromium baths as an environmentally friendly alternative to hazardous hexavalent chromium baths: comparative study on advantages and disadvantages," Clean Technologies and Environmental Policy, vol. 16 no. 6, pp. 1201-1206, Aug. 2014.

Protsenko, V. S., Danilov, F. I., Gordiienko, V. O., Kwon, S. C., Kim, M., and Lee, J. Y., "Electrodeposition of hard nanocrystalline chrome from aqueous sulfate trivalent chromium bath," Thin Solid Films, vol. 520 no. 1, pp. 380-383, Oct. 31, 2011.

Protsenko, V., and Danilov, F., "Kinetics and mechanism of chromium electrodeposition from formate and oxalate solutions of Cr(III) compounds," Electrochimica Acta, vol. 54 no. 24, pp. 5666-5672, Oct. 1, 2009.

Prymak, John, and Lai, Ken, "Conductive Polymer Capacitors for Lead Free Processing (260°C)." Arrow Asia Times, July 2005.

Prymak, John, Carter-Berrios, Mary, and Lai, Ken, "Product Status for Pb-Free, RoHS, and Pb-Free Processing (260°C)," Arrow Asia Times, Mar. 2006.

Pryor, Gordon, "WEEE / RoHS Update & EU Project: LEADOUT," SMART Group Ireland Lead-free Seminar, Dublin, Ireland, Oct. 22, 2003.

Przekop, Laura Armstrong, and Kerr, Shawn, "Life Cycle Tools for Future Product Sustainability," 2004 IEEE International Symposium on Electronics & the Environment Conference Record , Scottsdale, AZ, May 10-13, 2004, pp. 23-26.

Pstrus, J., "Early stages of wetting of copper by Sn-Zn eutectic alloy," Journal of Materials Science: Materials in Electronics, vol. 29 no. 24, pp. 20531-20545, Dec. 2018.

Pstrus, Janusz, Fima, Przemyslaw, and Gasior, Wladyslaw, "Surface Tension, Density, and Thermal Expansion of (Bi-Ag)eut-Zn Alloys," Journal of Electronic Materials, vol. 40 no. 12, pp. 2465-2469, Dec. 2011.

Pstrus, Janusz, Fima, Przemyslaw, and Gancarz, Tomasz, "Wetting of Cu and Al by Sn-Zn and Zn-Al Eutectic Alloys," Journal of Materials Engineering and Performance, vol. 21 no. 5, pp. 606-613, May 2012.

Pu, P. K., Lewis, Theron, Cole, Marie, Hoffmeyer, Mark, Shaughnessey, John, Finck, Tom, Stevens, Mark, Fischer, Kari, and Doman, Joe, "Lead-Free Solder Assembly Implementation for a Mid-Range Power Systems Server," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 581-598.

Pu, P. K., Lewis, Theron, Cole, Marie, Hoffmeyer, Mark, Shaughnessy, John, Finck, Tom, Stevens, Mark, Fischer, Kari, and Doman, Joe, "Lead-Free Solder Assembly Implementation for a Mid-Range Power Systems Server," SMTA Journal, vol. 25 no. 1, pp. 11-19, 2012.

Pudas, Marko, Kutilainen, Terho, and Hokka, Jussi, "ALD Coatings Mitigate Tin Whiskers and Upgrade Environmental Durability of Electronic Circuit Boards," 10th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Villepinte, France, May 15-16, 2019, pp. xx-xx.

Pudas, Marko, Kutilainen, Terho, Collander, Paul, Wang, Jing, Ashworth, Mark A., Wilcox, Geoffrey D., and Hokka, Jussi, "Atomic Layer Deposition (ALD) for Tin Whisker Mitigation on Pb-free Surfaces," 7th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Portsmouth, United Kingdom, Apr. 13-14, 2016, pp. xx-xx.

Pudas, Marko, "Atomic Layer Deposition (ALD) for Tin Whisker Mitigation on Pb-free Surfaces (2015-2016)," 8th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Noordwijk, the Netherlands, May 10-12, 2017, pp. xx-xx.

Puechagut, Celine, Laugt, Anne-Marie, Guene, Emmanuelle, and Anisko, Richard, "Solder Paste Corrosivity Assesment: Bono Test," 2015 IEEE 17th Electronics Packaging and Technology Conference, Singapore, Dec. 2-4, 2015, pp. xx-xx.

Puechagut, Celine, Laugt, Anne-Marie, Guene, Emmanuelle, and Anisko, Richard, "Solder Paste Residue Corrosivity Assessment: Bono Test," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S17_03-1-S17_03-9.

Puechagut, Celine, Laugt, Anne-Marie, Guene, Emmanuelle, and Anisko, Richard, "Solder Paste Residue Corrosivity Assessment: Bono Test," 2015 European Microelectronics Packaging Conference, Friedrichshafen, Germany, Sept. 14-16, 2015, pp. xx-xx.

Pun, Kelvin, Islam, M. N., and Ng, Tin Wing, "Comparison between ENA and ENEPIG Surface Finish for High Density TBGA Package," 2014 Electronics System-Integration Technology Conference , Helsinki, Finland, Sept. 16-18, 2014, pp. xx-xx.

Pun, Kevin, Eu, Poh Leng, Islam, M. N., and Cui, C. Q., "Effect of Ni Layer Thickness on Intermetallic Formation and Mechanical Strength of Sn-Ag-Cu Solder Joint," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 487-493.

Pun, Kelvin, Islam, M. N., and Ng, Tin Wing, "ENEG and ENEPIG Surface Finish for Long Term Solderability," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1-5.

Pun, Kelvin P. L., Islam, M. N., Rotanson, Jason, Cheung, Chee-Wah, and Chan, Alan H. S., "Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection," Journal of Electronic Materials , vol. 47 no. 9, pp. 5191-5202, Sept. 2018.

Puomi, P., Fagerholm, H. M., and Sopanen, A., "Parameters affecting long-term performance of painted galvanised steels," Anti-Corrosion Methods and Materials, vol. 48 no. 3, pp. 160-170, 2001.

Puomi, P., Fagerholm, H. M., and Sopanen, A., "Parameters affecting long-term performance of painted galvanised steels," Pigment & Resin Technology, vol. 30 no. 6, pp. 363-373, 2001.

Puomi, Paula, and Fagerholm, Heidi M., "Performance of silane treated primed hot-dip galvanised steel," Anti-Corrosion Methods and Materials, vol. 48 no. 1, pp. 7-17, 2001.

Purvis, Dave, "Getting RoHS Ready," Circuits Assembly, vol. 17 no. 7, pp. 34-37, July 2006.

Pustan, David, Wenxin, Zhang, and Wilde, Juergen, "Experimental Damage Analysis and Numerical Reliability Modeling of Lead-Free Ball-Grid-Array Second Level Interconnects," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Putaala, Jussi, Salmela, Olli, Nousiainen, Olli, Kangasvieri, Tero, Vahakangas, Jouko, Uusimaki, Antti, and Lappalainen, Jyrki, "Lifetime prediction and design aspects of reliable lead-free non-collapsible BGA joints in LTCC packages for RF/microwave telecommunication applications," Soldering & Surface Mount Technology, vol. 26 no. 3, pp. xx-xx, 2014.

Puttlitz, Karl J., and Galyon, George T., "Impact of the ROHS directive on high-performance electronic systems Part I: need for lead utilization in exempt systems," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 331-346, Mar. 2007.

Puttlitz, Karl J., and Galyon, George T., "Impact of the ROHS Directive on high-performance electronic systems Part II: key reliability issues preventing the implementation of lead-free solders," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 347-365, Mar. 2007.

Puydinger dos Santos, Marcos V., Lima, Lucas P. B., Diniz, Jose A., and Filho, Jose Godoy, "Fabrication of p-type silicon nanowires for 3D FETs using focused ion beam," Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol. 31 no. 6, pp. 06FA01-06FA01-6, Nov. 2013.

Pye, Maurice, "Alternatives to Decorative Hexavalent Chrome Electrodeposits," Transactions of the Institute of Metal Finishing, vol. 79 no. 5, pp. B83-B84, Sept. 2001.

Pymento, L. G., Davis, W. T., Kim, Ben, and Umpo, Surangkana, "Lead Free Process Development with Thick Multilayer PCBA Density in Server Applications," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Pymento, L., Davis, W. T., and Godown, T., "Mixed Assembly Process Development & Reliability Qualification" 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Pymento, L. G., Davis, W. T., Kelly, Matthew, Cole, Marie, Wilcox, Jim, Krystek, Paul, and Grosskopf, Curtis, "Process Development with Temperature Sensitive Components in Server Applications," CARTS USA 2008 Proceedings, Newport Beach, CA, Mar. 17-20, 2008, pp. xx-xx.

Pymento, L. G., Davis, W. T., Kelly, Matthew, Cole, Marie, Wilcox, Jim, Krystek, Paul, and Grosskopf, Curtis, "Process Development with Temperature Sensitive Components in Server Applications," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S21:03.

Pyrz, William, Vijay, Rohit, Lauterbach, Jochen, Vlachos, Dionisios G., and Buttrey, Douglas J., "Characterization of K-Promoted Ru Catalysts for Ammonia Decomposition Discovered Using High-Throughput Experimentation."

QQQQ

Qasaimeh, Awni, Lu, Susan, and Borgesen, Peter, "Crack Evolution and Rapid Life Assessment for Lead Free Solder Joints," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1283-1290.

Qasaimeh, Awni, Hamasha, Sa'd, Jaradat, Younis, and Borgesen, Peter, "Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue," Journal of Electronic Packaging, vol. 137 no. 2, pp. 021012-1-021012-8, June 2015.

Qasaimeh, Awni, Jaradat, Younis, Wentlent, Luke, Yang, Linlin, Yin, Liang, Arfaei, Babak, and Borgesen, Peter, "Recrystallization Behavior of Lead Free and Lead Containing Solder in Cycling," 2011 IEEE 61st Electronic Components and Technology Conference , Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1775-1781.

Qi, Fangjuan, and Liu, Jim, "Research on Failure Modes of BGA Assemblies With Lead-Free Solder on Different PCB Materials," Fifth International Conference on Electronic Packaging Technology, Shanghai, China, Oct. 28-30, 2003, pp. 396-400.

Qi, Fangjuan, Huo, Lixing, Ding, Yaping, and Ding, Zhanlai, "Study on the Mechanical Bend Fatigue of Micro-joining Soldered Joint with Lead-free Solder," Key Engineering Materials, vol. 353-358 Part 4, pp. 2573-2576, 2007.

Qi, Fangjuan, Sun, Li, Hou, Zhezhe, Wang, Jianqiang, and Qin, Cha, "The Effects of Ni Nanoparticles Addition on Shear Behavior and Microstructure of Sn-Ag Lead-free Solder," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Qi, Guojun, He, Min, and Chen, Zhong, "Reaction of Sn-Containing Solders with Nickel Based Under Bump Metallizations," Yazawa International Symposium: Metallurgical and Materials Processing: Principles and Techologies: Volume 1: Materials Processing Fundamentals and New Technologies, San Diego, CA, Mar. 2-6, 2003, pp. 1173-1183.

Qi, Haiyu, Osterman, Michael, and Pecht, Michael, "Design of Experiments for Board-Level Solder Joint Reliability of PBGA Package Under Various Manufacturing and Multiple Environmental Loading Conditions," IEEE Transactions on Electronics Packaging Manufacturing , vol. 32 no. 1, pp. 32-40, Jan. 2009.

Qi, Haiyu, Ganesan, Sanka, Wu, Ji, Pecht, Michael, Matkowski, Przemyslaw, and Felba, Jan, "Effects of Printed Circuit Board Materials on Lead-free Interconnect Durability," 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, Oct. 23-26, 2005, pp. 140-144.

Qi, Haiyu, Zhang, Qian, Tinsley, Edwin C., Osterman, Michael, and Pecht, Michael G., "High Cycle Cyclic Torsion Fatigue of PBGA Pb-Free Solder Joints," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 2, pp. 309-314, June 2008.

Qi, Haiyu, Ganesan, Sanka, and Pecht, Michael, "No-fault-found and intermittent failures in electronic products," Microelectronics Reliability, vol. 48 no. 5, pp. 663-674, May 2008.

Qi, Kun, Chen, Xu, and Lu, Guo-Quan, "Effect of interconnection area on shear strength of sintered joint with nano-silver paste," Soldering & Surface Mount Technology, vol. 20 no. 1, pp. 8-12, 2008.

Qi, L. H., Huang, J. H., Zhao, X. K., and Zhang, H., "Microstructure transformation of Sn base solders under isothermal aging and thermal shearing cycling conditions," Materials Science and Technology , vol. 24 no. 10, pp. 1254-1258, Oct. 2008.

Qi, Lihua, Huang, Jihua, Zhao, Xingke, and Zhang, Hua, "Effect of thermal-shearing cycling on Ag3Sn microstructural coarsening in SnAgCu solder," Journal of Alloys and Compounds, vol. 469 no. 1-2, pp. 102-107, Feb. 5, 2009.

Qi, Lihua, Huang, Jihua, Zhao, Xingke, and Zhang, Hua, "Effect of Thermal-Shearing Induced Microstructural Coarsening on SnAgCu Microelectronic Solder," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Qi, Lihua, Huang, Jihua, Li, Hua, Zhao, Xingke, and Zhang, Hua, "Growth Behavior of IMCs and Fracture Forming Mechanism at Sn-Ag-Cu/Cu Interfaces under Thermal-Shearing Cycling Condition," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Qi, Lihua, Huang, Jihua, Zhang, Hua, Zhao, Xingke, Wang, Haitao, and Cheng, Donghai, "Growth Behavior of Intermetallic Compounds at SnAgCu/Ni and Cu Interfaces," Journal of Materials Engineering and Performance, vol. 19 no. 1, pp. 129-134, Feb. 2010.

Qi, Lihua, Huang, Jihua, Niu, Jing, Yang, Long, Feng, Yaorong, Zhao, Xingke, and Zhang, Hua, "Microstructure Changes and Compound Growth Dynamic at Lead-free/Cu Interface under Different Conditions," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1083-1087.

Qi, Lihua, Huang, Jihua, Zhao, Xingke, and Zhang, Hua, "Microstructural Transformation on SnAgCu/Cu Interface Induced by Thermal-shearing Cycling," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 499-505.

Qi, Lihua, Huang, Jihua, Zhang, Jiangang, and Wang, Ye, "Microstructure and Intermetallic Growth at the Sn-Ag-Cu/Ni Interface after Thermal-shearing Cycling," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Qi, Lihua, Huang, Jihua, Li, Hua, Zhao, Xingke, and Zhang, Hua, "Microstructures Transformation in Sn-Base Solders under the Isothermal and Thermal-Shearing Cycling Condition," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Qi, Lin, Zhao, Jie, Wang, Xiu-min, and Wang, Lai, "The effect of Bi on the IMC growth in Sn-3Ag-0.5Cu solder interface during aging process," 2004 International Conference on Business of Electronic Product Reliability and Liability, Shanghai, China, Apr. 27-30, 2004, pp. 42-46.

Qi, Ruijuan, and Cheng, Yan, "Synthesis of Se nanowires at room temperature using selenourea as Se source," Journal of Materials Science: Materials in Electronics, vol. 31 no. 8, pp. 5843-5847, Apr. 2020.

Qi, Siyuan, Vaidhyanathan, Bala, and Hutt, David, "Conventional and microwave-assisted processing of Cu-loaded ICAs for electronic interconnect applications," Journal of Materials Science , vol. 48 no. 20, pp. 7204-7214, Oct. 2013.

Qi, Xiao, Ma, Haoran, Wang, Chen, Shang, Shengyan, Li, Xiaogan, Wang, Yunpeng, and Ma, Haitao, "Electrochemical migration behavior of Sn-based lead-free solder," Journal of Materials Science: Materials in Electronics, vol. 30 no. 15, pp. 14695-14702, Aug. 2019.

Qi, Xiao, Ma, Haoran, Li, Xiaogan, Shang, Shengyan, Wang, Yunpeng, and Ma, Haitao, "Electrochemical Migration behavior of Sn9Zn," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Qi, Xiao, Ma, Haoran, Huang, Ru, Yao, Jinye, Shang, Shengyan, Anil, , Wang, Yunpeng, and Ma, Haitao, "Study on Electrochemical Migration of Sn-0.7Cu," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 387-390.

Qi, Xueli, Zhou, Bin, and En, Yunfei, "Effect of Solder Joint Parameter on Vibration Fatigue Reliability of High Density PCB Assembly," 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, Xi'an, China, June 17-19, 2011, pp. 514-517.

Qi, Y., Ghorbani, H. R., Spelt, J. K., Snugovsky, P., and Arrowsmith, P., "Accelerated Thermal Cycling of Tin-Lead and Lead-Free Solder Joints," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 735-740.

Qi, Y., Zbrzezny, A. R., Agia, M., Lam, R., Ghorbani, H. R., Snugovsky, P., Perovic, D. D., and Spelt, J. K., "Accelerated Thermal Fatigue of Lead-Free Solder Joints as a Function of Reflow Cooling Rate," Journal of Electronic Materials, vol. 33 no. 12, pp. 1497-1506, Dec. 2004.

Qi, Y., Ghorbani, H. R., and Spelt, J. K., "Applying Life Prediction Models to SnPb and SAC Solder Joints," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Qi, Yan, Lam, Rex, Ghorbani, Hamid R., Snugovsky, Polina, and Spelt, Jan K., "Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints," Microelectronics Reliability, vol. 46 no. 2-4, pp. 574-588, Feb.-Apr. 2006.

Qi, Yan, Ghorbani, Hamid R., and Spelt, Jan K., "Thermal Fatigue of SnPb and SAC Resistor Joints: Analysis of Stress-Strain as a Function of Cycle Parameters," IEEE Transactions on Advanced Packaging, vol. 29 no. 4, pp. 690-700, Nov. 2006.

Qian, M. F., Zhang, X. X., Wei, L. S., Martin, P. G., Sun, J. F., Geng, L., Scott, T. B., Panina, L. V., and Peng, H. X., "Microstructural evolution of Ni-Mn-Ga microwires during the melt-extraction process," Journal of Alloys and Compounds, vol. 660, pp. 244-251, Mar. 5, 2016.

Qian, Richard, Liu, Yong, Kim, Jihwan, and Martin, Stephen, "Board Level Flat and Vertical Drop Impact Reliability for Wafer Level Chip Scale Package," 2011 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Linz, Austria, Apr. 18-20, 2011, pp. xx-xx.

Qian, Yuhan, Han, Jing, Ma, Limin, Wang, Yishu, and Guo, Fu, "Inhomogeneous Evolution of Microscopic Structure and Crystal Orientation in Sn3Ag0.5Cu under Tensile Stress," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 669-673.

Qian, Zhaoxia, and Park, So-Jung, "Silver Seeds and Aromatic Surfactants Facilitate the Growth of Anisotropic Metal Nanoparticles: Gold Triangular Nanoprisms and Ultrathin Nanowires," Chemistry of Materials, vol. 26 no. 21, pp. 6172-6177, Nov. 11, 2014.

Qiang, Lei, and Huang, Zaixing, "A physical model and analysis for whisker growth caused by chemical intermetallic reaction," Microelectronics Reliability, vol. 54 no. 11, pp. 2494-2500, Nov. 2014.

Qiang, Wang, Lihua, Liang, Xuefan, Chen, Xiaohong, Weng, Liu, Yong, Irving, Scott, and Luk, Timwah, "Experimental Determination and Modification of Anand Model Constants for Pb-Free Material 95.5Sn4.0Ag0.5Cu," Proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, London, England, Apr. 15-18, 2007, pp. xx-xx.

Qiang, Wen, Xunping, Li, and Guoyuan, Li, "Effect of Pb Content on Thermal Fatigue Life of Mixed SnAgCu-SnPb Solder Joints," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 1369-1372.

Qiang, Zhao, and Zhou, Dejian, "Application of Response Surface Methods in Lead-free Solder Joints of Plastic Ball Grid Array Thermal Fatigue Life Prediction," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 842-845.

Qiao, Chuang, Wang, Mingna, Hao, Long, Jiang, Xiaolin, Liu, Xiahe, Thee, Chowwanonthapunya, and An, Xizhong, "In-situ EIS study on the initial corrosion evolution behavior of SAC305 solder alloy covered with NaCl solution," Journal of Alloys and Compounds, vol. 852, pp. 156953-1-156953-12, Jan. 25, 2021. https://doi.org/10.1016/j.jallcom.2020.156953

Qiao, L., Shougee, A., Albrecht, T., and Fobelets, K., "Oxide-coated silicon nanowire array capacitor electrodes in room temperature ionic liquid," Electrochimica Acta, vol. 210, pp. 32-37, Aug. 20, 2016.

Qiao, Lei, Zuo, Yong, Ma, Limin, Shu, Yutian, and Guo, Fu, "Failure behaviors of Sn-0.3Ag-0.7Cu solder joint under creep and current stressing," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 902-906.

Qiao, Mu, Xian, Aiping, and Shang, Jianku, "Electro-deposition of Sn-Ag Lead-Free Solder by Alkaline Pyrophosphate Bath," Acta Metallurgica Sinica, vol. 40 no. 8, pp. 822-826, Aug. 2004.

Qiao, Yuanyuan, Yu, Fengyun, Ma, Haitao, Zhao, Ning, and Liu, Chunying, "Characteristics of Cu6Sn5 grains formed on different Cu substrates under temperature gradient," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Qiao, Zhi-Yu, Xie, Yun-An, Cao, Zhan-Min, Yuan, Wen-Xia, Sun, Yong, and Qi, Geng-Xin, "Design of lead-free solder alloy and alloy phase diagram calculation," Zhongguo Youse Jinshu Xuebao/The Chinese Journal of Nonferrous Metals, vol. 14 no. 11, pp. 1789-1798, Nov. 2004.

Qin, Fei, Wang, Xiaoliang, and An, Tong, "Effects of aging time on interfacial fracture behaviors of Sn3.5Ag0.5Cu/Cu joints," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 857-860.

Qin, Fei, An, Tong, Chen, Na, and Bai, Jie, "Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates," Journal of Electronic Packaging, vol. 131 no. 3, pp. 031001-1-031001-6, Sept. 2009.

Qin, Grace, Nie, Lei, Toth Jr., Francis, Aspandiar, Raiyo, and Williams, Ian, "Assessing the Impact on Temperature Cycling Reliability of High Levels of Voiding in BGA Solder Joints," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 29-39.

Qin, H. B., Zhang, X. P., Zhou, M. B., Li, X. P., and Mai, Y.-W., "Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints," Microelectronics Reliability, vol. 55 no. 8, pp. 1214-1225, July 2015.

Qin, H. B., Li, W. Y., Zhou, M. B., and Zhang, X. P., "Low cycle fatigue performance of ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints," Microelectronics Reliability , vol. 54 no. 12, pp. 2911-2921, Dec. 2014.

Qin, H. B., Zhang, X. P., Zhou, M. B., Zeng, J. B., and Mai, Y.-W., "Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints," Materials Science and Engineering: A, vol. 617, pp. 14-23, Nov. 3, 2014.

Qin, Hong-Bo, Li, Bin, Li, Xun-Ping, and Zhang, Xin-Ping, "Finite element simulation of fracture behavior of BGA structure solder interconnects," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 991-996.

Qin, Hong-Bo, Li, Bin, and Zhang, Xin-Ping, "Finite Element Simulation of Interfacial Fracture and Impact Behavior at the Interfaces of Microscale Sn-Ag-Cu Solder Interconnects," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 594-600.

Qin, Hong-Bo, Yuwen, Hui-Hui, Zhou, Min-Bo, and Zhang, Xin-Ping, "Influence of Geometry of Microbump Interconnects on Thermal Stress and Fatigue Life of Interconnects in Copper Filled Through Silicon Via Structure," 2013 14th International Conference on Electronic Packaging Technology , Dalian, China, Aug. 11-14, 2013, pp. 1019-1024.

Qin, Hong-Bo, Li, Xun-Ping, and Zhang, Xin-Ping, "Influence of Thickness of Interfacial IMC Layer and Solder Mask Layer on Mechanical Reliability of Micro-Scale BGA Structure Interconnects," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 714-719.

Qin, Hong-Bo, Yue, Wu, Ke, Chang-Bo, Zhou, Min-Bo, Zhang, Xin-Ping, and Li, Bin, "Interaction effect between electromigration and microstructure evolution in BGA structure Cu/Sn-58Bi/Cu solder interconnects," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 587-591.

Qin, Hong-Bo, Li, Bin, Yue, Wu, Ke, Chang-Bo, Zhou, Min-Bo, and Zhang, Xin-Ping, "Interaction Effect between Electromigration and Microstructure Evolution in Cu/Sn-58Bi/Cu Solder Interconnect," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 2249-2254.

Qin, Hong-bo, Yue, Wu, Zhang, Xin-Ping, and Yang, Dao-guo, "Size and geometry effects on the electromigration behavior of flip-chip Sn3.5Ag solder joints," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 651-655.

Qin, Hong-Bo, Li, Xun-Ping, and Zhang, Xin-Ping, "Solder Volume Effects on Fatigue Life of BGA Structure Cu/Sn-3.0Ag-0.5Cu/Cu Interconnects," 2012 14th International Conference on Electronic Materials and Packaging, Hong Kong, Dec. 13-16, 2012, pp. xx-xx.

Qin, Hong-Bo, and Zhang, Xin-Ping, "Three-Dimensional Finite Element Analysis of Mechanical and Fracture Behavior of Micro-Scale BGA Structure Solder Joints Containing Cracks in the Intermetallic Compound Layer," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1244-1249.

Qin, Hongbo, Luan, Xinghe, and Yue, Wu, "Influence of Phase Inhomogeneity on Electromigration Behavior in Cu/Sn-58Bi/Cu Solder Joint," Journal of Electronic Materials, vol. 48 no. 6, pp. 3410-3414, June 2019.

Qin, Rongshan, Luo, Yongkun, Elliott-Bowman, Bernadette, and Omoigiade, Osamudiamen, "Fabrication of nanostructured pearlite steel wires using electropulsing," Materials Science and Technology, vol. 34 no. 1, pp. 29-34, Jan. 2018.

Qin, Wei, Kuang, Tian-feng, Ding, Chao, Lei, Chu-yi, Li, Wang-yun, and Qin, Hong-bo, "Research on the anisotropic mechanical behavior of microscale Sn58Bi solder matrix via finite element simulation," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Qin, X. F., Deng, C. H., Liu, Y., Meng, X. J., Zhang, J. Q., Wang, F., and Xu, X. H., "Magnetization Reversal of High Aspect Ratio Iron Nanowires Grown by Electrodeposition," IEEE Transactions on Magnetics, vol. 48 no. 11, pp. 3136-3139, Nov. 2012.

Qin, Yanli, Li, Fei, Liu, Dequan, Yan, Hengqing, Wang, Jinxiao, and He, Deyan, "The structure and optical properties of silicon nanowires prepared by inductively coupled plasma chemical vapor deposition," Materials Letters , vol. 65 no. 6, pp. 1117-1119, Apr. 15, 2011.

Qin, Yi, Wilcox, G. D., and Liu, Changqing, "Electrodeposition and characterisation of Sn-Ag-Cu solder alloys for flip-chip interconnection," Electrochimica Acta, vol. 56 no. 1, pp. 183-192, Dec. 15, 2010.

Qin, Yi, Wilcox, G. D., and Liu, Changqing, "Electrodeposition of Sn-Ag Solder Alloy for Electronics Interconnection," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 833-837.

Qin, Yi, Liu, Changqing, Wilcox, G. D., Zhao, Kun, and Wang, Changhai, "Electrodeposition of Sn-Ag-Cu Solder Alloy for Electronics Interconnection," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 278-282.

Qin, Yi, Wassay, Abdul, Liu, Changqing, Wilcox, G. D., Zhao, Kun, and Wang, Changhai, "Electrodeposition of Sn-Cu Solder Alloy for Electronics Interconnection," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 772-777.

Qin, Yi, Liu, Changqing, Wilcox, G. D., Zhao, Kun, and Wang, Changhai, "Near-Eutectic Sn-Ag-Cu Solder Bumps Formation for Flip-Chip Interconnection by Electrodeposition," 2010 Proceedings 60th Electronic Components and Technology Conference , Las Vegas, NV, June 1-4, 2010, pp. 144-150.

Qin, Yi, Lin, Jui-Ching, Woertink, Julia, Prange, Jonathan, Montesinos, Pedro Lopez, Lee, Inho, Lee, Yil-Hak, Imanari, Masaaki, Reddington, Erik, Lefebvre, Mark, Dong, Jianwei, Tachikawa, Wataru, and Calvert, Jeffrey, "Reliable Interconnection with Electroplated Cu Pillars and SnAg Solder Caps," International Wafer-Level Packaging Conference 2013 Proceedings, San Jose, CA, Nov. 5-7, 2013, pp. xx-xx.

Qin, Yufei, Wu, Jiang, Zhou, Quan, and Xu, Zhenming, "Quadratic nonlinear models for optimizing electrostatic separation of crushed waste printed circuit boards using response surface methodology," Journal of Hazardous Materials, vol. xxx no. xxx, pp. xx-xx, xxxx.

Qin, Yuxiang, Wang, Yongyao, and Liu, Yi, "Vertically aligned silicon nanowires with rough surface and its NO2 sensing properties," Journal of Materials Science: Materials in Electronics , vol. 27 no. 11, pp. 11319-11324, Nov. 2016.

Qing, Xiangyong, Huang, Mingliang, and Pan, Jianlin, "Effect of [Au]/[Na2SO3] Molar Ratio on Co-electroplating Au-Sn Alloys in Sulfite-based Solution," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 878-881.

Qiu, T., Wu, X. L., Mei, Y. F., Wan, G. J., Chu, Paul K., and Siu, G. G., "From Si nanotubes to nanowires: Synthesis, characterization, and self-assembly," Journal of Crystal Growth, vol. 277 no. 1-4, pp. 143-148, Apr. 15, 2005.

Qiu, Xiao-Feng, Zhu, Jun-Jie, and Chen, Hong-Yuan, "Controllable synthesis of nanocrystalline gold assembled whiskery structures via sonochemical route," Journal of Crystal Growth, vol. 257 no. 3-4, pp. 378-383, Oct. 2003.

Qiu, Yan, Huang, Mingliang, and Wu, Aimin, "Study on the electromigration-induced failure mechanism of Sn-3.0Ag-0.5Cu BGA solder balls," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 524-527.

Qiu, Yu, Hu, Xiaowu, Li, Yulong, and Jiang, Xiongxin, "Interfacial reaction between liquid-state Sn-xBi solder and Co substrate," Journal of Materials Science: Materials in Electronics, vol. 29 no. 11, pp. 9155-9165, June 2018.

Qu, Guoying, Weinman, Craig J., Ghosh, Tanushree, and Flake, John C., "Nonaqueous Halide-Free Flux Reactions with Tin-Based Solders," Journal of Electronic Materials, vol. 44 no. 4, pp. 1144-1150, Apr. 2015.

Qu, Jiangtao, Ringer, Simon, and Zheng, Rongkun, "Atomic-scale tomography of semiconductor nanowires," Materials Science in Semiconductor Processing, vol. 40, pp. 896-909, Dec. 2015.

Qu, L., Zhao, N., Zhao, H. J., Huang, M. L., and Ma, H. T., "In situ study on real-time growth behavior of Cu6Sn5 at Sn/Cu interface during soldering reaction," Scripta Materialia, vol. 72-73, pp. 43-46, Feb. 2014.

Qu, Lin, Zhao, Ning, Ma, Haitao, Zhao, Huijing, and Huang, Mingliang, "In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Soldering Process," Journal of Electronic Materials , vol. 44 no. 1, pp. 467-474, Jan. 2015.

Qu, Lin, Ma, Haitao, Zhao, Huijing, Zhao, Ning, Kunwar, Anil, and Huang, Mingliang, "The nucleation of Ag3Sn and the growth orientation relationships with Cu6Sn5," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 377-381.

Qu, Min, Cao, Tianze, Cui, Yan, Liu, Fengbin, and Jiao, Zhiwei, "Effect of nano-ZnO particles on wettability, interfacial morphology and growth kinetics of Sn-3.0Ag-0.5Cu-xZnO composite solder," Journal of Materials Science: Materials in Electronics, vol. 30 no. 21, pp. 19214-19226, Nov. 2019.

Qu, Xin, Chen, Zhaoyi, Qi, Bo, Lee, Taekoo, and Wang, Jiaji, "Board level drop test and simulation of leaded and lead-free BGA-PCB assembly," Microelectronics Reliability, vol. 47 no. 12, pp. 2197-2204, Dec. 2007.

Quan, Lenora, Frear, Darrel, Grivas, Dennis, and Morris Jr., J. W., "Tensile Behavior of Pb-Sn Solder/Cu Joints," Journal of Electronic Materials, vol. 16 no. 3, pp. 203-208, May 1987.

Quandt, Jessica, "Supplies of Indium, Element Critcal to LCD Production, Continue to Shrink," Information Display, vol. 23 no. 8, pp. 6, Aug. 2007.

Queiruga, D., Benito, J. Gonzalez, and Lannelongue, G., "Evolution of the electronic waste management system in Spain," Journal of Cleaner Production, vol. 24, pp. 56-65, Mar. 2012.

Queiruga, Dolores, Walther, Grit, Gonzalez-Benito, Javier, and Spengler, Thomas, "Evaluation of sites for the location of WEEE recycling plants in Spain," Waste Management, vol. 28 no. 1, pp. 181-190, 2008.

Quinn, Michael, "Optimization of drawing lubricant performance in copper wiredrawing systems," Wire Journal International, vol. 39 no. 8, pp. 67-69, Aug. 2006.

Quinnell, Richard A., "ROHS compliance: It's not easy being green," EDN, vol. 51 no. 6, pp. 37-38, 40, 42, 44, Mar. 16, 2006.

Quinnell, Richard A., "Tackling tin whisker test," Test & Measurement World, vol. 25 no. 8, pp. 79-80, Sept. 2005.

Quinnell, Richard A., "Tackling tin whisker test," Test & Measurement World, vol. 25 no. 8, pp. 79-80, Sept. 2005.

Quinnell, Richard A., "WEEE: No fun for manufacturers," Test & Measurement World , vol. 25 no. 3, pp. xx-xx, Apr. 2005.

Quinnell, Richard A., "Why the surprise?," Test & Measurement World, vol. 25 no. 3, pp. xx-xx, Apr. 2005.

Quintero, Pedro, Oberc, Timothy, and McCluskey, Patrick, "Reliability Assessment of High Temperature Lead-Free Device Attach Technologies," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 2131-2138.

Quintero, Pedro O., and McCluskey, F. Patrick, "Temperature Cycling Reliability of High-Temperature Lead-Free Die-Attach Technologies," IEEE Transactions on Device and Materials Reliability , vol. 11 no. 4, pp. 531-539, Dec. 2011.

Quintero-Aguilo, Pedro O., Caceres-Valencia, Pablo, Valentin, Ricky, and Diaz, Alfredo, "Combinatorial Studies for the Minimization of Tin Whiskers Growth in Lead Free Electronics," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 347.

Quist, John, "Attacking the Myth That Green Manufacturing Is More Expensive," IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies, Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.

Quist, John, and Ragunton, Jane, "Industry weighs lead-free packaging options," Green SupplyLine , Aug. 29, 2005.

Quist, John, and Ragunton, Jane, "NiPdAu Leadframe Packages: Matching Capacity With Customer Demand," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Quist, John, "Pb-Free Product Transition White Paper," Cypress Semiconductor, Apr. 7, 2004.

Quist, John R., and Gordon, Pamela J., "Strategies for garnering RoHS resources," Electronic Products , vol. 49 no. 1, pp. 107, June 2006.

RRRR

Rabbetts, A., "Replacements for Hexavalent Chromium in Anodizing and Conversion Coating," Transactions of the Institute of Metal Finishing, vol. 76 no. 1, pp. B4-B5, Jan. 1998.

Raby, Jim D., and Johnson, R. Wayne, "Is a Lead-Free Future Wishful Thinking?," Electronic Packaging & Production, vol. 35 no. 10, pp. 18-20, Aug. 1999.

Raby, Jim, "Lead-Free Solder: The future is now," Wiring Harness News, vol. xx no. xx, pp. xx-xx, Nov./Dec. 1999.

Raby, Jim, and Heller, David, "New No-Lead Solder Pastes and Reflow Techniques," Circuits Assembly, vol. 13 no. 3, pp. 28-30, Mar. 2002.

Radhakrishnan, Gokul, Freundlich, Alex, Rusakova, Irene, and Fuhrmann, Bodo, "Growth of Semiconductor Nanowires Using Rapidly and Uniformly Generated Metal Growth Centers," 2009 34th IEEE Photovoltaic Specialists Conference , Philadelphia, PA, June 7-12, 2009, pp. 2172-2174.

Radhakrishnan, Jagadeesh, Lu, Sunny, Molina, Al, Chen, Olivia H., Chang, Wu Jin, Xin Wang, Tang, Kok Kwan, Mokler, Scott, and Aspandiar, Raiyo, "Application Methods and Thermal Mechanical Reliability of Polymeric Solder Joint Encapsulation Materials (SJEM) on SnAgCu Solder Joints," SMTA China East 2017 Proceedings, Shanghai, China, Apr. 25-27, 2017, pp. xx-xx.

Radhakrishnan, Jagadeesh, "Effect of Board and Package Attributes on Solder Joint Reliability of FCBGA Packages Based on IPC-9701 Characterization," IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics, Raleigh, NC, Mar. 11-12, 2008, pp. xx-xx.

Radhakrishnan, Jagadeesh, "Effect of Board and Package Attributes on Solder Joint Reliability of FCBGA Packages Based on IPC9701 Characterization," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1431-1437.

Radman, John M., "Guide to Testing Lead-Free Product," Trace Laboratories-East.

Radman, John M., "Test Procedures for Determining the Amount of Tin Whisker Formation," Trace Laboratories-East.

Rae, Alan, "A Strong Vote for Lead-free Processing?," 2000 Lead Free Symposium Conference Proceedings, 2000, pp. xx-xx.

Rae, Alan, Smelik, Gene, and McLenaghan, Jim, "Compatibility of Lead-Free Solders and Surface Finishes," NEMI, Sept. 20, 2000.

Rae, Alan, Lasky, Ronald, Belmonte, Joe, McLenaghan, Jim, and Gosselin, Dan, "Developing and benchmarking lead-free processes," Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 605-610.

Rae, Alan, Smelik, Gene, and McLenaghan, Jim, "Compatibility of Lead-free Solders and Surface finishes," 2001 Advanced Packaging Technology Conference Proceedings, 2001, pp. xx-xx.

Rae, Alan, Lasky, Ronald, Belmonte, Joe, McLenaghan, Jim, and Gosselin, Dan, "Developing and benchmarking lead-free processes," 2000 International Symposium on Microelectronics, pp. 605-610.

Rae, Alan, and Lasky, Ronald C., "Economics and Implications of Moving to Lead-Free Assembly," Proceedings of the Technical Program NEPCON West 2000, Volume 2, Anaheim, CA, Feb. 29-Mar. 2, 2000, pp. 1099-1106.

Rae, Alan, "Harsh Environment vs. Environmentally-Friendly Electronics," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. PS-03-1-PS-03-6.

Rae, Alan, "Improved Electrical Properties of Epoxy Molding Compound and Circuit Board Materials Using Halogen-Free Flame Retardant Systems," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference , Anaheim, CA, Feb. 24-26, 2004, pp. PS-04-1-PS-04-6.

Rae, Alan, "Lead-Free - After the Shouting Is Over?," APEX 2000, Long Beach, CA, Mar. 14-16, 2000, pp. P-MT3/2-1-P/MT3/2-6.

Rae, Alan, "Lead-Free Perspectives," Global SMT & Packaging, vol. 5 no. 10, pp. 46-47, Nov. 2005.

Rae, Alan, and Wong, Gordon, "Lead-Free Requirements to Make Impact on PCB Manufacturers," Nikkei Electronics Asia, pp. xx-xx, May 2000.

Rae, Alan, "Lead-Free -- The Designer's Dilemma," Circuits Assembly.

Rae, Alan, "Nano Particle Adhesives," flipchips.com, July 2005.

Rae, Alan, "Nano-particle Solder Paste," flipchips.com, Jan. 2008.

Rae, Alan, "Nanosolder - What Next?," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Rae, Alan, "Nanotechnology Advances in Printable Systems for Conductors and Interconnects," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 746-750.

Rae, Alan, "Nanotechnology and Low Temperature Electronics Assembly," CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. 205-207.

Rae, Alan, "Nanotechnology and Low Temperature Electronics Assembly," 2005 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Rae, Alan, "Nanotechnology and Low Temperature Electronics Assembly," SMTA Journal , vol. 18 no. 2, pp. 11-14, Apr. 2005.

Rae, Alan, and Handwerker, Carol, "NEMI's Lead-Free Alloy," Circuits Assembly, vol. 15 no. 4, pp. 20-25, Apr. 2004.

Rae, Alan, "Packaging Trends for the Next 10 Years," Advanced Packaging, vol. 14 no. 3, pp. 12, Mar. 2005.

Rae, Alan, "Practical Processing of Lead-Free Assemblies," PCB007, June 2002.

Rae, Alan, McLenaghan, Jim, and Herber, Rob, "Real-life tin-silver-copper alloy processing," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies , San Jose, CA, Apr. 23-24, 2003, pp. 76-80.

Rae, Alan, McLenaghan, Jim, and Herber, Rob, "Real-life tin-silver-copper alloy processing," Dataweek, vol. xx no. xx, pp. xx-xx, Feb. 25, 2004.

Rae, Alan, "The Costs of Going Green," Circuits Assembly, vol. 14 no. 7, pp. 22-25, July 2003.

Rae, Alan, "The costs of going green: environmental requirements are forth coming but at what costs to industry (and consumers)? A primer on meeting WEEE and other laws," 2003.

Rae, Alan, "The value of nanotechnology?," Global SMT and Packaging, vol. 5 no. 6, pp. 40-41, June/July 2005.

Rae, Alan, Skipor, Andrew, and Chason, Marc, "`Warm' Manufacturing Heats Up," Circuits Assembly, vol. 19 no. 7, pp. 30-34, July 2008.

Rae, Alan, Skipor, Andrew, and Chason, Marc, "'Warm' Manufacturing HEATS UP," Printed Circuit Design and Fab, vol. 25 no. 7, pp. 32-35, July 2008.

Raeder, C. H., Schmeelk, G. D., Mitlin, D., Barbieri, T., Yang, W., Felton, L. F., Messler, R. W., Knorr, D. B., and Lee, D., "Isothermal Creep of Eutectic SnBi and SnAg Solder and Solder Joints," Sixteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, La Jolla, CA, Sept. 12-14, 1994, pp. 1-6.

Raeder, C. H., Felton, L. E., Knorr, D. B., Schmeelk, G. B., and Lee, D., "Microstructural Evolution and Mechanical Properties of Sn-Bi Based Solders," Fifteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium, Santa Clara, CA, Oct. 4-6, 1993, pp. 119-127.

Raeder, C. H., Messler Jr., R. W., and Coffin Jr., L. F., "Partially-Constrained Thermomechanical Fatigue of Eutectic Tin-Bismuth/Copper Solder Joints," Journal of Electronic Materials, vol. 28 no. 9, pp. 1045-1054, Sept. 1999.

Raeder, C. H., Felton, L. E., Tanzi, V. A., and Knorr, D. B., "The Effect of Aging on Microstructure, Room Temperature Deformation, and Fracture of Sn-Bi/Cu Solder Joints," Journal of Electronic Materials , vol. 23 no. 7, pp. 611-617, July 1994.

Raeder, C. H., Felton, L. E., Messler Jr., R. W., and Coffin Jr., L. F., "Thermomechanical Stress-Strain Hysteresis of Sn-Bi Eutectic Solder Alloy," Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, Oct. 2-4, 1995, pp. 263-268.

Rafanelli, A. J., "Dependable Electronics with Lead-Free Components/Systems - Overview," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. xx-xx.

Rafanelli, A. J., "Dependable Electronics with Lead-Free Components/Systems - Test and Reliability," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. xx-xx.

Rafanelli, Anthony, Woody, Linda, Hillman, David, and Pinsky, David, "Dependable Electronics with Lead-Free Components/Systems (Managing the Transition to a "Green World")," Lead-Free Symposium AIA/PERM Workshop , Orlando, FL, Oct. 18, 2012.

Rafanelli, Anthony J., "GEIA-STD-0005-3: Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 710-714.

Rafanelli, Anthony J., "How the Defense/Aerospace Industry is Responding to Pb-free (lead-free) Challenge," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. xx-xx.

Rafanelli, Anthony J., and Pinsky, David, "Industry Takes a Pro-Active Approach: The AIA-AMC-GEIA Lead-Free Electronics in Aerospace Project Working Group," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 889-896.

Rafanelli, Anthony J., "Latest Developments in Testing Pb-free Electronic Assemblies: A Report on the Revision A Update to GEIA-STD-0005-3," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 594-598.

Rafanelli, Anthony J., "Living With Pb-Free in High Performance Engineering Design," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 407-412.

Rafanelli, Anthony J., "Pb-Free Design and Implementation Guidance in High Performance Engineering Design," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 586-591.

Rafanelli, Anthony J., "Raytheon's Pro-Active Approach in Addressing the Challenges Associated with Lead-Free Technologies in COTS Equipment," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.

Rafanelli, Anthony, and Woody, Linda, "Recalling the Lead-Free Manhattan Project," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 423-428.

Rafanelli, Anthony J., "Status of Pb-Free Risk Mitigation for Aerospace and Defense - An "Attitude Adjustment" Perspective," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 478-483.

Rafanelli, Anthony J., "The Lead-Free Solder Alternatives Issue: A Defense Industry Perspective."

Rafanelli, Anthony J., "The Pb-Free in Electronics Risk Mitigation (PERM) Consortium," 2010 AIMS/ Harsh Environments Symposium, Orlando, FL, Oct. 25, 2010, pp. 341-348.

Rafanelli, Anthony J., "Thermo-mechanical Creep Characteristics of Electrically Conductive Epoxy Adhesives at Room Temperature," InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V, Orlando, FL, May 29-June 1, 1996, pp. 299-305.

Rafanelli, Tony, "Dependable Electronics with Lead-Free Components/Systems Overview," Tin Whisker Group teleconferences, Jan. 16, 2013 and Jan. 23, 2013.

Ragan, Regina, Chen, Yong, Ohlberg, Douglas A. A., Medeiros-Ribeiro, Gilberto, and Williams, R. Stanley, "Ordered arrays of rare-earth silicide nanowires on Si(0 0 1)," Journal of Crystal Growth, vol. 251 no. 1-4, pp. 657-661, 2003.

Raghavan, V., "Bi-Fe-Sn (Bismuth-Iron-Tin)," Journal of Phase Equilibria and Diffusion , vol. 32 no. 2, pp. 145, Apr. 2011.

Raghavan, V., "Fe-Sn-W (Iron-Tin-Tungsten)," Journal of Phase Equilibria and Diffusion , vol. 31 no. 2, pp. 190, Apr. 2010.

Raghavan, Venkatesh Arasanipalai, Roggeman, Brian, Meilunas, Michael, and Borgesen, Peter, "Effects of 'Latent Damage' on pad cratering: Reduction in life and a potential change in failure mode," Microelectronics Reliability, vol. 53 no. 2, pp. 303-313, Feb. 2013.

Raghavan, Venkatesh, Roggeman, Brian, Meilunas, Michael, and Borgesen, Peter, "Effects of Pre-Stressing on Solder Joint Failure by Pad Cratering," 2010 Proceedings 60th Electronic Components and Technology Conference , Las Vegas, NV, June 1-4, 2010, pp. 456-463.

Rahal, Mohamad, "Innovative Circuits to Detect Faults in Accelerator Pedal Sensor Wires in Modern Vehicles," 2013 25th International Conference on Microelectronics , Beirut, Lebanon, Dec. 15-18, 2013, pp. xx-xx.

Rahangdale, Unique, Srinivas, Rahul, Krishnamurthy, S., Rajmane, Pavan, Misrak, Abel, Sakib, A. R., Agonafer, Dereje, Lohia, Alok, Kummerl, Steven, and Nguyen, Luu T., "Effect of PCB Thickness on Solder Joint Reliability of Quad Flat No-Lead Assembly under Power Cycling and Thermal Cycling," 2017 33rd Thermal Measurement, Modeling & Management Symposium, San Jose, CA, Mar. 13-17, 2017, pp. 70-76.

Rahangdale, Unique, Conjeevaram, B., Doiphode, Aniruddha, Rajmane, Pavan, Misrak, Abel, Sakib, A. R., Agonafer, Dereje, Nguyen, Luu T., Lohia, Alok, and Kummerl, Steven, "Solder Ball Reliability Assessment of WLCSP - Power Cycling Versus Thermal Cycling," 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 30-June 2, 2017, pp. 1361-1368.

Rahim, M. Kaysar, Suhling, Jeffrey C., Jaeger, Richard C., Lall, Pradeep, and Knight, Roy, "Reliability of Flip Chip Assemblies Subjected to Extreme Low Temperatures," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 2, 2006, pp. 1379-1389.

Rahimi, M. H., Tabaian, S. H., Marashi, S. P. H., Saramad, S., Arab, M., and Hemasian, A., "Heat treatment of aluminum in preparing porous anodic alumina templates," IET Micro & Nano Letters, vol. 7 no. 2, pp. 125-129, Feb. 2012.

Rahimian, Morteza, and Fathipour, Morteza, "Improvement of electrical performance in junctionless nanowire TFET using hetero-gate-dielectric," Materials Science in Semiconductor Processing , vol. 63, pp. 142-152, June 1, 2017.

Rahman, Md. Masudur, and Sharif, Ahmed, "Characteristics of Zn-Sb based high temperature solder alloy," Journal of Materials Science: Materials in Electronics, vol. 29 no. 21, pp. 18417-18425, Nov. 2018.

Rahman, Md. Arifur, Ho, Cheng En, Gierlotka, Wojciech, and Kuo, Jui Chao, "Experimental Determination and Thermodynamic Modeling of the Sn-Rich Corner of the Ternary Ni-Pd-Sn Phase Diagram at 250°C," Journal of Electronic Materials, vol. 43 no. 12, pp. 4582-4593, Dec. 2014.

Rahman, Md. Arifur, Fan, Chia-Wei, Wang, Shih-Ju, Ho, Cheng-En, and Gierlotka, Wojciech, "Experimental Studies and Thermodynamic Assessment of Ternary Cu-Pd-Sn Phase Relations Focusing on the Sn-Rich Alloys," Journal of Electronic Materials, vol. 43 no. 1, pp. 176-186, Jan. 2014.

Rahmani, Mehdi, Nabizadeh, Ramin, Yaghmaeian, Kamyar, Mahvi, Amir Hossein, and Yunesian, Massoud, "Estimation of waste from computers and mobile phones in Iran," Resources, Conservation and Recycling, vol. 87, pp. 21-29, June 2014.

Rahn, A., "Tasks for Lead-Free," Rahn-Tec, Feb. 2000.

Rai, R. S., Kang, S. K., and Purushothaman, S., "Interfacial Reactions with Lead (Pb)-Free Solders," 1995 Proceedings 45th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 1995, pp. 1197-1202.

Rai, Rahul, and Terpenny, Janis, "Principles for Managing Technological Product Obsolescence," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 4, pp. 880-889, Dec. 2008.

Raj, Anto, Sridhar, Sharath, Thirugnanasambandam, Sivasubramanian, Sanders, Thomas, Evans, John, Johnson, Wayne, Carpenter, Mark, and Hamasha, Sa'd, "Comparative Study on Impact of Various Low Creep Doped Lead Free Solder Alloys," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 820-826.

Raj, Anto, Thirugnanasambandam, Sivasubramanian, and Evans, John, "Isothermal Aging Effects of Doped Lead-Free Solder Performance in Super BGA Package," International Conference for Electronics Enabling Technologies 2018 Proceedings, Markham, Ontario, Canada, June 5-7, 2018, pp. xx-xx.

Raj, Anto, Thirugnanasambandam, Sivasubramanian, Sanders, Thomas, Sridhar, Sharath, Gordon, Seth, Evans, John, Megahed, Fadel, Bozack, Michael, Johnson, Wayne, and Carpenter, Mark, "Proportional Hazard Model of Doped Low Creep Lead Free Solder Paste under Thermal Shock," 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 31-June 3, 2016, pp. 1191-1201.

Raj, Anto, Sanders, Thomas, Sridhar, Sharath, Evans, John L., Bozack, Michael J., Johnson, Wayne R., and Carpenter, D. Mark, "Thermal Shock Reliability of Isothermally Aged Doped Lead-Free Solder With Semiparametric Estimation," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 9 no. 6, pp. 1082-1093, June 2019.

Raj, Anto, Thirugnanasambandam, Sivasubramanian, Sanders, Thomas, Sridhar, Sharath, Evans, John, Bozack, Michael, and Johnson, Wayne, "Thermal Shock Reliability Test on Multiple Doped Low Creep Lead Free Solder Paste and Solder Ball Grid Array Packages," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 354-361.

Rajagopal, Subramanian, and Pecht, Michael, "The Impact of Lead-Free Legislation Exeemptions on the Electronics Industry," Proceedings of 2004 International IEEE Conference on the Asian Green Electronics, Hong Kong, China, Jan 5-9, 2004, pp. 26-37.

Rajaguru, P., Lu, H., Bailey, C., Ortiz-Gonzalez, J., and Alatise, O., "Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective," Microelectronics Reliability, vol. 68, pp. 77-85, Jan. 2017.

Rajaguru, Pushpa, Lu, Hua, and Bailey, Chris, "Time Integration Damage Model for Sn3.5Ag Solder Interconnect in Power Electronic Module," IEEE Transactions on Device and Materials Reliability, vol. 19 no. 1, pp. 140-148, Mar. 2019.

Rajaguru, Pushparajah, Lu, Hua, and Bailey, Chris, "A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module," Microelectronics Reliability, vol. 55 no. 11, pp. 2371-2381, Nov. 2015.

Rajan, Juley Lissy, Grosskopf, Curtis, Xue, Feng, and Adams, Jackie, "The Status of Low-Halogen Material Usage in Supply Chain Electronic Components," South East Asia Technical Training Conference on Electronics Assembly Technologies 2012 Proceedings, Penang, Malaysia, Apr. 18-20, 2012, pp. xx-xx.

Rajendran, S., Bharathi, S., Krishna, C., and Vasudevan, T., "Corrosion Evaluation of CN & Non-CN Zinc Coatings Using Electrochemical Polarization," Plating & Surface Finishing, vol. 84 no. 3, pp. 59-62, Mar. 1997.

Rajendran, S., Bharathi, S., Krishna, C., and Vasudevan, T., "Electrodeposition of Zinc-Cobalt Alloy From Cyanide-Free Alkaline Plating Bath," Plating & Surface Finishing, vol. 84 no. 10, pp. 53-56, Oct. 1997.

Rajoo, R., and Wong, E. H., "Moisture Characteristics and Performance of Halogen-Free Laminates."

Rajoo, R., and Wong, E. H., "Moisture Characteristics and Performance of Halogen-Free Laminates," International Conference on Electronics Packaging, Tokyo, Japan, Apr. 17-19, 2002, pp. 480-485.

Rajoo, Ranjan, Kisi, E. H., and O'Connor, D. J., "Micro Impact Testing of Lead Free Solder Joints," Advanced Materials Research, vol. 32, pp. 99-102, 2008.

Rajoo, Ranjan, and Wong, E. H., "Trends and Challenges of Environmentally Friendly Laminates," Printed Circuit Fabrication, vol. 26 no. 3, pp. 26-28,31, Mar. 2003.

Rajput, N. S., Tong, Z., Verma, H. C., and Luo, X., "Ion-beam-assisted fabrication and manipulation of metallic nanowires," IET Micro & Nano Letters, vol. 10 no. 7, pp. 334-338, July 2015.

Rajska, Dominika, Hnida-Gut, Katarzyna E., Gajewska, Marta, Chlebda, Damian, Brzozka, Agnieszka, and Sulka, Grzegorz D., "Adjusting the crystal size of InSb nanowires for optical band gap energy modification," Materials Chemistry and Physics, vol. 254, pp. 123498-1-123498-x, Nov. 1, 2020.

Ralph, W. Carter, Morscher, Gregory N., Benedetto, Elizabeth Elias, Newman, Keith, Allen, Aileen, and Silk, Julie, "Detection of Pad Crater Initiation in Shock Using Acoustic Emission Detection," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 109-116.

Ram, B., Stevels, A., Griese, H., Middendorf, A., Muller, J., Nissen, N. F., and Reich, H., "Environmental Performance of Mobile Products," Proceedings of the 1997 IEEE International Symposium on Electronics and the Environment, Danvers, MA, May 11-13, 1999, pp. 140-145.

Ram, T. S. Krishna, "Successful formulation of ENIG Plating," Printed Circuit Design and Fab/ Circuits Assembly, vol. 29 no. 8, pp. 26-29, Aug. 2012.

Ramachandran, Koushik, Liu, Fuhan, Raj, P. Markondeya, Sundaram, Venky, and Tummala, Rao, "Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates," Journal of Electronic Materials, vol. 42 no. 2, pp. 348-354, Feb. 2013.

Ramachandran, Koushik, Liu, Fuhan, Sundaram, Venky, and Tummala, Rao, "Conductive Anodic Filament Reliability of Small and Fine-Pitch Through Vias in Halogen-Free Organic Packaging Substrate," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 2, pp. 282-288, Feb. 2013.

Ramachandran, Koushik, Ready, W. Jud, Raj, P. Markondeya, Sundaram, Venky, and Tummala, Rao, "Insulation reliability of fine-pitch through-vias in glass fiber reinforced halogen-free epoxy substrates," Journal of Materials Science: Materials in Electronics, vol. 25 no. 4, pp. 1687-1695, Apr. 2014.

Ramachandran, Koushik, Liu, Fuhan, Kumbhat, Nitesh, Wilson, Mark, Sundaram, Venky, and Tummala, Rao, "Reliability of Fine Pitch Halogen-Free Organic Substrates for Green Electronics," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 2015-2020.

Ramachandran, V., Wu, K. C., Lee, C. C., and Chiang, K. N., "Reliability Life Assessment of WLCSP Using Different Creep Models," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 1017-1022.

Ramakrishna, Gnyaneshwar, Nandagopal, Bala, Dick, Tim, Burton, Anthony, Higdon, Reggie, Anvari, Mike, Hu, Mason, Teng, Sue, and Xue, Jie, "Comprehensive Assembly and Reliability Study of 0201's for High Reliability Applications for Utilizing both a Pb-Free and Sn/Pb Assembly Process," 2007 Proceedings 57th Electronic Components & Technology Conference , Reno, NV, May 29-June 1, 2007, pp. 1313-1319.

Ramanathan, Lakshmi N., Lee, Tien-Yu Tom, Jang, Jin-Wook, Chae, Seung-Hyun, and Ho, Paul S., "Current Carrying Capability of Sn0.7Cu Solder Bumps in Flip Chip Modules for High Power Applications," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1456-1461.

Ramanathan, Lakshmi N., Jang, Jin-Wook, Tang, Jinbang, and Frear, D. R., "Electromigration Behavior of Flip-Chip Solder Bumps Subjected to RF Stressing," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 325-329.

Ramanauskas, Rimantas, Selskis, Algirdas, Juodkazyte, Jurga, and Jasulaitiene, Vitalija, "PCB Failure Analysis Related to the ENIG Black Pad Problem," Circuit World, vol. 39 no. 3, pp. xx-xx, 2013.

Ramandi, Hamed Lamei, Chen, Honghao, Crosky, Alan, and Saydam, Serkan, "Interactions of stress corrosion cracks in cold drawn pearlitic steel wires: An X-ray micro-computed tomography study," Corrosion Science, vol. 145, pp. 170-179, Dec. 2018.

Ramayya, Edwin B., Vasileska, Dragica, Goodnick, Stephen M., and Knezevic, Irena, "Electron Mobility in Silicon Nanowires," IEEE Transactions on Nanotechnology, vol. 6 no. 1, pp. 113-117, Jan. 2007.

Ramazani, A., Almasi-Kashi, M., and Safari, Z., "The effect of off-time and annealing on the magnetic behavior of CoxSn1-x alloy nanowires," Journal of Alloys and Compounds, vol. 609, pp. 206-210, Oct. 5, 2014.

Ramazani, A., Kashi, M. Almasi, Kabiri, S., and Zanguri, M., "The influence of asymmetric electrodeposition voltage on the microstructure and magnetic properties of FexCo1-x nanowire arrays," Journal of Crystal Growth, vol. 327 no. 1, pp. 78-83, July 15, 2011.

Rambauske, Werner, and Gruenzel, Ronald R., "X-Ray Diffraction on Whiskers Grown from Ferrous Chloride in an Argon Atmosphere," Journal of Applied Physics, vol. 35 no. 2, pp. 408, Feb. 1964.

Ramesham, Rajeshuni, "Extreme Temperature Thermal Cycling Tests and Results to Assess Reliability for Mars Rover Flight Qualification," 2004 IEEE Microelectronics Reliability and Qualification Workshop, 2003, pp. xx-xx.

Ramirez, Ainissa G., Mavoori, Hareesh, and Jin, Sungho, "Bonding nature of rare-earth-containing lead-free solders," Applied Physics Letters, vol. 80 no. 3, pp. 398-400, Jan. 21, 2002.

Ramizy, Asmiet, Hassan, Z., and Omar, Khalid, "Porous silicon nanowires fabricated by electrochemical and laser-induced etching," Journal of Materials Science: Materials in Electronics, vol. 22 no. 7, pp. 717-723, July 2011.

Ramkumar, S. Manian, and Srihari, Krishnaswami, "A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging," Journal of Electronic Packaging, vol. 129 no. 2, pp. 149-156, June 2007.

Ramkumar, S. Manian, Chen, Alex, Venugopalan, Hari, and Khanna, Kumar, "Influence of Filler Modifications on the Performance of a Novel Anisotropic Conductive Adhesive Under Temperature/Humidity Aging," 2011 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, Kamuela, HI, Jan. 18-20, 2011, pp. xx-xx.

Ramkumar, S. Manian, Chen, Alex, Venugopalan, Hari, and Khanna, Kumar, "Influence of Filler Modifications on the Performance of a Novel Anisotropic Conductive Adhesive under Temperature/Humidity Aging," International Conference on Soldering & Reliability 2011 Proceedings, Toronto, Ontario, Canada, May 4-6, 2011, pp. xx-xx.

Ramkumar, S. Manian, and Srihari, K., "Influence of PCB Surface Finish and Thermal and Temperature/Humidity Aging on the Performance of a Novel Anisotropic Conductive Adhesive for Lead-free Surface Mount Assembly," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 65-73.

Ramkumar, S. Manian, and Srihari, K., "Influence of Process Parameters on Component Assembly and Drop Test Performance using a Novel Anisotropic Conductive Adhesive for Lead-free Surface Mount Assembly," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 225-233.

Ramkumar, S. Manian, Newasekar, Rahul, and Ghaffarian, Reza, "Lead-Free 0201 Assembly and Reliability," IEEE/CPMT International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, CA, Mar. 16-18, 2005, pp. 94-99.

Ramkumar, S. Manian, Ghaffarian, Reza, and Varanasi, Arun, "Lead-free 0201 manufacturing, assembly and reliability test results," Microelectronics Reliability, vol. 46 no. 2-4, pp. 244-262, Feb.-Apr. 2006.

Ramkumar, S. Manian, and Srihari, Krishnaswami, "Modeling and Experimental Verification of the Contacxt Resistance of a Novel Anisotropic Conductive Adhesive," 2007 ASME International Mechanical Engineering Conference and Exposition, Volume 5, Seattle, WA, Nov. 11-15, 2007, pp. 149-157.

Ramkumar, S. Manian, Venugopalan, Hari, and Khanna, Kumar, "Novel Anisotropic Conductive Adhesive for 3D Stacking and Lead-free PCB Packaging - A Review," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 246-254.

Ramkumar, S. Manian, Ganeshan, Vijaykumar, Thenalur, Karthik, and Ghaffarian, Reza, "Reliability and Paste Process Optimization of Eutectic and Lead-Free for Mixed Packaging," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Ramkumar, S. Manian, Kannabiran, Anand, Baskaran, Aarthi, Puligandla, Viswam, and Dahle, Bjorn, "Understanding hidden reactions and the importance of profile in reflow soldering, part 1," Global SMT and Packaging, vol. 8 no. 7, pp. 10-12,14,16,28, July 2008.

Ramkumar, S. Manian, Kannabiran, Anand, Baskaran, Aarthi, Puligandla, Viswam, and Dahle, Bjorn, "Understanding hidden reactions and the importance of profile in reflow soldering, part 2," Global SMT and Packaging, vol. 8 no. 8, pp. 22-24,26,28-29, Aug. 2008.

Ramkumar, S. Manian, Kannabiran, Anand, Baskaran, Aarthi, Puligandla, Viswam, and Dahle, Bjorn, "Understanding the hidden reactions and the importance of profile-part 3," Global SMT and Packaging, vol. 8 no. 10, pp. 34-36,38, Oct. 2008.

Ramli, M. I. I., Saud, N., Salleh, M. A. A. Mohd, Derman, M. N., and Said, R. Mohd, "Effect of TiO2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder," Microelectronics Reliability, vol. 65, pp. 255-264, Oct. 2016.

Ramli, M. I. I., Salleh, M. A. A. Mohd, Sobri, F. A. Mohd, Narayanan, P., Sweatman, K., and Nogita, K., "Relationship between free solder thickness to the solderability of Sn-0.7Cu-0.05Ni solder coating during soldering," Journal of Materials Science: Materials in Electronics, vol. 30 no. 4, pp. 3669-3677, Feb. 2019.

Ramli, M. I. I., Salleh, M. A. A. Mohd, Abdullah, M. M. A., Narayanan, P., Chaiprapa, J., Said, R. Mohd, Yoriya, S., and Nogita, K., "The Effect of Ni and Bi Additions on the Solderability of Sn-0.7Cu Solder Coatings," Journal of Electronic Materials, vol. 49 no. 1, pp. 1-12, Jan. 2020.

Ramos, Jean, "Choosing the best bumping option," EE Times - Asia, vol. xx no. xx, pp. xx-xx, June 1, 2006.

Ramos, S. B., Lemus, N. V. Gonzalez, Toro, C. E. Deluque, Cabeza, G. F., and Guillermet, A. Fernandez, "Systematics of Structural, Phase Stability, and Cohesive Properties of n'-Cu6(Sn,In)5 Compounds Occurring in In-Sn/Cu Solder Joints," Journal of Electronic Materials, vol. 46 no. 7, pp. 4485-4496, July 2017.

Ramos de Debiaggi, S., Toro, C. Deluque, Cabeza, G. F., and Guillermet, A. Fernandez, "Ab initio study of the cohesive properties, electronic structure and thermodynamic stability of the Ni-In and Ni-Sn intermetallics," Journal of Alloys and Compounds, vol. 576, pp. 302-316, Nov. 5, 2013.

Ramsay, Guy, "Ask the EMPF Helpline!," empfasis, pp. xx-xx, Sept. 2003.

Ramsden, Ed, "RoHS and sensors: what this means to you," Sensors Magazine, vol. 23 no. 1, pp. 34, Jan. 2006.

Rana, Pallavi, Narula, Chetna, Rani, Anita, Chauhan, R. P., Gupta, Rashi, and Kumar, Rajesh, "Ion implantation effects of negative oxygen on copper nanowires," Journal of Materials Science: Materials in Electronics, vol. 28 no. 14, pp. 9998-10006, July 2017.

Ranadive, Nandu, Ma, Wai Mon, and Buschel, Daniel, "Preventing Head in Pillow Defects in Area Array Components," International Conference on Soldering & Reliability 2015 Proceedings , Toronto, Ontario, Canada, May 19-21, 2015, pp. xx-xx.

Randall, Lorie, "UK lead on WEEE directive technology," Engineering Technology, vol. 7 no. 8, pp. 47, Oct. 2004.

Randall, Michael, Prymak, John, Laps, Mark, Renner, Garry, Blais, Peter, Staubli, Paul, and Tajuddin, Aziz, "D-Pack 3D Interposer Decoupling System," CARTS Europe 2007, Barcelona, Spain, Oct. 29-Nov. 1, 2007, pp. xx-xx.

Randall, Michael, Sloka, Bill, Laps, Mark, Renner, Garry, Prymak, John, Blais, Peter, and Tajuddin, Aziz, "Decoupling Solutions," CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29, 2007, pp. xx-xx.

Randall, Paul M., and van Ooij, W. J., "Silane-Based Conversion Coating for Metals," Proceedings of the 19th AESF/EPA Pollution Prevention and Control Conference, Orlando, FL, Jan. 26-28, 1998, pp. 267-270.

Rani, S. Devaki, and Murthy, G. S., "Evaluation of Bulk Mechanical Properties of Selected Lead-Free Solders in Tension and in Shear," Journal of Materials Engineering and Performance , vol. 22 no. 8, pp. 2359-2365, Aug. 2013. https://doi-org.ezproxy.uky.edu/10.1007

Rani, S. Devaki, and Murthy, G. S., "Impression creep behaviour of tin based lead free solders," Materials Science & Technology, vol. 20 no. 3, pp. 403-408, Mar. 1, 2004.

Rani, S. Devaki, and Murthy. G. S., "Impression creep behaviour of tin based lead free solders," Materials Science & Technology, vol. 20 no. 7, pp. 885-890, July 1, 2004.

Ranouta, Amarinder Singh, Fan, Xuejun, and Han, Qiang, "Shock Performance Study of Solder Joints in Wafer Level Packages," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1266-1276.

Rao, B. S. S. Chandra, Zeng, K. Y., and Kripesh, V., "Determination of Tensile Properties of Lead-free Solder Joints Using Nanoindentation," 2010 12th Electronics Packaging Technology Conference , Singapore, Dec. 8-10, 2010, pp. 309-314.

Rao, B. S. S. Chandra, Kripesh, V., and Zeng, K. Y., "Diffusion Kinetics and Mechanical Behavior of Lead-free Microbump Solder Joints in 3D Packaging Applications," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 100-108.

Rao, B. S. S. Chandra, Fernandez, D. M., Kripesh, V., and Zeng, K. Y., "Effect of Solder Volume on Diffusion Kinetics and Mechanical Properties of Microbump Solder Joints," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 423-428.

Rao, B. S. S. Chandra, Kumar, K. Mohan, Zeng, K. Y., Tay, A. A. O., and Kripesh, V., "Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders," 11th Electronics Packaging Technology Conference , Singapore, Dec. 9-11, 2009, pp. 272-277.

Rao, B. S. S. Chandra, Weng, J., Shen, L., Lee, T. K., and Zeng, K. Y., "Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints," Microelectronic Engineering, vol. 87 no. 11, pp. 2416-2422, Nov. 2010.

Rao, Li, Hu, Fengtian, Xu, Penghui, Hu, Anmin, Gao, Liming, Li, Ming, and Zhao, Wen, "Research on the interfacial reaction and mechanism of Cu/Sn/Ni copper pillar bump," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 1045-1050.

Rao, Yang, Lu, Daoqiang, and Wong, C. P., "A study of impact performance of conductive adhesives," International Journal of Adhesion and Adhesives, vol. 24 no. 5, pp. 449-453, Oct. 2004.

Rao, Zhenzhen, Bao, Shengxiang, Lai, Weiming, Shi, Guanghua, Li, Peng, and Ye, Jianhai, "Discoloration Mechanism of Silver-filled Adhesive used for Packaging Solder Joint," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 874-876.

Rapala-Virtanen, Tarja, "Experiences gained manufacturing high density interconnect (HDI) printed wiring boards (PWBs)," Circuit World, vol. 29 no. 1, pp. 14-18, 2002.

Rapala-Virtanen, Tarja, "Status and trends for PWBs with embedded components," Circuit World , vol. 30 no. 1, pp. 42-47, 2004.

Rappaz, M., Kohler, F., Valloton, J., Phillion, A. B., and Stampanoni, M., "Connectivity of Phases and Growth Mechanisms in Peritectic Alloys Solidified at Low Speed: an X-Ray Tomography Study of Cu-Sn," Metallurgical and Materials Transactions A, vol. 41 no. 3, pp. 563-567, Mar. 2010.

Raskin, Christian, "Copper rod and wire welds' influence on drawing performance," Wire Journal International, vol. 39 no. 11, pp. 56-61, Nov. 2006.

Rasmussen, J., "Internal stress in pulse plated tin/zinc alloys," Proceedings of The International Technical Conference of SUR/FIN, Baltimore, MD, June 26-29, 1995, pp. 539-546.

Rasmussen, J., Owei, A., Isik, D., Dombert, A., and Ormerod, D., "Oxide Replacement for High Temperature Applications," Printed Circuit Design and Manufacture, vol. 24 no. 5, pp. 30-34, May 2007.

Rasmussen, Jean, and Budman, Edward, "Electrochemical Deposition of Sn/Zn Alloys," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Rasmussen, Jean, "The corrosion resistance of tin/zinc alloys," SUR/FIN '94 Technical Conference Proceedings, Indianapolis, IN, June 20-23, 1994, pp. 657-663.

Rasmussen, Jean, "Tin/Zinc Alloy Plating," Plating & Surface Finishing, vol. 88 no. 2, pp. 18-20, Feb. 2001.

Rasmussen, Ray, ""Industry Steps Up to Make the World A Bit Cleaner" or "Who's Responsible for the Lead-Free Mess?"," PCB007, June 9, 2006.

Rasmussen, Ray, "It's Worse Than I Thought," Surface Mount Technology (SMT), vol. 27 no. 9, pp. 8,10,12, Sept. 2012.

Rasmussen, Ray, "What if the Occam Process Actually Works?," PCB007, Jan. 1, 2008.

Rasool, Kamran, Rafiq, M. A., and Durrani, Z. A. K., "Tailoring transport and dielectric properties by surface passivation of silicon nanowires with Polyacrylic acid/TiO2 nanoparticles composite," Microelectronic Engineering, vol. 119, pp. 141-145, May 1, 2014.

Rasul, Jad S., and Olson, William, "Anisotropically Conductive Adhesive for Flip Chip on Paper Assembly," Proceedings 2002 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4931), Denver, CO, Sept. 4-6, 2002, pp. 464-469.

Rasul, Jad S., "Chip on paper technology utilizing anisotropically conductive adhesive for smart label applications," Microelectronics Reliability, vol. 44 no. 1, pp. 135-140, Jan. 2004.

Rasul, Jad, and Olson, William, "Flip Chip on Paper Assembly Utilizing Anisotropic Conductive Adhesive," 2002 Proceedings 52nd Electronic Components & Technology Conference , San Diego, CA, May 28-31, 2002, pp. 90-94.

Rasul, Jad S., and Olson, Bill, "Flip Chip on Paper Assembly Utilizing Anisotropic Conductive Adhesive," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Ratajewicz, Z., and Saneluta, C., "Electrolytic Codeposition of Palladium & Nickel in an Ammonia Bath," Plating & Surface Finishing, vol. 84 no. 11, pp. 60-62, Nov. 1997.

Ratchev, P., Vandevelde, B., and De Wolf, I., "Reliability and Failure Analysis of SnAgCu Solder Joints for PSGA packages," Leuven, Feb. 6, 2004.

Ratchev, P., Vandevelde, B., and De Wolf, I., "Reliability and Failure Analysis of SnAgCu Solder Interconnections on NiAu Surface Finish," Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 7-11, 2003, pp. 113-116.

Ratchev, P., Vandevelde, B., Gonzalez, M., and De Wolf, I., "Reliability and Failure Modes of SnAgCu Solder Joints for PSGA packages," IPC and Soldertec Global Conference on Lead Free Electronics, Brussels, Belgium, June 11-12, 2003, pp. xx-xx.

Ratchev, Petar, Vandevelde, Bart, Verlinden, Bert, Allaert, Bart, and Werkhoven, Daniel, "Brittle to Ductile Fracture Transition in Bulk Pb-Free Solders," IEEE Transactions on Components and Packaging Technologies, vol. 30 no. 3, pp. 416-423, Sept. 2007.

Ratchev, Petar, Vandevelde, Bart, and De Wolf, Ingrid, "Reliability and Failure Analysis of Sn-Ag-Cu Solder Interconnections for PSGA packages on Ni/Au Surface Finish," 2003.

Ratchev, Petar, Vandevelde, Bart, and De Wolf, Ingrid, "Reliability and Failure Analysis of Sn-Ag-Cu Solder Interconnections for PSGA Packages on Ni/Au Surface Finish," IEEE Transactions on Device and Materials Reliability, vol. 4 no. 1, pp. 5-10, Mar. 2004.

Rathod, Jignesh, Santos, Daryl, Chouta, Prashant, Rae, Alan, and Belmonte, Joe, "A Reliability Comparison of Different Pb-Free Alloys and Surface Finishes in SMT Assembly."

Rathod, Jignesh, Santos, Daryl, Chouta, Prashant, Belmonte, Joe, and Rae, Alan, "A Reliability Comparison of Different Lead-Free Alloys and Surface Finishes in SMT Assembly," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S28-2-1-S28-2-14.

Rathod, Jignesh, Santos, Daryl, Belmonte, Joe, and McLenaghan, A. James, "Comparison of Microstructures in SAC305 and SAC405 Solder Joints and the Influence of Surface Finish," 2002 Advanced Technology Symposium Conference Proceedings, 2002, pp. xx-xx.

Rathore, Pragam, Kota, Srinivas, and Chakrabarti, Amaresh, "Sustainability through remanufacturing in India: a case study on mobile handsets," Journal of Cleaner Production, vol. 19 no. 15, pp. 1709-1722, Oct. 2011.

Ratzker, Menahem, Pearl, Adam, Osterman, Michael, Pecht, Michael, and Milad, George, "Review of Capabilities of the ENEPIG Surface Finish," Journal of Electronic Materials, vol. 43 no. 11, pp. 3885-3897, Nov. 2014.

Rauer, Miriam, Volkert, Antje, Schreck, Timo, Harrter, Stefan, and Kaloudis, Michael, "Computed-Tomography-Based Analysis of Voids in SnBi57Ag1 Solder Joints and Their Influence on the Reliability," Journal of Failure Analysis and Prevention, vol. 14 no. 3, pp. 272-281, June 2014.

Rauer, Miriam, Schreck, Timo, Harter, Stefan, and Kaloudis, Michael, "The Effect of Thermal Stress on the Reliability of Low Ag Solder Joints in High-Power LEDs," 2015 European Microelectronics Packaging Conference , Friedrichshafen, Germany, Sept. 14-16, 2015, pp. xx-xx.

Raugi, Fabien, Chowdhury, Mohammad Kamruzzaman, Kristiansen, Helge, and Liu, Johan, "Flow Behaviour of Anisotropic Conductive Adhesive Film during COG Bonding Process in Flat Panel Display Assembly," 1st Electronics Systemintegration Technology Conference, Volume 2, Dresden, Germany, Sept. 5-7, 2006, pp. 827-833.

Rausch, Martin, "Low Halogen Transition Issues," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Raut, Rahul, Lewis, Brian, and Hunsinger, Tom, "Case Studies in Preventing Component Damage from Lead-Free Heat," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 255-267.

Raut, Rahul, Singer, Adam, Lewis, Brian, and Santos, Daryl, "Thermal Management of Heat-Sensitive Components in the Reflow and Rework Processes," 2005 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Rautiainen, Antti, Vuorinen, Vesa, and Paulasto-Krockel, Mervi, "Interfacial Reactions Between ZnAl(Ge) Solders on Cu and Ni Substrates," Journal of Electronic Materials, vol. 46 no. 4, pp. 2323-2333, Apr. 2017.

Ravelo, R., and Baskes, M., "Equilibrium and Thermodynamic Properties of Grey, White, and Liquid Tin," Physical Review Letters, vol. 79 no. 13, pp. 2482-2485, Sept. 29, 1997.

Ravi, Raju, and Paul, Aloke, "Diffusion and growth mechanism of phases in the Pd-Sn system," Journal of Materials Science: Materials in Electronics, vol. xx no. xx, pp. xx-xx, xxxx.

Ravi, V., "Evaluating overall quality of recycling of e-waste from end-of-life computers," Journal of Cleaner Production, vol. xx no. xx, pp. xx-xx, xxxx.

Ravindran, V., Krishnan, R. M., and Muralidharan, V. S., "Characterization of Zn-Ni Alloy Deposits," Plating & Surface Finishing, vol. 83 no. 5, pp. 139-141, May 1996.

Rawicz, Andrew H., "Comparative Studies of Vibrational Reliability of Electroconductive Adhesive and Soldered Microjoints," IEEE Transactions on Reliability, vol. 36 no. 5, pp. 528-530, Dec. 1987.

Rawinski, Viktoria, "Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate - Influence of Eigenmodes," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 690-696.

Rawinski, Viktoria, "Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate- Process Intergration in Industrial Production," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 685-694.

Ray, Justin, "Satellite failure causes communications blackout," Spaceflight Now , Aug. 29, 2000.

Ray, Samit K., Katiyar, Ajit K., and Raychaudhuri, Arup K., "One-dimensional Si/Ge nanowires and their heterostructures for multifunctional applications-a review," Nanotechnology, vol. 28 no. 9, pp. 092001-1-092001-40, Mar. 3, 2017.

Ray, Sudipta, Muncy, Jennifer, McLaughlin, Paul V., and Nicholls, Lou, "Qualification of Low-k 65nm Technology Die with Pb-free Bumps on a 2-2-2 Laminate Package (PBGA) with Pb-free Assembly Processes," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1-7.

Ray, Sudipta, Kiyono, Satsuo Steven, Waite, Kirk, and Nicholls, Lou, "Qualification of Low-K 90nm Technology Die with Pb-Free Bumps on a Build-up Laminate Package (PBGA) with Pb-Free Assembly Processes," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 139-144.

Ray, U., Artaki, I., Finley, D. W., Wenger, G. M., Pan, T., Blair, H. D., Nicholson, J. M., and Vianco, P. T., "Assessment of Circuit Board Surface Finishes for Electronic Assembly with Lead-Free Solders," Surface Mount International Proceedings of the Technical Program, Volume II, San Jose, CA, Sept. 10-12, 1996, pp. 656-668 (Sandia Report SAND-96-2265C).

Ray, U., Artaki, I., Wenger, G. M., and Machusak, D. A., "Printed Wiring Board Surface Finishes: Evaluation of Electroless Noble Metal Coatings," Surface Mount International Proceedings of the Technical Program, San Jose, CA, Aug. 29-31, 1995, pp. 891-906.

Ray, U., Artaki, I., Gordon, H. M., and Vianco, P. T., "The Influence of Temperature and Humidity on Printed Wiring Board Surface Finishes: Immersion Tin vs Organic Azoles," Journal of Electronic Materials, vol. 23 no. 8, pp. 779-785, Aug. 1994.

Ray, U., Artaki, I., and Vianco, P. T., "The Influence of Temperature and Humidity on the Wettability of Immersion Tin Coated Printed Wiring Boards," 1994 Proceedings 44th Electronic Components & Technology Conference, Washington, D.C., May 1-4, 1994, pp. 1089-1100.

Ray, Urmi, Artaki, Iris, and Vianco, Paul T., "Influence of Temperature and Humidity on the Wettability of Immersion Tin Coated Printed Wiring Boards," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 18 no. 1, pp. 153-162, Mar. 1995.

Rayne, J. A., and Chandrasekhar, B. S., "Elastic Constants of b tin from 4.2°K to 300°K," Physical Review , vol. 120 no. 5, pp. 1658-1663, Dec. 1, 1960. https://doi.org/10.1103/PhysRev.120.1658

Rayner, Bruce, "Advice for WEEE compliance," Green SupplyLine, Feb. 15, 2005.

Rayner, Bruce, "Advice for WEEE compliance," EE Times Europe, Feb. 15, 2005.

Rayner, Bruce, "AeA rolls information service," Electronics Supply & Manufacturing, Jan. 2006.

Rayner, Bruce, "Behind schedule," Electronics Supply & Manufacturing, Sept. 2004.

Rayner, Bruce, "Behind schedule," Green SupplyLine, Sept. 1, 2004.

Rayner, Bruce, "Easing the pain," Electronics Supply & Manufacturing, May 2006.

Rayner, Bruce, "Easing the pain," Green SupplyLine, May 1, 2006.

Rayner, Bruce, "High-reliability RoHS challenge," Electronics Supply & Manufacturing, Apr. 2006.

Rayner, Bruce, "High-reliability RoHS challenge," Green SupplyLine, Apr. 1, 2006.

Rayner, Bruce, "Information lacking on China RoHS law," Electronics Supply & Manufacturing, Dec. 2005.

Rayner, Bruce, "IPC standard revs up," Electronics Supply & Manufacturing , Mar. 2006.

Rayner, Bruce "Keeping track of the package," Electronics Supply & Manufacturing, Dec. 2005.

Rayner, Bruce, "Making progress," Electronics Supply & Manufacturing, Mar. 2005.

Rayner, Bruce, "Making progress," Green SupplyLine, Mar. 1, 2005.

Rayner, Bruce, "Manufacturers battle green law compliance challenges," Green SupplyLine, Feb. 1, 2005.

Rayner, Bruce, "REACH gains ground," EE Times, no. 1540, pp. 34, Sept. 8, 2008.

Rayner, Bruce, "RoHS help on the way," Green SupplyLine, Oct. 1, 2005.

Rayner, Bruce, "RoHS help on the way," Electronics Supply & Manufacturing , Oct. 2005.

Rayner, Bruce, "RoHS transition slower than expected," Green SupplyLine, July 1, 2006.

Rayner, Bruce, "RoHS transition slower than expected," Electronics Supply & Manufacturing, July 2006.

Rayner, Bruce, and Wang, Amy, "Soft launch for China RoHS in July," Green SupplyLine, Nov. 29, 2005.

Rayner, Bruce, "Standardizing RoHS materials declaration," Electronics Supply & Manufacturing, Apr. 2005.

Rayner, Bruce, "Still a long way to go," Electronics Supply & Manufacturing , Feb. 2006.

Rayner, Bruce, "Still a long way to go," Green SupplyLine, Feb. 1, 2006.

Rayner, Bruce, "Still a long way to go," Industrial Control Design Line, Feb. 1, 2006.

Rayner, Bruce, "Tough RoHS choices," Electronics Supply & Manufacturing , Mar. 2006.

Rayner, Bruce, "Tough RoHS choices," Green SupplyLine, Mar. 1, 2006.

Rayner, Bruce, "U.S. missing in action?," Electronics Supply & Manufacturing , Feb. 2005.

Rayner, Bruce, "U.S. missing in action?," Green SupplyLine, Feb. 1, 2005.

Raynor, G. V., and Smith, R. W., "The transition temperature of the transition between grey and white tin," Proceedings of the Royal Society of London, Series A, vol. 244, pp. 101-109, 1958.

Raypah, Muna, Devarajan, Mutharasu, and Mahmud, Shahrom, "Investigation on effects of solder paste voids on thermal and optical performance of white high-power surface-mounted device LEDs," Soldering & Surface Mount Technology, vol. 32 no. 2, pp. 104-114, 2020.

Razak, Nurul Razliana Abdul, Adli, Nisrin, Saud, Norainiza, and Musa, Sayyidah Amnah, "Effect of Aluminium Addition on Microstructure and Microhardness of Sn-0.7Cu-xAl Lead-free Solder Alloy," Applied Mechanics and Materials , vol. 754-755, pp. 166-170, Apr. 2015.

Rdzawski, Zbiegniew, and Gluchowski, Wojciech, "Development of technology for fine gold wire production," Wire Journal International, vol. 34 no. 1, pp. 94-98, Jan. 2001.

Re, Julia Del, "The Effect of Reflow Profile on Tin-Bismuth Solders," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 579-584.

Rea, Darren, "Confusion over green directives," EE Times Europe, Sept. 3, 2001.

Rea, Darren, "Europe mulls electronics-recycling legislation," EE Times, vol. xx no. xx, pp. xx-xx, Nov. 30, 2000.

Rea, Darren, "Less dioxin danger during incineration," EE Times Europe, Oct. 29, 2002.

Rea, Darren, "MEPs `fudge' key waste law clause," EE Times Europe, Apr. 16, 2002.

Rea, Darren, "Smaller firms `asleep' over waste directive," EE Times Europe , Oct. 9, 2002.

Rea, Darren, "'Start WEEE planning now'," EE Times Europe, July 4, 2002.

Rea, Darren, "UK firms not aware of WEEE," EE Times Europe, Oct. 21, 2002.

Rea, Darren, "WEEE directives could kill electronics manufacturing in UK," EE Times Europe, Nov. 19, 2001.

Read, Jennifer, "Contract manufacturing for industrial equipment," Green SupplyLine , Jan. 5, 2007.

Ready, W. J., Turbini, L. J., Stock, S. R., and Smith, B. A., "Conductive Anodic Filament Enhancement in the Presence of a Polyglycol-Containing Flux," Proceedings of the International Reliability Physics Symposium, Dallas, TX, Apr. 30-May 2, 1996, pp. 267-273.

Ready, W. J., Stock, S. R., Freeman, G. B., Dollar, L. L., and Turbini, L. J., "Microstructure of Conductive Anodic Filaments Formed during Accelerated Testing of Printed Wiring Boards," Circuit World, vol. 21 no. 4, pp. 5-9, 1995.

Reagor, Barbara T., "Interconnection Reliability," Proceedings of the 38th Electronics Components Conference, May 9-11, 1988, pp. 188-191.

Reagor, Barbara T., "Interconnection Reliability," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 11 no. 4, pp. 390-392, Dec. 1988.

Reck, K., Richter, J., Hansen, O., and Thomsen, E. V., "Piezoresistive Effect in Top-Down Fabricated Silicon Nanowires," 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems, Wuhan, China, Jan. 13-17, 2008, pp. 717-720.

Recknagel, Sebastian, Radant, Hendrik, and Kohlmeyer, Regina, "Survey of mercury, cadmium and lead content of household batteries," Waste Management, vol. 34 no. 1, pp. 156-161, Jan. 2014.

Redcay, Christopher J., and Englander, Ongi, "Germanium nanowire synthesis using a localized heat source and a comparison to synthesis in a uniform temperature environment," Journal of Materials Research, vol. 26 no. 17, pp. 2215-2223, Sept. 14, 2011.

Reddy, Bhupal, Bhattacharya, P., Singh, Bawa, and Chattopadhyay, K., "The effect of ball milling on the melting behavior of Sn-Cu-Ag eutectic alloy," Journal of Materials Science, vol. 44 no. 9, pp. 2257-2263, May 2009.

Reddy, E. Sudhakar, and Rajasekharan, T., "Microstructural evolution of the eta-phase in the Cu-Sn system," Journal of Materials Research, vol. 13 no. 7, pp. 1828-1833, July 1998.

Reddy, P. Jayarama, and Subrahmanyam, S. V., "Dependence on Temperature of Elastic Moduli of Tin," Nature, vol. 185 no. , pp. 29, Jan. 2, 1960. https://doi-org.ezproxy.uky.edu/10.1038/185029a0

Redwing, Joan M., Ke, Yue, Wang, Xin, Eichfeld, Chad, Weng, Xiaojun, Kendrick, Chito E., Mohney, Suzanne E., and Mayer, Theresa S., "Vapor-Liquid-Solid Growth and Characterization of Al-Catalyzed Si Nanowires," 2011 International Semiconductor Device Research Symposium, College Park, MD, Dec. 7-9, 2011, pp. xx-xx.

Reed, Allan H., and Shechtmann, Michael, "Bondable Finishes for Electronics," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. 17-19.

Reed, Dale, "Industry group is the solution to lack of basics," Connector Specifier, vol. 22 no. 1, pp. 26, Jan. 2006.

Reed, Greg, "Lead-Free Debate: All Over but the Shouting," Semiconductor International, vol. 27 no. 5, pp. 15, May 2004.

Reed, Greg, "Moisture Prevention for Packaged Semiconductors," Semiconductor International, vol. 26 no. 11, pp. 36, Oct. 2003.

Reed, Greg, "Packaging According to Lead-Free Mandates," Semiconductor International, vol. 26 no. 9, pp. 44, Aug. 1, 2003.

Reed, Greg, "Test procedures needed for tin whisker failures," Test & Measurement World, vol. 24 no. 8, pp. A2, Sept. 2004.

Reed, Jason D., Lueck, Matthew, Gregory, Chris, Huffman, Charles A., Lannon Jr., John M., and Temple, Dorota, "Reliability and Ultra-Low Temperature Bonding of High Density Large Area Arrays with Cu/Sn-Cu Interconnects for 3D Integration," 2010 International Interconnect Technology Conference, San Francisco, CA, June 6-9, 2010, pp. xx-xx.

Reed, Jim, "NCMS Surface Finish Testing," Surface Mount International Proceedings of the Technical Program, Volume II, San Jose, CA, Sept. 10-12, 1996, pp. 797-805.

Reed, Jim R., "Risk Assessment of PCB Alternative Finishes," Printed Circuit Fabrication, vol. 23 no. 7, pp. 26-28,30,32,34,36,38,40,42, July 2000.

Reese, Andrew K., "Get the Lead Out!," Supply & Demand Chain Executive, vol. xx no. x, pp. xx-xx, xxxx.

Reese, Andrew K., "Meeting the Reverse Logistics Challenge," Supply & Demand Chain Executive, vol. xx no. x, pp. xx-xx, xxxx.

Reeve, Kathlene N., Holaday, John R., Choquette, Stephanie M., Anderson, Iver E., and Handwerker, Carol A., "Advances in Pb-free Solder Microstructure Control and Interconnect Design," Journal of Phase Equilibria and Diffusion, vol. 37 no. 4, pp. 369-386, Aug. 2016.

Reeve, Kathlene N., and Handwerker, Carol A., "Beta-Tin Grain Formation in Aluminum-Modified Lead-Free Solder Alloys," Journal of Electronic Materials, vol. 47 no. 1, pp. 61-76, Jan. 2018.

Reeve, Kathlene N., Anderson, Iver E., and Handwerker, Carol A., "Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys," Journal of Electronic Materials , vol. 44 no. 3, pp. 842-866, Mar. 2015.

Reeve, Kathlene N., Choquette, Stephanie M., Anderson, Iver E., and Handwerker, Carol A., "Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 47 no. 12, pp. 6507-6525, Dec. 2016.

Reeve, Kathlene N., Choquette, Stephanie M., Anderson, Iver E., and Handwerker, Carol A., "Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 47 no. 12, pp. 6526-6541, Dec. 2016.

Refaey, S. A. M., Taha, F., and Hasanin, T. H. A., "Passivation and pitting corrosion of nanostructured Sn-Ni alloy in NaCl solutions," Electrochimica Acta, vol. 51 no. 14, pp. 2942-2948, Mar. 15, 2006.

Regolin, I., Khorenko, V., Prost, W., Tegude, F.-J., Sudfeld, D., Kastner, J., and Dumpich, G., "Composition control in metal-organic vapor-phase epitaxy grown InGaAs nanowhiskers," Journal of Applied Physics, vol. 100, pp. 074321-1-074321-5, 2006.

Regolin, I., Sudfeld, D., Luttjohann, S., Khorenko, V., Prost, W., Kastner, J., Dumpich, G., Meier, C., Lorke, A., and Tegude, F.-J., "Growth and characterisation of GaAs/InGaAs/GaAs nanowhiskers on (1 1 1) GaAs," Journal of Crystal Growth, vol. 298, pp. 607-611, Jan. 2007.

Regolin, Ingo, Khorenko, Victor, Prost, Werner, Tegude, Franz J., Sudfeld, Daniela, Kastner, Jochen, Dumpich, Gunter, Hitzbleck, Klemens, and Wiggers, Hartmut, "GaAs whiskers grown by metal-organic vapor-phase epitaxy using Fe nanoparticles," Journal of Applied Physics, vol. 101, pp. 054318-1-054318-5, 2007.

Rehl, Chris, "The Double Edged Sword for Green Initiatives," SMT Web Exclusive Article.

Reichelt, Jan, Gromala, Przemyslaw, and Rzepka, Sven, "Accelerating the Temperature Cycling Tests of FBGA Memory Components with Lead-free Solder Joints without Changing the Damage Mechanism," European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Reichenecker, W. J., "________ Intermetallic Compound Cu6Sn5," Tin and its Uses, no. 130, pp. 14-16, 1981.

Reichman, Corey, and Darveaux, Robert, "The Effect of Surface Finish on the Reliability of Pb-Free Solder Joints in Chip Scale Packages," 2005 SMTA International Conference Proceedings , Chicago, IL, Sept. 25-29, 2005, pp. 611-620.

Reid, Karen, and Wable, Girish, "Changing BGA Solder Ball Metallurgy," Surface Mount Technology (SMT), vol. 21 no. 8, pp. 17, 23, Oct. 2007.

Reid, M., Punch, J., Collins, M., and Ryan, C., "Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys," Soldering & Surface Mount Technology, vol. 20 no. 4, pp. 3-8, 2008.

Reid, Michael, Collins, Maurice N., Coyle, Richard, and Punch, Jeff, "Surface Finish Effect on Reliability of Lead Free Electronic Assemblies," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 861-866.

Reid, Paul, "Characterizing the Barrel Crack," Printed Circuit Design and Fab , vol. 26 no. 8, pp. 12, Aug. 2009.

Reid, Paul, "Demonstrating the Lead-Free Capability of PCBs," Printed Circuit Design and Manufacture, vol. 23 no. 4, pp. 32-35, Apr. 2006.

Reid, Paul, "Dielectric Material Damage vs. Conductive Anodic Filament Formation," International Conference on Soldering & Reliability 2013 Proceedings , Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.

Reid, Paul, "Dielectric Performance in Lead-Free Assembly," Printed Circuit Design and Fab, vol. 26 no. 3, pp. xx-xx, Mar. 2009.

Reid, Paul, "Lead Free - Impact on Interconnect Reliability," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Reid, Paul, Parry, Gareth, and Andrews, Paul, "Microvia Failure in Lead-Free Assembly, Part 2," Printed Circuit Design and Manufacture, vol. 23 no. 7, pp. 41-43, July 2006.

Reid, Paul, "PCB Dielectric Degradation in Lead-Free Assembly Applications," Printed Circuit Design and Fab, vol. 25 no. 5, pp. 32-36, May 2008.

Reid, Paul, "PWB reliability - the next step," Circuit World, vol. 33 no. 4, pp. 51-59, 2007.

Reid, Paul, "Reid on Reliability: Foiling Foil Cracks," PCB007, Nov. 10, 2010.

Reid, Paul, "Reliability Methodology," Overcoming the Reliability Challenge: An IPC Summit, Andover, MA, Apr. 15, 2008, pp. xx-xx.

Reid, Paul, "The Impact of Lead-Free Processing on Interconnect Reliability," Printed Circuit Design and Manufacture, vol. 24 no. 3, pp. 37-38, Mar. 2007.

Reid, Paul, "Two Methods of Evaluating a Printed Wiring Board's Dielectric Performance in a Lead Free Assembly Environment," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Reiff, Dave, and Bradley, Edwin, "A Novel Mechanical Shock Test Method to Evaluate Lead-Free BGA Solder Joint Reliability," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 1519-1525.

Reignier, C., Lee, D., and De Wet, D., "HVOF sprayed WC-Co-Cr as a generic coating type for replacement of hard chrome plating," International Thermal Spray Conference, Essen, Germany, Mar. 4-6, 2002, pp. xx-xx.

Reignier, Carole, "Are HVOF coatings an alternative to hard chrome plating?," TWI, 2004.

Reilly, Francis, "The Power of XRF," Finishing Today, vol. 82 no. 10, pp. 34-36, Oct. 2006.

Reinbold, L., Chason, E., Jadhav, N., Kelly, V., Holmes, P., Shin, J. W., Chan, W. L., Kumar, K. S., and Barr, G., "Degradation in Sn Films due to Whisker Formation," Degradation Processes in Nanostructured Materials (Materials Research Society Symposium Proceedings, vol. 887), Boston, MA, Nov. 28-Dec. 1, 2005, pp. 197-207.

Reinbold, Lucine, Jadhav, Nitin, Chason, Eric, and Kumar, K. Sharvan, "Relation of Sn whisker formation to intermetallic growth: Results from a novel Sn-Cu "bimetal ledge specimen"," Journal of Materials Research , vol. 24 no. 12, pp. 3583-3589, Dec. 2009.

Reinert, W., and Harder, T., "Performance of the Stud Bump Bonding (SBB) Process in Comparison to Solder Flip CHip Technology," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 136-140.

Reinikainen, T., and Kivilahti, J., "Deformation Behavior of Dilute SnBi(0.5 to 6 At. Pct) Solid Solutions," Metallurgical and Materials Transactions A, vol. 30 no. 1, pp. 123-132, Jan. 1999.

Reinikainen, T. O., Marjamaki, P., and Kivilahti, J. K., "Deformation Characteristics and Microstructural Evolution of SnAgCu Solder Joints," Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, Apr. 18-20, 2005, pp. 91-98.

Reinikainen, T., and Kivalahti, J. K., "Mechanical and Microstructural Characteristics of Dilute SnBi and SnBiIn Alloys," Proceedings 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, Brazelton, GA, Mar. 15-18, 1998, pp. 170-174.

Reinikainen, T., and Suhir, E., "Novel Test Methodology for the Most Consistent and Accurate Characterization of Solder Materials in Electronics Engineering," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 87-92.

Reinke, Jeff, "Expansion Resources," Product Design & Development, vol. 63 no. 9, pp. 24, Sept. 2008.

Reinke, Jeff, "Getting To The Source," Product Design & Development, vol. 62 no. 8, pp. 18-20, Aug. 2007.

Reinke, Roger R., "Connecting Liquid Crystal Driver LSIs by Tab-on-Glass and Board-to-Glass Using Heat Seal Connectors and Anisotropic Electrically Conductive Tape," Proceedings 1993 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 2105), Dallas, TX, Nov. 9-11, 1993, pp. 241-248.

Reinke, Roger R., "Interconnection Method of Liquid Crystal Driver LSIs by Ton-on-Glass and Board to Glass Using Anisotropic Conductive Film and Monosotropic Heat Seal Connectors," 1991 Proceedings 41st Electronic Components & Technology Conference, Atlanta, GA, May 11-16, 1991, pp. 355-361.

Reinosa, Rosa D., "Effect of Lead Free Solders on In-Circuit Test Process," 2005 IEEE International Test Conference, Austin, TX, Nov. 8-10, 2005, pp. 26.3-1-26.3-7.

Reinosa, Rosa D., "Lead Free Through Hole Technology (THT) and Contact Repeatability in In-Circuit Test," 2006 IEEE International Test Proceedings, Santa Clara, CA, Oct. 24-26, 2006, pp. 5.3-1-5.3-10.

Reisch, Marc S., "Waste Not, Want Not," Chemical & Engineering News, vol. 82 no. 26, pp. 28-29. June 28, 2004.

Reiss, Howard, "Recent Developments in Nucleation Theory," Zeitschrift fur Elektrochemie Berichte der Bunsengesellschaft fur Physikalische Chemie, vol. 56 no. 5, pp. 459-464, 1952.

Rekers, Henry, "Case Study - Head in Pillow Defect on a Plastic Ball Grid Array," International Conference on Soldering & Reliability 2015 Proceedings , Toronto, Ontario, Canada, May 19-21, 2015, pp. xx-xx.

Ren, Dahai, Yang, Zhenheng, Chang, Yina, Dai, Zhenyu, and You, Zheng, "Fabrication of Bi2Te3 nanowires applied in thermoelectric generators," Key Engineering Materials, vol. 609-610, pp. 306-310, Apr. 2014.

Ren, F., Nah, J. W., Suh, J. O., Tu, K. N., Xiong, B. S., Xu, L. H., and Pang, J. H. L., "Effect of Electromigration on Mechanical Behavior of Solder Joints," 2005 IEEE/CPMT 10th International Symposium on Advanced Packaging Materials , Irvine, CA, Mar. 16-18, 2005, pp. 66-69.

Ren, Fei, Nah, Jae-Woong, Gan, Hua, Suh, Jong-ook, Tu, King-Ning, Xiong, Bingshou, Xu, Luhua, and Pang, John, "Effect of Electromigration on Mechanical Behavior of Solder Joints," Materials Research Society Symposia Proceedings Volume 863, 1994, pp. B10,2,1-B10.2.5.

Ren, Fei, Nah, Jae-Woong, Gan, Hua, Suh, Jong-ook, Tu, King-Ning, Xiong, Bingshou, Xu, Luhua, and Pang, John, "Effect of Electromigration on Mechanical Behavior of Solder Joints," Materials, Technology and Reliability of Advanced Interconnects - 2005 (Materials Research Society Symposium Proceedings Volume 863), San Francisco, CA, Mar. 28-Apr. 1, 2005, pp. 369-373.

Ren, Fei, Xu, Luhua, Zhang, Xi, Nah, Jae-Woong, Pang, John H. L., and Tu, K. N., "In-Situ Study of the Effect of Electromigration on Strain Evolution and Mechanical Property Change in Lead-free Solder Joints," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1160-1163.

Ren, Guang, Wilding, Ian J., and Collins, Maurice N., "Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections," Journal of Alloys and Compounds, vol. 665, pp. 251-260, Apr. 25, 2016.

Ren, Jing, Huang, Mingliang, and Yang, Xudong, "Effect of Ag element on microstructure and mechanical properties of Sn-Bi-xAg solders designed by cluster-plus-glue-atom model," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 265-269.

Ren, W., Qian, Z., Liu, M., Liu, S., and Shangguan, D., "Investigation of a New Lead-Free Solder Alloy Using Thin Strip Specimens," Journal of Electronic Packaging, vol. 121 no. 4, pp. 271-274, Dec. 1999.

Ren, Wei, Qian, Zhengfang, Lu, Minfu, Liu, Sheng, and Shangguan, Dongkai, "Thermal Mechanical Properties of Two Solder Alloys," Applications of Experimental Mechanics to Electronic Packaging, Proceedings of the 1997 ASME International Mechanical Engineering Congress and Exposition, EEP-Vol. 22 AMD-Vol. 226, Dallas, TX, Nov. 16-21, 1997, pp. 125-130.

Ren, Wei, Qian, Zhengfang, and Liu, Sheng, "Thermo-mechanical Creep of Two Solder Alloys," 1998 Proceedings 48th Electronic Components & Technology Conference, Seattle, WA, May 25-28, 1998, pp. 1431-1437.

Ren, Yong, Wang, Jianbo, Liu, Qingfang, Dai, Yingying, Zhang, Bin, and Yan, Longgang, "Tailoring coercivity and magnetic anisotropy of Co nanowire arrays by microstructure," Journal of Materials Science, vol. 46 no. 23, pp. 7545-7550, Dec. 2011.

Ren, Zhaodi, Hao, Peng, Du, Jun, Han, Gaorong, Weng, Wenjian, Ma, Ning, and Du, Piyi, "Self-assembly of TiSi nanowires on TiSi2 thin films by APCVD," Journal of Alloys and Compounds, vol. 509 no. 27, pp. 7519-7524, July 7, 2011.

Renard, C., Boukhicha, R., Gardes, C., Fossard, F., Yam, V., Vincent, L., Bouchier, D., Hajjar, S., Bubendorff, J. L., Garreau, G., and Pirri, C., "Size effect on Ge nanowires growth kinetics by the vapor-liquid-solid mechanism," Thin Solid Films, vol. 520 no. 8, pp. 3314-3318, Feb. 1, 2012.

Renavikar, Mukul P., Patel, Neha, Dani, Ashay, Wakharkar, Vijay, Arrigotti, George, Vasudevan, Vasu, Bchir, Omar, Alur, Amruthavalli P., Gurumurthy, Charan K., and Stage, Roger W., "Materials Technology for Environmentally Green Micro-electronic Packaging," Intel Technology Journal, vol. 12 no. 1, pp. 1-15, Feb.2008.

Rendleman, John, "Launch Precedes Satellite Outage," PC Week, vol. 15 no. 21, pp. 28, May 25, 1998.

Reno, J. L., and Stephenson, L. L., "Effect of growth conditions on the stability of a-Sn grown on CdTe by molecular beam epitaxy," Applied Physics Letters, vol. 54 no. 22, pp. 2207-2209, May 29, 1989.

Reno, Robert C., and Takacs, Laszlo, "Mossbauer Parameters Describing Several Intermetallic Phases in Tin-Containing Solders," Materials Research Society Symposia Proceedings Volume 323, Boston, MA, Nov. 29-Dec. 3, 1993, pp. 201-206.

Renou, Bernard, "Approach and Return of Experience on Lead Free Introduction in Various Industrial Sectors," 8th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Noordwijk, the Netherlands, May 10-12, 2017, pp. xx-xx.

Renta, Lorraine M., Valentin, Ricky, Quintero, Pedro, Ma, David, and Hovland, Alan, "Study of the Thermomechanical Inelastic Energy Response of Backward Compatible Solder Joints Made with Sn-3.8Ag-0.7Cu Versus Reballed Sn37.0Pb Components," Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, Volume 1, Portland, OR, July 6-8, 2011, pp. 123-129.

Renz, R. P., Fortman, J. J., Taylor, E. J., and Inman, M. E., "A Functional Trivalent Chromium Process to Replace Hexavalent Chromium Plating," Proceedings 2003 AESF/EPA Conference for Environmental & Process Excellence, Daytona, FL, Feb. 3-7, 2003, pp. 196-207.

Renz, R. P., Fortman, J. J., Taylor, E. J., and Inman, M. E., "Electrically Mediated Process for Functional Trivalent Chromium to Replace Hexavalent Chromium: Scale-up for Manufacturing Insertion," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 382-394.

Renz, R. P., Fortman, J. J., and Taylor, E. J., "Electrically Mediated Process for Functional Trivalent Chromium to Replace Hexavalent Chromium: Scale-Up for Manufacturing Insertion," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 330-344.

Renz, R. P., Fortman, J. J., Taylor, E. J., and Inman, M. E., "Electrically Mediated Process For Functional Trivalent Chromium To Replace Hexavalent Chromium: Scale-up for Manufacturing Insertion," Plating & Surface Finishing, vol. 90 no. 6, pp. 52-59, June 2003.

Renz, R. P, Fortman, J. J., Taylor, E. J., and Inman, M. E., "Electrodeposition of Hard, Functional Chromium from a Trivalent Bath, to Replace Hexavalent Chromium Plating," International Surface Engineering Congress - Proceedings of the 1st Congress, Columbus, OH, Oct. 7-10, 2003, pp. 174-180.

Renz, R. P., Zhou, C. D., Taylor, E. J., Marshall, R. G., Stortz, E. C., and Grant, B., "Functional Chromium Plating from a Trivalent Chromium Bath," Proceedings AESF SUR/FIN '96, Cleveland, OH, June 10-13, 1996, pp. 439-448.

Renz, R. P., Zhou, C. D., Taylor, E. J., Stortz, E. C., and Grant, B. J., "Functional Chromium Plating from a Trivalent Chromium Bath," 18th AESF/EPA Pollution Prevention and Control Conference, Orlando, FL, Jan. 27-29, 1997, pp. 115-123.

Renz, R. P., Fortman, J. J., and Taylor, E. J., "Functional Trivalent Chromium Plating: An Alternative to Functional Hexavalent Chromium Plating," Proceedings 2004 AESF/EPA Conference for Environmental & Process Excellence, Orlando, FL, Jan. 26-29, 2004, pp. 85-98.

Renz, R. P., Taylor, E. J., and Inman, M. E., "Investigation of a Functional Trivalent Chromium Plating Process," 22nd AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 29-Feb. 1, 2001, pp. xx-xx.

Renz, R. P., Fortman, J. J., and Taylor, E. J., "Plating from a Functional Trivalent Chromium Bath to Replace Hexavalent Chromium Plating," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 504-518.

Renz, R. P., Miller, P. O., Taylor, E. J., Zhou, C. D., and Richardson, R. A., "Validation of a Functional Trivalent Chromium Plating Process," 21st AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 17-19, 2000, pp. 155-160.

Retnasamy, Vithyacharan, Sauli, Zaliman, Nor, Nurul Izza Mohd, Palianysamy, Moganraj, Ismail, Rizalafande Che, Say, Ong Tee, and Kamarudin, Hussin, "Different Shear Height Stress Evaluation on -0.7Cu Based Lead Free Solder," 2013 UKSim 15th International Conference on Computer Modelling and Simulation, Cambridge, United Kingdom, Apr. 10-12, 2013, pp. 317-320.

Rettenmayr, M., Lambracht, P., Kempf, B., and Graff, M., "High Melting Pb-Free Solder Alloys for Die-Attach Applications," Advanced Engineering Materials, vol. 7 no. 10, pp. 965-969, Oct. 2005.

Rettenmayr, M., Lambracht, P., Kempf, B., and Tschudin, C., "Zn-Al Based Alloys as Pb-Free Solders for Die Attach," Journal of Electronic Materials, vol. 31 no. 4, pp. 278-285, Apr. 2002.

Reuter, M. A., van Schaik, A., Ignatenko, O., and de Haan, G. J., "Fundamental limits for the recycling of end-of-life vehicles," Minerals Engineering, vol. 19 no. 5, pp. 433-449, Apr. 2006.

Reuter, Markus A., and Verhoef, Ewoud V., "A Dynamic Model for the Assessment of the Replacement of Lead in Solders," Journal of Electronic Materials, vol. 33 no. 12, pp. 1567-1580, Dec. 2004.

Reuter, Markus, and van Schaik, Antoinette, "Thermodynamic Metrics for Measuring the "Sustainability" of Design for Recycling," JOM, vol. 60 no. 8, pp. 39-46, Aug. 2008.

Rexius, Kristopher, Hossan, Robert, Mhetar, Vijay, and Rajamani, Vijay, "Non-halogenated Thermoplastic for Automotive Wire Insulation," Proceedings of the 54th International Wire and Cable Symposium, Providence, RI, Nov. 13-16, 2005, pp. 224-228.

Reyes-Gasga, J., Elechiguerra, J. L., Liu, C., Camacho-Bragado, A., Montejano-Carrizales, J. M., and Yacaman, M. Jose, "On the structure of nanorods and nanowires with pentagonal cross-sections," Journal of Crystal Growth, vol. 286 no. 1, pp. 162-172, 1 Jan. 2006.

Reynolds, Chris C., "Environmentally Friendly Lead-free Takes the Lead," Advanced Packaging, vol. 12 no. 10, pp. 21, Oct. 2003.

Reynolds, Chris, "Global environmental initiatives," Electronic Products, vol. 49 no. 3, pp. 53-54, Aug. 2006.

Reynolds, Chris, "Lead-Free... ...A Passive Manufacturer's Perspective," CARTS , Apr. 2003.

Reynolds, Chris, "RoHS - A Material Retrospective," Green SupplyLine, Sept. 10, 2005.

Reynolds, Chris, "RoHS and the Supply Chain," Circuits Assembly, vol. 16 no. 7, pp. 26, July 2005.

Reynolds, Chris, "Tin-lead components alive and well in the military sector," Military & Aerospace Electronics, Jan. 2008.

Reynolds, H. L., Kang, S. H., and Morris Jr., J. W., "The Creep Behavior of In-Ag Eutectic Solder Joints," Journal of Electronic Materials, vol. 28 no. 1, pp. 69-75, Jan. 1999.

Reynolds, Heidi L., and Hilty, Robert, "Investigations of Zinc Whiskers using FIB Technology," IPC/JEDEC Lead Free North America Conference, Boston, MA, Dec. 3, 2004.

Reynolds, Heidi L., and Hilty, Robert, "Investigations of Zinc (Zn) Whiskers using FIB Technology," IPC/JEDEC Lead Free North America Conference, Boston, MA, Dec. 3, 2004, pp. xx-xx.

Reynolds, Heidi L., Osenbach, John W., Henshall, Gregory, Parker, Richard D., and Su, Peng, "Tin Whisker Test Development- Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 1, pp. 1-15, Jan. 2010.

Reynolds, Melanie, "Finding advice on lead-free," Electronics Weekly, Feb. 25, 2005.

Reynolds, Melanie, "Lead-free alloys analysed for thermal performance," Electronics Weekly, June 18, 2003.

Reynolds, Melanie, "Lead-free: Recipe for compliance," Electronics Weekly, Nov. 3, 2004.

Reynolds, Melanie, "Proposed CE-mark forces change," electronicsweekly.com, Oct. 7, 2004.

Reynolds, Melanie, "UK must go lead-free to boost competitive edge," electronicsweekly.com, Mar. 29, 2000.

Reynolds, Melanie, "Waste not, want not," Electronics Weekly, Sept. 8, 1999.

Reynolds, Melanie, "What will WEEE and RoHS Directives mean to you?," ElectronicsWeekly.com, Aug. 3, 2005.

Reynolds, Quentin, "Lead Free - A European Perspective for Hybrid and Component Materials," Proceedings of the 37th International Symposium on Microelectronics , Long Beach, CA, Nov. 14-18, 2004, pp. xx-xx.

Reynolds, Ralph., "Optimizing TAB bonding to flat panel displays using design of experiments," Proceedings of SPIE - The International Society for Optical Engineering, Volume 2734, Orlando, FL, Apr. 8-12, 1996, pp. 75-84.

Reza, Shahed, Bosman, Gijs, Islam, M. Saif, Kamins, Theodore I., Sharma, Shashank, and Williams, R. Stanley, "Noise in Silicon Nanowires," IEEE Transactions on Nanotechnology , vol. 5 no. 5, pp. 523-529, Sept. 2006.

Rezvani, S. J., Favre, L., Celegato, F., Boarino, L., Berbezier, Isabelle, and Pinto, N., "Supersaturation state effect in diffusion induced Ge nanowires growth at high temperatures," Journal of Crystal Growth, vol. 436, pp. 51-55, Feb. 15, 2016.

Rezvanian, Omid, and Zikry, Mohammed A., "Continuum modeling of large-strain deformation modes in gold nanowires," Journal of Materials Research, vol. 26 no. 17, pp. 2286-2292, Sept. 14, 2011.

Rhee, H., Guo, F., Lee, J. G., Chen, K. C., and Subramanian, K. N., "Effects of Intermetallic Morphology at the Metallic Particle/Solder Interface on Mechanical Properties of Sn-Ag-Based Solder Joints," Journal of Electronic Materials, vol. 32 no. 11, pp. 1257-1264, Nov. 2003.

Rhee, H., and Subramanian, K. N., "Effects of Prestrain, Rate of Prestrain, and Temperature on the Stress-Relaxation Behavior of Eutectic Sn-3.5Ag Solder Joints," Journal of Electronic Materials, vol. 32 no. 11, pp. 1310-1316, Nov. 2003.

Rhee, H., Subramanian, K. N., Lee, A., and Lee, J. G., "Mechanical characterization of Sn-3.5Ag solder joints at various temperatures," Soldering & Surface Mount Technology, vol. 15 no. 3, pp. 21-26, 2003.

Rhee, H., Lucas, J. P., and Subramanian, K. N., "Micromechanical characterization of thermomechanically fatigued lead-free solder joints," Journal of Materials Science: Materials in Electronics , vol. 13 no. 8, pp. 477-484, Aug. 2002.

Rhee, H., Subramanian, K. N., and Lee, A., "Role of imposed cyclic straining on the stress relaxation behavior of eutectic Sn-3.5Ag solder joints," Journal of Materials Science: Materials in Electronics, vol. 16 no. 3, pp. 169-176, Mar. 2005.

Rhee, H., and Subramanian, K. N., "Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation behaviour of pre-strained eutectic Sn-3.5Ag solder joints," Soldering & Surface Mount Technology, vol. 18 no. 1, pp. 19-28, 2006.

Rheem, Youngwoo, Hangarter, Carlos M., Yang, Eui-Hyeok, Park, Deok-Yong, Myung, Nosang V., and Yoo, Bongyoung, "Site-Specific Magnetic Assembly of Nanowires for Sensor Arrays Fabrication," IEEE Transactions on Nanotechnology, vol. 7 no. 3, pp. 251-255, May 2008.

Rhodes, Christopher, "Get a Jump on the Lead Ban," Surface Mount Technology (SMT), vol. 13 no. 8, pp. 62-64, Aug. 1999.

Ri, Shien, and Saka, Masumi, "Diffusion-fatigue interaction effect on hillock formation in aluminum thin films under thermal cycle testing," Materials Letters, vol. 79, pp. 139-141, July 15, 2012.

Riani, Paola, Cacciamani, Gabriele, Parodi, Nadia, Borzone, Gabriella, Marazza, Rinaldo, Nanni, Francesca, and Gusmano, Gualtiero, "Phase equilibria in the In-Sn-rich part of the Cu-In-Sn ternary system," Journal of Alloys and Compounds, vol. 487 no. 1-2, pp. 90-97, Nov. 13, 2009.

Ribas, Morgana, Kumar, Anil, Pandher, Ranjit, Raut, Rahul, Mukherjee, Sutapa, Sarkar, Siuli, and Singh, Bawa, "Comprehensive Report on Low Temperature Solder Alloys for Portable Electronics," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 176-183.

Ribas, Morgana, Chegudi, Sujatha, Kumar, Anil, Pandher, Ranjit, Raut, Rahul, Mukherjee, Sutapa, Sarkar, Siuli, and Singh, Bawa, "Development of Low-Temperature Drop Shock Resistant Solder Alloys for Handheld Devices," 2013 IEEE 15th Electronics Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp. 48-52.

Ribas, Morgana, Kumar, Anil, Rangaraju, Raghu R., Kosuri, Divya, Choudhury, Pritha, Sarkar, Siuli, Pandher, Ranjit, and Hunsinger, Tom, "Effect of Thermal-Mechanical Stresses on the Reliability of Lead-Free Low Silver Alloys," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 606-612.

Ribas, Morgana, Sarkar, Siuli, Bilgrien, Carl, and Hunsinger, Tom, "Effect of Voids on Thermo-Mechanical Reliability of Solder Joints," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 667-673.

Ribas, Morgana, Kumar, Anil, Augustine, Prathap, Choudhury, Pritha, and Sarkar, Siuli, "High-Reliability, Fourth Generation Low-Temperature Solder Alloys," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 364-372.

Ribas, Morgana, Kumar, Anil, Augustine, Prathap, Choudhury, Pritha, and Sarkar, Siuli, "High-Reliability, Fourth-Generation Low-Temperature Solder Alloys," Printed Circuit Design and Fab/ Circuits Assembly, vol. 37 no. 12, pp. 34-39, Dec. 2020.

Ribas, Morgana, Telu, Suresh, Augustine, Prathap, Rangaraju, Raghu R., Kumar, Anil, Kosuri, Divya, Choudhury, Pritha, Sarkar, Siuli, Bumagat, Rommel T., Lim, Garian, and Sobczak, Martin, "High Thermo-Mechanical Fatigue and Drop Shock Resistant Alloys for Ball-Grid Array Package Applications," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 204-209.

Ribas, Morgana, Vangapandu, Bhaskar, Rangaraju, Raghu Raj, Telu, Suresh, Pai, Laxminarayana, Kumar, Ramesh, Patil, Vikas, Ramakrishna, H. V., Cucu, Traian, and Sarkar, Siuli, "Low Temperature Soldering: Reflow Optimization for Enhanced Mechanical Reliability," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Ribas, Morgana, Kumar, Anil, Kosuri, Divya, Rangaraju, Raghu R., Choudhury, Pritha, Telu, Suresh, and Sarkar, Siuli, "Low Temperature Soldering Using Sn-Bi Alloys," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 201-206.

Ribas, Morgana, Chegudi, Sujatha, Kumar, Anil, Pandher, Ranjit, Raut, Rahul, Mukherjee, Sutapa, Sarkar, Siuli, and Singh, Bawa, "Thermal and Mechanical Reliability of Low-Temperature Solder Alloys for Handheld Devices," 2014 IEEE 16th Electronics Packaging Technology Conference, Singapore, Dec. 3-5, 2014, pp. 366-371.

Ribas, Morgana, Chegudi, Sujatha, Kumar, Anil, Mukherjee, Sutapa, Sarkar, Siuli, Pandher, Ranjit, Raut, Rahul, and Singh, Bawa, "Low Temperature Alloy Development for Electronics Assembly - Part II," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 695-700.

Ribas, Morgana, Lim, Garian, Bumagat, Rommel T., Kumar, Anil, Kosuri, Divya, Augustine, Prathap, Choudhury, Pritha, Rangaraju, Raghu R., Telu, Suresh, Sarkar, Siuli, Sobczak, Martin, and Singh, Bawa, "Wafer Level CSP with Ultra-High Thermal Reliability Lead-Free Alloys," 2015 IEEE 17th Electronics Packaging and Technology Conference, Singapore, Dec. 2-4, 2015, pp. xx-xx.

Rice-Evans, P. C., Moussavi-Madani, M., El Khangi, F. A. R., and Rao, K. U., "Positron annihilation study of lattice defects and phase transitions in tin," Philosophical Magazine A, vol. 52 no. 4, pp. 431-439, 1985. https://doi.org/10.1080/01418618508237637

Ricci, Bill, and Liu, George, "RoHS: The Supply Chain Challenge," Circuitree, vol. 19 no. 6, pp. xx-xx, June 2006.

Ricci, Lawrence, "In designs for RoHS, think platform," EE Times, Oct. 23, 2006.

Richards, B. P., Levoguer, C. L., Hunt, C. P., Nimmo, K., Peters, S., and Cusack, P., "An Analysis of the Current Status of Lead-Free Soldering. A Summary Report," NPL Report CMMT(A)168, Jan. 1999.

Richards, B. P., Levoguer, C. L., Hunt, C. P., Nimmo, K., Peters, S., and Cusack, P., "An Analysis of the Current Status of Lead-Free Soldering," NPL Report CMMT(A)170, Jan. 1999.

Richards, B. P., Levoguer, C. L., Hunt, C. P., Nimmo. K., Peters, S., and Cusack, P. "An Analysis of the Current Status of Lead-Free Soldering," DTI, Jan. 1999.

Richards, B., "Environmental Management in Electronics Manufacturing," Circuit World , vol. 23 no. 4, pp. 16-21, 1997.

Richards, Benjamin T., Schraer, Samuel R., McShane, Eric J., Quintana, Jacob, Levin, Barnaby D. A., Muller, David A., and Hanrath, Tobias, "Reaction Kinetics of Germanium Nanowire Growth on Inductively Heated Copper Surfaces," Chemistry of Materials, vol. 29 no. 11, pp. 4792-4800, June 13, 2017.

Richards, Brian, "Lead-free Legislation."

Richards, Brian, and Levoguer, Carl, "Lead-Free Soldering: An Overview," SMART Group Lead-Free Seminar 1999 , High Wycombe, UK, Feb. 10, 1999.

Richards, Brian, "Lead-free soldering - world's apart?," Electronic Packaging & Production.

Richards, Brian, "NPL - ITRI - DTI Status Report - The Future," SMART Group Lead-Free Seminar 2000, High Wycombe, UK, Feb. 10, 2000.

Richards, Brian, "The Reality of Lead-free Soldering," Materials World, vol. xx no. xx, pp. xx-xx.

Richards, Brian, "Unleading the Way," Materials World, vol 9 no. 1, pp. 19-21, Jan. 2001.

Richards, Ted, "REACH and EuP Directives: Business Impact and Risk Mitigation," 2006 IEEE Symposium on Product Safety & Compliance Engineering, Irvine, CA, Oct. 23-24, 2006, pp. xx-xx.

Richesin, Terrance, and East, Rick, "Halogen Free Materials Expectations," Intel Halogen Free Symposium , Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Richter, Christian, and Hannapel, Jeff, "Green Chemistry Legislation in Congress and Chemical Regulation in Europe," Plating & Surface Finishing, vol. 94 no. 10, pp. 8-9, Oct. 2007.

Richter, Christian, "Settlement on Chrome PEL Rule Spares Industry Costly Litigation," Metal Finishing, vol. 104 no. 11, pp. 46-47, Nov. 2006.

Richter, Curt A., Xiong, Hao D., Zhu, Xiaoxiao, Wang, Wenyong, Stanford, Vincent M., Hong, Woong-Ki, Lee, Takhee, Ioannou, Dimitris E., and Li, Qiliang, "Metrology for the Electrical Characterization of Semiconductor Nanowires," IEEE Transactions on Electron Devices, vol. 55 no. 11, pp. 3086-3095, Nov. 2008.

Richter, Gunther, Hillerich, Karla, Gianola, Daniel S., Monig, Reiner, Kraft, Oliver, and Volkert, Cynthia A., "Ultrahigh Strength Single Crystalline Nanowhiskers Grown by Physical Vapor Deposition," Nano Letters, vol. 9 no. 8, pp. 3048-3052, 2009.

Richter, Jessica, Steenmann, Anna, Schellscheidt, Benjamin, Licht, Thomas, and Madler, Ralph, "Tilting Behavior and Phase Formation of Sn-Cu Composite Solder for Large Area Baseplate Solder Joints," 2019 22nd European Microelectronics and Packaging Conference & Exhibition, Pisa, Italy, Sept. 16-19, 2019. pp. xx-xx.

Rickett, B., Elmgren, P., Flowers, G., Gale, S., and Suhling, J., "Potential for Whisker Formation in Lead-Free Electroplated Connector Finishes," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 707-716.

Rickett, B., Elmgren, P., Flowers, G., Gale, S., and Suhling, J., "Whisker Formation Potential in Pb-Free Electroplated Connector Finishes," Circuits Assembly, vol. 16 no. 2, pp. 52-59, Feb. 2005.

Riddle, Kenneth A., "Tin Plating Versus Silver Plating and the Use of Silver Alloys on Electrical Equipment for the Paper Industry," Conference Record of 1990 Annual Pulp and Paper Industry Technical Conference, Seattle, WA, June 18-22, 1990, pp. 32-36.

Ridout, S., and Bailey, C., "Review of methods to predict solder joint reliability under thermo-mechanical cycling," Fatigue and Fracture of Engineering Materials and Structures , vol. 30 no. 5, pp. 400-412, May 2007.

Ridout, Stephen, Dusek, Milos, Bailey, Chris, and Hunt, Chris, "Assessing the performance of crack detection tests for solder joints," Microelectronics Reliability, vol. xx no. xx, pp. xx-xx, 2006.

Riedel, W., "Uber die struktur und die Eigenschaften elektrolytisch abgeschiedener Zinn-Blei-Legierungen," Metalloberflaeche, vol. 23 no. 2, pp. 42-44, Feb. 1969.

Rieger, Torsten, Heiderich, Sonja, Lenk, Steffi, Lepsa, Mihail Ion, and Grutzmacher, Detlev, "Ga-assisted MBE growth of GaAs nanowires using thin HSQ layer," Journal of Crystal Growth, vol. 353 no. 1, pp. 39-46, Aug. 15, 2012.

Rieger, Torsten, Grutzmacher, Detlev, and Lepsa, Mihail Ion, "InAs nanowires with AlxGa1-xSb shells for band alignment engineering," Journal of Crystal Growth, vol. 425, pp. 80-84, Sept. 1, 2015.

Riemer, D. E., "An Engineering Approach to Thermal-stress Analysis in SMT Applications," Soldering & Surface Mount Technology, vol. 1 no. 3, pp. 11-20, 1989.

Rifkin, Erik, Gwinn, Patrick, and Bouwer, Edward, "Chromium and Sediment Toxicity," Environmental Science & Technology vol. 38 no. 14, pp. 267A-271A, 2004.

Riley, George A., "Adhesive Flip Chip Assembly Using Plated Bump Chips," Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, Oct. 13-15, 1997, pp. 313-318.

Riley, George, "Avoiding Lead-Free Brittle Failures," flipchips.com, May 2008.

Riley, George, "C4NP Preliminary Test Data," flipchips.com, May 2006.

Riley, George A., "Discovering Gold as a Lead-free Substitute," Advanced Packaging , vol. 14 no. 10, pp. 36, Oct. 2005.

Riley, George A., "Eutectic Wafer Bonding for Hermetic Seals," flipchips.com, Mar. 2009.

Riley, George A., "Flip Chip's Midlife Crisis," Advanced Packaging, vol. 17 no. 4, pp. 20-22, Apr. 2008.

Riley, George A., "Lead-Free Solder Bumping Methods ," flipchips.com, Mar. 2006.

Riley, George A., "Lower temperature lead-free flip chip," flipchips.com, Jan. 2006.

Riley, George, "Optoelectronic Flip Chip Assembly," flipchips.com, Sept. 2010.

Riley, George A., "RoHS Report Excludes Comparisons," Advanced Packaging Online Article.

Riley, George A., "Solder Bumping: Mastering Challenges of Lead-free Alloys," Advanced Packaging, vol 14 no. 11, pp. 16-17.20, Nov. 2005.

Riley, George A., "Solderless Copper Assembly," flipchips.com, Oct. 2007.

Riley, George A., "The $38 Billion Blunder," Advanced Packaging Online Article.

Riley, George A., "The Folly of RoHS," FlipChips.com

Riley, George A., "The Perils of RoHS," Advanced Packaging, vol. 15 no. 11, pp. 48, Nov./Dec. 2006.

Ring, Karl, "Reliability Issues with Leadfree Solders," 2nd Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Paris, France, May 4, 2011.

Rinne, C. Lizzul, Hren, John J., and Fedkiw, Peter S., "Electrodeposition of Tin Needle-Like Structures," Journal of the Electrochemical Society, vol. 149 no. 3, pp. C150-C158, Feb. 2002.

Rinne, Glenn, "Challenges of Going Halogen-free on the FC FLI," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Rinne, Glenn A., "Electromigration in SnPb and Pb-Free Solder Bumps," 2004 Proceedings 54th Electronic Components & Technology Conference, Volume 1 , New Orleans, May 27-30, 2004, pp. 974-978.

Rinne, Glenn A., and Nair, Krishna K., "Lead-free is Not Alpha-free - Why WLCSPS Should Care about Alpha Particles," Wafer-Level Congress and Exhibition Conference Proceedings, San Jose, CA, Oct. 10-12, 2004, pp. xx-xx.

Rinne, Glenn, Rosson, Jim, Paugh, Michael, and Schuckert, Craig C., "Reaching Detente in the Design and Material Selection for Hi Rel WLCSP's," 54th Electronic Components & Technology Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1499-1505.

Rinne, Glenn A., "Tin Pest in Tin-rich Solders," Advanced Packaging, vol. 15 no. 11, pp. 32, 34, Nov./Dec. 2006.

Rist, Martin A., Plumbridge, W. J., and Cooper, S., "Creep-Constitutive Behavior of Sn-3.8Ag-0.7Cu Solder Using an Internal Stress Approach," Journal of Electronic Materials, vol. 35 no. 5, pp. 1050-1058, May 2006.

Rist, Martin, "Modelling solder deformation: the internal state-variable approach," Structural Integrity & Reliability in Lead-Free, United Kingdom, Mar. 25, 2004.

Riter, Bill, "Ask the EMPF Helpline!," empfasis, pp. 4, 11, Apr. 2007.

Riva, Julieta S., Juarez, Andrea V., Urreta, Silvia E., and Yudi, Lidia M., "Catalytic properties of Fe-Pd ferromagnetic nanowires at liquid/liquid interfaces," Electrochimica Acta, vol. 298, pp. 379-388, Mar. 1, 2019.

Riva, Julieta S., Pozo-Lopez, Gabriela, Condo, Adriana M., Levingston, Jorge M., Fabietti, Luis M., and Urreta, Silvia E., "Magnetic viscosity in iron-rhodium nanowires," Journal of Alloys and Compounds, vol. 709, pp. 531-534, June 30, 2017.

Rivlin, Kenneth S., Brisson, Jean-Philippe, and Wharwood, David, "Preparing for the WEEE Directive," Circuits Assembly, vol. 16 no. 4, pp. 40, Apr. 2005.

Rivlin, Kenneth S., and Brisson, Jean-Philippe, "WEEE and RoHS Basics, Update and Open Issues," NEMI RoHS/Pb-Free Summit, Oct. 18-20, 2004.

Rivlin, Kenneth S., Brisson, Jean-Philippe, and Wharwood, David, "WEEE and RoHS Directives: New Requirements Impacting the Global Supply Chain of the High-Tech Industry."

Rizvi, J., Yin, C., Bailey, C., and Lu, H., "Modelling the Reliability of Components on Flexible Substrates," Proceedings of the ASME InterPack Conference, Volume 1, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 375-380.

Rizvi, M. J., Bailey, C., Chan, Y. C., and Lu, H., "Comparative Wetting Behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni Solders on Cu and Ni Substrates," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 145-151.

Rizvi, M. J., Bailey, C., and Lu, H., "Damage predictions in a chip resistor solder joint on flexible circuit board," Microelectronic Engineering, vol. 87 no. 10, pp. 1889-1895, Oct. 2010.

Rizvi, M. J., Bailey, C., Chan, Y. C., and Lu, H., "Effect of adding 0.3 wt% Ni into the Sn-0.7 wt%Cu solder: Part I: Wetting behavior on Cu and Ni substrates," Journal of Alloys and Compounds , vol. 438 no. 1-2, pp. 116-121, July 12, 2007.

Rizvi, M. J., Bailey, C., Chan, Y. C., Islam, M. N., and Lu, H., "Effect of adding 0.3 wt% Ni into the Sn-0.7 wt% Cu solder: Part II. Growth of intermetallic layer with Cu during wetting and aging," Journal of Alloys and Compounds, vol. 438 no. 1-2, pp. 122-128, July 12, 2007.

Rizvi, M. J., Chan, Y. C., Bailey, C., Lu, H., and Islam, M. N., "Effect of adding 1 wt% Bi into the Sn-2.8Ag-0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging," Journal of Alloys and Compounds, vol. 407 no. 1-2, pp. 208-212, Jan. 5, 2006.

Rizvi, M. J., Bailey, C., Chan, Y. C., and Lu, H., "Effects of Thermal Cycling Profiles on the Performance of Chip-On-Flex Assembly Using Anisotropic Conductive Films," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 2, 2006, pp. 855-860.

Rizvi, M. J., Bailey, C., and Lu, H., "Failure mechanisms of ACF joints under isothermal ageing," Microelectronics Journal, vol. 39 no. 9, pp. 1101-1107, Sept. 2008.

Rizvi, M. J., Lu, H., Bailey, C., Bevan, E., Pountney, N., and Coates, J., "Finite Element Modelling of Failures in Thick Film Chip Resistor Solder Joints," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Rizvi, M. J., Lu, H., and Bailey, C., "Modeling the diffusion of solid copper into liquid solder alloys," Thin Solid Films, vol. 517 no. 5, pp. 1686-1689, Jan. 1, 2009.

Rizvi, M. J., Yin, C. Y., and Bailey, C., "Modeling the Effect of Lead-free Soldering on Flexible Substrates," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Rizvi, M. J., Lu, H., Bailey, C., Chan, Y. C., Lee, M. Y., and Pang, C. H., "Role of bonding time and temperature on the physical properties of coupled anisotropic conductive-nonconductive adhesive film for flip chip on glass technology," Microelectronic Engineering, vol. 85 no. 1, pp. 238-244, Jan. 2008.

Rizvi, M. J., Chan, Y. C., Bailey, C., and Lu, H., "Study of anisotropic conductive adhesive joint behavior under 3-point bending," Microelectronics Reliability, vol. 45 no. 3-4, pp. 589-596, Mar./Apr. 2005.

Rizvi, M. J., Chan, Y. C., Bailey, C., Lu, H., and Sharif, A., "The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing," Soldering & Surface Mount Technology, vol. 17 no. 2, pp. 40-48, 2005.

Rizvi, M. J., Chan, Y. C., Bailey, C., Lu, H., Islam, M. N., and Wu, B. Y., "Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates," Journal of Electronic Materials, vol. 34 no. 8, pp. 1115-1122, Aug. 2005.

Rizzo, Sam, "Evaluating tin whiskers," Green SupplyLine, July 18, 2005.

Roberson, Kris, "Lead-Free Rework in a Mixed Alloy Environment," IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics, Raleigh, NC, Mar. 11-12, 2008, pp. xx-xx.

Roberson, Kris, "Reballing Rework: The Bright New Future," SMT Web Exclusive Article.

Roberson, Kris, "Rework Practices in a Mixed Alloy Environment," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 301-305.

Roberts, E. C., and Lawrence, S. C., "Whisker-on-whisker Growth," Acta Metallurgica, vol. 5 no. 6, pp. 335, June 1957.

Roberts, Hugh, Lamprecht, Sven, Ramos, Gustavo, and Sebald, Christian, "Effect of Process Variations on Solder Joint Reliability for Nickel-Based Surface Finishes," 2008 Pan Pacific Microelectronics Symposium & Exhibit, Kauai, HI, Jan. 22-24, 2008, pp. xx-xx.

Roberts, Hugh, Lamprecht, Sven, Ramos, Gustavo, and Sebald, Christian, "Effect of Process Variations on Solder Joint Reliability for Nickel-Based Surface Finishes," SMTA China East Technical Conference 2008, Shanghai, China, Apr. 8-10, 2008, pp. xx-xx.

Roberts, Hugh, Lamprecht, Sven, Ramos, Gustavo, and Sebald, Christian, "Effect of Process Variations on Solder Joint Reliability for Nickel-Based Surface Finishes," NEPCON Shanghai 2008, Shanghai, China, Apr. 8-11, 2008, pp. xx-xx.

Roberts, Hugh, Lamprecht, Sven, Bevan, Elaine, Coates, John, and Prosser, Steve, "Immersion Tin as a Cost-Effective and Reliable Surface Finish for Pb-Free Automotive Electronics Applications - Phase II Investigations," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 574-581.

Roberts, Hugh, "Nickel/Palladium/Gold - A Versatile Surface Finish," Surface Mount Technology (SMT), vol. 21 no. 9, pp. 36, Sept. 2007.

Roberts, Hugh, Lamprecht, Sven, Sebald, Christian, Bachman, Mark, Osenbach, John, Desai, Kishor, Huemoeller, Ron, Jung, YoonHa, and Darveaux, Robert, "Performance Evaluations of Surface Finish and Solder Alloy Configurations for BGA Solder Joint Reliability," Pan Pacific Microelectronics Symposium , Mauna Kea, HI, Feb. 10-12, 2009, pp. 248-256.

Roberts, Jordan C., Motalab, Mohammad, Hussain, Safina, Suhling, Jeffrey C., Jaeger, Richard C., and Lall, Pradeep, "Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink Clamping," Journal of Electronic Packaging, vol. 134 no. 3, pp. 031005-1-031005-17, Sept. 2012.

Roberts, Jordan, Hussain, Safina, Suhling, Jeffrey C., Jaeger, Richard C., and Lall, Pradeep, "Characterization of Die Stresses in Microprocessor Packages Subjected to Thermal Cycling," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 1003-1014.

Roberts, Jordan, Hussain, Safina, Rahim, M. Kaysar, Motalab, Mohammad, Suhling, Jeffrey C., Jaeger, Richard C., Lall, Pradeep, and Zhang, Ron, "Characterization of Microprocessor Chip Stress Distributions During Component Packaging and Thermal Cycling," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1281-1295.

Roberts, Jordan C., Rahim, M. Kaysar, Suhling, Jeffrey C., Jaeger, Richard C., Lall, Pradeep, Zhang, Ron, and Jones, James, "Stress Measurements in Large Area Array Flip Chip Microprocessor Chips," 2008 Proceedings 58th Electronic Components & Technology Conference , Lake Buena Vista, FL, May 27-30, 2008, pp. 1462-1471.

Roberts, Laura, and Galanis, Anthony, "Eliminating Hexavalent Chrome," Industrial Paint and Powder, vol. xx no. xx, pp. xx-xx, May 2006.

Roberts, Laura, and Galanis, Anthony, "Non-Chromated Technology Works on Aircraft," Plating & Surface Finishing, vol. 90 no. 10, pp. 8-11, Oct. 2003.

Roberts, Richard W., McElligott, Peter E., and Kilgore, B. F., "Formation of Silicon Whiskers," Journal of Applied Physics, vol. 35, pp. 248, 1964.

Robertson, Chris, Goodman, Paul, Skipper, Robert, and Muzika, Andrew, "A case study of energy dispersive x-ray fluorescence as a tool for RoHS Compliance," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Robertson, Chris, and Goodman, Paul, "A Practical Guide to Compliance with the RoHS Directive," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies , San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Robertson, Chris, "Addressing worldwide environmental requirements on the electronics sector," EMasia, Jan. 2009.

Robertson, Jordan, "'Tin Whiskers' ruin electronics, stoke debate over anti-lead regulations," Dayton Daily News, Oct. 7, 2007, pp. A29.

Robertson, Jordan, "Tiny 'tin whiskers' imperil electronics," USA Today, Oct. 7, 2007.

Robertson, R. Glenn, and Smetana. Joe, "Fundamental Concerns in Lead-Free Implementation," Circuits Assembly , vol. 11 no. 9, pp. 42,44-49, Sept. 2000.

Robertson, R. Glenn, and Smetana, Joe, "Some Fundamental Concerns in Lead-free Implementation," 2000 Lead Free Symposium Conference Proceedings, 2000, pp. xx-xx.

Robins, Mark, "The History of Pb-Free," Electronic Packaging & Production , vol. 40 no. 6, pp. 7-10, June 2000.

Robinson, James J., "In the final analysis," JOM, vol. 59 no. 7, pp. 4, July 2007.

Robinson, Keith, "Impact of Lead-free on the SMT Soldering Equipment Market," Surface Mount Technology (SMT), vol. 18 no. 9, pp. 66-67, Sept. 2004.

Robinson, Marc, "3D Wafer Level Packaging Technology for CIS Applications," SMTA International Wafer-Level Packaging Conference, San Jose, CA, Oct. 13-16, 2008, pp. xx-xx.

Robson, M. T., and LaPierre, R. R., "InAs nanowire growth modes on Si (111) by gas source molecular beam epitaxy," Journal of Crystal Growth, vol. 436, pp. 1-11, Feb. 15, 2016.

Rocak, D., Macek, S., Sitek, J., Hrovat, M., Bukat, K., and Drozd, Z., "A reliability study of the lead-free solder connections of miniature chip components on hybrid circuits," Microelectronics Reliability, vol. 47 no. 6, pp. 986-995, June 2007.

Rochester, Tom, and Kennedy, Zachary W., "Unexpected Results from Corrosion Testing of Trivalent Passivates," Plating & Surface Finishing, vol. 94 no. 10, pp. 14-18, Oct. 2007.

Rock, Markus, "Conductive Bonding on Polyester Foil for the Production of Rigid-Flex Printed Circuit Boards," Rafi Italia.

Rock, Michael T., Angel, David P., and Lim, Pao Li, "Impact of Firm-Based Environmental Standards on Subsidiaries and Their Suppliers: Evidence from Motorola-Penang," Journal of Industrial Ecology , vol. 10 no. 1/2, pp. 257-278, Winter/Spring 2006.

Rodbell, D. S., "Ferromagnetic Resonance of Iron Whisker Crystals," Journal of Applied Physics, vol. 30 no. 4, pp. 187S-188S, Apr. 1959.

Rodbell, K. P., and Ficalora, P. J., "The role of hydrogen in altering the electrical properties of gold, titanium, and tungsten films," Journal of Applied Physics, vol. 65 no. 8, pp. 3107-3117, Apr. 15, 1989.

Rodekohr, C. L., Flowers, G. T., Suhling, J. C., and Bozack, M. J., "Auger Electron Spectroscopic (AES) Measurements on High Aspect Ratio Tin Whiskers," Proceedings of the 54th IEEE Holm Conference on Electrical Contacts, Orlando, FL, Oct. 27-29, 2008, pp. 232-237.

Rodekohr, C. L, Flowers, G. T., Bozack, M. J., Jackson, R., Martens, R., Zhao, Z., Crandall, E. R., Starman, V., Bitner, T., and Street, J., "Correlation of Intrinsic Thin Film Stress Evolution and IMC Growth with Whisker Growth," 2011 IEEE 57th Holm Conference on Electrical Contacts , Minneapolis, MN, Sept. 11-14, 2011, pp. xx-xx.

Rodekohr, C. L., Bozack, M. J., Flowers, G. T., Suhling, J. C., and Rodekohr, D. A., "The Effects of Surface Finish Roughness on Intermetallic Layer Growth, Intermetallic Interface Roughness, and Solder Joint Reliability," 2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts, Charleston, SC, Oct. 4-7, 2010, pp. xx-xx.

Rodelas, Jeff, Susan, Donald F., Pillars, Jamin, Dyer, Isaac, and Soule, Luke, "Cadmium Whisker Growth on Fastener Hardware," 29th Rio Grande Symposium on Advanced Materials, Albuquerque, NM, Oct. 9, 2017, pp. xx-xx. (Sandia Report SAND2017-10901C)

Rodgers, Bryan, Punch, Jeff, Flood, Ben, and Waldron, Finbarr, "Determination of the Anand Viscoplasticity Model Constants for SnAgCu," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B, San Francisco, CA, July 17-22, 2005, pp. 1263-1270.

Rodgers, Bryan, Flood, Ben, Punch, Jeff, and Waldron, Finbarr, "Experimental Determination and Finite Element Model Validation of the Anand Viscoplasticity Model Constants for SnAgCu," Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, Apr. 18-20, 2005, pp. 490-496.

Rodgers, J. M., "Contrast in the Electron Microscope due to Stray Magnetic Fields near Single-Domain Iron Whiskers," Journal of Applied Physics, vol. 38 no. 3, pp. 1301-1303, Mar. 1, 1967.

Rodrigues, Nelson, Ferreira, Ana Cristina, Teixeira, Senhorinha Fatima, Soares, Delfim, Teixeira, Jose Carlos, Cerqueira, Fatima, and Macedo, Francisco, "Contact angle measurement of SAC 305 solder: numerical and experimental approach," Journal of Materials Science: Materials in Electronics , vol. 27 no. 9, pp. 8941-8950, Sept. 2016.

Rodriguez, Rogie I., Ibitayo, Dimeji, and Quintero, Pedro O., "Thermal Stability Characterization of the Au-Sn Bonding for High-Temperature Applications," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 4, pp. 549-557, Apr. 2013.

Roeck, Markus, and Hunt, Ian, "Isotropically Conductive Adhesives for Electronic Manufacture of Flexible Printed Circuit Boards," Proceedings of 3rd Electronics Packaging Technology Conference, Singapore, Dec. 5-7, 2000, pp. 327-334.

Roeder, J. F., Notis, M. R., and Goldstein, J. I., "Compound Formation and Interfacial Instability in the Au-Cu-Sn System at Low Temperature," Defect and Diffusion Forum, vol. 59, pp. 271-278, 1988.

Roellig, Mika, Dudek, Rainer, Wiese, Steffen, Wunderle, Bernhard, Wolter, Klaus-Jurgen, and Michel, Bernd, "Novel Test Concept for Experimental Lifetime Prediction of Miniaturized Lead-Free Solder Contacts," 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, Vienna, Austria, May 19-20, 2005, pp. 257-264.

Roellig, Mike, Metasch, Rene, Meier, Karsten, and Alt, Falko, "Characterization Methods for Determination of Temperature Depended Electrical, Thermal, Mechanical and Fatigue Properties of SnAg3.5 Solder," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Roellig, Mike, Dudek, Rainer, Wiese, Steffen, Boehme, Bjoern, Wunderle, Berhard, Wolter, Klaus-Juergen, and Michel, Bernd, "Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept," Microelectronics Reliability, vol. 47 no. 2-3, pp. 187-195, Feb.-Mar. 2007.

Roellig, Mike, Dudek, Rainer, Wiese, Steffen, Wunderle, Berhard, Wolter, Klaus-Jurgen, and Michel, Bernd, "Novell test concept for experimental lifetime prediction of miniaturized lead-free solder contacts," Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, Apr. 18-20, 2005, pp. 86-90.

Roellig, Mike, Meier, Karsten, and Metasch, Rene, "Time And Temperature Dependent Micromechanical Properties Of Solder Joints For 3D-Package Integration," AIP Conference Proceedings, vol. 1300, pp. 176-185, 2010.

Roepsch, Jodi A., Champaign, Robert F., and Waller, Barbara M., "Black Pad Defect: Influence of Geometry and Other Factors," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 404-411.

Roessler, Robert, and Parker, T. Paul, "MSL Rating and Packaging Requirements of PCBs used in Board Mounted Power Assemblies," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Roev, V. G., Matykina, E. Y., Kaidrikov, R. A., "Short-Termed Assessment of Chromate Films on Zinc and Zinc-Nickel Alloy Coatings,"

Roev, Victor, Doo, Seok Gwang, Kim, Joong-Do, and Choi, Woo-Suk, "Sn and Sn-Bi Alloy Plating Solution Development for High-speed Applications," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 280-301.

Rogelj, Igor, "Plasma: a clean and cost-effective alternative to chemical and heat treatment," Wire Journal International, vol. 41 no. 6, pp. 72-78, June 2008.

Rogers, Adam, "The Day the Beepers Died," Newsweek, vol. 131 no. 22, pp. 48, June 1, 1998.

Rogers, K., Hillman, C., and Pecht, M., "Hollow Fibers Can Accelerate Conductive Filament Formation," Journal of Failure Analysis and Prevention, vol. 1 no. 4, pp. 57-60, Aug. 2001.

Rogers, Keith L., and Pecht, Michael G., "A variant of conductive filament formation failures in PWBs with 3 and 4 mil spacings," Circuit World, vol. 32 no. 3, pp. 11-18, 2006.

Rogers, Keith, Hillman, Craig, Pecht, Michael, and Nachbor, Suzanne, "Conductive filament formation failure in a printed circuit board," Circuit World, vol. 25 no. 3, pp. 6-8, 1999.

Rogers, Keith, Van Den Driessche, Pascale, Hillman, Craig, and Pecht, Michael, "Do You Know That Your Laminates May Contain Hollow Fibers?," Printed Circuit Fabrication, vol. 22 no. 4, pp. 34-38, Apr. 1999.

Rogers, Keith, Hillman, Craig, and Pecht, Michael, "Hollow Fibers Can Accelerate Conductive Filament Formation," ASM International Practical Failure Analysis, vol. 1 no. 4, pp. 57-60, Aug. 2001.

Rogers, R. R., and Fydell, J. F., "Closure to "Discussion of 'Effect of Germanium on the Transformation of White to Gray Tin, at comparatively Low Temparature' [R. R. Rogers and J. F. Fydell (pp. 161-164)]"," Journal of the Electrochemical Society, vol. 100 no. 12, pp. 590, Dec. 1953.

Rogers, R. R., and Fydell, J. F., "Closure to "Discussion of 'Factors Affecting the Transformation to Gray Tin at Low Temperatures' [R. R. Rogers and J. F. Fydell (pp. 383-387)]"," Journal of the Electrochemical Society, vol. 101 no. 6 pp. 335, 1954.

Rogers, R. R., and Fydell, J. F., "Effect of Germanium on the Transformation of White to Grey Tin at Comparatively Low Temperature," Canada Department of Mines and Technical Surveys, Mines Branch, Technical Paper no. 5, 1953.

Rogers, R. R., and Fydell, J. F., "Effect of Germanium on the Transformation of White to Gray Tin, at Comparatively Low Temperature," Journal of the Electrochemical Society , vol. 100 no. 4, pp. 161-164, Apr. 1953.

Rogers, R. R., and Fydell, J. F., "Factors Affecting the Transformation to Gray Tin at Low Temperatures," Journal of the Electrochemical Society, vol. 100 no. 9, pp. 383-387, Sept. 1953.

Roggeman, Brian, Borgesen, Peter, Li, Jing, Godbole, Guarav, Tumne, Pushkraj, Srihari, K., Levo, Tim, and Pitarresi, James, "Assessment of PCB Pad Cratering Resistance by Joint Level Testing," 2008 Proceedings 58th Electronic Components & Technology Conference , Lake Buena Vista, FL, May 27-30, 2008, pp. 884-892.

Roggeman, Brian, and Jones, Wayne, "Characterizing the Lead-Free Impact on PCB Pad Craters," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S35_02-1-S35_02-10.

Roggeman, Brian, and Borgesen, Peter, "Cumulative and Synergistic Effects of Combined Mechanical Loading of Lead-Free BGAs," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 740-745.

Roggeman, Brian D., Raghavan, Venkatesh, and Borgesen, Peter, "Joint Level Test Methods for Solder Pad Cratering Investigations," Journal of Electronic Packaging, vol. 133 no. 3, pp. 031007-1-031007-8, Sept. 2011.

Roggeman, Brian, Anselm, Martin, Guruprasad, Pradosh, and Pitarresi, James, "Investigation of Solder Joint Reliability Through Impact Fatigue Loading," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 636-643.

Roggeman, Brian, Vicari, David, Smith, Lee, and Syed, Ahmer, "Material Selection and Parameter Optimization for Reliable TMV PoP Assembly," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 43-48.

Roggeman, Brian, Vicari, David, Smith, Lee, and Syed, Ahmer, "Material Selection and Parameter Optimization for Reliable TMV Pop Assembly," International Conference on Soldering & Reliability 2013 Proceedings , Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.

Roggeman, Brian, and Rae, David, "Reliability Impact of Partial Pad Craters," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 612-616.

Roggeman, Brian, Marquez de Tino, Ursula, and Barbini, Denis, "Reliability Investigation of Sn/Cu/Ni Solder Joints," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 447-452.

Roh, Hee-Ra, and Kim, Young-Ho, "Intermetallic compound formation and solder joint reliability of Sn-Ag-Cu solder ball on Cu-Zn substrate," 9th International Conference on Electronic Materials and Packaging, Daejon, Korea, Nov. 19-22, 2007, pp. xx-xx.

Roh, Myong-Hoon, Jung, Jae Pil, and Kim, Wonjoong, "Electroplating Characteristics of Sn-Bi Microbumps for Low-Temperature Soldering," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 4, pp. 566-573, Apr. 2013.

Roh, Myong-Hoon, Jung, Jae Pil, and Kim, Wonjoong, "Microstructure, shear strength, and nanoindentation property of electroplated Sn-Bi micro-bumps," Microelectronics Reliability, vol. 54 no. 1, pp. 265-271, Jan. 2014.

Rohnke, Marcus, Best, Timo, and Janek, Jurgen, "Controlled electrochemical growth of silver microwires," Journal of Solid State Electrochemistry, vol. 9 no. 4, pp. 239-243, Apr. 2005.

Rohwer, Lauren E. S., and Martin, James E., "Platelet Composite Coatings for Tin Whisker Mitigation," Journal of Electronic Materials, vol. 44 no. 11, pp. 4424-4433, Nov. 2015. (Sandia Report SAND2015-8335J)

Rohwer, Lauren E. S., and Martin, James E., "Platelet Composite Coatings for Tin Whisker Mitigation," Journal of Electronic Materials, vol. 44 no. 11, pp. 4424-4433, Nov. 2015. (Sandia Report SAND2015-8335J)

Rohwer, Lauren, "Tin Whisker Mitigation," 2015 Joint Munitions Technical Advisory Committee Meeting, Lawrence Livermore National Laboratory, Aug. 18-20, 2015, pp. xx-xx. (Sandia Report SAND2015-6765PE)

Roinila, Tomi, Zeng, Hongjiang, Verho, Jarmo, Xiao, Yu, Vilkko, Matti, Kallio, Pasi, Lekkala, Jukka, Li, Tie, and Wang, Yuelin, "Measuring resistivity of silicon nanowire using pseudo-random binary sequence injection," Microelectronics Journal, vol. 45 no. 7, pp. 976-980, July 2014.

Roine, Kjetil, and Lee, Chin-Yu, "With a Little Help from EPR?: Technological Change and Innovation in the Norwegian Plastic Packaging and Electronics Sectors," Journal of Industrial Ecology, vol. 10 no. 1/2, pp. 217-237, Winter/Spring 2006.

Rollig, Mike, Wiese, Steffen, Meier, Karsten, and Wolter, Klaus-Jurgen, "Creep Measurements of 200 um - 400 um Solder Joints," Proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, London, England, Apr. 15-18, 2007, pp. xx-xx.

Rollig, Mike, Wiese, Steffen, Meier, Karsten, and Wolter, Klaus-Jurgen, "Creep Measurements on SnAgCu Solder Joints in Different Compositions and after Mechanical and Thermal Treatment," International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, Freiburg, Germany, Apr. 20-23, 2008, pp. xx-xx.

Rollig, Mike, Wiese, Steffen, and Wolter, Klaus-Jurgen, "Extraction of material parameters for creep experiments on real solder-joints by FE analysis," 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Como, Italy, Apr. 24-26, 2006, pp. xx-xx.

Rollins, William P., Pinsky, David A., Minter, Charles S., Toussaint, Gary, Das, Diganta, and Tyler, Donald, "(Draft) Final Report on the Transformational Manufacturing Technology Initiative (TMTI) ManTech Research Project S1057: Tin Whisker Mitigation," Mar. 3, 2006.

Rollins, Bill, "Engineering Requirements for a Tin-Whisker-Risk-Controlling Conformal Coating to be used in a Missile," Tin Whisker Group teleconference, June 1, 2016.

Rollins Jr., Fred R., "Specimen Holder for Deforming Whiskers in an Electron Microscope," Review of Scientific Instruments, vol. 30, pp. 603-604, 1959.

Rollins, William P., Pinsky, David A., Minter, Charles S., Toussaint, Gary, Das, Diganta, and Tyler, Donald, "Final Report on the Transformational Manufacturing Technology Initiative (TMTI) ManTech Research Project S1057: Tin Whisker Mitigation," Apr. 12, 2006.

Roma, Maria Penafrancia C., Kudtarkar, Santosh, Kierse, Oliver, Sengupta, Dipak, and Cho, Junghyun, "Aging Studies of Cu-Sn Intermetallics in Cu Micropillars Used in Flip Chip Attachment onto Cu Lead Frames," Journal of Electronic Materials, vol. 47 no. 2, pp. 1694-1704, Feb. 2018.

Romaka, L., Dovgalyuk, Yu., Romaka, V. V., Lototska, I., and Stadnyk, Yu., "Interaction of the components in Y-Ni-Sn ternary system at 770 K and 670 K," Intermetallics, vol. 29, pp. 116-122, 2012.

Romaka, L., Konyk, M., Romaka, V. V., Melnychenko, N., and Rogl, P., "Phase equilibria in Nd-Ni-Sn ternary system," Journal of Alloys and Compounds, vol. 454 no. 1-2, pp. 136-141, Apr. 24, 2008.

Romaka, V. V., and Romaka, L., "Contribution to the investigation of ternary Lu-Ni-Sn system," Journal of Alloys and Compounds, vol. 509 no. 13, pp. 4530-4533, Mar. 31, 2011.

Roman, B. J., and Ewald, A. W., "Stress-Induced Band Gap and Related Phenomena in Gray Tin," Physical Review B, vol. 5 no. 10, pp. 3914-3932, May 15, 1972.

Roman, John W., and Eagar, Thomas W., "Low Stress Die Attach by Low Temperature Transient Liquid Phase Bonding," Proceedings of the 1992 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 1847), San Francisco, CA, Oct. 19-21, 1992, pp. 52-57.

Romanowska, Jolanta, "Experimental study on the thermodynamics of the Cu-Sb-Sn liquid alloys," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 33 no. 4, pp. 723-725, Dec. 2009.

Romer, Klaus, "SMT Wertheim," SMART Group Pin In Hole Odd Form Assembly and Soldering Workshop, Bracknell, United Kingdom, Sept. 24, 2002.

Romermann, F., and Blachnik, R., "The Excess Enthalpies of Liquid Ag-Ge-Te and Ag-Sn-Te Alloys," Zeitschrift fur Metallkunde, vol. 92 no. 4, pp. 336-344, Apr. 2001.

Romero, Christian, Lim, Jun, Kim, Taeuui, Kim Hingwon, and Kim, KyungO, "Design and Characterization of Fully Embedded Passive Components on Multilayer Organic-based Substrate for Highly Compact SOP Applications," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1731-1736.

Romm, Douglas, Lange, Bernhard, and Abbott, Donald, "Evalution of Nickel/Palladium-Finished ICs with Lead-Free Solder Alloys," Texas Instruments Application Report SZZA024, Jan. 2001.

Romm, Douglas, Lange, Bernhard, and Abbott, Donald, "Evaluation of Nickel/Palladium/Gold-Finished Surface-Mount Integrated Circuits," Texas Instruments Application Report SZZA026, July 2001.

Romm, Doug, "IC materials change to meet environmental standards," Electronic Products, vol. 48 no. 2, pp. 79-80, July 2005.

Romm, Douglas W., and Abbott, Donald C., "Lead-free Solder Joint Evaluation," Surface Mount Technology (SMT) , vol. 13 no. 3, pp. 84-88, Mar. 1999.

Romm, Douglas W., and Abbott, Donald C., "Pb-Free Solder Joint Evaluation," AIM.

Romm, Douglas W., and Abbott, Donald C., "Pb-free solder joint evaluation," Dataweek, vol. xx no. xx, pp. xx-xx, Aug. 24, 2005.

Romm, Douglas W., Abbott, Donald C., and Lange, Bernhard, "Shelf-Life Evaluation of Lead-Free Component Finishes," Texas Instruments Applications Report SZZA046, June 2004.

Romm, Douglas W., and Abbott, Donald, "Steam-age Evaluation of Ni/Pd Lead Finish," Surface Mount Technology (SMT), vol. 13 no. 1, pp. 86, 88, 90, Jan. 1999.

Romm, Douglas, and Abbott, Donald, "Steam-Age Evaluation of Nickel/Palladium Lead Finish for Integrated Circuits," Texas Instruments Applications Report SZZA004, Sept. 1998.

Romm, Douglas W., Abbott, Donald C., Grenney, Stu, and Khan, Muhammad, "Whisker Evaluation of Tin-Plated Logic Component Leads," Texas Instruments Application Report SZZA037A, Feb. 2003.

Ronningen, Brage, "Competitors together in PRO (Producers Responsibility Organisation) - A case study of the PRO-system in Norway," Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, New Orleans, LA, May 16-19, 2005, pp. 45-48.

Rooney, Daniel T., Gullo, Louis, Castello, Todd, and Shangguan, Dongkai, "Evaluation of Reliability and Metallurgical Integrity of Wire Bonds and Lead Free Solder Joints on Flex Circuit Modules" 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 410-417.

Rooney, Daniel T., Gullo, Louis, Xie, Dongji, Castello, N. Todd, and Shangguan, Dongkai, "Evaluation of reliability and metallurgical integrity of wire bonds and lead free solder joints on flexible printed circuit board sample modules," Microelectronics Reliability, vol. 47 no. 12, pp. 2152-2160, Dec. 2007.

Rooney, Daniel T., Geiger, David, Shangguan, Dongkai, and Lau, John, "Metallurgical Analysis and Hot Storage Testing of Lead-Free Solder Interconnects: SAC versus SACC," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 89-98.

Roos, Gina, "Achieving environmental compliance requires a strategic plan," Green SupplyLine, Dec. 29, 2005.

Roos, Gina, "Ageus expands China RoHS services," Green SupplyLine, Sept. 18, 2006.

Roos, Gina, "Alert: China RoHS released to WTO," Green SupplyLine, Oct. 3, 2005.

Roos, Gina, "Allied launches RoHS Knowledge Center," Green SupplyLine, Aug. 9, 2005.

Roos, Gina, "AMI DODUCO releases Cd-free contact material findings," Green SupplyLine, Oct. 13, 2005.

Roos, Gina, "Another WEEE delay in the U.K.," Green SupplyLine, Aug. 10, 2005.

Roos, Gina, "Arrow enhances parts search with free RoHS data," Green SupplyLine , Apr. 19, 2006.

Roos, Gina, "Best releases lead-free rework roadmap," Green SupplyLine, July 8, 2005.

Roos, Gina, "Bromine forum counters Greenpeace electronics report," EE Times - Asia, vol. xx no. xx, pp. xx-xx, Dec. 6, 2007.

Roos, Gina, "Canada launches its first industry-led electronics recycling program," Green SupplyLine, Feb. 5, 2007.

Roos, Gina, "Cefic clarifies Deca-BDE restrictions proposed by some European countries," Green SupplyLine, Apr. 16, 2007.

Roos, Gina, "Celestica helps OEM customers meet environmental compliance," Green SupplyLine, July 12, 2005.

Roos, Gina, "China RoHS English translation available from DCA," Green SupplyLine, Nov. 7, 2005.

Roos, Gina, "China RoHS is topic of the year," EE Times, vol. xx no. xx, pp. xx-xx, Dec. 29, 2006.

Roos, Gina, "China RoHS is topic of the year," Green SupplyLine, Dec. 29, 2006.

Roos, Gina, "Chinese delegation to explain new environmental regulations," Green SupplyLine, Oct. 11, 2006.

Roos, Gina, "Component manufacturers make progress in lead-free part numbering, says study," Green SupplyLine, July 1, 2005.

Roos, Gina, "Counterfeit parts may become a problem," EE Times Europe, June 13, 2006.

Roos, Gina, "DCA launches RoHS compliance service," Green SupplyLine, Mar. 27, 2006.

Roos, Gina, "DCA offers free English translation of Korea RoHS legislation," Green SupplyLine, Apr. 18, 2007.

Roos, Gina, "DCA releases RoHS docs," Green SupplyLine, Apr. 28, 2006.

Roos, Gina, "Design Priorities Shift in a Post-RoHS World," Circuitree, vol. 19 no. 8, pp. xx-xx, Aug. 2006.

Roos, Gina, "Design priorities shift in a post-RoHS world," EE Times Europe , Aug. 21, 2006.

Roos, Gina, "Design priorities shift in a post-RoHS world," EE Times, Aug. 21, 2006.

Roos, Gina, "Design priorities shift in a post-RoHS world," Green SupplyLine , Aug. 21, 2006.

Roos, Gina, "Design priorities shift in a post-RoHS world," Industrial Control Design Line, Aug. 21, 2006.

Roos, Gina, "Designers must consider green regs for new designs," Green SupplyLine, Dec. 11, 2006.

Roos, Gina, "Designers must consider green regs for new designs," TechOnLine , Dec. 11, 2006.

Roos, Gina, "Designing and shipping after RoHS," EE Times - Asia, vol. xx no. xx, pp. xx-xx, Aug. 23, 2006.

Roos, Gina, "EC gets tough on environmental crimes," Green SupplyLine, Feb. 12, 2007.

Roos, Gina, "EC set to review 15 RoHS exemptions," Green SupplyLine, Dec. 23, 2005.

Roos, Gina, "EC warns late eight - not going green will cost serious green," Green SupplyLine, July 11, 2005.

Roos, Gina, "EIA to offer China RoHS translations," Green SupplyLine, Dec. 13, 2007.

Roos, Gina, "EMA addresses ROHS compliance at the design stage," Green SupplyLine, May. 24, 2005.

Roos, Gina, "Environmental compliance poses several business risks," Green SupplyLine, Dec. 12, 2005.

Roos, Gina, "Environmental compliance requires team work," Green SupplyLine , July 26, 2005.

Roos, Gina, "Environmental law compliance service targets RoHS and WEEE," Green SupplyLine, Dec. 28, 2005.

Roos, Gina, "Environmental law firm releases REACH document," Green SupplyLine , Apr. 27, 2007.

Roos, Gina, "EPEAT gets presidential backing," Green SupplyLine, Feb. 5, 2007.

Roos, Gina, "EPEAT identifies more than 200 green computers," Green SupplyLine , Oct. 13, 2006.

Roos, Gina, "ERNI provides roadmap for RoHS compliance," Green SupplyLine , Sept. 15, 2004.

Roos, Gina, "EU announces Deca-BDE exemption," EE Times, Oct. 17, 2005.

Roos, Gina, "EU announces Deca-BDE exemption," Green SupplyLine, Oct. 17, 2005.

Roos, Gina, "EU updates RoHS exemption annex," Green SupplyLine, Nov. 15, 2005.

Roos, Gina, "Evaluation boards: in or out of RoHS scope?," Green SupplyLine , Nov. 6, 2006.

Roos, Gina, "FAQs about the RoHS and WEEE directives," Green SupplyLine, May 16, 2005.

Roos, Gina, "GEIA to release lead-free standards for high-reliability industries," EE Times Europe, July 20, 2006.

Roos, Gina, "GEIA to release lead-free standards for high-reliability industries," Green SupplyLine, July 20, 2006.

Roos, Gina, "GEIA to release lead-free standards for high-reliability industries," EE Times, July 20, 2006.

Roos, Gina, "Germany offers WEEE test registration," Green SupplyLine, Oct. 10, 2005.

Roos, Gina, "Get prepared for China RoHS," Green SupplyLine, Dec. 11, 2006.

Roos, Gina, "GoodBye Chain Group improves materials declaration process," Green SupplyLine, Oct. 4, 2006.

Roos, Gina, "Green engineering challenges reliability and logistics," EE Times , Apr. 24, 2006.

Roos, Gina, "GREEN engineering challenges reliability and logistics," Electronic Engineering Times no. 1420, pp. 43-44, 56, Apr. 24, 2006.

Roos, Gina, "Green engineering challenges reliability and logistics," Green SupplyLine, Apr. 24, 2006.

Roos, Gina, "Green engineering challenges reliability and logistics," Industrial Control Design Line, Apr. 24, 2006.

Roos, Gina, "Green engineering challenges reliability, logistics," EE Times - Asia, vol. xx no. xx, pp. xx-xx, July 17, 2006.

Roos, Gina, "GreenSoft launches 'GreenData' searchable components database," EE Times Europe, Sept. 11, 2008.

Roos, Gina, "HCL launches RoHS compliance system for medical devices," Green SupplyLine, May 22, 2006.

Roos, Gina, "Industry groups partner to develop a standard for materials declaration," Green SupplyLine, Apr. 20, 2005.

Roos, Gina, "Industry orgs release materials declaration draft forms," Green SupplyLine, June 13, 2005.

Roos, Gina, "iNEMI addresses lead-free component reliability," Green SupplyLine , Aug. 25, 2005.

Roos, Gina, "iNEMI calls for industry participation," Green SupplyLine, Nov. 8, 2006.

Roos, Gina, "iNEMI calls for industry participation," Industrial Control Design Line, Nov. 8, 2006.

Roos, Gina, "iNEMI calls for unique part numbers for RoHS-compliant components," Green SupplyLine, Apr. 28, 2005.

Roos, Gina, "iNEMI pledges support for IPC-1752," Green SupplyLine, Feb. 9, 2006.

Roos, Gina, "iNEMI recommends lead-free manufacturing requirements," Green SupplyLine, Mar. 9, 2006.

Roos, Gina, "iNEMI releases standard for tin whisker testing, updates lead-free surface finish guidelines," Green SupplyLine, May 25, 2005.

Roos, Gina, "iNEMI updates tin whisker guidelines," Industrial Control Design Line, Dec. 18, 2006.

Roos, Gina, "iNEMI updates tin whisker guidelines," Green SupplyLine, Dec. 18, 2006.

Roos, Gina, "Information overload," Green SupplyLine, Feb. 14, 2006.

Roos, Gina, "IPC delivers RoHS compliance tools," Green SupplyLine, Dec. 30, 2005.

Roos, Gina, "IPC, JEDEC to address materials declaration issues," Green SupplyLine, Apr. 20, 2006.

Roos, Gina, "IPC launches lead-free audit program," Green SupplyLine, Jan. 23, 2006.

Roos, Gina, "IPC lead-free study reveals industry dissatisfaction," Green SupplyLine, Oct. 16, 2006.

Roos, Gina, "IPC lead-free study reveals industry dissatisfaction," Industrial Control Design Line, Oct. 16, 2006.

Roos, Gina, "IPC opposed to changes in EU RoHS directive," EE Times Europe , Jan. 21, 2008.

Roos, Gina, "IPC publishes IPC-1752 standard," Green SupplyLine, Mar. 9, 2006.

Roos, Gina, "IPC releases paper on solder joint voids," Green SupplyLine, Dec. 19, 2005.

Roos, Gina, "IPC white paper addresses lead-free solder material costs," Green SupplyLine, June 12, 2006.

Roos, Gina, "Is industry calling for a RoHS law in the U.S.?," Green SupplyLine , Dec. 21, 2006.

Roos, Gina, "Is pricing on the rise for non-compliant parts?," Green SupplyLine , Feb. 22, 2006.

Roos, Gina, "Japan legislation is right around the corner," Green SupplyLine , Dec. 28, 2005.

Roos, Gina, "JEDEC, iNEMI release tin whisker standard," Green SupplyLine , May 4, 2006.

Roos, Gina, "Lead-free alloys impact back-end semiconductor manufacturing, says research firm," Green SupplyLine, May 13, 2005.

Roos, Gina, "Leverage your PLM for RoHS compliance," Green SupplyLine, Aug. 1, 2005.

Roos, Gina, "Many manufacturers not ready to demonstrate RoHS compliance, says study," Green SupplyLine, July 31, 2006.

Roos, Gina, "Materials compliance software gets ecodesign capabilities," EE Times Europe, June 20, 2008.

Roos, Gina, "More effective RoHS enforcement promised," Green SupplyLine, Oct. 16, 2008.

Roos, Gina, "More opposition to RoHS," Green SupplyLine, Oct. 23, 2006.

Roos, Gina, "More opposition to RoHS," Industrial Control Design Line, Oct. 23, 2006.

Roos, Gina, "NEMI revises tin whisker test requirements," eeProductCenter , Sept. 2, 2004.

Roos, Gina, "NEMI revises tin whisker test requirements," Green SupplyLine , Sept. 2, 2004.

Roos, Gina, "NEMI revises tin whisker test requirements," Green SupplyLine , Sept. 2, 2004.

Roos, Gina, "Newark InOne calls for Federal RoHS legislation," Green SupplyLine , Sept. 19, 2006.

Roos, Gina, "Newark InOne offers free BOM scrubbing," Green SupplyLine, Oct. 12, 2005.

Roos, Gina, "Newark InOne provides downloadable certificates of compliance," Green SupplyLine, June 8, 2006.

Roos, Gina, "Newark InOne releases WEEE compliance guide," Green SupplyLine , Aug. 31, 2005.

Roos, Gina, "Newark InOne unveils RoHS catalog on web site," Green SupplyLine , Apr. 12, 2006.

Roos, Gina, "On-demand software tracks product quality of RoHS products," Green SupplyLine, Aug. 18, 2006.

Roos, Gina, "On-demand software tracks product quality of RoHS products," Industrial Control Design Line, Aug. 18, 2006.

Roos, Gina, "Part number changes ahead for lead-free BGAs," Green SupplyLine , May 7, 2007.

Roos, Gina, "PartMiner adds hazardous material content to electronic components database," eeProductCenter, Dec. 23, 2004.

Roos, Gina, "PartMiner expands material content database," Green SupplyLine , May 7, 2007.

Roos, Gina, "Passives makers actively eliminate lead," Green SupplyLine, Jan. 30, 2003.

Roos, Gina, "Passives makers actively eliminate lead," eeProductCenter, Jan. 30, 2003.

Roos, Gina, "Passives makers actively eliminate lead," Electronic Engineering Times , vol. xx no. xx, pp. 63, 70, Feb. 3, 2003.

Roos, Gina, "Preparing for RoHS compliance begins at design," Green SupplyLine , Aug. 5, 2005.

Roos, Gina, "Process makes leaded devices Pb-free," EE Times - Asia, vol. xx no. xx, pp. xx-xx, Aug. 30, 2007.

Roos, Gina, "Puzzled by RoHS exemptions," Green SupplyLine, Aug. 15, 2005.

Roos, Gina, "Puzzled by RoHS exemptions," Industrial Control Design Line, Aug. 15, 2005.

Roos, Gina, "REACH chemicals legislation nears final adoption," Green SupplyLine , Dec. 13, 2006.

Roos, Gina, "Recycling in the U.S.," Green SupplyLine, Nov. 15, 2006.

Roos, Gina, "Report covers green labeling regs in 36 countries," Green SupplyLine, Sept. 10, 2005.

Roos, Gina, "RoHS 101," Green SupplyLine, June 9, 2005.

Roos, Gina, "RoHS and WEEE input needed," Green SupplyLine, May 1, 2007.

Roos, Gina, "RoHS debate continues," Green SupplyLine, Oct. 10, 2006.

Roos, Gina, "RoHS directive causes anxiety," Green SupplyLine, Mar. 18, 2005.

Roos, Gina, "RoHS era drives changes in design priorities," EE Times - Asia , vol. xx no. xx, pp. xx-xx, Oct. 2, 2006.

Roos, Gina, "RoHS exemption for lead in connector tin plating is under review," Green SupplyLine, Apr. 14, 2005.

Roos, Gina, "RoHS-International releases China RoHS declaration template," Green SupplyLine, Mar. 5, 2007.

Roos, Gina, "RoHS-International releases China RoHS guidance," Green SupplyLine , Jan. 12, 2007.

Roos, Gina, "RoHS-International updates China RoHS guidance notes," Green SupplyLine, Apr. 2, 2007.

Roos, Gina, "RoHS policy mitigates compliance risk," Green SupplyLine, Jan. 17, 2006.

Roos, Gina, "RoHS Recast still causes confusion in the supply chain," SupplyChainHQ.

Roos, Gina, "Shimadzu Scientific offers RoHS white paper," Green SupplyLine , Apr. 12, 2006.

Roos, Gina, "Solectron addresses environmental compliance," Green SupplyLine , May 5, 2005.

Roos, Gina, "Solving lead-free board challenges requires design changes, testing, and education," Green SupplyLine, Sept. 22, 2006.

Roos, Gina, "Solving lead-free board challenges requires design changes, testing, and education," Industrial Control Design Line, Sept. 22, 2006.

Roos, Gina, "Sorting out WEEE label requirements," EE Times Europe, Dec. 20, 2005.

Roos, Gina, "Sorting out WEEE label requirements," Green SupplyLine, Dec. 20, 2005.

Roos, Gina, "Study indicates RoHS component conversion to rise," Green SupplyLine, Jan. 10, 2007.

Roos, Gina, "Study: Process for converting leaded devices to lead free works," EE Times, vol. xx no. xx, pp. xx-xx, Aug. 28, 2007.

Roos, Gina, "Supply line steps up to RoHS compliance challenge," EE Times , Aug. 21, 2006.

Roos, Gina, "Supply line steps up to RoHS compliance challenge," Green SupplyLine, Aug. 21, 2006.

Roos, Gina, "TechniData, Sap deliver REACH solutions," Green SupplyLine, May 3, 2007.

Roos, Gina, "TFI reveals top 5 environmental compliance mistakes," Green SupplyLine, Sept. 29, 2005.

Roos, Gina, "Time is running out for RoHS compliance," Green SupplyLine, Oct. 3, 2005.

Roos, Gina, "Time is running out for WEEE registration," Green SupplyLine , July 8, 2005.

Roos, Gina, "Toshiba unveils lead-free memory products plan," Green SupplyLine , Sept. 8, 2005.

Roos, Gina, "Total Parts Plus expands database, includes RoHS content," Green SupplyLine, June. 20, 2005.

Roos, Gina, "Trace Labs offers tin whisker testing," Green SupplyLine, Feb. 10, 2005.

Roos, Gina, "Trade alliance launches RoHS/WEEE services," Green SupplyLine , Jan. 27, 2006.

Roos, Gina, "UL offers RoHS compliance services," Green SupplyLine, May 12, 2006.

Roos, Gina, "Watch for supply problems," Green SupplyLine, May 16, 2006.

Roos, Gina, "Watch for supply problems," Green SupplyLine, May 16, 2006.

Roos, Gina, "Watch out for EU RoHS exemptions when evaluating products for China RoHS compliance," Green SupplyLine, Mar. 19, 2007.

Roos, Gina, "Watch out for WEEE whistle blowers," Green SupplyLine, Apr. 19, 2006.

Roos, Gina, "WEEE enforcement may disrupt sales, says M-Cubed," Green SupplyLine , Aug. 23, 2006.

Roos, Gina, "WEEE national registration update," Green SupplyLine, July 25, 2005.

Roos, Gina, "Weighing the business risks," Electronics Supply & Manufacturing, Jan. 2006.

Roos, Gina, "What is the industry's best lead-free solder?," Green SupplyLine , July 1, 2005.

Roper, Celeste, "NAVAIR Technology Needs Survey Document."

Rorgren, Roger S., and Liu, Johan, "Reliability Assessment of Isotropically Conductive Adhesive Joints in Surface Mount Applications," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, vol. 18 no. 2, pp. 305-312, May 1995.

Rosa, Manuel La, Tankink, Albertus, and Hoch, Martin, "Highly Flexible Halogen Free and Flame Retardant Thermoplastic Cable Compounds Modified with EVM Polymers," Proceedings of the 57th International Wire and Cable Symposium, Providence, RI, Nov. 9-12, 2008, pp. 124-133.

Rosalbino, F., Angelini, E., Zanicchi, G., and Marazza, R., "Corrosion behaviour assessment of lead-free Sn-Ag-M (M = In, Bi, Cu) solder alloys," Materials Chemistry and Physics, vol. 109 no. 2-3, pp. 386-391, June 15, 2008.

Rosalbino, F., Zanicchi, G., Carlini, R., Angelini, E., and Marazza, R., "Electrochemical corrosion behaviour of Sn-Ag-Cu (SAC) eutectic alloy in a chloride containing environment," Materials and Corrosion, vol. 63 no. 6, pp. 492-496, June 2012.

Rosalbino, F., Angelini, E., Zanicchi, G., Carlini, R., and Marazza, R., "Electrochemical corrosion study of Sn-3Ag-3Cu solder alloy in NaCl solution," Electrochimica Acta, vol. 54 no. 28, pp. 7231-7235, Dec. 1, 2009.

Rosalbino, Francesco, Scavino, Giorgio, Mortarino, Giovanni, Angelini, Emma, and Lunazzi, Giancarlo, "EIS study on the corrosion performance of a Cr(III)-based conversion coating on zinc galvanized steel for the automotive industry," Journal of Solid State Electrochemistry, vol. 15 no. 4, pp. 703-709, Apr. 2011.

Rosas, Julian, Delhaise, Andre M., Haas, Alyssa, and Perovic, Doug D., "Microstructure Evaluation and Ball Shear Testing of SAC-Bi Pb-Free Solder Alloys," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 423-431.

Rosaz, G., Salem, B., Pauc, N., Gentile, P., Potie, A., and Baron, T., "Electrical characteristics of a vertically integrated field-effect transistor using non-intentionally doped Si nanowires," Microelectronic Engineering , vol. 88 no. 11, pp. 3312-3315, Nov. 2011.

Rose, Catherine M., Stevels, Ab, and Ishii, Kosuke, "Method for Formulating Product End-of-Life Strategies for Electronics Industry," Journal of Electronics Manufacturing, vol. 11 no. 2, pp. 185-196, June 2002.

Rose, Catherine M., and Ishii, Kosuke, "Product End-of-Life Strategy Categorization Design Tool," Journal of Electronics Manufacturing, vol. 9 no. 1, pp. 41-51, Mar. 1999.

Rosenthal, Y., Stern, A., Cohen, S. R., and Eliezer, D., "Nanoindentation measurements and mechanical testing of as-soldered and aged Sn-0.7Cu lead-free miniature joints," Materials Science and Engineering: A, vol. 527 no. 16-17, pp. 4014-4020, June 25, 2010.

Rosenthal, Y., Sabag, O., Tourgeman, A., Zalkind, S., Stern, A., and Eliezer, D., "Solderability Testing of Lead-Free Solder Joints Using Miniature Specimens," Journal of Testing and Evaluation, vol. 36 no. 5, pp. 417-424, Sept. 2008.

Roshanghias, A., Kokabi, A. H., Miyashita, Y., Mutoh, Y., Rezayat, M., and Madaah-Hosseini, H. R., "Ceria reinforced nanocomposite solder foils fabricated by accumulative roll bonding process," Journal of Materials Science: Materials in Electronics , vol. 23 no. 9, pp. 1698-1704, Sept. 2012.

Roshanghias, A., Kokabi, A. H., Miyashita, Y., Mutoh, Y., and Hosseini, H. R. Madaah, "Formation of intermetallic reaction layer and joining strength in nano-composite solder joint," Journal of Materials Science: Materials in Electronics, vol. 24 no. 3, pp. 839-847, Mar. 2013.

Roshanghias, A., Kokabi, A. H., Miyashita, Y., Mutoh, Y., Ihara, I., Fatt, R. G. Guan, and Madaah-Hosseini, H. R., "Nanoindentation Creep Behavior of Nanocomposite Sn-Ag-Cu Solders," Journal of Electronic Materials, vol. 41 no. 8, pp. 2057-2064, Aug. 2012.

Roshanghias, Ali, Vrestal, Jan, Yakymovych, Andriy, Richter, Klaus W., and Ipser, Herbert, "Sn-Ag-Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 49, pp. 101-109, June 2015.

Roshanghias, Ali, Khatibi, Golta, Yakymovych, Andriy, Bernardi, Johannes, and Ipser, Herbert, "Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength," Journal of Electronic Materials, vol. 45 no. 8, pp. 4390-4399, Aug. 2016.

Rosner, Bela, Liu, Johan, and Lai, Zonghe, "Flip Chip Bonding Using Isotropically Conductive Adhesives," 1996 Proceedings 46th Electronic Components & Technology Conference, Orlando, FL, May 28-31, 1996, pp. 578-581.

Rosner, Bela, "Reliability Study of Polymer Adhesive Bump Interconnections," Journal of Electronics Manufacturing, vol. 5 no. 4, pp. 297-300, Dec. 1995.

Ross, G., Vuorinen, V., Krause, M., Reissaus, S., Petzold, M., and Paulasto-Krockel, M., "XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects," Microelectronics Reliability, vol. 76-77, pp. 390-394, Sept. 2017.

Ross, Glenn, Vuorinen, Vesa, and Paulasto-Krockel, Mervi, "Key parameters influencing Cu-Sn interfacial void formation," 2016 IEEE 18th Electronics Packaging Technology Conference, Singapore, Nov. 30-Dec. 3, 2016, pp. 459-467.

Ross, Glenn, Vuorinen, Vesa, and Paulasto-Krockel, Mervi, "Void formation and its impact on Cu-Sn intermetallic compound formation," Journal of Alloys and Compounds, vol. 677, pp. 127-138, Aug. 25, 2016.

Ross, Glenn, Vuorinen, Vesa, and Paulasto-Krockel, Mervi, "Void Formation in Cu-Sn Micro-Connects," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 2193-2199.

Ross, Graham, "Hand Soldering with Lead-Free Alloys," Lead-Free Connection, vol. 1 no. 1, pp. 4-7, July 2004.

Ross, Graham, "Reworking BGAs/CSPs Using Lead-Free Solders," Lead-Free Connection , vol. 1 no. 2, pp. 4-6, Nov. 2004.

Rostek, Paul, "The RoHS Experience at NCR Corporation," 2006 IEEE Symposium on Product Safety & Compliance Engineering, Irvine, CA, Oct. 23-24, 2006, pp. xx-xx.

Rostek, Paul, "The RoHS Experience at NCR Corporation," Advancing Microelectronics , vol. 34 no. 2, pp. 10-18, Mar./Apr. 2007.

Rotchadl, Hal, "Bridging Supply Chain Gap for Exempt High-Reliability OEM's," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Rotchadl, Hal, "Bridging Supply Chain Gap for Exempt High-Reliability OEM's," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 646-653.

Rotchadl, Hal, "Bridging Supply Chain Gap for Exempt High-Reliability OEM's," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S12_01-1-S12_01-9.

Roters, F., Eisenlohr, P., Hantcherli, L., Tjahjanto, D. D., Bieler, T. R., and Raabe, D., "Overview of constitutive laws, kinematics, homogenization and multiscale methods in crystal plasticity finite-element modeling: Theory, experiments, applications," Acta Materialia, vol. 58 no. 4, pp. 1152-1211, Feb. 2010.

Roth, Holger, "X-ray inspection of lead-free solder joints," Dataweek, vol. xx no. xx, pp. xx-xx, Aug. 27, 2003.

Roth, Holger, "X-ray Inspection of Lead-free Solder Joints," Surface Mount Technology (SMT), vol. 18 no. 7, pp. 44, 46, 48, July 2004.

Roth, Jason, "Problems Diagnosing Zinc Needles in High-Tech Environments." 2006.

Rothberg, Barbara D., "Superconductivity and Mechanical Twinning of Tin Whiskers," Philosophical Magazine, vol. 25 no. 6, pp. 1473-1480, June 1972. https://doi.org/10.1080/14786437208223866

Rotter, Vera Susanne, Chancerel, Perrine, and Schill, Wolf Peter, "Implementing Individual Producer Responsibility (IPR) under the European WEEE directive - Experiences in Germany," IEEE International Symposium on Sustainable Systems and Technology, Phoenix, AZ, May 18-20, 2009, pp. xx-xx.

Rotter, Vera Susanne, Chancerel, Perrine, and Schill, Wolf-Peter, "Practicalities of individual producer responsibility under the WEEE directive: experiences in Germany," Waste Management and Research , vol. 29 no. 9, pp. 931-944, Sept. 2011.

Roubaud, Patrick, Ng, Grace, Henshall, Greg, Bulwith, Ronald, Herber, Robert, Prasad, Swaminath. Carson, Flynn, Kamath, Sundar, and Garcia, Alexander, "Impact of Intermetallic Growth on the Mechanical Strength of Lead-Free BGA Assemblies," IPC SMEMA Council APEX 2001, San Diego, CA, Jan. 14-18, 2001, pp. xx-xx.

Roubaud, Patrick, Henshall, Bulwith, Ronald, Prasad, Swaminath, Carson, Flynn, Kamath, Sundar, and O'Keeffe, Eamon, "Thermal Fatigue Resistance of Pb-Free Second Level Interconnect." 2001 SMTA International Conference Proceedings, Chicago, IL, Sept. 30-Oct. 4, 2001, pp. xx-xx.

Rousseau, A., and Benaben, P., "Single-bath Electrodeposition of Chromium-Nickel Compositionally Modulated Multilayers (CMM) From a Trivalent Chromium Bath," Plating & Surface Finishing, vol. 86 no. 9, pp. 106-110, Sept. 1999.

Rousseau, Agnes, and Shahin, and George E., "Lead and Cadmium free Electroless Nickel for End-of-Life Vehicle Directive," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 150-158.

Roussel, Manuel, Erdelyi, Zoltan, and Schmitz, Guido, "Reactive diffusion and stresses in nanowires or nanorods," Acta Materialia, vol. 131, pp. 315-322, June 1, 2017.

Routley, Michele, "The Restriction of Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive (2002/95/EC)," Connect, 2007.

Routley,Michele, "What is the best lead-free surface finish to use for printed circuit board assemblies?," Connect, 2007.

Rovner, Sophie L., "Coping With Whiskers: 'The Five Stages Of Metal Whisker Grief'," Chemical & Engineering News, vol. 85 no. 29, pp. xx-xx, July 16, 2007.

Rovner, Sophie L., "Stopping the Tin Whisker Stalkers," Chemical and Engineering News , vol. 85 no. 29, pp. 30-33, July 16, 2007.

Rowe, Martin, "Lead makes an electronic exit," Test & Measurement World , vol. 26 no. 2, pp. 37-38, 40, 42, Mar. 2006.

Rowenhorst, D. J., and Voorhees, P. W., "Measurements of the Grain Boundary Energy and Anisotropy in Tin," Metallurgical and Materials Transactions A, vol. 36 no. 8, pp. 2127-2135, Aug. 2005.

Rowland, Debbie, "Solving the problem of obsolete passive components," Electronics Weekly, July 5, 2006.

Rowland, Robert, "Another Look at RoHS Material Declarations," Surface Mount Technology (SMT), vol. 21 no. 5, pp. 9, May 2007.

Rowland, Rob, and Prasad, Ray, "Comparing PCB Surface Finishes and their Assembly Process Compatibility," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 929-933.

Rowland, Robert, "Comparing Substrate Surface Finishes," Surface Mount Technology (SMT), vol. 17 no. 3, pp. xx-xx, Mar. 2003.

Rowland, Robert, "Countdown to RoHS Compliance," Surface Mount Technology (SMT) , vol. 18 no. 9, pp. 16, Sept. 2004.

Rowland, Robert, "Demonstrating RoHS Compliance," Surface Mount Technology (SMT) , vol. 20 no. 6, pp. xx-xx, June 2006.

Rowland, Robert, "EU's RoHS 2 on the Horizon," Surface Mount Technology (SMT), vol. 24 no. 1, pp. 20, Jan./Feb. 2010.

Rowland, Robert, "Hybrid Reflow Profiles," Surface Mount Technology (SMT), vol. 19 no. 8, pp. xx-xx, Aug. 2005.

Rowland, Robert, "Lead-free Alloys and Component Surface Finishes," Surface Mount Technology (SMT), vol. 19 no. 11, pp. 10, Nov. 2005.

Rowland, Robert, "Lead-free PCBs," SMT Web Exclusive Article.

Rowland, Robert, "Mixed Alloy Soldering," Surface Mount Technology (SMT), vol. 19 no. 12, pp. 12, Dec. 2005.

Rowland, Robert, "Moisture-sensitive Components," SMT, Oct. 2000.

Rowland, Robert, "More on Lead-free PCBs," Surface Mount Technology (SMT), vol. 21 no. 11, pp. 10 , Nov. 2007.

Rowland, Robert, "Part 2: RoHS Material Declarations," Surface Mount Technology , vol. 19 no. 5, pp. xx-xx, May 2005.

Rowland, Robert, "RoHS 101," , vol. 18 no. 11, pp. xx-xx, Nov. 2004.

Rowland, Robert, "RoHS: A Step-by-Step Strategy," Surface Mount Technology (SMT) , vol. 19 no. 3, pp. 16, Mar. 2005.

Rowland, Robert, "RoHS and Material Declarations," Surface Mount Technology (SMT) , vol. 18 no. 7, pp. xx-xx, July 2004.

Rowland, Robert, "RoHS Enforcement Guidelines," Surface Mount Technology (SMT) , vol. 20 no. 10, pp. 8, Oct. 2006.

Rowland, Robert, "Solder Alloy Quality," Surface Mount Technology (SMT), vol. 15 no. 8, pp. xx-xx, Aug. 2001.

Rowland, Robert, "The Lead-free PCB Evolution," Surface Mount Technology (SMT) , vol. 23 no. 2, pp. 23, Mar.-Apr. 2009.

Rowland, Robert, "The RoHS and Lead-free Puzzle," Surface Mount Technology (SMT) , vol. 20 no. 3, pp. xx-xx, Mar. 2006.

Roya, Emilia, Chinn, Robert, and Cote, Debbie, "Is your company ready for U.S. mercury labeling requirements?," Green SupplyLine, Feb. 14, 2006.

Royan, R. Nishata, Sulong, Abu Bakar, Suherman, Hendra, and Sahari, Jaafar, "Effect of wet oxidation on the dispersion and electrical properties of Multi-walled Carbon Nanotubes/Epoxy Nanocomposites," Key Engineering Materials, vol. 471-472, pp. 162-166, 2011.

Royte, Elizabeth, "E-Gad!," Conformity, vol. 10 no. 11, pp. 12, 14-15, Nov. 2005.

Rozen, M., and Renaud, M., "Effects of Temperature on Bright Acid Tin-Plated Deposits," Plating , vol. 57 no. 10, pp. 1019-1024, Oct. 1970.

Rozen, M., "Practical Whisker Growth Control Methods," Plating, vol. 55 no. 11, pp. 1155-1160, Nov. 1968.

Rozovskij, G., Petretyte, L., Gavrilov, G., and Karagiozova, Z., "Copper Behavior During Immersion Deposition of Tin," Plating & Surface Finishing, vol. 77 no. 4, pp. 60-62, Apr. 1990.

Ruan, Haibo, Wang, Ranlong, Luo, Yulin, Liu, Hongdong, Han, Tao, and Yang, Liu, "Study on synthesis and growth mechanism of copper nanowires via a facile oleylamine-mediated process," Journal of Materials Science: Materials in Electronics, vol. 27 no. 9, pp. 9405-9409, Sept. 2016.

Ruangsinchaiwanich, S., Intachai, S., and Nakem, P.. "Surface tension analysis affecting Deformation of Solder Bumps," IEEE Vehicle Power and Propulsion Conference, Harbin, China, Sept. 3-5, 2008, pp. xx-xx.

Rubin, Holly-Dee, "Alternate Interconnect Methods Using Conductive Adhesives," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume 2, San Jose, CA, Aug. 31-Sept. 2, 1993, pp. 748-752.

Rubin, Wallace, "Some reflections on lead free solder issues," Global SMT and Packaging, vol. 7 no. 12, pp. 44-45, Dec. 2007.

Rubinstein, Marvin, and Rosen, Al, "Electrochemical Metallizing For Tin and Tin Alloy Applications," Plating & Surface Finishing, vol. 75 no. 8, pp. 34-38, Aug. 1988.

Rudajevova, A., and Dusek, K., "Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints," Journal of Electronic Materials, vol. 43 no. 7, pp. 2479-2486, July 2014.

Rudman, Bob, "Anisotropic (ZAF's) Conductive Adhesives for Electronic Connections," IPC Printed Circuits Expo 1998, Long Beach, CA, Apr. 26-30, 1998, pp. S02-2-1-S02-2-5.

Rudra, B., Li, M. J., Pecht, M., and Jennings, D., "Electrochemical Migration in Multichip Modules," Circuit World, vol. 22 no. 1, pp. 67-70, 1996.

Rudra, Balu, and Jennings, David, "Failure-Mechanism Models for Conductive-Filament Formation," IEEE Transactions on Reliability, vol. 43 no. 3, pp. 354-360, Sept. 1994.

Rudrapati, Sandesh, and Lall, Pradeep, "Thermo-Mechanical Reliability of Flip-Chip Devices-on-Metal Backed Flex Circuits," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 487-494.

Rudy, Stephen F., "2001: A Plating & Surface Finishing Odyssey," Plating & Surface Finishing, vol. 88 no. 1, pp. 66-67, Jan. 2001.

Rudy, Stephen F., "2001: A Plating & Surface Finishing Odyssey The Journey Continues ...," Plating & Surface Finishing, vol. 88 no. 2, pp. 46-48, Feb. 2001.

Rudy, Stephen F., "2001: A Plating & Surface Finishing Odyssey The Journey Continues, Part 3," Plating & Surface Finishing, vol. 88 no. 4, pp. 65-67, Apr. 2001.

Rudy, Stephen F., "2001: A Plating & Surface Finishing Odyssey The Journey Continues, Part 4," Plating & Surface Finishing, vol. 88 no. 5, pp. 110-112, May 2001.

Rudy, Stephen F., "2001: A Plating & Surface Finishing Odyssey The Journey Continues, Part 5," Plating & Surface Finishing, vol. 88 no. 5, pp. xx-xx, June 2001.

Rudy, Stephen F., "2001: A Plating & Surface Finishing Odyssey The Journey Continues, Part 6," Plating & Surface Finishing, vol. 88 no. 7, pp. 38-42, July 2001.

Rudy, Stephen F., "2001: A Plating & Surface Finishing Odyssey The Journey Continues, Part 7," Plating & Surface Finishing, vol. 88 no. 9, pp. 53-55, Sept. 2001.

Rudy, Stephen F., "2001: A Plating & Surface Finishing Odyssey The Journey Continues, Part 8," Plating & Surface Finishing, vol. 88 no. 10, pp. 38-40, Oct. 2001.

Rudy, Stephen F., "2001: A Plating & Surface Finishing Odyssey The Journey Continues, Part 9," Plating & Surface Finishing, vol. 88 no. 11, pp. 38-40, Nov. 2001.

Rudy, Stephen F., "Alternative Procedures & Processes," Plating and Surface Finishing , vol. 92 no. 2, pp. 28, 53, Feb. 2005.

Rudy, Stephen F., "Alternatives for Hex Chrome Exposure Standard," Plating & Surface Finishing, vol. 93 no. 6, pp. 34-35, June 2006.

Rudy, Stephen F., "Beat the Heat - Keep it Cool," Plating & Surface Finishing, vol. 91 no. 6, pp. 25, 29, June 2004.

Rudy, Stephen F., "Caught on the Fly," Plating & Surface Finishing, vol. 93 no. 7, pp. 42-43, July 2006.

Rudy, Stephen F., "Change is Good ... Change is Ongoing ... To Chrome or Not to Chrome," Plating & Surface Finishing, vol. 87 no. 12, pp. 56-57, Dec. 2000.

Rudy, Stephen F., "Functional Plating - Applications for 16 Deposits," Plating & Surface Finishing, vol. 89 no. 10, pp. 28-29, Oct. 2002.

Rudy, Stephen F., "Glitches in Every Direction; Problems in Any Possible Way," Plating & Surface Finishing, vol. 87 no. 3, pp. 56-58, Mar. 2000.

Rudy, Stephen F., "Mechanical Processing - An Alternative To Traditional Plating," Plating & Surface Finishing, vol. 89 no. 1, pp. 48-49, Jan. 2002.

Rudy, Stephen F., "More on Analysis & Control: Additional Procedures & Tips," Plating & Surface Finishing, vol. 90 no. 5, pp. 70-71, May 2003.

Rudy, Stephen F., "RoHS is Coming," Plating & Surface Finishing, vol. 91 no. 10, pp. 51, Oct. 2004.

Rudy, Stephen F., "Trivalent Chromates Boosting Systems & Compliance," Plating and Surface Finishing, vol. 92 no. 5, pp. 40-41, May 2005.

Rudy, Stephen F., "Winter Means Heat," Plating & Surface Finishing, vol. 92 no. 10, pp. 32-33, Oct. 2005.

Ruffini, Alan J., "Electroless Nickel Technology Formulated Without Lead & Cadmium: An Overview of the Performance Characteristics," Proceedings 2004 AESF/EPA Conference for Environmental & Process Excellence, Orlando, FL, Jan. 26-29, 2004, pp. 252-257.

Ruffino, B., Zanetti, M. C., and Marini, P., "A mechanical pre-treatment process for the valorization of useful fractions from spent batteries," Resources, Conservation and Recycling, vol. 55 no. 3, pp. 309-315, Jan. 2011.

Ruggiero, P., and Froning, Marc, "A Winning Alternative to Hard Chrome in Deep Bore Applications," Advanced Materials & Processes, vol. 164 no. 8, pp. 60-61, Aug. 2006.

Ruhland, Mark, "Part finishing and the new RoHS and ELV directives," DesignFax , vol. 2 no. 17, pp. xx-xx, May 2, 2006.

Ruhland, Mark, "Part Finishing and the New RoHS and ELV Directives," Metal Finishing , vol. 104 no. 7/8, pp. 68-72, July/Aug. 2006.

Ruhmer, Klaus, Laine, Eric, O'Donnell, Kathy, Kostetsky, John, Hauck, Karin, Manessis, Dionysios, Ostmann, Andreas, Toepper, Michael, and Juergensen, Nils, "Alternative UBM for Lead Free Solder Bumping using C4NP," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 15-21.

Ruhmer, Klaus, Laine, Eric, and Gruber, Peter, "C4NP - IBM Manufacturing & Reliability Data for Lead Free Flip Chip Solder Bumping," International Microsystems, Packaging, Assembly Conference Taiwan, Taipei, Taiwan, Oct. 18-20, 2006, pp. xx-xx.

Ruhmer, Klaus, Laine, Eric, and Gruber, Peter, "C4NP: Lead-Free and Low Cost Solder Bumping Technology for Electronics Packaging," Circuitree, vol. 19 no. 8, pp. xx-xx, Aug. 2006.

Ruhmer, Klaus, Fleming, Daniel, and Gruber, Peter, "C4NP: Lead-Free and Low Cost Solder Bumping Technology for Flip Chip and WLCSP," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Ruhmer, Klaus, Laine, Eric, Hauck, Karin, Manessis, Dionysios, Ostmann, Andreas, Toepper, Michael, and Juergensen, Nils, "ENIG UBM with C4NP Lead Free Solder Bumping," 4th International Wafer Level Packaging Congress, San Jose, CA, Sept. 17-19, 2007, pp. xx-xx.

Ruhmer, Klaus, Gruber, Peter, Toennies, Dietrich, and Hughlett, Emmett, "Lead Free Bumping Using C4NP Reliability and Cost Information - Extended Abstract," Second International Wafer-Level Packaging Congress, San Jose, CA, Nov. 3-4, 2005, pp. 168-169.

Ruhmer, Klaus, Hughlett, Emmett, Ishizuka, Masahiko, Kojima, Tomoaki, Asaka, Takeshi, Dang, Bing, Buchwalter, Steve, and Shih, Da-Yuan, "Lead Free Micro Bumping - Cost & Yield Challenges," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 331-337.

Ruhmer, Klaus, Laine, Eric, Hauck, Karin, Manessis, Dionysios, Ostmann, Andreas, and Toepper, Michael, "Low Cost UBM for Lead Free Solder Bumping with C4NP," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Ruhmer, Klaus, Hawken, David, Busby, James, Budd, Russell, and Danovitch, David, "Solder Micro-Bumping for 3D SiP and FlipChip Extended Abstract," NEPCON Shanghai 2008, Shanghai, China, Apr. 8-11, 2008, pp. xx-xx.

Ruhmer, Klaus, Laine, Eric, O'Donnell, Kathy, Kostetsky, John, Hauck, Karin, Manessis, Dionysios, Ostmann, Andreas, and Toepper, Michael, "Under Bump Metallurgy for C4NP Lead Free Solder Bumping," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Rui, Manman, Lu, Xiuzhen, Chen, Si, Ye, Lilei, and Johan, Liu, "TiO2 Nanoparticles Functionalized Sn/3.0Ag/0.5Cu Lead-free Solder," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 203-207.

Ruifen, Zhang, and Dexter, Reynoso, "Fundamental knowledge of solder paste," Global SMT and Packaging , vol. 13 no. 6, pp. 8-10,12,40, June 2013.

Rungyusiri, Vipa, Sa-ngiamsak, Chiranut, Harnsoongnoen, Sanchai, and Intarakul, Poonsak, "Comparison of Electromigration for Lead-Free Solder Joints of Cu vs. Ni UBM Flip Chip Structure," 6th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology, Volume 1, Pattaya, Thailand, May 6-9, 2009, pp. 469-472.

Rupprecht, Howard, "Hand Soldering," Lead-Free Magazine, vol. 1.

Rupprecht, Howard, "Hand Soldering," Lead-Free Magazine.

Rupprecht, Howard, "Hand Soldering," Lead-Free Magazine.

Rusanen, Outi, Keranen, Kimmo, Blomberg, Martti, and Lehto, Ari, "Adhesive Flip Chip Bonding in a Miniaturised Spectrometer," The First IEEE International Symposium on Polymeric Electronics Packaging, Oct. 26-30, 1997, pp. 95-100.

Rusanen, Outi, and Torkkeli, Altti, "Adhesives as a Thermomechanical Stress Source - Comparing Silicones to Epoxies," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 288-294.

Rusanen, Outi, "Modelling of ICA Creep Properties," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 194-198.

Rusanen, Outi, and Laitinen, Janne R., "Reasons for Using Lead-free Solders Rather than Isotropically Conductive Adhesives in Mobile Phone Manufacturing," 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, Portland, OR, Sept. 12-15, 2004, pp. 89-91.

Rusanen, Outi, and Lenkkeri, Jaako, "Reliability Issues of Replacing Solder with Conductive Adhesives in Power Modules," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, vol. 18 no. 2, pp. 320-325, May 1995.

Rusanen, Outi, Rohde, Hartmut, and Brielmann, Volker, "Roadmap Adhesives Technologies in Automotive and Harsh Environment Applications," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 307-309.

Rusanen, Outi, and Lenkkeri, Jaakko, "Thermal Stress Induced Failures in Adhesive Flip Chip Joints," The International Journal of Microcircuits and Electronic Packaging, vol. 22 no. 4, pp. 363-369, 4th Quarter 1999.

Ruschau, G. R., Yoshikawa, S., and Newnham, R. E., "Percolation Constraints in the Use of Conductor-Filled polymers for Interconnects," 1992 Proceedings 42nd Electronic Components & Technology Conference, San Diego, CA, May 18-20, 1992, pp. 481-486.

Russell, Allan M., and Abbott, Robert C., "Whisker Growth from Iodide Titanium Wire," Journal of Applied Physics , vol. 29, pp. 1130-1131, 1958.

Russell, Bill, Fritz, Dennis, and Latta, Gary, "Evaluating "Reverse Compatibility" of Solder Joints," IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics, Raleigh, NC, Mar. 11-12, 2008, pp. xx-xx.

Russell, Bill, Fritz, Dennis, and Latta, Gary S., "Methodology for Evaluating Data for "Reverse Compatibility" of Solder Joints," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 200-218.

Russell, Bill, Fritz, Dennis, and Tucker, Jonathon P., "Methodology for Evaluating Data for "Reverse Compatibility" of Solder Joints II," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 322-332.

Russell, Eric, "Time is running out," New Electronics, vol. 36 no. 7, pp. 52-53, Apr. 8, 2003.

Russell, Kimberley A., Hession-Kunz, Drew, and Connors, Brendan "Portable XRF for RoHS Compliance and Pb-Free Soldering," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 655-659.

Russell, Steve, "How will green IT laws impact your business?," ZDNet UK, Aug. 26, 2005.

Russev, Dimiter Christov, and Karaivanov, Stefan Jordanov, "Microcracked Chromium Plating," Metal Finishing, vol. 79 no. 1, pp. 21-25, Jan. 1981.

Russick, Edward M., and Thayer, Gayle Echo, "Conformal Coating Value/Risk Assessment for Sandia Satellite Programs," Sandia Report SAND2008-1125, Mar. 2008.

Russkikh, O., and Sandera, J., "Reliability of Lead Free Solder SAC 305 for Chip Components Depending on Various Factors," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 471-476.

Russo-Averchi, E., Tutuncuoglu, G., Dalmau-Mallorqui, A., Mundet, I. Canales, de la Mata, M., Ruffer, D., Arbiol, J., Conesa-Boj, S., and Morral, A. Fontcuberta i, "Bottom-up engineering of InAs at the nanoscale: From V-shaped nanomembranes to nanowires," Journal of Crystal Growth, vol. 420, pp. 47-56, June 15, 2015.

Ruth, V., and Hirth, J. P., "Kinetics of Diffusion-Controlled Whisker Growth," Journal of Chemical Physics, vol. 41 no. 10, pp. 3139-3149, Nov. 15, 1964.

Rutledge, Art, "The RoHS Transition: An EMS View," Surface Mount Technology (SMT) , vol. 20 no. 6, pp. xx-xx, June 2006.

Ryan, Claire, Punch, Jeff, and Rodgers, Bryan, "A Reliability Evaluation of Lead-Free Ball Grid Array (BGA) Solder Joints through Mechanical Fatigue Testing," Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, Apr. 18-20, 2005, pp. 436-440.

Ryan, Claire, O'Neill, Shane, Donovan, John, Punch, Jeff, Rodgers, Bryan, and Murphy, Eamonn, "Optimising Lead-free Screen-printing and Reflow Process Parameters," The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 664-668.

Ryan, Claire, Rodgers, Bryan A., and Punch, Jeff M., "SnAgCu Micro-ball Grid Array (BGA) Solder Joint Evaluation Using a Torsion Mechanical Fatigue Test Method," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B , San Francisco, CA, July 17-22, 2005, pp. 1223-1228.

Rydh, Carl Johan, and Karlstrom, Magnus, "Life cycle inventory of recycling portable nickel-cadmium batteries," Resources, Conservation, and Recycling, vol. 34 no. 4, pp. 289-309, Mar. 2002.

Ryen, Erinn G., and Babbitt, Callie, "Identifying Barriers to Efficient Recovery and Sustainable End of Life Management of Electronic Waste," 2010 IEEE International Symposium on Sustainable Systems and Technology, Arlington, VA, May 17-19, 2010, pp. xx-xx.

Ryu, ChangGyun, Hsu, Jackson, Mendoza, Lito, Capuz, Au, Caguiat, Jaycie, Sy, Hansen, and Lathrop, Rick, "Novel Approaches to Current BGA Packaging Challenges," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1258-1263.

Ryu, J. B., Huh, J. Y., Kim, H. S., and Oh, S. J., "Solid-state Interaction between Ni and Cu for Ternary Compound Growth in Ni/Sn/Cu Diffusion Couple," Advanced Materials Research, vol. 15-17, pp. 604-608, 2007.

Ryu, Je Hong, Choi, Ki Seop, and Kim, Whan Gun, "Latent Catalyst Effects in Halogen-Free Epoxy Molding Compounds for Semiconductor Encapsulation," Journal of Applied Polymer Science, vol. 96 no. 6, pp. 2287-2299, June 15, 2005.

Ryu, Kwang Hyun, Kwon, Namic, Seo, Myung Hee, Lee, Myung Hoon, Nam, Gi Jung, and Kwak, No Heung, "A New Method of Anisotropic Conductive Film Bonding by High Power Diode Laser (HPDL)," 2005 Quantum Electronics and Laser Science Conference, Volume 3 , Baltimore, MD, May 22-27, 2005, pp. 1585-5187.

Ryu, Kwang Hyun, Kwon, Namic, Seo, Myung Hee, Lee, Myung Hoon, Nam, Gi Jung, and Kwak, No Heung, "Anisotropic Conductive Film Bonding by Making Use of a High-Power Diode Laser," IEEE Transactions on Advanced Packaging, vol. 29 no. 4, pp. 701-706, Nov. 2006.

Ryu, Seunghwa, and Cai, Wei, "Molecular dynamics simulations of gold-catalyzed growth of silicon bulk crystals and nanowires," Journal of Materials Research, vol. 26 no. 17, pp. 2199-2206, Sept. 14, 2011.

Ryu, Woonghwan, Yim, Myung-Jin, Paik, Kyung-Wook, and Kim, Joungho, "Anisotropic Conductive Film (ACF) Flip-chip Interconnect In Over GHz RF Clock Distribution System," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 153-158.

Ryu, Woonghwan, Yim, Myung-Jin, Ahn, Seungyoung, Lee, Junho, Kim, Woopoung, Paik, Kyung-Wook, and Kim, Joungho, "High-Frequency SPICE Model of Anisotropic Conductive Film Flip-Chip Interconnections Based on a Genetic Algorithm," IEEE Transactions on Components and Packaging Technologies, vol. 23 no. 3, pp. 542-545, Sept. 2000.

Ryu, Woonghwan, Yim, Myung-Jin, Lee, Junho, Jeon, Young-Doo, and Ahn, Seungyoung, "Microwave Frequency Model of Flip-Chip Interconnects Using Anisotropic Conductive Film," Proceedings 1999 International Conference on High-Density Packaging and MCMs, Denver, CO, Apr. 6-9, 1999, pp. 311-315.

Rzeznik, Maria, "It's Not Easy Being Greener," PCB007, Dec. 8, 2008.

SSSS

Sa, Xianzhang, Zhou, Wei, and Wu, Ping, "Electromigration in Cu-Cored Sn-3.5Ag-0.7Cu Solder Interconnects Under Current Stressing," Journal of Electronic Materials, vol. 43 no. 4, pp. 1144-1149, Apr. 2014.

Sa, Xianzhang, and Wu, Ping, "Microstructure Evolution of Cu-Cored Sn Solder Joints Under High Temperature and High Current Density," Journal of Electronic Materials, vol. 42 no. 8, pp. 2641-2647, Aug. 2013.

Sa, Yoon-Ki, Yoo, Sehoon, Shin, Yue-Seon, Han, Min-Kyu, and Lee, Chang-Woo, "Joint Properties of Solder Capped Copper Pillars for 3D Packaging," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 2019-2024.

Saad, G., Fawzy, A., and Shawky, E., "Effect of Ag Addition on the Creep Characteristics of Sn-8.8wt%Zn Solder Alloy," Journal of Alloys and Compounds, vol. 479 no. 1-2, pp. 844-850, June 24, 2009.

Saarinen, Kirsi, and Frisk, Laura, "Reliability Testing and Modeling of Anisotropic Conductive Adhesive Joints Under Temperature Cycling Test," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 9, pp. 1512-1523, Sept. 2013.

Saarinen, Kirsi, and Frisk, Laura, "Shear stress modeling of ACA joints in thermal tests," 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Lisbon, Portugal, Apr. 16-18, 2012, pp. xx-xx.

Saarinen, Kirsi, and Frisk, Laura, "The Effects of Temperature Profile of Accelerated Temperature Cycling Tests on the Reliability of ACAC joints in RFID Tags," Journal of Microelectronics and Electronic Packaging, vol. 8, pp. 10-15, 2011.

Saarinen, Kirsi, and Frisk, Laura, "Utilizing Modeling in a Reliability Study of ACA Joints in Humidity Tests," Journal of Microelectronics and Electronic Packaging, vol. 10 no. 1, pp. 30-39, Jan. 2013.

Saas, Bill, "Chrome PEL Issue Taints Otherwise Bright Business Outlook," Metal Finishing, vol. 103 no. 1, pp. 14, Jan. 2005.

Sabbagh, N. A. J., and McQueen, H. J., "Tin Whiskers: Causes & Remedies," Metal Finishing, vol. 73 no. 3, pp. 27-31, Mar. 1975.

Sabbah, Wissam, Bondue, Pierre, Avino-Salvado, Oriol, Buttay, Cyril, Fremont, Helene, Guedon-Gracia, Alexandrine, and Morel, Herve, "High temperature ageing of microelectronics assemblies with SAC solder joints," Microelectronics Reliability, vol. 76-77, pp. 362-367, Sept. 2017.

Sabbah, Wissam, Azzopardi, Stephane, Buttay, Cyril, Meuret, Regis, and Woirgard, Eric, "Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy," Microelectronics Reliability , vol. 53 no. 9-11 pp. 1617-1621, Sept.-Nov. 2013.

Sabbar, A., Zrineh, A., Dubes, J. P., Gambino, M., Bros J. P., and Borzone, G., "The Ag-Bi-In system: enthalpy of formation," Thermochimica Acta, vol. 395 no. 1-2, pp. 47-58, Jan. 3, 2002.

Sabri, M. F. M., Nordin, N. I. M., Said, S. M., Amin, N. A. A. M., Arof, H., Jauhari, I., Ramli, R., and Weide-Zaage, K., "Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys," Microelectronics Reliability, vol. 55 no. 9-10, pp. 1882-1885, Aug.-Sept. 2015.

Sabri, Mohd Faizul Mohd, Shnawah, Dhafer Abdul-Ameer, Badruddin, Irfan Anjum, and Said, Suhana Binti Mohd, "A Compliant Lead-Free Solder Alloy," 2012 10th IEEE International Conference on Semiconductor Electronics, Kuala Lumpur, Malaysia, Sept. 24-26, 2012, pp. 453-457.

Sabri, Mohd Faizul Mohd, Shnawah, Dhafer Abdulameer, Badruddin, Irfan Anjum, and Said, Suhana Binti Mohd, "Effects of aging on Sn-1Ag-0.5Cu solder alloys containing 0.1 wt.% and 0.5 wt.% Al," Journal of Alloys and Compounds, vol. 582, pp. 437-446, Jan. 5, 2014.

Sabri, Mohd Faizul Mohd, Shnawah, Dhafer Abdul-Ameer, Badruddin, Irfan Anjum, and Said, Suhana Binti Mohd, "Microstructural Stability and Mechanical Properties of Sn-1Ag-0.5Cu Solder Alloy with 0.1 wt.% Al Addition Under High-Temperature Annealing," 2012 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium , Nov. 6-8, 2012, pp. xx-xx.

Sabuncuoglu, Baris, Vanhee, Filip, Willems, Geert, Vandevelde, Bart, and Vandepitte, Dirk, "Evaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 7 no. 12, pp. 1957-1964, Dec. 2017.

Sabuncuoglu, Baris, Vanhee, Filip, Willems, Geert, Vandevelde, Bart, Vandepitte, Dirk, and De Wolf, Ingrid, "Finite Element Modeling of Solder Joint Fatigue in Four-Point Bending Test," 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Lisbon, Portugal, Apr. 16-18, 2012, pp. xx-xx.

Sack, Thilo, and Scala, Joe, "Managing lead-free MSL ratings," Green SupplyLine, June 20, 2005.

Sack, Thilo, Shangguan, Dongkai, Skoczowski, Thomas, Smith, Brian, and Sullivan, Bob, "Optimization of Lead Free SMT Reflow & Rework Process Window," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S24-01-1-S24-01-16.

Sadasiva, Subramanya, Subbarayan, Ganesh, Jiang, Lei, and Pantuso, Daniel, "Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects," Journal of Electronic Packaging , vol. 134 no. 2, pp. 020907-1-020907-9, June 2012.

Sadasiva, Subramanya, Subbarayan, Ganesh, Jiang, Lei, and Pantuso, Daniel, "Numerical Simulations of Electromigration and Stress Migration Driven Void Propagation in Pb Free Solder Interconnects," Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, Volume 1, Portland, OR, July 6-8, 2011, pp. 585-590.

Sadeghian, Hamed, Goosen, Hans, Bossche, Andre, Thijsse, Barend, and van Keulen, Fred, "On the size-dependent elasticity of silicon nanocantilevers: impact of defects," Journal of Physics D: Applied Physics, vol. 44 no. 7, pp. 072001-1-072001-6, Feb. 2011.

Sadiq, Muhammad, Pesci, Raphael, and Cherkaoui, Mohammed, "Impact of Thermal Aging on the Microstructure Evolution and Mechanical Properties of Lanthanum-Doped Tin-Silver-Copper Lead-Free Solders." Journal of Electronic Materials, vol. 42 no. 3, pp. 492-501, Mar. 2013.

Sadiq, Muhammad, Lecomte, Jean-Sebastien, and Cherkaoui, Mohammed, "Individual Phase Mechanical Properties at Different Temperatures of Sn-Ag-Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation," Journal of Electronic Packaging, vol. 137 no. 3, pp. 031005-1-031005-5, Sept. 2015.

Sadler, Mike, "Counting down to WEEE-day," Manufacturing Engineer, vol. 84 no. 3, pp. 48, June/July 2005.

Sadler, Michael, and Pavry, Justin, "What are the financial risks of ignoring WEEE?," Electronics Weekly , Oct. 16, 2006.

Saeed, U., Flandorfer, H., and Ipser, H., "Lead-free solders: Enthalpies of mixing of liquid Ag-Cu-Ni-Sn alloys," Journal of Materials Research, vol. 22 no. 11, pp. 3218-3225, Nov. 2007.

Saeed, Usman, Flandorfer, Hans, and Ipser, Herbert, "Lead-free solders: Enthalpies of mixing of liquid alloys in the Ag-Ni and Ag-Ni-Sn systems," Journal of Materials Research, vol. 21 no. 5, pp. 1294-1304, May 2006.

Saeki, Koji, and Carano, Michael, "Next Generation Organic Solderability Preservatives (OSP) for Lead-free Soldering and Mixed Metal Finish PWB's and BGA Substrates," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference , Anaheim, CA, Feb. 24-26, 2004, pp. S10-2-1-S10-2-9.

Safranek, William H., "Cadmium Plating," Plating & Surface Finishing, vol. 82 no. 8, pp. 46-47, Aug. 1995.

Safranek, William H., "Cadmium Plating," Plating & Surface Finishing, vol. 84 no. 8, pp. 45-46, Aug. 1997.

Safranek, William H., "Cadmium Plating," Plating & Surface Finishing, vol. 85 no. 11, pp. 40-41, Nov. 1998.

Safranek, William H., "Cadmium Plating," Plating & Surface Finishing, vol. 86 no. 11, pp. 34-35, Nov. 1999.

Safranek, William H., "Cadmium Plating," Plating & Surface Finishing, vol. 87 no. 8, pp. 32-33, Aug. 2000.

Safranek, William H., "Cadmium Plating," Plating & Surface Finishing, vol. 88 no. 8, pp. 26-27, Aug. 2001.

Safranek, William H., "Cadmium Plating," Plating & Surface Finishing, vol. 89 no. 8, pp. 22-23, Aug. 2002.

Safranek, William H., "Cadmium Plating," Plating & Surface Finishing, vol. 90 no. 8, pp. 17-18, Aug. 2003.

Safranek, William H., "Cadmium Plating," Plating & Surface Finishing, vol. 91 no. 8, pp. 11-12, Aug. 2004.

Safranek, William H., "Cadmium Plating," Plating & Surface Finishing, vol. 94 no. 11, pp. 15, 18, Nov. 2006.

Sagawa, Tomoharu, Oyama, Masaki, Haga, Souichi, Kawahira, Tetsuya, Ishii, Takahiro, Kurosawa, Masaru, Koshihara, Masatomo, and Goto, Hideo, "Anisotropic Conductive Paste (ACP) Connection Technology," Fujikura Technical Review, no. 34, pp. 33-37, Jan. 2005.

Sage, Jan, and Schnitzer, Hans, "Waste minimization and its ecological evaluation: A case study in printed circuit board manufacture," Journal of Cleaner Production, vol. 2 no. 3-4, pp. 185-195, 1994.

Saha, S. K., Howell, R. S., and Hatalis, M. K., "Elimination of hillock formation in Al interconnects using Ni or Co," Journal of Applied Physics, vol. 86 no. 1, pp. 625-633, July 1, 1999.

Saha, Sambit K., Mathew, Sesil, and Canumalla, Sridhar, "Effect of Intermetallic Phases on Performance in a Mechanical Drop Environment: 96.5Sn3.5Ag solder on Cu and Ni/Au Pad Finishes," 54th Electronic Components & Technology Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1288-1295.

Saha, Sourav, Motalab, Mohammad Abdul, and Mahboob, Monon, "Investigation on mechanical properties of polycrystalline W nanowire," Computational Materials Science, vol. 136, pp. 52-59, Aug. 2017.

Sahasrabudhe, Shubhada, Mokler, Scott, Renavikar, Mukul, Sane, Sandeep, Byrd, Kevin, Brigham, Eric, Jin, Owen, Goonetilleke, Pubudu, Badwe, Nilesh, and Parupalli, Satish, "Low Temperature Solder - A Breakthrough Technology for Surface Mounted Devices," 2018 IEEE 68th Electronic Components and Technology Conference , San Diego, CA, May 29-June 1, 2018, pp. 1455-1464.

Sahaym, Uttara, Miller, Stephanie L., and Norton, M. Grant, "Effect of plating temperature on Sn surface morphology," Materials Letters, vol. 64 no. 14, pp. 1547-1550, July 31, 2010.

Sahaym, Uttara, Talebanpour, Babak, Seekins, Sean, Dutta, Indranath, Kumar, Praveen, and Borgesen, Peter, "Recrystallization and Ag4Sn Particle Redistribution During Thermomechanical Treatment of Bulk Sn-Ag-Cu Solder Alloys," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 11, pp. 1868-1875, Nov. 2013.

Sahin, Mevlut, and Cadirli, Emin, "The effects of temperature gradient and growth rate on the microstructure of directionally solidified Sn-3.5Ag eutectic solder," Journal of Materials Science: Materials in Electronics, vol. 23 no. 2, pp. 484-492, Feb. 2012.

Sahni, S., Boustani, A., Gutowski, T. G., and Graves, S. C., "Reusing Personal Computer Devices - Good or Bad for the Environment?," 2010 IEEE International Symposium on Sustainable Systems and Technology , Arlington, VA, May 17-19, 2010, pp. xx-xx.

Sahraoui, T., Fenineche, N. E., Montavon, G., and Coddet, C., "Wear behavior of HVOF Sprayed WC-12%Co coatings vs. Hard Chrome Plating," Proceedings of the International Thermal Spray Conference, Osaka, Japan, May 10-12, 2004, pp. 488-491

Saif, Taher, Alaca, Erdem, and Sehitoglu, Huseyin, "Nano Wires by Self Assembly," The Sixteenth Annual International Conference on Micro Electro Mechanical Systems, Kyoto, Japan, Jan. 23, 2003, pp. 45-47.

Saimoto, S., Griffiths, V., and Teghtsoonian, E., "Growth Kinks in Copper Whiskers," Journal of Applied Physics, vol. 31, pp. 1693-1694, 1960.

Saint-Martin, Xavier, and Joly, Jean, "Plastic Package Moisture Absorption Hazards in SMT Board Assembly," Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium , San Francisco, CA, Sept. 25-27, 1989, pp. 38-42.

Saito, Akira, and Nishikawa, Hiroshi, "Tin Whisker Growth Mechanism on Tin Plating of MLCCs Mounted with Sn-3.5Ag-8In-0.5Bi Solder in 30°C60%RH," 2019 22nd European Microelectronics and Packaging Conference & Exhibition, Pisa, Italy, Sept. 16-19, 2019. pp. xx-xx.

Saito, M., Sasaki, H., Katou, K., Toba, T., and Homma, T., "Effect of Cu Seed Layers on the Properties of Electroplated Sn-Cu Films," Journal of the Electrochemical Society, vol. 156 no. 5, pp. E86-E90, Jan. 2009.

Saito, Masayuki, Mori, Miki, Hongu, Akinori, and Niitsuma, Akira, "COG (Chip On Glass) Technique for LCD Using a Low Melting Point Metal," Proceedings of the 1990 International Symposium on Microelectronics , Chicago, IL, Oct. 15-17, 1990, pp. 263-268.

Saito, N., Kiumi, R., Kuriyama, F., and Kamimura, K., "Electroplating of Lead-Free Bumps on 300mm Wafers for WLP Applications," Second International Wafer-Level Packaging Congress, San Jose, CA, Nov. 3-4, 2005, pp. 148-153.

Saito, Shun, Nakasato, Katumi, Katoh, Yukihiro, Oshibe, Yoshihiro, and Ishidoya, Masahiro, "Application of Thermal Latent Carboxylic Acid Derivatives to Pb-Free Microsoldering," Materials Transactions, vol. 45 no. 3, pp. 759-764, Mar. 2004.

Saiyed, Shafi, Santos, Daryl, Andros, Frank, Chouta, Prashant, and McLenaghan, A. James, "Effects of Reflow Profile on Shear Strength of Sn/4.0Ag/0.5Cu Solder Spheres for Ball Grid Array Applications," 2002 Advanced Technology Symposium Conference Proceedings, 2002, pp. xx-xx.

Saiyed, Shafi, Santos, Daryl, and McLenaghanm A. James, "SMT Assembly Process Comparison of Pb-Free Alloy Systems - Part I," 2003 Pan Pacific Symposium Conference Proceedings, Feb. 18-20, 2003, pp. xx-xx.

Saiz, E., Hwang, C.-W., Suganuma, K., and Tomsia, A. P., "Spreading of Sn-Ag solders on FeNi alloys," Acta Materialia vol. 51 no. 11, pp. 3185-3197, June 2003.

Saka, H., Suzuki, Y., Fujino, S., Haruta, K., Takatsuji, H., Tsujimoto, K., and Tsuji, S., "Effects of surface damaging and overcoating on the formation of hillocks and whiskers on pure Al films deposited on to a glass substrate," Philosophical Magazine A, vol. 81 no. 2, pp. 275-285, Feb. 1, 2001.

Saka, H., Tsujimoto, K., Fujino, S., Kuroda, K., Takatsuji, H., and Tsuji, S., "Transmission electron microscopy of whiskers and hillocks formed on Al films deposited onto a glass," AIP Conference Proceedings, vol. 418, pp. 371-382, 1998.

Saka, M., Kohara, T., Hasegawa, T., and Yamashita, M., "A simple method for testing the electromigration resistance of solders," Microsystem Technologies, vol. 15 no. 1, pp. 17-25, Jan. 2009.

Saka, Masumi, Yamaya, Fumihiko, and Tohmyoh, Hironori, "Rapid and mass growth of stress-induced nanowhiskers on the surfaces of evaporated polycrystalline Cu films," Scripta Materialia, vol. 56 no. 12, pp. 1031-1034, June 2007.

Sakai, Hidehisa, Morimune, Katsufumi, and Yonemoto, Takashi, "Approaches to Technology of Thermal Fatigue Life Prediction of Solder Joints," Fujitsu Ten Technical Journal, no. 33, pp. 40-47, July 2009.

Sakai, Hiroshi, "Development of Decorative Trivalent Chromium Plating," Journal of the Surface Finishing Society of Japan, vol. 57 no. 12, pp. 869-871, 2006.

Sakai, Hiroshi, Uehara, Masami, Okada, Shinichi, Kishida, Hideya, and Sato, Yasuharu, "The Development of Environmentally Friendly PCs," NEC Technical Journal, vol. 1 no. 1, pp. 115-119, Mar. 2006.

Sakai, T., and Jonas, J. J., "Overview no. 35 Dynamic Recrystallization: Mechanical and Microstructural Considerations," Acta Metallurgica, vol. 32 no. 2, pp. 189-209, Feb. 1984.

Sakai, T., Watanabe, E., Sei, T., and Yamanaka, K., "Solder Electromigration Failure Time as a Function of the Angle Between the c-axis of Sn Crystals and Direction of Electron Flow," 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Nagasaki, Japan, Apr. 17-21, 2018, pp. 102-107.

Sakai, Takekazu, Amita, Hitoshi, Shibuya, Yoshinori, Kurozumi, Tadatoshi, Nagasaki, Shunsuke, and Shoji, Takashi, "Reliability of Solder Paste and Solder Pm-Coating Technology by Lead-Free Sn-Zn Base Solder Alloy," Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 293-302.

Sakaki, Hiroyuki, "Scattering Suppression and High-Mobility Effect of Size-Quantized Electrons in Ultrafine Semiconductor Wire Structures," Japanese Journal of Applied Physics, vol. 19, No. 12, pp. L735-L738, Dec. 1980.

Sakakida, Tomomi, Kubouchi, Tatsuo, Miyano, Yasuyuki, Takahashi, Mamoru, and Kamiya, Osamu, "Effect of Environment on Sn Whisker Growth during Welding of Electronic Wires," Advanced Materials Research, vol. 1110, pp. 235-240, June 2015.

Sakama, T., and Kajihara, M., "Kinetics of reactive diffusion between Pd-Ag alloys and Sn at solid-state temperatures," Journal of Alloys and Compounds, vol. xxx no. x, pp. xx-xx, xxxx.

Sakama, Taro, and Kajihara, Masanori, "Influence of Ag on Kinetics of Solid-State Reactive Diffusion between Pd and Sn," Materials Transactions, vol. 50 no. 2, pp. 266-274, Feb. 2009.

Sakamoto, Ichizo, "Whisker Test Methods of JEITA."

Sakamoto, Ichizo, "Whisker Test Methods of JEITA Whisker Growth Mechanism for Test Methods," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 10-16, Jan. 2005.

Sakamoto, Junji, Ohara, Hisakazu, and Shibutani, Tadahiro, "Finite element analysis of thermal and mechanical stresses due to the grain anisotropy of polycrystalline b-Sn," Microelectronics Reliability , vol. 71, pp. 29-34, Apr. 2017.

Sakane, Masao, Yagi, Kota, Itoh, Takamoto, Yamashita, Mitsuo, and Hokazono, Hiroaki, "Aging Effect on Creep Properties of SnBi Solders," 2014 IEEE 16th Electronics Packaging Technology Conference, Singapore, Dec. 3-5, 2014, pp. 583-586.

Sakelson, Roy, "Lead-Free Conference Highlights Fabricators' Issues," CircuiTree , vol. 18 no. 7, pp. xx-xx, July 2005.

Sakuma, K., Andry, P. S., Dang, B., Maria, J., Tsang, C. K., Patel, C., Wright, S. L., Webb, B., Sprogis, E., Kang, S. K., Polastre, R., Horton, R., and Knickerbocker, J. U., "3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections," 2007 Proceedings 57th Electronic Components & Technology Conference , Reno, NV, May 29-June 1, 2007, pp. 627-632.

Sakuma, K., Andry, P. S., Tsang, C. K., Wright, S. L., Dang, B., Patel, C. S., Webb, B. C., Maria, J., Sprogis, E. J., Kang, S. K., Polastre, R. J., Horton, R. R., and Knickerbocker, J. U., "3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections," IBM Journal of Research and Development , vol. 52 no. 6, pp. 611-622, Nov. 2008.

Sakuma, Katsuyuki, Webb, Buck, Liu, Xiao Hu, Knickerbocker, John, Weiss, Thomas, Li, Shidong, Zhang, Hongqing, Thomas, Conor R., Perfecto, Eric, Xu, Tingge, and Lu, Hongbing, "Fluxless Bonding Process using Thermo-compression Micro-scrub for 61 um pitch SnAg Solder 3-D interconnections," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 329-335.

Sakurai, Hitoshi, Kim, Keun-Soo, Lee, Kiju, Kim, Chang-Jae, Kukimoto, Youichi, and Suganuma, Katsuaki, "Effects of Cu contents in flux on microstructure and joint strength of Sn-3.5Ag soldering with electroless Ni-P/Au surface finish," Microelectronics Reliability, vol. 52 no. 11, pp. 2716-2722, Nov. 2012.

Sakurai, Hitoshi, Kukimoto, Youichi, Kim, Seongjun, Baated, Alongheng, Lee, Kiju, Kim, Keun-Soo, Kumamoto, Seishi, and Suganuma, Katsuaki, "Effects of Zn-Bearing Flux on Joint Reliability and Microstructure of Sn-3.5Ag Soldering on Electroless Ni-Au Surface Finish," Materials Transactions, vol. 51 no. 10, pp. 1727-1734, 2010.

Sakurai, Hitoshi, Baated, Alongheng, Lee, Kiju, Kim, Seongjun, Kim, Keun-Soo, Kumimoto, Youichi, Kumamoto, Seishi, and Suganuma, Katsuaki, "Effects of Zn-Containing Flux on Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish: Microstructure and Wettability," Journal of Electronic Materials, vol. 39 no. 12, pp. 2598-2604, Dec. 2010.

Sakuyama, Seiki, and Kutami, Michinori, "Substitute Materials for Complete Elimination of Hazardous Substances - Study of Whisker Growth on Lead-Free Plating," Fujitsu Scientific and Technical Journal, vol. 41 no. 2, pp. 217-224, July 2005.

Salam, B., Ekere, N. N., and Durairaj, R., "A Study of Inter-Metallic Compounds (IMC) Formation and Growth in Ultra-Fine Pitch Sn-Ag-Cu Lead-Free Solder Joints," 1st Electronics Systemintegration Technology Conference, Volume 2, Dresden, Germany, Sept. 5-7, 2006, pp. 988-994.

Salam, B, Virseda, C, Da, H, Ekere, N. N., and Durairaj, R., "Reflow profile study of the Sn-Ag-Cu solder," Soldering & Surface Mount Technology, vol. 16 no. 1, pp. 27-34, 2004.

Salam, B., Ekere, N. N., and Rajkumar, D., "Study of the Interface Microstructure of Sn-Ag-Cu Lead-Free Solders and the Effect of Solder Volume on Intermetallic Layer Formation," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 471-477.

Salazar, Chito, "Semi-conductors from the Philippines (Draft)," Global Product Chains: Northern Consumers, Southern Producers, and Sustainability.

Salazar, Victoria, "Evaluation of the Tin Plating on the Trailing Umbilical System Reel Ground Strap," NASA KSC-MSL-2007-0124, June 5, 2007.

Salehzadeh, O., and Watkins, S. P., "Control of GaAs nanowire morphology by group III precursor chemistry," Journal of Crystal Growth, vol. 325 no. 1, pp. 5-9, June 15, 2011.

Salema, Maria Isabel G., Barbosa-Povoa, ana P., and Novais, Augusto Q., "Design of a recovery network in Portugal: The electric and electronic equipment case," 2008 IEEE International Engineering Management Conference, Europe, Estoril, Portugal, June 28-30, 2008, pp. xx-xx.

Salhofer, Stefan, and Tesar, Maria, "Assessment of removal of components containing hazardous substances from small WEEE in Austria," Journal of Hazardous Materials, vol. 186 no. 2-3, pp. 1481-1488, Feb. 28, 2011.

Salleh, M. A. A. Mohd, McDonald, S. D., Gourlay, C. M., Belyakov, S. A., Yasuda, H., and Nogita, K., "Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process," Journal of Electronic Materials, vol. 45 no. 1, pp. 154-163, Jan. 2016.

Salleh, M. A. A. Mohd, McDonald, S. D., and Nogita, K., "Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates," Journal of Materials Processing Technology, vol. 242, pp. 235-245, Apr. 2017.

Salleh, M. A. A. Mohd, Bakri, A. M. Mustafa Al, Zan@Hazizi, M. H., Somidin, Flora, Alui, Noor Farhani Mohd, and Ahmad, Zainal Arifin, "Mechanical properties of Sn-0.7Cu/Si3N4 lead-free composite solder," Materials Science and Engineering: A, vol. 556, pp. 633-637, Oct. 30, 2012.

Salleh, M. A. A. Mohd, McDonald, S. D., Yasuda, H., Sugiyama, A., and Nogita, K., "Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces," Scripta Materialia, vol. 100, pp. 17-20, Apr. 15, 2015.

Salleh, Mohd Arif Anuar Mohd, Hazizi, Muhammad Hafiz, Ahmad, Zainal Arifin, Hussin, Kamarudin, and Ahmad, Khairel Rafezi, "Wettability, Electrical and Mechanical Properties of 99.3Sn-0.7Cu/Si3N4 Novel Lead-Free Nanocomposite Solder," Advanced Materials Research, vol. 277, pp. 106-111, 2011.

Salmela, Olli, "Acceleration Factors for Lead-Free Solder Materials," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 931-938.

Salmela, Olli, "Acceleration Factors for Lead-Free Solder Materials," IEEE Transactions on Components and Packaging Technologies, vol. 30 no. 4, pp. 700-707, Dec. 2007.

Salmela, Olli, Andersson, Klas, Perttula, Altti, Sarkka, Jussi, and Tammenmaa, Markku, "Modified Engelmaier's model taking account of different stress levels," Microelectronics Reliability, vol. xx no. x, pp. xx-xx, xxxx.

Salmela, Olli, Putaala, Jussi, Nousiainen, Olli, Uusimaki, Antti, Sarkka, Jussi, and Tammenmaa, Markku, "Multipurpose Lead-Free Reliability Prediction Model," Pan Pacific Symposium 2016 Proceedings, Waimea, HI, Jan. 25-28, 2016, pp. xx-xx.

Salmela, Olli, Andersson, Klas, Perttula, Altti, Sarkka, Jussi, and Tammenmaa, Markku, "Re-calibration of Engelmaier's Model for Leadless, Lead-free Solder Attachments," Quality and Reliability Engineering International, vol. 23 no. 4, pp. 415-429, June 2007.

Salmela, Olli, Nieminen, Teor, Sarkka, Jussi, and Tammenmaa, Markku, "Reliability Analysis of Lead-Free Solder Castellations," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 1, pp. 13-22, Mar. 2008.

Salmela, Olli, Andersson, Klas, Sarkka, Jussi, and Tammenmaa, Markku, "Reliability Analysis of Some Ceramic Lead-Free Solder Attachments," 2005 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Salmela, Olli, Andersson, Klas, Sarkka, Jussi, and Tammenmaa, Markku, "Reliability Analysis of Some Ceramic Lead-Free Solder Attachments," SMTA Journal, vol. 18 no. 2, pp. 15-22, Apr. 2005.

Salmela, Olli, "Solder Joint Shape Optimization for Ceramic Leadless Chip Carriers," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 433-441.

Salminen, J., "The Solder Joint Reliability of Conformal Coated WLCSP Components," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 341-347.

Salot Jr., Stanley H., "Achieving Green Compliance," Quality Digest, vol. 28 no. 10, pp. 30-33, Oct. 2008.

Salot Jr., Stanley H., "Controlling Heavy Metals (and Other Nasty Stuff)," Quality Digest , vol. 26 no. 10, pp. 32-36, Oct. 2006.

Salot Jr., Stanley H., "Process Management for Hazardous Substances," Quality Digest , vol. 26 no. 3, pp. 27-31, Mar. 2006.

Sam, Mahshid, Moghimian, Nima, and Bhiladvala, Rustom B., "Field-directed chaining of nanowires: towards transparent electrodes," Materials Letters, vol. 163, pp. 205-208, Jan. 15, 2016.

Samant, Purnanand G., Poranki, Srikanth, and Santos, Daryl, "Evaluate Soldering Irons for Pb-Free Assembly - A Quantitative Approach," Journal of the Reliability Information Analysis Center, pp. 14-17, 2nd Quarter 2006.

Samardak, A. S., Ognev, A. V., Sukovatitsina, E. V., Stebliy, M. E., Modin, E. B., Chebotkevich, L. A., Mahmoodi, R., Hosseini, M. G., Peighambari, S. M., and Nasirpouri, F., "Magnetic Behavior of Single Ni Nanowires and Its Arrays Embedded in Highly Ordered Nanoporous Alumina Templates," Solid State Phenomena, vol. 215, pp. 298-305, Apr. 2014.

Samat, Adzahar, and Chia, K. L., "Re Introduction of Vapor Phase Soldering Technology for Lead Free Application," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 809-813.

Samavatian, Vahid, Iman-Eini, Hossein, Avenas, Yvan, and Samavatian, Majid, "Effects of Creep Failure Mechanisms on Thermomechanical Reliability of Solder Joints in Power Semiconductors," IEEE Transactions on Power Electronics , vol. 35 no. 9, pp. 8956-8964, Sept. 2020.

Samavatian, Vahid, Masoumian, Armin, Mafi, Mehdi, Lakzaei, Mostafa, and Ghaderi, Davood, "Influence of Directional Random Vibration on the Fatigue Life of Solder Joints in a Power Module," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 9 no. 2, pp. 262-268, Feb. 2019.

Sampath, K., "Desirable Features of a Non-Chromate Conversion Coating Process," Plating & Surface Finishing, vol. 91 no. 3, pp. 38-44, Mar. 2004.

Sampathkumar, Manivannan, Rajesnayagham, Santhakumar, Shaikh, Riyaz, Ramkumar, S. Manian, and Anson, Scott J., "Effect of Deviating from the Reflow Process Window for Lead-Free Assembly," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 712-727.

Sampathkumar, Manivannan, Rajesnayagham, Santhakumar, Shaikh, Riyaz, Ramkumar, S. Manian, and Anson, Scott J., "Effect of Deviating from the Reflow Process Window for Lead-Free Assembly," SMTA Journal, vol. 18 no. 4, pp. 29-37, Oct. 2005.

Sampathkumar, Manivannan, Rajesnayagham, Santhakumar, Ramkumar, S. Manian, and Anson, Scott J., "Investigation of the Performance of SAC and SACBi Lead-Free Solder Alloys with OSP and Immersion Silver PCB Finishes," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 568-575.

Sampathkumar, Manivannan, Rajesnayagham, Santhakumar, Shaikh, Riyaz, Ramkumar, S. Manian, anson, Scott J., and Moreau, Miles, "Quality Issues Related to the Breach of Lead-Free Thermal Process Window," Lead-Free Magazine, vol. 6, May 2006.

Sampei, Hideyuki, "Evaluation Methods of Solder Wettability," Journal of the Surface Finishing Society of Japan, vol. 58 no. 4, pp. 219-222, 2007.

Sampson, Michael J., "Developing a NASA Lead-Free Policy for Electronics Lessons Learned," TRISMAC 08 Joint NASA/ESA/JAXA Conference, Noordwijk, The Netherlands, May 2008, pp. xx-xx.

Sampson, Michael J., "Government-Industry Data Exchange Program GIDEP as a Resource," GSFC Systems Engineering Seminar, July 13, 2004.

Sampson, Michael J., "Lead-Free Electronics: Impact for Space Electronics," NASA, 2010.

Sampson, Michael J., "Lead-free from One NASA Perspective," Lead-free Summit, Philadelphia, PA, July 13, 2005, pp. xx-xx.

Sampson, Michael J., and Leidecker, Henning, "NASA Goddard Space Flight Center Comments Regarding JEDEC Ballot JC-14-04-226," NASA, Aug. 31, 2004.

Sampson, Michael J., "The Development of a NASA Lead-Free Policy for Electronics," 20th JAXA Microelectronics Workshop, Tsukuba, Japan, October 29, 2007, pp. xx-xx.

Sampson, Michael J., "The NASA EEE Parts Assurance Group (NEPAG)," NASA, May 1, 2001.

Sampson, Michael J., "Tin Whiskers," NASA Parts Advisory NA-044, Oct. 23, 1998.

Sampson, Michael J., "Tin Whiskers: Amendment," NASA Parts Advisory NA-044A, Dec. 17, 1998.

San, Wong Boon, and Silk, Julie, "Pad Cratering Susceptibility," South East Asia Technical Training Conference on Electronics Assembly Technologies 2012 Proceedings, Penang, Malaysia, Apr. 18-20, 2012, pp. xx-xx.

San, Wong Boon, and Silk, Julie, "Pad Cratering Susceptibility," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 966-973.

Sanapala, Ravikumar, Sood, Bhanu, Das, Diganta, and Pecht, Michael, "Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. xx-xx.

Sanapala, Ravikumar, Sood, Bhanu, Das, Diganta, Pecht, Michael, Huang, C. Y., and Tsai, M. Y., "Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 195-199.

Sanapala, Ravikumar, Sood, Bhanu, Das, Diganta, and Pecht, Michael, "Effect of Lead-Free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates," IEEE Transactions on Electronics Packaging Manufacturing, vol. 32 no. 4, pp. 272-280, Oct. 2009.

Sancaktar, Erol, and Dilsiz, Nursel, "Anisotropic alignment of nickel particles in a magnetic field for electronically conductive adhesives applications," Journal of Adhesion Science and Technology, vol. 11 no. 2, pp. 155-166, 1997.

Sancaktar, Erol, Rajput, Pankaj, and Khanolkar, Amit, "Correlation of Silver Migration to the Pull out Strength of Silver Wire Embedded In an Adhesive Matrix," 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, Portland, OR, Sept. 12-15, 2004, pp. 171-181.

Sancaktar, Erol, Rajput, Pankaj, and Khanolkar, Amit, "Correlation of Silver Migration to the Pull Out Strength of Silver Wire Embedded in an Adhesive Matrix," IEEE Transactions on Components and Packaging Technologies, vol. 28 no. 4, pp. 771-780, Dec. 2005.

Sancaktar, Erol, and Gomatam, Rajesh, "Correlation of Single Lap Joint Strength and Deformation with Joint Resistance, Surface, and Cure Conditions," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing , Espoo, Finland, June 18-21, 2000, pp. 254-263.

Sancaktar, Erol, and Bai, Lan, "Modeling Filler Volume Fraction and Film Thickness Effects on Conductive Adhesive Resistivity," 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, Portland, OR, Sept. 12-15, 2004, pp. 38-49.

Sancaktar, Erol, and Dilsiz, Nursel, "Pressure Dependent Conduction Behaviour of Various Particles For Conductive Adhesive Applications," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 334-344.

Sancaktar, Erol, and Wei, Yong, "The effect of pressure on the initial establishment of conductive paths in electronically conductive adhesives," Journal of Adhesion Science and Technology, vol. 10 no. 11, pp. 1221-1235, 1996.

Sancaktar, Erol, and Dilsiz, Nursel, "Thickness Dependent Conduction Behavior of Various Particles for Conductive Adhesive Applications," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 90-95.

Sancaktar, Erol, and Liu, Chengjun, "Use of polymeric emeraldine salt for conductive adhesive applications," Journal of Adhesion Science and Technology, vol. 17 no. 9, pp. 1265-1282, Sept. 2003.

Sanchez, Dominic C., and Balela, Mary Donnabelle L., "Investigation of the Electrical, Optical, and Mechanical Properties of Ag Nanowire Conducting Electrode," Key Engineering Materials, vol. 775, pp. 156-162, Aug. 2018.

Sanchez, F., Morenza, J. L., and Trtik, V., "Characterization of the progressive growth of columns by excimer laser irradiation of silicon," Applied Physics Letters, vol. 75 no. 21, pp. 3303-3305, Nov. 22, 1999.

Sanchez, F., Bolarin, A. M., Tello, A., Hernandez, L. E., and Bas, J. A., "Diffusion at Cu/Sn interface during sintering process," Materials Science and Technology, vol. 22 no. 5, pp. 590-596, May 2006.

Sanchez-Barriga, J., Lucas, M., Radu, F., Martin, E., Multigner, M., Marin, P., Hernando, A., and Rivero, G., "Interplay between the magnetic anisotropy contributions of cobalt nanowires," Physical Review B, vol. 80 no. 18. pp. 184424-1-184424-8, Nov. 1, 2009.

Sanchez-Soares, Alfonso, and Greer, James C., "A Semimetal Nanowire Rectifier: Balancing Quantum Confinement and Surface Electronegativity," Nano letters, vol. 16 no. 12, pp. 7639-7644, Dec. 14, 2016. DOI: 10.1021/acs.nanolett.6b03612

Sandera, J., "Thermomechanical Reliability of Lead Free Solder Joint in SMT Assembly," 30th International Spring Seminar on Electronics Technology, Cluj-Napoca, Romania, May 9-13, 2007, pp. 123-127.

Sandera, Josef, "Reliability of Solder Joint and SMT Assembly," 2005 Spanish Conference on Electron Devices, Barcelona, Spain, Feb. 2-4, 2005, pp. 73-76.

Sanders, John R., Chute, Susan, Soma, Jay, and Fouts, Christine, "A Comparison of Cleaning Technologies for New Lead-Free Solder Paste Formulations," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 871-875.

Sanders, Thomas, Thirugnanasambandam, Sivasubramanian, Evans, John, Bozack, Michael, Johnson, Wayne, and Suhling, Jeff, "Component Level Reliability for High Temperature Power Computing with SAC305 and Alternative High Reliability Solders," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 144-250.

Sandmann, Dirk, Jackel, Hans-Georg, and Gutzmer, Jens, "Cues to Greater Recycling Efficiency - Characterization of a Crushed Mobile Phone by Mineral Liberation Analysis (MLA)," Materials Science Forum , vol. 959, pp. 134-141, June 2019.

Sandnes, E., Williams, M. E., Vaudin, M. D., and Stafford, G. R., "Equi-Axed Grain Formation in Electrodeposited Sn-Bi," Journal of Electronic Materials, vol. 37 no. 4, pp. 490-497, Apr. 2008.

Sandy, Brook, Briggs, Edward, and Lasky, Ronald, "Advantages of Bismuth-Based Alloys for Low-Temperature Lead-Free Soldering and Rework," Surface Mount Technology (SMT), vol. 26 no. 6, pp. 26,28,30,32,34,36,38,40, June 2011.

Sandy, Brook, and Lasky, Ronald, "Choosing a Low-Cost Alternative to SAC Alloys for PCB Assembly: Preliminary Work," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 698-702.

Sandy, Brook, and Lasky, Ronald C., "Choosing a Low-Cost Alternative to SAC Alloys for PCB Assembly," Surface Mount Technology (SMT), vol. 28 no. 1, pp. 44-46,48-51, Jan. 2013.

Saneluta, C., and Ratajewicz, Z., "Modeling of the Electrolytic Codeposition of Palladium & Nickel in an Ammonia Bath in a Rotary Device," Plating & Surface Finishing , vol. 84 no. 6, pp. 102-105, June 1997.

Sang, Liu, Yunhua, Tu, Song, Li, and Cui, Zhang, "Physical Understanding About Failure Fracture of Solder Joints After Thermal Cycle," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 532-537.

Sang, Xiahan, Du, Kui, and Ye, Hengqiang, "An ordered structure of Cu3Sn in Cu-Sn alloy investigated by transmission electron microscopy," Journal of Alloys and Compounds, vol. 469 no. 1-2, pp. 129-136, Feb. 5, 2009.

Sangalli, Nicoletta, and Darbha, Krishna, "Lead Free Alloys and Materials Evaluation for Electronic Consumer Applications," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Sangwal, Keshra, and Rodriguez-Clemente, Rafael, "Morphology of Evaporated Surfaces," Solid State Phenomena, vol. 17-18, pp. 213-250, 1991.

Santamaria, Antxon, Munoz, Maria Eugenia, Fernandez, Mercedes, and Landa, Maite, "Electrically Conductive Adhesives with a Focus on Adhesives that Contain Carbon Nanotubes," Journal of Applied Polymer Science, vol. 129 no. 4, pp. 1643-1652, Aug. 15, 2013.

Santos, Daryl, Saiyed, Shafi, Andros, Frank, Chouta, Prashant, and McLenaghan, A. James, "Effects of Reflow Profile on Shear Strength of Sn/4.0Ag/0.5Cu Solder Spheres for Ball Grid Array Applications," Journal of SMT, vol. 15 no. 3, pp. 25-31, July 2002.

Santos, Daryl L., Ramasubramanian, Arun, and Harvilchuck, Laurence A., "On the Use of Three Thermocouples to Verify a PCB Profile During Reflow," Circuits Assembly, vol. 20 no. 6, pp. 33-36, June 2009.

Santra, Sangeeta, Islam, Sarfaraj, Ravi, Raju, Vuorinen, Vesa, Laurila, Tomi, and Paul, Aloke, "Phase Evolution in the AuCu/Sn System by Solid-State Reactive Diffusion," Journal of Electronic Materials, vol. 43 no. 9, pp. 3357-3371, Sept. 2014.

Sanyal, Sriya, Ke, Qingdi, Zhang, Yuan, Ngo, Thao, Carrell, John, Zhang, Hongchao, and Dai, Lenore L., "Understanding and optimizing delamination/recycling of printed circuit boards using a supercritical carbon dioxide process," Journal of Cleaner Production, vol. 41, pp. 174-178, Feb. 2013.

Saphores, Jean-Daniel, and Milovantseva, Natalia, "E-waste and the Digital Transition: Results from a Survey of U.S. Households," JOM, vol. 63 no. 8, pp. 14-17, Aug. 2011.

Saphores, Jean-Daniel M., Nixon, Hilary, Ogunseitan, Oladele A., and Shapiro, Andrew A., "How much e-waste is there in US basements and attics? Results from a national survey," Journal of Environmental Management, vol. 90 no. 11, pp. 3322-3331, Aug. 2009.

Saraf, R. F., Roldan, J. M., Sambucetti, C. J., Gaynes, M. A., and Lewis, R., "High Performance Isotropic Polymer/Metal Composite for Interconnect Applications," Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium, Omiya, Japan, Dec. 4-6, 1995, pp. 425-428.

Saraf, R. F., Roldan, J. M., and Sambucetti, C. J., "Material Development of Polymer/Metal Paste for Flip-Chip Attach Interconnection Technology," IBM, July 22, 1996.

Sard, Richard, "Advances in Functional Zinc and Zinc Alloy Coatings," Plating and Surface Finishing, vol. 74 no. 2, pp. 30-34. Feb. 1987.

Sardan, Ozlem, Yalcinkaya, Arda D., and Alaca, B. Erdem, "Batch Fabrication of Self-assembled Nickel-Iron Nanowires by Electrodeposition," 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Zhuhai, China, Jan. 18-21, 2006, pp. 1101-1104.

Sargent, Anita, Konrad, John, and Collura, Janine, "Corrosion Resistance of ENIG: An Improved Immersion Gold Process," CircuiTree, vol. 16 no. 12, pp. xx, Dec. 2003.

Sarkka, Jussi, Tammenmaa, Markku, Salmela, Olli, and Andersson, Klas, "Reliability Assessment of Some Lead-free Solder Attached Ceramic Components," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Sarma, Kalluri R., and Rice Jr., M. John, "Continuous Growth of Polycrystalline Silicon Films by Chemical Vapor Deposition," Journal of Crystal Growth, vol. 56 no. 2, pp. 313-323, Jan. 2, 1982.

Sarmaitis, R., Dikinis, V., Rezaite, V., and Demcenko, I., "Conversion Coatings for Zinc Substrates from Acidic Solutions of Cr(III) Compounds," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 575-583.

Sarmaitis, R., and Survila, A., "Mass Transfer of Components of Zinc Chromating Solutions - Part 1; Mass Transfer of Species Containing Cr(VI), Cr(III) & Zn(II)," Plating & Surface Finishing, vol. 85 no. 10, pp. 64-68, Oct. 1998.

Sarmaitis, R., Survila, A., Dikinis, V., and Stasiukaltis, "Mass Transfer of Zinc Chromating Solution Components Part 2: Formation of Low-Solubility Substances At the Zn/Chromating Solution Interface," Plating & Surface Finishing, vol. 86 no. 7, pp. 53-57, July 1999.

Sarobol, P., Wang, Y., Chen, W. H., Pedigo, A. E., Koppes, J. P., Blendell, J. E., and Handwerker, C. A., "A Predictive Model for Whisker Formation Based on Local Microstructure and Grain Boundary Properties," JOM, vol. 65 no. 10, pp. 1350-1361, Oct. 2013.

Sarobol, P., Koppes, J. P., Chen, W. H., Su, P., Blendell, J. E., and Handwerker, C. A., "Recrystallization as a nucleation mechanism for whiskers and hillocks on thermally cycled Sn-alloy solder films," Materials Letters, vol. 99, pp. 76-80, May 15, 2013.

Sarobol, P., Blendell, J. E., and Handwerker, C. A., "Whisker and hillock growth via coupled localized Coble creep, grain boundary sliding, and shear induced grain boundary migration," Acta Materialia , vol. 61 no. 6, pp. 1991-2003, Apr. 2013.

Sarobol, Pylin, Pedigo, Aaron, Blendell, John, Handwerker, Carol, Su, Peng, Li, Li, and Xue, Jie, "A Synchrotron Micro-Diffraction Investigation of Crystallographic Texture of High-Sn Alloy Films and its Effects on Whisker Growth," 2010 Proceedings 60th Electronic Components and Technology Conference , Las Vegas, NV, June 1-4, 2010, pp. 162-169.

Sarobol, Pylin, Pedigo, Aaron E., Su, Peng, Blendell, John E., and Handwerker, Carol A., "Defect Morphology and Texture in Sn, Sn-Cu, and Sn-Cu-Pb Electroplated Films," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 3, pp. 159-164, July 2010.

Sarobol, Pylin, Chen, Wei-Hsun, Blendell, John E., Su, Peng, and Handwerker, Carol A., "Effects of Grain Misorientations & Strain Distribution on the Location of Whisker Formation on Electroplated Sn-Cu films," SMTA International 2011 Conference, Fort Worth, TX, Oct. 16-20, 2011.

Sarobol, Pylin, Chen, Wei-Hsun, Pedigo, Aaron E., Su, Peng, Blendell, John E., and Handwerker, Carol A., "Effects of local grain misorientation and b-Sn elastic anisotropy on whisker and hillock formation," Journal of Materials Research, vol. 28 no. 5, pp. 747-756, Mar. 14, 2013.

Sarobol, Pylin, Chen, Wei-Hsun, Pedigo, Aaron E., Su, Peng, Blendell, John E., and Handwerker, Carol A., "Effects of local grain misorientation and b-Sn elastic anisotropy on whisker and hillock formation - CORRIGENDUM," Journal of Materials Research , vol. 28 no. 5, pp. 785, Mar. 14, 2013.

Sarobol, Pylin, "The Effects of Local Film Properties on Whisker and Hillock Growth on Sn, Sn-Cu and Sn-Cu-Pb Electroplated Films," Tin Whisker Group teleconference, June 16, 2010.

Sarobol, Pylin, Chen, Wei-Hsun, Wang, Ying, Koppes, John P., Pedigo, Aaron E., Su, Peng, Blendell, John E., and Handwerker, Carol A., "Tin Whisker Formation: A Predictive Model Based on Local Microstructure and Grain Boundary Properties," Tin Whisker Group Teleconference, Jan. 30, 2013.

Sartel, C., Dheeraj, D. L., Jabeen, F., and Harmand, J. C., "Effect of arsenic species on the kinetics of GaAs nanowires growth by molecular beam epitaxy," Journal of Crystal Growth, vol. 312 no. 14, pp. 2073-2077, July 1, 2010.

Sartwell, Bruce D., Legg, Keith, and Bodger, Bruce, "HVOF Thermal Spray Coatings as an Alternative To Hard Chrome Plating on Military and Commercial Aircraft," Proceedings of the 20th AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 25-29, 1999, pp. 231-237.

Sartwell, Bruce D., Legg, Keith, and Bretz, Philip E., "Status of HCAT/JG-PP Program on Replacement of Hard Chrome Plating With HVOF Thermal Spray Coatings on Landing Gear," 2000 Aerospace/Airline Plating & Metal Finishing Forum, Cincinnati, OH, Mar. 27-29, 2000, pp. 131-139.

Sarvar, Farhad, Hutt, David A., and Whalley, David C., "Application of Adhesives in MEMS and MOEMS Assembly: A Review," 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Zalaegerszeg, Hungary, June 23-26, 2002, pp. 22-28.

Sarveswaran, C., Salleh, Emee Marina, Jalar, A., Samsudin, Z., Ali, M. Yusuf Tura, Ani, F. Che, and Othman, N. K., "Investigation of Corrosion on SAC 305, SAC 0307 and SAC 0307-0.03 P-0.005 Ni Solder Paste Alloys in Simulated Body Fluid (SBF)," AIP Conference Proceedings, vol. 1838, pp. 020003-1-020003-7, 2017. https://doi.org/10.1063/1.4982175

Sarwono, Darwin, and Lin, Kwang-Lung, "Wetting and IMC Growth Behavior Between Cu Substrate and Zn-25Sn-xCu-yTi High-Temperature Solder Alloys," Journal of Electronic Materials, vol. 48 no. 1, pp. 99-106, Jan. 2019.

Sasaki, Katsuhiko, Kobayashi, Takuji, and Ohguchi, Ken-Ichi, "Correlation Between Creep and Uniaxial Ratchetting of Sn/37Pb and Sn/3Ag/0.5Cu solder alloys," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part C , San Francisco, CA, July 17-22, 2005, pp. 1773-1778.

Sasaki, Katsuhiko, Kobayashi, Takuji, and Ohguchi, Ken-ichi, "Experimental Observation of Correlation Between Creep and Uniaxial Ratchetting of Sn/37Pb and Sn/3Ag/0.5Cu Solder Alloys," Journal of Electronic Packaging, vol. 129 no. 1, pp. 82-89, Mar. 2007.

Sasaki, Katsuhiko, Kobayashi, Takuji, and Ohguchi, Ken-ichi, "Microstructural Change of Sn/37Pb and Sn/3Ag/0.5Cu Solder Alloys Subjected to Uniaxial Ratchetting Deformation," Proceedings of the ASME InterPack Conference, Volume 2, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 99-105.

Sasaki, Katsuhiko, and Ohguchi, Ken-ichi, "Uniaxial Ratchetting Behavior of Solder Alloys and Its Simulation by an Elasto-Plastic-Creep Constitutive Model," Journal of Electronic Materials, vol. 40 no. 12, pp. 2403-2414, Dec. 2011.

Sasaki, Katsuhiko, Yanagimoto, Akiyuki, and Ishikawa, Hiromasa, "Viscoplastic Deformation of Lead-Free Solder Alloy - Experiments and Simulations," Key Engineering Materials (Engineering Plasticity from Macroscale to Nanoscale), vol. 233-236 part 2, pp. 779-784, 2003.

Sasaki, Takuo, and Takahasi, Masamitu, "Influence of indium supply on Au-catalyzed InGaAs nanowire growth studied by in situ X-ray diffraction," Journal of Crystal Growth, vol. 468, pp. 135-138, June 15, 2017.

Sasaki, Tsutomu, Tanaka, Masamoto, and Ohno, Yasuhide, "Intermetallic compound formation between lead-free solders (Sn) and Cu or Ni electrodes," Materials Letters, vol. 61 no. 10, pp. 2093-2095, Apr. 2007.

Sasamura, Tetsuya, Someya, Tatsushi, Nakano, Naoki, Furuya, Eriko, Tanabe, Katsuhisa, and Hashimoto, Shigeo, "Deposit Properties of Electroless Au/Pd/Au Process for 5G Application," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 603-608.

Sasangka, W. A., Gan, C. L., Thompson, C. V., Choi, W. K., and Wei, J., "Effect of Bonding and Aging Temperatures on Bond Strengths of Cu with 75Sn25In Solders," 11th Electronics Packaging Technology Conference , Singapore, Dec. 9-11, 2009, pp. 336-341.

Sasangka, W. A., Gan, C. L., and Thompson, C. V., "Mechanical Property Characterization of Cu-Sn-In Intermetallic Thin Films using Microcantilevers," 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Incheon, South Korea, July 4-7, 2011, pp. xx-xx.

Sasangka, Wardhana A., Gan, Chee Lip, Thompson, Carl V., Choi, Won Kyoung, and Wei, Jun, "Influence of Bonding Parameters on the Interaction Between Cu and Noneutectic Sn-In Solder Thin Films," Journal of Electronic Materials, vol. 40 no. 11, pp. 2329-2336, Nov. 2011.

Sastry, V. Srirama, and Shook, Richard L., "Diffusion Modeling for the Analysis of Moisture Induced Damage During Solder Reflow of Plastic Surface Mount ICs," Surface Mount International Proceedings of the Technical Program, San Jose, CA, Aug. 29-31, 1995, pp. 627-631.

Sathe, S., Sammakia, B., Kodnani, R., and Gaynes. M., "A Study Of The Thermal Characteristics Of A Conductive Adhesive Chip Attach Process," 1997 Proceedings 47th Electronic Components & Technology Conference, San Jose, CA, May 18-21, 1997, pp. 1182-1187.

Sato, T., Hiruma, K., Shirai, M., Tominaga, K., Haraguchi, K., Katsuyama, T., and Shimada, T., "Site-controlled growth of nanowhiskers," Applied Physics Letters , vol. 66 no. 2, pp. 159-161, Jan. 9, 1995.

Sato, Takuma, Kariya, Yoshiharu, and Fukui, Kazuma, "Effect of Temperature and Strain rate on Low-Cycle Fatigue Life of Bi-Sn Eutectic Alloy," Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 1, Burlingame, CA, July 16-18, 2013, pp. V001T07A014-1-V001T07A014-7.

Sato, Takuya, Motohisa, Junichi, Noborisaka, Jinichiro, Hara, Shinjiro, and Fukui, Takashi, "Growth of InGaAs nanowires by selective-area metalorganic vapor phase epitaxy," Journal of Crystal Growth, vol. 310 no. 7-9, pp. 2359-2364, Apr. 2008.

Sato, Takuya, Kobayashi, Yasunori, Motohisa, Junichi, Hara, Shinjiro, and Fukui, Takashi, "SA-MOVPE of InGaAs nanowires and their compositions studied by micro-PL measurement," Journal of Crystal Growth, vol. 310 no. 23, pp. 5111-5113, Nov. 15, 2008.

Satoh, Hiroshi, Chiba, Momoko, Takamatsu, Takejiro, and Kuboi, Toru, "Evaluation of Environmental and Biological Impact of Pb-Free Solder," Proceedings of EcoDesign2003: Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 8-11, 2003, pp. 829-830.

Satoh, Toshikazu, Ishizaki, Toshitaka, and Usui, Masanori, "Effect of bismuth-tin alloy particle diameter on bonding strength of copper nanoparticles/bismuth-tin solder hybrid joints," Journal of Materials Science: Materials in Electronics, vol. 29 no. 9, pp. 7161-7176, May 2018.

Satoh, Toshikazu, and Usui, Masanori, "Effect of bismuth-tin composition on bonding strength of zinc particle-mixed copper nanoparticle/bismuth-tin solder hybrid joint," Journal of Materials Science: Materials in Electronics, vol. 31 no. 9, pp. 6547-6559, May 2020.

Satoh, Toshikazu, and Usui, Masanori, "Effect of zinc particle mixing on properties of copper-nanoparticle/ bismuth-tin solder hybrid joints," Journal of Materials Science: Materials in Electronics, vol. 29 no. 23, pp. 20415-20423, Dec. 2018.

Sattiraju, S. V., Dang, B., Johnson, R. W., Li, Y., Smith, J. S., and Bozack, M. J., "Wetting Characteristics of Pb-free Solder Pastes and Pb-free PWB Finishes," 2001 Proceedings 51st Electronic Components & Technology Conference , Orlando, FL, May 29-June 1, 2001, pp. 1338-1344.

Sattiraju, S. V., Dang, Bing, Johnson, R. Wayne, Li, Yali, Smith, Jeffrey S., and Bozack, Michael J., "Wetting Characteristics of Pb-Free Solder Alloys and PWB Finishes," IEEE Transactions on Electronics Packaging Manufacturing, vol. 25 no. 3, pp. 168-184, July 2002.

Sattiraju, S. V., Johnson, R. W., Genc, D. Z, and Bozack, M. J., "Wetting Performance vs. Board Finish and Flux for Several Pb-Free Solder Alloys," Twenty-Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium, Santa Clara, CA, Oct. 2-3, 2000, pp. 253-262.

Sattiraju, S. V., Dang, Bing, Johnson, R. Wayne, Li, Yali, Smith, Jeffrey S., and Bozack, Michael J., "Wetting Characteristics of Pb-Free Solder Alloys and PWB Finishes," IEEE Transactions on Electronics Packaging Manufacturing, vol. 25 no. 3, pp. 168-184, July 2002.

Satyanarayan, , and Prabhu, K. N., "Comparison of spreading behaviour and interfacial microstructure in Sn-0.7Cu, Sn-0.3Ag-0.7Cu and Sn-2.5Ag-0.5Cu lead free solder alloys on Fe-42Ni substrate," Materials Science and Technology, vol. 29 no. 4, pp. 464-473, Apr. 2013. https://doi.org/10.1179/1743284712Y.0000000162

Satyanarayan, , and Prabhu, K. N., "Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn-0.7Cu solder alloy and copper substrate," Journal of Materials Science: Materials in Electronics, vol. 23 no. 9, pp. 1664-1672, Sept. 2012.

Satyanarayan, , and Prabhu, K. N., "Reactive wetting of Sn-2.5Ag-0.5Cu solder on copper and silver coated copper substrates," Journal of Materials Science: Materials in Electronics , vol. 24 no. 5, pp. 1714-1719, May 2013.

Satyanarayan, , and Prabhu, K. N., "Solder joint reliability of Sn-0.7Cu and Sn-0.3Ag-0.7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses," Materials Science and Technology, vol. 29 no. 12, pp. 1430-1440, Dec. 2013.

Satyanarayan, , and Prabhu, K. N., "Spreading Behavior and Evolution of IMCs During Reactive Wetting of SAC Solders on Smooth and Rough Copper Substrates," Journal of Electronic Materials, vol. 42 no. 8, pp. 2696-2707, Aug. 2013.

Saud, N., and Jalar, A., "Sn-rich phase coarsening during isothermal annealing for as-soldered Sn-Ag-Cu solder," Journal of Materials Science: Materials in Electronics, vol. 21 no. 10, pp. 1083-1089, Oct. 2010.

Sauerwald, F., and Teske, W., "Uber die rontgenpgraphische Untersuchung schmelzflussiger Metalle und Legierungen," Zeitschrift fur anorganische und allgemeine Chemie, vol. 210 pp. 247-256, 1933. https://doi.org/10.1002/zaac.19332100304

Sauli, Zaliman, Retnasamy, Vithyacharan, Aziz, Muhamad Hafiz Ab, Say, Ong Tee, Kamarudin, Hussin, Theren, Dasarathan Rajan, and Man, Bahari, "Shear Height Analysis Study on Sn-3.9Ag-0.6Cu by Using SSF Method," 2013 UKSim 15th International Conference on Computer Modelling and Simulation , Cambridge, United Kingdom, Apr. 10-12, 2013, pp. 314-316.

Sauli, Zaliman, Retnasamy, Vithyacharan, Say, Ong Tee, Taniselass, Steven, Ismail, Rizalafande Che, Yeow, Aaron Koay Terr, and Kamarudin, Hussin, "Shearing Speed Stress Comparison between Sn-3.9Ag-0.6Cu and Sn-3.5Ag-0.7Cu Solder Ball," 2013 UKSim 15th International Conference on Computer Modelling and Simulation, Cambridge, United Kingdom, Apr. 10-12, 2013, pp. 321-324.

Saums, Dave, Jarrett, Bob, Mackie, Andy C., and Ross, Jordan, "Thermal Management Materials Choices for Power Semiconductors," Advancing Microelectronics, vol. 36 no. 4, pp. 8-16, July/Aug. 2009.

Sauro, Ron, "Ask the EMPF Helpline!: Pad Cratering," empfasis, pp. 2,8, Nov. 2010.

Sauter, Karl, "Electrochemical Migration Testing Results: Evaluating PWB Design, Manufacturing Process, and Laminate Material Impacts on CAF Resistance," CircuiTree, vol. 15 no. 7, pp. xx-xx, July 2002.

Sauter, Karl, "Thermal Stress Testing & Impact of High Thermal Excursion Pre-Conditioning on Cycles to Fail," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S36-03-1-S36-03-12.

Sauter, L., Seekamp, A., Shibata, Y., Kanameda, Y., and Yamashita, H., "Whisker mitigation measures for Sn-plated Cu for different stress tests," Microelectronics Reliability, vol. 50 no. 9-11, pp. 1631-1635, Sept.-Nov. 2010.

Savage, Timothy Scott, "The Implications of RoHS on Active Implantable Medical Devices," 2011 IEEE International Reliability Physics Symposium, Monterey, CA, Apr. 10-14, 2011, pp. 3B.1.1-3B.1.7.

Savi, Daniel, Kasser, Ueli, and Ott, Thomas, "Depollution benchmarks for capacitors, batteries and printed wiring boards from waste electrical and electronic equipment (WEEE)," Waste Management , vol. 33 no. 12, pp. 2737-2743, Dec. 2013.

Savolainen, P., and Kivilahti, J., "Characterisation of Polyimide-glass-metal Joints Bonded with Anisotropic Electrically Conductive Adhesives," Microelectronics International , vol. 13 no. 2, pp. xx-xx, 1996.

Savolainen, P., and Kivilahti, J., "Electrical Properties of Solder Filled Anisotropically Conductive Adhesives," Journal of Electronics Manufacturing, vol. 5 no. 1, pp. 19-26, Mar. 1995.

Savolainen, P., and Kivilahti, J., "Feasibility of Some Lead-free Solder Alloys as Filler Materials for Z-axis Adhesives," Soldering & Surface Mount Technology, vol. 7 no. 2, pp. 10-12, 1995.

Savolainen, Petri, and Schueller, Randy, "Creep corrosion of electronic assemblies in harsh environments," DfR Solutions.

Savolainen, Petri, "Display Driver Packaging: ACF Reaching the Limits?," 2004 9th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 24-26, 2004, pp. 7-10.

Savolainen, Petri, Saarinen, Ilkka, and Rusanen, Outi, "High-density Interconnections in Mobile Phones Using ACF," 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, Portland, OR, Sept. 12-15, 2004, pp. 99-104.

Savolainen, Petri, and Reinikainen, Tommi, "Measuring the Manufacturability and Reliability of Electronic Assemblies," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Nov.-Dec. 1998.

Savvilotidou, Vasiliki, Hahladakis, John N., and Gidarakos, Evangelos, "Determination of toxic metals in discarded Liquid Crystal Displays (LCDs)," Resources, Conservation and Recycling, vol. 92, pp. 108-115, Nov. 2014.

Sawada, Yuko, Sato, Mitsuru, Abe, Takeshi, Tokunaga, Muneharu, Baba, Shinji, and Hatanaka, Yasumichi, "Low Thermal Stress Flip-Chip Package for Ultra Low-k Die and Lead-Free Bumps," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1775-1780.

Say, Wen C., and Chen, Chien Chon, "Formation of Tin Whiskers and Spheres on Anodic Aluminum Oxide Template," Japanese Journal of Applied Physics, vol. 46 no. 11, pp. 7577-7580, Nov. 6, 2007.

Sayyadi, Reza, and Naffakh-Moosavy, Homam, "Physical and mechanical properties of synthesized low Ag/lead-free Sn-Ag-Cu-xBi (x = 0, 1, 2.5, 5 wt%) solders," Materials Science and Engineering: A, vol. 735, pp. 367-377, Sept. 26, 2018.

Scala, Linda, "Creating Reliable Electronic Assemblies: An EMS Perspective," Overcoming the Reliability Challenge: An IPC Summit, Andover, MA, Apr. 15, 2008, pp. xx-xx.

Scaltro, Francesca, Biglari, Mohammad H., Kodentsov, Alexander, Yakovleva, Olga, and Brom, Erik, "Reliability and Microstructure of Lead-Free Solder Joints in Industrial Electronics after Accelerated Thermal Aging," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Scalzo, Mario, "Addressing head-in-pillow defects in electronics assembly," EMasia , May 2010.

Scalzo, Mario, "Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

Scalzo, Mario, "Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S15_02-1-S15_02-7.

Scalzo, Mario, "Addressing the challenge of Head-in-Pillow Defects in Electronics Assembly," evertiq, June 12, 2009.

Scalzo, Mario, and Hisert, James, "Ultra-Reliable Package Attachment Using Advanced Technology Re-Workable Underfill," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Schachameyer, Steve, Halmstad, Terry, Bauer, Robert, and Newman, John, "The Search for Cadmium Plating Alternatives -- A Cooperative Approach," Proceedings of The International Technical Conference of AESF SUR/FIN , Anaheim, CA, June 21-24, 1993, pp. 317-326.

Schaefer, H., Guenther, B., Battermann, A., Haug, R., and Brielmann, V., "Conductive Adhesives With Improved Thermomechanical Properties," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 278-281.

Schaefer, Helmut, Gesang, Thomas, Hartwig, Andreas, Knaebel, Harald, Maurieschat, Uwe, and Riesenbeck, Thomas, "Polymeric Materials for Adaptronic Fibre Modules," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics , Potsdam, Germany, Oct. 21-24, 2001, pp. 98-103.

Schaefer, R. J., Biancaniello, F. S., and Jiggetts, R. D., "Preparation of Bulk Samples of Copper-Tin Intermetallic Compounds," The Metal Science of Joining, Cincinnati, OH, Oct. 20-24, 1991, pp. 175-181.

Schaefer, Robert J., and Lewis, Daniel J., "Directional solidification in a AgCuSn eutectic alloy," Metallurgical and Materials Transactions A, vol. 36 no. 10, pp. 2775-2783, Oct. 2005.

Schafer, H., and Stock, H.-R., "Improving the corrosion protection of aluminium alloys using reactive magnetron sputtering," Corrosion Science, vol. 47 no. 4, pp. 953-964, Apr. 2005.

Schafer, Huub, Yuan, Peter, and Wang, Z. P., "Investigation of Ultrasonic Flip Chip Bonding On Flex Substrates," Fifth International Conference on Electronic Packaging Technology Proceedings , Shanghai, China, Oct. 28-30, 2003, pp. 161-166.

Schafet, Natalja, Lemm, Christian, Becker, Ulrich, Guttler, Herbert, and Schmid, Philipp, "Development of a submodel technique for the simulation of solder joint fatigue of electronic devices mounted within an assembled ECU," 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, Delft, Netherlands, Apr. 26-29, 2009, pp. xx-xx.

Schafsteller, Britta, Ramos, Gustavo, Rosin, Mario, and Schlosser, Timo, "ENIG - Corrosion: When It Gets Critical and How Is the Status in the PCB Industry?," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 609-615.

Schake, Jeff, and Roggeman, Brian, "Assembly Process Influence on Mechanical Test Performance of 0.4mm Pitch CSP and LGA Components," SMTA International 2011 Conference Proceedings , Fort Worth,TX, Oct. 16-20, 2011, pp. 136-141.

Schake, Jeff, "Foundations for Successful 01005 Resistor Assembly," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 877-884.

Schake, Jeff, "Mass reflow assembly of 01005 resistor components," Dataweek , vol. xx no. xx, pp. xx-xx, July 25, 2007.

Schambeck, Simon, Hutter, Matthias, Jaeschke, Johannes, Deutinger, Andrea, Schneider-Ramelow, Martin, "Sporadic Early Life Solder Ball Detachment Effects on Subsequent Microstructure Evolution and Fatigue of Solder Joints in Wafer-Level Chip-Scale Packages," Journal of Microelectronics and Electronic Packaging, vol. 17 no. 1, pp. 13-22, Jan. 2020.

Schamel, Matthias, Schopf, Carola, Linsler, Dominic, Haag, Sabine T., Hofacker, Lisa, Kappel, Christian, Strunk, Horst P., and Richter, Gunther, "The filamentary growth of metals," International Journal of Materials Research, vol. 102 no. 7, pp. 828-836, July 2011.

Schamp. C. T., and Jesser, W. A., "Two-Phase Equilibrium in Individual Nanoparticles of Bi-Sn," Metallurgical and Materials Transactions A, vol. 37A no. 6, pp. 1825-1829, June 2006.

Schardt, David, "Get the Lead Out," Nutrition Action Health Letter, vol. 32 no. 2, pp. 1-6, Mar. 2005.

Schario, D. A., Pavlik, M. A., Klingenberg, M. L., and Brooman, E. W., "Corrosion Performance of Environmentally Acceptable Alternatives to Chromium Coatings," 21st AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 17-19, 2000, pp. 163-176.

Schario, Mark, "Decorative trivalent chromium plating," Finishing Today, vol. 84 no. 4, pp. 45-xx, Apr. 2008.

Schario, Mark, "Decorative Trivalent Chromium Plating," Metal Finishing, vol. 106 no. 6, pp. 66-68, June 2008.

Schario, Mark, "How To Choose Between Sulfate and Chloride-Based Trivalent Chromium," Products Finishing, vol. 84 no. 12, pp. 52-53, Sept. 2020.

Schario, Mark, "Summary on USCAR Field Test for Trivalent Chromium," Products Finishing , vol 84 no. 6, pp. 32-33, Mar. 2020.

Schario, Matt, "Preventing Dark Streaks in Trivalent Chromium," Products Finishing , vol 83 no. 10, pp. 36-37, July 2019.

Scheerer, M., Fink, M., Jogl, Ch., Eidenberger, Ph., Schuster, M., and Marischler, M., "Electrical resistance, microstructure and mechanical performance of solder alloys," 7th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Portsmouth, United Kingdom, Apr. 13-14, 2016, pp. xx-xx.

Scheiber, Steve, "Meeting the lead-free inspection challenge," Test & Measurement World, vol. 25 no. 7, pp. M9-M11, Aug. 2005.

Scheiber, Steve, "RoHS standards present moving target," Test & Measurement World , vol. xx no. x, pp. xx-xx, Dec. 2008.

Schell, Jerry D., and Rechtsteiner, Mark, "Replacement of Chromium Electroplating Using Advanced Material Technologies On Gas Turbine Engine Components," Plating & Surface Finishing , vol. 87 no. 7, pp. 17-23, July 2000.

Schempp, Fabian, Dressler, Marc, Kraetschmer, Daniel, Loerke, Friederike, and Wilde, Juergen, "Experimental Investigation of the Correlation between a Load-Based Metric and Solder Joint Reliability of BGA Assemblies on System Level," 2019 IEEE 69th Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2019, pp. 1113-1120.

Scherff, Maximilian L. D., Schwertheim, Stefan, Ma, Yue,, Mueller, Thomas, and Fahrner, Wolfgang R., "10 x 10 cm2 HIT Solar Cells Contacted with Lead-Free Electrical Conductive Adhesives to Solar Cell Interconnectors," Conference Record of the 2006 IEEE 4th World Conference on Photovoltaic Energy Conversion, Volume 2, Waikoloa, HI, May 7-12, 2006, pp. 1384-1387.

Scherge, M., "Electromigration- Simulation and Experiment," AIP Conference Proceedings, vol. 305, pp. 290-299, 1994.

Schertel, Arnulf, "Einige Beobachtungen uber die graue Modification des Zinns," Journal fur Praktische Chemie, vol. 19 no. x, pp. 322-326, 1879. https://doi.org/10.1002/prac.18790190130

Schetty, R., "An Environmentally Friendly Method for Plating Semiconductor Components: Palladium Lead Frame Plating," Proceedings AESF SUR/FIN '96, Cleveland, OH, June 10-13, 1996, pp. 449-457.

Schetty, R., "Suppression of Tin Whisker Growth through Optimized Tin Plating Chemistry Formulation Technistan EP," Technic Inc, 2004.

Schetty, Rob, "Effects of Electrodeposited Matte Tin Crystal Orientation and Grain Structure on Tin Whisker Growth Propensity Using Stress-Inducing Test Methods," 2014 IEEE 60th Holm Conference on Electrical Contacts, New Orleans, LA, Oct. 12-15, 2014, pp. xx-xx.

Schetty, Rob, "Electrodeposited Tin Properties & Their Effect on Component Finish Reliability," 2004 International Conference on Business of Electronic Product Reliability and Liability, Apr. 27-30, 2004, pp. 29-34.

Schetty, Rob, and Sepp, Bill, "Implementation of Lead-Free Component Finishes in Mass Production," Metal Finishing, vol. 104 no. 10, pp. 50-56, Oct. 2006.

Schetty, Rob, "Minimization of tin whisker formation for lead-free electronics finishing," Circuit World, vol. 27 no. 2, pp. 17-20, 2001.

Schetty, Rob, and Sepp, William, "Minimization of Tin Whisker Growth for Ultra-Low Tin Whisker Applications," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 225-234.

Schetty, Rob, "Minimization of Tin Whisker Growth in Pb-Free Component Production Applications," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Schetty, Rob, "Next-Gen Corrosion-Resistant Finishes for Electronics," Products Finishing, vol. 83 no. 12, pp. 28-31, Sept. 2019.

Schetty, Rob, "Pb-free Component Finishes," Proceedings of the AESF SUR/FIN 2000 , Chicago, IL, June 26-29, 2000, pp. xx-xx.

Schetty, Rob, "Pb-Free External Lead Finishes for Electronic Components: Tin-Bismuth and Tin-Silver," 1998 IEMT/IMC Proceedings, Tokyo, Japan, Apr. 15-17, 1998, pp. 380-385.

Schetty, Rob, "Tin Whisker Studies - Experimentation & Mechanistic Understanding," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 124-134.

Schetty, Rob, "Tin Whisker Studies- Experimentation & Mechanistic Understanding," Plating & Surface Finishing, vol. 90 no. 3, pp. 48-51, Mar. 2003.

Scheuermann, Uwe, and Schmidt, Ralf, "Impact of Solder Fatigue on Module Lifetime in Power Cycling Tests," Proceedings of the 2011-14th European Conference on Power Electronics and Applications, Birmingham, United Kingdom, Aug. 30-Sept. 1, 2011, pp. xx-xx.

Schewe, Phillip F., "Physics Update: Soft-metal whiskers," Physics Today, vol. 58 no. 2, pp. 9, Feb. 2005. https://doi-org.ezproxy.uky.edu/10.1063/1.4796866

Schildhouse, Jill, "EU Leading the Lead-Free Way," Inside Supply Management, vol. xx no. xx, pp. xx-xx, Feb. 2005.

Schimmel, Gunther, Kempf, Bernd, and Rettenmayr, Markus, "Exudation of Ag and Cu in internally oxidized Ag-Sn-In-(Cu) alloys," Materials Letters, vol. 63 no. 17, pp. 1521-1524, July 15, 2009.

Schindler, Sebastian, Mueller, Maik, and Wiese, Steffen, "Investigation of the undercooling of SnCu solder spheres," 2014 Electronics System-Integration Technology Conference, Helsinki, Finland, Sept. 16-18, 2014, pp. xx-xx.

Schindler, Sebastian, and Wiese, Steffen, "Investigation of wettability and interface reactions of Sn-Pb, Sn-Cu, Sn-Ag and Sn-Ag-Cu solders for solar cell interconnections," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Schindler, Sebastian, and Wiese, Steffen, "Solidification Processes of SnCu, SnAg and SnAgCu solder alloys and interface reactions to charactize solar cell interconnections processes," 2011 18th European Microelectronics and Packaging Conference, Brighton, United Kingdom, Sept. 12-15, 2011, pp. xx-xx.

Schischke, Karsten, Mueller, Jutta, and Reichl, Herbert, "EcoDesign in European Small and Medium Sized Enterprises of the Electrical and Electronics Sector: Status Quo and the Road towards EuP," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 233-238.

Schischke, Karsten, Nissen, Nils F., Stobbe, Lutz, and Reichl, Herbert, "Energy Efficiency Meets Ecodesign - Technology Impacts of the European EuP Directive," 2008 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 19-21, 2008, pp. xx-xx.

Schischke, Karsten, Griese, Hansjoerg, Mueller, Jutta, and Stobbe, Irina, "State of the Art in Material Declarations: Compliance Management and Usability for Eco-Design," Proceedings of 2005 International Conference on Asian Green Electronics, Shang Hai, China, Mar. 15-18, 2005, pp. 25-30.

Schischke, Karsten, "The Lead-Free Challenge: Materials for Assembly and Packaging," Semiconductor International, vol. xx no. xx, pp. xx-xx, Aug. 2004.

Schlessmann, Heike, and Walter, Markus, "Lead-free wave soldering: Is process changeover really simple?," EMasia, Sept. 2004.

Schlessmann, Heike, and Horn, Ronny, "Soldering in Nitrogen Atmosphere - Do Quality Aspects Justify the Costs?," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 566-570.

Schlickum, U., Wulfhekel, W., and Kirschner, J., "Spin-polarized scanning tunneling microscope for imaging the in-plane magnetization," Applied Physics Letters, vol. 83 no. 10, pp. 2016-2018, Sept. 8, 2003.

Schlieper, Andreas, Romermann, Frank, and Blachnik, Roger, "Thermodynamic Investigations in the System Bi-Sn-Te," Zeitschrift fur Metallkunde, vol. 90 no. 4, pp. 250-260, Apr. 1999.

Schlieper, Andreas, and Blachnik, Roger, "Thermodynamic Investigations of the System Ge-Sn-Te," Zeitschrift fur Metallkunde, vol. 89 no. 1, pp. 3-15, Jan. 1996.

Schlobohm, J., Weide-Zaage, K., Rongen, R., Voogt, F., and Roucou, R., "Simulation and Measurement of the Solder Bumps with a plastic Core," 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Wroclaw, Poland, Apr. 14-17, 2013, pp. xx-xx.

Schlummer, Martin, Gruber, Ludwig, Maurer, Andreas, Wolz, Gerd, and van Eldik, Rudi, "Characterisation of polymer fractions from waste electrical and electronic equipment (WEEE) and implications for waste management," Chemosphere , vol. 67 no. 9, pp. 1866-1876, Apr. 2007.

Schlummer, Martin, Maurer, Andreas, Leitner, Thomas, and Spruzina, Walter, "Recycling of flame-retarded plastics from waste electric and electronic equipment (WEEE)," Waste Management and Research, vol. 24 no. 6, pp. 573-583, Dec. 2006.

Schlummer, Martin, and Maurer, Andreas, "Recycling of Styrene Polymers from Shredded Screen Housings Containing Brominated Flame Retardants," Journal of Applied Polymer Science, vol. 102 no. 2, pp. 1262-1273, Oct. 15, 2006.

Schlund, Barry, "The Physics and Chemistry of Solder and Solder Joint Reliability," Design & Reliability of Solders and Solder Interconnections, Orlando, FL, Feb. 10-13, 1997, pp. 203-211.

Schmetterer, C., Flandorfer, H., Luef, Ch., Kodentsov, A., and Ipser, H., "Cu-Ni-Sn: A Key System for Lead-Free Soldering," Journal of Electronic Materials, vol. 38 no. 1, pp. 10-24, Jan. 2009.

Schmetterer, C., Vizdal, J., Kroupa, A., Kodentsov, A., and Ipser, H., "The Ni-rich Part of the Ni-P-Sn System: Isothermal Sections," Journal of Electronic Materials, vol. 38 no. 11, pp. 2275-2300, Nov. 2009.

Schmetterer, Clemens, Flandorfer, Hans, Richter, Klaus W., Saeed, Usman, Kauffman, Matthieu, Roussel, Pascal, and Ipser, Herbert, "A new investigation of the system Ni-Sn," Intermetallics, vol. 15 no. 7, pp. 869-884, July 2007.

Schmetterer, Clemens, Flandorfer, Hans, and Ipser, Herbert, "Comment on the paper "Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition" by X. F. Zhang, J. D. Guo, J. K. Shang, J. Alloys Compd. 479(2009) 505-510," Journal of Alloys and Compounds , vol. 486 no. 1-2, pp. L8-L9, Nov. 3, 2009.

Schmetterer, Clemens, and Ipser, Herbert, "Ni-Rich Part of the System Ni-P-Sn: Thermal Behavior," Metallurgical and Materials Transactions A, vol. 41 no. 1, pp. 43-56, Jan. 2010.

Schmetterer, Clemens, Flandorfer, Hans, Richter, Klaus W., and Ipser, Herbert, "Phase Equilibria in the Ag-Ni-Sn System: Isothermal Sections," Journal of Electronic Materials, vol. 36 no. 11, pp. 1415-1428, Nov. 2007.

Schmetterer, Clemens, Flandorfer, Hans, and Ipser, Herbert, "Phase equilibria in the system Ag-Ni-Sn: Thermal behavior," Acta Materialia, vol. 56 no. 2, pp. 155-164, Jan. 2008.

Schmetterer, Clemens, Rajamohan, Divakar, Ipser, Herbert, and Flandorfer, Hans, "The high-temperature phase equilibria of the Ni-Sn-Zn system: Isothermal sections," Intermetallics, vol. xx no. x, pp. xx-xx, xxxx.

Schmid, H., Borg, B. M., Moselund, K., Das Kanungo, P., Signorello, G., Karg, S., Mensch, P., Schmidt, V., and Riel, H., "III-V Semiconductor Nanowires for Future Devices," 2014 Design, Automation and Test in Europe Conference and Exhibition, Dresden, Germany, Mar. 24-28, 2014, pp. xx-xx.

Schmidt, Charles W., "e-Junk Explosion," Environmental Health Perspectives, vol. 110 no. 4, pp. A188-A194, Apr. 2002.

Schmidt, Hartmuth, "Europe Enters 'Age of Lead-free Electronics'," Lead-free Electronics, Nov. 2004.

Schmidt, Kymberly, "Choose capacitor types to optimize PC sound quality," EDN, vol. 52 no. 8, pp. 77-78, 80, 82, 84, Apr. 12, 2007.

Schmidt, R., Alpern, P., Plecher, K., and Tilgner, R., "Investigation of the Adhesion Strength between Molding Compound and Leadframe at Higher Temperatures," Proceedings of 2nd Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 1998, pp. 349-353.

Schmidt, Ralf, Kaesbauer, Michael, Sippel, Marcel, and Dreher, Patrick, "Power Cycle Testing at Low Temperature Swings - Evaluating the Stability of SAC- and SnSb-based Chip Solder Layers," 11th International Conference on Integrated Power Electronics Systems, Berlin, Germany, Mar. 24-26, 2020, pp. 196-201.

Schmidtbauer, Jan, Bansen, Roman, Heimburger, Robert, Teubner, Thomas, and Boeck, Torsten, "MBE growth of germanium nanowires along <1 1 0>," Journal of Crystal Growth, vol. 406, pp. 36-40, Nov. 15, 2014.

Schmitt, Wolfgang, "Novel Silver Contact Paste Lead Free Solution for Die Attach," 2010 6th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany, Mar. 16-18, 2010, pp. xx-xx.

Schmitz, D., Shirazi, S., Wentlent, L., Hamasha, S., Yin, L., Qasaimeh, A., and Borgesen, P., "Towards a Quantitative Mechanistic Understanding of the Thermal Cycling of SnAgCu Solder Joints," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 371-378.

Schmitz, G. J., Zhou, B., Bottger, B., Klima, S., and Villain, J., "Phase-Field Modeling and Experimental Observation of Microstructures in Solidifying Sn-Ag-Cu Solders," Journal of Electronic Materials, vol. 42 no. 8, pp. 2658-2666, Aug. 2013.

Schnabl, K., Wentlent, L., Mootoo, K., Perfecto, E., Lu, M., and Borgesen, P., "Effects of Materials, Design and Process on Intermetallic Formation and Evolution in Solder Microbumps," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 616-622.

Schnabl, K., Wentlent, L., Mootoo, K., Khasawneh, S., Zinn, A. A., Beddow, J., Hauptfleisch, E., Blass, D., and Borgesen, P., "Nanocopper Based Solder-Free Electronic Assembly," Journal of Electronic Materials, vol. 43 no. 12, pp. 4515-4521, Dec. 2014.

Schneck, Nathan, Johnson, Zane, Schaff, Chris, Bell, Meredith, and Stone, James, "Drop Testing and Finite Element Simulation of Stacked Chip Scale Packages with and without Underfill," 11th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 28-31, 2008, pp. 853-861.

Schnederle, Petr, Adamek, Martin, and Szendiuch, Ivan, "Effect of Nitrogen Atmosphere on the Soldering Process for Different Types of Lead-Free Solders," 2012 35th International Spring Seminar on Electronics Technology, Bad Aussee, Austria, May 9-13, 2012, pp. 201-206.

Schneegans, Manfred, and Zorn, Gerhard M., "Degradation of Passivated Aluminum Metallization by Mechanical and Electrical Stress," AIP Conference Proceedings, vol. 305, pp. 111-125, 1994.

Schneider, Al, Arora, Sanju, and Mo, Bin, "Temperature Selection for Wave Soldering with Lead-Free Alloys," Circuits Assembly, vol. xx no. xx, pp. 46, 48, 51, May 2001.

Schneider, Andreas, "WEEE Marking," Electronics Goes Green, Berlin, Germany, Sept. 8, 2004.

Schneider, Peter, "Get the Lead Out! ," Dec. 21, 2005.

Schneider, Steve, "Zinc Plating," Plating & Surface Finishing, vol. 85 no. 11, pp. 70-71, Nov. 1998.

Schneider, Steve, "Zinc Plating," Plating & Surface Finishing, vol. 94 no. 11, pp. 40-41, Nov. 2006.

Schneiderman, Ron, "Electronic Waste: Be Part Of The Solution," Electronic Design, vol. 52 no. 8, pp. 47-54, Apr. 12, 2004.

Schneiderman, Ron, "It Isn't Easy Being Green," Electronic Design, vol. 55 no. 15, pp. 28-30, 32, July 5, 2007.

Schneiderman, Ron, "It's Time To Take Out The Trash," Electronic Design, vol. 53 no. 23, pp. 77-78, 80, Oct. 20, 2005.

Schneiderman, Ron, "Lead-Free Means You're Still In The Game," Electronic Design , vol. 54 no. 15, pp. 42-44, 46, 48, July 6, 2006.

Schneiderman, Ron, "Managing Product Obsolescence - Now You See It, Now You Don't," Electronic Design, vol. 52 no. 12, pp. 47-52, June 7, 2004.

Schneiderman, Ron, "Regulatory Compliance Means Going The Extra Green Mile," Electronic Design, vol. 57 no. 2, pp. 26-28,30, Jan. 29, 2009.

Schneiderman, Ron, "RoHS Is In Effect, But What About China?," Electronic Design , vol. 54 no. 19, pp. 23, Sept. 1, 2006.

Schneiderman, Ron, "RoHS: What You Need To Know," Electronic Design, vol. 53 no. 9, pp. 92, Apr. 28, 2005.

Schneiderman, Ron, "The EU's Effect On Green Design," ED Online, ID # 15939, July 5, 2007.

Schneiderman, Ron, "Time Is Ticking... Lead-Free In A Year Or Else," Electronic Design , vol. 53 no. 15, pp. 35-36, 38, 40, July 7, 2005.

Schneiderman, Ron, "Wal-Mart Takes Role in RoHS Compliance," Electronic Design, vol. xx no. xx, pp. xx-xx, Mar. 6, 2006.

Schneiderman, Ron, "Your Next Environmental Challenge? Eco-Design," Electronic Design , Feb. 28, 2006.

Schnoor, Jerald L., "Extended Producer Responsibility for E-Waste," Environmental Science & Technology, vol. 46 no. 15, pp. 7927, Aug. 7, 2012.

Schoeller, Harry, Bansai, Shubhra, Knobloch, Aaron, Shaddock, David, and Cho, Junghyun, "Effects of Microstructure Evolution on High-Temperature Mechanical Deformation of 95Sn-5Sb," 2008 ASME International Mechanical Engineering Congress and Exposition, Volume 6, Boston, MA, Oct. 31-Nov. 6, 2008, pp. 25-32.

Schoeller, Harry, and Meilunas, Michael, "Fine Pitch Re-ball and Reliability," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 551-558.

Schoeller, Harry, "Isothermal Fatigue of High Temperature Solder Joints," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 375-383.

Schoeller, Harry, and Parks, Gregory, "Isothermal Fatigue of High Temperature Solder Joints," SMTA Journal , vol. 30 no. 2, pp. 28-35, 2017.

Schoeller, Harry, Bansal, Shubhra, Knobloch, Aaron, Shaddock, David, and Cho, Junghyun, "Microstructure Evolution and the Constitutive Relations of High-Temperature Solders," Journal of Electronic Materials, vol. 38 no. 6, pp. 802-809, June 2009.

Schoeller, Harry, Kim, Jongman, Park, Seungbae, and Cho, Junghyun, "Thermodynamics and Kinetics of Oxidation of Pure Indium Solders," Advanced Electronic Packaging (Materials Research Society Symposium Proceedings Volume 968), Boston, MA, Nov. 27-30, 2006, pp. xx-xx.

Schoenung, Julie M., Ogunseitan, Oladele A., Saphores, Jean-Daniel M., and Shapiro, Andrew A., "Adopting Lead-Free Electronics: Policy Differences and Knowledge Gaps," Journal of Industrial Ecology, vol. 8 no. 4, pp. 59-85, Fall 2004.

Schoenung, Julie M., Ogunseitan, Oladele A., Saphores, Jean-Daniel M., and Shapiro, Andrew A., "Industrial Ecology of Lead (Pb) in Electronics: Perspectives on Legislation, Materials Engineering and Environmental Management," Journal of Industrial Ecology, vol. xx no. xx, pp. xx-xx.

Schoenung, Julie, Ogunseitan, Dele, Saphores, Jean-Daniel, and Shapiro, Andrew, "Lead in Electronics: An Industrial Ecology Case Study," ISIE, 2003.

Scholz, Sven, Schott, Rudiger, Labud, Patrick A., Somsen, Christoph, Reuter, Dirk, Ludwig, Arne, and Wieck, Andreas D., "Focused ion beam supported growth of monocrystalline wurtzite InAs nanowires grown by molecular beam epitaxy," Journal of Crystal Growth, vol. 470, pp. 46-50, July 15, 2017.

Schon, Aline Ferreira, Reyes, Rodrigo Valenzuela, Spinelli, Jose Eduardo, Garcia, Amauri, and Silva, Bismarck Luiz, "Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate," Journal of Alloys and Compounds, vol. 809, pp. 151780-1-151780-9, Nov. 15, 2019.

Schonholz, Roland, "CAF Conductive Anodic Filament," 6th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Oberpfaffenhofen, Germany, Apr. 15-16, 2015, pp. xx-xx.

Schopf, Carola, Schamel, Matthias, Strunk, Horst P., and Richter, Gunther, "Cyclic Cantilever Bending of Copper Nanowhiskers," Advanced Engineering Materials, vol. 14 no. 11, pp. 975-980, Nov. 2012.

Schoppe, Stephen, "Lead-Free Impact on Area Array Device Rework," Lead-Free Connection, vol. 2 no. 4, pp. 10-11, Dec. 2005.

Schoppe, Stephen, "The Optimized Reflow Profile for Rework of High I/O Lead Free Area Array Packages," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 268-273.

Schouten, Gert, and Diepstraten, Gerjan, "Allowable Concentration of Contaminating Elements in Solder," Circuits Assembly, vol. 18 no. 5, pp. 38, May 2007.

Schouten, Gert, "Blowholes in Pb-Free Wave Soldering," Circuits Assembly, vol. 18 no. 2, pp. 92, Feb. 2007.

Schouten, Gert, "Poor Hole-Filling with Pb-Free Wave Soldering?," Circuits Assembly , vol. 17 no. 7, pp. 54, July 2006.

Schouten, Gert, "Solderable Coatings and Pb-Free Alloy Combinations," Circuits Assembly, vol. 17 no. 12, pp. 42, Dec. 2006.

Schouten, Gert, "The Impact of Solderability on Pb-free Soldering," Circuits Assembly, vol. 17 no. 8, pp. 56, Aug. 2006.

Schram, T., Goeminne, G., Terryn, H., Vanhoolst, W., and Van Espen, P., "Study of the Composition of Zirconium based Chromium free Conversion Layers on Aluminium," Transactions of the Institute of Metal Finishing, vol. 73 no. 3, pp. 91-95, Aug. 1995.

Schramm, Thomas, "The Green Computer Myth: How Green are Green Computers?," PRWeb , Nov. 7, 2006.

Schreck, Timo, Schnorpfeil, Anna, and Kaloudis, Michael, "Analysing the growth of intermetallic compounds in lead-free solder joints by differential scanning calorimetry measurements," Journal of Materials Science, vol. 48 no. 6, pp. 2479-2484, Mar. 2013.

Schrantz, Joe, "Trivalent chrome plating: It's in production!," Industrial Finishing , vol. 53 no. 5, pp. 16-22, May 1977.

Schreiber, Steve, "Editor's Note: Get the lead out," Test & Measurement World , vol. 24 no. 7, pp. 44, Aug. 2004.

Schroeder, Sabine, "Superior, whisker-reduced immersion tin technology," Circuit World , vol. 31 no. 4, pp. 42-46, 2005.

Schroder, Sabine, "The new immersion tin generation in practical operation -- a surface finish process including the world's first organinc metal," Circuit World , vol. 29 no. 1, pp. 10-13, 2002.

Schroeder, V., and Hua, F., "A Reliability Investigation of Bi-42Sn-1Ag Solder Paste: An Alternative to Sn-3.5Ag-0.7Cu for Low Cost Consumer Products," 2001 Advanced Packaging Technology Conference Proceedings, 2001, pp. xx-xx.

Schroeder, V., Hua, F., and Gleason, J., "Strength and Fatigue Behavior of Joints Made with Bi-42Sn-1Ag Solder Paste: An Alternative to Sn-3.5Ag-0.7Cu for Low Cost Consumer Products," 2001 SMTA International Conference Proceedings, Chicago, IL, Sept. 30-Oct. 4, 2001, pp. xx-xx.

Schroeder, Valeska, "Effects of room temperature aging on assembled and non-assembled platings," IPC, Nov. 2002, pp. xx-xx.

Schroeder, Valeska, "HP experience with tin whisker inspection training," Hewlett-Packard, 2004.

Schroeder, Valeska, Bush, Peter, Williams, Maureen, Vo, Nhat (Nick), and Reynolds, Heidi L., "Tin Whisker Test Method Development," IEEE Transactions on Electronics Packaging Manufacturing, vol. 29 no. 4, pp. 231-238, Oct. 2006.

Schroter, Anke, "Annex 5 of RoHS2 amended," evertiq, June 22, 2009.

Schroter, Anke, "Care-free storage of OSP coated PCBs," evertiq, Jan. 12, 2010.

Schroter, Anke, "Greenpeace's BFR campaign puts consumers at risk," evertiq, May 22, 2008.

Schroter, Anke, "Significant reduction in brominated flame retardant," evertiq , Jan. 28, 2010.

Schubert, A., Dudek, R., Auerswald, E., Gollhardt, A., Michel, B., and Reichl, H., "Fatigue Life Models for SnAgCu and SnPb Solder Joints Evaluated by Experiments and Simulation," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 603-610.

Schubert, A., Dudek, R., Walter, H., Jung, E., Gollhardt, A., Michel, B., and Reichl, H., "Reliability Assessment of Flip-Chip Assemblies with Lead-free Solder Joints," 2002 Proceedings 52nd Electronic Components & Technology Conference , San Diego, CA, May 28-31, 2002, pp. 1246-1255.

Schubert, A., Dudek, R., Doering, R., and Michel, B., "Reliability Investigations of Flip Chip Interconnects in FCOB and FCOG Applications by FEA," Proceedings of 2nd Electronic Packaging Technology Conference, Singapore, Dec. 8-10, 1998, pp. 49-56.

Schubert, A., Walter, H., Dudek, R., Michel, B., Lefranc, G., Otto, J., and Mitic, G., "Thermo-Mechanical Properties and Creep Deformation of Lead-Containing and Lead-Free solders," Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, Mar. 11-14, 2001, pp. 129-134.

Schubert, A., Dudek, R., Doring, R., Walter, H., Auerswald, E., Gollhardt, A., and Michel, B., "Thermo-mechanical Reliability of Lead-free Solder Interconnects," Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, Braselton, GA, Mar. 11-14, 2001, pp. 90-96.

Schubert, A., Dudek, R., Doring, R., Walter, H., Auerswald, E., Gollhardt, A., and Michel, B., "Thermo-mechanical Reliability of Lead-free Solder Interconnects," 2002 8th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 3-6, 2002, pp. 90-96.

Schubert, L., Werner, P., Zakharov, N. D., Gerth, G., Kolb, F. M., Long, L., Gosele, U., and Tan, T. Y., "Silicon nanowhiskers grown on <111>Si substrates by molecular-beam epitaxy," Applied Physics Letters, vol. 84 no. 24, pp. 4968-4970, June 14, 2004.

Schueller, R., Ables, W., and Fitch, J., "A Case Study for Transitioning Class A Server Motherboards to Lead-Free," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 162-171.

Schueller, R., Ables, W., and Fitch, J., "A Case Study for Transitioning Class A Server Motherboards to Lead-Free," SMTAnews & Journal of Surface Mount Technology, vol. 22 no. 1, pp. 11-20, Jan.-Mar. 2009.

Schueller, Randy, "2nd Generation LF Alloys Is SAC the best we can do?," Medical Electronics Symposium 2009 Proceedings, Tempe, AZ, Sept. 16-17, 2009, pp. xx-xx.

Schueller, Randy, "Considerations for Selecting a Printed Circuit Board Surface Finish," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 957-964.

Schueller, Randy, "Creep Corrosion on Lead-Free Printed Circuit Boards in High Sulfur Environments," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 643-654.

Schueller, Randy, "Creep Corrosion on Lead-Free Printed Circuit Boards in High Sulfur Environments," SMTAnews & Journal of Surface Mount Technology , vol. 21 no. 1, pp. 21-29, Jan.-Mar. 2008.

Schueller, Randy, and Tulkoff, Cheryl, "Design for Reliability with Computer Modeling," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 326-336.

Schueller, Randy, and Tulkoff, Cheryl, "Design for Reliability with Computer Modeling," Printed Circuit Design and Fab/ Circuits Assembly, vol. 31 no. 3, pp. 26,28,30,32-34,36,38,40,42, Mar. 2014.

Schueller, Randy, and Tulkoff, Cheryl, "Get the Lead Out," Medical Electronics Design, vol. 2 no. 4, pp. 24-27, Nov./Dec. 2011.

Schueller, Randy, Blattau, Nathan, Arnold, Joelle, and Hillman, Craig, "Second Generation Pb-Free Alloys," SMTA International Conference , San Diego, CA, Oct. 4-8, 2009, pp. 458-467.

Schueller, Randy, Blattau, Nathan, Arnold, Joelle, and Hillman, Craig, "Second Generation Pb-Free Alloys," SMTAnews & Journal of Surface Mount Technology, vol. 23 no. 1, pp. 18-26, Jan.-Mar. 2010.

Schuepstuhl, Karl, "The Invisible Enemy," Surface Mount Technology (SMT), vol. 18 no. 11, pp. 53, Nov. 2004.

Schuette, Waynie M., and Buhro, William E., "Polyol Synthesis of Silver Nanowires by Heterogeneous Nucleation; Mechanistic Aspects Influencing Nanowire Diameter and Length," Chemistry of Materials, vol. 26 no. 22, pp. 6410-6417, Oct. 26, 2014.

Schuh, Christopher A., "Replacing Chrome Coatings with Safer Metal Alloys," Advanced Manufacturing Technology (AMT), vol. 30 no. 6, pp. 1-2, June 15, 2009.

Schuler, C. Chr., Stuck, A., Beck, N., Keser, H., and Tack, U., "Direct silver bonding - an alternative for substrates in power semiconductor packaging," Journal of Materials Science: Materials in Electronics , vol. 11 no. 5, pp. 389-396, July 2000.

Schulte, Gary, "Conversion of Ongoing Products to RoHS Compliance," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 177-182.

Schulte, Gary, "Conversion of Ongoing Products to RoHS Compliance," Circuits Assembly, vol. 17 no. 4, pp. 32, Apr. 2006.

Schultmann, Frank, Zumkeller, Moritz, and Rentz, Otto, "Modeling reverse logistic tasks within closed-loop supply chains: An example from the automotive industry," European Journal of Operational Research , vol. 171 no. 3, pp. 1033-1050, June 16, 2006.

Schulz, Gerd, "RoHS Compatible Products," Proceedings of the 25th Symposium for Passive Components, Palm Springs, CA, Mar. 21-24, 2005, pp. 119-125.

Schultz, Steven, "Are You RoHS Compliant?," Technology Review, vol. 13 no. 1, pp. 1-2, Jan. 2007.

Schultz, Steve, "How REACH Impacts Electronics Components Use," Circuits Assembly , vol. 20 no. 3, pp. 31-32, Mar. 2009.

Schultz, Steven, "RoHS implementation: a summary," Electronic Products, vol. 49 no. 5, pp. 91, Oct. 2006.

Schulz, Stephan, Schwartz, Marcel, Kuczkowski, Andreas, and Assenmacher, Wilfried, "Self-catalyzed growth of GaSb nanowires at low reaction temperatures," Journal of Crystal Growth, vol. 312 no. 9, pp. 1475-1480, Apr. 15, 2010.

Schulz, U., Wilbrandt, P. J., and Tidecks, R., "Growth and Crystallographic Orientations of Zinc and Zinc-Silver Whiskers," Journal of Crystal Growth, vol. 85 no. 3, pp. 472-476, Nov II, 1987.

Schussler, Florian, Dohle, Rainer, Oppert, Thomas. Azdasht, Ghassem, Geogiev, Georgi, and Franke, Jorg, "New Solder Bumping and Adapted Assembly Technologies," Wafer & Device Packaging and Interconnect, vol. 1 no. 7, pp. 20-27, Nov./Dec. 2010.

Schussler, Florian, Dohle, Rainer, Oppert, Thomas, Azdasht, Ghassem, Georgiev, Georgi, and Franke, Jorg, "New Solder Bumping Technology and Adapted Assembly Processes for 100 um Pitch Flip-Chip-Technology Using Capillary Flow or No Flow Underfill," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 160-168.

Schussler, Florian, Rosch, Michael, Horber, Johannes, and Feldmann Klaus, "Reliability aspects of electronic devices for advanced requirements," Circuit World, vol. 34 no. 3, pp. 23-30, 2008.

Schut, Jan H., "First Commercial Recycling Process For Electronics Waste," Plastics Technology, vol. 54 no. 5, pp. 47-49, May 2008.

Schut, Jan H., "Recycling E-Plastics: New Material Stream Brings Its Own Set of Problems," Plastics Technology, vol. 53 no. 8, pp. xx-xx, Aug. 2007.

Schutz, Gerhard, Birzer, Christian, and Dittes, Marc, "On The Equivalence Of First- And Second-Level Reliability Test Conditions For Packages In Enhanced Temperature Regimes," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 626-632.

Schvaneveldt, Shane J., "Environmental performance of products: Benchmarks and tools for measuring improvement," Benchmarking: An International Journal, vol. 10 no. 2, pp. 136-151, 2003.

Schwalbach, E. J., Davis, S. H., Voorhees, P. W., Wheeler, D., and Warren, J. A., "Liquid droplet dynamics and complex morphologies in vapor-liquid-solid nanowire growth," Journal of Materials Research, vol. 26 no. 17, pp. 2186-2198, Sept. 14, 2011.

Schwartz, Ephraim, "Caught in a regulatory cross fire," InfoWorld, vol. xx no. xx, pp. xx-xx, Oct. 29, 2004.

Schwartz, Ephraim, "EuP: The coming regulation storm," InfoWorld, vol. xx no. xx, pp. xx-xx, Oct. 31, 2006.

Schwartz, Ephraim, "New regulations loom large in 2006," InfoWorld, vol. xx no. xx, pp. xx-xx, Dec. 29, 2005.

Schwartz, Ephraim, "Regulatory Cross Fire," InfoWorld, vol. 26 no. 44, pp. 10, Nov. 1, 2004.

Schwarz, Bernd, "Deformation Measurements used for Design Optimization and Verification during Industrial Electronic Board (Product) Manufacturing," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Schwarz, Mark, Choi, Alan, and Fay, Owen, "Evaluation of Reliability and Stack-Up Height on Next Generation 0.5mm Pitch PoP," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 49-56.

Schwarzer, Christian, Lang, Kurt-Jurgen, Fuchs, Dennis, Rauer, Miriam, Kaloudis, Michael, Krugelstein, Andreas, and Franke, Jorg, "Investigation of the influence of voids on the reliability of LED solder joints by computer tomography and forward voltage measurements," 2017 21st European Microelectronics and Packaging Conference & Exhibition , Warsaw, Poland, Sept. 10-13, 2017, pp. xx-xx.

Schwarzer, N., "Short note on the effect of a pressure-induced increase in Young's modulus," Philosophical Magazine, vol. 92 no. 13, pp. 1631-1648, May 1, 2012. https://doi.org/10.1080/14786435.2012.667579

Schweber, Bill, "Easy to say does not mean easy to do," EE Times Europe, July 19, 2008.

Schweber, Bill, "Lead-free mandate plumbs new design challenges," EDN, vol. 47 no. 9, pp. 55-59, Apr. 18, 2002.

Schweber, Bill, "Unintended benefits," EDN, vol. xx no. xx, pp. xx-xx, Nov. 1, 2004.

Schweigart, Helmut, and Wack, Harald, "Humidity and Pollution Effects on Lead-Free Assemblies," Lead-Free Connection, vol. 3 no. 2, pp. 8-10, Aug. 2006.

Schweigart, Helmut, and Wack, Harald, "Humidity and Pollution Effects on Pb-Free Assemblies," Circuits Assembly, vol. 18 no. 4, pp. 34, 36-37, Apr. 2007.

Schwertheim, S., Scherff, M., Mueller, T., Fahrner, W. R., and Neitzert, H. C., "Lead-Free Electrical Conductive Adhesives for Solar Cell Interconnectors ," 33rd IEEE Photovoltaic Specialists Conference, San Diego, CA, May 11-16, 2008, pp. xx-xx.

Schwerz, Robert, Meyer, Sebastian, Roellig, Mike, Meier, Karsten, and Wolter, Klaus-Juergen, "Finite Element Modeling on Thermal Fatigue of BGA Solder Joints with Multiple Voids," 2011 34th International Spring Seminar on Electronics Technology , Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 380-385.

Schwerz, Robert, Roellig, Mike, Meier, Karsten, and Wolter, Klaus-Juergen, "Lifetime Assessment of BGA Solder Joints with Voids under Thermo-Mechanical Load," 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Lisbon, Portugal, Apr. 16-18, 2012, pp. xx-xx.

Sciacca, Beniamino, van de Groep, Jorik, Polman, Albert, and Garnett, Erik C., "Solution-Grown Silver Nanowire Ordered Arrays as Transparent Electrodes," Advanced Materials, vol. 28 no. 5, pp. 905-909, Feb. 3, 2016.

Scimeca, Tom, Sikorcin Glenn, and Lentz, Tony, "lead-free HASl: the role of germanium," Global SMT and Packaging , vol. 11 no. 7 pp. 12-14,41, July 2011.

Scopel, Illa, "Making sense of WEEE," Electronic Product Design, vol. 23 no. 11, pp. 22,24, Nov. 2002,

Scotcher, Phil, "ROHS - The cost of compliance," Electronic Product Design, vol. 27 no. 6, pp. 21-22, June 2006.

Scott, G. G., and Coleman, R. V., "Domain Changes during Longitudinal Magnetization of Iron Whiskers," Journal of Applied Physics, vol. 28 no. 12, pp. 1512-1513, 1957.

Scroope, Alan, and Patterson, Anne, "Unraveling WEEE, The EU's 2005 E-Waste Regulation, and Just Why You Should Care," SupplyChainBrain.com, Apr. 2005.

Scroope, Alan, "WEEE basics," Green SupplyLine, June 15, 2005.

Scruby, Ray, "WEEE & RoHS: The conformity detectives," Electronics Weekly, Dec. 1, 2005.

Scruby, Ray, "RoHS and WEEE compliance testing?," Finishing, vol. 29 no. 6, pp. S6, Nov.-Dec. 2005.

Scuderi, Mario, Prete, Paola, Lovergine, Nico, Spinella, Corrado, and Nicotra, Giuseppe, "Effects of VLS and VS mechanisms during shell growth in GaAs-AlGaAs core-shell nanowires investigated by transmission electron microscopy," Materials Science in Semiconductor Processing, vol. 65, pp. 108-112, July 2017.

Scullion, Andrew, Thompson, David A., and Botton, Gianluigi A., "Growth and kinetic Monte Carlo simulation of InAs quantum wires on vicinal substrates," Journal of Crystal Growth, vol. 412, pp. 87-94, Feb. 15, 2015.

Sea, T. Y., Tan, T. C., and Peh, E. K., "Reflowable Anisotropic Conductive Adhesives for Flipchip Packaging," Proceedings of the 1997 1st Electronic Packaging Technology Conference, Singapore, Oct. 8-10, 1997, pp. 259-262.

Seah, S. K. W., Wong, E. H., Selvanayagam, C. S., Caers, J. F. J. M, v. Driel, W. D., Owens, N., and Lai, Y.-S., "A Comprehensive Test Method for Bridging the Gap between Product and Board Level Drop Tests," 2008 10th Electronics Packaging Technology Conference , Singapore, Dec. 9-12, 2008, pp. 1102-1107.

Seah, S. K. W., Wong, E. H., Mai, Y. W., Rajoo, R., and Lim, C. T., "Failure Mechanisms of Interconnections in Drop Impact," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1484-1492.

Seah, S. K. W., Wong, E. H., and Shim, V. P. W., "Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading," Scripta Materialia, vol. 59 no. 12, pp. 1239-1242, Dec. 2008.

Seah, S. K. W., Wong, E. H., Mai, Y. W., Rajoo, R., and Lim, C. T., "High-Speed Bend Test Method and Failure Prediction for Drop Impact Reliability," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1003-1008.

Sears, G. W., "A Growth Mechanism for Mercury Whiskers," Acta Metallurgica, vol. 3 no. 4, pp. 361-366, July 1955.

Sears, G. W., "A Mechanism of Whisker Growth," Acta Metallurgica, vol. 3 no. 4, pp. 367-369, July 1955.

Sears, G. W., Gatti, A., and Fullman, R. L., "Elastic Properties of Iron Whiskers," Acta Metallurgica, vol. 2 no. 5, pp. 727-728, Sept. 1954.

Sears, G. W., and Coleman, R. V., "Growth Mechanism of Near-Perfect Crystals," Journal of Chemical Physics , vol. 25 no. 4, pp. 635-637, Oct. 1956.

Sears, G. W., "Mercury Whiskers," Acta Metallurgica, vol. 1 no. 4, pp. 457-459, July 1953.

Sears, G. W., "Nucleation and Growth of Mercury Crystals at Low Supersaturation," Journal of Chemical Physics, vol. 33 no. 2, pp. 563-567, Aug. 1960.

Sears, G. W., "Ultimate Strength of Crystals," Journal of Chemical Physics, vol. 36 no. x, pp. 862, 1962.

Sears, Gerald W., "Dislocation Etchings," Journal of Chemical Physics, vol. 32 no. 5, pp. 1317-1322, May 1960.

Sears, Gerald W., "Growth of Mercury Platelets from the Vapor," Journal of Chemical Physics, vol. 25 no. 4, pp. 637-642, Oct. 1956.

Sebo, P., Svec Sr., P., Janickovic, D., Illekova, E., Zemankova, M., Plevachuk, Yu., Sidorov, V., and Svec, P., "The influence of silver content on structure and properties of Sn-Bi-Ag solder and Cu/solder/Cu joints," Materials Science and Engineering: A , vol. 571, pp. 184-192, June 1, 2013.

Sebo, P., Svec, P., Janickovic, D., Illekova, E., and Plevachuk, Yu., "Interface between Sn-Sb-Cu solder and copper substrate," Materials Science and Engineering: A, vol. 528 no. 18, pp. 5955-5960, July 15, 2011. https://doi.org/10.1016/j.msea.2011.04.008

Sebo, Pavol, Moser, Zbigniew, Svec, Peter, Janickovic, Dusan, Dobrocka, Edmund, Gasior, Wladyslaw, and Pstrus, Janus, "Effect of indium on the microstructure of the interface between Sn3.13Ag0.74CuIn solder and Cu substrate," Journal of Alloys and Compounds, vol. xxx no. xxx, pp. xx-xx, xxxx.

Sebo, Pavol, Svec, Peter, Janickovic, Dusan, and Stefanik, Pavol, "Influence of thermal cycling on shear strength of Cu-Sn3.5AgIn-Cu joints with various content of indium," Journal of Alloys and Compounds, vol. 463 no. 1-2, pp. 168-172, Sept. 8, 2008.

Seby, F., Gagean, M., Garraud, H., Castetbon, A., and Donard, O. F. X., "Development of analytical procedures for determination of total chromium by quadrupole ICP-MS and high-resolution ICP-MS, and hexavalent chromium by HPLC-ICP-MS, in different materials used in the automotive industry," Analytical and Bioanalytical Chemistry, vol. 377 no. 4, pp. 685-694, Oct. 2003.

Sedman, Richard M., Beaumont, Jay, McDonald, Thomas A., Reynolds, Stephen, Krowech, Gail, and Howd, Robert, "Review of the Evidence Regarding the Carcinogenicity of Hexavalent Chromium in Drinking Water," Journal of Environmental Science and Health - Part C Environmental Carcinogenesis and Ecotoxicology Reviews, vol. 24 no. 1, pp. 155-182, Jan.-June 2006.

Seehase, Dirk, Huth, Heiko, Neiser, Arne, and Nowottnick, Mathias, "Reactive Paste for Reflow Soldering of Large Components," Proceedings of the 2014 37th International Spring Seminar on Electronics Technology , Dresden, Germany, May 7-11, 2014, pp. 27-32.

Seelig, Karl, "A Comparison of Leading Lead-Free Alloys," AIM, Sept. 1998.

Seelig, Karl, and Suraski, David, "A Comparison of Tin-Silver-Copper Lead-Free Solder Alloys,", AIM.

Seelig, Karl, and Suraski, David, "A Practical Guide to Achieving Lead-Free Electronics Assembly," AIM.

Seelig, Karl, "A Study of Indium/Lead Solders," AIM.

Seelig, Karl, and Suraski, David, "A Study of Lead-Contamination in Lead-Free Electronics Assembly and It's Impact on Reliability," SMTA Technical Conference, San Jose, CA, May 2002, pp. 93-97.

Seelig, Karl, and Suraski, David, "A Study of Lead-Contamination in Lead-Free Electronics Assembly and Its Impact on Reliability," 2002 SMTA International Conference Proceedings , Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Seelig, Karl, and Suraski, David, "A study of Lead-Contamination in Lead-Free Electronics Assembly and It's Impact on Reliability," 2002 NEPCON West - Fiberoptic Expo Conference Proceedings, 2002, pp. 288-292.

Seelig, Karl, "A Study of Lead-Free Solder Alloys," Proceedings of the Technical Program NEPCON West '95, Volume 2, Anaheim, CA, Feb. 26-Mar. 2, 1995, pp. 1061-1065.

Seelig, Karl, and Nishimura, Tetsuro, "A Unique Tin Whisker Growth Study of Nine Lead Free Alloys," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Seelig, Karl, and Nishimura, Tetsuro, "A Unique Tin Whisker Growth Study of Nine Lead Free Alloys," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Seelig, Karl, and Suraski, David, "Advanced Issues in Assembly: Part 1 Lead Contamination in Lead-free Assembly," Surface Mount Technology (SMT), vol. 15 no. 10, pp. 70, 72-73, Oct. 2001.

Seelig, Karl, and Suraski, David, "Advanced Materials Considerations for Lead-Free Electronics Assemblies," The International Journal of Microcircuits and Electronic Packaging , vol. 24 no. 4, pp. 366-378, Fourth Quarter 2001.

Seelig, Karl, "Agreeing on a Lead-Free Alloy," Printed Circuit Fabrication, vol. 25 no. 7, pp. 47, July 2002.

Seelig, Karl F., "Alternative Lead-free Alloys for SMT Assembly," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 701-705.

Seelig, Karl, and Suraski, David, "An Overview and Comparison of Viable Lead-Free Alloys," 2001 HD International Conference on High-Density Interconnect and Systems Packaging (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4428) , Santa Clara, CA, Apr. 17-20, 2001, pp. 308-313.

Seelig, Karl, and O'Neill, Tim, "Can the Right Alloy Prevent Tin Whisker Formation?," Printed Circuit Design and Fab/ Circuits Assembly, vol. 31 no. 7, pp. 40-41, July 2014.

Seelig, Karl, and O'Neill, Timothy, "Conformal Coating over No Clean Flux," IPC APEX Expo 2013, San Diego, CA, Feb. 17-21, 2013, pp. xx-xx.

Seelig, Karl, "Considerations for Lead-Free Wave Soldering."

Seelig, Karl, and Suraski, David, "Controlling Copper Build Up In Automatic Soldering Equipment," AIM.

Seelig, Karl, and Suraski, David, "Controlling Copper Build Up In Automatic Soldering Equipment Using Lead-Free Solder," AIM.

Seelig, Karl, "HIP Defects in BGAs," Circuits Assembly, vol. 19 no. 12, pp. 28,30-31,46, Dec. 2008.

Seelig, Karl, and Suraski, David, "Joint Failures, Lead Contamination and Other Important Considerations for Lead-free Electronics Assembly," 2001 Advanced Packaging Technology Conference Proceedings, 2001, pp. xx-xx.

Seelig, Karl, and Suraski, David, "Lead-Contamination in Lead-Free Electronics Assembly," AIM.

Seelig, Karl F., "Lead Free Alloy Development," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 16-18, 2012, pp. xx-xx.

Seelig, Karl, "Lead-Free Alloy Development," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 599-604.

Seelig, Karl, "Lead-Free Solder Assembly for Mixed Technology Circuit Boards," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Seelig, Karl, and Suraski, David, "Lead-Free Soldering: An Overview and Comparison of the Viable Solutions," Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 558-563.

Seelig, Karl, and Suraski, David, "Materials and Process Considerations for Lead-Free Electronics Assembly," Circuits Assembly, vol. 12 no. 12, pp. 30,33-34,36,38-39, Dec. 2001.

Seelig, Karl, Tournier, Bernard, Lotosky, Paul, Vivari, John, Slattery, Jim, Hilvers, Tony, Munie, Greg, Wicker, Tippy, Shangguan, Dongkai, Bath, Jasbir, Wenger, George, Clech, Jean-Paul, and May, Dean, "Overview of Lead Free SAC Alloys Evaluation and Reliability Test Program," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Seelig, Karl, "Pb-Free Solder Assembly for Mixed-Technology Boards," Circuits Assembly, vol. 17 no. 3, pp. 42, 44-45, Mar. 2006.

Seelig, Karl, O'Neill, Timothy, Pigeon, Kevin, Maaleckian, Mehran, Monson, Andy, Machado, Walter, and Shea, Chrys, "Production Testing of Ni-Modified SnCu Solder Paste," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 655-663.

Seelig, Karl F., "Sample Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys," IPC APEX Expo 2014, Las Vegas, NV, Mar. 25-27, 2014, pp. xx-xx.

Seelig, Karl, "STEP 7: Soldering," Surface Mount Technology (SMT), vol. 19 no. 8, pp. xx-xx, Aug. 2005.

Seelig, Karl, and O'Neill, Tim, "The Reflow Limbo: How Low Can We Go?," Printed Circuit Design and Fab/ Circuits Assembly, vol. 31 no. 1, pp. 37-38, Jan. 2014.

Seelig, Karl, and Suraski, David, "The Status of Lead-Free Solder Alloys," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 1405-1409.

Seelig, Karl, and Suraski. David, "The Status of Lead-Free Alloys," Circuits Assembly, vol. 11 no. 9, pp. 56,58-61, Sept. 2000.

Seelig, Karl, and O'Neil, Tim, "Tin Whisker Revelations," Printed Circuit Design and Fab/ Circuits Assembly, vol. 31 no. 5, pp. 71-72, May 2014.

Seelig, Karl, and O'Neil, Tim, "Tin Whisker Study Conclusions," Printed Circuit Design and Fab/ Circuits Assembly, vol. 31 no. 9, pp. 52-54, Sept. 2014.

Seelig, Karl, "Understanding Lead-Free Alloys," AIM, Jan. 1998.

Seelig, Karl, "Understanding Lead-Free Alloys," Surface Mount Technology (SMT) , vol. 1 no. 11, pp. xx-xx, Nov. 1997.

Seelig, Karl, and Burgess, Michael, "What is Halogen-Free Solder Paste?," Circuits Assembly, vol. 20 no. 5, pp. 19-21, May 2009.

Sefton, D. E., Rist, M. A., and Gungor, S., "Rate-dependent deformation of Sn-3.5Ag lead-free solder," Journal of Materials Science: Materials in Electronics, vol. 20 no. 11, pp. 1083-1089, Nov. 2009.

Segerberg, Tomas, and Hedemalm, Per, "Life Cycle Assessment of Tin-lead Solder and Silver-Epoxy Conductive Adhesive," Proceedings of the 1996 IEEE International Symposium on Electronics and the Environment, Dallas, TX, May 6-8, 1996. pp. 64-65.

Segerberg, Tomas, Gumaelius, Lena, Hessle, Helena, and Ostensson, Eva, "Toxicological Aspects of Halogen Free Flame Retardants Based on Denitrification Inhibition Tests," Proceedings of the 2000 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-10, 2000, pp. 69-74.

Seidowski, Th., Kriebel, F., and Galties, J., "Smart Cards and Smart Labels - High Volume Applications of Adhesive Flip-Chip Technologies," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 52-54.

Seifert, Werner, Borgstrom, Magnus, Deppert, Knut, Dick, Kimberly A., Johansson, Jonas, Larsson, Magnus W., Martensson, Thomas, Skold, Niklas, Svensson, C. Patrik T., Wacaser, Brent A., Wallenberg, L. Reine, and Samuelson, Lars, "Growth of one-dimensional nanostructures in MOVPE," Journal of Crystal Growth, vol. 272 no. 1-4, pp. 211-220, Dec. 10, 2004.

Seifner, Michael S., Pertl, Patrik, Bernardi, Johannes, Biswas, Subhajit, Holmes, Justin D., and Barth, Sven, "Lead-supported germanium nanowire growth," Materials Letters, vol. 173, pp. 248-251, June 15, 2016.

Seifner, Michael S., Biegger, Felix, Lugstein, Alois, Bernardi, Johannes, and Barth, Sven, "Microwave-Assisted Ge1-xSnx Nanowire Synthesis: Precursor Species and Growth Regimes," Chemistry of Materials, vol. 27 no. 17, pp. 6125-6130, Sept. 8, 2015.

Seiroco, H., Vincente, M., Ferreira, J., Fernandes, F. B., Marvao, A. P., Martins, J. I., Fortunato, E., and Martins, R., "New Adhesion Process based on lead free solder applied in electronic power devices," Key Engineering Materials, vol. 230-232, pp. 92-95, 2002.

Seitz, Jan-Marten, Utermohlen, Dennis, Wulf, Eric, Klose, Christian, and Bach, Friedrich-Wilhelm, "The Manufacture of Resorbable Suture Material from Magnesium - Drawing and Stranding of Thin Wires," Advanced Engineering Materials, vol. 13 no. 12, pp. 1087-1095, Dec. 2011.

Seki, Yoshihito, Imanishi, Ken, and Ohminato, Tadanori, "Flip Chip on FPC," Fujikura Technical Review, no. 31, pp. 18-21, Jan. 2002.

Sekito, Tomoo, Tanaka, Nobutoshi, and Matsuto, Toshihiko, "Leachability and content of heavy metals in incombustible residues from resource recovery facilities," Waste Management and Research, vol. 18 no. 2, pp. 151-x159, Apr. 2000.

Sekulic, Dusan P., Zhao, Hui, and Liu, Wen, "A Thermodynamic Metric for Process Quality Assessment in Manufacturing: Pb vs. Pb-free Solders Spreading Case Study," 2008 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 19-21, 2008, pp. xx-xx.

Selcuker, Ahmet, and Johnson, Michael, "Microstructural Characterization of Electrodeposited Tin Layer in Relation to Whisker Growth", 10th Capacitor and Resistor Technology Symposium , San Francisco, CA, Mar. 28-29, 1990, pp. 196-199.

Self, W. B., and Edwards, P. L., "Effect of Tensile Stress on the Domain-Nucleation Field of Iron Whiskers," Journal of Applied Physics, vol. 43 no. 1, pp. 199-202, Jan. 1972.

Sellers, Keith M., "A 'Quality' Test Plan for Pb-Free Products," IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics, Raleigh, NC, Mar. 11-12, 2008, pp. xx-xx.

Sellers, Keith M., "Got Whiskers?," Surface Mount Technology (SMT), vol. 32 no. 1, pp. 92,94, Jan. 2017.

Sellers, Keith M., "Real Reliability Concerns in the Medical Electronics World," Medical Electronics Symposium 2010 Proceedings, Tempe, AZ, Sept. 22-23, 2010, pp. xx-xx.

Selvaduray, Guna, "An Expert Looks at the IssuesTM," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Mar.-Apr. 2000.

Selvaduray, Guna S., "Is 'Design for the Environment' Strictly Academic?," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Sept.-Oct. 2000.

Selvaduray, Guna, "Pb-Free Solders and their Effectiveness," Apr. 6, 2005.

Seman, A., Ekere, N. N., Ashenden, S. J., Mallik, S., Marks, A. E., and Durairaj, R., "In-situ Non-destructive Ultrasonic Rheology Technique for Monitoring Different Lead-free Solder Pastes for Surface Mount Applications," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1448-1454.

Semenova, Olga, Flandorfer, Hans, and Ipser, Herbert, "On the non-occurrence of tin pest in tin-silver-indium solders," Scripta Materialia, vol. 52 no. 2, pp. 89-92, Jan. 2005.

Semmens, Janet E., "Evaluation of Lead-Free Solder Bonds and Effects of the Lead-Free Process on Devices Using Acoustic Micro Imaging," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 560-565.

Semmens, Janet E., "Lead-Free Solder Bond Evaluation Using Acoustic Micro Imaging (AMI)," 2002 Pan Pacific Symposium Conference Proceedings, Maui, Hawaii, Feb. 5-7, 2002, pp. xx-xx.

Seneker, Carl, Moffatt, Scott, "New Pretreatment Systems, Primers and Coatings Meet the Challenges of Modern Appliances," Finishing Today, vol. 83 no. 6, pp. 24-25, June 2007.

Senese, Tony, "IPC Low Halogen Electronics Standard Task Group 4-33a & JEDEC JC14 Committee," It's Not Easy Being Green, San Jose, CA, Feb. 4-5, 2009, pp. xx-xx.

Seng, Henri, and Muller, Chris, "Data Center Woes: Reliability Issues Plague RoHS-Compliant Electronics," South East Asia Technical Training Conference on Electronics Assembly Technologies 2012 Proceedings, Penang, Malaysia, Apr. 18-20, 2012, pp. xx-xx.

Sengupta, S., Soda, H., McLean, A., and Rutter, J. W., "A Comparative Study of the Microstructures Observed in Statically Cast and Continuously Cast Bi-In-Sn Ternary Eutectic Alloy," Metallurgical and Materials Transactions A, vol. 31 no. 1, pp. 239-248, Jan. 2000.

Sengupta, Shirsho, Das, Diganta, Ganesan, Sanka, Rollins, William, Pinsky, David, Lin, T. Y., and Pecht, Michael G., "Assessment of Thermomechanical Damage of Electronic Parts Due to Solder Dipping as a Postmanufacturing Process," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 2, pp. 128-137, Apr. 2007.

Sengupta, Shirsho, Das, Diganta, Ganesan, Sanka, Pecht, Michael, Lin, T. Y., and Rollins, William, "Effects of Re-finishing of Terminations by Solder-Dipping on Plastic Quad Flatpack Electronic Parts," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2, Singapore, Dec. 7-9, 2005, pp. 768-773.

Sentz, Scott, "Fusion Processing of Surface Mount Components to Mitigate Tin Whiskers," Microwave Journal, vol. 56 no. 10, pp. 144,146,148,150,152, Oct. 2013.

Sentz, Scott, "The Unpredictability of Tin Whiskers Endures," Surface Mount Technology (SMT), vol. 30 no. 2, pp. 62,64-65, Feb. 2015.

Sentz, Scott, "Tin Whisker Mitigation Process for Surface Mount Components," Surface Mount Technology (SMT), vol. 27 no. 8, pp. 58-60,62, Aug. 2012.

Seo, Sun-Kyoung, Kang, Sung K., Shih, Da-Yuan, and Lee, Hyuck Mo, "An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate," Journal of Electronic Materials, vol. 38 no. 2, pp. 257-265, Feb. 2009.

Seo, Sun-kyoung, Cho, Moon Gi, Lee, Hyuck Mo, and Choi, Won Kyoung, "Comparison of Sn2.8Ag20In and Sn10Bi10In Solders for Intermediate-Step Soldering," Journal of Electronic Materials, vol. 35 no. 11, pp. 1975-1981, Nov. 2006.

Seo, Sun-Kyoung, Cho, Moon Gi, and Lee, Hyuck Mo, "Crystal orientation of b-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints," Journal of Materials Research, vol. 25 no. 10, pp. 1950-1957, Oct. 2010.

Seo, Sun-Kyoung, Kang, Sung K., Cho, Moon Gi, and Lee, Hyuck Mo, "Electromigration Performance of Pb-free Solder Joints in Terms of Solder Composition and Joining Path," JOM, vol. 62 no. 7, pp. 22-29, July 2010.

Seo, Sun-Kyoung, Cho, Moon Gi, Kang, Sung K., Chang, Jaewon, and Lee, Hyuck Mo, "Minor Alloying Effects of Ni or Zn on Microstructure and Microhardness of Pb-free Solders," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 84-89.

Seo, Sun-Kyoung, Kang, Sung K., Cho, Moon Gi, Shih, Da-Yuan, and Lee, Hyuck Mo, "The Crystal Orientation of b-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy," Journal of Electronic Materials, vol. 38 no. 12, pp. 2461-2469, Dec. 2009.

Seo, Sun-Kyoung, Kang, Sung K., Shih, Da-Yuan, and Lee, Hyuck Mo, "The evolution of microstructure and microhardness of Sn-Ag and Sn-Cu solders during high temperature aging," Microelectronics Reliability, vol. 49 no. 3, pp. 288-295, Mar. 2009.

Seo, Sun-Kyoung, Cho, Moon Gi, and Lee, Hyuck Mo, "Thermodynamic Assessment of the Ni-Bi Binary System and Phase Equilibria of the Sn-Bi-Ni Ternary System," Journal of Electronic Materials, vol. 36 no. 11, pp. 1536-1544, Nov. 2007.

Seo, Wonil, Kim, Kyoung-Ho, Bang, Jung-Hwan, Kim, Mok-Soon, and Yoo, Sehoon, "Effect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG," Journal of Electronic Materials, vol. 43 no. 12, pp. 4457-4463, Dec. 2014.

Seo, Wonil, Kim, Kyoung-Ho, Kim, Young-Ho, and Yoo, Sehoon, "Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints," Journal of Electronic Materials, vol. 47 no. 1, pp. 110-116, Jan. 2018.

Seo, Wonil, Ko, Yong-Ho, Kim, Young-Ho, and Yoo, Sehoon, "Void fraction of a Sn-Ag-Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability," Journal of Materials Science: Materials in Electronics, vol. 30 no. 17, pp. 15889-15896, Sept. 2019.

Seol, Byong-Su, Lee, Jong-Sung, Lim, Jae-Deok, Lee, Hyungseok, Park, HarkByeong, Nandy, Argha, and Pommerenke, David, "A Circuit Model for ESD Performance Analysis of Printed Circuit Boards," Electrical Design of Advanced Packaging and Systems Symposium, Seoul, Korea, Dec. 10-12, 2008, pp. 120-123.

Seol, Keong-Won, Choi, Chang-Hee, Kim, Sangyum, Son, Seong Ho, and Lee, Jong K., "On the mechanism of popcorn blistering in copper clad laminates," Journal of Adhesion Science & Technology, vol. 17 no. 10, pp. 1331-1349, Oct. 1, 2003.

Seppala, A., and Ristolainen, E., "Study of adhesive flip chip bonding process and failure mechanisms of ACA joints," Microelectronics Reliability, vol. 44 no. 4, pp. 639-648, Apr. 2004.

Seppala, Anne, Suominen, Ilpo, and Ristolainen, Eero, "A Long-term Reliability of Adhesive Flip Chip Joints Using Very Thin Chips," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, Germany, Oct. 21-24, 2001, pp. 196-201.

Seppala, Anne, Pienimaa, Seppo, and Ristolainen, Eero, "Flip Chip Joining on FR-4 Substrate Using ACFs," The International Journal of Microcircuits and Electronic Packaging, vol. 24 no. 2, pp. 148-159, Second Quarter 2001.

Seppala, Anne, Aalto, Kati, and Ristolainen, Eero, "Reducing bonding cycle time of adhesive flip chip process," Soldering & Surface Mount Technology, vol. 15 no. 1, pp. 16-20, 2003.

Seppala, Anne, Saarinen, Kimmo, and Ristolainen, Eero, "Reliability of unencapsulated SMD plastic film capacitors," Soldering & Surface Mount Technology, vol. 12 no. 1, pp. 15-22, 2000.

Septimio, Rudimylla S., Costa, Thiago A., Vida, Talita A., Garcia, Amauri, and Cheung, Noe, "Interrelationship of thermal parameters, microstructure and microhardness of directionally solidified Bi-Zn solder alloys," Microelectronics Reliability, vol. 78, pp. 100-110, Nov. 2017.

Sepulveda-Macias, Matias, Amigo, Nicolas, and Gutierrez, Gonzalo, "Onset of plasticity and its relation to atomic structure in CuZr metallic glass nanowire: A molecular dynamics study," Journal of Alloys and Compounds, vol. 655, pp. 357-363, Jan. 15, 2016.

Sequeira, Pravin, "Lead Free Product Quality in Vapor Phase Reflow," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 182-188.

Sera, Kazihiko, and Muraki, Shinji, "Converting to Lead-Free Surface Plating for Terminals for Semiconductor Packages," OKI Technical Review, vol. 68, pp. 42-46, Dec. 2001.

Serbaroli Jr., Joseph A., "A Primer on Flame Retardants for Thermoplastics," Plastics Engineering , vol. 62 no. 8, pp. 22-24, Aug. 2006.

Serebreni, Maxim, Wilcoxon, Ross, Hillman, Dave, Blattau, Nathan, and Hillman, Craig, "Assessing the Effect of Improper Conformal Coating on SnPb and Pbfree BGA Solder Joints during Thermal Cycling: Experiments and Modeling," Advancing Microelectronics, vol. 44 no. 5, pp. 6-13, Sept./Oct. 2017.

Serebreni, Maxim, Blattau, Nathan, Hillman, Craig, Bhatkal, Ravi, Dutt, Gyan, and Pandher, Ranjit, "Fatigue Life Prediction Model for LEDs On Metal Core Printed Circuit Boards (MCPCBs) with Pb-Free Solder Alloys," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 361-369.

Serebreni, Maxim, Blattau, Nathan, Sharon, Gil, Hillman, Craig, and McCluskey, Patrick, "Semi-Analytical Fatigue Life Model for Reliability Assessment of Solder Joints in QFN Packages under Thermal Cycling," International Conference on Soldering & Reliability 2017 Proceedings, Toronto, Ontario, Canada, June 6-8, 2017, pp. xx-xx.

Serebreni, Maxim, Wilcoxon, Ross, Hillman, Dave, Blattau, Nathan, and Hillman, Craig, "The Effect of Improper Conformal Coating on SnPb and Pb-free BGA Solder Joints during Thermal Cycling: Experiments and Modeling," 2017 33rd Thermal Measurement, Modeling & Management Symposium, San Jose, CA, Mar. 13-17, 2017, pp. 40-47.

Serizawa, Koji, Miura, Kazuma, Shimokawa, Hanae, and Nakatsuka, Tetsuya, "Application of Lead Free Solders to Semiconductor Packages," Yosetsu Gakkai Shi/Journal of the Japan Welding Society, vol. 69 no. 2, pp. 30-24, Mar. 2000.

Serizawa, Koji, Okamoto, Masahide, Ishihara, Shosaku, and Harada, Masahide, "Development of Next Generation Environment-Friendly Soldering Technology," Proceedings of EcoDesign2003: Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 8-11, 2003, pp. 817-820.

Serizawa, Koji, "Some Propaties and Compositions of Lead-Free Solders," Hyomen Gijutsu (Journal of the Surface Finishing Society of Japan), vol. 55 no. 9, pp. 582-585, Sept. 2004.

Serizawa, Koji, Yoshimi, Kenji, Okamoto, Masahide, Narita, Toshio, and Tanaka, Junichi, "Thermal Fatigue Life of Sn-2Ag Solder Bump with Small Al Addition," Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 12-14, 2005, pp. 569-572.

Servant, Colette, "Relationships Between Phase Transformations, Microstructure and Properties in Ti and Pb-Free Alloys," Advanced Engineering Materials, vol. 12 no. 10, pp. 995-1002, Oct. 2010.

Servin, Jose M., Dominguez, Miguel, Nothel, Tabata, Vazquez, Indira, Juarez, Pedro, and Roman, Ivan, "Tin Flakes/Splashes in SMT," SMTA International 2016 Proceedings , Rosemont, IL, Sept. 25-29, 2016, pp. 703-713.

Servin Olivares, Jose Maria, and Gomez Aceves, Cynthia, "TOF SIMS Analysis for SnxOy Determination on Lead-Free HASL PCBs," Surface Mount Technology (SMT), vol. 28 no. 10, pp. 28,30-32,34-36,38,40,42,44, Oct. 2013.

Sesek, Aleksander, Chambers, Olga, and Trontelj, Janez, "Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques," Journal of Electronic Packaging, vol. 141 no. 2, pp. 021005-1-021005-7, June 2019.

Sethi, Anand Kumar, "India and E-Waste," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Aug. 23, 2007.

Seto, P., Evans, J., and Bishop, S., "Analysis of the Palladium Finish," Surface Mount Technology (SMT) , vol. 13 no. 6, pp. 60, 62-63, June 1999.

Seto, P., Evans, J., and Bishop, S., "Palladium Surface Finish for Soft Touch Switches and High Density SMT Assemblies," 1998 Surface Mount International Conference Proceedings , San Jose, CA, Aug. 23-27, 1998, pp. xx-xx.

Settino, Francesco, Crupi, Felice, Biswas, Subhajit, Holmes, Justin D., and Duffy, Ray, "Modelling doping design in nanowire tunnel-FETs based on group-IV semiconductors," Materials Science in Semiconductor Processing, vol. 62, pp. 201-204, May 2017.

Setty, Kaushik, Subbarayan, Ganesh, and Nguyen, Luu, "Powercycling Reliability, Failure Analysis and Acceleration Factors of Pb-Free Solder Joints," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 907-915.

Sevillano, Javier Gil, "A twist on heavily drawn wires," Wire Journal International, vol. 44 no. 2, pp. 58-70, Feb. 2011.

Seyyedi, J., "Thermal Fatigue Behaviour of Low Melting Point Solder Joints," Soldering & Surface Mount Technology, vol. 5 no. 1, pp. 26-32, 1993.

Seyyedi, J., "Thermal Fatigue of Low-temperature Solder Alloys in Insertion Mount Assembly," Advances in Electronic Packaging 1993, Volume 2, Binghamton, NY, Sept. 29-Oct. 2, 1993, pp. 951-960.

Sha, Chu-Hsuan, and Lee, Chin C., "15um Silver Flip-Chip Technology with Solid-State Bonding," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 911-915.

Sha, Chu-Hsuan, Lin, Wen P., and Lee, Chin C., "40 um Copper-Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding," Journal of Electronic Packaging, vol. 134 no. 2, pp. 021004-1-021004-4, June 2012.

Sha, Chu-Hsuan, and Lee, Chin C., "40 um Silver Flip-Chip Interconnect Technology With Solid-State Bonding," Journal of Electronic Packaging, vol. 133 no. 3, pp. 031012-1-031012-4, Sept. 2011.

Sha, Chu-Hsuan, and Lee, Chin C., "Low-Temperature Solid-State Silver Bonding of Silicon Chips to Alumina Substrates," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 12, pp. 1983-1987, Dec. 2011.

Shafer, Jeff, "Meeting Obsolescence & Compliance Challenges in the Age of RoHS," Wireless Design & Development, pp. 12, 14, Aug. 2006.

Shafer, Jeff, "U.S. RoHS: To be or not to be?," Feb. 6, 2007.

Shafer, Jeff, "Why RoHS impacts your company, even if it is exempt," Connector Specifier, vol. 22 no. 4, pp. 30, Apr./May 2006.

Shaffiar, N. M., Loh, W. K., Kamsah, N., and Tamin, M. N., "Continuum Damage Evolution in Pb-Free Solder Joint under Shear Fatigue Loadings," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 304-308.

Shaffiar, N. M., Yamin, A. F. M., Loh, W. K., and Tamin, M. N., "Fatigue Failure Processes in Pb-free Solder Joints using Continuum Damage and Cohesive Zone Models," 2012 IEEE 14th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 5-7, 2012, pp. 456-461.

Shaffiar, N. M., Loh, W. K., Kamsah, N., and Tamin, M. N., "Progressive Damage in Sn-4Ag-0.5Cu Solder Joints during Flexural Fatigue of a BGA Package," 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Melaka, Malaysia, Nov. 30-Dec. 2, 2010, pp. xx-xx.

Shafiq, I., Lau, H. Y., and Chan, Y. C., "Effect of Trace Diamond Nanoparticle Addition on the Interfacial, Mechanical, and Damping Properties of Sn-3.0Ag-0.5Cu Solder Alloy," Journal of Electronic Materials, vol. 42 no. 9, pp. 2835-2847, Sept. 2013.

Shafiq, I., Chan, Y. C., Xu, S., and Li, Q. Q., "Electro-migration Study of Nano Al Doped Lead- Free Sn-58Bi on Cu and Au/Ni/Cu Ball Grid Array (BGA) Packages," 2011 18th European Microelectronics and Packaging Conference, Brighton, United Kingdom, Sept. 12-15, 2011, pp. xx-xx.

Shafiq, I., Chan, Y. C., Wong, N. B., and Yung, Winco K. C., "Influence of small Sb nanoparticles additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy," Journal of Materials Science: Materials in Electronics, vol. 23 no. 7, pp. 1427-1434, July 2012.

Shah, Amit, Mahalingam, Saketh, and Goray, Kunal, "Reliability Evaluation of Lead Free Electronics for Automotive Applications," 2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.

Shah, Jayesh, Xia, Bo, Cheng, Stone, O'Hara, Wanda, and Buffa, Vito, "Low Temperature, Spot Cure Conductive Adhesive Technologies for RFID Tags Assembly," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 305-309.

Shah, Kunal, "A Novel & Cost-Effective Electroless Nickel Immersion Gold (ENIG) Surface Finish for Better Reliability of Electronic Assemblies," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Shah, Monal B., Tipre, Devayani R., and Dave, Shailesh R., "Chemical and biological processes for multi-metal extraction from waste printed circuit boards of computers and mobile phones," Waste Management and Research, vol. 32 no. 11, pp. 1134-1141, Nov. 2014.

Shah, Vatsal A., Kane, Amol S., Shakir, Ali M., Santos, Daryl L., DiPietro, Mike, Lehman, Lawrence, and Krantz, Leonard, "Pb-Free Process Development and Microstructural Analysis of Capacitor Filter Assemblies Using Solder Preforms," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 206-218.

Shah, Vatsal, Mohanty, Rita, Belmonte, Joe, Jensen, Tim, Lasky, Ron, and Bishop, Jeff, "Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing," .

Shah, Vatsal A., Kane, Amol S., Santos, Daryl L., DiPietro, Mike, Lehman, Lawrence, and Krantz, Leonard, "Transition to Pb-Free Alloys in Capacitor Filter Assemblies," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Shah, Vatsal A., Kane, Amol S., Santos, Daryl L., DiPietro, Mike, and Lehman, Lawrence, "Transition to Pb-free Alloys in Capacitor Filter Assemblies," Journal of the Reliability Information Analysis Center, pp. 12-16, 3rd Quarter 2006.

Shahin, George E., "A Review of Decorative Trivalent Chromium Electroplating," AESF Chromium Colloquium, Cleveland, OH, May 30-31, 1996, pp. 147-153.

Shahin, George E., "Alloys are Promising As Chromium or Cadimum Substitutes," Plating & Surface Finishing, vol. 85 no. 8, pp. 8-14, Aug. 1998.

Shahin, George E., "Barrel Chromium Plating From a Trivalent Chromium Electrolyte," Plating & Surface Finishing, vol. 79 no. 8, pp. 19-21, Aug. 1992.

Shahin, George E., "Decorative Chromium and Cadmium Substitutes," Proceedings of The International Technical Conference of SUR/FIN, Baltimore, MD, June 26-29, 1995, pp. 895-907.

Shahin, George E., "Electrodeposited Alloys as a Alternative for Decorative Hexavalent Chromium," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. 860-867.

Shahin, George, Smith, Howard, and Snyder, Donald, "Nickel & Cobalt Alloys as Alternatives For Decorative Hexavalent & Trivalent Chromium Deposits," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. 153-164.

Shahmanesh-Banks, Nargess, "Scrapheap challenge," Automotive Engineer (London), vol. 31 no. 1, pp. 30-31, Jan. 2006.

Shakthivel, Dhayalan, and Raghavan, Srinivasan, "Vapor-liquid-solid growth of Si nanowires: A kinetic analysis," Journal of Applied Physics, vol. 112 no. 2, pp. 024317-1-024317-14, July 15, 2012.

Shalaby, R. M., "Correlation between thermal diffusivity and activation energy of ordering of lead free solder alloys Sn65-xAg25Sb10Cux rapidly solidified from molten state," Journal of Materials Science: Materials in Electronics, v 16 no. 4, pp. 187-191, Apr. 2005.

Shalaby, R. M., and El-Sayed, M., "Effect of heat treatment on the fracture and structure of tin-indium solder alloy," Radiation Effects and Defects in Solids, vol. 160 no. 1-2, pp. 23-31, Jan.-Feb. 2005.

Shalaby, R. M., "Effect of rapid solidification on mechanical properties of a lead free Sn-3.5Ag solder," Journal of Alloys and Compounds, vol. 505 no. 1, pp. 113-117, Aug. 27, 2010.

Shalaby, R. M., "Structural, mechanical, hardness indentation measurements of Sn65-xAg25Sb10Cux solder alloys rapidly solidified from melt at cooling rate 1.1x10^5 K s-1," Journal of Materials Science: Materials in Electronics , vol. 15 no. 4, pp. 205-209, Apr. 2004.

Shalaby, Rizk Mostafa, and Elzanaty, Hesham, "Effect of nano-Al2O3 particles on the microstructure and mechanical performance of melt-spun process Sn-3.5Ag composite solder," Journal of Materials Science: Materials in Electronics, vol. 31 no. 8, pp. 5907-5913, Apr. 2020.

Shalaby, Rizk Mostafa, "Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi-Sn based lead-free solder alloys," Materials Science and Engineering: A, vol. 560, pp. 86-95, Jan. 10, 2013.

Shalaby, Rizk Mostafa, Allzeleh, Musaeed Mohammed, and Kamal, Mustafa, "Enhancement of melt-spun process Bi-Ag lead-free solder for high temperature applications," Journal of Materials Science: Materials in Electronics , vol. 29 no. 24, pp. 20554-20563, Dec. 2018.

Shalaby, Rizk Mostafa, "Indium, chromium and nickel-modified eutectic Sn-0.7 wt% Cu lead-free solder rapidly solidified from molten state," Journal of Materials Science: Materials in Electronics, vol. 26 no. 9, pp. 6625-6632, Sept. 2015.

Shalaby, Rizk Mostafa, Kamal, Mustafa, Ali, Esmail A. M., and Gumaan, Mohammed S., "Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly," Materials Science and Engineering: A, vol. 690, pp. 446-452, Apr. 6, 2017.

Shandle, Jack, and Goldberg, Lee, "Getting the Lead Out: European Initiative Will Have Global Impact,", TechOnLine, Oct. 4, 2004.

Shang, H. X., Gao, J. X., and Nichoson, P. I., "Thermal Stress Measurement of Solder Joints in BGA Packages: Theoretical and Experimental," 2008 ASME International Mechanical Engineering Congress and Exposition, Volume 6, Boston, MA, Oct. 31-Nov. 6, 2008, pp. 153-161.

Shang, Haixia, Gao, Jianxin, Nicholson, P. Ian, and Kenny, Steve, "An investigation of reliability of solder joints in microelectronic packages by high temperature moire method," Microelectronics Reliability, vol. 51 no. 5, pp. 994-1002, May 2011.

Shang, J. K., Zeng, Q. L., Zhang, L., and Zhu, Q. S., "Mechanical fatigue of Sn-rich Pb-free solder alloys," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 211-227, Mar. 2007.

Shang, P. J., Liu, Z. Q., Li, D. X., and Shang, J. K., "Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints," Scripta Materialia, vol. xx no. xx, pp. xx-xx, xxxx.

Shang, P. J., Liu, Z. Q., Li, D. X., and Shang, J. K., "Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (1 0 0) single crystal Cu," Scripta Materialia, vol. 59 no. 3, pp. 317-320, Aug. 2008.

Shang, P. J., Zhang, L., Liu, Z. Q., Tan, J., and Shang, J. K., "Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process," Microelectronics Reliability, vol. 53 no. 6, pp. 899-905, June 2013.

Shang, P. J., Liu, Z. Q., Pang, X. Y., Li, D. X., and Shang, J. K., "Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates," Acta Materialia, vol. 57 no. 16, pp. 4697-4706, Sept. 2009.

Shang, P. J., Liu, Z. Q., Li, D. X., and Shang, J. K., "Phase Identification of Intermetallic Compounds Formed during In-48Sn/Cu Soldering Reactions," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 597-600.

Shang, P. J., Liu, Z. Q., Li, D. X., and Shang, J. K., "TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface," Journal of Electronic Materials, vol. 38 no. 12, pp. 2579-2584, Dec. 2009.

Shang, P. J., Liu, Z. Q., Zhang, L., Li, D. X., and Shang, J. K., "TEM Study of Bi Segregation in the Interconnect of Eutectic Tin-Bismuth Solder and Copper," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Shang, Pan-Ju, Liu, Zhi-Quan, Li, Dou-Xing, and Shang, Jian-Ku, "Formation of Double-layer Cu3Sn in Solid-State Aging Process at the Interface of Eutectic SnBi Solder and (100) Single Crystal Cu," International Conference on Electronic Packaging Technology & High Density Packaging , Shanghai, China, July 28-31, 2008, pp. xx-xx.

Shang, Pan-Ju, Liu, Zhi-Quan, Li, Douxing, and Shang, Jian-Ku, "Orientation Relationships Among Sn/Cu6Sn5/Cu3Sn/(111)Cu in the Eutectic SnBi/(111)Cu Solder Joint," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 165-169.

Shang, Shengyan, Kunwar, Anil, Yao, Jinye, Wang, Yunpeng, Zhao, Ning, Huang, Mingliang, and Ma, Haitao, "All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles," Journal of Materials Science: Materials in Electronics , vol. 29 no. 18, pp. 15966-15972, Sept. 2018.

Shang, Shengyan, Kunwar, Anil, Wu, Yingchao, and Ma, Haitao, "Effects of Cu Nanoparticles Doped Flux on the Microstructure of IMCs between Sn Solder and Cu Substrate," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1577-1581.

Shang, Shengyan, Wang, Yanfeng, Wang, Yunpeng, Ma, Haitao, and Kunwar, Anil, "Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint," Microelectronic Engineering, vol. 208, pp. 47-53, Mar. 1, 2019.

Shang, Shengyan, Kunwar, Anil, Wang, Yanfeng, Qu, Lin, Ma, Haitao, and Wang, Yunpeng, "Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface," Journal of Materials Science: Materials in Electronics, vol. 30 no. 3, pp. 2872-2887, Feb. 2019.

Shang, Shengyan, Kunwar, Anil, Wang, Yanfeng, Yao, Jinye, Ma, Haitao, and Wang, Yunpeng, "Influence of Cu nanoparticles on Cu6Sn5 growth behavior at the interface of Sn/Cu solder joints," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 135-140.

Shang, Xiao-Hong, and Yan, Xiu-Ping, "Selective detection of trace lead in lead-free solder alloy by flow injection on-line solid-phase extraction using a macrocycle immobilized silica gel as sorbent coupled with hydride generation atomic fluorescence spectrometry," Journal of Analytical Atomic Spectrometry, vol. 22 no. 10, pp. 1284-1289, 2007.

Shang, Shengyan, Wu, Shaocheng, Feng, Tuo, Li, Weifeng, Wang, Yanfeng, Kunwar, Anil, Ma, Haoran, and Ma, Haitao, "Size effects on segregated growth kinetics of interfacial IMC between Sn solder and Cu substrate," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Shangguan, D., and Gao, G., "Lead-free and No-clean Soldering for Automotive Electronics," Soldering & Surface Mount Technology, vol. 9 no. 2, pp. 5-8, 1997.

Shangguan, Dongkai, "2006 Industry outlook," Global SMT & Packaging, vol. 5 no. 10, pp. 46, Nov. 2005.

Shangguan, Dongkai, "A Holistic Approach to Lead-Free Transition and Environmental Compliance," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 831-837.

Shangguan, Dongkai, "Analysis of crack growth in solder joints," Soldering & Surface Mount Technology, vol. 11 no. 3, pp. 27-32, 1999.

Shangguan, Dongkai, Achari, Achyuta, and Green, Wells, "Application of Lead-Free Eutectic Sn-Ag Solder in No-Clean Thick Film Electronic Modules," IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B, vol. 17 no. 4, pp. 603-611, Nov. 1994.

Shangguan, Dongkai, "Challenges and opportunities in lead-free solder PCB assembly," Global SMT & Packaging, vol. 2 no. 7, pp. 18-24, Oct. 2002.

Shangguan, Dongkai, "Challenges and opportunities in lead-free solder PCB assembly," Global SMT & Packaging, vol. 4 no. 9, pp. 11-14, Oct. 2004.

Shangguan, Dongkai, "Challenges in lead-free soldering," Global SMT and Packaging , vol. 6 no. 8, pp. 53, Sept. 2006.

Shangguan, Dongkai, "Electronics Packaging & Board Assembly: Technology Trend and Impact on the Supply Chain," 2005 Pan Pacific Symposium Conference Proceedings , Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Shangguan, Donkai, "Electronics Recycling and EOL Management," Surface Mount Technology , vol. 17 no. 11, pp. xx-xx, Nov. 2003.

Shangguan, Dongkai, "Environmental Leadership in Electronics Manufacturing: Lead-Free and Beyond," Proceedings of 2004 IEEE International Symposium on Electronics and the Environment, Phoenix, AZ, May 10-13, 2004.

Shangguan, Dongkai, and Achari, Achyuta, "Evaluation of Lead-Free Eutectic Sn-Ag Solder for Automotive Electronics Packaging Applications," Proceedings of the 16th IEEE/CPMT International Electronics Manufacturing Technology Symposium, La Jolla, CA, Sept. 12-14, 1994, pp. 25-37.

Shangguan, Dongkai, "Further study needed on backward compatibility," Global SMT & Packaging, vol. 6 no. 4, pp. 44, Apr. 2006.

Shangguan, Dongkai, "Industry Outlook 2006," Global SMT & Packaging, vol. 5 no. 10, pp. 46, Nov. 2005.

Shangguan, Dongkai, "iNEMA board assembly roadmap," Global SMT and Packaging, vol. 7 no. 2, pp. 64, Feb. 2007.

Shangguan, Dongkai, "Lead-free solder alloys," Global SMT and Packaging, vol. 7 no. 1, pp. 5, Jan. 2007.

Shangguan, Dongkai, and Achari, Achyuta, "Lead-Free Solder Development for Automotive Electronics Packaging Applications," Surface Mount International Proceedings of the Technical Program, San Jose, CA, Aug. 29-31, 1995, pp. 423-428.

Shangguan, Dongkai, "Lead-free solder interconnect reliability," Global SMT & Packaging, vol. 6 no. 2, pp. 19, Feb. 2006.

Shangguan, Dongkai, "Lead-free solder joint reliability," Global SMT & Packaging , vol. 5 no. 7, pp. 34, Aug. 2005.

Shangguan, Dongkai, "Lead Free Soldering and Environmental Compliance: Supply Chain Readiness & Challenges," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S09-03-1-S09-03-3.

Shangguan, Dongkai, "Lead-free transition and environmental compliance: challenges ahead for the industry," Global SMT & Packaging, vol. 4 no. 7 & 8, pp. 5-6, Aug./Sept. 2004.

Shangguan, Dongkai, "Leading the Lead-Free Transition," Circuits Assembly, vol. 15 no. 3, pp. 48, Mar. 2004.

Shangguan, Dongkai, "Managing Lead-Free Compatibility," Circuits Assembly, vol. 14 no. 11, pp. 30-33, Nov. 2003.

Shangguan, Dongkai, "Managing the Environmental Life Cycle of Electronics," Surface Mount Technology (SMT), vol. 19 no. 3, pp. 49, Mar. 2005.

Shangguan, Dongkai, "Packaging and Board Assembly Technology Trend and Impact on the Supply Chain," Proceedings of the Sixth IEEE/CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, June 30-July 3, 2004, pp. 14-17.

Shangguan, Dongkai, "Reworking Lead-free Solder in PCB Assembly," Surface Mount Technology (SMT), vol. 17 no. 6, pp. 38, June 2003.

Shangguan, Dongkai, "Study of Compatibility for Lead-Free Solder PCB Assembly," IPC and Soldertec Global Conference on Lead Free Electronics, Brussels, Belgium, June 11-12, 2003, pp. xx-xx.

Shangguan, Dongkai, "Supply Chain Impact of Lead-Free Soldering," 2005 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Shangguan, Dongkai, "Supply chain impact of lead-free soldering," Global SMT & Packaging, vol. 5 no. 1, pp. 8, Jan. 2005.

Shangguan, Dongkai, "Supply chain impact of lead-free soldering (II): PCB," Global SMT & Packaging, vol. 5 no. 2, pp. 9, 6, Feb. 2005.

Shangguan, Dongkai, "Supply chain impact of lead-free soldering (III): components" Global SMT & Packaging, vol. 5 no. 4, pp. 40, 42, Apr. 2005.

Shangguan, Dongkai, "Supply chain impact of lead-free soldering (III): components," Global SMT and Packaging, vol. 5 no. 5, pp. 38-39, May 2005.

Shangguan, Dongkai, "Supply chain readiness & challenges," Global SMT and Packaging , vol. 6 no. 1, pp. 44, 46, Dec. 2005-Jan. 2006.

Shangguan, Dongkai, "Supply Chain Readiness for Lead Free Soldering and Environmental Compliance," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Shangguan, Dongkai, "Thermal Study of Lead Free Reflow Soldering Processes," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies , San Jose, CA, Apr. 23-24, 2003, pp. 94-98.

Shangguan, Dongkai, "Voids in solder joints," Global SMT and Packaging, vol. 5 no. 8, pp. 47, Sept. 2005.

Shao, C. B., and Zhang, J. G., "Electric Contact Behavior of Cu-Sn Intermetallic Compound Formed in Tin Platings," Proceedings of the 44th Holm Conference on Electrical Contacts, Washington, D. C., Oct. 26-28, 1998, pp. 26-33.

Shao, Hangting, Li, Ming, and Hu, Anming, "The effect of Ag3Sn and Cu3Sn nanoparticles on the IMC morphology of Sn-3.0Ag-0.5Cu solder," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Shao, Hao, Zhang, Xuebin, Liu, Shasha, Chen, Fanyan, Xu, Jie, and Feng, Yi, "Preparation of pure iron nanofibers via electrospinning," Materials Letters, vol. 65 no. 12, pp. 1775-1777, June 30, 2011.

Shao, Huakai, Wu, Aiping, Bao, Yudian, Zhao, Yue, and Zou, Guisheng, "Interfacial reaction and mechanical properties for Cu/Sn/Ag system low temperature transient liquid phase bonding," Journal of Materials Science: Materials in Electronics, vol. 27 no. 5, pp. 4839-4848, May 2016.

Shao, Shuai, Mutuku, Francis, Arfaei, Babak, and Wilcox, Jim, "Effect of Solder Composition, PCB Surface Finish and Solder Joint Volume on Drop Shock Reliability," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 553-562.

Shao, T. L., Chen, T. S., Huang, Y. M., and Chen, Chih, "Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflow," Journal of Materials Research , vol. 19 no. 12, pp. 3654-3664, Dec. 2004.

Shao, T. L., Chen, I. H., and Chen, Chih, "Electromigration Failure Mechanism of Sn96.5Ag3.5 Flip-Chip Solder Bumps," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 979-982.

Shao, T. L., Chen, Y. H., Chiu, S. H., and Chen, Chih, "Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti/Cr-Cu/Cu and Ni(P)/Au metallization pads," Journal of Applied Physics, vol. 96 no. 8, pp. 4518-4524, Oct. 15, 2004.

Shao, T. L, Lin, K. C., and Chen, Chih, "Electromigration Studies of Flip Chip Sn95/Sb5 Solder Bumps on Cr/Cr-Cu/Cu Under-Bump Metallization," Journal of Electronic Materials, vol. xx no. xx, pp. xx-xx, Nov. 2003

Shao, T. L., Chiu, S. H., Chen, Chih, Yao, D. J., and Hsu, C. Y., "Thermal Gradient in Solder Joints under Electrical-Current Stressing," Journal of Electronic Materials, vol. 33 no. 11, pp. 1350-1354, Nov. 2004.

Shao, Yu-Hsiu, Chiu, Ying-Ta, Kao, Chin-Lin, and Yang, Ping-Feng, "The failure behavior of the fine pitch SnAg bump under current stressing," 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 22-24, 2014, pp. 150-153.

Shapiro, Andrew A., Tudryn, Carissa, Schatzel, Donald, and Tseng, Stephen, "Electronic Packaging Materials for Extreme, Low Temperature, Fatigue Environments," IEEE Transactions on Advanced Packaging, vol. 33 no. 2, pp. 408-420, May 2010.

Shapiro, Andrew A., Bonner, J. Kirk, Ogunseitan, Oladele A., Saphores, Jean-Daniel M., and Schoenung, Julie M., "Implications of Pb-Free Microelectronics Assembly in Aerospace Applications."

Shapiro, Andrew A., Bonner, J. Kirk, Ogunseitan, Oladele A., Saphores, Jean-Daniel M., and Schoenung, Julie M., "Implications of Pb-Free Microelectronics Assembly in Aerospace Applications," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 1., pp. 60-70, Mar. 2006.

Shapiro, Andrew A., "Out of this world electronic packaging," Chip Scale Review, vol. 19 no. 5, pp. 25-29, Sept.-Oct. 2015.

Shapiro, Andrew A., Bonner, J. Kirk, Ogunseitan, Oladele A., Saphores, Jean-Daniel M., and Schoenung, Julie M., "Pb-Free Microelectronics Assembly in Aerospace Applications," 2004 IEEE Aerospace Conference Proceedings, Volume 4, Mar. 6-13, 2004, pp. 2474-2485.

Shapiro, Lev, "Counterfeit Electronics: Threats, Risks and Prevention Practices," Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb. 10-12, 2009, pp. 28-32.

Shapiro, Lev, "RoHS and Lead-free: Are They the Same?," Surface Mount Technology .

Shapiro, Lev, "Technological Aspects of the RoHS Directive," SMT Web Exclusive Article.

Sharif, A., and Chan, Y. C., "Retardation of spalling by the addition of Ag in Sn-Zn-Bi solder with the Au/Ni metallization," Materials Science and Engineering: A, vol. 445-446, pp. 686-690, Feb. 15, 2007.

Sharif, Ahmed, and Chan, Y. C., "Comparative Study of Interfacial Reactions of Sn-Ag-Cu and Sn-Ag Solders on Cu Pads during Reflow Soldering," Journal of Electronic Materials , vol. 34 no. 1, pp. 46-52, Jan. 2005.

Sharif, Ahmed, and Chan, Y. C., "Dissolution kinetics of BGA Sn-Pb and Sn-Ag solders with Cu substrates during reflow," Materials Science and Engineering B: Solid-State Materials for Advanced Technology, vol. 106 no. 2, pp. 126-131, Jan. 25, 2004.

Sharif, Ahmed, Chan, Y. C., Islam, M. N, and Rizvi, M. J., "Dissolution of electroless Ni metallization by lead-free solder alloys," Journal of Alloys and Compounds, vol. 388 no. 1, pp. 75-82, Feb. 8, 2005.

Sharif, Ahmed, Chan, Y. C., and Wu, B. Y., "Effect of 3 wt.% Bi in Sn-Zn solder on the interfacial reactions with the Au/Ni metallization," 31st International Conference on Electronics Manufacturing and Technology, Kuala Lumpur, Malasia, Nov. 8-10, 2007, pp. 456-461.

Sharif, Ahmed, and Chan, Y. C., "Effect of indium addition in Sn-rich solder on the dissolution of Cu metallization," Journal of Alloys and Compounds, vol. 390, no. 1-2, pp. 67-73, Mar. 22, 2005.

Sharif, Ahmed, Chan, Y. C., and Zhong, H. W., "Effect of multiple reflows on mechanical strength of the interface formed between Sn-Zn-Bi solder and Au/Ni/Cu bond pad," Journal of Materials Research, vol. 22 no. 1, pp. 40-45, Jan. 2007.

Sharif, Ahmed, and Chan, Y. C., "Effect of Reaction Time on Mechanical Strength of the Interface Formed between the Sn-Zn(-Bi) Solder and the Au/Ni/Cu Bond Pad," Journal of Electronic Materials, vol. 35 no. 10, pp. 1812-1817, Oct. 2006.

Sharif, Ahmed, and Chan, Y. C., "Effect of substrate metallization on interfacial reactions and reliability of Sn-Zn-Bi solder joints," Microelectronic Engineering, vol. 84 no. 2, pp. 328-335, Feb. 2007.

Sharif, Ahmed, Islam, M. N., and Chan, Y. C., "Interfacial reactions of BGA Sn-3.5%Ag-0.5%Cu and Sn-3.5%Ag solders during high-temperature aging with Ni/Au metallization," Materials Science and Engineering B, vol. 113 no. 3, pp. 184-189, Nov. 15, 2004.

Sharif, Ahmed, and Chan, Y. C., "Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles," Journal of Materials Science: Materials in Electronics, vol. 16 no. 3, pp. 153-158, Mar. 2005.

Sharif, Ahmed, and Chan, Y. C., "Investigation of interfacial reactions between Sn-Zn solder with electrolytic Ni and electroless Ni(P) metallization," Journal of Alloys and Compounds , vol. 440 no. 1-2, pp. 117-121, Aug. 16, 2007.

Sharif, Ahmed, and Chan, Y. C., "Liquid and solid state interfacial reactions of Sn-Ag-Cu and Sn-In-Ag-Cu solders with Ni-P under bump metallization," Thin Solid Films, vol. 504 no. 1-2, pp. 431-435, May 10, 2006.

Sharif, Ahmed, Gan, Chee Lip, and Chen, Zhong, "Transient Liquid Phase Ag-based Solder Technology for High-temperature Packaging Applications," Journal of Alloys and Compounds, vol. 587, pp. 365-368, Feb. 25, 2014.

Sharif, R., Zhang, X. Q., Rahman, M. K., Shamaila, S., Chen, J. Y., Han, X. F., and Kim, Y. K., "Fabrication and Magnetization Reversal Processes for Co/Cu Multilayer Nanowires," IEEE Transactions on Magnetics, vol. 45 no. 10, pp. 4033-4036, Oct. 2009.

Shario, David S., Viszlay, David S., Moyer, Heather R., and Brooman, Eric W., "Overview of the Important Characteristics and Properties of Chromium Coatings," Proceedings AESF SUR/FIN '96, Cleveland, OH, June 10-13, 1996, pp. 389-400.

Sharma, A., Lim, D. W., Yim, S. H., Yoon, J. H., Yun, J. Hyun, Kim, K. H., Yoo, S. H., and Jung, J. P., "Effect of Nano-Particle on the Properties of Sn-3Ag-0.5Cu Solder," International Conference on Soldering & Reliability 2016 Proceedings , Toronto, Ontario, Canada, May 9-11, 2016, pp. xx-xx.

Sharma, Ashutosh, Das, Siddhartha, and Das, Karabi, "Effect of different electrolytes on the microstructure, corrosion and whisker growth of pulse plated tin coatings," Microelectronic Engineering , vol. 170, pp. 59-68, Feb. 25, 2017.

Sharma, Ashutosh, Sohn, Heung-Rak, and Jung, Jae Pil, "Effect of Graphene Nanoplatelets on Wetting, Microstructure, and Tensile Characteristics of Sn-3.0Ag-0.5Cu (SAC) Alloy," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 47 no. 1, pp. 494-503, Jan. 2016.

Sharma, Ashutosh, Kumar, Santosh, Jung, Do-Hyun, and Jung, Jae Pil, "Effect of high temperature high humidity and thermal shock test on interfacial intermetallic compounds (IMCs) growth of low alpha solders," Journal of Materials Science: Materials in Electronics, vol. 28 no. 11, pp. 8116-8129, June 2017.

Sharma, Ashutosh, Bhattacharya, Sumit, Das, Siddhartha, and Das, Karabi, "Fabrication of Sn-Ag/CeO2 Electro-Composite Solder by Pulse Electrodeposition," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 44 no. 12, pp. 5587-5601, Dec. 2013. https://doi.org/10.1007/s11661-013-1894-5

Sharma, Ashutosh, Bhattacharya, Sumit, Sen, Ranjan, Reddy, B. S. B., Fecht, H.-J., Das, Karabi, and Das, Siddhartha, "Influence of current density on microstructure of pulse electrodeposited tin coatings," Materials Characterization, vol. 68, pp. 22-32, June 2012.

Sharma, Ashutosh, Park, Young Min, Lee, Sangyeob, and Ahn, Byungmin, "Morphology, resistivity and corrosion behavior of tin coatings plated from citric acid bath," Materials Research Express, vol. 6 no. 11, pp. 116589-1-116589-10, Nov. 2019.

Sharma, Ashutosh, and Ahn, Byungmin, "Pulse plated Sn-Cu solder coatings from stannate bath," Soldering & Surface Mount Technology, vol. 32 no. 1, pp. 24-32, 2020.

Sharma, Ashutosh, Jang, Young-Joo, Kim, Jang Baeg, and Jung, Jae Pil, "Thermal cycling, shear and insulating characteristics of epoxy embedded Sn-3.0Ag-0.5Cu (SAC305) solder paste for automotive applications," Journal of Alloys and Compounds, vol. 704, pp. 795-803, May 15, 2017.

Sharma, Gaurav, Eichfeld, C. M., and Mohney, S. E., "Intermetallic Growth between Lead-Free Solders and Palladium," Journal of Electronic Materials, vol. 32 no. 11, pp. 1209-1213, Nov. 2003.

Sharma, Gaurav, and Kripesh, Vaidyanathan, "Kinetics of Intermetallic Growth between Lead-Free Solders and Silver-Palladium Metallizations," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 190-195.

Sharma, Monika, Kuanr, Bijoy K., Sharma, Manish, and Basu, Ananjan, "Relation Between Static and Dynamic Magnetization Effects and Resonance Behavior in Ni Nanowire Arrays," IEEE Transactions on Magnetics, vol. 50 no. 4, pt. 2, pp. xx-xx, Apr. 2014.

Sharma, P., Ganti, S., Dasgupta, A., and Loman, J., "Prediction of Rate-Independent Constitutive Behavior of Pb-Free Solders Based on First Principles," IEEE Transactions on Components and Packaging Technologies, vol. 26 no. 3, pp. 659-666, Sept. 2003.

Sharma, Priyanka, and Kumar, Vinod, "Current Technology of Supercapacitors: A Review," Journal of Electronic Materials, vol. 49 no. 6, pp. 3520-3532, June 2020.

Sharma, S., Kamins, T. I., Islam, M. S., Williams, R. Stanley, and Marshall, A. F., "Structural characteristics and connection mechanism of gold-catalyzed bridging silicon nanowires," Journal of Crystal Growth, vol. 280 no. 3-4, pp. 562-568, July 1, 2005.

Sharma, Umesh, Holland, Philip, Gee, Harry, Ozen, Metin, and Ozcan, Can, "A Reliable Wafer-Level Chip Scale Package Technology," Chip Scale Review, vol. 13 no. 2, pp. 26-30,32,34, Feb.-Mar. 2009.

Sharon, Gilad, and Tulkoff, Cheryl, "Temperature Cycling and Fatigue in Electronics," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 333-342.

Sharon, Gilad, and Caswell, Greg, "Temperature Cycling and Fatigue in Electronics," Advancing Microelectronics, vol. 42 no. 5, pp. 18-24, Sept./Oct. 2015.

Sharp, John, "IPC Material Declaration Guidelines Project," Proceedings 2004 AESF/EPA Conference for Environmental & Process Excellence, Orlando, FL, Jan. 26-29, 2004, pp. 132-140.

Sharp, John, "The IPC Material Declaration Handbook," Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, New Orleans, LA, May 16-19, 2005, pp. 167-172.

Sharpe, Kim, "RoHS Conversion for Medical Devices," Circuits Assembly, vol. 19 no. 11, pp. 26,28-33, Nov. 2008.

Sharpe, Kim, "RoHS Conversion for Medical Devices: Risks, Considerations and Company Impact Plus Several BOM Analysis Case Studies," 2008 Medical Electronics Symposium, Anaheim, CA, Jan. 29-31, 2008, pp. xx-xx.

Sharpe, Kim, "RoHS Conversion for Medical Devices: Risks, Considerations and Company Impact Plus Several BOM Analysis Case Studies," SMTAnews & Journal of Surface Mount Technology, vol. 21 no. 2, pp. 19-27, Apr.-June 2008.

Sharvin, G., "The Experimental Proof of the Non-Supraconductivity of Grey Tin Down to 1.32° K," Journal of Physics (USSR), vol. 9 no. 4, pp. 350-351, 1945.

Shaterabadi, Z., Soltanian, S., Koohbor, M., Salimi, A., and Servati, P., "Modification of microstructure and magnetic properties of electrodeposited Co nanowire arrays: A study of the effect of external magnetic field, electrolyte acidity and annealing process," Materials Chemistry and Physics, vol. 160, pp. 389-397, June 15, 2015.

Shaughnessy, Andy, "I'm From the Government and I'm Here to Help," PCB Update, May 26, 2006.

Shaughnessy, Andy, "Mentor Adds RoHS Compliance Function," Printed Circuit Design and Manufacture, vol. 22 no. 9, pp. 8, Sept. 2005.

Shaughnessy, Andy, "WEEE: The Other Directive," Printed Circuit Design and Manufacture , vol. 22 no. 6, pp. 4, June 2005.

Shaw, Anita, "Pitfalls and Progress for Electronics Finishing: Environmental legislation and offshore outsourcing are key issues driving the industry," Metal Finishing, vol. 103 no. 2, pp. 8-14, Feb. 2005.

Shaw, George, "Long-Term Performance of Cadmium Alternatives," Products Finishing , vol. 63 no. 5, pp. 66-81, Feb. 1999.

Shaw, George, "Optimizing Paint Durability, Part II," Products Finishing, vol. 69 no. 3, pp. 34-37, Dec. 2004.

Shaw, Harry, and Kadesch, Jong, "Reliability of Pb-free Solder Alloy Study," NASA, Dec. 30, 2006.

Shaw, J. M., Buchwalter, S. L., Gelorme, J. D., Hedrick, J. C., Kang, S. K., Kosbar, L. L., Lewis, D. A., Purushotham, S., Saraf, R., and Viehbeck, A., "Future Packaging Materials: Cost Performance, and Environmental Issues," Polymer Preprints (American Chemical Society), vol. 37 no. 1, pp. pp. 172-173, Mar. 1996.

Shaw, Jane M., Buchwalter, S. L., Hedrick, J. C., Kang, S. K., Kosbar, L. L., Gelorme, J. D., Lewis, D. A., Purushothaman, S., Saraf, R., and Viehbeck, A., "Big Blue Goes Green," Printed Circuit Fabrication, vol. 19 no. 11, pp. 38-40,42,44, Nov. 1996.

Shaygan, Mehrdad, Kheirabi, Nazli, Davami, Keivan, Mortazavi, Bohayra, Lee, Jeong-Soo, Cuniberti, Gianaurelio, and Meyyappan, M., "Annealing effect on the thermal conductivity of thermoelectric ZnTe nanowires," Materials Letters, vol. 135, pp. 87-91, Nov. 15, 2014.

She, Jia, and Zhan, Yongzhong, "High volume intermetallics reinforced Ti-based composites in situ synthesized from Ti-Si-Sn ternary system," Materials Science and Engineering: A , vol. 528 no. 10/11, pp. 3871-3875, Apr. 2011.

Shea, Chris, and Pandher, Ranjit S., "Optimizing Stencil Design for Lead-Free SMT Processing," Proceedings of the SMTA International Conference, Chicago, IL, Sept. 16-30, 2004, pp. xx-xx.

Shea, Chrys, "A Clean Start," Circuits Assembly, vol. 19 no. 10, pp. 39, Oct. 2008.

Shea, Chrys, Hozer, Leszek, and Kida, Hitoshi, "A Feasibility Study of 01005 Chip Components in a Lead-Free System," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 162-171.

Shea, Chrys, "A Small Perk," Circuits Assembly, vol. 18 no. 12, pp. 38, Dec. 2007.

Shea, Chrys, "Bare Board Concerns," Circuits Assembly, vol. 19. no. 3, pp. 67, Mar. 2008.

Shea, Chrys, Raut, Rahul, Chu, Quyen, Tokotch, Nicholas, and Wang, Paul, "BGA Solder Void Correlation to Via-in-pad, Via Fill, Surface Finish, and Lead-free Solder - A Preliminary Review," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Shea, Chrys, Raut, Rahul, Picchione, Lou, Chu, Quyen, Tokotch, Nicholas, and Wang, Paul, "BGA Solder Void Correlation to Via-in-Pad, Via Fill, Surface Finish, and Lead-Free Solder - A Preliminary Review, Part Three," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 381-392.

Shea, Chrys, Raut, Rahul, Picchione, Lou, Chu, Quyen, Tokotch, Nicholas, and Wang, Paul, "BGA Solder Void Correlation to Via-in-Pad, Via Fill, Surface Finish, and Lead-Free Solder - a Preliminary Review, Part Three," Route, Oct. 2006.

Shea, Chrys, Chu, Quyen, and Wang, Paul, "BGA Solder Void Correlation to Via-In-Pad, Via Fill, Surface Finish, and Lead-Free Solder - A Preliminary Review, Part Two," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Shea, Chrys, Raut, Rahul, Picchione, Lou, Chu, Quyen, Tokotch, Nicholas, and Wang, Paul, "BGA Solder Void Correlation to Via-in-Pad, Via Fill, Surface Finish, and Lead-Free Solder - Final Report," 2007 Pan Pacific Microelectronics Symposium & Exhibit, Maui, HI, Jan. 30-Feb. 1, 2007, pp. xx-xx.

Shea, Chrys, Wade, Greg, Leak, Esse, Tripp, Ron, and Burkhalter, Grant, "Characterizing Transfer Efficiencies and the Fine Feature Stencil Printing Process," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 59-64.

Shea, Chrys, Arora, Sanju, Brown, Steve, and Wong, Steven, "Considerations in Selecting Fluxes for Lead-Free Wave Soldering," 2007 Pan Pacific Microelectronics Symposium & Exhibit, Maui, HI, Jan. 30-Feb. 1, 2007, pp. xx-xx.

Shea, Chrys, Arora, Sanju, Brown, Steve, and Wong, Steven, "Considerations in Selecting Fluxes for Lead-Free Wave Soldering," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Shea, Chrys, Arora, Sanju, Brown, Steve, and Wong, Steven, "Considerations in Selecting Fluxes for Lead-Free Wave Soldering," SMTAnews & Journal of Surface Mount Technology, vol. 20 no. 3, pp. 29-37, July-Sept. 2007.

Shea, Chrys, "Constructing DoEs," Circuits Assembly, vol. 18 no. 4, pp. xx-xx, Apr. 2007.

Shea, Chrys, Kenny, Jim, Rasmussen, Jean, Wable, Girish, Chu, Quyen, Teng, Shiang, Sweatman, Keith, and Nogita, Kazuhiro, "Copper Erosion: The Influence of Metallurgy on Copper Dissolution," Printed Circuit Design and Fab, vol 25 no. 10, pp. 35-37, Oct. 2008.

Shea, Chrys, and Ormerod, David, "Copper Via Fill - A Solution for HDI Via-in-Pad," Printed Circuit Design and Manufacture, vol. 24 no. 10, pp. 24, 26, 28-30, Oct. 2007.

Shea, Chrys, "Erasing Fab Problems," Circuits Assembly, vol. 19. no. 5, pp. 42, May 2008.

Shea, Chrys, "Fab Workarounds, Part 2," Circuits Assembly, vol. 19. no. 6, pp. 39, June 2008.

Shea, Chrys, "Fictions of Pb-Free Surface Mounting," Circuits Assembly, vol. 18 no. 5, pp. 42, 46, May 2007.

Shea, Chrys, "Halogens and Halides," Circuits Assembly, vol. 19 no. 1, pp. 42-43, Jan. 2008.

Shea, Chrys, "Head-In-Pillow and Hybrid Solder Pastes," Circuits Assembly, vol. 19 no. 12, pp. 37-38, Dec. 2008.

Shea, Chrys, "HOP-ping Mad," Circuits Assembly, vol. 19 no. 7, pp. 72-73, July 2008.

Shea, Chrys, "Hot Over Preheat," Circuits Assembly, vol. 18 no. 8, pp. 36, 38-39, Aug. 2007.

Shea, Chrys, "Lead-Free Lessons Learned: Surface Mount Technology (Tutorial 3)," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009.

Shea, Chrys, "Lead-Free Lessons Learned: Wave Soldering," Shea Engineering Services, 2009.

Shea, Chrys, "Lead Free Wave Soldering - Differences in Alloy Behavior Create Different Soldering Processes," IPC Review, vol. 48 no. 1, pp. 14-15, Jan. 2007.

Shea, Chrys, and Howell, Keith, "Lead-Free Wave Soldering - Tighter Process Windows Need Tighter Process Controls," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 494-500.

Shea, Chrys, "Lead Spread," Circuits Assembly, vol. 18 no. 6, pp. 57, 59, June 2007.

Shea, Chrys, Pandher, Ranjit, Hubbard, Ken, Ramakrishna, Gnyaneshwar, Syed, Ahmer, Henshall, Greg, Chu, Quyen, Tokatch, Nick, Escuro, Lorraine, Lapitan, Mike, Ta, Gary, Babasa, Anthony, and Wable, Girish, "Low-Silver BGA Assembly Phase I - Reflow Considerations and Joint Homogeneity Initial Report," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S26:02.

Shea, Chrys, Pandher, Ranjit, Hubbard, Ken, Ramakrishna, Gnyaneshwar, Syed, Ahmer, Henshall, Greg, Chu, Quyen, Tokotch, Nick, Escuro, Lorraine, Lapitan, Mike, Ta, Gary, Babaa, Anthony, and Wable, Girish, "Low-Silver BGA Assembly Phase I - Reflow Considerations and Joint Homogeneity - Initial Report," International Conference on Soldering and Reliability , Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Shea, Chrys, Pandher, Ranjit, Hubbard, Ken, Ramakrishna, Gnyaneshwar, Syed, Ahmer, Henshall, Greg, Chu, Quyen, Tokatch, Nick, Escuro, Lorraine, Lapitan, Mike, Ta, Gary, Babasa, Anthony, and Wable, Girish, "Low-Silver BGA Assembly Phase I - Reflow Considerations and Joint Homogeneity Second Report: SAC105 Spheres with Tin-Lead Paste," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 424-434.

Shea, Chrys, Lapitan, M., Santos, M., Doxtad, E., Babasa, A., Solon, J., Chu, Q., Wable, G., Hubbard, Ken, Ramakrishna, Gnyaneshwar, Pandher, Ranjit, Syed, Ahmer, and Henshall, Gregory, "Low-Silver BGA Assembly Phase II - Reflow Considerations and Joint Homogeneity Fourth Report: Sensitivity to Process Variations," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 105-115.

Shea, Chrys, Lee, Dale, and Jean, Denis, "Microvia-in-Pad: Possible Outcomes and Solutions," Circuits Assembly, vol. 18 no. 2, pp. 44-47, Feb. 2007.

Shea, Chrys, and Pandher, Ranjit S., "Optimizing Stencil Design for Lead-Free SMT Processing," SMTA Journal , vol. 18 no. 1, pp. 11-18, Jan. 2005.

Shea, Chrys, "Pb-Free Lemons? Don't Be Suckered," Circuits Assembly, vol. 19 no. 11, pp. 42, Nov. 2008.

Shea, Chrys, Barton, Bruce, Belmonte, Joe, and Kirby, Ken, "Practical Lead-Free Implementation," IPC APEX/EXPO 2005, Anaheim, CA, Feb. 22-24, 2005, pp. xx-xx.

Shea, Chrys, and Luke, Tim, "Process Considerations in Transitioning RoHS-Exempt Electronic Assemblies to Lead-Free Processes," 2007 Medical Electronics Symposium, Minneapolis, MN, May 1-3, 2007, pp. xx-xx.

Shea, Chrys, "Revisiting Rework," Circuits Assembly, vol. 20 no. 4, pp. 34-35, Apr. 2009.

Shea, Chrys, Arora, Sanju, and Brown, Steve, "Selection of Wave Soldering Fluxes for Lead Free Assembly," Circuitnet.

Shea, Chrys, "Stencil design for lead-free SMT assembly," EMasia, Mar. 2006.

Shea, Chrys, "Stencil Design for Lead-Free SMT Assembly," Circuitnet.

Shea, Chrys, "The Disappearing Defects," Circuits Assembly, vol. 18 no. 10, pp. 44, 62, Oct. 2007.

Shea, Chrys, Raut, Rahul, Chu, Quyen, Tokotch, Nicholas, and Wang, Paul, "The Effect of Filling Via-In-Pad on Voiding Rates in PWB Assembly for BGA Components," APEX 2007.

Shea, Chrys, "The Impact of RoHS on COMPLEX PCBs," Printed Circuit Design and Manufacture, vol. 23 no. 10, pp. 18, 20-23, Oct. 2006.

Shea, Chrys, Kenny, Jim, Rasmussen, Jean, Wable, Girish, Chu, Quyen, Teng, Shiang, Sweatman, Keith, and Nogita, Kazuhiro, "The Influence of the PWB Fabrication Electrodesposition Process on Copper Erosion During Wave Soldering," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 147-167.

Shea, Chrys, Kenny, Jim, Rasmussen, Jean, Wable, Girish, Chu, Quyen, Teng, Shiang, Sweatman, Keith, and Nogita, Kazuhiro, "The Influence of the PWB Fabrication Electrodeposition Process on Copper Erosion During Wave Soldering," 2008 Pan Pacific Microelectronics Symposium & Exhibit, Kauai, HI, Jan. 22-24, 2008, pp. xx-xx.

Shea, Chrys, Kenny, Jim, Rasmussen, Jean, Wable, Girish, Chu, Quyen, Teng, Shiang, Sweatman, Keith, and Nogita, Kazuhiro, "The Influence of the PWB Fabrication Electrodisposition Process on Copper Erosion During Wave Soldering Second Report, 4 Lead-Free Alloys," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 255-275.

Shea, Chrys, "The New `Mixed Technology' PCB," Circuits Assembly, vol. 18 no. 7, pp. 58-59, July 2007.

Shea, Chrys, "There's Something about Copper," Circuits Assembly, vol. 19 no. 9, pp. 52, Sept. 2008.

Shea, Chrys, "Wave Soldering DoE a DfM Dream," Circuits Assembly, vol. 20 no. 1, pp. 42, Jan. 2009.

Shea, Chrys, "Wave Soldering Facts and Fiction," Circuits Assembly, vol. 18 no. 1, pp. 58, Jan. 2007.

Shea, Chrys, Arora, Sanju, and Brown, Steve, "Wave Soldering Flux Selection for Pb-Free Assembly," Circuits Assembly, vol. 18 no. 3, pp. 36-39, Mar. 2007.

Shea, Chrys, "Wave Soldering Myths, Part 2," Circuits Assembly, vol. 18 no. 2, pp. 93, 103, Feb. 2007.

Shea, Dan, "Guess What? There Are No Exemptions to RoHS Legislation!," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Shea, Dan, "The Greening of Electronics," Circuits Assembly, vol. 17 no. 7, pp. 24, 27, July 2006.

Shea, Dan, "The GREENING of Electronics," Printed Circuit Design and Manufacture, vol. 23 no. 9, pp. 32-33, Sept. 2006.

Shea, Dan, "The Road to RoHS," emcnow, Mar. 2, 2005.

Shea, Erin J., "Exemption to the rule," emsnow, Apr. 18, 2008.

Shea, Erin J., "Global influences - the impact of REACH is complex, but not insurmountable," emsnow, May 13, 2008.

Shears, A. P., "Zinc-cobalt deposits from an acid chloride electrolyte," Transactions of the Institute of Metal Finishing, vol. 67 no. 3, pp. 67-69, Aug. 1989.

Shedd, Kim B., "Cobalt," Minerals Yearbook: Volume I. -- Metals and Minerals , 2002.

Sheehan, Aideen, "TV and fridge dumpers face threat of 15m fine," Irish Independent , Apr. 28, 2005.

Sheen, M. T., Chang, C. M., H. Teng, C., Kuang, J. H., C. Hsieh, and Cheng, W. H., "The Influence of Thermal Aging on Joint Strength and Fracture Surface of Pb/Sn and Au/Sn Solders in Laser Diode Packages," Journal of Electronic Materials, vol. 31 no. 8, pp. 895-902, Aug. 2002.

Sheen, M. T., Ho, Y. H., Wang, C. L., Hsieh, K. C., and Cheng, W. H., "The Joint Strength and Microstructure of Fluxless Au/Sn Solders in InP-Based Laser Diode Packages," Journal of Electronic Materials, vol. 34 no. 10, pp. 1318-1323, Oct. 2005.

Shell, Don, "MSD Protection Steps Per J-STD-033B.1," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 11, pp. 34,36-37, Nov. 2010.

Shemenski, R. M., Beck, F. H., and Fontana, M. G., "Orientation-Dependent Dissolution of Iron Whiskers," Journal of Applied Physics, vol. 36 no. 12, pp. 3909-3916, Dec. 1965.

Shen, Chaobo, Hai, Zhou, Zhao, Cong, Zhang, Jiawei, Evans, John L., and Bozack, M. J., "The Effect of Isothermal Aging on the Reliability of Sn-Ag-Cu Solder Joints Using Various Surface Finishes," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 992-999.

Shen, Guan-Hung, and Hong, Franklin Chau-Nan, "Ultraviolet photosensors fabricated with Ag nanowires coated with ZnO nanoparticles," Thin Solid Films, vol. 570 pt. B, pp. 363-370, Nov. 3, 2014.

Shen, J., and Chan, Y. C., "Effect of metal/ceramic nanoparticle-doped fluxes on the wettability between Sn-Ag-Cu solder and a Cu layer," Journal of Alloys and Compounds, vol. 477 no. 1-2, pp. 909-914, May 27, 2009.

Shen, J., and Chan, Y. C., "Effects of ZrO2 nanoparticles on the mechanical properties of Sn-Zn solder joints on Au/Ni/Cu pads," Journal of Alloys and Compounds, vol. 477 no. 1-2, pp. 552-559, May 27, 2009.

Shen, J., Liu, Y. C., Han, Y. J., Tian, Y. M., and Gao, H. X., "Erratum to "Strengthening effects of ZrO2 nanoparticles on the microstructure and microhardness of Sn-3.5Ag lead-free solder"," Materials Science and Engineering: A, vol. 476 no. 1-2, pp. 378, May 15, 2008.

Shen, J., Liu, Y. C., Gao, H. X., Wei, C., and Yang, Y. Q., "Formation of Bulk Ag3Sn Intermetallic Compounds in Sn-Ag Lead-Free Solders in Solidification," Journal of Electronic Materials, vol. 34 no. 12, pp. 1591-1597, Dec. 2005.

Shen, J., Liu, Y. C., and Gao, H. X., "Formation of bulk Cu6Sn5 intermetallic compounds in Sn-Cu lead-free solders during solidification," Journal of Materials Science, vol. 42 no. 14, pp. 5375-5380, July 2007.

Shen, J., Chan, Y. C., and Liu, S. Y., "Growth mechanism of bulk Ag3Sn intermetallic compounds in Sn-Ag solder during solidification," Intermetallics, vol. 16 no. 9, pp. 1142-1148, Sept. 2008.

Shen, J., Chan, Y. C., and Liu, S. Y., "Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction," Acta Materialia, vol. 57 no. 17, pp. 5196-5206, Oct. 2009.

Shen, J., Liu, Y. C., and Gao, H. X., "In situ nanoparticulate-reinforced lead-free Sn-Ag composite prepared by rapid solidification," Journal of Materials Science: Materials in Electronics, vol. 18 no. 4, pp. 463-468, Apr. 2007.

Shen, J., and Chan, Y. C., "Research advances in nano-composite solders," Microelectronics Reliability, vol. 49 no. 3, pp. 223-234, Mar. 2009.

Shen, J., Liu, Y. C., Han, Y. J., Tian, Y. M., and Gao, H. X., "Strengthening Effects of ZrO2 Nanoparticles on the Microstructure and Microhardness of Sn-3.5Ag Lead-Free Solder," Journal of Electronic Materials, vol. 35 no. 8, pp. 1672-1679, Aug. 2006.

Shen, J., Liu, Y. C., Han, Y. J., Tian, Y. M., and Gao, H. X., "Strengthening effects of ZrO2 nanoparticles on the microstructure and microhardness of Sn-3.5Ag lead-free solder," Materials Science and Engineering: A, vol. 441 no. 1-2, pp. 135-141, Dec. 15, 2006.

Shen, Jun, Cao, Zhongming, Zhai, Dajun, Zhao, Mali, and He, Peipei, "Effect of isothermal aging and low density current on intermetallic compound growth rate in lead-free solder interface," Microelectronics Reliability , vol. 54 no. 1, pp. 252-258, Jan. 2014.

Shen, Jun, Liu, Yong-Chang, Han, Ya-Jing, Gao, Hou-Xiu, Wei, Chen, and Yang, Yu-Qin, "Effects of cooling rates on microstructure and microhardness of lead-free Sn-3.5%Ag solders," Transactions of Nonferrous Metals Society of China , vol. 16 no. 1, pp. 59-64, Feb. 2006.

Shen, Jun, Pu, Yayun, Yin, Henggang, and Tang, Qin, "Effects of Cu, Zn on the Wettability and Shear Mechanical Properties of Sn-Bi-Based Lead-Free Solders," Journal of Electronic Materials, vol. 44 no. 1, pp. 532-541, Jan. 2015.

Shen, Jun, Pu, Yayun, Wu, Dong, Tang, Qin, and Zhao, Mali, "Effects of minor Bi, Ni on the wetting properties, microstructures, and shear properties of Sn-0.7Cu lead-free solder joints," Journal of Materials Science: Materials in Electronics, vol. 26 no. 3, pp. 1572-1580, Mar. 2015.

Shen, Jun, Pu, Yayun, Yin, Henggang, Luo, Dengjun, and Chen, Jie, "Effects of minor Cu and Zn additions on the thermal, microstructure and tensile properties of Sn-Bi-based solder alloys," Journal of Alloys and Compounds, vol. 614, pp. 63-70, Nov. 25, 2014.

Shen, Jun, He, Peipei, Zhang, Tao, Li, Yang, Pu, Yayun, and Chen, Jie, "The effects of Mn powder additions on the microstructures and tensile property of SnAgCu/Cu solder joints," Journal of Materials Science: Materials in Electronics, vol. 25 no. 11, pp. 4779-4785, Nov. 2014.

Shen, Jun, Wu, Cuiping, and Li, Shizeng, "Effects of rare earth additions on the microstructural evolution and microhardness of Sn30Bi0.5Cu and Sn35Bi1Ag solder alloys," Journal of Materials Science: Materials in Electronics, vol. 23 no. 1, pp. 156-163, Jan. 2012.

Shen, Jun, Liu, Yongchang, Han, Yajing, Zhang, Peizhen, and Gao, Houxiu, "Formation of Bulk Intermetallic Compound Ag3Sn in Slowly-Cooled Lead-Free Sn-4.0 wt pct Ag Solders," Journal of Materials Science and Technology , vol. 21 no. 6, pp. 827-830, Nov. 2005.

Shen, Jun, Zhai, Dajun, Cao, Zhongming, Zhao, Mali, and Pu, Yayun, "Fracture Behaviors of Sn-Cu Intermetallic Compound Layer in Ball Grid Array Induced by Thermal Shock," Journal of Electronic Materials, vol. 43 no. 2, pp. 567-578, Feb. 2014.

Shen, Jun, Zhao, Mali, He, Peipei, and Pu, Yayun, "Growth behaviors of intermetallic compounds at Sn-3Ag-0.5Cu/Cu interface during isothermal and non-isothermal aging," Journal of Alloys and Compounds, vol. 574, pp. 451-458, Oct. 15, 2013.

Shen, Jun, Peng, Changfei, Yin, Heng Gang, and Chen, Jie, "Influence of minor POSS molecules additions on the microstructure and hardness of Sn3Ag0.5Cu-xPOSS composite solders," Journal of Materials Science: Materials in Electronics, vol. 23 no. 9, pp. 1640-1646, Sept. 2012.

Shen, Jun, Tang, Qin, Pu, Yayun, Zhai, Dajun, Cao, Zhongming, and Chen, Jie, "Influence of POSS nano-particles on Sn-3.0Ag-0.5Cu-xPOSS/Cu composite solder joints during isothermal aging," Journal of Materials Science: Materials in Electronics, vol. 24 no. 12, pp. 4881-4887, Dec. 2013.

Shen, Jun, Peng, Changfei, Zhao, Mali, and Wu, Cuiping, "Microstructural evolutions of the Ag nano-particle reinforced SnBiCu-xAg/Cu solder joints during liquid aging," Journal of Materials Science: Materials in Electronics, vol. 23 no. 7, pp. 1409-1414, July 2012.

Shen, Jun, Liu, Yongchang, Han, Yajing, and Gao, Houxiu, "Microstructure and mechanical properties of Lead-free Sn-Cu solder composites prepared by rapid directional solidification," Journal of Materials Science: Materials in Electronics, vol. 18 no. 12, pp. 1235-1238, Dec. 2007.

Shen, Jun, Liu, Yongchang, Wang, Dongjiang, and Gao, Houxiu, "Nano ZrO2 Particulate-reinforced Lead-Free Solder Composite," Journal of Materials Science and Technology, vol. 22 no. 4, pp. 529-532, July 2006.

Shen, Jun, Lai, Shiqiang, Liu, Yongchang, Gao, Houxiu, and Wei, Jun, "The effects of third alloying elements on the bulk Ag3Sn formation in slowly cooled Sn-3.5Ag lead-free solder," Journal of Materials Science: Materials in Electronics, vol. 19 no. 3, pp. 275-280, Mar. 2008.

Shen, Li, Xu, Guangchen, Zhao, Ran, and Guo, Fu, "Interfacial Reaction Between the Thermopile Materials and Eutectic Sn-Based Solders," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 1171-1175.

Shen, Linlin, Chen, Cong, and Niu, Xiaoyan, "Random vibration analysis of BGA with different size of the SAC0307 solder joint," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 1019-1021.

Shen, Lu, Lu, Pin, Wang, Shijie, and Chen, Zhong, "Creep behaviour of eutectic SnBi alloy and its constituent phases using nanoindentation technique," Journal of Alloys and Compounds, vol. 574, pp. 98-103, Oct. 15, 2013.

Shen, Lu, Wu, Yuanyuan, Wang, Shijie, and Chen, Zhong, "Creep behavior of Sn-Bi solder alloys at elevated temperatures studied by nanoindentation," Journal of Materials Science: Materials in Electronics , vol. 28 no. 5, pp. 4114-4124, Mar. 2017.

Shen, Lu, Septiwerdani, Pradita, and Chen, Zhong, "Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation," Materials Science and Engineering: A, vol. 558, pp. 253-258, Dec. 15, 2012.

Shen, Lu, Tan, Zheng Yu, and Chen, Zhong, "Nanoindentation study on the creep resistance of SnBi solder alloy with reactive nano-metallic fillers," Materials Science and Engineering: A , vol. 561, pp. 232-238, Jan. 20, 2013.

Shen, Lu, Xiao, Youming, Vileno, Elizabeth, Ma, Ying, Suib, Steven L., Galasso, Francis S., Freihaut, James D., and Hardwick, Steven J., "Nanosize Silicon Whiskers Produced by Chemical Vapor Deposition: Active Getters for NF3," Chemistry of Materials, vol. 7 no. 5, pp. 961-968, May 1995.

Shen, Ping, Yang, Jun, Wang, Yi, Guo, Ruifen, and Jiang, Qichuan, "Effect of structural transition in an amorphous Ni80P20 alloy on the wetting by a eutectic Sn-Bi solder," Journal of Materials Science, vol. 49 no. 7, pp. 2932-2942, Apr. 2014.

Shen, Xiaohu, Jin, Hao, Dong, Shurong, Wong, Hei, Zhou, Jian, Guo, Zhaodi, and Wang, Demiao, "Effects of High-Temperature Treatment on the Reaction Between Sn-3%Ag-0.5%Cu Solder and Sputtered Ni-V Film on Ferrite Substrate," Journal of Electronic Materials, vol. 41 no. 11, pp. 3145-3151, Nov. 2012.

Shen, Y.-L., and Aluru, K., "Numerical study of ductile failure morphology in solder joints under fast loading conditions," Microelectronics Reliability, vol. 50 no. 12, pp. 2059-2070, Dec. 2010.

Shen, Yidong, Hu, Anming, Chen, Xi, Li, Ming, and Mao, Dali, "Interfacial Reactions and Reliability of Sn-Zn-Bi-XCr Solder Joints with Cu Pads," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Shen, Yingming, Qi, Fangjuan, Xie, Min, and Li, Jian, "The Effect of Nano-Cu Particles on Mechanical Properties of Micro-Joining Joint with Lead-Free Solder," Advanced Materials Research, vol. 291-294, pp. 929-933, 2011.

Shen, Yu-An, and Chen, Chih, "Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration," Scripta Materialia, vol. 128, pp. 6-9, Feb. 2017.

Shen, Yu-An, Ouyang, Fan-Yi, and Chen, Chih, "Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps," Materials Letters , vol. 236, pp. 190-193, Feb. 1, 2019.

Shen, Yu-An, and Chen, Chih, "Effect of Sn Grain Orientation on the Formation of Cu6S5 Intermetallic Compounds during Electromigration," 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 26-28, 2016, pp. 85-86.

Shen, Yu-An, Zhou, Shiqi, Li, Jiahui, Tu, K. N., and Nishikawa, Hiroshi, "Microstructure and Property Changes in Cu/Sn-58Bi/Cu Solder Joints during Thermomigration," 2019 IEEE 69th Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2019, pp. 2003-2008.

Shen, Yu-Lin, Song, Jenn-Ming, and Su, Chien-Wei, "Nanoindentation analysis of interfacial IMCs in electronic solder joints," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 88-90.

Shen, Zhenzhen, Fang, Kun, Johnson, R. Wayne, and Hamilton, Michael C., "Characterization of Bi-Ag-X Solder for High Temperature SiC Die Attach," IEEE Transactions on Components, Packaging, and Manufacturing Technology , vol. 4 no. 11, pp. 1778-1784, Nov. 2014.

Shen, Zhenzhen, Xu, Teng, Johnson, R. Wayne, and Hamilton, Michael C., "Lead-Free Solder for Assembly of Thick-Film Hybrid Modules for Use in High-Temperature Applications," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 6 no. 3, pp. 373-382, Mar. 2016.

Shenai, Krishna, Singh, Prabjit J., Rao, Surya, Sorenson, Dale, Chu, King, and Gaylon, George, "Power Supply Design for Performance and Reliability," Proceedings of the IEEE 2000 National Aerospace and Electronics Conference, Oct. 10-12, 2000, pp. 524-531.

Sheng, George T. T., Hu, C. F., Choi, W. J., Tu, K. N., Bong, Y. Y., and Nguyen, Luu, "Tin whiskers studied by focused ion beam imaging and transmission electron microscopy," Journal of Applied Physics, vol. 92 no. 1, pp. 64-69, July 1, 2002.

Sheng, Lu, and Chenggang, Wei, "Effect of Mg on the Microstructure and Properties of Sn-Ag-Cu Lead-free Solder," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Sheng, Peter P., and Etsell, Thomas H., "Recovery of gold from computer circuit board scrap using aqua regia," Waste Management and Research, vol. 25 no. 4, pp. 380-383, Aug. 2007.

Shenq, Wong Wing, "Statistical Analysis of IMC Count Variant with Difference Soldering Reflow Profiles and Solder Ball Size," 31st International Conference on Electronics Manufacturing and Technology, Kuala Lumpur, Malasia, Nov. 8-10, 2007, pp. 253-256.

Sheng, Yang-yang, Yan, Yan-fu, Han, Cun-cang, Tang, Kun, Zhao, Kuai-le, and Xu, Zhi-wei, "Effect of the LaNd Addition on Melting Point and Spreading Properties of Bi5Sb8Sn Solder Alloy," Materials Science Forum, vol. 686, pp. 488-493, June 2011.

Sheng, Yangyang, Yan, Yanfu, Zhao, Kuaile, and Xu, Zhiwei, "Effects of Different Fluxes on the Spreadability of Zn-20Sn Solders," Advanced Materials Research, vol. 337, pp. 546-549, 2011.

Shepherd, Dominique, Hagwood, Charles, and Fields, Richard, "Evaluation of the Elevated Temperature Creep Strength of Three Lead-Free Solder Alloys in Soldered Joints," Journal of Testing and Evaluation , vol. 29 no. 4, pp. 380-386, July 2001.

Shepherd, Jennifer, "Design for Environment: Europe's Hazardous Substances Restrictions and HVAC." ASHRAE Journal, vol. 49 no. 6, pp. 60-61,63, June 2007.

Shepherd, Jennifer, "Lead-Free: Putting the Fun in Cross-Functional," Lead-Free Magazine , vol. 3, Feb. 2005.

Sherman, Lilli Manolis, "Organic PVC Stabilizers Move from Europe to U.S.," Plastics Technology, vol. xx no. xx, pp. xx-xx, Apr. 2005.

Sherman, Lilli Manolis, "PVC heat stabilizers," Plastics Technology, vol. xx no. xx, pp. xx-xx, Feb. 1994.

Sherrington, D., and Kohn, W., "Speculations about Grey Tin," Reviews of Modern Physics, vol. 40 no. 4, pp. 767-769, Oct. 1968.

Sherwood, Bert J., "Hexavalent Chrome and the Permissible Exposure Limit (PEL) in Plating," Metal Finishing, vol. 104 no. 7/8, pp. 103-104, July/Aug. 2006.

Shetty, M. N., "Surface Steps on Copper Whiskers," Journal of Crystal Growth, vol. 5 no. 3, pp. 210-212, June 1969.

Shev, Elliot, Wycoff, Brian, and Saumur, Michelle, "Issues in Outsourcing Pb-Free Prototypes," Circuits Assembly , vol. 16 no. 5, pp. 39, May 2005.

Shev, Elliot L., "Key Issues in Supporting Lead-Free and Complex Prototypes in the Electronics Manufacturing Services Environment," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 750-753.

Shevyrtalov, S., Zhukov, A., Zhukova, V., and Rodionova, V., "Internal stresses influence on magnetic properties of Ni-Mn-Ga Heusler-type microwires," Intermetallics, vol. 94, pp. 42-46, Mar. 2018.

Shi, Daniel, Fan, Xuejun, and Xie, Bin, "A New Method for Equivalent Acceleration of JEDEC Moisture Sensitivity Levels," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 907-912.

Shi, Frank G., Abdullah, Mikrajuddin, Chungpaiboonpatana, Surasit, Okuyama, Kikuo, Davidson, Craig, and Adams, Joseph M., "Electrically Anisotropic Conductive Adhesives: A New Model for Conduction Mechanism," 1999 International Symposium on Advanced Packaging Materials, Braselton, GA, Mar. 14-17, 1999, pp. 163-168.

Shi, Ge, Bie, Xiaorui, An, Tong, and Qin, Fei, "Copper Pillar Bump Design Optimization Based on Taguchi Method," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 1108-1111.

Shi, GuangHua, Bao, ShengXiang, Li, Peng, Lai, Weiming, and Rao, Zhenzhen, "Investigation on Soldering Reliability in Terminal Electrodes of MLCC," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 783-786.

Shi, Guihua, Shou, Ming, and Lu, Hua, "SAC and SnPb Solder Joint Thermal Stress and Strain Characterization for Resistor Packages," 2004 SMTA International Conference Proceedings , Chicago, IL, Sept. 26-30, 2004, pp. 463-471.

Shi, H. C., and Xian, A. P., "Effect of Organic Acid in Isopropyl Alcohol Fluxes on Wetting of Sn-Bi Solder on Cu Surface," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 163-167.

Shi, Helen, Zhou, Ming, and Lu, Hua, "Thermo-mechanical Stress-Strain Hysteresis In Lead-Free (SAC) and Eutectic Tin-Lead Solder Joints," International Conference on Lead-free Soldering , Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Shi, Hongbin, Tian, Cuihua, Yu, Daquan, and Ueda, Toshitsusgu, "A Comprehensive Analysis of the Thermal Cycling Reliability of Lead-Free Chip Scale Package Assemblies with Various Reworkable Board-Level Polymeric Reinforcement Strategies," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 959-970.

Shi, Hongbin, Tian, Cuihua, Pecht, Michael, and Ueda, Toshitsuga, "Board-Level Shear, Bend, Drop and Thermal Cycling Reliability of Lead-Free Chip Scale Packages with Partial Underfill: A Low-Cost Alternative to Full Underfill," 2012 IEEE 14th Electronics Packaging Technology Conference , Singapore, Singapore, Dec. 5-7, 2012, pp. 774-785.

Shi, Hongbin, and Ueda, Toshitsugu, "Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test," Microelectronics Reliability, vol. 51 no. 9-11, pp. 1898-1902, Sept. 2011.

Shi, Hongbin, and Ueda, Toshitsugu, "Effects of Edge and Corner Bond Adhesives on the Drop Reliability of Package-on-Package Bottom Package Assemblies," 2011 3rd International Conference on Computer Research and Development, Shanghai, China, Mar. 11-13, 2011, pp. 416-420.

Shi, Hongbin, and Ueda, Toshitsugu, "Halogen-free and Reworkable Corner Bond Adhesive for Array-based Packages and the Impact on Board-level Solder Joint Reliability," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 108-113.

Shi, Hongbin, and Ueda, Toshitsugu, "Investigation of Various Board-level Underfills and Adhesives for CTBGA Bend Performance Enhancements in Lead-free Portable Electronic Products," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 91-96.

Shi, Hong-Bin, and Ueda, Toshitsugu, "Mitigation of Thermal Fatigue Failure in Fully Underfilled Lead-free Array-based Package Assemblies Using Partial Underfills," 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 7-9, 2011, pp. 542-547.

Shi, Hongbin, Tian, Cuihua, Pecht, Michael, and Ueda, Toshitsugu, "Polymeric Reinforcement Approaches and Materials Selection to Improve Board-Level Drop Reliability of SnAgCu Soldered Area Array Packages," 2012 IEEE 14th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 5-7, 2012, pp. 219-230.

Shi, Hongbin, Yu, Daquan, and Ueda, Toshitsugu, "Systematic Studies of Second Level Interconnection Reliability of Edge and Corner Bonded Lead-Free Array-Based Packages under Mechanical and Thermal Loading," 2012 IEEE 62nd Electronic Components and Technology Conference , San Diego, CA, May 29-June 1, 2012, pp. 965-976.

Shi, Hongbin, and Ueda, Toshitsugu, "Thermal Cycling Reliability of Lead-free Package Stackable Very Thin Fine Pitch Ball Grid Array Assemblies with Reworkable Edge and Corner Bond Adhesives," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 81-86,

Shi, Hong-Chang, and Xian, Ai-Ping, "Tin Whisker Growth on NdSn3 Powder," Journal of Electronic Materials , vol. 40 no. 9, pp. 1962-1966, Sept. 2011.

Shi, Jing, Popovic, Darko, Nettleton, Nyles, Sze, Theresa, Douglas, David, Thacker, Hiren, Cunningham, John, Furuta, Kazutaka, Kojima, Ryoji, Hirose, Koichi, and Hwang, Kuopin, "Direct Chip Powering and Enhancement of Proximity Communication through Anisotropic Conductive Adhesive Chip-to-Chip Bonding," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 363-368.

Shi, Lei, Xing, Lu, Ma, Zhong, Yang, Li, and Wu, Xiaoqing, "Household disposal behavior and attitudes towards the recycling of waste household electrical appliances in Qingdao, P.R. China," International Conference on Management and Service Science, Beijing, China, Sept. 20-22, 2009, pp. xx-xx.

Shi, Lihong, and Zhang, Gang, "Exploring Direct to Indirect Bandgap Transition in Silicon Nanowires: Size Effect," Journal of Electronic Materials, vol. 45 no. 10, pp. 5391-5394, Oct. 2016.

Shi, Pei-jing, Xu, Yi, Wang, Hong-mei, and Xu, Bin-shi, "Sustainable manufacturing for obsolete computers based on 3R engineering," Journal of Central South University of Technology, vol. 12 no. 2, pp. 138-141, Oct. 2005.

Shi, Shawn, Sleeper, Scott, and Kim, Chunho, "Study on Isotropic Electrically Conductive Adhesive for Medical Device Applications," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 263-270.

Shi, Wei, Barnes, Paul, and Muhs, David, "Void-Free Fluxless Solder Bonding of CPV Solar Cells," Advancing Microelectronics, vol. 37 no. 1, pp. 28-33, Jan./Feb. 2010.

Shi, X. Q., Kwan, H. F., Nai, S. K. L., and Lim, G. H., "Kinetics of interface reaction and intermetallics growth of Sn-3.5Ag-0.7Cu/Au/Ni/Cu system under isothermal aging," Journal of Materials Science, vol. 39 no. 3, pp. 1095-1099, Feb. 2004.

Shi, Yanrong, Wei, Xiang, and Tolla, Bruno, "Smart Chemistry Towards Highly Efficient Soldering Material Formulation," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 436-443.

Shi, Yaowu, Yan, Yanfu, Liu, Jianping, Xia, Zhidong, Lei, Yongping, Guo, Fu, and Li, Xiaoyan, "Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles," Journal of Electronic Materials, vol. 38 no. 9, pp. 1866-1873, Sept. 2009.

Shi, Yaowu, Liu, Jianping, Yan, Yanfu, Xia, Zhidong, Lei, Yongping, Guo, Fu, and Li, Xiaoyan, "Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles," Journal of Electronic Materials, vol. 37 no. 4, pp. 507-514, Apr. 2008.

Shi, Yaowu, Liu, Jianping, Xia, Zhidong, Lei, Yongping, Guo, Fu, and Li, Xiaoyan, "Creep property of composite solders reinforced by nano-sized particles," Journal of Materials Science: Materials in Electronics, vol. 19 no. 4, pp. 349-356, Apr. 2008.

Shi, Yaowu, Tian, Jun, Hao, Hu, Xia, Zhidong, Lei, Yongping, and Guo, Fu, "Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder," Journal of Alloys and Compounds, vol. 453 no. 1-2, pp. 180-184, Apr. 3, 2008.

Shi, Yaowu, Fang, Weiping, Xia, Zhidong, Lei, Yongping, Guo, Fu, and Li, Xiaoyan, "Investigation of rare earth-doped BiAg high-temperature solders," Journal of Materials Science: Materials in Electronics, vol. 21 no. 9, pp. 875-881, Sept. 2010.

Shi, Yaowu, and Hao, Hu, "Tin Whiskers with Special Morphology," Beijing University of Technology, July 2008.

Shi, Yuning, Chen, Haibin, Wu, Jingshen, Shiu, Ivan, and Wong, Fei, "Thermo-Mechanical Analysis and Design for SOD Package Based on Finite Element Method," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 4, pp. 650-659, Apr. 2012.

Shi, Z., Wu, S., Fairbridge, C., and Szpunar, J. A., "Controlling palladium nanowire size through electroless deposition process," IET Micro & Nano Letters, vol. 3 no. 2, pp. 50-56, June 2008.

Shi, Zhe, and Singh, Chandra Veer, "Competing twinning mechanisms in body-centered cubic metallic nanowires," Scripta Materialia, vol. 113, pp. 214-217, Mar. 1, 2016.

Shiau, L. C., Ho, C. E., and Kao, C. R., "Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages," Soldering & Surface Mount Technology , vol. 14 no. 3, pp. 25-29, 2002.

Shibasaki, Maiya, Warburg, Niels, and Eyerer, Peter, "Directives and Legislations - Recycling and Reuse of Products," Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 12-14, 2005, pp. 823-827.

Shibata, A., "Drop Test," Overcoming the Reliability Challenge: An IPC Summit, Andover, MA, Apr. 15, 2008, pp. xx-xx.

Shibutani, Tadahiro, Yu, Qiang, and Shiratori, Masaki, "A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder Balls," Journal of Electronic Packaging, vol. 129 no. 1, pp. 71-75, Mar. 2007.

Shibutani, Tadahiro, Yu, Qiang, and Shiratori, Masaki, "Effect of Creep Properties on Pressure Induced Tin Whisker Formation," Proceedings - The 2nd IEEE International Conference on Secure System Integration and Reliability Improvement, Yokohama, Japan, July 14-17, 2008, pp. 197-198.

Shibutani, Tadahiro, "Effect of Grain Size on Pressure-Induced Tin Whisker Formation," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 3, pp. 177-182, July 2010.

Shibutani, Tadahiro, Yu, Qiang, Shiratori, Masaki, and Pecht, Michael G., "Evaluation of Pressure-Induced Tin Whisker Formation," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Shibutani, Tadahiro, Wu, Ji, Yu, Qiang, and Pecht, Michael, "Key reliability concerns with lead-free connectors," Microelectronics Reliability, vol. 48 no. 10, pp. 1613-1627, Oct. 2008.

Shibutani, Tadahiro, Yu, Qiang, Shiratori, Masaki, and Pecht, Michael G., "Pressure-induced tin whisker formation," Microelectronics Reliability , vol. 48 no. 7, pp. 1033-1039, July 2008. https://doi.org/10.1016/j.microrel.2008.04.009

Shibutani, Tadahiro, and Yu, Qiang, "Pressure Induced Tin Whisker Formation on SnCu Finish by Nanoindentation Creep," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1442-1447.

Shibutani, Tadahiro, Osterman, Michael, and Pecht, Michael, "Standards for Tin Whisker Test Methods on Lead-Free Components," IEEE Transactions on Components and Packaging Technologies, vol. 32 no. 1, pp. 216-219, Mar. 2009.

Shibutani, Tadahiro, Yu, Qiang, Yamashita, Takuma, and Shiratori, Masaki, "Stress-Induced Tin Whisker Initiation Under Contact Loading," IEEE Transactions on Electronics Packaging Manufacturing, vol. 29 no. 4, pp. 259-264, Oct. 2006.

Shieh, Pei-Ying, "Sn-Ag-Cu Lead Free Solder SMT Process," 2000 Lead Free Symposium Conference Proceedings, 2000, pp. xx-xx.

Shih, Chun-Hsing, Huang, Ming-Kun, Tsai, Jr-Jie, Chen, Yu-Hsuan, and Wu, Wen-Fa, "Metallic Schottky barrier source/drain nanowire transistors using low-temperature microwave annealed nickel, ytterbium, and titanium silicidation," Materials Science in Semiconductor Processing, vol. xx, pp. xx-xx, xxxx.

Shih, D.-Y., Dang, B., Gruber, P., Lu, M., Kang, S., Buchwalter, S., Knickerbocker, J., Perfecto, E., Garant, J., Knickerbocker, S., Semkow, K., Sundlof, B., Busby, J., Weisman, R., Ruhmer, K., and Hughlett, E., "C4NP for Pb-Free Solder Wafer Bumping and 3D Fine-Pitch Applications," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Shih, Da-Yuan, and Ficalora, Peter J., "The Effect of Hydrogen on the Rate of Formation of Intermetallics in the Cu-Sn, Ag-Sn and Ni-Sn Systems," 17th Annual Reliability Physics Symposium, San Francisco, CA, Apr. 24-26, 1979, pp. 87-90.

Shih, H. C., Hsu, J. W., Sun, C. N., and Chung, S. C., "The Electrochemical Behavior & Lifetime Of a Hot-Dip 5-Wt% Al-Zn Coating In Chloride Environments," Plating & Surface Finishing, vol. 88 no. 6, pp. 100-103, June 2001.

Shih, Li-Hsing, "Reverse logistics system planning for recycling electrical appliances and computers in Taiwan," Resources, Conservation, and Recycling, vol. 32 no. 1, pp. 55-72, May 2001.

Shih, Meng-Kai, Shih, Hsin-Chih, Lee, Ying-Chih, Tarng, David, and Hung, C. P., "Solder Joint Reliability Analysis for Large Size WLCSP," 2017 International Conference on Electronics Packaging, Yamagata, Japan, Apr. 19-22, 2017, pp. 61-65.

Shih, Po-Cheng, and Lin, Kwang-Lung, "Correlation between interfacial microstructure and shear behavior of Sn-Ag-Cu solder ball joined with Sn-Zn-Bi paste," Journal of Materials Science , vol. 42 no. 8, pp. 2574-2581, Apr. 2007.

Shih, Po-Cheng, and Lin, Kwang-Lung, "Effect of microstructural evolution on electrical property of the Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste," Journal of Materials Research , vol. 20 no. 10, pp. 2854-2865, Oct. 2005.

Shih, Po-Cheng, and Lin, Kwang-Lung, "Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 °C," Journal of Materials Research, vol. 22 no. 1, pp. 113-123, Jan. 2007.

Shih, Po-Cheng, and Lin, Kwang-Lung, "Interfacial bonding behavior with introduction of Sn-Zn-Bi paste to Sn-Ag-Cu ball grid array package during multiple reflows," Journal of Materials Research, vol. 20 no. 1, pp. 219-229, Jan. 2005.

Shih, Po-Cheng, and Lin, Kwang-Lung, "Interfacial microstructure and shear behavior of Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste," Journal of Alloys and Compounds, vol. 422 no. 1-2, pp. 153-163, Sept. 28, 2006.

Shih, Po-Cheng, and Lin, Kwang-Lung, "Spallation of interfacial Ag-Au-Cu-Zn compounds in Sn-Ag-Cu/Sn-Zn-Bi joints during 210°C reflow," Journal of Alloys and Compounds, vol. 439 no. 1-2, pp. 137-142, July 31, 2007.

Shih, Richard L. H., Lau, Danny Y. K., and Kwok, Raymund W. M., "Metallurgy and Stability of The Sn/Cu Interface For Lead-Free Flip Chip Application," Fifth International Conference on Electronic Packaging Technology Proceedings, Shanghai, China, Oct. 28-30, 2003, pp. 295-301.

Shih, T. I., and Duh, J. G., "Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging," Journal of Electronic Materials, vol. 37 no. 6, pp. 845-851, June 2008.

Shih, T. I., Lin, Y. C., Duh, J. G., and Hsu, Tom, "Electrical Characteristics for Sn-Ag-Cu Solder Bump with Ti/Ni/Cu Under-Bump Metallization after Temperature Cycling Tests," Journal of Electronic Materials, vol. 35 no. 10, pp. 1773-1780, Oct. 2006.

Shih, T. I., Lin, Y. C., Duh, J. G., Hsu, Tom, and Wu, W. S., "Electrical Measurement of a Lead-Free Solder Assembly after Environmental Tests by SEM Internal Probing," JOM, vol. 59 no. 7, pp. 32-34, 36-37, July 2007.

Shih, Tien-Tsorng, Chen, Bing-Hua, Lee, Win-Der, and Wang, Mu-Chun, "Drop Test for Sn96.7-Ag3.7 Polymer Core Solder Ball in BGA Package," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 184-187.

Shih, Tien-Tsorng, Chen, Bing-Hua, Lee, Win-Der, and Wang, Mu-Chun, "IMC Integrity for Sn96.7-Ag3.7 Polymer Core Solder Ball in BGA Package," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 427-430.

Shih, Tien-Tsorng, Chen, Wei-Chih, Lee, Win-Der, and Wang, Mu-Chun, "Nickel Solder Ball Performance for Pb-free LFBGA Assembly under Oxygenous Reflow," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 439-442.

Shih, Tien-Tsorng, Chen, Wei-Chih, Lee, Win-Der, and Wang, Mu-Chun, "Oxygenous Reflow Affecting Performance of Pb-free TFBGA Assembly," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 443-446.

Shih, Tien-Tsorng, Chen, Bing-Hua, Lee, Win-Der, and Wang, Mu-Chun, "Reflow Influence for Sn96.7-Ag3.7 Polymer Core Solder Ball in BGA Package," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 431-434.

Shih, Tien-Tsorng, Chen, Wei-Chih, Lee, Win-Der, and Wang, Mu-Chun, "Solder Stability for Pb-free HBGA Assembly with Oxygenous Reflow," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 435-438.

Shihua, Yang, Pengrong, Lin, Yanhong, Tian, Chunqing, Wang, Le, Liang, and Qian, Wang, "Effect of Solder Volume on Shear Strength between Sn-3.0Ag-0.5Cu Solder and Cu Metallization," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Shilyaeva, Yulia, Gavrilov, Sergey, and Matyna, Larisa, "Melting of indium, tin, and zinc nanowires embedded in the pores of anodic aluminum oxide," Journal of Thermal Analysis and Calorimetry, vol. 118 no. 2, pp. 937-942, Nov. 2014.

Shimada, Koji, "Does Environmental Regulation Reduce the Competitiveness of Firms? : A Review of Recent Empirical Studies," Journal of the Surface Finishing Society of Japan, vol. 57 no. 12, pp. 809-812, 2006.

Shimada, Yasushi, lu, Daoqiang, and Wong, C. P., "Electrical Characterizations and Considerations of Electrically Conductive Adhesives (ECAs)," 2000 International Symposium on Advanced Packaging Materials, Braselton, GA, Mar. 6-8, 2000, pp. 336-342.

Shimada, Yasushi, Lu, Daoqiang, and Wong, C. P., "Electrical Characterizations of Isotropic Conductive Adhesives (ICAs)," Journal of Electronics Manufacturing, vol. 10 no. 2, pp. 97-103, June 2000.

Shimamura, Hideaki, Fujita, Shoyo, Sakata, Masao, Kamei, Tsuneaki, and Kobayashi, Shigeru, "Aluminum sputtering with intermittent pulse bias application," Journal of Vacuum Science & Technology A: Vacuum Surfaces, and Films, vol. 7 no. 3, pp. 1202-1205, May/June 1989.

Shimamura, Masato, Ohnishi, Tsukasa, Nonaka, Tomoko, Ishibashi, Seiko, Okuno, Tetsuya, Akita, Satoru, and Daily, Derek, "A Unique Low-Ag Alloy Solder Paste for High-Reliability SMT Applications," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 709-716.

Shimamura, Masato, Okuno, Tetsuya, Akita, Satoru, and Daily, Derek, "Awakening from Head-in-Pillow: A Novel Pre-production Test Method for BGA Non-wet Issues," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 422-429.

Shimamura, Masato, Nonaka, Tomoko, Okuno, Tetsuya, Akita, Satoru, and Daily, Derek, "Head-in-Pillow: Alarm Still Ringing? A Continuation Study on Known Chemical and Mechanical Factors in BGA Non-Wet," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 60-67.

Shimanovich, Klimentiy, Coen, Tom, Vaknin, Yonatan, Henning, Alex, Hayon, Joseph, Roizin, Yakov, and Rosenwaks, Yossi, "CMOS Compatible Electrostatically Formed Nanowire Transistor for Efficient Sensing of Temperature," IEEE Transactions on Electron Devices, vol. 64 no. 9, pp. 3836-3840, Sept. 2017.

Shimidzu, Takeo, Iyoda, Tomokazu, Ando, Masanori, Ohtani, Akira, Kaneko, Takehira, and Honda, Kenichi, "A Novel Anisotropic Conducting Thin Film Having a Conducting and Insulating Layered Structure," Thin Solid Films, vol. 160, pp. 67-79, June 1988.

Shimizu, Kozo, Akamatsu, Toshiya, Nakanishi, Teru, Karasawa, Kazuaki, Hashimoto, Kaoru, and Niwa, Koichi, "Solder Joint Reliability of Flip-Chip Interconnection," Proceedings of the 1994 International Symposium on Microelectronics, Boston, MA, Nov. 15-17, 1994, pp. 272-277.

Shimizu, Kozo, Nakanishi, Teru, Karasawa, Kazuaki, Hashimoto, Kaoru, and Niwa, Koichi, "Solder Joint Reliability of Indium-Alloy Interconnection," Journal of Electronic Materials, vol. 24 no. 1, pp. 39-45, Jan. 1995.

Shimizu, T., Ishikawa, H., Ohnuma, I., and Ishida, K., "Zn-Al-Mg-Ga Alloys as Pb-Free Solder for Die-Attaching Use," Journal of Electronic Materials, vol. 28 no. 11, pp. 1172-1175, Nov. 1999.

Shimoda, Masayoshi, Hidaka, Noboru, Yamashita, Mitsuo, Sakaue, Kenichi, and Ogawa, Takeshi, "The Effect of Ni,Ge Elements on Microstructure and Mechanical Properties of Sn-Ag-Cu Solders," 11th Electronics Packaging Technology Conference , Singapore, Dec. 9-11, 2009, pp. 725-730.

Shimoji, Teruaki, "The Situation and Future of Electroless Silver Plating Solution," Journal of the Surface Finishing Society of Japan, vol. 58 no. 2, pp. 105-108, 2007.

Shimokawa, Hanae, Okamoto, Masahide, and Serizawa, Koji, "Evaluation of Soldering Properties with Various Types of Metallization," Proceedings of EcoDesign2003: Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 8-11, 2003, pp. 821-828.

Shimokawa, Hanae, Soga, Tasao, and Serizawa, Koji, "Mechanical Properties and Microstructure of Tin-Silver-Bismuth Lead-Free Solder," Materials Transactions, vol. 43 no. 8, pp. 1808-1815, Aug. 2002.

Shimotomai, M., and Doyama, M., "State of Solution of Co in a-Sn," Scripta Metallurgica, vol. 14 no. 12, pp. 1269-1272, Dec. 1980.

Shimozaki, Toshitada, Lee, Je-hyun, and Lee, Chan-Gyu, "Influence of Interdiffusion in Sn Solution on Growth of Cu3Sn and Cu6Sn5 Formed in Semi-infinite and Finite Cu-Sn Diffusion Couples," Journal of Phase Equilibria and Diffusion, vol. 38 no. 1, pp. 17-29, Feb. 2017.

Shin, C. K., Baik, Y.-J., and Huh, J. Y., "Effects of Microstructrual Evolution and Intermetallic Layer Growth on Shear Strength of Ball-Grid-Array Sn-Cu Solder Joints," Journal of Electronic Materials, vol. 30 no. 10, pp. 1323-1331, Oct. 2001.

Shin, Chang-Keun, and Huh, Joo-Youl, "Effect of Cu-containing solders on the critical IMC thickness for the shear strength of BGA solder joints," Proceedings of 3rd Electronics Packaging Technology Conference, Singapore, Dec. 5-7, 2000, pp. 406-411.

Shin, Ho Sun, Song, Jae Yong, and Yu, Jin, "Lattice Deformation of Sn Nanowires for the Application to Nano-interconnection Technology," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1861-1865.

Shin, Ho Sun, Yu, Jin, Song, Jae Yong, and Park, Hyun Min, "Size-dependent lattice parameters of microstructure-controlled Sn nanowires," Journal of Materials Research, vol. 26 no. 16, pp. 2033-2039, Aug. 28, 2011.

Shin, Ho Sun, Jeon, Seong Gi, Yu, Jin, and Song, Jae Yong, "Transformation of Sn nanowires to oxide nanotubes by a localized corrosion process," Materials Letters, vol. 82, pp. 22-25, Sept. 1, 2012.

Shin, Jae Cheol, Kim, Do Yang, Lee, Ari, Kim, Hyo Jin, Kim, Jae Hun, Choi, Won Jun, Kim, Hyun-Seok, and Choi, Kyoung Jin, "Improving the composition uniformity of Au-catalyzed InGaAs nanowires on silicon," Journal of Crystal Growth, vol. 372, pp. 15-18, June 1, 2013.

Shin, Jae Wook, and Chason, Eric, "Compressive stress generation in Sn thin films and the role of grain boundary diffusion," Physical Review, vol. xx no. xx, pp. xx-xx, xxxx.

Shin, Jae Wook, and Chason, Eric, "Stress behavior of electroplated Sn films during thermal cycling," Journal of Materials Research, vol. 24 no. 4, pp. 1522-1528, Apr. 2009.

Shin, Ji-Won, Kim, Il, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Jee, Young Kun, and Paik, Kyung-Wook, "Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40um pitch Cu-pillar/Sn-Ag bump interconnection," Microelectronics Reliability , vol. 55 no. 2, pp. 432-441, Feb. 2015.

Shin, Jong Yoon, Pi, Kilhwa, Jung, Sukwon, and Cho, Dong-il Dan, "Silicon-Nanowire Field-Effect Transistors on a Flexible Substrate Using Top-Down MEMS Processes," 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems, Shanghai, China, Jan. 24-28, 2016, pp. 469-472.

Shin, Jooho, Jung, Sooim, and Lee, Minsu (Tim), "A Novel Halogen-Free Material for High Speed PCB," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S31_02-1-S31_02-7.

Shin, Keesam, Cho, Won-Gu, and Kim, Young-Ho, "Interfacial Microstructure and Intermetallics Developed in the Interface between In Solders and Au/Ni/Ti Thin Films during Reflow Process," Journal of Electronic Materials, vol. 32 no. 6, pp. 483-491, June 2003.

Shin, Mu-Seob, and Kim, Young-Ho, "Microstructure Characterization of Sn-Ag Solder Joints between Stud Bumps and Metal Pads," Journal of Electronic Materials, vol. 32 no. 12, pp. 1448-1454, Dec. 2003.

Shin, S. W., and Yu, Jin, "Creep Deformation of Sn-3.5Ag-xCu and Sn-3.5Ag-xBi Solder Joints," Journal of Electronic Materials, vol. 34 no. 2, pp. 188-195, Feb. 2005.

Shin, S. W., Kim, P. W., Woo, H. J., Ahn, E. C., Cho, I. S., and Chung, T. G., "Effect of Ni Surface Finish on Half Etched Cu on Solder Joint Reliability," 2007 Proceedings 57th Electronic Components & Technology Conference , Reno, NV, May 29-June 1, 2007, pp. 415-419.

Shin, Sangwoo, and Cho, Hyung Hee, "Self-formed platform for in situ measurement of electrical transport of individual copper nanowires," Electrochimica Acta, vol. 117, pp. 120-126, Jan. 20, 2014.

Shin, Seung-Jung, Kim, Jae-Jung, and Son, Young Kap, "Analysis of plating grain size effect on whisker," Journal of Mechanical Science and Technology, vol. 23 no. 11 , pp. 2885-2890, Nov. 2009.

Shin, Seung-yong, Lee, Ji-hyun, and Park, Hai-woong, "Mechanical and electrical properties of In-Bi solder at Bi2212 superconductor interface with annealed Ag spray layers and Ag precoating layers," Transactions of Nonferrous Metals Society of China, vol. 19 no. 4, pp. 961-964, Aug. 2009.

Shin, Yong Moo, Kim, Hyun-Jin, Jang, Seok Pil, and Lee, Jong-Hyun, "Enhancement of Processability and Electrical Resistance by Use of Ag-Based Composite Inks Containing Ultrafine SAC305 Alloy Nanoparticles," Journal of Electronic Materials, vol. 43 no. 9, pp. 3372-3378, Sept. 2014.

Shin, Young-eui, Nakajima, Dai, and Nakata, Shuji, "Investigation on Optimal Thickness of Plating Layers and Reliability of Bonds with Low Temperature Bonding Process," Yosetsu Gakkai Ronbunshu/ Quarterly Journal of the Japan Welding Society, vol. 11 no. 2, pp. 347-352, May 1993.

Shin, Young-Eui, Lee, Kyung-Woo, Chang, Kyong-Ho, Jung, Seung-Boo, and Jung, Jae Pil, "Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis," Materials Transactions, vol. 42 no. 5, pp. 809-813, May 2001.

Shin, Yue-Seon, Lee, Se-hyung, Lee, Chang-Woo, Jung, Seung-Boo, and Kim, Jeong-Han, "Effect of Dispersed SiC Nano-particles in Eutectic Sn58Bi Solder Micro-Bumps of Wafer Level Package by Electroplating," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 279-284.

Shin, Yue-Seon, Lee, Sehyung, Yoo, Sehoon, and Lee, Chang-Woo, "Mechanical and Microstructural Properties of SiC-Mixed Sn-Bi Composite Solder Bumps by Electroplating," European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Shina, Sammy, Harriman, Liz, MacFadden, Todd, Anderson, Richard, Pasquito, Helena, Wilkish, George, Abbott, Donald, Kistler, Marie, Pinsky, David, Quealy, Mark, and Walters, Karen, "A Comparative Analysis of Lead Free Materials and Processes Using Design of Experiment Techniques" 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 705-714.

Shina, Sammy, Harriman, Liz, Morose, Greg, Anderson, Richard, Pasquito, Helena, Wilkish, George, Farrell, Bob, Goulet, John, Lauzier, Phil, Lombardo, Ralph, Buck, Tom, Longworth, Don, Degan, Ken, Abbott, Donald, Pinsky, David, Sarkhel, Amit, Quealy, Mark, Dimock, Fred, DiMatteo, Rob, Benson, Roger, Walters, Karen, Ballas, Jack, and Ulmer, Carl, "Analysis of Testing Results of Surface Mounted Lead Free Soldering Materials and Processes," 2005 Pan Pacific Symposium Conference Proceedings , Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Shina, Sammy, Belbase, Hemant, Walters, Karen, Bresnan, Tom, Biocca, Peter, Skidmore, Tim, Pinsky, David, Provencal, Phil, and Abbott, Don, "Design of Experiments for Lead Free Materials, Surface Finishes and Manufacturing Processes of Printed Wiring Boards," 2000 SMTA International Conference Proceedings, Chicago, IL, Sept. 24-28, 2000, pp. xx-xx.

Shina, Sammy, and Belbase, Hemant, "Developing and Analyzing Lead-Free Soldering Processes for Printed Wiring Boards," Toxics Use Reduction Institute Technical Report No. 52, 2000.

Shina, Sammy, and Morose, Greg, "How Surface Finish and Solder Paste Affect Lead-free Conversions," Surface Mount Technology (SMT), vol. 19 no. 2, pp. xx-xx, Feb. 2005.

Shina, Sammy, "Knowledgeable Green Transition Management," Surface Mount Technology (SMT), vol. 22 no. 5, pp. 30, May 2008.

Shina, Sammy, Harriman, Liz, MacFadden, Todd, Abbott, Donald, Anderson, Richard, Pasquito, Helena, Wilkish, George, Kistler, Marie, Pinsky, David, Quealy, Mark, Walters, Karen, McCann, Richard, and Grusby, Al, "Lead Free Conversion Analysis for Multiple PWB/Component Materials and Finishes using Quality and Reliability Testing," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S29-4-1-S29-4-14.

Shina, Sammy, and MacFadden, Todd, "Lead-free Conversion Issues in Component and PWB Surface Finishes," Surface Mount Technology (SMT), vol. 18 no. 5, pp. 73, May 2004.

Shina, Sammy, Harriman, Liz, Morose, Greg, Anderson, Richard, Pasquito, Helena, Wilkish, George, Bodmer, Paul, Farrell, Bob, Goulet, John, Lauziere, Philip, Brinkman, James, Longworth, Don, Degan, Ken, Abbott, Donald, Pinsky, David, Sarkhel, Amit, Quealy, Mark, Walters, Karen, Benson, Roger, Ballas, Jack, and Lizotte, Ray, "New England Lead Free Electronics Consortium: Testing of Lead Free Soldering Materials and Processed for Solder Joint Integrity," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies , San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Shina, Sammy, Belbase, Hemant, Walters, Karen, Bresnan, Tom, Biocca, Peter, Skidmore, Tim, Pinsky, David, Provencal, Phil, Abbott, Don, "Process and Material Selection for Zero Defects and Superior Adhesion Lead Free SMT Soldering," 2001 SMTA International Conference Proceedings , Chicago, IL, Sept. 30-Oct. 4, 2001, pp. xx-xx.

Shina, Sammy, Morose, Greg, Anderson, Richard, Pasquito, Helena, Farrell, Bob, Longworth, Don, Boger, Wendi, Degan, Ken, Abbott, Donald, Pinsky, David, Ebner, Karen, Sarkhel, Amit, Miller, Michael, Feinstein, Louis, Fragoza, Deb, Ren, Eric, and Bickford, Charlie, "Quality and Reliability Analysis of Lead Free PCBs in Simulated Production Conditions and Long Term Use," 2010 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, Koloa, HI, Jan. 26-28, 2010, pp. xx-xx.

Shina, Sammy, Morose, Greg, Anderson, Richard, Pasquito, Helena, Farrell, Bob, Longworth, Don, Boger, Wendi, Degan, Ken, Abbott, Donald, Pinsky, David, Ebner, Karen, Sarkhel, Amit, Miller, Michael, Feinstein, Louis, Fragoza, Deb, Ren, Eric, and Bickford, Charlie, "Quality and Reliability Testing of Circuit Boards Assembled with Lead Free Components, Finishes, Soldering Materials and Processes in Simulated Production Conditions," Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb. 10-12, 2009, pp. 55-61.

Shina, Sammy, Belbase, Hemant, Walters, Karen, Bresnan, Tom, Biocca, Peter, Skidmore, Tim, Pinsky, David, Provencal, Phil, and Abbott, Don, "Selecting Material and Process Parameters for Lead Free SMT Soldering Using Design of Experiments Techniques," APEX 2001, San Diego, CA, 2001, pp. xx-xx.

Shina, Sammy, Morose, Greg, Harriman, Liz, Anderson, Richard, Pasquito, Helena, Wilkish, George, Bodmer, Paul, Farrell, Bob, Goulet, John, Lauziere, Philip, Brinkman, James, Longworth, Don, Boger, Wendi, Buck, Tom, Degan, Ken, Lockard, Don, Abbott, Donald, Pinsky, David, Ebner, Karen Walters, Sarkhel, Amit, Quealy, Mark, and Benson, Roger, "Summary of New England Lead Free Consortium Implementation Plan of High Volume Assembly of Printed Wiring Boards," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Shina, Sammmy, Harriman, Liz, Morose, Greg, Anderson, Richard, Pasquito, Helena, Wilkish, George, Abbott, Donald, Kistler, Marie, Pinsky, David, Quealy, Mark, DiMatteo, Rob, Dimock, Fred, Walters, Karen, McCann, Richard, and Grusby, Al, "Summary of Visual and Reliability Testing Results of Surface Mounted Lead Free Soldering Materials and Processes," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Shina, Sammy, and Akhtar, Irtiza, "The Development of Test Methodolgies for Determining the Formulations and Mechanical Properties of Leadfree Nano Solder," Pan Pacific Symposium 2018 Proceedings, Kamuela, HI, Feb. 5-8, 2018, pp. xx-xx.

Shina, Sammy G., "The Use of Six Sigma Principles for Successful RoHS Implementation," Printed Circuit Design and Manufacture, vol. 24 no. 4, pp. 28-32, Apr. 2007.

Shinada, Takahiro, Kimura, Hiroaki, Kumura, Yoshinori, and Ohdomari, Iwao, "Damage and contamination free fabrication of thin Si wires with highly controlled feature size," Applied Surface Science, vol. 117-118, pp. 684-689, June 2, 1997. https://doi.org/10.1016/S0169-4332(97)80164-X

Shinde, Mahesh A., Lee, Dong-Jun, Kim, Byoung-Joon, and Kim, Haekyoung, "Highly conductive and smooth surfaced flexible transparent conductive electrode based on silver nanowires," Thin Solid Films, vol. 685, pp. 366-371, Sept. 1, 2019.

Shingubara, S., Osaka, T., Abdeslam, S., Sakue, H., and Takahagi, T., "Void Formation Mechanism at No Current Stressed Area," AIP Conference Proceedings, vol. 418, pp. 159-170, 1998.

Shinohara, Kazunori, Yu, Qiang, Fujita, Masato, Ishii, Hideaki, and Ishikawa, Hisao, "Ball Impact Response Based on Modeling Techniques," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 828-833.

Shiokawa, Kazuhiko, and Ito, Yoshiaki, "High Speed Silver Plating," Journal of the Surface Finishing Society of Japan, vol. 60 no. 4, pp. 238-242, 2009.

Shiozawa, N., Isaka, K., and Ohta, T., "Electric Properties of Connections by Anisotropic Conductive Film," Journal of Electronics Manufacturing, vol. 5 no. 1, pp. 33-37, Mar. 1995.

Shirai, Masataka, Haraguchi, Keichi, Hiruma, Kenji, and Katsuyama, Toshio, "The Role of Gold Clusters in Semiconductor Microstructure Fabrication," Gold Bulletin, vol. 32 no. 3, pp. 80-84, 1999.

Shirai, Takeshi, Hayakawa, Masashige, Joshi, Shantanu, and Garcia, Roberto, "Lead-Free Solder Paste Development for Ultra Fine-Pitch Printing and Reflow of 03015 and 0201 Metric Chip Components," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 661-666.

Shirai, Yukio, Komagata, Mitinori, and Suzuki, Kenichi, "Non-migration Conductive Adhesives," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, Germany, Oct. 21-24, 2001, pp. 79-83.

Shiraishi, Tsukasa, Kojima, Toshiyuki, Ono, Masahiro, Itagaki, Minehiro, and Bessho, Yoshihiro, "A Study of New Compression Type Flip-Chip Bonding Technique Using Conductive Adhesive," Proceedings 2000 HD International Conference on High-Density Interconnect and Systems Packaging (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4217), Denver, CO, Apr. 25-28, 2000, pp. 369-374.

Shiraishi, Tsukasa, Amami, Kazuyoshi, Bessho, Yoshiriro, Sakamaoto, Kazunori, Eda, Kazuo, Ishida, Toru, and Fukuoka, Kazuyoshi, "Flip Chip MPU module on High Performance Printed Circuit Board "ALIVH"," Proceedings of the 1998 International Conference on Multichip Modules and High Density Packaging, Apr. 15-17, 1998, pp. 520-525.

Shiraishi, Tsukasa, Amami, Kazuyoshi, Bessho, Yoshiriro, Sakamaoto, Kazunori, Eda, Kazuo, Ishida, Toru, and Fukuoka, Kazuyoshi, "Flip Chip MPU module on High Performance Printed Circuit Board "ALIVH"," The International Journal of Microcircuits and Electronic Packaging , vol. 21 no. 2, pp. 205-211, 2nd Quarter 1998.

Shirasaki, Toshihiro, and Wakui, Takayuki, "Analysis of Chromium(VI) in Chromate Coating Film by UV-VIS Spectro-photometer," Journal of the Surface Finishing Society of Japan , vol. 58 no. 7, pp. 393-398, 2007.

Shirazi, Alireza, Varvani-Farahani, Ahmad, and Lu, Hua, "Comparative study on stress-strain hysteresis response of SAC solder joints under thermal cycles," International Journal of Fracture, vol. 151 no. 2, pp. 135-150, June 2008.

Shirazi, S., Yin, L., Khasawneh, S., Wentlent, L., and Borgesen, P., "Effects of Solder Joint Dimensions and Assembly Process on Acceleration Factors and Life in Thermal Cycling of SnAgCu Solder Joints," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 92-98.

Shirley, D. R., Ghorbani, H. R., and Spelt, J. K., "Effect of Constitutive Relationship, Solder Constraint and Stress State on Creep of SnPb and SnAgCu," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Shirley, D. R., and Spelt, J. K., "Primary Creep in Sn-3.8Ag-0.7Cu Solder, Part II: Constitutive Creep Model Development and Finite Element Analysis," Journal of Electronic Materials, vol. 38 no. 11, pp. 2388-2397, Nov. 2009.

Shirley, D. R., and Spelt, J. K., "Primary Creep in Sn3.8Ag0.7Cu Solder. Part I: Theory, Experiments, and Data Reduction," Journal of Electronic Materials, vol. 38 no. 11, pp. 2376-2387, Nov. 2009.

Shirley, Dwayne R., Ghorbani, Hamid R., and Spelt, Jan K., "Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints," Microelectronics Reliability, vol. 48 no. 3, pp. 455-470, Mar. 2008.

Shishido, Itsuroh, Matsuo, Akihiko, Toyoyama, Hirokazu, Mizuno, Masataka, Araki, Hideki, and Shirai, Yasuharu, "Influence of Lattice Defects Introduced in Copper during Electroplating on the Interlayer Reaction to Sn-3.0Ag-0.5Cu Lead Free Solder," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 70 no. 7, pp. 548-553, July 2006.

Shishido, Nobuyuki, Kanno, Toshifumi, Kawahara, Shinya, Ikeda, Toru, Miyazaki, Noriyuki, Lu, Hua, Bailey, Chris, Thomas, Owen, Di Maio, Davide, and Hunt, Chris, "An Analysis of Local Deformation of SnAgCu Solder Joint Using Digital Image Correlation," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 376-381.

Shiue, R. K., Tsay, L. W., Lin, C. L., and Ou, J. L., "The reliability study of selected Sn-Zn based lead-free solders on Au/Ni-P/Cu substrate," Microelectronics Reliability, vol. 43 no. 3, pp. 453-463, Mar. 2003.

Shiue, Ren-Kae, Tsay, Leu-Wen, Lin, Chun-Lin, and Ou, Jia-Lin, "A study of Sn-Bi-Ag-(In) lead-free solders," Journal of Materials Science, vol. 38 no. 6, pp. 1269-1279, Mar. 15, 2003.

Shiue, Yu-Yun, and Chuang, Tung-Han, "Effect of La Addition on the Interfacial Intermetallics and Bonding Strengths of Sn-58Bi Solder Joints with Au/Ni/Cu Pads," Journal of Alloys and Compounds, vol. xxx no. x, pp. xx-xx, xxxx.

Shiyong, Luo, Ning, Wang, Wencai, Xu, and Yong, Lv, "Preparation and rheological behavior of lead free silver conducting paste," Materials Chemistry and Physics, vol. 111 no. 1, pp. 20-23, Sept. 15, 2008.

Shklyaev, A. A., and Latyshev, A. V., "Formation of lateral nanowires by Ge deposition on Si(111) at high temperatures," Journal of Crystal Growth, vol. 441, pp. 84-88, May 1, 2016.

Shlichta, Paul J., "Comparison of Copper Whiskers with Ultrafine Wires," Growth and Perfection of Crystals, Cooperstown, NY, Aug. 27-29, 1958, pp. 214-218. (Edited by Doremus, R. H., Roberts, B. W., and Turnbull, David.)

Shnawah, Dhafer Abdul Ameer, Sabri, Mohd Faizul Bin Mohd, Badruddin, Irfan Anjum, and Said, Suhana, "A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low-Ag Sn-Ag-Cu solder joints," Microelectronics International, vol. 29 no. 1, pp. 47-57, 2012.

Shnawah, Dhafer Abdulameer, Sabri, Mohd Faizul Mohd, and Badruddin, Irfan Anjum, "A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products," Microelectronics Reliability, vol. 52 no. 1, pp. 90-99, Jan. 2012.

Shnawah, Dhafer Abdulameer, Sabri, Mohd Faizul Mohd, Badruddin, Irfan Anjum, Said, Suhana Binti Mohd, Ariga, Tadashi, and Che, Fa Xing, "Effect of Ag Content and the Minor Alloying Element Fe on the Mechanical Properties and Microstructural Stability of Sn-Ag-Cu Solder Alloy Under High-Temperature Annealing." Journal of Electronic Materials, vol. 42 no. 3, pp. 470-484, Mar. 2013.

Shnawah, Dhafer Abdul Ameer, Said, Suhana Binti Mohd, Sabri, Mohd Faizul Bin Mohd, Badruddin, Irfan Anjum, and Che, Fa Xing, "Effect of minor additions of Fe on bulk alloy microstructure and tensile properties of the low Ag-content Sn-1Ag-0.5Cu solder alloy," Soldering & Surface Mount Technology, vol. 24 no. 4, pp. 257-266, 2012.

Shnawah, Dhafer Abdulameer, Said, Suhana Binti Mohd, Sabri, Mohd Faizul Mohd, Badruddin, Irfan Anjum, and Che, Fa Xing, "High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications," Journal of Electronic Materials, vol. 41 no. 9, pp. 2631-2658, Sept. 2012.

Shnawah, Dhafer Abdulameer, Sabri, Mohd Faizul Mohd, Said, Suhana Binti Mohd, Jauhari, Iswadi, Mahdavifard, Mohammad Hossein, Bashir, Mohamed Bashir Ali, and Elsheikh, Mohamed Hamid, "Interfacial reactions between Cu substrate and Sn-1Ag-0.5Cu solder containing 0.1 wt% Al by dipping method," Journal of Materials Science: Materials in Electronics, vol. 26 no. 10, pp. 8229-8239, Oct. 2015.

Shnawah, Dhafer Abdul-Ameer, Said, Suhana Binti Mohd, Sabri, Mohd Faizul Mohd, Badruddin, Irfan Anjum, Hoe, Teh Guan, Che, Fa Xing, and Abood, Adnan Naama, "Microstructure and Tensile Properties of Sn-1Ag-0.5Cu Solder Alloy Bearing Al for Electronics Applications," Journal of Electronic Materials, vol. 41 no. 8, pp. 2073-2082, Aug. 2012.

Shnawah, Dhafer Abdul-Ameer, Said, Suhana Binti Mohd, Sabri, Mohd Faizul Mohd, Badruddin, Irfan Anjum, and Che, Fa Xing, "Novel Fe-containing Sn-1Ag-0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products," Microelectronics Reliability, vol. 52 no. 11, pp. 2701-2708, Nov. 2012.

Shnawah, Dhafer Abdulameer, Sabri, Mohd Faizul Mohd, Badruddin, Irfan Anjum, Said, Suhana Binti Mohd, Bashir, Mohamed Bashir Ali, Sharif, Nurulakmal Mohd, and Elsheikh, Mohamed Hamid, "Study on coarsening of Ag3Sn intermetallic compound in the Fe-modified Sn-1Ag-0.5Cu solder alloys," Journal of Alloys and Compounds, vol. 622, pp. 184-188, Feb. 15, 2015.

Shnawah, Dhafer Abdul-Ameer, Sabri, Mohd Faizul Mohd, Badruddin, Irfan Anjum, Said, Suhana Binti Mohd, and Che, Fa Xing, "The bulk alloy microstructure and mechanical properties of Sn-1Ag-0.5Cu-xAl solders (x = 0, 0.1 and 0.2 wt. %)," Journal of Materials Science: Materials in Electronics, vol. 23 no. 11, pp. 1988-1997, Nov. 2012.

Shnawah, Dhafer Abdul-Ameer, Sabri, Mohd Faizul Mohd, Badruddin, Irfan Anjum, and Che, Fa Xing, "The bulk alloy microstructure and tensile properties of Sn-1Ag-0.5Cu-xAl lead-free solder alloys (x=0, 1, 1.5 and 2 wt.%)," Microelectronics International, vol. 29 no. 2, pp. xx-xx, 2012.

Shoaf, Thomas, "Copper Dissolution as a Function of Surface Finish as Observed on RoHS Selective Solder Equipment," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 575-582.

Shohji, Ikuo, Kobayashi, Tatsuya, and Tohei, Tomotake, "Analysis of Stress-Strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints," Key Engineering Materials , vol. 462-463, pp. 76-81, 2011.

Shohji, Ikuo, Shimoyama, Satoshi, Ishikawa, Hisao, and Kojima, Masao, "Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-free Solder Ball Joints," Key Engineering Materials, vol. 385-387, pp. 429-432, 2008.

Shohji, Ikuo, Yoshida, Tomohiro, Takahashi, Takehiko, and Hioki, Susumu, "Comparison of low-melting lead-free solders in tensile properties with Sn-Pb eutectic solder," Journal of Materials Science: Materials in Electronics , vol. 15 no. 14, pp. 219-223, Apr. 2004.

Shohji, Ikuo, Gagg, Colin, and Plumbridge, W. J., "Creep Properties of Sn-8Mass%Zn-3Mass%Bi Lead-Free Alloy," Journal of Electronic Materials, vol. 33 no. 8, pp. 923-927, Aug. 2004.

Shohji, Ikuo, Arai, Ryohei, Ishikawa, Hisao, and Kojima, Masao, "Effect of Ag Content on Mechanical Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Alloy," Key Engineering Materials, vol. 462-463, pp. 82-87, Jan. 2011.

Shohji, Ikuo, Shiratori, Yuji, Yoshida, Horoshi, Mizukami, Masahiko, and Ichida, Akira, "Effect of Ni Coating Over Cu Ball on the Microstructure of Flip Chip Joints with Cu-Cored Solder Balls," Advances in Electronic Packaging 2003, Volume 1, Maui, Hawaii, July 6-11, 2003, pp. 137-140.

Shohji, Ikuo, and Arai, Ryohei, "Effect of Ni, Ge and P Addition in Sn-Ag-Cu Lead-free Solder on Solder Joint Properties with Electroless Ni/Au Electrodes," 2012 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Nov. 6-8, 2012, pp. xx-xx.

Shohji, Ikuo, Yoshizawa, Keisuke, Nishimoto, Masaharu, and Kawano, Takayuki, "Effect of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size Package," Key Engineering Materials , vol. 353-358 Part 3, pp. 2029-2032, 2007.

Shohji, Ikuo, Osawa, Tsutomu, Matsuki, Takashige, Kariya, Yoshiharu, Yasuda, Kiyokazu, and Takemoto, Tadashi, "Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders," Materials Transactions, vol. 49 no. 5, pp. 1175-1179, May 2008.

Shohji, Ikuo, and Toyama, Yuichiro, "Effect of Strain Rate on Tensile Properties of Miniature Size Specimens of Several Lead-free Alloys," Materials Science Forum, vol. 783-786, pp. 2810-2815, May 2014.

Shohji, Ikuo, Tohei, Tomotake, Yoshizawa, Keisuke, Nishimoto, Masaharu, Ogawa, Yasushi, and Kawano, Takayuki, "Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint," Key Engineering Materials, vol. 385-387, pp. 433-436, 2008.

Shohji, Ikuo, Yasuda, Kiyokazu, and Takemoto, Tadashi, "Estimation of Thermal Fatigue Resistances of Sn-Ag and Sn-Ag-Cu Lead-Free Solders Using Strain Rate Sensitivity Index," Materials Transactions , vol. 46 no. 11, pp. 2329-2334, 2005.

Shohji, Ikuo, Koyama, Shinji, Oshiro, Itaru, Nara, Hideaki, and Iwata, Yoshiharu, "Fluxless Bonding of Ni-P/Cu Plated Al Alloy and Cu Alloy with Lead-Free Sn-Cu Foil," Materials Transactions, vol. 51 no. 10, pp. 1753-1758, 2010.

Shohji, Ikuo, Shiratori, Yuji, Yoshida, Hiroshi, Mizukami, Masahiko, and Ichida, Akira, "Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls," Materials Transactions, vol. 45 no. 3, pp. 754-758, Mar. 2004.

Shohji, Ikuo, Watanabe, Hirohiko, Okashita, Takeshi, and Osawa, Tsutomu, "Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode," Materials Transactions, vol. 49 no. 7, pp. 1513-1517, July 2008.

Shohji, Ikuo, Osawa, Tsutomu, Okashita, Takeshi, and Watanabe, Hirohiko, "Impact Properties of Sn-0.75Cu Lead-free Solder Ball Joint," Key Engineering Materials, vol. 385-387, pp. 745-748, July 2008.

Shohji, Ikuo, Goto, Hiroki, Nakamura, Kiyotomo, and Ookubo, Toshikazu, "Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint," Materials Transactions, vol. 46 no. 12, pp. 2725-2729, 2005.

Shohji, Ikuo, Tsunoda, Satoshi, Watanabe, Hirohiko, and Asai, Tatsuhiko, "Influence of Content of Ni and Ag on Microstructure and Joint Strength of Lead-free Solder Joint with Sn-Ag-Cu-Ni-Ge," Key Engineering Materials , vol. 353-358 Part 3, pp. 2033-2036, Sept. 2007.

Shohji, Ikuo. Goto, Hiroki, Nakamura, Kiyotomo, and Ookubo, Toshikazu, "Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure of Solder Joint with Sn-3Ag-0.5Cu," Key Engineering Materials, vol. 297-300, pp. 2864-2869, Nov. 2005.

Shohji, Ikuo, Nakamura, Takao, Mori, Fuminari, and Fujiuchi, Shinichi, "Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints," Materials Transactions, vol. 43 no. 8, pp. 1797-1801, Aug. 2002.

Shohji, Ikuo, Tsunoda, Satoshi, Watanabe, Hirohiko, Asai, Tatsuhiko, and Nagano, Megumi, "Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lad-Free Alloy under Heat Exposure Conditions ," Materials Transactions, vol. 46 no. 12, pp. 2737-2744, 2005.

Shohji, Ikuo, Yoshida, Tomohiro, Takahashi, Takehiko, and Hioki, Susumu, "Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders," Materials Transactions, vol. 43 no. 8, pp. 1854-1857, Aug. 2002.

Shohji, Ikuo, Mori, Fuminari, and Kobayashi, Kojiro F., "Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders," Materials Transactions, vol. 42 no. 5, pp. 790-793, May 2001.

Shoji, Hikoroku, "On the Mechanism of the Change of Space-lattice in Different Modifications of Crystals," Proceedings of the Imperial Academy, vol. 5 no. 10, pp. 447-449, 1929.

Shokohyar, S., and Mansour, S., "Simulation-based optimisation of a sustainable recovery network for Waste from Electrical and Electronic Equipment (WEEE)," International Journal of Computer Integrated Manufacturing, vol. 26 no. 6, pp. 487-503, 2013.

Shook, R. L., Gilbert, J. J., Thomas, E., Vaccaro, B. T., Dairo, A., Horvath, C., Libricz, G. J., Crouthamel, D. L., and Gerlach, D. L., "Impact of Ingressed Moisture and High Temperature Warpage Behavior on the Robust Assembly Capability for Large Body PBGAs."

Shook, R. L., Gerlach, D. L., and Vaccaro, B. T., "Moisture Blocking Planes and Their Effect on Reflow Performance in Achieving Reliable Pb-free Assembly Capability for PBGAs," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 74-79.

Shook, Richard L., and Goodelle, Jason P., "Handling of Highly-Moisture Sensitive Components - An Analysis Of Low-Humidity Containment and Baking Schedules," IEEE Transactions on Electronics Packaging Manufacturing, vol. 23 no. 2, pp. 81-86, Apr. 2000.

Short, Rick, "Lead-free Soldering: Short-term Fix or Long-term Cure?," Surface Mount Technology (SMT), vol. 14 no. 9, pp. xx-xx, Sept. 2000.

Short, Rick, "The $38 Billion Blunder: A Rebuttal," Advanced Packaging Online Article.

Showalter, Chad, Sibell, Susan, Jean, Denis, Klimah, Paul, and Biggs, Joe, "A Study of Overcoming Solder Icicling and Copper Wire Dissolution in an Automated Lead-Free Soldering System," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 714-721.

Shrestha, Triratna, Gollapudi, Srikant, Charit, Indrajit, and Murty, K. Linga, "Creep deformation behavior of Sn-Zn solder alloys," Journal of Materials Science, vol. 49 no. 5, pp. 2127-2135, Mar. 2014.

Shrivastava, Puneet, O'Connell, Scott, and Watson, Mike, "Dell Survey of Electronic Recyclers - Results and Analysis," IEEE International Symposium on Sustainable Systems and Technology, Phoenix, AZ, May 18-20, 2009, pp. xx-xx.

Shrivastava, Puneet, O'Connell, Scott, and Whitley, Allen, "Handheld X-Ray Fluorescence: Practical Application as a Screening Tool to Detect the Presence of Environmentally-Sensitive Substances in Electronic Equipment," Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, New Orleans, LA, May 16-19, 2005, pp. 157-162.

Shu, Ming-Hung, Hsu, Bi-Min, and Hu, Min-Chuan, "Optimal combination of soldering conditions of BGA for halogen-free and lead-free SMT-green processes," Microelectronics Reliability, vol. 52 no. 11, pp. 2690-2700, Nov. 2012.

Shu, Yang, Rajathurai, Karunaharan, Gao, Fan, Cui, Qingzhou, and Gu, Zhiyong, "Synthesis and thermal properties of low melting temperature tin/indium (Sn/In) lead-free nanosolders and their melting behavior in a vapor flux," Journal of Alloys and Compounds, vol. 626, pp. 391-400, Mar. 25, 2015.

Shualdi, Wedianti, Ahmad, Ibrahim, Omar, Ghazali, and Isnin, Aishah, "Intermetallic Growth of Sn-Ag-Sb/Ni plated Cu in Power Packaging Subject to Thermal Aging," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Shuker, and Newby, K. R., "Why functional trivalent chromium fails and hexavalent is environmentally friendly," Finishing, vol. 30 no. 1, pp. 24-25, Jan./Feb. 2006.

Shukla, A., Pecht, M., Jordan, J., Rogers, K., and Jennings, D., "Hollow Fibres in PCB, MCM-L and PBGA Laminates May Induce Reliability Degradation," Circuit World, vol. 23 no. 2, pp. 5-6, 1997.

Shulman, Garson P., and Bauman, A. J., "Organic Acid Sealants for Anodized Aluminum - A New Method for Corrosion Protection," Metal Finishing, vol. 93 no. 7, pp. 16, 18-19, July 1995.

Shvydka, D., Warrell, G., Parsai, E., Karpov, V., and Vasko, A., "SU-E-T-447: Growth of Metal Whiskers Under External Beam Irradiation: Experimental Evidence and Implications in Medical Electronic Devices for Radiation Therapy Treatments," Medical Physics, vol. 42 no. 6 part 19, pp. 3437, June 2015.

Shvydka, Diana, and Karpov, Victor G., "Gamma and x-ray accelerated tin whisker development," Tin Whisker Group teleconference, Oct. 14, 2020.

Shvydka, Diana, and Karpov, V. G., "Surface parameters determining a metal propensity for whiskers," Journal of Applied Physics, vol. 119 no. 8, pp. 085301-1-085301-8, Feb. 28, 2016.

Shvydka, Diana, Killefer, Morgan, Borra, Vamsi, Georgiev, Daniel G., Karpov, Victor G., and Parsai, E. Ishmael, "Whisker growth on Sn thin film accelerated under gamma-ray induced electric field,", Tin Whisker Group teleconference, July 12, 2017.

Siang, Sharon Lim Pei, Min, Tan Ai, and Lee, Charles, "Process Development of a Flip Chip in Package with Anisotropic Conductive Film (ACF) for Lead-free Soldering," 2004 6th International Conference on Electronic Packaging Technology, Singapore, Dec. 8-10, 2004, pp. 450-454.

Sibirev, N. V., Nazarenko, M. V., Zeze, D. A., and Dubrovskii, V. G., "Modeling the nucleation statistics in vapor-liquid-solid nanowires," Journal of Crystal Growth, vol. 401, pp. 51-55, Sept. 1, 2014.

Siciliano, T., Tepore, A., Micocci, G., Genga, A., Siciliano, M., and Filippo, E., "Synthesis and characterization of indium monoselenide (InSe) nanowires," Journal of Materials Science: Materials in Electronics, vol. 22 no. 6, pp. 649-653, June 2011.

Sidhu, R. S., and Chawla, N., "Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part I. Microstructure Characterization of Bulk Solder and Solder/Copper Joints," Metallurgical and Materials Transactions A , vol. 39 no. 2, pp. 340-348, Feb. 2008.

Sidhu, R. S., Deng, X., and Chawla, N., "Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part II. Creep Behavior of Bulk Solder and Solder/Copper Joints," Metallurgical and Materials Transactions A, vol. 39 no. 2, pp. 349-362, Feb. 2008.

Sidhu, R. S., and Chawla, N., "Thermal Fatigue Behavior of Sn-Rich (Pb-Free) Solders," Metallurgical and Materials Transactions A, vol. 39 no. 4, pp. 799-810, Apr. 2008.

Sidhu, R. S., and Chawla, N. "Three-dimensional (3D) visualization and microstructure-based modeling of deformation in a Sn-rich solder," Scripta Materialia, vol. 54 no. 9, pp. 1627-1631, May 2006.

Sidhu, Rajen S., Aspandiar, Raiyo, Vandervoort, Steve, Amir, Dudi, and Murtagian, Gregorio, "Impact of Processing Conditions and Solder Materials on Surface Mount Assembly Defects," JOM, vol. 63 no. 10, pp. 47-51, Oct. 2011.

Sidhu, Rajen S., Madge, Shantanu V., Deng, Xin, and Chawla, Nikhilesh, "On the Nature of the Interface between Ag3Sn Intermetallics and Sn in Sn-3.5Ag Solder Alloys," Journal of Electronic Materials, vol. 36 no. 12, pp. 1615-1620, Dec. 2007.

Sidiki, Tamim P., and Cox, Ine, "Design for Green Electronics," 2011 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, Kamuela, HI, Jan. 18-20, 2011, pp. xx-xx.

Sidiki, Tamim P., Hilty, Robert D., and Shipe, Joanne, "Design for Low-Halogen Green Electronics," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Sieber, Arne, Valdastri, Pietro, Houston, Keith, Menciassi, Arianna, and Dario, Paolo, "Flip chip microassembly of a silicon triaxial force sensor on flexible substrates," Sensors and Actuators, vol. 142 no. 1, pp. 421-428, Mar. 10, 2008.

Sieber, John R., "Creating Standard Reference Materials for Testing Declarable Substances in Materials," Standardization News, vol. 33 no. 6, pp. 38-39, June 2006.

Sieber, John R., and Mortensen, Adam, "Validation and traceability of XRF and SEM-EDS elemental analysis results for solder in high-reliability applications," X-Ray Spectrometry, vol. 43 no. 5, pp. 259-268, 2014. https://doi-org.ezproxy.uky.edu/10.1002/xrs.2548

Siebert, W. Peter, "Solder Connections for High Frequency Applications Between Flexible and Rigid Printed Circuit Boards," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 1., pp. 118-126, Mar. 2006.

Siegel, H. M., Self, W. B., Johnson, R. M., and Wiseman, C. D., "Rapid determination of metal whiskers growth axes," Journal of Applied Physics, vol. 47 no. 10, pp. 4688-4690, Oct. 1976.

Siewert, T. A., Smith, D. R., Liu, S., and Madeni, J. C., "Database on Lead-free Solders," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 1312-1314.

Siewert, T. A., and Handwerker, C. A., "Test Procedures for Developing Solder Data," NIST Recommended Practice Guide Special Publication 960-8, Aug. 2002.

Siewiorek, A., Kudyba, A., Sobczak, N., Homa, M., Huber, Z., Adamek, Z., and Wojewoda-Budka, J., "Effects of PCB Substrate Surface Finish and Flux on Solderability of Lead-Free SAC305 Alloy," Journal of Materials Engineering and Performance, vol. 22 no. 8, pp. 2247-2252, Aug. 2013. https://doi-org.ezproxy.uky.edu/10.1007/s11665-013-0492-4

Sigelko, J., Choi, S., Subramanian, K. N., and Lucas, J. P., "The Effect of Small Additions of Copper on the Aging Kinetics of the Intermetallic Layer and Intermetallic Particles of Eutectic Tin-Silver Solder Joints," Journal of Electronic Materials, vol. 29 no. 11, pp. 1307-1311, Nov. 2000.

Sigelko, Jeff, Choi, S., Subramanian, K. N., Lucas, James P., and Bieler, T. R., "Effect of Cooling Rate on Microstructure and Mechanical Properties of Eutectic Sn-Ag Solder Joints with and without Intentionally Incorporated Cu6Sn5 Reinforcements," Journal of Electronic Materials, vol. 28 no. 11, pp. 1184-1188, Nov. 1999.

Sigelko, Jeff D., and Subramanian, K. N., "Overview of lead-free solders," Advanced Materials & Processes , vol. 157 no. 3, pp. 47-48, Mar. 2000.

Sihlbom, Anders, and Liu, Johan, "Thermal Characterisation of Electrically Conductive Adhesive Flip-Chip Joints," Proceedings of 2nd Electronics Packaging Technology Conference , Singapore, Dec. 8-10, 1998, pp. 251-257.

Sihlbom, Rolf, Dernevik, Markus, Lai, Zonghe, Starski, Piotr, and Liu, Johan, "Conductive Adhesives for High-Frequency Applications," The First IEEE International Symposium on Polymeric Electronics Packaging, Oct. 26-30, 1997, pp. 123-130.

Sihlbom, Rolf, Dernevik, Markus, Lai, Zonghe, Starski, J. Piotr, and Liu, Johan, "Conductive Adhesives for High-Frequency Applications," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A , vol. 21 no. 3, pp. 469-477, Sept. 1998.

Sihlbom, Rolf, "Electrical Modeling of Anisotropically Conductive Adhesive Interconnections for Microwave Applications," Proceedings of 2nd Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 1998, pp. 119-125.

Sijia, Yang, Xiaohua, Yang, and Xiaoyan, Li, "IMC's growth behavior and the characterization of its size during isothermal aging," 2011 International Symposium on Advanced Packaging Materials , Xiamen, China, Oct. 25-28, 2012, pp. 180-185.

Sikorcin, Glenn, "Reliability and Solderability of the Lead Free HASL Process," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 553-555.

Silaimani, S. M., Pushpavanam, M., and Narasimham, K. C., "Performance Characteristics of Electrochemically Prepared Tin Fluoborate," Plating & Surface Finishing, vol. 83 no. 10, pp. 48-53, Oct. 1996.

Silk, Julie, "Brittle Failure in Pb-free BGA Solder Joints," Surface Mount Technology (SMT), vol. 28 no. 9, pp. 14,16-18,20-22,24-28, Sept. 2013.

Silk, Julie, Wenger, George, Coyle, Richard, Goodbread, Jon, and Giamis, Andrew, "Double Reflow-Induced Brittle Interfacial Failures in Pb-free Ball Grid Array Solder Joints," IPC APEX Expo 2013, San Diego, CA, Feb. 17-21, 2013, pp. xx-xx.

Silk, Julie, Pan, Jianbiao, and Powers, Mike, "The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish," Surface Mount Technology (SMT), vol. 27 no. 7, pp. 16-18,20-22,24,26,28-30, July 2012.

Silva, Bismarck Luiz, Garcia, Amauri, and Spinelli, Jose Eduardo, "Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys," Journal of Alloys and Compounds, vol. 691, pp. 600-605, Jan. 15, 2017.

Silva, Bismarck L., Xavier, Marcella G. C., Garcia, Amauri, and Spinelli, Jose E., "Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys," Materials Science and Engineering: A, vol. 705, pp. 325-334, Sept. 29, 2017.

Silva, Bismarck Luiz, Silva, Vitor Covre Evangelista Da, Garcia, Amauri, and Spinelli, Jose Eduardo, "Effects of Solidification Thermal Parameters on Microstructure and Mechanical Properties of Sn-Bi Solder Alloys," Journal of Electronic Materials , vol. 46 no. 3, pp. 1754-1769, Mar. 2017.

Silva, Bismarck Luiz, Cheung, Noe, Garcia, Amauri, and Spinelli, Jose Eduardo, "Evaluation of solder/substrate thermal conductance and wetting angle of Sn-0.7 wt%Cu-(0-0.1 wt%Ni) solder alloys," Materials Letters, vol. 142, pp. 163-167, Mar. 1, 2015.

Silva, Bismarck Luiz, Spinelli, Jose Eduardo, Cante, Manuel V., Bertelli, Felipe, Cheung, Noe, Riva, Rudimar, and Garcia, Amauri, "Experimental and numerical analyses of laser remelted Sn-0.7 wt%Cu solder surfaces," Journal of Materials Science: Materials in Electronics , vol. 26 no. 5, pp. 3100-3107, May 2015.

Silva, Bismarck Luiz, Cheung, Noe, Garcia, Amauri, and Spinelli, Jose Eduardo, "Sn-0.7 wt%Cu-(xNi) alloys: Microstructure-mechanical properties correlations with solder/substrate interfacial heat transfer coefficient," Journal of Alloys and Compounds, vol. 632, pp. 274-285, May 25, 2015.

Silva, Bismarck Luiz, Bertelli, Felipe, Cante, Manuel V., Spinelli, Jose E., Cheung, Noe, and Garcia, Amauri, "Solder/substrate interfacial thermal conductance and wetting angles of Bi-Ag solder alloys," Journal of Materials Science: Materials in Electronics , vol. 27 no. 2, pp. 1994-2003, Feb. 2016.

Silva, Bismarck Luiz, Garcia, Amauri, and Spinelli, Jose Eduardo, "The roles of dendritic spacings and Ag3Sn intermetallics on hardness of the SAC307 solder alloy," Microelectronics Reliability, vol. 54 no. 12, pp. 2929-2934, Dec. 2014.

Silva, Bismarck Luiz, Cheung, Noe, Garcia, Amauri, and Spinelli, Jose Eduardo, "Thermal Parameters, Microstructure, and Mechanical Properties of Directionally Solidified Sn-0.7 wt.%Cu Solder Alloys Containing 0 ppm to 1000 ppm Ni," Journal of Electronic Materials, vol. 42 no. 1, pp. 179-191, Jan. 2013.

Silva, Jeffrey, "Findings may change cell phone disposal," Waste News, vol. xx no. x, pp. xx-xx, Mar. 15, 2004.

Silva, L. A. S., and Sathler, L., "The Corrosion Behavior of Cadmium, Zinc, Zinc-Nickel & Nickel-Phosphorus/Zinc Commercial Coatings in Chloride Solutions," Plating & Surface Finishing, vol. 90 no. 12, pp. 38-42, Dec. 2003.

Silva, L. S., Souza, J. S., and Silva, R. A. G., "Effects of Ag addition on phase transitions, microstructures and solder/copper interfaces of Sn99.1-xCu0.9Agx alloys," Journal of Thermal Analysis & Calorimetry, vol. 136 no. 6, pp. 2205-2210, June 2019.

Silvain, J. F., Binot, C., Durand, E., and Demourgues, A., "Interfacial and Surface Characterization of Fluorine Treated SnAgCu and NiTi Powders and NiTi/SnAgCu Composite Materials," Materials Science Forum , vol. 534-536 part 2, pp. 1461-1464, 2007.

Silvain, Jean-Fran‡ois, Mathias, Jean-Denis, Vincent, Cecile, Lalet, Gregory, Veillere, Amelie, Heintz, Jean-Marc, and Geffroy, Pierre-Marie, "Architectural optimization for microelectronic packaging."

Silverman, Mike, Schenkelberg, Fred, and Hillman, Craig, "Developing a Pb-Free Qualification Plan for Hi-Rel Applications."

Silverman, Mike, Schenkelberg, Fred, and Hillman, Craig, "How to Develop a RoHS Qualification Test Plan for Commercial Products," Ops A La Carte.

Silverman, Mike, Schenkelberg, Fred, and Hillman, Craig, "How to Develop a Qualification Test Plan for RoHS Products," 54th Annual Reliability & Maintainability Symposium, Las Vegas, NV, Jan. 28-31, 2008, pp. 375-380.

Sim, Gi-Dong, Chung, Chang-Kyu, Paik, Kyung-Wook, and Lee, Soon-Bok, "Experimental analysis on the mechanism of moisture induced interface weakening in ACF package," European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Sim, Kijoo, and Lee, Joonho, "Phase stability of Ag-Sn alloy nanoparticles," Journal of Alloys and Compounds, vol. 590, pp. 140-146, Mar. 25, 2014.

Simanek, E., "Nuclear Magnetic Resonance in Cobalt Whiskers," Czechoslovak Journal of Physics, vol. 12 no. 1, pp. 81-83, Jan. 1962.

Simanullang, Marolop, Usami, Koichi, Kodera, Tetsuo, Kawano, Yukio, and Oda, Shunri, "Microscopic study of germanium nanowires grown via gold-catalyzed chemical vapor deposition below the eutectic temperature," Journal of Crystal Growth, vol. 384, pp. 77-81, Dec. 1, 2013.

Simard-Normandin, M., Bealieu, M., Oliver, B., Sparks, R., and Pilote, S., "Evaluation of solder pastes for lead-free applications using MAJIC," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Simard-Normandin, M., Murison, M., Hebert, D., and Fersht, J., "Failure modes in mixed and lead-free soldering after reliability testing," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Simard-Normandin, Martine, Murison, Melody, Hebert, Daniel, and Fersht, Joseph, "Joint Integrity Characterization in Mixed and Lead-Free Soldering," Electronic Device Failure Analysis, vol. 8 no. 1, pp. 16-24, Feb. 2006.

Simmon, Eric, and Messina, John, "Understanding the IPC 175X Data Model," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S09:03.

Simmons, J. A., Parker, R. L., and Howard, R. E., "Theory of Whisker Growth and Evaporation," Journal of Applied Physics , vol. 35, pp. 2271-2272, 1964.

Simo, Grace L. Tsebo, Shirangi, Hossein, Nowottnick, Matthias, and Konstantin, Georg, "Influence of the Pad Design on the Reliability of PCB/BGA Assemblies under Drop Excitation," 2014 Electronics System-Integration Technology Conference, Helsinki, Finland, Sept. 16-18, 2014, pp. xx-xx.

Simon, Franz, Leyendecker, Klaus, Glaser, Franz, "New Tin-Alloy Electrolytes for the Deposition of Decorative and Functional Layers," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Simov, S. B., Kamadjiev, P. R., Gospodinov, M. M., and Gantcheva, V. F., "Observations of Hollow Cadmium Telluride Crystals with a Scanning Electron Microscope," Journal of Crystal Growth, vol. 26 no. 2, pp. 294-300, Dec. 1974.

Simov, S., Gantcheva, V., Kamadjiev, P., and Gospodinov, M., "Study of the Morphology of CdTe Whiskers by Scanning Electron Microscope," Journal of Crystal Growth, vol. 32 no. 1, pp. 133-136, Jan. 1976.

Simpson, Craig. "REACH And the Electronics Industry," ECN, vol. 53 no. 7, pp. 25, June 2009.

Simpson, Mike, "Where There's Muck, There's Money," Lighting Journal, vol. 70 no. 1, pp. 33,35, Jan./Feb. 2005.

Sinagra, C., Atienza, A., Ipock, A. W., and Pennestri, A., "Surface Cr Free Treatment for Aluminium Alloys: Influence of the Conversion Layer of Surface Treatments Based on Fluorine, Titanium and Zirconium on the Corrosion Resistance and on the Surface Energy of Aluminium Alloy AA 3003 For Honeycomb Application," Corrosion Reviews, vol. 25 no. 5-6, pp. 621-629, 2007.

Sindermann, S. P., Latz, A., Dumpich, G., Wolf, D. E., and zu Heringdorf, F.-J. Meyer, "Lattice dependent motion of voids during electromigration," Journal of Applied Physics, vol. 113, pp. 134505-1-134505-7, 2013.

Sines, G., Nakashima, A., and Hanna, W., "Uniformity of composition of alloy whiskers grown from the solid," Scripta Metallurgica, vol. 3 no. 8, pp. 589-590, Aug. 1969.

Sines, George, "Filamentary Crystals grown from the Solid Metal," Journal of the Physical Society of Japan, vol. 15 no. 7, pp. 1199-1210, July 1960.

Singh, Ashutosh K., Das, Bipul, Sen, Pintu, Bandopadhyay, Sujit Kumar, and Mandal, Kalyan, "Effect of a-Particle Irradiation on the Magnetic Properties of Ni Nanowires," IEEE Transactions on Magnetics, vol. 50 no. 11, pp. 2302104-1-2302104-4, Nov. 2014.

Singh, Bhupender, Menezes, Gary, McCann, Scott, Jayaram, Vidya, Ray, Urmi, Sundaram, Venky, Pulugurtha, Raj, Smet, Vanessa, and Tummala, Rao, "Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 7 no. 5, pp. 726-733, May 2017.

Singh, Narendra, Duan, Huabo, Ogunseitan, Oladele A., Li, Jinhui, and Tang, Yuanyuan, "Toxicity trends in E-Waste: A comparative analysis of metals in discarded mobile phones," Journal of Hazardous Materials, vol. 380, pp. 120898-1-120898-9, Dec. 15, 2019.

Singh, Nisha, Sahoo, Mihir Kumar, and Kale, P. G., "Effect of MACE parameters on length of porous silicon nanowires (PSiNWs)," Journal of Crystal Growth, vol. 496-497, pp. 10-14, Aug.-Sept. 2018.

Singh, Prabjit, Palmer, Larry, Fu, Haley, Lee, Dem, Lee, Jeffrey, Guo, Karlos, Li, Jane, Lee, Simon, Tong, Geoffrey, and Xu, Chen, "Second Round Robin Evaluation of iNEMI Creep Corrosion Qualification Test," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Singh, Prabjit, and Ohring, Milton, "Tracer study of diffusion and electromigration in thin tin films," Journal of Applied Physics, vol. 56 no. 4, pp. 899-907, Aug. 15, 1984.

Singh, Prashant, Srivastava, Sanjay K., Yameen, M., Sivaiah, B., Prajapati, Vijay, Prathap, P., Laxmi, Subha, Singh, B. P., Vandana, , Rauthan, C. M. S., and Singh, P. K., "Fabrication of vertical silicon nanowire arrays on three-dimensional micro-pyramid-based silicon substrate," Journal of Materials Science , vol. 50 no. 20, pp. 6631-6641, Oct. 2015.

Singh, S. S., Sarkar, R., Xie, H.-X., Mayer, C., Rajagopalan, J., and Chawla, N., "Tensile Behavior of Single-Crystal Tin Whiskers," Journal of Electronic Materials, vol. 43 no. 4, pp. 978-982, Apr. 2014.

SinghRanouta, Amarinder, and Fan, Xuejun, "Investigations of Solder Ball Drop Reliability: BGA versus WLP," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 626-631.

Sinha, Arv, "Effects of Thermal and Mechanical Fatigue on Organic SAC305 FC-PBGA Packages," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 597-600.

Sinha, Arv, and Kuczynski, Joe, "Mechanical and Thermal Characterization of Lead Free Solder," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 847-850.

Sinha, Koustav, Varghese, Joe, and Dasgupta, Abhijit, "Effect of geometric complexities and nonlinear material properties on interfacial crack behavior in electronic devices," Microelectronics Reliability, vol. 54 no. 3, pp. 610-618, Mar. 2014.

Sinha, Parikhit, Kriegner, Christopher J., Schew, William A., Kaczmar, Swiatoslav W., Traister, Matthew, and Wilson, David J., "Regulatory policy governing cadmium-telluride photovoltaics: A case study contrasting life cycle management with the precautionary principle," Energy Policy, vol. 36 no. 1, pp. 381-387, Jan. 2008.

Sinha, Saion, Gao, Bo, and Zhou, Otto, "Synthesis of silicon nanowires and novel nano-dendrite structures," Journal of Nanoparticle Research, vol. 6 no. 4, pp. 421-425, 2004.

Sinnott, Vincent, "Low Cost Lead-Free Soldering Technology to Improve Competitiveness of European SME," RoHS Compliance & LEADOUT Seminar, Dublin, Ireland, Sept. 22, 2005.

Sinsel, John A., "Plant Line Trial Evaluation of Viable Non-Chromium Passivation Systems for Electrolytin Tinplate (ETP),", June 2003.

Sinta, Roger, Naiman, Alaric, Weiss, Neal, and Ramirez, Ainissa, "Reactive Solders Improve Fiber Couplers and OE Bonding," Photonics Tech Briefs, vol. 31 no. 3, pp. 4a, 6a, Mar. 2007.

Siow, K. S., and Manoharan, M., "Combined Tensile-Shear Fracture Toughness Of A Lead-Tin And A Tin-Silver Solder," IPC/SMTA Electronics Assembly Expo 1998, Providence, RI, Oct. 24-29, 1998, pp. S19-3-1-S19-3-8.

Siow, Kim S., "Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?," Journal of Electronic Materials, vol. 43 no. 4, pp. 947-961, Apr. 2014.

Siow, Kim S., "Mechanical properties of nano-silver joints as die attach materials," Journal of Alloys and Compounds, vol. 514, pp. 6-19, Feb. 15, 2012.

Siplon, Jocelyn P., Ewell, Gary J., Frasco, Eric, Brusse, Jay A., and Gibson, Tom, "Tin Whiskers On Discrete Components: The Problem," Proceedings of the 28th International Symposium for Testing and Failure Analysis, Phoenix, AZ, Nov. 3-7, 2002, pp. 421-434.

Siroky, Georg, Kraker, Elke, Magnien, Julien, Kozeschnik, Ernst, Kieslinger, Dietmar, and Ecker, Werner, "Numerical study on local effects of composition and geometry in self-healing solders," 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Hanover, Germany, March 24-27, 2019, pp. xx-xx.

Sita, Z., and Biler, M., "Ta Capacitors with Conductive Polymer Robust to Leadfree Process," Proceedings of the 25th Symposium for Passive Components, Palm Springs, CA, Mar. 21-24, 2005, pp. 112-118.

Sitek, J., Drozd, Z., and Bukat, K., "Influence of PCBs Coatings Wettability on Lead-free SMT Solder Joints Reliability," 31st International Spring Seminar on Electronics Technology, Budapest, Hungary, May 7-11, 2008, pp. 55-60.

Sitek, Janusz, Rocak, Dubravka, Bukat, Krystyna, Fajfar-Plut, Janeta, and Belavic, Darko, "A comparison of the quality of lead-free solder pastes," Soldering & Surface Mount Technology, vol. 16 no. 3, pp. 22-30, 2004.

Sitek, Janusz, "Advantages of the Wetting balance Method for new lead-free materials evaluation," Proceedings of SPIE - The International Society for Optical Engineering, Volume 6159, Feb. 2006, pp. 61591W-1-61591W-12.

Sitek, Janusz, Drozd, Z., and Bukat, K., "Assembly Problems in Lead-free and Mix Production," 30th International Spring Seminar on Electronics Technology, Cluj-Napoca, Romania, May 9-13, 2007, pp. 298-303.

Sitek, Janusz, Zhang, Yan, Ma, Shiwei, Liu, Johan, Ga, Yulai, Zha, Qijie, Koscielski, Marek, Bukat, Krystyna, Arazna, Aneta, Jakubowska, Malgorzata, and Mlozniak, A., "Comparisons of Nano-Additives Influence on Properties of the Bi-Modal Solder Pastes for Special Applications," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 183-187.

Sitek, Janusz, Steplewski, Wojciech, Janeczek, Kamil, Koscielski, Marek, Lipiec, Krzysztof, Ciszewski, Piotr, and Krzaczek, Tomasz, "Influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP) technology," Soldering & Surface Mount Technology, vol. 27 no. 3, pp. 98-102, 2015.

Sitek, Janusz, and Bukat, Krystyna, "Influence of Flux Activity on Process Parameters and Solder Joints in Lead-Free Wave Soldering," 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, Vienna, Austria, May 19-20, 2005, pp. 100-105.

Sitek, Janusz, and Koscielski, Marek, "Influence of micro additives on printing and electric parameters of conductive adhesives for printing electronic applications," Circuit World, vol. 40 no. 1, pp. 2-6, 2014.

Sitek, Janusz, Koscielski, Marek, Bukat, Krystyna, Niedzwiedz, Wojciech, Jakubowska, Malgorzata, and Mlozniak, Anna, "Influence of modified carbon nanotubes addition to SAC solder paste on solder joints properties and their thermal and mechanical fatigue," Electronics Goes Green 2012+, Berlin, Germany, Sept. 9-12, 2012, pp. xx-xx.

Sitek, Janusz, Koscielski, Marek, Zhang, Yan, Fan, Jing-yu, Ma, Shiwei, and Liu, Johan, "Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 151-154.

Sitek, Janusz, Bukat, Krystyna, Borecki, Janusz, and Ionescu, Ciprian, "Influence of the Cu Substrate Surface Energy on Lead-Free Solder Paste Wetting Properties," 26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials, The High Tatras, Slovak Republic, May 8-11, 2003, pp. 239-243.

Sitek, Janusz, Arazna, Aneta, Janeczek, Kamil, Steplewski, Wojciech, Lipiec, Krzysztof, Futera, Konrad, and Ciszewski, Piotr, "Influence of thermal cycling on reliability of solder joints executed on long and metal core PCBs," Soldering & Surface Mount Technology, vol. 27 no. 3, pp. 120-124, 2015.

Sitek, Janusz, Koscielski, Marek, Arazna, Aneta, Janeczek, Kamil, and Steplewski, Wojciech, "Investigations of BGA components' balls remanufacturing techniques for Circular Economy applications," 2018 7th Electronic System-Integration Technology Conference, Dresden, Germany, Sept. 18-21, 2018, pp. xx-xx.

Sivakov, Vladimir, Heyroth, Frank, Falk, Fritz, Andra, Gudrun, and Christiansen, Silke, "Silicon nanowire growth by electron beam evaporation: Kinetic and energetic contributions to the growth morphology," Journal of Crystal Growth , vol. 300 no. 2, pp. 288-293, Mar. 15, 2007.

Sivasubramaniam, V., Galli, M., Cugnoni, J., Janczak-Rusch, J., and Botsis, J., "A Study of the Shear Response of a Lead-Free Composite Solder by Experimental and Homogenization Techniques," Journal of Electronic Materials, vol. 38 no. 10, pp. 2122-2131, Oct. 2009.

Sivasubramaniam, V., Bosco, N. S., Janczak-Rusch, J., Cugnoni, J., and Botsis, J., "Interfacial Intermetallic Growth and Strength of Composite Lead-Free Solder Alloy Through Isothermal Aging," Journal of Electronic Materials, vol. 37 no. 10, pp. 1598-1604, Oct. 2008.

Siviour, C. R., Walley, S. M., Proud, W. G., and Field, J. E., "Mechanical properties of SnPb and lead-free solders at high rates of strain," Journal of Physics D: Applied Physics, vol. 38 no. 22, pp. 4131-4139, 2005. https://doi-org.ezproxy.uky.edu/10.1088/0022-3727/38/22/018

Sjoberg, Jonas, Lee, Jenson, Aranda, Ranilo, and Geiger, David, "0.3mm Pitch CSP Process Development and Printed Circuit Board (PCB) Design," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 57-63.

Sjoberg, Jonas, and Morr, Andreas, "Alternative Assembly Options to Achieve Cost Effective and Reliable Handheld Products," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 485-494.

Sjoberg, Jonas, Aranda, Ranilo, Geiger, David, and Kurwa, Murad, "Assembly and Design Challenges for New Generation 0.4/0.4mm Pitch Package on Package (POP) and 0.3mm Pitch Chip Scale Package (CSP)," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 101-108.

Sjoberg, Jonas, Aranda, Ranilo, Pang, David, Geiger, David, and Kurwa, Murad, "Lead-Free and Halogen Free Solder Flip Chips Integration on Board Using SMT Process," South East Asia Technical Training Conference on Electronics Assembly Technologies 2014 Proceedings, Penang, Malaysia, Apr. 8-10, 2014, pp. xx-xx.

Sjoberg, Jonas, Aranda, Ranilo, Pang, Dick, Geiger, David A., and Kurwa, Murad, "Lead-Free and Halogen Free Solder Flip Chips on board using SMT processes and materials for miniaturization and lower cost," 2013 IEEE 15th Electronics Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp. 483-488.

Sjoberg, Jonas, Geiger, David A., Shangguan, Dongkai, and Castello, Todd, "Lead-Free Solder Flip Chips on FR-4 Substrates with Different Surface Finishes, Underfills and Fluxes," Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, San Jose, CA, July 14-16, 2004, pp. 31-36.

Sjoberg, Jonas, Geiger, David A., Castello Todd, and Shangguan, Dongkai, "Package on package (PoP) process development and reliability evaluation," Global SMT and Packaging, vol. 7 no. 10, pp. 34-36, 38, Oct. 2007.

Sjoberg, Jonas, Geiger, David A., and Shangguan, Dongkai, "Process Development and Reliability Evaluation for Inline Package-on-Package (PoP) Assembly," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 2005-2010.

Sjoberg, Jonas, Lee, Jensen, and Shangguan, Dongkai, "Process Development and Reliability Study with Anisotropic Conductive Film Bonding as a Replacement for Surface Mount Connectors and Hotbar Soldering," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 333-339.

Skidmore, Tim, and Walters. Karen, "Lead-Free Research: Optimizing Solder Joint Quality," Circuits Assembly , vol. 11 no. 4, pp. 38,40,42,44-45, Apr. 2000.

Skinner, Tony, "Industries prepare for changes to EU environmental legislation," Jane's Defence Weekly, vol. 42 no. 34, pp. 31, Aug. 24, 2005.

Skomski, R., Zeng, H., Zheng, M., and Sellmyer, D. J., "Magnetic localization in transition-metal nanowires," Physical Review B , vol. 62 no. 6. pp. 3900-3904, Aug. 1, 2000.

Skove, M. J., and Stillwell, E. P., "Size Effects in Residual Resistance Ratios for Zinc "Whiskers"," Applied Physics Letters, vol. 7 no. 9, pp. 241-242, Nov. 1, 1965.

Skowronski, Gloria A., Seide, Margaret, and Abdel-Rahman, Mohamed S., "Oral Bioaccessibility of Trivalent and Hexavalent Chromium in Soil by Simulated Gastric Fluid," Journal of Toxicology and Environmental Health Part A, vol. 63 no. 5, pp. 351-362, July 2001.

Skwarek, A., Ratajczak, J., Czerwinski, A., Witek, K. and Kulawik, J., "Effect of Cu addition on whisker formation in tin-rich solder alloys under thermal shock stress," Applied Surface Science, vol. 255 no. 15, pp. 7100-7103, 2009.

Skwarek, A., Kulawik, J., and Witek, K., "Induction of Tin Pest Transformation in Solder Joints in Ceramic Packages of Sub-THz Scanner," 2015 38th International Spring Seminar on Electronics Technology, Eger, Hungary, May 6-10, 2015, pp. 47-51.

Skwarek, A., Witek, K., Pluska, M., and Czerwinski, A., "Tin Whisker Growth on the Surface of Tin-Rich Lead-Free Alloys," Surface Mount Technology (SMT), vol. 30 no. 2, pp. 56,58-60, Feb. 2015.

Skwarek, Agata, Kulawik, Jan, Czerwinski, Andrzej, Pluska, Mariusz, and Witek, Krzysztof, "A method for the tin pest presence testing in SnCu solder alloys," Soldering & Surface Mount Technology, vol. 26 no. 3, pp. 110-116, 2014.

Skwarek, Agata, Pluska, Mariusz, Ratajczak, Jacek, Czerwinski, Andrzej, Witek, Krzysztof, and Szwagierczak, Dorota, "Analysis of tin whisker growth on lead-free alloys with Ni presence under thermal shock stress," Materials Science and Engineering B: Solid-State Materials for Advanced Technology, vol. 176 no. 4, pp. 352-357, 2011. https://doi.org/10.1016/j.mseb.2010.10.001

Skwarek, Agata, Illes, Balazs, Synkiewicz, Beata, Wronski, Sebastian, Tarasiuk, Jacek, and Witek, Krzysztof, "Characterization of solder joints made with VPS on DBC substrate," Journal of Materials Science: Materials in Electronics, vol. 28 no. 2, pp. 1769-1776, Jan. 2017.

Skwarek, Agata, Illes, Balazs, and Geczy, Attila, "Characterization of Tin Pest by Electrical Resistance Measurement," 2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging, Oradea, Romania, Oct. 20-23, 2016, pp. 294-299.

Skwarek, Agata, Illes, Balazs, Hurtony, Tamas, Busek, David, and Dusek, Karel, "Effect of Recrystallization on b to a-Sn Allotropic Transition in 99.3Sn-0.7Cu wt. % Solder Alloy Inoculated with InSb," Materials, vol. 13 no. 4, pp. 968-978, Feb. 2020.

Skwarek, Agata, Illes, Balazs, Horvath, Barbara, Geczy, Attila, Zachariasz, Piotr, and Busek, David, "Identification and characterization of b-a-Sn transition in SnCu1 bulk alloy inoculated with InSb," Journal of Materials Science: Materials in Electronics, vol. 28 no. 21, pp. 16329-16335, Nov. 2017.

Skwarek, Agata, Zachariasz, Piotr, Kulawik, Jan, and Witek, Krzysztof, "Inoculator dependent induced growth of a-Sn," Materials Chemistry and Physics, vol. 166, pp. 16-19, Sept. 15, 2015.

Skwarek, Agata, Sroda, Marcin, Pluska, Mariusz, Czerwinski, Andrzej, Ratajczak, Jacek, and Witek, Krzysztof, "Occurrence of tin pest on the surface of tin-rich lead-free alloys," Soldering & Surface Mount Technology, vol. 23 no. 3, pp. 184-190, 2011.

Skwarek, Agata, Illes, Balazs, Witek, Krzysztof, Hurtony, Tamas, Tarasiuk, Jacek, Wronski, Sebastian, and Synkiewicz, Beata Kinga, "Reliability studies of InnoLot and SnBi joints soldered on DBC substrate," Soldering & Surface Mount Technology, vol. 30 no. 4, pp. 205-212, 2018.

Skwarek, Agata, Witek, Krzysztof, and Ratajczak, Jacek, "Risk of whiskers formation on the surface of commercially available tin-rich alloys under thermal shocks," Microelectronics Reliability, vol. 49 no. 6, pp. 569-572, June 2009. https://doi.org/10.1016/j.microrel.2009.02.026

Slack, Rebecca J., Zerva, Panagoula, Gronow, Jan R., and Voulvoulis, Nikolaos, "Assessing Quantities and Disposal Routes for Household Hazardous Products in the United Kingdom," Environmental Science & Technology, vol. 39 no. 6, pp. 1912-1919, 2005.

Slee, Daren, Stepan, Jeremiah, Wei, Wei, and Swart, Jan, "Introduction to Printed Circuit Board Failures," 2009 IEEE Symposium on Product Compliance Engineering Proceedings, Toronto, Ontario, Oct. 26-28, 2009, pp. xx-xx.

Slee, Daren, Stepan, Jeremiah, Wei, Wei, and Swart, Jan, "Introduction to Printed Circuit Board Failures," 2011 IEEE Symposium on Product Compliance Engineering, San Diego, CA, Oct. 10-12, 2011, pp. xx-xx.

. Slezak, Eric, "REACH at Indium Corporation," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. xx-xx.

Slifka, A. J., and Drexler, E. S., "Characterization of Interfaces Involving Electrically Conductive Adhesives using Electron-Beam Moire and Infrared Microscopy," 2000 Proceedings 50th Electronic Components & Technology Conference , Las Vegas, NV, May 21-24, 2000, pp. 403-407.

Slifka, A. J., and Drexler, E. S., "Thermomechanical Effects in Embedded Passive Materials," Journal of Electronic Materials, vol. 31 no. 4, pp. 286-291, Apr. 2002.

Sloan, Meagan, Flanagan, Kim, Sandy-Smith, Brook, and Allen, M. B., "Reflow Profiling for Next-Generation Solder Alloys," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Sloan, Meagan, Flanagan, Kim, Sandy-Smith, Brook, and Allen, M. B., "Reflow Profiling for Next-Generation Solder Alloys," Global SMT and Packaging, vol. 19 no. 4, pp. 12-17, Apr. 2019.

Sloboda, Laura, Kennedy, Thomas, Liu, Julie, Ramjattan, Deepchand, and Turbini, Laura, "Corrosion Study of Lead-free Solders Exposed to Artificial Sweat," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 16-18, 2012, pp. xx-xx.

Sloboda, Laura, Kennedy, Thomas, Liu, Julie, Ramjattan, Deepchand, Wang, Nancy, and Turbini, Laura J., "Corrosion Study of Lead-Free Solders Exposed to Artificial Sweat," SMTAnews & Journal of Surface Mount Technology, vol. 26 no. 3, pp. 31-38, July-Sept. 2013.

Slovick, Murray, "RoHS revisions: Nothing drastic," Electronic Products, vol. 51 no. 9, pp. 41-42, Feb. 2009.

Slupska, M., and Ozga, P., "Electrodeposition of Sn-Zn-Cu alloys from citrate solutions," Electrochimica Acta, vol. 141, pp. 149-160, Sept. 20, 2014.

Small, Darryl J., and Eisenach, Brian, "Electrically Conductive Adhesives: Characteristics and Applications," SMT, vol. 12 no. 9, pp. 52-54, Sept. 1998.

Small, Darryl J., and Biocca, Peter, "Lead-free solders vs. conductive adhesives," Advanced Packaging , vol. 9 no. 9, pp. xx-xx, Oct. 2000.

Small, Darryl J., "Reliability Considerations of Electrically Conductive Adhesives," Proceedings of the Technical Program NEPCON West '99, Volume 1, Anaheim, CA, Feb. 23-25, 1999, pp. 367-374.

Smart, D., Such, T. E., and Wake, S. J., "A Novel Trivalent Chromium Electroplating Bath," Transactions of the Institute of Metal Finishing, vol. 61 no. 3, pp. 105-110, Autumn 1983.

Smart, R. F., and Robins, D. A., "The Structural Stability of Tin-Nickel Electrodeposits," Transactions of the Institute of Metal Finishing, vol. 37, pp. 108-109, 1960.

Smeby, J. M., "Behavior of Solder Materials in Surface Mount Applications," Proceedings of ASM's 2nd Electronic Packaging: Materials and Processes Conference, Bloomington, MN, Oct. 29-31, 1985, pp. 97-107.

Smelik, Eugene A., McLenaghanm James, and Belmonte, Joe, "The Formal Development of a Pb-Free Electronics Manufacturing Operation," IPC SMEMA Council APEX 2002, San Diego, CA, Jan. 22-24, 2002, pp. xx-xx.

Smetana, Joe, Birch, Bill, and Rothschild, Wayne, "A Standard Multilayer Printed Wiring Board for Material Reliability Evaluations," IPC/APEX, Las Vegas, NV, April 12-14, 2011, pp. xx-xx.

Smetana, Joe, "A Standard Multilayer Printed Wiring Board for Material Reliability Evaluations," Tin Whisker Group teleconference, Jan. 18, 2012.

Smetana, Joe, Sack, Thilo, Rothschild, Wayne, Birch, Bill, and Morton, Kim, "Bare Board Material Performance after Pb-Free Reflow," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Smetana, Joe, Morton, Kim, and Sack, Thilo, "Conductive Anodic Filament (CAF) Performance of PWB Materials Before and After Pb-free Reflow," SMTA International 2013 Conference Proceedings , Fort Worth, TX, Oct. 13-17, 2013, pp. 459-469.

Smetana, Joe, Horsley, Rob, Lau, John, Snowdon, Ken, Shangguan, Dongkai, Gleason, Jerry, Memis, Irv, Love, Dave, Dauksher, Walter, and Sullivan, Bob, "Design, materials and process for lead-free assembly of high-density packages," Soldering & Surface Mount Technology, vol. 16 no. 1, pp. 53-62, 2004.

Smetana, Joe, "HDPUG Pb-Free Board Materials Reliability Project 2: Moisture Sensitivity and Its Effect on Delamination," Tin Whisker Group teleconference, Feb. 29, 2012.

Smetana, Joe, Horsley, Rob, Lau, John, Snowdon, Ken, Shangguan, Dongkai, Gleason, Jerry, Memis, Irv, Love, Dave, Dauksher, Walter, and Sullivan, Bob, "HDPUG's Lead-Free Design, Materials and Process of High Density Packages," IPC SMEMA Council APEX 2003, Anaheim, CA, Mar. 31-Apr. 2, 2003, pp. xx-xx.

Smetana, Joe, and Sack, Thilo, "High-Complexity, Thermally Challenging Pb-Free Product Recommendations," Circuits Assembly, vol. 17 no. 3, pp. 56-57, Mar. 2006.

Smetana, Joe, Lau, John, McDermott, Sean, Chiang, Diana, Chin, Vicki, Mei, Zequn, Parker, Richard, Benedetto, Elizabeth, Henshall, Greg, Schroeder, Valeska, Galyon, George T., Gedney, Ronald, Coyle, Richard, Planinsek, Frances, Reynolds, Heidi, Love, David, and Hilty, Bob, "iNEMI Recommendations on Lead Free Finishes for Components Used in High-Reliability Products," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S04-02-1-S04-02-11.

Smetana, Joe, "iNEMI Recommendations on Lead Free Finishes for Components Used in High-Reliability Products," Tin Whisker Group teleconference, June 10, 2009.

Smetana, Joe, "iNEMI updates tin whisker recommendations," Global SMT and Packaging, vol. 7 no. 6, pp. 14, 16-18, June 2007.

Smetana, Joe, and Sack, Thilo, "Lead-Free Product Recommendations," Printed Circuit Design and Manufacture, vol. 23 no. 3, pp. 16, 18, Mar. 2006.

Smetana, Joe, "Minimizing Tin Whiskers," Surface Mount Technology (SMT), vol. 19 no. 8, pp. xx-xx, Aug. 2005.

Smetana, Joe, "NEMI Tin Whisker User Group," July 28, 2004.

Smetana, Joe, "NIPP-NPP-2009-053,"

Smetana, Joe, Coyle, Richard, Sack, Thilo, Syed, Ahmer, Love, David, Tu, Danny, and Kummerl, Steve, "Pb-free Solder Joint Reliability in a Mildly Accelerated Test Condition," IPC APEX Expo Technical Conference 2011, Las Vegas, NV, April 12-14, 2011, pp. 2686-2735.

Smetana, Joe, "Pb-free Solder Joint Reliability in a Mildly Accelerated Test Condition," Tin Whisker Group teleconference, Aug. 10, 2011.

Smetana, Joe, Birch, Bill, Sack, Thilo, Morton, Kim, Yu, Marie, Katzko, Chris, Helminen, Erkko, and Luo, Laura, "Reliability Testing of PWB Plated through Holes in Air-to-Air Thermal Cycling and Interconnect Stress Testing after Pb-free Reflow Preconditioning," IPC/APEX, Las Vegas, NV, April 12-14, 2011, pp. xx-xx.

Smetana, Joe, "Reliability Testing of PWB Plated through Holes in Air-to-Air Thermal Cycling and Interconnect Stress Testing after Pb-free Reflow Preconditioning," Tin Whisker Group teleconference, Jan. 18, 2012.

Smetana, Joe, and Sullivan, Bob, "Solder Joint Reliability of Wafer Scale CSP Packages," Proceedings 2002 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4931), Denver, CO, Sept. 4-6, 2002, pp. 216-222.

Smetana, Joe, "The Effects of Lead-Free Reflow On Conductive Anodic Filament (CAF) Performance of Materials," Tin Whisker Group teleconference, Feb. 8, 2012.

Smetana, Joe, "The Effects of Non-filled Microvia in Pad on Pb-free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal Cycling," Tin Whisker Group teleconference, July 27, 2011.

Smetana, Joe, "Theory of Tin Whisker Growth: "The End Game"," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 1, pp. 11-22, Jan. 2007.

Smetana, Joe, "Theory of Tin Whisker Growth "The End Game"," iNEMI Tin Whisker Workshop at ECTC May 31, 2005 Updated 2007.

Smetana, Joe, "Theory of Tin Whisker Growth "The End Game"," Tin Whisker Group teleconference, May 13, 2009.

Smetana, Joe, Coyle, Richard, Read, Peter, Koshmeider, Thomas, Love, Dave, Kolenik, Mark, and Nguyen, Jennifer, "Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S23_01-1-S23_01-23.

Smetana, Joe, and Gedney, Ron, "Tin Whisker Management Guidelines," Dec. 1, 2005.

Smetana, Joe, and Gedney, Ron, "Tin Whisker Management Guidelines," Circuits Assembly, vol. 16 no. 12, pp. 42, Dec. 2005.

Smetana, Joe, and Gedney, Ron, "Tin Whisker Management Guidelines," Printed Circuit Design and Manufacture, vol. 22 no. 12, pp. 14, 16-17, Dec. 2005.

Smetana, Joe, and Gedney, Ron, "Tin Whisker Management Guidelines, Part 2," Jan. 1, 2006.

Smetana, Joe, and Gedney, Ron, "Tin Whisker Management Guidelines, Part 2," Circuits Assembly , vol. 17 no. 1, pp. 64-65, Jan. 2006.

Smetana, Joe, and Gedney, Ron, "Tin Whisker Management Guidelines, Part 2," Printed Circuit Design and Manufacture, vol. 23 no. 1, pp. 14, Jan. 2006.

Smetana, Joseph, Coyle, Richard, Read, Peter, Popowich, Richard, Fleming, Debra, and Sack, Thilo, "Variations in Thermal Cycling Response of Pb-free Solder Due to Isothermal Preconditioning," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 641-654.

Smetana, Joe, "Variations in Thermal Cycling Response of Pb-free Solder Due to Isothermal Preconditioning," Tin Whisker Group teleconference, Mar. 7, 2012.

Smetana, Joe, "Via (Plated Through Hole) Integrity with Lead Free Soldering," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S24-03-1-S24-03-19.

Smink, Carla K., "Vehicle recycling regulations: lessons from Denmark," Journal of Cleaner Production, vol. 15 no. 11-12, pp. 1135-1146, 2007.

Smith, A. M., Watson, A., and Vaughan, D. H., "The Role of Oligomeric Olated Species in the Deposition Rate of Chromium from a Commercial Chromium (III) Electrolyte," Transactions of the Institute of Metal Finishing, vol. 71 no. 3, pp. 106-112, Aug. 1993.

Smith, Brian, "A Proposed Mechanism and Remedy for Ball-in-Socket and Foot-in-Mud Soldering Defects on Ball Grid Array and Quad Flat Pack Components," Circuitnet.

Smith, Brian, "Preparing for Life Without Lead," IEE Manufacturing Engineer, vol. 82 no. 6, pp. 44-47, Dec. 2003/Jan. 2004.

Smith, Brian, "Preparing for life without lead," Elektron, vol. 22 no. 5, pp. 27-28, May 2005.

Smith, Brian, and Scala, Linda, "STRATEGIES for Lead-free transition," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, July 2003.

Smith, Bryan, and AKhaghi, Siamak, "Alloy Electroplating: The best solution for Au-Sn solder?," flipchips.com.

Smith, C. A., "The application of X-rays in the failure analysis of electronic devices and systems," Circuit World, vol. 34 no. 3, pp. 31-39, 2008.

Smith, Chris, "UK RoHS Enforcement," SMART Group "All You Ever Wanted to Know About Lead-Free" Seminar, High Wycombe, United Kingdom, Nov. 1, 2005.

Smith, D., Small, M., Dodds, R., Amagai, S., and Strong, T., "Computer monitor recycling: a case study," Engineering Science and Education Journal, vol. 5 no. 4, pp. 159-164, Aug. 1996.

Smith, Ed, and Swanger, Kristine, "Environmental Impact of Lead-free Solders," Surface Mount Technology (SMT), vol. 13 no. 7, pp. xx-xx, July 1999.

Smith, Edwin B., and Swanger, L. Kristine, "Toxicity and Worldwide Environmental Regulation of Lead-Free Solders," Transactions of the Institute of Metal Finishing, vol. 78 part 2, pp. B18-B21, Mar. 2000.

Smith III, Edwin B., and Swanger, L. Kristine, "Are Lead-free Solders Really Environment Friendly?," Surface Mount Technology (SMT), vol. 13 no. 3, pp. xx-xx, Mar. 1999.

Smith III, Edwin B, "Environmental Impacts and Toxicity of Lead Free Solders," KTEC Electronics.

Smith III, Edwin B., "Environmental Impacts and Toxicity of Lead Free Solders," IPC Works '99, Minneapolis, MN, Oct. 23-28, 1999, pp. xx-xx.

Smith III, Edwin B., and Swanger, L. Kristine, "Lead Free Solders - A Push in the Wrong Direction?," IPC Printed Circuits Expo 1999, Long Beach, CA, Mar. 14-18, 1999, pp. F-10-1-F-10-6.

Smith, Emma L., Abbott, Andrew P., Griffin, Jason, Harris, Robert C., O'Connor, Cecil, and Ryder, Karl S., "Pilot trials of immersion silver deposition using a choline chloride based ionic liquid," Circuit World, vol. 36 no. 1, 2010, pp. 3-9.

Smith, George A., "How to Avoid Metallic Growth on Electronic Hardware," Circuits Manufacturing, vol. 17 no. 7, pp. 66,68,70-72, July 1977.

Smith, Gerald R., "Lead," Minerals Yearbook: Volume I. -- Metals and Minerals, 2003.

Smith, H. G., and Rundle, R. E., "X-Ray Investigation of Perfection in Tin Whiskers," Journal of Applied Physics, vol. 29 no. 4, pp. 679-683, Apr. 1958.

Smith, Hillary, "Electromigration in Single-Crystal Copper Whiskers," Aug. 20, 2005.

Smith, J. Eric, "Zinc Whiskers: Could They Happen to You?," EDI.

Smith, J. F., "The Surface Texture of Electrodeposited Tin," Transactions of the Institute of Metal Finishing, vol. 46, pp. 199-200, 1968.

Smith, J. F., "Whisker Growth on Electrodeposited Tin," Transactions of the Institute of Metal Finishing, vol. 45, pp. 9-11, 1967. https://doi.org/10.1080/00202967.1967.11870012

Smith, J. R., Larson, C., and Campbell, S. A., "Recent applications of SEM and AFM for assessing topography of metal and related coatings - a review," Transactions of the IMF, vol. 89 no. 1, pp. 18-27, 2011. https://doi.org/10.1179/174591910X12922367327388

Smith, Jason M., "Basic Metallurgy and Wavesoldering Trends," Surface Mount Technology (SMT), vol. 15 no. 2, pp. xx-xx, Feb. 2001.

Smith, Jeffrey S., and Mendeloff, John M., "A Quantitative Analysis of Factors Affecting PELs and TLVs for Carcinogens," Risk Analysis, vol. 19 no. 6, pp. 1223-1234, Dec. 1999.

Smith, Jim, "BEING GREEN Can Make You See Red," Printed Circuit Design and Manufacture, vol. 22 no. 6, pp. 26, 28-29, June 2005.

Smith, Jim, "Green First," Avnet Advantage, Aug. 2005.

Smith, Jim, "Green Update," Avnet Advantage, Apr. 2005.

Smith, Jim, "Keeping inventory levels in shape," Green SupplyLine, Aug. 1, 2005.

Smith, Jim, "RoHS: the next six months," Green SupplyLine, Junly 3, 2006.

Smith, Kenneth L., Hession-Kunz, Drew, and Sackett, Donald W., "High Through-put Production Material Screening Methods for RoHS Compliance," 2007 Pan Pacific Microelectronics Symposium & Exhibit, Maui, HI, Jan. 30-Feb. 1, 2007, pp. xx-xx.

Smith, Laura, "Get the Lead Out," Quality Digest, vol. 25 no. 12, pp. 8, Dec. 2005.

Smith, Laura, "Thorny RoHS," Quality Digest, vol. 27 no. 3, pp. 10, Mar. 2007.

Smith, Michael, "Lead-Free Test and Inspection," Assembly, vol. xx no. xx, pp. xx-xx, Dec. 2004.

Smith, Michael J., "Making the switch to lead-free solder," EMasia, Nov. 2004.

Smith, Michael, "Switching to Lead-Free Solder: Test And Inspection Issues," OnBoard Technology, vol. xx no. xx, pp. 50-52, Apr. 2004.

Smith, Michael J., "Test and Inspection of Lead-Free Assemblies," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S27-3-1-S27-3-3.

Smith, R. W., and Raynor G. V., "The Effect of Liquid Media on the Grey Tin <==> White Tin Transformation in Commercially Pure Tin," Proceedings of the Physical Society, section B vol. 70 part 12, pp. 1135-1142, Dec. 1957.

Smith, R. W., "The Grey Tin <--> White Tin Transition in Tin-Mercury Alloys," Canadian Journal of Physics, vol. 37 no. 10, pp. 1079-1084, Oct. 1959.

Smith, R. W., "The White Tin -> Grey Tin Transition in Tin-Mercury Alloys," Canadian Journal of Physics, vol. 38 no. 5, pp. 588-592, May 1960.

Smith, Reginald W., "The alpha (Semiconductor) <=> beta (Metal) Transformation in Tin," Journal of the Less-Common Metals, vol. 114, pp. 69-80, 1985.

Smith, Ronald W., Vianco, P., Hernandez, C., Lugscheider, E., Rass, I., and Hillen, F., "A New Active Solder for Joining Electronic Components," Sandia Report SAND2000-1191C.

Smith, Ronald W., "Active Solder Joining of Metals, Ceramics and Composites," Welding Journal, vol. 80 no. 10, pp. 30-35, Oct. 2001.

Smith, Selena, Zeng, Guang, Read, Jonathan, McDonald, Stuart D., and Nogita, Kazuhiro, "Peritectic Reactions and Phase Transformations of Sn-30wt%Cu for High Temperature Pb-free Soldering Applications," Materials Science Forum , vol. 857, pp. 58-62, May 2016.

Smith, Sherri L., Cheng, Chih-Min, O'Hara, Wanda, and Buffa, Vito, "Cure Processing Effect on Conductive Epoxy Adhesives as Solder Alternatives: Ceramic Applications," 2003 SMTA International Conference Proceedings , Chicago, IL, Sept. 21-25, 2003, pp. 722-727.

Smith, Steve, "Fluid Physics," Tin Whisker Group teleconference, July 13, 2011.

Smith, Steve, Rollins, Bill, and Minter, Charlie, "The Whisker-Tough Conformal Coating: A Certain Solution to an Uncertain Problem," DMC 2010, Las Vegas, NV, Nov. 29-Dec. 2, 2010, pp. xx-xx.

Smith, Steve, Rollins, Bill, and Minter, Charlie, "The Whisker-Tough Conformal Coating: A Certain Solution to an Uncertain Problem," Tin Whisker Group teleconference, Dec. 8, 2010.

Smith, Steve, "Tin whisker captivation by the Whisker-Tough Magnum(TM) conformal coating," Tin Whisker Group teleconference, June 1, 2016.

Smith, Ulf, Kristensen, Nils, Ericson, Fredric, and Schweitz, Jan-Ake, "Local stress relaxation phenomena in thin aluminum films," Journal of Vacuum Science & Technology A: Vacuum Surfaces, and Films, vol. 9 no. 4, pp. 2527-2535, July/Aug. 1991.

Smith, Zachary R., Smith, Rosemary L., and Collins, Scott D., "Mechanism of nanowire formation in metal assisted chemical etching," Electrochimica Acta, vol. 92, pp. 139-147, Mar. 1, 2013.

Smock, Doug, "Design for Disassembly," Design News, vol. 62 no. 17, pp. 49-50, 52, Nov. 19, 2007.

Smock, Doug, "New tungsten Moldings Offer Alternatives to Lead," Design News , vol 62 no. 11, pp. 51, Aug. 13, 2007.

Smogunov, A. N., Kurkina, L. I., Kurganskii, S. I., and Farberovich, O. V., "Electronic structure of simple metal whiskers," Surface Science, vol. 391 no. 1-3, pp. 245-251, Nov. 26, 1997.

Smooha, Y., and Komem, Y., "The Growth of Whiskers in Gold Films Due to High Current Densities," Journal of Crystal Growth, vol. 38 no. 2, pp. 149-154, May 1977.

Smythe, J. A., "Notes on Ancient and Roman Tin and its Alloys with Lead," Transactions of the Newcomen Society, vol. 18, pp. 255-265, 1937-1938. https://doi.org/10.1179/tns.1937.021

Snider, Kristal, "A Time for Change - Part 1: The Not So Hidden Truth Behind the Chinese Open Market," ERAI Special Report, Apr. 16, 2007.

Snider, Kristal, and DiMase, Daniel J., "Avoiding and Resolving Disputes over Unsatisfactory Components," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 95-105.

Snipes, E. K., Flowers, G. T., Lall, P., and Bozack, M. J., "Impact of Thermal Cycling and Background Gas Environment on Tin Whiskering," 2014 IEEE 60th Holm Conference on Electrical Contacts, New Orleans, LA, Oct. 12-15, 2014, pp. xx-xx.

Snipes, E. K., Flowers, G. T., Lall, P., and Bozack, M. J., "Influence on Sn Whiskering of Controlled Bismuth Additions to Sputtered Sn Films," 2015 IEEE 61st Holm Conference on Electrical Contacts, San Diego, CA, Oct. 11-14, 2015, pp. 54-58.

Snipes, E. K., Flowers, G.,T., Lall, P., and Bozack, M. J., "Role of Incorporated Hydrogen and Sputtered Grain Size on Tin Whiskering," 2013 IEEE 59th Holm Conference on Electrical Contacts, Newport, RI, Sept. 22-25, 2013, pp. xx-xx.

Snoeckx, Koen, Vandevelde, Bart, and Ratchev, Petar, "Zuverlassigkeit bleifreier Lotstellen," Elektronik, vol. 54 no. 8, pp. 60-63, Apr. 18, 2005.

Snowdon, K. G., Tanner, C. G., and Thompson, J. R., "Lead Free Soldering Electronic Interconnect: Current Status and Future Developments," 2000 Proceedings 50th Electronic Components & Technology Conference , Las Vegas, NV, May 21-24, 2000, pp. 1416-1419.

Snowdon, Ken, Whitaker, Brian, and Ford, Anna, "WEEE: a Directive to far?," Engineering Science and Education Journal , vol. 9 no. 1, pp. 42-48, Feb. 2000.

Snugovsky, L., Perovic, D. D., Rutter, J. W., and Snugovsky, P., "Control of "Spalling" in SAC Pb-Free Solder Alloys When Used with a Ni Substrate," International Conference on Soldering and Reliability , Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

Snugovsky, L., Snugovsky, P., Perovic, D. D., and Rutter, J. W., "Effect of cooling rate on microstructure of Ag-Cu-Sn solder alloys," Materials Science and Technology, vol. 21 no. 1, pp. 61-68, Jan. 2005.

Snugovsky, L., Ruggiero, M. A., Perovic, D. D., and Rutter, J. W., "Experiments on interaction of liquid tin with solid copper," Materials Science and Technology, vol. 19 no. 7, pp. 866-874, July 2003.

Snugovsky, L., Perovic, D. D., and Rutter, J. W., "Experiments on the aging of Sn-Ag-Cu solder alloys," Materials Science & Technology, vol. 20 no. 8, pp. 1049-1054, Aug. 2004.

Snugovsky, L., Perovic, D. D., and Rutter, J. W., "Experiments on the aging of Sn-Ag-Cu solder alloys," Powder Metallurgy , vol. 48 no. 2, pp. 193-198, June 2005.

Snugovsky, L., Snugovsky, P., Perovic, D. D., and Rutter, J. W., "Formation of intermetallic compounds with Sn-Zn-Al solder on copper and electroless nickel-immersion gold substrates," Materials Science and Technology, vol. 23 no. 10, pp. 1161-1166, Oct. 2007.

Snugovsky, L., Snugovsky, P., Perovic, D. D., and Rutter, J. W., "Formation of microstructure in Ag-In-Sn solder alloys," Materials Science and Technology, vol. 23 no. 4, pp. 432-437, Apr. 2007.

Snugovsky, L., Snugovsky, P., Perovic, D. D., and Rutter, J. W., "Formation of microstructure resulting from quasi-peritectic reactions during freezing of Bi-Pb-Sn and Cu-Ni-Sn ternary alloys," Materials Science and Technology, vol. 24 no. 2, pp. 245-249, Feb. 2008.

Snugovsky, L., Snugovsky, P., Perovic, D. D., and Rutter, J. W., "Microstructure of Ag-In-Sn (Pb-free) Solder Alloys," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Snugovsky, L., Snugovsky, P., Perovic, D. D., Bagheri, S., and Rutter, J. W., "Microstructures formed from mixed solders on copper substrate," Materials Science and Technology, vol. 25 no. 12, pp. 1467-1473, Dec. 2009.

Snugovsky, L., Perovic, D. D., Rutter, J. W., Snugovsky, P., and Bagheri, S., "Microstructures Resulting from the Use of Solder Balls of One Composition with Paste of a Different Composition on a Copper Substrate," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Snugovsky, L., Snugovsky, P., Perovic, D. D., and Rutter, J. W., "Phase equilibria in Sn rich corner of Cu-Ni-Sn system," Materials Science and Technology, vol. 22 no. 8, pp. 899-902, Aug. 2006.

Snugovsky, L., Snugosvky, P., Perovic, D. D., and Rutter, J. W., "Solidification and Aging Behaviour of Sn-Ag-Cu Solder Alloys," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Snugovsky, L., Perovic, D. D., and Rutter, J. W., "Solidification of ternary eutectic and near eutectic alloys in the Ag - Cu - Sn system," Materials Science and Technology, vol. 20 no. 11, pp. 1403-1413, Nov. 2004.

Snugovsky, L., Snugovsky, P., Perovic, D. D., Sack, T., and Rutter, J. W., "Some aspects of nucleation and growth in Pb free Sn-Ag-Cu solder," Materials Science and Technology, vol. 21 no. 1, pp. 53-60, Jan. 2005.

Snugovsky, L., Snugovsky, P., Perovic, D. D., and Rutter, J. W., "'Spalling' of SAC Pb free solders when used with nickel substrates," Materials Science and Technology, vol. 25 no. 10, pp. 1296-1300, Oct. 2009.

Snugovsky, L., Cermignani, C., Perovic, D. D., and Rutter, J. W., "The Solid Solubility of Ag and Cu in the Sn Phase of Eutectic and Near-Eutectic Sn-Ag-Cu Solder Alloys," Journal of Electronic Materials, vol. 33 no. 11, pp. 1313-1315, Nov. 2004.

Snugovsky, P., Bragg, J., Bagheri, Z., Romansky, M., Ganster, A., Russell, W., Tucker, J. P., Handwerker, C. A., and Fritz, D. D., "Drop Test Assessment of a Medium Complexity Assembly for High Reliability Applications," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 426-441.

Snugovsky, P., Bragg, J., Kosiba, E., Thomson, M., Lee, B., Brush, R., Subramaniam, S., Romansky, M., Ganster, A., Russell, W., Tucker, J. P., Handwerker, C. A., and Fritz, D. D., "Drop Test Performance of A Medium Complexity Lead-Free Board After Assembly and Rework," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S33_01-1-S33_01-12.

Snugovsky, P., Bragg, J., Romansky, M., Ganster, A., Russell, W., Tucker, J. P., Handwerker, C. A., and Fritz, D. D., "Drop Testing for High Reliability Applications," SMTA International 2010 Conference (Presentations), Orlando, FL, Oct. 24-28, 2010.

Snugovsky, P., McMahon, J., Romansky, M., Snugovsky, L., Perovic, D., and Rutter, J., "Microstructure and Properties of Sn-Pb Solder Joints with Sn-Bi Finished Components," IPC Printed Circuits Expo, APEX and the Designer Summit , Anaheim, CA, Feb. 8-10, 2006, pp. S28-01-1-S28-01-13.

Snugovsky, P., Bagheri, S., Bagheri, Z., and Romansky, M., "The New Pb-Free Assembly Rework Solution Using Low Melting Alloys," IPC Review, vol. 48 no. 4, pp. 7, May 2007.

Snugovsky, Polina, Bagheri, Zohreh, McCormick, Heather, Bagheri, Simin, Hamilton, Craig, and Romansky, Marianne, "Failure Mechanisms of SAC 305 and SAC 405 in Harsh Environments and Influence of Board Defects Including Black Pad," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 503-514.

Snugovsky, Polina, Bagheri, Zohreh, McCormick, Heather, Bagheri, Simin, Hamilton, Craig, and Romansky, Marianne, "Failure Mechanism of SAC 305 and SAC 405 in Harsh Environments and Influence of Board Defects Including Black Pad," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Snugovsky, Polina, Bagheri, Zohreh, McCormick, Heather, Bagheri, Simin, Hamilton, Craig, and Romansky, Marianne, "Failure Mechanism of SAC 305 and SAC 405 in Harsh Environments and Influence of Board Defects Including Black Pad," SMTAnews & Journal of Surface Mount Technology, vol. 20 no. 3, pp. 17-28, July-Sept. 2007.

Snugovsky, Polina, "Issues and Whisker Mitigation for those Using SAC Solder and Tin Surface Finishes," The Latest Findings on Tin Whiskers in Electronics Webinar, Oct. 29, 2015, pp. xx-xx.

Snugovsky, Polina, Kosiba, Eva, Kennedy, Jeffrey, Bagheri, Zohreh, Romansky, Marianne, Robinson, Michael, Juarez Jr., Joseph M., and Heebink, Joel, "Manufacturability and Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi," IPC APEX Expo 2013, San Diego, CA, Feb. 17-21, 2013, pp. xx-xx.

Snugovsky, Polina, Bagheri, Zohreh, and Hamilton, Craig, "Microstructure and Reliability Comparison of Different Pb-Free Alloys Used for Wave Soldering and Rework," Journal of Electronic Materials, vol. 38 no. 12, pp. 2628-2646, Dec. 2009.

Snugovsky, Polina, McCormick, Heather, Bagheri, Simin, Bagheri, Zohreh, Hamilton, Craig, and Romansky, Marianne, "Microstructure, Defects, and Reliability of Mixed Pb-Free/Sn-Pb Assemblies," Journal of Electronic Materials, vol. 38 no. 2, pp. 292-302, Feb. 2009.

Snugovsky, Polina, Bagheri, Simin, Romansky, Marianne, Perovic, Doug, Snugovsky, Leonid, and Rutter, John, "New Generation of Pb-Free Solder Alloys: Possible Solution to Solve Current Issues with Main Stream Pb-free Soldering," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 16-18, 2012, pp. xx-xx.

Snugovsky, Polina, Bagheri, Simin, Romansky, Marianne, Perovic, Doug, Snugovsky, Leonid, and Rutter, John, "New Generation of Pb-Free Solder Alloys: Possible Solution to Solve Current Issues with Main Stream Pb-Free Soldering," SMTA Journal, vol. 25 no. 3, pp. 42-52, 2012.

Snugovsky, Polina, McMahon, John, Kelly, Matthew, Bagheri, Zohreh, and Romanksy, Marianne, "Properties of SMT Solder Joints Formed Between Different Surface Finishes and Component Metallization Using Pb-free and Sn-Pb Solder Pastes," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Snugovsky, Polina, Meschter, Stephan, Kennedy, Jeff, and Bagheri, Zohreh, "REMAP Materials Project M2: High Temperature High Humidity Corrosion and Tin Whisker Evaluation of Bi Containing Lead-Free Alloys," International Conference on Soldering & Reliability 2016 Proceedings, Toronto, Ontario, Canada, May 9-11, 2016, pp. xx-xx.

Snugovsky, Polina, Bagheri, Zohreh, Kelly, Matthew, and Romansky, Marianne, "Solder Joint Formation with Sn-Ag-Cu and Sn-Pb Solder Balls and Pastes," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Snugovsky, Polina, Zberzny, Adam R., Kelly, Matthew, and Romansky, Marianne, "Theory and Practice of Lead-Free BGA Assembly Using Sn-Pb Solder," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Snugovsky, Polina, Meschter, Stephan, Bagheri, Zohreh, Kosiba, Eva, Romansky, Marianne, and Kennedy, Jeffrey, "Whisker Formation Induced by Component and Assembly Ionic Contamination," Journal of Electronic Materials, vol. 41 no. 2, pp. 204-223, Feb. 2012.

Snugovsky, Polina, Bagheri, Zohreh, and Romansky, Marianne, "Whisker Growth on SAC Solder Joints: Microstructure Analysis," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Snugovsky, Polina, Bagheri, Zohreh, and Romansky, Marianne, "Whisker Growth on SAC Solder Joints: Microstructure Analysis (presentation)," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Snyder, D. L., "A Comparison of the Corrosion Characteristics Of Trivalent and Hexavalent Chromium Electrodeposits," Plating and Surface Finishing, vol. 66 no. 6, pp. 60-65, June 1979.

Snyder, D. L., "Distinguishing Trivalent Chromium Deposits By Color," Plating & Surface Finishing, vol. 90 no. 11, pp. 34-39, Nov. 2003.

Snyder, Donald L., "Alternative to Hexavalent Chromium Coatings: Decorative & Functional Trivalent Chromium Plating," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. 329-337.

Snyder, Donald L., "Decorative Chromium Plating," Metal Finishing, vol. 105 no. 10, pp. 173-181, Oct. 2007.

Snyder, Donald L., "Performance Properties of Trivalent Chromium," Proceedings of The International Technical Conference of AESF SUR/FIN, Anaheim, CA, June 21-24, 1993, pp. 445-450.

Snyder, Donald, "Quality Decorative Plating," Products Finishing, vol. xx no. xx, pp. xx-xx, Dec. 1996.

Snyder, Donald L., "The Case for Trivalent Chromium," Products Finishing, vol. 53 no. 11, pp, 61-69, Aug. 1989.

Snyder, Donald L., "The Decorative Colors of Trivalent Chromium Deposits," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 362-372.

Snyder, Donald L., "Twenty-six Year Corrosion Study Comparing Decorative Hexavalent and Trivalent Chromium," Plating and Surface Finishing, vol. 92 no. 9, pp. 26-36, Sept. 2005.

So, Alex C. K., and Chan, Y. C., "Aging Studies of Cu-Sn Intermetallic Compounds in Annealed Surface Mount Solder Joints," Proceedings of the 1996 Electronic Components and Technology Conference, May 28-31, 1996, pp. 1164-1171.

So, Alex C. K., Chan, Yan C., and Lai, J. K. L., "Aging Studies of Cu-Sn Intermetallic Compounds in Annealed Surface Mount Solder Joints," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, vol. 20 no. 2, pp. 161-166, May 1997.

So, Alex C. K., and Chan, Y. C., "Reliability Studies of Surface Mount Solder Joints- Effect of Cu-Sn Intermetallic Compounds," 45th Electronic Components and Technology Conference, May 21-24, 1995, pp. 1073-1080.

So, Alex C. K., and Chan, Y. C., "Reliability Studies of Surface Mount Solder Joints- Effect of Cu-Sn Intermetallic Compounds," IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B, vol. 19 no. 3, pp. 661-668, Aug. 1996.

So, William W., and Lee, Chin C., "A Fluxless Process of Producing In-Au Joints on Copper Substrates," 1999 Proceedings 49th Electronic Components & Technology Conference , San Diego, CA, June 1-4, 1999, pp. 278-282.

Soares, Delfim, Sarmento, Manuel, Barros, Daniel, Peixoto, Helder, Figueiredo, Hugo, Alves, Ricardo, Delgado, Isabel, Teixeira, Jose C., and Cerqueira, Fatima, "The effect of Bi addition on the electrical and microstructural properties of SAC405 soldered structure," Soldering & Surface Mount Technology, vol. 33 no. 1, pp. 19-25, 2021.

Soares, Thiago, Cruz, Clarissa, Silva, Bismarck, Brito, Crystopher, Garcia, Amauri, Spinelli, Jose Eduardo, and Cheung, Noe, "Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples," Journal of Electronic Materials, vol. 49 no. 1, pp. 173-187, Jan. 2020.

Sob, M., Pokluda, J., Cerny, M., Sandera, P., and Vitek, V., "Theoretical Strength of Metals and Intermetallics from First Principles," Materials Science Forum, vol. 482, pp. 33-38, Apr. 2005.

Sober, Douglas J., "IPC-4101 "Lead Free FR-4" Specification Sheets - Facts and Fiction," IPC Review, vol. 47 no. 6, pp. 9-10, July 2006.

Sober, Douglas J., "Lead-Free Compatible Base Materials - Is there Anything Left to Specify?," IPC Review, vol. 1 no. 1, pp. 8-9,12, Mar./Apr. 2008.

Sober, Douglas J., "Lead-Free FR-4 Specs: Facts and Fiction," Printed Circuit Design and Manufacture, vol. 23 no. 7, pp. 20-21, July 2006.

Sobhy, M., El-Refai, A. M., Mousa, M. M., and Saad, G., "Effect of ageing time on the tensile behavior of Sn-3.5 wt% Ag-0.5 wt% Cu (SAC355) solder alloy with and without adding ZnO nanoparticles," Materials Science and Engineering: A, vol. 646, pp. 82-89, Oct. 14, 2015.

Sobhy, M., El-Refai, A. M., and Fawzy, A., "Effect of Graphene Oxide Nano-Sheets (GONSs) on thermal, microstructure and stress-strain characteristics of Sn-5 wt% Sb-1 wt% Ag solder alloy," Journal of Materials Science: Materials in Electronics, vol. 27 no. 3, pp. 2349-2359, Mar. 2016.

Sobhy, M., "Effects of torsional oscillation on tensile behavior of Sn-3.5 wt% Ag alloy with and without adding ZnO nanoparticles," Materials Science and Engineering: A, vol. 610, pp. 237-242, July 29, 2014.

Sobiech, M., Welzel, U., Mittemeijer, E. J., Hugel, W., and Seekamp, A., "Driving force for Sn whisker growth in the system Cu-Sn," Applied Physics Letters, vol. 93 no. 1, pp. 011906-1-011906-3, July 7, 2008.

Sobiech, M., Kruger, C., Welzel, U., Wang, J. Y., Mittemeijer, E. J., and Hugel, W., "Evolution of microstructure and stress of and associated whisker growth on Sn layers sputter-deposited on Cu substrates," Journal of Materials Research, vol. 25 no. 11, pp. 2166-2174, Nov. 2010.

Sobiech, M., Wohlschlogel, M., Welzel, U., Mittemeijer, E. J., Hugel, W., Seekamp, A., Liu, W., and Ice, G. E., "Local, submicron, strain gradients as the cause of Sn whisker growth," Applied Physics Letters, vol. 94 no. xx, pp. 221901-1-221901-3, 2009.

Sobiech, M., Teufel, J., Welzel, U., Mittemeijer, E. J., and Hugel, W., "Stress Relaxation Mechanisms of Sn and SnPb Coatings Electrodeposited on Cu: Avoidance of Whiskering," Journal of Electronic Materials, vol. 40 no. 11, pp. 2300-2313, Nov. 2011.

Sobiech, M., Welzel, U., Schuster, R., Mittemeijer, E. J., Hugel, W., Seekamp, A., and Muller, V., "The Microstructure and State of Stress of Sn Thin Films after Post-Plating Annealing: An Explanation for the Suppression of Whisker Formation?," 2007 Proceedings 57th Electronic Components & Technology Conference , Reno, NV, May 29-June 1, 2007, pp. 192-197.

Sobiech, Matthias, Kruger, Carmen, Welzel, Udo, Wang, Jiang-Yang, Mittemeijer, Eric Jan, and Hugel, Werner, "Phase formation at the Sn/Cu interface during room temperature aging: Microstructural evolution, whiskering, and interface thermodynamics," Journal of Materials Research, vol. 26 no. 12, pp. 1482-1493, June 28, 2011.

Sobolewski, Maciej, and Dziurdzia, Barbara, "Experimental approach to thermal conductivity of macro solder joints with voids," Soldering & Surface Mount Technology, vol. 31 no. 3, pp. 181-191, 2019.

Sobri, Fatin Afeeqa Mohd, Salleh, Mohd Arif Anuar Mohd, Ghazali, Che Mohd Ruzaidi, and Narayanan, Pavithiran, "Sn-Cu-Ni (SN100C) Lead-free Solder Coating Wettability Study," Applied Mechanics and Materials, vol. 754-755, pp. 489-492, Apr. 2015.

Socolof, Maria Leet, Geibig, Jack R., and Swanson, Mary B., "Cradle to Gate Toxic Impacts of Solders: A Comparison of Impact Assessment Methods," 2003 IEEE International Symposium on Electronics and the Environment, Boston, MA, May 19-22, 2003, pp. 66-71.

Socolof, Maria Leet, Geibig, Jack, and Dillon, Patricia, "Electronics Environmental Benefits Calculator: A Tool to Measure the Benefits of EPEAT and the Federal Electronics Challenge," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 95-99.

Socolof, Maria Leet, Overly, Jonathan G., and Geibig, Jack R., "Environmental life-cycle impacts of CRT and LCD desktop computer displays," Journal of Cleaner Production, vol. 13 no. 13-14, pp. 1281-1294, Nov.-Dec. 2005.

Socolof, Maria Leet, Geibig, Jack R., and Swanson, Mary B., "Lead and Lead-free Solder Project LCIA Characterization Methods," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S11-1-1-S11-1-5.

Socolof, Maria Leet, and Geibig, Jack R., "Life-Cycle Impacts of Lead and Lead-Free Solder Used in Wave Soldering of Electronics," Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, New Orleans, LA, May 16-19, 2005, pp. 96-101.

Socolof, Maria, "Summary of Activities for a Life-Cycle Environmental Impact Evaluation of Tin-Lead and Lead-Free Solder," Lead Free Electronics Workshop , Marlborough, MA, June 19, 2003.

Socolow, Robert, and Thomas, Valerie, "The Industrial Ecology of Lead and Electric Vehicles," Journal of Industrial Ecology, vol. 1 no. 1, pp. 13-36, Jan. 1997.

Socolowski, Norbert, "Lead-Free Alloys and Limitations for Surface Mount Assembly," Surface Mount International Proceedings of the Technical Program, San Jose, CA, Aug. 29-31, 1995, pp. 477-480.

Soderstrom, Stan, "Hidden Costs of Poor Fluxing for Lead Free Wave-Soldering," Circuitnet, Dec. 4, 2005.

Soderstrom, Stan, "How to Develop and Measure a Uniform and Repeatable Spray Fluxing Process for Lead-Free Wave Soldering," Adhesives & Sealants Industry, vol. 13 no. 7, pp. 36-37, July 2006.

Sogo, Yousuke, Hojo, Takashi, Iwanishi, Hiroaki, Hirose, Akio, Kobayashi, Kojiro F., Yamaguch, Atsushi, Furusawa, Akio, and Nishida, Kazuto, "Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn-8Zn-3Bi Solder and Ni/Au Plating," Materials Transactions , vol. 45 no. 3, pp. 734-740, Mar. 2004.

Sohn, B. H., and Cohen, R. E., "Electrical Properties of Block Copolymers Containing Silver Nanoclusters Within Oriented Lamellar Microdomains," Journal of Applied Polymer Science, vol. 65 no. 4, pp. 723-729, July 25, 1997.

Sohn, John E., "Are Lead-Free Solder Joints Reliable?," Circuits Assembly, vol. 13 no. 6, pp. 32-35, June 2002.

Sohn, Y. C., Yu, Jin, Kang, S. K., Shih, D. Y., and Lee, T. Y., "Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization," Journal of Materials Research, vol. 19 no. 8, pp. 2428-2436, Aug. 2004.

Sohn, Y. C., Yu, Jin, Kang, S. K., Shih, D. Y., and Lee, T. Y., "Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization," Journal of Materials Research, vol. 19 no. 8, pp. 2428-2436, Aug. 2004.

Sohn, Yoon-Chul, and Yu, Jin, "Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection," Journal of Materials Research, vol. 20 no. 8, pp. 1931-1934, Aug. 2005.

Sohn, Yoon-Chul, Yu, Jin, Kang, Sung K., Shih, Da-Yuan, and Lee, Taek-Yeong, "Effect of Intermetallics Spalling on the Mechanical Behavior of Electroless Ni(P)/Pb-free Solder Interconnection," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 1, Orlando, FL, May 31-June 3, 2005, pp. 83-88.

Sohn, Yoon-Chul, Yu, Jin, Kang, Sung K., Shih, Da-Yuan, and Lee, Taek-Yeong, "Spalling Behaviors of Intermetallic Compounds During the Wetting Reaction of Sn(3.5Ag) on Electroless Ni-P Metallization," Proceedings of 2004 International IEEE Conference on the Asian Green Electronics, Shanghai, China, Apr. 27-30, 2004, pp. 177-181.

Sohn, Yoon-Chul, Yu, Jin, Kang, Sung K., Shih, Da-Yuan, and Lee, Taek-Yeong, "Study of Spalling Behavior of Intermetallic Compounds During the Reaction Between Electroless Ni-P Metallization and Lead-free Solders," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 75-81.

Sohn, Yoonchul, "Effect of Morphological Change of Ni3Sn4 Intermetallic Compounds on the Growth Kinetics in Electroless Ni-P/Sn-3.5Ag Solder Joint," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 51 no. 6, pp. 2905-2914, June 2020.

Solberg, Vern, "Addressing RoHS Impact on PCB Design and Assembly," IPC Review, vol. 47 no. 11, pp. 16-17, Dec. 2006.

Solberg, Vern, Mitchell, Craig, and Gray, Gordon, "Advanced Package Stacking Technologies - IC Package Qualification Testing for Lead-Free Soldering," 2006 Pan Pacific Symposium Conference Proceedings , Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Solberg, Vern, "Board Level Reliability Testing of uBGA(R) Packaging with Lead-Free Solder Attachment," Proceedings of 3rd Electronics Packaging Technology Conference, Singapore, Dec. 5-7, 2000, pp. 10-13.

Solberg, Vern, "Bottom Terminal Components (QFN-SON) Part 3: PCB Surface Finish Options and Recommendations for Solder Printing," Surface Mount Technology (SMT) , vol. 26 no. 4, pp. 40-42,44, Apr. 2011.

Solberg, Vern, "Design for Assembly: High-density Circuits for Hand-held and Portable Products," Surface Mount Technology (SMT), vol. 15 no. 4, pp. xx-xx, Apr. 2001.

Solberg, Vern, "Designers Guide to Lead-Free SMT Components, PCB Materials, Plating and Surface Coatings," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Solberg, Vern, "Embedding Passive and Active Components: PCB Design and Fabrication Process Variations," IPC APEX Expo 2015, San Diego, CA, Feb. 22-26, 2015, pp. xx-xx.

Solberg, Vern, "Environmental Testing for Portable and Hand-Held Electronics," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Aug.-Sept. 2001.

Solberg, Vern, "High Temperature Lead-Free Soldering Impact on End Product Reliability," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 599-604.

Solberg, Vern, Mitchell, Craig, and Gray, Gordon, "IC package qualification testing for lead-free soldering ," Global SMT and Packaging, vol. 6 no. 5, pp. 10-12, 14. 16-17, May 2006.

Solberg, Vern, "Lead-Free Soldering for CSP," Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 611-616.

Solberg, Vern, "No-Lead Solder for CSP the Impact of Higher Temperature SMT Assembly Processing," Proceedings of the Technical Program NEPCON West 2000, Volume 1, Anaheim, CA, Feb. 29-Mar. 2, 2000, pp. 542-553.

Solberg, Vern, "Part 1: PCB Designers Notebook _ Flexible Circuit Design for SMT Assembly," Surface Mount Technology (SMT), vol. 18 no. 9, pp. 18, Sept. 2004.

Solberg, Vern, "Part 1: Specifying Base Materials for SMT Circuit Boards," Surface Mount Technology (SMT), vol. 19 no. 6, pp. xx-xx, June 2005.

Solberg, Vern, "Part 2: PCB Designers Notebook: Stencil Design," Surface Mount Technology (SMT), vol. 22 no. 7, pp. 28, July 2008.

Solberg, Vern, "Part 3: PCB Designer's Notebook: IC Component Package Evolution and the Impact of Lead-free Soldering," SMT Web Exclusive Article.

Solberg, Vern "Part 3: Specifying Base Materials for SMT Circuit Boards," Surface Mount Technology (SMT), vol. 19 no. 9, pp. xx-xx, Sept. 2005.

Solberg, Vern, "PCB Designer's Notebook: Lead-free Marking for Assemblies," Surface Mount Technology (SMT), vol. 20 no. 1, pp. xx-xx, Jan. 2006.

Solberg, Vern, "PCB Designer's Notebook: Selecting Halogen-free (HF) Soldermask Materials," Surface Mount Technology Online Article.

Solberg, Vern, "PCB Designers Notebook: Selecting the Right Surface Finish," Surface Mount Technology (SMT), vol. 18 no. 1, pp. xx-xx, Jan. 2004.

Solberg, Vern, "PCB Designer's Notebook: SMT Land Patterns for Lead-free," Surface Mount Technology (SMT), vol. 20 no. 4, pp. xx-xx, Apr. 2006.

Solberg, Vern, "Preparing for the Pb-Free Generation," Electronic Packaging & Production, vol. xx no. xx, pp. xx, July 2001.

Solberg, Vern, and Osorio, Ignacio, "Qualification Testing of Pb-Free Assemblies Using Ball Stacked Chip Scale IC Packaging," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 403-409.

Solberg, Vern, "Reliability Qualification Testing of Chip-Scale IC Packages," Medical Electronics Manufacturing, pp. 42-46, Fall 2005.

Soler, Rafael, Molina-Aldareguia, Jon Mikel, Segurado, Javier, and LLorca, Javier, "Effect of Misorientation on the Compression of Highly Anisotropic Single-Crystal Micropillars," Advanced Engineering Materials, vol. 14 no. 11, pp. 1004-1008, Nov. 2012.

Solodkova, L. N., and Kudryavtsev, V. N., "Corrosion-Protective Properties of Chromium Coatings in Marine and Coal-Mine Conditions," Galvanotechnik, vol. xx no. xx, pp. 1150-1154, May 2004.

Solovyeva, Z. A., "The Mechanism of Electrodeposition of Chromium Coatings with Different Phase Structure," Plating & Surface Finishing, vol. 85 no. 4, pp. 87-95, Apr. 1998.

Som, Anirban, Samal, A. K., Udayabhaskararao, T., Bootharaju, M. S., and Pradeep, T., "Manifestation of the Difference in Reactivity of Silver Clusters in Contrast to Its Ions and Nanoparticles: The Growth of Metal Tipped Te Nanowires," Chemistry of Materials, vol. 26 no. 10, pp. 3049-3056, May 27, 2014.

Soma, Toshinobu, "Lattice Vibation Spectra in a-Sn," Journal of the Physical Society of Japan, vol. 36 no 5, pp. 1301-1303, May 1974.

Somidin, Flora, McDonald, Stuart D., Ye, Xiaozou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro, and Nogita, Kazuhiro, "Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditions," 2019 International Conference on Electronics Packaging, Niigata, Japan, Apr. 17-20, 2019, pp. 223-228.

Somidin, Flora, Salleh, M. A. A. Mohd, and Ahmad, Khairel Rafezi, "Intermetallic compound formation on solder alloy/Cu-substrate interface using lead-free Sn-0.7Cu/recycled-aluminum composite solder," Advanced Materials Research, vol. 620, pp. 105-111, Dec. 2012.

Sommadossi, S., Gust, W., and Mittemeijer, E. J., "Characterization of the reaction process in diffusion-soldered Cu/In-48 at.% Sn/Cu joints," Materials Chemistry and Physics, vol. 77 no. 3, pp. 924-929, Jan. 30, 2003.

Sommadossi, S., and Guillermet, A. Fernandez, "Interface reaction systematics in the Cu/In-48Sn/Cu system bonded by diffusion soldering," Intermetallics, vol. 15 no. 7, pp. 912-917, July 2007.

Sommoadossi, S., Huici, J., Khanna, P. K., Gust, W., and Mittemeijer, E. J., "Mechanical properties of Cu/In-48Sn/Cu diffusion-soldered joints," Zeitschrift fur Metallkunde, vol. 93 no. 6, pp. 496-501, June 2002.

Sommadossi, S., Gust, W., and Mittemeijer, E. J., "Phase characterisation and kinetic behaviour of diffusion soldered Cu/In/Cu interconnections," Materials Science & Technology, vol. 19 no. 4, pp. 528-534, Apr. 1, 2003.

Sommadossi, Silvana, Troiani, Horacio E., and Guillermet, Armando Fernandez, "Diffusion soldering using a Gallium metallic paste as solder alloy: study of the phase formation systematics," Journal of Materials Science, vol. 42 no. 23, pp. 9707-9712, Dec. 2007.

Sommer, Johann-Peter, Licht, Thomas, Berg, Hermann, Appelhoff, Klaus, and Michel, Bernd, "Solder Fatigue at High-Power IGBT Modules," 2006 4th International Conference on Integrated Power Systems, Naples, Italy, June 7-9, 2006, pp. xx-xx.

Sommer, R., "Alternatives to Hexavalent Chromium for Steel and Aluminium," Galvanotechnik, vol. 97 no. 5, pp. 1110-1115, May 2006.

Sommer, Roland, "Are you in or out of RoHS scope?," Green SupplyLine, Oct. 20, 2006.

Sommer, Roland, "Choose material composition testing based on needs," Green SupplyLine, Feb. 20, 2006.

Sommer, Roland, "Comparison of RoHS Legislations Around the World, Version 1.01" Aug. 11, 2006.

Sommer, Roland, "Eight steps to China RoHS compliance," Industrial Control Design Line, Jan. 29, 2007.

Sommer, Roland, "Eight steps to China RoHS compliance," Green SupplyLine, Jan. 29, 2007.

Sommer, Roland, "EU RoHS Compliant Does Not Mean "China RoHS" Compliant," PCB007 , Mar. 13, 2007.

Sommer, Roland, "Future-proof RoHS material declaration," ferret.com.au, pp. xx-xx, May 17, 2006.

Sommer, Roland, "Part 1: EU REACH Legislation: Implications for electronics, textiles and plastics industries," Circuitnet, Feb. 13, 2008.

Sommer, Roland, "Part 2: EU REACH Legislation: Implications for electronics," Circuitnet, Feb. 14, 2008.

Sommer, Roland, "RoHS and WEEE not just Lead-Free," ESConnectivity, Christchurch, New Zealand, Nov. 2004.

Sommer, Roland, "RoHS and WEEE not just Lead-Free," no. 1, Mar. 2005.

Sommer, Roland, "RoHS and WEEE not just Lead-Free," no. 2, Apr. 2005.

Sommer, Roland, "RoHS and WEEE not just Lead-Free," no. 4, June/July 2005.

Sommer, Roland, "RoHS and WEEE not just Lead-Free," no. 5, Aug.-Oct. 2005.

Sommer, Roland, "RoHS and WEEE not just Lead-Free," no. 6, Nov. 2005-Jan. 2006.

Sommer, Roland, "RoHS and WEEE not just Lead-Free," no. 7, June 2006.

Sommer, Roland, "RoHS and WEEE not just Lead-Free," no. 8, Aug. 2006.

Sommer, Roland, "RoHS and WEEE not just Lead-Free," no. 9, Nov. 2006.

Sommer, Roland, "RoHS and WEEE not just Lead-Free," no. 10, Dec. 2006.

Sommer, Roland, "RoHS and WEEE not just Lead-Free," no. 11, Feb. 2007.

Sommer, Roland, "RoHS and WEEE not just Lead-Free," no. 12, May 2007.

Sommer, Roland, "RoHS and WEEE not just Lead-Free," no. 13, Aug. 2007.

Sommer, Roland, "RoHS and WEEE not just Lead-Free," no. 14, Jan. 2008.

Sommer, Roland, "RoHS enforcement explained," Green SupplyLine, June 30, 2006.

Sommer, Roland, "RoHS substance review: 46 additional substances under scrutiny," Circuitnet, Mar. 21, 2008.

Sommer, Roland, "RoHS Threats to the Industry," Asia Electronics Forum, Qingdao, China, July 2, 2005, pp. xx-xx.

Sommer, Roland, "Supporting the Good Company A RoHS and WEEE Model," World Electronics Forum, London, UK, Sept. 2005, pp.xx-xx.

Sommer, Roland, "Waste Not: Recycling and the future of design," designindustry , pp. xx-xx, Dec. 2005/Jan. 2006.

Sommer, Roland, "What comes after RoHS?, Technology Futures Conference, Melbourne, Australia, July 2006, pp. xx-xx.

Son, Ho-Young, Jung, Gi-Jo, Park, Byung-Jin, and Paik, Kyung-Wook, "A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates," Journal of Electronic Materials , vol. 37 no. 12, pp. 1832-1842, Dec. 2008.

Son, Ho-Young, Jung, Gi-Jo, Lee, Jun-Kyu, Choi, Joon-Young, and Paik, Kyung-Wook, "Cu/SnAg Double Bump Flip Chip Assembly as an Alternative of Solder Flip Chip on Organic Substrates for Fine Pitch Applications," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 864-871.

Son, Ho-Young, Kim, Ilho, Park, Jin-Hyoung, Lee, Soon-Bok, Jung, Gi-Jo, Park, Byung-Jin, and Paik, Kyung-Wook, "Studies on the Thermal Cycling Reliability of Fine Pitch Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates: Experimental Results and Numerical Analysis," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 2035-2043.

Son, Ho-Young, Paik, Kyung-Wook, Kim, Ilho, Park, Jin-Hyoung, Lee, Soon-Bok, Jung, Gi-Jo, Park, Byung-Jin, and Byun, Kwang-Yoo, "Studies on the Thermal Cycling Reliability of Fine Pitch Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates: Experimental Results and Numerical Analysis," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 716-724.

Son, Ho-Young, Kim, Il-Ho, Lee, Soon-Bok, Jung, Gi-Jo, Park, Byung-Jin, and Paik, Kyung-Wook, "Thermal Cycling Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies for 100um Pitch Applications," 9th International Conference on Electronic Materials and Packaging, Daejon, Korea, Nov. 19-22, 2007, pp. xx-xx.

Son, Ho-Young, Kim, IlHo, Lee, Soon-Bok, Jung, Gi-Jo, Park, Byung-Jin, and Paik, Kyung-Wook, "Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 um pitch applications," Journal of Applied Physics, vol. 105 no. x, pp. 013522-1-013522-8, 2009.

Son, Ho-Young, Chung, Chang-Kyu, Yim, Myung-Jin, and Paik, Kyung-Wook, "Wafer-Level Package using Pre-Applied Anisotropic Conductive Films (ACFs) for Flip-Chip Interconnections," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 565-569.

Son, J. Y., Lee, Y. W., Hong, S. J., Im, I. B., Lee, J. H., Kim, H. J., and Moon, J. T., "Study on the Characteristics of Various Dopants in Sn-1Ag-0.8Cu solder," 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 7-9, 2011, pp. 231-235.

Son, K.-A., Wong, D., Sharifi, H., Seo, H. C., De Lyon, T., Terterian, S., Moon, J. S., and Hussain, T., "Silver Nanowire-Based Infrared-Transparent Contacts for Future High-Density Format Focal Plane Arrays," IEEE Transactions on Nanotechnology, vol. 14 no. 1, pp. 10-14, Jan. 2015.

Son, Kirak, Park, Gyu-Tae, Lee, Byeong-Rok, Yang, Cheol-Woong, Han, Jeong Sam, Lee, Tae-Kyu, and Park, Young-Bae, "Effect of Electromigration-Induced Joule Heating on the Reliability of Sn-Ag Microbump with Different UBM Structures," Journal of Electronic Materials, vol. 49 no. 12, pp. 7228-7237, Dec. 2020.

Son, Min-Jung, Jeong, Jae Won, Kim, Hyunchang, Lee, Taik-Min, Lee, Hoo-Jeong, and Kim, Inyoung, "Effect of particle size distribution on the mechanical and electrical properties of reverse-offset printed Sn-Ag-Cu solder bumps," Journal of Materials Science: Materials in Electronics, vol. 29 no. 23, pp. 19620-19631, Dec. 2018.

Son, Min-Jung, Kim, Inyoung, Yang, Sangsun, Lee, Taik-Min, and Lee, Hoo-Jeong, "Employment of roll-offset printing for fabrication of solder bump arrays: Harnessing the rheological properties of lead-free solder pastes using particle size distribution," Microelectronic Engineering, vol. 164, pp. 128-134, Oct. 1, 2016.

Son, Min-Jung, Kim, Minwoo, Lee, Taik-Min, Kim, Jihoon, Leeb, Hoo-Jeong, and Kim, Inyoung, "Mechanical and electrical properties of reverse-offset printed Sn-Ag-Cu solder bumps," Journal of Materials Processing Technology, vol. 259, pp. 126-133, Sept. 2018.

Son, Phung Van, Fujitsuka, Akira, and Ohshima, Ken-Ichi, "Influence of 0.03 wt.% Carbon Black Addition on the Performance of Sn-3.5Ag Lead-Free Solder," Journal of Electronic Materials, vol. 41 no. 7, pp. 1893-1897, July 2012.

Sona, Mrunali, and Prabhu, K. Narayan, "Effect of Reflow Time on Wetting Behavior, Interfacial Reaction and Shear Strength of Sn-0.3Ag-0.7Cu Solder/Cu Joint," International Conference on Soldering & Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.

Sona, Mrunali, and Prabhu, K. Narayan, "Effect of Reflow Time on Wetting Behaviour, Interfacial Reaction and Shear Strength of Sn-0.3Ag-0.7Cu Solder/Cu Joint," SMTA Journal, vol. 28 no. 2, pp. 36-41, June 2015.

Sona, Mrunali, and Prabhu, K. Narayan, "Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates," Journal of Electronic Materials, vol. 45 no. 7, pp. 3744-3758, July 2016.

Sona, Mrunali, and Prabhu, K. N., "Review on microstructure evolution in Sn-Ag-Cu solders and its effect on mechanical integrity of solder joints," Journal of Materials Science: Materials in Electronics, vol. xx no. xx, pp. xx-xx, xxxx.

Sona, Mrunali, and Prabhu, K. Narayan, "The effect of reflow time on reactive wetting, evolution of interfacial IMCs and shear strength of eutectic Sn-Cu solder alloy," Journal of Materials Science: Materials in Electronics, vol. 25 no. 3, pp. 1446-1455, Mar. 2014.

Sona, Mrunali, and Prabhu, K. Narayan, "Wetting kinetics and joint strength of Sn-0.3Ag-0.7Cu lead-free solder alloy on copper substrate as a function of reflow time," Materials Science Forum, vol. 830-831, pp. 286-289, Sept. 2015.

Sone, Hayato, Suda, Yasuyuki, Kubota, Daiki, and Hosaka, Sumio, "Vapor-Liquid-Solid Growth of Silicon-Based Nanowires for High Sensitive Sensor," Key Engineering Materials, vol. 534, pp. 257-261, Jan. 2013.

Song, Fubin, Lo, Jeffrey C. C., Lam, Jimmy K. S., Jiang, Tong, and Lee, S. W. Ricky, "A Comprehensive Parallel Study on the Board Level Reliability of SAC, SACX and SCN Solders," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 146-154.

Song, Fubin, Lee, S. W. Ricky, Newman, Keith, Sykes, Bob, and Clark, Stephen, "Brittle Failure Mechanism of SnAgCu and SnPb Solder Balls during High Speed Ball Shear and Cold Ball Pull Tests," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 364-372.

Song, Fubin, Lee, S. W. Ricky, Newman, Keith, Clark, Stephen, and Sykes, Bob, "Comparison of Joint Strength and Fracture Energy of Lead-free Solder Balls in High Speed Ball Shear/Pull Tests and their Correlation with Board Level Drop Test," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 450-458.

Song, Fubin, and Lee, S. W. Ricky, "Corrosion of Sn-Ag-Cu Lead-free Solders and the Corresponding Effects on Board Level Solder Joint Reliability," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 891-898.

Song, Fubin, Lee, S. W. Ricky, Newman, Keith, Reynolds, Heidi, Clark, Stephen, and Sykes, Bob, "Effect of Thermal Aging on High Speed Ball Shear and Pull Tests of SnAgCu Lead-free Solder Balls," 9th Electronics Packaging Technology Conference , Singapore, Dec. 10-12, 2007, pp. 463-470.

Song, Fubin, Yang, Chaoran, Wu, H. L. Henry, Lo, C. C. Jeffery, Lee, S. W. Ricky, and Newman, Keith, "Effects of Corner and Edgebond Epoxy Adhesives on Board Level Solder Joint Reliability of BGA Mezzanine Connectors," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 926-934.

Song, Fubin, and Lee, S. W. Ricky, "Effects of Testing Conditions and Multiple Reflows on Cold Bump Pull Test of Pb-free Solder Balls," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Song, Fubin, Lee, S. W. Ricky, Newman, Keith, Sykes, Bob, and Clark, Stephen, "High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1504-1513.

Song, Fubin, and Lee, S. W. Ricky, "Investigation of IMC Thickness Effect on the Lead-free Solder Ball Attachment Strength: Comparison between Ball Shear Test and Cold Bump Pull Test Results," Proceedings 56th Electronic Components & Technology Conference , San Diego, CA, May 30-June 2, 2006, pp. 1196-1203.

Song, Fubin, Newman, Keith, Yang, Chaoran, and Lee, S. W. Ricky, "Investigation of Lead-free BGA Solder Joint Reliability under 4-point Bending Using PWB Strain-Rate Analysis," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 863-868.

Song, Fubin, Jiang, Tong, Lo, Jeffery C. C., Lee, S. W. Ricky, and Newman, Keith, "Investigation of Mixed SAC and SnPb Solder Balls under High Speed Ball Shear and Pull Tests," 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, Delft, Netherlands, Apr. 26-29, 2009, pp. xx-xx.

Song, Fubin, Lee, S. W. Ricky, Osterman, Michael, and Pecht, Michael, "Investigation of the Effect of PCB Base Materials and Pad Surface Finish on the Thermal Fatigue Life of Lead-free Solder Joints of PBGA and Passive Resistors," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Song, Fubin, and Lee, S. W. Ricky, "Reliability Assessment on the Re-Balling of PBGA from SnPb to Pb-Free Solder Spheres," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 474-480.

Song, H. G., Morris Jr., J. W., and Hua, F., "Creep Properties of Pb-free Solder Joints," Lawrence Berkeley National Laboratory, 2002.

Song, H. G., Morris Jr., J. W., and Hua, F., The Creep Properties of Lead-Free Solder Joints," JOM, vol. 54 no. 6, pp. 30-32, June 2002.

Song, H. G., Ahn, J. P., and Morris Jr., J. W., "The Microstructure of Eutectic Au-Sn Solder Bumps on Cu/Electroless Ni/Au," Journal of Electronic Materials, vol. 30 no. 9, pp. 1083-1087, Sept. 2001.

Song, H. G., Morris Jr., J. W., and McCormack, M. T., "The Microstructure of Ultrafine Eutectic Au-Sn Solder Joints on Cu," Journal of Electronic Materials, vol. 29 no. 8, pp. 1038-1046, Aug. 2000.

Song, H. Y., and Sun, Y., "Effect of coherent twin boundary and stacking fault on deformation behaviors of copper nanowires," Computational Materials Science, vol. 104, pp. 46-51, June 15, 2015.

Song, H. Y., Zhu, Q. S., Wang, Z. G., Shang, J. K., and Lu, M., "Effects of Zn addition on microstructure and tensile properties of Sn-1Ag-0.5Cu alloy," Materials Science and Engineering: A, vol. 527 no. 6, pp. 1343-1350, Mar. 15, 2010.

Song, Ho Geon, Morris Jr., John W., and Hua, Fay, "Anomalous Creep in Sn-Rich Solder Joints," Materials Transactions , vol. 43 no. 8, pp. 1847-1853, Aug. 2002.

Song, J. M., Lan, G. F., Lui, T. S., and Chen, L. H., "Microstructure and tensile properties of Sn-9Zn-xAg lead-free solder alloys," Scripta Materialia, vol. 48 no. 8, pp. 1047-1051, Apr. 2003.

Song, J. M., Lui, T. S., Chen, L. H., and Tsai, D. Y., "Resonant Vibration Behavior of Lead-Free Solders," Journal of Electronic Materials, vol. 32 no. 12, pp. 1501-1508, Dec. 2003.

Song, J. M., Lui, T. S., Lan, G. F., and Chen, L. H., "Resonant vibration behavior of Sn-Zn-Ag solder alloys," Journal of Alloys and Compounds, vol. 379 no. 1-2, pp. 233-239, Oct. 6, 2004.

Song, J. Y., Yu, Jin, and Lee, T. Y., "Effects of reactive diffusion on stress evolution in Cu-Sn films," Scripta Materialia, vol. 51 no. 2, pp. 167-170, July 2004.

Song, Jae Yong, "Layered intermetallic compounds and stress evolution in Sn and Ni(P) films," Journal of Materials Research, vol. 22 no. 7, pp. 2025-2031, July 2007.

Song, Jae Yong, and Yu, Jin, "Solid-state reactions and stress evolutions between SnAg and Ni(P) thin films," Journal of Materials Research, vol. 24 no. 2, pp. 482-486, Feb. 2009.

Song, Jenn-Ming, Lin, Meng-Ju, Hsieh, Kun-Hung, Pai, Tsung-Yun, Lai, Yi-Shao, and Chiu, Ying-Ta, "Ball Impact Reliability of Zn-Sn High-Temperature Solder Joints Bonded with Different Substrates," Journal of Electronic Materials, vol. 42 no. 9, pp. 2813-2821, Sept. 2013.

Song, Jenn Ming, and Lin, Kwang Lung, "Behavior of intermetallics in liquid Sn-Zn-Ag solder alloys," Journal of Materials Research, vol. 18 no. 9, pp. 2060-2067, Sept. 2003.

Song, Jenn-Ming, Lui, Truan-Sheng, Chang, Yea-Luen, and Chen, Li-Hui, "Compositional effects on the microstructure and vibration fracture properties of Sn-Zn-Bi alloys," Journal of Alloys and Compounds, vol. 403 no. 1-2, pp. 191-196, Nov. 10, 2005.

Song, Jenn-Ming, Lin, Jian-Jhih, Huang, Chi-Feng, and Chuang, Hsin-Yi, "Crystallization, morphology and distribution of Ag3Sn in Sn-Ag-Cu alloys and their influence on the vibration fracture properties," Materials Science and Engineering: A, vol. 466 no. 1-2, pp. 9-17, Sept. 25, 2007.

Song, Jenn-Ming, and Lin, Kwang-Lung, "Double peritectic behavior of Ag-Zn intermetallics in Sn-Zn-Ag solder alloys," Journal of Materials Research, vol. 19 no. 9, pp. 2719-2724, Sept. 2004.

Song, Jenn-Ming, Lui, Truan-Sheng, Chang, Yea-Luen, and Chen, Li-Hui, "Effect of Zn Content on the Vibration Fracture Behavior of Sn-Zn and Sn-Zn-Bi Solders," Journal of Electronic Materials, vol. 35 no. 5, pp. 929-936, May 2006.

Song, Jenn-Ming, and Chang, Zhang-Hong, "Heat resistant Bi-Ag-X solders for power IC die attachment," 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference, Kyoto, Japan, Apr. 14-17, 2015, pp. 550-553.

Song, Jenn-Ming, Liu, Yao-Ren, Lai, Yi-Shao, Chiu, Ying-Ta, and Lee, Ning-Cheng, "Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints," Microelectronics Reliability, vol. 52 no. 1, pp. 180-189, Jan. 2012.

Song, Jenn-Ming, Chuang, Hsin-Yi, and Wu, Zong-Mou, "Interfacial Reactions between Bi-Ag High-Temperature Solders and Metallic Substrates," Journal of Electronic Materials, vol. 35 no. 5, pp. 1041-1049, May 2006.

Song, Jenn-Ming, Liu, Yao-Ren, Su, Chien-Wei, Lai, Yi-Shao, and Chiu, Ying-Ta, "Intermetallic formation induced substrate dissolution in electroless Ni(P)-solder interconnections," Journal of Materials Research, vol. 23 no. 9, pp. 2545-2554, Sept. 2008.

Song, Jenn-Ming, Li, Fang-I, Lui, Truan-Sheng, and Chen, Li-Hui, "Investigation of vibration fracture behavior of Sn-Ag-Cu Solders under resonance," Journal of Materials Research, vol. 19 no. 9, pp. 2665-2673, Sept. 2004.

Song, Jenn-Ming, Lin, Li-Wei, Lee, Ning-Cheng, Lai, Yi-Shao, and Chiu, Ying-Ta, "Metallurgical Perspective on Alloying Modification of Sn-Ag-Cu Solders," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1358-1363.

Song, Jenn-Ming, Huang, Chi-Feng, and Chuang, Hsin-Yi, "Microstructural Characteristics and Vibration Fracture Properties of Sn-Ag-Cu-TM (TM = Co, Ni, and Zn) Alloys," Journal of Electronic Materials, vol. 35 no. 12, pp. 2154-2163, Dec. 2006.

Song, Jenn-Ming, Liu, Nai-Shuo, and Lin, Kwang-Lung, "Microstructures, Thermal and Tensile Properties of Sn-Zn-Ga Alloys," Materials Transactions, vol. 45 no. 3, pp. 776-782, Mar. 2004.

Song, Jenn-Ming, Cheng, Yun-Min, and Tsai, Chi-Hang, "Oxidation of liquid solders for die attachment," Corrosion Science , vol. 52 no. 12, pp. 4011-4016, Dec. 2010.

Song, Jenn-Ming, Liu, Pei-Chi, Shih, Chia-Ling, and Lin, Kwang-Lung, "Role of Ag in the Formation of Interfacial Intermetallic Phases in Sn-Zn Soldering," Journal of Electronic Materials, vol. 34 no. 9, pp. 1249-1254, Sept. 2005.

Song, Jenn-Ming, Shen, Yu-Lin, and Chuang, Hsin-Yi, "Sedimentation of Cu-rich intermetallics in liquid lead-free solders," Journal of Materials Research, vol. 22 no. 12, pp. 3432-3439, Dec. 2007.

Song, Jenn-Ming, Chang-Chien, Yu-Chien, Huang, Bo-Chang, Chen, Wei-Ting, Shie, Chi-Rung, and Hsu, Chuang-Yao, "Spectroscopic investigation of oxidized solder surfaces," Corrosion Science, vol. 53 no. 6, pp. 2283-2288, June 2011.

Song, Jenn-Ming, Shen, Yu-Lin, Su, Chien-Wei, Lai, Yi-Shao, and Chiu, Ying-Ta, "Strain Rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints with Cu and Ag Substrates," Materials Transactions, vol. 50 no. 5, pp. 1231-1234, 2009.

Song, Jenn-Ming, Chuang, Hsin-Yi, and Wu, Zong-Mou, "Substrate Dissolution and Shear Properties of the Joints between Bi-Ag Alloys and Cu Substrates for High-Temperature Soldering Applications," Journal of Electronic Materials, vol. 36 no. 11, pp. 1516-1523, Nov. 2007.

Song, Jenn-Ming, Wu, Zong-Mou, Huang, De-An, and Chuang, Hsin-Yi, "The Effect of Low-Temperature Solute Elements on Nonequilibrium Eutectic Solidification of Sn-Ag Eutectic Solders," Journal of Electronic Materials, vol. 36 no. 12, pp. 1608-1614, Dec. 2007.

Song, Jenn-Ming, Su, Chien-Wei, Lai, Yi-Shao, and Chiu, Ying-Ta, "Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints," Journal of Materials Research , vol. 25 no. 4, pp. 629-632, Apr. 2010.

Song, Jenn-Ming, Su, Chien-Wei, Lai, Yi-Shao, and Chiu, Ying-Ta, "Time dependent deformation behavior of interfacial intermetallic compounds in electronic solder joints," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 497-500.

Song, Jenn-Ming, Lui, Truan-Sheng, Chang, Yea-Luen, and Chen, Li-Hui, "Tin whiskers of bulk solders generated under resonance," Journal of Materials Research, vol. 20 no. 6, pp. 1385-1388, June 2005.

Song, Jenn-Ming, Wu, Zong-Mou, and Huang, De-An, "Two-stage nonequilibrium eutectic transformation in a Sn-3.5Ag-3In solder," Scripta Materialia, vol. 56 no. 5, pp. 413-416, Mar. 2007.

Song, Jenn-Ming, and Wu, Zong-Mou, "Variable eutectic temperature caused by inhomogeneous solute distribution in Sn-Zn system," Scripta Materialia, vol. 54 no. 8, pp. 1479-1483, Apr. 2006.

Song, Jenn-Ming, Chang, Yea-Luen, Lui, Truan-Sheng, and Chen, Li-Hui, "Vibration Fracture Behavior of Sn-Bi Solder Alloys with Various Bi Contents," Materials Transactions, vol. 45 no. 3, pp. 666-672, Mar. 2004.

Song, Kelly, and Liu, Jim, "Surface Finishes In PWB Fabrication," Fifth International Conference on Electronic Packaging Technology Proceedings, Shanghai, China, Oct. 28-30, 2003, pp. 497-501.

Song, Li, Bing, An, Tong-jun, Zhang, and Yi-ping, Wu, "Wetting Dynamics Study of Sn-Ag Solder during Reflow," 7th IEEE CPMT International Conference on High Density Microsystem Design, Packaging and Failure Analysis, Shanghai, June 28, 2005, pp. xx-xx.

Song, Lu, Yoon, Dal-Jin, Zhang, Shuye, and Paik, Kyung-Wook, "A Study on Polyvinylidene Difluoride (PVDF) Anchoring Polymer Layer (APL) Solder Anisotropic Conductive Films (ACFs) for Fine-Pitch Flex-on-Flex (FOF) Interconnection," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 10 no. 3, pp. 368-377, Mar. 2020.

Song, Qingbin, Wang, Zhishi, Li, Jinhui, and Yuan, Wenyi, "Life cycle assessment of desktop PCs in Macau," International Journal of Life Cycle Assessment, vol. 18, pp. 553-566, Mar. 2013.

Song, Rui-Wen, Fleshman, Collin Jordon, Wu, Zih-You, Tsai, Su-Yueh, and Duh, Jenq-Gong, "Increasing mechanical strength and refining grains of Cu-core solder joints with pressurized bonding," Journal of Materials Science: Materials in Electronics, vol. 31 no. 24, pp. 22966-22972, Dec. 2020. https://doi-org.ezproxy.uky.edu/10.1007/s10854-020-04824-3

Song, Y. B., and Chin, D.-T., "Current efficiency and polarization behavior of trivalent chromium electrodeposition process," Electrochimica Acta, vol. 48 no. 4, pp. 349-356, Dec. 20, 2002.

Song, Y., and Chin, D.-T., "Pulse Plating of Hard Chromium from a Trivalent Chromium Bath (AESF Research Project 98)," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. 53-60.

Song, Y. B., and Chin, D.-T., "Pulse Plating of Hard Chromium From Trivalent Baths," Plating & Surface Finishing, vol. 87 no. 9, pp. 80-82, 85-87, Sept. 2000.

Song, Yiming, Lu, Wei, Xu, Yewen, Shi, Jindan, and Fang, Xumin, "Growth of single-crystalline Co7Fe3 nanowires via electrochemical deposition and their magnetic properties," Journal of Alloys and Compounds, vol. 652, pp. 179-184, Dec. 15, 2015.

Song, Zhenxing, Xie, Yujuan, Yao, Suwei, and Wang, Hongzhi, "Field emission properties of electrodeposited cobalt nanowire arrays grown in anodic aluminum oxide," Materials Letters, vol. 65 no. x, pp. 44-45, 2011.

Song, Zhenxing, Xie, Yujuan, Yao, Suwei, Wang, Hongzhi, Zhang, Weiguo, and Tang, Zhiyuan, "Microstructure and magnetic properties of electrodeposited Co/Cu multilayer nanowire arrays," Materials Letters, vol. 65 no. 11, pp. 1562-1564, June 15, 2011.

Songninluck, Jinda, Fangkangwanwong, Juthathip, and Ng, Teng Hoon, "Lead-Free PTH Barrel Fill Challenge for High Thermal Mass Components," South East Asia Technical Training Conference on Electronics Assembly Technologies 2011 Proceedings, Penang, Malaysia, May 19-20, 2011, pp. xx-xx.

Songping, Wu, "Preparation of micron size flake silver powders for conductive thick films," Journal of Materials Science: Materials in Electronics, vol. 18 no. 4, pp. 447-452, Apr. 2007.

Sonntag, Birgit, and Vogel, Roland, "Chrom(VI)freie Passivierungen fur die Automobilindustrie," Galvanotechnik, vol. xx no. xx, pp. 2408-2413, Oct. 2003.

Sonntag, Birgit, Vogel, Roland, and Jeannier, Eliane, "Passivations sans Cr(VI) pour l'industrie automobile," Galvano , vol. xx no. xx, pp. 157-161, Mar. 2004.

Sonoda, T., Nawafune, H., and Mizumoto, S., "Electrodeposition of Bright Tin from Netral Gluconate Baths," Plating & Surface Finishing, vol. 79 no. 10, pp. 78-81, Oct. 1992.

Sonoda, T., Nawafune, H., and Mizumoto, S., "Properties of Bright Tin-Lead Alloy Deposits From Neutral Gluconate Baths," Plating & Surface Finishing, vol. 82 no. 3, pp. 66-69, Mar. 1995.

Sonu, Chong Ho, and O'Keefe, Thomas J., "Anodic Pulse Enhanced Electrocrystallization (APEX) of Tin," Plating & Surface Finishing, vol. 80 no. 5, pp. 141-145, May 1993.

Sood, Bhanu, Osterman, Michael, and Pecht, Michael, "An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards," IPC APEX Expo 2014, Las Vegas, NV, Mar. 25-27, 2014, pp. xx-xx.

Sood, Bhanu, "Comparison of Halogen Free (HF) and Halogenated Printed Circuit Board Laminate Materials Subjected to Pb-free Soldering Conditions," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Sood, Bhanu, Sanapala, Ravikumar, Das, Diganta, Pecht, Michael, Huang, C. Y., and Tsai, M. Y., "Comparison of Printed Circuit Board Property Variations in Response to Simulated Lead-Free Soldering," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 2, pp. 98-111, Apr. 2010.

Sood, Bhanu, and Pecht, Michael, "Conductive filament formation in printed circuit boards: effects of reflow conditions and flame retardants," Journal of Materials Science: Materials in Electronics, vol. 22 no. 10, pp. 1602-1615, Oct. 2011.

Sood, Bhanu, and Pecht, Michael, "The effect of epoxy/glass interfaces on CAF failures in printed circuit boards," Microelectronics Reliability, vol. 82, pp. 235-243, Mar. 2018.

Sood, Bhanu, Osterman, Michael, and Pecht, Michael, "Tin whisker analysis of Toyota's electronic throttle controls," Circuit World, vol. 37 no. 3, pp. 4-9, 2011.

Sopousek, Jiri, Palcut, Marian, Hodulova, Erika, and Janovec, Jozef, "Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy," Journal of Electronic Materials, vol. 39 no. 3, pp. 312-317, Mar. 2010.

Sorensen, Henning O., Schmidt, Soren, Wright, Jonathan P., Vaughan, Gavin B. M., Techert, Simone, Garman, Elspeth F., Oddershede, Jette, Davaasambuu, Jav, Paithankar, Karthik S., Gundlach, Carsten, and Poulsen, Henning F., "Multigrain crystallography," Zeitschrift fur Kristallographie - Crystalline Materials, vol. 227 no. 1, pp. 63-78, Jan. 2012.

Sorensen, N. Rob, and Vianco, Paul, "The Sn Whisker Issue in High-Reliability Electronics," DoD Fusing Group Briefing, Oct. 30, 2007, pp. xx-xx. (Sandia Report SAND2007-7023C)

Sosiati, H., Hata, S., Kuwano, N., Iwane, Y., Morizono, Y., and Ohno, Y., "Microstructural Characterization of Whiskers and Oxidized Surfaces on Sn/FeNi42 and Pb-free Alloys," CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept. 25-28, 2006, pp. xx-xx.

Sosiati, H., Kuwano, N., Hata, S., Iwane, Y., Morizono, Y., and Ohno, Y., "Tin Whisker Formation on a Lead-free Solder Alloy Studied by Transmission Electron Microscopy," 8th Electronics Packaging Technology Conference , Singapore, Dec. 6-8, 2006, pp. 398-403.

Sosiati, H., Hirokado, N., Kuwano, N., and Ohno, Y., "Transmission Electron Microscopy of Spontaneous Tin (Sn) Whisker Growth under High Temperature/Humidity Storage," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1054-1059.

Souadkia, M., Bennecer, B., and Kalarasse, F., "Elastic, vibrational and thermodynamic properties of a-Sn based group IV semiconductors and GeC under pressure," Journal of Physics and Chemistry of Solids, vol. 74 no. 11, pp. 1615-1625, Nov. 2013.

Soundarrajan, C., Sivasankar, A., Maruthamuthu, S., and Veluchamy, A., "Improved lead recovery and sulphate removal from used lead acid battery through Electrokinetic technique," Journal of Hazardous Materials , vol. 217-218, pp. 452-456, May 30, 2012.

Souriau, Jean-Charles, Brun, Jean, Franiatte, Remi, and Gasse, Adrien, "Development on Wafer Level Anisotropic Conductive Film for Flip-Chip Interconnection," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 155-158.

Souriau, Jean-Charles, Rossat, Cyrille, Gasse, Adrien, Renard, Pierre, and Poupon, Gilles, "Electrical Conductive Film for Flip-Chip Interconnection Based on Z-axis Conductors," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1151-1153.

Sousa, C. T., Leitao, D. C., Proenca, M. P., Apolinario, A., Correia, J. G., Ventura, J., and Araujo, J. P., "Tunning pore filling of anodic alumina templates by accurate control of the bottom barrier layer thickness," Nanotechnology, vol. 22 no. 31, pp. 315602-1-315602-6, Aug. 5, 2011.

Sousa, M. F., Riches, S., Johnston, C., and Grant, P. S., "Understanding Die Attach Materials Performance in Electronic Packages Under Harsh Environments," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Southworth, A. R., Ho, C. E., Lee, A., and Subramanian K. N., "Effect of strain on whisker growth in matte tin," Soldering & Surface Mount Technology, vol. 20 no. 1, pp. 4-7, 2008.

Souza, Crista, "Are you green enough?," Green SupplyLine, Apr. 1, 2004.

Souza, Crista, "Are you green enough?," Electronics Supply & Manufacturing , Apr. 2004.

Souza, Crista, "EU ponders makeover for lead-free directive," Green SupplyLine , Dec. 1, 2004.

Souza, Crista, "Prepare for China's green legislation," EE Times Europe, Dec. 1, 2006.

Souza, Crista, "Prepare for China's green legislation," Green SupplyLine, Dec. 1, 2006.

Souza, Crista, "Prepare for China's green legislation," Electronics Supply & Manufacturing, Dec. 2006.

Souza, Crista, "The Next Big Design Challenge," Electronics Supply & Manufacturing, Apr. 2005.

Souza, Crista, "The Next Big Design Challenge," Green SupplyLine, Apr. 1, 2005.

Sowah, Sara, "Uphill battle to end the use of lead," EE Times, Feb. 25, 2002.

Sowinski, Roger, "Increasing Bath Life and Quality of Trivalent Passivates on Zinc Plate," Products Finishing, vol 83 no. 7, pp. 30, Apr. 2019.

Spalding, Keith, "Tin Whisker Test - Phase II Passives."

Spalding, O., "Thermal Effects of Replacing Solder with Conductive Adhesives," Microelectronics International, vol. 10 no. 2, pp. 26-28, 1993.

Spalvins, Erik, Dubey, Brajesh, and Townsend, Timothy, "Impact of Electronic Waste Disposal on Lead Concentrations in Landfill Leachate," Environmental Science & Technology, vol. 42 no. 19, pp. 7452-7458, Oct. 1, 2008.

Sparks, Doug, "Advances in high-reliability, hermetic MEMS CSP," Chip Scale Review , vol. 20 no. 5, pp. 36-39, Sept.-Oct. 2016.

Spear, Mike, "European chemical makers face printer overloads," Chemical Processing, vol. 70 no. 2, pp. xx-xx, Feb. 2007.

Spear, Mike, "Industry tackles a grave issue," Chemical Processing, vol. 69 no. 11 pp. xx-xx, Nov. 2006.

Spear, Mike, "Rise to the challenge of global legislation," Chemical Processing , vol. 69 no. 11, pp. xx-xx, Nov. 2006.

Spear, Mike, "The end of the affair," Control, vol. 20 no. 3, pp. 45-49, Mar. 2007.

Spear, Rod, "WEEE and RoHS -- have we been focused on the wrong issue?," Electronic Products, vol. 48 no. 9, pp. 90, Feb. 2006.

Spearot, Rebecca M., and Tandel, Vijay P., "End of Life Vehicle Regulations and Automotive OEM Specifications Requirements for Product Content Reporting - Influence on a Tier 1 Automotive Supplier," Proceedings 2004 AESF/EPA Conference for Environmental & Process Excellence, Orlando, FL, Jan. 26-29, 2004, pp. 122-131.

Spearot, Rebecca M., and Peck, John V., "Environmental and Safety Consequences: The Hidden Value in New Metal Finishing Processes," Plating and Surface Finishing, vol. 72 no. 10, pp. 22-28, Oct. 1985.

Sperling, Ed, "Call In the Lawyers," Electronic News, Oct. 13, 2005.

Sperling, Ed, "Environmental Rules Are Your Business," Electronic News, July 27, 2005.

Sperling, Ed, "Get Used To Tin Whiskers," Electronic News, May 5, 2006.

Sperling, Ed, "Hidden Costs Begin to Surface," Electronic News, May 25, 2006.

Sperling, Ed, "Lead: Hazardous to the bottom line?," Electronics Weekly, Apr. 29, 2005.

Sperling, Ed, "Not Ready Yet," Electronic News, Oct. 27, 2005.

Sperling, Ed, "Off-The-Shelf Migraines," EECatalog.

Sperling, Ed, "On, Off, and Somewhere in Between," Electronic News, July 29, 2005.

Sperling, Ed, "On, off and somewhere in between," Electronics Weekly, Aug. 3, 2005.

Sperling, Ed, "Psst, Do You Know What's in Your MP3 Player?," Electronic News , Aug. 24, 2005.

Sperling, Ed, "Ready or not, environmental laws are coming," Electronics Weekly , July 28, 2005.

Sperling, Ed, "RoHS Creates New Business Opportunities," Electronic News, Aug. 11, 2005.

Sperling, Ed, "RoHS Directive: Call in the lawyers," Electronics Weekly, Oct. 13, 2005.

Sperling, Ed, "RoHS: Supply chain not yet ready," Electronics Weekly, Oct. 27, 2005.

Sperling, Ed, "RoHS will lead to tin whiskers," Electronics Weekly, May 8, 2006.

Sperling, Ed, "Standards mooted for RoHS reporting," Electronics Weekly, Jan. 26, 2006.

Sperling, Ed, "Turning Green," Electronic News, Feb. 17, 2006.

Sperling, Ed, "Warning: Lead May Be Hazardous to Your Bottom Line," Electronic News, Apr. 29, 2005.

Sperling, Ed, "We've Been Watching You," Electronic News, Oct. 28, 2005.

Sperling, Ed, "What Sticks and What Doesn't?," Electronic News, Apr. 2005.

Sperling, Ed, "Who Foots the Bill?," Electronic News, Sept. 7, 2005.

Sperling, Ed, "Who's setting standards and why?," Electronics Weekly, Apr. 22, 2005.

Spexarth, F., Cronin, J., and Johnson, W., "Reliable GaAs Microwave Assembly Using SilvarTM Heat Sink and Carrier Components," Proceedings of the 1994 International Electronics Packaging Conference, Atlanta, GA, Sept. 25-28, 1994, pp. 247-257.

Spicer, D., Lal, K., Kornelsen, K., Brennan, A., Belov, N., Wang, M., and Chou, T-K., "Pressure Distribution in Wafer-to-Wafer Bonding," Wafer & Device Packaging and Interconnect, vol. 1 no. 4, pp. 34-37, Mar./Apr. 2010.

Spiegel, Rob, "Anxiety Grows Over RoHS Compliance," Electronic News, Dec. 23, 2004.

Spiegel, Rob, "Anxiety grows over RoHS compliance," Electronics Weekly, Dec. 24, 2004.

Spiegel, Rob, "Are Two Standards Better Than One?," Electronic News, Feb. 9, 2006.

Spiegel, Rob, "Assessing the Risks: RoHS Compliance," Electronic News, Sept. 22, 2005.

Spiegel, Rob, "Assistance Available as Scurry for RoHS Compliance Begins," ElectronicNews, vol. xx no. xx, pp. xx-xx, Mar. 11, 2005.

Spiegel, Rob, "Avnet Not Hurt by RoHS Conversion," Electronic News, Apr. 28, 2006.

Spiegel, Rob, "Avnet Offers i2 Lead-Free Database," Electronic News, Nov. 10, 2004.

Spiegel, Rob, "Avnet offers lead-free database," Electronics Weekly, Nov. 11, 2004.

Spiegel, Rob, "Big Companies Better Prepared for RoHS," Design News, July 29, 2005.

Spiegel, Rob, "Can You Say EuP?," Avnet Advantage, Aug. 2005.

Spiegel, Rob, "Case Study: Playing Both Sides of RoHS," Avnet Advantage, May 2006.

Spiegel, Rob, "Case Study: The Search For Leaded Parts," Avnet Advantage, May 2006.

Spiegel, Rob, "Commentary: Leaded Or Unleaded?," Avnet Advantage, Nov. 2004.

Spiegel, Rob, "Companies Enter Compliance Services Market," Electronic News , Dec. 22, 2005.

Spiegel, Rob, "Compliance Requires Data and Testing," Electronic News, Nov. 21, 2005.

Spiegel, Rob, "Could REACH be the nightmare after RoHS," Electronics Weekly , July 27, 2006.

Spiegel, Rob, "Counterfeit components find new markets," EDN, vol. 54 no. 7, pp. 66, Apr. 9, 2009.

Spiegel, Rob, "Counterfeit components remains a huge electronics supply chain problem," Electronic Business, Mar. 3, 2009.

Spiegel, Rob, "Counterfeiters Compliant," Electronic News, Dec. 7, 2005.

Spiegel, Rob, "Crying Wolf or Seeing Real Whiskers?," Avnet Advantage, Mar. 2005.

Spiegel, Rob, "Defense And Aerospace Try To Get The Lead Back In," ED Online , ID # 16315, Aug. 3, 2007.

Spiegel, Rob, "Design Engineers Become Compliance Regulators," Avnet Advantage , Aug. 2005.

Spiegel, Rob, "Designing Products for the Global Marketplace," Avnet Advantage , Dec. 2004.

Spiegel, Rob, "Distribution Guarantee?," Electronic News, Jan. 22, 2006.

Spiegel, Rob, "Distribution in 2005: Slow and Steady," Electronic News, Jan. 26, 2005.

Spiegel, Rob, "Distributors add to RoHS support services," Electronics Weekly , Apr. 27, 2006.

Spiegel, Rob, "Distributors Beef Up RoHS Services," Electronic News, Apr. 27, 2006.

Spiegel, Rob, "Distributors spreading RoHS data," electronicsweekly.com, Feb. 4, 2005.

Spiegel, Rob, "Distributors Spreading RoHS Data as Deadline Looms," Electronic News, Feb. 4, 2005.

Spiegel, Rob, "Distributors Spreading RoHS Data as Deadline Looms," ECN, Feb. 4, 2005.

Spiegel, Rob, "Electronics Industry Is Still Far From Complying With RoHS," Design News, Feb. 1, 2007.

Spiegel, Rob, "End Times Near for Many Non-RoHS-Compliant Parts," Electronic News , Apr. 13, 2006.

Spiegel, Rob, "EU Updates Hazardous Substances Guidelines," Design News, July 11, 2011.

Spiegel, Rob, "EuP: The EU's Latest Directive," Electronic News, Aug. 25, 2005.

Spiegel, Rob, "Europe opts for Eco-design," ElectronicsWeekly.com, Aug. 25, 2005.

Spiegel, Rob, "Even MRO is Affected by RoHS," Electronic News, Sept. 5, 2005.

Spiegel, Rob, "Even spares are affected by RoHS," Electronics Weekly, Sept. 5, 2005.

Spiegel, Rob, "Exempt Industries Struggle with RoHS," Electronic News, May 11, 2006.

Spiegel, Rob, "First On The Green," Avnet Advantage, Nov. 2004.

Spiegel, Rob, "Four Steps to RoHS Compliance," Electronic News, June 29, 2005.

Spiegel, Rob, "Gaps in the Lead-Free Conversion," Semiconductor International , vol. xx no. xx, pp. xx, Dec. 16, 2004.

Spiegel, Rob, "Gaps in the Lead-Free Conversion," Electronic News, Dec. 16, 2004.

Spiegel, Rob, "Getting Ready for RoHS?," Avnet Advantage, Jan. 2005.

Spiegel, Rob, "Hazardous Rules Ahead," Avnet Advantage, Mar. 2005.

Spiegel, Rob, "India Passes WEEE & RoHS Regulations," Design News, July 5, 2011.

Spiegel, Rob, "Industry Move to Compliance Slips into Chaos," Electronic News , Oct. 11, 2005.

Spiegel, Rob, "iNEMI Releases Lead-Free Process Book," Design News, July 7, 2011.

Spiegel, Rob, "iNEMI Releases Tests to ID Tin Whisker Problems," Electronic News , June 6, 2005.

Spiegel, Rob, "IPC Communications Standard Scrutinized by Industry," Electronic News, Sept. 22, 2005.

Spiegel, Rob, "IPC Materials Standards Ready for Release," Electronic News, Feb. 22, 2006.

Spiegel, Rob, "Is Asia Ready for RoHS?," Electronic News, Mar. 5, 2006.

Spiegel, Rob, "Is the $700 hammer back?," Avnet Advantage, June 2005.

Spiegel, Rob, "Kudos, Embarrassment & New Questions," Avnet Advantage, Dec. 2005.

Spiegel, Rob, "Lead-free Design Challenges Mount," Avnet Advantage, June 2004.

Spiegel, Rob, "Lead-Free Rules Create Havoc," Electronic News, vol. 50 no. 28, pp. xx, July 12, 2004.

Spiegel, Rob, "Lead-Free Solder Is Holding Up," Design News, July 13, 2011.

Spiegel, Rob, "Lead-Free: Watching Out for the Customer," Avnet Advantage, June 2004.

Spiegel, Rob, "Leaded parts still in high demand," Electronic Business, Jan. 20, 2009.

Spiegel, Rob, "LTK taps Underwriters Laboratory for RoHS Compliance," Electronic News, Nov. 9, 2005.

Spiegel, Rob, "Living By The Numbers," Avnet Advantage, May 2005.

Spiegel, Rob, "Managing the Risk in RoHS Compliance," ElectronicNews, May 9, 2005.

Spiegel, Rob, "Materials Composition Standard Gets Workover," Design News, Aug. 30, 2005.

Spiegel, Rob, "Materials Documentation Still a Mess," Design News, Aug. 22, 2005.

Spiegel, Rob, "Messing With The Numbers," Avnet Advantage, June 2004.

Spiegel, Rob, "Most Parts Suppliers Ready for RoHS," Electronic News, Aug. 19, 2005.

Spiegel, Rob, "More PLM Vendors Ready to Manage Compliance," Electronic News , June 8, 2006.

Spiegel, Rob, "Newark InOne Offers BOM Update," Electronic News, Oct. 21, 2005.

Spiegel, Rob, "Newark InOne Offers RoHS-only Catalog," Electronic News, Feb. 23, 2006.

Spiegel, Rob, "Newark Launches Interactive RoHS Catalog," Electronic News, Apr. 11, 2006.

Spiegel, Rob, "Newark Launches RoHS Site," Electronic News, May 11, 2005.

Spiegel, Rob, "Newark Takes Lead-Free Soldering to Net," Electronic News, Aug. 29, 2005.

Spiegel, Rob, "Not All Products Have To Comply with RoHS," Avnet Advantage, Jan. 2005.

Spiegel, Rob, "PartMiner Expands RoHS Data, Partners with Thomas B2B," Electronic News, May 2, 2005.

Spiegel, Rob, "Parts Go Green, Documentation Doesn't," Avnet Advantage, Aug. 2005.

Spiegel, Rob, "Passing the Test," Electronic News, Dec. 7, 2005.

Spiegel, Rob, "PLM Companies Develop Compliance Support," Electronic News, Apr. 27, 2006.

Spiegel, Robert, "Rivaling a Fruit Fly's Brief Existence," Design News, vol. xx no. xx, pp. xx, June 28, 2004.

Spiegel, Rob, "Robots dip lead to end tin whiskers," Design News, Feb. 6, 2009.

Spiegel, Rob, "RoHS Challenges Facing Design Process," Avnet Advantage, Dec. 2005.

Spiegel, Rob, "RoHS Challenges MRO Parts," Electronic News, May 25, 2006.

Spiegel, Rob, "ROHS changes keep design engineers vigilant," EDN, vol. 54 no. 9, pp. 54, May 14, 2009.

Spiegel, Rob, "RoHS compliance: Assessing the risks," Electronics Weekly, Sept. 23, 2005.

Spiegel, Rob, "RoHS Deadline Looms Over Industry," Avnet Advantage, Dec. 2005.

Spiegel, Rob, "RoHS Leaves Exempt Industries in a Bind," Avnet Advantage, May 2006.

Spiegel, Rob, "RoHS Recasts Brings Clarity to Dev Kits," Design News, Dec. 11, 2010.

Spiegel, Rob, "ROHS recast: Electronics industry braces for further regulation," EDN, vol. 55 no. 15, pp. 52, Aug. 12, 2010.

Spiegel, Rob, "RoHS rules will hit supply of non-compliant components," Electronics Weekly, May 12, 2006.

Spiegel, Rob, "RoHS: The Biggest Headache the Industry Has Ever Seen," Electronic News, Aug. 10, 2005.

Spiegel, Rob, "RoHS: The biggest headache the industry has ever seen," Electronics Weekly, Aug. 10, 2005.

Spiegel, Rob, "Scurry for RoHS compliance begins," Electronics Weekly.com, Mar. 14, 2005.

Spiegel, Rob, "Same Parts, New Numbers?," Electronic News, Aug. 4, 2004.

Spiegel, Rob, "Serious Doubts Among Engineers on Tin Whisker Testing," Design News , Aug. 5, 2005.

Spiegel, Rob, "Should Design Engineers Run Environmental Compliance?," Design News , Sept. 28, 2011.

Spiegel, Rob, "Sites Abound with RoHS Info," Design News, Aug. 5, 2005.

Spiegel, Rob, "Suppliers getting up to speed on RoHS," Electronics Weekly, July 4, 2005.

Spiegel, Rob, "Suppliers Ready for Lead-Free, But Balk at New Part Numbers," Electronic News, Nov. 10, 2004.

Spiegel, Rob, "Suppliers Slowly Getting Up to Speed on RoHS," Electronic News , July 4, 2005.

Spiegel, Rob, "Supply Chain Disruptions Expected from Lead-Free Conversion," Electronic News, June 1, 2005.

Spiegel, Rob, "Take-Back Laws Taken On by 13 Countries," Electronic News, Oct. 26, 2005.

Spiegel, Rob, "Testing the Tester," Electronic News, Mar. 23, 2006.

Spiegel, Rob, "Tests spot tin whisker problems," Electronics Weekly, June 6, 2005.

Spiegel, Rob, "The Long And Bumpy Road to Going Green," Avnet Advantage, May 2005.

Spiegel, Rob, "The Nightmare After RoHS: REACH," Electronic News, July 26, 2006.

Spiegel, Rob, "Threat of Tin Whiskers Haunts Rush to Lead-Free," Electronic News , Mar. 17, 2005.

Spiegel, Rob, "Tin whisker debate roars on," Design News, vol. xx no. x, pp. xx-xx, Jan. 9, 2006.

Spiegel, Rob, "Tin whiskers haunt rush to Pb-free," Electronics Weekly, Mar. 17, 2005.

Spiegel, Rob, "US firms question RoHS enforcement," Electronics Weekly, July 13, 2006.

Spiegel, Rob, "US suppliers ready for RoHS," ElectronicsWeekly.com, Aug. 22, 2005.

Spiegel, Rob, "Vendors Line Up to Offer RoHS Help," Electronic News, Nov. 9, 2005.

Spiegel, Rob, "Waiting for the RoHS Enforcement," Electronic News, July 13, 2006.

Spiegel, Rob, "What's Going Glut and What's Not?," Electronic News, Jan. 12, 2006.

Spiegel, Rob, "Who's Got Lead?," Avnet Advantage, June 2005.

Spinelli, Jose Eduardo, Silva, Bismarck Luiz, and Garcia, Amauri, "Assessment of Tertiary Dendritic Growth and Its Effects on Mechanical Properties of Directionally Solidified Sn-0.7Cu-xAg Solder Alloys," Journal of Electronic Materials, vol. 43 no. 5, pp. 1347-1361, May 2014.

Spinelli, Jose Eduardo, and Garcia, Amauri, "Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders," Journal of Materials Science: Materials in Electronics, vol. 25 no. 1, pp. 478-486, Jan. 2014.

Spinelli, Jose Eduardo, and Garcia, Amauri, "Microstructural development and mechanical properties of hypereutectic Sn-Cu solder alloys," Materials Science and Engineering: A, vol. 568, pp. 195-201, Apr. 15, 2013.

Spitler, Alexandra L. M., and Hilty, Robert D., "Effect of Transient Thermal Profiles in Wave Soldering Processes on Connector Performance," IPC/APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. xx-xx.

Spitler, Alexandra L. M., and Hilty, Robert D., "Effect of Transient Thermal Profiles in Wave Soldering Processes on Connector Performance," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S27-5-1-S27-5-14.

Spolenak, R., Kraft, O., and Arzt, E., "Alloying Effects in Electromigration: What Controls the Electromigration Drift?," AIP Conference Proceedings, vol. 491, pp. 126-137, 1999.

Spraul, M., Nuchter, W., Wunderle, B., and Michel, B., "FE analysis and experimental testing of a 4-pin ceramic test vehicle with tin-lead and tin-silver-copper solder joints," Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, Apr. 18-20, 2005, pp. 441-447.

Spraul, M., Nuchter, W., Moller, A., Wunderle, B., and Michel, B., "Reliability of SnPb and Pb-Free Flip-Chips Under Different Test Conditions," Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems , Brussels, Belgium, May 9-12, 2004, pp. 437-442.

Spraul, M., Nuchter, W., Moller, A., Wunderle, B., and Michel, B., "Reliability of SnPb and Pb-free flip-chips under different test conditions," Microelectronics Reliability, vol. 47 no. 2-3, pp. 252-258, Feb.-Mar. 2007.

Sprovieri, John, "01005s and Lead-Free Solder," Assembly, vol. 49 no. 5, pp. 54-59, May 2006.

Sprovieri, John, "It is Easy Being Green," Assembly, vol. xx no. xx, pp. xx-xx, Mar. 2003.

Sprovieri, John, "Lead into Gold," Assembly, vol. 49 no. 1, pp. 62-68, Jan. 2006.

Sprovieri, John, "Moving Ahead in Lead-Free," Assembly, vol. xx no. xx, pp. xx-xx, Jan. 2004.

Sprovieri, John, "Trimming Whiskers," Assembly, vol. xx no. xx, pp. xx-xx, Dec. 2006.

Squires, Glade E., "Brominated Flame Retardants Voluntary Emissions Control Action Program (VECAPT)," 2008 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 19-21, 2008, pp. xx-xx.

Sridhar, Sharath, Raj, Anto, Gordon, Seth, Thirugnanasambandam, Sivasubramanian, Evans, John L., and Johnson, Wayne, "Drop Impact Reliability Testing of Isothermally Aged Doped Low Creep Lead-free Solder Paste Alloys," 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 31-June 3, 2016, pp. 501-506.

Sridhar, Sharath, Raj, Anto, Evans, John, Bozack, Michael, Johnson, Wayne, and Hamasha, Sa'd, "Reliability Study of Doped Lead Free Solder Paste Alloys by Thermal Cycling Testing," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 562-567.

Sridhar, Sharath, Thirugnanasambandam, Sivasubramanian, Gordon, Seth, Raj, Anto, Sanders, Thomas, Evans, John, and Johnson, Wayne, "Reliability Testing of Isothermally Aged Doped Low Creep Lead-Free Solder Paste Alloys Under Vibration and Shock Conditions," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 432-437.

Srinath, Purushotham K. Muthur, and Aswath, Pranesh B., "Impression creep of monolithic and composite lead free solders," Journal of Materials Science, vol. 42 no. 17, pp. 7592-7600, Sept. 2007.

Srinivas, Vikram, Williard, Nicholas, Chauhan, Preeti, and Osterman, Michael, "Board Level Reliability Evaluation of Low Silver (Ag) Content Lead-Free Solder Joints at Low Strain Rates," International Conference on Soldering & Reliability 2010 Proceedings, Toronto, Ontario, Canada, May 17-20, 2010, pp. xx-xx.

Srinivas, Vikram, Al-Bassiyiouni, Moustafa, Osterman, Michael, and Pecht. Michael, "Characterization of Lead-Free Solder Interconnects Reliability under Torsional Loads," Proceedings of the ASME International Mechanical Engineering Congress & Exposition, Volume 5: Electronics and Photonics , Lake Buena Vista, FL, Nov. 13-19, 2009, pp. 211-216.

Srinivas, Vikram, Al-Bassyiouni, Moustafa, Osterman, Michael, and Pecht, Michael, "Impact of Rework on Reliability of Plastic Ball Grid Arrays Subjected to Mechanical Bend Test," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

Srinivas, Vikram, Menon, Sandeep, Osterman, Michael, and Pecht, Michael G., "Modeling the Rate-Dependent Durability of Reduced-Ag SAC Interconnects for Area Array Packages Under Torsion Loads," Journal of Electronic Materials, vol. 42 no. 8, pp. 2606-2614, Aug. 2013.

Srinivas, Vikram, Osterman, Michael, and Farrell, Robert, "Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages under Torsion Loads," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S34_03-1-S34_03-11.

Srivastava, G. P., "Self-consistent pseudopotential calculations for the electronic structure of bulk and (111) surface of a-Sn," Journal of Physics C: Solid State Physics, vol. 15, pp. 699-706, 1982.

Srivastava, M., and Sharma, R. C., "Thermodynamic Analysis and Phase Equilibria Calculations of Pb-Zn, Sn-Zn, and Pb-Sn-Zn Systems," Journal of Phase Equilibria, vol. 14 no. 6, pp. 700-709, 1993.

Srivastava, S., and Arya, K., "Threshold Characteristics of Interband Electronic Raman Scattering," Physical Review B, vol. 8 no. 2, pp. 667-675, July 15, 1973.

Sriyarunya, Anocha, Tondtan, Jiraporn, and Kittidacha, Witoon, "Backward Compatibility of Solder Alloys With Chip Scale Package," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 673-675.

Sriyarunya, Anocha, Tondtan, Jiraporn, Kittidecha, Witoon, and Tukiman, Hasmani, "Board Level Reliability of Mixed Solder Interconnects," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 249-253.

Sriyarunya, Anocha, and Schetty, Rob, "Lead-Free Plating for Semiconductor Devices Production Qualification & Implementation," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 187-198.

Sriyarunya, Anocha, and Schetty, Rob, "Lead-Free Plating for Semiconductor Devices Qualification & Implementation," 2003 Electronics Packaging Technology Conference , Dec 10-12, 2003, pp. 59-64.

Sriyarunya, Anocha, and Schetty, Rob, "Lead-Free Plating of Semiconductor Devices Qualification & Manufacturability Study," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 23-24, 2003, pp. 158-166.

Sriyarunya, Anocha, "Manufacturability and Reliability of Lead-free Package," Proceedings of 2004 International IEEE Conference on the Asian Green Electronics, Shanghai, China, Apr. 27-30, 2004, pp. 105-109.

Sriyarunya, Anocha, Tondtan, Jiraporn, and Tukiman, Hasmani, "Matte Tin (Sn) Plating of Semiconductor Devices - Update of Whisker Growth Study," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 94-102.

Sriyarunya, Anocha, and Bansal, Dhiraj, "Matte Tin (Sn) Plating Of Semiconductor Devices - Whisker Growth Study," Proceedings of IPC/JEDEC 6th International Conference on Lead-Free Electronic Assemblies and Components, Singapore, Aug. 18-20, 2004, pp. xx-xx.

Sriyarunya, Anocha, Tondtan, Jiraporn, and Bansal, Dhiraj, "Matte Tin (Sn) Plating: Whisker Growth Study," 2004 Electronics Packaging Technology Conference, Dec. 8-10, 2004, pp. 281-288.

Sriyarunya, Anocha, and Tondtan, Jiraporn, "Tin Whisker Mitigation Study on Alloy 42 Pure Tin Plating" 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 726-732.

Sruti, A. Naga, and Jagannadham, K., "Electrical Conductivity of Graphene Composites with In and In-Ga Alloy," Journal of Electronic Materials, vol. 39 no. 8, pp. 1268-1276, Aug. 2010.

St. Cyr, Valerie A., "New Laminates for High Reliability Printed Circuit Boards," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S12-01-1-S12-01-21.

St. Germain, Steve, Celaya, Phil, and Amaro, Isauro, "Board Mounting Notes for SO8-Flat Lead," EE Times - Asia, vol. xx no. xx, pp. xx-xx, June 22, 2005.

St. Onge, Gary, "The Finer Points of Test," Evaluation Engineering, vol. 45 no. 1, pp. 36, 38-41, Jan. 2006.

Stach, Steve, and Bixenman, Mike, "Optimizing batch cleaning for removing lead-free flux residues on PCAs," Global SMT and Packaging, vol. 8 no. 9, pp. 12-16,18-19, Sept. 2008.

Stach, Steve, and Bixenman, Mike, "Optimizing Batch Cleaning Process Parameters for Removing Lead-Free Flux Residues on Populated Circuit Assemblies," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 402-410.

Stach, Steve, "Step 9: Cleaning," Surface Mount Technology (SMT), vol. 16 no. 10, pp. xx-xx, Oct. 2002.

Stacy, B. F., Mayer, L. J., Abys, J. A., Fan, C., and Straschil, H. K., "A Stable Electroless Palladium Plating System For Electronics Circuit Finishing," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. 119-121.

Stacy, B. F., Kadija, I. V., Mayer, L. J., Kudrak, E. J., Fan, C., Abys, J. A., and Straschil, H. K., "Palladium for PWB Applications," Proceedings of the Technical Program NEPCON West '97, Volume 3, Anaheim, CA, Feb. 23-27, 1997, pp. 1569-1578.

Stadem, Richard, and Cristea, Cornel, "A Novel Process for Automated Lead Tinning," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 2, pp. 40-42, Feb. 2010.

Staffiere, Donald T., "Designing product for the environment," Tenth Annual Applied Power Electronics Conference and Exposition, Volume 1, Dallas, TX, Mar. 5-9, 1995, pp. 76-77.

Stafford, G. R., Williams, M. E., Johnson, C. E., Moon, K.-W., Bertocci, U., Kongstein, O., and Boettinger, W. J., "Whisker Formation in Pb-Free Surface Finishes," ECS Transactions , vol. 1 no. 13, pp. 71-86, July 2006. https://doi.org/10.1149/1.2214599

Stafford, G. R., Williams, M. E., Shin, J. W., Moon, K.-W., Beauchamp, C. R., and Boettinger, W. J., "Whisker Formation in Pb-Free Surface Finishes," ECS Transactions , vol. 28 no. 2, pp. 499-512, Apr. 2010. https://doi.org/10.1149/1.3372604

Stafford, Jason, "Reflow Blower and Vibration Characterization, Effect on BGA Bridging," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Stafford, Steve, "Chain reaction," Dataweek, vol. xx no. xx, pp. xx-xx, Apr. 6, 2005.

Stafstrom, Eric, Wengenroth, Karl, and Fudala. John, "Addressing Future Surface Finishing Needs with OSPs," Circuits Assembly , vol. 10 no. 5, pp. 44,47-52, May 1999.

Stafstrom, Eric, "Good as Gold," Printed Circuit Fabrication, vol. 20 no. 4, pp. 26-30, Apr. 1997.

Stafstrom, Eric, and Wengenroth, Karl, "OSPs: The Next Generation," Proceedings of the Technical Program NEPCON West 2000, Volume 2, Anaheim, CA, Feb. 29-Mar. 2, 2000, pp. 875-884.

Stafstrom, Eric, "Unraveling the Final Finishing Mystery," Circuits Assembly, vol. xx no. xx, pp. 56-62, Nov. 2000.

Stager, R. A., Balchan, A. S., and Drickamer, H. G., "High-Pressure Phase Transition in Metallic Tin," Journal of Chemical Physics, vol. 37 no. 5, pp. 1154, Sept. 1, 1962.

Stagon, Stephen, Knapp, Alex, Elliott, Paul, and Huang, Hanchen, "Advances in Conductive Adhesives at Ambient Temperature," Global SMT and Packaging, vol. 16 no. 2, Feb. 2016, pp. 16-19.

Stahlmecke, Burkhard, and Dumpich, Guenter, "In-Situ Observation of Electromigration in Gold Nanowires," Defect and Diffusion Forum, vol. 237-240, pp. 1163-1167, Apr. 2005.

Stam, F., O'Grady, P., and Barrett, J., "Characterization and Reliability Study of Anisotropic Conductive Adhesives for Fine Pitch Package Assembly," Journal of Electronics Manufacturing , vol. 5 no. 1, pp. 1-8, Mar. 1995.

Stam, F. A., Davitt, E., and Barrett, J., "Reliability Testing of SnAgCu Solder Surface Mount Assembly," 1999 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 3906), Chicago, IL, Oct. 26-28, 1999, pp. 259-263.

Stan, Gheorghe, Krylyuk, Sergiy, Davydov, Albert V., and Cook, Robert F., "Bending manipulation and measurements of fracture strength of silicon and oxidized silicon nanowires by atomic force microscopy," Journal of Materials Research, vol. 27 no. 3, pp. 562-570, Feb. 14, 2012.

Stanfield, Adam A., and Mannan, Samjid H., "Gallium-based interconnects for flip-chip assembly," Soldering & Surface Mount Technology, vol. 10 no. 3, pp. 18-22, 1998.

Stankus, S. V., Savchenko, I. V., and Agazhanov, A. Sh., "Thermal Conductivity and Thermal Diffusivity of Liquid Indium-Tin Alloys," International Journal of Thermophysics, vol. xx no. x, pp. xx-xx, xxxx.

Stanley, S. A., Stuttle, C., Caruana, A. J., Cropper, M. D., and Walton, A. S. O., "An investigation of the growth of bismuth whiskers and nanowires during physical vapour deposition," Journal of Physics D: Applied Physics , vol. 45 no. 43, pp. 435304-1-435304-12, Oct. 31, 2012.

Stansfield, Mark, "PROFILE key to the Lead-free challenge," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, Oct. 2003.

Stanton, Neil, "Facing up to the changing hazards," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Jan. 4, 2008.

Stanton, Neil, "The RoHS Directive Routes to Compliance," SMART Group 8th Annual Lead-Free Seminar + 'Question Time' & Table-Top Exhibition, High Wycombe, United Kingdom, Feb. 16, 2006.

Stark, Brian H., and Najafi, Khalil, "A Mold and Transfer Technique for Lead-Free Fluxless Soldering and Application to MEMS Packaging," IEEE/ASME Journal of Microelectromechanical Systems, vol. 15 no. 4, pp. 849-858, Aug. 2006.

Starkey, Pete, "EIPC Technical Seminar: Halogen Free ...," Circuitree, vol. 19 no. 9, pp. xx-xx, Sept. 2006.

Starkey, Pete, "Halogen-free is Not for free!," PCB007, Sept. 11, 2006.

Starkey, Pete, "ICT Evening Seminar: Restriction of Hazardous Substances," Circuit World, vol. 32 no. 3, pp. xx-xx, 2006.

Starkey, Pete, "ICT Seminar: Addressing Environmental Needs," PCB007, Sept. 25, 2008.

Starkey, Pete, "ICT Seminar: Restriction of Hazardous Substances," PCB007, Mar. 3, 2006.

Starkey, Pete, "PCB Considerations for Lead-Free Assembly," SMART Ireland Lead-Free Materials + Legislation Seminar, Dublin, Ireland, Sept. 23, 2004.

Starkey, Pete, "RoHS PCB specification - What has to change?," emsnow, Dec. 11, 2006.

Starkey, Peter, and Judd, Mike, "SMART advice on pb-free and forecasting," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Feb. 2005.

Starkey, Pete, "Technology Breakthroughs: Bending the Design Rules," PCB007, Nov. 19, 2008.

Starkey, Pete, "The A-Z of Lead-Free Reliability: SMART Group workshop at NPL," PCB007, Jan. 23, 2009.

Starkey, Peter, "The (Electronics) Merchants of Venice," Circuitree, vol. 19 no. 8, pp. xx-xx, Aug. 2006.

Starkey, Pete, "The Way We See It," CircuiTree, vol. 20 no. 4, pp. xx-xx, Apr. 2007.

Starkey, Pete, "Tin Whisker mitigation methodologies," Transactions of the IMF, vol. 95 no. 4, pp. 180-182, 2017. https://doi.org/10.1080/00202967.2017.1283896

Starr, John E.. "Ruggedness and Reliability of Lead Free Electronics," 2010 Proceedings - Annual Reliability and Maintainability Symposium, San Jose, CA, Jan. 25-28, 2010, pp. xx-xx.

Starski, J.Piotr, and Rudnicki, Janusz, "Numerical Analysis of Conductive Adhesive Based Flip Chip Connections," IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging, Oct. 23-25, 2000, pp. 91-94.

Stary, Jiri, and Szendiuch, Ivan, "Lead Free Solder Material Compatibility and Technological Factors," 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, Vienna, Austria, May 19-20, 2005, pp. 94-99.

Stary, Jiri, and Szendiuch, Ivan, "Some Aspects of Lead Free Soldering," 26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials, The High Tatras, Slovak Republic, May 8-11, 2003, pp. 175-178.

Staubli, Paul, Prymak, John, and Prevallet, Mike, "MLC Flex Comparison of Lead Free Versus Lead Based Solders," Proceedings of CARTS-Europe 2005, Prague, Czech Republic, Oct. 17-20, 2005, pp. 50-56.

Steele, Nancy, and Allen, David, "Evaluation of Recycling and Disposal Options for Batteries," IEEE International Symposium on Electronics and the Environment, Dallas, TX, May 6-8, 1996, pp. 135-140.

Steen, H., "Assessment of Some Published Data on Lead-Free Solder Joint Reliability," SMART Group/NPL Lead Free Seminar 2003, Feb. 23, 2003.

Steen, Hector, "Assessment of Some Published Data on Lead-Free Solder Joint Reliability," Design For Reliability Seminar/Exhibition, Shannon, Ireland, May 30, 2002.

Steen, Hector, and Toleno, Brian, "Development of a Lead-Free Alloy for High-Reliability, High-Temperature Applications," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. xx-xx.

Steen, Hector, and Toleno, Brian, "Lead-free for High-reliability, High-temperature Applications," Surface Mount Technology Online Article.

Steffani, C. P., Dini, J. W., Groza, J. R., and Palazoglu, A., "Electrodeposition and Corrosion Resistance of Ni-W-B Coatings," Journal of Materials Engineering and Performance, vol. 6 no. 4, pp. 413-416, Aug. 1997.

Steffani, Chris, and Meltzer, Michael, "Electrodeposited Tungsten-Nickel-Boron: A Replacement for Hexavalent Chromium," Lawrence Livermore National Laboratory UCRL-ID-120611, Apr. 1995.

Stehr, Ken, "Compliance Screening Using a Small Spot Hand-held XRF Analyzer," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Stein, Berl, "Fast and Accurate Deposit Internal Stress Determination," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Stein, J., Tineo, C. A. Cordova, Welzel, U., Huege, W., and Mittemeijer, E. J., "Microstructural Development and Possible Whiskering Behavior of Thin Sn Films Electrodeposited on Cu(Zn) Substrates," Journal of Electronic Materials , vol. 44 no. 3, pp. 886-894, Mar. 2015.

Stein, J., Welzel, U., Leineweber, A., Huegel, W., and Mittemeijer, E. J., "The crystallographic growth directions of Sn whiskers," Acta Materialia , vol. 86, pp. 102-109, Mar. 2015.

Stein, J., Rehm, S., Welzel, U., Huegel, W., and Mittemeijer, E. J., "The Role of Silver in Mitigation of Whisker Formation on Thin Tin Films," Journal of Electronic Materials, vol. 43 no. 11, pp. 4308-4316, Nov. 2014.

Stein, Jendrik, Welzel, Udo, Huegel, Werner, Blatt, Sabine, and Mittemeijer, Eric Jan, "Aging-time-resolved in situ microstructural investigation of tin films electroplated on copper substrates, applying two-dimensional-detector X-ray diffraction," Journal of Applied Crystallography, vol. 46 no. 6, pp. 1645-1653, Dec. 2013.

Steiner, Frantisek, Rendl, Karel, and Wirth, Vaclav, "Correlation analysis of wettability, intermetallic compound formation and PCB contamination," Circuit World, vol. 41 no. 2, pp. 70-75, 2015.

Steiner, Frantisek, Wirth, Vaclav, and Hirman, Martin, "Relationship of Soldering Profile, Voids Formation and Strength of Soldered Joints," 2019 42nd International Spring Seminar on Electronics Technology, Wroclaw, Poland, May 15-19, 2019, pp. xx-xx.

Steiner, Frantisek, and Harant, Petr, "Solderability of the Lead Free Surface Finishes," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 365-369.

Steinhorst, P., Poller, T., and Lutz, J., "Approach of a physically based lifetime model for solder layers in power modules," Microelectronics Reliability, vol. 53 no. 9-11 pp. 1199-1202, Sept.-Nov. 2013.

Steinpress, Martin G., and Ward, Anthony C., "The Scientific Process and Hollywood: The Case of Hexavalent Chromium," Ground Water, vol. 39 no. 3, pp. 321-322, May-June 2001.

Steller, A., Pape, U., and Blair, L., "Solder joint reliability in automotive applications: New assessment criteria through the Use of EBSD," Solid State Phenomena, vol. 160, pp. 307-312, 2010.

Steller, Antje, Pape, Uwe, and Lange, Petrik, "Solder Joint Reliability in Automotive Applications: Analysis Methods and Assessment Criteria," 32nd International Spring Seminar on Electronics Technology, Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.

Steller, Antje, Pape, Uwe, and Dudek, Rainer, "Solder joint reliability in automotive applications: describing damage mechanisms through the use of EBSD," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Stennett, A. D., and Whalley, D. C., "Novel techniques for electronic component removal," Soldering & Surface Mount Technology, vol. 11 no. 2, pp. 7-11, 1999.

Stepanova, A. N., Muratova, V. I., Obolenskaya, L. N., Zhigalina, O. M., Kiselev, N. A., and Givargizov, E. I., "Investigation of the Formation of Nanowires from Silicon Whiskers," Crystallography Reports, vol. 55 no. 3, pp. 500-506, May 2010. DOI: 10.1134/S1063774510030211

Stephen, Su C. S., Arshad, M. K. Md, Nor, M. Nuzaihan Md, Fathil, M. F. M., Ruslinda, A. R., and Hashim, U., "Fabrication and Characterization of Doped Polysilicon Nanowire for pH Sensor," Applied Mechanics and Materials, vol. 754-755, pp. 561-566, Apr. 2015.

Stephens, John, "Halogen Free Laminates on a Global Scale - PCB Fabricator's Readiness to Support OEM's Green Initiatives," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Steplewski, W., and Koziol, G., "Stencil Design for Lead-Free Reflow Process," 30th International Spring Seminar on Electronics Technology, Cluj-Napoca, Romania, May 9-13, 2007, pp. 330-334.

Stepniak, Frank, Kohl, Paul A., and Bidstrup, Sue Ann, "Silver Metallization For Advanced Electronic Interconnections," Proceedings of The International Technical Conference of SUR/FIN, Baltimore, MD, June 26-29, 1995, pp. 151-155.

Sterian, Irene, "Producing through the Downturn," Surface Mount Technology (SMT) , vol. 23 no. 2, pp. 20,22, Mar.-Apr. 2009.

Steukers, Veronique, "Presentation to the IPC RoHS Meeting," IPC Brussels, Brussels, Belgium, June 18, 2008, pp. xx-xx.

Stevels, A. L. N., Ram, A. A. P., and Deckers, E., "Take-back of discarded consumer electronic products from the perspective of the producer: Conditions for success," Journal of Cleaner Production , vol. 7 no. 5, pp. 383-389, Oct. 1999.

Stevels, Ab., and Huisman, Jaco, "An Industry Vision on the Implementation of WEEE and RoHS," Proceedings of EcoDesign2003: Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 8-11, 2003, pp. 9-16.

Stevels, Ab, "Is the WEEE Directive EcoEfficient?," 2003 IEEE International Symposium on Electronics and the Environment, Boston, MA, May 19-22, 2003, pp. 7-12.

Stevels, Ab, "Towards an operationalization of the proposed European Directive on EcoDesign (Design for Environment) of electronic end use products (EuP)," Proceedings of EcoDesign2003: Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 8-11, 2003, pp. 185-191.

Stevens, Craig, "Relay Failures Induced by the Growth of Tin Whiskers: A Case Study," IEEE Boston Reliability Chapter 38th Annual Spring Reliability Symposium , May 16, 2001.

Stevens, Howard P., "A Test Comparison of SAC and Non-SAC Lead-Free Solders," International Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19, 2007, pp. xx-xx.

Stevens, Howard P., "A Test Comparison of SAC and Non-SAC Pb-Free Solders," Circuits Assembly, vol. 18 no. 12, pp. 24-27, Dec. 2007.

Stevens, Howard, and Liyanage, Nimal, "Lead-Free HAL Final Finishes," Printed Circuit Design and Manufacture, vol. 23 no. 11, pp. 36-42, Nov. 2006.

Stevens, Howard, and Liyanage, Nimal, "Pb-Free Hot Air Leveled Solder Coatings," Circuits Assembly, vol. 17 no. 10, pp. 28, Oct. 2006.

Stevens, Howard, and Liyanage, Nimal, "PC Board Assembly with Lead Free Hot Air Leveled Solder Coatings," IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies, Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.

Stevenson, Joel O., Roberts, John L., Davidson, Rick N., Yost, Fred G., and Hosking, F. Michael, "The Effect of Lead Content and Surface Roughness on Wetting and Spreading of Low-lead and No-lead Solders on Copper-clad FR-4 Laminates," Advances in Electronic Packaging 1997, Volume 2, Kohala Coast, Hawaii, June 15-19, 1997, pp. 1335-1345.

Stevenson Sr., Milt, "Which Zinc Do You Use?," Anoplate News, Winter 1998.

Stevenson Sr., Milt, "Which Zinc Do You Use?," Products Finishing, vol. xx no. xx, pp. xx-xx, Mar. 1998.

Stewart, Richard, "Flame Retardants: Improving Fire Safety for Plastics Products," Plastics Engineering, vol. 62 no. 2, pp. 14-22, Feb. 2006.

Stillwell, E. P., Skove, M. J., Overcash, D. R., and Gettys, W. B., "Measurement of the Electron Mean Free Path Using a Bending Effect," Zeitschrift fur Physik B Condensed Matter, vol. 9 no. 1-2, pp. 183-191, Mar. 1969. https://doi.org/10.1007/BF02422551

Stinson-Bagby, Kelly, Huff, Dan, Katsis, Dimos, Van Wyk, Daan, and Lu, G. Q., "Thermal Performance and Microstructure of Lead versus Lead-free Solder Die Attach Interface in Power Device Packages," 2004 IEEE International Symposium on Electronics & the Environment Conference Record, Scottsdale, AZ, May 10-13, 2004, pp. 27-32.

Stobbe, Irina, Liong, Budianto, and Nimmo, Kay, "Lead-free Board Marking as Marking for Environmental Issues."

Stobbe, Irina, Deubzer, Otmar, Griese, Hansjorg, and Reichl, Herbert, "Marking of Electronic Components and Board Assemblies as RoHS Compatible - Information in the Supply Chain and Logistics," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Stobbe, Irina, Potter, Harald, Griese, Hansjorg, Fotheringham, Gerhard, and Reichl, Herbert, "Quality challenges of reused components," Proceedings of 2004 International IEEE Conference on the Asian Green Electronics, Shanghai, China, Apr. 27-30, 2004, pp. 218-225.

Stock, S. R., Dollar, L. L., Freeman, G. B., Ready, W. J., Turbini, L. J., Elliott, J. C., Anderson, P., and Davis, G. R., "Characterization of Conductive Anodic Filament (CAF) by X-Ray Microtomography and by Serial Sectioning," Materials Research Society Symposia Proceedings Volume 323, Boston, MA, Nov. 29-Dec. 3, 1993, pp. 65-69.

Stockham, Norman, "The impact of environmental legislation on electronics and electrical product design and assembly," Connect, 2007.

Stoeckl, Stephan, Yeo, Alfred, Lee, Charles, and Pape, Heinz, "Impact of Fatigue Modeling on 2nd Level Joint Reliability of BGA Packages with SnAgCu Solder Balls," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2, Singapore, Dec. 7-9, 2005, pp. 857-862.

Stone, Harvey, "China RoHS: Beyond the Requirements," emsnow, Jan. 17, 2007.

Stone, Harvey, "If the left one don't get you, the right one will," emsnow, Oct. 29, 2007.

Stone, J., Burrus, C. A., and Campbell, J. C., "Laser action in photopumped GaAs ribbon whiskers," Journal of Applied Physics, vol. 51 no. 6, pp. 3038-3041, June 1980.

Stoney, G. Gerald, "The Tension of Metallic Films Deposited by Electrolysis," Proceedings of the Royal Society of London, series A, vol. A82 no. 553, pp. 172-175, May 6, 1909.

Stong, Jeff, "Manufacturer's Corner: JBC Advanced Series Soldering Irons," empfasis, pp. xx-xx, End of year 2005.

Stong, Jeff, "Manufacturer's Corner: Lead-Free Soldering with Pace TW-50 and NF500," empfasis, pp. 10, July 2005.

Stong, Jeff, "Manufacturer's Corner: Technical Devices - Dual Process Wave Soldering," empfasis, pp. xx-xx, Jan. 2005.

Stong, Jeff, "Manufacturer's Corner: X-Ray Flourescence Analyzers," empfasis , pp. 11, Aug. 2005.

Stoukatch, Sergei, Vaesen, Kristof, Meng, Ho Hong, and Beyne, Eric, "Mixed Assembly on PCB of Wide Variety Components (MCM-D, SMDs, Bare Dies) Using Wire Bonding and SMT," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1671-1674.

Stout, Gail, "Friendly FR4 Green," Surface Mount Technology (SMT), vol. 15 no. 10, pp. 16, Oct. 2001.

Stoyanov, S., Kay, R., Bailey, C., and Desmulliez, M., "Computational modelling for reliable flip-chip packaging at sub-100 um pitch using isotropic conductive adhesives," Microelectronics Reliability , vol. 47 no. 1, pp. 132-141, Jan. 2007.

Stoyanov, S., and Bailey, C., "Modelling the impact of refinishing processes on COTS components for use in aerospace applications," Microelectronics Reliability, vol. 55 no. 9-10, pp. 1271-1279, Aug.-Sept. 2015.

Stoyanov, S., and Bailey, C., "Optimisation modelling for design of advanced interconnects," 1st Electronics Systemintegration Technology Conference, Volume 2, Dresden, Germany, Sept. 5-7, 2006, pp. 1108-1117.

Stoyanov, S., Bailey, C., Saxena, N., and Adams, S., "Optimising the Wave Soldering Process for Lead Free Solders," Proceedings of 2005 International Conference on Asian Green Electronics , Shang Hai, China, Mar. 15-18, 2005, pp. 125-128.

Stoyanov, S., Yannou, J. M., Bailey, C., and Strusevich, N., "Reliability Based Design Optimisation for System-in-Package," Proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems , London, England, Apr. 15-18, 2007, pp. xx-xx.

Stoyanov, S., Gwyer, D., Bailey, C., Saxena, N., and Adams, S., "Wave Soldering Process for Lead Free Solders - A Modelling Study using Computational Fluid Dynamics," 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, Vienna, Austria, May 19-20, 2005, pp. 476-479.

Stoyanov, Stoyan, Bailey, Chris, Strusevich, Nadia, and Yannou, Jean-Marc, "Computational Approach for Reliable and Robust System-in-Package Design," 30th International Spring Seminar on Electronics Technology, Cluj-Napoca, Romania, May 9-13, 2007, pp. 40-45.

Stoyanov, Stoyan, Dabek, Alexander, and Bailey, Chris, "Hot Nitrogen Deballing of Ball Grid Arrays," Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, Dresden, Germany, May 7-11, 2014, pp. 44-49.

Stoyanov, Stoyan, Best, Chris, Alam, M. O., Bailey, Chris, Tollafield, Pete, Parker, Mike, and Scott, Jim, "Modelling and Testing the Impact of Hot Solder Dip Process on Leaded Components," 2012 35th International Spring Seminar on Electronics Technology, Bad Aussee, Austria, May 9-13, 2012, pp. 303-308.

Stoyanov, Stoyan, Bailey, Chris, Alam, M. O., Yin, Chunyan, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike, and Scott, Jim, "Modelling methodology for thermal analysis of hot solder dip process," Microelectronics Reliability, vol. 53 no. 8, pp. 1055-1067, Aug. 2013.

Stoyanov, Stoyan, Bailey, Chris, and Desmulliez, Marc, "Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packaging," Soldering & Surface Mount Technology, vol. 21 no. 1, pp. 11-24, 2009.

Stoyanov, Stoyan, Bailey, Chris, Stewart, Paul, and Morrison, Graeme, "Reliability Impact of Assembly Materials for Micro-BGA Components in High Reliability Applications," 2020 IEEE 8th Electronics System-Integration Technology Conference, Tonsberg, Norway, Sept. 15-18, 2020, pp. xx-xx.

Stoyanov, Stoyan, Bailey, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim, and Roulston, John, "Thermal Modelling and Optimisation of Hot Solder Dip Process," 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Lisbon, Portugal, Apr. 16-18, 2012, pp. xx-xx.

Stoyanov, Stoyan, Dabek, Alexander, and Bailey, Chris, "Thermo-mechanical Impact of Laser-induced Solder Ball Attach Process on Ball Grid Arrays," 2014 Electronics System-Integration Technology Conference , Helsinki, Finland, Sept. 16-18, 2014, pp. xx-xx.

Stoyanov, Stoyan, Stewart, Paul, and Bailey, Chris, "Vulnerability Study of Hot Solder Dipped COTS Components," 2016 39th International Spring Seminar on Electronics Technology, Pilsen, Czech Republic, May 18-22, 2016, pp. 193-198.

Strandjord, Andrew J. G., Popelar, Scott F., and Erickson, Curt A., "Electroless Nickel/Gold Plating On Copper Based Semiconductors," Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 196-201.

Stranz, A., Kahler, J., Merzsch, S., Waag, A., and Peiner, E., "Nanowire silicon as a material for thermoelectric energy conversion," Microsystem Technologies, vol. 18 no 7-8, pp. 857-862, Aug. 2012.

Stranz, Andrej, Waag, Andreas, and Peiner, Erwin, "High-Temperature Performance of Stacked Silicon Nanowires for Thermoelectric Power Generation," Journal of Electronic Materials, vol. 42 no. 7, pp. 2233-2238, July 2013.

Stranz, Andrej, Waag, Andreas, and Peiner, Erwin, "Thermal characterization of vertical silicon nanowires," Journal of Materials Research, vol. 26 no. 15, pp. 1958-1962, Aug. 14, 2011.

Stratton, Paul, "Nitrogen Advantages for Lead-free Soldering," SMART Group 8th Annual Lead-Free Seminar + 'Question Time' & Table-Top Exhibition, High Wycombe, United Kingdom, Feb. 16, 2006.

Stratton, Paul, "Nitrogen's Effect on Pb-free soldering," Circuits Assembly, vol. 16 no. 2, pp. 50-51, Feb. 2005.

Straubinger, Daniel, Geczy, Attila, Sipos, Andras, Kiss, Andras, Gyarmati, Daniel, Krammer, Oliver, Rigler, Daniel, Busek, David, and Harsanyi, Gabor, "Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs," Circuit World, vol. 45 no. 1, pp. 37-44, 2019.

Straubinger, Daniel, Rigler, Daniel, Geczy, Attila, and Synkiewicz-Musialska, Beata, "Electromigration in lead-free solder joints on ceramic PCB substrates," 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging, virtual conference, Oct. 19-24, 2020, pp. 52-56.

Strauss, R., and Smernos, S., "Low Temperature Soldering," Circuit World, vol. 10 no. 3, pp. 23-25, 1984.

Streeter, Donald E., "Rapidly delivering war-winning capability," CTMA Symposium: Lead-Free Solder, Apr. 2, 2003.

Streicher-Porte, Martin, "SWICO/S.EN.S, the Swiss WEEE recycling systems and best practices from other European systems," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 281-287.

Streicher-Porte, Martin, and Yang, Jianxin, "WEEE recycling in China. Present situation and main obstacles for improvement," Proceedings of the 2007 IEEE International Symposium on Electronics & the Environment, Orlando, FL, May 7-10, 2007, pp. 40-45.

Strixner, Stefan, "Can lead-free and lead-containing PCBs be cleaned in a single process?," Global SMT and Packaging, vol. 8 no. 11, pp. 28-31, Nov. 2008.

Stromswold, E. I., Pratt, R. E., and Quesnel, D. J., "Capillary soldering system for the material property characterization of solder joints," Review of Scientific Instruments, vol. 64 no. 11, pp. 3314-3320, Nov. 1993.

Stropki, John T., and Graham, Glen H., "Evaluation of Zinc Alloys As An Alternative to Cadmium," 31st Aerospace/Airline Plating & Metal Finishing Forum, 1995, pp. 13-24.

Stroscio, Joseph A., and Pierce, D. T., "Growth of iron on iron whiskers," Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol. 12 no. 3, pp. 1783-1788, May 1994.

Stuhlpfarrer, Philipp, Luidold, Stefan, and Antrekowitsch, Helmut, "Recycling of waste printed circuit boards with simultaneous enrichment of special metals by using alkaline melts: A green and strategically advantageous solution," Journal of Hazardous Materials, vol. 307, pp. 17-25, Apr. 15, 2016.

Strukova, G. K., Strukov, G. V., Egorov, S. V., Mazilkin, A. A., Khodos, I. I., and Vitkalov, S. A., "3D-mesostructures obtained by self-organization of metallic nanowires," Materials Letters, vol. 128, pp. 212-215, Aug. 1, 2014.

Stuart, Julie Ann, Low, Ming Kaan, Williams, David J., and Turbini, Laura J., "Challenges in Determining Electronics Equipment Take-Back Levels," IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part C, vol. 21 no. 3, pp. 225-232, July 1998.

Stuart, Julie Ann, Turbini, Laura J., and Ammons, Jane C., "Towards Quantifying the Effect of Lead Legislation on Electronic Product and Process Design," IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 5-7, 1997, pp. 84-87.

Studnitzky, Thomas, and Schmid-Fetzer, Rainer, "Phase formation and reaction kinetics in M-Sn systems (M = Zr, Hf, Nb, Ta, Mo)," Zeitschrift fur Metallkunde, vol. 93 no. 9, pp. 894-903, Sept. 2002.

Stuna, Jakub, Steiner, Frantisek, and Hirman, Martin, "Properties of temperature stable solder pastes," 2016 6th Electronic System-Integration Technology Conference, Grenoble, France, Sept. 13-15, 2016, pp. xx-xx.

Stundza, Tom, "Tin has skyrocketed in price," Purchasing, vol. xx no. xx, pp. xx-xx, Jan. 10, 2007.

Stundza, Tom, "U.S. copper and brass mills worry about REACH implications," Purchasing, vol. xx no. 7, pp. xx-xx, July 17, 2008.

Stupian, G. W., "Tin Whiskers in Electronic Circuits," Aerospace Report No. TR-92 (2925-7), Dec. 20, 1992.

Stupnisek-Lisac, E., Lisica, M., and Reichenbach, D., "Copper Corrosion Inhibition In Printed Circuit Board Production," Plating & Surface Finishing, vol. 88 no. 1, pp. 90-92, Jan. 2001.

Stuttle, C. J., Ashworth, M. A., Wilcox, G. D., and Mortimer, R. J., "Characterisation of tin-copper intermetallic growth in electrodeposited tin coatings using electrochemical oxidation techniques," Transactions of the IMF, vol. 92 no. 5, pp. 272-281, 2014. https://doi.org/10.1179/0020296714Z.000000000174

Stutz, Markus, Thomas, Valerie M., and Saar, Steven, "Linking Bar Codes to Recycling Information for Mobile Phones," 2004 IEEE International Symposium on Electronics & the Environment Conference Record, Scottsdale, AZ, May 10-13, 2004, pp. 313-316.

Styrkas, A. D., "Growth of Gray Tin Crystals," Inorganic Materials, vol. 39 no. 7, pp. 683-386, July 2003.

Styrkas, A. D., ""Life, Memory, Recognition and Aging" of Grey Tin," Journal of Materials Science and Chemical Engineering, vol. 4 no. 11, pp. 1-11, Nov. 2016.

Styrkas, A. D., "Preparation of Shaped Gray Tin Crystals," Inorganic Materials, vol. 41 no. 6, pp. 580-584, June 2005.

Su, Bin, and Qu, Jianmin, "A Micromechanics Model for Electrical Conduction in Isotropically Conductive Adhesives during Curing," 2004 9th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 24-26, 2004, pp. 145-151.

Su, Bin, and Qu, Jianmin, "A Micromechanics Model for Electrical Conduction in Isotropically Conductive Adhesives during Curing," 54th Electronic Components & Technology Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1766-1771.

Su, Bin, and Qu, Jianmin, "Effect of Filler Geometry on the Conduction of Isotropically Conductive Adhesives," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part C, San Francisco, CA, July 17-22, 2005, pp. 1889-1901.

Su, Bin, and Qu, Jianmin, "Electrical and Thermomechanical Modeling of Electrically Conductive Adhesives," 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 69.

Su, Bin, and Qu, Jianmin, "Electrical Contact Resistance of Silver with Different Coatings," 2005 IEEE/CPMT 10th International Symposium on Advanced Packaging Materials, Irvine, CA, Mar. 16-18, 2005, pp. 75-78.

Su, Bin, and Qu, Jianmin, "Fatigue Behavior of Electrically Conductive Adhesives," Journal of Adhesion Science and Technology, vol. 22 no. 8-9, pp. 927-946, 2008.

Su, Chien-Hao, Chen, Hao, Lee, Hsin-Yi, and Wu, Albert T., "Controlled positions and kinetic analysis of spontaneous tin whisker growth," Applied Physics Letters, vol. 99, pp. 131906-1-131906-3, 2011.

Su, Chien-Hao, Chen, Hao, Lee, Hsin-Yi, Liu, Cheng Yi, Ku, Ching-Shun, and Wu, Albert T., "Kinetic Analysis of Spontaneous Whisker Growth on Pre-treated Surfaces with Weak Oxide," Journal of Electronic Materials, vol. 43 no. 9, pp. 3290-3295, Sept. 2014.

Su, Dezhi, Guan, Peijie, Zhao, Dan, Niu, Yucheng, Wang, Quanwen, Wang, Shangzhi, Yang, Huihui, and Wang, Cen, "Development of flip chip solders joint defects under temperature cycling testing," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Su, Dezhi, Guan, Peijie, Zhao, Dan, Luan, Qinghua, Wang, Cen, and Niu, Yucheng, "Welding reactions of lead free solder alloy for aluminum packaging electronic devices," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Su, Fei, Mao, Ronghai, Wang, Xiaoyan, Wang, Guangzhou, and Pan, Haiyan, "Creep behaviour of Sn-3.8Ag-0.7Cu under the effect of electromigration: Experiments and modelling," Microelectronics Reliability, vol. 51 no. 5, pp. 1020-1024, May 2011.

Su, Fei, and Pan, Haiyan, "Creep Characterization of Lead Free 80Au-20Sn Solder," International Conference on Electronic Packaging Technology & High Density Packaging , Beijing, China, Aug. 10-13, 2009, pp. 718-721.

Su, Fei, Pan, Xiaoxu, Zhang, Zheng, and Liu, Qingyi, "Simulation of Electromigration induced stress of solder," 2016 IEEE 37th International Electronics Manufacturing Technology & 18th Electronics Materials and Packaging Conference, Penang, Malaysia, Sept. 20-22, 2016, pp. xx-xx.

Su, Fei, Zhang, Zheng, Wang, Yuan, and Li, Weijia, "Study of Electromigration-Induced Stress of Solder," Journal of Electronic Packaging, vol. 137 no. 2, pp. 021006-1-021006-6, June 2015.

Su, Guobiao, Han, Yongjiu, Wang, Chunyan, Wang, Hongbin, and Wei, Xicheng, "Effect of 0.05% Cr on Intermetallic Compound Layer Growth for Sn-Ag-Cu Lead-free Solder Joint during Isothermal Aging," 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 6-10, 2009, pp. 393-396.

Su, Peng, Li, Li, Lai, Yi-Shao, Chiu, Ying-Ta, and Kao, Chin-Li, "A Comparison Study of Electromigration Performance of Pb-free Flip Chip Solder Bumps," 59th Electronic Components & Technology Conference , San Diego, CA, May 26-29, 2009, pp. 903-908.

Su, Peng, Howell, Jim, and Chopin, Sheila, "A Statistical Study of Sn Whisker Population and Growth During Elevated Temperature and Humidity Tests," IEEE Transactions on Electronics Packaging Manufacturing, vol. 29 no. 4, pp. 246-251, Oct. 2006.

Su, Peng, Ding, Min, Uehling, Trent, Wontor, David, and Ho, Paul S., "An Evaluation of Electromigration Performance of SnPb and Pb-free Flip Chip Solder Joints," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 1431-1436.

Su, Peng, and Subbarayan, Guhan, "Effects of Component Warpage on Board Assembly Defects and Effective Mitigation Measures," SMTA International 2010 Conference Proceedings , Orlando, FL, Oct. 24-28, 2010, pp. 686-691.

Su, Peng, Ding, Min, and Chopin, Sheila, "Effects of Reflow on the Microstructure and Whisker Growth Propensity of Sn Finish," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 434-440.

Su, Peng, Lee, C. J., Li, Li, Xue, Jie, Khan, Boaz, Moazeni, Reza, and Hartranft, Marc, "Practical Assessment of Tin Whisker Growth Risk due to Environmental Temperature Variations," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 736-741.

Su, Peng, Bai, Song, Ding, Min, and Chopin, Sheila, "The Effects of Plating Parameters on the Microstructure and Whisker Growth Propensity of Pure Sn Finish," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 571-578.

Su, Qing, Li, Lijuan, Li, Shanying, and Zhao, Haipeng, "Field-emission property of ZnSe nanoarrays," IET Micro & Nano Letters , vol. 7 no. 10, pp. 1053-1055, Oct. 2012.

Su, Qing, Zhang, Yanghua, Li, Shanying, Du, Lingzhi, Zhao, Haipeng, Liu, Xiangyun, and Li, Xiaoyan, "Synthesis of p-type phosphorus doped ZnSe nanowires and their applications in nanodevices," Materials Letters, vol. 139, pp. 487-490, Jan. 15, 2015.

Su, S. H., Zhao, K., Ma, S. W., and Zhang, J. H., "Simulation Study of bump metallization on the stress and strain distributions of ACF interconnections for flip-chip-on-flex (COF) applications," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Su, Shun, Yin, Liang, Sun, Ying, Murray, Bruce T., and Singler, Timothy J., "Modeling dissolution and spreading of Bi-Sn alloy drops on a Bi substrate," Acta Materialia, vol. 57 no. 10, pp. 3110-3122, June 2009.

Su, Sinan, Akkara, Francy John, Thaper, Ravinder, Alkhazali, Atif, Hamasha, Mohammad, and Hamasha, Sa'd, "A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint," Journal of Electronic Packaging, vol. 141 no. 4, pp. 040802-1-040802-13, Dec. 2019.

Su, Sinan, Fu, Nianjun, Akkara, Francy John, and Hamasha, Sa'd, "Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint," Journal of Electronic Packaging, vol. 140 no. 3, pp. 031005-1-031005-9, Sept. 2018.

Su, Sinan, Jian, Minghong, Wei, Xin, Akkara, Francy John, Hamasha, Sa'd, Suhling, Jeff, and Lall, Pradeep, "Effect of Surface Finish on the Fatigue Behavior of Bi-based Solder Joints," 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 28-31, 2019, pp. 1155-1159.

Su, Sinan, Hamasha, Sa'd, and Hamasha, Khozima, "Effect of Surface Finish on the Shear Properties of SnAgCu-Based Solder Alloys," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 9 no. 8, pp. 1473-1485, Aug. 2019.

Su, Sinan, Jian, Minghong, and Hamasha, Sa'd, "Effects of Surface Finish on the Shear Fatigue of SAC-Based Solder Alloys," IEEE Transactions on Components, Packaging, and Manufacturing Technology , vol. 10 no. 3, pp. 457-466, Mar. 2020.

Su, Sinan, Jian, Minghong, Akkara, Francy John, Hamasha, Sa'd, Suhling, Jeff, and Lall, Pradeep, "Fatigue and Shear Properties of High Reliable Solder Joints for Harsh Applications," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Su, Sinan, Akkara, Francy John, Abueed, Mohammed, Jian, Minghong, Hamasha, Sa'd, Suhling, Jeff, and Lall, Pradeep, "Fatigue Properties of Lead-free Doped Solder Joints," 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29-June 1, 2018, pp. 1243-1248.

Su, Sinan, Hoque, Mohd Aminul, Chowdhury, Md Mahmudur, Hamasha, Sa'd, Suhling, Jeffrey C., Evans, John L., and Lall, Pradeep, "Mechanical Properties and Microstructural Fatigue Damage Evolution in Cyclically Loaded Lead-Free Solder Joints," 2019 IEEE 69th Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2019, pp. 792-799.

Su, Sinan, Akkara, Francy, Sanders, Thomas, Zhang, Jiawei, Evans, John, and Harris, Gregory, "Reexamination of Thermal Cycling Reliability of BGA Components with SnAgCu and SnPb Solder Joints on Different Board Designs," Pan Pacific Symposium 2020, Honolulu, HI, Feb. 10-13, 2020, pp. xx-xx.

Su, Sinan, Akkara, Francy John, Raj, Anto, Zhao, Cong, Gordon, Seth, Sridhar, Sharath, Thirugnanasambandam, Sivasubramanian, Hamasha, Sa'd, Suhling, Jeffery, and Evans, John, "Reliability of Micro-Alloyed SnAgCu Based Solder Interconnections for Various Harsh Applications," 2019 IEEE 69th Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2019, pp. 2309-2317.

Su, T. L., Tsao, L. C., Chang, S. Y., and Chuang, T. H., "Interfacial Reactions of Liquid Sn and Sn-3.5Ag Solders With Ag Thick Films," Journal of Materials Engineering and Performance, vol. 11 no. 5, pp. 481-486, Oct. 2002.

Su, T. L., Tsao, L. C., Chang, S. Y., and Chuang, T. H., "Morphology and Growth Kinetics of Ag3Sn During Soldering Reaction Between Liquid Sn and an Ag Substrate," Journal of Materials Engineering and Performance, vol. 11 no. 4, pp. 365-368, Aug. 2002.

Su, Xiran, Luo, Haiping, and Yang, D. G., "Investigation of Thermal-Mechanical and Moisture Driven Delamination in Lead-free QFN Packages during SMT Reflow Soldering Process," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Su, Y. A., Tan, L. B., Tee, T. Y., and Tan, V. B. C., "Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP," Microelectronics Reliability, vol. 50 no. 4, pp. 564-576, Apr. 2010.

Su, Yong'An, Tan, Long Bin, Tan, Vincent B. C., and Tee, Tong Yan, "Rate-Dependent Properties of Sn-Ag-Cu Based Lead Free Solder Joints," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 283-291.

Su, Yu-Ping, Wu, Chun-Sen, and Ouyang, Fan-Yi, "Asymmetrical Precipitation of Ag3Sn Intermetallic Compounds Induced by Thermomigration of Ag in Pb-Free Microbumps During Solid-State Aging," Journal of Electronic Materials, vol. 45 no. 1, pp. 30-37, Jan. 2016.

Suarez, Manuel, "RoHS clarification: Put on the market and intra-group transactions," Green SupplyLine, June 18, 2006.

Subasic, Nihad, "Thermodynamic Evaluation of Sn-Zr Phase Diagram," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 22 no. 2, pp. 157-165, June. 1998.

Subbaiah, Yogesha, Kaje, Venkatakrishna, and Hegde, Ampar Chitharanjan, "Development of anti-corrosive multi-layered coatings of zinc-nickel alloy," Anti-Corrosion Methods and Materials, vol. 58 no. 2, pp. 84-89, 2011.

Subbarayan, G., Kinyanjui, R., Deutsch, J., and Baker, M., "An Experimental Study of a Components Termination Finish Conversion Process: The Robotic Stripping and Solder Termination Process," SMTAnews & Journal of Surface Mount Technology, vol. 20 no. 4, pp. 11-20, Oct.-Dec. 2007.

Subbarayan, Guhan, Priore, Scott, and Sethuraman, Sundar, "A Novel Approach to Experimentally Create and Mitigate Head-in-Pillow Defects," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S30_02-1-S30_02-9.

Subbarayan, Guhan, Priore, Scott, and Sethuraman, Sundar, "A Novel Test Methodology to Evaluate Solder Pastes for Mitigating Head-in-Pillow Defects," SMTA Journal, vol. 23 no. 3, pp. 17-23, 2010.

Subbarayan, Guhan, Kinyanjui, Robert, and Deutsch, Joel, "An Experimental Study of a Components Termination Finish Conversion Process: The Robotic Stripping and Solder Dipping Process," Successful Lead-Free/RoHS Strategies Conference 2007, Boxborough, MA, June 21, 2007, pp. xx-xx.

Subbarayan, Guhan, Tsai, Pei-Fang Jennifer, Srihari, Krishnaswami, Kinyanjui, Robert, and Damodaran, Purushothaman, "Effect of Lead-Free PCB Surface Finishes on the Formation of Microvoids and Kirkendall Voids," Proceedings of the 2007 Industrial Engineering Research Conference, Nashville, TN, May 19-23, 2007, pp. 1208-1213.

Subbarayan, Guhan, Damodaran, Purushothaman, Srihari, Krishnaswami, Kinyanjui, Robert, and Korf, Dana, "Impact of Lead-Free PCB Surface Finishes on Microvoiding," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 617-624.

Subbarayan, Guhan, Kinyanjul, Robert, Tsai, Pei Fang Jenneifer, and Srihari, Krishnaswami, "Mechanical Reliability Evaluation of Stripped and Replated Component Termination Finishes," Proceedings of the ASME InterPack Conference, Volume 1, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 43-49.

Subedi, Biswas, Niraula, Dipesh, and Karpov, Victor G., "The stochastic growth of metal whiskers (paper)," Tin Whisker Group teleconference, June 7, 2017.

Subedi, Biwas, Niraula, Dipesh, and Karpov, Victor G., "The stochastic growth of metal whiskers," Applied Physics Letters , vol. 110 no. 25, pp. 251604-1-251604-5, June 19, 2017.

Subramanian, J. S., Rodgers, P., Newson, J., Rude, T., He, Z., Besnoin, E., Weihs, T. P., Eveloy, V., and Pecht, M., "Room Temperature Soldering of Microelectronic Components for Enhanced Thermal Performance," Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, Apr. 18-20, 2005, pp. 681-686.

Subramanian, K. N., "A Parametric Approach for Assessment of Thermomechanical Fatigue Performance of Sn-Based Solder Joints," Journal of Electronic Materials, vol. 34 no. 10, pp. 1313-1317, Oct. 2005.

Subramanian, K. N., "Assessment of Factors Influencing Thermomechanical Fatigue Behavior of Sn-Based Solder Joints under Severe Service Environments," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 237-246, Mar. 2007.

Subramanian, K. N., and Lee, J. G., "Effect of anisotropy of tin on thermomechanical behavior of solder joints," Journal of Materials Science: Materials in Electronics, vol. 15 no. 4, pp. 235-240, Apr. 2004.

Subramanian, K. N., and Lee, J. G., "Effects of internal stresses on the thermomechanical behavior of Sn-based solder joints," Materials Science and Engineering A, vol. 421 no. 1-2, pp. 46-56, Apr. 15, 2006. https://doi.org/10.1016/j.msea.2005.10.005

Subramanian, K. N., Lee, A., Choi, S., and Sonje, P., "Material Issues in Electronic Interconnects and Packaging," Journal of Electronic Materials, vol. 30 no. 4, pp. 372-378, Apr. 2001.

Subramanian, K. N., Bieler, T. R., and Lucas, J. P., "Microstructural Engineering of Solders," Journal of Electronic Materials, vol. 28 no. 11, pp. 1176-1183, Nov. 1999.

Subramanian, K. N., and Lee, J. G., "Physical Metallurgy in Lead-Free Electronic Solder Development," JOM , vol. 55 no. 5, pp. 26-32, May 2003.

Subramanian, K. N., "Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn-based solder joints under thermal excursions," Fatigue and Fracture of Engineering Materials and Structures, vol. 30 no. 5, pp. 420-431, May 2007.

Subramanian, K. N., and Lee, A., "Thermomechanical Fatigue and Fracture of Sn-based Solders," 2006 Lead-Free Technology Workshop, San Antonio, TX, Mar. 12, 2006, pp. xx-xx.

Subramanian, Sankara J., and Penmetcha, Vijay K. R., "Strain Evolution during Lap Shear Testing of SnCu Solder," Applied Mechanics and Materials, vol. 70, pp. 303-308, 2011.

Subramaniam, Suthakaran, Snugovsky, Polina, Kennedy, Jeffrey, Kosiba, Eva, Bagheri, Zohreh, and Romansky, Marianne, "Vibration Testing of Lead-Free Alloys for High Reliability," International Conference on Soldering & Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.

Subramaniam, Suthakaran, Snugovsky, Polina, Kennedy, Jeffrey, Kosiba, Eva, Bagheri, Zohreh, and Romansky, Marianne, "Vibration Testing of Lead-Free Alloys for High Reliability," SMTAnews & Journal of Surface Mount Technology, vol. 27 no. 4, pp. 31-47, Oct.-Dec. 2014.

Succo, L., Esposito, J., Cleeves, Monty, Whitney, S., Lionetti, R. E., and Wickersham Jr., C. E., "Influence of target microstructure on the propensity for whisker growth in sputter-deposited aluminum alloy films," Journal of Vacuum Science & Technology A, Second Series, vol. 7 no. 3, part 1, pp. 814-816, May/June 1989.

Suenaga, Makoto, Nakamori, Takashi, Hirakawa, Daisuka, Ohno, Yasuhida, Hagihara, Taizo, Kagami, Johji, and Takeuchi, Tatsuya, "Development of Flux-Free Reflow Soldering Process Using Hydrogen Radicals," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 1, Orlando, FL, May 31-June 3, 2005, pp. 710-715.

Sueoka, Kuniaki, Kohara, Sayuri, Horibe, Akihiro, Yamada, Fumiaki, Mori, Hiroyuki, and Orii, Yasumitsu, "Fine-pitch Solder Joining for High Density Interconnection," 2014 International Conference on Electronics Packaging, Toyoma, Japan, Apr. 23-25, 2014, pp. 600-603.

Suetsugu, Kenichiro, "Development and Application of Lead-Free Solder Bonding Technology," Matsushita Electric Industrial, Dec. 20, 2000.

Suetsugu, Kenichiro, "Development and Worldwide Expansion of Lead-free Soldering Technology at Matsushita Electric Industrial," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Suetsugu, Kenichiro, Furusawa, Akio, Tanaka, Masato, Takano, Hiroaki, Takehara, Hideki, Horiuchi, Toshihiro, and Matsushige, Kazumi, "Liquidus Temperature Design of Lead-Free Solder," Materials Transactions, vol. 47 no. 4, pp. 1082-1089, 2006.

Suetsugu, Kenichiro, Yamaguchi, Atsushi, Matsushige, Kazumi, and Horiuchi, Toshihisa, "Non-Equilibrium Thermodynamic Theory of 4-Component Lead-Free Solder," Materials Transactions, vol. 50 no. 2, pp. 236-244, Feb. 2009.

Sueyoshi, Hidekazu, Odo, Harunori, Mizokuchi, Shinji, Abe, Shigeru, and Saikusa, Kazuya, "Consumption of Soldering Iron by Pb-Free Solder," Materials Transactions, vol. 47 no. 4, pp. 1221-1226, 2006.

Suga, Tadatomo, and Saito, Keisuke., "A New Bumping Process Using Lead-Free Solder Paste," IEEE Transactions on Electronics Packaging Manufacturing, vol. 25 no. 4, pp. 253-256, Oct. 2002.

Suga, Tadatomo, Ozaki, Hiroshi, and Ozawa, Hayato, "Behavior of Surface Oxide and Intermetallic Compounds in Interconnections of Micro Sn-Ag Solder Bumps" Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1141-1146.

Suga, Tadatomo, and Takeuchi, Makoto, "JIEP Project for Low-temperature Lead-free Solders and its Report on Questionnaire Survey," Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 11-15, 2001, pp. 1050-1054.

Suganuma, Hiro, and Tamanaha, Alvin, "Next-generation reflow technology," Surface Mount Technology (SMT) , vol. 15 no. 2, pp. 65-66+68+70, Feb. 2001.

Suganuma, K., and Yamashita, M., "High Temperature Degradation Mechanism of Conductive Adhesive/Sn Alloy Interface," 2001 International Symposium on Advanced Packaging Materials , Braselton, GA, Mar. 11-14, 2001, pp. 19-22.

Suganuma, K., Kim, K. S., Kim, S. S., Kim, D. S., Kang, M., and Kim, S. J., "Joining Characteristics of Various High Temperature Lead-free Interconnection Materials," 59th Electronic Components & Technology Conference , San Diego, CA, May 26-29, 2009, pp. 1764-1768.

Suganuma, K., Sakamoto, S., Kagami, N., Wakuda, D., Kim, K.-S., and Nogi, M., "Low-temperature low-pressure die attach with hybrid silver particle paste," Microelectronics Reliability, vol. xx no. xx, pp. xx-xx, xxxx.

Suganuma, K., Yamamoto, K., Sasaki, K., Homma, H., Matsuoka, H., Takeuchi, M., Kusakabe, K., Toyofuku, K., Takahashi, K., Nishiyama, Y., Karira, Y., Yu, Q., and Higuchi, K., "Low Temperature Soldering Project of JEITA," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Suganuma, K., Kim, K. S., and Huh, S. H., "Selection of Sn-Ag-Cu Lead-Free Alloys," Proceedings 2001 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4587), Baltimore, MD, Oct. 9-11, 2001, pp. 529-534.

Suganuma, Katsuaki, "Advances in lead-free electronics soldering," Current Opinion in Solid State and Materials Science, vol. 5 no. 1, pp. 55-64, Jan. 2001.

Suganuma, Katsuaki, "Conductive Adhesives: Alternative to High Temperature Solders and The Future," 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Odaiba, Japan, Jan. 16-18, 2007, pp. 30-35.

Suganuma, Katsuaki, Huh, Seok-Hwang, Kim, Keunsoo, Nakase, Hirofumi, and Nakamura, Yoshikazu, "Effect of Ag Content on Properties of Sn-Ag Binary Alloy Solder," Materials Transactions, vol. 42 no. 2, pp. 286-291, Feb. 2001.

Suganuma, Katsuaki, Kim, Seong-Jun, and Kim, Keun-Soo, "High-Temperature Lead-Free Solders: Properties and Possibilities," JOM , vol. 61 no. 1, pp. 64-71, Jan. 2009.

Suganuma, Katsuaki, "Interface Phenomena in Lead-Free Soldering," Proceedings of the First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Feb. 1-3, 1999, pp. 620-625.

Suganuma, Katsuaki, "Lead-Free Soldering in Japan," IPC Works '99, Minneapolis, MN, Oct. 23-28, 1999, pp. xx-xx.

Suganuma, Katsuaki, "Mechanism and Prevention of Lift-Off in Lead-Free Soldering," Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 303-307.

Suganuma, Katsuaki, and Nakamura, Yoshikazu, "Microstructure and Strength of Interface between Sn-Ag Eutectic Solder and Cu," Journal of the Japan Institute of Metals, vol. 59 no. 12, pp. 1299-1305, 1995.

Suganuma, Katsuaki, "Research Trends of Tin Whiskers and Current under Standing of the Mechanism," Journal of the Surface Finishing Society of Japan, vol. 59 no. 4, pp. 210-217, 2008.

Suganuma, Katsuaki, Baated, Alongheng, Kim, Keun-Soo, Hamasaki, Kyoko, Nemoto, Norio, Nakagawa, Tsuyoshi, and Yamada, Toshiyuki, "Sn whisker growth during thermal cycling," Acta Materialia, vol. 59 no. 19, pp. 7255-7267, Nov. 2011.

Suganuma, Katsuaki, and Kim, Kuen-Soo, "Sn-Zn low temperature solder," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 121-127, Mar. 2007.

Suganuma, Katsuaki, and Kim, Keun-Soo, "Solidification Microstructure Control of Sn-Ag-Cu Lead-Free Solder," Journal of High Temperature Society of Japan, vol. 30 no. 4, pp. 185-190, July 2004.

Suganuma, Katsuaki, "The current status of lead-free soldering," ESPEC Technology Report, no. 13, pp. 1-8, Mar. 2002.

Suganuma, Katsuaki, and Kim, Kuen-Soo, "The Root Causes of the "Black pad" Phenomenon and Avoidance Tactics," JOM, vol. 60 no. 6, pp. 61-65, June 2008.

Suganuma, Katsuaki, Sakai, T., Kim, Keun-Soo,, Takagi, Yoshinori, Sugimoto, Jun, and Ueshima, Minoru, "Thermal and Mechanical Stability of Soldering QFP With Sn-Bi-Ag Lead-Free Alloy," IEEE Transactions on Electronics Packaging Manufacturing, vol. 25 no. 4, pp. 257-261, Oct. 2002.

Suganuma, Katsuaki, Niihara, Koichi, Shoutoku, Takeshi, and Nakamura, Yoshikazu, "Wetting and interface microstructure between Sn-Zn binary alloys and Cu," Journal of Materials Research, vol. 13 no. 10, pp. 2859-2865, Oct. 1998.

Suganuma, Katsuaki, "World environmental legislations on electronics and vehicles," Journal of Japan Institute of Light Metals, vol. 57 no. 5, pp. 210-217, May 2007.

Sugawara, Hiroyoshi, "Ecofriendly Surface Treatment for Automobile Parts," Journal of the Surface Finishing Society of Japan, vol. 57 no. 12, pp. 831-836, 2006.

Sugden, Mark W., Hutt, David A., Whalley, David C., and Liu, Changqing, "A novel flip-chip interconnection process for integrated circuits," Circuit World, vol. 38 no. 4, pp. 214-218, 2012.

Sugiarto, H, Christie, I. R., and Richards, B. P., "Studies of Zinc Whiskers Formation and Growth from Bright Zinc Electrodeposits," The Institute of Metal Finishing Annual Technical Conference and Exhibition, Volume 1, Eastbourne, UK, May 1-5, 1984, pp. 189-202.

Sugiarto, H., Christie, I. R., and Richards, B. P., "Studies of zinc whiskers formation and growth from bright zinc electrodeposits," Transactions of the Institute of Metal Finishing , vol. 62 no. 3, pp. 92-97, Autumn 1984. https://doi.org/10.1080/00202967.1984.11870680

Sugiyama, Masaharu, Igarashi, Takanori, Fukumoto, Masahiro, Kimura, Hisamichi, and Inoue, Akihisa, "Formation of Fe-based Metallic Glass Coating Films Produced by High Velocity Oxy-fuel Spraying Process and their Applications," Journal of the Japan Society of Powder and Powder Metallurgy , vol. 54 no. 11, pp. 784-789, Nov. 2007.

Sugizaki, Takashi, Nakao, Hidehiro, Kimura, Takashi, and Watanabe, Tohru, "BGA Jointing Property of Sn-8.8 mass %Zn and Sn-8.0 mass %Zn-3.0 mass%Bi Solder on Electroless Nickel-Phosphorus/Immersion Gold Plated Substrates," Journal of Japan Institute of Metals, vol. 67 no. 5, pp. 232-238, May 2003.

Sugizaki, Takashi, Nakao, Hidehiro, Kimura, Takashi, and Watanabe, Tohru, "BGA Jointing Property of Sn-8.8 mass%Zn and Sn-8.0 mass%Zn-3.0 mass%Bi Solder on Electroless Nickel-Phosphorus/Immersion Gold Plated Substrates," Materials Transactions, vol. 44 no. 9, pp. 1790-1796, Sept. 2003.

Sugizaki, Takashi, Nakao, Hidehiro, and Watanabe, Tohru, "Jointing Structures of Some Kinds of Lead-Free Solder on EN/IG Finished Boards," Materials Science Forum, vol. 426-432 part 5, pp. 4117-4122, 2003.

Sugovsky, P., Arrowsmith, P., and Romansky, M., "Electroless Ni/Immersion Au Interconnects: Investigation of Black Pad in Wire Bonds and Solder Joints," Journal of Electronic Materials, vol. 30 no. 9, pp. 1262-1270, Sept. 2001.

Suh, Daewoong, Hwang, Chi-won, Ueshima, Minoru, and Sugimoto, Jun, "A Novel Low-Temperature Solder Based on Intermetallic-Compound Phases: Alloy Design, High-Homologous Temperature Properties, and Reliability," JOM , vol. 60 no. 6, pp. 71-76, June 2008.

Suh, Daewoong, Hwang, Chi-won, Ueshima, Minoru, and Sugimoto, Jun, "A novel low-temperature solder based on intermetallic-compound phases with superior high-homologous temperature properties," Materials Letters , vol. 62 no. 12-13, pp. 2017-2020, Apr. 30, 2008.

Suh, Daewoong, Kim, Dong W., Liu, Pilin, Kim, Hyunchul, Weninger, Jessica A., Kumar, Chetan M., Prasad, Aparna, Grimsley, Brian W., and Tejada, Hazel B., "Effects of Ag content on fracture resistance of Sn-Ag-Cu lead-free solders under high-strain rate conditions," Materials Science and Engineering: A , vol. 460-461, pp. 595-603, July 15, 2007.

Suh, Daewoong, Hwang, Chi-won, Ueshima, Minoru, and Sugimoto, Jun, "Material Design and Package-Level Reliability of a Novel Low-Temperature Solder based on Intermetallic-Compound Phases with Superior High-Homologous Temperature Properties," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1265-1271.

Suh, Hoyoung, Jung, Hyunsung, Hangarter, Carlos M., Park, Hosik, Lee, Youngin, Choa, Yongho, Myung, Nosang V., and Hong, Kimin, "Diameter and Composition Modulated Bismuth Telluride Nanowires by Galvanic Displacement Reaction of Segmented NiFe Nanowires," Electrochimica Acta , vol. 75, pp. 201-207, July 30, 2012.

Suh, J. O., Tu, K. N., and Tamura, N., "A Synchrotron Radiation X-Ray Microdiffraction Study on Orientation Relationships between a Cu6Sn5 and Cu Substrate in Solder Joints," JOM , vol. 58 no. 6, pp. 63-66, June 2006.

Suh, J. O., Tu, K. N., and Tamura, N., "Preferred orientation relationship between Cu6Sn5 scallop-type grains and Cu substrate in reactions between molten Sn-based solders and Cu," Journal of Applied Physics, vol. 102 no. 6, pp. 063511-1-063511-7, 2007.

Suh, J. O., Tu, K. N., Lutsenko, G. V., and Gusak, A. M., "Size distribution and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper," Acta Materialia, vol. 56 no. 5, pp. 1075-1083, Mar. 2008.

Suh, J. O., Nah, J. W., Tu, K. N., and Tamura, N., "Synchrotron Radiation Based X-ray Micro-Diffraction Study on Reliability Issues of Solder Joints in Electronic Packaging Technology," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1924-1927.

Suh, Min-Suk, Park, Chan-Jin, and Kwon, Hyuk-Sang, "Growth kinetics of Cu-Sn intermetallic compounds at the interface of a Cu substrate and 42Sn-58Bi electrodeposits, and the influence of the intermetallic compounds on the shear resistance of solder joints," Materials Chemistry and Physics, vol. 110 no. 1, pp. 95-99, July 15, 2008.

Suhir, E., and Ghaffarian, R., "Column-grid-array (CGA) versus ball-grid-array (BGA): board-level drop test and the expected dynamic stress in the solder material," Journal of Materials Science: Materials in Electronics, vol. 27 no. 11, pp. 11572-11582, Nov. 2016.

Suhir, E., Yi, S., and Ghaffarian, R., "How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?," Journal of Electronic Materials, vol. 46 no. 3, pp. 1747-1753, Mar. 2017.

Suhir, E., Ghaffarian, R., and Nicolics, J., "Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package design," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Suhir, E., "What could and should be done differently: failure-oriented-accelerated-testing (FOAT) and its role in making an aerospace electronics device into a product," Journal of Materials Science: Materials in Electronics, vol. 29 no. 4, pp. 2939-2948, Feb. 2018.

Suhir, Ephraim, "Avoiding low-cycle fatigue in solder materials using inhomogeneous column grid array (CGA) design," Chip Scale Review, vol. 20 no. 2, pp. 46-48,50,52, Mar.-Apr. 2016.

Suhir, Ephraim, Ghaffarian, Reza, and Nicolics, Johann, "Could application of column-grid-array (CGA) technology result in inelastic-strain-free state-of-stress in solder material?," Journal of Materials Science: Materials in Electronics, vol. 26 no. 12, pp. 10062-10067, Dec. 2015.

Suhir, Ephraim, Yi, Sung, Hwang, Jennie S., and Ghaffarian, Reza, "Elevated Standoff Heights of Solder Joint Interconnections Can Result in Appreciable Stress and Warpage Relief," Journal of Microelectronics and Electronic Packaging, vol. 16 no. 1, pp. 13-20, Jan. 2019.

Suhir, Ephraim, and Ghaffarian, Reza, "Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with a low modulus solder at its ends," Journal of Materials Science: Materials in Electronics, vol. 26 no. 12, pp. 9680-9688, Dec. 2015.

Suhl, David, Kirloskar, Mohan, and Steiner, T. O., "The mechanism of plastic package cracking in SMT and two solutions," Fourth IEEE/CHMT European Electronic Manufacturing Technology Symposium , Neuilly Sur Seine, France, June 13-15, 1988, pp. 129-132.

Suhling, Jeffrey C., Gale, H. S., Johnson, R. Wayne, Islam, M. Nokibul, Shete, Tushar, Lall, Pradeep, Bozack, Michael J., Evans, John L., Seto, Ping, Gupta, Tarun, and Thompson, James R., "Thermal cycling reliability of lead-free chip resistor solder joints," Soldering & Surface Mount Technology, vol. 16 no. 2, pp. 77-87, 2004.

Suhling, Jeffrey C., Gale, H. S., Johnson, R. Wayne, Islam, M. Nokibul, Shete, Tushar, Lall, Pradeep, Bozack, Michael J., Evans, John L., Seto, Ping, Gupta, Tarun, and Thompson, James R., "Thermal Cycling Reliability of Lead Free Solders for Automotive Applications," The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 350-357.

Sui, Ran, Li, Fuxiang, Ci, Wenjuan, and Lin, Qiaoli, "Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350°C," Journal of Electronic Materials, vol. 48 no. 7, pp. 4660-4668, July 2019.

Suihkonen, David, and Mehta, Atul, "Vapor Phase - A Current Overview and its Application for Lead Free Reflow," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 189-199.

Suihkonen, David, "Vapor phase for lead-free reflow,," Global SMT and Packaging , vol. 7 no. 9, pp. 30, 32, Sept. 2007.

Sujan, D., Woldemichael, Dereje E., Murthy, M. V. V., and Seetharamu, K. N., "Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change," Journal of Electronic Packaging, vol. 133 no. 4, pp. 041014-1-041014-6, Dec. 2011.

Sujan, G. K., Haseeb, A. S. M. A., Jian, Chong Hoe, and Afifi, Amalina, "Ball shear strength and fracture mode of lead-free solder joints prepared using nickel nanoparticle doped flux," 2014 IEEE 36th International Electronics Manufacturing Technology Conference, Johor, Malaysia , Nov. 11-13, 2014, pp. xx-xx.

Sujan, G. K., Haseeb, A. S. M. A., Nishikawa, Hiroshi, and Amalina, M. A., "Interfacial reaction, ball shear strength and fracture surface analysis of lead-free solder joints prepared using cobalt nanoparticle doped flux," Journal of Alloys and Compounds, vol. 695, pp. 981-990, Feb. 25, 2017.

Suk, Kyoung-Lim, and Paik, Kyung-Wook, "Effects of Nanofiber Materials of Nanofiber Anisotropic Conductive Adhesives (Nanofiber ACAs) for Ultra-Fine Pitch Electronic Assemblies," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 118-123.

Suk, Kyoung-Lim, Son, Ho-Young, Chung, Chang-Kyu, Kim, Joong Do, Lee, Jin-Woo, and Paik, Kyung-Wook, "Embedded Chip-in-Flex (CIF) Packages using Wafer Level Package (WLP) with Pre-Applied Anisotropic Conductive Films (ACFs)," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1741-1748.

Suk, Kyoung-Lim, Son, Ho-Young, Chung, Chang-Kyu, Kim, Joong Do, Lee, Jin-Woo, and Paik, Kyung-Wook, "Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)," Microelectronics Reliability, vol. 52 no. 1, pp. 225-234, Jan. 2012.

Suk, Kyoung-Lim, and Paik, Kyung-Woo, "Microsolder Ball Incorporated Nanofiber Anisotropic Conductive Adhesives (Microsolder/Nanofiber ACAs)," 2013 IEEE International Symposium on Advanced Packaging Materials, Irvine, CA, Feb. 27-Mar. 1, 2013, pp. 162-169.

Suk, Kyoung-Lim, Chung, Chang-Kyu, and Paik, Kyung-Wook, "Nanofiber Anisotropic Conductive Adhesives (ACAs) for Ultra Fine Pitch Chip-on-Film (COF) Packaging," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 656-660.

Suk, Sung Dae, Yeo, Kyoung Hwan, Cho, Keun Hwi, Li, Ming, Yeoh, Yun Young, Lee, Sung-Young, Kim, Sung Min, Yoon, Eun Jung, Kim, Min Sang, Oh, Chang Woo, Kim, Sung Hwan, Kim, Dong-Won, and Park, Donggun, "High-Performance Twin Silicon Nanowire MOSFET (TSNWFET) on Bulk Si Wafer," IEEE Transactions on Nanotechnology, vol. 7 no. 2, pp. 181-184, Mar. 2008.

Sulka, Grzegorz D., Brzozka, Agnieszka, and Liu, Lifeng, "Fabrication of diameter-modulated and ultrathin porous nanowires in anodic aluminum oxide templates," Electrochimica Acta, vol. 56 no. 14, pp. 4972-4979, May 30, 2011.

Sullivan, J., and Worsley, D., "Synthesis of nanostructured ruthenium microwires in domestic microwave oven," Materials Science and Technology, vol. 25 no. 1, pp. 121-124, Jan. 2009.

Sullivan, Keith, "Designing for Environmental Compliance," empfasis, pp. xx-xx, May 2008.

Sullivan, Robert, "Zinc Whiskers Growing on Raised-Floor Tiles are Causing Conductive Failures and Equipment Shutdowns," The Uptime Institute, 2001.

Sulouff, R. E., "Time Dependent Relationships in Solder Interconnections," 1974 International Microelectronic Symposium, Boston, MA, Oct. 21-23, 1974, pp. 418-426.

Sumikawa, Masato, Murayama, Rina, Ogawa, Masashi, and Matsubara, Hiroshi, "Reliability of a Wafer Level Packaging Method with Plastic-Core Solder Bumps - Utilizing Sn-Ag solder at 0.3 mm diameter -," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 693-698.

Sun, Bianting, Jones, J. J., Burford, R. P., and Skyllas-Kazacos, M., "Conductivity and Anisotropy of Electrochemically Prepared Conducting Polypyrrole Films Journal of the Electrochemical Society, vol. 136 no. 3, pp. 698-701, Mar. 1989.

Sun, Bin, Yang, Zhong-Tian, Zou, Xian-Wu, and Jin, Zhun-Zhi, "Nonequilibrium microstructure of Pb-Sn alloy obtained from electrochemical deposition," Materials Chemistry and Physics, vol. 86 no. 1, pp. 144-149, July 2004.

Sun, Du, Xiong, Yihuang, Sun, Yifan, Dabo, Ismaila, and Schaak, Raymond E., "Solution-Synthesized In4SnSe4 Semiconductor Microwires with a Direct Band Gap," Chemistry of Materials, vol. 29 no. 3, pp. 1095-1098, Feb. 14, 2017.

Sun, F., Hochstenbach, P., Van Driel, W. D., and Zhang, G. Q., "Aging Effects on IMC Formation and Joint Strength of Low-Ag SAC solder/UBM (Ni(P)-Au) for WLCSP," International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, Freiburg, Germany, Apr. 20-23, 2008, pp. xx-xx.

Sun, F., Hochstenbach, P., Van Driel, W. D., and Zhang, G. Q., "Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP," Microelectronics Reliability, vol. 48 no. 8-9, pp. 1167-1170, Aug.-Sept. 2008.

Sun, F. L., Hochstenbach, P., Van Driel, W. D. and Zhang, G. Q., "Morphology, Evolution and Performance of IMC in SAC105 Solder/UBM (Ni (P)-Au)," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Sun, Fenglian, Zhu, Yan, and Li, Xuemei, "Effects of Micro Solder Joint Geometry on Interfacial IMC Growth Rate," Journal of Electronic Materials, vol. 46 no. 7, pp. 4034-4038, July 2017.

Sun, Fenglian, LiuA, Yang, LiuB, Yang, Wang, Jiabing, and Zhang, Hongwu, "Improving Low-Ag Pb-Free Solder Performance by Adding Bi, Ni Elements," Advanced Materials Research, vol. 189-193, pp. 3498-3502, 2011.

Sun, Fujiang, "Solder Joint Reliability of Sn-Ag-Cu BGA and Sn-Pb Solder Paste," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Sun, Fenglian, and Yin, Zuozhu, "The interfacial Cu-Sn intermetallic compounds (IMCs) growth behavior of Cu/Sn/Cu sandwich structure via induction heating method," Journal of Materials Science: Materials in Electronics, vol. 30 no. 20, pp. 18878-18884, Oct. 2019.

Sun, Hongqi, Sun, Jiangyan, Ding, Dongyan, Chen, Chun, Li, Ming, and He, Yanfeng, "Effect of deposit microstructure on the reflow discoloration of electroplating pure tin," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 158-162.

Sun, Hongyu, and Huang, Mingliang, "Dominant effect of Sn grain orientation on electromigration-induced failure mechanism of Sn-3.0Ag-0.5Cu flip chip solder interconnects," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1296-1299.

Sun, Huayu, Li, Qingqian, and Chan, Y. C., "A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints," Journal of Materials Science: Materials in Electronics, vol. 25 no. 10, pp. 4380-4390, Oct. 2014.

Sun, Huayu, and Chan, Y. C., "Drawbacks of the nanoparticle reinforced lead-free BGA solder joints," 2014 Electronics System-Integration Technology Conference, Helsinki, Finland, Sept. 16-18, 2014, pp. xx-xx.

Sun, Huayu, Chan, Y. C., and Wu, Fengshun, "Effect of CNTs and Ni coated CNTs on the mechanical performance of Sn57.6Bi0.4Ag BGA solder joints," Materials Science and Engineering: A , vol. 656, pp. 249-255, Feb. 22, 2016.

Sun, Huayu, Chan, Y. C., and Wu, Fengshun, "Influence of the aggregated Ag3Sn on the improvement of electromigration phenomenon in the doped Sn58Bi solder joints," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Sun, Huayu, Chan, Y. C., and Wu, Fengshun, "Influence of the aggregated Ag3Sn on the improvement of electromigration phenomenon in the doped Sn58Bi solder joints," Journal of Materials Science: Materials in Electronics, vol. 26 no. 7, pp. 5129-5134, July 2015.

Sun, Huayu, Chan, Y. C., and Wu, Fengshun, "Reliability performance of tin-bismuth-silver (Sn57.6Bi0.4Ag) solder joints with different content of carbon nano-tubes (CNTs) or nickel (Ni)-modified CNTs," Journal of Materials Science: Materials in Electronics, vol. 29 no. 10, pp. 8584-8593, May 2018.

Sun, Huayu, Chan, Y. C., and Wu, Fengshun, "The impact of reflow soldering induced dopant redistribution on the mechanical properties of CNTs doped Sn58Bi solder joints," Journal of Materials Science: Materials in Electronics, vol. 26 no. 7, pp. 5318-5325, July 2015.

Sun, Jia, Xu, Guangchen, Guo, Fu, Xia, Zhidong, Lei, Yongping, Shi, Yaowu, Li, Xiaoyan, and Wang, Xitao, "Effects of electromigration on resistance changes in eutectic SnBi solder joints," Journal of Materials Science, vol. 46 no. 10, pp. 3544-3549, May 2011.

Sun, Jiapeng, Xu, Bingqian, Yang, Zhenquan, Han, Jing, Zhuo, Xiaoru, Liu, Huan, Wu, Yuna, Ma, Aibin, and Wu, Guosong, "Shrinking tension-compression asymmetry of Au nanowires by designed nanotwin boundaries," Materials Chemistry and Physics, vol. 252, pp. 123267-1123267-6, Sept. 15, 2020.

Sun, Jiapeng, Fang, Liang, Ma, Aibin, Jiang, Jinghua, Han, Ying, Chen, Huawei, and Han, Jing, "The fracture behavior of twinned Cu nanowires: A molecular dynamics simulation," Materials Science and Engineering: A, vol. 634, pp. 86-90, May 14, 2015.

Sun, Jie, and Wang, Gang, "Preparation and characterization of a cerium conversion film on magnesium alloy," Anti-Corrosion Methods and Materials, vol. 62 no. 4, pp. , 253-258, 2015.

Sun, Jinghua, Dahlgren, Eric, Tang, Dian, O'Keefe, Thomas, and O'Keefe, Matthew, "Deposition of Gold and Silver Surface Finishes Using Organic-Based Solutions," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S060101-S06-1-7.

Sun, Junhao, Du, Yao, Kunwar, Anil, Qu, Lin, Li, Shuang, Liu, Jiahui, Guo, Binfeng, and Ma, H. T., "In situ study on growth behavior of interfacial bubbles and its size effect on Sn-0.7Cu/Cu interfacial reaction," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 976-979.

Sun, Lei, Chen, Ming-he, Zhang, Liang, and Xie, Lan-sheng, "Effect of addition of CuZnAl particle on the properties of Sn solder joint," Journal of Materials Processing Technology, vol. 278, pp. 116507, Apr. 2020.

Sun, Lei, Zhang, Liang, Xu, Le, Zhong, Su-Juan, Ma, Jia, and Bao, Li, "Effect of nano-Al addition on properties and microstructure of low-Ag content Sn-1Ag-0.5Cu solders," Journal of Materials Science: Materials in Electronics, vol. 27 no. 7, pp. 7665-7673, July 2016.

Sun, Lei, Chen, Ming-he, Wei, Chun-chun, Zhang, Liang, and Yang, Fan, "Effect of thermal cycles on interface and mechanical property of low-Ag Sn1.0Ag0.5Cu(nano-Al)/Cu solder joints," Journal of Materials Science: Materials in Electronics, vol. 29 no. 12, pp. 9757-9763, June 2018.

Sun, Lei, Zhang, Liang, Zhong, Su-juan, Ma, Jia, and Bao, Li, "Reliability study of industry Sn3.0Ag0.5Cu/Cu lead-free soldered joints in electronic packaging," Journal of Materials Science: Materials in Electronics, vol. 26 no. 11, pp. 9164-9170, Nov. 2015.

Sun, Lei, Chen, Ming-he, Zhang, Liang, Xie, Lan-sheng, and Wei, Chun-chun, "Wettability, interfacial reaction and mechanical properties of Sn/Sn-CuZnAl solder and Cu sheet during solid-liquid diffusion," Journal of Materials Science: Materials in Electronics, vol. 30 no. 20, pp. 18462-18470, Oct. 2019.

Sun, Li, DeReus, Dana, Cunningham, Shawn, and Morris, Art, "Investigation of Board-Level and Package-Level Drop Reliability of RF MEMS Packages," Proceedings of the ASME International Mechanical Engineering Congress & Exposition, Volume 5: Electronics and Photonics, Lake Buena Vista, FL, Nov. 13-19, 2009, pp. 225-230.

Sun, Li, Qi, Fangjuan, Hou, Zhezhe, and Xiao, Yuehua, "The Prediction of Sn-Ag Solder Properties Based on BP Algorithm of Artificial Neutral Network," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Sun, Liying, Wang, Chen, Shang, Shengyan, Chen, Jun, Wang, Yunpeng, and Ma, Haitao, "Study on the coordination agent system of Sn-Ag-Cu ternary alloy co-deposition," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Sun, Menglong, Zhao, Qinghua, Wang, Dongfan, Hu, Anmin, and Li, Ming, "Effect of reflow time on shear property of Sn-9Zn solder bumps," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1035-1038.

Sun, Menglong, Dong, Mengya, Wang, Dongfan, Ling, Huiqin, Hu, An-min, and Li, Ming, "Growth behavior of tin whisker on SnAg microbump under compressive stress," Scripta Materialia, vol. 147, pp. 114-118, Apr. 1, 2018.

Sun, Menglong, Long, Xiaoping, Dong, Mengya, Xia, Yuanyuan, Hu, Fengtian, Hu, An-min, and Li, Ming, "Mitigation of tin whisker growth by inserting Ni nanocones," Materials Characterization, vol. 134, pp. 354-361, Dec. 2017.

Sun, Ming, Loo, Mike, and Dandia, Sanjay, "Conductivity Assessment of Conductive Polymer Bonding for Flip Chip Applications" Twenty-Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium, Santa Clara, CA, Oct. 2-3, 2000, pp. 279-287.

Sun, Ming, Lin, Muh-Ren, Chaudhry, Tim (Imtiaz), and Lutze, Robert, "Investigation of Phosphorus Impact on Lead-Free BGA Solder Joint and Failure Mechanism," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 469-476.

Sun, Mingfei, Cao, Ronggen, Xiao, Fei, and Deng, Chuang, "Surface and interface controlled yielding and plasticity in fivefold twinned Ag nanowires," Computational Materials Science, vol. 79, pp. 289-295, Nov. 2013.

Sun, Ning, Lin, Dachuan, and Yang, Daoguo, "Analysis of Thermal-Moisture Induced Failure of Pb-free Soldered IC Packages in SMT Reflow Soldering Process," Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, Brussels, Belgium, May 9-12, 2004, pp. 341-344.

Sun, Pan, Liu, Yihe, Wan, Xiang, Meng, Xianquan, Su, Rui, and Yu, Sheng, "Synthesis of long Ag nanowires and its application in GaN nanowires photodetector as transparent electrodes," Journal of Materials Science: Materials in Electronics, vol. 26 no. 9, pp. 6787-6792, Sept. 2015.

Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cheng, Zhaonian, Shangguan, Dongkai, and Liu, Johan, "Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint," Soldering & Surface Mount Technology, vol. 18 no. 2, pp. 4-11, 2006.

Sun, Peng, Andersson, Cristina, Cheng, Zhaonian, Lai, Zonghe, Shangguan, Dongkai, and Liu, Johan, "Coffin-Manson Equation determination for Sn-Zn Based Lead-Free Solder Joints," 7th IEEE CPMT International Conference on High Density Microsystem Design, Packaging and Failure Analysis, Shanghai, June 28, 2005, pp. xx-xx.

Sun, Peng, Andersson, Cristina, Liu, Johan, Andersson, Dag R., Tegehall, Per-Erik, and Shangguan, Dongkai, "Evolution of Intermetallic Compounds in PBGA Sn-Ag-Cu Solder Joints during Thermal Cycling Testing," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cheng, Zhaonian, Shangguan, Dongkai, and Liu, Johan, "High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni(P) metallization," Journal of Alloys and Compounds, vol. 425 no. 1-2, pp. 191-199, Nov. 30, 2006.

Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cheng, Zhaonian, Lai, Zonghe, Shangguan, Dongkai, and Liu, Johan, "High Temperature Aging Study of Intermetallic Compound Formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu Solders on Electroless Ni (P) Metallization," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1468-1475.

Sun, Peng, Andersson, Christina, Wei, Xicheng, Cheng, Zhaonian, Shangguan, Dongkai, and Liu, Johan, "Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering," Proceedings of the 2006 IEEE CPMT Conference on High Density Microsystem Design, Packaging and Component Failure Analysis, Shanghai, June 27-28, 2006, pp. 285-291.

Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cheng, Zhaonian, Shangguan, Dongkai, and Liu, Johan, "Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering," Materials Science and Engineering B: Solid-State Materials for Advanced Technology, vol. 135 no. 2, pp. 134-140, Nov. 25, 2006.

Sun, Peng, Andersson, Cristina, Cao, Liqiang, Lai, Zhonghe, Cheng, Zhaonian, Wei, Xicheng, and Liu, Johan, "Isothermal Low Cycle Fatigue Behavior of Sn-8Zn-3Bi on Single Shear Solder Joint," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 696-700.

Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cao, Liqiang, Cheng, Zhaonian, and Liu, Johan, "Low cycle fatigue testing and simulation of Sn-8Zn-3Bi and Sn-37Pb solder joints," Soldering & Surface Mount Technology, vol. 17 no. 4, pp. 38-45, 2005.

Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cheng, Zhaonian,Shangguan, Dongkai, and Liu, Johan, "Microstructural evolution of Sn-Zn based lead free solders after temperature and humid atmosphere exposure," 7th IEEE CPMT International Conference on High Density Microsystem Design, Packaging and Failure Analysis, Shanghai, June 28, 2005, pp. xx-xx.

Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cheng, Zhaonian, Shangguan, Dongkai, and Liu, Johan, "Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate," Journal of Alloys and Compounds, vol. 437 no. 1-2, pp. 169-179, June 28, 2007.

Sun, Q. Q., Liu, L. J., Li, X. F., Zu, F. Q., Ding, G. H., Guo, L. L., Chen, J., and Huang, Z. Y., "A new understanding of melt overheating treatment of Sn-20 wt-%Sb from viewpoint of TI-LLST," Materials Science and Technology, vol. 25 no. 1, pp. 35-38, Jan. 2009.

Sun, Qian, and Selvaduray, Guna, "Understanding and Minimizing Tin Whiskers," San Jose State University, June 4, 2003.

Sun, Qian, "Understanding and Minimization of Tin Whiskers," Spring 2003.

Sun, Ren, Sui, Yanwei, Qi, Jiqiu, Wei, Fuxiang, He, Yezeng, Chen, Xiao, Meng, Qingkun, and Sun, Zhi, "Influence of SnO2 Nanoparticles Addition on Microstructure, Thermal Analysis, and Interfacial IMC Growth of Sn1.0Ag0.7Cu Solder," Journal of Electronic Materials, vol. 46 no. 7, pp. 4197-4205, July 2017.

Sun, Shenliang, Yau, Yung-Herng, Fudala, John, Farrell, Robert, Fan, Chonglun, Xu, Chen, Wengenroth, Karl, Cheung, Michael, and Abys, Joseph, "Novel OSP Coatings For Lead-Free Processes," CircuiTree, vol. 19 no. 3, pp. xx-xx, Mar. 2006.

Sun, Shenliang, Yau, Yung-Herng, Fudala, John, Farrell, Robert, Fan, Chonglun, Xu, Chen, Wengenroth, Karl, Cheung, Michael, and Abys, Joseph, "The Characterization of Novel High Temperature Resistant OSP Coatings for Lead free Processes by Comparing to Other Commercial OSP Coatings," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S33-03-1-S33-03-12.

Sun, W., and Ivey, D. G., "Development of an electroplating solution for codepositing Au-Sn alloys," Materials Science and Engineering B: Solid-State Materials for Advanced Technology, vol. 65 no. 2, pp. 111-122, Nov. 15, 1999.

Sun, Wei, Zhu, W. H., Che, F. X., Wang, C. K., Sun, Anthony Y. S., and Tan, H. B., "Experimental and Numerical Assessment of Board-Level Temperature Cycling Performance for Eutectic and Pb-free windows-Chip-Scale-Package (wCSP)," 2006 7th International Conference on Electronic Packaging Technology , Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Sun, Wei, Zhu, W. H., Poh, Edith S. W., Tan, H. B., and Gan, Richard Te, "Study of Five Substrate Pad Finishes for the Co-design of Solder Joint Reliability under Board-level Drop and Temperature Cycling Test Conditions," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Sun, Wei, Zhu, W. H., Danny, Retuta, Che, F. X., Wang, C. K., Sun, Anthony Y. S., and Tan, H. B., "Study on the Board-level SMT Assembly and Solder Joint Reliability of Different QFN Packages," Proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, London, England, Apr. 15-18, 2007, pp. xx-xx.

Sun, Xiaowei, Li, Weiming, and Chen, Mingsheng, "Influence of the BGA solder joint microstructure on the thermal cycling reliability," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Sun, Xuhui, Yu, Bin, Ng, Garrick, Meyyappan, M., Ju, Sanghyun, and Janes, David B., "Germanium Antimonide Phase-Change Nanowires for Memory Applications," IEEE Transactions on Electron Devices, vol. 55 no. 11, pp. 3131-3135, Nov. 2008.

Sun, Y., Xu, Z. H., Li, X., Shangguan, D., and Liang, J., "Mechanical Properties of Lead Free Solder Alloy Measured by Nanoindentation," Proceedings of the ASME InterPack Conference, Volume 2, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 415-421.

Sun, Y. L., Dai, Y., Zhou, L. Q., and Chen, W., "Single-Crystal Iron Nanowire Arrays," Solid State Phenomena, vol. 121-123, pp. 17-20, Mar. 2007.

Sun, Yangshan, Xue, Feng, and Zhou, Jian, "Lead-free Solders Based on the Sn-8Zn-3Bi Ternary Alloy with Additions of In, Nd or La," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Sun, Yaofeng, and Pang, John H. L., "Experimental and numerical investigations of near-crack-tip deformation in a solder alloy," Acta Materialia, vol. xx no. xx, pp. xx-xx, 2008.

Sun, Yinlu, Sun, Wei, Fu, Yingqiang, Wang, FenYing, Gao, Yajun, and Zhao, Jianwei, "The deformation behaviors of silver nanowires including 3D defects under tension," Computational Materials Science, vol. 79, pp. 63-68, Nov. 2013.

Sun, Yong, Hoffman, Elizabeth N., Lam, Poh-Sang, and Li, Xiaodong, "Evaluation of local strain evolution from metallic whisker formation," Scripta Materialia, vol. 65 no. 5, pp. 388-391, Sept. 2011.

Sun, Yong, Liang, Jin, Xu, Zhi-Hui, Wang, Guofeng, and Li, Xiaodong, "In Situ Observation of Small-Scale Deformation in a Lead-Free Solder Alloy," Journal of Electronic Materials, vol. 38 no. 3, pp. 400-409, Mar. 2009.

Sun, Yong, Liang, Jin, Xu, Zhi-Hui, Wang, Guofeng, and Li, Xiaodong, "Nanoindentation for measuring individual phase mechanical properties of lead free solder alloy," Journal of Materials Science: Materials in Electronics, vol. 19 no. 6, pp. 514-521, June 2008.

Sun, Yugang, Gates, Byron, Mayers, Brian, and Xia, Younan, "Crystalline Silver Nanowires by Soft Solution Processing," Nano letters , vol. 2 no. 2, pp. 165-168, Feb. 2002.

Sun, Z. M., and Barsoum, M. W., "Spontaneous room temperature extrusion of Pb nano-whiskers from leaded brass surfaces," Journal of Materials Research, vol. 20 no. 5, pp. 1087-1089, May 2005.

Sun, Zheng Ming, "Spontaneous growth of freestanding Ga nanoribbons from Cr2GaC surfaces," Journal of Materials Research, vol. 20 no. 10, pp. 2618-2621, Oct. 2005.

Sun, ZhengMing, Hashimoto, Hitoshi, and Barsoum, Michel W., "On the effect of environment on spontaneous growth of lead whiskers from commercial brasses at room temperature," Acta Materialia, vol. 55 no. 10, pp. 3387-3396, June 2007.

Sun, Zhijie, Ma, Limin, Wang, Yishu, Han, Jing, Zuo, Yong, and Guo, Fu, "Study of EM and TM of Sn0.3Ag0.7Cu solder joints under high current stress and thermal gradient," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 750-754.

Sunappan, Vasudivan, and Collier, Peter, "Lead-free Wave Soldering Development for PCB Assembly," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1829-1838.

Sundelin, Janne J., Nurmi, Sami T., Lepisto, Toivo K., and Ristolainen, Eero O., "Effect of PCB surface finish on creep properties of lead-free solder joints," Soldering & Surface Mount Technology, vol. 17 no. 4, pp. 3-9, 2005.

Sundelin, Janne J., Nurmi, Sami T., Lepisto, Toivo K., and Ristolainen, Eero O., "Mechanical and microstructural properties of SnAgCu solder joints," Materials Science and Engineering A, vol. 420 no. 1-2, pp. 55-62, Mar. 25, 2006.

Sundelin, Janne J., Nurmi, Sami T., Lepisto, Toivo K., and Ristolainen, Eero O., "Microstructure, Creep Properties, and Failure Mechanism of SnAgCu Solder Joints," Journal of Electronic Materials, vol. 35 no. 7, pp. 1600-1606, July 2006.

Sundelin, Janne J., Nurmi, Sami T., Lepisto, Toivo K., and Ristolainen, Eero O., "Pull Testing of Lead-free QFP Solder Joints," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1622-1626.

Sundelin, Janne J., Nurmi, Sami T., and Lepisto, Toivo K., "Recrystallization behaviour of SnAgCu solder joints," Materials Science and Engineering: A, vol. 474 no. 1-2, pp. 201-207, Jan. 25, 2008.

Sung, Yong-Gue, Myung, Woo-Ram, Jeong, Haksan, Ko, Min-Kwan, Moon, Jeonghoon, and Jung, Seung-Boo, "Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock," Journal of Electronic Materials , vol. 47 no. 7, pp. 4165-4169, July 2018.

Sungkhaphaitoon, Phairote, and Plookphol, Thawatchai, "Effect of Cooling Rate on the Microstructure and Mechanical Properties of Sn-0.7wt.%Cu Solder Alloy," Key Engineering Materials, vol. 675-676, pp. 513-516, Jan. 2016.

Sungkhaphaitoon, Phairote, and Plookphol, Thawatchai, "The Effects of Antimony Addition on the Microstructural, Mechanical, and Thermal Properties of Sn-3.0Ag-0.5Cu Solder Alloy," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 49 no. 2, pp. 652-660, Feb. 2018.

Sunthankar, Mandar, and Storey, Dan, "Development of a New Chromium Coating Method to Eliminate Hexavalent Chromium," 22nd AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 29-Feb. 1, 2001, pp. xx-xx.

Sunwoo, A. J., Hayashigatani, H., Morris Jr., J. W., and Lucey Jr., G. K., "The Effect of Pretinning on the Solderability of Copper," JOM, vol. 43 no. 6, pp. 21-24, June 1991.

Sunwoo, A. J., Morris, J. W., and Lucey, G. K., "The Growth of Cu-Sn Intermetallics at a Pretinned Copper-Solder Interface," Metallurgical Transactions A, vol. 23 no. 4, pp. 1323-1332, Apr. 1992. https://doi.org/10.1007/BF02665064

Suppa, Manfred, "Evaluation of Photoimageable Solder Resists With Regard to the VOC and EuP Directives," CircuiTree, vol. 20 no. 9, pp. xx-xx, Sept. 2007.

SuPrise, Anne Marie T., and Willoughby, Brian, "Best Manufacturing Practices Center of Excellence," Naval-Industry R&D Partnership Conference 2003, Aug. 5, 2003.

Suraski, David, "A Study of Antimony in Solder," AIM.

Suraski, David, "A Study of Lead-Free Hot Air Leveling," Circuits Assembly, vol. 15 no. 10, pp. 32-34, Oct. 2004.

Suraski, David, "Choices in Pb-free solder alloys," Electronic Products, vol. 48 no. 12, pp. 105, May 2006.

Suraski, David, "Considerations for Printing Lead-free Solder Pastes," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Suraski, David, and Seelig, Karl, "Controlling Copper Build Up in Automatic Soldering Equipment Using Lead-Free Solder," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 236-238.

Suraski, David, and Seelig, Karl, "Lead-Free Solder Assembly for Mixed Technology Circuit Boards," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 121-125.

Suraski, David, "TechTips Toolbox," Lead-free Electronics, Nov. 2004.

Suraski, David, and Seelig, Karl, "The Current Status of Lead-Free Solder Alloys," IEEE Transactions on Electronics Packaging Manufacturing, vol. 24 no. 4, pp. 244-248, Oct. 2001.

Surendar, A., Kishore, K. H., Kavitha, M., Ibatova, A. Z., and Samavatian, V., "Effects of Thermo-Mechanical Fatigue and Low Cycle Fatigue Interaction on Performance of Solder Joints," IEEE Transactions on Device and Materials Reliability, vol. 18 no. 4, pp. 606-612, Dec. 2018.

Surendar, A., Siswanto, Waluyo Adi, Alijani, Maryam, Alhaifi, K., and Salmani, Mohammad, "High-G drop effect on the creep-fatigue failure of SAC solder joints in BGA packages," Microsystem Technologies, vol. 25 no. 10, pp. 4027-4034, Oct. 2019.

Surendar, A., Kavitha, M., Arun, M., and Panwar, V., "Reliability Assessment of Solder Joints in Electronic Devices Under Extreme Thermal Fluctuations," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 10 no. 8, pp. 1394-1400, Aug. 2020.

Surendar, Aravindhan, Akhmetov, Linar G., Ilyashenko, Lubov K., Maseleno, Andino, and Samavatian, Vahid, "Effect of Thermal Cycle Loadings on Mechanical Properties and Thermal Conductivity of a Porous Lead-Free Solder Joint," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 8 no. 10, pp. 1769-1776, Oct. 2018.

Suriano, F., Ferri, M., Moscatelli, F., Mancarella, F., Belsito, L., Solmi, S., Roncaglia, A., Frabboni, S., Gazzadi, G. C., and Narducci, D., "Influence of Grain Size on the Thermoelectric Properties of Polycrystalline Silicon Nanowires," Journal of Electronic Materials, vol. 44 no. 1, pp. 371-376, Jan. 2015.

Suriati, G., Mariatti, M., and Azizan, A., "Effects of filler shape and size on the properties of silver filled epoxy composite for electronic applications," Journal of Materials Science: Materials in Electronics, vol. 22 no. 1, pp. 56-63, Jan. 2011.

Surowiec, M., Bojarski, Z., and Champier, G., "Dislocations in Deformed Iron Whiskers," Acta crystallographica, vol. A37 no. x, pp. C255, 1981.

Surowiec, M., and Champier, G., "Microdeformation of [111] Iron Whiskers," Journal of Applied Crystallography, vol. 15 no. x, pp. 558-563, 1982.

Survila, Arvydas, Brazinskiene, Dalia, Kanapeckaite, Stase, Mockus, Zenius, and Jasulaitiene, Vitalija, "Codeposition of copper and tin from acidic sulfate solutions containing polyethylene glycols. Effect of length of the hydrocarbon chain," Journal of Solid State Electrochemistry, vol. 14 no. 4, pp. 507-514, Apr. 2010.

Surviliene, S., Lisowska-Oleksiak, A., Selskis, A., and Cesuniene, A., "Corrosion behavior of Cr coatings deposited from Cr(III) formate-urea electrolytes," Transactions of the Institute of Metal Finishing, vol. 84 no. 5, pp. 241-245, Sept. 2006.

Surviliene, S., Cesuniene, A., Jasulaitiene, V., and Bucinskiene, D., "Influence of SiC + WC addition to Cr(VI) bath on corrosion behavior of coatings in sulphate solution," Transactions of the Institute of Metal Finishing, vol. 86 no. 6, pp. 308-314, Nov. 2008.

Susan, D. F., Vianco, P. T., Yelton, W. G., and Michael, J. R., "Recent Tin Whisker Research at Sandia," Sandia Report SAND2011-9133C, 2011.

Susan, D. F., Michael, J. R., Grant, R. P., and Yelton, W. G., "Tin Whiskers: Electron Microscopy and EBSD Characterization," Microscopy and Microanalyses, vol. 16 no. S2, pp. 792-793, July 2010.

Susan, D. F., Rejent, J. A., Hlava, P. F., and Vianco, P. T., "Very long-term aging of 52In-48Sn (at.%) solder joints on Cu-plated stainless steel substrates," Journal of Materials Science, vol. 44 no. 2, pp. 545-555, Jan. 2009.

Susan, Don F., Michael, Joe, McKenzie, Bonnie, and Yelton, Graham, "Crystallographic Analysis of Tin Whiskers with SEM/EBSD," 5th Annual Tin Whisker Conference, College Park, MD, Sept. 14-15, 2011, pp. xx-xx. (Sandia Report SAND2011-7551C).

Susan, Don, Vianco, Paul, Yelton, Graham, and Michael, Joe, "Recent Research on Tin Whiskers at Sandia," 5th International Brazing and Soldering Conference, Las Vegas, NV, Apr. 27, 2011, pp. xx-xx. (Sandia Report SAND2012-3310C)

Susan, Don, "Tin Whisker Work at Sandia National Laboratories," Tin Whisker Group teleconference, Jan. 9, 2013.

Susan, Donald, Michael, Joseph, Grant, Richard P., Mckenzie, Bonnie, and Yelton, W. Graham, "Morphology and Growth Kinetics of Straight and Kinked Tin Whiskers," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 44 no. 3, pp. 1485-1496, Mar. 2013. https://doi.org/10.1007/s11661-012-1488-7

Susan, Donald F., Michael, Joseph R., Yelton, W. Graham, McKenzie, Bonnie B., Grant, Richard P., Pillars, Jamin, and Rodriguez, Mark A., "Understanding and Predicting Metallic Whisker Growth and its Effects on Reliability: LDRD Final Report,", Sandia Report SAND2012-0519, Jan. 2012.

Suter, T., Schmutz, P., and Trzebiatowski, O. V., "Electrochemical Characterization of Submicrometer Structures," ECS Transactions, vol. 3 no. 31, pp. 29-37, 2007.

Sutiono, S., Seah, A., Chew, S., Calpito, D., Saraswati, Stephan, D., Wulff, F., and Breach, C. D., "Intermetallic Growth Behaviour of Gold Ball Bonds Encapsulated with Green Moulding Compounds," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2, Singapore, Dec. 7-9, 2005, pp. 584-589.

Sutton, Bernard, "Bernard Sutton Consultancy," SMART Group Lead-Free Seminar, Shannon, Ireland, May 19, 2005.

Sutton, William G., "Association Report: ARI," Appliance Design, vol. xx no. xx, pp. xx-xx, May 1, 2006.

Suzuki, Atsushi, Ishikawa, Takaaki, Wakazono, Yoshitsugu, Nagao, Daisuke, Hino, Tomoyuki, Hashimoto, Yoichi, Masuda, Hiroshi, Suzuki, Shuji, Tamura, Mitsuaki, Suzuki, Tei-Ichi, Kikuchi, Katsuya, Okada, Yoshikuni, Nakagawa, Hiroshi,Aoyaghi, Masahiro, and Mikawa, Takashi, "10-Gb/s x 12-ch Downsized Optical Modules with Electrical Conductive Film Connector," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 250-255.

Suzuki, Ken, Kano, Satoru, Kajihara, Masanori, Kurokawa, Noriharu, and Sakamoto, Katsuhiko, "Reactive Diffusion between Ag and Sn at Solid State Temperatures," Materials Transactions, vol. 46 no. 5, pp. 969-973, 2005.

Suzuki, Kenichi, "Ag-Sn Alloys as Conductive Fillers in ICAS," 2003 Pan Pacific Symposium Conference Proceedings, Feb. 18-20, 2003, pp. xx-xx.

Suzuki, Kenichi, Suzuki, Osamu, and Komagata, Mitinori, "Conductive adhesive Materials for Lead solder Replacement," The First IEEE International Symposium on Polymeric Electronics Packaging, Oct. 26-30, 1997, pp. 76-79.

Suzuki, Kenichi, Suzuki, Osamu, and Komagata, Mitinori, "Conductive Adhesive Materials for Lead Solder Replacement," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A , vol. 21 no. 2, pp. 252-258, June 1998.

Suzuki, Kenichi, Shirai, Yukio, Mizumura, Noritsuka, and Komagata, Michinori, "Conductive Adhesives containing Ag-Sn Alloys as Conductive Filler," 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, Portland, OR, Sept. 12-15, 2004, pp. 57-62.

Suzuki, Kunio, Ishida, Yoichi, and Ichihara, Masaki, "Growth of Whisker During "Superplastic" Straining of Zn-Al Eutectoid," Journal of the Japan Institute of Metals, vol. 38 no. 10, pp. 920-925, Oct. 1974.

Suzuki, Masachika, Subramanian, Logakanthi, Watanabe, Tomio, and Hasegawa, Hiroyuki, "The Application of the International Resource Recycling System (IRRS) to encouragement of Electronic Waste Recycling- the Case of Fuji Xerox," 2008 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 19-21, 2008, pp. xx-xx.

Suzuki, Motofumi, Nagai, Koji, Kinoshita, Sadamu, Nakajima, Kaoru, Kimura, Kenji, Okano, Tomoki, and Sasakawa, Kaoru, "Morphological evolution of Al whiskers grown by high temperature glancing angle deposition," Journal of Vacuum Science & Technology A: Vacuum Surfaces, and Films, vol. 25 no. 4, pp. 1098-1102, July/Aug. 2007.

Suzuki, Motofumi, Nagai, Koji, Kinoshita, Sadamu, Nakajima, Kaoru, Kimura, Kenji, Okano, Tomoki, and Sasakawa, Kaoru, "Vapor phase growth of Al whiskers induced by glancing angle deposition at high temperature," Applied Physics Letters, vol. 89, pp. 133103-1-133103-3, 2006.

Suzuki, Motoji, Matsuoka, Hiroshi, Kono, Eiichi, and Igarashi, Makoto, "Sn-Zn Lead-Free Solder Applied to Notebook Personal Computer," Proceedings 2001 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4587), Baltimore, MD, Oct. 9-11, 2001, pp. 298-303.

Suzuki, Motoji, Matsuoka, Hiroshi, Sakai, Hiroshi, and Kishida, Hideya, "Sn-Zn Lead-Free Soldering Technologies for Personal Computers," 2005 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.

Suzuki, Osamu, Komagata, Michinori, and Suzuki, Kenichi, "Conductive Adhesive Materials for Lead Solder Replacement 2," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 351-355.

Suzuki, Taku, Asami, Kazushi, Kitamura, Yasuhiro, Fukushima, Takafumi, Nagai, Chisato, Bea, Jichoel, Sato, Yutaka, Murugesan, Mariappan, Lee, Kang-Wook, and Koyanagi, Mitsumasa, "Challenges of High-Robustness Self-Assembly with Cu/Sn-Ag Microbump Bonding for Die-to-Wafer 3D Integration," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 342-347.

Suzuki, Tetsuaki, "Development of Halogen/Antimony Free Multilayer PWB Materials for Notebook PC (Halogen-Free FR-4 and Halogen-Free RSC)," Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 281-286.

Suzuki, Tetsuaki, "Trend of Halogen Free Printed Wiring Board Materials," Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 11-15, 2001, pp. 1026-1031.

Suzuki, Tomoyuki, Matsumoto, Tetsuo, Shiramatsu, Eiji, Ooya, Shingo, Kawasaki, Osamu, Hisatsune, Toyokazu, Maeda, Yoshihiro, and Iwasaki, Kunio, "Development of Environment-Friendly Cable "Eco-Ace"," Furukawa Review, no. 19, pp. 85-90, Apr. 2000.

Suzuki, Yasuhiro, Kayashima, Yuuji, Maeda, Takehiko, Matsuura, Yoshihiro, Sekiguchi, Tomohisa, and Watanabe, Akio, "Development of thin Flip-Chip BGA for Package on Package," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 8-14.

Svasta, P., Ionescu, C., Codreanu, N. D., and Bonfert, D., "Investigation of Solder Joints by Thermographical Analysis," European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Svasta, Paul, Plotog, Ioan, Cucu, Traian, Vasile, Alexandru, and Marin, Alexandru, "4 P Soldering Model for Solder Joints Quality Assessment," 32nd International Spring Seminar on Electronics Technology, Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.

Svasta, Paul M., Plotog, Ioan, Codreanu, Norocel D., Vasile, Alexandru, Varzaru, Gaudentiu, and Marin, Alexandru, "Printed Circuit Boards with Different Material Core Assembling Quality Analysis Based on 4 P Soldering Model," 32nd International Spring Seminar on Electronics Technology, Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.

Svasta, Paul, and Simion-Zanescu, Daniel, "Thermal Limits in Reflow Soldering Process," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1839-1842.

Svecova, O., Kosina, P., Sandera, J., and Szendiuch, I., "Reliability Model for Assessment of Lifetime of Lead-Free Solder Joints," 2011 18th European Microelectronics and Packaging Conference, Brighton, United Kingdom, Sept. 12-15, 2011, pp. xx-xx.

Svecova, Olga, Kosina, Petr, Sandera, Josef, and Adamek, Martin, "Committing of Electronic Modules by Ball Pins and Their Reliability," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 259-262.

Svecova, Olga, and Sandera, Josef, "Environment-friendly LF Solder SAC 305 and Its Reliability," 32nd International Spring Seminar on Electronics Technology, Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.

Svecova, Olga, Nicak, Michal, Kosina, Petr, and Sandera, Josef, "Recent Advance in Solder Ball Interconnections Reliability Examination," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 253-257.

Svensson, Britt-Marie, Martensson, Lennart, Mathiasson, Lennart, and Eskilsson, Linda, "Leachability testing of metallic wastes," Waste Management and Research , vol. 23 no. 5, pp. 457-467, Oct. 2005.

Svoboda, Thomas, "Meeting the Restricted Substance Compliance Challenge," 2010 IEEE Symposium on Product Compliance Engineering, Boston, MA, Oct. 18-20, 2010, pp. xx-xx.

Swain, Bhabani S., Swain, Bibhu P., and Hwang, Nong M., "Investigation of optical properties of core-shell silicon nanowires," Materials Chemistry and Physics, vol. 129 no. 3, pp. 733- 739, Oct. 3, 2011.

Swain, Bhabani S., Lee, Sung S., Lee, Sang H., Swain, Bibhu P., and Hwang, Nong M., "Transformation of silicon nanowires to nanocoils by annealing in reducing atmosphere," Journal of Crystal Growth, vol. 327 no. 1, pp. 276-280, July 15, 2011.

Swan, Geoff, Woosley, Alan, Vo, Nick, Koshmieder, Thomas, and Chong, T. S., "Development of Lead-Free Peripheral Leaded and PBGA Components to Meet MSL3 at 260°C Peak Reflow Profile," IPC SMEMA Council APEX 2001, San Diego, CA, Jan. 14-18, 2001, pp. xx-xx.

Swanson, Dale W., Enlow, Leonard R., Stiegler, Daniel E., and Timms, Edward, "Applications and Reliability Evaluation of Solder Replacements in SMT Assembly for Satellite Electronics," Proceedings 1996 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 2920), Minneapolis, MN, Oct. 8-10, 1996, pp. 314-321.

Swanson, Howard E., and Tatge, Eleanor, "Standard X-ray Diffraction Powder Patterns," National Bureau of Standards Circular 539, vol. 1, pp. 24-25, June 15, 1953.

Swanson, Howard E., and Fuyat, Ruth K., "Standard X-ray Diffraction Powder Patterns," National Bureau of Standards Circular 539, vol. 2, pp. 12-13, June 15, 1953.

Swanson, John, "Designated Solderability Preservative," Printed Circuit Design and Fab, vol. 26 no. 4, pp. xx-xx, Apr. 2009.

Swanson, John, and Zhang, Yun, "Lead-free Component Finishes - A Market & Technical Analysis," Plating & Surface Finishing, vol. 89 no. 1, pp. 14-16, Jan. 2002.

Swanson, Tayler J., and Anselm, Martin K., "Properties of Mixing SAC Solder Alloys with Bismuth-Containing Solder Alloys for a Low Reflow Temperature Process," Proceedings of SMTA International , Rosemont, IL, Sept. 22-26, 2019, pp. 149-158.

Sweatman, K., McDonald, S. D., Whitewick, M., Nishimura, T., and Nogita, K., "Grain Refinement for Improved Lead-Free Solder Joint Reliability ," IPC APEX Expo 2013, San Diego, CA, Feb. 17-21, 2013, pp. xx-xx.

Sweatman, K., Nishimura, T., McDonald, S. D., Whitewick, M., and Nogita, K., "Grain Refinement for Improved Lead-Free Solder Joint Reliability," Surface Mount Technology (SMT), vol. 29 no. 1, pp. 30,32-34,36-41, Jan. 2014.

Sweatman, Keith, Watanabe, Daisuke, and Nishimura, Tetsuro, "A Database for the Transition to Lead Free," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Sweatman, Keith, and Nishimura, Tetsuro, "A Eutectic Alloy for Lead-free Soldering," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Sweatman, Keith, Nishimura, Tetsuro, and Komatsu, Teruo, "A Nano Silver Replacement for High Lead Solders in Semiconductor Junctions," 18th Annual Pan Pacific Microelectronics Symposium, Wailea-Makena, HI, Jan. 22-24, 2013, pp. xx-xx.

Sweatman, Keith, Nishimura, Tetsuro, and Komatsu, Teruo, "A Nano Silver Replacement for High Lead Solders in Semiconductor Junctions," SMTAnews & Journal of Surface Mount Technology, vol. 26 no. 2, pp. 21-27, Apr.-June 2013.

Sweatman, Keith, Nishimura, Tetsuro, and Komatsu, Teruo, "A nano silver replacement for high lead solders in semiconductor junctions," Global SMT and Packaging, vol. 13 no. 10, pp. 30-36, Oct. 2013.

Sweatman, Keith, and Nishimura, Tetsuro, "Advances in the Understanding of the Behaviour of the Ni-Modified Sn-Cu Eutectic as a Lead-free Solder," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Sweatman, Keith, Nishimura, Takatoshi, Ng, Wayne, Sato, Michihiro, and Nishimura, Tetsuro, "Alternative Strengthening Mechanisms for Lead-Free Solders," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 293-299.

Sweatman, Keith, "Another chance for Tin-Copper as a Lead-free Solder," TIN World , Apex Special Issue, pp. 4-7, Feb. 2005.

Sweatman, Keith, "Another chance for Tin-Copper as a Lead-free Solder," TIN World , no. 9, pp. 15-17, 2005.

Sweatman, Keith, Belyakov, Sergey A., Nishimura, Tetsuro, and Gourlay, Christopher M., "Behaviour and Strengthening Effects of Sb in a Low-Bi Sn-Cu Solder Alloy," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 291-298.

Sweatman, Keith, Nishimura, Takatoshi, Sugimoto, Kenichiro, and Kita, Akira, "Controlling Voiding Mechanisms in the Reflow Soldering Process," IPC APEX Expo 2016, Las Vegas, NV, Mar. 13-17, 2016, pp. xx-xx.

Sweatman, Keith, Masuda, Junya, Nozu, Takashi, Koshi, Masuo, and Nishimura, Tetsuro, "Corrosion Driven Whisker Growth in SAC305," 2010 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, Koloa, HI, Jan. 26-28, 2010, pp. xx-xx.

Sweatman, Keith, Nishimura, Tetsuro, McDonald, Stuart D., and Nogita, Kazuhiro, "Effect of Cooling Rate on the Intermetallic Layer in Solder Joints," IPC APEX Expo 2012, San Diego, CA, Feb. 28-Mar. 1, 2012, pp. xx-xx.

Sweatman, Keith, Nishimura, Tetsuro, McDonald, Stuart D., and Nogita, Kazuhiro, "Effect of Cooling Rate on the Intermetallic Layer in Solder Joints," Surface Mount Technology (SMT), vol. 27 no. 11, pp. 68-70,72,74,76-77, Nov. 2012.

Sweatman, Keith, Suenaga, Shoichi, Miyaoka, M., Nozu, Takashi, Nogita, Kazuhiro, and Nishimura, Tetsuro, "Effect of Intermetallic Stabilization on the Impact Resistance of Joints to BGA Packages," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 331-335.

Sweatman, Keith, Masuda, Junya, Nozu, Takashi, Koshi, Masuo, and Nishimura, Tetsuro, "Effect of Soldering Method, Temperature, and Humidity on Whisker Growth in the Presence of Flux Residues," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S11_02-1-S11_02-5.

Sweatman, Keith, Akaiwa, Tetsuya, and Nishimura, Tetsuro, "Effect on Creep Rate of Alloying Additions to Ni-Stabilised Sn-Cu Eutectic Solder," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Sweatman, Keith, Mu, Dekui, and Nishimura, Takatoshi, "Enhancing the Impact Properties of Tin-Copper and Tin-Copper-Nickel Lead-Free Solders with Trace Additions of Zinc, Indium and Gold," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 707-711.

Sweatman, Keith, Suenaga, Shoichi, Yoshimura, Masaaki, Nishimura, Tetsuro, and Ikeda, Masahiko, "Erosion of Copper and Stainless Steels by Lead-free-Solders," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S27-4-1-S27-4-7.

Sweatman, Keith, "Fact and fiction in lead-free soldering," Global SMT & Packaging, vol. 6 no. 4, pp. 26-28, 30-31, Apr. 2006.

Sweatman, Keith, "Hot Air Solder Leveling in the Lead-free Era," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Sweatman, Keith, "Hot air solder leveling in the lead-free era," Global SMT and Packaging , vol. 9 no. 4, pp. 10-14,16,18, Apr. 2009.

Sweatman, Keith, "Hot air solder leveling in the lead free era," EMasia, Sept. 2009.

Sweatman, Keith, and Nishimura, Tetsuro, "Important properties of lead free solders," EMasia, May 1, 2008.

Sweatman, Keith, Howell, Keith, Coyle, Richard, Parker, Richard, Henshall, Gregory, Smetana, Joseph, Benedetto, Elizabeth, Lui, Weiping, Pandher, Ranjit S., Daily, Derek, Currie, Mark, Nguyen, Jennifer, Lee, Tae-Kyu, Osterman, Michael, Miremadi, Jian, Allen, Aileen, Arnold, Joelle, Moore, Donald, and Chang, Graver, "iNEMI Pb-Free Alloy Characterization Project Report: Part III - Thermal Fatigue Results for Low-Ag Alloys," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 359-375.

Sweatman, Keith, Coyle, Richard, Parker, Richard, Howell, Keith, Benedetto, Elizabeth, Smetana, Joseph, Allen, Aileen, Lui, Weiping, and Silk, Julie, "iNEMI Pb-Free Alloy Characterization Project Report: Part VII - Thermal Fatigue Results for Low-Ag Alloys," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 561-574.

Sweatman, Keith, Suenaga, Shoichi, and Nishimura, Tetsuro, "Intermetallic Growth in Lead-Free Solders on PCB Substrates," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 544-547.

Sweatman, Keith, Nishimura, Tetsuro, Jonathan, , and Nogita, Kazuhiro, "Microalloy additions and the morphology and growth of interfacial intermetallic in low-Ag and no-Ag Pb-free solders," Global SMT and Packaging, vol. 11 no. 12, pp. 16-18,20-21, Dec. 2011.

Sweatman, Keith, Miyaoka, Motanori, Nishimura, Takatoshi, Tran, Xuan Quy, McDonald, Stuart, and Nogita, Kazuhiro, "Modified Hypereutectic Sn-Cu-Pb-free Solder for Power Semiconductor Die Attach," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 349-356.

Sweatman, Keith, "Nihon Superior SN100CV - Reliability in Simplicity," Global SMT and Packaging, vol. 20 no. 3, pp. 12-14, Mar. 2020.

Sweatman, Keith, Nishimura, Tetsuro, Akaiwa, Tetsuya, and Naraynanan, Pavithiran, "Optimizing Solder Alloy Composition for Low Temperature Assembly," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 175-182.

Sweatman, Keith, Nozu, Takashi, and Nishimura, Tetsuro, "Optimizing Solder Paste for Void Minimization with Vacuum Reflow," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 903-910.

Sweatman, Keith, Nozu, Takashi, and Nishimura, Tetsuro, "Optimizing Solder Paste for Void Minimization With Vacuum Reflow," South East Asia Technical Training Conference on Electronics Assembly Technologies 2013 Proceedings, Penang, Malaysia, Apr. 17-19, 2013, pp. xx-xx.

Sweatman, Keith, and Nishimura, Tetsuro, "Properties that are Important in Lead-Free Solders," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S18:01.

Sweatman, Keith, Miyaoka, Motonori, Seki, Sonoko, Suenaga, Shoichi, and Nishimura, Tetsuro, "Relationship Between the Impact Strength and Microstructure of Lead-Free Solders," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Sweatman, Keith, Nishimura, Takatoshi, and Nishimura, Tetsuro, "Semiconductor Die Attach with High Copper Solder Alloys," 2014 Pan Pacific Microelectronics Symposium, Kohala Coast, HI, Feb. 11-13, 2014, pp. xx-xx.

Sweatman, Keith, and Nishimura, Tetsuro, "Solidification Behaviour of Lead-Free Alloys and its Relationship to their Performance as Practical Solders," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 188-193.

Sweatman, Keith, Suenaga, Shoichi, and Nishimura, Tetsuro, "Strength of lead-free bga spheres in high speed loading," Global SMT and Packaging, vol. 8 no. 1, pp. 10-15, Jan. 2008.

Sweatman, Keith, Suenaga, Shoichi, and Nishimura, Tetsuro, "Strength of Lead-Free BGA Spheres in High Speed Loading," 2008 Pan Pacific Microelectronics Symposium & Exhibit, Kauai, HI, Jan. 22-24, 2008, pp. xx-xx.

Sweatman, Keith, Suenaga, Shoichi, and Nishimura, Tetsuro, "Suppression of Tin Pest in Lead-free Solders," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies , San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Sweatman, Keith, Nozu, Takashi, and Nishimura, Tetsuro, "The Development of an Improved Tin-Zinc Solder," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 607-612.

Sweatman, Keith, Read, Jonathan, Nishimura, Tetsuro, and Nogita, Kazuhiro, "The Effect of Microalloy Additions on the Morphology and Growth of Interfacial Intermetallic in Low-Ag and No-Ag Pb-Free Solders," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 703-708.

Sweatman, Keith, Suenaga, Shoichi, Koshi, Masuo, and Nishimura, Tetsuro, "The Effect of Variations in the Silver Level and Microalloying on the Impact Strength of Tin-Silver-Copper BGA Spheres," Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb. 10-12, 2009, pp. 257-263.

Sweatman, Keith, Nishimura, Takatoshi, and Fukami, Takuro, "The Effects of Phosphorus in Lead-Free Solders," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 314-320.

Sweatman, Keith, and Nishimura, Tetsuro, "The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead-free Solder," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S14-02-1-S14-02-6.

Sweatman, Keith, Nishimura, Tetsuro, and Nogita, Kazuhiro, "The Stability of Cu6Sn5 in the Formation and Performance of Lead-Free Solder Joints," 2012 Pan Pacific Microelectronics Symposium, Kauai, HI, Feb. 14-16, 2012, pp. xx-xx.

Sweatman, Keith, Nishimura, Tetsuro, and Nogita, Kazuhiro, "The Stability of Cu6Sn5 in the Formation and Performance of Lead-free Solder Joints," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 16-18, 2012, pp. xx-xx.

Sweatman, Keith, Nishimura, Tetsuro, and Nogita, Kazuhiro, "The Stability of Cu6Sn5 in the Formation and Performance of Lead-Free Solder Joints," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 83-87.

Sweatman, Keith, Nogita, Kazuhiro, Tsukamoto, Hideaki, and Nishimura, Tetsuro, "The Stability Window and Mechanical Properties of the Interfacial Intermetallic in Lead-Free Solder Joints," 2011 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, Kamuela, HI, Jan. 18-20, 2011, pp. xx-xx.

Sweeney, Donald L., "How the New RoHS 2 Directive affects you and your company," DLS News & Views, vol. 17, pp. 3-4, Fall 2012.

Sweeney, Emilia L., and Ferguson, Michael L., "Managing the RoHS Risk," Advanced Packaging.

Swenson, D., "The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 39-54, Mar. 2007.

Sy, H. G., Arulvanan, P., and Collier, P. A., "Rework and Reliability of QFP and BGA Lead-free Assemblies," Proceedings of 4th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2002, pp. 194-199.

Sy, Hansen Garcia, Hsu, Jackson, and Jimarez, Miguel, "New Robust Process Improvement for BGA Solder Ball Attach First Pass Yield," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 797-804.

Sycheva, Anna, Radanyi, Adam and Gacsi, Zoltan, "Studying Pressure Induced Whiskers Formation from Sn-rich Surfaces," Materials Science Forum, vol. 790-791, pp. 271-276, May 2014.

Syed, Ahmer, "Accumulated Creep Strain and Energy Density Based Thermal Fatigue Life Prediction Models for SnAgCu Solder Joints", 54th Electronic Components & Technology Conference, Las Vegas, NV, June 1-4, 2004, pp. 737-746.

Syed, Ahmer, Tee, Tong Yan, Ng, Hun Shen, Anderson, Rex, Khoo, Choong Peng, and Rogers, Boyd, "Advanced analysis on board trace reliability of WLCSP under drop impact," Microelectronics Reliability, vol. xx no. x, pp. xx-xx, xxxx.

Syed, Ahmer, Kim, Tae Seong, Cho, Young Min, Kim, Chang Woo, and Yoo, Min, "Alloying Effect of Ni, Co, and Sb in SAC solder for Improved Drop Performance of Chip Scale Packages with Cu OSP Pad Finish," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 404-411.

Syed, Ahmer, Kim, TaeSeong, and Cha, SeWoong, "Alternate Solder Balls for Improving Drop/Shock Reliability," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 390-386.

Syed, Ahmer, Kim, TaeSeong, and Cha, Se Woong, "Alternate Solder Balls for Improving Drop/Shock Reliability," SMTAnews & Journal of Surface Mount Technology, vol. 21 no. 3, pp. 13-19, July-Sept. 2008.

Syed, Ahmer, Kang, Won-Joon, Kim, Tae-Seong, and Cannis, Jeff, "Board Level Reliability of QFP and QFN Type Packages with Matte Sn Lead Finish," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 325-329.

Syed, Ahmer, Kim, SeokBong, and Lin, Wei, "Building Accuracies in Finite Element Models for Life Prediction of Solder Joints," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 184-191.

Syed, Ahmer, Dhandapani, Karthikeyan, Moody, Robert, Nicholls, Lou, and Kelly, Mike, "Cu Pillar and u-bump Electromigration Reliability and Comparison with High Pb, SnPb, and SnAg bumps," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 332-339.

Syed, Ahmer, "Damage Mechanism Based Acceleration Factor Model for Pb-Free Solder," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 655-664.

Syed, Ahmer, Kim, Tae-Seong, Cha, Se-Woong, Scanlon, Joan, and Ryu, Chang-Gyun, "Effect of Pb free Alloy Composition on Drop/Impact Reliability of 0.4, 0.5 & 0.8mm Pitch Chip Scale Packages with NiAu Pad Finish," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 951-956.

Syed, Ahmer, Sharon, Gil, and Darveaux, Robert, "Factors Affecting Pb-free Flip Chip Bump Reliability Modeling for Life Prediction," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 1715-1725.

Syed, Ahmer, Scanlan, Joan, Cha, SeWoong, Kang, WonJoon, Sohn, EunSook, Kim, TaeSeong, and Ryu, ChangGyun, "Impact of Package Design and Materials on Reliability for Temperature Cycling, Bend, and Drop Loading Conditions," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1453-1461.

Syed, Ahmer, "Limitations of Norris-Landzberg Equation and Application of Damage Accumulation Based Methodology for Estimating Acceleration Factors for Pb Free Solders," 2010 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, Bordeaux, France, Apr. 26-28, 2010, pp. xx-xx.

Syed, Ahmer, Lin, Wei, Sohn, Eun-Sook, and Cha, Se-Woong, "Plastic Deformation and Life Prediction of Solder Joints for Mechanical Shock and Drop/Impact Loading Conditions," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 507-514.

Syed, Ahmer, "Predicting Solder Joint Reliability for Thermal, Power, & Bend Cycle within 25% Accuracy," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 255-263.

Syed, Ahmer, "Reliability and Au Embrittlement of Lead Free Solders for BGA Applications," Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, Braselton, GA, Mar. 11-14, 2001, pp. 143-147.

Syed, Ahmer, "Reliability of Lead-Free Solder Connections for Area-Array Packages," IPC SMEMA Council APEX 2001, San Diego, CA, Jan. 14-18, 2001, pp. LF2-7-1 to LF2-7-9.

Syed, Ahmer, "Surface Mount Guidelines for Pb free Solder Assemblies," Amkor Technology, Mar. 2004.

Syed, Ahmer, "Updated Solder Fatigue Life Prediction Models for SnAgCu Solder Joints," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 939-945.

Syed-Khaja, A., and Franke, J., "Investigations on Advanced Soldering Mechanisms for Transient Liquid Phase Soldering (TLPS) in Power Electronics," 2014 Electronics System-Integration Technology Conference, Helsinki, Finland, Sept. 16-18, 2014, pp. xx-xx.

Sykes, Bob, "Lead-free BGA reliability: high-speed bondtesting and brittle fracture detection," Global SMT and Packaging, vol. 5 no. 9, pp. 20, 22-23, Oct. 2005.

Sykes, Bob, "Testing for BGA Resistance to Brittle Fracture," Advanced Packaging , vol. 14 no. 7, pp. 38-41, July 2005.

Sylvestre, Julien, and Blander, Alexandre, "Large-Scale Correlations in the Orientation of Grains in Lead-Free Solder Joints," Journal of Electronic Materials, vol. 37 no. 10, pp. 1618-1623, Oct. 2008.

Sylvestre, Julien, Blander, Alexandre, Oberson, Valerie, Perfecto, Eric, and Srivastava, Kamalesh, "The Impact of Process Parameters on the Fracture of Device Structures During Chip Joining on Organic Laminates," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 82-88.

Sylvia, Somaia Sarwat, Park, Hong-Hyun, Khayer, M. Abul, Alam, Khairul, Klimeck, Gerhard, and Lake, Roger K., "Material Selection for Minimizing Direct Tunneling in Nanowire Transistors," IEEE Transactions on Electron Devices, vol. 59 no. 8, pp. 2064-2069, Aug. 2012.

Symons, Joanna, "RoHS compliance testing," EuroAsia Semiconductor, vol. xx no. xx, pp. xx-xx, Aug. 2006.

Synkiewicz, Beata Kinga, Skwarek, Agata, and Witek, Krzysztof, "Voids investigation in solder joints performed with vapour phase soldering (VPS)," Soldering & Surface Mount Technology, vol. 26 no. 1, pp. 8-11, 2014.

Synnott, Vincent, "RoHS/Lead Free," SMART Ireland Lead-Free Materials + Legislation Seminar, Dublin, Ireland, Sept. 23, 2004.

Sypien, Anna, Piatkowski, Andrzej, and Zieba, Pawel, "Microstructure evolution and mechanical properties of the Ni/Ni soldered joints," Solid State Phenomena, vol. 172-174, pp. 863-868, June 2011.

Sytsma, Steve, and Wrightson, Mark, "Lead-Free Solder Durability Testing at Accelerated Thermal Excursions for QFN and DFN Package Interconnects," 2007 Pan Pacific Microelectronics Symposium & Exhibit, Maui, HI, Jan. 30-Feb. 1, 2007, pp. xx-xx.

Syu, Hong-Jhang, Hung, Yung-Jr, Shiu, Shu-Chia, Lee, San-Liang, and Lin, Ching-Fuh, "Highly Ordered Silicon Nanowire Arrays on Heterojunction Solar Cells ," 2012 38th IEEE Photovoltaic Specialists Conference, Austin, TX, June 3-8, 2012, pp. 1926-1928.

Szabo, Judy, "RoHS audits prove due diligence," Green SupplyLine, Mar. 9, 2007.

Szaruga, Steve L., and Anderl, Tim, "Nonchromated Treatment for Aluminum Surfaces," Air Force Research Laboratory Technology Horizons, vol. 7 no. 5, pp. 38-38, Oct. 2006.

Szendiuch, Ivan, Vasko, Cyril, and Cejtchaml, Pavel, "Lead-free Solder Quality Investigation," 29th International Spring Seminar on Electronics Technology, St. Marienthal, Germany, May 10-14, 2006, pp. 215-218.

Szendiuch, Ivan, Jankovsky, Jaroslav, Bursik, Martin, and Hejatkova, Edita, "New Facts from Lead-free Solders Reliability Investigation," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Szendiuch, Ivan, "Roadmap of Lead-free Soldering," 30th International Spring Seminar on Electronics Technology, Cluj-Napoca, Romania, May 9-13, 2007, pp. 527-534.

Szendiuch, Ivan, Stary, Jiri, Sandera, Josef, Bursik, Martin, and Hejatkova, Edita, "Some Facts from Lead-free Solders Reliability Investigation," European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Szocinski, Michal, "AFM-assisted investigation of conformal coatings in electronics," Anti-Corrosion Methods and Materials, vol. 63 no. 4, pp. 289-294, 2016.

Szurdan, Szabolcs, Medgyes, Balint, Mende, Tamas, Beranyi, Richard, Gal, Laszla, and Harsanyi, Gabor, "Reliability Tests on SAC-xMn Solder Alloys," 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging, Cluj Napoca, Romania, Oct. 23-26, 2019, pp. 34-37.

Szurgot, M., and Karniewicz, J., "Microscopic Observations on As-Grown Surfaces of ZnTe Crystals," Journal of Crystal Growth, vol. 52 pt. 1, pp. 53-59, Apr. 1981.

Szymanowski, R. A., Casati, D., Saglia, E., Lotosky, P., Howell, K., and Hueste, G., "Dynamics in Pb-Free Wave Soldering," Circuits Assembly, vol. 17 no. 2, pp. 76-80, 82-83, Feb. 2006.

Szwech, M., Niedzwiedz, W., and Drozd, Z., "Infant Mortality Failures of Lead - Free Solder Joints," 32nd International Spring Seminar on Electronics Technology, Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.

Szwech, M., and Drozd, Z., "Life-Time of Lead-free Soldered SMT Joints," 31st International Spring Seminar on Electronics Technology, Budapest, Hungary, May 7-11, 2008, pp. 17-21.

Szweda, Roy, "RoHS draws near," III-Vs Review, vol. 19 no. 4, pp. 2, May 2006.

TTTT

Tabatabaei, Salomeh, Kumar, Ashavani, Ardebili, Haleh, Loos, Peter J., and Ajayan, Pulickel M., "Synthesis of Au-Sn alloy nanoparticles for lead-free electronics with unique combination of low and high melting temperatures," Microelectronics Reliability, vol. 52 no. 11, pp. 2685-2689, Nov. 2012.

Taber, H. F., Shadley, J. R., Rybicki, E. F., Megat, I., Emery, W. A., Nuse, J. D., Somerville, D. A., and Kruecke, T. L., "Comparison of Wear Rates for Chrome Plating & Six Tungsten Carbide Coatings Tested Against Aircraft Bearing Materials & Coatings," 1999 Aerospace/Airline Plating & Metal Finishing Forum, Jacksonville, FL, Apr. 20-22, 1999, pp. 55-66.

Tada, Kazuhiro, Sato, Mitsura, Fujioka, Hirofumi, and Kanegae, Hirozoh, "Generation Mechanism of Initial Delamination of Pop Corn Phenonema of SMDs," Proceedings 1995 International Symposium on Microelectronics, Los Angeles, CA, Oct. 24-26, 1995, pp. 18-23.

Tada, Naoya, Tanaka, Takuhiro, Tabata, Hirotsugu, Uemori, Takeshi, and Nakata, Toshiya, "Evaluation of Bonding Strength of Thin Copper Wire and Lead-Free Solder by Pullout Tests," 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 26-28, 2016, pp. 164-167.

Tada, Naoya, and Andou, Takahiro, "Evaluation of Interface Crack between Solder Ball and Copper Based on the Non-Destructive Monitoring of Direct Current Potential Difference," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Tada, Naoya, and Masago, Hiroyasu, "Evaluation of Tensile Strength of Copper-Cored Lead-Free Solder Joints in Air, Distilled Water, and NaCl Solution Using Testing Device with Permanent Magnets," 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 22-24, 2014, pp. 92-95.

Tada, Naoya, and Ezaki, Yusuke, "Monitoring of Interface Crack between Solder Ball and Copper Plate Subjected to Cyclic Tensile Loading under Fluctuating Temperature by Direct Current Potential Difference Method," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 232-235.

Tada, Naoya, and Masago, Hiroyasu, "Remotely-Controlled Tensile Test of Copper-Cored Lead-Free Solder Joint in Liquid Using Permanent Magnet," 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 22-25, 2013, pp. 186-189.

Tada, Naoya, Nishihara, Ryo, and Masago, Hiroyasu, "Tensile Test of Small Lead-Free Solder Joint Using Permanent Magnet," 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 24-26, 2012, pp. 145-148.

Tada, Naoya, and Uemori, Takeshi, "Time-Dependent Fracture of Copper-Cored Lead-Free Solder Ball and Nickel Rod Joints in Air, Distilled Water, and NaCl Solution," 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 25-27, 2017, pp. 168-171.

Tadauchi, Masahiro, Komatsu, Izuru, Tateishi, Hiroshi, and Teshima, Kouichi, "Sn-Zn Eutectic Alloy Soldering in a Low Oxygen Atmosphere," Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 11-15, 2001, pp. 1055-1058.

Taguchi, O., Lee, C. G., Park, D. Y., Shin, G. S., Suzuki, S., and Nakamura, R., "Reaction Diffusion in Pb Free Solder-Cu System," Defect and Diffusion Forum, vol. 297-301, pp. 796-801, 2010.

Taguchi, Toshihiko, Kato, Rikiya, Akita, Satoru, Okuno, Atsushi, Suzuki, Hiro, and Okuno, Tetsuya, "Lead Free Interfacial Structures and Their Relationship to Au Plating (Including Accelerated Thermal Cycle Testing of Non-Leaden BGA Spheres)," 2001 Proceedings 51st Electronic Components & Technology Conference , Orlando, FL, May 29-June 1, 2001, pp. 675-680.

Tahm, V. T., "The performance of hard chrome plating," Finishing, vol. 7 no. 5, pp. 33-35, May 1983.

Tahrim, Aqilah A., Ahmad, Anita, and Ali, Mohamed Sultan Mohamed, "Silicon Nanowire Arrays Thermoelectric Power Harvester," 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, Las Vegas, NV, Jan. 22-26, 2017, pp. 728-731.

Tai, F., Guo, F., Han, M. T., Xia, Z. D., Lei, Y. P., and Shi, Y. W., "Creep and thermomechanical fatigue properties of in situ Cu6Sn5 reinforced lead-free composite solder," Materials Science and Engineering: A , vol. 527 no. 15 pp. 3335-3342, June 15, 2010.

Tai, F., Guo, F., Xia, Z. D., Lei, Y. P., and Shi, Y. W., "Effects of nano-structured particles on microstructure and microhardness of Sn-Ag solder alloy," Journal of Materials Science: Materials in Electronics, vol. 21 no. 7, pp. 702-707, July 2010.

Tai, F., Guo, F., Liu, B., Xia, Z. D., and Shi, Y. W., "Effects of Service Parameters on Thermomechanical Fatigue Behaviors of New Nano Composite Solder Joints," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 753-758.

Tai, F. C., and Duh, J. G., "Interfacial Toughness Evaluation of SAC305 Solder Bump with Pendulum Impact Test," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 541-544.

Tai, F., Guo, F., Xia, Z. D., Lei, Y. P., Yan, Y. F., Liu, J. P., and Shi, Y. W., "Processing and Creep Properties of Sn-Cu Composite Solders with Small Amounts of Nanosized Ag Reinforcement Additions," Journal of Electronic Materials, vol. 34 no. 11, pp. 1357-1362, Nov. 2005.

Tai, Feng, Guo, Fu, Liu, Jianping, Xia, Zhidong, Shi, Yaowu, Lei, Yongping, and Li, Xiaoyan, "Creep properties of Sn-0.7Cu composite solder joints reinforced with nano-sized Ag particles," Soldering & Surface Mount Technology , vol. 22 no. 4, pp. 50-56, 2010.

Tai, Li-Jung, Tsai, Iting, and Wu, Enboa, "Mechanical Properties of Ni3Sn4 and Cu3Sn Determined by Inverse Method," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 2, pp. 503-508, June 2008.

Takada, Akio, Sakane, Masao, and Tsukada, Yutaka, "Creep and Creep Rupture Properties of Sn-8Zn-3Bi Solder," Journal of the Society of Materials Science, vol. 56 no. 2, pp. 129-135, Feb. 2007.

Takada, Koji, "An Alternative to Hard Chrome Plating," SAE 1991 Transactions Journal of Aerospace, section 1, vol. 100, part 1, 910924, pp. 24-27.

Takagi, Kanji, Yu, Qiang, Shibutani, Tadahiro, and Miyauchi, Hiroki, "Reflow Process Simulation for Dispersion Evaluation of Solder Joint Shape on Chip Component," Proceedings of the ASME 2009 InterPack Conference, Volume 2, San Francisco, CA, July 19-23, 2009, pp. 1-7.

Takagi, Kanji, Yu, Qiang, Shibutani, Tadahiro, Miyauch, Hiroki, Shiratori, Masaki, and Noro, Yukihiro, "Study of Thermal Fatigue Life Caused by Dispersion of Solder Joint," 11th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 28-31, 2008, pp. 883-888.

Takagi, Kanji, Wakabayashi, Masaki, Inoue, Junichi, Yu, Qiang, and Akutsu, Takahiro, "Study on High Reliability of Lead-Free Solder Joint on Metal Substrate," Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, Volume 1, Portland, OR, July 6-8, 2011, pp. 143-148.

Takagi, Kiyoshi, "Recent Surface Treatment Technologies for Printed Wiring Boards," Journal of the Surface Finishing Society of Japan, vol. 59 no. 9, pp. 570-578, 2008.

Takahara, Wataru, "Considerations on selection of alloying elements for designing Sn-based solder alloys by the molecular orbital method," 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Nagasaki, Japan, Apr. 17-21, 2018, pp. 91-93.

Takahashi, Dean, "Lead-free journey," Electronics Supply & Manufacturing, Oct. 2005.

Takahashi, Dean, "Lead-free journey," Green SupplyLine, Oct. 1, 2005.

Takahashi, Takehiko, Shohji, Ikuo, Hioki, Susumu, and Kamiya, Osamu, "An Evaluation of Fatigue Damage in Low-Cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part C, San Francisco, CA, July 17-22, 2005, pp. 1811-1817.

Takahashi, Takehiko, Hioki, Susumu, Shohji, Ikuo, and Kamiya, Osamu, "An Evaluation of Low-Cycle Fatigue Property for Sn-3.5Ag and Sn-0.7Cu Lead-free Solders Using Surface Deformation," Key Engineering Materials , vol. 326-328, pp. 1035-1038, Dec. 2006.

Takahashi, Takehiko, Hioki, Susumu, Shohji, Ikuo, and Kamiya, Osamu, "Fatigue Damage Evaluation by Surface Feature for Sn-3.5Ag and Sn-0.7Cu Solders," Materials Transactions, vol. 46 no. 11, pp. 2335-2343, 2005.

Takahashi, Takehiko, Hioki, Susumu, Shohji, Ikuo, and Kamiya, Osamu, "Low Cycle Fatigue Behavior and Surface Feature by Image Processing of Sn-0.7Cu Lead-Free Solder," Key Engineering Materials, vol. 306-308, pp. 115-120, Mar. 2006.

Takahashi, Takehiko, Hioki, Susumu, Shohji, Ikuo, and Kamiya, Osamu, "Low-Cycle Fatigue Life Definition for Sn-3.5Ag and Sn-0.7Cu Lead-free Solders Using Surface Deformation," Quarterly Journal of the Japan Welding Society/ Yosetsu Gakkai Ronbunshu, vol. 24 no. 3, pp. 253-258, 2006.

Takahashi, Takehiko, Hioki, Susumu, Shohji, Ikuo, and Kamiya, Osamu, "Low Cycle Fatigue Properties and Surface Feature by an Image Processing of Sn-0.7Cu Lead-free Solder," Quarterly Journal of the Japan Welding Society/ Yosetsu Gakkai Ronbunshu, vol. 23 no. 3, pp. 436-441, 2005.

Takahashi, Takehiko, Hioki, Susumu, Shohji, Ikuo, and Kamiya, Osamu, "Low cycle Fatigue behavior and Surface Feature by Image Processing of Sn-0.7Cu Lead-free Solder," Key Engineering Materials, vol. 306-308, pp. 115-120, 2006.

Takahashi, Tetsuya, Abdulkadhim, Ahmed, Music, Denis, and Schneider, Jochen M., "Spontaneous Formation of In-Whiskers on YIn3Thin Films Deposited by Combinatorial Magnetron Sputtering," IEEE Transactions on Nanotechnology , vol. 10 no. 5, pp. 1202-1208, Sept. 2011.

Takahashi, Tomohiro, and Yu, Qiang, "Precision Evaluation for Thermal Fatigue Life of Power Module using Coupled Electrical-Thermal-Mechanical Analysis," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 201-205.

Takahashi, Toshihide, Komatsu, Shuichi, Nishikawa, Hiroshi, and Takemoto, Tadashi, "High-Temperature Resistant Intermetallic Compound Joints for Si Chips and Cu Substrates," Journal of Electronic Materials, vol. 39 no. 10, pp. 2274-2280, Oct. 2010.

Takahashi, Toshihide, Komatsu, Shuichi, Nishikawa, Hiroshi, and Takemoto, Tadashi, "Improvement of High-Temperature Performance of Zn-Sn Solder Joint," Journal of Electronic Materials, vol. 39 no. 8, pp. 1241-1247, Aug. 2010.

Takahashi, Toshihide, Komatsu, Shuichi, Nishikawa, Hiroshi, and Takemoto, Tadashi, "Thin film joining for high-temperature performance of power semi-conductor devices," Microelectronics Reliability, vol. 50 no. 2, pp. 220-227, Feb. 2010.

Takahashi, Yasuo, and Asakura, Yoshihiro, "Characteristics Extraction of Pb Free Solder Fillet Profile for External Feature Inspection, IEEE Transactions on Electronics Packaging Manufacturing, vol. 24 no. 4, pp. 313-322, Oct. 2001.

Takahashi, Yuki, and Shohji, Ikuo, "Mechanical Properties of Low-silver Sn-1.0Ag-0.7Cu-1.6Bi-0.2In Solder," 2014 IEEE 16th Electronics Packaging Technology Conference, Singapore, Dec. 3-5, 2014, pp. 784-787.

Takaku, Yoshikazu, Ohnuma, Ikuo, Kainuma, Ryosuke, Yamada, Yasushi, Yagi, Yuji, Nishibe, Yuji, and Ishida, Kiyohito, "Development of Bi-Base High-Temperature Pb-Free Solders with Second-Phase Dispersion: Thermodynamic Calculation, Microstructure, and Interfacial Reaction," Journal of Electronic Materials, vol. 35 no. 11, pp. 1926-1932, Nov. 2006.

Takaku, Yoshikazu, Liu, Xing Jun, Ohnuma, Ikuo, Kainuma, Ryosuke, and Ishida, Kiyohito, "Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate," Materials Transactions, vol. 45 no. 3, pp. 646-651, Mar. 2004.

Takaku, Yoshikazu, Felicia, Lazuardi, Ohnuma, Ikuo, Kainuma, Ryosuke, and Ishida, Kiyohito, "Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders," Journal of Electronic Materials, vol. 37 no. 3, pp. 314-323, Mar. 2008.

Takaku, Yoshikazu, Makino, Komei, Watanabe, Keita, Ohnuma, Ikuo, Kainuma, Ryosuke, Yamada, Yasushi, Yagi, Yuji, Nakagawa, Ikuo, Atsumi, Takashi, and Ishida, Kiyohito, "Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate," Journal of Electronic Materials, vol. 38 no. 1, pp. 54-60, Jan. 2009.

Takamatsu, Yoshiko, Esaka, Hisao, and Shinozuka, Kei, "Formation Mechanism of Eutectic Cu6Sn5 and Ag3Sn after Growth of Primary b-Sn in Sn-Ag-Cu Alloy," Materials Transactions, vol. 52 no. 2, pp. 189-195, 2011.

Takamatsu, Yoshiko, Esaka, Hisao, and Shinozuka, Kei, "Formation of Primary Intermetallic Compounds in Sn-Ag-Cu Alloys," Materials Science Forum, vol. 654-656, pp. 1397-1399, 2010.

Takamatsu, Yoshiko, Esaka, Hisao, and Shinozuka, Kei, "Liquid-Phase Separation in the Interdendritic Region After Growth of Primary b-Sn in Undercooled Sn-2.8Ag-0.3Cu Melt," Journal of Electronic Materials, vol. 41 no. 8, pp. 2035-2044, Aug. 2012.

Takamatsu, Yoshiko, Esaka, Hisao, and Shinozuka, Kei, "Volume Fraction of b-Sn Formed in Sn-X (X=Cu, Ag and Ni) Eutectic and Hyper-Eutectic Alloys," Journal of the Japan Institute of Metals, vol. 74 no. 9, pp. 551-558, 2010.

Takamizawa, Masao, Naka, Toshihide, Hino, Makoto, Murakami, Koji, Mitooka, Yutaka, and Nakai, Kiyomichi, "Effect of Lead Co-Deposition on the Whisker Growth on Electrodeposited Tin Film," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 72 no. 3, pp. 229-235, Mar. 2008.

Takano, Tadashi, Wang, Renyi, Kuder, Richard, Lam, Shirley, Kuriyama, Kenji, Seki, Kazumitsu, Yoshie, Takashi, Sakai, Ayako, Emmerson, Gordon T., and Seeley, Gordon J., "Lead-Free TQFP Package Achieved JEDEC level 1/260°C by Specific Combination of Die Attach Adhesive and Leadframe," 54th Electronic Components & Technology Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1354-1359.

Takao, H., and Hasegawa, H., "Influence of Alloy Composition on Fillet-lifting Phenomenon in Sn-Ag-Bi Alloys," Journal of Electronic Materials, vol. 30 no. 9, pp. 1060-1067, Sept. 2001.

Takao, H., and Hasegawa, H., "Influence of Alloy Composition on Fillet-Lifting Phenomenon in Tin Binary Alloys," Journal of Electronic Materials, vol. 30 no. 5, pp. 513-520, May 2001.

Takao, Hisaaki, and Hasegawa, Hideo, "Effect of Au Coating on the Wettability of Cu Substrate by Sn-Ag Eutectic Solder," Journal of Japan Institute of Metals, vol. no. , pp. , .

Takao, Hisaaki, and Hasegawa, Hideo, "Influence of Noble Metal Coating on Wettability of Copper Substrate by Sn-Ag Eutectic Solder," Materials Transactions, vol. 45 no. 3, pp. 747-753, Mar. 2004.

Takao, Hisaaki, Yamada, Akira, and Hasegawa, Hideo, "Mechanical Properties and Solder Joint Reliability of Low-Melting SN-Bi-Cu Lead Free Solder Alloy," R&D Review of Toyota CRDL, vol. 39 no. 2, pp. 49-56, June 2004.

Takatsuija, Hiroshi, Tsujimoto, Katsuhiro, and K. Kuroda,, and Saka, H., "Relationship of grain nanostructure and orientation in whisker growth on aluminum thin films on glass substrates," Thin Solid Films, vol. 343-344, pp. 461-464, Apr. 1999.

Takatsuji, H., Colgan, E. G., Cabral Jr., C., and Harper, J. M. E., "Evaluation of Al(Nd)-alloy films for application to thin-film-transistor liquid crystal displays," IBM Journal of Research and Development , vol. xx no. xx, pp. xx-xx, May-July 1998.

Takaya, M., Matsunaga, M., and Otaka, T., "Hardness of Deposits from Trivalent Chromium Sulfate/Potassium Formate Baths," Plating and Surface Finishing, vol. 74 no. 6, pp. 90-92, June 1987.

Takayama, Shinji, and Tsutsui, Naganori, "Effects of Y or Gd addition on the structures and resistivities of Al thin films," Journal of Vacuum Science & Technology A: Vacuum Surfaces, and Films, vol. 14 no. 4, pp. 2499-2504, July/Aug. 1996.

Takayama, Shinji, and Tsutsui, Naganori, "Low resistivity Al-RE (RE=La, Pr, and Nd) alloy thin films with high thermal stability for thin-film-transistor interconnects," Journal of Vacuum Science & Technology B: Nanotechnology and Microelectronics: Materials, Processing, Measurement and Phenomena, vol. 14 no. 5, pp. 3257-3262, Sept./Oct. 1996.

Takeda, Shinji, and Masuko, Takashi, "Novel Die Attach Films Having High Reliability Performance for Lead-free Solder and CSP," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 1616-1622.

Takeichi, Motohide, "History of ACF Development and New Solutions," 2008 SID International Symposium Digest of Technical Papers, Volume 39 Book I, Los Angeles, CA, May 20-21, 2008, pp. 244-248.

Takeichi, Motohide, and Nagashima, Minoru, "Trend of Solder-less Joint in Flip Chip Bonding," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics , Potsdam, Germany, Oct. 21-24, 2001, pp. 168-172.

Takemoto, Tadashi, and Takemoto, Masaharu, "Dissolution of stainless steels in molten lead-free solders," Soldering & Surface Mount Technology, vol. 18 no. 3, pp. 24-30, 2006.

Takemoto, Tadashi, Uetani, Takashi, and Yamazaki, Morio, "Dissolution rates of iron plating on soldering iron tips in molten lead-free solders," Soldering & Surface Mount Technology, vol. 16 no. 3, pp. 9-15, 2004.

Takemoto, Tadashi, and Miyazaki, Makoto, "Effect of Excess Temperature above Liquidus of Lead-Free Solders on Wetting Time in a Wetting Balance Test," Materials Transactions, vol. 42 no. 5, pp. 745-750, May 2001.

Takemoto, Tadashi, Funaki, Tatsuya, and Matsunawa, Akira, "Electrochemical Investigation on the Effect of Silver Addition on Wettability of Sn-Zn System Lead-free Solder," Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society, vol. 17 no. 2, pp. 251-258, May 1999.

Takemoto, Tadashi, "High Dissolution Rate of Solid Materials in Molten Lead-free Solders," Materials Science Forum, vol. 580-582, pp. 205-208, 2008.

Takemoto, Tadashi, "Introduction of JIS Related to Lead-free Solder and Soldering," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Takemoto, Tadashi, Ninomiya, Ryuji, Takahashi, Masahiro, and Matsunawa, Akira, "Mechanical Properties and Estimation of Thermal Fatigue Properties of Lead-free Solders," Advances in Electronic Packaging 1997, Volume 2 , Kohala Coast, Hawaii, June 15-19, 1997, pp. 1623-1628.

Takemoto, Tadashi, Takahashi, Toshihide, and Nishikawa, Hiroshi, "Reduction of Copper Content from Dip-type Lead-free Soldering Bath," 2003 3rd International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 8-11, 2003, pp. 838-842.

Takemoto, Tadashi, Tomitsuka, Ken-ichi, Tooyama, Toshio, and Nishikawa, Hiroshi, "Reduction of Damage of Soldering Iron Tip by Addition of Co and Ni to Sn-Ag-Cu Lead-free Solder," Quarterly Journal of the Japan Welding Society, vol. 27 no. 2, pp. 209s-213s, 2009.

Takemoto, Tadashi, Joo, Yeon Jun, Mawatari, Shohei, and Kato, Rikaya, "Reduction of Dross Formation during Wave Soldering using Lead-free Solders," Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 11-15, 2001, pp. 1131-1136.

Takemoto, Tadashi, and Funaki, Tatsuya, "Role of Electrode Potential Difference between Lead-Free Solder and Copper Base Metal in Wetting," Materials Transactions, vol. 43 no. 8, pp. 1784-1790, Aug. 2002.

Takemoto, Tadashi, Takahashi, Masahiro, Matsunawa, Akira, Ninomiya, Ryuji, and Tai, Hideo, "Tensile Deformation Behavior of Sn-Ag-Bi System Lead-free Solders," Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society , vol. 16 no. 1, pp. 87-92, Feb. 1998.

Takemoto, Tadashi, Takahashi, Masahiro, and Matsunawa, Akira, "Tensile Deformation Properties and Microstructure of Sn-Zn System Lead-Free Solders," Advances in Electronic Packaging 1999, Volume 1, Maui, Hawaii, June 13-19, 1999, pp. 575-580.

Takemoto, Tadashi, "The Recent Situation of Lead-containing Solder Regulation and Replacement to Environmentally Compatible Lead-free solder," Yosetsu Gakkai Shi/Journal of the Japan Welding Society, vol. 69 no. 2, pp. 6-13, Mar. 2000.

Takemoto, Tadashi, "Toward Defects-free in Lead-free Micro-soldering," Proceedings of the First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Feb. 1-3, 1999, pp. 964-969.

Takemura, Taketoshi, Kobayashi, Masahiro, and Okutani, Masayuki, "Influence of Base Materials on the Characteristics of Zinc Electroplates and the Whisker Formations," Japanese Journal of Applied Physics, vol. 25 no. 9, pp. 1439-1440, Sept. 1986.

Takemura, Taketoshi, Kobayashi, Masahiro, Okutani, Masayuki, Kakeshita, Tomoyuki, and Shimizu, Ken'ichi, "Relation Between the Direction of Whisker Growth and the Crystallographic Texture of Zinc Electroplate," Japanese Journal of Applied Physics , vol. 25 no. 12, pp. 1948-1949, Dec. 1986.

Takenaka, Osamu, "Environment-Friendly Electronic Devices for Automobile - Technology Concept and Case Study," Hyomen Gijutsu (Journal of the Surface Finishing Society of Japan), vol. 54 no. 8, pp. 507-511, Aug. 2003.

Takenaka, T., Kajihara, M., Kurokawa N., and Sakamoto, K., "Reactive diffusion between Ag-Au alloys and Sn at solid-state temperatures," Materials Science and Engineering A, vol. 427 no. 1-2, pp. 210-222, July 15, 2006.

Takenaka, Toshio, and Kajihara, Masanori, "Fast Penetration of Sn into Ag by Diffusion Induced Recrystallization," Materials Transactions, vol. 47 no. 3, pp. 822-828, Mar. 2006.

Takenaka, Toshio, Kano, Satoru, Kajihara, Masanori, Kurokawa, Noriharu, and Sakamoto, Katsuhiko, "Growth Behavior of Au-Sn and Ag-Sn Compounds during Solid-state Reactive Diffusion between Au-Ag Alloys and Sn," Materials Transactions, vol. 46 no. 8, pp. 1825-1832, 2005.

Takeshita, Yuki, and Kimura, Yuji, "Generating Behavior of Whisker on Pb Free Sn Plating and Its Control," Proceedings of the ASME InterPack Conference, Volume 1, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 591-594.

Takeuchi, Makoto, Kamiyama, Kouichi, and Suganuma, Katsuaki, "Suppression of Tin Whisker Formation on Fine Pitch Connectors by Surface Roughening," Journal of Electronic Materials, vol. 35 no. 11, pp. 1918-1925, Nov. 2006.

Takeuchi, Teruaki, Tatsumura, Kosuke, Shimura, Takayoshi, and Ohdomari, Iwao, "Analysis of X-ray diffraction curves of trapezoidal Si nanowires with a strain distribution," Thin Solid Films, vol. 612, pp. 116-121, Aug. 1, 2016.

Takeuchi, Y., and Fujiwara, K., "Pb whisker growth from liquid phase on Pb-alloy Josephson device chips," Journal of Applied Physics, vol. 54 no. 10, pp. 6053-6064, Oct. 1, 1983.

Takezawa, H., Itagaki, M., Mitani, T., Bessho, Y., and Eda, K., "Development of Solderless Joining Technologies Using Conductive Adhesives," 1999 International Symposium on Advanced Packaging Materials, Braselton, GA, Mar. 14-17, 1999, pp. 11-15.

Takezawa, H., Mitani, T., Kitae, T., Sogo, H., Kobayashi, S., and Bessho, Y., "Effects of Zinc on the Reliability of Conductive Adhesives," 2002 8th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 3-6, 2002, pp. 139-143.

Takita, Atsuko, Sasaki, Katsuhiko, and Ohguchi, Ken-ichi, "A Method to Identify Steady Creep Strain from Indentation Creep Using a New Reference Area of Indentation," Journal of Electronic Materials, vol. 43 no. 7, pp. 2530-2539, July 2014.

Takizawa, Minoru, Torii, Akiko, "The Application Of Flip Chip Bonding Technology To The Mobile Communications Terminals," 1st 1997 IEMT/IMC Symposium, Tokyo, Japan, Apr. 16-18, 1997, pp. 62-66.

Taklo, M. M. V., Graff, J. Seland, Wright, D. Nilsen, Kristiansen, H., Hoff, L., and Waaler, K., "Failure Analysis Of Thermally And Mechanically Stressed Plastic Core Solder Balls," 2013 IEEE 63rd Electronic Components and Technology Conference , Las Vegas, NV, May 28-31, 2013, pp. 748-754.

Taklo, Maaike M. Visser, Carvalho, Patricia Almeida, and Ramsdal, Elisabeth, "Compatibility of Metals on MEMS and Soldering for Assembly," Advancing Microelectronics, vol. 43 no. 5, pp. 12-16, Sept./Oct. 2016.

Taklo, Maaike M. Visser, Wright, Daniel Nilsen, Graff, Joachim Seland, Carvalho, Patricia Almeida, Austad, Hanne Opsahl, Dalsjo, Per, Gakkestad, Jakob, Ishida, Hiroya, and Johnsen, Christian H., "Reliability of Plastic Core Solder Balls in relation to formation of intermetallic compounds," 2016 6th Electronic System-Integration Technology Conference, Grenoble, France, Sept. 13-15, 2016, pp. xx-xx.

Tak-Seng, Thang, Sun, Decai, Koay, Huck-Khim, Sabudin, Mohd-Fezley, Thompson, Jim, Martin, Paul, Rajkomar, Pradeep, and Haque, Shatil, "Characterization of Au-Sn Eutectic Die Attach Process for Optoelectronics Device," 2005 International Symposium on Electronics Materials and Packaging, Tokyo, Japan, Dec. 11-14, 2005, pp. 118-124.

Takyi, G., and Ekere, N. N., "Investigation of the effect of nitrogen and air atmospheres on solder wettability of plasma-treated HASL finish PCBs," Soldering & Surface Mount Technology, vol. 22 no. 3, pp. 17-21, 2010.

Takyi, G., and Ekere, N. N., "Study of the effects of PCB surface finish on plasma process time for lead-free wave soldering," Soldering & Surface Mount Technology , vol 22 no. 2, pp. 37-42, 2010.

Takyi, Gabriel, and Bernasko, Peter K., "The Effects of Reflow Profile Parameters on Sn-Ag-Cu Solder Bumps and Cu Substrate Using Full Factorial Design," SMTAnews & Journal of Surface Mount Technology, vol. 27 no. 4, pp. 13-22, Oct.-Dec. 2014.

Talaat, A., Zhukova, V., Ipatov, M., del Val, J. J., Gonzalez-Legarreta, L., Hernando, B., Blanco, J. M., and Zhukov, A., "Effect of nanocrystallization on giant magnetoimpedance effect of Fe-based microwires," Intermetallics, vol. 51, pp. 59-63, Aug. 2014.

Talaat, A., Zhukova, V., Ipatov, M., del Val, J. J., Blanco, J. M., Gonzalez-Legarreta, L., Hernando, B., Churyukanova, M., and Zhukov, A., "Engineering of Magnetic Softness and Magnetoimpedance in Fe-Rich Microwires by Nanocrystallization," JOM, vol. 68 no. 6, pp. 1563-1571, June 2016.

Talaat, Ahmed, Zhukova, Valentina, Ipatov, Mihail, Blanco, Juan Maria, Varga, Rastislav, Klein, Peter, Gonzalez-Legarreta, Lorena, Hernando, Blanca, and Zhukov, Arcady, "Magnetic Properties of Nanocrystalline Microwires," Journal of Electronic Materials, vol. 45 no. 1, pp. 212-218, 2016.

Talebanpour, B., Sahaym, U., Dutta, I., and Kumar, P., "Effect of Aging on Impression Creep Behavior of Pb-free Solders," Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 1 , Burlingame, CA, July 16-18, 2013, pp. V001T07A005-1-V001T07A005-5.

Talebanpour, B., Sahaym, U., and Dutta, I., "Effect of Composition and Thermal-Mechanical History on the Creep Behavior of Sn-Ag-Cu Solders-- Part I: Experiments," IEEE Transactions on Device and Materials Reliability, vol. 16 no. 3, pp. 318-325, Sept. 2016.

Talebanpour, B., Sahaym, U., and Dutta, I., "Effect of Composition and Thermal-Mechanical History on the Creep Behavior of Sn-Ag-Cu Solders-- Part II: Model," IEEE Transactions on Device and Materials Reliability, vol. 16 no. 3, pp. 326-335, Sept. 2016.

Talebanpour, B., Huang, Z., Chen, Z., and Dutta, I., "Effect of Joint Scale and Processing on the Fracture of Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumps in 3D Packages," Journal of Electronic Materials, vol. 45 no. 1, pp. 57-68, Jan. 2016.

Talapatra, S., Tang, X., Padi, M., Kim, T., Vajtai, R., Sastry, G. V. S., Shima, M., Deevi, S. C., and Ajayan, P. M., "Synthesis and characterization of cobalt-nickel alloy nanowires," Journal of Materials Science, vol. 44 no. 9, pp. 2271-2275, May 2009.

Tallentire, Paul, "Commentary: Why we need federal RoHS and WEEE laws," Electronic Business, June 20, 2006.

Tallentire, Paul, "Give RoHS its Due Diligence," ECN, vol. 50 no. 4, pp. 27, Apr. 2006.

Tallentire, Paul, "RoHS: the final challenge," EE Times Europe, June 1, 2006.

Tallentire, Paul, "RoHS: the final challenge," Green SupplyLine, June 1, 2006.

Tallentire, Paul, "RoHS: the final challenge," Electronics Supply & Manufacturing , June 2006.

Tallentire, Paul, "Why We Need Federal RoHS and WEEE Laws," Design News, vol. 61 no. 12, pp. 16, Sept. 4, 2006.

Tamai, Isao, and Hasegawa, Hideki, "Selective MBE growth of hexagonal networks of trapezoidal and triangular GaAs nanowires on patterned (1 1 1)B substrates," Journal of Crystal Growth , vol. 301-302, pp. 857-861, Apr, 2007.

Tamai, Terutaka, and Ide, Tatsumi, "Application of Ag-Pd-Mg New Contact Material to Micro Relays," Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts, Sept. 20-23, 2004, pp. 467-473.

Tamai, Terutaka, Nabeta, Yuya, Sawada, Shigeru, and Hattori, Yasuhiro, "Property of Tin Oxide Film Formed on Tin-Plated Connector Contacts," 2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts , Charleston, SC, Oct. 4-7, 2010, pp. xx-xx.

Tamboli, Adele C., Chen, Christopher T., Warren, Emily L., Turner-Evans, Daniel B., Kelzenberg, Michael D., Lewis, Nathan S., and Atwater, Harry A., "Wafer-Scale Growth of Silicon Microwire Arrays for Photovoltaics," 2011 37th IEEE Photovoltaic Specialists Conference, Seattle, WA, June 19-24, 2011, pp. 3390.

Tammann, G., and Dreyer, K. L., "Uber die Umwandlung von weissen in graues Zinn," Zeitschrift fur anorganische und allgemeine Chemie, vol. 199, pp. 97-108, 1931.

Tammenmaa, Markku, Salmela, Olli, Sarkka, Jussi, and Nieminen, Tero, "Enhancement of lead Free Solder Joint Reliability of Leadless Ceramic SAW Filter Packages by Design Modifications," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies , San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Tamura, N., Padmore, H. A., and Patel, J. R., "High spatial resolution stress measurements using synchrotron based scanning X-ray microdiffraction with white or monochromatic beam," Materials Science and Engineering A, vol. 399 no. 1-2, pp. 92-98, June 15, 2005. https://doi.org/10.1016/j.msea.2005.02.033

Tamura, S., Tsunekawa, Y., Okumiya, M., and Hatakeyama, M., "Ultrasonic cavitation treatment for soldering on Zr-based bulk metallic glass," Journal of Materials Processing Technology, vol. 206 no. 1-3, pp. 322-327, Sept. 12, 2008.

Tan, Ai Ting, Tan, Ai Wen, and Yusof, Farazila, "Evolution of microstructure and mechanical properties of Cu/SAC305/Cu solder joints under the influence of low ultrasonic power," Journal of Alloys and Compounds, vol. 705, pp. 188-197, May 25, 2017.

Tan, Ai Ting, Tan, Ai Wen, and Yusof, Farazila, "Influence of high-power-low-frequency ultrasonic vibration time on the microstructure and mechanical properties of lead-free solder joints," Journal of Materials Processing Technology, vol. 238, pp. 8-14, Dec. 2016.

Tan, C. W., Chan, Y. C., and Yeung, N. H., "Behaviour of anisotropic conductive joints under mechanical loading," Microelectronics Reliability, vol. 43 no. 3, pp. 481-486, Mar. 2003.

Tan, C. W., Chiu, Y. W., and Chan, Y. C., "Corrosion study of anisotropic conductive joints on polyimide flexible circuits," Materials Science and Engineering B: Solid-State Materials for Advanced Technology, vol. 98 no. 3, pp. 255-264, Apr. 15, 2003.

Tan, C. W., Chan, Y. C., and Yeung, N. H., "Effect of autoclave test on anisotropic conductive joints," Microelectronics Reliability, vol. 43 no. 2, pp. 279-285, Feb. 2003.

Tan, C. W., Siu, Y. M., Lee, K. K., Chan, Y. C., and Cheng, L. M., "Fabrication of Smart Card using UV Curable Anisotropic Conductive Adhesive (ACA) Part II: Reliability Performance of the ACA Joints," 2004 International Conference on Business of Electronic Product Reliability and Liability, Shanghai, China, Apr. 27-30, 2004, pp. 140-144.

Tan, Cai Hui, Yap, Boon Kar, and Tan, Chou Yong, "Characterization Study for Polymer Core Solder Balls under AC and TC Reliability Test," 2014 IEEE 36th International Electronics Manufacturing Technology Conference, Johor, Malaysia , Nov. 11-13, 2014, pp. xx-xx.

Tan, Chia-Yan, and Duh, Jenq-Gong, "Influence of NiTi Shape Memory Alloy as Under Bump Metallization on Thermal Mechanical Behavior of Solder Joints," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1300-1305.

Tan, Chia-Yen, and Duh, Jenq-Gong, "Characterization of the Effect of Shape Memory Alloy on Solder Joint Strength Through Modeling and Testing," Journal of Electronic Materials, vol. 38 no. 12, pp. 2496-2505, Dec. 2009.

Tan, Dongchen, Jiang, Chengming, Li, Qikun, Bi, Sheng, and Song, Jinhui, "Silver nanowire networks with preparations and applications: a review," Journal of Materials Science: Materials in Electronics, vol. 31 no. 18, pp. 15669-15696, Sept. 2020.

Tan, Fatang, Qiao, Xueliang, Chen, Jianguo, and Wang, Hongshui, "Effects of coupling agents on the properties of epoxy-based electrically conductive adhesives," International Journal of Adhesion and Adhesives , vol. 26 no. 6, pp. 406-413, Sept. 2006.

Tan, Ivan, Juarez, Joseph, Snugovsky, Polina, Kennedy, Jeffrey, Kammer, Milea, Straznicky, Ivan, Hillman, David, Adams, David, Meschter, Stephan, Suthakaran, Subramaniam, Brush, Russell, and Perovic, Doug, "Accelerated Life Testing Solder Reliability in Combined Environments: ISO Temperatures with Harmonic Vibration," International Conference on Soldering & Reliability 2017 Proceedings, Toronto, Ontario, Canada, June 6-8, 2017, pp. xx-xx.

Tan, Ivan, Juarez, Joseph, Snugovsky, Polina, Kennedy, Jeffrey, Kammer, Milea, Straznicky, Ivan, Hillman, David, Adams, David, Meschter, Stephan, Suthakaran, Subramaniam, Brush, Russell, and Perovic, Doug, "Accelerated Life Testing Solder Reliability in Combined Environments: Isothermal Conditions with Harmonic Vibration," SMTA Journal, vol. 31 no. 1, pp. 13-24, 2018.

Tan, K.-L., Morelle, J.-M., Vivet, L., and Lavrentieff, S., "Metallurgical structure of lead free solder alloy to improve the reliability of power module," 9th International Conference on Integrated Power Electronics Systems, Hamburg, Germany, Feb. 8-10, 2016, pp. xx-xx.

Tan, Kok Ee, Luhua, Xu, Pang, John H. L., Lau, John H., and Zhang, X. W., "Creep Properties of Sn3wt%Ag0.5wt%Cu0.019wt%Ce (SACC) Lead-Free Solder," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 521-526.

Tan, Kok Ee, and Pang, John H. L., "Fracture Behavior of 96.5Sn3.0Ag0.5Cu Solder Joint under Mixed-Mode Tensile and Shear Loading Conditions," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 296-300.

Tan, Kok Ee, and Pang, John H. L., "Strain-Rate Effects on Constitutive Behavior of Sn3.8Ag0.7Cu Lead-Free Solder," Proceedings of the ASME InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 841-847.

Tan, L .B., Zhang, Xiaowu, Lim, C. T., and Tan, V. B. C., "Mapping the failure envelope of board-level solder joints," Microelectronics Reliability, vol. 49 no. 4, pp. 397-409, Apr. 2009.

Tan, Meng-Ying, Zhou, Min-Bo, Huang, Jia-Qiang, Ma, Fa-Qian, Ma, Xiao, and Zhang, Xin-Ping, "Dynamic wetting behavior and solder ball spattering formation of Sn-Bi solder pastes during reflow soldering process," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 974-978.

Tan, Quanyin, Zeng, Xianlai, Ijomah, Winifred L., Zheng, Lixia, and Li, Jinhui, "Status of End-of-life Electronic Product Remanufacturing in China," Journal of Industrial Ecology, vol. xx no. x, pp. xx-xx, xxxx.

Tan, S. C., Chan, Y. C., Chiu, Y. W., and Tan, C. W., "Thermal stability performance of anisotropic conductive film at different bonding temperatures," Microelectronics Reliability, vol. 44 no. 3, pp. 495-503, Mar. 2004.

Tan, Shihai, Han, Jing, Wang, Yan, and Guo, Fu, "A method to determine the slip systems in BGA lead-free solder joints during thermal fatigue," Journal of Materials Science: Materials in Electronics , vol. 29 no. 9, pp. 7501-7509, May 2018.

Tan, Shihai, Han, Jing, and Guo, Fu, "Effects of twin grain boundaries on the subgrain rotation of the solder joint during thermal shock," Microelectronics Reliability, vol. 71, pp. 126-133, Apr. 2017.

Tan, Shihai, Han, Jing, and Guo, Fu, "Subgrain rotation at twin grain boundaries of a lead-free solder joint during thermal shock," Journal of Materials Science: Materials in Electronics , vol. 27 no. 9, pp. 9642-9649, Sept. 2016.

Tan, Wei, Ume, I. Charles, Hung, Ying, and Wu, C. F. Jeff, "Effects of Warpage on Fatigue Reliability of Solder Bumps: Experimental and Analytical Studies," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 131-138.

Tan, Wei, Ume, I. Charles, Hung, Ying, and Wu, C. F. Jeff, "Effects of Warpage on Fatigue Reliability of Solder Bumps: Experimental and Analytical Studies," IEEE Transactions on Advanced Packaging, vol. 33 no. 2, pp. 314-322, May 2010.

Tan, Wei, and Ume, I. Charles, "Fatigue Assessment of Solder Bumps on Board Assemblies Affected by PWB Warpage," Journal of Microelectronics and Electronic Packaging, Vol. 4 no. 1, pp. 37-44, First Quarter 2007.

Tan, Y. Y., On, Dinah, Krishnan, J., "Early Whisker Detection through Intermetallic Compound (IMC) Grain Size," 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 7-11, 2008, pp. xx-xx.

Tan, Yansong, Li, Xin, Chen, Gang, Mei, Yunhui, and Chen, Xu, "Three-Dimensional Visualization of the Crack-Growth Behavior of Nano-Silver Joints During Shear Creep," Journal of Electronic Materials, vol. 44 no. 2, pp. 761-769, Feb. 2015.

Tan, Yong-Jun, Bailey, Stuart, and Kinsella, Brian, "Studying the formation process of chromate conversion coatings on aluminium using continuous electrochemical noise resistance measurements," Corrosion Science, vol. 44 no. 6, pp. 1277-1286, June 2002.

Tanabe, Kazuhiko, Toshima, Hiroshi, and Toyoda, Yoshitaka, "The Consideration of Whisker Growth Mechanism on Lead Free Soldering," Journal of the Surface Finishing Society of Japan, vol. 59 no. 4, pp. 228-231, 2008.

Tanabe, T., and Harada, S., "Examination of compound formation at interface of tin-bismuth-silver solder and copper substrate by using electron probe micro analysis," X-Ray Spectrometry, vol. 31 no. 1, pp. 3-6, Jan./Feb. 2002.

Tanabe, Takahiro, Irino, Tetsuro, Ose, Masahisa, and Sakai, Kazunaga, "New Halogen-Free Laminate for Advanced Package Substrate," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 29-32.

Tanaka, Hirokazu, Ueta, Fumitaka, Yoshihara, Sachio, and Shirakashi, Takashi, "Effects of Reflow Processing and Flux Residue on Ionic Migration of Lead-Free Solder Plating Using the Quartz Crystal Microbalance Method," Materials Transactions, vol. 42 no. 9, pp. 2003-2007, Sept. 2001.

Tanaka, Hirokazu, "Evaluating hot-dipped solder plating with corrosion testing," Espec Technology Report, no. 21, pp. 1-10, 2006.

Tanaka, Hirokazu, Nakamura, Makoto, Ueta, Fumitake, Yoshihara, Sachio, and Shirakashi, Takashi, "Evaluating ionic migration in lead-free solder using the Quartz Crystal Microbalance Method," Espec Technology Report, no. 12, pp. 17-22, Oct. 2001.

Tanaka, Hirokazu, Aoki, Yuichi, and Katayanagi, Hiroko, "Evaluation results on reliability of lead-free solder -- Tabai Espec efforts to develop viable lead-free solder," ESPEC Technology Report, no. 11, pp. 9-18, Apr. 2001.

Tanaka, Hirokazu, "Factors leading to ionic migration in lead-free solder," ESPEC Technology Report, no. 14, pp. 1-9, Oct. 2002.

Tanaka, Hirokazu, Saito, Akihiko, Nagayama, Toshiro, and Umeda, Hiromi, "Promoting the commercial adoption of lead-free solder and evaluating its reliability," ESPEC Technology Report, no. 17, pp. 10-21, Apr. 2004.

Tanaka, Hirokazu, Aoki, Yuuichi, Kitagawa, Makoto, and Saito, Yoshiki, "Reliability Testing and Failure Analysis of Lead-Free Solder Joints under Thermo-Mechanical Stress," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S28-1-1-S28-1-12.

Tanaka, Hiroyuki, Qun, Lang Feng, Munekata, Osamu, Taguchi, Toshihiko, and Narita, Toshio, "Elastic Properties of Sn-Based Pb-Free Solder Alloys Determined by Ultrasonic Pulse Echo Method," Materials Transactions, vol. 46 no. 6, pp. 1271-1271, June 2005.

Tanaka, Hitoshi, Tanimoto, Morimasa, Matsuda, Akira, Uno, Takeo, Kurihara, Masaaki, and Shiga, Shoji, "Pb-Free Surface-Finishing on Electronic Components' Terminals for Pb-Free Soldering Assembly," Journal of Electronic Materials, vol. 28 no. 11, pp. 1216-1223, Nov. 1999.

Tanaka, Manabu, and Watanabe, Takayuki, "Vaporization Mechanism from Sn-Ag Mixture by Ar-H2 Arc for Nanoparticle Preparation," Thin Solid Films, vol. xxno. xx, pp. xx-xx, xxxx.

Tanaka, Masamoto, Sasaki, Tsutomu, Kobayashi, Takayuki, and Tatsumi, Kohei, "Improvement in Drop Shock Reliability of Sn-1.2Ag-0.5Cu BGA Interconnects by Ni Addition," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 78-84.

Tanaka, Naotaka, Kawano, Kenya, Miura, Hideo, Kado, Yoshiyuki, and Yoshida, Ikuo, "A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film," Journal of Electronic Packaging, Transactions of the ASME, vol. 126 no. 1, pp. 82-86, Mar. 2004.

Tanaka, Naotaka, Kawano, Kenya, Miura, Hideo, Kado, Yoshiyuki, and Yoshida, Ikuo, "A Highly Reliable Flip Chip Joint Consisting of an Anisotropic Conductive Film," Advances in Electronic Packaging 2001, Volume 3, Kauai, Hawaii, July 8-13, 2001, pp. 1561-1565.

Tanaka, S., and Kajihara, M., "Kinetics of solid-state reactive diffusion between Sn-Ni alloys and Pd," Journal of Alloys and Compounds, vol. 484 no. 1-2, pp. 273-279, Sept. 18, 2009.

Tanaka, Tetsuya, and Kris, E. Martin, "Low Warpage, Lead-Free Multilayer Dielectric," Proceedings 1996 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 2920), Minneapolis, MN, Oct. 8-10, 1996, pp. 328-332.

Tanaka, Toru, Kawaguchi, Hiroshi, Terao, Takashi, Babasaki, Tadatoshi, and Yamasaki, Mikio, "Modeling of Fuses for DC Power Supply Systems Including Arcing Time Analysis," 29th International Telecommunications Energy Conference , Rome, Italy, Sept. 30-Oct. 4, 2007, pp. 135-141.

Tanaka, Toru, and Yamasaki, Mikio, "Modeling of Fuses for Melting Time and Fusing Current Analysis," 26th Annual International Telecommunications Energy Conference, Chicago, IL, Sept. 19-23, 2004, pp. 671-675.

Tanaka, Toshihiro, Hack, Klaus, and Hara, Shigeta, "Calculation of Surface Tension of Liquid Bi-Sn Alloy using Thermochemical Application Library ChemApp," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 24 no. 4, pp. 465-474, Dec. 2000.

Tanaka, Toshihiro, Nakamoto, Masashi, Oguni, Ryosuke, Lee, Joonho, and Hara, Shigeta, "Measurment of the surface tension of liquid Ga, Bi, Sn, In and Pb by the constrained drop method," Zeitschrift fur Metallkunde, vol. 95 no. 9, pp. 818-822, Sept. 2004.

Tanaka, Yasunori, Takahashi, Junichi, and Kawashima, Kazuyuki, "Lead Free Soldering Technology for Mobile Equipment," ," Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 314-319.

Tandon, Samarth, Deshmukh, Sachin P., Mishra, Rajiv S., Krishnamurthy, K., and Tayloe, R., "Fracture criteria prediction in wiredrawing using finite element modeling," Wire Journal International, vol. 39 no. 1, pp. 58-62, Jan. 2006.

Taneja, D., Volpert, M., Mendizabal, L., Chaira, T., Henry, D., and Hodaj, F., "Towards Reliable 10um Pitch Assembly Using Cu/Ni/SnAg based Interconnects," 2017 IEEE 19th Electronics Packaging Technology Conference, Singapore, Dec. 6-9, 2017, pp. xx-xx.

Taneja, D., Volpert, M., Lasfargues, G., Catelain, T., Henry, D., and Hodaj, F., "Understanding The Behavior of SnAg Bumps at 10 um Pitch and Below for Imaging and Microdisplay Application," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 361-367.

Taneja, Divya, Volpert, Marion, Lasfargues, Gilles, Chambion, Bertrand, Bouillard, Boris, Jarjayes, Sylvie, Chaira, Tarik, Vandeneynde, Aureili, Goiran, Yannick, Henry, David, and Hodaj, Fiqiri, "Cu-SnAg Interconnects Evaluation for the Assembly at 10um and 5um Pitch," 2017 IEEE 67th Electronic Components and Technology Conference, Orlando, FL, May 30-June 2, 2017, pp. 376-383.

Taneja, Divya, Volpert, Marion, and Hodaj, Fiqiri, "Further insight into interfacial interactions in nickel/liquid Sn-Ag solder system at 230-350 °C," Journal of Materials Science: Materials in Electronics, vol. 28 no. 24, pp. 18366-18378, Dec. 2017.

Taneja, Divya, Volpert, Marion, and Hodaj, Fiqiri, "On the initial stages of solid state reactions in Ni/Sn-Ag solder system at 150-210 °C," Journal of Alloys and Compounds, vol. 742, pp. 199-211, Apr. 25, 2018.

Tang, Bin, Zhang, Shu-Ren, Yuan, Ying, Yang, Lin-Bo, and Zhou, Xiao-Hua, "Influence of tetragonality and secondary phase on the Curie temperature for barium titanate ceramics," Journal of Materials Science: Materials in Electronics, vol. 19 no. 11, pp. , Nov. 2008.

Tang, Cai, Hu, Biao, Du, Yong, Zhao, Dongdong, Zhou, Peng, Zheng, Feng, Gao, Qiannan, and Wang, Jiong, "Thermodynamic modeling of the Hf-Sn and Sn-Y systems," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 39, pp. 91-96, Dec. 2012.

Tang, Chi Yan, Zhang, L. C., and Mylvaganam, Kausala, "Rate dependent deformation of a silicon nanowire under uniaxial compression: Yielding, buckling and constitutive description," Computational Materials Science, vol. 51 no. 1, pp. 117-121, Jan. 2012.

Tang, Fangwu, Huang, Mingliang, and Huang, Feifei, "Effects of Bath Temperature on Co-electroplating Au-Sn Alloys for Electronic Packaging," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 301-303.

Tang, Ganran, An, Bing, Wu, Yiping, and Wu, Fengshun, "Finite Element Analysis of Sn-Ag-Cu Solder Joint Failure under Impact Test," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1220-1224.

Tang, Hongqun, Liu, Moumiao, Ma, Yueyuan, Du, Zaixiang, Zhan, Yongzhong, and Yang, Wenchao, "Microstructure, Interface Morphology, and Antioxidant Properties of Sn-8.5Zn-0.1Cr-(Nd,Al,Cu) Solders," Journal of Electronic Materials , vol. 46 no. 1, pp. 637-649, Jan. 2017.

Tang, Jie, Gong, Yi, and Yang, Zhen-Guo, "Failure analysis on cracking of blind and buried vias of printed circuit board for high-end mobile phones," Soldering & Surface Mount Technology , vol. 31 no. 4, pp. 203-210, 2019.

Tang, Kun, Yan, Yan-fu, Zhao, Kuai-le, Sheng, Yang-yang, and Feng, Li-fang, "Effect of the content of Sn on microstructure and mechanical properties of Bi5Sb solder alloy," Applied Mechanics and Materials, vol. 34-35, pp. 774-779, Oct. 2010.

Tang, P. T., Bech-Nielsen, G., and Moller, P., "Molybdate Based Passivation of Zinc," Transactions of the Institute of Metal Finishing, vol. 75 no. 4, pp. 144-148, July 1997.

Tang, Peter T., Bech-Neilsen, Gregers, and Moller, Per, "Molybdate Based Alternatives to Chromating as a Passivation Treatment for Zinc," SUR/FIN '94 Technical Conference Proceedings, Indianapolis, IN, June 20-23, 1994, pp. 533-541.

Tang, Peter T., Bech-Nielsen, Gregers, and Moller, Per, "Molybdate-Based Alternatives to Chromating As a Passivation Treatment for Zinc," Plating & Surface Finishing, vol. 81 no. 11, pp. 20-23, Nov. 1994.

Tang, Qiang, Liu, Xian, Kamins, Theodore I., Solomon, Glenn S., and Harris, James S., "Nucleation of Ti-catalyzed self-assembled kinked Si nanowires grown by gas source MBE," Journal of Crystal Growth, vol. 251 no. 1-4, pp. 662-665, 2003.

Tang, Shaochun, Vongehr, Sascha, Wan, Neng, and Meng, Xiangkang, "Rapid synthesis of pentagonal silver nanowires with diameter-dependent tensile yield strength," Materials Chemistry and Physics, vol. 142 no. 1, pp. 17-26, Oct. 15, 2013.

Tang, Wenbin, Long, Xu, Liu, Yongchao, Du, Chongyang, Yao, Yao, Zhou, Cheng, Wu, Yanpei, and Jia, Fengrui, "Effect of Electric Current on Constitutive Behaviour and Microstructure of SAC305 Solder Joint," 2018 IEEE 20th Electronics Packaging Technology Conference, Singapore, Dec. 4-7, 2018, pp. 717-721.

Tang, Wenbin, Shi, Hongbin, and Long, Xu, "Growth Behaviour of Intermetallic Compounds in Sn-3.0Ag-0.5Cu Solder Joints under Annealing Treatment with Various Temperatures," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Tang, Wenming, He, Anqiang, Liu, Qi, and Ivey, Douglas G., "Fabrication and microstructures of sequentially electroplated Au-rich, eutectic Au/Sn alloy solder," Journal of Materials Science: Materials in Electronics, vol. 19 no. 12, pp. 1176-1183, Dec. 2008.

Tang, Wenming, He, Anqiang, Liu, Qi, and Ivey, Douglas G., "Fabrication and Microstructures of Sequentially Electroplated Sn-Rich Au-Sn Alloy Solders," Journal of Electronic Materials, vol. 37 no. 6, pp. 837-844, June 2008.

Tang, Wenming, Zhang, Hong, Wu, Yucheng, and Zheng, Zhixiang, "Mechanical alloying synthesis and soldering microstructures of nanocrystalline Sn-3.5Ag-0.7Cu alloy powders," Journal of Alloys and Compounds, vol. 497 no. 1-2, pp. 396-401, May 14, 2010.

Tang, Wenming, He, Anqiang, Liu, Qi, and Ivey, Douglas G., "Response to Comments on "Room temperature interfacial reactions in electrodeposited Au/Sn couples"," Scripta Materialia, vol. 61 no. 11, pp. 1095-1096, Dec. 2009.

Tang, Wenming, He, Anqiang, Liu, Qi, and Ivey, Douglas G., "Room temperature interfacial reactions in electrodeposited Au/Sn couples," Acta Materialia, vol. 56 no. 19, pp. 5818-5827, Nov. 2008.

Tang, Wen-ming, He, An-qiang, Liu, Qi, and Ivey, D. G., "Solid state interfacial reactions in electrodeposited Cu/Sn couples," Transactions of Nonferrous Metals Society of China, vol. 20 no. 1, pp. 90-96, Jan. 2010.

Tang, Xiang-qiong, Huang, Chun-yue, Zhao, Sheng-jun, and Liang, Ying, "Stress and strain analysis of solder joints of gull wing lead in the cooling process of reflow," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Tang, Xingyong, Wang, Jun, Gu, Bo, Yu, Hongkun, and Xiao, Fei, "Effects of Aging on Structures and Shear Strength of Interface of Sn-Ag-Cu Solder/Ni-P Plating Layer," Acta Metallurgica Sinica, vol. 42 no. 2, pp. 205-210, Feb. 2006.

Tang, Xinhe, Reiter, Werner, Meyer, Andreas, Tse, Kalvin Ka Chun, and Hammel, Ernst, "Carbon Nanotube Enhanced Thermally and Electrically Conductive Adhesive for Advanced Packaging," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 438-441.

Tang, Y., Li, G. Y., Luo, S. M., Wang, K. Q., and Zhou, B., "Creep Behavior of 95.8Sn-3.5Ag-0.7Cu Solder Joints, and a Modified Constitutive Model for the Joints," Journal of Electronic Materials , vol. 44 no. 7, pp. 2440-2449, July 2015.

Tang, Y. K., Stoyanov, S., Bailey, C., and Lu, H., "Decision Support Systems for Eco-friendly Electronic Products," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Tang, Y., Li, G. Y., Luo, S. M., Wang, K. Q., and Zhou, B., "Diffusion wave model and growth kinetics of interfacial intermetallic compounds in Sn-3.0Ag-0.5Cu-xTiO2 solder joints," Journal of Materials Science: Materials in Electronics, vol. 26 no. 5, pp. 3196-3205, May 2015.

Tang, Y., Luo, S. M., Li, G. Y., Yang, Z., Chen, R., Han, Y., and Hou, C. J., "Effect of Mn Nanoparticles on Interfacial Intermetallic Compound Growth in Low-Ag Sn-0.3Ag-0.7Cu-xMn Solder Joints," Journal of Electronic Materials, vol. 47 no. 2, pp. 1673-1685, Feb. 2018.

Tang, Y., Zhou, B., Huang, J. H., Wu, Z. Z., and Li, G. Y., "Effect of nano-dopant on intermetallic compounds growth in Sn-3.0Ag-0.5Cu-xBi solder joints during aging process," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 141-144.

Tang, Y., Luo, S. M., Wang, K. Q., and Li, G. Y., "Effect of Nano-TiO2 particles on growth of interfacial Cu6Sn5 and Cu3Sn layers in Sn-3.0Ag-0.5Cu-xTiO2 solder joints," Journal of Alloys and Compounds, vol. 684, pp. 299-309, Nov. 1, 2016.

Tang, Y., Luo, S. M., Huang, W. F., Pan, Y. C., and Li, G. Y., "Effects of Mn nanoparticles on tensile properties of low-Ag Sn-0.3Ag-0.7Cu-xMn solder alloys and joints," Journal of Alloys and Compounds, vol. 719, pp. 365-375, Sept. 30, 2017.

Tang, Y., Pang, Y. C., Zhan, J. X., and Li, G. Y., "Effects of Sb Addition on Grain Ripening Growth at Interface of Sn-Ag-Cu-xSb/Cu in Wetting Reactions," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging , Guilin, China, Aug. 13-16, 2012, pp. 219-223.

Tang, Y., Guo, Q. W., Luo, S. M., Li, Z. H., Li, G. Y., Hou, C. J., Zhong, Z. Y., and Zhuang, J. J., "Formation and growth of interfacial intermetallics in Sn-0.3Ag-0.7Cu-xCeO2/Cu solder joints during the reflow process," Journal of Alloys and Compounds, vol. 778, pp. 741-755, Mar. 25, 2019.

Tang, Y., Li, G. Y., and Pan, Y. C., "Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints in reflow process," Journal of Alloys and Compounds, vol. 554, pp. 195-203, Mar. 25, 2013.

Tang, Y., Li, G. Y., Chen, D. Q., and Pan, Y. C., "Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints during isothermal aging process," Journal of Materials Science: Materials in Electronics, vol. 25 no. 2, pp. 981-991, Feb. 2014.

Tang, Y., Pan, Y. C., and Li, G. Y., "Influence of TiO2 nanoparticles on thermal property, wettability and interfacial reaction in Sn-3.0Ag-0.5Cu-xTiO2 composite solder," Journal of Materials Science: Materials in Electronics, vol. 24 no. 5, pp. 1587-1594, May 2013.

Tang, Y. K., Hsu, Y. C., Lin, E. J., Hu, Y. J., and Liu, C. Y., "LED Die-Bonded on the Ag/Cu Substrate by a Sn-BiZn-Sn Bonding System," Journal of Electronic Materials, vol. 45 no. 12, pp. 6171-6176, Dec. 2016.

Tang, Y., Li, G. Y., and Shi, X. Q., "Low-Cycle Fatigue Behavior of 95.8Sn-3.5Ag-0.7Cu Solder Joints," Journal of Electronic Materials, vol. 42 no. 1, pp. 192-200, Jan. 2013.

Tang, Y., Luo, S. M., Li, Z. H., Hou, C. J., and Li, G. Y., "Morphological Evolution and Growth Kinetics of Interfacial Cu6Sn5 and Cu3Sn Layers in Low-Ag Sn-0.3Ag-0.7Cu-xMn/Cu Solder Joints During Isothermal Ageing," Journal of Electronic Materials, vol. 47 no. 10, pp. 5913-5929, Oct. 2018.

Tang, Y., Luo, S. M., Li, G. Y., Yang Z., ,and Hou, C. J., "Ripening Growth Kinetics of Cu6Sn5 Grains in Sn-3.0Ag-0.5Cu-xTiO2/Cu Solder Joints During the Reflow Process," Journal of Electronic Packaging , vol. 140 no. 1, pp. 011003-1-011003-11, Mar. 2018.

Tang, Ya-Sheng, Derakhshandeh, Jaber, Kho, Yi-Tung, Chang, Yao-Jen, Slabbekoorn, John, De Preter, Inge, Vanstreels, Kris, Rebibis, Kenneth June, Beyne, Eric, and Chen, Kuan-Neng, "Investigation of Co Thin Film as Buffer Layer Applied to Cu/Sn Eutectic Bonding and UBM With Sn, SnCu, and SAC Solders Joints," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 7 no. 11, pp. 1899-1905, Nov. 2017.

Tang, Yao, He, Wei, Wang, Shouxu, Tao, Zhihua, and Cheng, Lijuan, "One step synthesis of silver nanowires used in preparation of conductive silver paste," Journal of Materials Science: Materials in Electronics , vol. 25 no. 7, pp. 2929-2933, July 2014.

Tang, Yu, Luo, Shaoming, Li, Guoyuan, Yang, Zhou, and Hou, Chaojun, "Effects of Mn nanoparticle addition on wettability, microstructure and microhardness of low-Ag Sn-0.3Ag-0.7Cu-xMn(np) composite solders," Soldering & Surface Mount Technology, vol. 30 no. 3, pp. 153-163, 2018.

Tang, Zhenming, Park, Seungbae, Lee, H. C. John, and Chung, Soonwan, "Effect of Board-Level Reflow on Adhesion Between Lead-Free Solder and Underfill in Flip-Chip BGA Packages," 2007 ASME International Mechanical Engineering Conference and Exposition, Volume 5, Seattle, WA, Nov. 11-15, 2007, pp. 9-14.

Tang, Zhiyuan, Guo, Hetong, and Tan, Lixin, "Solderability of electro-deposited tin-based composite coating," Huagong Xuebao/Journal of Chemical Industry and Engineering (China), vol. 44 no. 6, pp. 712-716, Dec. 1993.

Tange, Lein, and Drohmann, Dieter, "Waste electrical and electronic equipment plastics with brominated flame retardants - from legislation to separate treatment - thermal processes," Polymer Degradation and Stability, vol. 88 no. 1, pp. 35-40, Apr. 2005.

Tanie, Hisashi, Nakane, Kazuhiko, Urata, Yusuke, Tsuda, Masatoshi, and Ohno, Nobutada, "Warpage variations of Si/solder/OFHC-Cu layered plates subjected to cyclic thermal loading," Microelectronics Reliability, vol. 51 no. 9-11, pp. 1840-1844, Sept. 2011.

Taniguchi, Maiko, and Kariya, Yoshiharu, "Effect of Strain Rate and Temperature on Micro Fatigue Crack Propagation of Bi-Sn Eutectic Alloy," Materials Transactions, JIM, vol. 57 no. 6, pp. 853-859, 2016.

Tanimoto, Morimasa, Tanaka, Hitoshi, Suzuki, Satoshi, and Matsuda, Akira, "Pb-Free Plating for Electronic Components," Furukawa Review, no. 19, pp. 91-96, Apr. 2000.

Tanner, Chris, "Lead Free Board Finishes," Nortel Networks.

Tanner, Chris, "Lead Free Soldering Reliability and Characterization Efforts," International Workshop for Lead- and Halide-free Electronics, Long Beach, CA, Mar. 16, 2000.

Tanokura, Yasuo, "Nissan Uses Lead-Free Solder in Automotive Electronics," Nikkei Electronics Asia, pp. xx-xx, Dec. 2000.

Tanokura, Yasuo, "Race for Pb-Free Solder Splits over Bi Contents," Nikkei Electronics Asia, pp. xx-xx, Feb. 2001.

Tanong, Kulchaya, Coudert, Lucie, Mercier, Guy, and Blais, Jean-Francois, "Recovery of metals from a mixture of various spent batteries by a hydrometallurgical process," Journal of Environmental Management, vol. 181, pp. 95-107, Oct. 1, 2016.

Tanskanen, Pia, "Management and recycling of electronic waste," Acta Materialia, vol. 61 no. 3, pp. 1001-1011, Feb. 2013.

Tanskanen, Pia, and Butler, Ed, "Mobile phone take back - learning's from various initiatives," Proceedings of the 2007 IEEE International Symposium on Electronics & the Environment, Orlando, FL, May 7-10, 2007, pp. 206-209,

Tao, Bo, Yin, Zhouping, and Xiong, Youlun, "ACF curing process optimization based on degree of cure considering contact resistance degradation of joints," Soldering & Surface Mount Technology, vol. 22 no. 4, pp. 4-12, 2010.

Tao, Dong Ping, "Prediction of activities of all components in the lead-free solder systems Bi-In-Sn and Bi-In-Sn-Zn," Journal of Alloys and Compounds, vol. 457 no. 1-2, pp. 124-130, June 12, 2008.

Tao, Jing, Mathewson, Alan, and Razeeb, Kafil M., "Bumpless Interconnects formed with Nanowire ACF for 3D Applications," 2014 International 3D Systems Integration Conference, Kinsdale, Ireland, Dec. 1-3, 2014, pp. xx-xx.

Tao, Jing, Mathewson, Alan, and Razeeb, Kafil M., "Bumpless Interconnects formed with Nanowire ACF for 3D Applications," 2014 International 3D Systems Integration Conference, Kinsdale, Ireland, Dec. 1-3, 2014, pp. xx-xx.

Tao, Jing, Mathewson, Alan, and Razeeb, Kafil M., "Study of Fine Pitch Micro-Interconnections Formed by Low Temperature Bonded Copper Nanowires Based Anisotropic Conductive Film," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 1064-1070.

Tao, Junlei, Whalley, David, Liu, Changqing, and He, J. Y., "Process and Performance Modelling for Individual ACA Conductor Particles," 2014 Electronics System-Integration Technology Conference, Helsinki, Finland, Sept. 16-18, 2014, pp. xx-xx.

Tao, Lu, Bin, Zhou, Kailin, Pan, Yunfei, En, and Yubin, Gong, "Harmonic Vibration Analysis and S-N Curve Estimate of PBGA Mixed Solder Joints," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 778-782.

Tao, Q. B., Benabou, L., Tan, K. L., Morelle, J. M., and Ouezdou, F. Ben, "Creep Behavior of Innolot Solder Alloy Using Small Lap-Shear Specimens," 2015 IEEE 17th Electronics Packaging and Technology Conference, Singapore, Dec. 2-4, 2015, pp. xx-xx.

Tao, Q. B., Benabou, L., Vivet, L., Le, V. N., and Ouezdou, F. B., "Effect of Ni and Sb additions and testing conditions on the mechanical properties and microstructures of lead-free solder joints," Materials Science and Engineering: A, vol. 669, pp. 403-416, July 4, 2016.

Tao, Q. B., Benabou, L., Van, T. A. Nguyen, and Nguyen-Xuan, H., "Isothermal aging and shear creep behavior of a novel lead-free solder joint with small additions of Bi, Sb and Ni," Journal of Alloys and Compounds , vol. 789, pp. 183-192, June 15, 2019.

Tao, Q. B., Benabou, L., Le, Van Nhat, Thi, Ngoc Anh, and Nguyen-Xuan, Nguyen Hung, "Temperature-dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn-3.8Ag-0.7Cu lead-free solder alloy," Fatigue and Fracture of Engineering Materials and Structures, vol. 43 no. 12, pp. 2883-2891, Dec. 2020. https://doi-org.ezproxy.uky.edu/10.1111/ffe.13313

Tao, Q. B., Benabou, L., Le, V. N., Hwang, H., and Luu, D. B., "Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni," Journal of Alloys and Compounds, vol. 694, pp. 892-904, Feb. 15, 2017.

Tao, Wenkai, Chen, Si, Berggren, Par, and Liu, Johan, "Reliability study for high temperature stable conductive adhesives," International Symposium on Advanced Packaging Materials, Cambridge, England, Feb. 28-Mar. 2, 2010, pp. 74-77.

Tao, W. H., Chen, C., Ho, C. E., Chen, W. T., and Kao, C. R., "Selective Interfacial Reaction between Ni and Eutectic BiSn Lead-Free Solder," Chemistry of Materials, vol. 13 no. 3, pp. 1051-1056, Mar. 2001.

Tao, Wenkai, Chen, Si, Liu, Xiaohua, Cui, Huiwang, Chen, Tianan, and Liu, Johan, "Reliability Characterisation of Bi-modal High Temperature Stable Isotropic Conductive Adhesives," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 225-228.

Tao, Yeqing, Guo, Jason, Ding, Dongyan, Li, Ting, and Yu, Yunhong, "Influence of Argon Reflow on the Microstructure and Properties of Lead-free Solder Joints," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 408-412.

Tao, Yeqing, Ding, Dongyan, Li, Ting, Guo, Jason, and Yu, Yunhong, "Influence of protective atmosphere on the solderability and reliability of OSP-based solder joints," Journal of Materials Science: Materials in Electronics, vol. 27 no. 5, pp. 4898-4907, May 2016.

Tao, Yeqing, Ding, Dongyan, Li, Ting, Guo, Jason, and Fan, Guoliang, "Reflow of tiny 01005 capacitor/SAC305 solder joints in protective atmosphere," Soldering & Surface Mount Technology, vol. 29 no. 3, pp. 144-150, 2017.

Tao, Yeqing, Ding, Dongyan, Li, Ting, Guo, Jason, He, Ted, and Yu, Yunhong, "Reliability of 1206 capacitor/SAC305 solder joint reflowed in protective atmosphere," 2014 15th International Conference on Electronic Packaging Technology , Chengdu, China, Aug. 12-15, 2014, pp. 1026-1029.

Tao, You-Rong, Fan, Lei, Wu, Zhong-Yu, Wu, Xing-Cai, and Wang, Zhi-He, "Synthesis and characterization of superconducting FeSe nanowires," Journal of Alloys and Compounds, vol. 751, pp. 20-27, June 30, 2018.

Tao, Yu, Xia, Yanping, Wang, Hui, Gong, Fanghong, Wu, Haiping, and Tao, Guoliang, "Novel Isotropical Conductive Adhesives for Electronic Packaging Application," IEEE Transactions on Advanced Packaging, vol. 32 no. 3, pp. 589-592, Aug. 2009.

Tao, Yu, Chang, Yu, Tao, Yuxiao, Wu, Haiping, and Yang, Zhenguo, "Self-Healing Ag/Epoxy Electrically Conductive Adhesive Using Encapsulated Epoxy-Amine Healing Chemistry," Journal of Applied Polymer Science , vol. 132 no. 7, pp. 41483-1-41483-6, Feb. 15, 2015.

Tao, Yu, Chang, Yu, Tao, Yuxiao, Yang, Zhenguo, and Wu, Haiping, "Self-healing isotropical conductive adhesives filled with Ag nanowires," Materials Chemistry and Physics, vol. 148 no. 3, pp. 778-782, Dec. 15, 2014. https://doi.org/10.1016/j.matchemphys.2014.08.048

Tarr, Greg, "CE Industry Intensifies Green Programs TV Makers Push Recycling Efforts," TWICE, Mar. 30, 2009.

Tarzwell, Robert, and Bahl, Ken, "Bleeding Edge: Extreme Printed Circuit Boards -- "Down the Hole"," PCB007, Sept. 25, 2006.

Tarzwell, Robert, and Bahl, Ken, "The Occam Process: One PCB Fabricator's Perspective," PCB007 , Oct. 19, 2007.

Tasaki, Tomohiro, Oguchi, Masahiro, Kameya, Takashi, and Urano, Kohei, "Screening of Metals in Waste Electrical and Electronic Equipment Using Simple Assessment Methods," Journal of Industrial Ecology, vol. 11 no. 4, pp. 64-84, Fall 2007.

Tasaki, Tomohiro, and Oguchi, Masahiro, "Two Estimation Methods for Average Domestic Lifespan of Products," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 365.

Tasdemir, Zuhal, Peric, Oliver, Sacchetto, Davide, Fantner, Georg Ernest, Leblebici, Yusuf, and Alaca, B. Erdem, "Monolithic Fabrication of Silicon Nanowires Bridging Thick Silicon Structures," IEEE Nanotechnology Express, vol. 1, pp. 2-5, 2015.

Tashiro, Naoki, Kariya, Yoshiharu, and Kanda, Yoshihiko, "Fatigue life and fracture behavior of micro size Sn-Ag-Cu solder joint," Proceedings of the ASME Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS, Volume 2, Portland, OR, July 6-8, 2011, pp. 707-712.

Tashiro, Tomoya, Zhang, Hui, Oshima, Kakeru, Sakurai, Yuya, Suzuki, Takaaki, Ohshima, Noriyasu, Izumi, Takashi, and Sone, Hayato, "Fabrication of N-Type Silicon Nanowire Biosensor for Sub-10-Femtomolar Concentration of Immunoglobulin," Key Engineering Materials, vol. 790, pp. 28-33, Nov. 2018.

Tasooji, Amaneh, Lara, Leticia, and Lee, Kyuoh, "Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints," Journal of Electronic Materials, vol. 43 no. 12, pp. 4386-4394, Dec. 2014.

Tatebayashi, J., Ota, Y., Ishida, S., Nishioka, M., Iwamoto, S., and Arakawa, Y., "Formation and optical properties of multi-stack InGaAs quantum dots embedded in GaAs nanowires by selective metalorganic chemical vapor deposition," Journal of Crystal Growth, vol. 370, pp. 299-302, May 1, 2013.

Tateyama, Kazuki, Ubukata, Hiroshi, Yamaoka, Yoji, Takahashi, Kuniaki, Yamada, Hiroshi, and Saito, Masayuki, "Effects of Bi Content on Mechanical Properties and Bump Interconnection Reliability of Sn-Ag Solder Alloys," 1999 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 3906), Chicago, IL, Oct. 26-28, 1999, pp. 722-727.

Tateyama, Kazuki, Ubukata, Hiroshi, Yamaoka, Yoji, Takahashi, Kuniaki, Yamada, Hiroshi, and Saito, Masayuki, "Effects of Bi Content on Mechanical Properties and Bump Interconnection Reliability of Sn-Ag Solder Alloys," The International Journal of Microcircuits and Electronic Packaging, vol. 23 no. 1, pp. 131-137, 1st Quarter 2000.

Tauchmann, Jens, Schaller, Karl-Heinz, and Kirmse, Torsten, "Solderability of Lead Free Metallizations on Board- and Component-level under Different Atmospheres, Especially Nitrogen," 2000 Emerging Technologies Conference Proceedings, 2000, pp. xx-xx.

Taupin, M., Mannila, E., Krogstrup, P., Maisi, V. F., Nguyen, H., Albrecht, S. M., Nygard, J., Marcus, C. M., and Pekola, J. P., "InAs Nanowire with Epitaxial Aluminum as a Single-Electron Transistor with Fixed Tunnel Barriers," Physical Review Applied, vol. 6 no. 5, pp. 054017-1-054017-7, Nov. 2016.

Tavakoli, Mehdi, "What are the advantages - and, if any, the disadvantages - of electrically conductive adhesives (ECAs)?," Connect, 2007.

Tay, A. A. O., Ma, Y., Nakamura, T., and Ong, S. H., "A Numerical and Experimental Study of Delamination of Polymer-metal Interfaces in Plastic Packages at Solder Reflow Temperatures," The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 245-252.

Tay, A. A. O., and Lin, T. Y., "Moisture Diffusion and Heat Transfer in Plastic IC Packages," InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V , Orlando, FL, May 29-June 1, 1996, pp. 67-73.

Tay, S. L., Haseeb, A. S. M. A., and Johan, Mohd Rafie, "Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing," Soldering & Surface Mount Technology, vol. 23 no. 1, pp. 10-14, 2011.

Tay, S. L., Haseeb, A. S. M. A., and Johan, Mohd Rafie, "Effect of Addition Cobalt Nanoparticles on Sn-Ag-Cu Lead-free Solder," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 433-436.

Tay, S. L., Haseeb, A. S. M. A., and Johan, Mohd Rafie, "Effect of Aging Time on Interfacial Microstructure of Sn-3.8Ag-0.7Cu Solder Reinforced with Co Nanoparticles," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 655-661.

Tay, S. L., Haseeb, A. S. M. A., Johan, Mohd Rafie, Munroe, P. R., and Quadir, M. Z., "Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn-3.8Ag-0.7Cu lead-free solder and copper substrate," Intermetallics, vol. 33, pp. 8-15, Feb. 2013.

Tayal, Shubham, and Nandi, Ashutosh, "Optimization of gate-stack in junctionless Si-nanotube FET for analog/RF applications," Materials Science in Semiconductor Processing, vol. 80, pp. 63-67, June 15, 2018.

Tayeb, Shaikh A., and French, Joanna L., "Air Permitting for Hard Chromium Electroplating Facilities Based on Maximum Achievable Control Technology (MACT) Standard," Metal Finishing, vol. 106 no. 11, pp. 33-39, Nov. 2008.

Taylor, Colleen, "Company calls for US version of RoHS," Electronics Weekly, Sept. 20, 2006.

Taylor, Colleen, "EIA proposes U.S. framework to regulate e-waste," Electronic News , May 25, 2007.

Taylor, Colleen, "Industry and government heavyweights team up to tackle electronic waste," Electronic News, Mar. 6, 2007.

Taylor, Colleen, "NSAI launches RoHS compliance assurance program," Electronic News , Oct. 18, 2007.

Taylor, Colleen, "Support Swells for U.S. Version of RoHS," Electronic News, Dec. 27, 2006.

Taylor, Colleen, "Task Force Forms for OEMs Exempt from RoHS," Electronic News , Nov. 9, 2006.

Taylor, Don, "Producing RoHS-Compliant Assemblies at SMC," Circuits Assembly , vol. 17 no. 6, pp. 22, 24, June 2006.

Taylor, Edward, "QPQ: Salt Treatment That Prevents Corrosion," Metal Progress, vol. 124 no. 2, pp. 21-25, July 1983.

Taylor, Michael, "Design for Green: LAMINATES," Printed Circuit Design and Fab , vol. 25 no. 9, pp. 22-25, Sept. 2008.

Tead, Stanley, Murray, Cameron, and Rudman, Bob, "Conductive Adhesive Films Based on New Hybrid Adhesive Technologies," IPC Printed Circuits Expo 1999, Long Beach, CA, Mar. 14-18, 1999, pp. S04-5-1-S04-5-4.

Tead, Stanley, and Murray, Cameron, "New Conductive Adhesive Films for Interconnecting and Grounding," Proceedings of SPIE - The International Society for Optical Engineering Volume 3906 / 1999 International Symposium on Microelectronics, Chicago, IL, Oct. 26-28, 1999, pp. 45-51.

Tead, Stanley, Murray, Cameron, and Rudman. Bob, "Using Conductive Adhesives for Grounding Applications," Circuits Assembly, vol. 11 no. 2, pp. 46,48,50,52-53, Feb. 2000.

Teague, Paul, "'Green' is good business," Purchasing, vol. 134 no. 19, pp. xx-xx, Nov. 17, 2005.

Teague, Paul, "Manufacturers deserve better," Purchasing, vol. xx no. xx, pp. xx-xx, June 15, 2006.

Teague, Paul, "Note to the EU: Get the lead out," Purchasing, vol. 134 no. 11, pp. xx-xx, June 16, 2005.

Tee, Tong Yan, Tan, Long Bin, Anderson, Rex, Ng, Hun Shen, Low, Jim Hee, Khoo, Choong Peng, Moody, Robert, and Rogers, Boyd, "Advanced Analysis of WLCSP Copper Interconnect Reliability under Board Level Drop Test," 2008 10th Electronics Packaging Technology Conference , Singapore, Dec. 9-12, 2008, pp. 1086-1095.

Tee, Tong Yan, Ng, Hun Shen, and Zhong, Zhaowei, "Board level solder joint reliability analysis of stacked-die mixed flip-chip and wirebond BGA," Microelectronics Reliability, vol. 46 no. 12, pp. 2131-2138, Dec. 2006.

Tee, Tong Yan, Ng, Hun Shen, Syed, Ahmer, Anderson, Rex, Khoo, Choong Peng, and Rogers, Boyd, "Design for Board Trace Reliability of WLCSP under Drop Test," 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, Delft, Netherlands, Apr. 26-29, 2009, pp. xx-xx.

Tegehall, Per-Erik, "IMC Layers Formed with Various Combinations of Solders and Surface Finishes and Their Effect on Solder Joint Reliability," 4th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Aalborg, Denmark, May 29, 2013.

Tegehall, Per-Erik, and Wetter, Goran, "Impact of cracks in the PCB laminate during thermal cycling on the fatigue lives of solder joints," 7th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Portsmouth, United Kingdom, Apr. 13-14, 2016, pp. xx-xx.

Tegehall, Per-Erik, and Wetter, Goran, "Impact of laminate cracks under solder pads on the fatigue lives of ball grid array solder joints," Microelectronics Reliability, vol. 55 no. 11, pp. 2354-2370, Nov. 2015.

Tegehall, Per-Erik, "Impact of Surface Finish, Solder Volume and Solder Composition on the Grain Structure of SnAgCu Solder Joints," 2020 IEEE 8th Electronics System-Integration Technology Conference, Tonsberg, Norway, Sept. 15-18, 2020, pp. xx-xx.

Teh, L. K., Teo, M., Anto, E., Wong, C. C., Mhaisalkar, S. G., Teo, P. S., and Wong, E. H., "Moisture-Induced Failures of Adhesive Flip Chip Interconnects," IEEE Transactions on Components and Packaging Technologies, vol. 28 no. 3, pp. 506-516, Sept. 2005.

Teh, Lay Kuan, Wong, Chee Cheong, Mhaisalkar Subodh, Ong Kristine, Teo, Poi Siong, and Wong Ee Hua, "Characterization of Nonconductive Adhesives for Flip-Chip Interconnection," Journal of Electronic Materials, vol. 33 no. 4, pp. 271-276, Apr. 2004.

Tejedor, M., and Fuertes, J. F., "Ferromagnetic domains in [110] iron whiskers," Journal of Applied Physics, vol. 55 no. 4, pp. 1226-1228, Feb. 15, 1984.

Tejedor, M., and Fuertes, J. F., "Serrated Faces in [110] Iron Whiskers," Journal of Crystal Growth , vol. 76 no. 1, pp. 185-191, July 1986.

Telang, A. U., and Bieler, T. R., "Characterization of microstructure and crystal orientation of the tin phase in single shear lap Sn-3.5Ag solder joint specimens," Scripta Materialia, vol. 52 no. 10, pp. 1027-1031, May 2005.

Telang, A. U., Bieler, T. R., Mason. D. E., and Subramanian, K. N., "Comparisons of Experimental and Computed Crystal Rotations Caused by Slip in Crept and Thermomechanically Fatigued Dual-Shear Eutectic Sn-Ag Solder Joints," Journal of Electronic Materials, vol. 32 no. 12, pp. 1455-1462, Dec. 2003.

Telang, A. U., and Bieler, T. R., "Dislocation Activity and Slip Analysis Contributing to Grain Boundary Sliding and Damage During Thermomechanical Fatigue in Dual Shear Lead-Free Solder Joint Specimens," Diffusion and Defect Data Pt.B: Solid State Phenomena, vol. 105, pp. 219-226, 2005.

Telang, A. U., and Bieler, T. R., "Dislocation Activity and Slip Analysis Contributing to Grain Boundary Sliding and Damage During Thermomechanical Fatigue in Dual Shear Lead-Free Solder Joint Specimens," Solid State Phenomena, vol. 105, pp. 219-226, July 2005.

Telang, A. U., Bieler, T. R., Lucas, J. P., Subramanian, K. N., Lehman, L. P., Xing, Y., and Cotts, E. J., "Grain-Boundary Character and Grain Growth in Bulk Tin and Bulk Lead-Free Solder Alloys," Journal of Electronic Materials, vol. 33 no. 12, pp. 1412-1423, Dec. 2004.

Telang, A. U., Bieler, T. R., and Crimp, M. A., "Grain boundary sliding on near-7°, 14°, and 22° special boundaries during thermomechanical cycling in surface-mount lead-free solder joint specimens," Materials Science and Engineering A, vol. 421 no. 1-2, pp. 22-34, Apr. 15, 2006.

Telang, A. U., Bieler, T. R., Zamiri, A., and Pourboghrat, F., "Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint," Acta Materialia, vol. 55 no. 7, pp. 2265-2277, Apr. 2007.

Telang, A. U., Bieler, T. R., Choi, S., and Subramanian, K. N., "Orientation imaging studies of Sn-based electronic solder joints," Journal of Materials Research, vol. 17 no. 9, pp. 2294-2306, Sept. 2002.

Telang, A. U., and Bieler, T. R., "The Orientation Imaging Microscopy of Lead-Free Sn-Ag Solder Joints," JOM, vol. 57 no. 6, pp. 44-49, June 2005.

Telang, Adwait U., and Bieler, Thomas R., "The Role of Special Boundaries During Solidification and Microstructure Evolution in Lead Free Solder Joints," Materials Science Forum, vol. 495-497, pp. 1419-1424, Sept. 2005.

Teliszewski, Steven, "Development and Testing of a Lead-Free Low Melting Point Alloy," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Teliszewski, Steven, Lauwaert, Ralph, and Vandevelde, Bart, "Effect of a Ductile, Low Melting Point Alloy on the Hot Tear Defect on Lead-Free Ball Grid Arrays," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 312-318.

Tellefsen, Karen, and Holtzer, Mitch, "Evaluating the Electrical and the Mechanical Reliability of Soldering Materials," International Conference on Soldering and Reliability , Toronto, Ontario, Canada, May 16-18, 2012, pp. xx-xx.

Tello, Juan S., Bower, Allan F., Chason, Eric, and Sheldon, Brian W., "Kinetic Model of Stress Evolution during Coalescence and Growth of Polycrystalline Thin Films," Physical Review Letters, vol. 98 no. 21, pp. 216104-1-216104-4, May 25, 2007.

Telychkina, Oksana, Boehme, Bjoern, Heimann, Matthias, Morris, James E., and Wolter, Klaus-Juergen, "Study of Nanosilver Filled Conductive Adhesives and Pastes for Electronics Packaging," 32nd International Spring Seminar on Electronics Technology , Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.

Tench, D. Morgan, Jambazian, and Anderson, Dennis, "Solderability Assessment of Circuit Boards and Lead Finishes," Surface Mount International Proceedings of the Technical Program, San Jose, CA, Aug. 29-31, 1995, pp. 529-535.

Tench, D. M., Anderson, D. P., Lucey, G. K., Piekarski, B., and Lichtenberg, L., "Solderability Degradation by Steam Aging," Plating & Surface Finishing, vol. 80 no. 9, pp. 75-78, Sept. 1993.

Teng, S. Y., and Priore, S., "Comparative Study of Next-Generation Surface Finishes for Printed Circuit Assembly," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 973-980.

Teng, Sue, Oliver, J., and Priore, Scott, "Manufacturability Assessment of Next-Generation PCB Surface Finishes," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 1058-1063.

Tennant, Gail, Kelly, Matt, Rothschild, Wayne, and Khan, Arshad, "Lead Free Laminates: Surviving Assembly & Rework Processes to Deliver High Quality and High Reliability Products," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Tenya, Yuichi, and Adams, Tom, "Lead-free Processing: Thermal Effect on Components," Surface Mount Technology (SMT), vol. 14 no. 11, pp. 68-81, Nov. 2000.

Teo, J. W. Ronnie, Ng, F. L., Goi, L. S. Kip, Sun, Y. F., Wang, Z. F., Shi, X. Q., Wei, J., and Li, G. Y., "Microstructure of eutectic 80Au/20Sn solder joint in laser diode package" Microelectronic Engineering, vol. 85 no. 3, pp. 512-517, Mar. 2008.

Teo, J. W. Ronnie, Li, G. Y., Ling, M. S., Wang, Z. F., and Shi, X. Q., "Parametic investigation of laser diode bonding using eutectic AuSn solder," Thin Solid Films, vol. 515 no. 10, pp. 4340-4343, 2006.

Teo, J. W. Ronnie, and Sun,, Y. F., "Spalling behavior of interfacial intermetallic compounds in Pb-free solder joints subjected to temperature cycling loading," Acta Materialia , vol. 56 no. 2, pp. 242-249, Jan. 2008.

Teo, J. W. Ronnie, "Thermal Cycling Aging Effect on the Reliability and Morphological Evolution of SnAgCu Solder Joints," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 4, pp. 279-284, Oct. 2007.

Teo, Mary, and Lee, Charles, "Characterization of Fast Cure Anisotropic Conductive and Non-Conductive Adhesives," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Teo, Mary, Mhaisalkar, Subodh G., Wong, E. H., Teo, Poi-Siong, Wong, C. C., Ong, Kristine, Goh, Chin Foo, and Teh, Lay Kuan, "Correlation of Material Properties to Reliability Performance of Anisotropic Conductive Adhesive Flip Chip Packages," IEEE Transactions on Components and Packaging Technologies, vol. 28 no. 1, pp. 157-164, Mar. 2005.

Teo, Mary, "Novel Techniques for Characterization of Fast-Cure Anisotropic Conductive and Non-conductive Adhesives," Journal of Adhesion Science and Technology , vol. 22 no. 8-9, pp. 1003-1015, 2008.

Teodorescu, V., and Birjega, M. I., "Whiskers Formed in the Thin Epitaxial Au Film Growth Process," Revue Roumaine de Physique, vol. 22 no. 3, pp. 261-262+, 1977.

Terasaki, Takeshi, Iwasaki, Tomio, Okura, Yasutaka, Suzuki, Tomohisa, Kato, Takahiko, Nakamura, Masato, and Hashimoto, Tomoaki, "Evaluation of Tin-whisker Growth During Thermal-cycle Testing Using Stress- and Mass-diffusion Analysis," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 277-284.

Terasaki, Takeshi, Kato, Takahiko, Iwasaki, Tomio, Ookura, Yasutaka, Nakamura, Masato, Ishii, Hideki, and Yamamoto, Kenji, "Prediction of Tin-Whiskers Generation during Thermal Cycle Test Using Stress and Mass-Diffusion Analysis," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 1183-1189.

Terashima, S., Kobayashi, T., and Tanaka, M., "Effect of crystallographic anisotropy of b-tin grains on thermal fatigue properties of Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu lead free solder interconnects," Science and Technology of Welding and Joining, vol. 13 no. 8, pp. 732-738, Nov. 2008.

Terashima, S., and Tanaka, M., "Effect of fine dispersoids and anisotropic nature of b-Sn on thermal fatigue properties of flip chips connected by Sn-xAg-0.5Cu (x: 1, 3 and 4 mass-%) lead free solders," Science and Technology of Welding and Joining , vol. 14 no. 5, pp. 767-774, July 2009.

Terashima, S., Kohno, T., Mizusawa, A., Arai, K., Okada, O., Wakabayashi, T., Tanaka, M., and Tatsumi, K., "Improvement of Thermal Fatigue Properties of Sn-Ag-Cu Lead-Free Solder Interconnects on Casio's Wafer-Level Packages Based on Morphology and Grain Boundary Character," Journal of Electronic Materials, vol. 38 no. 1, pp. 33-38, Jan. 2009.

Terashima, S., Tanaka, M., and Tatsumi, K., "Thermal fatigue properties and grain boundary character distribution in Sn-xAg-0.5Cu (x = 1, 1.2 and 3) lead free solder interconnects," Science and Technology of Welding and Joining, vol. 13 no. 1, pp. 60-65, Feb. 2008.

Terashima, Shinichi, and Ishikawa, Shinji, "Effect of Dispersoids in b-Sn Matrix on Creep Properties of Chip Scale Packages Joined by Sn-xAg-0.5 mass%Cu (x = 1, 2, 3 and 4 mass%) Solder Alloys," Materials Transactions, vol. 56 no. 4, pp. 507-512, 2015.

Terashima, Shinichi, Kariya, Yoshiharu, Hosoi, Takuya, and Tanaka, Masamoto, "Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip-Chip Interconnects," Journal of Electronic Materials, vol. 32 no. 12, pp. 1527-1533, Dec. 2003.

Terashima, Shinichi, Uno, Tomohiro, Hashino, Eiji, and Tatsumi, Kohei, "Improvement in Thermal Reliability of a Flip Chip Interconnection System Joined by Pb-Free Solder and Au bumps," Materials Transactions, vol. 42 no. 5, pp. 803-808, May 2001.

Terashima, Shinichi, Kariya, Yoshiharu, and Tanaka, Masamoto, "Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition," Materials Transactions, vol. 45 no. 3, pp. 673-680, Mar. 2004.

Terashima, Shinichi, and Sasaki, Tsutomu, "Prediction of Intermetallic Compound Formation Sequences in Pseudo Binary Diffusion Couples: Experimental Examinations for (Sn-xZn)/Cu (x = 2, 5, 10, 15, 20 and 25 mass%) by a Kinetic Model with Thermodynamic Data Using MDR Diagram," Materials Transactions, vol. 55 no. 11, pp. 1750-1754, 2014.

Terashima, Shinichi, and Tanaka, Masamoto, "Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-xNi Flip Chip Interconnects," Materials Transactions, vol. 45 no. 3, pp. 681-688, Mar. 2004.

Teredesai, Amey, Santos, D. L., Belmonte, J., Rae, A., and Chouta, P., "A Study of the Self-Centering Phenomenon in Pb-Free Surface Mount Assembly," 2004 Pan Pacific Symposium Conference Proceedings, Kahuku, Oahu, Hawaii, Feb. 10-12, 2004, pp. xx-xx.

Teredesai, Amey, and Batalha, Tony, "Challenges Associated with Concurrent Manufacturing (Pb-Based & Pb-Free) in an EMS Environment," 2005 SMTA International Conference Proceedings , Chicago, IL, Sept. 25-29, 2005, pp. 704-711.

Teredesai, Amey, and Batalha, Tony. "Concurrent Manufacturing in an EMS Environment," Circuits Assembly , vol. 17 no. 3, pp. 36-38, 40-41, Mar. 2006.

Teredesai, Amey, Aravamudhan, Srinivasa, Belmonte, Joe, and Szymanowski, Richard, "Self-Centering of Offset Chip Components in a Pb-free Assembly."

Teresko, John, "EU Compliance? UL's Solution," Industry Week, vol. 254 no. 2, pp. 18, Feb. 2005.

Teresko, John, "RoHS -- Don't Ignore The Opportunities," Industry Week, vol. x no. x, pp. xx-xx, Dec. 2006.

Teresko, John, "Still Not RoHS Compliant?," Industry Week, vol. x, no. x, pp. xx-xx, Dec. 2006.

Terhell, J. C. J. M., and Lieth, R. M. A., "The Growth and Structure Determination of GaSe Needle Crystals," Journal of Crystal Growth, vol. 16 no. 1, pp. 54-58, Oct. 1972.

Ternes, Randal l., "Conductive Anodic Filament Study: Laminates and Pb-Free Processing," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 335-340.

Tersztyanszky, Laszlo, "Differences between solder bonds made with SnPbAg and SnAgCu solders," 27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, Volume 3, Sofia, Bulgaria, May 13-16, 2004, pp. 467-470.

Tersztyanszky, Laszlo, and Illes, Balazs, "Incompatibility Problems in Soldering Technology," 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, Vienna, Austria, May 19-20, 2005, pp. 106-112.

Terzieff. Peter, Hindler, Michael, Mikula, Adolf, and Ipser, Herbert, "Thermodynamics of liquid Au-Sb-Sn," International Journal of Materials Research, vol. 103 no. 12, pp. 1462-1468, Dec. 2012.

Tetsopgang, Samuel, and Kuepouo, Gilbert, "Quantification and characterization of discarded batteries in Yaounde, from the perspective of health, safety and environmental protection," Resources, Conservation, and Recycling, vol. 52 no. 8-9, pp. 1077-1081, July 2008.

Teutsch, Thorsten, "Lead-free Impact on Wafer Bumping & Wafer-level Packaging," Advanced Packaging, vol. 14 no. 11, pp. 14, Nov. 2005.

Teutsch, Thorsten, Blankenhorn, Ronald G., and Zakel, Elke, "Lead-Free Solder Bumping Process for High Temperature Automotive Application," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1468-1471.

Teutsch, Thorsten, Oppert, Thomas, Zakel, Elke, Klusmann, Eckart, Meyer, Heinrich, Schulz, Ralf, and Schulze, Jorg, "Wafer Level CSP using Low Cost Electroless Redistribution Layer," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 107-113.

Teverovsky, Alexander, "Gold Whiskers: Introducing a New Member to the Family," NASA, Apr. 2003.

Teverovsky, Alexander, "Introducing a New Member to the Family: Gold Whiskers." NASA, Apr. 2003.

Teverovsky, Alexander, "Whisker-like Defects on Aluminum Wire Bonds," GSFC, NASA, Parts Analysis Lab, Sept. 2006.

Thackeray, M. M., Vaughey, J. T., Johnson, C. S., Kropf, A. J., Benedek, R., Fransson, L. M. L., and Edstrom, K., "Structural considerations of intermetallic electrodes for lithium batteries," Journal of Power Sources, vol. 113 no. 1, pp. 124-130, Jan. 1, 2003.

Thambi, J., Tetzlaff, U., Schiessl, A., Lang, K-D., and Waltz, M., "High cycle fatigue behaviour and generalized fatigue model development of lead-free solder alloy based on local stress approach," Microelectronics Reliability, vol. 66, pp. 98-105, Nov. 2016.

Thambi, Joel, Schiessl, Andreas, Waltz, Manuela, Lang, Klaus-Dieter, and Tetzlaff, Ulrich, "Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys," Journal of Electronic Packaging, vol. 139 no. 3, pp. 031002-1-031002-10, Sept. 2017.

Thanachayanont, C., and Ramungul, N., "Low-Cost Lead-Free Solder for EE Industries," 2002 IEEE International Conference on Industrial Technology, Volume 2, Bankok, Thailand, Dec. 11-14, 2002, pp. 1213-1218.

Tharp, James W., "Western Electric's Tin-Lead Plating," Products Finishing, vol. 37 no. 11, pp. 54-59, Aug. 1973.

Thein, George, Geiger, David, and Kurwa, Murad, "Study of Various PCBA Surface Finishes," Printed Circuit Design and Fab/ Circuits Assembly, vol. 31 no. 9, pp. 47-50,54, Sept. 2014.

Thein, Georgie, Geiger, David, and Kurwa, Murad, "Study of Various PCBA Surface Finishes," IPC APEX Expo 2014, Las Vegas, NV, Mar. 25-27, 2014, pp. xx-xx.

Theng, A. L., Goh, W. L., Lo, G. Q., Chan, L., and Ng, C. M., "Dual Nanowire Silicon MOSFET With Silicon Bridge and TaN Gate," IEEE Transactions on Nanotechnology, vol. 7 no. 6, pp. 795-799, Nov. 2008.

Theriault, Martin, and Rahn, Armin, "New Avenues for Wave Soldering and Lead-Free Conversion," Circuits Assembly, vol. 13 no. 4, pp. 34-36, Apr. 2002.

Theriault, M., Blostein, P., and Rahn, A., "Nitrogen and Soldering: Reviewing the Issue of Inerting," Surface Mount Technology (SMT), vol. 14 no. 6, pp. xx-xx, June 2000.

Theuss, H., Pressel, K., Paulus, S., Kilger, T., Dangelmaier, J., Lehner, R., Eisener, B., Kiendl, H., Schischka, J., Graff, A., and Petzold, M., "A Highly Reliable Flip Chip Solution Based on Electroplated AuSn Bumps in a Leadless Package," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 272-279.

Theuss, Horst, Kilger, Thomas, and Ort, Thomas, "Solder Joint Reliability of Lead-Free Solder Balls Assembled with SnPb Solder Paste," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 331-337.

Thewlis, J., and Davey, A. R., "Thermal Expansion of Grey Tin," Nature, vol. 274 no. 4439, pp. 1011, Nov. 27, 1954. https://doi-org.ezproxy.uky.edu/10.1038/1741011a0

Thibodeau, Patrick, "Satellite failure is a wake-up call to users," Computerworld , vol. xx no. xx, pp. xx-xx, May 25, 1998.

Thibodeau, Patrick, "Satellite glitch spawns big headaches," Computerworld, vol. xx no. xx, pp. xx-xx, May 20, 1998.

Thiebaud, Esther, Hilty, Lorenz M., Schluep, Mathias, and Faulstich, Martin, "Use, Storage, and Disposal of Electronic Equipment in Switzerland," Environmental Science & Technology, vol. 51 no. 8, pp. 4494-4502, Apr. 18, 2017.

Thirugnanasambandam, Sivasubramanian, Sanders, Thomas, Evans, John, Bozack, Michael, Johnson, Wayne, and Suhling, Jeff, "Component Level Reliability for High Temperature Power Computing with SAC305 and Alternative High Reliability Solders," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 262-270.

Thirugnanasambandam, Sivasubramanian, Zhang, Jiawei, Evans, John, Xie, Fei, Perry, Matt, Lewis, Brian, Baldwin, Daniel, Stahn, Kent, and Roy, Michel, "Component Level Reliability on Different Dimensions of Lead Free Wafer Level Chip Scale Packages Subjected to Extreme Temperatures," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 612-618.

Thirugnanasambandam, Sivasubramanian, Vijayakumar, Namo, Zhang, Jiawei, Evans, John, Xie, Fei, and Baldwin, Daniel F., "Drop Reliability Test on Different Dimensional Lead-Free Wafer Level Chip Scale Packages," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 7-15.

Thirugnanasambandam, Sivasubramanian, Raj, Anto, Stone, Derrick, Sanders, Thomas, Sridhar, Sharath, Gordon, Seth, Evans, John, Megahed, Fadel, Flowers, George, Bozack, Michael, Johnson, Wayne, and Carpenter, Mark, "Proportional Hazard Model of Doped Low Creep Lead Free Solder Paste under Vibration," 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 31-June 3, 2016, pp. 1209-1217.

Thissandier, F., Dupre, L., Gentile, P., Brousse, T., Bidan, G., Buttard, D., and Sadki, S., "Ultra-dense and highly doped SiNWs for micro-supercapacitors electrodes," Electrochimica Acta, vol. 117, pp. 159-163, Jan. 20, 2014.

Thollier, Karine, and Jansen, Bart, "Reducing life cycle impacts of housing and computers in relation with paper," Journal of Cleaner Production, vol. 16 no. 7, pp. 790-800, May 2008.

Thomas, B., Atkinson, A., and Dashwood, R. J., "Strength of Soldered Joints Formed under Microgravity Conditions," Journal of Electronic Materials, vol. 36 no. 1, pp. 1-5, Jan. 2007.

Thomas, E. E., "Tin Whisker Studies, Observation of Some Hollow Whiskers and Some Sharply Irregular External Forms," Acta Metallurgica, vol. 4 no. 1, pp. 94, Jan. 1956.

Thomas, Joe, "Industry Trends Driving Need for Warpage/Flatness Specifications," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Thomas, Muriel, "Die-attach Materials and Processes," Advanced Packaging, vol. 16 no. 3, pp. 32-34, 36, Apr. 2007.

Thomas, Owen, Hunt, Chris, Wickham, Martin, and Clayton, Kate, "Long Term Monitoring and Failure Detection of Tin Whiskers Bridging Adjacent Leads on SOIC Components," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 711-717.

Thomasson, Conny, "Use of Lead-Free HAL/HASL as surface finish on PCBs increases," evertiq, Jan. 16, 2006.

Thompson, Brad, "Lead-free? Not so fast," Test & Measurement World, vol. 27 no. 9, pp. xx-xx, Oct. 2007.

Thompson, Carl V., and Carel, Roland, "Stress and Grain Growth in Thin Films," Journal of the Mechanics and Physics of Solids, vol. 44 no. 5, pp. 657-673, May 1996.

Thompson, James R., Seto, Ping, Evans, John L., and Davis, Jared A., "A Characterization of Component Reliability on Metalbacked Substrates for Use in Harsh Automotive Environments," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 394-402.

Thompson, James R., Freytag, Jurgen, Senske, Wilhelm, and Wondrak, Wolfgang, "An Automotive Industry's Perspective on High-Temperature Electronics," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Thompson, Terrence E., "Lead-Free Solders Gain Converts - Needed or Not," Chip Scale Review , vol. xx no. xx, pp. xx-xx, Aug. 2003.

Thompson, Terrence E., "Opinion: What's Wrong With Tin-Lead Anyway?," Chip Scale Review , vol. xx no. xx, pp. xx-xx, Aug.-Sept. 2005.

Thompson, Terrence E., "Sort of Pb-free? That's like slightly pregnant!," Chip Scale Review , vol. xx no. xx, pp. xx-xx, Mar. 2006.

Thompson, Terrence E., "The Global Lead-Free Solder Feeding Frenzy: Much Ado About Nothing or Serious Business?," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Aug.-Sept. 2004.

Thompson, Terrence E., "Where the Solder Meets the Pad: Spheres and Ball-Placement Systems Are Setting the Pace," Chip Scale Review,vol. 14 no. 6, pp. 34-38, Aug./Sept. 2007.

Thompson, Valerie, "Are you ready for ecodesign?," EE Times Europe, Feb. 13, 2008.

Thompson, W. A., "Lead whisker growth from the metallic vapor phase," Journal of Chemical Physics, vol. 68 no. 4, pp. 1854-1856, Feb. 15, 1978.

Thomson, Michael D., "Zinc Alloys - the Boeing Alternative to Cadmium," Transactions of the Institute of Metal Finishing, vol. 74 no. 3, pp. 3-5, May 1996.

Thomson, Kirk, "The Boeing Company provides the following comments on the Draft PBDE Chemical Action Plan," Nov. 14, 2004.

Thor, V., Appel, K., Nover, M., and Sommerfeld, P., "Soldered Flip Chip IC's in automotive applications," Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium, Berlin, Germany, Apr. 27-29, 1998, pp. 27-30.

Thorpe, Beverley, "Take It Back West March 1-3, 2004 San Francisco."

Thryft, Ann R., "Military Suppliers Confront the RoHS Challenge," COTS Journal , pp. xx-xx, Feb. 2007.

Thryft, Ann R., "Pins & Vias: Packaging Materials Go Lead-Free," Nikkei Electronics Asia, pp. xx-xx, Mar. 2004.

Thryft, Ann R., "RoHS Complicates Obsolescence Management, EOL," COTS Journal , pp. xx-xx, Mar. 2007.

Thuaire, Aurelie, Reynaud, Patrick, Brun, Christophe, Sordes, Delphine, Carmignani, Corentin, Rolland, Emmanuel, Baillin, Xavier, Cheramy, Severine, and Poupon, Gilles, "Innovative Solutions for the Nanoscale Packaging of Silicon-Based and Biological Nanowires: Development of a Generic Characterization and Integration Platform," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 6 no. 12, pp. 1804-1814, Dec. 2016.

Thumm, Andreas, "Going Lead Free with Vapor Phase Soldering - Lead Free is Still a Challenge for Major Industries," International Conference on Soldering & Reliability 2010 Proceedings, Toronto, Ontario, Canada, May 17-20, 2010, pp. xx-xx.

Thummes, G., Kuckhermann. V., and Mende, H. H., "Effect of sample size on the temperature dependence of the resistivity of copper below 4.2 K," Journal of Physics F: Metal Physics, vol. 15 no. 3, pp. L65-L69, Mar. 1985.

Thwaites, C. J., "The Attainment of Reliability in Modern Soldering Techniques for Electronic Assemblies," International Materials Reviews, vol. 17 no. 1, pp. 149-174, 1972.

Tian, Dewei, and Kutilainen, Terho, "Microstructures in Solder Joints between Sn95.5Ag4Cu0.5 Solder and Ag/Pd Thick Film," Journal of Electronic Materials, vol. 32 no. 3, pp. 152-158, Mar. 2003.

Tian, Dewen, Chen, Hongtao, and Wang, Chunqing, "Effect of thermal aging on microstructure, shear and mechanical shock failures for solder ball bonding joint," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Tian, Fei-fei, and Liu, Zhi-Quan, "The interfacial microstructure and Kirkendall voids in In-48Sn/Cu solder joint," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 907-910.

Tian, Feifei, Pang, Xueyong, Xu, Bo, and Liu, Zhi-Quan, "Evolution and Growth Mechanism of Cu2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging," Journal of Electronic Materials, vol. 49 no. 4, pp. 2651-2659, Apr. 2020.

Tian, Feifei, Liu, Zhi-Quan, Shang, Pan-Ju, and Guo, Jingdong, "Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate," Journal of Alloys and Compounds, vol. 591, pp. 351-355, Apr. 5, 2014.

Tian, Feifei, Shang, Pan-Ju, and Liu, Zhi-Quan, "Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint," Materials Letters, vol. 121, pp. 185-187, Apr. 15, 2014.

Tian, Ji-Li, Zhang, Hua-Yu, and Wang, Hai-Jun, "Preparation and Properties of Silver Nanowire-Based Transparent Conductive Composite Films," Journal of Electronic Materials, vol. 45 no. 6, pp. 3040-3045, June 2016.

Tian, Jun, Hong, Chunfu, Hong, Lihua, Yan, Xiaohui, and Dai, Pinqiang, "Effect of Rare Earth Metals on the Properties of Zn-20Sn High-Temperature Lead-Free Solder," Journal of Electronic Materials, vol. 48 no. 5, pp. 2685-2690, May 2019.

Tian, Jun, Dai, Pinqiang, and Li, Xiaojun, "Interfacial reactions between Cu and Zn20Sn solder doped with minor RE," Journal of Materials Science: Materials in Electronics, vol. 28 no. 22, pp. 17185-17192, Nov. 2017.

Tian, Jun, Kim, Hyoung II, and Gupta, Vijay, "Measurement of solder joint strength in freestanding chip-scale packages using a quantitative laser spallation technique," Journal of Adhesion Science and Technology, vol. 27 no. 8, pp. 835-842, Apr. 2013.

Tian, Jun, and Hao, Hu, "Rapid Growth of Tin Whiskers on the Surface of Sn3.8Ag0.7Cu1.0Y Alloy," Advanced Materials Research, vol. 557-559, pp. 1397-1403, July 2012.

Tian, Jun, Hong, ChunFu, Yan, XiaoHui, Hong, LiHua, and Dai, PinQiang, "Study on microstructure and properties of Zn-20Sn-0.2Ni-xRE solders," Journal of Materials Science: Materials in Electronics, vol. 30 no. 1, pp. 824-831, Jan. 2019.

Tian, Mi, Chen, She-Jun, Wang, Jing, Shi, Tian, Luo, Xiao-Jun, and Mai, bi-Xian, "Atmospheric Deposition of Halogenated Flame Retardants at Urban, E-Waste, and Rural Locations in Southern China," Environmental Science & Technology, vol. 45 no. 11, pp. 4696-4701, June 1, 2011.

Tian, Mi, Chen, She-Jun, Wang, Jing, Luo, Yong, Luo, Xiao-Jun, and Mai, Bi-Xian, "Plant Uptake of Atmospheric Brominated Flame Retardants at an E-Waste Site in Southern China," Environmental Science & Technology, vol. 46 no. 5, pp. 2708-2714, Mar. 2012.

Tian, Mizhe, Gan, Guisheng, Cao, Huadong, Yang, Donghua, Jiang, Liujie, Xia, Daquan, Sun, Pengfei, Liu, Xin, and Wu, Yiping, "Effect of Rapid Thermal Fatigue on Microstructure and Properties of Sn3.0Ag0.5Cu/Cu Solder Bumps," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Tian, Ruyu, Hang, Chunjin, Tian, Yanhong, and Feng, Jiayun, "Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment," Journal of Alloys and Compounds, vol. 777, pp. 463-471, Mar. 10, 2019.

Tian, Ruyu, Hang, Chunjin, Tian, Yanhong, and Zhao, Liyou, "Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock," Materials Science and Engineering: A, vol. 709, pp. 125-133, Jan. 2, 2018.

Tian, Ruyu, Tian, Yanhong, and Wang, Chenxi, "Influence of Low Temperature on Tensile Properties and Fracture Behavior of Sn3Ag0.5Cu Solder Alloy," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 116-118.

Tian, Ruyu, Tian, Yanhong, Wang, Chenxi, and Zhao, Liyou, "Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures," Materials Science and Engineering: A, vol. 684, pp. 697-705, Jan. 27, 2017.

Tian, Ruyu, Hang, Chunjin, Tian, Yanhong, and Zhao, Liyou, "Microstructure evolution and mechanical property of Sn-37Pb and Sn-3.0Ag-0.5Cu BGA solder joints under extreme temperature environment," 2017 18th International Conference on Electronic Packaging Technology , Harbin, China, Aug. 16-19, 2017, pp. 473-476.

Tian, Shuang, Cao, Ruihua, Zhou, Jian, Xue, Feng, Liu, Yushuang, Zhang, Peigen, and Sun, ZhengMing, "A comparative study on the growth behaviors of Sn whiskers and hillocks in a Sn-Al alloy coating under different environments," Journal of Alloys and Compounds, vol. 853, pp. 157101-1-157101-12, Feb. 5, 2021. https://doi.org/10.1016/j.jallcom.2020.157101

Tian, Shuang, Wang, Fengjiang, Li, Dongyang, and He, Peng, "Effect of electromigration of Sn-xAg-Cu solder joints on its microstructure and mechanical properties," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 256-259.

Tian, Shuang, Li, Saipeng, Zhou, Jian, Xue, Feng, Cao, Ruihua, and Wang, Fengjiang, "Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn-0.7Cu solder joints," Journal of Materials Science: Materials in Electronics, vol. 28 no. 21, pp. 16120-16132, Nov. 2017.

Tian, Shuang, Cao, Ruihua, Zhou, Jian, and Xue, Feng, "Effect of interfacial intermetallic compounds morphology on mechanical properties of solder joint with finite element simulation," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 235-239.

Tian, Shuang, Gong, Xiaohua, Zhou, Jian, and Xue, Feng, "Growth behaviors of tin whiskers on Sn-Al coating," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Tian, Shuang, Zhang, Xuemei, Zhou, Jian, and Xue, Feng, "Investigation of microstructure and growth behavior of CoSn3 full intermetallic joints in electronic packaging," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 1051-1054.

Tian, Shuang, Cao, Ruihua, Zhou, Jian, Xue, Feng, Tu, Fuqiang, and Li, Saipeng, "Microstructure and mechanical properties of resistor chip joints fabricated by laser soldering using Sn-58Bi solder on Ni(P)/Cu pads," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 240-243.

Tian, Shuang, Wang, Fengjiang, Wang, Xiaojing, and Li, Dongyang, "Rapid microstructure evolution of structural composite solder joints induced by low-density current stressing," Materials Letters, vol. 172, pp. 153-156, June 1, 2016.

Tian, Shuang, Li, Saipeng, Zhou, Jian, and Xue, Feng, "Thermodynamic characteristics, microstructure and mechanical properties of Sn-0.7Cu-xIn lead-free solder alloy," Journal of Alloys and Compounds , vol. 742, pp. 835-843, Apr. 25, 2018.

Tian, Tian, Gusak, A. M., Liashenko, O. Yu., Han, Jung-Kyu, Choi, Daechul, and Tu, King-Ning, "A New Physical Model for Life Time Prediction of Pb-free Solder Joints in Electromigration Tests," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 741-746.

Tian, Tian, Chen, Kai, Kunz, Martin, Tamura, Nobumichi, Zhan, Chau-Jie, Chang, Tao-Chih, and Tu, King-Ning, "Preferred orientation of 30 um Fine Pitch Sn2.5Ag Micro-bumps Studied by Synchrotron Polychromatic x-ray Laue Microdiffraction," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 882-885.

Tian, Wenya, and Li, Junhui, "Effect of Electromigration and Aging on evolution of interfacial intermetallic compounds in Cu-Solder-Cu solder joints," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 280-285.

Tian, Xia, Cui, Junzhi, and Xiang, Meizhen, "Atomistic Simulations on the Mechanical Behavior of Single-Crystalline Cu Nanowires Under Bending and Torsion Loads," Journal of Computational and Theoretical Nanoscience, vol. 7 no. 6, pp. 1194-1200, June 2010. https://doi.org/10.1166/jctn.2010.1472

Tian, Xia, Cui, Junzhi, Zhang, Chaobo, Ma, Zhidong, Wan, Rui, and Zhang, Qi, "Investigations on the deformation mechanisms of single-crystalline Cu nanowires under bending and torsion," Computational Materials Science , vol. 83, pp. 250-254, Feb. 15, 2014.

Tian, Y. H., Wang, C. Q., and Zhou, W. F., "Evolution of Microstructure of Sn-Ag-Cu Lead-Free Flip Chip Solder Joints During Aging Process," Acta Metallurgica Sinica, vol. 19 no. 4, pp. 301-306, Aug. 2006.

Tian, Yali, Zhou, Wei, and Wu, Ping, "A Density Functional Investigation of the Structural, Elastic and Thermodynamic Properties of the Au-Sn Intermetallics," Journal of Electronic Materials, vol. 45 no. 1, pp. 639-647, Jan. 2016.

Tian, Yali, and Wu, Ping, "First-Principles Study of Substitution of Au for Ni in Ni3Sn4," Journal of Electronic Materials, vol. 47 no. 5, pp. 2600-2608, May 2018.

Tian, Yanhong, Niu, Lina, and Wang, Chunqing, "Analysis of Cu6Sn5 Grain Orientations in Sn3.0Ag0.5Cu Lead-Free Solder Joints," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 353-356.

Tian, Yanhong, Wang, Chunqing, and Chen, Yarong, "Characteristics of Laser Reflow Bumping of Sn3.5Ag and Sn3.5Ag0.5Cu Lead-Free Solder Balls," Journal of Materials Science and Technology, vol. 24 no. 2, pp. 220-226, Mar. 2008.

Tian, Yanhong, Liu, Wei, An, Rong, Zhang, Wei, Niu, Lina, and Wang, Chunqing, "Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test," Journal of Materials Science: Materials in Electronics, vol. 23 no. 1, pp. 136-147, Jan. 2012.

Tian, Yanhong, Hang, Chunjin, Wang, Chunqing, Yang, Shihua, and Lin, Pengrong, "Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing," Materials Science and Engineering: A, vol. 529 no. x, pp. 468-478, 2011.

Tian, Yanhong, Wang, Chunqing, Liu, Wei, and Chen, Yarong, "Effects of Cu Addition on Growth of Au-Sn Intermetallics at Sn-xCu/Au Interface during Aging Process," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Tian, Yanhong, Wang, Chunqing, Liu, Wei, and Chen, Yarong, "Effects of Cu Addition on Growth of Au-Sn Intermetallics at Sn-xCu/Au Interface during Aging Process," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Tian, Yanhong, Liu, Baolei, Zhang, Rui, and Qin, Jingkai, "Electromigration Failure of SnAgCu Lead-free BGA Package Assembled with SnPb Solder Paste," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 892-895.

Tian, Yanhong, Hang, Chunjin, Zhao, Xin, Liu, Baolei, Wang, Ning, and Wang, Chunqing, "Phase transformation and fracture behavior of Cu/In/Cu joints formed by solid-liquid interdiffusion bonding," Journal of Materials Science: Materials in Electronics, vol. 25 no. 9, pp. 4170-4178, Sept. 2014.

Tian, Yanhong, Wang, Chunqing, Yang, Shihua, Lin, Penrong, and Liang, Le, "Shear Fracture Behavior of Sn3.0Ag0.5Cu Solder Joints on Cu Pads with Different Solder Volumes," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Tian, Ye, Liu, Xi, Chow, Justin, Wu, Yi Ping, and Sitaraman, Suresh K., "Comparison of IMC Growth in Flip-Chip Assemblies with 100- and 200-æm-Pitch SAC305 Solder Joints," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 1005-1009.

Tian, Ye, Liu, Xi, Chow, Justin, Wu, Yi Ping, and Sitaraman, Suresh K., "Comparison of Sn-Ag-Cu Solder Alloy Intermetallic Compound Growth Under Different Thermal Excursions for Fine-Pitch Flip-Chip Assemblies," Journal of Electronic Materials, vol. 42 no. 8, pp. 2724-2731, Aug. 2013.

Tian, Ye, Liu, Xi, Chow, Justin, Wu, Yi Ping, and Sitaraman, Suresh K., "Experimental evaluation of SnAgCu solder joint reliability in 100-um pitch flip-chip assemblies," Microelectronics Reliability, vol. 54 no. 5, pp. 939-944, May 2014.

Tian, Ye, Fang, Heng, Ren, Ning, Qiu, Chao, Chen, Fan, and Sitaraman, Suresh, "Intermetallics evolution and its reliability effects on micro-joints in flip chip assemblies," Microelectronics International, vol. 37 no. 3, pp. 117-124, 2020.

Tian, Ye, Ren, Ning, Jian, Xiaoxia, Shang, Shuanjun, and Sitaraman, Suresh. K., "Scaling effect on Ag3Sn growth behaviours in micro-joints for flip chip assemblies," Science & Technology of Welding and Joining, vol. 23 no. 7, pp. 551-557, Oct. 2018.

Tian, Ye, Chow, Justin, Liu, Xi, Wu, Yi Ping, and Sitaraman, Suresh K., "Study of Intermetallic Growth and Kinetics in Fine-Pitch Lead-Free Solder Bumps for Next-Generation Flip-Chip Assemblies." Journal of Electronic Materials, vol. 42 no. 2, pp. 230-239, Feb. 2013.

Tian, Ye, Chow, Justin, Liu, Xi, and Sitaraman, Suresh K., "The size effect on intermetallic microstructure evolution of critical solder joints for flip chip assemblies," Soldering & Surface Mount Technology, vol. 27 no. 4, pp. 178-184, 2015.

Tian, Yee-Kai, and Wong, Mee Chu, Interfacial Morphology Studies of Sn-3.8Ag-0.7Cu alloy on different substrates," Advanced Materials Research, vol. 686, pp. 201-210, Apr. 2013.

Tian, Yingtao, Liu, Changqing, Hutt, David, and Stevens, Bob, "Electrodeposition of Indium Bumps for Ultrafine Pitch Interconnection," Journal of Electronic Materials, vol. 43 no. 2, pp. 594-603, Feb. 2014.

Tian, Yingtao, Liu, Changqing, Hutt, David, and Stevens, Bob, "Electrodeposition of Indium for Bump Bonding," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 2096-2100.

Tian, Yu, Han, Jing, and Guo, Fu, "Effects of b-Sn grain c-axis on electromigration behavior in BGA Sn3.0Ag0.5Cu solder interconnects," Journal of Materials Science: Materials in Electronics, vol. 28 no. 15, pp. 10785-10793, Aug. 2017.

Tian, Yu, Han, Jing, Ma, Limin, and Guo, Fu, "The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn-3.0Ag-0.5Cu solder joints," Microelectronics Reliability, vol. 80, pp. 7-13, Jan. 2018.

Tian, Yu, Wang, Yishu, Guo, Fu, Ma, Limin, and Han, Jing, "The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing," Journal of Electronic Materials, vol. 48 no. 5, pp. 2770-2779, May 2019.

Tian, Yu, Ma, Limin, Wang, Yishu, Guo, Fu, and Sun, Zhijie, "The Growth of Interfacial IMC Layer in SAC0307 Solder Joints with Specific Grain Orientation Under Electrical and Thermal Coupling Fields," Journal of Electronic Materials, vol. 49 no. 1, pp. 202-211, Jan. 2020.

Tianpeng, Li, Ru, Jorcelyn Tan Ying, Breach, C. D., and Hawkins, A., "The Effects of Water Soluble Paste Formulation on the Ball Attach and Ball Shear Failure," International Conference on Soldering & Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.

Tice, Mike, "X-Ray Technology Today: An Overview," Spectroscopy, vol. 22 no. 7, pp. 26-28, July 2007.

Tidecks, R., and Yang, X., "Breakdown of superconductivity in a microcontact between two whiskers - Evidence for discrete excited states of a phase-slip center," Zeitschrift fur Physik B Condensed Matter, vol. 83 no. 1, pp. 119-123, Feb. 1991. https://doi.org/10.1007/BF01314405

Tidecks, R., and Slama, G., "Breakdown of Superconductivity in Current-Carrying Indium Whiskers," Zeitschrift fur Physik B, vol. 37 no. 2, pp. 103-113, June 1980. https://doi.org/10.1007/BF01365366

Tidecks, R., and Meyer, J. D., "Current-Induced Resistive State of Superconducting Tin Whiskers with Indium Impurities," Zeitschrift fur Physik B Condensed Matter, vol. 32 no. 4, pp. 363-374, Dec. 1979. https://doi.org/10.1007/BF02109465

Tidecks, R., "Properties of a Weak Link with Tunable Strength in a Quasi-One-Dimensional Superconductor," Zeitschrift fur Physik B Condensed Matter, vol. 57 no. 2, pp. 127-136, Oct. 1984. https://doi.org/10.1007/BF02071962

Tidecks, R., and von Minnigerode, G., "The Influence of High-Frequency Radiation on the U-I Characteristics of Superconducting Tin Whiskers," Physica Status Solidi (a), vol. 52 no. 2, pp. 421-426, 1979. https://doi-org.ezproxy.uky.edu/10.1002/pssa.2210520208

Tiederle, Viktor, and Mahrle, Joerg, "Lead-free soldering for automotive applications - meeting the reliability requirement," Global SMT and Packaging, vol. 5 no. 9, pp. 16-18, Oct. 2005.

Tiederle, Viktor, and Mahrle, Joerg, "Lead-Free Soldering in Automotive Applications," OnBoard Technology , vol. xx no. xx, pp. 52-54, Oct. 2004.

Tilford, T., Morris, J. E., Ferenets, M., Rajaguru, P. R., Pavuluri, S., Desmulliez, M. P. Y., and Bailey, C., "Numerical Analysis of Polymer Cure Kinetics in Isotropic Conductive Adhesives," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 412-416.

Timberlake, Larry D., Hanson, Mark V., and Edwards, E. Bradley, "A New Non-Halogen Flame-Retardant System for Printed Wiring Boards," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S09-1-1-S09-1-11.

Timsit, Roland S., "On the Melting of Ohmic-Heated Nanowires and Electrical Contacts," 2018 IEEE Holm Conference on Electrical Contacts, Albuquerque, NM, Oct. 14-18, 2018, pp. 373-380.

Tinca, Iulia-Eliza, Rai, Prabhath, and Faller, David, "System-Level Flip-Chip Ball Grid Array Solder Joint Reliability Assessment Under Different Methodologies and Correlation with Accelerated Thermal Cycling Experimental Data," 2020 IEEE 8th Electronics System-Integration Technology Conference, Tonsberg, Norway, Sept. 15-18, 2020, pp. xx-xx.

Tindall, G., "A Zinc Nickel Alloy Electrodeposition Tested to Cadmium Military Specifications," 30th Aerospace/Airline Plating & Metal Finishing Forum, 1994, pp. xx-xx.

Ting-biao, Jiang, Chao, Du, and Long-hui, Xu, "Finite Element Analysis and Fatigue Life Prediction of BGA Mixed Solder Joints," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Tino, Yosiaki, and Mukoyama, Etsuzo, "On the Initial Stage of the Reduction Growth of Iron Whiskers," Japanese Journal of Applied Physics, vol. 8 no. 3, pp. 314-319, Mar. 1969.

Tipton, Leonie, "Distributors Help Designers," Electronic Design, vol. 53 no. 11, pp. 56, May 26, 2005.

Tisdale, Stephen, Long, Gary B., Krabbenhoft, Roger, Papathomas, Kostas, and Fischer, Terry, "iNEMI BFR-Free PCB Materials Evaluation Project Report," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 745-755.

Tisdale, Stephen, Long, Gary B., Krabbenhoft, Roger, Papathomas, Kostas, Fischer, Terry, and Fu, Haley, "iNEMI BFR-free PCB Materials Evaluation Project Report," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Tisdale, Stephen, Pfahl, Robert. C., and Fu, Halay, "iNEMI HFR-free Leadership Program," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 594-597.

Tisdale, Stephen, Davignon, John, Hall, Stephen, Leddige, Mike, Hinaga, Scott, and Senk, David, "iNEMI HFR-free Leadership Project: An Investigation to Identify Technology Limitations Involved in Transitioning to HFR-Free PCB Materials," Electronics Goes Green 2012+, Berlin, Germany, Sept. 9-12, 2012, pp. xx-xx.

Tisdale, Stephen, Long, Gary B., Krabbenhoft, Roger, Papathomas, Kostas, and Fischer, Terry, "iNEMI project evaluates BFR-free PCB materials," Global SMT and Packaging, vol. 9 no. 3, Mar. 2009, pp. 10-12,14-15.

Tishkevich, D. I., Vorobjova, A. I., and Vinnik, D. A., "Template Assisted Ni Nanowires Fabrication," Materials Science Forum , vol. 946, pp. 235-241, Feb. 2019.

Titus, Jon, "Was Lead-Free Solder Worth the Effort?," ECN, vol. 56 no. 2, pp. 32, Feb. 2012.

Tivakornsasithorn, K., Pimpinella, R. E., Nguyen, V., Liu, X., Dobrowolska, M., and Furdyna, J. K., "Magnetic anisotropy of GaAs/Fe/Au core-shell nanowires grown by MBE," Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol. 30 no. 2, pp. 02B115-1-02B115-4, Mar. 2012.

Tjandra, Janto, Wong, C. L., How, James, Peana, Stefan, Mita, Mamoru, and Murakami, Gen, "Au-Sn Microsoldering on Flexible Circuit," Proceedings of the 1997 1st Electronic Packaging Technology Conference, Singapore, Oct. 8-10, 1997, pp. 52-57.

Tobak, Steve, "Junkyard money," Electronics Supply & Manufacturing, Mar. 2005.

Toben, M. P., Martin, J. L., and Russo, R. A., "Palladium-Nickel Electrodeposits - Properties and Selection," Technical Conference Proceedings AESF SUR/FIN, Detroit, MI, June 23-26, 1997, pp. 353-361.

Todd, A. D. W., Dunlap, R. A., and Dahn, J. R., "Mossbauer effect studies of sputter-deposited tin-cobalt and tin-cobalt-carbon alloys," Journal of Alloys and Compounds, vol. 443 no. 1-2, pp. 114-120, Sept. 27, 2007.

Todd, Thomas, "Repair and Rework of Flat-Panel Displays Information Display, vol. 14 no. 11, pp. 12-15, Nov. 1998.

Toffel, Michael W., "The Growing Strategic Importance of End-of-Life Product Management," IEEE Engineering Management Review, vol. 31 no. 3, pp. 61-77, Third Quarter 2003.

Toh, C. H., Liu, Hao, Tu, C. T., Chen, T. D., and Yeo, Jessica, "Interfacial Reactions in Ni-doped SAC105 and SAC405 Solders on Ni-Au Finish during Multiple Reflows," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Toh, C. H., Ooi, C. K., Tan, W. A., Teng, H. J., and Chen, C. K., "Validation of Polymeric Thermal Interface Material for Lead Free Reflow Soldering Semiconductor Packages," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Tohei, Tomotake, Shohji, Ikuo, Yoshizawa, Keisuke, Nishimoto, Masaharu, Kawano, Takayuki, Mizutani, Yumiko, and Ohsaki, Yoshihiko, "Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package with Underfill," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 72 no. 3, pp. 244-248, Mar. 2008.

Tohmyoh, H., Yasuda, M., and Saka, Masumi, "Controlling Ag whisker growth using very thin metallic films," Scripta Materialia, vol. 63 no. 3, pp. 289-292, Aug. 2010.

Tohmyoh, Hironori, Ishikawa, Shoho, Watanabe, Satoshi, Kuroha, Motohisa, and Nakano, Yoshikatsu, "Estimation and visualization of the fatigue life of Pb-free SAC solder bump joints under thermal cycling," Microelectronics Reliability, vol. 53 no. 2, pp. 314-320, Feb. 2013.

Toida, Gou, Shirai, Yukio, Mizumura, Noritsuka, Komagata, Michinori, and Suzuki, Kenichi, "Conductive Adhesives containing Ag-Sn Alloys as Conductive Filler," 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, Oct. 23-26, 2005, pp. 7-12.

Toisawa, Kenta, Hayashi, Yamato, and Takizawa, Hirotsugu, "Synthesis of Highly Concentrated Ag Nanoparticles in a Heterogeneous Solid-Liquid System under Ultrasonic Irradiation," Materials Transactions, vol. 51 no. 10, pp. 1764-1768, 2010.

Tojima, Ken, and Selvaduray, Guna S., "Wetting Force of Lead-Free Solders on Bare Copper and Ni-Pd Coated Copper," Proceedings 2000 HD International Conference on High-Density Interconnect and Systems Packaging (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4217), Denver, CO, Apr. 25-28, 2000, pp. 585-591.

Tojima, Ken, and Selvaduray, Guna S., "Wetting Force of Lead-Free Solders on Bare Copper and Ni-Pd Coated Copper," 2000 International Conference on High-Density Interconnect and Systems Packaging, Denver, CO, Apr. 25-28, 2000, pp. 585-591.

Tokio, Kanae, "Sn Plating to Replace Sn-Pb Plating," Journal of The Surface Finishing Society of Japan, vol. 66 no. 5, pp. 191-194, 2015.

Tokuda, H., Tanaka, Y., Nakagawa, H., Aoyagi, M., Fukuda, K., Ohashi, H., Tsuno, T., Hoshino, T., Namikawa, Y., and Hayashi, H., "Investigation of a Sic Module with a High Operating Temperature for Power Applications," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 931-936.

Tokutomi, Junichiro, Hanazaki, Kenichi, Tsuji, Nobuhiro, and Yanagimoto, Jun, "Change in mechanical properties of fine copper wire manufactured by continuous rotary draw bending process," Journal of Materials Processing Technology, vol. 212 no. 11, pp. 2505-2513, Nov. 2012.

Tokutomi, Junichiro, Hanazaki, Kenichi, Tsuji, Nobuhiro, and Yanagimoto, Jun, "Changes in Mechanical Characteristics of Pre-Annealed Wires of Cu-Sn Alloy Manufactured by Continuous Draw Bending," Materials Transactions, vol. 53 no. 1, pp. 116-122, 2012.

Toleno, Brian, "A Basic Guide to No-Clean Solder Paste," evertiq, Nov. 18, 2005.

Toleno, Brian J., "Alternative Finishes: Failure Modes of Electroless Nickel/Immersion Gold," Electronics Manufacturing Productivity Facility TP 200101, Apr. 2001.

Toleno, Brian "Case Study 2 - Implementation of Pb-free solder paste in a real manufacturing environment," emsnow, Nov. 15, 2005.

Toleno, Brian, "Case Study - Implementation of Pb-free solder paste in a real manufacturing environment," emsnow, Oct. 25, 2005.

Toleno, Brian, "Case Study One - Implementation of Pb-free solder paste in a real manufacturing environment," Henkel Technologies.

Toleno, Brian J., and Chu, Robert, "Electrically conductive adhesives," Adhesives & Sealants Industry, vol. 11 no. 6, pp. 40-43, July-Aug. 2004.

Toleno, Brian, Maslyk, Dan, and Privett, Mark, "Enhancing lead-free CSP solder joints using underfills," EMasia , Apr. 2007.

Toleno, Brian, Carson, George, and Todd, Michael, "Flip-Chip Underfill and Flux Residue Interaction in a Pb-Free Process," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 365-373.

Toleno, Brian J., and Carson, George, "Flip Chip Underfill and Flux Residue with Lead Free," Circuits Assembly, vol. 15 no. 6, pp. 24-29, June 2004.

Toleno, Brian, and Moriya, Jorge, "Implementing Lead-Free: Two Case Studies," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Toleno, Brian, and Mendoza, Jose L., "Isothermal Aging and Intermetallic Growth of Pb-free Joints," International Conference on Lead-free Soldering, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.

Toleno, Brian, and Poole, Neil, "Minimizing Voids in Lead-free Array Packages," Surface Mount Technology (SMT), vol. 21 no. 11, pp. 15-16, Nov. 2007.

Toleno, Brian, "Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers," Henkel Corp. (found 9/30/2020)

Toleno, Brian, "No Lead Material Compatibility in a Pb-free Process," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies , San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Toleno, Brian, "Optimizing Mixed Metal Manufacturing," Circuitnet.

Toleno, Brian, "PCB surface finish options for lead-free manufacturing," emsnow , Feb. 23, 2005.

Toleno, Brian, "SMT step by step STEP 3: Solder Materials," SMT: Surface Mount Technology (SMT), vol. 19 no. 3, pp. 50, Mar. 2005.

Toleno, Brian, "Sn-Pb wetting to Pb-free components - designing reliability into the process," emsnow, May 24, 2005.

Toleno, Brian, and Jackson, Gavin, "The Affect of Flux Chemistry on Voiding in Pb-free Solder Joints," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Toleno, Brian, "The effects of Pb-free solder paste formulation on voiding in reflowed assemblies," emsnow, June 23, 2005.

Toleno, Brian, "The Next Big Thing: Self-Aligning, Pb-free Capable Corner Support for CSPs," Circuitnet.

Toleno, Brian, "Underfills in Pb-Free Assemblies," Circuits Assembly, vol. 16 no. 6, pp. 26, June 2005.

Toleno, Brian, Maslyk, Dan, and White, Tom, "Using Underfills to Enhance Drop Test Reliability of Pb-Free Solder Joints in Advanced Chip Scale Packages," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 376-380.

Toleno, Brian, Maslyk, Dan, and White, Tom, "Using Underfills to Enhance Drop Test Reliability of Pb-Free Solder Joints in Advanced Chip Scale Packages," 2007 Pan Pacific Microelectronics Symposium & Exhibit, Maui, HI, Jan. 30-Feb. 1, 2007, pp. xx-xx.

Toleno, Brian, and Dowds, Steve, "White Paper: Enhancing Pb-free Solder Joint Reliability," Sept. 19, 2006.

Tollady, Chris, "Implementation of the WEEE and RoHS Directives," DTI.

Tollefsen, Torleif Andre, Larsson, Andreas, Lovvik, Ole Martin, and Aasmundtveit, Knut E., "High Temperature Interconnect and Die Attach Technology: Au-Sn SLID Bonding," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 6, pp. 904-914, June 2013.

Tolvgard, Arne, Malmodin, Jens, Liu, Johan, and Lai, Zonghe, "A Reliable and Environmentally Friendly Packaging Technology - Flip Chip Joining Using Anisotropically Conductive Adhesive," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 19-26.

Tomachuk, C. R., Elsner, C. I., Di Sarli, A. R., and Ferraz, O. B., "Corrosion resistance of Cr(III) conversion treatments applied on electrogalvanised steel and subjected to chloride containing media," Materials Chemistry and Physics, vol. 119 no. 1-2, pp. 19-29, Jan. 15, 2010.

Tomas, Hujer, Zdenek, Konarek, Tomas, Novak, and Frantisek, Steiner, "Building of Web-Enable Expert System for Solderability Testing," 2010 33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16, 2010, pp. 506-509.

Tomiello, Kathryn, and Gyorki, John R., "Are you sweating over solder?," Design World , vol. 3 no. 7, pp. 48-52, July 2008.

Tomioka, K., Mohan, P., Noborisaka, J., Hara, S., Motohisa, J., and Fukui, T., "Growth of highly uniform InAs nanowire arrays by selective-area MOVPE," Journal of Crystal Growth, vol. 298, pp. 644-647, Jan. 2007.

Tomioka, Katsuhiro, Ikejiri, Keitaro, Tanaka, Tomotaka, Motohisa, Junichi, Hara, Shinjiroh, Hiruma, Kenji, and Fukui, Takashi, "Selective-area growth of III-V nanowires and their applications," Journal of Materials Research, vol. 26 no. 17, pp. 2127-2141, Sept. 14, 2011.

Tomko, Geoffrey, and McDonald, Karen M., "Environmental fate of hexabromocyclododecane from a new Canadian electronic recycling facility," Journal of Environmental Management, vol. 114, pp. 324-327, Jan. 15, 2013.

Tomlins, P. E., and Levoguer, C., "An Introduction to Electrically Conductive Adhesives and their Current Applications," NPL Report CMMT(A)243, Dec. 1999.

Tomlins, P. E., Nottay, J., and Zou, L., "The Influence Of Thermal Cycling On The Adhesion Of Conformal Coatings," NPL Report CMMT(A)277, July 2000.

Tomlinson, Charles E., "Coating Systems That Compete With Chromates," Proceedings of the 19th AESF/EPA Pollution Prevention and Control Conference, Orlando, FL, Jan. 26-28, 1998, pp. 263-266.

Tomlinson, Charles E., "Evolution of Group IV-A Chromate Alternatives: Survival of the Fittest," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. 383-387.

Tonapi, Sandeep, Borgesen, Peter, and Srihari, K. "Effects of Flux and Reflow Parameters on Lead-Free Flip Chip Assembly," Universal Instruments, July 20, 2004.

Tonapi, Sandeep, Gopakumar, Sunil, Borgesen, Peter, and Srihari, K., "Reliability of Lead-Free Solder Interconnects - A Review," Annual Reliability and Maintainability Symposium 2002 Proceedings, Seattle, WA, Jan. 28-31, 2002, pp. 423-428.

Tong, K. H., Ku, M. T., Hsu, K. L., Tang, Q., Chan, C. Y., and Yee, K. W., "The Evolution of Organic Solderability Preservative (OSP) Process in PCB Application," 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 22-25, 2013, pp. 43-46.

Tong, Quinn K., Markley, Deanna L., Fredrickson, Gerry, Kuder, Richard, and Lu, Daoqiang, "Conductive Adhesives with Stable Contact Resistance and Superior Impact Performance," 1999 Proceedings 49th Electronic Components & Technology Conference, San Diego, CA, June 1-4, 1999, pp. 347-352.

Tong, Quinn K., Markley, Deanna L., Fredrickson, Gerry, Kuder, Richard, and Lu, Daoqiang, "Conductive Adhesives with Stable Contact Resistance And Superior Impact Resistance," 1998 International Symposium on Advanced Packaging Materials, 1998, pp. 261-267.

Tong, Quinn K., Zhang, Eric, Fredrickson, Gerald R., and Schultz, Roseann V., "Novel Conductive Adhesives with Stable Conductivity and High Impact Resistance," 2000 International Symposium on Advanced Packaging Materials , Braselton, GA, Mar. 6-8, 2000, pp. 18-23.

Tong, Quinn K., and Markley, Deanna, Fredrickson, Gerry, and Kuder, Richard, "Recent Advances in Surface Mount Conductive Adhesives (SMCAs) for Solder Replacement," Proceedings of the Technical Program NEPCON West '99, Volume 1, Anaheim, CA, Feb. 23-25, 1999, pp. 350-358.

Tong, Quinn K., and Zhang, Eric, "The Material Science Approaches Utilized to Develop Novel Surface Mount Conductive Adhesives," Proceedings of the Technical Program NEPCON West 2000, Volume 1, Anaheim, CA, Feb. 27-Mar. 2, 2000, pp. 268-274.

Tong, Quinn K., Vona Jr., Samual A., Kuder, Richard, and Shenfield, David, "The Recent Advances in Surface Mount Conductive Adhesives," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 272-277.

Tong, Xin, Lifset, Reid, and Lindhqvist, Thomas, "Extended Producer Responsibility in China: Where Is "Best Practice"?," Journal of Industrial Ecology, vol. 8 no. 4, pp. 6-9, Fall 2004.

Tonge, James S., "Silver Corrosion in High Sulfur Environments," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 931-935.

Tongxiang, Liang, Wenli, Guo, Yinghui, Yan, and Chunhe, Tang, "Electroless plating of silver on graphite powders and the study of its conductive adhesive," International Journal of Adhesion and Adhesives , vol. 28 no. 1-2, pp. 55-58, Jan.-Mar. 2008.

Too, Sean S., Khan, Mohammad, Lim, Kevin, Loo, Mike, Lau, W. C., Nayan, Azlina, Ng, S. F., Peh, B. L., and Goh, Edwin, "Thin-core MCM Assembly Development for High-performance Server Microprocessor," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 517-522.

Toon, John, "Replacing Lead-Based Solder," Adhesives & Sealants Industry , vol. 12 no. 9, pp. 26-28, Sept. 2005.

Topacio, Roden, "Polyimide Restructuring, an Application for Low-K/Ultra-Low-K Die and Lead-Free Bump Integrity Improvement," International Conference on Soldering & Reliability 2010 Proceedings, Toronto, Ontario, Canada, May 17-20, 2010, pp. xx-xx.

Topfer, Oliver, Clauss, Margot, Futterer, Thomas, and Schmitt, Elmar, "Flame Retardants for Engineering Thermoplastics used in Electric and Electronic Equipment like Connectors," Electronics Goes Green 2012+ , Berlin, Germany, Sept. 9-12, 2012, pp. xx-xx.

Topper, Michael, Fischer, Thorsten, Zang, Marcus, Teipel, Ulrich, Fehrenbacher, Ulrich, and Reichl, Herbert, "BCB with Nano-Filled BaSrTiO3 for Thin Film Capacitors," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 784-792.

Torazawa, Naoki, Arai, Shigeo, Shimoyama, Koji, Takase, Yoshihisa, and Saka, Hiroyasu, "Transmission Electron Microscopy of Joints between the Sn-Ag Solder and the Electroless Ni-P of an Electronic Device," Journal of Japan Institute of Metals, vol. 66 no. 2, pp. 47-52, Feb. 2002.

Torazawa, Naoki, Arai, Shigeo, Takase, Yoshihisa, Sasaki, Katuhiro, and Saka, Hiroyasu, "Transmission Electron Microscopy of Solder Joints of Sn-Ag-Cu/Electroless Ni-P and Sn-Ag-Cu-Bi/Electroless Ni-P of an Electronic Device," Journal of Japan Institute of Metals, vol. 66 no. 11, pp. 1122-1130, Nov. 2002.

Torbati-Sarraf, A., Mahmudi, R., Geranmayeh, A. R., and Baradaran-Goorani, A., x "Creep of Lead-Free Sn-3.8Ag and Sn-3.8Ag-0.7Cu Solder Alloy as Replacements of Sn-Pb Solder Used in Microelectronic Packaging," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Toriaga, Allen, and Ramos, Jean, "Green IC Packaging: Options, Challenges and Direction," Advanced Interconnect Technologies.

Toriaga, Allan, and Ramos, Jean, "The Challenges of Qualifying 'Green' Packages," Advanced Packaging , vol. 14 no. 3, pp. 22-24, Mar. 2005.

Torii, Akiko, Takizawa, Minoru, and Sawano, Mitsutoshi, "The Application of Flip Chip Bonding Technology using Anisotropic Conductive Film to the Mobile Communications Terminals," Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium , Apr. 15-17, 1998, pp. 94-99.

Toriyama, Toshiyuki, Tanimoto, Yasutada, and Sugiyama, Susumu, "Characteristics of Silicon Nano Wire as Piezoresistor for Nano Electro Mechanical Systems," 14th IEEE International Conference on Micro Electro Mechanical Systems, Interlaken, Switzerland, Jan. 25, 2001, pp. 305-308.

Toriyama, Toshiyuki, Tanimoto, Yasutada, and Sugiyama, Susumu, "Single Crystal Silicon Nano-Wire Piezoresistors for Mechanical Sensors," Journal of Microelectromechanical Systems, vol. 11 no. 5, pp. 605-611, Oct. 2002.

Tormey, Ellen, Raut, Rahul, Bent, Westin, Pandher, Ranjit, Singh, Bawa, Bhatkal, Ravi, and Kolbe, Justin, "Low Voiding Reliable Solder Interconnects for LED Packages on Metal Core PCBs," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 278-283.

Torp, Dave, "The A-Line: A Standard Day," Surface Mount Technology (SMT), vol. 22 no. 9, pp. 29, Sept. 2008.

Torres, Gabriel, "RoHS Explained," Hardware Secrets, Oct. 11, 2005.

Torretta, Vincenzo, Ragazzi, Marco, Istrate, Irina Aura, and Rada, Elena Cristina, "Management of waste electrical and electronic equipment in two EU countries: A comparison," Waste Management, vol. 33 no. 1, pp. 117-122, Jan. 2013.

Tosaka, Akihiko, Yu, Qiang, Shibutani, Tadahiro, Kondo, Satoshi, and Shiratori, Masaki, "Reliability Evaluation of Lead Free Solder Joints Subjected to Multi-loads," Proceedings of the ASME InterPack Conference, Volume 1, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 547-552.

Toscano, Lenora, "A Brief Summary of Creep Corrosion," Printed Circuit Design and Fab/ Circuits Assembly, vol. 27 no. 10, pp. 24, Oct. 2010.

Toscano, Lenora, and Long, Ernest, "A New Surface Finish for the Electronics Industry," SMTA International 2010 Conference (Presentations), Orlando, FL, Oct. 24-28, 2010.

Toscano, Lenora M., and Long, Ernest, "A New Surface Finish for the Electronics Industry: Electroless Nickel/Immersion Silver," 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 22-24, 2014, pp. 372-378.

Toscano, Lenora, Long, Ernest, and Swanson, John, "Creep Corrosion on PCB Surfaces: Improvements of Predictive Test Methods and Developments Regarding Prevention Techniques," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 634-642.

Toscano, Lenora, and Long, Ernest, "Creeping Corrosion of PWB Surfaces in Harsh Sulfur Containing Environments," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 499-507.

Toscano, Lenora, Swanson, John, Long, Ernest, and Ganjei, John, "Implementing Silver Surface Finishing for Broader Segments of Electronics," South East Asia Technical Training Conference on Electronics Assembly Technologies 2011 Proceedings, Penang, Malaysia, May 19-20, 2011, pp. xx-xx.

Toscano, Lenora, "Surface Analysis for PCB Final Finishes," Printed Circuit Design and Fab/ Circuits Assembly, vol. 28 no. 12, pp. 24, Dec. 2011.

Toscano, Lenora, "The Shift in Surface Finishing," Printed Circuit Design and Fab/ Circuits Assembly, vol 28 no. 7, pp. 24, July 2011.

Toscano, Lenora, "The Universal Finish?," Printed Circuit Design and Fab/ Circuits Assembly, vol 28 no. 1, pp. 19,24, Jan. 2011.

Toshida, Junko, "'Green fever' worry," EE Times, Jan. 10, 2005.

Toshioka, Hideaki, Kobayashi, Motoo, Koyama, Keiji, Nakatsugi, Kyoichiro, Kuwabara, Tetsuya, Yamamoto, Masamichi, and Kashihara, Hideki, "Development of Anisotropic Conductive Film with Straight-chain-like Nickel Nano Particles," SEI Technical Review, no. 62, pp. 58-61, June 2006.

Tostar, Sandra, Stenvall, Erik, Boldizar, Antal, and Foreman, Mark R. St. J., "Antimony leaching in plastics from waste electrical and electronic equipment (WEEE) with various acids and gamma irradiation," Waste Management , vol. 33 no. 6, pp. 1478-1482, June 2013.

Tosun, Umut, "Cleaning Lead-Free:"No Problems Are Expected!"," Lead-Free Connection, vol. 2 no. 2, pp. 9-11, June 2005.

Tosun, Umut, "Cleaning Lead Free prior to Conformal Coating? Risks and Implications," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S08-01-1-S08-01-5.

Tosun, Umut, and Ellis, Dirk, "Cleaning under Low-standoff Components," Surface Mount Technology (SMT), vol. 22 no. 2, pp. 10,12,20, Feb. 2008.

Tosun, Umut, Wack, Harald, Becht, Joachim, Schweigart, Helmut, Afshari, Sia, and Ellis, Dirk, "Defluxing of Eutectic and Lead-Free Assemblies in a Single Cleaning Process," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 160-168.

Tosun, Umut, Ravindran, Naveen, and McCutchen, Michael, "Determining Critical Cleaning Process Parameters for QFNs," Printed Circuit Design and Fab/ Circuits Assembly, vol. 30 no. 8, pp. 29-34, Aug. 2013.

Tosun, Umut, Ravindran, Naveen, and McCutchen, Michael, "Determining Critical Cleaning Process Parameters for QFNs, Part 2," Printed Circuit Design and Fab/ Circuits Assembly, vol. 30 no. 9, pp. 40,42,44,46-47, Sept. 2013.

Tosun, Umut, "Lead-Free Cleaning: Moving from Eutectic to Lead-free," Surface Mount Technology (SMT), vol. 19 no. 6, pp. 47-50, June 2005.

Tosun, Umut, and Ellis, Dirk, "Leadfree (No-Clean) - Unheated Cleaning?," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 152-157.

Tosun, Umut, Ravindran, Naveen, and McCutchen, Michael, "Maintaining OSP Coating Integrity During the Cleaning Process," Surface Mount Technology (SMT), vol. 27 no. 9, pp. 28-30,32,34,36, Sept. 2012.

Tosun, Umut, "Who Are We Kidding?," Surface Mount Technology (SMT), vol. 17 no. 11, pp. 20, Nov. 2003.

Toth, Frank, and Shade, Gary F., "Unique Failure Modes from use of Sn-Pb and Lead-Free (mixed metallurgies) in PCB Assembly: CASE STUDY," Proceedings of the 31st International Symposium for Testing and Failure Analysis, San Jose, CA, Nov. 6-10, 2005, pp. 140-144.

Toto, DeAnne, "Europe calling," Recycling Today, vol. 42 no. 2, pp. 58-65, Feb. 2004.

Touw, Andui E., "AIA-AMC-GEIA Lead-free Electronics in Aerospace Project," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.

Touw, Anduin, "GEIA-HB-0005-4 Guidelines for Performing Reliability Assessment for Pb Free Assemblies used in Aerospace and High-Performance Electronic Applications," Tin Whisker Group teleconference, Jan. 26, 2011.

Touw, Anduin, "GEIA-STD-0005-2 Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems, Rev A draft 1/5/11," Tin Whisker Group teleconference, Jan. 19, 2011.

Touw, Anduin E., "Tin Whisker Investigation of SnPb Plated Parts with Marginal Pb Content," Boeing, Nov. 17, 2008.

Touyeras, F., Hihn, J. Y., Bourgoin, X., Jacques, B., Hallez, L., and Branger, V., "Effects of ultrasonic irradiation on the properties of coatings obtained by electroless plating and electro plating," Ultrasonics Sonochemistry , vol. 12 no. 1-2, pp. 13-19, Jan. 2005.

Towashiraporn, Pongpinit, Crosbie, Paul, Brown, Matt, and Cavallaro, Alberto, "Dynamic Crack Propagation Prediction of Solder Joints under Impact Conditions," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 689-694.

Towashiraporn, Pongpinit, Crosbie, Paul, and Lee, Yeong J., "The Effect of PCB Flexural Modes on Dynamic Reliability of Ball Grid Array Packages," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1804-1811.

Townsend, Matthew, "Waste Electrical and Electronic Equipment: A Picture Starts to Emerge," AFDEC, Feb. 18, 2004.

Townsend, Timothy G., and Musson, Stephen E., "Assessing the Landfill Disposal Implication of Discarded Electronic Equipment," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 298-301.

Townsend, Timothy G., Jang, Yong-Chul, Ko, Jae Hac, Pearson, Brian, Spalvins, Erik, and Wadanambi, Lakmini, "Assessment of True Impacts of E-Waste Disposal in Florida," Report #04-0232008, Florida Center for Solid and Hazardous Waste Management, Gainesvlle, FL, Dec. 2003.

Townsend, Timothy G., Musson, Stephen, Jang, Yong-Chul, and Chung, Il-Hyun, "Characterization of Lead Leachability from Cathode Ray Tubes Using the Toxicity Characteristic Leaching Procedure," Report #99-5, Florida Center for Solid and Hazardous Waste Management, Gainesvlle, FL, Dec. 1999.

Townsend, Timothy G., Jang, Yong-Chul, Tolaymat, Thabet, and Jambeck, Jenna, "Draft Annual Report Leaching Tests for Evaluating Risk in Solid Waste Management Decision Making: Year 1," Florida Center for Hazardous Waste Management, Sept. 2001.

Townsend, Timothy G., "Evaluation of Leaching Test Results of Lead-Free Solders," Abt Associates, Apr. 30, 2002.

Townsend, Timothy, Musson, Stephen, Dubey, Brajesh, and Pearson, Brian, "Leachability of printed wire boards containing leaded and lead-free solder," Journal of Environmental Management, vol. 88 no. 4, pp. 926-931, Sept. 2008.

Townsend, Timothy G., Vann, Kevin, Mutha, Sarvesh, Pearson, Brian, Jang, Yong-Chul, Musson, Stephen, and Jordan, Aaron, "RCRA Toxicity Characterization of Computer CPUs and Other Discarded Electronic Devices," Department of Environmental Engineering Sciences, University of Florida, Gainesville, Florida, July 15, 2004.

Toyama, Yuichiro, and Shohji, Ikuo, "Effect of Strain Rate on Tensile Properties of Miniature Size Lead-Free Alloys," 2012 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Nov. 6-8, 2012, pp. xx-xx.

Toyoda, H., Kawanoue, T., Ito, S., Hasunuma, M., and Kaneko, H., "Effects of Aluminum Texture on Electromigration Lifetime," AIP Conference Proceedings, vol. 373, pp. 169-184, 1996.

Trainor, Jim, "Electroless Palladium as a PCB Surface Finish - "The Re-introduction"," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 978-986.

Tran, Hiue, Chua, Yin Fun, Yi, Sung, and Geng, Phil, "Effects of Microstructure on Thermal Fatigue Life Prediction of Solder Joints," 2012 14th International Conference on Electronic Materials and Packaging, Hong Kong, Dec. 13-16, 2012, pp. xx-xx.

Tran, Son Ha, Dupont, Laurent, and Khatir, Zoubir, "Electrothermal Evaluation of Single and Multiple Solder Void Effects on Low-Voltage Si MOSFET Behavior in Forward Bias Conditions," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 7 no. 3, pp. 396-404, Mar. 2017.

Tranitz, Hans-Peter, and Dunker, Sebastian, "Growth Mechanisms of Tin Whiskers at Press-in Technology," IPC APEX EXPO, San Diego, CA, Feb. 28, 2012.

Treichel, Todd H., "A Reliability Examination of Lead-Free Quartz Crystal Products using Surface Mount Technology Engineered for Harsh Environments," SMTA Journal , vol. 18 no. 3, pp. 39-47, July 2005.

Treichel, Todd H., "Reliability of Space Flight Crystal Controlled Oscillator Using Lead-Free Surface Mount Technology," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 536-546.

Trejo, A., Miranda, A., Toscano-Medina, L. K., Vazquez-Medina, R., and Cruz-Irisson, M., "Optical vibrational modes of Ge nanowires: A computational approach," Microelectronic Engineering, vol. 159, pp. 215-220, June 15, 2016.

Trenchard, Mike, "'Chaotic UK not ready for EU waste directive'," Electronics Weekly , Jan. 22, 2003.

Trenchard, Mike, "Managing component obsolescence to succeed," Electronics Weekly , Jan. 21, 2004.

Trenchard, Mike, "The obsolescence minefield," IEE Review, vol. 49 no. 10, pp. 29, Oct. 2003.

Treuting, R. G., and Arnold, S. M., "Orientation Habits of Metal Whiskers," Acta Metallurgica, vol. 5 no. 10, pp. 598, Oct. 1957.

Treuting, R. G., "Torsional Strain and the Screw Dislocation in Whisker Crystals," Acta Metallurgica, vol. 5 no. 3, pp. 173-175, Mar. 1957.

Trip, Harry, "Understanding 'tombstoning' and how to prevent it," Dataweek , vol. xx no. xx, pp. xx-xx, July 30, 2003.

Trip, Nistor Daniel, Burca, Adrian, Gordan, Cornelia, and Schiop, Adrian, "Nitrogen Influence on the Reflow Soldering Process Optimization," 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging, Brasov, Romania, Oct. 22-25, 2015, pp. 99-102.

Trippel, Patrick, "Lead-Free Assembly: Greatest Shake-up is Yet to Come," Advanced Packaging, vol. 13 no. 8, pp. 17, Aug. 2004.

Trivedi, S. B., and Bhatt, V. P., "Growth of Se-Te Whisker Crystals from the Vapour Phase," Journal of Crystal Growth, vol. 32 no. 2, pp. 227-232, Feb. 1976.

Trodler, Jorg, "Assembly Materials for High-Temperature Applications," Surface Mount Technology (SMT), vol. 29 no. 3, pp. 60,62-64,66-68,70,72, Mar. 2014.

Trodler, Joerg, and Mueller, Tobias, "High-Reliability Connection Products for Packaging Technology in Microelectronics," Advanced Engineering Materials, vol. 11 no. 4, pp. 302-308, Apr. 2009.

Trodler, Jorg, and Albrecht, Hans-Juergen, "Lead-Free Paste Characterization (Wetting and Voiding) vs. Reliability," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 694-697.

Trodler, Jorg, Nowottnick, Mathias, Fix, Andreas, and Heberholz, Timo, "New Interconnection for High Temperature Application: HotPowCon (HPC)," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 321-326.

Trodler, Jorg, Nowottnick, Mathias, Fix, Andreas, and Herberholz, Timo, "New Interconnection for High Temperature Application: HotPowCon (HPC) - Part 2," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 286-292.

Trodler, Jorg, and Wohlrabe, Heinz, "R1 - A Reliability Comparison Study between 14 Lead Free Alloys," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 379-384.

Trodler, Jorg, and Wohlrabe, Habil Heinz, "Reliability Improvements by the Creation of Intermetallic Connections," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 310-313.

Trodler, Jorg, Wohlrabe, Heinz, and Knofe, Rudiger, "Reliability of Passive and Active Components with Differences According to Lead-Free Paste Characterization," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 261-263.

Troxel, Kris, "LTS - Motivations & Industry Challenges," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. xx-xx.

Trueba, Monica, Trasatti, Stefano P., and Flamini, Daniel O., "Hybrid coatings based on conducting polymers and polysiloxane chains for corrosion protection of Al alloys," Advanced Materials Research, vol. 138, pp. 63-78, 2010.

Trueba, Monica, and Trasatti, Stefano, "Pyrrole-based silane primer for corrosion protection of commercial AA 2024 T3," Advanced Materials Research, vol. 38, pp. 14-26, 2008.

Truini, Joe, "EU directive vexes automakers," Waste News, vol. xx no. x, pp. xx-xx, Nov. 25, 2002.

Truini, Joe, "Following Europe's lead," Waste News, vol. xx no. x, pp. xx-xx, Aug. 29, 2005.

Truini, Joe, "Nick of time," Waste News, vol. xx no. x, pp. xx-xx, Sept. 29, 2003.

Truini, Joe, "Office Depot opens its doors to recycling," Waste News, vol. xx no. x, pp. xx-xx, Jan. 3, 2005.

Truini, Joe, "Sony, WMI spark recycling program," Waste News, vol. xx no. x, pp. xx-xx, Oct. 23, 2000.

Trumble, B., and Brydges, J., "Technical Progress on Printed Wired Assembly Using Nortels's No-lead Solder Assembly Process," 1998 IEEE International Symposium on Electronics and the Environment, Oak Brook, IL, May 4-6, 1998, pp. 112-116.

Trumble, Bill, "Alternatives to Chromate as a Conversion Coating for Electronic Enclosures," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Trumble, Bill, and Lawless, Pat, "Case Study: Alternatives to Chromate Conversion Coatings for Corrosion Protection of Zinc Plated Electronic Shelves," IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 5-7, 1997, pp. 38-41.

Trumble, Bill, "Get the Lead out!," IEEE Spectrum, vol. 35 no. 5, pp. 55-60, May 1998.

Trumble, Bill, "Printed Circuit Assembly with No Lead Solder Assembly Process," Proceedings of the 1997 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 5-7, 1997, pp. 25-27.

Trumbore, F. A., and Isenberg, C. R., "Two-Phase Germanium-Zinc "Whiskers"," Journal of Applied Physics , vol. 30, pp. 795-796, 1959.

Trumbull, Roy, "Progress Report by the Committee for Alternatives to Lead on Solder," The Journal of Irreproducible Results, vol. 25 no. 11, pp. xx, 1979.

Truong, Anh Hoang, Sone, Hayato, and Hosaka, Sumio, "Fabrication of Si Nanowire Biosensor Using FIB and Its Evaluations," Key Engineering Materials, vol. 596, pp. 224-228, Dec. 2013.

Truttmann, Nina, and Rechberger, Helmut, "Contribution to resource conservation by reuse of electrical and electronic household appliances," Resources, Conservation and Recycling, vol. 48 no. 3, pp. 249-262, Sept. 2006.

Tsai, Chi-Hang, Cheng, Yun-Min, and Song, Jenn-Ming, "Electrochemical corrosion and oxidation behaviors of high temperature Pb-free solders," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Tsai, Chi-Hang, Song, Jenn-Ming, and Fu, Yen-Pei, "Electrochemical corrosion behavior of Pb-free solders for die attachment," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 448-451.

Tsai, H. C., Jong, W. R., and Peng, S. H., "The Comparisons of IC Packages with/without Underfill on the Thermo-mechanical Characteristics," Society of Plastics Engineers Annual Technical Conference, Volume 3, Cincinnati, OH, May 6-11, 2007, pp. 1437-1441.

Tsai, Hsin-Chun, and Jong, Wen-Ren, "The Significance of Underfill on the IC Packages Subjected to Temperature Cyclic Loading," Journal of Reinforced Plastics and Composites, vol. 26 no. 12, pp. 1211-1223, 2007.

Tsai, Iting, Lai, Li Jung, Yen, S. F., Chuang, T. H., Lo, Robert, Ku, Tarry, and Wu, Enboa, "Characterization of Thin Films and Intermetallic Compounds in Solder Joint," Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, Apr. 18-20, 2005, pp. 703-705.

Tsai, Iting, Tai, Li Jung, Yen, S. F., Chuang, T. H., Lo, Robert, Ku, Terry, and Wu, Enboa, "Identification of Mechanical Properties of Intermetallic Compounds on Lead Free Solder," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 687-691.

Tsai, Iting, Wu, Enboa, Yen, S. F., and Chuang, T. H., "Mechanical Properties of Intermetallic Compounds on Lead-Free Solder by Moire Techniques," Journal of Electronic Materials, vol. 35 no. 5, pp. 1059-1066, May 2006.

Tsai, J. Y., Hu, Y. C., Tsai, C. M., and Kao, C. R., "A Study on the Reaction between Cu and Sn3.5Ag Solder Doped with Small Amounts of Ni," Journal of Electronic Materials, vol. 32 no. 11, pp. 1203-1208, Nov. 2003.

Tsai, J. Y., Chang, C. W., Shieh, Y.C., Hu, Y. C., and Kao, C. R., "Controlling the Microstructures from the Gold-Tin Reaction," Journal of Electronic Materials, vol. 34 no. 2, pp. 182-187, Feb. 2005.

Tsai, J. Y., Chang, C. W., Ho, C. E., Lin, Y. L., and Kao, C. R., "Microstructure Evolution of Gold-Tin Eutectic Solder on Cu and Ni Substrates," Journal of Electronic Materials, vol. 35 no. 1, pp. 65-71, Jan. 2006.

Tsai, Jhy-Cherng, and Wang, Wen-Tsung, "Effects of Surface Cleanness, Bonding Pressure and Contact Area of ACF on Interfacial Impedance of Chip on Glass Bonding in Flat Panel Display Assembly," Key Engineering Materials, vol. 364-366 I, pp. 618-623, 2008.

Tsai, Jia-Lin, and Hong, Cheng-Fong, "Investigate Mechanical Behavior of Gold Nanowire with Defect," Applied Mechanics and Materials, vol. 481, pp. 49-54, Dec. 2013.

Tsai, Jui-Yun, Sundaram, Venky, Wiedenman, Boyd, Sun, Yangyang, Wong, C. P., and Tummala, Rao, "A Novel 20-100um Pitch IC-to-Package Interconnect and Assembly Process for Pb-Free Solder, Copper or Gold Stud Bumps," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 263-268.

Tsai, Jui-Yun, Gaida, Josef, Steinberger, Gerhard, and Uhlig, Albrecht, "The Intereations Between SnAgCu Solder and Ni(P)/Au, Ni(P)/Pd/Au UBMs," 4th International Wafer Level Packaging Congress, San Jose, CA, Sept. 17-19, 2007, pp. xx-xx.

Tsai, Jui-Yun, Gaida, Josef, Steinberger, Gerhard, and Uhlig, Albrecht, "The Study on the Interfacial Reaction Between SnAgCu Solder and Ni(P)/Au, Ni(P)/Pd/Au UBMs," SMTA China East Technical Conference 2008, Shanghai, China, Apr. 8-10, 2008, pp. xx-xx.

Tsai, Jui-Yun, Gaida, Josef, Steinberger, Gerhard, and Uhlig, Albrecht, "The Study on the Interfacial Reaction between SnAgCu Solder and Ni(P)/Au, Ni(P)/Pd/Au UBMs," NEPCON Shanghai 2008, Shanghai, China, Apr. 8-11, 2008, pp. xx-xx.

Tsai, K. T., Liu, F.-L., Wong, E. H., and Rajoo, R. "High Strain Rate Testing of Solder Interconnections," 7th IEEE CPMT International Conference on High Density Microsystem Design, Packaging and Failure Analysis, Shanghai, June 28, 2005, pp. xx-xx.

Tsai, K. T., Liu, F-L.,, Wong, E. H., and Rajoo, R., "High strain rate testing of solder interconnections," Soldering & Surface Mount Technology, vol. 18 no. 2, pp. 12-17, 2006.

Tsai, M. H., Hwang, W. S., and Chou, H. H., "The micro-droplet behavior of a molten lead-free solder in an inkjet printing process," Journal of Micromechanics and Microengineering , vol. 19 no. 12, pp. 125021-1-125021-10, Dec. 2009.

Tsai, M. Y., Ting, C. W., Huang, C. Y., and Lai, Yi-Shao, "Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes," Microelectronics Reliability, vol. 51 no. 3, pp. 642-648, Mar. 2011.

Tsai, M. Y., Wu, C. Y., Huang, C. W., Cheng, W. C., Kong, S. R., Yang, S. S, and Chang, S. M., "Effects of Some Parameters on Warpage and Bump-Joint Stresses of COG Packages," 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, Portland, OR, Sept. 12-15, 2004, pp. 182-190.

Tsai, M. Y., Yang, S. C., Wang, Y. W., and Kao, C. R., "Grain growth sequence of Cu3Sn in the Cu/Sn and Cu/Sn-Zn systems," Journal of Alloys and Compounds, vol. 494 no. 1-2, pp. 123-127, Apr. 2, 2010.

Tsai, M. Y., and Chang, H. Y., "Warpage Measurement and Simulation of Flip-Chip PBGA Package under Thermal Loading," International Conference on Electronic Materials and Packaging , Taipei, Taiwan, Oct. 22-24, 2008, pp. 145-148.

Tsai, M. Y., Huang, C. Y., Ting, C. W., Kao, Kuo-Shu, and Chen, Ming-Yao, "Warpage Measurement of ACF-bonded COG Package in TFT-LCD after Manufacturing and under Hydrothermal Loads," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 106-109.

Tsai, M. Y., Huang, C. Y., Chiang, C. Y., Chen, W. C., and Yang, S. S., "Warpages of ACF-bonded COG packages Induced from Manufacturing and Thermal Cycling," 2005 International Symposium on Electronics Materials and Packaging, Tokyo, Japan, Dec. 11-14, 2005, pp. 143-149.

Tsai, Ming-Yi, Huang, Chen-Yu, Chiang, Chih-Yao, Chen, Wen-Chin, and Yang, Sheng-Shu, "Experimental and Numerical Studies of Warpages of ACF-Bonded COF Packages Induced From Manufacturing and Thermal Cycling," IEEE Transactions on Advanced Packaging, vol. 30 no. 4, pp. 665-673, Nov. 2007.

Tsai, Ming-Yi, Wu, Chung-Yen, Huang, Chen-Yu, Cheng, Wen-Chen, and Yang, Sheng-Shu, "Study of Some Parameter Effects on Warpage and Bump-Joint Stresses of COG Packages," IEEE Transactions on Advanced Packaging, vol. 29 no. 3, pp. 587-598, Aug. 2006.

Tsai, Shan-Ting, Chiang, Ping-Chen, Liu, Chang, Feng, Shien-Ping, and Chen, Chih-Ming, "Suppression of Void Formation at Sn/Cu Joint Due to Twin Formation in Cu Electrodeposit," JOM, vol. 71 no. 9, pp. 3012-3022, Sept. 2019.

Tsai, T. Y., Chang, S. J., Hsueh, T. J., Hsu, C. L., Weng, W. Y., and Shieh, J. M., "A Si Nanowire Photovoltaic Device Prepared by Selective Electroless Etching," IEEE Transactions on Nanotechnology, vol. 11 no. 6, pp. 1148-1150, Nov. 2012.

Tsai, Tsung-Fu, Chang, Jing-Yao, Chien, Chien-Wei, Juang, Jing-Ye, and Shen, Li-Cheng, "Ternary Lead-Free SnAgCu Micro-Bumps for Ultra-fine Pitch Chip-to-Chip Interconnection," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 54-58.

Tsai, Tsung-Yueh, Lai, Yi-Shao, Yeh, Chang-Lin, and Chen, Rong-Sheng, "Structural design optimization for board-level drop reliability of wafer-level chip-scale packages," Microelectronics Reliability, vol. xx no. x, pp. xx-xx, xxxx.

Tsai, Tsung-Yueh, Yeh, Chang-Lin, Lai, Yi-Shao, and Chen, Rong-Sheng, "Transient Submodeling Analysis for Board-Level Drop Tests of Electronic Packages," IEEE Transactions on Electronics Packaging Manufacturing , vol. 30 no. 1, pp. 54-62, Jan. 2007.

Tsai, Yi-Da, Hu, Chi-Chang, and Lin, Chi-Cheng, "Electrodeposition of Sn-Bi lead-free solders: Effects of complex agents on the composition, adhesion, and dendrite formation," Electrochimica Acta , vol. 53 no. 4, pp. 2040-2047, Dec. 31, 2007. https://doi.org/10.1016/j.electacta.2007.09.002

Tsai, Ying-Ling, Hwang, Weng-Sing, Wang, Huel-Sen, and Wu, Mei-Hui, "Measurements of Thermal Expansion Coefficients and Melting Ranges for Sn-9Zn-xAg Lead-free Solder Alloys," International Journal of Cast Metals Research, vol. 15 no. 3, pp. 181-186, 2002.

Tsai, Ying-Ling, and Hwang, Weng-Sing, "Pasty Ranges and Latent Heat Release Modes for Sn-9Zn-xAg Lead-free Solder Alloys," Materials Transactions, vol. 45 no. 6, pp. 1949-1957, June 2004.

Tsao, Jenny, "Strategic Planning is Required," Electronic Products, vol. 48 no. 5, pp. 85, 136, Oct. 2005.

Tsao, L. C., "An investigation of microstructure and mechanical properties of novel Sn3.5Ag0.5Cu-XTiO2 composite solders as functions of alloy composition and cooling rate," Materials Science and Engineering: A, vol. 529 no. 1, pp. 41-48, Nov. 25, 2011.

Tsao, L. C., and Chen, C. W., "Corrosion characterization of Cu-Sn intermetallics in 3.5 wt.% NaCl solution," Corrosion Science, vol. 63, pp. 393-398, Oct. 2012.

Tsao, L. C., Wang, B. C., Chang, C. W., and Wu, M. W., "Effect of Nano-TiO2 Addition on Wettability and Interfacial Reactions of Sn0.7Cu Composite Solder/Cu Solder Joints," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging , Xi'an, China, Aug. 16-19, 2010, pp. 250-253.

Tsao, L. C., Cheng, S. Y., Chen, C. W., and Chen, Ting-Yu, "Effect of nano-TiO2 particles and cooling rate on the thermal, microstructure and mechanical properties of novel low-ag Sn1.5Sb1Ag solders," Materials Science and Engineering: A, vol. 658, pp. 159-166, Mar. 21, 2016.

Tsao, L. C., Wu, M. W., and Chang, S. Y., "Effect of TiO2 nanoparticles on the microstructure and bonding strengths of Sn0.7Cu composite solder BGA packages with immersion Sn surface finish," Journal of Materials Science: Materials in Electronics, vol. 23 no. 3, pp. 681-687, Mar. 2012.

Tsao, L. C., Lo, T. T., Peng, S. F., and Chang, S. Y., "Electrochemical Behavior of a New Sn3.5Ag0.5Cu Composite Solder," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 1013-1017.

Tsao, L. C., "Evolution of nano-Ag3Sn particle formation on Cu-Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering," Journal of Alloys and Compounds, vol. 509 no. 5, pp. 2326-2333, Feb. 3, 2011.

Tsao, L. C., Lo, T. T., and Peng, S. F., "Growth Kinetics of the Intermetallic Compounds During the Interfacial Reactions Between Sn3.5Ag0.9Cu-nanoTiO2 Alloys and Cu Substrate," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 190-194.

Tsao, L. C., Huang, C. H., Chung, C. H., and Chen, R. S., "Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder," Materials Science and Engineering: A, vol. 545, pp. 194-200, May 30, 2012.

Tsao, L. C., "Microstructural characterization and mechanical properties of microplasma oxidized TiO2/Ti joints soldered using Sn3.5Ag4Ti(Ce) active filler," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Tsao, L. C., Chang, S. Y., Sun, W. H., and Yen, S. F., "Study of Interfacial Reactions between Sn3.5Ag0.5Cu Alloys and Cu Substrate," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 886-889.

Tsao, L. C., Chu, C. P., and Peng, S. F., "Study of interfacial reactions between Sn3.5Ag0.5Cu composite alloys and Cu substrate," Microelectronic Engineering, vol. 88 no. 9, pp. 2964-2969, Sept. 2011.

Tsao, L. C., "Suppressing effect of 0.5 wt.% nano-TiO2 addition into Sn-3.5Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging," Journal of Alloys and Compounds, vol. 509 no. 33, pp. 8441-8448, Aug. 18, 2011.

Tsao, L. C., Huang, W. T., Wu, M. W., and Su, Sheng-Lun, "Suppressing effect of 1 wt.% nano-TiO2 addition into low Ag content Sn-Ag-Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 465-468.

Tschan, Thomas, "An Overview of Flip-Chip Technology," Chip Scale Review, vol. xx no. xx, pp. xx-xx, May-June 2001.

Tschudin, Christoph, Hutin, Olivier, Arsalane, Souad, Bartels, Ferdinand, Lambracht, Petra, and Rettenlayr, Markus, "Lead Free Soft Solder Die Attach Process for Power Semiconductor Packaging," Semicon, Shanghai, Mar. 2002.

Tse, Po, "IPC Reliability Summit Training," Overcoming the Reliability Challenge: An IPC Summit, Andover, MA, Apr. 15, 2008, pp. xx-xx.

Tsebo Simo, Grace L., Shirangi, Hossein, Nowottnick, Matthias, Dudek, Rainer, Kaulfersch, Eberhard, Rzepka, Sven, and Michel, Bernd, "Drop Impact Simulations for Lifetime Assessment of PCB/BGA Assemblies regarding Pad Cratering," 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Ghent, Belgium, Apr. 7-9, 2014, pp. xx-xx.

Tsebo Simo, Grace L., Shirangi, Hossein, Nowottnick, Mathias, and Rzepka, Sven, "Effects of Board Design Parameters on Failure Mechanisms of PCB/BGA Assemblies under Drop Impact," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 2048-2053.

Tsenev, Valentin, "Exploration of the Possibilities of Low Temperature Soldering Alloy LMPA at Selective Wave Soldering (SWS)," 2018 41st International Spring Seminar on Electronics Technology, Zlatibor, Serbia, May 16-20, 2018, pp. xx-xx.

Tseng, Chien-Fu, and Duh, Jenq-Gong, "Correlation between microstructure evolution and mechanical strength in the Sn-3.0Ag-0.5Cu/ENEPIG solder joint," Materials Science and Engineering: A, vol. 580, pp. 169-174, Sept. 15, 2013.

Tseng, Chien-Fu, Wang, Kai-Jheng, and Duh, Jenq-Gong, "Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Cu-Mn UBM During Aging," Journal of Electronic Materials, vol. 39 no. 12, pp. 2522-2527, Dec. 2010.

Tseng, Chien-Fu, Lee, Tae-Kyu, Ramakrishna, Gnyaneshwar, Liu, Kuo-Chuan, and Duh, Jenq-Gong, "Suppressing Ni3Sn4 formation in the Sn-Ag-Cu solder joints with Ni-P/Pd/Au surface finish," Materials Letters, vol. 65 no. 21-22, pp. 3216-3218, Nov. 2011.

Tseng, H. W., Wang, S. J., and Liu, C. Y., "Cross-Interaction Effect in the Ni/Sn/Cu Solder Joints," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 325-330.

Tseng, H. W., Lu, C. T., Hsiao, Y. H., Liao, P. L., Chuang, Y. C., and Liu, C. Y., "Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 401-405.

Tseng, H. W., Lu, C. T., Hsiao, Y. H., Liao, P. L., Chuang, Y. C., Chung, T. Y., and Liu, C. Y., "Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces," Microelectronics Reliability, vol. 50 no. 8, pp. 1159-1162, Aug. 2010.

Tseng, H. W., and Liu, C. Y., "Evolution of Ag3Sn compound formation in Ni/Sn5Ag/Cu solder joint," Materials Letters, vol. 62 no. 23, pp. 3887-3889, Aug. 31, 2008.

Tseng, H. W., and Liu, C. Y., "Study of Interfacial Reactions by Ni/Sn5Ag/Cu Sandwich Structure," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Tseng, Po-Hao, Tian, Wei-Cheng, Pan, Samuel C., and Hwu, Jenn-Gwo, "Formation of Single Crystal Si-Nanowire by Electric Field Self-Redistribution Effect in Anodic Oxidation for Multilayer Array Application," IEEE Transactions on Nanotechnology, vol. 13 no. 6, pp. 1084-1087, Nov. 2014.

Tseng, Tsan-Hsien, Wu, Albert T., Chang, Yu-Ting, Shi, H. C., and Lee, Jeffrey, "Creep Corrosion on High Reliability Printed Circuit Boards," 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 26-28, 2016, pp. 156-158.

Tseng, Watson, "Meeting the Rising Reliability Demands in Automotive Electronics Applications," Global SMT and Packaging, vol. 20 no. 3, pp. 18-19, Mar. 2020.

Tseng, Wen-Tsung, Tsai, Ho-Yi, Chiu, Steve, and Hsiao, C. S., "Molded Underfill Technology for Low-k Flip Chip Packages," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 335-337.

Tseng, Y. H., Yeh, M. S., and Chuang, T. H., "Interfacial Reactions between Liquid Indium and Nickel Substrate," Journal of Electronic Materials, vol. 28 no. 2, pp. 105-108, Feb. 1999.

Tseng, Yan-lun, Chang, Ya-chun, and Chen, Chih-chi, "Co Effects upon Intermetallics Growth Kinetics in Sn-Cu-Co/Ni and Sn-Cu-Co/Cu Couples," Journal of Electronic Materials, vol. 44 no. 1, pp. 581-589, Jan. 2015.

Tseng, Yi-Wei, Hung, Fei-Yi, and Lui, Truan-Sheng, "Thermoelectric Mechanism and Interface Characteristics of Cyanide-Free Nanogold-Coated Silver Wire," Journal of Electronic Materials, vol. 45 no. 1, pp. 624-630, Jan. 2016.

Tsoi, Abby, "China RoHS Update," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 724-729.

Tsou, Meng-Yu, Yen, Yee-Wen, Shao, Pei-Sheng, and Jao, Chien-Chung, "Investigation of Sn Whisker Growth in the Matte Sn/Alloy 42 Substrate Coated Different Metallic Layers," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Tsoulfas, Giannis T., Pappis, Costas P., and Minner, Stefan, "An environmental analysis of the reverse supply chain of SLI batteries," Resources, Conservation, and Recycling, vol. 36 no. 2, pp. 135-154, Aug. 2002.

Tsuda, Kenji, "Environmentally Friendly PCBs at Tokyo Show," Nikkei Electronics Asia, pp. xx-xx, Aug. 2000.

Tsuji, H., and Kamitani, M., "Electrodeposition and Passivation of Bright Zinc-Nickel Alloys," American Electroplaters' Society SUR/FIN '82 69th Annual Technical Conference , San Francisco, CA, June 20-24, 1982, session P-2 pp. 1-15.

Tsuji, Kiyotaka, "Growth Mechanism of Tin Whisker," Journal of the Surface Finishing Society of Japan, vol. 58 no. 7, pp. 406-411, 2007.

Tsuji, Kiyotaka, "Role of Grain-boundary-free Energy & Surface-free Energy for Tin Whisker Growth," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 169-186.

Tsuji, Kiyotaka, "Roll of Grain-boundary Free Energy & Surface Free Energy for Tin Whisker Growth," Ishihara Chemical Co.

Tsuji, Kiyotaka, "Study on the Mechanism of Sn Whisker Growth Part I Relation between Whisker Growth and the Structure of Deposits," Journal of the Surface Finishing Society of Japan, vol. 57 no. 6, pp. 451-458, 2006.

Tsuji, Kiyotaka, "Study on the Mechanism of Sn Whisker Growth Part II Estimation of Excessive Energy & Its Origin," Journal of the Surface Finishing Society of Japan, vol. 57 no. 7, pp. 529-536, 2006.

Tsuji, S., Tsujimoto, K., and Iwama, H., "Application of cross-sectional transmission electron microscopy to thin-film-transistor failure analysis," IBM Journal of Research and Development, vol. 42 no. 3/4, pp. xx-xx, 1998.

Tsujimoto, K., Tsuji, S., and Saka, H., "Electron microscopy observation of whiskers and hillocks formed on an Al film deposited on to a glass substrate," Philosophical Magazine A, vol. 81 no. 2, pp. 287-299, Feb. 1, 2001.

Tsujimoto, Katsuhiro, Tsuji, Satoshi, Takatsuji, Hiroshi, Kuroda, Kotaro, Saka, Hiroyasu, and Suzuki, Yukinobu, "Nanostructural Investigation of Whiskers and Hillocks of Al-Based Metallization in Thin-Film Transistor Liquid Crystal Displays," AIP Conference Proceedings, vol. 418, pp. 395-400, 1998.

Tsujimoto, Masanobu, "Study of tin whisker inhibiting systems Controlling the copper substrate roughness and controlling the tin deposit crystal structure," IPC Symposium on Tin Whiskers, pp. xx-xx.

Tsujimoto, Masanobu, Hashimoto, Shigeo, Kiso, Masayuki, Ikumoto, Raihei, Kano, Toshikazu, Kanamori, Genki, Gudeczauskas, Don, and Milad, George, "The Elimination of Whiskers from Electroplated Tin," IPC APEX Expo Technical Conference 2011, Las Vegas, NV, April 12-14, 2011 pp. 555-603.

Tsujimoto, Masanobu, Hashimoto, Shigeo, Kiso, Masayuki, Ikumoto, Raihei, Kano, Toshikazu, Kanamori, Genki, Gudeczauskas, Don, and Milad, George, "The Elimination of Whiskers from Electroplated Tin," International Conference on Soldering & Reliability 2013 Proceedings, Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.

Tsujimoto, Masanobu, Hashimoto, Shigeo, Kiso, Masayuki, Ikumoto, Raihei, Kano, Toshikazu, Kanamori, Genki, Gudeczauskas, Don, and Gruenwald, Al, "The Elimination of Whiskers from Electroplated Tin, NASF SURFIN 2016, Las Vegas, NV, June 6, 2016, pp. xx-xx.

Tsukada, Kiyotaka, "Development of New Surface Finishing Technology for PKG Substrate with High Bondability," 2005 IEEE/CPMT 10th International Symposium on Advanced Packaging Materials, Irvine, CA, Mar. 16-18, 2005, pp. 110-114.

Tsukamoto, H., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. W., and Nogita, K., "The influence of solder composition on the impact strength of lead-free solder ball grid array joints," Microelectronics Reliability, vol. 51 no. 3, pp. 657-667, Mar. 2011.

Tsukamoto, Hideaki, Nishimura, Tetsuro, and Nogita, Kazuhiro, "Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interface," Materials Letters, vol. 63 no. 30, pp. 2687-2690, Dec. 31, 2009.

Tsukamoto, Hideaki, Dong, Zhigang, Huang, Han, Nishimura, Tetsuro, and Nogita, Kazuhiro, "Nanoindentation characterization of intermetallic compounds formed between Sn-Cu (-Ni) ball grid arrays and Cu substrates," Materials Science and Engineering B: Solid-State Materials for Advanced Technology, vol. 164 no. 1, pp. 44-50, Aug. 15, 2009.

Tsukamoto, Hideaki, Dong, Zigang, Huang, Han, Nishimura, Tetsuro, and Nogita, Kazuhiro, "Nanoindentation Characterization of Intermetallics Formed at the Lead-Free Solder/Cu Substrate Interface," Materials Science Forum, vol. 654-656, pp. 2446-2449, 2010.

Tsukamoto, Katsuo, Srivastava, Atul, and Dold, Peter, "Developments in Interferometric Techniques for In-situ Observation of Surface Kinetics of Crystals in Solutions and Three-dimensional Analysis of Transport Phenomena," AIP Conference Proceedings, vol. 1270, pp. 292-315, 2010.

Tsukui, Tsutomu, Takeuchi, Yoshihiro, Ueshima, Minoru, Takenaka, Junichi, Takeuchi, Makoto, Sasaki, Kihichi, Kobayashi, Yoshikazu, and Sasabe, Toshiki, "Study on Whisker Growth on Solder Joints-Part I: Study on Acceleration Test Method," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 8 no. 8, pp. 1477-1486, Aug. 2018.

Tsunekawa, Masami, Ito, Mayumi, Yuta, Sasaki, Tomoo, Sakai, and Hiroyoshi, Naoki, "Removal of lead compounds from polyvinylchloride in electric wires and cables using cation-exchange resin," Journal of Hazardous Materials, vol. 191 no. 1-3, pp. 388-392, July 15, 2011.

Tsunematsu, Yushi, Tanigami, Masanobu, and Hirano, Masao, "Evaluation of Pb-free Solders for adaptability to various soldering processes," Proceedings of the First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Feb. 1-3, 1999, pp. 610-614.

Tsung, Zeng Yu, Chang, Wen Tsung, Chang, Chingyi, Chang, Hsiu-Rong, and Hwang, Yeong Tsyr, "The effect of cyanate ester and anhydride hardeners on the properties of underfill/anisotropic conductive paste in the electronic applications," Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 749-751.

Tsunoi, Kazuhisa, and Iketaki, Kenji, "Environment Friendly Technology for Mobile Machines," Proceedings 2000 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4339), Boston, MA, Sept. 18-20, 2000, pp. 275-280.

Tsuritani, Hiroyuki, Sayama, Toshihiko, Okamoto, Yoshiyuki, Takayanagi, Takeshi, Uesugi, Kentaro, and Mori, Takao, "Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 761-769.

Tsutsumi, Keisuke, Iwane, Yuicji, Morizono, Yasuhiro, Kozuka, Toshiyuki, and Ohno, Yasuhide, "Whisker Formation Behavior on Tin Film Plated in High Magnetic Field," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 722-725.

Tsyntsaru, N., Silkin, S., Cesiulis, H., Guerrero, M., Pellicer, E., and Sort, J., "Toward uniform electrodeposition of magnetic Co-W mesowires arrays: direct versus pulse current deposition," Electrochimica Acta, vol. 188, pp. 589-601, Jan. 10, 2016.

Tu, Chuanhong, Prest, Harry, Lau, John, and Benefiel, Monty, "Measurement of PBDEs in Electronic Products Using GC-MS for the RoHS Directive," IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies, Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.

Tu, Jui-the, "An Assessment Model and Guidelines for Multimedia Computer Recycling from the Life Cycle Design Standpoint," First International Symposium On Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Feb. 1-4, 1999, pp. 740-745.

Tu, K. N., and Gusak, A. M., "A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production," Journal of Applied Physics, vol. 126 no. 7, pp. 075109-1-075109-6, Aug. 21, 2019.

Tu, K. N., "Cu/Sn interfacial reactions: thin-film case versus bulk case," Materials Chemistry and Physics, vol. 46 no. 2-3, pp. 217-223, Nov. 12, 1996.

Tu, K. N., "Diffusion in Thin Films," Defect and Diffusion Forum, vol. 83, pp. 141-144, 1992.

Tu, K. N., "Interdiffusion and Reaction in Bimetallic Cu-Sn Thin Films," Acta Metallurgica, vol. 21 no. 4, pp. 347-354, Apr. 1973.

Tu, K. N., "Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions," Physical Review B, vol. 49 no. 3, pp. 2030-2034, Jan. 15, 1994.

Tu, K. N., and Thompson, R. D., "Kinetics of Interfacial Reaction in Bimetallic Cu-Sn Thin Films", ACTA Metallurgica, vol. 30 no. 5, pp. 947-952, May 1982.

Tu, K. N., Gusak, A. M., , and Li, M., "Physics and materials challenges for lead-free solders," Applied Physics Reviews, vol. 93 no. 3, pp. 1335-1353, Feb. 1, 2003.

Tu, K. N., Gusak, A. M., and Li, M., "Physics and materials challenges for lead-free solders," Journal of Applied Physics, vol. 93 no. 3, pp. 1335-1353, Feb. 1, 2003.

Tu, K. N. "Recent advances on electromigration in very-large-scale-integration of interconnects," Journal of Applied Physics, vol. 94 no. 9, pp. 5451-5473, Nov. 1, 2003.

Tu, K. N., and Zeng, K., "Reliability Issues of Pb-free Solder Joints in Electronic Packaging Technology," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1194-1200.

Tu, K. N., and Li, J. C. M., "Spontaneous whisker growth on lead-free solder finishes," Materials Science and Engineering: A, vol. 409 no. 1-2, pp. 131-139, Nov. 15, 2005. https://doi.org/10.1016/j.msea.2005.06.074

Tu, K. N., Chen, Chih, and Wu, Albert T., "Stress analysis of spontaneous Sn whisker growth," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 269-281, Mar. 2007.

Tu, K. N., Hsiao, Hsiang-Yao, and Chen, Chih, "Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy," Microelectronics Reliability, vol. xx no. xx, pp. xx-xx, xxxx.

Tu, King-Ning, Suh, Jong-ook, Wu, Albert Tzu-Chia, Tamura, Nobumichi, and Tung, Chih-Hang, "Mechanism and Prevention of Spontaneous Tin Whisker Growth," Materials Transactions, vol. 46 no. 11, pp. 2300-2308, 2005.

Tu, L. W., Wong, G. K., Song, S. N., Zhao, Z., and Ketterson, J. B., "Growth and characterisation of substrate-stabilised heteroepitaxial grey tin films," Semiconductor Science and Technology, vol. 5 no. 3S, pp. S245-S247, Mar. 1990.

Tu, L. W., Wong, G. K., Song, S. N., Zhao, Z., and Ketterson, J. B., "Shubnikov-de Haas effect in thin epitaxial films of gray tin," Applied Physics Letters, vol. 55 no. 25, pp. 2643-2645, Dec. 18, 1989.

Tu, Li-Wei, Wong, George K., and Ketterson, John B., "Growth of n-type heteroepitaxial films of gray tin on (001) CdTe by molecular beam epitaxy," Applied Physics Letters, vol. 54 no. 11, pp. 1010-1012, Mar. 13, 1989.

Tu, Li-Wei, Wong, George K., and Ketterson, John B., "Observation of quantum size effect in the resistivity of thin, gray tin epilayers," Applied Physics Letters, vol. 55 no. 13, pp. 1327-1329, Sept. 25, 1989.

Tu, Xiaoxuan, Yi, Danqing, Wu, Jing, and Wang, Bin, "Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties," Journal of Alloys and Compounds, vol. 698, pp. 317-328, Mar. 25, 2017.

Tu, Yiyou, Wang, Xiaohui, Huang, Huiling, Zhou, Xuefeng, and Jiang, Jianqing, "Effect of Si on the Aging Behavior of Cold-Drawn Pearlitic Steel Wires," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 48 no. 2, pp. 659-665, Feb. 2017.

Tu, Yunhua, Liu, Sang, Ye, Yuming, and Chen, Limin, "Influence of Ni-Sn-Cu ternary intermetallic compound on solder joint reliability," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Tu, Zhenmi, Yang, Zhelong, Zhang, Jingshuang, An, Mao-Zhong, and Li, Wen-Liang, "Cathode Polarization in Trivalent Chromium Plating," Plating & Surface Finishing, vol. 80 no. 11, pp. 79-82, Nov. 1993.

Tu, Zhenmi, Yang, Zhelong, and Zhang, Jingshuang, "Pulse Plating with a Trivalent Chromium Plating Bath," Plating & Surface Finishing, vol. 77 no. 10, pp. 55-57, Oct. 1990.

Tubino, Riccardo, Piseri, Luigi, and Zerbi, Giuseppe, "Lattice Dynamics and Spectroscopic Properties by a Valence Force Potential of Diamondlike Crystals: C, Si, Ge, and Sn," Journal of Chemical Physics , vol. 56 no. 3, pp. 1022-1039, Feb. 1, 1972.

Tubrini, Laura J., "Printed Wiring Boards in the Lead-free Era," Surface Mount Technology (SMT), vol. 21 no. 6, pp. 10, June 2007.

Tuck, John, "A Successor to Solder?," Circuits Assembly, vol. 4 no. 6, pp. 22,24-25, June 1993.

Tuck, John, "Conductive Adhesives Bid for Fine Pitch," Circuits Assembly, vol. 3 no. 1, pp. 22-23, Jan. 1992.

Tuck, John, "Getting the Lead Out," Circuits Assembly, vol. 3 no. 12, pp. 24-25, Dec. 1992.

Tucker, J. P., Chan, D. K., Subbarayan, G., and Handwerker, C. A., "Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys," Journal of Electronic Materials, vol. 41 no. 3, pp. 596-610, Mar. 2012.

Tucker, J. P., Chan, D. K., Subbarayan, G., and Handwerker, C. A., "Erratum to: Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys," Journal of Electronic Materials, vol. 41 no. 4, pp. 800, Apr. 2012.

Tucker, J. P., Chan, D. K., Subbarayan, G., and Handwerker, C. A., "Maximum Entropy Fracture Model and Fatigue Fracture of Mixed SnPb/Sn3.0Ag0.5Cu Solder Alloys," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 870-879.

Tucker, J. P., Chan, D. K., Subbarayan, G., and Handwerker, C. A., "Maximum entropy fracture model and its use for predicting cyclic hysteresis in Sn3.8Ag0.7Cu and Sn3.0Ag0.5 solder alloys," Microelectronics Reliability, vol. 54 no. 11, pp. 2513-2522, Nov. 2014.

Tucker, J. P., Chan, D. K., Subbarayan, G., and Handwerker, C. A., "Maximum Entropy Fracture Model and its Use for Predicting Cyclic Hysteresis in Solder Alloys," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 207-215.

Tucker, J. P., Handwerker, C. A., Russell, W., Pedigo, A. E., Ganster, A., Snugovsky, P., Bragg, J., Bagheri, Z., and Romansky, M., "NASA-DoD Pb-Free Electronics Rework Project: Effect of 1X and 2X Eutectic Solder Rework on Vibration Reliability," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 398-426.

Tucker, Reginald, "Defense Specs Keen on 'Green'," Metal Finishing, vol. 105 no. 6, pp. 51-53, June 2007.

Tucker, Reginald E., "Demystifying 'REACH'," Metal Finishing, vol. 106 no. 10, pp. 4, Oct. 2008.

Tucker, Reginald, "Working New Angles to Solve Old Problems," Metal Finishing, vol. 105 no. 1, pp. 14, 16-19, Jan. 2007.

Tucker, Stephen, "What Nasty Little Things are Lurking Inside Your Data Center?," Unisys World, vol. xx no. xx, pp. xx-xx, Nov. 2002.

Tuerlings, Serge, and Biocca, Peter, "Implementation of Reliable Lead-free Wave and SMT Processes," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies , Frankfurt, Germany, Oct. 20-22, 2004.

Tufte, O. N., and Ewald, A. W., "Gray Tin Single Crystals," Bulletin of the American Physical Society, Series II, vol. 3 no. 1, pp. 128, Jan 29, 1958.

Tukker, Andrew, "Uses and Risks of Lead in Products - Summary of a Policy Study for the EC," TMS Lead Free Workshop, San Franscisco, CA, Feb. 13, 2005.

Tukker, Arnold, Buist, Harrie, van Oers, Lauran, and van der Voet, Ester, "Risks to health and environment of the use of lead in products in the EU," Resources, Conservation, and Recycling, vol. 49 no. 2, pp. 89-109, Dec. 2006.

Tulkoff, Cheryl, "A New & Better Approach to Tin Whisker Mitigation (Tutorial 14)," SMTA International Conference, Orlando, FL, October 15, 2012.

Tulkoff, Cheryl, and Caswell, Greg, "Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes," IMAPS 2011 Symposium, Long Beach, CA, Oct. 9-13, 2011, pp. xx-xx.

Tulkoff, Cheryl, "Pad Cratering: Prevention, Mitigation and Detection Strategies (Tutorial 11)," SMTA International Conference, Orlando, FL, October 15, 2012.

Tulkoff, Cheryl, "To Kill a Circuit Board: Perils in Manual Soldering and Cleaning Processes," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 683-690.

Tullmin, Martin, and Roberge, Pierre R., "Corrosion of Metallic Materials," IEEE Transactions on Reliability , vol. 44 no. 2, pp. 271-278, June 1995.

Tumkor, Serdar, Sutherland, John W., and Kumar, Vishesh, "Electrical and Electronic Equipment Recovery and Recycling in Turkey," Energy Conversion and Resources - 2005, Orlando, FL, Nov. 5-11, 2005, pp. 443-449.

Tumne, P., Venkatadri, V., Kudtarkar, S., Delaus, M., Santos, D., Havens, R., and Srihari, K., "Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages," Journal of Electronic Packaging, vol. 134 no. 2, pp. 020905-1-020905-7, June 2012.

Tung, Chih Hang, Teo, Poi Siong, and Lee, Charles, "Interface Microstructure Evolution of Lead-Free Solder on Ni-based Under Bump Metallizations during Reflow and High Temperature Storage," Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits, Taiwan, July 5-8, 2004, pp. 225-228.

Tung, Chih Hang, Teo, Poi Siong Teo, and Lee, Charles, "Interface Microstructure Evolution of Lead-Free Solder on Ni-Based Under Bump Metallizations During Reflow and High Temperature Storage," IEEE Transactions on Device and Materials Reliability, vol. 5 no. 2, pp. 212-216, June 2005.

Tunga, Krishna, Kacker, Karan, Pucha, Raghuram V., and Sitaraman, Suresh K., "Accelerated Thermal Cycling: Is it Different for Lead-free Solder?," 54th Electronic Components & Technology Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1579-1585.

Tunga, Krishna, and Sitaraman, Suresh K., "Laser moire interferometry for fatigue life prediction of lead-free solders," Microelectronics Reliability, vol. xx no. x, pp. xx-xx, xxxx.

Tunga, Krishna, and Sitaraman, Suresh K., "Microstructure evolution based acceleration factor determination for SnAgCu solder joints during thermal cycling," International Journal of Materials and Structural Integrity, vol. 2 no. 1-2, pp. 173-192, June 2008. DOI: 10.1504/IJMSI.2008.018906

Tunga, Krishna, and Sitaraman, Suresh K., "Predictive Model Development for Life Prediction of PBGA Packages With SnAgCu Solder Joints," IEEE Transactions on Components and Packaging Technologies, vol. 33 no. 1, pp. 84-97, Mar. 2010.

Tuominen, Aulis, Nummenpaa, Pekka, and Liukkonen, Timo, "Available Thermal Budget in Lead-free Reflow Process," Proceedings of IEEE 24rd International Conference on Microelectronics, Volume 2, Nis, Serbia and Montenegro, May 16-19, 2004, pp. 441-443.

Turbini, L. J., "Comparison of Methods for Characterising Soldering Fluxes and their Interactions with Substrates and Metallisation," Circuit World, vol. 23 no. 1, pp. 20-24, 1997.

Turbini, Laura J., "Challenges of Lead-free Electronics," Surface Mount Technology (SMT), vol. 23 no. 5, pp. 20, Sept./Oct. 2009.

Turbini, Laura J., "Conductive anodic filament (CAF) formation: an historic perspective," Circuit World, vol. 32 no. 3, pp. 19-24, 2006.

Turbini, Laura J., "Copper Dissolution in Tin," Surface Mount Technology (SMT), vol. 21 no. 2, pp. 8, Feb. 2007.

Turbini, Laura J., Munie, Gregory C., Bernier, Dennis, Gamalski, Jurgen, and Bergman, David W., "Examining the Environmental Impact of Lead-Free Soldering Alternatives," 2000 IEEE International Symposium on Electronics and the Environment , San Francisco, CA, Oct. 8-10, 2000, pp. 46-53.

Turbini, Laura J., Munie, Gregory C., Bernier, Dennis, Gamalski, Jurgen, and Bergman, David W., "Examining the Environmental Impact of Lead-Free Soldering Alternatives," IEEE Transactions on Electronics Packaging and Manufacturing, vol. 24 no. 1, pp. 4-9, Jan. 2001.

Turbini, Laura J., "Growing Tin and Other Dangerous Whiskers," Surface Mount Technology , Feb. 5, 2010.

Turbini, Laura J., "Halogen: The Latest Green Initiative," SMT Web Exclusive Article.

Turbini, Laura J., Bent, Westin R., and Ready, W. Jud, "Impact of Higher Melting Lead-Free Solders on the Reliability of Printed Wiring Assemblies," 2000 SMTA International Conference Proceedings , Chicago, IL, Sept. 24-28, 2000, pp. xx-xx.

Turbini, Laura J., Bent, Westin R., and Ready, W. Jud, "Impact of Higher Melting Lead-Free Solders on the Reliability of Printed Wiring Assemblies," Journal of SMT, vol. 13 no. 4, pp. 10-14, Oct. 2000.

Turbini, Laura J., "Processing and material issues related to lead-free soldering," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 147-154, Mar. 2007.

Turbini, Laura J., "Sulfur Meets Silver," Surface Mount Technology (SMT), vol. 22 no. 3, pp. 52, Mar. 2008.

Turbini, Laura J., "The Real Environmantal Cost of Lead-Free Soldering."

Tureau, Maeva S., Arslanian, Gregory K., and Dong, Christine C., "Facilitating the Reduction of Head-in-Pillow Defects and Improving Assembly Reliability & In-line Productivity Using Nitrogen Reflow," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 183-189.

Turnbull, Aidan, "A design for life," Engineering Management, vol. 15 no. 2, pp. 32-33, Apr./May 2005.

Turnbull, Aidan, "Firms add up costs of WEEE Directive," Electronics Weekly, Dec. 10, 2004.

Turnbull, D., and Hoffman, R. E., "The Effect of Relative Crystal and Boundary Orientations on Grain Boundary Diffusion Rates," Acta Metallurgica, vol. 2 no. 3, pp. 419-426, May 1954.

Turnbull, David, "Role of Structural Impurities in Phase Transformations," Impurities and Imperfections, Chicago, IL, Oct. 30-Nov. 5, 1955, pp. 121-144.

Turner, Jim, "What do we mean by lead free?," Electronics Weekly, May 21, 2003.

Turner, Kevin T., Mlcak, Richard, Roberts, David C., and Spearing, S. Mark, "Bonding of Bulk Piezoelectric Material to Silicon Using a Gold-Tin Eutectic Bond," Materials Research Society Symposium Proceedings Volume 687, Materials Science of Micromechanical Systems (MEMS) Devices IV, Boston, MA, Nov. 25-28, 2001. pp. 49-54

Turner, Mark, and Callaghan, Dominic, "UK to finally implement the WEEE Directive," Computer Law and Security Report, vol. 23 no. 1, pp. 73-76, 2007.

Turner, Mark, and Callaghan, Dominic, "Will IT in the UK become greener in 2006? - The impact of the new UK Regulations on the use of hazardous substances in electrical and electronic equipment," Computer Law & Security Report, vol. 22 no. 2, pp. 172-175, 2006.

Turner, Tim, and Parsons, Bob, "A New Failure Mechanism: Al-Si Bond Pad Whiskers Growth During Life Test," 32nd Electronic Components Conference, San Diego, CA, May 10-12, 1982, pp. 416-420.

Turpe, M., "Evaluation of Lead Free Soldering Development by Means of a Holistic Consideration," Advanced Engineering Materials, vol. 8 no. 3, pp. 161-164, Mar. 2006.

Tyagi, Neha, Jaiswal, Neeraj K., Kovacevic, Goran, and Srivastava, Pankaj, "On the evolution and electronic properties of self-assembled gold nanowires," Computational Materials Science, vol. 130, pp. 222-231, Apr. 1, 2017.

Tyagi, Pawan, and Hinds, Bruce J., "Mechanism of ultrathin tunnel barrier failure due to mechanical-stress-induced nanosized hillocks and voids," Journal of Vacuum Science & Technology B, vol. 28 no. 3, pp. 517-521, May/June 2010.

Tyler, Don, and Dennehy, Charley, "Reliability of Ball Grid Arrays Converted from Pb-free to Tin-Lead by Robotic Hot Solder Dip (RHSD)," 6th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Oberpfaffenhofen, Germany, Apr. 15-16, 2015, pp. xx-xx.

Tyler, Don, "Robotic Hot Solder Dip for Prevention of Tin Whiskers and Weak Solder Joints," Tin Whisker Group teleconference, Nov. 6, 2012.

Tyler, Donald, "Tin Whisker Mitigation Through Robotic Hot Solder Dip (RHSD)," 2007 Medical Electronics Symposium, Minneapolis, MN, May 1-3, 2007, pp. xx-xx.

Tzan, S.-R., and Chu, S.-L., "Characterization of Lead-free Solder by Reliability Testing," Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, Santa Clara, CA, Oct. 2-4, 2000, pp. 270-273.

Tzeng, G.-S., "Effects of Additive Agents on the Kinetics of Tin Electrodeposition from An Acidic Solution of Tin(II) Sulfate," Plating & Surface Finishing , vol. 82 no. 11, pp. 67-71, Nov. 1995.

Tzeng, Ruoh-Ning, Huang, Yan-Pin, Chien, Yu-San, Chuang, Ching-Te, Hwang, Wei, Chiou, Jin-Chern, Shy, Ming-Shaw, Lin, Teu-Hua, Chen, Kou-Hua, Chiu, Chi-Tsung, Tong, Ho-Ming, and Chen, Kuan-Neng, "Low Temperature Bonding of Sn/In-Cu Interconnects for Three-Dimensional Integration Applications," 2013 IEEE International Interconnect Technology Conference, Kyoto, Japan, June 13-15, 2013, pp. xx-xx.

Tzeng-Cherng, Luo, Meng-Chieh, Liao, Te-Chun, Huang, and Chen-Yu, Huang, "Evaluation of board level reliability of BGAs under thermal cycling test," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Tzu, Fu-Ming, Chao, Long-Sun, and Chou, Jung-Hua, "Failure Analysis of Lead-Free Solder Joints for Flip Chip on Board," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 314-317.

UUUU

U, Aung San, and Toomer, Barbara, "An Expert Infobase System for Tracing Hazardous Materials in Engineering Documents and System Requirements for Materials Information Standardization," Journal of Testing and Evaluation, vol. 25 no. 3, pp. 341-348, May 1997.

U. S. Geological Survey, "Mineral Commodity Summaries 2005," 2005.

Ubachs, R. L. J. M., Schreurs, P. J. G., and Geers, M. G. D., "Elasto-viscoplastic nonlocal damage modelling of thermal fatigue in anisotropic lead-free solder," Mechanics of Materials, vol. 39 no. 7, pp. 685-701, July 2007.

Ubachs, R. L. J. M., "Electromigration in WLCSP solder Bumps," Microelectronics Reliability , vol. 50 no. 9-11, pp. 1678-1683, Sept.-Nov. 2010.

Uchibori, Chihiro J., Zhang, Xuefeng, Ho, Paul S., and Nakamura, Tomoji, "Impact of Chip-Package Interaction on Reliability of Cu/Ultra low-k Interconnects for 65nm Technology and beyond," 8th International Conference on Solid-State and Integrated Circuit Technology , Shanghai, China, Oct. 23-26, 2006, pp. 314-317.

Uchic, Michael D., Holzer, Lorenz, Inkson, Beverley J., Principe, Edward L., and Munroe, Paul, "Three-Dimensional Microstructural Characterization Using Focused Ion Beam Tomography," MRS Bulletin, vol. 32 no. 5, pp. 408-416, May 2007.

Uchida, Masayuki, Ito, Hisashi, Yabui, Ken, Nishiuchi, Hideo, Togasaki, Takashi, Higuchi, Kazuhito, and Ezawa, Hirokazu, "Low-Stress Interconnection for Flip Chip BGA Employing Lead-Free Solder Bump," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 885-891.

Uddin, M. A., Chan, Y. C., Chan, H. P., and Alam, M. O., "A Continuous Contact Resistance Monitoring during the Temperature Ramp of Anisotropic Conductive Adhesive Film Joint," Journal of Electronic Materials, vol. 33 no. 1, pp. 14-21, Jan. 2004.

Uddin, M. A., Alam, M. O., Chan, Y. C., and Chan, H. P., "Adhesion strength and contact resistance of flip chip on flex packages - effect of curing degree of anisotropic conductive film," Microelectronics Reliability, vol. 44 no. 3, pp. 505-514, Mar. 2004.

Uddin, M. A., Alam, M. O., Chan, Y. C., and Chan, H. P., "Plasma Cleaning of the Flex Substrate for Flip-Chip Bonding with Anisotropic Conductive Adhesive Film," Journal of Electronic Materials, vol. 32 no. 10, pp. 1117-1124, Oct. 2003.

Udomleartprasert, Panyaluck, "Roadmap to Green Supply Chain Electronics: Design for Manufacturing Implementation and Management," Proceedings of 2004 International IEEE Conference on the Asian Green Electronics, Hong Kong, China, Jan 5-9, 2004, pp. 169-173.

Ueda, Ryo, Okuyama, Masanobu, Abe, Jiro, Kiga, Tomoya, and Taniguchi, Yoshikuni, "Evaluation of Lead-free Flux Cored Wire Solder in Sony," Yosetsu Gakkai Shi/Journal of the Japan Welding Society, vol. 69 no. 2, pp. 19-29, Mar. 2000.

Uegai, Yasumi, and Tani, Shuichi, "Accelerated Reliability Test Method of Thermal Cycle Life for Solder Joints of Electronic Devices," Journal of the Society of Materials Science , vol. 53 no. 2, pp. 218-222, Feb. 2004.

Uemura, Taiki, Sakai, Taiji, and Sakuyama, Seiki, "Improvement of mechanical properties of In-48mass%Sn solder by Ag and Cu addition," 2016 IEEE 18th Electronics Packaging Technology Conference , Singapore, Nov. 30-Dec. 3, 2016, pp. 181-184.

Uenishi, Keisuke, Saeki, Toshio, Kohara, Yasuhiro, Kobayashi, Kojiro F., Shoji, Ikuo, Nishiura, Masataka, and Yamamoto, Masaharu, "Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au/Ni Coated Cu Pads," Materials Transactions, vol. 42 no. 5, pp. 756-760, May 2001.

Uenishi, Keisuke, and Kobayashi, Kojiro F., "Interfacial Reaction between Sn-Ag Based Solders and Au/Ni Alloy Platings," Materials Science Forum, vol. 502, pp. 411-416, 2005.

Uenishi, Keisuke, Kohara, Yasuhiro, Sakatani, Shigeaki, Saeki, Toshio, Kobayashi, Kojiro F., and Yamamoto, Masaharu, "Melting and Joining Behavior of Sn/Ag and Sn/Ag/Sn-Bi Plating on Cu Core Ball," Materials Transactions, vol. 43 no. 8, pp. 1833-1839, Aug. 2002.

Uesugi, Ken'ji, Ishikawa, Kazunori, Shimizu, Masanobu, Shiramatsu, Eiji, Hirukawa, Hiroshi, Nishiguchi, Masaki, and Muramatsu, Shin, "Development of Environment-Friendly Products at Furukawa Electric," Furukawa Review, no. 19, pp. 75-79, Apr. 2000.

Ukita, Yasunari, Tateyama, Kazuki, Segawa, Masao, Tojo, Yoshihiko, Gotoh, Hideyuki, and Oosako, Katsuhisa, "Lead Free Die Mount Adhesive Using Silver Nanoparticles Applied To Power Discrete Package," Advancing Microelectronics, vol. 32 no. 5, pp. 8-11, Sept.-Oct. 2005.

Ukita, Yasunari, Tateyama, Kazuki, Segawa, Masao, Tojo, Yoshihiko, Gotoh, Hideyuki, and Oosako, Katsuhisa, "Lead Free Die Mount Adhesive Using Silver Nanoparticles Applied To Power Discrete Package," Journal of Microelectronics and Electronic Packaging , vol. 2 no. 3, pp. 217-222, Third Quarter 2005.

Ulmschneider, William P. "RoHS Wins Converts Despite Exemptions," Surface Mount Technology (SMT) , vol. 21 no. 12, pp. 20-21, Dec. 2007.

Ulrich, O., Biquard, X., Bleuet, P., Geaymond, O., Gergaud, P., Micha, J. S., Robach, O., and Rieutord, F., "A new white beam x-ray microdiffraction setup on the BM32 beamline at the European Synchrotron Radiation Facility," Review of Scientific Instruments, vol. 82 no. 3, pp. 033908-1-033908-6, Mar. 2011.

Umair, Shakila, Bjorklund, Anna, and Petersen, Elisabeth Ekener, "Social impact assessment of informal recycling of electronic ICT waste in Pakistan using UNEP SETAC guidelines," Resources, Conservation and Recycling, vol. 95, pp. 46-57, Feb. 2015.

Umalas, Madis, Vlassov, Sergei, Polyakov, Boris, Dorogin, Leonid M., Saar, Rando, Kink, Ilmar, Lohmus, Runno, Lohmus, Ants, and Romanov, Alexey E., "Electron beam induced growth of silver nanowhiskers," Journal of Crystal Growth, vol. 410, pp. 63-68, Jan. 15, 2015.

Ume, Ifeanyi Charles, and Gong, Jie, "Evaluation of Lead-Free Solder Bump Voiding Ball Grid Array Packages Using Laser Ultrasound and Interferometric Technique," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 8, pp. 1310-1320, Aug. 2013.

Umehara, H., Takaya, M., and Terauchi, S., "Chrome-free surface treatments for magnesium alloy," Surface and Coatings Technology, vol. 169-170 no. 1, pp. 666-669, June 2, 2003.

Umehara, Hiroyuki, Takaya, Matsufumi, and Kojima, Yo, "An Investigation of the structure and corrosion resistance of a permanganate conversion coatings on AZ91D magnesium alloy," Keikinzoku/Journal of Japan Institute of Light Metals, vol. 50 no. 3, pp. 109-115, Mar. 2000.

Umeno, Yoshitaka, and Negami, Jun, "Atomistic Simulation of Stress-Induced Grain Boundary Diffusion: For Tin-Whisker Problem," Materials Science Forum, vol. 706-709, pp. 1545-1549, Jan. 2012.

Umino, Shigeru, Ogata, Hiroyuki, and Kato, Chiaki, "Properties of Chromate-Free Coated Electrogalvanized Steel Sheets for Electrical Appliances," Kawasaki Steel Technical Report, no. 46, pp. 31-36, June 2002.

Umlauf, Jan, and Dusek, Karel, "Qualification processes during flux and solder paste evaluation," 2016 39th International Spring Seminar on Electronics Technology, Pilsen, Czech Republic, May 18-22, 2016, pp. 218-221.

Unal, O., Anderson, I. E., Harringa, J. L., Terpstra, R. L., Cook, B. A., and Foley, J. C., "Application of an Asymmetrical Four-Point Bend Shear Test to Solder Joints," Journal of Electronic Materials, vol. 30 no. 9, pp. 1206-1213, Sept. 2001.

Unal, O., and Foley, J. C., "Effects of temperature and loading rate on the shear strength and shear yield stress of lead-free 97Cu-3Sn and 95.5Cu-4Sn-0.5Ag solder alloys," Journal of Materials Science Letters, vol. 20 no. 17, pp. 1585-1587, Sept. 2001.

Unsworth, D. A., and Mackay, C. A., "A Preliminary Report on Growth of Compound Layers on Various Metal Bases Plated with Tin and its Alloys," Transactions of the Institute of Metal Finishing, vol. 51, pp. 85-90, 1973.

Uppalapati, Ramgopal V., Leiser, Kristie, Van Sickle, Mark, Parupalli, Satish, and Vasudevan, Vasu, "Board Design Influence on BGA Mechanical Reliability," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1788-1795.

Upton, P., "The Effect of Sealers on Increase of Corrosion Resistance of Chromate-Free Passivates on Zinc & Zinc Alloys," Plating & Surface Finishing , vol. 88 no. 2, pp. 68-71, Feb. 2001.

Upton, Paul, "The Effect Of Sealers On Increasing The Corrosion Resistance Of Chromate Free Passivates On Zinc And Zinc Alloys," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Upton, Paul, "The Effect of Sealers on Increasing the Corrosion Resistance of Chromate Free Passivates on Zinc and Zinc Alloys," Transactions of the Institute of Metal Finishing, vol. 78 no. 4, pp. B45-B48, July 2000.

Upton, Paul, "The Use Of Chromate-free Passivates & Passivate Sealers On Zinc And Zinc Alloys," 22nd AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 29-Feb. 1, 2001, pp. xx-xx.

Urabe, Motohiko, Asakawa, Motoo, Kajino, Satoshi, Hamada, Ryota, and Kashiyama, D., "Improvement of straightness in tension annealing for superfine wire," Wire Journal International, vol. 42 no. 7, pp. 66-71, July 2009.

Urbanek, Jan, and Dusek, Karel, "Measurements of the solders surface tension values," 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Como, Italy, Apr. 24-26, 2006, pp. xx-xx.

Uribe, Fernando, "Assessment of Microelectronics Packaging for High Temperature, High Reliability Applications," Sandia Report SAND97-0745.

Uryu, Tsutomu, Yoshinaga, Jun, and Yanagisawa, Yukio, "Environmental Fate of Gallium Arsenide Semiconductor Disposal: A Case Study of Mobile Phones," Journal of Industrial Ecology, vol. 7 no. 2, pp. 103-112, Summer 2003.

Usami, Mitsuo, "Thin Silicon Chips and ACF Connection Technology for Contactless IC Cards," Proceedings of SPIE - The International Society for Optical Engineering Volume 3906 / 1999 International Symposium on Microelectronics, Chicago, IL, Oct. 26-28, 1999, pp. 309-312.

Ushio, Noriki, "Lead Free Activities of JEITA," Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 11-15, 2001, pp. 1047-1049.

Usman, Mohammad A. U., Smith, Brady J., Jackson, Justin B., De Long, Matthew C., and Miller, Mark S., "Titanium catalyzed silicon nanowires and nanoplatelets," AIP Advances , vol. 3 no. 3, pp. 032112-1-032112-6, Mar. 2013.

Ustun, O., Yilmaz, M., Ali-Zada, P., Tuncay, R. N., and Mamadov, H., "Car and Renewable Energy Storage Accumulators Active Life Extension for Hazardous Wastes Eco-impact Minimization," 2010 IEEE Vehicle Power and Propulsion Conference, Lille, France, Sept. 1-3, 2010, pp. xx-xx.

Usui, M., Satoh, T., Kimura, H., Tajima, S., Hayashi, Y., Setoyama, D., and Kato, M., "Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding," Microelectronics Reliability, vol. 78, pp. 93-99, Nov. 2017.

Uszynski, I., and Kubiak, R., "On products of InMg corrosion in wet air and their conversion during annealing in vacuum," Journal of Alloys and Compounds, vol. 218 no. 2, pp. 259-262, Mar. 1, 1995.

Uvarajan, M. V., Lim, L. H., Goh, M. H., Ng, F. L., and Pan, W. C., "Temperature Cycling Aging Studies of Zn-based Solders for high-temperature applications," 2015 IEEE 17th Electronics Packaging and Technology Conference, Singapore, Dec. 2-4, 2015, pp. xx-xx.

VVVV

V, Ramakrishna H., S, Harish H., J, Manjuvani, Bhaskar, Vangapandu, Kumar, Ramesh, Patil, Vikas, Sarkar, Siuli, and Cucu, Traian C., "Engineered Flux for Low Temperature Solders," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Vaccaro, B. T., Shook, R. L., Thomas, E., Gilbert, J. J., Horvath, C., Dairo, A., and Libricz, G. J., "PBGA Package Warpage and Impact on Traditional MSL Classification for Pb-Free Assembly," Circuits Assembly, vol. 16 no. 5, pp. 28-29, May 2005.

Vaccaro, B. T., Shook, R. L., Thomas, E., Gilbert, J. J., Horvath, C., Dairo, A., and Libricz, G. J., "Plastic Ball Grid Array Package Warpage and Impact on Traditional MSL Classification For Pb-Free Assembly," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 165-171.

Vaccaro, B. T., Shook, R. L., and Gerlach, D. L., "The Impact Of Lead-Free Reflow Temperatures on the Moisture Sensitivity Performance Of Plastic Surface Mount Packages," Journal of SMT, vol. 16 no. 4, pp. 21-26, Oct. 2003.

Vaccaro, B. T., Shook, R. L., and Gerlach, D. L., "The Impact Of Lead-Free Reflow Temperatures on the Moisture Sensitivity Performance Of Plastic Surface Mount Packages," 2000 SMTA International Conference Proceedings, Chicago, IL, Sept. 24-28, 2000, pp. xx-xx.

Vaccaro, Brian, Gerlach, Dan, Coyle, Richard, Popowich, Richard, Manock, John, McCormick, Heather, Riccitelli, George, and Fleming, Debra, "Influence of Package Construction and Board Design Variables on the Solder Joint Reliability of SnPb and Pb-Free PBGA Packages," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 272-282.

Vachaparambil, Kurian J., Martensson, Gustaf, and Essen, Lars, "Rheological characterization of non-Brownian suspensions based on structure kinetics," Soldering & Surface Mount Technology, vol. 30 no. 1, pp. 57-64, 2018.

Vadde, Srikanth, Kamarthi, Sagar V., and Gupta, Surendra M., "Pricing of End-of-Life Items with Obsolescence," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 156-160.

Vafaeenezhad, H., Seyedein, S. H., Aboutalebi, M. R., and Eivani, A. R., "An investigation of workability and flow instability of Sn-5Sb lead free solder alloy during hot deformation," Materials Science and Engineering: A, vol. 718, pp. 87-95, Mar. 7, 2018.

Vafaeenezhad, H., Seyedein, S. H., Aboutalebi, M. R., and Eivani, A. R., "Application of constitutive description and integrated ANFIS - ICA analysis to predict hot deformation behavior of Sn-5Sb lead-free solder alloy," Journal of Alloys and Compounds, vol. 697, pp. 287-299, Mar. 15, 2017.

Vafaeenezhad, H., Seyedein, S. H., Aboutalebi, M. R., Eivani, A. R., and Nikan, O., "Creep life prediction for Sn-5Sb lead-free solder alloy: Model and experiment," Microelectronic Engineering, vol. 207, pp. 55-65, Feb. 15, 2019.

Vafaeenezhad, H., Seyedein, S. H., Aboutalebi, M. R., and Eivani, A. R., "Incorporating the Johnson-Cook Constitutive Model and a Soft Computational Approach for Predicting the High-Temperature Flow Behavior of Sn-5Sb Solder Alloy: A Comparative Study for Processing Map Development," Journal of Electronic Materials, vol. 46 no. 1, pp. 467-477, Jan. 2017.

Vafaeenezhad, H., Seyedein, S. H., Aboutalebi, M. R., and Eivani, A. R., "Quantitative Assessment of Dynamic Recovery Kinetics in Sn-5Sb Lead-Free Solder Alloy During Hot Working," Journal of Electronic Materials , vol. 47 no. 11, pp. 6868-6877, Nov. 2018.

Vaishampayan, Nandini, "Effect of Impurity Addition on the Crystal Growth Mechanism of Selenium Single Crystals from the Vapour Phase," Journal of Crystal Growth , vol. 20 no. 1, pp. 73-74, Aug. 1973.

Vakanas, G. P., Vandecasteele, B., Schaubroek, D., De Messemaeker, J., Willems, G., Ashworth, M. A., Wilcox, G. D., and De Wolf, I., "Sn whisker evaluations in 3D microbumped structures," Microelectronics Reliability, vol. 54 no. 9-10, pp. 1982-1987, Sept.-Oct. 2014.

Valero, Greg, "Are Hex Chrome's Days Numbered?," Metal Finishing, vol. 103 no. 11, pp. 47-49, Nov. 2005.

Valero, Greg, "State of the Industry: Where Do We Stand?," Metal Finishing, vol. 104 no. 1, pp. 14-19, 56, Jan. 2006.

Valero, Greg, "The Painful Truth About Chrome PEL." Metal Finishing, vol. 103 no. 1, pp. 15-19, Jan. 2005.

Valero, Leopoldo, "Revised Plastic Package Crack Mechanism for Large Pad PLCC Packages," Surface Mount International Proceedings of the Technical Program, San Jose, CA, Aug. 29-31, 1995, pp. 632-639.

Valette, Ludovic, Hoevel, Bernd, Jestad, Karin, and Aoyama, Tomoyuki, "Characterization of the Thermal Stability of Electrical Laminates Suitable for Lead-Free Soldering," IPC Review, vol. 46 no. 11, pp. 6, Dec. 2005.

Valette, Ludovic, Hoevel, Bernd, Jestadt, Karin, and Aoyama, Tomoyuki, "Lead Free Soldering: Impact on Laminates Requirements," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S07-02-1-S07-02-12.

Valfridsson, Martin, "Evaluation and Implementation of Halogen-Free Printed Circuit Board Materials for Telecom Applications," CircuiTree, vol. 13 no. 11, pp. xx, Nov. 2000.

Valkama, Jani, and Keskinen, Marika, "Comparison of Simplified LCA Variations for Three LCA Cases of Electronic Products from the Ecodesign Point of View," 2008 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 19-21, 2008, pp. xx-xx.

Valloton, J., Wagniere, J.-D., and Rappaz, M., "Competition of the primary and peritectic phases in hypoperitectic Cu-Sn alloys solidified at low speed in a diffusive regime," Acta Materialia , vol. 60 no. 9, pp. 3840-3848, May 2012.

Valooran, Rohit, and Anselm, Martin, "Investigation of the Factors Influencing the Performance of Low Temperature Solder," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 550-561.

Valota, Anna Tiziana, Losavio, Aldo, Renard, Loic, and Vicenzo, Antonello, "High Speed Pull Test Characterization of BGA solder joints," 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Como, Italy, Apr. 24-26, 2006, pp. xx-xx.

van Arkel, A. E., and Koets, P., "Das Wesen der Rekristallisationskerne bei Metallen," Zeitschrift fur Physik, vol. 41 pp. 701-707, 1927.

van Beelen, D. C., Rouw, P., Boomgaard, R, and Zabel, K., "Aviox CF Primer: a new generation primer for aircraft maintenance," Anti-Corrosion Methods and Materials, vol. 44 no. 2, pp. 123-128, 1997.

van Beelen, D. C., Rouw, P., Boomgaard, R, and Zabel, K., "Aviox CF Primer: a new generation primer for aircraft maintenance," Pigment & Resin Technology, vol. 27 no. 1, pp. 28-33, 1998.

Van Benschoten, Andrea Lyn, "Boots Retail (Ireland) Pleads Guilty to WEEE Violations," Manufacturing.net, Feb. 9, 2006.

Vandaele, K., He, Bin, Van Der Voort, P., De Buysser, K., and Heremans, J. P., "Wet-Chemical Synthesis of Enhanced-Thermopower Bi1-xSbx Nanowire Composites for Solid-State Active Cooling of Electronics," Physical Review Applied , vol. 9 no. 2, pp. 024020-1-024020-12, Feb. 2018.

Vandamme, L. K. J., Perichaud, Marie Genevieve, Noguera, E., Danto, Yves, and Behner, Ulrich, "1/f Noise as a Diagnostic Tool to Investigate the Quality of Isotropic Conductive Adhesive Bonds," IEEE Transactions on Components and Packaging Technologies, vol. 22 no. 3, pp. 446-454, Sept. 1999.

van de Groenendaal, Hans, "RoHS - is it overkill?," EngineerIT, pp. xx-xx, Jan, 2010.

Van de Leest, R. E., and Wessels, J., "Stabilization of Black Chromate Conversion Coatings on Zinc," Plating and Surface Finishing, vol. 67 no. 5, pp. 86-21, May 1980.

van den Bogaard, J. A., Shangguan, D., Jayaram, J. S. R., Hulsken, G., Brombacher, A. C., and Ion, R. A., "Using dynamic reliability models to extend the economic life of strongly innovative products," Proceedings of 2004 International Symposium on Electronics and the Environment, May 10-13, 2004, pp. 220-225.

van den Bosch, Brett, "Cause of tin whiskers identified," Dataweek, vol. 36 no. 1, pp. 4, Jan. 23, 2013.

van den Ende, Daan A., Hendriks, Rob, Cauchois, Romain, Kusters, Roel H. L., Cauwe, Maarten, Groen, Wilhelm A., and van den Brand, Jeroen, "Photonic Flash Soldering of Thin Chips and SMD Components on Foils for Flexible Electronics," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 4 no. 11, pp. 1879-1886, Nov. 2014.

van den Winjgaerd, Eddy, "Myths and beliefs in modern electronic assembly and soldering techniques, Santa Claus and resolutions for 2008," Dataweek, vol. xx no. xx, pp. xx-xx, Feb. 20, 2008.

van den Wijngaerd, Eddy, "Reminisence and aftermath of the lead-free seminars held throughout the country," Dataweek, vol. xx no. xx, pp. xx-xx, Jan. 24, 2007.

Vanderpan, Crystal, "Lead Free Material Requirements - and Options - for Fast UL Qualification," EIPC Winter Conference, Barcelona, Spain, pp. xx-xx, 2005.

Vanderpan, Crystal, "Lead Free PCB Surface Finishes in Compliance with UL," IPC Printed Circuits Expo, Anaheim, CA, 2005, pp. xx-xx.

Vanderpan, Crystal, "PWB Thermal Management and UL Pre-Selection Programs," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. FF-04.

van der Pas, Frando, and Lachowicz, Agata, "Immersion tin: the final answer for lead-free?," Printed Circuit Europe, vol. xx no. xx, pp. 32-35, 4th Quarter 2003.

van der Pas, Frando, Yau, Yung-Herng, Wengenroth, Karl, and Kenny, Jim, "Selecting the Right Final Finish for RoHS Compliant PCBs," Printed Circuit Design and Manufacture, vol. 24 no. 3, pp. 40-43, Mar. 2007.

Van der Planken, J., and Deruyttere, A., "A Scanning Electron Microscope Study of Vapour Grown Magnesium," Journal of Crystal Growth, vol. 11 no. 3, pp. 273-279, Dec. 1971.

Vander Plas, Hubert A., Cinque, Russell B., Mei, Zequn, and Holder, Helen, "Assessment of Low-Temperature Fluxes," Hewlett-Packard Journal , vol. 47 no. 4, pp. 99-103, Aug. 1996.

Vandervoort, Steve, Amir, Dudi, Aspandiar, Raiyo, Hua, Fay, Li, Bin, Murtagian, Gregorio, and Sidhu, Rajen S., "Head-and-Pillow Defects in BGA Sockets," SMTA International Conference , San Diego, CA, Oct. 4-8, 2009, pp. 438-446.

Vandevelde, B., Labie, R., Cherman, V., Webers, T., Winters, C., Beyne, E., and Dosseul, Franck, "Electromigration, fuse and thermo-mechanical performance of solder bump versus Cu pillar flip chip assemblies," 2011 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Linz, Austria, Apr. 18-20, 2011, pp. xx-xx.

Vandevelde, B., Deweerdt, R., Duflos, F., Gonzalez, M., Vanderstraeten, D., Blansaer, Eddy, Brizar, Guy, and Gillon, Renaud, "Impact of Moisture Absorption on Warpage of Large BGA Packages during a lead-free reflow process," 15th International Workshop on Thermal Investigations of ICs and Systems, Leuven, Belgium, Oct. 7-9, 2009, pp. 113-116.

Vandevelde, Bart, Driessens, Evelien, Chandrasekhar, Arun, Beyne, Eric, Van Puymbroeck, Jef, and Heerman, Marcel, "Characterisation of the Polymer Stud Grid Array (PSGA), a Lead-Free CSP for High Performance & High Reliable Packaging," 2001 SMTA International Conference Proceedings, Chicago, IL, Sept. 30-Oct. 4, 2001, pp. xx-xx.

Vandevelde, Bart, Vanhee, Filip, Pissoort, Davy, Degrendele, Lieven, De Baets, Johan, Allaert, Bart, Lauwaert, Ralph, Labie, Riet, and Willems Geert, "Four-point bending cycling as alternative for thermal cycling solder fatigue testing," 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Montpelier, France, Apr. 18-20, 2016, pp. xx-xx.

Vandevelde, Bart, Vanhee, Filip, Pissoort, Davy, Degrendele, Lieven, De Baets, Johan, Allaert, Bart, Lauwaert, Ralph, Zanon, Franco, Labie, Riet, and Willems, Geert, "Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components," Microelectronics Reliability , vol. 74, pp. 131-135, July 2017.

Vandevelde, Bart, Vanfleteren, Jan, Vandecasteele, Bjorn, Gonzalez, Mario, Ratchev, Petar, Schildermans, Inge, Willems, Geert, Wiese, Joachim, Hagedorn, Hans-Werner, Manessis, Dion, Mango, M., Maatttanen, Jarmo, Maakannas, Greta, Vanderstraeten, Daniel, Blansaer, Eddy, Kriebel, Frank, and Lopez, Manual, "FP5-CSG-IMECAT: Highlights of a EC funded Project on Lead Free Materials and Assembly Development Technologie," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Vandevelde, Bart, Willems, Geert, and Allaert, Bart, "Hidden Head-In-Pillow soldering failures," 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Ghent, Belgium, Apr. 7-9, 2014, pp. xx-xx.

Vandevelde, Bart, Ratchev, Petar, Labie, Riet, Vanfleteren, Jan, and Gonzalez, Mario, "IMEC goes Lead-free," Leuven, Feb. 6, 2004.

Vandevelde, Bart, Van Kerckhove, Matthias, Degryse, Dominiek, D'Haese, Wim, Schaubroeck, David, Allaert, Bart, Geerinckx, Eddy, Lauwaert, Ralph, and Willems, Geert, "Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode," 2013 European Microelectronics Packaging Conference, Grenoble, France, Sept. 9-12, 2013, pp. xx-xx.

Vandevelde, Bart, Labie, Riet, Lauwaert, Ralph, Werkhoven, Daniel, Vanderstraeten, Daniel, Blansaer, Eddy, Lannoo, Jonas, and Pissoort, Davy, "Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q," 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Hanover, Germany, March 24-27, 2019, pp. xx-xx.

Vandevelde, Bart, Gonzalez, Mario, Limaye, Paresh, Ratchev, Petar, Vanfleteren, Jan, and Beyne, Eric, "Lead Free Solder Joint Reliability Estimation by Finite Element Modeling: Advantages, Challenges and Limitations," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.

Vandevelde, Bart, "New brittle fracture test reveals importance of choosing the right board finish," Global SMT and Packaging, vol. 14 no. 4, pp. 16-17, Apr. 2014.

Vandevelde, Bart, Chandrasekhar, Arun, Driessens, Evelien, Beyne, Eric, Van Puymbroeck, Jef, and Heerman, Marcel, "The PSGA, a Lead-Free CSP for High Performance & High Reliable Packaging," Proceedings 2001 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4587), Baltimore, MD, Oct. 9-11, 2001, pp. 260-265.

Vandevelde, Bart, Gonzalez, Mario, Limaye, Paresh, Ratchev, Petar, and Beyne, Eric, "Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison for several IC-packages," Eurosime04 Conference, Brussels, May 9-12, 2004, pp.

Vandevelde, Bart, Gonzalez, Mario, Limaye, Paresh, Ratchev, Petar, and Beyne, Eric, "Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages," Microelectronics Reliability, vol. 47 no. 2-3, pp. 259-265, Feb.-Mar. 2007.

van de Ven, Niek, Ouendag, Rene, Pronk, Leo, and Vlutters, Herman, ""Whiskers" the Root Cause of Spontaneous Short Circuits."

Vandivier, Blair, and Flanigan, Michael, "A New Alternative for Decorative Hexavalent Chromium Plating," 21st AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 17-19, 2000, pp. 83-87.

Vanfleteren, Jan, Vandecasteele, Bjorn, and Podprocky, Tomas, "Low Temperature Flip-Chip Process using ICA and NCA (Isotropically and Non-Conductive Adhesive) for Flexible Displays Application," Proceedings of 4th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2002, pp. 139-143.

Vanfleteren, Jan, Vandecasteele, Bjorn, Raevens, Steven, Maattanen, Jarmo, and Perttula, Pasi, "Reduced Temperature Flip-Chip Technologies on Flexible Display Substrates using Adhesives," 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Zalaegerszeg, Hungary, June 23-26, 2002, pp. 92-95.

van Heerden, David, and Subramanian, Jai S., "Room-temperature Solder Bonding of Electronic Packages," Advanced Packaging, vol. 15 no. 5, pp. 20, May/June 2006.

van Kan, J. A., Zhang, F., Chiam, S. Y., Osipowicz, T., Bettiol, A. A., and Watt, F., "Proton beam writing: a platform technology for nanowire production," Microsystem Technologies, vol. 14 no. 9-11, pp. 1343-1348, Oct. 2008.

van Kleef, Marc, Bielen, Jeroen, Gulpen, Jan, and Ramos, Mike, "Delamination and solder flow-out in underfilled and Pb-free flip chips on laminate," Microelectronics International, vol. 22 no. 2, pp. 28-34, Feb. 2005.

Vann, Kevin, Musson, Stephen, and Townsend, Timothy, "Evaluation of a modified TCLP methodology for RCRA toxicity characterization of computer CPUs," Journal of Hazardous Materials, vol. 129, no. 1-3, pp. 101-109, Feb. 28, 2006.

Vann, Kevin N., Musson, Stephen E., and Townsend, Timothy G., "Factors affecting TCLP lead leachability from computer CPUs," Waste Management, vol. 26 no. 3, pp. 293-298, 2006.

Van Lent, P. H., "The Position of Gray Tin in the Tin-Mercury System," Acta Metallurgica , vol. 9 no. 2, pp. 125-128, Feb. 1961.

Van Lent, P. H., "The Preparation of Gray Tin Single Crystals by Transformation of Tin-Mercury Alloys," Acta Metallurgica, vol. 10 no. 11, pp. 1089-1100, Nov. 1962.

van Noort, H. M., Kloos, M. J. H., and Schafer, H. E. A., "Anisotropic Conductive Adhesives for Chip on Glass and Other Flip Chip Applications," Journal of Electronics Manufacturing, vol. 5 no. 1, pp. 27-31, Mar. 1995.

Van Scoyoc, Susan B., Naguy, Tom, Osborne, Joseph, Babcock, Ed. A., and Gaydos, Stephen, "High-Strength Steel Joint Test Protocol For Validation of Alternatives to Low Hydrogen Embrittlement Cadmium For High-Strength Steel Landing Gear and Component Applications," Proceedings 2004 AESF/EPA Conference for Environmental & Process Excellence, Orlando, FL, Jan. 26-29, 2004, pp. 313-321.

van Soestbergen, M., and Zaal, J. J. M., "Predictive modeling of competing failure mechanisms using a dedicated constitutive relation for solder alloy," 2018 7th Electronic System-Integration Technology Conference, Dresden, Germany, Sept. 18-21, 2018, pp. xx-xx.

van Steenberge, Nele, Vandevelde, Bart, Schildermans, Inge, and Willems, Geert, "Analytical and Finite Element Models of the Thermal Behavior for Lead-free Soldering Processes in Electronic Assembly," Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, Apr. 18-20, 2005, pp. 675-680.

Van Steenberge, Nele, Limaye, Paresh, Willems, Geert, Vandevelde, Bart, and Schildermans, Inge, "Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly," Microelectronics Reliability, vol. 47 no. 2-3, pp. 215-222, Feb.-Mar. 2007.

van Tiggelen-Aarden, Ineke, and Westerlaken, Eli, "Performing Flux-Technology for Pb-Free SN100C Solders," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S28:01.

Van Vechten, J. A., "Quantum Dielectric Theory of Electronegativity in Covalent Systems. III. Pressure-Temperature Phase Diagrams, Heats of Mixing, and Distribution Coefficients," Physical Review B, vol. 7 no. 4, pp. 1479-1507, Feb. 15, 1973.

Van Wuytswinkel, G., Dreezen, G., and Luyckx, G., "The Effects of Temperature and Humidity Aging on the Contact Resistance of Novel Electrically Conductive Adhesives," 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Zalaegerszeg, Hungary, June 23-26, 2002, pp. 225-230.

VanZandt, T., Browning, R., and Landolt, M., "Iron overlayer polarization enhancement technique for spin-polarized electron microscopy," Journal of Applied Physics, vol. 69 no. 3, pp. 1564-1568, Feb. 1, 1991.

Vardaman, E. Jan, "Tin Whiskers: An Old Problem Reappears," Circuits Assembly, vol. 15 no. 9, pp. 22-23, Sept. 2004.

Varga, Peter, and Rusinko, Andrew, "Modeling the effects of imposed current on the creep of SAC305 solder material," 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Toulouse, France, Apr. 15-18, 2018, pp. xx-xx.

Vargas C, Ramiro S., and Gonda, Viktor, "Comparison of the thermal-mechanical behavior of a soldered stack influenced by the choice of the solder," 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Hanover, Germany, March 24-27, 2019, pp. xx-xx.

Vargas, Lidia, Terrazas, Juan, Cabrera, Eduardo, Valdez, Benjamin, and Nedev, Nicola, "Failure analysis method to study solder wicking phenomena in modern microelectronic devices," Journal of Materials Science: Materials in Electronics, vol. 25 no. 2, pp. 609-617, Feb. 2014.

Vargas, O. L., Valdez, S. B., Veleva, M. L., Zlatev, K. R., Schorr, W. M., and Terrazas, G. J., "The corrosion of silver in indoor conditions of an assembly process in the microelectronics industry," Anti-Corrosion Methods and Materials, vol. 56 no. 4, pp. 218-225, 2009.

Varghese, J., and Dasgupta, A., "Test methodology for durability estimation of surface mount interconnects under drop testing conditions," Microelectronics Reliability, vol. 47 no. 1, pp. 93-103, Jan. 2007.

Varkey, Bijumon, Christian, Bev, Liu, Julie, Romanov, Alexandre, and Moorhead, Philip, "Not Whiskers or Hillocks, But Tin Bumps on RF Shielding Cans," IEEE Transactions on Device and Materials Reliability, vol. 10 no. 3, pp. 353-359, Sept. 2010.

Varleva, Sv., Nanev, Kr., and Nanev, Chr., "The Growth of Silver Whiskers by Reduction of Silver Halogenides," Crystal Research and Technology, vol. 28 no. 4, pp. 441-448, 1993.

Varnell, Bill, Chouta, Prachant, and Enzien, Helen, "Effect of Lead Free Assembly Reflow Cycles on Base Material Substrate Properties," IPC Printed Circuits Expo, APEX and the Designer Summit , Anaheim, CA, Feb. 8-10, 2006, pp. S07-01-1-S07-01-5.

Varnell, William, and Hornsby, Ron, "Evaluation of Thermally Reliable PWB Substrates," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 392-394.

Varshava, S. S., and Ostrovskii, I. P., "Miniature transducers based on Si whisker joints," Sensors and Actuators A: Physical, vol. 99 no. 1-2, pp. 134-136, Apr. 30, 2002. https://doi.org/10.1016/S0924-4247(01)00913-X

Vasantha, V. S., Pushpavanam, M., and Muralidharan, V. S., "Hydrogen in Electrodeposited Tin-Zinc Alloy," Plating & Surface Finishing, vol. 82 no. 6, pp. 81-83, June 1995.

Vasantha, V. S., Pushpavanam, Malathy, Kamaraj, P., and Muralidharan, V. S., "Role of Peptone in the Electrodeposition of Tin and Tin-Zinc Alloys from Neutral Gluconate Bath," Transactions of the Institute of Metal Finishing, vol. 74 no. 1, pp. 28-32, Jan. 1996.

Vasile, C., Brebu, M. A., Totolin, M., Yanik, J., Karayildirim, T., and Darie, H., "Feedstock Recycling from the Printed Circuit Boards of Used Computers," Energy & Fuels, vol. 22 no. 3, pp. 1658-1665, 2008.

Vasko, A. C., Warrell, G. R., Parsai, E. I., Karpov, V. G., and Shvydka, Diana, "Electron beam induced growth of tin whiskers," Journal of Applied Physics, vol. 118 no. 12, pp. 125301-1-125301-5, Sept. 28, 2015.

Vasko, A., and Karpov, V., "Rapid Growth of Whiskers in Evaporated Tin Films Under Influence of Electric Field," Tin Whisker Group teleconference, October 15, 2014.

Vasko, Anthony C., Grice, Corey R., Kostic, Andrew D., and Karpov, Victor G., "Evidence of electric-field-accelerated growth of tin whiskers," MRS Communications, vol. 5 no. 4, pp. 619-622, Dec. 2015.

Vasko, Cyril, Novotny, Marek, and Szendiuch, Ivan, "Impact of solder pad shape on lead-free solder joint reliability," 31st International Spring Seminar on Electronics Technology, Budapest, Hungary, May 7-11, 2008, pp. 433-445.

Vasko, Cyril, Ohera, Jiri, and Szendiuch, Ivan, "Investigation of solder joints strength," 29th International Spring Seminar on Electronics Technology, St. Marienthal, Germany, May 10-14, 2006, pp. 233-236.

Vassilev, G. P., Lilova, K. I., and Gachon, J. C., "Calorimetric and phase diagram studies of the Co-Sn system," Intermetallics, vol. 15 no. 9, pp. 1156-1162, Sept. 2007.

Vassilev, G. P., Lilova, K. I., and Gachon, J.-C., "Phase diagram investigations of the Ni-Sn-Bi system," Journal of Alloys and Compounds, vol. 469 no. 1-2, pp. 264-269, Feb. 5, 2009.

Vassilev, G., Gandova, V., Milcheva, N., and Wnuk, G., "Thermodynamic description of the system Ag-Sn-Zn," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 43, pp. 133-138, Dec. 2013.

Vassilev, Gueorgui P., Evtimova, Svetla K., Tedenac, Jean-Claude, and Dobrev, Evgueni S., "Experimental study of the ternary Ag-Sn-Zn system through diffusion couples," Journal of Alloys and Compounds, vol. 334 no. 1-2, pp. 182-186, Feb. 28, 2002.

Vassilev, Gueorgui P., Dobrev, Evgeni S., and Tedenac, Jean-Claude, "Phase diagram of the Sn-Zn-Ti system," Journal of Alloys and Compounds , vol. 407 no. 1-2, pp. 170-175, Jan. 5, 2006.

Vassiliev, V. P., Lysenko, V. A., and Bros, J. P., "Thermodynamic study of the Ag-In-Sn system by the EMF method," Journal of Alloys and Compounds, vol. 790, pp. 370-376, June 25, 2019.

Vasudevan, Vasu, and Fan, Xuejun, "An Acceleration Model for Lead-Free (SAC) Solder Joint Reliability under Thermal Cycling," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 139-145.

Vasudevan, Vasu, Fan, Xuejun, Liu, Tao, and Young, Dave, "Slow Cycle Fatigue Creep Performance of Pb-Free (LF) Solders," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 116-123.

Vasudevan, Vasu, Schulz, Tanner, Pei, Min, Toth, F., Lucero, A. E., Zhou, Bite, and Mukherjee, Sibasish, "The State of Pb-free Solder - A Joint Reliability Overview," 2016 IEEE International Reliability Physics Symposium, Pasadena, CA, Apr. 17-21, 2016, pp. 6B-6-1-6B-6-6.

Vasudevan, Vasu, Coyle, Richard, Aspandiar, Raiyo, Tisdale, Steve, Kinyanjui, Robert, and Long, Gary, "Thermal Cycling Reliability, Microstructural Characterization, and Assembly Challenges with Backward Compatible Soldering of a Large, High Density Ball Grid Array," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 954-964.

Vaynman, S., Mavoori, H., and Fine, M. E., "Comparison of Isothermal Fatigue of Lead-free Solders with Lead-Tin Solders," Advances in Electronic Packaging 1995, Volume 2, Lahaina, Maui, Hawaii, Mar. 26-30, 1995, pp. 657-662.

Vaynman, S., Ghosh, G., and Fine, M. E., "Some Fundamental Issues in the Use of Zn-Containing Lead-Free Solders for Electronic Packaging," Materials Transactions, vol. 45 no. 3, pp. 630-636, Mar. 2004.

Vaynman, Semyon, and Fine, Morris E., "Fluxes for Lead-Free Solders Containing Zinc," 2000 SMTA International Conference Proceedings, Chicago, IL, Sept. 24-28, 2000, pp. xx-xx.

Vayrette, Renaud, Rivero, Christian, Blayac, Sylvain, and Inal, Karim, "Thickness effect on microstructure and residual stress of annealed copper thin films," Materials Science Forum, vol. 681, pp. 139-144, Mar. 2011.

Vazquez, M., Hernando, A., Madurga, V., and Barandiaran, J. M., "The influence of the torsional strain and the azimuthal field on the inverse Wiedemann effect for iron whiskers," Journal of Physics D: Applied Physics, vol. 13 no. 9, pp. 1713-1718, Sept. 14, 1980.

Veale, Robert, and Trainor, James, "Comparison of Several PCB Final Finishes in a Mixed Flowing Gas Test Environment," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 981-986.

Veale, Robert, and Trainor, James, "Comparison of Several PCB Final Finishes in a Mixed Flowing Gas Test Environment," SMTA Journal, vol. 24 no. 4, pp. 13-18, 2011.

Veale, Robert, "Reliability of PCB Alternate Surface Finishes in a Harsh Industrial Environment," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 494-499.

Veerakamolmal, Pitipong, Lee, Yung-Joon, Fasano, J. P., Hale, Rhea, and Jacques, Mary, "A Cost-Benefit Study of Consumer Product Take Back Programs Using IBM's WIT Reverse Logistics Optimization Tool," Environmentally Conscious Manufacturing II (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4569), Newton, USA, Oct. 28-29, 2001, pp. 13-22.

Veeraraghavan, Basker, Kumaraguru, Swaminatha P., Haran, Bala, and Popov, Branko, "Deposition of Non-anomalous Ni-Zn-P Alloys for Replacement of Cadmium Coatings," Proceedings 2003 AESF/EPA Conference for Environmental & Process Excellence, Daytona, FL, Feb. 3-7, 2003, pp. 304-312.

Veeraraghavan, Basker, Kumaraguru, Swaminatha Prabu, Haran, Bala, and Popov, Branko, "Development of Nanostructured Ni-Zn-P Alloys by Electroless Deposition for Replacement of Cadmium Coatings," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 561-573.

Veit, Raphael, "How do WEEE get it right?," emsnow, Nov. 1, 2005.

Veleva, Vesela, Greiner, Tim, and Harriman, Elizabeth, "Emerging Environmental, Health and Safety Issues and Requirements Related to the Coated Wire and Cable Industry," 2002 IEEE International Symposium on Electronics & the Environment, San Francisco, CA, May 6-9, 2002, pp. 93-95.

Vemal, R., and Hamdi, M., "An Investigation Concerning the Diffusion Of Elements in Sn-Ag3.8-Cu0.7 and Sn-Pb36-Ag2 on Electrolytic Ni-Au Pads during Pre-Pack Thermal Aging," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 565-570.

Venables, Mark, "Burden, or opportunity to blossom?," Works Management, vol. 58 no. 5, pp. 24-26, May 2005.

Venditti, D., Durecu, S., and Berthelin, J., "A Multidisciplinary Approach to Assess History, Environmental Risks, and Remediation Feasability of Soils Contaminated by Metallurgical Activities. Part A: Chemical and Physical Properties of Metals and Leaching Ability," Archives of Environmental Contamination and Toxicology, vol. 38 no. 4, pp. 411-420, 2000.

Venkatadri, Vikram, Yin, Liang, Xing, Yan, Cotts, Eric, Srihari, K., and Borgesen, Peter, "Accelerating the Effects of Aging on the Reliability of Lead Free Solder Joints in a Quantitative Fashion," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 398-405.

Venkatadri, Vikram, Tumne, Pushkraj, Srihari, Krishnaswami, and Santos, Daryl L., "An Evaluation of the Neville Distribution for Studying the Brittle Failure Mode in Microelectronics Drop Testing Studies," 2012 Pan Pacific Microelectronics Symposium, Kauai, HI, Feb. 14-16, 2012, pp. xx-xx.

Venkatasamy, V., Riemer, S., and Tabakovic, I., "Electrodeposition of eutectic Sn96.5Ag3.5 films from iodide-pyrophosphate solution," Electrochimica Acta, vol. 56 no. 13, pp. 4834-4840, May 1, 2011. https://doi.org/10.1016/j.electacta.2011.03.050

Venkatraman, Mahadevan, Schlieper, Andreas, Blachnik, Roger, and Gather, Bernd, "The Excess Enthalpies of Liquid Cu-Sn-Te Alloys," Zeitschrift fur Metallkunde, vol. 85 no. 5, pp. 354-358, May 1994.

Venkatraman, R., Chen, S., and Bravman, J. C., "The effect of laser reflow on the variation of stress with thermal cycling in aluminum thin films," Journal of Vacuum Science & Technology A: Vacuum Surfaces, and Films, vol. 9 no. 4, pp. 2536-2542, July/Aug. 1991.

Ventsias, Tom, "CALCE Seeks Answer on the Use of Lead-Free Alternatives," Maryland Research, vol. 3 no. 2, pp. xx-xx, Spring 2003.

Ventura, Tina, Cho, Young-Hee, Kong, Chun, and Dahle, Arne K., "Formation of Intermetallics in Sn-0.9Cu and Sn-0.7Cu-0.08Ni Solders," Journal of Electronic Materials, vol. 40 no. 6, pp. 1403-1408, June 2011.

Ventura, Tina, Cho, Younghee, and Dahle, Arne K., "Solidification Mechanisms in the Sn-Cu-Ni Lead-Free Solder System," Materials Science Forum, vol. 654-656, 1381-1384, 2010.

Ventura, Tina, Gourlay, Christopher M., Nogita, Kazuhiro, Nishimura, Tetsuro, Rappaz, Michel, and Dahle, Arne K., "The Influence of 0-0.1 wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi," Journal of Electronic Materials, vol. 37 no. 1, pp. 32-39, Jan. 2008.

Venugopal, ?., Vijayalakshmi, R. P., Murali, G., Reddy, D. Amaranatha, and Chen, Yit-Tsong, "Structural, optical and luminescence studies of ZnSe nanowires," International Journal of Materials Research, vol. 102 no. 12, pp. 1503-1506, Dec. 2011.

Vera, D. A., Monfared, R. P., West, A. A., and Conway, P. P., "Novel Approach to Reflow Oven Design to Control and Optimise Lead Free Soldering Process," 8th Electronics Packaging Technology Conference , Singapore, Dec. 6-8, 2006, pp. 512-517.

Verbiest, Peter, "An Investigation into Lead-Free BGA Rework with Consideration to Profile Requirements of IPC/JEDEC J-STD-020B," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 172-177.

Verbruggen, A. H., van den Homberg, M. J. C., Jacobs, L. C., Kalkman, A. J., Kraayeveld, J. R., and Radelaar, S., "Resistance Changes Induced by the Formation of a Single Void/Hillock During Electromigration," AIP Conference Proceedings, vol. 418, pp. 135-146, 1998.

Verdi, Fred, "Ask the EMPF Helpline!," empfasis, pp. xx-xx, Feb. 2004.

Verdi, Fred, "Ask the EMPF Helpline!," empfasis, pp. xx-xx, Feb. 2008.

Verdi, Fred, "Ask the EMPF Helpline! Identification of Solder Joint Failures," empfasis, pp. 2, Apr. 2009.

Verdi, Fred, "Effects of Plating on Reliability of Lead Free Assembly," empfasis , pp. 1,7, May 2010.

Verdi, Fred W., "Electroplated Tin and Tin Whiskers in Lead Free Electronics," Nov. 5, 2004.

Verdi, Fred, "GEAI Tin Whisker Industry Standard," empfasis, pp. xx-xx, Mar. 2006.

Verdi, Fred W., "Lead Free Electronics, Tin Whisker Risks, and Mitigation Techniques," Mar. 11, 2009.

Verdi, Fred, and Meola, Carmine, "Lead (Pb)-Free Electronics Training," empfasis, pp. 6,13, Apr. 2010.

Verdi, Fred, "Lead Free Manufacturability," empfasis, pp. xx-xx, Sept. 2003.

Verdi, Fred, "Substrate Finishes," empfasis, pp. 1,7, June 2009.

Verdi, Fred, Yu, Phillip, Sneh, Ofer, Toscano, Lenora, and Gallager, George, "Susceptibility Testing for Tin Whiskers," IPC Tin Whiskers Conference , Chicago, IL, Dec. 6-7, 2010, pp. xx-xx.

Verdi, Fred, "Susceptibility Testing for Tin Whiskers," Tin Whisker Group teleconference, Feb. 23, 2011.

Verdi, Fred, "Tin Whiskers: Mitigation With Conformal Coatings Part II," empfasis , pp. 1,7, May 2009.

Verdi, Fred, "Tin Whiskers: Risks with Lead Free Part I," empfasis, pp. 1,7, Apr. 2009.

Verdingovas, Vadimas, Jellesen, Morten Stendahl, and Ambat, Rajan, "Effect of pulsed voltage on electrochemical migration of tin in electronics," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Verebelyi, D. T., "Thermal conductivity measurement of microgram whiskers," Review of Scientific Instruments, vol. 68 no. 6, pp. 2494-2498, June 1997.

Vergnat, M., Marchal, G., and Mangin, Ph., "Preparation and structure of amorphous semiconductor hydrogenated tin," Applied Physics Letters, vol. 57 no. 22, pp. 2300-2301, Nov. 26, 1990.

Verhelst, Eric, and Ocket, Tom, "Lead-free manufacturing Effects on press-fit connections," Tyco Electronics Report, July 2002.

Vergnat, M., Marchal, G., and Mangin, Ph., "Preparation and structure of amorphous semiconductor hydrogenated tin," Applied Physics Letters, vol. 57 no. 22, pp. 2300-2301, Nov. 26, 1990.

Verhelst, Eric, "Lead-free manufacturing: Effects on press-fit connections," 21st ICEC, Zurich, Switzerland, Sept. 2002, pp. xx-xx.

Verhelst, Eric, "Lead-free: Solderballs and BGA," Tyco Electronics, Oct. 2002.

Verheyden, S., Da Veiga, L. Pires, Deillon, L., and Mortensen, A., "The effect of size on the plastic deformation of annealed cast aluminium microwires," Scripta Materialia, vol. 161, pp. 58-61, Mar. 1, 2019.

Verhoef, E. V., Reuter, M. A., and Scholte, A., "A Dynamix LCA Model for Assessing the Impact of Lead Free Solder," Yazawa International Symposium: Metallurgical and Materials Processing: Principles and Techologies: Volume 2: High Temperature Metal Production , San Diego, CA, Mar. 2-6, 2003, pp. 605-621.

Verkerk, M. J., and van der Kolk, G. J., "Effects of oxygen on the growth of vapor-deposited aluminium films," Journal of Vacuum Science & Technology A: Vacuum Surfaces, and Films , vol. 4 no. 6, pp. 3101-3105, Nov./Dec. 1986.

Verma, Ajit Ram, Lal, Krishan, Pahwa, D. R., Kumar, Vijay, and Aggarwal, Keshav, "A Lang X-Ray Topography Camera & Some X-Ray Topographic Investigations of Whisker Crystals," Indian Journal of Pure & Applied Physics, vol. 12 no. 5, pp. 350-357, May 1974.

Verma, Ajit Ram, and Peneva, S. K., "X-Ray Investigations on the Growth of Cadmium Whiskers," Journal of Crystal Growth, vol. 3-4, no. xx, pp. 700-704, 1968.

Verma, Suresh Chand, Guan, Wanbing, Andersson, Cristina, Gao, Yulai, Zhai, Qijie, and Liu, Johan, "Flip-Chip Interconnection Using Anisotropic Conductive Adhesive with Lead Free Nano-Solder Particles," 1st Electronics Systemintegration Technology Conference, Volume 1, Dresden, Germany, Sept. 5-7, 2006, pp. 282-286.

Vermeij, Richard, "7 Tips For RoHS Compliance," Manufacturing.net, June 28, 2006.

Vermeij, Richard, "Seven tips for documenting RoHS compliance," Green SupplyLine , June 27, 2006.

Vermillion, Len, "Q&A: Finishing Off the RoHS Transition," Product Design & Development, pp. 24, Apr. 2006.

Vermilyea, D. A., "Electrodeposition onto Metal Whiskers," Journal of Chemical Physics , vol. 27 no. x, pp. 814-815, 1957.

Verton, Dan, "Think Tank Calls for Better Protection of GPS Systems," Computerworld , vol. 36 no. 5, pp. 7, Jan. 28, 2002.

Verton, Dan, "U.S. urged to add more protection to GPS systems," Computerworld , vol. xx no. xx, pp. xx-xx, Jan. 24, 2003.

Vesely, Petr, and Kozak, Martin, "Accelerated Aging of Bismuth-Tin Solder Joints on Various Substrates," 2020 43rd International Spring Seminar on Electronics Technology, Liptovsky Mikulas, Slovakia, May 14-15, 2020, pp. xx-xx.

Vesely, Petr, Dusek, Karel, and Stankova, Angelika, "Evaluation of Bismuth/Tin Solder Intermetallic Layers Based on Heating Factor," 2019 42nd International Spring Seminar on Electronics Technology, Wroclaw, Poland, May 15-19, 2019, pp. xx-xx.

Vesely, Petr, Horynova, Eva, Stary, Jiri, Busek, David, Dusek, Karel, Zahradnik, Vit, Placek, Martin, Mach, Pavel, Kucirek, Martin, Jezek, Vladimir, and Dosedla, Milan, "Solder joint quality evaluation based on heating factor," Circuit World , vol. 44 no. 1, pp. 37-44, 2018.

Vezzoli, G. C., and Otooni, M., "b->a Transformation in Tin as Studied by Electrical Resistance and Optical Reflectance under Vacuum and at High Pressure," Journal of Crystal Growth, vol. 68 no. 3, pp. 705-720, Oct. 1984.

Vianco, P. T., Kilgo, A. C., Wroblewski, B., Zender, G., and Guerrero, E., "Accelerated Aging of Sn-Pb and Pb-Free Solder Joints on Hybrid Microcircuit Assemblies," Sandia Report SAND2011-9223C, 2011.

Vianco, P. T., Kilgo, A. C., Wroblewski, B., Zender, G. L., and Guerrero, E., "Accelerated Aging of Sn-Pb and Pb-free Solder Joints on Hybrid Microcircuit Assemblies," Sandia Report SAND2012-3230C, Apr. 23, 2012.

Vianco, P. T., Grant, R., Rejent, J. A., Crenshaw, T. B., and Kilgo, A. C., "Ag-Au-Ge Alloys for High Temperature Geothermal and Oil Well Electronics Applications," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 613-624.

Vianco, P. T., Grant, R., Rejent, J. A., Crenshaw, T. B., and Kilgo, A. C., "Ag-Au-Ge Alloys for High Temperature Geothermal and Oil Well Electronics Applications," SMTA Journal, vol. 26 no. 1, pp. 20-30, 2013.

Vianco, P. T., and Rejent, J. A., "Capillary Flow Solder Wettability Test," Soldering & Surface Mount Technology, vol. 9 no. 1, pp. 4-7, 1997.

Vianco, P., and Rejent, J., "Compression Deformation Response of 95.5Sn-3.9Ag-0.6Cu Solder," UCLA Pb-Free Workshop, Sept. 5, 2002.

Vianco, P., Fossum, A., Neilsen, M., and Burchett, S., "Constitutive Model Development for Predicting Thermal Mechanical Fatigue Deformation in Solder Interconnects," Sandia Report SAND2000-2290C.

Vianco, P. T., Frear, D. R., Yost, F. G., and Roberts, J. L., "Development of Alternatives to Pb-Based Solders," Sandia Report SAND97-0315, Feb. 1997.

Vianco, P. T., and Rejent, J. A., "Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part I: A Model," Journal of Electronic Materials, vol. 38 no. 9, pp. 1815-1825, Sept. 2009.

Vianco, P. T., and Rejent, J. A., "Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part II: Experimental Study," Journal of Electronic Materials, vol. 38 no. 9, pp. 1826-1837, Sept. 2009.

Vianco, P. T., and Neilsen, M. K., "Dynamic Recrystallization Model for Whisker and Hillock Growth," Sandia Report SAND2015-6236J, 2015.

Vianco, P. T., and Neilsen, M. K., "Dynamic Recrystallization Model for Whisker and Hillock Growth," Sandia Report SAND2015-9335J, 2015.

Vianco, P. T., and Claghorn, A. C., "Effect of Substrate Preheating on Solderability Performance as a Guideline for Assembly Process Development Part 1: Baseline Analysis," Soldering & Surface Mount Technology, vol. 8 no. 3, pp. xx, 1996.

Vianco, P. T., Kilgo, A. C., and Grant, R., "Intermetallic Compound Layer Growth By Solid State Reactions Between 58Bi-42Sn Solder and Copper," Journal of Electronic Materials, vol. 24 no. 10, pp. 1493-1505, Oct. 1995.

Vianco, P. T., Kilgo, A. C., and Grant, R., "Intermetallic Compound Layer Growth Kinetics in Non-Lead Bearing Solders," Sandia Report SAND-95-0573C, Apr. 1, 1995.

Vianco, P. T., Cummings, D. P., Kotula, P. G., Mckenzie, B. M., Lowery, L. M., Williams, S., and Banga, D., "Mitigation of Long Whisker Growth Based upon the Dynamic Recrystallization Mechanism," Journal of Electronic Materials, vol. 49 no. 1, pp. 888-904, Jan. 2020.

Vianco, P. T., Rejent, J. A., Grazier, J. M., Kilgo, A. C., McKenzie, B. M., and Neilsen, M. K., "Predicting the Reliability of Package-On-Package-On-Package (POPOP) Interconnections Based on Accelerated Aging Experiments and Computational Modeling," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 24-45.

Vianco, P. T., and Rejent, J. A., "Properties of Ternary Sn-Ag-Bi Solder Alloys: Part I-Thermal Properties and Microstructural Analysis," Journal of Electronic Materials, vol. 28 no. 10, pp. 1127-1137, Oct. 1999.

Vianco, P. T., and Rejent, J. A., "Properties of Ternary Sn-Ag-Bi Solder Alloys: Part II-Wettability and Mechanical Properties Analyses," Journal of Electronic Materials, vol. 28 no. 10, pp. 1138-1143, Oct. 1999.

Vianco, P. T., and Rejent, J. A., "Prototype Circuit Boards Assembled with Non-Lead Bearing Solders," Sandia Report SAND-98-0827C, Apr. 1998.

Vianco, P. T., Erickson, K. L., and Hopkins, P. L., "Solid State Intermetallic Compound Growth Between Copper and High Temperature, Tin-Rich Solders- Part I: Experimental Analysis," Journal of Electronic Materials, vol. 23 no. 8, pp. 721-727, Aug. 1994.

Vianco, P. T., Grazier, J. M., Rejent, J. A., Kilgo, A. C., Verdi, F., and Meola, C., "Temperature Cycling of Pb-free and Mixed Solder Interconnections Used on a Package-on-Package Test Vehicle," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 22-34.

Vianco, P. T., Neilsen, M. K., Rejent, J. A., and Grant, R. P., "Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth on Sn Thin Films," Journal of Electronic Materials , vol. 44 no. 10, pp. 4012-4034, Oct. 2015.

Vianco, P. T., Neilsen, M. K., Rejent, J. A., and Grant, R. P., "Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth on Thin Films," Sandia Report SAND2014-15673J, 2014.

Vianco, P. T., Hosking, F. M., and Rejent, J. A., "Wettability Analysis of Tin-Based, Lead Free Solders," Proceedings of the Technical Program NEPCON West '92, Volume 3, Anaheim, CA, Feb. 23-27, 1992. pp. 1730-1738.

Vianco, Paul t., and Yost, Frederick G., "A Ban on Use of Lead-Bearing Solders: Implications for the Electronics Industry," Sandia Report SAND92-0211, Apr. 1992.

Vianco, Paul T., "A Review of Interface Microstructures in Electronic Packaging Applications: Soldering Technology," JOM, vol. 71 no. 1, pp. 158-177, Jan. 2019. (Sandia Report SAND2018-6973J)

Vianco, Paul T., and May, Chris, "An Evaluation of Prototype Surface Mount Circuit Boards Assembled with Three Non-Lead Bearing Solders," Sandia Report SAND-95-1367C, July 2001.

Vianco, Paul T., "An overview of surface finishes and their role on printed circuit board solderability and solder joint performance," Circuit World, vol. 25 no. 1, pp. 6-24, 1998.

Vianco, Paul T., and Rejent, Jerome A., "Capillary Flow Solder Wettability Test," Proceedings of the Technical Program NEPCON West '96, Volume 1, Anaheim, CA, Feb. 25-29, 1996, pp. 174-182.

Vianco, Paul T., Hernandez, Cynthia L., and Rejent, Jerome A., "Circuit Board Assembly with Lead-Free Solders," APEX 2000, Long Beach, CA, Mar. 14-16, 2000, pp. P-MT3/3-1-P-MT3/3-8.

Vianco, Paul, Rejent, Jerry, Artaki, Iris, Ray, Urmi, Finley, Donald, and Jackson, Anna, "Compatibility of Lead-Free Solders with Lead Containing Surface Finishes as a Reliability Issue in Electronic Assemblies," 1996 Proceedings 46th Electronic Components & Technology Conference, Orlando, FL, May 28-31, 1996, pp. 1172-1183 (Sandia Report SAND-96-0455C).

Vianco, Paul, Rejent, Jerome, Kilgo, Alice, and Martin, Joseph, "Compression Creep Behavior of the 95.5Sn-(4.3, 3.9, 3.8)Ag-(0.2, 0.6, 0.7)Cu Solders," Advanced Electronic Packaging (Materials Research Society Symposium Proceedings Volume 968), Boston, MA, Nov. 27-30, 2006, pp. 103-116. (Sandia Report SAND2006-7358C)

Vianco, Paul T., Rejent, Jerome A., Fossum, Arlo F., and Neilsen, Michael K., "Compression stress-strain and creep properties of the 52In-48Sn and 97In-3Ag low-temperature Pb-free solders," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 93-119, Mar. 2007.

Vianco, Paul T., Rejent, Jerome A., and Kilgo, Alice C., "Creep Behavior of the Ternary 95.5Sn-3.9Ag-0.6Cu Solder_Part I: As-Cast Condition," Journal of Electronic Materials, vol. 33 no. 11, pp. 1389-1400, Nov. 2004.

Vianco, Paul T., Rejent, Jerome A., and Kilgo, Alice C., "Creep Behavior of the Ternary 95.5Sn3.9Ag-0.6Cu Solder: Part II - Aged Condition," Journal of Electronic Materials, vol. 33 no. 12, pp. 1473-1484, Dec. 2004.

Vianco, Paul T., "Development of Alternatives to Lead-Bearing Solders," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume II, San Jose, CA, Aug. 31-Sept. 2, 1993, pp. 725-731.

Vianco, Paul, Rejent, Jerome, and Grant, Richard, "Development of Sn-Based, Low Melting Temperature Pb-Free Solder Alloys," Materials Transactions, vol. 45 no. 3, pp. 765-775, Mar. 2004.

Vianco, Paul T., Rejent, Jerome A., Zender, Gary L., and Hlava, Paul F., "Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part I. 95.5Sn-3.9Ag-0.6Cu Alloy," ," Metallurgical and Materials Transactions A, vol. 41 no. 12, pp. 3042-3052, Dec. 2010.

Vianco, Paul T., Martin, Joseph J., Wright, Robert D., and Hlava, Paul F., "Dissolution and Interface Reactions between the 95.5Sn-3.9Ag-0.6Cu, 99.3Sn-0.7Cu, and 63Sn-37Pb Solders on Silver Base Metal," Metallurgical and Materials Transactions A, vol. 37A no. 5, pp. 1551-1561, May 2006.

Vianco, Paul, Lopez, Edwin, Buttry, R. Wayne, Kilgo, Alice, and Lucero, Samuel, "Effects of Accelerated Storage Environments on the Solderability of Immersion Silver-Coated Printed Circuit Boards," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx. (Sandia Report SAND2005-7508C)

Vianco, Paul, Lopez, Edwin, Buttry, R. Wayne, Kilgo, Alice, and Lucero, Samuel, "Effects of Accelerated Storage Environments on the Solderability of Immersion Silver-Coated Printed Circuit Boards," SMTANews & Journal of Surface Mount Technology, vol. 19 no. 3, pp. 29-42, July-Sept. 2006.

Vianco, Paul, Lopez, Edwin, Buttry, R. Wayne, Kilgo, Alice, and Lucero, Samuel, "Effects of Accelerated Storage Environments on the Solderability of Immersion Silver-Coated Printed Circuit Boards," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 917-930.

Vianco, Paul, Lopez, Edwin, Wallace, William, Kilgo, Alice, and Lucero, Samuel, "Effects of Storage Procedures and Bake Out on the Solderability of Immersion Silver-Coated Printed Circuit Boards," Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb. 10-12, 2009, pp. 40-54.

Vianco, Paul, Lopez, Edwin, Wallace, William, Kilgo, Alice, and Lucero, Samuel, "Effects of Storage Procedures and Bake Out on the Solderability of Immersion Silver-Coated Printed Circuit Boards," SMTAnews & Journal of Surface Mount Technology, vol. 22 no. 2, pp. 30-43, Apr.-June 2009.

Vianco, Paul T., "Environmental Mandates and Soldering Technology: The Path Forward," Welding Journal, vol. 86 no. 9, pp. 27-30, Sept. 2007.

Vianco, Paul T., and May, Chris, "Evaluation of Prototype Surface Mount Circuit Boards Assembled with Three Non-Lead Bearing Solders," Surface Mount International Proceedings of the Technical Program, San Jose, CA, Aug. 29-31, 1995, pp. 481-494.

Vianco, Paul T., Kilgo, Alice C., and McKenzie, Bonnie M., "Gold-Tin Solder Wetting Behavior for Package Lid Seals," Journal of Electronic Packaging, vol. 140 no. 2, pp. 021003-1-021003-18, June 2018.

Vianco, Paul T., Hernandez, Cynthia L., Rejent, and Jerome A., "Hybrid Microcircuit Board Assembly with Lead-Free Solders," Sandia Report SAND2000-0124C, 1999.

Vianco, Paul T., Hlava, Paul F., and Kilgo, Alice C., "Intermetallic Compound Layer Formation Between Copper and Hot-Dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb Coatings," Journal of Electronic Materials, vol. 23 no. 7, pp. 583-594, July 1994.

Vianco, Paul T., "Issues in the Replacement of Lead-Bearing Solders," JOM, vol. 45 no. 7, pp. 14-19, July 1993.

Vianco, Paul T., "Lead (Pb)-Free Solder Applications," Sandia Report SAND2000-2066C, 2000.

Vianco, Paul T., and Artaki, Iris, "Logistics for the Implementation of Lead-Free Solders on Electronic Assemblies," Sandia Report SAND-93-0226C, 1993.

Vianco, Paul T., "Low Temperature Solders - Deja vu," Sandia Report SAND2017-2978C, Mar. 28, 2017.

Vianco, Paul T., "Low Temperature Solders - Deja vu," Sandia Report SAND2018-3975C, Apr. 23, 2018.

Vianco, Paul T., "Pb-Free Solder Alloy Development and Intermetallic Compound Layer Growth in High-Reliability Hybrid Microcircuits," The International Journal of Microcircuits and Electronic Packaging, vol. 24 no. 4, pp. 328-345, 4th Quarter 2001.

Vianco, Paul T., "Pb-Free Soldering and Surface Mount: Parallels in Technology Implementation," Lead-Free Magazine, vol. 3, Feb. 2005.

Vianco, Paul T., Neilsen, Michael K., Rejent, Jerome A., Grazier, J. Mark, and Kilgo, Alice C., "Predicting the Reliability of Package-on-Package Interconnections Using Computational Modeling Software," SMTAnews & Journal of Surface Mount Technology, vol. 27 no. 1, pp. 37-47, Mar. 2014.

Vianco, Paul T., "Programmatic Challenges of Pb-Free Technology for the High-Reliability Electronics Industry," SMTA International 2011 Conference, Fort Worth, TX, Oct. 16-20, 2011.

Vianco, Paul T., and Mizik, Patrick M., "Prototyping Lead-free Solders on Hand-soldered, Through-hole Circuit Boards," Sandia Report SAND-93-2586C, 1994.

Vianco, Paul T., Artaki, Iris, and Jones, Anna M., "Reliability Studies of Surface Mount Boards Manufactured with Lead-Free Solders," Surface Mount International Conference & Exposition Proceedings of the Technical Program, San Jose, CA, Aug. 28-Sept. 1, 1994, pp. 437-448.

Vianco, Paul T., "Solder Technology in the Manufacturing of Electronic Products," Manufacturing Aspects in Electronic Packaging 1993, PED-Vol. 65, EEP-Vol. 5, New Orleans, LA, Nov. 28-Dec. 3, 1993, pp. 57-69.

Vianco, Paul, "Solder Trends and Pb-Free Soldering Issues," SMTA International , 2004.

Vianco, Paul T., Martin, Joseph J., Wright, Robert D., and Hlava, Paul F., "Solid-State Interface Reactions between Silver and 95.5Sn-3.9Ag-0.6Cu and 63Sn-37Pb Solders," Metallurgical and Materials Transactions A, vol. 38 no. 10, pp. 2488-2502, Oct. 2007.

Vianco, Paul T., Rejent, Jerome A., and Paul F. Hlava, "Solid-State Intermetallic Compound Layer Growth Between Copper and 95.5Sn-3.9Ag-0.6Cu Solder," Journal of Electronic Materials, vol. 33 no. 9, pp. 991-1004, Sept. 2004.

Vianco, Paul T., Rejent, Jerome A., and Martin, Joseph J., "The Compression Stress-Strain Behavior of Sn-Ag-Cu Solder," JOM, vol. 55 no. 6, pp. 50-55, June 2003.

Vianco, Paul, and Neilsen, Michael K., "Thermal Mechanical Fatigue of a 56 I/O Plastic Quad-Flat Nolead (PQFN) Package," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 85-94.

Vianco, Paul T., McKenzie, Bonnie B., Rejent, Jerome A., Grazier, J. Mark, Jaramillo, Celedonio E., and Kilgo, Alice C., "Time Independent Deformation of a Sn-Ag-Bi Pb-Free Solder: Stress-Strain Deformation and Yield Stress Properties," Journal of Electronic Materials, vol. 49 no. 1, pp. 152-172, Jan. 2020.

Vianco, Paul T., Rejent, Jerome A., and Kilgo, Alice C., "Time-Independent Mechanical and Physical Properties of the Ternary 95.5Sn-3.9Ag-0.6Cu Solder," Journal of Electronic Materials, vol. 32 no. 3, pp. 142-151, Mar. 2003.

Vianco, Paul T., "Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications: Part 1 - Filler Metal Properties and the Soldering Process," Sandia Report SAND2017-1069J, 2017.

Vianco, Paul T., "Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications: Part 2 - Reliability Performance," Sandia Report SAND2017-1070J, 2017.

Vicenzo, A., Cavallotti, P. L., and Crema, P., "Electrochemical Control of Whisker Growth on Electrodeposited Tin Coatings," Transactions of the Institute of Metal Finishing, vol. 80 no. 3, pp. 79-84, May 2002. https://doi.org/10.1080/00202967.2002.11871438

Vicenzo, A., Bonelli, S., and Cavallotti, P. L., "Pulse plating of matt tin: effect on properties," Transactions of the Institute of Metal Finishing, vol. 88 no. 5, pp. 248-255, Sept. 2010. https://doi.org/10.1179/002029610X12791981507802

Vicenzo, Antonello, Rea, Michela, Vonella, Luca, Bestetti, Massimiliano, and Cavallotti, Pietro Luigi, "Electrochemical deposition and structural characterization of Au-Sn alloys," Journal of Solid State Electrochemistry, vol. 8 no. 3, pp. 159-166, Feb. 2004.

Vicenzo, Antonello, "Tin Whiskers: Testing and Mitigation." SEMICON Europa 2006, Munich, Germany, Apr. 5, 2006, pp. xx-xx.

Vichos, Peter, "Real-life tin-silver-copper alloy processing," Dataweek, vol. xx no. xx, pp. xx-xx, Feb. 25, 2004.

Vickers, Nicholas, Rauen, Kyle, Farris, Andrew, and Pan. Jianbiao, "Board Level Failure Analysis of Chip Scale Package Drop Test Assemblies," Proceedings of the 41st International Symposium on Microelectronics , Providence, RI, Nov. 2-6, 2008, pp. xx-xx.

Vieilledent, Julien, Maia, Wilson, Retailleau, Pascal, Ameil-Ferbos, Marie Gabrielle, Dulondel, Frederic, Milesi, Philippe, Munier, Catherine, and Jephos, Catherine, "Mechanical behavior of SAC305 lead-free alloy," 2019 22nd European Microelectronics and Packaging Conference & Exhibition, Pisa, Italy, Sept. 16-19, 2019. pp. xx-xx.

Vigilante, Gene, "Lead-Free - The Global Effects," emsnow, Sept. 20, 2005.

Vigilante, Gene, "RoHS compliance calls for a product-based strategy," Green SupplyLine, Apr. 24, 2006.

Vigilante, Gene, "The Global Effects of Lead-Free," Lead-Free Magazine, vol. 5, 2005.

Vigliotti, Anthony, "Ask the EMPF Helpline!," empfasis, pp. 4-5, Sept. 2006.

Vigliotti, Anthony, "Design of Experiment for Reflow Soldering in Inert Atmospheres," empfasis, pp. 4, 9, Oct. 2007.

Vignola, Eric, Menini, Richard, Petrescu, George, and Gurban, Lucian, "Effect of Metallic Bath Contaminants On Zn-Ni Electroplated Alloy Properties," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 636-650.

Vijayakumar, K. P., and Purushothaman, C., "Measurement of intrinsic stress in silver films by using ellipsometry," Journal of Applied Physics, vol. 59 no. 6, pp. 1787-1789, Mar. 15, 1986.

Vijayakumar, Namo, Thirugnanasamanbandam, Sivasubramanian, Soobramaney, Pregassen, Zhang, Jiawei, Sanders, Thomas, Evans, John, Flowers, George, and Bozack, Michael, "The Effect of Iso-Thermal aging on Vibrational performance of SAC 105 and 305 alloys," 2013 IEEE International Symposium on Advanced Packaging Materials, Irvine, CA, Feb. 27-Mar. 1, 2013, pp. 69-81.

Vijayen, Jayamalar, Maveety, James G., and Allen, Emily L., "The Effect of Temperature and Strain Rate on Selected Lead-Free Solder Alloys," Proceedings of the 30th International Symposium for Testing and Failure Analysis, Worchester (Boston), MA, Nov. 14-18, 2004, pp. 244-247.

Villain, J., Brueller, O. S., and Qasim, T., "Creep behaviour of lead free and lead containing solder materials at high homologous temperatures with regard to small solder volumes," Sensors and Actuators A: Physical, vol. 99 no. 1-2, pp. 194-197, Apr. 30, 2002.

Villain, J., Corradi, U., Weippert, Chr., Klima, S., Meeh, M., and Golling, S., "Determination of Mechanical Properties of Differently Oriented beta-Tin Crystals in Small Solder Joints and Small Tensile Specimens using EBSD and Nano Hardness Measurements," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 356-359.

Villain, J., Jillek, W., Schmitt, E., and Qasim, T., "Properties and Reliability of SnZn-Based Lead-Free Solder Alloys," Proceedings of 2004 International IEEE Conference on the Asian Green Electronics, Hong Kong, China, Jan 5-9, 2004, pp. 38-41.

Villain, Juergen, Mueller, Wolfgang, Weippert, Christina, Corradi, Ulrike, and Saeed, Usman, "Determination of Mechanical Properties of Electronic Materials as Gold, Nickel and Tin using Nanoindentation," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 304-309.

Villain, Juergen, Mueller, Wolfgang, Saeed, Usman, Weippert, Christina, Corradi, Ulrike, and Svetly, Artur, "Mechanical Behaviour of SAC-Lead Free Solder Alloys with Regard to the Size Effect and the Crystal Orientation," European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009, pp. xx-xx.

Vincent, J. H., Richards, B. P., Wallis, D. R., Gunter, I. A., Billington, S. R., Harman, A. C., Knight, E., Tanner, C. G., Wright, B. M., Warwick, M. E., Steen, H. A. H., Harris, P. G., and Whitmore, M. A., "Alternative Solders for Electronic Assemblies," Proceedings of the Technical Program NEPCON West '94, Volume 2, Anaheim, CA, Feb. 27-Mar. 4, 1994, pp. 884-892.

Vincent, J. H., Richards, B. P., Wallis, D. R., Gunter, I. A., Warwick, M., Steen, H. A. H., Harris, P. G., Whitmore, M. A., Billington, S. R., Harman, A. C., and Knight, E., "Alternative Solders for Electronics Assemblies: Part 2: UK Progress and Preliminary Trials," Circuit World, vol. 19 no. 3, pp. 32-34, 1993.

Vincent, J. H., and Humpston, G., "Lead-Free Solders for Electronic Assembly," GEC Journal of Research , vol. 11 no. 2, pp. 76-89, 1994.

Vincent, James H., "IDEALS: Improved Design Life and Environmentally Aware Manufacture of Electronic Assemblies by Lead-Free Soldering," SMART Group Lead-Free Seminar 2000, High Wycombe, UK, Feb. 10, 2000.

Vincent, L., Djomani, D., Fakfakh, M., Renard, C., Belier, B., Bouchier, D., and Patriarche, G., "Shear-driven phase transformation in silicon nanowires," Nanotechnology , vol. 29 no. 12, pp. 125601-1-125601-7, Mar. 23, 2018.

Vincent, Laetitia, Patriarche, Gilles, Hallais, Geraldine, Renard, Charles, Gardes, Cyrille, Troadec, David, and Bouchier, Daniel, "Novel Heterostructured Ge Nanowires Based on Polytype Transformation," Nano letters, vol. 14 no. 8, pp. 4828-4836, 2014. DOI: 10.1021/nl502049a

Vincent, Matt, "IECQ-ECCB, BICSI plant seeds for `green'," Connector Specifier , vol. 25 no. 3, pp. 10-11, May/June 2009.

Vincent, Matt, "RoHS compliance forecast: More substances under scrutiny," Connector Specifier, vol. 24 no. 2, pp. 16-19, Mar. 2008.

Vincent, Matt, "Wire and harness industry standard passes the test," Connector Specifier, vol. 23 no. 3, pp. 19-21, June-July 2007.

Vincent, Matt, "Wire harness intelligentsia probe standards, RoHS, lean manufacturing," Connector Specifier, vol. 23 no. 4, pp. 15-18, Sept./Oct. 2007.

Viqueira, Maria S., Garcia, Sebastian E., Urreta, Silvia E., Lopez, Gabriela Pozo, and Fabietti, Luis M., "Hysteresis Properties of Hexagonal Arrays of FePd Nanowires," IEEE Transactions on Magnetics, vol. 49 No. 8 part 1, pp. 4498-4501, Aug. 2013.

Virk, Hardev Singh, "Synthesis and Characterization of Metal and Semiconductor Nanowires," Solid State Phenomena, vol. 201, pp. 21-64, May 2013.

Visser, P., "Novel totally chrome free corrosion inhibiting coating technology for protection of aluminium alloys," Transactions of the Institute of Metal Finishing, vol. 89 no. 6, pp. 291-294, Nov. 2011.

Viswanadam, Gautham, and Han, Leow Khim, "Wafer Level Lead Free Solder Bumping Process & Characterization," International Symposium on Electronic Materials and Packaging, Hong Kong, China, Nov. 30-Dec. 2, 2000, pp. 7-11.

Vitina, I., Pelece, I., Rubene, V., Belmane, V., Lubane, M., Krumina, A., and Zarina, Z., "Formation of intermediate intermetallic layers on interaction of electrodeposited Sn, Ni-Fe, Ni-B coatings with different metallic substrata," Journal of Adhesion Science and Technology, vol. 11 no. 6, pp. 835-860, 1997.

Vivari, John, "3 Steps to Successful Solder Paste Selection," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Vivet, L., Joudrier, A.-L., Tan, K.-L., Morelle, J.-M., Etcheberry, A., and Chalumeau, L., "Influence of nickel-phosphorus surface roughness on both wettability and pores formation in solder joints for high power electronic applications," 2014 8th International Conference on Integrated Power Systems, Nuremberg, Germany, Feb. 25-27, 2014, pp. xx-xx.

Vizdal, Jiri, Kroupa, Ales, Popovic, Jiri, and Zemanova, Adela, "The Experimental and Theoretical Study of Phase Equilibria in the Pd-Zn (-Sn) System," Advanced Engineering Materials, vol. 8 no. 3, pp. 164-176, Mar. 2006.

Vizdal, Jiri, Braga, Maria Helena, Kroupa, Ales, Richter, Klaus W., Soares, Delfim, Malheiros, Luís Filipe, and Ferreira, Jorge, "Thermodynamic assessment of the Bi-Sn-Zn System," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 31 no. 4, pp. 438-448, Dec. 2007.

Vlassov, Sergei, Polyakov, Boris, Dorogin, Leonid M., Antsov, Mikk, Mets, Magnus, Umalas, Madis, Saar, Rando, Lohmus, Runno, and Kink, Ilmar, "Elasticity and yield strength of pentagonal silver nanowires: In situ bending tests," Materials Chemistry and Physics, vol. 143 no. 3, pp. 1026-1031, Feb. 14, 2014.

Vnuk, F., "Preparation of Compact alpha-Tin Specimens," Journal of Crystal Growth , vol. 48 no. 3, pp. 486-488, Mar. 1980.

Vnuk, F., De Monte, A., and Smith, R. W., "The effect of pressure on the semiconductor-to-metal transition temperature in tin and dilute Sn-Ge alloys," Journal of Applied Physics, vol. 55 no. 12, pp. 4171-4176, June 15, 1984.

Vo, Nhat, Boguslavsky, Irina, and Bush, Peter, "NEMI Recommends Standard Test Methods to Assess Propensity for Tin Whisker Growth," Surface Mount Technology (SMT), vol. 17 no. 11, pp. 36-41, Nov. 2003.

Vo, Nick, "Board-Level Whisker Testing," Apex, July 12, 2007.

Vo, Nick, Kwoka, Mark, and Bush, Peter, "Tin Whisker Test Standardization," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 3-9, Jan. 2005.

Vogel, Gert, "Failure Analysis on Soldered Ball Grid Arrays: Part II," Electronic Device Failure Analysis, vol. 19 no. 2, pp. 4-9, May 2017.

Vogel, Roland, and Sonntag, Birgit, "Zink-Eisen, Zink-Kobalt und Nachbehandlungsverfahren in der Praxis," Galvanotechnik, vol. 92 no. 11, pp. 2970-2976, Sept. 2001.

Voight, Wolfgang, and Kenny, John, "Liquid antioxidants: a new choice for increased cleanliness and productivity in the production of cross-linked cable insulation," Wire Journal International, vol. 35 no. 4, pp. 196-201, Apr. 2002.

Vojdani, S., and White, E. A. D., "The Vapour-Phase Growth of Thin Nickel Crystal Platelets," Journal of Materials Science, vol. 4 no. 1, pp. 80-83, Jan. 1969.

Vokes, Kathleen, "US EPA Flame Retardants in Printed Circuit Boards Partnership," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Volante, Charles N., "A Review of Green Flame Retardants used in Epoxy Molding Powders designed for Passive Components," 24th Annual Capacitor and Resistor Technology Symposium, San Antonio, TX, Mar. 29-Apr. 1, 2004, pp. 5-9.

Volk, P., "Masshaltig und brillant - chrom(VI)freie galvanische Beschichtungssysteme fur Verbindungselemente," Galvanotechnik, vol. 101 no. x, pp. 5479-5484, Sept. 2003.

Volk, Peter, "Echte Alternative Chrom(III)-haltige Vorbehandlung fur Aluminium," Metalloberflache, vol. 60 no. 5, pp. 1-4, May 2006.

Volobuev, V. V., Stetsenko, A. N., Mateychenko, P. V., Zubarev, E. N., Samburskaya, T., Dziawa, P., Reszka, A., Story, T., and Sipatov, A. Yu., "Bi catalyzed VLS growth of PbTe (0 0 1) nanowires," Journal of Crystal Growth, vol. 318 no. 1, pp. 1105-1108, Mar. 1, 2011.

Volodin, V. N., Tuleushev, Yu. Zh., Sukurov, B. M., Zhakanbaev, E. A., and Kerimshe, A. S., "Cadmium Whisker Microcrystals on the Surface of Niobium-Cadmium Films," Journal of Surface Investigation: X-ray, Synchrotron and Neutron Techniques, vol. 14 no. 4, pp. 679-683, 2020.

Volpert, Marion, Kopp, Christophe, Routin, Julien, Gasse, Adrien, Bernabe, Stephane, Rossat, Cyrille, Tournair, Myriam, Hamelin, Regis, and Lecocq, Vincent, "A Fluxless Bonding Process using AuSn or Indium for a Miniaturized Hermetic Package," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 224-231.

Volpert, Marion, Roulet, Lucile, Boronat, J. F., Borel, I., Pocas, S., and Ribot, H., "Indium Deposition Processes for Ultra Fine Pitch 3D Interconnections," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1739-1745.

Vona Jr., Samuel A., Tong, Quinn K., Kuder, Richard, and Shenfield, David, "Surface Mount Conductive Adhesives with Superior Impact Resistance," 1998 4th International Symposium on Advanced Packaging Materials, Brazelton, GA, Mar. 15-18, 1998, pp. 261-267.

von Czarnecki, J., Silberzahn, W., and Ortner, J., "Interface Stress-Induced Degradation of the Performance of Electrically Conductive Adhesives," Journal of Failure Analysis and Prevention , vol. 12 no. 3, pp. 248-252, June 2012.

von Gentzkow, W., and Rogler, W., "Latest Results with New Halogen-free Flame-retardant Base Materials," Circuit World, vol. 21 no. 1, pp. 45-47, 1994.

von Trapp, Francoise, "From the Editor: 192 Days to Lead-free and Counting," Advanced Packaging, vol. xx no. xx, pp. xx-xx, Dec. 21, 2005.

von Werne, Tim, Brooks, Andy, and Woollard, Siobhan, "Latest Developments in Surface Finishing of PCBs Using Plasma Deposition," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 972-977.

Voorhoeve, R. J. H., and Carides, J. N., "Whisker and Island Growth of Cadmium on (211) Germanium," Journal of Crystal Growth, vol. 16 no. 3, pp. 195-202, Dec. 1972.

Voronin, V., Maryamova, I., Zaganyach, Y., Karetnikova, E., and Kutrakov, A., "Silicon whiskers for mechanical sensors," Sensors and Actuators A: Physical, vol. 30 no. 1-2, pp. 27-33, Jan. 1992. https://doi.org/10.1016/0924-4247(92)80193-7

Vossen, J. L., Schnable, G. L., and Kern, W., "Processes for multilevel metallization," Journal of Vacuum Science and Technology, vol. 11 no. 1, pp. 60-70, Jan./Feb. 1974.

Voutilainen, Juha-Veikko, Hakkinen, Juha, and Moilanen, Markku, "Solder interconnection failure time estimation based on the embedded precursor behaviour modelling," Microelectronics Reliability, vol. 51 no. 2, pp. 425-436, Feb. 2011.

Voutsas, Apostolos T., Hibino, Yoshi, Pethe, Rajiv, and Demaray, Ernest, "Structure engineering for hillock-free pure aluminum sputter deposition for gate and source line fabrication in active-matrix liquid crystal displays." Journal of Vacuum Science & Technology A: Vacuum Surfaces, and Films , vol. 16 no. 4, pp. 2668-2677, July/Aug. 1998.

Vrabel, Melanie, "US EPA Flame Retardants in Printed Circuit Boards Partnership," It's Not Easy Being Green, San Jose, CA, Feb. 4-5, 2009, pp. xx-xx.

Vuong, B. X., Vu, N. S. H., Manh, T. D., Vaka, M., Du, D. X., and Nam, N. D., "Role of cerium in microstructure and corrosion properties of Sn-1.0Ag solder alloys," Materials Letters, vol. 228, pp. 309-313, Oct. 1, 2018.

Vuono, Bill, "Cleaning Fluid Entrapment Under Vented Flip Chip Packages," High Performance Cleaning and Coating Conference, Schaumburg, IL, Nov. 16-18, 2010, pp. xx-xx.

Vuono, Bill, "Cleaning Fluid Entrapment under Vented Flip Chip Packages," Tin Whisker Group teleconference, Mar. 23, 2011.

Vuono, Bill, "PWB Surface Finish Reliability," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 715-723.

Vuorela, M., Holloway, M., Fuchs, S., Stam, F., and Kivilahti, J., "Bismuth-filled Anisotropically Conductive Adhesive for Flip Chip Bonding," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 147-152.

Vuorela, M., and Kivilahti, J. K., "Evaluation of Bismuth as a Filler Material for Anisotropically Conductive Adhesive," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, Germany, Oct. 21-24, 2001, pp. 202.

Vuorinen, V., Dong, H. Q., and Laurila, T., "Effect of Ti on the interfacial reaction between Sn and Cu," Journal of Materials Science: Materials in Electronics, vol. 23 no. 1, pp. 68-74, Jan. 2012.

Vuorinen, V., Yu, H., Laurila, T., and Kivilahti, J. K., "Formation of Intermetallic Compounds Between Liquid Sn and Various CuNix Metallizations," Journal of Electronic Materials, vol. 37 no. 6, pp. 792-805, June 2008.

Vuorinen, V., Laurila, T., Yu, H., and Kivilahti, J. K., "Phase formation between lead-free Sn-Ag-Cu solder and Ni(P)/Au finishes." Journal of Applied Physics, vol. 99 no. 2, pp. 023530-1-023530-6, Jan 15, 2006.

Vuorinen, Vesa, Laurila, Tomi, Mattila, Toni, Heikinheimo, Erkki, and Kivilahti, Jorma K., "Solid-State Reactions between Cu(Ni) Alloys and Sn," Journal of Electronic Materials, vol. 36 no. 10, pp. 1355-1362, Oct. 2007.

WWWW

Wable, Girish S., "A Comparison of Lead-free No-Clean and Water Soluble Solder Pastes," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 23-24, 2003, pp. 83-91.

Wable, Girish S., Chu, Quyen, Damodaran, Purushothaman, and Srihari, Krishnaswami, "A systematic procedure for the selection of a lead-free solder paste in an electronics manufacturing environment," Soldering & Surface Mount Technology, vol. 17 no. 2, pp. 32-39, 2005.

Wable, Girish, and Neathway, Paul, "BGA Assembly with Low-Ag Alloy Spheres," Circuits Assembly, vol. 18 no. 10, pp. 34, 36, Oct. 2007.

Wable, Girish S., "Quality Engineering in Lead-Free Manufacturing," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies , San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Wable, Girish S., Chada, Srinivas, Neal, Bryan, and Fournelle, Raymond A., "Solidification Shrinkage Defects in Electronic Solders," JOM, vol. 57 no. 6, pp. 38-42, June 2005.

Wable, Girish, Chu, Quyen, Damodaran, Purushothaman, and Srihari, Krishnaswami, "Wave Soldering Using Sn/3.0Ag/0.5Cu Solder and Water Soluble VOC-Free Flux." IEEE Transactions on Electronics Packaging Manufacturing, vol. 29 no. 3, pp. 202-210, July 2006.

Wacaser, Brent A., Deppert, Knut, Karlsson, Lisa S., Samuelson, Lars, and Seifert, Werner, "Growth and characterization of defect free GaAs nanowires," Journal of Crystal Growth, vol. 287 no. 2, pp. 504-508, Jan. 25, 2006.

Wack, Harald, Tosun, Umut, Ravindran, Naveen, Becht, Joachim, Schweigart, Helmut, and Ellis, Dirk, "A New Definition of Low Stand Off Cleaning," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 232-247.

Wack, Harald, Becht, Joachim, Tosun, Umut, Schweigart, Helmut, and Afshari, Sia., "Cleaning Efficiency: Defluxing Lead-Free and Eutectic PCBs in One Process," Surface Mount Technology (SMT), vol. 26 no. 11, pp. 56-64, Nov. 2011.

Wack, Harald, "Cleaning Lead-Free - No Problems are expected," emsnow, Sept. 26, 2004.

Wack, Harald, Schweigart, Helmut, Tosun, Umut, Becht, Joachim, Afshari, Sia, and Ellis, Dirk, "Defluxing of Eutectic and LEAD-FREE Assemblies in a Single Cleaning Process," SMTA International ATE Show, Aug. 2006, pp. xx-xx.

Wack, Harald, Becht, Joachim, Tosun, Umut, Schweigart, Helmut, Afshari, Sia, and Ellis, Dirk, "Defluxing of Eutectic and Lead-Free Assemblies in a Single Cleaning Process," Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.

Wack, Harald, "Preventing Contamination-Caused Assembly Failure," Circuits Assembly, vol. 20 no. 6, pp. 42-43, June 2009.

Wack, Harald, "Preventing Contamination-Caused Assembly Failure," Printed Circuit Design and Fab, vol. 26 no. 7, pp. 14, July 2009.

Wack, Harald, "Specify Cleaning Chemistry Prior to Equipment Selection," Surface Mount Technology (SMT), vol. 21 no. 8, pp. 9, Oct. 2007.

Wada, Takehiro, Mori, Kimiaki, Joshi, Shantanu, and Garcia, Roberto, "Superior Thermal Cycling Reliability of Pb-Free Solder Alloy By Addition of Indium and Bismuth for Harsh Environments," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 210-215.

Wade, Noboru, Wu, Kepeng, Kunii, Johji, Yamada, Seiji, and Miyahara, Kazuya, "Effect of Cu, Ag and Sb on the Creep-Rupture Strength of Lead-Free Solder Alloys," Journal of Electronic Materials, vol. 30 no. 9, pp. 1228-1231, Sept. 2001.

Wafula, F., Yin, L., Borgesen, P., Andala, D., and Dimitrov, N., "Influence of Poly(ethylene glycol) Degradation on Voiding Sporadically Occurring in Solder Joints with Electroplated Cu," Journal of Electronic Materials, vol. 41 no. 7, pp. 1898-1906, July 2012.

Wager, Patrick A., Schluep, Mathias, Muller, Esther, and Gloor, Rolf, "RoHS regulated Substances in Mixed Plastics from Waste Electrical and Electronic Equipment," Environmental Science & Technology, vol. 46 no. 2, pp. 628-635, Jan. 17, 2012.

Wagner, John L., Ladwig, Peter F., Riemer, Doug P., and Houk, Galen, "Microstructure, Intermetallic Growth, and Reliability of Rapidly Solidified Pb-Free Solder Joints Formed via Solder Ball Jetting," Journal of Electronic Materials, vol. 38 no. 12, pp. 2600-2609, Dec. 2009.

Wagner, R. J., and Ewald, A. W., "Free Carrier Reflectivity of Gray Tin Single Crystals," Journal of Physics and Chemistry of Solids, vol. 32 no. 3, pp. 697-707, 1971.

Wagner, R. S., Ellis, W. C., Jackson, K. A., and Arnold, S. M., "Study of the Filamentary Growth of Silicon Crystals from the Vapor," Journal of Applied Physics, vol. 35 no. 10, pp. 2993-3000, Oct. 1964.

Wahlers, R. L., Feingold, A. H., and Heinz, M., "Lead Free, Zero Shrink, Substrate Bonded LTCC System," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 206-211.

Wai, Leong Ching, Wei, Seit Wen, Yuan, Hwang How, and MinWoo, Daniel Rhee, "High Temperature Die Attach Material on ENEPIG Surface for High Temperature (250DegC/500hour) and Temperature Cycle (-65 to +150DegC) Applications," 2014 IEEE 16th Electronics Packaging Technology Conference, Singapore, Dec. 3-5, 2014, pp. 229-234.

Wakabayashi, Shinichi, Sakaguchi, Noboru, Kaneko, Norio, and Nezu, Hiroyuki, "Effects of Underlayer Metals on Die Bond Reliability of Gold-Plated Ceramic Packages," Plating & Surface Finishing, vol. 81 no. 11, pp. 58-65, Nov. 1994.

Wakharkar, Vijay, and Dani, Ashay, "Microelectronic Packaging Materials Development & Integration Challenges for Lead Free," 2006 Lead-Free Technology Workshop, San Antonio, TX, Mar. 12, 2006, pp. xx-xx.

Wakuda, Daisuke, Kim, Chang-Jae, Kim, Keun-Soo, and Suganuma, Katsuaki, "Room Temperature Sintering Mechanism of Ag Nanoparticle Paste," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 909-913.

Wakuda, Daisuke, Kim, Keun-Soo, and Suganuma, Katsuaki, "Room-Temperature Sintering Process of Ag Nanoparticle Paste," IEEE Transactions on Components and Packaging Technologies, vol. 32 no. 3, pp. 627-632, Sept. 2009.

Waldron, Finbar, "Overview of Issues in Design for Reliability Using Lead-Free Solders," SMART Group Ireland Lead-free Seminar, Dublin, Ireland, Oct. 22, 2003.

Walk, Wolfgang, "Forecasting quantities of disused household CRT appliances - A regional case study approach and its application to Baden-Wurttemberg," Waste Management, vol. 29 no. 2, pp. 945-951, Feb. 2009.

Walker, D. E., and Wilcox, G. D., "Molybdate based conversion coatings for zinc and zinc alloy surfaces: a review," Transactions of the Institute of Metal Finishing, vol. 86 no. 5, pp. 251-259, Sept. 2008.

Walker, E., "Whisker Growth on Silver Tipped Contacts." 2004.

Walker, Jean-Cyril, "RoHS Recast Just Around the Corner: Are You Ready?," Surface Mount Technology (SMT), vol. 26 no. 2, pp. 18-20,22,24, Feb. 2011.

Walker, Jean-Cyril, "Waiting for Recast RoHS?," Surface Mount Technology (SMT), vol. 26 no. 4, pp. 64-66,68,70, Apr. 2011.

Walko, John, "Commentary: WEEE troubles in store," Green SupplyLine, Jan. 27, 2006.

Walko, John "Commentary: WEEE troubles in store," EE Times, Jan. 27, 2006.

Walko, John, "Consortium to focus on lead-free BGA availability," EE Times Europe , Nov. 9, 2006.

Walko, John, "EU takes cautious steps towards power standby regulation," EE Times Europe, July 8, 2008.

Walko, John, "Europe charges up battery recycling rules," Green SupplyLine , May 3, 2006.

Walko, John, "First REACH list "a drop in the ocean" warns environmental lobby," EE Times Europe, Oct. 29, 2008.

Walko, John, "Green, smart materials set for major growth, says report," Green SupplyLine, Nov. 23, 2005.

Walko, John, "Green, smart materials set for major growth -- report," EE Times Europe, Nov. 23, 2005.

Walko, John, "Green, smart materials set for major growth -- report," EE Times , Nov. 23, 2005.

Walko, John, "Green, smart materials set for major growth -- report," Industrial Control Design Line, Nov. 23, 2005.

Walko, John, "Greenpeace: iPhone not green enough," EE Times Europe, vol. xx no. xx, pp. xx-xx, Nov. 19, 2007.

Walko, John, "Greenpeace tries to gatecrash Apple's Euro iPhone party," EE Times Europe, vol. xx no. xx, pp. xx-xx, Nov. 5, 2007.

Walko, John, "Groups link to lobby for environmental recycling charge," EE Times Europe, Sep. 19, 2006.

Walko, John, "Groups link to lobby for environmental recycling charge," Green SupplyLine, Sept. 19, 2006.

Walko, John, "REACH a risk to EU solder supply, warns report," EE Times Europe , Sept. 17, 2008.

Walko, John, "RoHS directive heralds requiem for church organs," EE Times, Mar. 20, 2006.

Walko, John, "RoHS directive heralds Requiem for church organs," Green SupplyLine , Mar. 20, 2006.

Walko, John, and Clarke, Peter, "Survey sees difficult introduction for RoHS," EE Times Europe , Aug. 23, 2006.

Walko, John, "UK firms breaking the law as WEEE directive starts," EE Times Europe, vol. xx no. xx, pp. xx-xx, Mar. 15, 2007.

Wallace, Dewight, "It's About Time for RoHS," Design News, vol. 62 no. 15, pp. 24, Oct. 22, 2007.

Wallace, John, "Solder bonds directly to optical fiber," Laser Focus World, vol. 38 no. 5, pp. 38-40, May 2002.

Wallentin, Jesper, and Borgstrom, Magnus T., "Doping of semiconductor nanowires," Journal of Materials Research , vol. 26 no. 17, pp. 2142-2156, Sept. 14, 2011.

Wallin, Lars, "A Swedish Authority Doesn't Make Mistakes," IPC Review, vol. 48 no. 10, pp. 21,27, Dec. 2007.

Wallin, Lars, "Approaching lead free from a practical standpoint," evertiq, Sept. 7, 2005.

Wallin, Lars, "Are Scandinavian Companies Ready for Production of Lead Free PCBs?," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S19-03-1-S19-03-3.

Wallin, Lars, "Are You Prepared for RoHS Compliance?," evertiq, May 5, 2005.

Wallin, Lars, "Electronics from an Environmental Point of View: Will Norway be Electronics Free?," IPC Review, vol. 48 no. 8, pp. 9-10, Sept. 2007.

Wallin, Lars, "Report from a BGA," emsnow, Jan. 25, 2007.

Wallin, Lars, "Report from a BGA - part 2," emsnow, Feb. 13, 2007.

Wallin, Lars, "Startling results from reliability testing," Mydata, 2009.

Wallin, Lars, "The Lead-free Conference in Barcelona: Experts Share Their Insight on Lead-free," Lead-Free Magazine, vol. 5, 2005.

Wallin, Lars, "View from Europe: RoHS Compliance and Beyond in Malmo," IPC Review , vol. 47 no. 5, pp. 9, June 2006.

Wallin, Lars, "View from Europe: RoHS Compliance and Beyond in Malmo," Lead-Free Magazine, vol. 7, Nov. 2006.

Wallin, Lars, "What is the future of electronics?," emsnow, Nov. 6, 2007.

Wallin, Lars, "Will the WEEE Directive Drive Swedish Companies to Bankruptcy?," IPC Review, vol. 48 no. 7, pp. 10, Aug. 2007.

Walls, James, Kuo, Shun-Meen, Gelvin, Eric, and Rogers, Albert, "High-Sensitivity Electromigration Testing of Lead-Free WLCSP Solder Bumps," 2010 Proceedings 60th Electronic Components and Technology Conference , Las Vegas, NV, June 1-4, 2010, pp. 293-296.

Walls, Mike, "REACH 101," Adhesives & Sealants Industry, vol. 15 no. 1, pp. 21-23, Jan. 2008.

Walraven, Tony, "PB-FREE - too hot for traditional soldering irons," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, Apr. 2003.

Walsh, Don, "Back to the Drawing Board," Metal Finishing, vol. 103 no. 12, pp. 25-29, Dec. 2005.

Walsh, Don, "Black Pad Has Multiple Causes," Circuits Assembly, vol. 19. no. 6, pp. 4, June 2008.

Walsh, Donald, Milar, George, and Gudeczauskas, Donald, "Know Your Final Finish Options," Circuits Assembly, vol. 17 no. 8, pp. 52-53, Aug. 2006.

Walsh, Donald, Milad, George, and Gudeczauskas, Donald, "Know Your Final Finish Options," Printed Circuit Design and Manufacture, vol. 23 no. 2, pp. 38, 40, Feb. 2006.

Walsh, Donald E., Milad, George, and Gudeczauskas, Donald, "Printed circuit boards: Final finish options," Products Finishing , vol. 68 no. 11, pp. 50-53, Aug. 2004.

Walsh, E. M., "Zinc as a substitute for cadmium?," Finishing, vol. 6 no. 6, pp. 13-14, June 1982.

Walsh, F. C., and Low, C. T. J., "A review of developments in the electrodeposition of tin," Surface and Coatings Technology, vol. 288, pp. 79-94, Feb. 25, 2016. https://doi.org/10.1016/j.surfcoat.2015.12.081

Walsh, Mike, "Electroless Nickel Immersion Gold and Black Pad," CircuiTree , vol. 14 no. 1, pp. xx, Jan. 2001.

Walsh, Mike, "Electroless Nickel Immersion Gold and Black Pad," Galvanotechnik , vol. xx no. xx, pp. 2281-2286, Sept. 2002.

Walsh, Michael K, and Ewer, Kristen, "High Phosphorus Electroless Nickel for Selective ENIG (SENIG)," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S14:01.

Walter, J., Fischer, R., and Birzer, C., "Analysis Methods for Characterizing Drop Test Robustness of Lead-free FBGA's," Proceedings of the 31st International Symposium for Testing and Failure Analysis, San Jose, CA, Nov. 6-10, 2005, pp. 145-150.

Walter, Markus, " Processes and Their Parameters," Circuits Assembly, vol. 17 no. 1, pp. 38, 40-41, Jan. 2006.

Walter, Markus, "Switching to Pb-Free," Circuits Assembly, vol. 16 no. 3, pp. 36, Oct. 2005.

Walter, Markus, "Switching to Pb-Free: Reflow Soldering," Circuits Assembly, vol. 16 no. 12, pp. 30, 32, Dec. 2005.

Walter, Markus, "Switching to Pb-Free: Wave Soldering," Circuits Assembly, vol. 16 no. 11, pp. 46-49, Nov. 2005.

Walter, Markus, and Schlessmann, Heike, "Switching your wave soldering equipment to "lead-free"," EMasia , May 2006.

Walter, Paul, "Lead-free Impact on X-ray Inspection," Advanced Packaging, vol. 15 no. 10, pp. xx-xx, Oct. 2006.

Walters, John, Foster, Mike, and Lambert, Dave, "Process simulation of drawing and cold heading processes," Wire Journal International, vol. 38 no. 3, pp. 199-204, Mar. 2005.

Walther, Grit, and Spengler, Thomas, "Impact of WEEE-directive on reverse logistics in Germany," International Journal of Physical Distribution & Logistics Management , vol. 35 no. 5, pp. 337-361, 2005.

Walz, Mark J., and Berry, Michael, "Through-Hole Connector Rework Using Convection Heating," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 481-484.

Wan, J. B., Liu, Y. C., Wei, C., Gao, Z. M., and Ma, C. S., "Effect of Al content on the formation of intermetallic compounds in Sn-Ag-Zn lead-free solder," Journal of Materials Science: Materials in Electronics, vol. 19 no. 3, pp. 247-253, Mar. 2008.

Wan, Jing Bo, Liu, Yong Chang, Wei, Chen, Jiang, Peng, and Gao, Zhi Ming, "Effect of the soldering time on the formation of interfacial structure between Sn-Ag-Zn lead-free solder and Cu substrate," Journal of Materials Science: Materials in Electronics, vol. 19 no. 12, pp. 1160-1168, Dec. 2008.

Wan, Jingbo, Liu, Yongchang, Wei, Chen, and Gao, Zhiming, "Effect of the addition of In on the microstructural formation of Sn-Ag-Zn lead-free solder," Journal of Alloys and Compounds, vol. 463 no. 1-2, pp. 230-237, Sept. 8, 2008.

Wan, Yongqiang, Liu, Xiaoli, Hu, Xiaowu, Min, Zhixian, Yi, Guangbin, Jiang, Xiongxin, and Li, Yulong, "Effect of electroplating parameters on electroplated Cu film and microvoid formation of solder joints," Journal of Materials Science: Materials in Electronics, vol. 29 no. 21, pp. 18404-18416, Nov. 2018.

Wan, Yongqiang, Hu, Xiaowu, Xu, Tao, Li, Yulong, and Jiang, Xiongxin, "Interfacial IMC growth of SAC305/Cu joint with a novel dual-layer of Ni(P)/Cu plating during solid-state aging," Microelectronic Engineering, vol. 199, pp. 69-79, Nov. 5, 2018.

Wan, Yongqiang, Li, Shuang, Hu, Xiaowu, Qiu, Yu, Xu, Tao, Li, Yulong, and Jiang, Xiongxin, "Shear strength and fracture surface analysis of Sn58Bi/Cu solder joints under a wide range of strain rates," Microelectronics Reliability, vol. 86, pp. 27-37, July 2018.

Wanchun, Tian, Qin, Wu, and Liang, Zhou, "Failure Analysis Technology of Lead-free BGA Solder Joints and Relevant Cases," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 284-287.

Wang, Amy, "China accelerates green program," Electronics Supply & Manufacturing, Mar. 11, 2005.

Wang, Amy, "China: Partially leaded, partially unleaded," Electronics Weekly , Oct. 27, 2005.

Wang, Amy, "Decoding China RoHS," Industrial Control Design Line, Jan. 1, 2007.

Wang, Amy, "Decoding China RoHS," Electronics Supply & Manufacturing , Jan. 2007.

Wang, Amy, "Decoding China RoHS," EE Times Europe, vol. xx no. xx, pp. xx-xx, Jan. 1, 2007.

Wang, Amy, "Partially Leaded, Partially Unleaded," Electronic News, Oct. 27, 2005.

Wang, Amy, and Rayner, Bruce, "Soft launch for China RoHS in July," Electronics Supply & Manufacturing, Dec. 2005.

Wang, Bo, Wu, Fengshun, Wu, Yiping, An, Bing, Liu, Hui, and Zou, Jian, "A comparative study of microstructure and mechanical properties among Cu/Sn/Cu, Ni/Sn/Ni and Cu/Sn/Ni solder joints," Soldering & Surface Mount Technology, vol. 23 no. 1, pp. 40-46, 2011.

Wang, Bo, and Siegmund, T., "A modified 4-point bend delamination test," Microelectronic Engineering , vol. 85 no. 2, pp. 477-485, Feb. 2008.

Wang, Bo, Xu, Yan, Yung, Kai-Leung, Chen, Wei, and Kang, Chun-Lei, "Aligning and Soldering Pure-Copper Nanowires for Nanodevice Fabrication," IEEE/ASME Journal of Microelectromechanical Systems, vol. 22 no. 3, pp. 519-526, June 2013.

Wang, Bo, Li, Jiajun, Gallagher, Anthony, Wrezel, James, Towashirporn, Pongpinit, and Zhao, Naiqin, "Drop impact reliability of Sn-1.0Ag-0.5Cu BGA interconnects with different mounting methods," Microelectronics Reliability, vol. 52 no. 7, pp. 1475-1482, July 2012.

Wang, Bo, Wu, Fengshun, Peng, Jin, Liu, Hui, Wu, Yiping, and Fang, Yuebo, "Effect of Miniaturization on the Microstructure and Mechanical Property of Solder Joints," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1149-1154.

Wang, Bo, Wu, Fengshun, Du, Bin, An, Bing, and Wu, Yiping, "Effect of Stand-off Height on the Microstructure and Fracture Mode of Cu/Sn-9Zn/Cu Solder Joint under Tensile Test," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Wang, Bo, Wu, Fengshun, Wu, Yiping, Liu, Hui, Zhou, Longzao, and Fang, Yuebo, "Effect of stand-off height on the microstructure and mechanical behaviour of solder joints," Soldering & Surface Mount Technology, vol. 22 no. 1, pp. 11-18, 2010.

Wang, Bo, Yang, Xuexia, Zhang, Yu, and Shu, Xuefeng, "Experimental Study on the Effect of Reflow Soldering Temperature Profile on the Solder Joint Shape," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 1128-1131.

Wang, Bo, Wu, Fengshun, Wu, Yiping, Mo, Liping, and Xia, Weisheng, "Microstructural evolution of the intermetallic compounds in the high density solder interconnects with reduced stand-off heights," Soldering & Surface Mount Technology, vol. 23 no. 4, pp. 229-234, 2011.

Wang, Bo, Zhu, Jinzhuan, Chen, Shijie, Xia, Weisheng, and He, Man, "Research on the microstructure and shearing property of microbumps with one Sn grain for high density solder interconnects," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 659-661.

Wang, C. Q., Zhong, Y., Caers, J. F. J. M., Zhao, X. J., Li, B., and Liu, B. L., "Relationship between crack propagation trends and grains in SnAgCu interconnects," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1200-1204.

Wang, Changchang, Chen, Yinbo, and Liu, Zhi-Quan, "Fractography and failure location evolution of Sn58Bi-Ag-Cu solder alloy during thermal aging," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Wang, Changchang, Chen, Yinbo, and Liu, Zhi-Quan, "Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging," Acta Metallurgica Sinica (China), vol. 33 no. 10, pp. 1388-1396, Oct. 2020. https://doi.org/10.1007/s40195-020-01059-3

Wang, Chao, He, Yuehui, Wang, Shiliang, Zhang, Quan, and Liu, Xinli, "Low-temperature growth of tetragonal tungsten nanowire arrays on tungsten substrate using Ni solid catalysts," Journal of Crystal Growth, vol. 338 no. 1, pp. 214-217, Jan. 1, 2012.

Wang, Chao-hong, and kuo, Chun-yi, "Coupling Effect of the Interfacial Reaction in Co/Sn/Cu Diffusion Couples," Journal of Electronic Materials, vol. 39 no. 8, pp. 1303-1308, Aug. 2010.

Wang, Chao-hong, and Chen, Sinn-wen, "Cruciform pattern formation in Sn/Co couples," Journal of Materials Research, vol. 22 no. 12, pp. 3404-3409, Dec. 2007.

Wang, Chao-hong, Chen, Hsien-hsin, and Chiu, Chun-wei, "Cruciform Pattern of Ni5Zn21 Formed in Interfacial Reactions Between Ni and Sn-Zn Solders," Journal of Electronic Materials, vol. 43 no. 5, pp. 1362-1369, May 2014.

Wang, Chao-hong, Lai, Wei-han, and Chen, Sinn-wen, "Dissolution and Interfacial Reactions of (Cu,Ni)6Sn5 Intermetallic Compound in Molten Sn-Cu-Ni Solders," Journal of Electronic Materials, vol. 43 no. 1, pp. 195-203, Jan. 2014.

Wang, Chao-hong, Shen, Han-ting, and Lai, Wei-han, "Effective suppression of electromigration-induced Cu dissolution by using Ag as a barrier layer in lead-free solder joints," Journal of Alloys and Compounds, vol. 564, pp. 35-41, July 5, 2013.

Wang, Chao-Hong, Kuo, Chun-yi, Chen, Hsien-hsin, and Chen, Sinn-wen, "Effects of current density and temperature on Sn/Ni interfacial reactions under current stressing," Intermetallics, vol. 19 no. 1, pp. 75-80, Jan. 2011.

Wang, Chao-Hong, and Li, Kuan-Ting, "Effects of Ga Addition on Interfacial Reactions Between Sn-Based Solders and Ni," Journal of Electronic Materials, vol. 45 no. 12, pp. 6200-6207, Dec. 2016.

Wang, Chao-hong, Chen, Hsien-hsin, and Lai, Wei-han, "Effects of Minor Amounts of Zn on the Sn-Zn/Ni Interfacial Reactions and Phase Equilibria of the Ternary Sn-Zn-Ni System at 250°C," Journal of Electronic Materials, vol. 40 no. 12, pp. 2436-2444, Dec. 2011.

Wang, Chao-hong, Kuo, Chun-yi, and Guo, Yu-bin, "Effects of Minor Cu, Ni and Ag Additions on the Reactions Between Sn-Based Solders and Co Substrate," JOM, vol. 71 no. 9, pp. 3023-3030, Sept. 2019.

Wang, Chao-hong, and Shen, Han-ting, "Effects of Ni addition on the interfacial reactions between Sn-Cu solders and Ni substrate," Intermetallics, vol. 18 no. 4, pp. 616-622, Apr. 2010.

Wang, Chao-hong, and Liu, Jian-lin, "Effects of Sn thickness on morphology and evolution of Ni3Sn4 grains formed between molten Sn and Ni substrate," Intermetallics, vol. 61, pp. 9-15, June 2015.

Wang, Chao-hong, Li, Kuan-ting, and Chen, Ke-hsing, "Effects of Zn and Ga Additions to Suppress PdSn4 Growth at a Solder/Pd Interface Under Current Stressing," Journal of Electronic Materials , vol. 47 no. 1, pp. 1-8, Jan. 2018.

Wang, Chao-Hong, and Li, Kuan-Ting, "Growth kinetics and mechanism of Pd2Zn9 at the interface of Pd substrate with molten Sn-9wt.%Zn solder," Materials Chemistry and Physics, vol. 164, pp. 223-229, Aug. 15, 2015.

Wang, Chao-hong, and Kuo, Chun-yi, "Growth kinetics of the solid-state interfacial reactions in the Sn-Cu/Co and Sn/Co-Cu couples," Materials Chemistry and Physics, vol. 130 no. 1-2, pp. 651-656, Oct. 17, 2011.

Wang, Chao-hong, Huang, Sheng-en, and Chiu, Chun-wei, "Influence of the P content on phase formation in the interfacial reactions between Sn and electroless Co(P) metallization on Cu substrate," Journal of Alloys and Compounds, vol. 619, pp. 474-480, Jan. 15, 2015.

Wang, Chao-hong, Huang, Sheng-en, and Li, Kuan-ting, "Inhibiting CoSn3 growth at the Sn/Co system by minor Zn addition," Intermetallics, vol. 56, pp. 68-74, Jan. 2015.

Wang, Chao-hong, Li, Po-yi, and Li, Kuan-ting, "Interfacial Microstructure Evolution Between Sn-Zn Solders and Ag Substrate During Solid-State Annealing," Journal of Electronic Materials, vol. 43 no. 12, pp. 4594-4601, Dec. 2014.

Wang, Chao-Hong, and Chen, Sinn-Wen, "Interfacial reactions in Sn-(Cu)/Cu6Sn5/Ni couples at 210 °C," Intermetallics, vol. 16 no. 4, pp. 531-537, Apr. 2008.

Wang, Chao-hong, Chen, Hsien-hsin, and Li, Po-yi, "Interfacial reactions of high-temperature Zn-Sn solders with Ni substrate," Materials Chemistry and Physics, vol. 135 no. 2-3, pp. 325-333, Aug. 15, 2012.

Wang, Chao-Hong, and Chen, Sinn-Wen, "Isothermal Section of the Ternary Sn-Cu-Ni System and Interfacial Reactions in the Sn-Cu/Ni Couples at 800 °C," Metallurgical and Materials Transactions A, vol. 34 no. 10, pp. 2281-2287, Oct. 2003.

Wang, Chao-hong, Chen, Hsien-hsin, Li, Po-yi, and Chu, Po-yen, "Kinetic analysis of Ni5Zn21 growth at the interface between Sn-Zn solders and Ni," Intermetallics, vol. 22, pp. 166-175, Mar. 2012.

Wang, Chao-hong, Li, Mei-hau, Chiu, Chun-wei, and Chang, Tai-yu, "Kinetic study of solid-state interfacial reactions of p-type (Bi,Sb)2Te3 thermoelectric materials with Sn and Sn-Ag-Cu solders," Journal of Alloys and Compounds, vol. 767, pp. 1133-1140, Oct. 30, 2018.

Wang, Chao-hong, Li, Po-yi, and Li, Kuan-ting, "Liquid-state interfacial reactions in Sn-Zn/Pd couples and phase equilibria of the Sn-Zn-Pd system at 260 °C," Intermetallics, vol. 59, pp. 68-74, Apr. 2015.

Wang, Chao-hong, Huang, Sheng-en, and Liu, Jian-lin, "Liquid-State Interfacial Reactions of Sn-Zn/Co Couples at 250°C." Journal of Electronic Materials, vol. 41 no. 12, pp. 3259-3265, Dec. 2012.

Wang, Chao-hong, Li, Kuan-ting, and Huang, Po-yen, "Metastable CoSn4 formation induced by minor Ga addition and effective suppression effect on the IMC growth in solid-state Sn-Ga/Co reactions," Journal of Materials Science, vol. 51 no. 15, pp. 7309-7321, Aug. 2016.

Wang, Chao-hong, and Lin, Che-yang, "Minor P Doping to Effectively Suppress IMC Growth in Solder Joints with Electroplated Co(P) Metallization," Journal of Electronic Materials , vol. 48 no. 7, pp. 4552-4561, July 2019.

Wang, Chao-hong, and Kuo, Chun-yi, "Peltier effect on CoSn3 growth in Sn/Co/Sn couples with different substrate lengths," Materials Chemistry and Physics, vol. 153, pp. 72-77, Mar. 1, 2015.

Wang, Chao-hong, and Chen, Sinn-wen, "Peltier Effect on Sn/Co Interfacial Reactions," Journal of Electronic Materials, vol. 38 no. 5, pp. 655-662, May 2009.

Wang, Chao-hong, Huang, Sheng-en, and Huang, Po-yen, "Phase Equilibria of the Ternary Sn-Zn-Co System at 250°C and 500°C," Journal of Electronic Materials, vol. xx no. xx, pp. xx-xx, xxxx.

Wang, Chao-Hong, and Chen, Sinn-Wen, "Sn-0.7 wt.%Cu/Ni interfacial reactions at 250 °C," Acta Materialia , vol. 54 no. 1, pp. 247-253, Jan. 2006.

Wang, Chao-hong, and Chen, Sinn-wen, "Sn/Co solid/solid interfacial reactions," Intermetallics, vol. 16 no. 4, pp. 524-530, Apr. 2008.

Wang, Chao-hong, Wen, Chun-chieh, and Lin, Che-yang, "Solid-state interfacial reactions of Sn and Sn-Ag-Cu solders with an electroless Co(P) layer deposited on a Cu substrate," Journal of Alloys and Compounds, vol. 662, pp. 475-483, Mar. 25, 2016.

Wang, Chao-hong, and Li, Kuan-ting, "Study of electromigration resistance of (Pd,Ni)Sn4 phase in lead-free solder joints," Journal of Alloys and Compounds, vol. 654, pp. 546-553, Jan. 5, 2015.

Wang, Chao-hong, and Chen, Hsien-hsin, "Study of the Effects of Zn Content on the Interfacial Reactions Between Sn-Zn Solders and Ni Substrates at 250°C," Journal of Electronic Materials , vol. 39 no. 11, pp. 2375-2381, Nov. 2010.

Wang, Chao-hong, Kuo, Chun-yi, Huang, Sheng-en, and Li, Po-yi, "Temperature effects on liquid-state Sn/Co interfacial reactions," Intermetallics, vol. 32, pp. 57-63, Jan. 2013.

Wang, Chen Y., and Lee, Chin C., "A Eutectic Bonding Technology at a Temperature Below the Eutectic Point," 1992 Proceedings 42nd Electronic Components & Technology Conference , San Diego, CA, May 18-20, 1992, pp. 502-507.

Wang, Chen-Chao, Zhang, Shu-Qiang, Cheng, Hung-Hsiang, Lin, Tzu-Chih, Chiu, Chi-Tsung, and Hung, Chih-Pin, "Synthesizing SPICE-Compatible Models of Power Delivery Networks with Resonance Effect by Time-domain Waveforms," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Wang, Chunfen, Wang, Qun, Liufu, Shengcong, Yao, Qin, and Chen, Lidong, "Evaluation of Thermoelectric Properties of Highly Dense Bi2Te3 Nanowire Arrays by Macro-Integration Method," Key Engineering Materials, vol. 352, pp. 239-244, Aug. 2007

Wang, Chunke, Qin, Fei, and An, Tong, "Effects of IMC Thickness on Fracturing of Solder Joints," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 511-514.

Wang, Colin, Chang, Wu Jin, Xin, Wang, Kwan, Tang Kok, and Aspandiar, Raiyo F., "Impact of Low Ag SAC Solder Pastes on BGA Solder Joint Quality," SMTA China East 2014 Proceedings, Shanghai, China, Apr. 23-25, 2014, pp. xx-xx.

Wang, Colin, Jin-chang, Wu, and Xin, Wang, "SJQ and SJR Study of SMT Soldering with Low Temperature Solder Paste," SMTA China East 2015 Proceedings, Shanghai, China, Apr. 21-24, 2015, pp. xx-xx.

Wang, Cuiping, Wang, Jian, Wang, Juan, Chen, Liang, and Liu, Xingjun, "Characteristics of a New Non-rosin, Lead-free Solder Paste Activity System," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 250-256.

Wang, Cuiping, Xu, Yelu, Yang, Shuiyuan, Jiang, Hengxing, Li, Jian, Zhu, Jiahua, Yang, Shuang, and Liu, Xingjun, "Experimental Determination of Phase Equilibria in the Sn-Zn-Sb System," Journal of Phase Equilibria and Diffusion, vol. 36 no. 4, pp. 350-356, Aug. 2015.

Wang, Cuiping, Wang, Jian, Chen, Liang, Li, Yuechan, and Liu, Xingjun, "Study on soldering flux used for Sn-0.7Cu welding wire," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 246-249.

Wang, Daijiao, and Panton, Ronald L., "Experimental Study of Void Formation in Eutectic and Lead-Free Solder Bumps of Flip-Chip Assemblies," Journal of Electronic Packaging, vol. 128 no. 3, pp. 202-207, Sept. 2006.

Wang, Dapeng, Hao, Jian, Zhou, Jian, Xue, Feng, Tian, Shuang, and Li, Saipeng, "The Influence of Thermal Aging on Reliability of Sn-58Bi Interconnects," 2017 18th International Conference on Electronic Packaging Technology , Harbin, China, Aug. 16-19, 2017, pp. 744-749.

Wang, Debao, Yu, Dabin, Mo, Maosong, Liu, Xianming, and Qian, Yitai, "Preparation and characterization of wire-like Sb2Se3 and flake-like Bi2Se3 nanocrystals," Journal of Crystal Growth, vol. 253 no. 1-4, pp. 445-451, 2003.

Wang, Dong, Ma, Xiaosong, and Guo, Dan, "Reliability Analysis of Lead-free Flip Chip Solder Joint," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Wang, Dongfan, Ling, Huiqin, Sun, Menglong, Miao, Xiaoying, Hu, Anmin, Li, Ming, Dai, Fengwei, Zhang, Wenqi, and Cao, Liqiang, "Investigation of intermetallic compound and voids growth in fine-pitch Sn-3.5Ag/Ni/Cu microbumps," Journal of Materials Science: Materials in Electronics, vol. 29 no. 3, pp. 1861-1867, Feb. 2018.

Wang, Dongliang, Yuan, Yuan, and Luo, Le, "Failure Analysis of Sn-3.5Ag Solder Joints for FCOB Using 2-D FEA Model," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 624-629.

Wang, Dongliang, Yuan, Yuan, and Luo, Le, "Indium Addition on Intermetallic Compound Evolution in Tin-Silver Solder Bump," Materials Transactions, vol. 52 no. 7, pp. 1522-1524, 2011.

Wang, Dong-Liang, Yuan, Yuan, and Luo, Le, "Liquid-solid interfacial reactions of Sn-Ag and Sn-Ag-In solders with Cu under bump metallization," Journal of Materials Science: Materials in Electronics, vol. 23 no. 1, pp. 61-67, Jan. 2012.

Wang, Dong-Liang, Yuan, Yuan, and Luo, Le, "Preparation of Sn-Ag-In Solder Bumps by Electroplating of Sn-Ag and Indium in Sequence and the Effect of Indium Addition on Microstructure and Shear Strength," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 8, pp. 1275-1279, Aug. 2012.

Wang, Emily, "4 steps for managing environmental compliance," Green SupplyLine , Mar. 12, 2007.

Wang, Fei, and Nestler, Britta, "Detachment of nanowires driven by capillarity," Scripta Materialia , vol. 113, pp. 167-170, Mar. 1, 2016.

Wang, Fei, Gao, Xiang, and Liu, Sheng, "Effects of Different Temperature Profile on Solder Joints in PBGA Packages," 2013 14th International Conference on Electronic Packaging Technology , Dalian, China, Aug. 11-14, 2013, pp. 994-996.

Wang, Feng-Jiang, Gao, Feng, Ma, Xin, and Qian, Yi-Yu, "Depressing Effect of 0.2wt.%Zn Addition into Sn-3.0Ag-0.5Cu Solder Alloy on the Intermetallic Growth with Cu Substrate during Isothermal Aging," Journal of Electronic Materials, vol. 35 no. 10, pp. 1818-1824, Oct. 2006.

Wang, Fengjiang, Ma, Xin, and Qian, Yiyu, "Improvement of microstructure and interface structure of eutectic Sn-0.7Cu solder with small amount of Zn addition," Scripta Materialia, vol. 53 no. 6, pp. 699-702, Sept. 2005.

Wang, Feng-Jiang, Yu, Zhi-Shui, and Qi, Kai, "Intermetallic compound formation at Sn-3.0Ag-0.5Cu-1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions," Journal of Alloys and Compounds, vol. 438 no. 1-2, pp. 110-115, July 12, 2007.

Wang, Feng-Jiang, Ma, Xin, and Qian, Yi-Yu, "Rate-dependent indentation behavior of solder alloys," Journal of Materials Science, vol. 40 no. 8, pp. 1923-1928, Apr. 2005.

Wang, Fengjiang, Li, Dongyang, Wang, Jiheng, Wang, Xiaojing, and Dong, Changhui, "Comparative study on the wettability and interfacial structure in Sn-xZn/Cu and Sn/Cu-xZn system," Journal of Materials Science: Materials in Electronics, vol. 28 no. 2, pp. 1631-1643, Jan. 2017.

Wang, Fengjiang, Zhou, Lili, Zhang, Zhijie, Wang, Jiheng, Wang, Xiaojing, and Wu, Mingfang, "Effect of Sn-Ag-Cu on the Improvement of Electromigration Behavior in Sn-58Bi Solder Joint," Journal of Electronic Materials, vol. 46 no. 10, pp. 6204-6213, Oct. 2017.

Wang, Fengjiang, Xiao, Zhiping, and Zhou, Lili, "Electromigration behavior of liquid Sn-58Bi/Cu joints through minor Zn alloying substrates," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 286-290.

Wang, Fengjiang, Zhou, Lili, and Wang, Xiaojing, "Electromigration behavior of Sn3.0Ag0.5Cu/Sn58Bi structural composite solder interconnect," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 268-272.

Wang, Fengjiang, Liu, Luting, Li, Dongyang, and Wu, Mingfang, "Electromigration behaviors in Sn-58Bi solder joints under different current densities and temperatures," Journal of Materials Science: Materials in Electronics, vol. 29 no. 24, pp. 21157-21169, Dec. 2018.

Wang, Fengjiang, Zhou, Lili, Wang, JiHeng, and Wang, Xiaojing, "Electromigration-induced morphology and microstructure changes in Sn58Bi/Sn3.0Ag0.5Cu compositional solder interconnect," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 1450-1453.

Wang, Fengjiang, Ma, Xin, and Qian, Yiyu, "Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu Pb-free Ball Grid Array (BGA) Solder Joint," Materials Science Forum, vol. 502, pp. 399-404, Dec. 2005.

Wang, Fengjiang, Chen, Hong, Huang, Ying, and Yan, Chao, "Interfacial behavior and joint strength of Sn-Bi solder with solid solution compositions," Journal of Materials Science: Materials in Electronics , vol. 29 no. 13, pp. 11409-11420, July 2018.

Wang, Fengjiang, Li, Dongyang, Tian, Shuang, Zhang, Zhijie, Wang, Jiheng, and Yan, Chao, "Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration," Microelectronics Reliability , vol. 73, pp. 106-115, June 2017.

Wang, Fengjiang, Liu, Luting, Wu, Mingfang, and Li, Dongyang, "Interfacial evolution in Sn-58Bi solder joints during liquid electromigration," Journal of Materials Science: Materials in Electronics, vol. 29 no. 11, pp. 8895-8903, June 2018.

Wang, Fengjiang, Huang, Ying, and Du, Chengchao, "Mechanical properties of SnBi-SnAgCu composition mixed solder joints using bending test," Materials Science and Engineering: A, vol. 668, pp. 224-233, June 21, 2016.

Wang, Fengjiang, O'Keefe, Matthew, and Brinkmeyer, Brandon, "Microstructural evolution and tensile properties of Sn-Ag-Cu mixed with Sn-Pb solder alloys," Journal of Alloys and Compounds, vol. 477 no. 1-2, pp. 267-273, May 27, 2009.

Wang, Fengjiang, Chen, Hong, Huang, Ying, Liu, Luting, and Zhang, Zhijie, "Recent progress on the development of Sn-Bi based low-temperature Pb-free solders," Journal of Materials Science: Materials in Electronics, vol. 30 no. 4, pp. 3222-3243, Feb. 2019.

Wang, Fengjiang, Tang, Dayun, Wen, Huabing, and Wu, Mingfang, "Reliability of Pb-free BGA solder joints under random vibration," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1150-1154.

Wang, Fengjiang, Li, Dongyang, and Huang, Ying, "The influence of adding different Sn-based solder coating into Sn-58Bi/Cu interface on the growth of intermetallic compound," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 266-270.

Wang, Fengjiang, Huang, Ying, and Li, Dongyang, "The shear strength and fracture mode of Sn-xBi (x=0, 2.5, 5, 15)/Cu solder joints," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 253-257.

Wang, Fengjiang, Ding, Yu, Liu, Luting, Huang, Ying, and Wu, Mingfang, "Wettability, Interfacial Behavior and Joint Properties of Sn-15Bi Solder," Journal of Electronic Materials, vol. 48 no. 10, pp. 6835-6848, Oct. 2019.

Wang, Fenying, Sun, Wei, Gao, Yajun, Liu, Yunhong, Zhao, Jianwei, and Sun, Changqing, "Investigation on the most probable breaking behaviors of copper nanowires with the dependence of temperature," Computational Materials Science , vol. 67 no. x, pp. 182-187, 2013.

Wang, Fuliang, Li, Junhui, and Han, Lei, "High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without Flux," Journal of Electronic Packaging, vol. 136 no. 3, pp. 031001-1-031001-4, Sept. 2014.

Wang, G. J., Lin, Y. C., and Lin, G. S., "A novel contact resistance model of anisotropic conductive film for FPD packaging," Microsystem Technologies, vol. 13 no. 11-12, pp. 1477-1482, July 2007.

Wang, G. Z., Cheng, Z. N., Becker, K., and Wilde, J., "Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys," Journal of Electronic Packaging, vol. 123 no. 3, pp. 247-253, Sept. 2001.

Wang, Gang, Yin, Li-Meng, Yao, Zong-Xiang, and Wang, Jin-Zhao, "Effects of Thermal Aging and Electromigration on Tensile Strength of SnAgCu Solder Joints with Different Volume," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 753-756.

Wang, H.-M., and O'Keefe, T. J., "Modification of Anomalous Deposition in Zn-Ni Alloys Using Antimony Additives," Plating & Surface Finishing, vol. 83 no. 5, pp. 149-153, May 1996.

Wang, Hailing, Wei, Wenqi, Wang, Jianhuan, Feng, Qi, Wu, Shiyao, Yang, Huaixin, Xu, Xiulai, Wang, Ting, and Zhang, Jianjun, "Catalyst-free growth of lateral InAs nanowires," Journal of Crystal Growth, vol. 498, pp. 209-213, Sept. 15, 2018.

Wang, Haiyan, and Pritzker, Mark, "Effect of low concentrations of Pb2+ on Sn electrodeposition in methyl sulphonic acid solutions," Electrochimica Acta, vol. 53 no. 5, pp. 2430-2440, Jan. 2008.

Wang, Han, Song, Xiping, You, Li, and Zhang, Bei, "Influence factors on the formation of magnesium nanowires prepared by physical vapor deposition," Journal of Crystal Growth, vol. 432, pp. 78-82, Dec. 15, 2015.

Wang, Han, Song, Xiping, You, Li, and Zhang, Bei, "Oriented growth of magnesium nanowires by physical vapor deposition in high vacuum," Scripta Materialia, vol. 108, pp. 68-71, Nov. 2015.

Wang, Haozhong, Hu, Xiaowu, Li, Qinglin, and Qu, Min, "Effect of flux doped with Cu6Sn5 nanoparticles on the interfacial reaction of lead-free solder joints," Journal of Materials Science: Materials in Electronics, vol. 30 no. 12, pp. 11552-11562, June 2019.

Wang, He, and Xue, Song-bai, "Effect of Ag on the properties of solders and brazing filler metals," Journal of Materials Science: Materials in Electronics, vol. 27 no. 1, pp. 1-13, Jan. 2016.

Wang, He, Xue, Songbai, and Wang, JianXin, "Study on the microstructure and properties of low-Ag Sn-0.3Ag-0.7Cu-0.5Ga solder alloys bearing Pr," Journal of Materials Science: Materials in Electronics, vol. 28 no. 11, pp. 8246-8254, June 2017.

Wang, Hongmei, Lu, Lin, Liu, Xiaolong, and Gao, Feng, "A method based on the morphology of lead-free solder powder adhesive particle segmentation," Advanced Materials Research, vol. 690-693, pp. 2681-2685, May 2013.

Wang, Hongqin, Zhao, Hui, Sekulic, Dusan P., and Qian, Yiyu, "A Comparative Study of Reactive Wetting of Lead and Lead-Free Solders on Cu and (Cu6Sn5/Cu3Sn)/Cu Substrates," Journal of Electronic Materials , vol. 37 no. 10, pp. 1640-1647, Oct. 2008.

Wang, Hongqin, Wang, Fengjiang, Gao, Feng, Ma, Xin, and Qian, Yiyu, "Reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrate," Journal of Alloys and Compounds, vol. 433 no. 1-2, pp. 302-305, May 16, 2007.

Wang, Hongqin, Gao, Feng, Ma, Xin, and Qian, Yiyu, "Reactive wetting of solders on Cu and Cu6Sn5/Cu3Sn/Cu substrates using wetting balance," Scripta Materialia, vol. 55 no. 9, pp. 823-826, Nov. 2006.

Wang, Hongqin, Xiao, Hui, Liang, Chaohui, Lu, Tao, and Tian, Wanchun, "Research on the risk identification of mechanical stress damage during electronic assembly process," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 98-104.

Wang, Hongqin, Wang, Fengjiang, Ma, Xin, Liu, Jun, and Qian, Yiyu, "Study on reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrate," 2005 6th International Conference on Electronic Packaging Technology , Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Wang, Hongqin, Wan, Zhonghua, Luo, Daojun, and Liu, Zilian, "The effect of low-melting point alloy re-melting process on the quality of mixed BGA joint and its reliability," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 447-451.

Wang, Hongqin, He, Guanghui, and Luo. Daojun, "The Quantitative Assessment of Mixed BGA Joint with the Elimination of Low-Melting Point Alloy Re-Melting Process," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 336-340.

Wang, Hongqin, Gong, Qingqiu, Wang, Dawei, Li, Wei, Xu, Ziqiang, and Cai, Jinbao, "Thermal Fitigure Life Prediction on PBGA Solder Joints of Typical Pad Finish/Solder Combination," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Wang, Hongwei, Fang, Jianshi, Xu, Zhenqin, and Zhang, Xiaopeng, "Improvement of Ga and Zn alloyed Sn-0.7Cu solder alloys and joints," Journal of Materials Science: Materials in Electronics, vol. 26 no. 6, pp. 3589-3595, June 2015.

Wang, Hongxuan, Lu, Tao, Yi, Danqing, and Wang, Bin, "Microstructure refinement, characterization of tensile behavior and aging resistance of Zr-modified SAC105 solder alloy," Journal of Materials Science: Materials in Electronics, vol. 30 no. 12, pp. 11429-11439, June 2019.

Wang, Hongyu, and Fischman, Gary S., "Role of liquid droplet surface diffusion in the vapor-liquid-solid whisker growth mechanism," Journal of Applied Physics, vol. 76 no. 3, pp. 1557-1562, Aug. 1, 1994.

Wang, Huaishan, Gan, Guisheng, Meng, Guoqing, Du, Changhua, and Yang, Donghua, "Wetting characteristics and liquid-solid state reaction of Co-P films for low silver Sn-0.45Ag-0.68Cu-Ni-P solder," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 328-332.

Wang, Huan, Liu, Yongchang, Gao, Huixia, and Gao, Zhiming, "Effects of aging on microstructure evolution and mechanical properties of high-temperature Zn-4Al-3Mg solder," Soldering & Surface Mount Technology, vol. 26 no. 4, pp. xx-xx, 2014.

Wang, Huan, Gao, Zhiming, Liu, Yongchang, Li, Chong, Ma, Zongqing, and Yu, Liming, "Evaluation of cooling rate on electrochemical behavior of Sn-0.3Ag-0.9Zn solder alloy in 3.5 wt% NaCl solution," Journal of Materials Science: Materials in Electronics, vol. 26 no. 1, pp. 11-22, Jan. 2015.

Wang, Huan, Hu, Anmin, Li, Chengkang Chang Ming, and Mao, Dali, "Oxidation Behavior and Intermetallic Compounds Growth of Sn-Ag-Bi-Cr Lead-free Solder," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Wang, Huan, Hu, Anmin, Wang, Lihong, Zhao, Li, Zhu, Ping, Chang, Chengkang, and Li, Ming, "Properties and Reliability of Sn-Pb and Lead-free Mixed Soldering," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Wang, Huazhi, Xu, Yong, and Liu, Ying, "Novel Modified Epoxy Adhesive for FCCL with High Thermal Resistance," PCB007, May 15, 2008.

Wang, Hui, Gu, Guo-hua, and Qi, Yun-feng, "Crushing performance and resource characteristic of printed circuit board scrap," Journal of Central South University of Technology, vol. 12 no. 5, pp. 552-555, Oct. 2005.

Wang, Hui, Xue, Songbai, Zhao, Feng, and Chen, Wenxue, "Effects of Ga, Al, Ag, and Ce multi-additions on the properties of Sn-9Zn lead-free solder," Journal of Materials Science: Materials in Electronics, vol. 20 no. 12, pp. 1239-1246, Dec. 2009.

Wang, Hui, Xue, Songbai, Zhao, Feng, and Chen, Wenxue, "Effects of Ga, Al, Ag, and Ce multi-additions on the properties of Sn-9Zn lead-free solder," Journal of Materials Science: Materials in Electronics, vol. 21 no. 2, pp. 111-119, Feb. 2010.

Wang, Huigai, Zhang, Keke, and Zhang, Meng, "Fabrication and properties of Ni-modified graphene nanosheets reinforced Sn-Ag-Cu composite solder," Journal of Alloys and Compounds, vol. 781, pp. 761-772, Apr. 15, 2019.

Wang, I-Lin, and Yang, Wen-Cheng, "Fast Heuristics for Designing Integrated E-Waste Reverse Logistics Networks," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 2, pp. 147-154, Apr. 2007.

Wang, J., Leinenbach, C., Liu, H. S., Liu, L. B., Roth, M., and Jin, Z. P., "Diffusion and Atomic Mobilities in fcc Ni-Sn Alloys," Journal of Phase Equilibria and Diffusion, vol. 31 no. 1, pp. 28-33, Feb. 2010.

Wang, J., Zhang, L. G., Liu, H. S., Liu, L. B., and Jin, Z. P., "Interfacial reaction between Sn-Ag alloys and Ni substrate," Journal of Alloys and Compounds, vol. 455 no. 1-2, pp. 159-163, May 8, 2008.

Wang, J., Liu, H. S., Liu, L. B., and Jin, Z.P., "Interfacial Reaction between Sn-Bi Alloy and Ni Substrate," Journal of Electronic Materials, vol. 35 no. 10, pp. 1842-1847, Oct. 2006.

Wang, J. Y., Tang, Y. K., Yeh, C. Y., Chang, P. J., Lin, Y. X., Lin, E. J., Wu, C. Y., Zhuang, W. X., and Liu, C. Y., "Kinetics of Ni solid-state dissolution in Sn and Sn3.5Ag alloys," Journal of Alloys and Compounds, vol. 797, pp. 684-691, Aug. 15, 2019.

Wang, J., Meng, F. G., Liu, H. S., Liu, L. B., and Jin, Z. P., "Thermodynamic Modeling of the Au-Bi-Sb Ternary System," Journal of Electronic Materials, vol. 36 no. 5, pp. 568-577, May 2007.

Wang, J., Leinenbach, C., and Roth, M., "Thermodynamic modeling of the Au-Ge-Sn ternary system," Journal of Alloys and Compounds, vol. 481 no. 1-2, pp. 830-836, July 29, 2009.

Wang, Jason, Seah, S. K. W., Wong, E. H., and Cadge, D., "Fracture Mechanics Study of Fatigue Crack Growth in Solder Joints under Drop Impact," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1601-1605.

Wang, Jia, An, Bing, He, Jingqiang, Wu, Fengshun, and Wu, Yiping, "Preparation of Conductive Particles by Electroless Nickel Plating on Polystyrene Microsphere," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Wang, Jian-pei, Lu, Liang-kun, Huang, Chun-yue, and Wei, He, "Thermal Stress Analysis of BGA Solder Joint Power Load Based on COMSOL," 2018 19th International Conference on Electronic Packaging Technology , Shanghai, China, Aug. 8-11, 2018, pp. 104-108.

Wang, Jian-xin, Xue, Song-bai, Fang, Dian-song, Ju, Jin-long, Han, Zong-jie, and Yao, Li-hua, "Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad," Transactions of Nonferrous Metals Society of China, vol. 16 no. 6, pp. 1374-1378, Dec. 2006.

Wang, Jian-Xin, Xue, Song-Bai, Han, Zong-Jie, Yu, Sheng-Lin, Chen, Yan, Shi, Yi-Ping, and Wang, Hui, "Effects of rare earth Ce on microstructures, solderability of Sn-Ag-Cu and Sn-Cu-Ni solders as well as mechanical properties of soldered joints," Journal of Alloys and Compounds, vol. 467 no. 1-2, pp. 219-226, Jan. 7, 2009.

Wang, Jianbo, and Xu, Zhenming, "Disposing and Recycling Waste Printed Circuit Boards: Disconnecting, Resource Recovery, and Pollution Control," Environmental Science & Technology , vol. 49 no. 2, pp. 721-733, Jan. 20, 2015.

Wang, Jianbo, and Xu, Zhenming, "Environmental friendly technology for aluminum electrolytic capacitors recycling from waste printed circuit boards," Journal of Hazardous Materials, vol. 326, pp. 1-9, Mar. 15, 2017.

Wang, Jianhao, Xue, Songbai, Zhang, Peng, Wang, Ziyi, and Zhai, Peizhuo, "Effect of extreme thermal shocking on the reliability of Sn50Pb49Sb1/Cu solder joint," Journal of Materials Science: Materials in Electronics , vol. 31 no. 2, pp. 1421-1429, Jan. 2020.

Wang, Jianhao, Xue, Songbai, Zhang, Peng, Zhai, Peizhuo, and Tao, Yu, "The reliability of lead-free solder joint subjected to special environment: a review," Journal of Materials Science: Materials in Electronics, vol. 30 no. 10, pp. 9065-9086, May 2019.

Wang, Jianhui, Wen, Long, Zhou, Jianwei, and Lee, Jaisung, "Investigation of Package Warpage Effect on TC Solder Joint Reliability," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 1201-1205.

Wang, Jianhui, Wen, Long, Zhou, Jianwei, and Chung, Myungkee, "Mechanical Properties and Joint Reliability Improvement of Sn-Bi alloy," 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 7-9, 2011, pp. 492-496.

Wang, Jianqiang, Bi, Kedong, and Chen, Yunfei, "Molecular dynamic simulations of contact thermal resistance between two individual silicon nanowires," Key Engineering Materials, vol. 483, pp. 663-667, June 2011.

Wang, JianXin, and Nishikawa, Hiroshi, "Impact strength of Sn-3.0Ag-0.5Cu solder bumps during isothermal aging," Microelectronics Reliability, vol. 54 no. 8, pp. 1583-1591, Aug. 2014.

Wang, Jifan, Ye, Yuming, Zhao, Junying, Liu, Sang, Tu, Yunhua, Li, Song, and Song, Zhiwei, "Assessment of LF Solder Joint Reliability by Four Point Cyclic Bending," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 572-576.

Wang, Jin, Wang, Qian, Hou, Xinnan, Du, Ke, Zhao, Lixin, and Cai, Jian, "Au-Rich/Sn-Bi interconnection in Chip-on-Module package," 2019 IEEE 69th Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2019, pp. 69-75.

Wang, Jin-Yi, Lin, Chih-Fan, and Chen, Chih-Ming, "Interfacial Reactions and Mechanical Properties of Bi-x wt.%Sn/Cu Joints (x = 2, 5, 10)." Journal of Electronic Materials, vol. 41 no. 12, pp. 3303-3308, Dec. 2012.

Wang, Jin-Yi, Chen, Chih-Ming, and Yen, Yee-Wen, "Interfacial Reactions of High-Bi Alloys on Various Substrates," Journal of Electronic Materials, vol. 43 no. 1, pp. 155-165, Jan. 2014.

Wang, Jin-Yi, Lin, Chih-Fan, and Chen, Chih-Ming, "Retarding the Cu5Zn8 phase fracture at the Sn-9 wt.% Zn/Cu interface," Scripta Materialia, vol. 64 no. 7, pp. 633-636, Apr. 2011.

Wang, Jing, Chen, Guang, Forbes, Henry, Christopoulos, Katerina, Liu, Changqing, Sun, Liangquan, and Shang, Panju, "An Investigation into the Effect of Dry Bake on the Solderability Degradation of Electrodeposited Tin Finishes," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 366-371.

Wang, Jing, Ashworth, Mark A., and Wilcox, Geoffrey D., "An Investigation Into the Role of Lead as a Suppressant for Tin Whisker Growth in Electronics," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 4 no. 4, pp. 727-740, Apr. 2014.

Wang, Jing, Chen, Guang, Sun, Fulong, Zhou, Zhaoxia, Liu, Zhi-Quan, and Liu, Changqing, "Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing," Corrosion Science, vol. 139, pp. 383-394, July 15, 2018.

Wang, Jing, "Effect of Temperature on Elasticity of Silicon Nanowires," Key Engineering Materials, vol. 483, pp. 526-531, June 2011.

Wang, Jing-han, and Li, De-xiou, "Computer Simulation of the Condensation Process on Top of a Growing Whisker," Chinese Physics Letters, vol. 2 no.7, pp. 289-292, July 1985.

Wang, Jingwei, Bai, Jianfeng, Xu, Jinqiu, and Liang, Bo, "Bioleaching of metals from printed wire boards by Acidithiobacillus ferrooxidans and Acidithiobacillus thiooxidans and their mixture," Journal of Hazardous Materials, vol. 172 no. 2-3, pp. 1100-1105, Dec. 30, 2009.

Wang, Jinlin, "Wetting and Spreading Studies for Lead Free Solder and Flux Materials in Flip Chip Packages," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 484-489.

Wang, Jingze, Mao, Dongxin, Chen, Hongtao, Zhang, Xiaohua, Shi, Lei, and Wang, Jianbing, "Effect of Zinc Addition on the Evolution of Interfacial Intermetallic Phases at Near-Eutectic 50In-50Sn/Cu Interfaces," Journal of Electronic Materials, vol. 49 no. 2, pp. 1512-1517, Feb. 2020.

Wang, Jingze, Mao, Dongxin, Shi, Lei, Zhang, Wei, and Zhang, Xiaohua, "Effect of Zinc Addition on the Microstructure, Thermal and Mechanical Properties of Indium-Tin-xZinc Alloys," Journal of Electronic Materials , vol. 48 no. 2, pp. 817-826, Feb. 2019.

Wang, Jingze, Mao, Dongxin, Meng, Guizhi, Shi, Lei, Chen, Hongtao, Xia, Ruihan, and Li, Manning, "Electromigration Mechanism of Indium-44Tin-6Zinc Alloy," Journal of Electronic Materials, vol. 48 no. 10, pp. 6849-6856, Oct. 2019.

Wang, Jingze, Mao, Dongxin, Shi, Lei, Chen, Hongtao, Li, Feng, Xia, Ruihan, and Li, Manning, "Phase separation mechanism and property changes in In-41Sn-9Zn under the current stressing," Journal of Materials Science: Materials in Electronics, vol. 30 no. 12, pp. 11676-11681, June 2019.

Wang, Jinlin, "Rheology and Wetting Characterizations of Flux and Solder Paste for BGA Packages," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Wang, Jirui, Gao, Fan, and Gu, Zhiyong, "Infrared (IR) Soldering of Metallic Nanowires," 2017 IEEE 67th Electronic Components and Technology Conference, Orlando, FL, May 30-June 2, 2017, pp. 2175-2180.

Wang, Jizhuang, Xiong, Ze, Zhan, Xiaojun, Dai, Baohu, Zheng, Jing, Liu, Jun, and Tang, Jinyao, "A Silicon Nanowire as a Spectrally Tunable Light-Driven Nanomotor," Advanced Materials, vol. 29 no. 30, pp. 1701451-1-1701451-7, Aug. 11, 2017.

Wang, Jo-Mei, Wang, Kai-Jheng, and Duh, Jenq-Gong, "Cu Substrates with Different Grain Sizes," Journal of Electronic Materials, vol. 40 no. 7, pp. 1549-1555, July 2011.

Wang, Jun, Li, Jinshan, Hu, Rui, Kou, Hongchao, and Beaugnon, Eric, "Evidence for the structure transition in a liquid Co-Sn alloy by in-situ magnetization measurement," Materials Letters, vol. 145, pp. 261-263, Apr. 15, 2015.

Wang, Jun, Wei, Hongmei, He, Peng, Lin, Tiesong, and Lu, Fengjiao, "Microstructure and Mechanical Properties of Tin-Bismuth Solder Reinforced by Aluminum Borate Whiskers," Journal of Electronic Materials, vol. 44 no. 10, pp. 3872-3879, Oct. 2015.

Wang, Jun, Lu, Chunsheng, Wang, Qi, Xiao, Pan, Ke, Fujiu, Bai, Yilong, Shen, Yaogen, Wang, Yanbo, Chen, Bin, Liao, Xiaozhou, and Gao, Huajian, "Self-healing in fractured GaAs nanowires," Acta Materialia, vol. 60 no. 15, pp. 5593-5600, Sept. 2012.

Wang, Juncheng, Du, Gang, Lun, Zhiyuan, Wei, Kangliang, Zeng, Lang, and Liu, Xiaoyan, "Performance Investigation on the Reconfigurable Si Nanowire Schottky Barrier Transistors," 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology, X'an, China, Oct. 29-Nov. 1, 2012, pp. xx-xx.

Wang, Jundong, and Yao, Yao, "Effects of aging temperature on fatigue life of Sn-3.0Ag-0.5Cu solder joints," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 421-425.

Wang, Junjie, Wei, Xicheng, Zhu, Wenqi, Wu, Jian, and Wu, Nianzu, "Study on Low Silver Sn-Ag-Cu-P Alloy for Wave Soldering," 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Suzhou, China, July 15-19, 2013, pp. 485-489.

Wang, Junjun, and Chen, Ming, "Recycling of Electronic Control Units from End-of-Life Vehicles in China," JOM, vol. 63 no. 8, pp. 42-47, Aug. 2011.

Wang, Junjun, and Wu, Yongming, "Simulating Production Lines of Recycling WEEE Products in eM-Plant," Advanced Materials Research, vol. 97-101, pp. 2287-2290.

Wang, Junqiang, Wang, Qian, Wu, Zijian, Wang, Dejun, and Cai, Jian, "Solid-State-Diffusion Bonding for Wafer-Level Fine-Pitch Cu/Sn/Cu Interconnect in 3-D Integration," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 7 no. 1, pp. 19-26, Jan. 2017.

Wang, K., Pickering, H. W., and Weil, K. G., "Corrosion Behavior Of Electroplated Tin-Zinc Coatings," Plating & Surface Finishing, vol. 91 no. 1, pp. 34-37, Jan. 2004.

Wang, K., Pickering, H. W., and Weil, K. G., "Corrosion Resistance of Electroplated Sn-Zn Alloy & Its Improvement," Plating & Surface Finishing, vol. 89 no. 6, pp. 80-83, June 2002.

Wang, K., Pickering, H. W., and Weil, K. G., "EQCM studies of the electrodeposition and corrosion of tin-zinc coatings," Electrochimica Acta, vol. 46 no. 24-25, pp. 3835-3840, Aug. 15, 2001.

Wang, K., Aasmundtveit, K., and Jakobsen, H., "Surface Evolution and Bonding Properties of Electroplated Au/Sn/Au," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 1131-1133.

Wang, K., Pickering, H. W., and Weil, K. G., "Tin-Zinc Alloy Electroplating and Its Corrosion Behavior," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Wang, Kai, Yao, Kui, and Chua, Soo Jin, "Titanium diffusion and residual stress of platinum thin films on Ti/SiO2/Si substrate," Journal of Applied Physics, vol. 98 no. 1, pp. 013538-1-013538-5, July 1, 2005.

Wang, Kai-Jheng, Tsai, Yan-Zuo, Duh, Jenq-Gong, and Shih, Toung-Yi, "Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization," Journal of Materials Research, vol. 24 no. 8, pp. 2638-2643, Aug. 2009.

Wang, Kai-Jheng, Duh, Jenq-Gong, Sykes, Bob, and Schade, Dirk, "Impact Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization After Aging at 150°C," Journal of Electronic Materials , vol. 39 no. 12, pp. 2558-2563, Dec. 2010.

Wang, Kai-Jheng, Lin, Yung-Chi, Duh, Jenq-Gong, Cheng, Ching-Yuan, and Lee, Jey-Jau, "In situ investigation of the interfacial reaction in Sn/Cu system by synchrotron radiation," Journal of Materials Research, vol. 25 no. 5, pp. 972-975, May 2010.

Wang, Kai Jheng, and Duh, Jenq Gong, "Interfacial Reaction and Failure Mechanism for SnAgCu Solder Bump with Ni(V)/Cu Under Bump Metallization During Aging," International Conference on Electronic Packaging Technology & High Density Packaging , Shanghai, China, July 28-31, 2008, pp. xx-xx.

Wang, Kai-Jheng, Duh, Jenq-Gong, and Tsai, Su-Yueh, "Morphological and Microstructural Evolution of Sn-patch in SnAgCu Solder with Ni(V)/Cu under Bump Metallization," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 558-561.

Wang, Kai-Jheng, and Duh, Jenq-Gong, "Shear and Pull Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Underbump Metallization During Aging," Journal of Electronic Materials, vol. 38 no. 12, pp. 2534-2542, Dec. 2009.

Wang, Kai-Jheng, and Duh, Jenq-Gong, "Suppressing Sn-Patch Growth in Ti/Ni(V)/Cu Under Bump Metallization with Sn-Ag-Cu Solder After Reflow and Aging," Journal of Electronic Materials , vol. 41 no. 4, pp. 757-762, Apr. 2012.

Wang, Kaimin, Chen, Bingjie, and Yao, Yao, "A rate-dependent constitutive model considering effects of temperature cycles for lead-free solders," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 755-758.

Wang, Kuang-Kuo, Gan, Dershin, and Hsieh, Ker-Chang, "Orientation relationships, interfaces, and microstructure of n-Cu6Sn5 formed in the early-stage reaction between Cu and molten Sn," Thin Solid Films , vol. 519 no. 4, pp. 1380-1386, Dec. 1, 2010.

Wang, Kuang-Kuo, Gan, Dershin, Hsieh, Ker-Chang, and Chiou, Shi-Yung, "The microstructure of n'-Cu6Sn5 and its orientation relationships with Cu in the early stage of growth," Thin Solid Films, vol. 518 no. 6, pp. 1667-1674, Jan. 1, 2010,

Wang, Kuang-Kuo, Chin, Pei-Ju, Yeh, Cheng-Fong, and Gan, Dershin, "The orientation relationships and interfaces of Ag3Sn and Ag4Sn on Ag and a discussion of their formation sequence," Thin Solid Films, vol. xx, pp. xx-xx, xxxx.

Wang, Kuang-Kuo, Gan, Dershin, and Hsieh, Ker-Chang, "The orientation relationships of the Cu3Sn/Cu interfaces and a discussion of the formation sequence of Cu3Sn and Cu6Sn5," Thin Solid Films, vol. 562, pp. 398-404, July 1, 2014.

Wang, L., Yu, D. Q., Han, S. Q., Ma, H. T., and Xie, H. P., "The evaluation of the new composite lead free solders with the novel fabricating process," 2004 International Conference on Business of Electronic Product Reliability and Liability, Shanghai, China, Apr. 27-30, 2004, pp. 50-56.

Wang, Lei, Zhao, Zhenqing, Wang, Qian, and Lee, Jaisung, "Characterize the Microstructure and Reliability of Ultra Fine Pitch BGA Joints," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 674-678.

Wang, Lei, Wang, Chun-qing, Zhao, Zhen-qing, and Huang, Yi, "Interfacial Characteristics of Sn3.5Ag Solder on Copper after Nd:YAG Laser Surface Irradiation," Proceedings of 2005 International Conference on Asian Green Electronics, Shang Hai, China, Mar. 15-18, 2005, pp. 202-205.

Wang, Lei, Xie, Xiaoqiang, and Lee, Taekoo, "Interfacial Reaction and Joint Reliability of Sn-Ag-Cu/OSP-Cu Pad SMT Solder Joint," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Wang, Lei, Zhao, Zhenqing, Liu, Jiangtao, and Lee, Jaisung, "Replace Ball Attach by Developing Substrate Solder Bumping for 0.5mm Pitch FBGA," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 229-234.

Wang, Li-jun, Yang, Can, Wang, Zi, Liu, Xiao-fei, and Wang, Xiao-ping, "Copper Nanowires Preparation and Field Electron Emission Properties," Key Engineering Materials, vol. 537, pp. 298-301, Jan. 2013.

Wang, Lianwen, and Xian, Ai-Ping, "Density Measurement of Sn-40Pb, Sn-57Bi, and Sn-9Zn by Indirect Archimedean Method," Journal of Electronic Materials, vol. 34 no. 11, pp. 1414-1419, Nov. 2005.

Wang, Lifeng, Shen, Xuwei, Sun, Fenglian, and Liu, Yang, "Effects of Ni addition on Microstructure and the Shear Strength of Sn-3.0Ag-0.5Cu/Cu Solders Joints," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Wang, Lifeng, Wang, Jia, Liu, Xue, and Liu, Xiaojing, "Morphology and Growth Mechanisms of SAC305-xNi/pad joints Intermetallic Compounds," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 181-184.

Wang, Lifeng, Liu, Meina, Liu, Yang, and Sun, Fenglian, "Nanoindentation for measuring mechanical properties of Sn-Ag-Cu-RE BGA solders joints," 2010 International Forum on Strategic Technology , Ulsan, South Korea, Oct. 13-15, 2010, pp. 169-172.

Wang, Lifeng, Liu, Haitao, Dai, Wenqin, and Zhang, Pule, "Step Nano-mechanical Behavior of SnAgCu Solder Joints under nano-indentation method," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 674-678.

Wang, Lifeng, Lv, Ye, Dai, Hongbin, Zhao, Zhili, and Liu, Meina, "Study on the meso-mechanical characteristics of SAC0307-xCe micro-solder joints," 2012 7th International Forum on Strategic Technology, Tomsk, Russia, Sept. 18-21, 2012, pp. xx-xx.

Wang, Lifeng, Zhou, Jia, Liu, Yingjie, Ge, Qi, Zhang, Yuanjian, and Dai, Wenqin, "The Finite Element Simulation and Nanoindentation Methods for the Study of Mechanical Behavior of Lead-free Solder Joints," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 231-234.

Wang, Lifeng, Sun, Fenglian, Liang, Ying, and Yang, Miaosen, "The influence of element-Ni on interfacial reactions between lead-free Sn-Ag-Cu and Cu substrate," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Wang, Ling, Xu, Hongbo, Yang, Ming, Li, Mingyu, and Fu, Yonggao, "Dramatic Morphological Change of Interfacial Prism-type Cu6Sn5 in the Sn3.5Ag/Cu Joints Reflowed by Induction Heating," International Conference on Electronic Packaging Technology & High Density Packaging , Beijing, China, Aug. 10-13, 2009, pp. 843-846.

Wang, Ling, Wang, Hongqin, Wan, Chao, Wang, Pengcheng, Li, Mingyu, Du, Bin, Deng, Meiling, and He, Lijiao, "Effect of different latent curing agents on the performance of isotropy conductive adhesives and its application in LED," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 446-449.

Wang, Ling, Wan, Chao, Fu, Yonggao, Chen, Hongtao, Liu, Xiaojian, and Li, Mingyu, "Study on the Effects of Adipic Acid on Properties of Dicyandiamide-Cured Electrically Conductive Adhesive and the Interaction Mechanism," Journal of Electronic Materials, vol. 43 no. 1, pp. 132-136, Jan. 2014.

Wang, Lingling, Sun, Fenglian, Liu, Yang, and Wang, Lifeng, "Effect of Ni Addition on the Sn-0.3Ag-0.7Cu Solder Joints," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 830-833.

Wang, Liujue, Xue, Songbai, Liu, Han, and Wang, Jianhao, "Effect of oxygen content on reliability of Au-20Sn solder joints for the chip-level package," Journal of Materials Science: Materials in Electronics, vol. 31 no. 2, pp. 1411-1420, Jan. 2020.

Wang, Mark, and Ma, Michael C. Y., "Freedom from Halogen: The IPC/Intel-FOXCONN Approach," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Wang, Miaocao, Xu, Ling, Zhou, Yang, and Liu, Sheng, "Effect of Die Size and Die Tilt on Solder Reliability under Thermal Cycling," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 1984-1989.

Wang, Min, Zhao, Zhili, Liu, Xin, and Zhang, Shiyong, "Analysis of Microstructure and Interface Morphology of Sn- based Solder / Cu during Pulsed Hot - pressing Welding," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 649-654.

Wang, Mingna, Wang, Jianqiu, and Ke, Wei, "Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints," Microelectronics Reliability, vol. 73, pp. 69-75, June 2017.

Wang, Mingna, Wang, Jianqiu, and Ke, Wei, "Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition," Journal of Materials Science: Materials in Electronics, vol. 25 no. 3, pp. 1228-1236, Mar. 2014.

Wang, Mingna, Wang, Jianqiu, Feng, Hao, and Ke, Wei, "Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition," Corrosion Science , vol. 63, pp. 20-28, Oct. 2012.

Wang, Mingna, Wang, Jianqiu, and Ke, Wei, "Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder," Journal of Materials Science: Materials in Electronics, vol. 25 no. 12, pp. 5269-5276, Dec. 2014.

Wang, Mingna, Wang, Jianqiu, Feng, Hao, and Ke, Wei, "Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder," Journal of Materials Science: Materials in Electronics, vol. 23 no. 1, pp. 148-155, Jan. 2012.

Wang, Mingna, Wang, Jianqiu, Feng, Hao, and Ke, Wei, "In-situ observation of fracture behavior of Sn-3.0Ag-0.5Cu lead-free solder during three-point bending tests in ESEM," Materials Science and Engineering: A, vol. 558, pp. 649-655, Dec. 15, 2012.

Wang, Mingzhang, and Mohapatra, Satish C., "Electrochemical Corrosion Study of Tin-based Solders in Potassium Formate Brines for Heat Transfer Applications," Journal of Materials Engineering and Performance, vol. 17 no. 1, pp. 96-100, Feb. 2008.

Wang, Moo-Chin, Yu, Shan-Pu, Chang, Tao-Chih, and Hon, Min-Hsiung, "Formation and morphology of the intermetallic compounds formed at the 92Sn-8.55Zn-0.45Al lead-free solder alloy/Cu interface," Journal of Alloys and Compounds, vol. 389 no. 1-2, pp. 133-139, Mar. 8, 2005.

Wang, Moo-Chin, Yu, Shan-Pu, Chang, Tao-Chih, and Hon, Min-Hsiung, "Kinetics of intermetallic compound formation at 91Sn-8.55Zn-0.45Al lead-free solder alloy/Cu interface," Journal of Alloys and Compounds , vol. 381 no. 1-2, pp. 162-167, Nov. 3, 2004.

Wang, Moo-Chin, Lin, Ching-Tsung, Hsi, Chi-Shiung, Chang, Tao-Chih, Liang, Ming-Kann, and Huang, Hong-Hsin, "Microstructures Variations of Sn-9Zn-1Al and Sn-8Zn-3Bi Solder Pastes with Sn-3.8Ag-0.7Cu Solder Balls on OSP PCBs after Thermal Cycling Test," Materials Transactions, vol. 54 no. 3, pp. 332-336, 2013.

Wang, Mu-Chun, Huang, Kuo-Shu, Hsieh, Zhen-Ying, Yang, Hsin-Chia, Liu, Chuan-Hsi, and Lin, Chii-Ruey, "Performance of Silver-Glue Attachment Technology in Assembly," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 472-475.

Wang, N., Cai, Y., and Zhang, R. Q., "Growth of nanowires," Materials Science and Engineering: R: Reports , vol. 60 np. 1-6, pp. 1-51, Mar. 31, 2008. https://doi.org/10.1016/j.mser.2008.01.001

Wang, Paul P. E., Lizardo, Ferdie, Siavash, Setareh, and Miller, Michael, "From HALT and HASA to Interconnect Reliability," 2006 Pan Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006. pp. xx-xx.

Wang, Paul, He, David, Cao, Vivi, Mai, Goterry, Song, Sy, Ge, Fred, and Tan, KG, "Interconnect Reliability of Low Temperature Solder for Potential Application in Enterprise Computers, Portable, and Automotive Electronics," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 1675-1680.

Wang, Paul P. E., "Lead-Free Process and Product Transition* Phase II. Paste Characteristic Study by Response Assessment and Printing Optimization by Taguchi Method," 2004 SMTA International Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 574-592.

Wang, Paul, He, David, Cao, Vivi, and Su, Jason, "Low Temperature Solder Interconnect Reliability and Potential Application in Enterprise Computer and Automotive Electronics," SMTA International 2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.

Wang, Paul P. E., Hsu, Hana, Lin, C. J., Huang, Gary, Kochi, Ken, Love, David, Reynolds, Heidi, Graveling, Keith, and Hu, Livia, "Mechanical Stress Control and Management in the Assembly Processes for Sn-Pb and Pb-Free System Phase II - Lead-Free Process and Product Transition," 2004 Pan Pacific Symposium Conference Proceedings, Kahuku, Oahu, Hawaii, Feb. 10-12, 2004, pp. xx-xx.

Wang, Peng, Hu, Junhua, Cao, Guoqin, Zhang, Shilin, Zhang, Peng, Liang, Changhao, Wang, Zhuo, and Shao, Guosheng, "Suppression on allotropic transformation of Sn planar anode with enhanced electrochemical performance," Applied Surface Science, vol. 435, pp. 1150-1158, Mar. 30, 2018.

Wang, Pin J., Kim, Jong S., and Lee, Chin C., "A New Bonding Technology Dealing with Large CTE Mismatch Between Large Si Chips and Cu Substrates," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1562-1568.

Wang, Pin J., Kim, Jong S., and Lee, Chin C., "Direct Silver to Copper Bonding Process," Journal of Electronic Packaging, vol. 130 no. 4, pp. 045001-1-045001-4, Dec. 2008.

Wang, Pin J., Sha, Chu-Hsuan, and Lee, Chin C., "Effect of Ag Grain Size on High Temperature Joint Formation in Ag-In System," 2010 Proceedings 60th Electronic Components and Technology Conference , Las Vegas, NV, June 1-4, 2010, pp. 781-788.

Wang, Pin J., Kim, Jong S., and Lee, Chin C., "Fluxless Bonding of Large Silicon Chips to Ceramic Packages Using Electroplated Eutectic Au/Sn/Au Structures," Journal of Electronic Materials, vol. 38 no. 10, pp. 2106-2111, Oct. 2009.

Wang, Pin J., Kim, Jong S., and Lee, Chin C., "Fluxless Bonding of Silicon Chips to Ceramic Packages Using Electroplated Au/Sn/Au Structure," 12th International Symposium on Advanced Packaging Materials, San Jose, CA, Oct. 3-5, 2007, pp. 41-46.

Wang, Pin J., Kim, Jong S., and Lee, Chin C., "Fluxless Wafer-to-Wafer Bonding in Vacuum Using Electroplated Sn-Rich Sn-Ag Dual-layer Structure," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1290-1293.

Wang, Pin J., and Lee, Chin C., "Flip-Chip Silver Joints between Si Chips and Cu Zubstrates Made at Low Temperature," 59th Electronic Components & Technology Conference , San Diego, CA, May 26-29, 2009, pp. 731-735.

Wang, Pin J., Kim, Jong S., and Lee, Chin C., "Intermetallic Reaction between Electroplated Indium and Silver Layers," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1317-1321.

Wang, Pin J., and Lee, Chin C., "Silver Joints Between Silicon Chips and Copper Substrates Made by Direct Bonding at Low-Temperature," IEEE Transactions on Components and Packaging Technologies, vol. 33 no. 1, pp. 10-15, Mar. 2010.

Wang, Qi, Chen, Zhao-Hui, and Xing, Li-Li, "Monocrystalline silicon nanowires and nanosheets as anodes of lithium-ion battery: synthesis in mass production and low cost," IET Micro & Nano Letters, vol. 8 no. 7, pp. 336-339, July 2013.

Wang, Qian, Choa, Sung-Hoon, Kim, Woonbae, Hwang, Junsik, Ham, Sukjin, and Moon, Changyoul, "Application of Au-Sn Eutectic Bonding in Hermetic Radio-Frequency Microelectromechanical System Wafer Level Packaging," Journal of Electronic Materials, vol. 35 no. 3, pp. 425-432, Mar. 2006.

Wang, Qian, Jung, Kyudong, Choi, Minseog, Kim, Woonbae, Ham, Sukjin, Jeong, Byunggil, and Moon, Changyoul, "Low Temperature, Wafer Level Au-In Bonding for ISM Packaging," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Wang, Qian, Zhang, Shuye, Liu, Guiming, Lin, Tiesong, and He, Peng, "The mixture of silver nanowires and nanosilver-coated copper micronflakes for electrically conductive adhesives to achieve high electrical conductivity with low percolation threshold," Journal of Alloys and Compounds, vol. 820, pp. 153184-1-153184-11, Apr. 15, 2020.

Wang, Qiang, Zhang, Yuanxiang, Liang, Lihua, Liu, Yong, and Irving, Scott, "Anand Parameter Test for Pb-Free Material SnAgCu and Life Prediction for a CSP," 8th International Conference on Electronic Packaging Technology , Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Wang, Qiang, Liang, Lihua, and Liu, Yong, "Experimental Determination of Mechanical Properties for Lead-Free Material SnAgCu," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Wang, Qing, Gail, William F., Johnson, R. Wayne, Strickland, Mark, and Blanche, Jim, "Mechanical Properties and Microstructure Investigation Of Lead Free Solder," June 24, 2005.

Wang, Qing-meng, Gan, Gui-sheng, Du, Yunfei, Yang, Donghua, Meng, Guoqi, Wang, Huaishan, and Wu, Yi-ping, "Effect of Trace Ge on Wettability and High-Temperature Oxidation Resistance of Sn-0.7Cu Lead-Free Solder," Materials Transactions, JIM, vol. 57 no. 10, pp. 1685-1690, 2016.

Wang, Qingping, Min, Fanfei, and Zhu, Jinbo, "Preparation of gold nanowires and its application in glucose biosensing," Materials Letters, vol. 91, pp. 9-11, Jan. 15, 2013.

Wang, Qisheng, Li, Jie, Lei, Yin, Wen, Yao, Wang, Zhenxing, Zhan, Xueying, Wang, Feng, Wang, Fengmei, Huang, Yun, Xu, Kai, and He, Jun, "Oriented Growth of Pb1-x Snx Te Nanowire Arrays for Integration of Flexible Infrared Detectors," Advanced Materials, vol. 28 no. 18, pp. 3596-3601, May 11, 2016.

Wang, Qiwei, Xiao, Yong, and Zhang, Xingyi, "Ultrasound-assisted soldering of Cu alloy using a Ni-foam reinforced Sn composite solder," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 875-878.

Wang, Ranlong, and Ruan, Haibo, "Synthesis of copper nanowires and its application to flexible transparent electrode," Journal of Alloys and Compounds, vol. 656, pp. 936-943, Jan. 25, 2016.

Wang, Ruey-Chi, Chao, Chien-Yang, and Su, Wei-Sung, "Electrochemically controlled fabrication of lightly doped porous Si nanowire arrays with excellent antireflective and self-cleaning properties," Acta Materialia, vol. 60 no. 5, pp. 2097-2103, Mar. 2012.

Wang, Ruoda, Zhang, Shaoming, Hu, Qiang, and Zhang, Fuwen, "Effect of Boron on Microstructure and Properties of Sn-1.0Ag-0.5Cu Low-Silver Lead-Free Solder," Materials Science Forum, vol. 898, pp. 908-916, June 2017.

Wang, S. J., and Liu, C. Y., "Asymmetrical solder microstructure in Ni/Sn/Cu solder joint," Scripta Materialia, vol. 55 no. 4, pp. 347-350, Aug. 2006.

Wang, S. J., Kao, H. J., and Liu, C. Y., "Correlation between Interfacial Reactions and Mechanical Strengths of Sn(Cu)/Ni(P) Solder Bumps," Journal of Electronic Materials, vol. 33 no. 10, pp. 1130-1136, Oct. 2004.

Wang, S. J., Hsu, L. H., Wang, N. K., and Ho, C. E., "EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing," Journal of Electronic Materials , vol. 43 no. 1, pp. 219-228, Jan. 2014.

Wang, S. J., and Liu, C. Y., "Kinetic Analysis of the Interfacial Reactions in Ni/Sn/Cu Sandwich Structures," Journal of Electronic Materials, vol. 35 no. 11, pp. 1955-1960, Nov. 2006.

Wang, S. J., and Liu, C. Y., "Study of Interaction between Cu-Sn and Ni-Sn Interfacial Reactions by Ni-Sn3.5Ag-Cu Sandwich Structure," Journal of Electronic Materials , vol. 32 no. 11, pp. 1303-1309, Nov. 2003.

Wang, S. L., He, Y. H., Zou, J., Wang, Y., Huang, H., Huang, B. Y., Liu, C. T., and Liaw, P. K., "Catalytic growth of metallic tungsten whiskers based on the vapor-solid-solid mechanism," Nanotechnology, vol. 19 no. 34, pp. 345604-1-345604-5, Aug, 27, 2008.

Wang, S. S., Tseng, Y. H., and Chuang, T. H., "Intermetallic Compounds Formed during the Interfacial Reactions between Liquid In-49Sn Solder and Ni Substrates," Journal of Electronic Materials, vol. 35 no. 1, pp. 165-169, Jan. 2006.

Wang, Shang, and Tian, Yanhong, "Electroplating Enhanced Silver Nanowire Networks for Transparent Heaters," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 1751-1756.

Wang, Shang, Tian, Yanhong, and Guo, Xuguang, "Fatigue LifePrediction for CBGA under Random Vibration Loading by Finite Element Method," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 535-537.

Wang, Shang, Tian, Yanhong, Ding, Su, and Huang, Yilong, "Rapid synthesis of long silver nanowires by controlling concentration of Cu2+ ions," Materials Letters, vol. 172, pp. 175-178, June 1, 2016.

Wang, Shaobin, and Yao, Yao, "Size effect of Sn3.0Ag0.5Cu solder joint on intermetallic layer growth," 2017 18th International Conference on Electronic Packaging Technology , Harbin, China, Aug. 16-19, 2017, pp. 1547-1551.

Wang, Shaobin, Yao, Yao, and Long, Xu, "Size effect on microstructure and tensile properties of Sn3.0Ag0.5Cu solder joints," Journal of Materials Science: Materials in Electronics, vol. 28 no. 23, pp. 17682-17692, Dec. 2017.

Wang, Shiliang, He, Yuehui, Zou, Jou, Wang, Yong, and Huang, Han, "Growth of single-crystal W whiskers during humid H2/N2 reduction of Ni, Fe-Ni, and Co-Ni doped tungsten oxide," Journal of Alloys and Compounds , vol. 482 no. 1-2, pp. 61-66, Aug. 12, 2009.

Wang, Shiliang, He, Yuehui, Liu, Xinli, Zhang, Quan, Zou, Jin, Huang, Han, Song, Min, Huang, Baiyun, Liu, C. T., and Du, Yong, "Large-scale synthesis of tungsten single-crystal microtubes via vapor-deposition process," Journal of Crystal Growth, vol. 316 no. 1, pp. 137-144, Feb. 1, 2011.

Wang, ShiNan, Liang, Lihua, Liu, Yong, Irving, Scott, and Luk, Timwah, "Solder Joint Reliability under Electromigration and Thermal-Mechanical Load," 2007 Proceedings 57th Electronic Components & Technology Conference , Reno, NV, May 29-June 1, 2007, pp. 1074-1083.

Wang, Shuo-Hong, Chin, Tsung-Shune, Yang, Ching-Feng, Chen, Sinn-Wen, and Chuang, Chin-Tzuan, "Pb-free solder-alloy based on Sn-Zn-Bi with the addition of germanium," Journal of Alloys and Compounds, vol. 497 no. 1-2, pp. 428-431, May 14, 2010.

Wang, T. B., Shen, Z. Z., Ye, R. Q., Xie, X. M., Stubhan, F., and Freytag, J., "Die Bonding with Au/In Isothermal Solidification Technique," Journal of Electronic Materials, vol. 29 no. 4, pp. 443-447, Apr. 2000.

Wang, T. S., Liu, S. C., Huang, Y. L., Lin, K. L., and Lai, Y. S., "The Microstructure and Fracture Behavior of Sn-3Ag-0.5Cu Solder Joints," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 293-296.

Wang, Tianxiong, and Meng, Xianquan, "One-step fabrication of InxGa1-xSb nanowires by vapor transport method," Journal of Materials Science: Materials in Electronics, vol. 30 no. 18, pp. 17440-17446, Sept. 2019.

Wang, Tiebing, Fu, Ying, Becker, Matthias, and Liu, Johan, "Heating and Reliability Characteristics of Electrically Conductive Adhesives Using Variable Frequency Microwave Cure," Proceedings of 3rd Electronics Packaging Technology Conference, Singapore, Dec. 5-7, 2000, pp. 373-377.

Wang, Tiebing, Fu, Ying, Becker, Matthias, and Liu, Johan, "Microwave Cure of Metal-Filled Electrically Conductive Adhesive," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 593-597.

Wang, Ting-Hui, and Lin, Kwang-Lung, "The Dissolution and Supersaturation of Zn in the Sn9Zn Solder Under Current Stressing," Journal of Electronic Materials, vol. 45 no. 1, pp. 164-171, Jan. 2016.

Wang, Tong Hong, Tsai, Chung-Hung, and Lai, Yi-Shao, "Effect of the combination of surface finishes and solder balls on JEDEC drop reliability of chip-scale packages," Microelectronic Engineering, vol. 98, pp. 1-5, Oct. 2012.

Wang, Tongmin, Zhou, Peng, Cao, Fei, Kang, Huijun, Chen, Zongning, Fu, Yanan, Xiao, Tiqiao, Huang, Wanxia, and Yuan, Qingxi, "Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation," Intermetallics, vol. 58, pp. 84-90, Mar. 2015.

Wang, Vicky, and Maslyk, Dan, "Analysis of the Reliability of Package-on-Package Devices Manufactured Using Various Underfill Methods," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Wang, W., Qu, J. F., Lu, X. L., Zhang, G. Q., Li, G., and Li, X. G., "Electrochemical Fabrication of BixTe1-x (0.4 <= x <= 0.7) Nanowire Arrays," Materials Science Forum, vol. 546-549, pp. 2171-2174, May 2007.

Wang, Wangang, and Peng, Yong, "Solder Selection of Lead-free Reflow Soldering and Optimization of Craft Curve," Advanced Materials Research, vol. 323, pp. 70-74, 2011.

Wang, Wei, Huang, Qinghua, Jia, Falong, and Zhu, Jing, "Electrochemically assembled p-type Bi2Te3 nanowire arrays," Journal of Applied Physics, vol. 96 no. 1, pp. 615-618, July 1, 2004.

Wang, Wei, Wang, Zhongguang, Xian, Aiping, and Shang, Jianku, "Microstructural Evolution and Cracking of Pb-free Ball Grid Array Assemblies under Thermal Cycling," Journal of Materials Science and Technology , vol. 23 no. 1, pp. 65-91, Jan. 2007.

Wang, Wei, Wang, Zhongguang, Xian, Aiping, and Shang, Jianku, "Microstructure and Fracture of Pb-free Solder Interconnects in CBGA Packages under Thermal Cycling," Acta Metallurgica Sinica, vol. 42 no. 6, pp. 647-652, June 2006.

Wang, Wei-Chieh, Lin, Kwang-Lung, Chiu, Ying-Ta, and Lai, Yi-Shao, "The Growth and Segregation of Intermetallic Compounds in the Bulk of Flip Chip Sn2.4Ag Solder Joint under Electrical Current Stressing," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 1600-1605.

Wang, Weiqiang, Choubey, Anupam, Azarian, Michael H., and Pecht, Michael, "An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics," Journal of Electronic Materials, vol. 38 no. 6, pp. 815-827, June 2009.

Wang, Weiqiang, Chan, Y. C., and Pecht, Michael, "Anisotropic Conductive Adhesives for Flip-Chip Interconnects," Journal of Adhesion Science and Technology, vol. 22 no. 8-9, pp. 871-892, 2008.

Wang, Weiqiang, Ding, Ying, and Wang, Chunqing, "Molecular dynamics (MD) simulation of uniaxial tension of beta-Sn single crystals with nanocracks," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Wang, Weiqiang, Osterman, Michael, Das, Diganta, and Pecht, Michael, "Solder Joint Reliability of SnAgCu Solder Refinished Components Under Temperature Cycling Test," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 5, pp. 798-808, May 2011.

Wang, Wen, Zhong, Yinghui, Li, Dongxue, Wang, Pan, Cai, Yuwei, and Duan, Zhiyong, "Thermal Behavior of Ag Micro/Nano Wires Formed by Low-Temperature Sintering of Ag Nanoparticles," Journal of Electronic Materials, vol. 44 no. 12, pp. 4920-4927, Dec. 2015.

Wang, Wenlong, Sun, Jing, Ma, Chunyuan, Dong, Yong, Wang, Zhiqiang, Xu, Xiren, and Song, Zhanlong, "Study on the Gasification and Melting Characteristics of Electronic Waste," International Conference on Energy and Environment Technology, Guilin, China, Oct. 16-18, 2009, pp. 574-577.

Wang, X., Liu, Y. C., and Gao, Z. M., "Effect of Bi content on spalling behavior of Sn-Bi-Zn-Ag/Cu interface," Journal of Materials Science: Materials in Electronics, vol. 22 no. 1, pp. 14-19, Jan. 2011.

Wang, X. J., Wang, Z. G., and Shang, J. K., "Effect of displacement rate on lap shear test of SAC solder ball joints," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Wang, X. J., Zhu, Q. S., Liu, B., Liu, N., and Wang, F. J., "Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder," Journal of Materials Science: Materials in Electronics, vol. 25 no. 5, pp. 2297-2304, May 2014.

Wang, X. J., Zeng, Q. L., Zhu, Q. S., Wang, Z. G., and Shang, J. K., "Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints," Journal of Materials Science and Technology, vol. 26 no. 8, pp. 737-742, Aug. 2010.

Wang, X., and Gaustad, G., "Prioritizing Material Recovery for End-of-Life Printed Circuit Boards," 2011 IEEE International Symposium on Sustainable Systems and Technology , Chicago, IL, May 16-18, 2011, pp. xx-xx.

Wang, X., Liu, Y. C., Wei, C., Gao, H. X., Jiang, P., and Yu, L. M., "Strengthening mechanism of SiC-particulate reinforced Sn-3.7Ag-0.9Zn lead-free solder," Journal of Alloys and Compounds, vol. 480 no. 2, pp. 662-665, July 8, 2009.

Wang, X., Xiu, Y., Dong, M. J., and Liu, Y. C., "The microstructure and properties of the Sn-xBi-0.9Zn-0.3Ag lead-free solders," Journal of Materials Science: Materials in Electronics, vol. 22 no. 6, pp. 592-595, June 2011.

Wang, Xianbao, Liu, Yunqi, Yu, Gui, Xu, Cuiying, Zhang, Jinbiao, and Zhu, Daoben, "Anisotropic Electrical Transport Properties of Aligned Carbon Nanotube Films," Journal of Physical Chemistry B, vol. 105 no. 39, pp. 9422-9425, Oct. 4, 2001.

Wang, Xiaobai, and Poon, Christine, "Benchmarking of Lead-Free No-Clean Fluxes Soldering Performance on OSP Board," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 225-228.

Wang, Xiaobai, "Void of Leaded and Lead-free Solder Paste on Different PCB Surface Pad Finish Under Various Reflow Conditions - Further Investigation on Void of SnInAgBi Lead-Free Soldering Paste," Proceedings of 7th Electronic Packaging Technology Conference, Volume 1, Singapore, Dec. 7-9, 2005, pp. 347-352.

Wang, Xiaofei, Zhang, Yufei, Yu, Kan, and Yu, Xiaomei, "Fabrication of Silicon Nano-wire by Oxidation," Key Engineering Materials, vol. 483, pp. 565-568, June 2011.

Wang, Xiaohui, Huang, Mingliang, Yang, Fan, and Zhao, Ning, "Simulation of IMC Layer Growth and Cu Consumption in Sn-Ag-xCu/Cu Solder Joints during Reflow," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 823-827.

Wang, Xiaojing, Li, Tianyang, Chen, Yunxia, and Wang, Jianxin, "Current induced interfacial microstructure and strength weakening of SAC/FeNi-Cu connection," Applied Mechanics and Materials, vol. 651-653, pp. 11-15, Sept. 2014.

Wang, Xiaojing, Wang, Yanlai, Wang, Fengjiang, Liu, Ning, and Wang, Jianxin, "Effects of Zn, Zn-Al and Zn-P Additions on the Tensile Properties of Sn-Bi Solder," Acta Metallurgica Sinica, vol. 27 no. 6, pp. 1159-1164, Dec. 2014. https://doi.org/10.1007/s40195-014-0165-9

Wang, Xiaoya, Han, Mengting, Ma, Liming, Xu, Guangchen, and Guo, Fu, "Electromigration Behavior in In-situ Cu6Sn5 Reinforced Eutectic SnAg Composite Solder Joints," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 211-215.

Wang, Xiaoye, Yang, Wenyuan, Wang, Baojun, Ji, Xianghai, Xu, Shengyong, Wang, Wei, Chen, Qing, and Yang, Tao, "Effect of nanohole size on selective area growth of InAs nanowire arrays on Si substrates," Journal of Crystal Growth, vol. 460, pp. 1-4, Feb. 15, 2017.

Wang, Xiaoye, Du, Wenna, Yang, Xiaoguang, Zhang, Xingwang, and Yang, Tao, "Self-catalyzed growth mechanism of InAs nanowires and growth of InAs/GaSb heterostructured nanowires on Si substrates," Journal of Crystal Growth , vol. 426, pp. 287-292, Sept. 15, 2015.

Wang, Xiaoye, Yang, Xiaoguang, Du, Wenna, Ji, Haiming, Luo, Shuai, and Yang, Tao, "Thickness influence of thermal oxide layers on the formation of self-catalyzed InAs nanowires on Si(111) by MOCVD," Journal of Crystal Growth, vol. 395, pp. 55-60, June 1, 2014.

Wang, Xinchang, Wang, Chengchuan, Shen, Xiaotian, and Sun, Fanghong, "High-Speed Drawing of Al Alloy Wire by Diamond-Coated Drawing Die Under Environmentally Friendly Water-Based Emulsion Lubrication," Journal of Manufacturing Science and Engineering, vol. 140 no. 12, pp. 124502-1-124502-7, Dec. 2018.

Wang, Xinxin, Ma, Limin, Qi, Ya, Liu, Jianping, Guo, Fu, and Liu, Li, "Impact of Sn3.0Ag0.5Cu Solder Powder Size on the Reliability of Solder Joints in High Density LED Packages," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1416-1420.

Wang, Xinying, Lu, Xuebin, and Zhang, Shuting, "Study on the waste liquid crystal display treatment: Focus on the resource recovery," Journal of Hazardous Materials, vol. 244-245, pp. 342-347, Jan. 15, 2013.

Wang, Xitao, Wang, Yanli, Chen, Guoliang, Liu, Johan, and Lai, Zonghe, "Quantitative Estimate of the Characteristics of Conductive Particles in ACA by Using Nano Indenter," The First IEEE International Symposium on Polymeric Electronics Packaging, Oct. 26-30, 1997, pp. 101-106.

Wang, Xitao, Wang, Yanli, Chen, Guoliang, Liu, Johan, and Lai, Zonghe, "Quantitative Estimate of the Characteristics of Conductive Particles in ACA by Using Nano Indenter," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 21 no. 2, pp. 248-251, June 1998.

Wang, Xiyu, Li, Deyu, Li, Ning, and Wang, Rui, "Growth behavior of intermetallic compounds in Fe/Sn diffusion couples," Journal of Materials Science: Materials in Electronics, vol. 30 no. 13, pp. 12639-12646, July 2019.

Wang, Xu, Cheng, Zhaonian, and Liu, Johan, "RF Characterization of Flip-Chip Anisotropic Conductive Adhesives Joints," Proceedings of the 2006 IEEE CPMT Conference on High Density Microsystem Design, Packaging and Component Failure Analysis, Shanghai, June 27-28, 2006, pp. 213-217.

Wang, Xu, Zhang, Xia, Liu, Johan, and Zhang, Yan, "RF Performance of Flip Chip ACA Joints for CPW Transmission Lines," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 501-506.

Wang, Xue, Han, Jing, Guo, Fu, Ma, Limin, and Wang, Yishu, "Effects of POSS on the interfacial reactions between Sn-3.5Ag solders and Cu substrates during soldering," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1000-1005.

Wang, Xue-wei, He, Zhao-cheng, Li, Ju-shan, and Yuan, Zhi-hao, "A facile method of fabricating PbBi alloy nanowires with controlled component proportion," Journal of Alloys and Compounds, vol. 595, pp. 221-225, May 15, 2014.

Wang, Xue Wei, Fei, Guang Tao, Tong, Peng, Xu, Xi Jin, and Zhang, Li De, "Structural control and magnetic properties of electrodeposited Co nanowires," Journal of Crystal Growth, vol. 300 no. 2, pp. 421-425, Mar. 15, 2007.

Wang, Xuehua, Chen, Gui, Yang, Liang, Li, Chengyong, and Cai, Peng, "Preparation, Characterization and Magnetic Properties of Fe59Co41 alloy nanowires using AC electrochemical deposition," Advanced Materials Research, vol. 152-153, pp. 963-966, 2011.

Wang, Xuming, Qin, Fei, and An, Tong, "A Constitutive Model for Lead-free Solders Considering the Damage Effect at High Strain Rates," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 510-513.

Wang, Xuming, Qin, Fei, and An, Tong, "Fracture Mode of the IMC Layer in Soder Joints," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 861-864.

Wang, Xun, Liu, Yongchang, Yu, Liming, Dong, Zhizhong, and Gao, Zhiming, "Development of a lead-free solder: Sn-4.0Bi-3.7Ag-0.9Zn," Soldering & Surface Mount Technology, vol. 23 no. 1, pp. 15-21, 2011.

Wang, Y. H., Xiong, N. N., Li, Z. L., Xie, H., Liu, J. Z., Dong, J., and Li, J. Z., "A comprehensive study of silver nanowires filled electrically conductive adhesives," Journal of Materials Science: Materials in Electronics , vol. 26 no. 10, pp. 7927-7935, Oct. 2015.

Wang, Y. H., Huang, A., Xie, H., Liu, J. Z., Zhao, Y. Z., and Li, J. Z., "Isotropical conductive adhesives with very-long silver nanowires as conductive fillers," Journal of Materials Science: Materials in Electronics, vol. 28 no. 1, pp. 10-17, Jan. 2017.

Wang, Y. H., Xiong, N. N., Xie, H., Zhao, Y. Z., and Li, Jingze, "New insights into silver nanowires filled electrically conductive adhesives," Journal of Materials Science: Materials in Electronics, vol. 26 no. 2, pp. 621-629, Feb. 2015.

Wang, Y. W., and Kao, C. R., "Development of Lead-Free Solders with Superior Drop Test Reliability Performance," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 534-539.

Wang, Y. W., Lin, Y. W., Tu, C. T., and Kao, C. R., "Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu," Journal of Alloys and Compounds, vol. 478 no. 1-2, pp. 121-127, June 10, 2009.

Wang, Y. W., Lin, Y. W., and Kao, C. R., "Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders," Journal of Alloys and Compounds, vol. 493 no. 1-2, pp. 233-239, Mar. 18, 2010.

Wang, Y. W., Lin, Y. W., and Kao, C. R., "Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates," Microelectronics Reliability , vol. 49 no. 3, pp. 248-252, Mar. 2009.

Wang, Y. W., Chang, C. C., and Kao, C. R., "Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth," Journal of Alloys and Compounds, vol. 478 no. 1-2, pp. L1-L4, June 10, 2009.

Wang, Y. W., and Kao, C. R., "Minor Fe, Co, and Ni Additions to SnAgCu Solders for Retarding Cu3Sn Growth," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 76-79.

Wang, Y. W., Shih, W. L., Hung, H. T., and Kao, C. R., "Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications," Journal of Electronic Materials, vol. 48 no. 1, pp. 25-31, Jan. 2019.

Wang, Y. W., and Kao, C. R., "The Effects of Minor Fe, Co, and Ni Additions to Lead-Free Solders on the Thickness of Cu3Sn at the Interface," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 280-283.

Wang, Yan, Wang, Yishu, Ma, Limin, Han, Jing, and Guo, Fu, "Effect of Sn Grain c-Axis on Cu Atomic Motion in Cu Reinforced Composite Solder Joints Under Electromigration," Journal of Electronic Materials , vol. 49 no. 3, pp. 2159-2163, Mar. 2020.

Wang, Yan, Han, Jing, Wang, Yishu, Ma, Limin, and Guo, Fu, "Effect of the Angle Between Sn Grain c-Axis and Electron Flow Direction on Cu-Reinforced Composite Solder Joints Under Current Stressing," Journal of Electronic Materials, vol. 47 no. 1, pp. 96-102, Jan. 2018.

Wang, Yan, Han, Jing, Guo, Fu, and Ke, Xiaoxing, "Effects of Grain Orientation on the Electromigration of Cu-Reinforced Composite Solder Joints," Journal of Electronic Materials, vol. 46 no. 10, pp. 5877-5883, Oct. 2017.

Wang, Yan, Wang, Yishu, Han, Jing, Tan, Shihai, and Guo, Fu, "Effects of Sn grain c-axis on electromigration in Cu reinforced composite solder joints," Journal of Materials Science: Materials in Electronics , vol. 29 no. 7, pp. 5954-5960, Apr. 2018.

Wang, Yan, Han, Jing, Ma, Limin, Zuo, Yong, and Guo, Fu, "Electromigration Behaviors of Cu Reinforced Sn-3.5Ag Composite Solder Joints," Journal of Electronic Materials, vol. 45 no. 12, pp. 6095-6101, Dec. 2016.

Wang, Yan, Wang, Yishu, Ma, Limin, Han, Jing, and Guo, Fu, "IMC growth behavior along c-axis of Sn grain under current stressing," Journal of Materials Science: Materials in Electronics, vol. 29 no. 15, pp. 13180-13187, Aug. 2018.

Wang, Yanfeng, Shang, Shengyan, Ma, Haoran, Wu, Shaocheng, Li, Weifeng, Feng, Tuo, and Ma, Haitao, "Effect of TiO2 nanoparticle on intermetallic compounds growth of Cu/Sn/Cu Solder Joint," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Wang, Yang, Liu, Wenxiao, Liu, Wei, He, Peng, Fan, Zhonghua, Wang, Xiaorong, Yu, Dingkun, Guo, Jiayu, Guo, Bing, and Shen, Hangyan, "Synthesis of SnAgCu nanoparticles with low melting point by the chemical reduction method," Microelectronics Reliability, vol. 78, pp. 17-24, Nov. 2017.

Wang, Yanli, Lin, Junpin, Lin, Zhi, Cui, Xinfa, and Chen, Guoliang, "Deformation characterization of conductive particles in anisotropically conductive adhesive simulated by FEM," Journal of University of Science and Technology Beijing, vol. 12 no. 1, pp. 48-53, Feb. 2005.

Wang, Yanli, Wang, Tianyu, Da, Peimei, Xu, Ming, Wu, Hao, and Zheng, Gengfeng, "Silicon Nanowires for Biosensing, Energy Storage, and Conversion," Advanced Materials, vol. 25 no. 37, pp. 5177-5195, Oct. 4, 2013.

Wang, Yanqing, Xu, Xiaoyan, Zhou, Jian, and Xue, Feng, "Investigation of Rheology Behavior of Lead-free Solder Paste," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 487-490.

Wang, Yaodong, Chu, David T., and Tu, King-Ning, "Porous Cu3Sn Formation in Cu-Sn IMC-based micro-joints," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 439-446.

Wang, Yaodong, De Rosa, Igor M., and Tu, K. N., "Size Effect on Ductile-to-Brittle Transition in Cu-solder-Cu Micro-joints," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 632-639.

Wang, Yaoli, Dong, Gaihong, Li, Chenyang, Wu, Zhiwei, and Sun, Jing, "Effect of RE on creep rupture life of SnAgCu solder joints," Materials Science Forum, vol. 687, pp. 39-43, 2011.

Wang, Yaoli, Zhang, Keke, Zhao, Guoji, and Han, Lijuan, "Effect of RE on microstructure and interfacial reactions of SnAgCu solder," Advanced Materials Research, vol. 154-155, pp. 87-90, 2011.

Wang, Yaoli, Zhang, Kele, Li, Chenyang, Han, Lijuan, and Zhang, Qingzhi, "Interfacial microstructures and kinetics of Sn2.5Ag0.7Cu/Cu," Materials Science Forum, vol. 687, pp. 112-116, 2011.

Wang, Yaoli, Fang, Zonghui, Ma, Ning, and Zhang, Keke, "Wettability of SACR-xNi solder alloy on Cu leading wire with no-clean flux," Journal of Materials Science: Materials in Electronics, vol. 28 no. 1, pp. 94-99, Jan. 2017.

Wang, Yeng-Ping, Jiang, Don-Son, Wang, Yu-Po, and Hsiao, C. S., "Board Level Reliability Study for CSP with 400 um Ball Pitch," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 354-357.

Wang, Yeng-Ping, Hung, Liang Yi, Jiang, Don-Son, Chang, Chiang Cheng, Wang, Yu-Po, and Hsiao, C. S., "High Drop Performance Interconnection: Polymer Cored Solder Ball," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1208-1211.

Wang, Yi-Qi, Ko, Byung-Han, Jeong, Sang-Geuk, Park, Kyoung-Su, Park, No-Cheol, and Park, Young-Pil, "Analysis of the influence of soldering parameters on multi-layer ceramic capacitor vibration," Microsystem Technologies, vol. 21 no. 12, pp. 2565-2571, Dec. 2015.

Wang, Yi-Ta, Ho, Cheng Jen, and Tsai, Hsien-Lung, "Effect of In addition on mechanical properties of Sn-9Zn-In/Cu solder," 2013 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Suzhou, China, Apr. 7-10, 2013, pp. 1038-1041.

Wang, Yi Ta, Ho, Chung Jen, and Tsai, Hsien Lung, "Effect of In Addition on Wetting Properties of Sn-Zn-In/Cu Soldering," Materials Transactions, vol. 51 no. 10, pp. 1735-1740, 2010.

Wang, Yibo, Pan, Hongfa, Chen, Charles Nan-Cheng, Li, Ming, and Gao, Liming, "Effect of Ni(P) thickness of ultrathin ENEPIG on the interfacial reaction and board level reliability of solder joints," 2020 IEEE 70th Electronic Components and Technology Conference, Lake Buena Vista, AL, May 26-29, 2020, pp. 690-695.

Wang, Yibo, Lu, Jicun, Li, Ming, and Gao, Liming, "Effect of Sb and Ni Addition on Microstructure and Mechanical Properties of SAC1205 Solder," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Wang, Yikai, Liu, Wensheng, Ma, Yunzhu, Huang, Yufeng, Tang, Ya, Cheng, Fan, and Yu, Qiang, "Indentation size effect and micromechanics characterization of intermetallic compounds in the Au-Sn system," Materials Science and Engineering: A , vol. 610, pp. 161-170, July 29, 2014.

Wang, Yikai, Liu, Wensheng, Ma, Yunzhu, Huang, Yufeng, and Tang, Ya, "Influence of Dislocation Density on Micromechanical Characteristics of Cu6Sn5 and Cu3Sn," Materials Science Forum, vol. 815, pp. 115-124, Mar. 2015.

Wang, Yile, Zhang, Xu, Sun, Xiaohong, Qi, Yongle, Wang, Zhen, and Wang, Hua, "Enhanced optical properties in inclined GaAs nanowire arrays for high-efficiency solar cells," Optics and Laser Technology, vol. 85, pp. 85-90, Nov. 2016. https://doi.org/10.1016/j.optlastec.2016.05.022

Wang, Ying, Blendell, John E., and Handwerker, Carol A., "Evolution of tin whiskers and subsiding grains in thermal cycling," Journal of Materials Science, vol. 49 no. 3, pp. 1099-1113, Feb. 2014.

Wang, Ying, Yoo, Byung-Gil, Phillipi, Bastian, Handwerker, Carol, Blendell, John, Kraft, Oliver, and Dehm, Gerhard, "Stress Relaxation in Tin Films during Cyclic Bending and Thermal Cycling," Tin Whisker Group teleconference, Jan. 28 & Feb. 4, 2015.

Wang, Ying-Hui, and Suga, Tadatomo, "Effect of Surface Contamination on Solid-State Bondability of Sn-Ag Bumps in Ambient Air," Materials Transactions, vol. 49 no. 7, pp. 1508-1512, July 2008.

Wang, Ying-Hui, and Suga, Tadatomo, "Feasibility of Solid State Bonding for Sn-Ag-Cu Solder Bumps in Ambient Air," 8th International Conference on Electronic Packaging Technology , Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Wang, Ying-Hui, and Suga, Tadatomo, "Metal Surface Cleanliness and its Improvement on Bonding," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 1317-1320.

Wang, Ying-Hui, Howlader, Matiar R., Nishida, Kenji, Kimura, Takashi, and Suga, Tadatomo, "Study on Sn-Ag Oxidation and Feasibility of Room Temperature Bonding of Sn-Ag-Cu Solder," Materials Transactions, vol. 46 no. 11, pp. 2431-2436, 2005.

Wang, YingHui, Nishida, Kenji, Hutter, Matthias, Howlader, Matiar R., Higurashi, Eiji, Kimura, Takashi, and Suga, Tadatomo, "Surface Activation Process of Lead-free Solder Bumps for Low Temperature Bonding," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Wang, Yinhai, Zhao, Hui, Hu, Yihua, Ye, Changhui, and Zhang, Lide, "Thermal expansion behavior of hexagonal Zn nanowires," Journal of Crystal Growth, vol. 305 no. 1, pp. 8-11, July 1, 2007.

Wang, Yiqing, Ding, Dongyan, Liu, Ting, Galuschki, Klaus-Peter, Hu, Yu, Gong, Angela, Shen, Ming, Sun, Hongqi, Wang, Xianfeng, Sun, Jiangyan, Li, Ming, and Mao, Dali, "Effect of Ni Barrier on the Tin Whisker Formation of Electroplating Sn on Lead-frame Alloy," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 980-983.

Wang, Yiqing, Ding, Dongyan, Galuschki, Klaus-Peter, Hu, Yu, Gong, Angela, Bai, Shuo, Li, Ming, and Mao, Dali, "Microstructural Characterization of Electroplating Sn on Lead-frame Alloys," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 601-606.

Wang, Yiwei, Lu, Kuan H., Gupta, Vikas, Stiborek, Leon, Shirley, Dwayne, Im, Jay, and Ho, Paul S., "Effect of Sn Grain Structure on Electromigration Reliability of Pb-Free Solders," 2011 IEEE 61st Electronic Components and Technology Conference , Lake Buena Vista, FL, May 31-June 3, 2011, pp. 711-716.

Wang, Yiwei, Lu, Kuan H., Gupta, Vikas, Stiborek, Leon, Shirley, Dwayne, Chae, Seung-Hyun, Im, Jay, and Ho, Paul S., "Effects of Sn grain structure on the electromigration of Sn-Ag solder joints," Journal of Materials Research, vol. 27 no. 8, pp. 1131-1141, Apr. 28, 2012.

Wang, Yiwei, Chae, Seung-Hyun, Im, Jay, and Ho, Paul S., "Kinetic Study of Intermetallic Growth and its Reliability Implications in Pb-free Sn-based Microbumps in 3D Integration," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 1953-1958.

Wang, Yiwei, and Ho, Paul S., "Mode II electromigration failure mechanism in Sn-based Pb-free solder joints with Ni under-bump metallization," Applied Physics Letters, vol. 103 no. 12, pp. 121909-1-121909-4, Sept, 16, 2013.

Wang, YiWun, and Kao, C. Robert, "Interconnections of Low-Temperature Solder and Metallizations," 2020 IEEE 8th Electronics System-Integration Technology Conference, Tonsberg, Norway, Sept. 15-18, 2020, pp. xx-xx.

Wang, Yong, Zhao, Xiuchen, Xie, Xiaochen, Gu, Yue, and Liu, Ying, "Effects of nano-SiO2 particles addition on the microstructure, wettability, joint shear force and the interfacial IMC growth of Sn3.0Ag0.5Cu solder," Journal of Materials Science: Materials in Electronics, vol. 26 no. 12, pp. 9387-9395, Dec. 2015.

Wang, Yu, and Cao. Liqiang, "Development of High Speed Cold Ball Pull as a Quick Turn Monitor for Solder Joint Reliability," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1071-1074.

Wang, Yue, Yang, Jian, Huang, Jihua, Wang, Wanli, Ye, Zheng, Chen, Shuhai, and Zhao, Yue, "First-principles calculations on physical properties of Ni3Snx binary system intermetallic compounds and Ni/Ni3Sn interfaces in Nickel-Tin TLPS bonding layer," Intermetallics, vol. 101, pp. 27-38, Oct. 2018.

Wang, Yuexing, Long, Xu, Yao, Yao, "Theoretical study of thermomigration effect on the pancake void propagation at the current crowding zone of solder joints," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 451-454.

Wang, Yuming, Dong, Mingzhi, and Cai, Jian, "Solderability of Flash Gold Surface Finish," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 152-156.

Wang, Yung-Wen, and Wu, Mei-Ling, "Critical Parameters Lead to Failure of Lead-Free Solder Joint Under Thermal Cycling," 2012 Pan Pacific Microelectronics Symposium, Kauai, HI, Feb. 14-16, 2012, pp. xx-xx.

Wang, Yung-Wen, and Wu, Mei-Ling, "Failure of Lead-Free Solder Joint under Thermal Cycling," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 265-268.

Wang, Yuzhong, and guan, Liangwei, "Thermomechanical Fatigue Analysis of Pb-free Solder Joints," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Wang, Z. P., "Challenges in the Reliability Study of Chip-On-Glass (COG) Technology for Mobile Display Applications," 2003 5th Conference on Electronics Packaging Technology, Dec 10-12, 2003, pp. 595-599.

Wang, Z. P., Tan, Y. M., Schreiber, Christopher M., Tsui, Christina C., Shi, Z. F., and Wei, J.. "Development of Chip-on-Dot Flip Chip Technique Utilizing Gold Dot(TM) Flexible Circuitry," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 1470-1474.

Wang, Z., Adhikari, S. S., Kroener, M., Kojda, D., Mitdank, R., Fischer, S. F., Toellner, W., Nielsch, K., and Woias, P., "Electrical Conductivity and Seebeck Coefficient Measurements of Single Nanowires by Utilizing a Microfabricated Thermoelectric Nanowire Characterization Platform," 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems, Taipei, Taiwan, Jan. 20-24, 2013, pp. 508-511.

Wang, Z., Zhang, Q. K., Chen, Y. X., and Song, Z. L., "Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints," Journal of Materials Science: Materials in Electronics, vol. 30 no. 20, pp. 18524-18538, Oct. 2019.

Wang, Z. X., Dutta, I., and Majumdar, B. S., "Thermal cycle response of a lead-free solder reinforced with adaptive shape memory alloy," Materials Science and Engineering A, vol. 421 no. 1-2, pp. 133-142, Apr. 15, 2006.

Wang, Z. X., Dutta, I., and Majumdar, B. S., "Thermomechanical response of a lead-free solder reinforced with a shape memory alloy," Scripta Materialia, vol. 54 no. 4, pp. 627-632, Feb. 2006.

Wang, Zekun, Flowers, George T., and Bozack, Michael, "The Influence of Limitation of Sputtered Tin Area Through Mesh Grids on Sn Whiskering," 2020 IEEE 66th Holm Conference on Electrical Contacts and Intensive Course, San Antonio, TX, Oct. 4-7, 2020, pp. 137-143.

Wang, Zhaohua, Zhang, Bin, Yin, Jianhua, and Zhang, Xiang, "Willingness and behavior towards e-waste recycling for residents in Beijing city, China," Journal of Cleaner Production, vol. 19 no. 9-10, pp. 977-984, June-July 2011.

Wang, Zhenghong, Zhang, Gong, Chen, Chuantong, and Suganuma, Katsuaki, "Corrosion process study of Zn-30Sn high-temperature lead-free solder," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1254-1257.

Wang, Zhenghong, Yang, Zelin, Zeng, Shenbo, Zhang, Gong, Liu, Jianchun, Chen, Chuantong, and Suganuma, Katsuaki, "Effect of temperature on electrochemical corrosion of Zn-30Sn lead-free solder," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 10-14.

Wang, ZhengJia, Wang, Yuhui, and Yin, Zhouping, "A Multi-physics Simulation Based Parameters Optimization for Anisotropic Conductive Adhesive Interconnection in Electronic Packaging," Lecture Notes in Computer Science, Volume 5315: 2008 Proceedings First International Conference Intelligent Robotics and Applications, Part II, Wuhan, China, Oct. 15-17, 2008, pp. 896-905.

Wang, ZhengJia, Yin, ZhouPing, Tao, Bo, and Xiong, YouLun, "Coupled Simulation of Anisotropic Conductive Adhesive Bonding Process and Reliability Analysis of the Packaging," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 411-416.

Wang, Zhibin, Zhang, Yanwei, Zhang, Wei, Chen, Yan, Gong, Xin, and Meng, Meng, "The spontaneous growth of Pb whisker from the Pb60Sn40 solder layer on the Au coating," Applied Mechanics and Materials, vol. 798, pp. 406-409, Oct. 2015.

Wang, Zhuoru, Qin, Fei, and Xia, Guofeng, "Stress Analysis of Cu Pad/Solder Interfaces," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging , Xi'an, China, Aug. 16-19, 2010, pp. 515-519.

Wangxin, , Xunping, Li, Kailin, Pan, bin, Zhou, and Tingbiao, Jiang, "Effect of Pb content on shear performance of SnAgCu-xSnPb/Cu Mixed solder joint," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1173-1176.

Warashina, Kenji, Kariya, Yoshiharu, Hirata, Yasunori, and Otsuka, Masahisa, "Thermal Fatigue Damage of Quad Flat Pack Leads and Sn-3.5Ag-X (X=Bi and Cu) Solder Joints," Proceedings of the First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Feb. 1-3, 1999, pp. 626-631.

Warburg, N., Braune, A., Eyerer, P., Herrmann, C., and Gallon, N., "Environmental indicators for ICT products - A practical approach based on four steps," Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, New Orleans, LA, May 16-19, 2005, pp. 226-230.

Warburg, N., "Life Cycle Assessment," APEX 2003.

Warburton, R. J., Patton, B. R., Webb, W. W., and Wilkins, J. W., "Fluctuation Effects in the Resistive Transition of Thin Filamentary Superconductors," Physica, vol. 55, pp. 324-338, Oct. 1971, https://doi.org/10.1016/0031-8914(71)90270-9

Ward, Daniel K., "What's driving environmentally friendly product designs?," Advanced Packaging, vol. xx no. xx, pp. xx-xx, May 2000.

Ward, J. J. B., Christee, I. R. A., and Carter, V. E., "A Pilot Scale Evaluation of a Trivalent Chromium Plating Process," Transactions of the Institute of Metal Finishing, vol. 49 no. 3, pp. 97-104, Summer 1971.

Ward, J. J. B., and Christie, I. R. A., "The Electrodeposition of Chromium from Trivalent Salts," Transactions of the Institute of Metal Finishing, vol. 49, pp. 148-152, 1971.

Warren, Nathan, "Companies may loose contracts if its employees don't know what RoHS is," evertiq, Dec. 5, 2005.

Warwick, M., "Implementing Lead Free Soldering - Consortium Research," 1999 SMTA International Conference Proceedings, San Jose, CA, Sept. 12-16, 1999, pp. xx-xx.

Warwick, M. "Implementing Lead Free Soldering - European Consortium Research," Journal of SMT, vol. 12 no. 4, pp. 1-12, Oct. 1999.

Warwick, M. E., and Davis, P. E., "Passivation and Corrosion Resistance Of Tin-Zinc Alloy Electrodeposits on Steel," Plating and Surface Finishing, vol. 74 no. 12, pp. 77-81, Dec. 1987.

Warwick, M. E., Steen, H. A. H., Vincent, J. H., Richards, B. P., Harris, P. G., Whitmore, M. A., Billington, S. R., and Harman, A. C., ""Screening Studies on Lead-Free Solder Alloys"," Proceedings of the Technical Program NEPCON West '94, Volume 2, Anaheim, CA, Feb. 27-Mar. 4, 1994, pp. 874-883.

Warwick, M. E., and Shirley, Beryl J., "The Autocatalytic Deposition of Tin," Transactions of the Institute of Metal Finishing, vol. 58, pp. 9-14, 1980. https://doi.org/10.1080/00202967.1980.11870517

Warwick, Malcolm, "Impact of the Oko-Institut Recommendations on the Solder Manufacturer," IPC Brussels, Brussels, Belgium, June 18, 2008, pp. xx-xx.

Warwick, Malcolm, "Lead Free Soldering Materials Selection in Japan," NEPCON UK, Birmingham, United Kingdom, Apr. 3-5, 2001.

Warwick, Malcolm, "PREPARING for a lead-free future," Electronics Manufacture and Test , vol. xx no. xx, pp. xx, June 1998.

Warwick, Malcolm, "Solder Trends in Microelectronics," Chip Scale Review, vol. xx no. xx, pp. xx-xx, Oct. 2001.

Warwick, Malcolm E., and Davis, Paul E., "The Passivation, and Corrosion Resistance, of Tin-Zinc Alloy Electrodeposits," The Proceedings of the AESF 74th Annual Technical Conference, Chicago, IL, July 13-16, 1987, session T-1 pp.1-11.

Wasef, Mohammed, and Anderson, Mike, "Evaluation of High Temperature Overmold Compounds for Manufacturing of Laminate Based Leadfree System in Package," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 357-362.

Wasisto, Hutomo Suryo, Merzsch, Stephan, Stranz, Andrej, Waag, Andreas, Uhde, Erik, Salthammer, Tunga, and Peiner, Erwin, "Femtogram aerosol nanoparticle mass sensing utilising vertical silicon nanowire resonators," IET Micro & Nano Letters, vol. 8 no. 10, pp. 554-558, Oct. 2013.

Wasisto, Hutomo Suryo, Merzsch, Stephan, Stranz, Andrej, Waag, Andreas, Uhde, Erik, Salthammer, Tunga, and Peiner, Erwin, "Silicon Nanowire Resonators for Aerosol Nanoparticle Mass Sensing," 2013 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Suzhou, China, Apr. 7-10, 2013, pp. 506-509.

Wasserman, Ch., Boecking, Roland, and Gustafsson, S., "Replacement for Hard Chrome Plating in Printing Machinery," Proceedings of the International Thermal Spray Conference, Singapore, May 28-30, 2001, pp. 69-74.

Watanabe, Hirohiko, Shimoda, Masayoshi, Hidaka, Noboru, and Shohji, Ikuo, "Effect of Interfacial Reaction in Sn-Ag-Cu Solder Alloy with Ni Addition," Key Engineering Materials, vol. 462-463, pp. 247-252, 2011.

Watanabe, Hirohiko, Nagai, Marie, Osawa, Tsutomu, and Shohji, Ikuo, "Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge Alloy," Key Engineering Materials, vol. 462-463, pp. 70-75, Jan. 2011.

Watanabe, Itsuo, and Gotoh, Yasushi, "Driver IC Packaging Technologies using Anisotropic Conductive Films in Flat Panel Display," 2008 SID International Symposium Digest of Technical Papers, Volume 39 Book I, Los Angeles, CA, May 20-21, 2008, pp. 240-243.

Watanabe, Itsuo, Takemura, Kenzo, Shiozawa, Naoyuki, Watanabe, Osamu, Kojima, Kazuyoshi, and Ohta, Tomohisa, "Flip-Chip Interconnection to Various Substrates Using Anisotropic Conductive Films," Journal of Electronics Manufacturing, vol. 5 no. 4, pp. 273-276, Dec. 1995.

Watanabe, Itsuo, Fujinawa, Tohru, Arifuku, Motohiro, Kobayashi, Kouji, and Gotoh, Yasushi, "Recent Advances of Interconnection Technologies using Anisotropic Conductive Films," Proceedings of 2004 International IEEE Conference on the Asian Green Electronics, Hong Kong, China, Jan 5-9, 2004, pp. 229-234.

Watanabe, Itsuo, Fujinawa, Tohru, Arifuku, Motohiro, Fujii, Masaki, and Gotoh, Yasushi, "Recent Advances of Interconnection Technologies using Anisotropic Conductive Films in Flat Panel Display Applications," 2004 9th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 24-26, 2004, pp. 11-16.

Watanabe, Kazuo, "Decorative Trivalent Chromium Plating," Hyomen Gijutsu (Journal of the Surface Finishing Society of Japan), vol. 56 no. 6, pp. 320-324, June 2005.

Watanabe, Masako, and Ano, Kazuaki, "Solder Joint Study of CSP for use During the Transition Period to Lead Free Process," 1999 SMTA International Conference Proceedings, San Jose, CA, Sept. 12-16, 1999, pp. xx-xx.

Watanabe, Masako, and Ano, Kazuaki, "The Reliability Study of Lead-Free Solder Ball for the Chip Scale Package (CSP)," 1998 Surface Mount International Conference Proceedings, San Jose, CA, Aug. 23-27, 1998, pp. xx-xx.

Waterhouse, Richard, "The Current State of EU Sustainability Legislation: Unravelling the Tangle," IEE Seminar on Beyond WEEE. Unsustainable Product Design and How to Avoid It, London, UK, Nov. 29, 2005, pp. 2/1-2/13.

Wathne, Kail, "WL Packaging Challenges Reflow Soldering," Chip Scale Review , vol. 12 no. 3, pp. 45-48, Apr./May 2008.

Watson, A., Borzone, G., Parodi, N., and Cacciamani, G., "The determination of the integral enthalpies of mixing of liquid Au-In-Sn alloys and the enthalpy of formation of the Au4In3Sn3 compound," Thermochimica Acta, vol. 510 no. 1-2, pp. 24-31, Oct. 20, 2010.

Watson, A., Su, Y. J., el-Sharif, M. R., and Chisholm, C. U., "The Electrodeposition of Zinc Chromium Alloys and the Formation of Conversion Coatings without use of Chromate Solutions," Transactions of the Institute of Metal Finishing, vol. 71 no. 1, pp. 15-20, Feb. 1993.

Watson, A., Anderson, A. M. H., el-Sharif, M. R., and Chisholm, C. U., "The role of chromium II catalysed olation reactions in the sustained deposition of chromium and its alloys from environmentally acceptable III electrolytes," Transactions of the Institute of Metal Finishing, vol. 69 no. 1, pp. 26-32, Feb. 1991.

Watson, Alistair, "Pb-free Wave-Soldering & Pb-free Selective-Soldering An Update - Feb 16th 2006," SMART Group 8th Annual Lead-Free Seminar + 'Question Time' & Table-Top Exhibition, High Wycombe, United Kingdom, Feb. 16, 2006.

Watson, Andy, Kroupa, Ales, Ipser, Herbert, Dinsdale, Alan, and Vrestal, Jan, "Soldering on," Materials World, vol. 15 no. 7, pp. 32-33, July 2007.

Watson, Douglas, Bath, Jasbir, and Chi, Pan Wei, "Flux Selection for Lead-Free Wave Soldering," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 168-176.

Watson, Douglas, Bath, Jasbir, and Chih, Pan Wei, "Flux Selection for Lead-Free Wave Soldering," Circuits Assembly , vol. 19 no. 1, pp. 28, 30-32, Jan. 2008.

Watt, Charles, Liu, Qi, and Ivey, Douglas G., "A simple process for electrodeposition of Sn-rich, Au-Sn solder films," Journal of Materials Science: Materials in Electronics, vol. 24 no. 2, pp. 827-837, Feb. 2013.

Watts, Chris, "Green Manufacturing's Competitive Edge," Quality Digest, vol. 28 no. 10, pp. 34-37, Oct. 2008.

Watts, Chris, "RoHS," CircuiTree, vol. 19 no. 3, pp. xx-xx, Mar. 2006.

Wayman, C. M., "Observations on the Growth of a-Iron Single Crystals by Halogen Reduction," Journal of Applied Physics, vol. 32 no. 10, pp. 1844-1845, Oct. 1, 1961.

Weardon, Graeme, "UK scientist researches IT hazards for EC," ZDNetUK, Oct. 13, 2004.

Webb III, Edmund B., "Pesky Stubble: Recent Progress and Remaining Challenges in Controlling Sn Whiskers," 4th Meeting of TAPS: Challenges in Mechanics and Materials, Boulder, CO, Aug. 2009, pp. xx-xx. (Sandia Report SAND2009-4865C)

Webb, Steven, "Meeting The Due Diligence Challenges Of RoHS," Electronic Design , vol. 54 no. 2, pp. 20, Jan. 19, 2006.

Webb, Susy, "The Value of Data Sheets and Application Notes," Printed Circuit Design and Fab, vol. 25 no. 2, pp. 16, Feb. 2008.

Webb, W. W., "Dislocation Mechanisms in the Growth of Palladium Whisker Crystals," Journal of Applied Physics, vol. 36 no. 1, pp. 214-221, Jan. 1965.

Webb, W. W., "Dislocation Structure of Whiskers," Growth and Perfection of Crystals , Cooperstown, NY, Aug. 27-29, 1958, pp. 230-238. (Edited by Doremus, R. H., Roberts, B. W., and Turnbull, David.)

Webb. W. W., Dragsdorf, R. D., and Forgeng, W. D., "Dislocations in Whiskers," Physical Review, vol. 108, no. xx, pp. 498-499, 1957.

Webb, W. W., and Stern, M., "Effect of Surface Films on the Strength of Metal Whiskers," Journal of Applied Physics, vol. 30, pp. 1471, 1959.

Webb, W. W., and Riebling, E. F., "On the Growth of Metal Whiskers by Hydrogen Reduction of Halides," Journal of Chemical Physics, vol. 28 no. 6, pp. 1242-1245, June 1958.

Webb, W. W., "Point Defect Trapping in Crystal Growth," Journal of Applied Physics , vol. 33 no. 6, pp. 1961-1971, June 1962.

Weber, Austin, "Appliance Assembly: Environmental Restrictions Dictate European Designs," Assembly, May 1, 2005.

Webster, James, Pan, Jianbiao, and Toleno, Brian J., "Investigation of the Lead-free Solder Joint Shear Performance," Journal of Microelectronics and Electronic Packaging, Vol. 4 no. 2, pp. 72-77, Second Quarter 2007.

Wege, S., Habenicht, G., and Bergmann, R., "Manufacture and Reliability of Alternate Solder Alloys," 1998 Surface Mount International Conference Proceedings, San Jose, CA, Aug. 23-27, 1998, pp. 699-704.

Wehner, G. K., "Cone formation as a result of whisker growth on ion bombarded metal surfaces," Journal of Vacuum Science & Technology A: Vacuum Surfaces, and Films, vol. A 3, pp. 1821-1835, July/Aug. 1985.

Wehner, G. K., "Whisker growth, and cone formation on metal surfaces under ion bombardment," Applied Physics Letters, vol. 43 no. 4, pp. 366-367, Aug. 15, 1983.

Wehner, G. K., "Whiskers, Cones and Pyramids Created in Sputtering by Ion Bombardment," NASA Contractor Report NASA CR-159549, Mar. 1979.

Wei, C. C., Yu, C. H., Tung, C. H., Huang, R. Y., Hsieh, C. C., Chiu, C. C., Hsiao, H. Y., Chang, Y. W., Lin, C. K., Liang, Y. C., Chen, C., Yeh, T. C., Lin, Larry C., and Yu, Doug C. H., "Comparison of the Electromigration Behaviors Between Micro-bumps and C4 Solder Bumps," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 706-710.

Wei, C., Liu, Y. C., Yu, L. M., Chen, H., and Wang, X., "Effects of Al on the failure mechanism of the Sn-Ag-Zn eutectic solder," Microelectronics Reliability, vol. 50 no. 8, pp. 1142-1145, Aug. 2010.

Wei, C. C., Chen, C. F., Liu, P. C., and Chen, Chih, "Electromigration in Sn-Cu intermetallic compounds," Journal of Applied Physics, vol. 105 no. 2, pp. 023715-1-023715-5, 2009.

Wei, C. C., Liu, P. C., Chen, Chih, and Tu, K. N., "Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes," Journal of Materials Research, vol. 23 no. 7, pp. 2017-2022, July 2008.

Wei, C. C., and Liu, C. Y., "Electromigration studies of Sn(Cu) and Sn(Ni) alloy stripes," Journal of Materials Research, vol. 20 no. 8, pp. 2072-2079, Aug. 2005.

Wei, C., Liu, Y. C., and Wan, J. B., "Formation of interfacial structure of Sn-3.7Ag-0.9Zn eutectic solder with different Al additions," Journal of Materials Science: Materials in Electronics, vol. 20 no. 9, pp. 861-866, Sept. 2009.

Wei, C., Liu, Y. C., Han, Y. J., Wan, J. B., and Yang, K., "Microstructures of eutectic Sn-Ag-Zn solder solidified with different cooling rates," Journal of Alloys and Compounds, vol. 464 no. 1-2, pp. 301-305, Sept. 22, 2008.

Wei, C. C., Liu, P. C., Chen, Chih, Lee, Jeffrey C.B., and Wang, I Ping, "Relieving Sn whisker growth driven by oxidation on Cu leadframe by annealing and reflowing treatments," Journal of Applied Physics, vol. 102 no. 4, pp. 043521-1-043521-7, Aug. 15, 2007.

Wei, C. C., Liu, P. C., Chen, Chih, Lee, Jeffrey C. B., and Chen, P. C., "Relieving Sn Whisker Growth Driven by Oxidation on Cu Leadframe by Annealing and Reflowing Treatments," 2008 Pan Pacific Microelectronics Symposium & Exhibit, Kauai, HI, Jan. 22-24, 2008, pp. xx-xx.

Wei, Chen, Liu, Yongchang, Gao, Zhiming, Xu, Ronglei, and Yang, Kai, "Effects of aging on structural evolution of the rapidly solidified Sn-Ag-Zn eutectic solder," Journal of Alloys and Compounds, vol. 468 no. 1-2, pp. 154-157, Jan. 22, 2009.

Wei, Chen, Liu, Yongchang, Gao, Zhiming, Ma, Changsheng, and Wan, Jingbo, "Effects of small addition of In on the structure of the rapidly cooled Sn-Ag-Zn solder," Journal of Alloys and Compounds, vol. 470 no. 1-2, pp. 145-149, Feb. 20, 2009.

Wei, Chen, Liu, Yongchang, Gao, Zhiming, Wan, Jingbo, and Ma, Changsheng, "Effects of Thermal Aging on Microstructure and Microhardness of Sn-3.7Ag-0.9Zn-1In Solder," Journal of Electronic Materials, vol. 38 no. 2, pp. 345-350, Feb. 2009.

Wei, G. Q., Du, L. C., Jia, Y. P., and Qi, L., "Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Sn/Cu and Cu/Sn0.7Cu/Cu solder joints," Journal of Materials Science: Materials in Electronics, vol. 26 no. 6, pp. 4313-4317, June 2015.

Wei, G. Q., and Huang, Y. L., "Suppression of interfacial intermetallic compounds between Sn-9Zn solder and Cu-substrate by adding Cu-particles in the solder," Journal of Materials Science: Materials in Electronics, vol. 23 no. 1, pp. 130-135, Jan. 2012.

Wei, Guo-qiang, Ma, Si, Li, Da-lei, Jia, Yin-pei, and Liu, Heng-lin, "Influence of thermomigration on creep behavior of Cu/Sn0.7Cu/Cu solder joint," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 20-24.

Wei, Guo-qiang, Kuang, Min, Yang, Yong-qiang, and Zhao, Li, "Interfacial growth behavior of Sn-9Zn/additive Cu-particles and Sn-9Zn/Cu-substrate," Zhongguo Youse Jinshu Xuebao/ Chinese Journal of Nonferrous Metals, vol. 17 no. 7, pp. 1083-1089, July 2007.

Wei, Guoqiang, Luo, Daojun, Gao, Hongyong, and He, Guanghui, "Effect of Ti on Wettability and Interface Reaction of Sn0.7Cu Lead-free Solder," 2011 International Symposium on Advanced Packaging Materials , Xiamen, China, Oct. 25-28, 2012, pp. 308-312.

Wei, Guoqiang, and Wang, Lei, "Effects of cooling rate on microstructure and microhardness of lead-free Sn-3.0Ag-0.5Cu solder," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 453-456.

Wei, Guoqiang, Luo, Daojun, Shi, Lei, and He, Guanghui, "Influence of multiple reflows and thermal shock on interfacial IMC of solder joints between Sn0.3Ag0.7Cu solder/pads(HASL, OSP, electrolytic Ni/Au and ENIG PCB finishes)," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 302-307.

Wei, Guoqiang, Wan, Zhonghua, Xue, Mingyang, and Wang, Lei, "Investigation on Microstructures and Properties of Low Ag Content Lead-free Solder Alloy," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 87-90.

Wei, Guoqiang, Yao, Jian, and Shi, Yonghua, "The Influence of Electromigration and Aging on the Reliability of SnAgCu Lead-Free Solder Joint at 100°C," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 953-957.

Wei, H. L., Huang, Hanchen, Woo, C. H., Zheng, R. K., Wen, G. H., and Zhang, X. X., "Development of <110> texture in copper thin films," Applied Physics Letters, vol. 80 no. 13, pp. 2290-2292, Apr. 1, 2002.

Wei, He, Huang, Chunyue, and Ying, Liang, "Analysis of Thermal Stress and Strain in BGA Solder Joint Based on Microchannel Ceramic Substrate," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 9 no. 5, pp. 895-904, May 2019.

Wei, Helin, and Wang, Kuisheng, "A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints," Journal of Electronic Materials, vol. 40 no. 11, pp. 2314-2319, Nov. 2011.

Wei, Hsiu-Ping, Yang, Yu-Hsiang, and Han, Bongtae, "Advanced Statistical Model Calibration to Determine Manufacturing-Induced Variations of Effective Elastic Properties of SAC Solder Joints in Leadless Chip Resistor Assemblies," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 9 no. 4, pp. 797-804, Apr. 2019.

Wei, Hsiu-Ping, Yang, Yu-Hsiang, Wu, Bulong, and Han, Bongtae, "Prediction of Statistical Distribution of Vibration-induced Solder Fatigue Failure Considering Intrinsic Variations of Mechanical Properties of Anisotropic Sn-Rich Solder Alloys," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 741-747.

Wei, Lee Xin, Haseeb, A. S. M. A., and Yingxin, Goh, "Effects of Thiourea and Gelatin on the Electrodeposition of Sn-Ag Solder Alloy," 2012 4th Asia Symposium on Quality Electronic Design, Kuala Lumpur, Malaysia, July 10-11, 2012, pp. 291-296.

Wei, Li, Min-Bo, Zhou, Xiao, Ma, and Xin-Ping, Zhang, "Influence of Mixed Rare Earth Addition on the Microstructure of the Sn-Cu-Ni Solder and Interfacial Reaction of Cu/Sn-Cu-Ni/Cu Joints," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 228-232.

Wei, Liu, Chunqing, Wang, Yanhong, Tian, and Mingyu, Li, "Evolution of AuSnx Intermetallic Components in Laser Reflowed Right-angled Solder Joints during Isothermal Aging Process," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Wei, Q., Su, Y., Yang, C. J., Liu, Z. G., Xu, H. N., Xia, Y. D., and Yin, J., "The synthesis of Bi2Te3 nanobelts by vapor-liquid-solid method and their electrical transport properties," Journal of Materials Science, vol. 46 no. 7, pp. 2267-2272, Apr. 2011.

Wei, Quek Kiang, and Meng, Loo Shei, "Manufacturability of Ag wire for Mass production - Challenges and Robustness," 2018 IEEE 38th International Electronics Manufacturing Technology Conference, Melaka, Malaysia, Sept, 4-6, 2018, pp. xx-xx.

Wei, Xiang, and Hawkins, Adrian, "Application of the advanced activator technology on halogen-free lead-free solder paste development," Global SMT and Packaging, vol. 12 no. 6, pp. 12-17, June 2012.

Wei, Xiao-feng, Zhang, Yu-kun, Wang, Ri-chu, and Feng, Yan, "Microstructural evolution and shear strength of AuSn20/Ni single lap solder joints," Microelectronics Reliability, vol. 53 no. 5, pp. 748-754, May 2013.

Wei, Xin, Su, Sinan, Hamasha, Sa'd, Ali, Haneen, Suhling, Jeff, and Lall, Pradeep, "Fatigue Performance of Doped SAC Solder Joints in BGA Assembly," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp. 1035-1042.

Wei, Xiuqin, Huang, Huizhen, Zhou, Lang, and Zhang, Meng, "Effect of Microalloying on Wettability, Oxidation and Solidification Morphology of Sn-9Zn Alloy," Journal of Rare Earths, vol. 23 no. 2, pp. 220-223, Apr. 2005.

Wei, Xiuqin, Li, Yinghui, and Huang, Huizhen, "Effects of Sulfur on the Properties of Sn-9Zn as Lead-Free Solder," Journal of Electronic Materials, vol. 46 no. 2, pp. 1067-1071, Feb. 2017.

Wei, Xiuqin, Huang, Huizhen, Zhou, Lang, Zhang, Meng, and Liu, Xiaodong, "On the advantages of using a hypoeutectic Sn-Zn as lead-free solder material," Materials Letters, vol. 61 no. 3, pp. 655-658, Feb. 2007.

Wei, Y., Chow, C. L., Lau, K. J., Vianco, P., and Fang, H. E., "Behavior of Lead-Free Solder Under Thermomechanical Loading," Journal of Electronic Packaging, Transactions of the ASME, vol. 126 no. 3, pp. 367-373, Sept. 2004.

Wei, Y. Y., and Duh, J. G., "Effect of thermal ageing on (Sn-Ag, Sn-Ag-Zn)/PtAg, Cu/Al2O3 solder joints," Journal of Materials Science: Materials in Electronics, vol. 9 no. 5-6, pp. 373-381, Oct. 1998.

Wei, Yong, and Sancaktar, Erol, "A Pressure Dependent Conduction Model for Electronically Conductive Adhesives," Proceedings 1995 International Symposium on Microelectronics , Los Angeles, CA, Oct. 24-26, 1995, pp. 231-236.

Wei, Yong, and Sancaktar, Erol, "Dependance of Electric Conduction on Film Thickness of Conductive Adhesives," 1995 Proceedings 45th Electronic Components & Technology Conference , Las Vegas, NV, May 21-24, 1995, pp. 701-706.

Wei, Yong, and Sancaktar, Erol, "Dependence of electrical conduction on the film thickness of conductive adhesives: modeling, computer simulation, and experiment," Journal of Adhesion Science and Technology, vol. 10 no. 11, pp. 1199-1219, 1996.

Wei, Yong Wei, and Wei, Ronnie Tan Chin, "Effect of Convection and Conduction Oven to the Intermetallic Formation and Solder Joint Reliability," 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Melaka, Malaysia, Nov. 30-Dec. 2, 2010, pp. xx-xx.

Wei, Yong, Chow, C. L., Vianco, Paul, and Fang, Eliot, "Isothermal Fatigue Damage Model for Lead-free Solder," International Journal of Damage Mechanics, vol. 15 no. 2, pp. 109-119, Apr. 2006.

Wei, Yuhang, Liu, Yingxia, Tan, Chengwen, Zhang, Ji, and Zhao, Xiuchen, "Effect of nano-Ag3Sn additions on wettability, interfacial intermetallic growth and mechanical properties of Zn-30Sn-1Ge solders on Cu substrates," Journal of Materials Science: Materials in Electronics, vol. 31 no. 8, pp. 5796-5806, Apr. 2020.

Wei, Yuhang, Liu, Yingxia, Zhao, Xiuchen, Tan, Chengwen, Dong, Yaru, and Zhang, Ji, "Effects of minor alloying with Ge and In on the interfacial microstructure between Zn-Sn solder alloy and Cu substrate," Journal of Alloys and Compounds, vol. 831, pp. 154812-1-154812-13, Aug. 5, 2020.

Wei, Zhou, Waf, Low Siu, Loo, Neo Yong, Koon, Eng Meow, and Huang, Mark, "Studies on moisture-induced failures in ACF interconnection," Proceedings of 4th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2002, pp. 133-138.

Weide-Zaage, K., Schlobohm, J., Rongen, R. T. H., Voogt, F. C., and Roucou, R., "Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core," Microelectronics Reliability, vol. 54 no. 6-7, pp. 1206-1211, June-July 2014.

Weide-Zaage, Kirsten, "Simulation of Migration Effects in Solder Bumps," IEEE Transactions on Device and Materials Reliability, vol. 8 no. 3, pp. 442-448, Sept. 2008.

Weidler, J. D., Burg, R. D., Decker, J. J., and Constable, J. H., "Electrical Characteristics of an ACF Bond as a Function of Temperature and Humidity Aging," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 906-913.

Weidong, Huang, Changhong, Yu, Cimi, Cui, Dolphin, Zuo, Hongwei, Guo, Chris, Xie, and Majed, Anani, "Capacitor Dendrite Failure Analysis for Lidless CPU Testing," 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 2-6, 2012, pp. xx-xx.

Weiglein, Andre, "Doing what's right and increasing profits too," emsnow, Feb. 22, 2006.

Weihs, Tim, "New Materials and Processes Enable Lead-free Solder," Surface Mount Technology (SMT), vol. 18 no. 3, pp. 50, Mar. 2004.

Weik, H., "Whisker Structure and Tensile Strength," Journal of Applied Physics , vol. 30, pp. 791-792, 1959.

Weil, Rolf, "Characterization of Deposits, Coatings & Electroforms - Part I," Plating & Surface Finishing, vol. 83 no. 9, pp. 49-50, Sept. 1996.

Weinberg, Kerstin, and Bohme, Thomas, "Condensation and Growth of Kirkendall Voids in Intermetallic Compounds," IEEE Transactions on Components and Packaging Technologies, vol. 32 no. 3, pp. 684-692, Sept. 2009.

Weinberger, Christopher R., "Modeling Tin Whisker Growth," Sandia Report 2013-6818, Aug. 2013.

Weiner, Gene H., "US Gov't Should Fight the Proposed TBBPA Ban," Circuits Assembly , vol. 20 no. 9, pp. 4, Sept. 2009.

Weinhold, Michael, "Copper Dissolution: A New Industry Challenge," PCB007, Dec. 2, 2008.

Weinhold, Michael K., "European printed circuit board (PCB) technology and environmental trends: their impact on PCB supply from China," Circuit World, vol. 32 no. 4, pp. 25-27, 2006.

Weinhold, Michael, and Yen, George, "How advanced low coefficient of thermal expansion (CTE) laminates and prepregs can improve the reliability of printed circuit boards (PCBs)," Circuit World, vol. 29 no. 1, pp. 24-31, 2003.

Weinhold, Michael, "The importance of standards for PCBs when doing business in Europe," Circuit World, vol. 33 no. 3, pp. 35-37, 2007.

Weintraub, Bob, "Tin Disease and Ernst Julius Cohen (1869-1944)."

Weiwei, Hu, Xiangkun, Meng, Yufeng, Sun, and Guangyan, Zhao, "Fault Injection and Simulation of the Solder Joint Mechanical Creep in Integrated Circuit," 2014 Pan Pacific Microelectronics Symposium, Kohala Coast, HI, Feb. 11-13, 2014, pp. xx-xx.

Welch III, W. C., and Najafi, K., "Nickel-Tin Transient Liquid Phase (TLP) Wafer Bonding for MEMS Vacuum Packaging," 2007 International Solid-State Sensors, Actuators and Microsystems Conference, Lyon, France, June 10-14, 2007, pp. 1327-1328.

Weller, S. D. T., Jones, I. P., Fox, I. M., and Hirst, T., "High Reliability Pb-Free Printed Circuit Board Assembly," Key Engineering Materials, vol. 450, pp. 9-12, 2011.

Wells, Charles, "Keeping Counterfeit Parts Off the Production Floor," Quality Digest , vol. 28 no. 9, pp. 38-39,41-42, Sept. 2008.

Welsher, T. L., Mitchell, J. P., and Lando, D. J., "CAF in Composite Printed-Circuit Substrates: Characterization, Modeling and a Resistant Material," 18th Annual Reliability Physics Symposium, Las vegas, NV, Apr. 8-10, 1980, pp. 235-237.

Welzel, U., Ligot, J., Lamparter, P., Vermeulen, A. C., and Mittemeijer, E. J., "Stress analysis of polycrystalline thin films and surface regions by X-ray diffraction," Journal of Applied Crystallography, vol. 38 no. 1, pp. 1-29, Feb. 2005.

Welzel, U., and Mittemeijer, E. J., "Stress evolution in thin films, diffusion and reactions," Diffusion and Defect Data. Pt A Defect and Diffusion Forum, vol. 264, pp. 71-78, Apr. 2007.

Welzel, Udo, "Breakthroughs in understanding elastic grain interaction and whisker formation made possible by advances in X-ray power diffraction," International Journal of Materials Research, vol. 102 no. 7, pp. 846-860, 2011. DOI: 10.3139/146.110539

Wen, Fon Bih, Krishnan, Shutesh, and Chan, Yo Meng, "Lead-free Solder Paste Selection and Solder Joint Reliability for Copper Stud Flip Chip," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 80-83.

Wen, Li, Xue, Songbai, Wang, JianXin, Long, Weimin, and Zhong, Shujuan, "Effects of g-ray irradiation on microstructure and mechanical property of AuSn20 solder joint," Journal of Materials Science: Materials in Electronics, vol. 30 no. 10, pp. 9489-9497, May 2019.

Wen, N. T., Chen, F. J., Ger, M. D., Pan, Y. N., and Lin, C. S., "Microstructure of Trivalent Chromium Conversion Coating on Electrogalvanized Steel Plate," Electrochemical and Solid-State Letters, vol. 11 no. 8, pp. C47-C50, 2008.

Wen, Quan-Zhang, Guo, Lei, Qin, Hong-Bo, Li, Wang-Yun, and Yang, Dao-Guo, "The influence of phase inhomogeneity on the current density and temperature gradient in Cu/Sn58Bi/Cu solder joint," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Wen, S., and Szpunar, J. A., "Direct electrodeposition of highly ordered magnetic nickel nanowires on silicon wafer," IET Micro & Nano Letters, vol. 1 no. 2, pp. 89-93, Dec. 2006.

Wen, Shengmin, Keer, Leon M., Mavoori, Hareesh, "Constitutive and Damage Model for a Lead-Free Solder," Journal of Electronic Materials, vol. 30 no. 9, pp. 1190-1196, Sept. 2001.

Wen, Shengmin, "Damage Based Fatigue Criterion for Solders in Electronic Packaging," IEEE Transactions on Components and Packaging Technologies, vol. 28 no. 3, pp. 435-440, Sept. 2005.

Wen, Sheree H., "Optoelectronic Packaging," Journal of Metals, vol. 40 no. 6, pp. 14-17, June 1988.

Wen, Shixue, and Szpunar, Jerzy A., "Cathodic Potential Oscillations of Sn(II) Reduction and Hydrogen Evolution in Acid Stannous Sulfate Solutions," Journal of the Electrochemical Society , vol. 153 no. 3, pp. E45-E51, 2006.

Wen, Shixue, and Szpunar, Jerzy A., "Nucleation and growth of tin on low carbon steel," Electrochimica Acta , vol. 50 no. 12, pp. 2393-2399, Apr. 15, 2005.

Wen, Xuefeng, Li, Jinhui, Hao, Liu, Yin, Fengfu, Hu, Lixiao, Liu, Heping, and Liu, Zhenyu, "An Agenda to Move Forward E-waste Recycling and Challenges in China," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 315-320.

Wen, Xuefeng, Zhou, Xiaohua, and Hu, Hualong, "The New Process in Integrated E-waste Management in China," 2008 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 19-21, 2008, pp. xx-xx.

Wen, Yanni, Zhao, Xiuchen, Chen, Zhuo, Gu, Yue, Wang, Yong, Chen, Zhiwei, and Wang, Xinyuan, "Reliability enhancement of Sn-1.0Ag-0.5Cu nano-composite solders by adding multiple sizes of TiO2 nanoparticles," Journal of Alloys and Compounds , vol. 696, pp. 799-807, Mar. 5, 2017.

Wen, Yu-Hua, Huang, Rao, Zhu, Zi-Zhong, and Wang, Quan, "Mechanical properties of platinum nanowires: An atomistic investigation on single-crystalline and twinned structures," Computational Materials Science, vol. 55, pp. 205-210, Apr. 2012.

Wenchao, Tian, and sanjuan, Wei, "Reliability Analysis of and Experiment Test on SAC305 Solder Balls," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 1134-1138.

Wendrock, Horst, Mirpuri, Kabir, Menzel, Siegfried, Wetzig, Klaus, and Schindler, Gunther, "Formation of Electromigration Defects in Small Damascene Cu Interconnects with Respect to the Microstructure," AIP Conference Proceedings, vol. 741, pp. 173-179, 2004.

Wendrock, Horst, Menzel, S., Koetter, T. G., Rauser, D., and Wetzig, K., "Influence of Grain Boundary Type on Electromigration in Damascene Copper Lines," AIP Conference Proceedings, vol. 612, pp. 86-93, 2002.

Weng, Wei-Lun, Lai, Wen-Hao, Lee, Jheng-Syun, and Liao, Chien-Neng, "Fabrication and Characterization of Copper Nanowires with Dense Nanoscale Twin Boundaries," 2017 IEEE International Interconnect Technology Conference, HsinChu, Taiwan, May 16-18, 2017, pp. xx-xx.

Wengenroth, Karl, Stafstrom, Eric, and Fudala, John, "OSPs: Addressing Future Surface Finishing Needs," 2000 Surface Finishes Forum Conference Proceedings, May 4, 2000, pp. xx-xx.

Wengenroth, Karl, and Stafstrom, Eric, "OSPs: Enabling Advanced Technologies," Printed Circuits Expo 2000 , San Diego, CA, Apr. 2-6, 2000, pp. S03-3-1-S03-3-9.

Wenger, G. M., Machusak, D. A., and Parker, J. L., "Application Model for Organic Solderability Preservatives," Soldering & Surface Mount Technology, vol. 7 no. 2, pp. 6-9, May 1995.

Wenger, George M., Machusak, Donald A., Woods, Robert E., Tashjian, Gregory P., and Hallworth, Thomas M., "Double Reflow: The Stress Fracture Reliability Problem of the 90's," Surface Mount International Proceedings of the Technical Program, San Jose, CA, Aug. 29-31, 1995, pp. 640-646.

Wenger, George M., and Furrow, Robert G., "Immersion Silver Surface Finish: Usage Requirement Test Results & Production Experience," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Wentlent, Luke, Wilcox, Jim, and Dong, Fei, "Assessment of the Behavior of High Reliability Solder Alloys in Accelerated Thermal Testing," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 532-541.

Wentlent, Luke, Yin, Liang, Meilunas, Michael, Arfaei, Babak, and Borgesen, Peter, "Damage Mechanisms and Acceleration Factors for No-Pb LGA, TSOP and QFN Type Assemblies in Thermal Cycling," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 101-110.

Wentlent, Luke, Alghoul, Thaer M., Greene, Christopher M., and Borgesen, Peter, "Effects of Amplitude Variations on Deformation and Damage Evolution in SnAgCu Solder in Isothermal Cycling," Journal of Electronic Materials, vol. 47 no. 5, pp. 2752-2760, May 2018.

Wentlent, Luke A., Genanu, Mohammed, and Alghoul, Thaer, "Effects of Laser Selective Reflow on Solder Joint Microstructure and Reliability," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 425-433.

Wentlent, Luke, Wilcox, Jim, and Meilunas, Michael, "Influence of Dwell Time on the Mechanical Properties of SAC-xBi Solder Joints," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 387-391.

Wentlent, Luke, Schnabl, Karl, Khasawneh, S., Mootoo, K., Owens, J., Jiang, J., Zinn, A. A., Beddow, J., Stoltenberg, R., Chang, J., Hauptfleisch, E., Blass, D., and Borgesen, Peter, "Nanocopper as a Replacement for Solder -- A Question of Reliability?," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 258-268.

Wentlent, Luke, Wilcox, Jim, and Meilunas, Michael, "Reliability Behavior of Surface Mount Devices Assembled with Bismuth Beathing Low-Melt Solder Pastes," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 442-450.

Wentworth, Stuart M., Dillaman, Brian L., Chadwick, Jon R., Ellis, Charles D., and Johnson, R. Wayne, "Attenuation in Silver-Filled Conductive Epoxy Interconnects," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A , vol. 20 no. 1, pp. 52-59, Mar. 1997.

Wenzek, Hagen R., "Turn the WEEE Challenge into a Fresh Opportunity," Electronic Design, vol. 51 no. 6, pp. 24, July 21, 2003.

Werigin, N., Lewkojeff, J., and Tammann, G., "Uber die Ausflussgeschwindigkeit einiger Metalle," Annalen der Physik (Drude's Annalen), vol. 10 no. 3, pp. 647-654, 1903.

Werner, Ingo, "Leiterplattenanschluss fur Gebaudetechnik and Telekommunikation," Elektronik Industrie, vol. 36 no. 4, pp. 40-42, Apr. 2005.

Werner, K., Heinecke, H., Weyers, M., Luth, H., and Balk, P., "Defects in GaAs Films Grown by MOMBE," Journal of Crystal Growth , vol. 81 no. 1-4, pp. 281-287, Feb. 2, 1987.

Werner, Max, "Metallographische Mittelungen aus dem Institut fur physikalische Chemie in Gottingen. LXXXV. Uber die Eigenschaftsanderungen bei den polymorphen Umwandlungen des Thalliums, Zinns, Zinks und Nickels," Zeitschrift fur Anorganische Chemie, vol. 83 no. 3, pp. 275-321, 1913.

Werner, P., "Growth and properties of silicon nanowires for low-dimensional devices," Solid State Phenomena, vol. 131-133, pp. 535-540. Oct. 2007.

Werner, P., Schubert, L., Zakharov, N. D., Gerth, G., Kolb, F. M., and Gosele, U., "Silicon Nanowhiskers Grown on <111> Si Substrates by Molecular Beam Epitaxy," Applied Physics Letters, vol. 84 no. 24, pp. xx-xx, 2004.

Werner, Th., Tidecks, R., and Johnston, B. D., "Whiskers from the In-Pb System: Growth, Handling and Characteristic Properties," Journal of Crystal Growth, vol. 73 no. 3, pp. 467-481, Dec. 1985.

Wernersson, Lars-Erik, "III-V nanowires for logics and beyond," Microelectronic Engineering , vol. 147, pp. 344-348, Nov. 1, 2015.

Wernicki, Evan, and Gu, Zhiyong, "Effect of Sn nanoparticle additions on thermal properties of Sn-Ag-Cu lead-free solder paste," Thermochimica Acta, vol. 690, pp. 178642-1-178642-7, Aug. 2020.

Wertkin, Andrew, "Getting Green and Staying Green," NASA Tech Briefs, vol. 33 no. 10, pp. 14,16-17, Oct. 2009.

Wesselmann, Carl, "Soldering," Surface Mount Technology (SMT), vol. 13 no. 8, pp. 102, 104, 106, Aug. 1999.

Wessely, Frank, Krauss, Tillmann, and Schwalke, Udo, "Reconfigurable CMOS with undoped silicon nanowire midgap Schottky-barrier FETs," Microelectronics Journal, vol. 44 no. 12, pp. 1072-1076, Dec. 2013.

Wessling, B., Thun, M., Arribas-Sanchez, C., Gleeson, S., Posdorfer, J., Rischka, M., Zeysing, B., and Arendt, N., "Ormecon Introduces Nano-Thin PCB Surface Finish--Organic Metal Nanofinish," PCB007, Mar. 25, 2008.

Wessling, B., Rischka, M., and Posdorfer, J., "OrmeSTAR Ultra - the organic metal nanofinish," Circuit World, vol. 36 no. 1, 2010, pp. 14-21.

Wessling, Bernhard, and Posdorfer, Joerg, "Lead-free surface finishes - a comparison of various alternatives with HASL/ New developments in Organic Metal based Immersion Tin," IPC Summit on Surface Finishes, Irvine, CA, Sept. 1999, pp. xx-xx.

Wessling, Bernhard, and Kenny, Jim, "Nanotechnology for Lead-Free PWB Final Finishes with the Organic Metal," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 554-557.

Wessling, Bernhard, Merkle, Holger, Wengenroth, Karl, and Orduz, Mario, "The Re-emergence of Immersion Tin Final Finish," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 924-932.

Wessling, Bernhard, "Use of Organic Metal to enhance the operating window and solderability of immersion tin," Circuit World, vol. 25 no. 4, pp. 8-16, 1999.

West, Jack T., and Bonacker, Franz F., "Characterization of Alkaline Manganese Dioxide Products Containing No Lead Added Zinc Alloys," Proceedings of the 1995 30th Intersociety Energy Conversion Engineering Conference, Orlando, FL, July 30-Aug. 4, 1995, pp. 255-260.

Westcott, Sarah L., Kotov, Nicholas A., Ostrander, John W., Mamedov, Arif A., Reust, Dennis K., and Roark, Joel P., "Corrosion Protection by Multifunctional Stratified Coatings," 2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004, Volume 3 , Boston, MA, Mar. 7-11, 2004, pp. 288-291

Wester, Craig, Midence, Rene, and Cosoreanu, Claudia, "Considerations When Applying Microprocessor Relays In Chemically Harsh Environments," Conference Record of Annual Pulp and Paper Industry Technical Conference, Williamsburg, VA, June 22-27, 2007, pp. 19-24.

Westerlaken, Eli, Diepstraten, Gerjan, Silveri, Bob, and Trip, Harry, "Designing Wave Flux Chemistries," Surface Mount Technology (SMT) , vol. 22 no. 7, pp. 16-18, July 2008.

Westerlaken, Eli, "Running Lead Free Reflow Profiles Without Nitrogen," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S14-01-1-S14-01-9.

Westerlaken, Eli, "Running Pb-Free Reflow Profiles without Nitrogen," Circuits Assembly, vol. 17 no. 5, pp. 42-48, May 2006.

Westervelt, Sarah, "Responsibility lacking for e-waste," Waste News, vol. xx no. x, pp. xx-xx, Feb. 27, 2006.

Westwater, Angus, "BUILD confidence with lead-free knowledge," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, Sept. 2001.

Westwater, Angus, "Lead-Free: get theFAQs," Electronics Manufacture and Test, vol. xx no. xx, pp. xx, Mar. 2004.

Westwater, Angus, "Making The Transition To A Lead-Free PCB Assembly Process," SMART Group 6th Annual Lead-Free Seminar and Table-top Exhibition, High Wycombe, United Kingdom, Feb. 3, 2004.

Westwater, Angus, "SMART Group Ireland Lead-free Seminar," Advanced Manufacturing Technology (AMT), vol. 16 no. 6, pp. 16-18, Dec. 2003/Jan. 2004.

Westwater, Angus, "The Component Manufacturers Perspective: "Achieving Component Reliability During Manufacturing"," Structural Integrity & Reliability in Lead-Free, United Kingdom, Mar. 25, 2004.

Westwater, Angus, "The Component Manufacturers Perspective: "Avoiding Component Failure During Lead-Free Soldering"," Structural Integrity & Reliability in Lead-Free, United Kingdom, Mar. 25, 2004.

Westwater, Angus, "Transition to Lead-Free Components & User Induced Component Failures," SMART Group/NPL Lead Free Seminar 2003, Feb. 23, 2003.

Westwater, J., Gosain, D. P., Tomiya, S., Usui, S., and Ruda, H., "Growth of silicon nanowires via gold/silane vapor-liquid-solid reaction," Journal of Vacuum Science & Technology B: Nanotechnology and Microelectronics: Materials, Processing, Measurement and Phenomena, vol. 15 no. 3, pp. 554-557, May/June 1997.

Westwater, J., Gosain, D. P., Yamauchi, K., and Usui, S., "Nanoscale silicon whiskers formed by silane/gold reaction at 335°C," Materials Letters, vol. 24 no. 1-3, pp. 109-112, June 1995.

Wettermann, Bob, "Simple, Fast, High-Reliability Rework of Leadless Devices," Printed Circuit Design and Fab/ Circuits Assembly, vol 29 no. 8, pp. 30,32-33, Aug. 2012.

Wettermann, Bob, "Simple, Fast High Reliability Rework of Leadless Devices," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 759-763.

Wettermann, Bob, "Step 10: Rework & Repair," Surface Mount Technology (SMT) , vol. 21 no. 11, pp. 24-25, Nov. 2007.

Wetzel, E., "Bruchigwerden von aluminiumhaltigem Zinn," Zeitschrift fur Metallkunde , vol. 14 no. 8, pp. 335-336, Aug. 1922.

Whalley, David C., Williams, David J., Ogunjimi, Yinka, Boyle, Owen A., and Goward, John M., "A Comparison of the Behavior of Isotropic and Anisotropic Conducting Adhesives," Manufacturing Aspects in Electronic Packaging 1993, PED-Vol. 65, EEP-Vol. 5, New Orleans, LA, Nov. 28-Dec. 3, 1993, pp. 81-91.

Whalley, David C, Mannan, Samjid H, and Williams, David J., "Anisotropic conducting adhesives for electronic assembly," Assembly Automation, vol. 17 no. 1, pp. 44-48, 1997.

Whalley, David C., Mannan, Samjid H., and Williams, David J., "Anisotropic conducting adhesives for electronic assembly," Microelectronics International, vol. 16 no. 2, pp. 44-48, 1999.

Whalley, David C., Kristiansen, Helge, and Liu, Johan, "Characterization of Anisotropic Conductive Adhesive Compression During the Assembly Process," Advances in Electronic Packaging 2003, Volume 1 , Maui, Hawaii, July 6-11, 2003, pp. 183-189.

Whalley, David, "Lead free - will it help our environment?." Soldering & Surface Mount Technology, vol. 12 no. 2, pp. xx, 2000.

Wharton, J. A., Wilcox, G. D., and Baldwin, K. R., "An Electrochemical Evaluation of Possible Non-Chromate Conversion Coating Treatments for Electrodeposited Zinc-Nickel Alloys," Transactions of the Institute of Metal Finishing, vol. 77 no. 4, pp. 152-158, July 1995.

Wharton, J. A., Wilcox, G. D., and Baldwin, K. R., "Non-Chromate Conversion Coating Treatments For Electrodeposited Zinc-Nickel Alloys," Transactions of the Institute of Metal Finishing, vol. 74 no. 6, pp. 210-213, Nov. 1996.

Wheatley, Malcolm, "Lack of harmony in RoHS interpretation could be exacerbated if U.S. state governments take action," Manufacturing Business Technology, vol. xx no. xx, pp. xx-xx, Nov. 2005.

Wheeler, Adam, Adams, Jackie, Cole, Marie, Grosskopf, Curtis, Lagler, Jeff, Lau, Sophia, Wilhite, Dale, and Van der Herten, Kurt, "European Union RoHS Recast - Implication for Exemption and Substance Review," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 226-236.

Wheeler, Candace S., Simon, Nakia L., Duranceau, Claudia M., and Winslow, Gerald R., "A Life Cycle Look at End of Life Vehicle Recycling," InLCA/LCN 2006 , Washington, DC, Oct. 4-6, 2006, pp. xx-xx.

Wheeling, Rebecca, Laing, John, Williams, Shelley, and Vianco, Paul, "High-Cycle Fatigue Test Development to Assess Solder Joints," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 355-363.

White, Bill, "Getting connected," Green SupplyLine, June 1, 2006.

White, Roy, and Turner, Ann, "Reliability Challenges and Solutions: An OEM Perspective," Overcoming the Reliability Challenge: An IPC Summit, Andover, MA, Apr. 15, 2008, pp. xx-xx.

Whitehouse, John, "Tin Plating Copper Wire using Stannous Fluoroborate," Finishing Industries, vol. 1 no. 4, pp. 28-29, Apr. 1977.

Whitelaw, R. S., Neu, R. W., and Scott, D. T., "Deformation Behavior of Two Lead-Free Solders: Indalloy 227 and Castin Alloy," Journal of Electronic Packaging, vol. 121 no. 2, pp. 99-107, June 1999.

Whiteman, Lee, "Ask the EMPF Helpline!," empfasis, pp. 5. Jan. 2005.

Whiteman, Lee, "Confessions of a Rookie Manufacturing Engineer," Circuits Assembly , vol. 18 no. 2, pp. 24, Feb. 2007.

Whiteman, Lee, Stong, Jeff, and Alavezos, Debbie, "Converting Wave Soldering Equipment to Pb-Free," Circuits Assembly , vol. 16 no. 8, pp. 34, Aug. 2005.

Whiteman, Lee, "Flexible Manufacturing Systems for Wave and Fountain Wave Soldering," Circuits Assembly, vol. 17 no. 8, pp. 36-39, 41, Aug. 2006.

Whiteman, Lee, and Northam, Riley, "Guidelines for Pb-Free Hand Soldering," Circuits Assembly, vol. 16 no. 9, pp. 48-51, Sept. 2005.

Whiteman, Lee, "Issues and Solutions to Implementing Lead Free Soldering," 2000 Lead Free Symposium Conference Proceedings, 2000, pp. xx-xx.

Whiteman, Lee, "Issues and Solutions to Implementing Lead Free Soldering," Journal of SMT, vol. 13 no. 4, pp. 15-22, Oct. 2000.

Whiteman, Lee, "Issues and Solutions to Implementing Lead Free Soldering," Electronics Manufacturing Productivity Facility TP200106, Nov. 2001.

Whiteman, Lee, "Lead Free Analytical Services," emphasis, pp. 4, 6, Jan. 2005.

Whiteman, Lee, "Lead Free Hand Soldering," empfasis, pp. 4, 6, Apr. 2005.

Whiteman, Lee, "Lead Free Manufacturing," empfasis, pp. xx-xx, Aug. 2003.

Whiteman, Lee, "Lead Free Manufacturing for Navy Systems," empfasis, pp. 1-2, 6, Jan. 2005.

Whiteman, Lee, "Lead Free Processing," empfasis, pp. xx-xx, Sept. 2003.

Whiteman, Lee, "Lead Free Rework," empfasis, pp. xx-xx, Sept. 2003.

Whiteman, Lee, "Lead Free Soldering Process Audit," empfasis, pp. 8-9, Jan. 2005.

Whiteman, Lee, "Mixed Metallurgies," Circuits Assembly, vol. 16 no. 3, pp. 38, Oct. 2005.

Whiteman, Lee, "Reflow Profiling of Power Printed Circuit Boards (PCBs)," empfasis , pp. xx-xx, Feb. 2006.

Whiteman, Lee, "Salt Atmosphere, Temperature Humidity, and Mechanical Shock Environmental Stress Testing Results of the JG-PP / JCAA Lead Free Soldering Program," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 841-845.

Whiteman, Lee, Kwoka, Mark, Cannis, Jeff, O'Brien, Gerald, Hillman, Dave, Toben, Michael, Schetty, Rob, "Test Results from the Lead-free Component Focus Group," 2002 Advanced Technology Symposium Conference Proceedings, 2002, pp. xx-xx.

Whiteman, Lee, "Tin Whiskers Part III," Empfasis, Nov. 2003.

Whiting, Tim, "New Lead Free Terminations For Passive Components," CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. 104-110.

Whitlaw, Keith, Crosby, Jeff, and Toben, Mike, "A New Fine-Grained Matte Pure Tin for Semiconductor Lead Frame Applications," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Whitlaw, Keith, Crosby, Jeff, and Toben, Mike, "A new fine-grained matte pure tin for semiconductor lead-frame applications," Circuit World, vol. 32 no. 1, pp. 23-30, 2006.

Whitlaw, Keith, and Crosby, Jeff, "An Empirical Study into Whisker-Growth of Tin & Tin Alloy Electrodeposits," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 136-147.

Whitlaw, Keith, and Crosby, Jeff, "An Investigation into Methods for Minimising Tin Whisker Growth," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 289-298.

Whitlaw, Keith, Egli, Andre, and Toben, Mike, "Preventing whiskers in electrodeposited tin for semiconductor lead frame applications," Circuit World, vol. 30 no. 2, pp. 20-24, 2004.

Whitley, Allen, "Dell Marketing Perspectives on Halogen-Free Electronics," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Whitmore, Mark, "Lead-free solders - The next environmental challenge?," Soldering & Surface Mount Technology, vol. 5 no. 3, pp. 2, 1993.

Whitney, M., and Corbin, S. F., "Lead Contamination of a Transient Liquid-Phase-Processed Sn-Bi Lead-Free Solder Paste," Journal of Electronic Materials, vol. 35 no. 2, pp. 284-291, Feb. 2006.

Whitney, T. M., Jiang, J. S., Searson, P. C., and Chien, C. L., "Fabrication and Magnetic Properties of Arrays of Metallic Nanowires," Science, vol. 261 no. 5126, pp. 1316-1319, Sept. 3, 1993.

Whittemore, Amanda, and Lasky, Ronald C., "Virtues of Indium as a Thermal Interface Material," Chip Scale Review, vol. 12 no. 3, pp. 56-59, Apr./May 2008.

Whitten, Gordon, "Lead-free Solder Implementation for Automotive Electronics," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 1410-1415.

Whytock, Paul, "Stubble Trouble-Beating Back Those Tin Whiskers," Electronic Design, vol. 57 no. 20, pp. 38, Oct. 1, 2009.

Wibber, John W., "Non-Electrolytic Aluminum Oxide Conversion Coating," Products Finishing, vol. xx no. xx, pp. xx-xx, June 9, 2003.

Wicker, Tippy, "Lead-free? Yes!," Surface Mount Technology (SMT), vol. 17 no. 1, pp. 116, Jan. 2003.

Wickham, M., and Hunt, C., "A Comparison of Automatic Optical Inspection Systems For Use With Lead-Free Surface Mount Assemblies," NPL Report MATC(A)119, July 2002.

Wickman, M., Brewin, A., Zou, L., and Hunt, C. P., "Code of Practice for the Use of Electronic Components and PCBs in Lead-Free Processing," NPL Report MATC(A)141, Apr. 2003.

Wickham, M., Dusek, M., Zou, L., and Hunt, C., "Effect of Voiding on Lead-Free Reliability," NPL Report DEPC-MPR 033, Apr. 2005.

Wickham, M., and Hunt, C., "Evaluation of the Ability of Conformal Coatings to Inhibit Tin Whiskering," NPL Report MAT 36, Sept. 2009.

Wickham, M., Dusek, M., Zou, L., and Hunt, C. P., "Improving the Processability of Noble Metal Component Termination Finishes." NPL Report CMMT(A)199, Aug. 1999.

Wickham, M., Zou, L., and Hunt, C., "Measuring the Effect on Isotropic Electrically Conductive Adhesive Reliability of Substrate and Component Finishes," NPL Report DEPC MPR 031, Aug. 2005.

Wickham, M., Zou, L., Dusek, M., and Hunt, C., "Measuring the Impact of Component Solderability on Lead-Free Solder Joint Reliability," NPL Report DEPC-MPR 038, Nov. 2005.

Wickham, M., Zou, L., Dusek, M., and Hunt, C. P., "Measuring the Impact of Land Size and Solder Joint Volume on Lead-free Solder Joint Reliability," NPL Report DEPC-MPR 044, Mar. 2006.

Wickham, M., Zou, L., Dusek, M., and Hunt, C., "Measuring the Reliability of Electronics Assemblies During the Transition Period to Lead-Free Soldering," NPL Report DEPC-MPR 030, Aug. 2005.

Wickham, M., Zou, L., and Hunt, C. P., "Measuring the Reliability of Technology Demonstrator Manufactured with Isotropic Electrically Conductive Adhesives," NPL Report DEPC-MPR 046, Dec. 2006.

Wickham, M., Zou, L., and Hunt, C. P., "Measuring the Effect on Isotropic Electrically Conductive Adhesive Reliability of Joint Design Characteristics," NPL Report DEPC-MPR 045, Mar. 2006.

Wickham, M., Salter, M., Ridler, N., Dusek, M., and Hunt, C., "On-wafer Testing of PCB Tracks as CPW Lines as a Production Assessment Method for Anisotropic Conductive Film Bonding," NPL Report MAT 18, Apr. 2008.

Wickham, M., Zou, L., and Hunt, C., "Preliminary Measurements for Thermoplastic Electronics: Developing a Stress Screening Test," NPL Report MAT 6, Nov. 2007.

Wickham, M., and Hunt, C., "Relative Reliability Measurements for Electrically Conductive Adhesive Joints on Subtractive Thermoplastic Substrates," NPL Report MN 2, May 2007.

Wickham, M., Dusek, M., and Hunt, C., "Reliability of Electronic Substrates After Processing at Lead-free Soldering Temperatures," NPL Report MAT 10, Dec. 2007.

Wickham, M., Hunt, C., Birch, B., and Furlong, J., "Reliability of Electronic Substrates After Processing at Lead-free Soldering Temperatures; Part 2," NPL Report MAT 38, Mar. 2010.

Wickham, M., and Hunt, C., "Test Method for Measurement of the Propensity for Conformal Coatings to Inhibit Tin Whiskering," NPL Report MAT 28, Dec. 2008.

Wickham, M. J., and Hunt, C. P., "Thermal Profiling of Electronic Assemblies," NPL Report MATC(A)50, Sept. 2001.

Wickham, Martin, Lewis, Adam, and Clayton, Kate, "1000 Days of Testing Tin Whiskering PCB Assemblies to Determine the Suitability of Conformal Coatings to Mitigate Against Shorting," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 1007-1014.

Wickham, Martin, Lewis, Adam, and Clayton, Kate, "1000 Days of Testing Tin Whiskering PCB Assemblies to Determine the Suitability of Conformal Coatings to Mitigate Against Shorting," SMTA Journal, vol. 30 no. 4, pp. 22-30, 2017.

Wickham, Martin, Lewis, Adam, Clayton, Kate, and Thomas, Owen, "1000 Days of Tin Whiskers Testing Using Conformal Coatings as a Mitigation," 8th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Noordwijk, the Netherlands, May 10-12, 2017, pp. xx-xx.

Wickham, Martin, Nottay, Jaspal, and Hunt, Christopher, "A Review of Mechanical Test Method Standards for Lead-Free Solders," NPL Report MATC(A)69, Oct. 2001.

Wickham, Martin, Zou, Ling, and Hunt, Christopher, "An Assessment of the Suitability of Current PCB Laminates to Withstand Lead-free Reflow Profiles," NPL Report MATC(A)91, Apr. 2002.

Wickham, Martin, "Approaches for stencil printing of conductive and non-conductive adhesives," Advanced Printing Technology Conference, United Kingdom. June 25, 2002.

Wickham, Martin, "Are Supply Chains Ready?," Microelectronics News, no. 20, pp. 2, Autumn 2004.

Wickham, Martin, "Can Conductive Adhesives Do the Job?," Microelectronics News , no. 22, pp. 3, Winter 2006.

Wickham, Martin, "Champagne Voiding Causes," Printed Circuit Design and Fab/ Circuits Assembly, vol. 35 no. 5, pp. 36, May 2018.

Wickham, Martin, "Concern Over Barrel-cracking," Microelectronics News, no. 22, pp. 2, Winter 2006.

Wickham, Martin, Zou, Ling, and Hunt, Chris, "Developing a Stress Screening Regime for Isotropic Electrically Conductive Adhesives," NPL Report DEPC-MPR 005, July 2004.

Wickham, Martin, Fry, Tony, and Hunt, Chris, "Developing a Test Method to Characterise Internal Stress in Tin Coatings: Phase 1," NPL Report MATC(A)148, Oct. 2003.

Wickman, Martin, Fry, Tony, Gohil, Dipak, and Hunt, Chris, "Developing a Test Method to Characterise Internal Stress in Tin Coatings: Phase 2," NPL Report DEPC-MPR 014, Jan. 2005.

Wickham, Martin, Thomas, Owen, Clayton, Kate, Lewis, Adam, and Hunt, Chris, "How Good Are Conformal Coatings at Preventing Sn Whisker Failures?," National Physical Laboratory, July 20, 2016.

Wickham, Martin, "Issues with Device Reliability after Pb-free Processing?," SMART Group Lead-Free Seminar 2000, High Wycombe, UK, Feb. 10, 2000.

Wickham, Martin, "Lead-Free Transition Reliability," Microelectronics News, no. 20, pp. 4, Autumn 2004.

Wickham, Martin, "Measurement Methods for Electrically Conducting Adhesives," Microelectronics News, no. 18, pp. 4, Dec. 2003.

Wickham, Martin, Thomas, Owen, Clayton, Kate, and Hunt, Chris, "Measurement of tin whisker growth on printed circuit board assemblies and the effect of mitigation techniques," 6th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Oberpfaffenhofen, Germany, Apr. 15-16, 2015, pp. xx-xx.

Wickham, Martin, Zou, Ling, and Hunt, Christopher, "Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive joints," Soldering & Surface Mount Technology, vol. 21 no. 4, pp. 12-18, 2009.

Wickham, Martin, Jennett, Nigel, Nunn, John, Gohil, Dipak, and Hunt, Chris, "Measuring Tin Whiskering Propensity: Measuring Internal Stress in Tin Coatings by Nanoindentation," NPL Report MAT 29, Mar. 2009.

Wickham, Martin, Kent, Laura, Lewis, Adam, and Clayton, Kate, "New Results from National Physics Laboratory Whiskers Study - up to 5 years of testing," 10th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Villepinte, France, May 15-16, 2019, pp. xx-xx.

Wickham, Martin, "Nothing Lost from Voiding," Microelectronics News, no. 22, pp. 3, Winter 2006.

Wickham, Martin, "PCB Laminate Cracking," Printed Circuit Design and Fab/ Circuits Assembly, vol. 35 no. 6, pp. 39, June 2018.

Wickham, Martin, "Pitfalls to Lead-free Soldering," Microelectronics News, no. 16, pp. 3, Jan. 2003.

Wickham, Martin, Lea, Deborah, Nottay, Jaspal, and Hunt, Chris, "Processability of Lead-Free Component Termination Materials," NPL Report MATC(A)47, Aug. 2001.

Wickham, Martin, "Promising ICA demonstrator performance," Microelectronics News , no. 23, pp. 3, Winter 2006.

Wickham, Martin, "Relative Reliability of ECA Joints," Microelectronics News, no. 24, pp. 4, Winter 2007.

Wickham, Martin, Brewin, Alan, and Hunt, Christopher, "Rework of Mixed Lead-Free Alloys - A Guide," NPL Report MATC(A)106, Apr. 2002.

Wickman, Martin, Clayton, Kate, Hunt, Chris, and Dunn, Barrie, "Sn Whiskers and their Mitigation for Space, Aerospace and Defence Electronics," 5th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Noordwijk, The Netherlands, May 2014, pp. xx-xx.

Wickham, Martin, "Solder Fillet Tearing," Printed Circuit Design and Fab/ Circuits Assembly, vol. 33 no. 10, pp. 51, Oct. 2016.

Wickham, Martin, "Stress Screening for Conductive Adhesives," Microelectronics News , no. 21, pp. 4, Spring 2005.

Wickham, Martin, "Test Refinements for Conducting Adhesives," Microelectronics News , no. 19, pp. 2, July 2004.

Wickham, Martin, "The Attraction of Sn Whiskers," 4th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Aalborg, Denmark, May 29, 2013.

Wickham, Martin, "The Impact of Lead-Free Solders on Inspection & Test," NEPCON UK , Birmingham, United Kingdom, Apr. 3-5, 2001.

Wickham, Martin, "Tin Whiskers on PCBs," Printed Circuit Design and Fab/ Circuits Assembly, vol. 35 no. 4, pp. 89, Apr. 2018.

Wickham, Martin, Gopee, Vimal, Lewis, Adam, Clayton, Kate, and Thomas, Owen, "Tin Whiskers Testing Using Conformal Coatings as a Mitigation," Tin Whisker Group teleconference, July 19, 2017.

Wickham, Martin, "Transition Worries Eased," Microelectronics News, no. 22, pp. 2, Winter 2006.

Wickham, Martin, "Voiding: Occurence and reliability issues with lead-free."

Wickham, Martin, and Hunt, Christopher, "XRF Equipment as a RoHS Screening Tool," Circuits Assembly, vol. 19 no. 2, pp. 26, 28, 30, 32, Feb. 2008.

Wickham, Martin, and Hunt, Christopher, "XRF Measurement of Residual Materials in Electronics," NPL Report MAT4, Aug. 2007.

Wickham, Martin, "XRF - Proven RoHS Screening Tool," Microelectronics News, no. 24, pp. 5, Winter 2007.

Widmer, Rolf, Oswald-Krapf, Heidi, Sinha-Khetriwal, Deepali, Schnellmann, Max, and Boni, Heinz, "Global perspectives on e-waste," Environmental Impact Assessment Review, vol. 25 no. 5, pp. 436-458, July 2005.

Wiedersich, H., "Growth of Whiskers by Reduction of Halogenides," Journal of the Electrochemical Society, vol. 106 no. 9, pp. 810-815, Sept. 1959.

Wiegler, Laurie, "Taking the lead," Engineering & Technology, vol. 1 no. 2, pp. 26-27, May 2006.

Wielage, B., Weber, D., and Lampke, Th., "Beurteilung von Loten und Lotverbindungen unter dem Einfluss steigender Kupfergehalte in verunreinigten bleifreien Lotbadern," Materialwissenschaft und Werkstofftechnik, vol. 39 no. 1, pp. 66-74, Jan. 2008.

Wierzbicka-Miernik, A., Garzel, G., and Zabdyr, L. A., "Emf Measurements in the Liquid Au-Cu-Sn Lead-free Solder Alloys," Journal of Phase Equilibria and Diffusion, vol. 31 no. 1, pp. 34-36, Feb. 2010.

Wierzbicka-Miernik, A., Miernik, K., Wojewoda-Budka, J., Szyszkiewicz, K., Filipek, R., Litynska-Dobrzynska, L., Kodentsov, A., and Zieba, P., "Growth kinetics of the intermetallic phase in diffusion-soldered (Cu-5 at.%Ni)/Sn/(Cu-5 at.%Ni) interconnections," Materials Chemistry and Physics, vol. 142 no. 2-3, pp. 682-685, Nov. 15, 2013.

Wierzbicka-Miernik, A., Miernik, K., Filipek, R., and Szyszkiewicz, K., "Kinetics of intermetallic phase growth and determination of diffusion coefficients in solid-solid-state reaction between Cu and (Sn+1at.%Ni) pads," Journal of Materials Science, vol. 52 no. 17, pp. 10533-10544, Sept. 2017.

Wierzbicka-Miernik, Anna, Miernik, Krzysztof, Wojewoda-Budka, Joanna, Litynska-Dobrzynska, Lidia, and Garzel, Grzegorz, "Microstructure and chemical characterization of the intermetallic phases in Cu/(Sn,Ni) diffusion couples with various Ni additions," Intermetallics , vol. 59, pp. 23-31, Apr. 2015.

Wiese, S., Feustel, F., and Meusel, E., "Characterisation of constitutive behaviour of SnAg, SnAgCu and SnPb solder in flip chip joints, Sensors and Actuators A: Physical, vol. 99 no. 1-2, pp. 188-193, Apr. 30, 2002.

Wiese, S., and Meusel, E., "Characterization of Lead-Free Solders in Flip Chip Joints," Journal of Electronic Packaging, Transactions of the ASME, vol. 125 no. 4, pp. 531-538, Dec. 2003.

Wiese, S., Kramer, F., Krause, M., Bennemann, S., Muller, M., Rollig, M., Petzold, M., and Wolter, K.-J., "Compositional Effects on the Creep Properties of SnAgCu Solder," 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Como, Italy, Apr. 24-26, 2006, pp. xx-xx.

Wiese, S., Schubert, A., Walter, H., Dukek, R., Feustel, F., Meusel, E., and Michel, B., "Constitutive Behaviour of Lead-free Solders vs. Lead-containing Solders - Experiments on Bulk Specimens and Flip-Chip Joints," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 890-902.

Wiese, S., Roellig, M., and Wolter, K.-J., "Creep of Eutectic SnAgCu in Thermally Treated Solder Joints," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 1272-1281.

Wiese, S., Roellig, M., and Wolter, K.-J., "Creep of Thermally Aged SnAgCu-Solder Joints," Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, Apr. 18-20, 2005, pp. 79-85.

Wiese, S., and Wolter, K.-J., "Creep of thermally aged SnAgCu-solder joints," Microelectronics Reliability, vol. 47 no. 2-3, pp. 223-232, Feb.-Mar. 2007.

Wiese, S., Meier, K., Scholz, D., Muller, A., Rollig, M., Rzepka, S., and Wolter, K.-J., "Experimental Determination of Time-Independent Elastic-Plastic Behaviour of Solder Joints at High Strain Rates," Proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, London, England, Apr. 15-18, 2007, pp. xx-xx.

Wiese, S., and Wolter, K. -J., "Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders," Microelectronics Reliability, vol. 44 no. 12, pp. 1923-1931, Dec. 2004.

Wiese, S., Mueller, M., Cap, D., Barth, D., Yuile, A., Schindler, S., and Panchenko, I., "Temperature evaluation of solder joints for adjusting reflow profiles," 2019 22nd European Microelectronics and Packaging Conference & Exhibition, Pisa, Italy, Sept. 16-19, 2019. pp. xx-xx.

Wiese, S., Mueller, M., Panchenko, I., Metasch, R., and Wolter, K-J., "The Creep Behaviour and Microstructure of ultra small Solder Joints," 2011 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Linz, Austria, Apr. 18-20, 2011, pp. xx-xx.

Wiese, S., Roellig, M., Mueller, M., and Wolter, K.-J., "The effect of downscaling the dimensions of solder interconnects on their creep properties," Microelectronics Reliability, vol. 48 no. 6, pp. 843-850, June 2008.

Wiese, S., Roellig, M.. Mueller, M., Rzepka, S., Nocke, K., Luhmann, C., Kraemer, F., Meier, K., and Wolter, K.-J., "The Influence of Size and Composition on the Creep of SnAgCu Solder Joints," 1st Electronics Systemintegration Technology Conference, Volume 2 , Dresden, Germany, Sept. 5-7, 2006, pp. 912-925.

Wiese, S., Mueller, M., Panchenko, I., Metasch, R., Roellig, M., and Wolter, K-J., "The scaling effect on microstructure and creep properties of Sn-based solders," 2010 3rd Electronic System-Integration Technology Conference , Berlin, Germany, Sept. 13-16, 2010, pp. .

Wiese, S., Roellig, M., Mueller, M., Bennemann, S., Petzold, M., and Wolter, K.-J., "The Size Effect on the Creep Properties of SnAgCu-Solder Alloys," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 548-557.

Wiese, Steffen, Meusel, Ekkehard, and Wolter, Klaus-Juergen, "Microstructural Dependence of Constitutive Properties of Eutectic SnAg and SnAgCu Solders," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 197-206.

Wieser, Christian, Hugel, Werner, Walnsch, Alexander, and Leineweber, Andreas, "Two-Phase n'+n Region in Cu6Sn5 Intermetallic: Insight into the Order-Disorder Transition from Diffusion Couples," Journal of Electronic Materials, vol. 49 no. 1, pp. 245-256, Jan. 2020.

Wiest, C., Blattau, N., Wright, J., Schatz, R., and Hillman, C., "Robustness of Surface Mount Aluminum Electrolytic Capacitors When Subjected to Pb-Free Reflow," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Wigand, Albert, "Uber die Spezifische Warme des Grauen Zinns und die Richarzsche Regel," Zeitschrift fur Elektrochemie, vol. 20 no. 2, pp. 38-39, Jan. 15, 1914.

Wigand, Albert, "Uber spezifische Warme und spezifisches Gewicht der allotropen Modifikationen fester Elemente," Annalen der Physik, vol. 22, pp. 64-98, 1907.

Wilcox, Allan, "The Black and White of Immersion Tin," Printed Circuit Design and Fab, vol. 26 no. 7, pp. 18-19, July 2009.

Wilcox, G. D., and Wharton, J. A., "A Review of Chromate-free Passivation Treatments for Zinc and Zinc Alloys," Transactions of the Institute of Metal Finishing, vol. 75 no. 6, pp. B140-B142, Nov. 1997.

Wilcox, G. D., "Electrodeposition - a versatile tool for the surface engineer," Transactions of the Institute of Metal Finishing, vol. 85 no. 1, pp. 8-13, Jan. 2007. https://doi.org/10.1179/174591907X171945

Wilcox, G. D. Gabe, D. R., and Warwick, W. E., "Molybdate passivation treatment for tinplate," Transactions of the Institute of Metal Finishing, vol. 66 no. 3, pp. 89-91, Aug. 1988.

Wilcox, G. D., "Replacing Chromates for the Passivation of Zinc Surfaces," Transactions of the Institute of Metal Finishing, vol. 81 no. 1, pp. B13-B15, Jan. 2003.

Wilcox, G. D., "Whiskers," Transactions of the IMF, vol. 88 no. 2, pp. 81-82, 2010. https://doi.org/10.1179/174591910X12646066373883

Wilcox, J. R., Godown, T. C., and Adams, J. A., "Mixed Assembly: A Lead Free Transition Strategy for Servers," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics , Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Wilcox, Jim, Dearing, Glenn, Smith, Brian, Skoczowski, Thomas, Sack, Thilo, and Sullivan, Bob, "Accelerated Reliability Testing and Analysis of Lead-Free Solder Interconnects," IPC Printed Circuits Expo, APEX and the Designer Summit , Anaheim, CA, Feb. 8-10, 2006, pp. S24-02-1-S24-02-17.

Wilcox, Jim, Coyle, Richard, Lehman, Lawrence, and Smetana, Joe, "Effect of Isothermal Preconditioning on Thermal Fatigue Life and Microstructure of a SAC305 BGA," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 122-133.

Wilcox, Jim, Mutuku, Francis, Shao, Shuai, and Arfaei, Babak, "Effect of Solder Composition, PCB Surface Finish and Solder Joint Volume on Drop-Shock Reliability," Surface Mount Technology (SMT), vol. 32 no. 1, pp. 30,32-34,36-40,42-45, Jan. 2017.

Wilcox, Jim, Coyle, Richard, Read, Pete, Meilunas, Michael, and Popowich, Richard, "The Influence of Die Size and Distance from Neutral Point on the Thermal Fatigue Reliability of a Chip Array BGA," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 535-544.

Wilcoxon, Ross, and Hillman, Dave, "Conformal Coatings and Area Array Components," Advancing Microelectronics, vol. 44 no. 5, pp. 20-24, Sept./Oct. 2017.

Wild, M. J., and Blair, A., "Palladium-Nickel Plating," Plating and Surface Finishing, vol. 70 no. 11, pp. 32-34, Nov. 1983.

Wild, P., Lorenz, D., Grozinger, T., and Zimmermann, A., "Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation," Microelectronics Reliability, vol. 85, pp. 163-175, June 2018.

Wild, P., Grozinger, T., Lorenz, D., and Zimmermann, A., "Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates," IEEE Transactions on Reliability, vol. 66 no. 4, pp. 1229-1237, Dec. 2017.

Wilde, Jurgen, and Zukowski, Elena, "Comparative Sensitivity Analysis for uBGA and QFN reliability," Proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems , London, England, Apr. 15-18, 2007, pp. xx-xx.

Wilding, Ian J., and Jackson, Gavin J., "High-Reliability, Pb-Free, Halogen-Free Solder," South East Asia Technical Training Conference on Electronics Assembly Technologies 2014 Proceedings, Penang, Malaysia, Apr. 8-10, 2014, pp. xx-xx.

Wilding, Ian J., and Jackson, Gavin J., "High-Reliability, Pb-free, Halogen-free Solder," Surface Mount Technology (SMT), vol. 29 no. 11, pp. 56,58-60,62-64,66-67, Nov. 2014.

Wilding, Ian, and Jackson, Gavin, "High-Reliability Meets Pb-free and Halogen-Free The Ultimate Solder Material Trifecta."

Wilding, Ian J., and Jackson, Gavin J., "High-Reliability Pb-Free Halogen-Free Solder," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 378-383.

Wilding, Ian, "Pb-free Soldering," SMART Group Ireland Lead-Free Wave Soldering Workshop, Dublin, Ireland, Feb. 24, 2005.

Wilks, Neil, "Recycling guidelines," Professional Engineering, vol. 18 no. 19, pp. 24-25, Oct. 19, 2005.

Willems, B., Dewulf, W., and Duflou, J. R., "Can large-scale disassembly be profitable? A linear programming approach to quantifying the turning point to make disassembly economically viable," International Journal of Production Research, vol. 44 no. 6, pp. 1125-1146, Mar. 15, 2006.

Willems, Geert, and Watte, Piet, "Predicting PCB delamination in lead-free assembly," Global SMT and Packaging, vol. 10 no. 9, pp. 10-12,14,16, Sept. 2010.

Willey, John R., "Functional Single-Cell Trivalent Chromium Electroplating Method," Metal Finishing, vol. 104 no. 11, pp. 37-40, Nov. 2006.

Williams, Alun, "Ask Dr RoHS: problems with lead-free BGA solder balls," Electronics Weekly, Apr. 20, 2006.

Williams, Alun, "China: Partially leaded, partially unleaded," Electronics Weekly , Oct. 27, 2005.

Williams, Alun, "Demonstrating compliance with the RoHS Directive," Electronics Weekly, Nov. 25, 2005.

Williams, Alun, "Enforcing RoHS on firms outside the EU," Electronics Weekly , Oct. 18, 2005.

Williams, Alun, "EuP Directive compliance webcast made available," Electronics Weekly, Oct. 26, 2007.

Williams, Alun, "How is Europe tackling RoHS legislation?," Electronics Weekly , Mar. 27, 2007.

Williams, Alun, "Lead-free soldering means changes," Electronics Weekly, Mar. 3, 2005.

Williams, Alun, "MEPs call "foul" on Pb-free exemptions," Electronics Weekly, Mar. 8, 2005.

Williams, Alun "Poll Results: On lead-free hand soldering," Electronics Weekly , Sept. 7, 2010.

Williams, Alun, "RoHS makes impact on circuit design," Electronics Weekly, Apr. 2, 2007.

Williams, Alun, "The RoHS Directive and UK RoHS regulations," Electronics Weekly , July 26, 2007.

Williams, Alun, "Tin whiskers brush with RoHS," Electronics Weekly, Feb. 18, 2005.

Williams, Alun, "WEEE Directive in full force from Sunday," Electronics Weekly , June 29, 2007.

Williams, Alun, "WEEE regulations: are you covered?," Electronics Weekly, Nov. 8, 2007.

Williams, Chandra, Tan, Kok Ee, and Pang, John H. L., "Thermal Cycling Fatigue Analysis of SAC387 Solder Joints," 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June 2-5, 2010, pp. xx-xx.

Williams, Curt, "Key Issues in Supporting Customers not Transitioning to Lead Free," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 815-817.

Williams, Curt, "Key Issues in Supporting Customers Not Transitioning To Pb-Free," Circuits Assembly, vol. 17 no. 12, pp. 32-35, Dec. 2006.

Williams, D. J., Whalley, D. C., Boyle, O. A., and Ogunjimi, A. O., "Anisotropic Conducting Adhesives for Electronic Interconnection," Soldering & Surface Mount Technology, vol. 5 no. 2, pp. 4-8, 1993.

Williams, David, and Stutz, Andreas, "Lead-free Bright Tin Plating for Barrel and Rack Applications for Connectors," Finishing, vol. 27 no. 11, pp. 34-37, Nov. 2003.

Williams, David J., and Whalley, David C., "The effects of conducting particle distribution on the behavior of anisotropic conducting adhesives: non-uniform conductivity and shorting between connections," Journal of Electronics Manufacturing, vol. 3 no. x, pp. 85-94, 1993.

Williams, Diana, "New Environmentally Friendly Materials and Processes: Flexible Circuit Materials," The Board Authority, vol. xx no. xx, pp. 20-22, 2005.

Williams, Eric, Babbitt, Callie, Matthews, H. Scott, and Weber, Christopher, "Comment on "Comparative Assessment of Life Cycle Assessment Methods Used for Personal Computer"," Environmental Science & Technology, vol. 45 no. 16, pp. 7096-7097, Aug. 15, 2011.

Williams, Eric, "Energy Intensity of Computer Manufacturing: Hybrid Assessment Combining Process and Economic Input-Output Methods," Environmental Science & Technology, vol. 38 no. 22, pp. 6166-6174, 2004.

Williams, Eric, Kahhat, Ramzy, Allenby, Braden, Kavazanjian, Edward, Xu, Ming, and Kim, Junbeum, "Sustainability review of the international reverse chain for reuse and recycling of computers," 2008 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 19-21, 2008, pp. xx-xx.

Williams, J. A. S., "A review of electronics demanufacturing processes," Resources, Conservation, and Recycling, vol. 47 no. 3, pp. 195-208, June 2006.

Williams, J. J., Chapman, N. C., and Chawla, N., "Mechanisms of Sn Hillock Growth in Vacuum by In Situ Nanoindentation in a Scanning Electron Microscope (SEM)." Journal of Electronic Materials , vol. 42 no. 2, pp. 224-229, Feb. 2013.

Williams, James, "Lead-Free Implications for Barcode Labels," Circuits Assembly, vol. 15 no. 2, pp. 58-61, Feb. 2004.

Williams, James R., "Lead free soldering and the implications for barcode labels," Global SMT & Packaging, vol. 4 no. 9, pp. 44-46, Oct. 2004.

Williams, Jim, "Overcoming Product Identification Challenges," Surface Mount Technology (SMT), vol. 21 no. 1, pp. 44, Jan. 2007.

Williams, Jim, "Product Identification," Lead-Free Magazine, vol. 3, Feb. 2005.

Williams, Jim, "Product Identification," Lead-Free Magazine, Feb. 2005.

Williams, Lawson, "The Trend Toward Pd/Ni Contacts in High Density Interconnects," Technical Conference Proceedings AESF SUR/FIN, Detroit, MI, June 23-26, 1997, pp. 339-342.

Williams, M. E., Moon, K.-W., Boettinger, W. J., Josell, D., and Deal, A. D., "Hillock and Whisker Growth on Sn and SnCu Electrodeposits on a Substrate Not Forming Interfacial Intermetallic Compounds," Journal of Electronic Materials, vol. 36 no. 3, pp. 214-219, Mar. 2007.

Williams, M. E., Johnson, C. E., Moon, K.-W., Stafford, G. R., Handwerker, C. A., and Boettinger, W. J., "Whisker Formation on Electroplated Sn-Cu," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 148-159.

Williams, Maureen, and Boguslavsky, Irina, "NEMI Sn Whisker Modeling Group Part 2: Future Work," IPC/NEMI Meeting, New Orleans, LA, Nov. 7, 2002, pp. xx-xx.

Williams, Steve, "View from the Middle," CircuiTree, vol. 19 no. 2, pp. xx-xx, Feb. 2006.

Williams, W. Lee, "Gray Tin Formation in Soldered Joints Stored at Low Temperatures," Symposium on Solder (ASTM Special Technical Publication No. 189), Atlantic City, NJ, June 19-20, 1956, pp. 149-158.

Williamson, D. M., Field, J. E., Palmer, S. J. P., and Siviour, C. R., "Rate dependent strengths of some solder joints," Journal of Physics D: Applied Physics, vol. 40 no. 15 , pp. 4691-4700, Aug. 7, 2007.

Williamson, Jaimal M., Ostrowicki, Gregory T., Gupta, Vikas, Gurrum, Siva P., and Zhang, Andy, "Impact of Lead Free Solder Joint Orientation on Multi-terminal Passive Components during FCBGA Board Level Reliability," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 1112-1118.

Williard, Nicholas, Chauhan, Preeti, Srinivas, Vikram, Osterman, Michael, Pecht, Michael, and Farrell, Robert, "Thermal Cycling Reliability of Package on Packages Assembled by One-Pass and Two-Pass Techniques," SMTA International 2010 Conference Proceedings , Orlando, FL, Oct. 24-28, 2010, pp. 44-51.

Willis, Bob, "A Beginner's Guide to Lead-Free Production," Circuits Assembly , vol. 15 no. 3, pp. xx-xx, Mar. 2004.

Willis, Bob, "A Need for Change: Addressing lead-free component problems," Circuits Assembly, vol. 15 no. 1, pp. xx-xx, Jan. 2004.

Willis, Bob, "Addressing lead-free component problems," Circuits Assembly, vol. 14 no. 10, pp. xx-xx, Oct. 2003.

Willis, Bob, "Auditing a contract manufacturer for lead-free capability," Dataweek, vol. xx no. xx, pp. xx-xx, Sept. 20, 2006.

Willis, Bob, "Auditing an EMS Firm for Pb-free Capability," Circuits Assembly (Online Exclusive), vol. 16 no. 10, pp. 1, Oct. 2005.

Willis, Bob, "Baking printed circuit boards - why and how?," Global SMT & Packaging, vol. 4 no. 2, pp. 4-5, Feb. 2004.

Willis, Bob, "Benchmarking & PPM Monitoring your Process," SMART Group Scotland - Electronics Manufacturing - Competing in a Global Economy & Tabletop Exhibition, Livingston, Scotland, Apr. 1, 2004.

Willis, Bob, "Bob Willis Guide to Solder Spots - A New Plague in Manufacture?"

Willis, Bob, "Classification of Quality Standards," P19.

Willis, Bob, "Classification of Quality Standards," P20.

Willis, Bob, "Component Counterfeiting - The Problem, Cost & Practical Solutions (Tutorial 7)," SMTA International 2010 Conference, Orlando, FL, Oct. 24-28, 2010.

Willis, Bob, "Disappearing Solder with a Lead-Free Process."

Willis, Bob, Hunter, Phil, and Porter, John, "Evaluation of Bare-Board Finishes," Printed Circuit Fabrication, vol. 16 no. 12, pp. 52-54, Dec. 1993.

Willis, Bob, "Evaluation of Solderable Finishes for Surface Mount and Fine Pitch Assembly 1996 for Shipley Europe Limited."

Willis, Bob, "Guide to Soldering & De-Soldering Lead-Free Conventional & Surface Mount Components."

Willis, Bob, "Hand Soldering Through Hole Components with Lead-Free Solders," Global SMT & Packaging, vol. xx no. xx, pp. 4-5, Sept. 2003.

Willis, Bob, "Hand Soldering with Lead-Free Solders."

Willis, Bob, "Intrusive reflow with SNIC paste," Global SMT and Packaging, vol. 9 no. 10, pp. 52-53, Oct. 2009.

Willis, Bob, "Lead-Free Assembly Problems?," Advanced Manufacturing Technology (AMT) , vol. 16 no. 6, pp. 6, Dec. 2003/Jan. 2004.

Willis, Bob, "Lead-Free component removal," Global SMT and Packaging, vol. 7 no. 2, pp. 62, Feb. 2007.

Willis, Bob, "Lead-Free Components Problems - A Need for Change."

Willis, Bob, "Lead-Free Components Problems - A Need for Change," Lead-Free Connection, vol. 2 no. 1, pp. 8-10, Jan. 2005.

Willis, Bob, "Lead-Free Fillet Lifting - It Happens in Reflow and Wave Soldering." IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 23-24, 2003, pp. 52-65.

Willis, Bob, "Lead-Free Hands On Experience," Circuits Assembly, vol. 15 no. 7, pp. xx-xx, July 2003.

Willis, Bob, "Lead Free Inspection Reference & Defect Guide," P16.

Willis, Bob, "Lead-Free Printed Board Design for Manufacture and Assembly (Tutorial T5)," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007.

Willis, Bob, "Lead-Free Printed Circuit Board Related Defects," Printed Circuit Board Specification and Procurement Workshop, Petersfield, England, Feb. 18, 2004.

Willis, Bob, "Lead Free Production, Under the Microscope," Vision Engineering.

Willis, Bob, "Lead-Free Solder Joint Process Failure Modes," Structural Integrity & Reliability in Lead-Free, United Kingdom, Mar. 25, 2004.

Willis, Bob, "Lead-Free Solder Paste & Printing," P22.

Willis, Bob, "Lead-Free Solderability - Testing Made Easy."

Willis, Bob, "Low Cost Lead-Free Soldering Technology to Improve Competitiveness of European SMEs," SMART Group "All You Ever Wanted to Know About Lead-Free" Seminar, High Wycombe, United Kingdom, Nov. 1, 2005.

Willis, Bob, "Pb-Free Hand-Soldering PTH Parts," Circuits Assembly, vol. 15 no. 8, pp. xx-xx, Aug. 2004.

Willis, Bob, "PCB solderability assessment - the industry standard," Dataweek , vol. xx no. xx, pp. xx-xx, Sept. 20, 2006.

Willis, Bob, "Popcorning of Components May Increase with Lead-Free Assembly."

Willis, Bob, "Practical Guide to Lead Free Assembly and Soldering Master Class," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 23-24, 2003, T-01.

Willis, Bob, "Practical Lead-Free Production - the Introductory Guide."

Willis, Bob, "Practical Testing Lead-Free Solder Finishes."

Willis, Bob, "Printed board assemblies sag during lead-free wave soldering - but they do not have to with good design," Dataweek, vol. xx no. xx, pp. xx-xx, Sept. 6, 2006.

Willis, Bob, "Process defects: some remain the same, others change in lead-free assembly," Global SMT & Packaging, vol. 5 no. 10, pp. 4-5, Nov. 2005.

Willis, Bob, "Rework & Repair Hand Soldering & Desoldering of Lead-Free Joints." Practical Lead-Free Rework & Repair Workshop, Thame, United Kingdom, Oct. 11, 2006.

Willis, Bob, "SMART Group launches "Lead-Free Process Defect Guide 2"," Global SMT and Packaging, vol. 8 no. 8, pp. 8-9, Aug. 2008.

Willis, Bob, "SMART Group Lead-Free Hands-On Experience 3 Report."

Willis, Bob, "SMART Group Lead-Free Mission to Japan," Lead-Free Soldering Seminar 2001, High Wycombe, United Kingdom, Feb. 15, 2001.

Willis, Bob, "Solderability Testing Surface Mount Components," P21.

Willis, Bob, "Testing for Lead-Free Products, Components and Solder Joints."

Willis, Bob, "Testing for RoHS compliance in production," Dataweek, vol. xx no. xx, pp. xx-xx, Oct. 3, 2007.

Willis, Bob, "The Impact On Microvia Holes With A Lead-Free Process," Lead-Free Magazine.

Willis, Bob, "Tin, gold, copper OSP or silver for your lead-free products?," Global SMT & Packaging, vol. 5 no. 9, pp. 4-5, Oct. 2005.

Willis, Bob, "Vapour Phase is Back for Lead-Free Soldering," SMARTgroup.

Willis, Bob, "Vapour phase or convection for lead-free?," Dataweek, vol. xx no. x, pp. xx-xx, Feb. 17, 2010.

Willis, Bob, "Wave Solder Process Considerations & Set-up for Lead Free."

Willis, Bob, "What is LEADOUT online training?," Global SMT and Packaging, vol. 7 no. 10, pp. 74, Oct. 2007.

Willis, Bob, "Zero defect wave solder set-up for lead-free," Dataweek, vol. xx no. xx, pp. xx-xx, Sept. 20, 2006.

Willis, D. J., and Hammond, C., "Structure of chromium deposits from plating solutions containing trivalent and hexavalent chromium," Materials Science and Technology, vol. 2 no. 6, pp. 630-636, June 1986.

Willkomm, Gunter, "Zuverlassig uber mehr als 10 Jahre," Elektronik, vol. 54 no. 13, pp. 62-29, June 28, 2005.

Willoughby, Arthur, "Featured issue: Lead-free solder and packaging," Journal of Materials Science: Materials in Electronics, vol. 23 no. 1, pp. 1, Jan. 2012.

Wilmot, Lee, Bath, Jasbir, and McCullen, Jack, "J-STD-609 Standard: Labeling and Marking for Harmony in a Lead Free and Tin-Lead World," IPC Review, vol. 48 no. 7, pp. 18-19, Aug. 2007.

Wilmot, Lee, Bath, Jasbir, and McCullen, Jack, "J-STD-609 Standard: Labeling and Marking for Harmony in a Lead-free and Tin/Lead World," SMT Web Exclusive Article.

Wilson, David N., "Beyond Batteries: Other Trends in the Demand for Lead," JOM, vol. 58 no. 10, pp. 24-27, Oct. 2006.

Wilson, Drew, "AMI builds a RoHS house," Green SupplyLine, Nov. 7, 2005.

Wilson, Drew, "Are WEEE and RoHS warm-up exercises for a new design culture," Industrial Control Design Line, Feb. 1, 2006.

Wilson, Drew, "Authorities say RoHS violations ease, but highlight specific areas," EE Times Europe, June 10, 2008.

Wilson, Drew, "Clear As Night," Electronics Supply & Manufacturing, Feb. 2005.

Wilson, Drew, "Clear As Night," Green SupplyLine, Feb. 1, 2005.

Wilson, Drew, "Cradle to grave: New EU directive directly impacts an OEM's core competency," Green SupplyLine, Aug. 1, 2005.

Wilson, Drew, "Debating the cost of WEEE," Green SupplyLine, Sept. 23, 2005.

Wilson, Drew, "EMS providers see green in green laws," Electronics Supply & Manufacturing, Jan. 2005.

Wilson, Drew, "EMS providers see green in green laws," Green SupplyLine, Jan. 1, 2005.

Wilson, Drew, "Energy-using Products directive drives global power-down movement," Green SupplyLine, Feb. 26, 2007.

Wilson, Drew, "EU battery law gets new juice," Green SupplyLine, Feb. 13, 2006.

Wilson, Drew, "EU battery law gets extra juice," EE Times, Feb. 13, 2006.

Wilson, Drew, "EU chemical law impacts electronics manufacturing," Green SupplyLine, Jan. 16, 2006.

Wilson, Drew, "EU members dragging their heels on WEEE," Electronics Supply & Manufacturing, Apr. 2005.

Wilson, Drew, "EU members dragging their heels on WEEE," Green SupplyLine, Apr. 1, 2005.

Wilson, Drew, "EU powers up battery law," Electronics Supply & Manufacturing , Mar. 2006.

Wilson, Drew, "EU powers up battery law," EE Times Europe, Mar. 1, 2006.

Wilson, Drew, "EU review hints at major RoHS revamp," EE Times - Asia, vol. xx no. xx, pp. xx-xx, Oct. 17, 2007.

Wilson, Drew, "EU review of RoHS Category 9 products goes to the heart of system integrity," Green SupplyLine, Sept. 29, 2006.

Wilson, Drew, "EU review of RoHS Category 9 products goes to the heart of system integrity," Industrial Control Design Line, Sept. 29, 2006.

Wilson, Drew, "EU turmoil and extensions won't derail WEEE," Green SupplyLine , June 13, 2005.

Wilson, Drew, "EuP: Another EU green challenge," Electronics Supply & Manufacturing, Sept. 2005.

Wilson, Drew, "EuP could have RoHS-like impact; eco-design to dominate Green Electronics Conference," EE Times Europe, Sept. 2, 2008.

Wilson, Drew, "Europe at a crossroads," Electronic Business, Mar. 1, 2006.

Wilson, Drew, "Europe drives Taiwan green," EE Times Europe, Aug. 1, 2006.

Wilson, Drew, "EU's environmental authority speaks out on RoHS, other directives," Electronic Business, July 11, 2006.

Wilson, Drew, "Evaluating WEEE options," Green SupplyLine, May 25, 2005.

Wilson, Drew, "Fill in the blanks: China's open-ended RoHS requirements raise concern," Green SupplyLine, Dec. 4, 2005.

Wilson, Drew, "Global Designer: Design software complies with ROHS," EDN, vol. 50 no. 23, pp. xx-xx, Nov. 10, 2005.

Wilson, Drew, "Going green? Label, watch and wait," Green SupplyLine, Aug. 1, 2005.

Wilson, Drew, "Green laws unearth trade secrets," Green SupplyLine, Dec. 22, 2006.

Wilson, Drew, "How to choose a recycling partner," Green SupplyLine, Apr. 21, 2006.

Wilson, Drew, "Law firms clarify Europe's environmental directives," Green SupplyLine, Apr. 26, 2007.

Wilson, Drew, "Learning from a product teardown," Green SupplyLine, Mar. 20, 2006.

Wilson, Drew, "Norway's arsenic proposal shakes industry," EE Times Europe, vol. xx no. xx, pp. xx-xx, Nov. 19, 2007.

Wilson, Drew, "One-stop WEEE shop aims to spark compliance competition," Electronic Business, May 16, 2006.

Wilson, Drew, "Out of scope, out of luck," Green SupplyLine, Oct. 25, 2006.

Wilson, Drew, "Pass/fail: RoHS deadline leaves no room for 99% compliant," Green SupplyLine, June 2, 2006.

Wilson, Drew, "PCB detoxifying method developed in Eastern Europe," EE Times Europe, May 16, 2008.

Wilson, Drew, "Producers challenge authorities on WEEE directives," EE Times - Asia, vol. xx no. xx, pp. xx-xx, Aug. 10, 2007.

Wilson, Drew, "Q&A: NWML talks about RoHS compliance," Green SupplyLine, Nov. 11, 2006.

Wilson, Drew, "Q&A: NWML talks about RoHS compliance," EE Times Europe, Nov. 24, 2006.

Wilson, Drew, "REACH compliance: Get ready for the paperwork," Green SupplyLine , Jan. 22, 2007.

Wilson, Drew, "RoHS deadline leaves no room for 99% compliant," EE Times Europe , June 2, 2006.

Wilson, Drew, "RoHS exemption for medical devices is under review," EE Times Europe, Aug. 25, 2006.

Wilson, Drew, "RoHS exemption for medical devices is under review," Green SupplyLine, Aug. 25, 2006.

Wilson, Drew, "RoHS law changes component landscape in T&M industry," Green SupplyLine, Oct. 2, 2006.

Wilson, Drew, "RoHS law changes component landscape in T&M industry," Industrial Control Design Line, Oct. 2, 2006.

Wilson, Drew, "RoHS 'police' are busy at work," EE Times Europe, Nov. 27, 2006.

Wilson, Drew, "RoHS police are busy at work," Green SupplyLine, Nov. 27, 2006.

Wilson, Drew, "RoHS revamp may add pitfalls," EE Times, vol. xx no. xx, pp. xx-xx, Oct. 15, 2007.

Wilson, Drew, "RoHS testing race heats up," Green SupplyLine, Sept. 15, 2005.

Wilson, Drew, "RoHS under fire," Green SupplyLine, Aug. 1, 2006.

Wilson, Drew, "RoHS under fire," Electronics Supply & Manufacturing, Aug. 2006.

Wilson, Drew, "RoHS under fire," Industrial Control Design Line, Aug. 1, 2006.

Wilson, Drew, "RoHS watchdog reports less violations in 2007," EE Times - Asia , vol. xx no. xx, pp. xx-xx, June 13, 2008.

Wilson, Drew, "SMEs slow to embrace eco-design," Green SupplyLine, Feb. 10, 2006.

Wilson, Drew, "Taiwan goes green," Electronics Supply & Manufacturing, Aug. 2006.

Wilson, Drew, "Taiwan tackles RoHS compliance," EE Times Europe, July 13, 2006.

Wilson, Drew, "Taiwan tackles RoHS compliance," Green SupplyLine, July 13, 2006.

Wilson, Drew, "The cost of WEEE," Electronics Supply & Manufacturing, Oct. 2005.

Wilson, Drew, "Timing is everything," Green SupplyLine, Aug. 29, 2005.

Wilson, Drew, "U.K. takes the lead in RoHS implementation," Green SupplyLine , May 22, 2006.

Wilson, Drew, "Unraveling the mystery of RoHS exemptions," Green SupplyLine , Oct. 18, 2005.

Wilson, Drew, "Vendor admits to RoHS misconduct," EE Times, vol. xx no. xx, pp. xx-xx, Oct. 15, 2007.

Wilson, Drew, "WEEE and RoHS could be mere warm-up exercises for a new design culture," Green SupplyLine, Feb. 1, 2006.

Wilson, Drew, "WEEE challenges ahead as producers go to court," EE Times Europe , Aug. 7, 2007.

Wilson, Drew, "WEEE critics speak out," Green SupplyLine, Mar. 26, 2007.

Wilson, Drew, "WEEE directive: Waste not, want not," Green SupplyLine, Apr. 25, 2005.

Wilson, I. H., "The Topography of Sputtered Semiconductors," Radiation Effects, vol. 18 no. 1-2, pp. 95-103, 1973. https://doi.org/10.1080/00337577308234723

Wilson, J. R., "Lead-free RoHS on military electronics procurement," Military & Aerospace Electronics, vol. 20 no. 4, pp. 24-29, Apr. 2009.

Wilson, Jim, "thermal conductivity of solders," Electronics Cooling, vol. 12 no. 3, pp. 4-5, Aug. 2006.

Wilson, John, "CFD Thermal Analysis for Improved Reflow," Surface Mount Technology (SMT), vol. 23 no. 4, pp. 10-12, July/Aug. 2009.

Wilson, Richard, "A question of going lead-free," Electronics Weekly, Dec. 1, 2004.

Wilson, Richard, "A step ahead in RoHS compliance game," Electronics Weekly, Dec. 14, 2005.

Wilson, Richard, "Agency warns against RoHS `smokescreen'," Electronics Weekly , Sept. 28, 2005.

Wilson, Richard, "Body urges early Pb-free redesigns," ElectronicsWeekly.com, June 2, 2005.

Wilson, Richard, "China RoHS rules available on web," Electronics Weekly, Jan. 19, 2007.

Wilson, Richard, "Distributor Warns of Pb-Free Complacency, Offers Data," Electronics Weekly, Feb. 6, 2004.

Wilson, Richard, "DTI funding for CAF bid," Electronics Weekly, May 16, 2001.

Wilson, Richard, "DTI publishes WEEE recycling guide book online," Electronics Weekly, Feb. 28, 2007.

Wilson, Richard, "Envirowise criticised for poor RoHS advice," Electronics Weekly , Feb. 1, 2006.

Wilson, Richard, "EU sets start date for compulsory battery recycling," Electronics Weekly, May 3, 2006.

Wilson, Richard, "European Commission to plug RoHS loophole," Electronics Weekly , May 10, 2006.

Wilson, Richard, "Exemption muddies the waters of RoHS," Electronics Weekly, May 3, 2006.

Wilson, Richard, "Firms risk RoHS fines to avoid cost of compliance," Electronics Weekly, Aug. 30, 2006.

Wilson, Richard, "Frustration at lack of Pb-free details," Electronics Weekly, Apr. 21, 2005.

Wilson, Richard, "Government delays WEEE regulations," Electronics Weekly, Dec. 15, 2005.

Wilson, Richard, "Government warns firms to act now over waste directive," Electronics Weekly, Nov. 10, 2003.

Wilson, Richard, "Lead-Free: Managing the Changeover," Electronic News, Nov. 5, 2004.

Wilson, Richard, "Lead-free: Managing the changeover," Electronics Weekly, Nov. 5, 2004.

Wilson, Richard, "Lead-free role for catalogue distribution," electronicsweekly.com , Jan. 21, 2005.

Wilson, Richard, "Lead-free will create competition threat," Electronics Weekly , Oct. 20, 2004.

Wilson, Richard, "Leadtimes rise as July RoHS deadline looms," electronicsweekly.com , Apr. 14, 2006.

Wilson, Richard, "Obsolescence costs £300,000, says MoD," ElectronicsWeekly.com , Feb. 23, 2005.

Wilson, Richard, "Recycling body warns firms to act on WEEE rules," Electronics Weekly, Oct. 31, 2006.

Wilson, Richard, "RoHS Directive turmoil as loophole stays open," Electronics Weekly , June 14, 2006.

Wilson, Richard, "RoHS-exempt component prices rise," Electronics Weekly, Sept. 14, 2006.

Wilson, Richard, "RoHS: Is the supply chain ready?," Electronics Weekly, Mar. 20, 2006.

Wilson, Richard, "RoHS: Is the Supply Chain Ready?," Electronic News, Mar. 20, 2006.

Wilson, Richard, "RS signs up for WEEE compliance scheme," Electronics Weekly, Mar. 28, 2007.

Wilson, Richard, "Supply chain pressure comes from RoHS," Electronics Weekly, Dec. 7, 2005.

Wilson. Richard, "U.K. Agency Criticized for Poor RoHS Advice," Electronic News , Feb. 2, 2006.

Wilson, Richard, "U.K. Delays WEEE Regulations," Electronic News, Dec. 16, 2005.

Wilson, Richard, "Uncertainty hangs over lead-free plans," Electronics Weekly, July 8, 2004.

Wilson, Richard, "US to get own 'RoHS' rules...at last," Electronics Weekly, July 2, 2009.

Wilson, Scott, "Design Lead-Free, Environmental, and Regulatory Compliant Products," IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics, Raleigh, NC, Mar. 11-12, 2008, pp. xx-xx.

Wimmer, Wolfgang, Pamminger, Rainer, Stachura, Marek, and Grab, Ratko, "ECODESIGN in the electronics industry - achieving legal compliance with the EU-directives and environmentally improving products by using the new EEE-PILOT," Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 12-14, 2005, pp. 671-677.

Wing, Linda, "End of the road for hexavalent chromium," AEI, vol. xx no. xx, pp. 43-45, June 2004.

Winlow, Alison, "Surface Finishing," Circatex, 2003.

Winn, Dennis, and Dalton, William, "Chromium-Free Corrosion Solutions," Metal Finishing, vol. 106 no. 6, pp. 70-74, June 2008.

Winslow, Russell T., "Challenges in Modification of Electronic Components," IEEE Transactions on Components and Packaging Technologies, vol. 30 no. 2, pp. 356-358, June 2007.

Winster, Teny, van Rijckevorsel, Hans, Lui, Ben, and Zhuo, Qizhuo, "Wafer Backside Coating of Electrically Conductive Die Attach Adhesives for Packaging of Discrete Semiconductor Devices," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 291-295.

Winter, Martin, and Besenhard, Jurgen O., "Electrochemical lithiation of tin and tin-based intermetallics and composites," Electrochimica Acta, vol. 45 no. 1-2, pp. 31-50, Sept. 30, 1999.

Winterbottom, W. L., "NCMS Environmentally Conscious Manufacturing: Development of Lead-Free Solders," Technical Papers of Third Environmental Management and Technology Conference/North America, Detroit, MI, Oct. 12-14, 1993, pp. 425-430.

Winterbottom, Walter L., "Converting to Lead-Free Solders: An Automotive Industry Perspective," JOM, vol. 45 no. 7, pp. 20-24, July 1993.

Winterstein, J. P., LeBret, J. B., and Norton, M. G., "Characteristics of tin whiskers formed on sputter-deposited films-an aging study," Journal of Materials Research, vol. 19 no. 3, pp. 689-692, Mar. 2004.

Winterstein, J. P., and Norton, M. G., "The influence of porosity on whisker growth in electroplated tin films," Journal of Materials Research, vol. 21 no. 12, pp. 2971-2974, Dec. 2006.

Winterstein, Jonathan, "Tin Whiskers Studied by Scanning Electronic Microscopy."

Wirth, Vaclav, Rendl, Karel, and Steiner, Frantisek, "Effect of Multiple Reflow Cycles on Intermetallic Compound Creation," 2015 38th International Spring Seminar on Electronics Technology, Eger, Hungary, May 6-10, 2015, pp. 226-230.

Wise, Holly, "Identifying Stencils for Lead-free Solder Paste," Surface Mount Technology (SMT), vol. 20 no. 3, pp. xx-xx, Mar. 2006.

Wiser, Franz, "Keeping the Lid on Non-solid SMD Electrolytic Capacitors During a Lead-Free Reflow Soldering," Electronics World, vol. 113 no. 1860, pp. 34-37. Dec. 2007.

Witkin, David, "Creep Behavior of Bi-Containing Lead-Free Solder Alloys," Journal of Electronic Materials, vol. 41 no. 2, pp. 190-203, Feb. 2012.

Witkin, David B., "Influence of Microstructure on Mechanical Behavior of Bismuth Pb-Free Solders," Surface Mount Technology (SMT), vol. 29 no. 3, pp. 30,32-38,40,42, Mar. 2014.

Witkin, David B., "Influence of microstructure on quasi-static and dynamic mechanical properties of bismuth-containing lead-free solder alloys," Materials Science and Engineering: A, vol. 532, pp. 212-220, Jan. 15, 2012.

Witusiewicz, V. T., Hecht, U., Bottger, B., and Rex, S., "Thermodynamic re-optimisation of the Bi-In-Sn system based on new experimental data," Journal of Alloys and Compounds, vol. 428 no. 1-2, pp. 115-124, Jan. 31, 2007.

Woertink, Julia, Qin, Yi, Prange, Jonathan, Lopez-Montesinos, Pedro, Lee, Inho, Lee, Yil-Hak, Imanari, Masaaki, Dong, Jianwei, and Calvert, Jeffrey, "From C4 to Micro-Bump: Adapting Lead Free Solder Electroplating Processes to Next-Gen Advanced Packaging Applications," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 342-347.

Wohlrabe, Heinz, Herzog, Thomas, and Wolter, Klaus-Jurgen, "Optimization of SMT Solder Joint Quality by Variation of Material and Reflow Parameters," 2nd Electronics Systemintegration Technology Conference , Greenwich, London, UK, Sept. 1-4, 2008, pp. 1185-1191.

Wohlrabe, Heinz, and Reichelt, Gundolf, "R1 - a Reliability Comparison Study between 14 Lead free Alloys," 2013 IEEE 15th Electronics Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp. 292-297.

Wojciechowski, Dominique, Vanfleteren, Jan, Reese, Elisabeth, and Hagedorn, Hans-Werner, "Electro-conductive adhesives for high density package and flip-chip interconnections," Microelectronics and Reliability, vol. 40 no. 7, pp. 1215-1226, July 2000.

Wojciechowski, Dominique, Chan, Moses, and Martone, Fabrizio, "Lead-free plastic area array BGAs and polymer stud grid arrays package reliability," Microelectronics Reliability, vol. 41 no. 11, pp. 1829-1839, Nov. 2001.

Wojciechowski, Dominique, Vanfleteren, Jan, Reese, Elisabeth, and Hagedorn, Hans-Werner, "New Adhesives for High Density Flip-chip Interconnections," Proceedings 1998 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 3582), San Diego, CA, Nov. 1-4, 1998, pp. 224-229.

Wojewada, Joanna, Onderka, Boguslaw, and Zieba, Pawel, "The Effect of Intermetallic Compound on Shear Strength of Diffusion Soldered Interconnection," Advanced Engineering Materials, vol. 8 no. 3, pp. 176-179, Mar. 2006.

Wojewoda, J., "Solid State Transformations in Cu/In-48Sn/Cu Diffusion Soldered Interconnections," Solid State Phenomena, vol. 138, pp. 165-174, Mar. 2008.

Wojewoda, Joanna, Zieba, Pawel, and Wierzbicka, Anna, "Growth Kinetics of the intermetallic phases in the Cu/In-Bi 22at.%/Cu interconnection," Defect and Diffusion Forum, vol. 237-240, pp. 1188-1192, 2005.

Wojewoda-Budka, J., Huber, Z., Litynska-Dobrzynska, L., Sobczak, N., and Zieba, P., "Microstructure and chemistry of the SAC/ENIG interconnections," Materials Chemistry and Physics, vol. 139 no. 1, pp. 276-280, Apr. 15, 2013.

Wojewoda-Budka, J., and Zieba, P., "Shear strength of Cu/In-48Sn/Cu diffusion soldered interconnections," Science and Technology of Welding and Joining, vol. 16 no. 6, pp. 541-545, Aug. 2011. https://doi.org/10.1179/1362171811Y.0000000041

Wojewoda-Budka, Joanna, and Zieba, Pawel, "Formation and growth of intermetallic phases in diffusion soldered Cu/In-Bi/Cu interconnections," Journal of Alloys and Compounds, vol. 476 no. 1-2, pp. 164-171, May 12, 2009.

Wojtasik, K., and Missol, W., "PM helps develop cadmium-free electrical contacts," Metal Powder Report , vol. 59 no. 7, pp. 34-36, 38-39, July/Aug. 2004.

Wolf, Gunter, Halwax, Erich, and Kronberger, Hermann, "Effect of Current Density and Temperature on the Morphology of Electrodeposited Chromium," Metal Finishing, vol. 108 no. 1, pp. 19-27, Jan. 2010.

Wolf, M. Juergen, Engelmann, Gunter, Dietrich, Lothar, and Reichl, Herbert, "Flip chip bumping technology - Status and update," Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, vol. 565 no. 1, pp. 290-295, Sept. 1, 2006.

Wolfgong, W. John, Ogden, Bob, Champaign, Robert, and Waller, Barbara, "Surface Oxidation as a Tin Whisker Growth Mechanism," Circuits Assembly, vol. 16 no. 12, pp. 24-27, Dec. 2005.

Wolflick, Peter, and Feldmann, Klaus, "Lead-Free Low-Cost Flip-Chip Process Chain: Layout, Process, Reliability," Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium, San Jose, CA, July 17-18, 2002, pp. 27-34.

Wolfson, Ken, "Tech Tips: Preparation for Reflow Profiling," empfasis, pp. 4, Apr. 2009.

Wolfson, R. G., Fine, M. E., and Ewald, A. W., "Transformation Studies of Gray Tin Single Crystals," Journal of Applied Physics, vol. 31 no. 11, pp. 1973-1977, Nov. 1960.

Wolski, Gerhard B., "The "green" Approach - Between the Best of Intentions and Confusion," Lead-Free Magazine, vol. 2.

Wong, B., Megerle, C. A., O'Brien III, D. L., Elias, W. E., Gesick, W. R., and McKernan, D. B., "Fatigue-Resistance Solder," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume I, San Jose, CA, Aug. 31-Sept. 2, 1993, pp. 484-493.

Wong, C. K., Pang, John H. L., Sun, Y. F., Ng, F. L., Tew, J. W., and Fan, W., "Influence of Solder Volume on Interfacial Reaction between Sn-Ag-Cu Solder and TiW/Cu/Ni UBM," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2, Singapore, Dec. 7-9, 2005, pp. 492-496.

Wong, C. K., Pang, J. H. L., Tew, J. W., Lok, B. K., Lu, H. J., Ng, F. L., and Sun, Y. F., "The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging," Microelectronics Reliability, vol. 48 no. 4, pp. 611-621, Apr. 2008.

Wong, C. L., and How, James, "Low Cost Flip Chip Bumping Technologies," Proceedings of the 1997 1st Electronic Packaging Technology Conference, Singapore, Oct. 8-10, 1997, pp. 244-250

Wong, C. P., "2004 Progress Report: Environmentally Benign Lead-Free Electrically Conductive Adhesive for Electronic Packaging Manufacturing," EPA Grant Number R831489, 2004.

Wong, C. P., and Lu, D., "Development of Solder Replacement Isotropic Conductive Adhesives," IEEE International Symposium on Electronic Materials and Packaging, Hong Kong, China, Nov. 30-Dec. 2, 2000, pp. 304-312.

Wong, C. P., and Lu, D., "Development of Solder Replacement Isotropic Conductive Adhesives," Proceedings of 3rd Electronics Packaging Technology Conference, Singapore, Dec. 5-7, 2000, pp. 214-222.

Wong, C. P., "Electrically conductive adhesives replace solder," Advanced Materials and Processes, vol. 163 no. 5, pp. 22, May 2005.

Wong, C. P., Lu, Daoquang, Meyers, Laura, Vona Jr., Samuel A., and Tong, Quinn K., "Fundamental Study of Electrically Conductive Adhesives (ECAs)," The First IEEE International Symposium on Polymeric Electronics Packaging, Oct. 26-30, 1997, pp. 80-85.

Wong, C. P., "Industry updates: Improvements to Electrically Conductive Adhesives Increase Current Density," Journal of Failure Analysis and Prevention, vol. 5 no. 4, pp. 31-32, Aug. 2005.

Wong, C. P., Lu, Daoqiang, and Tong, Quinn K., "Lubricants of Silver Fillers for Conductive Adhesive Applications," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 184-192.

Wong, C. P., and Lu, Daoqiang, "Recent Advances in Electrically Conductive Adhesives for Electronics Applications," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 121-128.

Wong, C. P, and Moon, Kyoung-sik, "The Study of Self-Alignment Capability of Electrically Conductive Adhesives (ECAs) Using Low Melting Point Alloy for Flip-Chip Application," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, Germany, Oct. 21-24, 2001, pp. 112-118.

Wong, Chris, "Waste Not!," MX, vol. xx no. xx, pp. xx-xx, May/June 2004.

Wong, E. H., Seah, S. K. W., and Shim, V. P. W., "A review of board level solder joints for mobile applications," Microelectronics Reliability, vol. 48 no. 11-12, pp. 1747-1758, Nov.-Dec. 2008.

Wong, E. H., Seah, S. K. W., van Driel, W. D., Caers, J. F. J. M., Owens, N., and Lai, Y.-S., "Advances in the drop-impact reliability of solder joints for mobile applications," Microelectronics Reliability, vol. 49 no. 2, pp. 139-149, Feb. 2009.

Wong, E. H., Koh, S. W., Lee, K. H., Lim, Kian-Meng, Lim, Thiam Beng, and Mai, Yiu-Wing, "Advances in Vapor Pressure Modeling for Electronic Packaging," IEEE Transactions on Advanced Packaging, vol. 29 no. 4, pp. 751-759, Nov. 2006.

Wong, E. H., Koh, S. W., Lee, K. H., and Rajoo, R., "Comprehensive Treatment of Moisture Induced Failure - Recent Advances," IEEE Transactions on Electronics Packaging Manufacturing, vol. 25 no. 3, pp. 223-230, July 2002.

Wong, E. H., Chrisp, J., Selvanayagam, C. S., and Seah, S. K. W., "Constitutive modeling of solder alloys for drop-impact applications," Microelectronics Reliability, vol. 67, pp. 135-142, Dec. 2016.

Wong, E. H., Rajoo, R., Seah, S. K. W., Selvanayagam, C. S., van Driel, W. D., Caers, J. F. J. M., Zhao, X. J., Owens, N., Tan, L. C., Leoni, M., Eu, P. L., Lai, Y.-S., and Yeh, C.-L., "Correlation studies for component level ball impact shear test and board level drop test," Microelectronics Reliability, vol. 48 no. 7, pp. 1069-1078, July 2008.

Wong, E. H., van Driel, W. D., Dasgupta, A., and Pecht, M., "Creep fatigue models of solder joints: A critical review," Microelectronics Reliability, vol. 59, pp. 1-12, Apr. 2016.

Wong, E. H., Rajoo, R., Mai, Y. W., Seah, S. K. W., Tsai, K. T., and Yap, L. M., "Drop Impact: Fundamentals and Impact Characterisation of Solder Joints," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 1, Orlando, FL, May 31-June 3, 2005, pp. 1202-1209.

Wong, E. H., Mai, Y-W, Seah, S. K. W., Rajoo, R., Lim, T. B., Lim, C. T., and Field, J., "Drop Impact Reliability A - A Comprehensive Summary," 7th IEEE CPMT International Conference on High Density Microsystem Design, Packaging and Failure Analysis, Shanghai, June 28, 2005, pp. xx-xx.

Wong, E. H., Seah, S. K. W., and Shim, V. P. W., "Frequency-Dependent Low Cycle Fatigue of Sn1Ag0.1Cu(In/Ni) Solder Joints Subjected to High-Frequency Loading," Journal of Electronic Materials , vol. 43 no. 2, pp. 586-593, Feb. 2014.

Wong, E. H., Seah, S. K. W., Caers, J. F. J. M., and Lai, Y.-S., "Frequency-dependent strain-life characteristics of Sn1.0Ag0.1Cu solder on cupper pad at high cyclic frequency," International Journal of Fatigue , vol. 59, pp. 43-49, Feb. 2014. https://doi.org/10.1016/j.ijfatigue.2013.09.016

Wong, E. H., Seah, S. K. W., Selvanayagam, C. S., Rajoo, R., van Driel, W. D., Caers, J. F. J. M., Zhao, X. J., Owens, N., Leoni, M., Tan, L. C., Lai, Y.-S., and Yeh, C.-L., "High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies," Journal of Electronic Materials, vol. 38 no. 6, pp. 884-895, June 2009.

Wong, E. H., Mai, Y-W, Rajoo, R., Tsai, K. T., Liu, F., Seah, S. K. W., and Yeh, C-L, "Micro Impact Characterisation of Solder Joint for Drop Impact Application," Proceedings 56th Electronic Components & Technology Conference , San Diego, CA, May 30-June 2, 2006, pp. 64-71.

Wong, E. H., Seah, S. K. W., van Driel, W. D., Caers, J. F. J. M., Owens, N., and Lai, Y. -S., "Recent Advances in Drop-Impact Reliability," International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, Freiburg, Germany, Apr. 20-23, 2008, pp. xx-xx.

Wong, E. H., Selvanayagam, C. S., Seah, S. K. W., van Driel, W. D. Caers, J. F. J. M., Zhao, X. J., Owens, N., Tan, L. C., Frear, D. R., Leoni, M., Lai, Y.-S., and Yeh, C.-L., "Stress-Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling," Journal of Electronic Materials, vol. 37 no. 6, pp. 829-836, June 2008.

Wong, Fu-Mauh, and Seetharamu, K. N., "Study of Interfacial Delamination by Considering the Effect of Temperature and Moisture during Solder Reflow for QFN Package," Journal of Microelectronics and Electronic Packaging, vol. 2 no. 3, pp. 197-207, Third Quarter 2005.

Wong, Karen M. C., and Tian, Yee Kai, "Effect of trace platinum additions on the interfacial morphology of Sn-3.8Ag-0.7Cu alloy aged for long hours," Microelectronics Reliability , vol. 54 no. 11, pp. 2536-2541, Nov. 2014.

Wong, Kenneth, "PLM Strategies - Lead-Free, Not Necessarily Stress-Free," cadalyst , vol. 23 no. 5, pp. 50-51, May 2006.

Wong, Shaw Fong, Malatkar, Pramod, Rick, Canham, Kulkarni, Vijay, and Chin, Ian, "Vibration Testing and Analysis of Ball Grid Array Package Solder Joints," 2007 Proceedings 57th Electronic Components & Technology Conference , Reno, NV, May 29-June 1, 2007, pp. 373-380.

Wong, Stephen, and Nestor, Myron, "High Volume Lead Free Production," 2001 SMTA International Conference Proceedings, Chicago, IL, Sept. 30-Oct. 4, 2001, pp. xx-xx.

Wong, William, "Lead-Free Designs Deliver High Reliability In Safety Critical Applications," Microwaves & RF, vol. 52 no. 7, pp. S14-S18, July 2013.

Wong, Y. W., Wu, C. M. L., Woo, H. C. B., Choi, Y. T., and Li, K. L., "Interfacial Reaction of Lead-Free Solders with Lead-Free Finished Leadframes," 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006, pp. xx-xx.

Wong-Leung, Jennifer, Yang, Inseok, Li, Ziyuan, Karuturi, Siva Krishna, Fu, Lan, Tan, Hark Hoe, and Jagadish, Chennupati, "Engineering III-V Semiconductor Nanowires for Device Applications," Advanced Materials, vol. 32 no. 18, pp. 1904359-1-1904359-14, May 7, 2020. https://doi-org.ezproxy.uky.edu/10.1002/adma.201904359

Wood, E. P., and Nimmo, K. L., "In Search of New Lead-Free Electronic Solders," Journal of Electronic Materials, vol. 23 no. 8, pp. 709-713, Aug. 1994.

Wood, Paul, "Double-sided Lead-free Rework," Surface Mount Technology (SMT) , vol. 22 no. 8, pp. 12-13, Aug. 2008.

Wood, Paul, "Rework of BGA/CSP Components Using Lead Free Solders," 2003 SMTA International Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 64-69.

Wood, Paul, "Rework of BGA/CSP components using lead-free solders," Dataweek , vol. xx no. xx, pp. xx-xx, Feb. 25, 2004.

Wood, Paul, "Rework of BGA/CSP Components Using Lead Free Solders," Lead-Free Magazine.

Wood, Paul, "Rework of package on package in lead-free array," Global SMT and Packaging, vol. 7 no. 4, pp. 20, 22, 24, 26-27, Apr. 2007.

Wood, Paul, "Rework of Package on Package in Lead-Free Array," NEPCON Shanghai 2007 , Shanghai, China, Apr. 24-27, 2007, pp. xx-xx.

Wood, Paul, "Rework with Lead-Free Solders," Circuits Assembly, vol. 14 no. 8, pp. 18-21, Aug. 2003.

Wood, Paul, "Reworking lead-free array packages on double sided PCBs," EMasia , Oct. 2007.

Wood, Paul, "Reworking Lead-Free Array Packages on Double Sided Printed Circuit Boards," Lead-Free Connection, vol. 4 no. 1, pp. 8-10, Feb. 2007

Wood, Paul, "Step 10: Rework and Repair," Surface Mount Technology (SMT), vol. 18 no. 11, pp. 54-57, Nov. 2004.

Wood, Paul, "Step 10: Rework and Repair," Surface Mount Technology (SMT), vol. 20 no. 11, pp. 38-39, Nov. 2006.

Woodle, Roger S., "Ion Exchange for Trivalent Chromium Plating Baths," Products Finishing, vol. xx no. x, pp. xx-xx, Nov. 1997.

Woodrow, Thomas A., "Effects of Pb on the Diffusion of Tin Within Tin Platings," 2009 AIMS Harsh Environments Electronics Symposium, San Diego, CA, Oct. 5-6, 2009, pp. 935-954.

Woodrow, Thomas A., and Ledbury, Eugene A., "Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy," IPC/JEDEC 8th International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Woodrow, Thomas A., and Ledbury, Eugene A., "Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy (Presentation)," IPC/JEDEC 8th International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Woodrow, Thomas A., and Ledbury, Eugene A., "Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy, Part II," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 972-1004.

Woodrow, Thomas A., "JCAA/JG-PP Lead-Free Solder Project: -20°C to +80°C Thermal Cycle Test," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 825-835.

Woodrow, Thomas A., "JCAA/JG-PP Lead-Free Solder Project: -20°C to +80°C Thermal Cycle Test," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 354-376.

Woodrow, Thomas A., "JCAA/JG-PP No-Lead Solder Project: -20°C to +80°C Thermal Cycle Test," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S20-01-1-S20-01-11.

Woodrow, Thomas A., "JCAA/JG-PP No-Lead Solder Project: Thermal Shock Test," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 807-823.

Woodrow, Thomas A., "JCAA/JG-PP No-Lead Solder Project: Vibration Test," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 771-806.

Woodrow, Thomas A., "JCAA/JG-PP No-Lead Solder Project: Vibration Test," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S25-01-1-S25-01-37.

Woodrow, Thomas A., "NASA/DoD Lead-Free Electronics Project: -20°C to +80°C Thermal Cycle Test," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 427-449.

Woodrow, Thomas A., "NASA-DoD Lead-Free Electronics Project: Mechanical Shock Test," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S09_02-1-S09_02-25.

Woodrow, Thomas A., "NASA/DoD Lead-Free Electronics Project: Mechanical Shock Test," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 442-466.

Woodrow, Thomas A., "NASA-DoD Lead-Free Electronics Project: Vibration Test," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 480-511.

Woodrow, Thomas A., "Reliability and Leachate Testing of Lead-Free Solder Joints," Boeing.

Woodrow, Thomas A., "The Effects of Trace Amounts of Lead on the Reliability of Six Lead-Free Solders," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, Apr. 23-24, 2003, pp. 242-255.

Woodrow, Tom, "Composition of Tin Whiskers on Tin-Plated Brass," Tin Whisker Group teleconference, May 26, 2010.

Woodrow, Tom, "Effects of Pb on the Diffusion of Tin within Tin Platings," Tin Whisker Group teleconference, Dec. 9, 2009.

Woodrow, Tom, and Ledbury, Eugene, "Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy, Part III," Symposium on Reprocessing, Tin Whisker Mitigation and Assembly Rework, College Park, MD, Nov. 11-12, 2008, pp. xx-xx.

Woodrow, Tom, "Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy, Part III," Tin Whisker Group teleconference, Oct. 20, 2010.

Woodrow, Tom, and Ledbury, Eugene, "Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy, Part III," Symposium on Reprocessing, Tin Whisker Mitigation and Assembly Rework, College Park, MD, Nov. 11-12, 2008, pp. xx-xx.

Woodrow, Tom, "JCAA/JG-PP No-Lead Solder Project: Vibration Testing," IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies , San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.

Woodrow, Tom, Rollins, Bill, Nalley, Pat, and Ogden, Bob, "Tin Whisker Mitigation Study: Phase I. Evaluation of Environments for Growing Tin Whiskers," August 1, 2003.

Woodrow, Tom, "Tracer Diffusion in Whisker-Prone Tin Platings (presentation)," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 674-723.

Woodruff, D. P., and Horn, K., "The surface structure of a-Sn (100)," Philosophical Magazine A, vol. 47 no. 3. pp. L5-L8, 1983. https://doi.org/10.1080/01418618308245226

Woods, Lawrence M., Wolk, Jeffrey, Smith, Marta, Davande, Hemali, Ribelin, Rosine M., and Perkins, Craig L., "Ag Nanowire Based Transparent Conductor for CIGS PV," 2011 37th IEEE Photovoltaic Specialists Conference, Seattle, WA, June 19-24, 2011, pp. 1380-1385.

Woods, Susan, "The Move to Lead-free Solder." Connector Specifier, vol. 18 no. 11, pp. xx-xx, Nov. 2002.

Woody, Linda, "Review of Lead Free Control Plan Requirements," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. xx-xx.

Woody, Linda, and Fox, William, "Tin Whisker Risk Management by Conformal Coating," IPC APEX Expo 2014, Las Vegas, NV, Mar. 25-27, 2014, pp. xx-xx.

Woody, Linda, and Fox, William, "Tin Whisker Risk Management by Conformal Coating," Surface Mount Technology (SMT), vol. 29 no. 7, pp. 40,42-44,46-48,50,52-58, July 2014.

Wooley, Mark, Brown, Wesley, and Choi, Jae, "Selective Soldering for Interconnection Technology Used in Enterprise Communication Apparatuses," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Woolley, Mark, and Choi, Jae, "The Effects of Tin Whisker Testing on Solder Connections," IPC Review , vol. 48 no. 8, pp. 6, Sept. 2007.

Woolnough, Paul, "Penalties ahead for non-compliers," ferret.com.au, pp. xx-xx, May 16, 2006.

Wraige, Helen, "Recycling ideas instead of cars," Professional Engineering, vol. 15 no. 17, pp. 24, Sept. 18, 2002.

Wright, Andrew C., and Faulkner, Michael, "Magnetophoretic assembly and printing of nanowires," Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol. 30 no. 2, pp. 021603-1-021603-7, Mar. 2012.

Wright, Conrad, "The Effect of Solid-State Reactions Upon Solder Lap Shear Strength," IEEE Transactions on Parts, Hybrids, and Packaging, vol. PHP-13 no. 3, pp. 202-207, Sept. 1977.

Wright, D. A., Gage, N., and Wilson, B. A., "Zinc Nickel Electroplate as a Replacement for Cadmium Electroplate on High Strength Steels," 30th Aerospace/Airline Plating & Metal Finishing Forum, 1994, pp. xx-xx.

Wright, D. A., Gage, N., and Wilson, B. A., "Zinc-Nickel Electroplate as a Replacement for Cadmium on High-Strength Steels," Plating & Surface Finishing, vol. 81 no. 7, pp. 18-21, July 1994.

Wright, D. A., Gage, N., and Wilson, B. A., "Zinc-Nickel Electroplate as a Replacement for Cadmium on High-Strength Steels," Plating & Surface Finishing, vol. 93 no. 3, pp. 18-22, Mar. 2006.

Wright, Gary C., Brooman, Eric W., Pavlik, Milissa A., and Van Scoyoc, Susan B., "Evaluation of Alloy Coatings Being Developed As Alternatives to Cadmium Coatings," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 657-672.

Wright, Roger N., "Modeling the drawing of ultrafine wire," Wire Journal International , vol. 37 no. 1, pp. 56-57, Jan. 2004.

Wright, Roger N., "Optimizing high friction drawing - a mechanical perspective," Wire Journal International, vol. 38 no. 1, pp. 76-78, Jan. 2005.

Wright, Roger N., "The mechanism of chevron or 'crow's feet' development in wiredrawing," Wire Journal International, vol. 35 no. 8, pp. 86-90, Aug. 2002.

Wright, Roger N., "Wire flaws and fracture mechanics," Wire Journal International, vol. 38 no. 4, pp. 116-118, Apr. 2005.

Wright, Roger N., "Wiredrawing breaks - A review of mechanical perspectives," Wire Journal International, vol. 40 no. 6, pp. 49-52, June 2007.

Wright, S. L., Polastre, R., Gan, H., Buchwalter, L. P., Horton, R., Andry, P. S., Sprogis, E., Patel, C., Tsang, C., Knickerbocker, J., Lloyd, J. R., Sharma, A., and Sri-Jayantha, M. S., "Characterization of Micro-Bump C4 Interconnects for Si-Carrier SOP Applications," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 633-640.

Wright, S. L., Tsang, C. K., Maria, J., Dang, B., Polastre, R., Andry, P., and Knickerbocker, J., "Micro-interconnection Reliability: Thermal, Electrical and Mechanical Stress," 2012 IEEE 62nd Electronic Components and Technology Conference , San Diego, CA, May 29-June 1, 2012, pp. 1278-1286.

Wrona, Rafal, and Drozd, Zdzislaw, "Resistance of BGA Contacts During Reliability Tests," 30th International Spring Seminar on Electronics Technology, Cluj-Napoca, Romania, May 9-13, 2007, pp. 162-166.

Wronkowska, A. A., Wronkowski, A., and Skowronski, T., "Non-destructive characterization of In/Ag and In/Cu diffusive layers," Journal of Alloys and Compounds, vol. xxx no. x-x, pp. xxx-xxx, xxxx.

Wu, Albert T., and Sun, K. H., "Determination of Average Failure Time and Microstructural Analysis of Sn-Ag-Bi-In Solder Under Electromigration," Journal of Electronic Materials, vol. 38 no. 12, pp. 2780-2785, Dec. 2009.

Wu, Albert T., Chen, Chih-Hao, Huang, Jyun-Jhe, Chiang, Jeng-Yu, and Wang, Chang-Meng, "Development of Low Temperature Solder Alloys for Advanced Electronic Packaging: Assessment of In-Bi alloys on Cu substrates," 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Nagasaki, Japan, Apr. 17-21, 2018, pp. 128-131.

Wu, Albert T., Chen, Ming-Hsun, and Huang, Che-Hsun, "Formation of intermetallic compounds in SnAgBiIn solder systems on Cu substrates," Journal of Alloys and Compounds, vol. 476 no. 1-2, pp. 436-440, May 12, 2009.

Wu, Albert T., Siao, Ciou-Nan, Ku, Ching-Shun, and Lee, Hsin-Yi, "In situ observation of stress evolution in pure tin strip under electromigration using synchrotron radiation x-ray," Journal of Materials Research, vol. 25 no. 2, pp. 292-295, Feb. 2, 2010.

Wu, Albert T., Chen, Ming-Hsun, and Siao, Ciou-Nan, "The Effects of Solid-State Aging on the Intermetallic Compounds of Sn-Ag-Bi-In Solders on Cu Substrates," Journal of Electronic Materials , vol. 38 no. 2, pp. 252-256, Feb. 2009.

Wu, Albert T., Tu, K. N., Lloyd, J. R., Tamura, N., Valek, B. C., and Kao, C. R., "The Study of Microstructure Evolution of Tin Grains Due to Electromigration by Using Synchrotron X-Ray Microdiffraction," TMS Letters, vol. 1 no. 8, pp. 165-166. 2004.

Wu, Albert T., and Ding, Y. C., "The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment," Microelectronics Reliability, vol. 49 no. 3, pp. 318-322, Mar. 2009. https://doi.org/10.1016/j.microrel.2008.11.002

Wu, B. Y., Zhong, H. W., Chan, Y. C., and Alam, M. O., "Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current density," Journal of Materials Science: Materials in Electronics, vol. 17 no. xx, pp. 943-950, 2006.

Wu, B. Y., Chan, Y. C., Alam, M. O., and Jillek, W., "Electrochemical corrosion study of Pb-free solders," Journal of Materials Research, vol. 21 no. 1, pp. 62-70, Jan. 2006.

Wu, B. Y., Alam, M. O., Chan, Y. C., and Zhong, H. W., "Joule Heating Enhanced Phase Coarsening in Sn37Pb and Sn3.5Ag0.5Cu Solder Joints during Current Stressing," Journal of Electronic Materials , vol. 37 no. 4, pp. 469-476, Apr. 2008.

Wu, B. Y., Chan, Y. C., Zhong, H. W., Alam, M. O., and Lai, J. K. L., "Study of the thermal stress in a Pb-free half-bump solder joint under current stressing," Applied Physics Letters, vol. 90 no. 23, pp. 232112-1-232112-3, 2007.

Wu, Bi-Chu, Pecht, Michael, and Jennings, David, "Conductive Filament Formation In Printed Wiring Boards," Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium, Baltimore, MD, Sept. 28-30, 1992, pp. 74-79.

Wu, Bulong, Yang, Yu-Hsiang, Han, Bongtae, and Schumacher, Joshua, "Measurement of anisotropic coefficients of thermal expansion of SAC305 solder using surface strains of single grain with arbitrary orientation," Acta Materialia, vol. 156, pp. 196-204, Sept. 1, 2018.

Wu, C. M. L., and Huang, M. L., "Creep Behavior of Eutectic Sn-Cu Lead-Free Solder Alloy," Journal of Electronic Materials, vol. 31 no. 5, pp. 442-448, May 2002.

Wu, C. M. L., Huang, M. L., Lai, J. K. L., and Chan, Y. C., "Developing a Lead-Free Solder Alloy Sn-Bi-Ag-Cu by Mechanical Alloying," Journal of Electronic Materials, vol. 29 no. 8, pp. 1015-1020, Aug. 2000.

Wu, C. M. L., Yeung, N. H., Lam, W. H., and Li, R. K. Y., "High Energy Impact Resistance of Sb-Sn Lead-Free SMT Joint," Materials Science Forum, vol. 437-438, pp. 117-120, 2003.

Wu, C. M. L., Yu, D. Q., Law, C. M. T., and Wang, L., "Microstructure and Mechanical Properties of New Lead-Free Sn-Cu-RE Solder Alloys," Journal of Electronic Materials, vol. 31 no. 9, pp. 928-932, Sept. 2002.

Wu, C. M. L., and Law, C. M. T., "Microstructure Evolution and Shear Strength of Eutectic Sn-9Zn and Sn-0.7Cu Lead-Free BGA Solder Balls," Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, China, June 30-July 3, 2004, pp. 47-51.

Wu, C. M. L., Yu, D. Q., Law, C. M. T., and Wang, L., "Properties of lead-free solder alloys with rare earth element additions," Materials Science and Engineering: R: Reports, vol. 44 no. 1, pp. 1-44, Apr. 1, 2004.

Wu, C. M. L., and Wong, Y. W., "Rare-earth additions to lead-free electronic solders," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 77-91, Mar. 2007.

Wu, C. M. L., Yeung, N. H., Tsang, C. H., and Chan, Y. C., "Reliability Assessment of Connection Using HSC on LCD," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 220-223.

Wu, C. M. L., Liu, Johan, and Yeung, N. H., "Reliability of ACF in Flip-Chip with Various Bump Height," 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18-21, 2000, pp. 101-106.

Wu, C, M, L., Yeung, N. H., Chau, M. L., and Lai, J. K. L., "Residual Strength of OLB in a TAB Assembly with ACF after Thermal and Mechanical Loading," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 295-298.

Wu, C. M. L., Liu, Johan, and Yeung, N. H., "The effects of bump height on the reliability of ACF in flip-chip," Soldering & Surface Mount Technology, vol. 13 no. 1, pp. 25-30, 2001.

Wu, C. M. L., Yu, D. Q., Law, C. M. T., and Wang, L., "The Properties of Sn-9Zn Lead-Free Solder Alloys Doped with Trace Rare Earth Elements," Journal of Electronic Materials, vol. 31 no. 9, pp. 921-927, Sept. 2002.

Wu, C. M. L., Law, C. M. T., Yu, D. Q., and Wang, L., "The Wettability and Microstructure of Sn-Zn-RE Alloys," Journal of Electronic Materials, vol. 32 no. 2, pp. 63-69, Feb. 2003.

Wu, C. M. Lawrence, "A Promising Lead-free Material for Flip-Chip Bumps: Sn-Cu-RE," Fourth International Conference on Advanced Semiconductor Devices and Microsystems , Smolenice Castle, Slovakia, Oct. 14-16, 2002, pp. 17-26.

Wu, C. M. Lawrence, and Chau, M. L., "Degradation of flip-chip-on-glass interconnection with ACF under high humidity and thermal ageing," Soldering & Surface Mount Technology , vol. 14 no. 2, pp. 51-58, 2002.

Wu, C. M. Lawrence, Li, Robert K. Y., and Yeung, N. H., "Impact Resistance of SM Joints Formed With ICA," Journal of Electronic Packaging, Transactions of the ASME, vol. 124 no. 4, pp. 374-378, Dec. 2002.

Wu, C. M. Lawrence, and Huang, Mingliang L., "Microstructural Evolution of Lead-Free Sn-Bi-Ag-Cu SMT Joints During Aging," IEEE Transactions on Advanced Packaging, vol. 28 no. 1, pp. 128-133, Feb. 2005.

Wu, Changjun, Su, Xuping, Wang, Jianhua, Liu, Ya, Tu, Hao, and Zhang, Yifan, "Phase Equilibria of the Sn-Ni-V System at 800°C," Journal of Electronic Materials, vol. 43 no. 11, pp. 4111-4118, Nov. 2014.

Wu, Changjun, Su, Xuping, Peng, Haoping, Liu, Ya, Tu, Hao, and Wang, Jianhua, "Phase Equilibria of the Sn-Ni-V System: The 980°C Isothermal Section and the Sn-Rich Corner at 600°C and 300°C," Journal of Electronic Materials , vol. 44 no. 10, pp. 3904-3913, Oct. 2015.

Wu, Cuiping, Shen, Jun, and Peng, Changfei, "Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder joints," Journal of Materials Science: Materials in Electronics, vol. 23 no 1, pp. 14-21, Jan. 2012.

Wu, D., Mao, H. Y., and Wu, W. G., "Fabrication of Compact Collateral Silicon Nanowires Based on Continuously Alternating Deposition," Conference on Nano/Micro Engineered and Molecular Systems, Shenzhen, China, Jan. 5-8, 2009, pp. 601-604.

Wu, D., Lograsso, T. A., and Anderegg, J. W., "Migration, Formation, and Growth of Pure Cd Whiskers in Cd-Based Compounds," Journal of Electronic Materials, vol. 36 no. 5, pp. 555-561, May 2007.

Wu, Di, Xu, Tingting, Shi, Zhifeng, Tian, Yongtao, and Li, Xinjian, "Construction of ZnTe nanowires/Si p-n heterojunctions for electronic and optoelectronic applications," Journal of Alloys and Compounds, vol. 661, pp. 231-236, Mar. 15, 2016.

Wu, Er-Dong, and Guo, Xiu-Mei, "Mn Nanowhiskers of a Novel Hexagonal Phase Grown from Hydrogen Activated Laves Phase Alloys," Chinese Physics Letters, vol. 25 no. 7, pp. 2607-2609, July 2008.

Wu, Fei-Jain, Lee, Chang Hoon, and Loh, Karl, "Assembly of a Prototype Flip-Chip-On-Glass Liquid Crystal Display," 1995 Proceedings 45th Electronic Components & Technology Conference , Las Vegas, NV, May 21-24, 1995, pp. 674-681.

Wu, Fengshun, He, Mingmin, Wu, Yiping, An, Bing, and Zhang, Weigang, "Effect of Interfacial IMCs Proportion on the Reliability of Miniature Lead-Free Solder Joint," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Wu, Fengshun, Wang, Bo, Du, Bin, An, Bing, and Wu, Yiping, "Effect of Stand-Off Height on Microstructure and Tensile Strength of Cu/Sn9Zn/Cu Solder Joint," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 494-498.

Wu, Fengshun, Wang, Bo, Du, Bin, An, Bing, and Wu, Yiping, "Effect of Stand-Off Height on Microstructure and Tensile Strength of the Cu/Sn9Zn/Cu Solder Joint," Journal of Electronic Materials, vol. 38 no. 6, pp. 860-865, June 2009.

Wu, Fengshun, Wu, Yiping, Wu, Boyi, and Chen, Li, "Shear Strength of Flip Chip Packaging Bonded with Anisotropic Conductive Film," Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors, vol. 25 no. 3, pp. 340-345, Mar. 2004.

Wu, Fupei, and Li, Shengping, "The cause analysis of pseudo solder in surface mounted technology," Advanced Materials Research, vol. 146-147, pp. 895-898, 2010.

Wu, G. Q., and Zhang, Z. K., "Recycling of waste printed circuit boards," Circuit World, vol. 36 no. 4, pp. 35-39, 2010.

Wu, Guanghua, and Tao, Bo, "A Stress-related Model for Reliability Lifetime Estimation of ACA Joints Based on Accelerated Failure Date," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 907-911.

Wu, Guanghua, Tao, Bo, and Yin, Zhouping, "Study on the shear strength degradation of ACA joints induced by different hygrothermal aging conditions," Microelectronics Reliability, vol. 53 no. 12, pp. 2030-2035, Dec. 2013.

Wu, H. A., Soh, A. K., Wang, X. X., and Sun, Z. H., "Strength and Fracture of Single Crystal Metal Nanowire," Key Engineering Materials, vol. 261-263, pp. 33-38, Apr. 2004.

Wu, H. P., Liu, J. F., Wu, X. J., Ge, M. Y., Wang, Y. W., Zhang, G. Q., and Jiang, J. Z., "High conductivity of isotropic conductive adhesives filled with silver nanowires," International Journal of Adhesion and Adhesives, vol. 26 no. 8, pp. 617-621, Dec. 2006. https://doi.org/10.1016/j.ijadhadh.2005.10.001

Wu, Haifei, Tang, Jiahao, Liang, Qifeng, Shi, Biyun, Niu, Yixiao, Si, Jianxiao, Liao, Qing, and Dou, Weidong, "A van der Waals epitaxial growth of ultrathin two-dimensional Sn film on graphene covered Cu(111) substrate," Applied Physics Letters, vol. 115 no. 14, pp. 141601-1-141601-5, Sept. 30, 2019.

Wu, Haifeng, Jiang, Xiangdong, Li, Wei, Wang, Jimin, Zeng, Yixiong, and Ming, Yangzhou, "Silicon nanowires prepared by hydrogen-assisted rf-magnetron sputtering on bismuth-coated ITO glass," Materials Letters, vol. 188, pp. 312-315, Feb. 1, 2017.

Wu, Hsing-Fei, Chiang, Ming-Jui, and Chuang, Tung-Han, "Selective Formation of Intermetallic Compounds in Sn-20In-0.8Cu Ball Grid Array Solder Joints with Au/Ni Surface Finishes," Journal of Electronic Materials, vol. 33 no. 9, pp. 940-947, Sept. 2004.

Wu, Hui-Min, Wu, Feng-Chih, and Chuang, Tung-Han, "Intermetallic Reactions in a Sn-20In-2.8Ag Solder Ball-Grid-Array Package with Au/Ni/Cu Pads," Journal of Electronic Materials, vol. 34 no. 11, pp. 1385-1390, Nov. 2005.

Wu, J. D., Lee, C. W., Zheng, P. J., Lee, Jeffrey C. B., and Li, Simon, "Electromigration Reliability of SnAgxCuy Flip Chip Interconnects," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 961-967.

Wu, Jerry, Arslanian, Gregory K., and Tan, Emily, "Benefits of Inert Gas Soldering for Printed Circuit Board Assembly Processes," South East Asia Technical Training Conference on Electronics Assembly Technologies 2012 Proceedings, Penang, Malaysia, Apr. 18-20, 2012, pp. xx-xx.

Wu, Ji, and Pecht, Michael G., "Contact Resistance and Fretting Corrosion of Lead-Free Alloy Coated Electrical Contacts," Proceedings of 2004 International IEEE Conference on the Asian Green Electronics, Shanghai, China, Apr. 27-30, 2004, pp. 127-135.

Wu, Ji, and Pecht, Michael G., "Contact Resistance and Fretting Corrosion of Lead-Free Alloy Coated Electrical Contacts," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 2, pp. 402-410, June 2006.

Wu, Ji, Pecht, Michael, and Mroczkowski, Robert S., "Electrical Characterization of Lead-Free Solder Separable Contact Interfaces," 2002 Pan Pacific Symposium Conference Proceedings, Maui, Hawaii, Feb. 5-7, 2002, pp. xx-xx.

Wu, Ji, Pecht, Michael, and Mroczkowski, Robert S., "Electrical Characterization of Lead-Free Solder Separable Contact Interfaces," Journal of SMT, vol. 15 no. 2, pp. 25-29, Apr. 2002.

Wu, Ji, and Pecht, Michael, "Fretting Corrosion Studies For Lead-Free Alloy Plated Contacts," Proceedings of 4th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2002, pp. 20-24.

Wu, Jiali, Moon, Kyoung-sik, and Wong, C. P., "Self-Alignment Feasibility Study and Contact Resistance Improvement of Electrically Conductive Adhesives (ECAs)," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 571-575.

Wu, Jiali, Moon, Ktoung-sik, and Wong, C. P., "The Depletion/Wetting of the Low Melting Point Alloy in Electrically Conductive Adhesives (ECAs)," 2001 International Symposium on Advanced Packaging Materials, Braselton, GA, Mar. 11-14, 2001, pp. 318-321.

Wu, Jian-Shu, Yu, Shan-Pu, Peng, I-Hsuan, Wang, Jong-Lih, and Chung, Brooks, "Board-Level Reliability of Lead-free SnAgCu Solder Joint," Proceedings of the 4th International Symposium on Electronic Materials and Packaging, Kaohsiung, Taiwan, Dec. 4-6, 2002, pp. 282-286.

Wu, Jiang, Qin, Yufei, Zhou, Quan, and Xu, Zhenming, "Impact of nonconductive powder on electrostatic separation for recycling crushed waste printed circuit board," Journal of Hazardous Materials , vol. 164 no. 2-3, pp. 1352-1358, May 30, 2009.

Wu, Jie, Xue, Songbai, Wang, Jingwen, and Wang, Jianxin, "Comparative studies on microelectronic reliability issue of Sn whisker growth in Sn-0.3Ag-0.7Cu-1Pr solder under different environments," Microelectronics Reliability, vol. 79, pp. 124-135, Dec. 2017.

Wu, Jie, Xue, Songbai, Wang, Jingwen, and Wu, Mingfang, "Coupling effects of rare-earth Pr and Al2O3 nanoparticles on the microstructure and properties of Sn-0.3Ag-0.7Cu low-Ag solder," Journal of Alloys and Compounds, vol. 784, pp. 471-487, May 5, 2019.

Wu, Jie, Xue, Songbai, Wang, Jingwen, and Wu, Mingfang, "Effect of in-situ formed Pr-coated Al2O3 nanoparticles on interfacial microstructure and shear behavior of Sn-0.3Ag-0.7Cu-0.06Pr/Cu solder joints during isothermal aging," Journal of Alloys and Compounds, vol. 799, pp. 124-136, Aug. 30, 2019.

Wu, Jie, Xue, Songbai, Wang, Jingwen, Wang, Jianxin, and Liu, Shuang, "Effect of Pr addition on properties and Sn whisker growth of Sn-0.3Ag-0.7Cu low-Ag solder for electronic packaging," Journal of Materials Science: Materials in Electronics, vol. 28 no. 14, pp. 10230-10244, July 2017.

Wu, Jie, Xue, Songbai, Wang, Jingwen, and Xue, Peng, "Effect of Thermal Cycling on Interfacial Microstructure and Mechanical Properties of Sn-0.3Ag-0.7Cu-(a-Al2O3) Nanoparticles/Cu Low-Ag Solder Joints," Journal of Electronic Materials, vol. 48 no. 7, pp. 4562-4572, July 2019.

Wu, Jie, Xue, Songbai, Wang, Jingwen, Wu, Mingfang, and Wang, Jianhao, "Effects of a-Al2O3 nanoparticles-doped on microstructure and properties of Sn-0.3Ag-0.7Cu low-Ag solder," Journal of Materials Science: Materials in Electronics, vol. 29 no. 9, pp. 7372-7387, May 2018.

Wu, Jie, Xue, Song-bai, Wang, Jing-wen, Liu, Shuang, Han, Yi-long, and Wang, Liu-jue, "Recent progress of Sn-Ag-Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging," Journal of Materials Science: Materials in Electronics, vol. 27 no. 12, pp. 12729-12763, Dec. 2016.

Wu, Jim C. L., Lee, C. B., Chou, Y. S., Lee, S. C., Ding, Y. C., and Zheng, P. Z., "Development of Lead Free Package and Its Reliability," Advances in Electronic Packaging, vol. 2, pp. 1297-1306, 2001.

Wu, Jing, Alam, Mohammad S., Hassan, K. M. Rafidh, Suhling, Jeffrey C., and Lall, Pradeep, "Investigation and Comparison of Aging Effects in SAC+X Solders Exposed to High Temperatures," 2020 IEEE 70th Electronic Components and Technology Conference, Lake Buena Vista, AL, May 26-29, 2020, pp. 492-503.

Wu, Jing, Alam, Mohammad S., Hassan, K. M. Rafidh, Suhling, Jeffrey C., and Lall, Pradeep, "Investigation and Comparison of Microstructural Changes in SAC and SAC+X Solders Exposed to Short-Term Aging," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , Orlando, FL, May 26-29, 2020, pp. 1229-1238.

Wu, Jing, Ahmed, Sudan, Suhling, Jeffrey C., and Lall, Pradeep, "Investigation of Aging Induced Microstructural Changes in Doped SAC+X Solders," 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 28-31, 2019, pp. 405-415.

Wu, Jing, Fu, Nianjun, Ahmed, Sudan, Suhling, Jeffrey C., and Lall, Pradeep, "Investigation of Microstructural Evolution in SAC Solders Exposed to Short-Term and Long-Term Aging," 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29-June 1, 2018, pp. 1234-1242.

Wu, Jing, Suhling, Jeffrey C., and Lall, Pradeep, "Microstructural Evolution in SAC+X Solders Subjected to Aging," 2019 IEEE 69th Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2019, pp. 1087-1098.

Wu, Jun, Borg, B. Mattias, Jacobsson, Daniel, Dick, Kimberly A., and Wernersson, Lars-Erik, "Control of composition and morphology in InGaAs nanowires grown by metalorganic vapor phase epitaxy," Journal of Crystal Growth, vol. 383, pp. 158-165, Nov. 15, 2013.

Wu, K. C., Lee, C. H., and Chiang, Kuo-Ning, "Characterization of thermal cycling ramp rate and dwell time effects on AF (Acceleration Factor) Estimation," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 251-256.

Wu, Kai-Chiang, and Chiang, Kuo-Ning, "Investigation of Solder Creep Behavior on Wafer Level CSP Under Thermal Cycling Loading," 2014 International Conference on Electronics Packaging , Toyoma, Japan, Apr. 23-25, 2014, pp. 498-501.

Wu, Kai-Chiang, Lin, Si-Yun, and Chiang, Kuo-Ning, "Investigation of Strain Rate Effect on Lifetime Performance of Wafer Level CSP Under Different Thermal Cycling Loading Rate," 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 22-24, 2014, pp. 102-104.

Wu, Kai-Chiang, Lin, Si-Yun, Hung, Tuan-Yu, and Chiang, Kuo-Ning, "Reliability Assessment of Packaging Solder Joints Under Different Thermal Cycle Loading Rates," IEEE Transactions on Device and Materials Reliability, vol. 15 no. 3, pp. 437-442, Sept. 2015.

Wu, Kepeng, Aoyama, Makoto, Wade, Noboru, Cui, Jie, Yamada, Shinji, and Miyahara, Kazuya, "Creep and Rupture Behavior of Cu Wire/Lead-Free Solder-Alloy Joint Specimen," Journal of Electronic Materials, vol. 32 no. 12, pp. pp. 1392-1397, Dec. 2003.

Wu, Kepeng, Wade, Noboru, Yamada, Seiji, and Miyahara, Kazuya, "Effect of variation of microstructure on the creep and rupture strengths of a Sn-3.5 % Ag lead-free solder alloy," Zeitschrift fur Metallkunde, vol. 95 no. 2, pp. 185-188, Mar. 2004.

Wu, Kepeng, Wade, Noboru, Cui, Jie, and Miyahara, Kazuya, "Microstructural Effect on the Creep Strength of a Sn-3.5%Ag Solder Alloy," Journal of Electronic Materials, vol. 32 no. 1, pp. 5-8, Jan. 2003.

Wu, Keyue, Chen, Jiyang, Shen, Xiao, and Cui, Jingbiao, "Resistive switching in Si2Te3 nanowires," AIP Advances, vol. 8 no. 12, pp. 125008-1-125008-7, Dec. 2018.

Wu, L., Ashworth, M. A., and Wilcox, G. D., "Investigation of Whisker Growth from Alkaline Non-cyanide Zinc Electrodeposits," Journal of Electronic Materials, vol. 46 no. 2, pp. 1114-1127, Feb. 2017.

Wu, L., Ashworth, M. A., and Wilcox, G. D., "Zinc whisker growth from electroplated finishes - a review," Transactions of the IMF, vol. 93 no. 2, pp. 1-8, 2015. https://doi.org/10.1179/0020296715Z.000000000227

Wu, Liang, and Cobley, Andrew J., "Investigation into the effects of magnetic agitation and pulsed current on the development of SnCu alloy electrodeposits," Thin Solid Films, vol. 683, pp. 118-127, Aug. 1, 2019.

Wu, Mao, Qu, Xuan-hui, He, Xin-bo, Rafi-ud-din, Ren, Shu-bin, and Qin, Ming-li, "Interfacial reactions between Sn-2.5Ag-2.0Ni solder and electroless Ni(P) deposited on SiCp/Al composites," Transactions of Nonferrous Metals Society of China, vol. 20 no. 6, pp. 958-965, June 2010.

Wu, Max K. C., Pan, H. Y., Lin, Larry, Chiu, Christine, Chou, Tulip, Lu, Gary, Liu, Patrick, Wu, Gene, Pu, H. P., Tsai, H. Y., Kiang, Bill, Wu, Kenneth, Lii, M. J., and Yu, C. H., "Flip Chip Power Cycling System Development and Lead Free Bump Power Cycling Reliability," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 771-775.

Wu, Mei-Ling, "Assessing the Impact of Uncertainty in Physics of Failure Analysis of BGA solder joints Fatigue Damage," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Wu, Mei-Ling, "Design of experiments to investigate reliability for solder joints PBGA package under high cycle fatigue," Microelectronics Reliability, vol. 50 no. 1, pp. 127-139, Jan. 2010.

Wu, Mei-Ling, and Lan, Jia-Shen, "Prediction of Fatigue Resistance in Lead-Free Ni-Doped SAC 1205 Solder Alloys Using a Rate-Dependent Material Model and Subjected to Drop Tests," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 8 no. 10, pp. 1777-1787, Oct. 2018.

Wu, Mei-Ling, and Lan, Jia-Shen, "Reliability and failure analysis of SAC 105 and SAC 1205N lead-free solder alloys during drop test events," Microelectronics Reliability, vol. 80, pp. 213-222, Jan. 2018.

Wu, Min, and Su, Xiangyu, "An investigation on surface tension of Sn-based lead free solders," Journal of Materials Science: Materials in Electronics, vol. 26 no. 11, pp. 8425-8431, Nov. 2015.

Wu, Min, and Li, Jinquan, "Estimation of the Viscosities of Liquid Sn-Based Binary Lead-Free Solder Alloys," Journal of Electronic Materials, vol. 47 no. 1, pp. 155-161, Jan. 2018.

Wu, Min, and Lv, Bailin, "Prediction of Phase Formation in Nanoscale Sn-Ag-Cu Solder Alloy," Journal of Electronic Materials, vol. 45 no. 1, pp. 38-43, Jan. 2016.

Wu, Min, and Lv, Bailin, "Prediction of viscosity of ternary tin-based lead-free solder melt using BP neural network," Soldering & Surface Mount Technology, vol. 32 no. 3, pp. 173-180, 2020.

Wu, Pei-Lin, Huang, Meng-Kuang, Lee, Chiapyng, and Tzan, Shyh-Rong, "Effects of Different Printed-Circuit-Board Surface Finishes on the Formation and Growth of Intermetallics at Thermomechanically Fatigued, Small Outline J Leads/Sn-Ag-Cu Interfaces," Journal of Electronic Materials, vol. 33 no. 3, pp. 157-161, Mar. 2004.

Wu, Pei-Lin, Huang, Meng-Kuang, Lee, Chiapyng, and Tzan, Shyh-Rong, "Failure behavior of small outline J Lead/Sn-X (X = AgCu or Pb) solder joints under thermomechanical fatigue test," Materials Chemistry and Physics , vol. 87 no. 2-3, pp. 285-291, Oct. 15, 2004.

Wu, R. W., Tsao, L. C., and Chen, R. S., "Effect of 0.5 wt% nano-TiO2 addition into low-Ag Sn0.3Ag0.7Cu solder on the intermetallic growth with Cu substrate during isothermal aging," Journal of Materials Science: Materials in Electronics, vol. 26 no. 3, pp. 1858-1865, Mar. 2015.

Wu, R. W., Tsao, L. C., Chang, S. Y., Jain, C. C., and Chen, R. S., "Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates," Journal of Materials Science: Materials in Electronics, vol. 22 no. 8, pp. 1181-1187, Aug. 2011.

Wu, Rui, and McCluskey, F. Patrick, "Constitutive Relations of Indium Solder Joint in Cold Temperature Electronic Packaging Based on Anand Model," 11th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 28-31, 2008, pp. 683-686.

Wu, Rui, and McCluskey, F. Patrick, "Reliability of Indium Solder for Cold Temperature Packaging," Proceedings of the ASME InterPack Conference, Volume 1, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 553-446.

Wu, S. H., Hu, Y. J., Lu, C. T., Huang, T. S., Chang, Y. H., and Liu, C. Y., "Electromigration Study on Sn(Cu) Solder/Ni(P) Joint Interfaces," Journal of Electronic Materials, vol. 41 no. 12, pp. 3342-3347, Dec. 2012.

Wu, Sean X., Peng, Su, and Yeh, Chao-Pin, "Behaviors of Polymeric Materials and Their Effects on High Density PWB," IEEE Transactions on Components and Packaging Technologies, vol. 23 no. 3, pp. 428-433, Sept. 2000.

Wu, Sean X., Zhang, Crystal, Yeh, Chao-Pin, Wille, Steve, and Wyatt, Karl, "Cure Kinetics and Mechanical Properties of Conductive Adhesive," 1997 Electronic Components and Technology Conference, San Jose, CA, May 18-21, 1997, pp. 550-553.

Wu, Sean X., Mei, Yuhai, Yeh, Chao-pin, and Wyatt, Karl W., "Process Induced Residual Stresses in Isotropically Conductive Adhesive Joints," IEEE Transactions on Components, Packaging, and Manufacturing Technology-- Part C, vol. 19 no. 4, pp. 251-256, Oct. 1996.

Wu, Tienhua, and Chen, Yenming J., "Understanding Population Dynamics of WEEE Recycling System in the Developing Countries: A SIR Model," 2008 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 19-21, 2008, pp. xx-xx.

Wu, W. H., Chung, H. L., Lee, Nico, Peng, Robert, and Ho, C. E., "A Study on the Soldering Reaction between Sn3Ag0.5Cu and Electrolytic-Ni Coated with A Au/Pd(P) Bilayer Surface Finish," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Wu, W. H., Chung, H. L., Chen, B. Z., and Ho, C. E., "Critical Current Density for Inhibiting (Cu,Ni)6Sn5 Formation on the Ni Side of Cu/Solder/Ni Joints," Journal of Electronic Materials, vol. 39 no. 12, pp. 2653-2661, Dec. 2010.

Wu, W. H., Lin, C. S., Huang, S. H., and Ho, C. E., "Influence of Palladium Thickness on the Soldering Reactions Between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish," Journal of Electronic Materials, vol. 39 no. 11, pp. 2387-2396, Nov. 2010.

Wu, W. H., Chung, H. L., Chen, C. N., and Ho, C. E., "The Influence of Current Direction on the Cu-Ni Cross-Interaction in Cu/Sn/Ni Diffusion Couples," Journal of Electronic Materials, vol. 38 no. 12, pp. 2563-2572, Dec. 2009.

Wu, Wangran, Wu, Heng, Sun, Weifeng, Si, Mengwei, Conrad, Nathan, Zhao, Yi, and Ye, Peide D., "Mobility Fluctuation-Induced Low-Frequency Noise in Ultrascaled Ge Nanowire nMOSFETs With Near-Ballistic Transport," IEEE Transactions on Electron Devices, vol. 65 no. 6, pp. 2573-2577, June 2018.

Wu, Wen-Han, Chuang, Hung-Yi, and Hsu, Steve Lien-chung, "Synthesis and mechanism of template-free growth of silver nanowires via syringes," Journal of Materials Research, vol. 31 no. 1, pp. 109-116, Jan. 14, 2016.

Wu, Wen-Yun, Qiu, Xiao-Ming, Yin, Shi-Qiang, Sun, Da-Qian, and Li, Ming-Gao, "Influence of Bi, Ag on microstructure and properties of Sn-Zn lead-free solder," Zhongguo Youse Jinshu Xuebao/The Chinese Journal of Nonferrous Metals, vol. 16 no. 1, pp. 158-163, Jan. 2006.

Wu, Xiaodan, Li, Jianxing, Unuvar, Tora, Manikam, Vemal Raja, and Tolentino, Erik Nino, "The Improvements of High Temperature Zn-Based Lead Free Solder," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1268-1272.

Wu, Xulei, Wu, Jiawei, Wang, Xiaojing, Yang, Jie, Xia, Ming, and Liu, Bin, "Effect of In addition on microstructure and mechanical properties of Sn-40Bi alloys," Journal of Materials Science, vol. 55 no. 7, pp. 3092-3106, Mar. 2020.

Wu, Xuewei, Ding, Dongyan, Han, Bai, and Mao, Dali, "Microstructure and Mechanical Properties of Lead-free PV Ribbon," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1072-1075.

Wu, Xulei, Xia, Ming, Li, Sujie, Wang, Xiaojing, Liu, Bin, Zhang, Jiaoxia, and Liu, Ning, "Microstructure and mechanical behavior of Sn-40Bi-xCu alloy," Journal of Materials Science: Materials in Electronics, vol. 28 no. 20, pp. 15708-15717, Oct. 2017.

Wu, Y. K., Lin, K. L., and Salam, B., "Specific Heat Capacities of Sn-Zn-Based Solders and Sn-Ag-Cu Solders Measured Using Differential Scanning Calorimetry," Journal of Electronic Materials, vol. 38 no. 2, pp. 227-230, Feb. 2009.

Wu, Y. P., Alam, M. O., Chan, Y. C., and Wu, B. Y., "Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages," Microelectronics Reliability, vol. 44 no. 2, pp. 295-302, Feb. 2004.

Wu, Y. P., Alam, M. O., Chan, Y. C., and Wu, B. Y., "Impact Properties of Flip Chip Interconnection Using Anisotropically Conductive Film on the Glass and Flexible Substrate," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 544-548.

Wu, Y. Q., Barry, J. C., Yamamoto, T., Gu, Q. F., McDonald, S. D., Matsumura, S., Huang, H., and Nogita, K., "A new phase in stoichiometric Cu6Sn5," Acta Materialia, vol. 60 no. 19, pp. 6581-6591, Nov. 2012.

Wu, Yanbo, Zeng, Sisi, and Sun, Peng, "Structure and Corrosion Resistance of Tin Salt Conversion Coating on Aluminum Alloy," Advanced Materials Research, vol. 129-131, pp. 467-471, 2010.

Wu, Yi-Hsin, Yu, Chi-Yang, Ho, Cheng-Ying, and Duh, Jenq-Gong, "Retardation of (Cu,Ni)6Sn5 spalling in Sn-Ag-Cu/Ni solder joints via controlling the grain structure of Ni metallization layer," Materials Letters, vol. 105, pp. 40-42, Aug. 15, 2013.

Wu, Yiping, Zhang, Jinsong, Wu, Fengshun, and An, Bing, "Electromigration of SnAgCu solder interconnects," Pan Tao Ti Hsueh Pao/ Chinese Journal of Semiconductors, vol. 27 no. 6, pp. 1136-1140, June 2006.

Wu, Yuan-Yun, Lin, Wen P., and Lee, Chin C., "Chemical Reactions of Silver and Indium at 180°C Annealing," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 717-723.

Wu, Yuan-Yun, Lin, Wen P., and Lee, Chin C., "Silver-indium phase diagram and its applications to electronic packaging," 2013 IEEE International Symposium on Advanced Packaging Materials , Irvine, CA, Feb. 27-Mar. 1, 2013, pp. 36-43.

Wu, Yuan-Yun, Nwoke, Dominic, Barlow, Fred D., and Lee, Chin C., "Thermal Cycling Reliability Study of Ag-In Joints Between Si Chips and Cu Substrates Made by Fluxless Processes," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 4 no. 9, pp. 1420-1426, Sept. 2014.

Wu, Yue, Min-Bo, Zhou, Hong-Bo, Qin, Xun-Ping, L. I., Xiao, M. A., and Xin-Ping, Zhang, "A Comparative Investigation of the Electromigration Behavior Between Wedge-Type and Line-Type Cu/Sn3.0Ag0.5Cu/Cu Interconnects," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 971-975.

Wu, Yujing, Jacobs, Elizabeth G., Pouraghabagher, Cyrus, and Pinizzitto, Russell F., "In-Situ TEM Study of Copper-Tin Intermetallic Formation," Materials Research Society Symposia Proceedings Volume 323, Boston, MA, Nov. 29-Dec. 3, 1993, pp. 165-170.

Wu, Z. X., Zhang, Y. W., Jhon, M. H., Greer, J. R., and Srolovitz, D. J., "Nanostructure and surface effects on yield in Cu nanowires," Acta Materialia, vol. 61 no. 6, pp. 1831-1842, Apr. 2013.

Wu, Zhenhua, Li, Jianzhi, Timmer, Douglas, Lozano, Karen, and Bose, Subhash, "Study of processing variables on the electrical resistivity of conductive adhesives," International Journal of Adhesion and Adhesives, vol. 29 no. 5, pp. 488-494, July 2009.

Wu, Zhiyong, Huang, Zhiheng, Xiong, Hua, Conway, Paul P., and Liu, Changqing, "Linkages Between Microstructure and Mechanical Properties of Ultrafine Interconnects." Journal of Electronic Materials, vol. 42 no. 2, pp. 263-271, Feb. 2013.

Wufeng, Feng, "Flip Chip Method in Smart Card/Smart Label Packaging," 2003 5th Conference on Electronics Packaging Technology, Dec 10-12, 2003, pp. 151-154.

Wulfert, Friedrich-Wilhelm, "Chancen und Risiken mit Pb-freien Halbleiterbauelementen," Freescale Semiconductor GmbH, Sept. 2004.

Wunderle, B., Kallmayer, C., Walter, H., Braun, T., Gollhardt, A., Michel, B., and Reichl, H., "Failure modeling of ACA-glued flip-chip on flex assemblies," Microsystem Technologies, vol. 15 no. 1, pp. 3-15, Jan. 2009.

Wunderle, B., Kallmayer, C., Walter, H., Braun, T., Michel, B., and Reichl, H., "Lifetime Model for Flip-Chip on Flex using Anisotropic Conductive Adhesive under Moisture and Temperature Loading," 11th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 28-31, 2008, pp. 799-808.

Wunderle, B., Kallmayer, C., Walter, H., Braun, T., Michel, B., and Reichl, H., "Reliability Modeling & Test for Flip-Chip on Flex Substrates with Ag-Filled Anisotropic Conductive Adhesive," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 271-280.

Wunderlich, Bernhard, and Shu, Hua-Cheng, "The Crystallization and Melting of Selenium," Journal of Crystal Growth , vol. 48 no. 2, pp. 227-239, Feb. 1980.

Wycherley, Andy, and Kinloch, Steve, "IMPROVED control of moisture sensitive devices," Electronics Manufacture and Test, pp. xx-xx, Mar. 2003.

Wynn, Paul., "Effective Zinc Nickel," Product Finishing, vol. 53 no. 7, pp. 8, July/Aug. 2000.

Wynn, Paul, "Hexavalent chromium update," Product Finishing, vol. 54 no. 6, pp. 5, June. 2001.

Wynn, Paul, "Replacing Hexavalent Chromium," Product Finishing, vol. 53 no. 10, pp. 7, Nov. 2000.

Wynn, Paul, and Bishop, Craig V., "Replacing Hexavalent Chromium," Plating & Surface Finishing , vol. 88 no. 2, pp. 12-14, Feb. 2001.

Wynn, Paul C., and Bishop, Craig V., "Replacing Hexavalent Chromium," Transactions of the Institute of Metal Finishing, vol. 79 no. 2, pp. B27-B30, Mar. 2001.

Wynn, Paul C., and Bishop, Craig V., "Replacing Hexavalent Chromium in Passivations on Zinc Plated Parts," Products Finishing, vol. 65 no. 5, pp. 55-62, Feb. 2001.

Wynn, Paul, and Bishop, Craig V., "Replacing Hexavalent Chromium - plating," Automotive Finishing , vol. xx no. xx, pp. xx-xx, Spring 2001.

Wynn, Paul, "The End of Life Vehicle Directive and International Material Data System," Products Finishing, vol. xx no. xx, pp. xx-xx, May 2003.

Wynn, Paul, "Under Pressure," Product Finishing, vol. 54 no. 10, pp. 8, Dec. 2001.

Wynn, Paul, "Workshop on green production in surface finishing industry: implications of RoHS, WEEE and ELV directives," Transactions of the Institute of Metal Finishing, vol. 85 no. 4, pp. 177-178, July 2007.

Wyrostek, Michael, and Wynn, Paul, "Driving Away from Hex Chrome Coatings," Metal Finishing, Apr. 3, 2006.

Wyvill, R. D., "Moybdate - a suitable replacement for chromate," Finishing Industries , vol. 3 no. 6, pp. 50,53, June 1979.

XXXX

Xavier, Marcella G. C., Cruz, Clarissa B., Kakitani, Rafael, Silva, Bismarck L., Garcia, Amauri, Cheung, Noe, and Spinelli, Jose E., "Directional solidification of a Sn-0.2Ni solder alloy in water-cooled copper and steel molds: Related effects on the matrix micromorphology, nature of intermetallics and tensile properties," Journal of Alloys and Compounds , vol. 723, pp. 1039-1052, Nov. 5, 2017.

Xi, Hongjia, Lou, Minyi, An, Bing, Wu, Fengshun, and Wu, Yiping, "Evaluate Anti-Shock Property of Solder Bumps by Impact Test," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Xi, Jia, Xiao, Fei, and Wang, Hu, "Comparative Study on the Reliability of QFN and AAQFN Packages," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 959-962.

Xia, Chuan, Yan, May, Priore, Scott, and Ramachandran, Kangeyan K., "Discussion on Cu Dissolution in Pb-Free PTH Rework," South East Asia Technical Training Conference on Electronics Assembly Technologies 2012 Proceedings, Penang, Malaysia, Apr. 18-20, 2012, pp. xx-xx.

Xia, Chuan, Gui, Charles, and Priore, Scott, "Package on Package Module Assembly Process Development," Conference Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 85-90.

Xia, Da-quan, Yang, Dong-hua, Liu, Xin, Zhou, Yu-feng, Gan, Gui-sheng, and Wu, Yi-ping, "Ultrasonic-assisted soldering of SAC0307 solder with Nano-particles active-flux," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 1696-1701.

Xia, Guofeng, Qin, Fei, An, Tong, and Li, Wei, "Diffusion-induced Stresses in the Intermetallic Compound Layer of Solder Joints," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 514-518.

Xia, Guofeng, Qin, Fei, Zhu, Wenhui, Gao, Cha, and Ma, Xiaobo, "Effects of Solder Constitutive Models and FE Models on Fatigue Life of Dual-row QFN Package," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 595-599.

Xia, Guofeng, Qin, Fei, Chen, Si, and An, Tong, "Thermal Fatigue Reliability Design of Solder Bumps in TSV Interposer Package Based on Finite Element Analysis," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 517-520.

Xia, Jiang, Li, GuoYuan, Zhou, Bin, and Cheng, LanXian, "PoP Assembly Reliability Test and Assessment Under Random Vibration Loading," 2016 17th International Conference on Electronic Packaging Technology , Wuhan, China, Aug. 16-19, 2016, pp. 406-410.

Xia, Xinzhi, Zou, Changdong, Gao, Yulai, Liu, Johan, and Zhai, Qijie, "Preparation Techniques and Characterization for Sn-3.0Ag-0.5Cu Nanopowders," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Xia, Y. H., Jee, Y. K., Yu, J., and Lee, T. Y., "Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations," Journal of Electronic Materials, vol. 37 no. 12, pp. 1858-1862, Dec. 2008.

Xia, Y. H., Jillek, W., and Schmitt, E., "In-situ Observation on Electrochemical Migration of Lead-free Solder Joints under Water Drop Test," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Xia, Yanghua, and Xie, Xiaoming, "A Comparative Study of Failure Mechanisms of Sn-Ag-Cu Assemblies under Temperature Cycling and Board Level Drop Test," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Xia, Yanghua, Xie, Xiaoming, Lu, Chuanyan, and Chang, Junling, "Coupling effects at Cu(Ni)-SnAgCu-Cu(Ni) sandwich solder joint during isothermal aging," Journal of Alloys and Compounds, vol. 417 no. 1-2, pp. 143-149, June 29, 2006.

Xia, Yanghua, Lu, Chuanyan, and Xie, Xiaoming, "Effect of Interfacial Reactions on the Reliability of Lead-Free Assemblies after Board Level Drop Tests," Journal of Electronic Materials, vol. 36 no. 9, pp. 1129-1136, Sept. 2007.

Xia, Yanghua, and Xie, Xiaoming, "Endurance of lead-free assembly under board level drop test and thermal cycling," Journal of Alloys and Compounds, vol. 457 no. 1-2, pp. 198-203, June 12, 2008.

Xia, Yanghua, Lu, Chuanyan, Chang, Junling, and Xie, Xiaoming, "Interaction of Intermetallic Compound Formation in Cu/SnAgCu/NiAu Sandwich Solder Joints," Journal of Electronic Materials, vol. 35 no. 5, pp. 897-904, May 2006.

Xia, Yanghua, Xie, Xiaoming, Xie, Xiaoming, and Lu, Chuanyan, "Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging," Journal of Materials Science , vol. 41 no. x, pp. 2359-2364, 2006.

Xia, Yanghua, and Xie, Xiaoming, "Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling," Journal of Alloys and Compounds, vol. 454 no. 1-2, pp. 174-179, Apr. 24, 2008.

Xia, Z., Shi, Y., and Chen, Z., "Evaluation on the Characteristics of Tin-Silver-Bismuth Solder," Journal of Materials Engineering and Performance, vol. 11 no. 1, pp. 107-111, Feb. 2002.

Xia, Zhidong, Chen, Zhigang, Shi, Yaowu, Mu, Nan, and Sun, Na, "Effect of Rare Earth Element Additions on the Microstructure and Mechanical Properties of Tin-Silver-Bismuth Solder," Journal of Electronic Materials, vol. 31 no. 6, pp. 564-567, June 2002.

Xian, Ai-Ping, and Liu, Meng, "Effect of humidity on tin whisker growth from Sn3Nd intermetallic compound," Journal of Materials Research, vol. 27 no. 12, pp. 1652-1662, June 28, 2012.

Xian, Ai-Ping, and Liu, Meng, "Observations of continuous tin whisker growth in NdSn3 intermetallic compound," Journal of Materials Research, vol. 24 no. 9, pp. 2775-2783, Sept. 2009.

Xian, Ai-Ping, and Gong, Guo-Liang, "Oxidation Behavior of Molten Tin Doped with Phosphorus," Journal of Electronic Materials, vol. 36 no. 12, pp. 1669-1678, Dec. 2007.

Xian, Ai-Ping, "Wetting of Si-Al-O-N ceramic by Sn-5at.% Ti-X ternary active solder," Materials Science and Engineering B: Solid-State Materials for Advanced Technology, vol. 25 no. 1, pp. 39-46, June 1994.

Xian, J. W., Zeng, G., Belyakov, S. A., Gu, Q., Nogita, K., and Gourlay, C. M., "Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and bSn," Intermetallics, vol. 91, pp. 50-64, Dec. 2017.

Xian, J. W., Belyakov, S. A., and Gourlay, C. M., "Controlling Bulk Cu6Sn5 Nucleation in Sn0.7Cu/Cu Joints with Al Micro-alloying," Journal of Electronic Materials, vol. 45 no. 1, pp. 69-78, Jan. 2016.

Xian, J. W., Belyakov, S. A., Ollivier, M., Nogita, K., Yasuda, H., and Gourlay, C. M., "Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections," Acta Materialia, vol. 126, Mar. 2017, pp. 540-551.

Xian, J. W., Belyakov, S. A., Britton, T. B., and Gourlay, C. M., "Heterogeneous Nucleation of Bulk Cu6Sn5 in Sn-Ag-Cu-Al and Sn-Cu-Al Solders," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 2241-2247.

Xian, J. W., Belyakov, S. A., Britton, T. B., and Gourlay, C. M., "Heterogeneous nucleation of Cu6Sn5 in Sn-Cu-Al solders," Journal of Alloys and Compounds, vol. 619, pp. 345-355, Jan. 15, 2015.

Xian, J. W., Salleh, M. A. A. Mohd, Belyakov, S. A., Su, T. C., Zeng, G., Nogita, K., Yasuda, H., and Gourlay, C. M., "Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7Cu-0.05Ni," Intermetallics, vol. 102, pp. 34-45, Nov. 2018.

Xian, J. W., Ma, Z. L., Belyakov, S. A., Ollivier, M., and Gourlay, C. M., "Nucleation of tin on the Cu6Sn5 layer in electronic interconnections," Acta Materialia, vol. 123, Jan. 15, 2017, pp. 404-415.

Xiang, Koh Kai, Haseeb, A. S. M. A., Arafat, M. M., and Yingxin, Goh, "Effects of Mn Nanoparticles on Wettability and Intermetallic Compounds in between Sn-3.8Ag-0.7Cu and Cu Substrate during Multiple Reflow," 2012 4th Asia Symposium on Quality Electronic Design, Kuala Lumpur, Malaysia, July 10-11, 2012, pp. 297-301.

Xiang, Nan, Yin, Ting, Tian, Bao-hong, Tang, Sheng-wen, and Chen, E., "Evaluation on the Manufacturability of Solderable Sn Coatings Obtained by Employing Hot-Dipped Tinning Process," JOM, vol. 71 no. 12, pp. 4284-4295, Dec. 2019.

Xiang, Song, He, Yue, Shi, Wei, Ji, Xuanming, Tan, Yuanbiao, Liu, Jianmin, and Ballinger, Ronald G., "Chloride-induced corrosion behavior of cold-drawn pearlitic steel wires," Corrosion Science, vol. 141, pp. 221-229, Aug. 15, 2018.

Xiang, Wenfeng, Zhang, Jiaqi, Liu, Yuan, Hu, Minghao, Zhao, Kun, Guo, Haizhong, and Jin, Kuijun, "Facile controlled synthesis and magnetic properties of high-aspect-ratio nickel nanowires prepared by the dropping method," Journal of Alloys and Compounds, vol. 693, pp. 257-263, Feb. 5, 2017.

Xiang, Yun, Wu, Pingxiao, Zhu, Nengwu, Zhang, Ting, Liu, Wen, Wu, Jinhua, and Li, Ping, "Bioleaching of copper from waste printed circuit boards by bacterial consortium enriched from acid mine drainage," Journal of Hazardous Materials, vol. 184 no. 1-3, pp. 812-818, Dec. 15, 2010.

Xiangru, Meng, and Xin, Mu, "Remanufacturing Network Analysis of Third-Party Reverse Logistics for Waste Household Appliances," 2010 International Conference on Management and Service Science, Wuhan, China, Aug. 24-26, 2010, pp. xx-xx.

Xiangyang, Chen, and Dejian, Zhou, "Modeling and Reliability Analysis of Lead-Free Solder Joints of Bottom Leaded Plastic (BLP) Package," Proceedings of the 2006 IEEE CPMT Conference on High Density Microsystem Design, Packaging and Component Failure Analysis , Shanghai, June 27-28, 2006, pp. 247-253.

Xiao, Gesheng, Yuan, Guozheng, Jia, Chunnan, Yang, Xuexia, Li, Zhigang, and Shu, Xuefeng, "Strain rate sensitivity of Sn-3.0Ag-0.5Cu solder investigated by nanoindentation," Materials Science and Engineering: A, vol. 613, pp. 336-339, Sept. 8, 2014.

Xiao, H., Li, X. Y., Hu, Y., Guo, F., and Shi, Y. W., "Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling," Journal of Alloys and Compounds, vol. 578, pp. 110-117, Nov. 25, 2013.

Xiao, H., Li, X. Y., Zhu, Y. X., Yang, J. L., Chen, J., and Guo, F., "Intermetallic growth study on SnAgCu/Cu solder joint interface during thermal aging," Journal of Materials Science: Materials in Electronics, vol. 24 no. 7, pp. 2527-2536, July 2013.

Xiao, Han, Peng, Li, Liang, Jiaxing, Hu, Anmin, and Li, Ming, "Effects of Cu orientation and stand-off-height on the microstructure of Cu/SnAgCu interface," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 205-208.

Xiao, Hua, Chan, Yan-cheong, Zhu, Ze, and Wu, Fengshun, "Investigation in microstructure and mechanical properties of Ni-coated multi-wall carbon nanotubes doped Sn3.0Ag0.5Cu solder alloys," 2016 6th Electronic System-Integration Technology Conference, Grenoble, France, Sept. 13-15, 2016, pp. xx-xx.

Xiao, Hui, Li, Xiaoyan, Liu, Na, and Yan, Yongchang, "A Damage Model for SnAgCu Solder under Thermal Cycling," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 772-776.

Xiao, Hui, Luo, Daojun, and Li, Weiming, "Failure Analysis of Solder Joint Cracking in a CBGA Assembly Applied for Aviation Equipment," 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits, Hangzhou, China, July 2-5, 2019, pp. xx-xx.

Xiao, Hui, Luo, Daojun, and Sun, Zhe, "Failure Analysis on Interconnection Fault for BGA Module after Board Assembly," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1508-1512.

Xiao, Hui, Wan, Zhonghua, and Luo, Daojun, "Investigation on Damage Behavior of Lead-free Solder Joints Based on Finite Element Modeling," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 14-18.

Xiao, Hui, Luo, Daojun, and Wang, Hongqin, "Research on Damage-mechanism Based Prediction Methodologies for Thermo-mechanical Reliability of Solder Joints in Electronic Packaging," 2016 17th International Conference on Electronic Packaging Technology , Wuhan, China, Aug. 16-19, 2016, pp. 7-13.

Xiao, J., and Chung, D. D. L., "Electrothermomechanical analysis and its application to studying electrically conductive adhesive joints," Journal of Thermal Analysis and Calorimetry , vol. 74 no. 1, pp. 3-11, 2003.

Xiao, Jun, and Chung, D. D. L., "Thermal and Mechanical Stability of Electrically Conductive Adhesive Joints," Journal of Electronic Materials, vol. 34 no. 5, pp. 625-629, May 2005.

Xiao, Li, Liu, Johan, Lai, Zhonghe, Ye, LiLei, and Tholen, Anders, "Characterization of mechanical properties of bulk lead-free solders," Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, Braselton, GA, Mar. 6-8, 2000, pp. 145-151.

Xiao, Qiang, Nguyen, Luu, and Armstrong, William D., "Aging and Creep Behavior of Sn3.9Ag0.6Cu Solder Alloy," 54th Electronic Components & Technology Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1325-1332.

Xiao, Qiang, Bailey, Harold J., and Armstrong, William D., "Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy," Journal of Electronic Packaging, Transactions of the ASME , vol. 126 no. 2, pp. 208-212, June 2004.

Xiao, Qiang, Nguyen, Luu, and Armstrong, William D., "Anomalously High Tensile Creep Rates from Thin Cast Sn3.9Ag0.6Cu Lead-Free Solder," Journal of Electronic Materials, vol. 34 no. 7, pp. 1065-1075, July 2005.

Xiao, Qiang, and Armstrong, William D., "Tensile Creep and Microstructural Characterization of Bulk Sn3.9Ag0.6Cu Lead-Free Solder," Journal of Electronic Materials, vol. 34 no. 2, pp. 196-215, Feb. 2005.

Xiao, Qiang, Nguyen, Luu, and Armstrong, William D., "The Anomalous Microstructural, Tensile, and Aging Response of Thin-Case Sn3.9Ag0.6Cu Lead-Free Solder," Journal of Electronic Materials, vol. 34 no. 5, pp. 617-624, May 2005.

Xiao, Wei Min, Shi, Yao Wu, Lei, Yong Ping, Xia, Zhi Dong, and Guo, Fu, "In Situ Scanning Electron Microscopy Observation of Tensile Deformation in Sn-Ag-Cu Alloys Containing Rare-Earth Elements," Journal of Electronic Materials, vol. 37 no. 11, pp. 1751-1755, Nov. 2008.

Xiao, Weimin, Shi, Yaowu, Lei, Yongping, Xia, Zhidong, and Guo, Fu, "Comparative Study of Microstructures and Properties of Three Valuable SnAgCuRE Lead-Free Solder Alloys," Journal of Electronic Materials , vol. 35 no. 5, pp. 1095-1103, May 2006.

Xiao, WeiMin, Shi, YaoWu, Xu, GuangChen, Ren, Ren, Guo, Fu, Xia, ZhiDong, and Lei, YongPing, "Effect of rare earth on mechanical creep-fatigue property of SnAgCu solder joint," Journal of Alloys and Compounds, vol. 472 no. 1-2, pp. 198-202, Mar. 20, 2009.

Xiao, X., Sachdev, A. K., Haddad, D., Li, Y., Sheldon, B. W., and Soni, S. K., "Stress-induced Sn Nanowires from Si-Sn Nanocomposite Coatings," Applied Physics Letters, vol. 97, pp. 141904-1-141904-3, 2010.

Xiao, Zhengxiang, Xue, Songbai, Hu, Yuhua, Ye, Huan, Gao, Lili, and Wang, Hui, "Properties and microstructure of Sn-9Zn lead-free solder alloy bearing Pr," Journal of Materials Science: Materials in Electronics, vol. 22 no. 6, pp. 659-665, June 2011.

Xiaoganq, Shanq, Lauricella, Christiane Mazur, and Brandi, Sergio Duarte, "Spreading Dynamics of Tin, Bismuth and Some Lead-Free Solders over Copper Substrate," Materials Science Forum, vol. 475-479 part 5, pp. 3879-3882, 2005

Xiaoquin, Fu, Jian, Zhou, Yangshan, Sun, and Feng, Xue, "Effect of phosphorus on microstructure and properties of Sn-8ZN-3Bi lead-free solder," Journal of Southeast University (Natural Science Edition) , vol. 36 no. 5, pp. 831-835, Sept. 2006.

Xiaoqing, Li, and Fai, Lam Tim, "Three Zone-Reactive Wetting Ring Structure at Interface between Lead-Free Sn-Ag-Cu Solder and Ni Pad," 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 6-10, 2009, pp. 224-227.

Xiaoyan, Niu, Yingjie, Yu, Lianhua, Ma, and Cong, Chen, "An Arrhenius-type constitutive model to predict the deformation behavior in lead-free solders," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 841-844.

Xiaoyan, Niu, and Xuefeng, Shu, "Characterization of the Creep Constitutive Behavior of SnAgCu Solder in Flip Chip Joints from the Indentation Creep Testing," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging , Xi'an, China, Aug. 16-19, 2010, pp. 156-159.

Xiaoyan, Niu, Yong, Ma, Zhigang, Li, Xuefeng, Shu, and Guitong,, Yang, "Investigation of the stress-strain curves of lead-free solder alloy," International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, Freiburg, Germany, Apr. 20-23, 2008, pp. xx-xx.

Xie, Bin, Shi, Xunqing, Ding, Han, and Qiao, Kai, "Experimental and Numerical Analysis of Misalignment Mechanism in Anisotropic Conductive Film Assembly," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 2, 2006, pp. 848-854.

Xie, Bin, Shi, X. Q., and Ding, Han, "Investigation of Mechanical and Electrical Characteristics for Cracked Conductive Particle in Anisotropic Conductive Adhesive (ACA) Assembly," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 2, pp. 361-369, June 2008.

Xie, Bin, and Ding, Han, "New Challenges in Design and Understanding of Chip-On-Glass (COG) for LCD Packaging by FEA," Proceedings of 2005 International Conference on Asian Green Electronics, Shang Hai, China, Mar. 15-18, 2005, pp. 79-85.

Xie, Bin, Shi, Xunqing, Ding, Han, and Qiao, Kai, "Study of Several Key Reliability Problems of COG/ACF Interconnect in LCD Module," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 330-337.

Xie, Bin, Ding, Han, Sheng, Xinjun, and Jia, Lei, "Thermal and Mechanical Loading Effects on the Reliability of COG-ACF with Thin Glass by FEA," 7th IEEE CPMT International Conference on High Density Microsystem Design, Packaging and Failure Analysis, Shanghai, June 28, 2005, pp. xx-xx.

Xie, Bin, Shi, Xun Qing, and Ding, Han, "Understanding of Delamination Mechanism of Anisotropic Conductive Film (ACF) Bonding in Thin Liquid Crystal Display (LCD) Module," IEEE Transactions on Components and Packaging Technologies, vol. 30 no. 3, pp. 509-516, Sept. 2007.

Xie, Dongji, Rooney, Daniel T., Geiger, David, and Shangguan, Dongkai, "A Comparative Study on Drop Test Performance of Fine Pitch BGA Assemblies Using Pb-free and Tin-lead Solders," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 865-874.

Xie, Dongji, Chin, Clavius, Ang, KarHwee, Lau, Dennis, and Shangguan, Dongkai, "A New Method to Evaluate BGA Pad Cratering in Lead-Free Soldering," 2008 Proceedings 58th Electronic Components & Technology Conference , Lake Buena Vista, FL, May 27-30, 2008, pp. 893-898.

Xie, Dongji, Wu, Zhongming, Woo, Min, and McMullen, Tom, "Crack Monitoring and Life Modeling Technique Towards High Thermal Cyclic and Mechanical Reliability of fcBGA Solder Joint," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 126-132.

Xie, Dongji, Geiger, David, Shangguan, Dongkai, Cai, Charles, Wu, Boyi, Hu, Billy, Liu, Hans, and Martin, Ivan, "Failure Mechanism and Mitigation of PCB Pad Cratering," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 471-476.

Xie, Dongji, Hu, Billy, Nguyen, Jennifer, Shangguan, Dongkai, and Geiger, David, "FEA Study of Solder Hole Fill Impact on the Reliability of PTH Solder Joints," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Xie, Dongji, Shangguan, Dongkai, Geiger, David, Gill, Dinesh, Vellppan, Varatharajan, and Chinniah, Karuna, "Head in Pillow (HIP) and Yield Study on SIP and PoP Assembly," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 752-758.

Xie, Dongji, Wang, Jonathan, Yu, Him, Lau, Dennis, and Shangguan, Dongkai, "Impact Performance of Microvia and Buildup Layer Materials and Its Contribution to Drop Test Failures," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 391-399.

Xie, Dongji, Arra, Minna, Phan, Hoang, Shangguan, Dongkai, Geiger, David, and Yi, Sammy, "Life Prediction of Lead Free Solder Joints for Handheld Products," 2002 Telecom Hardware Solutions Conference Proceedings, Plano, TX, May 15-16, 2002, pp. xx-xx.

Xie, Dongji, Shangguan, Dongkai, and Kroener, Helmut, "Pad Cratering Evaluation of PCB," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S33_02-1-S33_02-10.

Xie, Dongji, Geiger, David, and Shangguan, Dongkai, "Reliability Design and Experiment of Low Cost WLP-QFN Modules," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1476-1483.

Xie, Dongji, Geiger, David, Arra, Minna, Shangguan, Dongkai, and Phan, Hoang, "Reliability of CSP/Lead Free Solder Joints with Different Surface Finishes and Reflow Profiles," Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium, San Jose, CA, July 17-18, 2002, pp. 323-328.

Xie, Dongji, Gektin, Vadim, and Geiger, David, "Reliability Study of High-end Pb-free CBGA Solder Joint under Various Thermal Cycling Test Conditions," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 109-116.

Xie, Dongji, Yi, Sammy, and Davidson, Craig, "Solderability and Process Integration Studies of Immersion Silver and Tin Surface Finishes," 2002 SMTA International Conference Proceedings , Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Xie, Fei, Baldwin, Daniel F., Houston, Paul N., Lewis, Brian J., and Wu, Han, "Next Generation No-Clean Lead-free Solder Paste Evaluation for Fine Pitch Applications," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 559-565.

Xie, H. P., Yu, D. Q., and Wang, L., "Effects of Bi - Ni additives on the microstructures and wetting properties of Sn-Zn-Cu lead-free alloy," Proceedings of 2005 International Conference on Asian Green Electronics, Shang Hai, China, Mar. 15-18, 2005, pp. 96-100.

Xie, H. X., Jiang, L., and Chawla, N., "Effect of cerium addition on wetting, undercooling, and mechanical properties of Sn-3.9Ag-0.7Cu Pb-free solder alloys," Journal of Materials Science: Materials in Electronics, vol. 24 no. 9, pp. 3456-3466, Sept. 2013.

Xie, H. X., Friedman, D., Mirpuri, K., and Chawla, N., "Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy," Journal of Electronic Materials, vol. 43 no. 1, pp. 33-42, Jan. 2014.

Xie, H. X., and Chawla, N., "Enhancing the Ductility of Sn-Ag-Cu Lead-Free Solder Joints by Addition of Compliant Intermetallics," Journal of Electronic Materials, vol. 42 no. 3, pp. 527-536, Mar. 2013.

Xie, H. X., and Chawla, N., "Mechanical shock behavior of Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints," Microelectronics Reliability, vol. 53 no. 5, pp. 733-740, May 2013.

Xie, H. X., Chawla, N., and Shen, Y.-L., "Mechanisms of deformation in high-ductility Ce-containing Sn-Ag-Cu solder alloys," Microelectronics Reliability, vol. 51 no. 6, pp. 1142-1147, June 2011.

Xie, Hai-Ping, Yu, Da-quan, Ma, hai-tao, and Wang, Lai, "Microstructure, wettability and mechanical properties of Sn-Zn-Cu lead free solder," Zhongguo Youse Jinshu Xuebao/ Chinese Journal of Nonferrous Metals, vol. 14 no. 10, pp. 1694-1699, Oct. 2004.

Xie, Huxiao, Chawla, Nikhilesh, and Mirpuri, Kabir, "Thermal and Mechanical Stability of Ce-Containing Sn-3.9Ag-0.7Cu Lead-Free Solder on Cu and Electroless Ni-P Metallizations." Journal of Electronic Materials, vol. 41 no. 12, pp. 3249-3258, Dec. 2012.

Xie, Jin-Qi, Zhong, Zhe, Zhang, Kai, Yuen, Matthew M. F., Lee, S. W. Ricky, Fu, Xian-Zhu, Sun, Rong, and Wong, Ching-Ping, "Electroplating Fabrication and Characterization of Sn-Ag-Cu Eutectic Solder Films," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 318-321.

Xie, Jingsong, Pecht, Michael, DeDonato, David, and Hassanzadeh, Ali, "An investigation of the mechanical behavior of conductive elastomer interconnects," Microelectronics Reliability, vol. 41 no. 2, pp. 281-286, Feb. 2001.

Xie, Li, Shen, Jue, Mao, Jia, Jonsson, Fredrik, and Zheng, Lirong, "Co-Design of Flip Chip Interconnection with Anisotropic Conductive Adhesives and Inkjet-Printed Circuits for Paper-Based RFID Tags," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1752-1757.

Xie, Ling, Choi, Won Kyoung, Premachandran, C. S., Selvanayagam, Cheryl S., Bai, Ke Wu, Zeng, Ying Zhi, Ong, Siong Chiew, Liao, Ebin, Khairyanto, Ahmad, Sekhar, V. N., and Thew, Serene, "Design, Simulation and Process Optimization of AuInSn Low Temperature TLP Bonding for 3D IC Stacking," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 279-284.

Xie, Shengli, "Direction-controlled growth of nickel nanowire between electrodes with the assistance of magnetic field," Journal of Materials Science: Materials in Electronics, vol. 27 no. 10, pp. 10975-10979, Oct. 2016.

Xie, Weidong, Lee, Tae-Kyu, Liu, Kuo-Chuan, and Xue, Jie, "Pb-Free Solder Joint Reliability of Fine Pitch Chip-Scale Packages," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1587-1590.

Xie, Weidong, Lee, Tae-Kyu, and Perng, Steven, "Systematic Investigation of Impact of SMT Parameters, Isothermal Aging and Alloy Microstructure on Lead-Free BGA Solder Joint Reliability," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 566-574.

Xie, Xiaobing, Zeng, Xiangbo, Yang, Ping, Wang, Chao, and Wang, Qiming, "In situ formation of indium catalysts to synthesize crystalline silicon nanowires on flexible stainless steel substrates by PECVD," Journal of Crystal Growth, vol. 347 no. 1, pp. 7-10, May 15, 2012.

Xie, Xiaoqiang, Wang, Lei, and Lee, Taekoo, "Drop Test Failure Analysis of SAC BGA Solder Joints Using Ni/Au and Cu-OSP Pad Finish," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Xie, Xiaoqiang, Zhou, Jianwei, Chae, Jonghyun, and Chung, Myungkee, "Void Mechanism Research and Control in Solder Joint," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 725-728.

Xie, Y., and Giao, Z., "Thermodynamic Reoptimization of the Ag-Sn System," Journal of Phase Equilibria, vol. 17 no. 3, pp. 208-217, 1996.

Xin, Lin, Kraszewski, Rich, Liu, Jin, Allen, Jennifer, Goh, Seach Hwee, Showalter, Chad, and Wong, Linda, "Development of Single Pass Reflow Encapsulant for Lead Free Solder Bump," Proceedings 2002 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4931), Denver, CO, Sept. 4-6, 2002, pp. 256-260.

Xing, Fei, Lu, Yuzhen, Luo, Cui, Ruan, Ye, and Qiu, Xiaoming, "Coupling modification of microstructure for improving the mechanical properties of Zn-Sn-Cu-Bi high-temperature solder," Materials Letters , vol. 181, pp. 42-46, Oct. 15, 2016.

Xing, Fei, Shang, Qinghui, Lu, Yuzhen, Liang, Jingwei, and Qiu, Xiaoming, "Intermetallic compounds growth suppression in ZSCB solder with RE addition on Cu substrate," Journal of Alloys and Compounds, vol. 666, pp. 122-130, May 5, 2016.

Xing, Meiying, Mohapatra, Jeotikanta, Elkins, Jacob, Beatty, Julian, and Liu, J. Ping, "Effects of packing density on the magnetic properties of cobalt nanowire assemblies," AIP Advances, vol. 9 no. 3, pp. 035323-1-035323-4, Mar. 2019.

Xing, Mingfei, and Zhang, Fu-Shen, "Nano-lead particle synthesis from waste cathode ray-tube funnel glass," Journal of Hazardous Materials, vol. 194, pp. 407-413, Oct. 30, 2011.

Xing, Wen-qing, Yu, Xin-ye, Li, Heng, Ma, Le, Zuo, Wei, Dong, Peng, Wang, Wen-xian, and Ding, Min, "Microstructure and mechanical properties of Sn-9Zn-xAl2O3 nanoparticles (x=0-1) lead-free solder alloy: First-principles calculation and experimental research," Materials Science and Engineering: A, vol. 678, pp. 252-259, Dec. 15, 2016.

Xingjin, Zhou, Chunyue, Huang, Ying, Liang, Tianming, Li, and Liangbin, Shao, "Study on the impact of height of solder joints with compliant layer on stress and strain under thermal cycle," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 705-710.

Xiong, Bingshou, Loo, Kum Weng, and Nagarajan, K., "Missing Ball Improvement for Different Lead Free Solders," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 147-150.

Xiong, Hua, Huang, Zhiheng, and Conway, Paul, "A Method for Quantification of the Effects of Size and Geometry on the Microstructure of Miniature Interconnects," Journal of Electronic Materials, vol. 43 no. 2, pp. 618-629, Feb. 2014.

Xiong, Hua, Huang, Zhiheng, and Conway, Paul, "Effects of Stress and Electromigration on Microstructural Evolution in Microbumps of Three-Dimensional Integrated Circuits," IEEE Transactions on Device and Materials Reliability, vol. 14 no. 4, pp. 995-1004, Dec. 2014.

Xiong, Hua, Huang, Zhiheng, Ren, Shan, and En, Yunfei, "Microstructural Design in Ultrafine Interconnects under Current Stressing," 2013 14th International Conference on Electronic Packaging Technology , Dalian, China, Aug. 11-14, 2013, pp. 308-316.

Xiong, Hua, Huang, Zhiheng, and Conway, Paul, "Size and Geometry Effects on Microstructural Evolution in Sn Microbumps during Isothermal Aging," 2013 IEEE 15th Electronics Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp. 466-471.

Xiong, Jinhua, Wang, Liangying, Xu, Jingkun, Liu, Congcong, Zhou, Weiqiang, Shi, Hui, Jiang, Qinglin, and Jiang, Fengxing, "Thermoelectric performance of PEDOT:PSS/Bi2Te3-nanowires: a comparison of hybrid types," Journal of Materials Science: Materials in Electronics , vol. 27 no. 2, pp. 1769-1776, Feb. 2016.

Xiong, Ming-yue, and Zhang, Liang, "Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging," Journal of Materials Science, vol. 54 no. 2, pp. 1741-1768, Jan. 2019.

Xiong, Nana, Li, Zhiling, Li, Jingze, Xie, Hui, and Wang, Yuehui, "Influence of Curing Procedures on the Electrical Properties of Epoxy-Based Isotropic Conductive Adhesives," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 373-377.

Xiong, Nana, Wang, Meina, Zhang, Hanping, Xie, Hui, Zhao, Yuzhen, Wang, Yuehui, and Li, Jingze, "Sintering behavior and effect of silver nanoparticles on the resistivity of electrically conductive adhesives composed of silver flakes," Journal of Adhesion Science & Technology, vol. 28 no. 24, pp. 2402-2415, Dec. 2014.

Xiong, Wei, Qi, Lehua, Luo, Jun, Zhang, Daicong, Liang, Junhao, and Yi, Hao, "Experimental investigation on the height deviation of bumps printed by solder jet technology," Journal of Materials Processing Technology, vol. 243, pp. 291-298, May 2017.

Xiongfeng, Wei, Xunping, Li, Bin, Zhou, and Guoqiang, Wei, "Effects of Pb Content on Solidification Behavior and Microstructure on Mixed Solder Alloy," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 903-906.

Xiu, Fu-Rong, Weng, Huiwei, Qi, Yingying, Yu, Gending, Zhang, Zhigang, and Zhang, Fu-Shen, "A novel reutilization method for waste printed circuit boards as flame retardant and smoke suppressant for poly (vinyl chloride)," Journal of Hazardous Materials, vol. 315, pp. 102-109, Sept. 5, 2016.

Xiu, Fu-Rong, and Zhang, Fu-Shen, "Electrokinetic recovery of Cd, Cr, As, Ni, Zn and Mn from waste printed circuit boards: Effect of assisting agents," Journal of Hazardous Materials, vol. 170 no. 1, pp. 191-196, Oct. 15, 2009.

Xiu, Fu-Rong, and Zhang, Fu-Shen, "Materials recovery from waste printed circuit boards by supercritical methanol," Journal of Hazardous Materials, vol. xxx, no. xxx, pp. xx-xx, xxxx.

Xiuzhong, Liu, Min, Yang, Xinghong, Liu, and Jiahuic, Dai, "Microstructure and Property of Sn-Zn-Cu-Bi Lead Free Solder," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 789-793.

Xu, Bingsheng, Wu, Yan, Zhang, Lina, Chen, Junwei, and Yuan, Zhangfu, "Wettability and spreadability study of molten Sn-3.0Ag-0.5Cu wetting on V-shaped substrate," Soldering & Surface Mount Technology, vol. 28 no. 3, pp. 133-140, 2016.

Xu, Bulei, Lv, Wenlong, Wang, Xiang, Lei, Tingping, Zheng, Gaofeng, Zhao, Yang, and Sun, Daoheng, "Conductive Micro Silver Wires via Aerosol Deposition," 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems , Kyoto, Japan, Mar. 5-8, 2012, pp. 282-285.

Xu, C., Fan, C., Zhang, Y., Walsh, E., Zavarine, I., Khaselev, O., Kudrak, E., and Abys, J., "A Comparative Study of Material Properties of SnPb and Leadfree Surface Finishes," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. PS-04-1-PS-04-7.

Xu, C., Fan, C., Zhang, Y., and Abys, J. A., "An Overview of Surface Analysis Techniques and It's Practical Application in Electroplating Industries," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

Xu, C., Reents Jr., W. D., Fleming, D. A., Franey, J. P., Derkits Jr., G. E., Ahern, P., Wright, B., Demirkan, K., Opila, R. L., Hannigan, K., Reid, M., Punch, J., and Collins, M. N., "Corrosion Mechanisms of Lead-Free PCB Surface Finishes in Corrosive Environments," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 948-959.

Xu, C., Reents, W., Franey, J., Yaemsiri, J., and Devaney, J., "Creep Corrosion of OSP and ImAg PWB Finishes," Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp. S25_01-1-S25_01-8.

Xu, C., Reents, W., Franey, J., Yaemsiri, J., and Devaney, J.. "Creep Corrosion of OSP and ImAg PWB Finishes," Surface Mount Technology (SMT), vol. 25 no. 7, pp. 12-14,16-18,20-22,24-25, Nov. 2010.

Xu, C., Smetana, J., Franey, J., Guerra, G., Fleming, D., Reents, W., Willie, Dennis, Garcia I., Alfredo, Encinas, Guadalupe, and Xiaodong, Jiang, "Creep Corrosion of PWB Final Finishes: Its Cause and Prevention," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.

Xu, C., Franey, J., Fleming, D., and Reents, W., "Creep Corrosion on Lead-free PCBs," Surface Mount Technology (SMT) , vol. 23 no. 1, pp. 18,20, Jan.-Feb. 2009.

Xu, C., Zhang, Y., Chiu, P., and Abys, J. A., "Glossiness, Morphology and Microstructure of Electrodeposited Sn Films," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. 269-274.

Xu, C., Kopf, R., Smetana, J., and Fleming, D., "HDPUG Pb-Free Board Materials Reliability Project 2 Moisture Sensitivity and Its Effect on Delamination," IPC APEX Expo Technical Conference 2011, Las Vegas, NV, April 12-14, 2011, pp. xx-xx.

Xu, C. H., Qin, X. M., Guo, W. H., and Li, Y., "Protrusion and whisker growth on tin coated copper substrate under stresses," Materials Science and Technology, vol. 27 no. 8, pp. 1271-1274, Aug. 2011.

Xu, C. L., Zhang, L., Li, H. L., and Zhang, H. L., "Selective Assembly of Gold Nanowires on Patterned Gold Surfaces via Electrostatic Interactions," Solid State Phenomena, vol. 121-123, pp. 461-464, Mar. 2007.

Xu, C., Zhang, Y., Fan, C., Chiu, P., and Abys, J. A., "Surface Morphology, Appearanve & Tribology of Electrodeposited Tin Films," Plating & Surface Finishing, vol. 87 no. 9, pp. 88-92, Sept. 2000.

Xu, Chen, Zhang, Yun, Fan, Conglun, Walsh, E., and Abys, Joseph A., "An Innovative Whisker Reduction/Elimination Solution," IPC/JEDEC 7th International Conference on Lead Free Electronic Components and Assemblies , Frankfurt, Germany, Oct. 20-22, 2004.

Xu, Chen, Zhang, Yun, Fan, Chonglun, and Abys, Joseph A., "Driving Force for the Formation of Sn Whiskers: Compressive Stress-- Pathways for Its Generation and Remedies for Its Elimination and Minimization," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 31-35, Jan. 2005.

Xu, Chen, Fleming, Debbie, Kopf, Rose, Kondos, Pericles A., and Lin, Yunhu, "Hybrid Laminate Structure for Minimizing Pad Cratering," SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017, pp. 924-936.

Xu, Chen, Jian, Zhou, Feng, Xue, and Qing, Chen, "Microstructure and mechanical properties of Sn-Bi lead-free solder during extruding and drawing process," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 1215-1218.

Xu, Chen, "Stress in Electroplated Sn: Its Measurement and Implication in Spontaneous Whisker Growth," Cookson Electronics.

Xu, Chen, Zhang, Yun, Fan, Chonglun, and Abys, Joseph A., "Thin Sn over Ni: A Practical And Effective Whisker Mitigation Strategy For Leadframe," IPC Printed Circuits Expo, APEX and the Designer Summit , Anaheim, CA, Feb. 8-10, 2006, pp. S04-01-1-S-4-01-7.

Xu, Chen, Zhang, Yun, Fan, C., and Abys, J., "Understanding Whisker Phenomenon: Driving Force for Whisker Formation," Cookson Electronics.

Xu, Chen, Zhang, Yun, Fan, Chonglun, Vysotskaya, Anna, Abys, Joseph A., Hopkins, Leslie, and Stevie, Fred, "Understanding Whisker Phenomenon - Mechanisms Study," 2001 SMTA International Conference Proceedings, Chicago, IL, Sept. 30-Oct. 4, 2001, pp. xx-xx.

Xu, Chen, Fan, Chonglun, Vysotskaya, Anna, Abys, Joseph A., Zhang, Yun, Hopkins, Leslie, and Stevie, Fred, "Understanding Whisker Phenomenon - Part II: Competitive Mechanisms," Electroplating Chemicals and Services.

Xu, Chen, Zhang, Yun, Fan, Chonglun, and Abys, Joseph A., "Understanding Whisker Phenomenon: The Driving Force for Whisker Formation," CircuiTree, vol. 15 no. 5, pp. xx, May 2002.

Xu, Chen, Fan, Chonglun, Zhang, Yun, and Abys, Joseph A., "Whisker Prevention," OnBoard Technology, vol. xx no. xx, pp. 30-34, Feb. 2004.

Xu, Dapeng, Dong, Zhanmin, and Sun, Jia-Lin, "Fabrication of copper nanowires by a solid-state ionics method and their surface enhanced Raman scattering effect," Materials Letters, vol. 92, pp. 143-146, Feb. 1, 2013. https://doi.org/10.1016/j.matlet.2012.10.057

Xu, Dapeng, Kang, Weigang, Yang, Wei, Zhang, Song, and Chen, Jian, "Synthesis of centimeter level AgCu alloy nanowires via a solid-state ionics method and their SERS effect," Journal of Alloys and Compounds, vol. 725, pp. 248-252, Nov. 25, 2017.

Xu, Di Erick, Hook, Michael David, and Mayer, Michael, "Real time joint resistance monitoring during solder reflow," Journal of Alloys and Compounds, vol. 695, pp. 3002-3010, Feb. 25, 2017.

Xu, Dong-Xia, Lei, Yong-Ping, Xia, Zhi-Dong, Guo, Fu, and Shi, Yao-Wu, "Experimental Wettability Study of Lead-Free Solder on Cu Substrates Using Varying Flux and Temperature," Journal of Electronic Materials, vol. 37 no. 1, pp. 125-133, Jan. 2008.

Xu, Dong-xia, Lei, Yong-ping, Zhang, Bing-bing, Li, Guo-wei, Xia, Zhi-dong, Guo, Fu, and Shi, Yao-wu, "Preparation and study of a VOC-free, no-clean soldering flux," Beijing Gongye Daxue Xuebao / Journal of Beijing University of Technology , vol. 33 no. 12, pp. 1320-1325, Dec. 25, 2007.

Xu, Dongxia, Wang, Dongbin, and Lei, Yongping, "Study of VOC-Free, No-Clean Flux for Lead-Free Soldering in Electronic Packaging," Advanced Materials Research, vol. 154-155, pp. 1012-1018, 2011.

Xu, Dongxia, Li, Xusheng, Wang, Caiqin, and Xu, Bin, "Study on wettability and corrosivity of a new no-clean flux for lead-free solder paste in electronic packaging technology," 2011 Second International Conference on Mechanic Automation and Control Engineering, Inner Mongolia, China, July 15-17, 2011, pp. 1706-1708.

Xu, Dongxia, Lei, Yongping, Zhu, Lei, Xia, Zhidong, Guo, Fu, and Shi, Yaowu, "Wettability and Reliability Evaluation of Sn-9Zn solder on Cu Substrates Using Three Novel Soldering Fluxes," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Xu, Fangjie, Xue, Bin, Wang, Fudong, and Dong, Angang, "Ternary Alloyed ZnSexTe1-x Nanowires: Solution-Phase Synthesis and Band Gap Bowing," Chemistry of Materials, vol. 27 no. 3, pp. 1140-1146, Feb. 10, 2015.

Xu, Guang-Sui, Zeng, Jing-Bo, Zhou, Min-Bo, Cao, Shan-Shan, Ma, Xiao, and Zhang, Xin-Ping, "Influence of Soldering Temperature and Dwelling Time on Morphological Evolution of Cu6Sn5 Intermetallic Compound at the Sn-3.0Ag-0.5Cu/Cu Interface," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 289-293.

Xu, Guang-Sui, Zeng, Jing-Bo, Zhou, Min-Bo, and Zhang, Xin-Ping, "Undercooling and Solidification Behavior of Sn-Ag-Cu Solder Balls and Sn-Ag-Cu/UBM Joints," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 325-329.

Xu, Guangchen, Guo, Fu, Wang, Xitao, Xia, Zhidong, Lei, Yongping, Sha, Yaowu, and Li, Xiaoyan, "Retarding the electromigration effects to the eutectic SnBi solder joints by micro-sized Ni-particles reinforcement approach," Journal of Alloys and Compounds, vol. 509 no. 3, pp. 878-884, Jan. 21, 2011.

Xu, Guangchen, Guo, Fu, Lee, Andre, Subramanian, K. N., and Wright, Neil, "Study of Joule Heating Effects in Lead-Free Solder Joints under Electromigration," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 464-467.

Xu, Guangchen, He, Hongwen, and Guo, Fu, "Temperature-Dependent Phase Segregation in Cu/42Sn-58Bi/Cu Reaction Couples under High Current Density," Journal of Electronic Materials, vol. 38 no. 2, pp. 273-283, Feb. 2009.

Xu, H., Akid, R., and Brumpton, G., "Surface Characterisation Studies of CrVI and CrIII Electroplated Carbon Steel Samples," Transactions of the Institute of Metal Finishing, vol. 82 no. 1-2, pp. 18-23, Jan.-Mar. 2004.

Xu, Hongbo, Zhang, Shuai, Zhao, Hongyun, and Li, Mingyu, "Acceleration Reliability Tests for Lead-free Solder Joints under Thermal Cycling Coupling with Current Stressing," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Xu, Hongbo, Li, Mingyu, Fu, Yonggao, Wang, Ling, and Kim, Jongmyung, "Geometry control of solder interconnects via induction heating," Soldering & Surface Mount Technology, vol. 21 no. 1, pp. 25-30, 2009.

Xu, Hongbo, Li, Mingyu, Chen, Hongtao, Fu, Yonggao, and Wang, Ling, "Lead-Free Bumping Using an Alternating Electromagnetic Field," Journal of Electronic Materials, vol. 38 no. 5, pp. 663-669, May 2009.

Xu, Hongbo, Li, Mingyu, Kim, Jongmyung, and Kim, Daewon, "Lead-Free Soldering Technique by Using Medium-Frequency Electromagnetic Field," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1351-1357.

Xu, Hongbo, Li, Mingyu, Fu, Yonggao, Wang, Ling, and Kim, Jongmyung, "Local melt process of solder bumping by induction heating reflow," Soldering & Surface Mount Technology, vol. 21 no. 4, pp. 45-54, 2009.

Xu, Hongbo, Li, Mingyu, Kim, Jongmyung, and Kim, Daewon, "Local melting and shape controlling of solder joint via induction heating," Journal of Materials Processing Technology, vol. 209 no. 6, pp. 2781-2787, Mar. 19, 2009.

Xu, Hongbo, Li, Mingyu, Zhang, Liqing, Kim, Jongmyung, and Kim, Hongbae, "Manufacture of Hourglass-shaped Solder Joint by Induction Heating Reflow," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Xu, Hongbo, Li, Mingyu, Kim, Jongmyung, Kim, Hongbae, and Kim, Daewon, "Study on Induction Spontaneous Heating Reflow," Materials Science Forum , vol. 580-582, pp. 167-172, 2008.

Xu, Hongbo, Li, Mingyu, Kim, Jongmyung, and Kim, Hongbae, "Thermal Characters Analysis of Induction-Self-Heating-Reflow for Solders Bumping," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Xu, Hongyan, Yuan, Zhangfu, Matsuura, Hiroyuki, and Tsukihashi, Fumitaka, "Hysteresis phenomenon and wetting characteristics of molten Sn-3.0 wt.%Ag-0.5 wt.%Cu on different tilting substrates," Journal of Alloys and Compounds , vol. 487 no. 1-2, pp. 121-125, Nov. 13, 2009.

Xu, Hongyan, Wang, Chunlei, Zheng, Libin, Fang, Huachao, and Xu, Ju, "Interfacial Microscopic Reaction Mechanism of Lead-free Attachment Material in IGBT Packaging," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 1477-1481.

Xu, Hongyan, Wu, Qilong, Ning, Puqi, and Xu, Ju, "Low temperature liquid bonding using Cu@Sn preform for high temperature die attach," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1201-1206.

Xu, Hui, and Zou, Yabing, "Characteristics and analysis methods for connector whisker growth," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Xu, Huili, Lee, Tae-Kyu, and Kim, Choong-Un, "Fatigue Properties of Lead-free Solder Joints in Electronic Packaging Assembly Investigated by Isothermal Cyclic Shear Fatigue," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 133-138.

Xu, Huili, Bang, Woong Ho, Ma, Hong-Tao, Lee, Tae-Kyu, Liu, Kuo-Chuan, and Kim, Choong-Un, "Fracture Mechanics of Lead-Free Solder Joints under Cyclic Shear Load," 2010 Proceedings 60th Electronic Components and Technology Conference , Las Vegas, NV, June 1-4, 2010, pp. 484-489.

Xu, Huili, Lee, Tae-Kyu, and Kim, Choong-Un, "Grain Structure Evolution and its Impact on the Fatigue Reliability of Lead-free Solder Joints in BGA Packaging Assembly," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 740-747.

Xu, Huili, Bang, Woong Ho, Ma, Hong-Tao, Lee, Tae-Kyu, Liu, Kuo-Chuan, and Kim, Choong-Un, "Isothermal Shear Fatigue Mechanism of Lead Free Solder Joints," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 1299-1303.

Xu, Huili, Bang, Woong Ho, Lee, Tae-Kyu, and Kim, Choong-Un, "Sensitivity of Grain Structure and Fatigue Reliability of Pb-Free Solder Joint on the Position in PBGA Packaging Assembly," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 500-504.

Xu, Huixia, Zhang, Lijun, Cheng, Kaiming, Chen, Weimin, and Du, Yong, "Reassessment of Atomic Mobilities in fcc Cu-Ag-Sn System Aiming at Establishment of an Atomic Mobility Database in Sn-Ag-Cu-In-Sb-Bi-Pb Solder Alloys," Journal of Electronic Materials, vol. 46 no. 4, pp. 2119-2129, Apr. 2017.

Xu, Jiachen, Xue, Songbai, Xue, Peng, Long, Wei-min, and Zhang, Qing-ke, "Study on microstructure and properties of Sn-0.3Ag-0.7Cu solder bearing Nd," Journal of Materials Science: Materials in Electronics, vol. 27 no. 8, pp. 8771-8777, Aug. 2016.

Xu, Jiefeng, Cai, Chongyang, Pham, Vanlai, Pan, Ke, Wang, Huayan, and Park, Seungbae, "A Comprehensive Study of Electromigration in Lead-free Solder Joint," 2020 IEEE 70th Electronic Components and Technology Conference, Lake Buena Vista, AL, May 26-29, 2020, pp. 284-289.

Xu, Jing, Lu, Aijiang, Wang, Chunrui, Zou, Rujia, Liu, Xiaoyun, Wu, Xing, Wang, Yuxi, Li, Sijia, Sun, Litao, Chen, Xiaoshuang, Oh, Hongseok, Baek, Hyeonjun, Yi, Gyu-Chul, and Chu, Junhao, "ZnSe-Based Longitudinal Twinning Nanowires," Advanced Engineering Materials, vol. 16 no. 4, pp. 459-465, Apr. 2014.

Xu, Jun, Guo, Hong, Yang, Fubao, and Tu, Hailing, "Advanced Manufacturing Technologies and Characterization of the Microelectronic Interconnect and Packaging Materials," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Xu, Kaisheng, Chen, Guang, Wu, Fengshun, Xia, Weisheng, and Liu, Hui, "Effect of SiC Whiskers Addition on Microstructure, Microhardness and Wettablility of Sn-Ag-Cu Solder," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 310-312.

Xu, L. Y., Zhang, Z. K., Jing, H. Y., Wei, J., and Han, Y. D., "Effect of graphene nanosheets on the corrosion behavior of Sn-Ag-Cu solders," Journal of Materials Science: Materials in Electronics, vol. 26 no. 8, pp. 5625-5634, Aug. 2015.

Xu, L. Y., Zhang, S. T., Jing, H. Y., Wang, L. X., Wei, J., Kong, X. C., and Han, Y. D., "Indentation Size Effect on Ag Nanoparticle-Modified Graphene/Sn-Ag-Cu Solders," Journal of Electronic Materials, vol. 47 no. 1, pp. 612-619, Jan. 2018.

Xu, Lianyong, Wang, Lixia, Jing, Hongyang, Liu, Xiangdong, Wei, Jun, and Han, Yongdian, "Effects of graphene nanosheets on interfacial reaction of Sn-Ag-Cu solder joints," Journal of Alloys and Compounds, vol. 650, pp. 475-481, Nov. 25, 2015.

Xu, Lijuan, and Huang, Qiang, "Growth Process Modeling of III-V Nanowire Synthesis via Selective Area Metal-Organic Chemical Vapor Deposition," IEEE Transactions on Nanotechnology, vol. 13 no. 6, pp. 1093-1101, Nov. 2014.

Xu, Ling, Zhou, Shengrui, and Lu, Jicun, "Optimization of PCB Board to Improve Thermomechanical Reliability of Lead-Free Solder Ball Joint," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 1466-1471.

Xu, Luhua, and Pang, John H. L., "Combined Thermal and Electromigration Exposure Effect on SnAgCu BGA Solder Joint Reliability," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1154-1159.

Xu, Luhua, and Pang, John H. L., "Effect of Intermetallic and Kirkendall Voids Growth on Board Level Drop Reliability for SnAgCu Lead-Free BGA Solder Joint," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 275-282.

Xu, Luhua, and Pang, John H. L., "Effect of Thermal and Electromigration Exposure on Solder Joint Board Level Drop Reliability," 8th Electronics Packaging Technology Conference , Singapore, Dec. 6-8, 2006, pp. 570-575.

Xu, Luhua, Pang, John H. L., Ren, Fei, and Tu, K. N., "Electromigration Effect on Intermetallic Growth and Young's Modulus in SAC Solder Joint," Journal of Electronic Materials, vol. 35 no. 12, pp. 2116-2125, Dec. 2006.

Xu, Luhua, Pang, John H. L., Ren, Fei, Zhang, Xi, Nah, Jae-Woong, and Tu, K. N., "Electromigration Effect on Strain and Mechanical Property Change in Lead-Free Solder Joints," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 760-765.

Xu, Luhua, Liang, S. W., Xu, Di, Han, Jung-Kyu, Liang, Jarrett, and Tu, K. N., "Electromigration Failure with Thermal Gradient Effect in SnAgCu Solder Joints with Various UBM," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 909-913.

Xu, Luhua, Pang, John H. L., and Faxing, Che, "Failure Analysis of Lead-Free Sn-Ag-Cu Solder Joints For 316 I/O PBGA Package," Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, June 27-July 1, 2005, pp. 323-327.

Xu, Luhua, Pang, John H. L., and Che, Faxing, "Failure Study of Sn-Ag-Cu Lead-free Solder Joint by Digital Image Speckle Analysis (DISA)," Proceedings of 7th Electronic Packaging Technology Conference, Volume 1, Singapore, Dec. 7-9, 2005, pp. 125-128.

Xu, Luhua, Pang, John H. L., and Che, Faxing, "Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability," Journal of Electronic Materials, vol. 37 no. 6, pp. 880-886, June 2008.

Xu, Luhua, and Pang, John H. L., "In-Situ Electromigration Study on Sn-Ag-Cu Solder Joint by Digital Image Speckle Analysis," Journal of Electronic Materials, vol. 35 no. 11, pp. 1993-1999, Nov. 2006.

Xu, Luhua, and Pang, John H. L., "Interfacial IMC and Kirkendall void on SAC Solder Joints subject to Thermal Cycling," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2, Singapore, Dec. 7-9, 2005, pp. 863-867.

Xu, Luhua, Tan, Kok Ee, and Pang, John H. L., "Intermediate Strain Rate Dependant Mechanical Properties for Lead-free Solders," 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June 2-5, 2010, pp. xx-xx.

Xu, Luhua, Pang, John H. L., and Che, F. X., "Intermetallic Growth and Failure Study for Sn-Ag-Cu/ENIG PBGA Solder Joints Subject to Thermal Cycling," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 682-686.

Xu, Luhua, and Pang, John H. L., "Intermetallic Growth Studies on SAC/ENIG and SAC/CU-OSP Lead-Free Solder Joints," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 2, 2006, pp. 1131-1136.

Xu, Luhua, Pang, John H. L., Prakash, Kithva H., and Low, T. H., "Isothermal and Thermal Cycling Aging on IMC Growth Rate in Lead-Free and Lead-Based Solder Interface," IEEE Transactions on Components and Packaging Technologies, vol. 28 no. 3, pp. 408-414, Sept. 2005.

Xu, Luhua, and Pang, John H. L., "Nano-indentation characterization of Ni-Cu-Sn IMC layer subject to isothermal aging," Thin Solid Films, vol. 504 no. 1-2, pp. 362-366, May 10, 2006.

Xu, Luhua, and Pang, John H. L., "Nanoindentation on SnAgCu Lead-free Solder and Analysis," Proceedings of 7th Electronic Packaging Technology Conference, Volume 1, Singapore, Dec. 7-9, 2005, pp. 359-362.

Xu, Luhua, and Pang, John H. L., "Nanoindentation on SnAgCu Lead-Free Solder Joints and Analysis," Journal of Electronic Materials, vol. 35 no. 12, pp. 2107-2115, Dec. 2006.

Xu, Luhua, Tan, Kok Ee, and Pang, John H. L., "Strain-Rate-Dependant Mechanical Properties for Sn-3.8Ag-0.7Cu and SAC-X Solder Alloy," 11th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May 28-31, 2008, pp. 632-637.

Xu, Luhua, Tan, Kok Ee, and Pang, John H. L., "Strain-Rate Effects on Mechanical Properties for SAC387 and SAC105-Y Solder," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 845-850.

Xu, Min, Peng, Wenping, Cai, Jun, Li, Xunfeng, Liu, Zhigang, and Huai, Xiulan, "Ultrasound-assisted synthesis and characterization of ultrathin copper nanowhiskers," Materials Letters, vol. 161, pp. 164-167, Dec. 15, 2015.

Xu, Penghui, Hu, Fengtian, Hu, Anmin, and Li, Ming, "Effects of Cu Orientation on the Microstructure of Sn-2Ag-2.5Zn/Cu Interface," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 789-792.

Xu, Ping, Ke, Rongge, Rauer, Miriam, Kaloudis, Michael, and Franke, Joerg, "Analysis of the Effects of Voids on Crack Initiation in Solder Joints of High-Power LEDs," 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Nagasaki, Japan, Apr. 17-21, 2018, pp. 216-221.

Xu, Ping, Rauer, Miriam, Kaloudis, Michael, and Franke, Joerg, "Simulation-aided Analysis of the Influence of Voids on the Reliability of Solder-joints for LED-Applications," 2016 6th Electronic System-Integration Technology Conference, Grenoble, France, Sept. 13-15, 2016, pp. xx-xx.

Xu, Po, Hu, Anming, Chen, Zhuo, Li, Ming, and Mao, Dali, "Novel Low-Temperature Micro-insert Bonding Technology for 3D Package," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Xu, Q. G., Liu, X. B., and Zhang, H. F., "Current enhanced wettability of eutectic SnBi melt on Cu substrate," Materials Science and Technology, vol. 27 no. 3, pp. 666-669, Mar. 2011.

Xu, R. L., Liu, Y. C., Wei, C., and Yu, L. M., "Effects of Zn additions on the structure of the soldered Sn-3.5Ag and Cu interfaces," Soldering & Surface Mount Technology, vol 22 no. 2, pp. 13-20, 2010.

Xu, R. L., Liu, Y. C., Wei, C., Wang, X., and Gao, Z. M., "Evolution of intermetallic compounds layers in the soldered Sn-3.7Ag-1.0In-0.9Zn/Cu interface," Journal of Alloys and Compounds , vol. 468 no. 1-2, pp. 203-208, Jan. 22, 2009.

Xu, R. L., Liu, Y. C., Han, Y. J., Wei, C., Wang, X., and Yu, L. M., "The formation and evolution of intermetallic compounds formed between Sn-Ag-Zn-In lead-free solder and Ni/Cu substrate," Journal of Materials Science: Materials in Electronics, vol. 20 no. 7, pp. 675-679, July 2009.

Xu, Ruisheng, Liu, Yang, Zhang, Hao, Li, Zhao, Sun, Fenglian, and Zhang, Guoqi, "Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging," Journal of Electronic Materials , vol. 48 no. 3, pp. 1758-1765, Mar. 2019.

Xu, Sha, Hu, Xiao, Yang, Ying, Chen, Zhong, and Chan, Yan Cheong, "Effect of carbon nanotubes and their dispersion on electroless Ni-P under bump metallization for lead-free solder interconnection," Journal of Materials Science: Materials in Electronics, vol. 25 no. 6, pp. 2682-2691, June 2014.

Xu, Sha, Chan, Yan Cheong, Zhang, Kaili, and Yung, K. C., "Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing," Journal of Alloys and Compounds, vol. 595, pp. 92-102, May 15, 2014.

Xu, Sha, Zhu, Xiaoxin, Kotadia, Hiren, Lu, Hua, Mannan, Samjid H., Bailey, Chris, and Chan, Y. C., "Remedies to Control Electromigration: Effects of CNT Doped Sn-Ag-Cu Interconnects," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 1899-1904.

Xu, Shuangyan, and Dillard, David A., "Determining the Impact Resistance of Electrically Conductive Adhesives Using a Falling Wedge Test," IEEE Transactions on Components and Packaging Technologies, vol. 26 no. 3, pp. 554-562, Sept. 2003.

Xu, Shuangyan, Dilliard, David A., and Dilliard, John. G., "Environmental aging effects on the durability of electrically conductive adhesive joints," International Journal of Adhesion and Adhesives , vol. 23 no. 3, pp. 235-250, 2003.

Xu, Siyang, Habib, Ashfaque H., Prasitthipayong, Anya, and McHenry, Michael E., "Effects of FeCo magnetic nanoparticles on microstructure of Sn-Ag-Cu alloys," Journal of Applied Physics, vol. 113 no. 17, pp. 17A301-1-17A301-3, May 7, 2013.

Xu, Siyang, Prasitthipayong, Anya, Pickel, Andrea D., Habib, Ashfaque H., and McHenry, Michael E., "Mechanical properties of FeCo magnetic particles-based Sn-Ag-Cu solder composites," Applied Physics Letters, vol. 102 no. 25 , pp. 251909-1-251909-5, June 24, 2013.

Xu, Tao, Zhou, Min-Bo, Zhang, Ze-Jun, Zhao, Xing-Fei, and Zhang, Xin-Ping, "Solder size effect on interfacial reaction and growth behavior of Cu-Sn intermetallic compounds in cross-scale Sn3.0Ag0.5Cu/Cu joints between stacking TSV chips during step-reflow processes," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Xu, Tao, Hu, Xiaowu, Li, Yulong, and Jiang, Xiongxin, "The growth behavior of interfacial intermetallic compound between Sn-3.5Ag-0.5Cu solder and Cu substrate under different thermal-aged conditions," Journal of Materials Science: Materials in Electronics , vol. 28 no. 24, pp. 18515-18528, Dec. 2017.

Xu, Tianhan, Zhao, Maiqun, and Wang, Danghui, "Influences of Atomizing Pressure on Preparation Processing of Lead-Free Solder Powder," Advanced Materials Research, vol. 183-185, pp. 2091-2094, 2011.

Xu, Tianhan, Jin, Hai,Yun, Zhao, Maiqun, and Wang, Danghui, "Influences of Atomizing Pressure on Properties and Microstructure at Brazed Joint of Lead-free Solder Powder," Materials Science Forum, vol. 695, pp. 89-92, 2011.

Xu, Tianhan, Zhao, Maiqun, and Wang, Danghui, "Properties of Two Lead-Free Solder Alloys and Comparison with Sn37Pb," Advanced Materials Research, vol. 154-155, pp. 540-544, 2011.

Xu, Xing, Chen, Gaiqing, and Cheng, Mingsheng, "Study on local recrystallization and damage mode of Lead-free BGA solder joint," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 356-359.

Xu, Xing, Chen, Gaiqing, and Cheng, Mingsheng, "Study on the failure behavior of BGA solder interconnections under fatigue loading," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 729-733.

Xu, Yangjian, Zhao, Shuai, Jin, Guohui, Wang, Xiaogui, and Liang, Lihua, "Ductile fracture of solder-Cu interface and inverse identification of its interfacial model parameters," Mechanics of Materials, vol. 114, pp. 279-292, Nov. 2017.

Xu, Yuhuan, Ou, Shengquan, Tu, K. N., Zeng, Kejun, and Dunne, Rajiv, "Measurement of impact toughness of eutectic SnPb and SnAgCu solder joints in ball grid array by mini-impact tester," Journal of Materials Research , vol. 23 no. 5, pp. 1482-1487, May 2008.

Xu, Yunsheng, and Chung, D. D. L., "Z-Axis Anisotropic Electrical Conductor Films in Adhesive and Standalone Forms for Electrical Interconnection," Journal of Electronic Materials , vol. 28 no. 11, pp. 1307-1313, Nov. 1999.

Xu, Z. J., and Yu, T. X., "Board Level Dynamic Response and Solder Ball Joint Reliability Analysis under Drop Impact Test with Various Impact Orientations," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1080-1085.

Xu, Z. J., Jiang, T., Song, F. B., Lo, Jeffery C. C., and Lee, S. W. Ricky, "Modeling of Board Level Solder Joint Reliability under Mechanical Drop Test with the Consideration of Plastic Strain Hardening of Lead-free Solder," 2010 IEEE CPMT Symposium Japan, Tokyo, Japan, Aug. 24-26, 2010, pp. xx-xx.

Xu, Zhefeng, Choi, Yong Bum, Niimi, Takuya, Yu, Meiqi, Motozuka, Satoshi, Matsugi, Kazuhiro, and Suetsugu, Ken-ichiro, "Application and Compositional Optimization of Zn Alloys for High Temperature Solders," Materials Transactions, JIM, vol. 57 no. 4, pp. 553-557, 2016.

Xu, Zengfeng, Sharma, Ashutosh, Lee, Soon Jae, and Jung, Jae Pil, "Effect of Soldering Temperature on Wetting and Optical Density of Dip Coated Sn and Sn-3.5Ag Solders," Materials and Manufacturing Processes, vol. 30 no. 1, pp. 127-132, 2015.

Xu, Zhefeng, Matsugi, Kazuhiro, Choi, Yongbum, Terada, Keigo, and Suetsugu, Ken-ichiro, "Prediction of Mechanical Properties on Zinc System Alloys and Their Application to High Temperature Lead-Free Solder," 2014 Electronics System-Integration Technology Conference, Helsinki, Finland, Sept. 16-18, 2014, pp. xx-xx.

Xue, Lin, Cai, Jian, Lu, Lei, Zhang, Lan, and Wang, Shuidi, "Polymer Flip Chip Bumping and Its Application for CdZnTe Detectors," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Xue, Mengfei, Li, Ming, Huang, Yisheng, Chen, Runkun, Li, Yunliang, Wang, Jingyun, Xing, Yingjie, Chen, Jianjun, Yan, Hugen, Xu, Hongqi, and Chen, Jianing, "Observation and Ultrafast Dynamics of Inter-Sub-Band Transition in InAs Twinning Superlattice Nanowires," Advanced Materials, vol. 32 no. 40, pp. 2004120-1-2004120-7, Oct. 8, 2020. https://doi-org.ezproxy.uky.edu/10.1002/adma.202004120

Xue, Mianqiang, Yan, Guoqing, Li, Jia, and Xu, Zhenming, "Electrostatic Separation for Recycling Conductors, Semiconductors, and Nonconductors from Electronic Waste," Environmental Science & Technology, vol. 46 no. 19, pp. 10556-10563, October 2, 2012.

Xue, Mianqiang, Kendall, Alissa, Xu, Zhenming, and Schoenung, Julie M., "Waste Management of Printed Wiring Boards: A Life Cycle Assessment of the Metals Recycling Chain from Liberation through Refining," Environmental Science & Technology, vol. 49 no. 2, pp. 940-947, Jan. 20, 2015.

Xue, Peng, Wang, Ke-Hong, Zhou, Qi, Huang, Jun, Long, Wei-min, and Zhang, Qing-ke, "Effect of Nd on tin whisker growth in Sn-Zn soldered joint," Journal of Materials Science: Materials in Electronics, vol. 27 no. 4, pp. 3742-3747, Apr. 2016.

Xue, Peng, Xue, Songbai, Shen, Yifu, Xiao, Zhengxiang, Zhu, Hong, Long, Weimin, and Yu, Xinquan, "Effect of Pr on properties and Sn whisker growth of Sn-9Zn-xPr solder," Soldering & Surface Mount Technology, vol. 24 no. 4, pp. 280-286, 2012.

Xue, Peng, Xue, Song-bai, Shen, Yi-fu, and Zhu, Hong, "Inhibiting the growth of Sn whisker in Sn-9Zn lead-free solder by Nd and Ga," Journal of Materials Science: Materials in Electronics, vol. 25 no. 6, pp. 2671-2675, June 2014.

Xue, Peng, Xue, Song-bai, Shen, Yi-fu, Long, Fei, and Zhu, Hong, "Investigation on the intermetallic compound layer growth of SnZnGa/SnZnGaNd solder joints," Journal of Materials Science: Materials in Electronics , vol. 25 no. 10, pp. 4219-4224, Oct. 2014.

Xue, Peng, Xue, Song-bai, Shen, Yi-Fu, Long, Fei, and Zhu, Hong, "Mechanism of Reaction Between Nd and Ga in Sn-Zn-0.5Ga-xNd Solder," Journal of Electronic Materials, vol. 43 no. 9, pp. 3404-3410, Sept. 2014.

Xue, Peng, Xue, Song-bai, Shen, Yi-fu, Zhu, Hong, and Gao, Li-li, "Study on properties of Sn-9Zn-Ga solder bearing Nd," Journal of Materials Science: Materials in Electronics, vol. 23 no. 6, pp. 1272-1278, June 2012.

Xue, Peng, Xue, Song-bai, Zhang, Liang, Shen, Yi-fu, Gao, Li-li, Yu, Sheng-lin, Zhu, Hong, Han, Zongjie, and Chen, Yan, "Tensile strength of fine pitch QFP lead-free soldered joints with diode laser soldering," Soldering & Surface Mount Technology, vol. 23 no. 3, pp. 177-183, 2011.

Xue, Peng, Xue, Song-bai, Shen, Yi-fu, Long, Fei, and Zhu, Hong, "Wettability and interfacial whiskers of Sn-9Zn-0.5Ga-0.08Nd solder with Sn, SnBi and Au/Ni coatings," Journal of Materials Science: Materials in Electronics, vol. 25 no. 8, pp. 3520-3525, Aug. 2014.

Xue, Rong, Wang, Xingwei, Chen, Xingliang, Zhang, Mengyu, and Qi, Shuhua, "Transparent stretchable composite conductor based on silver nanowires with hybrid structure," Journal of Materials Science, vol. 51 no. 15, pp. 7211-7219, Aug. 2016.

Xue, Song-Bai, Chen, Yan, and Lu, Xiao-Chun, "Calculation and application for activity interaction parameters of Sn-Ce-Me lead-free solder alloys," Hanjie Xuebao/Transactions of the China Welding Institution, vol. 26 no. 4, pp. 45-47,80, Apr. 2005.

Xue, Weihuang, and Gu, Wenhua, "Conductivity size effect of polycrystalline metal nanowires," AIP Advances, vol. 6 no. 11, pp. 115001-1-115001-8, Nov. 2016.

Xuechun, Lin, and Feng, Lin, "The improvement on the properties of silver-containing conductive adhesives by the addition of carbon nanotube," Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, China, June 30-July 3, 2004, pp. 382-384.

Xueren, Zhang, Wenhui, Zhu, Edith, Poh, and Boon, Tan Hien, "Study on Board Level Drop Reliability of Wafer Level Chip Scale Package with Leadfree Solder," 2008 10th Electronics Packaging Technology Conference , Singapore, Dec. 9-12, 2008, pp. 1096-1101.

Xujing, Nan, Songbai, Xue, Peizhuo, Zhai, and Dongxue, Luo, "Effect of Pr Addition on Properties of Sn-0.5Ag-0.7Cu-0.5Ga Lead-Free Solder," Journal of Electronic Materials, vol. 45 no. 10, pp. 5443-5448, Oct. 2016.

Xu-jun, Hu-qiang, hui-jun, He, fu-wen, Zhang, and zhao-hui, Zhao, "Study of Sn-Bi-Cu Lead-free Solder," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1375-1380.

Xunping, Li, Xiaoqi, He, and Hui, Xu, "Effect of the Cross-Interaction on the Solidification Behaviors of Ni/Sn-Ag-Cu/Cu Solder Joint," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 1010-1013.

Xunping, Li, Bin, Zhou, Shaohua, Yang, and Yunfei, En, "The Coupling Effect of Size Effect and Krikendall Voids on the Fracture Features of Ni/Sn3.0Ag0.5Cu/Cu Joint," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 125-128.

Xunping, Li, Bin, Zhou, Yunfei, En, Xiaoqi, He, and Xiongfeng, Wei, "The Effect of Pb Contamination on the Solidification Behaviors and Mechanical Properties of Backward Compatible Solder Joints," 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Suzhou, China, July 15-19, 2013, pp. 628-632.

YYYY

Yadav, Satyamanyu, and Yadav, Sudesh, "Investigations of metal leaching from mobile phone parts using TCLP and WET methods," Journal of Environmental Management, vol. 144, pp. 101-107, Nov. 1, 2014.

Yaeger, Alyssa, Dale, Travis, Handwerker, Carol, and Blendell, John, "Microstructural Evolution in Au-containing SnPb and SAC305 Joints During Thermal Cycling of Leadless Ceramic Chip Carriers," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 413-422.

Yagi, S., Ichitsubo, T., Matsubara, E., Yamaguchi, M., Kimura, H., and Sasamori, K., "Interfacial reaction of gas-atomized Sn-Zn solder containing Ni and Cu additives," Journal of Alloys and Compounds, vol. 484 no. 1-2, pp. 185-189, Sept. 18, 2009.

Yagodin, D., Sidorov, V., Janickovic, D., and Svec, P., "Density studies of liquid alloys Sn-Ag and Sn-Zn with near eutectic compositions," Journal of Non-Crystalline Solids, vol. 358 no. 21, pp. 2935-2937, Oct. 15, 2012.

Yaguchi, Akihiro, Tanaka, Naotaka, Naka, Yasuhiro, Yamamoto, Kenichi, Kimoto, Ryosuke, and Yamada, Munehiro, "Impact Strength Evaluation of Solder Joints in BGA by Dropping Steel Rod," Proceedings 56th Electronic Components & Technology Conference , San Diego, CA, May 30-June 2, 2006, pp. 55-63.

Yahaya, Muhamad Zamri, Ani, Fakhrozi Che, Samsudin, Zambri, Sahin, Salim, Abdullah, Mohd Zulkifly, and Mohamad, Ahmad Azmin, "Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation," Materials Science and Engineering: A, vol. 669, pp. 178-186, July 4, 2016.

Yahaya, Muhamad Zamri, and Mohamad, Ahmad Azmin, "Hardness testing of lead-free solders: a review," Soldering & Surface Mount Technology, vol. 29 no. 4, pp. 203-224, 2017.

Yahaya, Muhamad Zamri, Salleh, Nor Azmira, Kheawhom, Soorathep, Illes, Balazs, Nazeri, Muhammad Firdaus Mohd, and Mohamad, Ahmad Azmin, "Selective etching and hardness properties of quenched SAC305 solder joints," Soldering & Surface Mount Technology, vol. 32 no. 4, pp. 225-233, 2020.

Yahya, Iziana, Ghani, Noor Asikin Ab, Salleh, Mohd Arif Anuar Mohd, Hamid, Hamidi Abd, Ahmad, Zainal Ariffin, and Mayappan, Ramani, "Intermetallic Evolution between Sn-3.5Ag-1.0Cu-xZn Lead Free Solder and Copper Substrate under Long Time Thermal Aging (x: 0, 0.1, 0.4, 0.7)," 2012 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Nov. 6-8, 2012, pp. xx-xx.

Yahya, Maryam Husna, Nakamura, Keisuke, Shohji, Ikuo, Housen, Toshihiro, Yamamoto, Yumi, and Kaga, Yoshio, "Investigation of Wetting Behavior of Sn-3Ag-0.5Cu Solder Paste to BGA Solder Ball," 2012 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Nov. 6-8, 2012, pp. xx-xx.

Yakymovych, A., Plevachuk, Yu., Sklyarchuk, V., Sokoliuk, B., Galya, T., and Ipser, H., "Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range," Journal of Phase Equilibria and Diffusion, vol. 38 no. 3, pp. 217-222, June 2017.

Yakymovych, A., Plevachuk, Yu., Svec Sr., P., Svec, P., Janickovic, D., Sebo, P., Beronska, N., Roshanghias, A., and Ipser, H., "Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles," Journal of Electronic Materials, vol. 45 no. 12, pp. 6143-6149, Dec. 2016.

Yakymovych, A., Plevachuk, Yu., Svec Sr., P., Janickovic, D., Sebo, P., Beronska, N., Nosko, M., Orovcik, L., Roshanghias, A., and Ipser, H., "Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn-3.8Ag-0.7Cu solders by adding Co nanoparticles," Journal of Materials Science: Materials in Electronics, vol. 28 no. 15, pp. 10965-10973, Aug. 2017.

Yakymovych, A., Svec Sr., P., Orovcik, L., Bajana, O., and Ipser, H., "Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders," Journal of Electronic Materials, vol. 47 no. 1, pp. 117-123, Jan. 2018.

Yakymovych, A., Shtablavyi, I., and Mudry, S., "Structural studies of liquid Co-Sn alloys," Journal of Alloys and Compounds, vol. 609, pp. 438-442, Oct. 5, 2014.

Yakymovych, Andriy, Mudry, Stepan, Shtablavyi, Ihor, and Ipser, Herbert, "Effect of nano Co reinforcements on the structure of the Sn-3.0Ag-0.5Cu solder in liquid and after reflow solid states," Materials Chemistry and Physics, vol. 181, pp. 470-475, Sept. 15, 2016.

Yalamanchili, P., Gannamani, R., Munamarty, R., McClusky, P., and Christou, A., "Optimum Processing Prevents PQFP Popcorning," Surface Mount Technology (SMT), vol. 9 no. 5, pp. 39-40, 42, May 1995.

Yamabe, Mitsuharu, "Effect of Silver Content and Vacuum Reflow Soldering on Thermal Fatigue Life of Sn-Ag-Cu Solder," 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference, Kyoto, Japan, Apr. 14-17, 2015, pp. 590-595.

Yamabe, Mitsuharu, "Estimation of Sn-3.0Ag-0.5Cu Solder Joint Reliability by Weibull Distribution and Modified Coffin-Manson Equation," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 823-828.

Yamada, Hitoshi, and Nishiguchi, Masaki, "Development of Environment-Harmonized Electric Wires," Furukawa Review, no. 19, pp. 81-84, Apr. 2000.

Yamada, T., Doyle, R., and Barrett, J., "Procedures for Metallographic Examination and Mechanical Strength Testing of Fine Pitch Surface Mount IC Package Solder Joints," Soldering & Surface Mount Technology, vol. 7 no. 1, pp. 26-31, 1995.

Yamada, Y., Takaku, Y., Yagi, Y., Nishibe, Y., Ohnuma, I., Sutou, Y., Kainuma, R., and Ishida, K., "Pb-free High Temperature Solders for Power Device Packaging," Microelectronics Reliability, vol. 46 no. 9-11, pp. 1932-1937, Sept.-Nov. 2006.

Yamada, Yasushi, Takaku, Yoshikazu, Yagi, Yuji, Nishibe, Yuji, Ohnuma, Ikuo, and Ishida, Kiyohito, "Novel Bi-based High Temperature Solder for Power Semiconductor Joining," 2006 4th International Conference on Integrated Power Systems, Naples, Italy, June 7-9, 2006, pp. xx-xx.

Yamaguchi, Atsushi, Furusawa, Akio, Nishida, Kazuto, Iwanishi, Hiroaki, Hojo, Takashi, Sogo, Yosuke, Hirose, Akio, and Kobayashi, Kojiro F., "Interfacial Reaction Layer and Reliability of CSP Solder Joints using Sn-8Zn-3Bi Solder and Ni/Au Planting Pad," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 69 no. 1, pp. 132-138, Jan. 2005.

Yamaguchi, Atsushi, Iwanisi, Hiroaki, Hojo, Takashi, Hirose, Akio, and Kobayashi, Kojiro, "Microstructure and Soldering Properties of CSP Solder Joints Using Sn-Zn-Bi Solder," 2003 Pan Pacific Symposium Conference Proceedings, Feb. 18-20, 2003, pp. xx-xx.

Yamaguchi, Atsushi, Yamashita, Yuhei, Furusawa, Akio, Nishida, Kazuto, Hojo, Takashi, Sogo, Yosuke, Miwa, Ryoko, Hirose, Akio, and Kobayashi, Kojiro F., "Properties of Sn-Ag-Bi-In Solder Joints," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 69 no. 1, pp. 139-146, Jan. 2005.

Yamaguchi, Atsushi, Behr, Andy, Fukuhara, Yasuo, Hino, Hirohisa, Suzuki, Yasuhiro, and Ohashi, Naomichi, "Solder Joint Reliability and Paste Stability Performance of Resin Reinforced Low Temperature Solder Paste," SMTA International 2017 Proceedings , Rosemont, IL, Sept. 17-21, 2017, pp. 221-231.

Yamaguchi, Atsushi, Yamashita, Yuhei, Furusawa, Akio, Nishida, Kazuto, Hojo, Takashi, Sogo, Yosuke, Miwa, Ayako, Hirose, Akio, and Kobayashi,Kojiro F., "Soldering Properties and Interfacial Microstructure of CSP Solder Joints with Lower Melting Lead-free Solder," Journal of Microelectronics and Electronic Packaging, vol. 2 no. 3, pp. 108-216, Third Quarter 2005.

Yamaguchi, Hiroshi, Tahara, Kiyotaka, Itsubo, Norihiro, and Inaba, Atsushi, "A Life Cycle Inventory Analysis of Cellular Phones," Proceedings of EcoDesign2003: Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 8-11, 2003, pp. 445-451.

Yamaguchi, Masahiko, Ichitsubo, Tetsu, Matsubara, Eiichiro, Kimura, Hisamichi, Sasamori, Kenichiro, Irie, Hisao, Kumamoto, Seishi, and Anada, Takaaki, "Atomizing Effect on Sn-Zn Based Solder Alloy," Nippon Kinzoku Gakkaishi/ Journal of the Japan Institute of Metals, vol. 70 no. 2, pp. 162-165, Feb. 2006.

Yamaguchi, Miho, Asai, Fumiteru, Eriguchi, Fuyuki, and Hotta, Yuji, "Development of Novel Anisotropic Conductive Film (ACF)," 1999 Proceedings 49th Electronic Components & Technology Conference, San Diego, CA, June 1-4, 1999, pp. 360-364.

Yamaguchi, T., Ikeda, O., Oda, Y., Hata, S., Kuroki, K., Kuroda, H., and Hirose, A., "Effects of Bonding Conditions on Bondability Using Zn/Al/Zn Clad Solder," Journal of Electronic Materials, vol. xx no. xx, pp. xx-xx, xxxx.

Yamaguchi, T., Ikeda, O., Oda, Y., Hata, S., Kuroki, K., Kuroda, H., and Hirose, A., "Three-Layer Zn/Al/Zn Clad Solder for Die Attachment," Journal of Electronic Materials, vol. 44 no. 2, pp. 751-760, Feb. 2015.

Yamaguchi, Yutaka, and Kato, Matsuo, "Some Progress in Anisotropic Conductive Film," Proceedings of the Technical Program NEPCON West '91, Volume I, Anaheim, CA, Feb. 24-28, 1991, pp. 221-233.

Yamamoto, Kenichi, Akahoshi, Haruo, Kato, Takahiko, Kawamura, Toshinori, Koizumi, Masahiro, and Satoh, Ryohei, "An Embrittlement Mechanism of Impact Fracture of Sn-Ag-Cu Solder Joints on BGA Using Electroplated Ni/Au Surface Finishes," IEEE Transactions on Components and Packaging Technologies, vol. 31 no. 4, pp. 849-858, Dec. 2008.

Yamamoto, Kenichi, Kawamura, Toshinori, Nakano, Hiroshi, Akahoshi, Haruo, and Satoh, Ryohei, "Improving Impact Toughness of BGA Lead-Free Solder Joints by Using Higher Current Density in Electrolytic Ni Plating," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 1, pp. 16-24, Jan. 2011.

Yamamoto, Kenichi, Kato, Takahiko, Kawamura, Toshinori, Nakano, Hiroshi, Koizumi, Masahiro, Akahoshi, Haruo, and Satoh, Ryohei, "The Embrittlement Mechanism and Improvement of Impact Strength for Lead-Free Solder Joints in BGA Packages Using Electrolytic Ni/Au Plating," Quarterly Journal of the Japan Welding Society, vol. 26 no. 1, pp. 15-23, 2008.

Yamamoto, Mikio, Gotoh, Yoshihito, Yoshida, Kazuhiko, and Watanabe, Denjiro, "Transmission Electron-Microscopic Study on the Growth of Copper Whiskers by Halide Reduction," Journal of Crystal Growth, vol. 3-4 no. xx, pp. 705-710, 1968.

Yamamoto, Reo, Takeda, Yasuko, Yokoyama, Hiroki, Kimura, Takashi, Nishida, Kenji, Maeda, Shigenori, and Teramoto, Motonobu, "Effect of Film Construction on Melting Point and Adhesion Strength of Sn-Au-Bi Multilayered Lead-Free Solder," Journal of the Japan Institute of Metals, vol. 68 no. 10, pp. 908-912. Oct. 2004

Yamamoto, Sayaka, Matsumoto, Ryo, Adachi, Shintaro, Takano, Yoshihiko, Muto, Hiroyuki, and Tanaka, Hiromi, "Crystal size improvement of Bi-based superconducting whiskers under stress-controlled condition," Journal of Crystal Growth, vol. 541, pp. 125669-1-125669-5, July 1, 2020.

Yamamoto, Shouzou, Itoh, Haruhiro, Nomoto, Takeshi, and Yaegashi, Hideaki, "Development of Lead Free Cationic Electro-Deposition Coating," Proceedings of the First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Feb. 1-3, 1999, pp. 632-635.

Yamamoto, T., Iwata, M., Sakane, M., Tsukada, Y., and Nishimura, H., "Effect of strain waveform on creep-fatigue life for Sn-8Zn-3Bi solder," Fatigue and Fracture of Engineering Materials and Structures, vol. 30 no. 5, pp. 376-386, May 2007.

Yamamoto, Takaei, Itoh, Takamoto, Sakane, Masao, and Tsukada, Yutaka, "Creep-fatigue life of Sn-8Zn-3Bi solder under multiaxial loading," International Journal of Fatigue, vol. 43, pp. 235-241, Oct. 2012.

Yamamoto, Takashi, Sakatani, Shigeaki, Kobayashi, Shinji, Uenishi, Keisuke, Kobayashi, Kojiro F., Ishio, Masaaki, Shiomi, Kazuhiro, Hashimoto, Akio, and Yamamoto, Masaharu, "Reactivity between Sn-Ag Solder and Au/Ni-Co Plating to Form Intermetallic Phases," Materials Transactions, vol. 46 no. 11, pp. 2406-2412, 2005.

Yamamoto, Tsuyoshi, and Tsubone, Ken-Ichiro, "Assembly Technology Using lead-free solder," Fujitsu Scientific and Technical Journal, vol. 43 no. 1, pp. 50-58, Jan. 2007.

Yamamoto, Tsuyoshi, Seyama, Kiyotaka, Yagi, Harumi, Higashi, Osamu, and Kanda, Takashi, "The Development of Assembly Technology for Lead-free Low Temperature Solder," Proceedings 2000 HD International Conference on High-Density Interconnect and Systems Packaging (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4217), Denver, CO, Apr. 25-28, 2000, pp. 269-273.

Yamanaka, Kimihiro, Nishikawa, Hiroshi, Taguchi, Hirohisa, Harada, Miyuki, and Ochi, Koichi, "Effect of magnetic flux density on Sn crystallographic orientation in a solder joint system," Journal of Materials Science: Materials in Electronics, vol. 27 no. 4, pp. 3710-3714, Apr. 2016.

Yamanaka, Kimihiro, Tsukada, Yutaka, and Suganuma, Katsuaki, "Electromigration effect on solder bump in Cu/Sn-3Ag-0.5Cu/Cu system," Scripta Materialia, vol. 55 no. 10, pp. 867-870, Nov. 2006.

Yamanaka, Kimihiro, Tsukada, Yutaka, and Suganuma, Katsuaki, "Solder electromigration in Cu/In/Cu flip chip joint system," Journal of Alloys and Compounds, vol. 437 no. 1-2, pp. 186-190, June 28, 2007.

Yamanaka, Kimihiro, Ooyoshi, Takafumi, Nejime, Takayuki, and Tsukada, Yutaka, "Studies on Solder Electomigration in Lead-Free Flip Chip Joint System," Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb. 10-12, 2009, pp. 62-70.

Yamanaka, Kimihiro, Tsukada, Yutaka, and Suganuma, Katsuaki, "Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system," Microelectronics Reliability, vol. 47 no. 8, pp. 1280-1287, Aug. 2007.

Yamanaka, Kimihiro, Ooyoshi, Takafumi, and Nejime, Takayuki, "Temperature measurement at flip chip solder joint during electromigration test," Journal of Materials Science: Materials in Electronics, vol. 21 no. 1, pp. 53-57, Jan. 2010.

Yamasaki, Shingo, "The microstructure and mechanical properties of drawn and aged pearlitic steel wires," Materials Science and Technology, vol. 34 no. 1, pp. 1-11, Jan. 2018.

Yamashita, M., and Suganuma, K., "Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressure," Microelectronics Reliability , vol. 46 no. xx, pp. 1113-1118, 2006.

Yamashita, M., and Suganuma, K., "Degradation Mechanism of Ag-Epoxy Conductive Adhesive/Sn-Pb Plating Interface by Heat Exposure," Journal of Electronic Materials, vol. 31 no. 6, pp. 551-556, June 2002.

Yamashita, M., and Suganuma, K., "Effect of the joining pressure on Ag-epoxy conductive adhesive/Sn interfaces exposed to heat," Journal of Materials Science Letters, vol. 22 no. 19, pp. 1311-1313, 2003.

Yamashita, M., and Suganuma, K., "Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers," Microelectronics Reliability, vol. 46 no. 5-6, pp. 850-858, May-June 2006.

Yamashita, Mitsuo, Hidaka, Noboru, and Shohji, Ikuo, "The Effects of Ag, Ni, and Ge elements in Lead-free Sn Base Solder Alloy," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 582-587.

Yamashita, Munenori, Suganuma, Katsuaki, Komagata, Michinori, and Shirai, Yukio, "An Improvement of Conductive Adhesives on High Temperature Endurance by Using Ag-Sn Alloy Powder," First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, Germany, Oct. 21-24, 2001, pp. 265-269

Yamashita, Munenori, and Suganuma, Katsuaki, "Differences in heat exposure degradation of Sn alloy platings joined with Ag-epoxy conductive adhesive," Journal of Materials Science, vol. 41 no. 2, pp. 583-585, Jan, 2006.

Yamashita, Tsutomu, and Yoshida, Kazunari, "Analyses and prevention methods for wire breaks in ultrafine gold wiredrawing," Wire Journal International, vol. 40 no. 3, pp. 200-203, Mar. 2007.

Yamashita, Tsutomu, and Yoshida, Kazunari, "Classification of wire breaks and countermeasures in superfine gold wiredrawing," Wire Journal International, vol. 38 no. 3, pp. 180-184, Mar. 2005.

Yamaura, Daichi, and Ogino, Toshio, "Fabrication of Si-nanowires controlled by spontaneously formed nanoholes on annealed Au thin films," Materials Science in Semiconductor Processing , vol. 53, pp. 28-35, Oct. 2016.

Yamin, A. F. M., Shaffiar, N. M., Loh, W. K., and Tamin, M. N., "Damage Progression in BGA Solder Joints during Board-Level Drop Test," 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 7-9, 2011, pp. 681-685.

Yamin, A. F. M., Shaffiar, N. M., Loh, W. K., and Tamin, M. N., "Extended Cohesive Zone Model for Simulation of Solder/IMC Interface Cyclic Damage Process in Pb-free Solder Interconnects," 2012 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Nov. 6-8, 2012, pp. xx-xx.

Yan, Bohan, Wang, Chunqing, and Zhang, Wei, "The Microstructure of Eutectic Au-Sn and In-Sn Solders on Au/Ti and Au/Ni Metallizations during Laser Solder Bonding Process for Optical Fiber Alignment," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Yan, Chaoyi, Wang, Jiangxin, Wang, Xu, Kang, Wenbin, Cui, Mengqi, Foo, Ce Yao, and Lee, Pooi See, "An Intrinsically Stretchable Nanowire Photodetector with a Fully Embedded Structure," Advanced Materials, vol. 26 no. 6, pp. 943-950, Feb. 12, 2014.

Yan, De-jin, Zhou, De-jian, Huang, Chun-yue, Wu, Zhao-hua, and Zhou, xiang, "The Reliability Research of Lead-Free Solder Joint of Flip-Chip," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Yan, Guoqing, Xue, Mianqiang, and Xu, Zhenming, "Disposal of waste computer hard disk drive: data destruction and resources recycling," Waste Management and Research, vol. 31 no. 6, pp. 559-567, June 2013.

Yan, Haidong, Zhou, Dejian, and Zhao, Qiang, "Solder Joints Reliability Assessment for Stacked CSP Module Based on Flexible Circuit Printed Board," Advanced Materials Research, vol. 189-193, pp. 2125-2128, 2011.

Yan, Jianfeng, Zou, Guisheng, Wang, Xiaoyu, Bai, Hailin, Mu, Fengwen, and Wu, Aiping, "Large-Scale Synthesis of Ag Nanoparticles by Polyol Process for Low Temperature Bonding Application," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 254-259.

Yan, Katrina Liu, "A Web-Based Course on Designing and Manufacturing Lead-Free Products," 6th International Conference on Information Technology Based Higher Education and Training, Juan Dolio, Dominican Republic, July 7-9, 2005, pp. T2C-22-T2C-28.

Yan, Lijun, Zheng, Shaobo, Ding, Guoji, Xu, Gaotian, and Qiao, Zhiyu, "Surface tension calculation of the Sn-Ga-In ternary alloy," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 31 no. 1, pp. 112-119, March 2007.

Yan, Li-ling, Lee, Cheng-kuo, Yu, Da-quan, Yu, Ai-bin, Choi, Won-Kyoung, Lau, John-H, and Yoon, Seung-Uk, "A Hermetic Seal Using Composite Thin-Film In/Sn Solder as an Intermediate Layer and Its Interdiffusion Reaction with Cu," Journal of Electronic Materials, vol. 38 no. 1, pp. 200-207, Jan. 2009.

Yan, May, Cai, Bendy, and Priore, Scott, "Study on Microstructure of Vippo Desinged PCB in Lead Free Rework," SMTA China East 2014 Proceedings, Shanghai, China, Apr. 23-25, 2014, pp. xx-xx.

Yan, Minyu, Tu, King-Ning, Vairagar, Anand V., Mhaisalkar, Subodh G., and Krishnamoorthy, Ahila, "The Effect of Immersion Sn coating on the Electromigration Failure Mechanism and Lifetimes of Cu Dual Damascene Interconnects," Materials Research Society Symposia Proceedings Volume 863, 1994, pp. B9.9.1-B9.9.6.

Yan, Shi, Chen, Fei-Jun, Ma, Yue-Yue, and Yang, Zhen-Guo, "Failure Analysis of Un-Wetting for the Surface Finish on the ENIG," Journal of Failure Analysis and Prevention, vol. 13 no. 2, pp. 194-201, Apr. 2013.

Yan, Tee Tong, Lim, Mayhuan, Shen, Ng Hun, Baraton, Xavier, Kaire, David, and Zhaowei, Zhong, "Design Analysis of Solder Joint Reliability for Stacked Die Mixed Flip-Chip and Wirebond BGA," Proceedings of 4th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2002, pp. 391-397.

Yan, Wei, Wang, Dan, Diaz, Luis A., and Botte, Gerardine G., "Nickel nanowires as effective catalysts for urea electro-oxidation," Electrochimica Acta, vol. 134, pp. 266-271, July 10, 2014.

Yan, X. L., Lin, M., and Wang, J. Y., "Equilibrium and kinetic surface segregations in Cu-Sn thin films," Applied Physics A, vol. 113 no. 2, pp. 423-430, Nov. 2013. https://doi.org/10.1007/s00339-013-7570-1

Yan, X. Q., Liu, D. F., Ci, L. J., Wang, J. X., Zhou, Z. P., Yuan, H. J., Song, L., Gao, Y., Liu, L. F., Zhou, W. Y., Wang, G., and Xie, S. S., "H2-assisted control growth of Si nanowires," Journal of Crystal Growth , vol. 257 no. 1-2, pp. 69-74, 2003.

Yan, Xin, Yang, Xiaojun, Hu, Wei, and Lei, Yongping, "Microstructure, thermal behavior, and wettability of Zn4Al3Mg-xIn solders," Journal of Materials Science: Materials in Electronics, vol. 26 no. 10, pp. 7537-7543, Oct. 2015.

Yan, Xingchen, Zhang, Yichen, Wang, Chunyan, Xu, Kexin, Wang, Junjie, and Wei, Xicheng, "Effect of P and Ge doping on microstructure of Sn-0.3Ag-0.7Cu/Cu solder joints," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 1185-1188.

Yan, Xingchen, Xu, Kexin, Wang, Junjie, Wei, Xicheng, and Wang, Wurong, "Effect of P and Ge doping on microstructure of Sn-0.3Ag-0.7Cu/Ni-P solder joints," Soldering & Surface Mount Technology, vol. 28 no. 4, pp. 215-221, 2016.

Yan, Yan-fu, Zhu, Jin-hong, Chen, Fu-xiao, He, Jun-guang, and Yang, Di-xin, "Creep behavior on Ag particle reinforced SnCu based composite solder joints," Transactions of Nonferrous Metals Society of China, vol. 16 no. 5, pp. 1116-1120, Oct. 2006.

Yan, Yanfu, Wang, Guoxin, Song, Kexing, and Zhao, Kuaile, "Effect of Ag Particles on Wettability and Creep Rupture Life of SnCu Based Composite Solders," Materials Science Forum, vol. 650, 78-84, 2010.

Yan, Yanfu, Feng, Lifang, Guo, Xiaoxiao, Tang, Kun, and Song, Kexing, "Effect of the Content of Cu on Solderability and Mechanical Properties of Bi5Sb Solder Alloy," Materials Science Forum, vol. 610-613, pp. 537-541, 2009.

Yan, Zhong, and Xian, Ai-Ping, "Corrosion of Ga-doped Sn-0.7Cu Solder in Simulated Marine Atmosphere," Metallurgical Transactions A, vol. 44 no. 3, pp. 1462-1474, Mar. 2013. https://doi.org/10.1007/s11661-012-1480-2

Yanada, Isamu, "Electroplating of Lead-Free Solder Alloys Composed of Sn-Bi and Sn-Ag," IPC Printed Circuits Expo 1998, Long Beach, CA, Apr. 26-30, 1998, pp. S11-2-1-S11-2-7.

Yanada, Isamu, and Gudeczauskas, Donald, "Electroplating of Lead-Free Solder Alloys Composed of Sn-Bi, Sn-Ag, and Sn-Cu," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. 457-467.

Yanagida, Hidetaka, Yamasaki, Akihiro, and Yanagisawa, Yukio, "A New Method Using a Health Index (HI) to Screen Low Level Toxic Organic Substances in Consumer Products," Environmental Science & Technology , vol. 40 no. 8, pp. 2832-2837, 2006.

Yanaki, Nicholas E., "Principles of X-Ray Fluorescence Coating Measurements," Proceedings AESF SUR/FIN '96, Cleveland, OH, June 10-13, 1996, pp. 85-88.

Yang, Chang Joon, Cho, Moon Gi, and Lee, Hyuck Mo, "Synthesis of the Combined Solder of 80Au-20Sn/42Sn-58Bi and Thermodynamic Interpretation of the Microstructural Evolution," Materials Transactions , vol. 49 no. 2, pp. 376-381, Feb. 2008.

Yang, Chaoran, Xu, Guangsui, Lee, S. W. Ricky, and Zhang, Xinping, "Brittle Fracture of Intermetallic Compounds in SAC Solder Joints under High Speed Ball Pull/Pin Pull and Charpy Impact Tests," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 1294-1299.

Yang, Chaoran, Song, Fubin, Lee, S. W. Ricky, and Newman, Keith, "Comparative Study of PWB Pad Cratering Subject to Reflow Soldering and Thermal Impact," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 464-470.

Yang, Chaoran, Song, Fubin, and Lee, S. W. Ricky, "Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes," Journal of Electronic Packaging, vol. 136 no. 1, pp. 011003-1-011003-7, Mar. 2014.

Yang, Chaoran, Chan, Yuen Sing, Lee, S. W. Ricky, Ye, Yuming, and Liu, Sang, "Comparison of Thermal Fatigue Reliability of SnPb and SAC Solders under Various Stress Range Conditions," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1119-1123.

Yang, Chaoran, Song, Fubin, and Lee, S. W. Ricky, "Effect of Interfacial Strength between Cu6Sn5 and Cu3Sn Intermetallics on the Brittle Fracture Failure of Lead-free Solder Joints with OSP Pad Finish," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 971-978.

Yang, Chaoran, Le, Fuliang, and Lee, S. W. Ricky, "Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints," Microelectronics Reliability, vol. 62, pp. 130-140, July 2016.

Yang, Chaoran, Song, Fubin, and Lee, S. W. Ricky, "Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn-Cu-Ni (SCN) lead-free solder joints," Microelectronics Reliability, vol. 54 no. 2, pp. 435-446, Feb. 2014.

Yang, Chaoran, and Lee, S. W. Ricky, "Investigation of Fracture Behaviors of Cu-Sn Intermetallics using Impact Test," 2012 2nd IEEE CPMT Symposium Japan, Kyoto, Japan, Dec. 10-12, 2012, pp. xx-xx.

Yang, Chaoran, and Lee, S. W. Ricky, "Investigation on the Thermal Degradation Mechanism of Cu-Sn Intermetallic Compound in SAC Solder Joints with Cohesive Zone Modeling," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1029-1037.

Yang, Chen, and Wang, Jun, "Fatigue Life Prediction of a board-level assembly for random vibrations," 2017 18th International Conference on Electronic Packaging Technology , Harbin, China, Aug. 16-19, 2017, pp. 1125-1129.

Yang, Cheng, Yuen, Matthew M. F., Gao, Bo, and Ma, Yuhui, "Flexible Thermoplastic Conductive Adhesive with High Reliability," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1337-1341.

Yang, Cheng, Yuen, Matthew M. F., Gao, Bo, Ma, Yuhui, and Wong, C. P., "Investigation of a Biocompatible Polyurethane-Based Isotropically Conductive Adhesive for UHF RFID Tag Antennas," Journal of Electronic Materials , vol. 40 no. 1, pp. 78-84, Jan. 2011.

Yang, Cheng, Gu, Hongwei, Lin, Wei, Yuen, Matthew M., Wong, Ching Ping, Xiong, Mingyong, and Gao, Bo, "Silver Nanowires: From Scalable Synthesis to Recyclable Foldable Electronics," Advanced Materials, vol. 23 no. 27, pp. 3052-3056, July 17, 2011.

Yang, Cheng, Yuen, Matthew M. F., and Xu, Bing, "Using Novel Materials to Enhance the Efficiency of Conductive Polymer," 2008 Proceedings 58th Electronic Components & Technology Conference , Lake Buena Vista, FL, May 27-30, 2008, pp. 213-218.

Yang, Chih-han, Zhou, Shiqi, Lin, Shih-kang, and Nishikawa, Hiroshi, "Development of Sn-Bi-In-Ga quaternary low-temperature solders," 2019 International Conference on Electronics Packaging, Niigata, Japan, Apr. 17-20, 2019, pp. 367-369.

Yang, Chih-han, Zhou, Shiqi, Nishikawa, Hiroshi, and Lin, Shih-kang, "Mechanical properties of Sn-Bi-In-Ga low melting temperature solder alloys," 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Nagasaki, Japan, Apr. 17-21, 2018, pp. 409-410.

Yang, Ching-feng, and Chen, Sinn-wen, "Interfacial reactions in Au/Sn/Cu sandwich specimens," Intermetallics , vol. 18 no. 4, pp. 672-678, Apr. 2010.

Yang, Ching-Feng, Chen, Sinn-Wen, Wu, Kuan-Hsien, and Chin, Tsung-Shune, "Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu, Ag, and Ni Substrates," Journal of Electronic Materials, vol. 36 no. 11, pp. 1524-1530, Nov. 2007.

Yang, Ching-feng, Chen, Feng-ling, Gierlotka, Wojciech, Chen, Sinn-wen, Hsieh, Ker-chang, and Huang, Li-ling, "Thermodynamic properties and phase equilibria of Sn-Bi-Zn ternary alloys," Materials Chemistry and Physics, vol. 112 no. 1, pp. 94-103, Nov. 15, 2008.

Yang, Chunyan, Li, Liuhui, and Xue, Yahui, "Study on preparation process of Au80Sn20 eutectic solder on thin film substrate," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 450-453.

Yang, Congming, Wang, Junli, You, Tingting, and Zhang, Chi, "Long ZnSe nanowires by a seed-catalytic solution synthesis," Materials Letters, vol. 80, pp. 29-32, Aug. 1, 2012.

Yang, D. G., Liang, J. S., Li, Q. Y., Ernst, L. J., and Zhang, G. Q., "Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach," Microelectronics Reliability , vol. 44 no. 12, pp. 1947-1955, Dec. 2004.

Yang, D., Chan, Y. C., and Tu, K. N., "The time-dependent melting failure in flip chip lead-free solder interconnects under current stressing," Applied Physics Letters, vol. 93 no. 4, pp. 041907-1-041907-3, July 28, 2008.

Yang, Donghua, Cai, Jian, Wang, Qian, Li, Jingwei, Hu, Yang, and Li, Liangliang, "IMC growth and shear strength of Sn-Ag-Cu/Co-P ball grid array solder joints under thermal cycling," Journal of Materials Science: Materials in Electronics, vol. 26 no. 2, pp. 962-969, Feb. 2015.

Yang, Donghua, Zhai, Xiang, Zhang, Chunhong, Gan, Guisheng, Ran, Teng, Du, Fei, and Fan, Tao, "Interfacial Reaction and Failure Mechanism of SAC/Co-P Solder Joint under Rapid Thermal Fatigue," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Yang, Donghua, Yang, Guoshuai, Cai, Jian, Wang, Qian, Li, Jingwei, Hu, Yang, and Li, Liangliang, "Kinetics of Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder and Co-4.0P or Co-8.0P Metallization," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 439-446.

Yang, Donghua, Cai, Jian, Wang, Qian, Li, Jingwei, Hu, Yang, and Li, Liangliang, "Significantly Enhanced Shear Strength of Sn-Ag-Cu/Co-P Ball Grid Array Solder Joints by CoSn3 Intermetallic Compound," 2016 6th Electronic System-Integration Technology Conference, Grenoble, France, Sept. 13-15, 2016, pp. xx-xx.

Yang, Donghua, Lu, Nianduan, and Li, Liangliang, "Wettability of Sn-Bi and Sn-Ag-Cu Lead-Free Solder Pastes on Electroplated Co-P Films," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 1686-1691.

Yang, F., Liu, L. W., and Huang, M. L., "Comparative Study on Interfacial Reactions between Sn-3.5Ag, Sn-3.0Ag-0.5Cu Solder Balls and ENEPIG Pad after Multiple Reflows," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 280-286.

Yang, Fan, Liu, Sheng, Zhou, Zhaoxia, Chen, Zhiwen, Liu, Li, Liu, Canyu, and Liu, Changqing, "Mechanical properties of intermetallic compounds at elevated temperature by nanoindentation," 2019 IEEE 69th Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2019, pp. 850-854.

Yang, Fan, Liu, Sheng, Liu, Li, and Chen, Zhiwen, "Plastic deformation behavior of IMCs in solder joints during nanoindentation," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 556-561.

Yang, Fan, Huang, Mingliang, and Zhao, Ning, "Study on Short Time Interfacial Reactions between Sn-3.0Ag-0.5Cu Solder Balls and ENEPIG Pads," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 499-502.

Yang, Fan, "Surface effects on large deflection of nanowires," Journal of Central South University, vol. 22 no. 6, pp. 2060-2065, June 2015.

Yang, Fangfang, Messing, Maria E., Mergenthaler, Kilian, Ghasemi, Masoomeh, Johansson, Jonas, Wallenberg, L. Reine, Pistol, Mats-Erik, Deppert, Knut, Samuelson, Lars, and Magnusson, Martin H., "Zn-doping of GaAs nanowires grown by Aerotaxy," Journal of Crystal Growth, vol. 414, pp. 181-186, Mar. 15, 2015.

Yang, Fu, Wang, Bangbang, Su, Hang, Zhou, Shijian, and Kong, Yan, "Facilely self-reduced generation of Ag nanowires in the confined reductive siliceous nanopores and its catalytic reduction property," Journal of Alloys and Compounds, vol. 719, pp. 30-41, Sept. 30, 2017.

Yang, Fuqian, "A Nonlinear Viscous Model for Sn-Whisker Growth," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 47 no. 12, pp. 5882-5889, Dec. 2016. https://doi.org/10.1007/s11661-016-3530-7

Yang, Fuqian, "Analysis of the lattice diffusion-controlled growth of metallic whiskers," Journal of Physics D: Applied Physics, vol. 40 no. 13, pp. 4034-4038, July 7, 2007.

Yang, Fuqian, and Shi, Yu, "Analysis of whisker growth on a surface of revolution," Physics Letters A, vol. 381 no. 34, pp. 2767-2771, Sept. 12, 2017.

Yang, Fuqian, and Li, J. C. M., "Comments on "A Model for Nano-Indentation Creep"," Scripta Metallurgica et Materialia, vol. 32 no. 1, pp. 139-144, Jan. 1, 1995.

Yang, Fuqian, Li, J. C. M., and Shih, C. W., "Computer simulation of impression creep using the hyperbolic sine stress law," Materials Science and Engineering: A, Structural Materials, vol. 201 no. 1-2, pp. 50-57, Oct. 1995.

Yang, Fuqian, "Creep due to grain boundary diffusion and grain boundary viscous flow," Journal of Physics D: Applied Physics, vol. 30 no. 2, pp. 286-288, Jan. 21, 1997.

Yang, Fuqian, and Li, J. C. M., "Deformation behavior of tin and some tin alloys," Journal of Materials Science: Materials in Electronics, vol. 18 no. 1-3, pp. 191-210, Mar. 2007.

Yang, Fuqian, and Li, J. C. M., "Impression and diffusional creep of anisotropic media," Journal of Applied Physics, vol. 77 no. 1, pp. 110-117, Jan. 1995.

Yang, Fuqian, and Li, J. C. M., "Impression creep of a thin film by vacancy diffusion. I. Straight punch," Journal of Applied Physics, vol. 74 no. 7, pp. 4382-4389, Oct. 1, 1993.

Yang, Fuqian, Peng, Lingling, and Okazaki, Kenji, "Impression stress relaxation of Sn3.5Ag eutectic alloy," Journal of Materials Research, vol. 21 no. 10, pp. 2653-2659, Oct. 2006.

Yang, Fuqian, and Li, Yan, "Indentation-induced tin whiskers on electroplated tin coatings," Journal of Applied Physics, vol. 104 no. 11, pp. 113512-1-113512-4, Dec. 2008.

Yang, Gordon C. C., "Environmental threats of discarded picture tubes and printed circuit boards," Journal of Hazardous Materials, vol. 34 no. 2, pp, 235-243, June 1993.

Yang, Gwangseok, Jung, Younghun, Chun, Seungju, Kim, Donghwan, and Kim, Jihyun, "Catalytic growth of CdTe nanowires by closed space sublimation method," Thin Solid Films, vol. 546, pp. 375-378, Nov. 1, 2013.

Yang, H.-C., and Chiu, T.-C., "Characterization of Sn2.4Ag Solder Viscoplastic Behavior under Cyclic Loading," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 863-869.

Yang, H.-C., and Chiu, T.-C., "Unified Viscoplastic Constitutive Model for Sn3.8Ag0.7Cu Solder," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Yang, H. W., Wu, J. Y., Zhu, Z. X., and Kao, C. R., "Effects of surface diffusion and reaction-induced volume shrinkage on morphological evolutions of micro joints," Materials Chemistry and Physics, vol. 191, pp. 13-19, Apr. 15, 2017.

Yang, Haiyu, Liu, Jingyang, and Yang, Jiakuan, "Leaching copper from shredded particles of waste printed circuit boards," Journal of Hazardous Materials, vol. 187 no. 1-3, pp. 393-400, Mar. 15, 2011.

Yang, Hung-Chun, and Chiu, Tz-Cheng, "A Cyclic-Softening Viscoplastic Model for Considering the Temperature-Cycling Reliability of SAC305 Solder Joints," 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Ict. 21-23, 2020, pp. 157-160.

Yang, J., Winter, M., and Besenhard, J. O., "Small particle size multiphase Li-alloy anodes for lithium-ion batteries," Solid State Ionics, vol. 90 no. 1-4, pp. 281-287, Sept. 1996.

Yang, Ji Hyuck, and Lee, Kang Yong, "Cracking Analysis of Platic Package in Consideration of Viscoelasticity," Proceedings of 3rd Electronics Packaging Technology Conference, Singapore, Dec. 5-7, 2000, pp. 251-256.

Yang, Ji Hyuck, and Lee, Kang Yong, "Hygrothermal Cracking Analysis of Plastic IC Package," Journal of Electronic Packaging, Transactions of the ASME, vol. 127 no. 2, pp. 164-171, June 2005.

Yang, Jianxin, Lu, Bin, and Xu, Cheng, "WEEE flow and mitigating measures in China," Waste Management, vol. 28 no. 9, pp. 1589-1597, 2008.

Yang, Jie, Shu, Pingsheng, Feng, Xiaole, Hao, Xiuyun, and Wang, Yupeng, "Effect of rare earths addition on mechanical properties and wetting behavior of Sn-2.5Ag-0.7Cu lead-free solder," Advanced Materials Research, vol. 490-495, pp. 3119-3123, Mar. 2012.

Yang, Jie, Zhang, Qingke, and Song, Zhenlun, "Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder," Journal of Electronic Materials, vol. 50 no. 1, pp. 283-290, Jan. 2021. https://doi-org.ezproxy.uky.edu/10.1007/s11664-020-08595-9

Yang, Jimmy, Huang, Jay CY, Huang, Mike, Ku, J. L., Hsieh, Ander, and Li, K. C., "Failure Analysis of ENIG Surface Finish Pad," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Yang, Jimmy, Huang, Jay CY, Li, K. C., Ku, J. L., and Lee, Andrew, "Reliability Assessment for the PoP Lead Free Solder Joint Through Temperature Cycling Test," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Yang, Jin, Zhang, Lizheng, Ume, I. Charles, Ghiu, Camil, and White, George, "Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Applications Using a Laser Ultrasound Inspection System," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1530-1535.

Yang, Jin, and Ume, I. Charles, "Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals," Journal of Electronic Packaging, vol. 131 no. 1, pp. 011013-1-011013-11, Mar. 2009.

Yang, Jiping, Xiang, Dong, Wang, Jinsong, Duan, Guanghong, and Zhang, Hong-chao, "Removal force models for component disassembly from waste printed circuit board," Resources, Conservation and Recycling, vol. 53 no. 8, pp. 448-454, June 2009.

Yang, John Zhiyuan, "Performance Evaluation for Electrical Plate Lead-free Solder Bumping on Sapphire Wafers," 9th Electronics Packaging Technology Conference , Singapore, Dec. 10-12, 2007, pp. 246-251.

Yang, John Zhiyuan, "Sapphire Wafer Bumping by Lead-free Solder Paste Printing Process," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 902-905.

Yang, Kai-Yueh, Homma, Hitoshi, and Schuller, Ivan K., "Epitaxial film growth and metastable phases of single crystal Dy by molecular beam epitaxy," Journal of Applied Physics, vol. 63 no. 8, pp. 4066-4068, Apr. 15, 1988.

Yang, L. M., Zhang, Q. K., and Zhang, Z. F., "Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints," Scripta Materialia, vol. 67 no. 7-8, pp. 637-640, Oct. 2012.

Yang, L. M., and Zhang, Z. F., "Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction," Journal of Electronic Materials, vol. 42 no. 12, pp. 3552-3558, Dec. 2013.

Yang, L. M., and Zhang, Z. F., "Influences of intermetallic compounds morphologies on fracture behaviors of Sn-3Ag-0.5Cu/Cu solder joint," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 247-249.

Yang, L., Du, C., Zhang, N., Dai, J., Ge, J., Jing, Y., and Wang, G., "Modification of Sn58Bi solder based on graphite," Materials Science and Technology, vol. 30 no. 7, pp. 806-811, June 2014.

Yang, L. Y., and Mui, Y. C., "Solder Joint Reliability Study for Plastic Ball Grid Array Packagies," The International Journal of Microcircuits and Electronic Packaging, vol. ?? no. ??, pp. 100-108, ??.

Yang, L., Bernstein, J. B., and Chung, K., "The impact of lead-free soldering on electronics packages," Microelectronics International, vol. 18 no. 3, pp. 20-26, Sept. 2001.

Yang, Lei, Jie, Xiaohua, and Guo, Li, "Low-temperature property of new type lead-free solder Sn-X-Cu-Ni," Advanced Materials Research, vol. 154-155, pp. 371-375, 2011.

Yang, Li, Wei, Di, Zhang, Yaocheng, Jiang, Wei, and Xiong, Yifeng, "Effect of aging temperature on microstructure and mechanical properties of Sn-9Zn-xZrC solder joints," Journal of Materials Science: Materials in Electronics, vol. 30 no. 1, pp. 753-759, Jan. 2019.

Yang, Li, Zhang, Yaocheng, Du, Chengchao, Dai, Jun, and Zhang, Ning, "Effect of aluminum concentration on the microstructure and mechanical properties of Sn-Cu-Al solder alloy," Microelectronics Reliability , vol. 55 no. 3-4, pp. 596-601, Feb.-Mar. 2015.

Yang, Li, Ge, Jinguo, Zhang, Yaocheng, Dai, Jun, and Jing, Yanfeng, "Effect of BaTiO3 on the microstructure and mechanical properties of Sn1.0Ag0.5Cu lead-free solder," Journal of Materials Science: Materials in Electronics, vol. 26 no. 1, pp. 613-619, Jan. 2015.

Yang, Li, Ge, Jinguo, Liu, Haixiang, Xu, Liufeng, and Bo, Anbing, "Effect of Cooling Rate on the Microstructure and Mechanical Properties of Sn-1.0Ag-0.5Cu-0.2BaTiO3 Composite Solder," Journal of Electronic Materials, vol. 44 no. 11, pp. 4595-4603, Nov. 2015.

Yang, Li, and Zhang, Na, "Effect of Metal Particles on Spreading Properties of Sn0.7Cu Based Composite Solder," Advanced Materials Research, vol. 152-153, pp. 1759-1762, 2011.

Yang, Li, Du, Chengchao, Dai, Jun, Zhang, Ning, and Jing, Yanfeng, "Effect of nanosized graphite on properties of Sn-Bi solder," Journal of Materials Science: Materials in Electronics, vol. 24 no. 11, pp. 4180-4185, Nov. 2013.

Yang, Li, "Effects of Ag particles content on properties of Sn0.7Cu solder," Journal of Materials Science: Materials in Electronics, vol. 24 no. 5, pp. 1405-1409, May 2013.

Yang, Li, Ge, Jinguo, Zhang, Yaocheng, Dai, Jun, and Jing, Yanfeng, "Electromigration reliability for Al2O3-reinforced Cu/Sn-58Bi/Cu composite solder joints," Journal of Materials Science: Materials in Electronics , vol. 28 no. 3, pp. 3004-3012, Feb. 2017.

Yang, Li, Dai, Jun, Zhang, Yaocheng, Jing, Yanfeng, Ge, Jinguo, and Liu, Haixiang, "Influence of BaTiO3 Nanoparticle Addition on Microstructure and Mechanical Properties of Sn-58Bi Solder," Journal of Electronic Materials, vol. 44 no. 7, pp. 2473-2478, July 2015.

Yang, Li, Ge, Jinguo, Zhang, Yaocheng, Dai, Jun, Liu, Haixiang, and Xiang, Jicen, "Investigation on the Microstructure, Interfacial IMC Layer, and Mechanical Properties of Cu/Sn-0.7Cu-xNi/Cu Solder Joints," Journal of Electronic Materials, vol. 45 no. 7, pp. 3766-3775, July 2016.

Yang, Li, Zhu, Lu, Zhang, Yaocheng, Liu, Po, Zhang, Ning, Zhou, Shiyuan, and Jiang, Licheng, "Microstructure and reliability of Mo nanoparticle reinforced Sn-58Bi-based lead-free solder joints," Materials Science and Technology, vol. 34 no. 8, pp. 992-1002, May 2018.

Yang, Li, Liu, Haixiang, and Zhang, Yaocheng, "Study on the Tensile Creep Behavior of Carbon Nanotubes-Reinforced Sn-58Bi Solder Joints," Journal of Electronic Materials, vol. 47 no. 1, pp. 662-671, Jan. 2018.

Yang, Li, Xiaoyan, Li, and Yao, Peng, "The effect of vacancy on the interfacial diffusion in Cu/Sn lead-free solder joints," Soldering & Surface Mount Technology, vol. 31 no. 1, pp. 28-39, 2019.

Yang, Linlin, Yin, Liang, Roggeman, Brian, and Borgesen, Peter, "Effects of Microstructure Evolution on Damage Accumulation in Lead-Free Solder Joints," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1518-1523.

Yang, Linlin, Yin, Liang, Arafei, Babak, Roggeman, Brian, and Borgesen, Peter, "On the Assessment of the Life of SnAgCu Solder Joints in Cycling With Varying Amplitudes," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 3, pp. 430-440, Mar. 2013.

Yang, Linlin, Raghavan, Venkatesh, Borgesen, Peter, Roggeman, Brian, and Yin, Liang, "On the Complete Breakdown of Miner's Rule for Lead Free BGA Joints," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 152-159.

Yang, Linmei, and Zhang, Z. F., "Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling," Journal of Electronic Materials , vol. 44 no. 1, pp. 590-596, Jan. 2015.

Yang, Liyu, Bernstein, Joseph B., and Koschmieder, T., "Assessment of acceleration models used for BGA solder joint reliability studies," Microelectronics Reliability, vol. 49 no. 12, pp. 1546-1554, Dec. 2009.

Yang, Lizhuang, Zhou, Wei, Li, Xuezheng, Ma, Yong, Liang, Yinghua, Cui, Wenquan, and Wu, Ping, "Effect of Ni and Ni-coated Carbon Nanotubes on the interfacial reaction and growth behavior of Sn58Bi/Cu intermetallic compound layers," Journal of Materials Science: Materials in Electronics, vol. 27 no. 11, pp. 12264-12270, Nov. 2016.

Yang, Lizhuang, Zhou, Wei, Ma, Yong, Li, Xuezheng, Liang, Yinghua, Cui, Wenquan, and Wu, Ping, "Effects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging," Materials Science and Engineering: A, vol. 667, pp. 368-375, June 14, 2016.

Yang, Lizhuang, Zhou, Wei, Liang, Yinghua, Cui, Wenquan, and Wu, Ping, "Improved microstructure and mechanical properties for Sn58Bi solder alloy by addition of Ni-coated carbon nanotubes," Materials Science and Engineering: A, vol. 642, pp. 7-15, Aug. 26, 2015.

Yang, Min, Liu, Xiuzhong, Wang, Chunqing, Zou, Zengda, and Jiang, Dalei, "Development of fluxes for selected Sn-Cu based lead-free solders," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Yang, Min, Zhang, Tao, Liu, Xiuzhong, and He, Songming, "Water-Soluble Fluxes for Sn-4Zn-0.89Cu-3.5Bi-0.3Re Alloy Lead-free Solder," 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 6-10, 2009, pp. 785-789.

Yang, Ming, Li, Mingyu, Wu, Jianxin, and Xu, Jinhua, "Abnormal Grain Growth in Cu6Sn5 Grains Formed at Sn-based Solder/Cu Interfaces," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1181-1185.

Yang, Ming, Li, Mingyu, Wang, Ling, Fu, Yonggao, Kim, Jongmyung, and Weng, Lvqian, "Cu6Sn5 Morphology Transition and Its Effect on Mechanical Properties of Eutectic Sn-Ag Solder Joints," Journal of Electronic Materials, vol. 40 no. 2, pp. 176-188, Feb. 2011.

Yang, Ming, Cao, Yong, Joo, Sungmin, Chen, Hongtao, Ma, Xin, and Li, Mingyu, "Cu6Sn5 precipitation during Sn-based solder/Cu joint solidification and its effects on the growth of interfacial intermetallic compounds," Journal of Alloys and Compounds, vol. 582, pp. 688-695, Jan. 5, 2014.

Yang, Ming, Ji, Hongjun, Wang, Shuai, Ko, Yong-Ho, Lee, Chang-Woo, Wu, Jianxin, and Li, Mingyu, "Effects of Ag content on the interfacial reactions between liquid Sn-Ag-Cu solders and Cu substrates during soldering," Journal of Alloys and Compounds, vol. 679, pp. 18-25, Sept. 15, 2016.

Yang, Ming, Li, Mingyu, Wang, Ling, Fu, Yonggao, Kim, Jongmyung, and Weng, Lvqian, "Growth behavior of Cu6Sn5 grains formed at an Sn3.5Ag/Cu interface," Materials Letters, vol. 65 no. 10, pp. 1506-1509, May 31, 2011.

Yang, Ming, Li, Mingyu, Kim, Jongmyung, and Kim, Hongbae, "Growth Behavior of Prismatic Cu6Sn5 and Its Effect on Mechanical Properties of Eutectic Sn-Ag Solder Joints," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 159-162.

Yang, Ming, Ko, Yong-Ho, Bang, Junghwan, Kim, Taek-Soo, Lee, Chang-Woo, Zhang, Shuye, and Li, Mingyu, "Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates," Journal of Alloys and Compounds, vol. 701, pp. 533-541, Apr. 15, 2017.

Yang, Ming, Li, Mingyu, and Wang, Chunqing, "Interfacial reactions of eutectic Sn3.5Ag and pure tin solders with Cu substrates during liquid-state soldering," Intermetallics, vol. 25, pp. 86-94, June 2012.

Yang, Ming, Yang, Shihua, Ji, Hongjun, Ko, Yong-Ho, Lee, Chang-Woo, Wu, Jianxin, and Li, Mingyu, "Microstructure evolution, interfacial reaction and mechanical properties of lead-free solder bump prepared by induction heating method," Journal of Materials Processing Technology, vol. 236, pp. 84-92, Oct. 2016.

Yang, Ming, Chen, Hongtao, Ma, Xin, Li, Mingyu, Cao, Yong, and Kim, Jongmyung, "Solid-state interfacial reaction of eutectic Sn3.5Ag and pure tin solders with polycrystalline Cu substrate," Journal of Materials Science, vol. 49 no. 10, pp. 3652-3664, May 2014.

Yang, Ming-Shan, He, Jie, Li, Lin-Kai, and Liu, Zhen, "The Synthesis and Curing Kinetics of the Silicon-containing Epoxy Resin with Environmentally Friendship Flame Retardance," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Yang, Minghui, Qi, Fangjuan, Ding, Yaping, Ren, Deliang, and Xu, Changling, "The Effect of Aging on Microstructures Evolution and Shear Behaviors in Lead-free Solder Joint," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Yang, Ping-Feng, Lai, Yi-Shao, Jian, Sheng-Rui, Chen, Jiunn, and Chen, Rong-Sheng, "Identification of Mechanical Properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Using Nanoindentation," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 189-192.

Yang, Ping-Feng, Lai, Yi-Shao, Jian, Sheng-Rui, and Chen, Jiunn, "Mechanical Properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Measured by Nanoindentation," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Yang, Ping-Feng, Lai, Yi-Shao, Jian, Sheng-Rui, Chen, Jiunn, and Chen, Rong-Sheng, "Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples," Materials Science and Engineering: A, vol. 485, no. 1-2, pp. 305-310, June 25, 2008.

Yang, Ping-Feng, Jian, Sheng-Rui, Lai, Yi-Shao, and Chen, Rong-Sheng, "Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds," Journal of Electronic Materials, vol. 38 no. 6, pp. 810-814, June 2009.

Yang, Po-Chun, Kuo, Chien-Chih, and Chen, Chih, "The Effect of Pre-Aging on the Electromigration of Flip-Chip SnAg Solder Joints," JOM, vol. 60 no. 6, pp. 77-80, June 2008.

Yang, Q. L., Guo, J. D., and Shang, J. K., "Electromigration In Cu/Sn-58Bi/Cu Interconnects," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Yang, Q. L., and Shang, J. K., "Interfacial Segregation of Bi during Current Stressing of Sn-Bi/Cu Solder Interconnect," Journal of Electronic Materials, vol. 34 no. 11, pp. 1363-1367, Nov. 2005.

Yang, Qiliang, Shang, Panju, Guo, Jing D., Liu, Zhiquan, and Shang, Jian-Ku, "Current-induced growth of P-rich phase at electroless nickel/Sn interface," Journal of Materials Research, vol. 24 no. 9, pp. 2767-2774, Sept. 2009.

Yang, Ren, "Advantages and Disadvantages of AOI Methodologies in Lead-Free PCB Assembly," Lead-Free Magazine, vol. 6, May 2006.

Yang, Rui, He, Tina, Marcoux, Carine, Andreucci, Philippe, Duraffourg, Laurent, and Feng, Philip X.-L, "Silicon Nanowire and Cantilever Electromechanical Switches with Integrated Piezoresistive Transducers," 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems, Taipei, Taiwan, Jan. 20-24, 2013, pp. 229-232.

Yang, Ruo-Wei, Chang, Yuan-Wei, Sung, Wei-Chi, and Chen, Chih, "Precipitation of large Ag3Sn intermetallic compounds in SnAg2.5 microbumps after multiple reflows in 3D-IC packaging," Materials Chemistry and Physics, vol. 134 no. 1, pp. 340-344, May 15, 2012.

Yang, S. C., Wang, Y. W., Chang, C. C., and Kao, C. R., "Analysis and Experimental Verification of the Volume Effect in the Reaction Between Zn-Doped Solders and Cu," Journal of Electronic Materials , vol. 37 no. 10, pp. 1591-1597, Oct. 2008.

Yang, S. C., Chang, C. C., Tsai, M. H., and Kao, C. R., "Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni," Journal of Alloys and Compounds, vol. 499 no. 2, pp. 149-153, June 11, 2010.

Yang, S., Wu, J., and Christou, A., "Initial Stage of Silver Electrochemical Migration Degradation," Microelectronics Reliability, vol. 46 no. 9-11, pp. 1915-1921, Sept.-Nov. 2006.

Yang, S. C., Chang, W. C., Wang, Y. W., and Kao, C. R., "Interfacial Reaction and Wetting Behavior Between Pt and Molten Solder," Journal of Electronic Materials, vol. 38 no. 1, pp. 25-32, Jan. 2009.

Yang, S. C., and Kao, C. R., "Massive Spalling of Intermetallics in Solder Joints: a General Phenomenon that Can Occur in Multiple Solder-Substrate Systems," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1825-1830.

Yang, S. C., and Kao, C. R., "Role of Minor Zn Addition in the Interfacial Reaction between Lead-Free Solders and Cu," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 102-105.

Yang, S. C., Ho, C. E., Chang, C. W., and Kao, C. R., "Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu," Journal of Materials Research, vol. 21 no. 10, pp. 2436-2439, Oct. 2006.

Yang, S. M., Chang, Y. Y., and Wu, Weite, "Analysis of the Interfacial Reaction between Sn-3.5Ag and Electroplating Interlayers," Materials Research Society Symposia Proceedings Volume 863 , 1994, pp. B8.29.1-B8.29.6.

Yang, S. M., Chang, Y. Y., and Wu, Weite, "Analysis of the Interfacial Reaction between Sn-3.5Ag and Electroplating Interlayers," Materials, Technology and Reliability of Advanced Interconnects - 2005 (Materials Research Society Symposium Proceedings Volume 863), San Francisco, CA, Mar. 28-Apr. 1, 2005, pp. 351-356.

Yang, Se Young, Kim, Ilho, and Lee, Soon-Bok, "A Study on the Thermal Fatigue Behavior of Solder Joints Under Power Cycling Conditions," IEEE Transactions on Components and Packaging Technologies , vol. 31 no. 1, pp. 3-12, Mar. 2008.

Yang, Se Young, Lee, Soon-Bok, Kwon, Woon-Seong, and Paik, Kyung-Wook, "Analytical Approach to Evaluate Shear Stress in Flip Chip Interconnection using NCA/ACF," Proceedings of the 4th International Symposium on Electronic Materials and Packaging, Kaoshung, Taiwan, Dec. 4-6, 2002, pp. 415-420.

Yang, Se Young, Kwon, Woon Seong, Lee, Soon Bok, and Paik, Kyoung Wook, "Chip Warpage Damage Model for ACA Flim Type Electonic Packages," Key Engineering Materials, vol. 297-300, pp. 887-892, Nov. 2005.

Yang, Se Young, and Lee, Soon Bok, "Developing Phase Shifting Micro Moire Interferometry using Phase Shifter with Rough Resolution and by Shifting Specimen Grating," Proceedings of the 3rd International Symposium on Electronics Materials and Packaging, Cheju, Korea, Nov. 19-22, 2001, pp. 399-403.

Yang, Se Young, Jeon, Young-Doo, Lee, Soon-Bok, and Paik, Kyung-Wook, "Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages," Microelectronics Reliability, vol. 46 no. 2-4, pp. 512-522, Feb.-Apr. 2006.

Yang, Shan, Peng, Li, Tao, Yishi, Hu, Anmin, and Li, Ming, "Influence of Cu Orientation on the Growth of Cu-Sn Intermetallics and Interfacial Reaction of Cu/Sn Diffusion Couple," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 121-124.

Yang, Shihua, Tian, Yanhong, and Wang, Chunqing, "Investigation on Sn grain number and crystal orientation in the Sn-Ag-Cu/Cu solder joints of different sizes," Journal of Materials Science: Materials in Electronics, vol. 21 no. 11, pp. 1174-1180, Nov. 2010.

Yang, Shihua, Wang, Chunqing, Tian, Yanhong, Lin, Pengrong, and Liang, Le, "Limited á-Sn grain number of miniaturized Sn-Ag-Cu solder joints," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Yang, Shihua, Tian, Yanhong, Wang, Chunqing, and Huang, Tengfei, "Modeling Thermal Fatigue in Anisotropic Sn-Ag-Cu/Cu Solder Joints," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 288-289.

Yang, Shuang, and Christou, Aristos, "Failure Model for Silver Electrochemical Migration," IEEE Transactions on Device and Materials Reliability, vol. 7 no. 1, pp. 188-196, Mar. 2007.

Yang, Su-Chun, Ho, Cheng-En, Chang, Chien-Wei, and Kao, C. Robert, "Effect of Zn Addition on the Interfacial Reactions between Cu and Lead-Free Solders," Advanced Electronic Packaging (Materials Research Society Symposium Proceedings Volume 968), Boston, MA, Nov. 27-30, 2006, pp. 81-87.

Yang, Su-Chun, Ho, Cheng-En, Chang, Chien-Wei, and Kao, C. Robert, "Massive Spalling of Intermetallic Compound in Lead-Free Solder Joints," Advanced Electronic Packaging (Materials Research Society Symposium Proceedings Volume 968), Boston, MA, Nov. 27-30, 2006, pp. 71-79.

Yang, T. H., Yu, H. Y., Wang, Y. W., and Kao, C. R., "Effects of Aspect Ratio on Microstructural Evolution of Ni/Sn/Ni Microjoints," Journal of Electronic Materials, vol. 48 no. 1, pp. 9-16, Jan. 2019.

Yang, T. L., Yu, J. J., Li, C. C., Lin, Y. F., and Kao, C. R., "Dominant effects of Sn orientation on serrated cathode dissolution and resulting failure in actual solder joints under electromigration," Journal of Alloys and Compounds, vol. 627, pp. 281-286, Apr. 5, 2015.

Yang, T. L., Yu, J. J., Shih, W. L., Hsueh, C. H., and Kao, C. R., "Effects of silver addition on Cu-Sn microjoints for chip-stacking applications," Journal of Alloys and Compounds, vol. 605, pp. 193-198, Aug. 25, 2014.

Yang, T. L., Shih, W. L., Yu, J. J., and Kao, C. R., "Interfacial Reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn Solder under Space Confinement for 3D IC Micro Joint Applications," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 2277-2282.

Yang, T. L., Wu, J. Y., Li, C. C., Yang, S., and Kao, C. R., "Low temperature bonding for high temperature applications by using SnBi solders," Journal of Alloys and Compounds, vol. 647, pp. 681-685, Oct. 25, 2015.

Yang, Teng-Kai, Lin, Chih-Fan, and Chen, Chih-Ming, "Interfacial Reactions Between Cu-Ag Alloy Substrates and Sn," Journal of Electronic Materials, vol. 44 no. 1, pp. 511-517, Jan. 2015.

Yang, Ting-Li, Liu, Yu-chen, Yang, Chih-Han, Kuo, Yi-Kai, and Lin, Shih-kang, Formation of a Diffusion Barrier-Like Intermetallic Compound to Suppress the Formation of Micro-voids at the Sn-0.7Cu/Cu Interface by Optimal Ga Additions," JOM, vol. 72 no. 10, pp. 3538-3546, Oct. 2020. https://doi-org.ezproxy.uky.edu/10.1007/s11837-020-04302-5

Yang, Tsung-Fu, Kao, Kuo-Shu, Cheng, Ren-Chin, Chang, Jing-Yao, and Zhan, Chau-Jie, "Evaluation of Cu/SnAg microbump bonding processes for 3D integration using wafer-level underfill film," Soldering & Surface Mount Technology , vol. 24 no. 4, pp. 287-293, 2012.

Yang, W. F., Lee, S. J., Liang, G. C., Eswar, R., Sun, Z. Q., and Kwong, D. L., "Temperature Dependence of Carrier Transport of a Silicon Nanowire Schottky-Barrier Field-Effect Transistor," IEEE Transactions on Nanotechnology, vol. 7 no. 6, pp. 728-732, Nov. 2008.

Yang, Wei, Cui, Chunxiang, Liu, Qiaozhi, Cao, Bin, Liu, Lian, and Zhang, Yajin, "Fabrication and magnetic properties of Sm2Co17 and Sm2Co17/Fe7Co3 magnetic nanowires via AAO templates," Journal of Crystal Growth, vol. 399, pp. 1-6, Aug. 1, 2014.

Yang, Wen-bin, Wun, Jun, Wei, Ming, Wang, Chao, and Xie, Chang-qiong, "Preparation and characterization of silicon nanowire arrays for solar cell," Materials Science Forum, vol. 663-665, pp. 840-843, Nov. 2010.

Yang, Wenge, Messler Jr., Robert W., and Felton, Lawrence E., "Microstructure Evolution of Eutectic Sn-Ag Solder Joints," Journal of Electronic Materials, vol. 23 no. 8, pp. 765-772, Aug. 1994.

Yang, Wenge, Felton, Lawrence E., and Messler Jr., Robert W., "The Effect of Soldering Process Variables on the Microstructure and Mechanical Properties of Eutectic Sn-Ag/Cu Solder Joints," Journal of Electronic Materials, vol. 24 no. 10, pp. 1465-1472, Oct. 1995.

Yang, Wenyuan, Ji, Xianghai, Wang, Xiaoye, Li, Tong, Shi, Tuanwei, Yang, Tao, and Chen, Qing, "The effect of nanoscale steps on the self-catalyzed position-controlled InAs nanowire growth," Journal of Micromechanics and Microengineering, vol. 28 no. 1, pp. 014002-1-014002-9, Jan. 2018.

Yang, X., and Tidecks, R., "Interaction between neighbouring phase-slip centers in a superconducting Zn whisker," Zeitschrift fur Physik B Condensed Matter, vol. 83 no. 1, pp. 113-118, Feb. 1991. https://doi.org/10.1007/BF01314404

Yang, X., and Tidecks, R., "Voltage changes due to interaction effects of neighbouring phase-slip centers in a superconducting Zn whisker," Physics Letters A, vol. 153 no. 4-5, pp. 243-247, Mar. 4, 1991.

Yang, X. B., and Zhang, R. Q., "Metallization induced by nitrogen atom adsorption on silicon nanofilms and nanowires," Applied Physics Letters, vol. 94 no. 13, pp. 113101-1-113101-3, 2009.

Yang, Xianjie, Luo, Yan, and Gao, Qing, "Constitutive Modeling on Time-Dependent Deformation Behavior of 96.5Sn-3.5Ag Solder Alloy Under Cyclic Multiaxial Straining," Journal of Electronic Packaging, vol. 129 no. 1, pp. 41-47, Mar. 2007.

Yang, Xiaojian, He, Wei, Wang, Shouxu, Zhou, Guoyun, and Tang, Yao, "Preparation and properties of a novel electrically conductive adhesive using a composite of silver nanorods, silver nanoparticles, and modified epoxy resin," Journal of Materials Science: Materials in Electronics, vol. 23 no. 1, pp. 108-114, Jan. 2012.

Yang, Xiaojun, Hu, Wei, Yan, Xin, and Lei, Yongping, "Microstructure and Solderability of Zn-6Al-xSn Solders," Journal of Electronic Materials, vol. 44 no. 4, pp. 1128-1133, Apr. 2015.

Yang, Xiaoning, Sun, Lushi, Xiang, Jun, Hu, Song, and Su, Sheng, "Pyrolysis and dehalogenation of plastics from waste electrical and electronic equipment (WEEE): A review," Waste Management, vol. 33 no. 2, pp. 462-473, Feb. 2013.

Yang, Xiongbo, Sun, Yinlu, Wang, Fenying, and Zhao, Jianwei, "Surface effects on the initial dislocation of Ag nanowires," Computational Materials Science, vol. 106, pp. 23-28, Aug. 2015.

Yang, Xuexia, Wang, Bo, Zhang, Yu, and Shu, Xuefeng, "Analysis on the Abilities of Solder Joints to Resist Thermal Fatigue and Service Life Prediction," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 1147-1150.

Yang, Xue-Xia, Zhang, Yu, and Shu, Xue-Feng, "Finite Element Analysis on the Ability of Solder Joints to Resist Thermal Fatigue," Advanced Materials Research, vol. 118-120, pp. 738-747, 2010.

Yang, Xun, Chen, Shixing, Wang, Yi, Wang, Yuelin, and Li, Tie, "High Performance pH Sensor by Using Silicon Nanowire Array," 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Bordeaux, France, May 29-June 1, 2017, pp. xx-xx.

Yang, Y., and Zhou, J., "An Experimental Technique for Liquid/Solid Thermal Conductivity Measurements at the Melting Point," International Journal of Thermophysics, vol. 27 no. 1, pp. 184-194, Jan. 2006.

Yang, Y., Balaraju, J. N., Tsakadze, Z., and Chen, Z., "Electroless Ni-W-P Alloy As A More Enduring And Reliable Soldering Metallization," 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 7-9, 2011, pp. 44-48.

Yang, Y., Teh, P. F., Sumboja, A., and Chen, Z., "Interface Reaction of Pb-free Sn-3.5Ag Solder with Ni-Sn-P Metallization," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 719-724.

Yang, Y., Lim, Y. J., Kumar, A., Lee, T. K., and Chen, Z., "Interface Reactions and Shear Strength of Lead-Free Sn-3.5Ag Solder with Ni-W-P Metallization," 9th Electronics Packaging Technology Conference , Singapore, Dec. 10-12, 2007, pp. 527-532.

Yang, Y. D., Mao, H. Y., Xiong, J. J., Jia, Y. C., Li, R. R., Ming, A. J., and Wang, W. B., "Optical Features of Nanowire Forests Generated Using Plasma Repolymerization," 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, Los Angeles, CA, Apr. 9-12, 2017, pp. 452-455.

Yang, Y., Balaraju, J. N., and Chen, Z., "Reflow Study of Pb-free Sn-3.5Ag Solder with Ni-Sn-P Metallization," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 801-806.

Yang, Yang, Zhao, Xuewei, Ma, Limin, Zhang, Fuwen, Hu, Qiang, and Guo, Fu, "Effects of temperature and humidity on the formation of solder bead and microstructure in Sn-58Bi Solder joint," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 370-374.

Yang, Yang, Lu, Hao, Yu, Chun, and Chen, Junmei, "First-Principles Calculations of Structural, Thermodynamic and Electronic Properties of Intermetallic Compounds in Solder," International Conference on Electronic Packaging Technology & High Density Packaging , Beijing, China, Aug. 10-13, 2009, pp. 384-387.

Yang, Yang, Li, Yongzhi, Lu, Hao, Yu, Chun, and Chen, Junmei, "First-principles calculations of Zn substitutions in Cu6Sn5," Computational Materials Science, vol. xx no. x, pp. xx-xx, xxxx.

Yang, Yang, Li, Yongzhi, Lu, Hao, Yu, Chun, and Chen, Junmei, "Interdiffusion at the interface between Sn-based solders and Cu substrate," Microelectronics Reliability, vol. 53 no. 2, pp. 327-333, Feb. 2013.

Yang, Yang, Lu, Hao, Yu, Chun, and Li, Yongzhi, "Void formation at the interface in Sn/Cu solder joints," Microelectronics Reliability, vol. 51 no. 12, pp. 2314-2318, Dec. 2011.

Yang, Yi-Shan, Yang, Chia-Jung, and Ouyang, Fan-Yi, "Erratum to "Interfacial reaction of Ni3Sn4 intermetallic compound in Ni/SnAg solder/Ni system under thermomigration" [J. Alloys Compd. 674 (2016) 331-340]," Journal of Alloys and Compounds, vol. 731, pp. 24, Jan. 15, 2018.

Yang, Yi-Shan, Yang, Chia-Jung, and Ouyang, Fan-Yi, "Interfacial reaction of Ni3Sn4 intermetallic compound in Ni/SnAg solder/Ni system under thermomigration," Journal of Alloys and Compounds, vol. 673, pp. 331-340, July 15, 2016.

Yang, Ying, "Failure analysis for bad wetting on HASL PCB," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 126-129.

Yang, Ying, "Failure analysis for laminate delamination," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 73-75.

Yang, Ying, Balaraju, J. N., Huang, Yizhong, Liu, Hai, and Chen, Zhong, "Interface reaction between an electroless Ni-Co-P metallization and Sn-3.5Ag lead-free solder with improved joint reliability," Acta Materialia , vol. 71, pp. 69-79, June 2014.

Yang, Ying, Balaraju, J. N., Huang, Yizhong, Tay, Yee Yan, Shen, Yiqiang, Tsakadze, Zviad, and Chen, Zhong, "Interface Reaction Between Electroless Ni-Sn-P Metallization and Lead-Free Sn-3.5Ag Solder with Suppressed Ni3P Formation," Journal of Electronic Materials, vol. 43 no. 11, pp. 4103-4110, Nov. 2014.

Yang, Ying, Balaraju, J. N., Chong, Ser Choong, Xu, Hui, Liu, Changqing, Silberschmidt, Vadim V., and Chen, Zhong, "Significantly retarded interfacial reaction between an electroless Ni-W-P metallization and lead-free Sn-3.5Ag solder," Journal of Alloys and Compounds, vol. 565, pp. 11-16, July 15, 2013.

Yang, Zhongbao, Zhou, Wei, and Wu, Ping, "Effects of Ni-coated Carbon Nanotubes addition on the electromigration of Sn-Ag-Cu solder joints," Journal of Alloys and Compounds, vol. 581, pp. 202-205, Dec. 25, 2013.

Yang, Zhongbao, Zhou, Wei, and Wu, Ping, "Effects of Ni-Coated Carbon Nanotubes addition on the microstructure and mechanical properties of Sn-Ag-Cu solder alloys," Materials Science and Engineering: A, vol. 590, pp. 295-300, Jan. 10, 2014.

Yanjun, Xu, Liquan, Wang, Fengshun, Wu, Weisheng, Xia, and Hui, Liu, "Effect of Interface Structure on Fatigue Life under Thermal Cycle with SAC305 Solder Joints," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 959-964.

Yano, Ryosuke, and Yu, Qiang, "The life cycle impact assessment that the variabilities of BGA solder connection makes," 2017 IEEE 19th Electronics Packaging Technology Conference, Singapore, Dec. 6-9, 2017, pp. xx-xx.

Yao, Da-Jeng, Hsu, Chung-Yi, Chen, Chih, and Chiu, Sheng-Hsiang, "Thermal Gradient in Solder Joints Under Electrical Current Stressing," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B, San Francisco, CA, July 17-22, 2005, pp. 1277-1282.

Yao, Marissa A., Higgs, Tim G., Cullen, Michael J., Stewart, Scott, and Brady, Todd A., "Comparative Assessment of Life Cycle Assessment Methods Used for Personal Computers," Environmental Science & Technology, vol. 44 no. 19, pp. 7335-7346, Oct. 1, 2010.

Yao, Pei, Liu, Ping, and Liu, Jim, "Effects of multiple reflows on intermetallic morphology and shear strength of SnAgCu-xNi composite solder joints on electrolytic Ni/Au metallized substrate," Journal of Alloys and Compounds, vol. 462 no. 1-2, pp. 73-79, Aug. 25, 2008.

Yao, Pei, Liu, Ping, and Liu, Jim, "Interfacial reaction and shear strength of SnAgCu-xNi/Ni solder joints during aging at 150 °C," Microelectronic Engineering, vol. 86 no. 10, pp. 1969-1974, Oct. 2009.

Yao, Peng, Li, Xiaoyan, Liang, Xiaobo, and Yu, Bo, "A Study on Optimization of Process Parameters, Microstructure Evolution and Fracture Behavior for Full Cu3Sn Solder Joints in Electronic Packaging," 2016 IEEE 18th Electronics Packaging Technology Conference, Singapore, Nov. 30-Dec. 3, 2016, pp. 135-140.

Yao, Peng, Li, Xiaoyan, Liang, Xiaobo, and Yu, Bo, "Investigation of soldering process and interfacial microstructure evolution for the formation of full Cu3Sn joints in electronic packaging," Materials Science in Semiconductor Processing, vol. 58, pp. 39-50, Feb. 2017.

Yao, Peng, and Li, Xiaoyan, "Investigation on shear fracture of different strain rates for Cu/Cu3Sn/Cu solder joints derived from Cu-15um Sn-Cu sandwich structure," Journal of Materials Science: Materials in Electronics, vol. 31 no. 4, pp. 2862-2876, Feb. 2020.

Yao, Peng, Li, Xiaoyan, Jin, Fengyang, and Li, Yang, "Morphology transformation on Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging," Soldering & Surface Mount Technology, vol. 30 no. 1, pp. 14-25, 2018.

Yao, Peng, Li, Xiaoyan, Han, Xu, and Xu, Liufeng, "Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu3Sn proportion and joints with conventional interfacial structure in electronic packaging," Soldering & Surface Mount Technology, vol. 31 no. 1, pp. 6-19, 2019.

Yao, Rihui, Li, Xiaoqing, Li, Zhihang, Shi, Muyang, Zhou, Shangxiong, Yuan, Weijian, Ning, Honglong, Peng, Junbiao, and Fang, Zhiqiang, "Fabrication and Properties of Silver Nanowire Flexible Transparent Electrode," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 454-456.

Yao, Shun, Wang, Xuelin, Yang, Shihua, Zhang, Zhihao, and Cao, Huijun, "Formation mechanism and reliability of Cu6Sn5 textures formed in-between liquid Sn and (111)/(001) Cu single crystals," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 444-447.

Yao, Wei, and Basaran, Cemal, "Damage of SAC405 Solder Joint under PDC," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , San Diego, CA, May 30-June 1, 2012, pp. 403-407.

Yao, Wei, and Basaran, Cemal, "Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model," Computational Materials Science, vol. 71, pp. 76-88, Apr. 2013.

Yao, Wei, and Basaran, Cemal, "Skin Effect and Material Degradation of Lead-free Solder Joint under AC," 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 408-412.

Yao, Xin, Ming, Xuefei, Cao, Yuyuan, Zeng, Yanping, Ji, Yong, Gao, Nayan, and Zhou, Xiufeng, "Effects of Ga addition on microstructure and properties of Sn-0.3Ag-0.7Cu solder," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 249-252.

Yao, Yao, He, Xu, Keer, Leon M., and Fine, Morris E., "A continuum damage mechanics-based unified creep and plasticity model for solder materials," Acta Materialia, vol. 83, pp. 160-168, Jan. 15, 2015.

Yao, Yao, Wang, Yuexing, Keer, Leon M., and Fine, Morris E., "An analytical method to predict electromigration-induced finger-shaped void growth in SnAgCu solder interconnect," Scripta Materialia, vol. 95, pp. 7-10, Jan. 15, 2015.

Yao, Yao, Li, Xiao, and He, Xu, "Effect of deep cryogenic treatment on mechanical properties and microstructure of Sn3.0Ag0.5Cu solder," Journal of Materials Science: Materials in Electronics, vol. 29 no. 6, pp. 4517-4525, Mar. 2018.

Yao, Yao, Jian, Zhou, Feng, Xue, and Xu, Chen, "Effect of Magnetic Particles on the Microstructure and Wettability of Sn-Zn Lead-free Solders," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 1165-1168.

Yao, Yao, Vaynman, Semyon, Keer, Leon M., and Fine, Morris E., "Energy-Based Micromechanics Analysis on Fatigue Crack Propagation Behavior in Sn-Ag Eutectic Solder," Journal of Electronic Materials, vol. 37 no. 3, pp. 339-346, Mar. 2008.

Yao, Yao, Fiedler, Brent A., Keer, Leon M., and Fine, Morris E., "Fatigue Crack Propagation Behavior of Sn-Ag-Cu Solder Interconnects," IEEE Transactions on Components and Packaging Technologies, vol. 32 no. 2, pp. 317-324, June 2009.

Yao, Yao, Zhou, Jian, Xue, Feng, and Chen, Xu, "Interfacial structure and growth kinetics of intermetallic compounds between Sn-3.5Ag solder and Al substrate during solder process," Journal of Alloys and Compounds, vol. 682, pp. 627-633, Oct. 15, 2016.

Yao, Yao, Keer, Leon M., and Fine, Morris E., "Modeling the failure of intermetallic/solder interfaces," Intermetallics, vol. 18 no. 8, pp. 1603-1611, Aug. 2010.

Yao, Yao, Fry, Jared, Fine, Morris E., and Keer, Leon M., "The Wiedemann-Franz-Lorenz relation for lead-free solder and intermetallic materials," Acta Materialia, vol. 61 no. 5, pp. 1525-1536, Mar. 2013.

Yao, Yao, and Yu, Xuemei, "Thermal cycling aging effects on the tensile property and constitute behavior of Sn-3.0Ag-0.5Cu solder alloy," Journal of Materials Science: Materials in Electronics, vol. 30 no. 1, pp. 867-875, Jan. 2019.

Yao, Yin, and Chen, Shaohua, "Surface effect in the bending of nanowires," Mechanics of Materials . vol. 100, pp. 12-21, Sept. 2016.

Yao, Z. T., Yuan, W. Y., Xie, Z. M., and Tang, J. H., "Non-metallic Materials from Waste Printed Circuit Boards (PCBs): Characteristics, Environmental risk and Recycling," Applied Mechanics and Materials, vol. 768, pp. 576-587, June 2015.

Yao, Z. X., Yin, L. M., Lu, Y. H., gang, W., Chen, Z. G., and Yao, Z. X., "Acceleration of the growth of tin whisker by thermal aging and external tension," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1096-1099.

Yao, Z. X., Yin, L. M., Zhang, L. P., Zhou, J., and Yao, Z. X., "The effect of coating thickness and external force on the growth of tin whisker," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1100-1103.

Yao, Z. X., Yin, L. M., Wang, G., Tian, X. K., and Yao, Z. Y., "The effect of current stressing and external loading on the growth of tin whiskers," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 734-736.

Yao, Zhonghua, Lu, Yen-wen, and Kandlikar, Satish G., "Direct growth of copper nanowires on a substrate for boiling applications," IET Micro & Nano Letters, vol. 6 no. 7, pp. 563-566, July 2011.

Yao, Zongxiang, Ling, Diying, Yin, Limeng, Wang, Gang, Zhang, Hehe, and Jiang, Shan, "Effect of Ni content on the creep properties of Cu/Sn-0.3Ag-0.7Cu/Cu solder micro-joints," Journal of Materials Science: Materials in Electronics , vol. 31 no. 7, pp. 5462-5470, Apr. 2020.

Yaofeng, Sun, and Pang, John H. L., "Digital image correlation for solder joint fatigue reliability in microelectronics packages," Microelectronics Reliability, vol. 48 no. 2, pp. 310-318, Feb. 2008.

Yarime, Masaru, "Bringing Forth Sustainability Innovation in the Electronic Industry: The Case of Lead-Free Solders," IEEE International Symposium on Sustainable Systems and Technology, Phoenix, AZ, May 18-20, 2009, pp. xx-xx.

Yassin, A., Reuben, R. L., Saad, G., Beshai, M. H. N., and Habib, S. K., "Effect of annealing and Microstructure on the creep behaviour of an Sn-10 Wt % Sb Alloy," Proceedings of the Institution of Mechanical Engineers - Part L - Journal of Materials: Design & Applications, vol. 213 no. 1, pp, 57-68, July 26, 1999.

Yasuda, Kiyokazu, Kim, Jong-Min, and Fujimoto, Kozo, "Adhesive Joining Process and Joint Property with Low Melting Point Filler," Journal of Electronic Packaging, Transactions of the ASME, vol. 127 no. 1, pp. 12-17, Mar. 2005.

Yasuda, Kiyokazu, "Characterization for Dynamic Micro Wetting of Lead-Free Solder Paste," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 1349-1352.

Yasuda, Kiyokazu, Shohji, Ikuo, and Takemoto, Tadashi, "Estimation of Thermal Fatigue Resistance of Sn-Bi (-Ag) and Sn-Ag-Bi-Cu Lead-Free Solders Using Strain Rate Sensitivity Index," Materials Science Forum, vol. 580-582, pp. 221-224, June 2008.

Yasuda, Kiyokazu, Kim, Jong-Min, Yasuda, Masahiro, and Fujimoto, Kozo, "Formation of a Self-Interconnected Joint using a Low-Melting-Point Alloy Adhesive," Materials Transactions, vol. 45 no. 3, pp. 799-805, Mar. 2004.

Yasuda, Kiyokazu, Ohta, Koushi, and Fujimoto, Kozo, "Influence of Resin Viscosity and Filler Volume on Self-Organized Micro Interconnection," Materials Science Forum, vol. 512, pp. 367-372, 2006.

Yasuda, Kiyokazu, "Self-Assembly Process for Array Interconnects Pattern Using Solder/Polymer Hybrid Materials," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 12, pp. 1895-1900, Dec. 2011.

Yasuda, Kiyokazu, "Self-Replicating Process for Micro Interconnect Array Pattern Using Solder/Polymer Hybrid Materials," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1416-1421.

Yato, Ui-ichi, and Kajihara, Masanori, "Kinetic Features of Reactive Diffusion between Sn-5Au Alloy and Ni at Solid-State Temperatures," Materials Transactions, vol. 47 no. 9, pp. 2277-2284, Sept. 2006.

Yau, Esther W. C., Gong, J. F., Hong, Benny F. W., and Chan, Philip C. H., "A Reliability Comparison of Lead Free and Eutectic Solder for Stencil Printing Based Flip-chip Applications," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 323-330.

Yau, Esther W. C., Hong, Benny F. W., and Chan, Philip C. H., "Evaluation of the Oven Reflow Bonding and Flip Chip Bonder Bonding of Lead Free Sn0.7Cu Solder Bumped Die on Low-cost FR-4 Substrate for Flip-chip Applications," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1856-1861.

Yau, Y-H., Fan, C., Guan, L., Xiao, X., Tam, R., Wengenroth, K., Abys, J., Nagakura, M., Sasaki, T., Kiuchi, S., Kamagai, H., and Toda, A., "Production Experience and Performance Characterization of a Novel Immersion Silver," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S33-01-1-S33-01-8.

Yau, Yung-Herng, Wengenroth, Karl, and Abys, Joseph, "A Study of Planar Microvoiding in Pb-Free Solder Joints," NEPCON Shanghai, Shanghai, China, Apr. 24-27. 2007, pp. xx-xx.

Yau, Yung-Herng, Wang, Xingping, Wang, Cai, Ye, PingPing, Wengenroth, Karl, and Abys, Joseph, "Characterization of Key Coating Properties of Immersion Tin for PWB," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 223-228.

Yau, Yung-Herng, Fan, Chonglun, Xu, Chen, Fiore, Anthony, Wengenroth, Karl, and Abys, Joe, "The Chemistry and Properties of a Newly Developed Immersion Silver Coating for PWB," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S10-4-1-S10-4-8.

Yazawa, M., Koguchi, M., and Hiruma, K., "Heteroepitaxial ultrafine wire-like growth of InAs on GaAs substrates," Applied Physics Letters, vol. 58 no. 10, pp. 1080-1082, Mar. 11, 1991.

Yazawa, M., Haraguchi, K., Koguchi, M., Katsuyama, T., Hiruma, K., and Ohta, H., "Nanocolumns composed of GaAs-InAs jointed whiskers and SiO2 covers," Applied Physics Letters, vol. 65 no. 9, pp. 1157-1158, Aug. 29, 1994.

Yazdanpanah, Mehdi M., Harfenist, Steven A., Safir, Abdelilah, and Cohn, Robert W., "Selective self-assembly at room temperature of individual freestanding Ag2Ga alloy nanoneedles," Journal of Applied Physics, vol. 98, pp. 073510-1-073510-7, 2005.

Yazzie, K. E., Williams, J. J., and Chawla, N., "Fracture Behavior of Sn-3.5Ag-0.7Cu and Pure Sn Solders as a Function of Applied Strain Rate," Journal of Electronic Materials, vol. 41 no. 9, pp. 2519-2526, Sept. 2012.

Yazzie, K. E., Fei, H., Williams, J. J., Jiang, H., and Chawla, N., "Mechanical Shock Behavior of Bulk Pure Sn Solder," Journal of Electronic Materials, vol. 38 no. 12, pp. 2746-2755, Dec. 2009.

Yazzie, K. E., Xie, H. X., Williams, J. J., and Chawla, N., "On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints," Scripta Materialia , vol. 66 no. 8, pp. 586-589, Apr. 2012.

Yazzie, K. E., Fei, H. E., Jiang, H., and Chawla, N., "Rate-dependent behavior of Sn alloy-Cu couples: Effects of microstructure and composition on mechanical shock resistance," Acta Materialia, vol. xx no. x, pp. xx-xx, xxxx.

Yazzie, Kyle E., Topliff, Jonathan, and Chawla, Nikhilesh, "On the Asymmetric Growth Behavior of Intermetallic Compound Layers During Extended Reflow of Sn-Rich Alloy on Cu," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 43 no. 10, pp. 3442-3446, Oct. 2012.

Ye, Dan, Du, Chengchao, Wu, Mingfang, and Lai, Zhongmin, "Microstructure and mechanical properties of Sn-xBi solder alloy," Journal of Materials Science: Materials in Electronics, vol. 26 no. 6, pp. 3629-3637, June 2015.

Ye, Gangfeng, Crimp, Martin A., and Nogami, Jun, "Phase transformation in self-assembled Gd silicide nanostructures on Si(001)," Journal of Materials Research, vol. 26 no. 17, pp. 2276-2281, Sept. 14, 2011.

Ye, Hua, Basaran, Cemal, and Hopkins, Douglas C., "Deformation of solder joint under current stressing and numerical simulation -- I," International Journal of Solids & Structures, vol. 41 no. 18-19, pp. 4939-4958, Sept. 2004.

Ye, Hua, Basaran, Cemal, and Hopkins, Douglas C., "Deformation of solder joint under current stressing and numerical simulation -- II," International Journal of Solids & Structures, vol. 41 no. 18-19, pp. 4959-4973, Sept. 2004.

Ye, Hua, Hopkins, Douglas C., and Basaran, Cemal, "Measurement of High Electrical Current Density Effects in Solder Joints," Advancing Microelectronics, vol. 30 no. 5, pp. 13-16, Sept.-Oct. 2003.

Ye, Hua, Basaran, Cemal, Hopkins, Douglas C., and Lin, Minghui, "Modeling Deformation in Microelectronics BGA Solder Joints Under High Current Density, Part I: Simulation and Testing," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 2, Orlando, FL, May 31-June 3, 2005, pp. 1437-1444.

Ye, Huan, Xue, Songbai, and Pecht, Michael, "Effects of thermal cycling on rare earth (Pr)-induced Sn whisker/hillock growth," Materials Letters, vol. 98, pp. 78-81, May 1, 2013.

Ye, Huan, Xue, Songbai, and Pecht, Michael, "Evaluation of the microstructure and whisker growth in Sn-Zn-Ga solder with Pr content," Journal of Materials Research, vol. 27 no. 14, pp. 1887-1894, July 28, 2012.

Ye, Huan, Xue, Songbai, Chen, Cheng, and Li, Yang, "Growth behaviors of tin whisker in RE-doped Sn-Zn-Ga solder," Soldering & Surface Mount Technology, vol. 25 no. 3, pp. 139-144, 2013.

Ye, Huan, Xue, Songbai, Zhang, Liang, Xiao, Zhengxiang, Hu, Yuhua, Lai, Zhongmin, and Zhu, Hong, "Sn whisker growth in Sn-9Zn-0.5Ga-0.7Pr lead-free solder," Journal of Alloys and Compounds, vol. 509 no. 5, pp. L52-L55, Feb. 3, 2011.

Ye, Jianhai, Bao, Shengxiang, Ma, Lili, and Lv, Dechun, "Failure Analysis of Halide of Epoxy Molding Compound Used for Electronic Packing," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 759-762.

Ye, L. L., Lai, Z. H., Liu, J., and Tholen, A., "Conductive Adhesive Development Concept using a Bimodal Distribution of Ag-particles," 1999 International Symposium on Advanced Packaging Materials, Braselton, GA, Mar. 14-17, 1999, pp. 1.

Ye, L., Lai, Z. H., Liu, J., and Tholen, A., "Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free solders," Soldering & Surface Mount Technology, vol. 13 no. 3, pp. 16-20, 2001.

Ye, Lilei, Lai, Zonghe, Liu, Johan, and Tholen, Anders, "Effect of Ag Particle Size on Electrical Conductivity of Isotropically Conductive Adhesives," IEEE Transactions on Electronics Packaging Manufacturing, vol. 22 no. 4, pp. 299-302, Oct. 1999.

Ye, Li-Lei, Lai, Zonghe, Liu, Johan, and Tholen, Anders, "Microstructural Coarsening of Lead Free Solder Joints During Thermal Cycling," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 134-137.

Ye, Lilei, Lai, Zonghe, Liu, Johan, and Tholen, Anders, "Recent Achievement in Microstructure Investigation of Sn0.5Cu3.4Ag Lead-free Alloy by Adding Boron," Proceedings International Symposium on Advanced Packaging Materials, Processes, Properties and Interfaces, Braselton, GA, Mar. 14-17, 1999, pp. 262-267.

Ye, Lin, Cai, Qi, Xu, Baojian, Di, Zengfeng, Zhang, Miao, and Yang, Jianhong, "High sensitivity biosensors based on germanium nanowires fabricated by Ge condensation technique," Materials Letters, vol. 172, pp. 142-145, June 1, 2016.

Ye, Shengrong, Rathmell, Aaron R., Chen, Zuofeng, Stewart, Ian E., and Wiley, Benjamin J., "Metal Nanowire Networks: The Next Generation of Transparent Conductors," Advanced Materials, vol. 26 no. 39, pp. 6670-6687, Oct. 22, 2014.

Ye, Song, Huang, Mingliang, Chen, Leida, and Liu, Xiaoying, "Electromigration of 300 um diameter Sn-3.0Ag-0.5Cu Lead-Free Bumps in Flip Chip Package," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 1132-1137.

Ye, Song, Huang, Mingliang, Chen, Leida, and Zhou, Shaoming, "Failure mechanisms of Ni/Sn3.0Ag0.5Cu/OSP flip chip solder under high current stressing," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 584-588.

Ye, Wei, Ougazzaden, Abdallah, and Cherkaoui, Mohammed, "Analytical formulations of image forces on dislocations with surface stress in nanowires and nanorods," International Journal of Solids & Structures, vol. 50 no. 25-26, pp. 4341-4348, Dec. 2013.

Yeates, Harry, "Electronics waste directive formally introduced," electronicsweekly.com, Feb. 13, 2003.

Yeates, Harry, "EU member states to adopt waste directives," electronicsweekly.com , Feb. 19, 2003.

Yeates, Harry, "Industry group calls for UK WEEE centre," Electronics Weekly , June 6, 2006.

Yeates, Harry, "Industry welcomes move to postpone WEEE," Electronics Weekly , Aug. 19, 2005.

Yeates, Harry, "U.K. Welcomes Move to Postpone WEEE," Electronic News, Aug. 19, 2005.

Yee, Dennis K. W., "Is Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG) the Solution of Lead Free Soldering on PCB and IC Packaging Applications?," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 208-218.

Yee, Dennis K. W., "New Final Finish Candidate for IC packages," Circuitree, vol. 20 no. 1, pp. 10-11, Jan. 2007.

Yee, Shelgon, and Ladhar, Harjinder, "Reliability compatison of different surface finishes on copper," Circuit World, vol. 25 no. 1, pp. 25-29, 1998.

Yee, Shelgon, Chen, Lodgers, Zeng, Justin, and Jay, Roger, "Ternary Intermetallic Compound - A Real Threat to BGA Solder Joint Reliability," 2004 Pan Pacific Symposium Conference Proceedings, Kahuku, Oahu, Hawaii, Feb. 10-12, 2004, pp. xx-xx.

Yee, Shelgon, Chen, Lodgers, Zeng, Justin, and Jay, Roger, "Ternary Intermetallic Compound - A Real Threat to BGA Solder Joint Reliability," Journal of SMT, vol. 17 no. 2, pp. 29-36, Apr. 2004.

Yeh, C.-H., Chang L.-S., and Straumal, B., "Study on the Solidus Line in Sn-Rich Region of Sn-In Phase Diagram," Journal of Phase Equilibria and Diffusion, vol. xx no. x, pp. xx-xx, xxxx.

Yeh, C.-H., Chang, L.-S., and Straumal, B., "The Grain Boundary Wetting in the Sn- 25 at% In Alloys," Defect and Diffusion Forum, vol. 258-260, pp. 491-496, Oct. 2006.

Yeh, C.-H., Chang, L.-S., and Straumal, B. B., "Wetting transition of grain boundaries in the Sn-rich part of the Sn-Bi phase diagram," Journal of Materials Science, vol. 46 no. 5, pp. 1557-1562, Mar. 2011.

Yeh, Chang-Lin, and Lai, Yi-Shao, "Effects of Solder Alloy Constitutive Relationships on Impact Force Responses of Package-level Solder Joints Under Ball Impact Test," Journal of Electronic Materials, vol. 35 no. 10, pp. 1892-1901, Oct. 2006.

Yeh, Chang-Lin, Lai, Yi-Shao, Chang, Hsiao-Chuan, and Chen, Tsan-Hsien, "Empirical correlation between package-level ball impact test and board-level drop reliability," Microelectronics Reliability, vol. 47 no. 7, pp. 1127-1134, July 2007.

Yeh, Chang-Lin, Lai, Yi-Shao, and Kao, Chin-Li, "Evaluation of board-level reliability of electronic packages under consecutive drops," Microelectronics Reliability, vol. 46 no. xx, pp. 1172-1182, 2006.

Yeh, Chang-Lin, and Lai, Yi-Shao, "Impact Force Characteristics of Package-level Solder Joints Under Ball Impact Test," 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Como, Italy, Apr. 24-26, 2006, pp. xx-xx.

Yeh, Chang-Lin, and Lai, Yi-Shao, "Insights Into Correlation Between Board-Level Drop Reliability and Package-Level Ball Impact Test Characteristics," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 1, pp. 84-91, Jan. 2007.

Yeh, Chang-Lin, and Lai, Yi-Shao, "Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops," Microelectronics Reliability , vol. 48 no. 2, pp. 282-292, Feb. 2008.

Yeh, Chang-Lin, and Lai, Yi-Shao, "Transient fracturing of solder joints subjected to displacement-controlled impact loads," Microelectronics Reliability, vol. 46 no. 5-6, pp. 885-895, May-June 2006.

Yeh, Chien-Hsuan, Chang, Li-Shin, and Straumal, Boris, "Wetting Transition of Grain Boundaries in Tin-Rich Indium-Based Alloys and Its Influence on Electrical Properties," Materials Transactions, vol. 51 no. 9, pp. 1677-1682, 2010.

Yeh, D. C., and Huntington, H. B., "Extreme Fast-Diffusion System: Nickel in Single-Crystal Tin," Physical Review Letters, vol. 53 no. 15, pp. 1469-1472, Oct. 8, 1984.

Yeh, Everett C. C., Choi, W. J., Tu, K. N., Elenius, Peter, and Balkan, Haluk, "Current-crowding-induced electromigration failure in flip chip solder joints," Applied Physics Letters, vol. 80 no. 4, pp. 580-582, Jan. 28, 2002.

Yeh, Kuo Yu, Lin, Chang Chih, and Hsu, Shou Chian, "The Investigation of the Performance of Bondability and Solderability on Various Substrate Surface Finishes," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Yeh, M. S., "Evaluation of the Mechanical Properties of a Ternary Sn-20In-2.8Ag Solder," Journal of Electronic Materials, vol. 31 no. 9, pp. 953-956, Sept. 2002.

Yeh, M. S., and Chiang, J. T., "Mechanical Properties of Ternary Sn-In-Ag Ball-Grid Array Assemblies at Ambient and Elevated Temperatures," Journal of Materials Engineering and Performance, vol. 18 no. 8, pp. 1073-1077, Nov. 2009.

Yeh, M. S., and Chiang, J. T., "Tensile Test Behavior of the Eutectic Sn-Ag Solder Joint in Ball Grid Array Assemblies," Metallurgical and Materials Transactions A, vol. 35 no. 12, pp. 3817-3821, Dec. 2004.

Yeh, Min-Chi, Li, Jyun Lin, Lo, Pei Jen, Yu, Rick, Yu, Cheng-Fu, and Hsieh, Ker-Chang, "Corrosion behavior of pure tin deposit under 55 °C/85 % RH reliability test," Journal of Materials Science: Materials in Electronics, vol. 25 no. 1, pp. 317-322, Jan. 2014.

Yeh, Po-Yi, Song, Jenn-Ming, and Lin, Kwang-Lung, "Dissolution Behavior of Cu and Ag Substrates in Molten Solders," Journal of Electronic Materials, vol. 35 no. 5, pp. 978-987, May 2006.

Yeh, Shing, "The Effects of Copper Content on the Reliability of Sn-Ag Based Bump Alloys in Flip Chip Applications," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Yeh, T. K., Lin, K. L., and Mohanty, U. S., "Effect of Ag on the Microstructure of Sn-8.5Zn-xAg-0.01Al-0.1Ga Solders Under High-Temperature and High-Humidity Conditions," Journal of Electronic Materials, vol. 42 no. 4, pp. 616-627, Apr. 2013.

Yeh, T. K., Lin, K. L., and Salam, B., "Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga solders," Soldering & Surface Mount Technology, vol. 21 no. 4, pp. 19-23, 2009.

Yeh, Tung-Chin, Tsai, Tsung-Fu, Lin, Larry, Hsieh, Roger, and Wu, Kenneth, "Electromigration of SnAg Bump with Ni UBM on Various Substrate Pad Finishes with SnCu Presolder," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 1293-1298.

Yelton, Graham, Susan, Don, Michael, Joseph, and Shore, Daniel, "Understanding and Predicting Metallic Whisker Growth as a Function of Electrodeposited Morphology," 217th ECS Meeting, Vancouver, British Columbia, Canada, Apr. 25-30, 2010, pp. xx-xx. (Sandia Report SAND2010-2517C)

Yen, Andrew C., Hongyu, Zheng, Wynn, Richard Thet, Yaohui, Zhang, and Wang, Lingfai, "A Method of Investigating Fine Shorting Whiskers Within a Leadframe Molded Package," IEEE Transactions on Advanced Packaging, vol. 24 no. 1, pp. 99-103, Feb. 2001.

Yen, Larry, "Best Practices for REACH Compliance Management for Electronics OEMs," Green SupplyLine.

Yen, Larry, "Risk Management of RoHS/REACH SVHC: Green Compliance for Electronics OEMs," Mar. 2011.

Yen, Larry, "RoHS Material Declaration - A Real Life Implementation," 2006 IEEE Symposium on Product Safety & Compliance Engineering, Irvine, CA, Oct. 23-24, 2006, pp. xx-xx.

Yen, Ming-Yu, Chiu, Ching-Wen, Hsia, Chih-Hao, Chen, Fu-Rong, Kai, Ji-Jung, Lee, Chi-Young, and Chiu, Hsin-Tien, "Synthesis of Cable-Like Copper Nanowires," Advanced Materials, vol. 15 no. 3, pp. 235-237, Feb. 2003.

Yen, Yee-Wen, Hsiao, Hsien-Ming, Shao, Pei-Sheng, and Chang, Yen Wei, "A Novel Electronic Packaging Method to Replace High-Temperature Sn-Pb Solders," Journal of Electronic Materials, vol. 44 no. 10, pp. 3914-3919, Oct. 2015.

Yen, Yee-Wen, and Lee, Chun-Yu, "ACF particle distribution in COG process," Microelectronics Reliability , vol. 51 no. 3, pp. 676-684, Mar. 2011.

Yen, Yee-wen, Liou, Wei-kai, Chen, Wan-ching, and Chiu, Chao-wei, "Aging and Cu concentration effects on Sn-Zn-xCu/Au couples," Journal of Alloys and Compounds, vol. 574, pp. 490-494, Oct. 15, 2013.

Yen, Yee-Wen, Tseng, H. W., Zeng, K., Wang, S. J., and Liu, C. Y., "Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions," Journal of Electronic Materials, vol. 38 no. 11, pp. 2257-2263, Nov. 2009.

Yen, Yee-Wen, Kuo, Meng-Han, Liou, Wei-Kai, and Chu, Tai-Ni, "Dissolution Behaviors of the Ni and Ni3Sn4 phase in Molten Lead-free Solders," 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 24-26, 2012, pp. 392-395.

Yen, Yee-wen, and Liou, Wei-kai, "Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free Solder and Ni substrate," Journal of Materials Research, vol. 22 no. 10, pp. 2663-2667, Oct. 2007.

Yen, Yee-Wen, Jao, Chien-Chung, and Lee, Chiapyng, "Effect of Cu addition on interfacial reaction between Sn-9Zn solder and Ag," Journal of Materials Research, vol. 21 no. 12, pp. 2986-2990, Dec. 2006.

Yen, Yee-Wen, Chou, Weng-Ting, Chen, Hong-Chih, Liou, Wei-Kai, and Lee, Chiapyng, "Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints," International Journal of Materials Research, vol. 99 no. 11, pp. 1256-1261, Nov. 2008.

Yen, Yee-Wen, Chiang, Yu-Cheng, Jao, Chien-Chung, Liaw, Da-Wei, Lo, Shao-cheng, and Lee, Chiapyng, "Interfacial reactions and mechanical properties between Sn-4.0Ag-0.5Cu and Sn-4.0Ag-0.5Cu-0.05Ni-0.01Ge lead-free solders with the Au/Ni/Cu substrate," Journal of Alloys and Compounds, vol. 509 no. 13, pp. 4595-4602, Mar. 31, 2011.

Yen, Yee-Wen, Chen, Pei-Yu, and Chen, Guan-Da, "Interfacial Reactions between Lead-free solders and Cu-40Zn Alloys," 2017 International Conference on Electronics Packaging, Yamagata, Japan, Apr. 19-22, 2017, pp. 549-550.

Yen, Yee-Wen, Hsiao, Hsien-Ming, Chen, Kuo-Jung, Lin, Yi-Show, and Lai, Mei-Ting, "Interfacial Reactions Between Lead-Free Solders and Ni-Pd-Co Alloys," JOM, vol. 71 no. 9, pp. 3031-3040, Sept. 2019.

Yen, Yee-Wen, Lee, Chun-Yu, Kuo, Meng-Han, Chao, Kuo-Sing, and Chen, Kuen-Da, "Interfacial reactions between lead-free solders and the multilayer Au/Ni/SUS304 substrate," International Journal of Materials Research , vol. 100 no. 5, pp. 672-676, May 2009.

Yen, Yee-Wen, Liou, Wei-Kai, Wei, Hong-Yao, and Lee, Chiapyng, "Interfacial Reactions Between Pb-Free Solders and In/Ni/Cu Multilayer Substrates," Journal of Electronic Materials, vol. 38 no. 1, pp. 93-99, Jan. 2009.

Yen, Yee-Wen, Hsiao, Hsien-Ming, Lo, Shao-Cheng, and Fu, Shu-Mei, "Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO2 laser and hot-air methods," International Journal of Materials Research, vol. 104 no. 7, pp. 637-642, 2013.

Yen, Yee-wen, Lin, Ming-chih, Lin, Cheng-kuan, and Chen, Wan-Ching, "Interfacial Reactions Between Sn-Zn Alloys and Au Substrate." Journal of Electronic Materials, vol. 41 no. 12, pp. 3284-3291, Dec. 2012.

Yen, Yee-Wen, Hsiao, Hsien-Ming, Lin, Shih-Wei, Huang, Pin-Ju, and Lee, Chiapyng, "Interfacial Reactions in Sn/Fe-xNi Couples," Journal of Electronic Materials, vol. 41 no. 1, pp. 144-152, Jan. 2012.

Yen, Yee-Wen, Chiu, Chao-Wei, Chen, Chih-Ming, Lai, Mei-Ting, and Dai, Jia-Ying, "Interfacial Reactions in Sn/Ni-xW Couples," Journal of Electronic Materials, vol. 44 no. 3, pp. 909-915, Mar. 2015.

Yen, Yee-Wen, Lin, Chung-Yung, Lai, Mei-Ting, and Chen, Wan-Ching, "Interfacial Reactions in the Ni/Sn-xZn/Cu Sandwich Couples," Journal of Electronic Materials, vol. 45 no. 1, pp. 203-211, Jan. 2016.

Yen, Yee-wen, Tsai, Po-hao, Fang, Yang-kai, Chen, Bo-jyun, and Lee, Chiapyng, "Interfacial reactions of Pb-free solders with Au/Pd/Ni/brass multilayer substrates," Journal of Alloys and Compounds, vol. 516, pp. 111-117, Mar. 5, 2012.

Yen, Yee-Wen, Syu, Ruo-Syun, Chen, Chih-Ming, Jao, Chien-Chung, and Chen, Guan-Da, "Interfacial reactions of Sn-58Bi and Sn-0.7Cu lead-free solders with Alloy 42 substrate," Microelectronics Reliability, vol. 54 no. 1, pp. 233-238, Jan. 2014.

Yen, Yee-Wen, Hsieh, Yu-Ping, Jao, Chien-Chung, Chiu, Chao-Wei, and Li, Yi-Shan, "Interfacial Reactions of Sn, Sn-3.0Ag-0.5Cu, and Sn-9Zn Lead-Free Solders with Fe-42Ni Substrates," Journal of Electronic Materials, vol. 43 no. 1, pp. 187-194, Jan. 2014.

Yen, Yee-Wen, Liaw, Da-Wei, Chen, Kuen-Da, and Chen, Hao, "Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate," Journal of Electronic Materials , vol. 39 no. 11, pp. 2412-2417, Nov. 2010.

Yen, Yee-wen, Tsai, Po-hao, Fang, Yang-kai, Lo, Shao-cheng, Hsieh, Yu-Ping, and Lee, Chiapyng, "Interfacial reactions on Pb-free solders with Au/Pd/Ni/Cu multilayer substrates," Journal of Alloys and Compounds, vol. 503 no. 1, pp. 25-30, July 30, 2010.

Yen, Yee-Wen, Chou, Weng-Ting, Tseng, Yu, Lee, Chiapyng, and Hsu, Chun-Lei, "Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders," Journal of Electronic Materials, vol. 37 no. 1, pp. 73-83, Jan. 2008.

Yen, Yee-Wen, Liou, Wei-kai, and Jao, Chien-Chung, "Investigation of Interfacial Reactions and Sn Whisker Formation in the Matte Sn Layer With NiP/Ni/Cu and Ni/Cu Multilayer Systems," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 6, pp. 951-956, June 2011.

Yen, Yee-Wen, Chen, Bo-Jyun, and Li, Yi-Shan, "Investigation of Interfacial Reactions in the Sn/Fe-xNi Couple," 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 22-25, 2013, pp. 260-262.

Yen, Yee-Wen, Jao, Chien-Chung, Hsiao, Hsien-Ming, Lin, Chung-Yung, and Lee, Chiapyng, "Investigation of the Phase Equilibria of Sn-Cu-Au Ternary and Ag-Sn-Cu-Au Quaternary Systems and Interfacial Reactions in Sn-Cu/Au Couples," Journal of Electronic Materials, vol. 36 no. 2, pp. 147-158, Feb. 2007.

Yen, Yee-wen, and Chen, Sinn-wen, "Phase equilibria of the Ag-Sn-Cu ternary system," Journal of Materials Research, vol. 19 no. 8, pp. 2298-2305, Aug. 2004.

Yen, Yee-Wen, Hsiao, Hsien-Ming, Jhang, Gu-Jhong, Shi, Han-Wei, and Huang, Meng-Kuang, "Phase equilibria of the Sn-Bi-Cu ternary system in advanced microelectronic packaging," 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 24-26, 2012, pp. 388-391.

Yen, Yee-wen, Yu, William, Wang, Chu-hsuan, Chen, Chih-ming, Li, Yu-chun, Chen, Pei-yu, and Chen, Guan-da, "Study of Interfacial Reactions Between Lead-Free Solders and Cu-xZn Alloys," Journal of Electronic Materials, vol. 48 no. 1, pp. 170-181, Jan. 2019.

Yen, Yee-Wen, Li, Chao-Kang, Tsou, Meng-Yu, and Shao, Pei-Sheng, "Substrate Shape Effect on the Sn Whisker Growth in the Electroplating Matte Sn System," Japanese Journal of Applied Physics, vol. 50 no. 1S2, pp. 01BJ07-1-01BJ07-4, Jan. 2011.

Yender, George L., "Battery Recycling Technology & Collection Processes," 1998 IEEE International Symposium on Electronics and the Environment, Oak Brook, IL, May 4-6, 1998, pp. 30-35.

Yeo, Alfred, Lim, Sharon, and Min, Tan Ai, "Assessment of Au Stud-Solder Interconnection for Fine Pitch Flip Chip Packaging," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 319-324.

Yeo, Alfred, Lam, Wong Foo, and Lee, Charles, "Development of Novel Joint Resistance Modeling Technique for Flip Chip Interconnection Systems," 31st International Conference on Electronics Manufacturing and Technology, Kuala Lumpur, Malasia, Nov. 8-10, 2007, pp. 115-119.

Yeo, Yen Chen, Huang, Mark, Che, Fa Xing, Chong, Ser Choong, Lim, Keith Cheng Sing, Thew, Serene, Vasarla, Nagendra Sekhar, and Gao, Shan, "Solder Joint Encapsulation and Reliability using Dippable Underfill," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 710-714.

Yetz, Neal, "Lead Free and Supply Chain Obsolescence: an Industry Overview," IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies, Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.

Yeung, N. H., Chan, Y. C., and Tan, C. W., "Effect of Bonding Force on the Conducting Particle With Different Sizes," Journal of Electronic Packaging, Transactions of the ASME, vol. 125 no. 4, pp. 624-629, Dec. 2003.

Yeung, N. H., Chan, Y. C., Tan, S. C., Lee, K. K., and Chan, K. K., "Effect of Void in the Anisotropic Conductive Assembly," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1378-1382.

Yeung, N. H., Wu, C. M. L., and Lai, J. K. L., "Thermal Cycling Analysis of TAB OLB Connection with ACF," Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, Sept. 28-30, 1998, pp. 206-210.

Yeung, Tak-Sang, Sze, Henry, Tan, Keith, Sandhu, Javed, Neo, Chong-Wei, and Law, Edward, "Material Characterization of a Novel Lead-Free Solder Material - SACQ," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 518-522.

Yew, Ming-Chih, Chiu, Chien-Chia, Chang, Shu-Ming, and Chiang, Kuo-Ning, "A novel crack and delamination protection mechanism for a WLCSP using soft joint technology," Soldering & Surface Mount Technology, vol. 18 no. 3, pp. 3-13, 2006.

Yew, Ming-Chih, Tsai, Mars, Hu, Dyi-Chung, Yang, Wen-Kun, and Chiang, Kuo-Ning, "Reliability analysis of a novel fan-out type WLP," Soldering & Surface Mount Technology, vol. 21 no. 3, pp. 30-38, 2009.

Ye-xiang, Ning, kai-lin, Pan, and Ni, Li, "Simulation and Analysis for Backward Compatibility of Solder Joints under Thermal Cycle," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Yi, Jaeseok, Lee, Dong Hyun, and Park, Won Il, "Site-Specific Design of Cone-Shaped Si Nanowires by Exploiting Nanoscale Surface Diffusion for Optimal Photoabsorption," Chemistry of Materials , vol. 23 no. 17, pp. 3902-3906, Sept. 13, 2011.

Yi, Pan, Dong, Chaofang, Ji, Yucheng, Yin, Yupeng, Yao, Jizheng, and Xiao, Kui, "Electrochemical migration failure mechanism and dendrite composition characteristics of Sn96.5Ag3.0Cu0.5 alloy in thin electrolyte films," Journal of Materials Science: Materials in Electronics, vol. 30 no. 7, pp. 6575-6582, Apr. 2019.

Yi, Sammy, Geiger, David, Wang, Mei, Singh, Harpuneet, Lee, Alan, and Wong, Harris, "A Case Study of Lead-free Assembly Implementation in EMS Environment," 2000 Lead Free Symposium Conference Proceedings, 2000, pp. xx-xx.

Yi, Sung, and Jones, Robert, "Machine learning framework for predicting reliability of solder joints," Soldering & Surface Mount Technology, vol. 32 no. 2, pp. 82-92, 2020.

Yi, W., MoberlyChan, W., Narayanamurti, V., Hu, Y. F., Li, Q., Kaya, I., Burns, M., and Chen, D. M., "Characterization of spinel iron-oxide nanocrystals grown on Fe whiskers," Journal of Applied Physics, vol. 95 no. 11, pp. 7136-7138, June 1, 2004.

Yi, Xiong, Yi, Guangbin, Hu, Xiaowu, Li, Qinglin, and Zhang, Ruhua, "Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints," Journal of Materials Science: Materials in Electronics, vol. 30 no. 24, pp. 21126-21137, Dec. 2019.

Yim, Byung-Seung, Lee, Jeong Il, Lee, Byung Hun, Shin, Young-Eui, and Kim. Jong-Min, "An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler," Microelectronics Reliability, vol. xx no. x, pp. xx-xx, xxxx.

Yim, Byung-Seung, Shin, Young-Eui, and Kim, Jong-Min, "Ball Grid Array Interconnection Properties of Solderable Polymer-Solder Composites With Low-Melting-Point Alloy Fillers," Journal of Electronic Packaging, vol. 139 no. 4, pp. 041007-1-041007-9, Dec. 2017.

Yim, Byung-Seung, Oh, Seung-Hoon, Kim, Jiwon, Kim, Jooheon, and Kim, Jong-Min, "Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)," Materials Transactions, vol. 53 no. 3, pp. 578-581, 2012.

Yim, Byung-Seung, and Kim, Jong-Min, "Characteristics of Isotropically Conductive Adhesive (ICA) Filled with Carbon Nanotubes (CNTs) and Low-Melting-Point Alloy Fillers," Materials Transactions, vol. 51 no. 12, pp. 2329-2331, 2010.

Yim, Byung-Seung, Kwon, Yumi, Oh, Seung Hoon, Kim, Jooheon, Shin, Yong-Eui, Lee, Seong Hyuk, and Kim, Jong-Min, "Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging," Microelectronics Reliability, vol. 52 no. 6, pp. 1165-1173, June 2012.

Yim, Byung-Seung, Lee, Byung Hun, Kim, Jooheon, and Kim, Jong-Min, "Effect of dispersion condition of multi-walled carbon nanotube (MWNT) on bonding properties of solderable isotropic conductive adhesives (ICAs)," Journal of Materials Science: Materials in Electronics, vol. 25 no. 12, pp. 5208-5217, Dec. 2014.

Yim, Byung-Seung, and Kim, Jong-Min, "Effect of multi-walled carbon nanotube (MWCNT) concentration on thermomechanical reliability of MWCNT-reinforced solderable isotropic polymer nanocomposites," Journal of Materials Science: Materials in Electronics , vol. 27 no. 9, pp. 9159-9171, Sept. 2016.

Yim, Byung-Seung, and Kim, Jong-Min, "Electrical and mechanical properties of multiwalled carbon nanotubes-reinforced solderable polymer nanocomposites," Journal of Materials Science: Materials in Electronics, vol. 26 no. 3, pp. 1678-1689, Mar. 2015.

Yim, Byung-Seung, Kim, Jong-Min, Jeon, Sung-Ho, Lee, Seong Hyuk, Kim, Jooheon, Han, Jung-Geun, and Cho, Minhaeng, "Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers," Materials Transactions , vol. 50 no. 11, pp. 2649-2655, 2009.

Yim, Byung-Seung, Kim, Kiho, Kim, Jooheon, and Kim, Jong-Min, "Influence of functionalized graphene on the electrical, mechanical, and thermal properties of solderable isotropic conductive adhesives," Journal of Materials Science: Materials in Electronics, vol. 27 no. 5, pp. 4516-4525, May 2016.

Yim, Byung-Seung, and Kim, Jong-Min, "Influence of multi-walled carbon nanotube (MWNT) concentration on the interconnection properties of solderable anisotropic conductive adhesives (SACAs)," Journal of Materials Science: Materials in Electronics, vol. 26 no. 7, pp. 4969-4980, July 2015.

Yim, Byung-Seung, Lee, Jeong Il, Heo, Yuseon, Kim, Jooheon, Lee, Seong Hyuk, Shin, Young-Eui, and Kim, Jong-Min, "Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers," Materials Transactions, vol. 53 no. 12, pp. 2104-2110, 2012.

Yim, Heejeong, and Herrmann, Christoph, "Consumer Behavior on Ecoproduct: why consumers do not buy an ecoproduct," Proceedings of EcoDesign2003: Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 8-11, 2003, pp. 771-778.

Yim, M. J., Kim, H.-J., and Paik, K.-W., "Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity for Flip Chip Applications," Journal of Electronic Materials, vol. 34 no. 8, pp. 1165-1171, Aug. 2005.

Yim, Myung J., Paik, Kyung W., Kim, Yang K., and Hwang, Hee N., "A Study on the Electrical Conduction Mechanism of Anisotropically Conductive Film (ACF) for LCD Packaging Applications ," Advances in Electronic Packaging 1997, Volume 1, Kohala Coast, Hawaii, June 15-19, 1997, pp. 65-72.

Yim, Myung-Jin, Hwang, Jin-Sang, Kim, Jin-Gu, Kim, Hyoung-Joon, Kwon, Woonseong, Jang, Kyung Woon, and Paik, Kyung Wook, "Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity for Flip Chip Applications," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 159-164.

Yim, Myung-Jin, Paik, Kyung-Wook, Kim, Tae-Sung, and Kim, Yang-Kook, "Anisotropic Conductive Film (ACF) Interconnection for Display Packaging Applications," 1998 Proceedings 48th Electronic Components & Technology Conference, Seattle, WA, May 25-28, 1998, pp. 1036-1041.

Yim, Myung Jin, Hwang, Jinsang, and Paik, Kyung Wook, "Anisotropic Conductive Films (ACFs) for Ultra-Fine Pitch Chip-On-Glass (COG) Applications," 2005 IEEE/CPMT 10th International Symposium on Advanced Packaging Materials, Irvine, CA, Mar. 16-18, 2005, pp. 181-186.

Yim, Myung Jin, Hwang, Jinsang, and Paik, Kyung Wook, "Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications," International Journal of Adhesion and Adhesives, vol. 27 no. xx, pp. 77-84, 2007.

Yim, Myung Jin, Kim, Hyoung Joon, Chung, Chang Kyu, and Paik, Kyung Wook, "Degradation Mechanism and Reliability of Flip-Chip Interconnects using Anisotropic Conductive Adhesives for High Current Density Packaging Applications," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 338-343.

Yim, Myung-Jin, and Paik, Kyung-Wook, "Design and Understanding of Anisotropic Conductive Films (ACFs) for LCD Packaging," The First IEEE International Symposium on Polymeric Electronics Packaging, Oct. 26-30, 1997, pp. 233-242.

Yim, Myung-Jin, and Paik, Kyung-Wook, "Design and Understanding of Anisotropic Conductive Films (ACF's) for LCD Packaging," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 21 no. 2, pp. 226-234, June 1998.

Yim, Myung Jin, Chung, Chang-Kyu, and Paik, Kyung Wook, "Effect of Conductive Particle Properties on the Reliability of Anisotropic Conductive Film for Chip-On-Glass (COG) Applications," 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 38.

Yim, Myung Jin, Chung, Chang-Kyu, and Paik, Kyung Wook, "Effect of Conductive Particle Properties on the Reliability of Anisotropic Conductive Film for Chip-on-Glass Applications," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 4, pp. 306-312, Oct. 2007.

Yim, Myung Jin, Kwon, Woonseong, and Paik, Kyung Wook, "Effect of filler content on the dielectric properties of anisotropic conductive adhesives materials for high-frequency flip-chip interconnection," Materials Science and Engineering B: Solid-State Materials for Advanced Technology, vol. 126 no. 1, pp. 59-65, Jan. 15, 2006

Yim, Myung-Jin, and Paik, Kyung-Wook, "Effect of Non-Conducting Filler Additions on Anisotropic Conductive Adhesives (ACAs) Properties and the Reliability of ACAs Flip Chip on Organic Substrates," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 899-905.

Yim, Myung-Jin, and Paik, Kyung-Wook, "Effect of Nonconducting Filler Additions on ACA Properties and the Reliability of ACA Flip-Chip on Organic Substrates," IEEE Transactions on Components and Packaging Technologies, vol. 24 no. 1, pp. 24-32, Mar. 2001.

Yim, Myung-Jin, and Paik, Kyung-Wook, "Effect of Non-Conducting Filler Additions on Anisotropic Conductive Adhesives (ACAs) Properties and the Reliability of ACAs Flip Chip on Organic Substrates," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 899-905.

Yim, Myung-Jin, Jeon, Young-Doo, and Paik, Kyung Wook, "Flip Chip Assembly on Organic Boards Using Anisotropic Conductive Adhesives/Films and Nickel/Gold Bump," Advances in Electronic Packaging 1999, Volume 1 (EEP-Vol. 26-1), Maui, Hawaii, June 13-19, 1999, pp. 367-372.

Yim, Myung-Jin, Jung, In ho, Choi, Hyung-Kyu, Kim, Kijoong, Hwang, Jin-Sang, Ahn, Jin-Yong, Kwon, Woonseong, and Paik, Kyung Wook, "Flip Chip Interconnection using Anisotropic Conductive Adhesives for RF and High Frequency Applications," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1398-1403.

Yim, Myung Jin, Jeong, In Ho, Choi, Hyung-Kyu, Hwang, Jin-Sang, Ahn, Jin-Yong, Kwon, Woonseong, and Paik, Kyung-Wook, "Flip Chip Interconnection with Anisotropic Conductive Adhesives for RF and High-Frequency Applications," IEEE Transactions on Components and Packaging Technologies, vol. 28 no. 4, pp. 789-796, Dec. 2005.

Yim, Myung-Jin, Hwang, Jin-Sang, Kwon, Woon-Seong, Jang, Kyung-Woon, and Paik, Kyung-Wook, "High Reliable Non-Conductive Adhesives for Flip Chip CSP Applications," 2002 Proceedings 52nd Electronic Components & Technology Conference , San Diego, CA, May 28-31, 2002, pp. 1385-1389.

Yim, Myung Jin, Hwang, Jin-Sang, Kim, Jin Gu, Ahn, Jin Yong, Kim, Hyung Joon, Kwon, Woonseong, and Paik, Kyung-Wook, "Highly Reliable Flip-Chip-on-Flex Package Using Multilayered Anisotropic Conductive Film Journal of Electronic Materials, vol. 33 no. 1, pp. 76-82, Jan. 2004.

Yim, Myung-Jin, Ryu, Woonghwan, Jeon, Young-Doe, Lee, Junho, Kim, Joungho, and Paik, Kyung-Wook, "Microwave Model of Anisotropic Conductive Adhesive Flip-Chip Interconnections for High Frequency Applications," 1999 Proceedings 49th Electronic Components & Technology Conference, San Diego, CA, June 1-4, 1999, pp. 488-492.

Yim, Myung-Jin, Ryu, Woonghwan, Jeon, Young-Doo, Lee, Junho, Ahn, Seungyoung, Kim, Joungho, and Paik, Kyung-Wook, "Microwave Model of Anisotropic Conductive Film Flip-Chip Interconnections for High Frequency Applications," IEEE Transactions on Components and Packaging Technologies, vol. 22 no. 4, pp. 575-581, Dec. 1999.

Yim, Myung Jin, and Paik, Kyung-Wook, "Overview of Anisotropic Conductive Adhesives for Flat Panel Displays and Semiconductor Packaging Applications," 2005 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Jan. 25-27, 2005, pp. 313-320.

Yim, Myung Jin, Li, Yi, Moon, Kyoung Sik, and Wong, C. P., "Oxidation Prevention and Electrical Property Enhancements of Copper-filled Electrically Conductive Adhesives for Electronic Packaging and Interconnection," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 82-88.

Yim, Myung Jin, and Paik, Kyung Wook, "Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications," International Journal of Adhesion and Adhesives, vol. 26 no. 5, pp. 304-313, Aug. 2006.

Yim, Myung Jin, Jeon, Young-Doo, and Paik, Kyung-Wook, "Reduced Thermal Strain in Flip Chip Assembly on Organic Substrate using Low CTE Anisotropic Conductive Film," IEEE Transactions on Electronics Packaging Manufacturing, vol. 23 no. 3, pp. 171-176, July 2000.

Yim, Myung Jin, Li, Yi, Moon, Kyoung-sik, Paik, Kyung Wook, and Wong, C. P., "Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging," Journal of Adhesion Science and Technology, vol. 22 no. 14, pp. 1593-1630, 2008.

Yim, Myung-Jin, and Paik, Kyung-Wook, "The Contact Resistance and Reliability of Anisotropically Conductive Film (ACF)," IEEE Transactions on Advanced Packaging, vol. 22 no. 2, pp. 166-173,May 1999.

Yin, C. Y., Lu, H., Musallam, M., Bailey, C., and Johnson, C. M., "A Physics-of-failure based Prognostic Method for Power Modules," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1190-1195.

Yin, C. Y., Lu, H., Bailey, C., and Chan, Y. C., "Analyzing the Performance of Flexible Substrates for Lead-Free Applications," 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Como, Italy, Apr. 24-26, 2006, pp. xx-xx.

Yin, C. Y., Lu, H., Bailey, C., and Chan, Y. C., "Effects of Reflow Process on the Reliability of Flip Chip on Flex Interconnections using Anisotropic Conductive Adhesives," Proceedings of 2004 International IEEE Conference on the Asian Green Electronics, Hong Kong, China, Jan 5-9, 2004, pp. 240-245.

Yin, C. Y., Lu, H., Bailey, C., and Chan, Y. C., "Experimental and Modeling Analysis of the Reliability of the Anisotropic Conductive Films," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 698-702.

Yin, C. Y., Lu, H., Bailey, C., and Chan, Y. C., "Experimental and Modeling Analysis on Moisture Induced Failures in Flip Chip on Flex Interconnections with Anisotropic Conductive Film," Proceedings of 2005 International Conference on Asian Green Electronics , Shang Hai, China, Mar. 15-18, 2005, pp. 172-177.

Yin, C. Y., Lu, H., Bailey, C., and Chan, Y. C., "Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly," Soldering & Surface Mount Technology, vol. 18 no. 2, pp. 27-32, 2006.

Yin, C. Y., Lu, H., and Bailey, C., "Modeling the Performance of Flexible Substrates for Lead-Free Applications," Proceedings of 7th Electronic Packaging Technology Conference, Volume 1, Singapore, Dec. 7-9, 2005, pp. 342-346.

Yin, C. Y., Lu, H., Bailey, C., and Chan, Y. C., "Moisture Effects on the Reliability of Anisotropic Conductive Films," Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, Apr. 18-20, 2005, pp. 162-167.

Yin, C. Y., Best, C., Bailey, C., Stoyanov, S., and Alam, M. O., "Statistical Analysis of the Impacts of Refinishing Process on the Reliability of Microelectronics Components," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1377-1381.

Yin, C. Y., Alam, M. O., Chan, Y. C., Bailey, C., and Lu, Hua, "The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications," Microelectronics Reliability, vol. 43 no. 4, pp. 625-633, Apr. 2003.

Yin, C., Lee, Y., Bailey, C., Riches, S., Cartwright, C., Sharpe, R., and Orr, H., "Thermal Analysis of LEDs for Liquid Crystal Display's Backlighting," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Yin, C. Y., Rizvi, M. J., Lu, H., and Bailey, C., "Thermal-Mechanical Analysis of Flexible Substrates during Lead-Free Solder Reflow," 1st Electronics Systemintegration Technology Conference, Volume 2, Dresden, Germany, Sept. 5-7, 2006, pp. 1007-1011.

Yin, Chunyan, Lu, Hua, Bailey, Chris, and Chan, Yan-Cheong, "Effects of Solder Reflow on the Reliability of Flip-Chip on Flex Interconnections Using Anisotropic Conductive Adhesives," IEEE Transactions on Electronics Packaging Manufacturing, vol. 27 no. 4, pp. 254-259, Oct. 2004.

Yin, Chunyan, Lu, Hua, Bailey, Chris, and Chan, Yan-cheong, "Moisture Effects on the Reliability of Anisotropic Conductive Film Interconnection for Flip Chip on Flex Applications," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Part B, San Francisco, CA, July 17-22, 2005, pp. 1293-1298.

Yin, Fengfu, Zhang, Xifua, Wang, Hailong, and Yu, Suiran, "Optimization of Process Parameters in Lead-free Wave Soldering Based on Orthogonal Experiment and Analytic Hierarchy Process," Applied Mechanics and Materials, vol. 26-28, pp. 641-647, June 2010.

Yin, HengGang, Shen, Jun, and Tang, Qin, "Wetting of Sn-0.7Cu Solder Alloy on Different Substrates at Different Temperatures," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 280-284.

Yin, Hong, Yu, Xiang-Xiang, Yu, Yi-Wei, Cao, Ming-Lei, Zhao, Han, Li, Chong, and Zhu, Ming-Qiang, "Tellurium nanotubes grown on carbon fiber cloth as cathode for flexible all-solid-state lithium-tellurium batteries," Electrochimica Acta , vol. 282, pp. 870-876, Aug. 20, 2018.

Yin, J. S., and Wang, Z. L., "Preparation of Self-Assembled Cobalt Nanocrystal Arrays," NanoStructured Materials, vol. 11 no. 7, pp. 845-852, 1999.

Yin, L. M., Lin, J. X., Zhang, T. T., Yao, Z. X., Du, C. H., and Tang, M., "Comparison of mechanical properties of lead-free microscale solder joints under tensile and shear loading," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 888-891.

Yin, L. M., Zhang, X. P., and Lu, Chunsheng, "Size and Volume Effects on the Strength of Microscale Lead-Free Solder Joints," Journal of Electronic Materials, vol. 38 no. 10, pp. 2179-2183, Oct. 2009.

Yin, Liang, Kondos, Pericles, Borgesen, Peter, Liu, Yihua, Bliznakov, Stoyan, Wafula, Fred, Dimitrov, Nikolay, Henderson, Donald W., Parks, Christopher, Gao, Mao, Therriault, Joseph, Wang, Ju, and Cotts, Eric, "Controlling Cu Electroplating to Prevent Sporadic Voiding in Cu3Sn," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 406-414.

Yin, Liang, Murray, Bruce T., and Singler, Timothy J., "Dissolutive wetting in the Bi-Sn system," Acta Materialia, vol. 54 no. xx, pp. 3561-3574, 2006.

Yin, Liang, Meilunas, Michael, Arfaei, Babak, Wentlent, Luke, and Borgesen, Peter, "Effect of Microstructure Evolution on Pb-free Solder Joint Reliability in Thermomechanical Fatigue," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 493-499.

Yin, Liang, and Borgesen, Peter, "On the root cause of Kirkendall voiding in Cu3Sn," Journal of Materials Research, vol. 26 no. 3, pp. 455-466, Feb. 2011.

Yin, Liang, Wentlent, Luke, Yang, Linlin, Arfaei, Babak, Oasaimeh, Awni, and Borgesen, Peter, "Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue," Journal of Electronic Materials, vol. 41 no. 2, pp. 241-252, Feb. 2012.

Yin, Liang, Wafula, Fred, Dimitrov, Nikolay, and Borgesen, Peter, "Toward a Better Understanding of the Effect of Cu Electroplating Process Parameters on Cu3Sn Voiding," Journal of Electronic Materials, vol. 41 no. 2, pp. 302-312, Feb. 2012.

Yin, Li-Meng, Li, Wang-Yun, Wei, Song, and Xu, Zhang-Liang, "Size and Volume Effects in Microscale Solder Joint of Electronic Packaging," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 832-834.

Yin, Limeng, Zhang, Zhongwen, Su, Zilong, Zuo, Cunguo, Yao, Zongxiang, Wang, Gang, Zhang, Hehe, Zhang, Long, and Zhang, Yupeng, "Effects of Graphene Nanosheets on the Wettability and Mechanical Properties of Sn-0.3Ag-0.7Cu Lead-Free Solder," Journal of Electronic Materials , vol. 49 no. 12, pp. 7394-7399, Dec. 2020.

Yin, Limeng, Li, Dong, Yao, Zongxiang, Wang, Gang, Das, Diganta, and Pecht, Michael, "Effects of Sn addition on the microstructure and properties of Bi-11Ag high-temperature solder," Journal of Materials Science: Materials in Electronics, vol. 29 no. 14, pp. 12028-12035, July 2018.

Yin, Limeng, Wei, Song, Xu, Zhangliang, Geng, Yanfei, Das, Diganta, and Pecht, Michael, "Erratum to: The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures," Journal of Materials Science: Materials in Electronics, vol. 24 no. 10, pp. 4155, Oct. 2013.

Yin, Limeng, Li, Dong, Yao, Zongxiang, Wang, Gang, and Blackburn, Adrian, "Microstructures and properties of Bi-10Ag high temperature solder doped with Cu element," Microelectronics Reliability, vol. 80, pp. 79-84, Jan. 2018.

Yin, Limeng, Zhang, Zhongwen, Zuo, Cunguo, Fang, Naiwen, Yao, Zongxiang, and Su, Zilong, "Microstructures and properties of Sn-0.3Ag-0.7Cu solder doped with graphene nanosheets," Journal of Materials Science: Materials in Electronics , vol. 31 no. 3, pp. 1861-1867, Feb. 2020.

Yin, Limeng, Wei, Song, Xu, Zhangliang, and Geng, Yanfei, "The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures," Journal of Materials Science: Materials in Electronics, vol. 24 no. 4, pp. 1369-1374, Apr. 2013.

Yin, Luqiao, Yang, Weiqiao, Guo, Yansheng, Ma, Kejun, Li, Shuzhi, Chen, Mingfa, Li, Jia, and Zhang, Jianhua, "Multi-Chip Integrated High-Power White LED Device on the Multi-Layer Ceramic Substrate," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 790-794.

Yin, Qiyue, Gao, Fan, Wang, Jirui, Gu, Zhiyong, Stach, Eric A., and Zhou, Guangwen, "Length-dependent melting behavior of Sn nanowires," Journal of Materials Research, vol. 32 no. 6, pp. 1194-1202, Mar. 2017.

Yin, Siqi, Huang, Mingliang, and Chen, Yu, "Effect of In addition on the properties of Sn-Au-Cu lead-free solder," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 1363-1367.

Yin, Wen, Yu, Daquan, Dai, Fengwei, Song, Chongshen, Bo, Zhang, Wan, Lixi, Yu, Han, and Sun, Jiangyan, "Development of Micro-alloying Method for Cu Pillar Solder Bump by Solid Liquid Interaction," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 1709-1714.

Yin, Wusheng, Lee, Ning-Cheng, Dimock, Fred, and Mattson, Kristen, "Effect of Flux and Cooling Rate on Microstructure of Flip Chip SAC Bump," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 449-454.

Yin, Wusheng, and Lee, Ning-Cheng, "Epoxy Flux For Lead-Free Soldering," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 731-738.

Yin, Wusheng, and Lee, Ning-Cheng, "Reworkable No-Flow Underfilling for Both Tin-Lead and Lead-Free Reflow for CSP Assembled under Air," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 502-509.

Yin, Yihao, Ling, Huiqin, Guo, Fayao, Hu, Anmin, and Li, Ming, "Investigation of the intermetallic compounds growth in 10um Cu/Sn and Cu/Ni/Sn microbumps under isothermal temperature aging," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Yin, Zuozhu, Lin, Mei, Li, Qi, and Wu, Ziyuan, "Effect of doping Ni nanoparticles on microstructure evolution and shear behavior of Sn-3.0Ag-0.5Cu(SAC305)/Cu-2.0Be solder joints during reflowing," Journal of Materials Science: Materials in Electronics, vol. 31 no. 6, pp. 4905-4914, Mar. 2020.

Yin, Zuozhu, Lin, Mei, Li, Qi, and Lv, Xiaochun, "Effects of Ni Nanoparticles on the Growth Rate of Intermetallic Compounds (IMCs) Between Sn-3.0Ag-0.5Cu (SAC305) Solder and Cu-2.0Be Substrate," Journal of Electronic Materials, vol. 49 no. 11, pp. 6721-6726, Nov. 2020.

Yin, Zuozhu, Sun, Fenglian, Liu, Yang, and Liu, Yang, "Growth kinetics of IMC at the solid Cu/liquid Sn interface," Soldering & Surface Mount Technology, vol. 30 no. 3, pp. 145-152, 2018.

Yin, Zuozhu, Sun, Fenglian, and Guo, Mengjiao, "Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu-Sn System Using Nanoindentation," Journal of Electronic Packaging, vol. 142 no. 2, pp. 021004-1-021004-7, June 2020.

Yin, Zuozhu, Sun, Fenglian, and Guo, Mengjiao, "The fast formation of Cu-Sn intermetallic compound in Cu/Sn/Cu system by induction heating process," Materials Letters, vol. 215, pp. 207-210, Mar. 15, 2018.

Yin, Zuozhu, Sun, Fenglian, and Guo, Mengjiao, "The fast formation of full Cu3Sn solder joints in Cu/Sn/Cu system by thermal gradient bonding," Journal of Materials Science: Materials in Electronics, vol. 30 no. 3, pp. 2146-2153, Feb. 2019.

Ying, Chen, Zebing, Hou, and Rui, Kang, "Lifetime Prediction and Impact Factors Analysis of Ball Grid Array Solder Joint Based on FEA," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 1142-1146.

Ying, Liu Ying, Premachandran, C. S., Yoon, Seung Wook, Ebin, Liao, Nagarajan, Ranganathan, and Ramama, Pamidighantm V., "Characterization of AuSn Solder in Laser Die Attachment for Photonic Packaging Applications," 9th Electronics Packaging Technology Conference , Singapore, Dec. 10-12, 2007, pp. 370-373.

Ying, Ming, Tengh, Alfred, Chia, Yew Choon, Mohtar, Arman, and Wong, Pak Wing, "Process Development of Void Free Underfilling for Flip-chip-on-board," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 805-810.

Yinglei, Huang, Zhaohua, Wu, and Zhengwei, Liu, "Study on the optimization and analysis of the Mixed Reflow soldering with lead and lead-free solder in the high density assembly," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 884-889.

Yingxin, Goh, Haseeb, A. S. M. A., and Sabri, Mohd Faizul Mohd, "Effects of Hydroquinone and Gelatin on the Electrodeposition of SnBi Low Temperature Pb-Free Solder," 2012 4th Asia Symposium on Quality Electronic Design, Kuala Lumpur, Malaysia, July 10-11, 2012, pp. 306-312.

Yip, Laurene, and Ng, Ace, "Board level Reliability of Fine Pitch Flip Chip BGA Packages for Automotive Applications," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 464-469.

Yip, Laurene, "Reliability of Large Die Ultra Low-k Lead-Free Flip Chip Packages," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2012, pp. 877-881.

Yip, Ming-Chuen, Huang, Chien-Yuan, Chen, Chien-Liang, and Lu, Su-Tsai, "Bending and Reliability Test of Chip-on-flex (COF) Assembly Using Anisotropic Conductive Films (ACFs)," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Yiping, Wu, Jinsong, Zhang, Fengshun, Wu, Bing, An, Boyi, Wu, and Lei, Wang, "Effects of UBM Thickness on Electromigration in Pb-free Solder Joints," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 998-1002.

Yla-Mella, Jenni, Poikela, Kari, Lehtinen, Ulla, Keiski, Riitta L., and Pongracz, Eva, "Implementation of Waste Electrical and Electronic Equipment Directive in Finland: Evaluation of the collection network and challenges of the effective WEEE management," Resources, Conservation and Recycling, vol. 86, pp. 38-46, May 2014.

Yokoyama, Akinori, Maehara, Kazuo, and Takagi, Kazuo, "New Anisotropic Conductive Film (ACF)," Fifth International Conference on Electronic Packaging Technology Proceedings, Shanghai, China, Oct. 28-30, 2003, pp. 302-305.

Yokoyama, Ken'ichi, Nogami, Akihide, and Sakai, Jun'ichi, "Creep corrosion cracking of Sn-3.0Ag and Sn-0.5Cu solder alloys in NaCl solution," Corrosion Science, vol. 86, pp. 142-148, Sept. 2014.

Yokoyama, Ken'ichi, Tsuji, Daisuke, and Sakai, Jun'ichi, "Fracture of sustained tensile-loaded Sn-3.0Ag-0.5Cu solder alloy in NaCl solution," Corrosion Science, vol. 53 no. 10, pp. 3331-3336, Oct. 2011.

Yokoyama, Yoshinori, Endo, Kazuyo, Iwasaki, Toshihiro, and Fukumoto, Hiroshi, "Variable-Size Solder Droplets by a Molten-Solder Ejection Method," IEEE/ASME Journal of Microelectromechanical Systems, vol. 18 no. 2, pp. 316-321, Apr. 2009.

Yoneda, Y., Mizutani, D., Cooray, N. F., and Motoyoshi, K., "A High Reliability Halogen-Free Flame-Retardant Dielectric for Build-up PWBs," Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 11-15, 2001, pp. 407-412.

Yoneta, Kiyoto, Sato, Ryohei, Iwata, Yoshiharu, Atsumi, Koichiro, Okamoto, Kazuya, Satio, Yukihiro, and Shigemoto, Takumi, "Study of Extreme Low Temperature and Load Solid-Phase Sn-Ag System Bonding Mechanism for 3D ICs," 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp. 2227-2230.

Yoneta, Kiyoto, Sato, Ryohei, Iwata, Yoshiharu, Atsumi, Koichiro, Okamoto, Kazuya, and Sato, Yukihiro, "Study of Low Load and Temperature, High Heat-Resistant Solid-Phase Sn-Ag Bonding with Formation of Ag3Sn Intermetallic Compound Via Nanoscale Thin Film Control for Wafer-Level 3D-Stacking for 3D LSI," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 2381-2384.

Yong, Zuo, Ma, Limin, Yue, Lu, Liu, Sihan, and Guo, Fu, "The effects of thermal cycling on electromigration behaviors in lead-free solder joints," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1068-1071.

Yongchang, , Li, Yan Xiaoyan, and Liu, Na, "FEM Analysis of SnAgCu Solder Joint in Flip Chip," 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 6-10, 2009, pp. 418-422.

yongping, Lei, Linjian, Hanguang, Fu, Zhongwei, Wu, Wangyong, Like, and gaobing, Liao, "Experimental Research on Sn99.0/Ag0.3/Cu0.7 Lead-Free Soldering Paste and its Board-Level Packaging Joint Reliability," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging , Xi'an, China, Aug. 16-19, 2010, pp. 935-937.

Yongping, Lei, Jinli, Yang, Jian, Lin, Hanguang, Fu, Baoquan, Liu, Hailong, Bai, and Junhu, Qin, "The influence of silver content on the reliability of lead-free solder joints under drop condition," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 826-829.

Yoo, Kyoungkeun, Lee, Jae-chun, Lee, Kwang-sek, Kim, Byung-su, Kim, Min-seuk, Kim, Soo-kyoung, and Pandey, B. D., "Recovery of Sn, Ag and Cu from Waste Pb-Free Solder Using Nitric Acid Leaching," Materials Transactions, vol. 53 no. 12, pp. 2175-2180, 2012.

Yoo, M. H., and Lee, J. K., "Deformation twinning in h.c.p. metals and alloys," Philosophical Magazine A, vol. 63 no. 5, pp. 987-1000, 1991. https://doi.org/10.1080/01418619108213931

Yoo, M. H., Morris, J. R., Ho, K. M., and Agnew, S. R., "Nonbasal Deformation Modes of HCP Metals and Alloys: Role of Dislocation Source and Mobility," Metallurgical and Materials Transactions A, vol. 33 no. , pp. 813-822, 2002. https://doi.org/10.1007/s11661-002-0150-1

Yoo, Sung Keun, Yang, Sung, and Lee, Jong-Hyun, "Hydrogen Ion Sensing Using Schottky Contacted Silicon Nanowire FETs," IEEE Transactions on Nanotechnology, vol. 7 no. 6, pp. 745-748, Nov. 2008.

Yoon, Hyunmyung, and Jang, Yong-Chul, "The Practice and Challenges of Electronic Waste Recycling in Korea with Emphasis on Extended Producer Responsibility (EPR)," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 326-330.

Yoon, J.-W., Lee, C,-B., and Jung, S.-B., "Activation energies of intermetallic compound growth at interface between Sn-5Bi-3.5Ag solder and Cu substrate," Materials Science & Technology, vol. 19 no. 8, pp. 1101-1106, Aug. 2003.

Yoon, J,-W., Kim, S.-W., and Jung, S.-B., "Effect of high temperature storage test on reliability of eutectic Sn-Cu/ENIG solder joint," Materials Science and Technology, vol. 23 no. 4, pp. 411-416, Apr. 2007.

Yoon, J.-W., and Jung, S.-B., "Interfacial reaction and mechanical reliability of eutectic Sn-0.7Cu/immersion Ag-plated Cu solder joint," Materials Science and Technology, vol. 25 no. 12, pp. 1478-1484, Dec. 2009.

Yoon, Jeong-Won, Chun, Hyun-Suk, Koo, Ja-Myeong, and Jung, Seung-Boo, "Au-Sn flip-chip solder bump for microelectronic and optoelectronic applications," Microsystem Technologies, vol. 13 no. 11-12, pp. 1463-1469, July 2007.

Yoon, Jeong-Won, Back, Jong-Hoon, and Jung, Seung-Boo, "Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints," Journal of Materials Science: Materials in Electronics , vol. 29 no. 6, pp. 4724-4731, Mar. 2018.

Yoon, Jeong-Won, Noh, Bo-In, and Jung, Seung-Boo, "Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint," Journal of Electronic Materials, vol. 40 no. 9, pp. 1950-1955, Sept. 2011.

Yoon, Jeong-Won, Noh, Bo-In, and Jung, Seung-Boo, "Comparison of Interfacial Stability of Pb-Free Solders (Sn-3.5Ag, Sn-3.5Ag-0.7Cu, and Sn-0.7Cu) on ENIG-Plated Cu During Aging," IEEE Transactions on Components and Packaging Technologies, vol. 33 no. 1, pp. 64-70, Mar. 2010.

Yoon, Jeong-Won, Chun, Hyun-Suk, and Jung, Seung-Boo, "Correlation between interfacial reactions and shear strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu solder joints," Materials Science and Engineering: A, vol. 483-484, pp. 731-734, June 15, 2008.

Yoon, Jeong-Won, Noh, Bo-In, Choi, Jung-Hyun, and Jung, Seung-Boo, "Effect of adding Ce on interfacial reactions between Sn-Ag solder and Cu," Journal of Materials Science: Materials in Electronics, vol. 22 no. 7, pp. 745-750, July 2011.

Yoon, Jeong-Won, Koo, Ja-Myeong, Kim, Jong-Woong, Ha, Sang-Su, Noh, Bo-In, Lee, Chang-Yong, Park, Jong-Hyun, Shur, Chang-Chae, and Jung, Seung-Boo, "Effect of boron content in electroless Ni-B layer on plating layer properties and soldering characteristics with Sn-Ag solder," Journal of Alloys and Compounds, vol. 466 no. 1-2, pp. 73-79, Oct. 20, 2008.

Yoon, Jeong-Won, and Jung, Seung-Boo, "Effect of immersion Ag surface finish on interfacial reaction and mechanical reliability of Sn-3.5Ag-0.7Cu solder joint," Journal of Alloys and Compounds, vol. 458 no. 1-2, pp. 200-207, June 30, 2008.

Yoon, Jeong-Won, and Jung, Seung-Boo, "Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate," Journal of Materials Science, vol. 39 no. 13, pp. 4211-4217, July 2004.

Yoon, Jeong-Won, and Jung, Seung-Boo, "Effect of isothermal aging on the interfacial reactions between Sn-0.4Cu solder and Cu substrate with or without ENIG plating layer," Surface and Coatings Technology, vol. 200 no. 14-15, pp. 4440-4447, Apr. 10, 2006.

Yoon, Jeong-Won, Lee, Chang-Bae, Quesnel, David J., and Jung, Seung-Boo, "Effect of Isothermal Aging on the Intermetallic Compound Layer Growth in BGA Joints with Sn-Ag-Cu Solder," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 465-470.

Yoon, Jeong-Won, and Jung, Seung-Boo, "Effect of surface finish on interfacial reactions of Cu/Sn-Ag-Cu/Cu(ENIG) sandwich solder joints," Journal of Alloys and Compounds, vol. 448 no. 1-2, pp. 177-184, Jan. 10, 2008.

Yoon, Jeong-Won, Noh, Bo-In, Lee, Young-Ho, Lee, Hyo-Soo, and Jung, Seung-Boo, "Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint," Microelectronics Reliability, vol. 48 no. 11-12, pp. 1864-1874, Nov.-Dec. 2008.

Yoon, Jeong-Won, Kim, Sang-Won, and Jung, Seung-Boo, "Effects of reflow and cooling conditions on interfacial reaction and IMC morphology of Sn-Cu/Ni solder joint," Journal of Alloys and Compounds , vol. 415 no. 1-2, pp. 56-61, May 18, 2006.

Yoon, Jeong-Won, Lee, Chang-Bae, and Jung, Seung-Boo, "Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-state Isothermal Aging," Materials Science Forum, vol. 449-452, pp. 893-896, 2004.

Yoon, Jeong-Won, and Jung, Seung-Boo, "Growth kinetics of Ni3Sn4 and Ni3P layer between Sn-3.5Ag solder and electroless Ni-P substrate," Journal of Alloys and Compounds, vol. 376 no. 1-2, pp. 105-110, Aug 11, 2004.

Yoon, Jeong-Won, Lee, Chang-Bae, and Jung, Seung-Boo, "Growth of an Intermetallic Compound Layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during Aging Treatment," Journal of Electronic Materials, vol. 32 no. 11, pp. 1195-1202, Nov. 2003.

Yoon, Jeong-Won, and Jung, Seung-Boo, "High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging ," Microelectronics Reliability , vol. 46 no. 5-6, pp. 905-914, May-June 2006.

Yoon, Jeong-Won, Kim, Sang-Won, and Jung, Seung-Boo, "IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging," Materials Transactions, vol. 45 no. 3, pp. 727-733, Mar. 2004.

Yoon, Jeong-Won, Kim, Sang-Won, and Jung, Seung-Boo, "IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate," Journal of Alloys and Compounds, vol. xx no. xx, pp. xx-xx, (in press).

Yoon, Jeong-Won, Bang, Jung-Hwan, Lee, Chang-Woo, and Jung, Seung-Boo, "Interfacial reaction and intermetallic compound formation of Sn-1Ag/ENIG and Sn-1Ag/ENEPIG solder joints," Journal of Alloys and Compounds, vol. 627, pp. 276-280, Apr. 5, 2015.

Yoon, Jeong-Won, Chun, Hyun-Suk, and Jung, Seung-Boo, "Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging," Materials Transactions, vol. 46 no. 11, pp. 2386-2393, 2005.

Yoon, Jeong-Won, Kim, Sang-Won, and Jung, Seung-Boo, "Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow," Materials Science Forum, vol. 486-487, pp. 289-292, 2005.

Yoon, Jeong-Won, and Jung, Seung-Boo, "Interfacial reaction and shear strength of Sn-0.7Cu solder/electrolytic Ni joints with reflow time," Zeitschrift fur Metallkunde, vol. 96 no. 12, pp. 1420-1425, Dec. 2005.

Yoon, Jeong-Won, Noh, Bo-In, and Jung, Seung-Boo, "Interfacial reaction between Au-Sn solder and Au/Ni-metallized Kovar," Journal of Materials Science: Materials in Electronics, vol. 22 no. 1, pp. 84-90, Jan. 2011.

Yoon, Jeong-Won, and Jung, Seung-Boo, "Interfacial Reaction of Cu/Sn-Ag/ENIG Sandwich Solder Joint During Aging," Advanced Materials Research, vol. 15-17, pp. 1001-1007, 2007.

Yoon, Jeong-Won, Moon, Won-Chul, and Jung, Seung-Boo, "Interfacial reaction of ENIG/Sn-Ag-Cu/ENIG sandwich solder joint during isothermal aging", Microelectronic Engineering, vol. 83 no. 11-12, pp. 2329-2334, Nov.-Dec. 2006.

Yoon, Jeong-Won, Lim, Jun Hyung, Lee, Hoo-Jeong, Joo, Jinho, Jung, Seung-Boo, and Moon, Won-Chul, "Interfacial reactions and joint strength of Sn-37Pb and Sn-3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C." Journal of Materials Research, vol. 21 no. 12, pp. 3196-3204, Dec. 2006.

Yoon, Jeong-Won, and Jung, Seung-Boo, "Interfacial reactions and shear strength on Cu and electrolytic Au/Ni metallization with Sn-Zn solder," Journal of Materials Research, vol. 21 no. 6, pp. 1590-1599, June 2006.

Yoon, Jeong-Won, and Jung, Seung-Boo, "Interfacial reactions between Sn-0.4Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction, Journal of Alloys and Compounds, vol. 396 no. 1-2, pp. 122-127, June 21, 2005.

Yoon, Jeong-Won, Lee, Chang-Bae, and Jung, Seung-Boo, "Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate," Materials Transactions, vol. 43 no. 8, pp. 1821-1826, Aug. 2002.

Yoon, Jeong-Won, Chun, Hyun-Suk, and Jung, Seung-Boo, "Investigation of interfacial reaction and joint reliability between eutectic Sn-3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test," Journal of Materials Science: Materials in Electronics, vol. 18 no. 5, pp. 559-567, 2007.

Yoon, Jeong-Won, Lee, Chang-Yong, Lee, Chang-Bae, Yoo, Choong-Sik, and Jung, Seung-Boo, "Investigation of interfacial reactions between Sn-Ag-Bi-In solder and (Cu, electroless Ni-P/Cu) substrate," Zeitschrift fur Metallkunde, vol. 94 no. 4, pp. 453-457, Apr. 2003.

Yoon, Jeong-Won, Chun, Hyun-Suk, and Jung, Seung-Boo, "Liquid-state and solid-state interfacial reactions of fluxless-bonded Au-20Sn/ENIG solder joint," Journal of Alloys and Compounds, vol. 469 no. 1-2, pp. 108-115, Feb. 5, 2009.

Yoon, Jeong-Won, Noh, Bo-In, and Jung, Seung-Boo, "Mechanical Reliability of Sn-Ag BGA Solder Joints With Various Electroless Ni-P and Ni-B Plating Layers," IEEE Transactions on Components and Packaging Technologies, vol. 33 no. 1, pp. 222-228, Mar. 2010.

Yoon, Jeong-Won, Chun, Hyun-Suk, Noh, Bo-In, Koo, Ja-Myeong, Kim, Jong-Woong, Lee, Hoo-Jeong, and Jung, Seung-Boo, "Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method," Microelectronics Reliability , vol. 48 no. 11-12, pp. 1857-1863, Nov.-Dec. 2008.

Yoon, Jeong-Won, Chun, Hyun-Suk, Lee, Hoo-Jeong, and Jung, Seung-Boo, "Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging," Journal of Materials Research, vol. 22 no. 10, pp. 2817-2824, Oct. 2007.

Yoon, Jeong-Won, Chun, Hyuk-Suk, Koo, Ja-Myeong, Lee, Hoo-Jeong, and Jung, Seung-Boo, "Microstructural evolution of Sn-rich Au-Sn/Ni flip-chip solder joints under high temperature storage testing conditions," Scripta Materialia , vol. 56 no. 8, pp. 661-664, Apr. 2007.

Yoon, Jeong-Won, and Jung, Seung-Boo, "Phase analysis and kinetics of solid-state ageing of Pb-free Sn3.5Ag solder on electroless NiP substrate," Surface and Interface Analysis, vol. 36 no. 8, pp. 963-965, Aug. 2004.

Yoon, Jeong-Won, Chun, Hyun-Suk, and Jung, Seung-Boo, "Reliability analysis of Au-Sn flip-chip solder bump fabricated by co-electroplating," Journal of Materials Research, vol. 22 no. 5, pp. 1219-1229, May 2007.

Yoon, Jeong-Won, Chun, Hyun-Suk, and Jung, Seung-Boo, "Reliability evaluation of Au-20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au," Materials Science and Engineering: A, vol. 473 no. 1-2, pp. 119-125, Jan. 25, 2008.

Yoon, Jeong-Won, Kim, Sang-Won, Koo, Ja-Myeong, Kim, Dae-Gon, and Jung, Seung-Boo, "Reliability Investigation and Interfacial Reaction of Ball-Grid-Array Packages Using the Lead-Free Sn-Cu Solder," Journal of Electronic Materials, vol. 33 no. 10, pp. 1190-1199, Oct. 2004.

Yoon, Jeong-Won, and Jung, Seung-Boo, "Reliability studies of Sn-9Zn/Cu solder joints with aging treatment," Journal of Alloys and Compounds, vol. 407 no. 1-2, pp. 141-149, Jan. 5, 2006.

Yoon, Jeong-Won, Noh, Bo-In, Yoon, Jae-Hyun, Kang, Han-Byul, and Jung, Seung-Boo, "Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn-Ag-Cu solder and ENEPIG substrate during a reflow process," Journal of Alloys and Compounds, vol. 509 no. 9, pp. L153-L156, Mar. 3, 2011.

Yoon, Jeong-Won, and Jung, Seung-Boo, "Solder joint reliability evaluation of Sn-Zn/Au/Ni/Cu ball-grid-array package during aging," Materials Science and Engineering: A, vol. 452-453, pp. 46-54, Apr. 15, 2007.

Yoon, Jeong-Won, and Jung, Seung-Boo, "TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate," Materials Science Forum , vol. 510-511, pp. 554-557, Mar. 2006.

Yoon, Jeong-Won, Lee, Jong-Gun, Lee, Jong-Bum, Noh, Bo-In, and Jung, Seung-Boo, "Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders," Journal of Materials Science: Materials in Electronics , vol. 23 no. 1, pp. 41-47, Jan. 2012.

Yoon, Jeong-Won, Noh, Bo-In, Kim, Bong-Kyun, Shur, Chang-Chae, and Jung, Seung-Boo, "Wettability and interfacial reactions of Sn-Ag-Cu/Cu and Sn-Ag-Ni/Cu solder joints," Journal of Alloys and Compounds, vol. 486 no. 1-2, pp. 142-147, Nov. 3, 2009.

Yoon, JeongAh, Shin, Insun, Park, Juyoung, and Kwon, Daeil, "A Prognostic Method of Assessing Solder Joint Reliability Based on Digital Signal Characterization," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 2060-2065.

Yoon, Jun-Sik, and Baek, Chang-Ki, "Vertical Nanowire Tunneling Field-Effect Transistors adopting Core-shell Structure with Strain Effects," 2018 IEEE 8th International Nanoelectronics Conferences, Kuala Lumpur, Malaysia, Jan. 3-5, 2018, pp. 3-4.

Yoon, Junsik, and Kirschne, Michael, "Electronics Recycling in Korea," Circuits Assembly, vol. 18 no. 8, pp. 18, Aug. 2007.

Yoon, S., Chen, Z., Osterman, M., Han, B., and Dasgupta, A., "Effect of Stress Relaxation on Board Level Reliability of Sn Based Pb-Free Solders," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 1210-1214.

Yoon, Sam, Wu, Roy, Bath, Jasbir, Chou, Chris, and Lam, Samson, "Assembly, Rework and Reliability of Lead-free FCBGA Soldered Component," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S29-2-1-S29-2-15.

Yoon, Sam, Wu, Roy, Bath, Jasbir, Chou, Chris, and Lam, Samson, "Lead-Free BGA Assembly," Assembly, vol. xx no. xx, pp. xx-xx, July 2004.

Yoon, Sang Won, Shiozaki, Koji, Yasuda, Satoshi, and Glover, Michael D., "Highly Reliable Nickel-Tin Transient Liquid Phase Bonding Technology for High Temperature Operational Power Electronics in Electrified Vehicles," 2012 Twenty-Seventh Annual IEEE Applied Power Electronics and Exposition, Orlando, FL, Feb. 5-9, 2012, pp. 478-482.

Yoon, Sang Won, Glover, Michael D., and Shiozaki, Koji, "Nickel-Tin Transient Liquid Phase Bonding Toward High-Temperature Operational Power Electronics in Electrified Vehicles," IEEE Transactions on Power Electronics, vol. 28 no. 5, pp. 2448-2456, May 2013.

Yoon, Seung Wook, Kripesh, Vaidyanathan, Viswanath, Akella, Li, Hong Yu, and Iyer, Mahadevan K., "150um Pitch Pb-Free Flipchip Packaging with Cu/Low-k Interconnects," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 1, Orlando, FL, May 31-June 3, 2005, pp. 100-106.

Yoon, Seung Wook, Soh, Jeong Ryong, Lee, Byeong-Joo, and Lee, Hyuck Mo, "Alloy Design of Sn-Zn-X (X=In, Bi) Solder Systems through Phase Equilibria Calculations," Design & Reliability of Solders and Solder Interconnections, Orlando, FL, Feb. 10-13, 1997, pp. 121-128.

Yoon, Seung Wook, Hong, Jun Ki, Kim, Hwa Jung, and Byun, Kwang Yoo, "Board-Level Reliability of Pb-Free Solder Joints of TSOP and Various CSPs," IEEE Transactions on Electronics Packaging Manufacturing, vol. 28 no. 2, pp. 168-175, Apr. 2005.

Yoon, Seung Wook, and Park, Ik Seung, "CSP Board Level Reliability Testing of Pb-Free Sn-Ag-X (X=Cu, In) and Polymer-Core Solder Ball," 2001 Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Feb. 13-15, 2001, pp. xx-xx.

Yoon, Seung Wook, Park, Chang Jun, Hong, Sung Hak, Moon, Jong Tae, Park, Ik Seong, and Chun, Heung Sup, "Interfacial Reaction and Solder Joint Reliability of Pb-Free Solders in Lead Frame Chip Scale Packages (LF-CSP)," Journal of Electronic Materials , vol. 29 no. 10, pp. 1233-1240, Oct. 2000.

Yoon, Seung Wook, Rho, Byung-Sup, Lee, Hyuck Mo, Kim, Choong-Un, and Lee, Byeong-Joo, "Investigation of the Phase Equilibria in the Sn-Bi-In Alloy System," Metallurgical and Materials Transactions A, vol. 30 no. 6, pp. 1503-1515, June 1999.

Yoon, Seung Wook, Soh, Jeong Ryong, Lee, Hyuck Mo, and Lee, Byeong-Joo, "Thermodynamics-aided Alloy Design and Evaluation of Pb-Free Solder, Sn-Bi-In-Zn System," Acta Materialia, vol. 45 no. 3, pp. 951-960, Mar. 1997.

Yoon, Seung Wook, Kripesh, Vaidyanathan, Jeffery, Su Yong Ji, and Iyer, Mahadevan K., "Under Bump Metallurgy Study on Copper/Low-k Dielectrics for Fine Pitch Flip Chip Packaging," Journal of Electronic Materials, vol. 33 no. 10, pp. 1144-1155, Oct. 2004.

Yorita, Chiko, Kobayashi, Tatsuya, and Shohji, Ikuo, "Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization and Sn-3Ag-0.5Cu Solder Ball," Key Engineering Materials , vol. 462-463, pp. 849-854, 2011.

Yorita, Chiko, Imamura, Yuko, Hirohate, Yasuhisa, and Asakura, Kentaro, "Evaluation of Cutting Forces for Intermetallic Compounds Formed on Solder Joint Interface by Instrumented Ultramicrotome," Journal of the Japan Institute of Metals, vol. 68 no. 5, pp. 282-287. May 2004.

Yoshida, A., Tasaki, T., and Terazono, A., "Environmental Life-cycle Impacts and Benefits of Secondhand CRT TVs Exported from Japan to the Philippines," IEEE International Symposium on Sustainable Systems and Technology, Phoenix, AZ, May 18-20, 2009, pp. xx-xx.

Yoshida, Akito, Kim, Young-Ho, Ishibashi, Kazuo, and Hozoji, Tomoaki, "An Extremely Thin BGA Format Chip-Scale Package and Its Board Level Reliability," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1335-1340.

Yoshida, Aya, Tasaki, Tomohiro, and Terazono, Atsushi, "Material flow analysis of used personal computers in Japan," Waste Management, vol. 29 no. 5, pp. 1602-1614, May 2009.

Yoshida, Aya, Tasaki, Tomohiro, and Terazono, Atsushi, "Material flow of used PCs in Japan," Proceedings of the 2007 IEEE International Symposium on Electronics & the Environment, Orlando, FL, May 7-10, 2007, pp. 46-51.

Yoshida, Aya, and Terazono, Atsushi, "Reuse of secondhand TVs exported from Japan to the Philippines," Waste Management, vol. 30 no. 6, pp. 1063-1072, June 2010.

Yoshida, Hiroatsu, Ikejiri, Keitaro, Sato, Takuya, Hara, Shinjiroh, Hiruma, Kenji, Motohisa, Junichi, and Fukui, Takashi, "Analysis of twin defects in GaAs nanowires and tetrahedra and their correlation to GaAs(1 1 1)B surface reconstructions in selective-area metal organic vapour-phase epitaxy," Journal of Crystal Growth, vol. 312 no. 1, pp. 52-57, Dec. 15, 2009.

Yoshida, Junko, "'Green fever' worry," Electronic Engineering Times, no. 1353, pp. 16, Jan. 10, 2005.

Yoshida, Junko, "'Green fever' worry," Green SupplyLine, Jan. 10, 2005.

Yoshida, Kazuhiko, Gotoh, Yoshihiko, and Yamamoto, Mikio, "The Thickness Dependence of Plastic Behaviors of Copper Whiskers," Journal of the Physical Society of Japan, vol. 24 no 5, pp. 1099-1107, May 1968.

Yoshida, Kazuhiko, Onozuka, Takashi, and Yamamoto, Mikio, "Thickness and Orientation Dependence of Plastic Behaviors of Iron Whiskers," Journal of the Physical Society of Japan, vol. 30 no 1, pp. 138-144, Jan. 1971.

Yoshida, Kazunari, Shinohara, Tetsuo, Yamashita, Tsutomu, and Tanaka, Atsuhiro, "Analysis of surface flaws on drawn wire and wire breaks," Wire Journal International, vol. 43 no. 3, pp. 152-158, Mar. 2010.

Yoshida, Kazunari, Ido, Ryuta, and Yamashita, Tsutomu, "Effects of back tension and drawing direction on wire properties in copper wiredrawing," Wire Journal International, vol. 35 no. 2, pp. 110-115, Feb. 2002.

Yoshida, Kazunari, and Shinohara, Tetsuo, "Growth and disappearance of flaws on wire surface in wiredrawing," Wire Journal International, vol. 37 no. 12, pp. 52-57, Dec. 2004.

Yoshida, Kazunari, and Kikuchi, Shunichi, "Improvement of mechanical properties of drawn aluminum wire for wiring harnesses," Wire Journal International, vol. 44 no. 8, pp. 76-80, Aug. 2011.

Yoshida, Kazunari, and Tanabe, Koichiro, "Improvement of surface quality of drawn copper wire by scalping," Wire Journal International, vol. 42 no. 7, pp. 72-76, July 2009.

Yoshida, Kazunari, "My 35 years of research on wiredrawing," Wire Journal International , vol. 44 no. 11, pp. 50-56, Nov. 2011.

Yoshida, Kazunari, Takemoto, Yasutoshi, and Katsuoka, Naoyuki, "Occurrence of dynamic recrystallization in copper wiredrawing," Wire Journal International, vol. 44 no. 1, pp. 57-61, Jan. 2011.

Yoshida, Kazunari, Sato, Kyotaro, Yamashita, Tsutomu, Sato, Huroyuki, Matsunaga, Eiji, and Kato, Daiki, "Tension straightening of a drawn superfine wire," Wire Journal International, vol. 40 no. 5, pp. 46-50, May 2007.

Yoshigahara, H., Sagami, Y., Yamazaki, T., Burkhart, A., and Edwards, M., "Anisotropic Adhesives for Advanced Surface Mount Interconnection," Proceedings of the Technical Program NEPCON West '91, Volume I, Anaheim, CA, Feb. 24-28, 1991, pp. 213-219.

Yoshihara, Ryoichi, Wake, Ryousuke, Iwamoto, Yoshiaki, and Uno, Yoshihide, "Pb Free Zn-Sn-Ni Alloy Coated Steel Sheet for Electric Devices," Nippon Steel Technical Report, no. 81, pp. 38-42, Jan. 2000.

Yoshihara, Sachio, Tanaka, Hirokazu, Ueta, Fumitaka, Kumekawa, Kazuhiro, and Hiramatsu, Hiroaki, "Newly Developed Real Time Monitoring System for Ionic Migration of Lead Free Solder by Means of Quartz Crystal Microbalance," Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing , Tokyo, Japan, Dec. 11-15, 2001, pp. 1064-1069.

Yoshiie, T., Iwanaga, H., Yamaguchi, T., and Shibata, N., "Effect of an Electric Field on the Polarity of Growth Direction in CdSe and ZnO Crystals," Journal of Crystal Growth, vol. 51 no. 3, pp. 624-626, Mar. 1981.

Yoshimi, Naoto, Matsuzaki, Akira, and Yamashita, Masaaki, "Recent Trend of Chromium-Free Coated Steel Sheets for Electrical Appliances," Hyomen Gijutsu (Journal of the Surface Finishing Society of Japan) , vol. 54 no. 5, pp. 344-349, May 2003.

Yoshimura, Masatoshi, Tomioka, Katsuhiro, Hiruma, Kenji, Hara, Shinjiro, Motohisa, Junichi, and Fukui, Takashi, "Lattice-mismatched InGaAs nanowires formed on GaAs(1 1 1)B by selective-area MOVPE," Journal of Crystal Growth, vol. 315 no. 1, pp. 148-151, Jan. 15, 2011.

Yoshioka, J., Kiumi, R., Kuriyama, F., Saito, N., Takeda, S., and Saijo, Y., "Void-free Bumping process for Lead-free Solder," Wafer-Level Congress and Exhibition Conference Proceedings, San Jose, CA, Oct. 10-12, 2004, pp. xx-xx.

You, In-Dong, and Kim, Ho-Kyung, "Evaluation of the joint strength between Sn-3.0Ag-0.5Cu solders and Cu substrate at high strain rates," Materials Science and Engineering: A , vol. 556, pp. 551-557, Oct. 30, 2012.

You, Min, Zhang, Lulu, Gong, Zhengpeng, Liu, Wenjun, and He, Aiping, "On the Properties of Conductive Adhesive Filled with Electroless Silver Plated Flake Graphite," Key Engineering Materials, vol. 373-374, pp. 220-223, 2008.

You, Taehoon, Kim, Yunsung, Jung, Woogwang, Moon, Jeongtak, and Choe, Heeman, "Effect of surface finish on the fracture behavior of Sn-Ag-Cu solder joints during high-strain rate loading," Journal of Alloys and Compounds , vol. 486 no. 1-2, pp. 242-245, Nov. 3, 2009.

You, Taehoon, Kim, Yunsung, Kim, Jina, Lee, Jaehong, Jung, Byungwook, Moon, Jungtak, and Choe, Heeman, "Predicting the Drop Performance of Solder Joints by Evaluating the Elastic Strain Energy from High-Speed Ball Pull Tests," Journal of Electronic Materials, vol. 38 no. 3, pp. 410-414, Mar. 2009.

Youm, Aeran, "Adhesive Attachment of Tantalum Capacitors: Solutions to Persistent Problems," Proceedings 1993 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 2105), Dallas, TX, Nov. 9-11, 1993, pp. 39-43.

Youn, Jeong-Il, Ha, Won, and Kim, Young-Jig, "Fabrication of Lead Free Micro Solder Powder by Melts Dispersion Technique," Materials Science Forum, vol. 510-511, pp. 570-573, 2006.

Youn, Jeong Il, Ha, Won, and Kim, Young Jig, "Soldering Properties of Sn-Zn-X Micro Solder Powders Fabricated by Melts Dispersion Technique," Advanced Materials Research, vol. 15-17, pp. 995-1000, 2007.

Young, Bi-Lian, Duh, Jenq-Gong, and Jang, Guh-Yaw, "Compound Formation for Electroplated Ni and Electroless Ni in the Under-Bump Metallurgy with Sn-58Bi Solder during Aging," Journal of Electronic Materials, vol. 32 no. 12, pp. 1463-1473, Dec. 2003.

Young, Bi-Lian, and Duh, Jenq-Gong, "Interfacial Reaction and Microstructural Evolution for Electroplated Ni and Electroless Ni in the Under Bump Metallurgy with 42Sn-58Bi Solder During Annealing," Journal of Electronic Materials, vol. 30 no. 7, pp. 878-884, July 2001.

Young, Bi-Lian, Duh, Jenq-Gong, and Chiou, Bi-Shiou, "Wettability of Electroless Ni in the Under Bump Metallurgy with Lead-Free Solder," Journal of Electronic Materials, vol. 30 no. 5, pp. 543-553, May 2001.

Young, C. C., Duh, J. G., and Tsai, S. Y., "Microstructural Evolution in the Sn-Cu-Ni and Pb-Sn Solder Joints with Cu and Pt-Ag Metallized Al2O3 Substrate," Journal of Electronic Materials , vol. 30 no. 9, pp. 1241-1248, Sept. 2001.

Young, Lamar, "Parylene: A Safe, Environmentally Friendly Coating," IPC Brussels , Brussels, Belgium, June 18, 2008, pp. xx-xx.

Youssef, Abdalla, Birner, Ingo, Voelkel, Holger, Thierauf, Jean, Vodiunig, Robert, Middendorf, Andreas, and Lang, Klaus-Dieter, "Reliability Analysis of Solder Joints under Different Thermal and Thermo-mechanical Loading Conditions: Case Study of Automotive ECUs," 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Montpelier, France, Apr. 18-20, 2016, pp. xx-xx.

Yu, A-Mi, Kim, Jeong-Han, Kim, Mok-Soon, and Lee, Jong-Hyun, "Characteristics Of Sn-Ag-Cu-In Quaternary Solder Compositions and Reliability Evaluation of the Solder Joints," International Conference on Soldering and Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.

Yu, A. Mi, Lee, Chang-Woo, Kim, Jeong-Han, Kim, Mok-Soon, and Lee, Jong-Hyun, "Effect of In Addition on the Reaction and Mechanical Properties in Sn-Ag-Cu-In Solder Alloy," 9th International Conference on Electronic Materials and Packaging, Daejon, Korea, Nov. 19-22, 2007, pp. xx-xx.

Yu, A-Mi, Jang, Jae-Won, Kim, Jun-Ki, Lee, Jong-Hyun, and Kim, Mok-Soon, "Improved Reliability of Sn-Ag-Cu-In Solder Alloy by the Addition of Minor Elements," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1524-1528.

Yu, A-Mi, Kim, Jun-Ki, Lee, Jong-Hyun, and Kim, Mok-Soon, "Tensile Properties and Drop/shock Reliability of Sn-Ag-Cu-In Based Solder Alloys," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 679-682.

Yu, Aibin, Kumar, Acitya, Ho, Soon Wee, Yin, Hnin Wai, Lau, John H., Houe, Khong Chee, Siang, Sharon Lim Pei, Zhang, Xiaowu, Yu, Da-Quan, Su, Nandar, Bi-Rong, Michelle Chew, Ching, Jong Ming, Chun, Tan Teck, Kripesh, Vaidyanathan, Lee, Charles, Huang, Jun Pin, Chiang, James, Chen, Scott, Chiu, Chi-Hsin, Chan, Chang-Yueh, Chang, Chin-Huang, Huang, Chih-Ming, and Hsiao, Cheng-Hsu, "Development of Fine Pitch Solder Microbumps for 3D Chip Stacking," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 387-392.

Yu, Aibin, Lau, John H., Ho, Soon Wee, Kumar, Aditya, Hnin, Wai Yin, Lee, Wen Sheng, Jong, Ming Ching, Sekhar, Vasarla Nagendra, Kripesh, Vaidyanathan, Pinjala, Damaruganath, Chen, Scott, Chan, Chien-Feng, Chao, Chun-Chieh, Chiu, Chi-Hsin, Huang, Chih-Ming, and Chen, Carl, "Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology with High-Density Interconnects," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 9, pp. 1336-1344, Sept. 2011.

Yu, C., Yang, Y., Lu, H., and Chen, J. M., "Effects of Current Stressing on Formation and Evolution of Kirkendall Voids at Sn-3.5Ag/Cu Interface," Journal of Electronic Materials, vol. 39 no. 8, pp. 1309-1314, Aug. 2010.

Yu, C. H., Kang, H. S., Kim, K. S., Han, S. W., and Yang, K. C., "Effects of Postbake on the Microstructure and Whisker Growth of Matte Sn Finish," 12th International Symposium on Advanced Packaging Materials , San Jose, CA, Oct. 3-5, 2007, pp. 158-164.

Yu, C., Lu, H., Fan, R. Z., and Li, S. M., "Factors influencing current density distribution and current crowding in flip chip solder joints," Science and Technology of Welding and Joining , vol. 12 no. 5, pp. 423-430, Oct. 2007.

Yu, C. L., Wang, S. S., and Chuang, T. H., "Intermetallic Compounds Formed at the Interface between Liquid Indium and Copper Substrates," Journal of Electronic Materials, vol. 31 no. 5, pp. 488-493, May 2002.

Yu, Chang-Ho, and Lin, Kwang-Lung, "Early stage soldering reaction and interfacial microstructure formed between molten Sn-Zn-Ag solder and Cu substrate," Journal of Materials Research , vol. 20 no. 5, pp. 1242-1249, May 2005.

Yu, Cheng-Fu, Chan, Chi-Ming, and Hsieh, Ker-Chang, "The effect of tin grain structure on whisker growth," Microelectronics Reliability, vol. 50 no. 8, pp. 1146-1151, Aug. 2010.

Yu, Cheng-Fu, and Hsieh, Ker-Chang, "The Mechanism of Residual Stress Relief for Various Tin Grain Structures," Journal of Electronic Materials, vol. 39 no. 8, pp. 1315-1318, Aug. 2010.

Yu, Chi-Ko, Chang, Graver, Shao, Tina, Chen, Cherie, and Lee, Jeffrey, "Investigation of Recrystallization in BGA Package to Evaluate the Low Ag Solder With Different Dopants After Board Level Test," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 1069-1072.

Yu, Chi-Ko, Chang, Graver, Shao, Tina, Chen, Cherie, and Lee, Jeffrey, "The impact Investigation of CSP IC Packaging on Halogen-free Board Level Performance," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 666-669.

Yu, Chi-Ko, Chang, Graver, Shao, Tina, Chen, Cherie, Lee, Jeffrey, and Nylese, Tara, "The Investigation of Dopants on SAC Solder for Board Level Reliability," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Yu, Chi-Yang, Lee, Tae-Kyu, Tsai, Michael, Liu, Kuo-Chuan, and Duh, Jenq-Gong, "Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu-xNi/Au/Ni Sandwich Structures," Journal of Electronic Materials, vol. 39 no. 12, pp. 2544-2552, Dec. 2010.

Yu, Chi-Yang, Lee, Joseph, Chen, Wen-Lin, and Duh, Jenq-Gong, "Enhancement of the impact toughness in Sn-Ag-Cu/Cu solder joints via modifying the microstructure of solder alloy," Materials Letters, vol. 119, pp. 20-23, Mar. 15, 2014.

Yu, Chi-Yang, and Duh, Jenq-Gong, "Growth mechanisms of interfacial intermetallic compounds in Sn/Cu-Zn solder joints during aging," Journal of Materials Science, vol. 47 no. 17, pp. 6467-6474, Sept. 2012.

Yu, Chi-Yang, Chen, Wei-Yu, and Duh, Jenq-Gong, "Improving the impact toughness of Sn-Ag-Cu/Cu-Zn Pb-free solder joints under high speed shear testing," Journal of Alloys and Compounds, vol. 586, pp. 633-638, Feb. 15, 2014.

Yu, Chi-Yang, Wang, Kai-Jheng, and Duh, Jenq-Gong, "Interfacial Reaction of Sn and Cu-xZn Substrates After Reflow and Thermal Aging," Journal of Electronic Materials, vol. 39 no. 2, pp. 230-237, Feb. 2010.

Yu, Chi-Yang, and Duh, Jenq-Gong, "Microstructural Variation and Phase Evolution in the Reaction of Sn-xAg-Cu Solders and Cu-yZn Substrates During Reflow," Journal of Electronic Materials, vol. 39 no. 12, pp. 2627-2635, Dec. 2010.

Yu, Chi-Yang, and Duh, Jenq-Gong, "Stabilization of hexagonal Cu6(Sn,Zn)5 by minor Zn doping of Sn-based solder joints," Scripta Materialia, vol. xx no. x, pp. xx-xx, xxxx.

Yu, Chi-Yang, Chen, Wei-Yu, and Duh, Jenq-Gong, "Suppressing the growth of Cu-Sn intermetallic compounds in Ni/Sn-Ag-Cu/Cu-Zn solder joints during thermal aging," Intermetallics, vol. 26, pp. 11-17, July 2012.

Yu, Ching-Feng, Cheng, Hsien-Chie, Tsai, Yu-min, Lu, Su-Tsai, and Chen, Wen-Hwa, "Influence of IMC Surface Geometry and Material Properties on Micro-bump Reliability of 3D Chip-on-Chip Interconnect Technology," 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 19-21, 2011, pp. 210-213.

Yu, Ching-Feng, Cheng, Hsien-Chie, and Chen, Wen-Hwa, "Molecular Dynamics Calculations and Nanoindentation Testing of the Strain-rate and Size Dependent Material Properties of Cu3Sn IMC," 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.

Yu, Chun, Yang, Yang, Chen, Jieshi, Xu, Jijin, Chen, Junmei, and Lu, Hao, "Effect of deposit thickness during electroplating on Kirkendall voiding at Sn/Cu joints," Materials Letters, vol. 128, pp. 9-11, Aug. 1, 2014.

Yu, Chun, Lu, Hao, and Li, Shiming, "Effect of Zn addition on the formation and growth of intermetallic compound at Sn-3.5 wt% Ag/Cu interface," Journal of Alloys and Compounds, vol. 459 no. 1-2, pp. 594-598, July 14, 2008.

Yu, Chun, Chen, Jieshi, Cheng, Zhewen, Huang, Yuqian, Chen, Junmei, Xu, Jijin, and Lu, Hao, "Fine grained Cu film promoting Kirkendall voiding at Cu3Sn/Cu interface," Journal of Alloys and Compounds, vol. 660, pp. 80-84, Mar. 5, 2016.

Yu, Chun, Liu, Junyan, Lu, Hao, Li, Peilin, and Chen, Junmei, "First-principles investigation of the structural and electronic properties of Cu6-xNixSn5 (x = 0, 1, 2) intermetallic compounds," Intermetallics , vol. 15 no. 11, pp. 1471-1478, Nov. 2007.

Yu, Chun, Yang, Yang, Wang, Kaiyun, Xu, Jijin, Chen, Junmei, and Lu, Hao, "Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints," Journal of Materials Science: Materials in Electronics, vol. 23 no. 1, pp. 124-129, Jan. 2012.

Yu, Chun, Wang, Dongye, Chen, Jieshi, Xu, Jijin, Chen, Junmei, and Lu, Hao, "Study of Cu6Sn5 and Cu3Sn growth behaviors by considering trace Zn," Materials Letters, vol. 121, pp. 166-169, Apr. 15, 2014.

Yu, Chun, Yang, Yang, Li, Peilin, Chen, Junmei, and Lu, Hao, "Suppression of Cu3Sn and Kirkendall voids at Cu/Sn-3.5Ag solder joints by adding a small amount of Ge," Journal of Materials Science: Materials in Electronics, vol. 23 no. 1, pp. 56-60, Jan. 2012.

Yu, Chun, Chen, Jie-Shi, Wang, Kai-Yun, Chen, Jing-Qing, and Lu, Hao, "Suppression effect of Cu and Ag on Cu3Sn layer in solder joints," Journal of Materials Science: Materials in Electronics, vol. 24 no. 11, pp. 4630-4635, Nov. 2013.

Yu, Chung-Hee, Kim, Kyung-Seob, Kim, Hyung-Il, and Jeon, Hyo-Joeng, "Influence on Interfacial Reaction Layer on Reliability of Chip-Scale Package Joint from Using Sn-37Pb and Sn-8Zn-3Bi Solder," Journal of Electronic Materials, vol. 34 no. 2, pp. 161-167, Feb. 2005.

Yu, D. Q., Wu, C. M. L., Wong, Y. W., and Lai, J. K. L., "Direct robust bonding between Sn-based solder and Si substrate," Journal of Materials Science: Materials in Electronics, vol. 18 no. 10, pp. 1057-1063, Oct. 2007.

Yu, D. Q., Wu, C. M. L., He, D. P., Zhao, N., Wang, L., and Lai, J. K. L., "Effects of Cu contents in Sn-Cu solder on the composition and morphology of intermetallic compounds at a solder/Ni interface," Journal of Materials Research, vol. 20 no. 8, pp. 2205-2212, Aug. 2005.

Yu, D. Q., Jillek, W., and Schmitt, E., "Electrochemical migration of lead free solder joints," Journal of Materials Science: Materials in Electronics, vol. 17 no. x, pp. 229-241, 2006.

Yu, D. Q., Jillek, W., and Schmitt, E., "Electrochemical migration of Sn-Pb and lead free solder alloys under distilled water," Journal of Materials Science: Materials in Electronics , vol. 17 no. x, pp. 219-227, 2006.

Yu, D. Q., Zhao, J., and Wang, L., "Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements," Journal of Alloys and Compounds, vol. 376 no. 1-2, pp. 170-175, Aug. 11, 2004.

Yu, D. Q., Oppermann, H., Kleff, J., and Hutter, M., "Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow," Scripta Materialia , vol. 58 no. 7, pp, 606-609, Apr. 2008.

Yu, D. Q., Wu, C. M. L., Law, C. M. T., Wang, L., and Lai, J. K. L., "Intermetallic compounds growth between Sn-3.5Ag lead-free solder and Cu substrate by dipping method," Journal of Alloys and Compounds, vol. 392 no. 1-2, pp. 192-199, Apr. 19, 2005.

Yu, D. Q., Xie, H. P., and Wang, L., "Investigation of interfacial microstructure and wetting property of newly developed Sn-Zn-Cu solders with Cu substrate," Journal of Alloys and Compounds, vol. 385 no. 1-2, pp. 119-125, Dec. 28, 2004.

Yu, D. Q., Oppermann, H., Kleff, J., and Hutter, M., "Stability of AuSn eutectic solder cap on Au socket during reflow," Journal of Materials Science: Materials in Electronics, vol. 20 no. 1, pp. 55-59, Jan. 2009.

Yu, D. Q., Wang, L., Wu, C. M. L., and Law, C. M. T., "The formation of nano-Ag3Sn particles on the intermetallic compounds during wetting reaction," Journal of Alloys and Compounds, vol. 389 no. 1-2, pp. 153-158, Mar. 8, 2005.

Yu, D. Q., and Wang, L., "The growth and roughness evolution of intermetallic compounds of Sn-Ag-Cu/Cu interface during soldering reaction," Journal of Alloys and Compounds , vol. 458 no. 1-2, pp. 542-547, June 30, 2008.

Yu, D. Q., Wang, J. H., and Wang, L., "The growth behavior of intermetallic compound layer of Sn-Ag-Cu/Cu interface during soldering," Proceedings of 2005 International Conference on Asian Green Electronics, Shang Hai, China, Mar. 15-18, 2005, pp. 86-90.

Yu, Da, Al-Yafawi, Abdullah, Park, Seungbae, and Chung, Soonwan, "Finite Element Based Fatigue Life Prediction for Electronic Components under Random Vibration Loading," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 188-193.

Yu, Da, Al-Yafawi, Abdullah, Nguyen, Tung T., Park, Seungbae, and Chung, Soonwan, "High-cycle fatigue life prediction for Pb-free BGA under random vibration loading," Microelectronics Reliability, vol. 51 no. 3, pp. 649-656, Mar. 2011.

Yu, Da, Lee, Hohyung, and Park, Seungbae, "Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling," Journal of Electronic Packaging, vol. 134 no. 4, pp. 041008-1-041008-6, Dec. 2012.

Yu, Da-Quan, Chai, Tai Chong, Thew, Meei Ling, and Ong, Yue Ying, "Electrochemical migration study of fine pitch lead free micro bump interconnect," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 389-394.

Yu, Da-Quan, Chai, Tai Chong, Thew, Meei Ling, Ong, Yue Ying, Rao, Vempati Srinivasa, Wai, Leong Ching, and Lau, John H., "Electromigration Study of 50 um Pitch Micro Solder Bumps using Four-Point Kelvin Structure," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 930-935.

Yu, Daquan, Lee, Chengkuo, and Lau, John H., "The Role of Ni Buffer Layer between InSn Solder and Cu Metallization for Hermetic Wafer Bonding," International Conference on Electronic Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 171-174.

Yu, Daquan, Yan, Liling, Lee, Chengkuo, Choi, Won Kyoung, Thew, Meei Ling, Fool, Chin Keng, and Lau, J. H., "Wafer Level Hermetic Bonding Using Sn/In and Cu/Ti/Au Metallization," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 767-772.

Yu, Da-Quan, Yan, Li Ling, Lee, Chengkuo, Choi, Won Kyoung, Thew, Serene, Foo, Chin Keng, and Lau, John H., "Wafer-Level Hermetic Bonding Using Sn/In and Cu/Ti/Au Metallization," IEEE Transactions on Components and Packaging Technologies, vol. 32 no. 4, pp. 926-934, Dec. 2009.

Yu, Fuwen, Liu, Hao, Hang, Chunjin, Chen, Hongtao, and Li, Mingyu, "Rapid Formation of Full Intermetallic Bondlines for Die Attachment in High-Temperature Power Devices Based on Micro-sized Sn-Coated Ag Particles," JOM, vol. 71 no. 9, pp. 3049-3056, Sept. 2019.

Yu, Gaoyang, Chen, Shuhai, Hai, Lu, Huang, Jihua, and Yang, Jian, "Low-Temperature High-Frequency Induction Brazing of 5052 Aluminum Alloy to Stainless Steel with Sn-Zn Solder," JOM, vol. 71 no. 5, pp. 1785-1792, May 2019.

Yu, H., Mhaisalkar, S. G., and Wong, E. H., "Effect of temperature on the cure shrinkage measurement of non-conductive adhesives for flip chip interconnects," Journal of Materials Research , vol. 20 no. 5, pp. 1324-1329, May 2005.

Yu, H., Vuorinen, V., and Kivilahti, J. K., "Solder/Substrate Interfacial Reactions in the Sn-Cu-Ni Interconnection System," Journal of Electronic Materials, vol. 36 no. 2, pp. 136-146, Feb. 2007.

Yu, H. C., Liu, S. H., and Chen, Chih, "Study of electromigration in thin tin film using edge displacement method," Journal of Applied Physics, vol. 98 no. 1, pp. 013540-1-013540-4, July 1, 2005.

Yu, H. Y., Yang, T. H., Chiu, Y. S., and Kao, C. R., "Surface Diffusion and the Interfacial Reaction in Cu/Sn/Ni Micro-Pillars," Journal of Electronic Materials, vol. 49 no. 1, pp. 88-95, Jan. 2020.

Yu, Haibo, Sun, Yu, Alpay, S. Pamir, and Aindow, Mark, "Solidification microstructures in Ag3Sn-Cu3Sn pseudo-binary alloys," Journal of Materials Science, vol. 51 no. 13, pp. 6474-6487, July 2016.

Yu, Hao, and Kivilahti, Jorma, "Combined Thermal, Thermodynamic and Kinetic Simulations of the Solidification of SnAgCu Interconnections," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 1, Orlando, FL, May 31-June 3, 2005, pp. 151-158.

Yu, Hao, Vuorinen, Vesa, and Kivilahti, Jorma, "Effect of Ni on the Formation of Cu6Sn5 and Cu3Sn Intermetallics," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1204-1209.

Yu, Hao, Vuorinen, Vesa, and Kivilahti, Jorma, "Effect of Ni on the Formation of Cu6Sn5 and Cu3Sn Intermetallics," IEEE Transactions on Electronics Packaging Manufacturing, vol. 30 no. 4, pp. 293-298, Oct. 2007.

Yu, Hao, and Kivilahti, Jorma K., "Nucleation Kinetics and Solidification Temperatures of SnAgCu Interconnections During Reflow Process," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 4, pp. 778-786, Dec. 2006.

Yu, Hao, and Shangguan, Dongkai, "Solidification and reliability of lead-free solder interconnection," Soldering & Surface Mount Technology, vol. 25 no. 1, pp. 31-38, 2013.

Yu, Hao, Mattila, Toni T., and Kivilahti, Jorma K., "Thermal Simulation of the Solidification of Lead-Free Solder Interconnections," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 3, pp. 475-485, Sept. 2006.

Yu, Hongwen, Hu, Shejun, Hou, Xianhua, Ru, Qiang, Zhao, Lingzhi, and Li, Weishan, "Electrochemical Performance of Tin-Aluminum Thin Film Anodes for Lithium Ion Battery," Materials Science Forum, vol. 610-613, pp. 467-471, Jan. 2009.

Yu, HongYu, Sun, Yuan, Singh, Navab, Lo, Guo-Qiang, and Kwong, Dim-Lee, "Perspective of flash memory realized on vertical Si nanowires," Microelectronics Reliability, vol. 52 no. 4, pp. 651-661, Apr. 2012.

Yu, Huicheng, Chen, Baizhen, Wu, Haiying, Sun, Xiliang, and Li, Bin, "Improved electrochemical performance of trivalent-chrome coating on Al 6063 alloy via urea and thiourea addition," Electrochimica Acta, vol. 54 no. 2, pp. 720-726, Dec. 30, 2008.

Yu, Hui-cheng, Chen, Bai-zhen, Shi, Xichang, Sun, Xiliang, and Li, Bin, "Investigation of the trivalent-chrome coating on 6063 aluminum alloy," Materials Letters, vol. 62 no. 17-18, pp. 2828-2831, June 30, 2008.

Yu, Hung Wei, Anandan, Deepak, Hsu, Ching Yi, Hung, Yu Chih, Su, Chun Jung, Wu, Chien Ting, Kakkerla, Ramesh Kumar, Ha, Minh Thien Huu, Huynh, Sa Hoang, Yi Yung, Tu, and Chang, Edward Yi, "Effect of Two-Step Metal Organic Chemical Vapor Deposition Growth on Quality, Diameter and Density of InAs Nanowires on Si (111) Substrate," Journal of Electronic Materials, vol. 47 no. 2, pp. 1071-1079, Feb. 2018.

Yu, J. J., Wu, J. Y., Yang, S., and Kao, C. R., "Effect of Ag Concentration on Ni/Sn-xAg/Ni Micro Joints under Space Confinement," 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference, Kyoto, Japan, Apr. 14-17, 2015, pp. 842-845.

Yu, J. J., Chung, C. K., Yang, S., and Kao, C. R., "Effects of Ag Concentration on the Ni-Sn Interfacial Reaction for 3D-IC Applications," 2013 IEEE International Symposium on Advanced Packaging Materials, Irvine, CA, Feb. 27-Mar. 1, 2013, pp. 113-120.

Yu, J. J., Yang, C. A., Lin, Y. F., Hsueh, C. H., and Kao, C. R., "Optimal Ag addition for the elimination of voids in Ni/SnAg/Ni micro joints for 3D IC applications," Journal of Alloys and Compounds, vol. 629, pp. 16-21, Apr. 25, 2015.

Yu, Jin, and Kim, J. Y., "Effects of residual S on Kirkendall void formation at Cu/Sn-3.5Ag solder joints," Acta Materialia, vol. xx no. xx, pp. xxxx-xxxx, xxxx.

Yu, Jin, Shin, S. W., and Kim, S. B., "Sources of Creep Data Scattering of Solders in Micro-electronic Packaging," 2007 Proceedings 57th Electronic Components & Technology Conference , Reno, NV, May 29-June 1, 2007, pp. 1796-1801.

Yu, Jin, Yang, Hui-zhen, Zu, Fang-qiu, and Xu, Wei, "The Study of Liquid-liquid Structural Transition of PbSnBi Ternary Alloy," Advanced Materials Research, vol. 152-153, pp. 242-247, 2011.

Yu, Jinglei, Williams, Eric, Ju, Meiting, and Shao, Chaofeng, "Managing e-waste in China: Policies, pilot projects and alternative approaches," Resources, Conservation and Recycling, vol. 54 no. 11, pp. 991-999, Aug. 2010.

Yu, Jinhua, Anand, Ashok, Mui, Y. C., Srinivasan, Parthasarathy, and Master, Raj, "Reliability Study on Copper Pillar Bumping with Lead Free Solder," 9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2007, pp. 618-622.

Yu, Kehang, Yang, Chen, Wang, Jun, Yu, Jiabo, and Yang, Yi, "Study on the strength of diameter-reducing solder balls by shear and pull tests," Soldering & Surface Mount Technology, vol. 31 no. 4, pp. 240-249, 2019.

Yu, L. J., Yen, H. W., Wu, J. Y., Yu, J. J., and Kao, C. R., "Micromechanical behavior of single crystalline Ni3Sn4 in micro joints for chip-stacking applications," Materials Science and Engineering: A , vol. 685, pp. 123-130, Feb. 8, 2017.

Yu, Leshu, Lv, Yingying, Zhang, Xiaolan, and Wang, Huizhen, "Application of in situ chloride-generated route to Ti5Si3 nanowires from and on Si substrate," Materials Letters, vol. 74, pp. 46-49, May 1, 2012.

Yu, Marie, and Hitchcock, Darren, "Halogen Free: A PWB Fabricator's Perspective," Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.

Yu, Marie P. Y., "Solderability of Lead-free Surface Finishes After Lead Free IR Reflow Process," HKPCA Journal, no. 10, pp. 1-9.

Yu, Michael, and Ali, Syed Wasif, "Underfill revisited: How a decades-old technique enables smaller, more durable PCBs," Embedded Systems Design (ESD), vol. 25 no. 1, pp. 22,24-28, Jan./Feb. 2012.

Yu, Phillip, "XRF and EDS Technologies (Lead Free)," empfasis, pp. 3,8, Apr. 2009.

Yu, Qiang, Kiga, Tomoya, Takeuchi, Makoto, Toi, Keiko, and Katou, Yoshihisa, "CSP Mounting Reliability with Sn-Zn-Bi in JIEP Project," Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, Dec. 11-15, 2001, pp. 1059-1063.

Yu, Qiang, Shibutani, Tadahiro, Kim, Do-Seop, Kobayashi, Yusuke, Yang, Jidong, and Shiratori, Masaki, "Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints," Microelectronics Reliability, vol. 48 no. 3, pp. 431-437, Mar. 2008.

Yu, Qiang, Jin, Jae-Chul, Kim, Do-Seop, and Shiratori, Masaki, "Fatigue Reliability Evaluation for Sn-Zn-Bi and Sn-Zn Lead-Free Solder Joints," Materials Transactions, vol. 46 no. 11, pp. 2316-2321, 2005.

Yu, Qiang, Shibutani, Tadahiro, Tanaka, Akifumi, Koyama, Takahiro, and Shiratori, Masaki, "Low-Cycle Fatigue Reliability Evaluation for Lead-Free Solders in Vehicle Electronics Devices," Proceedings of the ASME InterPack Conference, Volume 1, Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 531-537.

Yu, Qiang, Kim, Do-Seop, and Shiratori, Masaki, "The Effect of Intermetallic Compound on Thermal Fatigue Reliability of Lead-free Solder Joints," Advances in Electronic Packaging, vol. 2, pp. 1327-1334, 2001.

Yu, Qiang, Shibutani, Tadahiro, Kobayashi, Yusuke, and Shiratori, Masaki, "The Effect of Voids on Thermal Reliability of BGA Lead Free Solder Joint and Reliability Detecting Standard," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , San Diego, CA, May 30-June 2, 2006, pp. 1024-1030.

Yu, Qinrong, and Fritz, Mark A., "Development of a Lead-Free Package For Photonic Integrated Circuits," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Yu, Rick, Yu, Jui-I, Tai, Tom, Kang, C. H., Chen, Jami, Taguibao, Jowel, Tsai, Mars, Tong, Homing, and Hsieh, Ker-Chang, "Process Characteristics of 100um Bump Pitch with Lead-Free and High Lead Plating Solder Bump," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2, Singapore, Dec. 7-9, 2005, pp. 497-502.

Yu, Seon Young, Kwon, Yong-Min, Kim, Jinsu, Jeong, Taesung, Choi, Seogmoon, and Paik, Kyung-Wook, "Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) with an Embedded Die," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 4, pp. 625-633, Apr. 2012.

Yu, Shan-Pu, Chou, Yukon, Shie, Pei-ying, Lai, Chiou-Chu, and Peng, I-Hsuan, "Board-level Reliability for Lead-free QFP Assembly," 2001 Advanced Packaging Technology Conference Proceedings, 2001, pp. xx-xx.

Yu, Shan-Pu, Wang, Hsin-Chien, Hon, Min-Hsiung, and Wang, Moo-Chin, "Composition and Heat-Treatment Effects on the Adhesion Strength of Sn-Zn-Al Solders on Cu Substrate," JOM, vol. 52 no. 6, pp. 36-39, June 2000.

Yu, Shan-Pu, Wang, Hsin-Chien, Wang, Moo-Chin, and hon, Min-Hsiung, "Effect of composition and thermal cycling on the adhesion strength of Sn-Zn-Al solder hot-dipped on Cu substrate," Journal of Materials Science, vol. 37 no. 1, pp. 185-190, Jan. 2002.

Yu, Shan-Pu, Lin, Hsiu-Ju, Hon, Min-Hsiung, and Wang, Moo-Chin, "Effects of process parameters on the soldering behavior of the eutectic Sn-Zn solder on Cu substrate," Journal of Materials Science: Materials in Electronics, vol. 11 no. 6, pp. 461-471, Aug. 2000.

Yu, Shan-Pu, Wang, Moo-Chin, and Hon, Min-Hsiung, "Formation of intermetallic compounds at eutectic Sn-Zn-Al solder/Cu interface," Journal of Materials Research, vol. 16 no. 1, pp. 76-82, Jan. 2001.

Yu, Shan-Pu, Hon, Min-Hsiung, and Wang, Moo-Chin, "The Adhesion Strength of a Lead-Free Solder Hot-Dipped on Copper Substrate," Journal of Electronic Materials, vol. 29 no. 2, pp. 237-243, Feb. 2000.

Yu, Weiyuan, Liu, Yingzong, and Liu, Yun, "Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering," Journal of Electronic Materials, vol. 48 no. 9, pp. 5595-5602, Sept. 2019.

Yu, Xiao, Hu, Xiaowu, Li, Yulong, and Zhang, Ruhua, "Effect of alloying Cu substrate on microstructure and coarsening behavior of Cu6Sn5 grains of soldered joints," Journal of Materials Science: Materials in Electronics, vol. 26 no. 5, pp. 2782-2794, May 2015.

Yu, Xiaoming, Yu, Xuan, Zhang, Jianjun, Zhang, Dekun, Ni, Jian, Cai, Hongkun, Zhang, Dexian, and Zhao, Ying, "Investigation of light transmission and scattering properties in silver nanowire mesh transparent electrodes," Materials Letters, vol. 145, pp. 219-223, Apr. 15, 2015.

Yu, Xin Yong, Gong, Li Ming, Feng, Zhen (Jane), Basani, Jayapaul, and Kurwa, Murad, "Mixed Alloy Soldering Process Application for Ball Grid Array (BGA) Package," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. P-05.

Yu, Yang, Xia, Zhidong, Guo, Fu, and Shi, Yaowu, "Effects of Rare-Earth Addition on Properties and Microstructure of Lead-Free Solder Balls," Journal of Electronic Materials, vol. 37 no. 7, pp. 975-981, July 2008.

Yu, Yeonseop, Kim, Jinseok, Lim, DoKyung, Lee, SeongJae, Kim, MiYang, Lee, SangWon, and Yoo, JongSoo, "Effect of Strike Deposition on Nanoscale Voiding in Electrolytic Ni/Au," Journal of the Electrochemical Society, vol. 157 no. 12, pp. D620-D623, 2010.

Yu, Ying, Dou, Xiu-Ming, Wei, Bin, Zha, Guo-Wei, Shang, Xiang-Jun, Wang, Li, Su, Dan, Xu, Jian-Xing, Wang, Hai-Yan, Ni, Hai-Qiao, Sun, Bao-Quan, Ji, Yuan, Han, Xiao-Dong, and Niu, Zhi-Chuan, "Self-Assembled Quantum Dot Structures in a Hexagonal Nanowire for Quantum Photonics," Advanced Materials, vol. 26 no. 17, pp. 2710-2717, May 7, 2014.

Yu, Youmin, Xu, Sean, and Chiriac, Victor, "Comprehensive Evaluation of Solder Paste for Assembly of PQFN Packages," 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June 2-5, 2010, pp. xx-xx.

Yuan, Fang, and Zhang, Jianhua, "Investigation of Fine Pitch Chip on Glass with Au-Sn Thermocompression Bonding," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Yuan, Guozheng, Yang, Xuexia, and Shu, Xuefeng, "Effects of Strain Rate and Temperature on Mechanical Behavior of SACB Solder Alloy," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1186-1189.

Yuan, Jiaojiao, Wang, Xuefang, Lv, Zhicheng, Shi, Shuai, Wang, Yuzhe, and Liu, Sheng, "Study of Factors Influencing Tin Whisker Growth," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 940-944.

Yuan, Lin, Shan, Debin, Xu, Zhenhai, Wang, Lumeng, and Guo, Bin, "Atomistic simulation of the strain-hardening behavior of bicrystal Cu nanowires," Journal of Materials Research, vol. 28 no. 24, pp. 3339-3346, Dec. 28, 2013.

Yuan, Meng, Xu, Jing, Chen, Qiang, Li, Dongsheng, and Yang, Deren, "Fabrication of stabilized and dispersive copper nanowires ink," Journal of Materials Science: Materials in Electronics, vol. 29 no. 17, pp. 14989-14994, Sept. 2018.

Yuan, W., and Altieri-Weimar, P., "Modeling of LED solder joint cracking during temperature cycling with Finite Element," 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Budapest, Hungary, Apr. 19-22, 2015, pp. xx-xx.

Yuan, Y., Borzone, G., Zanicchi, G., and Delsante, S., "Lead-free soldering: Investigation of the Cu-Sn-Sb system along the Sn:Sb = 1:1 isopleth," Journal of Alloys and Compounds, vol. 509 no. 5, pp. 1595-1600, Feb. 3, 2011.

Yuan, Yuan, Li, Dajian, and Moelans, Nele, "Comments on "A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds"," Intermetallics, vol. 69, pp. 95-97, Feb. 2016.

Yuan, Yuan, Li, Dajian, Liu, Libin, and Borzone, Gabriella, "Interfacial Reactions in SnxZn1-x(Liquid)/Ni(Solid) Couples at 873 K," Journal of Electronic Materials, vol. 41 no. 9, pp. 2495-2501, Sept. 2012.

Yuan, Yuan, Guan, Yuanyuan, Li, Dajian, and Moelans, Nele, "Investigation of diffusion behavior in Cu-Sn solid state diffusion couples," Journal of Alloys and Compounds, vol. 661, pp. 282-293, Mar. 15, 2016.

Yuan, Yuan, Delsante, Simona, Li, Dajian, and Borzone, Gabriella, "The isothermal section of the Ni-Sn-Zn phase diagram at 873 K," Intermetallics, vol. 19 no. 11, pp. 1646-1650, Nov. 2011.

Yuan, Zhangfu, Wang, Rongyue, and Yu, Xiangtao, "Marangoni-Convection-Driven Bubble Behavior and Microstructural Evolution of Sn-3.5Ag/Sn-17Bi-0.5Cu (Wt Pct) Alloy Solidified on Cu Substrate Under Space Microgravity Condition," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 50 no. 11, pp. 5210-5220, Nov. 2019.

Yue, Q., Liu, Y. Q., Chu, M. Y., and Shen, J. Y., "Thermodynamic modeling of the Sn-V binary system," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 33 no. 3, pp. 539-544, Sept. 2009.

Yue, Stanedy, and Chan, Edmond, "Our experience in the introduction of Leadfree Soldering," Proceedings of 2004 International IEEE Conference on the Asian Green Electronics, Shanghai, China, Apr. 27-30, 2004, pp. 18-25.

Yue, Wu, Zhou, Min-Bo, and Zhang, Xin-Ping, "Effect of the Au bonding pad contamination on the wettability of Au/Sn-3.0Ag-0.5Cu/Au solder joints in flux-free laser jet solder ball bonding process," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 1201-1205.

Yue, Wu, and Zhang, Xin-Ping, "Essential factors influencing the wettability of Sn-3.0Ag-0.5Cu solder balls on Au pad of the right-angle solder interconnect in laser jet solder ball bonding," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 930-934.

Yue, Wu, Zhang, Jun-Xi, Gong, Cheng-Gong, Zhou, Min-Bo, and Zhang, Xin-Ping, "Identification of essential factors causing solder bridging of right-angle solder interconnects in laser jet solder ball bonding process," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Yue, Wu, Zhou, Min-Bo, Qin, Hong-Bo, Ma, Xiao, and Zhang, Xin-Ping, "Influence of Pre-existing Void in the Solder Joint on Electromigration Behavior of Cu/Sn58Bi/Cu Joints," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 1005-1009.

Yue, Wu, Zhou, Min-Bo, and Zhang, Xin-Ping, "Influence of solder ball volume on mechanical shock reliability of right-angle solder interconnects," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 1472-1475.

Yue, Wu, Qin, Hong-Bo, Zhou, Min-Bo, Xu, Guang-Sui, Cao, Shan-Shan, Ma, Xiao, and Zhang, Xin-Ping, "Influences of the Initial Thickness of the Interfacial IMC Layer on Electromigration Behavior of Cu/Sn/Cu Microscale Joints," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1320-1325.

Yuen, W. T., Liu, W. K., Joyce, B. A., and Stradling, R. A., "RHEED studies of the surface morphology of a-Sn pseudomorphically grown on InSb(100) by MBE-a new kind of non-polar/polar system," Semiconductor Science and Technology, vol. 5 no. 5, pp. 373-384, May 1990.

Yuen, W. T., Liu, W. K., Stradling, R. A., and Joyce, B. A., "The growth and electronic properties of a-Sn thin films grown on InSb(100) and (111) substrates by molecular beam epitaxy (MBE)," Journal of Crystal Growth, vol. 111 no. 1-4, pp. 943-947, May 2, 1991.

Yu-hong, Chen, Hua, Zhang, Lau, John, Wilbur, Steven, Benefiel, Monty, Yan-zhi, Shi, Hong, Cheng, Ping, Li, and Haizhou, Wang, "Determination of Lead, Cadmium, Mercury, Chromium and Arsenic in Polyethylene by Using Inductively Coupled Plasma Mass Spectrometry," IPC/JEDEC 12th International Conference on Lead Free Electronic Components and Assemblies , Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.

Yuile, A., and Wiese, S., "CFD Simulations of Wave Soldering on Through-Hole Printed Circuit Assemblies," 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Budapest, Hungary, Apr. 19-22, 2015, pp. xx-xx.

Yuile, Adam, Wiese, Steffen, and Wohlrabe, Heinz, "Improved CFD Analysis of Wave Soldering in Pin Through-Hole Technology," 2015 European Microelectronics Packaging Conference, Friedrichshafen, Germany, Sept. 14-16, 2015, pp. xx-xx.

Yuk, Hyung-Sang, Trivedi, Krutarth, Oh, Jin-Heon, and Lim, Kee-Joe, "Hole Transconductance of [100] Long-Channel Si Nanowire Transistor," Journal of Electronic Materials, vol. 45 no. 11, pp. 5638-5646, Nov. 2016.

Yuksel, Recep, Coskun, Sahin, and Unalan, Husnu Emrah, "Coaxial silver nanowire network core molybdenum oxide shell supercapacitor electrodes," Electrochimica Acta, vol. 193, pp. 39-44, Mar. 1, 2016.

Yumoto, H., Ohkawa, A., and Hasiguti, R. R., "Morphology and Growth Mechanism of Vapor Grown Zn Crystals as Affected by Impurity Sn," Journal of Crystal Growth, vol. 62 no. 2, pp. 433-438, July 1983.

Yumoto, Hisami, Hasiguti, Ryukiti, and Kaneko, Tsutomu, "Changes in the Morphologies of hcp Metals Grown from the Vapor Phase After the Cessation of VLS (Vapor-Liquid-Solid) Growth," Journal of Crystal Growth, vol. 68 no. 3, pp. 765-770, Oct. 1984.

Yumoto, Hisami, Hasiguti, Ryukiti R., and Kaneko, Tsutomo, "Impurity Effect on Surface Morphology of Cd and Zn Crystals Grown by VLS Mechanism," Journal of Crystal Growth, vol. 75 no. 2, pp. 284-288, May 2, 1986.

Yumoto, Hisami, Gotoh, Yoshihiko, Igata, Naohiro, and Kishi, Kiyoshi, "Morphological instability of Zn crystals grown by VLS mechanism from Zn-Bi monotectic droplets," Journal of Crystal Growth, vol. 99 no. 1-4, pp. 217-221, Jan 1990.

Yumoto, Hisami, Hasiguti, Ryukiti R., and Kuriyama, Yasuo, "Morphologies of Cd Crystals Grown by VLS Mechanism with Sn Impurities," Journal of Crystal Growth, vol. 67 no. 2, pp. 383-384, July 1984.

Yumoto, Hisami, Kaneko, Tsutomu, Hasiguti, Ryukiti R., and Watanabe, Tsuneo, "Morphology and Growth Mechanism of VLS Grown Zn Crystals from Zn-Bi Monotectic Droplets," Journal of Crystal Growth, vol. 84 no. 2, pp. 185-190, Aug. 1987.

Yun, Sang-Hyun, Yoo, Seong Min, Sohn, Byeong-Hyeok, Jung, Jin Chul, Zin, Wang-Cheol, Kwak, Seung-Yeop, and Lee, Taek Seung, "Electrically Anisotropic Thin Films Consisting of Polymeric and Metallic Nanolayers from Self-Assembled Lamellae of Diblock Copolymers." Langmuir , vol. 21 no. 8, pp. 3625-3628, Apr. 12, 2005.

Yun, Sungryul, Niu, Xiaofan, Yu, Zhibin, Hu, Weili, Brochu, Paul, and Pei, Qibing, "Compliant Silver Nanowire-Polymer Composite Electrodes for Bistable Large Strain Actuation," Advanced Materials, vol. 24 no. 10, pp. 1321-1327, Mar. 8, 2012.

Yun, Young, Nishijima, Masaaki, Katsuno, Motonari, Ishida, Hidetoshi, Minagawa, Katsuya, Nobusada, Toshihide, and Tanaka, Tsuyoshi, "A Fully Integrated Broad-Band Amplifier MMIC Employing a Novel Chip-Size Package," IEEE Transactions on Microwave Theory and Techniques, vol. 50 no. 12, pp. 2930-2937, Dec. 2002.

Yunan, James, Dzarnoski, John, and Ellingboe, Jay, "Lessons Learned Converting a Class I Medical Flex Circuit to RoHS Compliance," 2006 Medical Electronics Symposium Conference Proceedings , Minneapolis, MN, May 15-17, 2006, pp. xx-xx.

Yung, K. C., Law, C. M. T., Lee, C. P., Cheung, B., and Yue, T. M., "Size Control and Characterization of Sn-Ag-Cu Lead-Free Nanosolders by a Chemical Reduction Process," Journal of Electronic Materials, vol. 41 no. 2, pp. 313-321, Feb. 2012.

Yung, W. K. C., Chan, H. K., Choi, A. C. K., Yue, T. M., and Mazhar, M. I., "An environmental assessment framework with respect to the Requirements of Energy-using Products Directive," Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, vol. 222 no. 5, pp. 643-651, May 2008.

Yung, Winco K. C. Liem, Hai Ming, Choy, Henry H. S., and Man, Yuen Wah, "Correlating Interconnect Stress Test and Accelerated Thermal Cycling for Accessing the Reliabilities of High Performance Printed Circuit Boards," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 12, pp. 2005-2017, Dec. 2011.

Yunhui, Qi, Guangfu, Liu, Zhifeng, Liu, and Shuwang, Wang, "Analyzing and Modeling of Uncertainty Factors Influencing Product Recyclability," Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, New Orleans, LA, May 16-19, 2005, pp. 25-30.

Yunus, M., Primavera, A., Srihari, K., and Pitarresi, J. M., "Effect of Voids on the Reliability of BGA/CSP Solder Joints" Twenty-Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium, Santa Clara, CA, Oct. 2-3, 2000, pp. 207-213.

Yunus, Mohammad, Srihari, K., Pitarresi, J. M., and Primavera, Anthony, "Effect of voids on the reliability of BGA/CSP solder joints," Microelectronics Reliability, vol. 43 no. 12, pp. 2077-2086, Dec. 2003.

Yusoff, Wan Yusmawati Wan, Ismail, Norliza, Safee, Nur Shafiqa, Ismail, Ariffin, Jalar, Azman, and Bakar, Maria Abu, "Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition," Soldering & Surface Mount Technology, vol. 31 no. 2, pp. 102-108, 2019.

ZZZZ

Zaal, J. J. M., Hochstenbach, H. P., van Driel, W. D., and Zhang, G. Q., "An Alternative Solder Interconnect Reliability Test to Evaluate Drop Impact Performance," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1181-1186.

Zaal, J. J. M., van Driel, W. D., Kessels, F. J. H. G., and Zhang, G. Q., "Correlating Drop Impact Simulations with Drop Impact Testing using High-Speed Camera Measurements," International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, Freiburg, Germany, Apr. 20-23, 2008, pp. xx-xx.

Zaal, J. J. M., van Driel, W. D., Kessels, F. J. H. G., and Zhang, G. Q., "Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements," Journal of Electronic Packaging, vol. 131 no. 1, pp. 011007-1-011007-9, Mar. 2009.

Zaal, J. J. M., Hochstenbach, H. P., van Driel, W. D., and Zhang, G. Q., "Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull," Microelectronics Reliability, vol. 49 no. 8, pp. 846-852, Aug. 2009.

Zaal, J. J. M., van Driel, W. D., Hochstenbach, H. P., and Zhang, G. Q., "Testing Solder Interconnect Reliability Under Drop Impact Loading Conditions," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Zaal, J. J. M., van Driel, W. D., Kessels, F. J. H. G., and Zhang, G. Q., "Verification of Drop Impact Simulations Using High-Speed Camera Measurements," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 2149-2155.

Zabaniotou, A., Kouskoumvekaki, E., and Sanopoulos, D., "Recycling of spent lead/acid batteries: the case of Greece," Resources, Conservation and Recycling, vol. 25 no. 3-4, pp. 301-317, Mar. 1, 1999.

Zabdyr, Leszek A., and Garzel, G., "Critical assessment of the Ag-Bi-Sn ternary system," Calphad: Computer Coupling of Phase Diagrams and Thermochemistry, vol. 33 no. 1, pp. 187-191, Mar. 2009.

Zabel, Claus, and Filor, Uwe, "Secure Lead-Free Processes and Minimize Delta T's," Circuitnet .

Zabel, Claus, "Vapourphase vacuum-soldering. A new process technology opens tremendous production capabilities when reflow-soldering," Circuitnet.

Zabel, Claus, and Duck. Allen, Vapourphase Vacuum-Soldering: A New Process Technology Opens Tremendous Production Capabilities when Reflow-Soldering," International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 19-22, 2009, pp. xx-xx.

Zaccari, J. S., "Pure Tin Plated Leads - Problems and Mitigation," IPC/JEDEC Third International Conference on Lead-Free Electronic Components and Assemblies , San Jose, CA, Apr. 23-24, 2003, pp. 258-261.

Zaccari, Joe, "Lead-Free Component Finishes: Problems and Mitigation," 2004 IEEE Microelectronics Reliability and Qualification Workshop, Manhattan Beach, CA, Feb. 3-4, 2004, pp. xx-xx.

Zaccari, Joseph, "Lead-Free Component Finishes - Problems and Mitigation," 2004 Medical Electronics Symposium Conference Proceedings, Bloomington, MN, May 19-20, 2004, pp. xx-xx.

Zaccaria, B., "Filler materials: The current situation and future trends with particular reference to lead-free soldering alloys," Welding International, vol. 15 no. 7, pp. 545-550, 2001.

Zaccheroni, Giulio, "A new vertical hot-dipped wire galvanizing system for thin coatings," Wire Journal International, vol. 37 no. 12, pp. 64-68, Dec. 2004.

Zachariasz, Piotr, Skwarek, Agata, Illes, Balazs, Zukrowski, Jan, Hurtony, Tamas, and Witek, Krzysztof, "Mossbauer studies of b->a phase transition in Sn-rich solder alloys," Microelectronics Reliability, vol. 82, pp. 165-170, Mar. 2018.

Zackrisson, Mats, Avellan, Lars, and Orlenius, Jessica, "Life cycle assessment of lithium-ion batteries For plug-in hybrid electric vehicles - Critical issues," Journal of Cleaner Production, vol. 18 no. 15, pp. 1519-1529, Nov. 2010.

Zaghouani, R. Benabderrahmane, Tabassi, M. Yaacoubi, Khirouni, K., and Dimassi, W., "Vapor-liquid-solid silicon nanowires growth catalyzed by indium: study of indium oxide effect," Journal of Materials Science: Materials in Electronics, vol. 30 no. 10, pp. 9758-9766, May 2019.

Zahn, Bret A., "Solder Joint Fatigue Life Model Methodology for 63Sn37Pb and 95.5Sn4Ag0.5Cu Materials," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 83-94.

Zahn, Mark, "Chromate Conversions," Plating & Surface Finishing, vol. 82 no. 7, pp. 43-44, July 1995.

Zahn, Mark, "More on the Mettle of Metals - Speaking of Zinc ...," Plating & Surface Finishing, vol. 82 no. 2, pp. 42-43, Feb. 1995.

Zahn, Mark, "The Mettle of Metals, Continued ...," Plating & Surface Finishing , vol. 82 no. 4, pp. 65-66, Apr. 1995.

Zahran, H. Y., El-Rehim, A. F. Abd, and AlFaify, S., "Effect of Graphitic Carbon Nitride Nanosheets Addition on the Microstructure and Mechanical Properties of Sn-3.5Ag-0.5Cu Solder Alloy," Journal of Electronic Materials, vol. 47 no. 9, pp. 5614-5624, Sept. 2018.

Zaia, Eric, Andre, Clement, and Moreau, Beatrice, "Comparison between SnPb/SAC305 Solders: Structure and Intermetallics Morphologies after Thermal Stress," 5th Electronic Materials and Assembly Processes for Space (EMPS) Workshop, Noordwijk, The Netherlands, May 2014, pp. xx-xx.

Zak, Joelie, "Hex Chrome PEL Guidance," Metal Finishing, vol. 104 no. 5, pp. 41-43, May 2006.

Zak, Pavel, Tucan, Marek, and Kudlacek, Ivan, "Homogeneity of Joints Made of Electrically Conductive Adhesive," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 225-228.

Zak, Pavel, Tucan, Marek, and Kudlacek, Ivan, "Lead-free Car Electronics According to Updated ELV Directive," 2011 International Conference on Applied Electronics, Pilsen, Czech Republic, Sept. 7-8, 2011, pp. xx-xx.

Zak, Pavel, Tucan, Marek, and Urbanek, Jan, "Mechanical Stress Tests of SMT Attachments," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 262-266.

Zak, Pavel, Tucan, Marek, and Urbanek, Jan, "Post-Curing Behavior of Two-Component Electrically Conductive Adhesive," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 258-261.

Zak, Pavel, Tucan, Marek, and Kudlacek, Ivan, "Tin Coating of Connectors - Reliability Risk for Electrical Equipment," 2011 34th International Spring Seminar on Electronics Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 229-233.

Zaka, H., Shenouda, S. S., Fouad, S. S., Medhat, M., Katona, G. L., Csik, A., Langer, G. A., and Beke, D. L., "Formation of Cu6Sn5 phase by cold homogenization in nanocrystalline Cu-Sn bilayers at room temperature," Microelectronics Reliability, vol. 56, pp. 85-92, Jan. 2016.

Zakel, E., Simon, J., Azdasht, G., and Reichl, H., "Gold-Tin Solder Bumps for TAB Inner Lead Bonding with Reduced Bonding Pressure," Soldering & Surface Mount Technology, vol. 4 no. 3, pp. 27-32, 1992.

Zakel, Elke, and Reichl, Herbert, "Au-Sn Bonding Metallurgy of TAB Contacts and its Influence on the Kirkendall Effect in the Ternary Cu-Au-Sn System," 1992 Proceedings 42nd Electronic Components & Technology Conference, San Diego, CA, May 18-20, 1992, pp. 360-371.

Zakel, Elke, and Reichl, Herbert, "Au-Sn Bonding Metallurgy of TAB Contacts and its Influence on the Kirkendall Effect in the Ternary Cu-Au-Sn System," 1992 Proceedings 42nd Electronic Components & Technology Conference, San Diego, CA, May 18-20, 1992, pp. 360-371.

Zakel, Elke, and Reichl, Herbert, "Au-Sn Bonding Metallurgy of TAB Contacts and Its Influence on the Kirkendall Effect in the Ternary Cu-Au-Sn," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 16 no. 3, pp. 323-332, May 1993.

Zakel, Elke, Gwiasda, Jorg, Kloeser, Joachim, Eldring, Joachim, Engelmann, Gunter, and Reichl, Herbert, "Fluxless Flip Chip Assembly on Rigid and Flexible Polymer Substrates Using the Au-Sn Metallurgy," Sixteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, La Jolla, CA, Sept. 12-14, 1994, pp. 177-184.

Zakel, Elke, Villain, Jurgen, and Reichl, Herbert, "Reliability and Au-Concentration in OLB Solder Fillets of TAB-Devices Having a 75 um Pitch," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, vol. 19 no. 1, pp. 138-147, Feb. 1996.

Zakharov, N., Werner, P., Sokolov, L., and Gosele, U., "Growth of Si whiskers by MBE: Mechanism and peculiarities," Physica E: Low-dimensional Systems and Nanostructures, vol. 37 no. 1-2, pp. 148-152, March 2007. https://doi.org/10.1016/j.physe.2006.07.018

Zakharov, N. D., Werner, P., Gerth, G., Schubert, L., Sokolov, L., and Gosele, U., "Growth phenomena of Si and Si/Ge nanowires on Si (1 1 1) by molecular beam epitaxy," Journal of Crystal Growth, vol. 290 no. 1, pp. 6-10, Apr. 15, 2006.

Zaki, Nabil, "Advances in Trivalent Chrome Plating," Proceedings of The International Technical Conference of AESF SUR/FIN, Anaheim, CA, June 21-24, 1993, pp. 461-470.

Zaki, Nabil, "Chromium Plating," Products Finishing, vol. xx no. xx, pp. xx-xx, June 9, 2003.

Zaki, Nabil, "Corrosion Potential of Zinc Alloys," PF Online.

Zaki, Nabil, "Trivalent Chrome Conversion Coating for Zinc and Zinc Alloys," Metal Finishing, vol. 103 no. 6A, pp. 380, 382-389, Summer 2005.

Zaki, Nabil, "Trivalent Chrome Conversion Coating for Zinc and Zinc Alloys," Metal Finishing, vol. 105 no. 10, pp. 425-426,428,430-435, Oct. 2007.

Zakraysek, L., "Whisker Growth From a Bright Acid Tin Electrodeposit," Plating and Surface Finishing, vol. 64 no. 3, pp. 38-43, Mar. 1977.

Zakraysek, Louis, "Intermetallic Characterization," 11th Annual Reliability Physics Symposium, Las Vegas, NV, Apr. 3-5, 1973, pp. 6-9.

Zakraysek, Louis, "Microelectronic Component Lead Finishes," Plating and Surface Finishing , vol. 68 no. 9, pp. 72-76, Sept. 1981.

Zaky, A. M., Pickering, H. W., and Well, K. G., "Microstructure & Corrosion Behavior Of Electrodeposited Zn-Ni Films," Plating & Surface Finishing, vol. 88 no. 10, pp. 48-50, Oct. 2001.

Zama, Satoru, Baldwin, Daniel F., Hikami, Toshiya, and Murata, Hideaki, "Flip Chip Interconnect Systems Using Wire Stud Bumps and Lead Free Solder," 2000 Proceedings 50th Electronic Components & Technology Conference , Las Vegas, NV, May 21-24, 2000, pp. 1111-1117.

Zama, Satoru, Baldwin, Daniel F., Hikami, Toshiya, and Murata, Hideaki, "Flip Chip Interconnect Systems Using Copper Wire Stud Bump and Lead Free Solder," IEEE Transactions on Electronics Packaging Manufacturing , vol. 24 no. 4, pp. 261-268, Oct. 2001.

Zamani, Mahdi, Imbalzano, Giulio, Tappy, Nicolas, Alexander, Duncan T. L., Marti-Sanchez, Sara, Ghisalberti, Lea, Ramasse, Quentin M., Friedl, Martin, Tutuncuoglu, Gozde, Francaviglia, Luca, Bienvenue, Sebastien, Hebert, Cecile, Arbiol, Jordi, Ceriotti, Michele, and i Morral, Anna Fontcuberta, "3D Ordering at the Liquid-Solid Polar Interface of Nanowires," Advanced Materials, vol. 32 no. 38, pp. 2001030-1-2001030-8, Sept. 24, 2020. https://doi-org.ezproxy.uky.edu/10.1002/adma.202001030

Zamborsky, Ed, "Extending Tip Life in Pb-Free Hand Soldering," Circuits Assembly , vol. 18 no. 2, pp. 72-74, Feb. 2007.

Zamiri, A., Bieler, T. R., and Pourboghrat, F., "Anisotropic Crystal Plasticity Finite Element Modeling of the Effect of Crystal Orientation and Solder Joint Geometry on Deformation after Temperature Change," Journal of Electronic Materials, vol. 38 no. 2, pp. 231-240, Feb. 2009.

Zan, Muhammad Hafiz, Salleh, M. A. A. Mohd, and Ahmad, Zainal Ariffin, "Mixing Optimization of Sn-Cu-Si3N4 via Powder Metallurgy Route for Composite Solder Fabrication," Key Engineering Materials, vol. 594-595, pp. 765-769, Dec. 2013.

Zang, Likun, Yuan, Zhangfu, Cao, Zhanmin, Matsuura, Hiroyuki, and Tsukihashi, Fumitaka, "Reactive Wetting Processes and Triple-Line Configuration of Sn-3.5Ag on Cu Substrates at Elevated Temperatures," Journal of Electronic Materials , vol. 41 no. 8, pp. 2051-2056, Aug. 2012.

Zang, Likun, Yuan, Zhangfu, Zhao, Hongxin, and Zhang, Xiaorui, "Wettability of molten Sn-Bi-Cu solder on Cu substrate," Materials Letters, vol. 63 no. 23, pp. 2067-2069, Sept. 30, 2009.

Zannier, V., Grillo, V., and Rubini, S., "Diameter-dependent morphology of vapour-solid-solid grown ZnSe nanowires," Journal of Physics D: Applied Physics, vol. 47 no. 39, pp. 394005-1-394005-8, Oct. 1, 2014.

Zapanta, Loren R., "Tin Whisker White Paper: JESD201 Approach," Cypress, Sept. 2012.

Zapfardt, H. J., "Apocalypse RoHS Now!," Circuits Assembly, vol. 17 no. 6, pp. 20, June 2006.

Zarmai, M. T., Ekere, N. N., Oduoza, C. F., and Amalu, E. H., "Optimization of thermo-mechanical reliability of solder joints in crystalline silicon solar cell assembly," Microelectronics Reliability, vol. 59, pp. 117-125, Apr. 2016.

Zarrow, Phil, "All You Really Want To Know About XRF," Circuits Assembly, vol. 18 no. 2, pp. 32, 34, Feb. 2007.

Zarrow, Phil, "Black Pad - A Scourge on Your Boards," Circuits Assembly, vol. 19. no. 4, pp. 20, Apr. 2008.

Zarrow. Phil, "Lead Free: Act, Don't React," Circuits Assembly, vol. 11 no. 6, pp. 20,22, June 2000.

Zarrow. Phil, "Lead-Free: Don't Fight a Fact, Deal With It!," Circuits Assembly , vol. 10 no. 8, pp. 18,20, Aug. 1999.

Zarrow, Phil, Hall, Jim, and Klenke, Bob, "Lead-Free Implementation: The Other 90%," ITM Consulting.

Zarrow, Phil, "Lead-Free or Die," Circuits Assembly, vol. 16 no. 3, pp. 22, Oct. 2005.

Zarrow, Phil, "Occam is Just Alright With Me," Circuits Assembly, vol. 18 no. 12, pp. 21, Dec. 2007.

Zarrow, Phil, "Pb-Free Solder Joint Reliability," Circuits Assembly, vol. 17 no. 12, pp. 24, Dec. 2006.

Zarrow, Phil, "Reflow Profiling: Do It Right," Circuits Assembly, vol. 17 no. 2, pp. 36-37, Feb. 2006.

Zarrow, Phil, "RoHS Rumors," Circuits Assembly, vol. 17 no. 8, pp. 27, Aug. 2006.

Zarrow, Phil, "RoHS: The Really Obnoxious and Highly Suspect Directive," Circuits Assembly, vol. 16 no. 2, pp. 28-29, Feb. 2005.

Zarrow, Phil, "The Deadly Sins of Pb-Free Assembly," Circuits Assembly, vol. 18 no. 4, pp. 26-27, Apr. 2007.

Zarrow, Phil, "The Five Stages of Lead Free," Circuits Assembly, vol. 15 no. 8, pp. 18-19, Aug. 2004.

Zarrow, Phil, Daniels, Ron, and Hall, Jim, "The Truth Shall Make You Lead Free," Circuits Assembly, vol. 15 no. 6, pp. 14-16, June 2004.

Zarrow, Phil, "Things That Go Zap In The Night," Circuits Assembly, vol. 18 no. 6, pp. 25-26, June 2007.

Zarrow, Phil, "To the Finish," Circuits Assembly, vol. 19 no. 10, pp. 20,23, Oct. 2008.

Zavarine, I. S., Khaselev, O., Zhang, Yun, Xu, C., Fan, C., and Abys, J., "Lead-free Solder Bumping Technologies," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S15-3-1-S15-3-13.

Zavodinsky, V. G., Lebukhova, N. V., Karpovich, N. F., and Pugachevsky, M. A., "Growth of tungsten whiskers oriented in <111> direction," Crystal Research and Technology, vol. 45 no. 9, pp. 969-972, Sept. 2010.

Zbrzezny, A. R., Snugovsky, P., and Perovic, D. D., "Impact of board and component metallizations on microstructure and reliability of lead-free solder joints," Microelectronics Reliability , vol. 47 no. 12, pp. 2205-2214, Dec. 2007.

Zbrzezny, Adam R., Snugovsky, Polina, Lindsay, Tanya, and Lau, Ross, "Reliability Investigation of Mixed BGA Assemblies." IEEE Transactions on Electronics Packaging Manufacturing, vol. 29 no. 3, pp. 211-216, July 2006.

Zbrzezny, Adam R., Snugovsky, Polina, Lindsay, Tanya, and Lau, Ross, "Reliability Investigation of Sn-Ag-Cu BGA Memory Modules Assembled with Sn-Pb Eutectic Paste Using Different Reflow Profiles," International Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005, pp. xx-xx.

Zbrzezny, Adam R., Mclellan, Neil, and Lee, Yeong J., "Reliability of High I/O Count Wafer Level Packages," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 309-313.

Zbrzezny, Adam R., Snugovsky, Polina, Lindsay, Tanya, and Lau, Ross, "Reliability of Mixed Solder Interconnects - Case Studies," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 397-402.

Zdetsis, Aristides D., "On the Lattice Dynamics of Grey Tin," Journal of Physics and Chemistry of Solids, vol. 38 no. 10, pp. 1113-1116, 1977.

Zdzislaw, Drozd, Jaroslaw, Bronowski, Jaroslaw, Drozd, and Marcin, Szwech, "Accelerated fatigue test methods of lead-free solder joints in surface mounting technology," 27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, Volume 1, Sofia, Bulgaria, May 13-16, 2004, pp. 99-104.

Zdzislaw, Drozd, and Marcin, Szwech, "Failure Modes and Fatigue Testing Characteristics of SMT Solder Joints," 1st Electronics Systemintegration Technology Conference, Volume 2 , Dresden, Germany, Sept. 5-7, 2006, pp. 1187-1193.

Zdzislaw, Drozd, Marcin, Szwech, and Jaroslaw, Bronowski, "Quality and Reliability Assurance by Implementation of Lead - Free Technology in Electronic Industry," 26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials, The High Tatras, Slovak Republic, May 8-11, 2003, pp. 63-67.

Zednicek, T., Vasina, P., Sita, Z., and Vrana, B., "Lead-Free Soldering Effect to Tantalum Capacitors," 26th International Spring Seminar on Electronics Technology, Stara Lesna, Slovak Republic, May 8-11, 2003, pp. 85-89.

Zee, Bernice, Zhao, Xiaole, Joman, Pin Pin, Chin, J. M., and Master, Raj N., "Orientation Determination of Flip-Chip Pb-free Solder for TEM Application," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Zeng, Dong-ming, Hu, Ai-ping, Shu, Wan-yin, Liu, You-nian, and Lei, Cun-xi, "Study on the method of recovering and separating indium from residue containing indium," Journal of Central South University of Technology , vol. 9 no. 2, pp. 104-106, June 2002.

Zeng, G., Callaghan, M. D., McDonald, S. D., Yasuda, H., and Nogita, K., "In situ studies revealing dendrite and eutectic growth during the solidification of Sn-0.7Cu-0.5Ag Pb-free solder alloy," Journal of Alloys and Compounds, vol. 797, pp. 804-810, Aug. 15, 2019.

Zeng, Guang, Xue, Songbai, Zhang, Liang, Gao, Lili, Dai, Wei, and Luo, Jiadong, "A review on the interfacial intermetallic compounds between Sn-Ag-Cu based solders and substrates," Journal of Materials Science: Materials in Electronics, vol. 21 no. 5, pp. 421-440, May 2010.

Zeng, Guang, McDonald, Stuart, and Nogita, Kazuhiro, "Development of high-temperature solders: Review," Microelectronics Reliability, vol. 52 no. 7, pp. 1306-1322, July 2012.

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, and Nogita, Kazuhiro, "Effect of Zn, Au, and In on the polymorphic phase transformation in Cu6Sn5 intermetallics," Journal of Materials Research, vol. 27 no. 20, pp. 2609-2614, Oct. 28, 2012.

Zeng, Guang, Xue, Songbai, Gao, Lili, Zhang, Liang, Hu, Yuhua, and Lai, Zhongmin, "Interfacial microstructure and properties of Sn-0.7Cu-0.05Ni/Cu solder joint with rare earth Nd addition," Journal of Alloys and Compounds, vol. 509 no. 25, pp. 7152-7161, June 23, 2011.

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo, and Nogita, Kazuhiro, "Kinetics of the b->a Transformation of Tin: Role of a-Tin Nucleation," Crystal Growth & Design, vol. 15 no. 12, pp. 5767-5773, 2015.

Zeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen, and Nogita, Kazuhiro, "Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints," Intermetallics, vol. 54, pp. 20-27, Nov. 2014.

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Suenaga, Shoichi, Zhang, Yong, Chen, Jianghua, and Nogita, Kazuhiro, "Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In," Intermetallics, vol. 43, pp. 85-98, Dec. 2013.

Zeng, Guang, Xue, Songbai, Zhang, Liang, Gao, Lili, Lai, Zhongmin, and Luo, Jiadong, "Properties and microstructure of Sn-0.7Cu-0.05Ni solder bearing rare earth element Pr," Journal of Materials Science: Materials in Electronics , vol. 22 no. 8, pp. 1101-1108, Aug. 2011.

Zeng, Guang, Xue, Songbai, Zhang, Liang, and Gao, Lili, "Recent advances on Sn-Cu solders with alloying elements: review," Journal of Materials Science: Materials in Electronics, vol. 22 no. 6, pp. 565-578, June 2011.

Zeng, Guang, Xue, Songbai, Zhang, Liang, Sheng, Zhong, and Gao, Lili, "Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments," Soldering & Surface Mount Technology, vol. 22 no. 4, pp. 57-64, 2010.

Zeng, Guang, McDonald, Stuart D., Gourlay, Christopher M., Uesugi, Kentaro, Terada, Yasuko, Yasuda, Hideyuki, and Nogita, Kazuhiro, "Solidification of Sn-0.7Cu-0.15Zn Solder: In Situ Observation," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 45 no. 2, pp. 918-926, Feb. 2014.

Zeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen, Salleh, M. A. A. Mohd, and Nogita, Kazuhiro, "The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints," Journal of Alloys and Compounds, vol. 685, pp. 471-482, Nov. 15, 2016.

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Terada, Yasuko, Uesugi, Kentaro, Yasuda, Hideyuki, and Nogita, Kazuhiro, "The influence of Ni and Zn additions on microstructure and phase transformations in Sn-0.7Cu/Cu solder joints," Acta Materialia, vol. 83, pp. 357-371, Jan. 15, 2015.

Zeng, Guang, McDonald, Stuart D., Sweatman, Keith, and Nogita, Kazuhiro, "Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics," 2014 International Conference on Electronics Packaging, Toyoma, Japan, Apr. 23-25, 2014, pp. 135-139.

Zeng, Jinfeng, Chen, Xiaopeng, Ren, Xin, and Ma, Yanqing, "Effect of AgNPs/Reduced Graphene Oxide Nanocomposites on the Electrical Performance of Electrically Conductive Adhesives," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 39-42.

Zeng, Jinfeng, Tian, Xun, Song, Jingsi, Wei, Zhong, Harrington, Steven, Yao, Yagang, Ma, Lei, and Ma, Yanqing, "Green synthesis of AgNPs/reduced graphene oxide nanocomposites and effect on the electrical performance of electrically conductive adhesives," Journal of Materials Science: Materials in Electronics, vol. 27 no. 4, pp. 3540-3548, Apr. 2016.

Zeng, Jinfeng, Ma, Hongru, Tian, Xun, and Ma, Yanqing, "In Situ Hydrothermal Synthesis of Silver Nanoparticle Based on Graphene and Their Application for Electrically Conductive Adhesive," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 57-60.

Zeng, Jing-Bo, Xu, Guang-Sui, Zhou, Min-Bo, and Zhang, Xin-Ping, "Isothermal Aging Effect on Microstructure and Mechanical Properties of Ni/Sn3.0Ag0.5Cu/Ni Interconnects with the Decreasing Height," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 997-1004.

Zeng, Jing-Bo, Xu, Guang-Sui, Zhou, Min-Bo, Ma, Xiao, and Zhang, Xin-Ping, "Microstructural Evolution and Mechanical Behavior of Line-type Ni/Sn3.0Ag0.5Cu/Ni Interconnects with a Small Thickness during Isothermal Aging," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1303-1307.

Zeng, Jing-Bo, Xu, Guang-Sui, Zhou, Min-Bo, and Zhang, Xin-Ping, "Volume Effect on Interfacial Microstructure and Mechanical Properties of Ni(UBM)/Sn3.0Ag0.5Cu/Ni(UBM) Joints," 2012 14th International Conference on Electronic Materials and Packaging, Hong Kong, Dec. 13-16, 2012, pp. xx-xx.

Zeng, K., Vuorinen, V., and Kivilahti, J. K., "Intermetallic Reactions between Lead-free SnAgCu Solder and Ni(P)/Au Surface Finish on PWBs," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 693-698.

Zeng, K., and Tu, K. N., "Six cases of reliability study of Pb-free solder joints in electronic packaging technology," Materials Science and Engineering, vol. 38 no. 2, pp. 55-105, June 2002. https://doi.org/10.1016/S0927-796X(02)00007-4

Zeng, K., and Kivilahti, J. K., "Use of Multicomponent Phase Diagrams for Predicting Phase Evolution in Solder/Conductor Systems," Journal of Electronic Materials, vol. 30 no. 1, pp. 35-44, Jan. 2001.

Zeng, Kejun, and Holdford, Becky, "Effect of Cu Content on the Interfacial Reliability of SnAgCu Solder Joints," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 652-659.

Zeng, Kejun, Vuorinen, Vesa, and Kivilahti, Jorma K., "Interfacial Reactions Between Lead-Free SnAgCu Solder and Ni(P) Surface Finish on Printed Circuit Boards," IEEE Transactions on Electronics Packaging Manufacturing, vol. 25 no. 3, pp. 162-167, July 2002.

Zeng, Kejun, "Lead-free Soldering: Materials Science and Solder Joint Reliability," JOM, vol. 61 no. 6, pp. 28, June 2009.

Zeng, Kejun, Pierce, Mike, Miyazaki, Hiroshi, and Holdford, Becky, "Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective," Journal of Electronic Materials, vol. 41 no. 2, pp. 253-261, Feb. 2012.

Zeng, Kejun, Stierman, Roger, Abbott, Don, and Murtuza, Masood, "Root Cause of Black Pad Failure of Solder Joints with Electroless Nickel/Immersion Gold Plating," Proceedings 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30-June 2, 2006, pp. 1111-1119.

Zeng, Kejun, Stierman, Roger, Abbott, Don, and Murtuza, Masood, "The Root Cause of Black Pad Failure of Solder Joints with Electroless Ni/Immersion Gold Plating," JOM, vol. 58 no. 6, pp. 75-79, June 2006.

Zeng, Kejun, and Nangia, Amit, "Thermal Cycling Reliability of SnAgCu Solder Joints in WLCSP," 2014 IEEE 16th Electronics Packaging Technology Conference, Singapore, Dec. 3-5, 2014, pp. 503-511.

Zeng, Ming, Chen, Zheng-zhou, Shen, Bao-luo, and Xu, Dao-fen, "Indentation creep behavior of Sn-3.5Ag-2Bi lead-free solder," Zhongguo Youse Jinshu Xuebao/ Chinese Journal of Nonferrous Metals, vol. 18 no. 4, pp. 620-625, Apr. 2008.

Zeng, Qiu-lian, Wang, Zhong-Guang, Xian, Ai-ping, and Shang, J. K., "Cyclic Softening of the Sn-3.8Ag-0.7Cu Lead-Free Solder Alloy with Equiaxed Grain Structure," Journal of Electronic Materials, vol. 34 no. 1, pp. 62-67, Jan. 2005.

Zeng, Qiu Lian, Wang, Zhong Guang, and Shang, J. K., "Microstructural Effects on Low Cycle Fatigue of Sn-3.8Ag-0.7Cu Pb-free solder," Key Engineering Materials, vol. 345-356 I, pp. 239-242, 2007.

Zeng, Qiulian, Guo, Jianjun, Gu, Xiaolong, and Zhao, Xinbing, "Liquid-State Interfacial Reaction of Sn-10Sb-5Cu High Temperature Lead-Free Solder and Cu Substrate," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Zeng, Qiulian, Guo, Jianjun, Gu, Xiaolong, Zhao, Xinbing, and Liu, Xiaogang, "Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate," Journal of Materials Science and Technology, vol. 26 no. 2, pp. 156-162, Feb. 2010.

Zeng,, X. B., Liao, X. B., Wang, B., Dai, S. T., Xu, Y. Y., Xiang, X. B., Hu, Z. H., Diao, H. W., and Kong, G. L., "Optical properties of boron-doped Si nanowires," Journal of Crystal Growth, vol. 265 no. 1-2, pp. 94-98, Apr. 15, 2004.

Zeng, X. B., Xu, Y. Y., Zhang, S. B., Hu, Z. H., Diao, H. W., Wang, Y. Q., Kong, G. L., and Liao, X. B., "Silicon nanowires grown on a pre-annealed Si substrate," Journal of Crystal Growth, vol. 247 no. 1-2, pp. 13-16, 2003.

Zeng, Xianlai, Li, Jinhui, Stevels, A. L. N., and Liu, Lili, "Perspective of electronic waste management in China based on a legislation comparison between China and the EU," Journal of Cleaner Production , vol. 51, pp. 80-87, July 15, 2013.

Zeng, Xianlai, Li, Jinhui, and Ren, Yusen, "Prediction of Various Discarded Lithium Batteries in China," 2012 IEEE International Symposium on Sustainable Systems and Technology, Boston, MA, May 16-18, 2012, pp. xx-xx.

Zeng, Xianlai, Song, Qingbin, Li, Jinhui, Yuan, Wenyi, Duan, Huabo, and Liu, Lili, "Solving e-waste problem using an integrated mobile recycling plant," Journal of Cleaner Production, vol. 90, pp. 55-59, Mar. 1, 2015.

Zeng, Xianlai, Gong, Ruying, Chen, Wei-Qiang, and Li, Jinhui, "Uncovering the Recycling Potential of "New" WEEE in China," Environmental Science & Technology, vol. 50 no. 3, pp. 1347-1358, Feb. 2, 2016.

Zeng, Xianwei, Liu, Yichi, Zhang, Jiankang, Liu, Yi, Hu, Xiaowu, and Jiang, Xiongxin, "Effect of rare earth Ce on the thermal behavior, microstructure and mechanical properties of Zn-30Sn-2Cu high temperature lead-free solder alloy," Journal of Materials Science: Materials in Electronics, vol. 31 no. 19, pp. 16437-16447, Oct. 2020. https://doi.org/10.1007/s10854-020-04196-8

Zeng, Xianzhang, "Thermodynamic analysis of influence of Pb contamination on Pb-free solder joints reliability," Journal of Alloys and Compounds, vol. 348 no. 1-2, pp. 184-188, Jan. 13, 2003.

Zeng, Xu, Sun, Hong-Qi, He, Yan-Feng, and Qu, Xin-Ping, "Reflow discoloration formation on pure tin (Sn) surface finish," Microelectronics Reliability, vol. 52 no. 6, pp. 1153-1156, June 2012.

Zeng, Y., Kondos, Pericles, Jiang, J., Anselm, Martin, and Borgesen, Peter, "Comparing LGA and BGA Assemblies in Terms of Solder Pad Cratering," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 69-74.

Zeng, Z., Li, X. B., Li, L., and Wang, Z. H., "Effects of package geometry on thermal fatigue life and microstructure of Sn-Ag-Cu solder joint," Materials Science and Technology, vol. 27 no. 11, pp. 1686-1693, Nov. 2011.

Zeng, Zhixiang, and Zhang, Junyan, "Anti-wear properties of Cr-C and Ni-Co alloy coatings as substitutes for conventional nanocrystalline Cr coatings," Journal of Physics D: Applied Physics, vol. 41 no. 18, pp. 185303, Sept. 21, 2008.

Zeng, Zhixiang, Liang, Aimin, and Zhang, Junyan, "Electrochemical corrosion behavior of chromium-phosphorus coatings electrodeposited from trivalent chromium baths," Electrochimica Acta , vol. 53 no. 24, pp. 7344-7349, Oct. 15, 2008.

Zenin, V. V., Belyaev, V. N., Segal, Yu. E., and Kolbenkov, A. A., "Lead-Free Solders in IC Manufacture: A Review," Russian Microelectronics, vol. 32 no. 4, pp. 247-256, July 2003.

Zenner, Robert L., Connell, Glen, and Gerber, Joel A., "Adhesive and Conductive Adhesive Flip Chip Bonding," Proceedings 3rd International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Braselton, GA, Mar. 9-12, 1997, pp. 117-119.

Zenner, Robert L. D., Murray, Cameron T., and Fisher, Carl, "Temperature Characterization in Anisotropic Conductive Film Adhesive Bonding," Journal of Adhesion Science and Technology, vol. 22 no. 14, pp. 1781-1797, 2008.

Zerrer, Patrick, Fix, Andreas, Hutter, Matthias, and Pape, Uwe, "NanoFlux - Doping of Solder Pastes," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 923-927.

Zerrer, Patrick, Fix, Andreas, Hutter, Matthias, and Reichl, Herbert, "Solidification and wetting behaviour of SnAgCu solder alloyed by reactive metal organic flux," Soldering & Surface Mount Technology, vol. 22 no. 1, pp. 19-25, 2010.

Zervas, Michael, Sacchetto, Davide, De Micheli, Giovanni, and Leblebici, Yusuf, "Top-down fabrication of very-high density vertically stacked silicon nanowire arrays with low temperature budget," Microelectronic Engineering, vol. 88 no. 10, pp. 3127-3132, Oct. 2011.

Zerwekh, R. P, and Wayman, C. M., "On the nature of the a -> g transformation in iron: A study of whiskers," Acta Metallurgica, vol. 13 no. 2, pp. 99-107, Feb. 1965.

Zgirski, M., and Arutyunov, K. Yu., "Experimental limits of the observation of thermally activated phase-slip mechanism in superconducting nanowires," Physical Review B, vol. 75 no. 17, pp. 172509-1-172509-4, 2007.

Zha, X., Liu, C., and Silberschmidt, V. V., "Thermo-mechanical Behaviour Analysis of Micro-solder Joints by Finite Element Modelling," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1329-1332.

Zhai, Guangtao, Wang, Yishu, Ma, Limin, Guo, Fu, Tian, Yu, Zhou, Wei, Hu, Qiang, and Zhang, Fuwen, "Effect of grain boundary on failure behavior of SABI333 solder joints during creep," Journal of Materials Science: Materials in Electronics, vol. 31 no. 6, pp. 5017-5024, Mar. 2020.

Zhai, Q. J., Gao, Y. L., Guan, W. B., and Xu, K. D., "Role of size and cooling rate in quenched droplet of Sn-Bi eutectic alloy," Materials Science and Engineering: A, vol. 441 no. 1-2, pp. 278-281, Dec. 15, 2006.

Zhai, W., Wang, W. L., Geng, D. L., and Wei, B., "A DSC analysis of thermodynamic properties and solidification characteristics for binary Cu-Sn alloys," Acta Materialia, vol. 60 no. 19, pp. 6518-6527, Nov. 2012.

Zhai, Wei, and Wei, Bingbo, "Peritectic solidification characteristics of Sb-Sn alloy under ultrasonic vibration," Materials Letters, vol. 138, pp. 1-4, Jan. 1, 2015.

Zhan, Chau-Jie, Chuang, Chun-Chih, Juang, Jing-Ye, Lu, Su-Tsai, and Chang, Tao-Chih, "Assembly and Reliability Characterization of 3D Chip Stacking with 30um Pitch Lead-Free Solder Micro Bump Interconnection," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1043-1049.

Zhan, Chau-Jie, Chang, Jing-Yao, Chang, Tao-Chih, and Tsai, Tsung-Fu, "Bonding and electromigration of 30um fine pitch micro-bump interconnection," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 154-157.

Zhan, Chau-Jie, Chang, Hung-Jen, Chang, Tao-Chih, and Chou, Jung-Hua, "Experimental/numerical analysis of halogen-free printed circuit board assembly under board level drop test," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 381-384.

Zhan, Chau-Jie, Chuang, Chun-Chih, Chang, Tao-Chih, and Shen, Li-Cheng, "The Performance of Various Solder Ball under High Shear Speed Test," Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3, 2007, pp. 66-69.

Zhan, H. F., Gu, Y. T., Yan, C., and Yarlagadda, P. K. D. V., "Bending properties of Ag nanowires with pre-existing surface defects," Computational Materials Science, vol. 81, pp. 45-51, Jan. 2014.

Zhan, H. F., Gu, Y. T., Yan, C., Feng, X. Q., and Yarlagadda, P. K. D. V., "Numerical exploration of plastic deformation mechanisms of copper nanowires with surface defects," Computational Materials Science, vol. 50 no. 12, pp. 3425-3430, Dec. 2011.

Zhan, H. F., and Gu, Y. T., "Theoretical and numerical investigation of bending properties of Cu nanowires," Computational Materials Science, vol. 55, pp. 73-80, Apr. 2012.

Zhan, Lu, and Xu, Zhenming, "Assessment of heavy metals exposure, noise and thermal safety in the ambiance of a vacuum metallurgy separation system for recycling heavy metals from crushed e-wastes," Waste Management and Research, vol. 32 no. 12, pp. 1247-1253, Dec. 2014.

Zhan, Lu, and Xu, Zhenming, "Separating and Recovering Pb from Copper-Rich Particles of Crushed Waste Printed Circuit Boards by Evaporation and Condensation," Environmental Science & Technology, vol. 45 no. 12, pp. 5359-5365, June 15, 2011.

Zhan, Yongzhong, Yang, Wenchao, Xu, Yanfei, and Zhang, Xinjiang, "Experimental phase diagram of the Ti-Si-Sn ternary system at 473 K," Journal of Alloys and Compounds, vol. 509 no. 17, pp. 5269-5273, Apr. 28, 2011.

Zhan, Yongzhong, Xie, Haofeng, Jiang, Jichao, Xu, Yanfei, Wang, Ying, and Zhuang, Yinghong, "The isothermal section of the La-Cu-Sn ternary system at 473 K," Journal of Alloys and Compounds, vol. 461 no. 1-2, pp. 570-573, Aug. 11, 2008.

Zhang, Anna, Zhou, Zheng, Mo, Liping, Wu, Fengshun, and Liu, Hui, "Solidification microstructure of tin-based solder in the rapid cooling condition," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 966-970.

Zhang, Bing, and Kimura, Fumihiko, "Network Based Evaluation Framework for EEE to Comply with Environment Regulations," Proceedings of the 2006 IEEE International Conference on Mechatronics and Automation, Luoyang, China, June 25-28, 2006, pp. 797-802.

Zhang, Bo, Xi, Jing Si, Liu, Pin Kuan, and Ding, Han, "Failure Analysis of Board-Level Sn-Ag-Cu Solder Interconnections Under JEDEC Standard Drop Test," Journal of Electronic Materials, vol. 42 no. 9, pp. 2848-2855, Sept. 2013.

Zhang, Bo, Liu, Danmin, Liang, Yuntian, Zhang, Dandan, Yan, Hui, and Zhang, Yongzhe, "Flexible transparent and conductive films of reduced-graphene-oxide wrapped silver nanowires," Materials Letters, vol. 201, pp. 50-53, Aug. 15, 2017.

Zhang, Bo, Ding, Han, and Sheng, Xinjun, "Reliability study of board-level lead-free interconnections under sequential thermal cycling and drop impact," Microelectronics Reliability, vol. 49 no. 5, pp. 530-536, May 2009.

Zhang, Charles, Lin, Jong-Kai, and Li, Li, "Thermal Fatigue Properties of Lead-free Solders on Cu and NiP Under Bump Metallurgies," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 463-470.

Zhang, Chen, Lyu, Ruiyang, Lv, Wei, Li, Huan, Jiang, Wei, Li, Jia, Gu, Sichen, Zhou, Guangmin, Huang, Zhijia, Zhang, Yunbo, Wu, Junqiao, Yang, Quan-Hong, and Kang, Feiyu, "A Lightweight 3D Cu Nanowire Network with Phosphidation Gradient as Current Collector for High-Density Nucleation and Stable Deposition of Lithium," Advanced Materials, vol. 31 no. 48, pp. 1904991-1-1904991-9, Nov. 28, 2019. DOI: 10.1002/adma.201904991

Zhang, Chen, and Li, Xiuling, "III-V Nanowire Transistors for Low-Power Logic Applications: A Review and Outlook," IEEE Transactions on Electron Devices, vol. 63 no. 1, pp. 223-234, Jan. 2016.

Zhang, Cheng, Xu, XiaoYan, Zhou, Jian, and Xue, Feng, "The effect of flux components on the slump-in-heating resistance of Sn-3.0Ag-0.5Cu solder paste," 2015 16th International Conference on Electronic Packaging Technology , Changsha, China, Aug. 11-14, 2015, pp. 576-581.

Zhang, Chengwei, Chen, Jianfeng, and Xu, Lianbin, "Dual-templating approach to ordered mesoporous Pt nanowires with various morphologies," Materials Letters, vol. 223, pp. 97-101, July 15, 2018.

Zhang, Cong-Cong, and Zhang, Fu-Shen, "Removal of brominated flame retardant from electrical and electronic waste plastic by solvothermal technique," Journal of Hazardous Materials , vol. 221-222, pp. 193-198, June 30, 2012.

Zhang, Dong, Tredinnick, Meg, and Challingsworth, Mark, "Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications," CARTS USA 2009 Proceedings, Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp. xx-xx.

Zhang, F., Li, M., Chum, C. C., and Shao, Z. C., "Effects of Substrate Metallization on Solder/Under-Bump Metallization Interfacial Reactions in Flip-Chip Packages during Multiple Reflow Cycles," Journal of Electronic Materials, vol. 32 no. 3, pp. 123-130, Mar. 2003.

Zhang, Fan, Chum, Chan Choy, and Li, Ming, "Effect of Au on Interfacial Reactions of Eutectic SnPb and SnAgCu Solders with Al/Ni(V)/Cu Thin Film Metallization," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 726-731.

Zhang, Fan, Li, Ming, Balakrisnan, Bavani, and Chen, William T., "Failure Mechanism of Lead-Free Solder Joints in Flip Chip Packages," Journal of Electronic Materials, vol. 31 no. 11, pp. 1256-1263, Nov. 2002.

Zhang, G. S., Jing, H. Y., Xu, L. Y., Wei, J., and Han, Y. D., "Creep behavior of eutectic 80Au/20Sn solder alloy," Journal of Alloys and Compounds, vol. 476 no. 1-2, pp. 138-141, May 12, 2009.

Zhang, H. W., Liu, Y., Wang, J., and Sun, F. L., "Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading," Microelectronics Reliability , vol. 55 no. 11, pp. 2391-2395, Nov. 2015.

Zhang, Haidong, Shohji, Ikuo, Shimoda, Masayoshi, and Watanabe, Hirohiko, "Effect of Temperature on Tensile Properties of High-melting Point Bi System Solder," 2014 IEEE 16th Electronics Packaging Technology Conference , Singapore, Dec. 3-5, 2014, pp. 780-783.

Zhang, Han, Chen, Zhiwen, Pengv, Juan, and Liu, Li, "Diffusion barrier properties of electroless Ni-Fe-P coatings in Zn-5Al solder joints," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 589-592.

Zhang, Hao, Zhu, Qing-Sheng, Liu, Zhi-Quan, Zhang, Li, Guo, Hongyan, and Lai, Chi-Ming, "Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints," Journal of Materials Science and Technology, vol. 30 no. 9, pp. 928-933, Sept. 30, 2014. DOI: 10.1016/j.jmst.2014.06.009

Zhang, Hao, Liu, Yang, Sun, Fenglian, Ban, Gaofang, and Fan, Jiajie, "Effects of nano-copper particles on the properties of Sn58Bi composite solder pastes," Microelectronics International, vol. 34 no. 1, pp. 40-44, 2017.

Zhang, Hao, Sun, Fenglian, Li, Xuemei, Liu, Yang, and Xin, Tong, "Geometric Size Effects on the Elements Consuming at the Solder Pad under Current Stressing," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 1125-1128.

Zhang, Haoliang, Li, Junhui, and Zhu, Wenhui, "Electromigration in flip chip with Cu pillar having a shallow Sn-3.5Ag solder interconnect," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 1653-1656.

Zhang, Hong, Tang, Wen-Ming, Xu, Guang-Qing, Wu, Yu-Cheng, and Zheng, Zhi-Xiang, "Synthesis of Sn-Ag binary alloy powders by mechanical alloying," Materials Chemistry and Physics, vol. 122 no. 1, pp. 64-68, July 1, 2010.

Zhang, Hong-Chao, Ouyang, Xi, and Abadi, Alex, "An Environmentally Benign Process Model Development for Printed Circuit Board Recycling," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 212-217.

Zhang, Hong Wen, and Lee, Ning-Cheng, "High Temperature Lead-Free Solder Joints Via Mixed Powder System," SMTA International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 717-723.

Zhang, Hongqing, Perfecto, Eric, Calero-DdelC, Victoria L., and Pompeo, Frank, "An Effective Method for Full Solder Intermetallic Compound Formation and Kirkendall Void Control in Sn-base Solder Micro-joints," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 1695-1700.

Zhang, Hongwen, Minter, Jonathan, and Lee, Ning-Cheng, "A Brief Review on High-Temperature, Pb-Free Die-Attach Materials," Journal of Electronic Materials, vol. 48 no. 1, pp. 201-210, Jan. 2019.

Zhang, HongWen, and Lee, Ning-Cheng, "A Novel High Melting Lead-Free Mixed Solder Paste System," 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, Singapore, Dec. 7-9, 2011, pp. 567-572.

Zhang, Hongwen, Lytwynec, Samuel, and Wang, Huaguang, "An Alternative Lead-Free, Low-Temperature Solder with Excellent Drop-Shock Resistance," SMTA International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp. 280-290.

Zhang, HongWen, Mao RunSheng, and Lee, Ning-Cheng, "Corrosion Resistance of High Temperature Lead-free BiAgXT Paste," SMTA International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp. 415-420.

Zhang, HongWen, and Lee, Ning-Cheng, "High Reliability High melting Mixed Lead-Free BiAgX Solder Paste System," 2012 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, Nov. 6-8, 2012, pp. xx-xx.

Zhang, HongWen, and Lee, Ning-Cheng, "High Reliability High Melting Mixed Lead-Free BiAgX Solder Paste System," South East Asia Technical Training Conference on Electronics Assembly Technologies 2013 Proceedings, Penang, Malaysia, Apr. 17-19, 2013, pp. xx-xx.

Zhang, HongWen, and Lee, Ning-Cheng, "High Temperature Lead-Free Solder Joints Via Mixed Powder System," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 168-174.

Zhang, Hongwen, Mutuku, Francis, and Lee, Ning-Cheng, "Indium Low Temperature Solders," Proceedings of SMTA International , Rosemont, IL, Sept. 22-26, 2019, pp. xx-xx.

Zhang, HongWen, and Lee, Ning-Cheng, "Reliability of BiAgX Solder as a Drop-In Solution for High Temperature Lead-Free Die-Attach Applications," SMTAnews & Journal of Surface Mount Technology, vol. 26 no. 2, pp. 28-32, Apr.-June 2013.

Zhang, HongWen, and Lee, Ning-Cheng, "Reliability of BiAgX Solder as a Drop-In Solution for High Temperature Lead-Free Die-Attach Applications," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 256-260.

Zhang, Hongwu, Sun, Fenglian, and Liu, Yang, "Effects of Adding Some Elements on Solderability of Sn-0.7Ag-0.5Cu Solder," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 254-257.

Zhang, Hongwu, Liu, Yang, Wang, Jian, and Sun, Fenglian, "Failure study of solder joints subjected to random vibration loading at different temperatures," Journal of Materials Science: Materials in Electronics, vol. 26 no. 4, pp.2374-237 9, Apr. 2015.

Zhang, Hui, Yang, Deren, Ma, Xiangyang, and Que, Duanlin, "Transformation mechanism of Te particles into Te nanotubes and nanowires during solvothermal process," Journal of Crystal Growth, vol. 289 no. 2, pp. 568-573, Apr. 1, 2006.

Zhang, J. H., Chan, Y. C., Alam, M. O., and Fu, S., "Contact resistance and adhesion performance of ACF interconnections to aluminum metallization," Microelectronics Reliability, vol. 43 no. 8, pp. 1303-1310, Aug. 2003.

Zhang, J., van der Zwaag, S., Zeijl, H. W., and Zhang, G. Q., "On the Use of High Precision Electrical Resistance Measurement for Analyzing the Damage Development During Accelerated Test of Pb-free Solder Interconnects," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 192-199.

Zhang, J. H., Chan, Y. C., Zeng, Z. M., and Chiu, Y. W., "Research on the Interfacial Reaction between Anisotropically Conductive Film and Bumpless Die," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1569-1574.

Zhang, J. H., and Chan, Y. C., "Research on the Contact Resistance, Reliability, and Degradation Mechanisms of Anisotropically Conductive Film Interconnection for Flip-Chip-on-Flex Applications," Journal of Electronic Materials, vol. 32 no. 4, pp. 228-234, Apr. 2003.

Zhang, J. H., Chan, Y. C., Zeng, Z. M., and Chiu, Y. W., "Research on the Interfacial Reaction between Anisotropically Conductive Film and Bumpless Die," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1569-1574.

Zhang, J. S., Chan, Y. C., Wu, Y. P., Xi, H. J., and Wu, F. S., "Electromigration of Pb-free solder under a low level of current density," Journal of Alloys and Compounds, vol. 458 no. 1-2, pp. 492-499, June 30, 2008.

Zhang, J. S., Yang, Z. L., An, M. Z., Li, W. L., and Tu, Z. M., "Electrodeposition of Zinc-Cobalt Alloys From a Chloride Bath," Plating & Surface Finishing, vol. 82 no. 5, pp. 135-137, May 1995.

Zhang, J. S., Xi, H. J., Wu, Y. P., and Wu, F. S., "Thermomechanical Stress and Strain in Solder Joints During Electromigration," Journal of Electronic Materials, vol. 38 no. 5, pp. 678-684, May 2009.

Zhang, Jianhua, and Chan, Y. C., "Effects of Contact Metallizations on Electrical Resistance Reliability of ACF Interconnection for Flip-Chip on Flex Application," Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, China, June 30-July 3, 2004, pp. 277-281.

Zhang, Jiawei, Hai, Zhou, Thirugnanasambandam, Sivasubramanian, Evans, John L., Bozack, M. J., Sesek, Richard, Zhang, Yifei, and Suhling, J. C., "Aging Effects on Creep Behavior of Lead-Free Solder Joints and Reliability of Fine-Pitch Packages," SMTA International 2012 Conference Proceedings , Orlando, FL, Oct. 14-18, 2012, pp. 327-334.

Zhang, Jiawei, Hai, Zhou, Thirugnanasambandam, Sivasubramanian, Evans, John L., Bozack, M. J., Sesek, Richard, Zhang, Yifei, and Suhling, J. C., "Correlation of Aging Effects on Creep Rate and Reliability in Lead Free Solder Joints," SMTA Journal, vol. 25 no. 3, pp. 19-28, 2012.

Zhang, Jiawei, Thirugnanasambandam, Sivasubramanian, Evans, John L., Bozack, Michael J., and Sesek, Richard, "Impact of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Ball Grid Array Packages With Different Sn-Ag-Cu Solder Joints," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 2 no. 8, pp. 1317-1328, Aug. 2012.

Zhang, Jiawei, Hai, Zhou, Thirugnanasambandam, Sivasubramanian, Evans, John L., Bozack, M. J., and Sesek, Richard, "Isothermal Aging Effects on the Harsh Environment Performance of Lead-Free Solder Joints," SMTA International 2012 Conference Proceedings, Orlando, FL, Oct. 14-18, 2012, pp. 264-270.

Zhang, Jiawei, Hai, Zhou, Thirugnanasambandam, Sivasubramanian, Evans, John L., Bozack, Michael J., Zhang, Yifei, and Suhling, Jeffrey C., "Thermal Aging Effects on the Thermal Cycling Reliability of Lead-Free Fine Pitch Packages," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 3 no. 8, pp. 1348-1357, Aug. 2013.

Zhang, Jicheng, Xu, Yangjian, Liang, Lihua, Zhang, Yuanxiang, and Liu, Yong, "The effect of micro-structure evolution in electromigration on the reliability of solder joints," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 921-924.

Zhang, Jie, Li, Tian, Wang, Huiping, Liu, Yi, and Yu, Yingfeng, "Monitoring extent of curing and thermal-mechanical property study of printed circuit board substrates," Microelectronics Reliability, vol. 54 no. 3, pp. 619-628, Mar. 2014.

Zhang, Jing, Du, Maohua, Feng, Nufeng, and Lee, Taekoo, "Board Level Drop Test Reliability for MCP Package," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Zhang, Jinqiu, An, Maozhong, Chang, Limin, and Liu, Guiyuan, "Effect of triethanolamine and heliotropin on cathodic polarization of weakly acidic baths and properties of Sn-Ag-Cu alloy electrodeposits," Electrochimica Acta, vol. 53 no. 5, pp. 2637-2643, Jan. 1, 2008.

Zhang, Jinqiu, An, Maozhong, and Chang, Limin, "Study of the electrochemical deposition of Sn-Ag-Cu alloy by cyclic voltammetry and chronoamperometry," Electrochimica Acta, vol. 54 no. 10, pp. 2883-2889, Apr. 1, 2009.

Zhang, Jinsong, and Zhang, Jianhua, "Estimation of whiskers growth on Sn coating of Cu-Leads in different accelerated tests," Advanced Materials Research, vol. 160-162, pp. 1575-1581, 2011.

Zhang, Jinsong, and Zhang, Jianhua, "Mechanism of whisker growth on pure Sn coating of Cu leads in the high temperature/humidity storage tests," Applied Mechanics and Materials , vol. 44-47, pp. 2691-2695, Dec. 2010.

Zhang, Jun, Chen, Xu, Wei, Xinli, and Lin, Yong-Cheng, "Interfacial Stresses Analyses of Anisotropic Conductive Adhesive Bonding Under Thermal and Humidity Loads," Journal of Computational and Theoretical Nanoscience, vol. 5 no. 8, pp. 1542-1545, Aug. 2008.

Zhang, Jun, Lin, Y. C., and Huang, Liugang, "The Effect of the Different Teflon Films on Anisotropic Conductive Adhesive Film (ACF) Bonding," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Zhang, Jun, Chen, Xu, Wei, Xinli, and Lin, Yongchen, "The Mechanisms Analysis of the ACF Bonding Strengths after the High Temperature/Humidity Environment Test," Key Engineering Materials , vol. 353-358, pp. 2875-2878, 2007.

Zhang, Junjun, Han, Dong, Li, Wenfang, and Du, Jun, "Study of the Ce-Mn Conversion Coating on 6061 Aluminium Alloy," Advanced Materials Research, vol. 189-193, pp. 838-841, 2011.

Zhang, Junxiong, Xue, Songbai, Xue, Peng, and Liu, Shuang, "Thermodynamic reaction mechanism of the intermetallic compounds of SnxNdy and GaxNdy in soldered joint of Sn-9Zn-1Ga-0.5Nd," Journal of Materials Science: Materials in Electronics, vol. 26 no. 5, pp. 3064-3068, May 2015.

Zhang, K. K., Li, C. Y., Qiu, R. F., Shi, H. X., and Wang, Y. L., "Effect of Ni on growing of intermetallic compound in interface of Sn2.5Ag0.7Cu0.1RE/Cu solder joint during aging," Materials Science and Technology, vol. 28 no. 6, pp. 760-765, June 2012.

Zhang, K. K., Wang, Y. L., Fan, Y. L., Yang, J., Yan, Y. F., and Zhang, X., "Research on Creep Properties of Sn2.5Ag0.7CuXRE Lead-Free Soldered Joints for Surface Mount Technology," Key Engineering Materials, vol. 353-358 Part 4, pp. 2912-2915, 2007.

Zhang, Kai, Schnoor, Jerald L., and Zeng, Eddy Y., "E-Waste Recycling: Where Does It Go from Here?," Environmental Science & Technology, vol. 46 no. 20, pp. 10861-10867, October 16, 2012.

Zhang, Kaifeng, Zhou, Yeping, and Zeng, Xianzuo, "Research on Al particles reinforced thermal stress aging treatment behavior of composite lead-free solder," Advanced Materials Research, vol. 1004-1005, pp. 1178-1181, Aug. 2014.

Zhang, Kejing, Cang, Ping, Song, Fugen, and Geldermann, Jutta, "Research on STOF-Model-Based Innovation of E-Waste Recycling Service System," 2010 International Conference on Management and Service Science, Wuhan, China, Aug. 24-26, 2010, pp. xx-xx.

Zhang, KeKe, Fan, YanLi, Wang, Yaoli, Zhu, Yaomin, Zhang, Xin, and Yan, Yanfu, "Effect of Ni on Performances of Sn2.5Ag0.7Cu0.1RE Solder Alloy and Its Creep Properties of the solder Joints for SMT," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Zhang, Keke, Yang, Jie, Wang, Yaoli, Fan, Yanli, Zhang, Xin, and Yan, Yanfu, "Research on Creep Properties of SnAgCuRE Lead-Free Soldered Joints," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Zhang, Keke, Wang, Yaoli, Fan, Yan-li, Zhao, Guoji, Yan, Yanfu, and Zhang, Xin, "Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints," Materials Science Forum, vol. 650, pp. 91-96, 2010.

Zhang, Keke, Zhang, Xiaojiao, Qiu, Ranfeng, Shi, Hongxin, and Liu, Yujie, "The combined effects of ultrasonic wave and electric field on the microstructure and properties of Sn2.5Ag0.7Cu0.1RE/Cu soldered joints," Journal of Materials Science: Materials in Electronics, vol. 25 no. 4, pp. 1681-1686, Apr. 2014.

Zhang, L., Wang, Z. G., and Shang, J. K., "Creep Rupture of Sn-Ag-Cu Pb-free Solder Alloy," Key Engineering Materials, vol. 345-356 I, pp. 585-588, 2007.

Zhang, L., Wang, Z. G. and Shang, J. K., "Current-induced weakening of Sn3.5Ag0.7Cu Pb-free solder joints," Scripta Materialia, vol. 56, no. 5, pp. 381-384, Mar. 2007.

Zhang, L., Lu, J., Takagi, H., and Maeda, R., "Mechanical Characterization of Nanowires by Planar Vibration Sensor," 2013 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Suzhou, China, Apr. 7-10, 2013, pp. 124-127.

Zhang, L., Han, J.-G., Guo, Y.-H., and He, C.-W., "Properties of SnZn lead free solders bearing rare earth Y," Science and Technology of Welding and Joining, vol. 17 no. 5, pp. 424-428, July 2012.

Zhang, L. C., Tanaka, H., and Gupta, P., "The Deformation of Nano-Whiskers of Mono-Crystalline Copper: Shape Effect, Properties, Shear Banding and Necking," Key Engineering Materials vol. 274-276, pp. 331-336, Oct. 2004.

Zhang, Lang, Zhou, Min-Bo, and Zhang, Xin-Ping, "Influence of solder volume and interfacial reaction on the undercooling and solidification microstructure of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints," 2014 15th International Conference on Electronic Packaging Technology , Chengdu, China, Aug. 12-15, 2014, pp. 251-255.

Zhang, Lei, Wang, Dong, and Tong, Weiping, "A Numerical Simulation Study on Wetting and Bridging of SnAgCu Solder Liquid," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1347-1350.

Zhang, Lei, Guo, Jian-Jun, Xian, Ai-Ping, and Shang, J. K., "Solderability of Ni, Fe Elemental and Alloy Platings by SnAgCu," International Symposium on High Density Packaging and Microsystem Integration , Shanghai, China, June 26-28, 2007, pp. xx-xx.

Zhang, Li, and Mitani, Yuichiro, "Structural and electrical evolution of gate dielectric breakdown observed by conductive atomic force microscopy," Applied Physics Letters, vol. 88, pp. 032906-1-032906-3, 2006.

Zhang, Liang, Han, Ji-guang, Guo, Yonghuan, and He, Cheng-wen, "Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices," Microelectronics Reliability , vol. 54 no. 1, pp. 281-286, Jan. 2014.

Zhang, Liang, Han, Ji-guang, Guo, Yong-huan, and Sun, Lei, "Creep behavior of SnAgCu solders containing nano-Al particles," Journal of Materials Science: Materials in Electronics, vol. 26 no. 6, pp. 3615-3620, June 2015.

Zhang, Liang, Xue, Song-bai, Gao, Li-li, Zeng, Guang, Chen, Yan, Yu, Sheng-lin, and Sheng, Zhong, "Creep behavior of SnAgCu solders with rare earth Ce doping," Transactions of Nonferrous Metals Society of China, vol. 20 no. 3, pp. 412-417, Mar. 2010.

Zhang, Liang, Xue, Song-bai, Gao, Li-li, Sheng, Zhong, Ye, Huan, Xiao, Zheng-xiang, Zeng, Guang, Chen, Yan, and Yu, Sheng-lin, "Development of Sn-Zn lead-free solders bearing alloying elements," Journal of Materials Science: Materials in Electronics, vol. 21 no. 1, pp. 1-15, Jan. 2010.

Zhang, Liang, He, Cheng-wen, Guo, Yong-huan, Han, Ji-guang, Zhang, Yong-wei, and Wang, Xu-yan, "Development of SnAg-based lead free solders in electronics packaging," Microelectronics Reliability, vol. 52 no. 3, pp. 559-578, Mar. 2012.

Zhang, Liang, Yang, Fan, and Zhong, Su-juan, "Effect of Nd on whiskers growth behavior of SnAgCu solders in electronic packaging," Journal of Materials Science: Materials in Electronics , vol. 27 no. 9, pp. 9584-9588, Sept. 2016.

Zhang, Liang, Han, Ji-guang, He, Cheng-wen, and Guo, Yong-huan, "Effect of Zn on properties and microstructure of SnAgCu alloy," Journal of Materials Science: Materials in Electronics, vol. 23 no. 11, pp. 1950-1956, Nov. 2012.

Zhang, Liang, Xue, Song-bai, Gao, Li-li, Sheng, Zhong, Dai, Wei, Ji, Feng, Ye, Huan, Chen, Yan, and Yu, Sheng-lin, "Effects of bulk Cu6Sn5 intermetallic compounds on the properties of Sn-Ag-Cu-Ce soldered joints," Soldering & Surface Mount Technology , vol. 23 no. 1, pp. 4-9, 2011.

Zhang, Liang, Xue, Songbai, Chen, Yan, Han, Zongjie, Wang, Jianxin, Yu, Shenglin, and Lu, Fangyan, "Effects of cerium on Sn-Ag-Cu alloys based on finite element simulation and experiments," Journal of Rare Earths, vol. 27 no. 1, pp. 138-144, Feb. 2009.

Zhang, Liang, Xue, Song-bai, Gao, Li-li, Zeng, Guang, Sheng, Zhong, Chen, Yan, and Yu, Sheng-lin, "Effects of rare earths on properties and microstructures of lead-free solder alloys," Journal of Materials Science: Materials in Electronics, vol. 20 no. 8, pp. 685-694, Aug. 2009.

Zhang, Liang, Xue, Song-bai, Gao, Li-li, Chen, Yan, Yu, Sheng-lin, Sheng, Zhong, and Zeng, Guang, "Effects of trace amount addition of rare earth on properties and microstructure of Sn-Ag-Cu alloys," Journal of Materials Science: Materials in Electronics, vol. 20 no. 12, pp. 1193-1199, Dec. 2009.

Zhang, Liang, and Liu, Zhi-quan, "Inhibition of intermetallic compounds growth at Sn-58Bi/Cu interface bearing CuZnAl memory particles (2-6 um)," Journal of Materials Science: Materials in Electronics, vol. 31 no. 3, pp. 2466-2480, Feb. 2020.

Zhang, Liang, Xue, Song-bai, Zeng, Guang, Gao, Li-li, and Ye, Huan, "Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging," Journal of Alloys and Compounds, vol. 510 no. 1, pp. 38-45, Jan. 5, 2012.

Zhang, Liang, and Gao, Li-li, "Interfacial compounds growth of SnAgCu(nano La2O3)/Cu solder joints based on experiments and FEM," Journal of Alloys and Compounds, vol. 635, pp. 55-60, June 25, 2015.

Zhang, Liang, Fan, Xi-ying, He, Cheng-wen, and Guo, Yong-huan, "Intermetallic compound layer growth between SnAgCu solder and Cu substrate in electronic packaging," Journal of Materials Science: Materials in Electronics, vol. 24 no. 9, pp. 3249-3254, Sept. 2013.

Zhang, Liang, Xue, Song-bai, Gao, Li-li, Chen, Yan, Yu, Sheng-lin, Sheng, Zhong, and Zeng, Guang, "Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium," Soldering & Surface Mount Technology, vol 22 no. 2, pp. 30-36, 2010.

Zhang, Liang, Xue, Song-bai, Gao, Li-li, Dai, Wei, Ji, Feng, Chen, Yan, and Yu, Sheng-lin, "Microstructure characterization of SnAgCu solder bearing Ce for electronic packaging," Microelectronic Engineering, vol. 88 no. 9, pp. 2848-2851, Sept. 2011.

Zhang, Liang, Sun, Lei, and Guo, Yong-huan, "Microstructures and properties of Sn58Bi, Sn35Bi0.3Ag, Sn35Bi1.0Ag solder and solder joints," Journal of Materials Science: Materials in Electronics , vol. 26 no. 10, pp. 7629-7634, Oct. 2015.

Zhang, Liang, Han, Ji-Guang, Guo, Yong-Huan, and He, Cheng-Wen, "Microstructures and Properties of SnZn Lead-Free Solder Joints Bearing La for Electronic Packaging," IEEE Transactions on Electron Devices, vol. 59 no. 12, pp. 3269-3272, Dec. 2012.

Zhang, Liang, Long, Wei-min, and Wang, Feng-jiang, "Microstructures, interface reaction, and properties of Sn-Ag-Cu and Sn-Ag-Cu-0.5CuZnAl solders on Fe substrate," Journal of Materials Science: Materials in Electronics, vol. 31 no. 9, pp. 6645-6653, May 2020.

Zhang, Liang, and Yang, Fan, "New discovery of ZnO whisker in SnZn/Cu solder joints interconnection in concentrator silicon solar cells solder layer," Materials Letters , vol. 171, pp. 154-157, May 15, 2016.

Zhang, Liang, Jiang, Nan, He, Peng, and Zhong, Su-Juan, "Properties and microstructure evolution of Sn-Cu-Ni/Cu joints bearing carbon nanotubes and graphene nanosheets for solar cell," Journal of Materials Science: Materials in Electronics, vol. 31 no. 23, pp. 21758-21766, Dec. 2020. https://doi-org.ezproxy.uky.edu/10.1007/s10854-020-04688-7

Zhang, Liang, Xue, Song-bai, Gao, Li-li, Sheng, Zhong, Zeng, Guang, Chen, Yan, and Yu, Sheng-lin, "Properties of SnAgCu/SnAgCuCe soldered joints for electronic packaging," Journal of Materials Science: Materials in Electronics, vol. 21 no. 6, pp. 635-642, June 2010.

Zhang, Liang, Han, Ji-guang, He, Cheng-wen, and Guo, Yong-huan, "Reliability behavior of lead-free solder joints in electronic components," Journal of Materials Science: Materials in Electronics, vol. 24 no. 1, pp. 172-190, Jan. 2013.

Zhang, Liang, Sun, Lei, Guo, Yong-huan, and He, Cheng-wen, "Reliability of lead-free solder joints in CSP device under thermal cycling," Journal of Materials Science: Materials in Electronics, vol. 25 no. 3, pp. 1209-1213, Mar. 2014.

Zhang, Liang, Sun, Lei, Zhong, Su-juan, Ma, Jia, and Bao, Li, "Reliability of Pb-free solder joints in FCBGA using finite element simulation and Taguchi method," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 197-200.

Zhang, Liang, Han, Ji-guang, Guo, Yong-huan, and Sun, Lei, "Reliability of SnAgCu/SnAgCuCe solder joints with different heights for electronic packaging," Journal of Materials Science: Materials in Electronics, vol. 25 no. 10, pp. 4489-4494, Oct. 2014.

Zhang, Liang, Xue, Song-bai, Gao, Li-li, Sheng, Zhong, Yu, Sheng-lin, Chen, Yan, Dai, Wei, Ji, Feng, and Guang, Zeng, "Reliability study of Sn-Ag-Cu-Ce soldered joints in quad flat packages," Microelectronics Reliability, vol. 50 no. 12, pp. 2071-2077, Dec. 2010.

Zhang, Liang, Sun, Lei, Han, Ji-guang, and Guo, Yong-huan, "Sizes effect of CeSn3 on the whiskers growth of SnAgCuCe solder joints in electronic packaging," Journal of Materials Science: Materials in Electronics, vol. 26 no. 8, pp. 6194-6197, Aug. 2015.

Zhang, Liang, Sun, Lei, Han, Ji-guang, and Guo, Yong-huan, "Wettability optimization analysis of lead-free solders with Taguchi method," Journal of Materials Science: Materials in Electronics, vol. 26 no. 4, pp. 2605-2608, Apr. 2015.

Zhang, Liang, Yang, Fan, and Zhong, Su-juan, "Whisker growth on SnAgCu-xPr solders in electronic packaging," Journal of Materials Science: Materials in Electronics, vol. 27 no. 6, pp. 5618-5621, June 2016.

Zhang, Lifeng, "Recycling of Electronic Wastes: Current Perspectives," JOM, vol. 63 no. 8, pp. 13, Aug. 2011.

Zhang, Lili, Chen, Si, Sun, Peng, Cheng, Zhaonian, and Liu, Johan, "An aging study of intermetallic compounds formation in Sn-0.4Co-0.7Cu," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Zhang, Lili, Tao, Wenkai, Liu, Johan, Zhang, Yan, Cheng, Zhaonian, Andersson, Cristina, Gao, Yulai, and Zhai, Qijie, "Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles," International Conference on Electronic Packaging Technology & High Density Packaging , Shanghai, China, July 28-31, 2008, pp. xx-xx.

Zhang, Lili, Andersson, Cristina, Liu, Johan, and Cheng, Zhaonian, "The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn-0.7Cu -0.4Co eutectic solder and ENIG/Cu substrate finish," 2nd Electronics Systemintegration Technology Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 1295-1300.

Zhang, Meng, Peng, Weixiang, Zhang, Hongliang, Wu, Bingjie, Sun, Kun, and Fang, Liang, "The effect of PKA directions on the primary radiation damage in the alpha iron nanowires," Materials Chemistry and Physics, vol. 232, pp. 16-22, June 15, 2019.

Zhang, Min, Xu, Huanrui, Wang, Gang, and Zhu, Ziyue, "Effect of Ga on microstructure and properties of Sn-Zn-Bi solder for photovoltaic ribbon," China Welding (English Edition), vol. 28 no. 4, pp. 1-7, 2019. doi: 10.12073/j.cw.20190917001

Zhang, Ning, Shi, Yaowu, Guo, Fu, Lei, Yongping, Xia, Zhidong, Chen, Zhenhua, and Tian, Li, "Comparison of drop performance between the Sn37Pb and the Sn3.8Ag0.7Cu solder joints subjected to drop test," Journal of Materials Science: Materials in Electronics, vol. 22 no. 3, pp. 292-298, Mar. 2011.

Zhang, Ning, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu, and Li, Xiaoyan, "Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test," Journal of Electronic Materials, vol. 37 no. 10, pp. 1631-1639, Oct. 2008.

Zhang, Ning, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu, and Li, Xiaoyan, "Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test (Erratum)," Journal of Electronic Materials, vol. 37 no. 11, pp. 1756, Nov. 2008.

Zhang, Ning, Shi, Yaowu, Lei, Yongping, Xia, Zhidong, Fu, Guo, ,and Li, Xiaoyan, "Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions," Journal of Electronic Materials, vol. 38 no. 10, pp. 2132-2147, Oct. 2009.

Zhang, Ning, Shi, Yaowu, Guo, Fu, Lei, Yongpei, Xia, Zhidong, and Tian, Li, "Investigation of the fracture morphologies of Sn3.8Ag0.7Cu joints under high-velocity conditions," Journal of Materials Science: Materials in Electronics, vol. 21 no. 10, pp. 1076-1082, Oct. 2010.

Zhang, Ning, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu, and Li, Xiaoyan, "Investigation on impact strength of the as-soldered Sn37Pb and Sn3.8Ag0.7Cu solder joints," Journal of Materials Science: Materials in Electronics , vol. 20 no. 6, pp. 499-506, June 2009.

Zhang, Ning, Shi, Yaowu, Guo, Fu, and Yang, Fuqian, "Study of the Impact Performance of Solder Joints by High-Velocity Impact Tests," Journal of Electronic Materials, vol. 39 no. 12, pp. 2536-2543, Dec. 2010.

Zhang, P., Liu, Y., Ding, J., Zhang, Y. M., Yan, J. L., An, B., Iijima, T., and Sun, Z. M., "Controllable growth of Ga wires from Cr2GaC-Ga and its mechanism," Physica B: Condensed Matter, vol. 475, pp. 90-98, Oct. 15, 2015. https://doi.org/10.1016/j.physb.2015.07.005

Zhang, P., Shen, L. W., Ouyang, J., Zhang, Y. M., Wu, S. Q., and Sun, Z. M., "Room temperature mushrooming of gallium wires and its growth mechanism," Journal of Alloys and Compounds, vol. 619, pp. 488-497, Jan. 15, 2015.

Zhang, P., Zhang, Y. M., and Sun, Z. M., "Spontaneous Growth of Metal Whiskers on Surfaces of Solids: A Review," Journal of Materials Science and Technology, vol. 31 no. 7, pp. 675-698, 2015. DOI: 10.1016/j.jmst.2015.04.001

Zhang, Pei, Wei, Yanlong, Ou, Ming, Huang, Zhenzhu, Lin, Shudong, Tu, YuanYuan, and Hu, Jiwen, "Behind the role of bromide ions in the synthesis of ultrathin silver nanowires," Materials Letters, vol. 213, pp. 23-26, Feb. 15, 2018.

Zhang, Pei, Wyman, Ian, Hu, Jiwen, Lin, Shudong, Zhong, Zhiwei, Tu, Yuanyuan, Huang, Zhengzhu, and Wei, Yanlong, "Silver nanowires: Synthesis technologies, growth mechanism and multifunctional applications," Materials Science and Engineering B: Solid-State Materials for Advanced Technology, vol. 223, pp. 1-23, Sept. 2017.

Zhang, PeiGen, Ding, JianXiang, Liu, YuShuang, Yang, Li, Tian, WuBian, Ouyang, Jian, Zhang, YaMei, and Sun, ZhengMing, "Mechanism and mitigation of spontaneous Ga whisker growth on Cr2GaC," Science China Technological Sciences, vol. 63 no. 3, pp. 440-445, Mar. 2020.

Zhang, Peng, Bo, Chen Hong, and Yu, Hong, "Impact of Cross-Section and Size on Vibration of Silicon Nanowires," Key Engineering Materials, vol. 645-646, pp. 1004-1008, May 2015.

Zhang, Peng, Xue, Songbai, and Wang, Jianhao, "New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints," Materials & Design, vol. 192, pp. 108726-1-108726-17, July 2020, https://doi.org/10.1016/j.matdes.2020.108726

Zhang, Pin, Guo, Hong, Yang, Fubao, and Xu, Jun, "Effects of Alloying Elements on the High-Temperature Oxidation Resistance and Wettability of the Sn-9Zn Alloy," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Zhang, Q. K., Long, W. M., Yu, X. Q., Pei, Y. Y., and Qiao, P. X., "Effects of Ga addition on microstructure and properties of Sn-Ag-Cu/Cu solder joints," Journal of Alloys and Compounds, vol. 622, pp. 973-978, Feb. 15, 2014.

Zhang, Q. K., Zhu, Q. S., Zou, H. F., and Zhang, Z. F., "Fatigue fracture mechanisms of Cu/lead-free solders interfaces," Materials Science and Engineering: A, vol. 527 no. 6, pp. 1367-1376, Mar. 15, 2010.

Zhang, Q. K., Zhu, Q. S., and Zhang, Z. F., "Fatigue Fracture Mechanisms of Cu/Lead-Free Solders Interfaces," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 1168-1173.

Zhang, Q. K., and Zhang, Z. F., "Fracture mechanism and strength-influencing factors of Cu/Sn-4Ag solder joints aged for different times," Journal of Alloys and Compounds , vol. 485 no. 1-2, pp. 853-861, Oct. 19, 2009.

Zhang, Q. K., Long, W. M., and Zhang, Z. F., "Growth behavior of intermetallic compounds at Sn-Ag/Cu joint interfaces revealed by 3D imaging," Journal of Alloys and Compounds, vol. 646, pp. 405-411, Oct. 15, 2015.

Zhang, Q. K., and Zhang, Z. F., "In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints," Acta Materialia, vol. 59 no. 15, pp. 6017-6028, Sept. 2011.

Zhang, Q. K., and Zhang, Z. F., "In-situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron back-scatter diffraction," Scripta Materialia, vol. 67 no. 3, pp. 289-292, Aug. 2012.

Zhang, Q. K., Zou, H. F., and Zhang, Z. F., "Influences of Substrate Alloying and Reflow Temperature on Bi Segregation Behaviors at Sn-Bi/Cu Interface," Journal of Electronic Materials , vol. 40 no. 11, pp. 2320-2328, Nov. 2011.

Zhang, Q. K., and Zhang, Z. F., "Low cycle creep-fatigue behaviors of Sn-4Ag/Cu solder joints," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 154-157.

Zhang, Q. K., Zou, H. F., and Zhang, Z. F., "Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints," Journal of Electronic Materials, vol. 38 no. 6, pp. 852-859, June 2009.

Zhang, Q. K., and Zhang, Z. F., "Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude," Materials Science and Engineering: A, vol. 580, pp. 374-384, Sept. 15, 2013.

Zhang, Q. K., Hu, F. Q., Song, Z. L., and Zhang, Z. F., "Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain," Materials Science and Engineering: A, vol. 701, pp. 187-195, July 31, 2017.

Zhang, Qian, "A Novel Solder Ball Coating Process with Improved Reliability," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 1 , Orlando, FL, May 31-June 3, 2005, pp. 399-405.

Zhang, Qian, Dasgupta, Abhijit, and Haswell, Peter, "Creep and High-Temperature Isothermal Fatigue of Pb-Free Solders," Advances in Electronic Packaging 2003, Volume 1, Maui, Hawaii, July 6-11, 2003, pp. 955-960.

Zhang, Qian, Dasgupta, Abhijit, and Haswell, Peter, "Isothermal Mechanical Durability of Three Selected PB-Free Solders: Sn3.9Ag0.6Cu, Sn3.5Ag, and Sn0.7Cu." Journal of Electronic Packaging , vol. 127 no. 4, pp. 512-522, Dec. 2005.

Zhang, Qian, Dasgupta, Abhijit, Haswell, Peter, and Osterman, Michael, "Isothermal Mechanical Fatigue of Pb-free Solders: Damage Propagation Rate & Time to Failure," 34th International SAMPE Technical Conference , Baltimore, MD, Nov. 4-7, 2002, pp. 98-109.

Zhang, Qian, Dasgupta, Abhijit, and Haswell, Peter, "Partitioned Viscoplastic-Constitutive Properties of the Pb-Free Sn3.9Ag0.6Cu Solder," Journal of Electronic Materials, vol. 33 no. 11, pp. 1338-1349, Nov. 2004.

Zhang, Qian, Dasgupta, Abhijit, Nelson, Dave, and Pallavicini, Hector, "Systematic Study on Thermo-Mechanical Durability of Pb-Free Assemblies: Experiments and FE Analysis," Journal of Electronic Packaging, vol. 127 no. 4, pp. 415-429, Dec. 2005.

Zhang, Qian, Dasgupta, Abhijit, and Haswell, Peter, "Viscoplastic Constitutive Properties and Energy-Partitioning Model of Lead-free Sn3.9Ag0.6Cu Solder Alloy," 2003 Proceedings 53rd Electronic Components & Technology Conference, New Orleans, LA, May 27-30, 2003, pp. 1862-1868.

Zhang, Qiming, and Lee, S. W. Ricky, "Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance," Journal of Electronic Packaging, vol. 142 no. 2, pp. 021008-1-021008-8, June 2020.

Zhang, Qiming, Yang, Chaoran, Tao, Mian, Song, Fubin, and Lee, S. W. Ricky, "Assessment of Solder Pad Cratering Strength using Cold Pin Pull Test Method with Pre-Fabricated Pin Arrays," 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp. 1788-1793.

Zhang, Qiming, Lo, Jeffery C. C., and Lee, S. W. Ricky, "Correlation of Board and Joint Level Test Methods with Strain Dominant Failure Criteria for Improving the Resistance to Pad Cratering," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 1-6.

Zhang, Qiming, Yang, Chaoran, Tao, Mian, Song, Fubin, and Lee, S. W. Ricky, "Development of Innovative Cold Pin Pull Test Method for Solder Pad Crater Evaluation," 2012 14th International Conference on Electronic Materials and Packaging, Hong Kong, Dec. 13-16, 2012, pp. xx-xx.

Zhang, Qiming, Lo, Jeffery C. C., and Lee, S. W. Ricky, "Pad Cratering Based Failure Criterion for the Life Prediction of Board Level Cyclic Bending Test," 2017 IEEE 67th Electronic Components and Technology Conference, Orlando, FL, May 30-June 2, 2017, pp. 448-455.

Zhang, QingKe, Zou, HeFei, and Zhang, Zhe-Feng, "Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate," Journal of Materials Research, vol. 25 no. 2, pp. 303-314, Feb. 2, 2010.

Zhang, Qingke, Hu, Fangqin, and Song, Zhenlun, "Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces," Journal of Electronic Materials, vol. 49 no. 5, pp. 3383-3390, May 2020.

Zhang, Qun, Xie, Xiaoming, and Adams, Tom, "Preventing flip-chip solder joint failures," EE Times - Asia , vol. xx no. xx, pp. xx-xx, Aug. 2001.

Zhang, Ron, and Clech, Jean-Paul, "Applicability of Various Pb-Free Solder Joint Acceleration Factor Models," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 954-965.

Zhang, Ron, "Assembly and Application Specific Methodology to Determine Accelerated Temperature Cycling Requirements for Pb-free Solder Joint Reliability," 2007 Proceedings 57th Electronic Components & Technology Conference , Reno, NV, May 29-June 1, 2007, pp. 124-128.

Zhang, Ron, "Characterization of Board Level Reliability of a System with Flip Chip HITCE BGA Package through Modeling and Testing," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1438-1444.

Zhang, Ron, Shah, Chirag, and Pecavar, Stanley, "Comparisons of SAC Flip Chip BGA Solder Joint Reliability Under Accelerated Temperature Cycling and Power Cycling Conditions," SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 116-122.

Zhang, Rongwei, Wang, Wei, Moon, Kyoung-sik, Jiang, Hongjing, Lin, Wei, and Wong, C. P., "Development of Transparent and Flexible Electrically Conductive Adhesives for Microelectronics Applications," 2nd IEEE International Interdisciplinary Conference on Portable Information Devices, 2008 and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Garmisch-Partenkirchen, Germany, Aug, 17-20, 2008, pp. xx-xx.

Zhang, Rongwei, Moon, Kyoung-sik, Lin, Wei, and Wong, C. P., "Electrical Properties of ACA Joints Assisted by Conjugated Molecular Wires," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 2034-2038.

Zhang, Rongwei, Li, Yi, Yim, Myung Jin, Moon, Kyoung Sik, Lu, Daoqiang Daniel, and Wong, C. P., "Electrically Conductive Adhesive with pi-Conjugated Self-Assembled Molecular Wire Junctions for Enhanced Electrical and Thermal Properties," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1913-1918.

Zhang, Rongwei, Li, Yi, Yim, Myung Jin, Moon, Kyoung Sik, Lu, Daoqiang Daniel, and Wong, C. P., "Enhanced Electrical Properties of Anisotropic Conductive Adhesive With pi-Conjugated Self-Assembled Molecular Wire Junctions," IEEE Transactions on Components and Packaging Technologies, vol. 32 no. 3, pp. 677-683, Sept. 2009.

Zhang, Rongwei, Lin, Wei, Moon, Kyoung-Sik, Liang, Qizhen, and Wong, C. P., "Highly Reliable Copper-Based Conductive Adhesives Using an Amine Curing Agent for in Situ Oxidation/Corrosion Prevention," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 1, pp. 25-32, Jan. 2011.

Zhang, Rongwei, Lin, Wei, Lawrence, Kevin, and Wong, C. P., "Highly reliable, low cost, isotropically conductive adhesives filled with Ag-coated Cu flakes for electronic packaging applications," International Journal of Adhesion and Adhesives, vol. 30 no. 6, pp. 403-407, Sept, 2010.

Zhang, Rongwei, Moon, Kyoung Sik, Lin, Wei, Jiang, Hongjin, and Wong, C. P., "Incorporation of pi-conjugated Molecular Wires into Anisotropic Conductive Adhesive for High-performance Interconnection Applications," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 24-28.

Zhang, Rongwei, Moon, Kyoung-Sik, Lin, Wei, Duan, Yiqun, Lotz, Stefanie M., and Wong, C. P., "Interfacial Design of Anisotropic Conductive Adhesive Based Interconnects Using Molecular Wires and Understanding of Their Electrical Conduction," IEEE Transactions on Advanced Packaging, vol. 33 no. 4, pp. 892-898, Nov. 2010.

Zhang, Rongwei, and Wong, C. P., "Low Cost Copper-based Electrically Conductive Adhesives," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 715-720.

Zhang, Rongwei, Duan, Yiqun, Lin, Wei, Moon, Kyoung-sik, and Wong, C. P., "New Electrically Conductive Adhesives (ECAs) for Flexible Interconnect Applications," 59th Electronic Components & Technology Conference , San Diego, CA, May 26-29, 2009, pp. 1356-1360.

Zhang, Rongwei, Agar, Josh C., and Wong, C. P., "Recent Advances on Electrically Conductive Adhesives," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 696-704.

Zhang, Rui, Tian, Yanhong, Hang, Chunjin, Liu, Baolei, and Wang, Chunqing, "Formation mechanism and orientation of Cu3Sn grains in Cu-Sn intermetallic compound joints," Materials Letters, vol. 110, pp. 137-140, Nov. 1, 2013.

Zhang, Rui, Tian, Yanhong, Liu, Baolei, and Hang, Chunjin, "Growth mechanism of Cu-Sn full IMC joints on polycrystalline and single crystal Cu substrate," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 1276-1279.

Zhang, Rui, Zhang, Jiawei, Evans, John, Johnson, Wayne, Vardaman, Jan, Fujimura, Issei, Tseng, Andy, and Knight, Jeff, "Tin-Bismuth Plating for Component Finishes," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 2060-2066.

Zhang, Ruihong, Xu, Guangchen, Wang, Xitao, Guo, Fu, Lee, Andre, and Subramanian, K. N., "Electromigration in Sn-Bi Modified with Polyhedral Oligomeric Silsesquioxane," Journal of Electronic Materials, vol. 39 no. 12, pp. 2513-2521, Dec. 2010.

Zhang, Ruihong, Zhao, Ran, Guo, Fu, and Xia, Zhidong, "Interfacial reaction between the electroless nickel immersion gold substrate and Sn-based solders," Microelectronics Reliability, vol. 49 no. 3, pp. 303-309, Mar. 2009.

Zhang, Ruihong, Guo, Fu, Liu, Jianping, Shen, Hao, and Tai, Feng, "Morphology and Growth of Intermetallics at the Interface of Sn-based Solders and Cu with Different Surface Finishes," Journal of Electronic Materials , vol. 38 no. 2, pp. 241-251, Feb. 2009.

Zhang, S., De Baets, J., and Van Calster, A., "A new approach to flip chip on board technology using SMT compatible processes," Microelectronics International, vol. 16 no. 3, pp. 39-42, 1999.

Zhang, S. B., "Corrigendum to "Mechanical behaviors of single crystalline and fivefold twinned Ag nanowires under compression" [Comput. Mater. Sci. 98 (2015) 320-327]," Computational Materials Science, vol. 101, pp. 321, Apr. 15, 2015.

Zhang, S. B., "Mechanical behaviors of single crystalline and fivefold twinned Ag nanowires under compression," Computational Materials Science, vol. 98, pp. 320-327, Feb. 15, 2015.

Zhang, S. B., "Microstructure- and surface orientation-dependent mechanical behaviors of Ag nanowires under bending," Computational Materials Science, vol. 95, pp. 53-62, Dec. 2014.

Zhang, Shasha, Zhang, Yijie, and Wang, Haowei, "Effect of oxide thickness of solder powders on the coalescence of SnAgCu lead-free solder pastes," Journal of Alloys and Compounds, vol. 487 no. 1-2, pp. 682-686, Nov. 13, 2009.

Zhang, Shengde, and Sakane, Masao, "Creep-fatigue life assessment for three kinds of solders," Materials at High Temperatures, vol. 29 no. 4, pp. 315-321, Nov. 2012.

Zhang, Shiyong, Wang, Lifeng, Wang, Min, Bai, Yuhui, and Jia, Keming, "The Effect of Loading Rate on the Shear Behavior of BGA Solder Joints under Board-level," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 619-623.

Zhang, Shizhong, Rong, Weibin, and Sun, Lining, "Development of a Nanomanipualtion System for Handling Nanowires," Key Engineering Materials, vol. 562-565, pp. 1092-1097, July 2013.

Zhang, Shu, "Reliability Modeling of Lead-Free Soldering," empfasis, pp. 8-9, Aug. 2005.

Zhang, Shu-Guang, He, Li-Jun, Zhu, Xue-Xin, Zhang, Shao-Ming, and Shi, Li-Kai, "Fabrication technologies of solder ball for advanced electronic package," Zhongguo Youse Jinshu Xuebao/The Chinese Journal of Nonferrous Metals , vol. 14 no. Special 3, pp. 501-505, Oct. 2004.

Zhang, Shunli, Forssberg, Eric, Arvidson, Bo, and Moss, William, "Aluminum recovery from electronic scrap by High-Force eddy-current separators," Resources, Conservation and Recycling, vol. 23 no. 4, pp. 225-241, Sept. 1998.

Zhang, Shunli, and Forssberg, Eric, "Mechanical recycling of electronics scrap - the current status and prospects," Waste Management and Research, vol. 16 no. 2, pp. 119-128, Apr. 1998.

Zhang, Shunli, and Forssberg, Eric, "Mechanical separation-oriented characterization of electronic scrap," Resources, Conservation and Recycling, vol. 21 no. 4, pp. 247-269, Dec. 1997.

Zhang, Shunli, and Forssberg, Eric, "Optimization of electrodynamic separation for metals recovery from electronic scrap," Resources, Conservation and Recycling, vol. 22 no. 3-4, pp. 143-162, June 1998.

Zhang, Shunong, Kang, Rui, and Pecht, Michael G., "Corrosion of ImAg-Finished PCBs Subjected to Elemental Sulfur Environments," IEEE Transactions on Device and Materials Reliability, vol. 11 no. 3, pp. 391-400, Sept. 2011.

Zhang, Shunong, Osterman, Michael, Shrivastava, Anshul, Kang, Rui, and Pecht, Michael G., "The Influence of H2S Exposure on Immersion-Silver-Finished PCBs Under Mixed-Flow Gas Testing," IEEE Transactions on Device and Materials Reliability, vol. 10 no. 1, pp. 71-81, Mar. 2010.

Zhang, Shunong, Shrivastava, Anshul, Osterman, Michael, Pecht, Michael, and Kang, Rui, "The Influence of SO2 Environments on Immersion Silver Finished PCBs by Mixed Flow Gas Testing," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 116-122.

Zhang, Shuo, Han, Jing, Ma, Limin, Wang, Yishu, and Guo, Fu, "Effects of reflow time on the morphology of Cu6Sn5in solder balls at 250°C," 2018 19th International Conference on Electronic Packaging Technology , Shanghai, China, Aug. 8-11, 2018, pp. 409-412.

Zhang, Shuo, Han, Jing, Ma, Limin, Wang, Yishu, and Guo, Fu, "Study of the growth behavior of prism-type Cu6Sn5 in the liquid solder," 2017 18th International Conference on Electronic Packaging Technology , Harbin, China, Aug. 16-19, 2017, pp. 716-719.

Zhang, Shuye, Lin, Tiesong, He, Peng, Zhao, Ning, Huang, Mingliang, and Paik, Kyung-Wook, "A Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn–58Bi Solder ACFs Joints for Reliable Flex-on-Board Applications," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 7 no. 12, pp. 2087-2094, Dec. 2017.

Zhang, Shuye, and Paik, Kyung-Wook, "A Study on the Failure Mechanism and Enhanced Reliability of Sn58Bi Solder Anisotropic Conductive Film Joints in a Pressure Cooker Test Due to Polymer Viscoelastic Properties and Hydroswelling," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 6 no. 2, pp. 216-223, Feb. 2016.

Zhang, Shuye, Lin, Tiesong, He, Peng, Park, Junyong, Park, Gapyeol, Song, Huijin, Kim, Joungho, and Paik, Kyung-Wook, "A Study on the High Frequency Performance of solder ACFs Joints for Flex-on-Board Applications using Coplanar Waveguide," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 2404-2409.

Zhang, Shuye, Yang, Ming, Wu, Yang, Du, Jikun, Lin, Tiesong, He, Peng, Huang, Mingliang, and Paik, Kyung-Wook, "A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 °C Bonding Temperature," IEEE Transactions on Components, Packaging, and Manufacturing Technology , vol. 8 no. 3, pp. 383-391, Mar. 2018.

Zhang, Shuye, Qi, Xiaoquan, Yang, Ming, Cao, Yang, Lin, Tiesong, He, Peng, and Paik, Kyung-Wook, "A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives," Journal of Materials Science: Materials in Electronics, vol. 30 no. 10, pp. 9171-9183, May 2019.

Zhang, Shuye, Kim, Seung-Ho, Kim, Tae-Wan, Kim, Yoo-Sun, and Paik, Kyung-Wook, "A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-Board Assembly Applications Using Ultrasonic Bonding," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 5 no. 1, pp. 9-14, Jan. 2015.

Zhang, Shuye, and Paik, Kyung-Wook, "Effects of Cooling Processes and Silica Filler Contents of Solder ACFs (Anisotropic Conductive Films) on the Joints Reliability," 2016 IEEE 66th Electronic Components and Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 737-742.

Zhang, Shuye, Park, Jae-Hyeong, and Paik, Kyung-Wook, "Joint Morphologies and Failure Mechanisms of Anisotropic Conductive Films (ACFs) During a Power Handling Capability Test for Flex-On-Board Applications," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 6 no. 12, pp. 1820-1826, Dec. 2016.

Zhang, Tao, Liu, Yang, Zhao, Kai, and Sun, Fenglian, "Fabricating high temperature used solders with Cu@Ag core-shell micro-nano particle addition," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1406-1410.

Zhang, Tao, Evans, John, Mitchell, Charles, Li, Zhao Zhi, Crandall, Erika, Ridenour, Joshua, and Xie, Fei, "Reliability of Lead-Free BGA with Sn-Pb Solder Paste for Harsh Environments," 2009 AIMS Harsh Environments Electronics Symposium, San Diego, CA, Oct. 5-6, 2009, pp. 899-906.

Zhang, Tao, and Ling, Zhiyuan, "Template-assisted fabrication of Ni nanowire arrays for high efficient oxygen evolution reaction," Electrochimica Acta, vol. 318, pp. 91-99, Sept. 20, 2019.

Zhang, Teresa W., and Dornfeld, David A., "A Cradle to Grave Framework for Environmental Assessment of Photovoltaic Systems," 2010 IEEE International Symposium on Sustainable Systems and Technology, Arlington, VA, May 17-19, 2010, pp. xx-xx.

Zhang, Tianwei, Huang, Yuhong, Zhang, Weilin, Ma, Fei, and Xu, Kewei, "Effect of stacking sequence on crystallization in Al/a-Ge bilayer thin films," Journal of Vacuum Science & Technology A: Vacuum Surfaces, and Films, vol. 32 no. 3, pp. 031501-1-031501-7, May/June 2014.

Zhang, W., Limaye, P., Civale, Y., Labie, R., and Soussan, P., "Fine pitch Cu/Sn solid state diffusion bonding for making high yield bump interconnections and its application in 3D integration," 2010 3rd Electronic System-Integration Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.

Zhang, W., Dimcic, B., Limaye, P., Manna, A. L., Soussan, P., and Beyne, E., "Ni/Cu/Sn Bumping Scheme for Fine-pitch Micro-bump Connections," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 109-113.

Zhang, W., and Ruythooren, W., "Study of the Au/In Reaction for Transient Liquid-Phase Bonding and 3D Chip Stacking," Journal of Electronic Materials, vol. 37 no. 8, pp. 1095-1101, Aug. 2008.

Zhang, Wan, Guebey, Jonas, and Toben, Michael, "A Novel Electrolyte for the High Speed Electrodeposition of Bright Pure Tin at Elevated Temperatures," Metal Finishing, vol. 109 no. 1-2, pp. 13-19, Jan.-Feb. 2011.

Zhang, Wan, and Schwager, Felix, "Effects of Lead on Tin Whisker Elimination," iNEMI Tin Whisker Workshop, San Diego, CA, May 30, 2006, pp. xx-xx.

Zhang, Wan, and Schwager, Felix, "Effects of Lead on Tin Whisker Elimination," Journal of the Electrochemical Society, vol. 153 no. 5, pp. C337-C343, 2006.

Zhang, Wan, Clauss, Margit, and Schwager, Felix, "Growth Behavior of Meta-Stable NiSn3 Intermetallic Compound and Its Potential Influence on the Reliability of Electronic Components," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1 no. 8, pp. 1259-1268, Aug. 2011.

Zhang, Wan, Egli, Andre, Schwager, Felix, and Brown, Neil, "Investigation of Sn-Cu Intermetallic Compounds by AFM: New Aspects of the Role of Intermetallic Compounds in Whisker Formation," IEEE Transactions on Electronics Packaging Manufacturing,", vol. 28 no. 1, pp. 85-93, Jan. 2005.

Zhang, Wang, Han, Wei-Hua, Lv, Qi-Feng, Wang, Hao, and Yang, Fu-Hua, "Si-based Horizontal InAs Nanowire Transistors," 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology , Hangzhou, China, Oct. 25-28, 2016, pp. 999-1001.

Zhang, Wei, Amoli, Behnam Meschi, d'Eon, Jeffrey, Zhao, Boxin, and Chen, Alex, "Application of Novel Dopamine-Polypyrrole Nanofibers for Electrically Conductive Adhesives," Proceedings of SMTA Pan Pacific Symposium, Kauai, HI, Feb. 2-5, 2015, pp. xx-xx.

Zhang, Wei, Amoli, Behnam Meschi, d'Eon, Jeffrey, Zhao, Boxin, and Chen, Alex, "Application of Novel Dopamine-Polypyrrole Nanofibers for Electrically Conductive Adhesives," SMTAnews & Journal of Surface Mount Technology, vol. 28 no. 3, pp. 26-31, July-Sept. 2015.

Zhang, Wei, Zhong, Ying, and Wang, Chunqing, "Effect of Diamond Additions on Wettability and Distribution of SnAgCu Composite Solder," Journal of Materials Science and Technology , vol. 28 no. 7, pp. 661-665, July 2012.

Zhang, Wei Wei, Ma, Yong, Zhou, Wei, and Wu, Ping, "The Structural, Elastic and Electronic Properties of Ni3-xCuxSn4 (x = 0, 0.5, 1 and 1.5) Intermetallic Compounds via Ab Initio Calculations," Journal of Electronic Materials, vol. 48 no. 7, pp. 4533-4543, July 2019.

Zhang, Wenfei, An, Bing, Guo, Wei, Chai, Shen, and Wu, Yiping, "Research on Shear creep properties of SAC305 Solder Bumps in Ball Grid Array," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 909-913.

Zhang, X., Solak, H., Cerrina, F., Lai, B., Cai, Z., Ilinski, P., Legnini, D., and Rodrigues, W., "X-ray microdiffraction study of Cu interconnects," Applied Physics Letters, vol. 76 no. 3, pp. 315-317, Jan. 17, 2000.

Zhang, X. F., Guo, J. D., and Shang, J. K., "Abnormal polarity effect of electromigration on intermetallic compound formation in SN-9Zn solder interconnect," Scripta Materialia, vol. 57 no. 6, pp. 513-516, Sept. 2007.

Zhang, X. F., Guo, J. D., and Shang, J. K., "Controlling Intermetallic Compound Formation Reaction between Sn and Ni-P by Zn Addition," Journal of Alloys and Compounds, vol. 479 no. 1-2, pp. 505-510, June 24, 2009.

Zhang, X. F., Guo, J. D., and Shang, J. K., "Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate," Journal of Electronic Materials, vol. 39 no. 3, pp. 333-337, Mar. 2010.

Zhang, X. F., Guo, J. D., and Shang, J. K., "Effect of Electromigration on Intermetallic Compound Formation in Sn-9Zn Solder Interconnect," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Zhang, X. F., Guo, J. D., and Shang, J. K., "Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect," Journal of Electronic Materials, vol. 38 no. 3, pp. 425-429, Mar. 2009.

Zhang, X. F., Guo, J. D., and Shang, J. K., "Electromigration Behavior of the Ni/SnZn/Cu Solder Interconnect," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Zhang, X. F., Guo, J. D., and Shang, J. K., "Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization," Journal of Alloys and Compounds , vol. 487 no. 1-2, pp. 776-780, Nov. 13, 2009.

Zhang, X. F., Liu, H. Y., Guo, J. D., and Shang, J. K., "Inhibition of Electromigration in Eutectic SnBi Solder Interconnect by Plastic Prestraining," Journal of Materials Science and Technology , vol. 27 no. 11, pp. 1072-1076, Nov. 2011.

Zhang, X. P., Yu, C. B., Shrestha, S., and Dorn, L., "Creep and fatigue behaviors of the lead-free Sn-Ag-Cu-Bi and Sn60Pb40 solder interconnections at elevated temperatures," Journal of Materials Science: Materials in Electronics, vol. 18 no. 6, pp. 665-670, June 2007.

Zhang, X. P., Wang, H. W., and Shi, Y. W., "Influence of minute amount of elements Bi, Ag and In on surface tension and soldering process performance of tin-lead based solders," Journal of Materials Science: Materials in Electronics, vol. 15 no. 8, pp. 511-517, Aug. 2004.

Zhang, X. P., Yu, C. B., Zhang, Y. P., Shrestha, S., and Dorn, L., "Processing treatment of a lead-free Sn-Ag-Cu-Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection," Journal of Materials Processing Technology, vol. 192-193, pp. 539-542, Oct. 1, 2007.

Zhang, X. P., Yin, L. M., and Yu, C. B., "Thermal creep and fracture behaviors of the lead-free Sn-Ag-Cu-Bi solder interconnections under different stress levels," Journal of Materials Science: Materials in Electronics, vol. 19 no. 4, pp. 393-398, Apr. 2008.

Zhang, X. P., Lim, C. S. H., Mai, Y. W., and Shi, Y. W., "Thermal Fatigue and Creep Fracture Behaviors of a Nanocomposite Solder in Microelectronic/optoelectronic Packaging," Key Engineering Materials , vol. 312, pp. 237-242, 2006.

Zhang, X. Y., Cai, Y., Miao, J. Y., Ng, K. Y., Chan, Y. F., Zhang, X. X., and Wang, N., "Formation and phase transformation of selenium nanowire arrays in anodic porous alumina templates," Journal of Crystal Growth, vol. 276 no. 3-4, pp. 674-679, Apr. 1, 2005.

Zhang, Xi, and Xiang, Gang, "Magnetic Properties of Iron-Based Alloy Nanowires upon Heat Treatment," Advanced Materials Research, vol. 239-242, pp. 197-201, 2011.

Zhang, Xiao, Yang, Yang, Xu, Fangfang, Li, Tie, and Wang, Yuelin, "In-situ TEM mechanical characterization of nanowire in atomic scale using MEMS device," Microsystem Technologies, vol. 24 no. 4, pp. 2045-2049, Apr. 2018.

Zhang, Xiaodan, Hansen, Niels, Godfrey, Andrew, and Huang, Xiaoxu, "Structure and strength of sub-100nm lamellar structures in cold-drawn pearlitic steel wire," Materials Science and Technology, vol. 34 no. 7, pp. 794-808, May 2018.

Zhang, Xiaorui, Matsuura, Hiroyuki, Tsukihashi, Fumitaka, and Yuan, Zhangfu, "Wettability of Sn-Zn, Sn-Ag-Cu and Sn-Bi-Cu Alloys on Copper Substrates," Materials Transactions, vol. 53 no.5, pp. 926-931, 2012.

Zhang, Xiaowu, Rajoo, Ranjan, Che, F. X., Selvanayagam, C. S., Choi, W. K., Gao, Shan, Lo, G. Q., and Kwong, D.-L., "A Low Stress Bond Pad Design Optimization of Low Temperature Solder Interconnections on TSVs for MEMS Applications," 2011 IEEE International 3D Systems Integration Conference, Osaka, Japan, Jan. 31-Feb. 2, 2012, pp. xx-xx.

Zhang, Xiaowu, Wong, E. H., and Iyer, Madhadevan K., "Board Level Reliability Enhancement for A Double-bump Wafer Level Chip Scale Package," Journal of Microelectronics and Electronic Packaging, vol. 1 no. 2, pp. 64-71, Second Quarter 2004.

Zhang, Xinjiang, Zhan, Yongzhong, Guo, Qinghua, Zhang, Guanghua, and Hu, Jing, "The 473 K isothermal section of the Cu-Ti-Sn ternary system," Journal of Alloys and Compounds, vol. xxx no. xxx, pp. xx-xx, xxxx.

Zhang, Xiwei, Tang, Zhenjie, Hu, Dan, Meng, Dan, and Jia, Shuanwen, "Nanoscale p-n junctions based on p-type ZnSe nanowires and their optoelectronic applications," Materials Letters, vol. 168, pp. 121-124, Apr. 1, 2016.

Zhang, Xu, Xu, Guangchen, and Guo, Fu, "Effects of Micron-Sized Metal Particles on the Mechanical Properties of In-Sn Thermal Interface Materials," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 1169-1171.

Zhang, Xudong, Hu, Xiaowu, Jiang, Xiongxin, Zhou, Liuru, and Li, Qinglin, "Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints," Journal of Materials Science: Materials in Electronics, vol. 31 no. 3, pp. 2320-2330, Feb. 2020.

Zhang, Xudong, Hu, Xiaowu, Jiang, Xiongxin, Li, Qinglin, and Zhou, Liuru, "Novel insights in growth of intermetallic compounds between Sn-3.0Ag-0.5Cu solder and flexible PCB substrates under strain," Journal of Materials Science: Materials in Electronics, vol. 30 no. 10, pp. 9410-9420, May 2019.

Zhang, Xueren, Goh, Wei Zhen, Wong, Kim-sing, Yap, Daniel, and Goh, Kim-yong, "Enhance TCOB life for Wafer Level Package with a New Leadfree Solder Alloy," 2015 IEEE 17th Electronics Packaging and Technology Conference, Singapore, Dec. 2-4, 2015, pp. xx-xx.

Zhang, Xundi, Yang, Chenlin, Sun, Menglong, Hu, Anmin, Li, Ming, Gao, Liming, Hang, Tao, and Ling, Huiqin, "Inhibition of tin whisker by electroplating ultra-thin Co-W amorphous barrier layer," Materials Characterization, vol. 162, pp. 110221-1-110221-8, Apr. 2020.

Zhang, Y., and Abys, J. A., "An Alternative Surface Finish for Tin/Lead solders - Pure Tin," Proceedings AESF SUR/FIN '96, Cleveland, OH, June 10-13, 1996, pp. 223-246.

Zhang, Y., Abys, J. A., Chen, C. H., and Siegrist, T., "An Alternative Surface Finish for Tin-Lead Solders," Plating & Surface Finishing, vol. 85 no. 6, pp. 105-111, June 1998.

Zhang, Y., Breck, G., Humiec, F., Murski, K., and Abys, A., "An Alternative Surface Finish for Tin/Lead Solders: Pure Tin," Surface Mount International Proceedings of the Technical Program, Volume II, San Jose, CA, Sept. 10-12, 1996, pp. 641-649.

Zhang, Y. F., Tang, Y. H., Lam, C., Wang, N., Lee, C. S., Bello, I., and Lee, S. T., "Bulk-quantity Si nanowires synthesized by SiO sublimation," Journal of Crystal Growth, vol. 212 no. 1-2, pp. 115-118, 2000.

Zhang, Y., and Ivey, D. G., "Electroplating of Gold-Tin Alloys From a Sulfite-Citrate Bath," Plating & Surface Finishing, vol. 91 no. 2, pp. 28-33, Feb. 2004.

Zhang, Y., Zavarine, I., Steinius, O., Kleinfeld, M., Rietman, C., Richardson, T., Fan, C., Xu, C., Zhuang, H., Plass, B., Sison, E., and Lu, P. H., "Lead-free Bumping and Its Challenges," Wafer-Level Congress and Exhibition Conference Proceedings, San Jose, CA, Oct. 10-12, 2004, pp. xx-xx.

Zhang, Y., Zavarine, I., Steinius, O., Kleinfeld, M., Rietman, C., Richardson, T., Fan, C., Xu, C., Zhuang, H., Plass, B., Sison, E., and Lu, P. H., "Lead-Free Bumping and Its Challenges," International Wafer Level Packaging Congress, San Jose, CA, Oct. 2004, pp. xx-xx.

Zhang, Y. F., Tang, Y. H., Wang, N., Lee, C. S., Bello, I., and Lee, S. T., "One-dimensional growth mechanism of crystalline silicon nanowires," Journal of Crystal Growth, vol. 197 no. 1-2, pp. 136-140, Feb. 1, 1999.

Zhang, Y., Fan, C., Xu, C., Khaselev, O., and Abys, J. A., "Tin Whisker Growth - Substrate Effect Understanding CTE Mismatch and IMC Formation," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S27-2-1-S27-2-20.

Zhang, Y., Fan, C., Xu, C., Khaselev, O., and Abys, J. A., "Tin Whisker Growth - Substrate Effect: Understanding CTE Mismatch and IMC Formation," CircuiTree, vol. 17 no. 6, pp. xx, June 2004.

Zhang, Yali, Um, Joseph, Zhou, Wen, Stadler, Bethanie, and Franklin, Rhonda, "Magnetic Nanowires for RF applications: Ferromagnetic Resonance and Permeability Characterization," 2019 IEEE MTT-S International Microwave Symposium, Boston, MA, June 2-7, 2019, pp. 1100-1103.

Zhang, Yan, Sitek, Janusz, Fan, Jing-yu, Ma, Shiwei, Koscielski, Marek, Ye, Lilei, and Liu, Johan, "Characterization of nano-enhanced interconnect materials for fine pitch assembly," Soldering & Surface Mount Technology, vol. 26 no. 1, pp. 12-17, 2014.

Zhang, Yan, Liu, Johan, Larsson, Ragnar, and Watanabe, Itsuo, "Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection," Journal of Adhesion Science and Technology, vol. 22 no. 14, pp. 1717-1731, 2008.

Zhang, Yan, Larsson, Ragnar, Fan, Jing-yu, and Liu, Johan, "Interface Modelling of ACA Interconnects Using Micropolar Theory," 7th IEEE CPMT International Conference on High Density Microsystem Design, Packaging and Failure Analysis, Shanghai, June 28, 2005, pp. xx-xx.

Zhang, Yan, Fan, Jing-yu, and Liu, Johan, "Multiscale Delamination Modeling of an Anisotropic Conductive Adhesive Interconnect based on Micropolar Theory and Cohesive Zone Model," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 160-163.

Zhang, Yan, Larsson, Ragnar, Fan, Jing-yu, and Liu, Johan, "Study on the Multi-Scale Properties of the Internal Structure in ACA Interconnection," 1st Electronics Systemintegration Technology Conference, Volume 2, Dresden, Germany, Sept. 5-7, 2006, pp. 757-761.

Zhang, Yan, Zhang, Peigen, He, Wei, and Sun, Zhengming, "Tin whisker growth on immiscible Al-Sn alloy," Journal of Materials Science: Materials in Electronics, vol. 31 no. 2, pp. 1328-1334, Jan. 2020.

Zhang, Yanbo, Zhang, Zheming, Chen, Haibin, Mclellan, Neil, and Wu, Jingshen, "An Advanced High Speed Solder Ball Impact Method and Its Operation System," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 976-981.

Zhang, Yannan, Zhang, Yingjie, Li, Xue, Liu, Jiaming, Zhang, Mingyu, Yang, Xi, Huang, Mengyang, Xu, Mingli, Dong, Peng, and Zhou, Zhongren, "Low-Cost Fabrication of Silicon Nanowires by Molten Salt Electrolysis and Their Electrochemical Performances as Lithium-Ion Battery Anodes," JOM , vol. 72 no. 6, pp. 2245-2249, June 2020.

Zhang, Ye, Xu, Yangjian, Liu, Yong, and Schoenberg, Andrew, "The Experimental and Numerical Investigation on Shear Behaviour of Solder Ball in a Wafer Level Chip Scale Package," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1746-1751.

Zhang, Yifei, Cai, Zijie, Suhling, Jeffrey C., and Lall, Pradeep, "Aging Effects on the Mechanical Behavior and Reliability of SAC Alloys," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 959-976.

Zhang, Yifei, Kurumaddali, Kanth, Suhling, Jeffrey C., Lall, Pradeep, and Bozack, Michael J., "Analysis of the Mechanical Behavior, Microstructure, and Reliability of Mixed Formulation Solder Joints," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 759-770.

Zhang, Yifei, Kurumaddali, Kanth, Suhling, Jeffrey C., Lall, Pradeep, and Bozack, Michael J., "Material Behavior of Mixed Formulation Solder Joints," Proceedings of the ASME 2009 InterPack Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 335-346.

Zhang, Yifei, Mitchell, Charles, Suhling, Jeffrey C., Evans, John L., Lall, Pradeep, and Bozack, Michael J., "Properties of Mixed Formulation Solders," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 644-651.

Zhang, Yifei, Cai, Zijie, Suhling, Jeffrey C., Lall, Pradeep, and Bozack, Michael J., "The Effects of Aging Temperature on SAC Solder Joint Material Behavior and Reliability," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 99-112.

Zhang, Yifei, Cai, Zijie, Suhling, Jeffrey C., Lall, Pradeep, and Bozack, Michael J., "The Effects of SAC Alloy Composition on Aging Resistance and Reliability," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 370-389.

Zhang, Yifei, Cai, Zijie, Mustafa, Muhannad, Suhling, Jeffrey C., Lall, Pradeep, and Bozack, Michael J., "The Influence of Aging on the Stress-Strain and Creep Behavior of SAC Solder Alloys," 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June 2-5, 2010, pp. xx-xx.

Zhang, Yingjiu, Zhang, Qi, Wang, Nanlin, Yan, Yunjie, Zhou, Huihua, and Zhu, Jing, "Synthesis of thin Si whiskers (nanowires) using SiCl4," Journal of Crystal Growth, vol. 226 no. 2-3, pp. 185-191, June 2001.

Zhang, Yingjiu, Ago, Hiroki, Liu, Jun, Yumura, Motoo, Uchida, Kunio, Ohshima, Satoshi, Iijima, Sumio, Zhu, Jing, and Zhang, Xiaozhong, "The synthesis of In, In2O3 nanowires and In2O3 nanoparticles with shape-controlled," Journal of Crystal Growth, vol. 264 no. 1-3, pp. 363-368, Mar. 15, 2004.

Zhang, Yongzhong, Ji, Hongjun, and Wang, Jiao, "Microstructure and Property of Au stud/Lead-free solder composite joint," 2019 20th International Conference on Electronic Packaging Technology , Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Zhang, Yu, Zhu, Pengli, Li, Gang, Zhang, Baotan, Sun, Rong, and Wong, Chingping, "Facile Synthesis of Elliptical Cu-Ag Nanoplates for Electrically Conductive Adhesives," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 279-282.

Zhang, Yu, Nishi, Naoya, Amano, Ken-ichi, and Sakka, Tetsuo, "One-dimensional Pt nanofibers formed by the redox reaction at the ionic liquid|water interface," Electrochimica Acta, vol. 282, pp. 886-891, Aug. 20, 2018.

Zhang, Yuanxiang, Ni, Jiamin, Liu, Yong, and Maniatty, Antoinette M., "Modeling Effect of Grain Orientation on Degradation in Tin-Based Solder: I. Current-Driven Diffusion," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 9 no. 3, pp. 473-482, Mar. 2019.

Zhang, Yue, Liang, Tongxiang, and Jusheng, M. A., "Phase diagram calculation on Sn-Zn-Ga solders," Journal of Non-Crystalline Solids, vol. 336 no. 2, pp. 153-156, May 2004.

Zhang, Yujian, He, Siliang, and Nishikawa, Hiroshi, "Impact Strength of Sn-Ag-Cu/Cu Solder Bumps Formed by an Induction Heating Method," 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 25-27, 2017, pp. 50-53.

Zhang, Yujun, Yu, Hui, and Li, Liangliang, "Synthesis and Low-temperature Sintering of Tin-doped Silver Nanoparticles," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 209-212.

Zhang, Yuming, Zhu, Honglai, Fujiwara, Masami, Xu, Jinquan, and Dao, Ming, "Low-temperature creep of SnPb and SnAgCu solder alloys and reliability prediction in electronic packaging modules," Scripta Materialia, vol. 68 no. 8, pp. 607-610, Apr. 2013.

Zhang, Yun, and Abys, Joseph A., "A unique electroplating tin chemistry," Circuit World, vol. 25 no. 1, pp, 30-37, 1999.

Zhang, Yun, "Can Thin Sn over Ni be an Answer to Tin Whiskers?," IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.

Zhang, Yun, "Tin Electroplating Process," U. S. Patent 5,750,017, May 12, 1998.

Zhang, Yun, Xu, Chen, Fan, Chonglun, and Abys, Joseph A., "Tin Whisker Growth and Prevention," Journal of SMT, vol. 13 no. 4, pp. 1-9, Oct. 2000.

Zhang, Yun, Xu, Chen, Fan, Chonglun, Vysotskaya, Anna, and Abys, Joseph A., "Understanding Whisker Phenomenon - Part I: Growth Rates," Electroplating Chemicals and Services.

Zhang, Z. H., Li, M. Y., Liu, Z. Q., and Yang, S. H., "Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)Cu and liquid-Sn0.7Cu/(001)Cu joint interfaces," Acta Materialia, vol. 104, pp. 1-8, Feb. 1, 2016.

Zhang, Z. H., Wei, C. W., Han, J. J., Cao, H. J., and Li, M. Y., "Growth evolution and formation mechanism of n'-Cu6Sn5 whiskers on n-Cu6Sn5 intermetallics during room-temperature ageing," Acta Materialia, vol. 183, pp. 340-349, Jan. 15, 2020.

Zhang, Z. H., Cao, H. J., Yang, H. F., Li, M. Y., and Yu, Y. X., "Hexagonal-Rod Growth Mechanism and Kinetics of the Primary Cu6Sn5 Phase in Liquid Sn-Based Solder," Journal of Electronic Materials, vol. 45 no. 11, pp. 5985-5995, Nov. 2016.

Zhang, Z. Q., Shi, S. H., and Wong, C. P., "Development of No-Flow Underfill Materials for Lead-Free Solder Bumped Flip-Chip Applications," 6th International Symposium on Advanced Packaging Materials, Braselton, GA, Mar. 6-8, 2000, pp. 278-284.

Zhang, Z. X., Chen, X. Y., and Xiao, F., "The Sintering Behavior of Electrically Conductive Adhesives Filled with Surface Modified Silver Nanowires," Journal of Adhesion Science and Technology, vol. 25 no. 13, pp. 1465-1480, 2011. https://doi.org/10.1163/016942410X549924

Zhang, Ze-Jun, Zhou, Min-Bo, Sun, Tao, Wu, Xue, and Zhang, Xin-Ping, "Influences of Ag and Zn contents on interfacial microstructure and corrosion behavior of Sn-Zn-Ag/6061Al joints in antenna module packages," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Zhang, Zhao, Chen, Zhiwen, Liu, Sheng, Dong, Fang, Liang, Kang, and Ma, Kun, "The comparison of Qian-Liu model and Anand model for uniaxial tensile test of SAC305," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Zhang, Zhe, Hu, Xiaowu, Jiang, Xiongxin, and Li, Yulong, "Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 50 no. 1, pp. 480-492, Jan. 2019.

Zhang, Zheming, Wu, Jingshen, Zbrzezny, Adam R., and Mclellan, Neil, "Effect of Shear Rate on Lead Free Solder Joint Strength," International Conference on Electronic Packaging Technology & High Density Packaging , Shanghai, China, July 28-31, 2008, pp. xx-xx.

Zhang, Zheming, and Wu, Jingshen, "Research on Temperature Gradient Effect to Solder Joint Reliability," 2012 14th International Conference on Electronic Materials and Packaging , Hong Kong, Dec. 13-16, 2012, pp. xx-xx.

Zhang, Zhen, Park, S. B., Darbha, Krishna, and Master, Raj N., "Impact of Usage Conditions on Solder Joint Fatigue Life," 2010 Proceedings 60th Electronic Components and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 14-19.

Zhang, Zheng, Liu, Qingyi, Pan, Xiaoxu, Wang, Qizhi, and Su, Fei, "Influence of stress on the electromigration life of solder," 2016 IEEE 37th International Electronics Manufacturing Technology & 18th Electronics Materials and Packaging Conference, Penang, Malaysia, Sept. 20-22, 2016, pp. xx-xx.

Zhang, Zheng, Liu, Qingyi, Pan, Xiaoxu, Wang, Qizhi, and Su, Fei, "Influence of Stress on the Electromigration Life of Solder," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 7 no. 5, pp. 762-767, May 2017.

Zhang, Zheng, Wang, Yuan, and Su, Fei, "The Morphology Change of SnAgCu Solder Under Current Stressing," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1155-1158.

Zhang, Zhi, Lu, Zhen-Yu, Chen, Ping-Ping, Lu, Wei, and Zou, Jin, "Controlling the crystal phase and structural quality of epitaxial InAs nanowires by tuning V/III ratio in molecular beam epitaxy," Acta Materialia, vol. 92, pp. 25-32, June 15, 2015.

Zhang, Zhi-Hao, Wang, Xi-Shu, Ren, Huai-Hui, Jia, Su, and Yang, Hui-Hui, "Simulation study on thermo-fatigue failure behavior of solder joints in package-on-package structure," Microelectronics Reliability, vol. 75, pp. 127-134, Aug. 2017.

Zhang, Zhihao, Cao, Huijun, Xiao, Yong, Cao, Yong, Li, Mingyu, and Yu, Yuxi, "Electromigration-induced growth mode transition of anodic Cu6Sn5 grains in Cu|SnAg3.0Cu0.5|Cu lap-type interconnects," Journal of Alloys and Compounds, vol. 703, pp. 1-9, May 5, 2017.

Zhang, Zhihao, Li, Mingyu, and Wang, Chunqing, "Fabrication of Cu6Sn5 single-crystal layer for under-bump metallization in flip-chip packaging," Intermetallics, vol. 42, pp. 52-55, Nov. 2013.

Zhang, Zhihao, Cao, Huijun, Xiao, Yong, and Li, Mingyu, "Morphology, Kinetics and service reliability of Cu6Sn5 texture formed on Sn/Cu interface," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1056-1059.

Zhang, Zhihao, Kim, Jongmyung, and Li, Mingyu, "Nanoindentation Characteristics of Cu6Sn5 Formed in Lead Free Solder Joints," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 953-956.

Zhang, Zhihao, Cao, Huijun, and Li, Mingyu, "Synthetic and formation mechanism of Cu6Sn5 single-crystal layer on Cu pad for UBM application," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 347-350.

Zhang, Zhijie, Huang, Mingliang, Zhao, Ning, and Feng, Xiaofei, "Study on Liquid-Solid Electromigration in Cu/Sn-9Zn/Cu Interconnect Using Synchrotron Radiation Real-Time in Situ Imaging Technology," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 126-129.

Zhang, Zhikun, Jiang, Sijia, Liu, Johan, and Inoue, Masahiro, "Development of High Temperature Stable Isotropic Conductive Adhesives," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Zhang, Zhongxian, Chen, Xiangyan, Yang, Haowei, Fu, Huiying, and Xiao, Fei, "Electrically Conductive Adhesives with Sintered Silver Nanowires," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 834-837.

Zhang, Zhuqing, and Wong, C. P., "Assembly of Lead-Free Bumped Flip-Chip With No-Flow Underfills," IEEE Transactions on Electronics Packaging Manufacturing, vol. 25 no. 2, pp. 113-119, Apr. 2002.

Zhang, Zhuqing, and Wong, C. P., "Development of No-Flow Underfill for Lead-Free Bumped Flip-Chip Assemblies," International Symposium on Electronic Materials and Packaging , Hong Kong, China, Nov. 30-Dec. 2, 2000, pp. 297-303.

Zhang, Zhuqing, Liong, Silvia, and Wong, C. P., "High Frequency Measurement of Isotropic Conductive Adhesives," 2001 International Symposium on Advanced Packaging Materials, Braselton, GA, Mar. 11-14, 2001, pp. 246-250.

Zhang-mi, Tu, Zhe-long, Yang, Mao-zhong, An, Wen-liang, Li, and Jing-shuang, Zhang, "Research on the Structure and the Corrosion Resistance of Zn-Co Alloy Coating," Transactions of the Institute of Metal Finishing, vol. 77 no. 6, pp. 241-247, Nov. 1999.

Zhao, Bin, An, Bing, Wu, Feng-shun, and Wu, Yi-ping, "Effects of Heating Factors on Brittle Fractures of Solder Joints by High Speed Shear Test," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Zhao, Bingge, Zhao, Jin, Zhang, Weipeng, Yang, Bin, Zhai, Qijie, Schick, Christoph, and Gao, Yulai, "Fast scanning calorimetric measurements and microstructure observation of rapid solidified Sn3.5Ag solder droplets," Thermochimica Acta, vol. 565, pp. 194-201, Aug. 10, 2013.

Zhao, Cong, Shen, Chaobo, Hai, Zhou, Zhang, Jiawei, Bozack, M. J., and Evans, J. L., "Long Term Aging Effects on the Reliability of Lead Free Solder Joints in Ball Grid Array Packages with Various Pitch Sizes and Ball Alignments," SMTA International 2015 Proceedings, Rosemont, IL, Sept. 27-Oct. 1, 2015, pp. 199-206.

Zhao, Cong, Shen, Chaobo, Hai, Zhou, Basit, Munshi M., Zhang, Jiawei, Bozack, Michael. J., Evans, John. L., and Suhling, Jeffrey C., "Long Term Aging Effects on the Reliability of Lead Free Solder Joints in Ball Grid Array Packages with Various Pitch Sizes and Ball Arrangements," SMTA Journal, vol. 29 no. 2, pp. 37-46, 2016.

Zhao, Cong, Sanders, Thomas, Shen, Chaobo, Hai, Zhou, Evans, John L., Bozack, M. J., and Suhling, Jeffrey, "Reliability of Doped Lead-Free Solder Joints Under Isothermal Aging and Thermal Cycling," SMTA International 2016 Proceedings, Rosemont, IL, Sept. 25-29, 2016, pp. 599-605.

Zhao, Di, Zhang, Keke, Cui, Jianguo, Ma, Ning, Pan, Yibo, and Yin, Chenxiang, "Effect of ultrasonic vibration on the interfacial IMC three-dimensional morphology and mechanical properties of Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu halogen free solder joints," Journal of Materials Science: Materials in Electronics, vol. 29 no. 21, pp. 18828-18839, Nov. 2018.

Zhao, Fang, Wang, Qian, and Lee, Taekoo, "Characteristics of Tin Whisker Growth on Matte Tin Surface Finishes by Acceleration Conditions," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Zhao, Guangfeng, and Yang, Fuqian, "Effect of DC current on tensile creep of pure tin," Materials Science and Engineering: A, vol. 591, pp. 97-104, Jan. 3, 2014.

Zhao, Guodong, Pan, Zhiliang, Lu, Chengxiang, and Cai, Xufu, "Halogen-Free Intumescent Flame Retardant Acrylonitrile-Butadiene-Styrene/Poly(ethylene terephthalate) Blends," Journal of Applied Polymer Science, vol. 118 no. 3, pp. 1589-1597, Nov. 5, 2010.

Zhao, Guo-ji, Wen, Guang-hua, Sheng, Guang-min, and Jing, Yan-xia, "Effects of rapid solidification process and 0.1%Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints," Journal of Central South University, vol. 23 no. 8, pp. 1831-1838, August 2016.

Zhao, Guoji, Sheng, Guangmin, Xue, Haofei, and Yuan, Xinjian, "Improved mechanical property of a Cu/Sn-9Zn-0.1Cr/Cu joint using a rapidly solidified solder," Materials Letters, vol. 68, pp. 129-132, Feb. 1, 2012.

Zhao, Guoji, Sheng, Guangmin, Luo, Jun, and Yuan, Xinjian, "Solder Characteristics of a Rapidly Solidified Sn-9Zn-0.1Cr Alloy and Mechanical Properties of Cu/Solder/Cu Joints," Journal of Electronic Materials, vol. 41 no. 8, pp. 2100-2106, Aug. 2012.

Zhao, H., Wang, H. Q., Sekulic D. P., and Qian, Y. Y., "Spreading Kinetics of Liquid Solders over an Intermetallic Solid Surface. Part 2: Lead-Free Solders," Journal of Electronic Materials, vol. 38 no. 9, pp. 1846-1854, Sept. 2009.

Zhao, Heng, Liu, Qing-bin, Lan, Yuan-pei, Wang, Hua, and Yao, Da-wei, "The Application and Research Status of Tin Whisker Formation in Electric Usage," AIP Conference Proceedings, vol. 1839, pp. 020003-1-020003-10, 2017. https://doi.org/10.1063/1.4982368

Zhao, Hu, Eggeman, Alexander S., Race, Christopher P., and Derby, Brian, "Geometrical constraints on the bending deformation of Penta-twinned silver nanowires," Acta Materialia, vol. 185, pp. 110-118, Feb. 15, 2020.

Zhao, Hui, Nalagatla, Dinesh Reddy, and Sekulic, Dusan P., "Wetting Kinetics of Eutectic Lead and Lead-Free Solders: Spreading over the Cu Surface," Journal of Electronic Materials, vol. 38 no. 2, pp. 284-291, Feb. 2009.

Zhao, Huijing, Qu, Lin, Li, Hua, Zhao, Ning, and Ma, Haitao, "The study of cooling process' effect on the growth of IMC at Sn-3.5Ag/Cu soldering interface," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 372-376.

Zhao, J., Miyashita, Y., and Mutoh, Y., "Fatigue crack growth behavior of 96.5Sn-3.5Ag lead-free solder," International Journal of Fatigue, vol. 23 no. 8, pp. 723-731, Sept. 2001.

Zhao, J., Mutoh, Y., Miyahita, Y., and Mannan, S. L., "The Crack-Growth Behavior of Sn-Ag-Cu and Sn-Cu-Bi Lead-Free Solders," Journal of Electronic Materials, vol. 31 no. 8, pp. 879-886, Aug. 2002.

Zhao, Jianfei, Huang, Mingliang, Zhao, Ning, and Zhang, Zhijie, "Effect of Sn grain orientation on Cu diffusion in SnAgCu solder interconnect undergoing electromigration," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 1275-1278.

Zhao, Jie, Qi, Lin, and Wang, Lai, "Effect of Bi on the Kinetics of Intermetallics Growth in Sn-3Ag-0.5Cu/Cu Solder Joint," Proceedings of the 2006 IEEE CPMT Conference on High Density Microsystem Design, Packaging and Component Failure Analysis, Shanghai, June 27-28, 2006, pp. 232-235.

Zhao, Jie, Mutoh, Yoshiharu, Miyashita, Yukio, and Wang, Lai, "Fatigue crack growth behavior of Sn-Pb and Sn-based lead-free solders," Engineering Fracture Mechanics, vol. 70 no. 15, pp. 2187-2197, Oct. 2003.

Zhao, Jie, Qi, Lin, Wang, Xiu-min, and Wang, Lai, "Influence of Bi on microstructures evolution and mechanical properties in Sn-Ag-Cu lead-free solder," Journal of Alloys and Compounds, vol. 375 no. 1-2, pp. 196-201, July 28, 2004.

Zhao, Jie, Cheng, Cong-qian, Qi, Lin, and Chi, Cheng-yu, "Kinetics of intermetallic compound layers and shear strength in Bi-bearing SnAgCu/Cu soldering couples," Journal of Alloys and Compounds, vol. xx no. x, pp. xx-xx, xxxx.

Zhao, Jie, Li, Ning, Cui, Guofeng, and Zhao, Jianwei, "Study on Immersion Tin Process by Electrochemical Methods and Molecular Orbital Theory," Journal of the Electrochemical Society, vol. 153 no. 12, pp. C848-C853, 2006.

Zhao, Jie, Yang, Peng, Zhu, Feng, and Cheng, Cong-qian, "The effect of high magnetic field on the growth behavior of Sn-3Ag-0.5Cu/Cu IMC layer," Scripta Materialia, vol. 54 no. 6, pp. 1077-1080, Mar. 2006.

Zhao, Jie-Hao, Su, Peng, Ding, Min, Chopin, Sheila, and Ho, Paul S., "Microstructure-Based Stress Modeling of Tin Whisker Growth," IEEE Transactions on Electronics Packaging Manufacturing, vol. 29 no. 4, pp. 265-273, Oct. 2006.

Zhao, Jie-Hua, Su, Peng, Ding, Min, Chopin, Sheila, and Ho, Paul S., "Microstructure-Based Stress Modeling of Tin Whisker Growth," 2005 Proceedings 55th Electronic Components & Technology Conference, Orlando, FL, May 31-June 3, 2005, pp. 137-144.

Zhao, Jie-Hua, Gupta, Vikas, Lohia, Alok, and Edwards, Darvin, "Reliability Modeling of Lead Free Solder Joints in Wafer-Level Chip Scale Packages," Proceedings of the ASME InterPack Conference, Volume 1 , Vancouver, British Columbia, Canada, July 8-12, 2007, pp. 351-358.

Zhao, Jie-Hua, Gupta, Vikas, Lohia, Alok, and Edwards, Darvin, "Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages," Journal of Electronic Packaging, vol. 132 no. 1, pp. 011005-1-011005-6, Mar. 2010.

Zhao, Jin, Gao, Yulai, Zhang, Weipeng, Song, Tingting, and Zhai, Qijie, "Observation of the solidification microstructure of Sn3.5Ag droplets prepared by CDCA technique," Journal of Materials Science: Materials in Electronics, vol. 23 no. 12, pp. 2221-2228, Dec. 2012.

Zhao, Jingrui, Du, Yong, Zhang, Lijun, Wang, Aijun, Zhou, Liangcai, Zhao, Dongdong, and Liang, Jianlie, "Thermodynamic assessment of the Sn-Sr system supported by first-principles calculations," Thermochimica Acta, vol. 529, pp. 74-79, Feb. 10, 2012.

Zhao, Julia Y., Mackessy, David, and Jackson, John, "A Study of the Failure Mechanisms in Lead-Free and Eutectic Tin-Lead Solder Bumps for Flip Chip Assembly," 2005 SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 470-477.

Zhao, Julia Y., Mackessy, David, and Jackson, John, "A Study of the Failure Mechanisms in Lead-Free and Eutectic Tin-Lead Solder Bumps for Flip Chip Assembly," SMTAnews & Journal of Surface Mount Technology, vol. 19 no. 2, pp. 26-32, Apr.-June 2006.

Zhao, Kuai-le, Yan, Yan-fu, and Li, Yong-bing, "Effect of the Content of LaNd on Physical Properties and Solderability of Zn20Sn6Cu Solder," Materials Science Forum, vol. 686, pp. 515-520, June 2011.

Zhao, Kuai-le, Yan, Yan-fu, Sheng, Yang-yang, Du, Ning, and Liu, Zhan-lei, "Interfacial Reaction and Solderability of Zn20SnxCu Solder," Advanced Materials Research, vol. 337, pp. 402-405, Sept. 2011.

Zhao, Kuai-le, Yan, Yan-fu, Sheng, Yang-yang, Du, Ning, and Liu, Zhan-lei, "Interfacial Reaction and Solderability of Zn20SnxCu Solder," Advanced Materials Research, vol. 337, pp. 402-405, 2011.

Zhao, L., Chakraborty, P., Tonks, M. R., and Szlufarska, I., "On the plastic driving force of grain boundary migration: A fully coupled phase field and crystal plasticity model," Computational Materials Science, vol. 128, pp. 320-330, Feb. 15, 2017.

Zhao, M., and Jiang, Q., "Size effect on thermal properties in low-dimensional materials," Key Engineering Materials, vol. 444, pp. 189-218, July 2010.

Zhao, Mali, Shen, Jun, Chen, Jie, and Wu, Boyi, "Effects of Ni/Ag coating on the wettability of Sn-3Ag-0.5Cu alloy on Cu substrates at different temperatures," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging , Guilin, China, Aug. 13-16, 2012, pp. 890-895.

Zhao, Meng, Zhang, Liang, Liu, Zhi-quan, Xiong, Ming-yue, Sun, Lei, Jiang, Nan, and Xu, Kai-kai, "Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles," Journal of Materials Science: Materials in Electronics , vol. 30 no. 16, pp. 15054-15063, Aug. 2019.

Zhao, Mengke, Hao, Hu, Xu, Guangchen, Sun, Jia, Shi, Yaowu, and Guo, Fu, "Fundamental Studies on Whisker Growth in Sn-based Solders," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 585-588.

Zhao, N., Deng, J. F., Zhong, Y., Huang, M. L., and Ma, H. T., "Abnormal Intermetallic Compound Evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni Micro Solder Joints Under Thermomigration," Journal of Electronic Materials , vol. 46 no. 4, pp. 1931-1936, Apr. 2017.

Zhao, N., Liu, X. Y., Huang, M. L., and Ma, H. T., "Characters of multicomponent lead-free solders," Journal of Materials Science: Materials in Electronics, vol. 24 no. 10, pp. 3925-3931, Oct. 2013.

Zhao, N., Zhong, Y., Huang, M. L., Ma, H. T., and Dong, W., "Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient," Intermetallics, vol. 79, pp. 28-34, Dec. 2016.

Zhao, N., Wang, M. Y., Zhong, Y., Ma, H. T., Wang, Y. P., and Wong, C. P., "Effect of Zn content on Cu-Ni cross-interaction in Cu/Sn-xZn/Ni micro solder joints," Journal of Materials Science: Materials in Electronics, vol. 29 no. 6, pp. 5064-5073, Mar. 2018.

Zhao, N., Huang, M. L., Zhong, Y., Ma, H. T., and Pan, X. M., "Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions of eutectic Sn-0.7Cu solder," Journal of Materials Science: Materials in Electronics, vol. 26 no. 1, pp. 345-352, Jan. 2015.

Zhao, N., Zhong, Y., Huang, M. L., Dong, W., Ma, H. T., and Wang, Y. P., "In situ study on interfacial reactions of Cu/Sn-9Zn/Cu solder joints under temperature gradient," Journal of Alloys and Compounds, vol. 682, pp. 1-6, Oct. 15, 2016.

Zhao, N., Huang, M. L., and Wu, C. M. L., "Tensile creep behavior of Sn-Ag-Cu-Ni multicomponent lead-free solder alloy," Journal of Materials Science: Materials in Electronics, vol. 27 no. 7, pp. 6630-6636, July 2016.

Zhao, N., Pan, X. M., Yu, D. Q., Ma, H. T., and Wang, L., "Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders," Journal of Electronic Materials, vol. 38 no. 6, pp. 828-833, June 2009.

Zhao, Ning, Wang, Lai, Wan, Lixi, and Cao, Liqiang, "Absorption of Ag3Sn on Cu6Sn5 Intermetallic Compounds at Sn-3.5Ag-xCu/Cu Interfaces," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 909-912.

Zhao, Ning, Wang, Mingyao, Zhong, Yi, Ma, Haitao, and Wang, Yunpeng, "Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during Aging," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 1744-1747.

Zhao, Ning, Deng, Jianfeng, Zhong, Yi, Huang, Mingliang, and Ma, Haitao, "Interfacial reaction of Ni/Sn-9Zn/Ni solder joint undergoing liquid-solid thermomigration," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 273-276.

Zhao, Ning, Ma, Hai-tao, and Wang, Lai, "Interfacial Reactions between Sn-Cu Based Multicomponent Solders and Ni Substrates during Soldering and Aging," International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.

Zhao, Ning, Ma, Hai-tao, and Wang, Lai, "Interfacial reactions between Sn-Cu based multicomponent solders and Ni substrates during soldering and aging," Soldering & Surface Mount Technology, vol. 21 no. 2, pp. 19-23, 2009.

Zhao, Ning, Zhong, Yi, Huang, Mingliang, and Ma, Haitao, "Interfacial reactions in Cu/Sn/Cu(Ni) systems during soldering under temperature gradient," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 1263-1266.

Zhao, Ning, Wang, Jianhui, Ma, Haitao, and Wang, Lai, "Interfacial Reactions in Sn-xZn-Cu/Cu Couples during Soldering," Key Engineering Materials, vol. 373-374, pp. 543-546, 2008.

Zhao, Ning, and Pan, Xuemin, "Liquid structure of Sn-Ag-xCu solders and its effect on the formation and growth of interfacial Cu6Sn5," Journal of Materials Science, vol. 55 no. 27, pp. 13294-13302, Sept. 2020.

Zhao, Ning, Pan, Xuemin, Ma, Haitao, and Wang, Lai, "Study of the Liquid Structure of Sn-Cu Solders," Acta Metallurgica Sinica, vol. 44 no. 4, pp. 467-472, Apr. 2008.

Zhao, Ning, Wang, Mingyao, Zhong, Yi, Ma, Haitao, Wang, Yunpeng, and Wong, Ching-Ping, "Study on interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints under temperature gradient," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1478-1482.

Zhao, Ning, Zhong, Yi, Huang, Mingliang, Ma, Haitao, and Dong, Wei, "Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under temperature gradient," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 264-267.

Zhao, Ning, Pan, Xuemin, Ma, Haitao, Dong, Chuang, Guo, Shuhong, Lu, Wen, and Wang, Lai, "The liquid structure of Sn-based lead-free solders and the correlative effect in liquid-solid interfacial reaction," Journal of Physics Conference Series, vol. 98, pp. 012029-1-012029-4, 2008.

Zhao, Ning, Ma, Haitao, Xie, Haiping, and Wang, Lai, "Wetting Behavior and Interfacial Reactions in (Sn-9Zn)-2Cu/Ni Joints during Soldering and Isothermal Aging," Journal of Materials Science and Technology, vol. 25 no. 3, pp. 410-414, June 2009.

Zhao, Ping, Pecht, Michael G., Kang, Sungil, and Park, Sechul, "Assessment of Ni/Pd/Au-Pd and Ni/Pd/Au-Ag Preplated Leadframe Packages Subject to Electrochemical Migration and Mixed Flowing Gas Tests," IEEE Transactions on Components and Packaging Technologies, vol. 29 no. 4, pp. 818-826, Dec. 2006.

Zhao, Qinghua, Hu, Anmin, Li, Ming, and Sun, Jiangyan, "Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn-3.5Ag solder bumps," Microelectronics Reliability, vol. 53 no. 2, pp. 321-326, Feb. 2013.

Zhao, Qinghua, Bi, Jinglin, Hu, Anmin, Li, Ming, and Mao, Dali, "Effect of reflow time on shear property of two-step electroplated Sn-3.5Ag solder bumps," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1226-1229.

Zhao, Qinghua, Chen, Zhuo, Hu, Anmin, and Li, Ming, "Formation of SnAg solder bump by multilayer electroplating," Microelectronic Engineering, vol. 106, pp. 33-37, June 2013.

Zhao, Ran, Ma, Limin, Zuo, Yong, Liu, Sihan, and Guo, Fu, "Retarding Electromigration in Lead-Free Solder Joints by Alloying and Composite Approaches." Journal of Electronic Materials, vol. 42 no. 2, pp. 280-287, Feb. 2013.

Zhao, Renzhe, Ji, Qing, Carson, George, Todd, Michael, and Shi, Gary, "Flux and Underfill Compatibility in a Lead-free Environment," Advanced Packaging, vol. 16 no. 6, pp. 33-34, Aug./Sept. 2007.

Zhao, Renzhe, Ji, Qing, Huang, Qiaohong, Carson, George, and Todd, Michael, "Lead Free Application of Flip Chip Underfills," SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 519-524.

Zhao, Sheng-jun, Huang, Chun-yue, Tang, Xiang-qiong, and Liang, Ying, "Analysis of residual stress after reflow soldering of QFN package," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Zhao, Shufeng, and Pang, Xingshou, "Investigation of delamination control in plastic package," Microelectronics Reliability, vol. 49 no. 3, pp. 350-356, Mar. 2009.

Zhao, Tian-Zhang, Song, Hong-Wu, and Zhang, Shi-Hong, "Non-monotonic radial distribution of tensile yielding strength in cold-drawn pearlitic wire," Materials Science and Technology, vol. 34 no. 1, pp. 35-41, Jan. 2018.

Zhao, Wen-Bo, Zhu, Jun-Jie, and Chen, Hong-Yuan, "Photochemical synthesis of Au and Ag nanowires on a porous aluminum oxide template," Journal of Crystal Growth, vol. 258 no. 1-2, pp. 176-180, Oct. 2003.

Zhao, X. J., Caers, J. F. J. M., de Vries, J. W. C., Wong, E. H., and Rajoo, R., "A Component Level Test Method for Evaluating the Resistance of Pb-free BGA Solder Joints to Brittle Fracture under Shock Impact," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1522-1529.

Zhao, X. J., and Caers, J. F. J. M., "Evaluation of Soldering and Reliability Performance of NiPdAu Finished PPF with Pb-Free Solder Alloy 95.5Sn4.0Ag0.5Cu," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1442-1448.

Zhao, X. J., and Caers, J. F. J. M., "Feasibility Study on Board Assembly of TSSOP Components with NiPdAu PPF Finish," Proceedings of 7th Electronic Packaging Technology Conference, Volume 2, Singapore, Dec. 7-9, 2005, pp. 749-755.

Zhao, X. J., Caers, J. F. J. M., Wong, E. H., Seah, S. K. W., v. Driel, W. D., Owen, N., and Lai, Yi-Shao, "Frequency Dependent S-N Curves for Predicting Drop Impact Robustness of Pb-free Solder Interconnects," 59th Electronic Components & Technology Conference, San Diego, CA, May 26-29, 2009, pp. 93-99.

Zhao, X. J., Caers, J. F. J. M., de Vries, J. W. C., Kloosterman, J., Wong, E. H., and Rajoo, R., "Improvement of Mechanical Impact Resistance of BGA Packages with Pb-free Solder Bumps," 8th Electronics Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp. 174-178.

Zhao, X. J., De Vries, H., Engelen, R., Watte, P., and van Hees, G., "Solder interconnect degradation with irregular joint shape," 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Hanover, Germany, March 24-27, 2019, pp. xx-xx.

Zhao, X., Saka, M., Yamashita, M., and Hokazono, H., "The effect of adding Ni and Ge microelements on the electromigration resistance of low-Ag based SnAgCu solder," Microsystem Technologies , vol. xx no. x, pp. xx-xx, xxxx.

Zhao, X. J., and Caers, J. F. J. M., "To simulate the formation of TSSOP solder joint with SAC solder and assess on the effects of the stencil design and the misalignment on the joint shape," 2004 6th International Conference on Electronic Packaging Technology , Singapore, Dec. 8-10, 2004, pp. 313-317.

Zhao, Xiao-yan, Zhao, Mai-qun, Cui, Xiao-qing, Xu, Tian-han, and Tong, Ming-xin, "Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys," Transactions of Nonferrous Metals Society of China, vol. 17 no. 4, pp. 805-810, Aug. 2007.

Zhao, Xin, Tian, Yanhong, and Wang, Ning, "Shearing properties of Low Temperature Cu-In Solid-Liquid Interdiffusion in 3D Package," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 143-147.

Zhao, Xing-Fei, Zhou, Min-Bo, Sun, Tao, and Zhang, Xin-Ping, "Size effect on the interfacial reaction and IMC growth of Sn-3.0Ag-0.5Cu/Cu joints with the decreasing joint size to several tens of microns during reflowing soldering," 2018 19th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 8-11, 2018, pp. 562-565.

Zhao, Xingke, Xie, Feiming, Fan, Jinsheng, Liu, Dayong, Huang, Jihua, and Chen, Shuhai, "Evaluation on Dorsey Method in Surface Tension Measurement of Solder Liquids Containing Surfactants," International Journal of Thermophysics, vol. 39 no. 6, article 76, June 2018.

Zhao, Xiuchen, Wen, Yanni, Li, Yi, Liu, Ying, and Wang, Yong, "Effect of g-Fe2O3 nanoparticles size on the properties of Sn-1.0Ag-0.5Cu nano-composite solders and joints," Journal of Alloys and Compounds , vol. 662, pp. 272-282, Mar. 25, 2016.

Zhao, Xu, Saka, Masumi, Muraoka, Mikio, Yamashita, Mitsuo, and Hokazono, Hiroaki, "Electromigration Behaviors and Effects of Addition Elements on the Formation of a Bi-rich Layer in Sn58Bi-Based Solders," Journal of Electronic Materials, vol. 43 no. 11, pp. 4179-4185, Nov. 2014.

Zhao, Xu, Takaya, Satoshi, and Muraoka, Mikio, "Electromigration Critical Product to Measure Effect of Underfill Material in Suppressing Bi Segregation in Sn-58Bi Solder," Journal of Electronic Materials, vol. 46 no. 8, pp. 4999-5006, Aug. 2017.

Zhao, Xu, Saka, Masumi, Muraoka, Mikio, Yamashita, Mitsuo, and Hokazono, Hiroaki, "Investigating Testing Conditions for Electromigration Evaluation and Effect of Additive Elements on Electromigration Resistance of Sn58bi Solder," International Conference on Soldering & Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp. xx-xx.

Zhao, Xu, Muraoka, Mikio, and Saka, Masumi, "Length-Dependent Electromigration Behavior of Sn58Bi Solder and Critical Length of Electromigration," Journal of Electronic Materials, vol. 46 no. 2, pp. 1287-1292, Feb. 2017.

Zhao, Yonggang, Tan, Yuanbiao, Ji, Xuanming, He, Yue, Liang, Yu, and Xiang, Song, "Effect of Microstructure and Microtexture on the Mechanical Properties of Small-Strain Cold-Drawn Pearlite Steel Wires," JOM, vol. 71 no. 11, pp. 4041-4049, Nov. 2019.

Zhao, Zhangjian, Yang, Shan, Hu, Anmin, and Li, Ming, "Influence of solder layer thickness on the interfacial reaction in Ni/Sn/Cu system," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 447-449.

Zhao, Zhangjian, Shang, Jing, Hu, Anmin, and Li, Ming, "The effects of Sn solder grain size on the morphology and evolution of Cu6Sn5 in the aging process," Materials Letters, vol. 185, pp. 92-95, Dec. 15, 2016.

Zhao, Zhenqing, Wang, Chunqing, Li, Mingyu, and Wang, Lei, "Nd:YAG laser surface treatment of copper to improve the wettability of Sn3.5Ag solder on copper," Surface and Coatings Technology, vol. 200 no. 7, pp. 2181-2186, Dec. 21, 2005.

Zhao, Zhenqing, Wang, Lei, Xie, Xiaoqiang, Wang, Qian, and Lee, Jaisung, "The Influence of Low Level Doping of Ni on the Microstructure and Reliability of SAC Solder Joint," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Zhao, Zhenqing, Wang, Lei, Xie, Xiaoqiang, Wang, Qian, and Lee, Taekoo, "The Influences of Solder Composition and Pad Finish on the Reliability of Fine Pitch BGA Solder Joints," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Zhao, Zhenyu, Liu, Lei, Choi, Hyun Seok, Cai, Jian, Wang, Qian, Wang, Yuming, and Zou, Guisheng, "Effect of nano-Al2O3 reinforcement on the microstructure and reliability of Sn-3.0Ag-0.5Cu solder joints," Microelectronics Reliability, vol. 60, pp. 126-134, May 2016.

Zhao, Zhenyu, Chen, Chuan, Park, Chang Yong, Wang, Yuming, Liu, Lei, Zou, Guisheng, Cai, Jian, and Wang, Qian, "Effects of Package Warpage on Head-in-Pillow Defect," Materials Transactions, JIM, vol. 56 no. 7, pp. 1037-1042, 2015.

ZhaoHua, Wu, DeJian, Zhou, and ChunYue, Huang, "Study on No-Fillet SMT Solder Joint Reliability Based on Solder Joint Shape CAD," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Zhaohua, Wu, and Dejian, Zhou, "Study on Thermal Simulation Technology for SMA in Lead-free Reflow Soldering," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Zhen-mi, Tu, Jing-shuang, Zhang, Wennliang, Li, Zhe-long, Yang, and Maozhong, An, "The Electrodeposition of Zn-Co Alloy from a Zincate Bath," Transactions of the Institute of Metal Finishing, vol. 73 no. 2, pp. 48-49, May 1995.

Zhendong, Zhao, Zhigang, Li, Yu, Zhang, and Xuefeng, Shu, "Moisture Absorption and Void Growing Effects on Failure of Electronic Packaging," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Zheng, Boda, and Zhu, Qingsheng, "Uniform, highly conductive and flexible silver nanowire transparent conductive films," 2020 21st International Conference on Electronic Packaging Technology, Guangzhou, China, Aug. 12-15, 2020, pp. xx-xx.

Zheng, H. M., Yuan, Z. S., and Wang, Y. J., "Research Survey on Synthesis Methods of Silicon Nanowires," Advanced Materials Research, vol. 233-235, pp. 2098-2104, 2011.

Zheng, Kun, Shao, Ruiwen, Deng, Qingsong, Zhang, Yuefei, Li, Yujie, Han, Xiaodong, Zhang, Ze, and Zou, Jin, "Observation of enhanced carrier transport properties of Si <100>-oriented whiskers under uniaxial strains," Applied Physics Letters, vol. 104, pp. 013111-1-013111-5, 2014.

Zheng, Lu, and Gao, Naiyun, "Generation, Environmental Impact and Treatment of Waste Electrical and Electronic Equipment," International Conference on Management and Service Science, Beijing, China, Sept. 20-22, 2009, pp. xx-xx.

Zheng, T. J., "China's Green Quandary," Green SupplyLine, May 1, 2005.

Zheng, T. J., "China's Green Quandary," Electronics Supply & Manufacturing , May 2005.

Zheng, Xiaoling, Zhang, Lulu, You, Min, Wu, Jianhao, Yu, Haizhou, Yang, Derong, and Mao, Yuping, "Effect of Curing Procedure on the Properties of Copper-Powder-Filled Conductive Adhesives," Journal of Wuhan University of Technology-- Materials Science, vol. 23 no. 3, pp. 323-325, June 2008.

Zheng, Xu, Ran, Hongfeng, Wang, Lei, Kou, Hao, Ning, Yexiang, Wang, Bei, Lin, Xian, and Liu, Zuyao, "Effect of PCB Surface Finishes on Lead-Free Solder Joint Reliability," SMTA International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 101-111.

Zheng, Xu, Ran, Hongfeng, Wang, Lei, Kou, Hao, Ning, Yexiang, Wang, Bei, Lin, Xian, and Liu, Zuyao, "Effect of PCB Surface Finishes on Lead-Free Solder Joint Reliability," SMTA Journal, vol. 23 no. 4, pp. 13-23, 2010.

Zheng, Y., Hillman, C., and McCluskey, P., "Effect of PWB Plating on the Microstructure and Reliability of SnAgCu Solder Joints," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 313-319.

Zheng, Y., Hillman, C., and McCluskey, P., "Intermetallic Growth on PWBs Soldered with Sn3.8Ag0.7Cu," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1226-1231.

Zheng, Yanhong, Shen, Zhigang, Ma, Shulin, Cai, Chujiang, Zhao, Xiaohu, and Xing, Yushan, "A novel approach to recycling of glass fibers from nonmetal materials of waste printed circuit boards," Journal of Hazardous Materials, vol. 170 no. 2-3, pp. 978-982, Oct. 2009.

Zheng, Yanhong, Shen, Zhigang, Cai, Chujiang, Ma, Shulin, and Xing, Yushan, "The reuse of nonmetals recycled from waste printed circuit boards as reinforcing fillers in the polypropylene composites," Journal of Hazardous Materials, vol. 163 no. 2-3, pp. 600-606, Apr. 30, 2009.

Zheng, Yun, Rivas, Cristian, Lake, Roger, Alam, Khairul, Boykin, Timothy B., and Klimeck, Gerhard, "Electronic Properties of Silicon Nanowires," IEEE Transactions on Electron Devices, vol. 52 no. 6, pp. 1097-1103, June 2005.

Zheng, Zhen, Qiao, Zhen, Zhou, Wei, and Wang, Chunqing, "Study on the Pre-Tinned Effect in the Electroless Tin Plating Process," 2017 18th International Conference on Electronic Packaging Technology , Harbin, China, Aug. 16-19, 2017, pp. 1568-1571.

Zheng, Zhen, Yang, Fan, Yang, Ludong, and Wang, Chunqing, "The Fabrication of the Cu/Ni/Cu surface multilayer nano-array and the interconnection with the SAC305 solder," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1623-1625.

Zheng, Zhuoqun, Li, Eric, Ding, Nan, and Xu, Xu, "Beat phenomenon in metal nanowires: A molecular dynamics study," Computational Materials Science, vol. 138, pp. 117-127, Oct. 2017.

Zhi, Jian-Zhuang, Yu, Gui-Bo, Cao, Li-Jun, Chen, Zhi-Ling, and Bai, Wen-Ya, "Dynamic Mechanical Properties and Parameters of Constitutive Model for Lead-Free Solder," 2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, Emeishan, Sichuan, China, July 15-18, 2013, pp. 1193-1195.

Zhi, Jiang, Su, Ding, Yanhong, Tian, and Chunqing, Wang, "Synthesis of Sn-3.5Ag nanoparticles of tiny sizes," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1499-1501.

Zhihong, Lei, Ying, He, and Licong, Gao, "Electrical conduction and reliability of anisotropic conductive adhesives filled with Ag/Cu-coated epoxy composite particles," 8th International Conference on Solid-State and Integrated Circuit Technology , Shanghai, China, Oct. 23-26, 2006, pp. 1034-1036.

Zhirnov, V. V., Bormatova, L., Givargizov, E. I., Plekhanov, P. S., Son, U. T., Galdetsky, A. V., and Belyavsky, B. A., "Field emission properties of Au-Si eutectic," Applied Surface Science , vol. 94-95, pp. 144-147, Mar. 2, 1996.

Zhiting, Geng, Heqing, Cheng, Guohai, and Ma, Jusheng, "Analysis of new lead-free solder alloy microstructure," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 469-471.

Zhiting, Geng, Heqing, Guohai, Cheng, and Jusheng, Ma, "The Stress-Strain Behaviors of Solder Joints During Thermal Fatigue Process," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 764-767.

Zhong, Jianhua, Li, Zhihong, and Ou-Yang, Lingyu, "Study on the Mechanical Property of Cu-Filled Isotropically Conductive Adhesive/SiO2 Composites," Advanced Materials Research, vol. 239-242, pp. 1068-1071, 2011.

Zhong, H. W., Gu, X., Chan, Y. C., and Wu, B. Y., "Evaluation of the Potential Toxicity of Metals in Discarded Electronics: A Case Study of Mobile Phones in P. R. China," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Zhong, W. H., Chan, Y. C., Alam, M. O., Wu, B. Y., and Guan, J. F., "Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints," Journal of Alloys and Compounds, vol. 414, no. 1-2, pp. 123-130, Apr. 13, 2006.

Zhong, W. H., Chan, Y. C., Wu, B. Y., Alam, M. O., and Guan, J. F., "Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization," Journal of Materials Science, vol. 42 no. 13, pp. 5239-5247, July 2007.

Zhong, Weixu, Qin, Fei, An, Tong, and Wang, Tao, "Mechanical Properties of Intermetallic Compounds in Solder Joints," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 520-524.

Zhong, Weixu, Qin, Fei, An, Tong, and Liu, Chengyan, "Morphology and Nanoindentation Properties of Intermetallic Compounds in Solder Joints," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 523-528.

Zhong, X. L., and Gupta, M., "Development of lead-free Sn-0.7Cu/Al2O3 nanocomposite solders with superior strength," Journal of Physics D: Applied Physics, vol. 41 no. 9, pp. 095403, May 7, 2008.

Zhong, X. L., and Gupta, M., "Effect of Type of Reinforcement at Nanolength Scale on the Tensile Properties of Sn-0.7Cu Solder Alloy," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 669-674.

Zhong, Xiankang, Lu, Wenjun, Liao, Bokai, Medgyes, Balint, Hu, Junying, Zheng, Yan, Zeng, Dezhi, and Zhang, Zhi, "Evidence for Ag participating the electrochemical migration of 96.5Sn-3Ag-0.5Cu alloy," Corrosion Science, vol. 156, pp. 10-15, Aug. 1, 2019.

Zhong, Y., Zhao, N., Ma, H. T., Dong, W., and Huang, M. L., "Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition," Journal of Alloys and Compounds, vol. 695, pp. 1436-1443, Feb. 25, 2017.

Zhong, Yi, Zhao, Ning, Dong, Wei, Ma, Haitao, Wang, Yunpeng, and Wong, Ching-Ping, "Formation of preferred orientation of Cu6Sn5 grains in Cu/Sn/Cu interconnects by soldering under temperature gradient," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1438-1441.

Zhong, Yi, Zhao, Ning, Dong, Wei, Wang, Yunpeng, and Ma, Haitao, "Growth mechanism of Cu3Sn grains in the (111) Cu/Sn/Cu micro interconnects," 2018 19th International Conference on Electronic Packaging Technology , Shanghai, China, Aug. 8-11, 2018, pp. 1748-1750.

Zhong, Yi, Huang, Mingliang, Ma, Haitao, Dong, Wei, Wang, Yunpeng, and Zhao, Ning, "In situ study on Cu-Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient," Journal of Materials Research, vol. 31 no. 5, pp. 609-617, Mar. 14, 2016.

Zhong, Yi, Huang, Mingliang, Ma, Haitao, and Zhao, Ning, "Synchrotron radiation in situ study on liquid-solid thermomigration in Cu/Sn/Ni solder joint," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 1271-1274.

Zhong, Ying, Zhang, Wei, Wang, Chunqing, Wang, Chunyu, and Li, Bin, "Preparation and Microstructure of Functionally Gradient Diamond/SAC Composite Solder Bumps," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 178-182.

Zhong, Ying, Wang, Chun Qing, Caers, J. F. J. M., and Zhao, Xiujuan, "The Evolution of IMCs' Morphologies and Types in SAC and SAC+ Solder Bumps during Thermal Shock Process," 2012 14th International Conference on Electronic Materials and Packaging, Hong Kong, Dec. 13-16, 2012, pp. xx-xx.

Zhong, Ying, Wang, Chunqing, Zhao, Xiujuan, and Caers, J. F. J. M., "The Influence of High Melting Point Elements on the Reliability of Solder during Thermal Shocks," 2015 IEEE 65th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2015, pp. 2162-2167.

Zhong, Ying, Liu, Wei, Wang, Chunqing, Zhao, Xiujuan, and Caers, J. F. J. M., "The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling," Materials Science and Engineering: A, vol. 652, pp. 264-270, Jan. 15, 2016.

Zhong, Z. W., Chan, K. C., and Chen, Y. H., "Characterisation of Electroplated Eutectic Sn-Ag Solder," International Journal of Computational Engineering Science, vol. 4 no. 3, pp. 733-736, Sept. 2003.

Zhong, Z. W., Arulvanan, P., Maw, Hla Phone, and Lu,, C. W. A., "Characterization of SnAgCu and SnPb solder joints on low-temperature co-fired ceramic substrate," Soldering & Surface Mount Technology , vol. 19 no. 4, pp. 18-24, 2007.

Zhong, Z. W., Arulvanan, P., and Shi, X. Q., "Lead-free PCB assembly and effects of process conditions on the profile and reliability of solder joints," Soldering & Surface Mount Technology , vol. 17 no. 4, pp. 33-37, 2005.

Zhong, Z. W., Tee, T. Y., and Luan, J-E., "Recent advances in wire bonding, flip chip and lead-free solder for advanced microelectronics packaging," Microelectronics International, vol. 24 no. 3, pp. 18-26, 2007.

Zhong, Z. W., "Various Adhesives for Flip Chips," Journal of Electronic Packaging, Transactions of the ASME, vol. 127 no. 1, pp. 29-32, Mar. 2005.

Zhong, Zhaowei, "Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill," Microelectronics International, vol. 16 no. 3, pp. 6-14, 1999.

Zhong, Zhaowei, "Assembly issues in three flip chip processes," Microelectronics International, vol. 17 no. 2, pp. 15-18, 2000.

Zhong, Zhaowei, "Development of a reliable packaging process for flip chip on ceramics," Microelectronics International, vol. 18 no. 1, pp. 19-22, 2001.

Zhong, Zhaowei, "Flip chip assemblies using gold bumps and adhesive," Microelectronics International, vol. 18 no. 3, pp. 15-19, Sept. 2001.

Zhong, Zhaowei, and Wong, Stephen, "Flip Chip On Board Mounting Processes Using Anisotropic Conductive Adhesives And Eutectic Solder," Proceedings of 2nd Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 1998, pp. 76-82.

Zhong, Zhaowei, and Goh, Kay Soon, "Flip Chip on FR-4, Ceramics and Flex," Journal of Electronics Manufacturing, vol. 10 no. 2, pp. 89-96, June 2000.

Zhonghua, Wan, Yabing, Zou, Guanghui, He, and Daojun, Luo, "A Study on Solder-joints Fall-off Failure of Electroless Nickel/Immersion Gold Pad," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 814-817.

Zhonghua, Wan, and Hui, Xiao, "Study on Short-circuit Failure of Solder-joint Interconnections," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 727-729.

Zhou, Bin, and Qiu, Baojun, "Effect of Voids on the Thermal Fatigue Reliability of PBGA Solder Joints through Submodel Technology," 2008 10th Electronics Packaging Technology Conference, Singapore, Dec. 9-12, 2008, pp. 704-708.

Zhou, Bin, Qiu, Baojun, and En, Yunfei, "Vibration Durability Modeling and Dynamic Response Analysis of PBGA Mixed Solder Joints," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 616-619.

Zhou, Bite, Bieler, Thomas R., Lee, Tae-Kyu, and Liu, Wenjun, "Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD." Journal of Electronic Materials, vol. 42 no. 2, pp. 319-331, Feb. 2013.

Zhou, Bite, Bieler, Thomas R., Lee, Tae-kyu, and Liu, Kuo-Chuan, "Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface," Journal of Electronic Materials, vol. 39 no. 12, pp. 2669-2679, Dec. 2010.

Zhou, Bite, Bieler, Thomas R., Wu, Guilin, Zaefferer, Stefan, Lee, Tae-kyu, and Liu, Kuo-chuan, "In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders," Journal of Electronic Materials , vol. 41 no. 2, pp. 262-272, Feb. 2012.

Zhou, Bite, Bieler, Thomas R., Lee, Tae-Kyu, and Liu, Kuo-Chuan, "Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear," Journal of Electronic Materials, vol. 38 no. 12, pp. 2702-2711, Dec. 2009.

Zhou, Bite, Muralidharan, Govindarajan, Kurumadalli, Kanth, Parish, Chad M., Leslie, Scott, and Bieler, Thomas R., "Microstructure and Sn Crystal Orientation Evolution in Sn-3.5Ag Lead-Free Solders in High-Temperature Packaging Applications," Journal of Electronic Materials, vol. 43 no. 1, pp. 57-68, Jan. 2014.

Zhou, Bite, Zhou, Quan, Bieler, Thomas R., and Lee, Tae-kyu, "Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages," Journal of Electronic Materials, vol. xx no. x, pp. xx-xx, xxxx.

Zhou, Chuanhong, Liu, Zhixue, and Gao, Liang, "Declaration of RoHS Compliance based on Smart Document and XML Database ," 9th International Conference on Electronic Measurement & Instruments, Beijing, China, Aug. 16-19, 2009, pp. 4-1063-4-1068.

Zhou, Fang, Zhao, Yujing, Zhou, Weichang, and Tang, Dongsheng, "Temperature dependent Raman of BiTe nanotubes," AIP Advances, vol. 8 no. 12, pp. 125330-1-125330-9, Dec. 2018.

Zhou, Fengying, Chen, Fen, and Lee, Ning-Cheng, "Fluxes Design for Suppressing Non-Wet-Opens at BGA Assembly," Proceedings of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 211-217.

Zhou, G. J., Li, D. J., Cai, An. H., Zhou, Y., and Luo, Y., "Phase Evolution When Sn Reacts with Cu-Ti Compounds at 823 K," Journal of Electronic Materials, vol. 45 no. 11, pp. 5996-6004, Nov. 2016.

Zhou, Guangjun, Lu, Mengkai, Yang, Zhongsen, Zhang, Haiping, Zhou, Yuanyuan, Wang, Shumei, Wang, Shufen, and Zhang, Aiyu, "Surfactant-assisted synthesis and characterization of silver nanorods and nanowires by an aqueous solution approach," Journal of Crystal Growth , vol. 289 no. 1, pp. 255-259, Mar. 15, 2006.

Zhou, Guangwen, Zhang, Ze, and Yu, Dapeng, "Growth morphology and micro-structural aspects of Si nanowires synthesized by laser ablation," Journal of Crystal Growth, vol. 197 no. 1-2, pp. 129-135, Feb. 1, 1999.

Zhou, Haifei, Guo, Jingdong, Zhu, Qingsheng, and Shang, Jianku, "Application of Electroless FeL42Ni(P) Film for Under-bump Metallization on Solder Joint," Journal of Materials Science and Technology, vol. 29 no. 1, pp. 7-12, Jan. 2013.

Zhou, Haifei, Guo, Jingdong, Shang, Jianku, and Song, Xiaoning, "Highly solderability of FeP film in contact with SnAgCu solder," Journal of Alloys and Compounds, vol. 818, pp. 152900-1-152900-6, Mar. 25, 2020.

Zhou, Haifei, Guo, Jingdong, and Shang, Jian Ku, "Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys," Journal of Electronic Materials, vol. 41 no. 11, pp. 3161-3168, Nov. 2012.

Zhou, Henley, Lin, Ivan, Ling, Xin, Huang, Jumbo, Camacho, Arnel, Aranda, Ranilo, Guo, Jinsuo, VRajoo, RSivam, and Doiron, Mike, "The Study of Cure Percentage Determination for Anisotropic Conductive Film by Ftir Method," SMTA China South 2017 Proceedings, Shenzhen, China, Aug. 28-31, 2017, pp. xx-xx.

Zhou, Henley, Uy, William, and Huang, Jumbo, "Two Different Ways of Resolving BGA Head-In-Pillow Defects," South East Asia Technical Training Conference on Electronics Assembly Technologies 2012 Proceedings, Penang, Malaysia, Apr. 18-20, 2012, pp. xx-xx.

Zhou, Jia-cheng, Liu, Fang, and Nu, Yan, "Study the Effect of the Temperature on the PCB Assembly and Solder Joints in the Vehicle," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 25-29.

Zhou, Jian, Huang, Dan, Fang, Yi-Li, and Xue, Feng, "Investigation on properties of Sn-8Zn-3Bi lead-free solder by Nd addition," Journal of Alloys and Compounds, vol. 480 no. 2, pp. 903-907, July 8, 2009.

Zhou, Jian, Li, Peipei, Xiao, Yingying, and Fu, Xiaoqing, "Microstructure and Deformability of Sn-Zn-Bi Alloys," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Zhou, Jian, Sun, Yangshan, and Xue, Feng, "Properties of low melting point Sn-Zn-Bi solders," Journal of Alloys and Compounds, vol. 397 no. 1-2, pp. 260-264, July 19, 2005.

Zhou, Jianguo, and Sancaktar, Erol, "Capillary Flows of Highly Filled Epoxy/Ni Suspensions for Conductive Adhesive Applications," Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, Volume 4, Las Vegas, NV, Sept.4-7, 2007, pp. 505-512.

Zhou, Jianguo, and Sancaktar, Erol. "Chemorheology of Epoxy/Nickel Conductive Adhesives During Processing and Cure," Journal of Adhesion Science and Technology, vol. 22 no. 8-9, pp. 957-981, 2008.

Zhou, Jianguo, and Sancaktar, Erol, "Epoxy/Nickel Conductive Adhesive Rheology During Processing and Cure," 2008 ASME International Mechanical Engineering Congress and Exposition, Volume 15, Boston, MA, Oct. 31-Nov. 6, 2008, pp. 37-43.

Zhou, Jianguo, and Sancaktar, Erol, "Geometric Effects on Multilayer Generic Circuits Fabricated Using Conductive Epoxy/Nickel Adhesives," Journal of Adhesion Science and Technology , vol. 22 no. 8-9, pp. 947-956, 2008.

Zhou, Jianguo, and Sancaktar, Erol, "Stable and Unstable Capillary Flows of Highly-Filled Epoxy/Nickel Suspensions," Journal of Adhesion Science and Technology, vol. 22 no. 8-9, pp. 983-1002, 2008.

Zhou, Jiming, Clawson, Robert, Wittmer, Phil, Snyder, Rick, and Badgett, Jerry, "Electrochemical Migration of Immersion Silver Finishes: Test Vehicle and Material Evaluation," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 351-356.

Zhou, Ke-Ya, Jee, Sang-Won, Guo, Zhong-Yi, Xiao, Yanjun, Moiz, S. A., Liu, Shu-tian, and Lee, Jung-Ho, "Plasmonics Induced Absorption Enhancement in Silicon Nanowires Coated with Metallic Nanoparticles," 2011 37th IEEE Photovoltaic Specialists Conference, Seattle, WA, June 19-24, 2011, pp. 2977-2981.

Zhou, L., Wang, N., Zhang, L., and Yao, W. J., "The effects of the minority phase on phase separation in Fe-Sn hypermonotectic alloy," Journal of Alloys and Compounds, vol. 555, pp. 88-94, Apr. 5, 2013.

Zhou, Lei, and Xu, Zhenming, "Response to Waste Electrical and Electronic Equipments in China: Legislation, recycling system, and advanced integrated process," Environmental Science & Technology, vol. 46 no. 9, pp. 4713-4724, May 1, 2012.

Zhou, M. B., Ma, X., and Zhang, X. P., "Early Interfacial Reaction and Formation of Intermetallic Compounds in the Sn-3.5Ag/Cu Soldering System," Journal of Electronic Materials, vol. 40 no. 2, pp. 189-194, Feb. 2011.

Zhou, M. B., Ma, X., and Zhang, X. P., "Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process," Journal of Materials Science: Materials in Electronics, vol. 23 no. 8, pp. 1543-1551, Aug. 2012.

Zhou, M. B., Ma, X., and Zhang, X. P., "Undercooling Behavior and Intermetallic Compound Coalescence in Microscale Sn-3.0Ag-0.5Cu Solder Balls and Sn-3.0Ag-0.5Cu/Cu Joints," Journal of Electronic Materials, vol. 41 no. 11, pp. 3169-3178, Nov. 2012.

Zhou, M. B., Zhao, X. F., Yue, W., and Zhang, X. P., "Unique interfacial reaction and so-induced change in mechanical performance of Sn-3.0Ag-0.5Cu/Cu solder joints formed during undercooled and eutectic liquid soldering processes," Journal of Materials Science: Materials in Electronics, vol. 30 no. 5, pp. 4770-4781, Mar. 2019.

Zhou, Min-Bo, Zeng, Jing-Bo, Ma, Xiao, and Zhang, Xin-Ping, "Dissolution Behavior of Cu UBM in BGA Structure Sn-3.0Ag-0.5Cu/Cu Joints during Liquid Isothermal Aging at and above the Solder's Melting Temperature," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 872-876.

Zhou, Min-Bo, Zhou, Li-Bing, Zhang, Lang, Qiu, Fu-Shun, Ma, Xiao, and Zhang, Xin-Ping, "Influence of metal-oxide/salt content in the aluminum soldering flux on solderability and corrosion resistance of Sn-0.7Cu/6061Al joints," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 323-327.

Zhou, Min-Bo, Feng, Jian-Qiang, Yue, Wu, and Zhang, Xin-Ping, "Interfacial reaction and IMC growth between the undercooled liquid lead-free solder and Cu metallization," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 1023-1027.

Zhou, Min-Bo, Qin, Hong-Bo, Ma, Xiao, and Zhang, Xin-Ping, "Interfacial Reaction and Melting/solidification Characteristics Between Sn and Different Metallizations of Cu, Ag, Ni and Co," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 202-207.

Zhou, Min-Bo, Jin, Hong, Ke, Chang-Bo, and Zhang, Xin-Ping, "Quasi in-situ study of morphological evolution of the interfacial IMC in single-sided interface Sn-0.3Ag-0.7Cu/Cu joints during multiple reflow process," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 333-337.

Zhou, Min-Bo, Zhang, Han-Qian, Zhang, Xin-Ping, and Yue, Wu, "Shear strength and fracture behavior of locally-melted hybrid Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu joints under different loading rates," 2019 20th International Conference on Electronic Packaging Technology, Hong Kong, China, Aug. 12-15, 2019, pp. xx-xx.

Zhou, Min-Bo, Zhao, Xing-Fei, Yue, Wu, Ke, Chang-Bo, and Zhang, Xin-Ping, "Size and boundary effects on the growth and morphology evolution of interfacial intermetallic compound of Sn0.3Ag0.7Cu/Cu micro-bump joints," 2017 18th International Conference on Electronic Packaging Technology , Harbin, China, Aug. 16-19, 2017, pp. 1667-1671.

Zhou, Minbo, Ma, Xiao, and Zhang, Xin-Ping, "Undercooling Behavior and Solidification Microstructure Evolution of Sn-Cu-Ni Solders Modified by Minute Amount of Mixed Rare Earth La-Ce," Materials Science Forum, vol. 654-656, pp. 1373-1376, 2010.

Zhou, Peng, Kang, Huijun, Cao, Fei, Fu, Yanan, Xiao, Tiqiao, and Wang, Tongmin, "In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn-Cu solder alloys," Journal of Materials Science: Materials in Electronics, vol. 25 no. 10, pp. 4538-4546, Oct. 2014.

Zhou, Peng, Jiang, Ting-biao, Yang, Dao-guo, You, Zhi, Ma, Ya-hui, and Ren, Rong-bin, "The Effect of Interface Reaction with Different Finishes and SnAgCu on the Reliability of Solder Joints," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 998-1002.

Zhou, Ping, Hu, Bing-ting, Zhou, Jie-min, and Yang, Ying, "Parameter fitting of constitutive model and FEM analysis of solder joint thermal cycle reliability for lead-free solder Sn-3.5Ag," Journal of Central South University of Technology, vol. 16 no. 3, pp. 339-343, June 2009.

Zhou, Q., Zhou, Y., Qin, X., Wang, X. J., and Huang, M. L., "Different diffusion behavior of Cu, Ni and Zn atoms in Cu/Sn-9Zn/Ni interconnects during Liquid-Solid electromigration," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 1146-1168.

Zhou, Q., Li, Q., Zhou, Y., Wang, X. J., and Huang, M. L., "Effect of Electromigration on Interfacial Reaction in Cu/Sn-9Zn/Cu and Cu/Sn-9Zn/Ni Interconnects," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 473-476.

Zhou, Qiang, Huang, Mingliang, Zhao, Ning, and Zhang, Zhijie, "Effects of Cooling Rate and Solder Volume on the Formation of Large Ag3Sn Plates in Sn-Ag Based Solder Joints," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 1403-1406.

Zhou, Quan, Zhou, Bite, Lee, Tae-Kyu, and Bieler, Thomas, "Microstructural Evolution of SAC305 Solder Joints in a Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling," Journal of Electronic Materials, vol. 45 no. 6, pp. 3013-3024, June 2016.

Zhou, Shaoming, Huang, Mingliang, Chen, Leida, Ye, Song, Ye, Yuming, Wang, Jifan, and Cao, Xi, "Electromigration-induced failure of Ni/Sn3.0Ag0.5Cu/ENEPIG flip chip solder joint," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 321-326.

Zhou, Shaoming, Huang, Mingliang, and Chen, Leida, "Electromigration-induced Interfacial Reactions in Line-type Cu/Sn/ENIG Interconnect," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 467-471.

Zhou, Shiqi, Shen, Yu-An, Nishikawa, Hiroshi, Uresti, Tiffani, Shunmugasamy, Vasanth C., and Mansoor, Bilal, "Effects of In and Zn Double Addition on Eutectic Sn-58Bi Alloy," 2019 IEEE 69th Electronic Components and Technology Conference, Las Vegas, NV, May 28-31, 2019, pp. 1081-1086.

Zhou, Shiqi, Shen, Yu-An, Uresti, Tiffani, Shunmugasamy, Vasanth C., Mansoor, Bilal, and Nishikawa, Hiroshi, "Improved mechanical properties induced by In and In & Zn double additions to eutectic Sn58Bi alloy," Journal of Materials Science: Materials in Electronics, vol. 30 no. 8, pp. 7423-7434, Apr. 2019.

Zhou, Shiqi, Mokhtari, Omid, Rafique, Muhammad Ghufran, Shunmugasamy, Vasanth C., Mansoor, Bilal, and Nishikawa, Hiroshi, "Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging," Journal of Alloys and Compounds, vol. 765, pp. 1243-1252, Oct. 15, 2018.

Zhou, Shiqi, Mokhtari, Omid, and Nishikawa, Hiroshi, "Improvement of mechanical properties of Zn-added Sn58Bi alloy by Zn segregation on the Sn-Bi phase boundaries during thermal aging," 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp. 1899-1905.

Zhou, Shiqi, Liu, Xiangdong, Mokhtari, Omid, and Nishikawa, Hiroshi, "The evaluation of mechanical properties of Sn58BiXTi solder by tensile test," 2017 18th International Conference on Electronic Packaging Technology , Harbin, China, Aug. 16-19, 2017, pp. 703-707.

Zhou, Shiqi, Yang, Chih-han, Shen, Yu-An, Lin, Shih-kang, and Nishikawa, Hiroshi, "The study of Sn-45Bi-2.6Zn alloy before and after thermal aging," 2019 International Conference on Electronics Packaging, Niigata, Japan, Apr. 17-20, 2019, pp. 333-336.

Zhou, Wei, Liu, Lijuan, Li, Baoling, and Wu, Ping, "Effect of Intermetallic on Electromigration and Atomic Diffusion in Cu/SnAg3.0Cu0.5/Cu Joints: Experimental and First-Principles Study," Journal of Electronic Materials, vol. 38 no. 6, pp. 866-872, June 2009.

Zhou, Wei, Liu, Lijuan, Li, Baoling, and Wu, Ping, "Fast mass migration in SnBi deposits enhanced by electric current," Thin Solid Films, vol. 518 no. 20, pp. 5875-5880, Aug. 2, 2010.

Zhou, Wei, Liu, Lijuan, and Wu, Ping, "Structural, electronic and thermo-elastic properties of Cu6Sn5 and Cu5Zn8 intermetallic compounds: First-principles investigation," Intermetallics , vol. xx no. x, pp. xx-xx, xxxx.

Zhou, Wenfan, Tian, Yanhong, and Wang, Chunqing, "Microstructure of Sn-Ag-Cu Lead-free Flip Chip Interconnects during Aging," 2005 6th International Conference on Electronic Packaging Technology , Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Zhou, Xiaohua, Wen, Xuefeng, Li, Jinhui, and Liu, Hao, "Methodological Study and Application on Technology Policies of PCs Recycling in China," Proceedings of the 2007 IEEE International Symposium on Electronics & the Environment, Orlando, FL, May 7-10, 2007, pp. 34-39.

Zhou, Xiaoming, Gao, Peng, Sun, Shuchao, Bao, Di, Wang, Ying, Li, Xiaobo, Wu, Tingting, Chen, Yujin, and Yang, Piaoping, "Amorphous, Crystalline and Crystalline/Amorphous Selenium Nanowires and Their Different (De)Lithiation Mechanisms," Chemistry of Materials, vol. 27 no. 19, pp. 6730-6736, Oct. 13, 2015.

Zhou, Xiaoying, and Schoenung, Julie M., "An integrated impact assessment and weighting methodology: Evaluation of the environmental consequences of computer display technology substitution," Journal of Environmental Management, vol. 83 no. 1, pp. 1-24, Apr. 2007.

Zhou, Xiaoying, and Schoenung, Julie M., "An Integrated Impact Assessment and Weighting Methodology: Evaluation of the Environmental Consequences of Lead-Free Solder Alternatives," 2008 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 19-21, 2008, pp. xx-xx.

Zhou, Xiaoying, and Schoenung, Julie M., "Application of environmental accounting information to the decision-making for the environmentally conscious design and end-of-life management of cellular phones," Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 173-178.

Zhou, Xiaoyu, Guo, Jie, Lin, Kuangfei, Huang, Kai, and Deng, Jingjing, "Leaching characteristics of heavy metals and brominated flame retardants from waste printed circuit boards," Journal of Hazardous Materials, vol. 246-247, pp. 96-102, Feb. 15, 2013.

Zhou, Y., Al-Bassyiouni, M., and Dasgupta, A., "Harmonic and Random Vibration Durability of SAC305 and Sn37Pb Solder Alloys," IEEE Transactions on Components and Packaging Technologies, vol. 33 no. 2, pp. 319-328, June 2010.

Zhou, Y., Al-Bassyiouni, M., and Dasgupta, A., "Vibration Durability Assessment of Sn3.0Ag0.5Cu and Sn37Pb Solders Under Harmonic Excitation," Journal of Electronic Packaging, vol. 131 no. 1, pp. 011016-1-011016-9, Mar. 2009.

Zhou, Yanting, Ding, Dongyan, Han, Bai, Yu, Yunhong, Sun, Xulin, Chevrel, Henri, Ying, Hua, Li, Ming, and Mao, Dali, "Influence of Reflow Atmosphere on SAC305 Solder Joints," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 122-128.

Zhou, Yihan, "Preparation and Antibacterial Properties of Silver Nanowires," Materials Science Forum, vol. 944, pp. 686-691, Jan. 2019.

Zhou, Yihui, and Qiu, Keqiang, "A new technology for recycling materials from waste printed circuit boards," Journal of Hazardous Materials, vol. 175 no. 1-3, pp. 823-828, Mar. 15, 2010.

Zhou, Yilin, and Pecht, Michael, "Investigation on Mechanism of Creep Corrosion of Immersion Silver Finished Printed Circuit Board by Clay Tests," 2009 Proceedings of the 55th IEEE Holm Conference on Electrical Contacts, Vancouver, British Columbia, Canada, Sept. 14-16, 2009, pp. 324-333.

Zhou, Ying-chun, Pan, Qing-lin, Li, Wen-bin, Liang, Wen-jie, He, Yun-Bin, Li, Yun-chun, and Lu, Cong-ge, "Effect of La on intermetallic compounds of Sn-Ag-Cu lead-free alloy soldered with copper," Zhongguo Youse Jinshu Xuebao/ Chinese Journal of Nonferrous Metals, vol. 18 no. 9, pp. 1651-1657, Sept. 2008.

Zhou, Yuxun, and Dasgupta, Abhijit, "Vibration Durability Assessment of Sn3.0Ag0.5Cu & Sn37Pb Solders Under Harmonic Excitation," 2007 ASME International Mechanical Engineering Conference and Exposition, Volume 5, Seattle, WA, Nov. 11-15, 2007, pp. 413-420.

Zhou, Z. F., Zhou, Y. C., Pan, Y., and Xu, C. F., "Melting of Ni nanowires with and without oxide capping," Acta Materialia, vol. 58 no. 8, pp. 3059-3067, May 2010. https://doi.org/10.1016/j.actamat.2010.01.040

Zhou, Zhaoxia, Liu, Li, and Liu, Changqing, "Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy," 2018 7th Electronic System-Integration Technology Conference, Dresden, Germany, Sept. 18-21, 2018, pp. xx-xx.

Zhou, Zheng, Mo, Liping, Liu, Hui, Chan, Y. C., and Wu, Fengshun, "Study of Fusion Thickness of Tin Solder Heating by Self-Propagating Exothermic Reaction," Journal of Electronic Materials, vol. 47 no. 12, pp. 7435-7448, Dec. 2018.

Zhou, Zheng, Zhang, Anna, Liu, Hui, Mo, Liping, and Wu, Fengshun, "The influence of heat transfer boundary conditions on the fusion zone size of Sn solder under localized and rapid heat source," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 960-965.

Zhou, Zhou, Ma, Xiao, Zhou, Min-Bo, Yin, Can, and Zhang, Xin-Ping, "Effect of isothermal aging on mechanical properties and strain rate sensitivity of the eutectic Sn-58Bi solder alloy," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1586-1591.

Zhu, Ailan, and Liu, Yunji, "Research About New Lead-free Alloy Application Character," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 444-448.

Zhu, Dapeng, and Luo, Le, "Mechanical Properties of Arrayed Pb-Free Tin Bump and Its Interfacial Reaction with Ni-P UBM during Reflow Process," 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Zhu, F. L., Zhang, H. H., Guan, R. F., Liu, S., and Yang, Y. B., "Investigation of Temperature and Strain Rate Behavior of Lead-free Solder Sn96.5Ag3.5," 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 3-7, 2006, pp. 239-243.

Zhu, Fulong, Song, Shao, Zhang, Wei, and Liu, Sheng, "Creep Behavior Investigation of Lead-Free Solder Alloy Sn96.5Ag3Cu0.5," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 195-198.

Zhu, Fulong, Zhang, Honghai, Guan, Rongfeng, and Liu, Sheng, "Effects of temperature and strain rate on mechanical property of Sn96.5Ag3Cu0.5," Journal of Alloys and Compounds, vol. 438 no. 1-2, pp. 100-105, July 12, 2007.

Zhu, Fulong, Zhang, Honghai, Guan, Rongfeng, and Liu, Sheng, "Investigation of Creep Behavior of a Lead-Free Solder Alloy Sn96.5Ag3.5," 2006 7th International Conference on Electronic Packaging Technology , Shanghai, China, Aug. 26-29, 2006, pp. xx-xx.

Zhu, Fulong, Zhang, Honghai, Guan, Rongfeng, and Liu, Sheng, "Investigation of microstructures and tensile properties of a Sn-Cu lead-free solder alloy," Journal of Materials Science: Materials in Electronics , vol. 17 no. x, pp. 379-384, 2006.

Zhu, Fulong, Wang, Zhiyong, Guan, Rongfeng, and Zhang, Honghai, "Mechanical Properties of a Lead-Free Solder Alloys," Proceedings of 2005 International Conference on Asian Green Electronics, Shang Hai, China, Mar. 15-18, 2005, pp. 107-112.

Zhu, Fulong, Zhang, Honghai, Guan, Rongfeng, and Liu, Sheng, "Microstructure and Mechanical Properties Investigation of Lead-free Solder Sn99.3Cu0.7," 2005 6th International Conference on Electronic Packaging Technology, Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Zhu, Fulong, Zhang, Honghai, Guan, Rongfeng, and Liu, Sheng, "The effect of temperature and strain rate on the tensile properties of a Sn99.3Cu0.7(Ni) lead-free solder alloy," Microelectronic Engineering , vol. 84 no. 1, pp. 144-150, Jan. 2007.

Zhu, Gang, and Chen, Dapeng, "Solvothermal fabrication of uniform silver nanowires," Journal of Materials Science: Materials in Electronics, vol. 23 no. 11, pp. 2035-2041, Nov. 2012.

Zhu, H. W., Li, P. G., Lei, M., Li, L. H., Wang, S. L., and Tang, W. H., "Sublimation sandwich route to ultralong zinc-blende ZnSe nanowires and the cathodoluminescence properties of individual nanowires," Journal of Alloys and Compounds, vol. 509 no. 7, pp. 3306-3309, Feb. 17, 2011.

Zhu, Hui-Ling, Lun, Ning, Zhang, Zheng, Liu, Rui, Meng, Xiang-Lin, Zhang, Bo, Han, Fu-Dong, Bai, Yu-Jun, Bi, Jian-Qiang, and Fan, Run-Hua, "A catalyst-free method to silicon nanowires at relative low temperature," Journal of Crystal Growth, vol. 312 no. 24, pp. 3579-3582, Dec. 1, 2010.

Zhu, Jiandong, Wang, Chunqing, Hang, Chunjin, and Tian, Yanhong, "Growth and shear strength of intermetallic compounds in Sn-Ag-Cu solder joints," 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp. 40-43.

Zhu, Jie-Fei, Jin, Hong, Zhou, Min-Bo, and Zhang, Xin-Ping, "Electrical property of electrically conductive adhesives filled with micro-sized Ag flakes and modified by dicarboxylic acids," 2016 17th International Conference on Electronic Packaging Technology, Wuhan, China, Aug. 16-19, 2016, pp. 923-926.

Zhu, Ninghui, "Thermal Impact of Solder Voids in the Electronic Packaging of Power Devices," Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Diego, CA, Mar. 9-11, 1999, pp. 22-29.

Zhu, P., Chen, Y., Wang, L. Y., Qian, G. Y., Zhou, M., and Zhou, J., "A new technology for separation and recovery of materials from waste printed circuit boards by dissolving bromine epoxy resins using ionic liquid," Journal of Hazardous Materials, vol. 239-240, pp. 270-278, Nov. 15, 2012.

Zhu, Ping, Chen, Yan, Wang, Liang you, and Zhou, Ming, "A new technology for recycling solder from waste printed circuit boards using ionic liquid," Waste Management and Research, vol. no. 11, pp. 1222-1226, Nov. 2012.

Zhu, Q. S., Song, H. Y., Liu, H. Y., Wang, Z. G., and Shang, J. K., "Effect of Zn Addition on Microstructure of Sn-Bi Joint," International Conference on Electronic Packaging Technology & High Density Packaging , Beijing, China, Aug. 10-13, 2009, pp. 1043-1046.

Zhu, Q. S., Gao, F., Ma, H. C., Liu, Z. Q., Guo, J. D., and Zhang, L., "Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current," Journal of Materials Science: Materials in Electronics, vol. 29 no. 6, pp. 5025-5033, Mar. 2018.

Zhu, Q. S., Zhang, Z. F., Shang, J. K., and Wang, Z. G., "Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces," Materials Science and Engineering: A, vol. 435-436, pp. 588-594, Nov. 5, 2006.

Zhu, Q. S., Zhang, Z. F., Wang, Z. G., and Shang, J. K., "Inhibition of interfacial embrittlement at SnBi/Cu single crystal by electrodeposited Ag film," Journal of Materials Research, vol. 23 no. 1, pp. 78-82, Jan. 2008.

Zhu, Q. S., Wang, Z. G., Zeng, Q. L., Wu, S. D., and Shang, J. K., "Rapid cycle-dependent softening of equal channel angularly pressed Sn-Ag-Cu alloy," Journal of Materials Research, vol. 23 no. 10, pp. 2630-2638, Oct. 2008.

Zhu, Q. S., Guo, J. J., Wang, Z. G., Zhang, Z. F., and Shang, J. K., "Shear of Sn-3.8Ag-0.7Cu Solder Balls on Electrodeposited FeNi Layer," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.

Zhu, Q. S., Liu, H. Y., Wang, Z. G., and Shang, J. K., "Surface Morphology of Sn-Rich Solder Interconnects After Electrical Loading," Journal of Electronic Materials, vol. 41 no. 4, pp. 741-747, Apr. 2012.

Zhu, Qingsheng, Zhang, Zhefeng, Shang, Jianku, and Wang, Zhongguang, "A New Approach for the Evaluation of Interfacial Reliability in Micro-scale," 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.

Zhu, Qingsheng, Zhang, Li, Wang, Zhongguang, Wu, Shiding, and Shang, Jianku, "Effect of Intermetallics Ag3Sn on the Tensile Property of Sn3.8Ag0.7Cu Solder Alloy," Acta Metallurgica Sinica, vol. 43 no. 1, pp. 41-46, Jan. 2007,

Zhu, Qing-Sheng, Guo, Jian-Jun, Shang, Pan-Ju, Wang, Zhong-Guang, and Shang, Jian-Ku, "Effects of Aging on Interfacial Microstructure and Reliability Between SnAgCu Solder and FeNi/Cu UBM," Advanced Engineering Materials, vol. 12 no. 6, pp. 497-503, June 2010.

Zhu, Qinong, Sheng, Mei, and Luo, Le, "The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT," Soldering & Surface Mount Technology, vol. 12 no. 3, pp. 19-24, 2000.

Zhu, Sherry, and Nguyen, Cam, "Lead Free Solder Process Development and Reliability for Handset Application," IEEE/CPMT International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, CA, Mar. 16-18, 2005, pp. 100-104.

Zhu, W. H., Xu, Luhua, Pang, John H. L., Zhang, X. R., Poh, Edith, Sun, Y. F., Sun, Anthony Y. S., Wang, C. K., and Tan, H. B., "Drop Reliability Study of PBGA Assemblies with SAC305, SAC105 and SAC105-Ni Solder Ball on Cu-OSP and ENIG Surface Finish," 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1667-1672.

Zhu, Wenbo, Ma, Yong, Li, Xuezheng, Zhou, Wei, and Wu, Ping, "Effects of Al2O3 nanoparticles on the microstructure and properties of Sn58Bi solder alloys," Journal of Materials Science: Materials in Electronics , vol. 29 no. 9, pp. 7575-7585, May 2018.

Zhu, Wenbo, Zhang, Weiwei, Zhou, Wei, and Wu, Ping, "Improved microstructure and mechanical properties for SnBi solder alloy by addition of Cr powders," Journal of Alloys and Compounds, vol. 789, pp. 805-813, June 15, 2019.

Zhu, WenJun, Liu, HuaShan, Wang, Jiang, and Jin, ZhanPeng, "Formation of intermetallic compound (IMC) between Sn and Co substrate," Journal of Alloys and Compounds, vol. 456 no. 1-2, pp. 113-117, May 29, 2008.

Zhu, WenJun, Liu, HuaShan, Wang, JinSan, Ma, Guang, and Jin, ZhanPeng, "Interfacial Reactions Between Sn-Zn Alloys and Ni Substrates," Journal of Electronic Materials, vol. 39 no. 2, pp. 209-214, Feb. 2010.

Zhu, WenJun, Wang, Jiang, Liu, HuaShan, Jin, ZhanPeng, and Gong, WeiPing, "The interfacial reaction between Sn-Ag alloys and Co substrate," Materials Science and Engineering: A, vol. 456 no. 1-2, pp. 109-113, May 15, 2007.

Zhu, WenJun, Liu, HuaShan, Wang, JinSan, Dong, HongQun, and Jin, ZhanPeng, "Thermodynamic Assessment of the Sn-Ag-Co System and Solidification Simulation of the Ternary Alloy," Journal of Alloys and Compounds, vol. xxx no. xxx, pp. xx-xx, xxxx.

Zhu, Wenpeng, Wang, Hongtao, and Yang, Wei, "Orientation- and microstructure-dependent deformation in metal nanowires under bending," Acta Materialia, vol. 60 no. 20, pp. 7112-7122, Dec. 2012.

Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S. H., Bailey, C., and Chan, Y. C., "Electromigration in Sn-Ag solder thin films under high current density," Thin Solid Films, vol. 565, pp. 193-201, Aug. 28, 2014.

Zhu, XiaoKun, Qi, Bo, Qu, Xin, Wang, JiaJi, Lee, Taekoo, and Wang, Hui, "Mechanical Test and Analysis on Reliability of Lead-free BGA Assembly," 2005 6th International Conference on Electronic Packaging Technology , Dameisha, Shezhen, China, Aug. 30-Sept. 2, 2005, pp. xx-xx.

Zhu, Xuewei, Wang, Richu, Peng, Chaoqun, Wei, Xiaofeng, and Peng, Jian, "Reactions and mechanical properties between AuSn20 solders and metalized Al-Si alloys for electronic packaging application," Journal of Materials Science: Materials in Electronics, vol. 25 no. 2, pp. 742-748, Feb. 2014.

Zhu, Yan, and Sun, Fenglian, "Effect of solder joint thickness on IMC growth rate of Cu/Sn/Cu solder joints during thermal aging," Journal of Electronic Packaging, vol. 138 no. 4, pp. 041005-1-041005-5, Dec. 2016.

Zhu, Yan, and Sun, Fenglian, "Geometric size effect on IMC growth and elements diffusion in Cu/Sn/Cu solder joints," Soldering & Surface Mount Technology, vol. 29 no. 2, pp. 85-91, 2017.

Zhu, Yandan, Wang, Lifeng, Liu, Yang, and Lv, Ye, "Effect of RE Element Addition and Processing Parameters on the Shear Strength and Interfacial IMCs of SAC Solder Joints," 2012 7th International Forum on Strategic Technology, Tomsk, Russia, Sept. 18-21, 2012, pp. xx-xx.

Zhu, Yaxin, Li, Zhenhuan, and Huang, Minsheng, "Coupled effect of sample size and grain size in polycrystalline Al nanowires," Scripta Materialia, vol. 68 no. 9, pp. 663-666, May 2013.

Zhu, Yong, "In Situ Nanomechanical Testing of Crystalline Nanowires in Electron Microscopes," JOM, vol. 68 no. 1, pp. 84-93, Jan. 2016.

Zhu, Yongxin, Li, Xiaoyan, Wang, Chao, and Gao, Ruiting, "A new creep-fatigue life model of lead-free solder joint," Microelectronics Reliability, vol. 55 no. 7, pp. 1097-1100, June 2015.

Zhu, Yongxin, Li, Xiaoyan, and Gao, Ruiting, "Creep failure mechanism and life prediction of lead-free solder joint," Journal of Materials Science: Materials in Electronics, vol. 26 no. 1, pp. 267-272, Jan. 2015.

Zhu, Yongxin, Li, Xiaoyan, Gao, Ruiting, and Wang, Chao, "Effect of hold time on the mechanical fatigue failure behavior of lead-free solder joint under high temperature," Journal of Materials Science: Materials in Electronics, vol. 25 no. 9, pp. 3863-3869, Sept. 2014.

Zhu, Yongxin, Li, Xiaoyan, Gao, Ruiting, and Wang, Chao, "Investigate influence of solder thickness on the fatigue failure behavior of solder joint under high temperature," 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 940-944.

Zhu, Yongxin, Li, Xiaoyan, Wang, Chao, and Gao, Ruiting, "Investigation on high temperature mechanical fatigue failure behavior of SnAgCu/Cu solder joint," Journal of Materials Science: Materials in Electronics, vol. 25 no. 3, pp. 1429-1434, Mar. 2014.

Zhu, Yongxin, Li, Xiaoyan, Gao, Ruiting, and Wang, Chao, "Low-cycle fatigue failure behavior and life evaluation of lead-free solder joint under high temperature," Microelectronics Reliability, vol. 54 no. 12, pp. 2922-2928, Dec. 2014.

Zhu, Yongxin, Li, Xiaoyan, and Gao, Ruiting, "Stress relaxation behavior of lead-free solder joint," Journal of Materials Science: Materials in Electronics, vol. 26 no. 5, pp. 3020-3024, May 2015.

Zhu, Z. X., Li, C. C., Liao, L. L., Liu, C. K., and Kao, C. R., "Au-Sn bonding material for the assembly of power integrated circuit module," Journal of Alloys and Compounds, vol. 671, pp. 340-345, June 25, 2016.

Zhu, Ze, Sun, Huayu, Wu, Fengshun, and Chan, Yan-cheong, "Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods," Journal of Materials Science: Materials in Electronics, vol. 27 no. 7, pp. 6835-6844, July 2016.

Zhu, Ze, Chan, Yan-Cheong, Chen, Zhong, Gan, Chee-Lip, and Wu, Fengshun, "Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder," Materials Science and Engineering: A, vol. 727, pp. 160-169, June 6, 2018.

Zhu, Ze, Chan, Yan-cheong, and Wu, Fengshun, "Effects of ZrO2 nanoparticles on the mechanical properties of Sn42Bi58 solder joint," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 140-143.

Zhu, Ze, Sun, Huayu, Chan, Yan-cheong, and Wu, Fengshun, "Electromigration study of SnCu0.7 solder joints with Ag added by different methods," 2015 IEEE 17th Electronics Packaging and Technology Conference , Singapore, Dec. 2-4, 2015, pp. xx-xx.

Zhu, Ze, Li, Yi, Wu, Fengshun, and Chan, Yan-cheong, "Enhanced Electromigration (EM) Reliability of Sn58Bi Solder Due to the Incorporation of ZrO2 Nanoparticles," 2016 6th Electronic System-Integration Technology Conference, Grenoble, France, Sept. 13-15, 2016, pp. xx-xx.

Zhu, Ze, Chan, Yan-cheong, Wu, Fengshun, Gan, Chee Lip, and Chen, Zhong, "Review on test vehicles for electromigration (EM) study in solder interconnects," 2017 IEEE 19th Electronics Packaging Technology Conference, Singapore, Dec. 6-9, 2017, pp. xx-xx.

Zhu, Zhidan, Ma, Haoran, Shang, Shengyan, Ma, Haitao, Wang, Yunpeng, and Li, Xiaogan, "Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface," Journal of Materials Science: Materials in Electronics, vol. 30 no. 17, pp. 15964-15971, Sept. 2019.

Zhuge, Jing, Tian, Yu, Wang, Runsheng, Huang, Ru, Wang, Yiqun, Chen, Baoqin, Liu, Jia, Zhang, Xing, and Wang, Yangyuan, "High-Performance Si Nanowire Transistors on Fully Si Bulk Substrate From Top-Down Approach: Simulation and Fabrication," IEEE Transactions on Nanotechnology, vol. 9 no. 1, pp. 114-122, Jan. 2010.

Zhukov, A., Blanco, J. M., Ipatov, M., Talaat, A., and Zhukova, V., "Engineering of domain wall dynamics in amorphous microwires by annealing," Journal of Alloys and Compounds, vol. 707, pp. 35-40, June 15, 2017.

Zhukov, A., Talaat, A., Churyukanova, M., Kaloshkin, S., Semenkova, V., Ipatov, M., Blanco, J. M., and Zhukova, V., "Engineering of magnetic properties and GMI effect in Co-rich amorphous microwires," Journal of Alloys and Compounds, vol. 664, pp. 235-241, Apr. 15, 2016.

Zhukov, A., Churyukanova, M., Kaloshkin, S., Sudarchikova, V., Gudoshnikov, S., Ipatov, M., Talaat, A., Blanco, J. M., and Zhukova, V., "Magnetostriction of Co-Fe-Based Amorphous Soft Magnetic Microwires," Journal of Electronic Materials, vol. 45 no. 1, pp. 226-234, Jan. 2016.

Zhukov, Arcady, Ipatov, Mihail, Talaat, Ahmed, Blanco, Juan Maria, and Zhukova, Valentina, "Engineering of Magnetic Properties of Co- and Fe-Rich Microwires," IEEE Transactions on Magnetics, vol 54 no. 6 pt. 1, pp. 2000707, June 2018.

Zhukov, Arcady P., Corte-Leon, Paula, Blanco, Juan Maria, Ipatov, Mihail, Gonzalez, Julian, and Zhukova, Valentina, "Engineering of Magnetic Properties of Fe-Rich Microwires by Stress Annealing," IEEE Transactions on Magnetics, vol. 55 no. 2 part 1, pp. 2000504, Feb. 2019.

Zhukova, V., Blanco, J. M., Corte-Leon, P., Ipatov, M., Churyukanova, M., Taskaev, S., and Zhukov, A., "Grading the magnetic anisotropy and engineering the domain wall dynamics in Fe-rich microwires by stress-annealing," Acta Materialia, vol. 155, pp. 279-285, Aug. 15, 2018.

Zhukova, V., Umnov, P., Molokanov, V., Shalygin, A. N., Talaat, A., and Zhukov, A., "Magnetic Properties and GMI Effect of Ductile Amorphous Microwires," IEEE Transactions on Magnetics, vol. 48 no. 11, pp. 4034-4037, Nov. 2012.

Zhukova, V., Blanco, J. M., Ipatov, M., Churyukanova, M., Olivera, J., Taskaev, S., and Zhukov, A., "Optimization of high frequency magnetoimpedance effect of Fe-rich microwires by stress-annealing," Intermetallics, vol. 94, pp. 92-98, Mar. 2018.

Zhukova, Valentina, Ipatov, Mihail, del Val, Juan Jose, Granovsky, Alexandr, and Zhukov, Arcady, "Tuning of Magnetic Properties of Ni-Mn-Ga Glass-Coated Microwires," IEEE Transactions on Magnetics, vol 54 no. 6 pt. 1, pp. 2500504, June 2018.

Zianni, Xanthippi, "Designing width-modulated Si nanowires for enhanced thermoelectric efficiency," Microelectronic Engineering, vol. 159, pp. 51-54, June 15, 2016.

Zielonka, Andreas, and Krastev, Ivan, "Electrodeposition and Properties of Silver-Antimony Alloy Multilayers," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. 611-627.

Zielonka, Andreas, and Fauser, Heidi, "Influence of pulse-plating on internal stresses of alloy deposits and multilayers," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. 337-343.

Ziemann, M., Chen, Y., Kraft, O., Bayerschen, E., Wulfinghoff, S., Kirchlechner, C., Tamura, N., Bohlke, T., Walter, M., and Gruber, P. A., "Deformation patterns in cross-sections of twisted bamboo-structured Au microwires," Acta Materialia, vol. 97, pp. 216-222, Sept. 15, 2015.

Zimmerman, D. D., "A New Gold-Tin Alloy Composition for Hermetic Package Sealing and Attachment of Hybrid Parts," Solid State Technology, vol. 15 no. 1, pp. 44-46, Jan. 1972.

Zimprich, P., Betzwar-Kotas, A., Khatibi, G., Weiss, B., and Ipser, H., "Size effects in small scaled lead-free solder joints," Journal of Materials Science: Materials in Electronics, vol. 19 no. 4, pp. 383-388, Apr. 2008.

Zimprich, Peter, Saeed, Usman, Weiss, Brigitte, and Ipser, Herbert, "Constraining Effects of Lead-Free Solder Joints During Stress Relaxation," Journal of Electronic Materials, vol. 38 no. 3, pp. 392-399, Mar. 2009.

Zimprich, Peter, Saeed, Usman, Betzwar-Kotas, Agnieszka, Weiss, Brigitte, and Ipser, Herbert, "Mechanical Size Effects in Miniaturized Lead-Free Solder Joints," Journal of Electronic Materials, vol. 37 no. 1, pp. 102-109, Jan. 2008.

Zingg, Rene, Geelhaar, Ricardo, Myat, Chan, Struwe, Armin, and Krastev, Evstatin, "Comparative Tests for Lead-Free Solder Bumps," 2015 European Microelectronics Packaging Conference, Friedrichshafen, Germany, Sept. 14-16, 2015, pp. xx-xx.

Zink, Trevor, Maker, Frank, Geyer, Roland, Amirtharajah, Rajeevan, and Akella, Venkatesh, "Comparative life cycle assessment of smartphone reuse: repurposing vs. refurbishment," International Journal of Life Cycle Assessment, vol. 19 no. 5, pp. 1099-1109, May 2014.

Zinn, A. A., Stoltenberg, R. M., Beddow, J., and Chang, J., "NanoCopper Based Solder-free Electronic Assembly Material," IPC APEX Expo 2014, Las Vegas, NV, Mar. 25-27, 2014, pp. xx-xx.

Zivkovic, D., Katayama, I., Gomidzelovic, L., Manasijevic, D., and Novakovic, R., "Comparative thermodynamic study and phase equlibria of the Bi-Ga-Sn ternary system," International Journal of Materials Research, vol. 98 no. 10, pp. 1025-1030, Oct. 2007.

Zivkovic, D., Manasijevic, D., Kamberovic, Z., Cocic, M., and Marjanovic, B., "Thermodynamic and Structural Investigation of the Ag-In-Sb System," Metalurgija, vol. 46 no. 3, pp. 151-156, July-Sept. 2007.

Zivkovic, Dragana, Milosavljevic, A., Mitovski, A., and Marjanovic, B., "Comparative Thermodynamic Study and Characterization of Ternary Ag-In-Sn Alloys," Journal of Thermal Analysis and Calorimetry, vol. 89 no. 1, pp. 137-142, July 2007.

Zivkovic, Dragana, Minic, Dusko, Manasijevic, Dragan, Talijan, Nadezda, Katayama, Iwao, and Kostov, Ana, "Thermodynamic analysis and characterization of Bi-Cu-Sn alloys as advanced lead-free solder materials for high temperature application," Journal of Materials Science: Materials in Electronics, vol. 22 no. 8, pp. 1130-1135, Aug. 2011.

Zivkovic, Dragana, Mitovski, Aleksandra, Balanovic, Ljubisa, Manasijevic, Dragan, and Zivkovic, Zivan, "Thermodynamic analysis of liquid In-Sn alloys using Oelsen calorimetry," Journal of Thermal Analysis and Calorimetry, vol. 102 no. 3, pp. 827-830, Dec. 2010.

Zivkovic, Dragana, Katayama, Iwao, Zivkovic, Zivan, and Manasijevic, Dragan, "Thermodynamic Investigation of Liquid Alloys in Ga-Sb-Bi-Sn System," Materials Science Forum, vol. 502, pp. 123-128, 2005.

Zizzo, Thomas, "Europe gives Mother Nature a break," Electronic Business, Feb. 1, 2001.

Zizzo, Thomas, "New environmental laws in Europe target electronics waste," Electronic Business, vol. June 1, 2003.

Zobac, Ondrej, Sopousek, Jiri, Bursik, Jiri, Zemanova, Adela, and Roupcova, Pavla, "Experimental Study of the Sb-Sn-Zn Alloy System," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 45 no. 3, pp. 1181-1188, Mar. 2014.

Zoch, Reiner, "PCB layout and soldering nozzle design in selective soldering process," Global SMT and Packaging, vol. 9 no. 1, pp. 16-19, Jan. 2009.

Zorina, M. A., Karabanalov, M. S., Stepanov, S. I., Demakov, S. L., Loginov, Yu. N., and Lobanov, M. L., "Fiber vs Rolling Texture: Stress State Dependence for Cold-Drawn Wire," Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 49 no. 2, pp. 427-433, Feb. 2018.

Zoro, E., Dichi, E., Servant, C., and Legendre, B., "Phase equilibria in the Ag-Au-Bi ternary system," Journal of Alloys and Compounds, vol. 400, pp. 209-215, Sept. 1, 2005.

Zoro, E., Servant, C., and Legendre, B., "Thermodynamic Assessment of the Ag-Au-Bi and Ag-Au-Sb Systems," Journal of Thermal Analysis and Calorimetry, vol. 90 no. 2, pp. 347-353, Nov. 2007.

Zou, C. D., Gao, Y. L., Yang, B., Zhai, Q. J., Andersson, C., and Liu, J., "Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles," Soldering & Surface Mount Technology, vol. 21 no. 2, pp. 9-13, 2009.

Zou, Chang Dong, Gao, Yu Lai, Yang, Bin, Xia, Xin Zhi, Zhai, Qi Jie, Andersson, Cristina, and Liu, Johan, "Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression," Journal of Electronic Materials, vol. 38 no. 2, pp. 351-355, Feb. 2009.

Zou, Changdong, Gao, Yulai, Yang, Bin, and Zhai, Qijie, "Nanoparticles of Sn3.0Ag0.5Cu alloy synthesized at room temperature with large melting temperature depression," Journal of Materials Science: Materials in Electronics, vol. 23 no. 1, pp. 2-7, Jan. 2012.

Zou, Chang-dong, Gao, Yu-lai, Yang, Bin, and Zhai, Qi-jie, "Size-dependent melting properties of Sn nanoparticles by chemical reduction synthesis," Transactions of Nonferrous Metals Society of China, vol. 20 no. 2, pp. 248-253, Feb. 2010.

Zou, Changdong, Gao, Yulai, Yang, Bin, and Zhai, Qijie, "Synthesis and DSC study on Sn3.5Ag alloy nanoparticles used for lower melting temperature solder," Journal of Materials Science: Materials in Electronics, vol. 21 no. 9, pp. 868-874, Sept. 2010.

Zou, Gang, Gronqvist, Hans, Lai, Zonghe, Sodervall, Ulf, and Liu, Johan, "High Frequency Flip Chip Interconnection on Liquid Crystal Polymer Substrate Using Anisotropic Conductive Adhesive," 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, Portland, OR, Sept. 12-15, 2004, pp. 137-140.

Zou, Gang, Gronqvist, Hans, and Liu, Johan, "Theoretical Analysis of RF Performance of Anisotropic Conductive Adhesive Flip-Chip Joints," IEEE Transactions on Components and Packaging Technologies, vol. 27 no. 3, pp. 546-550, Sept. 2004.

Zou, H. F., and Zhang, Z. F., "Abnormal Growth of Intermetallic Compounds in Asymmetrical Cu/Sn/Ag Couples," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an, China, Aug. 16-19, 2010, pp. 418-421.

Zou, H. F., Yang, H. J., and Zhang, Z. F., "Coarsening mechanisms, texture evolution and size distribution of Cu6Sn5 between Cu and Sn-based solders," Materials Chemistry and Physics , vol. 131 no. 1-2, pp. 190-198, Dec. 15, 2011.

Zou, H. F., Yang, H. J., and Zhang, Z. F., "Controlling the Morphology and Orientation of Cu6Sn5 through Designing the Orientations of Cu Single Crystals," International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp. 1212-1215.

Zou, H. F., and Zhang, Z. F., "Ductile-to-brittle transition induced by increasing strain rate in Sn-3Cu/Cu joints," Journal of Materials Research, vol. 23 no. 6, pp. 1614-1617, June 2008.

Zou, H. F., and Zhang, Z. F., "Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates," Journal of Electronic Materials, vol. 37 no. 8, pp. 1119-1129, Aug. 2008.

Zou, H. F., and Zhang, Z. F., "Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn-3Cu/Cu single crystal joints," Microelectronic Engineering, vol. 87 no. 4, pp. 601-609, Apr. 2010.

Zou, H. F., Zhang, Q. K., and Zhang, Z. F., "Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples," Journal of Electronic Materials, vol. 40 no. 7, pp. 1542-1548, July 2011.

Zou, H. F., Zhang, Q. K., and Zhang, Z. F., "Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate," Materials Science and Engineering: A, vol. 532, pp. 167-177, Jan. 15, 2012.

Zou, H. F., Yang, H. J., and Zhang, Z. F., "Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals," Acta Materialia, vol. 56 no. 11, pp. 2649-2662, June 2008.

Zou, H. F., Yang, H. J., Tan, J., and Zhang, Z. F., "Preferential growth and orientation relationship of Ag3Sn grains formed between molten Sn and (001) Ag single crystal," Journal of Materials Research, vol. 24 no. 6, pp. 2141-2144, June 2009.

Zou, H. F., and Zhang, Z. F., "Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate," Journal of Alloys and Compounds , vol. 469 no. 1-2, pp. 207-214, Feb. 5, 2009.

Zou, H. F., Zhang, Q. K., and Zhang, Z. F., "Transition of Bi embrittlement of SnBi/Cu joint couples with reflow temperature," Journal of Materials Research, vol. 26 no. 3, pp. 449-454, Feb. 2011.

Zou, Jian, Mo, Liping, Wu, Fengshun, Wang, Bo, Liu, Hui, Zhang, Jun, and Wu, Yiping, "Effect of Cu Substrate and Solder Alloy on the Formation of Kirkendall Voids in the Solder Joints during Thermal Aging," 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging , Xi'an, China, Aug. 16-19, 2010, pp. 944-948.

Zou, L., and Hunt, C., "Development of Preheat on Solderability Testing," NPL Report DEPC-MPR 036, Sept. 2005.

Zou, Ling, and Hunt, Chris, "A New Approach to Investigate Conductive Anodic Filament (CAF) Formation," Soldering & Surface Mount Technology, vol. 27 no. 1, pp. xx-xx, 2015.

Zou, Ling, Dusek, Milos, Wickham, Martin, and Hunt, Christopher, "Characterising Stencil Printing of Surface Mount and Conductive Adhesives," NPL Report MATC(A)55, Oct. 2001.

Zou, Ling Chunxian, and Hunt, Christopher, "Electrochemical behavior of metal interconnects in electronic assemblies," Journal of Materials Research, vol. 23 no. 10, pp. 2622-2629, Oct. 2008.

Zou, Ling, and Hunt, Chris, "Electrochemical Impedance Technique to Predict Circuit Reliability with Lead-free Solders," NPL Report MAT 15, Mar. 2008.

Zou, Ling, and Hunt, Chris, "Protection Performance of Conformal Coatings in Harsh Environments," NPL Report DEPC-MPR 054, July 2006.

Zou, Ling, Lea, Deborah, and Hunt, Chris, "Solderability Testing of Surface Mount Components and PCB Pads," NPL Measurement Good Practice Guide No. 66, Feb. 2004.

Zou, Ling, and Hunt, Christopher, "Solderability Testing with Components Preheating," NPL Measurement Note DEPC-MN 038, Dec. 2005.

Zou, Ling, and Hunt, Chris, "Susceptibility of Lead-Free Systems to Electrochemical Migration," NPL Report MAT 1, May 2007.

Zou, Ling, and Hunt, Chris, "Test Method for Conformal Coating Protection Performance of Electronic Assembly in Harsh Environments," NPL Report DEPC-MPR 060, Mar. 2007.

Zou, Ling, Dusek, Milos, Wickham, Martin, and Hunt, Christopher, "The Effect of Solder Alloy, Metal Particle Size and Substrate Resist on Fine Pitch Stencil Printing Performance," NPL Report MATC(A)18, Nov. 2001.

Zou, Pengfei, Sun, Fenglian, and Liu, Yang, "Effect of Ni on the morphology of IMC and Mechanical Properties of SAC-Bi-Ni/Cu Joints," 2011 International Symposium on Advanced Packaging Materials, Xiamen, China, Oct. 25-28, 2012, pp. 267-271.

Zou, Shiwen, Li, Xiaogang, Dong, Chaofang, Ding, Kangkang, and Xiao, Kui, "Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment," Electrochimica Acta , vol. 114, pp. 363-371, Dec. 30, 2013. https://doi.org/10.1016/j.electacta.2013.10.051

Zou, Yabing, and Li, Weiming, "Process Optimization for Backward Compatible Reflow Soldering," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 797-802.

Zou, Yida, Lau, John, and Camerlo, Saergio, "3D Nonlinear Thermal Stress Analysis of VCSEL (Vertical-Cavity Surface-Emitting Laser) Assemblies with Lead-Free Flip-Chip Interconnects," 2003 Proceedings 53rd Electronic Components & Technology Conference , New Orleans, LA, May 27-30, 2003, pp. 1684-1690.

Zou, Yong, Cheng, YanHai, Cheng, Lin, and Liu, Wen, "Effect of Tin Addition on the Properties of Electroless Ni-P-Sn Ternary Deposits," Materials Transactions, vol. 51 no. 2, pp. 277-281, 2010.

Zou, Yong-Sheng, Hsiao, Yu-Hsiang, and Lin, Kwang-Lung, "Intermetallic Compound Growth Mechanism and Failure Modes of Flip Chip Solder Bump with Different UBM Structure during Electromigration," 2014 IEEE 16th Electronics Packaging Technology Conference, Singapore, Dec. 3-5, 2014, pp. 155-158.

Zou, Zhongli, Li, Ning, Li, Deyu, Liu, Haiping, and Mu, Songlin, "A vanadium-based conversion coating as chromate replacement for electrogalvanized steel substrates," Journal of Alloys and Compounds , vol. 509 no. 2, pp. 503-507, Jan. 12, 2011.

Zou, Zhouling, Wu, Fengshun, Mo, Liping, Zhou, Zheng, and Liu, Hui, "Comparison on microstructure and mechanical property of composite solder joints with different reinforcements," 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, Aug. 16-19, 2017, pp. 1455-1460.

Zribi, A., Kinyanjui, R., Borgesen, P., Zavalij, L, and Cotts, E. J., "Aspects of the Structural Evolution of Lead-Free Solder Joints," JOM , vol. 54 no. 6, pp. 38-40, June 2002.

Zribi, A., and Cotts, E. J., "Diffusion Controlled Growth of Ternary Intermetallic Compounds in Pb-Based and Pb-Free Electronic Solder Joints," 2001 SMTA International Conference Proceedings, Chicago, IL, Sept. 30-Oct. 4, 2001, pp. xx-xx.

Zribi, A., Clark, A., Zavalij, L., Borgesen, P., and Cotts, E. J., "The Growth of Intermetallic Compounds at Sn-Ag-Cu Solder/Cu and Sn-Ag-Cu Solder/Ni Interfaces and the Associated Evolution of the Solder Microstructure," Journal of Electronic Materials, vol. 30 no. 9, pp. 1157-1164, Sept. 2001.

Zribi, A., Zavalij, L., Borgesen, P., Primavera, A., Westby, G., and Cotts, E. J., "The Kinetics of Formation of Ternary Intermetallic Alloys in Pb-Sn and Cu-Ag-Sn Pb-free Electronic Joints," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 687-692.

Zribi, Anis, Kinyanjui, Robert K., Varano, W., and Cotts, Eric J., "Inhibiting Growth of Au-Ni-Sn Ternary Compounds at the Interfaces of Pb-Based and Pb-Free Solder Joints," 2002 SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.

Zu, Fang-qiu, Zhou, Bing, Li, Xian-fen, Yi, Xun, Chen, Yi-ping, and Sun, Qi-qiang, "Effect of liquid-liquid structure transition on solidification of Sn-Bi alloys," Transactions of Nonferrous Metals Society of China, vol. 17 no. 5, pp. 893-897, Oct. 2007.

Zuidwijk, Rob, and Krikke, Harold, "Strategic response to EEE returns: Product eco-design or new recovery processes?," European Journal of Operational Research, vol. 191 no. 3, pp. 1206-1222, Dec. 16, 2008.

Zulkarnain, M., Mariatti, M., and Azid, I. A., "Prediction Studies on Percolation Threshold Behaviour of Silver Filled Epoxy Composite for Electrically Conductive Adhesives Applications," 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.

Zuo, Jianwei, Fu, Guicui, Su, Yutai, and Jiang, Maogong, "Thermal fatigue life analysis of defective solder joints based on Engelmaier Fatigue Model," 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, Haining, China, Dec. 14-16, 2017, pp. xx-xx.

Zuo, Xiao-long, and Xian, Ai-Ping, "The influence of presetting a-Sn on the transformation of Sn at low temperature," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 152-155.

Zuo, Yong, Ma, Limin, Guo, Fu, and Ding, Huanyou, "Creep Behaviors of Pb-Free Solder Joints during Current Stressing," 2015 16th International Conference on Electronic Packaging Technology, Changsha, China, Aug. 11-14, 2015, pp. 746-751.

Zuo, Yong, Ma, Limin, Guo, Fu, Qiao, Lei, Shu, Yutian, and Han, Jing, "Effects of Electromigration on the Creep of Sn0.3Ag0.7Cu Solder Joint," 2014 15th International Conference on Electronic Packaging Technology , Chengdu, China, Aug. 12-15, 2014, pp. 898-901.

Zuo, Yong, Ma, Limin, Guo, Fu, Qiao, Lei, Shu, Yutian, Lee, Andree, and Subramanian, K. N., "Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints," Journal of Electronic Materials, vol. 43 no. 12, pp. 4395-4405, Dec. 2014.

Zuo, Yong, Bieler, Thomas R., Zhou, Quan, Ma, Limin, and Guo, Fu, "Electromigration and Thermomechanical Fatigue Behavior of Sn0.3Ag0.7Cu Solder Joints," Journal of Electronic Materials, vol. 47 no. 3, pp. 1881-1895, Mar. 2018.

Zuo, Yong, Ma, Limin, Liu, Sihan, Shu, Yutian, and Guo, Fu, "Evolution of Microstructure Across Eutectic Sn-Bi Solder Joints Under Simultaneous Thermal Cycling and Current Stressing," Journal of Electronic Materials, vol. 44 no. 1, pp. 597-603, Jan. 2015.

Zuo, Yong, Ma, Limin, Liu, Sihan, Wang, Ting, Guo, Fu, and Wang, Xitao, "The coupling effects of thermal cycling and high current density on Sn58Bi solder joints," Journal of Materials Science, vol. 48 no. 6, pp. 2318-2325, Mar. 2013.

Zuo, Yong, Ma, Limin, Wan, Ting, Qiao, Lei, Liu, Sihan, and Guo, Fu, "The effects of creep on electromigration behaviors in Sn-based Pb-free solder joints," 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, Aug. 11-14, 2013, pp. 784-788.

Zwolinski, Michael, Hickman, Julie, Rubin, Holly, Zaks, Yulia, McCarthy, Shaun, Hanlon, Thomas, Arrowsmith, Peter, Chaudhuri, Arun, Hermansee, Ralph, Lau, Steve, and Napp, Duane, "Electrically Conductive Adhesives for Surface Mount Solder Replacement," 1996 Surface Mount International Conference Proceedings, San Jose, CA, Sept. 10-12, 1996, pp. 391-401.

Zwolinski, Michael, Hickman, Julie, Rubin, Holly, Zaks, Yulia, McCarthy, Shaun, Hanlon, Thomas, Arrowsmith, Peter, Chaudhuri, Arun, Hermansen, Ralph, Lau, Steve, and Napp, Duane, "Electrically Conductive Adhesives for Surface Mount Solder Replacement," IEEE Transactions on Components, Packaging, and Manufacturing Technology-- Part C, vol. 19 no. 4, pp. 241-250, Oct. 1996.

Web Pages on Lead-Free, RoHS, and WEEE (revised 11/9/2020)

A "Lead-Free" Semiconductor Industry

About IBM's ECP program

Actel goes green on 100% of its FPGA products

Activists Push for Safer E-Recycling

Alternative to Lead-based Solders

Ampeg B-12-XY: Tin Whiskers!, Aug. 2, 2011.

Appendix

Apple and the Environment

Applying Surface Finishes

Are the military and telecommunications industries off the hook on RoHS?

Bleifrei Product Information

Business Issues

California State Board of Equalization (BOE)

Centopia Forum

"Concerned about "tin pest"," Circuitnet, June 11, 2006.

Controlling Lead Contamination Levels in a Mixed Alloy Hand Soldering Environments

Criteria for Lead-free Soldering Alloy

Database for Solder Properties with Emphasis on New Lead-free Solders Release 4.0

Brusse, Jay, Death by Zinc Whiskers, Youtube, Apr, 3, 2013.

Decision Tree

Directorate of Science, Technology and Medicine (DSTM) Chemical Sampling Information

Distributors could face prosecution for producer compliance failures

Dolby and the SMART Group Discussion Forum Thursday 15th May 2003

Don't Limit Your Analysis to the Lab Anymore!

Due Diligence

Dynamic WEEE & RoHS Developments

Electric Waste

Electrode Potential of Various Metals and Alloys

Electronic Waste Recycling Act of 2003 (SB 20)

Electronics Recycling Legislation in the USA & Canada - Actual and Pending

Elimination of RoHS Substances in Electronic Products

Enforcement

Environment Friendly Technology to Replace Cadmium Coatings

Environmental Information: RoHS and WEEE

Environmentally Friendly Green Package

EU TAC Defies Parliament to Press on with Exemptions

EUROPEAN UNION ELV, WEEE & ROHS DIRECTIVE COMPLIANCE

Facts

FAQ

FAQS

FAQ's

Flame Retardants FAQ

Flux and Solder Paste Considerations for Lead-Free Soldering

Frequently Asked Questions

Frequently Asked Questions

Frequently Asked Questions

Frequently Asked Questions

Galaxy VII Lost

General Pb (lead) Free Lead Finish/Plating - Frequently Asked Questions

Germanium

Government consultation papers on the WEEE & RoHS Directives

Government consultation papers on the WEEE & RoHS Directives

Green/Lead-Free Initiative

Green / Pb Free / Lead Free Packaging Technology Solution

Green Products

Green Products - the RoHS and WEEE Guideline

grey tin (tin pest) time-lapse video, Youtube, May 2, 2009.

Hand Soldering with Lead-free Alloys

Handling and Storing of Sn/Zn/Al Solder Paste

Harwin and the Elimination of Lead

Hazardous Materials in Electronic Components: Resources

Hex Chrome Is Also On The Hit List

Hexavalent Chromium

Hitachi has adopted the low-temperature (Drop-In) type of Lead-free solder alloy,

How to ensure RoHS compliance - XRF provides the answer

IDT: 99 percent lead free already

In the News

Index of Materials - A

Industry braces for the lead-free conversion

Information Technology (IT) and Telecommunication (Telecom) Waste in Canada

innovative xrf technology

Spiers, Simon, Inside an AF114 transistor with tin whiskers, Youtube, Jan. 24, 2015.

Internet Resources for Electronics free lead

IPC 1752 Compliant Component Databases

Iron

Japan Green Procurement Survey Standardization Initiative

Japan "RoHS": DCA Overview and Insights

JGPSSI released Survey Response Tools Ver.3.11 and the Second Edition of Manuals. (2006.06.13)

Just Say No to E-Waste: Background Document on Hazards and Waste from Computers

Launch Electronic Waste Recycling

Lead

Lead Free

Lead-Free Alloys

Lead Free Backgrounder

Lead-Free Component Finishes

Lead-free components/RoHS policies

LEAD-FREE Electronic Solder, Why?

Lead Free Electronics

Lead Free Environmental Counter Argument

Lead-Free Manufacturing in Virginia

Lead-free parts: Welcome to the messy supply chain

Lead Free PCB

Lead-Free Printed Circuit Board Finishes

Lead-Free Program Overview

Lead-free SMT

Lead Free Solder

"Lead-free solder and tin pests," finishing.com.

Lead-Free Solder FAQ's

Lead-Free Solder Initiative and Circuit Board Label FAQ's

Delserro, Gary, Lead Free Solder Reliability Issues and Test Methods

Lead Free Solder - Test Run

Lead-Free Solder Test - The Results...

Lead Free Soldering

Lead-Free Soldering Reports

Lead-Free Solutions

Lead-Free Solutions

Lead-free Technical Details and Frequently Asked Questions

Legislation

Logistics Issues

London Metal Exchange daily stocks and prices

Low Melting Point Phase

Making Grey Tin (tin pest), Youtube, Apr. 2, 2016.

Manufacturer's Lead Free Information & Documents

Manufacturing Issues

Material Composition Testing

Material-Process Management

Materials Issues

Mechanism of Tin Whisker Growth in Electronics

Brusse, Jay, Melting a TIN WHISKER Using a Volt/Ohm Meter, Youtube, May 3, 2012.

Metal & Metalloid Particulates in Workspace Atmospheres (Atomic Absorption)

Brusse, Jay, Metal whisker growing from the header/seal area of a package enclosure for a crystal, Youtube, Oct. 16, 2017.

Metal Whiskers from Sn-Ag-Cu Alloy Systems

Brusse, Jay, Metal Whiskers-Inspection Video #5: Transistor Package, Youtube, Nov. 21, 2009.

Brusse, Jay, Metal Whiskers-Optical Inspection #1, Youtube, Nov. 21, 2009.

Brusse, Jay, Metal Whiskers-Optical Inspection #2, Youtube, Nov. 21, 2009.

Brusse, Jay, Metal Whiskers-Optical Inspection Video #4, Youtube, Nov. 21, 2009.

Minerals Yearbook: Volume I. -- Metals and Minerals

Moisture Sensitive Device Control

Moisture Sensitive Devices

Moisture Sensitivity Level classifications

NASA Anecdote #1: 20 Years to Failure, June 9, 2008.

NASA Anecdote #2: Tin Whiskers on Waveguide, June 9, 2008.

NASA Anecdote #3: Field Failures Due to Tin Whiskers Breaking Loose from Matte Tin-Plated RF Enclosure Lids, June 9, 2008.

NASA Anecdote #4- Tin Whiskers on Shield of GPS Units, June 9, 2008.

NASA Anecdote #5: Field Failures Due to Tin Whiskers on Circuit Breaker Contacts, June 9, 2008.

NASA Anecdote #7: Tin Whiskers on RF Shield/Bracket, Aug. 3, 2009.

NASA Anecdote: Tin Whiskers Inside of AF114 Transistors, Aug. 3, 2009.

NASA Anecdote: Tin Whiskers on Bus Bars, Aug. 3, 2009.

NASA Anecdote: Tin Whiskers on Oscilloscope Probes (2007), Aug. 3, 2009.

NASA Basic Info/FAQ, Jan. 17, 2019.

NASA Experiment 2, June 16, 2009.

Kadesch. Jong S., NASA Goddard Space Flight Center Effect of Uralane Conformal Coating on Tin Whisker Growth, Apr. 20, 2005.

NASA Goddard Space Flight Center Electromagnetic Relay Manufacturer Survey , Apr. 20, 2005.

NASA Goddard Space Flight Center Experiment #2 Photo Gallery, Apr. 20, 2005.

NASA Goddard Space Flight Center Experiment 1, Apr. 20, 2005.

NASA Goddard Space Flight Center Experiment 3, Apr. 20, 2005.

NASA Goddard Space Flight Center Experiment 4, Apr. 20, 2005.

NASA Goddard Space Flight Center Experiment 5, Apr. 20, 2005.

NASA Goddard Space Flight Center Experiment 6: Simulation of Whisker Growth , Apr. 20, 2005.

NASA Goddard Space Flight Center Experiment 7: Matte Tin Plated IC Leadframe Examination, Apr. 20, 2005.

NASA Goddard Space Flight Center Photo of the Month, Apr. 20, 2005.

NASA Goddard Space Flight Center Re-emergence of an Old Problem with Potentially Catastrophic Consequences, Apr. 20, 2005.

NASA Goddard Space Flight Center Specification Language Related to Pure Tin , Apr. 20, 2005.

NASA Goddard Space Flight Center Summary of Specification Language for Pure Tin, Apr. 20, 2005.

NASA Goddard Space Flight Center Tin Whisker Photo, Apr. 20, 2005.

NASA Goddard Space Flight Center Tin Whisker Photo, Apr. 20, 2005.

NASA GOLD Whiskers, Feb. 22, 2007.

NASA GOLD WHISKERS: Introducing a New Member to the Family, Feb. 22, 2007.

NASA GSFC Experiments, Feb. 22, 2007.

NASA Literature References, Aug. 11, 2020.

NASA Metal "Dendrites" are NOT the Same as Metal "Whiskers", Feb. 22, 2007.

NASA Metal Whiskers from Sn-Ag-Cu Alloy Systems, July 14, 2008.

NASA Other Metal Whiskers, Jan. 4, 2016.

NASA Photo Gallery, May 8, 2012.

NASA Photo of the Month Archives December 2003 Sn-Pb Whiskers, Feb. 5, 2009.

NASA Related Links, Feb. 22, 2007.

NASA SILVER WHISKER Photo Gallery, Feb. 5, 2009.

NASA Tin Whisker (and Other Metal Whisker) Homepage, Aug. 2020.

NASA Tin Whisker Anecdote: Swiss Radio & Telephone, June 9, 2008.

NASA Video Gallery.

NASA What's New, Jan. 24, 2011.

NASA Whisker Anecdotes, Jan. 17, 2019.

NASA Whisker Failures, Aug. 3, 2009.

NASA Zinc Whiskers on Raised Floor Tile Structures Photo Gallery, Feb. 22, 2007.

NASA Zinc Whiskers on Zinc-Plated Steel Bus Rail, Feb. 22, 2007.

NEMI RoHS/Pb-Free Summit

Next Generation of Lead-free Solder : Sn/Zn/Al Alloy

NEW LAW, NEW FRIDGE MOUNTAIN - TIME TO CLEAN UP, Computer equipment gets "waste" high

NIOSH Safety and Health Topic: Hexavalent Chromium

NMFRC OSHA Hexavalent chrome PEL page

No Lead / Lead Free Soldering Information and Resources

Nu Horizons Electronics Corp. Lead-Free Information

Official Directive Documentation

Part 22: Lead-free solder

PartMiner's Hazardous Material Content Initiatives

Pb-Free Readiness Assessment(C)

Pb-Free / RoHS

Periodic Table of the Elements Atomic Radius

Phase Diagrams & Computational Thermodynamics

Physical Properties of Sn/Zn/Al and Sn/Pb

Smit, David, "Pipemaking Metal Pipes - Part I: Metallurgy,"

Plating

Preliminary Guidance for Optical Inspection for Metal Whiskers

Presentations & Reports

Press Release - RoHS Screening Service Announced

Press Releases on AVX Lead Free Products

Printed Wiring Boards

Procedures for the Determination of Levels of Regulated Substances in Electrotechnical Products

Producers / Importers - B-to-B

Producers / Importers - Do you want to know more ...

Producers / Importers - General

Producers / Importers - Key Elements

Producers / Importers - Our Advice

Producers / Importers - Your Options

Products and the Environment Database

Progress on lead-free components spotty

Publication of Guidelines for the Management of Chemical Substances in Products Ver. 1.1 (Dec. 14, 2006)

Pure Tin Plating Prohibition

'Put on the market'

'Put on the market'

Questions & Answers

Reducing tin whisker related failures in electronics, Youtube, Mar. 31, 2017.

References

Requirements for Suitable Lead-Free Alloys

Restricted elements and their typical uses

Restriction of Hazardous Substances Directive

Reworking Lead-free PCB Assemblies

RoHS and Lead-Free Research Center

RoHS Compliant Finishes

RoHS Directive

RoHS Directive: Facts

RoHS Directive: FAQ

RoHS Directive: Lead

RoHS Directive: RoHS

RoHS Directive: WEEE

RoHS Facts

RoHS/Lead Free Status

RoHS Report

RoHS : Restriction on Hazardous Substances Pb-Free : Lead-Free components and Q&A

Round Robin Testing and Analysis Lead-Free Alloys Tin, Silver and Copper

Semiconductor Packaging: Lead Finish

Services - Benchmarks

Services - Technical Projects

Shipbuilders Council of America

Silver

Sn/Zn/Al Solder Paste

Solder

Solder Alloy Selection

Solder and Solderability Measurements for Microelectronics

Solder FAQs

Solder Joint Reliability

SOLDERING FLUX

Solderpaste and Flux Solutions For Lead-Free Processes

Solders - What are the important issues relating to lead-free solder?

Soviet ILS teardown with a tin whiskers surprise, Youtube, Nov. 27, 2015.

Standard Products - Product Information - Lead-Free Products

Summary of Legislation, Regulations and Directions

Suppliers Ready for Lead-Free, But Balk at New Part Numbers

Surface Finish Technologies

Table of Specialty Alloys and Solders

TAC votes on RoHS Exemptions

TEERM Active Project

The ABCs of Lead-Free in Electronics Manufacturing: Oct 8, 2004 Webcast

The Allied RoHS Knowledge Center

The business implications of RoHS, WEEE and ELV

The issue of lead-free solder and its impact on the local electronics industry

The Lead-Free Solder Project ~ Project Documents

The Most Frequently Asked Questions on Lead-free

The need for Pb-free electronics

The Road to Lead-free Soldering (for PCB mounting)

The RoHS & WEEE Directives - A progress report...

The Soldertec RoHS screening test service

The WEEE and RoHS Directives

The Wheelie Bin Logo

Think Green

Tin - A Metal That DESTROYS ITSELF!, Youtube, Aug. 12, 2017.

Tin Pest

tin pest, Youtube, May 4, 2009.

Dr. Ron, "Tin Pest in Medieval Culture," Aug. 13, 2020.

Tin pest in tensile sample of lead-free solder

tin pest, transformation of beta tin into alpha modification (grey tin), Youtube, May 3, 2009.

Tin Plague

Brusse, Jay, Tin Whisker Growth Kinetics, Youtube, Nov. 21, 2009.

Tin Whisker Testing

Murray, Charles, Tin Whiskers Again Cited as Potential Problem for Toyotas, DesignNews, July 25, 2012.

Brusse, Jay, Tin Whiskers-Dsub Connector Shell, Youtube, Nov. 21, 2009.

Spiers, Simon, Tin whiskers inside a AF117 transistor, Youtube, Jan. 6, 2014.

Brusse, Jay, Tin Whiskers Inside Electromagnetic Relay, Youtube, Nov. 21, 2009.

Brusse, Jay, Tin Whiskers on Card Guides, Youtube, Nov. 21, 2009.

Brusse, Jay, Tin Whiskers on Electromagnetic Relays, Youtube, Nov. 21, 2009.

Brusse, Jay, Tin Whiskers on Lincoln's Beard, Nov. 25, 2009.

Brusse, Jay, Tin Whiskers on Terminal Lugs, Youtube, Nov. 21, 2009.

Brusse, Jay, Tin Whiskers on Variable Air Capacitor, Youtube, Nov. 21, 2009.

"Tin Whiskers with Special Morphology"

Tin World

Toxics in Electronics

Trouble looming over RoHS ban exemptions

Tutorial 45: Lead-Free Facts and Myths

Tutorial 48

UK - DTI update on RoHS and WEEE - Thursday 24th March 2005

Video showing Tin Whiskers, Youtube Oct, 5, 2015.

Waste Electrical and Electronic Equipment

Waste from Electrical & Electronic Equipment

Wave Solder Assembly Materials

Wave Solder Process Considerations & Set-up for Lead Free

Wave Soldering with Lead-free Alloys

WEEE

WEEE Facts

WEEE/RoHS Quality Control Screening & California Proposition 65

Welcome to the Open-Source Unified Eco-Compliance Declaration (ECD) Exchange Form Website

What are some of the pitfalls I should anticipate?

What happens to WEEE now?

What type of XRF will work for my RoHS/WEEE compliance testing?

What's driving the move to lead-free solder processes?

What's so special about Cadmium Plating?

Whisker growth over a 12 minute period

Whisker growth over a 19 minute period

Whisker (metallurgy)

Whiskers in germanium transistors etc

Zinc and Cadmium Whiskers

Zinc whisker induced failures in electronic systems

Kushner, Arthur S., "Zinc Whiskers," Products Finishing, Dec. 1, 2000.

Zinc "whiskers"

Zinc "whiskers", page 2

Brusse, Jay, Zinc Whiskers- Hot Dip Galvanized Pipe, Youtube, Nov. 21, 2009.

I would like to thank Anders Andrae, Jim Bacher, Walt Beltz, Roger Bilham, Paul Black, Olaf Bloemker, Jay Brusse, John Burke, Tom Byrnes, Jeff Caldwell, Toby Carrier, Jan Carver, Eric Chason, Keming Chen, Ann Cibelli, Larry Collier, Gordon Davy, MA/NY DDave, Judy Dooley, Scott Douglas, Barrie Dunn, Werner Engelmaier, David Fish, Ray Franklin,Bill Frohoff, Genny Gibard, Brian E. Greene, Alex Grigg, Jens Gruse, Gerhard Haubner, Keith Hardin, Liz Harriman, Nicoletta Mattioli Hary, Carolyn Herel, John Highet, David Hillman, Nitin Jadhav, Chris James, Dan Kallin, Victor Karpov, Ed Kelley, Jim L. Knighten, Tim Kunkel, Bob Landman,Ron Lasky, Mark Laurer, Mark Myles, Pascal Oberndorff, Oscar Overton, Lyudmyla Panashchenko, Chris Robertson, William P. Rollins, George Rugilla, Dongkai Shangguan, Eric Simler, Lou Simpson, Pratap Singh, Roland Sommer, Valerie St. Cyr, Roger Stoops, Peter L. Tarver, Jim Taylor, John Taylor, Fred Verdi, Paul T., Vianco, James Vincent, Jerome Wagner, and John Woodgate for contributing to this study.

I would also like to thank Auburn University, Big Sandy Community and Technical College: Mayo, Boston University, California State University - Long Beach California State University - Los Angeles Carnegie Mellon University, Chicago Public Library, Colorado School of Mines, Florida Atlantic University, Florida International University, Florida State University, Georgia Institute of Technology, Iowa State University, Kansas State University, Kansas University, Lamar University, Lexington Public Library, Lexmark International, Linda Hall Library, Massachusetts Institute of Technology, Michigan State University, Missouri University of Science and Technology Montana Tech of the University of Montana, Northeastern University, Northwestern University, Ohio State University, Portland State University, Purdue University, Rice University, Robust Electronic Design, Ryerson University, San Diego State University, Southern Illinois University - Carbondale, Southern Illinois University - Edwardsville, Southern Methodist University, Tufts University, University of Arkansas, University of California at Irvine, University of California at San Diego, University of Central Florida, University of Cincinnati, University of Colorado - Boulder, University of Dayton, University of Evansville, University of Florida, University of Hawaii at Manoa, University of Iowa, University of Kansas, University of Kentucky, University of Louisville, University of Miami, University of Michigan, University of Nebraska - Lincoln, University of North Carolina at Charlotte, University of Oklahoma, University of Pittsburgh, University of San Diego, University of Souther California, University of Tennessee, University of Texas at Austin, University of Texas at Dallas, University of Toledo, University of Toronto, University of Utah, University of Washington, University of Waterloo, Vanderbilt University, Washington University in St. Louis, and Wayne State University for letting me use their libraries for this research.

dBi Corporation was a one-man test house (testing laboratory) based in Lexington, Kentucky, testing a wide variety of commercial electronic products for electromagnetic compatibility (EMC), electromagnetic interference (EMI), and electrostatic discharge (ESD) under its ISO 17025 accreditation. dBi was founded in Winchester, Kentucky in 1995 by Donald R. Bush, shortly after he retired from 30 years service with IBM Lexington's/ Lexmark's EMC Lab. John R. Barnes, who'd worked with Don at IBM Lexington and Lexmark, bought dBi in 2002 after Don's death, and moved the company to Lexington, Kentucky. John closed dBi at 11:59pm EDT on September 30, 2013, because ObamaCrap had increased operating expenses to the point that we could no longer afford to remain in business.

We'd like to thank all of the clients who chose dBi to test their products from 1995 to 2013. Below is a brief summary of our accomplishments during the 18 years we were in business.

From 1995 to 2001, under Don Bush's ownership and operation, dBi:

From 2002 to 2013, under John Barnes' ownership and operation, dBi:

Go to Main Web Site Index Go to Full Standards Index Go to ITE Standards Index Go to Residential/ Commercial Standards Index Go to Industrial Standards Index
Go to Lab Equipment Standards Index Go to Audio/ Video Equipment Standards Index Go to Lamps/ Luminaires Standards Index Go to Appliance Standards Index
Last revised February 5, 2021