My plan was to write a Chapter 20.5 for my books, in the form of a web page that would be freely-available, summarizing the:
In late 2012, 6 years after the RoHS Directive went into effect on July 1, 2006, manufacturers finally seemed to be approaching the quality level (good out-of-the-box) we had up through late 2005 with tin/lead-based electronics. But the reliability and longevity of RoHS-compliant electronics are still pitiful compared to what we had with tin/lead-based electronics. I've heard many stories of RoHS-compliant electronics, purchased new with 1-year warranties, that died after just 13 months of use. With a lot of searching, we sometimes can find new electronic products with 3-year manufacturers' warranties. But they are rare-- 90-day and 1-year manufacturers' warranties are much more common nowadays. And 4 out of the last 5 ADSL modems that I've gotten from the phone company all crapped out between 11 and 14 months after they were installed-- *one* lasted 25 months.
I had to change my Internet provider in October 2016. After making sure that the modem I've been using since June 21, 2016 worked with my new ISP, I bought it from my previous ISP as a used unit. And I bought two more of these (used) ADSL modems on Ebay for about $25 each. When this modem crapped out at 11-1/2 months, it took me just minutes to install a spare modem. But several critical parameters were hidden in low-level menus (and weren't documented in my notebook). So it took me a couple of hours with the old modem-- which was fully functional *except* for connecting to the Internet-- to get the spare ADSL modem working with my ISP. Basically, I had my Internet connection working again in one evening. And the very next day another one of these ADSL modems showed up on Ebay, so I bought it to get back to 2 spares for this RoHS-compliant product!
In the 16 years since I started this study in late 2004, I've:
In this mass of material I have found tens of thousands of references to failure modes of lead-free solders, that were unknown or extremely rare in tin/lead solders:
Based on my reading, and years of helping clients develop RoHS-compliant electronic products, I believe that: If you buy a lead-free RoHS-compliant electronic device-- and if it works when you first turn it on-- it should be safe and fully-functional for at least one year. If you are lucky, it may even last a couple of years longer... versus the 20+ years use that we can easily get out of many tin/lead-based electronic products!
For myself and my companies, in early 2005 I adopted the following version
of the "Precautionary Principle", which so far has worked very well for
me:
Thus I have been very selective about buying any electrical or electronic stuff since year-end 2005. If I can find what I want as used, refurbished, or "new old stock" (NOS) on ebay or at a hamfest-- manufactured before 2006 (when the RoHS Directive went into effect)-- I feel comfortable just going ahead and buying it. If what I want is only available as new items, manufactured since the beginning of 2006, I do some hard thinking: Do I absolutely need this item? Will it pay for itself within the first three months that I will own it? Or do I just want the item? In many cases I'll say "Screw it. I'm not going to waste my money on lead-free crap". If I still really need the item, I will investigate various candidates based on the features/ functions/ etc. that are important to me, and sort the list by key factors to determine the desireability of each candidate. And if I discover that a candidate was designed or made in Europe, it automatically goes to the bottom of the list. Then I start working down through the list, top-to-bottom, checking for availability, sources, and prices. Once I have found three or so good candidates, I dig up all the information that I can find about them: specifications, datasheets, manuals, warranties, application notes, people's comments/ complaints about them, etc., If several candidates look like they will meet my needs, I usually make my final choice based on:
As a result, when I am considering buying some new electronic item, or something such as a car or appliance that contains electronics, I usually spend about 1 day doing research for every $100 that I expect to spend.
In July 2011 (5 years after the RoHS Directive went into effect), I made my first purchase of over $50 worth of RoHS-compliant electronics. I didn't want to, but when my 12-year old main computer monitor (a Sony Trinitron GDM-500PS) crapped out, I didn't have much choice. I first went to the public library, and checked Consumer Reports going back 3 years. Acer, Apple, Dell, Lenovo, and ViewSonic all had 2 or more wide-screen LCD monitors that were given high marks by Consumer Reports. Then I went around town, checking local stores to see which brands/models they carried. I then spent 4 days, researching some 50 models of >= 21-inch LCD monitors on the stores' and manufacturers' web sites. Comparing the features of the different models, the decisive factors for me came down to overall width, manufacturer's warranty period, and whether the monitor came with the video and monitor cables. I came down to a "short list" of 5 ViewSonic monitors, any one of which would meet my needs very well. Then I called the local stores, and found one which had several ViewSonic VX2450wm-LED monitors in stock. I bought two of them, with 3-year manufacturer's warranty, for $400 plus sales tax. It took me about an hour to get both monitors installed on my computer and working at 1920 x 1080 resolution (the primary monitor at 24-bit color and the secondary monitor at 16-bit color). So far, both monitors have been working okay for five years. But we shall see how they do long term for reliability and longevity...
Maybe 1% of the documents that I have collected on these subjects say "Lead is bad. Remove it at any cost." (I've seen estimates that complying with the RoHS Directive will cost between $40,000,000,000 and $100,000,000,000 worldwide, and will cause 5 to 6 times as much environmental damage as if it had not been enacted.) About half of the documents say "here are ways that we can try to comply with the RoHS Directive and its clones, by investing huge amounts of engineering and manufacturing time, money, and management focus." But the gist of the rest of the documents that I have collected is:
Manufacturers of lead-free/ RoHS-compliant electronics-- and their lawyers-- may want to carefully study Article 7 in the European Product Liability Directive ( Directive 85/374/EEC + Directive 1999/34/EC) which offers this defense: "The producer shall not be liable as a result of this Directive if he proves... (d) that the defect is due to compliance of the product with mandatory regulations issued by the public authorities... "
The RoHS Directive has been in place for 14 years now, and so far I haven't read about any big fires, airplane crashes, or other major disasters that have been traced to lead-free electronics. Although there is now considerable evidence pointing to tin whiskers causing some of the Sudden Unintended Accelleration (SUA) problems with Toyota vehicles....
Technology Forecasters did a study in late 2007/early 2008 for the Consumer Electronics Association (CEA) on "Economic Impact of the European Union RoHS Directive on the Electronics Industry". Page 48 of this report, which came out January 21, 2008, said that in its first 1-1/2 years the RoHS Directive had cost the worldwide electronics industry $38.25 billion ($38,250,000,000), with an on-going cost of $3.7 billion ($3,700,000,000) per year!
Personally, since the RoHS Directive went into effect, I've restricted myself to buying maybe two or three pieces of new test equipment or computer stuff that costs more than $20 each per year. But I only do so if I expect the item to pay for itself within 3 months. I also treat all new electronics very tenderly, and try not to drop them onto any hard surfaces. If this new equipment is AC powered, I only plug it into a live outlet when I or someone else is around. If it is battery powered, I take out the batteries whenever the new electronic equipment is not in use. (These precautions play hell with clocks, by the way.) If the item costs less than $20, I'll probably buy three or more, to have a fighting chance that at least one unit will work when I need it.
Early in my study, I decided to pull this information together as a web page, to make it:
In January 2016 I became a Donovan Scholar, and started taking classes at the University of Kentucky (UK). Then UK moved the Engineering Library from Anderson Tower, making it much less convenient for me to stop in the library before/between classes. But as a UK student I have online access to the UK libraries from home. Before the COVID-19 lockdown of 2020, I would spend 4 to 8 evenings per month checking 128 to 221 magazines/ journals and the proceedings of 136 to 200 conferences/ symposiums for the latest information on:
During the COVID-19 lockdown, I've been working on my studies via the Internet, usually spending about 6 days per week on them. And in the last 9 months (mid-May 2020 to February 2021) I've found over 1,863 additional documents on tin whiskers, tin pest, and other aspects of lead-free electronics. At least this project has kept me from going stir crazy with boredom!
This bibliography now has:
If a reference can be downloaded from the Internet for free, I've included a link from its title to the appropriate web page. Some web sites require you to register online before accessing some of their documents. If a book, CDROM, paper, or report is in print, I show the list price and include a link to at least one source. Even if an item is out of print, you might be able to buy it from one of the sources listed on my web page Internet Sources for Electronics Books, Standards, Manuals, Journals, and Magazines.
My web page, Designing Lead-Free, RoHS-Compliant, and WEEE-Compliant Electronics, where I started to summarize this huge mass of data, is 55 pages long-- with only 4 out of 20 sections reasonably complete. Like my books, both of these web pages are primarily aimed at electrical and electronic engineers who design and develop electronic products and electronic equipment for a living. We face more challenges than ever before:
Government Regulations on Lead-Free, RoHS, and
WEEE (revised 9/11/2011)
The European Union has very strict laws on product liability. In general, if a person can prove that someone was killed or injured-- or their property was damaged-- by a product, the "producer" must fully compensate the injured party. Even if the producer had only a tiny fraction of the overall responsibility for the injury! Underlaying numerous Product Safety Directives (EN 60950, EN 60065, EN 61010, and EN 60601-1-2 to name just a few) is the Product Liability Directive ( 85/374/EEC), which was published in volume 28 issue L210 pages 29-33 of the Official Journal of the European Union (OJ) on August 7, 1985.
This Directive was amended by Directive 1999/34/EC in volume 42 issue L141 pages 20-21 of the OJ on June 4, 1999. The consolidated text of these two Directives is available on the EUR-Lex website. One defense that the producer (manufacturer, importer, or the person whose name or trade mark is on the product) can use is in Article 7: "The producer shall not be liable as a result of this Directive if he proves... (d) that the defect is due to compliance of the product with mandatory regulations issued by the public authorities... "
Japan passed the Act on the Promotion of Effective Utilization of Resources Act No. 48 of 1991 (Japan "RoHS") in 2000.
The European Union published the End of Life Vehicles Directive (ELV Directive, 2000/53/EC) in volume 43 issue L269 pages 34-42 of the Official Journal of the European Union (OJ) on October 21, 2000, and has amended it a number of times since then, This Directive took effect on July 1, 2002, and with some exceptions (Annex II), totally bans the use of (Article 4.2(a)):
The European Union published the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Directive ( RoHS Directive, 2002/95/EC) in volume 46 issue L37 pages 19-23 of the Official Journal of the European Union (OJ) on February 13, 2003. This Directive took effect on July 1, 2006, and with some exceptions (Annex) totally bans the use of (Article 4.1):
Article 2.3 explicitly states that spare parts for the repair of electrical and electronic equipment put on the market before July 1, 2006 do not fall under the RoHS Directive. Nor does the reuse of electrical and electronic equipment put on the market before July 1, 2006. I.e., the electrical equipment is already in the European Union, and out of the manufacturer's control as of July 1, 2006. Owners of equipment acquired before this date may repair or upgrade their equipment, to extend its lifetime, instead of being forced to discard it.
Council Decision COM(2004) 606, adopted Sept. 23, 2004), amends the Annex of the RoHS Directive to permit-- in any application that was not already exempted--a homogenous material to contain a maximum of:
The European Union published the RoHS Recast (RoHS 2.0), Directive 2011/65/EU in volume 54 issue L174 pages 88-110 of the Official Journal of the European Union (OJ) on July 1, 2011. It takes effect on January 3, 2013, and brings in:
To help manufacturers, importers, and others understand their responsibilities, risks, and liabilities under European Directives, in 2000 the European Commission published the "Guide to the Implementation of Directives Based on New Approach and Global Approach". This is commonly called the "Blue Book", or "Blue Guide", and can help you understand just how European authorities will interpret these Directives when it is unclear whether/how a Directive applies to a specific product or situation.
The DTI has published a draft of the United Kingdom's version of the RoHS Directive as "Part IV - The RoHS Directive - draft implementing Regulations."
The official version of the UK law came out as Statutory Instrument 2006 No. 1463,
The DTI has also published draft Guidance Notes for the RoHS Directive, dated July 2004.
A revised draft RoHS REGULATIONS Government Guidance Notes came out in August 2005.
The final RoHS REGULATIONS Government Guidance Notes came out in November 2005.
The DTI published the RoHS Enforcement Guidance Document, Version 1 in May 2006.
The European Union published the Waste Electrical and Electronic Equipment Directive (WEEE Directive, 2002/96/EC) in volume 46 issue L37 pages 24-38 of the Official Journal of the European Union (OJ) on February 13, 2003. Directive 2003/108/EC, published in volume 46 issue L345 pages 106-107 of the OJ on December 31, 2003, amends Article 9 of the WEEE Directive with regard to the financing of WEEE for businesses. The WEEE Directive:
.
The DTI has also published draft Guidance Notes for the WEEE Directive, dated July 2004. According to these Guidance Notes, producers must register with the (UK) National Clearing House by August 13, 2005 (pages 4, 20-21).
Commission Decision 2004/249/EC is a questionaire for Member States of the EU, on reporting the implementation of the WEEE Directive.
Commision Decision 2005/369/EC on rules for Member States to monitor compliance with the WEEE Directive.
The European Union also bans many flame retardants that might be used in printed circuit boards (PCB's) under the Restrictions on the Marketing and Use of Certain Dangerous Substances and Preparations Directive (Directive 76/769/EEC) which has been amended 39 times since it was published in the Official Journal of the European Union (OJ) on September 27, 1976.
The European Union published the Batteries and Accumulators Containing Certain Dangerous Substances Directive (Battery Directive, 91/157/EEC) in volume xx issue L78 pages 38-41 of the Official Journal of the European Union (OJ) on March 26, 1991. Directive 98/101/EC, published in volume 42 issue L1 pages 1-2 of the OJ on January 5, 1999, clarifies the limitations on mercury in batteries. The Battery Directive permits lead-acid and nickel-cadmium batteries to be used in electrical and electronic equipment as long as they contain less than 0.0005% by weight of mercury. Button cells and batteries made from button cells are permitted to contain up to 2% mercury by weight (Article 3.1).
The European Union published the Energy-using Products (EuP) Directive (EuP Directive, 2005/32/EC) in Volume 48 issue L191 pages 29-58 of the Official Journal of the European Union (OJ) on July 22, 2005. This Directive took effect on August 11, 2005. It sets up a framework for regulating products that:
The European Union published a new Batteries and accumulators and waste batteries and accumulators (new Batteries Directive, 2006/66/EC) in volume 49 issue L266 pages 1-14 of the Official Journal of the European Union (OJ) on September 26, 2006. This Directive takes effect on September 26, 2009. Article 4 places limits on the mercury (Hg) and cadmium (Cd) content of batteries, but most of the Directive is concerned with collecting and recycling.
China's Ministry of Information Industry has drafted a Management Methods for the Prevention and Control of Pollutants from Electronic Information Products law, often referred to as "China RoHS ". This law also bans:
Grace Lin's web site has an unofficial translation of "Administrative Measure on the Control of Pollution Caused by Electronic Information Products," dated Mar. 2, 2006.
China RoHS actually consists of several interconnected laws: "Measures for Administration of the Pollution Control of Electronic Information Products," May 9, 2006.
Another unofficial translation by the AeA is Management Methods for Controlling Pollution by Electronic Information Products."
"Electronic Information Products Classification and Explanations," Mar. 16, 2006.
"General Rule of Environment-Friendly Use Period of Electronic Information Products, Draft,"
"Marking for Control of Pollution Caused by Electronic Information Products," Nov. 6, 2006.
"Packaging Recycling Marks," Jan. 1, 2002.
"Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products," Nov. 6, 2006.
"Testing Methods for Regulated Substances in Electronic Information Products, Draft,"
California passed Proposition 65, the Safe Drinking Water and Toxic Enforcement Act of 1986 in 1986. This act affects companies who:
California adopted Senate Bill No. 20 (SB20) on September 25, 2003, banning the use of certain materials in some types of electronic equipment, and setting up a system for the collection and recycling of certain types of electronic waste.
California adopted Senate Bill No. 50 (SB50) on September 29, 2003, amending SB20 in a number of areas, but the combination is usually still referred to as "SB20". SB20 and SB50 create a number of bureaucratic hurdles and snares for anyone who sells-- or wants to sell-- video display devices with screens larger than 4 inches diagonal (with some exceptions, SB50, pages 9, 11; SB20, page 9) to consumers in California:
California Legal Council's digest of SB50, on page 2, (3) says "The act requires each manufacturer of an electronic device who sells a covered electronic device in this state to submit an annual report to the board on the number of electronic devices sold by the manufacturer". On page 6, 25214.10.1 specifies the information that a manufacturer must suppy to retailers and the State Board of Equalization. On page 9, 42463(f) defines the "covered electronic devices". On page 10, 42463(n) defines "manufacturer". On page 11, 42463(t) defines "video display device". On pages 11 and 12, 42464.6(a) gives the Department of Toxic Substances Control the authority to determine what is, or is not, a "covered electronic device". On pages 13 and 14, 42465.2 specifies the information that the manufacturer must supply to the California Integrated Waste Management Board, consumers, and the Department of Toxic Substances Control.
For the actual implementation of SB20 and SB50, California's Health and Safety Code Section 25214.9-25214.10.2, under 25214.10(a) effectively bans lead, cadmium, mercury, and hexavalent chromium in "covered electronic devices" to the limits permitted by the RoHS Directive by January 1, 2007, or the effective date of the RoHS Directive, whichever comes later.
Furthermore, California's Public Resources Code Section 42463, 42463(f) defines "covered electronic device", 42463(n) defines "manufacturer", and 42463(t) defines "video display device".
California's actual regulations implementing SB20 and SB50 are in Emergency Regulations. 18660.5(23) has this snare for manufacturers-- "These catagories include, but are not limited to, (my italics) ...". 18660.41 specifies information that manufacturers must report to the California Integrated Waste Management Board, while 18660.42 specifies information that manufacturers must provide to consumers.
Washington passed Engrossed Substitute House Bill 2488 (EGHB2488) on March 29, 2004 to establish a statewide recycling system for waste electronics.
Maine adopted LD 743 (amended by HP 549) on May 14, 2003. This law bans disposal of CRT's in landfills after January 1, 2006.
In late 2005/ early 2006 Maine adopted an electronic waste law under 38 MRSA Section 1610 to establish a statewide recycling system for waste electronics.
Massachusetts, under 310 CMR 19 paragraph 19.017(3)(c), has not permitted cathode ray tubes (CRT's) to be deposited in landfills, or incinerated, since April 1, 2000.
Minnesota adopted H.F. No. 882 in 2003. This law bans disposal of CRT's in landfills after July 1, 2005.
Maryland adopted House Bill 575 on May 10, 2005. This law requires computer manufacturers that manufactured more than 1,000 computers per year, averaged over the last three years, to register with the (Maryland) Department of the Environment if they wish to sell new computers in the state after December 31, 2005. The initial registration fee is $5,000. The registration fee then drops to $500 per year if the manufacturer has implemented a "computer takeback program". Otherwise the registration fee continues at $5,000 per year. This law will expire December 31, 2010 unless it is renewed by the legislature.
Magazines/Newsletters on Lead-Free, RoHS, and WEEE
(revised 3/29/2005)
Electronics Manufacture and Test
Journal of Electronic Materials
LEAD-FREE Connection $195/year, published quarterly.
Soldering & Surface Mount Technology
Mailing Lists on Lead-Free, RoHS, and WEEE (revised
5/27/2009)
Leadfree mailing list for subscription; also see IPC LeadFree Archives
NoLeadTech mailing list for subscription; also see IPC NoLeadTech Archives
RoHS for subscription
Database for Solder Properties with Emphasis on New Lead-free Solders Release 4.0
Eco-Info & Lead (Pb)-Free: Lead (Pb)-Free Solutions from Texas Instruments
Electronics Manufacturing Productivity Facility
Infopool - On-line Information Resource about Lead-free Solders and Technologies
International Conference on Lead Free Electronics "Towards implementation of the RHS Directive"
International National Electronics Manufacturing Initiative (iNEMI)
Lead-free & RoHS Directive compliance services
Lead-Free Solder Testing for High Reliability (Project 1)
Lead-Free Solutions: Making Lead-Free a Reality Today
NASA-DOD Lead-Free Electronics (Project 2)
NASA Goddard Space Flight Center Tin Whisker (and Other Metal Whisker) Homepage
National Electronics Manufacturing Initiative (NEMI)
National Metal Finishing Resource Center
Printed Wiring Board Resource Center
RoHS Simplified (Department of Trade and Industry).
Speedline Technologies White Papers
Texas Instruments Quality & Pb-Free
Toxics Use Reduction Institute
ASM Engineered Materials Reference Book. Metals Park, OH: ASM International, 1989. ISBN 0-87170-350-5.
Electronic Materials Handbook, Volume 1: Packaging. Materials Park, OH: ASM International, 1989. ISBN 0-87170-285-1. $140.00 list price.
Equilibrium Data for Tin Alloys. Greenford, Middlesex, UK: Tin Reasearch Institute, 1949.
Handbook of Aluminum, 3rd Edition. St. Louis, MO: Metal Goods Service Centers.
Materials Used for Brazing Welding, Soldering Arc Cutting, and Metallizing. Department of the Army Technical Manual TM 9-237/1. Department of the Air Force Technical Order TO 34W4-1-10. May 1960.
Metal Statistics 1998, Nonferrous Edition, 90th Edition. New York: Cahners, 1998. $95.00 list price.
Metals Handbook, 1939 Edition. Cleveland, OH: American Society for Metals, 1939.
Metals Handbook, 9th Edition, Volume 2: Properties and Selection: Nonferrous Alloys and Pure Metals. Metals Park, OH: American Society for Metals, 1979.
NIOSH Pocket Guide to Chemical Hazards. Kutztown, PA: Hazardous Materials Publishing, 1994.
Rational Use of Potentially Scarce Metals. Brussels, Belgium: NATO Scientic Affairs Division, 1976.
Solder Alloy Data: Mechanical properties of solders and soldered joints. International Tin Research Institute, 1986 (I.T.R.I. Publication No. 656).
Soldering Manual. New York: American Welding Society, 1959.
The Lead Free Electronics Manhattan Project - Phase I. ACI Technologies, July 30, 2009.
The Lead Free Electronics Manhattan Project - Phase II. The Benchmarking and Best Practices Center of Excellence, May 31, 2010.
The Mechanism of Phase Transformation in Metals. London: The Institute of Metals, 1956.
The New Quick Pocket Reference for Tin-Lead and Lead-Free Solder Assembly. Cranston, RI: AIM, 2008.
The Properties of Tin. Greenford, Middlesex, England: Tin Research Institute, 1954.
The Quick Pocket Reference for Solder Assembly. Cranston, RI: AIM, 2000.
The Quick Pocket Reference for Tin-Lead and Lead-Free Solder Assembly. Cranston, RI: AIM, 2008.
Soldering Manual. New York: American Welding Society, 1959. pp. 52.
The Welding, Brazing, and Soldering of Copper & Its Alloys . Radlett, Herts.: Copper Development Association, 1952.
Abbott, David, Inorganic Chemistry. London: Mills & Boon, 1965.
Addison, W. E., The Allotropy of the Elements. London: Oldbourne Press, 1964.
Allen, B. M., Soldering and Welding. New York: Drake, 1975.
Andrae, A. S. G., Global Life Cycle Impact Assessments of Material Shifts: The Example of a Lead-free Electronics Industry. London: Springer, 2010. ISBN 978-1-84882-660-1. $129.00 list price.
Andrews, D. R., Soldering Brazing Welding and Adhesives. The Institution of Production Engineers, 1978.
Antler, Morton, Contact Technology for Electronic Connectors. (lecture notes for a class given at Lexmark International on May 15-16, 1996).
Aristotle (translated by Dowdall, L. D.), The Works of Aristotle Translated into English: de Mirabilibus Auscultationibus. Oxford: Clarendon Press, 1909. pp. 834 (chapter 50, page 27 of the .pdf file).
Avner, Sidney H., Introduction to Physical Metallurgy. New York: McGraw-Hill, 1964.
Bakoglu, H. B., Circuits, Interconnections, and Packaging for VLSI. New York: Addison-Wesley, 1990. ISBN 0-201-06008-6.
Barber, Clifford L., Solder... its fundamentals and usage, 2nd Edition. Kester Solder, 1961.
Barnes, John R., Robust Electronic Design Reference Book, Volumes 1 and 2. Boston, MA: Kluwer Academic Publishers, 2004. ISBN 1-4020-7739-4. $430.00 list price. This web page and its companion web page Designing Lead-Free, RoHS-Compliant, and WEEE-Compliant Electronics supplement these two books, and when completed may be considered as Chapter 20.5 in Volume 1.
Barrett, C. S., and Massalski, T. B., Structure of Metals: Crystallographic Methods, Principles and Data . New York: Pergamon, 1980.
Barrett, Charles S., Structure of Metals: Crystallographic Methods, Principles, and Data . New York: McGraw-Hill, 1943.
Barry, B. T. K., and Thwaites, C. J., Tin and Its Alloys and Compounds. New York: Halsted Press, 1983.
Bath, Jasbir, Lead-Free Soldering. New York: Springer, 2007. ISBN 978-0-387-32466-1. $129.00 list price.
Beaty, H. Wayne, Electrical Engineering Materials Reference Guide. New York: McGraw-Hill, 1990. ISBN 0-07-004196-2.
Bell Telephone Laboratories, Physical Design of Electronic Systems: Volume II Materials Technology . Englewood Cliffs, NJ: Prentice-Hall, 1970. ISBN 13-666362-1.
Berger, Melvin, Hazardous Substances: A Reference. Hillside, NJ: Enslow Publishers, 1986. ISBN 0-89490-116-8.
Best, Joel, Flavor of the Month: Why Smart People Fall for Fads. Berkeley, CA: University of California Press, 2006. ISBN 0-520-23626-8. $19.95 list price.
Billatos, Samir B., and Basaly, Nadia A., Green Technology and Design for the Environment. Washington, D. C.: Taylor & Francis, 1997. ISBN 1-56032-460-0. $93.42 list price.
Boyer, Howard E., and Gall, Timothy L,, Metals Handbook: Desk Edition. Metals Park, OH: American Society for Metals, 1985. ISBN 0-87170-188-X.
Bradley, Edwin, Handwerker, Carol A., Bath, Jasbir, Parker, Richard D., and Gedney, Ronald W., Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing . Hoboken, NJ: John Wiley & Sons, 2007. ISBN 978-0-471-44887-7. $99.95 list price.
Brandes, Eric A., Smithell's Metals Reference Book. Boston, MA: Butterworths, 1983. ISBN 0-408-71053-5.
Brandes, E. A., and Brook, G. B., Smithells Metals Reference Book, 7th Edition. Woburn, MA: Elsevier Butterworth-Heinemann, 1998. ISBN 0750636246.
Brick, R. M., and Phillips, Arthur, Structure and Property of Alloys. New York: McGraw-Hill, 1949.
Burns, R. M., and Bradley, W. W., Protective Coatings for Metals, 3rd Edition. New York: Reinhold Publishing, 1967.
Buschow, K. H. J., Cahn, Robert, Flemings, Merton C., Ilschner, Bernhard, Kramer, Edward J., Mahajan, Subhash, and Veyssiere, Patrick, Encyclopedia of Materials: Science and Technology, Volume 10. (Katz, J. D., "Whiskers," pp. 9570-9574.) Pergamon, 2001. ISBN 0080431526. $7,295.00 list price.
Cahn, Robert W. and Haansen, Peter, Physical Metallurgy, 4th Edition, Volume 1. New York: Elsevier North Holland, 1996. ISBN 0444898751. $995.00 list price for 3-volume set.
Cain, Tubal, Soldering and Brazing. Poole, Dorset, United Kingdom: Special Interest Model Books, 2003.
Cairns, J. H., and Gilbert, P. T., The Technology of Heavy Non-Ferrous Metals and Alloys. London: George Newnes, 1967.
Callenberg, Mona, Tenntradsbroderier. Vasteras, Sweden: ICA bokforlag, 1997. ISBN 91-534-1816-6.
Capillo, Carmen, Surface Mount Technology. New York: McGraw-Hill, 1990. ISBN 0-07-009781-X.
Carson, H. Tom, and Cox, Doye B., Handbook on Hazardous Materials Management, 4th Edition. Institute of Hazardous Materials Management, 1992.
Castelli, James, Nash, Carl, Ditlow. Clarence, and Pecht, Michael, Sudden Acceleration: The Myth of Driver Error. College Park, MD: CALCE, 2003. ISBN 0-9707174-5-8.
Chalmers, Bruce, and King, R., Progress in Metal Physics, Volume 5. New York: Interscience, 1954.
Cheremisinoff, Paul N., and Cheremisinoff, Nicholas P., Lead: A Guidebook to Hazard Detection, Remediation, and Control. Englewood Cliffs, NJ: PTR Prentice Hall, 1993. ISBN 0-13-012436-2.
Christian, J. W., The Theory of Transformations in Metals and Alloys. London: Pergamon Press, 1965.
Classon, Frank, Surface Mount Technology for Concurrent Engineering and Manufacturing . New York: McGraw-Hill, 1993. ISBN 0-07-011200-2.
Clauser, Henry R., Encyclopedia/Handbook of Materials, Parts and Finishes. Westport, CT: Technomic Publishing, 1976.
Cohen, Ernst, Physico-Chemical Metamorphosis and Some Problems in Piezochemistry . New York: McGraw-Hill, 1928.
Coombs, Jr., Clyde F., Printed Circuits Handbook, 3rd Edition. New York: McGraw-Hill, 1988. ISBN 0-07-012609-7.
Coombs, Jr., Clyde F., Printed Circuits Handbook, 5th Edition. New York: McGraw-Hill, 2001. ISBN 0-07-135016-0. $125.00 list price.
Coombs, Jr., Clyde F., Printed Circuits Handbook, 6th Edition. New York: McGraw-Hill, 2008. ISBN 0-07-146734-3. $135.00 list price.
Cralley, Lewis J., Cralley, Lester V., and Bus, James S., Patty's Industrial Hygiene and Toxicology, 3rd Edition, Volume III, Part B. New York: John Wiley & Sons, 1995, ISBN 0-471-53065-4.
Crowson, Richard, The Handbook of Manufacturing Engineering, 2nd Edition. New York: CRC Taylor & French, 2006. ISBN 0-8493-5554-0. $139.95 list price.
Cullity, B. D., Elements of X-Ray Diffraction, 2nd Edition. Reading, MA: Addison-Wesley, 1967. ISBN 0-201-01174-3.
Darken, Lawrence S., Gurry, Robert W., Physical Chemistry of Metals. New York: McGraw-Hill, 1953.
Dehlinger, Ulrich, Chemische Physik der Metalle und Legierungen. Liepzig, Germany: Akademische Verlagsgesellschaft, 1939.
Denison, Richard A., and Ruston, John, Recycling & Incineration: Evaluating the Choices. Washington, D. C.: Island Press, 1990. ISBN 1-55963-054-X. $50.00 list price.
Dillard, Clyde R., and Goldberg, David E., Chemistry Reactions, Structure and Properties. New York: MacMillan, 1971.
Doan, Gilbert E., and Mahla, Elbert M., The Principles of Physical Metallurgy, Second Edition. New York: McGraw-Hill, 1941.
Dunn, Barrie D., Materials and Processes for Spacecraft and High Reliability Applications . Chichester, United Kingdom: Springer, 2016. ISBN 978-3-319-79474-7. $154.26 list price.
Dunn, Barrie D., Metallurgical Assessment of Spacecraft Parts, Materials and Processes . New York: John Wiley & Sons, 1997. ISBN 047196428X. $280.00 list price.
Durairaj, Rajkumar, Rheology and processing of pastes for electronic packaging materials: Novel rheological characterisation techniques for lead-free solder pastes and electrical conductive adhesives. VDM Verlag Dr. Muller, 2009. ISBN 978-3-639-15746-8. $70.00 list price.
Durney, Lawrence J., Electroplating Engineering Handbook, 4th Edition. New York: Van Nostrand Reinhold, 1984. ISBN 0-442-22002-2.
Earnshaw, A., and Greenwood, Norman, Chemistry of the Elements, 2nd Edition. Elsevier, 1997. List price $99.95.
Edwards, Joseph, Coating and Surface Treatment Systems for Metals: A Comprehensive Guide to Selection. Materials Park, OH: ASM International, 1997. pp. 254-261.
Elices, M., and Llorca, J., Fiber Fracture. Oxford, UK: Elsevier, 2002. ISBN 0080441041. $199.00 list price.
Emsley, John, Molecules at an Exhibition - Portraits of Intriguing Materials in Everyday Life, New York: Oxford University Press, 1998. ISBN 0192862065. $17.95 list price.
Emsley, John, Nature's Building Blocks: An A-Z Guide to the Elements. Oxford University Press, 2001. ISBN 0198503407. $17.95 list price.
Evans, John W., A Guide to Lead-free Solders. London: Springer-Verlag, 2007. ISBN 978-1-84628-309-3. $129.00 list price.
Flinn, Richard A., and Trojan, Paul K., Engineering Materials and Their Applications, Second Edition. Dallas, TX: Houghton Mifflin, 1981. ISBN 0-395-29645-5.
Forsythe, W. E., Smithsonian Physical Tables, 9th Edition. Knovel, 1954.
Frear, D. R., Morgan, H. D., Burcheit, S. N., and Lau, J. H., The Mechanics of Solder Alloy Interconnects. New York: Van Nostrand Reinhold, 1994. ISBN 0-442-01505-4. $215.00 list price.
Frear, D. R., Jones, W. B., and Kinsman, K. R., Solder Mechanics: A State of the Art Assessment. Warrendale, PA: The Minerals, Metals & Materials Society, 1990. ISBN 0-87339-131-4.
Fukuda, Mitsuo, Reliability and Degradation of Semiconductor Lasers and LEDs. Boston, MA: Artech House, 1991. ISBN 0-89006-465-2. $138.00 list price.
Ganesan, Sanka, and Pecht, Michael, Lead-free Electronics 2004 Edition. College Park, MD: CALCE EOSC Press, 2003. ISBN 0-9707174-7-4. $100 list price.
Ganesan, Sanka, and Pecht, Michael. Lead-free Electronics. Hoboken, NJ: John Wiley & Sons, 2006. ISBN 0-471-78617-9. $99.95 list price.
Gilleo, Ken, Area Array Packaging Handbook: Manufacturing and Assembly. New York: McGraw-Hill, 2002. ISBN 0-07-137493-0. $125.00 list price.
Gilleo, Ken, Area Array Packaging Materials: Adhesives, Pastes, and Lead-Free. New York: McGraw-Hill, 2004. ISBN 0-07-142828-3. $130.00 list price.
Gilman, J. J., The Art and Science of Growing Crystals. New York: John Wiley & Sons, 1963.
Goldberg, Lee H., and Middleton, Wendy, Green Electronics/Green Bottom Line: Environmentally Responsible Engineering. Boston, MA: Newnes, 2000. ISBN 0-7506-9993-0. $59.95 list price.
Goodman, P., A Guide to Compliance with the RoHS Directive. ERA Technology. ISBN 0-7008-0780, £175.00 list price. (do not have)
Gordon, Pamela J., Lean and Green: Profit for Your Workplace and the Environment. San Francisco, CA: Berrett-Koehler, 2001. ISBN 1-57675-17088. $24.95 list price.
Graham, A. Kenneth, and Pinkerton, H. L., Electroplating Engineering Handbook. New York: Reinhold Publishing, 1955.
Greenfield, L. T., and Forrester, P. G., The Properties of Tin Alloys. Greenford, Middlesex, England: Tin Research Institute, Oct. 1947.
Grossman, Elizabeth, High Tech Trash: Digital Devices, Hidden Toxics, and Human Health . Washington: Shearwater Books, 2006. ISBN 1-55963-554-1. $19.95 list price.
Grossmann, Gunter, and Zardini, Christian, The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects. New York: Springer, 2011. ISBN 978-0-85729-235-3. $129.00 list price.
Hamer, Donald W., and Biggers, James V., Thick Film Hybrid Microcircuit Technology. New York: Wiley-Interscience, 1972. ISBN 0-471-34700-0.
Hampel, Clifford A., The Encyclopedia of the Chemical Elements. New York: Reinhold, 1968.
Harland, David M., and Lorenz, Ralph D., Space Systems Failures: Disasters and Rescues of Satellites, Rockets and Space Probes. Chichester, UK: Praxis, 2005. ISBN 0-387-21519-0. $29.95 list price.
Harper, Charles A., and Sampson, Ronald M., Electronic Materials & Processes Handbook, 2nd Edition. New York: McGraw-Hill, 1994. ISBN 0-07-054299-6.
Harper, Charles A., Electronic Materials and Processes Handbook, 3rd Edition. New York: McGraw-Hill, 2004. ISBN 0-07-140214-4. $125.00 list price.
Harper, Charles A., Electronic Packaging & Interconnection Handbook, 2nd Edition. New York: McGraw-Hill, 1997. ISBN 0-07-026694-8.
Harper, Charles A., Electronic Packaging & Interconnection Handbook, 3rd Edition. New York: McGraw-Hill, 2000. ISBN 0-07-134745-3.
Harper, Charles A., Electronic Packaging and Interconnection Handbook, 4th Edition. New York: McGraw-Hill, 2005. ISBN 0-07-143048-2. $150.00 list price.
Harper, Charles A., Handbook of Electronic Packaging. New York: McGraw-Hill, 1969.
Harper, Charles A., Handbook of Materials and Processes for Electronics. New York: McGraw-Hill, 1970.
Harper, Charles A., Handbook of Materials for Product Design. New York: McGraw-Hill, 2001. ISBN 0-07-135406-9. $125.00 list price.
Harper, Charles A., Handbook of Wiring, Cabling, and Interconnecting for Electronics. New York: McGraw-Hill, 1972.
Harper, Charles A., High Performance Printed Circuit Boards. New York: McGraw-Hill, 2000. ISBN 0-07-026713-8. $79.00 list price.
Hausner, Henry H., Modern Materials: Advances in Development and Applications, Volume 2 . New York: Academic Press, 1960.
Hedges, E. S., and Homer, C. E., The Properties of Tin, 3rd Revised Edition. International Tin Research and Development Council, 1937.
Hedges, Ernest S., Tin and Its Alloys. London, Edward Arnold, 1960.
Henshall, Greg, Bath, Jasbir, and Handwerker, Carol A., Lead-Free Solder Process Development. Hoboken, NJ: John Wiley & Sons, 2011. ISBN 978-0-470-41074-5. $99.95 list price.
Hoare, W. E., and Hedges, E. S., Tinplate. London: Edward Arnold, 1945.
Hobart, James F., Soft Soldering, Hard Soldering and Brazing. New York: D. Van Nostrand, 1919.
Hollomon Jr., James K., Surface-Mount Technology for PC Boards. Indianapolis, IN: Prompt Publications, 1995. ISBN 0-7906-1060-4. $45.95 list price.
Holm, Ragnar, Electric Contacts Handbook, 3rd Edition. Berlin, Springer-Verlag, 1958.
Honeycombe, R. W. K., The Plastic Deformation of Metals. Edward Arnold, 1984.
Hoyt, Samuel L., Metals and Alloys Data Book. New York: Reinhold Publishing, 1943.
Hoyt, Samuel L., Metals Properties. New York: McGraw-Hill, 1954.
Hudson, John B., Surface Science: An Introduction. New York: John Wiley & Sons, 1998. ISBN 0471252395.
Hume-Rothery, William, Atomic Theory for Students of Metallurgy. London: Institute of Metals, 1955.
Hume-Rothery, William, Electrons, Atoms, Metals and Alloys, 3rd Edition. New York: Dover,1963.
Hume-Rothery, William, and Raynor, G. V., The Structure of Metals and Alloys. London: The Institute of Metals, 1956.
Humpston, Giles, and Jacobson, David M., Principles of Soldering. Materials Park, OH: ASM, 2004. ISBN 0-87170-792-6. $165.00 list price.
Humpston, Giles, and Jacobson, David M., Principles of Soldering and Brazing. Materials Park, OH: ASM International, 1993. ISBN 0-87170-462-5. $165.00 list price.
Hwang, Jennie S., Ball Grid Array & Fine Pitch Peripheral Interconnections. Electrochemical Publications, 1995. ISBN 0-901150-29-0.
Hwang, Jennie S., Environment-Friendly Electronics: Lead-Free Technology. Electrochemical Publications, 2001. ISBN 0-901150-40-1. $238 list price.
Hwang, Jennie S., Implementing Lead-Free Electronics. New York: McGraw-Hill, 2005. ISBN 0-07-144374-6. $99.95 list price.
Hwang, Jennie S., Modern Solder Technology for Competitive Electronics Manufacturing . New York: McGraw-Hill, 1996. ISBN 0-07-031749-6. $89.95 list price.
Hwang, Jennie S., Solder Paste in Electronics Packaging. New York: Van Nostrand Reinhold, 1989. ISBN 0-442-20754-9. available from Amazon.com
Jeffries, Zay, and Archer, Robert S., The Science of Metals. New York: McGraw-Hill, 1924.
Johnson, Colin C., and Kevra, Joseph, Solder Paste Technology: Principles and Applications. Blue Ridge Summit, PA: TAB Professional and Reference Books, 1989. ISBN 0-8306-3203-4. available from Amazon.com
Jordan, Manfred, The Electrodeposition of Tin and its Alloys. Saulgau/Wurtt, Germany: Eugen G. Leuze Publishers, 1995. ISBN 3-87480-118-7.
Joseph, Shany, and Phatak, Girish, Electroplating of Lead Free Solder for Electronics. New York: Nova Science Publishers, 2011. ISBN 978-1-61668-753-3. $43.00 list price.
Joshi, P. B., and Ramakrishnan, P., Materials for Electrical and Electronic Contacts: Processing, Properties, and Applications. Enfield, NH: Science Publishers, 2004. ISBN 1-57808-269-2. $118.00 list price.
Jowett, C. E., Compatibility and Testing of Electronic Components. New York: John Wiley & Sons, 1972.
Jowett, C. E., Reliable Electronic Assembly Production. Blue Ridge Summit, PA: TAB Books, 1970.
Judd, Mike, and Brindley, Keith, Soldering in Electronics Assembly. Oxford: Newnes, 1999. ISBN 0750635452. $120.00 list price.
Kaldis, E., Current Topics in Material Science, Volume 1. (Givargizov, E. I., "Growth of Whiskers by the Vapor-Liquid-Solid Mechanism,", pp. 79-145.) New York: North-Holland Publishing, 1978.
Kato, Takahiko, Handwerker, Carol A., and Bath, Jasbir, Mitigating Tin Whisker Risks: Theory and Practice. Hoboken, NJ: IEEE Press, 2016. ISBN 9780470907238.
Kesler, Stephen E., Mineral Resources, Economics and the Environment. Macmillan College Publishing, New York, 1994. ISBN: 0-02-362842-1.
Kessel, Irene, and O'Conner, John T., Getting the Lead Out: The Complete Resource for Preventing and Coping with Lead Poisoning , Revised Edition. Cambridge, MA: Perseus Publishing, 2001. ISBN 0-7382-0499-4. $18.00 list price.
Kittel, Charles, Introduction to Solid State Physics, 5th Edition. New York: John Wiley & Sons, 1976.
Klaassen, Curtis D., Casarett & Doull's Toxicology: The Basic Science of Poisons. McGraw-Hill, 2001. List price $105.00.
Kubasek, Nancy K., and Silverman, Gary S., Environmental Law, 3rd Edition. Upper Saddle River, NJ: Prentice Hall, 2000. ISBN 0-13-014121-6.
Kuehr, Ruediger, and Williams, Eric, Computers and the Environment: Understanding and Managing their Impacts . Boston, MA: Kluwer Academic Publishers, 2003. ISBN 1-4020-1680-8. $39.95 list price.
Lall, Pradeep, Pecht, Michael G., and Hakim, Edward B., Influence of Temperature on Microelectronics and System Reliability . New York: CRC Press, 1997. ISBN 0-8493-9450-3. $109.95 list price.
Lancaster, J. F., The Metallurgy of Welding Brazing and Soldering. New York: Americal Elsevier, 1965.
Lashko, N. F., and Lashko-Avakyan, S. V., Brazing and Soldering of Metals. Jerusalem: Israel Program for Scientific Translations, 1961.
Lau, John H., Wong, C. P., Prince, John L., and Nakayama, Wataru, Electronic Packaging: Design, Materials, Process, and Reliability . New York: McGraw-Hill, 1998. ISBN 0-07-037135-0.
Lau, John H., Wong, C. P., Lee, Ning Cheng, and Lee, S. W. Ricky, Electronics Manufacturing with Lead-Free, Halogen-Free & Conductive Adhesive Materials. New York: McGraw-Hill, 2003. ISBN 0-07-138624-6. $125 list price.
Lau, John H., Flip Chip Technologies. New York: McGraw-Hill, 1996. ISBN 0-07-036609-8.
Lau, John H., Reliability of RoHS-Compliant 2D and 3D IC Interconnects. New York: McGraw Hill, 2011. ISBN 978-0-07-175379-1. $125.00 list price.
Lau, John H., Solder Joint Reliability: Theory and Applications. New York: Van Nostrand Reinhold, 1991. ISBN 0-442-00260-2. $227.00 list price.
Le Couteur, Penny, and Burreson, Jay, Napoleon's Buttons: How 17 Molecules Changed History. New York: Jeremy P. Tarcher/Putnam, 2003. $14.95 list price.
Le Grand, Rupert, The New American Machinist's Handbook. New York: McGraw-Hill, 1955.
Lee, Ning-Cheng, Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies. Boston, MA: Newnes, 2001. ISBN 0-7506-7218-8. $83.95 list price.
Lee, Thomas W., and Pabbisetty, Seshu V., Microelectronic Failure Analysis Desk Reference, 3rd Edition. Materials Park, OH: ASM International, 1993. ISBN 0-87170-479-X.
Leidheiser Jr., Henry, The Corrosion of Copper, Tin, and Their Alloys. New York: John Wiley & Sons, 1971. ISBN 0-471-52600-2.
Leighou, Robert B., Chemistry of Engineering Materials. New York: McGraw-Hill, 1942.
Levitt, Albert P., Whisker Technology. New York: Wiley-Interscience, 1970. ISBN 471-53150-2.
Lewis, Grace Ross, 1001 chemicals in everyday products, 2nd Edition. New York: John Wiley & Sons, 1999. ISBN 0-471-29212-5. $79.95 list price.
Lewis Sr., Richard J., Hazardous Chemicals Desk Reference, 2nd Edition. New York: Van Nostrand Reinhold, 1991. ISBN 0-442-000497-4.
Lewis Sr., Richard J., Sax's Dangerous Properties of Industrial Materials, 8th Edition, Volume II. New York: Van Nostrand Reinhold, 1992. ISBN 0-442-01277-2. $625.00 list price for 3-volume set.
Lewis Sr., Richard J., Sax's Dangerous Properties of Industrial Materials, 8th Edition, Volume III. New York: Van Nostrand Reinhold, 1992. ISBN 0-442-01278-0. $625.00 list price for 3-volume set.
Licari, James J., and Swanson, Dale W., Adhesives Technology for Electronic Applications: Materials, Processing, Reliability. William Andrew Publishing, 2005. List price $165.00.
Licari, James J., and Enlow, Leonard R., Hybrid Microcircuit Technology Handbook, 2nd Edition. Westwood, NF: Noyes Publications, 1989. ISBN 0815511523. $139.00 list price.
Licari, James J., and Enlow, Leonard R., Hybrid Microcircuit Technology Handbook: Materials, Processes, Design, Testing and Production, 2nd Edition. Westwood, NJ: Noyes Publications, 1998. ISBN 0815514239. $180.00 list price.
Lide, David R., CRC Handbook of Chemistry and Physics, 82nd Edition 2001-2002. New York: CRC Press, 2001. ISBN 0-8493-0482-2. pp. 4-32.
Liddell, Donald M., Handbook of Nonferrous Metallurgy. New York: McGraw-Hill, 1945.
Liddell, Donald M., and Doan, Gilbert E., The Principles of Metallurgy. New York: McGraw-Hill, 1933.
Lide, David R., CRC Handbook of Chemistry and Physics, 82nd Edition 2001-2002. New York: CRC Press, 2001. ISBN 0-8493-0482-2.
Lin, Kwang-Lung, Solder Materials. London: World Scientific Publishing, 2018. ISBN 978-981-3237-60-5. $143.47 list price.
Liu, Johan, Conductive Adhesives for Electronics Packaging. Electrochemical Publications, 1999. ISBN 0-901150-37-1.
Liu, Weifeng, and Pecht, Michael, IC Component Sockets. Hoboken, NJ: John Wiley & Sons, 2004. ISBN 0-471-46050-8. $73.50 list price.
Louis, Henry, Metallurgy of Tin. New York: McGraw-Hill, 1911.
Lowenheim, Frederick A., Modern Electroplating, 2nd Edition. New York: John Wiley & Sons, 1963.
Lu, Daniel, and Wong, C. P., Materials for Advanced Packaging. New York: Springer, 2010. ISBN 978-1-4419-4611-9. $129.00 list price.
Lyman, Taylor, Metals Handbook, 8th Edition, Volume 1. Novelty, OH: American Society for Metals, 1961.
Lynch, Charles T., CRC Handbook of Materials Science, Volume I: General Properties. Boca Raton, FL: CRC Press, 1974. ISBN 0-87819-231-X.
Lynch, Charles T., CRC Handbook of Materials Science, Volume II: Metals, Composites, and Refractory Materials. Boca Raton, FL: CRC Press, 1975. ISBN 0-87819-232-8.
Lynch, Charles T., Practical Handbook of Materials Science. Boca Raton, FL: CRC Press, 1989. ISBN 0-8493-3702-X.
Madenci, Erdogan, Guven, Ibrahim, and Kilie, Bahattin, Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS(R). Boston, MA: Kluwer Academic Publishers, 2003. ISBN 1-4020-7330-5. $186.00 list price.
Manko, Howard H., Soldering Handbook for Printed Circuits and Surface Mounting. New York: Van Nostrand Reinhold, 1986. ISBN 0442-26423-2. available from Amazon.com
Manko, Howard H., Solders and Soldering: Materials, Design, Production, and Analysis for Reliable Bonding, 3rd Edition. New York: McGraw-Hill, 1992. ISBN 0-07-039970-0. $79.95 list price.
Manko, Howard H., Solders and Soldering, 4th Edition. New York: McGraw-Hill, 2001. ISBN 0-07-134417-9.
Mantell, C. L., Tin: Its Mining, Production, Technology, and Applications. New York: Chemical Catalog Company, 1929.
Mantell, C. L., Tin: Its Mining, Production, Technology, and Applications, 2nd Edition . New York: Reinhold, 1949.
Mantell, Charles L., Engineering Materials Handbook. New York: McGraw-Hill, 1958.
Mathewson, C. W., Modern Uses of Nonferrous Metals. New York: American Institute of Mining and Metallurgical Engineers, 1953.
Meaden, George Terence, Electrical Resistance of Metals. New York: Plenum Press, 1965.
Mendenhall, J. Howard, Understanding Copper Alloys. Malabar, FL: Robert E. Krieger Publishing, 1989. ISBN 0-89874-855-0.
Mickelson, Alan R., Basavanhally, Nagesh R., and Lee, Yung-Cheng, Optoelectronic Packaging. New York: John Wiley & Sons, 1997. ISBN 0-471-11188-0. $115.00 list price.
Miner, Douglas F., and Seastone, John B., Handbook of Engineering Materials, 1st Edition. New York: McGraw-Hill, 1955.
Moore, Thomas M., and McKenna, Robert G., Characterization of Integrated Circuit Packaging Materials. Boston, MA: Butterworth-Heinemann, 1993. ISBN 0-7506-9267-7.
Moosbrugger, Charles, and Cverna, Fran, ASM Read Reference Electrical and Magnetic Properties of Metals. Materials Park, OH: ASM International, 2000. ISBN 0-87170-690-3. $167.00 list price.
Murr, Lawrence E., Interfacial Phenomena in Metals and Alloys. Don Mills, Ontario: Addison-Wesley, 1975. ISBN 0-201-04884-1.
Neely, W. Brock, Introduction to Chemical Exposure and Risk Assessment. Boca Raton, FL: Lewis Publishers, 1994. ISBN 1-56670-094-9.
Neumuller, Otto-Albrecht, Rompps Chemie-Lexikon, Volume 6. Stuttgart, Germany: Franckh'sche Verlagshandlung, 1988. ISBN 3-440-04516-1.
Newton, Joseph, An Introduction to Metallurgy, 2nd Edition. New York: John Wiley & Sons, 1947.
Nicholson, Morris E., Electronic Packaging and Corrosion in Microelectronics. ASM, 1987. ISBN 0-87170-291-6.
Nightingale, S. J., Tin Solders: A Modern Study of the Properties of Tin Solders and Soldered Joints, 2nd Edition. Brooklyn, NY: Chemical Publishing, 1942.
Nippes, Ernest F., Metals Handbook, 9th Edition, Volume 6: Welding, Brazing, and Soldering . Metals Park, OH: American Society for Metals, 1983. ISBN 0-87170-007-7.
Nowick, A. S., and Burton, J. J., Diffusion in Solids. New York: Academic Press, 1975.
Oberg, Erik, Machinery's Handbook, 20th Edition. New York: Industrial Press, 1975.
Pang, John Hock Lye, Lead Free Solder: Mechanics and Reliability. New York: Springer, 2012. ISBN 978-1-4614-0462-0. $129.00 list price.
Parker, Earl R., Materials Data Book. New York: McGraw-Hill, 1967.
Paul, William, and Warschauer, Douglas M., Solids Under Pressure, New York: McGraw-Hill, 1963.
Pearson, W. B., A Handbook of Lattice Spacings and Structures of Metals and Alloys . New York: Pergamon Press, 1958.
Pearson, W. B., A Handbook of Lattice Spacings and Structures of Metals and Alloys, Volume 2. New York: Pergamon Press, 1967.
Pecht, Michael, Bumiller, Elissa M., Douthit, David A., and Pecht, Joan, Contamination of Electronic Assemblies. New York: CRC Press, 2003. ISBN 0849314836. $169.95 list price.
Pecht, Michael, Agarwal, Rakish, McCluskey, Patrick, Dishongh, Terrance, Javadpour, Sirus, and Mahajan, Rahul, Electronic Packaging Materials and Their Properties. New York: CRC Press, 1999. ISBN 0-8493-9625-5. $109.95 list price.
Pecht, Michael, Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability. New York: John Wiley & Sons, 1994. ISBN 0-471-59446-6. $175.00 list price.
Perry, Robert H., and Green, Donald W., Perry's Chemical Engineers' Handbook, 7th Edition. McGraw-Hill, 1997. List price $150.00.
Plumbridge, W. J, Matela, Raymond J., and Westwater, A., Structural Integrity and Reliability in Electronics: Enhancing Performance in a Lead-Free Environment. Boston: Kluwer Academic Publishers, 2004. ISBN 1-4020-1765-0. $154 list price.
Pohanish, Richard P., Sittig's Handbook of Toxic and Hazardous Chemicals and Carcinogens, Volumes 1 and 2. William Andrew Publishing, 2002. List price $495.00.
Pojasek, Robert B., Toxic and Hazardous Waste Disposal, Volume One: Processes for Stabilization/ Solidification. Ann Arbor, MI: Ann Arbor Science Publishers, 1979. ISBN 0-250-40251-3.
Pollack, Herman W., Materials Science and Metallurgy. Reston, VA: Reston Publishing, 1977.
Prager, Jan C., Environmental Contaminant Reference Databook, Volumes 1-3. John Wiley & Sons, 1998.
Price, J. W., Tin and Tin-Alloy Plating. Great Britain: Electrochemical Publications, 1983.
Prise, Walter J., Electronic Circuit Packaging. Columbus, OH: Charles E. Merrill Books, 1967.
Puippe, Jean-Claude, and Leaman, Frank, Theory and Practice of Pulse Plating. Orlando, FL: American Electroplaters and Surface Finishers Society, 1986. pp. 189-208.
Puttlitz. Karl J., and Stalter, Kathleen A., Handbook of Lead-Free Solder Technology for Microelectronic Assemblies . New York: Marcel Dekker, 2004. ISBN 0-8247-4870-0. $225 list price.
Rabilloud, Guy, High-Performance Polymers Chemistry and Applications, Volume 1: Conductive Adhesives. Paris, France: Editions Technip, 1997. ISBN 9-782710-807162.
Rawdon, Henry S., Protective Metallic Coatings. New York: Chemical Catalog Co., 1928.
Reed-Hill, Robert E., Physical Metallurgy Principles. Princeton, NJ: D. Van Nostrand, 1964.
Rhines, Frederick N., Non-Ferrous Metallography Notes, Part II: Copper and the White Metals . Pittsburgh, PA: Carnegie Institute of Technology, 1948.
Richardson, H. L. "Bill", What Makes You Think We Read the Bills?. Ottawa, IL: Caroline House Books, 1978.
Ritchey, Lee W., Right the First Time: A Practical Handbook on High Speed PCB and System Design, Volume 2. Speeding Edge, 2006. ISBN 0-9741936-0-7.
Roberge, Pierre R., Handbook of Corrosion Engineering. McGraw-Hill, 2000. List price $115.00.
Rose, Robert M., Shepard, Lawrence A., and Wulff, John, Structure and Properties of Materials, Volume IV: Electronic Properties . New York: John Wiley & Sons, 1996.
Rosenthal, Murray P., Mini/Micro Soldering and Wire Wrapping. Rochelle Park, NJ: Hayden, 1978.
Safranek, William H., The Properties of Electrodeposited Metals and Alloys, 2nd Edition . Orlando, FL: American Electroplaters and Surface Finishers Society, 1986. ISBN 0-936569-00-X.
Sax, N. Irving, Dangerous Properties of Industrial Materials, 5th Edition. New York: Van Nostrand Reinhold, 1979. ISBN 0-442-27373-8.
Sax, N. Irving, and Lewis Sr., Richard J., Rapid Guide to Hazardous Chemicals in the Workplace. New York: Van Nostrand Reinhold, 1986. ISBN 0-442-28220-6.
Schapiro, Mark, Exposed: The Toxic Chemistry of Everyday Products and What's at Stake for American Power. White River Junction, VT: Chelsea Green Publishing, 2007. ISBN 1603580581. $16.95 list price.
Schlabach, T. D., and Rider, D. K., Printed and Integrated Circuitry: Materials and Processes. New York: McGraw-Hill, 1963.
Schlesinger, Mordechay, and Paunovic, Milan, Modern Electroplating, 4th Edition. New York: John Wiley & Sons, 2000. ISBN 0-471-16824-6. $184.00 list price.
Seitz, Frederick, and Turnbull, David, Solid State Physics, Volume 3. New York: Academic Press, 1956.
Seitz, Frederick, The Modern Theory of Solids. New York: McGraw-Hill, 1940.
Seitz, Frederick, The Physics of Metals. New York: McGraw-Hill, 1943.
Seraphim, Donald P., Lasky, Ronald, and Li, Che-Yu, Principles of Electronic Packaging. New York: McGraw-Hill, 1989. ISBN 0-07-056306-3.
Shangguan, Dongkai, Lead-Free Solder Interconnect Reliability. Materials Park, OH: ASM International, 2005. ISBN 0-87170-816-7. $195.00 list price.
Shemilt, H. R., Printed Circuit Troubleshooting. Scotland: Electrochemical Productions, 1974.
Sheng, William W., and Colino, Ronald P., Power Electronic Modules: Design and Manufacture. Ann Arbor, MI: CRC Press, 2004. $99.95 list price.
Shina, Sammy G., Green Electronics Design & Manufacturing: Implementing Lead-Free and RoHS-Compliant Global Products. New York: McGraw-Hill, 2008. ISBN 978-0-07-149594-3. $99.95 list price.
Shreir, L. L., Jarman, R. A., and Burstein, G. T., Corrosion, 3rd Edition, Volume 1. Woburn, MA: Elsevier Butterworth-Heinemann, 1994. ISBN 0750610778.
Singh, P., and Viswanadham, Puligandla, Failure Modes And Mechanisms in Electronic Packages. (copy on order.)
Smallman, R. E., and Bishop, R. J., Modern Physical Metallurgy and Materials Engineering: Science, process, applications, 6th Edition. Boston, MA: Elsevier Butterworth-Heinemann, 1999. ISBN 0750645644. $68.00 list price.
Smith, Morton C., Principles of Physical Metallurgy. New York: Harper & Brothers, 1956.
Smithells, Colin J., Metals Reference Book, 3rd Edition, Volume 1. Washington: Butterworths, 1962.
Smithells, Colin J., Metals Reference Book, 3rd Edition, Volume 2. Washington: Butterworths, 1962.
Strauss, Rudolf, SMT Soldering Handbook, 2nd Edition. Oxford, UK: Newnes, 1998. ISBN 0-7506-3589-4. $104.95 list price.
Stwertka, Albert, A Guide to the Elements. New York: Oxford University Press, 1996.
Subramanian, K. N., Lead-free Solders: Materials Reliability for Electronics. John Wiley & Sons, 2012. ISBN 9780470971826. $195.00 list price.
Suganuma, Katsuaki, Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact. New York: Marcell Dekker, 2004. ISBN 0-8247-4102-1. $165 list price.
Tammann, Gustav, Lehrbuch der Metallographie: Chemie und Physik der Metalle und ihrer Legierungen. Leipzig, Germany: Leopold Voss, 1923.
Tan, A. C., Lead Finishing in Semiconductor Devices: Soldering. New Jersey: World Scientific, 1989. ISBN 9971-50-679-3. $65.00 list price.
Tan, A. C., Tin and Solder Plating in the Semiconductor Industry. New York: Chapman & Hall, 1993. ISBN 0-412-48240-1.
Tautscher, Carl J., The Contamination of Printed Wiring Boards and Assemblies. Bothell, WA: Omega Scientific Services, 1976.
Teed, P. Litherland, The Properties of Metallic Materials at Low Temperatures. New York: John Wiley & Sons, 1950.
Tenner, Edward, Why Things Bite Back: Technology and the Revenge of Unintended Consequences. Alfred A. Knopf, New York, 1997. ISBN: 0679747567. $15.95 list price.
Thwaites, C. J., Capillary Joining - Brazing and Soft-Soldering. New York: Research Studies Press, 1982. ISBN 0-471-10167-2.
Thwaites, C. J., and Barry, B. T. K., Soldering. Oxford University Press, 1975. ISBN: 019859139X.
Tu, King-Ning, Solder Joint Technology: Materials, Properties, and Reliability. Springer, 2007. ISBN 0-387-38890-7. $149.00 list price.
Tummala, Rao R., Fundamentals of Microsystems Packaging. New York: McGraw-Hill, 2001. ISBN 0-07-137169-9. $89.95 list price.
Tummala, Rao R., and Rymaszewski, Eugene J., Microelectronics Packaging Handbook. New York: Van Nostrand Reinhold, 1989. ISBN 0-442-20578-3.
Tummala, Rao R., Rymaszewski, Eugene J., and Klopfenstein, Alan G., Microelectronics Packaging Handbook, 3-Part Set. New York: International Thompson Publishing, 1997. ISBN 0-412-08431-7, 0-412-08441-4, and 0-412-08451-1. $185.00 list price.
Tung, Chih-Hang, Sheng, George T. T. Sheng, and Lu, Chih-Yuan, ULSI Semiconductor Technology Atlas. John Wiley & Sons, 2003. ISBN 0471457728. $132.00 list price.
van Arkel, A. E., Reine Metalle, Berlin, Germany: Verlag von Julius Springer, 1939.
Verhoeven, John D., Fundamentals of Physical Metallurgy. New York: John Wiley & Sons, 1975.
Verma, Ajit Ram, and Krishna, P., Polymorphism and Polytypism in Crystals. New York: John Wiley & Sons, 1966.
Vianco, Paul T., Soldering Handbook, 3rd Edition. Miami, FL: American Welding Society, 1999. ISBN 0-87171-618-6.
Viswanadham, Puligandla, and Singh, Pratap, Failure Modes and Mechanisms in Electronic Packages. New York: International Thomson Publishing, 1998. ISBN 0-412-10591-8. $150.00 list price.
Wagner, Travis P., The Hazardous Waste Q & A. New York: Van Nostrand Reinhold, 1990. ISBN 0-442-23842-8. $115.00 list price.
Wassink, R. J. Klein, Soldering in Electronics, 2nd Edition. Electrochemical Publications, 1989. ISBN 0 901150 24 X. Available from Amazon.
Westbrook, J. H., and Fleischer, R. L., Intermetallic Compounds, Volume 1. John Wiley & Sons, 2000. List price $205.00.
Wilhelm, Donald, The Book of Metals. New York: Harper & Brothers, 1932.
Woodgate, Ralph W., Handbook of Machine Soldering: A Guide for the Soldering of Electronic Printed Wiring Assemblies. New York: John Wiley & Sons, 1983. ISBN 0-471-87540-6.
Wright, Roger N., Wire Technology: Process Engineering and Metallurgy. Elsevier, 2011. ISBN 978-0-12-382092-1.
Wyckoff, Ralph W. G., Crystal Structures, Volume 1. New York: Interscience Publishers, 1960.
Yost, Frederick G., Hosking, F. Michael, and Frear, Darrel R., The Mechanics of Solder Alloy Wetting & Spreading. New York: Van Nostrand Reinhold, 1993. ISBN 0-442-01752-9. $215.00 list price.
Ph. D. and Master's Theses on Lead-Free, RoHS, and
WEEE (revised 10/3/2020)
Abdelhadi, Ousama Mohamed Omer, Size Effects in Tin-Based Lead-Free Solder Joints: Kinetics of Bond Formation and Mechanical Characteristics. Ph. D. Thesis for University of Alabama, Tuscaloosa, AL, 2013.
Abtew, Mulugeta, Effect of Cooling Rate, Silver Composition, Dwell Time and Solder Joint Size on the Reliability of Tin-Silver-Copper Solder Joints. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2010.
Adeogba, Tonye, Effect of Reflow Variables on the Nanoscale Mechanical Properties of Lead Free Solders. Master's Thesis for University of Texas at Arlington, Arlington, TX, Dec. 2009.
Alghoul, Thaer M., Mechanisms of Deformation of Lead-Free Sn-Ag-Cu Solder Joints in Cycling . Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2019.
Alipour, Manijeh Mohammad, Thermal Diffusivity Determination in Sn-Based Lead-Free Solder Alloys . Ph. D. Thesis for University of Alabama, Huntsville, AL, 2011.
Allenby, Braden R., Design for environment: Implementing industrial ecology. Ph. D. Thesis for Rutgers the State University of New Jersey, New Brunswick, NJ, May 1992.
Al-Momani, Emad Shehadeh, Reliability Modeling of Lead-Free Electronics under Thermal Cycling Conditions. Ph. D. Thesis for State University of New York, Binghamton, NY, 2011.
Al-Yafawi, Abdullah, Electronic Packages Fatigue Life Predicion under Random Vibration Loading Conditions. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2010.
Anastasio, Onofrio A., An Approach for Impression Creep of Lead-Free Microelectronic Solders . Master's Thesis for Naval Postgraduate School, Monterey, CA. June 2002.
Anglin, Benjamin Stewart, Investigation and Characterization of Thermoelastic Eigenstresses Near Microstructural Features and the Application to Tin Whisker Growth. Ph. D. Thesis for Carnegie Mellon University, Pittsburgh, PA, Oct. 2012.
Anson, Scott J., Analysis of Lead Free Tin-Silver-Copper and Tin-Lead Solder Wetting Reactions. Ph. D. Thesis for State University of New York, Binghamton, University, Binghamton, NY, 2007.
Arfaei, Babak, The Effects of Nucleation and Solidification Mechanisms on the Microstructure and Thermomechanical Response of Sn-Ag-Cu Solder Joints. Ph. D. Thesis for State University of New York at Binghamton, Binghamton University, Binghamton, NY, 2010.
Athavale, Saurabh N., A Comparison of Different Mechanical Testing Protocols on the Reliability of a Pb-free Solder System. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2008.
Athavale, Saurabh, Effect of Cu Concentration and Cooling Rate on Microstructure of Sn-3.9Ag-XCu. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2006.
Bai, Guofeng, Low-Temperature Sintering of Nanoscale Silver Paste for Semiconductor Device Interconnection. Ph. D. Thesis for Virginia Polytechnic Institute and State University, Blacksburg, VA, Oct. 2005.
Bangalore, Sudhindra Nagaraj, Evaluation of conductive adhesives for Surface Mount Technology. Master's Thesis for University of Louisville, Louisville, KY, June 1992.
Barreda Esparza, Jorge Luis, Fabrication and Characterization of Heterogeneous Nanowires. Ph. D. Thesis for Florida State University, Tallahassee, FL, 2017.
Barry, Nathan, Lead-Free Solders for High-Reliability Applications: High-Cycle Fatigue Studies. Doctor of Engineering Thesis for University of Birmingham, Birmingham, United Kingdom, Oct. 23, 2008.
Beaumont, Matthew Hall, Characterization of Indalloy 227 Non Lead Solder. Ph. D. Thesis for Purdue University, West Lafayette, IN, Dec. 1999.
Becker, James Hall, Crystal Growth and Electrical and Optical Properties of Gray Tin. Ph. D. Thesis for Cornell University, June 1957.
Belbase, Hemant, Lead Free Soldering Materials, Reliability and Process Optimization . Master's Thesis for University of Massachusetts Lowell, Lowell, MA, Oct. 25, 2000.
Benedict, Michael Scott, Heterogeneous Nucleation of Sn in Sn-Ag-Cu Solder Joints. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.
Berger, Barry Nathaniel, Study of the Use of the Weibull Distribution and Compliance of the Reliability of Lead-Free Solder in Accelerated Thermal Cycling Through Varying Solder Volume, Pitch, and Thermal Range with Previously Established Materials Models. Master's Thesis for State University of New York, Binghamton, NY, 2012.
Berrios, Antonio Tavarez, Modeling the Reflow Process of an Actual PCB. Master's Thesis for University of Puerto Rico, Mayaguez, PR, 2001.
Bhalerao, Vikram, Process Development and Reliability Study for 01005 Components in a Lead-Free Assembly Environment. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2008.
Bhardwaj, Divya, Development of Lead Free Thermal Fuse Wires Using Ohno Continuous Casting. Master's Thesis for University of Toronto, Toronto, Canada, 2008.
Bhassyvasantha, Sherin, Mitigation of Tin Whiskers in Electroplated Tin Coatings by Effective Doping: The Role of Surface and Subsurface. Master's Thesis for New Mexico Institute of Mining and Technology, Socorro, NM, May 2018.
Bhave, Aniket, A Leaded and Lead-Free Solder Paste Evaluation Screening Procedure . Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2005.
Bierman, Matthew John, Dislocations in One-Dimensional Semiconductor Crystals: Nanowires, Nanotubes, and Whiskers. Ph. D. Thesis for University of Wisconsin - Madison, Madison, WI, 2009.
Bilderback, Donald Heywood, X-Ray Determination of the Valence Charge Density of Grey Tin, Indium-Antimonide, and Gallium-Arsenide. Ph. D. Thesis for Purdue University, West Lafayette, IN, Aug. 1975.
Bjeletich, John George, Dekinking of Copper Whiskers. Master's Thesis for Montana School of Mines, Butte, MT, 1961.
Bloomer, Tamara Ellis, Microstructural and mechanical properties of a novel lead-free solder . Master's Thesis for Iowa State University, Ames, IA, 1999.
Boesenberg, Adam James, Development of Al, Mn, & Zn doped Sn-Ag-Cu solders for electronic assembly, Master's Thesis for Iowa State University, Ames, IA, 2011.
Booth, Bruce Lee, Magnetoresistance Oscillations in Antimony Doped Gray Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1967.
Borra, Venkata Shesha Vamsi, Metal Whiskers: The Role of Electric Fields in the Formation Mechanism and Methods for Whisker Growth Mitigation. Ph. D. Thesis for University of Toledo, Toledo, OH, Dec. 2017.
Bowers, Trevor S., Microstructural Evolution of Nickel-Enhanced Tin-Copper Solder Joints on Nickel/Gold and Immersion Silver PCB Finishes. Master's Thesis for University of Alabama in Huntsville, Huntville, AL, 2006.
Brenner, Sidney S., The Growth and Mechanical Properties of Metal Whiskers. Ph. D. Thesis for Rensselaer Polytechnic Institute, Troy, New York, May 1957.
Bruno, Felix, An Experimental Study on Voids in Area Array Devices for Mixed Alloy Assemblies. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2006.
Buchovecky, Eric J., Numerical Simulation of Stress Generation and Whisker Growth in Sn Films. Ph. D. Thesis for Brown University, Providence, RI, May 2010.
Bukhari, Sarfaraz, Evaluation of the Effects of Processing Conditions on Shear Strength in Pb-Free Surface Mount Assembly. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2004.
Busta, Heinz, Uniaxial-tensile-stress-modified Galvanomagnetic Properties of Gray Tin . Ph. D. Thesis for Northwestern University, Evanston, IL, June 1974.
Caputo, Antonio, Conductive Anodic Filament (CAF) Formation. Ph. D. Thesis for University of Toronto, Toronto, Canada, 2010.
Chada, Srinivas, Effect of Processing Parameters and Thermal Cycling on the Microstructure and Strength of Eutectic Sn-Ag Solder on Cu. Ph. D. Thesis for Marquette University, Milwaukee, WI, May 1998.
Chae, Seung-Hyun, Electromigration and Thermomigration Reliability of Lead-Free Solder Joints for Advanced Packaging Applications. Ph. D. Thesis for University of Texas at Austin, Austin, TX, May 2010.
Chai, Fei, Solder Interconnect Life Prediction under Complex Temperature Cycling with Varying Mean and Amplitude. Ph. D. Thesis for University of Maryland, College Park, MD, 2013.
Chakraborty, Aritra, Using Chemo-Thermo-Mechanically Coupled Crystal Plasticity Simulations to Investigate the Process of Whisker Formation in b-Sn Thin Films. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2019.
Chaloupka, Andrew Charles, Lead-Free Electronics Use and Repair Dynamic Simulation. Master's Thesis for University of Maryland, College Park, MD, 2009.
Chan, Dennis King, A Maximum Entropy Fracture Model for Low and High Strain-Rate Fracture in SnAgCu Alloys. Ph. D. Thesis for Purdue University, West Lafayette, IN, Aug. 2012.
Chan, Yuen Sing, Investigation into Characteristics of Thermal Fatigue Modeling of Lead-Free Solder Joints and Optimization of Temperature Cycling Profile. Ph. D. Thesis for Hong Kong University of Science and Technology, Hong Kong, Jan. 2011.
Chandler, Gary Jesse Howard, Growth of Whiskers in the Indium-Tin Alloy System and the effect of Elastic Strain on Tc in alpha Indium-Tin. Master's Thesis for Clemson University, Clemson, SC, Aug. 1972.
Chang, Won, CSP Drop Test Performance Comparison for Different Solder Ball Materials . Master's Thesis for San Jose State University, San Jose, CA, May 2005.
Chao, Huang-Lin, Electromigration Enhanced Kinetics of Cu-Sn Intermetallic Compounds in Pb Free Solder Joints and Cu Low-k Dual Damascene Processing Using Step and Flash Imprint Lithography. Ph. D. Thesis for the University of Texas at Austin, Austin, TX, May 2009.
Chapaneri, Roshan, A Study of Hexavalent and Trivalent Chromium Conversion Coatings on Zinc Surfaces. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, 2010.
Chauhan, Preeti Singh, Microstructural Characterization and Thermal Cycling Reliability of Solders under Isothermal Aging and Electrical Current. Ph. D. Thesis for University of Maryland, College Park, MD, 2012.
Chavali, Sri Chaitra Jyotsna, Diffusion Driven Microstructural Evolution And Its Effect On Mechanical Behavior Of Sn-Ag-Cu Solder Alloys. Ph. D. Thesis for Purdue University, West Lafayette, IN, Dec. 2012.
Chaware, Raghunandan, Underfill Process Development for Lead Free Flip Chip Assembly. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2004.
Chen, Kai, Synchrotron polychromatic X-ray Laue microdiffraction studies of electromigration in Al (Cu) interconnects and Pb-free solder joints. Ph. D. Thesis for University of California, Los Angeles, CA, 2009.
Chen, Wei-Hsun, Evaluation of Local Anisotropic Elasticity and Thermal Expansion on Whisker Formation Sites in beta-tin Thin Films. Ph. D. Thesis for Purdue University, West Lafayette, IN, Aug. 2014.
Cheng, Jing, Tin Whiskers in Electronic Packaging: Mechanism and Modeling. Ph. D. Thesis for University of Rochester, Rochester, NY, 2011.
Chennagiri, Gurudutt, Rework of Lead-Free Area Array Packages Assembled on Ultra-thin Flexible Substrates. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.
Chin, Erica, Templated Synthesis and Characterization of Multi-segmented Nanowires for Sensor and Optical Device Applications. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, 2009.
Chin, Melida, Electrical Contact Resistance of Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging. Ph. D. Thesis for University of Michigan, Ann Arbor, MI, 2005.
Choi, Daechul, Statistical and Physical Analyses of Electromigration-induced Failure in Lead-free Flip Chip Solder Joints. Ph.D. Thesis for University of California, Los Angeles, CA, 2011.
Choi, Sunglak, An Investigation of Aging Kinetics and Creep Deformation in Composite Solders with In-Situ Particulate Reinforcements. Master's Thesis for Michigan State University, East Lansing, MI, 1997.
Choi, Sunglak, Studies on In-Situ Particulate Reinforced Sn-Ag Composite Solders Relevant to Thermomechanical Fatigue Issues. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2001.
Choi, Woojin, Reliability of Pb-free Solders in Electronic Packaging Technology . Ph. D. Thesis for University of California, Los Angeles, CA, 2002.
Choubey, Anupam, Microstructural Changes Under Isothermal Aging and Their Influence on Thermal Fatigue Reliability for Tin-Lead and Lead-Free Solder Joints, Including Microstructural Changes Under Isothermal Aging in Mixed Solder Joints. Ph. D. Thesis for University of Maryland, College Park, MD, 2007.
Choudhuri, Deep, Influence of Nano-structured Chemicals on the Microstructures and Mechanical Reliability of Lead-Free Tin-Based Solders. Ph. D. Thesis for Michigan State University, MI, 2009.
Chowdhury, Md Mahmudur Rahman, Mechanical Characterization and Aging Induced Evolution of Cyclic Properties and Microstructure of Lead-Free Solder Materials. Ph. D. Thesis for Auburn University, Auburn, AL, May 2, 2020.
Ciocci, Richard C., Assessing the Migration to Lead-Free Electronic Products. Ph. D. Thesis for University of Maryland, College Park, MD, 2001.
Clore, Nicholas G., Identification and Counting Procedure for Tin Whiskers, Hillocks, and Other Surface Defects. Master's Thesis for Purdue University, Hammond, IN, Dec. 2011.
Collins, Andrew, Corrosion Inhibition for an Aluminum Substrate Bonded with an Electrically Conductive Adhesive. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, 2003.
Cool, Raymond D., The Kinetics of Polymorphic Transitions of Solids. Ph. D. Thesis for University of Virginia, Charlottesville, VA, 1928.
Courey, Karim J., An Investigation of the Electrical Short Circuit Characteristics of Tin Whiskers. Ph. D. Thesis for University of Miami, Coral Gables, FL, May 2008.
Crandall, Erika R., Factors Governing Tin Whisker Growth. Ph. D. Thesis for Auburn University, Auburn, AL, 2012.
Crandall, Michael Adam, Effect of Intermetallic Growth on Durability of High Temperature Solders (SnAg, SAC305, SAC+Mn, SnAg+Cu Nano) in Thermal and Vibration Environments . M.S. Thesis for University of Maryland, College Park, MD, 2011.
Crum II, John Alan, Production of Tin and Tin-based Alloy Spheres via Multi-Orifice Uniform Droplet Spraying. Master's Thesis for Northeastern University, Boston, MA, Apr. 2012.
Cuddalorepatta, Gayatri, Evolution of the Microstructure and Viscoplastic Behavior of Microscale SAC305 Solder Joints as a Function of Mechanical Fatigue Damage. Ph. D. Thesis for University of Maryland, College Park, MD, 2010.
Dandu, Pridhvi, Finite Element Modeling on Electromigration of Solder Joints in Wafer Level Packages. Master's Thesis for Lamar University, Beaumont, TX, Aug. 2009.
Dang, Tung C., Lead-Free Solders in Surface Mount Electronic Assemblies: Designs for Quality and Reliability. Master's Thesis for California State University, Dominguez Hills, CA, Fall 2011.
Darbandi, Payam, Crystal Plasticity Finite Element Analysis of Deformation Behaviour in SAC305 Solder Joint. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2014.
Delhaise, Andre, Solid-State Diffusion of Bismuth in Tin-Rich, Lead-Free Solder Alloys . Ph. D. Thesis for University of Toronto, Toronto, Canada, 2018.
Desrochers, Brigitte, Reliability of Soldered Joints for Aerospace Applications. Master's Thesis for Ryerson University, Toronto, Ontario, Canada, 2007.
Deubzer, Otmar, Explorative Study into the Sustainable Use and Substitution of Soldering Metals in Electronics: Ecological and Economical Consequences of the Ban of Leas in Electronics and Lessons to Be Learned for the Future. Graad van Doktor (Ph. D.) Thesis for Technische Universiteit Delft, Delft, Nederland, 2007.
Dhakal, Ramji, Failure Mechanism of Lead-Free Sn-Ag-Cu Solder BGA Interconnects. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2005.
Dhakal, Ramji, Microstructure Based Experimental and Finite Element Analysis of Failure Mechanism of Pb-Free BGA Interconnects. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2008.
Dhiman, Rajat, Design and Qualification of a Robust Polyurethane Based Conformal Coating Process for SODIMMs. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2018.
Diaz Gonzalez, Alfredo J., Pb-Free Electronics: From Nanotechnology to Combinatorial Materials Science. Master's Thesis for University of Puerto Rico, Mayaguez, Puerto Rico, 2013.
Dimitrovska, Aleksandra, Mitigation Strategies of Tin(Sn) Whisker Growth, Ph. D. Thesis for Southern Methodist University, Dallas, TX, December 19, 2009.
Ding, Fei, Flip Chip and Lid Attachment Assembly Process Development. Ph. D. Thesis for Auburn University, Auburn, AL, Dec. 15, 2006.
Ding, Min, Investigation of Electromigration Reliability of Solder Joint in Flip-Chip Packages. Ph. D. Thesis for the University of Texas at Austin, Austin, TX, Aug. 2007.
Doerk, Gregory Stephen, Synthesis, Characterization, and Integration of Silicon Nanowires for Nanosystems Technology. Ph. D. Thesis for University of California, Berkeley, Berkeley, CA, Fall 2010.
Dong, Fei, Polyurethane-Based Conformal Coatings for Tin Whisker Mitigation. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2018.
Dong, Jaimee Ilene, The Effects of the Transition from Tin-lead to Lead-free Solder on Metal Flow in the United States. Ph. D. Thesis for Yale University, New Haven, CT, May 2008.
Du, Yingjie, Mechanical Properties Characterization of Lead-Free Solder Bumps and Ultra-Low-K Dielectrics by Nanoindentation. Ph. D. Thesis for University of Texas at Dallas, Dallas, TX, May 2015.
Dudek, Martha A., Microstructure, Mechanical and Oxidation Behavior of RE-containing Pb-free Solders. Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2009.
Edington, Joe Don, Development and Characterization of Cerium Oxide Coatings Deposited by Spontaneous Processes on Metallic Substrates. Ph. D. Thesis for University of Missouri - Rolla, Rolla, MS, 2004.
Ege, Efe Sinan, Thermo-mechanical Properties and Integrity of Metallic Interconnects in Microelectronics. Ph. D. Thesis for University of New Mexico, Albuquerque, NM, Dec. 2003.
Elbarbary, Mostafa, Elasto-Plastic Material Properties of Lead-Free Solder by Finite Element Analysis and Nanoindentation Test. Master's Thesis for Lamar University, Beaumont, TX, May 2018.
Emery, Robert Thomas, Isotropic Conductive Adhesives for Use in the Microelectronics Industry . Master's Thesis for University of Toronto, Toronto, Canada, 1996.
Faizan, Mohammad, Experimental Study and Modeling of Metal Dissolution and Intermetallic Compound Growth During Soldering. Ph. D. Thesis for University of Akron, Akron, OH, Dec. 2007.
Fallah-Adl, Ali, Development of a Robust and Integrated Methodology for Predicting the Reliability of Microelectronic Packaging Systems. Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2013.
Fang, Tong, Tin Whisker Risk Assessment Studies. Ph. D. Thesis for University of Maryland, College Park, MD, 2005.
Fei, Huiyang, Multiscale Modeling of Mechanical Shock Behavior of Environmentally-Benign Lead-Free Solders in Electronic Packaging. Ph. D. Thesis for Arizona State University, Tempe, AZ, August 2011.
Feyissa, Frezer Assefa, A Reliability Study on Tin Based Lead Free Microjoint Including Intermetallics and Void Evolution. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2015.
Fiedler, Brent Alan, Fatigue Failure Kinetics and Structural Changes in Lead-Free Interconnects due to Mechanical and Thermal Cycling. Ph. D. Thesis for Northwestern University, Evanston, IL, June 2010.
Fojas, Paul B., The Influence of Cold Work on the Wettability of Pb-Free Solders on Copper. Master's Thesis for San Jose State University, San Jose, CA, Dec. 2002.
Forest, Louis, Soudures Sans-Plomb Pour la Microelectronique. Master's Thesis for Ecole Polytechnique de Montreal, Montreal, Canada, Apr. 2008.
Fountoukidis, Evangelos, Thermo-Mechanical Response of Monolithic and NiTi Shape Memory Alloy Fiber Reinforced Sn-3.8Ag-0.7Cu Solder. Masters Thesis for Naval Postgraduate School, Monterey, CA. Sept. 2005.
Fukuda, Yuki, Experimental Investigations of Whisker Formation on Tin Platings . Ph. D. Thesis for University of Maryland, College Park, MD, 2005.
Gagliano, Robert Andrew, Characterization of the Growth Behavior of Cu-Sn Intermetallics in Liquid Tin/Solid Copper Reaction Couples. Ph. D. Thesis for Northwestern University, Evanston, IL, Dec. 2002.
Gan, Hua, Polarity Effect of Electromigration on Intermetallic Compound (IMC) Formation in Pb-free Solder V-groove Samples. Ph. D. Thesis for University of California, Los Angeles, CA, 2004.
Gao, Fan, Fundamental Investigation and Development of Lead-Free Nanosolders for Nanowire Assembly and Nano-Joining. Ph. D. Thesis for University of Massachusetts Lowell, Lowell, MA, 2012.
Gao, Fan, Lead-Free Nano-solders on Metallic Nanowires: Synthesis, Characterization, and Thermal Reflow Properties. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, April 21, 2009.
Gao, Mao, The Intermetallic Formation and Growth Kinetics at the Interface of Near Eutectic Sn-Ag-Cu Solder Alloys and Au/Ni Metallization. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2010.
George, Elviz, Thermal Cycling Reliability of Lead-Free Solders (SAC305 and Sn3.5Ag) for High Temperature Applications. Master's Thesis for University of Maryland, College Park, MD, 2010.
Ghorbani, Hamid Reza, Analytical Modeling of Thermal Stresses in Solder Joints - Application to Reliability Prediction. Ph. D. Thesis for University of Toronto, Toronto, Canada, 2006.
Ghosh, Santaneel, A Non-contact Measurement Technique at the Micro Scale. Ph. D. Thesis for University of Arizona, Tucson, AZ, 2005.
Ghosh, Santanu, Finite Element Analysis of Moisture and Thermal Induced Stress in Flip Chip Packages. Master's Thesis for University of Texas at Arlington, Arlington, TX, May 2006.
Gill, Amares Singh, Influence of Alumina and Titanium Dioxide Nanoparticles Reinforcement on Sn-3.0Ag-0.5Cu and Sn-58Bi Solder Alloys. Master's Thesis for Multimedia University, Malaysia, July 2015.
Godbole, Gaurav Vinod, Pad Cratering: Characterizing Crack Propagation and the Effects of Humidity and Reflow on Reliability. Master's Thesis for State University of New York at Binghamton, Binghamton University, Binghamton, NY, 2009.
Goland, Allen Nathan, Thermoelectric Properties of Gray Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, Aug. 1956.
Goldstein, Julia L. Freer, Microstructural Development and Mechanical Behavior of Eutectic Bismuth-Tin and Eutectic Indium-Tin in Response to High Temperature Deformation (Lawrence Berkeley Laboratory Report LBL 34909). Ph. D. Thesis for University of California, Berkeley, CA, Nov. 1993.
Gong, Jicheng, Microstructural Features and Mechanical Behaviour of Lead Free Solders for Microelectronic Packaging. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, 2007.
Gopakumar, Sunil, An Experimental Approach to Develop Process Windows for Lead-Free Flip Chip Assembly from a Yield and Reliability Perspective. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2003.
Gordon, Matthew, A Nacreous Self-Assembled Nanolaminate for Corrosion Resistance on 2024-Al Alloy. Masters Thesis for Virginia Polytechnic Institute and State University, Blacksburg, VA, May 24, 2001.
Gosavi, Mridula, Reliability Testing and Modeling of Linear Image Sensor Devices. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2006.
Greene, Christopher M., Lead-Free Solder Paste Printing for EMS Providers. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2001.
Greenlaw, Tamara, Cross-Functional Environmental Initiatives: Addressing Restriction of Hazardous Substance (RoHS) Technical Challenges at Sun Microsystems. Master's Thesis for Massachusetts Institute of Technology, Cambridge, MA, June 2005.
Gregory, Patrice Belnora, Comparison of Interconnect Failures of Electronic Components Mounted on FR-4 Boards with Sn37Pb and Sn3.0Ag0.5Cu Solders Under Rapid Loading Conditions. Ph. D. Thesis for University of Maryland, College Park, MD, 2010.
Groen, Luiken Jan, Kinetiek van de Allotrope Omzetting in Tin. Echeikundig Ingenieur Thesis, Delft, Netherlands, Oct. 31, 1956.
Gu, Huandi, Interfacial Reaction of Sn-Based Solder Joint in the Package System . Master's Thesis for University of Texas at Arlington, Arlington, TX, Aug. 2014.
Guinane, James, Rework Methods for Stacked PCB SMT Assemblies. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2008.
Gullapalli, Vikranth, Study of Metal Whiskers Growth and Mitigation Technique using Additive Manufacturing. Master's Thesis for University of North Texas, Denton, TX, Aug. 2015.
Guo, Fu, Studies on Lead-Free Solders Reinforced with Mechanically-Incorporated Cu, Ag, and Ni Particles. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2002.
Guo, Weiqing, Testing Methodology for Reflow Soldering Process Compatibility Evaluation of Surface Mount Technology. Ph. D. Thesis for University of Texas at Austin, Austin, TX, May 2001.
Guruprasad, Pradosh, Comparison of High Speed Impact Test of Solder Joints with Board Level Drop Test. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2013.
Hamid, Mohd Foad Abdul, Thermomigration: An Experimental Damage Mechanics Study on Nanoelectronic Lead-Free Solder Alloys. Ph. D. Thesis for State University of New York at Buffalo, Buffalo, NY, May 2008.
Han, Chunfen, Electrodeposition of Pb-free, Sn-based Alloy Solder Films. Ph. D. Thesis for University of Alberta, Edmonton, Canada, Fall 2009.
Han, Jung Kyu, Effect of Thermo-Electromigration on Copper Dissolution and Intermetallic Compound Formation in Flip-Chip Pb-free Solder Joints. Ph. D. Thesis for University of California, Los Angeles, CA, 2011.
Han, Sungwon, Assessment of an Electrical Shorting and Metal Vapor Arcing Potential of Tin Whiskers. Ph. D. Thesis for University of Maryland, College Park, MD, 2012.
Haspel, Dan, Developing a Dual-Layer System for the Mitigation of Tin Whiskers . Ph. D. Thesis for LOUGHBOROUGH University, Loughborough, United Kingdom, 2018.
Haswell, Peter Lewis, Durability Assessment and Microstructural Observations of Selected Solder Alloys. Ph. D. Thesis for University of Maryland, College Park, MD, 2001.
Hegde, Pradeep, Mechanical Behaviour and Reliability of Sn3.8Ag0.7Cu Solder for a Surface Mount Assembly. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, Dec. 2008.
Hensler, Donald Henry, Oscillatory Microwave Magnetoconductivity in Gray Tin. Ph. D. Thesis for University of Wisconsin, Madison, WI, Jan. 1963.
Hinkley Jr., Everett David, Oscillatory Magnetoresistance in Gray Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1963.
Hodges, S. LeAnn, Evaluation of Lead Free Solder and No-Clean Flux for Attachment of High Power Components to Direct Bond Copper. Master's Thesis for University of Kentucky, Lexington, KY, 1996.
Horvath, Barbara, Examination of Tin Whisker Growth in Electronic Assemblies. Ph. D. Thesis for Budapest University of Technology and Economics, Budapest, Hungary, 2012.
Hossain, Mohammad Masum, Development of Constitutive Equation Parameters and Reliability Evaluations of SnAgCu Interconnects. Ph. D. Thesis for University of Texas, Arlington, TX, May 2006.
How, Yew Seng, Modeling of Impression Testing to Obtain Mechanical Properties of Lead-Free Solders Microelectronic Interconnects. Masters Thesis for Naval Postgraduate School, Monterey, CA. Dec. 2005.
Huang, Xingjia, Investigation and Analysis on the Solder Ball Shear Strength of Plastic Ball Grid Array, Chip Scale, and Flip Chip Packages with Eutectic Pb-Sn and Pb-free Solders. Ph. D. Thesis for Hong Kong University of Science and Technology, Hong Kong, Jan. 2003.
Huang, Zhe, Fracture of Lead-Free Solder Joints for Electronic Applications: Effects of Material, Processing and Loading Conditions. Ph. D. Thesis for Washington State University, Washington, May 2013.
Huang, Zhiheng, Materials Issues in the Transition to Lead-Free Solder Alloys and Joint Miniaturization. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, Sept. 2005.
Hughes, William L., Synthesis and Characterization of Zinc Oxide Nanostructures for Piezoelectric Applications. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, Dec. 2006.
Hwang, Tae-Kyung, Effects of microstructure on material behaviors and fatigue properties of lead-free solder materials. Ph. D. Thesis for Korea Advanced Institute of Science and Technology, Daejeon, Korea, Nov. 28, 2006.
Ibitayo, Oladimeji Olalekan, Evaluation of Various Die-Attachment Materials and Processes for Power Electronics Packaging. Master's Thesis for Howard University, Washington, D.C., Dec. 2008.
Islam, Md Syful, Peripheral Soldering of Flip Chip Joints on Passive RFID Tags. Ph. D. Thesis for University of Nevada, Las Vegas, NV, May 2011.
Islam, Mohd Nokibul, Investigations on Damage Mechanics and Life Prediction of Fine-Pitch Electronics in Harsh Environments. Ph. D. Thesis for Auburn University, Auburn, AL, Aug. 8, 2005.
Iyer, Ganesh R., Role of Intermetallics for Both Tin-Lead and Lead-Free Solder Structures and Its Solder Pad Combination. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2005.
Iyer, Satyanarayan Shivkumar, Assembly, Reliability, and Rework of Stacked CSP Components. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2008.
Jadhav, Susheel Ganeshrao, Stress Relaxation in Lead-Free Solder Joints. Master's Thesis for Michigan State University, East Lansing, MI, 2001.
Jafreen, Rifat, A Cost Model for Assessing the Transition to Lead-Free Electronics . Master's Thesis for University of Maryland, College Park, MD, 2008.
Jain, Sameer, Research and Application of a Thermal Management Device (CoolCap(TM)) for Electronic Assemblies. Master's Thesis for State University of New York, Binghamton, NY, 2006.
Jain, Sujit, Green Synthesis and Applications of Polyaniline Derivatives. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, 2009.
Jakkali, Vaidehi, Finite Element Modeling of the Effect of Reflow Porosity on the Mechanical Behavior of Pb-free Solder Joints. Master's Thesis for Arizona State University, Tempe, AZ, Dec. 2011.
Janiuk, Szymon, Tin Whisker Growth and Mitigation with a Nanocrysytalline Nickel Coating . Master's Thesis for University of Toronto, Toronto, Ontario, Canada, 2015.
Jaradat, Younis, Reliability of SnAgCu and Mixed Solders under Variable Loading Conditions. Ph. D. Thesis for State University of New York, Binghamton, NY, 2012.
Jiang, Hongjin, Synthesis of Tin, Silver and Their Alloy Nanoparticles for Lead-Free Interconnect Applications. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, Apr. 2008.
Jiang, Tong, Modeling of Failure Mechanism and Life Prediction of Lead-Free BGA Solder Joint under Repetitive Mechanical Drop Loading. Ph. D. Thesis for Hong Kong University of Science and Technology, Hong Kong, Sept. 2012.
Johnson, Michael R., Evaluating Remanufacturing and Demanufacturing for Extended Producer Responsibility & Sustainable Product Management. Ph. D. Thesis for University of Windsor, Windsor, Ontario, Canada, Jan. 2002.
Joshi, Rahul V., Thermo-mechanical Behavior of Tin-Lead and Lead-Free Ceramic Column Grid Array Packages. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2005.
Joshi, Shantanu M., On Controlling and Correlating Microstructure of Pb-Free Solder Joints to Reliability under Accelerated Loading Conditions. Master's Thesis for State University of New York at Binghamton, Binhamton, NY, 2013.
Juarez, Joseph Moses, Accelerated Life Testing of Electronic Circuit Boards with Applications in Lead-Free Design. Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2012.
Kabade, Rajendra R., Metallurgical Investigation of Ag-Cu-Sn Lead-Free Solder with the Addition of Au. Master's Thesis for University of Texas at Arlington, Arlington, TX, Aug. 2003.
Kagwade, Sanjay Vasudeo, Surface Analytical and Electrochemical Studies of Aircraft Alloy Pretreatments and their Influence on Corrosion. Ph. D. Thesis for State University of New York, Stony Brook, NY, Dec. 1997.
Kaila, Rishi, Investigation of Mixed Solder Assemblies & Novel Lead-Free Solder Alloys. Master's Thesis for University of Toronto, Toronto, Canada, 2011.
Kalkundri, Kaustubh Jayant, Investigation of Electromigration Behavior in Lead-Free Flip Chip Solder Bumps. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2010.
Kannammal Palaniappan, Sakthi Cibi, A Study on Process, Strength and Microstructure Analysis of Low Temperature SnBi-Containing Solder Pastes Mixed with Lead-free Solder Balls . Master's Thesis for Rochester Institute of Technology, Rochester, NY, Sept. 2016.
Kao, Hui-Ju, Effect of Cu additives on Sn whisker formation and interfacial reaction of Sn(Cu) finishes. Master's Thesis for National Central University, Jhong-Li, Taiwan, May 23, 2005.
Karunakaran, Deepak, 3D modeling of void nucleation and initial void growth due to Tin diffusion as a result of electromigration in polycrystalline lead-free solders . Master's Thesis for Arizona State University, Tempe, AZ, Aug. 2016.
Katsis, Dimosthenis C., Thermal Characterization of Die-Attach Degradation in the Power MOSFET . Ph. D. Thesis for Virginia Polytechnic Institute and State University, Blacksburg, VA, Jan. 16, 2003.
Kaushik, Muthur Srinath Purushotham, A Statistically Based Evaluation of Creep and Shear Behaviour of Monolithic and Composite Lead Free Solders for Microelectronic Applications . Master's Thesis for University of Texas at Arlington, Arlington, TX, Dec. 2004.
Keimasi, Mohammadreza, Flex Cracking and Temperature-Humidity-Bias Effects on Reliability of Multilayer Ceramic Capacitors. Ph. D. Thesis for University of Maryland, College Park, MD, 2007.
Kelly, Marion Branch, 4D Microstructural Characterization of Electromigration and Thermal Aging Damage in Tin-Rich Solder Joints. Ph. D. Thesis for Arizona State University, Tempe, AZ, July 2019.
Khasawneh, Saif S., Towards a Quantitative Mechanistic Understanding of Thermal Cycling of Lead-Free Solder Joints. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2014.
Killefer, Morgan, Whisker Growth Induced by Gamma Radiation on Glass Coated with Sn Thin Films. Master's Thesis for University of Toledo, Toledo, OH, Aug. 2017.
Kim, Dong Hyun, Reliability Study of SnPb and SnAg Solder Joints in PBGA Packages . Ph. D. Thesis for The University of Texas at Austin, Austin, TX, Dec. 2007.
Kim, Dongwook, Fluxless Flip Chip Bonding Processes and Aerial Fluxless Bonding Technology. Ph. D. Thesis for University of California, Irvine, CA, 2004.
Kim, Harqkyun, Wetting Kinetics and Interfacial Reaction of Lead(Pb)-based and lead(Pb)-free Solder Alloys on Cu and Ni Metallizations in Electronic Packaging. Ph. D. Thesis for University of California, Los Angeles, CA, 1996.
Kim, Hye-Rim, Growth and Low Frequency Noise Properties of Grey Tin Films. Ph. D. Thesis for Cornell University, Ithaca, NY, May 1991.
Kim, Jeong-Min, Effect of Aging on the Transformation of Phases in Solder Joint of PBGA Packaging. Master's Thesis for University of Texas at Arlington, Arlington, TX, Dec. 2009.
Kim, Jongsung, Fluxless Bonding Technology Using Electroplated Multilayer Solder Structures. Ph. D. Thesis for University of California, Irvine, CA, 2007.
Kim, Patrick Gu-Ho, Wetting Behaviors and Interfacial Reactions of Pb-containing and Pb-free Solder Alloys on Au, Pd, Ni Foils, Leadframes, and Under Bump Thin Film Metallizations in Electronic Packaging. Ph. D. Thesis for University of California, Los Angeles, CA, 1998.
Kindesjo, Ulrika, Phasing out lead in solders: An assessment of possible impacts of material substitution in electronic solders on the recycling of printed circuit boards. Master's Thesis for University of Lund, Lund, Sweden, Oct. 2002.
Kinney, Christopher Charles, The Effect of an Imposed Current on the Creep of SnAgCu Interconnects . Ph. D. Thesis for University of California, Berkeley, CA, Fall 2009.
Kinyanjui, Robert Kamau, Thermal Processes and Solidification Kinetics of Evolution of the Microstructure of Sn-xAg-yCu (0 <=x<=4.0; 0<=y<=1.4) Solder Alloys. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2005.
Kirkpatrick, Timothy, The Kinetics of Tin Solidification in Lead-Free Solder Joints. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2006.
Kohnke, Elton Everett, Electrical Conductivity, Magnetoresistance, and Hall Effect in Gray Tin Filaments. Ph. D. Thesis for Northwestern University, Evanston, IL, July 1955.
Koppes, John Patrick, Effect of Crystallographic Orientation on Hillock Formation in Thermally Cycled Large Grain Tin Films. Ph. D. Thesis for Purdue University, West Lafayette, IN, Aug. 2012.
Kosiba, Eva, Characterization of Low Melting Temperature, Low-Ag, Bi-Containing, Pb-Free Solder Alloys. Master's Thesis for University of Toronto, Toronto, Canada, 2016.
Kumar, Santosh, Microvoid Formation and Kirkendall Effect in Lead-Free Solder Joints , Ph. D. Thesis for Purdue University, West Lafayette, IN, Aug. 2010.
Ladani, Leila Jannesari, Damage Initiation and Evolution in Voided and Unvoided Lead Free Solder Joints Under Cyclic Thermo-mechanical Loading. Ph. D. Thesis for University of Maryland, College Park, MD, 2006.
Lam, Carl, Integrating Hazardous Materials Characterization and Assessment Tools to Guide Pollution Prevention in Electronic Products and Manufacturing. Ph. D. Thesis for University of California, Davis, CA, 2011.
Lara, Leticia, Effect of Grain Orientation on Electromigration in Sn-0.7Cu Solder Joints. Master's Thesis for Arizona State University, Tempe, AZ, Dec. 2013.
Lavine, Charles Frederic, Two-band Galvanomagnetic Effects in Gray Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1968.
Lee, Hoyong, Avionics Reliability Assurance Guidelines for High Altitude Applications . Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2012.
Lee, Jong-Gi, Investigation of Thermomechanical Fatigue (TMF) Behavior in Tin-Silver Based Solder Joints. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2005.
Lee, Kyuoh, Development of Thermo-Mechanically Reliable Lead-Free Solder Alloys . Ph. D. Thesis for University of California, Berkeley, CA, Fall 2007.
Lee, Taekyeong, Electromigration and Solid State Aging of Flip Chip Solder Joints and Analysis of Sn Whisker on Lead-frame. Ph. D. Thesis for University of California, Los Angeles, CA, 2001.
Lee, Yuri, Constitutive Property Testing and Reliability Assessment of Lead-Free Solder Joint. Master's Thesis for University of Maryland, College Park, MD, 2010.
Leung, Wai-Bor, Electronic Properties of Gray Tin in the Presence of an External Magnetic Field. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1974.
Levo, Timothy James, Drop Test Energy Relationship to Reliability. Master's Thesis for State University of New York, Binghamton, NY, 2009.
Li, Dezhi, Properties and Behaviour of Pb-Free Solders in Flip-Chip Scale Solder Interconnections. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, Aug. 2005.
Li, Haiying, Study of Thermally Reworkable Epoxy Materials and Thermal Conductivity Enhancement Using Carbon Fiber for Electronics Packaging. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, Nov. 2003.
Li, Jing, Evaluation and Improvement of the Robustness of a PCB Pad in a Lead-Free Environment. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.
Li, Li, Basic and Applied Studies of Electrically Conductive Adhesives. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 1995.
Li, Shidong, A Multi-Scale Damage Mechanics Framework for Nanoelectronics Interconnects and Solder Joints. Ph. D. Thesis for State University of New York at Buffalo, Buffalo, NY, 2009.
Li, Yi, High Performance Electrically Conductive Adhesives (ECAs) for Leadfree Interconnects. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, Dec. 2007.
Li, Yuquan, Flip Chip and Heat Spreader Attachment Development. Ph. D. Thesis for Auburn University, Auburn, AL, May 9, 2009.
Li, Zhaozhi, A Novel Three Dimensional Wafer Level Chip Scale Packaging Technology- Manufacturing Process Development and Reliability Characterizations. Ph. D. Thesis for Auburn University, Auburn, AL, Aug. 9, 2010.
Lin, Dechao, Development of Lead-Free Solders Reinforced by Nanoparticles. Ph. D. Thesis for Southern Methodist University, Dallas, TX, May 20, 2006.
Lin, Xuan, An Environmentally Compliant Cerium-Based Conversion Coating for Aluminum Protection. Ph. D. Thesis for University of Missouri - Rolla, Rola, MO, 1998.
Linares, Xioranny, The Influence of Sn Orientation on the Electromigration of Idealized Lead-free Interconnects. Ph. D. Thesis for University of California, Berkeley, CA, Summer 2015.
Lindquist, Rolf Eugene, The Infrared Optical Properties of Single-crystal Gray Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1963.
Linteau, Mark W., Impression Creep in Near Eutectic Tin-Lead and Tin-Silver Solders . Master's Thesis for University of Texas at Arlington, Arlington, TX, May 1997.
Liu, Li, Deposition and Application of Electroless Ni-W-P Under Bump Metallisation for High Temperature Lead-Free Solder Interconnects. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, Nov. 2016.
Liu, Pilin, Roles of Interfacial Reaction on Mechanical Properties of Solder Interfaces. Ph. D. Thesis for University of Illinois at Urbana-Champaign, Urbana, IL, 2004.
Liu, Yingxia, Reliability Studies of Pb-Free Solder Joints Down to 1 um in Diameter . Ph. D. Thesis for University of California, Los Angeles, CA, 2016.
Liu, Yueli, Lead-Free Assembly and Reliability of Chip Scale Packages and 01005 Components. Ph. D. Thesis for Auburn University, Auburn, AL, May 11, 2006.
Lohokare, Saurabh, A Novel Conductive-Polymer-Based Integration Process for High-Performance Flip-Chip Packages. Ph. D. Thesis for University of Delaware, Newark, DE, Summer 2004.
Loomans, Michael Eugene, Phase Equilibria in Potential Pb-Free Solder Alloy Systems. Ph. D. Thesis for Northwestern University, Evanston, IL, Dec. 1999.
Lu, Daoqiang, Fundamental Understanding of Electrically Conductive Adhesives (ECA's) . Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, July 2000.
Lu, Yuan, Effect of Ag and Cu on Sn-x%Ag-y%Cu Interconnects. Ph. D. Thesis for Wayne State University, Detroit, MI, 2006.
Ma, Hongtao, Characterization of Lead-Free Solders for Electronic Packaging. Ph. D. Thesis for Auburn University, Auburn, AL, 2007.
Madeni, Juan Carlos, Mechanical properties and kinetics of intermetallics growth in four lead-free solder alloys, Sn-3.2Ag-0.8Cu, Sn-3.5Ag, Sn-0.7Cu and Sn-8.9Zn, applied to copper substrates. Master's Thesis for Colorado School of Mines, Golden, CO, Nov. 1, 2002.
Maganty, Suraj, Enhanced Conformal Coatings for Tin Whisker Mitigation. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2017.
Mahan, Kenneth Howard, Advanced Adhesion Strength Testing Methods of Thin Film Multilayers in Electronic Packaging Systems. Ph. D. Thesis for University of Maryland, College Park, MD, 2016.
Mahim Shirazi, Sam, Toward a mechanistic understanding of the damage evolution of SnAgCu solder joints in accelerated thermal cycling test. Ph. D. Thesis for State University of New York at Binghamton, 2015.
Majeed, Sulman, Rework & Reliability of Area Array Component. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2009.
Mallampati, Sandeep, High Bismuth Alloys as Lead-Free Alternatives for Interconnects in High-Temperature Electronics. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2017.
Mao, Jie, Nucleation Promotion of Sn-Ag-Cu Lead-Free Solder Alloys via Micro Alloying. Ph. D. Thesis for Rensselaer Polytechnic Institute, Troy, NY, Apr. 2014.
Marquez de Tino, Ursula, Reduction of Nitrogen Consumption of Lead-Free Reflow Processes and Prediction Models for Behaviors of Lead-Free Assemblies. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2009.
Mathai, Elizabeth, Optical Studies of Crystal Surfaces -Tellurium and Zinc-Antimony. Ph. D. Thesis for Maharaja Sayajirao University of Baroda, Vadodara, India, May 1971.
Matijevic, Ivan, Characterization of the Solvus Transformation in Ternary and Quaternary Bismuth Containing Lead-Free Solder Alloys. Master's Thesis for University of Toronto, Toronto, Canada, 2017.
Matin, Md. Abdul, Microstructure evolution and thermomechanical fatigue of solder materials. Ph. D. Thesis for Technische Universiteit Eindhoven, Eindhoven, Netherlands, Nov. 16, 2005.
Mavoori, Hareesh, Mechanical Properties and Fatigue Lifetime Prediction of Solders for Electronic Applications: Tin-Silver and Tin-Zinc Eutectics. Ph. D. Thesis for Northwestern University, Evanston, IL, 1996.
McCabe, Rodney James, Creep of InSb and SbSn Strengthened Tin-based Alloys: Effect of Precipitate Size, Shape, and Spacing. Ph. D. Thesis for Northwestern University, Evanston, IL, Dec. 2000.
McDougall, Jeffrey Lee, An Analysis of Global and Localized Creep Strains and Creep Properties of Non-Composite and Composite Lead-Free Solders at Room and Elevated Temperatures. Master's Thesis for Michigan State University, East Lansing, MI, 1998.
Mei, Yuhai, Stress Evolution in a Conductive Adhesive during Curing and Cooling . Ph. D. Thesis for University of Michigan, Ann Arbor, MI, 2000.
Mertens, James Charles Edwin, Quantifying Electromigration Processes in Sn-0.7Cu Solder with Lab-Scale X-Ray Computed Micro-Tomography. Ph. D, Thesis for Arizona State University, Tempe, AX, 2015.
Miller, Chad M., Development of a new Pb-free solder: Sn-Ag-Cu. MS Thesis for Iowa State University, Ames, IA, Feb. 10, 1995, IS-T-1728.
Mirza, Fahad, Investigation of the Impact Response of Lead-Free Electronic Assemblies and Comparison of Drop with Cyclic 4-point Bend Test. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.
Moon, Sungwook, Magnetically Aligned Z-Axis Anisotropic Conductive Adhesive and Its Applications. Ph. D. Thesis for Purdue University, West Lafayette, IN, Aug. 2010.
Morose, Gregory J., Electronics Assembly, Rework, and Reliability Evaluation Using Lead-Free Soldering Materials, Halogen-Free Laminate Materials, and Surface Finishes with Nanomaterials. Sc. D. Thesis for University of Massachusetts Lowell, Lowell, MA, 2008.
Morris, Eric Leon, Use of Cerium-Based Inhibitors in Electrochemically Deposited Coatings for the Corrosion Protection of Aluminum Alloys. Ph. D. Thesis for University of Missouri - Rolla, Rolla, MO, 2000.
Mudge Jr., Wilbur L., Kinetics of the alpha to/from beta Transformation of Pure Tin. Master's Thesis for University of Pennsylvania, Philadelphia, PA, June 1949.
Mukherjee, Shantanu, Lead-Free Wave Soldering of 'Thick' PCB Using Sn 3.8%Ag 0.07%Cu and No-Clean VOC-Free Flux. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.
Mukherjee, Subhasis, Multiscale Modeling of Anisotropic Creep Response of SnAgCu Single Crystal. Ph. D. Thesis for University of Maryland, College Park, MD, 2015.
Munukutla, Aravind, Tensile Properties of Lead Free Solders. Master's Thesis for University of Texas at Arlington, Arlington, TX, Dec. 2004.
Muza, Anthony R., Lead-Free Solutions for High and Low Temperature Solder Interconnects . Master's Thesis for Purdue University, West Lafayette, IN, Dec. 2009.
Nadimpalli, Siva Prasad Varma, Characterization and Prediction of Fracture within Solder Joints and Circuit Boards . Ph. D. Thesis for University of Toronto, Toronto, Canada, 2011.
Nagarkar, Kaustubh Ravindra, A Systems Approach to Ultra-fine Pitch Flip Chip Interconnect Packaging . Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2005.
Nair, Vineethkumar R., Estimation of Relative Rate of Copper Dissolution in Wave Soldering and Through-Hole Rework Process by Designing an Experiment for Soldering Parameters and PCB Features. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2012.
Nambiar, Sudeep, Process Development of 01005 Assembly. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.
Neuder, Heather Aurelia, In-Situ Phosphatizing Coatings for Aerospace, OEM and Coil Coating Applications. Ph. D. Thesis for Northern Illinois University, DeKalb, IL, Dec. 2003.
Nguyen, Tung Thanh, Characterization of the Elasto-plastic Behavior of Actual Sn-Ag-Cu Solder Joints Using DIC. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2010.
Nie, Lei, Temperature Cycling Reliability of Reballed and Reworked Ball Grid Array Packages in SnPb and SAC Assembly. Ph. D. Thesis for University of Maryland, College Park, MD, 2010.
Niraula, Dipesh, Physics and applications of conductive filaments in electronic structures: from metal whiskers to solid state memory. Ph. D. Thesis for University of Toledo, Toldeo, OH, May 2019.
Nourani, Amir, Strain-rate Dependent Fracture Load Prediction of Lead-free Solder Joints. Ph. D. Thesis for University of Toronto, Toronto, Canada, 2016.
Obaidat, Mazin, Reliability of Lead-Free Solders under Realistic Service Conditions . Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2013.
Oberc, Timothy James, Reliability of Lead-Free High Temperature Surface Mount Component Attaches. Master's Thesis for University of Maryland, College Park, MD, 2008.
Padilla, Eric, Characterization of Local Deformation in Pb-free Solder Joints Using Three Dimensional (3D) X-ray Microtomography. Master's Thesis for Arizona State University, Tempe, AZ, May 2012.
Panashchenko, Lyudmyla, Evaluation of Environmental Tests for Tin Whisker Assessment. Master's Thesis for University of Maryland, College Park, MD, 2009.
Panchagade, Dhananjay R., Damage Prediction of Lead Free Ball Grid Array Packages Under Shock and Drop Environment. Ph. D. Thesis for Auburn University, Auburn, AL, May 10, 2007.
Pandian, Guru Prasad, Effect of Long-term Aging on Lead-free Solder (SAC405) and Surface Finish (Pure Tin). Master's Thesis for University of Maryland, College Park, MD, 2017.
Paquette, Beth Miller, Harmonic Vibration Testing of Electronic Components Attached to Printed Wiring Boards with SAC305 and Eutectic SnPb Solder . Master's Thesis for University of Maryland, College Park, MD, 2010.
Park, Tae-Sang, A Study on Mechanical Fatigue Behaviors of Ball Grid Array Solder Joints for Electronic Packaging. Ph. D. Thesis for Korea Advanced Institute of Science and Technology, Daejeon, Korea, May 30, 2004.
Patel, Chandradip Pravinbhai, Performance Assessment of MEMS Gyroscope and Shock Durability Evaluation of SAC305-X Solders for High Temperature Applications. Ph. D. Thesis for University of Maryland, College Park, MD, 2014.
Pease, David Eugene, Deformation and Interface Morphology for the Alpha to Beta and Beta to Alpha Phase Transformation of Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1972.
Pedigo, Aaron E., The Influence of the Effective Physical Properties of Tin Electrodeposited Films on the Growth of Tin Whiskers. Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2011.
Peercy, Paul S., Helicon Propagation in Indium Antimonide and Gray Tin. Ph. D. Thesis for University of Wisconsin, Madison, WI, 1966.
Pei, Min, Effects of Lanthanum Doping on the Microstructure and Mechanical Behavior of a SnAg Alloy. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, May 2007.
Pierce, David Michael, Continuum Damage Mechanics Based Failure Prediction Methodology for 95.5Sn-3.9Ag-0.6Cu Solder Alloy Interconnects in Electronic Packaging. Ph. D. Thesis for Stanford University, Stanford, CA, June 2007.
Pinol, Lesly Agnes, Fundamental Studies of Tin Whiskering in Microelectronics Finishes . Ph. D. Thesis for University of Maryland, College Park, MD, 2010.
Plaza, Gustavo Alberto, Impact of Board Pad Finish on the SnPb and Lead-free Solder Interconnect Reliability for Leadless Chip Resistors under Random Vibration Loading. Master's Thesis for University of Maryland, College Park, MD, 2008.
Puthenparambil, Abhilash, Effect of Bonding Pressure on Reliability of Anisotropic Conductive Adhesives Joints in a Silicon-to-Flex-Substrate Interconnection. Master's Thesis for Binghamton University, State University of New York, Binghamton, NY, 2006.
Qasaimeh, Awni, Study of the Damage Evolution Function of SnAgCu in Cycling. Ph. D. Thesis for State University of New York, Binghamton, NY, 2012.
Qi, Yan, Accelerated Thermal Fatigue of SnPb and Pb-Free Solder Joints: Effect of Temperature Range and Rate of Change. Ph. D. Thesis for University of Toronto, Toronto, Canada, 2005.
Qin, Yi, Electrodeposition and Characterisation of Lead-Free Solder Alloys for Electronics Interconnection. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, Oct. 2010.
Quintero, Pedro O., Development of a Shifting Melting Point Ag-In Paste Via Transient Liquid Phase Sintering for High Temperature Environments. Ph. D. Thesis for University of Maryland, College Park, MD, 2008.
Quran, Mohammad M., Effect of Pad Location Relative to Glass Weave on Cratering and Underfill Process Improvement and Material Evaluation. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2014.
Raghavan, Venkatesh Arasanipalai, Pad Cratering: Development of a Test Protocol and Quantification of the Effects of 'Latent Damage' at the Joint Level and Assembly Level, Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2010.
Rajagopal, Subramanian, Transition of Low-Volume Complex Electronic System Industries to Lead-Free Electronics. Master's Thesis for University of Maryland, College Park, MD, 2003.
Rajathurai, Karunaharan, Synthesis and Characterization of Tin Nanorods and Tin-Indium Nanoparticles as Nanosolder Materials. Master's Thesis for University of Massachusetts, Lowell, MA, 2011.
Ramkumar, S. Manian, Process Analysis and Performance Characterization of a Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Assembly. Ph. D. Thesis for Binghamton University, State University of New York, Binghamton, NY, 2007.
Raut, Rahul, Thermal Management of Heat Sensitive Components in Pb-Free Assembly and Rework Process. Master's Thesis for State University of New York, Binghamton, NY, 2005.
Ready IV, William Judson, Reliability Investigation of Printed Wiring Boards Processed with Water Soluble Flux Constituents. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, July 2000.
Reeve, Thomas C., Nucleation, Growth, and Structure of Beta-Tin in Tin-Based Lead-Free Solders. Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2018.
Regalado, Irene Lujan, Characterization of Thermo-Mechanical Damage in Tin and Sintered Nano-Silver Solders. Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2018.
Reinbold, Lucine Kabakian, Kinetics of Interfacial Reaction and Stress Evolution in Bimetallic Copper-Tin Thin Films. Ph. D. Thesis for Brown University, Providence, RI, May 2007.
Ren, Fei, Polarity Effect of Electromigration on Mechanical Properties of Lead-Free Solder Joints. Ph. D. Thesis for University of California, Los Angeles, CA, 2006.
Reuse, Rolando, Thermomechanical Behavior of Monolithic Sn-Ag-Cu Solder and Copper Fiber Reinforced Solders. Masters Thesis for Naval Postgraduate School, Monterey, CA. Sept. 2005.
Reynolds, Heidi Linch, Creep of Two-Phase Microstructures for Microelectronic Applications (Lawrence Berkeley National Laboratory Report LBNL42733). Ph. D. Thesis for University of California, Berkeley, CA, Dec. 1998.
Rhee, Hongjoo, Roles of Service Parameters on the Mechanical Behavior of Lead-Free Solder Joints. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2005.
Robiaee, Ala Al, Evaluation of the Printability of Lead Versus Lead Free Solder Pastes . Master's Thesis for Ryerson University, Toronto, Ontario, Canada, 2005.
Rodekohr, Chad L., Material Factors Influencing Metallic Whisker Growth. Ph. D. Thesis for Auburn University, Auburn, AL, Dec. 19, 2008.
Rogers, Keith Leslie, An Analytical and Experimental Investigation of Filament Formation in Glass/Epoxy Composites. Ph. D. Thesis for University of Maryland, College Park, MD, 2005.
Roman, Bernard John, Stress-Induced Bandgap and Related Phenomena in Gray Tin. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1969.
Rowley, Jonathan Gabriel, The Role of Soldering Process Variables on Properties of Lead-Free Solder Joints. Master's Thesis for University of Texas at Arlington, Arlington, TX, Aug. 2003.
Rozgonyi, George A., Field Emission Microscope Studies of the Effect of Crystallographic Orientation and Surface Defects on the Chemisorption and Oxidation of Copper Whiskers. Ph. D. Thesis for University of Arizona, Tucson, AZ, 1964.
Sabbagh, N. A. J., Tin Whisker Growth in the Communication Industry. Master's Thesis for Sir George Williams University, Montreal, Canada, Apr. 1973.
Sadiq, Muhammad, Design and Fabrication of Lanthanum-Doped SN-AG-Cu Lead-Free Solder for the Next Generation of Microelectronics Applications in Severe Environment , Ph. D. Thesis for Georgia Institute of Technology, Georgia, Aug. 2012.
Sajjala, Sandeep Reddy, Optimizing Stencil and Pad Design for 0201 Components in a Lead-Free Assembly. Master's Thesis for State University of New York, Binghamton, NY, 2006.
Sanapala, Ravikumar, Characterization of FR-4 Printed Circuit Board Laminates Before and After Exposure to Lead-Free Soldering Conditions. Master's Thesis for University of Maryland, College Park, MD, Aug. 2008.
Sane, Shantanu Madhavrao, Disturbed State Concept Based Constitutive Modeling for Reliability Analysis of Lead Free Solders in Electronic Packaging and for Prediction of Glacial Motion. Ph. D. Thesis for University of Arizona, Tucson, AZ, 2007.
Sani-Bakhtiari, Paymon, Surface Mount DC/DC Converter Attachment to Printed Circuit Board . Master's Thesis for University of Toronto, Toronto, Canada, 2002.
Sarobol, Pylin, Effects of Local Film Properties on the Nucleation and Growth of Tin Whiskers and Hillocks. Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2013.
Sattiraju, Seshagirirao V., Wetting Studies of Pb-Free Solders on Pb-Free PWB Finishes. Ph. D. Thesis for Auburn University, Auburn, AL, Aug. 5, 2002.
Schnabl, Karl, A Systematic Study on the Reliability of Lead-Free Solder Alternatives Including Sn Based Microbump Configurations and Cu Based Nanomaterials. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2014.
Seastrom, Charles Collmar, Observations on the Dissolution Behavior of Iron Whiskers. Ph. D. Thesis for Ohio State University, Columbus, OH, 1962.
Seddon, Michael John, Characterization and Comparison of Creep Properties for Tin-Indium-Silver Solder Joints. Master's Thesis for University of Arizona, Tucson, AZ, 1996.
Sellers, Michael S., Atomistic Modeling of the Microstructure and Transport Properties of Lead-Free Solder Alloys. Ph. D. Thesis for State University of New York at Buffalo, Buffalo, NY, August 23, 2010.
Selvaraj, Mukesh K., An Experimental Study of Electromigration in Flip Chip Packages. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.
Sengupta, Shirsho, Effects of Solder-Dipping as a Termination Re-finishing Technique . Masters Thesis for University of Maryland, College Park, MD, June 2006.
Sha, Chu-Hsuan, Silver Flip Chip Interconnect Technology and Solid State Bonding. Ph. D. Thesis for University of California, Irvine, CA, 2011.
Shah, Vatsal, Pb-Free Process Development and Microstructural Analysis of Capacitor Filter Assemblies Using Solder Preforms. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2005.
Sharon, Gilad, Modeling the Physics of Failure for Electronic Packaging Components Subjected to Thermal and Mechanical Loading. Ph. D. Thesis for University of Maryland, College Park, MD, 2011.
Shemenski, Robert Martin, The Defect Structures and Dissolution Characteristics of Iron Filamentary Single Crystals. Ph. D. Thesis for Ohio State University, Columbus, OH, 1964.
Shirley, Dwayne R., Transient and Steady-State Creep in a Sn-Ag-Cu Lead-Free Solder Alloy: Experiments and Modeling. Ph. D. Thesis for University of Toronto, Toronto, Canada, 2009.
Sidhu, Rajen Singh, Thermomechanical Behavior of Sn-Rich (Pb-Free) Solders. Ph. D. Thesis for Arizona State University, Tempe, AZ, Aug. 2007.
Singh, Harmandeep, Study of Thermal Fatigue of Wafer Level Packages under Temperature Cycling. Master's Thesis for Lamar University, Beaumont, TX, Dec. 2008.
So, William W., Fluxless Indium and Silver-Indium Bonding Processes for Photonics and High Temperature Electronics. Ph. D. Thesis for University of California, Irvine, CA, 1999.
Song, Fubin, Experimental Investigation on Testing Conditions of Solder Ball Shear and Pull Tests and the Correlation with Board Level Mechanical Drop Test . Ph. D. Thesis for Hong Kong University of Science and Technology, Hong Kong, Aug. 2007.
Song, Ho Geon, Microstructural Evolution of Eutectic Au-Sn Solder Joints (Lawrence Berkeley National Laboratory Report LBNL50573). Ph. D. Thesis for University of California, Berkeley, CA, May 2002.
Song, Yubao, Study of Pulse Plating and Reaction Mechanism of Trivalent Chromium Deposition Process. Ph. D. Thesis for Clarkson University, Potsdam, NY, Apr. 20, 2000.
Spitzner, Matthew James, Response of tin whiskers to dynamic input: Mathematical modeling and experimental property measurement. Master's Thesis for Iowa State University, Ames, IA, 2009.
Srinivas, Vikram, Modeling Rate Dependent Durability of Low-Ag SAC Interconnects for Area Array Packages under Torsion Loads. Master's Thesis for University of Maryland, College Park, MD, 2010.
Stark, Brian H., Thin Film Technologies for Hermetic and Vacuum Packaging of MEMS. Ph. D. Thesis for University of Michigan, Ann Arbor, MI, 2004.
Stinson-Bagby, Kelly, Microstructural Evolution in Thermally Cycled Large-Area Lead and Lead-Free Solder Joints. Master's Thesis for Virginia Polytechnic Institute and State University, Blacksburg, VA, June 7, 2002.
Stromswold, Eric Ivan, Characterization of eutectic tin-silver solder joints. Ph. D. Thesis for University of Rochester, Rochester, NY, 1993.
Stuttle, Christopher James, The Electrodeposition of Tin Coatings from Deep Eutectic Solvents and their Subsequent Whisker Growth. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, Sept. 2014.
Su, Bin, Electrical, Thermomechanical and Reliability Modeling of Electrically Conductive Adhesives. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, May 2006.
Su, Peng, A Study on the Reliability of Flip Chip Solder Joints. Ph. D. Thesis for Cornell University, Ithaca, NY, Jan. 2001.
Subbaiyan, Sudharsan, A Physical Model Examination of Micro-brazing Reaction with Gallium and Copper. Master's Thesis for Queen's University, Kingston, Ontario, Canada, Apr. 2005.
Subbarayan, Guhan, A Systematic Approach for Selection of Best Pb-Free Printed Circuit Board (PCB) Surface Finish. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.
Suh, Jongook, Orientation distribution, morphology, and size distribution of Cu6Sn5 intermetallic compound in reactions between molten solder and Cu in flip chip solder joints. Ph. D. Thesis for University of California, Los Angeles, CA, 2006.
Sun, Yong, Micro/Nano-Scale Investigation on Tin Alloys and Tin Dioxide Nanowires . Ph. D. Thesis for University of South Carolina, Columbia, SC, 2012.
Swanson, Tayler John, Properties of Mixing SAC Solder Alloys with Bismuth-containing Solder Alloys for a Low Reflow Temperature Process. Master's Thesis for Rochester Institute of Technology, Rochester, NY, Dec. 17, 2018.
Syarbaini, Luthfia Amra, Microstructural Evolution during Stress Relaxation of Gold Thin Films . Master's Thesis for Purdue University, West Lafayette, IN, Dec. 2013.
Tabatabaei, Salomeh, Synthesis and Characterization of Two Component Alloy Nanoparticles. Ph. D. Thesis for Rice University, Houston, TX, 2010.
Talebanpour, Babak, Microstructural Effects on Creep and Fracture Mechanics of Sn-Ag-Cu Solders. Ph. D. Thesis for Washington State University, Pullman, WA, Aug. 2015.
Tan, Wei, Development of Convective Reflow-Projection Moire Warpage Measurement System and Prediction of Solder Bump Reliability on Board Assemblies Affected by Warpage. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, Apr. 2008.
Tang, Zhenming, Interfacial Reliability of Pb-Free Flip-Chip BGA Package. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2008.
Tashtoush, Tariq H., Effect of Lead-Free Solder Joint's Size and Configuration on Mechanical Properties, Microstructure, and Aging Kinetics. Ph. D. Thesis for Binghamton University, Binghamton, NY, 2013.
Telang, Adwait U., Characterization of Deformation in Sn-Ag Lead-Free Solders During Thermomechanical Fatigue Using Orientation Imaging Microscopy. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2004.
Telang, Adwait U., Characterization of Microstructural Evolution of Crept, Aged and Thermomechanically Fatigued Eutectic Sn-Ag Solder Joints using Orientation Imaging Microscopy. Master's Thesis for Michigan State University, East Lansing, MI, 2002.
Theeven, J. G. A., Creep and Failure of Lead-Free Solder Alloys. Master's Thesis for Eindhoven University of Technology, Eindhoven, Netherlands, Mar. 2002.
Tonapi, Sandeep Shrikant, Assembly and Reliability of Lead-Free Flip Chips. Ph. D. Thesis for State University of New York, Binghamton, NY, 2001.
Tong, Michael Shou-Ming, The Use of Nickel/Aluminum Explosively Reactive Nanolayers as Localized Heat Sources in Solder Joints. Ph. D. Thesis for University of California, Los Angeles, CA, 2009.
Tu, Li-Wei, Shubnikov-de Haas and Size Effects of Substrate Stabilized Gray Tin Epilayers Grown by Molecular Beam Epitaxy. Ph. D. Thesis for Northwestern University, Evanston, IL, Dec. 1989.
Tucker, Jonathon P., Microstructural Effects on Constitutive and Fatigue Fracture Behavior of SnAgCu Solder. Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2012.
Tufte, Obert Norman, Growth and Semiconducting Properties of Gray Tin Single Crystals. Ph. D. Thesis for Northwestern University, Evanston, IL, June 1960.
Tumne, Pushkraj Satish, Investigation of Bulk Solder and Intermetallic Failures in Pb-free BGA by Joint Level Testing. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2009.
Tunga, Krishna Rajaram, Study of Sn-Ag-Cu Alloy Reliability Through Material Microstructure Evolution and Laser Moire Interferometry. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, Aug. 2008.
Turner, Gregory Alan, A Novel Method for Direct Solder Bump Pull Testing using Lead-Free Solders. Master's Thesis for University of Rhode Island, Kingston, RI, 2015.
Vaddiraju, Sreeram, Chemical and Reactive Vapor Transport Methods for the Synthesis of Inorganic Nanowires and Nanowire Arrays. Ph. D. Thesis for University of Louisville, Louisville, KY, Dec. 2006.
Vallabhaneni, Venkata Sathya Sai Renuka, Environmental-Induced Damage in Tin (Sn) and Aluminum (Al) Alloys . Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2017.
Varghese, Joseph, Effect of Dynamic Flexural Loading on the Durability and Failure Site of Solder Inteconnects of Printed Wiring Assemblies. Ph. D. Thesis for University of Maryland, College Park, MD, 2007.
Varia, Ronak, Investigations of Polymer-Cored Solder Balls and Fan-Out Technologies in Wafer Level Packaging. Master's Thesis for Lamar University, Beaumont, TX, Aug. 2010.
Venkatadri, Vikram, Quantitative Assessment of Long Term Aging Effects on the Mechanical Properties of Lead Free Solder Joints. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2009.
Vijayanath, Vignesh, Assembly Process Development for Fine Pitch (0.4 mm) Package-On-Package Devices in a Lead-Free Assembly Environment. Master's Thesis for State University of New York at Binghamton, Binghamton, NY, 2010.
Virupaxappa, Hanchinamani, Novel Additives for Conductive Epoxy Adhesive. Master's Thesis for University of Massachusetts Lowell, Lowell, MA, 2001.
Vishwanathan, Krishnan, Process Development and Microstructural Analysis of Capacitor Filter Assemblies Using Lead Free Solder Preforms. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2007.
Vollweiler, Fred O. P., Intermetallic Growth at the Interface between Copper and Bismuth-Tin Solder. Masters Thesis for Naval Postgraduate School, Monterey, CA. Sept. 1993.
Wagner, Robert John, Free Carrier Reflectivity of Gray Tin Single Crystals. Ph. D. Thesis for Northwestern University, Evanston, IL, Aug. 1967.
Walleser, Jason Kenneth, Microstructure control of the Sn-Ag-Cu-X solder alloy system through nucleation catalysis of Sn. Master's Thesis for Iowa State University, Ames, IA, 2008.
Wang, Daijiao, Experimental Study of Void Formation in Solder Joints of Flip-Chip Assemblies. Ph. D. Thesis for University of Texas at Austin, Austin, TX, May 2005.
Wang, Pin J., Fluxless Bonding of Thermal Expansion Mismatch Materials. Ph. D. Thesis for University of California, Irvine, CA, 2009.
Wang, Qing, Mechanical Properties and Microstructure Investigation of Sn-Ag-Cu Lead Free Solder for Electronic Package Applications. Ph. D. Thesis for Auburn University, Auburn, AL, Dec. 16, 2005.
Wang, Rainey Yu, The Morphology Study of Zinc Electrodeposits from Alkaline Zincate Solutions. Ph. D. Thesis for University of Toronto, Toronto, Canada, 2006.
Wang, Weiqiang, Solder Joint Reliability of Sn and SnBi Finished and Refinished Sn (SAC/SnPb) SMT Packages Under Temperature Cycling Test. Master's Thesis for University of Maryland, College Park, MD, 2009.
Wang, Yibo, A Numerical Model of Anisotropic Mass Transport Through Grain Boundary Networks. Master's Thesis for Lehigh University, Bethlehem, PA, Sept. 2011.
Wang, Ying, Microstructure Evolution and Surface Defect Formation in Tin Films . Ph. D. Thesis for Purdue University, West Lafayette, IN, May 2014.
Watts, James D., The production of lead-free solder spheres for the electronics industry using materials jetting. Master's Thesis for Loughborough University, Loughborough, United Kingdom, Feb. 2001.
Wei, Yong, Electronically Conductive Adhesives: Conduction Mechanisms, Mechanical Behavior and Durability. Ph. D. Thesis for Clarkson University, Potsdam, NY, Apr. 1995.
Welch III, Warren Cornelius, Vacuum and Hermetic Packaging of MEMS Using Solder. Ph. D. Thesis for University of Michigan, Ann Arbor, MI, 2008.
Wentlent, Luke Arthur, Evolution of the Deformation Behavior of Sn-Rich Solders during Cyclic Fatigue. Ph. D. Thesis for State University of New York at Binghamton, Binghamton, NY, 2015.
Wentlent, Luke, On the Microstructure of Pb-Free Solder Joints: Implications for Accelerated Thermal Cycling and Finite Element Modeling. Master's Thesis for State University of New York, Binghamton, NY, 2012.
Wernicki, Evan, Synthesis and Characterization of Lead-Free Tin-Silver Nanosolders and Their Application to Halogen-Free Nanosolder Pastes. Master's Thesis for University of Massachusetts Lowell, Lowell, AM, 2015.
Wolfson, Robert George, Transformation Studies of Gray - Tin Single Crystals. Master's Thesis for Northwestern University, Evanston, IL, June 1960.
Wong, Anthony Yin-Bong, Implementation and Qualification of a Prototype Tester for Reflow Soldering Process Compatibility Evaluation of Surface Mount Technology Components. Ph. D. Thesis for University of Texas at Austin, Austin, TX, Dec. 2002.
Wright, William L., Processing of NiTi Reinforced Adaptive Solder for Electronic Packaging . Masters Thesis for Naval Postgraduate School, Monterey, CA. Mar. 2004.
Wu, Chun-I, Fabrication and Site Specific Growth of Nanowires. Ph. D. Thesis for Michigan State University, East Lansing, MI, 2006.
Wu, Ji, Electrical Characterization and Reliability Assessment of Lead-Free Solder Coated Electrical Contacts. Ph. D. Thesis for University of Maryland, College Park, MD, 2003.
Wu, Liang, Investigation of zinc whisker growth from electrodeposits produced using commercial electroplating baths. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, Dec. 2016
Xiao, Qiang, Constitutive Model Development for Lead Free Solder Alloys at Multiple Specimen Scales. Ph. D. Thesis for University of Wyoming, Laramie, WY, Dec. 2004.
Xie, Huxiao, Properties of Cerium Containing Lead Free Solder, Ph. D. Thesis for Arizona State University, Arizona, Oct. 2012.
Xing, Yan, Study of Thermal and Chemical Factors Which Influence Solidification of Tin in Near Eutectic Sn-3.0Ag-XCu Lead Free Solder. Master's Thesis for State University of New York, Binghamton University, Binghamton, NY, 2006.
Xu, Huili, Grain Structure Evolution of Tin-Based Lead-Free Solder Joints in Electronic Packaging Assembly and Its Impacts on the Fatigue Reliability . Ph. D. Thesis for University of Texas at Arlington, Arlington, TX, Dec. 2013.
Xu, Shuangyan, Evaluating Thermal and Mechanical Properties of Electrically Conductive Adhesives for Electronic Applications. Ph. D. Thesis for Virginia Polytechnic Institute and State University, Blacksburg, VA, Apr. 2001. link checked 8/21/2020
Xu, Xinyue, Applied Meta-Analysis of Lead-Free Solder Reliability. Master's Thesis for Arizona State University, Tempe, AZ, Dec. 2014.
Yang, Chaoran, Characterization and Modeling of the Failure Mechanism of Copper-Tin (Cu-Sn) Intermetallic Compounds in Lead-free Solder Joints. Ph. D. Thesis for Hong Kong University of Science and Technology, Hong Kong, 2015.
Yang, Fan-Yi Ou, Electromigration and Thermomigration in Pb-free SnAgCu and Eutectic SnPb Flip Chip Solder Joints. Ph. D. Thesis for University of California, Los Angeles, CA, 2007.
Yang, Hong, Mechanical and Thermomechanical Stability Issues of 96.5SN-3.5AG Solder Joints in Microelectronic Packages. Ph. D. Thesis for North Carolina State University, Raleigh, NC, 1998.
Yang, Linlin, Lead-Free Solder Reliability in Combined Environments. Ph. D. Thesis for State University of New York, Binghamton, NY, 2011.
Yang, Quan, Modeling and Characterization for Small-Scale Packaging Applications . Ph. D. Thesis for State University of New York, Binghamton, NY, 2004.
Yang, Se-Young, Reliability Evaluation for Flip-Chip Electronic packaging Using Optical Measurement Techniques. Ph. D. Thesis for Korea Advanced Institute of Science and Technology, Daejeon, Korea, Nov. 29, 2004.
Yang, Wenge, Process-Structure-Property Relationship for Eutectic Sn-Ag Solder Joints . Ph. D. Thesis for Rensselaer Polytechnic Institute, Troy, NY, Aug. 1995.
Yao, Wei, Damage Mechanics of Electromigration and Thermomigration in Electronics Packaging Solder Joints under Time Varying Current Loading. Ph. D. Thesis for State University of New York at Buffalo, Buffalo, NY, Mar. 19, 2013.
Yao, Yao, Modeling the Mechanical Properties of Intermetallic/Solder Interfaces . Ph. D. Thesis for Northwestern University, Evanston, IL, Dec. 2008.
Yazzie, Kyle, Mechanical Shock Behavior of Environmentally-Benign Pb-free Solders . Ph. D. Thesis for Arizona State University, Tempe, AZ, May 2012.
Ye, Hua, Mechanical Behavior of Microelectronics and Power Electronics Solder Joints Under High Current Density: Analytical Modeling and Experimental Investigation. Ph. D. Thesis for State University of New York, Buffalo, NY, June 1, 2004.
Yoon, Ji-Young, A Research for the Moisture-Induced Properties of ACF Package Materials . Master's Thesis for Korea Advanced Institute of Science and Technology, Daejeon, Korea, Dec. 27, 2006.
Young, Poh-shien, Measurements of Electrical Conductivity of Filaments of Gray Tin and Gray Tin Alloys. Master's Thesis for Oklahoma Agricultural and Mechanical College (now Oklahoma State University), Stillwater, OK, May 1957.
Yu, Hao, Combined Thermal, Thermodynamic and Kinetic Modelling for the Reliability of High-Density Lead-Free Solder Interconnections. Doctor of Science in Technology Thesis for Helsinki University of Technology, Espoo, Finland, 2006.
Zahedi, Fahad, Reliability of Lead-Free Solder Under Cyclic Bending. Master's Thesis for University of Texas at Arlington, Arlington, TX, May 2006.
Zbrzezny, Adam R., Characterization and Modeling of Microstructural Evolution of Near-Eutectic Sn-Ag-Cu Solder Joints. Ph. D. Thesis for University of Toronto, Toronto, Canada, 2004.
Zha, Xu, Numerical Analysis of Lead-free Solder Joints: Effects of Thermal Cycling and Electromigration. Ph. D. Thesis for Loughborough University, Loughborough, United Kingdom, Mar. 2016.
Zhan, Sheng, Surface Insulation Resistance Degradation and Electrochemical Migration on Printed Circuit Boards. Ph. D. Thesis for University of Maryland, College Park, MD, 2007.
Zhan, Yumei, Micro Zero-Insertion-Force (ZIF) Connector for Multi-Substrate Packages . Ph. D. Thesis for Michigan Technological University, Houghton, MI, Dec. 2003.
Zhang, Hongqing, Thermal and Electromigration Induced Strain and Microstructure Evolution in Metal Conductor Lines. Ph. D. Thesis for Lehigh University, Bethlehem, PA, July 2008.
Zhang, Qian, Isothermal Mechanical and Thermomechanical Durability Characterization of Selected Pb-Free Solders. Ph. D. Thesis for University of Maryland, College Park, MD, 2004.
Zhang, Rongwei, Novel Conductive Adhesives for Electronic Packaging Applications: A Way Towards Economical, Highly Conductive, Low Temperature and Flexible Interconnects. Ph. D, Thesis for Georgia Institute of Technology, Atlanta, GA, May 2011.
Zhang, Xuefeng, Chip Package Interaction (CPI) and Its Impact on the Reliability of Flip-Chip Packages. Ph. D. Thesis for University of Texas at Austin, Austin, TX, Dec. 2009.
Zhang, Yifei, The Effects of Aging on the Mechanical Behavior of Lead Free and Mixed Formulation Solder Alloys. Ph. D. Thesis for Auburn University, Auburn, AL, Aug. 9, 2010.
Zhang, Zheming, Ball Grid Array Solder Joint Reliability under Impact Test. Ph. D. Thesis for Hong Kong University of Science and Technology, Hong Kong, Aug. 2010.
Zhang, Zhongqin, Nucleation and Growth Kinetics of Tin and Tin-Silver Alloy During Initial Stages of Electrodeposition. Ph. D. Thesis for University of New Hampshire, Durham, NH, Dec. 2004.
Zhao, Ping, Creep Corrosion over Plastic Encapsulated Microcircuit Packages with Noble Metal Pre-plated Leadframes. Ph. D. Thesis for University of Maryland, College Park, MD, 2005.
Zheng, Yunqi, Effect of Surface Finishes and Intermetallics on the Reliability of SnAgCu Interconnects. Ph. D. Thesis for University of Maryland, College Park, MD, 2005.
Zhou, Bite, Characterization of Tin Crystal Orientation Evolution During Thermal Cycling in Lead-Free Solder Joints. Ph. D. Thesis for Michigan State University, Michigan, 2012.
Zhou, Jianguo, Processing of Generic Circuits by Conductive Adhesives: Geometrical and Rheological Considerations. Ph. D. Thesis for University of Akron, Akron, OH, May 2007.
Zhou, Xiaoying, Life Cycle Thinking and Assessment Tools on Environmentally-Benign Electronics: Convergent Optimization of Materials Use, End-of-Life Strategy and Environmental Policies. Ph. D. Thesis for University of California, Davis, CA, 2007.
Zhou, Yuxun, Harmonic and Random Vibration Durability Investigation for Sn3.0Ag0.5Cu Solder Interconnects. Ph. D. Thesis for University of Maryland, College Park, MD, 2008.
Zribi, Anis, Kinetics of Intermetallic Growth at the Interfaces of Soldered Metallizations. Ph. D. Thesis for State University of New York, Binghamton University, Binghamton, NY, 2002.
A Guide To Lead-Free Soldering for Assemblers & Sub-Contractors, Version 2.6, $68 from Roger Bilham Consultancy
AIM Lead-Free Information, Version 4.1, from AIM.
Assembly Technology Expo, Sept. 26-28, 2006, from Nihon Superior.
e3 survival toolkit, 499 British pounds + value-added tax from eco3 (do not have)
EMC & Compliance Yearbook Plus Information Bank 2005.
Guide to Lead-Free Wave Soldering, 99 British pounds + value-added tax from Soldertec Global (do not have)
Handsoldering and De-soldering with Lead-Free Solder, 99 British pounds + value-added tax from Soldertec Global (do not have)
Lead-Free Assembly and Soldering Cook Book3, $195 from Electronics.CA Publications (do not have)
Lead-Free: Fantasy or Fact?, $75.00 from MEPTEC (do not have)
Lead-Free Hand Soldering & DeSoldering Interactive CD-ROM, $195.00 from electronics.ca publications (do not have)
Lead-Free Solder CD-ROM, $570 for NCMS members, $670 for non-members from National Center for Manufacturing Sciences (do not have)
Lead-Free Solder Implementation Summit, $75.00 from MEPTEC (do not have)
Lead-Free Soldering Interactive Cook Book 3, $195.00 from electronics.ca publications
Lead-Free Watch: Countdown to July 1, 2006.
MacDermid's Patented Immersion Silver Solderability Preservative
Reflow Soldering with Lead-Free Solder Paste, 99 British pounds + value-added tax from Soldertec Global (do not have)
RoHS Ready Lead-Free Solutions, from Kester.
Round Robin Testing and Analysis of Lead Free Solder Pastes with Alloys of Tin, Silver and Copper, $99.00 for members and $199.00 for non-members from SMTA
SMTA TechScan Compendium: The State-of-the-Art in Pb-free Soldering Technology, $85.00 for members and $105.00 for non-members from SMTA
SN100C Lead-Free Alloy, Version 1.3, from AIM.
Summit on Lead-Free Solder Implementation, $75.00 from MEPTEC (do not have)
Papers, Reports, and Magazine Articles on Lead-Free,
RoHS, and WEEE (revised 2/5/2021)
"(editorial)," SMTA Journal, vol. 19 no. 1, pp. 10, Jan.-Mar. 2006.
"0201 capacitors creating process problem," Circuitnet, Sept. 25, 2006.
"100% Sn Plating Whisker Growth Study," AMD, Jan 10, 2003.
"12-month shelf life for chemical silver," evertiq, Nov. 11, 2005.
"1st Meeting of RoHS Enforcement Bodies Network."
"2004 - 10/01/2004 - OSHA Proposes Revised Rule on Hexavalent Chromium," Occupational Safety & Health Administration, Oct. 1, 2004.
"2006 (2nd) TMS State of Art Pb-free Technology Workshop Panel Discussion Summary," 2006 Lead-Free Technology Workshop, San Antonio, TX, Mar. 12, 2006, pp. xx-xx.
"2006: The Year of RoHS," Manufacturing.net, June 21, 2006.
"2008 Review of Directive 2002/96/EC on waste electrical and electronic equipment (WEEE),"
"2009 Industry Forecast," Surface Mount Technology (SMT), vol. 22 no. 12, pp. 8,11-17,19-20,22-23, Dec. 2008.
"3M provides information on the new OSHA hexavalent chromium standard," Welding Design and Fabrication, vol. 79 no. 5, pp, 6-7, May 2006.
"7 more RoHS exemptions proposed," evertiq, June 6, 2008.
"A big answer to a WEEE problem," Department of Trade and Industry, July 25, 2006.
"A Brief History of Lead," EDN, vol. 47 no. 9, pp. 57, Apr. 18, 2002.
"A Citizen's Guide to Producer Responsibility," Feb. 2003.
"A Flood of New Environmental Laws," SourceESB, July 13, 2006.
A Guide To Lead-Free Soldering for Assemblers & Sub-Contractors, Version 2.6, $68 from Roger Bilham Consultancy
"A legal look at environmental compliance," SourceESB, Mar. 22, 2006.
"A New Standard for Tin-Nickel I. S. O. 2179: International Standard for Electroplated Coatings of Tin-nickel Alloy," Tin and its Uses, no. 94, pp. 7, 1972.
"A new way to grow microwires," Electronics Manufacture and Test , Feb. 4, 2011.
"A practical precaution against introducing zinc whiskers," finishing.com.
"A quiet introduction for the RoHS Directive?," Components in Electronics, vol. xx no. xx, pp. xx-xx, Aug. 2006.
"A Research Program on SAC Lead Free Alloys," IPC Solder Products Value Council.
"A Review of California and Maine's electronics recycling programs," INFORM, Dec. 2006.
"A round-table discussion examining issues around the forthcoming European Restrictions of Hazardous Substances (RoHS) and electrical waste (WEEE) directives," Electronics Weekly, Feb. 11, 2004.
"A Study of Lead-Free Wave Soldering,", AIM.
"A WEEE bit late," Electronics Manufacture and Test, pp. xx-xx, Mar. 2006.
"A WEEE Warning," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Sept. 19, 2007.
"A Year of Many Conversions!," Lead-Free Connection, vol. 4 no. 1, pp. 1, Feb. 2007.
"A320's electrical system falters," evertiq, Aug. 11, 2008.
"About RoHS enforcement," Dataweek, vol. xx no. xx, pp. xx-xx, Sept. 20, 2006.
"Achieving a Competitive Advantage Through RoHS Compliance," PCB007 , July 28, 2005.
"ACI Lead Free Manufacturing for Navy Systems," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.
"Act for Resource Recycling of Electrical and Electronic Equipment and Vehicles - Korea RoHS, WEEE & ELV," ERA Technology, 2008.
"Actel goes green on 100% of its FPGA products," SourceESB, Dec. 15, 2004.
"Action to take on WEEE and RoHS," Electronics Weekly, Dec. 10, 2004.
"Adaption to scientific and technical progress under Directive 2002/95/EC," Oko-Institut e.V., 2007.
"Additional Revisions to the RoHS Directive = A Bumpy Ride for IPC Members," IPC Review, vol. 2 no. 2, pp. 8, Mar./Apr. 2009.
"Additional RoHS Exemptions Sought," Circuits Assembly, vol. 16 no. 3, pp. 8, Oct. 2005.
"Advanced AP Maine Touts Recycling Computer Monitors," Appliance Design, vol. xx no. x, pp. xx-xx, Jan. 2006.
"Advantages and Disadvantages of AOI Methodologies in Lead-Free PCB Assembly," AOI Solutions.
"Advantages of vapour phase reflow for lead-free soldering," Dataweek, Oct. 1, 2008.
"AEM, Inc."
"Africa Discusses E-waste at COP8," SMT Web Exclusive Article.
"After RoHS Deadline - Glut or Shortages?," SourceESB, Nov. 16, 2006.
"Agere discovers lead-free packaging method," Advanced Packaging , vol. xx no. xx, pp. xx-xx, Sept. 21, 2004.
"Agere Systems Uncovers Method to Overcome Barriers to Global Lead-Free Chip Implementation," Agere Systems, Sept. 20, 2004.
"Agere's Lead-free (Pb-free) Plating Capabilities Matte tin (Sn) versus matte Sn-over-nickel (Ni) underplate," Agere, Sept. 2004.
"Ageus now offers China RoHS compliance services," EE Times - Asia , vol. xx no. xx, pp. xx-xx, Apr. 4, 2006.
"Ageus Solutions: A Leader in UK WEEE Support," PCB007, Jan. 5, 2007.
"Ageus Solutions Launches New China RoHS Services," PCB007, Mar. 31, 2006.
"Ageus Solutions Provides China RoHS Services to Electronics Industry," PCB007, Oct. 24, 2006.
"AIM Lead-Free Validation Program," AIM.
"Alarming Facts About RoHS Compliance," Printed Circuit Design and Manufacture, vol. 23 no. 9, pp. 10, Sept. 2006.
"All Aboard -- Next Stop is Lead-Free Electronics," Lead-Free Connection, vol. 1 no. 1, pp. 1, July 2004.
"Allotropic Transformation of Tin," Tin and its Uses, no. 161, pp. 3, 1989.
"Allotropy," Advanced Materials & Processes, vol. 167 no. 2, pp. 81, Feb. 2009.
"Alloy Selection Team: Alloy Database," Mar. 16, 2000.
"Alloy Temperature Chart," Kester, July 19, 2002.
"Alloy Verdict: 'No Difference'," Printed Circuit Design and Manufacture , vol. 20 no. 10, pp. 10, Oct. 2003.
"Alloys that we've selected."
"Alternatives," Transactions of the Institute of Metal Finishing, vol. 75 no. 1, pp. B3-B4, Jan. 1997.
"Alternatives to Cadmium Plating: Reflections Five Years Later," Plating and Surface Finishing, vol. 69 no. 11, pp. 34-43, Nov. 1982.
"An Assessment of the Use of Lead in Electronics Assembly: Part 1," Circuit World, vol. 19 no. 2, pp. 18-24, 1993.
"An Assessment of the Use of Lead in Electronics Assembly: Part 2," Circuit World, vol. 19 no. 3, pp. 25-31, 1993.
"An Inherent Advantage of Tin-Nickel Coatings: Compressive State Reduces Corrosion," Tin and its Uses, no. 55, pp. 2-3, 1962.
"An Interview with the Editor of a new book, "Lead-Free Solder Interconnect Reliability"," Circuitnet, Jan. 30, 2006.
"An Introduction to Lead-Free Soldering," AIM.
"An Update: Elimination of Lead from Electronics," Boeing Environmental Technotes, vol. 7 no. 4, pp. 1-4, Nov. 2002.
"Analytical Procedures for Portable Lead-Free Alloy Test Data," IPC Solder Products Value Council Lead-Free Technical White Paper, May 2010.
"Analyzing lead-free soldering defects in wave soldering using Taguchi methods," Dataweek, vol. xx no. xx, pp. xx-xx, Feb. 23, 2005.
"Analyzing Thermal Fatigue," Circuits Assembly, vol. 18 no. 1, pp. 52-53, Jan. 2007.
"Announcement of "Guidelines for the Management of Chemical Substances in Products"," Japan Green Procurement Survey Standardization Initiative (JGPSSI), Sept. 27, 2005.
"Another Candidate Wave Solder."
"Another satellite to replace wayward pager relay," CNN Interactive, May 20, 1998.
"Anti-Counterfeiting Trade Agreement Negotiations Urged to Start," Circuitnet, Mar. 6, 2008.
"Apathy over legislation could damage electronics industry," European Electronics Engineer, vol. xx no. xx, pp. xx-xx, Nov. 11, 2003.
"Application for an additional exemption from RoHS for Fine Pitch Flexible Applications."
"Application of Fritsch Laboratory Mills for WEEE and RoHS Tests," Aufbereitungs-Technik/Mineral Processing, vol. 47 no. 6, pp. 48, June 2006.
"Applications of Low-Temperature Tin-bismuth and Tin-bismuth-silver Lead-free Alloy Solder Pastes," Surface Mount Technology (SMT), vol. 28 no. 6, pp. 12,14-16,18-20,22-24,26-28,30,32-33, July 2013.
"Applications of Tin-Nickel Alloy Electroplate," Tin and its Uses , no. 78, pp. 5-6, 1968.
"Approach and Return of Experience on Lead Free Introduction in Various Industrial Sectors," SERMA Technologies.
"Are Counterfeit Parts Going Compliant?," SourceESB, Jan. 11, 2006.
"Are electronics companies on target for lead-free RoHS deadlines?," Circuit World, vol. 31 no. 3, pp. xx, 2005.
"Are equipment companies mandated to meet lead-free requirements?," Circuitnet, Apr. 24, 2006.
"Are the military and telecommunications industries off the hook on RoHS?," SourceESB, Jan. 26, 2005.
"Are You Ready for RoHS?," EDN, July 21, 2005.
"Are You Ready for RoHS?," ECN Supplement, pp. 1, Nov. 2005.
"Are You Ready for RoHS Compliance?," Review, vol. 45 no. 9, pp.
2-5, Nov. 2004.
"Are you ready to collect & recycle WEEE in Germany from 23 March?,"
evertiq, Mar. 17, 2006.
"Are your parts the real deal?," Electronics Manufacture and Test
, vol. xx no. xx, pp. xx-xx, June 9, 2008.
"Are Zinc Whiskers Growing in Your Computer Room?"
"Arrow adds green data," Purchasing, vol. xx no. xx, pp.
xx-xx, Aug. 4, 2005.
"Arrow Electronics Delivering Critical Environmental Data On More Than 2.3
Million Components," Arrow Electronics, June 29, 2004.
"Arrow Electronics Enables OEMs to Check RoHS Compliancy at No Cost through
ArrowNAC.com," PCB007, Apr. 20, 2006.
"Arrow Electronics Offers Critical Environmental Data for Customers,"
PCB007, July 13, 2005.
"Arrow Helps Get the Lead Out."
"Arrow releases WEEE-guide," evertiq, Aug. 2, 2005.
"Artesyn's Approach to RoHS Compliance," Artesyn, Sept. 14-15, 2005.
"As RoHS Deadline Looms, Universal Compliance in Doubt," Supply &
Demand Chain Executive, vol. xx no. x, pp. xx-xx, xxxx.
"Asian firms on track to meet RoHS rules," emsnow, July 11,
2006.
"Ask Dr RoHS: problems with lead-free BGA solder balls," Electronics
Weekly, Apr. 20, 2006.
"Ask the Expert," Medical Product Manufacturing News, vol. xx
no. xx, pp. xx-xx, 2006.
"ASK the Experts," TUV Rheinland World News, pp. 2,
Mar./Apr. 2005.
"ASK the Experts," TUV Rheinland World News, pp. 8,
Sept./Oct. 2005.
"Assemblers to Suppliers: Which Lead-free Alloy?," Surface Mount
Technology (SMT), vol. 14 no. 2, pp. xx-xx, Feb. 2000.
"Assemblies Go PoP," Circuits Assembly, vol. 18 no. 12, pp.
34-35, Dec. 2007.
"Assembling High-Lead (Pb) DS2502 Flip-Chips in a Pb-Free Assembly Flow,"
EE Times - Asia, vol. xx no. xx, pp. xx-xx, June 8, 2005.
"Assembling High-Lead (Pb) DS2761 Flip-Chips in a Pb-Free Assembly Flow,"
Maxim Application Note 3599, Sept. 16, 2005.
"Assembly Guidelines: Sterling Silver & MacStan Immersion Tin Coated
PCB's," HKPCA Journal, no. 12, pp. 1-7.
"Assembly Lines: Japan Leads in Lead-Free," Assembly, vol. xx
no. xx, pp. xx-xx, Oct. 2004.
"Assessing Life-Cycle Impacts," EPA, May 2002.
"Assessment of Responses to the Third Consultation Documents: WEEE and RoHS
Directives," DTI, Nov. 2004.
"ASTM Declarable Substances Committee Publishes New REACH Standard,"
CircuiTree, vol. 21 no. 6, pp. xx-xx, June 2008.
"ASTM Establishes Committee on "Declarable Substances"," Conformity
, vol. 10 no. 11, pp. 50, Nov. 2005.
"ASTM Establishes Committee on "Declarable Substances"," Conformity
, pp. 214, Conformity 2006: The Annual Guide.
"At Deadline," Waste News, vol. xx no. x, pp. xx-xx, Feb. 27,
2006.
"At the Sharp, (Toshiba and Panasonic) end of US recycling,"
Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Jan. 7,
2008.
"Autocatalytic Deposition of Tin," Tin and its Uses, no. 128, pp.
10-11, 1981.
"Avnet offers RoHS compliance data," Purchasing, vol. xx no.
xx, pp. xx-xx, Nov. 4, 2004.
"Avoid the BGA Voids," Printed Circuit Design and Fab/ Circuits
Assembly, vol. 27 no. 11, pp. 40, Nov. 2010.
"Back Up Block 1 Whisker on Cu," June 6, 2003.
"Back Up Block 2 Whisker on NiFe," June 6, 2003.
"Back Up Block 3 Solderability," June 6, 2003.
"Baking lead-free and lead PCB's before assembly," Circuitnet
, Feb. 4, 2007.
"Ban Lifted on Deca-BDE Flame Ratardants," Printed Circuit Design and
Fab, vol. 25 no. 7, pp. 8, July 2008.
"Ban on Lead May Accelerate Component Obsolescence Problems,"
Lead-free Electronics, Nov. 2004.
"Banish Black Pad and Other PCB Laminate Issues," Circuitnet,
Sept. 9, 2008.
"Baroque Magnificence in Tin An Austrian Shrine," Tin and its Uses
, no. 43, pp. 1-7, Summer 1958.
"Base Material Selection Tool," Polyclad.
"Basel e-Waste Conference Convenes," Surface Mount Technology Online Article,
June 23, 2008.
"Basler Power Supplies," Westinghouse Nuclear Tech Bulletin TB-02-5, July
12, 2002.
"Battling Corrosion - and Making it Green," Products Finishing
, vol. 73 no. 9, pp. 8, June 2009.
"BCF says that REACH is good for UK coatings industry." Finishing
, vol. 30 no. 1, pp. 4, Jan.-Feb. 2006.
"Best, Inc. Lead-Free Roadmap," Best, June 6, 2005.
"Best Practices External / Customer Ready Version Rev. 1.0," Sun
Microsystems, Inc., July 7, 2000.
"Better than Chrome?," Products Finishing, vol. 73 no. 11, pp.
8-9, Aug. 2009.
"BFR Restrictions in Many US States to Follow EU's RoHS," Conformity
, vol. 10 no. 9, pp. 53-54, Sept. 2005.
"BFR Restrictions in Many U.S. States Expected to Follow EU's RoHS,"
Conformity, pp. 214, Conformity 2006: The Annual Guide.
"BGA re-balled with lead free spheres," Circuitnet, June 4,
2006.
"BGA Repair for Mixed Assemblies," Circuits Assembly, vol. 17
no. 5, pp. 54, May 2006.
"BGA Replacement limit," Circuitnet, Jan. 26, 2009.
"BGA Rework - with or without solder paste," Circuitnet,
Sept. 17, 2007.
"Black Pad - Though Rare, the Infamous and Irreparable PCB Defect Can Have
Disastrous Consequences," IPC Review, vol. 2 no. 2, pp. 5,
Mar./Apr. 2009.
"BMPCOE Strives to Mitigate Tin Whiskers," COTS Journal, vol.
xx no. xx, pp. 60-63, Sept. 2003.
"Boeing 601 (f.k.a. Hughes HS 601)."
"Boots pleads guilty to WEEE breaches," RTE Business, Jan.
24, 2006.
"Bridge-free Wave Soldering of Fine Pitch QFP," Tin World,
no. 12, pp. 16, Winter 2006.
"BT Task Force: BTTF 116-3 Title: Waste from electrical and electronic
equipment (WEEE)," CENELEC, Dec. 23, 2004.
"Building consensus," Electronics Supply & Manufacturing,
Feb. 2005.
"Building consensus," Green SupplyLine, Feb. 1, 2005.
"Bumps on Cu pillars tighten pitch," Solid State Technology, vol.
45 no. 11, pp. 24, Nov. 2002.
"Cadmium Plating," finishing.com.
"Cadmium Plating Prohibition," NASA Electronic Parts and Packaging
Program.
"Cadmium whiskers on Hubble," finishing.com.
"CAF," Electronics Manufacture and Test, vol. xx no. xx, pp.
xx-xx, June 7, 2002.
"California Expands RoHS Regulations," Conformity, 2007
Engineers' Reference Guide, pp. 222, 2007.
"California Goes the RoHS Way," Quality Digest, vol. 27 no. 4,
pp. 9, Apr. 2007.
"California Implements Battery Recycling Requirements," Conformity
, 2007 Engineers' Reference Guide, pp. 222-223, 2007.
"California Implements Tough Battery Recycling Requirements,"
Conformity, vol. 11 no. 2, pp. 46, Feb. 2006.
"California Proposition 65 Information for Wire and Cable Manufacturers,"
NEMA, Sept. 2002.
"Californian REACH-type initiative," Electronics Manufacture and
Test, vol. xx no. xx, pp. xx-xx, May 5, 2008.
"Call for unique part numbers to differentiate ball metallurgies on Pb-free
BGA components," Tin World, no. 18, pp. 13, Early Summer
2007.
"Calumet Electronics Presents New RoHS Compliance Informational Video:
Lead-Free Finishes and Material Selection," PCB007, Sept. 6,
2005.
"Cambridge Environmental Assessments take the strain out of REACH
registration," Anti-Corrosion Methods and Materials, vol. 56 no.
1, pp. xx-xx, 2009.
"Can I upgrade my Long wave IR/convection oven for use with lead-free?,"
Circuitnet, July 10, 2006.
"Can I use my old oven for lead-free reflow?," Circuitnet,
May 7, 2006.
"Can lead-free solder joints be good looking? (and give better sound
quality?)," Connector Specifier, Dec. 15, 2003.
"Can PCB's designed for Sn/Pb be used in a Pb free assembly?,"
Circuitnet, Apr. 17, 2006.
"Canadian Firms Next to Adopt RoHS Standard?," www.metalfinishing.com/, July
27, 2006.
"Caring about Electrical Waste Needn't Cost the Earth," PCB007
, Dec. 15, 2006.
"Case Study in Successful Lead-free Implementation using Both SAC305 and K100
Solders," Lead-Free Connection, vol. 3 no. 2, pp. 1, Aug.
2006.
"Case Study: One company's lead-free journey," Global SMT and
Packaging, vol. 7 no. 10, pp. 58, 60-61, Oct. 2007.
"Case study: Orchestrating RoHS implementation of TI's E&PS global products,"
Proceedings of the 2006 IEEE International Symposium on Electronics and
the Environment, San Francisco, CA, May 8-11, 2006, pp. 106.
"CEA Recommends a National Framework for Electronics Recycling to Congress,"
PCB007, Sept. 8, 2005.
"Challenges and Efforts Toward Commercialization of Lead-free Solder- Road Map
2000 for Commercialization of Lead-free Solder- ver 1.3," Japan Electronic
Industry Development Association (JEIDA).
"Challenges in Manufacturing Reliable Lead Free Components," Altera, Feb.
2004.
"CHALLENGES of Pb-free compliance overcome," Electronics Manufacture
and Test, pp. xx-xx, Mar. 2005.
"Change Leaded to Lead-Free, Lead-Free to Leaded," Design News
, vol. 61 no. 11, pp. 26, Aug. 14, 2006.
"Chapter C: Conductive Polymers Level 1: Introduction."
"Chapter C: Conductive Polymers Level 2: Conclusions and Guidelines."
"Chemical Regulation Challenges Industry," Standardization News,
vol. 35 no. 2, pp. 16-21, Mar./Apr. 2008.
"Chemicals Known to the State to Cause Cancer or Reproductive Toxicity,"
State of California Environmental Protection Agency, Mar. 4, 2005.
"Chicken or egg? EMS leads the way on lead-free," Electronics
Manufacture and Test, vol. xx no. xx, pp. xx, June 2004.
"China Acts on Hazardous Substances Ban," IPC Review, pp. 7,
Sept. 2005.
"China "Complying with RoHS"," PCB007, Nov. 17, 2006.
"China eyes European environmental directives," Connector Specifier
, Jan. 20, 2005.
"China Eyes European Environmental Directives," Advanced Packaging
, vol. xx no. xx, pp. xx-xx, Jan. 20, 2005.
"China kicks off own version of RoHS directive," Global Sources
, Jan. 30, 2007.
"China lags as the RoHS deadline nears," SourceESB, Apr. 6, 2006.
"China Promulgates "RoHS Plus" Laws," IPC Review, pp. 22, Apr.
2006.
"China Readies RoHS Marking and Limits Standards," Conformity,
2007 Engineers' Reference Guide, pp. 221, 2007.
"China RoHS- Deja Vu?," Surface Mount Technology (SMT), vol. 20
no. 12, pp. 14, Dec. 2006.
"China RoHS Gold and Silver Packages: The Fastest, Simplest, and Most
Affordable Way to China RoHS Compliance," PCB007, Nov. 3,
2006.
"China RoHS Guidance Notes V3.0 Including Standards FAQ Updates and Much
More," PCB007, Apr. 2, 2007.
"China RoHS Standards Ready - Marking Required Only On Products Exceeding
Concentration Limits," PRWeb, May 20, 2006.
"China RoHS Standards Ready - Marking Required Only On Products Exceeding
Concentration Limits," PCB007, May 20, 2006.
"China RoHS Standards to Become Effective March 1," Circuitree,
vol. 20 no. 2, pp. 28, Feb. 2007.
"China-RoHS test service for European exporters," emsnow,
Mar. 1, 2007.
"China RoHS versus EU RoHS," Update Intertek, no. 2008-1, pp.
18, 2008.
"China's own RoHS law to come into effect on March 2007," Global
Sources, July 12, 2006.
"China's RoHS Marking and Limits Standards Ready for Approval,"
Conformity, vol. 11 no. 8, pp. 88, 90, Aug. 2006.
"China's RoHS - Vague and Obstructive," Design News, vol. 61
no. 2, pp. xx, Feb. 6, 2006.
"Chinese Government Delegation Coming to US to Explain New Environmental
Regulations Impacting the High-Tech Industry," PCB007, Oct.
11, 2006.
"Christmas gadgets add to recycling headache," EE Times Europe
, Dec. 14, 2007.
"Chrom(VI)freie Fahrzeugindustrie," Galvanotechnik, vol. 97
no. 7, pp. 1708-12, July 2006.
"Chromate Coating from Trivalent Solution," Products Finishing,
vol. 47 no. 11, pp. 64-65, Aug. 1983.
"Chrome-free coil coating primers -- it's time to switch," Finishing
, vol. 28 no. 6, pp. 22, Sept./Oct. 2004.
"Chrome free pre-treatment launched," Finishing, vol. 30 no. 2,
pp. 14-15, Mar./Apr. 2006.
"Chromium: Science, Technology and the Future," Plating and Surface
Finishing, vol. 92 no. 6, pp. 14-16, June 2005.
"Cleaner product design: a practical approach."
"Cleaner product design: an introduction for industry."
"Cleaning residue after wave solder process," Circuitnet,
Oct. 15, 2007.
"Cleaning tin-lead and lead-free boards," Circuitnet, Apr. 2,
2007.
"Close Shave," Printed Circuit Design and Manufacture, vol.
20 no. 8, pp. 10, Aug. 2003.
"Coated Wire and Cable Industry: Lead Alternatives and Testing for Restricted
Substances," Toxics Use Reduction Institute, Mar. 23, 2004.
"Coating or encapsulating tin-lead solder joints?," Circuitnet
, Sept. 24, 2007.
"Coating to stop tin whisker growth?," Circuitnet, Aug. 14,
2006.
"Coil Coating Org Offer RoHS Tutorial," Products Finishing
, vol. 73 no. 9, pp. 8, June 2009.
"Coming environmental rules won't protect European PCB makers, says Numakura,"
PCB007, Oct. 31, 2003.
"Coming Up ROSA," Circuits Assembly, vol. 18 no. 10, pp.
46-47, Oct. 2007.
"Comment - Free from Pb-free? It's not so clear-cut," Components in
Electronics, vol. xx no. xx, pp. xx-xx, May 2004.
"Comment on Greenpeace iPhone study," emsnow, Oct. 22, 2007.
"Comments on Test Methods & Criteria for Tin Whiskers in Surface Mount
Passive Devices," EIA/ECA-CB22, Nov. 2005.
"Comments on the Greenpeace iPhone study," evertiq, Oct. 20,
2007.
"Commission adopts Communication on Precautionary Principle," Feb. 2,
2000.
"Commission ruling shock on DecaBDE," emsnow, July 17, 2006.
"Companies May Not be Included in New Manufacturing Contracts if Their
Employees Don't Know What RoHS and WEEE Stand For," PRWeb,
Dec. 5, 2005.
"Companies offer RoHS compliance services," SourceESB, Feb. 22, 2006.
"Comparison of Electroless Ni/Immersion Au vs. Electrolytic Ni/Au," Merix.
"Comparison of halogen free base materials," PCB007, Oct. 21,
2000.
"Complete list of EU RoHS Exemptions, Issue 1.0," Nov. 10, 2006.
"Complying to RoHS," Purchasing, vol. xx no. xx, pp. xx-xx,
May 19, 2005.
"Component Event Management Expert PCNalert Introduces Lead-Free Parts
Category to Component Database," Business Wire, vol. xx no. xx,
pp. xx-xx, Aug. 25, 2003.
"Component Heat Resistance to Lead-Free Reflow Soldering," Tyco
Electronics Test Specification 109-201, Mar. 3, 2004.
"Component Heat Resistance to Wave Soldering," Tyco Electronics Test
Specification 109-202, Feb. 12, 2004.
"Component Pb conversion helps OEMs find economic equalizer,"
Circuitnet, Nov. 29, 2007.
"Component Shift During Reflow," Circuitnet, Oct. 29, 2007.
"Component Solderability Workshop Proceedings (18-19 September 1991)",
Electronics Manufacturing Productivity Facility PC0012, Sept. 18-19, 1991.
"Components to be Next Lead-Free Headache," IEE Review, vol. 49
no. 11, pp. 12, Dec. 2003.
"Computer Manufacturer To Offer Customers Free Recycling,"
Conformity, vol. 11 no. 9, pp. 62-63, Sept. 2006.
"Concentration Limits, Marking Standards Set for China RoHS," SMT Web
Exclusive Article.
"Concerns over lead-free solder," Elektron, vol. 24 no. 6, pp.
17, June 2006.
"Concerns over RoHS revisions," Electronics Manufacture and Test
, vol. xx no. xx, pp. xx-xx, June 30, 2008.
"Concerns raised over 'lead-free' solder health," Dataweek,
vol. xx no. xx, pp. xx-xx, June 14, 2006.
"Confused about WEE/RoHS? Help is at hand," Electronics Manufacture
and Test, vol. xx no. xx, pp. xx, May 2004.
"Confusion in the UK over WEEE," evertiq, Feb. 7, 2007.
"Confusion over exemptions to RoHS rules," Components in Electronics
, vol. xx no. xx, pp. xx-xx, Mar. 2006.
"Confusion Reigns while Lead-Free Conquers," May 2, 2005.
"Considerations for Printing Lead-free Solder Paste," AIM.
"Consumers choosing green products," Electronics Manufacture and
Test, vol. xx no. xx, pp. xx-xx, Aug. 11, 2008.
"Control of Whisker Growth in Tin Alloy Coatings," ST Microelectronics
Application Note AN2035, Nov. 2004.
"Converting to VOC-Free Fluxes," Circuits Assembly, vol. 19
no. 9, pp. 49, Sept. 2008.
"Copper Alloy Guide," Olin Brass.
"Copper dissolution," Feb. 12, 2010.
"Copper Dissolution issue," Circuitnet, Nov. 5, 2006.
"Cored Solder Wire," Electronics Manufacture and Test, vol.
xx no. xx, pp. xx-xx, Mar. 17, 2008.
"Correction on California's RoHS Regulations," Conformity,
vol. 12 no. 1, pp. 10, Jan. 2007.
"Cost Effective, Nontoxic Process for Depositing Thick, Highly Wear
Resistant Chromium Coatings," Materials Technology, vol. 11 no.
2, pp. 43-45, Mar-Apr. 1996
"Cost-Effective Support for RoHS Compliance: A New Innov-X Initiative,"
PCB007, July 25, 2006.
"Cost of Chrome Regulation: $26M Annually," Products Finishing,
vol. 75 no. 1, pp. 9-10, Oct. 2010.
"Cost of Lead-Free Solder Materials," Adhesives & Sealants
Industry, vol. 14 no. 7, pp. 37-39, July 2007.
"Cost of recycling PCs is lower than expected," Electronics Weekly
, June 2, 2006.
"Countdown To Compliance," CircuiTree, vol. 18 no. 12, pp. 7,
Dec. 2005.
"Counterfeiting Moves Up the Technology Ladder," SourceESB, Sept. 19,
2006.
"Counterfeits 'not just from the Far East'," Components in
Electronics, vol. xx no. xx, pp. xx-xx, May 2006.
"Counting the Cost of Component Counterfeiting," Electronics
Manufacture and Test, vol. xx no. xx, pp. xx-xx, Oct. 29, 2007.
"Creep Analysis of Lead-Free Solders Undergoing Thermal Loading,"
NASA Tech Briefs, vol. 32 no. 2, pp. xx-xx, Feb. 2008.
"Critical Reliability Challenges for the International Technology Roadmap for
Semiconductors (ITRS)," International SEMATECH Technology Transfer
#03024377A-TR.
"Cure or treatment for tin disease," finishing.com.
"Current status of EU lead-free soldering," evertiq, Mar. 30,
2005.
"Customer Relationship Module Adds Marketing Benefits To WEEE Compliance
Websites," PCB007, July 7, 2006.
"Database for Properties of Lead-Free Solder Alloys, Version 1.0."
"Database of defects," Electronics Manufacture and Test, vol.
xx no. xx, pp. xx-xx, Jan 7, 2008.
"Dauernde Herausforderung - die Diskussion um die Verwendung von Chrom(VI),"
Galvanotechnik, vol. xx no. xx, pp. 1447-1449, June 2008.
"Deca-BDE exemption from EU RoHS directive awaits council approval,"
emsnow, Apr. 21, 2005.
"Deca-BDE Exemption - Statement on Greens Press Release," evertiq
, July 14, 2006.
"Deca-BDE Exemption - Statement on Greens Press Release," PCB007
, July 14, 2006.
"DEFECTS down with inert soldering," Electronics Manufacture and
Test, vol. xx no. xx, pp. xx-xx, Feb. 2005.
"Defense Engineers Still See Problems With Lead-Free Parts," Design
News, vol. 61 no. 6, pp. xx, Apr. 24, 2006.
"Deflux Eutectic and Lead-Free Assemblies," Circuitnet, Sept.
4, 2007.
"DEK concludes research on lead-free pastes," EE Times - Asia
, vol. xx no. xx, pp. xx-xx, June 5, 2006.
"DEK Report Details Lead-free Stencil Design Rules," SMT Web Exclusive
Article.
"Delay of the WEEE Directive Implementation In the UK," PRWeb
, May 3, 2005.
"Design and assembly process implementation for BGAs released,"
Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Apr. 21,
2008.
"Design Chain launches China RoHS site," Design News, vol. 61
no. 7, pp. xx, May 15, 2006.
"Design engineers and obsolescence - the distributor interface,"
Components in Electronics, vol. xx no. xx, pp. xx-xx, May 2005.
"Design for Environment: Phase I."
"Developing expertise in Pb-free materials," Electronics Manufacture
and Test, vol. xx no. xx, pp. xx, Sept. 2004.
"Developments in Chromium Plating," Plating and Surface Finishing
, vol. 74 no. 7, pp. 29-32, July 1987.
"DFx Lead-Free Review," Dell.
"Diagnosing Intermittent BGA Connections," Circuits Assembly,
vol. 19. no. 3, pp. 60, Mar. 2008.
"Did You Know?," TUV Rheinland World News, pp. 9, May/June
2005.
"DirectFET Technology: Materials and Practices Application Note,"
International Rectifier Application Note AN-1050, Sept. 2003.
"Directive 2002/96/EC (WEEE) Overview on National Registers in Member States,"
ORGALIME, July 15, 2005.
"Distinct Part Numbers Major Request at RoHS Summit," SMT Web Exclusive
Article.
"Distinctive Part Numbers for RoHS-compliant Parts Desired,"
Advanced Packaging, vol. xx no. xx, pp. xx-xx, Apr. 28, 2005.
"Distribution in 2005: Slow and Steady," Hynix Semiconductor, Jan. 26,
2005.
"Distributor wants a U.S. RoHS law," Purchasing, vol. xx no.
xx, pp. xx-xx, Oct. 19, 2006.
"Distributor warns of Pb-free complacency and offers data,"
Electronics Weekly, Feb. 6, 2004.
"Distributors need to show RoHS compliance," Purchasing, vol.
xx no. xx, pp. xx-xx, Nov. 2, 2006.
"Distributors' Position Paper on Lead Free Product Transition and RoHS
Compliance," National Electronic Distributors Association, June 22, 2004.
"Distributors see smooth RoHS conversion," Purchasing, vol.
xx no. xx, pp. xx-xx, June 15, 2006.
"Distributors take dominant role as RoHS ripples through,"
Components in Electronics, vol. xx no. xx, pp. xx-xx, Feb. 2005.
"Donate Rather Than Dump That Redundant Computer - UK Businesses are Asked,"
PRWeb, Nov. 15, 2004.
"Dr Dongkai Shangguan, PhD, Corporate Technology Leadership Group,
Flextronics, discusses lead free solder reliability," EMasia,
Jan. 2009.
"Dr RoHS answers your questions," Electronics Weekly, Apr.
19, 2006.
"Dr. Ron Lasky: A Solder Alloy and Solder Paste Overview," Surface Mount
Technology (SMT), pp. 10,12-14,16, May 2020.
"Drawing Notes for documenting RoHS and Lead Free Capable Material, Merix.
"Drawing the Line: How Green Electronics Turn Brown When Exposed to the
Light of Day," IPC Review, vol. 48 no. 5, pp. 19, June 2007.
"Dross recovery," Electronics Manufacture and Test, vol. xx
no. xx, pp. xx-xx, Oct. 7, 2006.
"DTI Report: Lead-Free Awareness Up," Printed Circuit Fabrication
, vol. 23 no. 7, pp. 18,20, July 2000.
"DTSC Calls for Comments Regarding Green Chemistry Initiative,"
PCB007, May 14, 2008.
"Dumb down directives - please!," Components in Electronics,
vol. xx no. xx, pp. xx-xx, Aug. 2005.
"Dutch Government Bans PS ones," Dec. 4, 2001.
"Dynacast Announces Results of Research into Alternative Diecast Coatings for
Compliance with Pending EC Regulations to Eliminate Hexavalent Chromium
Finishes," Dynacast, Nov. 5, 2002.
"E-waste campaign unveiled," Components in Electronics,
Dec./Jan. 2008.
"E2open Delivers First Eco-Compliance Solution to Fully Support the IPC-1752
Standard," PCB007, Feb. 8, 2006.
"EC welcomes agreement on WEEE, Restriction of Hazardous Substances,"
PCB007, Nov. 1, 2002.
"Eco-Design: EuP Directive Update," Components in Electronics
, vol. xx no. xx, pp. xx-xx, May 2006.
"Economic Impact of the European Union RoHS Directive on the Electronics
Industry," Technology Forecasters Inc., Jan. 21, 2008.
"Effect on Eutectic Melting point for a multiple alloy board,"
Circuitnet, July 13, 2008.
"EFIP Calls for Alternative to EU's Proposed Lead Ban," Circuits
Assembly, vol. 10 no. 8, pp. 8, Aug. 1999.
"EIA and JGPSSI to Update International Joint Industry Guide for Electronic
Products," Electronic Industry Alliance (EIA) and Japan Green Procurement
Survey Standardization Initiative (JGPSSI), Sept. 13, 2006.
"EIA, JGPSSI, and JEDEC Unveil New International Joint Industry Guide for
Electronic Products," Electronic Industry Alliance, May 25, 2005.
"EIPC SpeedNews - European PCB Industry Snapshot," PCB007,
Jan. 31, 2006.
"Electric gadgets "must get greener"," The Chemical Engineer (London)
, no. 765, pp. 5, Mar. 2005.
"Electrically Conducting Adhesives," Electronics Manufacture and
Test, vol. xx no. xx, pp. xx-xx, Nov. 7, 2002.
"Electrodeposited Pb-free Solder and Whisker Prevention," Journal of
Research of the National Institute of Standards and Technology, vol.
106 no. 2, pp. 490, Mar./Apr. 2001.
"Electronic and electrical waste: EU Commission Takes Legal Action Against
Eight Member States," PCB007, July 14, 2005.
"Electronic Design's Guide To New International Environmental Laws."
"Electronic Finishes," Reliable Plating.
"Electronics companies urge EU to restrict more RoHS in electronic products,"
evertiq, May 19, 2010.
"Electronics Industry Calls for Federal RoHS Legislation," Design News
, vol. 61 no. 16, pp. 26, Nov. 6, 2006.
"Electronics Industry is Severely Unprepared for REACH Regulation,"
Power Electronics Technology, vol. 34 no. 8, pp. 10-11, Aug. 2008.
"Electronics Industry Lacks Awareness of UK Ban on Brominated Flame
Retardants," Surface Mount Technology (SMT), vol. 18 no. 11,
pp. 27, Nov. 2004.
"Electronics Industry Takes Aim at Hazardous Substances," Quality Digest
, vol. 25 no. 6, pp. 9, June 2005.
"Electronics Makers Race to Meet RoHS Deadline," CENS.com,
Nov. 3, 2005.
"Electronics Makers Race to Meet RoHS Deadline," CENS.com,
Mar. 13, 2006.
"Electronics Makers Race to Meet RoHS Deadline," PCB007, June
13, 2006.
"Electronics manufacturers must go beyond 'green' laws," evertiq
, Nov. 30, 2006.
"Electronics recycling hits a Weee problem," Professional Engineering
, vol. 18 no. 15, pp. 17, Aug. 17, 2005.
"Electronics Recycling Legislation in the USA & Canada - Actual and
Pending," Apr. 29, 2005.
"Electronics Recycling: What to Expect from Global Mandates," PCB007
, Jan. 17, 2005.
"Electro-scrap mountains still growing," Professional Engineering
, vol. 19 no. 1, pp. 38-39, Jan. 11, 2006.
"ELFNET and COST 531 Deliver Lead-Free Solder Alloy Properties Database,"
evertiq, May 22, 2006.
"ELFNET Delivers 'Issues To Solutions' Initiative in Lead-Free Soldering,"
evertiq, Nov. 22, 2005.
"ELFNET Launches European Roadmap," SMT Web Exclusive Article.
"ELFNET publishes lead-free soldering status report 2006," emsnow
, Apr. 9, 2007.
"Eliminating Lead Solder," Sharp.
"Elimination of Lead from Electrical and Electronic Equipment - the Dilemma of
Tin-Whisker Growth," Eurocomp, no. 7, pp. 3-6, Autumn 2004.
"EMA Design Automation and Ageus Solutions Align Forces; Making RoHS/WEEE
Compliance an Inherent Part of the Design Process," PCB007,
Mar. 21, 2006.
"EMSF Monitors Low-silver BGAs," SMT Web Exclusive Article.
"EN 62321:2009, Electrotechnical products - Determination of levels of six
regulated substances (lead, mercury, cadmium, hexavalent chromium,
polybrominated biphenyls, polybrominated diphenyl ethers)," British Standards
Institution (BSI), Apr. 2009.
"End of Life Recycling Technologies - Hard Drive Impairment,"
Proceedings of the 2006 IEEE International Symposium on Electronics and the
Environment, San Francisco, CA, May 8-11, 2006, pp. 359.
"Energy-Use for Electronic Products (EuP) in Play," Printed Circuit
Design and Fab, vol. 25 no. 9, pp. 10, Sept. 2008.
"Engineers Doubt UK Sustainability Policy," IEE Review, vol. 50
no. xx, pp. 16, Sept. 2004.
"Engineers doubt UK sustainability policy," Power Engineer, vol.
18 no. 5, pp. 6, Oct./Nov. 2004.
"Enhancing Pb-free Solder Joint Reliability," PCB007, Mar. 3,
2006.
"ENIG and ImAg Finishes with Pb-Free Paste," Circuits Assembly
, vol. 17 no. 8, pp. 54, Aug. 2006.
"ENVIRON and COCIR cooperate on REACH & RoHS compliance,"
evertiq, Sept. 1, 2008.
"ENVIRON Assists Electronics Companies to Comply with WEEE Regulations in
France," PCB007, Sept. 5, 2006.
"Environ Celebrates 15th Pan-European WEEE Website," PCB007,
May 31, 2006.
"Environmental Aging Effects on the Durability of Electrically Conductive
Adhesive Joints."
"Environmental Compliance: A Year in Review and What 2009 Will Bring,"
IPC Review, vol. 2 no. 1, pp. 14-15, Jan./Feb. 2009.
"Environmental Management System," EE Times - Asia, vol. xx
no. xx, pp. xx-xx, Dec. 13, 2004.
"Environmental Outlook for 2007," IPC Review, vol. 48 no. 1, pp.
19,22, Jan. 2007.
"Environmental Regs Cause Slow Moving Train Wreck for Companies That Are Not
Ready," PRWeb, Aug. 19, 2005.
"Environmental regulations become patchwork nightmare," SourceESB, Aug.
10, 2005.
"Environmental Regulatory Update," Conformity, vol. 11 no. 4,
pp. 11, Apr. 2006.
"Environmental Regulatory Update," Conformity, vol. 11 no. 5,
pp. 62, May 2006.
"Environmental Regulatory Update," Conformity, vol. 11 no. 6,
pp. 56, 58, June 2006.
"Environmental Regulatory Update," Conformity, vol. 11 no. 7,
pp. 45, July 2006.
"Environmentally-safe FPC," Fujikura Technical Review, no.
33, pp. 57, Jan. 2004.
"Envirowise steers SMEs toward compliance," Green SupplyLine,
May 1, 2005.
"EPA Amends CRT Recycling Regulations," Conformity, vol. 11
no. 11, pp. 9, Nov. 2006.
"EPA Amends CRT Recycling Requirements," Conformity, 2007
Engineers' Reference Guide, pp. 223, 2007.
"EPA Award recognizes air force move to use non-chromate conversion coatings,"
Pigment & Resin Technology, vol. 33 no. 6, pp. xx, 2004.
"EPA Proposes Tighter Chromium Limits," Products Finishing, vol.
76 no. 6, pp. 12, Mar. 2012.
"EPA Rationale for New Chromium Limits and NASF Response," Products
Finishing, vol. 76 no. 6, pp. 12, Mar. 2012.
"EPA Releases Report on U.S. Electronic Waste," Conformity, 2008
Engineers' Reference Guide, pp. 238, 2008.
"EPA to Examine TBBPA Alternatives," IPC Review, vol. 47 no. 6,
pp. 22, July 2006.
"Epson implements program to eliminate RoHS Directive chemicals,"
PCB007, Oct. 2, 2004.
"EPTE Newsletter from DKN Research - JPCA Show 2006 (Part IV) - Materials,"
PCB007, June 27, 2006.
"Equilibrium Diagram of the Tin-Antimony Alloy System," Tin and its Uses
, no. 25, pp. 8, Dec. 1951.
"Equilibrium Diagram of the Tin-Nickel Alloy System," Tin and its Uses
, no. 24, pp. 6, July 1957.
"Equilibrium Diagrams Tin-Copper," Tin and its Uses, no. 23, pp.
7-8, Dec. 1950.
"Equipment Market Benefits from Lead-free Laws," SMT Web Exclusive
Article.
"Equipment waste tops one million tonnes a year," Electronic Product
Design, vol. xx no. xx, pp. xx-xx, Mar. 18, 2008.
"ERA reviewing Category 8 & 9 for RoHS Directive," evertiq,
Dec. 1, 2005.
"ERA Technology on British industry readiness to implement lead-free solder
ban: smaller PCB makers not ready," PCB007, Jan. 20, 2003.
"ERA wins EC contract for review of RoHS Directive exemptions."
"ERNI publishes roadmap for RoHS compliance," Connector Specifier
, vol. 20 no. 10, pp. xx-xx, Oct. 2004.
"EU Adopts REACH," SMT Web Exclusive Article.
"Eu-Altauto-Richtlinie bereinigt Markt der Galvanikanbieter,"
Galvanotechnik, vol. xx no. xx, pp. 2108-2110, Sept. 2005.
"EU and China RoHS Compliance Now Faster and Easier: Full IPC 1752
Functionality is Now Available in Material Declaration Wizard Software
MDW/1752," PRWeb, Oct. 5, 2006.
"EU Announces Consultation on New Exemption List," Dec. 23, 2004.
"EU Approves TBBPA, Is Commended By Albemarle," CircuiTree,
vol. 21 no. 4, pp. xx-xx, Apr. 2008.
"EU backs landmark chemicals law," BBC News, Dec. 13, 2005.
"EU chemicals law 'could disrupt supply chains'," Professional
Engineering, vol. 23 no. 9, pp. 3, June 2, 2010.
"EU Commission Amends Exemptions to The RoHS Directive," Conformity
, vol. 11 no. 1, pp. 46, Jan. 2006.
"EU Commission Extends RoHS Directive Exemption for Shielding,"
Conformity, vol. 12 no. 1, pp. 42, Jan. 2007.
"EU Commission Examines RoHS "Loophole"," Conformity, vol. 11
no. 8, pp. 9, Aug. 2006.
"EU Commission Poised to Review WEEE Directive," Conformity,
vol. 11 no. 10, pp. 72, Oct. 2006.
"EU Commission Publishes New WEEE Directive," IN Compliance Magazine
, pp. 8, Oct. 2012.
"EU Commission Releases Guidance Document on General Product Safety
Directive," Conformity, vol. 11 no. 3, pp. 44, Mar. 2006.
"EU Commission Requests Feedback on RoHS Impact Assessment,"
PCB007, June 16, 2008.
"EU Competent Authorities Confirm No Restrictions on Deca-BDE,"
CircuiTree, vol. 20 no. 12, pp. xx-xx, Dec. 2007.
"EU confirms no classification of TBBPA for health," evertiq,
Nov. 25, 2005.
"EU Considers Lowering Targets for Battery Collection," Conformity
, vol. 11 no. 3, pp. 44, Mar. 2006.
"EU-Court ruling does not question flame retardant Deca-BDE,"
evertiq, Apr. 2, 2008.
"EU Debates RoHS Exemptions," Advanced Packaging, vol. xx no.
xx, pp. xx-xx, Mar. 29, 2005.
"EU decision supports continued use of Deca-BDE, says EBFRIP,"
PCB007, June 2, 2004.
"EU directive threatens suppliers," Automotive Engineer, vol. 28
no. 5, pp. 4-5, May 2003.
"EU governments looking to increase RoHS enforcement," evertiq
, Oct. 17, 2008.
"EU governments looking to increase RoHS enforcement," Circuit World
, vol. 35 no. 1, pp. xx-xx, 2009.
"EU Green Rule Forces China To Raise Appliance Prices," Appliance
Design, vol. xx no. xx, pp. xx-xx, June 17, 2005.
"EU in a muddle over banned substance wavers," Feb. 18, 2005.
"EU Issues Correction on New Battery Directive," Conformity,
vol. 12 no. 1, pp. 42, Jan. 2007.
"EU launches monitoring for deca-BDE, hesitates over RoHS exemption,"
Additives for Polymers, vol. 2005 no. 7, pp. 11-12, July 2005.
"EU measures most important in reducing risks of flame retardants in Sweden,"
evertiq, Mar. 30, 2006.
"EU Parliament Approves New Battery Directive," Conformity,
vol. 11 no. 10, pp. 72, Oct. 2006.
"EU Policies on Electric and Electronic Waste Q&A," PCB007,
July 12, 2005.
"EU Ready to Ban More Chemicals," Design News, vol. 61 no. 1,
pp. xx, Jan. 9, 2006.
"EU Releases New Battery Directive," Conformity, vol. 11 no.
12, pp. 10, Dec. 2006.
"EU Releases Proposed RoHS Revisions," PCB007, Dec. 9,
2008.
"EU Releases Proposed RoHS Revisions," PCB007, Dec. 10, 2008.
"EU Requests Input on RoHS, WEEE," SMT Web Exclusive Article.
"EU RoHS "Enforcement Guidance" Document Available," Conformity
, vol. 11 no. 8, pp. 9, Aug. 2006.
"EU Rules Curb Chinese Exports," Appliance Design, vol. xx
no. x, pp. xx-xx, July 2006.
"EU Sets Eco-design Directive Framework to be Condition of CE Marking,"
Conformity, vol. 10 no. 10, pp. 70, Oct. 2005.
"EU TAC exempts FFL technology in RoHS," Global Sources,
Feb. 28, 2006.
"EU Tightens RoHS Exemptions," Conformity, 2007 Engineers'
Reference Guide, pp. 221, 2007.
"EU to Impose EUP Directive in August 2007," CENS.com, Aug.
28, 2006.
"EU, UK, France to block Swedish attempt to ban Deca-BDE," evertiq
, Feb. 28, 2006.
"EU Updates RoHS FAQs," Conformity, vol. 11 no. 12, pp. 10,
Dec. 2006.
"EU-wide REACH Enforcement Project Coordinated," SMT Web Exclusive
Article.
"EuP to challenge makers of "energy-using products" in 2007," EE
Times - Asia, vol. xx no. xx, pp. xx-xx, Oct. 9, 2006.
"European Commission Checklist."
"European Commission Sets Official RoHS Limits," Conformity, pp.
213, Conformity 2006: The Annual Guide.
"European COST Action 531L Basic Lead-free Soldering Research," Tin
World, no. 17, pp. 6-, Spring 2007.
"European directives vs. Tin Whiskers & Tin Pest," finishing.com
.
"European directives: web advice for best environmental practice,"
European Electronics Engineer, vol. xx no. xx, pp. xx-xx, Jan 11, 2002.
"European governments look to increase RoHS enforcement,"
Electronics Manufacture and Test, Oct. 21, 2008.
"European green directives expected to hit hard Taiwan`s economy,"
CENS.com, May 23, 2005.
"European Lead-free Technology Roadmap Ver1: February 2002," Soldertec,
Feb. 2002.
"European REACH Targets Chromium and Cobalt," Products Finishing,
vol. 76 no. 5, pp. 10-11, Feb. 2012.
"European RoHS directive may cause component inventory misalignment,"
Military & Aerospace Electronics, vol. 18 no. 1, pp. xx-xx,
Jan. 2007.
"European Standard approved, setting out marking requirements under WEEE law,"
tdctrade.com, no. 23, Nov. 25, 2004.
"European Union Set to Implement Ban on Hazardous Substances in Electronic
Equipment," JOM, vol. 58 no. 6, pp. 8-9, June 2006.
"EU's WEEE Directive May Be Revised," Conformity, 2007 Engineers'
Reference Guide, pp. 222, 2007.
"Eutectic reflow for Pb-free BGAs," Circuitnet, Apr. 21,
2008.
"Evaluation of Environmentally-sensitive Material Content in IT Products,"
Feb. 20, 2003.
"Evidence of Poor Practice," Circuits Assembly, vol. 18 no.
4, pp. xx-xx, Apr. 2007.
"Examples of tin-whiskers failures," evertiq, Oct. 11, 2007.
"Examples of Whiskergrowing in Industry Applications," 3rd
Electronic Materials and Assembly Processes for Space (EMPS) Workshop,
Genova, Italy, Mar. 21, 2012.
"Executive Guide: RoHS and compliance," Electronic Business,
July 11, 2006.
"Executive Summary: Responses to Third WEEE and RoHS Consultation."
"Exel Launches 'The WEEE Oracle'," PCB007, Jan. 13, 2006.
"Exemption application of RoHSUSA Inc 5/20/06."
"Expanding the Electronics Assembly Process Window with the New Generation of
Solder Pastes," AIM.
"Experiments show lead-free pastes will give great results with 0201s,"
evertiq, May 22, 2006.
"Experiments show lead-free pastes will give great results with 0201s,"
Dataweek, vol. xx no. xx, pp. xx-xx, Oct. 4, 2006.
"Extrusion Process."
"FACTSHEET: WEEE and RoHS DIRECTIVES."
"Fake parts, real threat," Electronics Manufacture and Test,
vol. xx no. xx, pp. xx-xx, July 11, 2008.
"FAQs for WEEE/RoHS Directives."
"FAQS for WEEE/RoHS Directives," TUV Rheinland.
"FARNELLinone Guide to RoHS Compliance, Part 1," Jan. 2005.
"FARNELLinone Guide to RoHS Compliance, Part 2," Jan. 2005.
"Fast Moving Tin-Nickel Plating," Tin and its Uses, no. 69, pp.
6, 1965.
"Faster Tin Plating from Alkaline Baths: The Tin Sol Process," Tin and
its Uses, no. 88, pp. 11-12, 1971.
"Federal Court Upholds OSHA Chromium PEL," Products Finishing
, vol. 73 no. 8, pp. 13, May 2009.
"Federal Electronics Introduces RoHS Conversion Services," PRWeb
, Dec. 7, 2005.
""Federal RoHS Legislation Is Imperative", Warns Newark InOne, As EU Law Takes
Hold," PCB007, Sept. 19, 2006.
"Federal RoHS legislation is imperative warns US distributor," Tin
World, no. 15, pp. 13, 2006.
"FEI-hosted debate on lead-free components and PCBs looks for 'ways forward'
in a lead-free world," PCB007, Nov. 30, 2001.
"Fewer steps, more flexibility for lead-free wafer bumps," Solid State
Technology, vol. 47 no. 12, pp, 18, 20, Dec. 2004.
"Fillet Lifting," Electronics Manufacture and Test, vol. xx
no. xx, pp. xx-xx, Feb. 7, 2006.
"Final Report: "2007 Lexus ES-350 Unintended Acceleration"," Apr. 30,
2008.
"Finding leaded parts after the RoHS deadline," SourceESB, July 27, 2005.
"Finishing Industry - Department of Defense Meet for 3rd Defense Metal
Finishing Workshop Held in Utah," Plating & Surface Finishing
, vol. 94 no. 7, pp. 12-13, July. 2007.
"Finite element models evaluate lead-free solders," Advanced Materials
& Processes, vol. 166 no. 5, pp. 18, May 2008.
"Firms on Track to Meet RoHS Rules," CENS.com, July 11, 2006.
"Firms on Track to Meet RoHS Rules," PCB007, July 11, 2006.
"First WEEE prosecution carried out," evertiq, Jan. 30, 2006.
"Flame Retardants in Printed Circuit Boards (Draft)," IPC Brussels
, Brussels, Belgium, June 18, 2008, pp. xx-xx.
"Flexible WEEE Collections from Wincanton," PCB007, June 5,
2006.
"Flexibility is Key to Handling Lead-free Reflow," PCB007,
Mar. 6, 2006.
"Flip Chip on FPC," Fujikura Technical Review, no. 29, pp.
66-67, Jan. 2000.
"Flowchart to determine if equipment is within the scope of RoHS," Rogers.
"Flowchart to determine if equipment is within the scope of WEEE," Rogers.
"Foretelling Failure," Product Design & Development, vol. 62
no. 7, pp. 38, July 2007.
"Former U.S. Ambassador to EU Warns of Threat to REACH," PCB007
, May 30, 2008.
"Forward planning can reduce obsolescence risks," Components in
Electronics, vol. xx no. xx, pp. xx-xx, May 2005.
"Fragility of Pb-free Solder Joints," Universal Instruments.
"Free RoHS BOM service offered," Purchasing, vol. xx no. xx,
pp. xx-xx, Nov. 3, 2005.
"Free web service on offer for environmental rules," Electronics
Weekly, Feb. 15, 2006.
"Freescale Networking and Communications Products Pb-Green Strategy,"
Freescale Semiconductor, 2004.
"Frequently Asked Questions About China's RoHS Requirements," Conformity
, vol. 12 no. 3, pp. 62, Mar. 2007.
"Frequently Asked Questions (FAQ) About The European Union's WEEE and RoHS
Directives," SEMI, July 20, 2005.
"Frequently Asked Questions About the EU's RoHS and WEEE Directives,"
Conformity, 2007 Engineers' Reference Guide, pp. 203-211, 2007.
"Frequently Asked Questions on Directive 2002/95/EC on the Restriction of the
Use of certain Hazardous Substances in Electrical and Electronic Equipment
(RoHS) and Directive 2002/96/EC on Waste Electrical and Electronic Equipment,"
European Commission, Aug. 2006.
"Frequently asked questions on RoHS and WEEE," Dataweek, vol.
xx no. xx, pp. xx-xx, Sept. 20, 2006.
"From the Makers of RoHS... New and Improved Chemicals Regulation Coming Soon
to a Government Near You," IPC Review, vol. 47 no. 11, pp. 22-23,
Dec. 2006.
"From the Online E2E Forum," Design News, vol. 61 no. 12, pp. 10,
Sept. 4, 2006.
"Fujitsu announces details of stage 4 of environmental protection program,"
PCB007, June 7, 2004.
"Fujitsu will finish shift to lead-free soldering in October 2000,"
PCB007, July 14, 2000.
"Fume Extraction For Healthy Lead-Free Rework," evertiq, Aug.
31, 2006.
"G2: Arts: Out&about: Art: WEEE man's warning," The Guardian
, Apr. 28, 2005.
"Gain a Competitive Advantage Through Design for Environmental Compliance."
Enovia.
"Galvanic Attack in Immersion Silver Processing: Causes and Remedies,"
MacDermid Technical Report No. 211, Feb. 28, 2005.
"Galvano- und Oberflaechentechnik fur Elektronikanwendungen,"
Galvanotechnik, vol. xx no. xx, pp. 629-635, Mar. 2006.
"GE Power Management Service Bulletin," GE, Mar. 27, 2000.
"GEIA-HB-0005-4 Guidelines for Performing Reliability Assessment for Pb Free
Assemblies used in Aerospace and High-Performance Electronic Applications,"
Sept. 23, 2010.
"GEIA-STD-0005-2 Standard for Mitigating the Effects of Tin Whiskers in
Aerospace and High Performance Electronic Systems," Rev A draft 1/5/11.
"GEIA prepares to release three new standards dealing with lead-free
electronics," Dataweek, vol. xx no. xx, pp. xx-xx, Sept. 20,
2006.
"GEIA Prepares to Release Three New Standards Dealing with the Lead-Free,"
PCB007, Sept. 7, 2006.
"General Purpose Lead-Free Assembly System Implementation Guideline."
"Getting the lead out," Air Safety Week, vol. xx no. xx, pp.
xx-xx, July 26, 2004.
"Getting the Lead Out," Appliance Design, vol. xx no. x, pp.
xx-xx, Feb. 2006.
"Getting The Lead Out," Electronic Design, vol. 52 no. 10, pp.
10, May 10, 2004.
"Getting the Lead Out - European Regulations Force Electronics Companies to
Clean up, Impact Local Manufacturers and Distributors," PRWeb
, May 24, 2005.
"Glitch silences millions of pagers," Star-Bulletin, May 20, 1998.
"Global Institute of Logistics Publishes White Paper on the Waste Electrical
and Electronic (WEEE) Directive," PRWeb, Mar. 6, 2006.
"Global Institute of Logistics Publishes White Paper on the Waste Electrical
and Electronic (WEEE) Directive," PCB007, Mar. 7, 2006.
"Global Transition to Pb-free/Green Electronics," CALCE, 2004.
"Go Green: Allied Electronics Launches RoHS Knowledge Center," Allied
Electronics, Aug. 12, 2005.
"Good looking lead-free solder joints (and better sound quality?),"
PCB007, Dec. 16, 2003.
"Got any old fashioned - leaded - spare parts?," SourceESB, Mar. 9, 2006.
"Government to shed light on waste directive," Electronics Weekly
, Nov. 19, 2003.
"Green Electronics Desired," Appliance Design, vol. 57 no. 2, pp.
9, Feb. 2009.
"Green gadgets: the Greenpeace search continues," evertiq,
Jan. 28, 2009.
"Green initiatives can payoff," Components in Electronics,
vol. xx no. xx, pp. xx-xx, July 2004.
"Green laws hitting from all corners," SourceESB, Oct. 5, 2005.
"Green Materials Market Will Reach $8.7 Billion By 2010," PCB007
, Nov. 23, 2005.
"Green/Pb Free Technology Solution," Amkor.
"Green Product: 2nd level reliability of tin plated components," Infineon.
"Green Product: Affected materials," Infineon.
"Green Product: Solderability of tin plated components (V1.3)." Infineon.
"Green Semiconductor Packaging: Addressing the Environmental Concerns of the
21st Century," IDT, Nov. 2004.
"Greenpeace exposes illegal dumping of e-waste in Nigeria," evertiq
, Feb. 19, 2009.
"Greenpeace ranks Apple last in greenness," emsnow, Apr. 4,
2007.
"Greenpeace: Toxic E-Waste in China and India Dumps," Design News
, vol. 60 no. 14, pp. xx, Oct. 10, 2005.
"Greenpeace's campaign against brominated flame retardants continues to ignore
fire safety," evertiq, Apr. 16, 2008.
"Growing Adoption of Lead-Free Electronic Assemblies Challenged by Materials
and Process Considerations," Appliance Design, vol. xx no.
xx, pp. xx-xx, Aug. 24, 2004.
"Growth in PC Recycling, Refurbishing to Meet Expanding Regulations, IDC
Says," Electronic News, Nov. 1, 2005.
"Guidance Document on the Appliance of Substances under Special Attention in
Electric & Electronic - Products, Version 2.2," Nov. 25, 2002.
"Guidance for the Lead-Free Marking of Materials, Components and Mounted
boards used in Electronic and Electric Equipment," JEITA, Sept. 5, 2004.
"Guide for U.S. High-Tech Companies Describes Far-Reaching Strategic Impact of
European Environmental Laws." Surface Mount Technology Online, Apr. 29,
2003.
"Guidelines for Suppliers Transitioning to RoHS Compliant Components (Rev.
1.1),"
"Guidelines for the Management of Chemical Substances in Products, Version
1.1," Japan Green Procurement Survey Standardization Initiative (JGPSSI),
Oct. 27, 2006.
"Hakko and Pb-Free Soldering Tips,", American Hakko Products.
"Half of electronic product companies plan to convert component for RoHS
compliance," emsnow, Jan. 10, 2007.
"HALF won't make the Pb-free deadline," Electronics Manufacture and
Test, vol. xx no. xx, pp. xx-xx, Jan. 2006.
"Halogen-free is not for free!," emsnow, Sept. 15, 2006.
"Halogenated fire retardants," Electronics Manufacture and Test
, vol. xx no. xx, pp. xx-xx, Apr. 7, 2004.
"Halogenated flame retardants continue to dominate Chinese market,"
evertiq, Oct. 24, 2007.
"Halogens and Halides - Jan 08," Alpha.
"Halt WEEE Implementation Say U.K.'s Main Domestic Appliance Producers,"
Appliance Design, vol. xx no. x, pp. xx-xx, June 2006.
"Hand-held tool tests for lead in electronics," Military &
Aerospace Electronics, vol. 16 no. 1 pp. xx-xx, Jan. 2005.
"Hand-held XRF analyzer suggestion," Circuitnet, July 31,
2006.
"Hand soldering for Lead-Free," Circuitnet, Sept. 18, 2006.
"Hand soldering process for lead-free," Circuitnet, Sept. 25,
2006.
"Happy 10th Anniversary SN100C," Electronics Production World
, Jan. 22, 2009.
"Happy 10th Anniversary SN100C," Global SMT and Packaging,
vol. 9 no. 2, Feb. 2009, pp. 28-30.
"Happy 10th aniversary SN100C!," Tin World, no. 27, pp. 12-15,
Summer 2009.
"Harsh life for Pb-free," Electronics Manufacture and Test,
vol. xx no. xx, pp. xx, Apr. 2004.
"HASL PCB's compared to OSP?," Circuitnet, Feb. 12, 2007.
"HASL Replacement - Immersion White Tin," Omni Graphics.
"Havoc in the supply chain," Purchasing, vol. xx no. xx, pp.
xx-xx, Dec. 9, 2004.
"Hazardous Materials Concerns and Tyco Electronic Products," Tyco
Electronics, Sept. 2004.
"HCL Launches RoHS Compliance Management System For Medical Device Users,"
PCB007, May 18, 2006.
"Help is at hand for producers who will soon be responsible for their waste
electrical goods," Mar. 1, 2002.
"Help Oppose REACH-Type Legislation in Senate This Week," CircuiTree
, vol. 21 no. 4, pp. xx-xx, Apr. 2008.
"Helping Companies "Go Green"," Supply & Demand Chain Executive
, vol. xx no. x, pp. xx-xx, xxxx.
"Helping OEMs meet environmental responsibilities," Electronics
Manufacture and Test, vol. xx no. xx, pp. xx-xx, July 14, 2008.
"HEPCO's LeadHoundC Chases RoHS/WEEE and Leaded Compliance," PCB007
, Feb. 15, 2006.
"Here WEEE go," Materials World, vol. 13 no. 5, pp. 4, May 2005.
"hex-chrome alternatives directory," Metal Finishing, vol. 106
no. 4, pp. 69, Apr. 2008.
"High Density Anisotropic Conductive Film," btechcorp.
"High frequency vibration tests of Sn-Pb and lead-free solder joints,"
Tin World, no. 19, pp. 14, Autumn 2007.
"High Performance Low Cost Interconnections for Flip Chip Attachment with
Electrically Conductive Adhesive," DOE/AL/98817--T1, DARPA TRP No.
DE-FC-04094AL98817.
"High-Speed, Non-Whiskering Tin for Semiconductor Packages," Products
Finishing, vol. 47 no. 12, pp. 80, Sept. 1983.
"High Tech Industry's Use of Chemical in Products."
"High Temperature Lead-Free Solders: Tools for the Microelectronics Industry,"
"High Temperature Report," Anadigics Application Note, Apr. 2003.
"Hitachi's Pb-Free Solder Retains Bond Strength at 200C," PCB007
, Mar. 2008, .
"Hot Air Leveling in the Lead-Free Environment," CircuiTree,
vol. 19 no. 2, pp. xx-xx, Feb. 2006.
"Hot-Dip Tin Process Said to Prevent Whisker Formation," Products
Finishing, vol. 73 no. 7, pp. 11, Apr. 2009.
"Hour One: High-tech Breakdown," Science Friday, vol. xx no.
xx, pp. xx-xx, May 22, 1998.
"How Advantages of Vapour Phase for Lead-Free Reflow Can Impact Production,"
SMART Group 8th Annual Lead-Free Seminar + 'Question Time' &
Table-Top Exhibition, High Wycombe, United Kingdom, Feb. 16, 2006.
"how far, how fast?," Coretec, 2004.
"How lead-free trends impact distribution," Purchasing, vol. 134 no. 7,
pp. 30, Apr. 21, 2005.
"How many zones are adequate for lead free profile," Circuitnet
, May 12, 2008.
"How Much Lead to Get Out?," EDN, vol. 47 no. 9, pp. 58, Apr.
18, 2002.
"How to comply with the RoHS Directive," ERA Technology.
"How-to Guide: Reduce RoHS Compliance Risk Using Portable XRF Analyzers,"
Assembly, vol. xx no. xx, pp. xx-xx, Mar. 17, 2006.
"HP boasts of electronics recycling," Electronics Weekly,
July 16, 2007.
"HP says RoHS making whiskers problem worse," evertiq, Feb.
22, 2005.
"HP's Position Statement on Tin-based Plating for Lead-free Components,"
Apr. 7, 2003.
"HUG debates EPA study, solder finishes," Printed Circuit Fabrication
, vol. 24 no. 1, pp. 18,20, Jan. 2001.
"Hughes Satellite Failures Continue To Plague New Owner,"
Electronics Weekly, Apr. 24, 2001.
"Hughes Seeks To Salvage Satellites," Television Digest with Consumer
Electronics, vol. xx no. xx, pp. xx-xx, Sept. 11, 2000.
"IBM Taps Solution to Ensure RoHS Compliance," Supply & Demand Chain
Executive," June 13, 2005.
"IDB to help LCD TV, electric-vehicle makers set up model "green" plants,"
CENS.com, June 30, 2005.
"Identification is Requested by Law on Plastics Containers and Packaging, and
on Paper Containers and Packaging," Ministry of Economy, Trade and
Industry.
"Identification of Non-Line-of-Sight Hard Chromium Alternatives (Task N.229)."
"Identifying Industry Sectors in the Northeast That Emit or Transfer Lead or
Lead Compounds (Draft)," Northeast Waste Management Officials' Association
(NEWMOA), Dec. 2001.
"IDT: 99 percent lead free already," SourceESB, Dec. 1, 2004.
"IEC, IPC Highlight Inadequacies Of Traditional Test Methods For Ensuring
Reliability Of Lead-Free Electronic Assemblies," PCB007, July
20, 2006.
"IEC, IPC highlight inadequacies of traditional test methods for ensuring
reliability of lead-free electronic assemblies," emsnow, July
20, 2006.
"IEC, IPC highlights inadequacies of traditional test methods for ensuring
reliability of lead-free electronic assemblies," Dataweek,
vol. xx no. xx, pp. xx-xx, Aug. 23, 2006.
"IEC/PAS 61906: Procedure for the declaration of materials in products of the
electrotechnical and electronic industry," Dec. 17, 2004.
"IECQ Launches Lead-Free Certification Program for Electronics,"
Compliance Engineering, vol. 22 no. 2, pp. 18, 20, 2005 EMC Update.
"IKP Department of Life-Cycle Engineering," University of Stuttgart.
"Immersion Tin Finish," Electronics Manufacture and Test,
Oct. 27, 2008.
"Impact of EU's Energy Use Directive Could Be Significant," June 2, 2006.
"Impact of EU's Energy Use Directive Could Be Significant,"
Conformity, vol. 11 no. 8, pp. 9, Aug. 2006.
"Impact of Lead Free Implementation - Solder Selection," SMART Group 8th
Annual Lead-Free Seminar + 'Question Time' & Table-Top Exhibition,
High Wycombe, United Kingdom, Feb. 16, 2006.
"Impact of the RoHS Directive on Electronic Products Sold in the United
States," INFORM, Sept. 2003.
"Impact of Unknown Component Alloy Finish During the Lead-free Transition
Period," National Physical Laboratory, Nov. 2003.
"Implementing Cleaner Printed Wiring Board Technologies: Surface Finishes,"
, United States Environmental Protection Agency, Mar. 2000.
"Imposing Standards for RoHS Compliance," EuroAsia Semiconductor
, vol. xx no. xx, pp. xx-xx, Nov. 2005.
"Inadvertent Reactor Trip and Partial Safety Injection Due to Tin Whisker,"
United States Nuclear Regulatory Commission, NRC Information Notice
2005-25, Aug. 25, 2005.
"Increases in Silver Prices Affect Material Costs," Advanced
Packaging, vol. 15 no. 7, pp. 10, July 2006.
"Industry and Governments Study RoHS Harmonization," IPC Review,
vol. 48 no. 7, pp. 12-14, Aug. 2007.
"Industry braces for the lead-free conversion," SourceESB, Nov. 3, 2004.
"Industry calls for non-compliant parts," SourceESB, Oct. 19, 2005.
"Industry Groups Continue Focus on Tin Whiskers," CPMT Society Outlook
, vol. 1, pp. 3-4, 2005.
"Industry not prepared for REACH," Electronics Manufacture and Test
, vol. xx no. xx, pp. xx-xx, Aug. 4, 2008.
"Industry Sees First Prosecution for RoHS Noncompliance," IPC Review
, vol. 48 no. 10, pp. 6, Dec. 2007.
"Industry Voices Call for U.S. RoHS," SMT Web Exclusive Article.
"Industry Vows to Eliminate Mercury in Button Cell Batteries,"
Conformity, vol. 11 no. 6, pp. 56, June 2006.
"iNEMI HFR-Free Leadership Program launches with 22 companies participating,"
Circuitree, vol. 22 no. 9, pp. 9-10, Sept. 2009.
"iNEMI Hi-Rel Group Tackles Lead-free Manufacturing Challenges," SMT Web
Exclusive Article.
"iNEMI High-Reliability Group Makes Recommendations for Pb-Free Manufacturing
Requirements," PCB007, Mar. 7, 2006.
"iNEMI High-Reliability Group makes recommendations for Pb-Free manufacturing
requirements," emsnow, Mar. 8, 2006.
"iNEMI High-Reliability Group makes recommendations for Pb-free manufacturing
requirements," Tin World, no. 13, pp. 17, Spring 2006.
"iNEMI High-Reliability Group Publishes Guidelines for Subassemblies in
High-Reliability Applications," PCB007, June 23, 2006.
"iNEMI High-Reliability Group publishes guidelines for subassemblies in
high-reliability applications," emsnow, July 5, 2006.
"iNEMI High-Reliability Group publishes guidelines for subassemblies in
high-reliability applications," July 17, 2006.
"iNEMI High-Reliability Task Force Position Statement on RoHS5 & RoHS6
Subassembly Modules," iNEMI.
"iNEMI, IPC and RosettaNet Collaborate on Development of Specifications for
Materials Declarations," PCB007, Apr. 21, 2005.
"iNEMI / IPC Meeting at Productronica Focuses on Implementation of Materials
Composition Data Exchange Standards," PCB007, Nov. 1, 2005.
"iNEMI launches new collaborative efforts," evertiq, Apr. 2,
2008.
"iNEMI Makes Recommendations for Managing Pb-Free Alloy Alternatives,"
CircuiTree, vol. 21 no. 7, pp. xx-xx, July 2008.
"iNEMI Makes Recommendations for Pb-Free Manufacturing Requirements,"
CircuiTree, vol. 19 no. 3, pp. xx-xx, Mar. 2006.
"iNEMI Makes Recommendations for Pb-Free Manufacturing Requirements,"
CircuiTree, vol. 19 no. 5, pp. xx-xx, May 2006.
"iNEMI Members Call for Unique Part Numbers for Ball Metallurgies on Lead-Free
Components," Printed Circuit Design and Manufacture, vol. 24 no.
6, pp. 10, June 2007.
"iNEMI members call for unique part numbers to differentiate ball metallurgies
on Pb-Free BGA components," emsnow, May 9, 2007.
"iNEMI Members Laud Material Declarations Standard," SMT Web Exclusive
Article.
"iNEMI Members Want Unique Part Numbers for RoHS-Compliant Components,"
CircuiTree, Apr. 27, 2005.
"iNEMI members want unique part numbers for RoHS-compliant components,"
emsnow, Apr. 28, 2005.
"iNEMI Members Want Unique Part Numbers for RoHS-Compliant Components,"
PCB007, Apr. 27, 2005.
"iNEMI Mobilizes for Tin/lead BGAs," SMT Web Exclusive Article.
"iNEMI Organizes Task Group to Address Availability of SnPb BGAs,"
Circuitree, vol. 19 no. 11, pp. xx-xx, Nov. 2006.
"iNEMI Organizes Task Group to Address Availability of SnPb BGAs,"
PCB007, Nov. 8, 2006.
"iNEMA organises task group to address availability of SnPg BGAs,"
Tin World, no. 16, pp. 14, 2006.
"iNEMI publishes book about Lead-Free," evertiq, Nov. 4,
2007.
"iNEMI Recommendations on Lead-Free Finishes for Components Used in
High-Reliability Products Version 4 (12-1-06)," iNEMI, Dec. 1, 2006.
"iNEMI recommends approaches for managing Pb-Free alloy alternatives,"
evertiq, July 10, 2008.
"iNEMA recommends approaches for managing Pb-free alloy alternatives,"
Tin World, no. 23, pp. 7, Summer 2008.
"iNEMI recommends approaches for managing Pb-free alloy alternatives,"
emsnow, July 16, 2008.
"iNEMI releases standards for RoHS transition," SourceESB, Sept. 21, 2005.
"iNEMI Task Force Addresses Lead-free Issues," Advanced Packaging
, vol. xx no. xx, pp. xx-xx, Aug. 25, 2005.
"iNEMI Task Force Addresses RoHS Transition Issues," iNEMI, Aug. 25, 2005.
"iNEMI Task Force Addresses RoHS Transition Issues," PCB007,
Aug. 25, 2005.
"iNemi task force addresses RoHS transitions issues," emsnow,
Sept. 8, 2005.
"iNEMI Tin Whisker Accelerated Test Project Test Method for Evaluating Tin
Whisker Growth on Plated Surfaces." International Electronics
Manufacturing Initiative, June 17, 2004.
"iNEMI tin whisker group publishes updated recommendations," Tin
World, no. 17, pp. 11, Spring 2007.
"iNEMI Tin Whisker user group publishes updated recommendations to help reduce
risk of tin whiskers," emsnow, Dec. 20, 2006.
"iNEMI Tin Whisker Workshop," Tin World, no. 18, pp. 14,
Early Summer 2007.
"iNEMI Updates Tin Whiskers Findings," SMT Web Exclusive Article.
"iNEMI want unique part numbers for RoHS-compliant components,"
evertiq, Apr. 29, 2005.
"iNEMI Whitepaper Tracks Members' Progress," Surface Mount Technology
(SMT), vol. 26 no. 2, pp. 16, Feb. 2011.
"iNEMI's recommendations for Pb-Free Manufacturing Requirements,"
evertiq, 2006. Mar. 8,
"Information Gathering Exercise to provide information for the review of
Directive 2002/96/EC of the European Parliament and of the Council on Waste
Electrical and Electronic Equipment (WEEE)," (Consultation period ended
Aug. 11, 2006.)
"Information on China's Planned RoHS Regulations," Conformity
, vol. 11 no. 6, pp. 56, June 2006.
"Information Resource on the EU's RoHS, WEEE Directives," Conformity
, vol. 11 no. 7, pp. 45, July 2006.
"Information shows how to meet EU RoHS regulations," Advanced Materials
& Processes, vol. 164 no. 2, pp. 24-25, Feb. 2006.
"Innov-X Responds to the European Union's RoHS Toxic Metals Directive for
Electronics," EExpress, vol. xx no. xx, pp. xx-xx, Jan. 5,
2005.
"Innovative Technology: X-Ray Fluorescence Field Analysis," Northeast
Waste Management Officials' Association (NEWMOA), Sept. 21, 1999.
"Input for Information Gathering Exercise for review of Directive 2002/96/EC."
AeA, EICTA, and Japan Business Council in Europe, Aug. 11, 2006.
"Inspection Guide Illustrates Defects," SMT Web Exclusive Article.
"Inspections, Compliance, Enforcement, and Criminal Investigations Tin Wiskers
Problems, Causes, and Solutions," Food and Drug Administration, Mar. 14,
1986.
"Intel eliminates lead from future microprocessors," emsnow,
May 25, 2007.
"Intel's 95 per cent lead reduction does not satisfy RoHS,"
Electronics Weekly, Apr. 14, 2004.
"Interconnection Substrates - Ceramic," 2004 IMAPS-CII / iNEMI Roadmaps.
"Interconnects pose several lead-free challenges," Green SupplyLine
, Apr. 11, 2005.
"Interim Recommendations on Lead-Free Finishes for Components Used in High-
Reliability Products,", NEMI, Mar. 2004.
"Intermetallics," Electronics Manufacture and Test, vol. xx
no. xx, pp. xx-xx, Mar. 7, 2004.
"International Tin Research Council Annual Report 1976," International Tin
Research Institute, 1976.
"International Tin Research Council Annual Report 1977," International Tin
Research Institute, 1977.
"International Tin Research Council Annual Report for 1980," International Tin
Research Institute, 1980.
"International Tin Research Council Annual Report for 1982," International Tin
Research Institute, 1982.
"International Tin Research Council Annual Report for 1983," International Tin
Research Institute, 1983.
"International Tin Research Council Annual Report for 1984," International Tin
Research Institute, 1984.
"Intertek Labtest signed a global services agreement with Matsushita Electric
Industrial Co., Ltd on hazardous substance testing," Intertek
Labtest Sparkle, vol. 174, May 2004.
"IPC-1066, Marking, Symbols and Labels for Identification of Lead-Free and
Other Reportable Materials in Lead-Free Assemblies, Components and Devices,"
Bannockburn, IL: IPC, Nov. 2004.
"IPC-1081, Conflict Minerals Due Diligence Best Practices Guideline, Final
Draft for Industry Review," Bannockburn, IL: IPC, July 2012.
"IPC-7351 Revs Forward," IPC Review, vol. 49 no. 3, pp. 10-12,
Mar./Apr. 2007.
"IPC and JEDEC 'leading the way to lead-free'," PCB007, Jan.
14, 2004.
"IPC announces RoHS lead-free certification program, solder results,"
Connector Specifier, pp. 1, 6, Feb. 2006.
"IPC cert for RoHS program now available," evertiq, May 5,
2006.
"IPC Certification for RoHS Lead Free Electronics Assembly Process Capability Program Now Available," PCB007
, May 4, 2006.
"IPC Concerned with Oko-Institut Proposed Chemical Bans," Printed
Circuit Design and Fab, vol. 25 no. 8, pp. 8, Aug. 2008.
"IPC continues to oppose RoHS amendments," Dataweek, pp.
xx-xx, June 23, 2010.
"IPC Council Reports Best Lead-Free Solder," CircuiTree, vol.
18 no. 8, pp. xx-xx, Aug. 2005.
"IPC Counters RoHS Expansion Discussion," Surface Mount Technology Online
Article, May 19, 2008.
"IPC Delivers Comments to the U.S. CPSC On Electronic Devices,"
PCB007, Nov. 13, 2008.
"IPC Determines Replacement for Lead Solder," Electronic News
, July 4, 2005.
"IPC fights RoHS expansion proposal," Dataweek, vol. xx no.
xx, pp. xx-xx, July 23, 2008.
"IPC Government Relations Committee Urges Industry to Pursue R&D Tax Credit
for Lead-Free Implementation Costs," CircuiTree, vol. 21 no.
3, pp. xx-xx, Mar. 2008.
"IPC Halogen-Free TG Releases TBBPA Report," CircuiTree, vol.
21 no. 4, pp. xx-xx, Apr. 2008.
"IPC Helps Industry Work Through Materials Declaration Implementation,"
IPC Review, vol. 46 no. 11, pp. 23, Dec. 2005.
"IPC Initiates Scientific Dialogue on Proposed RoHS Expansion,"
PCB007, May 20, 2008.
"IPC Intel Lead Free Symposium Examines the Issues," IPC Review,
vol. 47 no. 4, pp. 10, May 2006.
"IPC Introduces RoHS Lead Free Certification Program," PCB007
, Jan. 23, 2006.
"IPC Issues Call to Action on RoHS ," SMT Web Exclusive Article.
"IPC J-STD-075 Classifies Worst-Case Thermal Process Limitations for
Electronic Components," CircuiTree, vol. 21 no. 9, pp. xx-xx,
Sept. 2008.
"IPC/JEDEC J-STD-709 Definition of Maximum Limits on the Low-Halogens Bromine
& Chlorine Used in Materials for Certain Electronic Components and
Assemblies (Final Draft for Industry Review)," Bannockburn, IL: IPC, Sept.
2008.
"IPC launches lead-free website," Advanced Packaging, vol. xx
no. xx, pp. xx-xx, Aug. 18, 2004.
"IPC lead-free study shows dissatisfaction with component manufacturers,"
Tin World, no. 15, pp. 9, 2006.
"IPC National Technology Roadmap: Electronic Interconnections 2002/2003
Overview."
"IPC outcry over proposed RoHS expansion," Dataweek, vol. xx
no. xx, pp. xx-xx, June 11, 2008.
"IPC Prepares Industry for RoHS Compliance," SMT Web Exclusive Article.
"IPC publishes findings from round robin test program on lead-free solder,"
PCB007, Aug. 13, 2003.
"IPC publishes IPC-1752," emsnow, Mar. 13, 2006.
"IPC Publishes IPC-1752, Materials Declaration Management Standard,"
evertiq, Feb. 2, 2006.
"IPC Publishes IPC-1752, Materials Declaration Management Standard,"
CircuiTree, vol. 19 no. 3, pp. xx-xx, Mar. 2006.
"IPC Publishes Materials Declaration Standard," IPC Review, pp.
27, Feb./Mar. 2006.
"IPC Publishes Materials Declaration Standard," Route, Mar.
2006.
"IPC publishes revisions to IPC-A-610 and J-STD standards," Global
SMT & Packaging, vol. 5 no. 4, pp. 42, Apr. 2005.
"IPC released lead free solder paste guide," evertiq, July
18, 2005.
"IPC releases REACH Guidebook," Tin World, no. 25, pp. 15,
Winter 2008/2009.
"IPC Releases REACH Guidebook," SMT Web Exclusive Article.
"IPC Releases REACH Guidebook As Pre-Registration Deadline Approaches,"
PCB007, Nov. 11, 2008.
"IPC releases Revision B of IPC-7711/7721," Electronics Manufacture
and Test, vol. xx no. xx, pp. xx-xx, Feb. 4, 2008.
"IPC Releases Revision B of IPC-7711/7721 Lead Free Support and Inspection
Guidelines for Repairs and Modifications," IPC Review, vol. 1 no.
1, pp. 3, Mar./Apr. 2008.
"IPC Roadmap: A Guide for Assembly of Lead-Free Electronics," June 2000.
"IPC sets replacement for lead solder," electronicsweekly.com
, July 4, 2005.
"IPC sets replacement for lead solder," Electronics Weekly,
July 4, 2005.
"IPC simplify RoHS declaration process," Circuit World, vol. 32
no. 3, pp. xx-xx, 2006.
"IPC Solder Products Value Council Releases White Paper on Increased Costs of
Lead Free Solder Materials," Circuitree, vol. 19 no. 6, pp.
xx-xx, June 2006.
"IPC Solder Products Value Council Releases White Paper on Increased Costs of
Lead Free Solder Materials," PCB007, June 12, 2006.
"IPC SPVC announces research paper on solder joint voids for lead free
solder," Soldering & Surface Mount Technology, vol. 18 no. 2,
pp. xx-xx, 2006.
"IPC SPVC Announces Research Paper on Solder Joint Voids for Lead Free Solder,
" PCB007, Dec. 15, 2005.
"IPC-SPVC-WP-006 Round Robin Testing and Analysis: Lead-Free Alloys: Tin,
Silver and Copper," IPC, July 2003.
"IPC submit RoHS concerns," Electronics Manufacture and Test,
vol. xx no. xx, pp. xx-xx, Jan. 27, 2008.
"IPC submitted comments to the RoHS directive," evertiq, Jan.
22, 2008.
"IPC survey reveals electronics industry not prepared for reach,"
Circuit World, vol. 34 no. 3, pp. xx, 2008.
"IPC Urges California Members to Contact Department of Toxic Substances
Regarding the Green Chemistry Initiative," CircuiTree, vol.
21 no. 4, pp. xx-xx, Apr. 2008.
"IPC urges no RoHS changes," Connector Specifier, vol. 24 no.
2, pp. 1,4, Mar. 2008.
"IPC voices concerns over RoHS revision developments," evertiq
, Oct. 26, 2008.
"IPC Web Site Fights Halogen Fires," Printed Circuit Fabrication,
vol. 23 no. 7, pp. 18, July 2000.
"IPC Works on RoHS Material Declaration Standards," Conformity
, vol. 10 no. 11, pp. 48, 50, Nov. 2005.
"IPC Works on RoHS Material Declaration Standards," Conformity, pp.
213-214, Conformity 2006: The Annual Guide.
"IPC's Ball Grid Array Guideline Goes Lead Free," IPC Review,
vol. 47 no. 5, pp. 12-13, June 2006.
"IPC's SPVC Answers the Million Dollar Question: What's Industry's Best Lead
Free Solder?," PCB007, June 30, 2005.
"Is it possible to run Pb-Free reflow without nitrogen?," Circuitnet
, May 24, 2006.
"Is lead contamination during cleaning of PB-free stencils possible?,"
Circuitnet, Aug. 21, 2006.
"Is PCB Baking Necessary?," Circuitnet, Mar. 16, 2009.
"Is solder supply to the EU at risk?," Electronics Manufacture and
Test, vol. xx no. xx, pp. xx-xx, Sept. 22, 2008.
"Is the electronics industry prepared for the RoHS directive?,"
Electronic Products, vol. 48 no. 9, pp. 35, 37-38, 40, 42-43, Feb.
2006.
"Is WEEE regulation a waste of time?," evertiq, Dec. 22,
2006.
"Isola Launches IS415," CircuiTree, vol. 17 no. xx, pp. 58, Sept.
2004.
"Isola Technology Overview," Isola, Mar. 2005.
"'Issues To Solutions' Initiative in Lead-Free Soldering," evertiq
, Oct. 11, 2005.
"It is Easier Being Greener," Metal Finishing, vol. 106 no. 4,
pp. 62-65, Apr. 2008.
"ITG Subject: Tin Whiskers - Problems, Causes, and Solutions," Department
of Health, Education, and Welfare Public Health Service Food and Drug
Administration *ORA/ORO/DEIO/IB*, Mar. 14, 1986.
"ITRI Annual Report for 1990," International Tin Research Institute, 1990.
"ITRI raises concerns over effect of new EU regulations on solder supply to
Europe," Tin World, no. 24, pp. 15, Autumn 2008.
"It's Time To Get The Lead Out Of Our Designs," Electronic
Design, vol. 48 no. 25, pp. 56, Dec. 4, 2000.
"J-STD-020B, IPC/JEDEC J-STD-020B, Moisture/Reflow Sensitivity Classification
for Nonhermetic Solid State Surface Mount Devices," Arlington, VA: JEDEC
Solid State Technology Association, July 2002.
"J-STD-020C, IPC/JEDEC J-STD-020C Moisture/Reflow Sensitivity Classification
for Nonhermetic Solid State Surface Mount Devices," Arlington, VA: JEDEC
Solid State Technology Association, July 2004.
"J-STD-033A, IPC/JEDEC J-STD-033A, Joint Industry Standard Handling, Packing,
Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices,"
Arlington, VA: JEDEC Solid State Technology Association, July 2002.
"J-STD-033B, IPC/JEDEC J-STD-033B Joint Industry Standard Handling, Packing,
Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices,"
arlington, va: jedec solid state technology association, Oct. 2005.
"J-STD-075, EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic
Components for Assembly Processes," Arlington, VA: JEDEC Solid State
Technology Association, Apr. 2008.
"JAPAN progresses down the lead-free path," Electronics Manufacture
and Test, vol. xx no. xx, pp. xx, Apr. 2001.
"Japanese OEMs' Lead-free Initiative," Electronic Business,
Feb. 1, 2000.
"JCAA/JG-PP Lead-Free Solder Project Joint Test Report Executive Summary
(Draft)," NASA Acquisition Pollution Prevention (AP2) Office, Kennedy
Space Center, FL, July 14, 2006.
"JCAA/JG-PP lead-free solder project reports,"
emsnow, June 15, 2006.
"JCAA/JG-PP Lead-Free Solder Study Results," PCB007, June 19,
2006.
"JEDEC and IPC Release Tin Whisker Acceptance Testing," Tin World
, no. 14, pp. 11, 2006.
"JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation
Practices Guideline," CircuiTree, vol. 19 no. 5, pp. xx-xx,
May 2006.
"JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation
Practices Guideline," PCB007, May 4, 2006.
"JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation
Practices Guideline," FPGA and Structured ASIC Journal, vol.
xx no. x, pp. xx-xx, May 4, 2006.
"JEDEC and IPC release Tin Whisker Acceptance Testing Standard and Mitigation
Practices Guideline," emsnow, May 5, 2006.
"JEDEC, iNEMI Update Tin Whisker and Lead-Free Surface Finish Guidelines,"
CircuiTree, vol. 18 no. 7, pp. xx-xx, July 2005.
"JEDEC, IPC Release Tin Whisker Acceptance Testing Standard,"
Circuitree, vol. 19 no. 6, pp. xx-xx, June 2006.
"JEDEC, IPC Release Tin Whisker Standards," Printed Circuit Design
and Manufacture, vol. 23 no. 6, pp. 8, June 2006.
"JEDEC Releases Standard for Tin Whisker Testing and iNEMI User Group Updates
Lead-Free Surface Finish Guidelines," PCB007, May 24, 2005.
"JEITA ETR-7021. Guidance for the Lead-Free Marking of Materials, Components
and Mounted Boards used in Electronic and Electric Equipment, Japan
Electronics and Information Technologies Industries Association, June 2004,
"JEITA Whisker Test Method Project," IPC and SOLDERTEC Global
Conference, Brussels, June 2003.
"JEP113-B, Symbol and Labels for Moisture-Sensitive Devices," Arlington,
VA: JEDEC Solid State Technology Association, May 1999.
"JESD201, Environmental Acceptance Requirements for Tin Whisker
Susceptibility of Tin and Tin Alloy Surface Finishes," Arlington, VA:
JEDEC Solid State Technology Association, Mar. 2006.
"JESD22-B102D, Solderability," Arlington, VA: JEDEC Solid State Technology
Association, Sept. 2004.
"JESD22-B106C, Resistance to Soldering Temperature for Through-Hole Mounted
Devices," Arlington, VA: JEDEC Solid State Technology Association, Feb.
2005.
"JESD22A121, Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes,"
JEDEC Solid State Technology Association, May 2005.
"JESD22A121.01, Test Method for Measuring Whisker Growth on Tin and Tin Alloy
Surface Finishes," JEDEC Solid State Technology Association, Oct. 2005.
"JESD97, Marking, Symbols, and Labels for Identification of Lead (Pb) Free
Assemblies, Components, and Devices," Arlington, VA: JEDEC Solid State
Technology Association, 2004.
"JETRO Releases the Results of its Survey of Japanese Manufacturers in Europe
and Turkey," PCB007, May 26, 2006.
"JGPSSI Guidelines for the Management of Chemical Substances in Products Ver.
1.1 (List of Revisions to Main Text)," Japan Green Procurement Survey
Standardization Initiative (JGPSSI), Nov. 7, 2006.
"JIG-101, Joint Industry Guide (JIG), Material Composition Declaration for
Electronic Products," Arlington, VA: JEDEC Solid State Technology
Association, Apr. 2005.
"JIG Detailed Chemicals List (with JGPSSI Substsnce No.)," Japan Green
Procurement Survey Standardization Initiative (JGPSSI), Apr. 26, 2006.
"JIS C 0950:2005, The marking for presence of the specific chemical substances
for electrical and electronic equipment," JEITA, 2005. (Also called
J-MOSS, or Japan RoHS)
"Joint DoD/ NASA/ Industry Lead Free Solder Project," Joint Council on
Aging Aircraft/Joint Group on Pollution Prevention. (only printed out through
section 3.3.3)
"Joint Industry Guide: Material Composition Declaration Guide (Draft),"
Sept. 19, 2003.
"Joint Lead-Free Solder Test Program for High Reliability Military and Space
Applications."
"Joint Position Paper: Implementation of the EU Battery Directive: Ensuring
the Workability of the Batterie Removability Requirement," ACEA, AeA,
ceced, EICTA, FHS, Japan Business Council in Europe, Dec. 7, 2006.
"JP002, Current Tin Whiskers Theory and Mitigation Practices Guideline,"
Arlington, VA: JEDEC Solid State Technology Association and Bannockburn, IL:
IPC, Mar. 2006.
"Korea and China Formalizing RoHS Requirements," IPC Review, vol.
48 no. 5, pp. 5, June 2007.
"Korea gets behind RoHS," Electronics Manufacture and Test,
vol. xx no. xx, pp. xx-xx, Jan. 7, 2008.
"Korea Moves Ahead with Plans for RoHS Regulations," Conformity
, vol. 11 no. 8, pp. 88, Aug. 2006.
"Korea Moves Ahead with RoHS Requirements," Conformity, 2007
Engineers' Reference Guide, pp. 221-222, 2007.
"Korea Moves to Adopt RoHS-like Requirements," Conformity,
vol. 11 no. 7, pp. 45, July 2006.
"Korrosionsschutz ohne Chrom(VI) Nur noch 739 Tage Chromatierung - und dann?,"
Galvanotechnik, vol. xx no. xx, pp. 2674-2682, Nov. 2005.
"Lack of component data threatens RoHS plans," Electronics Weekly
, Feb. 11, 2004.
"Landfill Alloys Help Manufacturers Get the Lead Out of Electronics,"
Science News, June 10, 2005.
"Latest lead-free research highlights new stencil design rules,"
evertiq, Nov. 18, 2005.
"Latest moves to get industry lead-free," Electronics Times,
vol. xx no. xx, pp, xx-xx, Mar. 27, 2000.
"Latest OEM Push to "Green" Needs More Science," Printed Circuit Design
and Fab, vol. 25 no. 7, pp. 10, July 2008.
"Latest Plating Technology for the PCB industry," Transactions of the
Institute of Metal Finishing, vol. 86 no. 6, pp. 293, Nov. 2008.
"Latest Solder Mask Spec Addresses Lead-Free," Printed Circuit Design
and Manufacture, vol. 24 no. 3, pp. 10, Mar. 2007.
"Launch of Report: XRF Measurement of Residual Materials in Electronics,"
Circuitnet, Nov. 28, 2007.
"Lead Elimination from Printed Wiring Assemblies (Get the Lead Out!),"
Boeing Environmental Technotes, vol. 7 no. 1, pp. 1-4, Feb.
2002.
"Lead Free Electronics Impact on DoD Programs," DMSMS Conference
2007, Orlando, FL, Oct. 29, 2007, pp. xx-xx.
"Lead-free: a weighty debate," Electroline, 2003.
"Lead-Free Activities," KOA, Oct. 2002.
"Lead-Free Alloy Information," AIM.
"Lead-Free Alloy Trends for the Assembly of Mixed Technology PWB's,"
Proceedings of the Technical Program NEPCON West 2000, Volume 2,
Anaheim, CA, Feb. 29-Mar. 2, 2000, pp. 1091-1093.
"Lead-free Alloys Effect Back-end Manufacturing Technologies,"
Advanced Packaging, vol. xx no. xx, pp. xx-xx, Sept. 21, 2005.
"Lead-free Alloys Impact Back-end Semi Manufacturing Dynamics,"
ElectronicNews, May 11, 2005.
"Lead-free Alloys Impact Dynamics of Back-end Semiconductor Manufacturing
Technologies," PCB007, May 10, 2005.
"Lead Free Alloys Impact Dynamics of Back-end Semiconductor Manufacturing
Technologies," PCB007, Sept. 21, 2006.
"Lead-Free Alloys Impact Manufacturing," Electronic News,
Sept. 21, 2005.
"Lead-free alloys impact manufacturing," Electronics Weekly,
Sept. 22, 2005.
"Lead-Free Alloys - The Way Forward," Lead free Soldering Technology
Center.
"Lead-Free and RoHS Are in Full Swing ... are you ready?," Lead-Free
Connection, vol. 2 no. 2, pp. 1, June 2005.
"Lead-free and RoHS developments in China," evertiq, Dec. 3,
2004.
"Lead-Free Assemby -- Close Relationships with Suppliers Goes a Long Way,"
Lead-Free Connection, vol. 1 no. 2, pp. 1, Nov. 2004.
"Lead-free bar solder for wave soldering," Circuitnet, Mar.
4, 2007.
"Lead Free BGA Reflow," Circuitnet, June 25, 2007.
"Lead free BGA's and HASL," Circuitnet, Sept. 5, 2006.
"Lead-free brought to book," Electronics Manufacture and Test
, vol. xx no. xx, pp. xx-xx, Nov. 5, 2007.
"Lead-Free/Cadmium-Free Metals & Alloys," Indium Corporation of America.
"Lead-free causes headaches for military manufacturers," Components
in Electronics, vol. xx no. xx, pp. xx-xx, May 2006.
"Lead-free commercially close, but likelihood only 18%," Solid State
Technology, vol. 45 no. 8, pp. 22, 24, Aug. 2002.
"Lead-free connector rework," Circuitnet, Apr. 2, 2007.
"Lead-Free Conversion Program," STMicroelectronics, June 2, 2004.
"Lead-free conversion update," Purchasing, vol. xx no. xx, pp.
xx-xx, Jan. 13, 2005.
"Lead-free debacle threatens the industry - for nothing, says expert Miller,"
PCB007, Nov. 10, 2004.
Lead-Free Defect Guide 2, SMART Group, 2010.
"Lead Free Dross Removal," Circuitnet, Sept. 15, 2008.
"Lead-Free ECTC Panel," Components, Packaging, and Manufacturing
Technology Society Newsletter, vol. 28 no. 2, pp. 14, June 2005.
"Lead-Free Electronic Industry," Toxics Use Reduction Institute.
"Lead-free electronic solder: report asks "Why?"," PCB007,
Apr. 18, 2002.
"Lead Free Electronics Assembly: How Will This Unfold?," Prismark Partners
LLC, May 2002.
"Lead-free Electronics in Aerospace Systems," Boeing, Nov. 16, 2006.
Lead Free Electronics Manhattan Project Phase 2. ACI
Technologies, Feb. 10, 2010.
"Lead Free Electronics pose reliability problems," NAVAIR News Release
E200709171, Sept. 17, 2007.
"Lead-free electronics - virtual panel discussion," Elektron,
vol. xx no. xx, pp. 10-12, Oct. 2005.
"Lead-free exemptions--FYI." Connector Specifier, vol. 21
no. 2, pp. xx-xx, Feb. 2005.
"Lead Free Flux," Circuitnet, Sept. 2, 2008.
"Lead-free: Friction and Wear," Tyco Electronics.
"Lead-free: get the FAQs," Electronics Manufacture and Test,
vol. xx no. xx, pp. xx, Mar. 2004.
"Lead Free: How Will IPC Standards Change?," Route, Sept.
2005.
"Lead-Free Implementation Checklist," Speedline Technologies, 2005.
"Lead-free initiatives expand horizons for selective soldering technology,"
Tin World, no. 30, pp. 15-16, Spring 2010.
"Lead-Free Just Keeps Going and Going and ...," Design News, vol.
60 no. 9, pp. xx, June 27, 2005.
"Lead Free Materials, Merix.
""Lead-Free or Not to Be", That is the Question," PCB007,
Mar. 14, 2005.
"Lead-Free Packages," Mindspeed SMT Application Note.
"Lead-free packaging for semiconductor devices," E3 presentation, June
2003.
"Lead-free packaging for semiconductor devices," E4 presentation, Oct. 29,
2004.
"Lead-free parts need extensive testing," SourceESB, Nov. 2, 2005.
"Lead-free parts: Welcome to the messy supply chain," SourceESB, Jan. 12,
2005.
"Lead-free PCBs gradually gain dominance in Asia," Global Sources
, July 10, 2006.
"Lead-free: Polymers at high temp," Tyco Electronics.
"Lead-Free Process Support Guide," Balver Zinn.
"Lead Free Product Testing," Trace Laboratories-East.
"Lead Free Product Testing/Tin Whisker Testing," Trace Laboratories-East.
"Lead-Free Program Overview," Intel.
"Lead-Free Project Builds Momentum," Circuits Assembly, vol. 11
no. 11, pp. 12, Nov 2000.
"Lead Free (Pure Tin) Solder Coastings," State of the Art, Aug. 26, 2003.
"Lead-Free "Ready" Checklist," Arrow Electronics.
"Lead-free reflow puts new demands on rework equipment," Dataweek
, vol. xx no. xx, pp. xx-xx, May 5, 2004.
"Lead-Free Reflow Soldering," Circuitnet, Jan. 15, 2007.
"Lead-Free Risk Mitigation - A Case Study," aci.
"Lead-Free RoHS Assembly Training," Kester, 2006.
"Lead-free Semiconductors: Technologies and Roadmaps," STMicroelectronics,
Mar. 2003.
"Lead-free solder alloy data provided in European database," Advanced
Materials & Processes, vol. 164 no. 9, pp. 19-20, Sept. 2006.
"Lead-Free Solder Alloys," American Hakko Products.
"Lead-Free Solder Assembly for Mixed Technology Circuit Boards."
"Lead-Free solder failure mechanisms," TWI LiveWire, issue
11, Nov./Dec. 2003.
"Lead-Free solder failure mechanisms: What are Tin Whiskers?,"
LiveWire, no. 11, pp. xx-xx, .Nov./Dec. 2003.
"Lead-Free Solder Frequently Asked Questions:," Indium Corporation of
America.
"Lead Free Solder From The HASL Process - The Newest Surface Finish
Alternative," IPC/JEDEC 8th International Conference on Lead Free
Electronic Components and Assemblies, San Jose, CA, Apr. 18-20, 2005,
pp. xx-xx.
"Lead-free solder health concerns raised," Dataweek, vol. xx
no. xx, pp. xx-xx, June 14, 2006.
"Lead-Free Solder Lessens Environmental Burden," Defense Tech Briefs
, vol. 2 no. 3, pp. 36, June 2008.
"Lead-free solder licensed worldwide as EU lead-free rules take effect,"
Dataweek, vol. xx no. xx, pp. xx-xx, Sept. 20, 2006.
"Lead-free solder pastes drop-in replacements?," Circuitnet,
Apr. 3, 2006.
"Lead Free Solder Process Compatibility," Wiring Harness
News, vol. xx no. xx, pp. xx-xx, Nov./Dec. 2002.
"Lead-Free Solder Report," Adhesives & Sealants Industry,
vol. 12 no. 11, pp. 76, Nov. 2005.
"Lead-free solder SN100C (Sn-Cu-Ni+Ge)," Nihon Superior.
"Lead-free solder: the issues," Envirowise EN287.
"Lead Free Solder: "Why Bother"," SMART Group Lead-Free Seminar 1999
, High Wycombe, UK, Feb. 10, 1999.
"Lead-free: Solderballs and BGA," Tyco Electronics, Oct. 2002.
"Lead Free: Solderability," Tyco Electronics.
"Lead-free soldering and tools," Dataweek, vol. xx no. xx,
pp. xx-xx, July 28, 2004.
"Lead-free soldering and tools," Dataweek, vol. xx no. xx,
pp. xx-xx, Oct. 19, 2005.
"Lead-free soldering defects exposed," TWI, Feb. 23, 2005.
"Lead-free soldering defects exposed," Connect, vol. xx no.
xx, pp. xx-xx, Feb. 23, 2005.
"Lead Free Soldering for Sustainment," empfasis, pp. xx-xx,
Mar./Apr. 2003.
"Lead-free Soldering for the Attachment of uBGA Packages," Tessera
Application Note, Jan. 2001.
"Lead-Free Soldering Guide," AIM.
"Lead-free soldering - One Year On.," Electronics Manufacture and
Test, vol. xx no. xx, pp. xx, May 2000.
"Lead-free soldering problem," Circuitnet, Jan. 29, 2007.
"Lead Free Soldering Rapid Response Project," Lead Free Soldering
Summit, Philadelphia, PA, July 13-14, 2005.
"Lead-free soldering: reduce process variation by measuring wetting,"
TWI LiveWire, no. 16, Apr.-May 2005.
"Lead-free soldering term?," Circuitnet, May 21, 2007.
"Lead-Free Soldering with High-Power Diode Lasers," Coherent Application
Tech Note, Mar. 2002.
"Lead-free solders and electromechanical switches," Machine Design
, vol. xx no. xx, pp. 54, Apr. 1, 2004.
"Lead-free solders increase the need for bench-top fume extraction,"
Dataweek, vol. xx no. xx, pp. xx-xx, Mar. 21, 2007.
"LEAD-FREE solution at your fingertips," Electronics Manufacture and
Test, vol. xx no. xx, pp. xx, May 2002.
"Lead-Free Technology Experiment in a Space Environment."
"Lead-free Terminal Performance," NIC Components Corp., Dec. 26, 2002.
"Lead Free Tin Whiskering Study: Grayhill DIP Switches," Grayhill, May 11,
2004.
"Lead-free transition using HAL lead-free boards," Circuitnet
, Aug. 7, 2006.
"Lead Free Update," Purchasing, vol. xx no. xx, pp. xx-xx,
Dec. 9, 2004.
"Lead Free Update," Purchasing, vol. xx no. xx, pp. xx-xx,
Apr. 21, 2005.
"Lead Free Update," Purchasing, vol. xx no. xx, pp. xx-xx,
Aug. 11, 2005.
"Lead Free Update: How connector makers plan to comply with RoHs mandate,"
Purchasing, vol. xx no. xx, pp. xx-xx, Feb. 17, 2005.
Lead-Free Watch: Countdown to July 1, 2005
"Lead-Free Wave Solder Processing CPS Study Phase I," Alpha-Fry
Technologies.
"Lead-free wave soldering evaluation update," Soldering & Surface
Mount Technology, vol. 15 no. 2, pp. xx, 2003.
"Lead-free: Whiskers on Tin," Tyco Electronics.
"Lead Free World," Sierra Proto Express.
"Lead in solder, bromine in epoxy - Guilt by association," PCB007
, July 5, 2000.
"Lead in Solders for Servers," AeA, EICTA.
"Lead levels in lead-free process," Circuitnet, Nov. 20,
2006.
"Lead (Pb)-free Product," Samsung Electronics, July 2002.
"Leaded Solder on ROHS Compliant Parts?," Circuitnet, June 2,
2008.
"Leaders in SMT Kester," Surface Mount Technology (SMT), vol.
23 no. 2, pp. 13, Mar.-Apr. 2009.
"Leaders in SMT: Nihon Superior," Surface Mount Technology (SMT),
vol. 22 no. 7, pp. 7, July 2008.
"Leaders in SMT: phoenix|x-ray Systems+Services, Inc," Surface Mount
Technology (SMT), vol. 22 no. 8, pp. 15-17, Aug. 2008.
"Leadfree Solder and Tin Whiskers Program Guidance (draft),"
Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.
"Legs 1, 2 & 3: Olin 194 8lead SOIC Molded/Singulated."
"Letter Re: "Industry Steps Up to Make the World A Bit Cleaner" or "Who's
Responsible for the Lead-Free Mess"?," PCB007, June 14, 2006.
"Letter Re: "Industry Steps Up to Make the World A Bit Cleaner" or "Who's
Responsible for the Lead-Free Mess?"," PCB007, June 27, 2006.
"Letters," Circuits Assembly, vol. 17 no. 9, pp. 8, Sept.
2006.
"Letters to the Editor," Military & Aerospace Electronics
, vol. 16 no. 12, pp. xx-xx, Dec. 2005.
"Letters/CS Forum," Connector Specifier, vol. 21 no. 12, pp.
12, Dec. 2005.
"List: All substances that are possibly included in the new RoHS-directive,"
evertiq, Mar. 28, 2008.
"List of Banned, Restricted, and Materials Requiring Disclosure," Agere
Systems.
"Locking into chrome free zinc," Finishing, vol. 32 no. 6, pp.
40,42, Nov.-Dec. 2008.
"Looking beyond RoHS & WEEE," Electronics Manufacture and Test
, vol. xx no. xx, pp. xx-xx, June 7, 2006.
"Low Cost, Lead-Free Soldering Technology to Improve the Competitiveness of
European SMEs," LEADOUT Hands On Lead-Free Workshop, Manchester,
United Kingdom, June 21, 2006.
"Low cost lead-free soldering technology to improve the competitiveness of
European SMEs," Connect, no. 153, pp. 8, Mar./Apr. 2008.
"Low cost resource for WEEE education," Electronics Weekly,
Nov. 16, 2005.
"Low-halogen Electronics: The Next Lead Free?," IPC Review, vol.
48 no. 10, pp. 22-23, Dec. 2007.
"Lucent Technologies EC&S Hosts Open House At Its Staten Island
Headquarters," Plating & Surface Finishing, vol. 88 no. 3,
pp. 14, Mar. 2001.
"Lucent Technologies Venture announces electroplating process that gets the
lead out of solder materials," Lucent Technologies, Apr. 28, 1999.
"Major OEMs, EMS Providers and Suppliers Pledge Support for IPC-1752,"
PCB007, Feb. 8, 2006.
"Major OEMs, EMS Providers and Suppliers Pledge Support for IPC-1752,"
IPC Review, pp. 5, 6, Apr. 2006.
"Makers inch their way to RoHS compliance," Global Sources,
June 2, 2006.
"Making Product Information Work for the Environment," Integrated Product
Policy Working Group on Product Information, Nov. 15, 2006.
"Making Sense of RoHS Related Labels," Arrow.
"Making the Transition," Recycling Today, vol. xx no. x, pp.
xx-xx, Oct. 15, 2004.
"Manncorp Releases XBox Rework Solution," SMT Web Exclusive Article.
"Market for green materials to reach $8.7 billion by 2010," evertiq
, Nov. 24, 2005.
"Marking - Comparison of Standards or Guidelines," SMARTgroup.
"Marking of Electrical and Electronic Equipment," Mar. 3, 2005.
"Maryland adopts electronics recycling law," WasteNews.com,
May 13, 2005.
"Mastering Materials Declaration: Watch Out for Criminalization," IPC
Review, vol. 47 no. 6, pp. 16-18, July 2006.
"Material Composition," RosettaNet.
"Material Composition Survey and Response Manual, Second Edition," Japan
Green Procurement Survey Standardization Initiative (JGPSSI), May 26, 2006.
"Material Declaration: Who's in Charge?,"
"Materials Declaration Standard Users Speak Up," IPC Review, vol.
48 no. 8, pp. 15-16, Sept. 2007.
"Matsushita (Panasonic) develops new AdIT(R) technology employing conductive
adhesives," PCB007, July 18, 2002.
"Matte Tin Plating Whisker Data," Lattice Product Bulletin PB1227H, Nov.
2010.
"MAUDE Adverse Event Report," 1996.
"MAUDE Adverse Event Report," 2008.
"Maximum thermal stress temperatures," Circuitnet, Nov. 19,
2007.
"MaxiTech.biz: Guide to Computer Recycling," PRWeb, July 7,
2005.
"Maxitech.biz Say That Obsolete PCs Don't Need to Add to the UK's 'e-Waste
Mountain'," PRWeb, Jan. 2, 2005.
"Measurement methods for conductive adhesives."
"Measurements of Copper Dissolution in Lead-Free Solder Alloys."
Circuitree, vol. 20 no. 1, pp. 51, Jan. 2007.
"Mechanical Plating with Tin-Cadmium Alloy," Tin and its Uses,
no. 112, pp. x-x, 1977.
"Mechanism of Crystal Growth Discovered," Bell Laboratories Record
, vol. 48 no. 4, pp. 142-143, Apr. 1964.
Electronic Products, vol. 48 no.
2, pp. 47-59, July 2005.
"Meeting the RoHS Deadline: A Three Step Guide to Compliance," PartMiner,
2005.
"Melting point of lead free solder."
"Metal Storehouse," Nickel, vol. 17 no. 3, pp. xx-xx, Mar.
2002.
"Metal Whiskers," Science, New Series, vol. 123 no. 3209, pp.
1165, Jun. 29, 1956.
"Metal Whiskers," finishing.com.
"Metallic Whisker Sources," Worldwide Environmental Services, 2004.
"Metallurgical Division Publications - NISTIR 6797 Technical Highlights,"
"Micro-balling with lead-free HASL and SAC alloy," Circuitnet
, Dec. 14, 2009.
"Microsectioning of Lead-Free Solder Joints," empfasis, pp.
xx-xx, July 2001.
"MicroStar BGA Packaging Reference Guide, 3rd Edition," Texas Instruments
SSYZ015B, Sept. 2000.
"Military/Aerospace Forum," Electronic Products, vol. 49 no.
10, pp. 83, 85-92, Mar. 2007.
Electronic Products, vol. 47
no. 10, pp. 73-85, Mar. 2005.
"Military Facing Obsolescence Issues by RoHS," Design News,
June 23, 2005.
"Minnesota Finisher Offers High-Purity Aluminum As an Environmentally Friendly
Coating," Plating & Surface Finishing, vol. 89 no. 6, pp.
14-15, June 2002.
"Minutes of Declaration Process Management Meeting, Fiesta Inn - Tempe, AZ,
January 19-21, 2005," IPC.
"Mitsubishi outlines lead-free solder efforts," PCB007, Aug.
19, 2003.
"Mix Solder," Nihon Superior Co., Ltd., Nov 1, 2004.
"Moisture-Sensitive Devices," Assembly, vol. xx no. xx, pp.
xx-xx, Apr. 2006.
"Molecular Wires & Corrosion Control Boost Performance Of Conductive
Adhesives," Space Daily, vol. xx no. xx, pp. xx-xx, Mar. 14,
2005.
"Most Asian companies will be RoHS compliant," Purchasing,
vol. xx no. xx, pp. xx-xx, Mar. 16, 2006.
"Most Consumers Don't Care about Green," Design News, vol. 61
no. 12, pp. 24, Sept. 4, 2006.
"Most Design Engineers Are Ready For RoHS," Design News, vol.
61 no. 10, pp. xx-xx, July 17, 2006.
"Most discarded electronic devices are reused, study finds," Waste
News, vol. xx no. x, pp. xx-xx, Oct. 24, 2006.
"Most Hong Kong manufacturers are RoHs compliant," Purchasing
, vol. xx no. xx, pp. xx-xx, Feb. 23, 2006.
"Most want U.S. RoHS law," Purchasing, vol. xx no. xx, pp.
xx-xx, Jan. 4, 2007.
"Moving into REACH?," Materials World, vol. 12 no. 8, pp. 27-29,
Aug. 2004.
"Multi-metal Test Simplifies RoHS Screening," SMT Web Exclusive Article.
"Multiple Lead-free Profile," Circuitnet, June 30, 2008.
"Murata RoHS & Lead Reduction Activities," Murata, Sept. 23, 2004.
"MVR International Lauches www.mvr-gree.com: A Complete Resource Center About
RoHS and Other Environmental Regulations," June 15, 2005.
"MVR to launch RoHS web site," evertiq, June 22, 2005.
"Nano Whiskers."
"Nanowire breakthrough could lead to roll-out solar panels, flexible
electronics," American Ceramic Society Bulletin, vol. 92 no. 9,
pp. 11, Dec. 2013.
"NASA's Suggestions for Reducing Risk of Tin Whisker Induced Failures,"
Products Finishing, vol. 74 no. 12, pp. 32, Sept. 2010.
"National Physical Laboratory announces new report," emsnow,
July 2, 2004.
"NEDA seeks part numbers for Pb-free components," Purchasing,
vol. xx no. xx, pp. xx-xx, Sept. 16, 2004.
"Need lead-free wire solder for hand soldering," Circuitnet,
Sept. 25, 2006.
"NEMA Argues Against California's Proposed Battery Recycling Law,"
Conformity, vol. 11 no. 7, pp. 45, July 2006.
"NEMI backs standard for lead-free parts," Connector Specifier
, vol. 20 no. 7, pp. xx-xx, July 2004.
"NEMI Group Releases Draft Proposal of Tin Whisker Acceptance Test
Requirements," CircuiTree, vol. 17 no. 6, pp. xx-xx. June
2004.
"NEMI Group Recommends Tin/Silver/Copper Alloy as Industry Standard for
Lead-Free Solder Reflow in Board Assemblies," NEMI, Jan. 24, 2000.
"NEMI Issues Revised Tin Whisker Acceptance Test Requirements," NEMI, Aug.
30, 2004.
"NEMI issues revised tin whisker acceptance test requirements,"
PCB007, Aug. 30, 2004.
"NEMI issues revised tin whisker acceptance test requirements,"
emsnow, Sept. 6, 2004.
"NEMI issues revised tin whisker test requirements," TIN World
, no. 7, pp. 17, 2004.
"NEMI, ITRI Investigate Lead-Free Compatibility," Circuits Assembly
, vol. 11 no. 7, pp. 16, July 2000.
"NEMI makes lead-free part identification recommendations," Advanced
Packaging, vol. xx no. xx, pp. xx-xx, June 22, 2004.
"NEMI makes recommendations for Lead-Free part identfication,"
emsnow, June 14, 2004.
"NEMI makes recommendations for lead-free part identification,"
PCB007, June 22, 2004.
"NEMI Recommends Industry Standard Lead-free Solder," Surface Mount
Technology (SMT), vol. 14 no. 3, pp. xx-xx, Mar. 2000.
"NEMI Recommends Lead-Free Alloy," Printed Circuit Design and
Manufacture, vol. 17 no. 3, pp. 6, Mar. 2000.
"NEMI Recommends Lead-Free Part ID Process," Electronic News,
June 11, 2004.
"NEMI team recommends three test conditions for evaluating tin whisker
growth," PCB007, Oct. 6, 2003.
"NEMI Team Recommends Three Test Conditions for Evaluating Tin Whisker
Growth," CircuiTree, vol. 16 no. 12, pp. xx-xx, Dec. 2003.
"NEMI's Tin Whisker Project reports initial test results, reviews modeling
efforts at APEX 2002," PCB007, Feb. 8, 2002.
"New additive limits tin whiskers," Solid State Technology, vol.
51 no. 1, pp. 23, Jan. 2008.
"New Calif. law requires retailers to take back rechargeable batteries,"
Waste News, vol. xx no. x, pp. xx-xx, Oct. 13, 2006.
"New classification released," Electronics Manufacture and Test
, vol. xx no. xx, pp. xx-xx, Sept. 8, 2008.
"New E-Waste Recycling Laws Threaten Revenue Predictability and
Profitability," PCB007, Aug. 22, 2006.
"New EU Battery Directive Released," Conformity, 2007 Engineers'
Reference Guide, pp. 222, 2007.
"New EU Directive Targets Product Lifecycle," Design News,
vol. 60 no. 13, pp. xx, Sept 26, 2005.
"New EU environment directives estimated to cloud NT$200 billion Taiwanese
hi-tech exports," CENS.com, Jan. 17, 2005.
"New Guideline for producing Pb Free released," evertiq,
Apr. 26, 2010.
"New handheld XRF analyzer for fast, reliable and non-destructive RoHS
compliance screening from Oxford Instruments," PCB007, June
27, 2005.
"New Immersion Tin Process PRESA RMK-30: Tin Whisker Issue," Uyemura, Mar.
2007.
"New iNEMI lead-free book," Tin World, no. 20, pp. 15, Winter
2007.
"New IPC-1752, Materials Declaration Management Standard," evertiq
, Mar. 10, 2006.
"New IPC Guide to Environmental Megatrends Steers Companies Through
Environmental Regulations and Issues," CircuiTree, vol. 21
no. 9, pp. xx-xx, Sept. 2008.
"New I. T. R. I. Tin-Zinc Plating Bath," Tin and its Uses, no.
163, pp. 2, 1990.
"New Jersey Enacts Electronic Waste Recycling Regulations," Conformity
, vol. 13 no. 4, pp. 78, Apr. 2008.
"New Jersey Enacts Electronic Waste Recycling Regulations,"
Conformity, 2009 Engineers' Reference Guide, pp. 197, 2009.
"New Lead-Free Implementation Checklist," PCB007, Apr. 29,
2005.
"New machine tests lead free solders," Electronics Manufacture and
Test, vol. xx no. xx, pp. xx-xx, Apr. 21, 2008.
"New magnetic solders developed by Yale," Tin World, no. 30,
pp. 11, Spring 2010.
"New Pb-free technologies boost product reliability," Dataweek
, vol. xx no. xx, pp. xx-xx, Oct. 18, 2006.
"New Project on SnAgCu Impact Tolerance," PCB007, Mar. 31,
2005.
"New REACH Compliance Guidelines," Products Finishing, vol. 73
no. 10, pp. 10, July 2009.
"New Research Reveals Many US Companies Ignoring New RoHS Law,"
PCB007, Oct. 5, 2006.
"New Research shows that Flame Retardant Chemicals Save Lives and Money,"
evertiq, June 29, 2006.
"New research study on intermetallic growth," Tin World, no.
22, Early Summer 2008, pp. 14-15.
"New revision for BGA assembly standard," Dataweek, vol. xx
no. xx, pp. xx-xx, May 14, 2008.
"New RoHS business compliance program," evertiq, Mar. 20,
2006.
"New standard could simplify RoHS data exchange," Manufacturing
Business Technology, vol. xx no. xx, pp. xx-xx, Jan. 2006.
"New Standard to Provide Efficient Mechanism for the Exchange of Materials
Content Information," iNEMI, Apr. 20, 2005.
"New standards define revised test parameters for guaranteeing integrity of
RoHS-compliant products," Dataweek, vol. xx no. xx, pp.
xx-xx, Nov. 1, 2006.
"New Standards Development Committee on Declarable Substances in Materials is
formed within ASTM International," the emc journal, no. 59,
pp. 11, July 2005.
"New Standards on Tin Whisker Mitigation," Circuits Assembly,
vol. 17 no. 4, pp. 36, Apr. 2006.
"New Supplier RoHS Audit Form Can Help with RoHS Compliance," IPC Review
, vol. 47 no. 1, pp. 4, Jan. 2006.
"New tin whisker standard," Tin World, no. 18, pp. 16, Early
Summer 2007.
"New Tool Eases Lead-Free Parts Selection," Printed Circuit Design and
Manufacture, vol. 22 no. 8, pp. 8, Aug. 2005.
"New Tool Eases Pb-Free Parts Selection,"
"New TWI proposed project: Tin Whiskers - reducing the risk," TWI
LiveWire, issue 14, Summer 2004.
"New twists in environmental compliance rules," SourceESB, Nov. 30, 2005.
"New WEEE Legislation May Be Near," Conformity, vol. 11 no.
5, pp. 41, May 2006.
"New WWF study on food only identifies formerly used flame retardant
Penta-BDE," evertiq, Sept. 29, 2006.
"New XRF material analyzer slashes throughput times," Tin World
, no. 20, pp. 17, Winter 2007.
"Newark InOne has RoHs help," Purchasing, vol. xx no. xx, pp.
xx-xx, Feb. 2, 2006.
"Newark InOne offers RoHS catalog," Purchasing, vol. xx no.
xx, pp. xx-xx, Mar. 2, 2006.
"Newark InOne Revamps Website Around RoHS Compliance Steps," PCB007
, Jan. 31, 2006.
"Newark InOne revamps Website for RoHS conversion," SourceESB, Feb. 10,
2006.
"NGOs continue to put pressure on electronics companies despite fire safety
risks," evertiq, Jan. 21, 2008.
"Nickel Addition Turns Tin-Copper into a Viable Lead-free Solder,"
PCB007, Feb. 16, 2005.
"Nickel-coated Components Solve Electrical Problem," Nickel,
vol. 20 no. 2, pp. 5, Mar. 2005.
"Ningbo: RoHS compliance in full swing," Global Sources,
Sept. 13, 2006.
"NITROGEN is more than just hot air," Electronics Manufacture and
Test, vol. xx no. xx, pp. xx, Feb. 2001.
"No Votes Force Changes to J-STD-709," Printed Circuit Design and Fab
, vol. 26 no. 6, pp. 8, June 2009.
"Nokia tops latest Greenpeace 'Greener Electronics Guide'," evertiq
, Sept. 16, 2008.
"No-Lead and Horizontal Hot Air Leveling," Proceedings of the
Technical Program NEPCON West '95, Volume 2, Anaheim, CA, Feb. 26-Mar.
2, 1995, pp. 1087-1092.
"Non-Lead Stabilizers for PVC Wire & Cable," Plastics Technology
, vol. 52 no. 5, pp. 39, May 2006.
"NoNE lead-free soldering guideline Version 2 - November 2004," Nov. 2004.
"Norwegian RoHS, 18 substances banned," evertiq, July 24,
2007.
"NPL creating Industry Defect Database," Electronics Manufacture and
Test, vol. xx no. xx, pp. xx-xx, Aug. 17, 2007.
"NPL: Design & Build of Unique Machine," Circuitnet, Apr. 24,
2008.
"NPL develop low cycle isothermal testing for lead-free solders,"
Tin World, no. 22, Early Summer 2008, pp. 15.
"NPL Effect of Voiding on Lead-Free Reliability Report," Tin World
, no. 12, pp. 15, Winter 2006.
"NPL releases report on effect of voiding on lead-free reliability,"
emsnow, Oct. 6, 2005.
"NPL Report: The Measurement of Creep Rates and Stress Relaxation for Micro
Sized Lead-free Solder Joints," PCB007, July 25, 2005.
"NPL SSTC lead-free meeting previews unique video of tin transformation,"
emsnow, June 1, 2007.
"NPL to measure copper dissolution in lead-free solder alloys," Tin
World, no. 16, pp. 17, 2006.
"NPL wins 'Best International Paper at IPC/APEX," Tin World,
no. 13, pp. 16, Spring 2006.
"NSAI Launches RoHS Certificate Program," Circuitnet, Oct.
19, 2007.
"NT$20B.Taiwan-made Products Fail to Meet RoHS Directive," CENS.com
, Apr. 3, 2006.
"NT$20B.Taiwan-made Products Fail to Meet RoHS Directive," PCB007
, Apr. 3, 2006.
"Oeko-Institut Calls for Industry Input on RoHS Review," PCB007
, Mar. 17, 2008.
"Oki Electric Completes Hexavalent Chromium-free Screws for its Mechatronic
Products," PCB007, Mar. 15, 2005.
"Oki switches its screws to fit RoHS legislation" Engineeringtalk
, Mar. 16, 2005.
"Oki Terminates Six Chemical Substances Subject to RoHS for Its Stepping
Motors," PCB007, Feb. 21, 2005.
"Omikron Immersion White Tin," Florida CirTech, Feb. 19, 1998.
"On-line REACH service," Finishing, vol. 32 no. 4, pp. 8,
July-Aug. 2008.
"On-Site Lead Screening of Electronic Components," Niron Application
Bulletin.
"One-third are still not lead-free prepared," Electronicstalk
, Mar. 31, 2005.
"On Trial In Brazil," Air Safety Week, vol. 21 no. 23, June 11,
2007.
"Online "Game" Tests Knowledge of RoHS," Conformity, vol. 11
no. 7, pp. 45, July 2006.
"Only two years to go lead-free," European Electronics Engineer
, vol. xx no. xx, pp. xx-xx, Jan. 2005.
"Ontario Recycling E-Waste," Appliance Design, vol. 56 no. 5, pp.
14-15, Sept. 2008.
"Optimizing Mixed Metal Manufacturing," PCB007, Nov. 20,
2006.
"ORGALIME POSITION concerning the marking requirements of article 10(3) and
article 11 (2) of Directive 2002/96/EC (WEEE)," May 13, 2003.
"OSHA Ordered to Set New Chromium Limits," Chemical Market Reporter
, vol. 263 no. 15, pp. 3, Apr. 14, 2003.
"OSP," Electronics Manufacture and Test, vol. xx no. xx, pp.
xx-xx, Oct. 7, 2004.
"Other Environmental Regulatory News," Conformity, vol. 11
no. 3, pp. 44,-45, Mar. 2006.
"Other Environmental Requirements."
"Overcoming zinc whisker," finishing.com.
"Overview of Lead Free Solder Research," Center for Advanced Vehicle
Electronics (CAVE).
"Palm's Treo falls foul of European pollution law,", May 26, 2006.
"PANalytical," X-Ray Spectrometry, vol. 33 no. 5, pp. 391,
Sept./Oct. 2004.
"Part II - The WEEE Directive - draft implementing Regulations."
"Part IV - The RoHS Directive - draft implementing Regulations."
"Part Movement During Reflow," Circuitnet, Dec. 4, 2007.
"PartMiner Adds Lead-Free and RoHS Material Content Data to Its CAPS
Electronic Component Database," Business Wire, vol. xx no. xx,
pp. xx-xx, Dec. 15, 2004.
"Passport to Lead-Free," evertiq, May 10, 2005.
"Patent Protected Lead-Free Alloys and the User," SMART Group 8th Annual
Lead-Free Seminar + 'Question Time' & Table-Top Exhibition, High
Wycombe, United Kingdom, Feb. 16, 2006.
"Pb-Free Components," DfR Solutions, Mar. 3, 2010.
"Pb-free era," Electronics Manufacture and Test, vol. xx no.
xx, pp. xx-xx, Feb. 7, 2006.
"Pb-free FAQs," Electronics Manufacture and Test, vol. xx no.
xx, pp. xx, Dec 2003.
"Pb-free Impact on PCB Purchasing Whitepaper," NexLogic.
"Pb-Free Issues and the EPA," empfasis, pp. xx-xx, Feb. 2001.
"PB-Free solder properties database," Components in Electronics
, vol. xx no. xx, pp. xx-xx, June 2006.
"Pb-Free Solder Wetting Tests," Circuits Assembly, vol. 19
no. 12, pp. 32, Dec. 2008.
"PC makers must follow the toughest green laws," Global Sources
, Feb. 2, 2007.
"Phones, printers to be tested first under China RoHS," Purchasing
, vol. 138 no. 11, pp. 45-46, Nov. 2009.
"Plating thickness for lead-free HASL," Circuitnet, Apr. 10,
2007.
"Plating's Effects on Electronics Assembly," Printed Circuit Design
and Fab/Circuits Assembly, vol. 27 no. 7, pp. 40, July 2010.
"Plaudits and criticisms in green electronics review," Electronics
Manufacture and Test, vol. xx no. xx, pp. xx-xx, June 30, 2008.
"Pollution Prevention Technology Profile Trivalent Chromium Replacements for
Hexavalent Chromium Plating," Northeast Waste Management Officials'
Association (NEWMOA), Nov. 18, 2003.
"Polyclad Laminates Publishes Lead-Free Material Selection Guide," June
28, 2005.
"Polymer Solder Balls," Electronics Manufacture and Test,
vol. xx no. xx, pp. xx-xx, Dec. 17, 2007.
"Popcorning," Electronics Manufacture and Test, vol. xx no.
xx, pp. xx-xx, Feb. 7, 2005.
"Position Paper on Risks to High-Reliability Electronics and Associated
Hardware from Pure Tin Coatings," Jul. 25, 2002.
"Poster and Calendar Aid RoHS Compliance," Design News, vol.
61 no. 4, pp. xx, Mar. 20, 2006.
"Potential Magnitude of Additional Demand for Copper, Silver, Tin, and Bismuth
for Lead-free Solder Alternatives," Abt Associates, Nov. 20, 2002.
"Potential Regional Coordination on Pollution Prevention Technologies and
Resources for Industry Sectors Emitting or Transferring Lead or Lead Compounds
in the Northeast (Draft)," Northeast Waste Management Officials'
Association (NEWMOA), Sept. 2002.
"Potential Tin Whiskers on Printed Circuit Board Components," Westinghouse
Nuclear Tech Bulletin TB-05-4, June 8, 2005.
"Power Supply Failures: The Problem with Zinc Whiskers," Apr. 5, 2005.
"Pre-Bake Standard for Rework," Circuitnet, Jan. 12, 2009.
"Precision Analytical Weights Protected with Electrodeposited Tin-Nickel
Alloy," Tin and its Uses, no. 31, pp. 11, Apr. 1955.
"Premier Farnell Feedback on the EC Directives on RoHS & WEEE,"
Farnellinone.
"Premier Farnell RoHS Legislation and Technical Manual Step-by-step Guide
(Version 2)," Farnell inone, 2005.
"Principles of cleaner design," electronicsweekly.com, Dec.
9, 2004.
"Printed Board Laminates," Electronics Manufacture and Test,
vol. xx no. xx, pp. xx-xx, June 7, 2006.
"Printing Lead Free Solder Paste," LEADOUT Hands On Lead-Free Workshop
, Manchester, United Kingdom, June 21, 2006.
"Procedure for handling moisture sensitive PCB's," Circuitnet
, July 28, 2008.
"Process Changes for Electronics Manufacturing: LEAD FREE SOLDERING:
Implications for Barcode Labels," Lead-Free Magazine, vol. 3,
Feb. 2005.
"process guidelines to Lead-free assembly," Cookson Electronics.
"Product Manual: Familiarization and Training Guide," Alpha.
"Profile of the Surface Finishing Use Cluster."
"Profiling for Large BGA Attachment," Circuits Assembly, vol.
19 no. 2, pp. 33-34, Feb. 2008.
"Profiling for the Attachment of Large Ball Grid Array Packages,"
empfasis, pp. xx-xx, Nov. 2007.
"Progress of Tin-Zinc Alloy Plating," Tin and its Uses, no. 24,
pp. 11-12, July 1951.
"Progress on lead-free components spotty," SourceESB, Nov. 17, 2004.
"Proper method to bake PCB's," Circuitnet, Nov. 20, 2006.
"Proposal for a Battery Directive repealing Directive 91/157/EEC: EICTA
position on the implications for design and manufacturing of Electrical and
Electronic Equipment," EICTA, Feb. 5, 2006.
"Proposals for Further Exemptions from the Requirements of Article 4(1) of
Directive 2002/95/EC for Specific Applications of Lead, Mercury, Cadmium,
Hexavalent Chromium," Japan Business Council in Europe.
"Proposed restriction of organo-halogen compounds and its possible impact on
the electronics sector," IPC Brussels, Brussels, Belgium,
June 18, 2008, pp. xx-xx.
"Proposed RoHS Revisions Released: IPC Remains Cautious Until Directive is
Finalized," IPC Review, vol. 2 no. 1, pp. 2, Jan./Feb. 2009.
"Proposition 65 in Plain English," California Environmental Protection
Agency.
"Providing lead-free data," Purchasing, vol. xx no. xx, pp.
xx-xx, Apr. 7, 2005.
"Publication Provides Information on Implementing Lead-Free Solder,"
Electronic Device Failure Analysis, vol. 10 no. 1, pp. 37, Feb. 2008.
"Purchasers face new environmental deadline," Purchasing,
vol. xx no. xx, pp. xx-xx, May 25, 2006.
"Pure silver flakes conduct electricity and heat," Microelectronics
International, vol. 17 no. 1, pp. xx-xx, 2000.
"Q&A (FAQ) regarding JIG,Survey and Response Manual, and Survey Response
Tool Ver. 3," Japan Green Procurement Survey Standardization Initiative
(JGPSSI), Mar. 30, 2006.
"Qualification of Lead Free Component Plating Finishes," Nov. 3, 2003.
"Qualification Procedure for Tin Whisker Formation in Lead-free Connector
Terminal Finishes," Molex.
"QUALITY dips in isotropic conductive adhesive," Electronics
Manufacture and Test, vol. xx no. xx, pp. xx-xx, Oct. 2004.
"Quality Evaluation Data for Lead-free SMD Area Array Packages Seiko
Epson, Aug. 30, 2002.
"Quality Evaluation Data for Lead-free SMD Peripheral Packages (Sn-Bi plating)
Seiko Epson, Aug. 30, 2002.
"Quantifying lead-free solder spread," EMasia, Mar. 2006.
"Question & Answer," Waste News, vol. xx no. x, pp.
xx-xx, Apr. 28, 2003.
"Question: Are RO4000(R) materials compatible with lead-free processes?."
"Questions and Answers from October 26, 2006 AeA China RoHS Conference."
"Questions for your board maker on RoHS," Electronics Supply &
Manufacturing, Sept. 2005.
"Racing towards RoHS," Electronic Product Design, vol. xx no.
xx, pp. xx-xx, June 1, 2006.
"Rationale for the Auger Studies," Tin Whisker Group teleconference, May 11,
2016.
"REACH and its potential impact on coil coating," Finishing, vol.
28 no. 4, pp. 28, 30, May-June 2004.
"REACH Chemical Regulation Is Now EU Law," IPC Review, vol. 48
no. 2, pp. 6, Feb. 2007.
"REACH Chemical Regulation is Now EU Law," IPC Review, vol. 49
no. 3, pp. 22-23, Mar./Apr. 2007.
"REACH for knowledge.(news)," Finishing, vol. 31 no. 4, pp. 10,
July-Aug. 2007.
"REACH implementation Begins in 2008," Products Finishing, vol.
72 no. 7, pp. 12-13, Apr. 2008.
"REACH: Is Industry Ready for this EU Regulatory Tidal Wave?," IPC
Review, vol. 1 no. 4, pp. 11, Sept./Oct. 2008.
"REACH Out of Reach?," PCB007, July 29, 2008.
"REACH Puts 300 Chemicals on SIN List," Printed Circuit Design and Fab
, vol 25 no. 11, pp. 8, Nov. 2008.
"REACH registration fees," Finishing, vol. 32 no. 3, pp. 6,
May-June 2008.
"REACH Strategy and Preparation," 2008 IPC Midwest Show Proceedings
, Schaumburg, IL, Sept. 23-24, 2008, pp. xx-xx.
"REACH-ing for Answers," Products Finishing, vol. 72 no. 9, pp.
10, June 2008.
"Reaching Forward," Adhesives & Sealants Industry, vol. 13
no. 7, pp. 26, July, 2006.
"REACH-ing Out," Plating and Surface Finishing, vol. 95 no. 8,
pp. 12-13, Aug. 2008.
"REACH-ing out," Finishing, vol. 32 no. 5, pp. 6, Sept.-Oct.
2008.
"Ready for REACH?," Appliance Design, vol. 56 no. 5, pp. 18,
Sept. 2008.
"Recommendations for Pb-Free Manufacturing Requirements," Adhesives
& Sealants Industry, vol. xx no. xx, pp. xx-xx, July 2006.
"Recommendations on Lead-Free Finishes for Components Used in High-Reliability
Products," iNEMI Tin Whisker User Group, Version 3, May 2005.
"Recommendations for Pb-Free Manufacturing Requirements," Adhesives
& Sealants Industry, vol. 13 no. 7, pp. 35, July 2006.
"Recycling?," Green SupplyLine, May 1, 2005.
"Recycling fee threat to small electronics retailers," letsrecycle.com,
Mar. 20, 2006.
"Recycling Technology Advances and New Material Development Key to Successful
E-Waste Recovery," PCB007, June 5, 2006.
"Reduce process variation in lead free soldering," Connect,
no. 138, pp. 8, Sept.-Oct. 2005.
"Reduce the risk of tin Whiskers in lead-free RJ connectors," Xmultiple
Application Note, xxxx.
"Reduce voids in QFN pb-free reflow process," Circuitnet,
Apr. 28, 2008.
"Reducing the rising tide of electronic scrap," Materials World,
vol. 10 no. 11, pp. 16-17, Nov. 2002.
"Reducing the risk of tin whiskers on lead-free products," RF
Design, vol. xx no. x, pp. xx-xx, May 10, 2006.
"Re-educating the approach to recycling," Components in Electronics,
Feb. 2008.
"Reflecting on the environment," Finishing, vol. 14 no. 5, pp.
35, May 1990.
"Reflow and wave soldering OSP Boards," Circuitnet, Dec. 11,
2006.
"Reflow for leaded and lead-free assemblies," Circuitnet,
Sept. 9, 2007.
"Reflow oven profilers," Circuitnet, Oct. 23, 2006.
"Reflow parameters for lead-free BGA," Circuitnet, Feb. 4,
2007.
"Reflow Profiling of Power PCBs," Circuits Assembly, vol. 17
no. 6, pp. 38-39, June 2006.
"Reflow Soldering Guidelines for Lead-Free Packages," Altera Application
Note 353, July 2004.
"Regarding lead free, can I use the reflow ovens I currently have in
production?," Circuitnet, June 26, 2006.
"Regulatory Update," Conformity, vol. 11 no. 8, pp. 90, Aug.
2006.
"Relay Contact Life," Tyco Electronics Application Note.
"Release and Introduction of Survey Response Tools Ver.3 & Related Manuals
in English," Japan Green Procurement Survey Standardization Initiative
(JGPSSI), Feb. 1, 2006.
"Reliability of SN100C," Nihon Superior Co., Ltd., Mar. 24, 2005.
"Reliability Test Matrices for Lead-Free Solder Evaluation Project #1,"
AMD, Jan. 22, 2002.
"Reminder to register chemicals under REACH; ECHA launches new web site to
help," Anti-Corrosion Methods and Materials, vol. 55 no. 5, pp.
xx, 2008.
"Removal of Lead Shakes Up the Manufacturing Chain," Conformity
, vol. 10 no. 8, pp. 28-35, Aug. 2005.
"Remove and replace a 240 pin connector," Circuitnet, Oct.
16, 2006.
"Replacing Lead-Based Solder: Molecular Wires And Corrosion Control Boost
Performance Of Electrically Conductive Adhesives," ScienceDaily
, vol. xx no. xx, pp, xx-xx, Mar. 30, 2005.
"Report - RoHS Request for more exemptions Dec 2004," Dec. 2004.
"Reports on Lead-Free Soldering Research Available," Conformity
, vol. 11 no. 5, pp. 41, May 2006.
"Request for exempt on RoHS-directive 2002/95/EC for separable interface
connectors," FCI, Sept. 15, 2004.
"Requested Exemption from the requirements of Article 4(1) of Directive
2002/95/EC," Swatch, Jan. 12, 2006.
"Research and Markets Announces Regulations Impacting Green Labelling,"
Advanced Packaging, vol. xx no. xx, pp. xx-xx, Oct. 14, 2004.
"Research Updates on PCBs, RoHS, Economy, and PCs," SMT Web Exclusive
Article.
"Researcher Develops New Electroplating Process That Gets the Lead Out of
Solder," Lucent Technologies, Apr. 28, 1999.
"Researchers Develop Environmentally Friendly Coatings for Military
Applications," Products Finishing, vol. 70 no. 12, pp, 12, Sept.
2006.
"Resistance Welding of Tin and Tin-Zinc Alloy Coated Mild Steel Sheet,"
Tin and its Uses, no. 21, pp. 15-20, Oct. 1949.
"Response to Stakeholder Consultation on Adaptation to Scientific and
Technical Progress under Directive 2002/95/EC for the Purpose of a Possible
Amendment of the Annex," Japan Business Council in Europe, July 5, 2004.
"Restriction of Hazardous Substances," EE Times - Asia, vol.
xx no. xx, pp. xx-xx, Dec. 3, 2004.
"Restriction of Hazardous Substances: Compliance Strategy Rev 2,"
Anadigics, Nov. 2004.
"Restriction of Hazardous Substances (RoHS) Directive 5 months to
implementation," SMART Group 8th Annual Lead-Free Seminar + 'Question
Time' & Table-Top Exhibition, High Wycombe, United Kingdom, Feb.
16, 2006.
"Results from the Soldertec Global European Pb-Free Marking Survey," Jan.
2004.
"Results of IPC Survey on REACH Preparedness in the North American and
European Electronic Interconnect Industry," IPC, July 2008.
"Results of National Electronic Distributor Association Meeting,"
PCB007, Feb. 1, 2005.
"Review of Directive 2002/95/EC (RoHS) Categories 8 and 9 - Stakeholder
Meeting," ERA Technology, Apr. 2006.
"Revised Directives," Appliance Design, vol. 57 no. 2, pp. 7-8,
Feb. 2009.
"Revised RoHS directives proposed," Electronics Manufacture and Test
, Dec. 8, 2008.
"Revision B of IPC-7095 Now Available," CircuiTree, vol. 21
no. 4, pp. xx-xx, Apr. 2008.
"Revolutionary methodology," Electronics Manufacture and Test
, vol. xx no. xx, pp. xx-xx, Aug. 9, 2007.
"Rework - The Hidden Phenomenon?."
"Reworking BGAs/CSPs Using Lead-Free Solders," OK International.
"Reworking Pb-Free PCBs," Circuits Assembly, vol. 19 no. 10,
pp. 35, Oct. 2008.
"Risks of Conductive Whiskers in High-Reliability Electronics and Associated
Hardware from Pure Tin Coatings," June 19, 2002.
"RMD Instruments to Showcase A New Feature for LeadTracer-RoHS System at
SMTA," Circuitnet, Aug. 11, 2008.
"RMD to Exhibit New Feature for LeadTracer-RoHS System at IPC Midwest,"
Circuitnet, Sept. 17, 2008.
"Road to RoHS," CircuiTree, vol. 18 no. 8, pp. xx-xx, Aug.
2005.
"Road to RoHS," CircuiTree, Sept. 1, 2005.
"Road to RoHS," CircuiTree, vol. 18 no. 9, pp. xx-xx, Sept.
2005.
"Road to RoHS," CircuiTree, vol. 18 no. 10, pp. xx-xx, Oct.
2005.
"Road to RoHS," CircuiTree, vol. 18 no. 11, pp. xx-xx, Nov.
2005.
"Road to RoHS," CircuiTree, vol. 18 no. 12, pp. xx-xx, Dec.
2005.
"Road to RoHS," CircuiTree, vol. 19 no. 1, pp. xx-xx, Jan.
2006.
"Road to RoHS," CircuiTree, vol. 19 no. 2, pp. xx-xx, Feb.
2006.
"Robotic Solder Dip Solves Tin Whisker Problem," Navy Mantech, 2005.
"RoHS," EICTA, Sept. 15, 2004.
"RoHS Amendment: Commission Exempts DecaBDE and Lead in Bronze Bushings,"
Conformity, vol. 10 no. 12, pp. 54, Dec. 2005.
"RoHS and lead-free: how the regulations impact you," Dataweek
, vol. xx no. xx, pp. xx-xx, Oct. 4, 2006.
"RoHS and Material Declarations," Surface Mount Technology,
vol. xx no. xx, pp. xx-xx, xxx. xxxx
"RoHS and WEEE: could you be exempt?," Components in Electronics
, vol. xx no. xx, pp. xx-xx, Nov. 2005.
"RoHS and WEEE: Suppliers rattled to full compliance," Telecom
Products, July 29, 2005.
"RoHS Assurance Tests To Support Materials Declarations," evertiq
, May 18, 2006.
"RoHS at QP Semiconductor," QP Semiconductor Application Note 114 Rev.
2.0, Feb. 2008.
"RoHS Brings Glee to Some and Gloom to Others in Taiwan Electronics Parts
Sector," CENS.com, Jan. 5, 2007.
"RoHS catalog released," Purchasing, vol. xx no. xx, pp.
xx-xx, Mar. 16, 2006.
"RoHS Challenges Business Practices Too," Embedded Technology,
pp. 2, 4, Mar. 2006.
"RoHS clarification at last," Components in Electronics, vol.
xx no. xx, pp. xx-xx, Aug. 2004.
"RoHS Compliance," ECN, vol. 50 no. 1, pp. 53, Jan. 2006.
"RoHS Compliance," Components in Electronics, vol. xx no. xx,
pp. xx-xx, Feb. 2006.
"RoHS compliance easier with JIG-101," evertiq, June 1, 2005.
"RoHS compliance for SMT and Through-hole equipment," Circuitnet
, May 29, 2006.
"RoHS compliance is about 25%," Purchasing, vol. 134 no. 7., pp.
20, Apr. 21, 2005.
"RoHS Compliance - No Quick Fix," PCB007, Feb. 9, 2006.
"RoHS compliance of assembly machine transferred to European facility,"
Circuitnet, June 11, 2006.
"RoHS compliance slow but steady in mainland China, Taiwan," Global
Sources, Jan. 8, 2007.
"RoHS compliance testing," EuroAsia Semiconductor, vol. xx
no. xx, pp. xx-xx, Aug. 2006.
"RoHS Compliance Testing Resource Now On-line at www.rohsbyxrf.com,"
PCB007, Aug. 15, 2005.
"RoHS compliant chips with their own marking," evertiq, July 21, 2005.
"ROHS Conformance -- Related Notes."
"RoHS could crimp connector supply," Purchasing, vol. xx no.
xx, pp. xx-xx, Mar. 30, 2006.
"RoHS deadline: Closer to ready," SourceESB, Dec. 14, 2005.
"RoHS Directive Compliance Procrastinators and Naysayers Take Heed," IPC
Review, pp. 16-17, Sept. 2005.
"RoHS Directive Doomed to Fail, Says Environmental Consultant,"
CircuiTree, vol. 19 no. 3, pp. xx-xx, Mar. 2006.
"RoHS Directives," (Dionics)
"RoHS - electronic products must display environmental protection stickers,"
emsnow, Feb. 28, 2007.
"RoHS Enforcement," Components in Electronics, vol. xx no.
xx, pp. xx-xx, Feb. 2006.
"RoHS Enforcement Still a Mystery, But Will Include Testing," Design
News, vol. 61 no. 5, pp. xx, Apr. 10, 2006.
"RoHS: European Commission Sets Official Limits," Conformity,
vol. 10 no. 11, pp. 8. 10, Nov. 2005.
"RoHS Exemption... A Blessing or A Curse?," Chip Scale Review,
vol. 12 no. 5, pp. 86, July 2008.
"RoHS exemption for agricultural equipment in Europe," Circuitnet
, Aug. 14, 2006.
"RoHS exemptions list available on the web," Electronics Weekly
, Aug. 21, 2006.
"RoHS exemptions situation becomes clearer," evertiq, Jan. 3,
2005.
"RoHS existing products vs. new products," Circuitnet, May 1,
2006.
"RoHS Guidance Notes Reissued," Circuits Assembly, vol. 16 no. 3,
pp. 11, Oct. 2005.
"RoHS Guidance Re-issued," evertiq, Aug. 18, 2005.
"RoHS guidelines issued by UK enforcer," Electronics Weekly,
May 31, 2006.
"RoHS Hampers Product Innovation," SourceESB, June 29, 2006.
"RoHS impacts MRO parts," SourceESB, Nov. 16, 2005.
"RoHS in China delayed," evertiq, Jan. 11, 2006.
"RoHS: Is time running out for business to comply?," Apr. 22, 2005.
"RoHS isn't just inconvenient; it's potentially deadly," EE Times
, Oct. 9, 2006.
"RoHS: It's all still happening," Electronics News, Sept. 3,
2008.
"RoHS Law for US? Newark InOne Poll Says 'Yes' 2 to 1," PCB007
, Dec. 21, 2006.
"RoHS less rosy from across the pond," Electronics Manufacture and
Test, pp. xx-xx, July 2006.
"RoHS: Most suppliers to change part numbers," Purchasing,
vol. xx no. xx, pp. xx-xx, Nov. 29, 2005.
"RoHS panel discussion," EngineerIT, pp. 46-48, Jan. 2008.
"RoHS Part Numbering: The Continuing Saga," Design News, vol.
60 no. 8, pp. xx, June 6, 2005.
"RoHS PCB Specification - What Has To Change?," evertiq, Dec.
10, 2006.
"RoHS PCB specification - what has to change?," Soldering &
Surface Mount Technology, vol. 19 no. 1, pp. xx-xx, 2007.
"RoHS - perspectives of a PWB manufacturer," IPC Brussels,
Brussels, Belgium, June 18, 2008, pp. xx-xx.
"RoHS poll stirs debate," Purchasing, vol. xx no. xx, pp.
xx-xx, Nov. 2, 2006.
"RoHS, REACH and You," IPC Review, vol. 1 no. 1, pp. 11,
Mar./Apr. 2008.
"RoHS Readiness," Sanmina-Sci, June 2004.
"RoHS Regs are the Start - Not the "End-game"," Printed Circuit Design
and Manufacture, vol. 24 no. 2, pp. insert, Feb. 2007.
"RoHS remains a burning issue," Electronics Manufacture and Test
, vol. xx no. xx, pp. xx-xx, May 19, 2008.
"RoHS Revisited," Application Reference Materials, pp.
1-2,4,6,8,10, July 2008.
"RoHS Revisited," Electronic Products, July 2008.
"RoHS Routes to Compliance," SMART/LEADOUT Lead-Free Implementation
Seminar, Leicestershire, United Kingdom, May 23, 2006.
"RoHS Scope Are you in or out?,"
"RoHS screening service announced," evertiq, Mar. 3, 2005.
"RoHS: "Stakeholders" Plead Their Cases for Exemption," Conformity
, vol. 10 no. 11, pp. 10, Nov. 2005.
"RoHS substances (Hg, Pb, Cr(VI), Cd, PBB and pBDE) in electrical and
electronic equipment in Belgium (Final Report)," Federal Public Service
Health, Food Chain Safety and Environments, Directorate-General Environment,
Brussels, Nov. 2005.
"RoHS Support Service Established," PCB007, Aug. 28, 2006.
"RoHS: the good, the bad and the ugly," Dataweek, vol. xx no.
xx, pp. xx-xx, Apr. 6, 2005.
"RoHS: the good, the bad and the ugly," Electronicstalk,
Mar. 14, 2005.
"RoHS: Third-Party Certification," CircuiTree, vol. 19 no. 4,
pp. xx-xx, Apr. 2006.
"RoHS: Time Running Out to Prepare," Manufacturing Engineer, vol.
82 no. 6, pp. 5, Dec. 2003/Jan. 2004.
"RoHS to obsolete entire catalogues overnight," Dataweek,
vol. xx no. xx, pp. xx-xx, Mar. 24, 2004.
"RoHS Transition Should be a Company-Wide Concern," Lead-Free
Connection, vol. 2 no. 4, pp. 1, Dec. 2005.
"RoHS Troubles Affect Taiwan Industry," Surface Mount Technology Online,
Aug. 22, 2006.
"RoHS uncertainties - is there a light at the end of the tunnel?,"
Components in Electronics, vol. xx no. xx, pp. xx-xx, Nov. 2006.
"RoHS Under Fire for Weak Science," Design News, vol. 61 no.
13, pp. 30, Sept. 25, 2006.
"RoHS Under Review: IPC Urges Commission to Aim for Science-based
Regulations with Thorough Consideration of Life Cycle Impacts,"
PCB007, Jan. 21, 2008.
"RoHS under review - IPC urges commission to aim for science-based regulations
with thorough consideration of life cycle impacts," emsnow,
Jan. 22, 2008.
"RoHS Under Review: IPC Urges Commission to Aim for Science-based Regulations
with Thorough Consideration of Life Cycle Impacts," Tin World
, no. 21, pp. 13, Spring 2008.
"Ron Lasky: A Solder Alloy and Solder Paste Overview," Surface Mount
Technology (SMT), pp. 10,12-14,16, May 2020.
"Round Robin Testing and Analysis of Lead Free Solder Pastes with Alloys of
Tin, Silver and Copper: Final Report,", IPC Solder Products Value Council.
"Round Robin Testing and Analysis of Lead Free Solder Pastes with Alloys of
Tin, Silver and Copper: Phase II DOWN-SELECT and ASSEMBLY REPORT," IPC
Solder Products Value Council.
"RS trusts in Fischer," Finishing, vol. 30 no. 2, pp. 26,
Mar./Apr. 2006.
"Rushing out RoHS help - part one: distribution," SourceESB, Jan. 25,
2006.
"RUWEL AG Offers Numerous Lead-free Alternatives for Circuit Boards,"
PCB007, Sept. 19, 2005.
"Ruwel says advancing on 'green circuit board'," PCB007, Aug.
28, 2003.
"Same Parts, New Numbers?," Electrospec, vol. xx no. xx, pp.
xx-xx. Aug. 12, 2004.
"Satellite Failure Will Hurt Channel One's Second-Quarter Results,"
Electronic Education Report, vol. 5 no. 11, pp. 6-x, June 10, 1998.
"Scientists Research Tin Pest and Whiskers," SMT Web Exclusive Article.
"Scope of UL PCB Silver Task Group," PCB007, Oct. 9, 2006.
"Schwarzenegger Terminates State RoHS Bill," Printed Circuit Design and
Manufacture, vol. 24 no. 11, pp. 10, Nov. 2007.
"Schwarzennegger Vetoes AB 48," IPC Review, vol. 48 no. 9, pp. 7,
Oct./Nov. 2007.
"Second ECTC iNEMI Tin Whisker Workshop," Components, Packaging, and
Manufacturing Technology Society Newsletter, vol. 28 no. 2, pp. 8-9,
June 2005.
"Second European Lead-Free Soldering Technology Roadmap," Soldertec, Feb.
2003.
"Secondary Reflow of Lead-Free Joints," Electronics Manufacture and
Test, vol. xx no. xx, pp. xx-xx, July 1, 2007.
"Selective Finishing: Stannatech The Unique Immersion Tin Process,"
Atotech.
"Self-Declaration of conformance (Example) Version 1,"
Japan Green Procurement Survey Standardization Initiative, Sept. 27, 2005.
"SEMI Regulatory Alert on "China RoHS"," SEMI, Oct. 3, 2006.
"SEMI warns members to take action on China RoHS," Global Sources
, Nov. 14, 2006.
"Separate wash systems for leaded and non-lead boards?," Circuitnet
, Apr. 24, 2006.
"Set of recommendations to help reduce risk of Tin Whiskers,"
evertiq, Dec. 18, 2006.
"Set up for lead-free wave soldering," Circuitnet, Feb. 9,
2009.
"Seven questions to ask your board maker on RoHS," Green SupplyLine
, Sept. 5, 2005.
"Seven Substances Recommended for Inclusion in REACH Authorization List,"
PCB007, Jan. 20, 2009.
"Shaving the Risk of Tin Whiskers," NITON Application Bulletin
, Mar. 17, 2004.
"Shaving the whiskers for lead-free production," European
Semiconductor, vol. 26 no. 11, pp. 17, Nov. 1, 2004.
"Shea Keynote Looks Ahead," SMT Web Exclusive Article.
"Shelf-Life Evaluation of Nickel/Palladium Lead Finish for Integrated
Circuits," Texas Instruments SZZA002, Apr. 1998.
"Should the U.S. employ RoHS-like standards for imported products?,"
Product Design & Development, vol. 63 no. 9, pp. 34-35, Sept.
2008.
"SILVER takes the HASL out of board manufacture," Electronics
Manufacture and Test, vol. xx no. xx, pp. xx, June 2003.
"Since we build to customer spec are we safe from Material Declaration ...,"
Circuitnet, May 15, 2006.
"Sitzung vom 25. October," Berichte der Deutschen Chemischen
Gesellschaft, vol. 2, pp. 540-541, 1869.
"Six RoHS Exemptions Added," SMT Web Exclusive Article.
"SMART Group Lead-Free Soldering Mission to Japan," SMART Group, Feb. 19-23,
2001.
"SMART Group unveils 'Lead-free Experience 4' report," Tin World
, no. 15, pp. 10, 2006.
"SMT Epoxy for lead-free wave soldering," Circuitnet, July
30, 2007.
"Sn-Ag-Cu: key to a lead-free Europe_and world," Control Engineering
, vol. xx no. xx, pp. xx-xx, Feb. 14, 2006.
"Sn-plating in respect to proposed Nemi test conditions," Oct. 29, 2004.
"SN100C Celebrates a Remarkable Milestone," Surface Mount Technology
(SMT), vol. 23 no. 1, pp. 4-5, Jan.-Feb. 2009.
"So, you think you're ready?," Components in Electronics,
vol. xx no. xx, pp. xx-xx, Feb. 2005.
"Solder costs still soaring," Electronics Manufacture and Test
, vol. xx no. xx, pp. xx-xx, Apr. 18, 2007.
"Solder leveled - Hot Air Solder Leveled (HASL)," Electronics
Manufacture and Test, Nov. 17, 2008.
"Solderable Finishes," Electronics Manufacture and Test, vol.
xx no. xx, pp. xx-xx, Jan. 7, 2003.
"Solderability of Tin-Coated Copper," Plating, vol. 52 no. 4, pp.
315-321, Apr. 1965.
"Soldering reliability using SAC 305...," Circuitnet, Apr.
23, 2007.
"Solderability Tests," ST Microelectronics Application Note AN2036, Nov.
2004.
"Soldering Compatibility (Backward and Forward)," ST Application Note
AN2034, Nov. 2004.
"Soldering On," Electronics Times, vol. xx no. xx, pp. xx-xx,
Nov. 20, 2000.
"Soldering Resistance and Moisture Sensitivity Level (MSL) Classification of
STMicroelectronics Lead-Free Devices," ST Microelectronics Application
Note AN2033, Nov. 2004.
"Soldering tips for the 'lead-free' process," Dataweek, vol.
xx no. xx, pp. xx-xx, July 26, 2006.
"Solders come to attention," Environmental Engineering, vol. 13
no. 2, pp. 10, June 2000.
"Solders in Electronics: A Life-Cycle Assessment Summary," United States
Environmental Protection Agency, EPA-744-S-05-001, Aug. 2005.
"Solectron Hosts Environmental Compliance Roundtable," PCB007
, Apr. 15, 2005.
"Solectron Reaches RoHS Goals," Electronic News, Dec. 5,
2005.
"Solutions - and complications - emerge for RoHS directive,"
Manufacturing Business Technology, vol. 23 no. 4, pp. 16, Apr. 2005.
"Some electronics OEMs design out bromine, chlorine from products,"
Purchasing, vol. 138 no. 11, pp. 44-45, Nov. 2009.
"Some Examples of "Whiskers" from Tin-Based Alloys," Tin Whisker Group
teleconference, July 22, 2009.
"Some useful lead-free soldering websites," Dataweek, vol. xx
no. xx, pp. xx-xx, Sept. 20, 2006.
"Sony to recycle electronics for free," Electronics Manufacture and
Test, vol. xx no. xx, pp. xx-xx, Aug. 17, 2007.
"Sound planning prepares the way for Pb-free," Electronics
Manufacture & Test, pp. 9-10, Jan. 2005.
"SPECIFICATIONS To Invitation to Tender DG ENV.G.4/ETU/2006/xxxx."
"Specifying the design rules," Electronic Product Design,
vol. xx no. xx, pp. xx-xx, Jan. 1, 2008.
"Spectrometer measures Pb contamination," Dataweek, vol. xx
no. xx, pp. xx-xx, July 28, 2004.
"Speedline Completes Study on Lead-free Process Optimization,"
Advanced Packaging, Aug. 29, 2005.
"Speedline Technologies Launches Web Site as Resource on Lead-Free SMT
Manufacturing," PCB007, Apr. 5, 2005.
"Spotlight on Pb-free alternatives," Electronics Manufacture and
Test, vol. xx no. xx, pp. xx-xx, July 11, 2008.
"Stakeholder Consultation on Adaptation to Scientific and Technical Progress
Under Directive 2002/95/EC for the Purpose of a Possible Amendment of the
Annex," AeA EICTA, July 5, 2004.
"Stakeholder consultation on Adaptation to scientific and technical progress
under Directive 2002/95/EC of the European Parliament and of the Council on
the restriction of the use of certain hazardous substances in electrical and
electronic equipment for the purpose of a possible amendment of the annex,"
(The first consultation period ended July 5, 2004.)
"Stakeholder consultation on Adaptation to scientific and technical progress
under Directive 2002/95/EC of the European Parliament and of the Council on
the restriction of the use of certain hazardous substances in electrical and
electronic equipment for the purpose of a possible amendment of the annex,"
(The second consultation period ended Feb. 11, 2005.)
"Stakeholder consultation on Adaptation to scientific and technical progress
under Directive 2002/95/EC of the European Parliament and of the Council on
the restriction of the use of certain hazardous substances in electrical and
electronic equipment for the purpose of a possible amendment of the annex,"
(The third consultation period ended Oct. 28, 2005.)
"Stakeholder consultation on Adaptation to scientific and technical progress
under Directive 2002/95/EC of the European Parliament and of the Council on
the restriction of the use of certain hazardous substances in electrical and
electronic equipment for the purpose of a possible amendment of the annex,"
(The fourth consultation period ended Feb. 10, 2006.)
"Stakeholder consultation on Adaptation to scientific and technical progress
under Directive 2002/95/EC of the European Parliament and of the Council on
the restriction of the use of certain hazardous substances in electrical and
electronic equipment for the purpose of a possible amendment of the annex,"
(The fifth consultation period ended May 15, 2006.)
"Stakeholder consultation on Adaptation to scientific and technical progress
under Directive 2002/95/EC of the European Parliament and of the Council on
the restriction of the use of certain hazardous substances in electrical and
electronic equipment for the purpose of a possible amendment of the annex,"
(The sixth consultation period ended Jan. 10, 2007.)
"Standard Addresses Environmental Issues with Computers," Nuts and Volts
, pp. 10, June 2006.
"Standard Released for Worse Case Thermal Limits," Surface Mount
Technology (SMT), vol. 22 no. 10, pp. 8, Oct. 2008.
"Standard Specification for Electrodeposited Coatings of Tin", ASTM Standard
B 545 - 97, West Conshohocken, PA: American Society for Testing and Materials,
1997.
"Standardizing RoHS materials declaration," Apr. 1, 2005.
"Standards aim to reduce the risk of tin whiskers," Test &
Measurement World, vol. 26 no. 4, pp. xx-xx, May 4, 2006.
"Standards aim to reduce the risk of tin whiskers," Test &
Measurement World, vol. 26 no. 5, pp. 12, June 2006.
"Standards for Compliance Documentation," Design News, vol.
60 no. 10, pp. xx, July 18, 2005.
"Steady As It Goes: IPC Hosts Executive Market and Technology Forum in
Hong Kong," IPC Review, vol. 47 no. 6, pp. 12-13, July 2006.
"Stencil Apertures and Board Finish Requirements," Circuitnet
, May 5, 2008.
"Step-by-Step Guide to Compliance with the RoHS Directive."
"Stop the HOP," Circuits Assembly, vol. 19 no. 8, pp. 33,
Aug. 2008.
"Storagetek's RoHS/WEEE Projects," Oct. 19. 2004.
"Study Reveals State of RoHS-Compliance in China," Printed Circuit Design
and Manufacture, vol. 24 no. 1, pp. 8, Jan. 2007.
"Subject: Harmonization of national producer registers," EICTA, May 31,
2006.
"Subject: Impact of REACH on downstream users," AeA, ceced, EICTA, EECA
ESIA, Nov. 23, 2006.
"Surface-Mount Device Assembly: Electrically Conductive Adhesive May Replace
Solder," Circuits Assembly, vol. 11 no. 4, pp. 82, Apr. 2000.
"Summary of Data on Municipal Solid Waste Landfill Leachate Characteristics -
"Criteria for Municipal Solid Waste Landfills" (40 CFR Part 258),"
(U. S.) Environmental Protection Agency EPA/530-SW-88-038, PB88-242441, July
1988.
"Supplier Summit Confronts Status of RoHS Conversion," SourceESB, Nov. 29,
2006.
"Supply change management key to RoHS compliance," Electronics
Manufacture and Test, vol. xx no. xx, pp. xx, Sept. 2004.
"Surface Finish Options," Data Circuit Systems, May 2002.
"Surface Finish Options," Merix, Aug 2002.
"Surface Finishing for Printed Circuit Boards," Teledyne Electronic
Technologies.
"Survey Finds 83 Percent of Manufacturers at High to Severe Risk of Not Being
Able to Track, Document and Report on RoHS Compliance," PCB007
, Aug. 4, 2006.
"Survey Response Tools Ver. 3 Operation Manual, Second Edition," Japan
Green Procurement Survey Standardization Initiative, June 9, 2006.
"Survey Shows Europe Mostly Ready for RoHS," Design News,
vol. 61 no. 6, pp. xx, Apr. 24, 2006.
"Survey shows skepticism on national E-waste agreement," Connector
Specifier, vol. 21 no. 2, pp. xx-xx, Feb. 2005.
"Survey shows slow RoHS compliance," Purchasing, vol. xx no.
xx, pp. xx-xx, Oct. 6, 2006.
"Susceptibility to "Tin Pest"," Nihon Superior.
"Sustainable design: not just for architecture any more," Green
SupplyLine, Mar. 16, 2007.
"Switch makers deal with RoHS," Purchasing, vol. xx no. xx,
pp. xx-xx, Feb. 23, 2006.
"Switch Tips: Lead-free solders and electromechanical switches," Machine
Design.
"Switching to Unleaded," Printed Circuit Fabrication, vol. 23 no.
6, pp. 24, June 2000.
"Symposium on Tin and Tin Alloy Coatings," Tin and its Uses, no.
117, pp. x-x, 1978.
"TAC votes on RoHS Exemptions."
"Tackling e-waste in Africa," Dataweek, Apr. 1, 2009.
"Taiwan Inspects for RoHS Compliance," Design News, vol. 61
no. 3, pp. xx, Feb. 27, 2006.
"Taiwan Prepares for RoHS," PCB007, Mar. 31, 2005.
"Taiwanese Electronics Sector Faces RoHS Test," CENS.com,
July 30, 2006.
"Taiwanese IT Manufacturers Detected Not Compliant With RoHS,"
Taiwan Economic News, Aug. 22, 2006.
"Taiwanese LCD-TV Suppliers Make Themselves RoHS Compliant,"
CENS.com, July 31, 2006.
"Taiwanese Manufacturers Move to Comply With EuP Directive,"
CENS.com, Oct. 19, 2006.
"Taiwanese Tool Makers Turn to Eco-Friendly Products to Meet RoHS
Requirements," CENS.com, Sept. 25, 2006.
"Taiwan`s IT and Electronics Industries Go Green," CENS.com,
Oct. 26, 2004.
"Taiwan`s Production of Electronic Components To Grow 9% in 2005,"
CENS.com, Sept. 8, 2005.
"Taiwan`s Production of Electronic Components To Grow 9% in 2005,"
CENS.com, Aug. 4, 2005.
"Taking responsibility, tapping opportunity: How will consumer elecxtronics
companies respond to WEEE mandate?," IBM Business Consulting Services.
"Tax credits for RoHS implementation," Electronics Manufacture and
Test, vol. xx no. xx, pp. xx-xx, Mar. 17, 2008.
"TBBPA Risk Assessment Concluded," PCB007, Sept. 19, 2007.
"TBBPA unlikely to be banned under RoHS," Dataweek, Feb. 18,
2009.
"Tech Tips... Identifying Counerfeit Components," empfasis,
pp. xx-xx, Nov. 2007.
"Tech Tips... Implementing Lead-Free Soldering," empfasis,
pp. xx-xx, Sept. 2002.
"Technic Announces Surface Oxidation Reduction Patent," CircuiTree
, vol. 19 no. 3, pp. xx-xx, Mar. 2006.
"Technical Service Bulletin: Tin Whiskers in MOD10 Relays." GE Power
Management, MOD10 SB1-00.03.27, Mar. 27, 2000.
"Technical Support to the National Highway Traffic Safety Administration
(NHTSA) on the Reported Toyota Motor Corporation (TMC) Unintended Acceleration
(UA) Investigation, Version 1.0." NASA, Jan. 18, 2011.
"Technology provides the key to WEEE," LAWE, vol. xx no. xx,
pp. xx-xx, Jan. 2003.
"TechSearch Int'l Study Finds Embedded Components to be Most Significant
Developments," Circuitnet, Feb. 7, 2008.
"Tell DTSC That Green Chemistry Initiative Is the Wrong Approach, Participate
in EPA Public Workshop," CircuiTree, vol. 21 no. 4, pp.
xx-xx, Apr. 2008.
"Test Strategy considerations for lead-free," Agilent Technologies
Lead-free Seminar Part II.
"Texas Instruments' RoHS 'Gold' Aids Customers in RoHS Transition,"
CircuiTree, vol. 18 no. 8, pp. xx-xx, Aug. 2005.
"Texas of USA - Proposal of Electronic Equipment Waste Management,"
Intertek Labtest Sparkle, vol. 192, Feb. 2005.
"Tg and Td for lead free process," Circuitnet, Jan. 7, 2008.
"The Challenges Facing Lead-Free Soldering," Electroline, 2000.
"The Clock is Ticking... How Far Are You from the Finish Line?,"
Lead-Free Connection, vol. 2 no. 1, pp. 1, Jan. 2005.
"The Contagious Diseases of Metals," Scientific American, vol.
102 no. 26, pp. 517-518, June 25, 1910.
"The E. U. Environmental Directives," Innovation, no. 36, pp.
13-14, July 2004.
"The Effect of Voiding in Solder Interconnections Formed from Lead Free Solder
Pastes with Alloys of Tin, Silver and Copper," IPC Solder Products Value
Council.
"The Effects of Lead on Lead-Free Electronics Assembly," AIM.
"The Electrodeposition of Tin," The Brass world and Platers Guide
, vol. 3 no. 9, pp. 296, Sept. 1907.
"The Emergence of Information Technology (IT) Waste," The Gallon
Environment Letter, vol. 6 no. 31, dec. 19, 2002.
"The end of leaded commercial parts: Part 1," SourceESB, Apr. 19, 2006.
"The end of leaded commercial parts: Part 2," SourceESB, May 3, 2006.
"The EU's RoHS and WEEE Directives: The EU Commission Offers Guidance on these
Important Directives," Conformity, vol. 11 no. 1, pp. 10,
12-17, Jan. 2006.
"The Experts look at the issues," Chip Scale Review, vol. xx
no. xx, pp. xx-xx, Jan.-Feb. 2000.
"The Facts about Tin Whiskers," Electronic Components, Assemblies &
Materials Association, EIA/ECA-CB19, Aug. 2004.
"The Failure of Tin Beer Cooling Coils," Tin and its Uses, no. 3,
pp. 13, Oct. 1939.
"The Fusing of Wires and Tin Whiskers," Tin Whisker Group teleconferences,
Apr. 22, 2009 and Apr. 29, 2009.
"The government is not doing enough on RoHS," Electronics World,
vol. 111 no. 1834, pp. 5, Oct. 2005.
"The Growth of Tin Whisker," Samsung.
"The Hidden Challenges of Manufacturing Lead-free Elelctronics," Analog
Zone.
"The Interview - AIM President Rick Black in conversation with the editor,"
Tin World, no. 14, pp. 8-9, 2006.
"The Interview - Colin Longworth of solder producer DKL Metals talks to Tin
World," Tin World, no. 15, pp. 6-7, 2006.
"The IPC-1750 Series - A family of supplier declaration standards,"
emsnow, June 13, 2005.
"The iPhone's hazardous chemicals," evertiq, Oct. 17, 2007.
"The Joint Industry Guide (JIG) and Actions to Be Taken by the JGPSSI,"
Japan Green Procurement Survey Standardization Initiative (JGPSSI), May 26,
2005.
"The Latest in BGA Implementation Strategy," IPC-7095 Revision A Oct.
2004.
"The lead-free debacle threatens the industry - for nothing!,"
emsnow, Nov. 12, 2004.
"The Lead-Free Electronics Assembly Implementation Handbook," AIM, 2004.
""The measurement of creep rates and stress relaxation for micro-sized
lead-free solder joints"," Soldering & Surface Mount Technology
, vol. 17 no. 4, pp. xx-xx, 2005.
"The Mechanism of Ag2S Formation," Product Engineering & Quality
, Oct. 2002, pp. xx-xx.
"The Need for Lead-Free and Green Semiconductor Packages," TDK.
"The New Tin-Nickel Alloy Electroplate," Tin and its Uses, no.
25, pp. 9, Dec. 1951.
"The Pb-Free Control Plan," Printed Circuit Design and Fab/Circuits
Assembly, vol. 29 no. 8, pp. 40, Aug. 2010.
"The PDX Standard: Used for Material Declaration," IPC.
"The problem of 'tin whiskers' cannot be neglected," Dataweek
, vol. xx no. xx, pp. xx-xx, July 28, 2004.
"The Program Manager's Guide to Pb-Free," Circuits Assembly,
vol. 17 no. 3, pp. 50-51, Mar. 2006.
"The Reballing Process," Printed Circuit Design and Fab/ Circuits
Assembly, vol. 27 no. 9, pp. 46, Sept. 2010.
"The Relation between Whisker and Stress," Hynix Semiconductor.
"The RoHS Directive Implementation," European Organization for Conformity
Assessment (EOTC).
"The rush to RoHS compliance," Purchasing, vol. xx no. xx, pp.
xx-xx, Mar. 16, 2006.
"The SAC-SnPb Dilemma," Circuits Assembly, vol. 19. no. 6,
pp. 34, June 2008.
"The Spread of RoHS," IPC Review, vol. 47 no. 8, pp. 12-13, Sept.
2006.
"The Spread of RoHS," Route, Sept. 2006.
"The Transition to Lead-Free: Lead Free Soldering and the 5DX," 5DX
User Group Meeting, Loveland, CO, Mar. 2005.
"The Trend to Tin-Zinc Coatings," Tin and its Uses, no. 59, pp.
12-13, 1963.
"The Waste Electrical and Electronic Equipment (WEEE) and Restriction of
certain Hazardous Substances in electrical equipment (ROHS) Directives:
Responses to the Discussion paper of 28 March 2003: Executive summary and
comment," Department of Trade and Industry, July 2003.
"The Waste Electrical and Electronic Equipment (WEEE) directive - impacts on
it disposal, re-use and recycling," Dec. 3, 2004.
"The Waste Electrical and Electronic Equipment (WEEE) directive - impacts on
it disposal, re-use and recycling," Dec. 17, 2004.
"The WEEE directive could be helped with protocols," Electronics World
, vol. 112 no. 1837, pp. 7, Jan. 2006.
"There's more to Pb-free production than just a Pb-free product," 2006
11th International Symposium on Advanced Packaging Materials: Processes,
Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 149.
"Thermal Analysis of Lead-Free Solder."
"Thermal cycling test of tin-bismuth and tin plating," Ishihara Chemical
Co., 2008.
"Thermisches Spritzen - eine attraktive Erganzung zum Hartverchromen,"
Galvanotechnik, vol. xx no. xx, pp. 3002-3003, Dec. 2007.
"Three organizations from US, Europe, Japan cooperating to develop tin whisker
test method," PCB007, July 18, 2003.
"Think about disposal during design," Electronics Manufacture and
Test, vol. xx no. xx, pp. xx-xx, Sept. 7, 2006.
"THINK you are lead-free? Prove it," Electronics Manufacture and
Test, pp. xx-xx, Mar. 2006.
"TI offers "Gold"," Purchasing, vol. xx no. xx, pp. xx-xx,
Sept. 15, 2005.
"Time for a U.S. RoHS Law? Poll Respondents Say Yes by 2-to-1,"
Supply & Demand Chain Executive, vol. xx no. x, pp. xx-xx, xxxx.
"Tin Against Corrosion," Tin and its Uses, no. 41, pp. 9-10,
Winter 1957.
"Tin-Antimony Equilibrium Diagram," Tin and its Uses, no. 51, pp.
8-9, 1961.
"Tin as Semiconductor," Science News Letter, vol 58 no. 8, pp.
118, Aug. 19, 1950.
"Tin-Bismuth Melt-Out Cores for Tennis Racket Frame," Tin and its Uses
, no. 129, pp. 15-16, 1981.
"Tin-Cobalt Alloy Plating," Tin and its Uses, no. 121, pp. x,
1979.
"Tin disease, organ pipes and Napoleonic buttons," Advanced Materials
& Processes, vol. 162 no. 4, pp. 51, Apr. 2004.
"Tin in Modern Technology 2: Soldering," Tin and its Uses, no.
90, pp. 3-5, 1971.
"Tin-lead and no-lead compatibility issues," Circuitnet,
Oct. 20, 2008.
"Tin lead soldering of lead free components," Circuitnet,
Oct. 30, 2006.
"Tin-Nickel - A Pre-stressed Coating," Tin and its Uses, no. 58,
pp. 14, 1963.
"Tin-Nickel Alloy Plating Current Progress," Tin and its Uses,
no. 28, pp. 10-11, June 1953.
"Tin-Nickel Alloy Plating Does Not Grow Whiskers in Five Years," Tin and
its Uses, no. 64, pp. 15, 1964.
"Tin-Nickel on Watches and Drawing Instruments," Tin and its Uses
, no. 44, pp. 1-3, Autumn 1958.
"Tin-Nickel Plating for Railway Signal Relays," Tin and its Uses,
no. 51, pp. 6, 1961.
"Tin Nickel Plating Today," Tin and its Uses, no. 102, pp. 3-5,
1974.
"Tin-Nickel versus Metal "Whiskers"," Tin and its Uses, no. 52,
pp. 8, 1961.
"Tin "Noodles"???."
"Tin Pest," finishing.com.
"Tin Pest," Nihon Superior.
"Tin plating for very cold environments; alloying to avoid tin pest,"
finishing.com
"Tin/Silver/Copper Solder Increases Voids," Design News, vol.
61 no. 4, pp. xx, Mar. 20, 2006.
"Tin Structures."
"Tin Technology Ltd. granted UKAS accreditation for chemical tests in support
of the RoHS and WEEE Directives," Tin World, no. 19, pp. 14,
Autumn 2007.
"Tin touted as lead replacement in machining steel," Purchasing
, vol. xx no. xx, pp. xx-xx, Sept. 2, 1999.
"Tin Whisker Acceptance Test Requirements," NEMI Tin Whisker Users Group,
July 28, 2004.
"Tin Whisker Experience - Rocket Motor Initiator Failure Analysis."
"Tin Whisker Experiences," June 19, 2002.
"Tin Whisker Growth Evaluation Results," Kemet, Mar. 30, 2004.
"Tin Whisker Imagery," empfasis, pp. 9, Apr. 2009.
"Tin Whisker Info "Brief"," On Semiconductor Application Note TND311, May
2003.
"Tin Whisker Migration on New and Stored Parts," Printed Circuit
Design and Fab/ Circuits Assembly, vol. 29 no. 3, pp. 36-37, Mar. 2012.
"Tin Whisker Mitigation & Conformal Coating," Surface Mount
Technology (SMT), vol. 28 no. 2, pp. 57, Feb. 2013.
"Tin Whisker Qualification and Reliability Testing," Printed Circuit
Design and Fab/ Circuits Assembly, vol. 28 no. 10, pp. 37,39, Oct.
2011.
"Tin Whisker References."
"Tin Whisker Specs Defined," Metals and Interconnects, vol. 18
no. 7, pp. xx, Aug. 2004.
"Tin Whisker User Group Publishes Updated Set of Recommendations Help Reduce
Risk of Tin Whiskers," PCB007, Dec. 15, 2006.
"Tin Whiskering Borders on Urban Legend," Design News, vol.
60 no. 11, pp. xx, Aug. 15, 2005.
"Tin Whiskers," Electronics Manufacture and Test, vol. xx no.
xx, pp. xx-xx, Dec. 7, 2003.
"Tin Whiskers," Sept. 14, 2004.
"Tin Whiskers," Circuitnet, May 14, 2007.
"Tin Whiskers 2012," 3rd Electronic Materials and Assembly Processes
for Space (EMPS) Workshop, Genova, Italy, Mar. 21, 2012.
"Tin whiskers a problem with immersion tin pwb finishes? ,"
finishing.com.
"Tin Whiskers and Conversion to Pb-Free," Circuits Assembly,
vol. 16 no. 12, pp. 38-40, Dec. 2005.
"Tin Whiskers: Companies Taking Cover Under iNEMI Guidelines,"
Design News, vol. 60 no. 12, pp. xx, Sept 5, 2005.
"Tin whiskers in electronic," finishing.com.
"Tin whiskers on printed circuit boards: Consequences for safety components in
machine construction," IFA, May 2014.
"Tin whiskers - reducing the risk," LiveWire, no. 15, pp.
xx-xx, Feb./Mar. 2005.
"Tin "Whiskers" Studied at Very Low Temperature," The Science
News-Letter, vol. 67 no. 21, pp. 326, May 21, 1955.
"Tin Whiskers Syfer Surface Mount Capacitors," Syfer Application Note
AN0019 Issue 3.
"Tin wisker might delay RoHS schedule," Industry News, vol.
xx no. xx, pp. xx-xx, Mar. 18, 2005.
"Tin-Zinc-Coated Steel Tubes Challenge Copper for Central Heating," Tin
and its Uses, no. 78, pp. 12, 1968.
"Tin-Zinc Coatings," Tin and its Uses, no. 17, pp. 5-8, 14, Oct.
1946.
"Tin-Zinc Plating Grows Up," Tin and its Uses, no. 29, pp. 9,
Sept. 1953.
"Tinning no lead soldered wires with leaded solder," Circuitnet
, Aug. 28, 2006.
"TI's RoHS 'Gold' Aids Customers in RoHS Transition," PR Newswire
, Aug. 15, 2005.
"Titanium Wave Solder Upgrades from NEA," PCB007, July 3,
2006.
"TO-220 Lead Free and RoHS Compliance Document," International Rectifier.
"To the Attention of the members of the EU Technical Adaptation Committee
(TAC) on WEEE/ROHS," EICTA, Feb. 13, 2006.
"To the Attention of the members of the EU Technical Adaptation Committee
(TAC) on WEEE/ROHS," EICTA, Mar. 7, 2006.
"Tombstone problems," Circuitnet, Nov. 5, 2006.
"Tombstone Troubleshooting," PCB007, Sept. 29, 2005.
"Toshiba Announces Website With Information on RoHS-Compatible and
Lead(Pb)-Free Products," PCB007, Aug. 17, 2005.
"Total Parts Plus Increases RoHS Data Coverage," June 22, 2005.
"Total Parts Plus Increases RoHS Data Coverage," PCB007, June
23, 2005.
"Towards a RoHSy future, the final furlong," Electronics Manufacture
and Test, vol. xx no. xx, pp. xx-xx, June 7, 2006.
"Toxic and Hazardous Materials in Electronics," Five Winds International,
Oct. 2001.
"Toxic Chemicals Can Keep Products Off the Shelves," GreenBiz.com.
"Toxicological Review of Hexavalent Chromium," U. S. Environmental
Protection Agency, Aug. 1998.
"Trace Laboratories-Central Announces Their New Tin Whisker Testing Program
(iNEMI-Specified),"
"Trade alliance launches RoHS/WEEE services," evertiq, Mar.
18, 2006.
"Trade Groups Agree to 2005 Lead Ban Plan," Printed Circuit Design
, vol. 20 no. 2, pp. 7, Feb. 2003.
"Transformation of Tin," Tin and its Uses, no. 14, pp. 14, May
1943.
"Transition to RoHS: The Seven Common Pitfalls to Avoid," Arena Solutions
& Symphony Consulting, 2005.
"Transitioning to Lead (Pb)-Free Manufacturing with Toshiba Semiconductor
Products," Toshiba America Electronic Components, Aug. 2004.
"Transitioning to Lead(Pb)-Free Manufacturing with Toshiba Semiconductor
Products," Toshiba America Electronic Components, Sept. 2005.
"Transposition of the WEEE and RoHS Directives in Other EU Member States:
January 2005," Perchards, Jan. 2005.
"Transposition of the WEEE and RoHS Directives in Other EU Member States:
July 2005," Perchards, July 2005.
"Transposition of the WEEE and RoHS Directives in Other EU Member States:
November 2005," Perchards, Nov. 2005.
"Transposition of the WEEE Directive in Other EU Member States,"
Perchards, Nov. 2003.
"Transposition of the WEEE Directive in Other EU Member States: September
2004," Perchards, Sept. 2004.
"Transposition of the WEEE Directive in Other EU Member States: January
2005," Perchards, Jan. 2005.
"Trivalent Chrome - A Real Alternative," Finishing, vol. 7 no.
10, pp. 20-22, Oct. 1983.
"Trivalent Chromium Plating for a Safer Workplace & Environment,"
Transactions of the Institute of Metal Finishing, vol. 80 no. 2, pp.
B10-B12, Mar. 2002.
"Trivalent chromium: the second generation," Finishing Industries
, vol. 1 no. 8, pp. 3, Aug. 1977.
"Trojan urges WEEE compliance not denial," Electronics Manufacture
and Test, vol. xx no. xx, pp. xx-xx, Sept. 9, 2008.
"Tug-of-War Over Halogen-Free Issue," PCB007, May 22, 2008.
"TV manufacturing industry urges rethink on EU Waste Directive,"
PCB007, Oct. 24, 2001.
"TW System Failures," NAVSEA, Apr. 3, 2005.
"Two years to lead free," Manufacturing Engineer, vol. 83 no. 4,
pp. 7, Aug./Sept. 2004.
"Tyco Electronics Material Declaration Strategy," Tyco Electronics, Sept.
20, 2004.
"Typical Analyses of Various Brands of Tin," Tin and its Uses,
no. 27, pp. 6-7, Nov. 1952.
"Typical Tin Analyses," Tin and its Uses, no. 77, pp. 8-9, 1968.
"U.K. Outlines WEEE Implementation," SMT Web Exclusive Article.
"U.K. Prepares WEEE Roadmap," SMT Web Exclusive Article.
"U.N.: Europe can do more to recycle electronic waste," EE Times
, vol. xx no. xx, pp. xx-xx, Nov. 15, 2007.
"U.S. Guidelines Tout National E-recycling," SMT Web Exclusive Article.
"U. S. Weighs In on Domestic RoHS," Surface Mount Technology (SMT)
, vol. 20 no. 11, pp. 12, Nov. 2006.
"U.S Worries but UK Offers Solutions to the WEEE Directive Compliance on
E-Waste Disposal," Feb. 22, 2005.
"UCLA Department of Materials Science and Engineering."
"UK delays rollout of EU waste law," Financial Times Information
, Apr. 7, 2005.
"UK - DTI update on RoHS and WEEE - Thursday 24th March 2005," Mar. 24,
2005.
"UK Manufacturers set up recycling company," emsnow, Jan. 19,
2004.
"UK Meets WEEE Collection Target," Manufacturing Engineer, vol 82
no. 4, pp. 6, Aug./Sept. 2003.
"UK postponed implementation date for WEEE until June 2006,"
evertiq, Aug. 11, 2005.
"UK RoHS Enforcement Agency Decided," Conformity, vol. 10 no.
11, pp. 48, Nov. 2005.
"UK RoHS Enforcement Agency Decided," Conformity, pp. 213,
Conformity 2006: The Annual Guide.
"UK Site Offers Due Diligence," Design News, vol. 61 no. 2,
pp. xx, Feb. 6, 2006.
"UK Takes Lead on Lead-Free Soldering," Printed Circuit Fabrication
, vol. 23 no. 2, pp. 6, Feb. 2000.
"UL Affirms Acceptance of Immersion Silver Circuit Board Finishes,"
Circuitree, vol. 19 no. 10, pp. xx-xx, Oct. 2006.
"UL Program Helps in Meeting EU RoHS Compliance,"Wire & Cable
Technology International, vol. 33 no. 3, pp. 70, May/June 2005.
"UL program offers help for RoHS compliance," Green SupplyLine
, Nov. 17, 2004.
"UL's New Services for Restricted Substances Help OEMs and Manufacturers
Self-declare Compliance to RoHS," PCB007, Dec. 11, 2006.
"UN Models Task Force on WEEE," SMT Web Exclusive Article.
"Unawareness of recent UK Ban," evertiq, Sept. 13, 2004.
"Understanding RoHS: What it Means to U.S. Manufacturers," Shimadzu.
"Unofficial note of the Technical Adaptation Committee on the WEEE & RoHS
Directives: Brussels, 10 December 2004," Dec. 10, 2004.
"Update of Global Trends in Lead-Free Soldering," SMTA International
Conference, Chicago, IL, Sept. 26-29, 2004, pp. xx-xx.
"Update on WEEE and RoHS," Cookson Electronics, Apr. 2005.
"Updated Surface Insulation Resistance Testing Vital for Mission-critical
Electronic Assemblies Manufactured with Lead-free Alloys," PCB007
, Oct. 3, 2006.
"US Electronics Industry is in Real Trouble," PCB007.
"US group has lead-free code," Electronics Weekly, June 14,
2004.
"US House Bill Proposes to Ban Common Elements,"
"USA - State-Level Programmes for Electrical/Electronic Products Continue to
Proliferate," Sept. 11, 2006.
"Using Focused Infra-Red To Simplify Lead-Free BGA Rework," evertiq
, Apr. 12, 2006.
"Using Focused Infra-Red To Simplify Lead-Free BGA Rework," PCB007
, Apr. 12, 2006.
"Using non-RoHS components in RoHS process," Circuitnet, Apr.
16, 2007.
"Using tin-lead solder on RoHS parts," Circuitnet, June 11,
2007.
"Vapor Phase Fusion of Pure Tin Electroplate," Solid State Technology
, vol. 26 no. 3, pp. 141-142, Mar. 1983.
"Vapour Phase Perfect for Pb-free soldering!?," LEADOUT Hands On
Lead-Free Workshop, Manchester, United Kingdom, June 21, 2006.
"VCA Will Enforce WEEE in U.K.," SMT Web Exclusive Article.
"Verifying RoHS compliance," Products Finishing, vol. 70 no.
11, pp. 64, Aug. 2006.
"Verizon NEBS(TM) Compliance: Qualification Requirements for Printed Board
Assemblies Manufactured with Lead-Free Solder for use in Telecommunications
Equipment," Verizon Technical Purchasing Requirements VZ.TPR.9307 issue 1,
Sept. 2009.
"Victor Japan using Sn-Zn-system, lead-free solder in business printers since
April," PCB007, Sept. 16, 2002.
"Voids in BGA's," Circuitnet, Nov. 5, 2007.
"Voids in leadless packages," Circuitnet, Aug. 18, 2008.
"Wave soldering lead-free components," Circuitnet, Nov. 27,
2006.
"Wave Soldering Problems," Circuitnet, Aug. 11, 2008.
"Wear Resistance of Tin-Nickel Electroplate," Tin and its Uses,
no. 54, pp. 4, 1962.
"WEEE & RoHS Directives Update," Intertek Labtest Sparkle
, vol. 188, Feb. 2005.
"WEEE & ROHS... Preparing for the Future."
"WEEE breathing space for suppliers," evertiq, Mar. 31, 2005.
"WEEE - Commission Issues Reporting Guidelines For Member States,"
Conformity, vol. 10 no. 7, pp. 44, July 2005.
"WEEE deadline delayed in UK," evertiq, Jan. 12, 2006.
"WEEE Directive Forces Reduction in the Variety of Plastics Used In Electrical
and Electronic Equipment," PCB007, Sept. 21, 2005.
"WEEE Directive - Is Your Business Prepared?," PRWeb, Mar.
23, 2005.
"WEEE Directive Update," Intertek Labtest Sparkle, vol. 180,
Aug. 2004.
"WEEE Forum Guidance Document," WEEE Forum.
"WEEE Forum Questions and Answers," WEEE Forum.
"WEEE help available," Purchasing, vol. xx no. xx, pp. xx-xx,
Sept. 1, 2005.
"WEEE help from t2e," Electronics Manufacture and Test, vol.
xx no. xx, pp. xx-xx, Mar. 10, 2008.
"WEEE implementation put back - but you still have to mark mouldings from
August," British Plastics & Rubber, pp. 34, Apr. 2005.
"WEEE Official in EU," SMT Web Exclusive Article.
"WEEE reminder," Tin World, no. 17, pp. 8, Spring 2007.
"WEEE review in the U.K.," Electronics Supply & Manufacturing
, May 2006.
"WEEE review in the U.K.," Green SupplyLine, May 1, 2006.
"WEEE/RoHS Directives Implementation: Part I - Overview," Department of
Trade and Industry.
"WEEE/RoHS Directives Implementation: Part II - WEEE Directive
Implementation," Department of Trade and Industry.
"WEEE/RoHS Directives Implementation: Part III - WEEE/RoHS Directives
Implementation," Department of Trade and Industry.
"WEEE - RoHS Impact on Passive Components," NIC Components.
"WEEE/RoHS Info/Links," Conformity, vol. 10 no. 10, pp.
10-11, Oct. 2005.
"WEEE/ROHS Update," Conformity, vol. 10 no. 11, pp. 8, Nov.
2005.
"WEEE rule to push up production costs of Taiwanese electronics suppliers,"
CENS.com, Jan. 10, 2005.
"WEEE Update in Major Economies: UK, France, Germany, Italy,"
Conformity, vol. 10 no. 11, pp. 10, 48, Nov. 2005.
"WEEE Update in UK, France, Germany and Italy," Conformity, pp.
213, Conformity 2006: The Annual Guide.
"WEEE, WEEE, WEEE all the way to eBay," evertiq, Apr. 19,
2006.
"WEEE yields more lightweight, modular devices," Global Sources
, July 11, 2006.
"Wetting," Electronics Manufacture and Test, vol. xx no. xx,
pp. xx-xx, Dec. 7, 2006.
"Wetting Problem SAC finished component," Circuitnet, July
28, 2008.
"What are some cost implications of lead-free conversion?,"
Circuitnet, Mar. 23, 2006.
"What Are Tin Whiskers?"
"What are Tin Whiskers?."
"What challenges does the military/aerospace industry face?,"
Electronic Products, vol. xx no. xx, pp. xx-xx, Mar. 2006.
"What happens to leaded parts after RoHS?," SourceESB, July 13, 2005.
"What is horizontal convection reflow technology?," Dataweek,
vol. xx no. xx, pp. xx-xx, Feb. 21, 2007.
"What is Pb-free?," Electronics Manufacture and Test, vol. xx
no. xx, pp. xx-xx, May 7, 2004.
"What is the permissible limit of Cu in Pb-Sn solders?," Connect
, vol. xx no. xx, pp. xx-xx, 2000.
"What is Tin Pest and how does it occur?," LiveWire, no. 11,
pp. xx-xx, Nov./Dec. 2003.
"What type of cleaner method is preferred for lead-free stencils?,"
Circuitnet, July 17, 2006.
"What You Need to Know About ACPEIP (China RoHS)," evertiq,
Jan. 23, 2007.
"What's industry's best lead free solder?," evertiq, July 5,
2005.
"What's Inside Your PC?."
"What's Next After RoHS?," IPC Review, pp. 19, 22, Sept. 2005.
"What's RoHS' cost?," Purchasing, vol. xx no. xx, pp. xx-xx,
Sept. 29, 2005.
"Wheelie bin symbol", Feb. 11, 2005.
"When Electronics Get Five O'Clock Shadow," Jan. 5, 2005.
"When is oven drying mandatory," Circuitnet, Sept. 27, 2009.
"Where to Go for Green," EDN, vol. 53 no. 21, pp. S12-S13,
Oct, 2008.
"Whisker control plating process YWL SYSTEM," Yuken.
"Whisker Formation on Tin Plated Cu based Leadframes: Results and
Conclusions," Oct. 29. 2004.
"Whisker Formation on Tin Plated FeNi42: Results and Conclusions," Oct.
29, 2004.
"Whisker Formation Test Report," Phoenix Passive Components.
"Whisker-free Tin Coatings for Electronic Components," Tin and its Uses
, no. 74, pp. 5, 1967.
"Whisker Woes," Air Safety Week, vol. 18 no. 45, pp. xx-xx,
Nov. 22, 2004.
"Whiskers Can't Be Eliminated," Design News, vol. 61 no. 9,
pp. xx, June 26, 2006.
"Whiskers on Monitor PCBs," Center for Advanced Life Cycle Engineering,
Sept. 5, 2008.
"Whiskers on USB housing of PC Mother Board," Center for Advanced Life
Cycle Engineering, Sept. 5, 2008.
"Whitepaper (Draft)," Pb-Free Electronics Risk Management (PERM)
Consortium, Aug. 17, 2009.
"Whitepaper," Pb-Free Electronics Risk Management (PERM) Consortium, Dec.
2009.
"Who is taking the lead?," Electronic Product Design, vol. 25 no.
6, pp. 35-36, June 2004.
"Why Lead-free?," Almit.
"Widespread Reporting Error Surrounding BSEF," PCB007, Jan.
17, 2006.
"Will Discoloration Tarnish ImAg Reliability?," Circuits Assembly
, vol. 20 no. 2, pp. 28, Feb. 2009.
"Will electronic equipment fail from tin-whisker shorts?," SourceESB, Feb.
9, 2005.
"Will Plasma panels move out of RoHS?," evertiq, Feb. 23,
2006.
"Wohler Technologies Policy on RoHS & WEEE," PCB007, Oct. 10,
2005.
"World refined tin production," Tin World, no. 22, Early
Summer 2008, pp. 16-17.
"World Refined Tin Production," Tin World, no. 23, pp. 16-17,
Summer 2008.
"World Refined Tin Production," Tin World, no. 24, pp. 16-17,
Autumn 2008.
"World Tin Mine Production," Tin World, no. 25, pp. 17,
Winter 2008/2009.
"World Tin Mine Production," Tin World, no. 26, pp. 17,
Spring 2009.
"World Tin Mine Production," Tin World, no. 27, pp. 17, Summer
2009.
"World Tin Mine Production," Tin World, no. 28, pp. 17,
Autumn 2009.
"World Tin Mine Production," Tin World, no. 30, pp. 17,
Spring 2010.
"Worldwide lead-free certification," Elektron, vol. 22 no. 5,
pp. 13, May 2005.
"Worldwide lead-free certification for electronics launched by IECQ," Apr.
22, 2005.
"Working to Get the Lead Out," Journal of the Reliability
Information Analysis Center, pp. 2-4, 2nd Quarter 2006.
"X-ray Screening for RoHS Compliance," Design News, vol. 61
no. 2, pp. xx, Feb. 6, 2006.
"XRF analyzers measure traces of lead in solders," Advanced Materials
& Processes, vol. 163 no. 2, pp. 23, Feb. 2005.
"XRF, Close Up," Circuits Assembly, vol. 17 no. 2, pp. 84-85,
Feb. 2006.
"You can't sweep this one under the rug," Components in Electronics
, vol. xx no. xx, pp. xx-xx, Feb. 2005.
"You have Choices For Lead-free Wave Selective and Tinning Operations,"
Lead-Free Connection, vol. 3 no. 1, pp. 1, May 2006.
"Zinc Contamination in High Technology Facilities.,"
"Zinc "whiskers"," finishing.com.
"Zinc Whiskers Growing on Raised Floor Tiles are Causing Conductive
Contamination Failures and Equipment Shutdowns," The Uptime Institute.
Aamir, Muhammad, Muhammad, Riaz, Tolouei-Rad, Majid, Giasin, Khaled, and
Silberschmidt, Vadim V.,
"A review: microstructure and properties of tin-silver-copper lead-free solder
series for the applications of electronics," Soldering & Surface Mount
Technology, vol. 32 no. 2, pp. 115-126, 2020.
Aamir, Muhammad, Izhar, , Waqas, Muhammad, Iqbal, Muhammad, Hanif, Muhammad
Imran, and Muhammad, Riaz,
"Fuzzy logic approach for investigation of microstructure and mechanical
properties of Sn96.5-Ag3.0-Cu0.5 lead free solder alloy," Soldering
& Surface Mount Technology, vol. 29 no. 4, pp. 191-198, 2017.
Aamir, Muhammad, Muhammad, Riaz, Ahmed, Naseer, and Waqas, Muhammad,
"Impact of thermal aging on the intermetallic compound particle size and
mechanical properties of lead free solder for green electronics,"
Microelectronics Reliability, vol. 78, pp. 311-318, Nov. 2017.
Aamir, Muhammad, Tolouei-Rad, Majid, Din, Israr Ud, Giasin, Khaled, and
Vafadar, Ana,
"Performance of SAC305 and SAC305-0.4La lead free electronic solders at high
temperature," Soldering & Surface Mount Technology, vol. 31 no.
4, pp. 250-260, 2019.
Aasmundtveit, Knut E., Tekseth, Kim Robert, Breiby, Dag W., and Nguyen,
Hoang-Vu,
"High-energy X-ray Tomography for 3D Void Characterization in Au-Sn
Solid-Liquid Interdiffusion (SLID) Bonds," 2019 22nd European
Microelectronics and Packaging Conference & Exhibition, Pisa, Italy,
Sept. 16-19, 2019. pp. xx-xx.
Aasmundtveit, Knut E., Eggen, Trym, Manh, Tung, and Nguyen, Hoang-Vu,
"In-Bi low-temperature SLID bonding for piezoelectric materials,"
Soldering & Surface Mount Technology, vol. 30 no. 2, pp. 100-105,
2018.
Abbas, M. Hassib,
"Kinetics of Aluminum Chromating," Metal Finishing, vol. 93 no.
12, pp. 8, 10, 12-13, Dec. 1995.
Abbas, Sanaa Razzaq, Gumaan, Mohammed S., and Shalaby, Rizk Mostafa,
"Chromium effects on the microstructural, mechanical and thermal properties of
a rapidly solidified eutectic Sn-Ag alloy," Soldering & Surface Mount
Technology, vol. 32 no. 3, pp. 137-145, 2020.
Abbasi, Nasir M., Yu, Haojie, Wang, Li, Abdin, Zain-ul-, Amer, Wael A., Akram,
Muhammad, Khalid, Hamad, Chen, Yongsheng, Saleem, Muhammad, Sun, Ruoli, and
Shan, Jie,
"Preparation of silver nanowires and their application in conducting polymer
nanocomposites," Materials Chemistry and Physics, vol. 166, pp.
1-15, Sept. 15, 2015.
Abbott, Andrew P., Capper, Glen, McKenzie, Katy J., and Ryder, Karl S.,
"Electrodeposition of zinc-tin alloys from deep eutectic solvents based on
choline chloride," Journal of Electroanalytical Chemistry, vol.
599 no. 2, pp. 288-294, Jan. 15, 2007.
https://doi.org/10.1016/j.jelechem.2006.04.024
Abbott, Don,
"Technical Challenges for Pb-Free Components," Massachusetts Toxic
Use Reduction Institute 2nd Workshop on Lead-Free Electronics, June 29,
2000.
Abbott, Don, and Romm, Doug,
"TI Tin Whisker and Pb-Free Finish Evaluations," Lead Free
Electronics Workshop, Marlborough, MA, June 19, 2003.
Abbott, Donald, Romm, Douglas, and Lange, Bernhard,
"A Nickel-palladium-gold IC Lead Finish and the Potential for Solder Joint
Embrittlement," 2002 Advanced Technology Symposium Conference
Proceedings, 2002, pp. xx-xx.
Abbott, Donald, Romm, Douglas, and Lange, Bernhard,
"A Nickel-Palladium-Gold Integrated Circuit Lead Finish and Its Potential for
Solder Joint Embrittlement," Texas Instruments Application Report SZZA031,
Dec. 2001.
Abbott, Donald C.,
"Nickel/Palladium Finish for Leadframes," IEEE Transactions on
Components and Packaging Technology, vol. 22 no. 1, pp. 99-103, Mar.
1999.
Abbott, Donald C., and Romm, Douglas W.,
"Palladium Plating: A Lead Free Finish for IC Leadframes," 1995
Proceedings 45th Electronic Components & Technology Conference, Las
Vegas, NV, May 21-24, 1995, pp. 1068-1072.
Abbott, Donald, Anderson, Richard, Pasquito, Helena, Wilkish, George,
Harriman, Liz, Kistler, Marie, Pinsky, David, Quealy, Mark, Shina, Sammy, and
Walters, Karen,
"Testing and Analysis of Surface Mounted Lead Free Soldering Materials and
Processes," IPC SMEMA Council APEX 2003, Anaheim, CA, Mar.
31-Apr. 2, 2003, pp. xx-xx.
Abbott, Donald C.,
"Nickel/Palladium Finish for Leadframes," IEEE Transactions on
Components and Packaging Technology, vol. 22 no. 1, pp. 99-103, Mar.
1999.
Abdel-Hady, Hecham, Ma, Hongtao, Suhling, Jeffrey C., Islam, M. Saiful, and
Lall, Pradeep,
"Measurement of the Constitutive Behavior of Lead Free Solders,"
Proceedings of the 2004 SEM X International Congress and Exposition on
Experimantal and Applied Mechanics, Costa Mesa, CA, June 7-10, 2004,
pp. 345-349.
Abdelhadi, Ousama M., and Ladani, Leila,
"Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic
Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints,"
Journal of Electronic Packaging, vol. 135 no. 2, pp.
021004-1-021004-10, June 2013.
Abdelhadi, Ousama M., and Ladani, Leila,
"IMC growth of Sn-3.5Ag/Cu system: Combined chemical reaction and diffusion
mechanisms," Journal of Alloys and Compounds, vol. 537, pp.
87-99, Oct. 5, 2012.
Abd-Elnaiem, Alaa M., Mebed, A. M., Gaber, A., and Abdel-Rahim, M. A.,
"Tailoring the porous nanostructure of porous anodic alumina membrane with the
impurity control," Journal of Alloys and Compounds, vol. 659, pp.
270-278, Feb. 25, 2016.
Abdulhamid, M. F., Basaran, C., and Hopkins, D. C.,
"Effect of Thermomigration in Lead-Free Solder Alloy Mechanical Properties,"
International Conference on Soldering and Reliability, Toronto,
Ontario, Apr. 17-19, 2007, pp. xx-xx.
Abdulhamid, Mohd F., and Basaran, Cemal,
"Influence of Thermomigration on Lead-Free Solder Joint Mechanical
Properties," Journal of Electronic Packaging, vol. 131 no. 1, pp.
011002-1-011002-12, Mar. 2009.
Abdulhamid, Mohd F., Li, Shidong, and Basaran, Cemal,
"Thermomigration in lead-free solder joints," International Journal of
Materials and Structural Integrity, vol. 2 no. 1-2, pp. 11-34, June
2008.
DOI: 10.1504/IJMSI.2008.018898
Abdulhamid, Mohd F., Basaran, Cemal, and Lai, Yi-Shao,
"Thermomigration Versus Electromigration in Microelectronics Solder Joints,"
IEEE Transactions on Advanced Packaging, vol. 32 no. 3, pp.
627-635, Aug. 2009.
Abdullah, I., Ismail, R., and Jalar, A.,
"Strain Rate Effect on Micromechanical Properties of SnAgCu Solder Wire,"
2014 IEEE International Conference on Semiconductor Electronics,
Kuala Lumpur, Malaysia, Aug, 27-29, 2014, pp. 343-346.
Abdullah, Izhan, Zulkifli, Muhammad Nubli, Jalar, Azman, and Ismail, Roslina,
"Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied
tensile strain rates," Soldering & Surface Mount Technology,
vol. 29 no. 2, pp. 110-117, 2017.
Abdullah, Izhan, Zulkifli, Muhammad Nubli, Jalar, Azman, and Ismail, R.,
"Deformation behavior relationship between tensile and nanoindentation tests
of SAC305 lead-free solder wire," Soldering & Surface Mount Technology
, vol. 30 no. 3, pp. 194-202, 2018.
Abdullah, Izhan, Zulkifli, Muhammad Nubli, Jalar, Azman, Ismail, Roslina, and
Ambak, Mohd Arrifin,
"Relationship of Mechanical and Micromechanical Properties with
Microstructural Evolution of Sn-3.0Ag-0.5Cu (SAC305) Solder Wire Under Varied
Tensile Strain Rates and Temperatures," Journal of Electronic Materials
, vol. 48 no. 5, pp. 2826-2839, May 2019.
Abdullah, Mikrajuddin, Shi, Frank G., Chungpaiboonpatana, Surasit, Okuyama,
Kikuo, Davidson, Craig, and Adams, Joseph M.,
"Electrically Isotropic Conductive Adhesives: an Effective Contact Resistance
Model for Conductivity Development," 1999 International Symposium on
Advanced Packaging Materials, Braselton, GA, Mar. 14-17, 1999, pp. 282-287.
Abdullah, Zakaria, and Rahman, Mohamed Abdul,
"High Temperature Storage Performance for Au Sn Diffusion Soldering on Cu
Leadframe Substrate," 2010 34th IEEE/CPMT International Electronic
Manufacturing Technology Symposium, Melaka, Malaysia, Nov. 30-Dec. 2,
2010, pp. xx-xx.
Abel, Nicholas,
"What about mixing a leaded BGA on a board using Lead-Free paste? Or
vice-versa?," Lead-Free Magazine.
Aberg, Ingvar, Vescovi, Giuliano, Asoli, Damir, Naseem, Umear, Gilboy, James
P., Sundvall, Christian, Dahlgren, Andreas, Svensson, K. Erik, Anttu, Nicklas,
Bjork, Mikael T., and Samuelson, Lars,
"A GaAs Nanowire Array Solar Cell with 15.3% Efficiency at 1 Sun," 2015
IEEE 42nd Photovoltaic Specialist Conference, New Orleans, LA, June
14-19, 2015, pp. xx-xx.
Aberg, Ingvar, Vescovi, Giuliano, Asoli, Damir, Naseem, Umear, Gilboy, James
P., Sundvall, Christian, Dahlgren, Andreas, Svensson, K. Erik, Anttu, Nicklas,
Bjork, Mikael T., and Samuelson, Lars,
"A GaAs Nanowire Array Solar Cell With 15.3% Efficiency at 1 Sun," IEEE
Journal of Photovoltaics, vol. 6 no. 1, pp. 185-190, Jan. 2016.
Abermann, R., and Koch, R.,
"The Internal Stress in Thin Silver, Copper and Gold Films," Thin Solid
Films, vol. 129 no. 1-2, pp. 71-78, July 12, 1985.
Abhyankar, Hrushikesh, Webb, D. Patrick, Hutt, David A., and West, G.,
"Adhesion of Thermoplastics to Materials used in Electronics (Tin),"
2008 10th Electronics Packaging Technology Conference, Singapore, Dec.
9-12, 2008, pp. 296-303.
Abidh, Gerard,
"Matching Cleaning Process to Solder Alloy," Surface Mount
Technology (SMT), vol. 22 no. 12, pp. 24-26,31, Dec. 2008.
Abraham, Jisha Annie, Pagare, Gitanjali, Chouhan, Sunil Singh, and Sanyal,
Sankar P.,
"Structural, electronic, elastic, mechanical and thermal behavior of RESn3(RE
= Y, La and Ce) compounds: A first principles study," Intermetallics
, vol. 51, pp. 1-10, Aug. 2014.
Abrams, Fern,
"California Green Chemistry Takes Lists to Another Level,"
Circuitree, vol. 23 no. 1, pp. xx-xx, Jan. 2010.
Abrams, Fern,
"China Publishes RoHS-Like Laws," evertiq, Nov. 25, 2005.
Abrams, Fern
"Dealing with the devil: Could REACH be better than ROHS?," Electronic Business,
Feb. 5, 2008.
Abrams, Fern,
"Environmentally Speaking," CircuiTree, vol. 19 no. 4, pp.
xx-xx, Apr. 2006.
Abrams, Fern,
"Environmentally Speaking," Circuitree, vol. 19 no. 10, pp.
xx-xx, Oct. 2006.
Abrams, Fern,
"Environmentally Speaking," CircuiTree, vol. 20 no. 4, pp.
xx-xx, Apr. 2007.
Abrams, Fern,
"Environmentally Speaking -- Fern Abrams," CircuiTree, vol.
18 no. 7, pp. xx-xx, July 2005.
Abrams, Fern,
"Environmentally Speaking -- Fern Abrams," CircuiTree, vol.
18 no. 10, pp. xx-xx, Oct. 2005.
Abrams, Fern,
"Environmentally Speaking: Despite Unclear Environmental Impacts, OEMs Make
Clear Announcements on Halogen-Free Electronics," CircuiTree,
vol. 21 no. 4, pp. xx-xx, Apr. 2008.
Abrams, Fern,
"Environmentally Speaking: Drawing the Line - How Green Electronics Turn Brown
When Exposed to the Light of Day," CircuiTree, vol. 20 no. 7,
pp. xx-xx, July 2007.
Abrams, Fern,
"Environmentally Speaking -- Fern Abrams: Keeping Warm in Maine,"
CircuiTree, vol. 17 no. 4, pp. xx, Apr. 2004.
Abrams, Fern,
"Environmentally Speaking - Fern Abrams: Lead Bans Spreading Like Wildfire,"
CircuiTree, vol. 17 no. 7, pp. xx, July 2004.
Abrams, Fern,
"Environmentally Speaking: In Pursuit of Better Global Regulations,"
CircuiTree, vol. 20 no. 10, pp. xx-xx, Oct. 2007.
Abrams, Fern,
"Get the Facts on Federalizing RoHS," IPC Review, vol. 48 no. 2,
pp. 15,17, Feb. 2007.
Abrams, Fern,
"Has Greenpeace Gone Too Far?," Circuitree, vol. 23 no. 4,
pp. xx-xx, Apr. 2010.
Abrams, Fern,
"IPC Halogen-Free Position and Perspective," Intel Halogen Free
Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.
Abrams, Fern,
"Materials Declaration for Eco-Compliance," IPC.
Abrams, Fern,
"REACH: Is Industry Ready for This EU Regulatory Tidal Wave?,"
Circuitree, vol. 21 no. 10, pp. xx-xx, Oct. 2008.
Abrams, Fern,
"Regulation, Standards, and Science: Where Are We on Halogen Free?,"
Circuitree, vol. 22 no. 10, pp. xx, Sept. 2009.
Abrams, Fern,
"Social and Environmental Goals Pose Never-Ending Supply Chain Challenges: New
Regulations Go Beyond Restricted Materials," Surface Mount Technology
(SMT), vol. 26 no. 9, pp. 24-26,28, Sept. 2011.
Abrams, Fern,
"Troubling road ahead with EU RoHS Directive," Circuitree,
vol. 22 no. 4, pp. 21, Apr. 2009.
Abrams, Fern,
"What's in Your Electronics Equipment?," Circuits Assembly
, vol. 16 no. 1, pp. 58, Jan. 2005.
Abtew, M., and Selvaduray, G.,
"Lead-free Solders in Microelectronics," Materials Science and
Engineering, vol. 27 no. 5-6, pp. 95-141, June 2000.
https://doi.org/10.1016/S0927-796X(00)00010-3
Abtew, Mulugeta, Kinyanjui, Robert, Nuchsupap, Narong, Chavasiri, Thanarkhom,
Yingyod, Net-Hin, Saetang, Paiboon, Krapun, Jakrit, and Jikratoke, Kriangsak,
"Effect of Inert Atmosphere Reflow and Solder Paste Volume on the
Microstructure and Mechanical Strength of Mixed Sn-Ag-Cu and Sn-Pb Solder
Joints," 2006 SMTA International Conference Proceedings,
Rosemont, IL, Sept. 24-28, 2006, pp. 74-78.
Abtew, Mulugeta, and Selvaduray, Guna,
"Lead Free Solders for Surface Mount Technology Applications (Part 1),"
Chip Scale Review, vol. xx no. xx, pp. xx, Mar. 1998.
Abtew, Mulugeta, and Selvaduray, Guna,
"Lead Free Solders for Surface Mount Technology Applications (Part 2),"
Chip Scale Review, vol. xx no. xx, pp. xx, Mar. 1998.
Abtew, Mulugeta, and Selvaduray, Guna,
"Lead-free Solders in Microelectronics," Materials Science and
Engineering: R: Reports, vol. 27 no. 5-6, pp. 95-141, June 1, 2000.
Abtew, Mulugeta,
"Wetting Characteristics of Lead Free Solders for High Volume Surface Mount
Application," Proceedings of the Technical Program NEPCON West 2000,
Volume 2, Anaheim, CA, Feb. 29-Mar. 2, 2000, pp. 1089-1090.
Abu Bakar, M. S., and Rahimifard, S.,
"An integrated framework for planning of recycling activities in electrical
and electronic sector," International Journal of Computer Integrated
Manufacturing, vol. 21 no. 6, pp. 617-630, Sept. 2008.
Abueed, Mohammed, Belhadi, Mohamed, Wei, Xin, and Hamasha, Sa'd,
"Combined Creep and Fatigue Loadings on SAC305 Solder Joint," SMTA
International 2020, virtual conference, Sept. 28-Oct. 23, 2020, pp.
243-249.
Abueed, Mohammed, Alathamneh, Raed, Hamasha, Sa'd, Suhling, Jeff, and Lall,
Pradeep,
"Effect of Creep and Fatigue on Individual SAC305 Solder Joint Reliability in
Iso-Thermal Cycling," Proceedings of SMTA International,
Rosemont, IL, Sept. 22-26, 2019, pp. 306-314.
Abueed, Mohammed, Athamenh, Raed, Hamasha, Sa'd, Suhling, Jeff, and Lall,
Pradeep,
"Effect of Fatigue on Individual SAC305 Solder Joints Reliability at Elevated
Temperature," 2020 19th IEEE Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May
26-29, 2020, pp. 1043-1050.
Abys, Joseph A.,
"Analysis of Adhesion Failures of Thermally Treated Tin-plated Copper Using
AES," Plating & Surface Finishing, vol. 88 no. 7, pp. 28-29,
July 2001.
Abys, J. A., Maisano, J. J., Kadija, I. V., Kudrak, E. J., and Nakahara, S.,
"Annealing Behavior of Palladium-Nickel Alloy Deposits," Plating &
Surface Finishing, vol. 83 no. 8, pp. 43-49, Aug. 1996.
Abys, Joseph A.,
"Optimization of Tin Plating Process For Adhesive Bonding," Plating
& Surface Finishing, vol. 87 no. 11, pp. 32-33, Nov. 2000.
Abys, Joseph A.,
"Solderability & Wirebonding Performance Of Nickel/Palladium-plated
Leadframes," Plating & Surface Finishing, vol. 88 no. 5, pp.
114-115, May 2001.
Abys, Joseph A.,
"The Effect of Base Metal Impurities on the Solderability & Wirebonding of
Semiconductor Leadframes," Plating & Surface Finishing, vol.
87 no. 1, pp. 54-55, Jan. 2000.
Abys, Joseph A.,
"The Effect of Carbon Content on the Solderability/ Reflowability of Tin &
Tin-Lead Electrodeposits," Plating & Surface Finishing, vol.
87 no. 3, pp. 50-51, Mar. 2000.
Abys, Joseph A.,
"The Effect of Chromium Contamination In a Tin Plating Bath," Plating
& Surface Finishing, vol. 88 no. 3, pp. 50-51, Mar. 2001.
Acchione, T., and Scalzo, M.,
"Room Temperature LED and D-PAK Type Component-Attach and Reliability
Testing," South East Asia Technical Training Conference on Electronics
Assembly Technologies 2011 Proceedings, Penang, Malaysia, May 19-20,
2011, pp. xx-xx.
Accorsi, John,
"The right mix: morphology and dispersion of carbon black in the stabilization
of weather resistant polyethylenes," Wire Journal International,
vol. 35 no. 3, pp. 98-105, Mar. 2002.
Acharya, Sanchar, and Kottantharayil, Anil,
"Poole-Frenkel Transport in Gold Catalyzed VLS Grown Silicon Nanowires,"
IEEE Transactions on Electron Devices, vol. 65 no. 5, pp.
1685-1691, May 2018.
Achilias, D. S., Antonakou, E. V., Koutsokosta, E., and Lappas, A. A.,
"Chemical Recycling of Polymers from Waste Electric and Electronic Equipment,"
Journal of Applied Polymer Science, vol. 114 no. 1, pp. 212-221,
Oct. 5, 2009.
Achillas, Ch., Vlachokostas, Ch., Moussiopoulos, N., Perkoulidis, G., Banias,
G., and Mastropavlos, M.,
"Electronic waste management cost: a scenario-based analysis for Greece,"
Waste Management and Research, vol. 29 no. 9, pp. 963-972, Sept.
2011.
Adachi, M., Ohuchi, S., and Totsuka, N.,
"New Mode Crack of LSI Package in the Solder Reflow Process," Eleventh
IEEE/CHMT International Electronics Manufacturing Technology Symposium,
San Francisco, CA, Sept. 16-18, 1991, pp. 171-174.
Adachi, Naoya, Fukawa, Tadashi, Tatewaki, Yoko, Shirai, Hirofusa, and Kimura,
Mutsumi,
"Anisotropic Electronic Conductivity in Layer-By-Layer Composite Film Composed
of Water-Soluble Conjugated Polymers and SWNTs," Macromolecular Rapid
Communications, vol. 29 no. 23, pp. 1877-1881, Dec. 1, 2008.
Adachi, Sadao,
"Optical properties of a-Sn," Journal of Applied Physics, vol. 66
no. 2, pp. 813-819, July 15, 1989.
Adam, Achim, and Staschko, Klaus,
"Bleifreie Schichten fur Lageranwendungen," Galvanotechnik,
vol. xx no. xx, pp. 1335-1341, June 2005.
Adam, Sandor, Medgyes, Balint, Rigler, Daniel, Szabo, Bence, and Gal, Laszlo,
"Electrochemical Migration of SAC305 Solders and Tin Surface Finish in NaCI
Environment," 2018 IEEE 24th International Symposium for Design and
Technology in Electronic Packaging, Iasi, Romania, Oct. 25-28, 2018,
pp. 71-75.
Adami-Sampson, Mike,
"Designs on Environmental Compliance," Electronic News, Dec.
21, 2005.
Adami-Sampson, Mike, Cooper, Dolores, and Zepp. Mike,
"The countdown begins," Electronics Supply & Manufacturing
, Mar. 2006.
Adami-Sampson, Mike, Cooper, Dolores, and Zepp, Mike,
"The RoHS countdown begins," Green SupplyLine, Mar. 1, 2006.
Adams, Jackie A., Lau, Sophia S., and Chew, L. H.,
"Building a Global Technologically Efficient Supply Chain,"
International Conference on Soldering and Reliability, Toronto,
Ontario, May 13-16, 2008, pp. xx-xx.
Adams, Jacklin, Galyon, George, and Chew, L. H.,
"Environmental Regulatory Roadmap: A Recent History and a Look Forward,"
International Conference on Soldering & Reliability 2010
Proceedings, Toronto, Ontario, Canada, May 17-20, 2010, pp. xx-xx.
Adams, Jacklin, Galyon, George, and Chew, L. H.,
"Environmental Regulatory Roadmap: A Recent History and a Look Forward,"
SMTA Journal, vol. 23 no. 3, pp. 31-39, 2010.
Adams, Jackie, Cole, Marie, Fletcher, Mary Beth, Galyon, George, Grosskopf,
Curtis, Quick, John, and Lau, Sophia,
"EU RoHS Exemptions, Technology and Trends Since Promulgation," SMTA
International 2011 Conference Proceedings, Fort Worth, TX, Oct. 16-20,
2011, pp. 225-233.
Adams, Jackie, Liu, Hai L. H., Chew, L. H., Kelly, Matthew, and Wilcox, Jim,
"Industry Challenges with China Envrionmental Product Regulations,"
International Conference on Lead-free Soldering, Toronto, Ontario, May
16-18, 2006, pp. xx-xx.
Adams, Jackie,
"RoHs Compliance: Take A Supply-Chain Perspective," Electronic
Design, vol. 53 no. 26, pp. 20, Nov. 17, 2005.
Adams, Jackie, Godown, Terry, Lyjak, Kenneth, Ferretti, Louis, Cordioli, Mina,
Samson, Darren, and White, Fabio,
"RoHS vs. REACH: What Does This Mean to I/T Hardware Companies and Data
Management?," SMTA International Conference, San Diego, CA, Oct.
4-8, 2009, pp. 585-591.
Adams, Jacklin,
"Achieving RoHS Compliance and the Integrated Supply Chain,"
IPC/Soldertec Global 3rd International Conference on Lead Free Electronics
, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.
Adams, Larry,
"Metals and Metal Parts: Troubling Tin Tendrils," Appliance Design
, vol. xx no. x, pp. xx-xx, Nov. 2006.
Adams, Sean, Stratton, Paul, and Hunt, Chris,
"Atmosphere Effects on the Comparative Solderability of Eutectic
Tin-Silver-Copper and Tin-Lead Alloys," 2001 Advanced Packaging
Technology Conference Proceedings, 2001, pp. xx-xx.
Adams, Tom,
"A close look at mixed-solder boards," EMasia, May 2007.
Adams, Tom,
"Acoustic Imaging In Transition To Pb-Free Processing," OnBoard
Technology, vol. xx no. xx, pp. 10-11, Sept. 2004.
Adams, Tom,
"Damage-Free Alloy Conversion for Medical Components,", Medical
Electronics Manufacturing, pp. 3638,40-42, Fall 2009.
Adams, Tom,
"Finding packaging defects in BGAs," Global SMT and Packaging
, vol. 5 no. 4, pp. 32-33, Apr. 2005.
Adams, Tom,
"Lead-free solder proposals put pressure on electronics manufacturers,"
Military & Aerospace Electronics, vol. 11 no. 7, pp. 3-4,
July 2000.
Adams, Tom,
"Moving to Lead-Free Solder for Medical Electronics," Medical
Electronics Manufacturing, vol. xx no. xx, pp. 18-20, Spring 2002.
Adams, Tom,
"Revised moisture sensitivity standard includes lead-free components,"
Military & Aerospace Electronics, Aug. 2008.
Adams, Tom,
"Standard gives guidance for alloy conversion using hot-solder dip,"
Military & Aerospace Electronics, Dec. 2008.
Adams, Tom, and Martell, Steve,
"The Moisture Sensitivity Standard Goes Pb-Free," Circuits Assembly
, vol. 18 no. 1, pp. 40, 42, 44, Jan. 2007.
Adamson, Philip,
"Lead-free Packaging for Discrete Power Semiconductors," 2002 JEDEC
Conference, Apr./May 2002.
Adawiyah, M. A. Rabiatul, and Azlina, O. Saliza,
"Comparative study on the isothermal aging of bare Cu and ENImAg surface
finish for Sn-Ag-Cu solder joints," Journal of Alloys and Compounds
, vol. 740, pp. 958-966, Apr. 5, 2018.
Adawiyah, M. A. Rabiatul, and Azlina, O. Saliza,
"Interfacial reaction between SAC305 lead-free solders and ENImAg surface
finish and bare copper," Materialwissenschaft und Werkstofftechnik
, vol. 48 no. 3-4, pp. 235-240, Apr. 2017.
Adawiyah, M. A. Rabiatul, Hafiz, A. B. M., Azlina, O. Saliza, Zolhafizi, J.,
Azrina, W. M. Wan Nur, and Azmir, O. Shahrul,
"The effect of cooling rate during multiple reflow soldering on intermetallic
layer of Sn-4.0 Ag-0.5Cu/ENImAg," Materialwissenschaft und
Werkstofftechnik, vol. 50 no. 3, pp. 295-301, Mar. 2019.
Aday, Jon, and Evans, John L.,
"Thick Film Silver Multilayers for Under-the-Hood Automotive Applications,"
Proceedings 1993 International Symposium on Microelectronics
(Proceedings of SPIE - The International Society for Optical Engineering,
Volume 2105), Dallas, TX, Nov. 9-11, 1993, pp. 126-131.
Addamiano, Arrigo, and Davey, John E.,
"A New Type of Gallium Arsenide Whiskers," Journal of Crystal Growth
, vol. 10 no. 2, pp. 194-198, July 1971.
Addamiano, Arrigo,
"Coiled Crystals of Gallium Arsenide," Journal of Crystal Growth,
vol. 11 no. 3, pp. 351-354, Dec. 1971.
Addison, C. A., and Kedward, E. C.,
"The Development of Chromium Based Electrodeposited Composite Coatings,"
Transactions of the Institute of Metal Finishing, vol. 55 no. 2,
pp. 41-46, Summer 1977.
Adeva, P., Caruana, G., Ruano, O. A., and Torralba, M.,
"Microstructure and high temperature mechanical properties of tin,"
Materials Science and Engineering: A, vol. 194 no. 1, pp. 17-23, April
1995.
Adler, C., Klink, G., Feil, M., Ansorge, F., and Reichl, H.,
"Assembly of ultra thin and flexible ICs," 4th International Conference
on Adhesive Joining & Coating Technology in Electronics Manufacturing
, Espoo, Finland, June 18-21, 2000, pp. 20-23.
Adli, Nisrin, Razak, Nurul Razliana Abdul, and Saud, Norainiza,
"Physical and Mechanical Behaviors of SnCu-based Lead-free Solder Alloys with
an Addition of Aluminium," Applied Mechanics and Materials, vol.
815, pp. 64-68, Nov. 2015.
Advani, Gurmukh, and Yadav, Om Prakash,
"A Unified Model Approach for Solder Joint Life Prediction," 2015 Annual
Reliability and Maintainability Symposium, Palm Harbor, FL, Jan. 26-29,
2015, pp. xx-xx.
Aernoudt, Etienne A. D.,
"Drawing induced structural and mechanical anisotropy," Wire Journal
International, vol. 42 no. 12, pp. 60-71, Dec. 2009.
Affolter, Bruno,
"Automatic and Secure Rework in a Lead-Free Environment," 1st
Electronics Systemintegration Technology Conference, Volume 1, Dresden,
Germany, Sept. 5-7, 2006, pp. 624-628.
Afshari, Sia, and Hall, W. J.,
"XRF - a reality check," Global SMT and Packaging, vol. 7 no.
1, pp. 44, 46, 48, Jan. 2007.
Afshari, Sia, and Hall, W. J.,
"XRF - A Reality Check," Lead-Free Magazine.
Agar, Joshua C., Lin, Katy J., Zhang, Rongwei, Durden, Jessica, Lawrence,
Kevin, Moon, Kyoung-Sik, and Wong, C. P.,
"Deconstructing the Myth of Percolation in Electrically Conductive Adhesives
and Its Implications," 2010 Proceedings 60th Electronic Components and
Technology Conference, Las Vegas, NV, June 1-4, 2010, pp. 1713-1718.
Agar, Joshua C., Durden, Jessica, Zhang, Rongwei, Staiculescu, Daniela, and
Wong, C. P.,
"Kinetically Controlled Assembly Of terpheny-4,4"-dithiol Self-Assembled
Monolayers (SAMs) for Highly Conductive Anisotropically Conductive Adhesives
(ACA)," 2011 IEEE 61st Electronic Components and Technology Conference
, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 661-666.
Agarwal, Ravi, Ranjan, Rakesh, and Sarkar, Papiya,
"Scrapping the Hi-Tech Myth: Computer Waste in India," Toxic Link
, Feb. 2003.
Aggarwal, Ankur O., Abothu, Isaac R., Raj, P. Markondeya, Sacks, Michael. D.,
and Tummala, Rao R.,
"Lead-Free Solder Films Via Novel Solution Synthesis Routes," IEEE
Transactions on Components and Packaging Technologies, vol. 30 no. 3,
pp. 486-493, Sept. 2007.
Aggarwal, Ankur O., Raj, P. Markondeya, Abothu, Isaac R., Ravi, D., Sacks,
Michael D., Tay, Andrew A. O., and Tummala, Rao R.,
"Material Synthesis Routes for Thin Film Bonding Interfaces in Reworkable and
Bumpless Nano-Interconnects," 2004 9th International Symposium on
Advanced Packaging Materials, Atlanta, GA, Mar. 24-26, 2004, pp. 69-73.
Aggarwal, Ankur O., Raj, P. Markondeya, and Tummala, Rao R.,
"Metal-Polymer Composite Interconnections for Ultra Fine-Pitch Wafer Level
Packaging," IEEE Transactions on Advanced Packaging, vol. 30 no.
3, pp. 384-392, Aug. 2007.
Aggarwal, Ankur O., Raj, P. Markondeya, Abothu, Isaac R., Sacks, Michael D.,
Tay, Andrew A. O., and Tummala, Rao R.,
"New Paradigm in IC-Package Interconnections by Reworkable
Nano-Interconnects," 54th Electronic Components & Technology
Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 451-460.
Aggarwal, Ankur O., Raj, P. Markondeya, Lee, Baik-Woo, Yim, Myung Jin, Iyer,
M., Wong, C. P., and Tummala, Rao R.,
"Thermomechanical Reliability of Nickel Pillar Interconnections Replacing
Flip-Chip Solder Without Underfill," IEEE Transactions on Electronics
Packaging Manufacturing, vol. 31 no. 4, pp. 341-354, Oct. 2008.
Aghazadeh, Mostafa,
"Halogen-Free.... A Global Perspective," Intel Halogen Free Symposium
, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.
Agonafer, Dereje, and Hossain, Mohammad Masum,
"Development of Constitutive Equations and Novel Methodology for Failure
Prediction Models for SAC Lead-free Alloys," 2006 11th International
Symposium on Advanced Packaging Materials: Processes, Properties and
Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 13-14.
Agroskin, S., Geiger Jr., D., Griswold, B., Min, B. Y., Reinschmidt, R.,
Lasiter, J., Mathews, P. B., and Chong, F. C.,
"Reworking Multichip Modules," Electronic Packaging & Production
, vol. 35 no. 3, pp. 42-45, Mar. 1995.
Aguanno, Mauro, Collins, Maurice, Burke, Cillian, Reid, Michael, Ryan, Claire,
and Punch, Jeff,
"Reliability Testing of Doped Lead Free Solder Alloys," 2008 SMTA
International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008,
pp. 492-498.
Aguayo, Art, and Kuszaj, Michael,
"High Frequency Materials: Setting the Pace for Lead-free Processing,"
Circuitree, vol. 19 no. 6, pp. xx-xx, June 2006.
Aguilera, N. B. Palacios, Mollinger, J. R., Bastemeijer, J., Zhou, J., French,
P. J., and Bossche, A.,
"Gluing as an Alternative to Solder Flexible Batteries for its use in
System-in-a-package: Preliminary Results," 11th Electronics Packaging
Technology Conference, Singapore, Dec. 9-11, 2009, pp. 550-555.
Aguirre, Patricio,
"HOW safe is the lead-free environment," Electronics Manufacture and
Test, pp. xx-xx, June 2006.
Agwai, Abigail, Guven, Ibrahim, and Madenci, Erdogan,
"Peridynamic Theory for Impact Damage Prediction and Propagation in Electronic
Packages due to Drop," 2008 Proceedings 58th Electronic Components &
Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp.
1048-1053.
Ahat, Shawkret, Du, Liguang, Sheng, Mei, Luo, Le, Kempe, Wolfgang, and
Freytag, Juergen,
"Effect of Aging on the Microstructure and Shear Strength of SnPnAg/Ni-P/Cu
and SnAg/Ni-P/Cu Solder Joints," Journal of Electronic Materials,
vol. 29 no. 9, pp. 1105-1109, Sept. 2000.
Ahat, Shawkret, Weidong, Huang, Mei, Sheng, and Le, Luo,
"Joint Shape, Microstructure, and Shear Strength of Lead-Free Solder Joints
with Different Component Terminations," Journal of Electronic
Materials, vol. 31 no. 2, pp. 136-141, Feb. 2002.
Ahat, Shawkret, Sheng, Mei, and Luo, Le,
"Microstructure and Shear Strength Evolution of SnAg/Cu Surface Mount Solder
Joint during Aging," Journal of Electronic Materials, vol. 30 no.
10, pp. 1317-1322, Oct. 2001.
Ahlborn, H., and Wassermann, G.,
"Entstehung und Orientierung von Wolfram-Whiskern," Acta Metallurgica
, vol. 8 no. 12, pp. 897-898, Dec. 1960.
Ahmad, I., Jiun, Hoh Huey, Leng, Eu Poh, Majlis, B. Y., Jalar, A., and
Wagiran, R.,
"A Study on Inter-Metallic Compound Formation and Structure of Lead Free
SnAgCu Solder System," IEEE International Conference on Semiconductor
Electronics, Kuala Lumpur, Malasia, Nov. 29-Dec. 1, 2006, pp. 545-548.
Ahmad, Ibrahym, Seman, Anasyida Abu, and Mohamad, Ahmad Azmin,
"Investigation of anodic dissolution behaviour of intermetallic compound in
Sn-3Ag-0.5Cu solder alloy by cyclic voltammetry," Soldering & Surface
Mount Technology, vol. 31 no. 4, pp. 211-220, 2019.
Ahmad, Ibrahim, Majlis, B.Y., Jalar, A., and Leng, Eu Poh,
"Optimization Of Nickel Thickness On Substrate For TBGA Using SAC387 Solder
Material," 32nd IEEE/CPMT International Electronic Manufacturing
Technology Symposium, San Jose, CA, Oct. 3-5, 2007, pp. 192-194.
Ahmad, Ibrahim, Jalar, Azman, Majlis, Burhanuddin Yeop, Leng, Eu Poh, and San,
Yong Soo,
"Solder Joint Strength Of Lead Free Solders under Multiple Reflow and High
Temperature Storage Condition," IEEE International Conference on
Semiconductor Electronics, Kuala Lumpur, Malasia, Nov. 29-Dec. 1, 2006,
pp. 541-544.
Ahmad, Mudasir, Burlingame, Jennifer, and Guirguis, Cherif,
"Comprehensive Methodology to Characterize and Mitigate BGA Pad Cratering in
Printed Circuit Boards," SMTAnews & Journal of Surface Mount
Technology, vol. 22 no. 1, pp. 21-28, Jan.-Mar. 2009.
Ahmad, Mudasir, Liu, Kuo-Chuan, Ramakrishna, Gnyaneshwar, and Xue, Jie,
"Impact of Backwards Compatible Assembly on BGA Thermomechanical Reliability
and Mechanical Shock, Pre- and Post-Aging," 2008 SMTA International
Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 306-321.
Ahmad, Mudasir, Senk, David, and Burlingame, Jennifer,
"Methodology to Characterize Pad Cratering Under BGA Pads in Printed Circuit
Boards," 2008 Pan Pacific Microelectronics Symposium & Exhibit
, Kauai, HI, Jan. 22-24, 2008, pp. xx-xx.
Ahmad, Mudasir, Xie, Weidong, Liu, Kuo-Chuan, Xue, Jie, and Towne, Dave,
"Parametric Acceleration Transforms for Lead-Free Solder Joint Reliability
under Thermal Cycling Conditions," 59th Electronic Components &
Technology Conference, San Diego, CA, May 26-29, 2009, pp. 682-691.
Ahmad, Mudasir, and Wang, Qiang (Johnson),
"Predicting Strength and Pad Cratering Failures Under BGA Pads," Surface
Mount Technology (SMT), vol. 29 no. 1, pp. 48,50-52,54-59, Jan. 2014.
Ahmad, Mudasir, Duggan, Rich, Hu, Tom, Ong, Brett, Ralph, Carter, Sethuraman,
Sundar, and Shangguan, Dongkai,
"Strain Gage Testing: Standardization," Surface Mount Technology
, vol. 19 no. 7, pp. xx-xx, July 2005.
Ahmad, Mudasir, Burlingame, Jennifer, and Guirguis, Cherif,
"Validated Test Method to Characterize and Quantify Pad Cratering Under Bga
Pads on Printed Circuit Boards," 2009 IPC Printed Circuits Expo,
APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar.
31-Apr. 2, 2009, pp. xx-xx.
Ahmad, Naeem, Saeed, Ahmad, Khan, Suleman, Hassan, Fahad, Li, W. J., Shah,,
Saqlain A., Majid, Abdul, and Han, X. F.,
"Investigation of easy axis transition and magnetodynamics in Ni76Fe24
nanowires and Ni77Fe23 nanotubes synthesized by DC electrodeposition,"
Journal of Alloys and Compounds, vol. 725, pp. 123-128, Nov. 25, 2017.
Ahmad, Omar,
"The status of RoHS-compliant component supply," Electronic
Products, vol. 48 no. 8, pp. 89, Jan. 2006.
Ahmar, Joseph Al, and Wiese, Steffen,
"FEM Simulation of Cracks in MLCC during Reflow Soldering," 2017 18th
International Conference on Thermal, Mechanical and Multi-Physics Simulation
and Experiments in Microelectronics and Microsystems, Dresden, Germany,
Apr. 3-5, 2017, pp. xx-xx.
Ahmar, Joseph Al, Wiss, Erik, and Wiese, Steffen,
"Fracture Probability of MLCC in Dependence of Solder Fillet Height,"
2017 18th International Conference on Thermal, Mechanical and Multi-Physics
Simulation and Experiments in Microelectronics and Microsystems,
Dresden, Germany, Apr. 3-5, 2017, pp. xx-xx.
Ahmed, Mansur, Fouzder, Tama, Sharif, A., Gain, Asit Kumar, and Chan, Y. C.,
"Influence of Ag micro-particle additions on the microstructure, hardness and
tensile properties of Sn-9Zn binary eutectic solder alloy,"
Microelectronics Reliability, vol. 50 no. 8, pp. 1134-1141, Aug. 2010.
Ahmed, Md. Tusher, Motalab, Mohammad, and Suhling, Jeffrey C.,
"Impact of Mechanical Property Degradation and Intermetallic Compound
Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint,"
Journal of Electronic Materials, vol. 50 no. 1, pp. 233-248, Jan.
2021.
https://doi-org.ezproxy.uky.edu/10.1007/s11664-020-08514-y
Ahmed, Mohammad Faisal, Li, Yan, and Zeng, Changchun,
"Stretchable and compressible piezoresistive sensors from auxetic foam and
silver nanowire," Materials Chemistry and Physics, vol. 229, pp.
167-173, May 1, 2019.
Ahmed, Nafis, Bhargav, P. Balaji, Rayerfrancis, Arokiyadoss, Chandra, Balaji,
and Ramasamy, P.,
"Study the effect of plasma power density and gold catalyst thickness on
Silicon Nanowires growth by Plasma Enhanced Chemical Vapour Deposition,"
Materials Letters, vol. 219, pp. 127-130, May 15, 2018.
Ahmed, Omar, Jalilvand, Golareh, Fernandez, Hector, Su, Peng, Lee, Tae-Kyu,
and Jiang, Tengfei,
"Long-Term Reliability of Solder Joints in 3D ICs Under Near-Application
Conditions," 2019 IEEE 69th Electronic Components and Technology
Conference, Las Vegas, NV, May 28-31, 2019, pp. 1106-1112.
Ahmed, Sudan, Basit, Munshi, Suhling, Jeffrey C., and Lall, Pradeep,
"Effects of Aging on SAC-Bi Solder Materials," 2016 15th IEEE
Intersociety Conference on Thermal and Thermomechanical Phenomena in
Electronic Systems, Las Vegas, NV, May 31-June 3, 2016, pp. 746-754.
Ahmed, Sudan, Suhling, Jeffrey C., and Lall, Pradeep,
"Evaluation of Aging Induced Microstructural Evolution in Lead Free Solders
Using Scanning Probe Microscopy," 2018 17th IEEE Intersociety Conference
on Thermal and Thermomechanical Phenomena in Electronic Systems, San
Diego, CA, May 29-June 1, 2018, pp. 1062-1070.
Ahmed, Sudan, Hasnine, Md, Suhling, Jeffrey C., and Lall, Pradeep,
"Mechanical Characterization of SAC Solder Joints at High Temperature Using
Nanoindentation," 2017 IEEE 67th Electronic Components and Technology
Conference, Orlando, FL, May 30-June 2, 2017, pp. 1128-1135.
Ahmed, Sudan, Wu, Jing, Fu, Nianjun, Suhling, Jeffrey C., and Lall, Pradeep,
"Quantification and Modeling of Microstructural Evolution in Lead Free Solders
During Long Term Isothermal Aging," 2018 IEEE 68th Electronic Components
and Technology Conference, San Diego, CA, May 29-June 1, 2018, pp.
162-171.
Ahmed, Sudan, Suhling, Jeffrey C., and Lall, Pradeep,
"The Anand Parameters of Aging Resistant Doped Solder Alloys," 2017 16th
IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in
Electronic Systems, Orlando, FL, May 30-June 2, 2017, pp. 1416-1424.
Ahn, Jae Hyun, Lee, Jae-Hyun, Koo, Tae-Woong, Kang, MyungGil, Whang, Dongmok,
and Hwang, SungWoo,
"Synthesis of Small Diameter Silicon Nanowires on SiO2 and Si3N4 Surfaces,"
IEICE Transactions on Electronics, vol. E93.C no. 5, pp. 546-551,
2010.
Ahn, Junehyeon, Kim, Hongkwon, Byun, Kangho, Lee, Youngmin, Jang, Donghoon,
and Kim, Byungsung.
"Drop Test for Electroless Nickel Electroless Palladium Immersion Gold
(ENEPIG) Surface Treatment Application that is Suitable to a Low-Cost Fine
Pitch and Easy Fabrication," Proceedings of the ASME 2009 InterPack
Conference, Volume 1, San Francisco, CA, July 19-23, 2009, pp. 929-935.
Ahn, Jung-Ho, Kim, Yong-Jin, and Wang, Guoxiu,
"Electrochemical properties of SnO2 nanowires prepared by a simple heat
treatment of Sn-Ag alloys," Journal of Alloys and Compounds, vol.
xxx no. x-x, pp. xxx-xxx, xxxx.
Ahn, Seongki, Kadoya, Takahiro, Nara, Hiroki, Yokoshima, Tokihiko, Momma,
Toshiyuki, and Osaka, Tetsuya,
"Tin addition for mechanical and electronic improvement of electrodeposited
Si-O-C composite anode for lithium-ion battery," Journal of Power
Sources, vol. 437, pp. 226858-1-226858-6, Oct. 15, 2019.
Ahn, Seung-Ho, and Kwon, Young-Shin,
"Popcorn Phenomena in a Ball Grid Array Package," IEEE Transactions on
Components, Packaging, and Manufacturing Technology, Part B, vol. 18
no. 3, pp. 491-495, Aug. 1995.
Ahn, Seungyoung, Ryu, Woonghwan, Yim, Myung-Jin, Lee, Junho, Jeon, Young-Doo,
Kim, Woopoung, Paik, Kyung-Wook, and Kim, Joungho,
"Over 10 GHz Equivalent Circuit Model of ACF Flip-chip Interconnect using
Ni-filled Ball and Au-coated Polymer Balls," Proceedings of the
Twenty-Fourth IEEE/CPMT Electronics Manufacturing Technology Symposium,
Oct. 18-19, 1999, pp. 421-425.
Ahsan, Mohammad Al, Hasan, S. M. Kamrul, Fahim, Abdullah, Suhling, Jeffrey C.,
and Lall, Pradeep,
"Effect of Different Thermal Cycling Profiles on the Mechanical Behavior of
SAC305 Lead Free Solder," 2020 19th IEEE Intersociety Conference on
Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando,
FL, May 26-29, 2020, pp. 1170-1179.
Aiba, Akihiro, Kawamura, Kazumi, and Kumagai, Masashi,
"Novel Cyanide Free Electroless Au Plating for the Reliable Joint Between
Ni-P/Au and Sn-Ag-Cu Based Lead Free Solder," Proceedings of the
ASME/Pacific Rim Technical Conference and Exhibition on Integration and
Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic
Packaging 2005, Part B, San Francisco, CA, July 17-22, 2005, pp.
873-877.
Aiba, Akihiro,
"Post Surface Treatment Agent and Technology for IC Leadframe with High
Performance and Reliability," Journal of the Surface Finishing Society
of Japan, vol. 60 no. 4, pp. 243-247, 2009.
Aichele, Thomas, Tribu, Adrien, Sallen, Gregory, Bocquel, Juanita,
Bellet-Amalric, Edith, Bougerol, Catherine, Poizat, Jean-Philippe, Kheng,
Kuntheak, Andre, Regis, Tatarenko, Serge, and Mariette, Henri,
"CdSe quantum dots in ZnSe nanowires as efficient source for single photons up
to 220 K," Journal of Crystal Growth, vol. 311 no. 7, pp.
2123-2127, Mar. 15, 2009.
Aichele, Thomas, Tribu, Adrien, Bougerol, Catherine, Kheng, Kuntheak, Andre,
Regis, and Tatarenko, Serge,
"Defect-free ZnSe nanowire and nanoneedle nanostructures," Applied
Physics Letters, vol. 93, pp. 143106-1-143106-3, 2008.
Aifantis, K. E., and Dempsey, J. P.,
"Stable crack growth in nanostructured Li-batteries," Journal of Power
Sources, vol. 143 no. 1-2, pp. 203-211, Apr. 27, 2005.
Aihara, Masami,
"Material Properties and Practical Use Situation of Sn-Ag-In-Bi Solder
System," Harima Chemicals.
Aish, M. M., and Starostenkov, M. D.,
"Deformation and Fracture of Metallic Nanowires," Solid State Phenomena
, vol. 258, pp. 277-280, Dec. 2016.
Aisha, Siti Rabiatull, Ourdjini, A., Wah, N. M., How, H. C, and Chin, Y. T,
"Interfacial Reactions of SAC305 and SAC405 Solders on Electroless
Ni(P)/Immersion Au and Electroless Ni(B)/Immersion Au Finishes," 2010
34th IEEE/CPMT International Electronic Manufacturing Technology Symposium
, Melaka, Malaysia, Nov. 30-Dec. 2, 2010, pp. xx-xx.
Ait Mani, Abdenacer, and Arch, Manon,
"Direct Attach LED Soldering by New Printable AuSn Paste," 2015 European
Microelectronics Packaging Conference, Friedrichshafen, Germany, Sept.
14-16, 2015, pp. xx-xx.
Aizawa, Hirofumi, Yoshida, Hideto, and Sakai, Shin-ichi,
"Current results and future perspectives for Japanese recycling of home
electrical appliances," Resources, Conservation and Recycling,
vol. 52 no. 12 , pp. 1399-1410, Oct. 2008.
Ajmera, Abhinav, Ramkumar, S. Manian, and Liu, Ti Lin,
"Finite Element Modeling and Experimental Validation of Conventional and High
Speed Shear Testing in Pb-Free Environment," 2008 Proceedings 58th
Electronic Components & Technology Conference, Lake Buena Vista,
FL, May 27-30, 2008, pp. 1021-1030.
Akabori, M., Sladek, K., Hardtdegen, H., Schapers, Th., and Grutzmacher, D.,
"Influence of growth temperature on the selective area MOVPE of InAs nanowires
on GaAs (1 1 1) B using N2 carrier gas," Journal of Crystal Growth
, vol. 311 no. 15, pp. 3813-3816, July 15, 2009.
Akada, Yusuke, Tatsumi, Hiroaki, Yamaguchi, Takuto, Hirose, Akio, Morita,
Toshiaki, and Ide, Eiichi,
"Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to
Bulk Metals and Observation of Sintering Behavior," Materials
Transactions, vol. 49 no. 7, pp. 1537-1545, July 2008.
Akamatsu, M., Ohno, N., Takahashi, H., and Kawakami, T.,
"Comparison of Cyclic Inelastic Features of a Lead-Free Solder Alloy and a
Nickel-Base Superalloy," Key Engineering Materials, vol. 274-276,
pp. 763-768, 2004.
Akamatsu, Masafumi, Nakane, Kazuhiko, and Ohno, Nobutada,
"Implicit Stress Integration for High-Temperature Inelastic Constitutive
Models Using Linearization," Key Engineering Materials, vol.
340-341 II, pp. 907-912, 2007.
Akamatsu, Toshiya, Ueda, Hidefumi, Ochiai, Masayuki, and Horikoshi, Eiji,
"Joint Reliability of Flip Chip Interconnection with Sn-Bi Solder,"
2003 Pan Pacific Symposium Conference Proceedings, Feb. 18-20, 2003,
pp. xx-xx.
Akamatsu, Toshiya, Yamagishi, Yasuo, Imamura, Kazuyuki, Yamaguchi, Osamu, and
Minamizawa, Masaharu,
"Solder Joint Reliability of BGA Package with Sn-Bi System Solder Balls,"
Proceedings 2001 International Symposium on Microelectronics
(Proceedings of SPIE - The International Society for Optical Engineering,
Volume 4587), Baltimore, MD, Oct. 9-11, 2001, pp. 547-552.
Akatiff, Clark,
"Is this Ban Really Necessary? A Critical Investigation of the CRT Ban,"
May 2002.
Akazawa, Masamichi, and Hasegawa, Hideki,
"MBE growth and in situ XPS characterization of silicon interlayers on
(1 1 1)B surfaces for passivation of GaAs quantum wire devices," Journal
of Crystal Growth, vol. 301-302, pp. 951-954, Apr. 2007.
Akbari, Saeed, Nourani, Amir, and Spelt, Jan K.,
"Effect of Solder Joint Length on Fracture Under Bending," Journal of
Electronic Materials, vol. 45 no. 1, pp. 473-485, Jan. 2016.
Akbari, Saeed, and Spelt, Jan K.,
"Fracture Performance of BGA/PCB Underfilled Assemblies," International
Conference on Soldering & Reliability 2014, Toronto, Ontario,
Canada, May 13-15, 2014, pp. xx-xx.
Akenji, Lewis, Hotta, Yasuhiko, Bengtsson, Magnus, and Hayashi, Shiko,
"EPR policies for electronics in developing Asia: an adapted phase-in
approach," Waste Management and Research, vol. 29 no. 9, pp.
919-930, Sept. 2011.
Akhavan, Vahid, Ghosh, Rudy, Pillai, Nikhil, Chou, Harry, and Schroder, Kurt,
"Use of Flash Lamps to Achieve Non-equilibrium Soldering and Assembly
Utilizing Conventional SAC Alloys," SMTA International 2020,
virtual conference, Sept. 28-Oct. 23, 2020, pp. 585-588.
Akhtar, A. M. Zetty, Wirda, K.Hardinna, Aisha, I. Siti Rabiatull, and
Mahadzir, I.,
"Microstructure Evolution at the Solder Joint during Isothermal Aging,"
2014 IEEE 36th International Electronics Manufacturing Technology Conference
, Johor, Malaysia , Nov. 11-13, 2014, pp. xx-xx.
Akhtar, Masyood, and Anklekar, Rupendra M.,
"Effect of Lead and Cadmium-Free Glasses on Reliability and Microstructural
Development of Pb-Free Silver End Termination for MLCC Application,"
Proceedings of the 25th Symposium for Passive Components, Palm
Springs, CA, Mar. 21-24, 2005, pp. 199-207.
Akhtar, Masyood,
"Effect of Lead and Cadmium Free Glasses on Reliability of the Silver End
Termination for MLCC Application," 2005 International Symposium on
Electronics Materials and Packaging, Tokyo, Japan, Dec. 11-14, 2005,
pp. 67-73.
Akin, Meriem Ben-Salah, Rissing, Lutz, and Heumann, Wolfgang,
"Enabling Eutectic Soldering of 3D Opto-Electronics onto Low Tg Flexible
Polymers," 2014 IEEE 64th Electronic Components and Technology
Conference, Orlando, FL, May 27-30, 2014, pp. 1595-1600.
Akinade, K., Burgess, R., Campbell, M., Carver, S., Sanderson, L., Wade, R.,
and Melton, C.,
"Lead-free Solder Pastes Evaluation at Motorola Transmission Products
Division," Soldering & Surface Mount Technology, vol. 7 no.
2, pp. 50-54, May 1995.
Akkara, Francy John, Zhao, Cong, Sreenivasan, Arvind, Su, Sinan, Abueed,
Mohammed, Hamasha, Sa'd, Ali, Haneen, Suhling, Jeff, and Lall, Pradeep,
"Effect of Combining Solder Pastes with SAC305 Spheres on Component
Reliability in Harsh Thermal Cycling," 2020 19th IEEE Intersociety
Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
, Orlando, FL, May 26-29, 2020, pp. 1322-1327.
Akkara, Francy John, Zhao, Cong, Athamenh, Raed, Su, Sinan, Abueed, Mohammed,
Hamasha, Sa'd, Suhling, Jeff, and Lall, Pradeep,
"Effect of Solder Sphere Alloys and Surface Finishes on the Reliability of
Lead-Free Solder Joints in Accelerated Thermal Cycling," 2018 17th IEEE
Intersociety Conference on Thermal and Thermomechanical Phenomena in
Electronic Systems, San Diego, CA, May 29-June 1, 2018, pp. 1374-1380.
Akkara, Francy John, Su, Sinan, Thirugnanasambandam, Sivasubramanian,
Dawahdeh, Ahmad, Qasaimeh, Awni, Evans, John, and Hamasha, Sa'd,
"Effects of Long-Term Aging on SnAgCu Solder Joints Reliability in Mechanical
Cycling Fatigue," SMTA International 2017 Proceedings, Rosemont,
IL, Sept. 17-21, 2017, pp. 419-425.
Akkara, Francy John, Zhao, Cong, Abueed, Mohammed, Su, Sinan, Hamasha, Sa'd,
Suhling, Jeffrey, and Lall, Pradeep,
"Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes on the
Component Reliability in Harsh Thermal Cycling," SMTA International 2018
Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.
Akkara, Francy John, Abueed, Mohammed, Belhadi, Mohamed, Wei, Xin, Hamasha,
Sa'd, Ali, Haneen, Suhling, Jeff, and Lall, Pradeep,
"Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging,"
SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21,
2017, pp. xx-xx.
Akkara, Francy John, Zhao, Cong, Ahmed, Sudan, Abueed, Mohammed, Su, Sinan,
Hamasha, Sa'd, Suhling, Jeffrey, and Lall, Pradeep,
"Thermal Cycling Reliability of Newly Developed Lead-Free Solders for Harsh
Environments," Proceedings of SMTA International, Rosemont, IL,
Sept. 22-26, 2019, pp. 315-322.
Akopyan, I. Kh., Labzovskaya, M. E., Novikov, B. V., and Tsagan-Mandzhieva, D.
A.,
"Photostimulated Growth of Whiskers in AgI-Type Superionic Crystals,"
Journal of Technical Physics (USSR), vol. 57 no. 2, pp. 220-224, Feb.
2012.
https://doi.org/10.1134/S1063784212020028
Akram, Slaman,
"Lead-Free Electronics: Searching for a Lead Replacement," Future
Fab International, vol. 9, pp. xx-xx, Jan. 7, 2000.
Aksoy, Burcu, Kalay, Yunus Eren, and Unalan, Husnu Emrah,
"Germanium nanowire synthesis using solid precursors," Journal of
Crystal Growth, vol. 392, pp. 20-29, Apr. 15, 2014.
Aksoz, Namik, Ozturk, Esra, Bayram, Umit, Aksoz, Sezen, Kervan, Selcuk, Ulgen,
Ahmet, and Marasli, Necmettin,
"Thermal Conductivity Variation with Temperature for Lead-Free Ternary
Eutectic Solders," Journal of Electronic Materials, vol. 42 no.
12, pp. 3573-3581, Dec. 2013.
Akutsu, Takahiro, Yu, Qiang, and Nishimura, Yuji,
"Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder
Joints," 2010 12th Electronics Packaging Technology Conference,
Singapore, Dec. 8-10, 2010, pp. 550-555.
Akutsu, Takahiro, and Yu, Qiang,
"Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder
Joints," Proceedings of the ASME 2011 Pacific Rim Technical Conference
& Exposition on Packaging and Integration of Electronic and Photonic
Systems, Volume 2, Portland, OR, July 6-8, 2011, pp. 691-699.
Al Ahmar, Joseph, and Wiese, Steffen,
"FEM Simulation of Cracks in MLCC during Reflow Soldering," 2017 18th
International Conference on Thermal, Mechanical and Multi-Physics Simulation
and Experiments in Microelectronics and Microsystems, Dresden, Germany,
Apr. 3-5, 2017, pp. xx-xx.
Al Ahmar, Joseph, Wiss, Erik, and Wiese, Steffen,
"Fracture Probability of MLCC in Dependence of Solder Fillet Height,"
2017 18th International Conference on Thermal, Mechanical and Multi-Physics
Simulation and Experiments in Microelectronics and Microsystems,
Dresden, Germany, Apr. 3-5, 2017, pp. xx-xx.
Alagarsamy, Karthik, Kohani, Mehdi, Fortier, Aleksandra, and Pecht, Michael
G.,
"Risk of Tin Whiskers in Medical Devices," Journal of Biomedical
Engineering and Research, vol. 2 no. 101, pp. 1-10, 2018.
Alam, Javed, Riaz, Ufana, and Ahmad, Sharif,
"Development of nanostructured polyaniline dispersed smart anticorrosive
composite coatings," Polymers for Advanced Technologies, vol. 19
no. 7, pp. 882-888, July 2008.
Alam, Khairul, and Sajjad, Redwan N.,
"Electronic Properties and Orientation-Dependent Performance of InAs Nanowire
Transistors," IEEE Transactions on Electron Devices, vol. 57 no.
11, pp. 2880-2885, Nov. 2010.
Alam, M. E., Nai, S. M. L., and Gupta, M.,
"Development of high strength Sn-Cu solder using copper particles at
nanolength scale," Journal of Alloys and Compounds, vol. 476 no.
1-2, pp. 199-206, May 12, 2009.
Alam, M. E., Nai, S. M. L., and Gupta, M.,
"Effect of Amount of Cu on the Intermetallic Layer Thickness Between Sn-Cu
Solders and Cu Substrates," Journal of Electronic Materials, vol.
38 no. 12, pp. 2479-2488, Dec. 2009.
Alam, M. O., Chan, Y. C., and Tu, K. N.,
"Effect of 0.5 wt % Cu addition in Sn-3.5%Ag solder on the dissolution rate of
Cu metallization," Journal of Applied Physics, vol. 94 no. 12,
pp. 7904-7909, Dec. 15, 2003.
Alam, M. O., Chan. Y. C., Tu. N., and Kivilahti, K.,
"Effect of 0.5 wt % Cu in Sn-3.5%Ag Solder Balls on the Solid State
Interfacial Reaction with Au/Ni/Cu Bond Pads for Ball Grid Array (BGA)
Applications," Chemistry of Materials, vol. 17 no. 9, pp.
2223-2226, May 3, 2005.
Alam, M. O., Chan, Y. C., and Tu, K. N.,
"Effect of 0.5 wt % Cu in Sn-3.5%Ag Solder on the Interfacial Reaction with
Au/Ni Metallization," Chemistry of Materials, vol. 15 no. 23, pp,
4340-4342, 2003.
Alam, M. O., Chan, Y. C., and Tu, K. N.,
"Effect of reaction time and P content on mechanical strength of the interface
formed between eutectic Sn-Ag solder and Au/electroless Ni(P)/Cu bond pad,"
Journal of Applied Physics, vol. 94 no. 6, pp. 4108-4115, Sept.
15, 2003.
Alam, M. O., Lu, Hua, Bailey, Chris, and Chan, Y. C.,
"Finite-Element Simulation of Stress Intensity Factors in Solder Joint
Intermetallic Compounds," IEEE Transactions on Device and Materials
Reliability, vol. 9 no. 1, pp. 40-48, Mar. 2009.
Alam, M. O., Lu, H., Bailey, Chris, and Chan, Y. C.,
"Fracture Mechanics Analysis of Cracks in Solder Joint Intermetallic
Compounds," 2nd Electronics Systemintegration Technology Conference
, Greenwich, London, UK, Sept. 1-4, 2008, pp. 757-762.
Alam, M. O., Lu, H., Bailey, Chris, and Chan, Y. C.,
"Fracture mechanics analysis of solder joint intermetallic compounds in shear
test," Computational Materials Science, vol. 45 no. 2, pp.
576-583, Apr. 2009.
Alam, M. O., Bailey, Chris, Wu, B. Y., Yang, Dan, and Chan, Y. C.,
"High Current Density induced Damage Mechanisms in Electronic Solder Joints: A
State-of-the-Art Review," International Symposium on High Density
Packaging and Microsystem Integration, Shanghai, China, June 26-28,
2007, pp. xx-xx.
Alam, M. O., Chan, Y. C., and Hung, K. C.,
"Interfacial Reaction of Pb-Sn Solder and Sn-Ag Solder with Electroless Ni
Deposit during Reflow," Journal of Electronic Materials, vol. 31
no. 10, pp. 1117-1121, Oct. 2002.
Alam, M. O., and Chan, Y. C.,
"Interfacial Reaction Phenomena of Sn-Pb Solder with Au/Ni/Cu Metallization,"
Chemistry of Materials, vol. 17 no. 5, pp. 927-930, mar. 8, 2005.
Alam, M. O., Chan, Y. C., and Hung, K. C.,
"Reaction Kinetics of Pb-Sn and Sn-Ag Solder Balls with Electroless Ni-P/Cu
Pad During Reflow Soldering in Microelectronic Packaging," 2002
Proceedings 52nd Electronic Components & Technology Conference, San
Diego, CA, May 28-31, 2002, pp. 1650-1657.
Alam, M. O., Lu, H., Bailey, Chris, Wu, B. Y., and Chan, Y. C.,
"Shear Strength Analysis of Ball Grid Array (BGA) Solder Interfaces,"
9th Electronics Packaging Technology Conference, Singapore, Dec. 10-12,
2007, pp. 770-773.
Alam, M. O., Dan, Yang, Wu, B. Y., Chan, Y. C., Rufer, L., and Bailey, C.,
"Solid State Growth Kinetics of Complex Intermetallics in the Pb-free Ball
Grid Array (BGA) Solder Joint for MEMS Packaging," 8th Electronics
Packaging Technology Conference, Singapore, Dec. 6-8, 2006, pp.
211-213.
Alam, M. O., and Chan, Y. C.,
"Solid-state growth kinetics of Ni3Sn4 at the Sn-3.5Ag solder/Ni interface,"
Journal of Applied Physics, vol. 98 no. 12, pp.
123527-1-123527-4, Dec. 15, 2005.
Alam, Mohammad Ohidul, and Chan, Y. C.,
"Effect of 0.5 wt% Cu in Sn-3.5%Ag Solder to Retard Interfacial Reactions With
the Electroless Ni-P Metallization for BGA Solder Joints Application,"
IEEE Transactions on Components and Packaging Technologies, vol. 31 no.
2, pp. 431-438, June 2008.
Alam, Mohammad S., Hassan, K. M. Rafidh, Suhling, Jeffrey C., and Lall,
Pradeep,
"A Comparative Study of the High Temperature Mechanical Behavior of Lead Free
Solders," 2018 17th IEEE Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May
29-June 1, 2018, pp. 1314-1323.
Alam, Mohammad S., Hassan, K. M. Rafidh, Suhling, Jeffrey C., and Lall,
Pradeep,
"High Temperature Aging Effects in SAC and SAC+X Lead Free Solders,"
2019 IEEE 69th Electronic Components and Technology Conference, Las
Vegas, NV, May 28-31, 2019, pp. 1815-1825.
Alam, Mohammad S., Hassan, K. M. Rafidh, Suhling, Jeffrey C., and Lall,
Pradeep,
"High Temperature Mechanical Behavior of SAC and SAC+X Lead Free Solders,"
2018 IEEE 68th Electronic Components and Technology Conference,
San Diego, CA, May 29-June 1, 2018, pp. 1781-1789.
Alam, Mohammad S., Hassan, K. M. Rafidh, Fahim, Abdullah, Wu, Jing, Ahmed,
Sudan, Suhling, Jeffrey C., and Lall, Pradeep,
"Investigation of the Mechanical Behavior of SAC305 Solder Joints at Extreme
High Temperatures Using Nanoindentation," 2020 IEEE 70th Electronic
Components and Technology Conference, Lake Buena Vista, AL, May 26-29,
2020, pp. 2175-2184.
Alam, Mohammad S., Hassan, KM Rafidh, Suhling, Jeffrey C., and Lall, Pradeep,
"Mechanical Characterization and Microstructural Evolution of SAC and SAC+X
Lead Free Solders Subjected to High Temperature Aging," 2019 18th IEEE
Intersociety Conference on Thermal and Thermomechanical Phenomena in
Electronic Systems, Las Vegas, NV, May 28-31, 2019, pp. 319-328.
Alam, Mohammad S., Basit, Munshi, Suhling, Jeffrey C., and Lall, Pradeep,
"Mechanical Characterization of SAC305 Lead Free Solder at High Temperatures,"
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical
Phenomena in Electronic Systems, Las Vegas, NV, May 31-June 3,
2016, pp. 755-760.
Alarifi, Hani, Hu, Anming, Yavuz, Mustafa, and Zhou, Y. Norman,
"Silver Nanoparticle Paste for Low-Temperature Bonding of Copper,"
Journal of Electronic Materials, vol. xx no. x, pp. xx-xx, xxxx.
Alaviitala, Tiina, and Mattila, Tuomas J.,
"Engineered nanomaterials reduce but do not resolve life cycle environmental
impacts of power capacitors," Journal of Cleaner Production, vol.
93, pp. 347-353, Apr. 15, 2015.
Alaya, Mohamed Amine, Gal, Laszlo, Hurtony, Tamas, Medgyes, Balint,
Straubinger, Daniel, I, Al-Maaiteh Tareq, Illes, Balazs, and Geczy, Attila,
"Wetting of different lead free solder alloys during vapour phase soldering,"
2019 42nd International Spring Seminar on Electronics Technology,
Wroclaw, Poland, May 15-19, 2019, pp. xx-xx.
Albano, M., Fichera, G. V., Rovetta, T., Guida, G., Licchelli, M., Merlo, C.,
Cofrancesco, P., Milanese, C., and Malagodi, M.,
"Microstructural investigations on historical organ pipes," Journal of
Materials Science, vol. 52 no. 16, pp. 9859-9871, Aug. 2017.
Alber, Sebastian, Greif, Andre, and Rodrigo, Julio,
"Results from the SEES Project: Recyclability and Sustainability of Automotive
Electrical and Electronic Systems," InLCA/LCN 2006,
Washington, DC, Oct. 4-6, 2006, pp. xx-xx.
Albert, F.,and Schmidt, M.,
"Laserstrahlbasiertes Reparaturloten in der Elektronik-Produktion (Laser based
rework in electronic production)," Materialwissenschaft und
Werkstofftechnik, vol. 36 no. 2, pp. 69-74, Feb. 2005.
Alberth, W., and Schumacher, H.,
"Lead-free Soldering - A Challenge for Base Materials," Isola, Jan. 3,
2005.
Alberti, R., Longoni, A., Klatka, T., Guazzoni, C., Gianoncelli, A., Bacescu,
D., and Kaulich, B.,
"A Low Energy X-Ray Fluorescence Spectrometer for Elemental Mapping X-Ray
Microscopy," IEEE Nuclear Science Symposium Conference Record,
Dresden, Germany, Oct. 19-25, 2008, pp. 1564-1566.
Albrecht, H.-J., Brodie, D. S., Gunn, A. J., Muller, W. H., and Reuben, R. L.,
"A Study of Microstructural Change of Lead-Containing and Lead Free Solders,"
2002 Pan Pacific Symposium Conference Proceedings, Maui, Hawaii,
Feb. 5-7, 2002, pp. xx-xx.
Albrecht, H.-J., Brodie, D. S., Gunn, A. J., Muller, W. H., and Reuben, R. L.,
"A Study of Microstructural Change of Lead-Containing and Lead-Free Solders,"
Journal of SMT, vol. 15 no. 2, pp. 30-39, Apr. 2002.
Albrecht, H.-J.,
"Advanced Packages and Board Level Reliability," 1st Electronics
Systemintegration Technology Conference, Volume 1, Dresden, Germany,
Sept. 5-7, 2006, pp. 203-208.
Albrecht, H.-J., Walter, H., and Lantzsch, M.,
"Alternative Lead Free Ball Materials with Improved Interface Properties,"
2003 SMTA International Conference Proceedings, Chicago, IL,
Sept. 21-25, 2003, pp. 686-692.
Albrecht, H.-J.,
"Board Level Reliability of Lead Free Soldered Interconnections," 2000
SMTA International Conference Proceedings, Chicago, IL, Sept. 24-28,
2000, pp. xx-xx.
Albrecht, H.-J., Wilke, K., and Brodie, D. S.,
"Board Level Reliability of Lead-Free Soldered Interconnections," 2002
SMTA International Conference Proceedings, Chicago, IL, Sept. 22-26,
2002, pp. xx-xx.
Albrecht, H.-J., and Wilke, K.,
"Board Level Reliability of Lead-Free Soldered Interconnects on Conventional
and Area Array Components," 2001 SMTA International Conference
Proceedings, Chicago, IL, Sept. 30-Oct. 4, 2001, pp. xx-xx.
Albrecht, H.-J., Heimann, M., Gotze, Ch., and Loffler, M.,
"Board Level Reliability of Lead-Free Soldered Interconnects - Test Methods,"
SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp.
380-389.
Albrecht, H.-J.,
"Interface Description and Failure Mechanism of SnAgCu Solders in BGA
Packages," 2004 SMTA International Conference Proceedings,
Chicago, IL, Sept. 26-30, 2004, pp. 309-313.
Albrecht, H.-J., and Strogies, J.,
"Investigations studying the electromigration phenomena in interconnects,"
2014 Electronics System-Integration Technology Conference,
Helsinki, Finland, Sept. 16-18, 2014, pp. xx-xx.
Albrecht, H.-J., and Loffler, M.,
"Lead-Free Solder Alloy Optimization for Improved Reliability," 2006
SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28,
2006, pp. 126-133.
Albrecht, H.-J.,
"Lead-Free Solder Joints and Failure Mechanism on Different Finishes,"
2005 SMTA International Conference Proceedings, Chicago, IL, Sept.
25-29, 2005, pp. 584-590.
Albrecht, H.-J., Fruhauf, P., and Wilke, K.,
"Pb-Free Alloy Alternatives: Reliability Investigation," SMTA
International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 308-316.
Albrecht, Hans-Jurgen, and Wilke, Klaus,
"Material-Dependent Reliability Characteristics of Lead-Free Solder Joints,"
1st Electronics Systemintegration Technology Conference, Volume 1
, Dresden, Germany, Sept. 5-7, 2006, pp. 133-138.
Albrecht, Hans-Jurgen,
"Siemens AG Berlin: Overview about the Project Group Reliability and Lead-free
Activities," Siemens AG, 2003.
Albright, Brian,
"European Environmental Regulations Pose Supply Chain Challenge,"
Frontline Solutions, vol. xx no. xx, pp. xx-xx. Mar. 15, 2005.
Alducin, Diego, Borja, Raul, Ortega, Eduardo, Velazquez-Salazar, J. Jesus,
Covarrubias, Mario, Santoyo, Fernando Mendoza, Bazan-Diaz, Lourdes, Sanchez,
John Eder, Torres, Nayely, Ponce, Arturo, and Jose-Yacaman, Miguel,
"In situ transmission electron microscopy mechanical deformation and fracture
of a silver nanowire," Scripta Materialia, vol. 113, pp. 63-67,
Mar. 1, 2016.
Alexander, Curt,
"Cleaning Flux Residue in Hand Solder Rework and the Effects on SIR,"
Circuits Assembly, vol. 17 no. 9, pp. 65-66, Sept. 2006.
Alexander, Ralph B.,
"Ion Implantation Comes to the Rescue of Hard Chromium Plating," Plating
& Surface Finishing, vol. 83 no. 7, pp. 9-11, July 1996.
Alexis, J., Adrian, D., Masri, T., and Petit, J. A.,
"Adherence of Electrodeposited Zn-Ni Coatings on EN AW2024 T3 Aluminium
Alloy," Surface Engineering, vol. 20 no. 2, pp. 121-127, Apr.
2004.
Al-Ezzi, Athil, Al-Bawee, Abbas, Dawood, Feryal, and Shehab, Abeer A.,
"Effect of Bismuth Addition on Physical Properties of Sn-Zn Lead-Free Solder
Alloy," Journal of Electronic Materials, vol. 48 no. 12, pp.
8089-8095, Dec. 2019.
Alfred, Yeo, Bernd, Ebersberger, and Charles, Lee,
"Consideration of temperature and current stress testing on flip chip solder
interconnects," Microelectronics Reliability, vol. 48 no. 11-12,
pp. 1847-1856, Nov.-Dec. 2008.
Al-Ganainy, G. S.,
"Creep Characteristics of a New Pb-Free Soldering Sn-In Pewter," Physica
Status Solidi (A) - Applications and Materials Science, vol. 193 no. 2,
pp. 226-235, Sept. 2002.
Al-Ganainy, G. S., El-Daly, A. A., Fawzy, A., and Hussein, N.,
"Effect of adding nanometric ZnO particles on thermal, microstructure and
tensile creep properties of Sn-6.5 wt%Zn-3 wt%In solder alloy," Journal
of Materials Science: Materials in Electronics, vol. 28 no. 17, pp.
13303-13312, Sept. 2017.
Al-Ganainy, G. S.,
"Effect of heat treatment on the work-hardening parameters of a new Pb-free
solder Sn-9.8 wt% In alloy," Physica Status Solidi (A), vol. 199
no. 2, pp. 169-176, Aug. 14, 2003.
Al-Ganainy, G. S., El-Khalek, A. M. Abd, and Sakr, M. S.,
"Influence of heat treatment on stress-strain behaviour and lattice parameters
of Sn-In alloy," Materials Science and Technology, vol. xx no.
xx, pp. xx-xx, xxxx.
Algarni, Zaina, Singh, Abhay, and Philipose, U.,
"Role of chemical potential and limitations of growth kinematics on
stoichiometry of indium antimonide nanowires," Materials Chemistry and
Physics, vol. 219, pp. 196-203, Nov. 1, 2018.
Alghoul, T., Wentlent, L., Sivasubramony, R., Greene, C., Thompson, P., and
Borgesen, P.,
"Diffusion Creep of Realistic SnAgCu Solder Joints at Times and Stresses of
Relevance to Thermal Fatigue," IEEE Transactions on Components,
Packaging, and Manufacturing Technology, vol. 10 no. 2, pp. 288-295,
Feb. 2020.
Alghoul, T., Wentlent, L., Sivasubramony, R., Greene, C., Thompson, P., and
Borgesen, P.,
"Effects of Thermal Cycling on Creep of SnAgCu Solder Joints," IEEE
Transactions on Components, Packaging, and Manufacturing Technology,
vol. 9 no. 5, pp. 888-894, May 2019.
Alghoul, Thaer, Watson, Dustin, Adams, Nardeeka, Khasawneh, Saif, Batieha,
Farhan, Greene, Chris, and Borgesen, Peter,
"Constitutive Relations for Finite Element Modeling of SnAgCu in Thermal
Cycling -- How Wrong We Were!," 2016 IEEE 66th Electronic Components and
Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp.
1726-1732.
Alghoul, Thaer M., Yadav, Manu, Thekkut, Sanoop, Sivasubramony, Rajesh S.,
Greene, Christopher M., Poliks, Mark D., Borgesen, Peter, Wentlent, Luke,
Meilunas, Michael, Stoffel, Nancy, Shaddock, David M., and Yin, Liang,
"Low Temperature Solder Attach of SnAgCu Bumped Components for a Flexible
Hybrid Electronics Based Medical Monitor," 2018 IEEE 68th Electronic
Components and Technology Conference, San Diego, CA, May 29-June 1,
2018, pp. 948-953.
Ali, Bakhtiar,
"Advancement in microstructure and mechanical properties of lanthanum-doped
tin-silver-copper lead free solders by optimizing the lanthanum doping
concentration," Soldering & Surface Mount Technology, vol. 27
no. 2, pp. 69-75, 2015.
Ali, Bakhtiar, Sabri, Mohd Faizul Mohd, Said, Suhana Mohd, Sukiman, Nazatul
Liana, Jauhari, Iswadi, and Soin, Norhayati,
"High impact reliability and high temperature performance of Fe and Bi added
Sn-1Ag-0.5Cu solder alloys," Journal of Materials Science: Materials in
Electronics, vol. 28 no. 10, pp. 7277-7285, May 2017.
Ali, Bakhtiar, Sabri, Mohd Faizul Mohd, Jauhari, Iswadi, and Sukiman, Nazatul
Liana,
"Impact toughness, hardness and shear strength of Fe and Bi added Sn-1Ag-0.5Cu
lead-free solders," Microelectronics Reliability, vol. 63, pp.
224-230, Aug. 2016.
Ali, Bakhtiar, Sabri, Mohd Faizul Mohd, Sukiman, Nazatul Liana, and Jauhari,
Iswadi,
"Microhardness and shear performance of Fe/Bi-bearing SAC105 solder alloys
under high temperature aging," Journal of Materials Science: Materials in
Electronics, vol. 28 no. 1, pp. 197-206, Jan. 2017.
Ali, Bakhtiar, Sabri, Mohd Faizul Mohd, Said, Suhana Mohd, Sukiman, Nazatul
Liana, Jauhari, Iswadi, and Mahdavifard, Mohammad Hossein,
"Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder
alloy under high temperature environment," Microelectronics Reliability
, vol. 82, pp. 171-178, Mar. 2018.
Ali, Bakhtiar, Sabri, Mohd Faizul Mohd, Said, Suhana Mohd, Mahdavifard,
Mohammad Hossein, Sukiman, Nazatul Liana, and Jauhari, Iswadi,
"Microstructural Modification of Sn-0.7Cu Solder Alloys by Fe/Bi-Addition for
Achieving High Mechanical Performance," Journal of Electronic Materials
, vol. 46 no. 8, pp. 4755-4764, Aug. 2017.
Ali, L., Chan, Y. C., and Alam, M. O.,
"The effect of thermal cycling on the contact resistance of anisotropic
conductive joints," Soldering & Surface Mount Technology,
vol. 17 no. 3, pp. 20-31, 2005.
Ali, Lafir, Chan, Y. C., and Alam, M. O.,
"Effect of Bump Characteristics and Temperature Variation on the Online
Contact Resistance of Anisotropic Conductive Joints," Journal of
Electronic Materials, vol. 33 no. 9, pp. 1028-1035, Sept. 2004.
Ali, Lafir, and Chan, Y. C.,
"Impact of RoHS/WEEE - On Effective Recycling - Electronics System
Integration," 2nd Electronics Systemintegration Technology
Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 521-524.
Ali, Lafir, Chan, Y. C., and Alam, M. O.,
"Reliability of anisotropic conductive joints for bumpless flip-Chip on flex
packages under thermal stresses," Journal of Microelectronics and
Electronic Packaging, vol. 2 no. 4, pp. 269-280, Fourth Quarter 2005.
Ali, Syed W.,
"Mixed Signal Design Considerations," Printed Circuit Design and Fab
, vol 25 no. 10, pp. 29-31, Oct. 2008.
Aliwell, Rick,
"Lead Free Seminar: A Component Manufacturers View," SMART Group
Lead-Free Seminar 2000, High Wycombe, UK, Feb. 10, 2000.
Alkorta, J., and Sevillano, J. Gil,
"Measuring the strain rate sensitivity by instrumented indentation.
Application to an ultrafine grain (equal channel angular-pressed) eutectic
Sn-Bi alloy," Journal of Materials Research, vol. 19 no. 1, pp.
282-290, Jan. 2004.
Allachi, H., Chaouket, F., and Draoui, K.,
"Protection against corrosion in marine environments of AA6060 aluminium alloy
by cerium chlorides," Journal of Alloys and Compounds, vol. 491
no. 1-2, pp. 223-229, Feb. 18, 2010.
Allain, P. E., Le Roux, X., Parrain, F., and Bosseboeuf, A.,
"Large initial compressive stress in top-down fabricated silicon nanowires
evidenced by static buckling," Journal of Micromechanics and
Microengineering, vol. 23 no. 1,
pp. 015014-1-015014-8, Jan. 2013.
Allain, Pierre Etienne, Parrain, Fabien, Bosseboeuf, Alain, Maaroufi,
Seifeddine, Coste, Philippe, and Walther, Arnaud,
"Large-Range MEMS Motion Detection With Subangstrom Noise Level Using an
Integrated Piezoresistive Silicon Nanowire," IEEE/ASME Journal of
Microelectromechanical Systems, vol. 22 no. 3, pp. 716-722, June 2013.
Allan, Keri,
"system failure," Engineering and Technology, vol. 3 no. 20, pp.
66-67, Nov. 22-Dec. 5, 2008.
Allan, W. J., and Webb, W. W.,
"Some observations on mechanisms of growth of metal whiskers," Acta
Metallurgica, vol. 7 no. 9, pp. 646-648, Sept. 1959.
Allder, Brian,
"Lead Free Soldering," SMART Group Ireland Lead-free Seminar,
Dublin, Ireland, Oct. 22, 2003.
Allen, Aileen, Henshall, Gregory, Troxel, Kris, Miremadi, Jian, Benedetto,
Elizabeth, Holder, Helen, and Roesch, Michael,
"Acceptance Testing of BGA Ball Alloys," 2010 Proceedings 60th
Electronic Components and Technology Conference , Las Vegas, NV, June
1-4, 2010, pp. 182-187.
Allen, Joseph G., McClean, Michael D., Stapleton, Heather M., and Webster,
Thomas F.,
"Linking PBDEs in House Dust to Consumer Products using X-ray Fluorescence,"
Environmental Science & Technology, vol. 42 no. 11, pp.
4222-4228, 2008.
Allen, Marybeth,
"Honey, I Shrunk the Process Window," Advanced Packaging,
vol. 15 no. 2, pp. 12, Feb. 2006.
Allen, Sarah L., Notis, Michael R., Chromik, Richard R., and Vinci, Richard P.,
"Coarsening in tin-silver-copper lead-free solder alloys," Lehigh
University.
Allen, Sarah L., Notis, Michael R., Chromik, Richard R., and Vinci, Richard
P.,
"Microstructural evolution in lead-free solder alloys: Part I. Cast Sn-Ag-Cu
eutectic," Journal of Materials Research, vol. 19 no. 5, pp.
1417-1424, May 2004.
Allen, Sarah L., Notis, Michael R., Chromik, Richard R., Vinci, Richard P.,
Lewis, Daniel J., and Schaefer, Robert,
"Microstructural evolution in lead-free solder alloys: Part II. Directionally
solidified Sn-Ag-Cu, Sn-Cu and Sn-Ag," Journal of Materials Research
, vol. 19 no. 5, pp. 1425-1431, May 2004.
Allen, Woody, Heimann, Nancy, and Soucie, Wayne,
"Replacing Chromates," Proceedings 2004 AESF/EPA Conference for
Environmental & Process Excellence, Orlando, FL, Jan. 26-29, 2004,
pp. 99-106.
Allenby, B. R., Ciccarclli, J. P., Artaki, I., Fisher, J. R., Schoenthaler,
D., Carroll, T. A., Dahringer, D. W., Degani, Y., Freund, R. S., Graedel, T.
E., Lyons, A. M., Plewes, J. T., Gherman, C., Solomon, H., Melton, C., Munie,
G. C., and Socolowski, N.,
"An Assessment of the Use of Lead in Electronic Assembly," Surface Mount
International Conference & Exposition Proceedings of the Technical
Program, Volume I, San Jose, CA, Sept. 1-3, 1992, pp. 1-28.
Allison, Martin,
"Lead-Free Soldering Status In Japan and Main Europe 2003," SMART Group
6th Annual Lead-Free Seminar and Table-top Exhibition, High Wycombe,
United Kingdom, Feb. 3, 2004.
Allison, Martin,
"Senju Metal Industry," SMART Group Pin In Hole Odd Form Assembly and
Soldering Workshop, Bracknell, United Kingdom, Sept. 24, 2002.
Almasi-Kashi, M., Ramazani, A., Kheyri, F., and Jafari-Khamse, E.,
"The effect of magnetic layer thickness on magnetic properties of Fe/Cu
multilayer nanowires," Materials Chemistry and Physics, vol. 144
no. 3, pp. 230-234, Apr. 15, 2014.
Almeida, C. M. V. B., Madureira, M. A., Bonilla, S. H., and Giannetti, B. F.,
"Assessing the replacement of lead in solders: effects on resource use and
human health," Journal of Cleaner Production, vol. 47, pp.
457-464, May 2013.
Almeida, E.,
"Surface Treatments and Coatings for Metals. A General Overview. 1. Surface
Treatments, Surface Preparation, and the Nature of Coatings," Industrial
Engineering Chemical Research, vol. 40 no. 1, pp. 3-14, 2001.
Al-Momani, Emad, Khasawneh, Mohammed T., and Sammakia, Bahgat,
"A Closed-Form Norris-Landzberg Solder Reliability Model," Conference
Proceedings of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014,
pp. 530-535.
Al-Momani, Emad S., Borgesen, Peter, Khasawneh, Mohammad, Sammakia, Bahgat,
Alqudah, Rajaa, and Meilunas, Michael,
"A Tool for Predicting Reliability of Lead-Free Soldered Electronic Packages
under Thermal Cycling Conditions," International Conference on Soldering
& Reliability 2010 Proceedings, Toronto, Ontario, Canada, May
17-20, 2010, pp. xx-xx.
Al-Momani, Emad S., Khasawneh, Mohammad T., and Sammakia, Bahgat,
"An Approach for Assessing the Long-Term Reliability of Lead-Free Electronics
Under In-Field Conditions," IEEE Transactions on Device and Materials
Reliability, vol. 16 no. 4, pp. 532-540, Dec. 2016.
Al-Mufti, A. Wesam, Hashim, U., and Adam, Tijjani,
"Effect of electric potential into conductance silicon nanowire distribution,"
Microsystem Technologies, vol. 21 no. 3, pp. 693-697, Mar. 2015.
Alonso, Juan C., Dose, Julia, Fleischer, Gunter, Geraghty, Kate, Greif, Andre,
Rodrigo, Julio, and Schmidt, Wulf-Peter,
"Electrical and Electronic Components in the Automotive Sector: Economic and
Environmental Assessment," International Journal of Life Cycle
Assessment, vol. 12 no. 5, pp. 328-335, July 2007.
Alonzo, Juan Carlos, and Cubero, Jose Antonio,
"Use of Pb-Free Solder Alloys in Electrical & Electronic Devices for the
Automotive Industry." IPC and Soldertec Global Conference on Lead
Free Electronics, Brussels, Belgium, June 11-12, 2003, pp. xx-xx.
Alpern, P., Lee, K. C., and Tilgner, R.,
"Effect of long and short Pb-free soldering profiles of IPC/JEDEC J-STD-020 on
plastic SMD packages," Microelectronics Reliability, vol. 44, no.
9-11, pp. 1293-1297, Sept.-Nov. 2004.
Alpern, Peter, and Lee, Kheng Chooi,
"Moisture-Induced Delamination in Plastic Encapsulated Microelectronic
Devices: A Physics of Failure Approach," IEEE Transactions on Device and
Materials Reliability, vol. 8 no. 3, pp. 478-483, Sept. 2008.
Al-Salman, Rihab, Sommer, Heino, Brezesinski, Torsten, and Janek, Jurgen,
"Template-Free Electrochemical Synthesis of High Aspect Ratio Sn Nanowires in
Ionic Liquids: A General Route to Large-Area Metal and Semimetal Nanowire
Arrays?," Chemistry of Materials, vol. 27 no. 11, pp. 3830-3837,
June 9, 2015.
Alsharif, Nouf A., Martinez-Banderas, Aldo I., Merzaban, Jasmeen, Ravasi,
Timothy, and Kosel, Jurgen,
"Biofunctionalizing Magnetic Nanowires Toward Targeting and Killing Leukemia
Cancer Cells," IEEE Transactions on Magnetics, vol. 55 no. 2 part
1, pp. 5400105, Feb. 2019.
Alston, Sue M., Clark, Allan D., Arnold, J. Cris, and Stein, Bridget K.,
"Environmental Impact of Pyrolysis of Mixed WEEE Plastics Part 1: Experimental
Pyrolysis Data," Environmental Science & Technology, vol. 45
no. 21, pp. 9380-9385, Nov. 1, 2011.
Alston, Sue M., and Arnold, J. Cris,
"Environmental Impact of Pyrolysis of Mixed WEEE Plastics Part 2: Life Cycle
Assessment," Environmental Science & Technology, vol. 45 no.
21, pp. 9386-9392, Nov. 1, 2011.
Al-Taay, H. F., Mahdi, M. A., Parlevliet, D., and Jennings, P.,
"Controlling the diameter of silicon nanowires grown using a tin catalyst,"
Materials Science in Semiconductor Processing, vol. 16 no.
1, pp. 15-22, Feb. 2013.
Altay, M. Cumbul, and Eroglu, S.,
"Chemical vapor deposition of Ge nanowires from readily available GeO2 and
CH4 precursors," Journal of Crystal Growth, vol. 551, pp.
125886-1-125886-5, Dec. 2020.
https://doi.org/10.1016/j.jcrysgro.2020.125886
Altay, M. Cumbul, and Eroglu, S.,
"Growth of Ge Nanowires by Chemical Vapor Deposition at Atmospheric Pressure
Using Readily Available Precursors GeO2 and C2H5OH," JOM, vol. 72
no. 12, pp. 4340-4345, Dec. 2020.
https://doi-org.ezproxy.uky.edu/10.1007/s11837-020-04401-3
Altmayer, Frank,
"4 Questions (On Platers' Minds)."
Altmayer, Frank,
"A visit from old man "whiskers"," Plating &Surface Finishing
, vol. 90 no. 2, pp. 16-17, Feb. 2003.
Altmayer, Frank,
"Colombo, Part 1," Plating & Surface Finishing, vol. 86 no.
3, pp. 58-60, Mar. 1999.
Altmayer, Frank,
"Comparing Substitutes for Cr and CU, to Prevent Pollution," Plating
& Surface Finishing, vol. 80 no. 2, pp. 40, 42-43, Feb. 1993.
Altmayer, Frank,
"Comparing Substitutes for Cr and CU, to Prevent Pollution, Part Two"
Plating & Surface Finishing, vol. 80 no. 3, pp. 32-35, 37, Mar.
1993.
Altmayer, Frank,
"Complying with Cadmium Standards," Plating & Surface Finishing
, vol. 80 no. 4, pp. 60-61, Apr. 1993.
Altmayer, Frank,
"ELV, WEE, RoHS and Hex-Chrome Testing," Products Finishing,
vol. 70 no. 11, pp. 58-61, Aug. 2006.
Altmayer, Frank,
"From the Mailbox: Fastener Questions," Plating & Surface Finishing
, vol. 78 no. 12, pp. 35-36, Dec. 1991.
Altmayer, Frank,
"Hexavalent Chromium Headaches," Plating and Surface Finishing,
vol. 92 no. 3, pp. 30-31, Mar. 2005.
Altmayer, Frank,
"Is Cadmium Finished?," Plating & Surface Finishing, vol. 94
no. 2, pp. 16-18, Feb. 2007.
Altmayer, Frank,
"Is Cadmium Finished? (Continued)," Plating & Surface Finishing
, vol. 94 no. 3, pp. 22-23, 26, Mar. 2007.
Altmayer, Frank,
"Mail Call," Plating & Surface Finishing, vol. 92 no. 10, pp.
30-31, Oct. 2005.
Altmayer, Frank,
"More RoHS/ELV/WEEE Confusion," Plating & Surface Finishing,
vol. 93 no. 5, pp. 24, 28, May. 2006.
Altmayer, Frank,
"Test Finished Parts for Hex Chrome," Plating & Surface Finishing
, vol. 91 no. 12, pp. 20, 23, Dec. 2004.
Altmayer, Frank,
"The Hunt for Quicksilver," Plating & Surface Finishing, vol.
80 no. 1, pp. 35-37, Jan. 1993.
Altmayer, Frank,
"Tin Basics," Plating and Surface Finishing, vol. 92 no. 5, pp.
36-37, May 2005.
Altmayer, Frank,
""Verboten"," Plating and Surface Finishing, vol. 92 no. 9, pp.
20-21, Sept. 2005.
Altmayer, Frank,
"WEEE + RoHS + ELV = Co + N + F + U + S + I + O + N," Plating &
Surface Finishing, vol. 92 no. 2, pp. 12-13, Feb. 2006.
Altmayer, Frank,
"What Causes Macro-Cracks In Chromium Deposits," Plating & Surface
Finishing, vol. 89 no. 12, pp. 40, Dec. 2002.
Altmayer, Frank,
"What is RoHS?," Plating & Surface Finishing, vol. 91 no. 10,
pp. 30-34, Oct. 2004.
Alvarado, Rey, Keser, Beth, Zhou, Eric, Schwarz, Mark, Bezuk, Steve, Wang,
Henry, and Heng, Kok-Lin,
"Study of New Alloy Composition for Solder Balls - Identifying Material
Properties as Key Leading Indicators Toward Improved Board Level Performance,"
2015 IEEE 65th Electronic Components and Technology Conference,
San Diego, CA, May 26-29, 2015, pp. 1753-1757.
Alvarez, Samuel, Ye, Shengrong, Flowers, Patrick F., and Wiley, Benjamin J.,
"Photocatalytic Growth of Copper Nanowires from Cu2O Seeds," Chemistry
of Materials, vol. 27 no. 2, pp. 570-573, Jan. 27, 2015.
Alvarez-Caicoya, Jaime, Cosme-Torres, Antonio J., and Ortiz-Rivera, Eduardo
I.,
"Compact Fluorescent Lamps, an Anticipatory Mind to Mercury," IEEE
Potentials, vol. 30 no. 1, pp. 35-38, Jan./Feb. 2011.
Al-Yafawi, Abdullah, Patil, Saket, Yu, Da, Park, Seungbae, Pitarresi, James,
and Goo, Namseo,
"Random Vibration Test for Electronic Assemblies Fatigue Life Estimation,"
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical
Phenomena in Electronic Systems, Las Vegas, NV, June 2-5, 2010, pp.
xx-xx.
Al-Yafawi, Abdullah, Yu, Da, Park, Seungbae, Pitarresi, James, and Chung,
Soonwan,
"Reliability Assessment of Electronic Components under Random Vibration
Loading," 59th Electronic Components & Technology Conference,
San Diego, CA, May 26-29, 2009, pp. 431-436.
Amagai, Masazumi,
"A study of nanoparticles in Sn-Ag based lead free solders,"
Microelectronics Reliability, vol. 48 no. 1, pp. 1-16, Jan. 2008.
Amagai, Masazumi,
"A Study of Nano Particles in SnAg-Based Lead Free Solders for Intermetallic
Compounds and Drop Test Performance" Proceedings 56th Electronic
Components & Technology Conference, San Diego, CA, May 30-June 2,
2006, pp. 1170-1190.
Amagai, Masazumi,
"A study of nanoparticles in Sn-Ag based lead free solders,"
Microelectronics Reliability, vol. 48 no. 1, pp. 1-16, Jan. 2008.
Amagai, Masazumi, Toyoda, Yoshitaka, Ohnishi, Tsukasa, and Akita, Satoru,
"High Drop Test Reliability: Lead-free Solders," 54th Electronic
Components & Technology Conference, Volume 2, Las Vegas, NV, June
1-4, 2004, pp. 1304-1309.
Amagai, Masazumi, Toyoda, Yoshitaka, and Tajima, Takeshi,
"High Solder Joint Reliability with Lead Free Solders," 2003 Proceedings
53rd Electronic Components & Technology Conference, New Orleans,
LA, May 27-30, 2003, pp. 317-322.
Amagai, Masazumi, Watanabe, Masako, Omiya, Masaki, Kishimoto, Kikuo, and
Shibuya, Toshikazu,
"Mechanical characterization of Sn-Ag-based lead-free solders,"
Microelectronics Reliability, vol. 42 no. 6, pp. 951-966, June 2002.
Amagai, Masazumi, Suzuki, Yutaka, Abe, Kenji, Kim, YoungBae, and Sano,
Hitoyuki,
"Package-On-Package Mechanical Reliability Characterization," 9th
Electronics Packaging Technology Conference, Singapore, Dec. 10-12,
2007, pp. 557-570.
Amalu, E. H., Lau, W. K., Ekere, N. N., Bhatti, R. S., Mallik, S., Otiaba, K.
C., and Takyi, G.,
"A study of SnAgCu solder paste transfer efficiency and effects of optimal
reflow profile on solder deposits," Microelectronic Engineering,
vol. 88 no. 7, pp. 1610-1617, July 2011.
Amalu, Emeka H., and Ekere, N. N.,
"Damage of lead-free solder joints in flip chip assemblies subjected to
high-temperature thermal cycling," Computational Materials Science
, vol. 65, pp. 470-484, Dec. 2012.
Amalu, Emeka H., and Ekere, Ndy N.,
"High temperature reliability of lead-free solder joints in a flip chip
assembly," Journal of Materials Processing Technology, vol. 212
no. 2, pp. 471-483, Feb. 2012.
Amalu, Emeka H., and Ekere, Ndy N.,
"Prediction of damage and fatigue life of high-temperature flip chip assembly
interconnections at operations," Microelectronics Reliability,
vol. xx no. x, pp. xx-xx, xxxx.
Amami, Kazukoshi, Yuhaku, Satoru, Shiraishi, Tukasa, Itagaki, Minehiro,
Bessho, Yoshihiro, Eda, Kazuo, and Ishida, Toru,
"Stud-bump Bonding Technique onto an Advanced Organic Substrate for MCM-Ls,"
1st 1997 IEMT/IMC Symposium, Tokyo, Japan, Apr. 16-18, 1997, pp.
164-168.
Amarasekera, Jay, Liu, Bo, Cartier, Herve, and Chopin, Alexis,
"Halogen-Free Flame Retardant High Temperature Materials for Lead-Free
Soldering Applications," 2006 Medical Electronics Symposium Conference
Proceedings, Minneapolis, MN, May 15-17, 2006, pp. xx-xx.
Amato, Ivan,
"Tin Whiskers: The Next Y2K Problem?," Fortune, vol. xx no.
xx, pp. xx-xx, Dec. 29, 2004.
Ameen, Sadia, Park, Doo-Ri, and Shin, Hyung Shik,
"Silicon nanowires arrays for visible light driven photocatalytic degradation
of rose bengal dye," Journal of Materials Science: Materials in
Electronics, vol. 27 no. 10, pp. 10460-10467, Oct. 2016.
Ameer, M. A., Ghoneim, A. A., and Fekry, A. M.,
"The electrochemical behavior of Sn-Ag binary alloys in sulfate solutions,"
Materials and Corrosion, vol. 61 no. 7, pp. 580-589, July 2010.
Amelinckx, S., Bontinck, W., Dekeyser, W., and Seitz, F.,
"On the Formation and Properties of Helical Dislocations," The
Philosophical Magazine, series 8 vol. 2 no. 15, pp. 355-378, Mar. 1957.
Amey, Earle B.,
"Gold," Minerals Yearbook: Volume I. -- Metals and Minerals,
2003.
Amin, N. L. M., Yusof, S. Z., Kahar, M. N. A., Bakar, T. A. A., O, A., and
Fadil, N. A.,
"Tin Whiskers Formation and Growth on Immersion Sn Surface Finish under
External Stresses by Bending," Materials Science and Engineering,
vol. 238, pp. 012001-1-012001-5, 2017.
Amin, Nur Aishah Aminah Mohd, Shnawah, Dhafer Abdulameer, Said, Suhana Mohd,
Sabri, Mohd Faizul Mohd, and Arof, Hamzah,
"Effect of Ag content and the minor alloying element Fe on the electrical
resistivity of Sn-Ag-Cu solder alloy," Journal of Alloys and Compounds
, vol. 599, pp. 114-120, June 25, 2014.
Amir, Dudi, Walwadkar, Satyajit, Aravamudhan, Srinivasa, May, Lilia, and Tang,
Kok Kwan,
"Causes, Characterization and Mitigation of Non Wet Open Defects for Area
Array Components," South East Asia Technical Training Conference on
Electronics Assembly Technologies 2013 Proceedings, Penang, Malaysia,
Apr. 17-19, 2013, pp. xx-xx.
Amir, Dudi, Aspandiar, Raiyo, Buttars, Scott, Chin, Wei Wei, and Gill,
Paramjeet,
"Head - and - Pillow SMT Failure Modes," SMTA International Conference
, San Diego, CA, Oct. 4-8, 2009, pp. 409-421.
Amir, Dudi,
"Head-and-Pillow SMT Failure Modes (Tutorial 20)," SMTA International
2011 Conference, Fort Worth, TX, Oct. 16-20, 2011.
Amistoso, Jose Omar S., and Amorsolo Jr., Alberto V.,
"Study of Thermal Aging Effects on Intermetallic Growth Mechanisms and Shear
Strength Behavior of Wafer-Level Solder Bumps," IEEE Transactions on
Components and Packaging Technologies, vol. 32 no. 2, pp. 405-414, June
2009.
Amistoso, Jose Omar S., and Amorsolo Jr., Alberto V.,
"The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105
Solder Bumps," Journal of Electronic Packaging, vol. 131 no. 4,
pp. 041004-1-041004-6, Dec. 2009.
Amla, Tarun,
"Conductive Anodic Filament Growth Failure," IPC Printed Circuits
Expo 2002, pp. S08-2-1 to S08-2-6.
Amla, Tarun,
"Conductive Anodic Filament Growth Failure," Printed Circuit Fabrication
, vol. 25 no. 7, pp. 40-43, July 2002.
Ammons, Jane C., Assavapokee, Tiravat, Newton, David, and Realff, Matthew J.,
"Reverse production system design for recycling under uncertainty,"
Environmentally Conscious Manufacturing II (Proceedings of SPIE - The
International Society for Optical Engineering, Volume 4569), Newton,
USA, Oct. 28-29, 2001, pp. 1-12.
Amoli, Behnam Meschi, Trinidad, Josh, Hu, Anming, Zhou, Y. Norman, and Zhao,
Boxin,
"Highly electrically conductive adhesives using silver nanoparticle (Ag
NP)-decorated graphene: the effect of NPs sintering on the electrical
conductivity improvement," Journal of Materials Science: Materials in
Electronics, vol. xx no. x, pp. xx-xx, xxxx.
Amoli, Behnam Meschi, Hu, Anming, Zhou, Norman Y., and Zhao, Boxin,
"Recent progresses on hybrid micro-nano filler systems for electrically
conductive adhesives (ECAs) applications," Journal of Materials Science:
Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.
Amoli, Behnam Meschi, Trinidad, Josh, Zhou, Norman Y., Zhao, Boxin, Chen,
Alex, Persic, John, and Lyn, Robert,
"The Use of Graphene to Replace Silver in Electricaly Conductive Adhesives -
An Study on Electrical Conductivity and Mechanical Properties,"
International Conference on Soldering & Reliability 2015 Proceedings
, Toronto, Ontario, Canada, May 19-21, 2015, pp. xx-xx.
Amore, S., Delsante, S., Parodi, N., and Borzone, G.,
"Calorimetric Investigation of the Cu-Sn-Bi Lead-Free Solder System,"
Journal of Thermal Analysis and Calorimetry, vol. 92 no. 1, pp.
227-232, Apr. 2008.
Amore, S., Delsante, S., Parodi, N., and Borzone, G.,
"Thermochemistry of Pd-In, Pd-Sn and Pd-Zn alloy systems," Thermochimica
Acta, vol. 481 no. 1-2, pp. 1-6, Jan. 5, 2009.
Amore, S., Ricci, E., Borzone, G., and Novakovic, R.,
"Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates,"
Materials Science and Engineering: A, vol. 495 no. 1-2, pp.
108-112, Nov. 15, 2008.
Amore, Stefano, Ricci, Enrica, Lanata, Tiziana, and Novakovic, Rada,
"Surface tension and wetting behaviour of molten Cu-Sn alloys," Journal
of Alloys and Compounds, vol. 452 no. 1, pp. 161-166, Mar. 6, 2008.
Amorosi, Drew,
"Court of Appeals Upholds OSHA's Hex-Chrome PEL," Metal Finishing
, vol. 107 no. 5, pp. 16-17, May 2009.
Amram, Dor, Kovalenko, Oleg, Klinger, Leonid, and Rabkin, Eugen,
"Capillary-driven growth of metallic nanowires," Scripta Materialia
, vol. 109, pp. 44-47, Dec. 2015.
An, Bing, and Wu, Chi-man Lawrence,
"Evaluation of Wettability of Composite Solder Alloy Reinforced with Silver
and Copper Particles," 8th International Conference on Electronic
Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp. xx-xx.
An, Bing, Cai, Xiong-hui, Chu, Hua-bin, Lai, Xiao-wei, Wu, Feng-Shun, and Wu,
Yi-ping,
"Flex Reliability of RFID Inlays Assembled by Anisotropic Conductive
Adhesive," International Symposium on High Density Packaging and
Microsystem Integration, Shanghai, China, June 26-28, 2007, pp. xx-xx.
An, Bing, Wu, Yiping, Cai, Xionghui, and Wu, Fengshun,
"Reliability of RFID Tag Inlay Assembled by Anisotropic Conductive Adhesive,"
2nd Electronics Systemintegration Technology Conference,
Greenwich, London, UK, Sept. 1-4, 2008, pp. 1203-1207.
An, Bing, Gu, Guoqiang, Zhang, Wenfei, and Wu, Yiping,
"Shear Creep Behavior of Sn-3Ag-0.5Cu Solder Bumps in Ball Grid Array,"
2011 International Symposium on Advanced Packaging Materials, Xiamen,
China, Oct. 25-28, 2012, pp. 257-261.
An, Chengqiang, Liu, Chunming, Wang, Hao, and Zhang, Shudi,
"Research On The Corrosion Resistance Of Tinplate With Reflowing Technology,"
Advanced Materials Research, vol. 989-994, pp. 208-211, July
2014.
An, Lili, Ma, Haitao, Qu, Lin, Wang, Jie, Liu, Jiahui, and Huang, Mingliang,
"The Effect of Laser-soldering Parameters on the Sn-Ag-Cu/Cu Interfacial
Reaction," 2013 14th International Conference on Electronic Packaging
Technology, Dalian, China, Aug. 11-14, 2013, pp. 264-267.
An, M., Zhang, Y., Zhang, J., Yang, Z., and Tu, Z.,
"Mechanism of Additives in Electroplating of Zn-Zn Alloy," Plating &
Surface Finishing, vol. 86 no. 5, pp. 130-132, May 1999.
An, Qi, Wang, Chunqing, Zhao, Xiangxi, and Wang, Hong,
"The Mechanism Study of Low-Temperature Brittle Fracture of Bulk Sn-Based
Solder," 2017 18th International Conference on Electronic Packaging
Technology, Harbin, China, Aug. 16-19, 2017, pp. 1233-1237.
An, R., Wang, C. Q., and Tian, Y. H.,
"Elastic Property of Cu3Sn Determined by a First-Principles Calculation on
the Basis of its Crystal Substructure," 8th International Conference on
Electronic Packaging Technology, Shanghai, China, Aug. 14-17, 2007, pp.
xx-xx.
An, Rong, Wang, Chunqing, and Tian, Yanhong,
"Depiction of the Elastic Anisotropy of AuSn4 and AuSn2 from First-principles
Calculations," International Conference on Electronic Packaging
Technology & High Density Packaging, Beijing, China, Aug. 10-13,
2009, pp. 611-616.
An, Rong, Wang, Chunqing, and Tian, Yanhong,
"Determination of the Elastic Properties of Au5Sn and AuSn from Ab Initio
Calculations," Journal of Electronic Materials, vol. 37 no. 7,
pp. 968-974, July 2008.
An, Rong, Wang, Chunqing, Tian, Yanhong, and Wu, Huaping,
"Determination of the Elastic Properties of Cu3Sn Through First-Principles
Calculations," Journal of Electronic Materials, vol. 37 no. 4,
pp. 477-482, Apr. 2008.
An, Rong, Tian, Yanhong, Zhang, Rui, and Wang, Chunqing,
"Electromigration-induced intermetallic growth and voids formation in
symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints,"
Journal of Materials Science: Materials in Electronics, vol. 26 no. 5,
pp. 2674-2681, May 2015.
An, Rong, Wang, Chunqing, and Tian, Yanhong,
"First-Principles Study on the Elastic Anisotropy of Au-Sn Intermetallic
Compounds," International Conference on Electronic Packaging Technology
& High Density Packaging, Shanghai, China, July 28-31, 2008, pp.
xx-xx.
An, Rong, Ma, Huiwen, Li, Hailong, Zheng, Zhen, and Wang, Chunqing,
"Formation of single phase Cu-Sn IMCs via layer-by-layer electroplating of Cu
and Sn metals," 2014 15th International Conference on Electronic
Packaging Technology, Chengdu, China, Aug. 12-15, 2014, pp. 980-984.
An, Tong, and Qin, Fei,
"A Simplified Computational Model for Solder Joints under Drop Impact
Loadings," International Conference on Electronic Packaging Technology
& High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp.
209-214.
An, Tong, Qin, Fei, and Xia, Guofeng,
"Analytical Solutions and a Numerical Approach for Diffusion-Induced Stresses
in Intermetallic Compound Layers of Solder Joints," Journal of
Electronic Packaging, vol. 136 no. 1, pp. 011001-1-0110018, Mar. 2014.
An, Tong, and Qin, Fei,
"Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop
Impact Loading," Journal of Electronic Packaging, vol. 133 no. 3,
pp. 031004-1-031004-7, Sept. 2011.
An, Tong, and Qin, Fei,
"Effects of PCB Dynamic Responses on Solder Joint Stress," International
Conference on Electronic Packaging Technology & High Density Packaging
, Beijing, China, Aug. 10-13, 2009, pp. 370-373.
An, Tong, and Qin, Fei,
"Effects of the intermetallic compound microstructure on the tensile behavior
of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates,"
Microelectronics Reliability, vol. 54 no. 5, pp. 932-938, May 2014.
An, Tong, and Qin, Fei,
"Fracture Simulation of Solder Joint Interface by Cohesive Zone Model,"
International Conference on Electronic Packaging Technology & High Density
Packaging, Beijing, China, Aug. 10-13, 2009, pp. 260-266.
An, Tong, Qin, Fei, and Li, Jiangang,
"Influence of Strain Rate Effect on Behavior of Solder Joints under Drop
Impact Loadings," International Conference on Electronic Packaging
Technology & High Density Packaging, Beijing, China, Aug. 10-13,
2009, pp. 375-378.
An, Tong, and Qin, Fei,
"Intergranular cracking simulation of the intermetallic compound layer in
solder joints," Computational Materials Science, vol. 79, pp.
1-14, Nov. 2013.
An, Tong, Qin, Fei, and Li, Jiangang,
"Mechanical behavior of solder joints under dynamic four-point impact
bending," Microelectronics Reliability, vol. 51 no. 5, pp.
1011-1019, May 2011.
An, Tong, and Qin, Fei,
"Numerical simulation of the intermetallic compound cracking in solder joint,"
2014 15th International Conference on Electronic Packaging Technology
, Chengdu, China, Aug. 12-15, 2014, pp. 693-697.
An, Tong, and Qin, Fei,
"Relationship Between the Intermetallic Compounds Growth and the Microcracking
Behavior of Lead-Free Solder Joints," Journal of Electronic Packaging
, vol. 138 no. 1, pp. 011002-1-011002-10, Mar. 2016.
Anand, Ashok, and Mui, Y. C.,
"Lead-free Solder Evaluation For Ball Attache Process," Proceedings of
4th Electronics Packaging Technology Conference, Singapore, Dec. 10-12,
2002, pp. 6-10.
Anandakumar, S., Rani, V. Sudha, Rao, B. Parvatheeswara, Yoon, Seok Soo,
Jeong, J.-R., and Kim, CheolGi,
"Template Synthesis of Cobalt Nanowires Using PS-b-PMMA Block Copolymer,"
IEEE Transactions on Magnetics, vol. 45 no. 10, pp. 4063-4066,
Oct. 2009.
Anasyida, A. S., Nurulakmal, M. S., Yusoff, M., and Teh, C. L.,
"Microstructural study of Sn-3.0Ag0.5Cu alloy on Cu/NiP-coated substrate by
addition of Fe, Sb and Ce," Advanced Materials Research, vol.
858, pp. 116-121, Nov. 2013.
Anaya, Francisco,
"Wave Solder Thermal Profiling," Printed Circuit Design and Fab/
Circuits Assembly, vol. 27 no. 2, pp. 46-47, Feb. 2010.
Anbe, Yoshinobu,
"Why do solder spikes form?," Global SMT & Packaging,
vol. 6 no. 4, pp. 34, 36, 38, Apr. 2006.
Anderson, A. F.,
"Re the Tanya Spotts EDR results," Mar. 2012.
Anderson, A. F.,
"Review of VRTC MEMORANDUM REPORT EA-07-010 VRTC-DCD-7113," Oct. 11, 2009.
Anderson, Antony F.,
"Case Study: NHTSA's Denial of Dr Raghavan's Petition to Investigate Sudden
Acceleration in Toyota Vehicles Fitted With Electronic Throttles," IEEE
Access, Apr. 21, 2016.
Anderson, Antony,
"Comments on NHTSA 2014-0108: Intermittent Electronic/ Software Malfunctions -
Learning from Failures," Dec. 2, 2014.
Anderson, Antony F.,
"Intermittent Electrical Contact Resistance as a Contributory Factor in the
Loss of Automobile Speed Control Functional Integrity," IEEE Access, Apr.
9, 2014.
Anderson, Antony,
"Sudden Acceleration/Surge Incident Brandon Street, Wellington NZ," May
9, 2012.
Anderson, Antony, Kir, Brian, and Armstrong, Keith,
"The Poor Quality of Functional Safety Engineering in the Automobile
Industry," Inside Functional Safety, pp. xx-xx, 2010.
Anderson, Antony, Kir, Brian, and Armstrong, Keith,
"The Poor Quality of Functional Safety Engineering in the Automobile
Industry."
Anderson, Antony, Kirk, Brian, Armstrong, Keith,
"The Present Limitations of Motor Vehicle Electronic Data Recording,"
Dec. 11, 2010.
Anderson, A. F.,
"Provisional notes on the CTS electronic accelerator pedals as used in some
Toyota vehicles," Dec. 15, 2012.
Anderson, I. E., Foley, J. C., Cook, B. A., Harringa, J., Terpstra, R. L., and
Unal, O.,
"Alloying Effects in Near-Eutectic Sn-Ag-Cu Solder Alloys for Improved
Microstructural Stability," Journal of Electronic Materials, vol.
30 no. 9, pp. 1050-1059, Sept. 2001.
Anderson, I. E., and Harringa, J. L.,
"Elevated Temperature Aging of Solder Joints Based on Sn-Ag-Cu: Effects on
Joint Microstructure and Shear Strength," Journal of Electronic
Materials, vol. 33 no. 12, pp. 1485-1496, Dec. 2004.
Anderson, I. E., Cook, B. A., Harringa, J., and Terpstra, R. L.,
"Microstructural Modifications and Properties of Sn-Ag-Cu Solder Joints
Induced by Alloying," Journal of Electronic Materials, vol. 31
no. 11, pp. 1166-1174, Nov. 2002.
Anderson, I. E., Walleser, J., and Harringa, J. L.,
"Observations of Nucleation Catalysis Effects during Solidification of SnAgCuX
Solder Joints," JOM, vol. 59 no. 7, pp. 38-43, July 2007.
Anderson, I. E., Cook, B. A., Harringa, J. L. and Terpstra, R. L.
"Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and
Properties," JOM, vol. 54 no. 6, pp. 26-29, June 2002.
Anderson, I. E., and Harringa, J. L.,
"Suppression of Void Coalescence in Thermal Aging of Tin-Silver-Copper-X
Solder Joints," Journal of Electronic Materials, vol. 35 no. 1,
pp. 94-106, Jan. 2006.
Anderson, Iver E., Boesenberg, Adam, Harringa, Joel, Riegner, David,
Steinmetz, Andrew, and Hillman, David,
"Comparison of Extensive Thermal Cycling Effects on Microstructure Development
in Micro-alloyed Sn-Ag-Cu Solder Joints," Journal of Electronic
Materials, vol. 41 no. 2, pp. 390-397, Feb. 2012.
Anderson, Iver E., Bloomer, Tamara E., Foley, James C., and Terpstra, Robert
L.,
"Development of Eutectic and Near-eutectic Sn-Ag-Cu Solder Alloys for
Lead-Free Electronic Assemblies," IPC Works '99, Minneapolis,
MN, Oct. 23-28, 1999, pp. xx-xx.
Anderson, Iver E.,
"Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder
applications," Journal of Materials Science: Materials in Electronics
, vol. 18 no. 1-3, pp. 55-76, Mar. 2007.
Anderson, Iver E., Cook, Bruce A., Harringa, Joel, Terpstra, Robert L., Foley,
James C., and Unal, Ozer,
"Effects of Alloying in Near-Eutectic Tin-Silver-Copper Solder Joints,"
Materials Transactions, vol. 43 no. 8, pp. 1827-1832, Aug. 2002.
Anderson, Iver E., Kirkland, Kenneth, and Willenberg, Wayne,
"Implementing Pb-free Soldering," Surface Mount Technology (SMT),
vol. 14 no. 11, pp. 78-81, Nov. 2000.
Anderson, Iver E., Walleser, Jason W., Harringa, Joel L., Laabs, Fran, and
Kracher, Alfred,
"Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X
Solder Joints by Alloy Design," Journal of Electronic Materials,
vol. 38 no. 12, pp. 2770-2779, Dec. 2009.
Anderson, Iver E., Choquette, Stephanie, Reeve, Kathlene (Thomas), and
Handwerker, Carol,
"Pb-Free Solders and Other Joining Materials for Potential Replacement of
High-Pb Hierarchical Solders," Pan Pacific Symposium 2018 Proceedings
, Kamuela, HI, Feb. 5-8, 2018, pp. xx-xx.
Anderson, Iver E.,
"Tin-Silver-Copper: A Lead Free Solder for Broad Applications,"
Proceedings of the Technical Program NEPCON West '96, Volume 2,
Anaheim, CA, Feb. 25-29, 1996, pp. 882-887.
Anderson, Iver E.,
"Tin-Silver-Copper: A Lead Free Solder for Capacitor Interconnects,"
1996 Proceedings 16th Capacitor and Resistor Technology Symposium,
New Orleans, LA, Mar. 11-15, 1996, pp. 63-65.
Anderson, Lynda L., and Mahoney Jr., Robert,
"Converting Cable Assembly Manufacturing to Lead Free Solder,"
International Conference on Soldering & Reliability 2013 Proceedings
, Toronto, Ontario, Canada, May 14-17, 2013, pp. xx-xx.
Anderson, Mark,
"What an E-Waste," IEEE Spectrum, vol. 47 no. 9, pp. 72, Sept.
2010.
Anderson, R., Chilukuri, R., Tee, T. Y., Koo, C. P., Ng, H. S., Rogers, B.,
and Syed, A.,
"Advances in WLCSP technologies for growing market needs," Global
SMT and Packaging, vol. 10 no. 3, pp. 26-28,30,32, Mar, 2010.
Anderson, R., Chilukuri, R., Tee, T. Y., Koo, C. P., Ng, H. S., Rogers, B.,
and Syed, A.,
"Advances in WLCSP Technologies for Growing Market Needs," Wafer &
Device Packaging and Interconnect, vol. 1 no. 5, pp. 14-18, June/July
2010.
Anderson, Rex, Tee, Tong Yan, Tan, Long Bin, Ng, Hun Shen, Low, Jim Hee, Khoo,
Choong Peng, Moody, Robert, and Rogers, Boyd,
"Integrated Testing, Modeling and Failure Analysis of CSPnl for Enhanced Board
Level Reliability," SMTA International Wafer-Level Packaging Conference
, San Jose, CA, Oct. 13-16, 2008, pp. xx-xx.
Anderson, Rex, Tee, Tong Yan, and Tan, Long Bin,
"Integrated testing, modeling and failure analysis of CSPnl for board level
reliability," Global SMT and Packaging, vol. 10 no. 6, pp.
16-18,20,22-23, June 2010.
Anderson, Richard A.,
"Reviewing RoHS Compliance For Harsh Environments," Microwaves &
RF, vol. 46 no. 2, pp. 66, 68, 70, 72, 74, 76, 79-80, 82, 84, Feb.
2007.
Anderson, Richard A., Paquette, Stan, and Wilkish, George,
"TCP replaces hexavalent chromium coatings in enclosures," Green
SupplyLine, Apr. 7, 2006.
Anderson, Steve,
"An Expert Looks at the IssuesTM," Chip Scale Review, vol. xx
no. xx, pp. xx-xx, July-Aug. 2000.
Anderson, Thomas A.,
"Get the lead out," Green SupplyLine, July 25, 2005.
Anderson, Thomas,
"Getting the lead out," EE Times - Asia, vol. xx no. xx, pp.
xx-xx, Nov. 1, 2005.
Anderson, Vance,
"DoD Efforts to Address RoHS and WEEE Lead-Free Impacts," 9th Joint
FAA/DoD/NASA Aging Aircraft Conference, Atlanta, GA, Mar. 6-9, 2006.
Anderson, Vance,
"Lead-Free Impacts on DoD Microelectronics," DoD Diminishing
Manufacturing Sources & Material Shortages (DMSMS) Workshop, San
Antonio, TX, Dec. 13-15, 2005, pp. xx-xx.
Anderson, Vance,
"Restriction of Hazardous Substances (RoHS) Panel," DoD Diminishing Manufacturing
Sources and Material Shortages Conference, Charlotte, NC, July 11.
2006, pp. xx-xx.
Andersson, C., Liu, L., and Liu, J.,
"Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free
Alloy," 1st Electronics Systemintegration Technology Conference, Volume
1, Dresden, Germany, Sept. 5-7, 2006, pp. 152-160.
Andersson, C., Lai, Z., Liu, J., Jiang, H., and Yu, Y.,
"Comparison of isothermal mechanical fatigue properties of lead-free solder
joints and bulk solders," Materials Science and Engineering A,
vol. 394 no. 1-2, pp. 20-27, Mar. 15, 2005.
Andersson, C., and Liu, J.,
"Effect of corrosion on the low cycle fatigue behavior of Sn-4.0Ag-0.5Cu
lead-free solder joints," International Journal of Fatigue, vol.
30 no. 5, pp. 917-930, May 2008.
https://doi.org/10.1016/j.ijfatigue.2007.06.009
Andersson, C., Andersson, D. R., Tegehall, P. E., and Liu, J.,
"Effect of different temperature cycling profiles on the crack initiation and
propagation of Sn-3.5Ag wave soldered solder joints," Microelectronics
Reliability, vol. 47 no. 2-3, pp. 266-272, Feb.-Mar. 2007.
Andersson, C., and Liu, J.,
"Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free Solder Joints in
Different Corrosive Environmental Conditions," 1st Electronics
Systemintegration Technology Conference, Volume 1, Dresden, Germany,
Sept. 5-7, 2006, pp. 457-467.
Andersson, C., Vandevelde, B., Noritake, C., Sun, P., Tegehall, P. E.,
Andersson, D. R., Wetter, G., and Liu, J.,
"Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages,"
Soldering & Surface Mount Technology, vol. 21 no. 2, pp. 28-38,
2009.
Andersson, Cristina, Lai, Zonghe, Liu, Johan, Jiang, Hairong, and Yu,
Yongning,
"Comparison Of Isothermal Mechanical Fatigue Properties Of Lead-Free Solder
Joints And Bulk Solders," Fifth International Conference on Electronic
Packaging Technology Proceedings, Shanghai, China, Oct. 28-30, 2003,
pp. 371-376.
Andersson, Cristina, Andersson, Dag R., Tegehall, Per-Erik, Andersson, Jan,
and Liu, Johan,
"Correlation Between Thermomechanical Reliability of BGAs and Manufacturing
Process Parameters," IPC/Soldertec Global 3rd International Conference
on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.
Andersson, Cristina, Andersson, Dag R., Tegehall, Per-Erik, and Liu, Johan,
"Effect of different temperature cycle profiles on the crack propagation and
microstructural evolution of lead free solder joints of different electronic
components," Proceedings of the 5th International Conference on Thermal
and Mechanical Simulation and Experiments in Microelectronics and Microsystems
, Brussels, Belgium, May 9-12, 2004, pp. 455-464.
Andersson, Christina, Sun, Peng, and Liu, Johan,
"Low Cycle Fatigue of Sn-based Lead-free Solder Joints and the Analysis of
Fatigue Life Prediction Uncertainty," Proceedings of the 2006 IEEE CPMT
Conference on High Density Microsystem Design, Packaging and Component Failure
Analysis, Shanghai, June 27-28, 2006, pp. 272-279.
Andersson, K., Salmela, O., Perttula, A., Sarkka, J., and Tammenmaa, M.,
"Measurement of acceleration factor for lead-free solder (SnAg3.8Cu0.7) in thermal
cycling test of BGA components and calibration of lead-free solder joint model
for life prediction by finite element analyses," Proceedings of the 6th
International Conference on Thermal, Mechanical and Multi-Physics Simulation
and Experiments in Micro-Electronics and Micro-Systems, Berlin,
Germany, Apr. 18-20, 2005, pp. 448-453.
Andersson, Cristina, Zou, Changdong, Yang, Bin, Gao, Yulai, Liu, Johan, and
Zhai, Qijie,
"Recent Advances in the Synthesis of Lead-free Solder Nanoparticle," 2nd
Electronics Systemintegration Technology Conference, Greenwich, London,
UK, Sept. 1-4, 2008, pp. 915-921.
Andersson, Cristina, Sun, Peng, and Liu, Johan,
"Tensile properties and microstructural characterization of Sn-0.7Cu-0.4Co
bulk solder alloy for electronics applications," Journal of Alloys and
Compounds, vol. 457 no. 1-2, pp. 97-105, June 12, 2008.
Andersson, Cristina, Tegehall, Per-Erik, Andersson, Dag R., Wetter, Goran, and
Liu, Johan.
"Thermal Cycling Aging Effect on the Shear Strength, Microstructure,
Intermetallic Compounds (IMC) and Crack Initiation and Propagation of Reflow
Soldered Sn-3.8Ag-0.7Cu and Wave Soldered Sn-3.5Ag Ceramic Chip Components,"
IEEE Transactions on Components and Packaging Technologies, vol.
31 no. 2, pp. 331-344, June 2008.
Ando, Toshihiro, Shibata, Masamitsu, Okada, Seiichi, and Namasuya, Yoshikazu,
"Stress Analysis and Accelerated Evaluation of Tin Whisker under Thermal
Shock Stress," Murata.
Andrae, Anders S. G., Itsubo, Norihiro, and Inaba, Atsushi,
"Applicability and Accuracy Improvement for Life-Cycle Assessment in
Microelectronics Packaging," Proceedings of 7th International Conference
on EcoBalance, Tsukuba, Japan, Nov. 14-16, 2006, pp. 281-284.
Andrae, Anders S. G., Andersson, Dag R., Ramberg, Cecilia, Bengtsson, Gunnar,
and Liu, Johan,
"Application of Simplified Methods for Partial Environmental Assessment of
Microelectronics Soldering Materials and Processes in Small and Medium Sized
Enterprises," Gate to Environmental and Health Sciences
(Internet-Journal Gate to EHS), no. 5, May 18, 2005, pp. 1-8.
Andrae, Anders S. G., Itsubo, Norihiro, Yamaguchi, Hiroshi, and Inaba,
Atsushi,
"Conductive Adhesives vs. Solder Paste: A Comparative Life Cycle Based
Screening," Proceedings of 14th CIRP International Conference on Life
Cycle Engineering, Tokyo, Japan, June 11-13, 2007, pp. 285-290.
Andrae, Anders S. G., and Liu, Johan,
"Consequential Toxicity Assessment of the Global Shift to Pb-free Solder
Paste," Proceedings of International Conference on Electronics Packaging
, Tokyo, Japan, Apr. 19-21, 2006, pp. 298-303.
Andrae, Anders S. G., Itsubo, Norihiro, Yamaguchi, Hiroshi, and Inaba,
Atsushi,
"Environmental Implications of the Substitution of Silver-based
Interconnection Materials as evaluated by Life Cycle Assessment,"
Proceedings of EcoDesign 2007, Tokyo, Japan, Dec. 10-13, 2007, pp.
C3-4-2F.
Andrae, Anders S. G., Itsubo, Norihiro, and Inaba, Atsushi,
"Global environmental impact assessment of the Pb-free shift," Soldering
& Surface Mount Technology, vol. 19 no. 2, pp. 18-28, 2007.
Andrae, Anders S. G., Zou, Gang, and Liu, Johan,
"LCA of Electronic Products: An environmental assessment of Gallium Arsenide
Monolithic Microwave Integrated Circuit System-In-a-Package (SIP) Switch
Product," International Journal of Life Cycle Assessment, vol. 9
no. 1, pp. 45-52, Jan. 2004.
Andrae, Anders S. G., and Andersen, Otto,
"Life cycle assessment of integrated circuit packaging technologies,"
International Journal of Life Cycle Assessment, vol. 16 no. 3, pp.
258-267, Mar. 2011.
Andrae, Anders S. G., Itsubo, Norihiro, Yamaguchi, Hiroshi, and Inaba,
Atsushi,
"Life cycle assessment of Japanese high-temperature Japanese conductive
adhesives," Environmental Science & Technology, vol. 42 no.
8, pp. 3084-3089, 2008.
Andrae, Anders S. G., Itsubo, Norihiro, Yamaguchi, Hiroshi, and Inaba,
Atsushi,
"Life cycle assessment of Japanese high-temperature Japanese conductive
adhesives," Environmental Science & Technology, vol. ? no.
?, pp. xx-xx, Jan. 22, 2008.
Andrae, Anders S. G., Itsubo, Norihiro, Yamaguchi, Hiroshi, and Inaba,
Atsushi,
"Screening Life Cycle Assessment of Silver-Based Conductive Adhesive vs.
Lead-Based Solder and Plating Materials," Materials Transactions,
vol. 48 no. 8, pp. 2212-2218, 2007.
Andrae, Anders S. G., Andersson, Dag R., and Liu, Johan,
"Significance of intermediate production processes in life cycle assessment of
electronic products assessed using a generic compact model," Journal of
Cleaner Production, vol. 13 no. 13-14, pp. 1269-1279, Nov.-Dec. 2005.
Andrae, Anders S. G., and Ekvall, Tomas,
"The Shift to Lead-Free Solders - An Analysis of the Environmental Effects
Using Two Different Life Cycle Inventory Models," InLCA/LCM Internet
Conference, July 11-24, 2004, pp. xx-xx.
Andre, K. L., Zhang, D. M., Gutierrez, H. R., Dickey, E. C., Samarth, N. S.,
and Mohney, S. E.,
"Characterization of Zn1-xMnxSe nanowires and nanoribbons with cation
sublattice ordering," Journal of Crystal Growth, vol. 375, pp.
95-99, July 15, 2013.
Andreola, Fernanda, Barbieri, Luisa, Corradi, Anna, and Lancellotti, Isabella,
"Cathode ray tube glass recycling: an example of clean technology,"
Waste Management and Research, vol. 23 no. 4, pp. 314-321, Aug. 2005.
Andrews, Aaron Maxwell, Klang, Pavel, Detz, Hermann, Lugstein, Alois,
Schrambock, Matthias, Steinmair, Mathias, Hyun, Youn-Joo, Bertagnolli,
Emmerich, Muller, Thomas, Unterrainer, Karl, Schrenk, Werner, and Strasser,
Gottfried,
"MBE Growth of GaAs Whiskers on Si Nanowires," AIP Conference
Proceedings, vol. 1199, pp. 261-262, 2010.
Andrews, Clinton J., and Swain, Mathew,
"Institutional factors affecting life-cycle impacts of microcomputers,"
Resources, Conservation, and Recycling, vol. 31 no. 2, pp. 171-188,
Feb. 2001.
Andrews, Paul, Parry, Gareth, and Reid, Paul,
"Learning From MICROVIA FAILURE in Lead-Free Assembly," Printed
Circuit Design and Manufacture, vol. 23 no. 6, pp. 32-36, June 2006.
Andrews, Steve,
"Implementing RoHS in the U. K.," Circuits Assembly, vol. 17
no. 2, pp. 88-89, Feb. 2006.
Andrews, Steve,
"Implementing RoHS in the U. K.," Printed Circuit Design and
Manufacture, vol. 23 no. 2, pp. 16-17, Feb. 2006.
Andrews, Steve,
"The Restriction of Hazardous Substances (RoHS) Directive," SMART Group
"All You Ever Wanted to Know About Lead-Free" Seminar, High Wycombe,
United Kingdom, Nov. 1, 2005.
Andrews, Steve,
"The Restriction of Hazardous Substances (RoHS) Directive - Towards
Implementation in the UK and across Europe," IPC/Soldertec Global 3rd
International Conference on Lead Free Electronics, Barcelona, Spain,
June 7-10, 2005, pp. xx-xx.
Andrews, Steve,
"The Restriction of Hazardous Substances (RoHS) Directive - Update on
Implementation in the UK and Across Europe," IPC/JEDEC 8th
International Conference on Lead Free Electronic Components and Assemblies
, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.
Andrews, Steve,
"The Restriction of Hazardous Substances (RoHS) Directive - update on
implementation in the UK and across Europe," IPC/JEDEC 12th
International Conference on Lead Free Electronic Components and Assemblies
, Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.
Andrews, Steve,
"The RoHS Directive Consultation, Compliance & Enforcement," SMART
Group 6th Annual Lead-Free Seminar and Table-top Exhibition, High
Wycombe, United Kingdom, Feb. 3, 2004.
Andrews, Steve,
"The RoHS Directive - The end for lead soldering?," SMART Group/NPL
Lead Free Seminar 2003, Feb. 23, 2003.
Andrle, Claudia, and Bauspieá, Christoph,
"Bestimmung von sechswertigem Chrom in Korrosionsschutzschichten,"
ZVO Report, Ausgabe 3, pp. xx-xx, June 2004.
Andrle, Claudia, Sonntag, Birgit, Vogel, Roland, and Silomon, Martin,
"Cr(VI)-Free Post-Treatment Processes for Zinc & Zinc Alloys," 22nd
AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan.
29-Feb. 1, 2001, pp. xx-xx.
Angles, R. M.,
"Some Practical Aspects of Tin-Nickel Plating," Tin and its Uses,
no. 48, pp. 1-4, Autumn 1958.
Anglin, Chris, Briggs, Ed, Jensen, Tim, and Lasky, Ron,
"Fine Powder Solder Pastes: Stencil Printing and Reflow in Lead-Free
Assembly," International Conference on Soldering and Reliability,
Toronto, Ontario, May 13-16, 2008, pp. xx-xx.
Anhock, Sabine, Oppermann, Hermann, Kallmayer, Christine, Aschenbrenner, R.,
Thomas, Ludwig, and Reichl, Herbert,
"Investigations of Au-Sn alloys on different end-metallizations for high
temperature applications," Twenty Second IEEE/CPMT International
Electronics Manufacturing Technology Symposium, Berlin, Germany, Apr.
27-29, 1998, pp. 156-165.
Ani, Fakhrozi Che, Jalar, Azman, Saad, Abdullah Aziz, Khor, Chu Yee, Abas,
Mohamad Aizat, Bachok, Zuraihana, and Othman, Norinsan Kamil,
"Characterization of SAC - x NiO nano-reinforced lead-free solder joint in an
ultra-fine package assembly," Soldering & Surface Mount Technology
, vol. 31 no. 2, pp. 109-124, 2019.
Ani, Fakhrozi Che, Jalar, Azman, Saad, Abdullah Aziz, Khor, Chu Yee, Ismail,
Roslina, Bachok, Zuraihana, Abas, Mohamad Aizat, and Othman, Norinsan Kamil,
"SAC-xTiO2 nano-reinforced lead-free solder joint characterizations in
ultra-fine package assembly," Soldering & Surface Mount Technology
, vol. 30 no. 1, pp. 1-13, 2018.
Anjard Sr., Ronald P.,
"Solder Pastes for Electronics - A Status Report," Tin and its Uses
, no. 143, pp. 13-17, 1985.
Ansara, I., Bros, J. P., and Gambino, M.,
"Thermodynamic Analysis of the Germanium-Based Ternary Systems (Al-Ga-Ge,
Al-Ge-Sn, Ga-Ge-Sn)," Calphad: Computer Coupling of Phase Diagrams and
Thermochemistry, vol. 3 no. 3, pp. 225-233, 1979.
Ansari, Lida, Fagas, Giorgos, Colinge, Jean-Pierre, and Greer, James C.,
"A Proposed Confinement Modulated Gap Nanowire Transistor Based on a Metal
(Tin)," Nano letters, vol. 12 no. 5, pp. 2222-2227, 2012.
DOI: 10.1021/nl2040817
Ansari, Lida, Fagas, Giorgos, and Greer, James C.,
"Strain induced effects on electronic structure of semi-metallic and
semiconducting tin nanowires," Applied Physics Letters, vol. 105
no. 12, pp. 123105-1-123105-4, Sept. 22, 2016.
Anselm, Martin K., and Roggeman, Brian,
"Testing Intermetallic Fragility on ENIG Upon Addition of Limitless Cu,"
SMTA International 2011 Conference Proceedings, Fort Worth, TX,
Oct. 16-20, 2011, pp. 64-71.
Anselm, Martin K., and Roggeman, Brian,
"Testing Intermetallic Fragility on ENIG upon Addition of Limitless Cu,"
Surface Mount Technology (SMT), vol. 29 no. 2, pp.
30,32-34,36-41, Feb. 2014.
Anselm, Martin, and Jones, Wayne,
"Tools and techniques for material assessment in advanced technologies,"
Global SMT and Packaging, vol. 14 no. 1, pp. 8-12,14-15, Jan.
2014.
Anson, Scott, McLaughlin, Michael, and Argueta, Abner,
"Evaluation of Solder Pastes for High Reliability Applications," SMTA
International 2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17,
2013, pp. 800-807.
Anson, Scott J., Slezak, Jacob G., and Srihari, Krishnaswami,
"Investigation of Enhanced Solder Wetting in 63Sn/37Pb and Sn-Ag-Cu Lead Free
Alloy," 2008 Proceedings 58th Electronic Components & Technology
Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1737-1744.
Anson, Scott J., and Slezak, Jacob G.,
"Organic Solderability Preservative Lead Free Reflow Processing," SMTA
International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 607-612.
Anson, Scott J., Slezak, Jacob G., and Srihari, Krishnaswami,
"Reflow Process Enhancement and Wetting Analysis in 63Sn/37Pb and Sn-Ag-Cu
Lead-Free Alloy," SMTA International Conference, Orlando, FL,
Oct. 7-11, 2007, pp. 90-99.
Anthony, George, and Pfeiffer, Joseph,
"New flame retardant TPVs for electrical applications." Wire Journal
International, vol. 37 no. 8, pp. 64-68, Aug. 2004.
Antler, M., Feder, M., Hornig, C. F., and Bohland, J.,
"The Corrosion Behavior of Single and Multiphase Tin-Nickel Alloy
Electrodeposits," Plating and Surface Finishing, vol. 63 no. 7,
pp. 30-33, July 1976.
Anton, Bryce R., Shahin, George E., and Mishra, Brajendra,
"A Comparison of Hexavalent & Trivalent Chromium for Use as a Base
Material for Decorative PVD Coatings," Proceedings 2003 AESF/EPA
Conference for Environmental & Process Excellence, Daytona, FL,
Feb. 3-7, 2003, pp. 273-280.
Antoniou, Antonia, and Bastawros, Ashraf F.,
"Deformation characteristics of tin-based solder joints," Journal of
Materials Research, vol. 18 no. 10, pp. 2304-2309, Oct. 2003.
Anuar, S. Khairul, Mariatti, M., Azizan, A., Mang, N. Chee, and Tham, W. T.,
"Effect of different types of silver and epoxy systems on the properties of
silver/epoxy conductive adhesives," Journal of Materials Science:
Materials in Electronics, vol. 22 no. 7, pp. 757-764, July 2011.
Aoe, Taeko,
"Eco-efficiency and ecodesign in electrical and electronic products,"
Journal of Cleaner Production, vol. 15 no. 15, pp. 1406-1414, Oct.
2007.
Aoi, Tatsuki,
"Japan Frets Over EU Environmental Regs," Electronic News,
June 14, 2004.
Aoi, Tatsuki,
"Japan frets over RoHS Directive," Electronics Weekly, June
15, 2004.
Aoki, Masamitsu,
"Environment Regulation in Europe-WEEE/RoHS & REACH
," Journal of the Surface Finishing Society of Japan, vol. 57 no.
12, pp. 813-822, 2006.
Aoki, Toyohiro, Nakamura, Eiji, Hisada, Takashi, Mori, Hiroyuki, and
Yamamichi, Shintaro,
"Flip Chip Joining with Low Temperature Solders and Thermal Gradient Bonding,"
2017 International Conference on Electronics Packaging, Yamagata,
Japan, Apr. 19-22, 2017, pp. 216-219.
Aoki, Yuichi, Nagai, Takayuki, Katayanagi, Hiroko, and Tanaka, Hirokazu,
"Evaluating lead-free plating using gas corrosion tests," Espec
Technology Report, no. 12, pp. 23-28, Oct. 2001.
Aoki, Yuichi, Tanaka, Hirokazu, and Katayanagi, Hiroko,
"Factors affecting reliability of Sn-Ag-Cu solder," Espec Technology
Report, no. 15, pp. 1-9, Apr. 2003.
Aoki, Yuichi, Nakagawa, Yasutoshi, Toi, Keiko, Tanaka, Hirokazu, and Suyama,
Katsumasa,
"Solder Joint Reliability of Tin-Zinc-Bismuth Lead-free Solder under
Environmental Stress," IPC/JEDEC 7th International Conference on Lead
Free Electronic Components and Assemblies, Frankfurt, Germany, Oct.
20-22, 2004.
Aoki, Yuichi, Tsuje, Ichisaku, and Nagai, Takayuki,
"The effect of ramp rate on temperature cycle fatigue in solder joints,"
ESPEC Technology Report, no. 25, pp. 4-13, Sept. 15, 2007.
Aoki, Yuichi, Tsujie, Ichisaku, and Nagai, Takayuki,
"The effect of ramp rate on thermal fatigue testing of solder joints,"
ESPEC Technology Report, no. 27, pp. 1-13, xxxx.
Aoues, Younes, Makhloufi, Abderahman, Pougnet, Philippe, and El-Hami,
Abdelkhalak,
"Robustness study of solder joints of different compositions by using
Stochastic Finite Element Modeling," 2014 8th International Conference
on Integrated Power Systems, Nuremberg, Germany, Feb. 25-27, 2014, pp.
xx-xx.
Aoyama, M., and Saka, M.,
"Evaluation of electromigration resistance of lead-free solders using
unpassivated stripe-shaped samples," Microsystem Technologies,
vol. 21 no. 8, pp. 1777-1785, Aug. 2015.
Apell, Marc C.,
"Considerations for Lead-Free Reflow Soldering," Circuits
Assembly, vol. 15 no. 3, pp. 28-30, Mar. 2004.
Apell, Marc, Formella, Tad, and Johnson, Alden,
"Effects of Cooling Slopes in Lead Free Reflow," IPC APEX/EXPO 2005
, Anaheim, CA, Feb. 22-24, 2005, pp. xx-xx.
Apell, Marc C.,
"Lead-Free Reflow Soldering Equipment Considerations," Thermal and
Cleaning Systems.
Apell, Marc, Formella, Tad, Dautenhahn, Jon, Miller, Rick, and Hueste, Greg,
"OmniExcel(TM) Thermal profiling for Pb-Free Alloys," Cookson Electronics
Equipment.
Apell, Marc, Dautenhahn, Jon, Formella, Tad, and Morris, Jim,
"Power Consumption and Closed-loop Nitrogen Control Considerations in
Lead-free Reflow," IPC SMEMA Council APEX 2004, Anaheim, CA,
Feb. 24-26, 2004, pp. S19-1-1-S19-1-5.
Apisitpuvakul, Witoon, Piumsomboon, Pornpote, Watts, Daniel J., and
Koetsinchai, Woranut,
"LCA of spent fluorescent lamps in Thailand at various rates of recycling,"
Journal of Cleaner Production, vol. 16 no. 10, pp. 1046-1061,
July 2008.
Apparavu, Naidu, Sjoberg, Jonas, Geiger, David A., and Shangguan, Dongkai,
"Process Development, Repair and Reliability Evaluation for Inline Package on
Package (PoP) assembly," 2008 33rd IEEE/CPMT International Electronic
Manufacturing Technology Symposium, Penang, Malaysia, Nov. 4-6, 2008,
pp. xx-xx.
Appelbaum, Alec,
"Europe Cracks Down on E-Waste," IEEE Spectrum, vol. 39 no. 5,
pp. 46-51, May 2002.
Appell, David,
"CMEs - If The Sun Spits, The Earth Could Fry," Mar. 1, 1999.
Aptekar', I. L., and Styrkas, A. D.,
"Inert Supports as Carriers of Tin-Plague Infection from InSb to beta-Sn,"
High-Purity Substances (a translation of Vysokochistye Veshchestva)
vol. 7 no. 3, pp. 282-284, May-June 1993.
Aptekar', I. L., and Styrkas, A. D.,
"Nature of Memory in the Case of a Phase Transition in Tin After a
beta-alpha-beta Cycle," High-Purity Substances (a translation of
Vysokochistye Veshchestva) vol. 7 no. 3, pp. 285-288, May-June 1993.
Aptekar', I. L., Styrkas, A. D., and Aptekar', L. I.,
"The Nature of Tin Plague," High-Purity Substances (a translation of
Vysokochistye Veshchestva) vol. 7 no. 3, pp. 289-292, May-June 1993.
Arabi, F., Theolier, L., Youssef, T., Medina, M., Deletage, J.-Y., and
Woirgard, E.,
"Effect of voids on crack propagation in AuSn die attach for high-temperature
power modules," 2017 18th International Conference on Thermal,
Mechanical and Multi-Physics Simulation and Experiments in Microelectronics
and Microsystems, Dresden, Germany, Apr. 3-5, 2017, pp. xx-xx.
Arabi, F., Theolier, L., Martineau, D., Deletage, J.-Y., Medina, M., and
Woirgard, E.,
"Power electronic assemblies: Thermo-mechanical degradations of gold-tin
solder for attaching devices," Microelectronics Reliability, vol.
64, pp. 409-414, Sept. 2016.
Arafat, M. M., Haseeb, A. S. M. A., and Johan, Mohd Rafie,
"Interfacial reaction and dissolution behavior of Cu substrate in molten
Sn-3.8Ag-0.7Cu in the presence of Mo nanoparticles," Soldering &
Surface Mount Technology, vol. 23 no. 3, pp. 140-149, 2011.
Arafat, M. M., and Haseeb, A. S. M. A.,
"Interfacial Reaction and Dissolution Behavior of Cu Substrate in Molten
Sn-3.8Ag-0.7Cu-nano Mo Composite Solder," 11th Electronics Packaging
Technology Conference, Singapore, Dec. 9-11, 2009, pp. 953-956.
Arafat, M. M., Haseeb, A. S. M. A., and Johan, Mohd Rafie,
"Reflow Behavior of Mo Nanoparticle Added Sn-3.8Ag-0.7 Cu Solder," 2010
5th International Microsystems Packaging Assembly and Circuits Technology
Conference, Taipei, Taiwan, Oct. 20-22, 2010, pp. xx-xx.
Arafat, Y., Yang, H., Dutta, I., Kumar, P. A., and Datta, B.,
"A Model for Intermetallic Growth in Thin Sn Joints Between Cu Substrates:
Application to Solder Microjoints," Journal of Electronic Materials
, vol. 49 no. 5, pp. 3367-3382, May 2020.
Aragon, Joseph, Wavrik, Richard, Vianco, Paul, Witham, John, and Bou, Jimmy,
"Tin Whisker Mitigation Methods," 11th International Components for
Military and Space Electronics Conference, Mar. 12-15, 2007, pp.
xx-xx. (Sandia Report SAND2007-0400C)
Aragon, Joseph, Wavrik, Richard, Vianco, Paul, and Witham, John,
"Tin Whisker Mitigation Methods," Defense Semiconductor Association
Meeting, Las Vegas, NV, Jan. 14-17, 2008, pp. xx-xx. (Sandia Report
SAND2008-0117C)
Aragon, Joseph, Wavrik, Richard, Vianco, Paul, Witham, John, and McKenzie,
Bonnie,
"Tin Whisker Mitigation Methods," Defense Manufacturing Conference
, Orlando, FL, Dec. 1-4, 2008, pp. xx-xx. (Sandia Report
SAND2008-7346C)
Aragon, Joseph, Wavrik, Richard, and Witham, John,
"Tin Whisker Mitigation Methods," Sandia Report SAND2009-4735C, 2009.
Aragon, Joseph, Rohwer, Lauren, Wavrik, R., and Witham, J.,
"Tin Whisker Mitigation Methods," 28th Compatibility, Aging &
Stockpile Stewardship Conference, Albuquerque, NM, Fall 2009,
pp. xx-xx. (Sandia Report SAND2009-6058C)
Arai, Susumu, and Watanabe, Tohru,
"Microstructure of Sn-Ag Alloys Electrodeposited from Pyrophosphate-Iodide
Solutions," Materials Transactions, vol. 49 no. 4, pp. 439-445,
Apr. 2008.
Arai, Susumu,
"Recent Status of Plating Technology for Lead-Free Soldering,"
Journal of The Surface Finishing Society of Japan, vol. 55 no. 9, pp.
576-581, 2004.
Arai, T., Iiyori, H., Hiromasu, Y., Atsumi, M., Ioku, S., and Furuta, K.,
"Aluminum-based gate structure for active-matrix liquid crystal displays,"
IBM Journal of Research and Development, vol. 42 no. 3/4,
pp. 491-499, May-July 1998.
Araki, Teppei, Uemura, Takafumi, Yoshimoto, Shusuke, Takemoto, Ashuya, Noda,
Yuki, Izumi, Shintaro, and Sekitani, Tsuyoshi,
"Wireless Monitoring Using a Stretchable and Transparent Sensor Sheet
Containing Metal Nanowires," Advanced Materials, vol. 32 no. 15,
pp. 1902684-1-1902684-17, Apr. 16, 2020.
https://doi-org.ezproxy.uky.edu/10.1002/adma.201902684
Aravamudhan, Srinivasa, Apell, Marc, Belmonte, Joe, Van-Diep, Gerald Pham, and
Harrell, Jeff,
"Effect of Oxygen Concentration During Reflow on Tombstoning for Passive
Resistors for Lead-Free Assemblies," 2006 SMTA International Conference
Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 67-73.
Aravamudhan, Srinivas, Aspandiar, Raiyo, May, Lilia, Nad, Suddhasattwa,
Mokler, Scott, and Amir, Dudi,
"Impact of Low Silver Solder Pastes on Area Array Solder Joint Quality,"
SMTA International 2013 Conference Proceedings, Fort Worth, TX,
Oct. 13-17, 2013, pp. 599-603.
Aravamudhan, Srinivasa, Belmonte, Joe, and Pham-Van-Diep, Gerald,
"Self-Centering of Chip Components in a Pb-Free Assembly as a Function of
Component and Solder Paste Print Offsets," 2005 SMTA International
Conference Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 851-860.
Aravamudhan, Srinivasa, Belmonte, Joe, Bhosale, Anand, Johnson, Alden,
Mattero, Pat, Moore, Karl, and Pham-Van-Diep, Gerald,
""The Creation and Building of a Lead Free Product" A Case Study,"
IPC/JEDEC 8th International Conference on Lead Free Electronic Components and
Assemblies, San Jose, CA, Apr. 18-20, 2005, pp. xx-xx.
Aravamudhan, Srinivasa, Belmonte, Joe, Bhosale, Anand, Johnson, Alden,
Mattero, Pat, Moore, Karl, and Pham-Van-Diep, Gerald,
"The Creation and Building of a Pb-Free Product," Circuits Assembly
, vol. 17 no. 4, pp. 34, Apr. 2006.
Aravamudhan, Srinivasa, Belmonte, Joe, and Pham-Van-Diep, Gerald,
"Tin/lead vs. Lead-free: A Question of Print Accuracy," Surface
Mount Technology (SMT), vol. 20 no. 2, pp. 42, 44, 47, Feb. 2006.
Arazna, Aneta, Koziol, Grazyna, Steplewski, Wojciech, and Borecki, Janusz,
"Assessment of lead-free solder pastes with different type of powder for
fine-pitch application," 31st International Spring Seminar on
Electronics Technology, Budapest, Hungary, May 7-11, 2008, pp. 579-584.
Arazna, Aneta, Koscielski, Marek, Sitek, Anna, Steplewski, Wojciech, Janeczek,
Kamil, Lipiec, Krzysztof, Rafalik, Ireneusz, and Sitek, Janusz,
"Comparison of SAC and new Pb-free solder alloy for special application,"
2020 IEEE 8th Electronics System-Integration Technology Conference
, Tonsberg, Norway, Sept. 15-18, 2020, pp. xx-xx.
Arazna, Aneta, Koziol, Grazyna, Steplewski, Wojciech, and Lipiec, Krzysztof,
"Head on pillow defects in BGAs solder joints," 2010 3rd Electronic
System-Integration Technology Conference, Berlin, Germany, Sept. 13-16,
2010, pp. xx-xx.
Arazna, Aneta, Koziol, Grazyna, and Steplewski, Wojciech,
"Investigation of Tin Whiskers Formation," 2010 33rd International
Spring Seminar on Electronics Technology, Warsaw, Poland, May 12-16,
2010, pp. 183-185.
Archana, J., Navaneethan, M., Ponnusamy, S., Hayakawa, Y., and
Muthamizhcelvan, C.,
"Chemical synthesis of monodispersed ZnSe nanowires and its functional
properties," Materials Letters, vol. 81, pp. 59-61, Aug. 15,
2012.
Ardente., Fulvio, Mathieux, Fabrice, and Recchioni, Marco,
"Recycling of electronic displays: Analysis of pre-processing and potential
ecodesign improvements," Resources, Conservation and Recycling,
vol. 92, pp. 158-171, Nov. 2014.
Arellano, Jorge, Subbarayan, Guhan, and Russo, Richard,
"Optimization and Qualification of Lead Free Wave Soldering Process Using SAC
305 Solder Alloy," IPC Review, vol. 47 no. 11, pp. 8, Dec. 2006.
Arellano, Jorge, Subbarayan, Guban, and Warnock, Buck,
"Optimization and Qualification of Lead Free Wave Soldering Process Using sac
305 Solder Alloy," Route, Dec. 2006.
Arenas, Mario F., and Acoff, Viola L.,
"Contact Angle Measurements of Sn-Ag and Sn-Cu Lead-Free Solders on Copper
Substrates," Journal of Electronic Materials, vol. 33 no. 12,
pp. 1452-1458, Dec. 2004.
Arenas, Mario F., He, Min, and Acoff, Viola L.,
"Effect of Flux on the Wetting Characteristics of SnAg, SnCu. SnAgBi, and
SnAgCu Lead-Free Solders on Copper Substrates," Journal of Electronic
Materials, vol. 35 no. 7, pp. 1530-1536, July 2006.
Arendt, N., Baron, F., Benz, V., Letterer, M., Merkle, H., Schroeder, S., and
Wessling, B.,
"A New Whisker-Reducing Immersion Tin Technology," CircuiTree
, vol. 18 no. 1, pp. 10, 12, 14, Jan. 2005.
Arendt, N., Baron, F., Benz, V., Letterer, M., Merkle, H., Schroeder, S.,
Wessling, B.,
"A Superior Whisker-Reducing Immersion Tin Technology," OnBoard
Technology, vol. xx no. xx, pp. 30-32, Oct. 2004.
Arendt, N., Arribas-Sanchez, C., Gleeson, S., Posdorfer, J., Rischka, M.,
Thun, M., Wessling, B., and Zeysing, B.,
"Innovative Final Nanofinish for PCBs With Organic Metal,"
CircuiTree, vol. 20 no. 10, pp. xx-xx, Oct. 2007.
Arendt, N., Wessling, B., Thun, M., Arribas-Sanchez, C., Gleeson, S.,
Posdorfer, J., Rischka, M., and Zeysing, B.,
"Nanotechnology for Lead-Free PWB Final Finishes with the Organic Metal,"
SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp.
260-264.
Arensman, Russ,
"The Greening of technology," Electronic Business, May 1,
2001.
Aresti, A., Garbato, L., and Rucci, A.,
"Some Cohesive Energy Features of Tetrahedral Semiconductors," Journal
of Physics and Chemistry of Solids, vol. 45 no. 3, pp. 361-365, 1984.
Arfaei, B., Kim, N., and Cotts, E. J.,
"Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification
Temperature," Journal of Electronic Materials, vol. 41 no. 2, pp.
362-374, Feb. 2012.
Arfaei, B., Tashtoush, T., Kim, N., Wentlent, L., Cotts, E., and Borgesen, P.,
"Dependence of SnAgCu Solder Joint Properties on Solder Microstructure,"
2011 IEEE 61st Electronic Components and Technology Conference,
Lake Buena Vista, FL, May 31-June 3, 2011, pp. 125-132.
Arfaei, B., Wentlent, L., Joshi, S., Alazzam, A., Tashtoush, T., Halaweh, M.,
Chivukula, S., Yin, L., Meilunas, M., Cotts, E., and Borgesen, P.,
"Improving the Thermomechanical Behavior of Lead Free Solder Joints by
Controlling the Microstructure," 2012 13th IEEE Intersociety Conference
on Thermal and Thermomechanical Phenomena in Electronic Systems, San
Diego, CA, May 30-June 1, 2012, pp. 392-398.
Arfaei, B., Xing, Y., Woods, J., Wolcott, J., Tumne, P., Borgesen, P., and
Cotts, E.,
"The Effect of Sn Grain Number and Orientation on the Shear Fatigue Life of
SnAgCu Solder Joints," 2008 Proceedings 58th Electronic Components &
Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp.
459-465.
Arfaei, Babak, Anselm, Martin, Mutuku, Francis, and Cotts, Eric,
"A.R.E.A. - Effect of PCB Surface Finish on Sn Grain Morphology and Thermal
Fatigue Performance of Lead Free Solder Joints," Conference Proceedings
of SMTA International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp.
406-414.
Arfaei, Babak, and Cotts, Eric,
"Correlations Between the Microstructure and Fatigue Life of Near-Eutectic
Sn-Ag-Cu Pb-Free Solders," Journal of Electronic Materials, vol.
38 no. 12, pp. 2617-2627, Dec. 2009.
Arfaei, Babak, Mutuku, Francis, Sweatman, Keith, Lee, Ning-Cheng, Cotts,
Eric, and Coyle, Richard,
"Dependence of Solder Joint Reliability on Solder Volume, Composition and
Printed Circuit Board Surface Finish," 2014 IEEE 64th Electronic
Components and Technology Conference, Orlando, FL, May 27-30, 2014, pp.
655-665.
Arfaei, Babak, Mutuku, Francis, and Cotts, Eric,
"Effect of PCB Surface Finish on Sn Grain Morphology and Thermal Fatigue
Performance of Lead-Free Solder Joints," SMTAnews & Journal of
Surface Mount Technology, vol. 28 no. 4, pp. 13-20, Oct.-Dec. 2015.
Arfaei, Babak, Anselm, Martin, Joshi, Shantanu, Mahin-Shirazi, Sam, Borgesen,
Peter, Cotts, Eric, Wilcox, James, and Coyle, Richard,
"Effect of Sn Grain Morphology on Failure Mechanism and Reliability of
Lead-Free Solder Joints in Thermal Cycling Tests," SMTA International
2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp.
539-550.
Arfaei, Babak, Mutuku, Francis, Coyle, Richard, Cotts, Eric, and Wilcox, Jim,
"Failure Mechanism and Microstructural Evolution of Pb-free Solder Alloys in
Thermal Cycling Tests: Effect of Solder Composition and Sn Grain Morphology,"
2015 IEEE 65th Electronic Components and Technology Conference,
San Diego, CA, May 26-29, 2015, pp. 118-126.
Arfaei, Babak, Mutuku, Francis, Coyle, Richard, and Cotts, Eric,
"Influence of Microalloying Elements on Reliability of SnAgCu Solder Joints,"
Proceedings of SMTA Pan Pacific Symposium, Kauai, HI, Feb. 2-5,
2015, pp. xx-xx.
Arfaei, Babak, Mutuku, Francis, Coyle, Richard, and Cotts, Eric,
"Influence of Microalloying Elements on Reliability of SnAgCu Solder Joints,"
SMTA Journal, vol. 29 no. 2, pp. 13-20, 2016.
Arfaei, Babak,
"Lead-Free Solders: Focus on Fundamentals, Reliability, and Applications,"
JOM, vol. 66 no. 11, pp. 2309-2310, Nov. 2014.
Arfaei, Babak, Mahin-Shirazi, Sam, Joshi, Shantanu, Anselm, Martin, Borgesen,
Peter, Cotts, Eric, Wilcox, James, and Coyle, Richard,
"Reliability and Failure Mechanism of Solder Joints in Thermal Cycling Tests,"
2013 IEEE 63rd Electronic Components and Technology Conference,
Las Vegas, NV, May 28-31, 2013, pp. 976-985.
Armendariz, Norman J., and Vasudevan, Vasu,
"Effect of Baking Time and Temperature on Lead Free Second Level Interconnect
Solder Joint Microstructures, Microhardness and IMC Morphology," 2005
Pan Pacific Symposium Conference Proceedings, Kauai, Hawaii, Jan.
25-27, 2005, pp. xx-xx.
Armendariz, Norman J., and Paulraj, Prawin,
"Materials Characterization of Lead Free Compositions for Minimum Temperature
SMT Processes at the SLI-Second Level Interconnect Solder Joint,"
Proceedings of the 30th International Symposium for Testing and Failure
Analysis, Worchester (Boston), MA, Nov. 14-18, 2004, pp. 261-266.
Arnold, Henri,
"Lead tracer checks RoHS compatibility," EE Times Europe,
Mar. 7, 2007.
Arnold, J. W., and Suzuki, O.,
"Effects of Corrosive Treatment on Stainless Steel Surface Finishes and
Bacterial Attachment," Transactions of the ASAE, vol. 46 no. 6,
pp. 1595-1602, 2003.
Arnold, J. W., Boothe, D. H., and Bailey, B. W.,
"Parameters of Treated Stainless Steel Surfaces Important for Resistance to
Bacterial Contamination," Transactions of the ASAE, vol. 44 no.
2, pp. 347-356, 2001.
Arnold, Jim, McElroy, Jim, and Gedney, Ron,
"Roadmap of Lead-Free Assembly in North America," JISSO/PROTEC Forum
2002, Japan, Nov. 19-20, 2002.
Arnold, Joelle, and Sweatman, Keith,
"Accelerated Reliability Testing of Ni-Modified SnCu and SAC305,"
IPC/JEDEC International Conference on Reliability, Rework, and Repair of
Lead-Free Electronics, Raleigh, NC, Mar. 11-12, 2008, pp. xx-xx.
Arnold, Joelle, Binfield, Seth, Gulbrandsen, Steph, and Blattau, Nathan,
"Impact of Process Control in Pb-Free to SnPb Reballing Techniques Part 1:
Control of Thermal Exposure," International Conference on Soldering
& Reliability 2014, Toronto, Ontario, Canada, May 13-15, 2014, pp.
xx-xx.
Arnold, Joelle,
"Impact of Process Control in Pb-Free to SnPb Reballing Techniques - Part 2:
Contamination and Cleaning," SMTA-IPC High-Reliability Cleaning and
Conformal Coating Conference 2014, Schaumburg, IL, Nov. 18-20, 2014,
pp. xx-xx.
Arnold, Joelle, and Sweatman, Keith,
"Reliability Testing of Ni-Modified SnCu and SAC305 - Vibration,"
IPC/JEDEC International Conference on Reliability, Rework, and Repair of
Lead-Free Electronics, Raleigh, NC, Mar. 11, 2008, pp. xx-xx.
Arnold, Joelle, Blattau, Nathan, Hillman, Craig, and Sweatman, Keith,
"Reliability Testing of Ni-Modified SnCu and SAC305 - Accelerated Thermal
Cycling," 2008 SMTA International Conference Proceedings,
Orlando, FL, Aug. 17-21, 2008, pp. 187-190.
Arnold, Joelle, and Sweatman, Keith,
"Reliability Testing of Ni-Modified SnCu and SAC305 - Vibration," 2008
SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21,
2008, pp. 191-194.
Arnold, Rocky R.,
"New Product Development Challenges of Design for Environmental Compliance and
Design for Electromagnetic Compliance," 2004 IEEE International
Symposium on Electronics & the Environment Conference Record,
Scottsdale, AZ, May 10-13, 2004, pp. 287-291.
Arnold, S. M.,
"A hidden cause of failure in electronic equipment: Metal Whiskers,"
Electrical Manufacturing, vol. xx no. x, pp. 110-114, Nov. 1954.
Arnold, S. M., and Koonce, S. Eloise,
"Filamentary Growths on Metals at Elevated Temperatures," Journal of
Applied Physics, vol. 27 no. 8, pp. 964, 1956.
Arnold, S. M.,
"Repressing the Growth of Tin Whiskers," Plating, vol. 53 no.
1, pp. 16-19, Jan. 1966.
Arnold, S. M.,
"The Growth and Properties of Metal Whiskers," Proceedings of the
43rd Annual Convention of the American Electroplaters Society,
Washington, June 17-21, 1956, pp. 26-31.
Arnold, S. M.,
"The Growth of Metal Whiskers on Electrical Components," Proceedings
of Electrical Components Conference, pp. 75-82, 1959.
Arra, Minna, Geiger, David, Shangguan, Dongkai, Sjoberg, Jonas,
"A study of SMT assembly processes for fine pitch CSP packages,"
Soldering & Surface Mount Technology, vol. 16 no. 3, pp. 16-21,
2004.
Arra, Minna, Shangguan, Dongkai, Sundelin, Janne, Lepisto, Toivo, and
Ristolainen, Eero,
"Aging Mechanism of Immersion Tin and Silver PCB Surface Finishes in
Lead-Free Solder Applications," IPC/JEDEC Third International
Conference on Lead-Free Electronic Components and Assemblies, San Jose,
CA, Apr. 23-24, 2003, pp. 169-179.
Arra, Minna, Castello, Todd, Shangguan, Dongkai, and Ristolainen, Eero,
"Characterization of Mechanical Performance of Sn/Ag/Cu Solder Joints with
Different Component Lead Coatings," 2003 SMTA International Conference
Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 728-734.
Arra, Minna, Castello, Todd, Shangguan, Dongkai, and Ristolainen, Eero,
"Characterization of Mechanical Performance of Sn/Ag/Cu Solder Joints with
Different Component Lead Coatings," Lead-Free Magazine.
Arra, Minna, Castello, Todd, Shangguan, Dongkai, and Ristolainen, Eero,
"Characterization of mechanical performance of Sn/Ag/Cu solder joints with
different component lead coatings," Soldering & Surface Mount
Technology, vol. 16 no. 1, pp. 35-43, 2004.
Arra, Minna, Shangguan, Dongkai, Yi, Sammy, Thalhammer, Robert, and
Fockenberger, Harald,
"Development of Lead-Free Wave Soldering Process," IEEE Transactions on
Electronics Packaging Manufacturing , vol. 25 no. 4, pp. 289-299, Oct.
2002.
Arra, Minna, Shangguan, Dongkai, Ristolainen, Eero, and Lepisto, Toivo,
"Effect of reflow profile on wetting and intermetallic formation between
Sn/Ag/Cu solder components and printed circuit boards," Soldering &
Surface Mount Technology, vol. 14 no. 2, pp. 18-25, 2002.
Arra, Minna, Geiger, David, Shangguan, Dongkai, and Sjoberg, Jonas,
"Fine pitch component self-alignment with Sn/Pb and Sn/Ag/Cu solders,"
Global SMT and Packaging, vol. 6 no. 6, pp. 16, 18, 20-21,
June/July 2006.
Arra, Minna, Geiger, David, Shangguan, Dongkai, Yi, Sammy, Grebenstein, Frank,
Fockenberger, Harald, Kerk, K. H., and Wong, Harris,
"Performance Evaluation of Lead-Free Solder Pastes," 2001 SMTA
International Conference Proceedings, Chicago, IL, Sept. 30-Oct. 4,
2001, pp. 850-857.
Arra, Minna, Xie, DongJi, and Shangguan, Dongkai,
"Performance of Lead-Free Solder Joints Under Dynamic Mechanical Loading,"
2002 Proceedings 52nd Electronic Components & Technology Conference
, San Diego, CA, May 28-31, 2002, pp. 1256-1262.
Arra, Minna, Xie, DongJi, and Shangguan, Dongkai,
"Performance of QFP Lead-Free Solder Joints Under Dynamic Mechanical Loading,"
The International Journal of Microcircuits and Electronic Packaging
, vol. 24 no. 4, pp. 346-365, Fourth Quarter 2001.
Arra, Minna, Xie, DongJi, and Shangguan, Dongkai,
"Performance of QFP Lead-Free Solder Joints Under Dynamic Mechanical Loading,"
2002 Proceedings 52nd Electronic Components & Technology
Conference, San Diego, CA, May 28-31, 2002, pp. 346-365.
Arra, Minna, Shangguan, Dongkai, Ristolainen, Eero, and Lepisto, Toivo,
"Solder Balling of Lead-Free Solder Pastes," Journal of Electronic
Materials, vol. 31 no. 11, pp. 1130-1138, Nov. 2002.
Arra, Minna, Shangguan, Dongkai, Xie, DongJi, Sundeline, Janne, Lepisto,
Toivo, and Ristolainen, Eero,
"Study of Immersion Silver and Tin Printed-Circuit-Board Surface Finishes in
Lead-Free Solder Applications," Journal of Electronic Materials
, vol. 33 no. 9, pp. 977-990, Sept. 2004.
Arra, Minna, Geiger, David, Shangguan, Dongkai, and Sjoberg, Jonas,
"Study of SMT Assembly Processes for Fine Pitch CSP Packages,"
Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004
Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S07-1-1-S07-1-10.
Arra, Minna, Shangguan, Dongkai, and Xie, DongJi,
"Wetting of Fresh and Aged Immersion Tin and Silver Surface Finishes by
Sn/Ag/Cu Solder," HKPCA Journal, no. 10, pp. 1-9.
Arrott, A. S., and Heinrich, B.,
"Application of magnetization measurements in iron to high temperature
thermometry," Journal of Applied Physics, vol. 52 no. 3, pp.
2113-2115, Mar. 1981.
Arrott, A. S., Heinrich, B., and Bloomberg, D. S.,
"Domain Configurations, Bloch Walls and Magnetization Processes in Iron
Whiskers from D.C. to 200 kHz. Theory and Experiment II," AIP Conference
Proceedings, vol. 10, pp. 941-960, 1973.
Arrott, A. S., Heinrich, B., and Bloomberg, D. S.,
"Magnetization Processes and Eddy Currents in Iron Whiskers," AIP
Conference Proceedings, vol. 5, pp. 897-901, 1972.
Arrott, A. S., and Lee, J.-G.,
"Simple function for a complex domain configuration," Journal of Applied
Physics, vol. 79 no. 8, pp. 5752-5754, Apr. 15, 1996.
Arrott, A. S., Heinrich, B., and Noakes, J. E.,
"The Role of Dipole-Dipole Interactions in the Critical Behavior of
Ferromagnetic Materials," AIP Conference Proceedings, vol. 10,
pp. 822-826, 1973.
Arrowsmith, Peter,
"Investigation of Field Failures of Power Systems: A Different Whisker Story,"
International Conference on Soldering & Reliability 2015
Proceedings, Toronto, Ontario, Canada, May 19-21, 2015, pp. xx-xx.
Arslanian, Gregory K., Lin, Minfa, Wressell, Amy, and Mebrahtu, Tom,
"Effects of solder reflow conditions on electronics packaging and PCB
assemblies," EMasia, Mar. 2009.
Artaki, I., Ray, U., Rejent, Jerome A., and Vianco, Paul T.,
"An Evaluation of Prototype Circuit Boards Assembled with a Sn-Ag Bi Solder,"
Sandia Report SAND99-2273C, Sept. 1999.
Artaki, I., Ray, U., Gordon, H. M., and Opila, R. L.,
"Corrosion Protection of Copper Using Organic Soldering Preservatives,"
Surface Mount International Conference & Exposition Proceedings of the
Technical Program, Volume I, San Jose, CA, Sept. 1-3, 1992, pp. 503-511.
Artaki, I., Jackson, A. M., and Vianco, P. T.,
"Evaluation of Lead-Free Solder Joints in Electronic Assemblies,"
Journal of Electronic Materials, vol. 23 no. 8, pp. 757-764, Aug. 1994.
Artaki, I., Jackson, A. M., and Vianco, P. T.,
"Fine Pitch Surface Mount Assembly with Lead-Free, Low Residue Solder Paste,"
Surface Mount International Conference & Exposition Proceedings of
the Technical Program, San Jose, CA, Aug. 28-Sept. 1, 1994, pp.
449-459.
Artaki, I., Jackson, A. M., and Vianco, P. T.,
"Fine Pitch Surface Mount Technology Assembly with Lead-free, Low Residue
Solder Paste," Soldering & Surface Mount Technology, vol. 7
no. 2, pp. 27-32, 1995.
Artaki, I., Ray, U., Jackson, A. M., Gordon, H. M., and Vianco, P. T.,
"Solderability Preservative Coatings: Electroless Tin vs Organic Azoles,"
Surface Mount International Conference & Exposition Proceedings of
the Technical Program, Volume I, San Jose, CA, Aug. 31-Sept. 2, 1993,
pp. 414-420.
Artaki, I., Ray, U., Jackson, A. M., Gordon, H. M., and Vianco, P. T.,
"Solderability Preservative Coatings: Electroless Tin vs Organic Azoles,"
Circuit World, vol. 20 no. 3, pp. 23-26, 1994.
Artaki, I., Finley, D. W., Jackson, A. M., Ray, U., and Vianco, P. T.,
"Wave Soldering with Lead-Free Solders," Surface Mount International
Proceedings of the Technical Program, San Jose, CA, Aug. 29-31, 1995,
pp. 495-510 (Sandia Report SAND-95-1372C).
Artaki, I., Finley, D. W., Jackson, A. M., Ray, U., and Vianco, P. T.,
"Wave soldering with Pb-free solders," Sandia Report SAND-95-1372C, July
1995.
Artaki, Iris, Noctor, Donna, Desantis, Charles, Desaulnier, Willie, Felton,
Lawrence, Palmer, Mark, Felty, Joe, Greaves, John, Handwerker, Carol, Mather,
John, Schroeder, Scott, Napp, Duane, Pan, Tsung-Yu, Rosser, Jerald, Vianco,
Paul, Whitten, Gordon, and Zhu, Yun,
"Research Trends in Lead-Free Soldering in the U.S.: NCMS Lead-Free Solder
Project," Proceedings of the First International Symposium on
Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Feb.
1-3, 1999, pp. 602-605.
Arulvanan, Periannan, Zhong, Zhaowei, and Shi, Xunqing,
"Effects of process conditions on reliability, microstructure evolution and
failure modes of SnAgCu solder joints," Microelectronics Reliability
, vol. 46 no. 2-4, pp. 432-439, Feb.-Apr. 2006.
Arutyunov, K. Yu., Danilova, N. P., and Nikolaeva, A. A.,
"Galvanomagnetic properties of quasi-one-dimensional superconductors,"
Journal of Applied Physics, vol. 76 no. 10, pp. 7139-7141, Nov. 15,
1994.
Arutyunov, K. Yu., Danilova, N. P., and Nikolaeva, A. A.,
"Nonequilibrium transport in superconducting filaments," Proceedings
of the 4th International Conference and Exhibition: World Congress on
Superconductivity, Volume 1, Orlando, FL, June 27-July 1, 1994, pp.
359-368.
Arya, Sandeep, Khan, Saleem, Lehana, Parveen, Gupta, Ishan, and Kumar, Suresh,
"Electrical properties of electrodeposited zinc selenide (ZnSe) nanowires,"
Journal of Materials Science: Materials in Electronics, vol. 25
no. 9, pp. 4150-4155, Sept. 2014.
Asai, Hironori,
"Introduction to the MES Conference: Recent Changes," Advancing
Microelectronics, vol. 33 no. 3, pp. 30-32, May/June 2006.
Asai, Shin'Ichiro, Saruta, Ueki, Tobita, Masayuki, Takano, Minoru, and
Miyashita, Yasuo,
"Development of an Anisotropic Conductive Adhesive Film (ACAF) from Epoxy
Resins," Journal of Applied Polymer Science, vol. 56 no. 7, pp.
769-777, May 16, 1995.
Asai, Tadashi, Kiga, Tomoya, Taniguchi, Yoshikuni, Morikawa, Hiroshi, and
Sumiyama, Kenji,
"Suppression of External-Stress-Induced Formation of Tin Whisker by Annealing
of Electroplated Sn-Ag Alloy Films," Nippon Kinzoku Gakkaishi/
Journal of the Japan Institute of Metals, vol. 73 no. 11, pp. 823-832,
Nov. 2009.
Asakawa, Motoo, Sasaki, Wataru, and Shishido, Shunsuke,
"Effect of die approach geometry and bearing length on residual stress after
bar drawing," Wire Journal International, vol. 35 no. 10, pp.
68-72, Oct. 2002.
Asakura, Yoshihiro, and Takahashi, Yasuo,
"Feature Extraction of Pb Free Solder Fillet Profile by an Image Processing
Taking the Profile Scattering into Consideration," Quarterly Journal of
the Japan Welding Society/ Yosetsu Gakkai Ronbunshu, vol. 22 no. 2, pp.
323-333, 2004.
Aschenbrenner, R., Miessner, R., and Reichl, H.,
"Adhesive Flip Chip Bonding on Flexible Substrates," The First IEEE
International Symposium on Polymeric Electronics Packaging, Oct. 26-30,
1997, pp. 86-94.
Aschenbrenner, R., Miessner, R., Becker, K. F., and Reichl, H.,
"Characterization of Adhesive Materials for High Circuit Density
Applications," 4th International Symposium on Advanced Packaging
Materials, Brazelton, GA, Mar. 15-18, 1998, pp. 248-255.
Aschenbrenner, R., Ostmann, A., Motulla, G., Zakel, E., and Reichl, H.,
"Flip Chip Attachment Using Anisotropic Conductive Adhesives and Electroless
Nickel Bumps," Nineteenth IEEE/CPMT International Electronics
Manufacturing Technology Symposium, Austin, TX, Oct. 14-16, 1996, pp.
26-33.
Aschenbrenner, R., Zakel, E., Azdasht, G., Kloeser, A., and Reichl, H.,
"Fluxless Flip Chip Bonding on Flexible Substrates: A Comparison Between
Adhesive Bonding and Soldering," 1995 Surface Mount International
Conference Proceedings of the Technical Program, San Jose, CA, Aug.
29-31, 1995, pp. 91-101.
Aschenbrenner, R., Zakel, E., Azdasht, G., Kloeser, A., and Reichl, H.,
"Fluxless Flip-chip Bonding on Flexible Substrates: A Comparison between
Adhesive Bonding and Soldering," Soldering & Surface Mount
Technology, vol. 8 no. 2, pp. 5-11, 1996.
Aschenbrenner, Rolf, Ostmann, Andreas, Motulla, Gerald, Zakel, Elke, and
Reichl, Herbert,
"Flip Chip Attachment Using Anisotropic Conductive Adhesives and Electroless
Nickel Bumps," IEEE Transactions on Components, Packaging, and
Manufacturing Technology, Part C, vol. 20 no. 2, pp. 95-100, Apr. 1997.
Ashida. Kisho, Kawano, Kenya, Tanaka, Naotaka, Nishikizawa, Atsushi, and
Koike, Nobuya,
"Strength Evaluation of Conductive Adhesive Paste for Die Bonding during
Reflow Soldering," Proceedings of the ASME 2009 InterPack Conference,
Volume 1, San Francisco, CA, July 19-23, 2009, pp. 825-831.
Ashiru, O. A.,
"Morphological and Hardness Properties of Bright and Leveled Silver
Electrodeposit," Proceedings of the AESF SUR/FIN 2000, Chicago,
IL, June 26-29, 2000, pp. xx-xx.
Ashkhotov, O. G., Ashkhotova, I. B., and Krymshokalova, D. A.,
"On the Mechanism of Electron-Stimulated Formation of a Nanosize C-Sn Coating
on a Tin Surface," Physics of Metals and Metallography, vol. 110
no. 6, pp. 553-556, Dec. 2010.
https://doi.org/10.1134/S0031918X10120057
Ashmore, Clive, and Zahn, Michael,
"Improvements in Pb-free Stencils," Circuits Assembly, vol.
17 no. 12, pp. 26, 28-29, Dec. 2006.
Ashmore, Clive, and Goldsmith, Rick,
"Investigating Mass Imaging Lead Free Materials Using Enclosed Print Head
Technology," 2002 NEPCON West - Fiberoptic Expo Conference Proceedings
, 2002, pp. 308-314.
Ashmore, Clive,
"Mass Imaging of Lead Free Materials - What Impact Does Stencil Technology
Have?," 2005 SMTA International Conference Proceedings, Chicago,
IL, Sept. 25-29, 2005, pp. 734-737.
Ashmore, Clive,
"Mass Imaging Performance with Lead-free Solder," Surface Mount
Technology (SMT), vol. 18 no. 11, pp. xx-xx, Nov. 2004.
Ashmore, Clive,
"Optimizing the Print Process for Lead Free Manufacturing," IPC Review
, vol. 48 no. 1, pp. 7, Jan. 2007.
Ashmore, Clive,
"Optimizing the Print Process for Robust Lead-Free Manufacturing,"
International Conference on Lead-free Soldering, Toronto, Ontario, May
16-18, 2006, pp. xx-xx.
Ashmore, Clive,
"Optimizing the Print Process for Lead Free Manufacturing," Route
, Jan. 2007.
Ashmore, Clive,
"The business of lead-free assembly," emsnow, Mar. 10, 2005.
Ashmore, Clive,
"Understanding Pb-Free Stencil Requirements," Circuits Assembly
, vol. 17 no. 2, pp. 44-45, 47-49, Feb. 2006.
Ashmore, Clive,
"Understanding Stencil Requirements for a Lead Free Mass Imaging Process,"
IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim,
CA, Feb. 8-10, 2006, pp. S23-03-1-S23-03-11.
Ashmore, Clive,
"Understanding stencil requirements for a lead-free mass imaging process,"
Global SMT and Packaging, vol. 6 no. 2, pp. 10, 12, 14, 16, 18,
Feb. 2006.
Ashmore, Clive,
"Understanding stencil requirements for a lead-free mass-imaging process,"
Dataweek, vol. xx no. xx, pp. xx-xx, Nov. 1, 2006.
Ashmore, Clive,
"Will your printing process be affected by Pb-free?," Circuits
Assembly, vol. 16 no. 3, pp. 22, Mar. 2005.
Ashmore, Clive,
"Will Your Printing Process Be Affected by Pb-Free?," Lead-Free
Magazine, vol. 5, 2005.
Ashtiani, Fama Ghaffari, George, Allen Jose, Heinrich, Thomas, Wolfangel,
Simon, Shirangi, Hossein, and Klein, Christian,
"Solder Joint Reliability Investigation of Chip Scale Package with Plastic
Core Solder Balls on Thermomechanically Loaded PCBs," 2016 IEEE 66th
Electronic Components and Technology Conference, Las Vegas, NV, May
31-June 3, 2016, pp. 244-250.
Ashworth, M. A., Haspel, D., Wu, L., Wilcox, G. D., and Mortimer, R. J.,
"An Investigation into the Effect of a Post-electroplating Electrochemical
Oxidation Treatment on Tin Whisker Formation," Journal of Electronic
Materials, vol. 44 no. 1, pp. 442-456, Jan. 2015.
Ashworth, M. A., Wilcox, G. D., Higginson, R. L., Heath, R. J., and Liu, C.,
"Effect of direct current and pulse plating parameters on tin whisker growth
from tin electrodeposits on copper and brass substrates," Transactions
of the IMF, vol. 91 no. 5, pp. 260-268, 2013.
https://doi.org/10.1179/0020296713Z.000000000116
Ashworth, M. A., Pearson, H., Wilcox, G. D., Bao, X., and Brightwell, C.,
"The Development of a Tin-Whisker Mitigating Conformal Coating," 8th
Electronic Materials and Assembly Processes for Space (EMPS) Workshop,
Noordwijk, the Netherlands, May 10-12, 2017, pp. xx-xx.
Ashworth, M. A., Wilcox, G. D., Higginson, R. L., Heath, R. J., Liu, C., and
Mortimer, R. J.,
"The effect of electroplating parameters and substrate material on tin whisker
formation," Microelectronics Reliability, vol. 55 no. 1, pp.
180-191, Jan. 2015.
Ashworth, Mark A., Wilcox, Geoffrey D., Higginson, Rebecca L., Heath, Richard
J., and Liu, Changqing,
"An Investigation into Zinc Diffusion and Tin Whisker Growth for Electroplated
Tin Deposits on Brass," Journal of Electronic Materials, vol. 43
no. 4, pp. 1005-1016, Apr. 2014.
Ashworth, Mark Andrew, and Dunn, Barrie,
"An investigation of tin whisker growth over a 32-year period,"
Circuit World, vol. 42 no. 4, pp. 183-196, 2016.
Askari, Davood, and Feng, Gang,
"Finite element analysis of nanowire indentation on a flat substrate,"
Journal of Materials Research, vol. 27 no. 3, pp. 586-591, Feb. 14,
2012.
Askham, Cecilia,
"REACH and LCA--methodological approaches and challenges," International
Journal of Life Cycle Assessment, vol. 17 no. 1, pp. 43-57, Jan. 2012.
Ashkhotov, O. G., Ashkhotova, I. B., and Krymshokalova, D. A.,
"On the Mechanism of Electron-Stimulated Formation of a Nanosize C-Sn Coating
on a Tin Surface," Physics of Metals and Metallography, vol. 110
no. 6, pp. 553-556, Dec. 2010.
https://doi.org/10.1134/S0031918X10120057
Asom, M. T., Kortan, A. R., Kimerling, L. C., and Farrow, R. C.,
"Structure and stability of metastable a-Sn," Applied Physics Letters
, vol. 55 no. 14, pp. 1439-1441, Oct. 2, 1989.
Aspandiar, Raiyo F.,
"Voids in Solder Joints," 2006 SMTA International Conference
Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 406-413.
Aspandiar, Raiyo F.,
"Voids in Solder Joints," 2006 SMTA International Conference
Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 406-413.
Aspandiar, Raiyo F.,
"Voids in Solder Joints," Journal of SMT, vol. 19 no. 4, pp.
28-36, 2006.
Asrar, Nausha,
"Detrimental Effects of Excessive Gold Plating on Lead-Free Solder Joints,"
Journal of Failure Analysis and Prevention, vol. 10 no. 1, pp.
50-55, Feb. 2010.
Asrar, Nausha,
"Detrimental Effects of Excessive Gold Plating on Lead-Free Solder Joints,"
Electronic Device Failure Analysis, vol. 13 no. 1, pp.
4,6-8,10-11, Feb. 2011.
Asrar, Nausha,
"Solder/Metallization Interdiffusion - Case Studies," SMTA International
2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp.
384-388.
Asrar, Nausha, Vancauwenberghe, Oliver, and Prangere, Sebastien,
"Tin Whiskers Formation on an Electronic Product: A Case Study," Journal
of Failure Analysis and Prevention, vol. 7 no. 3, pp. 179-182, June
2007.
Asri, Asma Kamarul, and Hamzah, Esah,
"Corrosion Behaviour of Lead-free and Sn-Pb Solders in 3.5wt% NaCl,"
Advanced Materials Research, vol. 686, pp. 250-260, Apr. 2013.
Asryan, N. A., and Mikula, A.,
"Thermodynamic Properties of Bi-Sn Melts," Inorganic Materials,
vol. 40 no. 4, pp. 386-390, Apr. 2004.
Asryan, Nadezhda, and Mikula, Adolf,
"Thermodynamic properties of liquid Bi-Sn alloys," Zeitschrift fur
Metallkunde, vol. 95 no. 3, pp. 132-135, Mar. 2004.
Asthana, R.,
"Capillarity in Composite Fabrication," Key Engineering Materials
, vol. 151-152, pp. 86-135, 1998.
Aston, Adam, Reinhardt, Andy, and Tiplady, Rachel,
"Europe's Push for Less-Toxic Tech," BusinessWeek online,
Aug. 9, 2005.
Astrom, Anders,
"The Effect of Nitrogen Reflow Soldering in a Lead-Free Process,"
2003 SMTA International Conference Proceedings, Chicago, IL, Sept.
21-25, 2003, pp. 715-721.
Athamneh, Raed Al, Abueed, Mohammed, Hani, Dania Bani, and Hamasha, Sa'd,
"Effect of Aging on SAC305 Solder Joints Reliability in Accelerated Fatigue
Shear Test," SMTA International 2018 Proceedings, Rosemont, IL,
Oct. 14-18, 2018, pp. xx-xx.
Athamneh, Raed Al, Abueed, Mohammed, Hani, Dania Bani, Su, Sinan, Hamasha,
Sa'd, Suhling, Jeffery, and Lall, Pradeep,
"Effect of Aging on the Fatigue Life and Shear Strength of SAC305 Solder
Joints in Actual Setting Conditions," 2019 18th IEEE Intersociety
Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
, Las Vegas, NV, May 28-31, 2019, pp. 1146-1154.
Athamneh, Raed Al, and Hamasha, Sa'd,
"Fatigue Behavior of SAC-Bi and SAC305 Solder Joints With Aging," IEEE
Transactions on Components, Packaging, and Manufacturing Technology,
vol. 10 no. 4, pp. 611-620, Apr. 2020.
Athamneh, Raed Al, Hani, Dania Bani, Ali, Haneen, and Hamasha, Sa'd,
"Fatigue Life Degradation Modeling of SnAgCu Solder Joints After Aging,"
IEEE Transactions on Components, Packaging, and Manufacturing
Technology, vol. 10 no. 7, pp. 1175-1184, July 2020.
Atkinson, Phil,
"The Impact of Pb-free on Processes and Equipment," SMART Group Ireland
Lead-free Seminar, Dublin, Ireland, Oct. 22, 2003.
Atlee, Jennifer, and Kirchain, Randolph,
"Operational Sustainability Metrics Assessing Metric Effectiveness in the
Context of Electronics-Recycling Systems," Environmental Science &
Technology, vol. 40 no. 14, pp. 4506-4513, 2006.
Attada, Bhargava, and Oberoi, Mandeep Singh,
"Sanctions Against Sn/Pb Solder Paste," Surface Mount Technology
, vol. 17 no. 9, pp. 64-65, Sept. 2003.
Attanasio, Claudia, and Colloca, Laura,
"PVC improvement: a new range of eco-compounds," Wire Journal
International, vol. 41 no. 3, pp. 80-85, Mar. 2008.
Aubry, S., and Ortiz, M.,
"The Mechanics of Deformation-Induced Subgrain-Dislocation Structures in
Metallic Crystals at Large Strains," Proceedings: Mathematical, Physical
and Engineering Sciences, vol. 459 no. 2040, pp. 3131-3158, Dec. 8,
2003.
Aucot, Michael,
"Compact Fluorescent Bulbs and Mercury Pollution: Using Material Flow Analysis
to Prioritize Concerns," Journal of Industrial Ecology, vol. 13
no. 5, pp. 658-661, Oct. 2009.
Augis, J. A., DeNure, D. G., LuValle, M. J., Mitchell, J. P., Pinnel, M. R.,
and Welsher, T. L.,
"A Humidity Threshold for Conductive Anodic Filaments in Epoxy Glass Printed
Wiring Boards," 3rd International SAMPE Electronics Conference, Volume
3, Los Angeles, CA, June 20-22, 1989, pp. 1023-1030.
Aurelio, G., Sommadossi, S. A., and Cuello, G. J.,
"Crystal Structure of Cu-Sn-In Alloys Around the n-Phase Field Studied by
Neutron Diffraction," Journal of Electronic Materials, vol. 41
no. 11, pp. 3223-3231, Nov. 2012.
Aurelio, G., Sommadossi, S. A., and Cuello, G. J.,
"Neutron diffraction study of stability and phase transitions in Cu-Sn-In
alloys as alternative Pb-free solders," Journal of Applied Physics
, vol. 112 no. 5, pp. 053520-1-053520-7, Sept. 1, 2012.
Austen, Paul,
"Sensitive Component Degradation," Surface Mount Technology (SMT)
, vol. 23 no. 3, pp. 15, May/June 2009.
Austin, A. E., Richard, N. A., and Wood, Van E.,
"Surface and Grain-Boundary Diffusion of Gold-Copper," Journal of
Applied Physics, vol. 37 no. 10, pp. 3650-3658, Sept. 1966.
Austin, Timothy B.,
"WEEE and RoHS - Environmental Design Strategies," Society of Plastics
Engineers Annual Technical Conference 2006 ANTEC 2006 Conference Proceedings,
Volume 4, Charlotte, NC, May 7-11, 2006, pp. 1829-1831.
Avery, William F., and Baskin, Philip A.,
"The Performance of Fluxes and Lead-Free Solder Alloys In Soldering of
Aluminum," International Conference on Soldering and Reliability,
Toronto, Ontario, Canada, May 16-18, 2012, pp. xx-xx.
Avigal, Y., and Schieber, M.,
"Hollow Whiskers of Silicon Grown by Pyrolysis of Alkyl-Silicon Compounds on
Polycrystalline Quartz Substrates," Journal of Crystal Growth,
vol. 26 no. 1, pp. 157-161, Nov. 1974.
Avila, German,
"Design for Compliance," Appliance Design, vol. 53 no. 11, pp.
38-39, Nov. 2005.
Avila, German,
"Looking Beyond RoHS and WEEE," IPC/JEDEC 12th International Conference
on Lead Free Electronic Components and Assemblies, Santa Clara, CA,
Mar. 7-9, 2006, pp. xx-xx.
Avila, German,
"LOOKING beyond RoHS and WEEE," Electronics Manufacture and Test
, pp. xx-xx, June 2006.
Avila, German,
"Product Development for RoHS and WEEE Compliance," Surface Mount
Technology (SMT), vol. 20 no. 5, pp. 28-31, May 2006.
Avila, Robert,
"It seems that everyone can do lead-free rework, so what is the big deal?,"
Lead-Free Magazine.
Avram, Adrian, Carstea, Horea, Tanase, Mihail, Lie, Ioan, and Babaita, Mircea,
"The Impact of Manufacturing Issues above Lead Free Soldering Alloys,"
28th International Spring Seminar on Electronics Technology: Meeting the
Challenges of Electronics Technology Progress, Vienna, Austria, May
19-20, 2005, pp. 293-297.
Avrami, Melvin,
"Kinetics of Phase Change, I: General Theory," Journal of Chemical
Physics, vol. 7 no. 12, pp. 1103-1112, Dec. 1939.
Avrami, Melvin,
"Kinetics of Phase Change, II: Transformation-Time Relations for Random
Distribution of Nuclei," Journal of Chemical Physics, vol. 8 no.
2, pp. 212-224, Feb. 1940.
Aw, Jie Li, Lee, Jong Bum, Jaafar, Norhanani, Ding, Mian Zhi, Lim, Li-Shiah,
Choong, Chong Ser, and Rao, Vempati Srinivasa,
"Low Temperature Bonding Studies of Au-Studs and AuSn-Solder Bumps on
Au-Surface using Ultrasonic Energy," 2013 IEEE 15th Electronics
Packaging Technology Conference, Singapore, Dec. 11-13, 2013, pp.
384-388.
Awe, O. E., and Oshakuade, O. M.,
"Theoretical prediction of thermodynamic activities of all components in the
Bi-Sb-Sn ternary lead-free solder system and Pb-Bi-Sb-Sn quaternary system,"
Thermochimica Acta, vol. 589, pp. 47-55, Aug. 10, 2014.
Ayari-Kanoun, A., Oberson, V., Paquin, I., Fortin, C., Fontaine, R.,
Danovitch, D., and Drouin, D.,
"Study of influential parameters for Lead-Free Flip chip solder joint
cracking," 2013 European Microelectronics Packaging Conference,
Grenoble, France, Sept. 9-12, 2013, pp. xx-xx.
Ayers, J. E., and Ghandhi, S. K.,
"The Epitaxy of Germanium on Gallium Arsenide," Journal of Crystal
Growth, vol. 89 no. 4, pp. 371-377, July 1, 1988.
Aygun, Kemal,
"Electrical Impacts of Halogen-Free Substrates," Intel Halogen Free
Symposium, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.
Azizsoltani, Hamoon, and Haldar, Achintya,
"Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a
Novel Surrogate Model and Kriging Concept," Journal of Electronic
Packaging, vol. 140 no. 4, pp. 041003-1-041003-11, Dec. 2018.
Azlina, O.Saliza, Ourdjini, A., and Hanim, M. A. Azmah,
"The effect of nickel doping on SAC305 lead-free solders and EN(B)EPIG surface
finish," 2014 IEEE 36th International Electronics Manufacturing
Technology Conference, Johor, Malaysia , Nov. 11-13, 2014, pp. xx-xx.
Azpeitia, L. A., Gervasi, C. A., and Bolzan, A. E.,
"Electrochemical aspects of tin electrodeposition on copper in acid
solutions," Electrochimica Acta, vol. 298, pp. 400-412, Mar. 1,
2019.
Azuma, Keisuke, Sakajiri, Koichi, Matsumoto, Hidetoshi, Kang, Sungmin,
Watanabe, Junji, and Tokita, Masatoshi,
"Facile fabrication of transparent and conductive nanowire networks by wet
chemical etching with an electrospun nanofiber mask template," Materials
Letters, vol. 115, pp. 187-189, Jan. 15, 2014.
Baated, Alongheng, Kim, Keun-Soo, and Suganuma, Katsuaki,
"Effect of intermetallic growth rate on spontaneous whisker growth from a tin
coating on copper," Journal of Materials Science: Materials in
Electronics, vol. 22 no. 11, pp. 1685-1693, Nov. 2011.
Baated, Alongheng, Kim, Keun-Soo, Suganuma, Katsuaki, Huang, Sharon, Jurcik,
Benjamin, Nozawa, Shigeyoshi, and Ueshima, Minoru,
"Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu
solders," Journal of Materials Science: Materials in Electronics,
vol. xx no. x, pp. xx-xx, xxxx.
Baated, Alongheng, Kim, Keun-Soo, Suganuma, Katsuaki, Huang, Sharon, Jurcik,
Benjamin, Nozawa, Shigeyoshi, Stone, Bryan, and Ueshima, Minoru,
"Effects of Reflow Atmosphere and Flux on Tin Whisker Growth of Sn-Ag-Cu
Solder," SMTA International Conference, San Diego, CA, Oct.
4-8, 2009, pp. 802-808.
Baated, Alongheng, Kim, Keun-Soo, Suganuma, Katsuaki, Huang, Sharon, Jurcik,
Benjamin, Nozawa, Shigeyoshi, and Ueshima, Minoru,
"Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu
solders," Journal of Materials Science: Materials in Electronics,
vol. 21 no. 10, pp. 1066-1075, Oct. 2010.
Baated, Alongheng, Kim, Keun-Soo, and Suganuma, Katsuaki,
"Investigation of Mechanism for Spontaneous Zinc Whisker Growth from an
Electroplated Zinc Coating," International Conference on Electronic
Packaging Technology & High Density Packaging, Beijing, China, Aug.
10-13, 2009, pp. 1019-1022.
Baated, Alongheng, Jiang, Junxiang, Kim, Keun-Soo, Suganuma, Katsuaki, Huang,
Sharon, Jurcik, Benjamin, Nozawa, Shigeyoshi, and Ueshima, Minoru,
"Sn-Ag-Cu Soldering Reliability as Influenced by Process Atmosphere,"
IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no.
1, pp. 38-43, Jan. 2010.
Baated, Alongheng, Jiang, Junxiang, Kim, Keun-Soo, Suganuma, Katsuaki, Huang,
Sharon, Jurcik, Benjamin, Nozawa, Shigeyoshi, and Ueshima, Minoru,
"Sn-Ag-Cu Soldering Reliability Influenced by Process Atmosphere,"
International Symposium on High Density Packaging and Microsystem Integration
, Shanghai, China, June 26-28, 2007, pp. xx-xx.
Baated, Alongheng, Hamasaki, Kyoko, Kim, Sun Sik, Kim, Keun-Soo, and Suganuma,
Katsuaki,
"Whisker Growth Behavior of Sn and Sn Alloy Lead-Free Finishes," Journal
of Electronic Materials, vol. 40 no. 11, pp. 2278-2289, Nov. 2011.
Baated, Alongheng, Kim, Keun-Soo, and Suganuma, Katsuaki,
"Whisker growth from an electroplated zinc coating," Journal of
Materials Research, vol. 25 no. 11, pp. 2175-2182, Nov. 2010.
Baba, Shunji,
"Low Cost Flip Chip Technology for Organic Substrates," 1997 Proceedings
47th Electronic Components & Technology Conference, San Jose, CA,
May 18-21, 1997, pp. 268-273.
Babaghorbani, P., Nai, S. M. L., and Gupta, M.,
"Development of lead-free Sn-3.5Ag/SnO2 nanocomposite solders," Journal
of Materials Science: Materials in Electronics, vol. 20 no. 6, pp.
571-576, June 2009.
Babaghorbani, P., and Gupta, M.,
"Enhancing the Mechanical Response of a Lead-Free Solder Using an
Energy-Efficient Microwave Sintering Route," Journal of Electronic
Materials, vol. 37 no. 6, pp. 860-866, June 2008.
Babaghorbani, P., Nai, S. M. L., and Gupta, M.,
"Integrating copper at the nanometer length scale with Sn-3.5Ag solder to
develop high performance nanocomposites," Materials Science and
Technology, vol. 25 no. 10, pp. 1258-1264, Oct. 2009.
Babaghorbani, P., Nai, S. M. L., and Gupta, M.,
"Reinforcements at nanometer length scale and the electrical resistivity of
lead-free solders," Journal of Alloys and Compounds, vol. 478 no.
1-2, pp. 458-461, June 10, 2009.
Babbitt, Callie W., and Ryen, Erinn,
"Bridging the Gap in Forward and Reverse Supply Chains for Evolving Electronic
Products," 2010 IEEE International Symposium on Sustainable Systems and
Technology, Arlington, VA, May 17-19, 2010, pp. xx-xx.
Babbitt, Callie, Kahhat, Ramzy, and Willliams, Eric,
"Disposition flows and management of end-of-life computers from U.S.
universities," Life Cycle Assessment VIII, Seattle, WA, Sept.
30-Oct. 2, 2008, pp. xx-xx.
Babbitt, Callie W., Williams, Eric, and Kahhat, Ramzy,
"Institutional Disposition and Management of End-of-Life Electronics,"
Environmental Science & Technology, vol. 45 no. 12, pp. 5366-5372,
June 15, 2011.
Baber, Forrest, and Guven, Ibrahim,
"Solder Joint Fatigue Life Prediction of Electronic Packages Using Combined
FEA and Peridynamics," 2016 IEEE 66th Electronic Components and
Technology Conference, Las Vegas, NV, May 31-June 3, 2016, pp. 225-231.
Baber, Forrest, and Guven, Ibrahim,
"Solder joint fatigue life prediction using peridynamic approach,"
Microelectronics Reliability, vol. 79, pp. 20-31, Dec. 2017.
Babu, Balakrishnan Ramesh, Parande, Anand Kuber, and Basha, Chiya Ahmed,
"Electrical and electronic waste: a global environmental problem," Waste
Management and Research, vol. 25 no. 4, pp. 307-318, Aug. 2007.
Babu, J. Bubesh, and Yoh, Kanji,
"Effect of As/In-flux on the growth of InAs nanowire by molecular beam
epitaxy," Journal of Crystal Growth, vol. 323 no. 1, pp. 301-303,
May 15, 2011.
Babu, J. Bubesh, and Yoh, Kanji,
"Growth rate enhancement of InAs nanowire by molecular beam epitaxy,"
Journal of Crystal Growth, vol. 322 no. 1, pp. 10-14, May 1, 2011.
Bacconnier, B., Lormand, G., Papapietro, M., Achard, M., and Papon, A.-M.,
"A study of heating rate and texture influences on annealing hillocks by a
statistical characterization of Al thin-film topography," Journal of
Applied Physics, vol. 64 no. 11, pp. 6483-6489, Dec. 1, 1988.
Bacigalupi, Robert J.,
"Effect of Magnetic Field on Iron Whisker Growth," Journal of Applied
Physics, vol. 34, pp. 999-1000, 1963.
Badan, Juan A., Marotti, Ricardo E., Dalchiele, Enrique A., Ariosa, Daniel,
Martin, Francisco, Leinen, Dietmar, Ochoa, Efrain, and Ramos-Barrado, Jose R.,
"Optical properties of Si nanowires: Dependence on substrate crystallographic
orientation and light polarization," Journal of Materials Research
, vol. 30 no. 6, pp. 753-760, Mar. 28, 2015.
Bader, W. G.,
"Dissolution and Formation of Intermetallics in the Soldering Process,"
Physical Metallurgy of Metal Forming, St. Louis, Missouri, Oct. 16-17,
1980, pp. 257-268.
Bader, W. G.,
"Identification of Fused Tin Coatings On Integrated Circuit Device Leads,"
Plating and Surface Finishing, vol. 64 no. 8, pp. 56-57, Aug.
1977.
Bader. W. G.,
"Soldering, the Essential Link in Electronics," Lead-Zinc-Tin '80
, Las Vegas, NV, Feb. 24-28, 1980, pp. 939-950.
Badwe, Nilesh, Byrd, Kevin, Jin, Ou, and Goonetilleke, Pubudu,
"Sn-Bi Low-Temperature Homogeneous Solder Joint Microstructure, Reliability
and Failure Mechanism," Printed Circuit Design and Fab/ Circuits
Assembly, vol. 37 no. 2, pp. 50-55, Feb. 2020.
Badwe, Nilesh,
"Sn-Bi Solder Paste Supply Chain Overview," Proceedings of SMTA
International, Rosemont, IL, Sept. 22-26, 2019, pp. xx-xx.
Badwe, Nilesh, Stafford, Jason, Cook, Jeff, Sidhu, Rajen, and Goonetilleke,
Pubudu,
"Thermal Cycle and Drop Shock Performance of Homogeneous Tin-Bismuth and
Tin-Silver-Copper Solder Joints," SMTA International 2020,
virtual conference, Sept. 28-Oct. 23, 2020, pp. 451-456.
Badwe, Nilesh, Byrd, Kevin, Jin, Ou, and Goonetilleke, Pubudu,
"Tin-Bismuth Low Temperature Homogeneous Second Level Interconnect Solder
Joint Microstructure, Reliability, and Failure Mechanism," Proceedings
of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 507-512.
Bae, Ho-Eun, Choi, Kwang-Seong, Bae, Hyun-Cheol, Eom, Yong-Sung, and Bae,
Dong-sik,
"Fine-Pitch, Low-volume SoP(Solder-on-Pad) Process," 2012 IEEE 14th
Electronics Packaging Technology Conference, Singapore, Singapore, Dec.
5-7, 2012, pp. 723-727.
Bae, Hyun-Cheol, Lee, Haksun, Eom, Yong-Sung, and Choi, Kwang-Seong,
"Novel Low-Volume Solder-on-Pad for Fine Pitch Cu Pillar Bump," 2013
European Microelectronics Packaging Conference, Grenoble, France, Sept.
9-12, 2013, pp. xx-xx.
Bae, Joonho, Kulkarni, Niraj N., Zhou, Ji Ping, Ekerdt, John G., and Shih,
Chih-Kang,
"VLS growth of Si nanocones using Ga and Al catalysts," Journal of
Crystal Growth, vol. 310 no. 20, pp. 4407-4411, Oct. 1, 2008.
Bae, K.-S., and Kim, S.-J.,
"Interdiffusion Analysis of the Soldering Reactions in Sn-3.5Ag/Cu Couple,"
Journal of Electronic Materials, vol. 30 no. 11, pp. 1452-1457,
Nov. 2001.
Bae, Kyoo-Sik, and Kim, Si-Jung,
"Microstructure and adhesion properties of Sn-0.7Cu/Cu solder joints,"
Journal of Materials Research, vol. 17 no. 4, pp. 743-746, Apr. 2002.
Baek, Hyun Moo, Jin, Young Gwan, Hwang, Sun Kwang, Im, Yong-Taek, Son,
Il-Heon, and Lee, Duk-Lak,
"Numerical study on the evolution of surface defects in wire drawing,"
Journal of Materials Processing Technology, vol. 212 no. 4, pp.
776-785, Apr. 2012.
Baek, Rock-Hyun, Baek, Chang-Ki, Choi, Hyun-Sik, Lee, Jeong-Soo, Yeoh, Yun
Young, Yeo, Kyoung Hwan, Kim, Dong-Won, Kim, Kinam, Kim, Dae M., and Jeong,
Yoon-Ha,
"Characterization and Modeling of 1/f Noise in Si-nanowire FETs: Effects of
Cylindrical Geometry and Different Processing of Oxides," IEEE
Transactions on Nanotechnology, vol. 10 no. 3, pp. 417-423, May 2011.
Baek, Sung-min, Park, Yujin, Oh, Cheolmin, Chun, Eun-joon, and Kang, Namhyun,
"Modeling and Experimental Verification of Intermetallic Compounds Grown by
Electromigration and Thermomigration for Sn-0.7Cu Solders," Journal of
Electronic Materials, vol. 48 no. 1, pp. 142-151, Jan. 2019.
Baek, Yong-Ho, Chung, Bo-Mook, Choi, Young-Sik, Choi, Jaeho, and Huh,
Joo-Youl,
"Effects of Ni3Sn4 and (Cu,Ni)6Sn5 intermetallic layers on cross-interaction
between Pd and Ni in solder joints," Journal of Alloys and Compounds
, vol. 579, pp. 75-81, Dec. 5, 2013.
Bag, Rajesh K., Lohani, J., Tyagi, R., Pandya, D. K., and Singh, R.,
"MOVPE growth of in situ Ga catalyzed AlGaAs nanowires on sapphire substrate,"
Journal of Materials Science: Materials in Electronics, vol. 27
no. 3, pp. 2335-2341, Mar. 2016.
Bagal, Vivekanand S., Patil, Girish P., Suryawanshi, Sachin R., More,
Mahendra A., and Chavan, Padmakar G.,
"Vapour-liquid-solid-assisted growth of cadmium telluride nanowires and their
field emission properties," IET Micro & Nano Letters, vol. 11 no.
3, pp. 160-163, Mar. 2016.
Baggerman, A. F. J., and Batenburg, M. J.,
"Reliable Au-Sn Flip Chip Bonding on Flexible Prints," 1994 Proceedings
44th Electronic Components & Technology Conference, Washington,
D.C., May 1-4, 1994, pp. 900-905.
Baggerman, Antal F. J., and Batenburg, Martin J.,
"Reliable Au-Sn Flip-Chip Bonding on Flexible Prints," IEEE Transactions
on Components, Packaging, and Manufacturing Technology, Part B, vol. 18
no. 2, pp. 257-263, May 1995.
Baggio, Thomas J., Suetsugu, Kenichiro, and Okumura, Takeo,
"Challenges and Solutions for Lead-Free Soldering of Large PCB Assembly,"
APEX 2000, Long Beach, CA, Mar. 14-16, 2000, pp.
P-MT3/1-1-P-MT#/1-7.
Baggio, Tom,
"Case Studies of Lead-Free Technology Implemented in Panasonic Electronic
Products," Proceedings of the Technical Program NEPCON West 2000, Volume
1, Anaheim, CA, Feb. 29-Mar. 2, 2000. pp. 451-469.
Baggio, Tom, and Suetsugu, Kenichiro,
"Guidelines for Lead-free Processing," Surface Mount
Technology (SMT), vol. 13 no. 9, pp. 60-66, Sept. 1999.
Baghchesara, Mohammad Amin, Cheraghizade, Mohsen, and Yousefi, Ramin,
"Growth and characterization of ZnTe nanowires grown in a large scale by a CVD
method," Materials Letters, vol. 162, pp. 195-198, Jan. 1, 2016.
Baghchesara, Mohammad Amin, Cheraghizade, Mohsen, Jamali-Sheini, Farid, and
Yousefi, Ramin,
"Photovoltaic and photodetector performance of metal telluride nanowires grown
by a simple CVD method," Journal of Materials Science: Materials in
Electronics, vol. 28 no. 5, pp. 4475-4480, Mar. 2017.
Bagheri, S., Snugovsky, P., Bagheri, Z., Hamilton, C., McCormick, H., and
Romansky, M.,
"Low Melting Alloys: A New Solution to Lead Free Rework Process Issues,"
SMTA International Conference, Orlando, FL, Oct. 7-11, 2007, pp.
341-348.
Bagheri, S., Snugovsky, P., Bagheri, Z., Hamilton, C., and McCormick, H.,
"Solder Joint Microstructure and Reliability Study of Plastic Ball Grid Array
(PBGA196) and Micro Lead Frame (MLF) Components in Lead Free Processes,"
International Conference on Soldering and Reliability, Toronto,
Ontario, Canada, May 19-22, 2009, pp. xx-xx.
Bagheri, S., Snugovsky, P., Bagheri, Z., Hamilton, C., and McCormick, H.,
"Solder Joint Microstructure and Reliability Study of Plastic Ball Grid Array
(PBGA196) and Micro Lead Frame (MLF20) Components in Lead Free Processes,"
Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb.
10-12, 2009, pp. 269-279.
Bagheri, Simin, Snugovsky, Polina, Bagheri, Zohreh, Romansky, Marianne, Kelly,
Matthew, Cole, Marie, Interrante, Mario, Matin, Gregory, and Bergeron,
Christian,
"Solder Joint Microstructure and Reliability Study of Ceramic Ball Grid Array
(CBGA) Components," International Conference on Lead-free Soldering
, Toronto, Ontario, May 16-18, 2006, pp. xx-xx.
Bagheri, Simin, Snugovsky, Polina, Bagheri, Zohreh, Hamilton, Craig, and
McCormick, Heather,
"Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point
Lead Free Alloys," International Conference on Soldering and Reliability
, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.
Bagheri, Simin, Snugovsky, Polina, Bagheri, Zohreh, Hamilton, Craig, and
McCormick, Heather,
"Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point
Lead Free Alloys," 2008 SMTA International Conference Proceedings
, Orlando, FL, Aug. 17-21, 2008, pp. 586-596.
Bagheri, Simin, Snugovsky, Polina, Bagheri, Zohreh, Hamilton Craig, and
McCormick, Heather,
"Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point
Pb-Free Alloys," Circuits Assembly, vol. 19 no. 9, pp.
46-48,62, Sept. 2008.
Bagheripoor, Mahdi, and Klassen, Robert,
"Effect of crystal orientation on the size effects of nano-scale fcc metals,"
Materials Science and Technology, vol. 36 no. 17, pp. 1829-1850,
2020.
https://doi.org/10.1080/02670836.2020.1839193
Bagnetto, Laura Angela,
"Getting the Lead Out: Rapid tooling process speeds CT equipment upgrade,"
Medical Product Manufacturing News, pp. xx-xx, July 2003.
Bahari, Zahra, Elgadi, Mohamed, Rivet, Jacques, and Dugue, Jerome,
"Experimental study of the ternary Ag-Cu-In phase diagram," Journal of
Alloys and Compounds, vol. xxx no. x-x, pp. xxx-xxx, xxxx.
Baheti, Varun A., Kumar, Praveen, and Paul, Aloke,
"Effect of Au, Pd and Pt addition in Cu on the growth of intermetallic
compounds and the Kirkendall voids in the Cu-Sn system," Journal of
Materials Science: Materials in Electronics, vol. 28 no. 22, pp.
17014-17019, Nov. 2017.
Baheti, Varun A., Kashyap, Sanjay, Kumar, Praveen, Chattopadhyay, Kamanio, and
Paul, Aloke,
"Solid-state diffusion-controlled growth of the intermediate phases from room
temperature to an elevated temperature in the Cu-Sn and the Ni-Sn systems,"
Journal of Alloys and Compounds, vol. 727, pp. 832-840, Dec. 15,
2017.
Bai, John G., Zhang, Zhiye Zach, Calata, Jesus N., and Lu, Guo-Quan,
"Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor
Device-Metallized Substrate Interconnect Material," IEEE Transactions on
Components and Packaging Technologies, vol. 29 no. 3, pp. 589-593,
Sept. 2006.
Bai, Ning, Chen, Xu, and Fang, Zhou,
"Effect of Strain Rate and Temperature on the Tensile Properties of Tin-Based
Lead-Free Solder Alloys," Journal of Electronic Materials, vol.
37 no. 7, pp. 1012-1019, July 2008.
Bai, Ning, Chen, Xu, and Gao, Hong,
"Simulation of uniaxial tensile properties for lead-free solders with modified
Anand model," Materials and Design, vol. 30 no. 1, pp. 122-128,
Jan. 2009.
Bai, Ning, Chen, Xu, and Li, Xin,
"Torsional Fatigue of 63Sn-37Pb and Sn-0.7Cu Solders," Key Engineering
Materials, vol. 353-358, pp. 2908-2911, 2007.
Bai, Xiaohui, and Wen, Dianzhong,
"Study on Fabrication Pt nanowires for memristor," Applied Mechanics and
Materials, vol. 58-60, pp. 513-517, June 2011.
Baid, Chitra, and Wright, Roger N.,
"Flow stresses for the modeling of stainless steel and nickel wire drawing,"
Wire Journal International, vol. 37 no. 3, pp. 66-69, Mar. 2004.
Baig, Zaeem, Mirza, Fahad, Parekh, Hardik, and Agonafer, Dereje,
"3-D Fracture Analysis of the BEoL Region of a Flip Chip Package During Die
Attach Process," SMTA International 2013 Conference Proceedings,
Fort Worth, TX, Oct. 13-17, 2013, pp. 163-168.
Baig, Zaeem, Mirza, Fahad, Parekh, Hardik, and Agonafer, Dereje,
"3-D Fracture Analysis of the BEoL Region of a Flip Chip Package During Die
Attach Process," SMTAnews & Journal of Surface Mount Technology
, vol. 27 no. 2, pp. 19-24, Apr.-June 2014.
Baig, Zaeem, Shetty, Tejas S., Sakib, A R. Nazmus, Mirza, Fahad, and Agonafer,
Dereje,
"Impact of Replacing Sn-Ag Bumps with Cu pillars on the BEoL Cu/Low-k Fracture
Under Reflow - A Computational Study," 2014 IEEE Intersociety Conference
on Thermal and Thermomechanical Phenomena in Electronic Systems,
Orlando, FL, May 27-30, 2014, pp. 473-477.
Bailey, C., Lu, H., Yin, C., and Stoyanov, S.
"Modelling the Reliability of Green Electronic Interconnects,"
Proceedings of 2004 International IEEE Conference on the Asian Green
Electronics, Hong Kong, China, Jan 5-9, 2004, pp. 63-67.
Bailey, Chris, Stoyanov, Stoyan, Best, Chris, Yin, Chunyan, Alam, M. O.,
Tollafield, Peter, Stewart, Paul, and Roulston, John,
"Assessment of Refinishing Processes for Electronic Components in High
Reliability Applications," 2013 IEEE 15th Electronics Packaging
Technology Conference, Singapore, Dec. 11-13, 2013, pp. 156-161.
Bailey, Chris,
"Impact of Lead-Free Components and Technology Scaling for High Reliability
Applications," 18th Annual Pan Pacific Microelectronics Symposium
, Wailea-Makena, HI, Jan. 22-24, 2013, pp. xx-xx.
Bajad, Nupur, Kulkarni, Harshada, Dhole, Satish, Thakur, Shiwani, and Tonapi,
Sandeep,
"Effect of Solder Joint Size on Fatigue Life of WL-CSP under Accelerated
Thermal Cycling Using FEM," 2014 IEEE Intersociety Conference on
Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando,
FL, May 27-30, 2014, pp. 1145-1153.
Bajat, J. B., Miskovic-Stankovic, V. B., Maksimovic, M. D., Drazic, D. M., and
Zec, S.,
"Electrochemical deposition and characterization of Zn-Co alloys and corrosion
protection by electrodeposited epoxy coating on Zn-Co alloy,"
Electrochimica Acta, vol. 47 no. 25, pp. 4101-4112, Sept. 25, 2002.
Bajat, J. B., Stankovic, S., and Jokic, B. M.,
"Electrochemical deposition and corrosion stability of Zn-Co alloys,"
Journal of Solid State Electrochemistry, vol. 13 no. 5, pp. 755-762,
May 2009.
Bajkowski, Julian,
"Zinc whiskers tangle data centre ops," ComputerWorld, vol.
xx no. xx, pp. xx, Feb. 12, 2004.
Bakan, Gokhan, Khan, Niaz, Cywar, Adam, Cil, Kadir, Akbulut, Mustafa,
Gokirmak, Ali, and Silva, Helena,
"Self-heating of silicon microwires: Crystallization and thermoelectric
effects," Journal of Materials Research, vol. 26 no. 9, pp.
1061-1071, May 14, 2011.
Baker, G. S.
"Angular Bends in Whiskers," Acta Metallurgica, vol. 5 no. 7, pp.
353-357, July 1957.
Baker, George S.,
"Growth Bends in Iron Whiskers," Journal of Applied Physics, vol.
27, pp. 1561-1562, 1956.
Baker, Gil, and Pops, Horace,
"New perspectives on annealing analysis," Wire Journal International
, vol. 37 no. 3, pp. 70-81, Mar. 2004.
Baker, R. G., and Holden, C. A.,
"Investigation Of Zinc-Nickel Alloy Electrodeposits - Part 1. Rack Plating,"
The 71st AES Annual Technical Conference Proceedings, New York,
NY, July 1984, session N-2 pp. xx-xx.
Baker, Richard G.,
"Conclusion: Whisker Growth," Plating and Surface Finishing, vol.
74 no. 11, pp. 12, 66, Nov. 1987.
Baker, Richard G.,
"Spontaneous Metallic Whisker Growth," Plating and Surface Finishing
, vol. 74 no. 10, pp. 10, Oct. 1987.
Baker, Richard G, and Holden, Clarence A,
"Zinc-nickel alloy electrodeposits: rack plating," Plating and Surface
Finishing, vol. 72 no. 3, pp. 54-57, Mar. 1985.
Bakhishev, Teymur, and Subramanian, Vivek,
"Investigation of Gold Nanoparticle Inks for Low-Temperature Lead-Free
Packaging Technology," Journal of Electronic Materials, vol. 38
no. 12, pp. 2720-2725, Dec. 2009.
Bakkali, S., Jazouli, T., Cherkaoui, M., EbnTouhami, M., El Hajjaji, N., and
Chassaing, E.,
"Influence of M12 Organic Additive On the Electrodeposition of Tin From an
Acid Sulfate Solution," Plating & Surface Finishing, vol. 90
no. 1, pp. 46-49, Jan. 2003.
Bakri, Sitty Nur Syafa, Surif, Salmijah, and Ramasamy, Rajeswari K.,
"A Case Study of Life Cycle Assessment (LCA) on Ballast for Fluorescent Lamp
in Malaysia," 2008 IEEE International Symposium on Electronics and the
Environment, San Francisco, CA, May 19-21, 2008, pp. xx-xx.
Bakshi, Bhavik R., and Ukidwe, Nandan U.,
"The Role of Thermodynamics in Life Cycle Assessment of Existing and Emerging
Technologies," Proceedings of the 2006 IEEE International Symposium on
Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp.
15-20.
Balabas, M. V., Sushkov, A. O., and Budker, D.,
"Rubidium 'whiskers' in a vapour cell," Nature Physics, vol. 3
no. 2, pp. 2, Jan. 2007.
Balackyi, Joe,
"Practical Solutions to Lead Free Reflow Soldering," LEADOUT Hands On
Lead-Free Workshop, Manchester, United Kingdom, June 21, 2006.
Balakrisnan, B., Chum, C. C., Li, M., Chen, Z., and Cahyadi, T.,
"Fracture Toughness of Cu-Sn Intermetallic Thin Films," Journal of
Electronic Materials, vol. 32 no. 3, pp. 166-171, Mar. 2003.
Balaraju, J. N., Selvi, V. Ezhil, and Rajam, K. S.,
"Electrochemical Behavior of Nanocrystalline Ni-P Alloys Containing Tin and
Tungsten," Protection of Metals and Physical Chemistry of Surfaces
, vol. 46 no. 6, pp. 686-691, Nov. 2010.
Balasbas, Victor,
"EAS: Meeting the Total Lead-Free Challenge with Technology," U. S. Tech
, vol. xx no. xx, pp. xx-xx, June 2006.
Baldwin, Daniel F.,
"Flip Chip Interconnection Using Copper Wire Bumps," Advanced
Packaging, vol. 15 no. 3, pp. 44, Mar. 2006.
Baldwin, Daniel F., Deshmukh, Rajan D., and Hau, Christine S.,
"Gallium Alloy Interconnects for Flip-Chip Assembly Applications," 1996
Proceedings 46th Electronic Components & Technology Conference,
Orlando, FL, May 28-31, 1996, pp. 1143-1150.
Baldwin, Daniel F., Deshmukh, Rajan D., and Hau, Christine S.,
"Gallium Alloy Interconnects For Flip-Chip Assembly Applications," IEEE
Transactions on Components and Packaging Technologies, vol. 23 no. 2,
pp. 360-366, June 2000.
Baldwin, Daniel F.,Hau, Christine S., and Deshmukh, Rajan D.,
"Preparation and Properties of Gallium Alloys for Use as Microelectronic
Interconnect Materials," International Journal of Microcircuits and
Electronic Packaging, vol. 19 no. 1, pp. 37-45, First Quarter 1996.
Baldwin, Daniel F., Baynham, Grant, Boustedt, Katarina, and Wennerholm,
Claes,
"Processing and Reliability of Flip Chip with Lead-Free Solders on
Halogen-Free Microvia Substrates," Twenty Seventh Annual IEEE/CPMT/SEMI
International Electronics Manufacturing Technology Symposium, San Jose,
CA, July 17-18, 2002, pp. 310-315.
Baldwin, Daniel, and Kazmierowicz, Philip,
"Taking the Pain Out of Lead-Free Reflow," Assembly, vol. xx
no. xx, pp. xx-xx, Dec. 2003.
Baldwin, K. R., and Smith, C. J. E.,
"Advances in Replacements for Cadmium Plating in Aerospace Applications,"
Transactions of the Institute of Metal Finishing, vol. 74 no. 6,
pp. 202-209, Nov. 1996.
Baldwin, K. R., and Smith, C. J. E.,
"Repair of Metal Coatings Using Environmentally Compliant Brush Plating
Solutions," Plating & Surface Finishing, vol. 84. no. 7, pp.
23-28, July 1997.
Balela, Mary Donnabelle L., Yagi, Shunsuke, and Matsubara, Eiichiro,
"Fabrication of Cobalt Nanowires by Electroless Deposition under External
Magnetic Field," Journal Of The Electrochemical Society, vol.
158 no. 4, pp. D210-d216, 2011.
doi 10.1149/1.3545065
Balela, Mary Donnabelle L., Yagi, Shunsuke, and Matsubara, Eiichiro,
"Growth of Cobalt Nanowires under External Magnetic Field," Advanced
Materials Research, vol. 911, pp. 136-140, Mar. 2014.
Balela, Mary Donnabelle L., Dulin, Lalaine M., Garcia, Erica A., and Tica, Ma.
Janelle H.,
"Synthesis and Characterization of Cobalt-Nickel Nanowires Formed under
External Magnetic Field," Applied Mechanics and Materials, vol.
799-800, pp. 120-124, Oct. 2015.
Bali, R., Fleury, E., Han, S. H., and Ahn, J. P.,
"Interfacial intermetallic phases and nanoeutectic in rapidly quenched
Sn-Ag-Cu on Au under bump metallization," Journal of Alloys and
Compounds, vol. 457 no. 1-2, pp. 113-117, June 12, 2008.
Baliga, John,
"Can Nickel Barriers Eliminate Tin Whiskers?," Semiconductor
International, vol. 27 no. 12, pp. 38, Nov. 1, 2004.
Baliga, John,
"Nanotechnology Comes to the Lead-Free Rescue," Semiconductor
International, vol. xx, no. xx, pp. 32, May 1, 2005.
Baliga, John,
"The Emperor's New Lead-Free Clothes," Semiconductor International
, vol. 23 no. 10, pp. 21, Sept. 2000.
Baliga, John,
"Tin for No-Lead Solder," Semiconductor International, vol. 22
no. 8, pp. 74, July 1999.
Baljko, Jennifer,
"RoHS worries unabated," Electronics Supply & Manufacturing
, Sept. 2006.
Baljko, Jennifer,
"RoHS worries unabated," Green SupplyLine, Sept. 1, 2006.
Balkan, H., Vrtis, J., Lu, H., King, B., Trimmer, B., Meilon, J., and
Alvarado, R.,
"Wafer Level Packaging: Current Solutions and Developing Trends,"
Wafer-Level Congress and Exhibition Conference Proceedings, San Jose,
CA, Oct. 10-12, 2004, pp. xx-xx.
Balkan, Haluk, Patterson, Deborah, Burgess, Guy, Carlson, Craig, Elenius,
Peter, Johnson, Michael, Rooney, Brian, Sanchez, Joseph, Stepniak, David, and
Wood, Jim,
"Flip Chip Reliability: Comparative Characterization of Lead Free (Sn/Ag/Cu)
and 63Sn/Pb Eutectic Solder," 2002 Proceedings 52nd Electronic
Components & Technology Conference, San Diego, CA, May 28-31, 2002,
pp. 1263-1269.
Ball, J., Mendis, B. G., and Reehal, H. S.,
"The effects of substrate self-biasing on the growth of Sn-catalysed silicon
nanowires grown at low pressure," Journal of Materials Science,
vol. 49 no. 5, pp. 2078-2084, Mar. 2014.
Ball, Richard,
"Business can make money from WEEE, says recycle firm," Electronics
Weekly, Mar. 1, 2004.
Ball, Richard,
"Comprehensive WEEE and RoHS toolkit released," Electronics Weekly
, Nov. 1, 2005.
Ball, Richard,
"Copper posts replace solder balls at Intel," Electronics Weekly
, Jan. 26, 2006.
Ball, Richard,
"Electronic waste directive delayed in UK," Electronics Weekly
, Aug. 10, 2005.
Ball, Richard,
"EU studies RoHS exemptions," Electronics Weekly, Oct. 26,
2004.
Ball, Richard,
"European Parliament to update Battery Directive," Electronics
Weekly, May 4, 2004.
Ball, Richard,
"Lead-Free Confusion Must Be Cleared Up, Says U.K.," Electronics
Weekly, May 26, 2004.
Ball, Richard,
"Manufacturer calls for lead-free marking," Electronics Weekly
, Aug. 4, 2004.
Ball, Richard,
"Pb-free will increase PCB costs," Electronics Weekly, Dec.
6, 2004.
Ball, Richard,
"Power wiring legislation is imminent," Electronics Weekly,
Jan. 26, 2006.
Ball, Richard,
"RoHS: Distributor calls for new part numbers," Electronics Weekly
, Sept. 19, 2005.
Ball, Richard,
"RoHS PCB Specification - What Has to Change?," Electronics Weekly
, Dec. 19, 2006.
Ball, Richard,
"Standard aids RoHS compliance," ElectronicsWeekly.com, May
26, 2005.
Ball, Richard,
"Suppliers Have Less Than a Year for RoHS Compliance," Electronics
Weekly, Aug. 18, 2004.
Ball, Richard,
"Test house supports SMEs with RoHS website," electronicsweekly.com
, Sept. 21, 2005.
Ball, Richard,
"U.K. Manufacturers Fail to Tackle Lead-Free Directive," Electronics
Weekly, Oct. 22, 2003.
Ball, Richard,
"UK government publishes rules for WEEE directive," Electronics
Weekly, Dec. 12, 2006.
Ball, Richard,
"UK Government sets WEEE timetable," Electronics Weekly, July
25, 2006.
Ball, Richard,
"WEEE Directive Delayed in U.K.," Electronics Weekly, Aug.
11, 2005.
Ball, Richard,
"WEEE legislation vague, advice conflicting," Electronics Weekly
, Dec. 21, 2006.
Ball, Richard,
"WEEE/RoHS Directives doomed to fail, says consultant," Electronics
Weekly, Mar. 23, 2006.
Ballantyne, Andy, Forrest, Greg, Goosey, Martin, Griguceviciene, Asta,
Juodkazyte, Jurga, Kellner, Rod, Kosenko, Aleksandr, Ramanauskas, Rimantas,
Ryder, Karl, Selskis, Algirdas, Tarozaite, Rima, and Veninga, Erik,
"Advanced surface protection for improved reliability PCB systems (ASPIS),"
Circuit World, vol. 38 no. 1, pp. 21-29, 2012.
Ballentyne, D. W. G.,
"The preparation and properties of certain technologically important
semimetals and semiconductors," Metallurgical Reviews, vol. 16
no. 1, pp. 149-160, 1971.
https://doi.org/10.1179/mtlr.1971.16.1.149
Ballesteros-Gomez, Ana, de Boer, Jacob, and Leonards, Pim E. G.,
"A Novel Brominated Triazine-based Flame Retardant (TTBP-TAZ) in Plastic
Consumer Products and Indoor Dust," Environmental Science &
Technology, vol. 48 no. 8, pp. 4468-4474, Apr. 15, 2014.
Ballinger, Stuart,
"Get wise on waste," Engineer, vol. 293 no. 7716, pp. 25, Jan 29,
2007.
Balluch, B., Smetana, W., and Fleischer, W.,
"A Modified Wetting Balance Set-Up for the Evaluation of Lead-Free Solder / Flux
/ Metallization Systems," 28th International Spring Seminar on
Electronics Technology: Meeting the Challenges of Electronics Technology
Progress, Vienna, Austria, May 19-20, 2005, pp. 150-155.
Balogh, Balint, Illyefalvi-Vitez, Zs., Kotora, Gy., Harvey, T., Kirkpatrick,
D., and Farmer, G.,
"Qualification and Reliability Tests of Flexible Printed Circuits," 30th
International Spring Seminar on Electronics Technology, Cluj-Napoca,
Romania, May 9-13, 2007, pp. 82-87.
Balsavar, Rajiv,
"X-ray Inspection of Voids in BGA Joints with Respect to the IPC-7095A
Specification," IPC Printed Circuits Expo, APEX and the Designer Summit
, Anaheim, CA, Feb. 8-10, 2006, pp. S16-02-1-S16-02-4.
Ban, Gaofang, Sun, Fenglian, Liu, Yang, and Cong, Shaonan,
"Effect of nano-Cu addition on microstructure evolution of
Sn0.7Ag0.5Cu-BiNi/Cu solder joint," Soldering & Surface Mount
Technology, vol. 29 no. 2, pp. 92-98, 2017.
Bandar, A. R., Gifford, R. B., Misiolek, W. Z., and Coulter, J. P.,
"Impact of Die Geometry on Microhardness and Grain Size of Cold-Drawn Steel
Wire," Materials and Manufacturing Processes, vol. 19 no. 3, pp. 507-521,
May 2004.
Bando, Atsushi,
"WEEE & RoHS/ELV Directive and Analysis Technique of Hazardous
Substances," Journal of the Surface Finishing Society of Japan,
vol. 57 no. 12, pp. 843-849, 2006.
Bandyopadhyay, A. K., and Sen, S. K.,
"A study of intermetallic compound formation in a copper-tin bimetallic
couple," Journal of Applied Physics, vol. 67 no. 8, pp.
3681-3688, Apr. 15, 1990.
Banerji, Kingshuk, and Bradley, Edwin,
"Manufacturability and Reliability of Products Assembled with New PCB
Finishes," Surface Mount International Conference & Exposition
Proceedings of the Technical Program, San Jose, CA, Aug. 28-Sept. 1,
1994, pp. 584-590.
Banerjee, S., Dutta, I., and Majumdar, B. S.,
"A molecular dynamics evaluation of the effect of dopant addition on grain
boundary diffusion in tin: Implication for whisker growth," Materials
Science and Engineering: A, vol. 666, pp. 191-198, June 1, 2016.
https://doi.org/10.1016/j.msea.2016.04.049
Baney, Brenda B., Bezier, Pascal, Campbell, Michael S., Parker, Richard D.,
Sneller, Pamela A, Walls, Delbert R., Walsh, Matthew R,. Whiteside, Richard
L., and Whitten, Gordon C.
"Implementation of Lead-Free Solder for Automotive Electronics," SAE
2000 World Congress, Detroit, MI, Mar. 6-9, 2000.
Baney, Brenda,
"WEEE Directive and Its Supply-Chain Ramifications," Printed Circuit
Fabrication, vol. 25 no. 9, pp. 42,44, Sept. 2002.
Baney, Brenda,
"What I Learned about the Environment Last Year," Printed Circuit
Fabrication, vol. 25 no. 1, pp. 44, Jan. 2002.
Baney, Brenda,
"What's Up with Lead-free?," Printed Circuit Fabrication, vol. 24
no. 5, pp. 68-69, May 2001.
Bang, Junghwan, Yu, Dong-Yurl, Ko, Yong-Ho, Kim, Min-Su, Nishikawa, Hiroshi,
and Lee, Chang-Woo,
"Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu
lead-free solder joint," Journal of Alloys and Compounds, vol.
728, pp. 992-1001, Dec. 25, 2017.
Bang, Junghwan, Yu, Dong-Yurl, Ko, Yong-Ho, Nishikawa, Hiroshi, and Lee,
Chang-Woo,
"Intermetallic Compound Formation and Mechanical Property of Sn-Cu-xCr/Cu
Lead-Free Solder Joint," Pan Pacific Symposium 2018 Proceedings,
Kamuela, HI, Feb. 5-8, 2018, pp. xx-xx.
Bang, Woong Ho, Chen, Liang-Shan, Kim, Choong-Un, Lee, Tae-Kyu, and Liu,
Kuo-Chuan,
"Rate Dependence of Bending Fatigue Failure Characteristics of Lead-Free
Solder Joint," 59th Electronic Components & Technology Conference
, San Diego, CA, May 26-29, 2009, pp. 2070-2074.
Banh, Peter, Delhaise, Andre M., and Perovic, Doug D.,
"The Study of Dissolution of Bi Precipitates in Sn Using a Novel In Situ
Heating Technique in the SEM," SMTA Journal, vol. 32 no. 2, pp.
7-13, 2019.
Banijamali, Bahareh, and Mohammed, Ilyas,
"Advanced Simulation/Modeling and Reliability of Fine Pitch (130um) Lead-Free
Flip-Chip Package," 2008 ASME International Mechanical Engineering
Congress and Exposition, Volume 6, Boston, MA, Oct. 31-Nov. 6, 2008,
pp. 235-243.
Banks, Donald R., Burnette, Terry E., Cho, Yeuk-Chow (Dennis), DeMarco,
William T., and Mawer, Andrew J.,
"The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability,"
Surface Mount International Proceedings of the Technical Program, Volume
I, San Jose, CA, Sept. 10-12, 1996, pp. 121-126.
Bansal, Anjul, Nayak, Rajarama, Iyer, Shiva, Vishwanath, MS, and
Krishnankutty, Subash,
"WEEE & RoHS Impact, Current Challenges & Strategy,"
International Conference on Lead-free Soldering, Toronto, Ontario, May
24-26, 2005, pp. xx-xx.
Bansal, Anurag, Ramakrishna, Gnyaneshwar, and Liu, Kuo-Chuan,
"A New Approach for Early Detection of PCB Pad Cratering Failures,"
IPC APEX Expo Technical Conference 2011, Las Vegas, NV, April 12-14,
2011, pp. xx-xx.
Bansal, Anurag, Lee, Tae-Kyu, Liu, Kuo-Chuan, and Xue, Jie,
"Effects of Isothermal Aging and In-Situ Current Stress on the Reliability of
Lead-Free Solder Joints," 2010 Proceedings 60th Electronic Components
and Technology Conference, Las Vegas, NV, June 1-4, 2010, pp.
1529-1535.
Bansal, Anurag, Liu, Kuo-Chuan, and Xue, Jie,
"Evaluation of Defects in Lead-Free BGA Solder Joints Under Random Vibration
Stress," SMTA International 2010 Conference Proceedings, Orlando,
FL, Oct. 24-28, 2010, pp. 150-156.
Bansal, Anurag, Liu, Kuo-Chuan, and Xue, Jie,
"Evaluation of Defects in Lead-Free BGA Solder Joints under Random Vibration
Stress," SMTA Journal, vol. 24 no. 1, pp. 11-17, 2011.
Bansal, Anurag, Yoon, Sam, and Mahadev, Vadali,
"Flexural Strength of BGA Solder Joints with ENIG Substrate Finish Using
4-Point Bend Test," 2005 Pan Pacific Symposium Conference Proceedings
, Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.
Bansal, Anurag, Yoon, Sam, and Mahadev, Vadali,
"Flexural Strength of BGA Solder Joints with ENIG Substrate Finish using
4-Point Bend Test," SMTA Journal, vol. 18 no. 2, pp. 23-29, Apr.
2005.
Bansal, Anurag, Ramakrishna, Gnyaneshwar, and Liu, Kuo-Chuan,
"Method for Early Detection of PCB Bending Induced Pad Cratering," 2011
IEEE 61st Electronic Components and Technology Conference, Lake Buena
Vista, FL, May 31-June 3, 2011, pp. 1255-1262.
Bao, Nifa, Hu, Xiaowu, Li, Yulong, and Jiang, Xiongxin,
"Effects of thermal aging on growth behavior of interfacial intermetallic
compound of dip soldered Sn/Cu joints," Journal of Materials Science:
Materials in Electronics, vol. 29 no. 10, pp. 8863-8875, May 2018.
Bao, Nuo, Wang, Chunjie, Zhu, Lin, and Song, Shunguang,
"Effects of Different Solder Alloys on Reliability of 3D PLUS Solder Joint,"
Advanced Materials Research, vol. 314-316, pp. 1038-1042, 2011.
Bao, Tran Thai, Kim, Yunkyum, Lee, Joonho, and Lee, Jung-Goo,
"Preparation and Thermal Analysis of Sn-Ag Nano Solders," Materials
Transactions, vol. 51 no. 12, pp. 2145-2149, 2010.
Baral, Anil, and Engelken, Robert,
"Modeling, Optimization, and Comparative Analysis of Trivalent Chromium
Electrodeposition from Aqueous Glycine and Formic Acid Baths," Journal
of the Electrochemical Society, vol. 152 no. 7, pp. C504-C512, 2005.
Barba-Gutierrez, Y., Adenso-Diaz, B., and Hopp, M.,
"An analysis of some environmental consequences of European electrical and
electronic waste regulation," Resources, Conservation and Recycling
, vol. 52 no. 3, pp. 481-495, Jan. 2008.
Barbetta, Mike,
"Surface Finishes: an OEM Perspective," CircuiTree, vol. 16
no. 5, pp. xx, May 2003.
Barbetta, Mike,
"The Search for the Universal Surface Finish," Printed Circuit
Design and Manufacture, vol. 21 no. 2, pp. 34, 36-38, Feb. 2004.
Barbieri, R., Coppari, G., and Rudland, D.,
"The Use of Adhesive Technology in the Replacement of Solder for the
Manufacture of the New Fiat 500 Ignition System," Electro International
1994, Boston, MA, May 10-12, 1994, pp. 879-884.
Barbini, Denis, and Marquez, Ursula,
"Cooling Rates in Lead-free and Tin/lead Reflow," Surface Mount
Technology (SMT), vol. 19 no. 4, pp. 36-37, Apr. 2005.
Barbini, Denis, Diepstraten, Gerjan,
"Five steps to successful lead-free soldering," Circuits Assembly
, vol. 12 no. 4, pp. 42-49, Apr. 2001.
Barbini, Denis,
"Implementation of a Lead Free Wave Soldering Process: An In-Depth Look at the
Critical Issues," 2005 Pan Pacific Symposium Conference Proceedings
, Kauai, Hawaii, Jan. 25-27, 2005, pp. xx-xx.
Barbini, Denis, and Wang, Paul,
"Implementing Lead-Free Wave Soldering," Circuits Assembly,
vol. 16 no. 5, pp. 43-44, May 2005.
Barbini, Denis, Jean, Denis, Longgood, Stuart, Howell, Keith, and Miremadi,
Jian,
"iNEMI Lead-Free Wave Soldering Project: An Investigation of Reliability of
Through-Hole Electrical Interconnects," SMTA International 2010
Conference Proceedings, Orlando, FL, Oct. 24-28, 2010, pp. 666-673.
Barbini, Denis, Chu, Quyen, Jean, Denis, Longgood, Stuart, Lotosky, Paul, and
Shea, Chrys,
"Lead Free Wave Soldering: Influence of Alloys, Board Design, and Process
Parameters on Defect Formation," SMTA International Conference,
Orlando, FL, Oct. 7-11, 2007, pp. 751-759.
Barbini, Denis,
"Lead Free Wave Soldering: Process Optimization and Joint Performance,"
SMTA International 2010 Conference (Presentations), Orlando, FL, Oct.
24-28, 2010.
Barbini, Denis, Wang, Paul, Biocca, Peter, Chu, Quyen, Dick, Tim, Jean, Denis,
Longgood, Stuart, Shea, Chrys, Sweatman, Keith, and Yuen, Mike,
"Lead Free Wave Soldering: Process Optimization for Simple to Highly Complex
Boards," 2007 Pan Pacific Microelectronics Symposium & Exhibit
, Maui, HI, Jan. 30-Feb. 1, 2007, pp. xx-xx.
Barbini, Denis, Wang, Paul, Biocca, Peter, Chu, Quyen, Dick, Tim, Jean, Denis,
Longgood, Stuart, Shea, Chrys, Sweatman, Keith, and Yuen, Mike,
"Lead Free Wave Soldering: Process Optimization for Simple to Highly Complex
Boards," SMTAnews & Journal of Surface Mount Technology, vol.
20 no. 2, pp. 19-27, Apr.-June 2007.
Barbini, Denis, Wang, Paul, Biocca, Peter, Chu, Quyen, Dick, Tim, Jean, Denis,
Longgood, Stuart, Shea, Chrys, Sweatman, Keith, and Yuen, Mike,
"Lead Free Wave Soldering: Process Optimization for Simple to Highly Complex
Boards," Successful Lead-Free/RoHS Strategies Conference,
Boxborough, MA, June 20-21, 2007, pp. xx-xx.
Barbini, Denis, Jean, Denis, Longgood, Stuart, Howell, Keith, and Miremadi,
Jian,
"Lead-Free Wave Soldering Project: Performance of Lead Free Through-Hole
Electrical Interconnects," SMTA International 2011 Conference
Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 766-773.
Barbini, Denis, Marquez de Tino, Ursula, Kalkundri, Kaustubh, and Diepstraten,
Gerjan,
"Liquid Soldering Techniques and Process Optimization - A Case Study for Low
Defect Wave and Selective Soldering Processes," SMTA International
Conference, Orlando, FL, Oct. 7-11, 2007, pp. 255-263.
Barbini, Denis,
"Optimizing Selective Soldering," Circuits Assembly, vol. 20
no. 9, pp. 37, Sept. 2009.
Barbini, Denis,
"Pad Cratering: Assessing Long Term Reliability Risks," Medical
Electronics Symposium 2011 Proceedings, Tempe, AZ, Sept. 27-28, 2011,
pp. xx-xx.
Barbini, Denis, Diepstraten, Gerjan, and Marquez, Ursula,
"Process Considerations for Optimizing a Reflow Profile," Surface
Mount Technology (SMT), vol. 19 no. 7, pp. 28, 30-31, July 2005.
Barbini, Denis,
"Protecting the Pb-Free Solder Pot," Circuits Assembly, vol.
17 no. 3, pp. 52, Mar. 2006.
Barbini, Denis,
"Requirements for Implementation of Lead-free Soldering," Surface
Mount Technology (SMT), vol. 18 no. 4, pp. 52, Apr. 2004.
Barbini, Denis, and Meilunas, Michael,
"Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size, Cyclic
Strain and Microstructure," SMTA International 2011 Conference
Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 292-300.
Barbini, Denis,
"STEP 2: Process Control," Surface Mount Technology (SMT),
vol. 21 no. 2, pp. 55-57, Feb. 2007.
Barbini, Denis,
"TGA Analysis of No-Clean Pb-Free Flux Behavior," Circuits Assembly
, vol. 19. no. 4, pp. 65, Apr. 2008.
Barbini, Denis, and Geibig, Jack,
"The Relationship between Reflow Soldering Processes and Power Consumption,"
Surface Mount Technology (SMT), vol. 18 no. 10, pp. 28-32,
Oct. 2004.
Barbini, Denis, and Wang, Paul,
"Wave solder: Process otptimization for simple to complex boards,"
Global SMT and Packaging, vol. 7 no. 9, pp. 10-12, 14, 16-17, Sept.
2007.
Barbosa, Flavia V., Teixeira, Jose C. F., Teixeira, Senhorinha F. C. F., Lima,
Rui A. M. M., Soares, Delfim F., and Pinho, Diana M. D.,
"Rheology of F620 solder paste and flux," Soldering & Surface Mount
Technology, vol. 31 no. 2, pp. 125-132, 2019.
Barger, Mike,
"Flip Chip Assembly with Stud Bumping," empfasis, pp. xx-xx,
Jan. 2008.
Barghouthi, Nasma,
"Canada raises the bar for responsible electronics recycling,"
Green SupplyLine, Nov. 17, 2006.
Barik, El Mostafa, Gillot, Charlotte, and Hodaj, Fiqiri,
"Optimization of soldering experiments for power devices interconnection and
packaging," 2020 IEEE 8th Electronics System-Integration Technology
Conference, Tonsberg, Norway, Sept. 15-18, 2020, pp. xx-xx.
Barman, Binay Kumar Deb, Singh, Shobhit Pratap, and Kumar, Praveen,
"Processing and mechanical behavior of Cu-Bi alloys with high volume fraction
of Bi: Suitability for high temperature soldering application,"
Materials Science and Engineering: A, vol. 666, pp. 339-349, June 1,
2016.
Barnett, M. R., Kelly, G. L., and Hodgson, P. D.,
"Predicting the Critical Strain for Dynamic Recrystallization using the
Kinetics of Static Recrystallization," Scripta Materialia, vol.
43 no. 4, pp. 365-369, July 28, 2000.
Barney, Linda, and Rubinger, Jack,
"The Cost of Compliance: A Case Study," CircuiTree, vol. 19
no. 1, pp. xx-xx, Jan. 2006.
Barns, R. L., and Ellis, W. C.,
"Whisker Crystals of Gallium Arsenide and Gallium Phosphide Grown by the
Vapor-Liquid-Solid Mechanism," Journal of Applied Physics, vol.
36 no. 7, pp. 2296-2301, July 1965.
Barnstead, Mike,
"Electroless Nickel: Beyond ELV," Products Finishing, vol. 71
no. 6, pp. xx-xx, Mar. 2007.
Barnstead, Mike, Beckett, Duncan, and Morcos, Boules,
"EN Versus EN," Products Finishing, vol. 74 no. 1, pp. 18-21,
Oct. 2009.
Barnstead, Mike,
"Review & Forecast: Environmental Compliance Changes Approach to Business,"
Metal Finishing, vol. xx no. xx, pp. xx-xx, Jan. 6, 2006.
Barnstead, Mike, and Bieler, Chrissy,
"Trivalent Chromium for a New Generation," Metal Finishing, vol.
107 no. 1, pp. 27-30,33, Jan. 2009.
Barr, Gordon O.,
"Influences on Solderability and Cleanliness by the Use of Various Copper
Protection Media," Proceedings of the Technical Program NEPCON West '95,
Volume 1, Anaheim, CA, Feb. 26-Mar. 2, 1995, pp. 382-390.
Barr, Michael,
"Unintended acceleration and other embedded software bugs," Embedded
Systems Design (ESD), vol. 24 no. 3, pp. 9-10,12,29, Apr. 2011.
Barr, Stephanie,
"Mitigating and Preventing the Growth of Tin and Other Metal Whiskers on
Critical Hardware," The Aerospace Corporation, 2007.
Barr, Stephanie,
"Mitigating and Preventing the Growth of Tin and Other Metal Whiskers on
Critical Hardware (presentation)," The Aerospace Corporation, 2007.
Barrett, Kelly,
"Learning to Drop Lead," Electronic News, vol. 46 no. 38, pp.
74, Sept. 18, 2000.
Barrett, Kelly,
"Search for Packaging Survivors," Electronic News, vol. 46
no. 30, pp. 56, July 24, 2000.
Barry Jr., Edward P.,
"Use of Tin on Electrical Components for Space Vehicles," Department of
the Air Force SMC Regulation 800-27.
Barry, John D., Ervin, Matthew, Molstad, Jay, Wickenden, Alma, Brintlinger,
Todd, Hoffman, Patrik, and Meingailis, John,
"Electron beam induced deposition of low resistivity platinum from Pt(PF3)4,"
Journal of Vacuum Science & Technology B, vol. 24 no. 6, pp.
3165-3168, Nov./Dec. 2006.
Barry, N., Jones, I. P., Hirst, T., Fox, I. M., and Robins, F.,
"High-cycle fatigue testing of Pb-free solder joints," Soldering &
Surface Mount Technology, vol. 19 no. 2, pp. 29-38, 2007.
Barsoum, M. W., Hoffman, E. N., Doherty, R. D., Gupta, S., and Zavaliangos,
A.,
"Driving Force and Mechanism for Spontaneous Metal Whisker Formation,"
Physical Review Letters, vol. 93 no. 20, pp. 206104-1-206104-4,
June 25, 2004.
Bartels, F., Morris Jr., J. W., Dalke, G., and Gust, W.,
"Intermetallic Phase Formation in Thin Solid-Liquid Diffusion Couples,"
Journal of Electronic Materials, vol. 23 no. 8, pp. 787-790, Aug. 1994.
Bartels, F., Linch, H., Xu, P., and Morris Jr., J. W.,
"Mechanical Properties of Sn-Bi Solder Joints," Proceedings of the 20th
International Symposium on Testing and Failure Analysis, Los Angeles,
CA, Nov. 13-18, 1994, pp. 479-483.
Barten, P. G. J.,
"Continue waarneming van het rekristallisatie-proces bij metalen met
gepolariseerd licht," Nederlands Tijdschrift voor Natuurkunde,
vol. 20, pp. 25-35, 1954.
Barth, Sven, Kolesnik, Maria M., Donegan, Keith, Krstic, Vojislav, and
Holmes, Justin D.,
"Diameter-Controlled Solid-Phase Seeding of Germanium Nanowires: Structural
Characterization and Electrical Transport Properties," Chemistry of
Materials, vol. 23 no. 14, pp. 3335-3340, July 26, 2011.
Barthelmes, J., Wunderlich, C., Danker, M., and Neoh, D.-G.,,
"Successfully Linking Leadframe Roughening Processes for Adhesion Improvement
to the Ultra Thin Ni/Pd/Au Technology," SEMICON 2005 Singapore
, Singapore, 2005, pp. xx-xx.
Barthelmes, Jurgen, Wunderlich, Christian, and Lam, Patrick,
"A New Generation of Leadframe (LF) Roughening for MSL Improvement,"
SEMICON 2006 China, China, 2006, pp. xx-xx.
Barthelmes, Jurgen, Lagorce-Broc, Florence, Kuhlkamp, Peter, Kok, Sia-Wing,
and Neoh, Din-Ghee,
"Different Storage Conditions have Different Whisker Growth Mechanisms - Can
Bright Tin be an Alternative to Matt Tin?," International Electronic
Manufacturing Technology 2006, Kuala Lumpur, Malasia, 2006, pp. xx-xx.
Barthelmes, Jurgen, Lagorce-Broc, Florence, Kuhlkamp, Peter, Kok, Sia-Wing,
and Neoh, Din-Ghee,
"Different Storage Conditions have Different Whisker Growth Mechanisms - Can
Bright Tin be an Alternative to Matt Tin ?," 31st International
Conference on Electronics Manufacturing and Technology, Kuala Lumpur,
Malasia, Nov. 8-10, 2007, pp. 257-261.
Barthelmes, Jurgen, Kok, Sia-Wing, Neoh, Din-Ghee, and Kurtz, Olaf,
"Highly efficient corrosion protection for plated pure tin surfaces,"
2008 33rd IEEE/CPMT International Electronic Manufacturing Technology
Symposium, Penang, Malaysia, Nov. 4-6, 2008, pp. xx-xx.
Barthelmes, Jurgen, Kuhlkamp, Peter, Lagorce-Broc, Florence, and Neoh,
Din-Ghee,
"Quantification of the influence of all important physical and chemical Tin
plating bath parameters on the propensity for whisker formation,"
SEMICON Singapore 2006, Singapore, 2006, pp. xx-xx.
Barthelmes, Jurgen, and Yap, Yoon Foong,
"Reliable Adhesion-Enhanced Leadframes plated with Ultrathin Ni/Pd/Au,"
SEMICON 2005 Europe, 2005, pp. xx-xx.
Barthelmes, Jurgen, Crema, Paolo, Kuhlkamp, Peter, and Kurtz, Olaf,
"The necessity of corrosion protection for solderable pure tin deposits on IC
outer leads," European Microelectronics and Packaging Conference,
Rimini, Italy, June 15-18, 2009, pp. xx-xx.
Barthelmes, Jurgen, Crema, Paolo, and Kuhlkamp, Peter,
"Whisker Growth during Heat-Humidity Storage - Mechanism and Factors of
Influence," SEMICON Singapore 2007, Singapore, 2007, pp.
xx-xx.
Barthelmy, Michael,
"Problems with Pure Tin Coatings," NASA GSFC Materials Engineering
Branch, Jan. 17, 2001.
Bartholomew, P. M.,
"Review of Conductive Adhesives and Inks for Microengineered Devices,"
IEE Colloquium on Assembly and Connections in Microsystems (Digest no.
1997/004), Feb. 26, 1997, pp. 6/1-6/3.
Bartlett, R. J., and Kimble, J. M.,
"Behavior of Chromium in Soils: II. Hexavalent Forms," Journal of
Environmental Quality, vol. 5 no. 4, pp. 383-386, Oct.-Dec. 1976.
Barto, Seba, and Mach, Pavel,
"Climatic Resistance of Electrically Conductive Adhesive Modified with Silver
Nanoparticles," 2011 34th International Spring Seminar on Electronics
Technology, Tratanska Lomnica, Slovakia, May 11-15, 2011, pp. 128-130.
Barto, Seba, and Mach, Pavel,
"Influence of Curing Process Parameters on Quality of Electrically Conductive
Joints," 2010 33rd International Spring Seminar on Electronics
Technology, Warsaw, Poland, May 12-16, 2010, pp. 147-150.
Barto, Seba, Cinert, Jakub, and Mach, Pavel,
"Influence of Thermal Aging on the Reliability of Electrically Conductive
Adhesives," 2011 IEEE 17th International Symposium for Design and
Technology in Electronic Packaging, Timisoara, Romania, Oct. 20-23,
2011, pp. 305-308.
Barto, Seba, and Mach, Pavel,
"Resistance and Non-Linearity of Electrically Conductive Adhesives Aged by
Thermal, Humidity and Combined Aging," 2011 IEEE 17th International
Symposium for Design and Technology in Electronic Packaging, Timisoara,
Romania, Oct. 20-23, 2011, pp. 59-62.
Barto, Seba, and Mach, Pavel,
"Sensitivity of Resistance, Noise and Nonlinearity of Conductive Adhesive
Joints to Changes in Adhesive," 2016 IEEE 22nd International Symposium
for Design and Technology in Electronic Packaging, Oradea, Romania,
Oct. 20-23, 2016, pp. 40-43.
Barto, Seba, and Mach, Pavel,
"Tolerance Design of Curing Process of Electrically Conductive Adhesives,"
2010 33rd International Spring Seminar on Electronics Technology,
Warsaw, Poland, May 12-16, 2010, pp. 103-106.
Barto, Seba, and Radev, Radoslav,
"Using Fractional Factorial Experiments for Determination of Factors
Influencing Parameters of Electrically Conductive Adhesives," 2012 35th
International Spring Seminar on Electronics Technology, Bad Aussee,
Austria, May 9-13, 2012, pp. 266-269.
Barton, Bruce, and Shea, Chrys,
"Lead-free implementation: Time to get practical," EMasia,
July 2005.
Barton, Bruce, Shea, Chrys, Belmonte, Joe, and Kirby, Ken,
"Practical Pb-Free Implementation," Circuits Assembly, vol.
16 no. 9, pp. 40-47, Sept. 2005.
Bartosik, Lukasz, Stafiej, Janusz, and Caprio, Dung Di,
"3D simulations of ordered nanopore growth in alumina," Electrochimica
Acta, vol. 188, pp. 218-221, Jan. 10, 2016.
Basaran, Cemal, and Lin, Minghui,
"Electromigration induced strain field simulations for nanoelectronics
lead-free solder joints," International Journal of Solids &
Structures, vol. 44 no. 14-15, pp. 4909-4924, July 2007.
Basaran, Cemal, and Abdulhamid, Mohd F.,
"Low temperature electromigration and thermomigration in lead-free solder
joints," Mechanics of Materials, vol. 41 no. 11, pp. 1223-1241,
Nov. 2009.
Basaran, Cemal, Li, Shidong, Hopkins, Douglas C., and Yao, Wei,
"Mean Time to Failure of SnAgCuNi Solder Joints under DC," 2012 13th
IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in
Electronic Systems, San Diego, CA, May 30-June 1, 2012, pp. 518-520.
Basaran, Cemal, Sellers, Michael S., Schultz, Andrew J., Kofke, David A., and
Lee, Yongchang,
"Solder Joint Grain Boundary Structure and Diffusivity via Molecular Dynamics
Simulations," 2012 13th IEEE Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May
30-June 1, 2012, pp. 514-517.
Basaran, Cernal,
"Damage Mechanics of Solder Joints Under High Current Density," Key
Engineering Materials, vol. 345-356 II, pp. 1403-1410, 2007.
Basavanhally, Nagesh R., Chang, David D., Cranston, Benjamin H., and Seger
Jr., Steven G.,
"Direct Chip Interconnect with Adhesive-Connector Films," 1992
Proceedings 42nd Electronic Components & Technology Conference, San
Diego, CA, May 18-20, 1992, pp. 487-491.
Basavanhally, Nagesh R., Chang, David D., Cranston, Ben, and Segar Jr., Steve
G.,
"Direct Chip Interconnect with Adhesive Conductor Films," IEEE
Transactions on Components, Hybrids, and Manufacturing Technology, vol.
15 no. 6, pp. 972-976, Dec. 1992.
Basdere, Bahadir, and Seliger, Guenther,
"Disassembly Factories for Electrical and Electronic Products To Recover
Resources in Product and Material Cycles," Environmental Science &
Technology, vol. 37 no. 23, pp. 5354-5362, 2003.
Bashir, M. Nasir, Haseeb, A. S. M. A., Rahman, Abu Zayed M. Saliqur, and
Fazal, M. A.,
"Effect of Ni Nanoparticles on Intermetallic Compounds Formation in SAC305
Solder Joint under High Current Density," 2014 IEEE 36th International
Electronics Manufacturing Technology Conference, Johor, Malaysia , Nov.
11-13, 2014, pp. xx-xx.
Bashir, M. Nasir, and Haseeb, A. S. M. A.,
"Improving mechanical and electrical properties of Cu/SAC305/Cu solder joints
under electromigration by using Ni nanoparticles doped flux," Journal of
Materials Science: Materials in Electronics, vol. 29 no. 4, pp.
3182-3188, Feb. 2018.
Bashir, M. Nasir, Haseeb, A. S. M. A., Rahman, Abu Zayed Mohammad Saliqur,
Fazal, M. A., and Kao, C. R.,
"Reduction of electromigration damage in SAC305 solder joints by adding Ni
nanoparticles through flux doping," Journal of Materials Science,
vol. 50 no. 20, pp. 6748-6756, Oct. 2015.
Basit, Munshi M., Motalab, Mohammad, Suhling, Jeffrey C., and Lall, Pradeep,
"The Effects of Aging on the Anand Viscoplastic Constitutive Model for SAC305
Solder," 2014 IEEE Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems, Orlando, FL, May
27-30, 2014, pp. 112-126.
Basit, Munshi M., Motalab, Mohammad, Roberts, Jordan C., Suhling, Jeffrey C.,
and Lall, Pradeep,
"The Effects of Silver Content and Solidification Profile on the Anand
Constitutive Model for SAC Lead Free Solders," 2014 IEEE Intersociety
Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
, Orlando, FL, May 27-30, 2014, pp. 488-502.
Basit, Munshi M., Motalab, Mohammad, Suhling, Jeffrey C., Hai, Zhou, Evans,
John, Bozack, Michael J., and Lall, Pradeep,
"Thermal Cycling Reliability of Aged PBGA Assemblies - Comparison of Weibull
Failure Data and Finite Element Model Predictions," 2015 IEEE 65th
Electronic Components and Technology Conference, San Diego, CA, May
26-29, 2015, pp. 106-117.
Baskin, Philip,
"Challenges in Attaining Lead-Free Solders," Welding Journal,
vol. 86 no. 3, pp. 58-61, Mar. 2007.
Bassett, Glenn, and Lesem, Don,
"A love affair with lead," Electronic Products, vol. 48 no. 1,
pp. 79-80, June 2005.
Bassett, Glenn,
"Countdown to RoHS and Beyond," Avnet Advantage, May 2006.
Bassett, Glenn,
"Design for Environment -- Running Out of Time," Avnet Advantage
, Feb. 2005.
Bassett, Glenn,
"In Search of Restricted Substances," Avnet Advantage, Nov.
2004.
Bassett, Glenn,
"It's Real When You Read About It in the Wall Street Journal,"
Avnet Advantage, May 2005.
Bastecki, Chris,
"A Benchmark Process for the Lead-Free Assembly of Mixed Technology PCB's,"
Sept. 1999.
Bastecki, Chris,
"Lead-Free Assembly of Mixed-Technology PCBs," Surface Mount Technology
(SMT), vol. 11 no. 5, pp. 52-58, May 1997.
Bastin, Lisa Hamburg,
"Lead Free: How to Deal," Circuits Assembly, vol. 15 no.
7, pp. 7, July 2004.
Bastin, Lisa Hamburg,
"Lead Free: Time's Running Out," Lead-Free Magazine, vol. 2.
Bastow, Eric,
"5 Solder Families and How They Work," Advanced Materials &
Processes, vol. xx no. xx, pp. 26-29, Dec. 2003.
Bastow, Eric,
"Reflow Profiling on the Electrical reliability of No-Clean Solder Paste Flux
Residues," Surface Mount Technology (SMT), vol. 30 no. 4, pp.
8,1012,14,16-18,20-22,24-25, Apr. 2015.
Bastow, Eric, and Jensen, Timothy,
"The Proliferation of Lead-Free Alloys," SMTA International Conference
, San Diego, CA, Oct. 4-8, 2009, pp. 453-457.
Bates, James A.,
"Comparison of Alkaline Zinc-Nickel and Acid Zinc-Nickel as a Replacement
Coating for Cadmium," 15th AESF/EPA Pollution Prevention and Control
Conference, Orlando, FL, Jan. 24-27, 1994, pp. 155-165.
Bates, James A.,
"Comparison of Alkaline Zn-Ni & Acid Zn-Ni As a Replacement Coating for
Cadmium," Plating & Surface Finishing, vol. 81 no. 4, pp.
36-40, Apr. 1994.
Bath, J., Garcia, R., Uchida, N., Takahashi, H., Clark, G., and Itoh, M.,
"Part I: Developing tin-lead and lead-free solder pastes," EngineerIT
, pp. 35-37, Nov. 2009.
Bath, J., Garcia, R., Uchida, N., Takahashi, H., Clark, G., and Itoh, M.,
"Part II: Developing tin-lead and lead-free solder pastes," EngineerIT
, pp. 38-40, Jan, 2010.
Bath, Jasbir, Clark, Gordon, Jensen, Tim, Michalkiewicz, Renee, and Toleno,
Brian,
"A review of halogen/halide-free test methods and classifications for
soldering materials," Global SMT and Packaging, vol. 11 no.
6, pp. 26-31,58, June 2011.
Bath, Jasbir, Itoh, Manabu, Clark, Gordon, Mori, Kimiaki, Takahashi, Hajime,
Yokota, Kyosuke, and Garcia, Roberto,
"An Investigation into Low Silver Lead-Free Alloy Solder Paste for Electronics
Manufacturing Applications," SMTA International 2011 Conference
Proceedings, Fort Worth, TX, Oct. 16-20, 2011, pp. 731-740.
Bath, Jasbir, Itoh, Manabu, Clark, Gordon, Fuji, Masatoshi, Takahashi, Hajime,
and Garcia, Roberto,
"An Investigation into the Development of Lead-Free Solder Paste for Package
on Package (PoP) Component Manufacturing Applications," SMTA
International 2010 Conference Proceedings, Orlando, FL, Oct. 24-28,
2010, pp. 1-4.
Bath, Jasbir, Itoh, Manabu, Clark, Gordon, Fuji, Masatoshi, Takahashi,
Hajime, and Garcia, Roberto,
"An Investigation into the Development of Lead-Free Solder Paste for Package
on Package (PoP) Component Manufacturing Applications," SMTA Journal
, vol. 23 no. 4, pp. 30-35, 2010.
Bath, Jasbir, Itoh, Manabu, Clark, Gordon, Uchida, Noriyoshi, Takahashi,
Hajime, and Garcia, Roberto,
"An Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes
to Reduce Voiding in Large Contact Area Power Transistor/QFN Type Components,"
SMTA International 2010 Conference Proceedings, Orlando, FL, Oct.
24-28, 2010, pp. 909-914.
Bath, Jasbir,
"Assessment of Low-Ag Solder Alloys for General Lead-Free Assembly,"
Surface Mount Technology (SMT), vol. 27 no. 2, pp. 58-60,62,64,66-68,
Feb. 2012.
Bath, Jasbir,
"Can Existing Tools Survive Pb-Free Soldering?," Circuits Assembly
, vol. 16 no. 7, pp. 39, July 2005.
Bath, Jasbir,
"Can Existing Tools Survive Pb-Free Soldering?," Printed Circuit
Design and Manufacture, vol. 22 no. 7, pp. 18, 20-21, July 2005.
Bath, Jasbir, Joshi, Shantanu, and Segura, Roberto,
"Evaluations on the Mixing of the Tin-Bismuth Paste with Sn3ag0.5Cu BGA
Components in Terms of Peak Temperature, Time Over Melting and Paste Volume,"
Proceedings of SMTA International, Rosemont, IL, Sept. 22-26,
2019, pp. 159-168.
Bath, Jasbir, Chu, Quyen, Ghalib, Nabel, Han, Charlie, and Smith, Greg,
"iNEMI Lead-Free Micro-BGA, CBGA, Mictor Connector and Through-Hole DIP Rework
Evaluations," 2005 SMTA International Conference Proceedings,
Chicago, IL, Sept. 25-29, 2005, pp. 144-151.
Bath, Jasbir, Garcia, Roberto, Uchida, Noriyoshi, Takahashi, Hajime, Clark,
Gordon, and Itoh, Manabu,
"Investigation and Development of Tin-Lead and Lead-Free Solder Pastes to
Reduce the Head-in-Pillow Component Soldering Defect," SMTA
International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 430-437.
Bath, Jasbir, Garcia, Roberto, Uchida, Noriyoshi, Takahashi, Hajime, Clark,
Gordon, and Itoh, Manabu,
"Investigation and development of tin-lead and lead-free solder pastes to
reduce head-in-pillow defects," Global SMT and Packaging,
vol. 9 no. 12, pp. 10-12,14-16, Dec. 2009.
Bath, Jasbir, Wilmot, Lee, McCullen, Jack, and Abrams, Fern,
"IPC/JEDEC J-STD-609A Marking and Labeling of Components, PCBs and PCBAs to
Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes,"
Proceedings 2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr.
6-9, 2010, pp. S22_02-1-S22_02-35.
Bath, Jasbir, and Wilmot, Lee,
"IPC Lead-Free Labeling Standard," IPC Printed Circuits Expo,
Anaheim, CA, Feb. 24-26, 2004, pp. xx-xx.
Bath, Jasbir, Wageman, Mike, Chu, Quyen, Ghalib, Nabel, Donaldson, Alan,
Matias, Jose, and Hernandez, Eddie,
"Lead-Free and Tin-Lead Rework Development Activities Within the NEMI
Lead-Free Assembly and Rework Project," 2004 SMTA International
Conference Proceedings, Chicago, IL, Sept. 26-30, 2004, pp. 184-197.
Bath, Jasbir, and Hueste, Gregory,
"Lead-free Sn3.5Ag and Sn0.7Cu Wave Solder Evaluation with VOC-free No-clean
and Water Soluble Fluxes," 2001 Advanced Packaging Technology Conference
Proceedings, 2001, pp. xx-xx.
Bath, Jasbir,
"NEMI Lead-free Rework Development Phase 3,", NEMI, Mar. 2004.
Bath. Jasbir,
"Practical Lessons for Pb-Free," Circuits Assembly, vol. 18
no. 10, pp. 18, Oct. 2007.
Bath, Jasbir, Sethuraman, Sundar, Zhou, Xiang, Willie, Dennis, Hyland, Kim,
Newman, Keith, Hu, Livia, Love, Dave, Reynolds, Heidi, Kochi, Ken, Chiang,
Diana, Chin, Vicki, Teng, Sue, Ahmed, Mudasir, Henshall, Greg, Schroeder,
Valeska, Nguyen, Quang, Maheswari, Abhay, Lee, M. J., Clech, Jean-Paul,
Cannis, Jeff, Lau, John, and Gibson, Chris,
"Reliability Evaluation of Lead-Free SnAgCu PBGA676 Components Using Tin-Lead
and Lead-Free SnAgCu Solder Paste," 2005 SMTA International Conference
Proceedings, Chicago, IL, Sept. 25-29, 2005, pp. 891-901.
Bath, Jasbir, Jay, Roger, Bennett, Lenora, Tan, Suan Kee, Chih, Pan Wei, and
Lucuta, Adrian,
"Repeatability Analysis of EDXRF Equipment for RoHS Compliance Screening for
Soldering Materials used in PCBA Manufacturing," 32nd IEEE/CPMT
International Electronic Manufacturing Technology Symposium, San Jose,
CA, Oct. 3-5, 2007, pp. 339-345.
Bath, Jasbir, Handwerker, Carol, and Bradley. Edwin,
"Research Update: Lead-Free Solder Alternatives," Circuits Assembly
, vol. 11 no. 5, pp. 30-38,40, May 2000.
Bath, Jasbir, and Chu, Quyen,
"STEP 10: Rework and Repair," Surface Mount Technology (SMT),
vol. 19 no. 11, pp. 40-42, Nov. 2005.
Bath, Jasbir, and Crombez, Emmanuelle,
"Surface Mount Assembly Evaluations with Lead-free Solder Pastes," 2000
Lead Free Symposium Conference Proceedings, 2000, pp. xx-xx.
Bath, Jasbir, Asai, Kentaro, Joshi, Shantanu, Harris, Jack, and Segura,
Roberto,
"Voiding Study on Soldered Chip and Power Transistor (BTC) Components with
Different Lead-Free Solder Pastes," SMTA International 2020,
virtual conference, Sept. 28-Oct. 23, 2020, pp. 219-225.
Bath, Jasmir,
"A Manufacturable Lead-Free Surface-Mount Process?," Circuits
Assembly, vol. 14 no. 1, pp. 26-30, Jan. 2003.
Batieha, F., Hamasha, S., Jaradat, Y., Wentlent, L., Qasaimeh, A., and
Borgesen, P.,
"Challenges for the Prediction of Solder Joint Life in Long Term Vibration,"
2015 IEEE 65th Electronic Components and Technology Conference,
San Diego, CA, May 26-29, 2015, pp. 1553-1559.
Batieha, F., Feyissa, F., Hamasha, S., Shirazi, S., Wentlent, L., Ogutu, P.,
Dimitrov, N., Fey, E., and Borgesen, P.,
"Intermetallics Issues and Challenges in 2.5/3D Assembly Microjoints,"
Proceedings of SMTA Pan Pacific Symposium, Kauai, HI, Feb. 2-5, 2015,
pp. xx-xx.
Batorfi, Reka, Szoke, Peter, Olah, Zoltan, Geczy, Attila, Ruszinko, Miklos,
and, ILlyefalvi-Vitez, Zsolt,
"Bumping Technologies of Fine-Pitch BGA Components," 2010 33rd
International Spring Seminar on Electronics Technology, Warsaw, Poland,
May 12-16, 2010, pp. 107-112.
Batorfi, Reka,
"Examination of Soldering Defect Formation at QFN Components," 2015 38th
International Spring Seminar on Electronics Technology, Eger, Hungary,
May 6-10, 2015, pp. 320-323.
Batorfi, Reka, Storcz, Richard, and Ruszinko, Miklos,
"Investigating Hole Filling in Pin-in-Paste Technology for Vapour Phase
Soldering," 2013 IEEE 19th International Symposium for Design and
Technology in Electronic Packaging, Galati, Romania, Oct. 24-27, 2013,
pp. 59-64.
Batorfi, Reka, Illes, Balazs, and Krammer, Oliver,
"Whisker Formation from SnAgCu Alloys and Tin Platings - Review on the Latest
Results," 2015 IEEE 21st International Symposium for Design and
Technology in Electronic Packaging, Brasov, Romania, Oct. 22-25, 2015,
pp. 373-376.
Battaion, Michael,
"Environmental Overview - REACH," It's Not Easy Being Green, San
Jose, CA, Feb. 4-5, 2009, pp. xx-xx.
Battermann, Achim, Gunther, B., and Schafer, H.,
"UV-Curable Conductive Adhesives for 3-D MID Application," First
International IEEE Conference on Polymers and Adhesives in Microelectronics
and Photonics, Potsdam, Germany, Oct. 21-24, 2001, pp. 181-184
Baudrand, Don,
"Conversion Coatings for Aluminum and Magnesium," Plating and Surface
Finishing, vol. 92 no. 1, pp. 30-34, 44, Jan. 2005.
Baudrand, Don,
"Electroless Palladium, Past and Future," Proceedings of AESF SUR/FIN
'99, Cincinnati, OH, June 21-24, 1999, pp. 49-51.
Baudrand, Don,
"Electroless Plating Processes Developing Technologies for Electroless Nickel,
Palladium and Gold," Proceedings of the AESF SUR/FIN 2000,
Chicago, IL, June 26-29, 2000, pp. xx-xx.
Baudrand, Don,
"Electroplating/Electroless Plating for Electronic Applications,"
Products Finishing, vol. xx no. xx, pp. xx-xx, June 9, 2003.
Baudrand, Donald W.,
"Failure of Electroplated deposits, Detection and Prevention,"
Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp.
577-587.
Bauer, Brian D., and O'Neill, Michael P.,
"Are You Ready for Lead-free Solder Paste?," Surface Mount
Technology (SMT), vol. 14 no. 4, pp. 69-70, Apr. 2000.
Bauer, Brian D., and O'Neill, Michael P.,
"Are You Ready for Lead-free Solder Paste?," Surface Mount Technology
(Special Supplement, SMT), vol. 14 no. 6, pp. 11-12, June 2000.
Bauer, Brian,
"Making the Move to Lead-free Requires Teamwork," Surface Mount
Technology (SMT), vol. 18 no. 11, pp. xx-xx, Nov. 23, 2004.
Bauer, Brian, and Lathrop, Rick,
"Solder Materials," Surface Mount Technology (SMT), vol. 12 no.
3, pp. 90, 92, 94-95, Mar.
1998.
Bauer, J., Gottschalch, V., Paetzelt, H., Wagner, G., Fuhrmann, B., and
Leipner, H. S.,
"MOVPE growth and real structure of vertical-aligned GaAs nanowires,"
Journal of Crystal Growth, vol. 298, pp. 625-630, Jan. 2007.
Bauer, J., Gottschalch, V., Paetzelt, H., and Wagner, G.,
"VLS growth of GaAs/(InGa)As/GaAs axial double-heterostructure nanowires by
MOVPE," Journal of Crystal Growth, vol. 310 no. 23, pp.
5106-5110, Nov. 15. 2008.
Bauer, Laura Ann, Reich, Daniel H., and Meyer, Gerald J.,
"Selective Functionalization of Two-Component Magnetic Nanowires,"
Langmuir, vol. 19 no. x, pp. 7043-7048, 2003.
Bauer, R., Ebersberger, B., Kupfer, C., and Alexa, L.,
"Reliability Investigations on SnAg Bumps on Substrate Pads with Different Pad
Finish," AIP Conference Proceedings, vol. 817, pp. 360-365, 2006.
Baumann, Marji,
"Deciphering Pb-free labeling on integrated circuits," Electronic
Products, vol. 48 no. 6, pp. 83, Nov. 2005.
Baumann, Marji, and Celaya, Phill,
"Using lead-free devices in a standard process with lead solder,"
Green SupplyLine, Apr. 14, 2006.
Baumgartner, Tobias, Manessis, Dionysios, Topper, Michael, Hauck, Karin,
Ostmann, Andreas, Reichl, Herbert, Jorge, Pedro Goncalo C. T., and Yamada,
Hidehiro,
"Printing Solder Paste in Dry Film - A Low Cost Fine-Pitch Bumping Technique,"
9th Electronics Packaging Technology Conference, Singapore, Dec.
10-12, 2007, pp. 609-612.
Bautin, V. A., Kostitsyna, E. V., Popova, A. V., Gudoshnikov, S. A., Ignatov,
A. S., and Usov, N. A.,
"Glass shell etching to control residual quenching stress in Co-rich amorphous
ferromagnetic microwires," Journal of Alloys and Compounds, vol.
731, pp. 18-23, Jan. 15, 2018.
Bayati, M. R., Shariat, M. H., and Janghorban, K.,
"Design of chemical composition and optimum working conditions for trivalent
black chromium electroplating bath used for solar thermal collectors,"
Renewable Energy, vol. 30 no. 14, pp. 2163-2178, Nov. 2005.
Bayersdorfer, Maik, Kemethmueller, Martin, Steuff, Wolfgang, and Scharf,
Michael,
"Leoni Histral - The cadmium-free alternative for cable manufacturers,"
Wire Journal International, vol. 41 no. 6, pp. 67-71, June 2008.
Bayes, Martin, and Horn, Al,
"Effects of Conductor Surface Condition on High Frequency Loss,"
Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004
Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S18-3-1-S18-3-11.
Bayes, Martin, and Horn, Al,
"Effects of conductor surface condition on signal integrity," Circuit
World, vol. 30 no. 3, pp. xx, 2004.
Bayes, Martin,
"Materials Matters: Solder Joint Reliability," PCB007,
June 27, 2008.
Baylakoglu, Ilknur, Hamarat, Seref, Gokmen, Haluk, and Meric, Esra,
"Case Study for High Volume Lead-Free Wave Soldering Process with
Environmental Benefits," Proceedings of the 2005 IEEE International
Symposium on Electronics and the Environment, New Orleans, LA, May
16-19, 2005, pp. 102-106.
Baylakoglu, Ilknur,
"Reliability Concerns of Lead-free Solder Use in Aerospace Applications,"
3rd International Conference on Recent Advances in Space Technologies
, Istanbul, Turkey, June 14-16, 2007, pp. 158-164.
Baynham, Grant, Baldwin, Daniel F., Boustedt, Katarina, Johansson, Anette,
Wennerholm, Claes, Patterson, Deborah, and Elenius, Peter,
"Flip Chip Processing of Lead-Free Solders and Halogen-Free High Density
Microvia Substrates," 2000 Proceedings 50th Electronic Components &
Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 1101-1105.
Baynham, Grant, Baldwin, Daniel F., Boustedt, Katarina, and Wennerholm, Claes,
"Flip Chip with Lead-Free Solders on Halogen-Free Microvia Substrates,"
2001 Proceedings 51st Electronic Components & Technology Conference
, Orlando, FL, May 29-June 1, 2001, pp. 1135-1139.
Baynham, Grant, Baldwin, Daniel F., Boustedt, Katarina, Kandelid, Stefan,
Mattsson, Fredrik, Wennerholm, Claes, Johansson, Anette, Patterson, Deborah,
Elenius, Peter, and Balkan, Haluk,
"Lead-free Flip Chip Processing with Halogen-free High Density Microvia
Substrates," Twenty-Sixth IEEE/CPMT International Electronics
Manufacturing Technology Symposium, Santa Clara, CA, Oct. 2-3, 2000,
pp. 263-269.
Bazilchuk, Molly, Kristiansen, Helge, and He, Jianying,
"Influence of metallization and size on the conductive properties of
metal-coated polymer particles in anisotropic conductive adhesive," 2018
IEEE 68th Electronic Components and Technology Conference, San Diego,
CA, May 29-June 1, 2018, pp. 1920-1925.
Bazu, Marius, Ilian, Virgil Emil, Galateanu, Lucian, Varsescu, Dragos, and
Pietrikova, Alena,
"Reliability Testing of Lead-Free Solder Joints," 2012 35th
International Spring Seminar on Electronics Technology, Bad Aussee,
Austria, May 9-13, 2012, pp. 173-177.
Bchir, Omar, and Stage, Roger,
"Intel Halogen Free Component Key Properties and Reliability Test Results,"
Intel Halogen Free Symposium, Scottsdale, AZ, Jan. 15-16, 2008,
pp. xx-xx.
Beair, William, and Vuono, William,
"Lead Free to SnPb BGA Reballing Process and Reliability," 2008 SMTA
International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008,
pp. 379-383.
Beard, Adrian, Klimes, Michael, and Wietschorke, Ulrich,
"Non-halogenated phosphorus, inorganic and nitrogen flame retardants for
electronics: update on market situation, drivers and trends,"
Electronics Goes Green 2012+, Berlin, Germany, Sept. 9-12, 2012, pp.
xx-xx.
Beattie, S. D., Hatchard, T., Bonakdarpour, A., Hewitt, K. C., and Dahn, J.
R.,
"Anomalous, High-Voltage Irreversible Capacity in Tin Electrodes for Lithium
Batteries," Journal of the Electrochemical Society, vol. 150 no.
6. pp. A701-A705, 2003.
Beaumont, Mitch, and Okamoto, Kiyoshi,
"EuP Directive impacts design activities," Green SupplyLine,
Dec. 8, 2006.
Beauvillier, Luc,
"The Quest for the Ultimate Surface Finish," Printed Circuit
Design, vol. 19 no. 6, pp. 27-31, June 2002.
Beazant, Gareth,
"Electro-scrap mountains still growing," Professional Engineering
, vol. 19 no. 1, pp. 38-39, Jan. 11, 2006.
Becht, Joachim, Tosun, Umut, Wack, Harald, Schweigart, Helmut, Ellis, Dirk,
and Afshari, Sia,
"Eutectic & Lead-free Defluxing in One Process," Surface Mount
Technology (SMT), vol. 21 no. 5, pp. 39-41, May 2007.
Beck, Albrecht,
"Overcoming the challenges of lead-free wave soldering," Global SMT
and Packaging, vol. 12 no. 8, pp. 8-11, Aug. 2012.
Beck, Erin,
"Performance Validation of Thin-Film Sulfuric Acid Anodization (TFSAA) on
Aluminum Alloys," Proceedings 2003 AESF/EPA Conference for Environmental
& Process Excellence, Daytona, FL, Feb. 3-7, 2003, pp. 339-356.
Becker, J. H.,
"On the Linear Rate of Transformation of White to Gray Tin," Bulletin of
the American Physical Society, Series II, vol. 1 no. 1, pp. 45, Jan.
30, 1956.
Becker, J. H.,
"On the Quality of Gray Tin Crystals and Their Rate of Growth," Journal
of Applied Physics, vol. 29 no. 7, pp. 1110-1121, July 1958.
Becker, J. H.,
"Studies of Crystal Growth, and Electrical and Optical Properties of Gray
Tin," Physical Review, Second Series, vol. 98 no. 4, pp. 1192,
May 15, 1955.
Beckett, Duncan, and Terrell, Greg,
"Notes From the Field," Products Finishing, vol. 73 no. 7, pp.
19-22, Apr. 2009.
Beckett, Duncan, Szczypka, John, Morcos, Boules, and Terrell, Greg,
"Troubleshooting RoHS-compliant Electroless Nickel," Metal Finishing
, vol. 107 no. 6, pp. 33-38, June 2009.
Bedner, David, and He, Michael,
"Halogen-free materials with improved thermal and electrical properties,"
Circuit World, vol. 35 no. 3, pp. 3-7, 2009.
Bedner, David,
"New Halogen-Free Materials Their Time Has Finally Arrived,"
CircuiTree, vol. 21 no. 9, pp. xx-xx, Sept. 2008.
Beelen-Hendrikx, C. C. M., Klerk, J., and van der Water, J. T.,
"Lead-free Semiconductor Packaging," Proceedings of 4th Electronics
Packaging Technology Conference, Singapore, Dec. 10-12, 2002, pp.
11-19.
Beelen-Hendrikx, Caroline, and Verguld, Martin,
"Trends in Electronic Packaging and Assembly for Portable Consumer Products,"
Proceedings of 3rd Electronics Packaging Technology Conference,
Singapore, Dec. 5-7, 2000, pp. 24-32.
Beer, Detlef,
"Lead-free: AOI in High-volume Production Assemblies," Surface Mount
Technology (SMT), vol. 20 no. 1, pp. xx-xx, Jan. 2006.
Begin, Mathieu,
"RFID Helps Achieve Lead-free Compliance," Surface Mount Technology
(SMT), vol. 19 no. 11, pp. 48, Nov. 2005.
Beh, Key Shin, Leong, Jenn Seong, Loh, Wei Keat, and Tan, Wool Aun,
"Solder Joint Reliability Challenges in Sub 1.00mm Ball Pitch for Flip Chip
Ball Grid Array," Proceedings of the ASME/Pacific Rim Technical
Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and
Electronic Systems: Advances in Electronic Packaging 2005, Part B, San
Francisco, CA, July 17-22, 2005, pp. 1449-1454.
Beheshti, Mohammadsadegh, Choi, Junseo, Geng, Xiaohua, Podlaha-Murphy,
Elizabeth, and Park, Sunggook,
"Patterned electromagnetic alignment of magnetic nanowires,"
Microelectronic Engineering, vol. 193, pp. 71-78, June 5, 2018.
Behner, U., Haug, R., Schutz, R., and Hartnagel, H. L.,
"Characterization of Anisotropically Conductive Adhesive Interconnections by
1/f Noise Measurements," The First IEEE International Symposium on
Polymeric Electronics Packaging, Oct. 26-30, 1997, pp. 243-248.
Behner, U., Czaya, C.-P., Haug, R., Hauschild, F.-D., Jiang, H., Kaloudis, M.,
Kotthaus, S., Kuschel, S., Schuetz, R., Schultze, F., Treutler, C. P. O., and
Vogel, W.,
"Low-Cost Direct Chip Attach: Comparison of SMD Compatible FC Soldering with
Anisotropically Conductive Adhesive FC Bonding," 1998 IEMT/IMC
Proceedings, Tokyo, Japan, Apr. 15-17, 1998, pp. 358-363.
Behner, U., Czaya, C.-P., Haug, R., Hauschild, F.-D., Jiang, H., Kaloudis, M.,
Kotthaus, S., Kuschel, S., Schuetz, R., Schultze, F., Treutler, C. P. O., and
Vogel, W.,
"Low-Cost Direct Chip Attach: Comparison of SMD Compatible FC Soldering with
Anisotropically Conductive Adhesive FC bonding," Twenty Second IEEE/CPMT
International Electronics Manufacturing Technology Symposium, Berlin,
Germany, Apr. 27-29, 1998, pp. 49-54.
Behner, Ulrich, Haug, Ralf, Schutz, Reiner, and Hartnagel, Hans L.,
"Characterization of Anisotropically Conductive Adhesive Interconnections by
1/f Noise Measurements," IEEE Transactions on Components, Packaging, and
Manufacturing Technology, Part A, vol. 21 no. 2, pp. 243-247, June 1998.
Behura, Sanjay K., Yang, Qiaoqin, Hirose, Akira, Jani, Omkar, and
Mukhopadhyay, Indrajit,
"Catalyst-free synthesis of silicon nanowires by oxidation and reduction
process," Journal of Materials Science, vol. 49 no. 10, pp.
3592-3597, May 2014.
Beica, Rozalia, Wang, Kai, and Brown, Neil,
"Tin-Silver Electroplating of Pb-free Wafer Bumps," Proceedings 2003
International Symposium on Microelectronics (Proceedings of SPIE - The
International Society for Optical Engineering, Volume 5288), Boston,
MA, Nov. 18-20, 2003, pp. 835-840.
Beigle, Steve,
"Alternate Metal Finishes for Wire Bond and Soldering Applications," Alpha
Metals.
Beigle, Steve,
"Alternate Metal Finishes for Wire Bond and Soldering Applications,"
IPC Printed Circuits Expo, San Jose, CA, Mar. 3-7, 1996, pp.
S9-2-1-S9-2-6.
Beigle, Steve,
"Non-Precious Metal Coatings for Fine Pitch Assembly and Direct Chip
Attachment," Surface Mount International Proceedings of the Technical
Program, Volume II, San Jose, CA, Sept. 10-12, 1996, pp. 780-785.
Beilis, Isak I., Koulik, Yosef, Boxman, Raymond L., and Arbilly, David,
"Thin film deposition using a plasma source with a hot refractory anode vacuum
arc," Journal of Materials Science, vol. 45 no. 23, pp.
6325-6331, Dec. 2010.
Belashov, O., and Spelt, J. K.,
"Thermal stress concentration factors for defects in plated-through-vias,"
Microelectronics Reliability, vol. 48 no. 2, pp. 225-244, Feb.
2008.
Belavic, Darko, Rocak, Dubravka, Plut, Janeta Fajfar, Hrovat, Marko, Pavlic,
Janez, Drozd, Zdzizlaw, Macek, Srecko, Mcgill, Ian, and Bukat, Krystyna,
"An Introduction of RoHS Legislation in SMD Thick-Film Hybrid Technology - a
Case Study," 1st Electronics Systemintegration Technology Conference,
Volume 2, Dresden, Germany, Sept. 5-7, 2006, pp. 690-695.
Belhadi, Mohamed El Amine, Akkara, Francy, Jian, Minghong, and Hamasha, Sa'd,
"Effect of New SAC-Bi Solder Pastes on Thermal Cycling Reliability Considering
Aging," SMTA International 2020, virtual conference, Sept.
28-Oct. 23, 2020, pp. 333-338.
Belhadi, Mohamed El Amine, Wentlent, Luke, Athamneh, Raed Al, and Hamasha,
Sa'd,
"Mechanical Properties of SAC-Bi Solder Alloys with Aging," Proceedings
of SMTA International, Rosemont, IL, Sept. 22-26, 2019, pp. 431-438.
Belhadi, Mohamed El Amine, Akkara, Francy John, Athamenh, Raed, Abueed,
Mohammed, Hamasha, Sa'd, Ali, Haneen, Suhling, Jeff, and Lall, Pradeep,
"The Effect of Bi on the Mechanical Properties of Aged SAC Solder Joint,"
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical
Phenomena in Electronic Systems, Orlando, FL, May 26-29, 2020, pp.
1100-1105.
Belhenini, Soufyane, Bouchou, Abdelhake, Dosseul, Franck, and Tougui,
Abdellah,
"3-D finite elements simulation of drop test reliability on a Chip Scale
Package: focus on the component architecture and materials," 2012 13th
International Conference on Thermal, Mechanical and Multi-Physics Simulation
and Experiments in Microelectronics and Microsystems, Lisbon, Portugal,
Apr. 16-18, 2012, pp. xx-xx.
Belhenini, Soufyane, Tougui, Abdellah, Bouchou, Abdelhake, Mohan, Ranganathan,
and Dosseul, Franck,
"3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder
Reflow Residual Stress and Molding Resin Parameters," Journal of
Electronic Materials, vol. 43 no. 3, pp. 708-716, Mar. 2014.
Bell, H., Heinze, R., Wohlrabe, H., Pfulb, J., Yamada, H., and Oswald, F.,
"Lead-Free Reflow Soldering," Circuitnet, Mar. 2009.
Bell, Hans,
"A Comparison of Convection and Condensation Pb-Free Reflow Soldering,"
Circuits Assembly, vol. 17 no. 5, pp. 50, May 2006.
Bell, Hans, Kolossa, Thomas, and Fischer, Peter,
"Surface Tension and Load-Carrying Capacities of Solder," Surface Mount
Technology (SMT), vol. 28 no. 5, pp. 18,20-22,24-26,28-29, May 2013.
Bell, Hans,
"Vacuum Soldering and Void-Free, Lead Free Solder Joints," IPC Printed
Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10,
2006, pp. S13-01-1-S13-01-5.
Bell, M. I.,
"Valence force potential calculations of the lattice dynamics of diamond-type
crystals," Journal of Chemical Physics, vol. 62 no. 8, pp.
3357-3358, Apr. 15, 1975.
Bell. Richard,
"Lead-Free: Will Alternative Alloys Really Work?," Circuits Assembly
, vol. 11 no. 9, pp. 120, Sept. 2000.
Bellemare, Rich,
"RoHS and ELV Compliant Electroless Nickel," Products Finishing
, vol. xx no. xx, pp. xx-xx, Oct. 2005.
Bellet-Amalric, E., Elouneg-Jamroz, M., Rueda-Fonseca, P., Bounouar, S., Den
Hertog, M., Bougerol, C., Andre, R., Genuist, Y., Poizat, J. P., Kheng, K.,
Cibert, J., and Tatarenko, S.,
"Growth of II-VI ZnSe/CdSe nanowires for quantum dot luminescence,"
Journal of Crystal Growth, vol. 378, pp. 233-237, Sept. 1, 2013.
Belmonte, Joe,
"Doing the Poka-Yoke," Circuits Assembly, vol. 17 no. 12, pp.
22, Dec. 2006.
Belmonte, Joe,
"Lead Free Reflow & Wave Soldering Process Considerations," SMART
Group "All You Ever Wanted to Know About Lead-Free" Seminar, High
Wycombe, United Kingdom, Nov. 1, 2005.
Belmonte, Joe,
"Pb-Free and SnPb Solder Printing, Compared," Circuits Assembly
, vol. 16 no. 8, pp. 20, Aug. 2005.
Belmonte, Joe, and Apell, Marc,
"Practical Pb Free Assembly," IPC APEX/EXPO 2005, Anaheim,
CA, Feb. 22-24, 2005, (445 pages long).
Belmonte, Joe, Shah, Vatsal, Mohanty, Rita, Jensen, Tim, Lasky, Ron, and
Bishop, Jeff,
"Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing,"
2006 SMTA International Conference Proceedings, Rosemont, IL,
Sept. 24-28, 2006, pp. xx-xx.
Belmonte, Joe, Shah, Vatsal, Mohanty, Rita, Jensen, Tim, Lasky, Ron, and
Bishop, Jeff,
"Process Development for 01005 Lead Free Passive Assembly: Stencil Printing,"
IPC Review, vol. 48 no. 2, pp. 8, Feb. 2007.
Belmonte, Joe,
"Six Steps to Lead Free Process Implementation," IPC APEX/EXPO 2005
, Anaheim, CA, Feb. 22-24, 2005, pp. xx-xx.
Belmonte, Joe,
"Six Steps to Lead Free Process Implementation," Successful
Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007,
pp. xx-xx.
Belmonte, Joe,
"STEP 2: Process Control," Surface Mount Technology (SMT),
vol. 19 no. 2, pp. xx-xx, Feb. 2005.
Belmonte, Joe,
"Trends in the Stencil Printing Process," Surface Mount Technology
, vol. 19 no. 11, pp. xx-xx, Nov. 2005.
Belouet, C., Villard, C., Fages, C., and Keller, D.,
"Achievement of Homogeneous AuSn Solder by Pulsed Laser-Assisted Deposition,"
Journal of Electronic Materials, vol. 28 no. 10, pp. 1123-1126,
Oct. 1999.
Belov, Ilja, Arwidson, Jonas, Poder, Ralf, Johannesson, Par, and Leisner,
Peter,
"The Effect of Variations in Temperature Cycling Profile and Mechanical
Properties of Solder on Thermo-mechanical Reliability of a Lead-free BGA
Package," 2015 16th International Conference on Thermal, Mechanical and
Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
, Budapest, Hungary, Apr. 19-22, 2015, pp. xx-xx.
Belyakov, S., Atkinson, H. V., and Gill, S. P. A.,
"Crystallographically Faceted Void Formation in the Matrix of Lead-Free Solder
Joints," Journal of Electronic Materials, vol. 39 no. 8, pp.
1295-1297, Aug. 2010.
Belyakov, S. A., and Gourlay, C. M.,
"Heterogeneous nucleation of bSn on NiSn4, PdSn4 and PtSn4," Acta
Materialia, vol. 71, pp. 56-68, June 2014.
Belyakov, S. A., Nishimura, T., Sweatman, K., Nogita, K., and Gourlay, C. M.,
"Influence of Bi additions on the distinct bSn grain structure of
Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%)," 2016 International Conference on
Electronics Packaging, Hokkaido, Japan, Apr. 20-22, 2016, pp. 222-225.
Belyakov, S. A., Xian, J. W., Sweatman, K., Nishimura, T., Akaiwa, T., and
Gourlay, C. M.,
"Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints,"
Journal of Alloys and Compounds, vol. 701, pp. 321-334, Apr. 15,
2017.
Belyakov, S. A., and Gourlay, C. M.,
"Metastable eutectic in Pb-free joints between Sn-3.5Ag and Ni-based
substrates," Materials Letters, vol. 148, pp. 91-95, June 1,
2015.
Belyakov, S. A., Gourlay, C. M., Coyle, R., Johnson, C., and Arfaei, B.,
"Microstructure Evolution During Thermal Fatigue of a SAC Solder Containing
5.5%Sb," SMTA International 2020, virtual conference, Sept.
28-Oct. 23, 2020, pp. 432-441.
Belyakov, S. A., and Gourlay, C. M.,
"NiSn4 formation during the solidification of Sn-Ni alloys,"
Intermetallics, vol. 25, pp. 48-59, June 2012.
Belyakov, S. A., and Gourlay, C. M.,
"NiSn4 Formation in As-Soldered Ni-Sn and ENIG-Sn Couples," Journal of
Electronic Materials, vol. 41 no. 12, pp. 3331-3341, Dec. 2012.
Belyakov, S. A., and Gourlay, C. M.,
"NiSn4 in Solder Joints Between Sn-3.5Ag and Ni, ENIG or ENEPIG," 2015
IEEE 65th Electronic Components and Technology Conference, San Diego,
CA, May 26-29, 2015, pp. 1273-1279.
Belyakov, S. A., Nishimura, T., Akaiwa, T., Sweatman, K., Nogita, K., and
Gourlay, C. M.,
"Optimization of Ni and Bi levels in Sn-0.7Cu-xNi-yBi solders for improved
interconnection reliability," 2018 International Conference on
Electronics Packaging and iMAPS All Asia Conference, Nagasaki, Japan,
Apr. 17-21, 2018, pp. 211-215.
Belyakov, S. A., Arfaei, B., Johnson, C., Howell, K., Coyle, R., and Gourlay,
C. M.,
"Phase Formation and Solid Solubility in High Reliability Pb-Free Solders
Containing Bi, Sb or In," Proceedings of SMTA International,
Rosemont, IL, Sept. 22-26, 2019, pp. 492-506.
Belyakov, S. A., Xian, J., Zeng, G., Sweatman, K., Nishimura, T., Akaiwa, T.,
and Gourlay, C. M.,
"Precipitation and coarsening of bismuth plates in Sn-Ag-Cu-Bi and Sn-Cu-Ni-Bi
solder joints," Journal of Materials Science: Materials in Electronics
, vol. 30 no. 1, pp. 378-390, Jan. 2019.
Belyakov, S. A., Sweatman, K., Akaiwa, T., Nishimura, T., and Gourlay, C. M.,
"Precipitation of Bi and SbSn Phases in Next-Generation Pb-Free Solders,"
Proceedings of SMTA International, Rosemont, IL, Sept. 22-26,
2019, pp. 484-491.
Belyakov, S. A., and Gourlay, C. M.,
"Recommended values for the bSn solidus line in Sn-Bi alloys,"
Thermochimica Acta, vol. 654, pp. 65-69, Aug. 10, 2017.
Belyakov, S. A., Nishimura, T., Akaiwa, T., Sweatman, K., and Gourlay, C. M.,
"Role of Bi in microstructure formation of Sn-Cu-Ni based BGAs on Cu
metallizations," 2017 International Conference on Electronics Packaging
, Yamagata, Japan, Apr. 19-22, 2017, pp. 232-236.
Belyakov, S. A., Nishimura, T., Akaiwa, T., Sweatman, K., Nogita, K., and
Gourlay, C. M.,
"Role of Bi, Sb and In in microstructure formation and properties of
Sn-0.7Cu-0.05Ni-X BGA interconnections," 2019 International Conference
on Electronics Packaging, Niigata, Japan, Apr. 17-20, 2019, pp.
235-239.
Belyakov, S. A., and Gourlay, C. M.,
"Role of Fe impurities in the nucleation of metastable NiSn4,"
Intermetallics, vol. 37, pp. 32-41, June 2013.
Belyakov, S. A., and Gourlay, C. M.,
"The Influence of Cu on Metastable NiSn4 in Sn-3.5Ag-xCu/ENIG Joints,"
Journal of Electronic Materials, vol. 45 no. 1, pp. 12-20, Jan. 2016.
Belyakov, Sergey A.,
"Nitrogen in Reflow Soldering of Lead-Free Solders," 8th Siberian
Russian Workshop and Tutorial on Electron Devices and Materials,
Novosibirsk, Russia, July 1-5, 2007, pp. 84-85.
Belyakov, Sergey A.,
"Ultrasonic Modification of Sn-Ag-Cu Alloy Microstructure," 9th
International Workshop and Tutorials on Electron Devices and Materials,
Novosibirsk, Russia, July 1-5, 2008, pp. 58-59.
Benaben, P.,
"SURMAT 06: New challenges in surface treatment," Transactions of the
Institute of Metal Finishing, vol. 85 no. 2, pp. 66-67, Mar. 2007.
Benaben, Patrick,
"Some Aspects of Recent Development on Functional Trivalent Chromium Plating,"
Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002,
pp. 373-381.
Benaben, Patrick,
"Thick, Hard Electrodeposits From a Trivalent Chromium Bath," Plating
& Surface Finishing, vol. 76 no. 11, pp. 60-63, Nov. 1989.
Benabou, L., Sun, Z., and Dahoo, P. R.,
"A thermo-mechanical cohesive zone model for solder joint lifetime
prediction," International Journal of Fatigue, vol. 49, pp.
18-30, Apr. 2013.
https://doi.org/10.1016/j.ijfatigue.2012.12.008
Bender, Dave,
"Halogen Free - Impact on Connectors," Intel Halogen Free Symposium
, Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.
Benedetto, Elizabeth Elias, Allen, Aileen, Troxel, Kris, and Miremadi, Jian,
"Acceptance Testing of Pb-free Bar Solder Alloys," SMTA International
2013 Conference Proceedings, Fort Worth, TX, Oct. 13-17, 2013, pp.
583-589.
Benedetto, Elizabeth Elias,
"Evaluation of Palladium Lead Plating," Surface Mount Technology (SMT)
, vol. 13 no. 2, pp. 90, 92, 94, 96, Feb. 1999.
Benedetto, Elizabeth Elias,
"Lead Free Solder on Compaq's Aero Handheld Computer," 2001 Advanced
Packaging Technology Conference Proceedings, 2001, pp. xx-xx.
Benedetto, Elizabeth Elias,
"Solderability and Board Level Reliability of Palladium Plated, Fine Pitch
Components," 1998 Surface Mount International Conference Proceedings
, San Jose, CA, Aug. 23-27, 1998, pp. 624-632.
Benes, M., Placek, V., Matuschek, G., Kettrup, A. A., Gyoryova, K., Emmerich,
W. D., and Balek, V.,
"Lifetime Simulation and Thermal Characterization of PVC Cable Insulation
Materials," Journal of Thermal Analysis and Calorimetry, vol. xx
no. x, pp. xx-xx, xxxx.
Bengston, Jon, and DePotov, Richard,
"Comparing Soldering Results of ENIG and EPIG Post-steam Exposure,"
Surface Mount Technology (SMT), vol. 34 no. 9, pp. 88,90-94,96, Sept.
2019.
Benka, Stephen G.,
"How tin whiskers grow," Physics Today, vol. 62 no. 7, pp. 23,
July 1, 2009.
https://doi-org.ezproxy.uky.edu/10.1063/1.4797168
BenKinney, Marie, Arora, Ashish, and Swart, Jan,
"The Influence of Regulatory Changes on Unique Product Designs," IEEE
Symposium on Product Compliance Engineering, Longmont, CO, Oct. 22-23,
2007, pp. xx-xx.
Bennetts, Ben,
"Lead-free solder may shift test methods toward boundary scan,"
Connect, vol. xx no. xx, pp. xx-xx, May 2004.
Benson, Duane,
"Black Pad - And Then Some," SMT Web Exclusive Article.
Benson, Duane,
"Commentary: Comply with RoHS in four easy steps," Electronic
Business, July 11, 2006.
Benson, Duane,
"RoHS in Four Steps," SMT Web Exclusive Article.
Benson, Duane,
"Should You Mask 0.4 mm BGA Pads?," Printed Circuit Design and Fab/
Circuits Assembly, vol 28 no. 2, pp. 19, Feb. 2011.
Benson, Edward J.,
"Using Silicone Materials in Lead-Free CSP Processing," Chip Scale
Review, vol. xx no. xx, pp. xx-xx, May-June 2001.
Benson, R. C., Phillips, T. E., and deHaas, N.,
"Volatile Species from Conductive Die Attach Adhesives," 1989
Proceedings 39th Electronic Components Conference, Houson, TX, May
22-24, 1989, pp. 301-308.
Benson, Richard C., Romenesko, Bruce M., Nall, Berry H., DeHaas, Newman, and
Charles Jr., Harry K.,
"Current-Leakage Failures in Hybrid Microcircuits," IEEE Transactions on
Components, Hybrids, and Manufacturing Technology, vol. 9 no. 4, pp.
403-409, Dec. 1986.
Benson, Richard C., Phillips, Terry E., and DeHaas, Newman,
"Volatile Species from Conductive Die Attach Adhesives," IEEE
Transactions on Components, Hybrids, and Manufacturing Technology, vol.
12 no. 4, pp. 571-577, Dec. 1989.
Bent, Westin R., and Turbini, Laura J.,
"Identifying the Chemicals Responsible for Conductive Anodic Filament (CAF)
Enhancement," 1999 SMTA International Conference Proceedings, San
Jose, CA, Sept. 12-16, 1999, pp. xx-xx.
Bentzen, Brian Sloth, Ebdrup, Lars, and Juul, Poul,
"Pb-free Production Case," Mar. 30, 2004.
Bentzen, Brian Sloth,
"Lead-free Requires Process Changes," Surface Mount
Technology (SMT), vol. 17 no. 12, pp. xx-xx, Dec. 2003.
Bentzen, Brian Sloth,
"The Green Production Task," Circuits Assembly, vol. 15 no.
2, pp. xx-xx, Feb. 2004.
Beranek, M. W., Rassaian, M., Tang, C.-H., St. John, C. L., and Loebs, V. A.,
"Characterization of 63Sn37Pb and 80Au2OSn Solder Sealed Optical Fiber
Feedthroughs Subjected to Repetitive Thermal Cycling," IEEE Transactions
on Advanced Packaging, vol. 24 no. 4, pp. 576-585, Nov. 2001.
Bereznycky, Paul,
"Ask the EMPF Helpline!," empfasis, pp. 2,7, June 2009.
Bergauer, A., Bangert, H., Eisenmenger-Sittner, Ch., and Barna, P. B.,
"Whisker growth on sputtered AlSn (20 wt.% Sn) films," Thin Solid Films
, vol. 258 no. 1-2, pp. 115-122, Mar. 15, 1995.
Bergendahl, Carl Gunnar,
"Electronics Goes Halogen-Free: International Driving Forces and the
Availability and Potential of Halogen-Free Alternatives," Proceedings of
the 2000 IEEE International Symposium on Electronics and the Environment
, San Francisco, CA, May 8-10, 2000, pp. 54-58.
Bergendahl, Carl Gunnar, Lichtenvort, Kerstin, Johansson, Glenn, Zackrisson,
Mats, and Nyyssonen, Jonna,
"Environmental and economic implications of a shift to halogen-free printed
wiring boards," Circuit World, vol. 31 no. 3, pp. 26-31, 2005.
Berger, Ivan,
"E-Cycling Made Easier," The Institute, vol. 30 no. 3, pp. 1, 19,
Sept. 2006.
Berger, Robert, Bexell, Ulf, Grehk, T. Mikael, and Hornstrom, Sven-Erik,
"A comparative study of the corrosion protective properties of chromium and
chromium free passivation methods," Surface and Coatings Technology
, vol. 202 no. 2, pp. 391-397, Nov. 25, 2007.
Berger, Thomas,
"PCB production & test: tips from pros on lead-free processes Part 1 - Issues
in hot air solder levelling (HASL)," Global SMT and Packaging
, vol. 8 no. 7, pp. 18,20-21, July 2008.
Bergeson, Lynn,
"Don't let REACH become a stretch," Chemical Processing, vol.
xx no. x, pp. xx-xx, May 2004.
Bergeson, Lynn L.,
"EU's New Chemical Policy Will Hurt U.S. Competitiveness," Chemical
Processing, vol. xx no. x, pp. xx-xx, Aug. 2003.
Bergeson, Lynn L.,
"It's Here ... and It Ain't Pretty," Chemical Processing,
vol. xx no. x, pp. xx-xx, July 2003.
Bergeson, Lynn L.,
"RoHS, WEEE and Related EU Directives," Pollution Engineering,
vol. 38 no. 9, pp. 15, Sept. 2006.
Bergeson, Lynn,
"The impact of the European Union's directives on the U.S.,"
Chemical Processing, vol. 69 no. 8, pp. xx-xx, Aug. 2006.
Bergfeldt, Britta, Fisher, Michael M., Lehner, Theo, Mark, Frank E.,
Gruettner, Werner, Dresch, Hans, Dima, Bogdan, Kramer, Kai, and Vehlow,
Juergen,
"Large Scale Co-combustion Demonstration of Electrical and Electronic Shredder
Residue at the Wuerzburg Municipal Solid Waste Incinerator (MHKW),"
Proceedings of the 2006 IEEE International Symposium on Electronics and the
Environment, San Francisco, CA, May 8-11, 2006, pp. 302-308.
Bergin, Chris,
"NASA rebuttal of Tin Whisker dissent," NASA, June 8, 2006.
Bergman, David,
"A Research Program on SAC Lead Free Alloys," IPC/JEDEC 7th
International Conference on Lead Free Electronic Components and Assemblies
, Frankfurt, Germany, Oct. 20-22, 2004.
Bergman, David,
"IPC Technical Review -- David Bergman: IPC's Lead-Free Position: Still
Standing," CircuiTree, vol. 14 no. 10, pp. xx, Oct. 2001.
Bergman, David,
"Our goal has been to assist the industry as it works towards the orderly
conversion to lead free soldering," Lead-Free Magazine, vol.
3, Feb. 2005.
Bergman. David,
"Wacko, Inevitable, Irrelevant- Oh My!," Circuits Assembly, vol.
10 no. 8, pp. 80, Aug. 1999.
Bergman, Dieter,
"20th Anniversary Perspective: What's Happening-2010: Part 3 - The Impact of
Technology Roadmaps in the Last Decade," CircuiTree, vol. 21
no. 7, pp. xx-xx, July 2008.
Bergman, Dieter,
"Establishing BGA "Void Protocols" per IPC-7095," IPC Review,
vol. 48 no. 8, pp. 16-19, Sept. 2007.
Bergman, Stephanie, and Subramanian, K. N.,
"Critical studies to improve service reliability of Sn-Ag-Cu solder joints by
thermal treatments," Journal of Materials Science: Materials in
Electronics, vol. 23 no. 7, pp. 1442-1448, July 2012.
Bergmann, Rene, Tang, Peter Torben, Hansen, Hans Norgaard, and Moller, Per,
"In-Situ Investigation of Lead-Free Solder Alloy Formation using a Hot-Plate
Microscope," 9th Electronics Packaging Technology Conference,
Singapore, Dec. 10-12, 2007, pp. 252-256.
Bergner, Danielle M.,
"The Electronic Waste Recycling Act of 2003: California's Response to the
Electronic Waste Crisis," Marquette Law Review, vol. 88 no. 2,
pp. 377-389, Fall 2004.
Bergum, Erik J.,
"CAF Resistance of NON-DICY FR-4," Printed Circuit Fabrication,
vol. 25 no. 9, pp. 26,28,30, Sept. 2002.
Bergum, Erik J., and Humby, David,
"Lead Free Assembly: A Practical Tool for Laminate Materials Selection,"
IPC/Soldertec Global 3rd International Conference on Lead Free
Electronics, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.
Bergum, Erik,
"Material World: A Funny Thing Happened on the Way to Trying to Be Green.,"
CircuiTree, vol. 20 no. 10, pp. xx-xx, Oct. 2007.
Berman, Jeff,
"IPC gets the lead out of packaging standards," EDN, vol. xx
no. xx, pp. xx-xx, Mar. 1, 2005.
Berman, Ronald J.,
"Customer Advisory - CA04-AGR-08: Backward Compatibility of Pb-Free Leadframe
Decices," Agere Systems.
Bernal, J. D.,
"The Complex Structure of the Copper-Tin Intermetallic Compounds,"
Nature, vol. 122, pp. 54, July 14, 1928.
Bernard, David, and Willis, Bob,
"A Suggested Process for Detecting Counterfeit Components," 2008 SMTA
International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008,
pp. 756-761.
Bernard, David,
"An A-to-Z Guide to X-Ray Inspection, Part II," Circuits Assembly
, vol. 19 no. 1, pp. 34, Jan. 2008.
Bernard, David, and Ainsworth, Steve,
"Comparing Digital and Analogue X-ray Inspection for BGA, Flip Chip and CSP
Analysis," Proceedings of the Technical Conference (CDROM) IPC/SMEMA
Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp.
S05-2-1-S05-2-5.
Bernard, David, and Willis, Bob,
"Correlating the Presence of Popcorned BGA Devices Post Reflow with
Solder-Ball Diameter Measurements from X-ray Inspection," 2006 SMTA
International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006,
pp. 768-773.
Bernard, David,
"Counterfeit Detection," Surface Mount Technology (SMT), vol.
22 no. 8, pp. 14, Aug. 2008.
Bernard, David, and Bryant, Keith,
"Does PCB Pad Finish Affect Voiding Levels in Lead-Free Assemblies?,"
2004 SMTA International Conference Proceedings, Chicago, IL, Sept.
26-30, 2004, pp. 569-573.
Bernard, David,
"Implications of Using Lead-Free Solders on X-Ray Inspection of Flip Chips and
BGAs," 2003 SMTA International Conference Proceedings, Chicago,
IL, Sept. 21-25, 2003, pp. xx-xx.
Bernard, David,
"Lead-free Solder X-ray Inspection Implications," Surface Mount
Technology (SMT), vol. 17 no. 10, pp. 48, Oct. 2003.
Bernard, David, and Willis, Bob,
"Measurement Variation in PIHR Pb-Free Solder Joints," Circuits
Assembly, vol. 17 no. 3, pp. 54, Mar. 2006.
Bernard, David,
"Measurement Variation in the Fill of Intrusively Reflowed Lead Free Solder
Joints with Different Board Finishes by X-ray Inspection," 2005 SMTA
International Conference Proceedings, Chicago, IL, Sept. 25-29, 2005,
pp. 697-703.
Bernard, David,
"Pb-Free, Moisture Sensitivity and X-Ray Inspection," Circuits
Assembly, vol. 16 no. 8, pp. 26-27, Aug. 2005.
Bernard, David, and Willis, Bob,
"Pin-in-hole reflow (PIHR) and lead-free solder joints," Global SMT
and Packaging, vol. 7 no. 10, pp. 10-12, 14-15, Oct. 2007.
Bernard, David,
"X-ray Inspection of Low-Temperature Solder Joints," Printed Circuit
Design and Fab/ Circuits Assembly, vol. 37 no. 11, pp. 42-43, Nov.
2020.
Bernardin, T., Dupre, L., Burnier, L., Gentile, P., Peyrade, D., Zelsmann, M.,
and Buttard, D.,
"Organized porous alumina membranes for high density silicon nanowires
growth," Microelectronic Engineering, vol. 88 no. 9, pp.
2844-2847, Sept. 2011.
Bernasko, P. K., Mallik, S., Ekere, N.,N., Seman, A., and Takyi, G.,
"Effect of Reflow Profile and Thermal Cycle Ageing on the Intermetallic
Formation and Growth in Lead-free Soldering," 11th Electronics Packaging
Technology Conference, Singapore, Dec. 9-11, 2009, pp. 986-990.
Bernasko, Peter K., Mallik, Sabuj, and Takyi, G.,
"Effect of Intermetallic Compound Layer Thickness on the Shear Strength of
1206 Chip Resistor Solder Joint," Soldering & Surface Mount
Technology, vol. 27 no. 1, pp. xx-xx, 2015.
Bernauer, Christian, Kuntze, Torsten, Behrens, Volker, and Honig, Thomas,
"Substitution of Silver/Cadmium oxide in High Voltage Disconnectors,"
Proceedings of the Fifty-First IEEE Holm Conference on Electrical Contacts
, Chicago, IL, Sept. 26-28, 2005, pp. 42-47.
Bernede, J. C., Cattin, L., Morsli, M., and Berredjem, Y.,
"Ultra-thin metal layer passivation of the transparent conductive anode in
organic solar cells," Solar Energy Materials and Solar Cells,
vol. 92 no. 11, pp. 1508-1515, Nov. 2008.
Berni, Rossella, Catelani, Marcantonio, Fiesoli, Caterina, and Scarano,
Valeria L.,
"A Comparison of Alloy-Surface Finish Combinations Considering Different
Component Package Types and Their Impact on Soldering Reliability," IEEE
Transactions on Reliability, vol. 65 no. 1, pp. 272-281, Mar. 2016.
Bernier, D.,
"Effect of Aging on the Solderability of Various Plated Surfaces,"
Plating, vol. 61 no. 9, pp. 842-845, Sept. 1974.
Bernier, Dennis,
"An Expert Looks at the IssuesTM," Chip Scale Review, vol. xx
no. xx, pp. xx-xx, Sept.-Oct. 1999.
Berntson, Ross, Dixon, Doug, Holtzer, Mitch, Moloznik, Bruce, and Rothschild,
Stan,
"Heavy Metals," Adhesives & Sealants Industry, vol. xx
no. xx, pp. xx-xx, Sept. 2007.
Berroukche, A., Soudini, B., and Amara, K.,
"Molecular dynamics simulation study of structural, elastic and thermodynamic
properties of tin below 286 K," International Journal of
Nanoelectronics and Materials, vol. 1 no. 1, pp. 41-51, Jan. 2008.
Berry, Paul,
"Thermal Gradient Adhesion Testing," SMT Web Exclusive Article.
Berry, R. W., Bouton, G. M., Ellis, W. C., and Engling, D. E.,
"Growth of Whisker Crystals and Related Morphologies by Electrotransport,"
Applied Physics Letters, vol. 9 no. 7, pp. 263-265, Oct. 1, 1966.
Berry, Steve, and Winkler, Sandra,
"Are you ready for RoHS?," Chip Scale Review, vol. xx no. xx,
pp. xx-xx, 2006.
Berta, Bob,
"Manufacturer's Corner: DynamicIR for Lead-Free Rework," empfasis
, pp. xx-xx, Feb. 2006.
Berta, Robert,
"Manufacturer's Corner Dage X-Ray: Popcorning," empfasis, pp.
10, Apr. 2007.
Berta, Robert,
"Manufacturer's Corner Rework Equipment," empfasis, pp. 10,
Mar. 2007.
Bertheau, J., Bleuet, P., Pantel, Roland, Charbonnier, J., Hodaj, F.,
Coudrain, P., and Hotellier, N.,
"Microstructural and Morphological Characterization of SnAgCu Micro-bumps for
Integration in 3D Interconnects," 2013 IEEE 63rd Electronic Components
and Technology Conference, Las Vegas, NV, May 28-31, 2013, pp.
1127-1132.
Bertheau, Julien, Hodaj, Fiqiri, Hotellier, Nicolas, and Charbonnier, Jean,
"Effect of intermetallic compound thickness on shear strength of 25 um
diameter Cu-pillars," Intermetallics, vol. 51, pp. 37-47, Aug.
2014.
Berthou, M., Retailleau, P., Fremont, H., Guedon-Gracia, A., and
Jephos-Davennel, C.,
"Influence of PCB design and materials on chip solder joint reliability,"
2010 11th International Conference on Thermal, Mechanical &
Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems
, Bordeaux, France, Apr. 26-28, 2010, pp. xx-xx.
Berthou, M., Retailleau, P., Fremont, H., Guedon-Gracia, A., and
Jephos-Davennel, C.,
"Microstructure evolution observation for SAC solder joint: Comparison between
thermal cycling and thermal storage," Microelectronics Reliability
, vol. 49 no. 9-11, pp. 1267-1272, Sept.-Nov. 2009.
Berti, G. A., Monti, M., Bietresato, M., and D'Angelo, L.,
"Micro Wire-Drawing: Experiments And Modelling," AIP Conference
Proceedings, vol. 908, pp. 711-716, 2007.
Bertling, Silvio,
"Evaluating Laminates for High Temperature Assembly," The Board
Authority, vol. xx no. xx, pp. 20-23, 2005.
Bertocci, F., and Grandoni, A.,
"Corrosion of Tin-Indium Solder during the Manufacturing Process of Biomedical
Ultrasound Transducers," 2019 22nd European Microelectronics and
Packaging Conference & Exhibition, Pisa, Italy, Sept. 16-19, 2019. pp.
xx-xx.
Bertrand, Nathalie, Desgranges, Clara, Gauvain, Danielle, Monceau, Daniel, and
Poquillon, Dominique,
"Low Temperature Oxidation of Pure Iron: Growth Kinetics and Scale
Morphologies," Materials Science Forum, vol. 461-464, pp.
591-598, 2004.
Beshai, M. H. N., Habib, S. K., Yassein, A. M., Saad, G., and El-Naby, M. M.
Hasab,
"Effect of SnSb Particle Size on Creep Behavior under Power Law Regime of
Sn-10%Sb Alloy," Crystal Research Technology, vol. 34 no. 1,
pp. 119-126, 1999.
Bestetti, M., Lecis, N., Magagnin, L., Pirovano, R., and Cavallotti, P. L.,
"Alternatives to coatings from Chromium VI baths," Proceedings of AESF
SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 714-724.
Bestetti, M., Vicenzo, A., and Cavallotti, P. L.,
"Electrodeposition of Cu-Sn and Ag-Sn alloys from thiourea containing
electrolytes," Proceedings of AESF SUR/FIN 2002, Chicago, IL,
June 24-27, 2002, pp. 745-754.
Bestetti, M., Vicenzo, A., Lombardi, I., and Cavallotti, P. L.,
"Tin-copper Alloys Electroplating from Thiourea Solutions," AESF SUR/FIN
2004, Chicago, IL, June 28-July 1, 2004, pp. 584-592.
Betts, Kellyn S.,
"World's greenest PC goes global," Environmental Science &
Technology, vol. 36 no. 19, pp. 368A-371A, Oct. 1, 2002.
Betts, Mitch,
"'Zinc Whiskers' Vex Aussie Data Centers," Computerworld,
vol. xx no. xx, pp. xx-xx, Dec. 13, 2004.
Beuers, J., Pteschek, G., and Schlamp, G.,
"Mechanical Properties of Soft Solder Materials for Electronic Applications,"
Eleventh IEEE/CHMT International Electronics Manufacturing Technology
Symposium, San Francisco, CA, Sept. 16-18, 1991, pp. 120-130.
Beyer, H., Sivasubramaniam, V., Bayer, M., and Hartmann, S.,
"Reliability of Lead-free Large Area Solder Joints in IGBT Modules with
Respect to Passive and Active Thermal Cycling," 9th International
Conference on Integrated Power Electronics Systems, Hamburg, Germany,
Feb. 8-10, 2016, pp. xx-xx.
Bhagat, S. M., and Lubitz, P.,
"F.M.R. in H.C.P. Cobalt Whiskers," Magnetism and Magnetic Materials -
1972 (18th Annual Conference-Denver) Number, 10 Part 1, Denver, CO,
Nov. 28-Dec. 1, 1972, pp. 125-129.
Bhagat, S. M., and Lubitz, P.,
"F.M.R. in H.C.P. Cobalt Whiskers," AIP Conference Proceedings,
vol. 10, pp. 125-129, 1973.
Bhagat, S. M., Hirst, L. L., and Anderson, J. R.,
"Ferromagnetic Resonance in Nickel and Iron," Journal of Applied Physics
, vol. 37 no. 1, pp. 194-197, Jan. 1966.
Bhassyvasantha, S., Fredj, N., Mahapatra, S. D., Jennings, W., Dutta, I., and
Majumdar, B. S.,
"Whisker Mitigation Mechanisms in Indium-Doped Tin Thin Films: Role of the
Surface," Journal of Electronic Materials, vol. 47 no. 10, pp.
6229-6240, Oct. 2018.
Bhat, Kiran N., Prabhu, K. N., and Satyanarayan, ,
"Effect of reflow temperature and substrate roughness on wettability, IMC
growth and shear strength of SAC387/Cu bonds," Journal of Materials
Science: Materials in Electronics, vol. 25 no. 2, pp. 864-872, Feb.
2014.
Bhate, D., Chan, D., Subbarayan, G., and Nguyen, L.,
"A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in
Solder Joints," Journal of Electronic Packaging, vol. 130 no. 2,
pp. 021003-1-021003-9, June 2008.
Bhate, D., and Subbarayan, G.,
"A Nonlinear Fracture Mechanics Perspective on Solder Joint Failure: Going
Beyond the Coffin-Manson Equation," Proceedings 10th InterSociety
Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
, San Diego, CA, May 30-June 2, 2006, pp. 1220-1225.
Bhate, D., Chan, D., Subbarayan, G., Chiu, T. C., Gupta, V., and Edwards, D.,
"Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys at Creep and
Low Strain Rate Regimes," 2007 ASME International Mechanical Engineering
Conference and Exposition, Volume 5, Seattle, WA, Nov. 11-15, 2007, pp.
183-196.
Bhate, D., Chan, D., Subbarayan, G., and Nguyen, L.,
"Fatigue Crack Growth and Life Descriptions of Sn3.8Ag0.7Cu Solder Joints: A
Computational and Experimental Study," 2007 Proceedings 57th Electronic
Components & Technology Conference, Reno, NV, May 29-June 1, 2007,
pp. 558-565.
Bhate, D., Subbarayan, G., Zhao, J., Gupta, V., and Edwards, D.,
"Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of
Empirical Fits," Journal of Electronic Packaging, vol. 131 no. 4,
pp. 044502-1-044502-3, Dec. 2009.
Bhate, D., Chan, D., and Subbarayan, G.,
"Non-Empirical Modeling of Fatigue in Lead-Free Solder Joints: Fatigue Failure
Analysis and Estimation of Fracture Parameters," 7th International
Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments
in Micro-Electronics and Micro-Systems, Como, Italy, Apr. 24-26, 2006,
pp. xx-xx.
Bhate, D., Chan, D., Subbarayan, G., and Chiu, T. C.,
"Solder Interconnection Specimen Design and Test Control Procedure for Valid
Constitutive Modeling of Solder Alloys," Proceedings 10th InterSociety
Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
, San Diego, CA, May 30-June 2, 2006, pp. 977-983.
Bhate, Dhruv, Chan, Dennis, Subbarayan, Ganesh, Chiu, Tz Cheng, Gupta, Vikas,
and Edwards, Darvin R.,
"Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys at Creep and
Low Strain Rate Regimes," IEEE Transactions on Components and Packaging
Technologies, vol. 31 no. 3, pp. 622-633, Sept. 2008.
Bhatia, Gaytri, and Siegel, Jocelyn,
"Summary of Lead-Free Solder Performance Based on Existing Data Provided by
the Electronics Industry," Abt Associates, Dec. 4, 2002.
Bhatia, M. A., Adlakha, I., Lu, G., and Solanki, K. N.,
"Generalized stacking fault energies and slip in b-tin," Scripta
Materialia, vol. 123, pp. 21-25, Oct. 2016.
Bhatkal, Ravi M., Patel, Amit, and Pandher, Ranjit,
"High Reliability Interconnects for High Power LED Assembly," South East
Asia Technical Training Conference on Electronics Assembly Technologies 2016
Proceedings, Penang, Malaysia, Apr, 12-14, 2016, pp. xx-xx.
Bhatt, H. J.,
"Superior Aluminum for Interconnections of Integrated Circuits," Applied
Physics Letters, vol. 19 no. 2, pp. 30-33, July 15, 1971.
Bhatt, Harish,
"Alternatives to Hexavalent Chromium to Comply with European Union's
Directives (ELV, RoHS and WEEE)," Plating & Surface Finishing
, vol. 93 no. 10, pp. 20-23, Oct. 2006.
Bhatt, Harish,
"Status Update for End-of-Life Vehicle (ELV) Directive; Replacement of
Hexavalent Cr in Automotive Industry," Proceedings 2003 AESF/EPA
Conference for Environmental & Process Excellence, Daytona, FL,
Feb. 3-7, 2003, pp. 31-37.
Bhatt, Harish, Manavbasi, Alp, and Rosenquist, Danielle,
"Trivalent Chromium for Enhanced Corrosion Protection on Aluminum Surfaces,"
Metal Finishing, vol. 107 no. 6, pp. 39-47, June 2009.
Bhatt, Harish, Manavbasi, Alp, and Rosenquist, Danielle,
"Trivalent Chromium for Enhanced Corrosion Protection on Aluminum Surfaces,"
Metal Finishing, vol. 107 no. 7-8, pp. 31-37, July-Aug. 2009.
Bhatt, V. P., and Trivedi, S. B.,
"Chemical and Thermal Etching of Se-Te Whisker Crystals," Journal of
Crystal Growth, vol. 37 no. 1, pp. 23-28, Jan. 1977.
Bhatta, Rudra P., Henderson, Mark, Eufrasio, Andreza, Pegg, Ian L., and Dutta,
Biprodas,
"Properties of p- and n-Type PbTe Microwires for Thermoelectric Devices,"
Journal of Electronic Materials, vol. 43 no. 11, pp. 4056-4063,
Nov. 2014.
Bhattacharya, Sitangshu, and Mallik, Ramesh Chandra,
"Electrical Resistance and Seebeck Coefficient in PbTe Nanowires,"
Journal of Electronic Materials, vol. 41 no. 6, pp. 1421-1428, June
2012.
Bhattacharya, Sumit, Sharma, Ashutosh, Das, Siddhartha, and Das, Karabi,
"Synthesis and Properties of Pulse Electrodeposited Lead-Free Tin-Based
Sn/ZrSiO4 Nanocomposite Coatings," Metallurgical and Materials
Transactions A: Physical Metallurgy and Materials Science, vol. 47 no.
3, pp. 1292-1312, Mar. 2016.
https://doi.org/10.1007/s11661-015-3313-6
Bhatti, Pardeep K., Pei, Min, and Fan, Xuejun,
"Reliability Analysis of SnPb and SnAgCu Solder Joints in FC-BGA Packages with
Thermal Enabling Preload," Proceedings 56th Electronic Components &
Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 601-606.
Bhavankar, Anand,
"Ask the EMPF Helpline!," empfasis, pp. 2,8-9, July 2009.
Bhimarasetti, Gopinath, and Sunkara, Mahendra K.,
"Synthesis of Sub-20-nm-Sized Bismuth 1-D Structures Using Gallium-Bismuth
Systems," Journal of Physical Chemistry B, vol. 109 no. 34,
pp. 16219-16222, Sept. 1, 2005.
Bhuie, A. K., Ogunseitan, O. A., Saphores, J.-D.M., and Shapiro, A. A.,
"Environmental and Economic Trade-offs in Consumer Electronic Products
Recycling: A case study of cell phones and computers," 2004 IEEE
International Symposium on Electronics & the Environment Conference
Record, Scottsdale, AZ, May 10-13, 2004, pp. 74-79.
Bhukari, S., Santos, D. L., Lehman, L. P., and Cotts, E.,
"Continued Evaluation of the Effects of Processing Conditions and Aging
Treatments on Shear Strength and Microstructure in Pb-Free Surface Mount
Assembly," International Conference on Lead-free Soldering,
Toronto, Ontario, May 24-26, 2005, pp. xx-xx.
Bi, Jinglin, Hu, Anmin, Hu, Jing, Luo, Tingbi, Li, Ming, and Mao, Dali,
"Effect of Cr additions on interfacial reaction between the Sn-Zn-Bi solder
and Cu/electroplated Ni substrates," Microelectronics Reliability,
vol. 51 no. 3, pp. 636-641, Mar. 2011.
Bi, Jinglin, Hu, Anmin, Li, Ming, and Mao, Dali,
"The evolution of interfacial microstructure of Sn3.5Ag solder bump with Cu
under-bump metallization," 2011 12th International Conference on
Electronic Packaging Technology and High Density Packaging, Shanghai,
China, Aug. 8-11, 2011, pp. 369-373.
Bi, Wenzhen, Ju, Guokui, Lin, Fei, Xie, Shifang, and Wei, Xicheng,
"Interfacial IMC layer growth and tensile properties of low-silver Cu/SACBE/Cu
solder joints," Soldering & Surface Mount Technology, vol. 24
no. 4, pp. 249-256, 2012.
Biancomano, Vincent,
"IPC reactivates lead-free solder issue," Electronic Engineering
Times, no. 1288, pp. 74, Sept. 22, 2003.
Biancomano, Vinvent,
"IPC reactivates lead-free solder issue,", EE Times, Sept.
18, 2003.
Biancomano, Vincent,
"IPC reactivates lead-free solder issue," Green SupplyLine,
Sept. 18, 2003.
Biancomano, Vinvent,
"IPC reactivates lead-free solder issue," eeProductCenter,
Sept. 18, 2003.
Bibber, John W.,
"Chromate - Free Conversion Coatings For Aluminum," Proceedings of AESF
SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 425-433.
Bibber, John W.,
"Chromate-Free Conversion Coatings For Aluminum," Plating & Surface
Finishing, vol. 90 no. 3, pp. 40-43, Mar. 2003.
Bibber, John W.,
"Conversion Coatings For Magnesium and its Alloys," AESF SUR/FIN 2004
, Chicago, IL, June 28-July 1, 2004, pp. 438-447.
Bibber, John W.,
"Non-Chrome-Containing Conversion Coatings for Zinc and Zinc Alloys,"
Metal Finishing, vol. 106 no. 4, pp. 41-46, Apr. 2008.
Bibber, John W.,
"Zincate- or Stannate-free Plating of Magnesium, Aluminum, and Titanium,"
Metal Finishing, vol. 107 no. 7-8, pp. 28-30, July-Aug. 2009.
Bidin, Rahamat, Tagapulot, Rosemarie, Lao, Carl Nichelle D., and Manalac,
Rodel,
"Lead-Free Packaging", Advanced Packaging, vol. 10 no. 4, pp.
xx-xx, Apr. 2001.
Bielawski, M.,
"Hard Chromium Plating Alternative Technologies," Canadian Aeronautics
and Space Journal, vol. 46 no. 3, pp. 140-149, Sept. 2000.
Bieler, T. R., Jiang, H., Lehman, L. P., Kirkpatrick, T., and Cotts, E. J.,
"Influence of Sn Grain Size and Orientation on the Thermomechanical Response
and Reliability of Pb-free Solder Joints," Proceedings 56th Electronic
Components & Technology Conference, San Diego, CA, May 30-June 2,
2006, pp. 1462-1467.
Bieler, Thomas R., and Telang, Adwait U.,
"Analysis of Slip Behavior in a Single Shear Lap Lead-Free Solder Joint During
Simple Shear at 25°C and 0.1/s," Journal of Electronic Materials,
vol. 38 no. 12, pp. 2694-2701, Dec. 2009.
Bieler, Thomas R., Telang, Adwait U., Cotts, Eric J., Lehman, Larry P.,
Zamiri, A., and Pourboghrat, F.,
"Deformation and Microstructural Evolution Processes in Lead-Free Sn-Ag Solder
Joints due to Creep, Aging and ThermoMechanical Fatigue and Preliminary
Results on SAC Ball Grid Arrays," 2006 Lead-Free Technology Workshop
, San Antonio, TX, Mar. 12, 2006, pp. xx-xx.
Bieler, Thomas R., Jiang, Hairong, Lehman, Lawrence P., Kirkpatrick, Tim,
Cotts, Eric J., and Nandagopal, Bala,
"Influence of Sn Grain Size and Orientation on the Thermomechanical Response
and Reliability of Pb-free Solder Joints," IEEE Transactions on
Components and Packaging Technologies, vol. 31 no. 2, pp. 370-381, June
2008.
Bieler, Thomas R., Lee, Tae-kyu, and Liu, Kuo-Chuan,
"Methodology for Analyzing Strain States During In Situ Thermomechanical
Cycling in Individual Lead-Free Solder Joints Using Synchrotron Radiation,"
Journal of Electronic Materials, vol. 38 no. 12, pp. 2712-2719,
Dec. 2009.
Bieler, Thomas R., Zhou, Bite, Blair, Lauren, Zamiri, Amir, Darbandi, Payam,
Pourboghrat, Farhang, Lee, Tae-Kyu, and Liu, Kuo-Chuan,
"The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and
Damage Evolution During Thermal Cycling in SAC305 Solder Joints,"
Journal of Electronic Materials, vol. 41 no. 2, pp. 283-301, Feb. 2012.
Bigas, M., and Cabruja, E.,
"Characterisation of electroplated Sn/Ag solder bumps," Microelectronics
Journal, vol. 37 no. 4, pp. 308-316, Apr. 2006.
Bigas, M., and Cabruja, E.,
"High density of electrodeposited Sn/Ag bumps for flip chip connection,"
Microelectronic Engineering, vol. 83 no. 3, pp. 399-403, Mar.
2006.
Bigelow, Peter,
"A Turning Point," Printed Circuit Design and Manufacture,
vol. 23 no. 7, pp. 14, July 2006.
Bigelow, Peter,
"Ethics on Display," Printed Circuit Design and Manufacture,
vol. 23 no. 3, pp. 14, Mar. 2006.
Bigelow, Peter,
"Keep It Simple, Stupid!," Printed Circuit Design and Manufacture
, vol. 22 no. 8, pp. 14, Aug. 2005.
Bigelow, Peter,
"Why Lead-free Feels Like the End," Printed Circuit Design &
Manufacture, vol. xx no. xx, pp. 18, Aug. 2004.
Biglari, M. H., and Fox, F.,
"CLOSER look at lead-free joints," Electronics Manufacture and Test
, pp. xx-xx, Mar. 2006.
Biglari, M. H., Das, A., Krassenburg, L. C. P., Brom, J. H. G., van Veen, N.
J. A., and Kodentsov, A. A.,
"Low-Temperature Soldering Using Ordered Alloys," SMTA International
2018 Proceedings, Rosemont, IL, Oct. 14-18, 2018, pp. xx-xx.
Biglari, M. H., Kox, F., Hermans, M., and Kodentsov, A.,
"Reliability Aspects of Lead-Free Soldering in Industrial Applications,"
1st Electronics Systemintegration Technology Conference, Volume 1
, Dresden, Germany, Sept. 5-7, 2006, pp. 481-484.
Biglari, M. H., Nazarian, A., Denteneer, R., Biglari Jr., M., and Kodentsov,
A. A.,
"Reliability of BGA Solder Joints after Re-Balling Process," IPC
APEX Expo 2012, San Diego, CA, Feb. 28-Mar. 1, 2012, pp. xx-xx.
Bigum, Marianne, Brogaard, Line, and Christensen, Thomas H.,
"Metal recovery from high-grade WEEE: A life cycle assessment," Journal
of Hazardous Materials, vol. 207-208, pp. 8-14, Mar. 15, 2012.
Bigum, Marianne, Petersen, Claus, Christensen, Thomas H., and Scheutz,
Charlotte,
"WEEE and portable batteries in residual household waste: Quantification and
characterisation of misplaced waste," Waste Management, vol. 33
no. 11, pp. 2372-2380, Nov. 2013.
Bijimi, D., and Gabe, D. R.,
"Passivation Studies using Group VIA Anions. I. Anodic treatment of tin,"
British Corrosion Journal, vol. 18 no. 2, pp. 88-92, 1983.
Bijl, A. J., and Kolkmeijer, N. H.,
"De Kristalstructuur van Het Grauwe Tin," Chemisch Weekblad, vol.
15 nr. 40, pp. 1264, Oct. 5, 1918.
Bijl, A. J., and Kolkmeijer, N. H.,
"De Kristalstructuur van Tin," Chemisch Weekblad, vol. 15 no.
35, pp. 1077-1079, Aug. 31, 1918.
Bijl, A. J., and Kolkmeijer, N. H.,
"Investigation by means of X-rays of the crystal-structure of white and grey
tin. I," Koninklijke Akademie van Wetenschappen te Amsterdam,
vol. 21 no. 3, pp. 405-408, 1919.
Bijl, A. J., and Kolkmeijer, N. H.,
"Investigation by means of X-rays of the crystal-structure of white and grey
tin, II. The structure of white tin," Koninklijke Akademie van
Wetenschappen te Amsterdam, vol. 21 no. 4, pp. 494-500, 1919.
Bijl, A. J., and Kolkmeijer, N. H.,
"Investigation by means of X-rays of the crystal-structure of white and grey
tin, III. The structure of grey tin," Koninklijke Akademie van
Wetenschappen te Amsterdam, vol. 21 no. 4, pp. 501-504, 1919.
Bikulcius, G.,
"Control of Thickness of Corrosion-Resistant Zn-Fe, Zn-Co & Zn-Ni
Coatings," Plating & Surface Finishing, vol. 84 no. 8, pp.
30, 32, Aug. 1997.
Bilek, J., Atkinson, J. K., and Wakeham, W. A.,
"Thermal Conductivity of Molten Lead-Free Solders," International
Journal of Thermophysics, vol. 27 no. 1, pp. 92-102, Jan. 2006.
Biligiri, Suresh,
"RoHS Screening Via XRF Technology: A Guideline to Selecting Systems,"
Metal Finishing, vol. 105 no. 4, pp. 29-31, 33, Apr. 2007.
Billah, M. Muktadir, and Shorowordi, Kazi Mohammad,
"Effect of Micron Size Ni Particle Addition on Microstructure, Thermal and
Mechanical Properties of Sn-9Zn Lead-free Solder Alloy," Applied
Mechanics and Materials, vol. 229-231, pp. 271-275, Nov. 2012.
Billah, Md. Muktadir, Shorowordi, Kazi Mohammad, and Sharif, Ahmed,
"Effect of micron size Ni particle addition in Sn-8Zn-3Bi lead-free solder
alloy on the microstructure, thermal and mechanical properties," Journal
of Alloys and Compounds, vol. 585, pp. 32-39, Feb. 5, 2014.
Billah, Md Muktadir, and Chen, Quanfang,
"Strength of MWCNT-Reinforced 70Sn-30Bi Solder Alloys," Journal of
Electronic Materials, vol. 45 no. 1, pp. 98-103, Jan. 2016.
Bin, Jian, and Chen, Jeng-I,
"Lead-Free Process Compatible No Flow Prepreg for Rigid-Flex PCB,"
Proceedings of Technical Papers - 2007 International Microsystems, Packaging,
Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 1-3,
2007, pp. 377-380.
Bin, Yao, and Yabing, Zou,
"Key Failure Modes of Solder Joints on ENIG PCBs and Root Cause Analysis,"
2012 13th International Conference on Electronic Packaging Technology
and High Density Packaging, Guilin, China, Aug. 13-16, 2012, pp.
1205-1208.
Bin, Yao, Yudong, Lu, and Daojun, Luo,
"Key Failure Modes of Solder Joints on HASL PCBs and Root Cause Analysis,"
2013 14th International Conference on Electronic Packaging Technology
, Dalian, China, Aug. 11-14, 2013, pp. 742-745.
Bin, Yao, Hui, Chen, Yudong, Lu, and Daojun, Luo,
"Study of Key Failure Modes of PTH in High Density Printed Board and Case
Study," 2014 15th International Conference on Electronic Packaging
Technology, Chengdu, China, Aug. 12-15, 2014, pp. 923-927.
Bin, Zhou, Qing, Zhou, Kailin, Pan, and Ganggang, Liu,
"Extraction of Anand Model Parameters for Mixed Solder Material by Tensile
Test," 2012 13th International Conference on Electronic Packaging
Technology and High Density Packaging, Guilin, China, Aug. 13-16, 2012,
pp. 1340-1343.
Bin, Zhou, Zhonghua, Wan, Xunping, Li, and Yun-fei, En,
"Research on Tin Whisker Growth of Pure Tin Plating of Different Lead
Substrates," 2013 20th IEEE International Symposium on the Physical and
Failure Analysis of Integrated Circuits, Suzhou, China, July 15-19,
2013, pp. 611-614.
Bin, Zhou, Qing, Zhou, and Yun-fei, En,
"Study on Interfacial Behavior and Shear Strength of Lead-free
Micro-interconnect Bump after SnPb Reballing," 2012 13th International
Conference on Electronic Packaging Technology and High Density Packaging
, Guilin, China, Aug. 13-16, 2012, pp. 1317-1319.
Bing, An, Hua-bin, Chu, Jing-qiang, He, Jia, Wang, Li, Hua, Feng-Shun, Wu, and
Yi-ping, Wu,
"Low Cost Smart Labels Assembled by Anisotropically Conductive Adhesive,"
Proceedings of the 2006 IEEE CPMT Conference on High Density Microsystem
Design, Packaging and Component Failure Analysis, Shanghai, June 27-28,
2006, pp. 228-231.
Biocca, Peter,
"2005: A Year of Many Questions and Answers" Lead-Free Connection
, vol. 2 no. 4, pp. 2-6, Dec. 2005.
Biocca, Peter, and Khan, Zulki,
"Attaining Lead-free Solder Joint Reliability," Surface Mount
Technology (SMT), vol. 19 no. 11, pp. 34-35, Nov. 2005.
Biocca, Peter, and Rivas, Carlos,
"Case Study on the Validation of SAC305 & SnCu Based Solders in SMT, Wave
and Hand-Soldering at the Contract Assembler Level," International
Conference on Soldering and Reliability, Toronto, Ontario, Apr. 17-19,
2007, pp. xx-xx.
Biocca, Peter, and Rivas, Carlos,
"Case Study on the Validation of SAC305 and SnCu-Based Solders in SMT, Wave
and Hand-Soldering at the Contract Assembler Level," 12th International
Symposium on Advanced Packaging Materials, San Jose, CA, Oct. 3-5,
2007, pp. 152-157.
Biocca, Peter, and Rivas, Carlos,
"Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave
and Hand-Soldering at the Contract Assembler Level," Successful
Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007,
pp. xx-xx.
Biocca, Peter, and Rivas, Carlos,
"Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave
and Hand-Soldering at the Contract Assembler Level," Lead-Free
Magazine.
Biocca, Peter.
"Coming Soon: Lead-free Soldering in America," Surface Mount
Technology (SMT), vol. 17 no. 10, pp. 22, Oct. 2003.
Biocca, Peter,
"Creating of a Company Lead-free RoHS Implementation Plan" International
Conference on Lead-free Soldering, Toronto, Ontario, May 24-26, 2005,
pp. xx-xx.
Biocca, Peter,
"Creating Solder Joint Reliability with SnCu Based Solders Some Practical
Experiences," Kester.
Biocca, Peter,
"Creating solder joint reliability with tin-copper based solders,"
EMasia, May 2007.
Biocca, Peter,
"Developing a Reliable Lead-free SMT Assembly Process," Lead-Free
Connection, vol. 1 no. 2, pp. 2-4, Nov. 2004.
Biocca, Peter,
"Global Update on Lead-Free Solders," 1998 Surface Mount International
Conference Proceedings, San Jose, CA, Aug. 23-27, 1998, pp. xx-xx.
Biocca, Peter,
"Global Update on Lead-free Solders," Surface Mount Technology (SMT)
, vol. 13 no. 6, pp. 64-67, June 1999.
Biocca, Peter,
"How do you create a RoHS compliant lead-free roadmap?," emsnow
, Dec. 13, 2004.
Biocca, Peter,
"How Do You Create a RoHS Compliant - Lead-Free Roadmap?," Lead-Free
Magazine, vol. 5, 2005.
Biocca, Peter,
"Lead-free Alloys for Wave and SMT Assembly Status Report," Proceedings
of the Technical Program NEPCON West 2000, Volume 1, Anaheim, CA, Feb.
29-Mar. 2, 2000, pp. 423-431.
Biocca, Peter,
"Lead-free Alloys for Wave and SMT Assembly Assembly with Two Alloys,"
2000 Lead Free Symposium Conference Proceedings, 2000, pp. xx-xx.
Biocca, Peter,
"Lead-free and Lead Contamination," Surface Mount Technology (SMT)
, vol. 18 no. 10, pp. 50, Oct. 2004.
Biocca, Peter,
"Lead-free and RoHS Implimentation - Questions from the frontline,"
emsnow, Aug. 24, 2005.
Biocca, Peter,
"Lead-free and RoHS Implementation - Questions from the Frontline, Part 1."
Biocca, Peter,
"Lead-free and RoHS Implementation - Questions from the Frontline, Part 2."
Biocca, Peter,
"Lead-free and RoHS Implimentation - Questions from the Frontline, Part 3,"
emsnow, Feb. 8, 2006.
Biocca, Peter,
"Lead-free and RoHS implimentation questions from the frontline, Part 4,"
emsnow, Aug. 1, 2006.
Biocca, Peter,
"Lead-free and RoHS Implimentation: Moving Forward with Questions as Always,"
Lead-Free Connection, vol. 3 no. 2, pp. 2-5, Aug. 2006.
Biocca, Peter, Tuerlings, Serge, Ishizaki, Yuzo, and Tan, Su-Lynn,
"Lead-Free and RoHS: Its Global Reach," Lead-Free Connection,
vol. 2 no. 3, pp. 1-5, Sept. 2005.
Biocca, Peter,
"Lead-Free Connection Frequently Asked Questions," Lead-Free
Connection, vol. 1 no. 1, pp. 9-10, July 2004.
Biocca, Peter,
"Lead-Free Connection Frequently Asked Questions," Lead-Free
Connection, vol. 1 no. 2, pp. 11, Nov. 2004.
Biocca, Peter,
"Lead-free Defects in Reflow Soldering,", Feb. 15, 2005.
Biocca, Peter,
"Lead-Free Defects in Reflow Soldering - How to Prevent Them,"
emsnow, Feb. 17, 2005.
Biocca, Peter,
"Lead-free hand-soldering - ending the nightmares," emsnow,
Apr. 26, 2006.
Biocca, Peter,
"Lead-free Hand Soldering - Ending The Nightmares," Lead-Free
Connection, vol. 3 no. 1, pp. 2-4, May 2006.
Biocca, Peter,
"Lead-free Is Here. Where Are You?," SMT Web Exclusive Article.
Biocca, Peter,
"Lead-free is more than solder," Nov. 24, 2004.
Biocca, Peter,
"Lead-Free Reliability -- Building it Right the First Time,"
Lead-Free Connection, vol. 2 no. 2, pp. 2-5, June 2005.
Biocca, Peter,
"Lead-free reliability - building it right the first time," emsnow
, June 8, 2005.
Biocca, Peter,
"Lead-Free Rework Experiences Using SAC and Sn-Cu Based Alloys," SMTA
International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 825-829.
Biocca, Peter,
"Lead-free SMT - Considerations in Developing a Reliable Soldering Process,"
emsnow, Jan. 16, 2005.
Biocca, Peter,
"Lead-free SMT soldering defects - how to prevent them," Global SMT
& Packaging, vol. 4 no. 9, pp. 11-14, Oct. 2004.
Biocca, Peter,
"Lead-free SMT Soldering Defects -- How to Prevent Them," Lead-Free
Connection, vol. 2 no. 1, pp. 2-5, Jan. 2005.
Biocca, Peter,
"Lead-free SMT soldering defects - how to prevent them," Dataweek
, vol. xx no. xx, pp. xx-xx, Feb. 22, 2006.
Biocca, Peter,
"Lead-free soldering and RoHS implementation - Questions from the Frontline,
Part 2," emsnow, Nov. 22, 2005.
Biocca, Peter,
"Lead-Free Wave Soldering," Lead-Free Connection, vol. 1 no.
1, pp. 2-4, July 2004.
Biocca, Peter,
"Lead-free Wave Soldering - Some Insight on How to Develop a Process that
Works," emsnow, Apr. 5, 2005.
Biocca, Peter,
"Optimizing Lead-free Reflow Processes," Surface Mount Technology
(SMT), vol. 19 no. 2, pp. 76, 78, 80, Feb. 2005.
Biocca, Peter,
"Optimizing the Lead-free Reflow Process For Reliability and Defects
Reduction," Lead-Free Magazine, vol. 5, 2005.
Biocca, Peter,
"Preventing Lead-free Reflow Defects and Maintaining Process Yields,"
International Conference on Lead-free Soldering, Toronto, Ontario, May
16-18, 2006, pp. xx-xx.
Biocca, Peter,
"Preventing Lead-free SMT Soldering Defects," Surface Mount Technology
(SMT), vol. 28 no. 1, pp. 68-70,72,74-75, Jan. 2013.
Biocca, Peter,
"Reliable Lead-free Wave and SMT Processes," Advanced Packaging
, vol. 10 no. 8, pp. xx-xx, Aug. 2001.
Biocca, Peter,
"Reliable Lead-free Wave and SMT Processes," Lead-free Electronics
, Nov. 2004.
Biocca, Peter,
"Reliable lead-free wave and SMT processes," Dataweek, vol.
xx no. xx, pp. xx-xx, Feb. 22, 2006.
Biocca, Peter,
"SnCu Based Alloy Design for Lower Copper Dissolution and Better Process
Control," Lead-Free Magazine.
Biocca, Peter,
"Solder Material," Lead-Free Magazine.
Biocca, Peter,
"Solder Material," Lead-Free Magazine.
Biocca, Peter,
"Solder Paste," Lead-Free Magazine.
Biocca, Peter,
"Solder Paste," Lead-Free Magazine, vol. 3, Feb. 2005.
Biocca, Peter,
"Solder Safety and Disposal Management," Proceedings of the Technical
Program NEPCON West '94, Volume 2, Anaheim, CA, Feb. 27-Mar. 4, 1994,
pp. 867-873.
Biocca, Peter,
"STEP 3: Solder Materials," Surface Mount Technology (SMT),
vol. 21 no. 3, pp. 26-28, Mar. 2007.
Biocca, Peter,
"The turtle and the hare: beating the RoHS deadline anyway," Global
SMT and Packaging, vol. 6 no. 2, pp. 20-22, 24, 26, Feb. 2006.
Biocca, Peter, and Rivas, Carlos,
"The validation of SAC305 and SnCu-based solders at the contract assembler
level," Global SMT and Packaging, vol. 7 no. 2, pp. 10-12,
14, 16, Feb. 2007.
Biocca, Peter,
"Tin-copper based solder options for lead-free assembly," Global SMT
and Packaging, vol. 6 no. 10, pp. 23-25, Nov./Dec. 2006.
Biocca, Peter,
"Tin-Copper Based Solder Options for Lead-free Assembly," Lead-Free
Connection, vol. 4 no. 1, pp. 2-5, Feb. 2007.
Biocca, Peter,
"Worldwide Usage of Lead-free Solder Alloys for SMT," APEX 2000
, Long Beach, CA, Mar. 14-16, 2000, pp. P-MT2/1-1-P-MT2/1-3.
Birch, Bill, and Furlong, Jason,
"Materials Testing of PWB Substrates to Determine Survivability Through Lead
Free Assembly," SMTA International 2013 Conference Proceedings,
Fort Worth, TX, Oct. 13-17, 2013, pp. 431-448.
Birch, Bill,
"Reliability Testing of PWB Plated Through Holes Using Interconnect Stress
Testing Thermal Cycling Before and After Pb-Free Reflow Preconditioning,"
SMTA International 2013 Conference Proceedings, Fort Worth, TX,
Oct. 13-17, 2013, pp. 1032-1045.
Bird, Elliott J., Nelson, Kyle A., Harb, John N., and Wheeler, Dean R.,
"Investigation of additives for electroless plating of nanowires,"
Electrochimica Acta, vol. 70, pp. 69-75, May 30, 2012.
Bird, James "Mark", and Cannis, Jeff,
'Amkor Green/Pb Free Perspective," SAC Meeting, Dec. 2, 2003.
Bird, James "Mark",
"JEDEC Position on Environmentally Friendly Products," Dec. 2, 2003.
Bird, Mark,
"Changes to JEDEC's Moisture Sensitivity Classification for SMDs Likely Soon,"
Chip Scale Review, vol. xx no. xx, pp. xx-xx, July-Aug.
2000.
Bird, Mark,
"Marking, symbols and labels to identify lead-free assemblies, devices and
parts," Chip Scale Review, vol. xx no. xx, pp. xx-xx, July
2004.
Bird, Mark,
"MRT Reflow Conditions for Lead-Free Packages Challenge Standards Group,"
Chip Scale Review, vol. xx no. xx, pp. xx-xx, July 2003.
Bird, Mark,
"MRT Reflow Conditions for Lead-Free Packages Challenge Standards Group."
Bird, Mark,
"New Lead-Free Finishes Require Testing to Determine Best Reflow
Temperatures," Chip Scale Review, vol. xx no. xx, pp. xx-xx,
Nov.-Dec. 2001.
Bird, Mark,
"Testing Packages with Lead-Free Finishes? MRT Reflow Standard Is Finally
Revealed," Chip Scale Review, vol. xx no. xx, pp. xx-xx,
Nov.-Dec. 2002.
Birdsong, Barry, and Benninger, Glenn,
"Counterfeit Parts - Mission Impact," IPC Printed Circuits Expo, APEX
and the Designers Summit Proceedings 2008 Technical Conference, Las
Vegas, NV, Apr. 1-3, 2008, pp. FF-05.
Birkett, M.
"Tin Whisker Formation Test Report," TT electronics Welwyn Components,
Dec. 2006.
Birloaga, Ionela, De Michelis, Ida, Ferella, Francesco, Buzatu, Mihai, and
Veglio, Francesco,
"Study on the influence of various factors in the hydrometallurgical
processing of waste printed circuit boards for copper and gold recovery,"
Waste Management, vol. 33 no. 4, pp. 935-941, Apr. 2013.
Birzer, Christian, Rakow, Bernd, Steiner, Rainer, and Walter, Juergen,
"Drop Test Reliability Improvement of Lead-free Fine Pitch BGA Using Different
Solder Ball Composition," Proceedings of 7th Electronic Packaging
Technology Conference, Volume 1, Singapore, Dec. 7-9, 2005, pp.
255-261.
Birzer, Christian, Stoeckl, Stephan, Schuetz, Gerhard, and Fink, Markus,
"Reliability Investigations of Leadless QFN Packages until End-of-Life with
Application Specific Board Level Stress Tests," Proceedings 56th
Electronic Components & Technology Conference, San Diego, CA, May
30-June 2, 2006, pp. 594-600.
Bishop, B. M.,
"Nikalium Dentures Plated with Tin-Nickel," Tin and its Uses, no.
132, pp. 10-11, 1982.
Bishop, Craig V., and Wynn, Paul C.,
"Erratum: Replacing Hexavalent Chromium," Transactions of the Institute
of Metal Finishing, vol. 79 no. 3, pp. B34, May 2001.
Bishop, Craig V., and Loar, Gary,
"Multiple-step Alternatives to Chromate Passivation," 1999
Aerospace/Airline Plating & Metal Finishing Forum, Jacksonville,
FL, Apr. 20-22, 1999, pp. 107-111.
Bishop, Craig V., and Kochilla, John R.,
"Non-Hexavalent Chrome Passivation Technologies for Zinc and Zinc Alloys,"
Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29,
2000, pp. xx-xx.
Bishop, Ronald,
"Get the Lead Out: A Follow-Up by Bishop & Associates, Inc.," TTI.
Biswas, K., Qin, Y., DaSilva, M., Reifenberger, R., and Sands, T.,
"Electrical properties of individual gold nanowires arrayed in a porous anodic
alimina template," Physica Status Solidi. A, Applications and materials
science, vol. 204 no. 9, pp. 3152-3158, Sept. 2007.
Biswas, Kalyan, Liu, Shiguo, Zhang, Xiaowu, and Chai, T. C.,
"Thermo-mechanical Design of Large Die Fine Pitch Copper/Low-k FCBGA and
Lead-free Interconnections," International Conference on Electronic
Packaging Technology & High Density Packaging, Shanghai, China,
July 28-31, 2008, pp. xx-xx.
Biswas, Subhajit, Doherty, Jessica, Majumdar, Dipanwita, Ghoshal, Tandra,
Rahme, Kamil, Conroy, Michelle, Singha, Achintya, Morris, Michael A., and
Holmes, Justin D.,
"Diameter-Controlled Germanium Nanowires with Lamellar Twinning and
Polytypes," Chemistry of Materials, vol. 27 no. 9, pp. 3408-3416,
May 12, 2015.
Bitton, Franck,
"High Stakes: Reworking High-Precision, High-Reliability Boards,"
Circuits Assembly, vol. 15 no. 8, pp. 22-25, Aug. 2004.
Biunno, Nicholas,
"A Root Cause Failure Mechanism for Solder Joint Integrity of Electroless
Nickel / Immersion Gold Surface Finishes," IPC Printed Circuits Expo
1999, Long Beach, CA, Mar. 14-18, 1999, pp. S18-5-1-S18-5-8.
Biunno, Nicholas, and Barbetta, Michael,
"A Root Cause Failure Mechanism for Solder Joint Integrity of Electroless
Nickel/Immersion Gold Surface Finishes," 1999 SMTA International
Conference Proceedings, San Jose, CA, Sept. 12-16, 1999, pp. xx-xx.
Biunno, Nicholas, and Barbetta, Michael,
"A Root Cause Failure Mechanism for Solder Joint Integrity of Electroless
Nickel / Immersion Gold Surface Finishes," 2000 Surface Finishes Forum
Conference Proceedings, May 4, 2000, pp. xx-xx.
Bivins, Beth A., Juan, Alexia A., and Lee, Ning-Cheng,
"Cleaning of Lead Free Solder Paste Residues," SMARTgroup.
Bivins, Beth A., Juan, Alexia A., Starkweather, Byron, Lee, Ning-Cheng, and
Negi, Shailendra,
"Post Solder Cleaning of Lead Free Solder Paste Residues," 2000 SMTA
International Conference Proceedings, Chicago, IL, Sept. 24-28, 2000,
pp. xx-xx.
Bixenman, Mike,
"Cleaning," SMT Supplement, vol. 15 no. 7, pp. 30-34, July 1.
Bixenman, Mike,
"How Will Electronic Precision Cleaning be Impacted When Adopting Lead-free
Solder Technology," 2000 Lead Free Symposium Conference Proceedings
, 2000, pp. xx-xx.
Bixenman, Mike,
"Increased Interest in Cleaning Pb-Free Flux Residues," Circuitnet
, May 16, 2007.
Bixenman, Mike, Lee, Ning-Chen, and Stach, Steve,
"Ionic Cleanliness Testing Research of Printed Wiring Boards for Purposes of
Process Control," SMTA International Conference, San Diego, CA,
Oct. 4-8, 2009, pp. 690-703.
Bixenman, Mike, Ellis, Dirk, and Owens, Steve,
"Lead-Free Soldering: DOE Study to Understand its Affect on Electronic
Assembly Defluxing," Proceedings of the Technical Conference (CDROM)
IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004,
pp. S33-2-1-S33-2-6.
Bixenman, Mike,
"Matching the cleaning agent to the flux residue," Global SMT and
Packaging, vol. 10 no. 8, pp. 14,16-17, Aug. 2010.
Bixenman, Mike,
"Pb-free Cleaning Process Development," Circuitnet, Dec. 13,
2006.
Bixenman, Mike,
"Quantifying Cleaning Relevance When Manufacturing Lead-Free Printed Circuit
Board Assemblies," International Conference on Soldering and Reliability
, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.
Bixenman, Mike,
"Reliability and Cleaning Find an Important Correlation," Circuitnet
, Dec. 10, 2007.
Bixenman, Mike,
"Step-by-Step: Cleaning," Surface Mount Technology (SMT),
vol. 14 no. 9, pp. xx-xx, Sept. 2000.
Bixenman, Mike,
"Step-by-Step: Cleaning," Lead-free Electronics, vol. xx
no. xx, pp. xx-xx, Nov. 2004.
Bixenman, Mike, Miller, Erik, and Rueda, Fernando,
"Ten lessons learned in cleaning Pb-free flux residues," Global SMT
and Packaging, vol. 7 no. 1, pp. 10-11, 14-16, 18-19, Jan. 2007.
Bixenman, Mike, Miller, Erik, and Rueda, Fernando,
"Ten Lessons Learned in Cleaning Pb-Free Flux Residues," Lead-Free
Magazine.
Bixenman, Mike, and Stach, Steve,
"Validity of the IPC R.O.S.E. Method 2.3.25 Researched," Proceedings
2010 Technical Conference APEX EXPO, Las Vegas, NV, Apr. 6-9, 2010, pp.
S02_03-1-S02_03-9.
Bjerklie, Steve,
"A pox on hexavalent chromium," Metal Finishing, vol. 103 no. 3,
pp. 8-12, Mar. 2005.
Bjerklie, Steve,
"Looking for Mr. Good Chrome," Metal Finishing, vol. 105 no. 5,
pp. 21-23, May 2007.
Bjork, Mikael T., Schmid, Heinz, Breslin, Chris M., Gignac, Lynne, and Riel.
Heike,
"InAs nanowire growth on oxide-masked <111> silicon," Journal of Crystal
Growth, vol. 344 no. 1, pp. 31-37, Apr. 1, 2012.
Bjorklof, A.,
"Electroless Bumped Bare Dice on Flexible Substrates," Microelectronics
International, vol. 13 no. 2, pp. 40-52, 1996.
Bjorndahl, William D., Singleton, Leon, Griese, Richard, and Chong, Frank,
"Detection of Tin Plating and Tin Whisker Mitigation," 42nd Annual
Reliability Physics Symposium, Apr. 25-29, 2004, pp. 563-564.
Black, Harvey,
"Getting the Lead Out of Electronics," Environmental Health Perspectives
, vol 113 no. 10, pp. A682-A685, Oct. 2005.
Black, James R.,
"Electromigration Failure Modes in Aluminum Metallization for Semiconductor
Devices," Proceedings of the IEEE, vol. 57 no. 9, pp. 1587-1594,
Sept. 1969.
Blackshear, Edmund, Lombardi, Thomas, Pompeo, Frank, Audet, Jean, Kim,
KyungMooon, Jeong, YoungHyuk, Choi, JoonYoung, Lee, JoonYeob, Park, ChangWoo,
Kondo, Kyoji, Matsumoto, Shunichiro, and Miyazawa, Yoichi,
"Advanced Laminate Carrier Module Warpage Considerations for 32nm Pb-free, FC
PBGA Package Design and Assembly," 2011 IEEE 61st Electronic Components
and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011,
pp. 523-529.
Blair, A., Abys, J. A., and Fan, C.,
"Palladium-plated Lead Frames -- Current Technology for Electroplaters,"
Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998,
pp. 661-669.
Blair, Alan, Dullaghan, C. A., Stacy, B. F., and Kwok, Jimmy.
"An Economic Alternative to Decorative Palladium Plating - Palladium-Cobalt,"
Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24,
1999, pp. 765-770.
Blair, Alan,
"Analyze This...," Plating & Surface Finishing, vol. 87 no.
9, pp. 47, Sept. 2000.
Blair, Howard D., Pan, Tsung-Yu, Cooper, Ronald P., Nicholson, John M.,
Poulson, Russell H., Stine, Sandra C., Ezis, Katie, and Mitlin, David,
"Copper Dissolution in Molten Solders," Proceedings of the Technical
Program NEPCON West '94, Volume 1, Anaheim, CA, Feb. 27-Mar. 4, 1994,
pp. 543-555.
Blair, Howard D., Pan, Tsung-Yu, and Nicholson, John M.,
"Intermetallic Compound Growth on Ni, Au/Ni, and Pd/Ni Substrates with Sn/Pb,
Sn/Ag, and Sn Solders," 1998 Proceedings 48th Electronic Components
& Technology Conference, Seattle, WA, May 25-28, 1998, pp. 259-267.
Blair, Howard D., Pan, Tsung-Yu, Nicholson, John M., Cooper, Ronald P., Oh,
Sung-Won, and Farah, Ahmad R.,
"Manufacturing Concerns of the Electronic Industry Regarding Intermetallic
Compound Formation During the Soldering Stage," Nineteenth IEEE/CPMT
International Electronics Manufacturing Technology Symposium, Austin,
TX, Oct. 14-16, 1996, pp. 282-292.
Blake, N., and Smith, R. W.,
"Electron microscopy of grey tin," Journal of Materials Science Letters
, vol. 5 no. 1, pp. 103-104, Jan. 1986.
https://doi.org/10.1007/BF01671454
Blakely, J. M., and Jackson, K. A.,
"Growth of Crystal Whiskers," Journal of Chemical Physics, vol.
37 no. 2, pp. 428-430, July 15, 1962.
Blanche, J. F., and Strickland, S. M.,
"Lead-Free Experiment in a Space Environment," NASA/TM-2012-217463, July
2012.
Blanche, Jim, and Strickland, Mark,
"Working with Consortia - Advanced Packaging Reliability," 2010 NEPP
Electronics Technology Workshop, Greenbelt, MD, June 22, 2010, pp.
xx-xx.
Blass, D., Meilunas, M., and Borgesen, P.,
"On the Incorporation of Fine Pitch Lead Free CSPs in High Reliability SnPb
Based Microelectronics Assemblies," IEEE Transactions on Components,
Packaging and Manufacturing Technology, vol. 1 no. 1, pp. 92-99, Jan.
2011.
Blattau, N., Barker, D., and Hillman, C.,
"Lead Free Solder and Flex Cracking Failures in Ceramic Capacitors,"
24th Annual Capacitor and Resistor Technology Symposium, San
Antonio, TX, Mar. 29-Apr. 1, 2004, pp. 101-105.
Blattau, N., Hillman, C., Wiest, C., Wright, J., and Schatz, R.,
"Pb-Free Reflow Effect on Electrolytic Capacitors," Electronics World
, vol. 112 no. 1850, pp. 18-22, Feb. 2007.
Blattau, N., Wright, J., Schatz, R., and Hillman, C.,
"Robustness of Surface-Mount Aluminum Electrolytic Capacitors When Subjected
to Pb-free Reflow," Passive Component Industry, vol. x no. x,
pp. 6,8-11, Nov./Dec. 2005.
Blattau, Nathan, Arnold, Joelle, Fischer, Gerd, and Hillman, Craig,
"1st Order Failure Model for Area Array CSP Devices with Pb-Free Solder,"
2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24,
2008, pp. xx-xx.
Blattau, Nathan, and Hillman, Craig,
"A Comparison of the Isothermal Fatigue Behavior of Sn-Ag-Cu to Sn-Pb Solder,"
2005 SMTA International Conference Proceedings, Chicago, IL,
Sept. 25-29, 2005, pp. 884-890.
Blattau, Nathan, and Hillman, Craig,
"A Comparison of the Isothermal Fatigue Behavior of Sn-Ag-Cu to Sn-Pb Solder,"
IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim,
CA, Feb. 8-10, 2006, pp. S34-02-1-S34-02-15.
Blattau, Nathan, and Hillman, Craig,
"An Engelmaier Model for Leadless Ceramic Chip Devices with Lead Free Solder,"
IPC/JEDEC 12th International Conference on Lead Free Electronic
Components and Assemblies, Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.
Blattau, Nathan, and Hillman, Craig,
"An Engelmaier Model for Leadless Ceramic Chip Devices with Pb-FreeSolder,"
Journal of the Reliability Information Analysis Center, pp.
6-11, First Quarter 2007.
Blattau, Nathan, and Hillman, Craig,
"Design Guidelines for Ceramic Capacitors Attached with SAC Solder,"
IPC/APEX, Anaheim, California, Feb. 7-10, 2006, pp. xx-xx.
Blattau, Nathan, and Hillman, Craig,
"First Order Failure Model for Leadless Ceramic Chip Devices with Pb-Free
Solder," 2006 SMTA International Conference Proceedings,
Rosemont, IL, Sept. 24-28, 2006, pp. 148-153.
Blattau, Nathan, and Hillman, Craig,
"Has the Electronics Industry Missed the Boat on Pb-free? - Failures in
Ceramic Capacitors with Pb-free Solder Interconnects -," 5th
International Lead Free Conference on Electronic Components and Assemblies
, San Jose, CA, March 18-19, 2004, pp. xx-xx.
Blattau, Nathan, Priimak, Danko, Arnold, Joelle, and Hillman, Craig,
"Rapid Power Cycling of Pb-Free Soldered Components," 2006 SMTA
International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006,
pp. 913-916.
Blattau, Nathan, Gormally, Patrick, Iannaccone, Vin, Harvilchuck, Laurence,
and Hillman, Craig,
"Robustness of Surface Mount Multilayer Ceramic Capacitors Assembled with
Pb-Free Solder," 2006 CARTS Conference Proceedings, Orlando,
FL, Apr. 3-6, 2006, pp. xx-xx.
Blazek, Michele, and Koomey, Jonathan G.,
"Predicting Future Power Requirements for the IT Sector: Making the Case for
Including Life-Cycle Implications in Design of Servers," Proceedings of
the 2006 IEEE International Symposium on Electronics and the Environment
, San Francisco, CA, May 8-11, 2006, pp. 126-131.
Blech, I. A., and Meieran, E. S.,
"Electromigration in Thin Al Films," Journal of Applied Physics,
vol. 40 no. 2, pp. 485-491, Feb. 1969.
Blech, I. A., Petroff, P. M., Tai, K. L., and Kumar, V.,
"Whisker Growth in Al Thin Films," Journal of Crystal Growth,
vol. 32 no. 2, pp. 161-169, Feb. 1976.
Blekker, Kai, Munstermann, Benjamin, Matiss, Andreas, Do, Quoc Thai, Regolin,
Ingo, Brockerhoff, Wolfgang, Prost, Werner, and Tegude, Franz-Josef,
"High-Frequency Measurements on InAs Nanowire Field-Effect Transistors Using
Coplanar Waveguide Contacts," IEEE Transactions on Nanotechnology
, vol. 9 no. 4, pp. 432-437, July 2010.
Blekker, Kai, Richter, Rene, Oda, Ryosuke, Taniyama, Satoshi, Benner, Oliver,
Keller, Gregor, Munstermann, Benjamin, Lysov, Andrey, Regolin, Ingo, Waho,
Takao, and Prost, Werner,
"InAs Nanowire Circuits Fabricated by Field-Assisted Self-Assembly on a Host
Substrate," IEICE Transactions on Electronics, vol. E95.C no. 8,
pp. 1369-1375, 2012.
Bloem, J.,
"Nucleation and Growth of Silicon by CVD," Journal of Crystal Growth
, vol. 50 no. 3, pp. 581-604, Nov. 1980.
Bloembergen, N.,
"Nuclear Magnetic Relaxation in Semiconductors," Physica, vol. 20
no. 7-12, pp. 1130-1133, 1954.
https://doi.org/10.1016/S0031-8914(54)80253-9
Blomberg, Lars,
""The RoHS directive should be reconsidered!"," evertiq, Dec.
12, 2008.
Bloom, Terry, Lautzenhiser, Frans, and Rine, Mark,
"Plating to LTCC," 204th Meeting of the Electrochemical Society,
Orlando, FL, Oct. 12-15, 2003, pp. xx-xx.
Blouin, Glen,
"Is Canadian e-waste an environmental disaster in waiting?," canada.com,
Jan. 20, 2006.
Blowes, David,
"Tracking Hexavalent Cr in Groundwater," Science, vol. 295 no.
5562, pp. 2024-2025, Mar. 15, 2002.
Blum, A. I., and Goryunova, N. A.,
"(russian)," Doklady Akademii nauk SSSR, vol. 75 no. 3, pp.
367-370, 1950.
Blum, P. L., Pelissier, J., and Silvestre, G.,
"An Investigation of Soldered Copper-Tin Bond Brittleness by Electron
Microscopy," Solid State Technology, vol. 16 no. 3, pp. 55-58,
Mar. 1973.
Blum, Werner, Kullmann, Rainer, Wegner, Gerald L., and Kuhl, Reiner W.,
"Pure Tin: Differentiated View on the Risk of Whisker Formation," 23rd
Capacitor and Resistor Technology Symposium, Scottsdale, AZ, Mar.
31-Apr. 3, 2003, pp. 148-154.
Blustein, G, Amo, B del, and Romagnoli, R.,
"The influence of the solubility of zinc phosphate pigments on their
anticorrosive behaviour," Pigment and Resin Technology, vol. 29
no. 2, pp. 100-107, 2000.
Bo, Lai Zheng, Keat, Loh Wei, and Tamin, Mohd Nasir,
"Damage Mechanics of Solder/IMC Interface Fracture in Pb-Free Solder
Interconnects," 11th Electronics Packaging Technology Conference,
Singapore, Dec. 9-11, 2009, pp. 731-736.
Bo, Lai Zheng, Kamsah, Nazri, Keat, Loh Wei, and Tamin, Mohd Nasir,
"Mechanics of Sn-4Ag-0.5Cu Solder Joints in a Ball Grid Array Assembly during
Reflow and Temperature Cycles," 2008 33rd IEEE/CPMT International
Electronic Manufacturing Technology Symposium, Penang, Malaysia, Nov.
4-6, 2008, pp. xx-xx.
Boareto, J. C., Metasch, R., Roellig, M., Wendhausen, P. A. P., and Wolter, K.
J.,
"Influence of Indium on microstructure and creep properties of SnAg3.5InX
(X=0,2,4,8) solder alloys," 2010 3rd Electronic System-Integration
Technology Conference, Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.
Boareto, J. C., Rodrigues, G. V. S., Mastropietro, M. F., Wendhausen, P. A.
P., and Wolter, K. -J.,
"Introduction of Nanosized Al2O3 in Sn-Ag3,5 Solders by Mechanical Alloying,"
2010 3rd Electronic System-Integration Technology Conference,
Berlin, Germany, Sept. 13-16, 2010, pp. xx-xx.
Bobe, Alexander, Regener, Doris, Dietze, Gabriele, and Heyse, Hartmut,
"Veranderung Bleifreier Mikrolotkontakte bei Thermischer Beanspruchung
(Changes of Lead Free Solder Joints under Thermal Loading),"
Practical Metallography, vol. 44 no. 10, pp. 476-492, Oct. 2007.
Bobzin, K., Lugscheider, E., Zhuang, H., Ernst, F., Bagcivan, N., Maes,
M., Rosing, J., Ferrara, S., Erdle, A., and Kramer, A.,
"New soldering processes and solder systems for hybrid microsystems:
developments and applications," Microsystem Technologies,
vol. 12 no. 7, pp. 620-625, June 2006.
Bock, E. M.,
"Guidelines for the Successful Use of Tin Plate on Connector Contacts,"
Proceedings of The International Technical Conference of SUR/FIN,
Baltimore, MD, June 26-29, 1995, pp. 591-596.
Bock, Edward,
"Mateability of Tin to Gold, Palladium, and Silver," 1990 Proceedings
40th Electronic Components & Technology Conference, Las Vegas, NV,
May 20-23, 1990, pp. 840-844.
Bock, Geoff,
"TESTING, QUALITY & STANDARDS: Wake Up on Waste," Appliance Design
, vol. xx no. xx, pp. xx-xx, Feb. 1, 2005.
Bock, Geoff,
"Wake Up on Waste," Appliance Design, vol. 53 no. 2, pp. 36-37,
Feb. 2005.
Bock, Geoffrey,
"ASTM F40 Committee Addresses Standards on Declarable Substances in
Materials," TUV Rheinland World News, pp. 13-14, July/Aug.
2006.
Bock, Geoffrey,
"Back to the Future?," TUV Rheinland World News, pp. 4-5,
Nov./Dec. 2005.
Bock, Geoffrey,
"Committee F40 and the Need for Standards on Declarable Substances in
Materials," Standardization News, vol. 34 no. 7, pp. 23, July
2006.
Bock, Geoffrey,
"Don't qet locked out of Europe," Machine Design, vol. 77 no. 11,
pp. 96-98, June 2, 2005.
Bock, Geoffrey,
"Life Cycle Management of Products," TUV Rheinland World News
, pp. 6-8, Mar./Apr. 2005.
Bock, Geoffrey,
"Lock Out! Manufacturers Must Comply with New Environmental Directives or Miss
Out on the European Market," TUV Rheinland World News, pp.
6-8, Jan./Feb. 2005.
Bock, Geoffrey,
"Uncovering the New Waste Directives," TUV Rheinland World News
, pp. 10, Mar./Apr. 2004.
Bock, Geoff,
"Wake Up on Waste," Appliance Design, vol. xx no. x, pp.
xx-xx, Feb. 2006.
Bock, Geoffrey,
"WEEE/RoHS: Back to the Future? Looking Back to Protect Your Future,"
Manufacturing.net, Jan. 18, 2006.
Bock, Geoffrey,
"WEEE/RoHS Directives Self Declaration vs. Third Party Compliance,"
TUV Rheinland World News, pp. 3-4, Mar./Apr. 2006.
Bockmair, G.,
"Non-Chromate Surface Protection for Aircraft Maintenance," Advanced
Materials Research, vol. 38, pp. 7-13, 2008.
Bockmair, Georg, and Kranzeder, Katharina,
"Surface Protection for Aircraft Maintenance by Means of Zinc Rich Primers,"
Advanced Materials Research, vol. 138, pp. 41-46, 2010.
Bodger, B. E., McGrann, R. T. R., and Somerville, D. A.,
"The Evaluation of Tungsten Carbide Thermal Spray Coatings as Replacements for
Electrodeposited Chrome Plating on Aircraft Landing Gear," Plating &
Surface Finishing, vol. 84 no. 9, pp. 28-31, Sept. 1997.
Bodington, Juan Carlos, Eklin, Lauri, and Ojanen, Jari,
"Minimizing power and energy consumption in the Outokumpu UPCAST process,"
Wire Journal International, vol. 36 no. 9, pp. 82-85, Sept. 2003.
Bodiul, P. P., Gitsu, D. V., Dolma, V. A., Miglei, M. F., and Zegrya, G. G.,
"The Thermopower in Bismuth Whiskers," Physica Status Solidi (a),
vol. 53 no. 1, pp. 87-93, May 16, 1979.
Boehme, Mario, and Ensinger, Wolfgang,
"From Nanowheat to Nanograss: A Preparation Method to Achieve Free Standing
Nanostructures Having a High Length/Diameter Aspect Ratio," Advanced
Engineering Materials, vol. 13 no. 5, pp. 373-375, May 2011.
Boeschlin, Jean-Philippe, and Purschel, Marco,
"Automotive MOSFET Package for Lead Free Reflow Soldering Processes,"
IPC/Soldertec Global 3rd International Conference on Lead Free Electronics
, Barcelona, Spain, June 7-10, 2005, pp. xx-xx.
Boesenberg, Adam J., Anderson, Iver E., and Harringa, Joel L.,
"Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying
with Al," Journal of Electronic Materials, vol. 41 no. 7, pp.
1868-1881, July 2012.
Boettcher, Lars, Ostmann, Andreas, Manessis, Dionysios, Reichl, Herbert,
Whitmore, Mark, and Staddon, Michael,
"Development of 3D-Redistribution and Balling Technologies for Fabrication of
Vertical Power Devices," SMTA Journal, vol. 18 no. 1, pp. 27-35,
Jan. 2005.
Boettinger, W. J., Vaudin, M. D., Williams, M. E., Bendersjy, L. A., and
Wagner, W. R.,
"Electronic Backscattered Diffraction and Energy Dispersive X-Ray Spectroscopy
Study of the Phase NiSn4," Journal of Electronic Materials,
vol. 32 no. 6, pp. 511-515, June 2003.
Boettinger, W. J., Handwerker, C. A., Newbury, B., Pan, T. Y., and Nicholson,
J. M.,
"Mechanism of Fillet Lifting in Sn-Bi Alloys," Journal of Electronic
Materials, vol. 31 no. 5, pp. 545-550, May 2002.
Boettinger, W. J., Johnson, C. E., Bendersky, L. A., Moon, K.-W., Williams, M.
E., and Stafford, G. R.,
"Whisker and Hillock formation on Sn, Sn-Cu and Sn-Pb electrodeposits,"
Acta Materialia, vol. 53 no. 19, pp. 5033-5050, Nov. 2005.
Bogart, Matthew, and Brown, Harlan,
"Lead-Free Glass Formulations for Passive Component Termination,"
2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp.
xx-xx.
Bogert, Jim,
"X-ray fluorescence spectroscopy enables RoHS action-level analysis,"
Connector Specifier, vol. 23 no. 3, pp. 16-18, June-July 2007.
Boggs, David W.,
"Introducing the OSP Process as an Alternative to Hasl."
Bogatin, Eric,
"Lead-Free Is Coming," Semiconductor International, vol. 25, no.
4, pp. 42, Apr. 2002.
Bograchev, Daniil A., Volgin, Vladimir M., and Davydov, Alexey D.,
"Simulation of inhomogeneous pores filling in template electrodeposition of
ordered metal nanowire arrays," Electrochimica Acta, vol. 112,
pp. 279-286, Dec. 1, 2013.
Boguski, Robert,
"When Failure Analysis is a Matter of Interpretation," Printed Circuit
Design and Fab/ Circuits Assembly, vol. 31 no. 3, pp. 72-74, Mar. 2014.
Boguslavsky, I.,
"Materials Properties of Palladium Alloy Electrodeposits," Proceedings
of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. 491-497.
Boguslavsky, I., Abys, J. A., Straschil, H., Tsuruta, H., Maisano, J., and
Eckert, V.,
"New PdNi Plating Bath: Chemically Benign and Environmentally Friendly,"
Technical Conference Proceedings AESF SUR/FIN, Detroit, MI, June
23-26, 1997, pp. 363-368.
Boguslavsky, I., Abys, J. A., Kudrak, E. J., Williams, M. A., and Ong, T. C.,
"Pd-Ni-plated Lids for Frame-Lid Assemblies," Plating & Surface
Finishing, vol. 83 no. 2, pp. 72-77, Feb. 1996.
Boguslavsky, Irina,
"NEMI Sn Tin Whisker Project," JISSO/PROTEC Forum, Japan,
May 15-16, 2003.
Boguslavsky, Irina, Bush, Peter, Kam-Lum, Elsa, Kwoka, Mark, McCullen, Jack,
and Vo, Nick,
"NEMI Sn Tin Whisker Project."
Boguslavsky, Irina, and Williams, Maureen,
"NEMI Sn Whisker Modeling Group Part 1: Overview and Results,"
IPC/NEMI Meeting, New Orleans, LA, Nov. 7, 2002, pp. xx-xx.
Boguslavsky, Irina, and Bush, Peter,
"NEMI Tin Whisker Test Group Phase 2 DOE Results," IPC 2002,
New Orleans, LA, Nov. 7, 2002, pp. xx-xx.
Boguslavsky, Irina, Bush, Peter, Kam-Lum, Elsa, Kwoka, Mark, McCullen, Jack,
Spalding, Keithm Vo, Nick, and Williams, Maureen,
"NEMI Tin Whisker Test Method Standards," 2003 SMTA International
Conference Proceedings, Chicago, IL, Sept. 21-25, 2003, pp. 670-675.
Boguslavsky, Irina,
"NEMI Tin Whisker Test Project," SMTA International, Chicago,
IL, Sept. 25, 2003.
Boguslavsky, Irina, Straschil, H. K., Abys, J. A., Eckert, V. T., and Breck,
G. F.,
"Palladium Cobalt -- A New Finish for Electronic Applications,"
Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp.
xx-xx.
Boguslavsky, Irina,
"Recrystallization Principles Applied to Whisker Growth in Tin."
IPC SMEMA Council APEX 2003, Anaheim, CA, Mar. 31-Apr. 2, 2003, pp.
S12-4-1 to S12-4-10.
"Whiskers: Truth and Mystery," IPC/NEMI Symposium on Lead-Free
Electronics, Montreal, Canada, Sept. 19, 2002, pp. xx-xx.
Bohm, J., Volkert, C. A., Monig, R., Balk, T. J., and Arzt, E.,
"Electromigration-Induced Damage in Bamboo Al Interconnects," Journal of
Electronic Materials, vol. 31 no. 1, pp. 45-49, Jan. 2002.
Bohm, Johannes, Wolter, Klaus-Juergen, and Heuer, Henning,
"Solder Joint Inspection with Induction Thermography," 2014 IEEE 64th
Electronic Components and Technology Conference, Orlando, FL, May
27-30, 2014, pp. 1509-1516.
Bohme, Bjorn, Rollig, Mike, Wiese, Steffen, and Wolter, Klaus-Jurgen,
"Lifetime Modeling based on an Advanced Test Chip Configuration for Lead-free
Solder Joints," 29th International Spring Seminar on Electronics
Technology, St. Marienthal, Germany, May 10-14, 2006, pp. 26-31.
Bohme, Thomas, and Muller, Wolfgang H.,
"Theoretical and experimental investigations of microstructural changes in
lead-free solders," Computational Materials Science, vol. 43 no.
1, pp. 221-228, July 2008.
Bohnenkamp, Ulrich,
"Produkt-und Prozessengineering fur Elecktronische Baugruppen,"
IPC/JEDEC 7th International Conference on Lead Free Electronic Components and
Assemblies, Frankfurt, Germany, Oct. 20-22, 2004.
Bohr, Philipp,
"Policy Tools for Electronics Recycling: Characteristics of a specific
certificate market design," Proceedings of the 2006 IEEE International
Symposium on Electronics and the Environment, San Francisco, CA, May
8-11, 2006, pp. 132-137.
Boian, Jeffrey,
"A strategy for implementing RoHS-compliant materials in engineering
functions," Green SupplyLine, Dec. 15, 2006.
Boian, Jeffrey,
"Recommending a Strategy for Implemeting RoHS Compliant Materials in
Engineering Functions," Successful Lead-Free/RoHS Strategies Conference
, Boxborough, MA, June 20-21, 2007, pp. xx-xx.
Boisvert, Michelle M.,
"A Closer Look at Lead-free Solder," Surface Mount Technology (SMT)
, Nov. 15, 2005.
Boisvert, Michelle M.,
"From the Editor," SMT Web Exclusive Article.
Boisvert, Michelle M.,
"Lead-Free: The Directives Draw Near," Surface Mount Technology
, vol. 19 no. 8, pp. xx-xx, Aug. 2005.
Boisvert, Michelle M.,
"PB-free: How Close Are You?," Surface Mount Technology (SMT)
, vol. 18 no. 12, pp. 4, Dec. 2004.
Boisvert, Michelle M.,
"Standardizing Material Declarations Globally," Surface Mount
Technology (SMT), vol. 20 no. 4, pp. xx-xx, Apr. 2006.
Boisvert, Michelle M.,
"Tin Whisker Standards Help Alleviate Risk," Surface Mount
Technology (SMT), vol. 20 no. 6, pp. 12, June 2006.
Boisvert, Michelle,
"WEEE, RoHS, and a Trail of Breadcrumbs," SMT Web Exclusive Article.
Bojarski, Zbigniew, and Surowiec, Marian,
"Morphology and Dislocation Structure of Iron Whiskers," Journal of
Crystal Growth, vol. 46 no. 1, pp. 43-50, Jan. 1979.
Bokalo, Peter, Shahbazi, Samson, and Sims, Theresa D.,
"A Case Study of Lead Free Thick Film Conductors with Lead Free Solder
Alloys," Proceedings 2003 International Symposium on Microelectronics
(Proceedings of SPIE - The International Society for Optical Engineering,
Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 71-76.
Bokhout, H., and van Lent, P. H.,
"Electric properties of gray tin single crystals grown in tin-mercury alloys,"
Journal of Physics and Chemistry of Solids, vol. 24 no. 5, pp.
704-706, May 1963.
Boks, C., and Stevels, A.,
"Essential perspectives for design for environment. Experiences from the
electronics industry," International Journal of Production Research
, vol. 45 no. 18-19, pp. 4021-4039, Sept. 2007.
Boks, Casper, and Stevels, Ab,
"Maturing markets for recycled plastics from WEEE: An elaboration on the
consequences for the evaluation of future end-of-life scenarios," Second
International Symposium on Environmentally Conscious Design and Inverse
Manufacturing, Tokyo, Japan, Dec. 11-15, 2001, pp. 520-526.
Boles, Steven T., Thompson, Carl V., and Fitzgerald, Eugene A.,
"Influence of indium and phosphine on Au-catalyzed InP nanowire growth on Si
substrates," Journal of Crystal Growth, vol. 311 no. 5, pp.
1446-1450, Feb. 15, 2009.
Bolger, Justin C., Reynolds, Mark, and Popielarczyk, Jeff,
"Area Bonding Conductive (ABC) Adhesives for Flex Circuit Connection to
LTCC/MCM Substrates," 1995 Proceedings 45th Electronic Components &
Technology Conference, Las Vegas, NV, May 21-24, 1995, pp. 529-533.
Bolger, Justin C., and Gilleo, Ken,
"Area Bonding Conductive Epoxy Adhesive Preforms for Grid Array and MCM
Substrate Attach," Proceedings of the 1994 IEEE Multi-Chip Module
Conference, Mar. 15-17, 1994, pp. 77-82.
Bolger, Justin C., and Czarnowski, John M.,
"Area Bonding Conductive Epoxy Adhesives for Low Cost Grid Array Chip
Carriers," Seventeenth IEEE/CPMT International Electronics Manufacturing
Technology Symposium, Austin, TX, Oct. 2-4, 1995, pp. 422-427.
Bolger, Justin C., Sylva, John M., and McGovern, James F.,
"Conductive Epoxy Adhesives to Replace Solder," Surface Mount Technology
(SMT), vol. 6 no. 2, pp. 66,68,70, Feb. 1992.
Bolger, Justin C., McGovern, James F., and Sylva, John M.,
"Conductive Epoxy Surface Mount Adhesives for Solder Replacement."
Proceedings of the Technical Program NEPCON West '91, Volume III,
Anaheim, CA, Feb. 24-28, 1991, pp. 1955-1962.
Bolger, Michael, and Carrington, Clark,
"Methylmercury Hazards and Risks - What is the Question?," Proceedings
of the 31st Intersociety Energy Conversion Engineering Conference, Volume 4
, Washington, D.C., Aug. 11-16, 1996, pp. 2330-2334.
Bolin, Dick, and Bosze, Wayne,
"RoHS and Tin Whisker Issues for Resistive Components," Proceedings
of the 25th Symposium for Passive Components, Palm Springs, CA, Mar.
21-24, 2005, pp. 102-107.
Bolinger, Nancy J.,
"BFR and PVC Phase Out," Intel Halogen Free Symposium,
Scottsdale, AZ, Jan. 15-16, 2008, pp. xx-xx.
Bolshakova, I., Kost, Ya., Makido, O., and Shurygin, F.,
"Mathematical simulation, synthesis, characterization and application of
indium arsenide whiskers," Journal of Crystal Growth, vol. 310
no. 7-9, pp. 2254-2259, Apr. 2008.
Bonafede, Salvatore, Huffman, Alan, and Palmer, W. Devereux,
"Layer Structure and Thickness Effects on Electroplated AuSn Solder Bump
Composition," IEEE Transactions on Components and Packaging Technologies
, vol. 29 no. 3, pp. 604-609, Sept. 2006.
Bondarenko, V. A.,
"Electrodeposition of Whiskers and Thread-Like Crystals," Electrochimica
Acta, vol. 29 no. Issue 7, pp. 887-891, July 1984.
https://doi.org/10.1016/0013-4686(84)87132-7
Bonnaud, E. L., and Gudmundson, P.,
"Influence of Component Position on Lead-Free Solder Interconnections during
Drop Test," Proceedings of 7th Electronic Packaging Technology
Conference, Volume 1, Singapore, Dec. 7-9, 2005, pp. 54-57.
Bonnaud, E. L., and Gudmundson, P.,
"Lead-Free Solder Cyclic Plasticity Characterization for Drop Test
Simulations," 7th International Conference on Thermal, Mechanical and
Multi-Physics Simulation and Experiments in Micro-Electronics and
Micro-Systems, Como, Italy, Apr. 24-26, 2006, pp. xx-xx.
Bonnaud, Etienne L.,
"Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test
Simulations," Journal of Electronic Packaging, vol. 133 no. 4,
pp. 041013-1-041013-9, Dec. 2011.
Bonner, J. K. "Kirk", Castillo, L. Del, and Mehta, A.,
"Choosing the Right Lead-free Solder for Hi-rel Printed Wiring Assemblies,"
48th International SAMPE Symposium and Exposition, Long
Beach, CA, May 11-15, 2003, pp. 483-491.
Bonner, J. K. "Kirk", Castillo, L. del, and Mehta, A.,
"Hi-rel lead-free printed wiring assemblies," SMTA International
Conference Proceedings, Chicago, IL, Sept. 22-26, 2002, pp. xx-xx.
Bonner, J. K. "Kirk", Castillo, L. Del, and Mehta, A.,
"Issues concering the replacement of lead in Hi-Rel electronic applications,"
Industrial-Ecology UC-Discovery Grant Research Symposium:
Electronic Design, Manufacturing, and the Environment, Apr. 3-4, 2003.
Bonoli, Alessandra, Goldoni, Silvia, and Guerra, Galliano,
"Analysis of WEEE treatment methodologies within the Meaning of Directive
2002/96/EC of the European Parliament," REWAS'04 - Global Symposium on
Recycling, Waste Treatment and Clean Technology, Volume III, Madrid,
Spain, Sept. 26-29, 2004, pp. 2873-2874.
Bonyar, Attila, Hurtony, Tamas, and David, Szabolcs,
"Investigation of the oxidation process at the copper-solder interface with
atomic force microscopy," 2012 IEEE 18th International Symposium for
Design and Technology in Electronic Packaging, Alba Iulia, Romania,
Oct. 25-28, 2012, pp. 317-320.
Bonyar, Attila, Hurtony, Tamas, and Harsanyi, Gabor,
"Selective Electrochemical Etching for the Investigation of Solder Joint
Microstructures," 2012 35th International Spring Seminar on Electronics
Technology, Bad Aussee, Austria, May 9-13, 2012, pp. 89-94.
Booker, Chrisopher,
"Is this the craziest EU law of all?," Nov. 6, 2006.
Boon, Jane E., Isaacs, Jacqueline A., and Gupta, Surendra M.,
"Economic Sensitivity for End of Life Planning and Processing of Personal
Computers," Journal of Electronics Manufacturing, vol. 11 no. 1,
pp. 81-93, Mar. 2002.
Boone, LeRoy, Campbell, Gerard P., and Palacio, Lourdes C.,
"Lead-free Wave Solder Alloy Selection: Reliability Is Key," Surface
Mount Technology (SMT), vol. 19 no. 9, pp. xx-xx, Sept. 2005.
Bootsma, G. A., and Gassen, H. J.,
"A Quantitative Study on the Growth of Silicon Whiskers from Silane and
Germanium Whiskers from Germane," Journal of Crystal Growth, vol.
10 no. 3, pp. 223-234, Aug. 1971.
Bora, Mumtaz Y.,
"Lead Free Assembly Qualification of Stacked MicroVia Boards," IPC
Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb.
8-10, 2006, pp. S12-02-1-S12-02-6.
Borg, B. Mattias, Johansson, Jonas, Storm, Kristian, and Deppert, Knut,
"Geometric model for metalorganic vapour phase epitaxy of dense nanowire
arrays," Journal of Crystal Growth, vol. 366, pp. 15-19, Mar. 1,
2013.
Borgesen, P., Wentlent, L., Alghoul, T., Joshi, S., Sivasubramony, R., Yadav,
M., Thekkut, S., Cuevas, J. L. Then, Alvarez, L. E., and Greene, C.,
"A Mechanistic Model for the Life of Solder Joints under Realistic Long-Term
Service Conditions," 2018 19th International Conference on Thermal,
Mechanical and Multi-Physics Simulation and Experiments in Microelectronics
and Microsystems, Toulouse, France, Apr. 15-18, 2018, pp. xx-xx.
Borgesen, P., Yang, L., Qasaimeh, A., Yin, L., and Anselm, M.,
"A Mechanistically Justified Model for Life of SnAgCu Solder Joints in Thermal
Cycling," 18th Annual Pan Pacific Microelectronics Symposium,
Wailea-Makena, HI, Jan. 22-24, 2013, pp. xx-xx.
Borgesen, P., Blass, D., and Meilunas, M.,
"Effects of Corner/Edge Bonding and Underfill Properties on the Thermal
Cycling Performance of Lead Free Ball Grid Array Assemblies," Journal of
Electronic Packaging, vol. 134 no. 1, pp. 011010-1-011010-8, Mar. 2012.
Borgesen, P., Hamasha, S., Wentlent, L., Watson, D., and Greene, C.,
"Interpreting Accelerated Test Results for Lead Free Solder Joints," Pan
Pacific Symposium 2016 Proceedings, Waimea, HI, Jan. 25-28, 2016, pp.
xx-xx.
Borgesen, P., Cotts, E., and Dutta, I.,
"Microstructurally Adaptive Constitutive Relations and Reliability Assessment
Protocols for Lead Free Solder," Conference Proceedings of SMTA
International, Rosemont, IL, Sept. 28-Oct. 2, 2014, pp. 536-546.
Borgesen, P., Hamasha, S., Obaidat, M., Raghavan, V., Dai, X., Meilunas, M.,
and Anselm, M.,
"Solder joint reliability under realistic service conditions,"
Microelectronics Reliability, vol. 53 no. 9-11 pp. 1587-1591,
Sept.-Nov. 2013.
Borgesen, P., Jiang, J., Sivasubramony, R., Alvarez, L. E., Alghoul, T.,
Greene, C., Wentlent, L., and Meilunas, M.,
"Thermal Cycling - It Doesn't Have to be a Waste of Time and Money,"
SMTA International 2017 Proceedings, Rosemont, IL, Sept. 17-21, 2017,
pp. 370-378.
Borgesen, Peter, Wentlent, Luke, Hamasha, Sa'd, Khasawneh, Saif, Shirazi, Sam,
Schmitz, Debora, Alghoul, Thaer, Greene, Chris, and Yin, Liang,
"A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints," Journal
of Electronic Materials, vol. 47 no. 5, pp. 2526-2544, May 2018.
Borgesen, Peter, Yin, Liang, and Kondos, Pericles,
"Acceleration of the growth of Cu3Sn voids in solder joints,"
Microelectronics Reliability, vol. 52 no. 6, pp. 1121-1127, June 2012.
Borgesen, Peter, Yin, Liang, and Kondos, Pericles,
"Assessing the risk of "Kirkendall voiding" in Cu3Sn," Microelectronics
Reliability, vol. 51 no. 4, pp. 837-846, Apr. 2011.
Borgesen, Peter,
"Assessment of Microelectronics Interconnect Reliability - Current Practice
and Trends," 2014 15th International Conference on Thermal, Mechanical
and Multi-Physics Simulation and Experiments in Microelectronics and
Microsystems, Ghent, Belgium, Apr. 7-9, 2014, pp. xx-xx.
Borgesen, Peter, Yang, Linlin, Qasaimeh, Awni, Arfaei, Babak, Yin, Liang,
Roggeman, Brian, and Meilunas, Michael,
"Damage Accumulation In Pb-Free Solder Joints For Complex Loading Histories,"
2011 Pan Pacific Microelectronics Symposium & Tabletop Exhibition
, Kamuela, HI, Jan. 18-20, 2011, pp. xx-xx.
Borgesen, Peter, Dutta, Indranath, Meschter, Stephan, and Osterman, Michael,
"DoD Lead-free Electronics Risk Mitigation: Lead-free Solder Basics for
Systems Engineers," Tin Whisker Group teleconference, Mar. 29, 2017.
Borgesen, Peter, Al-Momani, Emad, and Meilunas, Michael,
"Effect of Dwell Time on the Life of Lead Free BGA Joints in Thermal Cycling,"
SMTA International Conference, San Diego, CA, Oct. 4-8, 2009, pp.
377-383.
Borgesen, Peter, and Meilunas, Michael,
"Effects of Solder Paste Volume and Reflow Profiles on the Thermal Cycling
Performance of Mixed SnAgCu/SnPb Solder Joints," IEEE Transactions on
Components, Packaging and Manufacturing Technology, vol. 1 no. 8, pp.
1205-1213, Aug. 2011.
Borgeson, Peter,
"Ensuring Quality in Implantable Electronics," Assembly, vol.
xx no. xx, pp. xx-xx, Feb. 7, 2006.
Borgesen, Peter, and Henderson, Donald W.,
"Fragility of Pb-free Solder Joints," Universal Instruments, Nov. 8, 2004.
Borgesen, Peter, and Cotts, Eric,
"Implantable Medical Electronics Assembly Quality and Reliability
Considerations," Journal of SMT, vol. 17 no. 3, pp. 25-33, July
2004.
Borgesen, Peter, and Cotts, Eric,
"Implatable Medical Electronics Assembly - Quality and Reliability
Considerations," Universal Instruments.
Borgesen, Peter, Yin, Liang, Kondos, Pericles A., Roggeman, Brian, Cotts,
Eric, Tumne, Pushkraj, Li, Jing, and Srihari, Krishnaswami,
"Interconnect Reliability in Medical Microelectronics Applications,"
2008 Medical Electronics Symposium, Anaheim, CA, Jan. 29-31, 2008, pp.
xx-xx.
Borgesen, Peter,
"Lead-Free Solder Joint Reliability Oxymoron? (I like it, but ...)," Tin
Whisker Group teleconference, Feb. 25, 2009.
Borgesen, Peter, Bieler, Thomas, Lehman, L. P., and Cotts, E. J.,
"Pb-Free Solder: New Materials Considerations for Microelectronics
Processing," MRS Bulletin, vol. 32 no. 4, pp. 360-365, Apr. 2007.
Borgesen, Peter, and Sykes, Bob,
"Predicting Brittle Fracture Failures," Surface Mount Technology
, vol. 19 no. 10, pp. xx-xx, Oct. 2005.
Borgesen, Peter, and Sykes, Bob,
"Predicting Brittle Fracture Failures," Advanced Packaging,
vol. 14 no. 10, pp. 30-31, Oct. 2005.
Borgesen, Peter, Yin, Liang, Kondos, Pericles, Henderson, Donald W., Servis,
Greg, Therriault, Joseph, Wang, Ju, and Srihari, K.,
"Sporadic Degradation in Board Level Drop Reliability - Those Aren't All
Kirkendall Voids!," 2007 Proceedings 57th Electronic Components &
Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 136-146.
Borgesen, Peter, and Schnabl, Karl,
"Unique Behavior and Properties of Cu Pillar and Micro Bump Solder Joints,"
flipchips.com Tutorial 124, Oct. 2013.
Borgne, Brice Le, Salaun, Anne-Claire, and Pichon, Laurent,
"Electrical properties of self-aligned gate-all-around polycrystalline silicon
nanowires field-effect transistors," Microelectronic Engineering,
vol. 150, pp. 32-38, Jan. 25, 2016.
Borgstrom, M., Deppert, K., Samuelson, L., and Seifert, W.,
"Size- and shape-controlled GaAs nano-whiskers grown by MOVPE: a growth
study," Journal of Crystal Growth, vol. 260 no. 1-2, pp. 18-22,
Jan. 2, 2004.
Borkes, Tom, and McDonough, Pat,
"The Economical Development of a Lead-Free Assembly Process: A Practical Case
Study that Minimized Conversion and Operational Costs," SMTA
International Conference, Orlando, FL, Oct. 7-11, 2007, pp. 798-805.
Borle, W. N., Jayakumar, V., Sharda, G. D., Bal, M., and Seth, G. L.,
"On the Growth of Silicon Crystals in an Internal Work Coil Type Float Zoner,"
Journal of Crystal Growth, vol. 19 no. 4, pp. 359-360, July 1973.
Bornemann, Alfred,
""Tin Disease" in Solder Type Alloys," Symposium on Solder (ASTM Special
Technical Publication No. 189), Atlantic City, NJ, June 19-20, 1956,
pp. 129-148.
Borra, Vamsi, Georgiev, Daniel G., and Karpov, Victor G.,
"Cultivating Metal Whiskers by Surface Plasmon Polariton Excitation,"
MRS Advances, vol. 1 no. 12, pp. 805-810, Feb. 2016.
https://doi.org/10.1557/adv.2016.160
Borra, Vamsi, Oudat, Osama, Georgiev, Daniel G., Karpov, Victor G., and
Shvydka, Diana,
"Metal whisker growth induced by localized, high-intensity DC electric
fields," MRS Advances, vol. 3 no. 57-58, pp. 3367-3372, Nov.
2018.
DOI: https://doi.org/10.1557/adv.2018.374
Borra, Vamsi, Georgiev, Daniel G., Karpov, V. G., and Shvydka, Diana,
"Microscopic Structure of Metal Whiskers," Physical Review Applied
, vol. 9 no. 5, pp. 054029-1-054029-9, May 2018.
Borra, Vamsi, and Georgiev, Daniel G.,
"Part - 1: Whisker characterization," Tin Whisker Group teleconference,
October 11, 2017.
Borra, Vamsi, and Georgiev, Daniel G.,
"Part - 2: Whisker characterization," Tin Whisker Group teleconference,
October 18, 2017.
Borra, Vamsi, Itapu, Srikanth, and Georgiev, Daniel G.,
"Sn whisker growth mitigation by using NiO sublayers," Journal of
Physics D: Applied Physics, vol. 50 no. 47, pp. 475309-1-475309-7, Nov.
29, 2017.
Borras, Ana, Macias-Montero, Manuel, Romero-Gomez, Pablo, and
Gonzalez-Elipe, Agustin R.,
"Supported plasma-made 1D heterostructures: perspectives and applications,"
Journal of Physics D: Applied Physics, vol. 44 no. 17, pp.
174016-1-174016-9, May 4, 2011.
Borras, Mario, Ratchev, Roumen, Lanier, Olivier, Guyenot, Michael, and
Coutellier, Daniel,
"Vibration Reliability of SMD Pb-free Solder Joints," 2010 11th
International Conference on Thermal, Mechanical & Multi-Physics
Simulation, and Experiments in Microelectronics and Microsystems,
Bordeaux, France, Apr. 26-28, 2010, pp. xx-xx.
Borruso, Marty,
"Finishers' Think Tank," Plating & Surface Finishing, vol. 79
no. 7, pp. 34-35, July 1992.
Borruso, Marty,
"Finishers' Think Tank," Plating & Surface Finishing, vol.
81 no. 1, pp. 34-35, Jan. 1994.
Borruso, Marty,
"Finishers' Think Tank," Plating & Surface Finishing, vol.
81 no. 4, pp. 55-56, Apr. 1994.
Borruso, Marty,
"Finisher's Think Tank," Plating & Surface Finishing, vol.
82 no. 5, pp. 122-123, May 1995.
Borruso, Marty,
"Finishers' Think Tank," Plating & Surface Finishing, vol.
82 no. 11, pp. 41-42, Nov. 1995.
Borusso, Marty,
"Finishers' Think Tank," Plating & Surface Finishing, vol. 83
no. 2, pp. 49, Feb. 1996.
Borusso, Marty,
"Finishers' Think Tank," Plating & Surface Finishing, vol. 83
no. 6, pp. 40-41, June 1996.
Borusso, Marty,
"Finishers' Think Tank," Plating & Surface Finishing, vol. 83
no. 7, pp. 30-31, July 1996.
Borruso, Marty,
"Finishers' Think Tank," Plating & Surface Finishing, vol. 84
no. 4, pp. 40, Apr. 1997.
Borthakur, Anwesha, and Singh, Pardeep,
"Researches on informal E-waste recycling sector: It's time for a "Lab to
Land" approach," Journal of Hazardous Materials, vol. 323 pp.
730-732, Feb. 2017.
Borzone, G., Parodi, N., Cacciamani, G., and Watson, A.,
"Phase equilibria in the Au-In-Sn ternary system," Calphad: Computer
Coupling of Phase Diagrams and Thermochemistry, vol. 33 no. 1, pp.
17-22, Mar. 2009.
Bosco, N. S., and Zok, F. W.,
"Critical interlayer thickness for transient liquid phase bonding in the Cu-Sn
system," Acta Materialia, vol. 52 no. 10, pp. 2965-2972, June 7,
2004.
Bosco, Nick, Silverman, Timothy J., and Kurtz, Sarah,
"Climate specific thermomechanical fatigue of flat plate photovoltaic module
solder joints," Microelectronics Reliability, vol. 62, pp.
124-129, July 2016.
Botelho, Anabela, Dias, Marta Ferreira, Ferreira, Carla, and Pinto, Ligia M.
Costa,
"The market of electrical and electronic equipment waste in Portugal: Analysis
of take-back consumers' decisions," Waste Management and Research
, vol. 34 no. 10, pp. 1074-1080, Oct. 2016.
Botsford, Krista,
"China RoHS vs. EU RoHS," EMasia, Oct. 2007.
Botsford, Krista,
"China RoHS vs. EU RoHS Myths & Misconceptions," Successful
Lead-Free/RoHS Strategies Conference, Boxborough, MA, June 20-21, 2007,
pp. xx-xx.
Botsford, Krista,
"Data Storage System Design: Best Practices for Industry (Focusing on
RoHS-Type Legislation)," Pan Pacific Microelectronics Symposium,
Mauna Kea, HI, Feb. 10-12, 2009, pp. 88-91.
Botsford, Krista,
"Eco-compliance: What, When, & Why: Focusing on European Union and China,"
Pan Pacific Microelectronics Symposium, Mauna Kea, HI, Feb.
10-12, 2009, pp. 1-5.
Botsford, Krista,
"Environmental Compliance Documentation," Successful Lead-Free/RoHS
Strategies Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.
Botsford, Krista,
"Environmental Compliance Documentation: More than Materials Declaration,"
Successful Lead-Free/RoHS Strategies Conference, Boxborough, MA,
June 20-21, 2007, pp. xx-xx.
Botsford, Krista,
"EU RoHS Recast: Are you ready?," 2010 IEEE Symposium on Product
Compliance Engineering, Boston, MA, Oct. 18-20, 2010, pp. xx-xx.
Botsford, Krista,
"EU RoHS Recast: Are you ready?," SMTA International 2010 Conference
(Presentations), Orlando, FL, Oct. 24-28, 2010.
Botsford, Krista,
"EU RoHS Recast: Is your company ready, Are your products ready," 2010
IEEE Symposium on Product Compliance Engineering, Boston, MA, Oct.
18-20, 2010, pp. xx-xx.
Botsford, Krista,
"EU RoHS vs. China RoHS," Successful Lead-Free/RoHS Strategies
Conference, Boxborough, MA, June 20-21, 2007, pp. xx-xx.
Botsford, Krista,
"EU RoHS VS. CHINA RoHS," IPC Printed Circuits Expo, APEX and the
Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV,
Apr. 1-3, 2008, pp. S09:02.
Botsford, Krista,
""It keeps going and going and going..."," IN Compliance Magazine
2010 Annual Guide, pp. 106,108-10, 2010.
Botsford, Krista,
"Medical Devices and Eco-Compliance: A Proactive Approach," 2008 Medical
Electronics Symposium, Anaheim, CA, Jan. 29-31, 2008, pp. xx-xx.
Botsford, Krista,
"Preparing for Product Environmental Compliance: A Method for the Madness,"
2010 IEEE Symposium on Product Compliance Engineering, Boston,
MA, Oct. 18-20, 2010, pp. xx-xx.
Botsford, Krista,
"RoHS compliance: Four misconceptions that could cripple your company,"
EMasia, May 2007.
Botsford, Krista,
"RoHS Documentation: More than Materials Declaration," IPC/JEDEC 12th
International Conference on Lead Free Electronic Components and Assemblies
, Santa Clara, CA, Mar. 7-9, 2006, pp. xx-xx.
Botsford, Krista,
"RoHS Recast - Are you ready?," Medical Electronics Symposium 2010
Proceedings, Tempe, AZ, Sept. 22-23, 2010, pp. xx-xx.
Botsford, Krista,
"RoHS Update: Exemptions Expiring, Recast Vote Delayed," IN
Compliance Magazine, pp. 5, Nov. 2010.
Botsford, Krista,
"Using Materials Declaration to Meet Future Product-based Environmental
Reporting Requirements," IPC Review, vol. 48 no. 8, pp. 7,9,
Sept. 2007.
Botwin, Brad,
"Counterfeits and the U.S. Industrial Base," 2009 IPC Printed Circuits
Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar.
31-Apr. 2, 2009, pp. xx-xx.
Bouarroudj, Mounira, Khatir, Zoubir, Ousten, Jean-Pierre, and Lefebvre,
Stephane,
"Temperature-Level Effect on Solder Lifetime During Thermal Cycling of Power
Modules," IEEE Transactions on Device and Materials Reliability,
vol. 8 no. 3, pp. 471-477, Sept. 2008.
Boukhicha, Rym, Vincent, Laetitia, Renard, Charles, Gardes, Cyrille, Yam, Vy,
Fossard, Frederic, Patriarche, Gilles, Jabeen, Fauzia, and Bouchier, Daniel,
"Gold nanocluster distribution on faceted and kinked Si nanowires," Thin
Solid Films, vol. 520 no. 8, pp. 3304-3308, Feb. 1, 2012.
Boulanger, J. P., and LaPierre, R. R.,
"Unveiling transient GaAs/GaP nanowire growth behavior using group V
oscillations," Journal of Crystal Growth, vol. 388, pp. 116-123,
Feb. 15, 2014.
Boulanger, Jonathan P., and LaPierre, Ray R.,
"Polytype formation in GaAs/GaP axial nanowire heterostructures,"
Journal of Crystal Growth, vol. 332 no. 1, pp. 21-26, Oct. 1, 2011.
Boulos, Makram, Hamilton, Craig, Moreno, Mario, Mendez, Ramon, Soto, German,
and Herrera, Jessica,
"Selective Wave Soldering DoE to Develop DFM Guidelines for Lead and Lead-Free
Assemblies," 2008 SMTA International Conference Proceedings,
Orlando, FL, Aug. 17-21, 2008, pp. 276-283.
Boulos, Makram, Hamilton, Craig, Moreno, Mario, Mendez, Ramon, Soto, German,
and Herrera, Jessica,
"Selective Wave Soldering DoE to Develop DfM Guidelines for Lead and Pb-Free
Assemblies," Circuits Assembly, vol. 20 no. 1, pp.
26,28-30,32-34, Jan. 2009.
Boulouiz, Aziz, and Sabbar, Abdelaziz,
"Pb-free solders: Experimental and calculated enthalpy of mixing of the liquid
Au-In-Sn-Zn quaternary system," Thermochimica Acta, vol. 575, pp.
151-158, Jan. 10, 2014.
Boumendil, Jean-Jack, and Preti, Pascal,
"Phase convection: Reflow soldering in the lead-free era," EMasia
, Aug. 2007.
Bouravleuv, A. D., Sibirev, N. V., Statkute, G., Cirlin, G. E., Lipsanen, H.,
and Dubrovskii, V. G.,
"Influence of substrate temperature on the shape of GaAs nanowires grown by
Au-assisted MOVPE," Journal of Crystal Growth, vol. 312 no. 10,
pp. 1676-1682, May 1, 2010.
Bourdelaise, R. A.,
"Solderless Alternatives to Surface Mount Component Attachment,"
Soldering & Surface Mount Technology, vol. 3 no. 2, pp. 13-23,
1991.
Bourekas, Phil,
"Green semiconductor packaging: Addressing the environmental concerns of the
21st century," EE Times - Asia, vol. xx no. xx, pp. xx-xx,
Feb. 1, 2006.
Bourgoin, Ron,
"Ambient Temperature Superconducting Filaments," 1983 Proceedings:
The Second International Symposium on Non-Conventional Energy Technology
, 1983.
Bouton, G. M., and Bader, W. G.,
"Migration and Whisker Growths of Tin and Solders Induced on Thin Metal Films
by Direct Current and Heat," 1968 Electronic Components Conference
, Washington, D. C., May 8-10, 1968, pp. 135-140.
Bouvier, Rachel, and Wagner, Travis,
"The influence of collection facility attributes on household collection rates
of electronic waste: The case of televisions and computer monitors,"
Resources, Conservation and Recycling, vol. 55 no. 11, pp. 1051-1059,
Sept. 2011.
Bower, A. F., Fridline, D., Kumar, A., Shih, C. F., Xia, L., and Zhang, Y. W.,
"Finite Element Analysis of Electromigration and Stress in Interconnects,"
AIP Conference Proceedings, vol. 418, pp. 291-302, 1998.
Bowering, Norbert, and Meier, Christian,
"Sticking behavior and transformation of tin droplets on silicon wafers and
multilayer-coated mirrors," Applied Physics A, vol. 125 no. 9,
pp. 633, Sept. 2019.
https://doi.org/10.1007/s00339-019-2927-8
Bowers, Trevor S., Evans, John L., and Bozack, Michael J.,
"Reliability Comparison of Leaded, Array, and Leadless Packages on Alternative
PWB Finishes," 2003 SMTA International Conference Proceedings,
Chicago, IL, Sept. 21-25, 2003, pp. xx-xx.
Bowman, Heather S.,
"US Electronic Product Stewardship," IPC Printed Circuits Expo
, Anaheim, CA, Feb. 24-26, 2004, pp. xx-xx.
Bowman Jr., R. C., Adams, P. M., Engelhardt, M. A., and Hochst, H.,
"Structural characterization of a-Sn and a-Sn1-x Gex alloys grown by molecular
beam epitaxy on CdTe and InSb," Journal of Vacuum Science & Technology
A: Vacuum Surfaces, and Films, vol. 8 no. 3, pp. 1577-1581, May 1990.
https://doi-org.ezproxy.uky.edu/10.1116/1.576768
Bowser, Brad A., and Ellis, Todd,
"Common Sense in RoHS Compliance,"Wire & Cable Technology
International, vol. 33 no. 3, pp. 60-62, May/June 2005.
Boyd, Bill,
"Advanced coating technologies for lead-free solders," Global SMT
and Packaging, vol. 7 no. 6, pp. 10-12, June 2007.
Boyd, Bill,
"Put Your Coat On," Assembly, vol. 51 no. 4, pp. 52-55, Apr.
2008.
Boyle, Richard, and Hoo, Nick,
"Lead-Free Testing for RoHS Compliance," emsnow, July 25,
2005.
Boyle, Richard,
"Lead Free Troubleshooting," SMART Group Ireland Lead-free Seminar
, Dublin, Ireland, Oct. 22, 2003.
Boyle, Richard,
"Wave set up," SMART Group Ireland Lead-Free Wave Soldering Workshop
, Dublin, Ireland, Feb. 24, 2005.
Boyuk, U., and Marasli, N.,
"Dependency of eutectic spacings and microhardness on the temperature
gradient for directionally solidified Sn-Ag-u lead-free solder,"
Materials Chemistry and Physics, vol. 119 no. 3, pp. 442-448, Feb. 15,
2010.
Boyuk, U., and Marasli, N.,
"The microstructure parameters and microhardness of directionally solidified
Sn-Ag-Cu eutectic alloy," Journal of Alloys and Compounds, vol.
485 no. 1-2, pp. 264-269, Oct. 19, 2009.
Bozack, M. J., Crandall, E. R., Rodekohr, C. E., Flowers, G. T., and Lall,
P.,
"Influence of Surface Composition and Substrate Roughness on Tin Whisker
Growth," Tin Whisker Group teleconference, May 26, 2010.
Bozack, M. J., Suhling, J. C., Zhang, Y., Cai, Z., and Lall, P.,
"Influence of Surface Segregation on Wetting of Sn-Ag-Cu (SAC) Series and
Pb-Containing Solder Alloys," Journal of Electronic Materials,
vol. 40 no. 10, pp. 2093-2104, Oct. 2011.
Bozack, M. J., Snipes, S. K., and Flowers, G. N.,
"Methods for fast, reliable growth of Sn whiskers," Surface Science
, vol. 652, pp. 355-366, Oct. 2016.
https://doi.org/10.1016/j.susc.2016.01.010
Bozack, M. J., and Johnson, R. W.,
"Real-Time Scanning Electron Microscopy and Auger Spectroscopy of Wetting in
Sn-3.3Au-4.8Bi Solder Paste Wetted to Ni-Au," Journal of Electronic
Materials, vol. 34 no. 3, pp. 248-265, Mar. 2005.
Bozack, Michael J., Crandall, Erika R., Rodekohr, Chad L., Dean, Robert N.,
Flowers, George T., and, Suhling, Jeffrey C.,
"High Lateral Resolution Auger Electron Spectroscopic (AES) Measurements for
Sn Whiskers on Brass," IEEE Transactions on Electronics Packaging
Manufacturing, vol. 33 no. 3, pp. 198-204, July 2010.
Bozack, Michael J., Snipes, Erica K., and Flowers, George T.,
"Influence of Small Weight Percentages of Bi and Systematic Coefficient of
Thermal Expansion Variations on Sn Whiskering," IEEE Transactions on
Components, Packaging, and Manufacturing Technology, vol. 7 no. 3, pp.
338-344, Mar. 2017.
Bozack, Michael J.,
"Research Activities in Surface Physics," Tin Whisker Group teleconferences,
Feb. 15, 2012, Mar. 21, 2012, and Apr. 25, 2012.
Bozack, Mike,
"(tin whiskers growing on thin film tin over a zinc substrate)." Tin Whisker
Group teleconference, May 26, 2010.
Bozyazi, Ebru, Urgen, Mustafa, and Cakir, Ali Fuat,
"Comparison of Reciprocating Wear Behavior of Electrolytic Hard Chrome And
Arc-PVD CrN Coatings," Proceedings of AESF SUR/FIN 2002, Chicago,
IL, June 24-27, 2002, pp. 705-713.
Brachmann, Matthias,
"Is everybody ready?," emsnow, Dec. 21, 2004.
Brachmann, matthias,
"Performance implications for non-solder materials used in the lead-free
process (Part 1)," emsnow, Mar. 23, 2005.
Bracht, Stephen, Ball, Aghavni, and Salerno, Lisa,
"Another Look at Lead-Free Solder Joint Reliability Under Random Vibration,"
International Conference on Soldering and Reliability, Toronto,
Ontario, May 13-16, 2008, pp. xx-xx.
Bracht, Stephen, Ball, Aghavni, and Salerno, Lisa,
"Another Look at Lead-Free Solder Joint Reliability Under Random Vibration,"
2008 SMTA International Conference Proceedings, Orlando, FL, Aug.
17-21, 2008, pp. 851-856.
Brack, Lance A., Mehrotra, Mradul, Simeus, Emmanuel J., Stegura, Stephen R.,
Weakley, Martin L., Reynolds, Adam S., Scionti, Martin L., and Thomas, William
C.,
"DOE Results for Lead-Free Solder Process Development for Harsh Environment
Considerations," 2006 SMTA International Conference Proceedings,
Rosemont, IL, Sept. 24-28, 2006, pp. 547-557.
Bradford, Jeff,
"JCAA/JG-PP Lead-Free Solder Project: Combined Environments Test,"
Bradford, Jeff, Felty, Joe, and Russell, Bill,
"JCAA/JG-PP Lead-Free Solder Project: Combined Environments Test," 2005
SMTA International Conference Proceedings, Chicago, IL, Sept. 25-29,
2005, pp. 824-840.
Bradford, Jeff, Felty, Joe, and Russell,
"JCAA/JG-PP Lead Free Solder Project: Combined Solder Project: Combined
Environments Test," IPC Printed Circuits Expo, APEX and the Designer
Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S20-03-1-S20-03-34.
Bradley, D. E., Franks, J., and Rush, P. E.,
"Electron Microscopy of Tin Whiskers using Carbon Replicas," Proc. Phys.
Soc. B, vol. 70 no. 9, pp. 889-892, Sept. 1, 1957.
https://doi.org/10.1088/0370-1301/70/9/412
Bradley, Dennis, and Wade, Gwen K.,
"Be Careful With That!," Quality Digest, vol. 26 no. 3, pp.
33-37, Mar. 2006.
Bradley, Edwin,
"Environmental Work Goes On," Electronic News, Jan. 21,
2002.
Bradley, Edwin, Bath, Jasbir, Whitten, Gordon, and Chada, Srinivas,
"Lead-free project focuses on electronics assemblies," Advanced
Packaging, vol. xx no. xx, pp. xx-xx, Feb. 2000.
Bradley, Edwin,
"Lead-Free Solder Assembly: Impact and Opportunity," 2003
Proceedings 53rd Electronic Components & Technology Conference, New
Orleans, LA, May 27-30, 2003, pp. 41-46.
Bradley, Edwin, Snowdon, Ken, and Gedney. Ronald,
"Lead-Free Update," Circuits Assembly, vol. 10 no. 12, pp.
30-?, Dec. 1999.
Bradley, Edwin, Handwerker, Carol, and Sohn, John E.,
"NEMI Report: A Single Lead-free Alloy is Recommended," Surface
Mount Technology (SMT), vol. 17 no. 1, pp. 24-25, Jan. 2003.
Bradley III, Edwin, and Hranisavljevic, Jasmina,
"Characterization of the Melting and Wetting of Sn-Ag-X Solders," 2000
Proceedings 50th Electronic Components & Technology Conference, Las
Vegas, NV, May 21-24, 2000, pp. 1443-1448.
Bradley III, Edwin, and Hranisavljevic, Jasmina,
"Characterization of the Melting and Wetting of Sn-Ag-X Solders," IEEE
Transactions on Electronics Packaging Manufacturing, vol. 24 no. 4, pp.
255-260, Oct. 2001.
Bradley, Tony,
"Compliance: Beyond RoHS," Electronic Business, June 20,
2006.
Bradshaw, Charles,
"Electrical Testing of No-lead-No-clean Paste Residues, No-clean Paste
Residues, and Conductive Adhesive Residues to Predict ICT testability and
Test Efficiencies," 2001 Advanced Packaging Technology Conference
Proceedings, 2001, pp. xx-xx.
Brady, Bryan,
"RoHS and High Reliability and Military: Good News and Bad News,"
Technology Review, vol. 12 no. 8, pp. 2, Aug. 2006.
Brady, Randall J..
"The Other War," Products Finishing, vol. 74 no. 3, pp. 10-15,
Dec. 2009.
Braga, M. H., Malheiros, L. F., Soares, D., Ferreira, J., and Castro, F.,
"Experimental Phase Diagram of the Ternary Bi-Sn-Zn," Materials Science
Forum, vol. 514-516, pp. 1682-1688, 2006.
Bragg, Jason, Zbrezny, Adam, Lai, Albert, Subramaniam, Suthakaran, Riccitelli,
George, and McCormick, Heather,
"Bend and Drop Testing Results for a Lead-free and Tin-lead 45 mm Flip Chip
BGA," International Conference on Lead-free Soldering, Toronto,
Ontario, May 16-18, 2006, pp. xx-xx.
Bragg, Jason,
"Pb-Free FA Case Studies," International Conference on Soldering and
Reliability, Toronto, Ontario, May 13-16, 2008, pp. xx-xx.
Bragg, W. L.,
"Discussion, Part I," Proceedings of the Physical Society, vol.
51 part 1 no. 289, pp. 54-55, Jan. 1940.
Bramlage, Silke, and Wolter, Klaus-Jurgen,
"Intermetallic Compound Growth in Lead Free Solder Joints on Ag-Based Thick
Film Coductors," 31st International Spring Seminar on Electronics
Technology, Budapest, Hungary, May 7-11, 2008, pp. 32-36.
Bran, C., Ivanov, Yu. P., Trabada, D. G., Tomkowicz, J., del Real, R. P.,
Chubykalo-Fesenko, O., and Vazquez, M.,
"Structural Dependence of Magnetic Properties in Co-Based Nanowires:
Experiments and Micromagnetic Simulations," IEEE Transactions on
Magnetics, vol. 49 No. 8 part 1, pp. 4491-4497, Aug. 2013.
Brandmair, Andreas, Bohme, Thomas, and Muller, Wolfgang H.,
"Changes in the microstructure of materials and their impact on reliability:
experiments and modeling," Microsystem Technologies, vol. 15 no.
1, pp. 201-215, Jan. 2009.
Brandmann, Christina, and Altvater, Meike,
"Growing Regulatory Complexity as Challenge - Strategies for Managing
Compliance with International Waste Regulations," Electronics Goes Green
2012+, Berlin, Germany, Sept. 9-12, 2012, pp. xx-xx.
Brannagan, D. J.,
"Enabling Factors Toward Production of Nanostructured Steel On an Industrial
Scale." Journal of Materials Engineering and Performance, vol.
14, pp. 5-9, 2005.
Branzei, M., Svasta, P., Miculescu, F., Miculescu, M., and Plotog, I. ,
"Correlation between the Thermophysical Properties, Geometry and
Microstructure of the SAC305 and SAC-X typical Solder Joints," 2009 15th
International Symposium for Design and Technology of Electronics Packages
, Gyula, Hungary, Sept. 17-20, 2009, pp. 129-133.
Branzei, M., Miculescu, F., Bibis, A., Cristea, I., Plotog, I., Varzaru, G.,
and Mihailescu, B.,
"Lead/Lead Free Solder Joints Comparative Electrical Tests as Function of
Microstructure and Soldering Thermal Profile," 2013 IEEE 19th
International Symposium for Design and Technology in Electronic Packaging
, Galati, Romania, Oct. 24-27, 2013, pp. 255-258.
Branzei, M., Plotog, I., Mihailescu, B., Matei, A. A., and Cucu, T. C.,
"Microstructure Morphology of No-Clean Lead-Free Solder Alloys Used in
Automotive Industry," 2017 IEEE 23rd International Symposium for Design
and Technology in Electronic Packaging, Constanta, Romania, Oct. 26-29,
2017, pp. 78-81.
Branzei, M., Plotog, I., Varzaru, G., and Cucu, T. C.,
"Thermophysical properties of some low temperature lead-free solder pastes
dedicated to automotive applications," 2016 IEEE 22nd International
Symposium for Design and Technology in Electronic Packaging, Oradea,
Romania, Oct. 20-23, 2016, pp. 44-47.
Branzei, Mihai, Vladescu, Marian, Plotog, Ioan, and Cucu, Traian,
"Comparative Shear Tests of Two Low Melting Point Solder Pastes Relating to
their Thermal Diffusivity," 2017 40th International Spring Seminar on
Electronics Technology, Sofia, Bulgaria, May 10-14, 2017, pp. xx-xx.
Branzei, Mihai, Mihailescu, Bogdan, and Pencea, Ion,
"Lead/Lead-Free Solder Alloys Shear Tests Correlations with Structure at
Different Temperatures," Proceedings of the 2014 37th International
Spring Seminar on Electronics Technology, Dresden, Germany, May 7-11,
2014, pp. 252-255.
Branzei, Mihai, Varzaru, Gaudentiu, and Svasta, Paul Mugurel,
"Shear Strength Function of Temperature for Lead/Lead-Free Alloys Samples
Obtained with Different Cooling Rate," 2015 38th International Spring
Seminar on Electronics Technology, Eger, Hungary, May 6-10, 2015, pp.
255-260.
Branzei, Mihai, Pencea, Ion, Plotog, Ioan, Miculescu, Florin, Cristea, Ionut,
and Thumm, Andreas,
"The Mischmetal and Bi94Zn6 Effect Alloying on SACX 0307," 2013 36th
International Spring Seminar on Electronics Technology, Alba Iulia,
Romania, May 8-12, 2013, pp. 24-29.
Brassard, Jeff,
"Decorative Chromium Electroplating - A Process in Transition," Metal
Finishing, vol. 86 no. 6, pp. 105, 107-108, June 1988.
Braterman, P. S., Marshall, J. L., Sees, J., Tan, C., and Zhao, J.,
"Examination of Various Soldered Surfaces and Electronic Components by
Confocal Microscopy," Soldering & Surface Mount Technology,
vol. 7 no. 2, pp. 22-26, 1995.
Bratin, P., Pavlov, Michael, and Chalyt, Gene,
"Surface evaluation of the silver finishes via sequential electrochemical
reduction analysis (SERA)," Circuit World, vol. 25 no. 1, pp.
59-64, 1998.
Bratin, Peter, Chalyt, Gene, Pavlov, Michael, and Gluzman, Rita,
"Control of Tin and Tin/lead Electroplating Solutions by Cyclic Voltammetric
Stripping," IPC Printed Circuits Expo, San Jose, CA, Mar.
3-7, 1996, pp. S16-1-1-S16-1-14.
Bratin, Peter, Pavlov, Michael, and Chalyt, Gene,
"Evaluating Finishes Using SERA," Printed Circuit Fabrication,
vol. 22 no. 5, pp. 30-32,34,36-37, May 1999.
Bratin, Peter, Chalyt, Gene, Hayward, Fred "Skip", and Pavlov, Michael,
"SERA tin evaluation for surface finish," EE Times - Asia,
vol. xx no. xx, pp. xx-xx, Apr. 15, 2001.
Bratin, Peter, Chalyt, Gene, Hayward, Fred, and Pavlov, Michael,
"Tin Finishes," Printed Circuit Fabrication, vol. 23 no. 2, pp.
48-52,54, Feb. 2000.
Bratnikov, Alexander, and Lasky, Ronald,
"Assembly of Large PWBs in a RoHS 6 Environment," IPC Printed Circuits
Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference
, Las Vegas, NV, Apr. 1-3, 2008, pp. S12:02.
Bratnikov, Alexander, Billerica, Jabil, and Lasky, Ronald C.,
"Assembly of Large PWBs in a RoHS Environment," 2008 IPC Midwest Show
Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. xx-xx.
Braun, Christian Seeberg, and Dirckinck-Holmfeld, Kasper Remmen,
"Implementing WEEE in Denmark - Has Extended Producer Responsibility been the
Outcome?," Proceedings of 2005 International Conference on Asian Green
Electronics, Shang Hai, China, Mar. 15-18, 2005, pp. 67-75.
Braun, Martin,
"The WEEE & RoHS Directives - A Manufacturer's Point of View," 2004.
Braun, T., Becker, K.-F., Sommer, J.-P., Loher, T., Schottenloher, K., Kohl,
R., Pufall, R., Bader, V., Koch, M., Aschenbrenner, R., and Reichl, H.,
"High Temperature Potential of Flip Chip Assemblies for Automotive
Applications," 2005 Proceedings 55th Electronic Components &
Technology Conference, Volume 1, Orlando, FL, May 31-June 3, 2005, pp.
376-383.
Braun, T., Becker, K.-F., Koch, M., Bader, V., Aschenbrenner, R., and Reichl,
H.,
"High-temperature reliability of Flip Chip assemblies," Microelectronics
Reliability, vol. 46 no. 1, pp. 144-154, Jan. 2006.
Braun, T., Wunderle, B., Becker, K.-F., Koch, M., Bader, V., Aschenbrenner,
R., and Reichl, H.,
"Improved Reliability of Leadfree Flip Chip Assemblies Using Direct
Underfilling by Transfer Molding," 31st International Conference on
Electronics Manufacturing and Technology, Kuala Lumpur, Malasia, Nov.
8-10, 2007, pp. 27-34.
Braunovic, M.,
"Effect of Intermetallic Phases on the Performance of Tin-Plated Copper
Connections and Conductors," Proceedings of the Forty-Ninth IEEE Holm
Conference on Electrical Contacts, Washington, D.C., Sept. 8-10, 2003,
pp. 124-131.
Braunovic, M., and Gagnon, D.,
"Formation of Intermetallics in Lead-Free Systems," Proceedings of the
50th IEEE Holm Conference on Electrical Contacts and the 22nd International
Conference on Electrical Contacts, Brussels, Belgium, Oct. 4-5, 2004,
pp. 267-273.
Braunovic, M., Gagnon, D., and Rodrigue, L.,
"Nanoscale Mechanical Properties of Intermetallics in Lead-Free Systems,"
Proceedings of the 52nd Holm Conference on Electrical Contacts,
Montreal, Quebec, Canada, Sept. 25-27, 2006, pp. 117-123.
Braunovic, Milenko, Gagnon, Daniel, and Rodrigue, Lisa,
"Nanoscale Mechanical Properties of Intermetallics in Lead-Free Systems,"
IEEE Transactions on Components and Packaging Technologies, vol.
32 no. 2, pp. 440-446, June 2009.
Braunwarth, Louisa, Amrhein, Sebastian, Schreck, Timo, and Kaloudis, Michael,
"Ecological comparison of soldering and sintering as die-attach technologies
in power electronics," Journal of Cleaner Production, vol. 102,
pp. 408-417, Sept. 2015.
Breck, G. F., Dullaghan, C. A., Maisano, J., Abys, J. A., Boguslavsky, I., and
Schnayderman, G.,
"PdCo - A Successful Scale-up to the Production Environment,"
Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp.
563-571.
Brehler, Jos,
"Storage of Lead-Free Components," evertiq, Feb. 3, 2006.
Brenner, S. S., and Morelock, C. R.,
"Cross Sectioning of Whiskers," Review of Scientific Instruments,
vol. 28 no. 8, pp. 652-653, Aug. 1957.
Brenner, S. S.,
"Further observations on the growth of silver whiskers from silver chloride,"
Acta Metallurgica, vol. 7 no. 10, pp. 677-678, Oct. 1959.
Brenner, S. S.,
"Growth and Properties of "Whiskers"," Science, vol. 128 no. 3324,
pp. 569-575, Sept. 12, 1958.
Brenner, S. S, and Sears, G. W,
"Mechanism of Whisker Growth - III Nature of Growth Sites," Acta
Metallurgica, vol. 4 no. 3, pp. 268-270, May 1956.
Brenner, S. S.,
"Metal "Whiskers"," Scientific American, vol. 203 no. 1, pp.
64-72, July 1960.
Brenner, S. S.,
"Plastic Deformation of Copper and Silver Whiskers," Journal of Applied
Physics, vol. 28 no. 9, pp. 1023-1026, Sept. 1957.
Brenner, S. S.,
"Properties of Whiskers," Growth and Perfection of Crystals,
Cooperstown, NY, Aug. 27-29, 1958, pp. 157-190. (Edited by Doremus, R. H.,
Roberts, B. W., and Turnbull, David.)
Brenner, S. S.,
"Strength of Gold Whiskers," Journal of Applied Physics, vol. 30,
pp. 266-267, 1959.
Brenner, S. S.,
"Tensile Strength of Whiskers," Journal of Applied Physics, vol.
27 no. 12, pp. 1484-1491, Dec. 1, 1956.
Brenner, Sidney S.,
"The Growth of Whiskers by the Reduction of Metal Salts," Acta
Metallurgica, vol. 4 no. 1, pp. 62-74, Jan. 1956.
Brenner, S. S., and Morelock, C. R.,
"The High-Temperature Recovery of Deformed Copper Whiskers," Acta
Metallurgica, vol. 4 no. 1, pp. 89-90, Jan. 1956.
Breuer, Steffen, Hilse, Maria, Geelhaar, Lutz, and Riechert, Henning,
"Nucleation and growth of Au-assisted GaAs nanowires on GaAs(1 1 1)B and
Si(1 1 1) in comparison," Journal of Crystal Growth, vol. 323 no.
1, pp. 311-314, May 15, 2011.
Brewer, Roland, and Gregoire, Steve,
"Supply-chain Management: Asset Recovery & Disposition," Surface
Mount Technology (SMT), vol. 20 no. 12, pp. 32, 34, Dec. 2006.
Brewin, Alan,
"Are Laminates Resistant to Lead-free Reflow?," Microelectronics
News, no. 17, pp. 2, June 2003.
Brewin, Alan,
"Conductive Anodic Filament Growth in PWB Substrates,"
Microelectronics News, no. 18, pp. 1-2, Dec. 2003.
Brewin, Alan, Zou, Ling, and Hunt, Christopher,
"Development of New Solderability Test Fluxes," NPL Report MATC(A)122,
Sept. 2002.
Brewin, Alan,
"I'm Exempt - Can I Relax?," Microelectronics News, no. 21,
pp. 3, Spring 2005.
Brewin, Alan,
"Impact of Lead-Free on Processing and Reliability of Laminates," SMART
Group/NPL Lead Free Seminar 2003, Feb. 23, 2003.
Brewin, Alan, and Zou, Ling,
"Lead Free and Other Process Effects on Conductive Anodic Filamentation
Resistance of Glass Reinforced Epoxy Laminates," Proceedings of the
Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference,
Anaheim, CA, Feb. 24-26, 2004, pp. S33-1-1-S33-1-7.
Brewin, Alan,
"Lightening the lead-free load," Microelectronics News, no.
23, pp. 2, Winter 2006.
Brewin, Alan,
"Realistic Solderability Testing with Lead-free Solders,"
Microelectronics News, no. 16, pp. 2, Jan. 2003.
Brewin, Alan, Hunt, Christopher, Dusek, Milos, and Nottay, Jaspal,
"Reliability of Joints Formed with Mixed Alloy Solders," NPL Report
MATC(A)85, Apr. 2002.
Brewin, Alan,
"Reliability: the Main Issue for Lead-free," Microelectronics News
, no. 19, pp. 2, July 2004.
Brewin, Alan,
"Solder Contamination," Microelectronics News, no. 18, pp. 3,
Dec. 2003.
Brewin, Alan,
"Solderability Pre-heating Worries Overcome," Microelectronics News
, no. 19, pp. 4, July 2004.
Brewin, Alan,
"Solderability Testing and Soldering Defect Levels," SMART PPM
Monitoring Workshop, Jan. 27, 2003.
Brewin, Alan,
"SSTC Meeting Underlines Issues," Microelectronics News, no.
20, pp. 3, Autumn 2004.
Brewin, Alan, Zou, Ling, and Hunt, Christopher,
"Stability of Electronic Components in Lead-Free Processing," NPL Report
MATC(A)79, Dec. 2001.
Brewin, Alan, Zou, Ling, and Hunt, Christopher,
"Susceptibility of Glass-Reinforced Epoxy Laminates to Conductive Anodic
Filamentation," NPL Report MATC(A)155, Jan. 2004.
Brewin, Alan,
"The Most Frequently Asked Questions on Lead-free," May 26, 2005.
Brewin, Alan,
"The Science of Reliability," SMART Group Ireland Lead-free Seminar
, Dublin, Ireland, Oct. 22, 2003.
Brewin, Peter,
"New Chemicals Policy - what's the fuss all about?," Materials World
, vol. 11 no. 9, pp. 20-22, Sept. 2003.
Brewin, Peter,
"REACH in the final stretch," Materials World, vol. 14 no. 1, pp.
6, Jan. 2006.
Brewin, Peter,
"REACHing out," Materials World, vol. 14 no. 3, pp. 24-26, Mar.
2006.
Brick, V. B., Larikov, L. N., and Falchenko, V. M.,
"The effect of impurities on the b->a transformation process in tin,"
Kristall und Technik, vol. 14 no. 2, pp. 135-140, 1979.
https://doi-org.ezproxy.uky.edu/10.1002/crat.19790140202
Bridges, Jade, and Stuart, Amanda,
"REACH Regulation Impacts on Exporters to EU," Circuitnet,
Apr. 6, 2009.
Briggs, Ed, and Lasky, Ron,
"Best Practices Reflow Profiling for Lead-Free SMT Assembly," SMTA
International Conference, San Diego, CA, Oct. 4-8, 2009, pp. 639-645.
Briggs, Ed, and Lasky, Ron,
"Process Guidelines to Ensure Optimal SMT Electronics Assembly,"
International Conference on Soldering and Reliability, Toronto,
Ontario, Canada, May 16-18, 2012, pp. xx-xx.
Briggs, Edward, and Lasky, Ronald,
"STEP 7: Flux Chemistry for Lead-free SMT," Surface Mount Technology
(SMT), vol. 22 no. 8, pp. 24,26, Aug. 2008.
Brinkley, Anne,
"IBM Environmental Requirements for Materials, Part, and Products," IBM
Engineering Specification 46G3772, July 28, 2003.
Brinkman, Don,
"Designing for ROHS: Select the right lead-free-connector design for
heat-sensitive applications," EDN, vol. 54 no. 5, pp. 40-41,
Mar. 5, 2009.
Brinkman, Don,
"Designing for RoHS: Select the right lead free connector design for heat
sensitive applications," EMasia, May 2009.
Brist, Gary,
"PCB Reliability Challenges," Overcoming the Reliability Challenge: An
IPC Summit, Andover, MA, Apr. 15, 2008, pp. xx-xx.
Britt, Linda,
"Ask the EMPF Helpline!," empfasis, pp. 5, Aug. 2005.
Britton, S. C.,
"Behavior of Tin Alloy Coatings," Tin and its Uses, no. 50, pp.
6-8, 1960.
Britton, S. C., and Clarke, M.,
"Effects of Diffusion from Brass Substrates into Electrodeposited Tin Coatings
on Corrosion Resistance and Whisker Growth," 6th International Metal
Finishing Conference, London, United Kingdom, May 25-29, 1964, pp.
205-211.
Britton, S. C.,
"Spontaneous Growth of Whiskers on Tin Coatings: 20 Years of Observation,"
Transactions of the Institute of Metal Finishing, vol. 52, pp.
95-102, Apr. 3, 1974.
https://doi.org/10.1080/00202967.1974.11870313
Britton, S. C.,
"Tin Alloy Coatings as Alternatives to Nickel-Chromium," Tin and its
Uses, no. 33, pp. 10-12, Oct. 1955.
Brizoux, M., Grivon, A., Smith, B. J., and Snugovsky, P.,
"Industrial Backward Solution for Lead Free Exempted AHP* Electronic
Products," IPC Printed Circuits Expo, APEX and the Designers Summit
Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008,
pp. S15:01.
Broadbent, Eliot K., Towner, Janet M., Towsend, Paul H., and Vander Plas,
Hubert A.,
"Electromigration-induced short-circuit failure in aluminum underlaid with
chemically vapor deposited tungsten," Journal of Applied Physics,
vol. 63 no. 6, pp. 1917-1923, Mar. 15, 1988.
Brockman, Daniel, and Wyrostek, Michael,
"Chromium Alternative Solves Problem," Products Finishing,
vol. xx no. xx, pp. xx-xx, June 9, 2003.
Brodie, D. S., Gunn, A. J., Muller, W. H., and Reuben, R. L.,
Toward a Better Understanding of Morphology Changes in Solders Using Phase
Field Theories: Quantitative Modeling and Experimental Verification,"
Proceedings of 4th Electronics Packaging Technology Conference,
Singapore, Dec. 10-12, 2002, pp. 404-409.
Brodt, Klaud,
"Heat transfer in forced convection reflow soldering systems: lead-free solder
paste, a new challenge," Dataweek, vol. xx no. xx, pp. xx-xx,
July 4, 2001.
Broerman, J. G.,
"A Conjecture on the Anomalous Mobility of a-Sn," Journal of Physics and
Chemistry of Solids, vol. 32 no. 6, pp. 1263-1267, 1971.
Brondum, Klaus, and Larson, Gary,
"Reinventing Chrome Coatings," Products Finishing, vol. 70
no. 3, pp. 48-52, Dec. 2005.
Brodusch, Ludovic, and Sanchez, Juan Carlos,
"Continuous hydrogen measurement in liquid copper - what can we learn?,"
Wire Journal International, vol. 36 no. 8, pp. 75-79, Aug. 2003.
Bronsted, J. N.,
"Studien zur chemischen Affinitat. IX. Die allotrope Zinnumwandlung,"
Zeitschrift fur physikalische Chemie, vol. 88, no. 4, pp.
479-489, 1914.
Bronsted, J. N.,
"Untersuchungen uber die Spezifische Warme. I," Zeitschrift fur
Elektrochemie, vol. 18 no. 16, pp. 714-717, Aug. 15, 1912.
Brooks, Andy, Woollard, Siobhan, Hennighan, Gareth, and von Werne, Timothy,
"Inhibition of Creep Corrosion Using Plasma Deposited Fluoropolymer Coating,"
SMTA International 2011 Conference Proceedings, Fort Worth, TX,
Oct. 16-20, 2011, pp. 987-992.
Brooks, B. T.,
"Tin Disease and Polar Exploration," Science, New Series, vol. 40
no. 1022, pp. 166-167, July 31, 1914.
Brooks, Richard, Day, David, and Goudarzi, Vahid,
"Changing to Pb-free Profoundly Impacts the Manufacturing Production Process."
Brooks, Richard, Day, David, and Goudarzi, Vahid,
"Get the Lead out," Adhesives & Sealants Industry, vol.
12 no. 7, pp. 23-28, July 2005.
Brooks, Timothy W.,
"A Lead-Free Alloy for Electronics Soldering," Circuits Assembly,
vol. 4 no. 10, pp. 58-60, Oct. 1993.
Brooks, William E.,
"Mercury," Minerals Yearbook: Volume I. -- Metals and Minerals,
2003.
Brooman, E., Kolek, J., Naguy, T., Klingenberg, M., Pavlik, M., and Schario,
D.,
"Air Force Hard Chromium Coatings Replacement Efforts," Proceedings of
AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. 688-696.
Brooman, Eric W.,
"Alternatives to Cadmium Coatings for Electrical/Electronic Applications,"
Plating & Surface Finishing, vol. 80 no. 2, pp. 29-35, Feb.
1993.
Brooman, Eric W.,
"Compliant Electrodeposited and Electroless Nano-Structured and Nano-Composite
Coatings to Replace Chromium Coatings, Part 1" Galvanotechnik
, vol. xx no. xx, pp. 2843-2853, Dec. 2005.
Brooman, Eric W., Adams, John W., and Manty, Brian A.,
""High-Priority Chemicals" Environmental Impact in the Aircraft and Parts
Industry (I)," 30th Aerospace/Airline Plating & Metal Finishing
Forum, 1994, pp. xx-xx.
Brost, Brent, and Faller, Harlan,
"Understanding How Pb-Free Platings Affect Production-Test Cost, Throughput
and Yield," Chip Scale Review, vol. xx no. xx, pp. xx-xx,
Nov.-Dec. 2005.
Brouillard, Michael J., and England, Raymond O.,
"A Metal Finisher's Evaluation of Commercially Available Lead-Free Solder
Coatings," Proceedings of the AESF SUR/FIN 2000, Chicago, IL,
June 26-29, 2000, pp. 406-420.
Brouillard, M. J., and England, Raymond O.,
"A Metal Finisher's Evaluation of Commercially Available Lead-Free Solder
Coatings," Plating & Surface Finishing, vol. 88 no. 1, pp.
38-45, Jan. 2001.
Brouillard, Michael J.,
"Solderability Study Comparing the Effects of Barrier Layers on Thermally
Aged, Tin-plated Brass," Proceedings of AESF SUR/FIN '99,
Cincinnati, OH, June 21-24, 1999, pp. 255-267.
Brower, Jay,
"PB-free solder evaluation: Rane Corp. lab notes case study," Global
SMT & Packaging, vol. 5 no. 5, pp. 27-28, May 2005.
Brown, Bob,
"Testing your mettle: Zinc whiskers in the data center,"
NetworkWorldFusion, Nov. 1, 2004.
Brown, Craig,
"Hand soldering with lead-free alloys," EMasia, Jan. 2006.
Brown, Craig,
"How To Get Lead-Free Rework Right First Time," OnBoard Technology
, vol. xx no. xx, pp. 52-54, Feb. 2004.
Brown, Craig,
"Reworking lead-free array packages," Electronics Manufacture and
Test, vol. xx no. xx, pp. xx-xx, Jan 7, 2007.
Brown, Craig,
"Thermal Repeatability in Lead-Free Array Rework," Circuits
Assembly, vol. 15 no. 4, pp. 40-43, Apr. 2004.
Brown, E. G.,
"Researches into the Action of Fusible Cutouts."
Brown, J. Teye, Popat, Ajay M., O'Neal, Chad B., and Xie, Yixiang,
"Intermetallic Effects of Electroplated Lead-Free Solder Bumps Using a Novel
Single Chamber Electroplating Process for Large Diameter Wafers,"
Proceedings of the ASME InterPack Conference, Volume 2, Vancouver,
British Columbia, Canada, July 8-12, 2007, pp. 743-748.
Brown, Jack,
"Agere Systems Advanced Lead-Free Packaging," Microwaves & RF
, vol. xx no. xx, pp. xx, Sept. 29, 2004.
Brown, Jay,
"High Conductivity Nickel-Fiber ACF," flipchips.com, May
2007.
Brown, Jim,
"Seven best practices to achieving higher levels of compliance,"
Green SupplyLine, Oct. 16, 2006.
Brown, Kevin,
"Chromium-free pre-treatments prior to painting," Anti-Corrosion Methods
and Materials, vol. 44 no. 5, pp. 323-327, 1997.
Brown, Neil,
"A Summary of Methods for Minimizing Tin Whisker Growth," Shipley
Electronic & Industrial Finishing.
Brown, Neil, and Toben, Michael,
"Overview of the lead-free movement in the electronics industry,"
TIN World, no. 4, pp. 13-14, 2004.
Brown, Neil, Imanari, Masaaki, Suda, Kazuyuki, and Shimazu, Motoya,
"Pure Tin Electroplating Process for pH Sensitive Devices,"
Proceedings of the 25th Symposium for Passive Components, Palm Springs,
CA, Mar. 21-24, 2005, pp. 108-111.
Brown, Orville, and Sridharan, Srinivasan,
"Lead and Cadmium Free Low Temperature Firing Thick Print Copper Inks,"
Proceedings 2003 International Symposium on Microelectronics (Proceedings of
SPIE - The International Society for Optical Engineering, Volume 5288),
Boston, MA, Nov. 18-20, 2003, pp. 648-654.
Brown, Steve,
"Development of a Fatigue Resistant Lead-Free Alloy for High Reliability Under
Hood Applications," SMTA China East 2014 Proceedings, Shanghai,
China, Apr. 23-25, 2014, pp. xx-xx.
Brown, Steve,
"Harsh Environment Applications for Lead-free Solder Systems," SMART
Group 6th Annual Lead-Free Seminar and Table-top Exhibition, High
Wycombe, United Kingdom, Feb. 3, 2004.
Brown, Steve,
"Harsh life for lead-free solders," Electronics Manufacture and Test
, vol. xx no. xx, pp. xx, Mar. 2004.
Brown, Steve, Holtzer, Mitch, and Renaud, Gilbert,
"Process Considerations in Reducing Voiding in High Reliability Lead Free
Solder Joints," SMTA China East 2015 Proceedings, Shanghai,
China, Apr. 21-24, 2015, pp. xx-xx.
Brown, Steve, and Shea, Chrys,
"The Lead-Free Wave Solder Process and Its Effect on Laminates," NEPCON
Shanghai 2007, Shanghai, China, Apr. 24-27, 2007, pp. xx-xx.
Brown, Steve,
"Wave goodbye to high material costs," Electronics Manufacture and
Test , vol. xx no. xx, pp. xx, July 2004.
Browning, Myron E., and Lindsay, James H.,
"Important Considerations in Hard Chromium Plating," Plating &
Surface Finishing, vol. 89 no. 4, pp. 10-15, Apr. 2002.
Brownlee, L. D.,
"Lattice Constant of Grey Tin," Nature, vol. 166 no. 4220, pp.
482, Sept. 16, 1950.
Brown-West, Boma M., Gregory, Jeremy R., and Kirchain, Randolph E.,
"Modeling Electronic Waste Recovery Systems Under Uncertainty," 2010
IEEE International Symposium on Sustainable Systems and Technology,
Arlington, VA, May 17-19, 2010, pp. xx-xx.
Brown-West, Boma M., Gregory, Jeremy R., and Kirchain, Randolph E.,
"Modeling Electronic Waste Recovery Systems Under Uncertainty," 2010
IEEE International Symposium on Sustainable Systems and Technology,
Arlington, VA, May 17-19, 2010, pp. xx-xx.
Brudzisz, Anna, Sulka, Grzegorz D., and Brzozka, Agnieszka,
"A facile approach to silver nanowire array electrode preparation and its
application for chloroform reduction," Electrochimica Acta, vol.
362, pp. 137110-1-137110-15, Dec. 1, 2020.
https://doi.org/10.1016/j.electacta.2020.137110
Brumer, Herbert,
"Chromating," Products Finishing, vol. xx no. xx, pp. xx-xx,
June 9, 2003.
Bruneel, Patrick,
"Warning not for pro RoHS people," July 26, 2006.
Bruner, Dan M.,
"Z-Axis Adhesive Film Interconnect Using 150 Micron and 75 Micron Pitch Flex
Circuits," The International Journal of Microcircuits and Electronic
Packaging, vol. 18 no. 3, pp. 311-318, Third Quarter 1995.
Brunetti, B., Gozzi, D., Iervolino, M., Piacente, V., Zanicchi, G., Parodi,
N., and Borzone, G.,
"Bismuth activity in lead-free solder Bi-In-Sn alloys," Calphad:
Computer Coupling of Phase Diagrams and Thermochemistry, vol. 30 no. 4,
pp. 431-442, Dec. 2006.
Brunetti, B., Gozzi, D., Iervolino, M., Latini, A., and Piacente, V.,
"Thermodynamics of Bismuth in the Molten Ag-Bi-Sn System," Journal of
Chemical & Engineering Data, vol. 52 no. 4, pp. 1394-1400, 2007.
Bruno, Felix, Grano, Frank, and Srihari, K.,
"Effect of the Reflow Profile on BGA Voiding in a Lead-Free Process,"
2004 SMTA International Conference Proceedings, Chicago, IL, Sept.
26-30, 2004, pp. 291-296.
Bruno, Lars, and Gustafson, Benny,
"Head-on-Pillow Defect Detection: X-Ray Inspection Limitations," Journal
of Microelectronics and Electronic Packaging, vol. 16 no. 2, pp.
91-102, Apr. 2019.
Brusse, Jay,
"A Discussion of the Significance of Metal Whisker Formation to the High
Reliability Community," Nov. 2003.
Brusse, J.,
"Aluminum Whiskers," Aug. 2004.
Brusse, Jay, and Panashchenko, Lyudmyla,
""Cable Tray #1" Zinc Whiskers Detected on Zinc-Coated Steel Cable Tray,"
Nov. 1, 2012.
Brusse, Jay, and Panashchenko, Lyudmyla,
""Cable Tray #2" Zinc Whiskers Detected on Zinc-Coated Steel Cable Tray,"
Nov. 1, 2012.
Brusse, Jay, and Sampson, Michael,
"Could Zinc Whiskers Be Impacting Your Electronic Systems? Raise Your
Awareness," NASA, Sept. 25, 2003.
Brusse, Jay,
"Could Zinc Whiskers Be Impacting Your Electronics?," NASA, Apr. 2, 2003.
Brusse, Jay,
"Electrical Failure of an Accelerator Pedal Position Sensor Caused by a Tin
Whisker and Discussion of Investigative Techniques Used for Whisker
Detection," Tin Whisker Group teleconference, Oct. 12, 2011.
Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla,
"Metal Whiskers," Association for Advancement of Medical
Instrumentation (AAMI) Cardiac Rhythm Management Device Committee, San
Francisco, CA, May 13, 2008.
Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla,
"Metal Whiskers," UNOVIS Consortium Meeting, Owego, NY, June
18, 2008.
Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla,
"Metal Whiskers," Nuclear Procurement Issues Committee (NUPIC)
Meeting, June 19, 2008.
Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla,
"Metal Whiskers: A Discussion of Risks and Mitigation," Symposium on
Part Reprocessing, Tin Whisker Mitigation and Assembly Rework, Nov. 12,
2008.
Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla,
"Metal Whiskers: Failure Modes and Mitigation Strategies,"
Microelectronics Reliability and Qualification Workshop, Los Angeles,
CA, Dec. 4-5, 2007, pp. xx-xx.
Brusse, Jay, Leidecker, Henning, and Panashchenko, Lyudmyla,